Bi-level microelectronic device package with an integral window

DOEpatents

Peterson, Kenneth A.; Watson, Robert D.

2004-01-06

A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The multilayered package can be formed of a LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded so that the light-sensitive side is optically accessible through the window. The package has at least two levels of circuits for making electrical interconnections to a pair of microelectronic devices. The result is a compact, low-profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device(s).

Single level microelectronic device package with an integral window

DOEpatents

Peterson, Kenneth A.; Watson, Robert D.

2003-12-09

A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The package can be formed of a multilayered LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during cofiring. The microelectronic device can be flip-chip interconnected so that the light-sensitive side is optically accessible through the window. A glob-top encapsulant or protective cover can be used to protect the microelectronic device and electrical interconnections. The result is a compact, low profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device.

Glass-to-Metal Seal Quality.

DTIC Science & Technology

1982-05-01

SELECTION AND EVALUATION . . . . . . . . . . . . . . 2 2.2 MICROELECTRONIC PACKAGES AND THEIR QUALITY . . . * . . . . . . . . 5 2.3 EQUIPMENT...liquid penetrant testing for various microelectronic package hermeticity. I t I MATERIALS AND EQUIPMENT 2.1 DYE PENETRANT SELECTION AND EVALUATION...a commercial visible dye penetrant and a commercial fluorescent dye penetrant were selected as being suitable for the testing of microelectronic

Solar Cells for Lunar Application

NASA Technical Reports Server (NTRS)

Freundlich, Alex; Ignatiev, Alex

1997-01-01

In this work a preliminary study of the vacuum evaporation of silicon extracted from the lunar regolith has been undertaken. An electron gun vacuum evaporation system has been adapted for this purpose. Following the calibration of the system using ultra high purity silicon deposited on Al coated glass substrates, thin films of lunar Si were evaporated on a variety of crystalline substrates as well as on glass and lightweight 1 mil (25 microns) Al foil. Extremely smooth and featureless films with essentially semiconducting properties were obtained. Optical absorption analysis sets the bandgap (about 1.1 eV) and the refractive index (n=3.5) of the deposited thin films close to that of crystalline silicon. Secondary ion mass spectroscopy and energy dispersive spectroscopy analysis indicated that these films are essentially comparable to high purity silicon and that the evaporation process resulted in a substantial reduction of impurity levels. All layers exhibited a p-type conductivity suggesting the presence of a p-type dopant in the fabricated layers. While the purity of the 'lunar waste material' is below that of the 'microelectronic-grade silicon', the vacuum evaporated material properties seems to be adequate for the fabrication of average performance Si-based devices such as thin film solar cells. Taking into account solar cell thickness requirements (greater than 10 microns) and the small quantities of lunar material available for this study, solar cell fabrication was not possible. However, the high quality of the optical and electronic properties of evaporated thin films was found to be similar to those obtained using ultra-high purity silicon suggest that thin film solar cell production on the lunar surface with in situ resource utilization may be a viable approach for electric power generation on the moon.

Vacuum Microelectronic Field Emission Array Devices for Microwave Amplification.

NASA Astrophysics Data System (ADS)

Mancusi, Joseph Edward

This dissertation presents the design, analysis, and measurement of vacuum microelectronic devices which use field emission to extract an electron current from arrays of silicon cones. The arrays of regularly-spaced silicon cones, the field emission cathodes or emitters, are fabricated with an integrated gate electrode which controls the electric field at the tip of the cone, and thus the electron current. An anode or collector electrode is placed above the array to collect the emission current. These arrays, which are fabricated in a standard silicon processing facility, are developed for use as high power microwave amplifiers. Field emission has been studied extensively since it was first characterized in 1928, however due to the large electric fields required practical field emission devices are difficult to make. With the development of the semiconductor industry came the development of fabrication equipment and techniques which allow for the manufacture of the precision micron-scale structures necessary for practical field emission devices. The active region of a field emission device is a vacuum, therefore the electron travel is ballistic. This analysis of field emission devices includes electric field and electron emission modeling, development of a device equivalent circuit, analysis of the parameters in the equivalent circuit, and device testing. Variations in device structure are taken into account using a statistical model based upon device measurements. Measurements of silicon field emitter arrays at DC and RF are presented and analyzed. In this dissertation, the equivalent circuit is developed from the analysis of the device structure. The circuit parameters are calculated from geometrical considerations and material properties, or are determined from device measurements. It is necessary to include the emitter resistance in the equivalent circuit model since relatively high resistivity silicon wafers are used. As is demonstrated, the circuit model accurately predicts the magnitude of the emission current at a number of typical bias current levels when the device is operating at frequencies within the range of 10 MHz to 1 GHz. At low frequencies and at high frequencies within this range, certain parameters are negligible, and simplifications may be made in the equivalent circuit model.

Field nanoemitter: One-dimension Al4C3 ceramics

NASA Astrophysics Data System (ADS)

Sun, Y.; Cui, H.; Gong, L.; Chen, Jian; Shen, P. K.; Wang, C. X.

2011-07-01

As a kind of ionic (or salt-like) carbide, Al4C3 hardly any active functions have been found except for structure material purposes. However, considering the unique characteristic features of its crystal structure, we think Al4C3 in fact might have huge potential for exhibiting active functionality on field-emission application. Herein, we report for the first time the catalyst-free synthesis and excellent field emission properties of Al4C3 one-dimension (1-D) nanostructures. The 1-D nanostructures acting as cold electron emitters display excellent field emission performance with the turn-on field as low as 1.4-2.0 V μm-1 and the threshold field down to 4.2-4.4 V μm-1. Such emitters are technologically useful, because they can be easily fabricated on large substrates, and the synthesis process is simple and broadly applicable. The findings conceptually provide new opportunities for the application of Al4C3 ceramic material in vacuum microelectronic devices.

PREFACE: E-MRS 2012 Spring Meeting, Symposium M: More than Moore: Novel materials approaches for functionalized Silicon based Microelectronics

NASA Astrophysics Data System (ADS)

Wenger, Christian; Fompeyrine, Jean; Vallée, Christophe; Locquet, Jean-Pierre

2012-12-01

More than Moore explores a new area of Silicon based microelectronics, which reaches beyond the boundaries of conventional semiconductor applications. Creating new functionality to semiconductor circuits, More than Moore focuses on motivating new technological possibilities. In the past decades, the main stream of microelectronics progresses was mainly powered by Moore's law, with two focused development arenas, namely, IC miniaturization down to nano scale, and SoC based system integration. While the microelectronics community continues to invent new solutions around the world to keep Moore's law alive, there is increasing momentum for the development of 'More than Moore' technologies which are based on silicon technologies but do not simply scale with Moore's law. Typical examples are RF, Power/HV, Passives, Sensor/Actuator/MEMS or Bio-chips. The More than Moore strategy is driven by the increasing social needs for high level heterogeneous system integration including non-digital functions, the necessity to speed up innovative product creation and to broaden the product portfolio of wafer fabs, and the limiting cost and time factors of advanced SoC development. It is believed that More than Moore will add value to society on top of and beyond advanced CMOS with fast increasing marketing potentials. Important key challenges for the realization of the 'More than Moore' strategy are: perspective materials for future THz devices materials systems for embedded sensors and actuators perspective materials for epitaxial approaches material systems for embedded innovative memory technologies development of new materials with customized characteristics The Hot topics covered by the symposium M (More than Moore: Novel materials approaches for functionalized Silicon based Microelectronics) at E-MRS 2012 Spring Meeting, 14-18 May 2012 have been: development of functional ceramics thin films New dielectric materials for advanced microelectronics bio- and CMOS compatible material systems piezoelectric films and nanostructures Atomic Layer Deposition (ALD) of oxides and nitrides characterization and metrology of very thin oxide layers We would like to take this opportunity to thank the Scientific Committee and Local Committee for bringing together a coherent and high quality Symposium at E-MRS 2012 Spring Meeting. Christian Wenger, Jean Fompeyrine, Christophe Vallée and Jean-Pierre Locquet Organizing Committee of Symposium M September 2012

Silicon microelectronic field-emissive devices for advanced display technology

NASA Astrophysics Data System (ADS)

Morse, J. D.

1993-03-01

Field-emission displays (FED's) offer the potential advantages of high luminous efficiency, low power consumption, and low cost compared to AMLCD or CRT technologies. An LLNL team has developed silicon-point field emitters for vacuum triode structures and has also used thin-film processing techniques to demonstrate planar edge-emitter configurations. LLNL is interested in contributing its experience in this and other FED-related technologies to collaborations for commercial FED development. At LLNL, FED development is supported by computational capabilities in charge transport and surface/interface modeling in order to develop smaller, low-work-function field emitters using a variety of materials and coatings. Thin-film processing, microfabrication, and diagnostic/test labs permit experimental exploration of emitter and resistor structures. High field standoff technology is an area of long-standing expertise that guides development of low-cost spacers for FEDS. Vacuum sealing facilities are available to complete the FED production engineering process. Drivers constitute a significant fraction of the cost of any flat-panel display. LLNL has an advanced packaging group that can provide chip-on-glass technologies and three-dimensional interconnect generation permitting driver placement on either the front or the back of the display substrate.

Monitoring Composite Material Pressure Vessels with a Fiber-Optic/Microelectronic Sensor System

NASA Technical Reports Server (NTRS)

Klimcak, C.; Jaduszliwer, B.

1995-01-01

We discuss the concept of an integrated, fiber-optic/microelectronic distributed sensor system that can monitor composite material pressure vessels for Air Force space systems to provide assessments of the overall health and integrity of the vessel throughout its entire operating history from birth to end of life. The fiber optic component would include either a semiconductor light emitting diode or diode laser and a multiplexed fiber optic sensing network incorporating Bragg grating sensors capable of detecting internal temperature and strain. The microelectronic components include a power source, a pulsed laser driver, time domain data acquisition hardware, a microprocessor, a data storage device, and a communication interface. The sensing system would be incorporated within the composite during its manufacture. The microelectronic data acquisition and logging system would record the environmental conditions to which the vessel has been subjected to during its storage and transit, e.g., the history of thermal excursions, pressure loading data, the occurrence of mechanical impacts, the presence of changing internal strain due to aging, delamination, material decomposition, etc. Data would be maintained din non-volatile memory for subsequent readout through a microcomputer interface.

The MOS silicon gate technology and the first microprocessors

NASA Astrophysics Data System (ADS)

Faggin, F.

2015-12-01

Today we are so used to the enormous capabilities of microelectronics that it is hard to imagine what it might have been like in the early Sixties and Seventies when much of the technology we use today was being developed. This paper will first present a brief history of microelectronics and computers, taking us to the threshold of the inventions of the MOS silicon gate technology and the microprocessor. These two creations provided the basic technology that would allow only a few years later to merge microelectronics and computers into the first commercial monolithic computer. By the late Seventies, the first monolithic computer weighting less than one gram, occupying a volume of less than one cubic centimeter, dissipating less than one Watt, and selling for less than ten dollars, could perform more information processing than the UNIVAC I, the first commercial electronic computer introduced in 1951, made with 5200 vacuum tubes, dissipating 125kW, weighting 13 metric tons, occupying a room larger than 35m2, and selling for more than one million dollars per unit. The first-person story of the SGT and the early microprocessors will be told by the Italian-born physicist who led both projects.

Design, Fabrication, and Characterization of Carbon Nanotube Field Emission Devices for Advanced Applications

NASA Astrophysics Data System (ADS)

Radauscher, Erich Justin

Carbon nanotubes (CNTs) have recently emerged as promising candidates for electron field emission (FE) cathodes in integrated FE devices. These nanostructured carbon materials possess exceptional properties and their synthesis can be thoroughly controlled. Their integration into advanced electronic devices, including not only FE cathodes, but sensors, energy storage devices, and circuit components, has seen rapid growth in recent years. The results of the studies presented here demonstrate that the CNT field emitter is an excellent candidate for next generation vacuum microelectronics and related electron emission devices in several advanced applications. The work presented in this study addresses determining factors that currently confine the performance and application of CNT-FE devices. Characterization studies and improvements to the FE properties of CNTs, along with Micro-Electro-Mechanical Systems (MEMS) design and fabrication, were utilized in achieving these goals. Important performance limiting parameters, including emitter lifetime and failure from poor substrate adhesion, are examined. The compatibility and integration of CNT emitters with the governing MEMS substrate (i.e., polycrystalline silicon), and its impact on these performance limiting parameters, are reported. CNT growth mechanisms and kinetics were investigated and compared to silicon (100) to improve the design of CNT emitter integrated MEMS based electronic devices, specifically in vacuum microelectronic device (VMD) applications. Improved growth allowed for design and development of novel cold-cathode FE devices utilizing CNT field emitters. A chemical ionization (CI) source based on a CNT-FE electron source was developed and evaluated in a commercial desktop mass spectrometer for explosives trace detection. This work demonstrated the first reported use of a CNT-based ion source capable of collecting CI mass spectra. The CNT-FE source demonstrated low power requirements, pulsing capabilities, and average lifetimes of over 320 hours when operated in constant emission mode under elevated pressures, without sacrificing performance. Additionally, a novel packaged ion source for miniature mass spectrometer applications using CNT emitters, a MEMS based Nier-type geometry, and a Low Temperature Cofired Ceramic (LTCC) 3D scaffold with integrated ion optics were developed and characterized. While previous research has shown other devices capable of collecting ion currents on chip, this LTCC packaged MEMS micro-ion source demonstrated improvements in energy and angular dispersion as well as the ability to direct the ions out of the packaged source and towards a mass analyzer. Simulations and experimental design, fabrication, and characterization were used to make these improvements. Finally, novel CNT-FE devices were developed to investigate their potential to perform as active circuit elements in VMD circuits. Difficulty integrating devices at micron-scales has hindered the use of vacuum electronic devices in integrated circuits, despite the unique advantages they offer in select applications. Using a combination of particle trajectory simulation and experimental characterization, device performance in an integrated platform was investigated. Solutions to the difficulties in operating multiple devices in close proximity and enhancing electron transmission (i.e., reducing grid loss) are explored in detail. A systematic and iterative process was used to develop isolation structures that reduced crosstalk between neighboring devices from 15% on average, to nearly zero. Innovative geometries and a new operational mode reduced grid loss by nearly threefold, thereby improving transmission of the emitted cathode current to the anode from 25% in initial designs to 70% on average. These performance enhancements are important enablers for larger scale integration and for the realization of complex vacuum microelectronic circuits.

Nano-interconnection for microelectronics and polymers with benzo-triazole

NASA Technical Reports Server (NTRS)

Park, Yeonjoon; Choi, Sang H.; Noh, Hyunpil; Kuk, Young

2006-01-01

Benzo-Triazole (BTA) is considered as an important bridging material that can connect an organic polymer to the metal electrode on silicon wafers as a part of the microelectronics fabrication technology. We report a detailed process of surface induced 3-D polymerization of BTA on the Cu electrode material which was measured with the Ultraviolet Photoemission Spectroscopy (UPS), X-ray Photoemission Spectroscopy (XPS), and Scanning Tunneling Microscope (STM). The electric utilization of shield and chain polymerization of BTA on Cu surface is contemplated in this study.

Multilayered Microelectronic Device Package With An Integral Window

DOEpatents

Peterson, Kenneth A.; Watson, Robert D.

2004-10-26

A microelectronic package with an integral window mounted in a recessed lip for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can be formed of a low temperature co-fired ceramic (LTCC) or high temperature cofired ceramic (HTCC) multilayered material, with the integral window being simultaneously joined (e.g. co-fired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that a light-sensitive side is optically accessible through the window. The result is a compact, low profile package, having an integral window mounted in a recessed lip, that can be hermetically sealed.

Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications

NASA Astrophysics Data System (ADS)

Jiang, Hongjin

SnPb solders have long been used as interconnect materials in microelectronic packaging. Due to the health threat of lead to human beings, the use of lead-free interconnect materials is imperative. Three kinds of lead-free interconnect materials are being investigated, namely lead-free metal solders (SnAg, SnAgCu, etc.), electrically conductive adhesives (ECAs) and carbon nanotubes (CNTs). However, there are still limitations for the full utilization of these lead-free interconnect materials in the microelectronic packaging, such as higher melting point of lead-free metal solders, lower electrical conductivity of the ECAs and poor adhesion of CNTs to substrates. This thesis is devoted to the research and development of low processing temperature lead-free interconnect materials for microelectronic packaging applications with an emphasis on fundamental studies of nanoparticles synthesis, dispersion and oxidation prevention, and nanocomposites fabrication. Oxide-free tin (Sn), tin/silver (96.5Sn3.5Ag) and tin/silver/copper (96.5Sn3.0Ag0.5Cu) alloy nanoparticles with different sizes were synthesized by a low temperature chemical reduction method. Both size dependent melting point and latent heat of fusion of the synthesized nanoparticles were obtained. The nano lead-free solder pastes/composites created by dispersing the SnAg or SnAgCu alloy nanoparticles into an acidic type flux spread and wet on the cleaned copper surface at 220 to 230°C. This study demonstrated the feasibility of nano sized SnAg or SnAgCu alloy particle pastes for low processing temperature lead-free interconnect applications in microelectronic packaging.

Solid State Research, 1973:2.

DTIC Science & Technology

MERCURY COMPOUNDS, CADMIUM COMPOUNDS, TELLURIDES, NEODYMIUM COMPOUNDS, PHOSPHATES , ELECTRON TRANSITIONS, INFRARED OPTICAL MATERIALS, CRYSTAL GROWTH, MAGNESIUM OXIDES, PHOSPHORESCENT MATERIALS, SEMICONDUCTOR DIODES, MICROELECTRONICS

Towards tunable and multifunctional interfaces: Multicomponent amorphous alloys and bilayer stacks

NASA Astrophysics Data System (ADS)

Kast, Matthew G.

Controlling the electronic structure and requisite charge transfer at and across interfaces is a grand challenge of materials science. Despite decades of research and numerous successes in the fields microelectronics and photovoltaics much work remains to be done. In many applications, whether they be in microelectronics, photovoltaics or display technology there is a demand for multiple functions at a single interface. Historically, existent materials were either discarded as an option due to known properties or tested with some application based figure of merit in mind. Following this, the quality of the material and/or the preparation of the surface/interface to which the material would be deposited was optimized. As the microelectronics and photovoltaics industries have matured, continued progress (faster, lower power transistors and more efficient, cheaper, abundant solar cells) will require new materials (possibly not previously existent) that are fundamentally better for their application than their highly optimized existent counter parts. The manifestation of this has been seen in the microelectronics field with introduction of hafnium silicates to replace silica (which had previously been monumentally successful) as the gate dielectrics for the most advanced transistors. Continued progress in efficient, cheap, abundant photovoltaics will require similar advances. Advances will be needed in the area of new abundant absorbers that can be deposited cheaply which result in materials with high efficiencies. In addition, selective contacts capable of extracting charge from efficient absorbers with low ohmic losses and low recombination rates will be needed. Presented here are two approaches to the multifunctional interface problem, first the use of amorphous alloys that open up the accessible composition space of thin films significantly and second the use of bilayers that loosen the requirements of a single film at an interface.

Wireless Integrated Microelectronic Vacuum Sensor System

NASA Technical Reports Server (NTRS)

Krug, Eric; Philpot, Brian; Trott, Aaron; Lawrence, Shaun

2013-01-01

NASA Stennis Space Center's (SSC's) large rocket engine test facility requires the use of liquid propellants, including the use of cryogenic fluids like liquid hydrogen as fuel, and liquid oxygen as an oxidizer (gases which have been liquefied at very low temperatures). These fluids require special handling, storage, and transfer technology. The biggest problem associated with transferring cryogenic liquids is product loss due to heat transfer. Vacuum jacketed piping is specifically designed to maintain high thermal efficiency so that cryogenic liquids can be transferred with minimal heat transfer. A vacuum jacketed pipe is essentially two pipes in one. There is an inner carrier pipe, in which the cryogenic liquid is actually transferred, and an outer jacket pipe that supports and seals the vacuum insulation, forming the "vacuum jacket." The integrity of the vacuum jacketed transmission lines that transfer the cryogenic fluid from delivery barges to the test stand must be maintained prior to and during engine testing. To monitor the vacuum in these vacuum jacketed transmission lines, vacuum gauge readings are used. At SSC, vacuum gauge measurements are done on a manual rotation basis with two technicians, each using a handheld instrument. Manual collection of vacuum data is labor intensive and uses valuable personnel time. Additionally, there are times when personnel cannot collect the data in a timely fashion (i.e., when a leak is detected, measurements must be taken more often). Additionally, distribution of this data to all interested parties can be cumbersome. To simplify the vacuum-gauge data collection process, automate the data collection, and decrease the labor costs associated with acquiring these measurements, an automated system that monitors the existing gauges was developed by Invocon, Inc. For this project, Invocon developed a Wireless Integrated Microelectronic Vacuum Sensor System (WIMVSS) that provides the ability to gather vacuum-gauge measurements automatically and wirelessly, in near-real time - using a low-maintenance, lowpower sensor mesh network. The WIMVSS operates by using a self-configuring mesh network of wireless sensor units. Mesh networking is a type of networking where each sensor or node can capture and disseminate its own data, but also serve as a relay to receive and transmit data from other sensors. Each sensor node can synchronize with adjacent sensors, and propagate data from one sensor to the next, until the destination is reached. In this case, the destination is a Network Interface Unit (NIU). The WIMVSS sensors are mounted on the existing vacuum gauges. Information gathered by the sensors is sent to the NIU. Because of the mesh networking, if a sensor cannot directly send the data to the NIU, it can be propagated through the network of sensors. The NIU requires antenna access to the sensor units, AC power, and an Ethernet connection. The NIU bridges the sensor network to a WIMVSS server via an Ethernet connection. The server is configured with a database, a Web server, and proprietary interface software that makes it possible for the vacuum measurements from vacuum jacketed fluid lines to be saved, retrieved, and then displayed from any Web-enabled PC that has access to the Internet. Authorized users can then simply access the data from any PC with Internet connection. Commands can also be sent directly from the Web interface for control and maintenance of the sensor network. The technology enabled by the WIMVSS decreases labor required for gathering vacuum measurements, increases access to vacuum data by making it available on any computer with access to the Internet, increases the frequency with which data points can be acquired for evaluating the system, and decreases the recurring cost of the sensors by using off-the-shelf components and integrating these with heritage vacuum gauges.

Performance characteristics of nanocrystalline diamond vacuum field emission transistor array

NASA Astrophysics Data System (ADS)

Hsu, S. H.; Kang, W. P.; Davidson, J. L.; Huang, J. H.; Kerns, D. V.

2012-06-01

Nitrogen-incorporated nanocrystalline diamond (ND) vacuum field emission transistor (VFET) with self-aligned gate is fabricated by mold transfer microfabrication technique in conjunction with chemical vapor deposition (CVD) of nanocrystalline diamond on emitter cavity patterned on silicon-on-insulator (SOI) substrate. The fabricated ND-VFET demonstrates gate-controlled emission current with good signal amplification characteristics. The dc characteristics of the ND-VFET show well-defined cutoff, linear, and saturation regions with low gate turn-on voltage, high anode current, negligible gate intercepted current, and large dc voltage gain. The ac performance of the ND-VFET is measured, and the experimental data are analyzed using a modified small signal circuit model. The experimental results obtained for the ac voltage gain are found to agree with the theoretical model. A higher ac voltage gain is attainable by using a better test setup to eliminate the associated parasitic capacitances. The paper reveals the amplifier characteristics of the ND-VFET for potential applications in vacuum microelectronics.

Performance characteristics of nanocrystalline diamond vacuum field emission transistor array

NASA Astrophysics Data System (ADS)

Hsu, S. H.; Kang, W. P.; Davidson, J. L.; Huang, J. H.; Kerns, D. V.

2012-05-01

Nitrogen-incorporated nanocrystalline diamond (ND) vacuum field emission transistor (VFET) with self-aligned gate is fabricated by mold transfer microfabrication technique in conjunction with chemical vapor deposition (CVD) of nanocrystalline diamond on emitter cavity patterned on silicon-on-insulator (SOI) substrate. The fabricated ND-VFET demonstrates gate-controlled emission current with good signal amplification characteristics. The dc characteristics of the ND-VFET show well-defined cutoff, linear, and saturation regions with low gate turn-on voltage, high anode current, negligible gate intercepted current, and large dc voltage gain. The ac performance of the ND-VFET is measured, and the experimental data are analyzed using a modified small signal circuit model. The experimental results obtained for the ac voltage gain are found to agree with the theoretical model. A higher ac voltage gain is attainable by using a better test setup to eliminate the associated parasitic capacitances. The paper reveals the amplifier characteristics of the ND-VFET for potential applications in vacuum microelectronics.

Hydrogen ion microlithography

DOEpatents

Tsuo, Y. Simon; Deb, Satyen K.

1990-01-01

Disclosed is a hydrogen ion microlithography process for use in microelectronic fabrication and semiconductor device processing. The process comprises the steps of providing a single layer of either an amorphous silicon or hydrogenated amorphous silicon material. A pattern is recorded in a selected layer of amorphous silicon or hydrogenated amorphous silicon materials by preferentially implanting hydrogen ions therein so as to permit the selected layer to serve as a mask-resist wafer suitable for subsequent development and device fabrication. The layer is developed to provide a surface pattern therein adaptable for subsequent use in microelectronic fabrication and semiconductor device processing.

Uses of ceramics in microelectronics: A survey

NASA Technical Reports Server (NTRS)

Bratschun, W. R.; Mountvala, A. J.; Pincus, A. G.

1971-01-01

The properties and behavior of ceramic materials used in components for electronic circuitry are examined to appraise the present and future directions for microelectronics, and to suggest further product development, and how innovations may be useful in other technologies. Ceramic and glass insulators, resistors, capacitors, and the use of ceramics and glasses in microcircuitry are discussed along with technology transfer to nonaerospace uses.

Investigation of “benign” ionic content in epoxy that induces microelectronic device failure

Treesearch

Gregory T. Schueneman; Jeffery Kingsbury; Edmund Klinkerch

2011-01-01

Microelectronics and the devices dependent upon them have the extremely challenging requirements of becoming more capable and less expensive every year. This drives the industry to pack more functions into an ever smaller footprint until the next technological revolution. Adding to this situation is the removal of lead from the bill of materials followed closely by...

Semiconductor Metal-Organic Frameworks: Future Low-Bandgap Materials.

PubMed

Usman, Muhammad; Mendiratta, Shruti; Lu, Kuang-Lieh

2017-02-01

Metal-organic frameworks (MOFs) with low density, high porosity, and easy tunability of functionality and structural properties, represent potential candidates for use as semiconductor materials. The rapid development of the semiconductor industry and the continuous miniaturization of feature sizes of integrated circuits toward the nanometer (nm) scale require novel semiconductor materials instead of traditional materials like silicon, germanium, and gallium arsenide etc. MOFs with advantageous properties of both the inorganic and the organic components promise to serve as the next generation of semiconductor materials for the microelectronics industry with the potential to be extremely stable, cheap, and mechanically flexible. Here, a perspective of recent research is provided, regarding the semiconducting properties of MOFs, bandgap studies, and their potential in microelectronic devices. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Evolution of gettering technologies for vacuum tubes to getters for MEMS

NASA Astrophysics Data System (ADS)

Amiotti, M.

2008-05-01

Getter materials are technically proven and industrially accepted practical ways to maintain vacuum inside hermetically sealed tubes or devices to assure high reliability and long lifetime of the operating devices. The most industrially proven vacuum tube is the cathode rays tubes (CRTs), where large surfaces are available for the deposition of an evaporated barium film by a radio frequency inductive heating of a stainless steel container filled with a BaAl4 powder mixed to Ni powder. The evolution of the CRTs manufacturing technologies required also new types of barium getters able to withstand some thermal process in air without any deterioration of the evaporation characteristics. In other vacuum tubes such as traveling waves tubes, the space available for the evaporation of a barium film and the sorption capacity required to assure the vacuum for the lifetime of the devices did not allow the use of the barium film, prompting the development of sintered non evaporable getter pills that can be activated during the manufacturing process or by flowing current through an embedded resistance. The same sintered non evaporable getter pills could find usage also in evacuated parts to thermally isolate the infrared sensors for different final applications. In high energy physics particle accelerators, the getter technology moved from localized vacuum getter pumps or getter strips to a getter coating over the surface of vacuum chambers in order to guarantee a more uniform pumping speed. With the advent of solid state electronics, new challenges faced the getter technology to assure long life to vacuum or inert gas filled hermetical packages containing microelectronic devices, especially in the telecommunication and military applications. A well known problem of GaAs devices with Pd or Pt metalization is the H2 poisoning of the metal gate: to prevent this degradation a two layer getter film has been develop to absorb a large quantity of H2 per unit of getter surface. The development of Micro Electro Mechanical Systems (MEMS) with moving parts in a vacuum environment required the development of a new generation of getter film, few microns thick, that can be selectively patterned onto a silicon or glass wafer (usually 4'' or 8''). This wafer with patterned getter film can be used directly as the cap wafer of a wafer to wafer bonded MEMS structure, assuring long life and reliability to the moving MEMS structure especially in automotive applications where thermal cycles are required for qualification.

Hydrogen ion microlithography

DOEpatents

Tsuo, Y.S.; Deb, S.K.

1990-10-02

Disclosed is a hydrogen ion microlithography process for use in microelectronic fabrication and semiconductor device processing. The process comprises the steps of providing a single layer of either an amorphous silicon or hydrogenated amorphous silicon material. A pattern is recorded in a selected layer of amorphous silicon or hydrogenated amorphous silicon materials by preferentially implanting hydrogen ions therein so as to permit the selected layer to serve as a mask-resist wafer suitable for subsequent development and device fabrication. The layer is developed to provide a surface pattern therein adaptable for subsequent use in microelectronic fabrication and semiconductor device processing. 6 figs.

Microelectronic components and metallic oxide studies and applications

NASA Technical Reports Server (NTRS)

Williams, L., Jr.

1976-01-01

The project involved work in two basic areas: (1) Evaluation of commercial screen printable thick film conductors, resistors, thermistors and dielectrics as well as alumina substrates used in hybird microelectronics industries. Results of tests made on materials produced by seven companies are presented. (2) Experimental studies on metallic oxides of copper and vanadium, in an effort to determine their electrochemical properties in crystalline, powder mixtures and as screen printable thick films constituted the second phase of the research effort. Oxide investigations were aimed at finding possible applications of these materials as switching devices memory elements and sensors.

PREFACE: The Second Conference on Microelectronics, Microsystems and Nanotechnology

NASA Astrophysics Data System (ADS)

Nassiopoulou, Androula G.; Papanikolaou, Nikos; Tsamis, Christos

2005-01-01

The Second Conference on Microelectronics, Microsystems and Nanotechnology took place at the National Centre for Scientific Research `Demokritos', in Athens, Greece, between 14 and 17 November 2004. The conference was organized by the Institute of Microelectronics (IMEL) with the aim to bring together scientists and engineers working in the above exciting fields in an interactive forum. The conference included 45 oral presentations with 9 invited papers and was attended by 146 participants from 16 countries. The topics covered were nanotechnologies, quantum devices, sensors, micro- and nano-systems, semiconductor devices, C-MOS fabrication and characterization techniques, new materials, and IC design. Quantum devices and nanostructured materials attracted considerable attention. Both theoretical and experimental studies of metallic and semiconducting quantum systems were presented, with emphasis on their applications in electronics, optoelectronics, and nanocrystal memory devices. Another exciting topic was the recent developments in biocompatible lithographic processes for applications in biosensors. In particular novel processes for bio-friendly lithography, together with innovations in Si sensors for applications in medicine and food industry were presented. Recent developments and perspectives in CMOS technology towards the ultimate limit were also discussed. The conference covered issues and concepts of IC design with two invited talks on RF design and cryptography.The conference included presentations from several companies active in the field of microelectronics and systems in Greece.

The MEMS Knudsen Compressor as a Vacuum Pump for Space Exploration Applications

NASA Technical Reports Server (NTRS)

Vargo, S. E.; Muntz, E. P.; Tang, W. C.

2000-01-01

Several lander, probe and rover missions currently under study at the Jet Propulsion Laboratory (JPL) and especially in the Microdevices Laboratory (MDL) Center for Space Microelectronics Technology, focus on utilizing microelectromechanical systems (MEMS) based instruments for science data gathering. These small instruments and NASA's commitment to "faster, better, cheaper" type missions has brought about the need for novel approaches to satisfying mission requirements. Existing in-situ instrument systems clearly lack novel and integrated methods for satisfying their vacuum needs. One attractive candidate for a MEMS vacuum pump is the Knudsen Compressor, which operates based on thermal transpiration. Thermal transpiration describes gas flows induced by temperature differences maintained across orifices, porous membranes or capillary tubes under rarefied conditions. This device has two overwhelmingly attractive features as a MEMS vacuum pump - no moving parts and no fluids. An initial estimate of a Knudsen Compressor's pumping power requirements for a surface atmospheric sampling task on Mars is less than 80 mW, significantly below than alternative pumps. Due to the relatively low energy use for this task and the applicability of the Knudsen Compressor to other applications, the development of a Knudsen Compressor utilizing MEMS fabrication techniques has been initiated. This paper discusses the initial fabrication of a single-stage MEMS Knudsen Compressor vacuum pump, provides performance criteria such as pumping speed, size, energy use and ultimate pressure and details vacuum pump applications in several MDL related in-situ instruments.

Field enhancement in plasmonic nanostructures

NASA Astrophysics Data System (ADS)

Piltan, Shiva; Sievenpiper, Dan

2018-05-01

Efficient generation of charge carriers from a metallic surface is a critical challenge in a wide variety of applications including vacuum microelectronics and photo-electrochemical devices. Replacing semiconductors with vacuum/gas as the medium of electron transport offers superior speed, power, and robustness to radiation and temperature. We propose a metallic resonant surface combining optical and electrical excitations of electrons and significantly reducing powers required using plasmon-induced enhancement of confined electric field. The properties of the device are modeled using the exact solution of the time-dependent Schrödinger equation at the barrier. Measurement results exhibit strong agreement with an analytical solution, and allow us to extract the field enhancement factor at the surface. Significant photocurrents are observed using combination of {{W}} {{{c}}{{m}}}-2 optical power and 10 V DC excitation on the surface. The model suggests optical field enhancement of 3 orders of magnitude at the metal interface due to plasmonic resonance. This simple planar structure provides valuable evidence on the electron emission mechanisms involved and it can be used for implementation of semiconductor compatible vacuum devices.

78 FR 59916 - Application(s) for Duty-Free Entry of Scientific Instruments

Federal Register 2010, 2011, 2012, 2013, 2014

2013-09-30

... Minnesota, Dept. of Chemical Engineering & Material Science, 421 Washington Avenue SE, Minneapolis, MN 55455... microelectronics, micro-electromechanical systems (MEMS) as well as nanotechnology materials and devices...

Ceramic materials of low-temperature synthesis for dielectric coating applied by 3D aerosol printing used in nano- and microelectronics, lighting engineering, and spacecraft control devices

NASA Astrophysics Data System (ADS)

Ivanov, A. A.; Tuev, V. I.; Nisan, A. V.; Potapov, G. N.

2016-11-01

A synthesis technique of low-temperature ceramic material based on aluminosilicates of dendrimer morphology capable to contain up to 80 wt % of nitrides and oxides of high-melting compounds as filler has been developed. The synthesis is based on a sol-gel method followed by mechanochemical treatment and ultrasonic dispersing. Dielectric ceramic layers with the layer thickness in the nanometer range and high thermal conductivity have been obtained for the first time by 3D aerosol printing of the synthesized material. The study of the obtained ceramic coating on the metal surface (Al) has proved its use prospects in microelectronics, light engineering, and devices for special purposes.

Electron emission from ferroelectrics - a review

NASA Astrophysics Data System (ADS)

Riege, H.

1994-02-01

The strong pulsed emission of electrons from the surface of ferroelectric (FE) materials was discovered at CERN in 1987. Since then many aspects and properties of the method of generation and propagation of electron beams from FE have been studied experimentally. The method is based on macroscopic charge separation and self-emission of electrons under the influence of their own space-charge fields. Hence, this type of emission is not limited by the Langmuir-Child law as are conventional emission methods. Charge separation and electron emission can be achieved by rapid switching of the spontaneous, ferroelectric polarization. Polarization switching may be induced by application of electrical-field or mechanical-pressure pulses, as well as by thermal heating or laser illumination of the ferroelectric emitter. At higher emission intensities plasma formation assists the FE emission and leads to a strong growth of emitted current amplitude, which is no longer limited by the FE material and the surface properties. The most attractive features of FE emission are robustness and ease of manipulation of the emitter cathodes which can be transported through atmospheric air and used without any problems in vacuum, low-pressure gas or plasma environments. Large-area arrangements of multiple emitters, switched in interleaved mode, can produce electron beams of any shape, current amplitude or time structure. The successful application of FE emission in accelerator technology has been demonstrated experimentally in several cases, e.g. for triggering high-power gas switches, for photocathodes in electron guns, and for electron-beam generators intended to generate, neutralize and enhance ion beams in ion sources and ion linacs. Other applications can be envisaged in microwave power generators and in the fields of electronics and vacuum microelectronics.

Integrated Vacuum Micro-Electronics for Upper Milimeter Wave Applications

DTIC Science & Technology

2011-01-01

voltages  beyond  VDSS   € ID ≅ IDSS 1+ λ VDS −VDSS( )[ ] = IDSS + gout VDS −VDSS( ) (A) (6) where  λ   is   the  channel   length...modulation  parameter  and   gout   (Ω-­‐1)   is  output  conductance  of   the   FET  in  the  saturation  regime.  As... gout (right) vs. doping concentration for a 1 µm × 1 µm × 100 µm ungated Si FET. Figure 6 Linear resistance rlin and output resistance rout (left

Sealed vacuum canister and method for pick-up and containment of material

DOEpatents

Stoutenburgh, Roger R.

1996-01-01

A vacuum canister including a housing with a sealed vacuum chamber having a predetermined vacuum pressure therein and a valve having a first port for fluid communication with the vacuum chamber and a second port for receiving at least one of a fluid and a particulate material. The valve is operable between a first position to seal the vacuum chamber and retain the predetermined vacuum within the vacuum chamber, and a second position to access the vacuum chamber to permit vacuum fluid flow through the valve from the second port into the vacuum chamber. In operation of the vacuum canister to pick up material with the valve in the second position, when the second port is located adjacent at least one of a fluid and a particulate material, is effective to displace through the valve at least one of a fluid and a particulate material into the housing. The vacuum canister is desirably suitable for picking up and containing hazardous material such as radioactive material, in which the vacuum canister includes a protective layer of lead having a predetermined thickness that is effective to shield radiation emitted from the radioactive material contained within the housing. Advantageously, the vacuum canister includes a vacuum means for establishing a predetermined vacuum pressure within the vacuum chamber.

Sealed vacuum canister and method for pick-up and containment of material

DOEpatents

Stoutenburgh, R.R.

1996-02-13

A vacuum canister is described including a housing with a sealed vacuum chamber having a predetermined vacuum pressure therein and a valve having a first port for fluid communication with the vacuum chamber and a second port for receiving at least one of a fluid and a particulate material. The valve is operable between a first position to seal the vacuum chamber and retain the predetermined vacuum within the vacuum chamber, and a second position to access the vacuum chamber to permit vacuum fluid flow through the valve from the second port into the vacuum chamber. The vacuum canister, in the operation to pick up material with the valve in the second position, when the second port is located adjacent at least one of a fluid and a particulate material, is effective to displace through the valve at least one of a fluid and a particulate material into the housing. The vacuum canister is desirably suitable for picking up and containing hazardous material such as radioactive material, in which the vacuum canister includes a protective layer of lead having a predetermined thickness that is effective to shield radiation emitted from the radioactive material contained within the housing. Advantageously, the vacuum canister includes a vacuum means for establishing a predetermined vacuum pressure within the vacuum chamber. 6 figs.

Photopolymerizable liquid encapsulants for microelectronic devices

NASA Astrophysics Data System (ADS)

Baikerikar, Kiran K.

2000-10-01

Plastic encapsulated microelectronic devices consist of a silicon chip that is physically attached to a leadframe, electrically interconnected to input-output leads, and molded in a plastic that is in direct contact with the chip, leadframe, and interconnects. The plastic is often referred to as the molding compound, and is used to protect the chip from adverse mechanical, thermal, chemical, and electrical environments. Encapsulation of microelectronic devices is typically accomplished using a transfer molding process in which the molding compound is cured by heat. Most transfer molding processes suffer from significant problems arising from the high operating temperatures and pressures required to fill the mold. These aspects of the current process can lead to thermal stresses, incomplete mold filling, and wire sweep. In this research, a new strategy for encapsulating microelectronic devices using photopolymerizable liquid encapsulants (PLEs) has been investigated. The PLEs consist of an epoxy novolac-based vinyl ester resin (˜25 wt.%), fused silica filler (70--74 wt.%), and a photoinitiator, thermal initiator, and silane coupling agent. For these encapsulants, the use of light, rather than heat, to initiate the polymerization allows precise control over when the reaction starts, and therefore completely decouples the mold filling and the cure. The low viscosity of the PLEs allows for low operating pressures and minimizes problems associated with wire sweep. In addition, the in-mold cure time for the PLEs is equivalent to the in-mold cure times of current transfer molding compounds. In this thesis, the thermal and mechanical properties, as well as the viscosity and adhesion of photopolymerizable liquid encapsulants, are reported in order to demonstrate that a UV-curable formulation can have the material properties necessary for microelectronic encapsulation. In addition, the effects of the illumination time, postcure time, fused silica loading, and the inclusion of a thermal initiator on the thermal and mechanical properties of the final cured encapsulants have been investigated. The results show that the material properties of the PLEs are the same, if not better, than those exhibited by conventional transfer molding compounds and demonstrate the potential of using PLEs for encapsulating microelectronic devices.

Synthetic thermoelectric materials comprising phononic crystals

DOEpatents

El-Kady, Ihab F; Olsson, Roy H; Hopkins, Patrick; Reinke, Charles; Kim, Bongsang

2013-08-13

Synthetic thermoelectric materials comprising phononic crystals can simultaneously have a large Seebeck coefficient, high electrical conductivity, and low thermal conductivity. Such synthetic thermoelectric materials can enable improved thermoelectric devices, such as thermoelectric generators and coolers, with improved performance. Such synthetic thermoelectric materials and devices can be fabricated using techniques that are compatible with standard microelectronics.

State-of-the-art methods for testing materials outdoors

Treesearch

R. Sam Williams

2004-01-01

In recent years, computers, sensors, microelectronics, and communication technologies have made it possible to automate the way materials are tested in the field. It is now possible to purchase monitoring equipment to measure weather and materials properties. The measurement of materials response often requires innovative approaches and added expense, but the...

Effect of an Interfacial Layer on Electron Tunneling through Atomically Thin Al2O3 Tunnel Barriers.

PubMed

Wilt, Jamie; Sakidja, Ridwan; Goul, Ryan; Wu, Judy Z

2017-10-25

Electron tunneling through high-quality, atomically thin dielectric films can provide a critical enabling technology for future microelectronics, bringing enhanced quantum coherent transport, fast speed, small size, and high energy efficiency. A fundamental challenge is in controlling the interface between the dielectric and device electrodes. An interfacial layer (IL) will contain defects and introduce defects in the dielectric film grown atop, preventing electron tunneling through the formation of shorts. In this work, we present the first systematic investigation of the IL in Al 2 O 3 dielectric films of 1-6 Å's in thickness on an Al electrode. We integrated several advanced approaches: molecular dynamics to simulate IL formation, in situ high vacuum sputtering atomic layer deposition (ALD) to synthesize Al 2 O 3 on Al films, and in situ ultrahigh vacuum scanning tunneling spectroscopy to probe the electron tunneling through the Al 2 O 3 . The IL had a profound effect on electron tunneling. We observed a reduced tunnel barrier height and soft-type dielectric breakdown which indicate that defects are present in both the IL and in the Al 2 O 3 . The IL forms primarily due to exposure of the Al to trace O 2 and/or H 2 O during the pre-ALD heating step of fabrication. As the IL was systematically reduced, by controlling the pre-ALD sample heating, we observed an increase of the ALD Al 2 O 3 barrier height from 0.9 to 1.5 eV along with a transition from soft to hard dielectric breakdown. This work represents a key step toward the realization of high-quality, atomically thin dielectrics with electron tunneling for the next generation of microelectronics.

Agricultural wastes as a resource of raw materials for developing low-dielectric glass-ceramics

PubMed Central

Danewalia, Satwinder Singh; Sharma, Gaurav; Thakur, Samita; Singh, K.

2016-01-01

Agricultural waste ashes are used as resource materials to synthesize new glass and glass-ceramics. The as-prepared materials are characterized using various techniques for their structural and dielectric properties to check their suitability in microelectronic applications. Sugarcane leaves ash exhibits higher content of alkali metal oxides than rice husk ash, which reduces the melting point of the components due to eutectic reactions. The addition of sugarcane leaves ash in rice husk ash promotes the glass formation. Additionally, it prevents the cristobalite phase formation. These materials are inherently porous, which is responsible for low dielectric permittivity i.e. 9 to 40. The presence of less ordered augite phase enhances the dielectric permittivity as compared to cristobalite and tridymite phases. The present glass-ceramics exhibit lower losses than similar materials synthesized using conventional minerals. The dielectric permittivity is independent to a wide range of temperature and frequency. The glass-ceramics developed with adequately devitrified phases can be used in microelectronic devices and other dielectric applications. PMID:27087123

Development of Micro and Nanostructured Materials for Interfacial Self-Healing

ERIC Educational Resources Information Center

Blaiszik, Benjamin James

2009-01-01

Damage in polymeric coatings, adhesives, microelectronic components, and composites spans many length scales. For small scale damage, autonomic self-healing can repair multiple damage modes without manual intervention. In autonomic self-healing materials, a healing response is triggered by damage to the material. Size scale considerations, such as…

Method of fabricating a microelectronic device package with an integral window

DOEpatents

Peterson, Kenneth A.; Watson, Robert D.

2003-01-01

A method of fabricating a microelectronic device package with an integral window for providing optical access through an aperture in the package. The package is made of a multilayered insulating material, e.g., a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). The window is inserted in-between personalized layers of ceramic green tape during stackup and registration. Then, during baking and firing, the integral window is simultaneously bonded to the sintered ceramic layers of the densified package. Next, the microelectronic device is flip-chip bonded to cofired thick-film metallized traces on the package, where the light-sensitive side is optically accessible through the window. Finally, a cover lid is attached to the opposite side of the package. The result is a compact, low-profile package, flip-chip bonded, hermetically-sealed package having an integral window.

The chemistry screening for ultra low-k dielectrics plasma etching

NASA Astrophysics Data System (ADS)

Zotovich, A.; Krishtab, M.; Lazzarino, F.; Baklanov, M. R.

2014-12-01

Nowadays, some of the important problems in microelectronics technological node scaling down are related to interconnect delay, dynamic power consumption and crosstalk. This compels introduction and integration of new materials with low dielectric permittivity (low-k materials) as insulator in interconnects. One of such materials under consideration for sub 10 nm technology node is a spin-coated organosilicate glass layer with ordered porosity (37-40%) and a k-value of 2.2 (OSG 2.2). High porosity leads to significant challenges during the integration and one of them is a material degradation during the plasma etching. The low-k samples have been etched in a CCP double frequency plasma chamber from TEL. Standard recipes developed for microporous materials with k<2.5 and based on mixture of C4F8 and CF4 with N2, O2 and Ar were found significantly damaging for high-porous ULK materials. The standard etch recipe was compared with oxygen free etch chemistries based on mixture CF4 with CH2F2 and Ar assuming that the presence of oxygen in the first recipe will have significant negative impact in high porous ULK materials. The film damage has been analyzed using FTIR spectroscopy and the k-value has been extracted by capacitance CV-measurements. There was indirectly shown that vacuum ultraviolet photons cause the main damage of low-k, whereas radicals and ions are not so harmful. Trench structures have been etched in low-k film and cross-SEM analysis with and without HF dipping has been performed to reveal patterning capability and visualize the sidewall damage and. The bottom roughness was analyzed by AFM.

JPRS report. Science and technology: Europe and Latin America

NASA Astrophysics Data System (ADS)

1987-12-01

Topics addressed include: advanced materials; aerospace; civil aviation; automative industry; biotechnology; computers; metallurgical industries; microelectronics; science and technology policy; and lasers, sensor, and optics.

Crystallization Process of Superlattice-Like Sb/SiO2 Thin Films for Phase Change Memory Application

NASA Astrophysics Data System (ADS)

Zhu, Xiao-Qin; Zhang, Rui; Hu, Yi-Feng; Lai, Tian-Shu; Zhang, Jian-Hao; Zou, Hua; Song, Zhi-Tang

2018-05-01

Not Available Supported by the National Natural Science Foundation of China under Grant No 11774438, the Natural Science Foundation of Jiangsu Province under Grant No BK20151172, the Changzhou Science and Technology Bureau under Grant No CJ20160028, the Qing Lan Project, the Opening Project of State Key Laboratory of Silicon Materials under Grant No SKL2017-04, and the Opening Project of Key Laboratory of Microelectronic Devices and Integrated Technology of Institute of Microelectronics of Chinese Academy of Sciences.

Laser processing of ceramics for microelectronics manufacturing

NASA Astrophysics Data System (ADS)

Sposili, Robert S.; Bovatsek, James; Patel, Rajesh

2017-03-01

Ceramic materials are used extensively in the microelectronics, semiconductor, and LED lighting industries because of their electrically insulating and thermally conductive properties, as well as for their high-temperature-service capabilities. However, their brittleness presents significant challenges for conventional machining processes. In this paper we report on a series of experiments that demonstrate and characterize the efficacy of pulsed nanosecond UV and green lasers in machining ceramics commonly used in microelectronics manufacturing, such as aluminum oxide (alumina) and aluminum nitride. With a series of laser pocket milling experiments, fundamental volume ablation rate and ablation efficiency data were generated. In addition, techniques for various industrial machining processes, such as shallow scribing and deep scribing, were developed and demonstrated. We demonstrate that lasers with higher average powers offer higher processing rates with the one exception of deep scribes in aluminum nitride, where a lower average power but higher pulse energy source outperformed a higher average power laser.

Low surface energy polymeric release coating for improved contact print lithography

NASA Astrophysics Data System (ADS)

Mancini, David P.; Resnick, Douglas J.; Gehoski, Kathleen A.; Popovich, Laura L.; Chang, Daniel

2002-03-01

Contact printing has been used for decades in many various lithography applications in the microelectronic industry. While vacuum contact printing processes offer sub-micron resolution and high throughput, they often suffer from some important drawbacks. One of the most common problems is degradation in both resolution and defect density which occurs when the same mask si used for multiple exposures without frequent mask cleans. This is largely due to the relatively high surface energy of both quartz and chrome and the tendency of most photoresists to adhere to these surfaces. As a result, when a mask and wafer are pressed into intimate contact, resist will tend to stick to the mask creating a defect on the wafer, effectively propagating defects to subsequent wafers. In this study, DuPont Teflon AF 1601S is used as a photomask coating and evaluated for its ability to act as a release agent and reduce defects while maintaining resolution for multiple exposures. Teflon AF is an amorphous, transparent, low surface energy, polymeric material that can be spin coated into a thin conformal film. Tests have shown that when using an uncoated mask in vacuum contact, resolution of 0.75 micrometers dense lines is severely degraded after less than 10 consecutive exposures. However, when the mask is coated, 0.75 micrometers dense lines were successfully resolved using vacuum contact for over 200 exposures without cleaning. In addition, it has been demonstrated that Teflon AF coatings impart to a mask a self-cleaning capability, since particles tend to stick to the photoresist rather than the mask. A coated mask, which was purposefully contaminated with particulates, resolved 0.75 micrometers dense lines on all but the first wafer of a series of 25 consecutive exposures. The patented mask releases layer process has successfully been demonstrated with a positive novolak resist. Additional data which describes the system chemistry, dilution and coating process, and film morphology are also presented.

The birth and evolution of surface science: child of the union of science and technology.

PubMed

Duke, C B

2003-04-01

This article is an account of the birth and evolution of surface science as an interdisciplinary research area. Surface science emanated from the confluence of concepts and tools in physics and chemistry with technological innovations that made it possible to determine the structure and properties of surfaces and interfaces and the dynamics of chemical reactions at surfaces. The combination in the 1960s and 1970s of ultra-high-vacuum (i.e., P < 10(-7) Pascal or 10(-9) Torr) technology with the recognition that electrons in the energy range from 50 to 500 eV exhibited inelastic collision mean free paths of the order of a few angstroms fostered an explosion of activity. The results were a reformulation of the theory of electron solid scattering, the nearly universal use of electron spectroscopies for surface characterization, the rise of surface science as an independent interdisciplinary research area, and the emergence of the American Vacuum Society (AVS) as a major international scientific society. The rise of microelectronics in the 1970s and 1980s resulted in huge increases in computational power. These increases enabled more complex experiments and the utilization of density functional theory for the quantitative prediction of surface structure and dynamics. Development of scanning-probe microscopies in the 1990s led to atomic-resolution images of macroscopic surfaces and interfaces as well as videos of atoms moving about on surfaces during growth and diffusion. Scanning probes have since brought solid-liquid interfaces into the realm of atomic-level surface science, expanding its scope to more complex systems, including fragile biological materials and processes.

Thick, low-stress films, and coated substrates formed therefrom

DOEpatents

Henager, Jr., Charles H.; Knoll, Robert W.

1991-01-01

Stress-induced deformation, and the damage resulting therefrom, increases with film thickness. The overcoming of excessive stress by the use of the film material of the present invention, permits the formation of thick films that are necessary for certain of the above described applications. The most likely use for the subject film materials, other than their specialized views as an optical film, is for microelectronic packaging of components on silicon substrates. In general, the subject Si-Al-O-N films have excellent adherence to the underlying substrate, a high degree of hardness and durability, and are excellent insulators. Prior art elevated temperature deposition processes cannot meet the microelectronic packaging temperature formation constraints. The process of the present invention is conducted under non-elevated temperature conditions, typically 500# C. or less.

Thermal and Electrical Characterization of Alumina Substrate for Microelectronic Applications

NASA Astrophysics Data System (ADS)

Ahmad, S.; Ibrahim, A.; Alias, R.; Shapee, S. M.; Ambak, Z.; Zakaria, S. Z.; Yahya, M. R.; Mat, A. F. A.

2010-03-01

This paper reports the effect of sintering temperature on thermal and electrical properties of alumina material as substrate for microelectronic devices. Alumina materials in the form of green sheet with 1 mm thickness were sintered at 1100° C, 1300° C and 1500° C for about 20 hours using heating and cooling rates of 2° C/min. The densities were measured using densitometer and the microstructures of the samples were analyzed using SEM micrographs. Meanwhile thermal and electrical properties of the samples were measured using flash method and impedance analyzer respectively. It was found that thermal conductivity and thermal diffusivity of the substrate increases as sintering temperature increases. It was found also that the dielectric constant of alumina substrate increases as the sintering temperature increases.

NASA Tech Briefs, September 1993. Volume 17, No. 9

NASA Technical Reports Server (NTRS)

1993-01-01

Topics include: Microelectronics; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

88-Inch Cyclotron

Science.gov Websites

, commercial, and international institutions use these beams to understand the effect of radiation on microelectronics, optics, materials, and cells. Click here to see the 88-Inch Cyclotron's contributions to space

Proceedings of the Goddard Space Flight Center Workshop on Robotics for Commercial Microelectronic Processes in Space

NASA Technical Reports Server (NTRS)

1987-01-01

Potential applications of robots for cost effective commercial microelectronic processes in space were studied and the associated robotic requirements were defined. Potential space application areas include advanced materials processing, bulk crystal growth, and epitaxial thin film growth and related processes. All possible automation of these processes was considered, along with energy and environmental requirements. Aspects of robot capabilities considered include system intelligence, ROM requirements, kinematic and dynamic specifications, sensor design and configuration, flexibility and maintainability. Support elements discussed included facilities, logistics, ground support, launch and recovery, and management systems.

