Optical inspection of hidden MEMS structures
NASA Astrophysics Data System (ADS)
Krauter, Johann; Gronle, Marc; Osten, Wolfgang
2017-06-01
Micro-electro-mechanical system's (MEMS) applications have greatly expanded over the recent years, and the MEMS industry has grown almost exponentially. One of the strongest drivers are the automotive and consumer markets. A 100% test is necessary especially in the production of automotive MEMS sensors since they are subject to safety relevant functions. This inspection should be carried out before dicing and packaging since more than 90% of the production costs are incurred during these steps. An electrical test is currently being carried out with each MEMS component. In the case of a malfunction, the defect can not be located on the wafer because the MEMS are no longer optically accessible due to the encapsulation. This paper presents a low coherence interferometer for the topography measurement of MEMS structures located within the wafer stack. Here, a high axial and lateral resolution is necessary to identify defects such as stuck or bent MEMS fingers. First, the boundary conditions for an optical inspection system will be discussed. The setup is then shown with some exemplary measurements.
Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects
NASA Astrophysics Data System (ADS)
Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter
2011-02-01
The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.
NASA Astrophysics Data System (ADS)
Krauter, Johann; Osten, Wolfgang
2018-03-01
There are a wide range of applications for micro-electro-mechanical systems (MEMS). The automotive and consumer market is the strongest driver for the growing MEMS industry. A 100 % test of MEMS is particularly necessary since these are often used for safety-related purposes such as the ESP (Electronic Stability Program) system. The production of MEMS is a fully automated process that generates 90 % of the costs during the packaging and dicing steps. Nowadays, an electrical test is carried out on each individual MEMS component before these steps. However, after encapsulation, MEMS are opaque to visible light and other defects cannot be detected. Therefore, we apply an infrared low-coherence interferometer for the topography measurement of those hidden structures. A lock-in algorithm-based method is shown to calculate the object height and to reduce ghost steps due to the 2π -unambiguity. Finally, measurements of different MEMS-based sensors are presented.
Process for fabricating a microelectromechanical structure
Sniegowski, Jeffry J.; Krygowski, Thomas W.; Mani, Seethambal S.; Habermehl, Scott D.; Hetherington, Dale L.; Stevens, James E.; Resnick, Paul J.; Volk, Steven R.
2004-10-26
A process is disclosed for forming a microelectromechanical (MEM) structure on a substrate having from 5 to 6 or more layers of deposited and patterned polysilicon. The process is based on determining a radius of curvature of the substrate which is bowed due to accumulated stress in the layers of polysilicon and a sacrificial material used to buildup the MEM structure, and then providing one or more stress-compensation layers on a backside of the substrate to flatten the substrate and allow further processing.
2004-01-01
pyrolyzed to produce the ceramic (SiCN) parts, or they may be retained in the polymeric state and used as high-temperature polymer /glass MEMS devices. Two...structure and the SU8 /wafer is weak due to the Teflon coating. (j) A free standing polymer structure results. The structure is then crosslinked and... polymer . Further efforts are necessary to identify the least damaging rinsing chemicals, that is, chemicals which would not contaminate polymerized
Conformal and embedded IDT microsensors for health monitoring of structures
NASA Astrophysics Data System (ADS)
Varadan, Vijay K.; Varadan, Vasundara V.
2000-06-01
MEMS are currently being applied to the structural health monitoring of critical aircraft components and composites. The approach integrates acoustic emission, strain gauges, MEMS accelerometers and vibration monitoring aircraft components with a known history of catastrophic failure due to fracture. Recently a combination of the need for safety in the air and the desire to control costs is encouraging the use of in-flight monitoring of aircraft components and systems using light-weight, wireless and cost effective microsensors and MEMS. An in-situ aircraft structural health monitoring system, with sensors embedded in the composite structure or surface-mounted on the structure, would permit the timely detection of damage in aircraft. Micromachining offers the potential for fabricating a range of microsensor and MEMS for structural applications including load, vibration and acoustics characterization and monitoring. Such microsensors are extremely small; they can be embedded into structural materials, can be mass-produced and are therefore potentially cheap. The smart sensors are being developed using the standard microelectronics and micromachining in conjunction with novel Penn State wireless communication systems suitable for condition monitoring of aircraft structures in-flight. The main application areas of this investigation include continuos monitoring of a) structural integrity of aging aircraft, b) fatigue cracking, c) corrosion, d) deflection and strain of aircraft structures, wings, and rotorblades, e) impact damage, f) delamination and g) location and propagation of cracks. In this paper we give an overview of wireless programmable microsensors and MEMS and their associated driving electronics for such applications.
Piezoelectric Lead Zirconate Titanate (PZT) Ring Shaped Contour-Mode MEMS Resonators
NASA Astrophysics Data System (ADS)
Kasambe, P. V.; Asgaonkar, V. V.; Bangera, A. D.; Lokre, A. S.; Rathod, S. S.; Bhoir, D. V.
2018-02-01
Flexibility in setting fundamental frequency of resonator independent of its motional resistance is one of the desired criteria in micro-electromechanical (MEMS) resonator design. It is observed that ring-shaped piezoelectric contour-mode MEMS resonators satisfy this design criterion than in case of rectangular plate MEMS resonators. Also ring-shaped contour-mode piezoelectric MEMS resonator has an advantage that its fundamental frequency is defined by in-plane dimensions, but they show variation of fundamental frequency with different Platinum (Pt) thickness referred as change in ratio of fNEW /fO . This paper presents the effects of variation in geometrical parameters and change in piezoelectric material on the resonant frequencies of Platinum piezoelectric-Aluminium ring-shaped contour-mode MEMS resonators and its electrical parameters. The proposed structure with Lead Zirconate Titanate (PZT) as the piezoelectric material was observed to be a piezoelectric material with minimal change in fundamental resonant frequency due to Platinum thickness variation. This structure was also found to exhibit extremely low motional resistance of 0.03 Ω as compared to the 31-35 Ω range obtained when using AlN as the piezoelectric material. CoventorWare 10 is used for the design, simulation and corresponding analysis of resonators which is Finite Element Method (FEM) analysis and design tool for MEMS devices.
SnO2-based memristors and the potential synergies of integrating memristors with MEMS
NASA Astrophysics Data System (ADS)
Zubia, David; Almeida, Sergio; Talukdar, Arka; Mireles, Jose; MacDonald, Eric
2012-06-01
Memristors, usually in the form metal/metal-oxide/metal, have attracted much attention due to their potential application for non-volatile memory. Their simple structure and ease of fabrication make them good candidates for dense memory with projections of 22 terabytes per wafer. Excellent switching times of ~10 ns, memory endurance of >109 cycles, and extrapolated retention times of >10 yrs have been reported. Interestingly, memristors use the migration of ions to change their resistance in response to charge flow, and can therefore measure and remember the amount of current that has flowed. This is similar to many MEMS devices in which the motion of mass is an operating principle of the device. Memristors are also similar to MEMS in the sense that they can both be resistant to radiation effects. Memristors are radiation tolerant since information is stored as a structural change and not as electronic charge. Functionally, a MEMS device's sensitivity to radiation is concomitant to the role that the dielectric layers play in the function of the device. This is due to radiation-induced trapped charge in the dielectrics which can alter device performance and in extreme cases cause failure. Although different material systems have been investigated for memristors, SnO2 has received little attention even though it demonstrates excellent electronic properties and a high resistance to displacement damage from radiation due to a large Frenkel defect energy (7 eV) compared its bandgap (3.6 eV). This talk discusses recent research on SnO2-based memristors and the potential synergies of integrating memristors with MEMS.
Ball driven type MEMS SAD for artillery fuse
NASA Astrophysics Data System (ADS)
Seok, Jin Oh; Jeong, Ji-hun; Eom, Junseong; Lee, Seung S.; Lee, Chun Jae; Ryu, Sung Moon; Oh, Jong Soo
2017-01-01
The SAD (safety and arming device) is an indispensable fuse component that ensures safe and reliable performance during the use of ammunition. Because the application of electronic devices for smart munitions is increasing, miniaturization of the SAD has become one of the key issues for next-generation artillery fuses. Based on MEMS technology, various types of miniaturized SADs have been proposed and fabricated. However, none of them have been reported to have been used in actual munitions due to their lack of high impact endurance and complicated explosive train arrangements. In this research, a new MEMS SAD using a ball driven mechanism, is successfully demonstrated based on a UV LIGA (lithography, electroplating and molding) process. Unlike other MEMS SADs, both high impact endurance and simple structure were achieved by using a ball driven mechanism. The simple structural design also simplified the fabrication process and increased the processing yield. The ball driven type MEMS SAD performed successfully under the desired safe and arming conditions of a spin test and showed fine agreement with the FEM simulation result, conducted prior to its fabrication. A field test was also performed with a grenade launcher to evaluate the SAD performance in the firing environment. All 30 of the grenade samples equipped with the proposed MEMS SAD operated successfully under the high-G setback condition.
CFD-ACE+: a CAD system for simulation and modeling of MEMS
NASA Astrophysics Data System (ADS)
Stout, Phillip J.; Yang, H. Q.; Dionne, Paul; Leonard, Andy; Tan, Zhiqiang; Przekwas, Andrzej J.; Krishnan, Anantha
1999-03-01
Computer aided design (CAD) systems are a key to designing and manufacturing MEMS with higher performance/reliability, reduced costs, shorter prototyping cycles and improved time- to-market. One such system is CFD-ACE+MEMS, a modeling and simulation environment for MEMS which includes grid generation, data visualization, graphical problem setup, and coupled fluidic, thermal, mechanical, electrostatic, and magnetic physical models. The fluid model is a 3D multi- block, structured/unstructured/hybrid, pressure-based, implicit Navier-Stokes code with capabilities for multi- component diffusion, multi-species transport, multi-step gas phase chemical reactions, surface reactions, and multi-media conjugate heat transfer. The thermal model solves the total enthalpy from of the energy equation. The energy equation includes unsteady, convective, conductive, species energy, viscous dissipation, work, and radiation terms. The electrostatic model solves Poisson's equation. Both the finite volume method and the boundary element method (BEM) are available for solving Poisson's equation. The BEM method is useful for unbounded problems. The magnetic model solves for the vector magnetic potential from Maxwell's equations including eddy currents but neglecting displacement currents. The mechanical model is a finite element stress/deformation solver which has been coupled to the flow, heat, electrostatic, and magnetic calculations to study flow, thermal electrostatically, and magnetically included deformations of structures. The mechanical or structural model can accommodate elastic and plastic materials, can handle large non-linear displacements, and can model isotropic and anisotropic materials. The thermal- mechanical coupling involves the solution of the steady state Navier equation with thermoelastic deformation. The electrostatic-mechanical coupling is a calculation of the pressure force due to surface charge on the mechanical structure. Results of CFD-ACE+MEMS modeling of MEMS such as cantilever beams, accelerometers, and comb drives are discussed.
Rotational MEMS mirror with latching arm for silicon photonics
NASA Astrophysics Data System (ADS)
Brière, Jonathan; Beaulieu, Philippe-Olivier; Saidani, Menouer; Nabki, Frederic; Menard, Michaël.
2015-02-01
We present an innovative rotational MEMS mirror that can control the direction of propagation of light beams inside of planar waveguides implemented in silicon photonics. Potential applications include but are not limited to optical telecommunications, medical imaging, scan and spectrometry. The mirror has a half-cylinder shape with a radius of 300 μm that provides low and constant optical losses over the full angular displacement range. A circular comb drive structure is anchored such that it allows free or latched rotation experimentally demonstrated over 8.5° (X-Y planar rotational movement) using 290V electrostatic actuation. The entire MEMS structure was implemented using the MEMSCAP SOIMUMPs process. The center of the anchor beam is designed to be the approximate rotation point of the circular comb drive to counter the rotation offset of the mirror displacement. A mechanical characterization of the MEMS mirror is presented. The latching mechanism provides up to 20 different angular locking positions allowing the mirror to counter any resonance or vibration effects and it is actuated with an electrostatic linear comb drive. An innovative gap closing structure was designed to reduce optical propagation losses due to beam divergence in the interstitial space between the mirror and the planar waveguide. The gap closing structure is also electrostatically actuated and includes two side stoppers to prevent stiction.
Benevicius, Vincas; Ostasevicius, Vytautas; Gaidys, Rimvydas
2013-08-22
Due to their small size, low weight, low cost and low energy consumption, MEMS accelerometers have achieved great commercial success in recent decades. The aim of this research work is to identify a MEMS accelerometer structure for human body dynamics measurements. Photogrammetry was used in order to measure possible maximum accelerations of human body parts and the bandwidth of the digital acceleration signal. As the primary structure the capacitive accelerometer configuration is chosen in such a way that sensing part measures on all three axes as it is 3D accelerometer and sensitivity on each axis is equal. Hill climbing optimization was used to find the structure parameters. Proof-mass displacements were simulated for all the acceleration range that was given by the optimization problem constraints. The final model was constructed in Comsol Multiphysics. Eigenfrequencies were calculated and model's response was found, when vibration stand displacement data was fed into the model as the base excitation law. Model output comparison with experimental data was conducted for all excitation frequencies used during the experiments.
MEMS Reliability Assurance Activities at JPL
NASA Technical Reports Server (NTRS)
Kayali, S.; Lawton, R.; Stark, B.
2000-01-01
An overview of Microelectromechanical Systems (MEMS) reliability assurance and qualification activities at JPL is presented along with the a discussion of characterization of MEMS structures implemented on single crystal silicon, polycrystalline silicon, CMOS, and LIGA processes. Additionally, common failure modes and mechanisms affecting MEMS structures, including radiation effects, are discussed. Common reliability and qualification practices contained in the MEMS Reliability Assurance Guideline are also presented.
Analysis of the surface effects on adhesion in MEMS structures
NASA Astrophysics Data System (ADS)
Rusu, F.; Pustan, M.; Bîrleanu, C.; Müller, R.; Voicu, R.; Baracu, A.
2015-12-01
One of the main failure causes in microelectromechanical systems (MEMS) is stiction. Stiction is the adhesion of contacting surfaces due to surface forces. Adhesion force depends on the operating conditions and is influenced by the contact area. In this study, the adhesion force between MEMS materials and the AFM tips is analyzed using the spectroscopy in point mode of the AFM. The aim is to predict the stiction failure mode in MEMS. The investigated MEMS materials are silicon, polysilicon, platinum, aluminum, and gold. Three types of investigations were conducted. The first one aimed to determine the variation of the adhesion force with respect to the variation of the roughness. The roughness has a strong influence on the adhesion because the contact area between components increases if the roughness decreases. The second type of investigation aimed to determine the adhesion force in multiple points of each considered sample. The values obtained experimentally for the adhesion force were also validated using the JKR and DMT models. The third type of investigation was conducted with the purpose of determining the influence of the temperature on the adhesion force.
Novel First-Level Interconnect Techniques for Flip Chip on MEMS Devices
Sutanto, Jemmy; Anand, Sindhu; Patel, Chetan; Muthuswamy, Jit
2013-01-01
Flip-chip packaging is desirable for microelectro-mechanical systems (MEMS) devices because it reduces the overall package size and allows scaling up the number of MEMS chips through 3-D stacks. In this report, we demonstrate three novel techniques to create first-level interconnect (FLI) on MEMS: 1) Dip and attach technology for Ag epoxy; 2) Dispense technology for solder paste; 3) Dispense, pull, and attach technology (DPAT) for solder paste. The above techniques required no additional microfabrication steps, produced no visible surface contamination on the MEMS active structures, and generated high-aspect-ratio interconnects. The developed FLIs were successfully tested on MEMS moveable microelectrodes microfabricated by SUMMiTVTM process producing no apparent detrimental effect due to outgassing. The bumping processes were successfully applied on Al-deposited bond pads of 100 μm × 100 μm with an average bump height of 101.3 μm for Ag and 184.8 μm for solder (63Sn, 37Pb). DPAT for solder paste produced bumps with the aspect ratio of 1.8 or more. The average shear strengths of Ag and solder bumps were 78 MPa and 689 kPa, respectively. The electrical test on Ag bumps at 794 A/cm2 demonstrated reliable electrical interconnects with negligible resistance. These scalable FLI technologies are potentially useful for MEMS flip-chip packaging and 3-D stacking. PMID:24504168
Damage assessment in multilayered MEMS structures under thermal fatigue
NASA Astrophysics Data System (ADS)
Maligno, A. R.; Whalley, D. C.; Silberschmidt, V. V.
2011-07-01
This paper reports on the application of a Physics of Failure (PoF) methodology to assessing the reliability of a micro electro mechanical system (MEMS). Numerical simulations, based on the finite element method (FEM) using a sub-domain approach was used to examine the damage onset due to temperature variations (e.g. yielding of metals which may lead to thermal fatigue). In this work remeshing techniques were employed in order to develop a damage tolerance approach based on the assumption that initial flaws exist in the multi-layered.
Monolithic integration of a MOSFET with a MEMS device
Bennett, Reid; Draper, Bruce
2003-01-01
An integrated microelectromechanical system comprises at least one MOSFET interconnected to at least one MEMS device on a common substrate. A method for integrating the MOSFET with the MEMS device comprises fabricating the MOSFET and MEMS device monolithically on the common substrate. Conveniently, the gate insulator, gate electrode, and electrical contacts for the gate, source, and drain can be formed simultaneously with the MEMS device structure, thereby eliminating many process steps and materials. In particular, the gate electrode and electrical contacts of the MOSFET and the structural layers of the MEMS device can be doped polysilicon. Dopant diffusion from the electrical contacts is used to form the source and drain regions of the MOSFET. The thermal diffusion step for forming the source and drain of the MOSFET can comprise one or more of the thermal anneal steps to relieve stress in the structural layers of the MEMS device.
NASA Astrophysics Data System (ADS)
Yang, Zhenyin
Metal-contact MEMS switches hold great promise for implementing agile radio frequency (RF) systems because of their small size, low fabrication cost, low power consumption, wide operational band, excellent isolation and exceptionally low signal insertion loss. Gold is often utilized as a contact material for metal-contact MEMS switches due to its excellent electrical conductivity and corrosion resistance. However contact wear and stiction are the two major failure modes for these switches due to its material softness and high surface adhesion energy. To strengthen the contact material, pure gold was alloyed with other metal elements. We designed and constructed a new micro-contacting test facility that closely mimic the typical MEMS operation and utilized this facility to efficiently evaluate optimized contact materials. Au-Ni binary alloy system as the candidate contact material for MEMS switches was systematically investigated. A correlation between contact material properties (etc. microstructure, micro-hardness, electrical resistivity, topology, surface structures and composition) and micro-contacting performance was established. It was demonstrated nano-scale graded two-phase Au-Ni film could possibly yield an improved device performance. Gold micro-contact degradation mechanisms were also systematically investigated by running the MEMS switching tests under a wide range of test conditions. According to our quantitative failure analysis, field evaporation could be the dominant failure mode for highfield (> critical threshold field) hot switching; transient thermal-assisted wear could be the dominant failure mode for low-field hot switching; on the other hand, pure mechanical wear and steady current heating (1 mA) caused much less contact degradation in cold switching tests. Results from low-force (50 muN/micro-contact), low current (0.1 mA) tests on real MEMS switches indicated that continuous adsorbed films from ambient air could degrade the switch contact resistance. Our work also contributes to the field of general nano-science and technology by resolving the transfer directionality of field evaporation of gold in atomic force microscope (AFM)/scanning tunneling microscope (STM).
A Study on the Performance of Low Cost MEMS Sensors in Strong Motion Studies
NASA Astrophysics Data System (ADS)
Tanırcan, Gulum; Alçık, Hakan; Kaya, Yavuz; Beyen, Kemal
2017-04-01
Recent advances in sensors have helped the growth of local networks. In recent years, many Micro Electro Mechanical System (MEMS)-based accelerometers have been successfully used in seismology and earthquake engineering projects. This is basically due to the increased precision obtained in these downsized instruments. Moreover, they are cheaper alternatives to force-balance type accelerometers. In Turkey, though MEMS-based accelerometers have been used in various individual applications such as magnitude and location determination of earthquakes, structural health monitoring, earthquake early warning systems, MEMS-based strong motion networks are not currently available in other populated areas of the country. Motivation of this study comes from the fact that, if MEMS sensors are qualified to record strong motion parameters of large earthquakes, a dense network can be formed in an affordable price at highly populated areas. The goals of this study are 1) to test the performance of MEMS sensors, which are available in the inventory of the Institute through shake table tests, and 2) to setup a small scale network for observing online data transfer speed to a trusted in-house routine. In order to evaluate the suitability of sensors in strong motion related studies, MEMS sensors and a reference sensor are tested under excitations of sweeping waves as well as scaled earthquake recordings. Amplitude response and correlation coefficients versus frequencies are compared. As for earthquake recordings, comparisons are carried out in terms of strong motion(SM) parameters (PGA, PGV, AI, CAV) and elastic response of structures (Sa). Furthermore, this paper also focuses on sensitivity and selectivity for sensor performances in time-frequency domain to compare different sensing characteristics and analyzes the basic strong motion parameters that influence the design majors. Results show that the cheapest MEMS sensors under investigation are able to record the mid-frequency dominant SM parameters PGV and CAV with high correlation. PGA and AI, the high frequency components of the ground motion, are underestimated. Such a difference, on the other hand, does not manifest itself on intensity estimations. PGV and CAV values from the reference and MEMS sensors converge to the same seismic intensity level. Hence a strong motion network with MEMS sensors could be a modest option to produce PGV-based damage impact of an urban area under large magnitude earthquake threats in the immediate vicinity.
Wireless health monitoring of cracks in structures with MEMS-IDT sensors
NASA Astrophysics Data System (ADS)
Kim, Jae-Sung; Vinoy, K. J.; Varadan, Vijay K.
2002-07-01
The integration of MEMS, IDTs and required microelectronics and conformal antennas to realize programmable, robust and low cost passive microsensors suitable for many military structures and systems including aircraft, missiles and munitions is presented in this paper. The technology is currently being applied to the structural health monitoring of accelerometers, gyroscopes and vibration monitoring devices with signal processing electronics to provide real- time indicators of incipient failure of aircraft components with a known history of catastrophic failure due to fracture. Recently a combination of the need for safety in the air and the desire to control costs is encouraging the use of in-flight monitoring of aircraft components and systems using light-weight, wireless and cost effective microsensors and MEMS. An in-situ Aircraft structural health monitoring system, with sensors embedded in the composite structure or surface-mounted on the structure, would permit the timely detection of damage in aircraft. Micromachining offers the potential for fabricating a range of microsensors and MEMS for structural applications including load, vibration and acoustics characteristics and monitoring. Such microsensors are extremely small; they can be embedded into structural materials, can be mass-produced and are therefore potentially cheap. Additionally a range of sensor types can be integrated onto a single chip with built-in electronics and ASIC, providing a low power microsystem. The smart sensors are being developed using the standard microelectronics and micromachining in conjunction with novel Penn State smart electronics or wireless communication systems suitable for condition monitoring of aircraft structures in-flight. A hybrid accelerometer and gyroscope in a single chip suitable for inertial navigation system and other microsensors for health monitoring and condition-based maintenance of structures, drag sensing and control of aircraft, strain and deflection of structures and systems, ice sensing on aircraft, remote temperature and humidity measurement of propellant in munitions, chemical sensing, etc. are discussed.
Wireless microsensors for health monitoring of aircraft structures
NASA Astrophysics Data System (ADS)
Varadan, Vijay K.
2003-01-01
The integration of MEMS, IDTs (interdigital transducers) and required microelectronics and conformal antennas to realize programmable, robust and low cost passive microsensors suitable for many military structures and systems including aircraft, missiles and munitions is presented in this paper. The technology is currently being applied to the structural health monitoring of critical aircraft components. The approach integrates acoustic emission, strain gauges, MEMS accelerometers, gyroscopes and vibration monitoring devices with signal processing electronics to provide real-time indicators of incipient failure of aircraft components with a known history of catastrophic failure due to fracture. Recently a combination of the need for safety in the air and the desire to control costs is encouraging the use of in-flight monitoring of aircraft components and systems using light-weight, wireless and cost effective microsensors and MEMS. An in-situ Aircraft structural health monitoring (ASHM) system, with sensors embedded in the composite structure or surface-mounted on the structure, would permit the timely detection of damage in aircraft. Micromachining offers the potential for fabricating a range of microsensors and MEMS for structural applications including load, vibration and acoustics characterization and monitoring. Such microsensors are extremely small; they can be embedded into structural materials, can be mass-produced and are therefore potentially cheap. Additionally a range of sensor types can be integrated onto a single chip with built-in electronics and ASIC (Application Specific Integrated Circuit), providing a low power Microsystems. The smart sensors are being developed using the standard microelectronics and micromachining in conjunction with novel Penn State smart electronics or wireless communication systems suitable for condition monitoring of aircraft structures in-flight. A hybrid accelerometer and gyroscope in a single chip suitable for inertial navigation system and other microsensors for health monitoring and condition-based maintenance of structures, drag sensing and control of aircraft, strain and deflection of structures and systems, ice sensing on aircraft, remote temperature and humidity measurement of propellant in munitions, chemical sensing, etc. are discussed.
Localized synthesis, assembly and integration of silicon nanowires
NASA Astrophysics Data System (ADS)
Englander, Ongi
Localized synthesis, assembly and integration of one-dimensional silicon nanowires with MEMS structures is demonstrated and characterized in terms of local synthesis processes, electric-field assisted self-assembly, and a proof-of-concept nanoelectromechanical system (HEMS) demonstration. Emphasis is placed on the ease of integration, process control strategies, characterization techniques and the pursuit of integrated devices. A top-down followed by a bottom-up integration approach is utilized. Simple MEMS heater structures are utilized as the microscale platforms for the localized, bottom-up synthesis of one-dimensional nanostructures. Localized heating confines the high temperature region permitting only localized nanostructure synthesis and allowing the surroundings to remain at room temperature thus enabling CMOS compatible post-processing. The vapor-liquid-solid (VLS) process in the presence of a catalytic nanoparticle, a vapor phase reactant, and a specific temperature environment is successfully employed locally. Experimentally, a 5nm thick gold-palladium layer is used as the catalyst while silane is the vapor phase reactant. The current-voltage behavior of the MEMS structures can be correlated to the approximate temperature range required for the VLS reaction to take place. Silicon nanowires averaging 45nm in diameter and up to 29mum in length synthesized at growth rates of up to 1.5mum/min result. By placing two MEMS structures in close proximity, 4--10mum apart, localized silicon nanowire growth can be used to link together MEMS structures to yield a two-terminal, self-assembled micro-to-nano system. Here, one MEMS structure is designated as the hot growth structure while a nearby structure is designated as the cold secondary structure, whose role is to provide a natural stopping point for the VLS reaction. The application of a localized electric-field, 5 to 13V/mum in strength, during the synthesis process, has been shown to improve nanowire organization, alignment, and assembly. The integrated nanoelectrormechanical system was found to be mechanically resilient as it proved to successfully withstand a wide variety of post-processing steps, including manipulations and examinations under scanning and transmission electron microscopes and aqueous processing, although a super critical drying step is necessary to preserve the integrated system during the drying process. Electrical characterization of the system proved challenging due to low carrier concentration and possible transport issues at the nano-micro interface. Nonetheless, in a proof-of-concept demonstration, the system was functionalized and tested for a hydrogen sensing application.
Mechanical characterization of poly-SiGe layers for CMOS-MEMS integrated application
NASA Astrophysics Data System (ADS)
Modlinski, Robert; Witvrouw, Ann; Verbist, Agnes; Puers, Robert; De Wolf, Ingrid
2010-01-01
Measuring mechanical properties at the microscale is essential to understand and to fabricate reliable MEMS. In this paper a tensile testing system and matching microscale test samples are presented. The test samples have a dog-bone-like structure. They are designed to mimic standard macro-tensile test samples. The micro-tensile tests are used to characterize 0.9 µm thick polycrystalline silicon germanium (poly-SiGe) films. The poly-SiGe film, that can be considered as a close equivalent to polycrystalline silicon (poly-Si), is studied as a very promising material for use in CMOS/MEMS integration in a single chip due to its low-temperature LPCVD deposition (T < 450 °C). The fabrication process of the poly-SiGe micro-tensile test structure is explained in detail: the design, the processing and post-processing, the testing and finally the results' discussion. The poly-SiGe micro-tensile results are also compared with nanoindentation data obtained on the same poly-SiGe films as well as with results obtained by other research groups.
Method and system for automated on-chip material and structural certification of MEMS devices
Sinclair, Michael B.; DeBoer, Maarten P.; Smith, Norman F.; Jensen, Brian D.; Miller, Samuel L.
2003-05-20
A new approach toward MEMS quality control and materials characterization is provided by a combined test structure measurement and mechanical response modeling approach. Simple test structures are cofabricated with the MEMS devices being produced. These test structures are designed to isolate certain types of physical response, so that measurement of their behavior under applied stress can be easily interpreted as quality control and material properties information.
Investigation of improved designs for rotational micromirrors using multiuser MEMS processes
NASA Astrophysics Data System (ADS)
Lin, Julianna E.; Michael, Feras S. J.; Kirk, Andrew G.
2001-04-01
In recent years, the design of rotational micromirrors for use in optical cross connects has received much attention. Although several companies have already produced and marketed a number of torsional mirror devices, more work is still needed to determine how these mirrors can be integrated into optical systems to form compact optical switches. However, recently several commercial MEMS foundry services have become available. Thus, due to the low cost of these prototyping services, new devices can be fabricated in short amounts of time and the designs adapted to meet the needs of different applications. The purpose of this work is to investigate the fabrication of new micromirror designs using the Multi-User MEMS Processes (MUMPs) foundry service available from Cronos Integrated Microsystems, located in North Carolina, USA). Several sets of mirror designs were submitted for fabrication and the resulting structures characterized using a phase-shifting Mirau interferometer. The results of these devices are presented.
Development of topologically structured membranes of aluminum oxide
NASA Astrophysics Data System (ADS)
Bankova, A.; Videkov, V.; Tzaneva, B.
2014-05-01
In recent years, nanomembranes have become one of the most widely used construction material for ultrasensitive and ultrathin applications in micro-electromechanical systems (MEMS) and other sensor structures due to their remarkable mechanical properties. Among these, the mechanical stability is of particular importance. We present an approach to the analysis of the stability of nanostructured anodic aluminum oxide free membranes subjected to mechanical bending. The membranes tested were with a thickness of 500 nm to 15 urn in various topological shapes; we describe the technological schemes of their preparation. Bends were applied to membranes prepared by using a selective process of etching and anodizing. The results of the preparation of the membranes are discussed, together with the influence of the angle of deflection, and the number of bendings. The results obtained can be used in designing MEMS structures and sensors which use nanostructured anodic aluminum oxide.
Sabato, Alessandro; Feng, Maria Q.
2014-01-01
Recent advances in the Micro Electro-Mechanical System (MEMS) technology have made wireless MEMS accelerometers an attractive tool for Structural Health Monitoring (SHM) of civil engineering structures. To date, sensors' low sensitivity and accuracy—especially at very low frequencies—have imposed serious limitations for their application in monitoring large-sized structures. Conventionally, the MEMS sensor's analog signals are converted to digital signals before radio-frequency (RF) wireless transmission. The conversion can cause a low sensitivity to the important low-frequency and low-amplitude signals. To overcome this difficulty, the authors have developed a MEMS accelerometer system, which converts the sensor output voltage to a frequency-modulated signal before RF transmission. This is achieved by using a Voltage to Frequency Conversion (V/F) instead of the conventional Analog to Digital Conversion (ADC). In this paper, a prototype MEMS accelerometer system is presented, which consists of a transmitter and receiver circuit boards. The former is equipped with a MEMS accelerometer, a V/F converter and a wireless RF transmitter, while the latter contains an RF receiver and a F/V converter for demodulating the signal. The efficacy of the MEMS accelerometer system in measuring low-frequency and low-amplitude dynamic responses is demonstrated through extensive laboratory tests and experiments on a flow-loop pipeline. PMID:25198003
MemBrain: An Easy-to-Use Online Webserver for Transmembrane Protein Structure Prediction
NASA Astrophysics Data System (ADS)
Yin, Xi; Yang, Jing; Xiao, Feng; Yang, Yang; Shen, Hong-Bin
2018-03-01
Membrane proteins are an important kind of proteins embedded in the membranes of cells and play crucial roles in living organisms, such as ion channels, transporters, receptors. Because it is difficult to determinate the membrane protein's structure by wet-lab experiments, accurate and fast amino acid sequence-based computational methods are highly desired. In this paper, we report an online prediction tool called MemBrain, whose input is the amino acid sequence. MemBrain consists of specialized modules for predicting transmembrane helices, residue-residue contacts and relative accessible surface area of α-helical membrane proteins. MemBrain achieves a prediction accuracy of 97.9% of A TMH, 87.1% of A P, 3.2 ± 3.0 of N-score, 3.1 ± 2.8 of C-score. MemBrain-Contact obtains 62%/64.1% prediction accuracy on training and independent dataset on top L/5 contact prediction, respectively. And MemBrain-Rasa achieves Pearson correlation coefficient of 0.733 and its mean absolute error of 13.593. These prediction results provide valuable hints for revealing the structure and function of membrane proteins. MemBrain web server is free for academic use and available at www.csbio.sjtu.edu.cn/bioinf/MemBrain/. [Figure not available: see fulltext.
Sabato, Alessandro; Feng, Maria Q
2014-09-05
Recent advances in the Micro Electro-Mechanical System (MEMS) technology have made wireless MEMS accelerometers an attractive tool for Structural Health Monitoring (SHM) of civil engineering structures. To date, sensors' low sensitivity and accuracy--especially at very low frequencies--have imposed serious limitations for their application in monitoring large-sized structures. Conventionally, the MEMS sensor's analog signals are converted to digital signals before radio-frequency (RF) wireless transmission. The conversion can cause a low sensitivity to the important low-frequency and low-amplitude signals. To overcome this difficulty, the authors have developed a MEMS accelerometer system, which converts the sensor output voltage to a frequency-modulated signal before RF transmission. This is achieved by using a Voltage to Frequency Conversion (V/F) instead of the conventional Analog to Digital Conversion (ADC). In this paper, a prototype MEMS accelerometer system is presented, which consists of a transmitter and receiver circuit boards. The former is equipped with a MEMS accelerometer, a V/F converter and a wireless RF transmitter, while the latter contains an RF receiver and a F/V converter for demodulating the signal. The efficacy of the MEMS accelerometer system in measuring low-frequency and low-amplitude dynamic responses is demonstrated through extensive laboratory tests and experiments on a flow-loop pipeline.
Structural tests using a MEMS acoustic emission sensor
NASA Astrophysics Data System (ADS)
Oppenheim, Irving J.; Greve, David W.; Ozevin, Didem; Hay, D. Robert; Hay, Thomas R.; Pessiki, Stephen P.; Tyson, Nathan L.
2006-03-01
In a collaborative project at Lehigh and Carnegie Mellon, a MEMS acoustic emission sensor was designed and fabricated as a suite of six resonant-type capacitive transducers in the frequency range between 100 and 500 kHz. Characterization studies showed good comparisons between predicted and experimental electro-mechanical behavior. Acoustic emission events, simulated experimentally in steel ball impact and in pencil lead break tests, were detected and source localization was demonstrated. In this paper we describe the application of the MEMS device in structural testing, both in laboratory and in field applications. We discuss our findings regarding housing and mounting (acoustic coupling) of the MEMS device with its supporting electronics, and we then report the results of structural testing. In all tests, the MEMS transducers were used in parallel with commercial acoustic emission sensors, which thereby serve as a benchmark and permit a direct observation of MEMS device functionality. All tests involved steel structures, with particular interest in propagation of existing cracks or flaws. A series of four laboratory tests were performed on beam specimens fabricated from two segments (Grade 50 steel) with a full penetration weld (E70T-4 electrode material) at midspan. That weld region was notched, an initial fatigue crack was induced, and the specimens were then instrumented with one commercial transducer and with one MEMS device; data was recorded from five individual transducers on the MEMS device. Under a four-point bending test, the beam displayed both inelastic behavior and crack propagation, including load drops associated with crack instability. The MEMS transducers detected all instability events as well as many or most of the acoustic emissions occurring during plasticity and stable crack growth. The MEMS transducers were less sensitive than the commercial transducer, and did not detect as many events, but the normalized cumulative burst count obtained from the MEMS transducers paralleled the count obtained from the commercial transducer. Waveform analysis of signals from the MEMS transducers provided additional information concerning arrivals of P-waves and S-waves. Similarly, the analysis provided additional confirmation that the acoustic emissions emanated from the damage zone near the crack tip, and were not spurious signals or artifacts. Subsequent tests were conducted in a field application where the MEMS transducers were redundant to a group of commercial transducers. The application example is a connection plate in truss bridge construction under passage of heavy traffic loads. The MEMS transducers were found to be functional, but were less sensitive in their present form than existing commercial transducers. We conclude that the transducers are usable in their current configuration and we outline applications for which they are presently suited, and then we discuss alternate MEMS structures that would provide greater sensitivity.
Stability analysis of a time-periodic 2-dof MEMS structure
NASA Astrophysics Data System (ADS)
Kniffka, Till Jochen; Welte, Johannes; Ecker, Horst
2012-11-01
Microelectromechanical systems (MEMS) are becoming important for all kinds of industrial applications. Among them are filters in communication devices, due to the growing demand for efficient and accurate filtering of signals. In recent developments single degree of freedom (1-dof) oscillators, that are operated at a parametric resonances, are employed for such tasks. Typically vibration damping is low in such MEM systems. While parametric excitation (PE) is used so far to take advantage of a parametric resonance, this contribution suggests to also exploit parametric anti-resonances in order to improve the damping behavior of such systems. Modeling aspects of a 2-dof MEM system and first results of the analysis of the non-linear and the linearized system are the focus of this paper. In principle the investigated system is an oscillating mechanical system with two degrees of freedom x = [x1x2]T that can be described by Mx+Cx+K1x+K3(x2)x+Fes(x,V(t)) = 0. The system is inherently non-linear because of the cubic mechanical stiffness K3 of the structure, but also because of electrostatic forces (1+cos(ωt))Fes(x) that act on the system. Electrostatic forces are generated by comb drives and are proportional to the applied time-periodic voltage V(t). These drives also provide the means to introduce time-periodic coefficients, i.e. parametric excitation (1+cos(ωt)) with frequency ω. For a realistic MEM system the coefficients of the non-linear set of differential equations need to be scaled for efficient numerical treatment. The final mathematical model is a set of four non-linear time-periodic homogeneous differential equations of first order. Numerical results are obtained from two different methods. The linearized time-periodic (LTP) system is studied by calculating the Monodromy matrix of the system. The eigenvalues of this matrix decide on the stability of the LTP-system. To study the unabridged non-linear system, the bifurcation software ManLab is employed. Continuation analysis including stability evaluations are executed and show the frequency ranges for which the 2-dof system becomes unstable due to parametric resonances. Moreover, the existence of frequency intervals are shown where enhanced damping for the system is observed for this MEMS. The results from the stability studies are confirmed by simulation results.
Fabrication of 3D Carbon Microelectromechanical Systems (C-MEMS).
Pramanick, Bidhan; Martinez-Chapa, Sergio O; Madou, Marc; Hwang, Hyundoo
2017-06-17
A wide range of carbon sources are available in nature, with a variety of micro-/nanostructure configurations. Here, a novel technique to fabricate long and hollow glassy carbon microfibers derived from human hairs is introduced. The long and hollow carbon structures were made by the pyrolysis of human hair at 900 °C in a N2 atmosphere. The morphology and chemical composition of natural and pyrolyzed human hairs were investigated using scanning electron microscopy (SEM) and electron-dispersive X-ray spectroscopy (EDX), respectively, to estimate the physical and chemical changes due to pyrolysis. Raman spectroscopy was used to confirm the glassy nature of the carbon microstructures. Pyrolyzed hair carbon was introduced to modify screen-printed carbon electrodes ; the modified electrodes were then applied to the electrochemical sensing of dopamine and ascorbic acid. Sensing performance of the modified sensors was improved as compared to the unmodified sensors. To obtain the desired carbon structure design, carbon micro-/nanoelectromechanical system (C-MEMS/C-NEMS) technology was developed. The most common C-MEMS/C-NEMS fabrication process consists of two steps: (i) the patterning of a carbon-rich base material, such as a photosensitive polymer, using photolithography; and (ii) carbonization through the pyrolysis of the patterned polymer in an oxygen-free environment. The C-MEMS/NEMS process has been widely used to develop microelectronic devices for various applications, including in micro-batteries, supercapacitors, glucose sensors, gas sensors, fuel cells, and triboelectric nanogenerators. Here, recent developments of a high-aspect ratio solid and hollow carbon microstructures with SU8 photoresists are discussed. The structural shrinkage during pyrolysis was investigated using confocal microscopy and SEM. Raman spectroscopy was used to confirm the crystallinity of the structure, and the atomic percentage of the elements present in the material before and after pyrolysis was measured using EDX.
Rodgers, M. Steven; Sniegowski, Jeffry J.; Miller, Samuel L.; McWhorter, Paul J.
2000-01-01
A process for forming complex microelectromechanical (MEM) devices having five layers or levels of polysilicon, including four structural polysilicon layers wherein mechanical elements can be formed, and an underlying polysilicon layer forming a voltage reference plane. A particular type of MEM device that can be formed with the five-level polysilicon process is a MEM transmission for controlling or interlocking mechanical power transfer between an electrostatic motor and a self-assembling structure (e.g. a hinged pop-up mirror for use with an incident laser beam). The MEM transmission is based on an incomplete gear train and a bridging set of gears that can be moved into place to complete the gear train to enable power transfer. The MEM transmission has particular applications as a safety component for surety, and for this purpose can incorporate a pin-in-maze discriminator responsive to a coded input signal.
Low voltage driven RF MEMS capacitive switch using reinforcement for reduced buckling
NASA Astrophysics Data System (ADS)
Bansal, Deepak; Bajpai, Anuroop; Kumar, Prem; Kaur, Maninder; Kumar, Amit; Chandran, Achu; Rangra, Kamaljit
2017-02-01
Variation in actuation voltage for RF MEMS switches is observed as a result of stress-generated buckling of MEMS structures. Large voltage driven RF-MEMS switches are a major concern in space bound communication applications. In this paper, we propose a low voltage driven RF MEMS capacitive switch with the introduction of perforations and reinforcement. The performance of the fabricated switch is compared with conventional capacitive RF MEMS switches. The pull-in voltage of the switch is reduced from 70 V to 16.2 V and the magnitude of deformation is reduced from 8 µm to 1 µm. The design of the reinforcement frame enhances the structural stiffness by 46 % without affecting the high frequency response of the switch. The measured isolation and insertion loss of the reinforced switch is more than 20 dB and 0.4 dB over the X band range.
MEMS Reliability Assurance Guidelines for Space Applications
NASA Technical Reports Server (NTRS)
Stark, Brian (Editor)
1999-01-01
This guide is a reference for understanding the various aspects of microelectromechanical systems, or MEMS, with an emphasis on device reliability. Material properties, failure mechanisms, processing techniques, device structures, and packaging techniques common to MEMS are addressed in detail. Design and qualification methodologies provide the reader with the means to develop suitable qualification plans for the insertion of MEMS into the space environment.
NASA Astrophysics Data System (ADS)
Konishi, Toshifumi; Yamane, Daisuke; Matsushima, Takaaki; Masu, Kazuya; Machida, Katsuyuki; Toshiyoshi, Hiroshi
2014-01-01
This paper reports the design and evaluation results of a capacitive CMOS-MEMS sensor that consists of the proposed sensor circuit and a capacitive MEMS device implemented on the circuit. To design a capacitive CMOS-MEMS sensor, a multi-physics simulation of the electromechanical behavior of both the MEMS structure and the sensing LSI was carried out simultaneously. In order to verify the validity of the design, we applied the capacitive CMOS-MEMS sensor to a MEMS accelerometer implemented by the post-CMOS process onto a 0.35-µm CMOS circuit. The experimental results of the CMOS-MEMS accelerometer exhibited good agreement with the simulation results within the input acceleration range between 0.5 and 6 G (1 G = 9.8 m/s2), corresponding to the output voltages between 908.6 and 915.4 mV, respectively. Therefore, we have confirmed that our capacitive CMOS-MEMS sensor and the multi-physics simulation will be beneficial method to realize integrated CMOS-MEMS technology.
DOE Office of Scientific and Technical Information (OSTI.GOV)
SPAHN, OLGA B.; GROSSETETE, GRANT D.; CICH, MICHAEL J.
2003-03-01
Many MEMS-based components require optical monitoring techniques using optoelectronic devices for converting mechanical position information into useful electronic signals. While the constituent piece-parts of such hybrid opto-MEMS components can be separately optimized, the resulting component performance, size, ruggedness and cost are substantially compromised due to assembly and packaging limitations. GaAs MOEMS offers the possibility of monolithically integrating high-performance optoelectronics with simple mechanical structures built in very low-stress epitaxial layers with a resulting component performance determined only by GaAs microfabrication technology limitations. GaAs MOEMS implicitly integrates the capability for radiation-hardened optical communications into the MEMS sensor or actuator component, a vitalmore » step towards rugged integrated autonomous microsystems that sense, act, and communicate. This project establishes a new foundational technology that monolithically combines GaAs optoelectronics with simple mechanics. Critical process issues addressed include selectivity, electrochemical characteristics, and anisotropy of the release chemistry, and post-release drying and coating processes. Several types of devices incorporating this novel technology are demonstrated.« less
NASA Astrophysics Data System (ADS)
Allen, Mark G.; Lang, Jeffrey
2013-11-01
Welcome to this special section of the Journal of Micromechanics and Microengineering (JMM). This section, co-edited by myself and by Professor Jeffrey Lang of the Massachusetts Institute of Technology, contains expanded versions of selected papers presented at the Power MEMS meeting held in Atlanta, GA, USA, in December of 2012. Professor Lang and I had the privilege of co-chairing Power MEMS 2012, the 12th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications. The scope of the PowerMEMS series of workshops ranges from basic principles, to materials and fabrication, to devices and systems, to applications. The many applications of power MEMS (microelectromehcanical systems) range from MEMS-enabled energy harvesting, storage, conversion and conditioning, to integrated systems that manage these processes. Why is the power MEMS field growing in importance? Smaller-scale power and power supplies (microwatts to tens of watts) are gaining in prominence due to many factors, including the ubiquity of low power portable electronic equipment and the proliferation of wireless sensor nodes that require extraction of energy from their embedding environment in order to function. MEMS manufacturing methods can be utilized to improve the performance of traditional power supply elements, such as allowing batteries to charge faster or shrinking the physical size of passive elements in small-scale power supplies. MEMS technologies can be used to fabricate energy harvesters that extract energy from an embedding environment to power wireless sensor nodes, in-body medical implants and other devices, in which the harvesters are on the small scales that are appropriately matched to the overall size of these microsystems. MEMS can enable the manufacturing of energy storage elements from nontraditional materials by bringing appropriate structure and surface morphology to these materials as well as fabricating the electrical interfaces required for their operation and interconnection. Clearly, the marriage of MEMS technologies and energy conversion is a vital application space; and we are pleased to bring you some of the latest results from that space in this special section. Approximately 130 papers were presented at the Power MEMS 2012 conference. From these, the 20 papers you have before you were selected based on paper quality and topical balance. As you can see, papers representing many of the important areas of power MEMS are included: energy harvesters using multiple transduction schemes; MEMS-based fabrication of compact passive elements (inductors, supercapacitors, transformers); MEMS-enabled power diagnostics; MEMS-based batteries; and low power circuitry adapted to interfacing MEMS-based harvesters to overall systems. All of the papers you will read in this special section comprise substantial expansion from the proceedings articles and were reviewed through JMM's normal reviewing process. Both Professor Lang and I hope that you will share our enthusiasm for the field of power MEMS and that you will find this special section of JMM exciting, interesting and useful. Sincerely, Mark G Allen
Betavoltaic device in por-SiC/Si C-Nuclear Energy Converter
NASA Astrophysics Data System (ADS)
Akimchenko, Alina; Chepurnov, Victor; Dolgopolov, Mikhail; Gurskaya, Albina; Kuznetsov, Oleg; Mashnin, Alikhan; Radenko, Vitaliy; Radenko, Alexander; Surnin, Oleg; Zanin, George
2017-10-01
The miniature and low-power devices with long service life in hard operating conditions like the Carbon-14 beta-decay energy converters indeed as eternal resource for integrated MEMS and NEMS are considered. Authors discuss how to create the power supply for MEMS/NEMS devices, based on porous SiC/Si structure, which are tested to be used as the beta-decay energy converters of radioactive C-14 into electrical energy. This is based on the silicon carbide obtaining by self-organizing mono 3C-SiC endotaxy on the Si substrate. The new idea is the C-14 atoms including in molecules in the silicon carbide porous structure by this technology, which will increase the efficiency of the converter due to the greater intensity of electron-hole pairs generation rate in the space charge region. The synthesis of C-14 can be also performed by using the electronically controlled magneto-optic chamber.
Advancing MEMS Technology Usage through the MUMPS (Multi-User MEMS Processes) Program
NASA Technical Reports Server (NTRS)
Koester, D. A.; Markus, K. W.; Dhuler, V.; Mahadevan, R.; Cowen, A.
1995-01-01
In order to help provide access to advanced micro-electro-mechanical systems (MEMS) technologies and lower the barriers for both industry and academia, the Microelectronic Center of North Carolina (MCNC) and ARPA have developed a program which provides users with access to both MEMS processes and advanced electronic integration techniques. The four distinct aspects of this program, the multi-user MEMS processes (MUMP's), the consolidated micro-mechanical element library, smart MEMS, and the MEMS technology network are described in this paper. MUMP's is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. It is both a proof-of-concept and educational tool that aids in the development of MEMS in the domestic community. MUMP's technologies currently include a 3-layer poly-silicon surface micromachining process and LIGA (lithography, electroforming, and injection molding) processes that provide reasonable design flexibility within set guidelines. The consolidated micromechanical element library (CaMEL) is a library of active and passive MEMS structures that can be downloaded by the MEMS community via the internet. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology. The MEMS technology network (TechNet) is a menu of standard substrates and MEMS fabrication processes that can be purchased and combined to create unique process flows. TechNet provides the MEMS community greater flexibility and enhanced technology accessibility.
Thermoelectric microdevice fabricated by a MEMS-like electrochemical process
NASA Technical Reports Server (NTRS)
Snyder, G. Jeffrey; Lim, James R.; Huang, Chen-Kuo; Fleurial, Jean-Pierre
2003-01-01
Microelectromechanical systems (MEMS) are the basis of many rapidly growing technologies, because they combine miniature sensors and actuators with communications and electronics at low cost. Commercial MEMS fabrication processes are limited to silicon-based materials or two-dimensional structures. Here we show an inexpensive, electrochemical technique to build MEMS-like structures that contain several different metals and semiconductors with three-dimensional bridging structures. We demonstrate this technique by building a working microthermoelectric device. Using repeated exposure and development of multiple photoresist layers, several different metals and thermoelectric materials are fabricated in a three-dimensional structure. A device containing 126 n-type and p-type (Bi, Sb)2Te3 thermoelectric elements, 20 microm tall and 60 microm in diameter with bridging metal interconnects, was fabricated and cooling demonstrated. Such a device should be of technological importance for precise thermal control when operating as a cooler, and for portable power when operating as a micro power generator.
Characterization of assembled MEMS
NASA Astrophysics Data System (ADS)
Jandric, Zoran; Randall, John N.; Saini, Rahul; Nolan, Michael; Skidmore, George
2004-12-01
Zyvex is developing a low-cost high-precision method for manufacturing MEMS-based three-dimensional structures/assemblies. The assembly process relies on compliant properties of the interconnecting components. The sockets and connectors are designed to benefit from their compliant nature by allowing the mechanical component to self-align, i.e. reposition themselves to their designed, stable position, independent of the initial placement of the part by the external robot. Thus, the self-aligning property guarantees the precision of the assembled structure to be very close to, or the same, as the precision of the lithography process itself. A three-dimensional (3D) structure is achieved by inserting the connectors into the sockets through the use of a passive end-effector. We have developed the automated, high-yield, assembly procedure which permits connectors to be picked up from any location within the same die, or a separate die. This general procedure allows for the possibility to assemble parts of dissimilar materials. We have built many 3D MEMS structures, including several 3D MEMS devices such as a scanning electron microscope (SEM) micro column, mass-spectrometer column, variable optical attenuator. For these 3D MEMS structures we characterize their mechanical strength through finite element simulation, dynamic properties by finite-element analysis and experimentally with UMECH"s MEMS motion analyzer (MMA), alignment accuracy by using an in-house developed dihedral angle measurement laser autocollimator, and impact properties by performing drop tests. The details of the experimental set-ups, the measurement procedures, and the experimental data are presented in this paper.
Characterization of assembled MEMS
NASA Astrophysics Data System (ADS)
Jandric, Zoran; Randall, John N.; Saini, Rahul; Nolan, Michael; Skidmore, George
2005-01-01
Zyvex is developing a low-cost high-precision method for manufacturing MEMS-based three-dimensional structures/assemblies. The assembly process relies on compliant properties of the interconnecting components. The sockets and connectors are designed to benefit from their compliant nature by allowing the mechanical component to self-align, i.e. reposition themselves to their designed, stable position, independent of the initial placement of the part by the external robot. Thus, the self-aligning property guarantees the precision of the assembled structure to be very close to, or the same, as the precision of the lithography process itself. A three-dimensional (3D) structure is achieved by inserting the connectors into the sockets through the use of a passive end-effector. We have developed the automated, high-yield, assembly procedure which permits connectors to be picked up from any location within the same die, or a separate die. This general procedure allows for the possibility to assemble parts of dissimilar materials. We have built many 3D MEMS structures, including several 3D MEMS devices such as a scanning electron microscope (SEM) micro column, mass-spectrometer column, variable optical attenuator. For these 3D MEMS structures we characterize their mechanical strength through finite element simulation, dynamic properties by finite-element analysis and experimentally with UMECH"s MEMS motion analyzer (MMA), alignment accuracy by using an in-house developed dihedral angle measurement laser autocollimator, and impact properties by performing drop tests. The details of the experimental set-ups, the measurement procedures, and the experimental data are presented in this paper.
DOT National Transportation Integrated Search
2011-06-01
Micro-electromechanical systems (MEMS) provide vast improvements over existing sensing methods in the context of structural health monitoring (SHM) of highway infrastructure systems, including improved system reliability, improved longevity and enhan...
A review: aluminum nitride MEMS contour-mode resonator
NASA Astrophysics Data System (ADS)
Yunhong, Hou; Meng, Zhang; Guowei, Han; Chaowei, Si; Yongmei, Zhao; Jin, Ning
2016-10-01
Over the past several decades, the technology of micro-electromechanical system (MEMS) has advanced. A clear need of miniaturization and integration of electronics components has had new solutions for the next generation of wireless communications. The aluminum nitride (AlN) MEMS contour-mode resonator (CMR) has emerged and become promising and competitive due to the advantages of the small size, high quality factor and frequency, low resistance, compatibility with integrated circuit (IC) technology, and the ability of integrating multi-frequency devices on a single chip. In this article, a comprehensive review of AlN MEMS CMR technology will be presented, including its basic working principle, main structures, fabrication processes, and methods of performance optimization. Among these, the deposition and etching process of the AlN film will be specially emphasized and recent advances in various performance optimization methods of the CMR will be given through specific examples which are mainly focused on temperature compensation and reducing anchor losses. This review will conclude with an assessment of the challenges and future trends of the CMR. Project supported by National Natural Science Foundation (Nos. 61274001, 61234007, 61504130), the Nurturing and Development Special Projects of Beijing Science and Technology Innovation Base's Financial Support (No. Z131103002813070), and the National Defense Science and Technology Innovation Fund of CAS (No. CXJJ-14-M32).
Controlling Variable Emittance (MEMS) Coatings for Space Applications
NASA Technical Reports Server (NTRS)
Farrar, D.; Schneider, W.; Osiander, R.; Champion, J. L.; Darrin, A. G.; Douglas, Donya; Swanson, Ted D.
2003-01-01
Small spacecraft, including micro and nanosats, as they are envisioned for future missions, will require an alternative means to achieve thermal control due to their small power and mass budgets. One of the proposed alternatives is Variable Emittance (Vari-E) Coatings for spacecraft radiators. Space Technology-5 (ST-5) is a technology demonstration mission through NASA Goddard Space Flight Center (GSFC) that will utilize Vari-E Coatings. This mission involves a constellation of three (3) satellites in a highly elliptical orbit with a perigee altitude of approximately 200 kilometers and an apogee of approximately 38,000 kilometers. Such an environment will expose the spacecraft to a wide swing in the thermal and radiation environment of the earth's atmosphere. There are three (3) different technologies associated with this mission. The three technologies are electrophoretic, electrochromic, and Micro ElectroMechanical Systems (MEMS). The ultimate goal is to make use of Van-E coatings, in order to achieve various levels of thermal control. The focus of this paper is to highlight the Vari-E Coating MEMS instrument, with an emphasis on the Electronic Control Unit responsible for operating the MEMS device. The Test & Evaluation approach, along with the results, is specific for application on ST-5, yet the information provides a guideline for future experiments and/or thermal applications on the exterior structure of a spacecraft.
A MEMS torsion magnetic sensor with reflective blazed grating integration
NASA Astrophysics Data System (ADS)
Long, Liang; Zhong, Shaolong
2016-07-01
A novel magnetic sensor based on a permanent magnet and blazed grating is presented in this paper. The magnetic field is detected by measuring the diffracted wavelength of the blazed grating which is changed by the torsion motion of a torsion sensitive micro-electromechanical system (MEMS) structure with a permanent magnet attached. A V-shape grating structure is obtained by wet etching on a (1 0 0) SOI substrate. When the magnet is magnetized in different directions, the in-plane or out-of-plane magnetic field is detected by a sensor. The MEMS magnetic sensor with a permanent magnet is fabricated after analytical design and bulk micromachining processes. The magnetic-sensing capability of the sensor is tested by fiber-optic detection system. The result shows the sensitivities of the in-plane and out-of-plane magnetic fields are 3.6 pm μT-1 and 5.7 pm μT-1, respectively. Due to utilization of the permanent magnet and fiber-optic detection, the sensor shows excellent capability of covering the high-resolution detection of low-frequency signals. In addition, the sensitive direction of the magnetic sensor can be easily switched by varying the magnetized direction of the permanent magnet, which offers a simple way to achieve tri-axis magnetic sensor application.
TOPICAL REVIEW: Self-assembly from milli- to nanoscales: methods and applications
NASA Astrophysics Data System (ADS)
Mastrangeli, M.; Abbasi, S.; Varel, C.; Van Hoof, C.; Celis, J.-P.; Böhringer, K. F.
2009-08-01
The design and fabrication techniques for microelectromechanical systems (MEMS) and nanodevices are progressing rapidly. However, due to material and process flow incompatibilities in the fabrication of sensors, actuators and electronic circuitry, a final packaging step is often necessary to integrate all components of a heterogeneous microsystem on a common substrate. Robotic pick-and-place, although accurate and reliable at larger scales, is a serial process that downscales unfavorably due to stiction problems, fragility and sheer number of components. Self-assembly, on the other hand, is parallel and can be used for device sizes ranging from millimeters to nanometers. In this review, the state-of-the-art in methods and applications for self-assembly is reviewed. Methods for assembling three-dimensional (3D) MEMS structures out of two-dimensional (2D) ones are described. The use of capillary forces for folding 2D plates into 3D structures, as well as assembling parts onto a common substrate or aggregating parts to each other into 2D or 3D structures, is discussed. Shape matching and guided assembly by magnetic forces and electric fields are also reviewed. Finally, colloidal self-assembly and DNA-based self-assembly, mainly used at the nanoscale, are surveyed, and aspects of theoretical modeling of stochastic assembly processes are discussed.
Self-assembly from milli- to nanoscales: methods and applications
Mastrangeli, M; Abbasi, S; Varel, C; Van Hoof, C; Celis, J-P; Böhringer, K F
2009-01-01
The design and fabrication techniques for microelectromechanical systems (MEMS) and nanodevices are progressing rapidly. However, due to material and process flow incompatibilities in the fabrication of sensors, actuators and electronic circuitry, a final packaging step is often necessary to integrate all components of a heterogeneous microsystem on a common substrate. Robotic pick-and-place, although accurate and reliable at larger scales, is a serial process that downscales unfavorably due to stiction problems, fragility and sheer number of components. Self-assembly, on the other hand, is parallel and can be used for device sizes ranging from millimeters to nanometers. In this review, the state-of-the-art in methods and applications for self-assembly is reviewed. Methods for assembling three-dimensional (3D) MEMS structures out of two-dimensional (2D) ones are described. The use of capillary forces for folding 2D plates into 3D structures, as well as assembling parts onto a common substrate or aggregating parts to each other into 2D or 3D structures, is discussed. Shape matching and guided assembly by magnetic forces and electric fields are also reviewed. Finally, colloidal self-assembly and DNA-based self-assembly, mainly used at the nanoscale, are surveyed, and aspects of theoretical modeling of stochastic assembly processes are discussed. PMID:20209016
Gruen, Dieter M [Downers Grove, IL; Busmann, Hans-Gerd [Bremen, DE; Meyer, Eva-Maria [Bremen, DE; Auciello, Orlando [Bolingbrook, IL; Krauss, Alan R [late of Naperville, IL; Krauss, Julie R [Naperville, IL
2004-11-02
MEMS structure and a method of fabricating them from ultrananocrystalline diamond films having average grain sizes of less than about 10 nm and feature resolution of less than about one micron . The MEMS structures are made by contacting carbon dimer species with an oxide substrate forming a carbide layer on the surface onto which ultrananocrystalline diamond having average grain sizes of less than about 10 nm is deposited. Thereafter, microfabrication process are used to form a structure of predetermined shape having a feature resolution of less than about one micron.
Design and simulation of MEMS vector hydrophone with reduced cross section based meander beams
DOE Office of Scientific and Technical Information (OSTI.GOV)
Kumar, Manoj; Dutta, S.; Pal, Ramjay
MEMS based vector hydrophone is being one of the key device in the underwater communications. In this paper, we presented a bio-inspired MEMS vector hydrophone. The hydrophone structure consists of a proof mass suspended by four meander type beams with reduced cross-section. Modal patterns of the structure were studied. First three modal frequencies of the hydrophone structure were found to be 420 Hz, 420 Hz and 1646 Hz respectively. The deflection and stress of the hydrophone is found have linear behavior in the 1 µPa – 1Pa pressure range.
NASA Astrophysics Data System (ADS)
Vescovo, P.; Joseph, E.; Bourbon, G.; Le Moal, P.; Minotti, P.; Hibert, C.; Pont, G.
2003-09-01
This paper focuses on recent advances in the field of MEMS-based actuators and distributed microelectromechanical systems (MEMS). IC-processed actuators (e.g. actuators that are machined using integrated circuit batch processes) are expected to open a wide range of industrial applications on the near term. The most promising investigations deal with high-aspect ratio electric field driven microactuators suitable for use in numerous technical fields such as aeronautics and space industry. Because the silicon micromachining technology have the potential to integrate both mechanical components and control circuits within a single process, MEMS-based active control of microscopic and macroscopic structures appears to be one of the most promising challenges for the next decade. As a first step towards new generations of MEMS-based smart structures, recent investigations dealing with silicon mechanisms involving MEMS-based actuators are briefly discussed in this paper.
Development of Testing Methodologies for the Mechanical Properties of MEMS
NASA Technical Reports Server (NTRS)
Ekwaro-Osire, Stephen
2003-01-01
This effort is to investigate and design testing strategies to determine the mechanical properties of MicroElectroMechanical Systems (MEMS) as well as investigate the development of a MEMS Probabilistic Design Methodology (PDM). One item of potential interest is the design of a test for the Weibull size effect in pressure membranes. The Weibull size effect is a consequence of a stochastic strength response predicted from the Weibull distribution. Confirming that MEMS strength is controlled by the Weibull distribution will enable the development of a probabilistic design methodology for MEMS - similar to the GRC developed CARES/Life program for bulk ceramics. However, the primary area of investigation will most likely be analysis and modeling of material interfaces for strength as well as developing a strategy to handle stress singularities at sharp corners, filets, and material interfaces. This will be a continuation of the previous years work. The ultimate objective of this effort is to further develop and verify the ability of the Ceramics Analysis and Reliability Evaluation of Structures Life (CARES/Life) code to predict the time-dependent reliability of MEMS structures subjected to multiple transient loads.
Application of Micro-Electro-Mechanical Sensors Contactless NDT of Concrete Structures.
Ham, Suyun; Popovics, John S
2015-04-17
The utility of micro-electro-mechanical sensors (MEMS) for application in air-coupled (contactless or noncontact) sensing to concrete nondestructive testing (NDT) is studied in this paper. The fundamental operation and characteristics of MEMS are first described. Then application of MEMS sensors toward established concrete test methods, including vibration resonance, impact-echo, ultrasonic surface wave, and multi-channel analysis of surface waves (MASW), is demonstrated. In each test application, the performance of MEMS is compared with conventional contactless and contact sensing technology. Favorable performance of the MEMS sensors demonstrates the potential of the technology for applied contactless NDT efforts. To illustrate the utility of air-coupled MEMS sensors for concrete NDT, as compared with conventional sensor technology.
NASA Astrophysics Data System (ADS)
Cicek, Paul-Vahe; Elsayed, Mohannad; Nabki, Frederic; El-Gamal, Mourad
2017-11-01
An above-IC compatible multi-level MEMS surface microfabrication technology based on a silicon carbide structural layer is presented. The fabrication process flow provides optimal electrostatic transduction by allowing the creation of independently controlled submicron vertical and lateral gaps without the need for high resolution lithography. Adopting silicon carbide as the structural material, the technology ensures material, chemical and thermal compatibility with modern semiconductor nodes, reporting the lowest peak processing temperature (i.e. 200 °C) of all comparable works. This makes this process ideally suited for integrating capacitive-based MEMS directly above standard CMOS substrates. Process flow design and optimization are presented in the context of bulk-mode disk resonators, devices that are shown to exhibit improved performance with respect to previous generation flexural beam resonators, and that represent relatively complex MEMS structures. The impact of impending improvements to the fabrication technology is discussed.
New dynamic silicon photonic components enabled by MEMS technology
NASA Astrophysics Data System (ADS)
Errando-Herranz, Carlos; Edinger, Pierre; Colangelo, Marco; Björk, Joel; Ahmed, Samy; Stemme, Göran; Niklaus, Frank; Gylfason, Kristinn B.
2018-02-01
Silicon photonics is the study and application of integrated optical systems which use silicon as an optical medium, usually by confining light in optical waveguides etched into the surface of silicon-on-insulator (SOI) wafers. The term microelectromechanical systems (MEMS) refers to the technology of mechanics on the microscale actuated by electrostatic actuators. Due to the low power requirements of electrostatic actuation, MEMS components are very power efficient, making them well suited for dense integration and mobile operation. MEMS components are conventionally also implemented in silicon, and MEMS sensors such as accelerometers, gyros, and microphones are now standard in every smartphone. By combining these two successful technologies, new active photonic components with extremely low power consumption can be made. We discuss our recent experimental work on tunable filters, tunable fiber-to-chip couplers, and dynamic waveguide dispersion tuning, enabled by the marriage of silicon MEMS and silicon photonics.
Akahane, M; Shimizu, T; Kira, T; Onishi, T; Uchihara, Y; Imamura, T; Tanaka, Y
2016-11-01
To assess the structure and extracellular matrix molecule expression of osteogenic cell sheets created via culture in medium with both dexamethasone (Dex) and ascorbic acid phosphate (AscP) compared either Dex or AscP alone. Osteogenic cell sheets were prepared by culturing rat bone marrow stromal cells in a minimal essential medium (MEM), MEM with AscP, MEM with Dex, and MEM with Dex and AscP (Dex/AscP). The cell number and messenger (m)RNA expression were assessed in vitro, and the appearance of the cell sheets was observed after mechanical retrieval using a scraper. β-tricalcium phosphate (β-TCP) was then wrapped with the cell sheets from the four different groups and subcutaneously implanted into rats. After mechanical retrieval, the osteogenic cell sheets from the MEM, MEM with AscP, and MEM with Dex groups appeared to be fragmented or incomplete structures. The cell sheets cultured with Dex/AscP remained intact after mechanical retrieval, without any identifiable tears. Culture with Dex/AscP increased the mRNA and protein expression of extracellular matrix proteins and cell number compared with those of the other three groups. More bridging bone formation was observed after transplantation of the β-TCP scaffold wrapped with cell sheets cultured with Dex/AscP, than in the other groups. These results suggest that culture with Dex/AscP improves the mechanical integrity of the osteogenic cell sheets, allowing retrieval of the confluent cells in a single cell sheet structure. This method may be beneficial when applied in cases of difficult tissue reconstruction, such as nonunion, bone defects, and osteonecrosis.Cite this article: M. Akahane, T. Shimizu, T. Kira, T. Onishi, Y. Uchihara, T. Imamura, Y. Tanaka. Culturing bone marrow cells with dexamethasone and ascorbic acid improves osteogenic cell sheet structure. Bone Joint Res 2016;5:569-576. DOI: 10.1302/2046-3758.511.BJR-2016-0013.R1. © 2016 Akahane et al.
Development of Probabilistic Life Prediction Methodologies and Testing Strategies for MEMS and CMC's
NASA Technical Reports Server (NTRS)
Jadaan, Osama
2003-01-01
This effort is to investigate probabilistic life prediction methodologies for ceramic matrix composites and MicroElectroMechanical Systems (MEMS) and to analyze designs that determine stochastic properties of MEMS. For CMC's this includes a brief literature survey regarding lifing methodologies. Also of interest for MEMS is the design of a proper test for the Weibull size effect in thin film (bulge test) specimens. The Weibull size effect is a consequence of a stochastic strength response predicted from the Weibull distribution. Confirming that MEMS strength is controlled by the Weibull distribution will enable the development of a probabilistic design methodology for MEMS - similar to the GRC developed CARES/Life program for bulk ceramics. A main objective of this effort is to further develop and verify the ability of the Ceramics Analysis and Reliability Evaluation of Structures/Life (CARES/Life) code to predict the time-dependent reliability of MEMS structures subjected to multiple transient loads. A second set of objectives is to determine the applicability/suitability of the CARES/Life methodology for CMC analysis, what changes would be needed to the methodology and software, and if feasible, run a demonstration problem. Also important is an evaluation of CARES/Life coupled to the ANSYS Probabilistic Design System (PDS) and the potential of coupling transient reliability analysis to the ANSYS PDS.
NASA Astrophysics Data System (ADS)
Zhang, Fengtian; Wang, Chao; Yuan, Mingquan; Tang, Bin; Xiong, Zhuang
2017-12-01
Most of the MEMS inertial switches developed in recent years are intended for shock and impact sensing with a threshold value above 50 g. In order to follow the requirement of detecting linear acceleration signal at low-g level, a silicon based MEMS inertial switch with a threshold value of 5 g was designed, fabricated and characterized. The switch consisted of a large proof mass, supported by circular spiral springs. An analytical model of the structure stiffness of the proposed switch was derived and verified by finite-element simulation. The structure fabrication was based on a customized double-buried layer silicon-on-insulator wafer and encapsulated by glass wafers. The centrifugal experiment and nanoindentation experiment were performed to measure the threshold value as well as the structure stiffness. The actual threshold values were measured to be 0.1-0.3 g lower than the pre-designed value of 5 g due to the dimension loss during non-contact lithography processing. Concerning the reliability assessment, a series of environmental experiments were conducted and the switches remained operational without excessive errors. However, both the random vibration and the shock tests indicate that the metal particles generated during collision of contact parts might affect the contact reliability and long-time stability. According to the conclusion reached in this report, an attentive study on switch contact behavior should be included in future research.
Nano/micro-electro mechanical systems: a patent view
NASA Astrophysics Data System (ADS)
Hu, Guangyuan; Liu, Weishu
2015-12-01
Combining both bibliometrics and citation network analysis, this research evaluates the global development of micro-electro mechanical systems (MEMS) research based on the Derwent Innovations Index database. We found that worldwide, the growth trajectory of MEMS patents demonstrates an approximate S shape, with United States, Japan, China, and Korea leading the global MEMS race. Evidenced by Derwent class codes, the technology structure of global MEMS patents remains steady over time. Yet there does exist a national competitiveness component among the top country players. The latecomer China has become the second most prolific country filing MEMS patents, but its patent quality still lags behind the global average.
NASA Astrophysics Data System (ADS)
Schifferle, Andreas; Dommann, Alex; Neels, Antonia
2017-12-01
New methods are needed in microsystems technology for evaluating microelectromechanical systems (MEMS) because of their reduced size. The assessment and characterization of mechanical and structural relations of MEMS are essential to assure the long-term functioning of devices, and have a significant impact on design and fabrication.
Construction and Initial Validation of the Multiracial Experiences Measure (MEM)
Yoo, Hyung Chol; Jackson, Kelly; Guevarra, Rudy P.; Miller, Matthew J.; Harrington, Blair
2015-01-01
This article describes the development and validation of the Multiracial Experiences Measure (MEM): a new measure that assesses uniquely racialized risks and resiliencies experienced by individuals of mixed racial heritage. Across two studies, there was evidence for the validation of the 25-item MEM with 5 subscales including Shifting Expressions, Perceived Racial Ambiguity, Creating Third Space, Multicultural Engagement, and Multiracial Discrimination. The 5-subscale structure of the MEM was supported by a combination of exploratory and confirmatory factor analyses. Evidence of criterion-related validity was partially supported with MEM subscales correlating with measures of racial diversity in one’s social network, color-blind racial attitude, psychological distress, and identity conflict. Evidence of discriminant validity was supported with MEM subscales not correlating with impression management. Implications for future research and suggestions for utilization of the MEM in clinical practice with multiracial adults are discussed. PMID:26460977
Construction and initial validation of the Multiracial Experiences Measure (MEM).
Yoo, Hyung Chol; Jackson, Kelly F; Guevarra, Rudy P; Miller, Matthew J; Harrington, Blair
2016-03-01
This article describes the development and validation of the Multiracial Experiences Measure (MEM): a new measure that assesses uniquely racialized risks and resiliencies experienced by individuals of mixed racial heritage. Across 2 studies, there was evidence for the validation of the 25-item MEM with 5 subscales including Shifting Expressions, Perceived Racial Ambiguity, Creating Third Space, Multicultural Engagement, and Multiracial Discrimination. The 5-subscale structure of the MEM was supported by a combination of exploratory and confirmatory factor analyses. Evidence of criterion-related validity was partially supported with MEM subscales correlating with measures of racial diversity in one's social network, color-blind racial attitude, psychological distress, and identity conflict. Evidence of discriminant validity was supported with MEM subscales not correlating with impression management. Implications for future research and suggestions for utilization of the MEM in clinical practice with multiracial adults are discussed. (c) 2016 APA, all rights reserved).
NASA Technical Reports Server (NTRS)
Lewicki, David George; Lambert, Nicholas A.; Wagoner, Robert S.
2015-01-01
The diagnostics capability of micro-electro-mechanical systems (MEMS) based rotating accelerometer sensors in detecting gear tooth crack failures in helicopter main-rotor transmissions was evaluated. MEMS sensors were installed on a pre-notched OH-58C spiral-bevel pinion gear. Endurance tests were performed and the gear was run to tooth fracture failure. Results from the MEMS sensor were compared to conventional accelerometers mounted on the transmission housing. Most of the four stationary accelerometers mounted on the gear box housing and most of the CI's used gave indications of failure at the end of the test. The MEMS system performed well and lasted the entire test. All MEMS accelerometers gave an indication of failure at the end of the test. The MEMS systems performed as well, if not better, than the stationary accelerometers mounted on the gear box housing with regards to gear tooth fault detection. For both the MEMS sensors and stationary sensors, the fault detection time was not much sooner than the actual tooth fracture time. The MEMS sensor spectrum data showed large first order shaft frequency sidebands due to the measurement rotating frame of reference. The method of constructing a pseudo tach signal from periodic characteristics of the vibration data was successful in deriving a TSA signal without an actual tach and proved as an effective way to improve fault detection for the MEMS.
Stability, Nonlinearity and Reliability of Electrostatically Actuated MEMS Devices
Zhang, Wen-Ming; Meng, Guang; Chen, Di
2007-01-01
Electrostatic micro-electro-mechanical system (MEMS) is a special branch with a wide range of applications in sensing and actuating devices in MEMS. This paper provides a survey and analysis of the electrostatic force of importance in MEMS, its physical model, scaling effect, stability, nonlinearity and reliability in detail. It is necessary to understand the effects of electrostatic forces in MEMS and then many phenomena of practical importance, such as pull-in instability and the effects of effective stiffness, dielectric charging, stress gradient, temperature on the pull-in voltage, nonlinear dynamic effects and reliability due to electrostatic forces occurred in MEMS can be explained scientifically, and consequently the great potential of MEMS technology could be explored effectively and utilized optimally. A simplified parallel-plate capacitor model is proposed to investigate the resonance response, inherent nonlinearity, stiffness softened effect and coupled nonlinear effect of the typical electrostatically actuated MEMS devices. Many failure modes and mechanisms and various methods and techniques, including materials selection, reasonable design and extending the controllable travel range used to analyze and reduce the failures are discussed in the electrostatically actuated MEMS devices. Numerical simulations and discussions indicate that the effects of instability, nonlinear characteristics and reliability subjected to electrostatic forces cannot be ignored and are in need of further investigation.
Gas detection with microelectromechanical Fabry-Perot interferometer technology in cell phone
NASA Astrophysics Data System (ADS)
Mannila, Rami; Hyypiö, Risto; Korkalainen, Marko; Blomberg, Martti; Kattelus, Hannu; Rissanen, Anna
2015-06-01
VTT Technical Research Centre of Finland has developed a miniaturized optical sensor for gas detection in a cell phone. The sensor is based on a microelectromechanical (MEMS) Fabry-Perot interferometer, which is a structure with two highly reflective surfaces separated by a tunable air gap. The MEMS FPI is a monolithic device, i.e. it is made entirely on one substrate in a batch process, without assembling separate pieces together. The gap is adjusted by moving the upper mirror with electrostatic force, so there are no actual moving parts. VTT has designed and manufactured a MEMS FPI based carbon dioxide sensor demonstrator which is integrated to a cell phone shield cover. The demonstrator contains light source, gas cell, MEMS FPI, detector, control electronics and two coin cell batteries as a power source. It is connected to the cell phone by Bluetooth. By adjusting the wavelength range and customizing the MEMS FPI structure, it is possible to selectively sense multiple gases.
NASA Technical Reports Server (NTRS)
Nemeth, Noel N.
2002-01-01
Brittle materials are being used, or considered, for a wide variety of high tech applications that operate in harsh environments, including static and rotating turbine parts. thermal protection systems, dental prosthetics, fuel cells, oxygen transport membranes, radomes, and MEMS. Designing components to sustain repeated load without fracturing while using the minimum amount of material requires the use of a probabilistic design methodology. The CARES/Life code provides a general-purpose analysis tool that predicts the probability of failure of a ceramic component as a function of its time in service. For this presentation an interview of the CARES/Life program will be provided. Emphasis will be placed on describing the latest enhancements to the code for reliability analysis with time varying loads and temperatures (fully transient reliability analysis). Also, early efforts in investigating the validity of using Weibull statistics, the basis of the CARES/Life program, to characterize the strength of MEMS structures will be described as as well as the version of CARES/Life for MEMS (CARES/MEMS) being prepared which incorporates single crystal and edge flaw reliability analysis capability. It is hoped this talk will open a dialog for potential collaboration in the area of MEMS testing and life prediction.
NASA Astrophysics Data System (ADS)
Lei, Hong; Jiang, Jimin; Yang, Bin; Zhao, Yan; Zhang, Hongwei; Wang, Weixian; Dong, Guiwen
2018-04-01
Mathematical simulation is an effective tool to analyze the fluid flow and the inclusion behavior in the bloom continuous caster with mold electromagnetic stirring (M-EMS). The mathematical model is applied to the modeling of magnetic field, flow field, and inclusion field. Due to the introduction of Archimedes force, the collision mechanism and inclusion's slipping velocity should be modified in the inclusion mass and population conservation model. Numerically predicted magnetic field, flow field, and the inclusion spatial distribution conform to the experimental results in the existing literature. Lorentz force plays an important role in the fluid flow, and Archimedes force plays an important role in the inclusion distribution in the continuous caster. Due to Brownian collision, Stokes collision, Archimedes collision, and turbulent collision, the coalescence among inclusions occurs in the bloom continuous caster with M-EMS. Among the four types of collisions, turbulent collision occurs most frequently, followed by Archimedes collision and Stokes collision. The frequency of Brownian collision is several orders of magnitudes smaller and is therefore negligible. The inclusion volume concentration, number density, and characteristic radius exhibit a U-shape in the continuous caster without M-EMS. However, with M-EMS, they exhibit an inverted U-shape.
Thermally-induced voltage alteration for analysis of microelectromechanical devices
Walraven, Jeremy A.; Cole, Jr., Edward I.
2002-01-01
A thermally-induced voltage alteration (TIVA) apparatus and method are disclosed for analyzing a microelectromechanical (MEM) device with or without on-board integrated circuitry. One embodiment of the TIVA apparatus uses constant-current biasing of the MEM device while scanning a focused laser beam over electrically-active members therein to produce localized heating which alters the power demand of the MEM device and thereby changes the voltage of the constant-current source. This changing voltage of the constant-current source can be measured and used in combination with the position of the focused and scanned laser beam to generate an image of any short-circuit defects in the MEM device (e.g. due to stiction or fabrication defects). In another embodiment of the TIVA apparatus, an image can be generated directly from a thermoelectric potential produced by localized laser heating at the location of any short-circuit defects in the MEM device, without any need for supplying power to the MEM device. The TIVA apparatus can be formed, in part, from a scanning optical microscope, and has applications for qualification testing or failure analysis of MEM devices.
Thuau, Damien; Abbas, Mamatimin; Wantz, Guillaume; Hirsch, Lionel; Dufour, Isabelle; Ayela, Cédric
2016-01-01
The growth of micro electro-mechanical system (MEMS) based sensors on the electronic market is forecast to be invigorated soon by the development of a new branch of MEMS-based sensors made of organic materials. Organic MEMS have the potential to revolutionize sensor products due to their light weight, low-cost and mechanical flexibility. However, their sensitivity and stability in comparison to inorganic MEMS-based sensors have been the major concerns. In the present work, an organic MEMS sensor with a cutting-edge electro-mechanical transducer based on an active organic field effect transistor (OFET) has been demonstrated. Using poly(vinylidenefluoride/trifluoroethylene) (P(VDF-TrFE)) piezoelectric polymer as active gate dielectric in the transistor mounted on a polymeric micro-cantilever, unique electro-mechanical properties were observed. Such an advanced scheme enables highly efficient integrated electro-mechanical transduction for physical and chemical sensing applications. Record relative sensitivity over 600 in the low strain regime (<0.3%) was demonstrated, which represents a key-step for the development of highly sensitive all organic MEMS-based sensors. PMID:27924853
Use of thermal cycling to reduce adhesion of OTS coated coated MEMS cantilevers
NASA Astrophysics Data System (ADS)
Ali, Shaikh M.; Phinney, Leslie M.
2003-01-01
°Microelectromechanical systems (MEMS) have enormous potential to contribute in diverse fields such as automotive, health care, aerospace, consumer products, and biotechnology, but successful commercial applications of MEMS are still small in number. Reliability of MEMS is a major impediment to the commercialization of laboratory prototypes. Due to the multitude of MEMS applications and the numerous processing and packaging steps, MEMS are exposed to a variety of environmental conditions, making the prediction of operational reliability difficult. In this paper, we investigate the effects of operating temperature on the in-use adhesive failure of electrostatically actuated MEMS microcantilevers coated with octadecyltrichlorosilane (OTS) films. The cantilevers are subjected to repeated temperature cycles and electrostatically actuated at temperatures between 25°C and 300°C in ambient air. The experimental results indicate that temperature cycling of the OTS coated cantilevers in air reduces the sticking probability of the microcantilevers. The sticking probability of OTS coated cantilevers was highest during heating, which decreased during cooling, and was lowest during reheating. Modifications to the OTS release method to increase its yield are also discussed.
MEMS closed-loop control incorporating a memristor as feedback sensing element
DOE Office of Scientific and Technical Information (OSTI.GOV)
Garcia, Ernest J.; Almeida, Sergio F.; Mireles, Jr., Jose
In this work the integration of a memristor with a MEMS parallel plate capacitor coupled by an amplification stage is simulated. It is shown that the MEMS upper plate position can be controlled up to 95% of the total gap. Due to its common operation principle, the change in the MEMS plate position can be interpreted by the change in the memristor resistance, or memristance. A memristance modulation of ~1 KΩ was observed. A polynomial expression representing the MEMS upper plate displacement as a function of the memristance is presented. Thereafter a simple design for a voltage closed-loop control ismore » presented showing that the MEMS upper plate can be stabilized up to 95% of the total gap using the memristor as a feedback sensing element. As a result, the memristor can play important dual roles in overcoming the limited operation range of MEMS parallel plate capacitors and in simplifying read-out circuits of those devices by representing the motion of the upper plate in the form of resistance change instead of capacitance change.« less
MEMS closed-loop control incorporating a memristor as feedback sensing element
Garcia, Ernest J.; Almeida, Sergio F.; Mireles, Jr., Jose; ...
2015-12-01
In this work the integration of a memristor with a MEMS parallel plate capacitor coupled by an amplification stage is simulated. It is shown that the MEMS upper plate position can be controlled up to 95% of the total gap. Due to its common operation principle, the change in the MEMS plate position can be interpreted by the change in the memristor resistance, or memristance. A memristance modulation of ~1 KΩ was observed. A polynomial expression representing the MEMS upper plate displacement as a function of the memristance is presented. Thereafter a simple design for a voltage closed-loop control ismore » presented showing that the MEMS upper plate can be stabilized up to 95% of the total gap using the memristor as a feedback sensing element. As a result, the memristor can play important dual roles in overcoming the limited operation range of MEMS parallel plate capacitors and in simplifying read-out circuits of those devices by representing the motion of the upper plate in the form of resistance change instead of capacitance change.« less
Thuau, Damien; Abbas, Mamatimin; Wantz, Guillaume; Hirsch, Lionel; Dufour, Isabelle; Ayela, Cédric
2016-12-07
The growth of micro electro-mechanical system (MEMS) based sensors on the electronic market is forecast to be invigorated soon by the development of a new branch of MEMS-based sensors made of organic materials. Organic MEMS have the potential to revolutionize sensor products due to their light weight, low-cost and mechanical flexibility. However, their sensitivity and stability in comparison to inorganic MEMS-based sensors have been the major concerns. In the present work, an organic MEMS sensor with a cutting-edge electro-mechanical transducer based on an active organic field effect transistor (OFET) has been demonstrated. Using poly(vinylidenefluoride/trifluoroethylene) (P(VDF-TrFE)) piezoelectric polymer as active gate dielectric in the transistor mounted on a polymeric micro-cantilever, unique electro-mechanical properties were observed. Such an advanced scheme enables highly efficient integrated electro-mechanical transduction for physical and chemical sensing applications. Record relative sensitivity over 600 in the low strain regime (<0.3%) was demonstrated, which represents a key-step for the development of highly sensitive all organic MEMS-based sensors.
NASA NDE Applications for Mobile MEMS Devices and Sensors
NASA Technical Reports Server (NTRS)
Wilson, William C.; Atkinson, Gary M.; Barclay, R. O.
2008-01-01
NASA would like new devices and sensors for performing nondestructive evaluation (NDE) of aerospace vehicles. These devices must be small in size/volume, mass, and power consumption. The devices must be autonomous and mobile so they can access the internal structures of aircraft and spacecraft and adequately monitor the structural health of these craft. The platforms must be mobile in order to transport NDE sensors for evaluating structural integrity and determining whether further investigations will be required. Microelectromechanical systems (MEMS) technology is crucial to the development of the mobile platforms and sensor systems. This paper presents NASA s needs for micro mobile platforms and MEMS sensors that will enable NDE to be performed on aerospace vehicles.
National Institute of Standards and Technology Data Gateway
SRD 166 MEMS Calculator (Web, free access) This MEMS Calculator determines the following thin film properties from data taken with an optical interferometer or comparable instrument: a) residual strain from fixed-fixed beams, b) strain gradient from cantilevers, c) step heights or thicknesses from step-height test structures, and d) in-plane lengths or deflections. Then, residual stress and stress gradient calculations can be made after an optical vibrometer or comparable instrument is used to obtain Young's modulus from resonating cantilevers or fixed-fixed beams. In addition, wafer bond strength is determined from micro-chevron test structures using a material test machine.
Droplet Epitaxy Image Contrast in Mirror Electron Microscopy
NASA Astrophysics Data System (ADS)
Kennedy, S. M.; Zheng, C. X.; Jesson, D. E.
2017-01-01
Image simulation methods are applied to interpret mirror electron microscopy (MEM) images obtained from a movie of GaAs droplet epitaxy. Cylindrical symmetry of structures grown by droplet epitaxy is assumed in the simulations which reproduce the main features of the experimental MEM image contrast, demonstrating that droplet epitaxy can be studied in real-time. It is therefore confirmed that an inner ring forms at the droplet contact line and an outer ring (or skirt) occurs outside the droplet periphery. We believe that MEM combined with image simulations will be increasingly used to study the formation and growth of quantum structures.
MEMS for Tunable Photonic Metamaterial Applications
NASA Astrophysics Data System (ADS)
Stark, Thomas
Photonic metamaterials are materials whose optical properties are derived from artificially-structured sub-wavelength unit cells, rather than from the bulk properties of the constituent materials. Examples of metamaterials include plasmonic materials, negative index materials, and electromagnetic cloaks. While advances in simulation tools and nanofabrication methods have allowed this field to grow over the past several decades, many challenges still exist. This thesis addresses two of these challenges: fabrication of photonic metamaterials with tunable responses and high-throughput nanofabrication methods for these materials. The design, fabrication, and optical characterization of a microelectromechanical systems (MEMS) tunable plasmonic spectrometer are presented. An array of holes in a gold film, with plasmon resonance in the mid-infrared, is suspended above a gold reflector, forming a Fabry-Perot interferometer of tunable length. The spectra exhibit the convolution of extraordinary optical transmission through the holes and Fabry-Perot resonances. Using MEMS, the interferometer length is modulated from 1.7 mum to 21.67 mum , thereby tuning the free spectral range from about 2900 wavenumbers to 230.7 wavenumbers and shifting the reflection minima and maxima across the infrared. Due to its broad spectral tunability in the fingerprint region of the mid-infrared, this device shows promise as a tunable biological sensing device. To address the issue of high-throughput, high-resolution fabrication of optical metamaterials, atomic calligraphy, a MEMS-based dynamic stencil lithography technique for resist-free fabrication of photonic metamaterials on unconventional substrates, has been developed. The MEMS consists of a moveable stencil, which can be actuated with nanometer precision using electrostatic comb drive actuators. A fabrication method and flip chip method have been developed, enabling evaporation of metals through the device handle for fabrication on an external substrate. While the MEMS can be used to fabricate over areas of approximately 100 square mum2, a piezoelectric step-and repeat system enables fabrication over cm length scales. Thus, this technique leverages the precision inherent to MEMS actuation, while enhancing nanofabrication thoughput. Fabricating metamaterials on new substrates will enable novel and tunable metamaterials. For example, by fabricating unit cells on a periodic auxetic mechanical scaffold, the optical properties can be tuned by straining the mechanical scaffold.
MEMS for optical switching: technologies, applications, and perspectives
NASA Astrophysics Data System (ADS)
Lin, Lih-Y.; Goldstein, Evan L.
1999-09-01
Micro-electro-mechanical-systems (MEMS), due to their unique ability to integrate electrical, mechanical, and optical elements on a single chip, have recently begun to exhibit great potential for realizing optical components and subsystems in compact, lowcost form. Recently, this technology has been applied to wavelength-division-multiplexed (WDM) networks, and resulted in advances in several network elements, including switches, filters, modulators, and wavelength-add/drop multiplexers. Due largely to the exploding capacity demand arising from data traffic, the transmission capacity demanded of and available from WDM networks is anticipated to increase rapidly. For managing such networks, optical switching is of particular interest due to the fact that its complexity is essentially immune to steady advances in the per-channel bit-rate. We will review various micromachined optical-switching technologies, emphasizing studies of their reliability. We then summarizing recent progress in the free-space MEMS optical switch we have demonstrated.
MEMS for optical switching: technologies, applications, and perspectives
NASA Astrophysics Data System (ADS)
Lin, Lih-Yuan; Goldstein, Evan L.
1999-09-01
Micro-electro-mechanical-systems (MEMS), due to their unique ability to integrate electrical, mechanical, and optical elements on a single chip, have recently begun to exhibit great potential for realizing optical components and subsystems in compact, low-cost form. Recently, this technology has been applied to wavelength-division-multiplexed (WDM) networks, and resulted in advances in several network elements, including switches, filters, modulators, and wavelength-add/drop multiplexers. Due largely to the exploding capacity demand arising from data traffic, the transmission capacity demanded of and available from WDM networks is anticipated to increase rapidly. For managing such networks, optical switching is of particular interest due to the fact that its complexity is essentially immune to steady advances in the per-channel bit-rate. We will review various micromachined optical-switching technologies, emphasizing studies of their reliability. We then summarizing recent progress in the free-space MEMS optical switch we have demonstrated.
Microelectromechanical Systems for Aerodynamics Applications
NASA Technical Reports Server (NTRS)
Mehregany, Mehran; DeAnna, Russell G.; Reshotko, Eli
1996-01-01
Microelectromechanical systems (MEMS) embody the integration of sensors, actuators, and electronics on a single substrate using integrated circuit fabrication techniques and compatible micromachining processes. Silicon and its derivatives form the material base for the MEMS technology. MEMS devices, including micro-sensors and micro-actuators, are attractive because they can be made small (characteristic dimension about microns), be produced in large numbers with uniform performance, include electronics for high performance and sophisticated functionality, and be inexpensive. MEMS pressure sensors, wall-shear-stress sensors, and micromachined hot-wires are nearing application in aeronautics. MEMS actuators face a tougher challenge since they have to be scaled (up) to the physical phenomena that are being controlled. MEMS actuators are proposed, for example, for controlling the small structures in a turbulent boundary layer, for aircraft control, for cooling, and for mixing enhancement. Data acquisition or control logistics require integration of electronics along with the transducer elements with appropriate consideration of analog-to-digital conversion, multiplexing, and telemetry. Altogether, MEMS technology offers exciting opportunities for aerodynamics applications both in wind tunnels and in flight
Integrated CoPtP Permanent Magnets for MEMS Electromagnetic Energy Harvesting Applications
NASA Astrophysics Data System (ADS)
Mallick, Dhiman; Roy, Saibal
2016-10-01
This work reports the development of integrated Co rich CoPtP hard magnetic material for MEMS applications such as Electromagnetic Vibration Energy Harvesting. We report a new method of electrodeposition compared to the conventional DC plating, involving a combination of forward and reverse pulses for optimized deposition of Co rich CoPtP hard magnetic material. This results in significant improvements in the microstructure of the developed films as the pulse reverse plated films are smooth, stress free and uniform. Such improvements in the structural properties are reflected in the hard magnetic properties of the material as well. The intrinsic coercivities of the pulse reverse deposited film are more than 6 times higher for both in-plane and out-of-plane measurement directions and the squareness of the hysteresis loops also improve due to the similar reasons.
Accounting for Uncertainties in Strengths of SiC MEMS Parts
NASA Technical Reports Server (NTRS)
Nemeth, Noel; Evans, Laura; Beheim, Glen; Trapp, Mark; Jadaan, Osama; Sharpe, William N., Jr.
2007-01-01
A methodology has been devised for accounting for uncertainties in the strengths of silicon carbide structural components of microelectromechanical systems (MEMS). The methodology enables prediction of the probabilistic strengths of complexly shaped MEMS parts using data from tests of simple specimens. This methodology is intended to serve as a part of a rational basis for designing SiC MEMS, supplementing methodologies that have been borrowed from the art of designing macroscopic brittle material structures. The need for this or a similar methodology arises as a consequence of the fundamental nature of MEMS and the brittle silicon-based materials of which they are typically fabricated. When tested to fracture, MEMS and structural components thereof show wide part-to-part scatter in strength. The methodology involves the use of the Ceramics Analysis and Reliability Evaluation of Structures Life (CARES/Life) software in conjunction with the ANSYS Probabilistic Design System (PDS) software to simulate or predict the strength responses of brittle material components while simultaneously accounting for the effects of variability of geometrical features on the strength responses. As such, the methodology involves the use of an extended version of the ANSYS/CARES/PDS software system described in Probabilistic Prediction of Lifetimes of Ceramic Parts (LEW-17682-1/4-1), Software Tech Briefs supplement to NASA Tech Briefs, Vol. 30, No. 9 (September 2006), page 10. The ANSYS PDS software enables the ANSYS finite-element-analysis program to account for uncertainty in the design-and analysis process. The ANSYS PDS software accounts for uncertainty in material properties, dimensions, and loading by assigning probabilistic distributions to user-specified model parameters and performing simulations using various sampling techniques.
Through-wafer interrogation of microstructure motion for MEMS feedback control
NASA Astrophysics Data System (ADS)
Dawson, Jeremy M.; Chen, Jingdong; Brown, Kolin S.; Famouri, Parviz F.; Hornak, Lawrence A.
1999-09-01
Closed-loop MEMS control enables mechanical microsystems to adapt to the demands of the environment which they are actuating opening a new window of opportunity for future MEMS applications. Planar diffractive optical microsystems have the potential to enable the integrated optical interrogation of MEMS microstructure position fully decoupled from the means of mechanical actuation which is central to realization of feedback control. This paper presents the results of initial research evaluating through-wafer optical microsystems for MEMS integrated optical monitoring. Positional monitoring results obtained from a 1.3 micrometer wavelength through- wafer free-space optical probe of a lateral comb resonator fabricated using the Multi-User MEMS Process Service (MUMPS) are presented. Given the availability of positional information via probe signal feedback, a simulation of the application of nonlinear sliding control is presented illustrating position control of the lateral comb resonator structure.
NASA Astrophysics Data System (ADS)
Milanovic, Veljko; Kasturi, Abhishek; Hachtel, Volker
2015-02-01
A high brightness Head-Up Display (HUD) module was demonstrated with a fast, dual-axis MEMS mirror that displays vector images and text, utilizing its ~8kHz bandwidth on both axes. Two methodologies were evaluated: in one, the mirror steers a laser at wide angles of <48° on transparent multi-color fluorescent emissive film and displays content directly on the windshield, and in the other the mirror displays content on reflective multi-color emissive phosphor plates reflected off the windshield to create a virtual image for the driver. The display module is compact, consisting of a single laser diode, off-the-shelf lenses and a MEMS mirror in combination with a MEMS controller to enable precise movement of the mirror's X- and Y-axis. The MEMS controller offers both USB and wireless streaming capability and we utilize a library of functions on a host computer for creating content and controlling the mirror. Integration with smart phone applications is demonstrated, utilizing the mobile device both for content generation based on various messages or data, and for content streaming to the MEMS controller via Bluetooth interface. The display unit is highly resistant to vibrations and shock, and requires only ~1.5W to operate, even with content readable in sunlit outdoor conditions. The low power requirement is in part due to a vector graphics approach, allowing the efficient use of laser power, and also due to the use of a single, relatively high efficiency laser and simple optics.
Wavelength specific excitation of gold nanoparticle thin-films
NASA Astrophysics Data System (ADS)
Lucas, Thomas M.; James, Kurtis T.; Beharic, Jasmin; Moiseeva, Evgeniya V.; Keynton, Robert S.; O'Toole, Martin G.; Harnett, Cindy K.
2014-01-01
Advances in microelectromechanical systems (MEMS) continue to empower researchers with the ability to sense and actuate at the micro scale. Thermally driven MEMS components are often used for their rapid response and ability to apply relatively high forces. However, thermally driven MEMS often have high power consumption and require physical wiring to the device. This work demonstrates a basis for designing light-powered MEMS with a wavelength specific response. This is accomplished by patterning surface regions with a thin film containing gold nanoparticles that are tuned to have an absorption peak at a particular wavelength. The heating behavior of these patterned surfaces is selected by the wavelength of laser directed at the sample. This method also eliminates the need for wires to power a device. The results demonstrate that gold nanoparticle films are effective wavelength-selective absorbers. This "hybrid" of infrared absorbent gold nanoparticles and MEMS fabrication technology has potential applications in light-actuated switches and other mechanical structures that must bend at specific regions. Deposition methods and surface chemistry will be integrated with three-dimensional MEMS structures in the next phase of this work. The long-term goal of this project is a system of light-powered microactuators for exploring cellular responses to mechanical stimuli, increasing our fundamental understanding of tissue response to everyday mechanical stresses at the molecular level.
NASA Astrophysics Data System (ADS)
Milanović, Veljko; Kasturi, Abhishek; Yang, James; Su, Yu Roger; Hu, Frank
2017-02-01
2D quasistatic (point-to-point) gimbal-less MEMS mirrors enable programmable, arbitrary control of laser beam position and velocity - up to their maximum limits. Hence, they provide the ability to track targets, point lasercom beams, and to scan uniform velocity lines over objects in laser imaging. They are becoming increasingly established in applications including 3D scanning, laser marking and 3D printing, biomedical imaging, communications, and LiDAR. With the increased utility in applications that demand larger mirror sizes and larger overall angle*diameter (θ*D) figures of merit, the technology is continuously pushed against its limit. As a result we have implemented mirrors with larger diameters including 5.0mm, 6.4mm, and 7.5mm, and have designed actuators with larger torque and angles to match the Θ*D demand. While the results have been very positive in certain application cases, a limitation for their more wide-spread use has been the relatively high susceptibility of large- θ*D mirrors to shock and vibrations. On the other hand, one of the challenges of MEMS mirrors of small diameters is their lower optical power tolerance simply due to their smaller area and heat removal ability. Although they can be operated at up to 2-3W of CW laser power, new developments in dynamic solid state lighting in e.g. headlights demand operation at up to 10W or beyond. In this work we study and present several package-level approaches to increase mechanical damping, shock robustness, and laser power tolerance. Specifically, we study back-filling of MEMS packages with different gases as well as with different (increased) pressures to control damping and in turn increase robustness and useable bandwidth. Additionally, we study the effects of specialized mechanical structures which were designed and fabricated to modify packages to significantly reduce volumes of space around moving structures. In their standard form and packaging the MEMS mirrors tested in this study typically measure quality factors of 75-100. Increases of pressure up to 50psi have shown relatively modest reductions of the overall quality factor to the 40-50 range. Backfilling of packages with heavier inert gasses such as Ar and SF6 results in lowering of the quality factor down to 20-30 range. Mechanical modifications of the package with special structures and reduced air-gap to the window yielded the best results, reducing the quality factor to 9-14. Combination of specialized packaging structures and gas backfill and pressure control could provide a very efficient heat transfer from the mirror and the desired near-critical damping, but has not been demonstrated yet. The increased performance does not change the compactness and low power consumption - the improved MEMS mirrors still consume <1mW. So far, designs with mirror sizes through 3.0mm diameter with increased damping have passed 500G shock tests. In terms of improved heat removal we have found that the packaging improvement greatly increased optical power tolerance of MEMS mirrors from few Watts of CW laser power to <10 Watts. The exact numbers for the upper limit are not yet available - in samples where the heat removing structure was added and air was replaced with Helium, our setup with 3 combined lasers was not able to damage any samples.
MEMS- and NEMS-based smart devices and systems
NASA Astrophysics Data System (ADS)
Varadan, Vijay K.
2001-11-01
The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with features sized now don at the sub micron and nanometer level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and systems. This effort offers the promise of: 1) increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed including micro stereo lithographic an micro molding techniques; 2) developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines; 3) development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation; 4) development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems, etc. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composite provide a new avenue for future smart systems. The integration of NEMS (NanoElectroMechanical Systems), MEMS, IDTs (Interdigital Transducers) and required microelectronics and conformal antenna in the multifunctional smart materials and composites results in a smart system suitable for sensing and control of a variety functions in automobile, aerospace, marine and civil structures and food and medical industries. This unique combination of technologies also results in novel conformal sensors that can be remotely sensed by an antenna system with the advantage of no power requirements at the sensor site. This paper provides a brief review of MEMS and NEMS based smart systems for various applications mentioned above. Carbon Nano Tubes (CNT) with their unique structure, have already proven to be valuable in their application as tips for scanning probe microscopy, field emission devices, nanoelectronics, H2-storage, electromagnetic absorbers, ESD, EMI films and coatings and structural composites. For many of these applications, highly purified and functionalized CNT which are compatible with many host polymers are needed. A novel microwave CVD processing technique to meet these requirements has been developed at Penn State Center for the engineering of Electronic and Acoustic Materials and Devices (CEEAMD). This method enables the production of highly purified carbon nano tubes with variable size (from 5-40 nm) at low cost (per gram) and high yield. Whereas, carbon nano tubes synthesized using the laser ablation or arc discharge evaporation method always include impurity due to catalyst or catalyst support. The Penn State research is based on the use of zeolites over other metal/metal oxides in the microwave field for a high production and uniformity of the product. An extended conventional purification method has been employed to purify our products in order to remove left over impurity. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross- linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composites will be presented.
NASA Astrophysics Data System (ADS)
Singh, R. A.; Satyanarayana, N.; Kustandi, T. S.; Sinha, S. K.
2011-01-01
Micro/nano-electro-mechanical-systems (MEMS/NEMS) are miniaturized devices built at micro/nanoscales. At these scales, the surface/interfacial forces are extremely strong and they adversely affect the smooth operation and the useful operating lifetimes of such devices. When these forces manifest in severe forms, they lead to material removal and thereby reduce the wear durability of the devices. In this paper, we present a simple, yet robust, two-step surface modification method to significantly enhance the tribological performance of MEMS/NEMS materials. The two-step method involves oxygen plasma treatment of polymeric films and the application of a nanolubricant, namely perfluoropolyether. We apply the two-step method to the two most important MEMS/NEMS structural materials, namely silicon and SU8 polymer. On applying surface modification to these materials, their initial coefficient of friction reduces by ~4-7 times and the steady-state coefficient of friction reduces by ~2.5-3.5 times. Simultaneously, the wear durability of both the materials increases by >1000 times. The two-step method is time effective as each of the steps takes the time duration of approximately 1 min. It is also cost effective as the oxygen plasma treatment is a part of the MEMS/NEMS fabrication process. The two-step method can be readily and easily integrated into MEMS/NEMS fabrication processes. It is anticipated that this method will work for any kind of structural material from which MEMS/NEMS are or can be made.
Microelectromechanical dual-mass resonator structure
Dyck, Christopher W.; Allen, James J.; Huber, Robert J.
2002-01-01
A dual-mass microelectromechanical (MEM) resonator structure is disclosed in which a first mass is suspended above a substrate and driven to move along a linear or curved path by a parallel-plate electrostatic actuator. A second mass, which is also suspended and coupled to the first mass by a plurality of springs is driven by motion of the first mass. Various modes of operation of the MEM structure are possible, including resonant and antiresonant modes, and a contacting mode. In each mode of operation, the motion induced in the second mass can be in the range of several microns up to more than 50 .mu.m while the first mass has a much smaller displacement on the order of one micron or less. The MEM structure has applications for forming microsensors that detect strain, acceleration, rotation or movement.
NASA Technical Reports Server (NTRS)
Jah, Muzar; Simon, Eric; Sharma, Ashok
2003-01-01
Micro Electro Mechanical Systems (MEMS) have been heralded for their ability to provide tremendous advantages in electronic systems through increased electrical performance, reduced power consumption, and higher levels of device integration with a reduction of board real estate. RF MEMS switch technology offers advantages such as low insertion loss (0.1- 0.5 dB), wide bandwidth (1 GHz-100 GHz), and compatibility with many different process technologies (quartz, high resistivity Si, GaAs) which can replace the use of traditional electronic switches, such as GaAs FETS and PIN Diodes, in microwave systems for low signal power (x < 500 mW) applications. Although the electrical characteristics of RF MEMS switches far surpass any existing technologies, the unknown reliability, due to the lack of information concerning failure modes and mechanisms inherent to MEMS devices, create an obstacle to insertion of MEMS technology into high reliability applications. All MEMS devices are sensitive to moisture and contaminants, issues easily resolved by hermetic or near-hermetic packaging. Two well-known failure modes of RF MEMS switches are charging in the dielectric layer of capacitive membrane switches and contact interface stiction of metal-metal switches. Determining the integrity of MEMS devices when subjected to the shock, vibration, temperature extremes, and radiation of the space environment is necessary to facilitate integration into space systems. This paper will explore the effects of different environmental stresses, operational life cycling, temperature, mechanical shock, and vibration on the first commercially available RF MEMS switches to identify relevant failure modes and mechanisms inherent to these device and packaging schemes for space applications. This paper will also describe RF MEMS Switch technology under development at NASA GSFC.
Study on the Weak Stress in Flexural MEMS Cantilever
NASA Astrophysics Data System (ADS)
Ge, Yuetao; Ren, Yan
2018-03-01
In order to design a better piezoresistive MEMS cantilever beam, especially for cantilever beams that will detect weak forces or will be subjected to weak forces, this paper uses study on the weak stress in flexural MEMS cantilever. The sensor design structure, divided into protective layer, piezoresistive layer, support layer. The protective layer is responsible for protecting the piezoresistive layer so that the varistor is insulated from the outside; the piezoresistive layer is used to make the varistor; the support layer forms the main part of the cantilever beam, the majority of the cantilever beam. This paper has some value for cantilever multilayer structure design and cantilever beam size design.
Modeling high signal-to-noise ratio in a novel silicon MEMS microphone with comb readout
NASA Astrophysics Data System (ADS)
Manz, Johannes; Dehe, Alfons; Schrag, Gabriele
2017-05-01
Strong competition within the consumer market urges the companies to constantly improve the quality of their devices. For silicon microphones excellent sound quality is the key feature in this respect which means that improving the signal-to-noise ratio (SNR), being strongly correlated with the sound quality is a major task to fulfill the growing demands of the market. MEMS microphones with conventional capacitive readout suffer from noise caused by viscous damping losses arising from perforations in the backplate [1]. Therefore, we conceived a novel microphone design based on capacitive read-out via comb structures, which is supposed to show a reduction in fluidic damping compared to conventional MEMS microphones. In order to evaluate the potential of the proposed design, we developed a fully energy-coupled, modular system-level model taking into account the mechanical motion, the slide film damping between the comb fingers, the acoustic impact of the package and the capacitive read-out. All submodels are physically based scaling with all relevant design parameters. We carried out noise analyses and due to the modular and physics-based character of the model, were able to discriminate the noise contributions of different parts of the microphone. This enables us to identify design variants of this concept which exhibit a SNR of up to 73 dB (A). This is superior to conventional and at least comparable to high-performance variants of the current state-of-the art MEMS microphones [2].
Analysis of the bending stiffness and adhesion effect in RF-MEMS structures
NASA Astrophysics Data System (ADS)
Birleanu, C.; Pustan, M.; Dudescu, C.; Merie, V.; Pintea, I.
2017-02-01
Microelectromechanical system (MEMS) is a special branch with a wide range of applications in sensing, switching and actuating devices. Designing the reliable MEMS for thin free-standing structures like as bridges and cantilevers requires understanding of the tribomechanical properties of the materials and structures. The effect of geometrical dimensions (cross-section dimensions and length) on mechanical and tribological behavior of free-standing MEMS structures made of electroplated gold was analyzed in this paper. Special attention was given to the dependences between stiffness and cantilever length and the dependences between bending stress and variable travel range of actuated load. The force position was moved from the beams free-end toward to the anchor. The tests were performed at room temperature (22°C) and relative humidity RH of 40% with a noise- and vibration-isolated and environment-controlled XE-70 AFM from Park Systems using the contact mode. Each measurement was repeated many times in order to improve the accuracy of the experimental results. The stiffness of a microcantilever varies if the position of the acting force is changed. The experimental results obtained were in good correlation with those obtained analytically.
Microelectromechanical resonator and method for fabrication
Wittwer, Jonathan W [Albuquerque, NM; Olsson, Roy H [Albuquerque, NM
2009-11-10
A method is disclosed for the robust fabrication of a microelectromechanical (MEM) resonator. In this method, a pattern of holes is formed in the resonator mass with the position, size and number of holes in the pattern being optimized to minimize an uncertainty .DELTA.f in the resonant frequency f.sub.0 of the MEM resonator due to manufacturing process variations (e.g. edge bias). A number of different types of MEM resonators are disclosed which can be formed using this method, including capacitively transduced Lame, wineglass and extensional resonators, and piezoelectric length-extensional resonators.
Microelectromechanical resonator and method for fabrication
Wittwer, Jonathan W [Albuquerque, NM; Olsson, Roy H [Albuquerque, NM
2010-01-26
A method is disclosed for the robust fabrication of a microelectromechanical (MEM) resonator. In this method, a pattern of holes is formed in the resonator mass with the position, size and number of holes in the pattern being optimized to minimize an uncertainty .DELTA.f in the resonant frequency f.sub.0 of the MEM resonator due to manufacturing process variations (e.g. edge bias). A number of different types of MEM resonators are disclosed which can be formed using this method, including capacitively transduced Lame, wineglass and extensional resonators, and piezoelectric length-extensional resonators.
Zhao, Lin; Guan, Dongxue; Landry, René Jr.; Cheng, Jianhua; Sydorenko, Kostyantyn
2015-01-01
Target positioning systems based on MEMS gyros and laser rangefinders (LRs) have extensive prospects due to their advantages of low cost, small size and easy realization. The target positioning accuracy is mainly determined by the LR’s attitude derived by the gyros. However, the attitude error is large due to the inherent noises from isolated MEMS gyros. In this paper, both accelerometer/magnetometer and LR attitude aiding systems are introduced to aid MEMS gyros. A no-reset Federated Kalman Filter (FKF) is employed, which consists of two local Kalman Filters (KF) and a Master Filter (MF). The local KFs are designed by using the Direction Cosine Matrix (DCM)-based dynamic equations and the measurements from the two aiding systems. The KFs can estimate the attitude simultaneously to limit the attitude errors resulting from the gyros. Then, the MF fuses the redundant attitude estimates to yield globally optimal estimates. Simulation and experimental results demonstrate that the FKF-based system can improve the target positioning accuracy effectively and allow for good fault-tolerant capability. PMID:26512672
CMOS compatible fabrication process of MEMS resonator for timing reference and sensing application
NASA Astrophysics Data System (ADS)
Huynh, Duc H.; Nguyen, Phuong D.; Nguyen, Thanh C.; Skafidas, Stan; Evans, Robin
2015-12-01
Frequency reference and timing control devices are ubiquitous in electronic applications. There is at least one resonator required for each of this device. Currently electromechanical resonators such as crystal resonator, ceramic resonator are the ultimate choices. This tendency will probably keep going for many more years. However, current market demands for small size, low power consumption, cheap and reliable products, has divulged many limitations of this type of resonators. They cannot be integrated into standard CMOS (Complement metaloxide- semiconductor) IC (Integrated Circuit) due to material and fabrication process incompatibility. Currently, these devices are off-chip and they require external circuitries to interface with the ICs. This configuration significantly increases the overall size and cost of the entire electronic system. In addition, extra external connection, especially at high frequency, will potentially create negative impacts on the performance of the entire system due to signal degradation and parasitic effects. Furthermore, due to off-chip packaging nature, these devices are quite expensive, particularly for high frequency and high quality factor devices. To address these issues, researchers have been intensively studying on an alternative for type of resonator by utilizing the new emerging MEMS (Micro-electro-mechanical systems) technology. Recent progress in this field has demonstrated a MEMS resonator with resonant frequency of 2.97 GHz and quality factor (measured in vacuum) of 42900. Despite this great achievement, this prototype is still far from being fully integrated into CMOS system due to incompatibility in fabrication process and its high series motional impedance. On the other hand, fully integrated MEMS resonator had been demonstrated but at lower frequency and quality factor. We propose a design and fabrication process for a low cost, high frequency and a high quality MEMS resonator, which can be integrated into a standard CMOS IC. This device is expected to operate in hundreds of Mhz frequency range; quality factor surpasses 10000 and series motional impedance low enough that could be matching into conventional system without enormous effort. This MEMS resonator can be used in the design of many blocks in wireless and RF (Radio Frequency) systems such as low phase noise oscillator, band pass filter, power amplifier and in many sensing application.
Nanotechnology: MEMS and NEMS and their applications to smart systems and devices
NASA Astrophysics Data System (ADS)
Varadan, Vijay K.
2003-10-01
The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with features sizes now down at the sub micron and nanometer level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and systems. This effort offers the promise of: (1) increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed including micro stereo lithographic and micro molding techniques; (2) developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines; (3) development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation; (4) development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems, etc. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composite provide a new avenue for future smart systems. The integration of NEMS (NanoElectroMechanical Systems), MEMS, IDTs (Interdigital Transducers) and required microelectronics and conformal antenna in the multifunctional smart materials and composites results in a smart system suitable for sending and control of a variety functions in automobile, aerospace, marine and civil strutures and food and medical industries. This unique combination of technologies also results in novel conformal sensors that can be remotely sensed by an antenna system with the advantage of no power requirements at the sensor site. This paper provides a brief review of MEMS and NEMS based smart systems for various applications mentioned above. Carbon Nano Tubes (CNT) with their unique structure, have already proven to be valuable in their application as tips for scanning probe microscopy, field emission devices, nanoelectronics, H2-storage, electromagnetic absorbers, ESD, EMI films and coatings and structural composites. For many of these applications, highly purified and functionalized CNT which are compatible with many host polymers are needed. A novel microwave CVD processing technique to meet these requirements has been developed at Penn State Center for the Engineering of Electronic and Acoustic Materials and Devices (CEEAMD). This method enables the production of highly purified carbon nano tubes with variable size (from 5 - 40 nm) at low cost (per gram) and high yield. Whereas, carbon nano tubes synthesized using the laser ablation or arc discharge evaporation method always include impurity due to catalyst or catalyst support. The Penn State research is based on the use of zeolites over other metal/metal oxides in the microwave field for a high production and uniformity of the product. An extended coventional purification method has been employed to purify our products in order to remove left over impurity. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composites will be presented.
Dai, Zhengfei; Xu, Lei; Duan, Guotao; Li, Tie; Zhang, Hongwen; Li, Yue; Wang, Yi; Wang, Yuelin; Cai, Weiping
2013-01-01
The chemiresistive thin film gas sensors with fast response, high sensitivity, low power consumption and mass-produced potency, have been expected for practical application. It requires both sensitive materials, especially exquisite nanomaterials, and efficient substrate chip for heating and electrical addressing. However, it is challenging to achieve repeatable microstructures across the films and low power consumption of substrate chip. Here we presented a new sensor structure via the fusion of metal-oxide nanoporous films and micro-electro-mechanical systems (MEMS)-based sensing chip. An interdigital-electrodes (IDEs) and microheater integrated MEMS structure is designed and employed as substrate chip to in-situ fabricate colloidal monolayer template-induced metal-oxide (egg. SnO2) nanoporous sensing films. This fused sensor demonstrates mW-level low power, ultrafast response (~1 s), and parts-per-billion lever detection for ethanol gas. Due to the controllable template strategy and mass-production potential, such micro/nano fused high-performance gas sensors will be next-generation key miniaturized/integrated devices for advanced practical applications. PMID:23591580
Ye, Liangchen; Zhang, Gaofei; You, Zheng
2017-03-05
The MEMS (Micro-Electronical Mechanical System) scanning mirror is an optical MEMS device that can scan laser beams across one or two dimensions. MEMS scanning mirrors can be applied in a variety of applications, such as laser display, bio-medical imaging and Light Detection and Ranging (LiDAR). These commercial applications have recently created a great demand for low-driving-voltage and low-power MEMS mirrors. However, no reported two-axis MEMS scanning mirror is available for usage in a universal supplying voltage such as 5 V. In this paper, we present an ultra-low voltage driven two-axis MEMS scanning mirror which is 5 V compatible. In order to realize low voltage and low power, a two-axis MEMS scanning mirror with mechanical leverage driven by PZT (Lead zirconate titanate) ceramic is designed, modeled, fabricated and characterized. To further decrease the power of the MEMS scanning mirror, a new method of impedance matching for PZT ceramic driven by a two-frequency mixed signal is established. As experimental results show, this MEMS scanning mirror reaches a two-axis scanning angle of 41.9° × 40.3° at a total driving voltage of 4.2 Vpp and total power of 16 mW. The effective diameter of reflection of the mirror is 2 mm and the operating frequencies of two-axis scanning are 947.51 Hz and 1464.66 Hz, respectively.
Ye, Liangchen; Zhang, Gaofei; You, Zheng
2017-01-01
The MEMS (Micro-Electronical Mechanical System) scanning mirror is an optical MEMS device that can scan laser beams across one or two dimensions. MEMS scanning mirrors can be applied in a variety of applications, such as laser display, bio-medical imaging and Light Detection and Ranging (LiDAR). These commercial applications have recently created a great demand for low-driving-voltage and low-power MEMS mirrors. However, no reported two-axis MEMS scanning mirror is available for usage in a universal supplying voltage such as 5 V. In this paper, we present an ultra-low voltage driven two-axis MEMS scanning mirror which is 5 V compatible. In order to realize low voltage and low power, a two-axis MEMS scanning mirror with mechanical leverage driven by PZT (Lead zirconate titanate) ceramic is designed, modeled, fabricated and characterized. To further decrease the power of the MEMS scanning mirror, a new method of impedance matching for PZT ceramic driven by a two-frequency mixed signal is established. As experimental results show, this MEMS scanning mirror reaches a two-axis scanning angle of 41.9° × 40.3° at a total driving voltage of 4.2 Vpp and total power of 16 mW. The effective diameter of reflection of the mirror is 2 mm and the operating frequencies of two-axis scanning are 947.51 Hz and 1464.66 Hz, respectively. PMID:28273880
Investigation of improving MEMS-type VOA reliability
NASA Astrophysics Data System (ADS)
Hong, Seok K.; Lee, Yeong G.; Park, Moo Y.
2003-12-01
MEMS technologies have been applied to a lot of areas, such as optical communications, Gyroscopes and Bio-medical components and so on. In terms of the applications in the optical communication field, MEMS technologies are essential, especially, in multi dimensional optical switches and Variable Optical Attenuators(VOAs). This paper describes the process for the development of MEMS type VOAs with good optical performance and improved reliability. Generally, MEMS VOAs have been fabricated by silicon micro-machining process, precise fibre alignment and sophisticated packaging process. Because, it is composed of many structures with various materials, it is difficult to make devices reliable. We have developed MEMS type VOSs with many failure mode considerations (FMEA: Failure Mode Effect Analysis) in the initial design step, predicted critical failure factors and revised the design, and confirmed the reliability by preliminary test. These predicted failure factors were moisture, bonding strength of the wire, which wired between the MEMS chip and TO-CAN and instability of supplied signals. Statistical quality control tools (ANOVA, T-test and so on) were used to control these potential failure factors and produce optimum manufacturing conditions. To sum up, we have successfully developed reliable MEMS type VOAs with good optical performances by controlling potential failure factors and using statistical quality control tools. As a result, developed VOAs passed international reliability standards (Telcodia GR-1221-CORE).
Investigation of improving MEMS-type VOA reliability
NASA Astrophysics Data System (ADS)
Hong, Seok K.; Lee, Yeong G.; Park, Moo Y.
2004-01-01
MEMS technologies have been applied to a lot of areas, such as optical communications, Gyroscopes and Bio-medical components and so on. In terms of the applications in the optical communication field, MEMS technologies are essential, especially, in multi dimensional optical switches and Variable Optical Attenuators(VOAs). This paper describes the process for the development of MEMS type VOAs with good optical performance and improved reliability. Generally, MEMS VOAs have been fabricated by silicon micro-machining process, precise fibre alignment and sophisticated packaging process. Because, it is composed of many structures with various materials, it is difficult to make devices reliable. We have developed MEMS type VOSs with many failure mode considerations (FMEA: Failure Mode Effect Analysis) in the initial design step, predicted critical failure factors and revised the design, and confirmed the reliability by preliminary test. These predicted failure factors were moisture, bonding strength of the wire, which wired between the MEMS chip and TO-CAN and instability of supplied signals. Statistical quality control tools (ANOVA, T-test and so on) were used to control these potential failure factors and produce optimum manufacturing conditions. To sum up, we have successfully developed reliable MEMS type VOAs with good optical performances by controlling potential failure factors and using statistical quality control tools. As a result, developed VOAs passed international reliability standards (Telcodia GR-1221-CORE).
Scalable fabrication of carbon-based MEMS/NEMS and their applications: a review
NASA Astrophysics Data System (ADS)
Jiang, Shulan; Shi, Tielin; Zhan, Xiaobin; Xi, Shuang; Long, Hu; Gong, Bo; Li, Junjie; Cheng, Siyi; Huang, Yuanyuan; Tang, Zirong
2015-11-01
The carbon-based micro/nano electromechanical system (MEMS/NEMS) technique provides a powerful approach to large-scale manufacture of high-aspect-ratio carbon structures for wafer-level processing. The fabricated three-dimensional (3D) carbon structures have the advantages of excellent electrical and electrochemical properties, and superior biocompatibility. In order to improve their performance for applications in micro energy storage devices and microsensors, an increase in the footprint surface area is of great importance. Various approaches have been proposed for fabricating large surface area carbon-based structures, including the integration of nanostructures such as carbon nanotubes (CNTs), graphene, nanowires, nanofilms and nanowrinkles onto 3D structures, which has been proved to be effective and productive. Moreover, by etching the 3D photoresist microstructures through oxygen plasma or modifying the photoresist with specific materials which can be etched in the following pyrolysis process, micro/nano hierarchical carbon structures have been fabricated. These improved structures show excellent performance in various applications, especially in the fields of biological sensors, surface-enhanced Raman scattering, and energy storage devices such as micro-supercapacitors and fuel cells. With the rapid development of microelectronic devices, the carbon-based MEMS/NEMS technique could make more aggressive moves into microelectronics, sensors, miniaturized power systems, etc. In this review, the recent advances in the fabrication of micro/nano hierarchical carbon-based structures are introduced and the technical challenges and future outlook of the carbon-based MEMS/NEMS techniques are also analyzed.
MEMS-based tunable gratings and their applications
NASA Astrophysics Data System (ADS)
Yu, Yiting; Yuan, Weizheng; Qiao, Dayong
2015-03-01
The marriage of optics and MEMS has resulted in a new category of optical devices and systems that have unprecedented advantages compared with their traditional counterparts. As an important spatial light modulating technology, diffractive optical MEMS obtains a wide variety of successful commercial applications, e.g. projection displays, optical communication and spectral analysis, due to its features of highly compact, low-cost, IC-compatible, excellent performance, and providing possibilities for developing totally new, yet smart devices and systems. Three most successful MEMS diffraction gratings (GLVs, Polychromator and DMDs) are briefly introduced and their potential applications are analyzed. Then, three different MEMS tunable gratings developed by our group, named as micro programmable blazed gratings (μPBGs) and micro pitch-tunable gratings (μPTGs) working in either digital or analog mode, are demonstrated. The strategies to largely enhance the maximum blazed angle and grating period are described. Some preliminary application explorations based on the developed grating devices are also shown. For our ongoing research focus, we will further improve the device performance to meet the engineering application requirements.
Wang, Ming-Fang; Xu, Yingshun; Prem, C S; Chen, Kelvin Wei Sheng; Xie, Jin; Mu, Xiaojing; Tan, Chee Wei; Yu, Aibin; Feng, Hanhua
2010-01-01
In this paper, we present a miniaturized endoscopic probe, consisted of MEMS micromirror, silicon optical bench (SiOB), grade index (GRIN) lens, single mode optical fiber (SMF) and transparent housing, for optical coherence tomography (OCT) bioimaging. Due to the use of the MEMS micromirror, the endoscopic OCT system is highly suitable for non-invasive imaging diagnosis of a wide variety of inner organs. The probe engineering and proof of concept were demonstrated by obtaining the two-dimensional OCT images with a cover slide and an onion used as standard samples and the axial resolution was around 10µm.
Reconstruction of coded aperture images
NASA Technical Reports Server (NTRS)
Bielefeld, Michael J.; Yin, Lo I.
1987-01-01
Balanced correlation method and the Maximum Entropy Method (MEM) were implemented to reconstruct a laboratory X-ray source as imaged by a Uniformly Redundant Array (URA) system. Although the MEM method has advantages over the balanced correlation method, it is computationally time consuming because of the iterative nature of its solution. Massively Parallel Processing, with its parallel array structure is ideally suited for such computations. These preliminary results indicate that it is possible to use the MEM method in future coded-aperture experiments with the help of the MPP.
Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach.
Mariani, Stefano; Ghisi, Aldo; Corigliano, Alberto; Zerbini, Sarah
2009-01-01
Failure of packaged polysilicon micro-electro-mechanical systems (MEMS) subjected to impacts involves phenomena occurring at several length-scales. In this paper we present a multi-scale finite element approach to properly allow for: (i) the propagation of stress waves inside the package; (ii) the dynamics of the whole MEMS; (iii) the spreading of micro-cracking in the failing part(s) of the sensor. Through Monte Carlo simulations, some effects of polysilicon micro-structure on the failure mode are elucidated.
2007-12-31
Wisconsin-Madison) for 2? ol !> o "S \\ % M 31 Statement of Objectives The original objectives of the proposal were as follows: 1. Obtain high-quality...performed multiple PEEM experiments on wear tracks on carbon-based films and polysilicon micro-electro mechanical systems (MEMS) devices, a comprehensive... polysilicon MEMS device known as the "nanotractor", and studies of the structure and composition of UNCD, ta-C, and nanocrystalline diamond (NCD) films. They
Effect of residual stress on modal patterns of MEMS vibratory gyroscope
DOE Office of Scientific and Technical Information (OSTI.GOV)
Dutta, Shankar, E-mail: shankardutta77@gmail.com; Panchal, Abha; Kumar, Manoj
Deep boron diffusion often induces residual stress in bulk micromachined MEMS structures, which may affect the MEMS devices operation. In this study, we studied the modal patterns of MEMS vibratory gyroscope under the residual stress (100 – 1000 MPa). Modal patterns and modal frequencies of the gyro are found to be dependent on the residual stress values. Without any residual stress, the modal frequencies drive and sense modeswere found to be 20.06 kHz and 20.36 kHz respectively. In presence of 450 MPa residual stress, the modal frequencies of the drive and sense modes were changed to 42.75 kHz and 43.07 kHz respectively.
Novel Processes for Modular Integration of Silicon-Germanium MEMS with CMOS Electronics
2007-02-28
process limits the compatibility with further lithography steps. Using silicon as the MEMS structural material, most of the integration processes...structures are defined by lithography and deep reactive ion etching. A layer of gasket oxide is deposited as the sacrificial material between the...When the Bragg condition for constructive interference is obtained, a diffraction peak is produced and the relative peak height is proportional to
2012-08-01
techniques and STEAM imager. It couples the high-speed capability of the STEAM imager and differential phase contrast imaging of DIC / Nomarski microscopy...On 10 TPE chips, we obtained 9 homogenous and strong bonds, the failed bond being due to operator error and presence of air bubbles in the TPE...instruments, structural dynamics, and microelectromechanical systems (MEMS) via laser-scanning surface vibrometry , and observation of biomechanical motility
MEMS-based fuel cells with integrated catalytic fuel processor and method thereof
Jankowski, Alan F [Livermore, CA; Morse, Jeffrey D [Martinez, CA; Upadhye, Ravindra S [Pleasanton, CA; Havstad, Mark A [Davis, CA
2011-08-09
Described herein is a means to incorporate catalytic materials into the fuel flow field structures of MEMS-based fuel cells, which enable catalytic reforming of a hydrocarbon based fuel, such as methane, methanol, or butane. Methods of fabrication are also disclosed.
Design, Simulation and Fabrication of Triaxial MEMS High Shock Accelerometer.
Zhang, Zhenhai; Shi, Zhiguo; Yang, Zhan; Xie, Zhihong; Zhang, Donghong; Cai, De; Li, Kejie; Shen, Yajing
2015-04-01
On the basis of analyzing the disadvantage of other structural accelerometer, three-axis high g MEMS piezoresistive accelerometer was put forward in order to apply to the high-shock test field. The accelerometer's structure and working principle were discussed in details. The simulation results show that three-axis high shock MEMS accelerometer can bear high shock. After bearing high shock impact in high-shock shooting test, three-axis high shock MEMS accelerometer can obtain the intact metrical information of the penetration process and still guarantee the accurate precision of measurement in high shock load range, so we can not only analyze the law of stress wave spreading and the penetration rule of the penetration process of the body of the missile, but also furnish the testing technology of the burst point controlling. The accelerometer has far-ranging application in recording the typical data that projectile penetrating hard target and furnish both technology guarantees for penetration rule and defend engineering.
MEMS based shock pulse detection sensor for improved rotary Stirling cooler end of life prediction
NASA Astrophysics Data System (ADS)
Hübner, M.; Münzberg, M.
2018-05-01
The widespread use of rotary Stirling coolers in high performance thermal imagers used for critical 24/7 surveillance tasks justifies any effort to significantly enhance the reliability and predictable uptime of those coolers. Typically the lifetime of the whole imaging device is limited due to continuous wear and finally failure of the rotary compressor of the Stirling cooler, especially due to failure of the comprised bearings. MTTF based lifetime predictions, even based on refined MTTF models taking operational scenario dependent scaling factors into account, still lack in precision to forecast accurately the end of life (EOL) of individual coolers. Consequently preventive maintenance of individual coolers to avoid failures of the main sensor in critical operational scenarios are very costly or even useless. We have developed an integrated test method based on `Micro Electromechanical Systems', so called MEMS sensors, which significantly improves the cooler EOL prediction. The recently commercially available MEMS acceleration sensors have mechanical resonance frequencies up to 50 kHz. They are able to detect solid borne shock pulses in the cooler structure, originating from e.g. metal on metal impacts driven by periodical forces acting on moving inner parts of the rotary compressor within wear dependent slack and play. The impact driven transient shock pulse analyses uses only the high frequency signal <10kHz and differs therefore from the commonly used broadband low frequencies vibrational analysis of reciprocating machines. It offers a direct indicator of the individual state of wear. The predictive cooler lifetime model based on the shock pulse analysis is presented and results are discussed.
An investigation into graphene exfoliation and potential graphene application in MEMS devices
NASA Astrophysics Data System (ADS)
Fercana, George; Kletetschka, Gunther; Mikula, Vilem; Li, Mary
2011-02-01
The design of microelectromecanical systems (MEMS) and micro-opto-electromechanical systems (MOEMS) are often materials-limited with respect to the efficiency and capability of the material. Graphene, a one atom thick honeycomb lattice of carbon, is a highly desired material for MEMS applications. Relevant properties of graphene include the material's optical transparency, mechanical strength, energy efficiency, and electrical and thermal conductivity due to its electron mobility. Aforementioned properties make graphene a strong candidate to supplant existing transparent electrode technology and replace the conventionally used material, indium-tin oxide. In this paper we present preliminary results on work toward integration of graphene with MEMS structures. We are studying mechanical exfoliation of highly ordered pyrolytic graphite (HOPG) crystals by repeatedly applying and separating adhesive materials from the HOPG surface. The resulting graphene sheets are then transferred to silicon oxide substrate using the previously applied adhesive material. We explored different adhesive options, particularly the use of Kapton tape, to improve the yield of graphene isolation along with chemical cross-linking agents which operate on a mechanism of photoinsertion of disassociated nitrene groups. These perfluorophenyl nitrenes participate in C=C addition reactions with graphene monolayers creating a covalent binding between the substrate and graphene. We are focusing on maximizing the size of isolated graphene sheets and comparing to conventional exfoliation. Preliminary results allow isolation of few layer graphene (FLG) sheets (n<3) of approximately 10μm x 44μm. Photolithography could possibly be utilized to tailor designs for microshutter technology to be used in future deep space telescopes.