NASA Tech Briefs, June 1994. Volume 18, No. 6

NASA Technical Reports Server (NTRS)

1994-01-01

Topics covered include: Microelectronics; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

Materials Coating Techniques

DTIC Science & Technology

1980-03-01

applications from decorative to utilitarian over significant segments of the engineering, chemical, nuclear , microelectronics, and related Industries. PVD...Thermal-control coating. Boron 2430 Cermet component, nuclear shielding and controlrod material; Carbide wear- and temperature-resistant. Calcium...Zirconium Oxide (Hafnia-Pree � Thermal-barrier coatings for nuclear applications. Lime Stabi!Aed) Zirconium 2563 Resistant to high-temperature

Thick, low-stress films, and coated substrates formed therefrom, and methods for making same

DOEpatents

Henager, Jr., Charles H.; Knoll, Robert W.

1992-01-01

Stress-induced deformation, and the damage resulting therefrom, increases with film thickness. The overcoming of excessive stress by the use of the Si-Al-N film material of the present invention, permits the formation of thick films that are necessary for certain of the above described applications. The most likely use for the subject film materials, other than their specialized views as an optical film, is for microelectronic packaging of components on silicon substrates. In general, the subject films have excellent adherence to the underlying substrate, a high degree of hardness and durability, and are excellent insulators. Prior art elevated temperature deposition processes cannot meet the microelectronic packaging temperature formation constraints. The process of the present invention is conducted under non-elevated temperature conditions, typically 500.degree. C. or less.

Printing of microstructure strain sensor for structural health monitoring

NASA Astrophysics Data System (ADS)

Le, Minh Quyen; Ganet, Florent; Audigier, David; Capsal, Jean-Fabien; Cottinet, Pierre-Jean

2017-05-01

Recent advances in microelectronics and materials should allow the development of integrated sensors with transduction properties compatible with being printed directly onto a 3D substrate, especially metallic and polymer substrates. Inorganic and organic electronic materials in microstructured and nanostructured forms, intimately integrated in ink, offer particularly attractive characteristics, with realistic pathways to sophisticated embodiments. Here, we report on these strategies and demonstrate the potential of 3D-printed microelectronics based on a structural health monitoring (SHM) application for the precision weapon systems. We show that our printed sensors can be employed in non-invasive, high-fidelity and continuous strain monitoring of handguns, making it possible to implement printed sensors on a 3D substrate in either SHM or remote diagnostics. We propose routes to commercialization and novel device opportunities and highlight the remaining challenges for research.

Using FLUKA to Calculate Spacecraft: Single Event Environments: A Practical Approach

NASA Technical Reports Server (NTRS)

Koontz, Steve; Boeder, Paul; Reddell, Brandon

2009-01-01

The FLUKA nuclear transport and reaction code can be developed into a practical tool for calculation of spacecraft and planetary surface asset SEE and TID environments. Nuclear reactions and secondary particle shower effects can be estimated with acceptable accuracy both in-flight and in test. More detailed electronic device and/or spacecraft geometries than are reported here are possible using standard FLUKA geometry utilities. Spacecraft structure and shielding mass. Effects of high Z elements in microelectronic structure as reported previously. Median shielding mass in a generic slab or concentric sphere target geometry are at least approximately applicable to more complex spacecraft shapes. Need the spacecraft shielding mass distribution function applicable to the microelectronic system of interest. SEE environment effects can be calculated for a wide range of spacecraft and microelectronic materials with complete nuclear physics. Evaluate benefits of low Z shielding mass can be evaluated relative to aluminum. Evaluate effects of high Z elements as constituents of microelectronic devices. The principal limitation on the accuracy of the FLUKA based method reported here are found in the limited accuracy and incomplete character of affordable heavy ion test data. To support accurate rate estimates with any calculation method, the aspect ratio of the sensitive volume(s) and the dependence must be better characterized.

Applying CLIPS to control of molecular beam epitaxy processing

NASA Technical Reports Server (NTRS)

Rabeau, Arthur A.; Bensaoula, Abdelhak; Jamison, Keith D.; Horton, Charles; Ignatiev, Alex; Glover, John R.

1990-01-01

A key element of U.S. industrial competitiveness in the 1990's will be the exploitation of advanced technologies which involve low-volume, high-profit manufacturing. The demands of such manufacture limit participation to a few major entities in the U.S. and elsewhere, and offset the lower manufacturing costs of other countries which have, for example, captured much of the consumer electronics market. One such technology is thin-film epitaxy, a technology which encompasses several techniques such as Molecular Beam Epitaxy (MBE), Chemical Beam Epitaxy (CBE), and Vapor-Phase Epitaxy (VPE). Molecular Beam Epitaxy (MBE) is a technology for creating a variety of electronic and electro-optical materials. Compared to standard microelectronic production techniques (including gaseous diffusion, ion implantation, and chemical vapor deposition), MBE is much more exact, though much slower. Although newer than the standard technologies, MBE is the technology of choice for fabrication of ultraprecise materials for cutting-edge microelectronic devices and for research into the properties of new materials.

Flexible packaging for microelectronic devices

DOE Office of Scientific and Technical Information (OSTI.GOV)

Anderson, Benjamin John; Nielson, Gregory N.; Cruz-Campa, Jose Luis

An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling themore » protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.« less

The birth and evolution of surface science: Child of the union of science and technology

PubMed Central

Duke, C. B.

2003-01-01

This article is an account of the birth and evolution of surface science as an interdisciplinary research area. Surface science emanated from the confluence of concepts and tools in physics and chemistry with technological innovations that made it possible to determine the structure and properties of surfaces and interfaces and the dynamics of chemical reactions at surfaces. The combination in the 1960s and 1970s of ultra-high-vacuum (i.e., P < 10−7 Pascal or 10−9 Torr) technology with the recognition that electrons in the energy range from 50 to 500 eV exhibited inelastic collision mean free paths of the order of a few angstroms fostered an explosion of activity. The results were a reformulation of the theory of electron solid scattering, the nearly universal use of electron spectroscopies for surface characterization, the rise of surface science as an independent interdisciplinary research area, and the emergence of the American Vacuum Society (AVS) as a major international scientific society. The rise of microelectronics in the 1970s and 1980s resulted in huge increases in computational power. These increases enabled more complex experiments and the utilization of density functional theory for the quantitative prediction of surface structure and dynamics. Development of scanning-probe microscopies in the 1990s led to atomic-resolution images of macroscopic surfaces and interfaces as well as videos of atoms moving about on surfaces during growth and diffusion. Scanning probes have since brought solid–liquid interfaces into the realm of atomic-level surface science, expanding its scope to more complex systems, including fragile biological materials and processes. PMID:12651946

High peak power solid-state laser for micromachining of hard materials

NASA Astrophysics Data System (ADS)

Herbst, Ludolf; Quitter, John P.; Ray, Gregory M.; Kuntze, Thomas; Wiessner, Alexander O.; Govorkov, Sergei V.; Heglin, Mike

2003-06-01

Laser micromachining has become a key enabling technology in the ever-continuing trend of miniaturization in microelectronics, micro-optics, and micromechanics. New applications have become commercially viable due to the emergence of innovative laser sources, such as diode pumped solid-state lasers (DPSSL), and the progress in processing technology. Examples of industrial applications are laser-drilled micro-injection nozzles for highly efficient automobile engines, or manufacturing of complex spinnerets for production of synthetic fibers. The unique advantages of laser-based techniques stem from their ability to produce high aspect ratio holes, while yielding low heat affected zones with exceptional surface quality, roundness and taper tolerances. Additionally, the ability to drill blind holes and slots in very hard materials such as diamond, silicon, sapphire, ceramics and steel is of great interest for many applications in microelectronics, semiconductor and automotive industry. This kind of high quality, high aspect ratio micromachining requires high peak power and short pulse durations.

Torsion pendulum measurements on viscoelastic materials during vacuum exposure

NASA Technical Reports Server (NTRS)

Ward, T. C.; Evans, M. L.

1972-01-01

A torsional pendulum apparatus designed for testing in situ in vacuum, the dynamic mechanical properties of materials is described. The application of this apparatus to an experimental program to measure the effects of vacuum on the mechanical properties of two ablator materials (a foamed material and a filled elastomer) and a solid rocket propellant (a filled elastomer) is presented. Results from the program are discussed as to the effects of vacuum on the mechanical properties of these three materials. In addition, time-temperature-superposition, as a technique for accelerating vacuum induced changes in mechanical properties, is discussed with reference to the three materials tested in the subject program.

Advanced Microelectronics and Materials Programs

DTIC Science & Technology

1991-12-01

of SiC /Si 3N 4 ceramic upon pyrolysis . This material was used to produce adherent coatings on a variety of substrates, and also infiltration ...the areas of Fiber Fabrication, Coatings and Infiltration , Composite Fabrication, and Physical/Mechanical Properties. Significant accomplishments...projects in the areas of Fiber Fabrication, Coatings and Infiltration , Composite Fabrication, and Physical/Mechanical Properties. Significant

Outgassing of solid material into vacuum thermal insulation spaces

NASA Technical Reports Server (NTRS)

Wang, Pao-Lien

1994-01-01

Many cryogenic storage tanks use vacuum between inner and outer tank for thermal insulation. These cryogenic tanks also use a radiation shield barrier in the vacuum space to prevent radiation heat transfer. This shield is usually constructed by using multiple wraps of aluminized mylar and glass paper as inserts. For obtaining maximum thermal performance, a good vacuum level must be maintained with the insulation system. It has been found that over a period of time solid insulation materials will vaporize into the vacuum space and the vacuum will degrade. In order to determine the degradation of vacuum, the rate of outgassing of the insulation materials must be determined. Outgassing rate of several insulation materials obtained from literature search were listed in tabular form.

Using federal technology policy to strength the US microelectronics industry

NASA Astrophysics Data System (ADS)

Gover, J. E.; Gwyn, C. W.

1994-07-01

A review of US and Japanese experiences with using microelectronics consortia as a tool for strengthening their respective industries reveals major differences. Japan has established catch-up consortia with focused goals. These consortia have a finite life targeted from the beginning, and emphasis is on work that supports or leads to product and process-improvement-driven commercialization. Japan's government has played a key role in facilitating the development of consortia and has used consortia promote domestic competition. US consortia, on the other hand, have often emphasized long-range research with considerably less focus than those in Japan. The US consortia have searched for and often made revolutionary technology advancements. However, technology transfer to their members has been difficult. Only SEMATECH has assisted its members with continuous improvements, compressing product cycles, establishing relationships, and strengthening core competencies. The US government has not been a catalyst nor provided leadership in consortia creation and operation. We propose that in order to regain world leadership in areas where US companies lag foreign competition, the US should create industry-wide, horizontal-vertical, catch-up consortia or continue existing consortia in the six areas where the US lags behind Japan -- optoelectronics, displays, memories, materials, packaging, and manufacturing equipment. In addition, we recommend that consortia be established for special government microelectronics and microelectronics research integration and application. We advocate that these consortia be managed by an industry-led Microelectronics Alliance, whose establishment would be coordinated by the Department of Commerce. We further recommend that the Semiconductor Research Corporation, the National Science Foundation Engineering Research Centers, and relevant elements of other federal programs be integrated into this consortia complex.

Using federal technology policy to strength the US microelectronics industry

DOE Office of Scientific and Technical Information (OSTI.GOV)

Gover, J.E.; Gwyn, C.W.

1994-07-01

A review of US and Japanese experiences with using microelectronics consortia as a tool for strengthening their respective industries reveals major differences. Japan has established catch-up consortia with focused goals. These consortia have a finite life targeted from the beginning, and emphasis is on work that supports or leads to product and process-improvement-driven commercialization. Japan`s government has played a key role in facilitating the development of consortia and has used consortia promote domestic competition. US consortia, on the other hand, have often emphasized long-range research with considerably less focus than those in Japan. The US consortia have searched for andmore » often made revolutionary technology advancements. However, technology transfer to their members has been difficult. Only SEMATECH has assisted its members with continuous improvements, compressing product cycles, establishing relationships, and strengthening core competencies. The US government has not been a catalyst nor provided leadership in consortia creation and operation. We propose that in order to regain world leadership in areas where US companies lag foreign competition, the US should create industry-wide, horizontal-vertical, catch-up consortia or continue existing consortia in the six areas where the US lags behind Japan -- optoelectronics, displays, memories, materials, packaging, and manufacturing equipment. In addition, we recommend that consortia be established for special government microelectronics and microelectronics research integration and application. We advocate that these consortia be managed by an industry-led Microelectronics Alliance, whose establishment would be coordinated by the Department of Commerce. We further recommend that the Semiconductor Research Corporation, the National Science Foundation Engineering Research Centers, and relevant elements of other federal programs be integrated into this consortia complex.« less

Encapsulation methods for organic electrical devices

DOEpatents

Blum, Yigal D.; Chu, William Siu-Keung; MacQueen, David Brent; Shi, Yijian

2013-06-18

The disclosure provides methods and materials suitable for use as encapsulation barriers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device encapsulated by alternating layers of a silicon-containing bonding material and a ceramic material. The encapsulation methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.

Excimer-laser-induced surface treatments on metal and ceramic materials: applications to automotive, aerospace, and microelectronic industries

NASA Astrophysics Data System (ADS)

Autric, Michel L.

1999-09-01

Surface treatments by laser irradiation can improve materials properties in terms of mechanical and physico- chemical behaviors, these improvements being related to the topography, the hardness, the microstructure, the chemical composition. Up to now, the use of excimer lasers for industrial applications remained marginal in spite of the interest related to the short wavelength (high photon energy and better energetic coupling with materials and reduced thermal effects in the bulk material). Up to now, the main limitations concerned the beam quality, the beam delivery, the gas handling and the relatively high investment cost. At this time, the cost of laser devices is going down and the ultraviolet radiation can be conducted through optical fibers. These two elements give new interest in using excimer laser for industrial applications. The main objective of this research program which we are involved in, is to underline some materials processing applications for automotive, aerospace or microelectronic industries for which it could be more interesting to use excimer lasers (minimized thermal effects). This paper concerns the modifications of the roughness, porosity, hardness, structure, phase, residual stresses, chemical composition of the surface of materials such as metallic alloys (aluminum, steel, cast iron, titanium, and ceramics (oxide, nitride, carbide,...) irradiated by KrF and XeCl excimer lasers.

Preliminary investigation of polystyrene/MoS{sub 2}-Oleylamine polymer composite for potential application as low-dielectric material in microelectronics

DOE Office of Scientific and Technical Information (OSTI.GOV)

Landi, Giovanni, E-mail: glandi@unisa.it; Department of Industrial Engineering, University of Salerno, Via G. Paolo II 132, 84084 Fisciano; Altavilla, Claudia

2015-12-17

Insulating materials play a vital role in the design and performance of electrical systems for both steady and transient state conditions. Among the other properties, also in this field, polymer nanocomposites promise to offer exciting improvements. Many studies in the last decade has witnessed significant developments in the area of nano-dielectric materials and significant effects of nano-scale fillers on electric, thermal and mechanical properties of polymeric materials have been observed. However, the developments of new and advanced materials to be used the miniaturization of electronic devices fabrication require extensive studies on electrical insulation characteristics of these materials before they canmore » be used in commercial systems. In this work, Polystyrene (PS) composites were prepared by the blend solution method using MoS{sub 2}@Oleylamine nanosheets as filler. The dielectric properties of the resulting comoposite have been investigated at 300K and in the frequency range between 1000 Hz and 1 MHz. The addition of the MoS{sub 2}@Oleylamine nanosheets leads to a decreasing of the relative dielectric constant and of the electrical conductivity measured in the voltage range between ±500V. Thanks to a possibility to tune the electrical permittivity with the control of MoS{sub 2} concentration, these materials could be used as a low-dielectric material in the microelectronics applications.« less

Apparatus for assembly of microelectronic devices

DOE Office of Scientific and Technical Information (OSTI.GOV)

Okandan, Murat; Nielson, Gregory N.; Cruz-Campa, Jose Luis

An apparatus including a carrier substrate configured to move a microelectronic device. The apparatus further includes a rotatable body configured to receive the microelectronic device. Additionally, the apparatus includes a second substrate configured to receive the microelectronic device from the rotatable body.

Correction of absorption-edge artifacts in polychromatic X-ray tomography in a scanning electron microscope for 3D microelectronics

DOE Office of Scientific and Technical Information (OSTI.GOV)

Laloum, D., E-mail: david.laloum@cea.fr; CEA, LETI, MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9; STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles

2015-01-15

X-ray tomography is widely used in materials science. However, X-ray scanners are often based on polychromatic radiation that creates artifacts such as dark streaks. We show this artifact is not always due to beam hardening. It may appear when scanning samples with high-Z elements inside a low-Z matrix because of the high-Z element absorption edge: X-rays whose energy is above this edge are strongly absorbed, violating the exponential decay assumption for reconstruction algorithms and generating dark streaks. A method is proposed to limit the absorption edge effect and is applied on a microelectronic case to suppress dark streaks between interconnections.

The design of radiation-hardened ICs for space - A compendium of approaches

NASA Technical Reports Server (NTRS)

Kerns, Sherra E.; Shafer, B. D; Rockett, L. R., Jr.; Pridmore, J. S.; Berndt, D. F.

1988-01-01

Several technologies, including bulk and epi CMOS, CMOS/SOI-SOS (silicon-on-insulator-silicon-on-sapphire), CML (current-mode logic), ECL (emitter-coupled logic), analog bipolar (JI, single-poly DI, and SOI) and GaAs E/D (enhancement/depletion) heterojunction MESFET, are discussed. The discussion includes the direct effects of space radiation on microelectronic materials and devices, how these effects are evidenced in circuit and device design parameter variations, the particular effects of most significance to each functional class of circuit, specific techniques for hardening high-speed circuits, design examples for integrated systems, including operational amplifiers and A/D (analog/digital) converters, and the computer simulation of radiation effects on microelectronic ISs.

Morphable 3D mesostructures and microelectronic devices by multistable buckling mechanics.

PubMed

Fu, Haoran; Nan, Kewang; Bai, Wubin; Huang, Wen; Bai, Ke; Lu, Luyao; Zhou, Chaoqun; Liu, Yunpeng; Liu, Fei; Wang, Juntong; Han, Mengdi; Yan, Zheng; Luan, Haiwen; Zhang, Yijie; Zhang, Yutong; Zhao, Jianing; Cheng, Xu; Li, Moyang; Lee, Jung Woo; Liu, Yuan; Fang, Daining; Li, Xiuling; Huang, Yonggang; Zhang, Yihui; Rogers, John A

2018-03-01

Three-dimensional (3D) structures capable of reversible transformations in their geometrical layouts have important applications across a broad range of areas. Most morphable 3D systems rely on concepts inspired by origami/kirigami or techniques of 3D printing with responsive materials. The development of schemes that can simultaneously apply across a wide range of size scales and with classes of advanced materials found in state-of-the-art microsystem technologies remains challenging. Here, we introduce a set of concepts for morphable 3D mesostructures in diverse materials and fully formed planar devices spanning length scales from micrometres to millimetres. The approaches rely on elastomer platforms deformed in different time sequences to elastically alter the 3D geometries of supported mesostructures via nonlinear mechanical buckling. Over 20 examples have been experimentally and theoretically investigated, including mesostructures that can be reshaped between different geometries as well as those that can morph into three or more distinct states. An adaptive radiofrequency circuit and a concealable electromagnetic device provide examples of functionally reconfigurable microelectronic devices.

Morphable 3D mesostructures and microelectronic devices by multistable buckling mechanics

NASA Astrophysics Data System (ADS)

Fu, Haoran; Nan, Kewang; Bai, Wubin; Huang, Wen; Bai, Ke; Lu, Luyao; Zhou, Chaoqun; Liu, Yunpeng; Liu, Fei; Wang, Juntong; Han, Mengdi; Yan, Zheng; Luan, Haiwen; Zhang, Yijie; Zhang, Yutong; Zhao, Jianing; Cheng, Xu; Li, Moyang; Lee, Jung Woo; Liu, Yuan; Fang, Daining; Li, Xiuling; Huang, Yonggang; Zhang, Yihui; Rogers, John A.

2018-03-01

Three-dimensional (3D) structures capable of reversible transformations in their geometrical layouts have important applications across a broad range of areas. Most morphable 3D systems rely on concepts inspired by origami/kirigami or techniques of 3D printing with responsive materials. The development of schemes that can simultaneously apply across a wide range of size scales and with classes of advanced materials found in state-of-the-art microsystem technologies remains challenging. Here, we introduce a set of concepts for morphable 3D mesostructures in diverse materials and fully formed planar devices spanning length scales from micrometres to millimetres. The approaches rely on elastomer platforms deformed in different time sequences to elastically alter the 3D geometries of supported mesostructures via nonlinear mechanical buckling. Over 20 examples have been experimentally and theoretically investigated, including mesostructures that can be reshaped between different geometries as well as those that can morph into three or more distinct states. An adaptive radiofrequency circuit and a concealable electromagnetic device provide examples of functionally reconfigurable microelectronic devices.

Liquid-Phase Laser Induced Forward Transfer for Complex Organic Inks and Tissue Engineering.

PubMed

Nguyen, Alexander K; Narayan, Roger J

2017-01-01

Laser induced forward transfer (LIFT) acts as a novel alternative to incumbent plotting techniques such as inkjet printing due to its ability to precisely deposit and position picoliter-sized droplets while being gentle enough to preserve sensitive structures within the ink. Materials as simple as screen printing ink to complex eukaryotic cells have been printed with applications spanning from microelectronics to tissue engineering. Biotechnology can benefit from this technique due to the efficient use of low volumes of reagent and the compatibility with a wide range of rheological properties. In addition, LIFT can be performed in a simple lab environment, not requiring vacuum or other extreme conditions. Although the basic apparatus is simple, many strategies exist to optimize the performance considering the ink and the desired pattern. The basic mechanism is similar between studies so the large number of variants can be summarized into a couple of categories and reported on with respect to their specific applications. In particular, precise and gentle deposition of complex molecules and eukaryotic cells represent the unique abilities of this technology. LIFT has demonstrated not only marked improvements in the quality of sensors and related medical devices over those manufactured with incumbent technologies but also great applicability in tissue engineering due to the high viability of printed cells.

Microelectronic bioinstrumentation systems

NASA Technical Reports Server (NTRS)

Ko, W. H.

1976-01-01

Progress was made in the development of an RF cage, a single channel RF powered ECG telemetry system, and a three channel RF powered ECG, aortic blood pressure, and body temperature telemetry system. Encapsulation materials for chronic implantation of electronic circuits in the body were also evaluated.

Flight Experiments for Living With a Star Space Environment Testbed (LWS-SET): Relationship to Technology

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Barth, Janet L.; Brewer, Dana A.

2003-01-01

This viewgraph presentation provides information on flight validation experiments for technologies to determine solar effects. The experiments are intended to demonstrate tolerance to a solar variant environment. The technologies tested are microelectronics, photonics, materials, and sensors.

Moore's law and the impact on trusted and radiation-hardened microelectronics.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ma, Kwok Kee

2011-12-01

In 1965 Gordon Moore wrote an article claiming that integrated circuit density would scale exponentially. His prediction has remained valid for more than four decades. Integrated circuits have changed all aspects of everyday life. They are also the 'heart and soul' of modern systems for defense, national infrastructure, and intelligence applications. The United States government needs an assured and trusted microelectronics supply for military systems. However, migration of microelectronics design and manufacturing from the United States to other countries in recent years has placed the supply of trusted microelectronics in jeopardy. Prevailing wisdom dictates that it is necessary to usemore » microelectronics fabricated in a state-of-the-art technology for highest performance and military system superiority. Close examination of silicon microelectronics technology evolution and Moore's Law reveals that this prevailing wisdom is not necessarily true. This presents the US government the possibility of a totally new approach to acquire trusted microelectronics.« less

Solventless sol-gel chemistry through ring-opening polymerization of bridged disilaoxacyclopentanes

DOE Office of Scientific and Technical Information (OSTI.GOV)

RAHIMIAN,KAMYAR; LOY,DOUGLAS A.

2000-04-04

Disilaoxacyclopentanes have proven to be excellent precursors to sol-gel type materials. These materials have shown promise as precursors for encapsulation and microelectronics applications. The polymers are highly crosslinked and are structurally similar to traditional sol-gels, but unlike typical sol-gels they are prepared without the use of solvents and water, they have low VOC's and show little shrinkage during processing.

Innovations in microelectronics and solid state at North Carolina Agricultural and Technical State University

NASA Technical Reports Server (NTRS)

Williams, L., Jr.

1977-01-01

Research in the following areas is described: (1) Characterization and applications of metallic oxide devices; (2) Electronic properties and energy conversion in organic amorphous semiconductors; (3) Material growth and characterization directed toward improving 3-5 heterojunction solar cells.

Source replenishment device for vacuum deposition

DOEpatents

Hill, Ronald A.

1988-01-01

A material source replenishment device for use with a vacuum deposition apparatus. The source replenishment device comprises an intermittent motion producing gear arrangement disposed within the vacuum deposition chamber. An elongated rod having one end operably connected to the gearing arrangement is provided with a multiarmed head at the opposite end disposed adjacent the heating element of the vacuum deposition apparatus. An inverted U-shaped source material element is releasably attached to the outer end of each arm member whereby said multiarmed head is moved to locate a first of said material elements above said heating element, whereupon said multiarmed head is lowered to engage said material element with the heating element and further lowered to release said material element on the heating element. After vaporization of said material element, second and subsequent material elements may be provided to the heating element without the need for opening the vacuum deposition apparatus to the atmosphere.

Source replenishment device for vacuum deposition

DOEpatents

Hill, R.A.

1986-05-15

A material source replenishment device for use with a vacuum deposition apparatus is described. The source replenishment device comprises an intermittent motion producing gear arrangement disposed within the vacuum deposition chamber. An elongated rod having one end operably connected to the gearing arrangement is provided with a multiarmed head at the opposite end disposed adjacent the heating element of the vacuum deposition apparatus. An inverted U-shaped source material element is releasably attached to the outer end of each arm member whereby said multiarmed head is moved to locate a first of said material elements above said heating element, whereupon said multiarmed head is lowered to engage said material element with the heating element and further lowered to release said material element on the heating element. After vaporization of said material element, second and subsequent material elements may be provided to the heating element without the need for opening the vacuum deposition apparatus to the atmosphere.

FBIS report. Science and technology: Europe/International, March 29, 1996

DOE Office of Scientific and Technical Information (OSTI.GOV)

NONE

1996-03-29

;Partial Contents: Advanced Materials (EU Project to Improve Production in Metal Matrix Compounds Noted, Germany: Extremely Hard Carbon Coating Development, Italy: Director of CNR Metallic Materials Institute Interviewed); Aerospace (ESA Considers Delays, Reductions as Result of Budget Cuts, Italy: Space Agency`s Director on Restructuring, Future Plans); Automotive, Transportation (EU: Clean Diesel Engine Technology Research Reviewed); Biotechnology (Germany`s Problems, Successes in Biotechnology Discussed); Computers (EU Europort Parallel Computing Project Concluded, Italy: PQE 2000 Project on Massively Parallel Systems Viewed); Defense R&D (France: Future Tasks of `Brevel` Military Intelligence Drone Noted); Energy, Environment (German Scientist Tests Elimination of Phosphates); Advanced Manufacturing (France:more » Advanced Rapid Prototyping System Presented); Lasers, Sensors, Optics (France: Strategy of Cilas Laser Company Detailed); Microelectronics (France: Simulation Company to Develop Microelectronic Manufacturing Application); Nuclear R&D (France: Megajoule Laser Plan, Cooperation with Livermore Lab Noted); S&T Policy (EU Efforts to Aid Small Companies` Research Viewed); Telecommunications (France Telecom`s Way to Internet).« less

Recent patents on Cu/low-k dielectrics interconnects in integrated circuits.

PubMed

Jiang, Qing; Zhu, Yong F; Zhao, Ming

2007-01-01

In past decades, the development of microelectronics has moved along with constant speed of scaling to maximize transistor density as driven by the need for electrical and functional performance. For further development, the propagation velocity of electromagnetic waves becomes increasingly important due to their unyielding constraints on interconnect delay. To minimize it, it was forced to the introduction of the Cu/low-k dielectric interconnects to very large scale integrated circuits (VLSI) where k denotes the dielectric constant. In addition, reliable barrier structures, which are the thinnest part among the device parts to maximize space availability for the actual Cu IWs, are required to prevent penetration of different materials. In light of the above statements, this review will focus recent patents and some studies on Cu interconnects including Cu interconnect wires, low-k dielectrics and related barrier materials as well manufacturing techniques in VLSI, which are one of the most essential concerns in microelectronic industry and decides the further development of VLSI. In addition, possible future development in this field is considered.

Trends in Dielectric Etch for Microelectronics Processing

NASA Astrophysics Data System (ADS)

Hudson, Eric A.

2003-10-01

Dielectric etch technology faces many challenges to meet the requirements for leading-edge microelectronics processing. The move to sub 100-nm device design rules increases the aspect ratios of certain features, imposes tighter restrictions on etched features' critical dimensions, and increases the density of closely packed arrays of features. Changes in photolithography are driving transitions to new photoresist materials and novel multilayer resist methods. The increasing use of copper metallization and low-k interlayer dielectric materials has introduced dual-damascene integration methods, with specialized dielectric etch applications. A common need is the selective removal of multiple layers which have very different compositions, while maintaining close control of the etched features' profiles. To increase productivity, there is a growing trend toward in-situ processing, which allows several films to be successively etched during a single pass through the process module. Dielectric etch systems mainly utilize capacitively coupled etch reactors, operating with medium-density plasmas and low gas residence time. Commercial technology development increasingly relies upon plasma diagnostics and modeling to reduce development cycle time and maximize performance.

Geckoprinting: assembly of microelectronic devices on unconventional surfaces by transfer printing with isolated gecko setal arrays

PubMed Central

Jeong, Jaeyoung; Kim, Juho; Song, Kwangsun; Autumn, Kellar; Lee, Jongho

2014-01-01

Developing electronics in unconventional forms provides opportunities to expand the use of electronics in diverse applications including bio-integrated or implanted electronics. One of the key challenges lies in integrating semiconductor microdevices onto unconventional substrates without glue, high pressure or temperature that may cause damage to microdevices, substrates or interfaces. This paper describes a solution based on natural gecko setal arrays that switch adhesion mechanically on and off, enabling pick and place manipulation of thin microscale semiconductor materials onto diverse surfaces including plants and insects whose surfaces are usually rough and irregular. A demonstration of functional ‘geckoprinted’ microelectronic devices provides a proof of concept of our results in practical applications. PMID:25056216

Encapsulation methods and dielectric layers for organic electrical devices

DOEpatents

Blum, Yigal D; Chu, William Siu-Keung; MacQueen, David Brent; Shi, Yijan

2013-07-02

The disclosure provides methods and materials suitable for use as encapsulation barriers and dielectric layers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device with a dielectric layer comprising alternating layers of a silicon-containing bonding material and a ceramic material. The methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.

Materials Characterization and Microelectronic Implementation of Metal-insulator Transition Materials and Phase Change Materials

DTIC Science & Technology

2015-03-26

appropriate. Group 16 (VI) contains the following elements: Oxygen (O), sulfur (S), selenium (Se), tellurium (Te), and polonium (Po). They are shown...below in Figure 33. S, Se, and Te are referred to as chalcogens, and their compounds are chalcogenides [68]. Polonium is excluded from the chalcogen...temperature dots and paint were placed on samples on the substrate. Temperature dots are typically used in the transportation of goods such as food in order

Description of a dust particle detection system and measurements of particulate contamination from shock, gate valve, and ion pump under ultrahigh vacuum conditions

NASA Astrophysics Data System (ADS)

Dorier, J.-L.; Hilleret, N.

1998-11-01

Dust particle contamination is known to be responsible for reduced quality and yield in microelectronic processing. However it may also limit the operation of particle accelerators as a result of beam lifetime reduction or enhanced field emission in radio-frequency accelerating cavities. Intrinsic dust contamination from sources such as valves or ion pumps has not yet been studied due to the inability of commercial particle counters to be able to detect across large cross sections under ultrahigh vacuum (UHV) conditions. This motivated the development of the dust particle detector described here which is able to quantify, in situ, the level of contamination on a representative part of a vacuum vessel. This system operates under UHV conditions and measures flashes of scattered light from free falling dust particles as they cross a thin laser light sheet across a 100 mm diam vacuum vessel. A calibration using microspheres of known diameter has allowed estimation of the particle size from the scattered signal amplitude. Measurements of particulate contamination generated by shocks onto the vessel walls are presented and determination of the height of origin of dust particles from their transit time across the irradiation sheet is discussed. Measurements of dust particle release right to operation of an all-metal gate valve are also presented in the form of time resolved measurements of dust occurrence during the open/close cycles of the valve, as well as histograms of the particle size distribution. A partial self-cleaning effect is witnessed during the first 10 operation cycles following valve installation. The operation of an ion pump has also been investigated and revealed that, in our conditions, particles were released only at pump startup.

Control concepts for active magnetic bearings

NASA Technical Reports Server (NTRS)

Siegwart, Roland; Vischer, D.; Larsonneur, R.; Herzog, R.; Traxler, Alfons; Bleuler, H.; Schweitzer, G.

1992-01-01

Active Magnetic Bearings (AMB) are becoming increasingly significant for various industrial applications. Examples are turbo-compressors, centrifuges, high speed milling and grinding spindles, vibration isolation, linear guides, magnetically levitated trains, vacuum and space applications. Thanks to the rapid progress and drastic cost reduction in power- and micro-electronics, the number of AMB applications is growing very rapidly. Industrial uses of AMBs leads to new requirements for AMB-actuators, sensor systems, and rotor dynamics. Especially desirable are new and better control concepts to meet demand such as low cost AMB, high stiffness, high performance, high robustness, high damping up to several kHz, vibration isolation, force-free rotation, and unbalance cancellation. This paper surveys various control concepts for AMBs and discusses their advantages and disadvantages. Theoretical and experimental results are presented.

Simulation of the synergistic low Earth orbit effects of vacuum thermal cycling, vacuum UV radiation, and atomic oxygen

NASA Technical Reports Server (NTRS)

Dever, Joyce A.; Degroh, Kim K.; Stidham, Curtis R.; Stueber, Thomas J.; Dever, Therese M.; Rodriguez, Elvin; Terlep, Judith A.

1992-01-01

In order to assess the low Earth orbit (LEO) durability of candidate space materials, it is necessary to use ground laboratory facilities which provide LEO environmental effects. A facility combining vacuum thermal cycling and vacuum ultraviolet (VUV) radiation has been designed and constructed at NASA Lewis Research Center for this purpose. This facility can also be operated without the VUV lamps. An additional facility can be used to provide VUV exposure only. By utilizing these facilities, followed by atomic oxygen exposure in an RF plasma asher, the effects of the individual vacuum thermal cycling and VUV environments can be compared to the effect of the combined vacuum thermal cycling/VUV environment on the atomic oxygen durability of materials. The synergistic effects of simulated LEO environmental conditions on materials were evaluated by first exposing materials to vacuum thermal cycling, VUV, and vacuum thermal cycling/VUV environments followed by exposure to atomic oxygen in an RP plasma asher. Candidate space power materials such as atomic oxygen protected polyimides and solar concentrator mirrors were evaluated using these facilities. Characteristics of the Vacuum Thermal Cycling/VUV Exposure Facility which simulates the temperature sequences and solar ultraviolet radiation exposure that would be experienced by a spacecraft surface in LEO are discussed. Results of durability evaluations of some candidate space power materials to the simulated LEO environmental conditions will also be discussed. Such results have indicated that for some materials, atomic oxygen durability is affected by previous exposure to thermal cycling and/or VUV exposure.

Microfabricated triggered vacuum switch

DOEpatents

Roesler, Alexander W [Tijeras, NM; Schare, Joshua M [Albuquerque, NM; Bunch, Kyle [Albuquerque, NM

2010-05-11

A microfabricated vacuum switch is disclosed which includes a substrate upon which an anode, cathode and trigger electrode are located. A cover is sealed over the substrate under vacuum to complete the vacuum switch. In some embodiments of the present invention, a metal cover can be used in place of the trigger electrode on the substrate. Materials used for the vacuum switch are compatible with high vacuum, relatively high temperature processing. These materials include molybdenum, niobium, copper, tungsten, aluminum and alloys thereof for the anode and cathode. Carbon in the form of graphitic carbon, a diamond-like material, or carbon nanotubes can be used in the trigger electrode. Channels can be optionally formed in the substrate to mitigate against surface breakdown.

Electrostatic Studies for the 2008 Hubble Service Repair Mission

NASA Technical Reports Server (NTRS)

Buhler, C. R.; Clements, J. S.; Calle, C. I.

2012-01-01

High vacuum triboelectric testing of space materials was required to identify possible Electrostatic Discharge (ESD) concerns for the astronauts in space during electronics board replacement on the Hubble Space Telescope. Testing under high vacuum conditions with common materials resulted in some interesting results. Many materials were able to charge to high levels which did not dissipate quickly even when grounded. Certain materials were able to charge up in contact with grounded metals while others were not. An interesting result was that like materials did not exchange electrostatic charge under high vacuum conditions. The most surprising experimental result is the lack of brush discharges from charged insulators under high vacuum conditions.

Editorial Conference Comments by the General Chairman

NASA Astrophysics Data System (ADS)

Hopkins, M. A.

2009-12-01

This paper tells about the comments given by the general chairman in the 2009 conference at Quebec City's Hilton and convection centre in the province of Quebec, canada. NSREC is recoginized as one of the premier international conference on radiation effects in electronic materials, devices and systems. Also the radiation effects in microelectronic devices and materials are discussed. Reliability effects in electronic device is also given in the conference.

Vacuum/Zero Net-Gravity Application for On-Orbit TPS Tile Repair

NASA Technical Reports Server (NTRS)

Harvey, Gale A.; Humes, Donald H.; Siochi, Emilie J.

2004-01-01

The Orbiter Columbia catastrophically failed during reentry February 1, 2003. All Space Shuttle flights were suspended, including logistics support for the International Space Station. NASA Langley Research Center s (LaRC) Structures and Materials Competency is performing characterizations of candidate materials for on-orbit repair of orbiter Thermal Protection System (TPS) tiles to support Return-to-Flight activities led by Johnson Space Center (JSC). At least ten materials properties or attributes (adhesion to damage site, thermal protection, char/ash strength, thermal expansion, blistering, flaming, mixing ease, application in vacuum and zero gravity, cure time, shelf or storage life, and short-term outgassing and foaming) of candidate materials are of interest for on-orbit repair. This paper reports application in vacuum and zero net-gravity (for viscous flow repair materials). A description of the test apparatus and preliminary results of several candidate materials are presented. The filling of damage cavities is different for some candidate repair materials in combined vacuum and zero net-gravity than in either vacuum or zero net-gravity alone.

Vacuum/Zero Net-Gravity Application for On-Orbit TPS Tile Repair

NASA Technical Reports Server (NTRS)

Harvey, Gale A.; Humes, Donald H.; Siochi, Emilie J.

2004-01-01

The Orbiter Columbia catastrophically failed during reentry February 1, 2003. All space Shuttle flights were suspended, including logistics support for the International Space Station. NASA LaRC s Structures and Materials Competency is performing characterizations of candidate materials for on-orbit repair of orbiter Thermal Protection System (TPS) tiles to support Return-to-Flight activities led by JSC. At least ten materials properties or attributes (adhesion to damage site, thermal protection, char/ash strength, thermal expansion, blistering, flaming, mixing ease, application in vacuum and zero gravity, cure time, shelf or storage life, and short-term outgassing and foaming) of candidate materials are of interest for on-orbit repair. This paper reports application in vacuum and zero net-gravity (for viscous flow repair materials). A description of the test apparatus and preliminary results of several candidate materials are presented. The filling of damage cavities is different for some candidate repair materials in combined vacuum and zero net-gravity than in either vacuum or zero net- gravity alone.

Method and apparatus for in-cell vacuuming of radiologically contaminated materials

DOEpatents

Spadaro, Peter R.; Smith, Jay E.; Speer, Elmer L.; Cecconi, Arnold L.

1987-01-01

A vacuum air flow operated cyclone separator arrangement for collecting, handling and packaging loose contaminated material in accordance with acceptable radiological and criticality control requirements. The vacuum air flow system includes a specially designed fail-safe prefilter installed upstream of the vacuum air flow power supply. The fail-safe prefilter provides in-cell vacuum system flow visualization and automatically reduces or shuts off the vacuum air flow in the event of an upstream prefilter failure. The system is effective for collecting and handling highly contaminated radiological waste in the form of dust, dirt, fuel element fines, metal chips and similar loose material in accordance with radiological and criticality control requirements for disposal by means of shipment and burial.

Multifunctional Materials: Transparent Reactive Armor Utilizing Single-Walled Carbon Nanotube Frameworks

DTIC Science & Technology

2010-03-03

with white- light femtosecond pulses. Applied Surface Science 253, 6305-6309 (2007). 22. Komarov, P. L., Burzo, M. G., Kaytaz, G. & Raad , P. E...Microelectronics Journal 34, 1115-1118 (2003). 23. Kulish, V. V., Lage, J. L., Komarov, P. L. & Raad , P. E. A fractional-diffusion theory for

Contamination control in hybrid microelectronic modules. Identification of critical process and contaminants, part 1

NASA Technical Reports Server (NTRS)

Himmel, R. P.

1975-01-01

Hybrid processes, handling procedures, and materials were examined to identify the critical process steps in which contamination is most likely to occur, to identify the particular contaminants associated with these critical steps, and to propose method for the control of these contaminants.

Tribological properties of polymer films and solid bodies in a vacuum environment

NASA Technical Reports Server (NTRS)

Fusaro, Robert L.

1988-01-01

The tribological properties of ten different polymer based materials were evaluated in a vacuum environment to determine their suitability for possible lubrication applications in a space environment, such as might be encountered on the proposed Space Station. A pin-on-disk tribometer was used and the polymer materials were evaluated either as solid body disks or as films applied to 440C HT stainless steel disks. A 440C HT stainless steel hemispherically tipped pin was slid against the polymer materials. For comparison, similar tests were conducted in a controlled air atmosphere of 50 percent relative humidity air. In most instances, the polymer materials lubricated much better under vacuum conditions than in air. Thus, several of the materials show promise as lubricants for vacuum applications. Friction coefficients of 0.05 or less and polymer material wear rates of up to 2 orders of magnitude less than in air were obtained. One material showed considerable promise as a traction drive material. Relative high friction coefficients (0.36 to 0.52) and reasonably low wear rates were obtained in vacuum.

Tribological properties of polymer films and solid bodies in a vacuum environment

NASA Technical Reports Server (NTRS)

Fusaro, Robert L.

1987-01-01

The tribological properties of ten different polymer based materials were evaluated in a vacuum environment to determine their suitability for possible lubrication applications in a space environment, such as might be encountered on the proposed space station. A pin-on-disk tribometer was used and the polymer materials were evaluated either as solid body disks or as films applied to 440C HT stainless steel disks. A 440C HT stainless steel hemispherically tipped pin was slid against the polymer materials. For comparison, similar tests were conducted in a controlled air atmosphere of 50 percent relative humidity air. In most instances, the polymer materials lubricated much better under vacuum conditions than in air. Thus, several of the materials show promise as lubricants for vacuum applications. Friction coefficients of 0.05 or less and polymer material wear rates of up to 2 orders of magnitude less than in air were obtained. One material showed considerable promise as a traction drive material. Relatively high friction coefficients (0.36 to 0.52) and reasonably low wear rates were obtained in vacuum.

Vacuum deposition and curing of liquid monomers

DOEpatents

Affinito, J.D.

1993-11-09

The present invention is the formation of solid polymer layers under vacuum. More specifically, the present invention is the use of standard polymer layer-making equipment that is generally used in an atmospheric environment in a vacuum, and degassing the monomer material prior to injection into the vacuum. Additional layers of polymer or metal may be vacuum deposited onto solid polymer layers. Formation of polymer layers under a vacuum improves material and surface characteristics, and subsequent quality of bonding to additional layers. Further advantages include use of less to no photoinitiator for curing, faster curing, fewer impurities in the polymer electrolyte, as well as improvement in material properties including no trapped gas resulting in greater density, and reduced monomer wetting angle that facilitates spreading of the monomer and provides a smoother finished surface.

Vacuum deposition and curing of liquid monomers

DOEpatents

Affinito, J.D.

1995-03-07

The present invention is the formation of solid polymer layers under vacuum. More specifically, the present invention is the use of ``standard`` polymer layer-making equipment that is generally used in an atmospheric environment in a vacuum, and degassing the monomer material prior to injection into the vacuum. Additional layers of polymer or metal or oxide may be vacuum deposited onto solid polymer layers. Formation of polymer layers under a vacuum improves material and surface characteristics, and subsequent quality of bonding to additional layers. Further advantages include use of less to no photoinitiator for curing, faster curing, fewer impurities in the polymer electrolyte, as well as improvement in material properties including no trapped gas resulting in greater density, and reduced monomer wetting angle that facilitates spreading of the monomer and provides a smoother finished surface.

Vacuum deposition and curing of liquid monomers

DOEpatents

Affinito, John D.

1993-01-01

The present invention is the formation of solid polymer layers under vacuum. More specifically, the present invention is the use of "standard" polymer layer-making equipment that is generally used in an atmospheric environment in a vacuum, and degassing the monomer material prior to injection into the vacuum. Additional layers of polymer or metal may be vacuum deposited onto solid polymer layers. Formation of polymer layers under a vacuum improves material and surface characteristics, and subsequent quality of bonding to additional layers. Further advantages include use of less to no photoinitiator for curing, faster curing, fewer impurities in the polymer electrolyte, as well as improvement in material properties including no trapped gas resulting in greater density, and reduced monomer wetting angle that facilitates spreading of the monomer and provides a smoother finished surface.

Vacuum deposition and curing of liquid monomers apparatus

DOEpatents

Affinito, John D.

1996-01-01

The present invention is the formation of solid polymer layers under vacuum. More specifically, the present invention is the use of "standard" polymer layer-making equipment that is generally used in an atmospheric environment in a vacuum, and degassing the monomer material prior to injection into the vacuum. Additional layers of polymer or metal or oxide may be vacuum deposited onto solid polymer layers. Formation of polymer layers under a vacuum improves material and surface characteristics, and subsequent quality of bonding to additional layers. Further advantages include use of less to no photoinitiator for curing, faster curing, fewer impurities in the polymer electrolyte, as well as improvement in material properties including no trapped gas resulting in greater density, and reduced monomer wetting angle that facilitates spreading of the monomer and provides a smoother finished surface.

Vacuum deposition and curing of liquid monomers

DOEpatents

Affinito, John D.

1995-01-01

The present invention is the formation of solid polymer layers under vacuum. More specifically, the present invention is the use of "standard" polymer layer-making equipment that is generally used in an atmospheric environment in a vacuum, and degassing the monomer material prior to injection into the vacuum. Additional layers of polymer or metal or oxide may be vacuum deposited onto solid polymer layers. Formation of polymer layers under a vacuum improves material and surface characteristics, and subsequent quality of bonding to additional layers. Further advantages include use of less to no photoinitiator for curing, faster curing, fewer impurities in the polymer electrolyte, as well as improvement in material properties including no trapped gas resulting in greater density, and reduced monomer wetting angle that facilitates spreading of the monomer and provides a smoother finished surface.

Modified low-temperture direct bonding method for vacuum microelectronics application

NASA Astrophysics Data System (ADS)

Ju, Byeong-Kwon; Lee, Duck-Jung; Choi, Woo-Beom; Lee, Yun-Hi; Jang, Jin; Lee, Kwang-Bae; Oh, Myung-Hwan

1997-06-01

This paper presents the process and experimental results for the improved silicon-to-glass bonding using silicon direct bonding (SDB) followed by anodic bonding. The initial bonding between glass and silicon was caused by the hydrophilic surfaces of silicon-glass ensemble using SDB method. Then the initially bonded specimen had to be strongly bonded by anodic bonding process. The effects of the bonding process parameters on the interface energy were investigated as functions of the bonding temperature and voltage. We found that the specimen which was bonded using SDB process followed by anodic bonding process had higher interface energy than one using anodic bonding process only. The main factor contributing to the higher interface energy in the glass-to-silicon assemble bonded by SDB followed by anodic bonding was investigated by secondary ion mass spectroscopy analysis.

Effects of long duration exposure to simulated space environment on nonmetallic materials properties

NASA Technical Reports Server (NTRS)

Peacock, C. L., Jr.; Whitaker, A. F.

1983-01-01

Nonmetallic materials specimens from the Viking program were tested in situ invacuo after continuous thermal vacuum exposure from 1971/1972 to the present. Eleven tests were done on appropriate specimens of 30 materials; however, no single material received all the tests. Some specimens also were exposed to 1 or 2.5 MeV electrons at differing fluences before testing. Baseline exposure data is reported for graphite/epoxy specimens that were exposed to vacuum since 1974. These materials were transferred to the thermal vacuum storage facility for future in situ testing and irradiation. Thin G/E specimens were tensile tested after thermal-vacuum cycling exposure. Photomicrographic examinations and SEM analyses were done on the failed specimens.

Goals, achievements of microelectronics program

NASA Astrophysics Data System (ADS)

Schronk, L.

1985-05-01

Besides reviewing the objectives of the government's microelectronics program, the Microelectronics Enterprise, the production of metal oxide semiconductors and bipolar integrated-circuit chips, specific research and development results to date, and the plans for future activity are discussed. Marketing and domestic demand are discussed.

Microcomputer Materials from MEP. An Annotated Directory of Packages of Interest to Further Education. An Occasional Paper.

ERIC Educational Resources Information Center

Gilbert, Leslie

Designed to disseminate information to the post-school sector of United Kingdom education, this directory provides information on 50 microcomputer software packages developed by the Microelectronics Education Program (MEP) and available through educational publishers. Subject areas represented include accountancy, biology, business education,…

Breakthrough: micro-electronic photovoltaics

ScienceCinema

Okandan, Murat; Gupta, Vipin

2018-01-16

Sandia developed tiny glitter-sized photovoltaic (PV) cells that could revolutionize solar energy collection. The crystalline silicon micro-PV cells will be cheaper and have greater efficiencies than current PV collectors. Micro-PV cells require relatively little material to form well-controlled, highly efficient devices. Cell fabrication uses common microelectric and micro-electromechanical systems (MEMS) techniques.

Chemical Engineering Curricula for the Future: Synopsis of Proceedings of a U.S.-India Conference, January, 1988.

ERIC Educational Resources Information Center

Ramkrishna, D.; And Others

1989-01-01

This is a summary of a seminar for changing the undergraduate chemical engineering curriculum in India. Identifies and describes biotechnology, materials for structural and microelectronic catalysis, and new separation processes as emerging areas. Evaluates the current curriculum, including basic science, engineering lore, chemical engineering,…

2011 NRL REVIEW

DTIC Science & Technology

2011-01-01

other mechanism ? What accelerates the solar wind? What are the near- Sun plasma properties (particle density, magnetic field)? Does the solar wind come...microstructure character iza tion, elec tronic ceramics, solid-state physics, fiber optics, electro-optics, microelectronics, fracture mechan ics...computational fluid mechanics , experi mental structural mechanics , solid me chan ics, elastic/plastic fracture mechanics , materials, finite-element

A Brief History of ... Semiconductors

ERIC Educational Resources Information Center

Jenkins, Tudor

2005-01-01

The development of studies in semiconductor materials is traced from its beginnings with Michael Faraday in 1833 to the production of the first silicon transistor in 1954, which heralded the age of silicon electronics and microelectronics. Prior to the advent of band theory, work was patchy and driven by needs of technology. However, the arrival…

A novel three-jet microreactor for localized metal-organic chemical vapour deposition of gallium arsenide: design and simulation

NASA Astrophysics Data System (ADS)

Konakov, S. A.; Krzhizhanovskaya, V. V.

2016-08-01

We present a novel three-jet microreactor design for localized deposition of gallium arsenide (GaAs) by low-pressure Metal-Organic Chemical Vapour Deposition (MOCVD) for semiconductor devices, microelectronics and solar cells. Our approach is advantageous compared to the standard lithography and etching technology, since it preserves the nanostructure of the deposited material, it is less time-consuming and less expensive. We designed two versions of reactor geometry with a 10-micron central microchannel for precursor supply and with two side jets of a dilutant to control the deposition area. To aid future experiments, we performed computational modeling of a simplified-geometry (twodimensional axisymmetric) microreactor, based on Navier-Stokes equations for a laminar flow of chemically reacting gas mixture of Ga(CH3)3-AsH3-H2. Simulation results show that we can achieve a high-rate deposition (over 0.3 μm/min) on a small area (less than 30 μm diameter). This technology can be used in material production for microelectronics, optoelectronics, photovoltaics, solar cells, etc.

Spontaneous and strong multi-layer graphene n-doping on soda-lime glass and its application in graphene-semiconductor junctions

DOE PAGES

Dissanayake, D. M. N. M.; Ashraf, A.; Dwyer, D.; ...

2016-02-12

Scalable and low-cost doping of graphene could improve technologies in a wide range of fields such as microelectronics, optoelectronics, and energy storage. While achieving strong p-doping is relatively straightforward, non-electrostatic approaches to n-dope graphene, such as chemical doping, have yielded electron densities of 9.5 × 10 12 e/cm 2 or below. Furthermore, chemical doping is susceptible to degradation and can adversely affect intrinsic graphene’s properties. Here we demonstrate strong (1.33 × 10 13 e/cm 2), robust, and spontaneous graphene n-doping on a soda-lime-glass substrate via surface-transfer doping from Na without any external chemical, high-temperature, or vacuum processes. Remarkably, the n-dopingmore » reaches 2.11 × 10 13 e/cm 2 when graphene is transferred onto a p-type copper indium gallium diselenide (CIGS) semiconductor that itself has been deposited onto soda-lime-glass, via surface-transfer doping from Na atoms that diffuse to the CIGS surface. Using this effect, we demonstrate an n-graphene/p-semiconductor Schottky junction with ideality factor of 1.21 and strong photo-response. As a result, the ability to achieve strong and persistent graphene n-doping on low-cost, industry-standard materials paves the way toward an entirely new class of graphene-based devices such as photodetectors, photovoltaics, sensors, batteries, and supercapacitors.« less

Vacuum deposition and curing of liquid monomers apparatus

DOEpatents

Affinito, J.D.

1996-08-20

The present invention is the formation of solid polymer layers under vacuum. More specifically, the present invention is the use of ``standard`` polymer layer-making equipment that is generally used in an atmospheric environment in a vacuum, and degassing the monomer material prior to injection into the vacuum. Additional layers of polymer or metal or oxide may be vacuum deposited onto solid polymer layers. Formation of polymer layers under a vacuum improves material and surface characteristics, and subsequent quality of bonding to additional layers. Further advantages include use of less to no photoinitiator for curing, faster curing, fewer impurities in the polymer electrolyte, as well as improvement in material properties including no trapped gas resulting in greater density, and reduced monomer wetting angle that facilitates spreading of the monomer and provides a smoother finished surface. 3 figs.

Sealing Materials for Use in Vacuum at High Temperatures

NASA Technical Reports Server (NTRS)

Pettit, Donald R.; Camarda, Charles J.; Lee Vaughn, Wallace

2012-01-01

Sealing materials that can be applied and left in place in vacuum over a wide range of temperatures (especially temperatures of a few thousand degrees Celsius) have been conceived and investigated for potential utility in repairing thermal-protection tiles on the space shuttles in orbit before returning to Earth. These materials are also adaptable to numerous terrestrial applications that involve vacuum processing and/or repair of structures that must withstand high temperatures. These materials can be formulated to have mechanical handling characteristics ranging from almost freely flowing liquid-like consistency through paste-like consistency to stiff puttylike consistency, and to retain these characteristics in vacuum until heated to high curing temperatures. A sealing material of this type can be formulated to be used in any of several different ways for example, to be impregnated into a high-temperature-fabric patch, impregnated into a high-temperature-fabric gasket for sealing a patch, applied under a patch, or applied alone in the manner of putty or wallboard compound. The sealing material must be formulated to be compatible with, and adhere to, the structural material(s) to be repaired. In general, the material consists of a vacuum-compatible liquid containing one or more dissolved compound(s) and/or mixed with suspended solid particles. Depending on the intended application, the liquid can be chosen to be of a compound that can remain in place in vacuum for a time long enough to be useful, and/or to evaporate or decompose in a controlled way to leave a useful solid residue behind. The evaporation rate is determined by proper choice of vapor pressure, application of heat, and/or application of ultraviolet light or other optical radiation. The liquid chosen for the original space shuttle application is a commercial silicone vacuum-pump oil.