A microelectromechanical accelerometer fabricated using printed circuit processing techniques
NASA Astrophysics Data System (ADS)
Rogers, J. E.; Ramadoss, R.; Ozmun, P. M.; Dean, R. N.
2008-01-01
A microelectromechanical systems (MEMS) capacitive-type accelerometer fabricated using printed circuit processing techniques is presented. A Kapton polymide film is used as the structural layer for fabricating the MEMS accelerometer. The accelerometer proof mass along with four suspension beams is defined in the Kapton polyimide film. The proof mass is suspended above a Teflon substrate using a spacer. The deflection of the proof mass is detected using a pair of capacitive sensing electrodes. The top electrode of the accelerometer is defined on the top surface of the Kapton film. The bottom electrode is defined in the metallization on the Teflon substrate. The initial gap height is determined by the distance between the bottom electrode and the Kapton film. For an applied external acceleration (normal to the proof mass), the proof mass deflects toward or away from the fixed bottom electrode due to inertial force. This deflection causes either a decrease or increase in the air-gap height thereby either increasing or decreasing the capacitance between the top and the bottom electrodes. An example PCB MEMS accelerometer with a square proof mass of membrane area 6.4 mm × 6.4 mm is reported. The measured resonant frequency is 375 Hz and the Q-factor in air is 0.52.
Chen, Jiawen; Li, Jianhua; Li, Yiyuan; Chen, Yulong
2018-01-01
A miniaturized Co-based amorphous wire GMI (Giant magneto-impedance) magnetic sensor was designed and fabricated in this paper. The Co-based amorphous wire was used as the sense element due to its high sensitivity to the magnetic field. A three-dimensional micro coil surrounding the Co-based amorphous wire was fabricated by MEMS (Micro-Electro-Mechanical System) technology, which was used to extract the electrical signal. The three-dimensional micro pick-up coil was designed and simulated with HFSS (High Frequency Structure Simulator) software to determine the key parameters. Surface micro machining MEMS (Micro-Electro-Mechanical System) technology was employed to fabricate the three-dimensional coil. The size of the developed amorphous wire magnetic sensor is 5.6 × 1.5 × 1.1 mm3. Helmholtz coil was used to characterize the performance of the device. The test results of the sensor sample show that the voltage change is 130 mV/Oe and the linearity error is 4.83% in the range of 0~45,000 nT. The results indicate that the developed miniaturized magnetic sensor has high sensitivity. By testing the electrical resistance of the samples, the results also showed high uniformity of each device. PMID:29494477
NASA Astrophysics Data System (ADS)
Liu, Ruiwen; Jiao, Binbin; Kong, Yanmei; Li, Zhigang; Shang, Haiping; Lu, Dike; Gao, Chaoqun; Chen, Dapeng
2013-09-01
Micro-devices with a bi-material-cantilever (BMC) commonly suffer initial curvature due to the mismatch of residual stress. Traditional corrective methods to reduce the residual stress mismatch generally involve the development of different material deposition recipes. In this paper, a new method for reducing residual stress mismatch in a BMC is proposed based on various previously developed deposition recipes. An initial material film is deposited using two or more developed deposition recipes. This first film is designed to introduce a stepped stress gradient, which is then balanced by overlapping a second material film on the first and using appropriate deposition recipes to form a nearly stress-balanced structure. A theoretical model is proposed based on both the moment balance principle and total equal strain at the interface of two adjacent layers. Experimental results and analytical models suggest that the proposed method is effective in producing multi-layer micro cantilevers that display balanced residual stresses. The method provides a generic solution to the problem of mismatched initial stresses which universally exists in micro-electro-mechanical systems (MEMS) devices based on a BMC. Moreover, the method can be incorporated into a MEMS design automation package for efficient design of various multiple material layer devices from MEMS material library and developed deposition recipes.
Wavelength tunable MEMS VCSELs for OCT imaging
NASA Astrophysics Data System (ADS)
Sahoo, Hitesh Kumar; Ansbæk, Thor; Ottaviano, Luisa; Semenova, Elizaveta; Hansen, Ole; Yvind, Kresten
2018-02-01
MEMS VCSELs are one of the most promising swept source (SS) lasers for optical coherence tomography (OCT) and one of the best candidates for future integration with endoscopes, surgical probes and achieving an integrated OCT system. However, the current MEMS-based SS are processed on the III-V wafers, which are small, expensive and challenging to work with. Furthermore, the actuating part, i.e., the MEMS, is on the top of the structure which causes a strong dependence on packaging to decrease its sensitivity to the operating environment. This work addresses these design drawbacks and proposes a novel design framework. The proposed device uses a high contrast grating mirror on a Si MEMS stage as the bottom mirror, all of which is defined in an SOI wafer. The SOI wafer is then bonded to an InP III-V wafer with the desired active layers, thereby sealing the MEMS. Finally, the top mirror, a dielectric DBR (7 pairs of TiO2 - SiO2), is deposited on top. The new device is based on a silicon substrate with MEMS defined on a silicon membrane in an enclosed cavity. Thus the device is much more robust than the existing MEMS VCSELs. This design also enables either a two-way actuation on the MEMS or a smaller optical cavity (pull-away design), i.e., wider FSR (Free Spectral Range) to increase the wavelength sweep. Fabrication of the proposed device is outlined and the results of device characterization are reported.
NASA Astrophysics Data System (ADS)
Sathya, S.; Pavithra, M.; Muruganand, S.
2016-09-01
This paper presents an actuation mechanism based on the interdigitated comb drive MEMS resonator. The important role of that device is to establish MEMS resonators for the second order systems. Comb drive model is one of the basic model which uses the principle of electrostatic and force can be generated for the capacitive sensors. This work is done by overlapping movable and fixed comb fingers which produces an energy. The specific range of the polyimide material properties of young's modulus of 3.1GPa and density of 1300 Kg/m3. Results are shown in the structural domain performance of a lateral motion which corresponds to the applying voltage between the interdigitated comb fingers. It has laterally driven about 40pm with driving voltage. Also the resonance frequency 24Hz and 15Hz with high quality factors are depending on the spring length 260pm and 360pm and structure thickness of 2μm and 5 μm. Here Finite element method (FEM) is used to simulate the various physics scenario and it is designed as two dimensional structure multiphysics domain. The prototype of comb drive MEMS resonator has been suitable for energy harvesting system applications.
Human organ-on-a-chip BioMEMS devices for testing new diagnostic and therapeutic strategies
NASA Astrophysics Data System (ADS)
Leary, James F.; Key, Jaehong; Vidi, Pierre-Alexandre; Cooper, Christy L.; Kole, Ayeeshik; Reece, Lisa M.; Lelièvre, Sophie A.
2013-03-01
MEMS human "organs-on-a-chip" can be used to create model human organ systems for developing new diagnostic and therapeutic strategies. They represent a promising new strategy for rapid testing of new diagnostic and therapeutic approaches without the need for involving risks to human subjects. We are developing multicomponent, superparamagnetic and fluorescent nanoparticles as X-ray and MRI contrast agents for noninvasive multimodal imaging and for antibody- or peptide-targeted drug delivery to tumor and precancerous cells inside these artificial organ MEMS devices. Magnetic fields can be used to move the nanoparticles "upstream" to find their target cells in an organs-on-achip model of human ductal breast cancer. Theoretically, unbound nanoparticles can then be removed by reversing the magnetic field to give a greatly enhanced image of tumor cells within these artificial organ structures. Using branched PDMS microchannels and 3D tissue engineering of normal and malignant human breast cancer cells inside those MEMS channels, we can mimic the early stages of human ductal breast cancer with the goal to improve the sensitivity and resolution of mammography and MRI of very small tumors and test new strategies for treatments. Nanomedical systems can easily be imaged by multicolor confocal microscopy inside the artificial organs to test targeting and therapeutic responses including the differential viability of normal and tumor cells during treatments. Currently we are using 2-dimensional MEMS structures, but these studies can be extended to more complex 3D structures using new 3D printing technologies.
Deformation analysis of MEMS structures by modified digital moiré methods
NASA Astrophysics Data System (ADS)
Liu, Zhanwei; Lou, Xinhao; Gao, Jianxin
2010-11-01
Quantitative deformation analysis of micro-fabricated electromechanical systems is of importance for the design and functional control of microsystems. In this paper, two modified digital moiré processing methods, Gaussian blurring algorithm combined with digital phase shifting and geometrical phase analysis (GPA) technique based on digital moiré method, are developed to quantitatively analyse the deformation behaviour of micro-electro-mechanical system (MEMS) structures. Measuring principles and experimental procedures of the two methods are described in detail. A digital moiré fringe pattern is generated by superimposing a specimen grating etched directly on a microstructure surface with a digital reference grating (DRG). Most of the grating noise is removed from the digital moiré fringes, which enables the phase distribution of the moiré fringes to be obtained directly. Strain measurement result of a MEMS structure demonstrates the feasibility of the two methods.
NASA Astrophysics Data System (ADS)
Bandi, T.; Shea, H.; Neels, A.
2014-06-01
The performance and aging of MEMS often rely on the stability of the mechanical properties over time and under harsh conditions. An overview is given on methods to investigate small variations of the mechanical properties of structural MEMS materials by functional characterization, high-resolution x-ray diffraction methods (HR-XRD) and environmental testing. The measurement of the dynamical properties of micro-resonators is a powerful method for the investigation of elasticity variations in structures relevant to microtechnology. X-ray diffraction techniques are used to analyze residual strains and deformations with high accuracy and in a non-destructive manner at surfaces and in buried micro-structures. The influence of elevated temperatures and radiation damage on the performance of resonant microstructures with a focus on quartz and single crystal silicon is discussed and illustrated with examples including work done in our laboratories at CSEM and EPFL.
NASA Astrophysics Data System (ADS)
Guha, K.; Laskar, N. M.; Gogoi, H. J.; Borah, A. K.; Baishnab, K. L.; Baishya, S.
2017-11-01
This paper presents a new method for the design, modelling and optimization of a uniform serpentine meander based MEMS shunt capacitive switch with perforation on upper beam. The new approach is proposed to improve the Pull-in Voltage performance in a MEMS switch. First a new analytical model of the Pull-in Voltage is proposed using the modified Mejis-Fokkema capacitance model taking care of the nonlinear electrostatic force, the fringing field effect due to beam thickness and etched holes on the beam simultaneously followed by the validation of same with the simulated results of benchmark full 3D FEM solver CoventorWare in a wide range of structural parameter variations. It shows a good agreement with the simulated results. Secondly, an optimization method is presented to determine the optimum configuration of switch for achieving minimum Pull-in voltage considering the proposed analytical mode as objective function. Some high performance Evolutionary Optimization Algorithms have been utilized to obtain the optimum dimensions with less computational cost and complexity. Upon comparing the applied algorithms between each other, the Dragonfly Algorithm is found to be most suitable in terms of minimum Pull-in voltage and higher convergence speed. Optimized values are validated against the simulated results of CoventorWare which shows a very satisfactory results with a small deviation of 0.223 V. In addition to these, the paper proposes, for the first time, a novel algorithmic approach for uniform arrangement of square holes in a given beam area of RF MEMS switch for perforation. The algorithm dynamically accommodates all the square holes within a given beam area such that the maximum space is utilized. This automated arrangement of perforation holes will further improve the computational complexity and design accuracy of the complex design of perforated MEMS switch.
PolyMUMPs MEMS device to measure mechanical stiffness of single cells in aqueous media
NASA Astrophysics Data System (ADS)
Warnat, S.; King, H.; Forbrigger, C.; Hubbard, T.
2015-02-01
A method of experimentally determining the mechanical stiffness of single cells by using differential displacement measurements in a two stage spring system is presented. The spring system consists of a known MEMS reference spring and an unknown cellular stiffness: the ratio of displacements is related to the ratio of stiffness. A polyMUMPs implementation for aqueous media is presented and displacement measurements made from optical microphotographs using a FFT based displacement method with a repeatability of ~20 nm. The approach was first validated on a MEMS two stage spring system of known stiffness. The measured stiffness ratios of control structures (i) MEMS spring systems and (ii) polystyrene microspheres were found to agree with theoretical values. Mechanical tests were then performed on Saccharomyces cerevisiae (Baker’s yeast) in aqueous media. Cells were placed (using a micropipette) inside MEMS measuring structures and compressed between two jaws using an electrostatic actuator and displacements measured. Tested cells showed stiffness values between 5.4 and 8.4 N m-1 with an uncertainty of 11%. In addition, non-viable cells were tested by exposing viable cells to methanol. The resultant mean cell stiffness dropped by factor of 3 × and an explicit discrimination between viable and non-viable cells based on mechanical stiffness was seen.
NASA Astrophysics Data System (ADS)
Jiang, Yuan; Zhang, Menglun; Duan, Xuexin; Zhang, Hao; Pang, Wei
2017-07-01
In this paper, a 2.6 GHz air-gap type thin film piezoelectric MEMS resonator was fabricated on a flexible polyethylene terephthalate film. A fabrication process combining transfer printing and hot-embossing was adopted to form a free-standing structure. The flexible radio frequency MEMS resonator possesses a quality factor of 946 and an effective coupling coefficient of 5.10%, and retains its high performance at a substrate bending radius of 1 cm. The achieved performance is comparable to that of conventional resonators on rigid silicon wafers. Our demonstration provides a viable approach to realizing universal MEMS devices on flexible polymer substrates, which is of great significance for building future fully integrated and multi-functional wireless flexible electronic systems.
Microelectromechanical Systems
NASA Technical Reports Server (NTRS)
Gabriel, Kaigham J.
1995-01-01
Micro-electromechanical systems (MEMS) is an enabling technology that merges computation and communication with sensing and actuation to change the way people and machines interact with the physical world. MEMS is a manufacturing technology that will impact widespread applications including: miniature inertial measurement measurement units for competent munitions and personal navigation; distributed unattended sensors; mass data storage devices; miniature analytical instruments; embedded pressure sensors; non-invasive biomedical sensors; fiber-optics components and networks; distributed aerodynamic control; and on-demand structural strength. The long term goal of ARPA's MEMS program is to merge information processing with sensing and actuation to realize new systems and strategies for both perceiving and controlling systems, processes, and the environment. The MEMS program has three major thrusts: advanced devices and processes, system design, and infrastructure.
NASA Astrophysics Data System (ADS)
Balpande, Suresh S.; Pande, Rajesh S.
2016-04-01
Internet of Things (IoT) uses MEMS sensor nodes and actuators to sense and control objects through Internet. IOT deploys millions of chemical battery driven sensors at different locations which are not reliable many times because of frequent requirement of charging & battery replacement in case of underground laying, placement at harsh environmental conditions, huge count and difference between demand (24 % per year) and availability (energy density growing rate 8% per year). Energy harvester fabricated on silicon wafers have been widely used in manufacturing MEMS structures. These devices require complex fabrication processes, costly chemicals & clean room. In addition to this silicon wafer based devices are not suitable for curved surfaces like pipes, human bodies, organisms, or other arbitrary surface like clothes, structure surfaces which does not have flat and smooth surface always. Therefore, devices based on rigid silicon wafers are not suitable for these applications. Flexible structures are the key solution for this problems. Energy transduction mechanism generates power from free surrounding vibrations or impact. Sensor nodes application has been purposefully selected due to discrete power requirement at low duty cycle. Such nodes require an average power budget in the range of about 0.1 microwatt to 1 mW over a period of 3-5 seconds. Energy harvester is the best alternate source in contrast with battery for sensor node application. Novel design of Energy Harvester based on cheapest flexible non silicon substrate i.e. cellulose acetate substrate have been modeled, simulated and analyzed on COMSOL multiphysics and fabricated using sol-gel spin coating setup. Single cantilever based harvester generates 60-75 mV peak electric potential at 22Hz frequency and approximately 22 µW power at 1K-Ohm load. Cantilever array can be employed for generating higher voltage by replicating this structure. This work covers design, optimization, fabrication of harvester and schottky diodes based voltage multiplier.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Balpande, Suresh S., E-mail: balpandes@rknec.edu; Pande, Rajesh S.
Internet of Things (IoT) uses MEMS sensor nodes and actuators to sense and control objects through Internet. IOT deploys millions of chemical battery driven sensors at different locations which are not reliable many times because of frequent requirement of charging & battery replacement in case of underground laying, placement at harsh environmental conditions, huge count and difference between demand (24 % per year) and availability (energy density growing rate 8% per year). Energy harvester fabricated on silicon wafers have been widely used in manufacturing MEMS structures. These devices require complex fabrication processes, costly chemicals & clean room. In addition tomore » this silicon wafer based devices are not suitable for curved surfaces like pipes, human bodies, organisms, or other arbitrary surface like clothes, structure surfaces which does not have flat and smooth surface always. Therefore, devices based on rigid silicon wafers are not suitable for these applications. Flexible structures are the key solution for this problems. Energy transduction mechanism generates power from free surrounding vibrations or impact. Sensor nodes application has been purposefully selected due to discrete power requirement at low duty cycle. Such nodes require an average power budget in the range of about 0.1 microwatt to 1 mW over a period of 3-5 seconds. Energy harvester is the best alternate source in contrast with battery for sensor node application. Novel design of Energy Harvester based on cheapest flexible non silicon substrate i.e. cellulose acetate substrate have been modeled, simulated and analyzed on COMSOL multiphysics and fabricated using sol-gel spin coating setup. Single cantilever based harvester generates 60-75 mV peak electric potential at 22Hz frequency and approximately 22 µW power at 1K-Ohm load. Cantilever array can be employed for generating higher voltage by replicating this structure. This work covers design, optimization, fabrication of harvester and schottky diodes based voltage multiplier.« less
Tunable cavity resonator including a plurality of MEMS beams
DOE Office of Scientific and Technical Information (OSTI.GOV)
Peroulis, Dimitrios; Fruehling, Adam; Small, Joshua Azariah
A tunable cavity resonator includes a substrate, a cap structure, and a tuning assembly. The cap structure extends from the substrate, and at least one of the substrate and the cap structure defines a resonator cavity. The tuning assembly is positioned at least partially within the resonator cavity. The tuning assembly includes a plurality of fixed-fixed MEMS beams configured for controllable movement relative to the substrate between an activated position and a deactivated position in order to tune a resonant frequency of the tunable cavity resonator.
2012-09-03
described in previous reports [32]. In this experimental technique, the specimen ends are gripped to loadcell and PZT actuator mounted on three dimensional...shown in Figure 3. This was due to the random distribution of columnar grains with different texture where KIC was dependent on one particular grain...Engineering: A, 268 (1-2), pp. 116-126, 1999 [19] C.P. Chen, and M.H. Leipold, "Fracture toughness of silicon", American Ceramics Society Bulletin
Patra, Subir; Ahmed, Hossain; Banerjee, Sourav
2018-01-18
Peridynamic based elastodynamic computation tool named Peri-elastodynamics is proposed herein to simulate the three-dimensional (3D) Lamb wave modes in materials for the first time. Peri-elastodynamics is a nonlocal meshless approach which is a scale-independent generalized technique to visualize the acoustic and ultrasonic waves in plate-like structure, micro-electro-mechanical systems (MEMS) and nanodevices for their respective characterization. In this article, the characteristics of the fundamental Lamb wave modes are simulated in a sample plate-like structure. Lamb wave modes are generated using a surface mounted piezoelectric (PZT) transducer which is actuated from the top surface. The proposed generalized Peri-elastodynamics method is not only capable of simulating two dimensional (2D) in plane wave under plane strain condition formulated previously but also capable of accurately simulating the out of plane Symmetric and Antisymmetric Lamb wave modes in plate like structures in 3D. For structural health monitoring (SHM) of plate-like structures and nondestructive evaluation (NDE) of MEMS devices, it is necessary to simulate the 3D wave-damage interaction scenarios and visualize the different wave features due to damages. Hence, in addition, to simulating the guided ultrasonic wave modes in pristine material, Lamb waves were also simulated in a damaged plate. The accuracy of the proposed technique is verified by comparing the modes generated in the plate and the mode shapes across the thickness of the plate with theoretical wave analysis.
Use of silicon oxynitride as a sacrificial material for microelectromechanical devices
Habermehl, Scott D.; Sniegowski, Jeffry J.
2001-01-01
The use of silicon oxynitride (SiO.sub.x N.sub.y) as a sacrificial material for forming a microelectromechanical (MEM) device is disclosed. Whereas conventional sacrificial materials such as silicon dioxide and silicate glasses are compressively strained, the composition of silicon oxynitride can be selected to be either tensile-strained or substantially-stress-free. Thus, silicon oxynitride can be used in combination with conventional sacrificial materials to limit an accumulation of compressive stress in a MEM device; or alternately the MEM device can be formed entirely with silicon oxynitride. Advantages to be gained from the use of silicon oxynitride as a sacrificial material for a MEM device include the formation of polysilicon members that are substantially free from residual stress, thereby improving the reliability of the MEM device; an ability to form the MEM device with a higher degree of complexity and more layers of structural polysilicon than would be possible using conventional compressively-strained sacrificial materials; and improved manufacturability resulting from the elimination of wafer distortion that can arise from an excess of accumulated stress in conventional sacrificial materials. The present invention is useful for forming many different types of MEM devices including accelerometers, sensors, motors, switches, coded locks, and flow-control devices, with or without integrated electronic circuitry.
NASA Astrophysics Data System (ADS)
Zhou, Kai; Liu, Yong; Si, Liming; Lv, Xin
2013-08-01
An integrated 0.5 THz electromagnetic crystals(EMXT) channel-drop filter based on PBG structure is presented in this paper. A channel-drop filter is a device in which a narrow bandwidth is redirected to another "drop" waveguide while other frequencies are unaffected. It's capable of extracting a certain frequency from a continuous spectrum in the bus channel and passing it to the test channel. It has potential applications in photonic integrated circuits, radio astronomy, THz spectroscopy, THz communication and remote sensing radar receiver. PBG structures(or photonic crystals) are periodic structures which possess band gaps, where the electromagnetic wave of certain ranges of frequencies cannot pass through and is reflected. The proposed channel-drop filter consists of input waveguide,output waveguide and PBG structure. The proposed filter is simulated using the finite element method and can be fabricated by micro-electromechanical systems (MEMS) technology,due to its low cost, high performance and high processing precision.The filter operation principle and fabrication process are discussed.The simulation results show its ability to filter the frequency of 496GHz with a linewidth of approximately 4GHz and transmission of 27.2 dB above background.The loss at resonant frequency is less than 1dB considering the thickness and roughness of gold layer required by the MEMS process.The channel drop efficiency is 84%.
Pang, Cheng; Bae, Hyungdae; Gupta, Ashwani; Bryden, Kenneth; Yu, Miao
2013-09-23
We present a micro-electro-mechanical systems (MEMS) based Fabry-Perot (FP) sensor along with an optical system-on-a-chip (SOC) interrogator for simultaneous pressure and temperature sensing. The sensor employs a simple structure with an air-backed silicon membrane cross-axially bonded to a 45° polished optical fiber. This structure renders two cascaded FP cavities, enabling simultaneous pressure and temperature sensing in close proximity along the optical axis. The optical SOC consists of a broadband source, a MEMS FP tunable filter, a photodetector, and the supporting circuitry, serving as a miniature spectrometer for retrieving the two FP cavity lengths. Within the measured pressure and temperature ranges, experimental results demonstrate that the sensor exhibits a good linear response to external pressure and temperature changes.
Stress Analysis of SiC MEMS Using Raman Spectroscopy
NASA Astrophysics Data System (ADS)
Ness, Stanley J.; Marciniak, M. A.; Lott, J. A.; Starman, L. A.; Busbee, J. D.; Melzak, J. M.
2003-03-01
During the fabrication of Micro-Electro-Mechanical Systems (MEMS), residual stress is often induced in the thin films that are deposited to create these systems. These stresses can cause the device to fail due to buckling, curling, or fracture. Industry is looking for ways to characterize the stress during the deposition of thin films in order to reduce or eliminate device failure. Micro-Raman spectroscopy has been successfully used to characterize poly-Si MEMS devices made with the MUMPS® process. Raman spectroscopy was selected because it is nondestructive, fast and has the potential for in situ stress monitoring. This research attempts to use Raman spectroscopy to analyze the stress in SiC MEMS made with the MUSiC® process. Raman spectroscopy is performed on 1-2-micron-thick SiC thin films deposited on silicon, silicon nitride, and silicon oxide substrates. The most common poly-type of SiC found in thin film MEMS made with the MUSiC® process is 3C-SiC. Research also includes baseline spectra of 6H, 4H, and 15R poly-types of bulk SiC.
Anti-ulcer and ulcer healing potentials of Musa sapientum peel extract in the laboratory rodents.
Onasanwo, Samuel Adetunji; Emikpe, Benjamin Obukowho; Ajah, Austin Azubuike; Elufioye, Taiwo Olayemi
2013-07-01
This study investigated the anti-ulcer and ulcer healing potentials of the methanol extract of Musa sapientum peel in the laboratory rats. Methanol extract of the peels on Musa sapientum (MEMS) was evaluated for its anti-ulcer using alcohol-induced, aspirin-induced, and pyloric ligation-induced models, and for its ulcer healing employing acetic acid-induced ulcer models in rats. The findings from this experiment showed that MEMS (50, 100 and 200 mg/kg, b.w.) anti-ulcer and ulcer healing activity (P ≤ 0.05) is dose-dependent. Also, MEMS exhibited healing of the ulcer base in all the treated groups when compared with the control group. The outcomes of this experiment revealed that the anti-ulcer effect of MEMS may be due to its anti-secretory and cyto-protective activity. The healing of the ulcer base might not be unconnected with basic fibroblast growth factors responsible for epithelial regeneration.
NASA Astrophysics Data System (ADS)
Sarkar, Biplab; Mills, Steven; Lee, Bongmook; Pitts, W. Shepherd; Misra, Veena; Franzon, Paul D.
2018-02-01
In this work, we report on mimicking the synaptic forgetting process using the volatile mem-capacitive effect of a resistive random access memory (RRAM). TiO2 dielectric, which is known to show volatile memory operations due to migration of inherent oxygen vacancies, was used to achieve the volatile mem-capacitive effect. By placing the volatile RRAM candidate along with SiO2 at the gate of a MOS capacitor, a volatile capacitance change resembling the forgetting nature of a human brain is demonstrated. Furthermore, the memory operation in the MOS capacitor does not require a current flow through the gate dielectric indicating the feasibility of obtaining low power memory operations. Thus, the mem-capacitive effect of volatile RRAM candidates can be attractive to the future neuromorphic systems for implementing the forgetting process of a human brain.
NASA Technical Reports Server (NTRS)
Patterson, Richard; Hammoud, Ahmad
2009-01-01
Semiconductor chips based on MEMS (Micro-Electro-Mechanical Systems) technology, such as sensors, transducers, and actuators, are becoming widely used in today s electronics due to their high performance, low power consumption, tolerance to shock and vibration, and immunity to electro-static discharge. In addition, the MEMS fabrication process allows for the miniaturization of individual chips as well as the integration of various electronic circuits into one module, such as system-on-a-chip. These measures would simplify overall system design, reduce parts count and interface, improve reliability, and reduce cost; and they would meet requirements of systems destined for use in space exploration missions. In this work, the performance of a recently-developed MEMS voltage-controlled oscillator was evaluated under a wide temperature range. Operation of this new commercial-off-the-shelf (COTS) device was also assessed under thermal cycling to address some operational conditions of the space environment
MEMS tunable grating micro-spectrometer
NASA Astrophysics Data System (ADS)
Tormen, Maurizio; Lockhart, R.; Niedermann, P.; Overstolz, T.; Hoogerwerf, A.; Mayor, J.-M.; Pierer, J.; Bosshard, C.; Ischer, R.; Voirin, G.; Stanley, R. P.
2017-11-01
The interest in MEMS based Micro-Spectrometers is increasing due to their potential in terms of flexibility as well as cost, low mass, small volume and power savings. This interest, especially in the Near-Infrared and Mid- Infrared, ranges from planetary exploration missions to astronomy, e.g. the search for extra solar planets, as well as to many other terrestrial fields of application such as, industrial quality and surface control, chemical analysis of soil and water, detection of chemical pollutants, exhausted gas analysis, food quality control, process control in pharmaceuticals, to name a few. A compact MEMS-based Spectrometer for Near- Infrared and Mid-InfraRed operation have been conceived, designed and demonstrated. The design based on tunable MEMS blazed grating, developed in the past at CSEM [1], achieves state of the art results in terms of spectral resolution, operational wavelength range, light throughput, overall dimensions, and power consumption.
Design and analysis of a high Q MEMS passive RF filter
NASA Astrophysics Data System (ADS)
Rathee, Vishal; Pande, Rajesh
2016-04-01
Over the past few years, significant growth has been observed in using MEMS based passive components in the RF microelectronics domain, especially in transceiver system. This is due to some excellent properties of the MEMS devices like low loss, low cost and excellent isolation. This paper presents a design of high performance MEMS passive band pass filter, consisting of L and C with improved quality factor and insertion loss less than the reported filters. In this paper we have presented a design of 2nd order band pass filter with 2.4GHz centre frequency and 83MHz bandwidth for Bluetooth application. The simulation results showed improved Q-factor of 34 and Insertion loss of 1.7dB to 1.9dB. The simulation results needs to be validated by fabricating the device, fabrication flow of which is also presented in the paper.
Trück, Johannes; Mitchell, Ruth; Thompson, Amber J; Morales-Aza, Begonia; Clutterbuck, Elizabeth A; Kelly, Dominic F; Finn, Adam; Pollard, Andrew J
2014-01-01
The ELISpot assay is used in vaccine studies for the quantification of antigen-specific memory B cells (B(MEM)), and can be performed using cryopreserved samples. The effects of cryopreservation on B(MEM) detection and the consistency of cultured ELISpot assays when performed by different operators or laboratories are unknown. In this study, blood was taken from healthy volunteers, and a cultured ELISpot assay was used to count B(MEM) specific for 2 routine vaccine antigens (diphtheria and tetanus toxoid). Results were assessed for intra- and inter-operator variation, and the effects of cryopreservation. Cryopreserved samples were shipped to a second laboratory in order to assess inter-laboratory variation. B(MEM) frequencies were very strongly correlated when comparing fresh and frozen samples processed by the same operator, and were also very strongly correlated when comparing 2 operators in the same laboratory. Results were slightly less consistent when samples were processed in different laboratories but correlation between the 2 measurements was still very strong. Although cell viability was reduced in some cryopreserved samples due to higher temperatures during transportation, B(MEM) could still be quantified. These results demonstrate the reproducibility of the ELISpot assay across operators and laboratories, and support the use of cryopreserved samples in future B(MEM) studies.
Powering a leadless pacemaker using a PiezoMEMS energy harvester
NASA Astrophysics Data System (ADS)
Jackson, Nathan; Olszewski, Oskar; O'Murchu, Cian; Mathewson, Alan
2017-06-01
MEMS based vibrational energy harvesting devices have been a highly researched topic over the past decade. The application targeted in this paper focuses on a leadless pacemaker that will be implanted in the right ventricle of the heart. A leadless pacemaker requires the same functionality as a normal pacemaker, but with significantly reduced volume. The reduced volume limits the space for a battery; therefore an energy harvesting device is required. This paper compares varying the dimensions of a linear MEMS based piezoelectric energy harvester that can harvest energy from the mechanical vibrations of the heart due to shock induced vibration. Typical MEMS linear energy harvesting devices operate at high frequency (<50 Hz) with low acceleration (< 1g). The force generated from the heart acts as a series of impulses as opposed to traditional sinusoidal vibration force with high acceleration (1-4 g). Therefore the design of a MEMS harvester that is based on shock-induced vibration is necessary. PiezoMEMS energy harvesting devices consisting of a silicon substrate and mass with aluminium nitride piezoelectric material were developed and characterized using acceleration forces that mimic the heartbeat. Peak powers of up to 25μW were obtained at 1 g acceleration with a powder density of approximately 1.5 mW cm-3.
NASA Astrophysics Data System (ADS)
Francis, Laurent A.; Gkotsis, Petros; Kilchytska, Valeriya; Tang, Xiaohui; Druart, Sylvain; Raskin, Jean-Pierre; Flandre, Denis
2013-03-01
The impact of different types of radiation on the electromechanical properties of materials used in microfabrication and on the capacitive and piezoresistive transduction mechanisms of MEMS is investigated. MEMS technologies could revolutionize avionics, satellite and space applications provided that the stress conditions which can compromise the reliability of microsystems in these environments are well understood. Initial tests with MEMS revealed a vulnerability of some types of devices to radiation induced dielectric charging, a physical mechanism which also affects microelectronics, however integration of novel functional materials in microfabrication and the current trend to substitute SiO2 with high-k dielectrics in ICs pose new questions regarding reliability in radiation environments. The performance of MEMS devices with moving parts could also degrade due to radiation induced changes in the mechanical properties of the materials. It is thus necessary to investigate the effects of radiation on the properties of thin films used in microfabrication and here we report on tests with γ, high energy protons and fast neutrons radiation. Prototype SOI based MEMS magnetometers which were developed in UCL are also used as test vehicles to investigate radiation effects on the reliability of magnetically actuated and capacitively coupled MEMS.
MEMS (Micro-Electro-Mechanical Systems) for Automotive and Consumer Electronics
NASA Astrophysics Data System (ADS)
Marek, Jiri; Gómez, Udo-Martin
MEMS sensors gained over the last two decades an impressive width of applications: (a) ESP: A car is skidding and stabilizes itself without driver intervention (b) Free-fall detection: A laptop falls to the floor and protects the hard drive by parking the read/write drive head automatically before impact. (c) Airbag: An airbag fires before the driver/occupant involved in an impending automotive crash impacts the steering wheel, thereby significantly reducing physical injury risk. MEMS sensors are sensing the environmental conditions and are giving input to electronic control systems. These crucial MEMS sensors are making system reactions to human needs more intelligent, precise, and at much faster reaction rates than humanly possible. Important prerequisites for the success of sensors are their size, functionality, power consumption, and costs. This technical progress in sensor development is realized by micro-machining. The development of these processes was the breakthrough to industrial mass-production for micro-electro-mechanical systems (MEMS). Besides leading-edge micromechanical processes, innovative and robust ASIC designs, thorough simulations of the electrical and mechanical behaviour, a deep understanding of the interactions (mainly over temperature and lifetime) of the package and the mechanical structures are needed. This was achieved over the last 20 years by intense and successful development activities combined with the experience of volume production of billions of sensors. This chapter gives an overview of current MEMS technology, its applications and the market share. The MEMS processes are described, and the challenges of MEMS, compared to standard IC fabrication, are discussed. The evolution of MEMS requirements is presented, and a short survey of MEMS applications is shown. Concepts of newest inertial sensors for ESP-systems are given with an emphasis on the design concepts of the sensing element and the evaluation circuit for achieving excellent noise performance. The chapter concludes with an outlook on arising new MEMS applications such as energy harvester and micro fuel cells.
Finite element based contact analysis of radio frequency MEMs switch membrane surfaces
NASA Astrophysics Data System (ADS)
Liu, Jin-Ya; Chalivendra, Vijaya; Huang, Wenzhen
2017-10-01
Finite element simulations were performed to determine the contact behavior of radio frequency (RF) micro-electro-mechanical (MEM) switch contact surfaces under monotonic and cyclic loading conditions. Atomic force microscopy (AFM) was used to capture the topography of RF-MEM switch membranes and later they were analyzed for multi-scale regular as well as fractal structures. Frictionless, non-adhesive contact 3D finite element analysis was carried out at different length scales to investigate the contact behavior of the regular-fractal surface using an elasto-plastic material model. Dominant micro-scale regular patterns were found to significantly change the contact behavior. Contact areas mainly cluster around the regular pattern. The contribution from the fractal structure is not significant. Under cyclic loading conditions, plastic deformation in the 1st loading/unloading cycle smooth the surface. The subsequent repetitive loading/unloading cycles undergo elastic contact without changing the morphology of the contacting surfaces. The work is expected to shed light on the quality of the switch surface contact as well as the optimum design of RF MEM switch surfaces.
A New MEMS Gyroscope Used for Single-Channel Damping
Zhang, Zengping; Zhang, Wei; Zhang, Fuxue; Wang, Biao
2015-01-01
The silicon micromechanical gyroscope, which will be introduced in this paper, represents a novel MEMS gyroscope concept. It is used for the damping of a single-channel control system of rotating aircraft. It differs from common MEMS gyroscopes in that does not have a drive structure, itself, and only has a sense structure. It is installed on a rotating aircraft, and utilizes the aircraft spin to make its sensing element obtain angular momentum. When the aircraft is subjected to an angular rotation, a periodic Coriolis force is induced in the direction orthogonal to both the angular momentum and the angular velocity input axis. This novel MEMS gyroscope can thus sense angular velocity inputs. The output sensing signal is exactly an amplitude-modulation signal. Its envelope is proportional to the input angular velocity, and the carrier frequency corresponds to the spin frequency of the rotating aircraft, so the MEMS gyroscope can not only sense the transverse angular rotation of an aircraft, but also automatically change the carrier frequency over the change of spin frequency, making it very suitable for the damping of a single-channel control system of a rotating aircraft. In this paper, the motion equation of the MEMS gyroscope has been derived. Then, an analysis has been carried to solve the motion equation and dynamic parameters. Finally, an experimental validation has been done based on a precision three axis rate table. The correlation coefficients between the tested data and the theoretical values are 0.9969, 0.9872 and 0.9842, respectively. These results demonstrate that both the design and sensing mechanism are correct. PMID:25942638
NASA Astrophysics Data System (ADS)
Kenda, A.; Kraft, M.; Tortschanoff, A.; Scherf, Werner; Sandner, T.; Schenk, Harald; Luettjohann, Stephan; Simon, A.
2014-05-01
With a trend towards the use of spectroscopic systems in various fields of science and industry, there is an increasing demand for compact spectrometers. For UV/VIS to the shortwave near-infrared spectral range, compact hand-held polychromator type devices are widely used and have replaced larger conventional instruments in many applications. Still, for longer wavelengths this type of compact spectrometers is lacking suitable and affordable detector arrays. In perennial development Carinthian Tech Research AG together with the Fraunhofer Institute for Photonic Microsystems endeavor to close this gap by developing spectrometer systems based on photonic MEMS. Here, we review on two different spectrometer developments, a scanning grating spectrometer working in the NIR and a FT-spectrometer accessing the mid-IR range up to 14 μm. Both systems are using photonic MEMS devices actuated by in-plane comb drive structures. This principle allows for high mechanical amplitudes at low driving voltages but results in gratings respectively mirrors oscillating harmonically. Both systems feature special MEMS structures as well as aspects in terms of system integration which shall tease out the best possible overall performance on the basis of this technology. However, the advantages of MEMS as enabling technology for high scanning speed, miniaturization, energy efficiency, etc. are pointed out. Whereas the scanning grating spectrometer has already evolved to a product for the point of sale analysis of traditional Chinese medicine products, the purpose of the FT-spectrometer as presented is to demonstrate what is achievable in terms of performance. Current developments topics address MEMS packaging issues towards long term stability, further miniaturization and usability.
NASA Astrophysics Data System (ADS)
Ma, Wenying; Ma, Changwei; Wang, Weimin
2018-03-01
Deformable mirrors (DM) based on microelectromechanical system (MEMS) technology are being applied in adaptive optics (AO) system for astronomical telescopes and human eyes more and more. In this paper a MEMS DM with hexagonal actuator is proposed and designed. The relationship between structural design and performance parameters, mainly actuator coupling, is analyzed carefully and calculated. The optimum value of actuator coupling is obtained. A 7-element DM prototype is fabricated using a commercial available standard three-layer polysilicon surface multi-user-MEMS-processes (PolyMUMPs). Some key performances, including surface figure and voltage-displacement curve, are measured through a 3D white light profiler. The measured performances are very consistent with the theoretical values. The proposed DM will benefit the miniaturization of AO systems and lower their cost.
Review of Polyimides Used in the Manufacturing of Micro Systems
NASA Technical Reports Server (NTRS)
Wilson, William C.; Atkinson, Gary M.
2007-01-01
Since their invention, polyimides have found numerous uses in MicroElectroMechanical Systems (MEMS) technology. Polyimides can act as photoresist, sacrificial layers, structural layers, and even as a replacement for silicon as the substrate during MEMS fabrication. They enable fabrication of both low and high aspect ratio devices. Polyimides have been used to fabricate expendable molds and reusable flexible molds. Development of a variety of devices that employ polyimides for sensor applications has occurred. Micro-robotic actuator applications include hinges, thermal actuators and residual stress actuators. Currently, polyimides are being used to create new sensors and devices for aerospace applications. This paper presents a review of some of the many uses of polyimides in the development of MEMS devices, including a new polyimide based MEMS fabrication process.
Low-voltage high-reliability MEMS switch for millimeter wave 5G applications
NASA Astrophysics Data System (ADS)
Shekhar, Sudhanshu; Vinoy, K. J.; Ananthasuresh, G. K.
2018-07-01
Lack of reliability of radio-frequency microelectromechanical systems (RF MEMS) switches has inhibited their commercial success. Dielectric stiction/breakdown and mechanical shock due to high actuation voltage are common impediments in capacitive MEMS switches. In this work, we report low-actuation voltage RF MEMS switch and its reliability test. Experimental characterization of fabricated devices demonstrate that proposed MEMS switch topology needs very low voltage (4.8 V) for actuation. The mechanical resonant frequency, f 0, quality factor, Q, and switching time are measured to be 8.35 kHz, 1.2, and 33 microsecond, respectively. These MEMS switches have high reliability in terms of switching cycles. Measurements are performed using pulse waveform of magnitude of 6 V under hot-switching condition. Temperature measurement results confirm that the reported switch topology has good thermal stability. The robustness in terms of the measured pull-in voltage shows a variation of 0.08 V °C‑1. Lifetime measurement results after 10 million switching cycles demonstrate insignificant change in the RF performance without any failure. Experimental results show that low voltage improves the lifetime. Low insertion loss (less than 0.6 dB) and improved isolation (above 40 dB) in the frequency range up to 60 GHz have been reported. Measured RF characteristics in the frequency range from 10 MHz to 60 GHz support that these MEMS switches are favorable choice for mm-wave 5G applications.
MEMS micromirrors for optical switching in multichannel spectrophotometers
NASA Astrophysics Data System (ADS)
Tuantranont, Adisorn; Lomas, Tanom; Bright, Victor M.
2004-04-01
This paper reports for the first time that a novel MEMS-based micromirror switch has successfully demonstrated for optical switching in a multi-channel fiber optics spectrophotometer system. The conventional optomechanical fiber optic switches for multi-channel spectrophotometers available in market are bulky, slow, low numbers of channels and expensive. Our foundry MEMS-based micromirror switch designed for integrating with commercially available spectrophotometers offers more compact devices, increased number of probing channels, higher performance and cheaper. Our MEMS-based micromirror switch is a surface micromachined mirror fabricated through MUMPs foundry. The 280 μm x 280 μm gold coated mirror is suspended by the double-gimbal structure for X and Y axis scanning. Self-assembly by solders is used to elevate the torsion mirror 30 μm over the substrate to achieve large scan angle. The solder self-assembly approach dramatically reduces the time to assembly the switch. The scan mirror is electrostatically controlled by applying voltages. The individual probing signal from each probing head is guided by fibers with collimated lenses and incidents on the center of the mirror. The operating scan angle is in the range of 3.5 degrees with driving voltage of 0-100 V. The fastest switching time of 4 millisecond (1 ms rise time and 3 ms fall time) is measured corresponding to the maximum speed of the mirror of 0.25 kHz when the mirror is scanning at +/- 1.5 degrees. The micromirror switch is packaged with a multi-mode fiber bundle using active alignment technique. A centered fiber is the output fiber that is connected to spectrophotometer. Maximum insertion loss of 5 dB has been obtained. The accuracy of measured spectral data is equivalent to the single channel spectrophotometer with a small degradation on probing signal due to fiber coupling.
Long working distance interference microscope
Sinclair, Michael B.; DeBoer, Maarten P.; Smith, Norman F.
2004-04-13
Disclosed is a long working distance interference microscope suitable for three-dimensional imaging and metrology of MEMS devices and test structures on a standard microelectronics probe station. The long working distance of 10-30 mm allows standard probes or probe cards to be used. This enables nanometer-scale 3-D height profiles of MEMS test structures to be acquired across an entire wafer. A well-matched pair of reference/sample objectives is not required, significantly reducing the cost of this microscope, as compared to a Linnik microinterferometer.
Hankins, Matthew G [Albuquerque, NM
2009-10-06
Etchant solutions comprising a redox buffer can be used during the release etch step to reduce damage to the structural layers of a MEMS device that has noble material films. A preferred redox buffer comprises a soluble thiophosphoric acid, ester, or salt that maintains the electrochemical potential of the etchant solution at a level that prevents oxidation of the structural material. Therefore, the redox buffer preferentially oxidizes in place of the structural material. The sacrificial redox buffer thereby protects the exposed structural layers while permitting the dissolution of sacrificial oxide layers during the release etch.
RF MEMS microswitches design and characterization
NASA Astrophysics Data System (ADS)
Lafontan, Xavier; Dufaza, Christian; Robert, Michel; Perez, Guy; Pressecq, Francis
2000-08-01
This paper presents the work performed in MUMPs on RF MEMS micro-switch. Concepts, design and characterization of switches are studied. The study particularly focuses on the electrical resistance characterization and modelization. The switches developed uses two different principle: overflowed gold and hinged beam. The realized contacts exhibited high on resistance (~20(Omega) ) due to nanoscopics asperities of contacts and insulating interfacial films. Results of a typical contact cleaning method are also presented.
A low-loss, single-pole, four-throw RF MEMS switch driven by a double stop comb drive
NASA Astrophysics Data System (ADS)
Kang, S.; Kim, H. C.; Chun, K.
2009-03-01
Our goal was to develop a single-pole four-throw (SP4T) radio frequency microelectromechanical system (RF MEMS) switch for band selection in a multi-band, multi-mode, front-end module of a wireless transceiver system. The SP4T RF MEMS switch was based on an arrangement of four single-pole single-throw (SPST) RF MEMS switches. The SP4T RF MEMS switch was driven by a double stop (DS) comb drive, with a lateral resistive contact, and composed of single crystalline silicon (SCS) on glass. A large contact force at a low-drive voltage was achieved by electrostatic actuation of the DS comb drive. Good RF characteristics were achieved by the large contact force and the lateral resistive Au-to-Au contact. Mechanical reliability was achieved by using SCS which has no residual stress as a structure material. The developed SP4T RF MEMS switch has a drive voltage of 15 V, an insertion loss below 0.31 dB at 6 GHz after more than one million cycles under a 10 mW signal, a return loss above 20 dB and an isolation value above 36 dB.
Integrated otpical monitoring of MEMS for closed-loop control
NASA Astrophysics Data System (ADS)
Dawson, Jeremy M.; Wang, Limin; McCormick, W. B.; Rittenhouse, S. A.; Famouri, Parviz F.; Hornak, Lawrence A.
2003-01-01
Robust control and failure assessment of MEMS employed in physically demanding, mission critical applications will allow for higher degrees of quality assurance in MEMS operation. Device fault detection and closed-loop control require detailed knowledge of the operational states of MEMS over the lifetime of the device, obtained by a means decoupled from the system. Preliminary through-wafer optical monitoring research efforts have shown that through-wafer optical probing is suitable for characterizing and monitoring the behavior of MEMS, and can be implemented in an integrated optical monitoring package for continuous in-situ device monitoring. This presentation will discuss research undertaken to establish integrated optical device metrology for closed-loop control of a MUMPS fabricated lateral harmonic oscillator. Successful linear closed-loop control results using a through-wafer optical microprobe position feedback signal will be presented. A theoretical optical output field intensity study of grating structures, fabricated on the shuttle of the resonator, was performed to improve the position resolution of the optical microprobe position signal. Through-wafer microprobe signals providing a positional resolution of 2 μm using grating structures will be shown, along with initial binary Fresnel diffractive optical microelement design layout, process development, and testing results. Progress in the design, fabrication, and test of integrated optical elements for multiple microprobe signal delivery and recovery will be discussed, as well as simulation of device system model parameter changes for failure assessment.
Cost-effective method of manufacturing a 3D MEMS optical switch
NASA Astrophysics Data System (ADS)
Carr, Emily; Zhang, Ping; Keebaugh, Doug; Chau, Kelvin
2009-02-01
growth of data and video transport networks. All-optical switching eliminates the need for optical-electrical conversion offering the ability to switch optical signals transparently: independent of data rates, formats and wavelength. It also provides network operators much needed automation capabilities to create, monitor and protect optical light paths. To further accelerate the market penetration, it is necessary to identify a path to reduce the manufacturing cost significantly as well as enhance the overall system performance, uniformity and reliability. Currently, most MEMS optical switches are assembled through die level flip-chip bonding with either epoxies or solder bumps. This is due to the alignment accuracy requirements of the switch assembly, defect matching of individual die, and cost of the individual components. In this paper, a wafer level assembly approach is reported based on silicon fusion bonding which aims to reduce the packaging time, defect count and cost through volume production. This approach is successfully demonstrated by the integration of two 6-inch wafers: a mirror array wafer and a "snap-guard" wafer, which provides a mechanical structure on top of the micromirror to prevent electrostatic snap-down. The direct silicon-to-silicon bond eliminates the CTEmismatch and stress issues caused by non-silicon bonding agents. Results from a completed integrated switch assembly will be presented, which demonstrates the reliability and uniformity of some key parameters of this MEMS optical switch.
Design and fabrication of a MEMS chevron-type thermal actuator
DOE Office of Scientific and Technical Information (OSTI.GOV)
Baracu, Angela, E-mail: angela.baracu@imt.ro; Voicu, Rodica; Müller, Raluca
This paper presents the design and fabrication of a MEMS chevron-type thermal actuator. The device was designed for fabrication in the standard MEMS technology, where the topography of the upper layers depends on the patterns of structural and sacrificial layers underneath. The proposed actuator presents some advantages over usual thermal vertical chevron actuators by means of low operating voltages, high output force and linear movement without deformation of the shaft. The device simulations were done using COVENTOR software. The movement obtained by simulation was 12 μm, for a voltage of 0.2 V and the current intensity of 257 mA. Themore » design optimizes the in-plane displacement by fixed anchors and beam inclination angle. Heating is provided by Joule dissipation. The material used for manufacture of chevron-based actuator was aluminum due to its thermal and mechanical properties. The release of the movable part was performed using isotropic dry etching by Reactive Ion Etching (RIE). A first inspection was achieved using Scanning Electron Microscope (SEM). In order to obtain the in-plane displacement we carried out electrical measurements. The thermal actuator can be used for a variety of optical and microassembling applications. This kind of thermal actuator could be integrated easily with other micro devices since its fabrication is compatible with the general semiconductor processes.« less
Wei, Chia-Ling; Lin, Yu-Chen; Chen, Tse-An; Lin, Ren-Yi; Liu, Tin-Hao
2015-02-01
An airflow sensing chip, which integrates MEMS sensors with their CMOS signal processing circuits into a single chip, is proposed for respiration detection. Three micro-cantilever-based airflow sensors were designed and fabricated using a 0.35 μm CMOS/MEMS 2P4M mixed-signal polycide process. Two main differences were present among these three designs: they were either metal-covered or metal-free structures, and had either bridge-type or fixed-type reference resistors. The performances of these sensors were measured and compared, including temperature sensitivity and airflow sensitivity. Based on the measured results, the metal-free structure with fixed-type reference resistors is recommended for use, because it has the highest airflow sensitivity and also can effectively reduce the output voltage drift caused by temperature change.
A new linear structured light module based on the MEMS micromirror
NASA Astrophysics Data System (ADS)
Zhou, Peng; Shen, Wenjiang; Yu, Huijun
2017-10-01
A new linear structured light module based on the Micro-Electro-Mechanical System (MEMS) two-dimensional scanning micromirror was designed and created. This module consists of a laser diode, a convex lens, and the MEMS micromirror. The laser diode generates the light and the convex lens control the laser beam to converge on a single point with large depth of focus. The fast scan in horizontal direction of the micromirror will turn the laser spot into a homogenous laser line. Meanwhile, the slow scan in vertical direction of the micromirror will move the laser line in the vertical direction. The width of the line generated by this module is 300μm and the length is 120mm and the moving distance is 100mm at 30cm away from the module. It will promote the development of industrial detection.
2011-03-01
properties, but would be very difficult to adapt to a MEMS fabrication process. Nitinol was also considered as a structural material for its...such as iron, carbon, hydrogen and oxygen(13). Nitinol was also considered for these wings, but the expense and lead time was too great. Aside
NASA Astrophysics Data System (ADS)
Parro, Rocco J.; Scardelletti, Maximilian C.; Varaljay, Nicholas C.; Zimmerman, Sloan; Zorman, Christian A.
2008-10-01
This paper reports an effort to develop amorphous silicon carbide (a-SiC) films for use in shunt capacitor RF MEMS microbridge-based switches. The films were deposited using methane and silane as the precursor gases. Switches were fabricated using 500 nm and 300 nm-thick a-SiC films to form the microbridges. Switches made from metallized 500 nm-thick SiC films exhibited favorable mechanical performance but poor RF performance. In contrast, switches made from metallized 300 nm-thick SiC films exhibited excellent RF performance but poor mechanical performance. Load-deflection testing of unmetallized and metallized bulk micromachined SiC membranes indicates that the metal layers have a small effect on the Young's modulus of the 500 nm and 300 nm-thick SiC MEMS. As for residual stress, the metal layers have a modest effect on the 500 nm-thick structures, but a significant affect on the residual stress in the 300 nm-thick structures.
Release of MEMS devices with hard-baked polyimide sacrificial layer
NASA Astrophysics Data System (ADS)
Boroumand Azad, Javaneh; Rezadad, Imen; Nath, Janardan; Smith, Evan; Peale, Robert E.
2013-03-01
Removal of polyimides used as sacrificial layer in fabricating MEMS devices can be challenging after hardbaking, which may easily result by the end of multiple-step processing. We consider the specific commercial co-developable polyimide ProLift 100 (Brewer Science). Excessive heat hardens this material, so that during wet release in TMAH based solvents, intact sheets break free from the substrate, move around in the solution, and break delicate structures. On the other hand, dry reactive-ion etching of hard-baked ProLift is so slow, that MEMS structures are damaged from undesirably-prolonged physical bombardment by plasma ions. We found that blanket exposure to ultraviolet light allows rapid dry etch of the ProLift surrounding the desired structures without damaging them. Subsequent removal of ProLift from under the devices can then be safely performed using wet or dry etch. We demonstrate the approach on PECVD-grown silicon-oxide cantilevers of 100 micron × 100 micron area supported 2 microns above the substrate by ~100-micron-long 8-micron-wide oxide arms.
Piezoelectric MEMS: Ferroelectric thin films for MEMS applications
NASA Astrophysics Data System (ADS)
Kanno, Isaku
2018-04-01
In recent years, piezoelectric microelectromechanical systems (MEMS) have attracted attention as next-generation functional microdevices. Typical applications of piezoelectric MEMS are micropumps for inkjet heads or micro-gyrosensors, which are composed of piezoelectric Pb(Zr,Ti)O3 (PZT) thin films and have already been commercialized. In addition, piezoelectric vibration energy harvesters (PVEHs), which are regarded as one of the key devices for Internet of Things (IoT)-related technologies, are promising future applications of piezoelectric MEMS. Significant features of piezoelectric MEMS are their simple structure and high energy conversion efficiency between mechanical and electrical domains even on the microscale. The device performance strongly depends on the function of the piezoelectric thin films, especially on their transverse piezoelectric properties, indicating that the deposition of high-quality piezoelectric thin films is a crucial technology for piezoelectric MEMS. On the other hand, although the difficulty in measuring the precise piezoelectric coefficients of thin films is a serious obstacle in the research and development of piezoelectric thin films, a simple unimorph cantilever measurement method has been proposed to obtain precise values of the direct or converse transverse piezoelectric coefficient of thin films, and recently this method has become to be the standardized testing method. In this article, I will introduce fundamental technologies of piezoelectric thin films and related microdevices, especially focusing on the deposition of PZT thin films and evaluation methods for their transverse piezoelectric properties.
Nonblocking Clos networks of multiple ROADM rings for mega data centers.
Zhao, Li; Ye, Tong; Hu, Weisheng
2015-11-02
Optical networks have been introduced to meet the bandwidth requirement of mega data centers (DC). Most existing approaches are neither scalable to face the massive growth of DCs, nor contention-free enough to provide full bisection bandwidth. To solve this problem, we propose two symmetric network structures: ring-MEMS-ring (RMR) network and MEMS-ring-MEMS (MRM) network based on classical Clos theory. New strategies are introduced to overcome the additional wavelength constraints that did not exist in the traditional Clos network. Two structures that followed the strategies can enable high scalability and nonblocking property simultaneously. The one-to-one correspondence of the RMR and MRM structures to a Clos is verified and the nonblocking conditions are given along with the routing algorithms. Compared to a typical folded-Clos network, both structures are more readily scalable to future mega data centers with 51200 racks while reducing number of long cables significantly. We show that the MRM network is more cost-effective than the RMR network, since the MRM network does not need tunable lasers to achieve nonblocking routing.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Mouro, J.; Gualdino, A.; Chu, V.
2013-11-14
Thin-film silicon allows the fabrication of MEMS devices at low processing temperatures, compatible with monolithic integration in advanced electronic circuits, on large-area, low-cost, and flexible substrates. The most relevant thin-film properties for applications as MEMS structural layers are the deposition rate, electrical conductivity, and mechanical stress. In this work, n{sup +}-type doped hydrogenated amorphous and nanocrystalline silicon thin-films were deposited by RF-PECVD, and the influence of the hydrogen dilution in the reactive mixture, the RF-power coupled to the plasma, the substrate temperature, and the deposition pressure on the structural, electrical, and mechanical properties of the films was studied. Three differentmore » types of silicon films were identified, corresponding to three internal structures: (i) porous amorphous silicon, deposited at high rates and presenting tensile mechanical stress and low electrical conductivity, (ii) dense amorphous silicon, deposited at intermediate rates and presenting compressive mechanical stress and higher values of electrical conductivity, and (iii) nanocrystalline silicon, deposited at very low rates and presenting the highest compressive mechanical stress and electrical conductivity. These results show the combinations of electromechanical material properties available in silicon thin-films and thus allow the optimized selection of a thin silicon film for a given MEMS application. Four representative silicon thin-films were chosen to be used as structural material of electrostatically actuated MEMS microresonators fabricated by surface micromachining. The effect of the mechanical stress of the structural layer was observed to have a great impact on the device resonance frequency, quality factor, and actuation force.« less
Lee, Chiara; Kang, Hae Joo; Hjelm, Anna; Qureshi, Abdul Aziz; Nji, Emmanuel; Choudhury, Hassanul; Beis, Konstantinos; de Gier, Jan-Willem; Drew, David
2014-10-16
Optimising membrane protein production yields in Escherichiacoli can be time- and resource-consuming. Here, we present a simple and effective Membrane protein Single shot amplification recipe: MemStar. This one-shot amplification recipe is based on the E. coli strain Lemo21(DE3), the PASM-5052 auto-induction medium and, contradictorily, an IPTG induction step. Using MemStar, production yields for most bacterial membrane proteins tested were improved to reach an average of 5 mg L(-1) per OD600 unit, which is significantly higher than yields obtained with other common production strategies. With MemStar, we have been able to obtain new structural information for several transporters, including the sodium/proton antiporter NapA. Copyright © 2014 Federation of European Biochemical Societies. Published by Elsevier B.V. All rights reserved.
Thermoelastic damping effect of the micro-ring resonator with irregular mass and stiffness
NASA Astrophysics Data System (ADS)
Kim, Jung-Hwan; Kim, Ji-Hwan
2016-05-01
Fundamentally, vibration characteristic is a main factor for the stability of structures. In this regard, the irregularity of mass and stiffness distributions for the structure have been an interesting issue for many years. Recently, the Micro Electro Mechanical Systems (MEMS) are developed for various applications such as gyro sensors. In the present work, in-plane vibration of micro-ring structure with multiple finite-sized imperfections is investigated. Then, the unbalance of the structure is represented using Heaviside Step Function for the inextensional modeling of the ring. Also, thermoelastic damping (TED) due to internal friction is studied based on Fourier's one-dimensional heat conduction equation using Laplace Transform. To obtain the quality-factors (Q-factors) for imperfect micro-ring, analytical solutions are calculated from governing equations of motion with TED. And then, the natural frequencies and the Q-factors are observed to separate into lower and higher modes. Additionally, the vibration mode shapes are presented, and the frequency trimming concept due to attached imperfections is investigated.
NASA Astrophysics Data System (ADS)
Bhuiyan, M. M. I.; Alamgir, T.; Bhuiyan, M.; Kajihara, M.
2013-12-01
Gradually the electronic devices are getting more compact dimension with respect to the width and thickness. As a result, the contacts are becoming thinner and which leads the contact to be loose and unstable contact. In comercial stamping methode, connector tip diameter should be more than 300μm due to its size limitation. Consequently, the connector contact resistance is becoming higher due to weak contact force. To overcome this problem there were few more basic research using MEMS and Electro Fine Forming (EFF) technology to make high Hertz-Stress Contact (5μm) due to the limitation in the commercial stamping process and the result was in satisfactory level. However, since the MEMS and EFF fabrication is costly therefore, a new method is introduced in this paper using the commercial Phosphor Bronze stamping method to reduce the production cost. Moreover, scribing method is used to make tip on the contact. Accordingly, more compact fine pitch contact is successfully fabricated and tested with 5μm High Hertz Stress without using the MEMS and EFF technology. Hence the manufactured contact resistance becomes less than 20mΩ ±5mΩ.
The MEMS process of a micro friction sensor
NASA Astrophysics Data System (ADS)
Yuan, Ming-Quan; Lei, Qiang; Wang, Xiong
2018-02-01
The research and testing techniques of friction sensor is an important support for hypersonic aircraft. Compared with the conventional skin friction sensor, the MEMS skin friction sensor has the advantages of small size, high sensitivity, good stability and dynamic response. The MEMS skin friction sensor can be integrated with other flow field sensors whose process is compatible with MEMS skin friction sensor to achieve multi-physical measurement of the flow field; and the micro-friction balance sensor array enable to achieve large area and accurate measurement for the near-wall flow. A MEMS skin friction sensor structure is proposed, which sensing element not directly contacted with the flow field. The MEMS fabrication process of the sensing element is described in detail. The thermal silicon oxide is used as the mask to solve the selection ratio problem of silicon DRIE. The optimized process parameters of silicon DRIE: etching power 1600W/LF power 100 W; SF6 flux 360 sccm; C4F8 flux 300 sccm; O2 flux 300 sccm. With Cr/Au mask, etch depth of glass shallow groove can be controlled in 30°C low concentration HF solution; the spray etch and wafer rotate improve the corrosion surface quality of glass shallow groove. The MEMS skin friction sensor samples were fabricated by the above MEMS process, and results show that the error of the length and width of the elastic cantilever is within 2 μm, the depth error of the shallow groove is less than 0.03 μm, and the static capacitance error is within 0.2 pF, which satisfy the design requirements.
Self-Alignment MEMS IMU Method Based on the Rotation Modulation Technique on a Swing Base
Chen, Zhiyong; Yang, Haotian; Wang, Chengbin; Lin, Zhihui; Guo, Meifeng
2018-01-01
The micro-electro-mechanical-system (MEMS) inertial measurement unit (IMU) has been widely used in the field of inertial navigation due to its small size, low cost, and light weight, but aligning MEMS IMUs remains a challenge for researchers. MEMS IMUs have been conventionally aligned on a static base, requiring other sensors, such as magnetometers or satellites, to provide auxiliary information, which limits its application range to some extent. Therefore, improving the alignment accuracy of MEMS IMU as much as possible under swing conditions is of considerable value. This paper proposes an alignment method based on the rotation modulation technique (RMT), which is completely self-aligned, unlike the existing alignment techniques. The effect of the inertial sensor errors is mitigated by rotating the IMU. Then, inertial frame-based alignment using the rotation modulation technique (RMT-IFBA) achieved coarse alignment on the swing base. The strong tracking filter (STF) further improved the alignment accuracy. The performance of the proposed method was validated with a physical experiment, and the results of the alignment showed that the standard deviations of pitch, roll, and heading angle were 0.0140°, 0.0097°, and 0.91°, respectively, which verified the practicality and efficacy of the proposed method for the self-alignment of the MEMS IMU on a swing base. PMID:29649150
Tang, Yee-Chin; Katsuma, Shoji; Fujimoto, Shinji; Hiromoto, Sachiko
2006-11-01
The electrochemical corrosion behaviour of Type 304 and 316L stainless steels was studied in Hanks' solution, Eagle's minimum essential medium (MEM), serum containing medium (MEM with 10% of fetal bovine serum) without cells, and serum containing medium with cells over a 1-week period. Polarization resistance measurements indicated that the stainless steels were resistant to Hanks' and MEM solutions. Type 304 was more susceptible to pitting corrosion than Type 316L in Hanks' and MEM solutions. The uniform corrosion resistance of stainless steels, determined by R(p), was lower in culturing medium than in Hanks' and MEM. The low corrosion resistance was due to surface passive film with less protective to reveal high anodic dissolution rate. When cells were present, the initial corrosion resistance was low, but gradually increased after 3 days, consistent with the trend of cell coverage. The presence of cells was found to suppress the cathodic reaction, that is, oxygen reduction, and increase the uniform corrosion resistance as a consequence. On the other hand, both Type 304 and 316L stainless steels became more susceptible to pitting corrosion when they were covered with cells.
Advanced packaging for Integrated Micro-Instruments
NASA Technical Reports Server (NTRS)
Lyke, James L.
1995-01-01
The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.
Microelectromechanical systems (MEMS) sensors based on lead zirconate titanate (PZT) films
NASA Astrophysics Data System (ADS)
Wang, Li-Peng
2001-12-01
In this thesis, modeling, fabrication and testing of microelectromechanical systems (MEMS) accelerometers based on piezoelectric lead zirconate titanate (PZT) films are investigated. Three different types of structures, cantilever beam, trampoline, and annular diaphragm, are studied. It demonstrates the high-performance, miniaturate, mass-production-compatible, and potentially circuitry-integratable piezoelectric-type PZT MEMS devices. Theoretical models of the cantilever-beam and trampoline accelerometers are derived via structural dynamics and the constitutive equations of piezoelectricity. The time-dependent transverse vibration equations, mode shapes, resonant frequencies, and sensitivities of the accelerometers are calculated through the models. Optimization of the silicon and PZT thickness is achieved with considering the effects of the structural dynamics, the material properties, and manufacturability for different accelerometer specifications. This work is the first demonstration of the fabrication of bulk-micromachined accelerometers combining a deep-trench reactive ion etching (DRIE) release strategy and thick piezoelectric PZT films deposited using a sol-gel method. Processing challenges which are overcome included materials compatibility, metallization, processing of thick layers, double-side processing, deep-trench silicon etching, post-etch cleaning and process integration. In addition, the processed PZT films are characterized by dielectric, ferroelectric (polarization electric-field hysteresis), and piezoelectric measurements and no adverse effects are found. Dynamic frequency response and impedance resonance measurements are performed to ascertain the performance of the MEMS accelerometers. The results show high sensitivities and broad frequency ranges of the piezoelectric-type PZT MEMS accelerometers; the sensitivities range from 0.1 to 7.6 pC/g for resonant frequencies ranging from 44.3 kHz to 3.7 kHz. The sensitivities were compared to theoretical values and a reasonable agreement (˜36% difference) is obtained.
Staging of RF-accelerating Units in a MEMS-based Ion Accelerator
NASA Astrophysics Data System (ADS)
Persaud, A.; Seidl, P. A.; Ji, Q.; Feinberg, E.; Waldron, W. L.; Schenkel, T.; Ardanuc, S.; Vinayakumar, K. B.; Lal, A.
Multiple Electrostatic Quadrupole Array Linear Accelerators (MEQALACs) provide an opportunity to realize compact radio- frequency (RF) accelerator structures that can deliver very high beam currents. MEQALACs have been previously realized with acceleration gap distances and beam aperture sizes of the order of centimeters. Through advances in Micro-Electro-Mechanical Systems (MEMS) fabrication, MEQALACs can now be scaled down to the sub-millimeter regime and batch processed on wafer substrates. In this paper we show first results from using three RF stages in a compact MEMS-based ion accelerator. The results presented show proof-of-concept with accelerator structures formed from printed circuit boards using a 3 × 3 beamlet arrangement and noble gas ions at 10 keV. We present a simple model to describe the measured results. We also discuss some of the scaling behaviour of a compact MEQALAC. The MEMS-based approach enables a low-cost, highly versatile accelerator covering a wide range of currents (10 μA to 100 mA) and beam energies (100 keV to several MeV). Applications include ion-beam analysis, mass spectrometry, materials processing, and at very high beam powers, plasma heating.
Development of amorphous SiC for MEMS-based microbridges
NASA Astrophysics Data System (ADS)
Summers, James B.; Scardelletti, Maximilian; Parro, Rocco; Zorman, Christian A.
2007-02-01
This paper reports our effort to develop amorphous hydrogenated silicon carbide (a-SiC:H) films specifically designed for MEMS-based microbridges using methane and silane as the precursor gases. In our work, the a-SiC:H films were deposited in a simple, commercial PECVD system at a fixed temperature of 300°C. Films with thicknesses from 100 nm to 1000 nm, a typical range for many MEMS applications, were deposited. Deposition parameters such as deposition pressure and methane-to-silane ratio were varied in order to obtain films with suitable residual stresses. Average residual stress in the as-deposited films selected for device fabrication was found by wafer curvature measurements to be -658 +/- 22 MPa, which could be converted to 177 +/- 40 MPa after thermal annealing at 450°C, making them suitable for micromachined bridges, membranes and other anchored structures. Bulk micromachined membranes were constructed to determine the Young's modulus of the annealed films, which was found to be 205 +/- 6 GPa. Chemical inertness was tested in aggressive solutions such as KOH and HF. Prototype microbridge actuators were fabricated using a simple surface micromachining process to assess the potential of the a-SiC:H films as structural layers for MEMS applications.
Staging of RF-accelerating Units in a MEMS-based Ion Accelerator
Persaud, A.; Seidl, P. A.; Ji, Q.; ...
2017-10-26
Multiple Electrostatic Quadrupole Array Linear Accelerators (MEQALACs) provide an opportunity to realize compact radio- frequency (RF) accelerator structures that can deliver very high beam currents. MEQALACs have been previously realized with acceleration gap distances and beam aperture sizes of the order of centimeters. Through advances in Micro-Electro-Mechanical Systems (MEMS) fabrication, MEQALACs can now be scaled down to the sub-millimeter regime and batch processed on wafer substrates. In this paper we show first results from using three RF stages in a compact MEMS-based ion accelerator. The results presented show proof-of-concept with accelerator structures formed from printed circuit boards using a 3more » × 3 beamlet arrangement and noble gas ions at 10 keV. We present a simple model to describe the measured results. We also discuss some of the scaling behaviour of a compact MEQALAC. The MEMS-based approach enables a low-cost, highly versatile accelerator covering a wide range of currents (10 μA to 100 mA) and beam energies (100 keV to several MeV). Applications include ion-beam analysis, mass spectrometry, materials processing, and at very high beam powers, plasma heating.« less
Staging of RF-accelerating Units in a MEMS-based Ion Accelerator
DOE Office of Scientific and Technical Information (OSTI.GOV)
Persaud, A.; Seidl, P. A.; Ji, Q.
Multiple Electrostatic Quadrupole Array Linear Accelerators (MEQALACs) provide an opportunity to realize compact radio- frequency (RF) accelerator structures that can deliver very high beam currents. MEQALACs have been previously realized with acceleration gap distances and beam aperture sizes of the order of centimeters. Through advances in Micro-Electro-Mechanical Systems (MEMS) fabrication, MEQALACs can now be scaled down to the sub-millimeter regime and batch processed on wafer substrates. In this paper we show first results from using three RF stages in a compact MEMS-based ion accelerator. The results presented show proof-of-concept with accelerator structures formed from printed circuit boards using a 3more » × 3 beamlet arrangement and noble gas ions at 10 keV. We present a simple model to describe the measured results. We also discuss some of the scaling behaviour of a compact MEQALAC. The MEMS-based approach enables a low-cost, highly versatile accelerator covering a wide range of currents (10 μA to 100 mA) and beam energies (100 keV to several MeV). Applications include ion-beam analysis, mass spectrometry, materials processing, and at very high beam powers, plasma heating.« less
Anti-ulcer and ulcer healing potentials of Musa sapientum peel extract in the laboratory rodents
Onasanwo, Samuel Adetunji; Emikpe, Benjamin Obukowho; Ajah, Austin Azubuike; Elufioye, Taiwo Olayemi
2013-01-01
Background: This study investigated the anti-ulcer and ulcer healing potentials of the methanol extract of Musa sapientum peel in the laboratory rats. Materials and Methods: Methanol extract of the peels on Musa sapientum (MEMS) was evaluated for its anti-ulcer using alcohol-induced, aspirin-induced, and pyloric ligation-induced models, and for its ulcer healing employing acetic acid-induced ulcer models in rats. Results: The findings from this experiment showed that MEMS (50, 100 and 200 mg/kg, b.w.) anti-ulcer and ulcer healing activity (P ≤ 0.05) is dose-dependent. Also, MEMS exhibited healing of the ulcer base in all the treated groups when compared with the control group. Conclusion: The outcomes of this experiment revealed that the anti-ulcer effect of MEMS may be due to its anti-secretory and cyto-protective activity. The healing of the ulcer base might not be unconnected with basic fibroblast growth factors responsible for epithelial regeneration. PMID:23900937
Bistable microelectromechanical actuator
Fleming, James G.
1999-01-01
A bistable microelectromechanical (MEM) actuator is formed on a substrate and includes a stressed membrane of generally rectangular shape that upon release assumes a curvilinear cross-sectional shape due to attachment at a midpoint to a resilient member and at opposing edges to a pair of elongate supports. The stressed membrane can be electrostatically switched between a pair of mechanical states having mirror-image symmetry, with the MEM actuator remaining in a quiescent state after a programming voltage is removed. The bistable MEM actuator according to various embodiments of the present invention can be used to form a nonvolatile memory element, an optical modulator (with a pair of mirrors supported above the membrane and moving in synchronism as the membrane is switched), a switchable mirror (with a single mirror supported above the membrane at the midpoint thereof) and a latching relay (with a pair of contacts that open and close as the membrane is switched). Arrays of bistable MEM actuators can be formed for applications including nonvolatile memories, optical displays and optical computing.
Bistable microelectromechanical actuator
Fleming, J.G.
1999-02-02
A bistable microelectromechanical (MEM) actuator is formed on a substrate and includes a stressed membrane of generally rectangular shape that upon release assumes a curvilinear cross-sectional shape due to attachment at a midpoint to a resilient member and at opposing edges to a pair of elongate supports. The stressed membrane can be electrostatically switched between a pair of mechanical states having mirror-image symmetry, with the MEM actuator remaining in a quiescent state after a programming voltage is removed. The bistable MEM actuator according to various embodiments of the present invention can be used to form a nonvolatile memory element, an optical modulator (with a pair of mirrors supported above the membrane and moving in synchronism as the membrane is switched), a switchable mirror (with a single mirror supported above the membrane at the midpoint thereof) and a latching relay (with a pair of contacts that open and close as the membrane is switched). Arrays of bistable MEM actuators can be formed for applications including nonvolatile memories, optical displays and optical computing. 49 figs.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Jung, H.; Gerasopoulos, K.; Gnerlich, Markus
This work presents the first demonstration of a MEMS optical sensor for in-situ, real-time monitoring of both mechanical and chemical structure evolutions in a V2O5 lithium-ion battery (LIB) cathode during battery operation. A reflective membrane forms one side of a Fabry-Perot (FP) interferometer, while the other side is coated with V2O5 and exposed to electrolyte in a half-cell LIB. Using one microscope and two laser sources, both the induced membrane deflection and the corresponding Raman intensity changes are observed during lithium cycling. Results are in good agreement with the expected mechanical behavior and disorder change of the V2O5 layers, highlightingmore » the significant potential of MEMS as enabling tools for advanced scientific investigations.« less
Liquid Tunable Microlenses based on MEMS techniques
Zeng, Xuefeng; Jiang, Hongrui
2013-01-01
The recent rapid development in microlens technology has provided many opportunities for miniaturized optical systems, and has found a wide range of applications. Of these microlenses, tunable-focus microlenses are of special interest as their focal lengths can be tuned using micro-scale actuators integrated with the lens structure. Realization of such tunable microlens generally relies on the microelectromechanical system (MEMS) technologies. Here, we review the recent progress in tunable liquid microlenses. The underlying physics relevant to these microlenses are first discussed, followed by description of three main categories of tunable microlenses involving MEMS techniques, mechanically driven, electrically driven, and those integrated within microfluidic systems. PMID:24163480
PLL application research of a broadband MEMS phase detector: Theory, measurement and modeling
NASA Astrophysics Data System (ADS)
Han, Juzheng; Liao, Xiaoping
2017-06-01
This paper evaluates the capability of a broadband MEMS phase detector in the application of phase locked loops (PLLs) through the aspect of theory, measurement and modeling. For the first time, it demonstrates how broadband property and optimized structure are realized through cascaded transmission lines and ANSYS simulations. The broadband MEMS phase detector shows potential in PLL application for its dc voltage output and large power handling ability which is important for munition applications. S-parameters of the power combiner in the MEMS phase detector are measured with S11 better than -15 dB and S23 better than -10 dB over the whole X-band. Compared to our previous works, developed phase detection measurements are performed and focused on signals at larger power levels up to 1 W. Cosine tendencies are revealed between the output voltage and the phase difference for both small and large signals. Simulation approach through equivalent circuit modeling is proposed to study the PLL application of the broadband MEMS phase detector. Synchronization and tracking properties are revealed.
Diffraction-Based Optical Switching with MEMS
Blanche, Pierre-Alexandre; LaComb, Lloyd; Wang, Youmin; ...
2017-04-19
In this article, we are presenting an overview of MEMS-based (Micro-Electro-Mechanical System) optical switch technology starting from the reflective two-dimensional (2D) and three-dimensional (3D) MEMS implementations. To further increase the speed of the MEMS from these devices, the mirror size needs to be reduced. Small mirror size prevents efficient reflection but favors a diffraction-based approach. Two implementations have been demonstrated, one using the Texas Instruments DLP (Digital Light Processing), and the other an LCoS-based (Liquid Crystal on Silicon) SLM (Spatial Light Modulator). These switches demonstrated the benefit of diffraction, by independently achieving high speed, efficiency, and high number of ports.more » We also demonstrated for the first time that PSK (Phase Shift Keying) modulation format can be used with diffraction-based devices. To be truly effective in diffraction mode, the MEMS pixels should modulate the phase of the incident light. We are presenting our past and current efforts to manufacture a new type of MEMS where the pixels are moving in the vertical direction. The original structure is a 32 x 32 phase modulator array with high contrast grating pixels, and we are introducing a new sub-wavelength linear array capable of a 310 kHz modulation rate« less
Diffraction-Based Optical Switching with MEMS
DOE Office of Scientific and Technical Information (OSTI.GOV)
Blanche, Pierre-Alexandre; LaComb, Lloyd; Wang, Youmin
In this article, we are presenting an overview of MEMS-based (Micro-Electro-Mechanical System) optical switch technology starting from the reflective two-dimensional (2D) and three-dimensional (3D) MEMS implementations. To further increase the speed of the MEMS from these devices, the mirror size needs to be reduced. Small mirror size prevents efficient reflection but favors a diffraction-based approach. Two implementations have been demonstrated, one using the Texas Instruments DLP (Digital Light Processing), and the other an LCoS-based (Liquid Crystal on Silicon) SLM (Spatial Light Modulator). These switches demonstrated the benefit of diffraction, by independently achieving high speed, efficiency, and high number of ports.more » We also demonstrated for the first time that PSK (Phase Shift Keying) modulation format can be used with diffraction-based devices. To be truly effective in diffraction mode, the MEMS pixels should modulate the phase of the incident light. We are presenting our past and current efforts to manufacture a new type of MEMS where the pixels are moving in the vertical direction. The original structure is a 32 x 32 phase modulator array with high contrast grating pixels, and we are introducing a new sub-wavelength linear array capable of a 310 kHz modulation rate« less
Large-aperture MOEMS Fabry-Perot interferometer for miniaturized spectral imagers
NASA Astrophysics Data System (ADS)
Rissanen, Anna; Langner, Andreas; Viherkanto, Kai; Mannila, Rami
2015-02-01
VTT's optical MEMS Fabry-Perot interferometers (FPIs) are tunable optical filters, which enable miniaturization of spectral imagers into small, mass producible hand-held sensors with versatile optical measurement capabilities. FPI technology has also created a basis for various hyperspectral imaging instruments, ranging from nanosatellites, environmental sensing and precision agriculture with UAVs to instruments for skin cancer detection. Until now, these application demonstrations have been mostly realized with piezo-actuated FPIs fabricated by non-monolithical assembly method, suitable for achieving very large optical apertures and with capacity to small-to-medium volumes; however large-volume production of MEMS manufacturing supports the potential for emerging spectral imaging applications also in large-volume applications, such as in consumer/mobile products. Previously reported optical apertures of MEMS FPIs in the visible range have been up to 2 mm in size; this paper presents the design, successful fabrication and characterization of MEMS FPIs for central wavelengths of λ = 500 nm and λ = 650 nm with optical apertures up to 4 mm in diameter. The mirror membranes of the FPI structures consist of ALD (atomic layer deposited) TiO2-Al2O3 λ/4- thin film Bragg reflectors, with the air gap formed by sacrificial polymer etching in O2 plasma. The entire fabrication process is conducted below 150 °C, which makes it possible to monolithically integrate the filter structures on other ICdevices such as detectors. The realized MEMS devices are aimed for nanosatellite space application as breadboard hyperspectral imager demonstrators.
NASA Astrophysics Data System (ADS)
Sullivan, J. P.
2002-03-01
Pure carbon films can exhibit surprising complexity in structure and properties. Amorphous diamond (tetrahedrally-coordinated amorphous carbon) is an amorphous quasi-two phase mixture of four-fold and three-fold coordinated carbon which is produced by pulsed excimer laser deposition, an energetic deposition process that leads to film growth by sub-surface carbon implantation and the creation of local metastability in carbon bonding. Modest annealing, < 900K, produces significant irreversible strain relaxation which is thermally activated with activation energies ranging from < 1 eV to > 2 eV. During annealing the material remains amorphous, but there is a detectable increase in medium-range order as measured by fluctuation microscopy. The strain relaxation permits the residual strain in the films to be reduced to < 0.00001, which is a critical requirement for the fabrication of microelectromechanical systems (MEMS). Amorphous diamond MEMS have been fabricated in order to evaluate the mechanical properties of this material under tension and flexure, and this has enabled the determination of elastic modulus (800 GPa), tensile strength (8 GPa), and fracture toughness (8 MPa m^1/2). In addition, amorphous diamond MEMS structures have been fabricated to measure internal dissipation and surface adhesion. The high hardness and strength and hydrophobic nature of the surface makes this material particularly suitable for the fabrication of high wear resistance and low stiction MEMS. Sandia is a multiprogram laboratory operated by Sandia Corp., a Lockheed Martin Co., for the U.S. Dept. of Energy under contract DE-AC04-94AL85000.
Faster sensitivity and non-antimonite permanent photoresist for MEMS
NASA Astrophysics Data System (ADS)
Misumi, Koichi; Saito, Koji; Yamanouchi, Atsushi; Senzaki, Takahiro; Okui, Toshiki; Honma, Hideo
2006-03-01
Micro Electro Mechanical Systems (MEMS) is a three-dimensional micro-fabrication technology based on photolithography. The fields of application are extensive and wide-ranging. Among the applications, those that have already acquired a large market include acceleration sensors for airbags of automobiles, pressure sensors for engine control, inkjet printer heads and thin film magnetic heads. The market is expected to further expand in the optic and biology-related fields in the future. In the MEMS field, the packaging accounts for the cost, and it is difficult to standardize due to the low production volume of highly specific technology application. A typical application in the MEMS process would be to conduct plating and etching (Deep RIE) through an intermediate layer of photoresist patterns, but there are cases where the photoresist itself is left therein as a permanent film. A photoresist composed of epoxy resin as the main component can form the permanent film through a catalyst of the optical cationic polymerizating initiator. In general, the optical cationic polymerizating initiator is of onium salt with antimonite as the anion group due to the nature of the hardening rate or the exposure energy. This paper presents the development status of a high sensitivity permanent photoresist made of epoxy resin as the main component with non-antimonite optical cationic polymerizating initiator with concerns to the impact to the environment and material for packaging.
NASA Astrophysics Data System (ADS)
Jang, Munseon; Yun, Kwang-Seok
2017-12-01
In this paper, we presents a MEMS pressure sensor integrated with a readout circuit on a chip for an on-chip signal processing. The capacitive pressure sensor is formed on a CMOS chip by using a post-CMOS MEMS processes. The proposed device consists of a sensing capacitor that is square in shape, a reference capacitor and a readout circuitry based on a switched-capacitor scheme to detect capacitance change at various environmental pressures. The readout circuit was implemented by using a commercial 0.35 μm CMOS process with 2 polysilicon and 4 metal layers. Then, the pressure sensor was formed by wet etching of metal 2 layer through via hole structures. Experimental results show that the MEMS pressure sensor has a sensitivity of 11 mV/100 kPa at the pressure range of 100-400 kPa.
MEMS high-speed angular-position sensing system with rf wireless transmission
NASA Astrophysics Data System (ADS)
Sun, Winston; Li, Wen J.
2001-08-01
A novel surface-micromachined non-contact high-speed angular-position sensor with total surface area under 4mm2 was developed using the Multi-User MEMS Processes (MUMPs) and integrated with a commercial RF transmitter at 433MHz carrier frequency for wireless signal detection. Currently, a 2.3 MHz internal clock of our data acquisition system and a sensor design with a 13mg seismic mass is sufficient to provide visual observation of a clear sinusoidal response wirelessly generated by the piezoresistive angular-position sensing system within speed range of 180 rpm to around 1000 rpm. Experimental results showed that the oscillation frequency and amplitude are related to the input angular frequency of the rotation disk and the tilt angle of the rotation axis, respectively. These important results could provide groundwork for MEMS researchers to estimate how gravity influences structural properties of MEMS devices under different circumstances.
NASA Astrophysics Data System (ADS)
Inoue, Shunya; Nishimura, Shun; Nakahama, Masanori; Matsutani, Akihiro; Sakaguchi, Takahiro; Koyama, Fumio
2018-04-01
For use in wavelength division multiplexing (WDM) with high-speed wavelength routing functions, the fast wavelength switching of tunable lasers is a key function. A tunable MEMS vertical cavity surface emitting laser (VCSEL) is a good candidate as a light source for this purpose. The cantilever in MEMS VCSELs has a high mechanical resonance frequency thanks to its small size, but the switching time is limited by the ringing of the cantilever structure. In this paper, we analyzed the mechanical behavior of a cantilever MEMS mirror and demonstrated ringing-free operation with an engineered voltage signal. The applied voltage waveform was optimized in a two-step format and we experimentally obtained ringing free wavelength switching. We measured the transient response of the wavelength by inserting a tunable filter, exhibiting the settling time of less than 2.5 µs, which corresponds to a half period of the cantilever resonance frequency.
CARES/Life Used for Probabilistic Characterization of MEMS Pressure Sensor Membranes
NASA Technical Reports Server (NTRS)
Nemeth, Noel N.
2002-01-01
Microelectromechanical systems (MEMS) devices are typically made from brittle materials such as silicon using traditional semiconductor manufacturing techniques. They can be etched (or micromachined) from larger structures or can be built up with material deposition processes. Maintaining dimensional control and consistent mechanical properties is considerably more difficult for MEMS because feature size is on the micrometer scale. Therefore, the application of probabilistic design methodology becomes necessary for MEMS. This was demonstrated at the NASA Glenn Research Center and Case Western Reserve University in an investigation that used the NASA-developed CARES/Life brittle material design program to study the probabilistic fracture strength behavior of single-crystal SiC, polycrystalline SiC, and amorphous Si3N4 pressurized 1-mm-square thin-film diaphragms. These materials are of interest because of their superior high-temperature characteristics, which are desirable for harsh environment applications such as turbine engine and rocket propulsion system hot sections.
New Research on MEMS Acoustic Vector Sensors Used in Pipeline Ground Markers
Song, Xiaopeng; Jian, Zeming; Zhang, Guojun; Liu, Mengran; Guo, Nan; Zhang, Wendong
2015-01-01
According to the demands of current pipeline detection systems, the above-ground marker (AGM) system based on sound detection principle has been a major development trend in pipeline technology. A novel MEMS acoustic vector sensor for AGM systems which has advantages of high sensitivity, high signal-to-noise ratio (SNR), and good low frequency performance has been put forward. Firstly, it is presented that the frequency of the detected sound signal is concentrated in a lower frequency range, and the sound attenuation is relatively low in soil. Secondly, the MEMS acoustic vector sensor structure and basic principles are introduced. Finally, experimental tests are conducted and the results show that in the range of 0°∼90°, when r = 5 m, the proposed MEMS acoustic vector sensor can effectively detect sound signals in soil. The measurement errors of all angles are less than 5°. PMID:25609046
Park, J H; Garipov, G K; Jeon, J A; Khrenov, B A; Kim, J E; Kim, M; Kim, Y K; Lee, C-H; Lee, J; Na, G W; Nam, S; Park, I H; Park, Y-S
2008-12-08
We introduce a novel telescope consisting of a pinhole-like camera with rotatable MEMS micromirrors substituting for pinholes. The design is ideal for observations of transient luminous phenomena or fast-moving objects, such as upper atmospheric lightning and bright gamma ray bursts. The advantage of the MEMS "obscura telescope" over conventional cameras is that it is capable both of searching for events over a wide field of view, and fast zooming to allow detailed investigation of the structure of events. It is also able to track the triggering object to investigate its space-time development, and to center the interesting portion of the image on the photodetector array. We present the proposed system and the test results for the MEMS obscura telescope which has a field of view of 11.3 degrees, sixteen times zoom-in and tracking within 1 ms. (c) 2008 Optical Society of America
Nanocharacterization of the adhesion effect and bending stiffness in optical MEMS
NASA Astrophysics Data System (ADS)
Pustan, Marius; Birleanu, Corina; Dudescu, Cristian
2017-11-01
The scope of this paper is the reliability design and testing of flexible MEMS components as clamp-clamp beams for the out-of-plane displacement. The field of implementation of such structures is in optical relevant applications such as the optical microsensors or optical microswitches. Moreover these structures can be successfully implemented in RF switches or in the other MEMS applications. The research studies presented in this paper consider the analytical and numerical analysis follow by the experimental validation. The mechanical and tribological characteristics such as the sample static response under an applied force and the adhesion effect between the flexible structure and substrate are investigated. The samples under test are fabricated from a reflective material - gold. Experimental investigations are performed by atomic force microscopy in order to determine the response of the gold microbridges under an applied force. Moreover, to identify the proper geometry that is less sensitive to a thermal gradient, different geometrical configurations of microbridges are tested under different temperatures. An etalon structure is considered as a reference beam and it is compared with the other samples fabricated in the same geometrical dimensions but with some additional rectangular holes performed on the flexible plate. The scope of holes is to reduce the temperature influence on the mechanical behaviour of clamp-clamp beam from application where a thermal gradient occurs. During numerical analysis and experimental investigations, the temperature of samples is increased from 20 °C to 100 °C and the sample response is monitored. A comparison between numerical and experimental results is provided at the end of paper. The research results are useful for designers to predict the behaviour of material and structure from optical or thermal applications in order to improve the reliability and the MEMS lifetime.
Self-assembly micro optical filter
NASA Astrophysics Data System (ADS)
Zhang, Ping (Cerina); Le, Kevin; Malalur-Nagaraja-Rao, Smitha; Hsu, Lun-Chen; Chiao, J.-C.
2006-01-01
Optical communication and sensor industry face critical challenges in manufacturing for system integration. Due to the assembly complexity and integration platform variety, micro optical components require costly alignment and assembly procedures, in which many required manual efforts. Consequently, self-assembly device architectures have become a great interest and could provide major advantages over the conventional optical devices. In this paper, we discussed a self-assembly integration platform for micro optical components. To demonstrate the adaptability and flexibility of the proposed optical device architectures, we chose a commercially available MEMS fabrication foundry service - MUMPs (Multi-User MEMS Process). In this work, polysilicon layers of MUMPS are used as the 3-D structural material for construction of micro component framework and actuators. However, because the polysilicon has high absorption in the visible and near infrared wavelength ranges, it is not suitable for optical interaction. To demonstrate the required optical performance, hybrid integration of materials was proposed and implemented. Organic compound materials were applied on the silicon-based framework to form the required optical interfaces. Organic compounds provide good optical transparency, flexibility to form filters or lens and inexpensive manufacturing procedures. In this paper, we have demonstrated a micro optical filter integrated with self-assembly structures. We will discuss the self-assembly mechanism, optical filter designs, fabrication issues and results.
Generation of Controllable Time-Mean Microvortices to Mimic Insect Flights
2010-01-01
force to drive the suspended MEMs-based microplate to in-plane resonance. 15. SUBJECT TERMS Fluid Mechanics, Micro Air Vehicles (MAVs), Microvortices...suspended MEMS-based microplate to in-plane resonance. Briefly, AC current flows through suspended beam-like microelectrode structure – a microplate ... microplate . As a result, the observed flow features are time-mean microvortices. Computational effort centers around optimization of a range of
Method of forming a package for MEMS-based fuel cell
Morse, Jeffrey D; Jankowski, Alan F
2013-05-21
A MEMS-based fuel cell package and method thereof is disclosed. The fuel cell package comprises seven layers: (1) a sub-package fuel reservoir interface layer, (2) an anode manifold support layer, (3) a fuel/anode manifold and resistive heater layer, (4) a Thick Film Microporous Flow Host Structure layer containing a fuel cell, (5) an air manifold layer, (6) a cathode manifold support structure layer, and (7) a cap. Fuel cell packages with more than one fuel cell are formed by positioning stacks of these layers in series and/or parallel. The fuel cell package materials such as a molded plastic or a ceramic green tape material can be patterned, aligned and stacked to form three dimensional microfluidic channels that provide electrical feedthroughs from various layers which are bonded together and mechanically support a MEMS-based miniature fuel cell. The package incorporates resistive heating elements to control the temperature of the fuel cell stack. The package is fired to form a bond between the layers and one or more microporous flow host structures containing fuel cells are inserted within the Thick Film Microporous Flow Host Structure layer of the package.
Integrated MEMS-based variable optical attenuator and 10Gb/s receiver
NASA Astrophysics Data System (ADS)
Aberson, James; Cusin, Pierre; Fettig, H.; Hickey, Ryan; Wylde, James
2005-03-01
MEMS devices can be successfully commercialized in favour of competing technologies only if they offer an advantage to the customer in terms of lower cost or increased functionality. There are limited markets where MEMS can be manufactured cheaper than similar technologies due to large volumes: automotive, printing technology, wireless communications, etc. However, success in the marketplace can also be realized by adding significant value to a system at minimal cost or leverging MEMS technology when other solutions simply will not work. This paper describes a thermally actuated, MEMS based, variable optical attenuator that is co-packaged with existing opto-electronic devices to develop an integrated 10Gb/s SONET/SDH receiver. The configuration of the receiver opto-electronics and relatively low voltage availability (12V max) in optical systems bar the use of LCD, EO, and electro-chromic style attenuators. The device was designed and fabricated using a silicon-on-insulator (SOI) starting material. The design and performance of the device (displacement, power consumption, reliability, physical geometry) was defined by the receiver parameters geometry. This paper will describe how these design parameters (hence final device geometry) were determined in light of both the MEMS device fabrication process and the receiver performance. Reference will be made to the design tools used and the design flow which was a joint effort between the MEMS vendor and the end customer. The SOI technology offered a robust, manufacturable solution that gave the required performance in a cost-effective process. However, the singulation of the devices required the development of a new singulation technique that allowed large volumes of silicon to be removed during fabrication yet still offer high singulation yields.
The MEMS Knudsen Compressor as a Vacuum Pump for Space Exploration Applications
NASA Technical Reports Server (NTRS)
Vargo, S. E.; Muntz, E. P.; Tang, W. C.
2000-01-01
Several lander, probe and rover missions currently under study at the Jet Propulsion Laboratory (JPL) and especially in the Microdevices Laboratory (MDL) Center for Space Microelectronics Technology, focus on utilizing microelectromechanical systems (MEMS) based instruments for science data gathering. These small instruments and NASA's commitment to "faster, better, cheaper" type missions has brought about the need for novel approaches to satisfying mission requirements. Existing in-situ instrument systems clearly lack novel and integrated methods for satisfying their vacuum needs. One attractive candidate for a MEMS vacuum pump is the Knudsen Compressor, which operates based on thermal transpiration. Thermal transpiration describes gas flows induced by temperature differences maintained across orifices, porous membranes or capillary tubes under rarefied conditions. This device has two overwhelmingly attractive features as a MEMS vacuum pump - no moving parts and no fluids. An initial estimate of a Knudsen Compressor's pumping power requirements for a surface atmospheric sampling task on Mars is less than 80 mW, significantly below than alternative pumps. Due to the relatively low energy use for this task and the applicability of the Knudsen Compressor to other applications, the development of a Knudsen Compressor utilizing MEMS fabrication techniques has been initiated. This paper discusses the initial fabrication of a single-stage MEMS Knudsen Compressor vacuum pump, provides performance criteria such as pumping speed, size, energy use and ultimate pressure and details vacuum pump applications in several MDL related in-situ instruments.
Gao, Lili; Zhou, Zai-Fa; Huang, Qing-An
2017-11-08
A microstructure beam is one of the fundamental elements in MEMS devices like cantilever sensors, RF/optical switches, varactors, resonators, etc. It is still difficult to precisely predict the performance of MEMS beams with the current available simulators due to the inevitable process deviations. Feasible numerical methods are required and can be used to improve the yield and profits of the MEMS devices. In this work, process deviations are considered to be stochastic variables, and a newly-developed numerical method, i.e., generalized polynomial chaos (GPC), is applied for the simulation of the MEMS beam. The doubly-clamped polybeam has been utilized to verify the accuracy of GPC, compared with our Monte Carlo (MC) approaches. Performance predictions have been made on the residual stress by achieving its distributions in GaAs Monolithic Microwave Integrated Circuit (MMIC)-based MEMS beams. The results show that errors are within 1% for the results of GPC approximations compared with the MC simulations. Appropriate choices of the 4-order GPC expansions with orthogonal terms have also succeeded in reducing the MC simulation labor. The mean value of the residual stress, concluded from experimental tests, shares an error about 1.1% with that of the 4-order GPC method. It takes a probability around 54.3% for the 4-order GPC approximation to attain the mean test value of the residual stress. The corresponding yield occupies over 90 percent around the mean within the twofold standard deviations.
Gao, Lili
2017-01-01
A microstructure beam is one of the fundamental elements in MEMS devices like cantilever sensors, RF/optical switches, varactors, resonators, etc. It is still difficult to precisely predict the performance of MEMS beams with the current available simulators due to the inevitable process deviations. Feasible numerical methods are required and can be used to improve the yield and profits of the MEMS devices. In this work, process deviations are considered to be stochastic variables, and a newly-developed numerical method, i.e., generalized polynomial chaos (GPC), is applied for the simulation of the MEMS beam. The doubly-clamped polybeam has been utilized to verify the accuracy of GPC, compared with our Monte Carlo (MC) approaches. Performance predictions have been made on the residual stress by achieving its distributions in GaAs Monolithic Microwave Integrated Circuit (MMIC)-based MEMS beams. The results show that errors are within 1% for the results of GPC approximations compared with the MC simulations. Appropriate choices of the 4-order GPC expansions with orthogonal terms have also succeeded in reducing the MC simulation labor. The mean value of the residual stress, concluded from experimental tests, shares an error about 1.1% with that of the 4-order GPC method. It takes a probability around 54.3% for the 4-order GPC approximation to attain the mean test value of the residual stress. The corresponding yield occupies over 90 percent around the mean within the twofold standard deviations. PMID:29117096
NASA Astrophysics Data System (ADS)
Rezazadeh, Ghader; Keyvani, Aliasghar; Sadeghi, Morteza H.; Bahrami, Manouchehr
2013-06-01
Effects of Ohmic resistance on MEMS/NEMS vibrating structures that have always been dismissed in some situations may cause important changes in resonance properties and impedance parameters of the MEMS/NEMS based circuits. In this paper it is aimed to present a theoretical model to precisely investigate the problem on a simple cantilever-substrate resonator. In this favor the Ohm's current law and charge conservation law have been merged to find a differential Equation for voltage propagation on the beam and because mostly nano structures are expected as the scope of the problem, modified couple stress theory is used to formulate the dynamic motion of the beam. The two governing equations were coupled and both nonlinear that have been solved simultaneously using a Galerkin based state space formulation. The obtained results that are in exact agreement with previous works show that dynamic pull-in voltage, switching time, and impedance of structure as a MEMS capacitor especially in frequencies higher than natural resonance frequency strongly relay on electrical resistance of the beam and substrate material.
Modelling of resonant MEMS magnetic field sensor with electromagnetic induction sensing
NASA Astrophysics Data System (ADS)
Liu, Song; Xu, Huaying; Xu, Dehui; Xiong, Bin
2017-06-01
This paper presents an analytical model of resonant MEMS magnetic field sensor with electromagnetic induction sensing. The resonant structure vibrates in square extensional (SE) mode. By analyzing the vibration amplitude and quality factor of the resonant structure, the magnetic field sensitivity as a function of device structure parameters and encapsulation pressure is established. The developed analytical model has been verified by comparing calculated results with experiment results and the deviation between them is only 10.25%, which shows the feasibility of the proposed device model. The model can provide theoretical guidance for further design optimization of the sensor. Moreover, a quantitative study of the magnetic field sensitivity is conducted with respect to the structure parameters and encapsulation pressure based on the proposed model.
Benefits of combined GPS/GLONASS with low-cost MEMS IMUs for vehicular urban navigation.
Angrisano, Antonio; Petovello, Mark; Pugliano, Giovanni
2012-01-01
The integration of Global Navigation Satellite Systems (GNSS) with Inertial Navigation Systems (INS) has been very actively researched for many years due to the complementary nature of the two systems. In particular, during the last few years the integration with micro-electromechanical system (MEMS) inertial measurement units (IMUs) has been investigated. In fact, recent advances in MEMS technology have made possible the development of a new generation of low cost inertial sensors characterized by small size and light weight, which represents an attractive option for mass-market applications such as vehicular and pedestrian navigation. However, whereas there has been much interest in the integration of GPS with a MEMS-based INS, few research studies have been conducted on expanding this application to the revitalized GLONASS system. This paper looks at the benefits of adding GLONASS to existing GPS/INS(MEMS) systems using loose and tight integration strategies. The relative benefits of various constraints are also assessed. Results show that when satellite visibility is poor (approximately 50% solution availability) the benefits of GLONASS are only seen with tight integration algorithms. For more benign environments, a loosely coupled GPS/GLONASS/INS system offers performance comparable to that of a tightly coupled GPS/INS system, but with reduced complexity and development time.
Tensile-stressed microelectromechanical apparatus and microelectromechanical relay formed therefrom
Fleming, James G [Albuquerque, NM
2008-03-04
A microelectromechanical (MEM) apparatus is disclosed which includes a shuttle suspended above a substrate by two or more sets of tensile-stressed beams which are operatively connected to the shuttle and which can comprise tungsten or a silicon nitride/polysilicon composite structure. Initially, the tensile stress in each set of beams is balanced. However, the tensile stress can be unbalanced by heating one or more of the sets of beams; and this can be used to move the shuttle over a distance of up to several tens of microns. The MEM apparatus can be used to form a MEM relay having relatively high contact and opening forces, and with or without a latching capability.
Encapsulants for protecting MEMS devices during post-packaging release etch
Peterson, Kenneth A.
2005-10-18
The present invention relates to methods to protect a MEMS or microsensor device through one or more release or activation steps in a "package first, release later" manufacturing scheme: This method of fabrication permits wirebonds, other interconnects, packaging materials, lines, bond pads, and other structures on the die to be protected from physical, chemical, or electrical damage during the release etch(es) or other packaging steps. Metallic structures (e.g., gold, aluminum, copper) on the device are also protected from galvanic attack because they are protected from contact with HF or HCL-bearing solutions.
NASA Astrophysics Data System (ADS)
Dawson, Jeremy M.; Chen, Jingdong; Brown, Kolin S.; Famouri, Parviz F.; Hornak, Lawrence A.
2000-12-01
Implementation of closed-loop microelectromechanical system (MEMS) control enables mechanical microsystems to adapt to the demands of the environment that they are actuating, opening a broad range of new opportunities for future MEMS applications. Integrated optical microsystems have the potential to enable continuous in situ optical interrogation of MEMS microstructure position fully decoupled from the means of mechanical actuation that is necessary for realization of feedback control. We present the results of initial research evaluating through-wafer optical microprobes for surface micromachined MEMS integrated optical position monitoring. Results from the through-wafer free-space optical probe of a lateral comb resonator fabricated using the multiuser MEMS process service (MUMPS) indicate significant positional information content with an achievable return probe signal dynamic range of up to 80% arising from film transmission contrast. Static and dynamic deflection analysis and experimental results indicate a through-wafer probe positional signal sensitivity of 40 mV/micrometers for the present setup or 10% signal change per micrometer. A simulation of the application of nonlinear sliding control is presented illustrating position control of the lateral comb resonator structure given the availability of positional state information.
Byrd, Kristin B.; Windham-Myers, Lisamarie; Leeuw, Thomas; Downing, Bryan D.; Morris, James T.; Ferner, Matthew C.
2016-01-01
Reducing uncertainty in data inputs at relevant spatial scales can improve tidal marsh forecasting models, and their usefulness in coastal climate change adaptation decisions. The Marsh Equilibrium Model (MEM), a one-dimensional mechanistic elevation model, incorporates feedbacks of organic and inorganic inputs to project elevations under sea-level rise scenarios. We tested the feasibility of deriving two key MEM inputs—average annual suspended sediment concentration (SSC) and aboveground peak biomass—from remote sensing data in order to apply MEM across a broader geographic region. We analyzed the precision and representativeness (spatial distribution) of these remote sensing inputs to improve understanding of our study region, a brackish tidal marsh in San Francisco Bay, and to test the applicable spatial extent for coastal modeling. We compared biomass and SSC models derived from Landsat 8, DigitalGlobe WorldView-2, and hyperspectral airborne imagery. Landsat 8-derived inputs were evaluated in a MEM sensitivity analysis. Biomass models were comparable although peak biomass from Landsat 8 best matched field-measured values. The Portable Remote Imaging Spectrometer SSC model was most accurate, although a Landsat 8 time series provided annual average SSC estimates. Landsat 8-measured peak biomass values were randomly distributed, and annual average SSC (30 mg/L) was well represented in the main channels (IQR: 29–32 mg/L), illustrating the suitability of these inputs across the model domain. Trend response surface analysis identified significant diversion between field and remote sensing-based model runs at 60 yr due to model sensitivity at the marsh edge (80–140 cm NAVD88), although at 100 yr, elevation forecasts differed less than 10 cm across 97% of the marsh surface (150–200 cm NAVD88). Results demonstrate the utility of Landsat 8 for landscape-scale tidal marsh elevation projections due to its comparable performance with the other sensors, temporal frequency, and cost. Integration of remote sensing data with MEM should advance regional projections of marsh vegetation change by better parameterizing MEM inputs spatially. Improving information for coastal modeling will support planning for ecosystem services, including habitat, carbon storage, and flood protection.
Improving Planetary Rover Attitude Estimation via MEMS Sensor Characterization
Hidalgo, Javier; Poulakis, Pantelis; Köhler, Johan; Del-Cerro, Jaime; Barrientos, Antonio
2012-01-01
Micro Electro-Mechanical Systems (MEMS) are currently being considered in the space sector due to its suitable level of performance for spacecrafts in terms of mechanical robustness with low power consumption, small mass and size, and significant advantage in system design and accommodation. However, there is still a lack of understanding regarding the performance and testing of these new sensors, especially in planetary robotics. This paper presents what is missing in the field: a complete methodology regarding the characterization and modeling of MEMS sensors with direct application. A reproducible and complete approach including all the intermediate steps, tools and laboratory equipment is described. The process of sensor error characterization and modeling through to the final integration in the sensor fusion scheme is explained with detail. Although the concept of fusion is relatively easy to comprehend, carefully characterizing and filtering sensor information is not an easy task and is essential for good performance. The strength of the approach has been verified with representative tests of novel high-grade MEMS inertia sensors and exemplary planetary rover platforms with promising results. PMID:22438761
Thermally actuated resonant silicon crystal nanobalances
NASA Astrophysics Data System (ADS)
Hajjam, Arash
As the potential emerging technology for next generation integrated resonant sensors and frequency references as well as electronic filters, micro-electro-mechanical resonators have attracted a lot of attention over the past decade. As a result, a wide variety of high frequency micro/nanoscale electromechanical resonators have recently been presented. MEMS resonators, as low-cost highly integrated and ultra-sensitive mass sensors, can potentially provide new opportunities and unprecedented capabilities in the area of mass sensing. Such devices can provide orders of magnitude higher mass sensitivity and resolution compared to Film Bulk Acoustic resonators (FBAR) or the conventional quartz and Surface Acoustic Wave (SAW) resonators due to their much smaller sizes and can be batch-fabricated and utilized in highly integrated large arrays at a very low cost. In this research, comprehensive experimental studies on the performance and durability of thermally actuated micromechanical resonant sensors with frequencies up to tens of MHz have been performed. The suitability and robustness of the devices have been demonstrated for mass sensing applications related to air-borne particles and organic gases. In addition, due to the internal thermo-electro-mechanical interactions, the active resonators can turn some of the consumed electronic power back into the mechanical structure and compensate for the mechanical losses. Therefore, such resonators can provide self-sustained-oscillation without the need for any electronic circuitry. This unique property has been deployed to demonstrate a prototype self-sustained sensor for air-borne particle monitoring. I have managed to overcome one of the obstacles for MEMS resonators, which is their relatively poor temperature stability. This is a major drawback when compared with the conventional quartz crystals. A significant decrease of the large negative TCF for the resonators has been attained by doping the devices with a high concentration of phosphorous, resulting in even slightly positive TCF for some of the devices. This is also expected to improve the phase noise characteristics of oscillators implemented utilizing such frequency references by eliminating the sharp dependence to electronic noise in the resonator bias current. Finally it is well known that non-uniformities in fabrication of MEMS resonators lead to variations in their frequency. I have proposed both active (non-permanent) and permanent frequency modification to compensate for variations in frequency of the MEMS resonators.
Acoustic resonance in MEMS scale cylindrical tubes with side branches
NASA Astrophysics Data System (ADS)
Schill, John F.; Holthoff, Ellen L.; Pellegrino, Paul M.; Marcus, Logan S.
2014-05-01
Photoacoustic spectroscopy (PAS) is a useful monitoring technique that is well suited for trace gas detection. This method routinely exhibits detection limits at the parts-per-million (ppm) or parts-per-billion (ppb) level for gaseous samples. PAS also possesses favorable detection characteristics when the system dimensions are scaled to a microelectromechanical system (MEMS) design. One of the central issues related to sensor miniaturization is optimization of the photoacoustic cell geometry, especially in relationship to high acoustical amplification and reduced system noise. Previous work relied on a multiphysics approach to analyze the resonance structures of the MEMS scale photo acoustic cell. This technique was unable to provide an accurate model of the acoustic structure. In this paper we describe a method that relies on techniques developed from musical instrument theory and electronic transmission line matrix methods to describe cylindrical acoustic resonant cells with side branches of various configurations. Experimental results are presented that demonstrate the ease and accuracy of this method. All experimental results were within 2% of those predicted by this theory.
Herrera-May, Agustín Leobardo; Soler-Balcazar, Juan Carlos; Vázquez-Leal, Héctor; Martínez-Castillo, Jaime; Vigueras-Zuñiga, Marco Osvaldo; Aguilera-Cortés, Luz Antonio
2016-08-24
Microelectromechanical systems (MEMS) resonators have allowed the development of magnetic field sensors with potential applications such as biomedicine, automotive industry, navigation systems, space satellites, telecommunications and non-destructive testing. We present a review of recent magnetic field sensors based on MEMS resonators, which operate with Lorentz force. These sensors have a compact structure, wide measurement range, low energy consumption, high sensitivity and suitable performance. The design methodology, simulation tools, damping sources, sensing techniques and future applications of magnetic field sensors are discussed. The design process is fundamental in achieving correct selection of the operation principle, sensing technique, materials, fabrication process and readout systems of the sensors. In addition, the description of the main sensing systems and challenges of the MEMS sensors are discussed. To develop the best devices, researches of their mechanical reliability, vacuum packaging, design optimization and temperature compensation circuits are needed. Future applications will require multifunctional sensors for monitoring several physical parameters (e.g., magnetic field, acceleration, angular ratio, humidity, temperature and gases).
Herrera-May, Agustín Leobardo; Soler-Balcazar, Juan Carlos; Vázquez-Leal, Héctor; Martínez-Castillo, Jaime; Vigueras-Zuñiga, Marco Osvaldo; Aguilera-Cortés, Luz Antonio
2016-01-01
Microelectromechanical systems (MEMS) resonators have allowed the development of magnetic field sensors with potential applications such as biomedicine, automotive industry, navigation systems, space satellites, telecommunications and non-destructive testing. We present a review of recent magnetic field sensors based on MEMS resonators, which operate with Lorentz force. These sensors have a compact structure, wide measurement range, low energy consumption, high sensitivity and suitable performance. The design methodology, simulation tools, damping sources, sensing techniques and future applications of magnetic field sensors are discussed. The design process is fundamental in achieving correct selection of the operation principle, sensing technique, materials, fabrication process and readout systems of the sensors. In addition, the description of the main sensing systems and challenges of the MEMS sensors are discussed. To develop the best devices, researches of their mechanical reliability, vacuum packaging, design optimization and temperature compensation circuits are needed. Future applications will require multifunctional sensors for monitoring several physical parameters (e.g., magnetic field, acceleration, angular ratio, humidity, temperature and gases). PMID:27563912
MEMS-based thin-film fuel cells
Jankowksi, Alan F.; Morse, Jeffrey D.
2003-10-28
A micro-electro-mechanical systems (MEMS) based thin-film fuel cells for electrical power applications. The MEMS-based fuel cell may be of a solid oxide type (SOFC), a solid polymer type (SPFC), or a proton exchange membrane type (PEMFC), and each fuel cell basically consists of an anode and a cathode separated by an electrolyte layer. Additionally catalyst layers can also separate the electrodes (cathode and anode) from the electrolyte. Gas manifolds are utilized to transport the fuel and oxidant to each cell and provide a path for exhaust gases. The electrical current generated from each cell is drawn away with an interconnect and support structure integrated with the gas manifold. The fuel cells utilize integrated resistive heaters for efficient heating of the materials. By combining MEMS technology with thin-film deposition technology, thin-film fuel cells having microflow channels and full-integrated circuitry can be produced that will lower the operating temperature an will yield an order of magnitude greater power density than the currently known fuel cells.
NASA Technical Reports Server (NTRS)
Sharma, Ashok K.; Teverovksy, Alexander; Day, John H. (Technical Monitor)
2000-01-01
Microelectromechanical systems in MEMS is one of the fastest growing technologies in microelectronics, and is of great interest for military and aerospace applications. Accelerometers are the earliest and most developed representatives of MEMS. First demonstrated in 1979, micromachined accelerometers were used in automobile industry for air bag crash- sensing applications since 1990. In 1999, N4EMS accelerometers were used in NASA-JPL Mars Microprobe. The most developed accelerometers for airbag crash- sensing are rated for a full range of +/- 50 G. The range of sensitivity for accelerometers required for military or aerospace applications is much larger, varying from 20,000 G (to measure acceleration during gun and ballistic munition launches), and to 10(exp -6) G, when used as guidance sensors (to measure attitude and position of a spacecraft). The presence of moving parts on the surface of chip is specific to MEMS, and particularly, to accelerometers. This characteristic brings new reliability issues to micromachined accelerometers, including cyclic fatigue cracking of polysilicon cantilevers and springs, mechanical stresses that are caused by packaging and contamination in the internal cavity of the package. Studies of fatigue cracks initiation and growth in polysilicon showed that the fatigue damage may influence MEMS device performance, and the presence of water vapor significantly enhances crack initiation and growth. Environmentally induced failures, particularly, failures due to thermal cycling and mechanical shock are considered as one of major reliability concerns in MEMS. These environmental conditions are also critical for space applications of the parts. For example, the Mars pathfinder mission had experienced 80 mechanical shock events during the pyrotechnic separation processes.
Applications of ANSYS/Multiphysics at NASA/Goddard Space Flight Center
NASA Technical Reports Server (NTRS)
Loughlin, Jim
2007-01-01
This viewgraph presentation reviews some of the uses that the ANSYS/Multiphysics system is used for at the NASA Goddard Space Flight Center. Some of the uses of the ANSYS system is used for is MEMS Structural Analysis of Micro-mirror Array for the James Web Space Telescope (JWST), Micro-shutter Array for JWST, MEMS FP Tunable Filter, AstroE2 Micro-calorimeter. Various views of these projects are shown in this presentation.
MEMS Gate Structures for Electric Propulsion Applications
2006-07-12
distance between gates of dual gate system V = grid voltage Dsheath = sheath thickness Va = anode voltage E = electric field Vemitter = emitter voltage Es...minutes. A hot pressed boron nitride target (4N) in the hexagonal phase (h- BN) was sputtered in a RF magnetron sputtering gun. To promote the nucleation...and nanoFETs. This paper concludes with a discussion on using MEMS gates for dual -grid electron field emission applications. II. Gate Design I I
Structural health monitoring using wireless sensor networks
NASA Astrophysics Data System (ADS)
Sreevallabhan, K.; Nikhil Chand, B.; Ramasamy, Sudha
2017-11-01
Monitoring and analysing health of large structures like bridges, dams, buildings and heavy machinery is important for safety, economical, operational, making prior protective measures, and repair and maintenance point of view. In recent years there is growing demand for such larger structures which in turn make people focus more on safety. By using Microelectromechanical Systems (MEMS) Accelerometer we can perform Structural Health Monitoring by studying the dynamic response through measure of ambient vibrations and strong motion of such structures. By using Wireless Sensor Networks (WSN) we can embed these sensors in wireless networks which helps us to transmit data wirelessly thus we can measure the data wirelessly at any remote location. This in turn reduces heavy wiring which is a cost effective as well as time consuming process to lay those wires. In this paper we developed WSN based MEMS-accelerometer for Structural to test the results in the railway bridge near VIT University, Vellore campus.
On the feasibility to integrate low-cost MEMS accelerometers and GNSS receivers
NASA Astrophysics Data System (ADS)
Benedetti, Elisa; Dermanis, Athanasios; Crespi, Mattia
2017-06-01
The aim of this research was to investigate the feasibility of merging the benefits offered by low-cost GNSS and MEMS accelerometers technology, in order to promote the diffusion of low-cost monitoring solutions. A merging approach was set up at the level of the combination of kinematic results (velocities and displacements) coming from the two kinds of sensors, whose observations were separately processed, following to the so called loose integration, which sounds much more simple and flexible thinking about the possibility of an easy change of the combined sensors. At first, the issues related to the difference in reference systems, time systems and measurement rate and epochs for the two sensors were faced with. An approach was designed and tested to transform into unique reference and time systems the outcomes from GPS and MEMS and to interpolate the usually (much) more dense MEMS observation to common (GPS) epochs. The proposed approach was limited to time-independent (constant) orientation of the MEMS reference system with respect to the GPS one. Then, a data fusion approach based on the use of Discrete Fourier Transform and cubic splines interpolation was proposed both for velocities and displacements: MEMS and GPS derived solutions are firstly separated by a rectangular filter in spectral domain, and secondly back-transformed and combined through a cubic spline interpolation. Accuracies around 5 mm for slow and fast displacements and better than 2 mm/s for velocities were assessed. The obtained solution paves the way to a powerful and appealing use of low-cost single frequency GNSS receivers and MEMS accelerometers for structural and ground monitoring applications. Some additional remarks and prospects for future investigations complete the paper.
2010-06-01
different approaches were used to model MEMS OM as a grating in Zemax software. First, a 2D grating was directly modeled as a combination of two ID...method of modeling ~IEMS DM in Zemax was implemented by combining two ID gratings. Due to the fact that ZEl\\’IAX allows to easily use ID physical...optics shows thc far field diffractioll pattcrn, which in Zemax geometrical model shows up as distinct spots. each one corresponding to a specific
NASA Astrophysics Data System (ADS)
Lu, Jiazhen; Liang, Shufang; Yang, Yanqiang
2017-10-01
Micro-electro-mechanical systems (MEMS) inertial measurement devices tend to be widely used in inertial navigation systems and have quickly emerged on the market due to their characteristics of low cost, high reliability and small size. Calibration is the most effective way to remove the deterministic error of an inertial reference unit (IRU), which in this paper consists of three orthogonally mounted MEMS gyros. However, common testing methods in the lab cannot predict the corresponding errors precisely when the turntable’s working condition is restricted. In this paper, the turntable can only provide a relatively small rotation angle. Moreover, the errors must be compensated exactly because of the great effect caused by the high angular velocity of the craft. To deal with this question, a new method is proposed to evaluate the MEMS IRU’s performance. In the calibration procedure, a one-axis table that can rotate a limited angle in the form of a sine function is utilized to provide the MEMS IRU’s angular velocity. A new algorithm based on Fourier series is designed to calculate the misalignment and scale factor errors. The proposed method is tested in a set of experiments, and the calibration results are compared to a traditional calibration method performed under normal working conditions to verify their correctness. In addition, a verification test in the given rotation speed is implemented for further demonstration.
NASA Astrophysics Data System (ADS)
Robinson, Nidia; Saafi, Mohamed
2006-03-01
Critical civil infrastructure systems such as bridges, high rises, dams, nuclear power plants and pipelines present a major investment and the health of the United States' economy and the lifestyle of its citizens both depend on their safety and security. The challenge for engineers is to maintain the safety and security of these large structures in the face of terrorism threats, natural disasters and long-term deterioration, as well as to meet the demands of emergency response times. With the significant negative impact that these threats can have on the structural environment, health monitoring of civil infrastructure holds promise as a way to provide information for near real-time condition assessment of the structure's safety and security. This information can be used to assess the integrity of the structure for post-earthquake and terrorist attacks rescue and recovery, and to safely and rapidly remove the debris and to temporary shore specific structural elements. This information can also be used for identification of incipient damage in structures experiencing long-term deterioration. However, one of the major obstacles preventing sensor-based monitoring is the lack of reliable, easy-to-install, cost-effective and harsh environment resistant sensors that can be densely embedded into large-scale civil infrastructure systems. Nanotechnology and MEMS-based systems which have matured in recent years represent an innovative solution to current damage detection systems, leading to wireless, inexpensive, durable, compact, and high-density information collection. In this paper, ongoing research activities at Alabama A&M University (AAMU) Center for Transportation Infrastructure Safety and Security on the application of nanotechnology and MEMS to Civil Infrastructure for health monitoring will presented. To date, research showed that nanotechnology and MEMS-based systems can be used to wirelessly detect and monitor different damage mechanisms in concrete structures as well as monitor critical structures' stability during floods and barge impact. However, some technical issues that needs to be addressed before full implementation of these new systems and will also be discussed in this paper.
Integrated multidisciplinary CAD/CAE environment for micro-electro-mechanical systems (MEMS)
NASA Astrophysics Data System (ADS)
Przekwas, Andrzej J.
1999-03-01
Computational design of MEMS involves several strongly coupled physical disciplines, including fluid mechanics, heat transfer, stress/deformation dynamics, electronics, electro/magneto statics, calorics, biochemistry and others. CFDRC is developing a new generation multi-disciplinary CAD systems for MEMS using high-fidelity field solvers on unstructured, solution-adaptive grids for a full range of disciplines. The software system, ACE + MEMS, includes all essential CAD tools; geometry/grid generation for multi- discipline, multi-equation solvers, GUI, tightly coupled configurable 3D field solvers for FVM, FEM and BEM and a 3D visualization/animation tool. The flow/heat transfer/calorics/chemistry equations are solved with unstructured adaptive FVM solver, stress/deformation are computed with a FEM STRESS solver and a FAST BEM solver is used to solve linear heat transfer, electro/magnetostatics and elastostatics equations on adaptive polygonal surface grids. Tight multidisciplinary coupling and automatic interoperability between the tools was achieved by designing a comprehensive database structure and APIs for complete model definition. The virtual model definition is implemented in data transfer facility, a publicly available tool described in this paper. The paper presents overall description of the software architecture and MEMS design flow in ACE + MEMS. It describes current status, ongoing effort and future plans for the software. The paper also discusses new concepts of mixed-level and mixed- dimensionality capability in which 1D microfluidic networks are simulated concurrently with 3D high-fidelity models of discrete components.
Laser-assisted advanced assembly for MEMS fabrication
NASA Astrophysics Data System (ADS)
Atanasov, Yuriy Andreev
Micro Electro-Mechanical Systems (MEMS) are currently fabricated using methods originally designed for manufacturing semiconductor devices, using minimum if any assembly at all. The inherited limitations of this approach narrow the materials that can be employed and reduce the design complexity, imposing limitations on MEMS functionality. The proposed Laser-Assisted Advanced Assembly (LA3) method solves these problems by first fabricating components followed by assembly of a MEMS device. Components are micro-machined using a laser or by photolithography followed by wet/dry etching out of any material available in a thin sheet form. A wide range of materials can be utilized, including biocompatible metals, ceramics, polymers, composites, semiconductors, and materials with special properties such as memory shape alloys, thermoelectric, ferromagnetic, piezoelectric, and more. The approach proposed allows enhancing the structural and mechanical properties of the starting materials through heat treatment, tribological coatings, surface modifications, bio-functionalization, and more, a limited, even unavailable possibility with existing methods. Components are transferred to the substrate for assembly using the thermo-mechanical Selective Laser Assisted Die Transfer (tmSLADT) mechanism for microchips assembly, already demonstrated by our team. Therefore, the mechanical and electronic part of the MEMS can be fabricated using the same equipment/method. The viability of the Laser-Assisted Advanced Assembly technique for MEMS is demonstrated by fabricating magnetic switches for embedding in a conductive carbon-fiber metamaterial for use in an Electromagnetic-Responsive Mobile Cyber-Physical System (E-RMCPS), which is expected to improve the wireless communication system efficiency within a battery-powered device.
NASA Astrophysics Data System (ADS)
Li, Gaoming; Li, Haijun; Duan, Xiyu; Zhou, Quan; Zhou, Juan; Oldham, Kenn R.; Wang, Thomas D.
2017-02-01
We demonstrate a dual axes confocal architecture, which can be used to collect horizontal(XY-plane) or vertical cross-sectional(XZ-plane) images for tissue. This scanner head is 5.5mm in outer diameter(OD), and integrates a 3D MEMS scanner with a compact chip size of 3.2×2.9mm2. To realize the miniaturization, there are some obstacles of the small size of 3D MEMS scanner, MEMS wire bundle, the air pressure effect for MEMS motion, the processing of parabolic mirror, and optical alignment to come over. In our probe, separation mechanical structure for optical alignment was adopted and a step shape MEMS holder was designed to deal with the difficult of MEMS wire bundle. Peptides have been demonstrated tremendous potential for in vivo use to detect colonic dysplasia. This class of in vivo molecular probe can be labeled with near-infrared (NIR) dyes for visualizing the full depth of the epithelium in small animals. To confirm our probe performance, we take use of USAF 1951 resolution target to test its lateral and axial resolution. It has lateral and axial resolution of 2.49um and 4.98um, respectively. When we collect the fluorescence imaging of colon, it shows that the field of view are 1000um×1000um (horizontal) and 1000um×430um (vertical). The horizontal and vertical cross-sectional images of fresh mouse colonic mucosa demonstrate imaging performance with this miniature instrument.
NASA Astrophysics Data System (ADS)
Lee, J.-H.; Houk, R. T. J.; Robinson, A.; Greathouse, J. A.; Thornberg, S. M.; Allendorf, M. D.; Hesketh, P. J.
2010-04-01
In this paper we demonstrate the potential for novel nanoporous framework materials (NFM) such as metal-organic frameworks (MOFs) to provide selectivity and sensitivity to a broad range of analytes including explosives, nerve agents, and volatile organic compounds (VOCs). NFM are highly ordered, crystalline materials with considerable synthetic flexibility resulting from the presence of both organic and inorganic components within their structure. Detection of chemical weapons of mass destruction (CWMD), explosives, toxic industrial chemicals (TICs), and volatile organic compounds (VOCs) using micro-electro-mechanical-systems (MEMS) devices, such as microcantilevers and surface acoustic wave sensors, requires the use of recognition layers to impart selectivity. Traditional organic polymers are dense, impeding analyte uptake and slowing sensor response. The nanoporosity and ultrahigh surface areas of NFM enhance transport into and out of the NFM layer, improving response times, and their ordered structure enables structural tuning to impart selectivity. Here we describe experiments and modeling aimed at creating NFM layers tailored to the detection of water vapor, explosives, CWMD, and VOCs, and their integration with the surfaces of MEMS devices. Force field models show that a high degree of chemical selectivity is feasible. For example, using a suite of MOFs it should be possible to select for explosives vs. CWMD, VM vs. GA (nerve agents), and anthracene vs. naphthalene (VOCs). We will also demonstrate the integration of various NFM with the surfaces of MEMS devices and describe new synthetic methods developed to improve the quality of VFM coatings. Finally, MOF-coated MEMS devices show how temperature changes can be tuned to improve response times, selectivity, and sensitivity.
MEMS/MOEMS foundry services at INO
NASA Astrophysics Data System (ADS)
García-Blanco, Sonia; Ilias, Samir; Williamson, Fraser; Généreux, Francis; Le Noc, Loïc; Poirier, Michel; Proulx, Christian; Tremblay, Bruno; Provençal, Francis; Desroches, Yan; Caron, Jean-Sol; Larouche, Carl; Beaupré, Patrick; Fortin, Benoit; Topart, Patrice; Picard, Francis; Alain, Christine; Pope, Timothy; Jerominek, Hubert
2010-06-01
In the MEMS manufacturing world, the "fabless" model is getting increasing importance in recent years as a way for MEMS manufactures and startups to minimize equipment costs and initial capital investment. In order for this model to be successful, the fabless company needs to work closely with a MEMS foundry service provider. Due to the lack of standardization in MEMS processes, as opposed to CMOS microfabrication, the experience in MEMS development processes and the flexibility of the MEMS foundry are of vital importance. A multidisciplinary team together with a complete microfabrication toolset allows INO to offer unique MEMS foundry services to fabless companies looking for low to mid-volume production. Companies that benefit from their own microfabrication facilities can also be interested in INO's assistance in conducting their research and development work during periods where production runs keep their whole staff busy. Services include design, prototyping, fabrication, packaging, and testing of various MEMS and MOEMS devices on wafers fully compatible with CMOS integration. Wafer diameters ranging typically from 1 inch to 6 inches can be accepted while 8-inch wafers can be processed in some instances. Standard microfabrication techniques such as metal, dielectric, and semiconductor film deposition and etching as well as photolithographic pattern transfer are available. A stepper permits reduction of the critical dimension to around 0.4 μm. Metals deposited by vacuum deposition methods include Au, Ag, Al, Al alloys, Ti, Cr, Cu, Mo, MoCr, Ni, Pt, and V with thickness varying from 5 nm to 2 μm. Electroplating of several materials including Ni, Au and In is also available. In addition, INO has developed and built a gold black deposition facility to answer customer's needs for broadband microbolometric detectors. The gold black deposited presents specular reflectance of less than 10% in the wavelength range from 0.2 μm to 100 μm with thickness ranging from 20 to 35 μm and a density of 0.3% the bulk density of gold. Two Balzers thin-film deposition instruments (BAP-800 and BAK-760) permit INO to offer optical thin film manufacturing. Recent work in this field includes the design and development of a custom filter for the James Webb Space Telescope (JWST) as collaboration with the Canadian company ComDEV. An overview of the different microfabrication foundry services offered by INO will be presented together with the most recent achievements in the field of MEMS/MOEMS.
Calibration of High Frequency MEMS Microphones
NASA Technical Reports Server (NTRS)
Shams, Qamar A.; Humphreys, William M.; Bartram, Scott M.; Zuckewar, Allan J.
2007-01-01
Understanding and controlling aircraft noise is one of the major research topics of the NASA Fundamental Aeronautics Program. One of the measurement technologies used to acquire noise data is the microphone directional array (DA). Traditional direction array hardware, consisting of commercially available condenser microphones and preamplifiers can be too expensive and their installation in hard-walled wind tunnel test sections too complicated. An emerging micro-machining technology coupled with the latest cutting edge technologies for smaller and faster systems have opened the way for development of MEMS microphones. The MEMS microphone devices are available in the market but suffer from certain important shortcomings. Based on early experiments with array prototypes, it has been found that both the bandwidth and the sound pressure level dynamic range of the microphones should be increased significantly to improve the performance and flexibility of the overall array. Thus, in collaboration with an outside MEMS design vendor, NASA Langley modified commercially available MEMS microphone as shown in Figure 1 to meet the new requirements. Coupled with the design of the enhanced MEMS microphones was the development of a new calibration method for simultaneously obtaining the sensitivity and phase response of the devices over their entire broadband frequency range. Over the years, several methods have been used for microphone calibration. Some of the common methods of microphone calibration are Coupler (Reciprocity, Substitution, and Simultaneous), Pistonphone, Electrostatic actuator, and Free-field calibration (Reciprocity, Substitution, and Simultaneous). Traditionally, electrostatic actuators (EA) have been used to characterize air-condenser microphones for wideband frequency ranges; however, MEMS microphones are not adaptable to the EA method due to their construction and very small diaphragm size. Hence a substitution-based, free-field method was developed to calibrate these microphones at frequencies up to 80 kHz. The technique relied on the use of a random, ultrasonic broadband centrifugal sound source located in a small anechoic chamber. Phase calibrations of the MEMS microphones were derived from cross spectral phase comparisons between the reference and test substitution microphones and an adjacent and invariant grazing-incidence 1/8-inch standard microphone.
Residual Stress and Fracture of PECVD Thick Oxide Films for Power MEMS Structures and Devices
2007-06-01
Residual stress leads to large overall wafer bow, which makes further processing difficult. For example some microfabrication machines , such as chemical...curvature will be measured across the wafer surface in 12 scans, rotating 24 the wafer by 300 between each scan. In situ wafer curvature will be...SiOx. 4.1. Introduction As introduced earlier (Sec.1), in Power MEMS (micro energy- harvesting devices such as micro heat engines and related components
Schifferle, Andreas; Dommann, Alex; Neels, Antonia
2017-01-01
New methods are needed in microsystems technology for evaluating microelectromechanical systems (MEMS) because of their reduced size. The assessment and characterization of mechanical and structural relations of MEMS are essential to assure the long-term functioning of devices, and have a significant impact on design and fabrication. Within this study a concept for the investigation of mechanically loaded MEMS materials on an atomic level is introduced, combining high-resolution X-ray diffraction (HRXRD) measurements with finite element analysis (FEA) and mechanical testing. In situ HRXRD measurements were performed on tensile loaded single crystal silicon (SCSi) specimens by means of profile scans and reciprocal space mapping (RSM) on symmetrical (004) and (440) reflections. A comprehensive evaluation of the rather complex XRD patterns and features was enabled by the correlation of measured with simulated, 'theoretical' patterns. Latter were calculated by a specifically developed, simple and fast approach on the basis of continuum mechanical relations. Qualitative and quantitative analysis confirmed the admissibility and accuracy of the presented method. In this context [001] Poisson's ratio was determined providing an error of less than 1.5% with respect to analytical prediction. Consequently, the introduced procedure contributes to further going investigations of weak scattering being related to strain and defects in crystalline structures and therefore supports investigations on materials and devices failure mechanisms.