The Legacy of the Microelectronics Education Programme.

ERIC Educational Resources Information Center

Thorne, Michael

1987-01-01

Describes the Microelectronics Education Programme (MEP), a plan developed to help British secondary school students learn about microcomputers and the role of technology in society, and its successor, the Microelectronics Support Unit (MESU). Highlights include curriculum development, teacher training, computer assisted instruction and the…

Educational Implications of Microelectronics and Microprocessors.

ERIC Educational Resources Information Center

Harris, N. D. C., Ed.

This conference report explores microelectronic technology, its effect on educational methods and objectives, and its implications for educator responsibilities. Two main areas were considered: the significance of the likely impact of the large scale introduction of microprocessors and microelectronics on commercial and industrial processes, the…

Marketing NASA Langley Polymeric Materials

NASA Technical Reports Server (NTRS)

Flynn, Diane M.

1995-01-01

A marketing tool was created to expand the knowledge of LaRC developed polymeric materials, in order to facilitate the technology transfer process and increase technology commercialization awareness among a non-technical audience. The created brochure features four materials, LaRC-CP, LaRC-RP46, LaRC-SI, and LaRC-IA, and highlights their competitive strengths in potential commercial applications. Excellent opportunities exist in the $40 million per year microelectronics market and the $6 billion adhesives market. It is hoped that the created brochure will generate inquiries regarding the use of the above materials in markets such as these.

Review of Graphene as a Solid State Diffusion Barrier.

PubMed

Morrow, Wayne K; Pearton, Stephen J; Ren, Fan

2016-01-06

Conventional thin-film diffusion barriers consist of 3D bulk films with high chemical and thermal stability. The purpose of the barrier material is to prevent intermixing or penetration from the two materials that encase it. Adhesion to both top and bottom materials is critical to the success of the barrier. Here, the effectiveness of a single atomic layer of graphene as a solid-state diffusion barrier for common metal schemes used in microelectronics is reviewed, and specific examples are discussed. Initial studies of electrical contacts to graphene show a distinct separation in behavior between metallic groups that strongly or weakly bond to it. The two basic classes of metal reactions with graphene are either physisorbed metals, which bond weakly with graphene, or chemisorbed metals, which bond strongly to graphene. For graphene diffusion barrier testing on Si substrates, an effective barrier can be achieved through the formation of a carbide layer with metals that are chemisorbed. For physisorbed metals, the barrier failure mechanism is loss of adhesion at the metal–graphene interface. A graphene layer encased between two metal layers, in certain cases, can increase the binding energy of both films with graphene, however, certain combinations of metal films are detrimental to the bonding with graphene. While the prospects for graphene's future as a solid-state diffusion barrier are positive, there are open questions, and areas for future research are discussed. A better understanding of the mechanisms which influence graphene's ability to be an effective diffusion barrier in microelectronic applications is required, and additional experiments are needed on a broader range of metals, as well as common metal stack contact structures used in microelectronic applications. The role of defects in the graphene is also a key area, since they will probably influence the barrier properties. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Nanocharacterization Challenges in a Changing Microelectronics Landscape

NASA Astrophysics Data System (ADS)

Brilloüt, Michel

2011-11-01

As the microelectronics industry enters the "nano"-era new challenges emerge. Traditional scaling of the MOS transistor faces major obstacles in fulfilling "Moore's law". New features like strain and new materials (e.g. high k—metal gate stack) are introduced in order to sustain performance increases. For a better electrostatic control, devices will use the third dimension, e.g., in gate-all-around nanowire structures. Due to the escalating cost and complexity of sub-28 nm technologies fewer industrial players can afford the development and production of advanced CMOS processes and many companies acknowledge the fact that the value in products can also be obtained in using more diversified non-digital technologies (the so-called "More-than-Moore" domain). This evolving landscape brings new requirements—discussed in this paper—in terms of physical characterization of technologies and devices.

Broadband image sensor array based on graphene-CMOS integration

NASA Astrophysics Data System (ADS)

Goossens, Stijn; Navickaite, Gabriele; Monasterio, Carles; Gupta, Shuchi; Piqueras, Juan José; Pérez, Raúl; Burwell, Gregory; Nikitskiy, Ivan; Lasanta, Tania; Galán, Teresa; Puma, Eric; Centeno, Alba; Pesquera, Amaia; Zurutuza, Amaia; Konstantatos, Gerasimos; Koppens, Frank

2017-06-01

Integrated circuits based on complementary metal-oxide-semiconductors (CMOS) are at the heart of the technological revolution of the past 40 years, enabling compact and low-cost microelectronic circuits and imaging systems. However, the diversification of this platform into applications other than microcircuits and visible-light cameras has been impeded by the difficulty to combine semiconductors other than silicon with CMOS. Here, we report the monolithic integration of a CMOS integrated circuit with graphene, operating as a high-mobility phototransistor. We demonstrate a high-resolution, broadband image sensor and operate it as a digital camera that is sensitive to ultraviolet, visible and infrared light (300-2,000 nm). The demonstrated graphene-CMOS integration is pivotal for incorporating 2D materials into the next-generation microelectronics, sensor arrays, low-power integrated photonics and CMOS imaging systems covering visible, infrared and terahertz frequencies.

A Survey of Current Trends in Master's Programs in Microelectronics

ERIC Educational Resources Information Center

Bozanic, Mladen; Sinha, Saurabh

2018-01-01

Contribution: This paper brings forward a paradigm shift in microelectronic and nanoelectronic engineering education. Background: An increasing number of universities are offering graduate-level electrical engineering degree programs with multi-disciplinary Master's-level specialization in microelectronics or nanoelectronics. The paradigm shift…

Microelectronics in Education

ERIC Educational Resources Information Center

Orton, Richard J. J.

2011-01-01

The history and meaning of the term "microelectronics" is reviewed, followed by a discussion of the key inventions of the Intel microprocessor in 1971 and the Texas Instruments electronic pocket calculator in 1975. The six characteristic features of microelectronic components are then defined. The UK prime minister Jim Callaghan's…

Vacuum stability requirements of polymeric material for spacecraft application

NASA Technical Reports Server (NTRS)

Craig, J. W.

1984-01-01

The purpose of this document is to establish outgassing requirements and test guidelines for polymeric materials used in the space thermal/vacuum environment around sensitive optical or thermal control surfaces. The scope of this document covers the control of polymeric materials used near or adjacent to optical or thermal control surfaces that are exposed to the thermal/vacuum environment of space. This document establishes the requirements and defines the test method to evaluate polymeric materials used in the vicinity of these surfaces in space applications.

Ion projection lithography: November 2000 status and sub-70-nm prospects

NASA Astrophysics Data System (ADS)

Kaesmaier, Rainer; Wolter, Andreas; Loeschner, Hans; Schunck, Stefan

2000-10-01

Among all next generation lithography (NGL) options Ion Projection Lithography (IPL) offers the smallest (particle) wavelength of 5x10- 5nm (l00keV Helium ions). Thus, 4x reduction ion-optics has diffraction limits <3nm even when using a numerical aperture as low as NAequals10-5. As part of the European MEDEA IPL project headed by Infineon Technologies wide field ion-optics have been designed by IMS- Vienna with predicted resolution of 50nm within a 12.5mm exposure field. The ion-optics part of the PDT tool (PDT-IOS) has been realized and assembled. In parallel to the PDT-IOS effort, at Leica Jena a test bench for a vertical vacuum 300mm-wafer stage has been realized. Operation of magnetic bearing supported stage movement has already been demonstrated. As ASML vacuum compatible optical wafer alignment system, with 3nm(3(sigma) ) precision demonstrated in air, has been integrated to this wafer test bench system recently. Parallel to the IPL tool development, Infineon Technologies Mask House and the Institute for Microelectronics Stuttgart are intensively working on the development of IPL stencil masks with success in producing 150mm and 200mm stencil masks as reported elsewhere. This paper is focused on information about the status of the PDT-IOS tool.

Preparation of W/CuCrZr mono-block test mock-up using vacuum brazing technique

NASA Astrophysics Data System (ADS)

Premjit Singh, K.; Khirwadkar, S.; Bhope, Kedar; Patel, Nikunj; Mokaria, Prakash

2017-04-01

Development of the joining for W/CuCrZr mono-block PFC test mock-up is an interesting area in Fusion R&D. W/Cu bimetallic material has been prepared using OFHC Copper casting approach on the radial surface of W mono-block tile surface. The W/Cu bimetallic material has been joined with CuCrZr tube (heat sink) material with the vacuum brazing route. Vacuum brazing of W/Cu-CuCrZr has been performed @ 970°C for 10 min using NiCuMn-37 filler material under deep vacuum environment (10-6 mbar). Graphite fixture was used for OFHC Copper casting and vacuum brazing experiments. The joint integrity of W/Cu-CuCrZr mono-block mock-up of W/Cu and Cu-CuCrZr interface has been checked using ultrasonic immersion technique. The result of the experimental work is presented in the paper.

FOREWORD: Proceedings of the 39th International Microelectronics and Packaging IMAPS Poland Conference

NASA Astrophysics Data System (ADS)

Jasiński, Piotr; Górecki, Krzysztof; Bogdanowicz, Robert

2016-01-01

These proceedings are a collection of the selected articles presented at the 39th International Microelectronics and Packaging IMAPS Poland Conference, held in Gdansk, Poland on September 20-23, 2015 (IMAPS Poland 2015). The conference has been held under the scientific patronage of the International Microelectronics and Packaging Society Poland Chapter and the Committee of Electronics and Telecommunication, Polish Academy of Science and jointly hosted by the Gdansk University of Technology, Faculty of Electronics, Telecommunication and Informatics (GUT) and the Gdynia Maritime University, Faculty of Electrical Engineering (GMU). The IMAPS Poland conference series aims to advance interdisciplinary scientific information exchange and the discussion of the science and technology of advanced electronics. The IMAPS Poland 2015 conference took place in the heart of Gdansk, two minutes walking distance from the beach. The surroundings and location of the venue guaranteed excellent working and leisure conditions. The three-day conference highlighted invited talks by outstanding scientists working in important areas of electronics and electronic material science. The eight sessions covered areas in the fields of electronics packaging, interconnects on PCB, Low Temperature Co-fired Ceramic (LTCC), MEMS devices, transducers, sensors and modelling of electronic devices. The conference was attended by 99 participants from 11 countries. The conference schedule included 18 invited presentations and 78 poster presentations.

Microelectronics and Special Education. CET/MEP Information Sheet.

ERIC Educational Resources Information Center

Council for Educational Technology, London (England).

Used as an additional aid by the teacher, microelectronics can assist mentally and physically handicapped children to meet educational objectives that have been specifically agreed upon for the individual child. Microelectronics can help deaf children develop speech production, communication skills, and grammar and sentence construction;…

Microelectronics and Music Education.

ERIC Educational Resources Information Center

Hofstetter, Fred T.

1979-01-01

This look at the impact of microelectronics on computer-assisted instruction (CAI) in music notes trends toward new applications and lower costs. Included are: a rationale for CAI in music, a list of sample programs, comparison of five microelectronic music systems, PLATO cost projections, and sources of further information. (SJL)

Microelectronics in the Curriculum--The Science Teacher's Contribution.

ERIC Educational Resources Information Center

Association for Science Education, Cambridge (England).

Rapid advances in microelectronics over the past few years have generally been beneficial, but they have also created some problems, and questions must be asked about the philosophy for including aspects of the new technology in the school curriculum. This statement, prepared by the Microelectronics and Science Education Subcommittee of the…

Vacuum Gas Tungsten Arc Welding

NASA Technical Reports Server (NTRS)

Weeks, J. L.; Todd, D. T.; Wooten, J. R.

1997-01-01

A two-year program investigated vacuum gas tungsten arc welding (VGTAW) as a method to modify or improve the weldability of normally difficult-to-weld materials. After a vacuum chamber and GTAW power supply were modified, several difficult-to-weld materials were studied and key parameters developed. Finally, Incoloy 903 weld overlays were produced without microfissures.

Cleaning Spectralon(TM) To Maintain Reflectance Properties

NASA Technical Reports Server (NTRS)

Stiegman, Albert; Bruegge, Carl; Plett, Gary

1996-01-01

Hydrocarbon impurities removed and stability of Spectralon(TM) towards ultraviolet and vacuum-ultraviolet radiation greatly enhanced by baking material at 90 degrees C for 24 h in vacuum of 10 to negative 5th power torr. After vacuum bake, material handled with white cotton, lint-free gloves in clean environment (preferably cleanroom). As material has tendency to reabsorb volatile organic compounds, stored and transported only in clean, air-tight (preferably glass or oil-free metal) containers.

Method to separate and determine the amount of ejecta produced in a second-shock material-fragmentation event

NASA Astrophysics Data System (ADS)

Buttler, W. T.; Hixson, R. S.; King, N. S. P.; Olson, R. T.; Rigg, P. A.; Zellner, M. B.; Routley, N.; Rimmer, A.

2007-04-01

The authors consider a mathematical method to separate and determine the amount of ejecta produced in a second-shock material-fragmentation process. The technique is theoretical and assumes that a material undergoing a shock release at a vacuum interface ejects particulate material or fragments as the initial shock unloads and reflects at the vacuum-surface interface. In this case it is thought that the reflected shock may reflect again at the source of the shock and return to the vacuum-surface interface and eject another amount of fragments or particulate material.

Microstructure-Evolution and Reliability Assessment Tool for Lead-Free Component Insertion in Army Electronics

DTIC Science & Technology

2008-10-01

provide adequate means for thermal heat dissipation and cooling. Thus electronic packaging has four main functions [1]: • Signal distribution which... dissipation , involving structural and materials consideration. • Mechanical, chemical and electromagnetic protection of components and... nature when compared to phenomenological models. Microelectronic packaging industry spends typically several months building and reliability

Advanced Electronic Technology

DTIC Science & Technology

1977-11-15

Electronics 15 III. Materials Research 15 TV. Microelectronics 16 V. Surface- Wave Technology 16 DATA SYSTEMS DIVISION 2 INTRODUCTION This...Processing Digital Voice Processing Packet Speech Wideband Integrated Voice/Data Technology Radar Signal Processing Technology Nuclear Safety Designs...facilities make it possible to track the status of these jobs, retrieve their job control language listings, and direct a copy of printed or punched

Molecular Design of Low-Density Multifunctional Hybrid Materials

DTIC Science & Technology

2016-01-01

properties, but also the synergistic interactions of reactive chemical and simulated solar UV environments with the hybrid film which leads to...applications possible including microelectronic interlayer dielectrics, antireflective coatings for solar cells , optical waveguides, size-selective...membranes, biosensors, micro-fluidic structures, and membranes in fuel cells . A critical aspect for all of these applications is that the hybrids

Independent Research and Independent Exploratory Development Annual Report Fiscal Year 1975

DTIC Science & Technology

1975-09-01

and Coding Study.(Z?80) ................................... ......... .................... 40 Optical Cover CMMUnicallor’s Using Laser Transceiverst...Using Auger Spectroscopy and PUBLICATIONS Additional Advanced Analytical Techniques," Wagner, N. K., "Auger Electron Spectroscopy NELC Technical Note 2904...K.. "Analysis of Microelectronic Materials Using Auger Spectroscopy and Additional Advanced Analytical Techniques," Contact: Proceedings of the

Microgravity

NASA Image and Video Library

1999-11-10

Space Vacuum Epitaxy Center works with industry and government laboratories to develop advanced thin film materials and devices by utilizing the most abundant free resource in orbit: the vacuum of space. SVEC, along with its affiliates, is developing semiconductor mid-IR lasers for environmental sensing and defense applications, high efficiency solar cells for space satellite applications, oxide thin films for computer memory applications, and ultra-hard thin film coatings for wear resistance in micro devices. Performance of these vacuum deposited thin film materials and devices can be enhanced by using the ultra-vacuum of space for which SVEC has developed the Wake Shield Facility---a free flying research platform dedicated to thin film materials development in space.

Microgravity

NASA Image and Video Library

2000-11-10

Space Vacuum Epitaxy Center works with industry and government laboratories to develop advanced thin film materials and devices by utilizing the most abundant free resource in orbit: the vacuum of space. SVEC, along with its affiliates, is developing semiconductor mid-IR lasers for environmental sensing and defense applications, high efficiency solar cells for space satellite applications, oxide thin films for computer memory applications, and ultra-hard thin film coatings for wear resistance in micro devices. Performance of these vacuum deposited thin film materials and devices can be enhanced by using the ultra-vacuum of space for which SVEC has developed the Wake Shield Facility---a free flying research platform dedicated to thin film materials development in space.

The localized quantum vacuum field

NASA Astrophysics Data System (ADS)

Dragoman, D.

2008-03-01

A model for the localized quantum vacuum is proposed in which the zero-point energy (ZPE) of the quantum electromagnetic field originates in energy- and momentum-conserving transitions of material systems from their ground state to an unstable state with negative energy. These transitions are accompanied by emissions and re-absorptions of real photons, which generate a localized quantum vacuum in the neighborhood of material systems. The model could help resolve the cosmological paradox associated with the ZPE of electromagnetic fields, while reclaiming quantum effects associated with quantum vacuum such as the Casimir effect and the Lamb shift. It also offers a new insight into the Zitterbewegung of material particles.

Solventless sol-gel chemistry through ring-opening polymerization of bridged disilaoxacyclopentanes

DOE Office of Scientific and Technical Information (OSTI.GOV)

RAHIMIAN,KAMYAR; LOY,DOUGLAS A.

2000-05-01

Ring-opening polymerization (ROP) of disilaoxacyclopentanes has proven to be an excellent approach to sol-gel type hybrid organic-inorganic materials. These materials have shown promise as precursors for encapsulation and microelectronics applications. The polymers are highly crosslinked and are structurally similar to traditional sol-gels, but unlike typical sol-gels they are prepared by an organic base or Bronsted acid (formic or triflic acid), without the use of solvents and water, they have low VOC's and show little shrinkage during processing.

Space Research Results Purify Semiconductor Materials

NASA Technical Reports Server (NTRS)

2010-01-01

While President Obama's news that NASA would encourage private companies to develop vehicles to take NASA into space may have come as a surprise to some, NASA has always encouraged private companies to invest in space. More than two decades ago, NASA established Commercial Space Centers across the United States to encourage industry to use space as a place to conduct research and to apply NASA technology to Earth applications. Although the centers are no longer funded by NASA, the advances enabled by that previous funding are still impacting us all today. For example, the Space Vacuum Epitaxy Center (SVEC) at the University of Houston, one of the 17 Commercial Space Centers, had a mission to create advanced thin film semiconductor materials and devices through the use of vacuum growth technologies both on Earth and in space. Making thin film materials in a vacuum (low-pressure environment) is advantageous over making them in normal atmospheric pressures, because contamination floating in the air is lessened in a vacuum. To grow semiconductor crystals, researchers at SVEC utilized epitaxy the process of depositing a thin layer of material on top of another thin layer of material. On Earth, this process took place in a vacuum chamber in a clean room lab. For space, the researchers developed something called the Wake Shield Facility (WSF), a 12-foot-diameter disk-shaped platform designed to grow thin film materials using the low-pressure environment in the wake of the space shuttle. Behind an orbiting space shuttle, the vacuum levels are thousands of times better than in the best vacuum chambers on Earth. Throughout the 1990s, the WSF flew on three space shuttle missions as a series of proof-of-concept missions. These experiments are a lasting testament to the success of the shuttle program and resulted in the development of the first thin film materials made in the vacuum of space, helping to pave the way for better thin film development on Earth.

Miniaturized Environmental Monitoring Instrumentation

DOE Office of Scientific and Technical Information (OSTI.GOV)

C. B. Freidhoff

1997-09-01

The objective of the Mass Spectrograph on a Chip (MSOC) program is the development of a miniature, multi-species gas sensor fabricated using silicon micromachining technology which will be orders of magnitude smaller and lower power consumption than a conventional mass spectrometer. The sensing and discrimination of this gas sensor are based on an ionic mass spectrograph, using magnetic and/or electrostatic fields. The fields cause a spatial separation of the ions according to their respective mass-to-charge ratio. The fabrication of this device involves the combination of microelectronics with micromechanically built sensors and, ultimately, vacuum pumps. The prototype of a chemical sensormore » would revolutionize the method of performing environmental monitoring for both commercial and government applications. The portable unit decided upon was the miniaturized gas chromatograph with a mass spectrometer detector, referred to as a GC/MS in the analytical marketplace.« less

Casimir free energy of dielectric films: classical limit, low-temperature behavior and control.

PubMed

Klimchitskaya, G L; Mostepanenko, V M

2017-07-12

The Casimir free energy of dielectric films, both free-standing in vacuum and deposited on metallic or dielectric plates, is investigated. It is shown that the values of the free energy depend considerably on whether the calculation approach used neglects or takes into account the dc conductivity of film material. We demonstrate that there are material-dependent and universal classical limits in the former and latter cases, respectively. The analytic behavior of the Casimir free energy and entropy for a free-standing dielectric film at low temperature is found. According to our results, the Casimir entropy goes to zero when the temperature vanishes if the calculation approach with neglected dc conductivity of a film is employed. If the dc conductivity is taken into account, the Casimir entropy takes the positive value at zero temperature, depending on the parameters of a film, i.e. the Nernst heat theorem is violated. By considering the Casimir free energy of SiO 2 and Al 2 O 3 films deposited on a Au plate in the framework of two calculation approaches, we argue that physically correct values are obtained by disregarding the role of dc conductivity. A comparison with the well known results for the configuration of two parallel plates is made. Finally, we compute the Casimir free energy of SiO 2 , Al 2 O 3 and Ge films deposited on high-resistivity Si plates of different thicknesses and demonstrate that it can be positive, negative and equal to zero. The effect of illumination of a Si plate with laser light is considered. Possible applications of the obtained results to thin films used in microelectronics are discussed.

100 Years of the Physics of Diodes

NASA Astrophysics Data System (ADS)

Luginsland, John

2013-10-01

The Child-Langmuir Law (CL), discovered 100 years ago, gives the maximum current that can be transported across a planar diode in the steady state. As a quintessential example of the impact of space-charge shielding near a charged surface, it is central to the studies of high current diodes, such as high power microwave sources, vacuum microelectronics, electron and ion sources, and high current drivers used in high-energy density physics experiments. CL remains a touchstone of fundamental sheath physics, including contemporary studies of nano-scale quantum diodes and plasmonic devices. Its solid state analog is the Mott-Gurney law, governing the maximum charge injection in solids, such as organic materials and other dielectrics, which is important to energy devices, such as solar cells and light-emitting diodes. This paper reviews the important advances in the physics of diodes since the discovery of CL, including virtual cathode formation and extension of CL to multiple dimensions, to the quantum regime, and to ultrafast processes. We will review the influence of magnetic fields, multiple species in bipolar flow, electromagnetic and time dependent effects in both short pulse and high frequency THz limits, and single electron regimes. Transitions from various emission mechanisms (thermionic, field, and photo-emission) to the space charge limited state (CL) will be addressed, especially highlighting important simulation and experimental developments in selected contemporary areas of study. This talk will stress the fundamental physical links between the physics of beams to limiting currents in other areas, such as low temperature plasmas, laser plasmas, and space propulsion. Also emphasized is the role of non-equilibrium phenomena associated with materials and plasmas in close contact. Work supported by the Air Force Office of Scientific Research.

Casimir free energy of dielectric films: classical limit, low-temperature behavior and control

NASA Astrophysics Data System (ADS)

Klimchitskaya, G. L.; Mostepanenko, V. M.

2017-07-01

The Casimir free energy of dielectric films, both free-standing in vacuum and deposited on metallic or dielectric plates, is investigated. It is shown that the values of the free energy depend considerably on whether the calculation approach used neglects or takes into account the dc conductivity of film material. We demonstrate that there are material-dependent and universal classical limits in the former and latter cases, respectively. The analytic behavior of the Casimir free energy and entropy for a free-standing dielectric film at low temperature is found. According to our results, the Casimir entropy goes to zero when the temperature vanishes if the calculation approach with neglected dc conductivity of a film is employed. If the dc conductivity is taken into account, the Casimir entropy takes the positive value at zero temperature, depending on the parameters of a film, i.e. the Nernst heat theorem is violated. By considering the Casimir free energy of SiO2 and Al2O3 films deposited on a Au plate in the framework of two calculation approaches, we argue that physically correct values are obtained by disregarding the role of dc conductivity. A comparison with the well known results for the configuration of two parallel plates is made. Finally, we compute the Casimir free energy of SiO2, Al2O3 and Ge films deposited on high-resistivity Si plates of different thicknesses and demonstrate that it can be positive, negative and equal to zero. The effect of illumination of a Si plate with laser light is considered. Possible applications of the obtained results to thin films used in microelectronics are discussed.

Engineering brain-computer interfaces: past, present and future.

PubMed

Hughes, M A

2014-06-01

Electricity governs the function of both nervous systems and computers. Whilst ions move in polar fluids to depolarize neuronal membranes, electrons move in the solid-state lattices of microelectronic semiconductors. Joining these two systems together, to create an iono-electric brain-computer interface, is an immense challenge. However, such interfaces offer (and in select clinical contexts have already delivered) a method of overcoming disability caused by neurological or musculoskeletal pathology. To fulfill their theoretical promise, several specific challenges demand consideration. Rate-limiting steps cover a diverse range of disciplines including microelectronics, neuro-informatics, engineering, and materials science. As those who work at the tangible interface between brain and outside world, neurosurgeons are well placed to contribute to, and inform, this cutting edge area of translational research. This article explores the historical background, status quo, and future of brain-computer interfaces; and outlines the challenges to progress and opportunities available to the clinical neurosciences community.

Highly photoresponsive and wavelength-selective circularly-polarized-light detector based on metal-oxides hetero-chiral thin film.

PubMed

Lee, Seung Hee; Singh, Dhruv Pratap; Sung, Ji Ho; Jo, Moon-Ho; Kwon, Ki Chang; Kim, Soo Young; Jang, Ho Won; Kim, Jong Kyu

2016-01-22

A highly efficient circularly-polarized-light detector with excellent wavelength selectivity is demonstrated with an elegant and simple microelectronics-compatible way. The circularly-polarized-light detector based on a proper combination of the geometry-controlled TiO2-SnO2 hetero-chiral thin film as an effective chiroptical filter and the Si active layer shows excellent chiroptical response with external quantum efficiency as high as 30% and high helicity selectivity of ~15.8% in an intended wavelength range. Furthermore, we demonstrated the ability of manipulating both bandwidth and responsivity of the detector simultaneously in whole visible wavelength range by a precise control over the geometry and materials constituting hetero-chiral thin film. The high efficiency, wavelength selectivity and compatibility with conventional microelectronics processes enabled by the proposed device can result in remarkable developments in highly integrated photonic platforms utilizing chiroptical responses.

Highly photoresponsive and wavelength-selective circularly-polarized-light detector based on metal-oxides hetero-chiral thin film

PubMed Central

Lee, Seung Hee; Singh, Dhruv Pratap; Sung, Ji Ho; Jo, Moon-Ho; Kwon, Ki Chang; Kim, Soo Young; Jang, Ho Won; Kim, Jong Kyu

2016-01-01

A highly efficient circularly-polarized-light detector with excellent wavelength selectivity is demonstrated with an elegant and simple microelectronics-compatible way. The circularly-polarized-light detector based on a proper combination of the geometry-controlled TiO2-SnO2 hetero-chiral thin film as an effective chiroptical filter and the Si active layer shows excellent chiroptical response with external quantum efficiency as high as 30% and high helicity selectivity of ~15.8% in an intended wavelength range. Furthermore, we demonstrated the ability of manipulating both bandwidth and responsivity of the detector simultaneously in whole visible wavelength range by a precise control over the geometry and materials constituting hetero-chiral thin film. The high efficiency, wavelength selectivity and compatibility with conventional microelectronics processes enabled by the proposed device can result in remarkable developments in highly integrated photonic platforms utilizing chiroptical responses. PMID:26795601

Highly photoresponsive and wavelength-selective circularly-polarized-light detector based on metal-oxides hetero-chiral thin film

NASA Astrophysics Data System (ADS)

Lee, Seung Hee; Singh, Dhruv Pratap; Sung, Ji Ho; Jo, Moon-Ho; Kwon, Ki Chang; Kim, Soo Young; Jang, Ho Won; Kim, Jong Kyu

2016-01-01

A highly efficient circularly-polarized-light detector with excellent wavelength selectivity is demonstrated with an elegant and simple microelectronics-compatible way. The circularly-polarized-light detector based on a proper combination of the geometry-controlled TiO2-SnO2 hetero-chiral thin film as an effective chiroptical filter and the Si active layer shows excellent chiroptical response with external quantum efficiency as high as 30% and high helicity selectivity of ~15.8% in an intended wavelength range. Furthermore, we demonstrated the ability of manipulating both bandwidth and responsivity of the detector simultaneously in whole visible wavelength range by a precise control over the geometry and materials constituting hetero-chiral thin film. The high efficiency, wavelength selectivity and compatibility with conventional microelectronics processes enabled by the proposed device can result in remarkable developments in highly integrated photonic platforms utilizing chiroptical responses.

Thermally Conductive Tape Based on Carbon Nanotube Arrays

NASA Technical Reports Server (NTRS)

Kashani, Ali

2011-01-01

To increase contact conductance between two mating surfaces, a conductive tape has been developed by growing dense arrays of carbon nanotubes (CNTs, graphite layers folded into cylinders) on both sides of a thermally conductive metallic foil. When the two mating surfaces are brought into contact with the conductive tape in between, the CNT arrays will adhere to the mating surface. The van der Waals force between the contacting tubes and the mating surface provides adhesion between the two mating surfaces. Even though the thermal contact conductance of a single tube-to-tube contact is small, the tremendous amount of CNTs on the surface leads to a very large overall contact conductance. Interface contact thermal resistance rises from the microroughness and the macroscopic non-planar quality of mating surfaces. When two surfaces come into contact with each other, the actual contact area may be much less than the total area of the surfaces. The real area of contact depends on the load, the surface roughness, and the elastic and inelastic properties of the surface. This issue is even more important at cryogenic temperatures, where materials become hard and brittle and vacuum is used, which prevents any gas conduction through the interstitial region. A typical approach to increase thermal contact conductance is to use thermally conducting epoxies or greases, which are not always compatible with vacuum conditions. In addition, the thermal conductivities of these compounds are often relatively low. The CNTs used in this approach can be metallic or semiconducting, depending on the folding angle and diameter. The electrical resistivity of multiwalled carbon nanotubes (MWCNTs) has been reported. MWCNTs can pass a current density and remain stable at high temperatures in air. The thermal conductivity of a MWCNT at room temperature is measured to be approximately 3,000 W/m-K, which is much larger than that of diamond. At room temperature, the thermal conductance of a 0.3 sq cm array of CNTs was measured to be as high as 10 W/K. The high thermal conductivity and the nanoscale size make CNTs ideal as thermal interface materials. The CNT-based thermal tape can be used for the thermal management of microelectronic packages and electronic systems. It also can be integrated with current device technology and packaging. The material would allow for an efficient method to manage excess heat generation without requiring any additional power. Lastly, the CNT tape can be used to enhance thermal contact conductance across two mating surfaces on some NASA missions.

Microelectronics bioinstrumentation systems

NASA Technical Reports Server (NTRS)

Ko, W. H.

1977-01-01

Microelectronic bioinstrumentation systems to be employed in the Cardiovascular Deconditioning Program were developed. Implantable telemetry systems for long-term monitoring of animals on earth were designed to collect physiological data necessary for the understanding of the mechanisms of cardiovascular deconditioning. In-flight instrumentation systems, microelectronic instruments, and RF powering techniques for other life science experiments in the NASA program were studied.

Relevance of microelectronic education to industrial needs

NASA Technical Reports Server (NTRS)

Prince, J. L.; Lathrop, J. W.

1977-01-01

The relevance of microelectronic education to industrial needs was evaluated, and four categories were surveyed: (1) facts and rules; (2) skills; (3) personality; and (4) deductive-inductive reasoning. Examples of specific items in each category are given to illustrate their meaning and it was indicated as to which items in each category are strongly impacted by microelectronics courses and laboratories.

Recycling of waste lead storage battery by vacuum methods.

PubMed

Lin, Deqiang; Qiu, Keqiang

2011-07-01

Waste lead storage battery is the most important recyclable lead material not only in various European and other OECD countries but also in China. Pollution control of lead has become the focus of people's attention in the world. A vacuum process for recycling waste lead storage battery was developed in this work. The experimental results showed that all the valuable materials in waste lead storage battery could be satisfactorily recycled by vacuum technologies. The vacuum melting of lead grids and the vacuum reduction of lead pastes produce the lead bullion with the direct recovery ratio of 96.29% and 98.98%, respectively. The vacuum pyrolysis of plastics can produce pyrolysis oil with yield of more than 93 wt.%. These vacuum recycling technologies offer improvements in metallurgical and environmental performance. Copyright © 2011 Elsevier Ltd. All rights reserved.

General and crevice corrosion study of the in-wall shielding materials for ITER vacuum vessel

NASA Astrophysics Data System (ADS)

Joshi, K. S.; Pathak, H. A.; Dayal, R. K.; Bafna, V. K.; Kimihiro, Ioki; Barabash, V.

2012-11-01

Vacuum vessel In-Wall Shield (IWS) will be inserted between the inner and outer shells of the ITER vacuum vessel. The behaviour of IWS in the vacuum vessel especially concerning the susceptibility to crevice of shielding block assemblies could cause rapid and extensive corrosion attacks. Even galvanic corrosion may be due to different metals in same electrolyte. IWS blocks are not accessible until life of the machine after closing of vacuum vessel. Hence, it is necessary to study the susceptibility of IWS materials to general corrosion and crevice corrosion under operations of ITER vacuum vessel. Corrosion properties of IWS materials were studied by using (i) Immersion technique and (ii) Electro-chemical Polarization techniques. All the sample materials were subjected to a series of examinations before and after immersion test, like Loss/Gain weight measurement, SEM analysis, and Optical stereo microscopy, measurement of surface profile and hardness of materials. After immersion test, SS 304B4 and SS 304B7 showed slight weight gain which indicate oxide layer formation on the surface of coupons. The SS 430 material showed negligible weight loss which indicates mild general corrosion effect. On visual observation with SEM and Metallography, all material showed pitting corrosion attack. All sample materials were subjected to series of measurements like Open Circuit potential, Cyclic polarization, Pitting potential, protection potential, Critical anodic current and SEM examination. All materials show pitting loop in OC2 operating condition. However, its absence in OC1 operating condition clearly indicates the activity of chloride ion to penetrate oxide layer on the sample surface, at higher temperature. The critical pitting temperature of all samples remains between 100° and 200°C.

Study of Vacuum Energy Physics for Breakthrough Propulsion

NASA Technical Reports Server (NTRS)

Millis, Marc G. (Technical Monitor); Maclay, G. Jordan; Hammer, Jay; Clark, Rod; George, Michael; Kim, Yeong; Kir, Asit

2004-01-01

This report summarizes the accomplishments during a three year research project to investigate the use of surfaces, particularly in microelectromechanical systems (MEMS), to exploit quantum vacuum forces. During this project, we developed AFM instrumentation to repeatably measure Casimir forces in the nanoNewton range at 10 6 torr, designed an experiment to measure attractive and repulsive quantum vacuum forces, developed a QED based theory of Casimir forces that includes non-ideal material properties for rectangular cavities and for multilayer slabs, developed theoretical models for a variety of microdevices utilizing vacuum forces, applied vacuum physics to a gedanken spacecraft, and investigated a new material with a negative index of refraction.

Vacuum Baking To Remove Volatile Materials

NASA Technical Reports Server (NTRS)

Muscari, J. A.

1985-01-01

Outgassing reduced in some but not all nonmetallic materials. Eleven polymeric materials tested by determining outgassing species as temperature of conditioned and unconditioned materials raised to 300 degrees C. Conditioning process consisted of vacuum bake for 24 hours at 80 degrees C in addition to usual cure. Baking did not change residual gas percentage of water molecules.

Spreading devices into a 2-D module layout

DOE Office of Scientific and Technical Information (OSTI.GOV)

Koplow, Jeffrey P.; Gupta, Vipin P.; Nielson, Gregory N.

An apparatus, method, and system, the apparatus including a receiving member dimensioned to receive an array of microelectronic devices; and a linkage member coupled to the receiving member, the linkage member configured to move the receiving member in at least two dimensions so as to modify a spacing between the electronic devices within the array of microelectronic devices received by the receiving member. The method including coupling an array of microelectronic devices to an expansion assembly; and expanding the expansion assembly so as to expand the array of microelectronic devices in at least two directions within a single plane. Themore » system including a support member; an expansion assembly coupled to the support member, the expansion assembly having a plurality of receiving members configured to move in at least two dimensions within a single plane; and a plurality of microelectronic devices coupled to each of the plurality of receiving members.« less

Enabling laser applications in microelectronics manufacturing

NASA Astrophysics Data System (ADS)

Delmdahl, Ralph; Brune, Jan; Fechner, Burkhard; Senczuk, Rolf

2016-02-01

In this experimental study, we report on high-pulse-energy excimer laser drilling into high-performance build-up films which are pivotal in microelectronics manufacturing. Build-up materials ABF-GX13 from Ajinomoto as well as ZS-100 from Zeon Corporation are evaluated with respect to their viability for economic excimer laser-based micro-via formation. Excimer laser mask imaging projection at laser wavelengths of 193, 248 and 308 nm is employed to generate matrices of smaller micro-vias with different diameters and via pitches. High drilling quality is achievable for all excimer laser wavelengths with the fastest ablation rates measured in the case of 248 and 308 nm wavelengths. The presence of glass fillers in build-up films as in the ABF-GX13 material poses some limitations to the minimum achievable via diameter. However, surprisingly good drilling results are obtainable as long as the filler dimensions are well below the diameter of the micro-vias. Sidewall angles of vias are controllable by adjusting the laser energy density and pulse number. In this work, the structuring capabilities of excimer lasers in build-up films as to taper angle variations, attainable via diameters, edge-stop behavior and ablation rates will be elucidated.

Multipurpose Vacuum Induction Processing System

NASA Astrophysics Data System (ADS)

Govindaraju, M.; Kulkarni, Deepak; Balasubramanian, K.

2012-11-01

Multipurpose vacuum processing systems are cost effective; occupy less space, multiple functional under one roof and user friendly. A multipurpose vacuum induction system was designed, fabricated and installed in a record time of 6 months time at NFTDC Hyderabad. It was designed to function as a) vacuum induction melting/refining of oxygen free electronic copper/pure metals, b) vacuum induction melting furnace for ferrous materials c) vacuum induction melting for non ferrous materials d) large vacuum heat treatment chamber by resistance heating (by detachable coil and hot zone) e) bottom discharge vacuum induction melting system for non ferrous materials f) Induction heat treatment system and g) directional solidification /investment casting. It contains provision for future capacity addition. The attachments require to manufacture multiple shaped castings and continuous rod casting can be added whenever need arises. Present capacity is decided on the requirement for 10years of development path; presently it has 1.2 ton liquid copper handling capacity. It is equipped with provision for capacity addition up to 2 ton liquid copper handling capacity in future. Provision is made to carry out the capacity addition in easy steps quickly. For easy operational maintenance and troubleshooting, design was made in easily detachable sections. High vacuum system is also is detachable, independent and easily movable which is first of its kind in the country. Detailed design parameters, advantages and development history are presented in this paper.

Vacuum-insulated catalytic converter

DOEpatents

Benson, David K.

2001-01-01

A catalytic converter has an inner canister that contains catalyst-coated substrates and an outer canister that encloses an annular, variable vacuum insulation chamber surrounding the inner canister. An annular tank containing phase-change material for heat storage and release is positioned in the variable vacuum insulation chamber a distance spaced part from the inner canister. A reversible hydrogen getter in the variable vacuum insulation chamber, preferably on a surface of the heat storage tank, releases hydrogen into the variable vacuum insulation chamber to conduct heat when the phase-change material is hot and absorbs the hydrogen to limit heat transfer to radiation when the phase-change material is cool. A porous zeolite trap in the inner canister absorbs and retains hydrocarbons from the exhaust gases when the catalyst-coated substrates and zeolite trap are cold and releases the hydrocarbons for reaction on the catalyst-coated substrate when the zeolite trap and catalyst-coated substrate get hot.

Vapor-barrier Vacuum Isolation System

NASA Technical Reports Server (NTRS)

Weinstein, Leonard M. (Inventor); Taminger, Karen M. (Inventor)

2014-01-01

A system includes a collimated beam source within a vacuum chamber, a condensable barrier gas, cooling material, a pump, and isolation chambers cooled by the cooling material to condense the barrier gas. Pressure levels of each isolation chamber are substantially greater than in the vacuum chamber. Coaxially-aligned orifices connect a working chamber, the isolation chambers, and the vacuum chamber. The pump evacuates uncondensed barrier gas. The barrier gas blocks entry of atmospheric vapor from the working chamber into the isolation chambers, and undergoes supersonic flow expansion upon entering each isolation chamber. A method includes connecting the isolation chambers to the vacuum chamber, directing vapor to a boundary with the working chamber, and supersonically expanding the vapor as it enters the isolation chambers via the orifices. The vapor condenses in each isolation chamber using the cooling material, and uncondensed vapor is pumped out of the isolation chambers via the pump.

Reception and study of lunar surface material in inert gas medium. [considering laboratory vacuum receiving chamber

NASA Technical Reports Server (NTRS)

Surkov, Y. A.; Rudnitskiy, Y. M.; Glotov, V. A.

1974-01-01

The reception and study of lunar material returned by the Luna 16 space station is described. The layout of a vacuum receiving chamber for working with material in a helium atmosphere is examined along with the main operations involved in extracting the material from the ampule and drill.

Aqueous, Room Temperature Deposition of Silicon, Molybdenum and Germanium onto Aluminum Substrates

NASA Astrophysics Data System (ADS)

Krishnamurthy, Aarti Krishna

Electrochemical deposition of active materials such as Si, Mo and Ge is notoriously difficult, so they are typically deposited using expensive vacuum methods such as chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), and magnetron sputtering. However, for most materials, electrochemical deposition has significant advantages of cost, scalability, and manufacturability. There are two main challenges in depositing these materials from aqueous electrolytes at room temperature, namely their highly cathodic standard reduction potential and the formation of native oxides. This has led researchers to use non-aqueous electrolytes such as organic solvents, room temperature ionic liquids (RTILs), and high temperature molten salts. However, these have drawbacks over aqueous electrolytes such as high cost, low conductivity, flammability, and corrosive behavior. During my PhS studies, these two challenges were overcome by using the galvanic method of deposition and by including HF in the electrolyte. Si thin films are employed in a variety of technologies, including microelectronic and photovoltaic devices, Li ion battery anodes, and corrosion-resistant coatings. A galvanic and a combined galvanic/electroless method of Si deposition were developed using aqueous electrolytes at room temperature to obtain nanoporous and compact films, respectively. These films were characterized to understand the surface morphology, thickness, crystallinity, growth rate, composition and nucleation behavior. Approximately 7-10 µm thick compact Si films were achieved with a deposition time of around 28 hours. The galvanic method of deposition was also extended to deposit compact Mo films. Mo thin films have a number of technological applications, including back contacts for CIGS/CZTS photovoltaic devices and corrosion-resistant coatings. Mo thin films were also thoroughly characterized and approximately 4.5 µm thick films were obtained after 3 hours. Similar to Si depostion, a galvanic method of deposition and the galvanic/electroless method of deposition was tested for the deposition of Ge. However no Ge deposit could be consistently obtained, probably due to oxyanion formation in aqueous hexaflurogermante solution.

Characteristics of ring type traveling wave ultrasonic motor in vacuum.

PubMed

Qu, Jianjun; Zhou, Ningning; Tian, Xiu; Jin, Long; Xu, Zhike

2009-03-01

The characteristics of ultrasonic motor strongly depend on the properties of stator/rotor contact interface which are affected by ambient environment. With the developed apparatus, load properties of two ring type traveling wave ultrasonic motors in atmosphere, low vacuum and high vacuum were studied, respectively. Wear of friction material, variations of vacuum degree and the temperature of motor during the experiment were also measured. The results show that load properties of motor A in vacuum were poorer than those in atmosphere, when load torque M(f) was less than 0.55 N m. Compared to motor A, load properties of motor B were affected a little by environmental pressure. Wear of friction material in vacuum was more severe than wear in atmosphere. The temperature of motor in vacuum rose more quickly than it in atmosphere and had not reached equilibrium in 2 h experiment. However, the temperature of motor in atmosphere had reached equilibrium in about forth minutes. Furthermore, outgas was also observed during experiment under vacuum conditions.

PILOT-SCALE REMOVAL OF FLUORIDE FROM LEGACY PLUTONIUM MATERIALS USING VACUUM SALT DISTILLATION

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pierce, R. A.; Pak, D. J.

2012-09-11

Between September 2009 and January 2011, the Savannah River National Laboratory (SRNL) and HB-Line designed, developed, tested, and successfully deployed a system for the distillation of chloride salts. In 2011, SRNL adapted the technology for the removal of fluoride from fluoride-bearing salts. The method involved an in situ reaction between potassium hydroxide (KOH) and the fluoride salt to yield potassium fluoride (KF) and the corresponding oxide. The KF and excess KOH can be distilled below 1000{deg}C using vacuum salt distillation (VSD). The apparatus for vacuum distillation contains a zone heated by a furnace and a zone actively cooled using eithermore » recirculated water or compressed air. During a vacuum distillation operation, a sample boat containing the feed material is placed into the apparatus while it is cool, and the system is sealed. The system is evacuated using a vacuum pump. Once a sufficient vacuum is attaned, heating begins. Volatile salts distill from the heated zone to the cooled zone where they condense, leaving behind the non-volatile material in the feed boat. Studies discussed in this report were performed involving the use of non-radioactive simulants in small-scale and pilot-scale systems as well as radioactive testing of a small-scale system with plutonium-bearing materials. Aspects of interest include removable liner design considerations, boat materials, in-line moisture absorption, and salt deposition.« less

High surface area silicon materials: fundamentals and new technology.

PubMed

Buriak, Jillian M

2006-01-15

Crystalline silicon forms the basis of just about all computing technologies on the planet, in the form of microelectronics. An enormous amount of research infrastructure and knowledge has been developed over the past half-century to construct complex functional microelectronic structures in silicon. As a result, it is highly probable that silicon will remain central to computing and related technologies as a platform for integration of, for instance, molecular electronics, sensing elements and micro- and nanoelectromechanical systems. Porous nanocrystalline silicon is a fascinating variant of the same single crystal silicon wafers used to make computer chips. Its synthesis, a straightforward electrochemical, chemical or photochemical etch, is compatible with existing silicon-based fabrication techniques. Porous silicon literally adds an entirely new dimension to the realm of silicon-based technologies as it has a complex, three-dimensional architecture made up of silicon nanoparticles, nanowires, and channel structures. The intrinsic material is photoluminescent at room temperature in the visible region due to quantum confinement effects, and thus provides an optical element to electronic applications. Our group has been developing new organic surface reactions on porous and nanocrystalline silicon to tailor it for a myriad of applications, including molecular electronics and sensing. Integration of organic and biological molecules with porous silicon is critical to harness the properties of this material. The construction and use of complex, hierarchical molecular synthetic strategies on porous silicon will be described.

Trusted Defense Microelectronics: Future Access and Capabilities Are Uncertain

DTIC Science & Technology

2015-10-28

Board Task Force on High Performance Microchip Supply and documentation and discussions with industry and DOD officials in September and October...the defense and microelectronics industry . DOD’s review of this report deemed some of this information as sensitive but unclassified. What GAO...increased specialization and industry consolidation. • Once dominated by domestic sources, the supply chain for microelectronics manufacturing is a global one

Microelectronics: The Nature of Work, Skills and Training. An Analysis of Case Studies from Developed and Developing Countries. Training Discussion Paper No. 51.

ERIC Educational Resources Information Center

Acero, Liliana

Microelectronic technologies have had an impact on the nature of work in industry for both white-collar and blue-collar workers. Evidence from sector- and enterprise-level studies shows changes in skills and job content for blue-collar workers involved with numerically controlled machine tools, robots, and other microelectronics applications.…

High-performance microsupercapacitors based on two-dimensional graphene/manganese dioxide/silver nanowire ternary hybrid film.

PubMed

Liu, Wenwen; Lu, Congxiang; Wang, Xingli; Tay, Roland Yingjie; Tay, Beng Kang

2015-02-24

Microsupercapacitors (MSCs), as one type of significant power source or energy storage unit in microelectronic devices, have attracted more and more attention. However, how to reasonably design electrode structures and exploit the active materials to endow the MSCs with excellent performances in a limited surface area still remains a challenge. Here, a reduced graphene oxide (RGO)/manganese dioxide (MnO2)/silver nanowire (AgNW) ternary hybrid film (RGMA ternary hybrid film) is successfully fabricated by a facile vacuum filtration and subsequent thermal reduction, and is used directly as a binder-free electrode for MSCs. Additionally, a flexible, transparent, all-solid state RMGA-MSC is also built, and its electrochemical performance in an ionic liquid gel electrolyte are investigated in depth. Notably, the RGMA-MSCs display superior electrochemical properties, including exceptionally high rate capability (up to 50000 mV·s(-1)), high frequency response (very short corresponding time constant τ0 = 0.14 ms), and excellent cycle stability (90.3% of the initial capacitance after 6000 cycles in ionic liquid gel electrolyte). Importantly, the electrochemical performance of RGMA-MSCs shows a strong dependence on the geometric parameters including the interspace between adjacent fingers and the width of the finger of MSCs. These encouraging results may not only provide important references for the design and fabrication of high-performance MSCs, but also make the RGMA ternary hybrid film promising for the next generation film lithium ion batteries and other energy storage devices.

100 years of the physics of diodes

NASA Astrophysics Data System (ADS)

Zhang, Peng; Valfells, Ágúst; Ang, L. K.; Luginsland, J. W.; Lau, Y. Y.

2017-03-01

The Child-Langmuir Law (CL), discovered a century ago, gives the maximum current that can be transported across a planar diode in the steady state. As a quintessential example of the impact of space charge shielding near a charged surface, it is central to the studies of high current diodes, such as high power microwave sources, vacuum microelectronics, electron and ion sources, and high current drivers used in high energy density physics experiments. CL remains a touchstone of fundamental sheath physics, including contemporary studies of nanoscale quantum diodes and nano gap based plasmonic devices. Its solid state analog is the Mott-Gurney law, governing the maximum charge injection in solids, such as organic materials and other dielectrics, which is important to energy devices, such as solar cells and light emitting diodes. This paper reviews the important advances in the physics of diodes since the discovery of CL, including virtual cathode formation and extension of CL to multiple dimensions, to the quantum regime, and to ultrafast processes. We review the influence of magnetic fields, multiple species in bipolar flow, electromagnetic and time dependent effects in both short pulse and high frequency THz limits, and single electron regimes. Transitions from various emission mechanisms (thermionic-, field-, and photoemission) to the space charge limited state (CL) will be addressed, especially highlighting the important simulation and experimental developments in selected contemporary areas of study. We stress the fundamental physical links between the physics of beams to limiting currents in other areas, such as low temperature plasmas, laser plasmas, and space propulsion.

Phenylated polyimides prepared from 3,6-diarylpyromellitic dianhydride and aromatic diamines

NASA Technical Reports Server (NTRS)

Harris, Frank W. (Inventor)

1992-01-01

A new class of soluble phenylated polyimides made from 3,6-diarypyromellitic dianhydride and process for the manufacture of the 3,6-diarypyromellitic dianhydride starting material. The polyimides obtained with said dianhydride are readily soluble in appropriate organic solvents and are distinguished by excellent thermal, electrical and/or mechanical properties making the polyimides ideally suited as coating materials for microelectronic apparatii, as membranes for selective molecular separation or permeation or selective gas separation or permeation, or as reinforcing fibers in molecular composites, or as high modulus, high tensile strength fibers.

46 CFR 153.368 - Pressure-vacuum valves.

Code of Federal Regulations, 2014 CFR

2014-10-01

... 46 Shipping 5 2014-10-01 2014-10-01 false Pressure-vacuum valves. 153.368 Section 153.368 Shipping... BULK LIQUID, LIQUEFIED GAS, OR COMPRESSED GAS HAZARDOUS MATERIALS Design and Equipment Cargo Venting Systems § 153.368 Pressure-vacuum valves. (a) The pressure side of a required pressure-vacuum relief valve...

46 CFR 153.368 - Pressure-vacuum valves.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 46 Shipping 5 2011-10-01 2011-10-01 false Pressure-vacuum valves. 153.368 Section 153.368 Shipping... BULK LIQUID, LIQUEFIED GAS, OR COMPRESSED GAS HAZARDOUS MATERIALS Design and Equipment Cargo Venting Systems § 153.368 Pressure-vacuum valves. (a) The pressure side of a required pressure-vacuum relief valve...

46 CFR 153.368 - Pressure-vacuum valves.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 46 Shipping 5 2012-10-01 2012-10-01 false Pressure-vacuum valves. 153.368 Section 153.368 Shipping... BULK LIQUID, LIQUEFIED GAS, OR COMPRESSED GAS HAZARDOUS MATERIALS Design and Equipment Cargo Venting Systems § 153.368 Pressure-vacuum valves. (a) The pressure side of a required pressure-vacuum relief valve...

46 CFR 153.368 - Pressure-vacuum valves.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 46 Shipping 5 2013-10-01 2013-10-01 false Pressure-vacuum valves. 153.368 Section 153.368 Shipping... BULK LIQUID, LIQUEFIED GAS, OR COMPRESSED GAS HAZARDOUS MATERIALS Design and Equipment Cargo Venting Systems § 153.368 Pressure-vacuum valves. (a) The pressure side of a required pressure-vacuum relief valve...

46 CFR 153.368 - Pressure-vacuum valves.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 46 Shipping 5 2010-10-01 2010-10-01 false Pressure-vacuum valves. 153.368 Section 153.368 Shipping... BULK LIQUID, LIQUEFIED GAS, OR COMPRESSED GAS HAZARDOUS MATERIALS Design and Equipment Cargo Venting Systems § 153.368 Pressure-vacuum valves. (a) The pressure side of a required pressure-vacuum relief valve...

Thermally-Activated Metal-to-Glass Bonding

NASA Technical Reports Server (NTRS)

Gallagher, B. D.

1986-01-01

Hermetic seals formed easily by use of metallo-organic film. Metallo-organic film thermally bonded to glass and soldered or welded to form hermetic seal. Film applied as ink consisting of silver neodecanoate in xylene. Relative amounts of ingredients selected to obtain desired viscosity. Material applied by printing or even by scribing with pen. Sealing technique useful in making solar-cell modules, microelectronic packages, and other hermetic silicon devices.

USSR and Eastern Europe Scientific Abstracts, Electronics and Electrical Engineering, Number 27

DTIC Science & Technology

1977-02-10

input and output conditions. The power section of the circuit is modified to permit triacs and thyristors, respectively, to function. The purpose of the...electronic materials, components, and devices, on circuit theory, pulse techniques, electromagnetic wave propagation, radar, quantum electronic theory...Lasers, Masers, Holography, Quasi-Optical 20 Microelectronics and General Circuit Theory and Information 21 Radars and Radio Wavigati on 22

Modeling biology with HDL languages: a first step toward a genetic design automation tool inspired from microelectronics.