Improved contact resistance stability in a MEMS separable electrical connector
NASA Astrophysics Data System (ADS)
Larsson, M. P.
2005-12-01
A MEMS in-line separable electrical connector with improved contact resistance stability to thermal fluctuations and mating cycles is described. The design allows sliding, in-line connection between separate halves, inducing vertical deflections on a set of flexible conductors to establish stable electrical contacts. Features are present on both halves to ensure precise lateral and vertical self-alignment; preventing shorts and maintaining consistent conductor deflections. Characterisation on early prototypes revealed significant variability in contact resistance with thermal fluctuations and mating cycle history. As flexible conductors are multi-layered structures of Au supported by a thick structural layer of Ni, they undergo differential thermal expansion, introducing variability in contact resistance with temperature. Sliding contact wear during repeated mating leads to removal of portions of the Au surface coating, and electrical contact between underlying (non-noble) Ni layers. By using a harder Co-Au alloy as the contact surface layer and modifying the arrangement of constituent conductor layers to balance thermal stresses, improvements to both wear and thermal tolerance of contact resistance can be obtained. Devices implementing the above design modifications show stable contact resistance over 100 mating cycles and an increase in contact resistance of between 3.5 and 7% over a temperature rise of 60°C. The electrical performance improvements increase the attractiveness of the MEMS in-line separable connector concept for applications in portable electronics and MEMS integration.
Schifferle, Andreas; Dommann, Alex; Neels, Antonia
2017-01-01
Abstract New methods are needed in microsystems technology for evaluating microelectromechanical systems (MEMS) because of their reduced size. The assessment and characterization of mechanical and structural relations of MEMS are essential to assure the long-term functioning of devices, and have a significant impact on design and fabrication. Within this study a concept for the investigation of mechanically loaded MEMS materials on an atomic level is introduced, combining high-resolution X-ray diffraction (HRXRD) measurements with finite element analysis (FEA) and mechanical testing. In situ HRXRD measurements were performed on tensile loaded single crystal silicon (SCSi) specimens by means of profile scans and reciprocal space mapping (RSM) on symmetrical (004) and (440) reflections. A comprehensive evaluation of the rather complex XRD patterns and features was enabled by the correlation of measured with simulated, ‘theoretical’ patterns. Latter were calculated by a specifically developed, simple and fast approach on the basis of continuum mechanical relations. Qualitative and quantitative analysis confirmed the admissibility and accuracy of the presented method. In this context [001] Poisson’s ratio was determined providing an error of less than 1.5% with respect to analytical prediction. Consequently, the introduced procedure contributes to further going investigations of weak scattering being related to strain and defects in crystalline structures and therefore supports investigations on materials and devices failure mechanisms. PMID:28533825
NASA Astrophysics Data System (ADS)
Frewin, C. L.; Locke, C.; Wang, J.; Spagnol, P.; Saddow, S. E.
2009-08-01
The growth of highly oriented 3C-SiC directly on an oxide release layer, composed of a 20-nm-thick poly-Si seed layer and a 550-nm-thick thermally deposited oxide on a (1 1 1)Si substrate, was investigated as an alternative to using silicon-on-insulator (SOI) substrates for freestanding SiC films for MEMS applications. The resulting SiC film was characterized by X-ray diffraction (XRD) with the X-ray rocking curve of the (1 1 1) diffraction peak displaying a FWHM of 0.115° (414″), which was better than that for 3C-SiC films grown directly on (1 1 1)Si during the same deposition process. However, the XRD peak amplitude for the 3C-SiC film on the poly-Si seed layer was much less than for the (1 1 1)Si control substrate, due to slight in-plane misorientations in the film. Surprisingly, the film was solely composed of (1 1 1) 3C-SiC grains and possessed no 3C-SiC grains oriented along the <3 1 1> and <1 1 0> directions which were the original directions of the poly-Si seed layer. With this new process, MEMS structures such as cantilevers and membranes can be easily released leaving behind high-quality 3C-SiC structures.
An Experimental Study of the Low-cost MEMS-type Seismometer for Structural Health Monitoring
NASA Astrophysics Data System (ADS)
Yin, RenCheng; Wu, Yih-Min; Hsu, Ting-Yu
2016-04-01
The Earthquake Early Warning (EEW) research group at National Taiwan University (NTU) and a technology company have been developing a Micro Electro Mechanical Systems (MEMS) type of accelerometer named Palert designed for EEW purpose. The main advantage of Palert is that it is a relatively low-cost seismometer. On the other hand, due to the high price of commercial hardware of Structural Health Monitoring (SHM) systems, the application of SHM to buildings is limited. Therefore, the low price of Palert devices makes it affordable to general purpose application and would lead to popularization of SHM for buildings. This study serves as a pre-study for this purpose and the feasibility for SHM application for Palert is also verified. In order to monitor the health of the building, the method proposed by Nakata et al. is used to estimate fundamental normal-mode frequency of a steel building in the laboratory of the National Center for Research on Earthquake Engineering (NCREE). The results show that the Palert is reliable to measure the building's response for the most of the normal buildings with less than ten stories. The fundamental normal-mode frequencies estimated using the Palert are quite comparable to the ones estimated using the high-performance accelerometers and data acquisition system. The Palert illustrates the possibility to be used to monitor the health of a building but further studies are still necessary.
NASA Astrophysics Data System (ADS)
Zhang, Ping
Microelectromechanical systems (MEMS) have a wide range of applications. In the field of wireless and microwave technology, considerable attention has been given to the development and integration of MEMS-based RF (radio frequency) components. An RF MEMS switch requires low insertion loss, high isolation, and low actuation voltage - electrical aspects that have been extensively studied. The mechanical requirements of the switch, such as low sensitivity to built-in stress and high reliability, greatly depend on the micromechanical properties of the switch materials, and have not been thoroughly explored. RF MEMS switches are typically in the form of a free-standing thin film structure. Large stress gradients and across-wafer stress variations developed during fabrication severely degrade their electrical performance. A micromachined stress measurement sensor has been developed that can potentially be employed for in-situ monitoring of stress evolution and stress variation. The sensors were micromachined using five masks on two wafer levels, each measuring 5x3x1 mm. They function by means of an electron tunneling mechanism, where a 2x2 mm silicon nitride membrane elastically deflects under an applied deflection voltage via an external feedback circuitry. For the current design, the sensors are capable of measuring tensile stresses up to the GPa range under deflection voltages of 50--100 V. Sensor functionality was studied by finite element modeling and a theoretical analysis of square membrane deflection. While the mechanical properties of thin films on substrates have been extensively studied, studies of free-standing thin films have been limited due to the practical difficulties in sample handling and testing. Free-standing Al and Al-Ti thin films specimens have been successfully fabricated and microtensile and stress relaxation tests have been performed using a custom-designed micromechanical testing apparatus. A dedicated TEM (transmission electron microscopy) sample preparation technique allows the investigation of the microstructures of these thin films both before and after mechanical testing to correlate the microstructural findings with the mechanical behavior. Major studies include grain boundary strengthening in pure Al, plastic deformation in pure Al by inhomogeneous deformation and localized grain thinning, solid solution and precipitate strengthening in Al-Ti alloys, and stress relaxation of Al and Al-Ti.
Dynamic MEMS devices for multi-axial fatigue and elastic modulus measurement
NASA Astrophysics Data System (ADS)
White, Carolyn D.; Xu, Rui; Sun, Xiaotian; Komvopoulos, Kyriakos
2003-01-01
For reliable MEMS device fabrication and operation, there is a continued demand for precise characterization of materials at the micron scale. This paper presents a novel material characterization device for fatigue lifetime testing. The fatigue specimen is subjected to multi-axial loading, which is typical of most MEMS devices. Polycrystalline silicon (polysilicon) fatigue devices were fabricated using the MUMPS process with a three layer mask process ground plane, anchor, and structural layer of polysilicon. A fatigue device consists of two or three beams, attached to a rotating ring and anchored to the substrate on each end. In order to generate a sufficiently large stress, the fatigue devices were tested in resonance to produce a von Mises equivalent stress as high as 1 GPa, which is in the fracture strength range reported for polysilicon. A further increase of the stress in the beam specimens was obtained by introducing a notch with a focused ion beam. The notch resulted into a stress concentration factor of about 3.8, thereby producing maximum von Mises equivalent stress in the range of 1 through 4 GPa. This study provides insight into multi-axial fatigue testing under typical MEMS conditions and additional information about micron-scale polysilicon mechanical behavior, which is the current basic building material for MEMS devices.
RF-MEMS tunable interdigitated capacitor and fixed spiral inductor for band pass filter applications
NASA Astrophysics Data System (ADS)
Bade, Ladon Ahmed; Dennis, John Ojur; Khir, M. Haris Md; Wen, Wong Peng
2016-11-01
This research presents the tunable Radio Frequency Micro Electromechanical Systems (RF-MEMS) coupled band-pass filter (BPF), which possess a wide tuning range and constructed by using the Chebyshev fourth degree equivalent circuit consisting of fixed inductors and interdigitated tunable capacitors. The suggested method was authenticated by designing a new tunable BPF with a 100% tuning range from 3.1 GHz to 4.9 GHz. The Metal Multi-User MEMS Process (Metal MUMPs) was involved in the process of design of this band-pass filter. It aimed to achieve the reconfiguration of frequencies and show high efficiency of RF in the applications that using Ultra Wide Band (UWB) such as wireless sensor networks. The RF performance of this filter was found to be very satisfactory due to its simple fabrication. Moreover, it showed less insertion loss of around 4 dB and high return loss of around 20 dB.
Diffusion Bonding of Silicon Carbide for MEMS-LDI Applications
NASA Technical Reports Server (NTRS)
Halbig, Michael C.; Singh, Mrityunjay; Shpargel, Tarah P.; Kiser, J. Douglas
2007-01-01
A robust joining approach is critically needed for a Micro-Electro-Mechanical Systems-Lean Direct Injector (MEMS-LDI) application which requires leak free joints with high temperature mechanical capability. Diffusion bonding is well suited for the MEMS-LDI application. Diffusion bonds were fabricated using titanium interlayers between silicon carbide substrates during hot pressing. The interlayers consisted of either alloyed titanium foil or physically vapor deposited (PVD) titanium coatings. Microscopy shows that well adhered, crack free diffusion bonds are formed under optimal conditions. Under less than optimal conditions, microcracks are present in the bond layer due to the formation of intermetallic phases. Electron microprobe analysis was used to identify the reaction formed phases in the diffusion bond. Various compatibility issues among the phases in the interlayer and substrate are discussed. Also, the effects of temperature, pressure, time, silicon carbide substrate type, and type of titanium interlayer and thickness on the microstructure and composition of joints are discussed.
Development of a MEMS acoustic emission sensor system
NASA Astrophysics Data System (ADS)
Greve, David W.; Oppenheim, Irving J.; Wu, Wei; Wright, Amelia P.
2007-04-01
An improved multi-channel MEMS chip for acoustic emission sensing has been designed and fabricated in 2006 to create a device that is smaller in size, superior in sensitivity, and more practical to manufacture than earlier designs. The device, fabricated in the MUMPS process, contains four resonant-type capacitive transducers in the frequency range between 100 kHz and 500 kHz on a chip with an area smaller than 2.5 sq. mm. The completed device, with its circuit board, electronics, housing, and connectors, possesses a square footprint measuring 25 mm x 25 mm. The small footprint is an important attribute for an acoustic emission sensor, because multiple sensors must typically be arrayed around a crack location. Superior sensitivity was achieved by a combination of four factors: the reduction of squeeze film damping, a resonant frequency approximating a rigid body mode rather than a bending mode, a ceramic package providing direct acoustic coupling to the structural medium, and high-gain amplifiers implemented on a small circuit board. Manufacture of the system is more practical because of higher yield (lower unit costs) in the MUMPS fabrication task and because of a printed circuit board matching the pin array of the MEMS chip ceramic package for easy assembly and compactness. The transducers on the MEMS chip incorporate two major mechanical improvements, one involving squeeze film damping and one involving the separation of resonance modes. For equal proportions of hole area to plate area, a triangular layout of etch holes reduces squeeze film damping as compared to the conventional square layout. The effect is modeled analytically, and is verified experimentally by characterization experiments on the new transducers. Structurally, the transducers are plates with spring supports; a rigid plate would be the most sensitive transducer, and bending decreases the sensitivity. In this chip, the structure was designed for an order-of-magnitude separation between the first and the second mode frequency, strongly approximating the desirable rigid plate limit. The effect is modeled analytically and is verified experimentally by measurement of the resonance frequencies in the new transducers. Another improvement arises from the use of a pin grid array ceramic package, in which the MEMS chip is acoustically coupled to the structure with only two interfaces, through a ceramic medium that is negligible in thickness when compared to wavelengths of interest. Like other acoustic emission sensors, those on the 2006 MEMS chip are sensitive only to displacements normal to the surface on which the device is mounted. To overcome that long-standing limitation, a new MEMS sensor sensitive to in-plane motion has been designed, featuring a different spring-mass mechanism and creating the signal by the change in capacitance between stationary and moving fingers. Predicted damping is much lower for the case of the in-plane sensor, and squeeze-film damping is used selectively to isolate the desired in-plane mechanical response from any unwanted out-of-plane response. The new spring-mass mechanism satisfies the design rules for the PolyMUMPS fabrication (foundry) process. A 3-D MEMS sensor system is presently being fabricated, collocating two in-plane sensors and one out-of-plane sensor at the mm scale, which is very short compared to the acoustic wavelength of interest for stress waves created by acoustic emission events.
In vivo cellular imaging with microscopes enabled by MEMS scanners
NASA Astrophysics Data System (ADS)
Ra, Hyejun
High-resolution optical imaging plays an important role in medical diagnosis and biomedical research. Confocal microscopy is a widely used imaging method for obtaining cellular and sub-cellular images of biological tissue in reflectance and fluorescence modes. Its characteristic optical sectioning capability also enables three-dimensional (3-D) image reconstruction. However, its use has mostly been limited to excised tissues due to the requirement of high numerical aperture (NA) lenses for cellular resolution. Microscope miniaturization can enable in vivo imaging to make possible early cancer diagnosis and biological studies in the innate environment. In this dissertation, microscope miniaturization for in vivo cellular imaging is presented. The dual-axes confocal (DAC) architecture overcomes limitations of the conventional single-axis confocal (SAC) architecture to allow for miniaturization with high resolution. A microelectromechanical systems (MEMS) scanner is the central imaging component that is key in miniaturization of the DAC architecture. The design, fabrication, and characterization of the two-dimensional (2-D) MEMS scanner are presented. The gimbaled MEMS scanner is fabricated on a double silicon-on-insulator (SOI) wafer and is actuated by self-aligned vertical electrostatic combdrives. The imaging performance of the MEMS scanner in a DAC configuration is shown in a breadboard microscope setup, where reflectance and fluorescence imaging is demonstrated. Then, the MEMS scanner is integrated into a miniature DAC microscope. The whole imaging system is integrated into a portable unit for research in small animal models of human biology and disease. In vivo 3-D imaging is demonstrated on mouse skin models showing gene transfer and siRNA silencing. The siRNA silencing process is sequentially imaged in one mouse over time.
MEMS-based platforms for mechanical manipulation and characterization of cells
NASA Astrophysics Data System (ADS)
Pan, Peng; Wang, Wenhui; Ru, Changhai; Sun, Yu; Liu, Xinyu
2017-12-01
Mechanical manipulation and characterization of single cells are important experimental techniques in biological and medical research. Because of the microscale sizes and highly fragile structures of cells, conventional cell manipulation and characterization techniques are not accurate and/or efficient enough or even cannot meet the more and more demanding needs in different types of cell-based studies. To this end, novel microelectromechanical systems (MEMS)-based technologies have been developed to improve the accuracy, efficiency, and consistency of various cell manipulation and characterization tasks, and enable new types of cell research. This article summarizes existing MEMS-based platforms developed for cell mechanical manipulation and characterization, highlights their specific design considerations making them suitable for their designated tasks, and discuss their advantages and limitations. In closing, an outlook into future trends is also provided.
Dynamic focus-tracking MEMS scanning micromirror with low actuation voltages for endoscopic imaging.
Strathman, Matthew; Liu, Yunbo; Li, Xingde; Lin, Lih Y
2013-10-07
We demonstrate a 3-D scanning micromirror device that combines 2-D beam scanning with focus control in the same device using micro-electro-mechanical-systems (MEMS) technology. 2-D beam scanning is achieved with a biaxial gimbal structure and focus control is obtained with a deformable mirror membrane surface. The micromirror with 800 micrometer diameter is designed to be sufficiently compact and efficient so that it can be incorporated into an endoscopic imaging probe in the future. The design, fabrication and characterization of the device are described in this paper. Using the focus-tracking MEMS scanning mirror, we achieved an optical scanning range of >16 degrees with <40 V actuation voltage at resonance and a tunable focal length between infinity and 25 mm with <100V applied bias.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Grau, Mario, E-mail: mario.grau@hs-rm.de; Völklein, Friedemann; Meier, Andreas
A method for measuring the thermal accommodation coefficient α for surface-/gas interfaces is presented. It allows the determination of α for thin films produced by a variety of deposition technologies, such as chemical vapor deposition, physical vapor deposition, and atomic layer deposition (ALD). The setup is based on two microelectromechanical systems (MEMS) Pirani sensors facing each other in a defined positioning. Because these MEMS sensors show a very high sensitivity in their individual molecular flow regimes, it is possible to measure the accommodation coefficients of gases without the disturbing influence of the transition regime. This paper presents the analytical backgroundmore » and the actual measurement principle. The results for air and nitrogen molecules on sputtered Au and Pt surfaces are presented.« less
Three Axes MEMS Combined Sensor for Electronic Stability Control System
NASA Astrophysics Data System (ADS)
Jeong, Heewon; Goto, Yasushi; Aono, Takanori; Nakamura, Toshiaki; Hayashi, Masahide
A microelectromechanical systems (MEMS) combined sensor measuring two-axis accelerations and an angular rate (rotation) has been developed for an electronic stability control system of automobiles. With the recent trend to mount the combined sensors in the engine compartment, the operation temperature range increased drastically, with the request of immunity to environmental disturbances such as vibration. In this paper, we report the combined sensor which has a gyroscopic part and two acceleration parts in single die. A deformation-robust MEMS structure has been adopted to achieve stable operation under wide temperature range (-40 to 125°C) in the engine compartment. A package as small as 10 × 19 × 4 mm is achieved by adopting TSV (through silicon via) and WLP (wafer-level package) technologies with enough performance as automotive grade.
Enabling MEMS technologies for communications systems
NASA Astrophysics Data System (ADS)
Lubecke, Victor M.; Barber, Bradley P.; Arney, Susanne
2001-11-01
Modern communications demands have been steadily growing not only in size, but sophistication. Phone calls over copper wires have evolved into high definition video conferencing over optical fibers, and wireless internet browsing. The technology used to meet these demands is under constant pressure to provide increased capacity, speed, and efficiency, all with reduced size and cost. Various MEMS technologies have shown great promise for meeting these challenges by extending the performance of conventional circuitry and introducing radical new systems approaches. A variety of strategic MEMS structures including various cost-effective free-space optics and high-Q RF components are described, along with related practical implementation issues. These components are rapidly becoming essential for enabling the development of progressive new communications systems technologies including all-optical networks, and low cost multi-system wireless terminals and basestations.
Adaptive optics ophthalmologic systems using dual deformable mirrors
NASA Astrophysics Data System (ADS)
Jones, S. M.; Olivier, S.; Chen, D.; Joeres, S.; Sadda, S.; Zawadzki, R. J.; Werner, J. S.; Miller, D. T.
2007-02-01
Adaptive Optics (AO) have been increasingly combined with a variety of ophthalmic instruments over the last decade to provide cellular-level, in-vivo images of the eye. The use of MEMS deformable mirrors in these instruments has recently been demonstrated to reduce system size and cost while improving performance. However, currently available MEMS mirrors lack the required range of motion for correcting large ocular aberrations, such as defocus and astigmatism. In order to address this problem, we have developed an AO system architecture that uses two deformable mirrors, in a woofer / tweeter arrangement, with a bimorph mirror as the woofer and a MEMS mirror as the tweeter. This setup provides several advantages, including extended aberration correction range, due to the large stroke of the bimorph mirror, high order aberration correction using the MEMS mirror, and additionally, the ability to 'focus' through the retina. This AO system architecture is currently being used in four instruments, including an Optical Coherence Tomography (OCT) system and a retinal flood-illuminated imaging system at the UC Davis Medical Center, a Scanning Laser Ophthalmoscope (SLO) at the Doheny Eye Institute, and an OCT system at Indiana University. The design, operation and evaluation of this type of AO system architecture will be presented.
Computer-aided design comparisons of monolithic and hybrid MEM-tunable VCSELs
NASA Astrophysics Data System (ADS)
Ochoa, Edward M.; Nelson, Thomas R., Jr.; Blum-Spahn, Olga; Lott, James A.
2003-07-01
We report and use our micro-electro-mechanically tunable vertical cavity surface emitting laser (MEM-TVCSEL) computer-aided design methodology to investigate the resonant frequency design space for monolithic and hybrid MEM-TVCSELs. For various initial optical air gap thickness, we examine the sensitivity of monolithic or hybrid MEM-TVCSEL resonant frequency by simulating zero, two, and four percent variations in III-V material growth thickness. As expected, as initial optical airgap increases, tuning range decreases due to less coupling between the active region and the tuning mirror. However, each design has different resonant frequency sensitivity to variations in III-V growth parameters. In particular, since the monolithic design is comprised of III-V material, the shift in all growth thicknesses significantly shifts the resonant frequency response. However, for hybrid MEMTVCSELs, less shift results, since the lower reflector is an Au mirror with reflectivity independent of III-V growth variations. Finally, since the hybrid design is comprised of a MUMPS polysilicon mechanical actuator, pull-in voltage remains independent of the initial optical airgap between the tuning reflector and the III-V material. Conversely, as the initial airgap increases in the monolithic design, the pull-in voltage significantly increases.
Chip based MEMS Ion Thruster to significantly enhance Cold Gas Thruster Lifetime for LISA
NASA Astrophysics Data System (ADS)
Tajmar, M.; Laufer, P.; Bock, D.
2017-05-01
Micropropulsion is a key component for ultraprecise attitude and orbit control required by the eLISA mission. LISA pathfinder uses cold gas micro thrusters that are accurate but require large tanks due to their very low specific impulse, which in turn limits the possible mission duration of the follow up eLISA mission. Recently, we developed a compact MEMS ion thruster on the chip with a size of only 1cm2 that can be simply attached to a gas feeding line like the one used for cold gas thrusters. It provides a specific impulse greater than 1000 s and only requires a single DC voltage. Since the operating principle is based on field emission, very low thrust noises similar to FEEP thrusters are expected but with gas propellants. The MEMS ion thruster chip could be mounted in parallel to the existing gold gas system providing high Isp and therefore long mission durations while leaving the cold gas system in place. To enable a possible mission extension, the MEMS ion thruster could take over from the cold gas system as a backup while maintaining the existing micropropulsion thruster system with its heritage therefore minimum risk.
Multiple Beam Torus Antenna Study. Volume 2
1977-03-01
matezal around the feed horn aperture yields 60Amin - (2 - 4 OHP (5-36) The minimum beam spacing for the front-fed MBTA as a function of D/X with -10- and...members were included. Secondly, the structural stresses on mem - bers at the survival loads were checked. Any member exceeding the yield stress limit...or buckling stress criteria was stiffened accordingly. The yield stress for the backup truss and support mem - bers was azsnad to be 36,000 psi for A36
Yuan, Xuebing; Yu, Shuai; Zhang, Shengzhi; Wang, Guoping; Liu, Sheng
2015-01-01
Inertial navigation based on micro-electromechanical system (MEMS) inertial measurement units (IMUs) has attracted numerous researchers due to its high reliability and independence. The heading estimation, as one of the most important parts of inertial navigation, has been a research focus in this field. Heading estimation using magnetometers is perturbed by magnetic disturbances, such as indoor concrete structures and electronic equipment. The MEMS gyroscope is also used for heading estimation. However, the accuracy of gyroscope is unreliable with time. In this paper, a wearable multi-sensor system has been designed to obtain the high-accuracy indoor heading estimation, according to a quaternion-based unscented Kalman filter (UKF) algorithm. The proposed multi-sensor system including one three-axis accelerometer, three single-axis gyroscopes, one three-axis magnetometer and one microprocessor minimizes the size and cost. The wearable multi-sensor system was fixed on waist of pedestrian and the quadrotor unmanned aerial vehicle (UAV) for heading estimation experiments in our college building. The results show that the mean heading estimation errors are less 10° and 5° to multi-sensor system fixed on waist of pedestrian and the quadrotor UAV, respectively, compared to the reference path. PMID:25961384
Determination Method of Bridge Rotation Angle Response Using MEMS IMU.
Sekiya, Hidehiko; Kinomoto, Takeshi; Miki, Chitoshi
2016-11-09
To implement steel bridge maintenance, especially that related to fatigue damage, it is important to monitor bridge deformations under traffic conditions. Bridges deform and rotate differently under traffic load conditions because their structures differ in terms of length and flexibility. Such monitoring enables the identification of the cause of stress concentrations that cause fatigue damage and the proposal of appropriate countermeasures. However, although bridge deformation monitoring requires observations of bridge angle response as well as the bridge displacement response, measuring the rotation angle response of a bridge subject to traffic loads is difficult. Theoretically, the rotation angle response can be calculated by integrating the angular velocity, but for field measurements of actual in-service bridges, estimating the necessary boundary conditions would be difficult due to traffic-induced vibration. To solve the problem, this paper proposes a method for determining the rotation angle response of an in-service bridge from its angular velocity, as measured by a inertial measurement unit (IMU). To verify our proposed method, field measurements were conducted using nine micro-electrical mechanical systems (MEMS) IMUs and two contact displacement gauges. The results showed that our proposed method provided high accuracy when compared to the reference responses calculated by the contact displacement gauges.
Research of a smart cutting tool based on MEMS strain gauge
NASA Astrophysics Data System (ADS)
Zhao, Y.; Zhao, Y. L.; Shao, YW; Hu, T. J.; Zhang, Q.; Ge, X. H.
2018-03-01
Cutting force is an important factor that affects machining accuracy, cutting vibration and tool wear. Machining condition monitoring by cutting force measurement is a key technology for intelligent manufacture. Current cutting force sensors exist problems of large volume, complex structure and poor compatibility in practical application, for these problems, a smart cutting tool is proposed in this paper for cutting force measurement. Commercial MEMS (Micro-Electro-Mechanical System) strain gauges with high sensitivity and small size are adopted as transducing element of the smart tool, and a structure optimized cutting tool is fabricated for MEMS strain gauge bonding. Static calibration results show that the developed smart cutting tool is able to measure cutting forces in both X and Y directions, and the cross-interference error is within 3%. Its general accuracy is 3.35% and 3.27% in X and Y directions, and sensitivity is 0.1 mV/N, which is very suitable for measuring small cutting forces in high speed and precision machining. The smart cutting tool is portable and reliable for practical application in CNC machine tool.
Wideband Electrically-Pumped 1050 nm MEMS-Tunable VCSEL for Ophthalmic Imaging.
John, Demis D; Burgner, Christopher B; Potsaid, Benjamin; Robertson, Martin E; Lee, Byung Kun; Choi, Woo Jhon; Cable, Alex E; Fujimoto, James G; Jayaraman, Vijaysekhar
2015-08-15
In this paper, we present a 1050 nm electrically-pumped micro-electro-mechanically-tunable vertical-cavity-surface-emitting-laser (MEMS-VCSEL) with a record dynamic tuning bandwidth of 63.8 nm, suitable for swept source optical coherence tomography (SS-OCT) imaging. These devices provide reduced cost & complexity relative to previously demonstrated optically pumped devices by obviating the need for a pump laser and associated hardware. We demonstrate ophthalmic SS-OCT imaging with the electrically-pumped MEMS-VCSEL at a 400 kHz axial scan rate for wide field imaging of the in vivo human retina over a 12 mm × 12 mm field and for OCT angiography of the macula over 6 mm × 6 mm & 3 mm × 3 mm fields to show retinal vasculature and capillary structure near the fovea. These results demonstrate the feasibility of electrically pumped MEMS-VCSELs in ophthalmic instrumentation, the largest clinical application of OCT. In addition, we estimate that the 3 dB coherence length in air is 225 meters ± 51 meters, far greater than required for ophthalmic SS-OCT and suggestive of other distance ranging applications.
NASA Astrophysics Data System (ADS)
Zhang, Guojun; Ding, Junwen; Xu, Wei; Liu, Yuan; Wang, Renxin; Han, Janjun; Bai, Bing; Xue, Chenyang; Liu, Jun; Zhang, Wendong
2018-05-01
A micro hydrophone based on piezoresistive effect, "MEMS vector hydrophone" was developed for acoustic detection application. To improve the sensitivity of MEMS vector hydrophone at low frequency, we reported a stress centralized MEMS vector hydrophone (SCVH) mainly used in 20-500 Hz. Stress concentration area was actualized in sensitive unit of hydrophone by silicon micromachining technology. Then piezoresistors were placed in stress concentration area for better mechanical response, thereby obtaining higher sensitivity. Static analysis was done to compare the mechanical response of three different sensitive microstructure: SCVH, conventional micro-silicon four-beam vector hydrophone (CFVH) and Lollipop-shaped vector hydrophone (LVH) respectively. And fluid-structure interaction (FSI) was used to analyze the natural frequency of SCVH for ensuring the measurable bandwidth. Eventually, the calibration experiment in standing wave field was done to test the property of SCVH and verify the accuracy of simulation. The results show that the sensitivity of SCVH has nearly increased by 17.2 dB in contrast to CFVH and 7.6 dB in contrast to LVH during 20-500 Hz.
MOEMS FPI sensors for NIR-MIR microspectrometer applications
NASA Astrophysics Data System (ADS)
Akujärvi, A.; Guo, B.; Mannila, R.; Rissanen, A.
2016-03-01
This paper presents near- and mid- infrared (NIR-MIR) wavelength range optical MEMS Fabry-Perot interferometers (FPIs) developed for automotive and multi-gas sensing applications. MEMS FPI platform for NIR-range consist of LPCVD (low-pressure chemical vapour) deposited polySi-SiN λ/4-thin film Bragg reflectors, with the air gap formed by sacrificial SiO2 etching in HF vapour. Characterization results for the NIR MFPI devices for λ = 1.5 - 2.0 μm show resolution of 15 nm at the optimization wavelength of 1750 nm. We also present a MIR-range MEMS FPI for λ = 2.5 - 3.5 μm, which utilizes silicon and air in within the Bragg reflector structure to provide a high contrast for improved resolution. Characterization results show a FWHM (Full Width Half Maximum) of 20 nm in comparison to the 50 nm resolution provided by earlier MEMS FPIs realized for hydrocarbon sensing with conventional CVD-thin film materials. The improved resolution and the extended operation region shows potential to enable simultaneous sensing of CO2 and multiple hydrocarbons.
A High Isolation Series-Shunt RF MEMS Switch
Yu, Yuan-Wei; Zhu, Jian; Jia, Shi-Xing; Shi, Yi
2009-01-01
This paper presents a wide band compact high isolation microelectromechanical systems (MEMS) switch implemented on a coplanar waveguide (CPW) with three ohmic switch cells, which is based on the series-shunt switch design. The ohmic switch shows a low intrinsic loss of 0.1 dB and an isolation of 24.8 dB at 6 GHz. The measured average pull-in voltage is 28 V and switching time is 47 μs. In order to shorten design period of the high isolation switch, a structure-based small-signal model for the 3-port ohmic MEMS switch is developed and parameters are extracted from the measured results. Then a high isolation switch has been developed where each 3-port ohmic MEMS switch is closely located. The agreement of the measured and modeled radio frequency (RF) performance demonstrates the validity of the electrical equivalent model. Measurements of the series-shunt switch indicate an outstanding isolation of more than 40 dB and a low insertion loss of 0.35 dB from DC to 12 GHz with total chip size of 1 mm × 1.2 mm. PMID:22408535
Solid oxide MEMS-based fuel cells
Jankowksi, Alan F.; Morse, Jeffrey D.
2007-03-13
A micro-electro-mechanical systems (MEMS) based thin-film fuel cells for electrical power applications. The MEMS-based fuel cell may be of a solid oxide type (SOFC), a solid polymer type (SPFC), or a proton exchange membrane type (PEMFC), and each fuel cell basically consists of an anode and a cathode separated by an electrolyte layer. The electrolyte layer can consist of either a solid oxide or solid polymer material, or proton exchange membrane electrolyte materials may be used. Additionally catalyst layers can also separate the electrodes (cathode and anode) from the electrolyte. Gas manifolds are utilized to transport the fuel and oxidant to each cell and provide a path for exhaust gases. The electrical current generated from each cell is drawn away with an interconnect and support structure integrated with the gas manifold. The fuel cells utilize integrated resistive heaters for efficient heating of the materials. By combining MEMS technology with thin-film deposition technology, thin-film fuel cells having microflow channels and full-integrated circuitry can be produced that will lower the operating temperature an will yield an order of magnitude greater power density than the currently known fuel cells.
Solid polymer MEMS-based fuel cells
Jankowski, Alan F [Livermore, CA; Morse, Jeffrey D [Pleasant Hill, CA
2008-04-22
A micro-electro-mechanical systems (MEMS) based thin-film fuel cells for electrical power applications. The MEMS-based fuel cell may be of a solid oxide type (SOFC), a solid polymer type (SPFC), or a proton exchange membrane type (PEMFC), and each fuel cell basically consists of an anode and a cathode separated by an electrolyte layer. The electrolyte layer can consist of either a solid oxide or solid polymer material, or proton exchange membrane electrolyte materials may be used. Additionally catalyst layers can also separate the electrodes (cathode and anode) from the electrolyte. Gas manifolds are utilized to transport the fuel and oxidant to each cell and provide a path for exhaust gases. The electrical current generated from each cell is drawn away with an interconnect and support structure integrated with the gas manifold. The fuel cells utilize integrated resistive heaters for efficient heating of the materials. By combining MEMS technology with thin-film deposition technology, thin-film fuel cells having microflow channels and full-integrated circuitry can be produced that will lower the operating temperature an will yield an order of magnitude greater power density than the currently known fuel cells.
Resonant Magnetic Field Sensors Based On MEMS Technology.
Herrera-May, Agustín L; Aguilera-Cortés, Luz A; García-Ramírez, Pedro J; Manjarrez, Elías
2009-01-01
Microelectromechanical systems (MEMS) technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI) and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration.
Resonant Magnetic Field Sensors Based On MEMS Technology
Herrera-May, Agustín L.; Aguilera-Cortés, Luz A.; García-Ramírez, Pedro J.; Manjarrez, Elías
2009-01-01
Microelectromechanical systems (MEMS) technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI) and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration. PMID:22408480
MEMS-based wide-bandwidth electromagnetic energy harvester with electroplated nickel structure
NASA Astrophysics Data System (ADS)
Sun, Shi; Dai, Xuhan; Sun, Yunna; Xiang, Xiaojian; Ding, Guifu; Zhao, Xiaolin
2017-11-01
A novel nickel-based nonlinear electromagnetic energy harvester has been designed, fabricated, and characterized in this work. Electroplated nickel is very suitable for a stretching-based mechanism to broaden the bandwidth due to its good process and mechanical properties. A strong hardening nonlinearity is induced due to the large deformation of the thin nickel based guided-beam structure. Combining the merits of both the mechanical properties and guided-beam structure, the energy harvester shows good bandwidth performance. It is found that increasing the thickness of the central platform could guarantee nonlinearity. Static and dynamic models of the energy harvester are simulated and validated. Test results show that the energy harvester has good repeatability without any destruction under a large deformation condition. At the acceleration of 0.5 g, comparative large bandwidths of 129 and 59 Hz are obtained for displacement and RMS output voltage, respectively. Power output of 3.4 µW and normalized power density of 125.92 µW cm-3 g-2 are achieved with the load resistance of 38 Ω.
MEMS-Based Force-Detected Nuclear Magnetic Resonance (FDNMR) Spectrometer
NASA Technical Reports Server (NTRS)
Lee, Choonsup; Butler, Mark C.; Elgammal, Ramez A.; George, Thomas; Hunt, Brian; Weitekamp, Daniel P.
2006-01-01
Nuclear Magnetic Resonance (NMR) spectroscopy allows assignment of molecular structure by acquiring the energy spectrum of nuclear spins in a molecule, and by interpreting the symmetry and positions of resonance lines in the spectrum. As such, NMR has become one of the most versatile and ubiquitous spectroscopic methods. Despite these tremendous successes, NMR experiments suffer from inherent low sensitivity due to the relatively low energy of photons in the radio frequency (rt) region of the electromagnetic spectrum. Here, we describe a high-resolution spectroscopy in samples with diameters in the micron range and below. We have reported design and fabrication of force-detected nuclear magnetic resonance (FDNMR).
Grayscale photomask fabricated by laser direct writing in metallic nano-films.
Guo, Chuan Fei; Cao, Sihai; Jiang, Peng; Fang, Ying; Zhang, Jianming; Fan, Yongtao; Wang, Yongsheng; Xu, Wendong; Zhao, Zhensheng; Liu, Qian
2009-10-26
The grayscale photomask plays a key role in grayscale lithography for creating 3D microstructures like micro-optical elements and MEMS structures, but how to fabricate grayscale masks in a cost-effective way is still a big challenge. Here we present novel low cost grayscale masks created in a two-step method by laser direct writing on Sn nano-films, which demonstrate continuous-tone gray levels depended on writing powers. The mechanism of the gray levels is due to the coexistence of the metal and the oxides formed in a laser-induced thermal process. The photomasks reveal good technical properties in fabricating 3D microstructures for practical applications.
Simulation of Mirror Electron Microscopy Caustic Images in Three-Dimensions
NASA Astrophysics Data System (ADS)
Kennedy, S. M.; Zheng, C. X.; Jesson, D. E.
A full, three-dimensional (3D) ray tracing approach is developed to simulate the caustics visible in mirror electron microscopy (MEM). The method reproduces MEM image contrast resulting from 3D surface relief. To illustrate the potential of the simulation methods, we study the evolution of crater contrast associated with a movie of GaAs structures generated by the droplet epitaxy technique. Specifically, we simulate the image contrast resulting from both a precursor stage and the final crater morphology which is consistent with an inverted pyramid consisting of (111) facet walls. The method therefore facilities the study of how self-assembled quantum structures evolve with time and, in particular, the development of anisotropic features including faceting.
BioMEMS for mitochondria medicine
NASA Astrophysics Data System (ADS)
Padmaraj, Divya
A BioMEMS device to study cell-mitochondrial physiological functionalities was developed. The pathogenesis of many diseases including obesity, diabetes and heart failure as well as aging has been linked to functional defects of mitochondria. The synthesis of Adenosine Tri Phosphate (ATP) is determined by the electrical potential across the inner mitochondrial membrane and by the pH difference due to proton flux across it. Therefore, electrical characterization by E-fields with complementary chemical testing was used here. The BioMEMS device was fabricated as an SU-8 based microfluidic system with gold electrodes on SiO2/Si wafers for electromagnetic interrogation. Ion Sensitive Field Effect Transistors (ISFETs) were incorporated for proton studies important in the electron transport chain, together with monitoring Na+, K+ and Ca++ ions for ion channel studies. ISFETs are chemically sensitive Metal Oxide Semiconductor Field Effect Transistor (MOSFET) devices and their threshold voltage is directly proportional to the electrolytic H+ ion variation. These ISFETs (sensitivity ˜55 mV/pH for H+) were further realized as specific ion sensitive Chemical Field Effect Transistors (CHEMFETs) by depositing a specific ion sensitive membrane on the gate. Electrodes for dielectric spectroscopy studies of mitochondria were designed as 2- and 4-probe structures for optimized operation over a wide frequency range. In addition, to limit polarization effects, a 4-electrode set-up with unique meshed pickup electrodes (7.5x7.5 mum2 loops with 4 mum wires) was fabricated. Sensitivity of impedance spectroscopy to membrane potential changes was confirmed by studying the influence of uncouplers and glucose on mitochondria. An electrical model was developed for the mitochondrial sample, and its frequency response correlated with impedance spectroscopy experiments of sarcolemmal mitochondria. Using the mesh electrode structure, we obtained a reduction of 83.28% in impedance at 200 Hz. COMSOL simulations of selected electrical structures in this sensor were compared with experimental results to better understand the physical system. A broadband permittivity analysis tool consisting of lumped and distributed structures was also developed. The frequency range of this device is from 100 Hz to 40 GHz and utilizes an interdigitated capacitor and coplanar waveguide. The simultaneous measurement of membrane potential, ion concentrations and pH would enhance diagnostics and studies of mitochondrial diseases.
Comparative performance study of smart structure for thermal microactuators
NASA Astrophysics Data System (ADS)
Yahya, Zulkarnain; Johar, Muhammad Akmal
2017-04-01
Thermal microactuator is one of earliest types of microactuators. Typical thermal actuators are in the form of Bimorph and Chevron structures. A bimorph thermal actuator has a complex movement direction, in arc motion and thus it is not feasible in the most MEMS designs. While Chevron actuator has a tendency to produce an off-plane movement which lead to low precision in lateral movement. A new thermal actuator design in the form of serpentine structures shows promising feature to have better performances in terms of more predictive lateral movement with smaller off-plane displacement. In MEMS chip design, areas play a critical role as it will impact with the cost of the final product. In this study, four different structures of thermal actuator were simulated using ANSYS v15. Three different set of area sizes which are 240 µm x 1000 µm, 240 µm x 1500 µm and 240 µm x 2000 µm have been analyzed. All four structures were named as Serpentine01, Serpentine02, Bimorph and Chevron. The data with regards to temperature produced by the structure and z-axis directional deformation were collected and analyzed. This paper reported the investigation result of comparison between these three types of thermal actuator structures design with a given area. From all of the result obtained, it is shown that the area 240 µm x 1500 µm showed a well balance performance in term of huge deformations and low power consumption. The Serpentine01 structure produced 16.7 µm deformation at 4mA of current. The results shows the potential of Serpentine01 structure as a new candidate for thermal microactuator for MEMS applications.
Design of a MEMS-Based Oscillator Using 180nm CMOS Technology.
Roy, Sukanta; Ramiah, Harikrishnan; Reza, Ahmed Wasif; Lim, Chee Cheow; Ferrer, Eloi Marigo
2016-01-01
Micro-electro mechanical system (MEMS) based oscillators are revolutionizing the timing industry as a cost effective solution, enhanced with more features, superior performance and better reliability. The design of a sustaining amplifier was triggered primarily to replenish MEMS resonator's high motion losses due to the possibility of their 'system-on-chip' integrated circuit solution. The design of a sustaining amplifier observing high gain and adequate phase shift for an electrostatic clamp-clamp (C-C) beam MEMS resonator, involves the use of an 180nm CMOS process with an unloaded Q of 1000 in realizing a fixed frequency oscillator. A net 122dBΩ transimpedance gain with adequate phase shift has ensured 17.22MHz resonant frequency oscillation with a layout area consumption of 0.121 mm2 in the integrated chip solution, the sustaining amplifier draws 6.3mW with a respective phase noise of -84dBc/Hz at 1kHz offset is achieved within a noise floor of -103dBC/Hz. In this work, a comparison is drawn among similar design studies on the basis of a defined figure of merit (FOM). A low phase noise of 1kHz, high figure of merit and the smaller size of the chip has accredited to the design's applicability towards in the implementation of a clock generative integrated circuit. In addition to that, this complete silicon based MEMS oscillator in a monolithic solution has offered a cost effective solution for industrial or biomedical electronic applications.
A Wireless MEMS-Based Inclinometer Sensor Node for Structural Health Monitoring
Ha, Dae Woong; Park, Hyo Seon; Choi, Se Woon; Kim, Yousok
2013-01-01
This paper proposes a wireless inclinometer sensor node for structural health monitoring (SHM) that can be applied to civil engineering and building structures subjected to various loadings. The inclinometer used in this study employs a method for calculating the tilt based on the difference between the static acceleration and the acceleration due to gravity, using a micro-electro-mechanical system (MEMS)-based accelerometer. A wireless sensor node was developed through which tilt measurement data are wirelessly transmitted to a monitoring server. This node consists of a slave node that uses a short-distance wireless communication system (RF 2.4 GHz) and a master node that uses a long-distance telecommunication system (code division multiple access—CDMA). The communication distance limitation, which is recognized as an important issue in wireless monitoring systems, has been resolved via these two wireless communication components. The reliability of the proposed wireless inclinometer sensor node was verified experimentally by comparing the values measured by the inclinometer and subsequently transferred to the monitoring server via wired and wireless transfer methods to permit a performance evaluation of the wireless communication sensor nodes. The experimental results indicated that the two systems (wired and wireless transfer systems) yielded almost identical values at a tilt angle greater than 1°, and a uniform difference was observed at a tilt angle less than 0.42° (approximately 0.0032° corresponding to 0.76% of the tilt angle, 0.42°) regardless of the tilt size. This result was deemed to be within the allowable range of measurement error in SHM. Thus, the wireless transfer system proposed in this study was experimentally verified for practical application in a structural health monitoring system. PMID:24287533
Characterization of a Polymer-Based MEMS Pyroelectric Infrared Detector
2007-03-01
The value, K, in Equation (8) is generic to all thermal detectors. This value, depending on the type of thermal detector, varies due to the ... the current generated due to a ramp in temperature. The main rationale for this biasing is to align the polar axis perpendicular to the face of ...PVA_CB-based imaging system . Due to the
NASA Astrophysics Data System (ADS)
Thao, Pham Ngoc; Yoshida, Shinya; Tanaka, Shuji
2017-12-01
This paper reports on the development of a metallic buffer layer structure, (100) SrRuO3 (SRO)/(100) Pt/(100) Ir/(100) yttria-stabilized zirconia (YSZ) layers for the epitaxial growth of a c-axis oriented Pb(Mn1/3,Nb2/3)O3-Pb(Zr,Ti)O3 (PMnN-PZT) thin film on a (100) Si wafer for piezoelectric micro-electro mechanical systems (MEMS) application. The stacking layers were epitaxially grown on a Si substrate under the optimal deposition condition. A crack-free PMnN-PZT epitaxial thin films was obtained at a thickness up to at least 1.7 µm, which is enough for MEMS applications. The unimorph MEMS cantilevers based on the PMnN-PZT thin film were fabricated and characterized. As a result, the PMnN-PZT thin film exhibited -10 to -12 C/m2 as a piezoelectric coefficient e 31,f and ˜250 as a dielectric constants ɛr. The resultant FOM for piezoelectric micromachined ultrasonic transducer (pMUT) is higher than those of general PZT and AlN thin films. This structure has a potential to provide high-performance pMUTs.
Additive direct-write microfabrication for MEMS: A review
NASA Astrophysics Data System (ADS)
Teh, Kwok Siong
2017-12-01
Direct-write additive manufacturing refers to a rich and growing repertoire of well-established fabrication techniques that builds solid objects directly from computer- generated solid models without elaborate intermediate fabrication steps. At the macroscale, direct-write techniques such as stereolithography, selective laser sintering, fused deposition modeling ink-jet printing, and laminated object manufacturing have significantly reduced concept-to-product lead time, enabled complex geometries, and importantly, has led to the renaissance in fabrication known as the maker movement. The technological premises of all direct-write additive manufacturing are identical—converting computer generated three-dimensional models into layers of two-dimensional planes or slices, which are then reconstructed sequentially into threedimensional solid objects in a layer-by-layer format. The key differences between the various additive manufacturing techniques are the means of creating the finished layers and the ancillary processes that accompany them. While still at its infancy, direct-write additive manufacturing techniques at the microscale have the potential to significantly lower the barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMS parts that have larger dimensions, high aspect ratios, and complex shapes. In recent years, significant advancements in materials chemistry, laser technology, heat and fluid modeling, and control systems have enabled additive manufacturing to achieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMS fabrication. Compared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, direct-write additive manufacturing techniques allow for rapid design-to-prototype realization by limiting or circumventing the need for cleanrooms, photolithography and extensive training. With current direct-write additive manufacturing technologies, it is possible to fabricate unsophisticated micrometer scale structures at adequate resolutions and precisions using materials that range from polymers, metals, ceramics, to composites. In both academia and industry, direct-write additive manufacturing offers extraordinary promises to revolutionize research and development in microfabrication and MEMS technologies. Importantly, direct-write additive manufacturing could appreciably augment current MEMS fabrication technologies, enable faster design-to-product cycle, empower new paradigms in MEMS designs, and critically, encourage wider participation in MEMS research at institutions or for individuals with limited or no access to cleanroom facilities. This article aims to provide a limited review of the current landscape of direct-write additive manufacturing techniques that are potentially applicable for MEMS microfabrication.
Joosub, Imraan; Gray, Andy; Crisostomo, Analyn; Salam, Abdul
2015-11-01
The aim of this study was to compare the costs of management of moderate to severe infections in patients treated with imipenem/cilastatin (IC) and meropenem (MEM). Pharmacoeconomic studies in Saudi Arabia are scarce. The current hospital formulary contains 2 carbapenems: IC and MEM. These antibiotics share a similar spectrum of activity. There are conflicting reviews with regard to the relative cost-effectiveness of these two agents. A retrospective, single-centre cohort study of 88 patients of IC versus MEM in moderate to severe infections was performed, applying cost-minimization analysis (CMA) methods. In accordance with CMA methods, the assumption of equivalent efficacy was first demonstrated by literature retrieved and appraised. Adult patients (⩾18 years old) diagnosed with moderate to severe infections, including skin and skin structure infections (SSIs), sepsis, intra-abdominal infections (IAIs), respiratory tract infections, urinary tract infections (UTIs) and hospital-acquired infections (HAIs), who were prescribed IC 500 mg every six hours intravenously (2 g per day) or MEM 1 g every eight hours (3 g per day), were included in the study. Only direct costs related to the management of the infections were included, in accordance with a payer perspective. Overall there was no difference in the mean total daily costs between IC (SAR 4784.46, 95% CI 4140.68, 5428.24) and MEM (4390.14, 95% CI 3785.82, 4994.45; p = 0.37). A significantly lower medicine acquisition cost per vial of IC was observed when compared to MEM, however there was a significantly higher cost attached to administration sets used in the IC group than the MEM group. Consultation, nursing and physician costs were not significantly different between the groups. No differences were observed in costs associated with adverse drug events (ADEs). This study has shown that while acquisition costs of IC at a dose of 500 mg q6 h may be lower than for MEM 1 g q8 h, mean total costs per day were not significantly different between IC and MEM, indicating that medicine costs are only a small element of the overall costs of managing moderate to severe infections.
Urban MEMS based seismic network for post-earthquakes rapid disaster assessment
NASA Astrophysics Data System (ADS)
D'Alessandro, Antonino; Luzio, Dario; D'Anna, Giuseppe
2014-05-01
Life losses following disastrous earthquake depends mainly by the building vulnerability, intensity of shaking and timeliness of rescue operations. In recent decades, the increase in population and industrial density has significantly increased the exposure to earthquakes of urban areas. The potential impact of a strong earthquake on a town center can be reduced by timely and correct actions of the emergency management centers. A real time urban seismic network can drastically reduce casualties immediately following a strong earthquake, by timely providing information about the distribution of the ground shaking level. Emergency management centers, with functions in the immediate post-earthquake period, could be use this information to allocate and prioritize resources to minimize loss of human life. However, due to the high charges of the seismological instrumentation, the realization of an urban seismic network, which may allow reducing the rate of fatalities, has not been achieved. Recent technological developments in MEMS (Micro Electro-Mechanical Systems) technology could allow today the realization of a high-density urban seismic network for post-earthquakes rapid disaster assessment, suitable for the earthquake effects mitigation. In the 1990s, MEMS accelerometers revolutionized the automotive-airbag system industry and are today widely used in laptops, games controllers and mobile phones. Due to their great commercial successes, the research into and development of MEMS accelerometers are actively pursued around the world. Nowadays, the sensitivity and dynamics of these sensors are such to allow accurate recording of earthquakes with moderate to strong magnitude. Due to their low cost and small size, the MEMS accelerometers may be employed for the realization of high-density seismic networks. The MEMS accelerometers could be installed inside sensitive places (high vulnerability and exposure), such as schools, hospitals, public buildings and places of worship. The waveforms recorded could be promptly used to determine ground-shaking parameters, like peak ground acceleration/velocity/displacement, Arias and Housner intensity, that could be all used to create, few seconds after a strong earthquakes, shaking maps at urban scale. These shaking maps could allow to quickly identify areas of the town center that have had the greatest earthquake resentment. When a strong seismic event occur, the beginning of the ground motion observed at the site could be used to predict the ensuing ground motion at the same site and so to realize a short term earthquake early warning system. The data acquired after a moderate magnitude earthquake, would provide valuable information for the detail seismic microzonation of the area based on direct earthquake shaking observations rather than from a model-based or indirect methods. In this work, we evaluate the feasibility and effectiveness of such seismic network taking in to account both technological, scientific and economic issues. For this purpose, we have simulated the creation of a MEMS based urban seismic network in a medium size city. For the selected town, taking into account the instrumental specifics, the array geometry and the environmental noise, we investigated the ability of the planned network to detect and measure earthquakes of different magnitude generated from realistic near seismogentic sources.
HIGH-RESOLUTION LINEAR POLARIMETRIC IMAGING FOR THE EVENT HORIZON TELESCOPE
DOE Office of Scientific and Technical Information (OSTI.GOV)
Chael, Andrew A.; Johnson, Michael D.; Narayan, Ramesh
Images of the linear polarizations of synchrotron radiation around active galactic nuclei (AGNs) highlight their projected magnetic field lines and provide key data for understanding the physics of accretion and outflow from supermassive black holes. The highest-resolution polarimetric images of AGNs are produced with Very Long Baseline Interferometry (VLBI). Because VLBI incompletely samples the Fourier transform of the source image, any image reconstruction that fills in unmeasured spatial frequencies will not be unique and reconstruction algorithms are required. In this paper, we explore some extensions of the Maximum Entropy Method (MEM) to linear polarimetric VLBI imaging. In contrast to previousmore » work, our polarimetric MEM algorithm combines a Stokes I imager that only uses bispectrum measurements that are immune to atmospheric phase corruption, with a joint Stokes Q and U imager that operates on robust polarimetric ratios. We demonstrate the effectiveness of our technique on 7 and 3 mm wavelength quasar observations from the VLBA and simulated 1.3 mm Event Horizon Telescope observations of Sgr A* and M87. Consistent with past studies, we find that polarimetric MEM can produce superior resolution compared to the standard CLEAN algorithm, when imaging smooth and compact source distributions. As an imaging framework, MEM is highly adaptable, allowing a range of constraints on polarization structure. Polarimetric MEM is thus an attractive choice for image reconstruction with the EHT.« less
Influence of adhesive rough surface contact on microswitches
NASA Astrophysics Data System (ADS)
Wu, Ling; Rochus, V.; Noels, L.; Golinval, J. C.
2009-12-01
Stiction is a major failure mode in microelectromechanical systems (MEMS). Undesirable stiction, which results from contact between surfaces, threatens the reliability of MEMS severely as it breaks the actuation function of MEMS switches, for example. Although it may be possible to avoid stiction by increasing restoring forces using high spring constants, it follows that the actuation voltage has also to be increased significantly, which reduces the efficiency. In our research, an electrostatic-structural analysis is performed to estimate the proper design range of the equivalent spring constant, which is the main factor of restoring force in MEMS switches. The upper limit of equivalent spring constant is evaluated based on the initial gap width, the dielectric thickness, and the expected actuation voltage. The lower limit is assessed on the value of adhesive forces between the two contacting rough surfaces. The MEMS devices studied here are assumed to work in a dry environment. In these operating conditions only the van der Waals forces have to be considered for adhesion. A statistical model is used to simulate the rough surface, and the Maugis's model is combined with Kim's expansion to calculate adhesive forces. In the resulting model, the critical value of the spring stiffness depends on the material and surface properties, such as the elastic modulus, surface energy, and surface roughness. The aim of this research is to propose simple rules for design purposes.
Micromechanical Structures Fabrication
DOE Office of Scientific and Technical Information (OSTI.GOV)
Rajic, S
2001-05-08
Work in materials other than silicon for MEMS applications has typically been restricted to metals and metal oxides instead of more ''exotic'' semiconductors. However, group III-V and II-VI semiconductors form a very important and versatile collection of material and electronic parameters available to the MEMS and MOEMS designer. With these materials, not only are the traditional mechanical material variables (thermal conductivity, thermal expansion, Young's modulus, etc.) available, but also chemical constituents can be varied in ternary and quaternary materials. This flexibility can be extremely important for both friction and chemical compatibility issues for MEMS. In addition, the ability to continuallymore » vary the bandgap energy can be particularly useful for many electronics and infrared detection applications. However, there are two major obstacles associated with alternate semiconductor material MEMS. The first issue is the actual fabrication of non-silicon micro-devices and the second impediment is communicating with these novel devices. We have implemented an essentially material independent fabrication method that is amenable to most group III-V and II-VI semiconductors. This technique uses a combination of non-traditional direct write precision fabrication processes such as diamond turning, ion milling, laser ablation, etc. This type of deterministic fabrication approach lends itself to an almost trivial assembly process. We also implemented a mechanical, electrical, and optical self-aligning hybridization technique for these alternate-material MEMS substrates.« less
High-resolution Linear Polarimetric Imaging for the Event Horizon Telescope
NASA Astrophysics Data System (ADS)
Chael, Andrew A.; Johnson, Michael D.; Narayan, Ramesh; Doeleman, Sheperd S.; Wardle, John F. C.; Bouman, Katherine L.
2016-09-01
Images of the linear polarizations of synchrotron radiation around active galactic nuclei (AGNs) highlight their projected magnetic field lines and provide key data for understanding the physics of accretion and outflow from supermassive black holes. The highest-resolution polarimetric images of AGNs are produced with Very Long Baseline Interferometry (VLBI). Because VLBI incompletely samples the Fourier transform of the source image, any image reconstruction that fills in unmeasured spatial frequencies will not be unique and reconstruction algorithms are required. In this paper, we explore some extensions of the Maximum Entropy Method (MEM) to linear polarimetric VLBI imaging. In contrast to previous work, our polarimetric MEM algorithm combines a Stokes I imager that only uses bispectrum measurements that are immune to atmospheric phase corruption, with a joint Stokes Q and U imager that operates on robust polarimetric ratios. We demonstrate the effectiveness of our technique on 7 and 3 mm wavelength quasar observations from the VLBA and simulated 1.3 mm Event Horizon Telescope observations of Sgr A* and M87. Consistent with past studies, we find that polarimetric MEM can produce superior resolution compared to the standard CLEAN algorithm, when imaging smooth and compact source distributions. As an imaging framework, MEM is highly adaptable, allowing a range of constraints on polarization structure. Polarimetric MEM is thus an attractive choice for image reconstruction with the EHT.
Study on film resistivity of Energy Conversion Components for MEMS Initiating Explosive Device
NASA Astrophysics Data System (ADS)
Ren, Wei; Zhang, Bin; Zhao, Yulong; Chu, Enyi; Yin, Ming; Li, Hui; Wang, Kexuan
2018-03-01
Resistivity of Plane-film Energy Conversion Components is a key parameter to influence its resistance and explosive performance, and also it has important relations with the preparation of thin film technology, scale, structure and etc. In order to improve the design of Energy Conversion Components for MEMS Initiating Explosive Device, and reduce the design deviation of Energy Conversion Components in microscale, guarantee the design resistance and ignition performance of MEMS Initiating Explosive Device, this paper theoretically analyzed the influence factors of film resistivity in microscale, through the preparation of Al film and Ni-Cr film at different thickness with micro/nano, then obtain the film resistivity parameter of the typical metal under different thickness, and reveals the effect rule of the scale to the resistivity in microscale, at the same time we obtain the corresponding inflection point data.
Dynamic focus-tracking MEMS scanning micromirror with low actuation voltages for endoscopic imaging
Strathman, Matthew; Liu, Yunbo; Li, Xingde; Lin, Lih Y.
2013-01-01
We demonstrate a 3-D scanning micromirror device that combines 2-D beam scanning with focus control in the same device using micro-electro-mechanical-systems (MEMS) technology. 2-D beam scanning is achieved with a biaxial gimbal structure and focus control is obtained with a deformable mirror membrane surface. The micromirror with 800 micrometer diameter is designed to be sufficiently compact and efficient so that it can be incorporated into an endoscopic imaging probe in the future. The design, fabrication and characterization of the device are described in this paper. Using the focus-tracking MEMS scanning mirror, we achieved an optical scanning range of >16 degrees with <40 V actuation voltage at resonance and a tunable focal length between infinity and 25 mm with <100V applied bias. PMID:24104304
NASA Astrophysics Data System (ADS)
Teves, André da Costa; Lima, Cícero Ribeiro de; Passaro, Angelo; Silva, Emílio Carlos Nelli
2017-03-01
Electrostatic or capacitive accelerometers are among the highest volume microelectromechanical systems (MEMS) products nowadays. The design of such devices is a complex task, since they depend on many performance requirements, which are often conflicting. Therefore, optimization techniques are often used in the design stage of these MEMS devices. Because of problems with reliability, the technology of MEMS is not yet well established. Thus, in this work, size optimization is combined with the reliability-based design optimization (RBDO) method to improve the performance of accelerometers. To account for uncertainties in the dimensions and material properties of these devices, the first order reliability method is applied to calculate the probabilities involved in the RBDO formulation. Practical examples of bulk-type capacitive accelerometer designs are presented and discussed to evaluate the potential of the implemented RBDO solver.
Design of RF MEMS switches without pull-in instability
NASA Astrophysics Data System (ADS)
Proctor, W. Cyrus; Richards, Gregory P.; Shen, Chongyi; Skorczewski, Tyler; Wang, Min; Zhang, Jingyan; Zhong, Peng; Massad, Jordan E.; Smith, Ralph
2010-04-01
Micro-electro-mechanical systems (MEMS) switches for radio-frequency (RF) signals have certain advantages over solid-state switches, such as lower insertion loss, higher isolation, and lower static power dissipation. Mechanical dynamics can be a determining factor for the reliability of RF MEMS. The RF MEMS ohmic switch discussed in this paper consists of a plate suspended over an actuation pad by four double-cantilever springs. Closing the switch with a simple step actuation voltage typically causes the plate to rebound from its electrical contacts. The rebound interrupts the signal continuity and degrades the performance, reliability and durability of the switch. The switching dynamics are complicated by a nonlinear, electrostatic pull-in instability that causes high accelerations. Slow actuation and tailored voltage control signals can mitigate switch bouncing and effects of the pull-in instability; however, slow switching speed and overly-complex input signals can significantly penalize overall system-level performance. Examination of a balanced and optimized alternative switching solution is sought. A step toward one solution is to consider a pull-in-free switch design. In this paper, determine how simple RC-circuit drive signals and particular structural properties influence the mechanical dynamics of an RF MEMS switch designed without a pull-in instability. The approach is to develop a validated modeling capability and subsequently study switch behavior for variable drive signals and switch design parameters. In support of project development, specifiable design parameters and constraints will be provided. Moreover, transient data of RF MEMS switches from laser Doppler velocimetry will be provided for model validation tasks. Analysis showed that a RF MEMS switch could feasibly be designed with a single pulse waveform and no pull-in instability and achieve comparable results to previous waveform designs. The switch design could reliably close in a timely manner, with small contact velocity, usually with little to no rebound even when considering manufacturing variability.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Ha, Thi Dep, E-mail: hathidep@yahoo.com; Faculty of Electronic Technology, Industrial University of Ho Chi Minh City, Hochiminh City; Bao, JingFu, E-mail: baojingfu@uestc.edu.cn
Phononic crystals (PnCs) and n-type doped silicon technique have been widely employed in silicon-based MEMS resonators to obtain high quality factor (Q) as well as temperature-induced frequency stability. For the PnCs, their band gaps play an important role in the acoustic wave propagation. Also, the temperature and dopant doped into silicon can cause the change in its material properties such as elastic constants, Young’s modulus. Therefore, in order to design the simultaneous high Q and frequency stability silicon-based MEMS resonators by two these techniques, a careful design should study effects of temperature and dopant on the band gap characteristics tomore » examine the acoustic wave propagation in the PnC. Based on these, this paper presents (1) a proposed silicon-based PnC strip structure for support tether applications in low frequency silicon-based MEMS resonators, (2) influences of temperature and dopant on band gap characteristics of the PnC strips. The simulation results show that the largest band gap can achieve up to 33.56 at 57.59 MHz and increase 1280.13 % (also increase 131.89 % for ratio of the widest gaps) compared with the counterpart without hole. The band gap properties of the PnC strips is insignificantly effected by temperature and electron doping concentration. Also, the quality factor of two designed length extensional mode MEMS resonators with proposed PnC strip based support tethers is up to 1084.59% and 43846.36% over the same resonators with PnC strip without hole and circled corners, respectively. This theoretical study uses the finite element analysis in COMSOL Multiphysics and MATLAB softwares as simulation tools. This findings provides a background in combination of PnC and dopant techniques for high performance silicon-based MEMS resonators as well as PnC-based MEMS devices.« less
NASA Astrophysics Data System (ADS)
Yamada, Shooji; Yamaguchi, Hiroshi; Ishihara, Sunao
2009-06-01
Microelectromechanical systems (MEMS) are widely used small electromechanical systems made of micrometre-sized components. Presently, we are witnessing a transition from MEMS to nanoelectromechanical systems (NEMS), which comprise devices integrating electrical and mechanical functionality on the nanoscale and offer new exciting applications. Similarly to MEMS, NEMS typically include a central transistor-like nanoelectronic unit for data processing, as well as mechanical actuators, pumps, and motors; and they may combine with physical, biological and chemical sensors. In the transition from MEMS to NEMS, component sizes need to be reduced. Therefore, many fabrication methods previously developed for MEMS are unsuitable for the production of high-precision NEMS components. The key challenge in NEMS is therefore the development of new methods for routine and reproducible nanofabrication. Two complementary types of method for NEMS fabrication are available: 'top-down' and 'bottom-up'. The top-down approach uses traditional lithography technologies, whereas bottom-up techniques include molecular self-organization, self-assembly and nanodeposition. The NT2008 conference, held at Ishikawa High-Tech Conference Center, Ishikawa, Japan, between 23-25 October 2008, focused on novel NEMS fabricated from new materials and on process technologies. The topics included compound semiconductors, small mechanical structures, nanostructures for micro-fluid and bio-sensors, bio-hybrid micro-machines, as well as their design and simulation. This focus issue compiles seven articles selected from 13 submitted manuscripts. The articles by Prinz et al and Kehrbusch et al introduce the frontiers of the top-down production of various operational NEMS devices, and Kometani et al present an example of the bottom-up approach, namely ion-beam induced deposition of MEMS and NEMS. The remaining articles report novel technologies for biological sensors. Taira et al have used manganese nanoparticles to improve the chemical analysis of biological samples by laser desorption/ionization mass spectrometry. Matsumoto et al have prepared sugar microarrays via click chemistry and have applied this to the detection and characterization of proteins. Yoshimura et al have expanded the single-nucleotide polymorphism typing method to differentiate genes from various food crops, such as indica and japonica rice. Finally, Takashi et al have designed a nanoparticle-based strip sensor, which can be used for rapid evaluation of the psychological condition of animals and humans. We hope that this focus issue will help readers to understand, from a materials science viewpoint, different aspects of frontier research into NEMS.
A MEMS-based Air Flow Sensor with a Free-standing Micro-cantilever Structure.
Wang, Yu-Hsiang; Lee, Chia-Yen; Chiang, Che-Ming
2007-10-17
This paper presents a micro-scale air flow sensor based on a free-standingcantilever structure. In the fabrication process, MEMS techniques are used to deposit asilicon nitride layer on a silicon wafer. A platinum layer is deposited on the silicon nitridelayer to form a piezoresistor, and the resulting structure is then etched to create afreestanding micro-cantilever. When an air flow passes over the surface of the cantileverbeam, the beam deflects in the downward direction, resulting in a small variation in theresistance of the piezoelectric layer. The air flow velocity is determined by measuring thechange in resistance using an external LCR meter. The experimental results indicate that theflow sensor has a high sensitivity (0.0284 ω/ms -1 ), a high velocity measurement limit (45ms -1 ) and a rapid response time (0.53 s).
NASA Astrophysics Data System (ADS)
Kim, Ilkyu
Recent developments in mobile communications have led to an increased appearance of short-range communications and high data-rate signal transmission. New technologies provides the need for an accurate near-field coupling analysis and novel antenna designs. An ability to effectively estimate the coupling within the near-field region is required to realize short-range communications. Currently, two common techniques that are applicable to the near-field coupling problem are 1) integral form of coupling formula and 2) generalized Friis formula. These formulas are investigated with an emphasis on straightforward calculation and accuracy for various distances between the two antennas. The coupling formulas are computed for a variety of antennas, and several antenna configurations are evaluated through full-wave simulation and indoor measurement in order to validate these techniques. In addition, this research aims to design multi-functional and high performance antennas based on MEMS (Microelectromechanical Systems) switches, EBG (Electromagnetic Bandgap) structures, and septum polarizers. A MEMS switch is incorporated into a slot loaded patch antenna to attain frequency reconfigurability. The resonant frequency of the patch antenna can be shifted using the MEM switch, which is actuated by the integrated bias networks. Furthermore, a high gain base-station antenna utilizing beam-tilting is designed to maximize gain for tilted beam applications. To realize this base-station antenna, an array of four dipole-EBG elements is constructed to implement a fixed down-tilt main beam with application in base station arrays. An improvement of the operating range with the EBG-dipole array is evaluated using a simple linkbudget analysis. The septum polarizer has been widely used in circularly polarized antenna systems due to its simple and compact design and high quality of circularity. In this research, the sigmoid function is used to smoothen the edge in the septum design, which makes it suitable for HPM systems. The PSO (Particle Swarm Optimization) technique is applied to the septum design to achieve a high performance antenna design. The electric field intensity above the septum is evaluated through the simulation and its properties are compared to simple half-plane scattering phenomena.
NASA Astrophysics Data System (ADS)
Pabst, Oliver; Schiffer, Michael; Obermeier, Ernst; Tekin, Tolga; Lang, Klaus Dieter; Ngo, Ha-Duong
2011-06-01
Silicon carbide (SiC) is a promising material for applications in harsh environments. Standard silicon (Si) microelectromechanical systems (MEMS) are limited in operating temperature to temperatures below 130 °C for electronic devices and below 600 °C for mechanical devices. Due to its large bandgap SiC enables MEMS with significantly higher operating temperatures. Furthermore, SiC exhibits high chemical stability and thermal conductivity. Young's modulus and residual stress are important mechanical properties for the design of sophisticated SiC-based MEMS devices. In particular, residual stresses are strongly dependent on the deposition conditions. Literature values for Young's modulus range from 100 to 400 GPa, and residual stresses range from 98 to 486 MPa. In this paper we present our work on investigating Young's modulus and residual stress of SiC films deposited on single crystal bulk silicon using bulge testing. This method is based on measurement of pressure-dependent membrane deflection. Polycrystalline as well as single crystal cubic silicon carbide samples are studied. For the samples tested, average Young's modulus and residual stress measured are 417 GPa and 89 MPa for polycrystalline samples. For single crystal samples, the according values are 388 GPa and 217 MPa. These results compare well with literature values.
Zhang, Xinfu; Wang, Chao; Jin, Liji; Han, Zhuo; Xiao, Yi
2014-08-13
Plasma membranes can sense the stimulations and transmit the signals from extracellular environment and then make further responses through changes in locations, shapes or morphologies. Common fluorescent membrane markers are not well suited for long time tracking due to their shorter retention time inside plasma membranes and/or their lower photostability. To this end, we develop a new bipolar marker, Mem-SQAC, which can stably insert into plasma membranes of different cells and exhibits a long retention time over 30 min. Mem-SQAC also inherits excellent photostability from the BODIPY dye family. Large two-photon absorption cross sections and long wavelength fluorescence emissions further enhance the competitiveness of Mem-SQAC as a membrane marker. By using Mem-SQAC, significant morphological changes of plasma membranes have been monitored during heavy metal poisoning and drug induced apoptosis of MCF-7 cells; the change tendencies are so distinctly different from each other that they can be used as indicators to distinguish different cell injuries. Further on, the complete processes of endocytosis toward Staphylococcus aureus and Escherichia coli by RAW 264.7 cells have been dynamically tracked. It is discovered that plasma membranes take quite different actions in response to the two bacteria, information unavailable in previous research reports.
NASA Astrophysics Data System (ADS)
Vinande, Eric T.
This research proposes several means to overcome challenges in the urban environment to ground vehicle global positioning system (GPS) receiver navigation performance through the integration of external sensor information. The effects of narrowband radio frequency interference and signal attenuation, both common in the urban environment, are examined with respect to receiver signal tracking processes. Low-cost microelectromechanical systems (MEMS) inertial sensors, suitable for the consumer market, are the focus of receiver augmentation as they provide an independent measure of motion and are independent of vehicle systems. A method for estimating the mounting angles of an inertial sensor cluster utilizing typical urban driving maneuvers is developed and is able to provide angular measurements within two degrees of truth. The integration of GPS and MEMS inertial sensors is developed utilizing a full state navigation filter. Appropriate statistical methods are developed to evaluate the urban environment navigation improvement due to the addition of MEMS inertial sensors. A receiver evaluation metric that combines accuracy, availability, and maximum error measurements is presented and evaluated over several drive tests. Following a description of proper drive test techniques, record and playback systems are evaluated as the optimal way of testing multiple receivers and/or integrated navigation systems in the urban environment as they simplify vehicle testing requirements.
An Enhanced MEMS Error Modeling Approach Based on Nu-Support Vector Regression
Bhatt, Deepak; Aggarwal, Priyanka; Bhattacharya, Prabir; Devabhaktuni, Vijay
2012-01-01
Micro Electro Mechanical System (MEMS)-based inertial sensors have made possible the development of a civilian land vehicle navigation system by offering a low-cost solution. However, the accurate modeling of the MEMS sensor errors is one of the most challenging tasks in the design of low-cost navigation systems. These sensors exhibit significant errors like biases, drift, noises; which are negligible for higher grade units. Different conventional techniques utilizing the Gauss Markov model and neural network method have been previously utilized to model the errors. However, Gauss Markov model works unsatisfactorily in the case of MEMS units due to the presence of high inherent sensor errors. On the other hand, modeling the random drift utilizing Neural Network (NN) is time consuming, thereby affecting its real-time implementation. We overcome these existing drawbacks by developing an enhanced Support Vector Machine (SVM) based error model. Unlike NN, SVMs do not suffer from local minimisation or over-fitting problems and delivers a reliable global solution. Experimental results proved that the proposed SVM approach reduced the noise standard deviation by 10–35% for gyroscopes and 61–76% for accelerometers. Further, positional error drifts under static conditions improved by 41% and 80% in comparison to NN and GM approaches. PMID:23012552
Model-Based Angular Scan Error Correction of an Electrothermally-Actuated MEMS Mirror
Zhang, Hao; Xu, Dacheng; Zhang, Xiaoyang; Chen, Qiao; Xie, Huikai; Li, Suiqiong
2015-01-01
In this paper, the actuation behavior of a two-axis electrothermal MEMS (Microelectromechanical Systems) mirror typically used in miniature optical scanning probes and optical switches is investigated. The MEMS mirror consists of four thermal bimorph actuators symmetrically located at the four sides of a central mirror plate. Experiments show that an actuation characteristics difference of as much as 4.0% exists among the four actuators due to process variations, which leads to an average angular scan error of 0.03°. A mathematical model between the actuator input voltage and the mirror-plate position has been developed to predict the actuation behavior of the mirror. It is a four-input, four-output model that takes into account the thermal-mechanical coupling and the differences among the four actuators; the vertical positions of the ends of the four actuators are also monitored. Based on this model, an open-loop control method is established to achieve accurate angular scanning. This model-based open loop control has been experimentally verified and is useful for the accurate control of the mirror. With this control method, the precise actuation of the mirror solely depends on the model prediction and does not need the real-time mirror position monitoring and feedback, greatly simplifying the MEMS control system. PMID:26690432
Surface-micromachined chain for use in microelectromechanical structures
DOE Office of Scientific and Technical Information (OSTI.GOV)
Vernon, Sr., George E.
2001-01-01
A surface-micromachined chain and a microelectromechanical (MEM) structure incorporating such a chain are disclosed. The surface-micromachined chain can be fabricated in place on a substrate (e.g. a silicon substrate) by depositing and patterning a plurality of alternating layers of a chain-forming material (e.g. polycrystalline silicon) and a sacrificial material (e.g. silicon dioxide or a silicate glass). The sacrificial material is then removed by etching to release the chain for movement. The chain has applications for forming various types of MEM devices which include a microengine (e.g. an electrostatic motor) connected to rotate a drive sprocket, with the surface-micromachined chain beingmore » connected between the drive sprocket and one or more driven sprockets.« less
Long working distance incoherent interference microscope
Sinclair, Michael B [Albuquerque, NM; De Boer, Maarten P [Albuquerque, NM
2006-04-25
A full-field imaging, long working distance, incoherent interference microscope suitable for three-dimensional imaging and metrology of MEMS devices and test structures on a standard microelectronics probe station. A long working distance greater than 10 mm allows standard probes or probe cards to be used. This enables nanometer-scale 3-dimensional height profiles of MEMS test structures to be acquired across an entire wafer while being actively probed, and, optionally, through a transparent window. An optically identical pair of sample and reference arm objectives is not required, which reduces the overall system cost, and also the cost and time required to change sample magnifications. Using a LED source, high magnification (e.g., 50.times.) can be obtained having excellent image quality, straight fringes, and high fringe contrast.
MEMS Lens Scanners for Free-Space Optical Interconnects
2011-12-15
22] D. C. O ? Brien , G. E. Faulkner, T. D. Wilkinson, B. Robertson, and D. G. Leyva, “Design and Analysis of an Adaptive Board-to-Board Dynamic...trenches on 20 µm device layer. (c-d) Deposit and pattern low-stress nitride and polysilicon for electrical isolation. (e) DRIE for MEMS structures...Telecentric Lateral Shift Board Translation (mm) D is p la c e m e n t o f S p o t ( m ) 0 0.5 1 1.5 2 0 100 200 300 400 Tilt Error Board Tilt (deg) D
NASA Astrophysics Data System (ADS)
Chang, Hung-Pin; Qian, Jiangyuan; Bachman, Mark; Congdon, Philip; Li, Guann-pyng
2002-07-01
A novel planarization technique, compressive molding planarization (CMP) is developed for implementation of a multi-layered micro coil device. Applying CMP and other micromachining techniques, a multi-layered micro coil device has been designed and fabricated, and its use in the magnetic micro actuators for hard disk drive applications has been demonstrated, showing that it can produce milli-Newton of magnetic force suitable for driving a micro actuator. The novel CMP technique can be equally applicable in other MEMS devices fabrication to ease the process integration for the complicated structure.
2002-04-01
residual and induced stress curves . A key to modelling MEMS structures, especially micromirrors , is to 2-23 (a) 0V (b) 10V (c) 20V (d) 40V (e) 50V (f...outlined in Figure 4.20. A line marker is used to extract the FEM data as displayed across the micromirror flexure. The MEMCAD FEM stress curve for the... curved as observed by the number of fringe lines displayed on the micromirror surface. The maximum peak deformation for this series of micromirrors is
NASA Astrophysics Data System (ADS)
Kannan, R.; Devaki, P.; Premkumar, P. S.; Selvambikai, M.
2018-04-01
Electrodeposition of nanocrystalline NiFe and NiFeW thin films were carried out from ammonium citrate bath at a constant current density and controlled pH of 8 by varying the bath temperature from 40 °C to 70 °C. The surface morphology and chemical composition of the electrodeposited NiFe and NiFeW soft magnetic thin films were studied by using SEM and EDAX. The SEM micrographs of the films coated at higher electrodeposited bath temperature have no micro cracks and also the films have more uniform surface morphology. The existence of crystalline nature of the coated films were analysed by XRD. The presence of predominant peaks in x-ray diffraction pattern (compared with JCPDS data) reveal that the average crystalline size was in the order of few tens of nano meters. The magnetic properties such as coercivity, saturation magnetization and magnetic flux density have been calculated from vibrating sample magnetometer analysis. The VSM result shows that the NiFeW thin film synthesised at 70 °C exhibit the lower coercivity with higher saturation magnetization. The hardness and adhesion of the electroplated films have been investigated. Reasons for variation in magnetic properties and structural characteristics are also discussed. The electroplated NiFe and NiFeW thin films can be used for Micro Electro Mechanical System (MEMS) applications due to their excellent soft magnetic behaviour.
Method using photo-induced and thermal bending of MEMS sensors
Datskos, Panagiotis G.
2001-01-01
A method for measuring chemical analytes and physical forces by measuring changes in the deflection of a microelectromechanical cantilever structure while it is being irradiated by a light having an energy above the band gap of the structure.
Off-grid MEMS sensors configurations for transportation applications.
DOT National Transportation Integrated Search
2013-10-01
The worsening problem of aging and deficient infrastructure in this nation and across the world has demonstrated the need for an improved system to monitor and maintain these structures. The field of structural health monitoring has grown in recent y...
Generalized Knudsen Number for Oscillatory Flows Generated by MEMS and NEMS Resonators
NASA Astrophysics Data System (ADS)
Ekinci, Kamil; Kara, Vural; Yakhot, Victor
2017-11-01
We have explored the scaling behavior of oscillatory flows that are generated by the oscillations of MEMS and NEMS resonators in a gas. If the gas is gradually rarefied, the Navier-Stokes equations begin to fail and a kinetic description of the flow becomes more appropriate. The failure of the Navier-Stokes equations can be thought to take place via two different physical mechanisms: either the continuum hypothesis breaks down as a result of a finite size effect; or local equilibrium is violated due to the high rate of strain. By independently tuning the relevant linear dimensions and the frequencies of the MEMS and NEMS resonators, we experimentally observe these two different physical mechanisms. All the experimental data, however, can be collapsed using a single dimensionless scaling parameter that combines the linear dimension and the frequency of each resonator. This proposed Knudsen number for oscillatory flows is rooted in a fundamental symmetry principle, namely Galilean invariance. We acknowledge support from US NSF through Grant No. CBET-1604075.
Modeling of biaxial gimbal-less MEMS scanning mirrors
NASA Astrophysics Data System (ADS)
von Wantoch, Thomas; Gu-Stoppel, Shanshan; Senger, Frank; Mallas, Christian; Hofmann, Ulrich; Meurer, Thomas; Benecke, Wolfgang
2016-03-01
One- and two-dimensional MEMS scanning mirrors for resonant or quasi-stationary beam deflection are primarily known as tiny micromirror devices with aperture sizes up to a few Millimeters and usually address low power applications in high volume markets, e.g. laser beam scanning pico-projectors or gesture recognition systems. In contrast, recently reported vacuum packaged MEMS scanners feature mirror diameters up to 20 mm and integrated high-reflectivity dielectric coatings. These mirrors enable MEMS based scanning for applications that require large apertures due to optical constraints like 3D sensing or microscopy as well as for high power laser applications like laser phosphor displays, automotive lighting and displays, 3D printing and general laser material processing. This work presents modelling, control design and experimental characterization of gimbal-less MEMS mirrors with large aperture size. As an example a resonant biaxial Quadpod scanner with 7 mm mirror diameter and four integrated PZT (lead zirconate titanate) actuators is analyzed. The finite element method (FEM) model developed and computed in COMSOL Multiphysics is used for calculating the eigenmodes of the mirror as well as for extracting a high order (n < 10000) state space representation of the mirror dynamics with actuation voltages as system inputs and scanner displacement as system output. By applying model order reduction techniques using MATLABR a compact state space system approximation of order n = 6 is computed. Based on this reduced order model feedforward control inputs for different, properly chosen scanner displacement trajectories are derived and tested using the original FEM model as well as the micromirror.
Design of a MEMS-Based Oscillator Using 180nm CMOS Technology
Roy, Sukanta; Ramiah, Harikrishnan; Reza, Ahmed Wasif; Lim, Chee Cheow; Ferrer, Eloi Marigo
2016-01-01
Micro-electro mechanical system (MEMS) based oscillators are revolutionizing the timing industry as a cost effective solution, enhanced with more features, superior performance and better reliability. The design of a sustaining amplifier was triggered primarily to replenish MEMS resonator’s high motion losses due to the possibility of their ‘system-on-chip’ integrated circuit solution. The design of a sustaining amplifier observing high gain and adequate phase shift for an electrostatic clamp-clamp (C-C) beam MEMS resonator, involves the use of an 180nm CMOS process with an unloaded Q of 1000 in realizing a fixed frequency oscillator. A net 122dBΩ transimpedance gain with adequate phase shift has ensured 17.22MHz resonant frequency oscillation with a layout area consumption of 0.121 mm2 in the integrated chip solution, the sustaining amplifier draws 6.3mW with a respective phase noise of -84dBc/Hz at 1kHz offset is achieved within a noise floor of -103dBC/Hz. In this work, a comparison is drawn among similar design studies on the basis of a defined figure of merit (FOM). A low phase noise of 1kHz, high figure of merit and the smaller size of the chip has accredited to the design’s applicability towards in the implementation of a clock generative integrated circuit. In addition to that, this complete silicon based MEMS oscillator in a monolithic solution has offered a cost effective solution for industrial or biomedical electronic applications. PMID:27391136
MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads
DOE Office of Scientific and Technical Information (OSTI.GOV)
Chanchani, Rajen; Nordquist, Christopher; Olsson, Roy H
In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.
Carbon material based microelectromechanical system (MEMS): Fabrication and devices
NASA Astrophysics Data System (ADS)
Xu, Wenjun
This PhD dissertation presents the exploration and development of two carbon materials, carbon nanotubes (CNTs) and carbon fiber (CF), as either key functional components or unconventional substrates for a variety of MEMS applications. Their performance in three different types of MEMS devices, namely, strain/stress sensors, vibration-powered generators and fiber solar cells, were evaluated and the working mechanisms of these two non-traditional materials in these systems were discussed. The work may potentially enable the development of new types of carbon-MEMS devices. Carbon nanotubes were selected from the carbon family due to several advantageous characteristics that this nanomaterial offers. They carry extremely high mechanical strength (Ey=1TPa), superior electrical properties (current density of 4x109 A/cm2), exceptional piezoresistivity (G=2900), and unique spatial format (high aspect ratio hollow nanocylinder), among other properties. If properly utilized, all these merits can give rise to a variety of new types of carbon nanotube based micro- and nanoelectronics that can greatly fulfill the need for the next generation of faster, smaller and better devices. However, before these functions can be fully realized, one substantial issue to cope with is how to implement CNTs into these systems in an effective and controllable fashion. Challenges associated with CNTs integration include very poor dispersibility in solvents, lack of melting/sublimation point, and unfavorable rheology with regard to mixing and processing highly viscous, CNT-loaded polymer solutions. These issues hinder the practical progress of CNTs both in a lab scale and in the industrial level. To this end, a MEMS-assisted electrophoretic deposition technique was developed, aiming to achieve controlled integration of CNT into both conventional and flexible microsystems at room temperature with a relatively high throughput. MEMS technology has demonstrated strong capability in developing silicon and metal based microsystems. In this thesis, this mature technique was exploited to generate a variety of microelectrode structures to facilitate the micropatterning and manipulation of the CNTs. Selective deposition of electrically charged CNTs onto desired locations was realized in an EPD process through patterning of electric field lines created by the microelectrodes fabricated through MEMS techniques. A variety of 2-D and 3-D micropatterns of CNTs with waferscale areas have been successfully achieved in both rigid and elastic systems. The thickness and morphology of the generated CNT patterns was found to be readily controllable through the parameters of the fabrication process. Studies also showed that for this technique, high surface hydrophobicity of the non-conductive regions in microstructures was critical to accomplish well-defined selective micropatterning of CNTs. Upon clearing the hurdles of the CNT manipulation, a patterned PDMS/CNT nanocomposite was fabricated through the aforementioned approach and was incorporated, investigated and validated in elastic force/strain microsensors. The gauge factor of the sensor exhibited a strong dependence on both the initial resistance of the device and the applied strain. Detailed analysis of the data suggests that the piezoresistive effect of this specially constructed bi-layer composite could be due to three mechanisms, and the sensing mechanism may vary when physical properties of the CNT network embedded in the polymer matrix alter. The feasibility of the PDSM/CNT composite being utilized as an elastic electret was further explored. The nanocomposite composed of these two non-traditional electret materials exhibited electret characteristics with reasonable charge storage stability when charged using a corona discharge. The power generation capacity of the corona-charged composite has been characterized and successfully demonstrated in both a ball drop experiment and cyclic mechanical load experiments. Lastly, in an effort to develop carbon-material-based substrates for MEMS applications, a carbon fiber-based poly-Si solar cell was designed, fabricated and investigated. This fiber-type photovoltaics (PV) takes advantage of the excellent thermal stability, electrical conductivity and spatial format of the CF, which allows CF to serve as both the building block and the electrode in the PV configuration. The photovoltaic effects of the fiber PV were demonstrated with an open-circuit voltage of 0.14 V, a short-circuit current density of 1.7 mA/cm2, and output power density of 0.059mW/cm2 . The issues of this system were discussed as well.
Li, Jie; Guo, Hao; Liu, Jun; Tang, Jun; Ni, Haiqiao; Shi, Yunbo; Xue, Chenyang; Niu, Zhichuan; Zhang, Wendong; Li, Mifeng; Yu, Ying
2013-05-08
As a highly sensitive strain gauge element, GaAs-based resonant tunneling diode (RTD) has already been applied in microelectromechanical system (MEMS) sensors. Due to poor mechanical properties and high cost, GaAs-based material has been limited in applications as the substrate for MEMS. In this work, we present a method to fabricate the GaAs-based RTD on Si substrate. From the experimental results, it can be concluded that the piezoresistive coefficient achieved with this method reached 3.42 × 10-9 m2/N, which is about an order of magnitude higher than the Si-based semiconductor piezoresistors.
Studying the Effect of Deposition Conditions on the Performance and Reliability of MEMS Gas Sensors
Sadek, Khaled; Moussa, Walied
2007-01-01
In this paper, the reliability of a micro-electro-mechanical system (MEMS)-based gas sensor has been investigated using Three Dimensional (3D) coupled multiphysics Finite Element (FE) analysis. The coupled field analysis involved a two-way sequential electrothermal fields coupling and a one-way sequential thermal-structural fields coupling. An automated substructuring code was developed to reduce the computational cost involved in simulating this complicated coupled multiphysics FE analysis by up to 76 percent. The substructured multiphysics model was then used to conduct a parametric study of the MEMS-based gas sensor performance in response to the variations expected in the thermal and mechanical characteristics of thin films layers composing the sensing MEMS device generated at various stages of the microfabrication process. Whenever possible, the appropriate deposition variables were correlated in the current work to the design parameters, with good accuracy, for optimum operation conditions of the gas sensor. This is used to establish a set of design rules, using linear and nonlinear empirical relations, which can be utilized in real-time at the design and development decision-making stages of similar gas sensors to enable the microfabrication of these sensors with reliable operation.
NASA Astrophysics Data System (ADS)
Liu, Yuan; Wang, Renxin; Zhang, Guojun; Du, Jin; Zhao, Long; Xue, Chenyang; Zhang, Wendong; Liu, Jun
2015-07-01
This paper presents methods of promoting the sensitivity of Microelectromechanical Systems (MEMS) vector hydrophone by increasing the sensing area of cilium and perfect insulative Parylene membrane. First, a low-density sphere is integrated with the cilium to compose a "lollipop shape," which can considerably increase the sensing area. A mathematic model on the sensitivity of the "lollipop-shaped" MEMS vector hydrophone is presented, and the influences of different structural parameters on the sensitivity are analyzed via simulation. Second, the MEMS vector hydrophone is encapsulated through the conformal deposition of insulative Parylene membrane, which enables underwater acoustic monitoring without any typed sound-transparent encapsulation. Finally, the characterization results demonstrate that the sensitivity reaches up to -183 dB (500 Hz 0dB at 1 V/ μPa ), which is increased by more than 10 dB, comparing with the previous cilium-shaped MEMS vector hydrophone. Besides, the frequency response takes on a sensitivity increment of 6 dB per octave. The working frequency band is 20-500 Hz and the concave point depth of 8-shaped directivity is beyond 30 dB, indicating that the hydrophone is promising in underwater acoustic application.
Application of MEMS-based x-ray optics as tuneable nanosecond choppers
NASA Astrophysics Data System (ADS)
Chen, Pice; Walko, Donald A.; Jung, Il Woong; Li, Zhilong; Gao, Ya; Shenoy, Gopal K.; Lopez, Daniel; Wang, Jin
2017-08-01
Time-resolved synchrotron x-ray measurements often rely on using a mechanical chopper to isolate a set of x-ray pulses. We have started the development of micro electromechanical systems (MEMS)-based x-ray optics, as an alternate method to manipulate x-ray beams. In the application of x-ray pulse isolation, we recently achieved a pulse-picking time window of half a nanosecond, which is more than 100 times faster than mechanical choppers can achieve. The MEMS device consists of a comb-drive silicon micromirror, designed for efficiently diffracting an x-ray beam during oscillation. The MEMS devices were operated in Bragg geometry and their oscillation was synchronized to x-ray pulses, with a frequency matching subharmonics of the cycling frequency of x-ray pulses. The microscale structure of the silicon mirror in terms of the curvature and the quality of crystallinity ensures a narrow angular spread of the Bragg reflection. With the discussion of factors determining the diffractive time window, this report showed our approaches to narrow down the time window to half a nanosecond. The short diffractive time window will allow us to select single x-ray pulse out of a train of pulses from synchrotron radiation facilities.
Evolution from MEMS-based Linear Drives to Bio-based Nano Drives
NASA Astrophysics Data System (ADS)
Fujita, Hiroyuki
The successful extension of semiconductor technology to fabricate mechanical parts of the sizes from 10 to 100 micrometers opened wide ranges of possibilities for micromechanical devices and systems. The fabrication technique is called micromachining. Micromachining processes are based on silicon integrated circuits (IC) technology and used to build three-dimensional structures and movable parts by the combination of lithography, etching, film deposition, and wafer bonding. Microactuators are the key devices allowing MEMS to perform physical functions. Some of them are driven by electric, magnetic, and fluidic forces. Some others utilize actuator materials including piezoelectric (PZT, ZnO, quartz) and magnetostrictive materials (TbFe), shape memory alloy (TiNi) and bio molecular motors. This paper deals with the development of MEMS based microactuators, especially linear drives, following my own research experience. They include an electrostatic actuator, a superconductive levitated actuator, arrayed actuators, and a bio-motor-driven actuator.
Realization of MEMS-IC Vertical Integration Utilizing Smart Bumpless Bonding
NASA Astrophysics Data System (ADS)
Shiozaki, Masayoshi; Moriguchi, Makoto; Sasaki, Sho; Oba, Masatoshi
This paper reports fundamental technologies, properties, and new experimental results of SBB (Smart Bumpless Bonding) to realize MEMS-IC vertical integration. Although conventional bonding technologies have had difficulties integrating MEMS and its processing circuit because of their rough bonding surfaces, fragile structures, and thermal restriction, SBB technology realized the vertical integration without thermal treatment, any adhesive materials including bumps, and chemical mechanical polishing. The SBB technology bonds sealing parts for vacuum sealing and electrodes for electrical connection simultaneously as published in previous experimental study. The plasma CVD SiO2 is utilized to realize vacuum sealing as sealing material. And Au projection studs are formed on each electrode and connected electrically between two wafers by compressive plastic deformation and surface activation. In this paper, new experimental results including vacuum sealing properties, electrical improvement, IC bonding results on the described fundamental concept and properties are reported.
Predicting the random drift of MEMS gyroscope based on K-means clustering and OLS RBF Neural Network
NASA Astrophysics Data System (ADS)
Wang, Zhen-yu; Zhang, Li-jie
2017-10-01
Measure error of the sensor can be effectively compensated with prediction. Aiming at large random drift error of MEMS(Micro Electro Mechanical System))gyroscope, an improved learning algorithm of Radial Basis Function(RBF) Neural Network(NN) based on K-means clustering and Orthogonal Least-Squares (OLS) is proposed in this paper. The algorithm selects the typical samples as the initial cluster centers of RBF NN firstly, candidates centers with K-means algorithm secondly, and optimizes the candidate centers with OLS algorithm thirdly, which makes the network structure simpler and makes the prediction performance better. Experimental results show that the proposed K-means clustering OLS learning algorithm can predict the random drift of MEMS gyroscope effectively, the prediction error of which is 9.8019e-007°/s and the prediction time of which is 2.4169e-006s
MEMS ultrasonic transducer for monitoring of steel structures
NASA Astrophysics Data System (ADS)
Jain, Akash; Greve, David W.; Oppenheim, Irving J.
2002-06-01
Ultrasonic methods can be used to monitor crack propagation, weld failure, or section loss at critical locations in steel structures. However, ultrasonic inspection requires a skilled technician, and most commonly the signal obtained at any inspection is not preserved for later use. A preferred technology would use a MEMS device permanently installed at a critical location, polled remotely, and capable of on-chip signal processing using a signal history. We review questions related to wave geometry, signal levels, flaw localization, and electromechanical design issues for microscale transducers, and then describe the design, characterization, and initial testing of a MEMS transducer to function as a detector array. The device is approximately 1-cm square and was fabricated by the MUMPS process. The chip has 23 sensor elements to function in a phased array geometry, each element containing 180 hexagonal polysilicon diaphragms with a typical leg length of 49 microns and an unloaded natural frequency near 3.5 MHz. We first report characterization studies including capacitance-voltage measurements and admittance measurements, and then report initial experiments using a conventional piezoelectric transducer for excitation, with successful detection of signals in an on-axis transmission experiment and successful source localization from phased array performance in an off-axis transmission experiment.
Investigation of Structures of Microwave Microelectromechanical-System Switches by Taguchi Method
NASA Astrophysics Data System (ADS)
Lai, Yeong-Lin; Lin, Chien-Hung
2007-10-01
The optimal design of microwave microelectromechanical-system (MEMS) switches by the Taguchi method is presented. The structures of the switches are analyzed and optimized in terms of the effective stiffness constant, the maximum von Mises stress, and the natural frequency in order to improve the reliability and the performance of the MEMS switches. There are four factors, each of which has three levels in the Taguchi method for the MEMS switches. An L9(34) orthogonal array is used for the matrix experiments. The characteristics of the experiments are studied by the finite-element method and the analytical method. The responses of the signal-to-noise (S/N) ratios of the characteristics of the switches are investigated. The statistical analysis of variance (ANOVA) is used to interpret the experimental results and decide the significant factors. The final optimum setting, A1B3C1D2, predicts that the effective stiffness constant is 1.06 N/m, the maximum von Mises stress is 76.9 MPa, and the natural frequency is 29.331 kHz. The corresponding switching time is 34 μs, and the pull-down voltage is 9.8 V.
Evaluation of MEMS-based in-place inclinometers in cold regions : [summary].
DOT National Transportation Integrated Search
2013-03-01
Inclinometer probes are used to measure ground movement. While an industry standard, this technology has drawbacks, including costly trips for manual measurements, : operator error, and limited measurements due to casing deformation. Relatively new M...
Evaluation of MEMS-based in-place inclinometers in cold regions.
DOT National Transportation Integrated Search
2013-03-01
Inclinometer probes are used to measure ground movement. While an industry standard, this technology has drawbacks, including costly trips for manual measurements, : operator error, and limited measurements due to casing deformation. Relatively new M...
A dynamic system matching technique for improving the accuracy of MEMS gyroscopes
NASA Astrophysics Data System (ADS)
Stubberud, Peter A.; Stubberud, Stephen C.; Stubberud, Allen R.
2014-12-01
A classical MEMS gyro transforms angular rates into electrical values through Euler's equations of angular rotation. Production models of a MEMS gyroscope will have manufacturing errors in the coefficients of the differential equations. The output signal of a production gyroscope will be corrupted by noise, with a major component of the noise due to the manufacturing errors. As is the case of the components in an analog electronic circuit, one way of controlling the variability of a subsystem is to impose extremely tight control on the manufacturing process so that the coefficient values are within some specified bounds. This can be expensive and may even be impossible as is the case in certain applications of micro-electromechanical (MEMS) sensors. In a recent paper [2], the authors introduced a method for combining the measurements from several nominally equal MEMS gyroscopes using a technique based on a concept from electronic circuit design called dynamic element matching [1]. Because the method in this paper deals with systems rather than elements, it is called a dynamic system matching technique (DSMT). The DSMT generates a single output by randomly switching the outputs of several, nominally identical, MEMS gyros in and out of the switch output. This has the effect of 'spreading the spectrum' of the noise caused by the coefficient errors generated in the manufacture of the individual gyros. A filter can then be used to eliminate that part of the spread spectrum that is outside the pass band of the gyro. A heuristic analysis in that paper argues that the DSMT can be used to control the effects of the random coefficient variations. In a follow-on paper [4], a simulation of a DSMT indicated that the heuristics were consistent. In this paper, analytic expressions of the DSMT noise are developed which confirm that the earlier conclusions are valid. These expressions include the various DSMT design parameters and, therefore, can be used as design tools for DSMT systems.
NASA Astrophysics Data System (ADS)
Wisniewiski, David
2014-03-01
The need to quantify and to improve long-term stability of pressure transducers is a persistent requirement from the aerospace sector. Specifically, the incorporation of real-time pressure monitoring in aircraft landing gear, as exemplified in Tire Pressure Monitoring Systems (TPMS), has placed greater demand on the pressure transducer for improved performance and increased reliability which is manifested in low lifecycle cost and minimal maintenance downtime through fuel savings and increased life of the tire. Piezoresistive (PR) silicon MEMS pressure transducers are the primary choice as a transduction method for this measurement owing to their ability to be designed for the harsh environment seen in aircraft landing gear. However, these pressure transducers are only as valuable as the long-term stability they possess to ensure reliable, real-time monitoring over tens of years. The "heart" of the pressure transducer is the silicon MEMS element, and it is at this basic level where the long-term stability is established and needs to be quantified. A novel High Pressure, High Temperature (HPHT) vessel has been designed and constructed to facilitate this critical measurement of the silicon MEMS element directly through a process of mechanically "floating" the silicon MEMS element while being subjected to the extreme environments of pressure and temperature, simultaneously. Furthermore, the HPHT vessel is scalable to permit up to fifty specimens to be tested at one time to provide a statistically significant data population on which to draw reasonable conclusions on long-term stability. With the knowledge gained on the silicon MEMS element, higher level assembly to the pressure transducer envelope package can also be quantified as to the build-effects contribution to long-term stability in the same HPHT vessel due to its accommodating size. Accordingly, a HPHT vessel offering multiple levels of configurability and robustness in data measurement is presented, along with 10 year long-term stability results.
A dynamic system matching technique for improving the accuracy of MEMS gyroscopes
DOE Office of Scientific and Technical Information (OSTI.GOV)
Stubberud, Peter A., E-mail: stubber@ee.unlv.edu; Stubberud, Stephen C., E-mail: scstubberud@ieee.org; Stubberud, Allen R., E-mail: stubberud@att.net
A classical MEMS gyro transforms angular rates into electrical values through Euler's equations of angular rotation. Production models of a MEMS gyroscope will have manufacturing errors in the coefficients of the differential equations. The output signal of a production gyroscope will be corrupted by noise, with a major component of the noise due to the manufacturing errors. As is the case of the components in an analog electronic circuit, one way of controlling the variability of a subsystem is to impose extremely tight control on the manufacturing process so that the coefficient values are within some specified bounds. This canmore » be expensive and may even be impossible as is the case in certain applications of micro-electromechanical (MEMS) sensors. In a recent paper [2], the authors introduced a method for combining the measurements from several nominally equal MEMS gyroscopes using a technique based on a concept from electronic circuit design called dynamic element matching [1]. Because the method in this paper deals with systems rather than elements, it is called a dynamic system matching technique (DSMT). The DSMT generates a single output by randomly switching the outputs of several, nominally identical, MEMS gyros in and out of the switch output. This has the effect of 'spreading the spectrum' of the noise caused by the coefficient errors generated in the manufacture of the individual gyros. A filter can then be used to eliminate that part of the spread spectrum that is outside the pass band of the gyro. A heuristic analysis in that paper argues that the DSMT can be used to control the effects of the random coefficient variations. In a follow-on paper [4], a simulation of a DSMT indicated that the heuristics were consistent. In this paper, analytic expressions of the DSMT noise are developed which confirm that the earlier conclusions are valid. These expressions include the various DSMT design parameters and, therefore, can be used as design tools for DSMT systems.« less
MEMS Actuators for Improved Performance and Durability
NASA Astrophysics Data System (ADS)
Yearsley, James M.
Micro-ElectroMechanical Systems (MEMS) devices take advantage of force-scaling at length scales smaller than a millimeter to sense and interact with directly with phenomena and targets at the microscale. MEMS sensors found in everyday devices like cell-phones and cars include accelerometers, gyros, pressure sensors, and magnetic sensors. MEMS actuators generally serve more application specific roles including micro- and nano-tweezers used for single cell manipulation, optical switching and alignment components, and micro combustion engines for high energy density power generation. MEMS rotary motors are actuators that translate an electric drive signal into rotational motion and can serve as rate calibration inputs for gyros, stages for optical components, mixing devices for micro-fluidics, etc. Existing rotary micromotors suffer from friction and wear issues that affect lifetime and performance. Attempts to alleviate friction effects include surface treatment, magnetic and electrostatic levitation, pressurized gas bearings, and micro-ball bearings. The present work demonstrates a droplet based liquid bearing supporting a rotary micromotor that improves the operating characteristics of MEMS rotary motors. The liquid bearing provides wear-free, low-friction, passive alignment between the rotor and stator. Droplets are positioned relative to the rotor and stator through patterned superhydrophobic and hydrophilic surface coatings. The liquid bearing consists of a central droplet that acts as the motor shaft, providing axial alignment between rotor and stator, and satellite droplets, analogous to ball-bearings, that provide tip and tilt stable operation. The liquid bearing friction performance is characterized through measurement of the rotational drag coefficient and minimum starting torque due to stiction and geometric effects. Bearing operational performance is further characterized by modeling and measuring stiffness, environmental survivability, and high-speed alignment capability. The superhydrophobic coatings developed for droplet containment are also discussed and measurements of contact angle are shown to affect device performance through correlation to models of bearing friction and stiffness.
Radiation Test Results for a MEMS Microshutter Operating at 60 K
NASA Technical Reports Server (NTRS)
Rapchun, David A.; Buchner, Stephen; Moseley, Harvey; Meyer, Stephen E.; Ray, Knute; Tuttle, Jim; Quinn, Ed; Buchanan, Ernie; Bloom, Dave; Hait, Tom;
2007-01-01
The James Webb Space Telescope (JWST), the successor to the Hubble Space Telescope, is due to be launched in 2013 with the goal of searching the very distant Universe for stars that formed shortly after the Big Bang. Because this occurred so far back in time, the available light is strongly red-shifted, requiring the use of detectors sensitive to the infrared portion of the electromagnetic spectrum. HgCdTe infrared focal plane arrays, cooled to below 30 K to minimize noise, will be used to detect the faint signals. One of the instruments on JWST is the Near Infrared Spectrometer (NIRSPEC) designed to measure the infrared spectra of up to 100 separate galaxies simultaneously. A key component in NIRSPEC is a Micro-Electromechanical System (MEMS), a two-dimensional micro-shutter array (MSA) developed by NASA/GSFC. The MSA is inserted in front of the detector to allow only the light from the galaxies of interest to reach the detector and to block the light from all other sources. The MSA will have to operate at 30 K to minimize the amount of thermal radiation emitted by the optical components from reaching the detector array. It will also have to operate in the space radiation environment that is dominated by the MSA will be exposed to a large total ionizing dose of approximately 200 krad(Si). Following exposure to ionizing radiation, a variety of MEMS have exhibited performance degradation. MEMS contain moving parts that are either controlled or sensed by changes in electric fields. Radiation degradation can be expected for those devices where there is an electric field applied across an insulating layer that is part of the sensing or controlling structure. Ionizing radiation will liberate charge (electrons and holes) in the insulating layers, some of which may be trapped within the insulating layer. Trapped charge will partially cancel the externally applied electric field and lead to changes in the operation of the MEMS. This appears to be a general principle for MEMS. Knowledge of the above principle has raised the concern at NASA that the MSA might also exhibit degraded performance because, i) each shutter flap is a multilayer structure consisting of metallic and insulating layers and ii) the movement of the shutter flaps is partially controlled by the application of an electric field between the shutter flap and the substrate (vertical support grid). The whole mission would be compromised if radiation exposure were to prevent the shutters from opening and closing properly. energetic ionizing particles. Because it is located A unique feature of the MSA is that, as outside the spacecraft and has very little shielding, previously mentioned, it will have to operate at temperatures near 30 K. To date, there are no published reports on how very low temperatures (- 30K) affect the response of MEMS devices to total ionizing dose. Experiments on SiO2 structures at low temperatures (80 K) indicate that the electrons generated by the ionizing radiation are mobile and will move rapidly under the application of an external electric field. Holes, on the other hand, that would normally move in the opposite direction through the SiO2 via a "thermal hopping" process, are effectively immobile at low electric fields as they are trapped close to their generation sites. However, for sufficiently large electric fields (greater than 3 MV/cm) holes are able to move through the SiO2. The larger the field, the more rapidly the holes move. The separation of the electrons and holes leads to a reduced electric field within the insulating layer. To overcome this reduction in electric field, a greater external voltage will have to be applied that alters the normal operation of the device. This report presents the results of radiation testing of the MSA at 60 K. The temperature was higher than the targeted temperature because of a faulty electrical interconnect on the test board. Specifically, our goal was to determine whether the MSA would function propey after a TID of 200 krad(Si).
Microcantilever-based platforms as biosensing tools.
Alvarez, Mar; Lechuga, Laura M
2010-05-01
The fast and progressive growth of the biotechnology and pharmaceutical fields forces the development of new and powerful sensing techniques for process optimization and detection of biomolecules at very low concentrations. During the last years, the simplest MEMS structures, i.e. microcantilevers, have become an emerging and promising technology for biosensing applications, due to their small size, fast response, high sensitivity and their compatible integration into "lab-on-a-chip" devices. This article provides an overview of some of the most interesting bio-detections carried out during the last 2-3 years with the microcantilever-based platforms, which highlight the continuous expansion of this kind of sensor in the medical diagnosis field, reaching limits of detection at the single molecule level.
Simulation of MEMS for the Next Generation Space Telescope
NASA Technical Reports Server (NTRS)
Mott, Brent; Kuhn, Jonathan; Broduer, Steve (Technical Monitor)
2001-01-01
The NASA Goddard Space Flight Center (GSFC) is developing optical micro-electromechanical system (MEMS) components for potential application in Next Generation Space Telescope (NGST) science instruments. In this work, we present an overview of the electro-mechanical simulation of three MEMS components for NGST, which include a reflective micro-mirror array and transmissive microshutter array for aperture control for a near infrared (NIR) multi-object spectrometer and a large aperture MEMS Fabry-Perot tunable filter for a NIR wide field camera. In all cases the device must operate at cryogenic temperatures with low power consumption and low, complementary metal oxide semiconductor (CMOS) compatible, voltages. The goal of our simulation efforts is to adequately predict both the performance and the reliability of the devices during ground handling, launch, and operation to prevent failures late in the development process and during flight. This goal requires detailed modeling and validation of complex electro-thermal-mechanical interactions and very large non-linear deformations, often involving surface contact. Various parameters such as spatial dimensions and device response are often difficult to measure reliably at these small scales. In addition, these devices are fabricated from a wide variety of materials including surface micro-machined aluminum, reactive ion etched (RIE) silicon nitride, and deep reactive ion etched (DRIE) bulk single crystal silicon. The above broad set of conditions combine to be a formidable challenge for space flight qualification analysis. These simulations represent NASA/GSFC's first attempts at implementing a comprehensive strategy to address complex MEMS structures.
Nanoionics-Based Switches for Radio-Frequency Applications
NASA Technical Reports Server (NTRS)
Nessel, James; Lee, Richard
2010-01-01
Nanoionics-based devices have shown promise as alternatives to microelectromechanical systems (MEMS) and semiconductor diode devices for switching radio-frequency (RF) signals in diverse systems. Examples of systems that utilize RF switches include phase shifters for electronically steerable phased-array antennas, multiplexers, cellular telephones and other radio transceivers, and other portable electronic devices. Semiconductor diode switches can operate at low potentials (about 1 to 3 V) and high speeds (switching times of the order of nanoseconds) but are characterized by significant insertion loss, high DC power consumption, low isolation, and generation of third-order harmonics and intermodulation distortion (IMD). MEMS-based switches feature low insertion loss (of the order of 0.2 dB), low DC power consumption (picowatts), high isolation (>30 dB), and low IMD, but contain moving parts, are not highly reliable, and must be operated at high actuation potentials (20 to 60 V) generated and applied by use of complex circuitry. In addition, fabrication of MEMS is complex, involving many processing steps. Nanoionics-based switches offer the superior RF performance and low power consumption of MEMS switches, without need for the high potentials and complex circuitry necessary for operation of MEMS switches. At the same time, nanoionics-based switches offer the high switching speed of semiconductor devices. Also, like semiconductor devices, nanoionics-based switches can be fabricated relatively inexpensively by use of conventional integrated-circuit fabrication techniques. More over, nanoionics-based switches have simple planar structures that can easily be integrated into RF power-distribution circuits.
A polymer-based Fabry-Perot filter integrated with 3-D MEMS structures
NASA Astrophysics Data System (ADS)
Zhang, Ping (Cerina); Le, Kevin; Malalur-Nagaraja-Rao, Smitha; Hsu, Lun-Chen; Chiao, J.-C.
2006-01-01
Polymers have been considered as one of the most versatile materials in making optical devices for communication and sensor applications. They provide good optical transparency to form filters, lenses and many optical components with ease of fabrication. They are scalable and compatible in dimensions with requirements in optics and can be fabricated on inorganic substrates, such as silicon and quartz. Recent polymer synthesis also made great progresses on conductive and nonlinear polymers, opening opportunities for new applications. In this paper, we discussed hybrid-material integration of polymers on silicon-based microelectromechanical system (MEMS) devices. The motivation is to combine the advantages of demonstrated silicon-based MEMS actuators and excellent optical performance of polymers. We demonstrated the idea with a polymer-based out-of-plane Fabry-Perot filter that can be self-assembled by scratch drive actuators. We utilized a fabrication foundry service, MUMPS (Multi-User MEMS Process), to demonstrate the feasibility and flexibility of integration. The polysilicon, used as the structural material for construction of 3-D framework and actuators, has high absorption in the visible and near infrared ranges. Therefore, previous efforts using a polysilicon layer as optical interfaces suffer from high losses. We applied the organic compound materials on the silicon-based framework within the optical signal propagation path to form the optical interfaces. In this paper, we have shown low losses in the optical signal processing and feasibility of building a thin-film Fabry-Perot filter. We discussed the optical filter designs, mechanical design, actuation mechanism, fabrication issues, optical measurements, and results.
Inertial measurement unit using rotatable MEMS sensors
Kohler, Stewart M [Albuquerque, NM; Allen, James J [Albuquerque, NM
2007-05-01
A MEM inertial sensor (e.g. accelerometer, gyroscope) having integral rotational means for providing static and dynamic bias compensation is disclosed. A bias compensated MEM inertial sensor is described comprising a MEM inertial sense element disposed on a rotatable MEM stage. A MEM actuator drives the rotation of the stage between at least two predetermined rotational positions. Measuring and comparing the output of the MEM inertial sensor in the at least two rotational positions allows for both static and dynamic bias compensation in inertial calculations based on the sensor's output. An inertial measurement unit (IMU) comprising a plurality of independently rotatable MEM inertial sensors and methods for making bias compensated inertial measurements are disclosed.
Inertial measurement unit using rotatable MEMS sensors
Kohler, Stewart M.; Allen, James J.
2006-06-27
A MEM inertial sensor (e.g. accelerometer, gyroscope) having integral rotational means for providing static and dynamic bias compensation is disclosed. A bias compensated MEM inertial sensor is described comprising a MEM inertial sense element disposed on a rotatable MEM stage. A MEM actuator for drives the rotation of the stage between at least two predetermined rotational positions. Measuring and comparing the output of the MEM inertial sensor in the at least two rotational positions allows, for both static and dynamic bias compensation in inertial calculations based on the sensor's output. An inertial measurement unit (IMU) comprising a plurality of independently rotatable MEM inertial sensors and methods for making bias compensated inertial measurements are disclosed.
NASA Astrophysics Data System (ADS)
Honma, H.; Mitsuya, H.; Hashiguchi, G.; Fujita, H.; Toshiyoshi, H.
2018-06-01
We introduce symmetric comb-electrode structures for the electrostatic vibrational MEMS energy harvester to lower the electrostatic constraint force attributed to the built-in electret potential, thereby allowing the harvester device to operate in a small acceleration range of 0.05 g or lower (1 g = 9.8 m s‑2). Given the same device structure, two different potentials for the electret are tested to experimentally confirm that the output induction current is enhanced 4.2 times by increasing the electret potential from ‑60 V to ‑250 V. At the same time, the harvester effectiveness has been improved to as high as 93%. The device is used to swiftly charge a 470 µF storage capacitor to 3.3 V in 120 s from small sinusoidal vibrations of 0.6 g at 124 Hz.
Validation of a wireless modular monitoring system for structures
NASA Astrophysics Data System (ADS)
Lynch, Jerome P.; Law, Kincho H.; Kiremidjian, Anne S.; Carryer, John E.; Kenny, Thomas W.; Partridge, Aaron; Sundararajan, Arvind
2002-06-01
A wireless sensing unit for use in a Wireless Modular Monitoring System (WiMMS) has been designed and constructed. Drawing upon advanced technological developments in the areas of wireless communications, low-power microprocessors and micro-electro mechanical system (MEMS) sensing transducers, the wireless sensing unit represents a high-performance yet low-cost solution to monitoring the short-term and long-term performance of structures. A sophisticated reduced instruction set computer (RISC) microcontroller is placed at the core of the unit to accommodate on-board computations, measurement filtering and data interrogation algorithms. The functionality of the wireless sensing unit is validated through various experiments involving multiple sensing transducers interfaced to the sensing unit. In particular, MEMS-based accelerometers are used as the primary sensing transducer in this study's validation experiments. A five degree of freedom scaled test structure mounted upon a shaking table is employed for system validation.
A MEMS-based Air Flow Sensor with a Free-standing Micro-cantilever Structure
Wang, Yu-Hsiang; Lee, Chia-Yen; Chiang, Che-Ming
2007-01-01
This paper presents a micro-scale air flow sensor based on a free-standing cantilever structure. In the fabrication process, MEMS techniques are used to deposit a silicon nitride layer on a silicon wafer. A platinum layer is deposited on the silicon nitride layer to form a piezoresistor, and the resulting structure is then etched to create a freestanding micro-cantilever. When an air flow passes over the surface of the cantilever beam, the beam deflects in the downward direction, resulting in a small variation in the resistance of the piezoelectric layer. The air flow velocity is determined by measuring the change in resistance using an external LCR meter. The experimental results indicate that the flow sensor has a high sensitivity (0.0284 Ω/ms-1), a high velocity measurement limit (45 ms-1) and a rapid response time (0.53 s). PMID:28903233
A Step Made Toward Designing Microelectromechanical System (MEMS) Structures With High Reliability
NASA Technical Reports Server (NTRS)
Nemeth, Noel N.
2003-01-01
The mechanical design of microelectromechanical systems-particularly for micropower generation applications-requires the ability to predict the strength capacity of load-carrying components over the service life of the device. These microdevices, which typically are made of brittle materials such as polysilicon, show wide scatter (stochastic behavior) in strength as well as a different average strength for different sized structures (size effect). These behaviors necessitate either costly and time-consuming trial-and-error designs or, more efficiently, the development of a probabilistic design methodology for MEMS. Over the years, the NASA Glenn Research Center s Life Prediction Branch has developed the CARES/Life probabilistic design methodology to predict the reliability of advanced ceramic components. In this study, done in collaboration with Johns Hopkins University, the ability of the CARES/Life code to predict the reliability of polysilicon microsized structures with stress concentrations is successfully demonstrated.
MEMS based ion beams for fusion
NASA Astrophysics Data System (ADS)
Persaud, A.; Seidl, P. A.; Ji, Q.; Waldron, W. L.; Schenkel, T.; Ardanuc, S.; Vinayakumar, K. B.; Schaffer, Z. A.; Lal, A.
2016-10-01
Micro-Electro-Mechanical Systems (MEMS) fabrication provides an exciting opportunity to shrink existing accelerator concepts to smaller sizes and to reduce cost by orders of magnitude. We revisit the concept of a Multiple Electrostatic Quadrupole Array Linear Accelerator (MEQALAC) and show how, with current technologies, the concept can be downsized from gap distances of several cm to distances in the sub-mm regime. The basic concept implements acceleration gaps using radio frequency (RF) fields and electrostatic quadrupoles (ESQ) on silicon wafers. First results from proof-of-concept experiments using printed circuit boards to realize the MEQALAC structures are presented. We show results from accelerating structures that were used in an array of nine (3x3) parallel beamlets with He ions at 15 keV. We will also present results from an ESQ focusing lattice using the same beamlet layout showing beam transport and matching. We also will discuss our progress in fabricating MEMS devices in silicon wafers for both the RF and ESQ structures and integration of necessary RF-circuits on-chip. The concept can be scaled up to thousands of beamlets providing high power beams at low cost and can be used to form and compress a plasma for the development of magnetized target fusion approaches. This work was supported by the Office of Science of the US Department of Energy through the ARPA-e ALPHA program under contracts DE-AC0205CH11231 (LBNL).
Modeling of stress-induced curvature in surface-micromachined devices
NASA Astrophysics Data System (ADS)
Cowan, William D.; Bright, Victor M.; Elvin, Alex A.; Koester, David A.
1997-09-01
This paper compares measured to modeled stress-induced curvature of simple piston micromirrors. Two similar flexure-beam micromirror designs were fabricate using the 11th DARPA-supported multi-user MEMS processes (MUMPs) run. The test devices vary only in the MUMPs layers used for fabrication. In one case the mirror plate is the 1.5 micrometers thick Poly2 layer. The other mirror design employs stacked Poly1 and Poly2 layers for a total thickness of 3.5 micrometers . Both mirror structures are covered with the standard MUMPs metallization of approximately 200 angstrom of chromium and 0.5 micrometers of gold. Curvature of these devices was measured to within +/- 5 nm with a computer controlled microscope laser interferometer system. As intended, the increased thickness of the stacked polysilicon layers reduces the mirror curvature by a factor of 4. The two micromirror designs were modeled using IntelliCAD, a commercial CAD system for MEMS. The basis of analysis was the finite element method. Simulated results using MUMPs 11 film parameters showed qualitative agreement with measured data, but obvious quantitative differences. Subsequent remeasurement of the metal stress and use of the new value significantly improved model agreement with the measured data. The paper explores the effect of several film parameters on the modeled structures. Implications for MEMS film metrology, and test structures are considered.
Key Processes of Silicon-On-Glass MEMS Fabrication Technology for Gyroscope Application.
Ma, Zhibo; Wang, Yinan; Shen, Qiang; Zhang, Han; Guo, Xuetao
2018-04-17
MEMS fabrication that is based on the silicon-on-glass (SOG) process requires many steps, including patterning, anodic bonding, deep reactive ion etching (DRIE), and chemical mechanical polishing (CMP). The effects of the process parameters of CMP and DRIE are investigated in this study. The process parameters of CMP, such as abrasive size, load pressure, and pH value of SF1 solution are examined to optimize the total thickness variation in the structure and the surface quality. The ratio of etching and passivation cycle time and the process pressure are also adjusted to achieve satisfactory performance during DRIE. The process is optimized to avoid neither the notching nor lag effects on the fabricated silicon structures. For demonstrating the capability of the modified CMP and DRIE processes, a z-axis micro gyroscope is fabricated that is based on the SOG process. Initial test results show that the average surface roughness of silicon is below 1.13 nm and the thickness of the silicon is measured to be 50 μm. All of the structures are well defined without the footing effect by the use of the modified DRIE process. The initial performance test results of the resonant frequency for the drive and sense modes are 4.048 and 4.076 kHz, respectively. The demands for this kind of SOG MEMS device can be fulfilled using the optimized process.
Recent progress in MEMS technology development for military applications
NASA Astrophysics Data System (ADS)
Ruffin, Paul B.; Burgett, Sherrie J.
2001-08-01
The recent progress of ongoing efforts at the Army Aviation and Missile Command (AMCOM) to develop microelectromechanical systems (MEMS) technology for military applications is discussed in this paper. The current maturity level of low cost, low power, micro devices in industry, which range from simple temperature and pressure sensors to accelerometers in airbags, provides a viable foundation for the development of rugged MEMS devices for dual-use applications. Early MEMS technology development efforts at AMCOM emphasized inertial MEMS sensors. An Army Science and Technology Objective (STO) project was initiated to develop low cost inertial components with moderate angular rate sensor resolution for measuring pitch and yaw of missile attitude and rotational roll rate. Leveraging the Defense Advanced Research Projects Agency and other Government agencies has resulted in the development of breadboard inertial MEMS devices with improved robustness. During the past two years, MEMS research at AMCOM has been expanded to include environmental MEMS sensors for missile health monitoring, RF-MEMS, optical MEMS devices for beam steering, and micro-optic 'benches' for opto-electronics miniaturization. Additionally, MEMS packaging and integration issues have come into focus and are being addressed. Selected ongoing research efforts in these areas are presented, and some horizon MEMS sensors requirements for Army and law enforcement are presented for consideration.
A finite element model of a MEMS-based surface acoustic wave hydrogen sensor.
El Gowini, Mohamed M; Moussa, Walied A
2010-01-01
Hydrogen plays a significant role in various industrial applications, but careful handling and continuous monitoring are crucial since it is explosive when mixed with air. Surface Acoustic Wave (SAW) sensors provide desirable characteristics for hydrogen detection due to their small size, low fabrication cost, ease of integration and high sensitivity. In this paper a finite element model of a Surface Acoustic Wave sensor is developed using ANSYS12© and tested for hydrogen detection. The sensor consists of a YZ-lithium niobate substrate with interdigital electrodes (IDT) patterned on the surface. A thin palladium (Pd) film is added on the surface of the sensor due to its high affinity for hydrogen. With increased hydrogen absorption the palladium hydride structure undergoes a phase change due to the formation of the β-phase, which deteriorates the crystal structure. Therefore with increasing hydrogen concentration the stiffness and the density are significantly reduced. The values of the modulus of elasticity and the density at different hydrogen concentrations in palladium are utilized in the finite element model to determine the corresponding SAW sensor response. Results indicate that with increasing the hydrogen concentration the wave velocity decreases and the attenuation of the wave is reduced.
EDITORIAL: International MEMS Conference 2006
NASA Astrophysics Data System (ADS)
Tay, Francis E. H.; Jianmin, Miao; Iliescu, Ciprian
2006-04-01
The International MEMS conference (iMEMS2006) organized by the Institute of Bioengineering and Nanotechnology and Nanyang Technological University aims to provide a platform for academicians, professionals and industrialists in various related fields from all over the world to share and learn from each other. Of great interest is the incorporation of the theme of life sciences application using MEMS. It is the desire of this conference to initiate collaboration and form network of cooperation. This has continued to be the objective of iMEMS since its inception in 1997. The technological advance of MEMS over the past few decades has been truly exciting in terms of development and applications. In order to participate in this rapid development, a conference involving delegates from within the MEMS community and outside the community is very meaningful and timely. With the receipt of over 200 articles, delegates related to MEMS field from all over the world will share their perspectives on topics such as MEMS/MST Design, MEMS Teaching and Education, MEMS/MST Packaging, MEMS/MST Fabrication, Microsystems Applications, System Integration, Wearable Devices, MEMSWear and BioMEMS. Invited speakers and delegates from outside the field have also been involved to provide challenges, especially in the life sciences field, for the MEMS community to potentially address. The proceedings of the conference will be published as an issue in the online Journal of Physics: Conference Series and this can reach a wider audience and will facilitate the reference and citation of the work presented in the conference. We wish to express our deep gratitude to the International Scientific Committee members and the organizing committee members for contributing to the success of this conference. We would like to thank all the delegates, speakers and sponsors from all over the world for presenting and sharing their perspectives on topics related to MEMS and the challenges that MEMS can potentially address.
Graphitization in Carbon MEMS and Carbon NEMS
NASA Astrophysics Data System (ADS)
Sharma, Swati
Carbon MEMS (CMEMS) and Carbon NEMS (CNEMS) are an emerging class of miniaturized devices. Due to the numerous advantages such as scalable manufacturing processes, inexpensive and readily available precursor polymer materials, tunable surface properties and biocompatibility, carbon has become a preferred material for a wide variety of future sensing applications. Single suspended carbon nanowires (CNWs) integrated on CMEMS structures fabricated by electrospinning of SU8 photoresist on photolithographially patterned SU8 followed by pyrolysis are utilized for understanding the graphitization process in micro and nano carbon materials. These monolithic CNW-CMEMS structures enable the fabrication of very high aspect ratio CNWs of predefined length. The CNWs thus fabricated display core---shell structures having a graphitic shell with a glassy carbon core. The electrical conductivity of these CNWs is increased by about 100% compared to glassy carbon as a result of enhanced graphitization. We explore various tunable fabrication and pyrolysis parameters to improve graphitization in the resulting CNWs. We also suggest gas-sensing application of the thus fabricated single suspended CNW-CMEMS devices by using the CNW as a nano-hotplate for local chemical vapor deposition. In this thesis we also report on results from an optimization study of SU8 photoresist derived carbon electrodes. These electrodes were applied to the simultaneous detection of traces of Cd(II) and Pb(II) through anodic stripping voltammetry and detection limits as low as 0.7 and 0.8 microgL-1 were achieved. To further improve upon the electrochemical behavior of the carbon electrodes we elucidate a modified pyrolysis technique featuring an ultra-fast temperature ramp for obtaining bubbled porous carbon from lithographically patterned SU8. We conclude this dissertation by suggesting the possible future works on enhancing graphitization as well as on electrochemical applications
NASA Astrophysics Data System (ADS)
Heo, Joonseong; Kwon, Hyukjin J.; Jeon, Hyungkook; Kim, Bumjoo; Kim, Sung Jae; Lim, Geunbae
2014-07-01
Nanofabrication technologies have been a strong advocator for new scientific fundamentals that have never been described by traditional theory, and have played a seed role in ground-breaking nano-engineering applications. In this study, we fabricated ultra-high-aspect (~106 with O(100) nm nanochannel opening and O(100) mm length) orthogonal nanochannel array using only polymeric materials. Vertically aligned nanochannel arrays in parallel can be stacked to form a dense nano-structure. Due to the flexibility and stretchability of the material, one can tune the size and shape of the nanochannel using elongation and even roll the stack array to form a radial-uniformly distributed nanochannel array. The roll can be cut at discretionary lengths for incorporation with a micro/nanofluidic device. As examples, we demonstrated ion concentration polarization with the device for Ohmic-limiting/overlimiting current-voltage characteristics and preconcentrated charged species. The density of the nanochannel array was lower than conventional nanoporous membranes, such as anodic aluminum oxide membranes (AAO). However, accurate controllability over the nanochannel array dimensions enabled multiplexed one microstructure-on-one nanostructure interfacing for valuable biological/biomedical microelectromechanical system (BioMEMS) platforms, such as nano-electroporation.Nanofabrication technologies have been a strong advocator for new scientific fundamentals that have never been described by traditional theory, and have played a seed role in ground-breaking nano-engineering applications. In this study, we fabricated ultra-high-aspect (~106 with O(100) nm nanochannel opening and O(100) mm length) orthogonal nanochannel array using only polymeric materials. Vertically aligned nanochannel arrays in parallel can be stacked to form a dense nano-structure. Due to the flexibility and stretchability of the material, one can tune the size and shape of the nanochannel using elongation and even roll the stack array to form a radial-uniformly distributed nanochannel array. The roll can be cut at discretionary lengths for incorporation with a micro/nanofluidic device. As examples, we demonstrated ion concentration polarization with the device for Ohmic-limiting/overlimiting current-voltage characteristics and preconcentrated charged species. The density of the nanochannel array was lower than conventional nanoporous membranes, such as anodic aluminum oxide membranes (AAO). However, accurate controllability over the nanochannel array dimensions enabled multiplexed one microstructure-on-one nanostructure interfacing for valuable biological/biomedical microelectromechanical system (BioMEMS) platforms, such as nano-electroporation. Electronic supplementary information (ESI) available. See DOI: 10.1039/c4nr00350k
Characterizing the reliability of a bioMEMS-based cantilever sensor
NASA Astrophysics Data System (ADS)
Bhalerao, Kaustubh D.
2004-12-01
The cantilever-based BioMEMS sensor represents one instance from many competing ideas of biosensor technology based on Micro Electro Mechanical Systems. The advancement of BioMEMS from laboratory-scale experiments to applications in the field will require standardization of their components and manufacturing procedures as well as frameworks to evaluate their performance. Reliability, the likelihood with which a system performs its intended task, is a compact mathematical description of its performance. The mathematical and statistical foundation of systems-reliability has been applied to the cantilever-based BioMEMS sensor. The sensor is designed to detect one aspect of human ovarian cancer, namely the over-expression of the folate receptor surface protein (FR-alpha). Even as the application chosen is clinically motivated, the objective of this study was to demonstrate the underlying systems-based methodology used to design, develop and evaluate the sensor. The framework development can be readily extended to other BioMEMS-based devices for disease detection and will have an impact in the rapidly growing $30 bn industry. The Unified Modeling Language (UML) is a systems-based framework for design and development of object-oriented information systems which has potential application for use in systems designed to interact with biological environments. The UML has been used to abstract and describe the application of the biosensor, to identify key components of the biosensor, and the technology needed to link them together in a coherent manner. The use of the framework is also demonstrated in computation of system reliability from first principles as a function of the structure and materials of the biosensor. The outcomes of applying the systems-based framework to the study are the following: (1) Characterizing the cantilever-based MEMS device for disease (cell) detection. (2) Development of a novel chemical interface between the analyte and the sensor that provides a degree of selectivity towards the disease. (3) Demonstrating the performance and measuring the reliability of the biosensor prototype, and (4) Identification of opportunities in technological development in order to further refine the proposed biosensor. Application of the methodology to design develop and evaluate the reliability of BioMEMS devices will be beneficial in the streamlining the growth of the BioMEMS industry, while providing a decision-support tool in comparing and adopting suitable technologies from available competing options.
Compliant displacement-multiplying apparatus for microelectromechanical systems
Kota, Sridhar; Rodgers, M. Steven; Hetrick, Joel A.