PubMed

Gendrault, Yves; Madec, Morgan; Lallement, Christophe; Haiech, Jacques

2014-04-01

Nowadays, synthetic biology is a hot research topic. Each day, progresses are made to improve the complexity of artificial biological functions in order to tend to complex biodevices and biosystems. Up to now, these systems are handmade by bioengineers, which require strong technical skills and leads to nonreusable development. Besides, scientific fields that share the same design approach, such as microelectronics, have already overcome several issues and designers succeed in building extremely complex systems with many evolved functions. On the other hand, in systems engineering and more specifically in microelectronics, the development of the domain has been promoted by both the improvement of technological processes and electronic design automation tools. The work presented in this paper paves the way for the adaptation of microelectronics design tools to synthetic biology. Considering the similarities and differences between the synthetic biology and microelectronics, the milestones of this adaptation are described. The first one concerns the modeling of biological mechanisms. To do so, a new formalism is proposed, based on an extension of the generalized Kirchhoff laws to biology. This way, a description of all biological mechanisms can be made with languages widely used in microelectronics. Our approach is therefore successfully validated on specific examples drawn from the literature.

Thermal conductivity of aerogel blanket insulation under cryogenic-vacuum conditions in different gas environments

NASA Astrophysics Data System (ADS)

E Fesmire, J.; Ancipink, J. B.; Swanger, A. M.; White, S.; Yarbrough, D.

2017-12-01

Thermal conductivity of low-density materials in thermal insulation systems varies dramatically with the environment: cold vacuum pressure, residual gas composition, and boundary temperatures. Using a reference material of aerogel composite blanket (reinforcement fibers surrounded by silica aerogel), an experimental basis for the physical heat transmission model of aerogel composites and other low-density, porous materials is suggested. Cryogenic-vacuum testing between the boundary temperatures of 78 K and 293 K is performed using a one meter cylindrical, absolute heat flow calorimeter with an aerogel blanket specimen exposed to different gas environments of nitrogen, helium, argon, or CO2. Cold vacuum pressures include the full range from 1×10-5 torr to 760 torr. The soft vacuum region, from about 0.1 torr to 10 torr, is complex and difficult to model because all modes of heat transfer - solid conduction, radiation, gas conduction, and convection - are significant contributors to the total heat flow. Therefore, the soft vacuum tests are emphasized for both heat transfer analysis and practical thermal data. Results for the aerogel composite blanket are analyzed and compared to data for its component materials. With the new thermal conductivity data, future applications of aerogel-based insulation systems are also surveyed. These include Mars exploration and surface systems in the 5 torr CO2 environment, field joints for vacuum-jacketed cryogenic piping systems, common bulkhead panels for cryogenic tanks on space launch vehicles, and liquid hydrogen cryofuel systems with helium purged conduits or enclosures.

Proceedings of the twenty sixth international symposium on discharges and electrical insulation in vacuum. V. 2

DOE Office of Scientific and Technical Information (OSTI.GOV)

NONE

2014-07-01

Vacuum science and technology has made vital contributions in high technology areas like space, high energy particle accelerators, plasma devices, pulse power, electronics, vacuum interrupters, thin films, melting and refining of metals/alloys, extraction and processing of advanced materials. Vacuum discharges, vacuum arc physics and technology and various applications towards vacuum interrupters, pulse power and particle accelerator are the main themes for this symposium. Papers relevant to INIS are indexed separately.

Proceedings of the twenty sixth international symposium on discharges and electrical insulation in vacuum. V. 1

DOE Office of Scientific and Technical Information (OSTI.GOV)

NONE

2014-07-01

Vacuum science and technology has made vital contributions in high technology areas like space, high energy particle accelerators, plasma devices, pulse power, electronics, vacuum interrupters, thin films, melting and refining of metals/alloys, extraction and processing of advanced materials. Vacuum discharges, vacuum arc physics and technology and various applications towards vacuum interrupters, pulse power and particle accelerator are the main themes for this symposium. Papers relevant to INIS are indexed separately.

Thick SS316 materials TIG welding development activities towards advanced fusion reactor vacuum vessel applications

NASA Astrophysics Data System (ADS)

Kumar, B. Ramesh; Gangradey, R.

2012-11-01

Advanced fusion reactors like ITER and up coming Indian DEMO devices are having challenges in terms of their materials design and fabrication procedures. The operation of these devices is having various loads like structural, thermo-mechanical and neutron irradiation effects on major systems like vacuum vessel, divertor, magnets and blanket modules. The concept of double wall vacuum vessel (VV) is proposed in view of protecting of major reactor subsystems like super conducting magnets, diagnostic systems and other critical components from high energy 14 MeV neutrons generated from fusion plasma produced by D-T reactions. The double walled vacuum vessel is used in combination with pressurized water circulation and some special grade borated steel blocks to shield these high energy neutrons effectively. The fabrication of sub components in VV are mainly used with high thickness SS materials in range of 20 mm- 60 mm of various grades based on the required protocols. The structural components of double wall vacuum vessel uses various parts like shields, ribs, shells and diagnostic vacuum ports. These components are to be developed with various welding techniques like TIG welding, Narrow gap TIG welding, Laser welding, Hybrid TIG laser welding, Electron beam welding based on requirement. In the present paper the samples of 20 mm and 40 mm thick SS 316 materials are developed with TIG welding process and their mechanical properties characterization with Tensile, Bend tests and Impact tests are carried out. In addition Vickers hardness tests and microstructural properties of Base metal, Heat Affected Zone (HAZ) and Weld Zone are done. TIG welding application with high thick SS materials in connection with vacuum vessel requirements and involved criticalities towards welding process are highlighted.

Cryogenic Insulation System for Soft Vacuum

NASA Technical Reports Server (NTRS)

Augustynowicz, S. D.; Fesmire, J. E.

1999-01-01

The development of a cryogenic insulation system for operation under soft vacuum is presented in this paper. Conventional insulation materials for cryogenic applications can be divided into three levels of thermal performance, in terms of apparent thermal conductivity [k-value in milliwatt per meter-kelvin (mW/m-K)]. System k-values below 0.1 can be achieved for multilayer insulation operating at a vacuum level below 1 x 10(exp -4) torr. For fiberglass or powder operating below 1 x 10(exp -3) torr, k-values of about 2 are obtained. For foam and other materials at ambient pressure, k-values around 30 are typical. New industry and aerospace applications require a versatile, robust, low-cost thermal insulation with performance in the intermediate range. The target for the new composite insulation system is a k-value below 4.8 mW/m-K (R-30) at a soft vacuum level (from 1 to 10 torr) and boundary temperatures of approximately 77 and 293 kelvin (K). Many combinations of radiation shields, spacers, and composite materials were tested from high vacuum to ambient pressure using cryostat boiloff methods. Significant improvement over conventional systems in the soft vacuum range was demonstrated. The new layered composite insulation system was also shown to provide key benefits for high vacuum applications as well.

Comparative Evaluation of Vacuum-based Surface Sampling ...

EPA Pesticide Factsheets

Journal Article Following a biological contamination incident, collection of surface samples is necessary to determine the extent and level of contamination, and to deem an area safe for reentry upon decontamination. Current sampling strategies targeting Bacillus anthracis spores prescribe vacuum-based methods for rough and/or porous surfaces. In this study, four commonly-used B. anthracis spore sampling devices (vacuum socks, 37 mm 0.8 µm MCE filter cassettes, 37 mm 0.3 µm PTFE filter cassettes, and 3MTM forensic filters) were comparatively evaluated for their ability to recover surface-associated spores. The vacuum sock device was evaluated at two sampling speeds (slow and fast), resulting in five total methods evaluated. Aerosolized spores (~105 cm-2) of a surrogate Bacillus species (Bacillus atrophaeus) were allowed to settle onto three material types (concrete, carpet, and upholstery). Ten replicate samples were collected using each vacuum method, from each of the three material types. In addition, stainless steel (i.e., nonporous) surfaces inoculated simultaneously were sampled with pre-moistened wipes. Recoveries from wipes of steel surfaces were utilized to verify the inoculum, and to normalize vacuum-based recoveries across trials. Recovery (CFU cm-2) and relative recovery (vacuum recovery/wipe recovery) were determined for each method and material type. Relative recoveries were compared by one-way and three-way ANOVA. Data analysis by one-

A microelectronics approach for the ROSETTA surface science package

NASA Technical Reports Server (NTRS)

Sandau, Rainer (Editor); Alkalaj, Leon

1996-01-01

In relation to the Rosetta surface science package, the benefits of the application of advanced microelectronics packaging technologies and other output from the Mars environmental survey (MESUR) integrated microelectronics study are reported on. The surface science package will be designed to operate for tens of hours. Its limited mass and power consumption make necessary a highly integrated design with all the instruments and subunits operated from a centralized control and information management subsystem.

Electric Field Control of Magnetism Using BiFeO3-Based Heterostructures

DTIC Science & Technology

2014-04-22

dissipation in the form of heat has become a center stage issue for the microelectronics industry. By taking advantage of the strong correlations...speed and storage density, significant energy dissipation in the form of heat has become a center stage issue for the microelectronics industry. By...and storage density, significant energy dissipation in the form of heat has become a center stage issue for the microelectronics industry. By taking

Experiences with integral microelectronics on smart structures for space

NASA Astrophysics Data System (ADS)

Nye, Ted; Casteel, Scott; Navarro, Sergio A.; Kraml, Bob

1995-05-01

One feature of a smart structure implies that some computational and signal processing capability can be performed at a local level, perhaps integral to the controlled structure. This requires electronics with a minimal mechanical influence regarding structural stiffening, heat dissipation, weight, and electrical interface connectivity. The Advanced Controls Technology Experiment II (ACTEX II) space-flight experiments implemented such a local control electronics scheme by utilizing composite smart members with integral processing electronics. These microelectronics, tested to MIL-STD-883B levels, were fabricated with conventional thick film on ceramic multichip module techniques. Kovar housings and aluminum-kapton multilayer insulation was used to protect against harsh space radiation and thermal environments. Development and acceptance testing showed the electronics design was extremely robust, operating in vacuum and at temperature range with minimal gain variations occurring just above room temperatures. Four electronics modules, used for the flight hardware configuration, were connected by a RS-485 2 Mbit per second serial data bus. The data bus was controlled by Actel field programmable gate arrays arranged in a single master, four slave configuration. An Intel 80C196KD microprocessor was chosen as the digital compensator in each controller. It was used to apply a series of selectable biquad filters, implemented via Delta Transforms. Instability in any compensator was expected to appear as large amplitude oscillations in the deployed structure. Thus, over-vibration detection circuitry with automatic output isolation was incorporated into the design. This was not used however, since during experiment integration and test, intentionally induced compensator instabilities resulted in benign mechanical oscillation symptoms. Not too surprisingly, it was determined that instabilities were most detectable by large temperature increases in the electronics, typically noticeable within minutes of unstable operation.

VOLATILE ORGANO-METALLOIDS IN BIO-SOLID MATERIALS: ANALYSIS BY VACUUM DISTILLATION-GC/MS

EPA Science Inventory

An analytical method based on vacuum distillation-gas chromatography-mass spectrometry (VD-GC-MS)

was developed for determining volatile organo-metalloid contaminants in bio-solid materials. Method

performance was evaluated for dimethylselenide (DMSe), dimethyldisel...

Fabrication of planarised conductively patterned diamond for bio-applications.

PubMed

Tong, Wei; Fox, Kate; Ganesan, Kumaravelu; Turnley, Ann M; Shimoni, Olga; Tran, Phong A; Lohrmann, Alexander; McFarlane, Thomas; Ahnood, Arman; Garrett, David J; Meffin, Hamish; O'Brien-Simpson, Neil M; Reynolds, Eric C; Prawer, Steven

2014-10-01

The development of smooth, featureless surfaces for biomedical microelectronics is a challenging feat. Other than the traditional electronic materials like silicon, few microelectronic circuits can be produced with conductive features without compromising the surface topography and/or biocompatibility. Diamond is fast becoming a highly sought after biomaterial for electrical stimulation, however, its inherent surface roughness introduced by the growth process limits its applications in electronic circuitry. In this study, we introduce a fabrication method for developing conductive features in an insulating diamond substrate whilst maintaining a planar topography. Using a combination of microwave plasma enhanced chemical vapour deposition, inductively coupled plasma reactive ion etching, secondary diamond growth and silicon wet-etching, we have produced a patterned substrate in which the surface roughness at the interface between the conducting and insulating diamond is approximately 3 nm. We also show that the patterned smooth topography is capable of neuronal cell adhesion and growth whilst restricting bacterial adhesion. Copyright © 2014 Elsevier B.V. All rights reserved.

The microstructure matters: breaking down the barriers with single crystalline silicon as negative electrode in Li-ion batteries

PubMed Central

Sternad, M.; Forster, M.; Wilkening, M.

2016-01-01

Silicon-based microelectronics forms a major foundation of our modern society. Small lithium-ion batteries act as the key enablers of its success and have revolutionised portable electronics used in our all everyday’s life. While large-scale LIBs are expected to help establish electric vehicles, on the other end of device size chip-integrated Si-based μ-batteries may revolutionise microelectronics once more. In general, Si is regarded as one of the white hopes since it offers energy densities being ten times higher than conventional anode materials. The use of monocrystalline, wafer-grade Si, however, requires several hurdles to be overcome since it its volume largely expands during lithiation. Here, we will show how 3D patterned Si wafers, prepared by the sophisticated techniques from semiconductor industry, are to be electrochemically activated to overcome these limitations and to leverage their full potential being reflected in stable charge capacities (>1000 mAhg–1) and high Coulomb efficiencies (98.8%). PMID:27531589

Advanced optical modeling of TiN metal hard mask for scatterometric critical dimension metrology

NASA Astrophysics Data System (ADS)

Ebersbach, Peter; Urbanowicz, Adam M.; Likhachev, Dmitriy; Hartig, Carsten

2017-03-01

The majority of scatterometric production control models assume constant optical properties of the materials and only dimensional parameters are allowed to vary. However, this assumption, especially in case of thin-metal films, negatively impacts model precision and accuracy. In this work we focus on optical modeling of the TiN metal hardmask for scatterometry applications. Since the dielectric function of TiN exhibits thickness dependence, we had to take this fact into account. Moreover, presence of the highly absorbing films influences extracted thicknesses of dielectric layers underneath the metal films. The later phenomenon is often not reflected by goodness of fit. We show that accurate optical modeling of metal is essential to achieve desired scatterometric model quality for automatic process control in microelectronic production. Presented modeling methodology can be applied to other TiN applications such as diffusion barriers and metal gates as well as for other metals used in microelectronic manufacturing for all technology nodes.

Reproductive Hazards Still Persist in the Microelectronics Industry: Increased Risk of Spontaneous Abortion and Menstrual Aberration among Female Workers in the Microelectronics Industry in South Korea.

PubMed

Kim, Inah; Kim, Myoung-Hee; Lim, Sinye

2015-01-01

Despite the global expansion of supply chains and changes to the production process, few studies since the mid-1990 s and 2000s have examined reproductive risks of the microelectronics industry; we examined the reproductive risks among female microelectronics workers in South Korea. Based on claim data from the National Health Insurance (2008-2012), we estimated age-specific rates of spontaneous abortion (SAB) and menstrual aberration (MA) among women aged 20 to 39 years. We compared data between microelectronics workers and three different control groups: economically inactive women, the working population as a whole, and workers employed in the bank industry. For an effect measure, age-stratified relative risks (RRs) were estimated. Female workers in the microelectronics industry showed significantly higher risk for SAB and MA compared to control groups. The RRs for SAB with reference to economically inactive women, working population, and bank workers in their twenties were 1.57, 1.40, and 1.37, respectively, and the RRs for MA among females in their twenties were 1.54, 1.38, and 1.48, respectively. For women in their thirties, RRs for SAB were 1.58, 1.67, and 1.13, and those for MA were 1.25, 1.35, and 1.23 compared to the three control populations, respectively. All RRs were statistically significant at a level of 0.05, except for the SAB case comparison with bank workers in their thirties. Despite technical innovations and health and safety measures, female workers in microelectronics industry in South Korea have high rates of SAB and MA, suggesting continued exposure to reproductive hazards. Further etiologic studies based on primary data collection and careful surveillance are required to confirm these results.

[Noncollagen bone proteins use in the composition of osteoplactic material Gapkol modified by vacuum].

PubMed

Volozhin, A I; Grigor'ian, A S; Desiatnichenko, K S; Ozhelevskaia, S A; Doktorov, A A; Kurdiumov, S G; Fionova, E V; Gurin, A N; Karakov, K G

2008-01-01

In rat experiments the ability of noncollagen bone proteins (NCBP) in the composition of osteoplactic modified material Gapkol (not tanned in formalin and subjected to vacuum extraction) to increase bone reparation in comparison with traditional Gapkol was studied. Quantitative evaluation was performed on rat parietal bone and qualitative evaluation was performed on rat mandible. It was shown that Gapkol with NCBP (not tanned in formalin and subjected to vacuum extraction) increased reparative osteogenesis.

Fundamental Materials Studies for Advanced High Power Microwave and Terahertz Vacuum Electronic Radiation Sources

DTIC Science & Technology

2014-12-10

AFRL-OSR-VA-TR-2014-0359 Fundamental Materials Studies for Advanced High Power Microwave and Terahertz John Booske UNIVERSITY OF WISCONSIN SYSTEM...12-2014 Final Technical Performance Report October 1, 2011 - September 30, 2014 Fundamental Materials Studies for Advanced High Power Microwave and...emission-barrier scandate cathodes and identify related, alternative cathode materials systems for advanced vacuum electronic cathodes for high power THz

Method for synthesizing ultrafine powder materials

DOEpatents

Buss, Richard J.; Ho, Pauline

1988-01-01

A method for synthesizing ultrafine powder materials, for example, ceramic and metal powders, comprises admitting gaseous reactants from which the powder material is to be formed into a vacuum reaction chamber maintained at a pressure less than atmospheric and at a temperature less than about 400.degree. K. (127.degree.C.). The gaseous reactants are directed through a glow discharge provided in the vacuum reaction chamber to form the ultrafine powder material.

Outgassing data for spacecraft materials

NASA Technical Reports Server (NTRS)

Campbell, W. A., Jr.; Marriott, R. S.; Park, J. J.

1980-01-01

A system for determining the mass loss in vacuum and for collecting the outgassed compounds was developed. Outgassing data, derived from tests at 398 K (125 degrees C) for 24 hours in vacuum as per ASTM E 59577, are compiled for numerous materials for spacecraft use. The data presented are the total mass loss (TML) and the collected volatile condensable materials (CVCM). The various materials are compiled by likely usage and alphabetically.

The Co-60 gamma-ray irradiation effects on the Al/HfSiO4/p-Si/Al MOS capacitors

NASA Astrophysics Data System (ADS)

Lok, R.; Kaya, S.; Karacali, H.; Yilmaz, E.

2017-12-01

In this work, the initial interface trap density (Nit) to examine device compability for microelectronics and then the Co-60 gamma irradiation responses of Al/HfSiO4/p-Si/Al (MOS) capacitors were investigated in various dose ranges up to 70 Gy. Pre-irradiation response of the devices was evaluated from high frequency (HF) and low frequency (LF) capacitance method and the Nit was calculated as 9.91 × 1011 cm-2 which shows that the HfSiO4/p-Si interface quality is convenient for microelectronics applications. The irradiation responses of the devices were carried out from flat-band and mid-gap voltage shifts obtained from stretch of capacitance characteristics prior to and after irradiation. The results show that the flat band voltages very slightly shifted to positive voltage values demonstrating the enhancement of negative charge trapping in device structure. The sensitivity of the Al/HfSiO4/p-Si/Al MOS capacitors was found to be 4.41 mV/Gy for 300 nm-thick HfSiO4 gate dielectrics. This value approximately 6.5 times smaller compared to the same thickness conventional SiO2 based MOS devices. Therefore, HfSiO4 exhibits crucial irradiation tolerance in gamma irradiation environment. Consequently, HfSiO4 dielectrics may have significant usage for microelectronic technology as a radiation hard material where radiation field exists such as in space applications.

Microelectronics and nanotechnology, and the fractal-like structure of information, knowledge, and science

NASA Astrophysics Data System (ADS)

Nutu, Catalin Silviu; Axinte, Tiberiu

2016-12-01

The article is centralizing and is concentrating the information from a considerable amount of papers related to the field of microelectronics and nanotechnology and also provides an approach to science and to the future evolution of science, based on the theory of the fractals. The new science of microelectronics and nanotechnology is one of the best examples of how the science of future will look like, namely at the confluence of increasingly more other sciences, where increasingly more sciences are to be added in the structure of the new science and the role of the multidisciplinary and interdisciplinary is becoming more and more important. Although not giving explicit details (e.g. specific formulas) the theory of fractals is used in the paper to explain the way of generation of new science for the specific case of microelectronics and nanotechnology, but is also used in the paper to outline a different way to approach new science and eventually to approach new sciences to come. There are mainly two motivations for the present article, namely: on the one hand, the position of the microelectronics and nanotechnologies in the fractal-like structure of science, and, on the other hand, that much of the communication, information, knowledge and science transfer, dissemination and advancement in sciences are taking place using the new technologies related to microelectronics and nanotechnologies.

JPRS report: Science and Technology. Europe and Latin America

NASA Astrophysics Data System (ADS)

1988-01-01

Articles from the popular and trade press are included on the following subjects: advanced materials, aerospace industry, automotive industry, biotechnology, computers, factory automation and robotics, microelectronics, and science and technology policy. The aerospace articles discuss briefly and in a nontechnical way the SAGEM bubble memories for space applications, Ariane V new testing facilities, innovative technologies of TDF-1 satellite, and the restructuring of the Aviation Division at France's Aerospatiale.

Developments of the studies on the polymerization under microgravity

NASA Astrophysics Data System (ADS)

Li, Ping; Yi, Zongchun

Microgravity has been recognized as a new and useful way of processing materials for pharmacology biology and microelectronic In microgravity there is no direction for gravity sensitive processes which take part in crystal growth convection sedimentation physical--chemical processes in biological objects The absent of gravity leads to the possibility of synthesis of new materials which cannot be prepared on Earth The perspective for possible biotechnological applications gave an impetus to a series of experiments on polymerization in space by NASA Rocket-Space Corporation RSC ENERGIYA the Institute of Bioorganic Chemistry Uzbekistan and so on The influence of microgravity on polymerization is based on the exclusion of convection and sedimentation processes in curing polymer Under microgravity condition a frontal polymerization process and creation of high homogeneous polyacrilamide gel were observed 1 Thus a much better resolution result of proteins by electrophoresis on orbital PAG matrices was obtained than that on terrestrial PAG matrices A deeper understanding of conditions responsible for generation of physical properties of PAG synthesized on the Earth was a strong motivation for seeking gravity-sensitive mechanisms of polymerization The polymerization under microgravity can potentially applied on functional polymer The conductive polymer such as polypyrrole is usually utilized especially for microelectronics The polymerization of pyrrole in microgravity conditions was made to prepare polymer particles having shapes

Production of Magnesium by Vacuum Aluminothermic Reduction with Magnesium Aluminate Spinel as a By-Product

NASA Astrophysics Data System (ADS)

Wang, Yaowu; You, Jing; Peng, Jianping; Di, Yuezhong

2016-06-01

The Pidgeon process currently accounts for 85% of the world's magnesium production. Although the Pidgeon process has been greatly improved over the past 10 years, such production still consumes much energy and material and creates much pollution. The present study investigates the process of producing magnesium by employing vacuum aluminothermic reduction and by using magnesite as material and obtaining magnesium aluminate spinel as a by-product. The results show that compared with the Pidgeon process, producing magnesium by vacuum aluminothermic reduction can save materials by as much as 50%, increase productivity up to 100%, and save energy by more than 50%. It can also reduce CO2 emission by up to 60% and realize zero discharge of waste residue. Vacuum aluminothermic reduction is a highly efficient, low-energy-consumption, and environmentally friendly method of producing magnesium.

Macro management of microelectronics in India in 1990s

NASA Astrophysics Data System (ADS)

Gupta, Parmod K.

1992-08-01

Development of microelectronics is taking place at a very fast rate all over the globe, including India. New technologies are introduced at very short intervals in order to capture the consumer market. It is essential that these technologies are managed properly at the macro level in order to bring the desired results. Microelectronics plays a very vital role in office automation for achieving cost effective results in a highly competitive environment. Introduction of various facilities like laser printers, photo copiers, dictaphone-selectronic boards, electronic telexes, teleconference rooms, telephone answering machines, computer, word processors, sensors, etc. have all revolutionized the industry. Keeping the above in view, the present and future status of microelectronics, with special emphasis on its role in office automation in India, are discussed in detail in this paper.

Sorption vacuum trap

NASA Technical Reports Server (NTRS)

Barrington, A. E.; Caruso, A. J.

1970-01-01

Modified sorption trap for use in high vacuum systems contains provisions for online regeneration of sorbent material. Trap is so constructed that it has a number of encapsulated resistance heaters and a valving and pumping device for removing gases from heated sorbing material. Excessive downtime is eliminated with this trap.

Center for Space Microelectronics Technology. 1993 Technical Report

NASA Technical Reports Server (NTRS)

1995-01-01

The 1993 Technical Report of the Jet Propulsion Laboratory Center for Space Microelectronics Technology summarizes the technical accomplishments, publications, presentations, and patents of the Center during the past year. The report lists 170 publications, 193 presentations, and 84 New Technology Reports and patents. The 1993 Technical Report of the Jet Propulsion Laboratory Center for Space Microelectronics Technology summarizes the technical accomplishments, publications, presentations, and patents of the Center during the past year. The report lists 170 publications, 193 presentations, and 84 New Technology Reports and patents.

Electron Technology: ELTE 2016

NASA Astrophysics Data System (ADS)

Pisarkiewicz, Tadeusz; Kucewicz, Wojciech

2016-12-01

In this paper we present a review of research results and technical accomplishments presented by researchers from technical universities, governmental institutes and research companies during the XIIth Scientific Conference Electron Technology, ELTE 2016. This review is based on materials presented at four topical conference sessions: Microelectronics and Nanoelectronics, Photonics, Materials and Technologies, and Microsystems and also on materials presented by invited speakers at two dedicated sessions. Oral sessions were accompanied by the poster sessions. In effect about 50 papers gathered in this volume reflect the topics discussed at the Conference. A short description of technological and measurement possibilities in the laboratories of Academic Centre for Materials and Nanotechnology and also in the Department of Electronics of the Faculty of Computer Science, Electronics and Telecommunications AGH UST are given.

Terrestrial Sources of X-Ray Radiation and Their Effects on NASA Flight Hardware

NASA Technical Reports Server (NTRS)

Kniffin, Scott

2016-01-01

X-rays are an energetic and penetrating form of ionizing electromagnetic radiation, which can degrade NASA flight hardware. The main concern posed by such radiation is degradation of active electronic devices and, in some cases, diodes. Non-electronic components are only damaged at doses that far exceed the point where any electronic device would be destroyed. For the purposes of this document, flight hardware can be taken to mean an entire instrument, the flight electronics within the instrument or the individual microelectronic devices in the flight electronics. This document will discuss and describe the ways in which NASA flight hardware might be exposed to x-rays, what is and isn't a concern, and how to tell the difference. First, we must understand what components in flight hardware may be vulnerable to degradation or failure as a result of being exposed to ionizing radiation, such as x-rays. As stated above, bulk materials (structural metals, plastics, etc.) are generally only affected by ionizing radiation at very high dose levels. Likewise, passive electronic components (e.g. resistors, capacitors, most diodes) are strongly resistant to exposure to x-rays, except at very high doses. The main concerns arise when active components, that is, components like discrete transistors and microelectronic devices, are exposed to ionizing radiation. Active components are designed to respond to minute changes in currents and voltages in the circuit. As such, it is not surprising that exposure to ionizing radiation, which creates ionized and therefore electrically active particles, may degrade the way the hardware performs. For the most part, the mechanism for this degradation is trapping of the charges generated by ionizing radiation by defects in dielectric materials in the hardware. As such, the degree of damage is a function of both the quantity of ionizing radiation exposure and the physical characteristics of the hardware itself. The metric that describes the level of exposure to ionizing radiation is total ionizing dose (TID). The unit of TID is the rad, which is defined as 100 ergs absorbed per gram of material. Dose can be expressed in other units, for example grays (gy), where 1 gy = 100 rads. The actual fluence of radiation needed to deliver a rad depends on the absorbing material, so units of dose are usually stated in reference to the material of interest. That is, for microelectronic devices, the unit of dose is generally rad (Si) or rad (SiO2). However, the definition of absorbed dose in this fashion has the advantage that the type of radiation causing the ionization can be normalized so that a realistic and adequate comparison can be made. The sensitivity of microelectronic parts to TID varies over many orders of magnitude. (Note: Doses to humans are typically expressed in rems-or roentgen-equivalent-man-which measures tissue damage, and depends on the type of radiation, as well as the dose in rads.) Thus far, the "softest" parts tested at NASA showed damage at 500 rads (Si), while parts that are radiation-hardened by design can remain functional to doses on the order of 107 rads (Si). This broad range of sensitivity highlights one of the most important considerations when considering the effects of radiation on electronic parts: In order to determine whether a radiation exposure is a concern for a particular part, one must understand the technologies used in the part and their vulnerabilities to TID damage. A NASA radiation expert should be consulted to obtain such information.

Laser-triggered vacuum switch

DOEpatents

Brannon, Paul J.; Cowgill, Donald F.

1990-01-01

A laser-triggered vacuum switch has a material such as a alkali metal halide on the cathode electrode for thermally activated field emission of electrons and ions upon interaction with a laser beam, the material being in contact with the cathode with a surface facing the discharge gap. The material is preferably a mixture of KCl and Ti powders. The laser may either shine directly on the material, preferably through a hole in the anode, or be directed to the material over a fiber optic cable.

Laser-triggered vacuum switch

DOEpatents

Brannon, P.J.; Cowgill, D.F.

1990-12-18

A laser-triggered vacuum switch has a material such as a alkali metal halide on the cathode electrode for thermally activated field emission of electrons and ions upon interaction with a laser beam, the material being in contact with the cathode with a surface facing the discharge gap. The material is preferably a mixture of KCl and Ti powders. The laser may either shine directly on the material, preferably through a hole in the anode, or be directed to the material over a fiber optic cable. 10 figs.

TID Effects of High-Z Material Spot Shields on FPGA Using MPTB Data

NASA Technical Reports Server (NTRS)

Hardage, Donna (Technical Monitor); Crain, S. H.; Mazur, J. E.; Looper, M. D.

2003-01-01

An experiment on the Microelectronics and Photonics Test Bed (MPTB) was testing lield programmable gate arrays using spot shields to extend the life of some of the devices being tested. It was expected that the unshielded parts would fail from a total ionizing dose (TID) and yet the opposite occurred. The data show that the devices failing from the TID effects are those with the spot shields attached. This effort is to determine the mechanism by which the environment is interacting with the high-Z material to enhance the TID in these field programmable gate arrays.

NASA Innovation Builds Better Nanotubes

NASA Technical Reports Server (NTRS)

2008-01-01

Nanotailor Inc., based in Austin, Texas, licensed Goddard Space Flight Center's unique single-walled carbon nanotube (SWCNT) fabrication process with plans to make high-quality, low-cost SWCNTs available commercially. Carbon nanotubes are being used in a wide variety of applications, and NASA's improved production method will increase their applicability in medicine, microelectronics, advanced materials, and molecular containment. Nanotailor built and tested a prototype based on Goddard's process, and is using this technique to lower the cost and improve the integrity of nanotubes, offering a better product for use in biomaterials, advanced materials, space exploration, highway and building construction, and many other applications.

Beam loss reduction by magnetic shielding using beam pipes and bellows of soft magnetic materials

NASA Astrophysics Data System (ADS)

Kamiya, J.; Ogiwara, N.; Hotchi, H.; Hayashi, N.; Kinsho, M.

2014-11-01

One of the main sources of beam loss in high power accelerators is unwanted stray magnetic fields from magnets near the beam line, which can distort the beam orbit. The most effective way to shield such magnetic fields is to perfectly surround the beam region without any gaps with a soft magnetic high permeability material. This leads to the manufacture of vacuum chambers (beam pipes and bellows) with soft magnetic materials. A Ni-Fe alloy (permalloy) was selected for the material of the pipe parts and outer bellows parts, while a ferritic stainless steel was selected for the flanges. An austenitic stainless steel, which is non-magnetic material, was used for the inner bellows for vacuum tightness. To achieve good magnetic shielding and vacuum performances, a heat treatment under high vacuum was applied during the manufacturing process of the vacuum chambers. Using this heat treatment, the ratio of the integrated magnetic flux density along the beam orbit between the inside and outside of the beam pipe and bellows became small enough to suppress beam orbit distortion. The outgassing rate of the materials with this heat treatment was reduced by one order magnitude compared to that without heat treatment. By installing the beam pipes and bellows of soft magnetic materials as part of the Japan Proton Accelerator Research Complex 3 GeV rapid cycling synchrotron beam line, the closed orbit distortion (COD) was reduced by more than 80%. In addition, a 95.5% beam survival ratio was achieved by this COD improvement.

NASA Tech Briefs, November 2013

NASA Technical Reports Server (NTRS)

2013-01-01

Topics include: Cryogenic Liquid Sample Acquisition System for Remote Space Applications; 5 Spatial Statistical Data Fusion (SSDF); GPS Estimates of Integrated Precipitable Water Aid Weather Forecasters; Integrating a Microwave Radiometer into Radar Hardware for Simultaneous Data Collection Between the Instruments; Rapid Detection of Herpes Viruses for Clinical Applications; High-Speed Data Recorder for Space, Geodesy, and Other High-Speed Recording Applications; Datacasting V3.0; An All-Solid-State, Room-Temperature, Heterodyne Receiver for Atmospheric Spectroscopy at 1.2 THz; Stacked Transformer for Driver Gain and Receive Signal Splitting; Wireless Integrated Microelectronic Vacuum Sensor System; Fabrication Method for LOBSTER-Eye Optics in <110> Silicon; Compact Focal Plane Assembly for Planetary Science; Fabrication Methods for Adaptive Deformable Mirrors; Visiting Vehicle Ground Trajectory Tool; Workflow-Based Software Development Environment; Mobile Thread Task Manager; A Kinematic Calibration Process for Flight Robotic Arms; Magnetostrictive Alternator; Bulk Metallic Glasses and Composites for Optical and Compliant Mechanisms; Detection of Only Viable Bacterial Spores Using a Live/Dead Indicator in Mixed Populations; and Intravenous Fluid Generation System.

PhoneSat: Ground Testing of a Phone-Based Prototype Bus

NASA Technical Reports Server (NTRS)

Felix, Carmen; Howard, Benjamin; Reyes, Matthew; Snarskiy, Fedor; Hickman, Ryan; Boshuizen, Christopher; Marshall, William

2010-01-01

Most of the key capabilities that are requisite of a satellite bus are housed in today's smart phones. PhoneSat refers to an initiative to build a ground-based prototype vehicle that could all the basic functionality of a satellite, including attitude control, using a smart Phone as its central hardware. All components used were also low cost Commercial off the Shelf (COTS). In summer 2009, an initial prototype was created using the LEGO Mindstorm toolkit demonstrating simple attitude control. Here we report on a follow up initiative to design, build and test a vehicle based on the Google s smart phone Nexus One. The report includes results from initial thermal-vacuum chamber tests and low altitude sub-orbital rocket flights which show that, at least for short durations, the Nexus One phone is able to withstand key aspects of the space environment without failure. We compare the sensor data from the Phone's accelerometers and magnetometers with that of an external microelectronic inertial measurement unit.

Telerobotic electronic materials processing experiment

NASA Technical Reports Server (NTRS)

Ollendorf, Stanford

1991-01-01

The Office of Commercial Programs (OCP), working in conjunction with NASA engineers at the Goddard Space Flight Center, is supporting research efforts in robot technology and microelectronics materials processing that will provide many spinoffs for science and industry. The Telerobotic Materials Processing Experiment (TRMPX) is a Shuttle-launched materials processing test payload using a Get Away Special can. The objectives of the project are to define, develop, and demonstrate an automated materials processing capability under realistic flight conditions. TRMPX will provide the capability to test the production processes that are dependent on microgravity. The processes proposed for testing include the annealing of amorphous silicon to increase grain size for more efficient solar cells, thin film deposition to demonstrate the potential of fabricating solar cells in orbit, and the annealing of radiation damaged solar cells.

Direct write with microelectronic circuit fabrication

DOEpatents

Drummond, T.; Ginley, D.

1988-05-31

In a process for deposition of material onto a substrate, for example, the deposition of metals for dielectrics onto a semiconductor laser, the material is deposited by providing a colloidal suspension of the material and directly writing the suspension onto the substrate surface by ink jet printing techniques. This procedure minimizes the handling requirements of the substrate during the deposition process and also minimizes the exchange of energy between the material to be deposited and the substrate at the interface. The deposited material is then resolved into a desired pattern, preferably by subjecting the deposit to a laser annealing step. The laser annealing step provides high resolution of the resultant pattern while minimizing the overall thermal load of the substrate and permitting precise control of interface chemistry and interdiffusion between the substrate and the deposit. 3 figs.

Direct write with microelectronic circuit fabrication

DOEpatents

Drummond, Timothy; Ginley, David

1992-01-01

In a process for deposition of material onto a substrate, for example, the deposition of metals or dielectrics onto a semiconductor laser, the material is deposited by providing a colloidal suspension of the material and directly writing the suspension onto the substrate surface by ink jet printing techniques. This procedure minimizes the handling requirements of the substrate during the deposition process and also minimizes the exchange of energy between the material to be deposited and the substrate at the interface. The deposited material is then resolved into a desired pattern, preferably by subjecting the deposit to a laser annealing step. The laser annealing step provides high resolution of the resultant pattern while minimizing the overall thermal load of the substrate and permitting precise control of interface chemistry and interdiffusion between the substrate and the deposit.

Development and mechanical properties of construction materials from lunar simulant

NASA Technical Reports Server (NTRS)

Desai, Chandra S.

1992-01-01

Development of versatile engineering materials from locally available materials in space is an important step toward the establishment of outposts on the Moon and Mars. Development of the technologies for manufacture of structural and construction materials on the Moon, utilizing local lunar soil (regolith), without the use of water, is an important element for habitats and explorations in space. It is also vital that the mechanical behavior such as strength and tensile, flexural properties, fracture toughness, ductility, and deformation characteristics are defined toward establishment of the ranges of engineering applications of the materials developed. The objectives include two areas: (1) thermal 'liquefaction' of lunar simulant (at about 1100 C) with different additives (fibers, powders, etc.), and (2) development and use of a new triaxial test device in which lunar simulants are first compacted under cycles of loading, and then tested with different vacuums and initial confining or in situ stress. Details of the development of intermediate ceramic composites (ICC) and testing for their flexural and compression characteristics were described in various reports and papers. The subject of behavior of compacted simulant under vacuum was described in previous progress reports and publications; since the presently available device allows vacuum levels up to only 10(exp -4) torr, it is recommended that a vacuum pump that can allow higher levels of vacuum be utilized for further investigation.

Method of using sacrificial materials for fabricating internal cavities in laminated dielectric structures

DOEpatents

Peterson, Kenneth A [Albuquerque, NM

2009-02-24

A method of using sacrificial materials for fabricating internal cavities and channels in laminated dielectric structures, which can be used as dielectric substrates and package mounts for microelectronic and microfluidic devices. A sacrificial mandrel is placed in-between two or more sheets of a deformable dielectric material (e.g., unfired LTCC glass/ceramic dielectric), wherein the sacrificial mandrel is not inserted into a cutout made in any of the sheets. The stack of sheets is laminated together, which deforms the sheet or sheets around the sacrificial mandrel. After lamination, the mandrel is removed, (e.g., during LTCC burnout), thereby creating a hollow internal cavity in the monolithic ceramic structure.

Electronic ferroelectricity in carbon-based systems: from reality of organic conductors to promises of polymers and graphene nano-ribbons

NASA Astrophysics Data System (ADS)

Kirova, Natasha; Brazovskii, Serguei

2014-03-01

Ferroelectricity is a rising demand in fundamental and applied solid state physics. Ferroelectrics are used in microelectronics as active gate materials, in capacitors, electro-optical-acoustic modulators, etc. There is a particular demand for plastic ferroelectrics, e.g. as a sensor for acoustic imaging in medicine and beyond, in shapeable capacitors, etc. Microscopic mechanisms of ferroelectric polarization in traditional materials are typically ionic. In this talk we discuss the electronic ferroelectrics - carbon-based materials: organic crystals, conducting polymers and graphene nano-ribbons. The motion of walls, separating domains with opposite electric polarisation, can be influenced and manipulated by terahertz and infra-red range optics.

Water absorption and desorption in shuttle ablator and insulation materials

NASA Technical Reports Server (NTRS)

Whitaker, A. F.; Smith, C. F.; Wooden, V. A.; Cothren, B. E.; Gregory, H.

1982-01-01

Shuttle systems ablator and insulation materials underwent water soak with subsequent water desorption in vacuum. Water accumulation in these materials after a soak for 24 hours ranged from +1.1% for orbiter tile to +161% for solid rocket booster MSA-1. After 1 minute in vacuum, water retention ranged from none in the orbiter tile to +70% for solid rocket booster cork.

Development of Subischial Prosthetic Sockets with Vacuum-Assisted Suspension for Highly Active Persons with Transfemoral Amputations

DTIC Science & Technology

2012-10-01

materials to facilitate dissemination of this technique. 15. SUBJECT TERMS Transfemoral amputation, sub-ischial socket, prosthesis , vacuum-assisted...an appropriate mechanical pump to create suitable vacuum for suspension of the prosthesis ...sockets of highly active prosthesis users

Influence of vacuum chamber impurities on the lifetime of organic light-emitting diodes

PubMed Central

Fujimoto, Hiroshi; Suekane, Takashi; Imanishi, Katsuya; Yukiwaki, Satoshi; Wei, Hong; Nagayoshi, Kaori; Yahiro, Masayuki; Adachi, Chihaya

2016-01-01

We evaluated the influence of impurities in the vacuum chamber used for the fabrication of organic light-emitting diodes on the lifetime of the fabricated devices and found a correlation between lifetime and the device fabrication time. The contact angle of the ITO substrates stored the chamber under vacuum were used to evaluate chamber cleanliness. Liquid chromatography-mass spectrometry was performed on Si wafers stored in the vacuum chamber before device fabrication to examine the impurities in the chamber. Surprisingly, despite the chamber and evaporation sources being at room temperature, a variety of materials were detected, including previously deposited materials and plasticizers from the vacuum chamber components. We show that the impurities, and not differences in water content, in the chamber were the source of lifetime variations even when the duration of exposure to impurities only varied before and after deposition of the emitter layer. These results suggest that the impurities floating in the vacuum chamber significantly impact lifetime values and reproducibility. PMID:27958304

Influence of vacuum chamber impurities on the lifetime of organic light-emitting diodes

NASA Astrophysics Data System (ADS)

Fujimoto, Hiroshi; Suekane, Takashi; Imanishi, Katsuya; Yukiwaki, Satoshi; Wei, Hong; Nagayoshi, Kaori; Yahiro, Masayuki; Adachi, Chihaya

2016-12-01

We evaluated the influence of impurities in the vacuum chamber used for the fabrication of organic light-emitting diodes on the lifetime of the fabricated devices and found a correlation between lifetime and the device fabrication time. The contact angle of the ITO substrates stored the chamber under vacuum were used to evaluate chamber cleanliness. Liquid chromatography-mass spectrometry was performed on Si wafers stored in the vacuum chamber before device fabrication to examine the impurities in the chamber. Surprisingly, despite the chamber and evaporation sources being at room temperature, a variety of materials were detected, including previously deposited materials and plasticizers from the vacuum chamber components. We show that the impurities, and not differences in water content, in the chamber were the source of lifetime variations even when the duration of exposure to impurities only varied before and after deposition of the emitter layer. These results suggest that the impurities floating in the vacuum chamber significantly impact lifetime values and reproducibility.

Fundamental Studies of the Mechanical Behavior of Microelectronic Thin Film Materials

DTIC Science & Technology

1991-01-01

scanning, wafer curvature technique to study the kinetics of crystallization of amorphous silicon. When a thin film of amorphous silicon crystallizes...the film and the kinetics of the crystallization process. We find the tensile stress in the film to increase by about 500 MPa when crystallization...occurs. This is a very large stress that could have significance for device processing and applications. By measuring the kinetics of this stress change

Insinuating electronics in the brain.

PubMed

Hughes, Mark A

2016-08-01

There is an expanding interface between electronic engineering and neurosurgery. Rapid advances in microelectronics and materials science, driven largely by consumer demand, are inspiring and accelerating development of a new generation of diagnostic, therapeutic, and prosthetic devices for implantation in the nervous system. This paper reviews some of the basic science underpinning their development and outlines some opportunities and challenges for their use in neurosurgery. Copyright © 2016 The Author. Published by Elsevier Ltd.. All rights reserved.

JPRS report: Science and technology. Europe and Latin America

NASA Astrophysics Data System (ADS)

1988-01-01

Articles from the popular and trade press of Western Europe and Latin America are presented on advanced materials, aerospace and civial aviation, computers, defense industries, factory automation and robotics, lasers, senors, optics microelectronics, science and technology policy, biotechnology, marine technology, and nuclear developments. The aerospace articles include an overview of Austrian space activities and plans and a report on a panel of West German experts recommending against self-sufficiency for the Airbus.

Perspectives on integrated modeling of transport processes in semiconductor crystal growth

NASA Technical Reports Server (NTRS)

Brown, Robert A.

1992-01-01

The wide range of length and time scales involved in industrial scale solidification processes is demonstrated here by considering the Czochralski process for the growth of large diameter silicon crystals that become the substrate material for modern microelectronic devices. The scales range in time from microseconds to thousands of seconds and in space from microns to meters. The physics and chemistry needed to model processes on these different length scales are reviewed.

Metallurgical coatings and thin films; Proceedings of the International Conference, 18th, San Diego, CA, Apr. 22-26, 1991. Vols. 1 & 2

NASA Technical Reports Server (NTRS)

Mcguire, Gary E. (Editor); Mcintyre, Dale C. (Editor); Hofmann, Siegfried (Editor)

1991-01-01

A conference on metallurgical coatings and thin films produced papers in the areas of coatings for use at high temperatures; hard coatings and deposition technologies; diamonds and related materials; tribological coatings/surface modifications; thin films for microelectronics and high temperature superconductors; optical coatings, film characterization, magneto-optics, and guided waves; and methods for characterizing films and modified surfaces.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kamiya, Junichiro, E-mail: kamiya.junichiro@jaea.go.jp; Hikichi, Yusuke; Kinsho, Michikazu

For the vacuum systems of high-intensity beam accelerators, low radioactivation materials with good vacuum characteristics and high mechanical strength are required. The titanium alloy Ti-6Al-4V was investigated as a potential low activation vacuum material with high mechanical strength for the fabrication of vacuum components, particularly the flanges of beam pipes, in the J-PARC 3 GeV synchrotron. The dose rate of Ti-6Al-4V when irradiated by a 400 MeV proton was observed to decrease more rapidly than that of stainless steel. Furthermore, the generated radioactive isotopes were nuclides with relatively short half-lives. The outgassing rate per unit area of Ti-6Al-4V was approximately 10{sup −8 }Pamore » m{sup 3}/s m{sup 2} after pumping for 100 h, which is the same as the typical value for stainless steel. Additionally, the hydrogen concentration in bulk Ti-6Al-4V was reduced to approximately 1 ppm by vacuum firing at 700 °C for 9 h; the mechanical strength was not reduced by this process. These results indicate that Ti-6Al-4V is a good candidate for use as a low activation vacuum material with high mechanical strength.« less

Lightweight Vacuum Jacket for Cryogenic Insulation. Volume 1

NASA Technical Reports Server (NTRS)

Barclay, D. L.; Bell, J. E.; Brogren, E. W.; Straayer, J. W.

1975-01-01

The feasibility of producing a lightweight vacuum jacket using state-of-the-art technology and materials was examined. Design and analytical studies were made on a full-scale, orbital maneuvering system fuel tank. Preliminary design details were made for the tank assembly, including an optimized vacuum jacket and multilayer insulation system. A half-scale LH2 test model was designed and fabricated, and a force/stiffness proof test was conducted on the vacuum jacket. A vacuum leak rate of .000001 atmosphere ml of helium per second was measured, approximately 1500 hours of vacuum pressure were sustained, and 29 vacuum-pressure cycles were experienced prior to failure.

Lightweight Vacuum Jacket for Cryogenic Insulation - Appendices to Final Report. Volume 2

NASA Technical Reports Server (NTRS)

Barclay, D. L.; Bell, J. E.; Brogren, E. W.; Straayer, J. W.

1975-01-01

The feasibility is demonstrated of producing a lightweight vacuum jacket using state-of-the-art technology and materials. Design and analytical studies were made on an orbital maneuvering system fuel tank. Preliminary design details were completed for the tank assembly which included an optimized vacuum jacket and multilayered insulation system. A half-scale LH2 test model was designed and fabricated and a force/stiffness proof test was conducted on the vacuum jacket. A vacuum leak rate of 0.00001 was measured, approximately 1500 hours of vacuum pressure was sustained, and 29 vacuum pressure cycles were experienced prior to failure. For vol. 1, see N75-26192.

Towards co-packaging of photonics and microelectronics in existing manufacturing facilities

NASA Astrophysics Data System (ADS)

Janta-Polczynski, Alexander; Cyr, Elaine; Bougie, Jerome; Drouin, Alain; Langlois, Richard; Childers, Darrell; Takenobu, Shotaro; Taira, Yoichi; Lichoulas, Ted W.; Kamlapurkar, Swetha; Engelmann, Sebastian; Fortier, Paul; Boyer, Nicolas; Barwicz, Tymon

2018-02-01

The impact of integrated photonics on optical interconnects is currently muted by challenges in photonic packaging and in the dense integration of photonic modules with microelectronic components on printed circuit boards. Single mode optics requires tight alignment tolerance for optical coupling and maintaining this alignment in a cost-efficient package can be challenging during thermal excursions arising from downstream microelectronic assembly processes. In addition, the form factor of typical fiber connectors is incompatible with the dense module integration expected on printed circuit boards. We have implemented novel approaches to interfacing photonic chips to standard optical fibers. These leverage standard high throughput microelectronic assembly tooling and self-alignment techniques resulting in photonic packaging that is scalable in manufacturing volume and in the number of optical IOs per chip. In addition, using dense optical fiber connectors with space-efficient latching of fiber patch cables results in compact module size and efficient board integration, bringing the optics closer to the logic chip to alleviate bandwidth bottlenecks. This packaging direction is also well suited for embedding optics in multi-chip modules, including both photonic and microelectronic chips. We discuss the challenges and rewards in this type of configuration such as thermal management and signal integrity.

Cryogenic Thermal Performance Testing of Bulk-Fill and Aerogel Insulation Materials

NASA Astrophysics Data System (ADS)

Scholtens, B. E.; Fesmire, J. E.; Sass, J. P.; Augustynowicz, S. D.; Heckle, K. W.

2008-03-01

Thermal conductivity testing under actual-use conditions is a key to understanding how cryogenic thermal insulation systems perform in regard to engineering, economics, and materials factors. The Cryogenics Test Laboratory at NASA's Kennedy Space Center tested a number of bulk-fill insulation materials, including aerogel beads, glass bubbles, and perlite powder, using a new cylindrical cryostat. Boundary temperatures for the liquid nitrogen boiloff method were 78 K and 293 K. Tests were performed as a function of cold vacuum pressure under conditions ranging from high vacuum to no vacuum. Results were compared with those from complementary test methods in the range of 20 K to 300 K. Various testing techniques are required to completely understand the operating performance of a material and to provide data for answers to design engineering questions.

Vacuum Technology Considerations For Mass Metrology

PubMed Central

Abbott, Patrick J.; Jabour, Zeina J.

2011-01-01

Vacuum weighing of mass artifacts eliminates the necessity of air buoyancy correction and its contribution to the measurement uncertainty. Vacuum weighing is also an important process in the experiments currently underway for the redefinition of the SI mass unit, the kilogram. Creating the optimum vacuum environment for mass metrology requires careful design and selection of construction materials, plumbing components, pumping, and pressure gauging technologies. We review the vacuum technology1 required for mass metrology and suggest procedures and hardware for successful and reproducible operation. PMID:26989593

Physical Limitations in Lithography for Microelectronics.

ERIC Educational Resources Information Center

Flavin, P. G.

1981-01-01

Describes techniques being used in the production of microelectronics kits which have replaced traditional optical lithography, including contact and optical projection printing, and X-ray and electron beam lithography. Also includes limitations of each technique described. (SK)

LETTERS AND COMMENTS: Permeability measurements in undergraduate vacuum laboratories: a simple experiment using a He leak detector

NASA Astrophysics Data System (ADS)

dos Santos, J. M. F.; Veloso, J. F. C. A.; Monteiro, C. M. B.

2004-01-01

We describe a simple experiment intended for didactic laboratory vacuum classes of undergraduate courses, using a helium leak detector. The helium throughput flowing into the vacuum volume due to the permeability of materials can be taken as a real leak, which can be measured with the helium leak detector. The experiment allows students to perform actual measurements of helium permeability constants of different materials, and access the dependence of the helium permeability throughput on the material thickness, area and helium pressure differential. As an example, a set of measurements are presented for Kapton foils, exhibiting results that are in good agreement with those presented in the literature.

Design, processing and testing of LSI arrays, hybrid microelectronics task

NASA Technical Reports Server (NTRS)

Himmel, R. P.; Stuhlbarg, S. M.; Ravetti, R. G.; Zulueta, P. J.; Rothrock, C. W.

1979-01-01

Mathematical cost models previously developed for hybrid microelectronic subsystems were refined and expanded. Rework terms related to substrate fabrication, nonrecurring developmental and manufacturing operations, and prototype production are included. Sample computer programs were written to demonstrate hybrid microelectric applications of these cost models. Computer programs were generated to calculate and analyze values for the total microelectronics costs. Large scale integrated (LST) chips utilizing tape chip carrier technology were studied. The feasibility of interconnecting arrays of LSU chips utilizing tape chip carrier and semiautomatic wire bonding technology was demonstrated.

Development and mechanical properties of structural materials from lunar simulant

NASA Technical Reports Server (NTRS)

Desai, Chandra S.

1991-01-01

Development of versatile engineering materials from locally available materials in space is an important step toward establishment of outposts such as on the moon and Mars. Here development of the technologies for manufacture of structural and construction materials on the moon, utilizing local lunar soil (regolith), without the use of water, is an important element for habitats and explorations in space. It is also vital that the mechanical behavior such as strength and flexural properties, fracture toughness, ductility, and deformation characteristics are defined toward establishment of the ranges of engineering applications of the materials developed. The objectives include two areas: (1) thermal liquefaction of lunar simulant (at about 1100 C) with different additives (fibers, powders, etc.); and (2) development and use of a traxial test device in which lunar simulants are first compacted under cycles of loading, and then tested with different vacuums and initial confining or insitu stress. The second area was described in previous progress reports and publications; since the presently available device allows vacuum levels up to only 10(exp -4) torr, it is recommended that a vacuum pump that can allow higher levels of vacuum is acquired.

How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

NASA Astrophysics Data System (ADS)

Suhir, E.; Yi, S.; Ghaffarian, R.

2017-03-01

It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

Cryogenic Thermal Performance Testing of Bulk-Fill and Aerogel Insulation Materials

NASA Technical Reports Server (NTRS)

Scholtens, B. E.; Fesmire, J. E.; Sass, J. P.; Augustynowicz, S. D.; Heckle, K. W.

2007-01-01

The research testing and demonstration of new bulk-fill materials for cryogenic thermal insulation systems was performed by the Cryogenics Test Laboratory at NASA Kennedy Space Center. Thermal conductivity testing under actual-use cryogenic conditions is a key to understanding the total system performance encompassing engineering, economics, and materials factors. A number of bulk fill insulation materials, including aerogel beads, glass bubbles, and perlite powder, were tested using a new cylindrical cryostat. Boundary temperatures for the liquid nitrogen boil-off method were 293 K and 78 K. Tests were performed as a function of cold vacuum pressure from high vacuum to no vacuum conditions. Results are compared with other complementary test methods in the range of 300 K to 20 K. Various testing techniques are shown to be required to obtain a complete understanding of the operating performance of a material and to provide data for answers to design engineering questions.