2001-01-01
A pivotless compliant structure is disclosed that can be used to increase the geometric advantage or mechanical advantage of a microelectromechanical (MEM) actuator such as an electrostatic comb actuator, a capacitive-plate electrostatic actuator, or a thermal actuator. The compliant structure, based on a combination of interconnected flexible beams and cross-beams formed of one or more layers of polysilicon or silicon nitride, can provide a geometric advantage of from about 5:1 to about 60:1 to multiply a 0.25-3 .mu.m displacement provided by a short-stroke actuator so that such an actuator can be used to generate a displacement stroke of about 10-34 .mu.m to operate a ratchet-driven MEM device or a microengine. The compliant structure has less play than conventional displacement-multiplying devices based on lever arms and pivoting joints, and is expected to be more reliable than such devices. The compliant structure and an associated electrostatic or thermal actuator can be formed on a common substrate (e.g. silicon) using surface micromachining.
Determination Method of Bridge Rotation Angle Response Using MEMS IMU
Sekiya, Hidehiko; Kinomoto, Takeshi; Miki, Chitoshi
2016-01-01
To implement steel bridge maintenance, especially that related to fatigue damage, it is important to monitor bridge deformations under traffic conditions. Bridges deform and rotate differently under traffic load conditions because their structures differ in terms of length and flexibility. Such monitoring enables the identification of the cause of stress concentrations that cause fatigue damage and the proposal of appropriate countermeasures. However, although bridge deformation monitoring requires observations of bridge angle response as well as the bridge displacement response, measuring the rotation angle response of a bridge subject to traffic loads is difficult. Theoretically, the rotation angle response can be calculated by integrating the angular velocity, but for field measurements of actual in-service bridges, estimating the necessary boundary conditions would be difficult due to traffic-induced vibration. To solve the problem, this paper proposes a method for determining the rotation angle response of an in-service bridge from its angular velocity, as measured by a inertial measurement unit (IMU). To verify our proposed method, field measurements were conducted using nine micro-electrical mechanical systems (MEMS) IMUs and two contact displacement gauges. The results showed that our proposed method provided high accuracy when compared to the reference responses calculated by the contact displacement gauges. PMID:27834871
KAPAO: a MEMS-based natural guide star adaptive optics system
NASA Astrophysics Data System (ADS)
Severson, Scott A.; Choi, Philip I.; Contreras, Daniel S.; Gilbreth, Blaine N.; Littleton, Erik; McGonigle, Lorcan P.; Morrison, William A.; Rudy, Alex R.; Wong, Jonathan R.; Xue, Andrew; Spjut, Erik; Baranec, Christoph; Riddle, Reed
2013-03-01
We describe KAPAO, our project to develop and deploy a low-cost, remote-access, natural guide star adaptive optics (AO) system for the Pomona College Table Mountain Observatory (TMO) 1-meter telescope. We use a commercially available 140-actuator BMC MEMS deformable mirror and a version of the Robo-AO control software developed by Caltech and IUCAA. We have structured our development around the rapid building and testing of a prototype system, KAPAO-Alpha, while simultaneously designing our more capable final system, KAPAO-Prime. The main differences between these systems are the prototype's reliance on off-the-shelf optics and a single visible-light science camera versus the final design's improved throughput and capabilities due to the use of custom optics and dual-band, visible and near-infrared imaging. In this paper, we present the instrument design and on-sky closed-loop testing of KAPAO-Alpha as well as our plans for KAPAO-Prime. The primarily undergraduate-education nature of our partner institutions, both public (Sonoma State University) and private (Pomona and Harvey Mudd Colleges), has enabled us to engage physics, astronomy, and engineering undergraduates in all phases of this project. This material is based upon work supported by the National Science Foundation under Grant No. 0960343.
Characterization of microcracks by application of digital image correlation to SPM images
NASA Astrophysics Data System (ADS)
Keller, Juergen; Gollhardt, Astrid; Vogel, Dietmar; Michel, Bernd
2004-07-01
With the development of micro- and nanotechnological products such as sensors, MEMS/NEMS and their broad application in a variety of market segments new reliability issues will arise. The increasing interface-to-volume ratio in highly integrated systems and nanoparticle filled materials and unsolved questions of size effect of nanomaterials are challenges for experimental reliability evaluation. To fulfill this needs the authors developed the nanoDAC method (nano Deformation Analysis by Correlation), which allows the determination and evaluation of 2D displacement fields based on scanning probe microscopy (SPM) data. In-situ SPM scans of the analyzed object are carried out at different thermo-mechanical load states. The obtained topography-, phase- or error-images are compared utilizing grayscale cross correlation algorithms. This allows the tracking of local image patterns of the analyzed surface structure. The measurement results of the nanoDAC method are full-field displacement and strain fields. Due to the application of SPM equipment deformations in the micro-, nanometer range can be easily detected. The method can be performed on bulk materials, thin films and on devices i.e microelectronic components, sensors or MEMS/NEMS. Furthermore, the characterization and evaluation of micro- and nanocracks or defects in bulk materials, thin layers and at material interfaces can be carried out.
NASA Astrophysics Data System (ADS)
Whalen, John J., III
Implantable electrical neurostimulating devices are being developed for a number of applications, including artificial vision through retinal stimulation. The epiretinal prosthesis will use a two-dimensional array microelectrodes to address individual cells of the retina. MEMS fabrication processes can produce arrays of microelectrodes with these dimensions, but there are two critical issues that they cannot satisfy. One, the stimulating electrodes are the only part of the implanted electrical device that penetrate through the water impermeable package, and must do so without sacrificing hermeticity. Two, As electrode size decreases, the current density (A cm-2 ) increases, due to increased electrochemical impedance. This reduces the amount of charge that can be safely injected into the tissue. To date, MEMS processing method, cannot produce electrode arrays with good, prolonged hermetic properties. Similarly, MEMS approaches do not account for the increased impedance caused by decreased surface area. For these reasons there is a strong motivation for the development of a water-impermeable, substrate-penetrating electrode array with low electrochemical impedance. This thesis presents a stimulating electrode array fabricated from platinum nanowires using a modified electrochemical template synthesis approach. Nanowires are electrochemically deposited from ammonium hexachloroplatinate solution into lithographically patterned nanoporous anodic alumina templates to produce microarrays of platinum nanowires. The platinum nanowires penetrating through the ceramic aluminum oxide template serve as parallel electrical conduits through the water impermeable, electrically insulating substrate. Electrode impedance can be adjusted by either controlling the nanowire hydrous platinum oxide content or by partially etching the alumina template to expose additional surface area. A stepwise approach to this project was taken. First, the electrochemistry of ammonium hexachloroplatinate solution was characterized, and physical properties of electrodeposited thin films were correlated to deposition conditions used. Second, platinum nanowires were fabricated and their properties characterized, using similar deposition conditions. Third, the feasibility of fabricating platinum nanowire stimulating electrode arrays with a variety of surface structures was demonstrated. Fourth, the enhanced charge transfer characteristics of these structures were demonstrated using electrochemical techniques. Finally, retinal cell stimulation was demonstrated using electrodes from platinum nanowire arrays.
Mehta, Dharmini C; Short, Jennifer L; Nicolazzo, Joseph A
2013-12-02
Memantine (MEM) is prescribed in mono and combination therapies for treating the symptoms of moderate to severe Alzheimer's disease (AD). Despite MEM being widely prescribed with other AD and non-AD medicines, very little is known about its mechanism of transport across the blood-brain barrier (BBB), and whether the nature of this transport lends MEM to a potential for drug-drug interactions at the BBB. Therefore, the purpose of this study was to characterize the mechanisms facilitating MEM brain uptake in Swiss Outbred mice using an in situ transcardiac perfusion technique, and identify the putative transporter involved in MEM disposition into the brain. Following transcardiac perfusion of MEM with increasing concentrations, the brain uptake of MEM was observed to be saturable. Furthermore, MEM brain uptake was reduced (up to 55%) by various cationic transporter inhibitors (amantadine, quinine, tetraethylammonium, choline and carnitine) and was dependent on extracellular pH, while being independent of membrane depolarization and the presence of Na(+) in the perfusate. In addition, MEM brain uptake was observed to be sensitive to changes in intracellular pH, hence, likely to be driven by H(+)/MEM antiport mechanisms. Taken together, these findings implicate the involvement of an organic cation transporter regulated by proton antiport mechanisms in the transport of MEM across the mouse BBB, possibly the organic cation/carnitine transporter, OCTN1. These studies also clearly demonstrate the brain uptake of MEM is significantly reduced by other cationic compounds, highlighting the need to consider the possibility of drug interactions with MEM at the BBB, potentially leading to reduced brain uptake and, therefore, altered efficacy of MEM when used in patients on multidrug regimens.
Closed-loop control of gimbal-less MEMS mirrors for increased bandwidth in LiDAR applications
NASA Astrophysics Data System (ADS)
Milanović, Veljko; Kasturi, Abhishek; Yang, James; Hu, Frank
2017-05-01
In 2016, we presented a low SWaP wirelessly controlled MEMS mirror-based LiDAR prototype which utilized an OEM laser rangefinder for distance measurement [1]. The MEMS mirror was run in open loop based on its exceptionally fast design and high repeatability performance. However, to further extend the bandwidth and incorporate necessary eyesafety features, we recently focused on providing mirror position feedback and running the system in closed loop control. Multiple configurations of optical position sensors, mounted on both the front- and the back-side of the MEMS mirror, have been developed and will be presented. In all cases, they include a light source (LED or laser) and a 2D photosensor. The most compact version is mounted on the backside of the MEMS mirror ceramic package and can "view" the mirror's backside through openings in the mirror's PCB and its ceramic carrier. This version increases the overall size of the MEMS mirror submodule from 12mm x 12mm x 4mm to 15mm x 15mm x 7mm. The sensors also include optical and electronic filtering to reduce effects of any interference from the application laser illumination. With relatively simple FPGA-based PID control running at the sample rate of 100 kHz, we could configure the overall response of the system to fully utilize the MEMS mirror's native bandwidth which extends well beyond its first resonance. When compared to the simple open loop method of suppressing overshoot and ringing which significantly limits bandwidth utilization, running the mirrors in closed loop control increased the bandwidth to nearly 3.7 times. A 2.0mm diameter integrated MEMS mirror with a resonant frequency of 1300 Hz was limited to 500Hz bandwidth in open loop driving but was increased to 3kHz bandwidth with the closed loop controller. With that bandwidth it is capable of very sharply defined uniform-velocity scans (sawtooth or triangle waveforms) which are highly desired in scanned mirror LiDAR systems. A 2.4mm diameter mirror with +/-12° of scan angle achieves over 1.3kHz of flat response, allowing sharp triangle waveforms even at 300Hz (600 uniform velocity lines per second). The same methodology is demonstrated with larger, bonded mirrors. Here closed loop control is more challenging due to the additional resonance and a more complex system dynamic. Nevertheless, results are similar - a 5mm diameter mirror bandwidth was increased from 150Hz to 500Hz.
NASA Technical Reports Server (NTRS)
Goodwin, Thomas J. (Inventor); Wolf, David A. (Inventor); Spaulding, Glenn F. (Inventor); Prewett, Tacey L. (Inventor)
1999-01-01
Normal mammalian tissue and the culturing process has been developed for the three groups of organ, structural and blood tissue. The cells are grown in vitro under micro- gravity culture conditions and form three dimensional cells aggregates with normal cell function. The microgravity culture conditions may be microgravity or simulated microgravity created in a horizontal rotating wall culture vessel. The medium used for culturing the cells, especially a mixture of epithelial and mesenchymal cells contains a mixture of Mem-alpha and Leibovits L15 supplemented with glucose, galactose and fructose.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Smith, J.H.; Ellis, J.R.; Montague, S.
1997-03-01
One of the principal applications of monolithically integrated micromechanical/microelectronic systems has been accelerometers for automotive applications. As integrated MEMS/CMOS technologies such as those developed by U.C. Berkeley, Analog Devices, and Sandia National Laboratories mature, additional systems for more sensitive inertial measurements will enter the commercial marketplace. In this paper, the authors will examine key technology design rules which impact the performance and cost of inertial measurement devices manufactured in integrated MEMS/CMOS technologies. These design parameters include: (1) minimum MEMS feature size, (2) minimum CMOS feature size, (3) maximum MEMS linear dimension, (4) number of mechanical MEMS layers, (5) MEMS/CMOS spacing.more » In particular, the embedded approach to integration developed at Sandia will be examined in the context of these technology features. Presently, this technology offers MEMS feature sizes as small as 1 {micro}m, CMOS critical dimensions of 1.25 {micro}m, MEMS linear dimensions of 1,000 {micro}m, a single mechanical level of polysilicon, and a 100 {micro}m space between MEMS and CMOS. This is applicable to modern precision guided munitions.« less
Simulation, prediction, and genetic analyses of daily methane emissions in dairy cattle.
Yin, T; Pinent, T; Brügemann, K; Simianer, H; König, S
2015-08-01
This study presents an approach combining phenotypes from novel traits, deterministic equations from cattle nutrition, and stochastic simulation techniques from animal breeding to generate test-day methane emissions (MEm) of dairy cows. Data included test-day production traits (milk yield, fat percentage, protein percentage, milk urea nitrogen), conformation traits (wither height, hip width, body condition score), female fertility traits (days open, calving interval, stillbirth), and health traits (clinical mastitis) from 961 first lactation Brown Swiss cows kept on 41 low-input farms in Switzerland. Test-day MEm were predicted based on the traits from the current data set and 2 deterministic prediction equations, resulting in the traits labeled MEm1 and MEm2. Stochastic simulations were used to assign individual concentrate intake in dependency of farm-type specifications (requirement when calculating MEm2). Genetic parameters for MEm1 and MEm2 were estimated using random regression models. Predicted MEm had moderate heritabilities over lactation and ranged from 0.15 to 0.37, with highest heritabilities around DIM 100. Genetic correlations between MEm1 and MEm2 ranged between 0.91 and 0.94. Antagonistic genetic correlations in the range from 0.70 to 0.92 were found for the associations between MEm2 and milk yield. Genetic correlations between MEm with days open and with calving interval increased from 0.10 at the beginning to 0.90 at the end of lactation. Genetic relationships between MEm2 and stillbirth were negative (0 to -0.24) from the beginning to the peak phase of lactation. Positive genetic relationships in the range from 0.02 to 0.49 were found between MEm2 with clinical mastitis. Interpretation of genetic (co)variance components should also consider the limitations when using data generated by prediction equations. Prediction functions only describe that part of MEm which is dependent on the factors and effects included in the function. With high probability, there are more important effects contributing to variations of MEm that are not explained or are independent from these functions. Furthermore, autocorrelations exist between indicator traits and predicted MEm. Nevertheless, this integrative approach, combining information from dairy cattle nutrition with dairy cattle genetics, generated novel traits which are difficult to record on a large scale. The simulated data basis for MEm was used to determine the size of a cow calibration group for genomic selection. A calibration group including 2,581 cows with MEm phenotypes was competitive with conventional breeding strategies. Copyright © 2015 American Dairy Science Association. Published by Elsevier Inc. All rights reserved.
Gallium nitride-based micro-opto-electro-mechanical systems
NASA Astrophysics Data System (ADS)
Stonas, Andreas Robert
Gallium Nitride and its associated alloys InGaN and AlGaN have many material properties that are highly desirable for micro-electro-mechanical systems (MEMS), and more specifically micro-opto-electro-mechanical systems (MOEMS). The group III-nitrides are tough, stiff, optically transparent, direct bandgap, chemically inert, highly piezoelectric, and capable of functioning at high temperatures. There is currently no other semiconductor system that possesses all of these properties. Taken together, these attributes make the nitrides prime candidates not only for creating new versions of existing device structures, but also for creating entirely unique devices which combine these properties in novel ways. Unfortunately, their chemical resiliency also makes the group III-nitrides extraordinarily difficult to shape into devices. In particular, until this research, no undercut etch technology existed that could controllably separate a selected part of a MEMS device from its sapphire or silicon carbide substrate. This has effectively prevented GaN-based MEMS from being developed. This dissertation describes how this fabrication obstacle was overcome by a novel etching geometry (bandgap-selective backside-illuminated photoelectochemical (BS-BIPEC) etching) and its resulting morphologies. Several gallium-nitride based MEMS devices were created, actuated, and modelled, including cantilevers and membranes. We describe in particular our pursuit of one of the many novel device elements that is possible only in this material system: a transducer that uses an externally applied strain to dynamically change the optical transition energy of a quantum well. While the device objective of a dynamically tunable quantum well was not achieved, we have demonstrated sufficient progress to believe that such a device will be possible soon. We have observed a shift (5.5meV) of quantum well transition energies in released structures, and we have created structures that can apply large biaxial stresses, which are required to produce significantly larger tuning (up to several hundred meV) in quantum well-based devices.
NASA Astrophysics Data System (ADS)
Zehetner, J.; Vanko, G.; Dzuba, J.; Ryger, I.; Lalinsky, T.; Benkler, Manuel; Lucki, Michal
2015-05-01
AlGaN/GaN based high electron mobility transistors (HEMTs), Schottky diodes and/or resistors have been presented as sensing devices for mechanical or chemical sensors operating in extreme conditions. In addition we investigate ferroelectric thin films for integration into micro-electro-mechanical-systems (MEMS). Creation of appropriate diaphragms and/or cantilevers out of SiC is necessary for further improvement of sensing properties of such MEMS sensors. For example sensitivity of the AlGaN/GaN based MEMS pressure sensor can be modified by membrane thickness. We demonstrated that a 4H-SiC 80μm thick diaphragms can be fabricated much faster with laser ablation than by electrochemical, photochemical or reactive ion etching (RIE). We were able to verify the feasibility of this process by fabrication of micromechanical membrane structures also in bulk 3C-SiC, borosilicate glass, sapphire and Al2O3 ceramic substrates by femtosecond laser (520nm) ablation. On a 350μm thick 4H-SiC substrate we produced an array of 275μm deep and 1000μm to 3000μm of diameter blind holes without damaging the 2μm AlN layer at the back side. In addition we investigated ferroelectric thin films as they can be deposited and micro-patterned by a direct UV-lithography method after the ablation process for a specific membrane design. The risk to harm or damage the function of thin films was eliminated by that means. Some defects in the ablated membranes are also affected by the polarisation of the laser light. Ripple structures oriented perpendicular to the laser polarisation promote creation of pin holes which would perforate a thin membrane. We developed an ablation technique strongly inhibiting formation of ripples and pin poles.
NASA Astrophysics Data System (ADS)
Reynaerts, Dominiek; Vullers, Ruud
2011-10-01
This special section of Journal of Micromechanics and Microengineering features papers selected from the 10th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2010). The workshop was organized in Leuven, Belgium from 30 November to 3 December 2010 by Katholieke Universiteit Leuven and the imec/Holst Centre. This was a special PowerMEMS Workshop, for several reasons. First of all, we celebrated the 10th anniversary of the workshop: the first PowerMEMS meeting was organized in Sendai, Japan in 2000. None of the organizers or participants of this first meeting could have predicted the impact of the workshop over the next decade. The second reason was that, for the first time, the conference organization spanned two countries: Belgium and the Netherlands. Thanks to the advances in information technology, teams from Katholieke Universiteit Leuven (Belgium) and the imec/Holst Centre in Eindhoven (the Netherlands) have been able to work together seamlessly as one team. The objective of the PowerMEMS Workshop is to stimulate innovation in micro and nanotechnology for power generation and energy conversion applications. Its scope ranges from integrated microelectromechanical systems (MEMS) for power generation, dissipation, harvesting, and management, to novel nanostructures and materials for energy-related applications. True to the objective of the PowerMEMSWorkshop, the 2010 technical program covered a broad range of energy related research, ranging from the nanometer to the millimeter scale, discussed in 5 invited and 52 oral presentations, and 112 posters. This special section includes 14 papers covering vibration energy harvesters, thermal applications and micro power systems. Finally, we wish to express sincere appreciation to the members of the International Steering Committee, the Technical Program Committee and last but not least the Local Organizing Committee. This special issue was edited in collaboration with the staff of IOP Publishing. PowerMEMS 2010 contents Harvesting energy from airflow with a michromachined piezoelectric harvester inside a Helmholtz resonator S P Matova, R Elfrink, R J M Vullers and R van Schaijk Analysis and characterization of triangular electrode structures for electrostatic energy harvestingDaniel Hoffmann, Bernd Folkmer and Yiannos Manoli A smart and self-sufficient frequency tunable vibration energy harvesterC Eichhorn, R Tchagsim, N Wilhelm and P Woias Power output enhancement of a vibration-driven electret generator for wireless sensor applicationsTatsuakira Masaki, Kenji Sakurai, Toru Yokoyama, Masayo Ikuta, Hiroshi Sameshima, Masashi Doi, Tomonori Seki and Masatoshi Oba Harvesting traffic-induced vibrations for structural health monitoring of bridgesT V Galchev, J McCullagh, R L Peterson and K Najafi Dispenser-printed planar thick-film thermoelectric energy generatorsA Chen, D Madan, P K Wright and J W Evans Silicon nanowire arrays as thermoelectric material for a power microgeneratorD Dávila, A Tarancón, M Fernández-Regúlez, C Calaza, M Salleras, A San Paulo and L Fonseca A micro thermal switch with a stiffness-enhanced thermal isolation structureTakashiro Tsukamoto, Masayoshi Esashi and Shuji Tanaka A dielectric liquid contact thermal switch with electrowetting actuationA R McLanahan, C D Richards and R F Richards A self-regulating valve for single-phase liquid cooling of microelectronicsRadu Donose, Michaël De Volder, Jan Peirs and Dominiek Reynaerts A MEMS-enabled 3D zinc-air microbattery with improved discharge characteristics based on a multilayer metallic substructureA Armutlulu, Y Fang, S H Kim, C H Ji, S A Bidstrup Allen and M G Allen Design, fabrication and testing of an air-breathing micro direct methanol fuel cell with compound anode flow fieldLuwen Wang, Yufeng Zhang, Youran Zhao, Zijiang An, Zhiping Zhou and Xiaowei Liu A shadow-mask evaporated pyroMEMS igniterD A de Koninck, D Briand and N F de Rooij Aerodynamic journal bearing with a flexible, damped support operating at 7.2 million DNTobias Waumans, Jan Peirs, Farid Al-Bender and Dominiek Reynaerts Thermoelectric energy harvester on the heated human machineVladimir Leonov
Converting MEMS technology into profits
NASA Astrophysics Data System (ADS)
Bryzek, Janusz
1998-08-01
This paper discusses issues related to transitioning a company from the advanced technology development phase (with a particular focus on MEMS) to a profitable business, with emphasis on start-up companies. It includes several case studies from (primarily) NovaSensor MEMS development history. These case studies illustrate strategic problems with which advanced MEMS technology developers have to be concerned. Conclusions from these case studies could be used as checkpoints for future MEMS developers to increase probability of profitable operations. The objective for this paper is to share the author's experience from multiple MEMS start-ups to accelerate development of the MEMS market by focusing state- of-the-art technologists on marketing issues.
Martín, Ferran; Bonache, Jordi
2014-01-01
In this review paper, several strategies for the implementation of reconfigurable split ring resonators (SRRs) based on RF-MEMS switches are presented. Essentially three types of RF-MEMS combined with split rings are considered: (i) bridge-type RF-MEMS on top of complementary split ring resonators CSRRs; (ii) cantilever-type RF-MEMS on top of SRRs; and (iii) cantilever-type RF-MEMS integrated with SRRs (or RF-MEMS SRRs). Advantages and limitations of these different configurations from the point of view of their potential applications for reconfigurable stopband filter design are discussed, and several prototype devices are presented. PMID:25474378
2013-01-01
As a highly sensitive strain gauge element, GaAs-based resonant tunneling diode (RTD) has already been applied in microelectromechanical system (MEMS) sensors. Due to poor mechanical properties and high cost, GaAs-based material has been limited in applications as the substrate for MEMS. In this work, we present a method to fabricate the GaAs-based RTD on Si substrate. From the experimental results, it can be concluded that the piezoresistive coefficient achieved with this method reached 3.42 × 10−9 m2/N, which is about an order of magnitude higher than the Si-based semiconductor piezoresistors. PMID:23651496
NASA Astrophysics Data System (ADS)
Fan, Ji; Zhang, Wen Ting; Liu, Jin Quan; Wu, Wen Jie; Zhu, Tao; Tu, Liang Cheng
2015-04-01
We systematically investigate the fabrication and dry-release technology for a high aspect ratio (HAR) structure with vertical and smooth silicon etching sidewalls. One-hundred-micrometer silicon on insulator (SOI) wafers are used in this work. By optimizing the process parameters of inductively coupled plasma deep reactive-ion etching, a HAR (˜25∶1) structure with a microtrench width of 4 μm has been demonstrated. A perfect etching profile has been obtained in which the structures present an almost perfect verticality of 0.10 μm and no sidewall scallops. The root-mean square roughness of silicon sidewalls is 20 to 29 nm. An in situ dry-release method using notching effect is employed after etching. By analysis, we found that the final notch length is typically an aspect-ratio-dependent process. The structure designed in this work has been successfully released by this in situ dry-release method, and the released bottom roughness effectively prohibits the stiction mechanism. The results demonstrate potential applications for design and fabrication of HAR SOI MEMS/MOEMS.
Development of micro-electromechanical system (MEMS) cochlear biomodel
NASA Astrophysics Data System (ADS)
Ngelayang, Thailis Bounya Anak; Latif, Rhonira
2015-05-01
Human cochlear is undeniably one of the most amazing organs in human body. The functional mechanism is very unique in terms of its ability to convert the sound waves in the form of mechanical vibrations into the electrical nerve impulses. It is known that the normal human auditory system can perceive the audible frequency range between 20 Hz to 20 kHz. Scientists have conducted several researches trying to build the artificial basilar membrane in the human cochlea (cochlear biomodel). Micro-electromechanical system (MEMS) is one of the potential inventions that have the ability to mimic the active behavior of the basilar membrane. In this paper, an array of MEMS bridge beams that are mechanically sensitive to the perceived audible frequency has been proposed. An array of bridge bridge beams with 0.5 µm thickness and length varying from 200 µm to 2000 µm have been designed operate within the audible frequency range. In the bridge beams design, aluminium (Al), copper (Cu), tantalum (Ta) and platinum (Pt) have considered as the material for the bridge beam structure. From the finite element (FE) and lumped element (LE) models of the MEMS bridge beams, platinum has been found to be the best material for the cochlear biomodel design, closely mimicking the basilar membrane.
Wafer-level vacuum/hermetic packaging technologies for MEMS
NASA Astrophysics Data System (ADS)
Lee, Sang-Hyun; Mitchell, Jay; Welch, Warren; Lee, Sangwoo; Najafi, Khalil
2010-02-01
An overview of wafer-level packaging technologies developed at the University of Michigan is presented. Two sets of packaging technologies are discussed: (i) a low temperature wafer-level packaging processes for vacuum/hermeticity sealing, and (ii) an environmentally resistant packaging (ERP) technology for thermal and mechanical control as well as vacuum packaging. The low temperature wafer-level encapsulation processes are implemented using solder bond rings which are first patterned on a cap wafer and then mated with a device wafer in order to encircle and encapsulate the device at temperatures ranging from 200 to 390 °C. Vacuum levels below 10 mTorr were achieved with yields in an optimized process of better than 90%. Pressures were monitored for more than 4 years yielding important information on reliability and process control. The ERP adopts an environment isolation platform in the packaging substrate. The isolation platform is designed to provide low power oven-control, vibration isolation and shock protection. It involves batch flip-chip assembly of a MEMS device onto the isolation platform wafer. The MEMS device and isolation structure are encapsulated at the wafer-level by another substrate with vertical feedthroughs for vacuum/hermetic sealing and electrical signal connections. This technology was developed for high performance gyroscopes, but can be applied to any type of MEMS device.
Development of micro-electromechanical system (MEMS) cochlear biomodel
DOE Office of Scientific and Technical Information (OSTI.GOV)
Ngelayang, Thailis Bounya Anak; Latif, Rhonira
Human cochlear is undeniably one of the most amazing organs in human body. The functional mechanism is very unique in terms of its ability to convert the sound waves in the form of mechanical vibrations into the electrical nerve impulses. It is known that the normal human auditory system can perceive the audible frequency range between 20 Hz to 20 kHz. Scientists have conducted several researches trying to build the artificial basilar membrane in the human cochlea (cochlear biomodel). Micro-electromechanical system (MEMS) is one of the potential inventions that have the ability to mimic the active behavior of the basilar membrane. Inmore » this paper, an array of MEMS bridge beams that are mechanically sensitive to the perceived audible frequency has been proposed. An array of bridge bridge beams with 0.5 µm thickness and length varying from 200 µm to 2000 µm have been designed operate within the audible frequency range. In the bridge beams design, aluminium (Al), copper (Cu), tantalum (Ta) and platinum (Pt) have considered as the material for the bridge beam structure. From the finite element (FE) and lumped element (LE) models of the MEMS bridge beams, platinum has been found to be the best material for the cochlear biomodel design, closely mimicking the basilar membrane.« less
Three-Dimensionally Printed Micro-electromechanical Switches.
Lee, Yongwoo; Han, Jungmin; Choi, Bongsik; Yoon, Jinsu; Park, Jinhee; Kim, Yeamin; Lee, Jieun; Kim, Dae Hwan; Kim, Dong Myong; Lim, Meehyun; Kang, Min-Ho; Kim, Sungho; Choi, Sung-Jin
2018-05-09
Three-dimensional (3D) printers have attracted considerable attention from both industry and academia and especially in recent years because of their ability to overcome the limitations of two-dimensional (2D) processes and to enable large-scale facile integration techniques. With 3D printing technologies, complex structures can be created using only a computer-aided design file as a reference; consequently, complex shapes can be manufactured in a single step with little dependence on manufacturer technologies. In this work, we provide a first demonstration of the facile and time-saving 3D printing of two-terminal micro-electromechanical (MEM) switches. Two widely used thermoplastic materials were used to form 3D-printed MEM switches; freely suspended and fixed electrodes were printed from conductive polylactic acid, and a water-soluble sacrificial layer for air-gap formation was printed from poly(vinyl alcohol). Our 3D-printed MEM switches exhibit excellent electromechanical properties, with abrupt switching characteristics and an excellent on/off current ratio value exceeding 10 6 . Therefore, we believe that our study makes an innovative contribution with implications for the development of a broader range of 3D printer applications (e.g., the manufacturing of various MEM devices and sensors), and the work highlights a uniquely attractive path toward the realization of 3D-printed electronics.
Sensing magnetic flux density of artificial neurons with a MEMS device.
Tapia, Jesus A; Herrera-May, Agustin L; García-Ramírez, Pedro J; Martinez-Castillo, Jaime; Figueras, Eduard; Flores, Amira; Manjarrez, Elías
2011-04-01
We describe a simple procedure to characterize a magnetic field sensor based on microelectromechanical systems (MEMS) technology, which exploits the Lorentz force principle. This sensor is designed to detect, in future applications, the spiking activity of neurons or muscle cells. This procedure is based on the well-known capability that a magnetic MEMS device can be used to sense a small magnetic flux density. In this work, an electronic neuron (FitzHugh-Nagumo) is used to generate controlled spike-like magnetic fields. We show that the magnetic flux density generated by the hardware of this neuron can be detected with a new MEMS magnetic field sensor. This microdevice has a compact resonant structure (700 × 600 × 5 μm) integrated by an array of silicon beams and p-type piezoresistive sensing elements, which need an easy fabrication process. The proposed microsensor has a resolution of 80 nT, a sensitivity of 1.2 V.T(-1), a resonant frequency of 13.87 kHz, low power consumption (2.05 mW), quality factor of 93 at atmospheric pressure, and requires a simple signal processing circuit. The importance of our study is twofold. First, because the artificial neuron can generate well-controlled magnetic flux density, we suggest it could be used to analyze the resolution and performance of different magnetic field sensors intended for neurobiological applications. Second, the introduced MEMS magnetic field sensor may be used as a prototype to develop new high-resolution biomedical microdevices to sense magnetic fields from cardiac tissue, nerves, spinal cord, or the brain.
Aligning Optical Fibers by Means of Actuated MEMS Wedges
NASA Technical Reports Server (NTRS)
Morgan, Brian; Ghodssi, Reza
2007-01-01
Microelectromechanical systems (MEMS) of a proposed type would be designed and fabricated to effect lateral and vertical alignment of optical fibers with respect to optical, electro-optical, optoelectronic, and/or photonic devices on integrated circuit chips and similar monolithic device structures. A MEMS device of this type would consist of a pair of oppositely sloped alignment wedges attached to linear actuators that would translate the wedges in the plane of a substrate, causing an optical fiber in contact with the sloping wedge surfaces to undergo various displacements parallel and perpendicular to the plane. In making it possible to accurately align optical fibers individually during the packaging stages of fabrication of the affected devices, this MEMS device would also make it possible to relax tolerances in other stages of fabrication, thereby potentially reducing costs and increasing yields. In a typical system according to the proposal (see Figure 1), one or more pair(s) of alignment wedges would be positioned to create a V groove in which an optical fiber would rest. The fiber would be clamped at a suitable distance from the wedges to create a cantilever with a slight bend to push the free end of the fiber gently to the bottom of the V groove. The wedges would be translated in the substrate plane by amounts Dx1 and Dx2, respectively, which would be chosen to move the fiber parallel to the plane by a desired amount Dx and perpendicular to the plane by a desired amount Dy. The actuators used to translate the wedges could be variants of electrostatic or thermal actuators that are common in MEMS.
Uncertainty quantification in capacitive RF MEMS switches
NASA Astrophysics Data System (ADS)
Pax, Benjamin J.
Development of radio frequency micro electrical-mechanical systems (RF MEMS) has led to novel approaches to implement electrical circuitry. The introduction of capacitive MEMS switches, in particular, has shown promise in low-loss, low-power devices. However, the promise of MEMS switches has not yet been completely realized. RF-MEMS switches are known to fail after only a few months of operation, and nominally similar designs show wide variability in lifetime. Modeling switch operation using nominal or as-designed parameters cannot predict the statistical spread in the number of cycles to failure, and probabilistic methods are necessary. A Bayesian framework for calibration, validation and prediction offers an integrated approach to quantifying the uncertainty in predictions of MEMS switch performance. The objective of this thesis is to use the Bayesian framework to predict the creep-related deflection of the PRISM RF-MEMS switch over several thousand hours of operation. The PRISM switch used in this thesis is the focus of research at Purdue's PRISM center, and is a capacitive contacting RF-MEMS switch. It employs a fixed-fixed nickel membrane which is electrostatically actuated by applying voltage between the membrane and a pull-down electrode. Creep plays a central role in the reliability of this switch. The focus of this thesis is on the creep model, which is calibrated against experimental data measured for a frog-leg varactor fabricated and characterized at Purdue University. Creep plasticity is modeled using plate element theory with electrostatic forces being generated using either parallel plate approximations where appropriate, or solving for the full 3D potential field. For the latter, structure-electrostatics interaction is determined through immersed boundary method. A probabilistic framework using generalized polynomial chaos (gPC) is used to create surrogate models to mitigate the costly full physics simulations, and Bayesian calibration and forward propagation of uncertainty are performed using this surrogate model. The first step in the analysis is Bayesian calibration of the creep related parameters. A computational model of the frog-leg varactor is created, and the computed creep deflection of the device over 800 hours is used to generate a surrogate model using a polynomial chaos expansion in Hermite polynomials. Parameters related to the creep phenomenon are calibrated using Bayesian calibration with experimental deflection data from the frog-leg device. The calibrated input distributions are subsequently propagated through a surrogate gPC model for the PRISM MEMS switch to produce probability density functions of the maximum membrane deflection of the membrane over several thousand hours. The assumptions related to the Bayesian calibration and forward propagation are analyzed to determine the sensitivity to these assumptions of the calibrated input distributions and propagated output distributions of the PRISM device. The work is an early step in understanding the role of geometric variability, model uncertainty, numerical errors and experimental uncertainties in the long-term performance of RF-MEMS.
Microelectromechanical Systems and Nephrology: The Next Frontier in Renal Replacement Technology
Kim, Steven; Roy, Shuvo
2013-01-01
Microelectromechanical systems (MEMS) is playing a prominent role in the development of many new and innovative biomedical devices, but remains a relatively underutilized technology in nephrology. The future landscape of clinical medicine and research will only see further expansion of MEMS based technologies in device designs and applications. The enthusiasm stems from the ability to create small-scale device features with high precision in a cost effective manner. MEMS also offers the possibility to integrate multiple components into a single device. The adoption of MEMS has the potential to revolutionize how nephrologists manage kidney disease by improving the delivery of renal replacement therapies and enhancing the monitoring of physiologic parameters. To introduce nephrologists to MEMS, this review will first define relevant terms and describe the basic processes used to fabricate MEMS devices. Next, a survey of MEMS devices being developed for various biomedical applications will be illustrated with current examples. Finally, MEMS technology specific to nephrology will be highlighted and future applications will be examined. The adoption of MEMS offers novel avenues to improve the care of kidney disease patients and assist nephrologists in clinical practice. This review will serve as an introduction for nephrologists to the exciting world of MEMS. PMID:24206604
Sources of stress gradients in electrodeposited Ni MEMS.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Hearne, Sean Joseph; Floro, Jerrold Anthony; Dyck, Christopher William
2004-06-01
The ability of future integrated metal-semiconductor micro-systems such as RF MEMS to perform highly complex functions will depend on developing freestanding metal structures that offer improved conductivity and reflectivity over polysilicon structures. For example, metal-based RF MEMS technology could replace the bulky RF system presently used in communications, navigation, and avionics systems. However, stress gradients that induce warpage of active components have prevented the implementation of this technology. Figure 1, is an interference micrograph image of a series of cantilever beams fabricated from electrodeposited Ni. The curvature in the beams was the result of stress gradients intrinsic to the electrodepositionmore » process. To study the sources of the stress in electrodeposition of Ni we have incorporated a wafer curvature based stress sensor, the multibeam optical stress sensor, into an electrodeposition cell. We have determined that there are two regions of stress induced by electrodepositing Ni from a sulfamate-based bath (Fig 2). The stress evolution during the first region, 0-1000{angstrom}, was determined to be dependent only on the substrate material (Au vs. Cu), whereas the stress evolution during the second region, >1000{angstrom}, was highly dependent on the deposition conditions. In this region, the stress varied from +0.5 GPa to -0.5GPa, depending solely on the deposition rate. We examined four likely sources for the compressive intrinsic stress, i.e. reduction in tensile stress, and determined that only the adatom diffusion into grain boundaries model of Sheldon, et al. could account for the observed compressive stress. In the presentation, we shall discuss the compressive stress generation mechanisms considered and the ramifications of these results on fabrication of electrodeposited Ni for MEMS applications.« less
NASA Astrophysics Data System (ADS)
Xereas, George; Chodavarapu, Vamsy P.
2014-03-01
Frequency references are used in almost every modern electronic device including mobile phones, personal computers, and scientific and medical instrumentation. With modern consumer mobile devices imposing stringent requirements of low cost, low complexity, compact system integration and low power consumption, there has been significant interest to develop batch-manufactured MEMS resonators. An important challenge for MEMS resonators is to match the frequency and temperature stability of quartz resonators. We present 1MHz and 20MHz temperature compensated Free-Free beam MEMS resonators developed using PolyMUMPS, which is a commercial multi-user process available from MEMSCAP. We introduce a novel temperature compensation technique that enables high frequency stability over a wide temperature range. We used three strategies: passive compensation by using a structural gold (Au) layer on the resonator, active compensation through using a heater element, and a Free-Free beam design that minimizes the effects of thermal mismatch between the vibrating structure and the substrate. Detailed electro-mechanical simulations were performed to evaluate the frequency response and Quality Factor (Q). Specifically, for the 20MHz device, a Q of 10,000 was obtained for the passive compensated design. Finite Element Modeling (FEM) simulations were used to evaluate the Temperature Coefficient of frequency (TCf) of the resonators between -50°C and 125°C which yielded +0.638 ppm/°C for the active compensated, compared to -1.66 ppm/°C for the passively compensated design and -8.48 ppm/°C for uncompensated design for the 20MHz device. Electro-thermo-mechanical simulations showed that the heater element was capable of increasing the temperature of the resonators by approximately 53°C with an applied voltage of 10V and power consumption of 8.42 mW.
Ku to V-band 4-bit MEMS phase shifter bank using high isolation SP4T switches and DMTL structures
NASA Astrophysics Data System (ADS)
Dey, Sukomal; Koul, Shiban K.; Poddar, Ajay K.; Rohde, Ulrich L.
2017-10-01
This work presents a micro-electro-mechanical system (MEMS) based on a wide-band 4-bit phase shifter using two back-to-back single-pole-four-throw (SP4T) switches and four different distributed MEMS transmission line (DMTL) structures that are implemented on 635 µm alumina substrate using surface micromachining process. An SP4T switch is designed with a series-shunt configuration and it demonstrates an average return loss of >17 dB, an insertion loss of <1.97 dB and maximum isolation of >28 dB up to 60 GHz. A maximum area of the SP4T switch is ~0.76 mm2. Single-pole-single-throw and SP4T switches are capable of handling 1 W of radio frequency (RF) power up to >100 million cycles at 25° C; they can even sustained up to >70 million cycles with 1 W at 85 °C. The proposed wide-band phase shifter works at 17 GHz (Ku-band), 25 GHz (K-band), 35 GHz (Ka-band) and 60 GHz (V-band) frequencies. Finally,a 4-bit phase shifter demonstrates an average insertion loss of <6 dB, return loss of >10 dB and maximum phase error of ~3.8° at 60 GHz frequency over 500 MHz bandwidth. Total area of the fabricated device is ~11 mm2. In addition, the proposed device works well up to >107 cycles with 1 W of RF power. To the best of the author’s knowledge, this is the best reported wide-band MEMS 4-bit phase shifter in the literature that works with a constant resolution.
NASA Astrophysics Data System (ADS)
Jang, Min-Woo
Power dissipation is a key factor for mobile devices and other low power applications. Complementary metal oxide semiconductor (CMOS) is the dominant integrated circuit (IC) technology responsible for a large part of this power dissipation. As the minimum feature size of CMOS devices enters into the sub 50 nanometer (nm) regime, power dissipation becomes much worse due to intrinsic physical limits. Many approaches have been studied to reduce power dissipation of deeply scaled CMOS ICs. One possible candidate is the electrostatic electromechanical switch, which could be fabricated with conventional CMOS processing techniques. They have critical advantages compared to CMOS devices such as almost zero standby leakage in the off-state due to the absence of a pn junction and a gate oxide, as well as excellent drive current in the on-state due to a metallic channel. Despite their excellent standby power dissipation, the electrostatic MEMS/NEMS switches have not been considered as a viable replacement for CMOS devices due to their large mechanical delay. Moreover, previous literature reveals that their pull-in voltage and switching speed are strongly proportional to each other. This reduces their potential advantage. However, in this work, we theoretically and experimentally demonstrated that the use of single-walled carbon nanotube (SWNT) with very low mass density and strong mechanical properties could provide a route to move off of the conventional trend with respect to the pull-in voltage / switching speed tradeoff observed in the literature. We fabricated 2-terminal fixed- beam switches with aligned composite SWNT thin films. In this work, layer-by-layer (LbL) self-assembly and dielectrophoresis were selected for aligned-composite SWNT thin film deposition. The dense membranes were successfully patterned to form submicron beams by e-beam lithography and oxygen plasma etching. Fixed-fixed beam switches using these membranes successfully operated with approximately 600 psec switching delay and as low as a 3 V dc pull-in. From this we confirmed that the SWNT-based thin films have the potential to make fast MEMS switches with a low operation voltage due to its low mass density and high stiffness. However, the copolymer caused a serious reliability issue and a copolymer-free SWNT film deposition method was developed by replacing positive copolymer with a dispersion of positively functionalized SWNTs. The electrical and physical properties of pure single-walled carbon nanotube thin films deposited through a copolymer-free LbL self-assembly process are then discussed. The film thickness was proportional to the number of dipping cycles. The film resistivity was estimated as 2.19x10-3 Ω-cm after thermal treatments were performed. The estimated specific contact resistance to gold electrodes was 6.33x10-9 Ω-m2 from contact chain measurements. The fabricated 3-terminal MEMS switches using these films functioned as a beam for multiple switching cycles with a 4.5V pull-in voltage, which was operated like a 2-input NAND gate. The SWNT-based thin film switch is promising for a variety of applications to high-end nanoelectronics and high- performance MEMS/NEMS.
Charging and breakdown in amorphous dielectrics: Phenomenological modeling approach and applications
NASA Astrophysics Data System (ADS)
Palit, Sambit
Amorphous dielectrics of different thicknesses (nm to mm) are used in various applications. Low temperature processing/deposition of amorphous thin-film dielectrics often result in defect-states or electronic traps. These traps are responsible for increased leakage currents and bulk charge trapping in many associated applications. Additional defects may be generated during regular usage, leading to electrical breakdown. Increased leakage currents, charge trapping and defect generation/breakdown are important and pervasive reliability concerns in amorphous dielectrics. We first explore the issue of charge accumulation and leakage in amorphous dielectrics. Historically, charge transport in amorphous dielectrics has been presumed, depending on the dielectric thickness, to be either bulk dominated (Frenkel-Poole (FP) emission) or contact dominated (Fowler-Nordheim tunneling). We develop a comprehensive dielectric charging modeling framework which solves for the transient and steady state charge accumulation and leakage currents in an amorphous dielectric, and show that for intermediate thickness dielectrics, the conventional assumption of FP dominated current transport is incorrect, and may lead to false extraction of dielectric parameters. We propose an improved dielectric characterization methodology based on an analytical approximation of our model. Coupled with ab-initio computed defect levels, the dielectric charging model explains measured leakage currents more accurately with lesser empiricism. We study RF-MEMS capacitive switches as one of the target applications of intermediate thickness amorphous dielectrics. To achieve faster analysis and design of RF-MEMS switches in particular, and electro-mechanical actuators in general, we propose a set of fundamental scaling relationships which are independent of specific physical dimensions and material properties; the scaling relationships provide an intrinsic classification of all electro-mechanical actuators. However, RF-MEMS capacitive switches are plagued by the reliability issue of temporal shifts of actuation voltages due to dielectric charge accumulation, often resulting in failure due to membrane stiction. Using the dielectric charging model, we show that in spite of unpredictable roughness of deposited dielectrics, there are predictable shifts in actuation voltages due to dielectric charging in RF-MEMS switches. We also propose a novel non-obtrusive, non-contact, fully electronic resonance based technique to characterize charging driven actuation shifts in RF-MEMS switches which overcomes limitations in conventionally used methods. Finally, we look into the issue of defect generation and breakdown in thick polymer dielectrics. Polymer materials often face premature electrical breakdown due to high electric fields and frequencies, and exposure to ambient humidity conditions. Using a field-driven correlated defect generation model, coupled with a model for temperature rise due to dielectric heating at AC stresses, we explain measured trends in time-to-breakdown and breakdown electric fields in polymer materials. Using dielectric heating we are able to explain the observed lifetime and dielectric strength reduction with increasing dielectric thicknesses. Performing lifetime measurements after exposure to controlled humidity conditions, we find that moisture ingress into a polymer material reduces activation barriers for chain breakage and increases dielectric heating. Overall, this thesis develops a comprehensive framework of dielectric charging, leakage and degradation of insulators of different thicknesses that have broad applications in multiple technologies.
Core/shell CuO/Al Nanorods Thermite Film Based on Electrochemical Anodization.
Yu, Chunpei; Zhang, Wenchao; Hu, Bin; Ni, Debin; Zheng, Zilong; Liu, Jingping; Ma, Kefeng; Ren, Wei
2018-06-13
In this study, a new method was reported for the fabrication of the nanostructured CuO/Al thermite film on the Cu substrate. The CuO nanorods (NRs) arrays vertically grew from the Cu surfaces by electrochemical anodization processes, followed by the deposition of an Al layer on the CuO NRs via magnetron sputtering to form a core/shell CuO/Al nanothermite film, whose component, structure and morphology were subsequently characterized. In addition, the energy-release characteristics of the obtained nanothermite film was investigated using thermal analyses and laser ignition tests. All evidences demonstrate that the obtained CuO/Al is of a uniform structure and superb energy performance. Impressively, this resulted material is potentially useful in the applications of functional energetic chips due to its easy integration with microelectromechanical systems (MEMS) technologies. © 2018 IOP Publishing Ltd.
System Model for MEMS based Laser Ultrasonic Receiver
NASA Technical Reports Server (NTRS)
Wilson, William C.
2002-01-01
A need has been identified for more advanced nondestructive Evaluation technologies for assuring the integrity of airframe structures, wiring, etc. Laser ultrasonic inspection instruments have been shown to detect flaws in structures. However, these instruments are generally too bulky to be used in the confined spaces that are typical of aerospace vehicles. Microsystems technology is one key to reducing the size of current instruments and enabling increased inspection coverage in areas that were previously inaccessible due to instrument size and weight. This paper investigates the system modeling of a Micro OptoElectroMechanical System (MOEMS) based laser ultrasonic receiver. The system model is constructed in software using MATLAB s dynamical simulator, Simulink. The optical components are modeled using geometrical matrix methods and include some image processing. The system model includes a test bench which simulates input stimuli and models the behavior of the material under test.
Micromachined fragment capturer for biomedical applications.
Choi, Young-Soo; Lee, Dong-Weon
2011-11-01
Due to changes in modern diet, a form of heart disease called chronic total occlusion has become a serious disease to be treated as an emergency. In this study, we propose a micromachined capturer that is designed and fabricated to collect plaque fragments generated during surgery to remove the thrombus. The fragment capturer consists of a plastic body made by rapid prototyping, SU-8 mesh structures using MEMS techniques, and ionic polymer metal composite (IPMC) actuators. An array of IPMC actuators combined with the SU-8 net structure was optimized to effectively collect plaque fragments. The evaporation of solvent through the actuator's surface was prevented using a coating of SU-8 and polydimethylsiloxane thin film on the actuator. This approach improved the available operating time of the IPMC, which primarily depends on solvent loss. Our preliminary results demonstrate the possibility of using the capturer for biomedical applications. © 2011 American Institute of Physics
NASA Astrophysics Data System (ADS)
Chung, Gwiy-Sang; Choi, Sung-Kyu; Nam, Hoy-Duck
2001-10-01
This paper presents the optimized design, fabrication and thermal characteristics of micro-heaters for thermal MEMS (micro electro mechanical system) applications using SDB and SOI membranes and trench structures. The micro-heater is based on a thermal measurement principle and contains for thermal isolation regions a 10 micrometers thick Si membrane with oxide-filled trenches in the SOI membrane rim. The micro- heater was fabricated with Pt-RTD on the same substrate by using MgO as medium layer. The thermal characteristics of the micro-heater with the SOI membrane is 280 degree(s)C at input power 0.9 W; for the SOI membrane with 10 trenches, it is 580 degree(s)C due to reduction of the external thermal loss. Consequently, the micro-heater with trenches in SOI membrane rim provides a powerful and versatile alternative technology for improving the performance of micro-thermal sensors and actuators.
Micromechanical die attachment surcharge
Filter, William F.; Hohimer, John P.
2002-01-01
An attachment structure is disclosed for attaching a die to a supporting substrate without the use of adhesives or solder. The attachment structure, which can be formed by micromachining, functions purely mechanically in utilizing a plurality of shaped pillars (e.g. round, square or polygonal and solid, hollow or slotted) that are formed on one of the die or supporting substrate and which can be urged into contact with various types of mating structures including other pillars, a deformable layer or a plurality of receptacles that are formed on the other of the die or supporting substrate, thereby forming a friction bond that holds the die to the supporting substrate. The attachment structure can further include an alignment structure for precise positioning of the die and supporting substrate to facilitate mounting the die to the supporting substrate. The attachment structure has applications for mounting semiconductor die containing a microelectromechanical (MEM) device, a microsensor or an integrated circuit (IC), and can be used to form a multichip module. The attachment structure is particularly useful for mounting die containing released MEM devices since these devices are fragile and can otherwise be damaged or degraded by adhesive or solder mounting.
1983-12-01
MAIN OEG=NFGVB1.3266P //COPY PEOC EILE=, MEM = // EXEC PGM=IEBGENEB //SISPRINT DD SYSOUT=A //SYSIN DC DÖMMY //SYS0T1 DD...COE*,FILE=1, MEM =FL027 // EXEC COPY,FILE=2,HEM=A411IN // EXEC COEY,FILE=3, MEM =VWIN // EXEC COPY,FILE = 4, MEM =A411A01...EXEC C0EY,FILE=5,MEä=INTERE // EXEC COPY,FILE=6, MEM =A411PS // EXEC COEY,FILE=7, MEM =A411P1 // EXEC COPY,FILE
Micro hot embossing for high-aspect-ratio structure with materials flow enhancement by polymer sheet
NASA Astrophysics Data System (ADS)
Murakoshi, Yoichi; Shan, Xue-Chuan; Sano, Toshio; Takahashi, Masaharu; Maeda, Ryutaro
2004-04-01
Nano imprinting or Nano embossing process have been introduced to fabricate semiconductor, optical device and Micro Electro Mechanical Systems (MEMS) and the Nano Electro Mechanical Systems (NEMS) to reduce the fabrication cost. In our previous paper, micro hot embossing of Polycarbonate (PC) and Polyetheretherketone (PEEK) for optical switch with 8x8 mirrors was reported. The PC and PEEK sheets were embossed at elevated temperature with an embossing machine designed for the MEMS. In the application, the mirrors on the optical switch had some defects, such as slump, sticking and step at side of the mirror, due to embossing process and process conditions. These defects are attributed to the poor materials flow of plastics into the e Ni mold cavity of complicate shape with different aspect ratio. Therefore, the micro hot embossing is optimized in this paper with PTFE sheet to enhance the materials flow. In this paper, the PC and the PEEK sheets, thickness of 300um, are embossed at elevated temperature with the hot embossing machine with a Nickel mold. To control material flow of the PC or the PEEK sheets, Polytetrafluoroethylene (PTFE) sheet, the thickness of 100um, is placed on the PC or the PEEK sheets at elevated temperature. Mirror shape was transferred with better fidelity on the PC and PEEK sheet, and the thickness of cantilever became thinner than previous embossed structure without the PTFE. Especially, the mirror height and the thickness of cantilever on the PC have been improved at lower embossing temperature.
Mbao, V; Berkvens, D; Dolan, T; Speybroeck, N; Brandt, J; Dorny, P; Van den Bossche, P; Marcotty, T
2006-09-01
Theileria parva sporozoite stabilates are used for immunizing cattle against East Coast fever and in in vitro sporozoite neutralization assays. In this study, we attempted to identify a cheaper freezing medium and quantified the infectivity loss of sporozoites due to refreezing of stabilates, using an in vitro technique. Pools of stabilates prepared using Minimum Essential Medium (MEM), Roswell Park Memorial Institute (RPMI 1640), foetal calf serum (FCS) and phosphate-buffered saline (PBS) were compared. All were supplemented with bovine serum albumin except the FCS. RPMI 1640 was as effective as MEM in maintaining sporozoite infectivity while the infectivity in PBS and FCS reached only 59% and 67%, respectively. In a second experiment, a stabiiate based on MEM was subjected to several freeze-thaw cycles including various holding times on ice between thawing and refreezing. Refrozen stabilate gave an average sporozoite infectivity loss of 35% per cycle. The results indicate that RPMI can be used as a cheaper freezing medium for T. parva stabilates and that refrozen stabilate doses need to be adjusted for the 35% loss of infectivity.
Experimental Investigation and Modeling of Scale Effects in Micro Jet Pumps
NASA Astrophysics Data System (ADS)
Gardner, William Geoffrey
2011-12-01
Since the mid-1990s there has been an active effort to develop hydrocarbon-fueled power generation and propulsion systems on the scale of centimeters or smaller. This effort led to the creation and expansion of a field of research focused around the design and reduction to practice of Power MEMS (microelectromechanical systems) devices, beginning first with microscale jet engines and a generation later more broadly encompassing MEMS devices which generate power or pump heat. Due to small device scale and fabrication techniques, design constraints are highly coupled and conventional solutions for device requirements may not be practicable. This thesis describes the experimental investigation, modeling and potential applications for two classes of microscale jet pumps: jet ejectors and jet injectors. These components pump fluids with no moving parts and can be integrated into Power MEMS devices to satisfy pumping requirements by supplementing or replacing existing solutions. This thesis presents models developed from first principles which predict losses experienced at small length scales and agree well with experimental results. The models further predict maximum achievable power densities at the onset of detrimental viscous losses.
DOE Office of Scientific and Technical Information (OSTI.GOV)
MANI,SEETHAMBAL S.; FLEMING,JAMES G.; WALRAVEN,JEREMY A.
Two major problems associated with Si-based MEMS (MicroElectroMechanical Systems) devices are stiction and wear. Surface modifications are needed to reduce both adhesion and friction in micromechanical structures to solve these problems. In this paper, the authors present a CVD (Chemical Vapor Deposition) process that selectively coats MEMS devices with tungsten and significantly enhances device durability. Tungsten CVD is used in the integrated-circuit industry, which makes this approach manufacturable. This selective deposition process results in a very conformal coating and can potentially address both stiction and wear problems confronting MEMS processing. The selective deposition of tungsten is accomplished through the siliconmore » reduction of WF{sub 6}. The self-limiting nature of the process ensures consistent process control. The tungsten is deposited after the removal of the sacrificial oxides to minimize stress and process integration problems. The tungsten coating adheres well and is hard and conducting, which enhances performance for numerous devices. Furthermore, since the deposited tungsten infiltrates under adhered silicon parts and the volume of W deposited is less than the amount of Si consumed, it appears to be possible to release adhered parts that are contacted over small areas such as dimples. The wear resistance of tungsten coated parts has been shown to be significantly improved by microengine test structures.« less
Optimizing Pt/TiO2 templates for textured PZT growth and MEMS devices
NASA Astrophysics Data System (ADS)
Potrepka, Daniel; Fox, Glenn; Sanchez, Luz; Polcawich, Ronald
2013-03-01
Crystallographic texture of lead zirconate titanate (PZT) thin films strongly influences piezoelectric properties used in MEMS applications. Textured growth can be achieved by relying on crystal growth habit and can also be initiated by the use of a seed-layer heteroepitaxial template. Template choice and the process used to form it determine structural quality, ultimately influencing performance and reliability of MEMS PZT devices such as switches, filters, and actuators. This study focuses on how 111-textured PZT is generated by a combination of crystal habit and templating mechanisms that occur in the PZT/bottom-electrode stack. The sequence begins with 0001-textured Ti deposited on thermally grown SiO2 on a Si wafer. The Ti is converted to 100-textured TiO2 (rutile) through thermal oxidation. Then 111-textured Pt can be grown to act as a template for 111-textured PZT. Ti and Pt are deposited by DC magnetron sputtering. TiO2 and Pt film textures and structure were optimized by variation of sputtering deposition times, temperatures and power levels, and post-deposition anneal conditions. The relationship between Ti, TiO2, and Pt texture and their impact on PZT growth will be presented. Also affiliated with U.S. Army Research Lab, Adelphi, MD 20783, USA
Drive-level dependence of doubly rotated langasite resonators with different configurations.
Zhang, Haifeng; Kosinski, John; Xie, Yuan; Turner, Joseph
2013-05-01
The miniaturization of crystal resonators and filters toward the micro electromechanical systems (MEMS) and nano-structured scales demands improvement of nonlinear piezoelectricity theory and a better understanding of the nonlinear behavior of new crystal materials. The nonlinearities affect the quality factor and acoustic behavior of MEMS and nano-structured resonators and filters. Among these nonlinear effects, drive-level dependence (DLD), which describes the instability of the resonator frequency resulting from voltage level and/or power density, is a potentially significant problem for miniaturized resonators. Langasite, a promising new piezoelectric material, is of current interest for a variety of applications because of its good temperature behavior, good piezoelectric coupling, low acoustic loss, and high Q-factor. It has been recently used to make high-temperature MEMS. In this paper, we report experimental measurements of the DLD of langasite resonators with different resonator configurations (plano-plano, single bevel, and double bevel). The results show that the resonator configuration affects the DLD of the langasite resonator. The DLD measurement results for langasite are compared with literature values for quartz, langaniste, and langatate, and with additional new measurements for a GaPO4 resonator of type R-30 (-11.1° rotated Y-cut). Uncertainty analysis for the measured drive-level sensitivity is performed as well.
In vitro degradation of ZM21 magnesium alloy in simulated body fluids.
Witecka, Agnieszka; Bogucka, Aleksandra; Yamamoto, Akiko; Máthis, Kristián; Krajňák, Tomáš; Jaroszewicz, Jakub; Święszkowski, Wojciech
2016-08-01
In vitro degradation behavior of squeeze cast (CAST) and equal channel angular pressed (ECAP) ZM21 magnesium alloy (2.0wt% Zn-0.98wt% Mn) was studied using immersion tests up to 4w in three different biological environments. Hanks' Balanced Salt Solution (Hanks), Earle's Balanced Salt Solution (Earle) and Eagle minimum essential medium supplemented with 10% (v/v) fetal bovine serum (E-MEM+10% FBS) were used to investigate the effect of carbonate buffer system, organic compounds and material processing on the degradation behavior of the ZM21 alloy samples. Corrosion rate of the samples was evaluated by their Mg(2+) ion release, weight loss and volume loss. In the first 24h, the corrosion rate sequence of the CAST samples was as following: Hanks>E-MEM+10% FBS>Earle. However, in longer immersion periods, the corrosion rate sequence was Earle>E-MEM+10% FBS≥Hanks. Strong buffering effect provided by carbonate buffer system helped to maintain the pH avoiding drastic increase of the corrosion rate of ZM21 in the initial stage of immersion. Organic compounds also contributed to maintain the pH of the fluid. Moreover, they adsorbed on the sample surface and formed an additional barrier on the insoluble salt layer, which was effective to retard the corrosion of CAST samples. In case of ECAP, however, this effect was overcome by the occurrence of strong localized corrosion due to the lower pH of the medium. Corrosion of ECAP samples was much greater than that of CAST, especially in Hanks, due to higher sensitivity of ECAP to localized corrosion and the presence of Cl(-). The present work demonstrates the importance of using an appropriate solution for a reliable estimation of the degradation rate of Mg-base degradable implants in biological environments, and concludes that the most appropriate solution for this purpose is E-MEM+10% FBS, which has the closest chemical composition to human blood plasma. Copyright © 2016 Elsevier B.V. All rights reserved.
NASA Astrophysics Data System (ADS)
Nakamachi, Eiji; Koga, Hirotaka; Morita, Yusuke; Yamamoto, Koji; Sakamoto, Hidetoshi
2018-01-01
We developed a PC12 cell trapping and patterning device by combining the dielectrophoresis (DEP) methodology and the micro electro mechanical systems (MEMS) technology for time-lapse observation of morphological change of nerve network to elucidate the generation mechanism of neural network. We succeeded a neural network generation, which consisted of cell body, axon and dendrites by using tetragonal and hexagonal cell patterning. Further, the time laps observations was carried out to evaluate the axonal extension rate. The axon extended in the channel and reached to the target cell body. We found that the shorter the PC12 cell distance, the less the axonal connection time in both tetragonal and hexagonal structures. After 48 hours culture, a maximum success rate of network formation was 85% in the case of 40 μm distance tetragonal structure.
NASA Astrophysics Data System (ADS)
Othman, Muhammad A.; Sabry, Yasser M.; Sadek, Mohamed; Nassar, Ismail M.; Khalil, Diaa A.
2016-03-01
In this work we report a novel optical MEMS deeply-etched mirror with metallic coating and vertical slot, where the later allows reflection and transmission by the micromirror. The micromirror as well as fiber grooves are fabricated using deep reactive ion etching technology, where the optical axis is in-plane and the components are self-aligned. The etching depth is 150 μm chosen to improve the micromirror optical throughput. The vertical optical structure is Al metal coated using the shadow mask technique. A fiber-coupled Fabry-Pérot filter is successfully realized using the fabricated structure. Experimental measurements were obtained based on a dielectric-coated optical fiber inserted into a fiber groove facing the slotted micromirror. A versatile performance in terms of the free spectral range and 3-dB bandwidth is achieved.
Design and Simulation of an Electrothermal Actuator Based Rotational Drive
NASA Astrophysics Data System (ADS)
Beeson, Sterling; Dallas, Tim
2008-10-01
As a participant in the Micro and Nano Device Engineering (MANDE) Research Experience for Undergraduates program at Texas Tech University, I learned how MEMS devices operate and the limits of their operation. Using specialized AutoCAD-based design software and the ANSYS simulation program, I learned the MEMS fabrication process used at Sandia National Labs, the design limitations of this process, the abilities and drawbacks of micro devices, and finally, I redesigned a MEMS device called the Chevron Torsional Ratcheting Actuator (CTRA). Motion is achieved through electrothermal actuation. The chevron (bent-beam) actuators cause a ratcheting motion on top of a hub-less gear so that as voltage is applied the CTRA spins. The voltage applied needs to be pulsed and the frequency of the pulses determine the angular frequency of the device. The main objective was to design electromechanical structures capable of transforming the electrical signals into mechanical motion without overheating. The design was optimized using finite element analysis in ANSYS allowing multi-physics simulations of our model system.
A low-cost CMOS-MEMS piezoresistive accelerometer with large proof mass.
Khir, Mohd Haris Md; Qu, Peng; Qu, Hongwei
2011-01-01
This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive sensing material. A full Wheatstone bridge was constructed through easy wiring allowed by the three metal layers in the 0.5 μm CMOS technology. The device fabrication process consisted of a standard CMOS process for sensor configuration, and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. A bulk single-crystal silicon (SCS) substrate is included in the proof mass to increase sensor sensitivity. In device design and analysis, the self heating of the polysilicon piezoresistors and its effect to the sensor performance is also discussed. With a low operating power of 1.5 mW, the accelerometer demonstrates a sensitivity of 0.077 mV/g prior to any amplification. Dynamic tests have been conducted with a high-end commercial calibrating accelerometer as reference.
NASA Astrophysics Data System (ADS)
Varady, M. J.; McLeod, L.; Meacham, J. M.; Degertekin, F. L.; Fedorov, A. G.
2007-09-01
Portable fuel cells are an enabling technology for high efficiency and ultra-high density distributed power generation, which is essential for many terrestrial and aerospace applications. A key element of fuel cell power sources is the fuel processor, which should have the capability to efficiently reform liquid fuels and produce high purity hydrogen that is consumed by the fuel cells. To this end, we are reporting on the development of two novel MEMS hydrogen generators with improved functionality achieved through an innovative process organization and system integration approach that exploits the advantages of transport and catalysis on the micro/nano scale. One fuel processor design utilizes transient, reverse-flow operation of an autothermal MEMS microreactor with an intimately integrated, micromachined ultrasonic fuel atomizer and a Pd/Ag membrane for in situ hydrogen separation from the product stream. The other design features a simpler, more compact planar structure with the atomized fuel ejected directly onto the catalyst layer, which is coupled to an integrated hydrogen selective membrane.
Standard semiconductor packaging for high-reliability low-cost MEMS applications
NASA Astrophysics Data System (ADS)
Harney, Kieran P.
2005-01-01
Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.
Standard semiconductor packaging for high-reliability low-cost MEMS applications
NASA Astrophysics Data System (ADS)
Harney, Kieran P.
2004-12-01
Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.