Reproductive Hazards Still Persist in the Microelectronics Industry: Increased Risk of Spontaneous Abortion and Menstrual Aberration among Female Workers in the Microelectronics Industry in South Korea

PubMed Central

Kim, Inah; Kim, Myoung-Hee; Lim, Sinye

2015-01-01

Objectives Despite the global expansion of supply chains and changes to the production process, few studies since the mid-1990s and 2000s have examined reproductive risks of the microelectronics industry; we examined the reproductive risks among female microelectronics workers in South Korea. Methods Based on claim data from the National Health Insurance (2008–2012), we estimated age-specific rates of spontaneous abortion (SAB) and menstrual aberration (MA) among women aged 20 to 39 years. We compared data between microelectronics workers and three different control groups: economically inactive women, the working population as a whole, and workers employed in the bank industry. For an effect measure, age-stratified relative risks (RRs) were estimated. Results Female workers in the microelectronics industry showed significantly higher risk for SAB and MA compared to control groups. The RRs for SAB with reference to economically inactive women, working population, and bank workers in their twenties were 1.57, 1.40, and 1.37, respectively, and the RRs for MA among females in their twenties were 1.54, 1.38, and 1.48, respectively. For women in their thirties, RRs for SAB were 1.58, 1.67, and 1.13, and those for MA were 1.25, 1.35, and 1.23 compared to the three control populations, respectively. All RRs were statistically significant at a level of 0.05, except for the SAB case comparison with bank workers in their thirties. Conclusions Despite technical innovations and health and safety measures, female workers in microelectronics industry in South Korea have high rates of SAB and MA, suggesting continued exposure to reproductive hazards. Further etiologic studies based on primary data collection and careful surveillance are required to confirm these results. PMID:25938673

Challenges and Opportunities in Interdisciplinary Materials Research Experiences for Undergraduates

NASA Astrophysics Data System (ADS)

Vohra, Yogesh; Nordlund, Thomas

2009-03-01

The University of Alabama at Birmingham (UAB) offer a broad range of interdisciplinary materials research experiences to undergraduate students with diverse backgrounds in physics, chemistry, applied mathematics, and engineering. The research projects offered cover a broad range of topics including high pressure physics, microelectronic materials, nano-materials, laser materials, bioceramics and biopolymers, cell-biomaterials interactions, planetary materials, and computer simulation of materials. The students welcome the opportunity to work with an interdisciplinary team of basic science, engineering, and biomedical faculty but the challenge is in learning the key vocabulary for interdisciplinary collaborations, experimental tools, and working in an independent capacity. The career development workshops dealing with the graduate school application process and the entrepreneurial business activities were found to be most effective. The interdisciplinary university wide poster session helped student broaden their horizons in research careers. The synergy of the REU program with other concurrently running high school summer programs on UAB campus will also be discussed.

Superconducting Microelectronics.

ERIC Educational Resources Information Center

Henry, Richard W.

1984-01-01

Discusses superconducting microelectronics based on the Josephson effect and its advantages over conventional integrated circuits in speed and sensitivity. Considers present uses in standards laboratories (voltage) and in measuring weak magnetic fields. Also considers future applications in superfast computer circuitry using Superconducting…

Purifying Aluminum by Vacuum Distillation

NASA Technical Reports Server (NTRS)

Du Fresne, E. R.

1985-01-01

Proposed method for purifying aluminum employs one-step vacuum distillation. Raw material for process impure aluminum produced in electrolysis of aluminum ore. Impure metal melted in vacuum. Since aluminum has much higher vapor pressure than other constituents, boils off and condenses on nearby cold surfaces in proportions much greater than those of other constituents.

Evidence for adverse reproductive outcomes among women microelectronic assembly workers.

PubMed Central

Huel, G; Mergler, D; Bowler, R

1990-01-01

Microelectronics assembly entails complex processes where several potentially fetotoxic chemical compounds are used extensively. This study was undertaken to assess the potential adverse reproductive outcomes among former women workers in a microelectronics assembly plant in New Mexico with respect to a comparable population from the same geographical region and to examine the relation between these outcomes and employment history in this plant. After matching a pool of 143 former microelectronic female workers and 105 referents, 90 former microelectronic female worker-referent pairs were constituted (representing 302 and 324 pregnancies in former workers and referents respectively). The odds ratio (for pair matching design) of spontaneous abortion among women workers, before beginning to assemble microelectronic components, was 0.9 (chi 2 = 0.04; NS). After the beginning of employment this odds ratio became 5.6 (chi 2 = 9.8; p less than 1%). This estimated odds ratio decreased to 4.0, taking into account the increased risk for spontaneous abortion in previous pregnancies before employment (chi 2 = 5.4; p less than 5%). It was not possible to determine if this effect was reversible owing to the small number of pairs available after employment. The findings of this study corroborate the results of former studies that suggest a potential association between electronic manufacturing activity and risk of spontaneous abortion. Although the organic solvents were suspected of being the potential risk factor, this study was inconclusive from this point of view. Nevertheless, these investigations may provide some insight into reproductive outcomes among female workers exposed to solvents. PMID:2378817

High Vacuum Creep Facility in the Materials Processing Laboratory

NASA Image and Video Library

1973-01-21

Technicians at work in the Materials Processing Laboratory’s Creep Facility at the National Aeronautics and Space Administration (NASA) Lewis Research Center. The technicians supported the engineers’ studies of refractory materials, metals, and advanced superalloys. The Materials Processing Laboratory contained laboratories and test areas equipped to prepare and develop these metals and materials. The ultra-high vacuum lab, seen in this photograph, contained creep and tensile test equipment. Creep testing is used to study a material’s ability to withstand long durations under constant pressure and temperatures. The equipment measured the strain over a long period of time. Tensile test equipment subjects the test material to strain until the material fails. The two tests were used to determine the strength and durability of different materials. The Materials Processing Laboratory also housed arc and electron beam melting furnaces, a hydraulic vertical extrusion press, compaction and forging equipment, and rolling mills and swagers. There were cryogenic and gas storage facilities and mechanical and oil diffusion vacuum pumps. The facility contained both instrumental and analytical chemistry laboratories for work on radioactive or toxic materials and the only shop to machine toxic materials in the Midwest.

Center for Space Microelectronics Technology 1988-1989 technical report

NASA Technical Reports Server (NTRS)

Olsen, Peggy

1990-01-01

The 1988 to 1989 Technical Report of the JPL Center for Space Microelectronics Technology summarizes the technical accomplishments, publications, presentations, and patents of the center. Listed are 321 publications, 282 presentations, and 140 new technology reports and patents.

Center for Space Microelectronics Technology

NASA Technical Reports Server (NTRS)

1991-01-01

The 1990 technical report of the Jet Propulsion Laboratory Center for Space Microelectronics Technology summarizes the technical accomplishments, publications, presentations, and patents of the center during 1990. The report lists 130 publications, 226 presentations, and 87 new technology reports and patents.

Vacuum System and Modeling for the Materials Plasma Exposure Experiment

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lumsdaine, Arnold; Meitner, Steve; Graves, Van

Understanding the science of plasma-material interactions (PMI) is essential for the future development of fusion facilities. The design of divertors and first walls for the next generation of long-pulse fusion facilities, such as a Fusion Nuclear Science Facility (FNSF) or a DEMO, requires significant PMI research and development. In order to meet this need, a new linear plasma facility, the Materials Plasma Exposure Experiment (MPEX) is proposed, which will produce divertor relevant plasma conditions for these next generation facilities. The device will be capable of handling low activation irradiated samples and be able to remove and replace samples without breakingmore » vacuum. A Target Exchange Chamber (TEC) which can be disconnected from the high field environment in order to perform in-situ diagnostics is planned for the facility as well. The vacuum system for MPEX must be carefully designed in order to meet the requirements of the different heating systems, and to provide conditions at the target similar to those expected in a divertor. An automated coupling-decoupling (“autocoupler”) system is designed to create a high vacuum seal, and will allow the TEC to be disconnected without breaking vacuum in either the TEC or the primary plasma materials interaction chamber. This autocoupler, which can be actuated remotely in the presence of the high magnetic fields, has been designed and prototyped, and shows robustness in a variety of conditions. The vacuum system has been modeled using a simplified finite element analysis, and indicates that the design goals for the pressures in key regions of the facility are achievable.« less

Vacuum System and Modeling for the Materials Plasma Exposure Experiment

DOE PAGES

Lumsdaine, Arnold; Meitner, Steve; Graves, Van; ...

2017-08-07

Understanding the science of plasma-material interactions (PMI) is essential for the future development of fusion facilities. The design of divertors and first walls for the next generation of long-pulse fusion facilities, such as a Fusion Nuclear Science Facility (FNSF) or a DEMO, requires significant PMI research and development. In order to meet this need, a new linear plasma facility, the Materials Plasma Exposure Experiment (MPEX) is proposed, which will produce divertor relevant plasma conditions for these next generation facilities. The device will be capable of handling low activation irradiated samples and be able to remove and replace samples without breakingmore » vacuum. A Target Exchange Chamber (TEC) which can be disconnected from the high field environment in order to perform in-situ diagnostics is planned for the facility as well. The vacuum system for MPEX must be carefully designed in order to meet the requirements of the different heating systems, and to provide conditions at the target similar to those expected in a divertor. An automated coupling-decoupling (“autocoupler”) system is designed to create a high vacuum seal, and will allow the TEC to be disconnected without breaking vacuum in either the TEC or the primary plasma materials interaction chamber. This autocoupler, which can be actuated remotely in the presence of the high magnetic fields, has been designed and prototyped, and shows robustness in a variety of conditions. The vacuum system has been modeled using a simplified finite element analysis, and indicates that the design goals for the pressures in key regions of the facility are achievable.« less

New hermetic sealing material for vacuum brazing of stainless steels

NASA Astrophysics Data System (ADS)

Hildebrandt, S.; Wiehl, G.; Silze, F.

2016-03-01

For vacuum brazing applications such as in vacuum interrupter industry Hermetic Sealing Materials (HSM) with low partial pressure are widely used. AgCu28 dominates the hermetic sealing market, as it has a very good wetting behavior on copper and metallized ceramics. Within recent decades wetting on stainless steel has become more and more important. However, today the silver content of HSMs is more in focus than in the past decades, because it has the biggest impact on the material prices. Umicore Technical Materials has developed a new copper based HSM, CuAg40Ga10. The wettability on stainless steel is significantly improved compared to AgCu28 and the total silver content is reduced by almost 44%. In this article the physical properties of the alloy and its brazed joints will be presented compared to AgCu28.

Toxic gases used in the microelectronics industry.

PubMed

Wald, P H; Becker, C E

1986-01-01

Toxic gases are among the most dangerous materials used in manufacturing semiconductors and related devices. The storage, handling, and disposal of these gases pose a major hazard to workers and to communities located near high-technology companies. It must be anticipated that accidents, acts of terrorism, and natural calamities will result in exposure. Flammability, corrosiveness, and concentration must be considered, as well as the immediate danger to life and known human health effects of the gases used.

Vacuum arc plasma thrusters with inductive energy storage driver

NASA Technical Reports Server (NTRS)

Schein, Jochen (Inventor); Gerhan, Andrew N. (Inventor); Woo, Robyn L. (Inventor); Au, Michael Y. (Inventor); Krishnan, Mahadevan (Inventor)

2004-01-01

An apparatus for producing a vacuum arc plasma source device using a low mass, compact inductive energy storage circuit powered by a low voltage DC supply acts as a vacuum arc plasma thruster. An inductor is charged through a switch, subsequently the switch is opened and a voltage spike of Ldi/dt is produced initiating plasma across a resistive path separating anode and cathode. The plasma is subsequently maintained by energy stored in the inductor. Plasma is produced from cathode material, which allows for any electrically conductive material to be used. A planar structure, a tubular structure, and a coaxial structure allow for consumption of cathode material feed and thereby long lifetime of the thruster for long durations of time.

Application of He ion microscopy for material analysis

NASA Astrophysics Data System (ADS)

Altmann, F.; Simon, M.; Klengel, R.

2009-05-01

Helium ion beam microscopy (HIM) is a new high resolution imaging technique. The use of Helium ions instead of electrons enables none destructive imaging combined with contrasts quite similar to that from Gallium ion beam imaging. The use of very low probe currents and the comfortable charge compensation using low energy electrons offer imaging of none conductive samples without conductive coating. An ongoing microelectronic sample with Gold/Aluminum interconnects and polymer electronic devices were chosen to evaluate HIM in comparison to scanning electron microscopy (SEM). The aim was to look for key applications of HIM in material analysis. Main focus was on complementary contrast mechanisms and imaging of none conductive samples.

Diamondlike carbon applications in infrared optics and microelectronics

NASA Technical Reports Server (NTRS)

Woollam, John A.; De, Bhola N.; Orzeszko, S.; Ianno, N. J.; Snyder, Paul G.; Alterovitz, Samuel A.; Pouch, John J.; Wu, R. L. C.; Ingram, D. C.

1990-01-01

The use of diamondlike carbon (DLC) as a protective coating in harsh environments is addressed. There are three topics presented. The first is a description of the preparation of DLC on seven different infrared transmitting materials, and the possibility of using DLC as an antireflecting coating at commonly used wavelengths. DLC doesn't bond easily to all materials, and special techniques for bonding are presented. The second topic deals with how well DLC will protect a substrate from moisture penetration. This is an important aspect in numerous uses of DLC, including both infrared optics and integrated circuits. The third topic is the effect of particulate impact on film performance and integrity.

Nanostructured Materials Development for Space Power

NASA Technical Reports Server (NTRS)

Raffaelle, Ryne P.; Landi, B. J.; Elich, J. B.; Gennett, T.; Castro, S. L.; Bailey, Sheila G.; Hepp, Aloysius F.

2003-01-01

There have been many recent advances in the use of nanostructured materials for space power applications. In particular, the use of high purity single wall nanotubes holds promise for a variety of generation and storage devices including: thin film lithium ion batteries, microelectronic proton exchange membrane (PEM) fuel cells, polymeric thin film solar cells, and thermionic power supplies is presented. Semiconducting quantum dots alone and in conjunction with carbon nanotubes are also being investigated for possible use in high efficiency photovoltaic solar cells. This paper will review some of the work being done at RIT in conjunction with the NASA Glenn Research Center to utilize nanomaterials in space power devices.

Laser-machined piezoelectric cantilevers for mechanical energy harvesting.

PubMed

Kim, HyunUk; Bedekar, Vishwas; Islam, Rashed Adnan; Lee, Woo-Ho; Leo, Don; Priya, Shashank

2008-09-01

In this study, we report results on a piezoelectric- material-based mechanical energy-harvesting device that was fabricated by combining laser machining with microelectronics packaging technology. It was found that the laser-machining process did not have significant effect on the electrical properties of piezoelectric material. The fabricated device was tested in the low-frequency regime of 50 to 1000 Hz at constant force of 8 g (where g = 9.8 m/s(2)). The device was found to generate continuous power of 1.13 microW at 870 Hz across a 288.5 kOmega load with a power density of 301.3 microW/cm(3).

Center for Space Microelectronics Technology

NASA Technical Reports Server (NTRS)

1992-01-01

The 1991 Technical Report of the Jet Propulsion Laboratory Center for Space Microelectronics Technology summarizes the technical accomplishments, publications, presentations, and patents of the Center during the past year. The report lists 193 publications, 211 presentations, and 125 new technology reports and patents.

Laser ultrasonic characterization of membranes for use as micro-electronic mechanical systems (MEMS)

NASA Astrophysics Data System (ADS)

Edwards, R. S.; Zhou, L. Q.; Pearce, M. J.; Prince, R. G.; Colston, G.; Myronov, M.; Leadley, D. R.; Trushkevych, O.

2017-02-01

Germanium (Ge) on Silicon (Si) has the potential to produce a wide variety of devices, including sensors, solar cells and transistors. Modification of these materials so that a suspended membrane layer is formed, through removing regions of the Si substrate, offers the potential for sensors with a more rapid response and higher sensitivity. Such membranes are a very simple micro-electronic mechanical system (MEMS). It is essential to ensure that the membranes are robust against shock and vibration, with well-characterised resonant frequencies, prior to any practical application. We present work using laser interferometry to characterise the resonant modes of membranes produced from Ge or silicon carbide (SiC) on a Si substrate, with the membranes typically having around 1 mm lateral dimensions. Two dimensional scanning of the sample enables visualisation of each mode. The stress measured from the resonant frequencies agrees well with that calculated from the growth conditions. SiC provides a more robust platform for electronics, while Ge offers better resonant properties. This offers a potential technique for characterising production quality or lifetime testing for the MEMS produced.

Silicon based nanogap device for studying electrical transport phenomena in molecule-nanoparticle hybrids.

PubMed

Strobel, Sebastian; Hernández, Rocío Murcia; Hansen, Allan G; Tornow, Marc

2008-09-17

We report the fabrication and characterization of vertical nanogap electrode devices using silicon-on-insulator substrates. Using only standard silicon microelectronic process technology, nanogaps down to 26 nm electrode separation were prepared. Transmission electron microscopy cross-sectional analysis revealed the well defined material architecture of the nanogap, comprising two electrodes of dissimilar geometrical shape. This asymmetry is directly reflected in transport measurements on molecule-nanoparticle hybrid systems formed by self-assembling a monolayer of mercaptohexanol on the electrode surface and the subsequent dielectrophoretic trapping of 30 nm diameter Au nanoparticles. The observed Coulomb staircase I-V characteristic measured at T = 4.2 K is in excellent agreement with theoretical modelling, whereby junction capacitances of the order of a few 10(-18) farad and asymmetric resistances of 30 and 300 MΩ, respectively, are also supported well by our independent estimates for the formed double barrier tunnelling system. We propose our nanoelectrode system for integrating novel functional electronic devices such as molecular junctions or nanoparticle hybrids into existing silicon microelectronic process technology.

Heuristic method of fabricating counter electrodes in dye-sensitized solar cells based on a PEDOT:PSS layer as a catalytic material

NASA Astrophysics Data System (ADS)

Edalati, Sh; Houshangi far, A.; Torabi, N.; Baneshi, Z.; Behjat, A.

2017-02-01

Poly(3,4-ethylendioxythiophene):poly(styrene sulfonate) (PEDOT:PSS) was deposited on a fluoride-doped tin oxide glass substrate using a heuristic method to fabricate platinum-free counter electrodes for dye-sensitized solar cells (DSSCs). In this heuristic method a thin layer of PEDOT:PPS is obtained by spin coating the PEDOT:PSS on a Cu substrate and then removing the substrate with FeCl3. The characteristics of the deposited PEDOT:PSS were studied by energy dispersive x-ray analysis and scanning electron microscopy, which revealed the micro-electronic specifications of the cathode. The aforementioned DSSCs exhibited a solar conversion efficiency of 3.90%, which is far higher than that of DSSCs with pure PEDOT:PSS (1.89%). This enhancement is attributed not only to the micro-electronic specifications but also to the HNO3 treatment through our heuristic method. The results of cyclic voltammetry, electrochemical impedance spectroscopy (EIS) and Tafel polarization plots show the modified cathode has a dual function, including excellent conductivity and electrocatalytic activity for iodine reduction.

Organo-metallic elements for associative information processing

NASA Astrophysics Data System (ADS)

Potember, Richard S.; Poehler, Theodore O.

1989-01-01

In the three years of the program we have: (1) built and tested a 4 bit element matrix device for possible use in high density content-addressable memories systems; (2) established a test and evaluation laboratory to examine optical materials for nonlinear effects, saturable absorption, harmonic generation and photochromism; (3) successfully designed, constructed and operated a codeposition processing system that enables organic materials to be deposited on a variety of substrates to produce optical grade coatings and films. This system is also compatible with other traditional microelectronic techniques; (4) used the sol-gel process with colloidal AgTCNQ to fabricate high speed photochromic switches; (5) develop and applied for patent coverage to make VO2 optical switching materials via the sol-gel processing using vanadium (IV) alkoxide compounds.

Contamination control in hybrid microelectronic modules. Part 2: Selection and evaluation of coating materials

NASA Technical Reports Server (NTRS)

Himmel, R. P.

1975-01-01

The selection, test, and evaluation of organic coating materials for contamination control in hybrid circuits is reported. The coatings were evaluated to determine their suitability for use as a conformal coating over the hybrid microcircuit (including chips and wire bonds) inside a hermetically sealed package. Evaluations included ease of coating application and repair and effect on thin film and thick film resistors, beam leads, wire bonds, transistor chips, and capacitor chips. The coatings were also tested for such properties as insulation resistance, voltage breakdown strength, and capability of immobilizing loose particles inside the packages. The selected coatings were found to be electrically, mechanically, and chemically compatible with all components and materials normally used in hybrid microcircuits.

Thin film coating process using an inductively coupled plasma

DOEpatents

Kniseley, Richard N.; Schmidt, Frederick A.; Merkle, Brian D.

1990-01-30

Thin coatings of normally solid materials are applied to target substrates using an inductively coupled plasma. Particles of the coating material are vaporized by plasma heating, and pass through an orifice to a first vacuum zone in which the particles are accelerated to a velocity greater than Mach 1. The shock wave generated in the first vacuum zone is intercepted by the tip of a skimmer cone that provides a second orifice. The particles pass through the second orifice into a second zone maintained at a higher vacuum and impinge on the target to form the coating. Ultrapure coatings can be formed.

Method Of Making A Vacuum-Tight Continuous Cable Feedthrough Device

DOEpatents

Bazizi, Kamel Abdel; Haelen, Thomas Eugene; Lobkowicz, Frederick; Slattery, Paul Francis

2001-07-17

A vacuum-tight cable feedthrough device includes a metallic first flange that is penetrated by a slot. Passing through the slot is a flat stripline cable that includes a plurality of conductive signal channels encompassed by a dielectric material on whose upper and lower surfaces is disposed a conductive material includes a ground. The stripline cable is sealed within the slot to provide a substantially vacuum-tight seal between the cable and the first flange. In a preferred embodiment, the cable feedthrough device includes a plurality, at least 16, of stripline cables. In a further preferred embodiment, the device includes a second flange and a bellows sealably connecting the first and second flanges, thereby providing a substantially vacuum-tight, flexible housing for the plurality of cables.

Compatibility testing of vacuum seal materials

NASA Astrophysics Data System (ADS)

Foster, P. A.; Rodin, W. A.

1993-05-01

Small scale materials compatibility testing was conducted for three elastomers considered for use as vacuum seal materials: Adiprene MOCA-cured; Adiprene Cyanacured; and Sylgard silastic rubber. The tests were conducted using orthogonal array designed experiments for each of the elastomers placed in contact with three materials commonly used during weapon disassembly operations: Duxseal, Sylgard 186 grease, and 2-propyl alcohol. The test results indicated that only the 2-propyl alcohol had a significant effect on the elastomer hardness and physical properties. The alcohol had the largest effect on the two Adiprene materials, and the silastic rubber was the least affected.

Labour-Saving versus Work-Amplifying Effects of Micro-Electronics.

ERIC Educational Resources Information Center

Watanabe, Susumu

1986-01-01

This article argues that the labor-displacement effect of microelectronic machinery, especially numerically controlled machine tools and robots, has been exaggerated and that people tend to confuse the impact of intensified international competition with that of the new technology. (Author/CT)

A versatile approach to vacuum injection casting for materials research and development.

PubMed

Xu, Donghua; Xu, Yifan

2017-03-01

Vacuum injection casting (VIC) is important for research and development (R&D) of materials that are prone to oxidation at high temperatures, particularly metals and metallic alloys (e.g., metallic glasses and high entropy alloys). VIC in R&D laboratories often involves initial melting/alloying in a prior step, transporting the sample to a dedicated vacuum chamber, re-melting the sample in a quartz tube, and finally injecting the melt with an inert gas to a dedicated mold. Here we present a new approach to laboratory VIC that requires no sample transfer (for a variety of materials), no dedicated vacuum chamber/space nor dedicated mold, and hence provides more versatility and higher efficiency and yet lowers the capital equipment cost. Our approach takes advantage of the exceptional portability, thermal and chemical stability, and thermoplastic processability of quartz glass and uses quartz tubes for all the melting, re-melting, injection casting, and molding. In addition, our approach includes oxygen gettering to remove residual oxygen for all the steps and allows for slow or fast cooling (e.g., water quenching) upon injection. This paper focuses on the design, the procedures, and the versatile features of this new approach while also demonstrating the practical implementation of this approach and computational modeling of the heat transfer and the cooling rates for two exemplary cases. The new approach is expected to bring notable expedition to sample fabrication and materials discovery, as well as wider adoption of vacuum injection casting in materials science and condensed matter physics research laboratories.

A versatile approach to vacuum injection casting for materials research and development

NASA Astrophysics Data System (ADS)

Xu, Donghua; Xu, Yifan

2017-03-01

Vacuum injection casting (VIC) is important for research and development (R&D) of materials that are prone to oxidation at high temperatures, particularly metals and metallic alloys (e.g., metallic glasses and high entropy alloys). VIC in R&D laboratories often involves initial melting/alloying in a prior step, transporting the sample to a dedicated vacuum chamber, re-melting the sample in a quartz tube, and finally injecting the melt with an inert gas to a dedicated mold. Here we present a new approach to laboratory VIC that requires no sample transfer (for a variety of materials), no dedicated vacuum chamber/space nor dedicated mold, and hence provides more versatility and higher efficiency and yet lowers the capital equipment cost. Our approach takes advantage of the exceptional portability, thermal and chemical stability, and thermoplastic processability of quartz glass and uses quartz tubes for all the melting, re-melting, injection casting, and molding. In addition, our approach includes oxygen gettering to remove residual oxygen for all the steps and allows for slow or fast cooling (e.g., water quenching) upon injection. This paper focuses on the design, the procedures, and the versatile features of this new approach while also demonstrating the practical implementation of this approach and computational modeling of the heat transfer and the cooling rates for two exemplary cases. The new approach is expected to bring notable expedition to sample fabrication and materials discovery, as well as wider adoption of vacuum injection casting in materials science and condensed matter physics research laboratories.

Processing of extraterrestrial materials by high temperature vacuum vaporization

NASA Technical Reports Server (NTRS)

Grimley, R. T.; Lipschutz, M. E.

1983-01-01

It is noted that problems associated with the extraction and concentration of elements and commpounds important for the construction and operation of space habitats have received little attention. High temperature vacuum vaporization is considered a promising approach; this is a technique for which the space environment offers advantages in the form of low ambient pressures and temperatures and the possibility of sustained high temperatures via solar thermal energy. To establish and refine this new technology, experimental determinations must be made of the material release profiles as a function of temperature, of the release kinetics and chemical forms of material being transported, and of the various means of altering release kinetics. Trace element data determined by neutron activation analysis of meteorites heated to 1400 C in vacuum is summarized. The principal tool, high temperature spectrometry, is used to examine the vaporization thermodynamics and kinetics of major and minor elements from complex multicomponent extraterrestrial materials.

High specific surface area aerogel cryoadsorber for vacuum pumping applications

DOEpatents

Hill, Randal M.; Fought, Eric R.; Biltoft, Peter J.

2000-01-01

A cryogenic pumping system is provided, comprising a vacuum environment, an aerogel sorbent formed from a carbon aerogel disposed within the vacuum environment, and cooling means for cooling the aerogel sorbent sufficiently to adsorb molecules from the vacuum environment onto the aerogel sorbent. Embodiments of the invention include a liquid refrigerant cryosorption pump, a compressed helium cryogenic pump, a cryopanel and a Meissner coil, each of which uses carbon aerogel as a sorbent material.

Effectiveness of some recent antimicrobial packaging concepts.

PubMed

Vermeiren, L; Devlieghere, F; Debevere, J

2002-01-01

A new type of active packaging is the combination of food-packaging materials with antimicrobial substances to control microbial surface contamination of foods. For both migrating and non-migrating antimicrobial materials, intensive contact between the food product and packaging material is required and therefore potential food applications include especially vacuum or skin-packaged products, e.g. vacuum-packaged meat, fish, poultry or cheese. Several antimicrobial compounds have been combined with different types of carriers (plastic and rubber articles, paper-based materials, textile fibrils and food-packaging materials). Until now, however, few antimicrobial concepts have found applications as a food-packaging material. Antimicrobial packaging materials cannot legally be used in the EU at the moment. The potential use would require amendments of several different legal texts involving areas such as food additives, food packaging, hygiene, etc. The main objective of this paper is to provide a state of the art about the different types of antimicrobial concepts, their experimental development and commercialization, and to present a case study summarizing the results of investigations on the feasibility of a low-density polyethylene (LDPE)-film containing triclosan to inhibit microbial growth on food surfaces and consequently prolong shelf-life or improve microbial food safety. In contrast with the strong antimicrobial effect in in-vitro simulated vacuum-packaged conditions against the psychrotrophic food pathogen L. monocytogenes, the 1000 mg kg(-1) containing triclosan film did not effectively reduce spoilage bacteria and growth of L. monocytogenes on refrigerated vacuum-packaged chicken breasts stored at 7 degrees C.

Evaporation in equilibrium, in vacuum, and in hydrogen gas

NASA Technical Reports Server (NTRS)

Nagahara, Hiroko

1993-01-01

Evaporation experiments were conducted for SiO2 in three different conditions: in equilibrium, in vacuum, and in hydrogen gas. Evaporation rate in vacuum is about two orders of magnitude smaller than that in equilibrium, which is consistent with previous works. The rate in hydrogen gas changes depending on hydrogen pressure. The rate at 10 exp -7 bar of hydrogen pressure is as small as that of free evaporation, but at 10 exp -5 bar of hydrogen pressure it is larger than that in equilibrium. In equilibrium and in vacuum, the evaporation rate is limited by decomposition of SiO2 on the crystal surface, but it is limited by a diffusion process for evaporation in hydrogen gas. Therefore, evaporation rate of minerals in the solar nebula can be shown neither by that in equilibrium nor by that in vacuum. The maximum temperature of the solar nebula at the midplane at 2-3 AU where chondrites are believed to have originated is calculated to be as low as 150 K, 1500 K, or in between them. The temperature is, in any case, not high enough for total evaporation of the interstellar materials. Therefore, evaporation of interstellar materials is one of the most important processes for the origin and fractionation of solid materials. The fundamental process of evaporation of minerals has been intensively studied for these several years. Those experiments were carried out either in equilibrium or in vacuum; however, evaporation in the solar nebula is in hydrogen (and much smaller amount of helium) gas. In order to investigate evaporation rate and compositional (including isotopic) fractionation during evaporation, vaporization experiments for various minerals in various conditions are conducted. At first, SiO2 was adopted for a starting material, because thermochemical data and its nature of congruent vaporization are well known. Experiments were carried out in a vacuum furnace system.

Multipurpose Thermal Insulation Test Apparatus

NASA Technical Reports Server (NTRS)

Fesmire, James E. (Inventor); Augustynowicz, Stanislaw D. (Inventor)

2002-01-01

A multi-purpose thermal insulation test apparatus is used for testing insulation materials, or other components. The test apparatus is a fluid boil-off calorimeter system for calibrated measurement of the apparent thermal conductivity (k-value) of a specimen material at a fixed vacuum level. The apparatus includes an inner vessel for receiving a fluid with a normal boiling point below ambient temperature, such as liquid nitrogen, enclosed within a vacuum chamber. A cold mass assembly, including the inner vessel and thermal guards, is suspended from the top of the vacuum chamber. Handling tools attach to the cold mass assembly for convenient manipulation of the assembly and for the installation or wrapping of insulation test materials. Liquid nitrogen is typically supplied to the inner vessel using a fill tube with funnel. A single port through the top of the vacuum chamber facilitates both filling and venting. Aerogel composite stacks with reflective films are fastened to the top and the bottom of the inner vessel as thermal guards. The comparative k-value of the insulation material is determined by measuring the boil-off flow rate of gas, the temperature differential across the insulation thickness, and the dimensions (length and diameters) of the test specimen.

Microelectronics and Computers in Medicine.

ERIC Educational Resources Information Center

Meindl, James D.

1982-01-01

The use of microelectronics and computers in medicine is reviewed, focusing on medical research; medical data collection, storage, retrieval, and manipulation; medical decision making; computed tomography; ultrasonic imaging; role in clinical laboratories; and use as adjuncts for diagnostic tests, monitors of critically-ill patients, and with the…

Parameter Measurement Methods for Interfacing Hydraulic Systems with Microelectronic Instruments and Controllers.

DTIC Science & Technology

1983-11-01

successfully. I- Accession For NTIS -GO iiiONa DTIC TAB t Unannounced - Justificatio Distribution/ I Availability Codes vail and/or DIst Special IA-11...terms of initial signal power. An active sensor must be excited externally. Such a sensor receives its power from an external source and merely modulates...electrons in the material to gain L enough energy to be emitted. The voltage source causes a positive potential to be felt on the collector, thus causing the

Wet/Dry Vacuum Cleaner

NASA Technical Reports Server (NTRS)

Reimers, Harold; Andampour, Jay; Kunitser, Craig; Thomas, Ike

1995-01-01

Vacuum cleaner collects and retains dust, wet debris, and liquids. Designed for housekeeping on Space Station Freedom, it functions equally well in normal Earth Gravity or in microgravity. Generates acoustic noise at comfortably low levels and includes circuitry that reduces electromagnetic interference to other electronic equipment. Draws materials into bag made of hydrophobic sheet with layers of hydrophilic super-absorbing pads at downstream end material. Hydrophilic material can gel many times its own weight of liquid. Blower also provides secondary airflow to cool its electronic components.

Vacuum ultraviolet radiation/atomic oxygen synergism in materials reactivity

NASA Technical Reports Server (NTRS)

Koontz, Steven; Leger, Lubert; Albyn, Keith; Cross, Jon

1990-01-01

Experimental results are presented which indicate that low fluxes of vacuum UV (VUV) radiation exert a pronounced influence on the atomic oxygen reactivity of such fluorocarbon and fluorocarbon spacecraft materials as the FEP Teflon and PCTFE that are under consideration for the Space Station Freedom. With simultaneous exposure to VUV fluxes comparable to those experienced in LEO, the reactivity of these materials becomes comparable to that of Kapton; VUV radiation has also been shown to increase the reactivity of Kapton with thermal-energy oxygen atoms.

Fundamental investigation of ultraviolet radiation effects in polymeric film-forming materials

NASA Technical Reports Server (NTRS)

Giori, C.; Yamauchi, T.; Llewellen, P.; Gilligan, J.

1974-01-01

A literature search from 1958 to present was conducted on the effect of ultraviolet radiation on polymeric materials, with particular emphasis on vacuum photolysis, mechanisms of degradation, and energy transfer phenomena. The literature from 1958 to 1968 was searched manually, while the literature from 1968 to present was searched by using a computerized keyword system. The primary objective was to provide the necessary background information for the design of new or modified materials with improved stability to the vacuum-radiation environment of space.

Low-Outgassing Photogrammetry Targets for Use in Outer Space

NASA Technical Reports Server (NTRS)

Gross, Jason N.; Sampler, Henry; Reed, Benjamin B.

2011-01-01

A short document discusses an investigation of materials for photogrammetry targets for highly sensitive optical scientific instruments to be operated in outer space and in an outer-space-environment- simulating thermal vacuum chamber on Earth. A key consideration in the selection of photogrammetry-target materials for vacuum environments is the need to prevent contamination that could degrade the optical responses of the instruments. Therefore, in addition to the high levels and uniformity of reflectivity required of photogrammetry-target materials suitable for use in air, the materials sought must exhibit minimal outgassing. Commercially available photogrammetry targets were found to outgas excessively under the thermal and vacuum conditions of interest; this finding prompted the investigators to consider optically equivalent or superior, lower-outgassing alternative target materials. The document lists several materials found to satisfy the requirements, but does not state explicitly whether the materials can be used individually or must be combined in the proper sequence into layered target structures. The materials in question are an aluminized polyimide tape, an acrylic pressure- sensitive adhesive, a 500-A-thick layer of vapor-deposited aluminum, and spherical barium titanate glass beads having various diameters from 20 to 63 microns..

Germanium Based Field-Effect Transistors: Challenges and Opportunities

PubMed Central

Goley, Patrick S.; Hudait, Mantu K.

2014-01-01

The performance of strained silicon (Si) as the channel material for today’s metal-oxide-semiconductor field-effect transistors may be reaching a plateau. New channel materials with high carrier mobility are being investigated as alternatives and have the potential to unlock an era of ultra-low-power and high-speed microelectronic devices. Chief among these new materials is germanium (Ge). This work reviews the two major remaining challenges that Ge based devices must overcome if they are to replace Si as the channel material, namely, heterogeneous integration of Ge on Si substrates, and developing a suitable gate stack. Next, Ge is compared to compound III-V materials in terms of p-channel device performance to review how it became the first choice for PMOS devices. Different Ge device architectures, including surface channel and quantum well configurations, are reviewed. Finally, state-of-the-art Ge device results and future prospects are also discussed. PMID:28788569

Short-pulse laser interactions with disordered materials and liquids

DOE Office of Scientific and Technical Information (OSTI.GOV)

Phinney, L.M.; Goldman, C.H.; Longtin, J.P.

High-power, short-pulse lasers in the picosecond and subpicosecond range are utilized in an increasing number of technologies, including materials processing and diagnostics, micro-electronics and devices, and medicine. In these applications, the short-pulse radiation interacts with a wide range of media encompassing disordered materials and liquids. Examples of disordered materials include porous media, polymers, organic tissues, and amorphous forms of silicon, silicon nitride, and silicon dioxide. In order to accurately model, efficiently control, and optimize short-pulse, laser-material interactions, a thorough understanding of the energy transport mechanisms is necessary. Thus, fractals and percolation theory are used to analyze the anomalous diffusion regimemore » in random media. In liquids, the thermal aspects of saturable and multiphoton absorption are examined. Finally, a novel application of short-pulse laser radiation to reduce surface adhesion forces in microstructures through short-pulse laser-induced water desorption is presented.« less

New nanocomposite surfaces and thermal interface materials based on mesoscopic microspheres, polymers and graphene flakes

NASA Astrophysics Data System (ADS)

Dmitriev, Alex A.; Dmitriev, Alex S.; Makarov, Petr; Mikhailova, Inna

2018-04-01

In recent years, there has been a great interest in the development and creation of new functional energy mate-rials, including for improving the energy efficiency of power equipment and for effectively removing heat from energy devices, microelectronics and optoelectronics (power micro electronics, supercapacitors, cooling of processors, servers and data centers). In this paper, the technology of obtaining new nanocomposites based on mesoscopic microspheres, polymers and graphene flakes is considered. The methods of sequential production of functional materials from graphene flakes of different volumetric concentration using epoxy polymers, as well as the addition of monodisperse microspheres are described. Data are given on the measurement of the contact angle and thermal conductivity of these nanocomposites with respect to the creation of thermal interface materials for cooling devices of electronics, optoelectronics and power engineering.

Comparative Advantages in Microelectronics,

DTIC Science & Technology

The initial point of departure for analyzing comparative advantages in microelectronics is to make certain explicit assumptions. First, technology...changes conditions but does not determine comparative advantages . Secondly, the entire industrial infrastructure is becoming increasingly abstract...that informatics will profoundly affect the productive infrastructure and the international division of labour.

76 FR 10395 - BreconRidge Manufacturing Solutions, Now Known as Sanmina-SCI Corporation, Division...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-02-24

... Solutions, Now Known as Sanmina-SCI Corporation, Division Optoelectronic and Microelectronic Design and Manufacturing, a Subsidiary of Sanmina-SCI Corporation, Including On- Site Leased Workers From Kelly Services... Manufacturing Solutions, now known as Sanmina-SCI Corporation, Division Optoelectronic and Microelectronic...

Low temperature ablation models made by pressure/vacuum application

NASA Technical Reports Server (NTRS)

Fischer, M. C.; Heier, W. C.

1970-01-01

Method developed employs high pressure combined with strong vacuum force to compact ablation models into desired conical shape. Technique eliminates vapor hazard and results in high material density providing excellent structural integrity.

Initiation of vacuum breakdown and failure mechanism of the carbon nanotube during thermal field emission

NASA Astrophysics Data System (ADS)

Dan, Cai; Lie, Liu; Jin-Chuan, Ju; Xue-Long, Zhao; Hong-Yu, Zhou; Xiao, Wang

2016-04-01

The carbon nanotube (CNT)-based materials can be used as vacuum device cathodes. Owing to the excellent field emission properties of CNT, it has great potentials in the applications of an explosive field emission cathode. The falling off of CNT from the substrate, which frequently appears in experiments, restricts its application. In addition, the onset time of vacuum breakdown limits the performance of the high-power explosive-emission-cathode-based diode. In this paper, the characteristics of the CNT, electric field strength, contact resistance and the kind of substrate material are varied to study the parameter effects on the onset time of vacuum breakdown and failure mechanism of the CNT by using the finite element method. Project supported by the National Natural Science Foundation of China (Grant Nos. 11305263 and 61401484).

Vacuum powder injector and method of impregnating fiber with powder

NASA Astrophysics Data System (ADS)

Working, Dennis C.

1993-05-01

A method and apparatus uniformly impregnate stranded material with dry powder such as low solubility, high melt flow polymer powder to produce, for example, composite prepregs. The stranded material is expanded in an impregnation chamber by an influx of air so that the powder, which may enter through the same inlet as the air, penetrates to the center of the stranded material. The stranded material then is contracted for holding the powder therein. The stranded material and powder may be pulled through the impregnation chamber in the same direction by vacuum. Larger particles of powder which do not fully penetrate the stranded material may be combed into the stranded material and powder which does not impregnate the stranded material may be collected and reused.

Vacuum powder injector and method of impregnating fiber with powder

NASA Technical Reports Server (NTRS)

Working, Dennis C. (Inventor)

1993-01-01

A method and apparatus uniformly impregnate stranded material with dry powder such as low solubility, high melt flow polymer powder to produce, for example, composite prepregs. The stranded material is expanded in an impregnation chamber by an influx of air so that the powder, which may enter through the same inlet as the air, penetrates to the center of the stranded material. The stranded material then is contracted for holding the powder therein. The stranded material and powder may be pulled through the impregnation chamber in the same direction by vacuum. Larger particles of powder which do not fully penetrate the stranded material may be combed into the stranded material and powder which does not impregnate the stranded material may be collected and reused.

Critically safe vacuum pickup for use in wet or dry cleanup of radioactive materials

DOEpatents

Zeren, Joseph D.

1994-01-01

A vacuum pickup of critically safe quantity and geometric shape is used in cleanup of radioactive materials. Collected radioactive material is accumulated in four vertical, parallel, equally spaced canisters arranged in a cylinder configuration. Each canister contains a filter bag. An upper intake manifold includes four 90 degree spaced, downward facing nipples. Each nipple communicates with the top of a canister. The bottom of each canister communicates with an exhaust manifold comprising four radially extending tubes that meet at the bottom of a centrally located vertical cylinder. The top of the central cylinder terminates at a motor/fan power head. A removable HEPA filter is located intermediate the top of the central cylinder and the power head. Four horizontal bypass tubes connect the top of the central cylinder to the top of each of the canisters. Air enters the vacuum cleaner via a hose connected to the intake manifold. Air then travels down the canisters, where particulate material is accumulated in generally equal quantities in each filter bag. Four air paths of bag filtered air then pass radially inward to the bottom of the central cylinder. Air moves up the central cylinder, through the HEPA filter, through a vacuum fan compartment, and exits the vacuum cleaner. A float air flow valve is mounted at the top of the central cylinder. When liquid accumulates to a given level within the central cylinder, the four bypass tubes, and the four canisters, suction is terminated by operation of the float valve.

Aerogel Beads as Cryogenic Thermal Insulation System

NASA Technical Reports Server (NTRS)

Fesmire, J. E.; Augustynowicz, S. D.; Rouanet, S.; Thompson, Karen (Technical Monitor)

2001-01-01

An investigation of the use of aerogel beads as thermal insulation for cryogenic applications was conducted at the Cryogenics Test Laboratory of NASA Kennedy Space Center. Steady-state liquid nitrogen boiloff methods were used to characterize the thermal performance of aerogel beads in comparison with conventional insulation products such as perlite powder and multilayer insulation (MLI). Aerogel beads produced by Cabot Corporation have a bulk density below 100 kilograms per cubic meter (kg/cubic m) and a mean particle diameter of 1 millimeter (mm). The apparent thermal conductivity values of the bulk material have been determined under steady-state conditions at boundary temperatures of approximately 293 and 77 kelvin (K) and at various cold vacuum pressures (CVP). Vacuum levels ranged from 10(exp -5) torr to 760 torr. All test articles were made in a cylindrical configuration with a typical insulation thickness of 25 mm. Temperature profiles through the thickness of the test specimens were also measured. The results showed the performance of the aerogel beads was significantly better than the conventional materials in both soft-vacuum (1 to 10 torr) and no-vacuum (760 torr) ranges. Opacified aerogel beads performed better than perlite powder under high-vacuum conditions. Further studies for material optimization and system application are in progress.

Surface Effects and Challenges for Application of Piezoelectric Langasite Substrates in Surface Acoustic Wave Devices Caused by High Temperature Annealing under High Vacuum.

PubMed

Seifert, Marietta; Rane, Gayatri K; Kirbus, Benjamin; Menzel, Siegfried B; Gemming, Thomas

2015-12-19

Substrate materials that are high-temperature stable are essential for sensor devices which are applied at high temperatures. Although langasite is suggested as such a material, severe O and Ga diffusion into an O-affine deposited film was observed during annealing at high temperatures under vacuum conditions, leading to a damage of the metallization as well as a change of the properties of the substrate and finally to a failure of the device. Therefore, annealing of bare LGS (La 3 Ga 5 SiO 14 ) substrates at 800 ∘ C under high vacuum conditions is performed to analyze whether this pretreatment improves the suitability and stability of this material for high temperature applications in vacuum. To reveal the influence of the pretreatment on the subsequently deposited metallization, RuAl thin films are used as they are known to oxidize on LGS at high temperatures. A local study of the pretreated and metallized substrates using transmission electron microscopy reveals strong modification of the substrate surface. Micro cracks are visible. The composition of the substrate is strongly altered at those regions. Severe challenges for the application of LGS substrates under high-temperature vacuum conditions arise from these substrate damages, revealing that the pretreatment does not improve the applicability.

Heat Flow Measurement and Analysis of Thermal Vacuum Insulation

NASA Astrophysics Data System (ADS)

Laa, C.; Hirschl, C.; Stipsitz, J.

2008-03-01

A new kind of calorimeter has been developed at Austrian Aerospace to measure specific material parameters needed for the analysis of thermal vacuum insulation. A detailed description of the measuring device and the measurement results will be given in this paper. This calorimeter facility allows to measure the heat flow through the insulation under vacuum conditions in a wide temperature range from liquid nitrogen to ambient. Both boundary temperatures can be chosen within this range. Furthermore the insulation can be characterized at high vacuum or under degraded vacuum, the latter is simulated by using helium or nitrogen gas. The mechanisms of heat transfer have been investigated, namely infrared radiation between the reflective layers of the insulation and conduction through the interleaving spacer material. A mathematical description of the heat flow through the insulation has been derived. Based on this, the heat flow for a typical insulation material has been calculated by finite element analysis by use of the sotware tool Ansys®. Such a transient calculation is needed to determine the time to reach thermal equilibrium, which is mandatory for a proper interpretation and evaluation of the measurement. The new insulation measurement results combined with the proposed type of analysis can be applied to better understand the thermal behavior of any kind of cryogenic system.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Custer, Jonathan S.; Fleming, James G.; Roherty-Osmun, Elizabeth

Refractory ternary nitride films for diffusion barriers in microelectronics have been grown using chemical vapor deposition. Thin films of titanium-silicon-nitride, tungsten-boron-nitride, and tungsten-silicon-nitride of various compositions have been deposited on 150 mm Si wafers. The microstructure of the films are either fully amorphous for the tungsten based films, or nauocrystalline TiN in an amorphous matrix for titanium-silicon-nitride. All films exhibit step coverages suitable for use in future microelectronics generations. Selected films have been tested as diffusion barriers between copper and silicon, and generally perform extremely weH. These fiIms are promising candidates for advanced diffusion barriers for microelectronics applications. The manufacturingmore » of silicon wafers into integrated circuits uses many different process and materials. The manufacturing process is usually divided into two parts: the front end of line (FEOL) and the back end of line (BEOL). In the FEOL the individual transistors that are the heart of an integrated circuit are made on the silicon wafer. The responsibility of the BEOL is to wire all the transistors together to make a complete circuit. The transistors are fabricated in the silicon itself. The wiring is made out of metal, currently aluminum and tungsten, insulated by silicon dioxide, see Figure 1. Unfortunately, silicon will diffuse into aluminum, causing aluminum spiking of junctions, killing transistors. Similarly, during chemical vapor deposition (CVD) of tungsten from ~fj, the reactivity of the fluorine can cause "worn-holes" in the silicon, also destroying transistors. The solution to these problems is a so-called diffusion barrier, which will allow current to pass from the transistors to the wiring, but will prevent reactions between silicon and the metal.« less

Iodine Beam Dump Design and Fabrication

NASA Technical Reports Server (NTRS)

Polzin, K. A.; Bradley, D. E.

2017-01-01

During the testing of electric thrusters, high-energy ions impacting the walls of a vacuum chamber can cause corrosion and/or sputtering of the wall materials, which can damage the chamber walls. The sputtering can also introduce the constituent materials of the chamber walls into an experiment, with those materials potentially migrating back to the test article and coating it with contaminants over time. The typical method employed in this situation is to install a beam dump fabricated from materials that have a lower sputter yield, thus reducing the amount of foreign material that could migrate towards the test article or deposit on anything else present in the vacuum facility.

Lightweight evacuated multilayer insulation systems for the space shuttle vehicle

NASA Technical Reports Server (NTRS)

Barclay, D. L.; Bell, J. E.; Zimmerman, D. K.

1973-01-01

The elements in the evacuated multilayer insulation system were investigated, and the major weight contributors for optimization selected. Outgassing tests were conducted on candidate vacuum jacket materials and experiments were conducted to determine the vacuum and structural integrity of selected vacuum jacket configurations. A nondestructive proof test method, applicable to externally pressurized shells, was validated on this program.

Research on thermal conductivity of HGMs at vacuum in room temperature

NASA Astrophysics Data System (ADS)

Wang, Ping; Liao, Bin; An, Zhenguo; Yan, Kaiqi; Zhang, Jingjie

2018-05-01

Hollow glass microspheres (HGMs) can be used as thermal insulation materials owing to its hollow structure which brings excellent thermal insulation property and low density. At present, most researches on thermal conductivity of HGMs are focused on polymer matrix/HGMs composite materials. However, thermal conductivity of HGMs at vacuum in room temperature has rarely been investigated. In this work, thermal conductivity of six types of HGMs (T17 (0.17g/cm3), T20 (0.20g/cm3), T22 (0.22g/cm3), T25 (0.25g/cm3), T32 (0.32g/cm3) and T40 (0.40g/cm3)) at vacuum in room temperature were calculated by heat transfer of solid conduction and radiation. The calculation results showed that thermal conductivity of HGMs would be decreased by an order of magnitude compared with no vacuum. In order to verify the calculation and study vacuum thermal insulation properties of HGMs, thermal conductivity of above-mentioned HGMs at no vacuum and high vacuum in room temperature were measured by a self-made thermal conductivity measuring apparatus which was based on the transient plane source (TPS) method. The experimental results showed that thermal conductivity of HGMs were in the range of 4.2030E-02 to 6.3300E-02 W/m.K (at no vacuum) and 3.8160E-03 to 4.9660E-03 W/m.K (at high vacuum). The results indicated that experimental thermal conductivity was consistent with the calculation results and both of them were all decreased by 8-13 times at vacuum compared with no vacuum. In addition, the relationship with physical properties and thermal conductivity of HGMs has been discussed in detail. In conclusion, HGMs possess excellent thermal insulation performance at high vacuum in room temperature and have potential to further reduce thermal conductivity at the same conditions.

Government Microelectronics Assessment for Trust (GOMAT)

NASA Technical Reports Server (NTRS)

Berg, Melanie D.; LaBel, Kenneth A.

2018-01-01

NASA Electronic Parts and Packaging (NEPP) is developing a process to be employed in critical applications. The framework assesses levels of trust and assurance in microelectronic systems. The process is being created with participation from a variety of organizations. We present a synopsis of the framework that includes contributions from The Aerospace Corporation.

Reparable, high-density microelectronic module provides effective heat sink

NASA Technical Reports Server (NTRS)

Carlson, K. J.; Maytone, F. F.

1967-01-01

Reparable modular system is used for packaging microelectronic flat packs and miniature discrete components. This three-dimensional compartmented structure incorporates etched phosphor bronze sheets and frames with etched wire conductors. It provides an effective heat sink for electric power dissipation in the absence of convective cooling means.

Managing the Manpower Aspects of Applying Micro-Electronics Technology.

ERIC Educational Resources Information Center

Thornton, P.; Routledge, C.

1980-01-01

Outlines major effects that the application of micro-electronics devices in products/processes and in office systems will have on future manpower and skill requirements in manufacturing organizations. Identifies the type of problems these changes will pose for manpower managers. Provides general guidelines for the successful management of these…

Teaching and Learning in a Microelectronic Age.

ERIC Educational Resources Information Center

Shane, Harold G.

General background information on microtechnologies with implications for educators provides an introduction to this review of past and current developments in microelectronics and specific ways in which the microchip is permeating society, creating problems and opportunities both in the workplace and the home. Topics discussed in the first of two…

Composite aerogel insulation for cryogenic liquid storage

NASA Astrophysics Data System (ADS)

Kyeongho, Kim; Hyungmook, Kang; Soojin, Shin; In Hwan, Oh; Changhee, Son; Hyung, Cho Yun; Yongchan, Kim; Sarng Woo, Karng

2017-02-01

High porosity materials such as aerogel known as a good insulator in a vacuum range (10-3 ∼ 1 Torr) was widely used to storage and to transport cryogenic fluids. It is necessary to be investigated the performance of aerogel insulations for cryogenic liquid storage in soft vacuum range to atmospheric pressure. A one-dimensional insulating experimental apparatus was designed and fabricated to consist of a cold mass tank, a heat absorber and an annular vacuum space with 5-layer (each 10 mm thickness) of the aerogel insulation materials. Aerogel blanket for cryogenic (used maximum temperature is 400K), aerogel blanket for normal temperature (used maximum temperature is 923K), and combination of the two kinds of aerogel blankets were 5-layer laminated between the cryogenic liquid wall and the ambient wall in vacuum space. Also, 1-D effective thermal conductivities of the insulation materials were evaluated by measuring boil-off rate from liquid nitrogen and liquid argon. In this study, the effective thermal conductivities and the temperature-thickness profiles of the two kinds of insulators and the layered combination of the two different aerogel blankets were presented.

High temperature circuit breaker

NASA Technical Reports Server (NTRS)

Edwards, R. N.; Travis, E. F.

1970-01-01

Alternating current circuit breaker is suitable for reliable long-term service at 1000 deg F in the vacuum conditions of outer space. Construction materials are resistant to nuclear radiation and vacuum welding. Service test conditions and results are given.

Degradable vinyl polymers for biomedical applications.

PubMed

Delplace, Vianney; Nicolas, Julien

2015-10-01

Vinyl polymers have been the focus of intensive research over the past few decades and are attractive materials owing to their ease of synthesis and their broad diversity of architectures, compositions and functionalities. Their carbon-carbon backbones are extremely resistant to degradation, however, and this property limits their uses. Degradable polymers are an important field of research in polymer science and have been used in a wide range of applications spanning from (nano)medicine to microelectronics and environmental protection. The development of synthetic strategies to enable complete or partial degradation of vinyl polymers is, therefore, of great importance because it will offer new opportunities for the application of these materials. This Review captures the most recent and promising approaches to the design of degradable vinyl polymers and discusses the potential of these materials for biomedical applications.

Study of bulk Hafnium oxide (HfO2) under compression

NASA Astrophysics Data System (ADS)

Pathak, Santanu; Mandal, Guruprasad; Das, Parnika

2018-04-01

Hafnium oxide (HfO2) is a technologically important material. This material has K-value of 25 and band gap 5.8 eV. A k value of 25-30 is preferred for a gate dielectric [1]. As it shows good insulating and capacitive properties, HfO2 is being considered as a replacement to SiO2 in microelectronic devices as gate dielectrics. On the other hand because of toughening mechanism due to phase transformation induced by stress field observed in these oxides, HFO2 has been a material of investigations in various configurations for a very long time. However the controversies about phase transition of HfO2 under pressure still exists. High quality synchrotron radiation has been used to study the structural phase transition of HfO2 under pressure.

Microelectronics Instrument Products Shock and Vibration Electro-optics: C-Qualification Test Report

NASA Technical Reports Server (NTRS)

1994-01-01

In this test report all measurements made during testing are recorded in ATP 20049 DS data sheets and are included in the log. The motor/encoder (henceforth referred to as the UUT) test sequence began with a baseline functional evaluation, which demonstrated that the motor satisfied the operating torque, cogging torque, winding resistance, and mechanical requirements of SOW. In addition, the encoder electrical requirements were verified, as well as the alignment of the encoder outputs relative tc, the motor shaft position. There were no discrepancies observed in this portion of the test. The UUT was then exposed to a number of environments, including thermal vacuum, thermal cycling, random and sine vibration, and mechanical shock. During the thermal environments, the performance of the UUT under load was verified at specified points in the cycles, as described in ATP 20049. In addition, the UUT was bench tested between the two thermal environments. No anomalies were observed during the thermal tests. The load attachment method was subsequently corrected, and vibration of S/N 0002 began while 0003 was being repaired.

Sharpening of field emitter tips using high-energy ions

DOEpatents

Musket, Ronald G.

1999-11-30

A process for sharpening arrays of field emitter tips of field emission cathodes, such as found in field-emission, flat-panel video displays. The process uses sputtering by high-energy (more than 30 keV) ions incident along or near the longitudinal axis of the field emitter to sharpen the emitter with a taper from the tip or top of the emitter down to the shank of the emitter. The process is particularly applicable to sharpening tips of emitters having cylindrical or similar (e.g., pyramidal) symmetry. The process will sharpen tips down to radii of less than 12 nm with an included angle of about 20 degrees. Because the ions are incident along or near the longitudinal axis of each emitter, the tips of gated arrays can be sharpened by high-energy ion beams rastered over the arrays using standard ion implantation equipment. While the process is particularly applicable for sharpening of arrays of field emitters in field-emission flat-panel displays, it can be effectively utilized in the fabrication of other vacuum microelectronic devices that rely on field emission of electrons.

DEVELOPMENT AND DEPLOYMENT OF VACUUM SALT DISTILLATION AT THE SAVANNAH RIVER SITE

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pierce, R.; Pak, D.; Edwards, T.

2010-10-28

The Savannah River Site has a mission to dissolve fissile materials and disposition them. The primary fissile material is plutonium dioxide (PuO{sub 2}). To support dissolution of these materials, the Savannah River National Laboratory (SRNL) designed and demonstrated a vacuum salt distillation (VSD) apparatus using both representative radioactive samples and non-radioactive simulant materials. Vacuum salt distillation, through the removal of chloride salts, increases the quantity of materials suitable for processing in the site's HB-Line Facility. Small-scale non-radioactive experiments at 900-950 C show that >99.8 wt % of the initial charge of chloride salt distilled from the sample boat with recoverymore » of >99.8 wt % of the ceric oxide (CeO{sub 2}) - the surrogate for PuO{sub 2} - as a non-chloride bearing 'product'. Small-scale radioactive testing in a glovebox demonstrated the removal of sodium chloride (NaCl) and potassium chloride (KCl) from 13 PuO{sub 2} samples. Chloride concentrations were distilled from a starting concentration of 1.8-10.8 wt % to a final concentration <500 mg/kg chloride. Initial testing of a non-radioactive, full-scale production prototype is complete. A designed experiment evaluated the impact of distillation temperature, time at temperature, vacuum, product depth, and presence of a boat cover. Significant effort has been devoted to mechanical considerations to facilitate simplified operation in a glovebox.« less

Preface to the special issue of Solid State Electronics EUROSOI/ULIS 2017

NASA Astrophysics Data System (ADS)

Nassiopoulou, Androula G.

2018-05-01

This special issue is devoted to selected papers presented at the EuroSOI-ULIS2017 international conference, held in Athens on 3-5 April 2017. EuroSOI-ULIS2017 Conference was mainly devoted to Si devices, which constitute the basic building blocks of any microelectronic circuit. It included papers on advanced Si technologies, novel nanoscale devices, advanced electronic materials and device architectures, mechanisms involved, test structures, substrate materials and technologies, modeling/simulation and characterization. Both CMOS and beyond CMOS devices were presented, covering the More Moore domain, as well as new functionalities in silicon-compatible nanostructures and innovative devices, representing the More than Moore domain (on-chip sensors, biosensors, energy harvesting devices, RF passives, etc.).

Transfer of InP epilayers by wafer bonding

NASA Astrophysics Data System (ADS)

Hjort, Klas

2004-08-01

Wafer bonding increases the freedom of design in the integration of dissimilar materials. For example, it is interesting to combine III-V compounds that have direct band gap and high mobility with silicon (Si) that is extensively used in microelectronic applications. The interest to integrate III-V-based materials with Si arises primarily from two types of applications: smart pixels for optical intra- and inter-chip interconnects in the so-called optoelectronic integrated circuits, and optoelectronic devices using some material advantages of combining III-V with Si. Also, in the III-V industry larger substrates are crucial for higher efficiency in high-volume production, and especially so for monolithic microwave integrated circuits (MMIC). For indium phosphide (InP) the development of large-area substrates has not been able to keep up with market demands. One way to circumvent this problem is to use silicon substrates that are large-area, low-cost, and mechanically strong with high thermal conductivity. In addition, silicon is transparent at the emission wavelengths most often used in InP-based optoelectronics. Unfortunately, the large lattice-mismatch, 8.1%, between silicon and InP, has limited the success of heteroepitaxial growth. Hence, one alternative to be reviewed is InP-to-Si wafer bonding. When a direct semiconductor interface is not needed there are several other means of wafer bonding, e.g. adhesive, eutectic, and solid-state. These processes can be used for direct integration of small islets of epitaxially thin InP microelectronics onto other substrates, e.g. by transferring of InP-based epilayers to a Si-based microwave circuit by pick-and-place, BCB resist adhesive bonding and sacrificing of the InP substrate.

Silicon Integrated Optics: Fabrication and Characterization

NASA Astrophysics Data System (ADS)

Shearn, Michael Joseph, II

For decades, the microelectronics industry has sought integration and miniaturization as canonized in Moore's Law, and has continued doubling transistor density about every two years. However, further miniaturization of circuit elements is creating a bandwidth problem as chip interconnect wires shrink as well. A potential solution is the creation of an on-chip optical network with low delays that would be impossible to achieve using metal buses. However, this technology requires integrating optics with silicon microelectronics. The lack of efficient silicon optical sources has stymied efforts of an all-Si optical platform. Instead, the integration of efficient emitter materials, such as III-V semiconductors, with Si photonic structures is a low-cost, CMOS-compatible alternative platform. This thesis focuses on making and measuring on-chip photonic structures suitable for on-chip optical networking. The first part of the thesis assesses processing techniques of silicon and other semiconductor materials. Plasmas for etching and surface modification are described and used to make bonded, hybrid Si/III-V structures. Additionally, a novel masking method using gallium implantation into silicon for pattern definition is characterized. The second part of the thesis focuses on demonstrations of fabricated optical structures. A dense array of silicon devices is measured, consisting of fully-etched grating couplers, low-loss waveguides and ring resonators. Finally, recent progress in the Si/III-V hybrid system is discussed. Supermode control of devices is described, which uses changing Si waveguide width to control modal overlap with the gain material. Hybrid Si/III-V, Fabry-Perot evanescent lasers are demonstrated, utilizing a CMOS-compatible process suitable for integration on in electronics platforms. Future prospects and ultimate limits of Si devices and the hybrid Si/III-V system are also considered.

Research Updates: The three M's (materials, metrology, and modeling) together pave the path to future nanoelectronic technologies

NASA Astrophysics Data System (ADS)

King, Sean W.; Simka, Harsono; Herr, Dan; Akinaga, Hiro; Garner, Mike

2013-10-01

Recent discussions concerning the continuation of Moore's law have focused on announcements by several major corporations to transition from traditional 2D planar to new 3D multi-gate field effect transistor devices. However, the growth and progression of the semiconductor microelectronics industry over the previous 4 decades has been largely driven by combined advances in new materials, lithography, and materials related process technologies. Looking forward, it is therefore anticipated that new materials and materials technologies will continue to play a significant role in both the pursuit of Moore's law and the evolution of the industry. In this research update, we discuss and illustrate some of the required and anticipated materials innovations that could potentially lead to the continuation of Moore's law for another decade (or more). We focus primarily on the innovations needed to achieve single digit nanometer technologies and illustrate how at these dimensions not only new materials but new metrologies and computational modeling will be needed.

Investigations of Heat Transfer in Vacuum between Room Temperature and 80 K

NASA Astrophysics Data System (ADS)

Hooks, J.; Demko, J. A.; E Fesmire, J.; Matsumoto, T.

2017-12-01

The heat transfer between room temperature and 80 K is controlled using various insulating material combinations. The modes of heat transfer are well established to be conduction and thermal radiation when in a vacuum. Multi-Layer Insulation (MLI) in a vacuum has long been the best approach. Typically this layered system is applied to the cold surface. This paper investigates the application of MLI to both the cold and warm surface to see whether there is a significant difference. In addition if MLI is on the warm surface, the cold side of the MLI may be below the critical temperature of some high temperature superconducting (HTS) materials. It has been proposed that HTS materials can serve to block thermal radiation. An experiment is conducted to measure this effect. Boil-off calorimetry is the method of measuring the heat transfer.

Effect of surface polishing and vacuum firing on electron stimulated desorption from 316LN stainless steel

DOE Office of Scientific and Technical Information (OSTI.GOV)

Malyshev, Oleg B., E-mail: oleg.malyshev@stfc.ac.uk; Hogan, Benjamin T.; Pendleton, Mark

2014-09-01

The reduction of thermal outgassing from stainless steel by surface polishing or vacuum firing is well-known in vacuum technology, and the consequent use of both techniques allows an even further reduction of outgassing. The aim of this study was to identify the effectiveness of surface polishing and vacuum firing for reducing electron-stimulated desorption (ESD) from 316LN stainless steel, which is a frequently used material for particle accelerator vacuum chambers and components. It was found that, unlike for thermal outgassing, surface polishing does not reduce the ESD yield and may even increase it, while vacuum firing of nonpolished sample reduces onlymore » the H{sub 2} ESD yield by a factor 2.« less

Use of space ultra-vacuum for high quality semiconductor thin film growth

NASA Technical Reports Server (NTRS)

Ignatiev, A.; Sterling, M.; Sega, R. M.

1992-01-01

The utilization of space for materials processing is being expanded through a unique concept of epitaxial thin film growth in the ultra-vacuum of low earth orbit (LEO). This condition can be created in the wake of an orbiting space vehicle; and assuming that the vehicle itself does not pertub the environment, vacuum levels of better than 10 exp -14 torr can be attained. This vacuum environment has the capacity of greatly enhancing epitaxial thin film growth and will be the focus of experiments conducted aboard the Wake Shield Facility (WSF) currently being developed by the Space Vacuum Epitaxy Center (SVEC), Industry, and NASA.

[Evaluation of the quality of poultry meat and its processing for vacuum packaging].

PubMed

Swiderski, F; Russel, S; Waszkiewicz-Robak, B; Cholewińska, E

1997-01-01

The aim of study was to evaluate the quality of poultry meat, roasted and smoked chicken and poultry pie packing under low and high vacuum. All investigated products were stored at +4 degrees C and evaluated by microbiological analysis. It was showed that packing under low and high vacuum inhibited development of aerobic microorganisms, proteolytic bacteria, yeasts and moulds. Vacuum-packaged storage of poultry meat and its products stimulated activity of anaerobic, nonsporeforming bacteria. The fast spoilage of fresh poultry meat was observed both under vacuum and conventional storage. The microbiology quality of poultry products depended on technology of production and microbiological quality of raw material.

Application of analytical redundancy management to Shuttle crafts. [computerized simulation of microelectronic implementation

NASA Technical Reports Server (NTRS)

Montgomery, R. C.; Tabak, D.

1979-01-01

The study involves the bank of filters approach to analytical redundancy management since this is amenable to microelectronic implementation. Attention is given to a study of the UD factorized filter to determine if it gives more accurate estimates than the standard Kalman filter when data processing word size is reduced. It is reported that, as the word size is reduced, the effect of modeling error dominates the filter performance of the two filters. However, the UD filter is shown to maintain a slight advantage in tracking performance. It is concluded that because of the UD filter's stability in the serial processing mode, it remains the leading candidate for microelectronic implementation.

Evaluation of a standardized micro-vacuum sampling method for collection of surface dust.

PubMed

Ashley, Kevin; Applegate, Gregory T; Wise, Tamara J; Fernback, Joseph E; Goldcamp, Michael J

2007-03-01

A standardized procedure for collecting dust samples from surfaces using a micro-vacuum sampling technique was evaluated. Experiments were carried out to investigate the collection efficiency of the vacuum sampling method described in ASTM Standard D7144, "Standard Practice for Collection of Surface Dust by Micro-Vacuum Sampling for Subsequent Metals Determination." Weighed masses ( approximately 5, approximately 10 and approximately 25 mg) of three NIST Standard Reference Materials (SRMs) were spiked onto surfaces of various substrates. The SRMs used were: (1) Powdered Lead-Based Paint; (2) Urban Particulate Matter; and (3) Trace Elements in Indoor Dust. Twelve different substrate materials were chosen to be representative of surfaces commonly encountered in occupational and/or indoor settings: (1) wood, (2) tile, (3) linoleum, (4) vinyl, (5) industrial carpet, (6) plush carpet, (7,8) concrete block (painted and unpainted), (9) car seat material, (10) denim, (11) steel, and (12) glass. Samples of SRMs originally spiked onto these surfaces were collected using the standardized micro-vacuum sampling procedure. Gravimetric analysis of material collected within preweighed Accucapinserts (housed within the samplers) was used to measure SRM recoveries. Recoveries ranged from 21.6% (+/- 10.4%, 95% confidence limit [CL]) for SRM 1579 from industrial carpet to 59.2% (+/- 11.0%, 95% CL) for SRM 1579 from glass. For most SRM/substrate combinations, recoveries ranged from approximately 25% to approximately 50%; variabilities differed appreciably. In general, SRM recoveries were higher from smooth and hard surfaces and lower from rough and porous surfaces. Material captured within collection nozzles attached to the sampler inlets was also weighed. A significant fraction of SRM originally spiked onto substrate surfaces was captured within collection nozzles. Percentages of SRMs captured within collection nozzles ranged from approximately 13% (+/- 4 - +/- 5%, 95% CLs) for SRMs 1579 and 2583 from industrial carpet to approximately 45% (+/- 7 - +/- 26%, 95% CLs) for SRM 1648 from glass, tile and steel. For some substrates, loose material from the substrate itself (i.e., substrate particles and fibers) was sometimes collected along with the SRM, both within Accucaps as well as collection nozzles. Co-collection of substrate material can bias results and contribute to sampling variability. The results of this work have provided performance data on the standardized micro-vacuum sampling procedure.

Vacuum pumps and systems: A review of current practice

NASA Technical Reports Server (NTRS)

Giles, Stuart

1986-01-01

A review of the fundamental characteristics of the many types of vacuum pumps and vacuum pumping systems is given. The optimum pumping range, relative cost, performance limitations, maintenance problems, system operating costs and similar subjects are discussed. Experiences from the thin film deposition, chemical processing, material handling, food processing and other industries, as well as space simulation are used to support conclusions and recommendations.

Gravitational vacuum energy in our recently accelerating universe

NASA Astrophysics Data System (ADS)

Bludman, Sidney

2009-04-01

We review current observations of the homogeneous cosmological expansion which, because they measure only kinematic variables, cannot determine the dynamics driving the recent accelerated expansion. The minimal fit to the data, the flat ACDM model, consisting of cold dark matter and a cosmological constant, interprets 4? geometrically as a classical spacetime curvature constant of nature, avoiding any reference to quantum vacuum energy. (The observed Uehling and Casimir effects measure forces due to QED vacuum polarization, but not any quantum material vacuum energies.) An Extended Anthropic Principle, that Dark Energy and Dark Gravity be indistinguishable, selects out flat ACDM. Prospective cosmic shear and galaxy clustering observations of the growth of fluctuations are intended to test whether the 'dark energy' driving the recent cosmological acceleration is static or moderately dynamic. Even if dynamic, observational differences between an additional negative-pressure material component within general relativity (Dark Energy) and low-curvature modifications of general relativity (Dark Gravity) will be extremely small.

Space Environmental Effects on Thermal Control Coatings

NASA Technical Reports Server (NTRS)

OBrien, Susan K.; Workman, Gary L.

1997-01-01

The study of long term near ultra-violet (NUV) effects in a vacuum atmosphere, is a crucial element for space applications. NUV radiation causes significant changes in the reflectance of many coatings and types of materials. An ultra high vacuum NUV system was assembled in order to investigate various coatings and materials in this hostile environment. The vacuum is an ion pump that maintains a minimum vacuum in the mid 10(exp -9) range. The system has a base pressure of 10(exp -9) torr and this base pressure is maintained with the ion pump. The NUV exposure was maintained at 2-3 suns which allows accelerated NUV exposure without overheating the samples. The goal of this test was to maintain an intensity of 3.4 x 10(exp -2) Watts/cm(exp 2) which equals 2.9 NUV suns. An NUV sun is defined as 1.16 Watts/cm(exp 2) integrated over wavelength of 200-400 nanometers.

Investigation on Surface Insulation Strength of Machinable Ceramic Material under Pulsed Voltage in Vacuum

NASA Astrophysics Data System (ADS)

Zhang, Guan-Jun; Zhao, Wen-Bin; Ma, Xin-Pei; Li, Guang-Xin; Ma, Kui; Zheng, Nan; Yan, Zhang

Ceramic material has been widely used as insulator in vacuum. Their high hardness and brittle property brings some difficulty in the application. A new kind of machinable ceramic was invented recently. The ceramic can be machined easily and accurately after being sintered, which provides the possibility of making the insulator with fine and complicated configuration. The paper studies its surface insulation performance and flashover phenomena under pulsed excitation in vacuum. The ceramic samples with different crystallization parameters are tested under the vacuum level of 10-4 Pa. The machinable ceramic behaves better surface insulation performance than comparative the Al2O3 and glass sample. The effect of crystallization level on the trap density and flashover current is also presented. After flashover shots many times, the surface microscopic patterns of different samples are observed to investigate the damage status, which can be explained by the thermal damage mechanism.

Tools to Study Interfaces for Superconducting, Thermoelectric, and Magnetic Materials at the University of Houston

DTIC Science & Technology

2016-09-01

The MBE system, which grows crystalline thin films in ultrahigh vacuum (UHV) with precise control of thickness, composition, and morphology, will...used on our sputtering system to fabricate thin films with interfaces. - The electronic structures of these materials will be investigated using the...magnetization/transport measurements. The MBE system, which grows crystalline thin films in ultrahigh vacuum (UHV) with precise control of thickness, composition

Making Microscopic Cubes Of Boron

NASA Technical Reports Server (NTRS)

Faulkner, Joseph M.

1993-01-01

Production of finely divided cubes of boron involves vacuum-deposition technology and requires making of template. Template supports pattern of checkered squares 25 micrometers on side, which are etched 25 micrometers into template material. Template coasted uniformly with paralyene or some similar vacuum coating with low coefficient of adhesion. Intended application to solid rocket fuels, explosives, and pyrotechnics; process used for other applications, from manufacture of pharmaceuticals to processing of nuclear materials.

Comparative study of post-growth annealing of Cu(hfac)2, Co2(CO)8 and Me2Au(acac) metal precursors deposited by FEBID.

PubMed

Puydinger Dos Santos, Marcos Vinicius; Szkudlarek, Aleksandra; Rydosz, Artur; Guerra-Nuñez, Carlos; Béron, Fanny; Pirota, Kleber Roberto; Moshkalev, Stanislav; Diniz, José Alexandre; Utke, Ivo

2018-01-01

Non-noble metals, such as Cu and Co, as well as noble metals, such as Au, can be used in a number modern technological applications, which include advanced scanning-probe systems, magnetic memory and storage, ferroelectric tunnel junction memristors, metal interconnects for high performance integrated circuits in microelectronics and nano-optics applications, especially in the areas of plasmonics and metamaterials. Focused-electron-beam-induced deposition (FEBID) is a maskless direct-write tool capable of defining 3-dimensional metal deposits at nanometre scale for above applications. However, codeposition of organic ligands when using organometallic precursors is a typical problem that limits FEBID of pure metal nanostructures. In this work, we present a comparative study using a post-growth annealing protocol at 100, 200, and 300 °C under high vacuum on deposits obtained from Co 2 (CO) 8 , Cu(II)(hfac) 2 , and Me 2 Au(acac) to study improvements on composition and electrical conductivity. Although the as-deposited material was similar for all precursors, metal grains embedded in a carbonaceous matrix, the post-growth annealing results differed. Cu-containing deposits showed the formation of pure Cu nanocrystals at the outer surface of the initial deposit for temperatures above 100 °C, due to the migration of Cu atoms from the carbonaceous matrix containing carbon, oxygen, and fluorine atoms. The average size of the Cu crystals doubles between 100 and 300 °C of annealing temperature, while the composition remains constant. In contrast, for Co-containing deposits oxygen release was observed upon annealing, while the carbon content remained approximately constant; the cobalt atoms coalesced to form a metallic film. The as-deposited Au-containing material shows subnanometric grains that coalesce at 100 °C, maintaining the same average size at annealing temperatures up to 300 °C. Raman analysis suggests that the amorphous carbonaceous matrix of the as-written Co, Cu and Au deposits turned into nanocrystalline graphite with comparable crystal sizes of 12-14 nm at 300 °C annealing temperature. However, we observed a more effective formation of graphite clusters in Co- than in Cu- and Au-containing deposits. The graphitisation has a minor influence on the electrical conductivity improvements of Co-C deposits, which is attributed to the high as-deposited Co content and the related metal grain percolation. On the contrary, electrical conductivity improvements by factors of 30 and 12 for, respectively, Cu-C and Au-C deposits with low metal content are mainly attributed to the graphitisation. This relatively simple vacuum-based post-growth annealing protocol may be useful for other precursors as it proved to be efficient in reliably tuning the electrical properties of as-deposited FEBID materials. Finally, a H 2 -assisted gold purification protocol is demonstrated at temperatures around 300 °C by fully removing the carbon matrix and drastically reducing the electrical resistance of the deposit.

Effect of additional heat treatment of 2024-T3 on the growth of fatigue crack in air and in vacuum

NASA Technical Reports Server (NTRS)

Louwaard, E. P.

1986-01-01

In order to determine the influence of ductility on the fatigue crack growth rate of aluminum alloys, fatigue tests were carried out on central notched specimens of 2024-T3 and 2024-T8 sheet material. The 2024-T8 material was obtained by an additional heat treatment applied on 2024-T3 (18 hours at 192 C), which increased the static yield strength from 43.6 to 48.9 kgf/sq mm. A change in the ultimate strength was not observed. Fatigue tests were carried out on both materials in humid air and in high vacuum. According to a new crack propagation model, crack extension is supported to be caused by a slip-related process and debonding triggered by the environment. This model predicts an effect of the ductility on the crack growth rate which should be smaller in vacuum than in humid air; however, this was not confirmed. In humid air the crack-growth rate in 2024-T8 was about 2 times faster than in 2024-T3, while in vacuum the ratio was about 2.5. Crack closure measurements gave no indications that crack closure played a significant role in both materials. Some speculative explanations are briefly discussed.

Role of Outgassing of ITER Vacuum Vessel In-Wall Shielding Materials in Leak Detection of ITER Vacuum Vessel

NASA Astrophysics Data System (ADS)

Maheshwari, A.; Pathak, H. A.; Mehta, B. K.; Phull, G. S.; Laad, R.; Shaikh, M. S.; George, S.; Joshi, K.; Khan, Z.

2017-04-01

ITER Vacuum Vessel is a torus-shaped, double wall structure. The space between the double walls of the VV is filled with In-Wall Shielding Blocks (IWS) and Water. The main purpose of IWS is to provide neutron shielding during ITER plasma operation and to reduce ripple of Toroidal Magnetic Field (TF). Although In-Wall Shield Blocks (IWS) will be submerged in water in between the walls of the ITER Vacuum Vessel (VV), Outgassing Rate (OGR) of IWS materials plays a significant role in leak detection of Vacuum Vessel of ITER. Thermal Outgassing Rate of a material critically depends on the Surface Roughness of material. During leak detection process using RGA equipped Leak detector and tracer gas Helium, there will be a spill over of mass 3 and mass 2 to mass 4 which creates a background reading. Helium background will have contribution of Hydrogen too. So it is necessary to ensure the low OGR of Hydrogen. To achieve an effective leak test it is required to obtain a background below 1 × 10-8 mbar 1 s-1 and hence the maximum Outgassing rate of IWS Materials should comply with the maximum Outgassing rate required for hydrogen i.e. 1 x 10-10 mbar 1 s-1 cm-2 at room temperature. As IWS Materials are special materials developed for ITER project, it is necessary to ensure the compliance of Outgassing rate with the requirement. There is a possibility of diffusing the gasses in material at the time of production. So, to validate the production process of materials as well as manufacturing of final product from this material, three coupons of each IWS material have been manufactured with the same technique which is being used in manufacturing of IWS blocks. Manufacturing records of these coupons have been approved by ITER-IO (International Organization). Outgassing rates of these coupons have been measured at room temperature and found in acceptable limit to obtain the required Helium Background. On the basis of these measurements, test reports have been generated and got approved by IO. This paper will describe the preparation, characteristics and cleaning procedure of samples, description of the system, Outgassing rate Measurement of these samples to ensure the accurate leak detection.

Designing a chevron unit for a microelectronic position-sensitive detector with two microchannel plates

NASA Astrophysics Data System (ADS)

Kosulya, A. V.; Verbitskii, V. G.

2017-09-01

The dependence of the transverse section of an electron beam on the distance between plates and on the accelerating potential difference is determined for a chevron unit of a microelectronic position-sensitive detector (MPSD) with two microchannel plates. The geometry of the MPSD chevron unit is designed and optimized.

Microelectronic Information Processing Systems: Computing Systems. Summary of Awards Fiscal Year 1994.

ERIC Educational Resources Information Center

National Science Foundation, Arlington, VA. Directorate for Computer and Information Science and Engineering.

The purpose of this summary of awards is to provide the scientific and engineering communities with a summary of the grants awarded in 1994 by the National Science Foundation's Division of Microelectronic Information Processing Systems. Similar areas of research are grouped together. Grantee institutions and principal investigators are identified…

Complex VLSI Feature Comparison for Commercial Microelectronics Verification

DTIC Science & Technology

2014-03-27

69 4.2.4 Circuit E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 4.3 Summary...used for high-performance consumer microelectronics. Volume is a significant factor in constraining the technology limit for defense circuits, but it...surveyed in a 2010 Department of Commerce report found counterfeit chips difficult to identify due to improved fabrication quality in overseas counterfeit

Center for space microelectronics technology

NASA Technical Reports Server (NTRS)

1993-01-01

The 1992 Technical Report of the Jet Propulsion Laboratory Center for Space Microelectronics Technology summarizes the technical accomplishments, publications, presentations, and patents of the center during the past year. The report lists 187 publications, 253 presentations, and 111 new technology reports and patents in the areas of solid-state devices, photonics, advanced computing, and custom microcircuits.

The large scale microelectronics Computer-Aided Design and Test (CADAT) system

NASA Technical Reports Server (NTRS)

Gould, J. M.

1978-01-01

The CADAT system consists of a number of computer programs written in FORTRAN that provide the capability to simulate, lay out, analyze, and create the artwork for large scale microelectronics. The function of each software component of the system is described with references to specific documentation for each software component.

The Tao of Microelectronics

NASA Astrophysics Data System (ADS)

Zhang, Yumin

2014-12-01

Microelectronics is a challenging course to many undergraduate students and is often described as very messy. Before taking this course, all the students have learned circuit analysis, where basically all the problems can be solved by applying Kirchhoff's laws. In addition, most engineering students have also learned engineering mechanics: statics and dynamics, where Newton's laws and related principles can be applied in solving all the problems. However, microelectronics is not as clean as these courses. There are hundreds of equations for different circuits, and it is impossible to remember which equation should be applied to which circuit. One of the common pitfalls in learning this course is over-focusing at the equation level and ignoring the ideas (Tao) behind it. Unfortunately, these ideas are not summarized and emphasized in most microelectronics textbooks, though they cover various electronic circuits comprehensively. Therefore, most undergraduate students feel at a loss when they start to learn this topic. This book tries to illustrate the major ideas and the basic analysis techniques, so that students can derive the right equations easily when facing an electronic circuit.

Characterization of the Heat Extraction Capability of a Compliant, Sliding, Thermal Interface for Use in a High Temperature, Vacuum, Microgravity Furnace

NASA Technical Reports Server (NTRS)

Bellomy-Ezell, Jenny; Farmer, Jeff; Breeding, Shawn; Spivey, Reggie

2001-01-01

A compliant, thermal interface material is tested to evaluate its thermal behavior at elevated temperatures, in vacuum conditions, and under varying levels of compression. Preliminary results indicate that the thermal performance of this polymer fiber-based, felt-like material is sufficient to meet thermal extraction requirements for the Quench Module Insert, a Bridgman furnace for microgravity material science investigation. This paper discusses testing and modeling approaches employed, gives of a status of characterization activities and provides preliminary test results.

Direct current sputtering of boron from boron/coron mixtures

DOEpatents

Timberlake, John R.; Manos, Dennis; Nartowitz, Ed

1994-01-01

A method for coating a substrate with boron by sputtering includes lowering the electrical resistance of a boron-containing rod to allow electrical conduction in the rod; placing the boron-containing rod inside a vacuum chamber containing substrate material to be coated; applying an electrical potential between the boron target material and the vacuum chamber; countering a current avalanche that commences when the conduction heating rate exceeds the cooling rate, and until a steady equilibrium heating current is reached; and, coating the substrate material with boron by sputtering from the boron-containing rod.

Dimensional-stability studies of candidate space-telescope mirror-substrate materials

NASA Technical Reports Server (NTRS)

Jerke, J. M.; Platt, R. J., Jr.

1972-01-01

The effects of aging, vacuum exposure, and thermal cycling on the dimensional stability of mirror-substrate materials, fused silica, Cer-Vit, Kanigen-coated beryllium, polycrystalline silicon, and U.L.E. fused silica were investigated. A multiple-beam interferometer was used to determine nonrecoverable surface-shape changes of the 12.7-cm-diameter mirrors with substrates of these materials. Thermal cycling and aging in vacuum produced the largest changes, but only a few were as large as 1/30 wavelength, where the wavelength was 632.8 nm.

Possibility of using sources of vacuum ultraviolet irradiation to solve problems of space material science

NASA Technical Reports Server (NTRS)

Verkhoutseva, E. T.; Yaremenko, E. I.

1974-01-01

An urgent problem in space materials science is simulating the interaction of vacuum ultraviolet (VUV) of solar emission with solids in space conditions, that is, producing a light source with a distribution that approximates the distribution of solar energy. Information is presented on the distribution of the energy flux of VUV of solar radiation. Requirements that must be satisfied by the VUV source used for space materials science are formulated, and a critical evaluation is given of the possibilities of using existing sources for space materials science. From this evaluation it was established that none of the sources of VUV satisfies the specific requirements imposed on the simulator of solar radiation. A solution to the problem was found to be in the development of a new type of source based on exciting a supersonic gas jet flowing into vacuum with a sense electron beam. A description of this gas-jet source, along with its spectral and operation characteristics, is presented.

Convenient mounting method for electrical measurements of thin samples

NASA Technical Reports Server (NTRS)

Matus, L. G.; Summers, R. L.

1986-01-01

A method for mounting thin samples for electrical measurements is described. The technique is based on a vacuum chuck concept in which the vacuum chuck simultaneously holds the sample and established electrical contact. The mounting plate is composed of a glass-ceramic insulating material and the surfaces of the plate and vacuum chuck are polished. The operation of the vacuum chuck is examined. The contacts on the sample and mounting plate, which are sputter-deposited through metal masks, are analyzed. The mounting method was utilized for van der Pauw measurements.

MoS2-Filled PEEK Composite as a Self-Lubricating Material for Aerospace Applications

NASA Technical Reports Server (NTRS)

Theiler, Geraldine; Gradt, Thomas

2010-01-01

At BAM, several projects were conducted in the past years dealing with the tribological properties of friction couples at cryogenic temperature and in vacuum environment. Promising candidates for vacuum application are MoS2-filled PEEK/PTFE composites, which showed a friction coefficient as low as 0.03 in high vacuum. To complete the tribological profile of these composites, further tests were performed in ultra-high vacuum (UHV) at room temperature. In this paper, friction and stick slip behavior, as well as outgassing characteristics during the test are presented.

Growth control of oxygen stoichiometry in homoepitaxial SrTiO3 films by pulsed laser epitaxy in high vacuum

PubMed Central

Lee, Ho Nyung; Ambrose Seo, Sung S.; Choi, Woo Seok; Rouleau, Christopher M.

2016-01-01

In many transition metal oxides, oxygen stoichiometry is one of the most critical parameters that plays a key role in determining the structural, physical, optical, and electrochemical properties of the material. However, controlling the growth to obtain high quality single crystal films having the right oxygen stoichiometry, especially in a high vacuum environment, has been viewed as a challenge. In this work, we show that, through proper control of the plume kinetic energy, stoichiometric crystalline films can be synthesized without generating oxygen defects even in high vacuum. We use a model homoepitaxial system of SrTiO3 (STO) thin films on single crystal STO substrates. Physical property measurements indicate that oxygen vacancy generation in high vacuum is strongly influenced by the energetics of the laser plume, and it can be controlled by proper laser beam delivery. Therefore, our finding not only provides essential insight into oxygen stoichiometry control in high vacuum for understanding the fundamental properties of STO-based thin films and heterostructures, but expands the utility of pulsed laser epitaxy of other materials as well. PMID:26823119

APPLICATION OF VACUUM SALT DISTILLATION TECHNOLOGY FOR THE REMOVAL OF FLUORIDE

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pierce, R.; Pak, D.

2011-08-10

Vacuum distillation of chloride salts from plutonium oxide (PuO{sub 2}) and simulant PuO{sub 2} has been previously demonstrated at Department of Energy (DOE) sites using kilogram quantities of chloride salt. The apparatus for vacuum distillation contains a zone heated using a furnace and a zone actively cooled using either recirculated water or compressed air. During a vacuum distillation operation, a sample boat containing the feed material is placed into the apparatus while it is cool, and the system is sealed. The system is evacuated using a vacuum pump. Once a sufficient vacuum is attained, heating begins. Volatile salts distill frommore » the heated zone to the cooled zone where they condense, leaving behind the non-volatile materials in the feed boat. The application of vacuum salt distillation (VSD) is of interest to the HB-Line Facility and the MOX Fuel Fabrication Facility (MFFF) at the Savannah River Site (SRS). Both facilities are involved in efforts to disposition excess fissile materials. Many of these materials contain chloride and fluoride salt concentrations which make them unsuitable for dissolution without prior removal of the chloride and fluoride salts. Between September 2009 and January 2011, the Savannah River National Laboratory (SRNL) and HB-Line designed, developed, tested, and successfully deployed a system for the distillation of chloride salts. Subsequent efforts are attempting to adapt the technology for the removal of fluoride. Fluoride salts of interest are less-volatile than the corresponding chloride salts. Consequently, an alternate approach is required for the removal of fluoride without significantly increasing the operating temperature. HB-Line Engineering requested SRNL to evaluate and demonstrate the feasibility of an alternate approach using both non-radioactive simulants and plutonium-bearing materials. Whereas the earlier developments targeted the removal of sodium chloride (NaCl) and potassium chloride (KCl), the current activities are concerned with the removal of the halide ions associated with plutonium trifluoride (PuF{sub 3}), plutonium tetrafluoride (PuF{sub 4}), calcium fluoride (CaF{sub 2}), and calcium chloride (CaCl{sub 2}). This report discusses non-radioactive testing of small-scale and pilot-scale systems and radioactive testing of a small-scale system. Experiments focused on demonstrating the chemistry for halide removal and addressing the primary engineering questions associated with a change in the process chemistry.« less

Effective Porosity Measurements by Wet- and Dry-type Vacuum Saturations using Process-Programmable Vacuum Saturation System

NASA Astrophysics Data System (ADS)

Lee, T. J.; Lee, K. S., , Dr; Lee, S. K.

2017-12-01

One of the most important factors in measuring effective porosity by vacuum saturation method is that the air in the pore space can be fully substituted by water during the vacuum saturation process. International Society of Rock Mechanics (ISRM) suggests vacuuming a rock sample submerged in the water, while American Society of Test and Materials (ASTM) vacuuming the sample and water separately and then pour the water to the sample. In this study, we call the former wet-type vacuum saturation (WVS) method and the latter dry-type vacuum saturation (DVS) method, and compare the effective porosity measured by the two different vacuum saturation processes. For that purpose, a vacuum saturation system has been developed, which can support both WVS and DVS by only changing the process by programming. Comparison of effective porosity has been made for a cement mortar and rock samples. As a result, DVS can substitute more void volume to water than WVS, which in turn insists that DVS can provide more exact value of effective porosity than WVS.

Scanning Probe Microscopy | Materials Science | NREL

Science.gov Websites

. Capability of use with ultra-high vacuum makes NREL Scanning Probe Microscopy particularly valuable for vacuum, as appropriate Field of view from atoms up to about 100 µm (vertical limit of about 7 µm

Radiation protection using Martian surface materials in human exploration of Mars

NASA Technical Reports Server (NTRS)

Kim, M. H.; Thibeault, S. A.; Wilson, J. W.; Heilbronn, L.; Kiefer, R. L.; Weakley, J. A.; Dueber, J. L.; Fogarty, T.; Wilkins, R.

2001-01-01

To develop materials for shielding astronauts from the hazards of GCR, natural Martian surface materials are considered for their potential as radiation shielding for manned Mars missions. The modified radiation fluences behind various kinds of Martian rocks and regolith are determined by solving the Boltzmann equation using NASA Langley's HZETRN code along with the 1977 Solar Minimum galactic cosmic ray environmental model. To develop structural shielding composite materials for Martian surface habitats, theoretical predictions of the shielding properties of Martian regolith/polyimide composites has been computed to assess their shielding effectiveness. Adding high-performance polymer binders to Martian regolith to enhance structural properties also enhances the shielding properties of these composites because of the added hydrogenous constituents. Heavy ion beam testing of regolith simulant/polyimide composites is planned to validate this prediction. Characterization and proton beam tests are performed to measure structural properties and to compare the shielding effects on microelectronic devices, respectively.

Development and Testing of an ISRU Soil Mechanics Vacuum Test Facility

NASA Technical Reports Server (NTRS)

Kleinhenz, Julie E.; Wilkinson, R. Allen

2014-01-01

For extraterrestrial missions, earth based testing in relevant environments is key to successful hardware development. This is true for both early component level development and system level integration. For In-Situ Resource Utilization (ISRU) on the moon, hardware must interface with the surface material, or regolith, in a vacuum environment. A relevant test environment will therefore involve a vacuum chamber with a controlled, properly conditioned bed of lunar regolith simulant. However, in earth-based granular media, such as lunar regolith simulant, gases trapped within the material pore structures and water adsorbed to all particle surfaces will release when exposed to vacuum. Early vacuum testing has shown that this gas release can occur violently, which loosens and weakens the simulant, altering the consolidation state. A mid-size chamber (3.66 m tall, 1.5 m inner diameter) at the NASA Glenn Research Center has been modified to create a soil mechanics test facility. A 0.64 m deep by 0.914 m square metric ton bed of lunar simulant was placed under vacuum using a variety of pumping techniques. Both GRC-3 and LHT-3M simulant types were used. Data obtained from an electric cone penetrometer can be used to determine strength properties at vacuum including: cohesion, friction angle, bulk density and shear modulus. Simulant disruptions, caused by off-gassing, affected the strength properties, but could be mitigated by reducing pump rate. No disruptions were observed at pressures below 2.5 Torr, regardless of the pump rate. The slow off-gassing of the soil at low pressure lead to long test times; a full week to reach 10(exp -5) Torr. Robotic soil manipulation would enable multiple ISRU hardware test within the same vacuum cycle. The feasibility of a robotically controlled auger and tamper was explored at vacuum conditions.

Microelectronic electroporation array

NASA Astrophysics Data System (ADS)

Johnson, Lee J.; Shaffer, Kara J.; Skeath, Perry; Perkins, Frank K.; Pancrazio, Joseph; Scribner, Dean

2004-06-01

Gene Array technology has allowed for the study of gene binding by creating thousands of potential binding sites on a single device. A limitation of the current technology is that the effects of the gene and the gene-derived proteins cannot be studied in situ the same way, thousand site cell arrays are not readily available. We propose a new device structure to study the effects of gene modification on cells. This new array technology uses electroporation to target specific areas within a cell culture for transfection of genes. Electroporation arrays will allow high throughput analysis of gene effects on a given cell's response to a stress or a genes ability to restore normal cell function in disease modeling cells. Fluorescent imaging of dye labeled indicator molecules or cell viability will provide results indicating the most effective genes. The electroporation array consists of a microelectronic circuit, ancillary electronics, protecting electrode surface for cell culturing and a perfusion system for gene or drug delivery. The advantages of the current device are that there are 3200 sites for electroporation, all or any subsets of the electrodes can be activated. The cells are held in place by the electrode material. This technology could also be applied to high throughput screening of cell impermeant drugs.

Can zinc aluminate-titania composite be an alternative for alumina as microelectronic substrate?

PubMed Central

Roshni, Satheesh Babu; Sebastian, Mailadil Thomas; Surendran, Kuzhichalil Peethambharan

2017-01-01

Alumina, thanks to its superior thermal and dielectric properties, has been the leading substrate over several decades, for power and microelectronics circuits. However, alumina lacks thermal stability since its temperature coefficient of resonant frequency (τf) is far from zero (−60 ppmK−1). The present paper explores the potentiality of a ceramic composite 0.83ZnAl2O4-0.17TiO2 (in moles, abbreviated as ZAT) substrates for electronic applications over other commercially-used alumina-based substrates and synthesized using a non-aqueous tape casting method. The present substrate has τf of + 3.9 ppmK−1 and is a valuable addition to the group of thermo-stable substrates. The ZAT substrate shows a high thermal conductivity of 31.3 Wm−1K−1 (thermal conductivity of alumina is about 24.5 Wm−1K−1), along with promising mechanical, electrical and microwave dielectric properties comparable to that of alumina-based commercial substrates. Furthermore, the newly-developed substrate material shows exceptionally good thermal stability of dielectric constant, which cannot be met with any of the alumina-based HTCC substrates. PMID:28084459

The international electronics industry.

PubMed

LaDou, J; Rohm, T

1998-01-01

High-technology microelectronics has a major presence in countries such as China, India, Indonesia, and Malaysia, now the third-largest manufacturer of semiconductor chips. The migration of European, Japanese, and American companies accommodates regional markets. Low wage rates and limited enforcement of environmental regulations in developing countries also serve as incentives for the dramatic global migration of this industry. The manufacture of microelectonics products is accompanied by a high incidence of occupational illnesses, which may reflect the widespread use of toxic materials. Metals, photoactive chemicals, solvents, acids, and toxic gases are used in a wide variety of combinations and workplace settings. The industry also presents problems of radiation exposure and various occupational stressors, including some unresolved ergonomic issues. The fast-paced changes of the technology underlying this industry, as well as the stringent security precautions, have added to the difficulty of instituting proper health and safety measures. Epidemiologic studies reveal an alarming increase in spontaneous abortions among cleanroom manufacturing workers; no definitive study has yet identified its cause. Other health issues, including occupational cancer, are yet to be studied. The microelectronics industry is a good example of an industry that is exported to many areas of the world before health and safety problems are properly addressed and resolved.

Carbon nanotubes for thermal interface materials in microelectronic packaging

NASA Astrophysics Data System (ADS)

Lin, Wei

As the integration scale of transistors/devices in a chip/system keeps increasing, effective cooling has become more and more important in microelectronics. To address the thermal dissipation issue, one important solution is to develop thermal interface materials with higher performance. Carbon nanotubes, given their high intrinsic thermal and mechanical properties, and their high thermal and chemical stabilities, have received extensive attention from both academia and industry as a candidate for high-performance thermal interface materials. The thesis is devoted to addressing some challenges related to the potential application of carbon nanotubes as thermal interface materials in microelectronics. These challenges include: 1) controlled synthesis of vertically aligned carbon nanotubes on various bulk substrates via chemical vapor deposition and the fundamental understanding involved; 2) development of a scalable annealing process to improve the intrinsic properties of synthesized carbon nanotubes; 3) development of a state-of-art assembling process to effectively implement high-quality vertically aligned carbon nanotubes into a flip-chip assembly; 4) a reliable thermal measurement of intrinsic thermal transport property of vertically aligned carbon nanotube films; 5) improvement of interfacial thermal transport between carbon nanotubes and other materials. The major achievements are summarized. 1. Based on the fundamental understanding of catalytic chemical vapor deposition processes and the growth mechanism of carbon nanotube, fast synthesis of high-quality vertically aligned carbon nanotubes on various bulk substrates (e.g., copper, quartz, silicon, aluminum oxide, etc.) has been successfully achieved. The synthesis of vertically aligned carbon nanotubes on the bulk copper substrate by the thermal chemical vapor deposition process has set a world record. In order to functionalize the synthesized carbon nanotubes while maintaining their good vertical alignment, an in situ functionalization process has for the first time been demonstrated. The in situ functionalization renders the vertically aligned carbon nanotubes a proper chemical reactivity for forming chemical bonding with other substrate materials such as gold and silicon. 2. An ultrafast microwave annealing process has been developed to reduce the defect density in vertically aligned carbon nanotubes. Raman and thermogravimetric analyses have shown a distinct defect reduction in the CNTs annealed in microwave for 3 min. Fibers spun from the as-annealed CNTs, in comparison with those from the pristine CNTs, show increases of ˜35% and ˜65%, respectively, in tensile strength (˜0.8 GPa) and modulus (˜90 GPa) during tensile testing; an ˜20% improvement in electrical conductivity (˜80000 S m-1) was also reported. The mechanism of the microwave response of CNTs was discussed. Such a microwave annealing process has been extended to the preparation of reduced graphene oxide. 3. Based on the fundamental understanding of interfacial thermal transport and surface chemistry of metals and carbon nanotubes, two major transfer/assembling processes have been developed: molecular bonding and metal bonding. Effective improvement of the interfacial thermal transport has been achieved by the interfacial bonding. 4. The thermal diffusivity of vertically aligned carbon nanotube (VACNT, multi-walled) films was measured by a laser flash technique, and shown to be ˜30 mm2 s-1 along the tube-alignment direction. The calculated thermal conductivities of the VACNT film and the individual CNTs are ˜27 and ˜540 W m-1 K-1, respectively. The technique was verified to be reliable although a proper sampling procedure is critical. A systematic parametric study of the effects of defects, buckling, tip-to-tip contacts, packing density, and tube-tube interaction on the thermal diffusivity was carried out. Defects and buckling decreased the thermal diffusivity dramatically. An increased packing density was beneficial in increasing the collective thermal conductivity of the VACNT film; however, the increased tube-tube interaction in dense VACNT films decreased the thermal conductivity of the individual CNTs. The tip-to-tip contact resistance was shown to be ˜1x10-7 m2 K W -1. The study will shed light on the potential application of VACNTs as thermal interface materials in microelectronic packaging. 5. A combined process of in situ functionalization and microwave curing has been developed to effective enhance the interface between carbon nanotubes and the epoxy matrix. Effective medium theory has been used to analyze the interfacial thermal resistance between carbon nanotubes and polymer matrix, and that between graphite nanoplatlets and polymer matrix.

Corona And Ultraviolet Equipment For Testing Materials

NASA Technical Reports Server (NTRS)

Laue, Eric G.

1993-01-01

Two assemblies of laboratory equipment developed for use in testing abilities of polymers, paints, and other materials to withstand ultraviolet radiation and charged particles. One is vacuum ultraviolet source built around commercial deuterium lamp. Other exposes specimen in partial vacuum to both ultraviolet radiation and brush corona discharge. Either or both assemblies used separately or together to simulate approximately combination of solar radiation and charged particles encountered by materials aboard spacecraft in orbit around Earth. Also used to provide rigorous environmental tests of materials exposed to artificial ultraviolet radiation and charged particles in industrial and scientific settings or to natural ultraviolet radiation and charged particles aboard aircraft at high altitudes.

Porous Diblock Copolymer Thin Films in High-Performance Semiconductor Microelectronics

DOE Office of Scientific and Technical Information (OSTI.GOV)

Black, C.T.

2011-02-01

The engine fueling more than 40 years of performance improvements in semiconductor integrated circuits (ICs) has been industry's ability to pattern circuit elements at ever-higher resolution and with ever-greater precision. Steady advances in photolithography - the process wherein ultraviolet light chemically changes a photosensitive polymer resist material in order to create a latent image - have resulted in scaling of minimum printed feature sizes from tens of microns during the 1980s to sub-50 nanometer transistor gate lengths in today's state-of-the-art ICs. The history of semiconductor technology scaling as well as future technology requirements is documented in the International Technology Roadmapmore » for Semiconductors (ITRS). The progression of the semiconductor industry to the realm of nanometer-scale sizes has brought enormous challenges to device and circuit fabrication, rendering performance improvements by conventional scaling alone increasingly difficult. Most often this discussion is couched in terms of field effect transistor (FET) feature sizes such as the gate length or gate oxide thickness, however these challenges extend to many other aspects of the IC, including interconnect dimensions and pitch, device packing density, power consumption, and heat dissipation. The ITRS Technology Roadmap forecasts a difficult set of scientific and engineering challenges with no presently-known solutions. The primary focus of this chapter is the research performed at IBM on diblock copolymer films composed of polystyrene (PS) and poly(methyl-methacrylate) (PMMA) (PS-b-PMMA) with total molecular weights M{sub n} in the range of {approx}60K (g/mol) and polydispersities (PD) of {approx}1.1. These materials self assemble to form patterns having feature sizes in the range of 15-20nm. PS-b-PMMA was selected as a self-assembling patterning material due to its compatibility with the semiconductor microelectronics manufacturing infrastructure, as well as the significant body of existing research on understanding its material properties.« less

Thomson backscattering diagnostics of nanosecond electron bunches in high space charge regime

NASA Astrophysics Data System (ADS)

Plachinda, Pavel

The trend over the last 50 years of down-scaling the silicon transistor to achieve faster computations has led to doubling of the number of transistors and computation speed over about every two years. However, this trend cannot be maintained due to the fundamental limitations of silicon as the main material for the semiconducting industry. Therefore, there is an active search for exploration of alternate materials. Among the possible candidates that can may be able to replace silicon is graphene which has recently gained the most attention. Unique properties of graphene include exceedingly high carrier mobility, tunable band gap, huge optical density of a monolayer, anomalous quantum Hall effect, and many others. To be suitable for microelectronic applications the material should be semiconductive, i.e. have a non-zero band gap. Pristine graphene is a semimetal, but by the virtue of doping the graphene surface with different molecules and radicals a band gap can be opened. Because the electronic properties of all materials are intimately related to their atomic structure, characterization of molecular and electronic structure of functionalizing groups is of high interest. The ab-inito (from the first principles) calculations provide a unique opportunity to study the influence of the dopants and thus allow exploration of the physical phenomena in functionalized graphene structures. This ability paves the road to probe the properties based on the intuitive structural information only. A great advantage of this approach lies in the opportunity for quick screening of various atomic structures. We conducted a series of ab-inito investigations of graphene functionalized with covalently and hapticly bound groups, and demonstrated possible practical usage of functionalized graphene for microelectronic and optical applications. This investigation showed that it is possible produce band gaps in graphene (i.e., produce semiconducting graphene) of about 1 eV, without degrading the carrier mobility. This was archived by considering the influence of those adducts on electronic band structure and conductivity properties.

Cermet insert high voltage holdoff improvement for ceramic/metal vacuum devices

DOEpatents

Ierna, W.F.

1986-03-11

An improved metal-to-ceramic seal is provided wherein the ceramic body of the seal contains an integral region of cermet material in electrical contact with the metallic member, e.g., an electrode, of the seal. The seal is useful in high voltage vacuum devices, e.g., vacuum switches, and increases the high-voltage holdoff capabilities of such devices. A method of fabricating such seals is also provided.

Cermet insert high voltage holdoff for ceramic/metal vacuum devices

DOEpatents

Ierna, William F.

1987-01-01

An improved metal-to-ceramic seal is provided wherein the ceramic body of the seal contains an integral region of cermet material in electrical contact with the metallic member, e.g., an electrode, of the seal. The seal is useful in high voltage vacuum devices, e.g., vacuum switches, and increases the high-voltage holdoff capabilities of such devices. A method of fabricating such seals is also provided.

Insulation Test Cryostat with Lift Mechanism

NASA Technical Reports Server (NTRS)

Dokos, Adam G. (Inventor); Fesmire, James E. (Inventor)

2014-01-01

A multi-purpose, cylindrical thermal insulation test apparatus is used for testing insulation materials and systems of materials using a liquid boil-off calorimeter system for absolute measurement of the effective thermal conductivity (k-value) and heat flux of a specimen material at a fixed environmental condition (cold-side temperature, warm-side temperature, vacuum pressure level, and residual gas composition). The apparatus includes an inner vessel for receiving a liquid with a normal boiling point below ambient temperature, such as liquid nitrogen, enclosed within a vacuum chamber. A cold mass assembly, including the upper and lower guard chambers and a middle test vessel, is suspended from a lid of the vacuum canister. Each of the three chambers is filled and vented through a single feedthrough. All fluid and instrumentation feedthroughs are mounted and suspended from a top domed lid to allow easy removal of the cold mass. A lift mechanism allows manipulation of the cold mass assembly and insulation test article.

Insulation Test Cryostat with Lift Mechanism

NASA Technical Reports Server (NTRS)

Fesmire, James E. (Inventor); Dokos, Adam G. (Inventor)

2016-01-01

A multi-purpose, cylindrical thermal insulation test apparatus is used for testing insulation materials and systems of materials using a liquid boil-off calorimeter system for absolute measurement of the effective thermal conductivity (k-value) and heat flux of a specimen material at a fixed environmental condition (cold-side temperature, warm-side temperature, vacuum pressure level, and residual gas composition). An inner vessel receives liquid with a normal boiling point below ambient temperature, such as liquid nitrogen, enclosed within a vacuum chamber. A cold mass assembly, including upper and lower guard chambers and middle test vessel, is suspended from a lid of the vacuum canister. Each of the three chambers is filled and vented through a single feedthrough. All fluid and instrumentation feedthroughs are mounted and suspended from a top domed lid allowing easy removal of the cold mass. A lift mechanism allows manipulation of the cold mass assembly and insulation test article.

Recovery of materials from waste printed circuit boards by vacuum pyrolysis and vacuum centrifugal separation.

PubMed

Zhou, Yihui; Wu, Wenbiao; Qiu, Keqiang

2010-11-01

In this research, a two-step process consisting of vacuum pyrolysis and vacuum centrifugal separation was employed to treat waste printed circuit boards (WPCBs). Firstly, WPCBs were pyrolysed under vacuum condition at 600 °C for 30 min in a lab-scale reactor. Then, the obtained pyrolysis residue was heated under vacuum until the solder was melted, and then the molten solder was separated from the pyrolysis residue by the centrifugal force. The results of vacuum pyrolysis showed that the type-A of WPCBs (the base plates of which was made from cellulose paper reinforced phenolic resin) pyrolysed to form an average of 67.97 wt.% residue, 27.73 wt.% oil, and 4.30 wt.% gas; and pyrolysis of the type-B of WPCBs (the base plates of which was made from glass fiber reinforced epoxy resin) led to an average mass balance of 72.20 wt.% residue, 21.45 wt.% oil, and 6.35 wt.% gas. The results of vacuum centrifugal separation showed that the separation of solder was complete when the pyrolysis residue was heated at 400 °C, and the rotating drum was rotated at 1200 rpm for 10 min. The pyrolysis oil and gas can be used as fuel or chemical feedstock after treatment. The pyrolysis residue after solder separation contained various metals, glass fibers and other inorganic materials, which could be recycled for further processing. The recovered solder can be reused directly and it can also be a good resource of lead and tin for refining. Copyright © 2010 Elsevier Ltd. All rights reserved.

Laser Scanner Tests For Single-Event Upsets

NASA Technical Reports Server (NTRS)

Kim, Quiesup; Soli, George A.; Schwartz, Harvey R.

1992-01-01

Microelectronic advanced laser scanner (MEALS) is opto/electro/mechanical apparatus for nondestructive testing of integrated memory circuits, logic circuits, and other microelectronic devices. Multipurpose diagnostic system used to determine ultrafast time response, leakage, latchup, and electrical overstress. Used to simulate some of effects of heavy ions accelerated to high energies to determine susceptibility of digital device to single-event upsets.

Assessing Advanced High School and Undergraduate Students' Thinking Skills: The Chemistry--From the Nanoscale to Microelectronics Module

ERIC Educational Resources Information Center

Dori, Yehudit Judy; Dangur, Vered; Avargil, Shirly; Peskin, Uri

2014-01-01

Chemistry students in Israel have two options for studying chemistry: basic or honors (advanced placement). For instruction in high school honors chemistry courses, we developed a module focusing on abstract topics in quantum mechanics: Chemistry--From the Nanoscale to Microelectronics. The module adopts a visual-conceptual approach, which…

Microelectronics in F. E.: Some Personal Perceptions. An Occasional Paper.

ERIC Educational Resources Information Center

Dean, K. J.

The recent microelectronics developments are having, and will continue to have, a sharp impact on various industries in Great Britain, and thus on the capacity of the Further Education System to produce qualified graduates. To maintain a high quality of education, instructors must learn of these new developments and teach them to their vocational…

Reliability Considerations for Ultra- Low Power Space Applications

NASA Technical Reports Server (NTRS)

White, Mark; Johnston, Allan

2012-01-01

NASA, the aerospace community, and other high reliability (hi-rel) users of advanced microelectronic products face many challenges as technology continues to scale into the deep sub- micron region and ULP devices are sought after. Technology trends, ULP microelectronics, scaling and performance tradeoffs, reliability considerations, and spacecraft environments will be presented from a ULP perspective for space applications.

Sealed symmetric multilayered microelectronic device package with integral windows

DOEpatents

Peterson, Kenneth A.; Watson, Robert D.

2002-01-01

A sealed symmetric multilayered package with integral windows for housing one or more microelectronic devices. The devices can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the windows being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic devices can be flip-chip bonded and oriented so that the light-sensitive sides are optically accessible through the windows. The result is a compact, low-profile, sealed symmetric package, having integral windows that can be hermetically-sealed.

EXPLORATORY DEVELOPMENT OF GRAPHITE MATERIALS.

DTIC Science & Technology

COMPOSITE MATERIALS), (* GRAPHITE , (*FIBERS, GRAPHITE ), (*LAMINATED PLASTICS, GRAPHITE ), MOLDINGS, EXTRUSION, VACUUM, EPOXY RESINS, FILAMENTS, STRESSES, TENSILE PROPERTIES, OXIDATION, PHYSICAL PROPERTIES.

Apparatus facilitates high-temperature tensile testing in vacuum

NASA Technical Reports Server (NTRS)

Sikora, P. F.

1964-01-01

An apparutus for heating refractory materials to high temperatures during tensile testing includes a water-cooled stainless steel vacuum chamber. This contains a resistance heater consisting of a slit tube of tantalum or tungsten to enclose the tensile test rod.

Vaccum Gas Tungsten Arc Welding, phase 1

NASA Astrophysics Data System (ADS)

Weeks, J. L.; Krotz, P. D.; Todd, D. T.; Liaw, Y. K.

1995-03-01

This two year program will investigate Vacuum Gas Tungsten Arc Welding (VGTAW) as a method to modify or improve the weldability of normally difficult-to-weld materials. VGTAW appears to offer a significant improvement in weldability because of the clean environment and lower heat input needed. The overall objective of the program is to develop the VGTAW technology and implement it into a manufacturing environment that will result in lower cost, better quality and higher reliability aerospace components for the space shuttle and other NASA space systems. Phase 1 of this program was aimed at demonstrating the process's ability to weld normally difficult-to-weld materials. Phase 2 will focus on further evaluation, a hardware demonstration and a plan to implement VGTAW technology into a manufacturing environment. During Phase 1, the following tasks were performed: (1) Task 11000 Facility Modification - an existing vacuum chamber was modified and adapted to a GTAW power supply; (2) Task 12000 Materials Selection - four difficult-to-weld materials typically used in the construction of aerospace hardware were chosen for study; (3) Task 13000 VGTAW Experiments - welding experiments were conducted under vacuum using the hollow tungsten electrode and evaluation. As a result of this effort, two materials, NARloy Z and Incoloy 903, were downselected for further characterization in Phase 2; and (4) Task 13100 Aluminum-Lithium Weld Studies - this task was added to the original work statement to investigate the effects of vacuum welding and weld pool vibration on aluminum-lithium alloys.

Vaccum Gas Tungsten Arc Welding, phase 1

NASA Technical Reports Server (NTRS)

Weeks, J. L.; Krotz, P. D.; Todd, D. T.; Liaw, Y. K.

1995-01-01

This two year program will investigate Vacuum Gas Tungsten Arc Welding (VGTAW) as a method to modify or improve the weldability of normally difficult-to-weld materials. VGTAW appears to offer a significant improvement in weldability because of the clean environment and lower heat input needed. The overall objective of the program is to develop the VGTAW technology and implement it into a manufacturing environment that will result in lower cost, better quality and higher reliability aerospace components for the space shuttle and other NASA space systems. Phase 1 of this program was aimed at demonstrating the process's ability to weld normally difficult-to-weld materials. Phase 2 will focus on further evaluation, a hardware demonstration and a plan to implement VGTAW technology into a manufacturing environment. During Phase 1, the following tasks were performed: (1) Task 11000 Facility Modification - an existing vacuum chamber was modified and adapted to a GTAW power supply; (2) Task 12000 Materials Selection - four difficult-to-weld materials typically used in the construction of aerospace hardware were chosen for study; (3) Task 13000 VGTAW Experiments - welding experiments were conducted under vacuum using the hollow tungsten electrode and evaluation. As a result of this effort, two materials, NARloy Z and Incoloy 903, were downselected for further characterization in Phase 2; and (4) Task 13100 Aluminum-Lithium Weld Studies - this task was added to the original work statement to investigate the effects of vacuum welding and weld pool vibration on aluminum-lithium alloys.

Retinal Implants for Blind Patients

NASA Astrophysics Data System (ADS)

Rothermel, Albrecht

Recently, very promising results have been obtained in clinical trials with eye-prostheses for the blind. There is a chance that advances in surgical techniques, microelectronics design, and material science may lead to the first really useful applications of retinal implants in the near future. This chapter will focus on the actual status of subretinal surgery and implant technologies. Opportunities and limitations of the different technologies will be discussed in terms of patients benefit and technological challenges. Finally, a vision on how the devices may work and look like in the future will be given.

1996 Laboratory directed research and development annual report

DOE Office of Scientific and Technical Information (OSTI.GOV)

Meyers, C.E.; Harvey, C.L.; Lopez-Andreas, L.M.

This report summarizes progress from the Laboratory Directed Research and Development (LDRD) program during fiscal year 1996. In addition to a programmatic and financial overview, the report includes progress reports from 259 individual R&D projects in seventeen categories. The general areas of research include: engineered processes and materials; computational and information sciences; microelectronics and photonics; engineering sciences; pulsed power; advanced manufacturing technologies; biomedical engineering; energy and environmental science and technology; advanced information technologies; counterproliferation; advanced transportation; national security technology; electronics technologies; idea exploration and exploitation; production; and science at the interfaces - engineering with atoms.

Japan's technology and manufacturing infrastructure

NASA Astrophysics Data System (ADS)

Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

1995-02-01

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Japan's technology and manufacturing infrastructure

NASA Technical Reports Server (NTRS)

Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

1995-01-01

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Microgravity

NASA Image and Video Library

2004-04-15

The Wake Shield Facility is a free-flying research and development facility that is designed to use the pure vacuum of space to conduct scientific research in the development of new materials. The thin film materials technology developed by the WSF could some day lead to applications such as faster electronics components for computers. The WSF Free-Flyer is a 12-foot-diameter stainless steel disk that, while traveling in orbit at approximately 18,000 mph, leaves in its wake a vacuum 1,000 to 10,000 times better than the best vacuums currently achieved on Earth. While it is carried into orbit by the Space Shuttle, the WSF is a fully equipped spacecraft in its own right, with cold gas propulsion for separation from the orbiter and a momentum bias attitude control system. All WSF functions are undertaken by a spacecraft computer with the WSF remotely controlled from the ground. The ultra vacuum, nearly empty of all molecules, is then used to conduct a series of thin film growths by a process called epitaxy which produces exceptionally pure and atomically ordered thin films of semiconductor compounds such as gallium arsenide. Using this process, the WSF offers the potential of producing thin film materials, and the devices they will make possible.

Solar cells for lunar applications by vacuum evaporation of lunar regolith materials

NASA Technical Reports Server (NTRS)

Ignatiev, Alex

1991-01-01

The National Space Exploration Initiative, specifically the Lunar component, has major requirements for technology development of critical systems, one of which is electrical power. The availability of significant electrical power on the surface of the Moon is a principal driver defining the complexity of the lunar base. Proposals to generate power on the Moon include both nuclear and solar (photovoltaic) systems. A more efficient approach is to attempt utilization of the existing lunar resources to generate the power systems. Synergism may occur from the fact that there have already been lunar materials processing techniques proposed for the extraction of oxygen that would have, as by-products, materials that could be specifically used to generate solar cells. The lunar environment is a vacuum with pressures generally in the 1 x 10(exp -10) torr range. Such conditions provide an ideal environment for direct vacuum deposition of thin film solar cells using the waste silicon, iron, and TiO2 available from the lunar regolith processing meant to extract oxygen. It is proposed, therefore, to grow by vacuum deposition, thin film silicon solar cells from the improved regolith processing by-products.

Design of plywood and paper flywheel rotors

NASA Astrophysics Data System (ADS)

Erdman, A. G.; Hagen, D. L.; Gaff, S. A.

1982-05-01

Technical and economic design factors of cellulosic rotors are compared with conventional materials for stationary flywheel energy storage systems. Wood species, operation in a vacuum, assembly and costs of rotors are evaluated. Wound kraft paper, twine and plywood rotors are examined. Two hub attachments are designed. Support stiffness is shown to be constrained by the material strength, rotor configuration and speed ratio. Preliminary duration of load tests was performed on vacuum dried hexagonal birch plywood. Dynamic and static rotor hub fatigue equipment is designed. Moisture loss rates while vacuum drying plywood cylinders were measured, and the radial and axial diffusion coefficients were evaluated. Diffusion coefficients of epoxy coated plywood cylinders were also obtained. Economics of cellulosic and conventional rotors were examined. Plywood rotor manufacturing costs were evaluated. The optimum economic shape for laminated rotors is shown to be cylindrical. Vacuum container costs are parametrically derived and based on material properties and costs. Containment costs are significant and are included in comparisons. The optimum design stress and wound rotor configuration are calculated for seventeen examples. Plywood rotors appear to be marginally competitive with the steel hose wire or E glass rotors. High performance oriented kraft paper rotors potentially provide the lowest energy storage costs in stationary systems.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ma, Ying; Li, Hong; Bridges, Denzel

We report that the continuing miniaturization of microelectronics is pushing advanced manufacturing into nanomanufacturing. Nanojoining is a bottom-up assembly technique that enables functional nanodevice fabrication with dissimilar nanoscopic building blocks and/or molecular components. Various conventional joining techniques have been modified and re-invented for joining nanomaterials. Our review surveys recent progress in nanojoining methods, as compared to conventional joining processes. Examples of nanojoining are given and classified by the dimensionality of the joining materials. At each classification, nanojoining is reviewed and discussed according to materials specialties, low dimensional processing features, energy input mechanisms and potential applications. The preparation of new intermetallicmore » materials by reactive nanoscale multilayer foils based on self-propagating high-temperature synthesis is highlighted. This review will provide insight into nanojoining fundamentals and innovative applications in power electronics packaging, plasmonic devices, nanosoldering for printable electronics, 3D printing and space manufacturing.« less

Direct Prototyping of Patterned Nanoporous Carbon: A Route from Materials to On-chip Devices

PubMed Central

Shen, Caiwei; Wang, Xiaohong; Zhang, Wenfeng; Kang, Feiyu

2013-01-01

Prototyping of nanoporous carbon membranes with three-dimensional microscale patterns is significant for integration of such multifunctional materials into various miniaturized systems. Incorporating nano material synthesis into microelectronics technology, we present a novel approach to direct prototyping of carbon membranes with highly nanoporous structures inside. Membranes with significant thicknesses (1 ~ 40 μm) are rapidly prototyped at wafer level by combining nano templating method with readily available microfabrication techniques, which include photolithography, high-temperature annealing and etching. In particular, the high-surface-area membranes are specified as three-dimensional electrodes for micro supercapacitors and show high performance compared to reported ones. Improvements in scalability, compatibility and cost make the general strategy promising for batch fabrication of operational on-chip devices or full integration of three-dimensional nanoporous membranes with existing micro systems. PMID:23887486

Effects of doping Na and Cl atom on electronic structure of silicene: Density functional theory calculation

NASA Astrophysics Data System (ADS)

Pamungkas, Mauludi Ariesto; Sobirin, Kafi; Abdurrouf

2018-04-01

Silicene is a material in which silicon atoms are packed in two-dimensional hexagonal lattice, similar to that of graphene. Compared to graphene, silicene has promising potential to be applied in microelectronic technology because of its compatibility with silicon comonly used in semiconducting devices. Natrium and chlorine are easy to extract and can be used as dopants in FET (Field Effect Transistor). In this work, the effects of adsorption energy and electronic structure of silicene to both natrium and chlorine atoms are calculated with Density Functional Theory (DFT). The results show that dopings of Na transform silicene which is initially semimetal into a metal. Then dopings of Cl Top-site transform silicene into a semiconducting material and doping of Na and Cl simultaneously transfoms silicene into a conducting material.

Nearly Seamless Vacuum-Insulated Boxes

NASA Technical Reports Server (NTRS)

Stepanian, Christopher J.; Ou, Danny; Hu, Xiangjun

2010-01-01

A design concept, and a fabrication process that would implement the design concept, have been proposed for nearly seamless vacuum-insulated boxes that could be the main structural components of a variety of controlled-temperature containers, including common household refrigerators and insulating containers for shipping foods. In a typical case, a vacuum-insulated box would be shaped like a rectangular parallelepiped conventional refrigerator box having five fully closed sides and a hinged door on the sixth side. Although it is possible to construct the five-closed-side portion of the box as an assembly of five unitary vacuum-insulated panels, it is not desirable to do so because the relatively high thermal conductances of the seams between the panels would contribute significant amounts of heat leakage, relative to the leakage through the panels themselves. In contrast, the proposal would make it possible to reduce heat leakage by constructing the five-closed-side portion of the box plus the stationary portion (if any) of the sixth side as a single, seamless unit; the only remaining seam would be the edge seal around the door. The basic cross-sectional configuration of each side of a vacuum-insulated box according to the proposal would be that of a conventional vacuum-insulated panel: a low-density, porous core material filling a partially evacuated space between face sheets. However, neither the face sheets nor the core would be conventional. The face sheets would be opposite sides of a vacuum bag. The core material would be a flexible polymer-modified silica aerogel of the type described in Silica/Polymer and Silica/Polymer/Fiber Composite Aero - gels (MSC-23736) in this issue of NASA Tech Briefs. As noted in that article, the stiffness of this core material against compression is greater than that of prior aerogels. This is an important advantage because it translates to greater retention of thickness and, hence, of insulation performance when pressure is applied across the thickness, in particular, when the space between the face sheets is evacuated, causing the core material to be squeezed between the face sheets by atmospheric pressure. Fabrication of a typical vacuum-insulated box according to the proposal would begin with fabrication of a cross-shaped polymer-modified aerogel blanket. The dimensions of the cross would be chosen so that (1) the central rectangular portion of the cross would form the core for the back of the box and (2) the arms of the cross could be folded 90 from the back plane to form the cores of the adjacent four sides of the box. Optionally, the blanket could include tabs for joining the folded sides of the blanket along mating edges and tabs that could serve as hinges for the door. Vacuum bags in the form of similar five-sided boxes would be made of a suitable polymeric film, one bag to fit the outer core surface, the other to fit the inner core surface. By use of commercially available film-sealing equipment, these box-shaped bags would be seamed together to form a single vacuum bag encasing the box-shaped core. Also, a one-way valve would be sealed to the bag. Through this valve, the interior of the bag would be evacuated to a pressure between 1 and 10 torr (approximately between 0.13 and 1.3 kPa). The polymer-modified aerogel core material is known to perform well as a thermal insulator in such a partial vacuum.

Miniature pulsed vacuum arc plasma gun and apparatus for thin-film fabrication

DOEpatents

Brown, Ian G.; MacGill, Robert A.; Galvin, James E.; Ogletree, David F.; Salmeron, Miquel

1998-01-01

A miniature (dime-size in cross-section) vapor vacuum arc plasma gun is described for use in an apparatus to produce thin films. Any conductive material can be layered as a film on virtually any substrate. Because the entire apparatus can easily be contained in a small vacuum chamber, multiple dissimilar layers can be applied without risk of additional contamination. The invention has special applications in semiconductor manufacturing.

Miniature pulsed vacuum arc plasma gun and apparatus for thin-film fabrication

DOEpatents

Brown, I.G.; MacGill, R.A.; Galvin, J.E.; Ogletree, D.F.; Salmeron, M.

1998-11-24

A miniature (dime-size in cross-section) vapor vacuum arc plasma gun is described for use in an apparatus to produce thin films. Any conductive material can be layered as a film on virtually any substrate. Because the entire apparatus can easily be contained in a small vacuum chamber, multiple dissimilar layers can be applied without risk of additional contamination. The invention has special applications in semiconductor manufacturing. 8 figs.

Casting methods

DOEpatents

Marsden, Kenneth C.; Meyer, Mitchell K.; Grover, Blair K.; Fielding, Randall S.; Wolfensberger, Billy W.

2012-12-18

A casting device includes a covered crucible having a top opening and a bottom orifice, a lid covering the top opening, a stopper rod sealing the bottom orifice, and a reusable mold having at least one chamber, a top end of the chamber being open to and positioned below the bottom orifice and a vacuum tap into the chamber being below the top end of the chamber. A casting method includes charging a crucible with a solid material and covering the crucible, heating the crucible, melting the material, evacuating a chamber of a mold to less than 1 atm absolute through a vacuum tap into the chamber, draining the melted material into the evacuated chamber, solidifying the material in the chamber, and removing the solidified material from the chamber without damaging the chamber.

Direct current sputtering of boron from boron/boron mixtures

DOEpatents

Timberlake, J.R.; Manos, D.; Nartowitz, E.

1994-12-13

A method for coating a substrate with boron by sputtering includes lowering the electrical resistance of a boron-containing rod to allow electrical conduction in the rod; placing the boron-containing rod inside a vacuum chamber containing substrate material to be coated; applying an electrical potential between the boron target material and the vacuum chamber; countering a current avalanche that commences when the conduction heating rate exceeds the cooling rate, and until a steady equilibrium heating current is reached; and, coating the substrate material with boron by sputtering from the boron-containing rod. 2 figures.

Cryogenic Vacuum Insulation for Vessels and Piping

NASA Technical Reports Server (NTRS)

Kogan, A.; Fesmire, J.; Johnson, W.; Minnick, J.

2010-01-01

Cryogenic vacuum insulation systems, with proper materials selection and execution, can offer the highest levels of thermal performance. Three areas of consideration are vital to achieve the optimum result: materials, representative test conditions, and engineering approach for the particular application. Deficiency in one of these three areas can prevent optimum performance and lead to severe inefficiency. Materials of interest include micro-fiberglass, multilayer insulation, and composite arrangements. Cylindrical liquid nitrogen boil-off calorimetry methods were used. The need for standard thermal conductivity data is addressed through baseline testing. Engineering analysis and design factors such as layer thickness, density, and practicality are also considered.

Microsphere Insulation Panels

NASA Technical Reports Server (NTRS)

Mohling, R.; Allen, M.; Baumgartner, R.

2006-01-01

Microsphere insulation panels (MIPs) have been developed as lightweight, longlasting replacements for the foam and vacuum-jacketed systems heretofore used for thermally insulating cryogenic vessels and transfer ducts. The microsphere core material of a typical MIP consists of hollow glass bubbles, which have a combination of advantageous mechanical, chemical, and thermal-insulation properties heretofore available only separately in different materials. In particular, a core filling of glass microspheres has high crush strength and low density, is noncombustible, and performs well in soft vacuum.

Multiscale Thermo-Mechanical Design and Analysis of High Frequency and High Power Vacuum Electron Devices

NASA Astrophysics Data System (ADS)

Gamzina, Diana

Diana Gamzina March 2016 Mechanical and Aerospace Engineering Multiscale Thermo-Mechanical Design and Analysis of High Frequency and High Power Vacuum Electron Devices Abstract A methodology for performing thermo-mechanical design and analysis of high frequency and high average power vacuum electron devices is presented. This methodology results in a "first-pass" engineering design directly ready for manufacturing. The methodology includes establishment of thermal and mechanical boundary conditions, evaluation of convective film heat transfer coefficients, identification of material options, evaluation of temperature and stress field distributions, assessment of microscale effects on the stress state of the material, and fatigue analysis. The feature size of vacuum electron devices operating in the high frequency regime of 100 GHz to 1 THz is comparable to the microstructure of the materials employed for their fabrication. As a result, the thermo-mechanical performance of a device is affected by the local material microstructure. Such multiscale effects on the stress state are considered in the range of scales from about 10 microns up to a few millimeters. The design and analysis methodology is demonstrated on three separate microwave devices: a 95 GHz 10 kW cw sheet beam klystron, a 263 GHz 50 W long pulse wide-bandwidth sheet beam travelling wave tube, and a 346 GHz 1 W cw backward wave oscillator.

Surface Design and Engineering Toward Wear-Resistant, Self-Lubricating Diamond Films and Coatings

NASA Technical Reports Server (NTRS)

Miyoshi, Kazuhisa

1999-01-01

The tribological properties of chemical-vapor-deposited (CVD) diamond films vary with the environment, possessing a Jekyll-and-Hyde character. CVD diamond has low coefficient of friction and high wear resistance in air but high coefficient of friction and low wear resistance in vacuum. Improving the tribological functionality of materials (such as achieving low friction and good wear resistance) was an aim of this investigation. Three studies on the surface design, surface engineering, and tribology of CVD diamond have shown that its friction and wear are significantly reduced in ultrahigh vacuum. The main criteria for judging whether diamond films are an effective wear-resistant, self-lubricating material were coefficient of friction and wear rate, which must be less than 0.1 and on the order of 10(exp 6) cu mm/N(dot)m, respectively. In the first study the presence of a thin film (less than 1 micron thick) of amorphous, nondiamond carbon (hydrogenated carbon, also called diamondlike carbon or DLC) on CVD diamond greatly decreased the coefficient of friction and the wear rate. Therefore, a thin DLC film on CVD diamond can be an effective wear-resistant, lubricating coating in ultrahigh vacuum. In the second study the presence of an amorphous, nondiamond carbon surface layer formed on CVD diamond by ion implantation significantly reduced the coefficient of friction and the wear rate in ultrahigh vacuum. Therefore, such surface layers are acceptable for effective self-lubricating, wear-resistant applications of CVD diamond. In the third study CVD diamond in contact with cubic boron nitride exhibited low coefficient of friction in ultra high vacuum. Therefore, this materials combination can provide an effective self-lubricating, wear-resistant couple in ultrahigh vacuum.

Laser assisted processing; Proceedings of the Meeting, Hamburg, Federal Republic of Germany, Sept. 19, 20, 1988

NASA Astrophysics Data System (ADS)

Laude, Lucien D.; Rauscher, Gerhard

The use of lasers in industrial material processing is discussed in reviews and reports. Sections are devoted to high-precision laser machining, deposition methods, ablation and polymers, and synthesis and oxidation. Particular attention is given to laser cutting of steel sheets, laser micromachining of material surfaces, process control in laser soldering, laser-induced CVD of doped Si stripes on SOS and their characterization by piezoresistivity measurements, laser CVD of Pt spots on glass, laser deposition of GaAs, UV-laser photoablation of polymers, ArF excimer-laser ablation of HgCdTe semiconductor, pulsed laser synthesis of Ti silicides and nitrides, the kinetics of laser-assisted oxidation of metallic films, and excimer-laser-assisted etching of solids for microelectronics.

Electric measurements of PV heterojunction structures a-SiC/c-Si

NASA Astrophysics Data System (ADS)

Perný, Milan; Šály, Vladimír; Janíček, František; Mikolášek, Miroslav; Váry, Michal; Huran, Jozef

2018-01-01

Due to the particular advantages of amorphous silicon or its alloys with carbon in comparison to conventional crystalline materials makes such a material still interesting for study. The amorphous silicon carbide may be used in a number of micro-mechanical and micro-electronics applications and also for photovoltaic energy conversion devices. Boron doped thin layers of amorphous silicon carbide, presented in this paper, were prepared due to the optimization process for preparation of heterojunction solar cell structure. DC and AC measurement and subsequent evaluation were carried out in order to comprehensively assess the electrical transport processes in the prepared a-SiC/c-Si structures. We have investigated the influence of methane content in deposition gas mixture and different electrode configuration.

Measurements of Thermophysical Properties of Molten Silicon and Geranium

NASA Technical Reports Server (NTRS)

Rhim, Won-Kyu

2001-01-01

The objective of this ground base program is to measure thermophysical properties of molten/ undercooled silicon, germanium, and Si-Ge alloys using a high temperature electrostatic levitator and in clearly assessing the need of the microgravity environment to achieve the objective with higher degrees of accuracy. Silicon and germanium are two of the most important semiconductors for industrial applications: silicon is unsurpassed as a microelectronics material, occupying more than 95% of the electronics market. Si-Ge alloy is attracting keen interest for advanced electronic and optoelectronic applications in view of its variable band gap and lattice parameter depending upon its composition. Accurate thermophysical properties of these materials are very much needed in the semiconductor industry for the growth of large high quality crystals.

Origami structures for tunable thermal expansion

NASA Astrophysics Data System (ADS)

Boatti, Elisa; Bertoldi, Katia

Materials with engineered thermal expansion, capable of achieving targeted and extreme area/volume changes in response to variations in temperature, are important for a number of aerospace, optical, energy, and microelectronic applications. While most of the proposed structures with tunable coefficient of thermal expansion consist of bi-material 2D or 3D lattices, here we propose a periodic metastructure based on a bilayer Miura-Ori origami fold. We combine experiments and simulations to demonstrate that by tuning the geometrical and mechanical parameters an extremely broad range of thermal expansion coefficients can be obtained, spanning both negative and positive values. Additionally, the thermal properties along different directions can be adjusted independently. Differently from all previously reported systems, the proposed structure is non-porous.

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

DOE PAGES

Carlton, Holly D.; Elmer, John W.; Li, Yan; ...

2016-04-13

For this study synchrotron radiation micro-­tomography, a non-destructive three-dimensional imaging technique, is employed to investigate an entire microelectronic package with a cross-sectional area of 16 x 16 mm. Due to the synchrotron’s high flux and brightness the sample was imaged in just 3 minutes with an 8.7 μm spatial resolution.

Microelectronics used for Semiconductor Imaging Detectors

DOE Office of Scientific and Technical Information (OSTI.GOV)

Heijne, Erik H. M.

Semiconductor crystal technology, microelectronics developments and nuclear particle detection have been in a relation of symbiosis, all the way from the beginning. The increase of complexity in electronics chips can now be applied to obtain much more information on the incident nuclear radiation. Some basic technologies are described, in order to acquire insight in possibilities and limitations for the most recent detectors.

Validation of Direct Analysis Real Time source/Time-of-Flight Mass Spectrometry for organophosphate quantitation on wafer surface.

PubMed

Hayeck, Nathalie; Ravier, Sylvain; Gemayel, Rachel; Gligorovski, Sasho; Poulet, Irène; Maalouly, Jacqueline; Wortham, Henri

2015-11-01

Microelectronic wafers are exposed to airborne molecular contamination (AMC) during the fabrication process of microelectronic components. The organophosphate compounds belonging to the dopant group are one of the most harmful groups. Once adsorbed on the wafer surface these compounds hardly desorb and could diffuse in the bulk of the wafer and invert the wafer from p-type to n-type. The presence of these compounds on wafer surface could have electrical effect on the microelectronic components. For these reasons, it is of importance to control the amount of these compounds on the surface of the wafer. As a result, a fast quantitative and qualitative analytical method, nondestructive for the wafers, is needed to be able to adjust the process and avoid the loss of an important quantity of processed wafers due to the contamination by organophosphate compounds. Here we developed and validated an analytical method for the determination of organic compounds adsorbed on the surface of microelectronic wafers using the Direct Analysis in Real Time-Time of Flight-Mass Spectrometry (DART-ToF-MS) system. Specifically, the developed methodology concerns the organophosphate group. Copyright © 2015 Elsevier B.V. All rights reserved.

Vacuum stability testing of Apollo 15 Scientific Instrument Module (SIM) non-metallic materials and reversion of silicone rubber in a motor switch

NASA Technical Reports Server (NTRS)

Clancy, H. M.

1972-01-01

Vacuum stability screening tests were performed on the Apollo 15 Scientific Instrument Module (SIM) bay nonmetallic materials in accordance with the NASA document SP-R-0022. The testing was necessary to support the evaluation to determine the effect material outgassing contamination would have on the SIM bay optical lenses and sensing devices. The Apollo 15 SIM experiments were highly successful, therefore, it is assumed that contamination due to the outgassing of nonmetallic materials did not affect equipment operation. A related problem, the reversion of a silicone rubber grommet which affected an electrical motor switch operation is also reported.

Steel bonded dense silicon nitride compositions and method for their fabrication

DOEpatents

Landingham, R.L.; Shell, T.E.

1985-05-20

A two-stage bonding technique for bonding high density silicon nitride and other ceramic materials to stainless steel and other hard metals, and multilayered ceramic-metal composites prepared by the technique are disclosed. The technique involves initially slurry coating a surface of the ceramic material at about 1500/sup 0/C in a vacuum with a refractory material and the stainless steel is then pressure bonded to the metallic coated surface by brazing it with nickel-copper-silver or nickel-copper-manganese alloys at a temperature in the range of about 850/sup 0/ to 950/sup 0/C in a vacuum. The two-stage bonding technique minimizes the temperature-expansion mismatch between the dissimilar materials.

Steel bonded dense silicon nitride compositions and method for their fabrication

DOEpatents

Landingham, Richard L.; Shell, Thomas E.

1987-01-01

A two-stage bonding technique for bonding high density silicon nitride and other ceramic materials to stainless steel and other hard metals, and multilayered ceramic-metal composites prepared by the technique are disclosed. The technique involves initially slurry coating a surface of the ceramic material at about 1500.degree. C. in a vacuum with a refractory material and the stainless steel is then pressure bonded to the metallic coated surface by brazing it with nickel-copper-silver or nickel-copper-manganese alloys at a temperature in the range of about 850.degree. to 950.degree. C. in a vacuum. The two-stage bonding technique minimizes the temperature-expansion mismatch between the dissimilar materials.

Growth control of oxygen stoichiometry in homoepitaxial SrTiO 3 films by pulsed laser epitaxy in high vacuum

DOE PAGES

Lee, Ho Nyung; Ambrose Seo, Sung S.; Choi, Woo Seok; ...

2016-01-29

In many transition metal oxides, oxygen stoichiometry is one of the most critical parameters that plays a key role in determining the structural, physical, optical, and electrochemical properties of the material. However, controlling the growth to obtain high quality single crystal films having the right oxygen stoichiometry, especially in a high vacuum environment, has been viewed as a challenge. In this work, we show that, through proper control of the plume kinetic energy, stoichiometric crystalline films can be synthesized without generating oxygen defects even in high vacuum. We use a model homoepitaxial system of SrTiO 3 (STO) thin films onmore » single crystal STO substrates. Physical property measurements indicate that oxygen vacancy generation in high vacuum is strongly influenced by the energetics of the laser plume, and it can be controlled by proper laser beam delivery. Thus, our finding not only provides essential insight into oxygen stoichiometry control in high vacuum for understanding the fundamental properties of STO-based thin films and heterostructures, but it expands the utility of pulsed laser epitaxy of other materials as well.₃« less

Measurement of Outgassing Rates of Steels.

PubMed

Park, Chongdo; Kim, Se-Hyun; Ki, Sanghoon; Ha, Taekyun; Cho, Boklae

2016-12-13

Steels are commonly used materials in the fabrication of vacuum systems because of their good mechanical, corrosion, and vacuum properties. A variety of steels meet the criterion of low outgassing required for high or ultrahigh vacuum applications. However, a given material can present different outgassing rates depending on its manufacturing process or the various pretreatment processes involved during the fabrication. Thus, the measurement of outgassing rates is highly desirable for a specific vacuum application. For this reason, the rate-of-pressure rise (RoR) method is often used to measure the outgassing of hydrogen after bakeout. In this article, a detailed description of the design and execution of the experimental protocol involved in the RoR method is provided. The RoR method uses a spinning rotor gauge to minimize errors that stem from outgassing or the pumping action of a vacuum gauge. The outgassing rates of two ordinary steels (stainless steel and mild steel) were measured. The measurements were made before and after the heat pretreatment of the steels. The heat pretreatment of steels was performed to reduce the outgassing. Extremely low rates of outgassing (on the order of 10 - 11 Pa m 3 sec - 1 m - 2 ) can be routinely measured using relatively small samples.

Thermal conductivity model for powdered materials under vacuum based on experimental studies

NASA Astrophysics Data System (ADS)

Sakatani, N.; Ogawa, K.; Iijima, Y.; Arakawa, M.; Honda, R.; Tanaka, S.

2017-01-01

The thermal conductivity of powdered media is characteristically very low in vacuum, and is effectively dependent on many parameters of their constituent particles and packing structure. Understanding of the heat transfer mechanism within powder layers in vacuum and theoretical modeling of their thermal conductivity are of great importance for several scientific and engineering problems. In this paper, we report the results of systematic thermal conductivity measurements of powdered media of varied particle size, porosity, and temperature under vacuum using glass beads as a model material. Based on the obtained experimental data, we investigated the heat transfer mechanism in powdered media in detail, and constructed a new theoretical thermal conductivity model for the vacuum condition. This model enables an absolute thermal conductivity to be calculated for a powder with the input of a set of powder parameters including particle size, porosity, temperature, and compressional stress or gravity, and vice versa. Our model is expected to be a competent tool for several scientific and engineering fields of study related to powders, such as the thermal infrared observation of air-less planetary bodies, thermal evolution of planetesimals, and performance of thermal insulators and heat storage powders.

Quantifying Electromigration Processes in Sn-0.7Cu Solder with Lab-Scale X-Ray Computed Micro-Tomography

NASA Astrophysics Data System (ADS)

Mertens, James Charles Edwin

For decades, microelectronics manufacturing has been concerned with failures related to electromigration phenomena in conductors experiencing high current densities. The influence of interconnect microstructure on device failures related to electromigration in BGA and flip chip solder interconnects has become a significant interest with reduced individual solder interconnect volumes. A survey indicates that x-ray computed micro-tomography (muXCT) is an emerging, novel means for characterizing the microstructures' role in governing electromigration failures. This work details the design and construction of a lab-scale muXCT system to characterize electromigration in the Sn-0.7Cu lead-free solder system by leveraging in situ imaging. In order to enhance the attenuation contrast observed in multi-phase material systems, a modeling approach has been developed to predict settings for the controllable imaging parameters which yield relatively high detection rates over the range of x-ray energies for which maximum attenuation contrast is expected in the polychromatic x-ray imaging system. In order to develop this predictive tool, a model has been constructed for the Bremsstrahlung spectrum of an x-ray tube, and calculations for the detector's efficiency over the relevant range of x-ray energies have been made, and the product of emitted and detected spectra has been used to calculate the effective x-ray imaging spectrum. An approach has also been established for filtering 'zinger' noise in x-ray radiographs, which has proven problematic at high x-ray energies used for solder imaging. The performance of this filter has been compared with a known existing method and the results indicate a significant increase in the accuracy of zinger filtered radiographs. The obtained results indicate the conception of a powerful means for the study of failure causing processes in solder systems used as interconnects in microelectronic packaging devices. These results include the volumetric quantification of parameters which are indicative of both electromigration tolerance of solders and the dominant mechanisms for atomic migration in response to current stressing. This work is aimed to further the community's understanding of failure-causing electromigration processes in industrially relevant material systems for microelectronic interconnect applications and to advance the capability of available characterization techniques for their interrogation.

Vacuum forming of thermoplastic sheet results in low-cost investment casting patterns

NASA Technical Reports Server (NTRS)

Clarke, A. E., Jr.

1964-01-01

Vacuum forming of a sheet of thermoplastic material around a mandrel conforming to the shape of the finished object provides a pattern for an investment mold. The thickness of the metal part is determined by the thickness of the plastic pattern.

Degassing procedure for ultrahigh vacuum

NASA Technical Reports Server (NTRS)

Moore, B. C.

1979-01-01

Calculations based on diffusion coefficients and degassing rates for stainless-steel vacuum chambers indicate that baking at lower temperatures for longer periods give lower ultimate pressures than rapid baking at high temperatures. Process could reduce pressures in chambers for particle accelerators, fusion reactors, material research, and other applications.

Mass spectrometer vacuum housing and pumping system

DOEpatents

Coutts, G.W.; Bushman, J.F.; Alger, T.W.

1996-07-23

A vacuum housing and pumping system is described for a portable gas chromatograph/mass spectrometer (GC/MS). The vacuum housing section of the system has minimum weight for portability while designed and constructed to utilize metal gasket sealed stainless steel to be compatible with high vacuum operation. The vacuum pumping section of the system consists of a sorption (getter) pump to remove atmospheric leakage and outgassing contaminants as well as the gas chromatograph carrier gas (hydrogen) and an ion pump to remove the argon from atmospheric leaks. The overall GC/MS system has broad application to contaminants, hazardous materials, illegal drugs, pollution monitoring, etc., as well as for use by chemical weapon treaty verification teams, due to the light weight and portability thereof. 7 figs.

Mass spectrometer vacuum housing and pumping system

DOEpatents

Coutts, Gerald W.; Bushman, John F.; Alger, Terry W.

1996-01-01

A vacuum housing and pumping system for a portable gas chromatograph/mass spectrometer (GC/MS). The vacuum housing section of the system has minimum weight for portability while designed and constructed to utilize metal gasket sealed stainless steel to be compatible with high vacuum operation. The vacuum pumping section of the system consists of a sorption (getter) pump to remove atmospheric leakage and outgassing contaminants as well as the gas chromatograph carrier gas (hydrogen) and an ion pump to remove the argon from atmospheric leaks. The overall GC/MS system has broad application to contaminants, hazardous materials, illegal drugs, pollution monitoring, etc., as well as for use by chemical weapon treaty verification teams, due to the light weight and portability thereof.

Quality control of FWC during assembly and commissioning in SST-1 Tokamak

NASA Astrophysics Data System (ADS)

Patel, Hitesh; Santra, Prosenjit; Parekh, Tejas; Biswas, Prabal; Jayswal, Snehal; Chauhan, Pradeep; Paravastu, Yuvakiran; George, Siju; Semwal, Pratibha; Thankey, Prashant; Ramesh, Gattu; Prakash, Arun; Dhanani, Kalpesh; Raval, D. C.; Khan, Ziauddin; Pradhan, Subrata

2017-04-01

First Wall Components (FWC) of SST-1 tokamak, which are in the immediate vicinity of plasma, comprises of limiters, divertors, baffles, passive stabilizers designed to operate long duration (∼1000 s) discharges of elongated plasma. All FWC consist of copper alloy heat sink modules with SS cooling tubes brazed onto it, graphite tiles acting as armour material facing the plasma, and are mounted to the vacuum vessels with suitable Inconel support structures at inter-connected ring & port locations. The FWC are very recently assembled and commissioned successfully inside the vacuum vessel of SST-1 undergoing a rigorous quality control and checks at every stage of the assembly process. This paper will present the quality control aspects and checks of FWC from commencement of assembly procedure, namely material test reports, leak testing of high temperature baked components, assembled dimensional tolerances, leak testing of all welded joints, graphite tile tightening torques, electrical continuity and electrical isolation of passive stabilizers from vacuum vessel, baking and cooling hydraulic connections inside vacuum vessel.

A Plasma Window for Transmission of Radiation and Particle Beams from Vacuum to Atmosphere for Various Applications

NASA Astrophysics Data System (ADS)

Hershcovitch, Ady

1997-11-01

Many industrial and scientific processes like electron beam melting and welding, material modification by ion implantation, dry etching, and micro-fabrication, as well as generation of synchrotron radiation are performed almost exclusively in vacuum nowadays, since the electron and ion guns and their extractors must be kept at a reasonably high vacuum. Consequently, there are numerous drawbacks, among which are low production rates due to required pumping time, limits the vacuum volume sets on the size of target objects. In a small number of applications like non-vacuum electron beam welding, and various processes involving UV and x-ray radiation, thin vacuum walls or long stages of differential pumping are used. But, the resultant degradations of particle and radiation beams severely limit those applications. A novel apparatus, which utilized a short plasma arc, was successfully used to maintain a pressure of 7.6 x exp(-6) Torr in a vacuum chamber with a 2.36mm aperture to atmosphere, i.e., a plasma was successfully used to "plug" a hole to atmosphere while maintaining a reasonably high vacuum in the chamber. Successful transmission of charged particle beams from a vacuum through the plasma to atmosphere was accomplished. More details can be found in A. Hershcovitch, J. Appl. Physics 78, p. 5283 (1995). In addition to sustaining a vacuum atmosphere interface, the plasma has very strong lensing effect on charged particles. The plasma current generates an azimuthal magnetic field which exerts a radial Lorentz on charged particles moving parallel to the current channel. With proper orientation of the current direction, the Lorentz force is radially inward. This feature can be used to focus in beams to a very small spot size, and to overcome beam dispersion due to scattering by atmospheric atoms and molecules. Relatively hot plasma at the atmosphere boundary rarefies the atmospheric gases to further enhance particle beam propagation to the materials to target. Recent experimental results, with a plasma window coupled to a venturi, show a factor of three further enhancement in vacuum-atmosphere separation.

Vacuum plasma spray applications on liquid fuel rocket engines

NASA Technical Reports Server (NTRS)

Mckechnie, T. N.; Zimmerman, F. R.; Bryant, M. A.

1992-01-01

The vacuum plasma spray process (VPS) has been developed by NASA and Rocketdyne for a variety of applications on liquid fuel rocket engines, including the Space Shuttle Main Engine. These applications encompass thermal barrier coatings which are thermal shock resistant for turbopump blades and nozzles; bond coatings for cryogenic titanium components; wear resistant coatings and materials; high conductivity copper, NaRloy-Z, combustion chamber liners, and structural nickel base material, Inconel 718, for nozzle and combustion chamber support jackets.

Diagnostics of Polymer Composite Materials and Analysis of Their Production Technology by Using the Method of Acoustic Emission

NASA Astrophysics Data System (ADS)

Bashkov, O. V.; Protsenko, A. E.; Bryanskii, A. A.; Romashko, R. V.

2017-09-01

The strength properties of glass-fiber-reinforced plastics produced by vacuum and vacuum autoclave molding techniques are studied. Based on acoustic emission data, a method of diagnostic and prediction of the bearing capacity of polymer composite materials by using data from three-point bending tests is developed. The method is based on evaluating changes in the exponent of a power function relating the total acoustic emission to the test stress.

Sub-micron elastic property characterization of materials using a near-field scanning optical microscope

NASA Astrophysics Data System (ADS)

Blodgett, David W.; Spicer, James B.

2001-12-01

The ability to characterize the sub-surface mechanical properties of a bulk or thin film material at the sub-micron level has applications in the microelectronics and thin film industries. In the microelectronics industry, with the decrease of line widths and the increase of component densities, sub-surface voids have become increasingly detrimental. Any voids along an integrated circuit (IC) line can lead to improper electrical connections between components and can cause failure of the device. In the thin film industry, the detection of impurities is also important. Any impurities can detract from the film's desired optical, electrical, or mechanical properties. Just as important as the detection of voids and impurities, is the measurement of the elastic properties of a material on the nanometer scale. These elastic measurements provide insight into the microstructural properties of the material. We have been investigating a technique that couples the high-resolution surface imaging capabilities of the apertureless near-field scanning optical microscope (ANSOM) with the sub-surface characterization strengths of high-frequency ultrasound. As an ultrasonic wave propagates, the amplitude decreases due to geometrical spreading, attenuation from absorption, and scattering from discontinuities. Measurement of wave speeds and attenuation provides the information needed to quantify the bulk or surface properties of a material. The arrival of an ultrasonic wave at or along the surface of a material is accompanied with a small surface displacement. Conventional methods for the ultrasound detection rely on either a contact transducer or optical technique (interferometric, beam deflection, etc.). However, each of these methods is limited by the spatial resolution dictated by the detection footprint. As the footprint size increases, variations across the ultrasonic wavefront are effectively averaged, masking the presence of any nanometer-scale sub-surface or surface mechanical property variations. The use of an ANSOM for sensing ultrasonic wave arrivals reduces the detection footprint allowing any nanometer scale variations in the microstructure of a material to be detected. In an ANSOM, the ultrasonic displacement is manifested as perturbations on the near-field signal due to the small variations in the tip-sample caused by the wave arrival. Due to the linear dependence of the near-field signal on tip-sample separation, these perturbations can be interpreted using methods identical to those for conventional ultrasonic techniques. In this paper, we report results using both contact transducer (5 MHz) and laser-generated ultrasound.

Smart Materials for Electromagnetic and Optical Applications

NASA Astrophysics Data System (ADS)

Ramesh, Prashanth

The research presented in this dissertation focuses on the development of solid-state materials that have the ability to sense, act, think and communicate. Two broad classes of materials, namely ferroelectrics and wideband gap semiconductors were investigated for this purpose. Ferroelectrics possess coupled electromechanical behavior which makes them sensitive to mechanical strains and fluctuations in ambient temperature. Use of ferroelectrics in antenna structures, especially those subject to mechanical and thermal loads, requires knowledge of the phenomenological relationship between the ferroelectric properties of interest (especially dielectric permittivity) and the external physical variables, viz. electric field(s), mechanical strains and temperature. To this end, a phenomenological model of ferroelectric materials based on the Devonshire thermodynamic theory was developed. This model was then used to obtain a relationship expressing the dependence of the dielectric permittivity on the mechanical strain, applied electric field and ambient temperature. The relationship is shown to compare well with published experimental data and other related models in literature. A model relating ferroelectric loss tangent to the applied electric field and temperature is also discussed. Subsequently, relationships expressing the dependence of antenna operating frequency and radiation efficiency on those external physical quantities are described. These relationships demonstrate the tunability of load-bearing antenna structures that integrate ferroelectrics when they are subjected to mechanical and thermal loads. In order to address the inability of ferroelectrics to integrate microelectronic devices, a feature needed in a material capable of sensing, acting, thinking and communicating, the material Gallium Nitride (GaN) is pursued next. There is an increasing utilization of GaN in the area of microelectronics due to the advantages it offers over other semiconductors. This dissertation demonstrates GaN as a candidate material well suited for novel microelectromechanical systems. The potential of GaN for MEMS is demonstrated via the design, analysis, fabrication, testing and characterization of an optical microswitch device actuated by piezoelectric and electrostrictive means. The piezoelectric and electrostrictive properties of GaN and its differences from common piezoelectrics are discussed before elaborating on the device configuration used to implement the microswitch device. Next, the development of two recent fabrication technologies, Photoelectrochemical etch and Bias-enabled Dark Electrochemical etch, used to realize the 3-dimensional device structure in GaN are described in detail. Finally, an ultra-low-cost, laser-based, non-contact approach to test and characterize the microswitch device is described, followed by the device testing results.

Scalable Sub-micron Patterning of Organic Materials Toward High Density Soft Electronics.

PubMed

Kim, Jaekyun; Kim, Myung-Gil; Kim, Jaehyun; Jo, Sangho; Kang, Jingu; Jo, Jeong-Wan; Lee, Woobin; Hwang, Chahwan; Moon, Juhyuk; Yang, Lin; Kim, Yun-Hi; Noh, Yong-Young; Jaung, Jae Yun; Kim, Yong-Hoon; Park, Sung Kyu

2015-09-28

The success of silicon based high density integrated circuits ignited explosive expansion of microelectronics. Although the inorganic semiconductors have shown superior carrier mobilities for conventional high speed switching devices, the emergence of unconventional applications, such as flexible electronics, highly sensitive photosensors, large area sensor array, and tailored optoelectronics, brought intensive research on next generation electronic materials. The rationally designed multifunctional soft electronic materials, organic and carbon-based semiconductors, are demonstrated with low-cost solution process, exceptional mechanical stability, and on-demand optoelectronic properties. Unfortunately, the industrial implementation of the soft electronic materials has been hindered due to lack of scalable fine-patterning methods. In this report, we demonstrated facile general route for high throughput sub-micron patterning of soft materials, using spatially selective deep-ultraviolet irradiation. For organic and carbon-based materials, the highly energetic photons (e.g. deep-ultraviolet rays) enable direct photo-conversion from conducting/semiconducting to insulating state through molecular dissociation and disordering with spatial resolution down to a sub-μm-scale. The successful demonstration of organic semiconductor circuitry promise our result proliferate industrial adoption of soft materials for next generation electronics.

Scalable Sub-micron Patterning of Organic Materials Toward High Density Soft Electronics

NASA Astrophysics Data System (ADS)

Kim, Jaekyun; Kim, Myung-Gil; Kim, Jaehyun; Jo, Sangho; Kang, Jingu; Jo, Jeong-Wan; Lee, Woobin; Hwang, Chahwan; Moon, Juhyuk; Yang, Lin; Kim, Yun-Hi; Noh, Yong-Young; Yun Jaung, Jae; Kim, Yong-Hoon; Kyu Park, Sung

2015-09-01

The success of silicon based high density integrated circuits ignited explosive expansion of microelectronics. Although the inorganic semiconductors have shown superior carrier mobilities for conventional high speed switching devices, the emergence of unconventional applications, such as flexible electronics, highly sensitive photosensors, large area sensor array, and tailored optoelectronics, brought intensive research on next generation electronic materials. The rationally designed multifunctional soft electronic materials, organic and carbon-based semiconductors, are demonstrated with low-cost solution process, exceptional mechanical stability, and on-demand optoelectronic properties. Unfortunately, the industrial implementation of the soft electronic materials has been hindered due to lack of scalable fine-patterning methods. In this report, we demonstrated facile general route for high throughput sub-micron patterning of soft materials, using spatially selective deep-ultraviolet irradiation. For organic and carbon-based materials, the highly energetic photons (e.g. deep-ultraviolet rays) enable direct photo-conversion from conducting/semiconducting to insulating state through molecular dissociation and disordering with spatial resolution down to a sub-μm-scale. The successful demonstration of organic semiconductor circuitry promise our result proliferate industrial adoption of soft materials for next generation electronics.

Microelectronics Reliability

DTIC Science & Technology

2017-01-17

2016-0155 Kirtland AFB, NM 87117-5776 9. SPONSORING / MONITORING AGENCY NAME(S) AND ADDRESS(ES) 10. SPONSOR/MONITOR’S ACRONYM(S) AFRL /RVSW 11...22060-6218 1 cy AFRL /RVIL Kirtland AFB, NM 87117-5776 2 cys Official Record Copy AFRL /RVSW/Clay Mayberry 1 cy Approved for... AFRL -RV-PS- AFRL -RV-PS- TR-2016-0155 TR-2016-0155 MICROELECTRONICS RELIABILITY Clay Mayberry and Joseph Bernstein 17 Jan 2017 Interim Report

Microelectronic bioinstrumentation system

NASA Technical Reports Server (NTRS)

Ko, W. H.; Yon, E. T.; Rodriguez, R. J.

1974-01-01

The progess made from April 1973 to June 1974 on a microelectronics bioinstrumentation system is reported and includes data for the following three individual projects: (1) a radio frequency powered implant telemetry system; (2) an ingestible temperature telemeter; and (3) development of pO2 and pH sensors. Proposed activities for continuation of the research for the period September 1, 1974 to August 31, 1975 are also discussed.

Radiofrequency and microwave radiation in the microelectronics industry.

PubMed

Cohen, R

1986-01-01

The microscopic precision required to produce minute integrated circuits is dependent on several processes utilizing radiofrequency and microwave radiation. This article provides a review of radiofrequency and microwave exposures in microelectronics and of the physical and biologic properties of these types of radiation; summarizes the existing, relevant medical literature; and provides the clinician with guidelines for diagnosis and treatment of excessive exposures to microwave and radiofrequency radiation.

Design and performance of vacuum system for high heat flux test facility

NASA Astrophysics Data System (ADS)

Swamy Kidambi, Rajamannar; Mokaria, Prakash; Khirwadkar, Samir; Belsare, Sunil; Khan, M. S.; Patel, Tushar; Krishnan, Deepu S.

2017-04-01

High heat flux test facility (HHFTF) at IPR is used for testing thermal performance of plasma facing materials or components. It consists of various subsystems like vacuum system, high power electron beam system, diagnostic and calibration system, data acquisition and control system and high pressure high temperature water circulation system. Vacuum system consists of large D-shaped chamber, target handling system, pumping systems and support structure. The net volume of vacuum chamber is 5 m3 was maintained at the base pressure of the order of 10-6 mbar for operation of electron gun with minimum beam diameter which is achieved with turbo-molecular pump (TMP) and cryo pump. A variable conductance gate valve is used for maintaining required vacuum in the chamber. Initial pumping of the chamber was carried out by using suitable rotary and root pumps. PXI and PLC based faster real time data acquisition and control system is implemented for performing the various operations like remote operation, online vacuum data measurements, display and status indication of all vacuum equipments. This paper describes in detail the design and implementation of various vacuum system for HHFTF.

Thermal Performance of Aged and Weathered Spray-On Foam Insulation (SOFI) Materials Under Cryogenic Vacuum Conditions (Cryostat-4)

NASA Technical Reports Server (NTRS)

2008-01-01

The NASA Cryogenics Test Laboratory at Kennedy Space Center conducted long-term testing of SOFI materials under actual-use cryogenic conditions with Cryostat-4. The materials included in the testing were NCFI 24-124 (acreage foam), BX-265 (close-out foam, including intertank flange and bipod areas), and a potential alternate material, NCFI 27-68, (acreage foam with the flame retardant removed). Specimens of these materials were placed at two locations: a site that simulated aging (the Vehicle Assembly Building [VAB]) and a site that simulated weathering (the Atmospheric Exposure Test Site [beach site]). After aging/weathering intervals of 3, 6, and 12 months, the samples were retrieved and tested for their thermal performance under cryogenic vacuum conditions with test apparatus Cryostat-4.

Enhanced vacuum laser-impulse coupling by volume absorption at infrared wavelengths

NASA Astrophysics Data System (ADS)

Phipps, C. R., Jr.; Harrison, R. F.; Shimada, T.; York, G. W.; Turner, R. F.

1990-03-01

This paper reports measurements of vacuum laser impulse coupling coefficients as large as 90 dyne/W, obtained with single microsec-duration CO2 laser pulses incident on a volume-absorbing, cellulose-nitrate-based plastic. This result is the largest coupling coefficient yet reported at any wavelength for a simple, planar target in vacuum, and partly results from expenditure of internal chemical energy in this material. Enhanced coupling was also observed in several other target materials that are chemically passive, but absorb light in depth at 10- and 3-micron wavelengths. The physical distinctions are discussed between this important case and that of simple, planar surface absorbers (such as metals) which were studied in the same experimental series, in light of the predictions of a simple theoretical model.

Collecting cometary soil samples? Development of the ROSETTA sample acquisition system

NASA Technical Reports Server (NTRS)

Coste, P. A.; Fenzi, M.; Eiden, Michael

1993-01-01

In the reference scenario of the ROSETTA CNRS mission, the Sample Acquisition System is mounted on the Comet Lander. Its tasks are to acquire three kinds of cometary samples and to transfer them to the Earth Return Capsule. Operations are to be performed in vacuum and microgravity, on a probably rough and dusty surface, in a largely unknown material, at temperatures in the order of 100 K. The concept and operation of the Sample Acquisition System are presented. The design of the prototype corer and surface sampling tool, and of the equipment for testing them at cryogenic temperatures in ambient conditions and in vacuum in various materials representing cometary soil, are described. Results of recent preliminary tests performed in low temperature thermal vacuum in a cometary analog ice-dust mixture are provided.

Low earth orbit durability evaluation of Haynes 188 solar receiver material

NASA Technical Reports Server (NTRS)

De Groh, Kim K.; Rutledge, Sharon K.; Burke, Christopher A.; Dever, Therese M.; Olle, Raymond M.; Terlep, Judith A.

1992-01-01

The effects of elevated-temperature vacuum and elevated-temperature atomic oxygen exposure on the mass, surface chemistry, surface morphology, and optical properties of Haynes 188, a possible heat receiver material for space-based solar dynamic power systems, have been studied. Pristine and surface modified Haynes 188 were exposed to vacuum less than or equal to 10 exp -6 torr at 820 C for 5215.5 h, and to atomic oxygen in an air plasma asher at 34 and 827 C for fluences up to 5.6 x 10 exp 21 atoms/sq cm. Results obtained indicate that vacuum heat treatment caused surface morphology and chemistry changes with corresponding optical property changes. Atomic oxygen exposure caused optical property changes which diminished with time. Mass changes are considered to be negligible for both exposures.

Vacuum-sintered body of a novel apatite for artificial bone

NASA Astrophysics Data System (ADS)

Tamura, Kenichi; Fujita, Tatsushi; Morisaki, Yuriko

2013-12-01

We produced regenerative artificial bone material and bone parts using vacuum-sintered bodies of a novel apatite called "Titanium medical apatite (TMA®)" for biomedical applications. TMA was formed by chemically connecting a Ti oxide molecule with the reactive [Ca10(PO4)6] group of Hydroxyapatite (HAp). The TMA powders were kneaded with distilled water, and solid cylinders of compacted TMA were made by compression molding at 10 MPa using a stainless-steel vessel. The TMA compacts were dried and then sintered in vacuum (about 10-3 Pa) or in air using a resistance heating furnace in the temperature range 1073-1773 K. TMA compacts were sintered at temperatures greater than 1073 K, thus resulting in recrystallization. The TMA compact bodies sintered in the range 1273-1773 K were converted into mixtures composed of three crystalline materials: α-TCP (tricalcium phosphate), β-TCP, and Perovskite-CaTiO3. The Perovskite crystals were stable and hard. In vacuum-sintering, the Perovskite crystals were transformed into fibers (approximately 1 µm in diameter × 8 µm in length), and the fiber distribution was uniform in various directions. We refer to the TMA vacuum-sintered bodies as a "reinforced composite material with Perovskite crystal fibers." However, in atmospheric sintering, the Perovskite crystals were of various sizes and were irregularly distributed as a result of the effect of oxygen. After sintering temperature at 1573 K, the following results were obtained: the obtained TMA vacuum-sintered bodies (1) were white, (2) had a density of approximately 2300 kg/m3 (corresponding to that of a compact bone or a tooth), and had a thermal conductivity of approximately 31.3 W/(m·K) (corresponding to those of metal or ceramic implants). Further, it was possible to cut the TMA bodies into various forms with a cutting machine. An implant made of TMA and inserted into a rabbit jaw bone was covered by new bone tissues after just one month because of the high biocompatibility of the TMA implant. TMA vacuum-sintered bodies are promising biomaterials for use as artificial bone materials to regenerate bone parts and produce bone reinforcement structures that are used for bone junctions in dental and orthopedic surgery.

Breadboard CO2 and humidity control system

NASA Technical Reports Server (NTRS)

Boehm, A. M.

1976-01-01

A regenerable CO2 and humidity control system is being developed for potential use on shuttle as an alternate to the baseline lithium hydroxide (LiOH)/condensing heat exchanger system. The system utilizes a sorbent material, designated HS-C, to adsorb CO2 and water vapor from the cabin atmosphere. The material is regenerated by exposing it to space vacuum. A half-size breadboard system, utilizing a flight representative HS-C canister, was designed, built, and performance tested to shuttle requirements for total CO2 and total humidity removal. The use of a new chemical matrix material allowed significant optimization of the system design by packing the HS-C chemical into the core of a heat exchanger which is manifolded to form two separate and distinct beds. Breadboard system performance was proven by parametric testing and simulated mission testing over the full range of shuttle crew sizes and metabolic loadings. Vacuum desorption testing demonstrated considerable savings in previously projected shuttle vacuum duct sizing.

Vacuum ultraviolet photon fluxes in argon-containing inductively coupled plasmas

NASA Astrophysics Data System (ADS)

Radovanov, S. B.; Persing, H. M.; Wang, S.; Culver, C. L.; Boffard, J. B.; Lin, C. C.; Wendt, A. E.

2013-09-01

Vacuum ultraviolet (VUV) photons emitted from excited atomic states are ubiquitous in material processing plasmas. Damage of materials is induced by energy transfer from the VUV photons to the surface, causing disorder in the surface region, surface reactions, and affecting bonds in the material bulk. Monitoring of the surface flux of VUV photons from inductively coupled plasmas (ICP) and its dependence on discharge parameters is thus highly desirable. Results of non-invasive, direct windowless VUV detection using a photosensitive diode will be presented. Relative VUV fluxes were also obtained using a sodium salicylate coating on the inside of a vacuum window, converting VUV into visible light detected through the vacuum window. The coating is sensitive to wavelengths in the range 80-300 nm, while the photodiode is only sensitive to wavelengths below 120 nm. In argon the VUV emissions are primarily produced by spontaneous decay from 3p5 4 s resonance levels (1s2,1s4) and may be reabsorbed by ground state atoms. Real-time resonance level concentrations were measured and used to predict the VUV photon flux at the detector for a range of different ICP pressures, powers, and for various admixtures of Ar with N2, and H2. This work was supported in part by NSF grant PHY-1068670.

Vacuum MOCVD fabrication of high efficience cells

NASA Technical Reports Server (NTRS)

Partain, L. D.; Fraas, L. M.; Mcleod, P. S.; Cape, J. A.

1985-01-01

Vacuum metal-organic-chemical-vapor-deposition (MOCVD) is a new fabrication process with improved safety and easier scalability due to its metal rather than glass construction and its uniform multiport gas injection system. It uses source materials more efficiently than other methods because the vacuum molecular flow conditions allow the high sticking coefficient reactants to reach the substrates as undeflected molecular beams and the hot chamber walls cause the low sticking coefficient reactants to bounce off the walls and interact with the substrates many times. This high source utilization reduces the materials costs power device and substantially decreases the amounts of toxic materials that must be handled as process effluents. The molecular beams allow precise growth control. With improved source purifications, vacuum MOCVD has provided p GaAs layers with 10-micron minority carrier diffusion lengths and GaAs and GaAsSb solar cells with 20% AMO efficiencies at 59X and 99X sunlight concentration ratios. Mechanical stacking has been identified as the quickest, most direct and logical path to stacked multiple-junction solar cells that perform better than the best single-junction devices. The mechanical stack is configured for immediate use in solar arrays and allows interconnections that improve the system end-of-life performance in space.

Vacuum Ultraviolet Radiation Desorption of Molecular Contaminants Deposited on Quartz Crystal Microbalances

NASA Technical Reports Server (NTRS)

Albyn, Keith; Burns, Dewitt

2006-01-01

Recent quartz crystal microbalance measurements made in the Marshall Space Flight Center, Photo-Deposition Facility, for several materials, recorded a significant loss of deposited contaminants when the deposition surface of the microbalance was illuminated by a deuterium lamp. These measurements differ from observations made by other investigators in which the rate of deposition increased significantly when the deposition surface was illuminated with vacuum ultraviolet radiation. These observations suggest that the accelerated deposition of molecular contaminants on optically sensitive surfaces is dependant upon the contaminant being deposited and must be addressed during the materials selection process by common material screening techniques.

Vacuum Powder Injector

NASA Technical Reports Server (NTRS)

Working, Dennis C.

1991-01-01

Method developed to provide uniform impregnation of bundles of carbon-fiber tow with low-solubility, high-melt-flow polymer powder materials to produce composite prepregs. Vacuum powder injector expands bundle of fiber tow, applies polymer to it, then compresses bundle to hold powder. System provides for control of amount of polymer on bundle. Crystallinity of polymer maintained by controlled melt on takeup system. All powder entrapped, and most collected for reuse. Process provides inexpensive and efficient method for making composite materials. Allows for coating of any bundle of fine fibers with powders. Shows high potential for making prepregs of improved materials and for preparation of high-temperature, high-modulus, reinforced thermoplastics.

Very high-vacuum heat treatment facility

NASA Technical Reports Server (NTRS)

Folkner, W. M.; Moody, M. V.; Richard, J.-P.

1987-01-01

A vacuum heat treatment facility, with hot zone dimensions of 12 x 19 x 19 cm, has been designed and constructed at a cost substantially below that of a commercial unit. The design incorporates efficient water cooling and a resistive heating element. A vacuum pressure of 1.5 x 10 to the -8th torr at room temperature has been obtained after baking. The temperature limit is approximately 1900 C. This limit results from the choice of niobium as the hot zone material.

Zero-dimensional to three-dimensional nanojoining: current status and potential applications

DOE PAGES

Ma, Ying; Li, Hong; Bridges, Denzel; ...

2016-08-01

We report that the continuing miniaturization of microelectronics is pushing advanced manufacturing into nanomanufacturing. Nanojoining is a bottom-up assembly technique that enables functional nanodevice fabrication with dissimilar nanoscopic building blocks and/or molecular components. Various conventional joining techniques have been modified and re-invented for joining nanomaterials. Our review surveys recent progress in nanojoining methods, as compared to conventional joining processes. Examples of nanojoining are given and classified by the dimensionality of the joining materials. At each classification, nanojoining is reviewed and discussed according to materials specialties, low dimensional processing features, energy input mechanisms and potential applications. The preparation of new intermetallicmore » materials by reactive nanoscale multilayer foils based on self-propagating high-temperature synthesis is highlighted. This review will provide insight into nanojoining fundamentals and innovative applications in power electronics packaging, plasmonic devices, nanosoldering for printable electronics, 3D printing and space manufacturing.« less

Microsensor research

NASA Astrophysics Data System (ADS)

Hughes, R. C.; Drebing, C. G.

1990-04-01

The technology that led to very large scale integrated circuits on silicon chips also provides a basis for new microsensors that are small, inexpensive, low power, rugged, and reliable. Two examples of microsensors Sandia is developing that take advantage of this technology are the microelectronic chemical sensor array and the radiation sensing field effect transistor (RADFET). Increasingly, the technology of chemical sensing needs new microsensor concepts. Applications in this area include environmental monitoring, criminal investigations, and state-of-health monitoring, both for equipment and living things. Chemical microsensors can satisfy sensing needs in the industrial, consumer, aerospace, and defense sectors. The microelectronic chemical-sensor array may address some of these applications. We have fabricated six separate chemical gas sensing areas on the microelectronic chemical sensor array. By using different catalytic metals on the gate areas of the diodes, we can selectively sense several gases.

Applicability of LET to single events in microelectronic structures

NASA Astrophysics Data System (ADS)

Xapsos, Michael A.

1992-12-01

LET is often used as a single parameter to determine the energy deposited in a microelectronic structure by a single event. The accuracy of this assumption is examined for ranges of ion energies and volumes of silicon appropriate for modern microelectronics. It is shown to be accurate only under very restricted conditions. Significant differences arise because (1) LET is related to energy lost by the ion, not energy deposited in the volume; and (2) LET is an average value and does not account for statistical variations in energy deposition. Criteria are suggested for determining when factors other than LET should be considered, and new analytical approaches are presented to account for them. One implication of these results is that improvements can be made in space upset rate predictions by incorporating the new methods into currently used codes such as CREME and CRUP.

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages.

PubMed

Carlton, Holly D; Elmer, John W; Li, Yan; Pacheco, Mario; Goyal, Deepak; Parkinson, Dilworth Y; MacDowell, Alastair A

2016-04-13

Synchrotron radiation micro-tomography (SRµT) is a non-destructive three-dimensional (3D) imaging technique that offers high flux for fast data acquisition times with high spatial resolution. In the electronics industry there is serious interest in performing failure analysis on 3D microelectronic packages, many which contain multiple levels of high-density interconnections. Often in tomography there is a trade-off between image resolution and the volume of a sample that can be imaged. This inverse relationship limits the usefulness of conventional computed tomography (CT) systems since a microelectronic package is often large in cross sectional area 100-3,600 mm(2), but has important features on the micron scale. The micro-tomography beamline at the Advanced Light Source (ALS), in Berkeley, CA USA, has a setup which is adaptable and can be tailored to a sample's properties, i.e., density, thickness, etc., with a maximum allowable cross-section of 36 x 36 mm. This setup also has the option of being either monochromatic in the energy range ~7-43 keV or operating with maximum flux in white light mode using a polychromatic beam. Presented here are details of the experimental steps taken to image an entire 16 x 16 mm system within a package, in order to obtain 3D images of the system with a spatial resolution of 8.7 µm all within a scan time of less than 3 min. Also shown are results from packages scanned in different orientations and a sectioned package for higher resolution imaging. In contrast a conventional CT system would take hours to record data with potentially poorer resolution. Indeed, the ratio of field-of-view to throughput time is much higher when using the synchrotron radiation tomography setup. The description below of the experimental setup can be implemented and adapted for use with many other multi-materials.

Strategic Computing. New-Generation Computing Technology: A Strategic Plan for Its Development and Application to Critical Problems in Defense

DTIC Science & Technology

1983-10-28

Computing. By seizing an opportunity to leverage recent advances in artificial intelligence, computer science, and microelectronics, the Agency plans...occurred in many separated areas of artificial intelligence, computer science, and microelectronics. Advances in "expert system" technology now...and expert knowledge o Advances in Artificial Intelligence: Mechanization of speech recognition, vision, and natural language understanding. o

Microelectronic device package with an integral window

DOEpatents

Peterson, Kenneth A.; Watson, Robert D.

2002-01-01

An apparatus for packaging of microelectronic devices, including an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can include a cofired ceramic frame or body. The package can have an internal stepped structure made of one or more plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination.

Design Considerations in Capacitively Coupled Plasmas

NASA Astrophysics Data System (ADS)

Song, Sang-Heon; Ventzek, Peter; Ranjan, Alok

2015-11-01

Microelectronics industry has driven transistor feature size scaling from 10-6 m to 10-9 m during the past 50 years, which is often referred to as Moore's law. It cannot be overstated that today's information technology would not have been so successful without plasma material processing. One of the major plasma sources for the microelectronics fabrication is capacitively coupled plasmas (CCPs). The CCP reactor has been intensively studied and developed for the deposition and etching of different films on the silicon wafer. As the feature size gets to around 10 nm, the requirement for the process uniformity is less than 1-2 nm across the wafer (300 mm). In order to achieve the desired uniformity, the hardware design should be as precise as possible before the fine tuning of process condition is applied to make it even better. In doing this procedure, the computer simulation can save a significant amount of resources such as time and money which are critical in the semiconductor business. In this presentation, we compare plasma properties using a 2-dimensional plasma hydrodynamics model for different kinds of design factors that can affect the plasma uniformity. The parameters studied in this presentation include chamber accessing port, pumping port, focus ring around wafer substrate, and the geometry of electrodes of CCP.

Fabrication and characterization of resonant SOI micromechanical silicon sensors based on DRIE micromachining, freestanding release process and silicon direct bonding

NASA Astrophysics Data System (ADS)

Gigan, Olivier; Chen, Hua; Robert, Olivier; Renard, Stephane; Marty, Frederic

2002-11-01

This paper is dedicated to the fabrication and technological aspect of a silicon microresonator sensor. The entire project includes the fabrication processes, the system modelling/simulation, and the electronic interface. The mechanical model of such resonator is presented including description of frequency stability and Hysterises behaviour of the electrostatically driven resonator. Numeric model and FEM simulations are used to simulate the system dynamic behaviour. The complete fabrication process is based on standard microelectronics technology with specific MEMS technological steps. The key steps are described: micromachining on SOI by Deep Reactive Ion Etching (DRIE), specific release processes to prevent sticking (resist and HF-vapour release process) and collective vacuum encapsulation by Silicon Direct Bonding (SDB). The complete process has been validated and prototypes have been fabricated. The ASIC was designed to interface the sensor and to control the vibration amplitude. This electronic was simulated and designed to work up to 200°C and implemented in a standard 0.6μ CMOS technology. Characterizations of sensor prototypes are done both mechanically and electrostatically. These measurements showed good agreements with theory and FEM simulations.

Nanoscale Imaging of Buried Structures via Scanning Near-Field Ultrasound Holography

NASA Astrophysics Data System (ADS)

Shekhawat, Gajendra S.; Dravid, Vinayak P.

2005-10-01

A nondestructive imaging method, scanning near-field ultrasound holography (SNFUH), has been developed that provides depth information as well as spatial resolution at the 10- to 100-nanometer scale. In SNFUH, the phase and amplitude of the scattered specimen ultrasound wave, reflected in perturbation to the surface acoustic standing wave, are mapped with a scanning probe microscopy platform to provide nanoscale-resolution images of the internal substructure of diverse materials. We have used SNFUH to image buried nanostructures, to perform subsurface metrology in microelectronic structures, and to image malaria parasites in red blood cells.

Social Significance of Fundamental Science Common to all Mankind

NASA Astrophysics Data System (ADS)

Zel'Dovich, Ya. B.

It is a challenge of science to play a great role in solution of the problem of meeting material and spiritual human demands. The argument is known that science has become a productive force. When characterizing economy of one or another country or region, it is a practice to speak about science-intensive works, i.e., those where production and competitiveness are directly related to a science level. The science-intensive works include, for example, production of microelectronic circuits and their application in computer and information science or production of pharmaceutical preparations using gene engineering. This list could be continued indefinitely…

Nanotechnologies in Cuba: Popularization and Training

NASA Astrophysics Data System (ADS)

Rodríguez Castellanos, Carlos

In Cuba, as in other countries, activities in the field of nanotechnology emerged from the converging development of research in materials physics and chemistry, microelectronics, supramolecular physics, microbiology and molecular biology. During the 1990s, theoretical and experimental work on semiconductor nanostructures gained in importance. Cuban physicists organized the Red CYTED (Network CYTED) to "study fabrication and characterization of semiconductor nanostructures for micro and optoelectronics" which functioned between 1998 and 2003 with the participation of eight Spanish-American countries. The network organized various courses and scientific meetings, edited a book and supported the scientific collaboration among the participant institutions.

Graphitic nanofilms of zinc-blende materials: ab initio calculations

NASA Astrophysics Data System (ADS)

Hu, San-Lue; Zhao, Li; Li, Yan-Li

2017-12-01

Ab initio calculations on ultra-thin nanofilms of 25 kinds of zinc-blende semiconductors demonstrate their stable geometry structures growth along (1 1 1) surface. Our results show that the (1 1 1) surfaces of 9 kinds of zinc-blende semiconductors can transform into a stable graphitelike structure within a certain thickness. The tensile strain effect on the thickness of graphitic films is not obvious. The band gaps of stable graphitic films can be tuned over a wide range by epitaxial tensile strain, which is important for applications in microelectronic devices, solar cells and light-emitting diodes.

Room-temperature semiconductor heterostructure refrigeration

NASA Astrophysics Data System (ADS)

Chao, K. A.; Larsson, Magnus; Mal'shukov, A. G.

2005-07-01

With the proper design of semiconductor tunneling barrier structures, we can inject low-energy electrons via resonant tunneling, and take out high-energy electrons via a thermionic process. This is the operation principle of our semiconductor heterostructure refrigerator (SHR) without the need of applying a temperature gradient across the device. Even for the bad thermoelectric material AlGaAs, our calculation shows that at room temperature, the SHR can easily lower the temperature by 5-7K. Such devices can be fabricated with the present semiconductor technology. Besides its use as a kitchen refrigerator, the SHR can efficiently cool microelectronic devices.

Comparisons of Hamaker constants for ceramic systems with intervening vacuum or water: From force laws and physical properties

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ackler, H.D.; Chiang, Y.M.; French, R.H.

1996-05-10

Van der Waals dispersive forces produce attractive interactions between bodies, playing an important role in many material systems influencing colloidal and emulsion stability, wetting behavior, and intergranular forces in glass-ceramic systems. It is of technological importance to accurately quantify these interactions, conveniently represented by the Hamaker constant, A. To set the current level of accuracy for determining A, they were calculated from Lifshitz theory using full spectral data for muscovite mica, Al{sub 2}O{sub 3}, SiO{sub 2}, Si{sub 3}N{sub 4}, and rutile TiO{sub 2}, separated by vacuum or water. These were compared to Hamaker constants calculated from physical properties using themore » Tabor-Winterton approximation, a single oscillator model, a multiple oscillator model, and A`s calculated using force vs separation data from surface force apparatus and atomic force microscope studies. For materials with refractive indices between 1.4 and 1.8 separated by vacuum, all methods produce similar values, but for indices larger than 1.8 separated by vacuum, and any of these materials separated by water, results span a broader range. The present level of accuracy for the determination of Hamaker constants, here taken to be represented by the level of agreement between various methods, ranges from about 10% for the case of SiO{sub 2}/vacuum/SiO{sub 2} and TiO{sub 2}/water/TiO{sub 2} to a factor of approximately 7 for mica/water/mica.« less

NDE for Material Characterization in Aeronautic and Space Applications

NASA Technical Reports Server (NTRS)

Baaklini, George Y.; Kautz, Harold E.; Gyekenyesi, Andrew L.; Abdul-Aziz, Ali; Martin, Richard E.

2000-01-01

This paper describes selected nondestructive evaluation (NDE) approaches that were developed or tailored at the NASA Glenn Research Center for characterizing advanced material systems. The emphasis is on high-temperature aerospace propulsion applications. The material systems include monolithic ceramics, superalloys, and high temperature composites. In the aeronautic area, the highlights are cooled ceramic plate structures for turbine applications, F-TiAl blade materials for low-pressure turbines, thermoelastic stress analysis (TSA) for residual stress measurements in titanium based and nickel based engine materials, and acousto ultrasonics (AU) for creep damage assessment in nickel-based alloys. In the space area, examples consist of cooled carbon-carbon composites for gas generator combustors and flywheel rotors composed of carbon fiber reinforced polymer matrix composites for energy storage on the international space station (ISS). The role of NDE in solving manufacturing problems, the effect of defects on structural behavior, and the use of NDE-based finite element modeling are discussed. NDE technology needs for improved microelectronic and mechanical systems as well as health monitoring of micro-materials and components are briefly discussed.

Enhanced energy harvesting in commercial ferroelectric materials

NASA Astrophysics Data System (ADS)

Patel, Satyanarayan; Chauhan, Aditya; Vaish, Rahul

2014-04-01

Ferroelectric materials are used in a number of applications ranging from simple sensors and actuators to ferroelectric random access memories (FRAMs), transducers, health monitoring system and microelectronics. The multiphysical coupling ability possessed by these materials has been established to be useful for energy harvesting applications. However, conventional energy harvesting techniques employing ferroelectric materials possess low energy density. This has prevented the successful commercialization of ferroelectric based energy harvesting systems. In this context, the present study aims at proposing a novel approach for enhanced energy harvesting using commercially available ferroelectric materials. This technique was simulated to be used for two commercially available piezoelectric materials namely PKI-552 and APCI-840, soft and hard lead-zirconate-titanate (PZT) pervoskite ceramics, respectively. It was observed that a maximum energy density of 348 kJm-3cycle-1 can be obtained for cycle parameters of (0-1 ton compressive stress and 1-25 kV.cm-1 electric field) using APCI-840. The reported energy density is several hundred times larger than the maximum energy density reported in the literature for vibration harvesting systems.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kim, Jaekyun; Kim, Myung -Gil; Kim, Jaehyun

The success of silicon based high density integrated circuits ignited explosive expansion of microelectronics. Although the inorganic semiconductors have shown superior carrier mobilities for conventional high speed switching devices, the emergence of unconventional applications, such as flexible electronics, highly sensitive photosensors, large area sensor array, and tailored optoelectronics, brought intensive research on next generation electronic materials. The rationally designed multifunctional soft electronic materials, organic and carbon-based semiconductors, are demonstrated with low-cost solution process, exceptional mechanical stability, and on-demand optoelectronic properties. Unfortunately, the industrial implementation of the soft electronic materials has been hindered due to lack of scalable fine-patterning methods. Inmore » this report, we demonstrated facile general route for high throughput sub-micron patterning of soft materials, using spatially selective deep-ultraviolet irradiation. For organic and carbon-based materials, the highly energetic photons (e.g. deep-ultraviolet rays) enable direct photo-conversion from conducting/semiconducting to insulating state through molecular dissociation and disordering with spatial resolution down to a sub-μm-scale. As a result, the successful demonstration of organic semiconductor circuitry promise our result proliferate industrial adoption of soft materials for next generation electronics.« less

Fabrication of fillable microparticles and other complex 3D microstructures

NASA Astrophysics Data System (ADS)

McHugh, Kevin J.; Nguyen, Thanh D.; Linehan, Allison R.; Yang, David; Behrens, Adam M.; Rose, Sviatlana; Tochka, Zachary L.; Tzeng, Stephany Y.; Norman, James J.; Anselmo, Aaron C.; Xu, Xian; Tomasic, Stephanie; Taylor, Matthew A.; Lu, Jennifer; Guarecuco, Rohiverth; Langer, Robert; Jaklenec, Ana

2017-09-01

Three-dimensional (3D) microstructures created by microfabrication and additive manufacturing have demonstrated value across a number of fields, ranging from biomedicine to microelectronics. However, the techniques used to create these devices each have their own characteristic set of advantages and limitations with regards to resolution, material compatibility, and geometrical constraints that determine the types of microstructures that can be formed. We describe a microfabrication method, termed StampEd Assembly of polymer Layers (SEAL), and create injectable pulsatile drug-delivery microparticles, pH sensors, and 3D microfluidic devices that we could not produce using traditional 3D printing. SEAL allows us to generate microstructures with complex geometry at high resolution, produce fully enclosed internal cavities containing a solid or liquid, and use potentially any thermoplastic material without processing additives.

Two- to three-dimensional crossover in a dense electron liquid in silicon

NASA Astrophysics Data System (ADS)

Matmon, Guy; Ginossar, Eran; Villis, Byron J.; Kölker, Alex; Lim, Tingbin; Solanki, Hari; Schofield, Steven R.; Curson, Neil J.; Li, Juerong; Murdin, Ben N.; Fisher, Andrew J.; Aeppli, Gabriel

2018-04-01

Doping of silicon via phosphine exposures alternating with molecular beam epitaxy overgrowth is a path to Si:P substrates for conventional microelectronics and quantum information technologies. The technique also provides a well-controlled material for systematic studies of two-dimensional lattices with a half-filled band. We show here that for a dense (ns=2.8 ×1014 cm-2) disordered two-dimensional array of P atoms, the full field magnitude and angle-dependent magnetotransport is remarkably well described by classic weak localization theory with no corrections due to interaction. The two- to three-dimensional crossover seen upon warming can also be interpreted using scaling concepts developed for anistropic three-dimensional materials, which work remarkably except when the applied fields are nearly parallel to the conducting planes.

Preparation and characteristics of TFMB functionalized graphene oxide/polyimide nanocomposite films

NASA Astrophysics Data System (ADS)

Liu, Lin; Wang, Yiyao; Gao, Yixin

2018-04-01

Polyimide(PI), with its great thermal and mechanical properties, has been widely used in various fields, such as aerospace and microelectronics. However, with the development of high technology, common PI materials can not satisfy the demands, due to its high resistance. In this work, we used 2,2'- Bis(trifluoromethyl) benzidine(TFMB) to functionalize GO and further form GO-TFMB/PI nanocomposite film. In the end, we got GO-TFMB/PI nanocomposite films with excellent thermal stability, better toughness and better electrical conductivity. As shown in results, the incorporation of GO-TFMB maintained excellent thermal stability. With the addition of GO-TFMB, the resistivity of the composite film decreased continuously. And when the content of GO-TFMB was 0.8 wt%, the resistivity could achieve the excellent antistatic material standard.

Physics through the 1990s: Scientific interfaces and technological applications

NASA Technical Reports Server (NTRS)

1986-01-01

The volume examines the scientific interfaces and technological applications of physics. Twelve areas are dealt with: biological physics-biophysics, the brain, and theoretical biology; the physics-chemistry interface-instrumentation, surfaces, neutron and synchrotron radiation, polymers, organic electronic materials; materials science; geophysics-tectonics, the atmosphere and oceans, planets, drilling and seismic exploration, and remote sensing; computational physics-complex systems and applications in basic research; mathematics-field theory and chaos; microelectronics-integrated circuits, miniaturization, future trends; optical information technologies-fiber optics and photonics; instrumentation; physics applications to energy needs and the environment; national security-devices, weapons, and arms control; medical physics-radiology, ultrasonics, MNR, and photonics. An executive summary and many chapters contain recommendations regarding funding, education, industry participation, small-group university research and large facility programs, government agency programs, and computer database needs.

Thermal Conductivity of Carbon Nanotube Composite Films

NASA Technical Reports Server (NTRS)

Ngo, Quoc; Cruden, Brett A.; Cassell, Alan M.; Walker, Megan D.; Koehne, Jessica E.; Meyyappan, M.; Li, Jun; Yang, Cary Y.

2004-01-01

State-of-the-art ICs for microprocessors routinely dissipate power densities on the order of 50 W/sq cm. This large power is due to the localized heating of ICs operating at high frequencies, and must be managed for future high-frequency microelectronic applications. Our approach involves finding new and efficient thermally conductive materials. Exploiting carbon nanotube (CNT) films and composites for their superior axial thermal conductance properties has the potential for such an application requiring efficient heat transfer. In this work, we present thermal contact resistance measurement results for CNT and CNT-Cu composite films. It is shown that Cu-filled CNT arrays enhance thermal conductance when compared to as-grown CNT arrays. Furthermore, the CNT-Cu composite material provides a mechanically robust alternative to current IC packaging technology.

Strong interfacial polarization in graphene/ZnO nanocomposite for high-performance miniscule permittivity materials

NASA Astrophysics Data System (ADS)

Shoeb, Mohd; Mobin, Mohammad; Naqvi, Alim H.

2018-05-01

In the 21st century evolution of microelectronics industries, consumptions of integrated circuits (IC's) increases, so the demand of miniscule permittivity (MP) material with minimum loss factor arises in the electronics industries. Graphene embedded ZnO Nanoparticle (Gr/ZnO NCs) is synthesized and studied their dielectric properties In the studied frequency range 75 kHz to 7 MHz. In the sample Gr/ZnO NCs dielectric permittivity decrease gradually from 7.2 to 6.7 as the frequency increases, whereas dielectric permittivity of ZnO NPs shows also diminishing behavior in the range 75 to 20 as the frequency increases. In the Gr/ZnO NCs, Maxwell-Wagner polarization model explains strong interfacial polarization to presence of functionalization group and lattice defects on graphene sheet.

Wafer-Level Vacuum Packaging of Smart Sensors.

PubMed

Hilton, Allan; Temple, Dorota S

2016-10-31

The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors-"low cost" for ubiquitous presence, and "smart" for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS) integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology.

Wafer-Level Vacuum Packaging of Smart Sensors

PubMed Central

Hilton, Allan; Temple, Dorota S.

2016-01-01

The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS) integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology. PMID:27809249

Transport of cosmic ray nuclei in various materials

NASA Technical Reports Server (NTRS)

Silberberg, R.; Tsao, C. H.; Letaw, J. R.

1988-01-01

Cosmic-ray heavy ions have become a concern in space radiation effects analyses. Heavy ions rapidly deposit energy and create dense ionization trails as they traverse materials. Collection of the free charge disrupts the operation of microelectronic circuits. This effect, called the single-event upset, can cause a loss of digital data. Passage of high linear energy transfer particles through the eyes has been observed by Apollo astronauts. These heavy ions have great radiobiological effectiveness and are the primary risk factor for leukemia induction on a manned Mars mission. Models of the transport of heavy cosmic-ray nuclei through materials depend heavily on our understanding of the cosmic-ray environment, nuclear spallation cross sections, and computer transport codes. Our group has initiated and pursued the development of a full capability for modeling these transport processes. A recent review of this ongoing effort is presented in Ref. 5. In this paper, we discuss transport methods and present new results comparing the attenuation of cosmic rays in various materials.

NASA SBIR product catalog, 1991

NASA Technical Reports Server (NTRS)

1991-01-01

This catalog is a partial list of products of NASA SBIR (Small Business Innovation Research) projects that have advanced to some degree into Phase 3. While most of the products evolved from work conducted during SBIR Phase 1 and 2, a few advanced to commercial status solely from Phase 1 activities. The catalog presents information provided to NASA by SBIR contractors who wished to have their products exhibited at Technology 2001, a NASA-sponsored technology transfer conference held in San Jose, California, on December 4, 5, and 6, 1991. The catalog presents the product information in the following technology areas: computer and communication systems; information processing and AI; robotics and automation; signal and image processing; microelectronics; electronic devices and equipment; microwave electronic devices; optical devices and lasers; advanced materials; materials processing; materials testing and NDE; materials instrumentation; aerodynamics and aircraft; fluid mechanics and measurement; heat transfer devices; refrigeration and cryogenics; energy conversion devices; oceanographic instruments; atmosphere monitoring devices; water management; life science instruments; and spacecraft electromechanical systems.

The effect of woven roving fiberglass total layers on resin infusion time in vacuum infusion

NASA Astrophysics Data System (ADS)

Saputra, A. H.; Ibrahim, R. H.

2018-04-01

Composite material consists of reinforcement materials and resin as a matrix. Vacuum infusion isone of composite material manufacturing process. This process is to minimize the air cavity on composite material. The composite material will have good mechanical properties. There is a problem in vacuum infusion related to resin gelling time that must be considered. In this study, the area as well as the reinforcement layers are variated. Unsaturated polyester was used as resin and woven roving fiberglass was used as reinforcement. This study was obtained that resin infusion time data for woven roving, 15x20 cm of size, in two until six layers are 55 seconds to 78 seconds; whereas, the infusion times for 15x25 cm of size,in two until six layers are 119 seconds to 235 seconds; whereas the infusion time for 15x35 cm of size, in two until six layers are 181 seconds to 303 seconds. By data processing, the maximum fiber area that resin still can flow, for 6 layers, is 0,4391 m2 (or 15 cm x 2.92m). Maximum fiber total layers for the specimen with 15x20cm2, 15x25cm2 and 15x35 cm2 of areaare 147, 145 and 125 layers respectively.

Vacuum ultraviolet radiation and thermal cycling effects on atomic oxygen protective photovoltaic array blanket materials

NASA Technical Reports Server (NTRS)

Brady, J.; Banks, B.

1990-01-01

The importance of synergistic environmental exposure is demonstrated through the evaluation of DuPont 93-1 in simulated LEO environment. Changes in optical properties, surface condition, and mass loss data are described. The qualitative results indicate the necessity for exposure of materials to a series of simulated LEO environments in order to properly determine synergistic effects and demonstrate the overall LEO durability of candidate materials. It is shown that synergistic effects may occur with vacuum thermal cycling combined with VUV radiation followed by atomic oxygen exposure. Testing the durability of candidate solar array blanket materials in a test sequence with necessary synergistic effects makes it possible to determine the appropriate material for providing structural support and maintaining the proper operating temperature for solar cells in the SSF Photovaltaic Power System.

Optical effect of the contamination of infrared windows by the outgassing of materials in outer space

NASA Technical Reports Server (NTRS)

Silberman, E.

1975-01-01

The products and kinetics of outgassing from S13G paint were studied by using infrared absorption measurements of the material outgassed (using an evaporation cell and vacuum chamber). Two separate long-term experimental depositions from heated samples of the S13G paint were made. Before each experiment, the vacuum chamber and sample holder were carefully cleaned and outgassed to ensure that subsequent deposits on the colled-window were due only to the products evaporated from the sample. Results of experiments are listed and discussed.

Conventionally cast and forged copper alloy for high-heat-flux thrust chambers

NASA Technical Reports Server (NTRS)

Kazaroff, John M.; Repas, George A.

1987-01-01

The combustion chamber liner of the space shuttle main engine is made of NARloy-Z, a copper-silver-zirconium alloy. This alloy was produced by vacuum melting and vacuum centrifugal casting; a production method that is currently now available. Using conventional melting, casting, and forging methods, NASA has produced an alloy of the same composition called NASA-Z. This report compares the composition, microstructure, tensile properties, low-cycle fatigue life, and hot-firing life of these two materials. The results show that the materials have similar characteristics.

Effect of Air and Vacuum Storage on the Tensile Properties of X-Ray Exposed Aluminized-FEP

NASA Technical Reports Server (NTRS)

deGroh, Kim K.; Gummow, Jonathan D.

2000-01-01

Metallized Teflon(Registered Trademark) FEP (fluorinated ethylene propylene), a common spacecraft thermal control material, from the exterior layer of the Hubble Space Telescope (HST) has become embrittled and suffers from extensive cracking. Teflon samples retrieved during Hubble servicing missions and from the Long Duration Exposure Facility (LDEF) indicate that there may be continued degradation in tensile properties over time. An investigation has been conducted to evaluate the effect of air and vacuum storage on the mechanical properties of x-ray exposed FEP. Aluminized-FEP (Al-FEP) tensile samples were irradiated with 15.3 kV Cu x-rays and stored in air or under vacuum for various time periods. Tensile data indicate that samples stored in air display larger decreases in tensile properties than for samples stored under vacuum. Air-stored samples developed a hazy appearance, which corresponded to a roughening of the aluminized surface. Optical property changes were also characterized. These findings indicate that air exposure plays a role in the degradation of irradiated FEP, therefore proper sample handling and storage is necessary with materials retrieved from space.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Shao, Tao, E-mail: st@mail.iee.ac.cn; Yang, Wenjin; Zhang, Cheng

Polymer materials, such as polymethylmethacrylate (PMMA), are widely used as insulators in vacuum. The insulating performance of a high-voltage vacuum system is mainly limited by surface flashover of the insulators rather than bulk breakdown. Non-thermal plasmas are an efficient method to modify the chemical and physical properties of polymer material surfaces, and enhance the surface insulating performance. In this letter, an atmospheric-pressure dielectric barrier discharge is used to treat the PMMA surface to improve the surface flashover strength in vacuum. Experimental results indicate that the plasma treatment method using Ar and CF{sub 4} (10:1) as the working gas can etchmore » the PMMA surface, introduce fluoride groups to the surface, and then alter the surface characteristics of the PMMA. The increase in the surface roughness can introduce physical traps that can capture free electrons, and the fluorination can enhance the charge capturing ability. The increase in the surface roughness and the introduction of the fluoride groups can enhance the PMMA hydrophobic ability, improve the charge capturing ability, decrease the secondary electron emission yield, increase the surface resistance, and improve the surface flashover voltage in vacuum.« less

Vacuum-deposited polymer/silver reflector material

NASA Astrophysics Data System (ADS)

Affinito, John D.; Martin, Peter M.; Gross, Mark E.; Bennett, Wendy D.

1994-09-01

Weatherable, low cost, front surface, solar reflectors on flexible substrates would be highly desirable for lamination to solar concentrator panels. The method to be described in this paper may permit such reflector material to be fabricated for less the 50$CNT per square foot. Vacuum deposited Polymer/Silver/Polymer reflectors and Fabry-Perot interference filters were fabricated in a vacuum web coating operation on polyester substrates. Reflectivities were measured in the wavelength range from .4 micrometers to .8 micrometers . It is hoped that a low cost substrate can be used with the substrate laminated to the concentrator and the weatherable acrylic polymer coating facing the sun. This technique should be capable of deposition line speeds approaching 1500 linear feet/minute2. Central to this technique is a new vacuum deposition process for the high rate deposition of polymer films. This polymer process involves the flash evaporation of an acrylic monomer onto a moving substrate. The monomer is subsequently cured by an electron beam or ultraviolet light. This high speed polymer film deposition process has been named the PML process- for Polymer Multi- Layer.

Miniature x-ray source

DOEpatents

Trebes, James E.; Bell, Perry M.; Robinson, Ronald B.

2000-01-01

A miniature x-ray source utilizing a hot filament cathode. The source has a millimeter scale size and is capable of producing broad spectrum x-ray emission over a wide range of x-ray energies. The miniature source consists of a compact vacuum tube assembly containing the hot filament cathode, an anode, a high voltage feedthru for delivering high voltage to the cathode, a getter for maintaining high vacuum, a connector for initial vacuum pump down and crimp-off, and a high voltage connection for attaching a compact high voltage cable to the high voltage feedthru. At least a portion of the vacuum tube wall is fabricated from highly x-ray transparent materials, such as sapphire, diamond, or boron nitride.

Effect of double vacuum melting and retained austenite on rolling-element fatigue life of AMS 5749 bearing steel

NASA Technical Reports Server (NTRS)

Parker, R. J.; Hodder, R. S.

1977-01-01

AMS 5749 steel combines the tempering, hot hardness, and hardness retention characteristics of AISI M-50 steel with the corrosion and oxidation resistance of AISI 440C stainless steel. The five-ball fatigue tester was used to evaluate the rolling-element fatigue life of AMS 5749. Double vacuum melting (vacuum induction melting plus vacuum arc remelting, VIM-VAR) produced AMS 5749 material with a rolling-element fatigue life at least 14 times that of vacuum induction melting alone. The VIM-VAR AMS 5749 steel balls gave lives from 6 to 12 times greater than VIM-VAR AISI M-50 steel balls. The highest level of retained austenite, 14.6 percent, was significantly detrimental to rolling-element fatigue life relative to the intermediate level of 11.1 percent.

Thermal Performance of Biological Substance Systems in Vitro Under Static and Dynamic Conditions at the Cryogenic Test Laboratory, NASA Kennedy Space Center, USA

NASA Technical Reports Server (NTRS)

Augustynowicz, S. D.; Fesmire, James E.; Steinrock, T. (Technical Monitor)

2001-01-01

A unique research program, including a comprehensive study of thermal performance at cryogenic vacuum insulation systems, was performed at the NASA Kennedy Space Center. The main goal was to develop a new soft vacuum system (from 1 torr to 10 torr) that provides an intermediate level of performance (k-value below 4.8 mW/m-K). Liquid nitrogen boil-off methods were used to test conventional materials, novel materials, and certain combinations. The test articles included combinations of aluminum foil, fiberglass paper, polyester fabric, silica aerogel composite blanket, fumed silica, silica aerogel powder, and syntactic foam. A new LCI system was developed at the Cryogenics Test Laboratory. This system performs exceptionally well at soft vacuum levels and nearly as good as an MLI at high vacuum levels. Apparent thermal conductivities for the LCI range from 2 mW/m-K at soft vacuum to 0.1 mW/m-K at high vacuum. Several cryostats were designed, constructed, and calibrated by the Cryogenics Test Laboratory at KSC NASA as part of this research program. The cryostat test apparatus is a liquid nitrogen boil-off calorimeter system for direct measurement of the apparent thermal conductivity at a fixed vacuum level between 5 x 10(exp -5) and 760 torr. The apparatus is also used for transient measurements of temperature profiles. The development of efficient, robust cryogenic insulation systems has been a targeted area of research for a number of years. Improved methods of characterization, testing, and evaluation of complex biological substance systems for cryosurgery and cryobiology are the focus of this paper.

Indigenous Manufacturing realization of TWIN Source

NASA Astrophysics Data System (ADS)

Pandey, R.; Bandyopadhyay, M.; Parmar, D.; Yadav, R.; Tyagi, H.; Soni, J.; Shishangiya, H.; Sudhir Kumar, D.; Shah, S.; Bansal, G.; Pandya, K.; Parmar, K.; Vuppugalla, M.; Gahlaut, A.; Chakraborty, A.

2017-04-01

TWIN source is two RF driver based negative ion source that has been planned to bridge the gap between single driver based ROBIN source (currently operational) and eight river based DNB source (to be operated under IN-TF test facility). TWIN source experiments have been planned at IPR keeping the objective of long term domestic fusion programme to gain operational experiences on vacuum immersed multi driver RF based negative ion source. High vacuum compatible components of twin source are designed at IPR keeping an aim on indigenous built in attempt. These components of TWIN source are mainly stainless steel and OFC-Cu. Being high heat flux receiving components, one of the major functional requirements is continuous heat removal via water as cooling medium. Hence for the purpose stainless steel parts are provided with externally milled cooling lines and that shall be covered with a layer of OFC-cu which would be on the receiving side of high heat flux. Manufacturability of twin source components requires joining of these dissimilar materials via process like electrode position, electron beam welding and vacuum brazing. Any of these manufacturing processes shall give a vacuum tight joint having proper joint strength at operating temperature and pressure. Taking the indigenous development effort vacuum brazing (in non-nuclear environment) has been opted for joining of dissimilar materials of twin source being one of the most reliable joining techniques and commercially feasible across the suppliers of country. Manufacturing design improvisation for the components has been done to suit the vacuum brazing process requirement and to ease some of the machining without comprising over the functional and operational requirements. This paper illustrates the details on the indigenous development effort, design improvisation to suits manufacturability, vacuum brazing basics and its procedures for twin source components.

Microelectronics Status Analysis and Secondary Part Procureability Assessment of the THAAD Weapon System

DTIC Science & Technology

1999-10-01

Technical Report 5-20448 & 5- 20449 Contract No. DAAH01-98-D-R001 Delivery Order No. 34 Microelectronics Status Analysis and Secondary Part...Procureability Assessment of the THAAD Weapon System. (5-20448 & 5- 20449 ) Final Technical Report for Period 21 January 1999 through 30 September 1999...Huntsville Huntsville, AL 35899 5. FUNDING NUMBERS 8. PERFORMING ORGANIZATION REPORT NUMBER 5-20448 & 5- 20449 9. SPONSORING/MONITORING AGENCY

Reduction of particle deposition on substrates using temperature gradient control

DOEpatents

Rader, Daniel J.; Dykhuizen, Ronald C.; Geller, Anthony S.

2000-01-01

A method of reducing particle deposition during the fabrication of microelectronic circuitry is presented. Reduction of particle deposition is accomplished by controlling the relative temperatures of various parts of the deposition system so that a large temperature gradient near the surface on which fabrication is taking place exists. This temperature gradient acts to repel particles from that surface, thereby producing cleaner surfaces, and thus obtaining higher yields from a given microelectronic fabrication process.

Electromagnetic Compatibility (EMC) in Microelectronics.

DTIC Science & Technology

1983-02-01

Fault Tree Analysis", System Saftey Symposium, June 8-9, 1965, Seattle: The Boeing Company . 12. Fussell, J.B., "Fault Tree Analysis-Concepts and...procedure for assessing EMC in microelectronics and for applying DD, 1473 EOiTO OP I, NOV6 IS OESOL.ETE UNCLASSIFIED SECURITY CLASSIFICATION OF THIS...CRITERIA 2.1 Background 2 2.2 The Probabilistic Nature of EMC 2 2.3 The Probabilistic Approach 5 2.4 The Compatibility Factor 6 3 APPLYING PROBABILISTIC

Radiation measurement in the environment of FLASH using passive dosimeters

NASA Astrophysics Data System (ADS)

Mukherjee, B.; Rybka, D.; Makowski, D.; Lipka, T.; Simrock, S.

2007-08-01

Sophisticated electronic devices comprising sensitive microelectronic components have been installed in the close proximity of the 720 MeV superconducting electron linear accelerator (linac) driving the FLASH (Free Electron Laser in Hamburg), presently in operation at DESY in Hamburg. Microelectronic chips are inherently vulnerable to ionizing radiation, usually generated during routine operation of high-energy particle accelerator facilities like the FLASH. Hence, in order to assess the radiation effect on microelectronic chips and to develop suitable mitigation strategy, it becomes imperative to characterize the radiation field in the FLASH environment. We have evaluated the neutron and gamma energy (spectra) and dose distributions at critical locations in the FLASH tunnel using superheated emulsion (bubble) detectors, GaAs light emitting diodes (LED), LiF-thermoluminescence dosimeters (TLD) and radiochromic (Gafchromic EBT) films. This paper highlights the application of passive dosimeters for an accurate analysis of the radiation field produced by high-energy electron linear accelerators.

Book of Knowledge (BOK) for NASA Electronic Packaging Roadmap

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2015-01-01

The objective of this document is to update the NASA roadmap on packaging technologies (initially released in 2007) and to present the current trends toward further reducing size and increasing functionality. Due to the breadth of work being performed in the area of microelectronics packaging, this report presents only a number of key packaging technologies detailed in three industry roadmaps for conventional microelectronics and a more recently introduced roadmap for organic and printed electronics applications. The topics for each category were down-selected by reviewing the 2012 reports of the International Technology Roadmap for Semiconductor (ITRS), the 2013 roadmap reports of the International Electronics Manufacturing Initiative (iNEMI), the 2013 roadmap of association connecting electronics industry (IPC), the Organic Printed Electronics Association (OE-A). The report also summarizes the results of numerous articles and websites specifically discussing the trends in microelectronics packaging technologies.

Bi-level multilayered microelectronic device package with an integral window

DOEpatents

Peterson, Kenneth A.; Watson, Robert D.

2002-01-01

A bi-level, multilayered package with an integral window for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that the light-sensitive side is optically accessible through the window. A second chip can be bonded to the backside of the first chip, with the second chip being wirebonded to the second level of the bi-level package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed.

Robust Multilayer Insulation for Cryogenic Systems

NASA Technical Reports Server (NTRS)

Fesmire, J. E.; Scholtens, B. F.; Augustynowicz, S. D.

2007-01-01

New requirements for thermal insulation include robust Multilayer insulation (MU) systems that work for a range of environments from high vacuum to no vacuum. Improved MLI systems must be simple to install and maintain while meeting the life-cycle cost and thermal performance objectives. Performance of actual MLI systems has been previously shown to be much worse than ideal MLI. Spacecraft that must contain cryogens for both lunar service (high vacuum) and ground launch operations (no vacuum) are planned. Future cryogenic spacecraft for the soft vacuum environment of Mars are also envisioned. Industry products using robust MLI can benefit from improved cost-efficiency and system safety. Novel materials have been developed to operate as excellent thermal insulators at vacuum levels that are much less stringent than the absolute high vacuum requirement of current MLI systems. One such robust system, Layered Composite Insulation (LCI), has been developed by the Cryogenics Test Laboratory at NASA Kennedy Space Center. The experimental testing and development of LCI is the focus of this paper. LCI thermal performance under cryogenic conditions is shown to be six times better than MLI at soft vacuum and similar to MLI at high vacuum. The experimental apparent thermal conductivity (k-value) and heat flux data for LCI systems are compared with other MLI systems.

Design, fabrication, and characterization of 4H-silicon carbide rectifiers for power switching applications

NASA Astrophysics Data System (ADS)

Sheridan, David Charles

Silicon Carbide has received a substantial increase in research interest over the past few years as a base material system for high-frequency and high-power semiconductor devices. Of the over 1200 polytypes, 4H-SiC is the most attractive polytype for power devices due to its wide band gap (3.2eV), excellent thermal conductivity (4.9 W/cm·K), and high critical field strength (˜2 x 106 V/cm). Important for power devices, the 10x increase in critical field strength of SiC allows high voltage blocking layers to be fabricated significantly thinner than for comparable Si devices. For power rectifiers, this reduces device on-resistance, while maintaining the same high voltage blocking capability. In this work, 4H-SiC Schottky, pn, and junction barrier Schottky (JBS) rectifiers for use in high voltage switching applications have been designed, fabricated, and extensively characterized. First, a detailed review of 4H-SiC material parameters was performed and SiC models were implemented into a standard Si drift-diffusion numerical simulator. Using these models, a SiC simulation methodology was developed in order to enable predictive SiC device design. A wide variety of rectifier and edge termination designs were investigated and optimized with respect to breakdown efficiency, area consumption, resistance to interface charge, and fabrication practicality. Simulated termination methods include: field plates, floating guard rings, and a variety of junction termination extensions (JTE). Using the device simulation results, both Schottky and JBS rectifiers were fabricated with a novel self-aligned edge termination design, and fabricated with process elements developed at the Alabama Microelectronics Science and Technology Center facility. These rectifiers exhibited near-ideal forward characteristics and had blocking voltages in excess of 2.5kV. The SiC diodes were subjected to inductive switching tests, and were found to have superior reverse recovery characteristics compared to a similar Si diode. Finally, the performance of these SiC rectifiers were tested in inductive switching circuits and in high dose gamma radiation environments. In both cases, these devices were shown to be superior to their silicon counterparts. The details of this work was presented and published in the proceedings of the 45th International Meeting of the American Vacuum Society [1], the 1999 International Conference on Silicon Carbide and Related Materials [2, 3] and the 2000 European Conference on Silicon Carbide and Related Materials [4]. The expanded conference papers were published in the international journal. Solid-State Electronics [5, 6].

Silicon crystal growth in vacuum

NASA Technical Reports Server (NTRS)

Khattak, C. P.; Schmid, F.

1982-01-01

The most developed process for silicon crystal growth is the Czochralski (CZ) method which was in production for over two decades. In an effort to reduce cost of single crystal silicon for photovoltaic applications, a directional solidification technique, Heat Exchanger Method (HEM), was adapted. Materials used in HEM and CZ furnaces are quite similar (heaters, crucibles, insulation, etc.). To eliminate the cost of high purity argon, it was intended to use vacuum operation in HEM. Two of the major problems encountered in vacuum processing of silicon are crucible decomposition and silicon carbide formation in the melt.

Apollo Experiment Report: Lunar-Sample Processing in the Lunar Receiving Laboratory High-Vacuum Complex

NASA Technical Reports Server (NTRS)

White, D. R.

1976-01-01

A high-vacuum complex composed of an atmospheric decontamination system, sample-processing chambers, storage chambers, and a transfer system was built to process and examine lunar material while maintaining quarantine status. Problems identified, equipment modifications, and procedure changes made for Apollo 11 and 12 sample processing are presented. The sample processing experiences indicate that only a few operating personnel are required to process the sample efficiently, safely, and rapidly in the high-vacuum complex. The high-vacuum complex was designed to handle the many contingencies, both quarantine and scientific, associated with handling an unknown entity such as the lunar sample. Lunar sample handling necessitated a complex system that could not respond rapidly to changing scientific requirements as the characteristics of the lunar sample were better defined. Although the complex successfully handled the processing of Apollo 11 and 12 lunar samples, the scientific requirement for vacuum samples was deleted after the Apollo 12 mission just as the vacuum system was reaching its full potential.