NASA Astrophysics Data System (ADS)
Goshi, Noah; Castagnola, Elisa; Vomero, Maria; Gueli, Calogero; Cea, Claudia; Zucchini, Elena; Bjanes, David; Maggiolini, Emma; Moritz, Chet; Kassegne, Sam; Ricci, Davide; Fadiga, Luciano
2018-06-01
We report on a novel technology for microfabricating 3D origami-styled micro electro-mechanical systems (MEMS) structures with glassy carbon (GC) features and a supporting polymer substrate. GC MEMS devices that open to form 3D microstructures are microfabricated from GC patterns that are made through pyrolysis of polymer precursors on high-temperature resisting substrates like silicon or quartz and then transferring the patterned devices to a flexible substrate like polyimide followed by deposition of an insulation layer. The devices on flexible substrate are then folded into 3D form in an origami-fashion. These 3D MEMS devices have tunable mechanical properties that are achieved by selectively varying the thickness of the polymeric substrate and insulation layers at any desired location. This technology opens new possibilities by enabling microfabrication of a variety of 3D GC MEMS structures suited to applications ranging from biochemical sensing to implantable microelectrode arrays. As a demonstration of the technology, a neural signal recording microelectrode array platform that integrates both surface (cortical) and depth (intracortical) GC microelectrodes onto a single flexible thin-film device is introduced. When the device is unfurled, a pre-shaped shank of polyimide automatically comes off the substrate and forms the penetrating part of the device in a 3D fashion. With the advantage of being highly reproducible and batch-fabricated, the device introduced here allows for simultaneous recording of electrophysiological signals from both the brain surface (electrocorticography—ECoG) and depth (single neuron). Our device, therefore, has the potential to elucidate the roles of underlying neurons on the different components of µECoG signals. For in vivo validation of the design capabilities, the recording sites are coated with a poly(3,4-ethylenedioxythiophene)—polystyrene sulfonate—carbon nanotube composite, to improve the electrical conductivity of the electrodes and consequently the quality of the recorded signals. Results show that both µECoG and intracortical arrays were able to acquire neural signals with high-sensitivity that increased with depth, thereby verifying the device functionality.
Reliable aluminum contact formation by electrostatic bonding
NASA Astrophysics Data System (ADS)
Kárpáti, T.; Pap, A. E.; Radnóczi, Gy; Beke, B.; Bársony, I.; Fürjes, P.
2015-07-01
The paper presents a detailed study of a reliable method developed for aluminum fusion wafer bonding assisted by the electrostatic force evolving during the anodic bonding process. The IC-compatible procedure described allows the parallel formation of electrical and mechanical contacts, facilitating a reliable packaging of electromechanical systems with backside electrical contacts. This fusion bonding method supports the fabrication of complex microelectromechanical systems (MEMS) and micro-opto-electromechanical systems (MOEMS) structures with enhanced temperature stability, which is crucial in mechanical sensor applications such as pressure or force sensors. Due to the applied electrical potential of -1000 V the Al metal layers are compressed by electrostatic force, and at the bonding temperature of 450 °C intermetallic diffusion causes aluminum ions to migrate between metal layers.
NASA Astrophysics Data System (ADS)
Lenka, Manas K.; Sharma, Amit; Sharma, Jaibir; DasGupta, Amitava
2012-10-01
This paper describes the design and simulation of RF MEMS SPST shunt and SPDT shunt-shunt switches with modified coplanar waveguide (CPW) configuration for X-band and Ku-band applications exhibiting high isolation and low insertion loss. By modifying the basic CPW structure for a six-strip membrane having length 720 μm, the resonant frequency can be reduced from 33.5 GHz to 13.5 GHz with isolation as high as -30 dB(-63 dB at resonant frequency) in Ku-band. Similar results are also found in case SPST and SPDT switches with other membrane types.
Fabrication and Characterization of a CMOS-MEMS Humidity Sensor.
Dennis, John-Ojur; Ahmed, Abdelaziz-Yousif; Khir, Mohd-Haris
2015-07-10
This paper reports on the fabrication and characterization of a Complementary Metal Oxide Semiconductor-Microelectromechanical System (CMOS-MEMS) device with embedded microheater operated at relatively elevated temperatures (40 °C to 80 °C) for the purpose of relative humidity measurement. The sensing principle is based on the change in amplitude of the device due to adsorption or desorption of humidity on the active material layer of titanium dioxide (TiO2) nanoparticles deposited on the moving plate, which results in changes in the mass of the device. The sensor has been designed and fabricated through a standard 0.35 µm CMOS process technology and post-CMOS micromachining technique has been successfully implemented to release the MEMS structures. The sensor is operated in the dynamic mode using electrothermal actuation and the output signal measured using a piezoresistive (PZR) sensor connected in a Wheatstone bridge circuit. The output voltage of the humidity sensor increases from 0.585 mV to 30.580 mV as the humidity increases from 35% RH to 95% RH. The output voltage is found to be linear from 0.585 mV to 3.250 mV as the humidity increased from 35% RH to 60% RH, with sensitivity of 0.107 mV/% RH; and again linear from 3.250 mV to 30.580 mV as the humidity level increases from 60% RH to 95% RH, with higher sensitivity of 0.781 mV/% RH. On the other hand, the sensitivity of the humidity sensor increases linearly from 0.102 mV/% RH to 0.501 mV/% RH with increase in the temperature from 40 °C to 80 °C and a maximum hysteresis of 0.87% RH is found at a relative humidity of 80%. The sensitivity is also frequency dependent, increasing from 0.500 mV/% RH at 2 Hz to reach a maximum value of 1.634 mV/% RH at a frequency of 12 Hz, then decreasing to 1.110 mV/% RH at a frequency of 20 Hz. Finally, the CMOS-MEMS humidity sensor showed comparable response, recovery, and repeatability of measurements in three cycles as compared to a standard sensor that directly measures humidity in % RH.
Fabrication and Characterization of a CMOS-MEMS Humidity Sensor
Dennis, John-Ojur; Ahmed, Abdelaziz-Yousif; Khir, Mohd-Haris
2015-01-01
This paper reports on the fabrication and characterization of a Complementary Metal Oxide Semiconductor-Microelectromechanical System (CMOS-MEMS) device with embedded microheater operated at relatively elevated temperatures (40 °C to 80 °C) for the purpose of relative humidity measurement. The sensing principle is based on the change in amplitude of the device due to adsorption or desorption of humidity on the active material layer of titanium dioxide (TiO2) nanoparticles deposited on the moving plate, which results in changes in the mass of the device. The sensor has been designed and fabricated through a standard 0.35 µm CMOS process technology and post-CMOS micromachining technique has been successfully implemented to release the MEMS structures. The sensor is operated in the dynamic mode using electrothermal actuation and the output signal measured using a piezoresistive (PZR) sensor connected in a Wheatstone bridge circuit. The output voltage of the humidity sensor increases from 0.585 mV to 30.580 mV as the humidity increases from 35% RH to 95% RH. The output voltage is found to be linear from 0.585 mV to 3.250 mV as the humidity increased from 35% RH to 60% RH, with sensitivity of 0.107 mV/% RH; and again linear from 3.250 mV to 30.580 mV as the humidity level increases from 60% RH to 95% RH, with higher sensitivity of 0.781 mV/% RH. On the other hand, the sensitivity of the humidity sensor increases linearly from 0.102 mV/% RH to 0.501 mV/% RH with increase in the temperature from 40 °C to 80 °C and a maximum hysteresis of 0.87% RH is found at a relative humidity of 80%. The sensitivity is also frequency dependent, increasing from 0.500 mV/% RH at 2 Hz to reach a maximum value of 1.634 mV/% RH at a frequency of 12 Hz, then decreasing to 1.110 mV/% RH at a frequency of 20 Hz. Finally, the CMOS-MEMS humidity sensor showed comparable response, recovery, and repeatability of measurements in three cycles as compared to a standard sensor that directly measures humidity in % RH. PMID:26184204
Fabrication and analysis of radiofrequency MEMS series capacitive single-pole double-throw switch
NASA Astrophysics Data System (ADS)
Bansal, Deepak; Bajpai, Anuroop; Kumar, Prem; Kaur, Maninder; Rangra, Kamaljit
2016-10-01
A compact radiofrequency (RF) MEMS single-pole double-throw (SPDT) switch based on series capacitive configuration is proposed. The critical process parameters are analyzed to improve the fabrication process. A technique of cold-hot thermal shock for lift-off method is explored. The residual stress in the structure is quantified by lancet test structures that come out to be 51 MPa. Effect of residual stress on actuation voltage is explored, which changes its value from 24 to 22 V. Resonance frequency and switching speed of the switch are 11 kHz and 44 μs, respectively, measured using laser Doppler vibrometer. Measured bandwidth of the SPDT switch is 20 GHz (5 to 25 GHz), which is verified with finite element method simulations in high frequency structure simulator©; and an equivalent LCR circuit in advanced design system©;. Insertion loss of the switch lies in -0.1 to -0.5 dB with isolation better than -20 dB for the above-mentioned bandwidth.
NASA Astrophysics Data System (ADS)
Tapilouw, Abraham Mario; Chen, Liang-Chia; Xuan-Loc, Nguyen; Chen, Jin-Liang
2014-08-01
A Micro-electro-mechanical-system (MEMS) is a widely used component in many industries, including energy, biotechnology, medical, communications, and automotive industries. However, effective inspection systems are also needed to ensure the functional reliability of MEMS. This study developed a stroboscopic coherence scanning Interferometry (SCSI) technique for measuring key characteristics typically used as criteria in MEMS inspections. Surface profiles of MEMS both static and dynamic conditions were measured by means of coherence scanning Interferometry (CSI). Resonant frequencies of vibrating MEMS were measured by deformation of interferogram fringes for out-of-plane vibration and by image correlation for in-plane vibration. The measurement bandwidth of the developed system can be tuned up to three megahertz or higher for both in-plane and out-of-plane measurement of MEMS.
Radiation Effects in M and NEMS
2016-03-31
10.1117/12.876968 casing mobile core AFM tip Pt wire x δ a Figure 5. Proposed approach to combine single crystal silicon MEMS (Sandia) fab capabilities and form supporting structure for 2D materials (VU). 198
NASA Astrophysics Data System (ADS)
Tanaka, Shuji
2009-09-01
This special issue of the Journal of Micromechanics and Microengineering features papers selected from The 8th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2008) with the 2nd Symposium on Micro Environmental Machine Systems (μMEMS 2008). The workshop was held in Sendai, Japan on 9-12 November 2008 by Tohoku University. This is the second time that the PowerMEMS workshop has been held in Sendai, following the first workshop in 2000. Power MEMS is one of the newest categories of MEMS, which encompasses microdevices and microsystems for power generation, energy conversion and propulsion. The first concept of Power MEMS was born in the late 1990's from a MEMS-based gas turbine project at Massachusetts Institute of Technology. After that, the research and development of Power MEMS have been promoted by the strong need for compact power sources with high energy and/or power density. Since its inception, Power MEMS has expanded to include not only various MEMS-based power generators but also small energy machines and microdevices for macro power generators. Previously, the main topics of the PowerMEMS workshop were miniaturized gas turbines and micro fuel cells, but recently, energy harvesting has been the hottest topic. In 2008, energy harvesting had a 41% share in the 118 accepted regular papers. This special issue includes 19 papers on various topics. Finally, I would like to express my sincere appreciation to the members of the International Steering Committee, the Technical Program Committee, the Local Organizing Committee and financial supporters. This special issue was edited in collaboration with the staff of IOP Publishing.
NASA Astrophysics Data System (ADS)
Bieniek, T.; Janczyk, G.; Dobrowolski, R.; Wojciechowska, K.; Malinowska, A.; Panas, A.; Nieprzecki, M.; Kłos, H.
2016-11-01
This paper covers research results on development of the cantilevers beams test structures for interconnects reliability and robustness investigation. Presented results include design, modelling, simulation, optimization and finally fabrication stage performed on 4 inch Si wafers using the ITE microfabrication facility. This paper also covers experimental results from the test structures characterization.
Phase Calibration of Microphones by Measurement in the Free-field
NASA Technical Reports Server (NTRS)
Shams, Qamar A.; Bartram, Scott M.; Humphreys, William M.; Zuckewar, Allan J.
2006-01-01
Over the past several years, significant effort has been expended at NASA Langley developing new Micro-Electro-Mechanical System (MEMS)-based microphone directional array instrumentation for high-frequency aeroacoustic measurements in wind tunnels. This new type of array construction solves two challenges which have limited the widespread use of large channel-count arrays, namely by providing a lower cost-per-channel and a simpler method for mounting microphones in wind tunnels and in field-deployable arrays. The current generation of array instrumentation is capable of extracting accurate noise source location and directivity on a variety of airframe components using sophisticated data reduction algorithms [1-2]. Commercially-available MEMS microphones are condenser-type devices and have some desirable characteristics when compared with conventional condenser-type microphones. The most important advantages of MEMS microphones are their size, price, and power consumption. However, the commercially-available units suffer from certain important shortcomings. Based on experiments with array prototypes, it was found that both the bandwidth and the sound pressure limit of the microphones should be increased significantly to improve the performance and flexibility of the microphone array [3]. It was also desired to modify the packaging to eliminate unwanted Helmholtz resonance s exhibited by the commercial devices. Thus, new requirements were defined as follows: Frequency response: 100 Hz to 100 KHz (+/-3dB) Upper sound pressure limit: Design 1: 130 dB SPL (THD less than 5%) Design 2: 150-160 dB SPL (THD less than 5%) Packaging: 3.73 x 6.13 x 1.3 mm can with laser-etched lid. In collaboration with Novusonic Acoustic Innovation, NASA modified a Knowles SiSonic MEMS design to meet these new requirements. Coupled with the design of the enhanced MEMS microphones was the development of a new calibration method for simultaneously obtaining the sensitivity and phase response of the devices over their entire broadband frequency range. Traditionally, electrostatic actuators (EA) have been used to characterize air-condenser microphones; however, MEMS microphones are not adaptable to the EA method due to their construction and very small diaphragm size [4]. Hence a substitution based, free-field method was developed to calibrate these microphones at frequencies up to 80 kHz. The technique relied on the use of a random, ultrasonic broadband centrifugal sound source located in a small anechoic chamber. The free-field sensitivity (voltage per unit sound pressure) was obtained using the procedure outlined in reference 4. Phase calibrations of the MEMS microphones were derived from cross spectral phase comparisons between the reference and test substitution microphones and an adjacent and invariant grazing-incidence 1/8-inch standard microphone. The free-field calibration procedure along with representative sensitivity and phase responses for the new high-frequency MEMS microphones are presented here.
Deletion of Mecom in mouse results in early-onset spinal deformity and osteopenia.
Juneja, Subhash C; Vonica, Alin; Zeiss, Caroline; Lezon-Geyda, Kimberly; Yatsula, Bogdan; Sell, David R; Monnier, Vincent M; Lin, Sharon; Ardito, Thomas; Eyre, David; Reynolds, David; Yao, Zhenqiang; Awad, Hani A; Yu, Hongbo; Wilson, Michael; Honnons, Sylvie; Boyce, Brendan F; Xing, Lianping; Zhang, Yi; Perkins, Archibald S
2014-03-01
Recent studies have indicated a role for a MECOM allele in susceptibility to osteoporotic fractures in humans. We have generated a mutation in Mecom in mouse (termed ME(m1)) via lacZ knock-in into the upstream transcription start site for the gene, resulting in disruption of Mds1 and Mds1-Evi1 transcripts, but not of Evi1 transcripts. We demonstrate that ME(m1/m1) mice have severe kyphoscoliosis that is reminiscent of human congenital or primary kyphoscoliosis. ME(m1/m1) mice appear normal at birth, but by 2weeks, they exhibit a slight lumbar lordosis and narrowed intervertebral space. This progresses to severe lordosis with disc collapse and synostosis, together with kyphoscoliosis. Bone formation and strength testing show that ME(m1/m1) mice have normal bone formation and composition but are osteopenic. While endochondral bone development is normal, it is markedly dysplastic in its organization. Electron micrographs of the 1week postnatal intervertebral discs reveals marked disarray of collagen fibers, consistent with an inherent weakness in the non-osseous connective tissue associated with the spine. These findings indicate that lack of ME leads to a complex defect in both osseous and non-osseous musculoskeletal tissues, including a marked vertebral osteopenia, degeneration of the IVD, and disarray of connective tissues, which is likely due to an inherent inability to establish and/or maintain components of these tissues. Copyright © 2013 Elsevier Inc. All rights reserved.
Structure and Ferroelectric Properties of High Tc BiScO3-PbTiO3 Epitaxial Thin Films.
Wasa, Kiyotaka; Yoshida, Shinya; Hanzawa, Hiroaki; Adachi, Hideaki; Matsunaga, Toshiyuki; Tanaka, Shuji
2016-10-01
Piezoelectric ceramics of new composition with higher Curie temperature T c are extensively studied for better piezoelectric microelectromechanical systems (MEMS). Apart from the compositional research, enhanced T c could be achieved in a modified structure. We have considered that a designed laminated structure of Pb(Zr, Ti)O 3 (PZT)-based thin film, i.e., relaxed heteroepitaxial epitaxial thin film, is one of the promising modified structures to enhance T c . This structure exhibits an extraordinarily high T c , i.e., [Formula: see text] (bulk [Formula: see text]). In this paper, we have fabricated the designed laminated structure of high T c (1-x)BiScO 3 -xPbTiO 3 . T c of BS-0.8PT thin films was found to be extraordinarily high, i.e., [Formula: see text] (bulk T c , [Formula: see text]). Their ferroelectric performances were comparable to those of PZT-based thin films. The present BS-xPT thin films have a high potential for fabrication of high-temperature-stable piezoelectric MEMS. The mechanism of the enhanced T c is probably the presence of the mechanically stable interface to temperature in the laminated structure. We believe this designed laminated structure can extract fruitful properties of bulk ferroelectric ceramics.
Remotely accessible laboratory for MEMS testing
NASA Astrophysics Data System (ADS)
Sivakumar, Ganapathy; Mulsow, Matthew; Melinger, Aaron; Lacouture, Shelby; Dallas, Tim E.
2010-02-01
We report on the construction of a remotely accessible and interactive laboratory for testing microdevices (aka: MicroElectroMechancial Systems - MEMS). Enabling expanded utilization of microdevices for research, commercial, and educational purposes is very important for driving the creation of future MEMS devices and applications. Unfortunately, the relatively high costs associated with MEMS devices and testing infrastructure makes widespread access to the world of MEMS difficult. The creation of a virtual lab to control and actuate MEMS devices over the internet helps spread knowledge to a larger audience. A host laboratory has been established that contains a digital microscope, microdevices, controllers, and computers that can be logged into through the internet. The overall layout of the tele-operated MEMS laboratory system can be divided into two major parts: the server side and the client side. The server-side is present at Texas Tech University, and hosts a server machine that runs the Linux operating system and is used for interfacing the MEMS lab with the outside world via internet. The controls from the clients are transferred to the lab side through the server interface. The server interacts with the electronics required to drive the MEMS devices using a range of National Instruments hardware and LabView Virtual Instruments. An optical microscope (100 ×) with a CCD video camera is used to capture images of the operating MEMS. The server broadcasts the live video stream over the internet to the clients through the website. When the button is pressed on the website, the MEMS device responds and the video stream shows the movement in close to real time.
2011-05-01
wafer pair through further processing. Initial cracking issues were identified due to liquid penetration between the wafers during wet processing...free-standing MCD films we needed to address crack formation in the diamond and the Si substrate, which we observed during our initial growths due to...NCD film grown using the heated stage, and finally the thick MCD film grown on the cooled stage. We also found that the control of cracking in the
NASA Astrophysics Data System (ADS)
Sasaki, Minoru; Kumagai, Shinya
2014-03-01
The suspended MEMS structure is suitable for reducing the energy loss due to the thermal conduction. There is the possibility that IR photon energy can be well-controlled to generate some physical effects. A new method bases on the nonlinear oscillation for the detector. The thin film torsional spring exhibits a large hard spring effect when the deflection occurs in the out-of-plane direction of the film. When IR is absorbed, the resonator bends due to the thermal expansion. The torsional spring becomes harder increasing the resonant frequency. The frequency measurement is suited for the precise sensing. The device response is measured using the laser (wavelength of 650nm). The resonant frequency is 88-94kHz. Q factor is about 1600 in vacuum (1Pa). The sensitivity is -0.144[kHz/(kW/m2)]. As for the emitter, nondispersive IR gas sensor is considered. The molecules have their intrinsic absorptions. CO2 absorbs the wavelength 4.2- 4.3μm. The major incandescent light bulbs have the broad spectrum emitting IR which is not used for gas sensing. The wavelength selectivity at the gas bandwidth will improve the efficiency. A new principle uses the microheater placed facing to the grating. SPP is excited carrying IR energy on the grating surface. IR emission is the reverse process of excitation occurring at the output end. The emission spectra show SPP related peak having the width of 190nm. When the input power increases from 0.3 to 1.9W, the peak at wavelength of 3.5μm becomes clearer.
White, Hannah J; Haycraft, Emma; Wallis, Deborah J; Arcelus, Jon; Leung, Newman; Meyer, Caroline
2015-02-01
This study aimed to examine the factor structure of the Mealtime Emotions Measure for adolescents (MEM-A), a novel measure of emotional responses experienced during family mealtimes. Additionally, it examined gender differences in mealtime emotions and also the relationships between mealtime emotions and levels of eating psychopathology, when controlling for anxiety or depression. Adolescent participants (N = 527; 282 girls, 245 boys) with a mean age of 15.9 years completed the new mealtime measure for adolescents (MEM-A), in addition to questions about family mealtime atmosphere, and measures assessing symptoms of anxiety, depression, and eating psychopathology. Factor analysis produced a three factor solution for the MEM-A with two subscales relating to different types of negative mealtime emotions (Anxiety-related mealtime emotions and Anger-related mealtime emotions) and one subscale relating to Positive mealtime emotions. Generally, girls reported experiencing more Anxiety-related mealtime emotions compared to boys. Having conducted separate analyses controlling for levels of either anxiety or depression, there were several significant associations for both girls and boys between mealtime emotions, particularly Anxiety-related emotions, and eating psychopathology. The findings suggest that some mealtime emotions are associated with increased eating psychopathology. Replication and detailed examination of these emotional responses is required. Copyright © 2014 Elsevier Ltd. All rights reserved.
ZnO on nickel RF micromechanical resonators for monolithic wireless communication applications
NASA Astrophysics Data System (ADS)
Wei, Mian; Avila, Adrian; Rivera, Ivan; Baghelani, Masoud; Wang, Jing
2017-05-01
On-chip integrability of high-Q RF passives alongside CMOS transistors is crucial for the implementation of monolithic radio transceivers. One of the most significant bottlenecks in back-end-of-line (BEoL) integration of MEMS devices on CMOS processed wafers is their relatively low thermal budget, which is less than that required for typical MEMS material deposition processes. This paper investigates electroplated nickel as a structural material for piezoelectrically-transduced resonators to demonstrate ZnO-on-nickel resonators with a CMOS-compatible low temperature process for the first time. Aside from the obvious manufacturing cost benefit, electroplated nickel is a reasonable substitute for polycrystalline or single crystal silicon and thin-film microcrystalline diamond device layers, while realizing decent acoustic velocity and moderate Q. Electroplated nickel has been already adopted by MEMSCAP, a multi-user MEMS process foundry, in its MetalMUMPs process. Furthermore, it is observed that a localized annealing process through Joule heating can be exploited to significantly improve the effective mechanical quality factor for the ZnO-on-nickel resonators, which is still lower than the reported AlN resonators. This work demonstrates ZnO-on-nickel piezoelectrically-actuated MEMS resonators and resonator arrays by using an IC compatible low temperature process. There is room for performance improvement by lowering the acoustic energy losses in the ZnO and nickel layers.
Fully Integrated, Miniature, High-Frequency Flow Probe Utilizing MEMS Leadless SOI Technology
NASA Technical Reports Server (NTRS)
Ned, Alex; Kurtz, Anthony; Shang, Tonghuo; Goodman, Scott; Giemette. Gera (d)
2013-01-01
This work focused on developing, fabricating, and fully calibrating a flowangle probe for aeronautics research by utilizing the latest microelectromechanical systems (MEMS), leadless silicon on insulator (SOI) sensor technology. While the concept of angle probes is not new, traditional devices had been relatively large due to fabrication constraints; often too large to resolve flow structures necessary for modern aeropropulsion measurements such as inlet flow distortions and vortices, secondary flows, etc. Mea surements of this kind demanded a new approach to probe design to achieve sizes on the order of 0.1 in. (.3 mm) diameter or smaller, and capable of meeting demanding requirements for accuracy and ruggedness. This approach invoked the use of stateof- the-art processing techniques to install SOI sensor chips directly onto the probe body, thus eliminating redundancy in sensor packaging and probe installation that have historically forced larger probe size. This also facilitated a better thermal match between the chip and its mount, improving stability and accuracy. Further, the leadless sensor technology with which the SOI sensing element is fabricated allows direct mounting and electrical interconnecting of the sensor to the probe body. This leadless technology allowed a rugged wire-out approach that is performed at the sensor length scale, thus achieving substantial sensor size reductions. The technology is inherently capable of high-frequency and high-accuracy performance in high temperatures and harsh environments.
NASA Astrophysics Data System (ADS)
Emadi, Tahereh Arezoo; Buchanan, Douglas A.
2014-03-01
A robust capacitive micromachined ultrasonic transducer has been developed. In this novel configuration, a stack of two deflectable membranes are suspended over a fixed bottom electrode. Similar to conventional capacitive ultrasonic transducers, a generated electrostatic force between the electrodes causes the membranes to deflect and vibrate. However, in this new configuration the transducer effective cavity height is reduced due to the deflection of two membranes. Therefore, the transducer spring constant is more susceptible to bias voltage, which in return reduces the required bias voltage. The transducers have been produced employing a MEMS sacrificial technique where two different membrane anchoring (curved- and flat- anchors) structures, with similar membrane radii were fabricated. Highly doped polysilicon was used as the membrane material. The resonant frequencies of the two transducers have been investigated. It was found that the transducers with curved membrane anchors exhibits a larger resonant frequency shift compared to the transducers with flat membranes for a given bias voltage. Comparison has been made between the spring constant of the flat membrane transducer and that of a conventional single membrane transducer. It is shown that the multiple moving membrane transducer exhibits a larger reduction in the spring constant compared to the conventional transducer, when driven with the same bias voltage. This results in a transducer with a higher power generation capability and sensitivity.
NASA Astrophysics Data System (ADS)
Newberry, R.; Glauvitz, N.; Coutu, R. A.; Medvedev, I. R.; Petkie, D.
2014-03-01
Historically, spectroscopy has been a cumbersome endeavor due to the relatively large sizes (3ft - 100ft in length) of modern spectroscopy systems. Taking advantage of the photoacoustic effect would allow for much smaller absorption chambers since the photoacoustic (PA) effect is independent of the absorption path length. In order to detect the photoacoustic waves being generated, a photoacoustic microphone would be required. This paper reports on the fabrication efforts taken in order to create microelectromechanical systems (MEMS) cantilevers for the purpose of sensing photoacoustic waves generated via terahertz (THz) radiation passing through a gaseous sample. The cantilevers are first modeled through the use of the finite element modeling software, CoventorWare®. The cantilevers fabricated with bulk micromachining processes and are 7x2x0.010mm on a silicon-on-insulator (SOI) wafer which acts as the physical structure of the cantilever. The devices are released by etching through the wafer's backside and etching through the buried oxide with hydrofluoric acid. The cantilevers are placed in a test chamber and their vibration and deflection are measured via a Michelson type interferometer that reflects a laser off a gold tip evaporated onto the tip of the cantilever. The test chamber is machined from stainless steel and housed in a THz testing environment at Wright State University. Fabricated devices have decreased residual stress and larger radii of curvatures by approximately 10X.
Contact resistance evolution of highly cycled, lightly loaded micro-contacts
NASA Astrophysics Data System (ADS)
Stilson, Christopher; Coutu, Ronald
2014-03-01
Reliable microelectromechanical systems (MEMS) switches are critical for developing high performance radio frequency circuits like phase shifters. Engineers have attempted to improve reliability and lifecycle performance using novel contact metals, unique mechanical designs and packaging. Various test fixtures including: MEMS devices, atomic force microscopes (AFM) and nanoindentors have been used to collect resistance and contact force data. AFM and nanoindentor test fixtures allow direct contact force measurements but are severely limited by low resonance sensors, and therefore low data collection rates. This paper reports the contact resistance evolution results and fabrication of thin film, sputtered and evaporated gold, micro-contacts dynamically tested up to 3kHz. The upper contact support structure consists of a gold surface micromachined, fix-fix beam designed with sufficient restoring force to overcome adhesion. The hemisphere-upper and planar-lower contacts are mated with a calibrated, external load resulting in approximately 100μN of contact force and are cycled in excess of 106 times or until failure. Contact resistance is measured, in-situ, using a cross-bar configuration and the entire apparatus is isolated from external vibration and housed in an enclosure to minimize contamination due to ambient environment. Additionally, contact cycling and data collection are automated using a computer and LabVIEW. Results include contact resistance measurements of 6 and 8 μm radius contact bumps and lifetime testing up to 323.6 million cycles.
Fabrication and Characterization of a Micro Methanol Sensor Using the CMOS-MEMS Technique.
Fong, Chien-Fu; Dai, Ching-Liang; Wu, Chyan-Chyi
2015-10-23
A methanol microsensor integrated with a micro heater manufactured using the complementary metal oxide semiconductor (CMOS)-microelectromechanical system (MEMS) technique was presented. The sensor has a capability of detecting low concentration methanol gas. Structure of the sensor is composed of interdigitated electrodes, a sensitive film and a heater. The heater located under the interdigitated electrodes is utilized to provide a working temperature to the sensitive film. The sensitive film prepared by the sol-gel method is tin dioxide doped cadmium sulfide, which is deposited on the interdigitated electrodes. To obtain the suspended structure and deposit the sensitive film, the sensor needs a post-CMOS process to etch the sacrificial silicon dioxide layer and silicon substrate. The methanol senor is a resistive type. A readout circuit converts the resistance variation of the sensor into the output voltage. The experimental results show that the methanol sensor has a sensitivity of 0.18 V/ppm.
Fabrication and Characterization of a Micro Methanol Sensor Using the CMOS-MEMS Technique
Fong, Chien-Fu; Dai, Ching-Liang; Wu, Chyan-Chyi
2015-01-01
A methanol microsensor integrated with a micro heater manufactured using the complementary metal oxide semiconductor (CMOS)-microelectromechanical system (MEMS) technique was presented. The sensor has a capability of detecting low concentration methanol gas. Structure of the sensor is composed of interdigitated electrodes, a sensitive film and a heater. The heater located under the interdigitated electrodes is utilized to provide a working temperature to the sensitive film. The sensitive film prepared by the sol-gel method is tin dioxide doped cadmium sulfide, which is deposited on the interdigitated electrodes. To obtain the suspended structure and deposit the sensitive film, the sensor needs a post-CMOS process to etch the sacrificial silicon dioxide layer and silicon substrate. The methanol senor is a resistive type. A readout circuit converts the resistance variation of the sensor into the output voltage. The experimental results show that the methanol sensor has a sensitivity of 0.18 V/ppm. PMID:26512671
NASA Astrophysics Data System (ADS)
Wu, Mingching; Fang, Weileun
2005-03-01
This work integrates multi-depth DRIE etching, trench-refilled molding, two poly-Si layers MUMPs and bulk releasing to improve the variety and performance of MEMS devices. In summary, the present fabrication process, named MOSBE II, has three merits. First, this process can monolithically fabricate and integrate poly-Si thin-film structures with different thicknesses and stiffnesses, such as the flexible spring and the stiff mirror plate. Second, multi-depth structures, such as vertical comb electrodes, are available from the DRIE processes. Third, a cavity under the micromachined device is provided by the bulk silicon etching process, so that a large out-of-plane motion is allowed. In application, an optical scanner driven by the self-aligned vertical comb actuator was demonstrated. The poly-Si micromachined components fabricated by MOSBE II can further integrate with the MUMPs devices to establish a more powerful MOEMS platform.
NASA Astrophysics Data System (ADS)
Hebling, C.; Woias, P.
2008-10-01
This special issue of Journal of Micromechanics and Microengineering (JMM) contains a selection of papers from the 7th International Workshop on Micro and Nanotechnologies for Power Generation and Energy Conversion (PowerMEMS 2007). The workshop was held in Freiburg, Germany on 27-29 November 2007 under the joint organization of the Fraunhofer Institute for Solar Energy Systems (FhG-ISE), Freiburg and the Department of Microsystems Engineering (IMTEK) of the Albert-Ludwig-University of Freiburg. PowerMEMS 2007 continues a series of workshops initiated in 2000 in Japan to create an annual discussion forum in the emerging field of micro energy technology. With a single exception in 2001, the workshop has continued as an annual meeting ever since, with a continuous increase in the number of presentations and participants. The program of PowerMEMS 2007 was composed of 2 invited talks, 25 oral talks and 61 poster presentations. From these 88 presentations 16 have been selected for this special issue. It was at the end of 1959 when the Caltech physicist Richard Feynman gave his famous lecture entitled 'There Is Plenty of Room at the Bottom' in which he discussed the possibilities of miniaturization for both storage capacity ('Encyclopaedia Britannica on the head of a pin') as well as micro machining ('rearranging the atoms'), although there were absolutely no technological possibilities in sight for an adequate realization of such ideas. Now, nearly 50 years later, we not only have incredible knowledge about the nanoworld, but even more we are now able to generate microelectromechanical devices which, next to their electronic properties, can integrate physical and analytical functions. Today, Feynman might easily have added a second lecture entitled 'There is Plenty of Energy at the Bottom'. Micro energy technology has seen a tremendous rise in MEMS and material sciences and is regarded today as one of their hot topics. Also, there are more and more companies in this field trying to commercialize micro energy harvesting devices, micro thermo-photovoltaics or micro fuel cells in order to make an impact on our daily life. It is interesting to see the remarkable scientific dynamics and innovations in micro energy technology that have been mirrored in the scope of consecutive PowerMEMS workshops. Micro fuel cells, micro combustion systems and heat engines have been on-going topics from the beginning due to their promising power densities and high power levels up to hundreds of watts. At the other end of the power scale micro energy harvesting has entered the stage, with a remarkable growth rate of presentations during the last three workshops, towering over all other topics with 33 presentations at PowerMEMS 2007. Another significant trend is the slow but steady emergence of electronic energy management as a future key technology. As Guest Editors of this special issue we would like to express our appreciation to the members of the Organizing Committee and the Technical Program Committee of PowerMEMS for their on-going efforts. By selecting the research fields mentioned above they formed the PowerMEMS 2007 program as a comprehensive digest of today's micro energy technology that is reflected, along with selected high quality publications, in this special issue of JMM. We hope that this work will stimulate further innovative research in micro energy technology and will help to mark the trail for further progress in this exciting field of MEMS science and technology.
MEMS testing and applications in automotive and aerospace industries
NASA Astrophysics Data System (ADS)
Ma, Zhichun; Chen, Xuyuan
2009-05-01
MEMS technology combines micromachining and integrated circuit fabrication technologies to produce highly reliable MEMS transducers. This paper presents an overview of MEMS transducers applications, particularly in automotive and aerospace industries, which includes inertia sensors for safety, navigation, and guidance control, thermal anemometer for temperature and heat-flux sensors in engine applications, MEMS atomizers for fuel injection, and micromachined actuators for flow control applications. Design examples for the devices in above mentioned applications are also presented and test results are given.
Method for integrating microelectromechanical devices with electronic circuitry
Montague, Stephen; Smith, James H.; Sniegowski, Jeffry J.; McWhorter, Paul J.
1998-01-01
A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.
MEMS cantilever based magnetic field gradient sensor
NASA Astrophysics Data System (ADS)
Dabsch, Alexander; Rosenberg, Christoph; Stifter, Michael; Keplinger, Franz
2017-05-01
This paper describes major contributions to a MEMS magnetic field gradient sensor. An H-shaped structure supported by four arms with two circuit paths on the surface is designed for measuring two components of the magnetic flux density and one component of the gradient. The structure is produced from silicon wafers by a dry etching process. The gold leads on the surface carry the alternating current which interacts with the magnetic field component perpendicular to the direction of the current. If the excitation frequency is near to a mechanical resonance, vibrations with an amplitude within the range of 1-103 nm are expected. Both theoretical (simulations and analytic calculations) and experimental analysis have been carried out to optimize the structures for different strength of the magnetic gradient. In the same way the impact of the coupling structure on the resonance frequency and of different operating modes to simultaneously measure two components of the flux density were tested. For measuring the local gradient of the flux density the structure was operated at the first symmetrical and the first anti-symmetrical mode. Depending on the design, flux densities of approximately 2.5 µT and gradients starting from 1 µT mm-1 can be measured.
The Development of the Differential MEMS Vector Hydrophone
Zhang, Guojun; Liu, Mengran; Shen, Nixin; Wang, Xubo; Zhang, Wendong
2017-01-01
To solve the problem that MEMS vector hydrophones are greatly interfered with by the vibration of the platform and flow noise in applications, this paper describes a differential MEMS vector hydrophone that could simultaneously receive acoustic signals and reject acceleration signals. Theoretical and simulation analyses have been carried out. Lastly, a prototype of the differential MEMS vector hydrophone has been created and tested using a standing wave tube and a vibration platform. The results of the test show that this hydrophone has a high sensitivity, Mv = −185 dB (@ 500 Hz, 0 dB reference 1 V/μPa), which is almost the same as the previous MEMS vector hydrophones, and has a low acceleration sensitivity, Mv = −58 dB (0 dB reference 1 V/g), which has decreased by 17 dB compared with the previous MEMS vector hydrophone. The differential MEMS vector hydrophone basically meets the requirements of acoustic vector detection when it is rigidly fixed to a working platform, which lays the foundation for engineering applications of MEMS vector hydrophones. PMID:28594384
MEMS for pico- to micro-satellites
NASA Astrophysics Data System (ADS)
Shea, H. R.
2009-02-01
MEMS sensors, actuators, and sub-systems can enable an important reduction in the size and mass of spacecrafts, first by replacing larger and heavier components, then by replacing entire subsystems, and finally by enabling the microfabrication of highly integrated picosats. Very small satellites (1 to 100 kg) stand to benefit the most from MEMS technologies. These small satellites are typically used for science or technology demonstration missions, with higher risk tolerance than multi-ton telecommunication satellites. While MEMS are playing a growing role on Earth in safety-critical applications, in the harsh and remote environment of space, reliability is still the crucial issue, and the absence of an accepted qualification methodology is holding back MEMS from wider use. An overview is given of the range of MEMS applications in space. An effective way to prove that MEMS can operate reliably in space is to use them in space: we illustrate how Cubesats (1 kg, 1 liter, cubic satellites in a standardized format to reduce launch costs) can serve as low-cost vectors for MEMS technology demonstration in space. The Cubesat SwissCube developed in Switzerland is used as one example of a rapid way to fly new microtechnologies, and also as an example of a spacecraft whose performance is only possible thanks to MEMS.
Development of a MEMS device for acoustic emission testing
NASA Astrophysics Data System (ADS)
Ozevin, Didem; Pessiki, Stephen P.; Jain, Akash; Greve, David W.; Oppenheim, Irving J.
2003-08-01
Acoustic emission testing is an important technology for evaluating structural materials, and especially for detecting damage in structural members. Significant new capabilities may be gained by developing MEMS transducers for acoustic emission testing, including permanent bonding or embedment for superior coupling, greater density of transducer placement, and a bundle of transducers on each device tuned to different frequencies. Additional advantages include capabilities for maintenance of signal histories and coordination between multiple transducers. We designed a MEMS device for acoustic emission testing that features two different mechanical types, a hexagonal plate design and a spring-mass design, with multiple detectors of each type at ten different frequencies in the range of 100 kHz to 1 MHz. The devices were fabricated in the multi-user polysilicon surface micromachining (MUMPs) process and we have conducted electrical characterization experiments and initial experiments on acoustic emission detection. We first report on C(V) measurements and perform a comparison between predicted (design) and measured response. We next report on admittance measurements conducted at pressures varying from vacuum to atmospheric, identifying the resonant frequencies and again providing a comparison with predicted performance. We then describe initial calibration experiments that compare the performance of the detectors to other acoustic emission transducers, and we discuss the overall performance of the device as a sensor suite, as contrasted to the single-channel performance of most commercial transducers.
NASA Astrophysics Data System (ADS)
Dean, Robert; Flowers, George; Sanders, Nicole; MacAllister, Ken; Horvath, Roland; Hodel, A. S.; Johnson, Wayne; Kranz, Michael; Whitley, Michael
2005-05-01
Some harsh environments, such as those encountered by aerospace vehicles and various types of industrial machinery, contain high frequency/amplitude mechanical vibrations. Unfortunately, some very useful components are sensitive to these high frequency mechanical vibrations. Examples include MEMS gyroscopes and resonators, oscillators and some micro optics. Exposure of these components to high frequency mechanical vibrations present in the operating environment can result in problems ranging from an increased noise floor to component failure. Passive micromachined silicon lowpass filter structures (spring-mass-damper) have been demonstrated in recent years. However, the performance of these filter structures is typically limited by low damping (especially if operated in near-vacuum environments) and a lack of tunability after fabrication. Active filter topologies, such as piezoelectric, electrostrictive-polymer-film and SMA have also been investigated in recent years. Electrostatic actuators, however, are utilized in many micromachined silicon devices to generate mechanical motion. They offer a number of advantages, including low power, fast response time, compatibility with silicon micromachining, capacitive position measurement and relative simplicity of fabrication. This paper presents an approach for realizing active micromachined mechanical lowpass vibration isolation filters by integrating an electrostatic actuator with the micromachined passive filter structure to realize an active mechanical lowpass filter. Although the electrostatic actuator can be used to adjust the filter resonant frequency, the primary application is for increasing the damping to an acceptable level. The physical size of these active filters is suitable for use in or as packaging for sensitive electronic and MEMS devices, such as MEMS vibratory gyroscope chips.
Vision for Micro Technology Space Missions. Chapter 2
NASA Technical Reports Server (NTRS)
Dennehy, Neil
2005-01-01
It is exciting to contemplate the various space mission applications that Micro Electro Mechanical Systems (MEMS) technology could enable in the next 10-20 years. The primary objective of this chapter is to both stimulate ideas for MEMS technology infusion on future NASA space missions and to spur adoption of the MEMS technology in the minds of mission designers. This chapter is also intended to inform non-space oriented MEMS technologists, researchers and decision makers about the rich potential application set that future NASA Science and Exploration missions will provide. The motivation for this chapter is therefore to lead the reader down a path to identify and it is exciting to contemplate the various space mission applications that Micro Electro Mechanical Systems (MEMS) technology could enable in the next 10-20 years. The primary objective of this chapter is to both stimulate ideas for MEMS technology infusion on future NASA space missions and to spur adoption of the MEMS technology in the minds of mission designers. This chapter is also intended to inform non-space oriented MEMS technologists, researchers and decision makers about the rich potential application set that future NASA Science and Exploration missions will provide. The motivation for this chapter is therefore to lead the reader down a path to identify and consider potential long-term, perhaps disruptive or revolutionary, impacts that MEMS technology may have for future civilian space applications. A general discussion of the potential for MEMS in space applications is followed by a brief showcasing of a few selected examples of recent MEMS technology developments for future space missions. Using these recent developments as a point of departure, a vision is then presented of several areas where MEMS technology might eventually be exploited in future Science and Exploration mission applications. Lastly, as a stimulus for future research and development, this chapter summarizes a set of barriers to progress, design challenges and key issues that must be overcome in order for the community to move on, from the current nascent phase of developing and infusing MEMS technology into space missions, in order to achieve its full future potential.
A novel dual gating approach using joint inertial sensors: implications for cardiac PET imaging
NASA Astrophysics Data System (ADS)
Jafari Tadi, Mojtaba; Teuho, Jarmo; Lehtonen, Eero; Saraste, Antti; Pänkäälä, Mikko; Koivisto, Tero; Teräs, Mika
2017-10-01
Positron emission tomography (PET) is a non-invasive imaging technique which may be considered as the state of art for the examination of cardiac inflammation due to atherosclerosis. A fundamental limitation of PET is that cardiac and respiratory motions reduce the quality of the achieved images. Current approaches for motion compensation involve gating the PET data based on the timing of quiescent periods of cardiac and respiratory cycles. In this study, we present a novel gating method called microelectromechanical (MEMS) dual gating which relies on joint non-electrical sensors, i.e. tri-axial accelerometer and gyroscope. This approach can be used for optimized selection of quiescent phases of cardiac and respiratory cycles. Cardiomechanical activity according to echocardiography observations was investigated to confirm whether this dual sensor solution can provide accurate trigger timings for cardiac gating. Additionally, longitudinal chest motions originating from breathing were measured by accelerometric- and gyroscopic-derived respiratory (ADR and GDR) tracking. The ADR and GDR signals were evaluated against Varian real-time position management (RPM) signals in terms of amplitude and phase. Accordingly, high linear correlation and agreement were achieved between the reference electrocardiography, RPM, and measured MEMS signals. We also performed a Ge-68 phantom study to evaluate possible metal artifacts caused by the integrated read-out electronics including mechanical sensors and semiconductors. The reconstructed phantom images did not reveal any image artifacts. Thus, it was concluded that MEMS-driven dual gating can be used in PET studies without an effect on the quantitative or visual accuracy of the PET images. Finally, the applicability of MEMS dual gating for cardiac PET imaging was investigated with two atherosclerosis patients. Dual gated PET images were successfully reconstructed using only MEMS signals and both qualitative and quantitative assessments revealed encouraging results that warrant further investigation of this method.
Yong, Dongeun; Lee, Yangsoon; Jeong, Seok Hoon; Lee, Kyungwon
2012-01-01
Accurate detection of metallo-β-lactamase (MBL)-producing Pseudomonas spp. and Acinetobacter spp. became very important with the increasing prevalence of carbapenem-nonsusceptible clinical isolates. The performance of phenotypic MBL detection methods may depend on the types of MBL and the characteristics of the isolates. A high false-positive rate is a problem with EDTA-based MBL detection methods. We evaluated the performance of double-disk potentiation tests (DDPTs) and disk potentiation tests (DPTs) with dipicolinic acid (DPA) using 44 isolates of Pseudomonas spp. and Acinetobacter spp. producing IMP-1-like, VIM-2-like, and SIM-1 type MBLs. Also, we characterized P. aeruginosa isolates with positive imipenem (IPM)-DPA DDPT, but negative meropenem (MEM)-DPA DDPT, and determined possibility of improving a DDPT by using MacConkey agar. Among five different DDPT methods, the IPM-DPA 250-μg method showed the highest sensitivity (97.7%) and specificity (100%). Among four DPT tests, the highest sensitivity (100%) was shown by the IPM-EDTA 1,900-μg disk method, but the specificity was very low (11.4%). Five of six P. aeruginosa isolates with false-negative DDPTs with MEM-DPA 250-μg disks carried blaIMP-6, and the high level resistance to MEM (MIC ≥ 512 μg/ml) was reduced by the presence of phenylalanine arginine β-naphtylamide. Improvement of DDPTs was observed when MacConkey agar was used instead of Mueller-Hinton agar. In conclusion, DPA is a better MBL inhibitor than EDTA for detection of Pseudomonas spp. and Acinetobacter spp. with IMP-1-like, VIM-2-like, and SIM-1-type MBLs. In DPA DDPTs, IPM disks perform better than MEM disks when the isolates are highly resistant to MEM due to the overexpression of efflux pumps. PMID:22837321
Flexible MEMS: A novel technology to fabricate flexible sensors and electronics
NASA Astrophysics Data System (ADS)
Tu, Hongen
This dissertation presents the design and fabrication techniques used to fabricate flexible MEMS (Micro Electro Mechanical Systems) devices. MEMS devices and CMOS(Complementary Metal-Oxide-Semiconductor) circuits are traditionally fabricated on rigid substrates with inorganic semiconductor materials such as Silicon. However, it is highly desirable that functional elements like sensors, actuators or micro fluidic components to be fabricated on flexible substrates for a wide variety of applications. Due to the fact that flexible substrate is temperature sensitive, typically only low temperature materials, such as polymers, metals, and organic semiconductor materials, can be directly fabricated on flexible substrates. A novel technology based on XeF2(xenon difluoride) isotropic silicon etching and parylene conformal coating, which is able to monolithically incorporate high temperature materials and fluidic channels, was developed at Wayne State University. The technology was first implemented in the development of out-of-plane parylene microneedle arrays that can be individually addressed by integrated flexible micro-channels. These devices enable the delivery of chemicals with controlled temporal and spatial patterns and allow us to study neurotransmitter-based retinal prosthesis. The technology was further explored by adopting the conventional SOI-CMOS processes. High performance and high density CMOS circuits can be first fabricated on SOI wafers, and then be integrated into flexible substrates. Flexible p-channel MOSFETs (Metal-Oxide-Semiconductor Field-Effect-Transistors) were successfully integrated and tested. Integration of pressure sensors and flow sensors based on single crystal silicon has also been demonstrated. A novel smart yarn technology that enables the invisible integration of sensors and electronics into fabrics has been developed. The most significant advantage of this technology is its post-MEMS and post-CMOS compatibility. Various high-performance MEMS devices and electronics can be integrated into flexible substrates. The potential of our technology is enormous. Many wearable and implantable devices can be developed based on this technology.
Modelling of mercury emissions from background soils.
Scholtz, M T; Van Heyst, B J; Schroeder, W H
2003-03-20
Emissions of volatile mercury species from natural soils are believed to be a significant contributor to the atmospheric burden of mercury, but only order-of-magnitude estimates of emissions from these sources are available. The scaling-up of mercury flux measurements to regional or global scales is confounded by a limited understanding of the physical, chemical and biochemical processes that occur in the soil, a complex environmental matrix. This study is a first step toward the development of an air-surface exchange model for mercury (known as the mercury emission model (MEM)). The objective of the study is to model the partitioning and movement of inorganic Hg(II) and Hg(0) in open field soils, and to use MEM to interpret published data on mercury emissions to the atmosphere. MEM is a multi-layered, dynamic finite-element soil and atmospheric surface-layer model that simulates the exchange of heat, moisture and mercury between soils and the atmosphere. The model includes a simple formulation of the reduction of inorganic Hg(II) to Hg(0). Good agreement was found between the meteorological dependence of observed mercury emission fluxes, and hourly modelled fluxes, and it is concluded that MEM is able to simulate well the soil and atmospheric processes influencing the emission of Hg(0) to the atmosphere. The heretofore unexplained close correlation between soil temperature and mercury emission flux is fully modelled by MEM and is attributed to the temperature dependence of the Hg(0) Henry's Law coefficient and the control of the volumetric soil-air fraction on the diffusion of Hg(0) near the surface. The observed correlation between solar radiation intensity and mercury flux, appears in part to be due to the surface-energy balance between radiation, and sensible and latent heat fluxes which determines the soil temperature. The modelled results imply that empirical correlations that are based only on flux chamber data, may not extend to the open atmosphere for all weather scenarios.
Utilization of Pb-free solders in MEMS packaging
NASA Astrophysics Data System (ADS)
Selvaduray, Guna S.
2003-01-01
Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.
Scanning laser beam displays based on a 2D MEMS
NASA Astrophysics Data System (ADS)
Niesten, Maarten; Masood, Taha; Miller, Josh; Tauscher, Jason
2010-05-01
The combination of laser light sources and MEMS technology enables a range of display systems such as ultra small projectors for mobile devices, head-up displays for vehicles, wearable near-eye displays and projection systems for 3D imaging. Images are created by scanning red, green and blue lasers horizontally and vertically with a single two-dimensional MEMS. Due to the excellent beam quality of laser beams, the optical designs are efficient and compact. In addition, the laser illumination enables saturated display colors that are desirable for augmented reality applications where a virtual image is used. With this technology, the smallest projector engine for high volume manufacturing to date has been developed. This projector module has a height of 7 mm and a volume of 5 cc. The resolution of this projector is WVGA. No additional projection optics is required, resulting in an infinite focus depth. Unlike with micro-display projection displays, an increase in resolution will not lead to an increase in size or a decrease in efficiency. Therefore future projectors can be developed that combine a higher resolution in an even smaller and thinner form factor with increased efficiencies that will lead to lower power consumption.
Kartanas, Tadas; Ostanin, Victor; Challa, Pavan Kumar; Daly, Ronan; Charmet, Jerome; Knowles, Tuomas P J
2017-11-21
Microelectromechanical systems (MEMS) have enabled the development of a new generation of sensor platforms. Acoustic sensor operation in liquid, the native environment of biomolecules, causes, however, significant degradation of sensing performance due to viscous drag and relies on the availability of capture molecules to bind analytes of interest to the sensor surface. Here, we describe a strategy to interface MEMS sensors with microfluidic platforms through an aerosol spray. Our sensing platform comprises a microfluidic spray nozzle and a microcantilever array operated in dynamic mode within a closed loop oscillator. A solution containing the analyte is sprayed uniformly through picoliter droplets onto the microcantilever surface; the micrometer-scale drops evaporate rapidly and leave the solutes behind, adding to the mass of the cantilever. This sensing scheme results in a 50-fold increase in the quality factor compared to operation in liquid, yet allows the analytes to be introduced into the sensing system from a solution phase. It achieves a 370 femtogram limit of detection, and we demonstrate quantitative label-free analysis of inorganic salts and model proteins. These results demonstrate that the standard resolution limits of cantilever sensing in dynamic mode can be overcome with the integration of spray microfluidics with MEMS.
Producing fluid flow using 3D carbon electrodes
NASA Astrophysics Data System (ADS)
Rouabah, H. A.; Park, B. Y.; Zaouk, R. B.; Madou, M. J.; Green, Nicolas G.
2008-12-01
Moving and manipulating bio-particles and fluids on the microscale is central to many lab-on-a-chip applications. Techniques for pumping fluids which use electric fields have shown promise using both DC and AC voltages. AC techniques, however, require the use of integrated metal electrodes which have a low resistance but can suffer from unwanted chemical reactions even at low potentials. In this paper we introduce the use of carbon MEMS technology (C-MEMS), a fabrication method which produces 3D conductive polymeric structures. Results are presented of the fabrication of an innovative design of 3D AC-electroosmotic micropump and preliminary experimental measurements which demonstrate the potential of both the technology and the design.
NASA Astrophysics Data System (ADS)
Zhang, Weiping; Chen, Wenyuan; Zhao, Xiaolin; Li, Shengyong; Jiang, Yong
2005-08-01
In a novel safety device based on MEMS technology for high consequence systems, the discriminator consists of two groups of metal counter meshing gears and two pawl/ratchet wheel mechanisms. Each group of counter meshing gears is onepiece and driven directly by an axial flux permanent magnet micromotor respectively. The energy-coupling element is an optical shutter with two collimators and a coupler wheel. The safety device's probability is less than 1/106. It is fabricated by combination of an LiGA-like process and precision mechanical engineering. The device has simple structure, few dynamic problems, high strength and strong reliability.
[Development of a massage device based on microcontroller in the field of alimentary tract].
Huang, Rong; Peng, Chenglin; He, Hongmei; Zhu, Jing
2007-12-01
In this artical is first reported a survey of the progress in research of MEMS technology. Then, the basic structure, features and the principles of a massage device based on microcontroller in the field of alimentary tract are introduced. Special emphasis is laid on the utilization of MSP430F123 microprocessor for producing a kind of period pulse to control the power of massage capsule. In general, the research and development of the massage device in the field of alimentary tract have active support and deep significance to therapy in the clinical and business settings as well as in the development of biomedical engineering and MEMS.
The 18 mm[superscript 2] Laboratory: Teaching MEMS Development with the SUMMiT Foundry Process
ERIC Educational Resources Information Center
Dallas, T.; Berg, J. M.; Gale, R. O.
2012-01-01
This paper describes the goals, pedagogical system, and educational outcomes of a three-semester curriculum in microelectromechanical systems (MEMS). The sequence takes engineering students with no formal MEMS training and gives them the skills to participate in cutting-edge MEMS research and development. The evolution of the curriculum from…
Electrostatic MEMS devices with high reliability
DOE Office of Scientific and Technical Information (OSTI.GOV)
Goldsmith, Charles L; Auciello, Orlando H; Sumant, Anirudha V
The present invention provides for an electrostatic microelectromechanical (MEMS) device comprising a dielectric layer separating a first conductor and a second conductor. The first conductor is moveable towards the second conductor, when a voltage is applied to the MEMS device. The dielectric layer recovers from dielectric charging failure almost immediately upon removal of the voltage from the MEMS device.
Electrical latching of microelectromechanical devices
Garcia, Ernest J.; Sleefe, Gerard E.
2004-11-02
Methods are disclosed for row and column addressing of an array of microelectromechanical (MEM) devices. The methods of the present invention are applicable to MEM micromirrors or memory elements and allow the MEM array to be programmed and maintained latched in a programmed state with a voltage that is generally lower than the voltage required for electrostatically switching the MEM devices.
MEMS device for spacecraft thermal control applications
NASA Technical Reports Server (NTRS)
Swanson, Theordore D. (Inventor)
2003-01-01
A micro-electromechanical device that comprises miniaturized mechanical louvers, referred to as Micro Electro-Mechanical Systems (MEMS) louvers are employed to achieve a thermal control function for spacecraft and instruments. The MEMS louvers are another form of a variable emittance control coating and employ micro-electromechanical technology. In a function similar to traditional, macroscopic thermal louvers, the MEMS louvers of the present invention change the emissivity of a surface. With the MEMS louvers, as with the traditional macroscopic louvers, a mechanical vane or window is opened and closed to allow an alterable radiative view to space.
Surface chemistry and tribology of MEMS.
Maboudian, Roya; Carraro, Carlo
2004-01-01
The microscopic length scale and high surface-to-volume ratio, characteristic of microelectro-mechanical systems (MEMS), dictate that surface properties are of paramount importance. This review deals with the effects of surface chemical treatments on tribological properties (adhesion, friction, and wear) of MEMS devices. After a brief review of materials and processes that are utilized in MEMS technology, the relevant tribological and chemical issues are discussed. Various MEMS microinstruments are discussed, which are commonly employed to perform adhesion, friction, and wear measurements. The effects of different surface treatments on the reported tribological properties are discussed.
JPRS Report. East Europe: Reference Aid, Abbreviations and Acronyms Used in the Bulgarian Press
1990-10-25
MHcneKUHfl 3a atprcaBeH TeXHHMeCKH KOHTpOJl ME MHTepHaUHOHaJIHH eflHHHUH MEMM M3BeCTHH Ha ETHOrpa<I>CKHfl HHCTHTyT c My3efi MEM ...HapofleH mezhdunar. international MEM MaillHHHO-eJieKTpOTeXHHHeCKH HHCTHTyT ME I Machine-Electrical Engineering Institute MEM MOCKOBCKH... MEM MHHHCTepCTBO Ha eJieKTpH$HKaUHHTa H MejiHopauHHTe MEM Ministry of Electrification and Land Reclamation (obs) 165 Menpo-Bajinpo
Method for integrating microelectromechanical devices with electronic circuitry
Montague, S.; Smith, J.H.; Sniegowski, J.J.; McWhorter, P.J.
1998-08-25
A method is disclosed for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry. 13 figs.
NASA Technical Reports Server (NTRS)
Keymeulen, Didier; Ferguson, Michael I.; Fink, Wolfgang; Oks, Boris; Peay, Chris; Terrile, Richard; Cheng, Yen; Kim, Dennis; MacDonald, Eric; Foor, David
2005-01-01
We propose a tuning method for MEMS gyroscopes based on evolutionary computation to efficiently increase the sensitivity of MEMS gyroscopes through tuning. The tuning method was tested for the second generation JPL/Boeing Post-resonator MEMS gyroscope using the measurement of the frequency response of the MEMS device in open-loop operation. We also report on the development of a hardware platform for integrated tuning and closed loop operation of MEMS gyroscopes. The control of this device is implemented through a digital design on a Field Programmable Gate Array (FPGA). The hardware platform easily transitions to an embedded solution that allows for the miniaturization of the system to a single chip.
Integrated three-dimensional optical MEMS for chip-based fluorescence detection
NASA Astrophysics Data System (ADS)
Hung, Kuo-Yung; Tseng, Fan-Gang; Khoo, Hwa-Seng
2009-04-01
This paper presents a novel fluorescence sensing chip for parallel protein microarray detection in the context of a 3-in-1 protein chip system. This portable microchip consists of a monolithic integration of CMOS-based avalanche photo diodes (APDs) combined with a polymer micro-lens, a set of three-dimensional (3D) inclined mirrors for separating adjacent light signals and a low-noise transformer-free dc-dc boost mini-circuit to power the APDs (ripple below 1.28 mV, 0-5 V input, 142 V and 12 mA output). We fabricated our APDs using the planar CMOS process so as to facilitate the post-CMOS integration of optical MEMS components such as the lenses. The APD arrays were arranged in unique circular patterns appropriate for detecting the specific fluorescently labelled protein spots in our study. The array-type APDs were designed so as to compensate for any alignment error as detected by a positional error signal algorithm. The condenser lens was used as a structure for light collection to enhance the fluorescent signals by about 25%. This element also helped to reduce the light loss due to surface absorption. We fabricated an inclined mirror to separate two adjacent fluorescent signals from different specimens. Excitation using evanescent waves helped reduce the interference of the excitation light source. This approach also reduced the number of required optical lenses and minimized the complexity of the structural design. We achieved detection floors for anti-rabbit IgG and Cy5 fluorescent dye as low as 0.5 ng/µl (~3.268 nM). We argue that the intrinsic nature of point-to-point and batch-detection methods as showcased in our chip offers advantages over the serial-scanning approach used in traditional scanner systems. In addition, our system is low cost and lightweight.
Design and simulation of MEMS microvalves for silicon photonic biosensor chip
NASA Astrophysics Data System (ADS)
Amemiya, Yoshiteru; Nakashima, Yuuto; Maeda, Jun; Yokoyama, Shin
2018-04-01
For the early and easy diagnosis of diseases, we have proposed a silicon photonic biosensor chip with two kinds of MEMS microvalves for a multiple-item detection system. The driving voltage of the vertical type with the circular-plate capacitor structure and that of the lateral type with the comb-shaped electrode are investigated. From mechanical calculations, the driving voltage of the vertical type is estimated to be 30 V and that of the lateral type to be 15 V. The propagation loss at the intersecting waveguides of arrayed ring-resonator biosensors is also estimated. In the case of optimized intersecting waveguides, more than 67% transmittance of TE-mode light is simulated for the series connection of 20 intersecting waveguides. It is confirmed that it is possible to fabricate an 8 × 12 arrayed biosensor chip in an area of 1 × 1.5 mm2 taking the device size of the microvalves into consideration. We have, for the first time, designed a whole system, including sensors and a fluid channel with MEMS microvalves.
Radioistopes to Solar to High Energy Accelerators - Chip-Scale Energy Sources
NASA Astrophysics Data System (ADS)
Lal, Amit
2013-12-01
This talk will present MEMS based power sources that utilize radioisotopes, solar energy, and potentially nuclear energy through advancements in integration of new structures and materials within MEMS. Micro power harvesters can harness power from vibration, radioisotopes, light, sound, and biology may provide pathways to minimize or even eliminate batteries in sensor nodes. In this talk work on radioisotope thin films for MEMS will be include the self-reciprocating cantilever, betavoltaic cells, and high DC voltages. The self-reciprocating cantilever energy harvester allows small commercially viable amounts of radioisotopes to generate mW to Watts of power so that very reliable power sources that last 100s of years are possible. The tradeoffs between reliability and potential stigma with radioisotopes allow one to span a useful design space with reliability as a key parameter. These power sources provide pulsed power at three different time scales using mechanical, RF, and static extraction of energy from collected charge. Multi-use capability, both harvesting radioisotope power and local vibration energy extends the reliability of micro-power sources further.
Operational characterization of CSFH MEMS technology based hinges
NASA Astrophysics Data System (ADS)
Crescenzi, Rocco; Balucani, Marco; Belfiore, Nicola Pio
2018-05-01
Progress in MEMS technology continuously stimulates new developments in the mechanical structure of micro systems, such as, for example, the concept of so-called CSFH (conjugate surfaces flexural hinge), which makes it possible, simultaneously, to minimize the internal stresses and to increase motion range and robustness. Such a hinge may be actuated by means of a rotary comb-drive, provided that a proper set of simulations and tests are capable to assess its feasibility. In this paper, a CSFH has been analyzed with both theoretical and finite element (FEM) methods, in order to obtain the relation between voltage and generated torque. The FEM model considers also the fringe effect on the comb drive finger. Electromechanical couple-field analysis is performed by means of both direct and load transfer methods. Experimental tests have been also performed on a CSFH embedded in a MEMS prototype, which has been fabricated starting from a SOI wafer and using D-RIE (deep reactive ion etching). Results showed that CSFH performs better than linear flexure hinges in terms of larger rotations and less stress for given applied voltage.
A Low-Cost CMOS-MEMS Piezoresistive Accelerometer with Large Proof Mass
Khir, Mohd Haris Md; Qu, Peng; Qu, Hongwei
2011-01-01
This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive sensing material. A full Wheatstone bridge was constructed through easy wiring allowed by the three metal layers in the 0.5 μm CMOS technology. The device fabrication process consisted of a standard CMOS process for sensor configuration, and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. A bulk single-crystal silicon (SCS) substrate is included in the proof mass to increase sensor sensitivity. In device design and analysis, the self heating of the polysilicon piezoresistors and its effect to the sensor performance is also discussed. With a low operating power of 1.5 mW, the accelerometer demonstrates a sensitivity of 0.077 mV/g prior to any amplification. Dynamic tests have been conducted with a high-end commercial calibrating accelerometer as reference. PMID:22164052
DOE Office of Scientific and Technical Information (OSTI.GOV)
Zhang, Y., E-mail: zhangya@iis.u-tokyo.ac.jp; Watanabe, Y.; Hosono, S.
We propose a room temperature, all electrical driving and detecting, very sensitive thermometer structure using a microelectromechanical (MEMS) resonator for bolometer applications. We have fabricated a GaAs doubly clamped MEMS beam resonator whose oscillation can be excited and detected by the piezoelectric effect. When a heating power is applied to a NiCr film deposited on the MEMS beam surface, internal thermal stress is generated in the beam, leading to a reduction in the resonance frequency. The present device detects the shift in the resonance frequency caused by heating and works as a very sensitive thermometer. When the resonator was drivenmore » by a voltage slightly below the threshold for the nonlinear, hysteretic oscillation, the thermometer showed a voltage responsivity of about 3300 V/W, while keeping a low noise spectral density of about 60 nV/Hz{sup 1/2}, demonstrating a noise equivalent power of <20 pW/Hz{sup 1/2} even at room temperature. The observed effect can be used for realizing high-sensitivity terahertz bolometers for room-temperature operation.« less
Microelectromechanical inertial sensor
Okandan, Murat [Edgewood, NM; Nielson, Gregory N [Albuquerque, NM
2012-06-26
A microelectromechanical (MEM) inertial sensor is disclosed which can be used to sense a linear acceleration, or a Coriolis acceleration due to an angular rotation rate, or both. The MEM inertial sensor has a proof mass which is supported on a bridge extending across an opening through a substrate, with the proof mass being balanced on the bridge by a pivot, or suspended from the bridge by the pivot. The proof mass can be oscillated in a tangential direction in the plane of the substrate, with any out-of-plane movement of the proof mass in response to a sensed acceleration being optically detected using transmission gratings located about an outer edge of the proof mass to generate a diffracted light pattern which changes with the out-of-plane movement of the proof mass.
NASA Astrophysics Data System (ADS)
Rimskog, Magnus; O'Loughlin, Brian J.
2007-02-01
Silex Microsystems handles a wide range of customized MEMS components. This speech will be describing Silex's MEMS foundry work model for providing customized solutions based on MEMS in a cost effective and well controlled manner. Factors for success are the capabilities to reformulate a customer product concept to manufacturing processes in the wafer fab, using standard process modules and production equipment. A well-controlled system increases the likelihood of a first batch success and enables fast ramp-up into volume production. The following success factors can be listed: strong enduring relationships with the customers; highly qualified well-experienced specialists working close with the customer; process solutions and building blocks ready to use out of a library; addressing manufacturing issues in the early design phase; in-house know how to meet demands for volume manufacturing; access to a wafer fab with high capacity, good organization, high availability of equipment, and short lead times; process development done in the manufacturing environment using production equipment for easy ramp-up to volume production. The article covers a method of working to address these factors: to have a long and enduring relationships with customers utilizing MEMS expertise and working close with customers, to translate their product ideas to MEMS components; to have stable process solutions for features such as Low ohmic vias, Spiked electrodes, Cantilevers, Silicon optical mirrors, Micro needles, etc, which can be used and modified for the customer needs; to use a structured development and design methodology in order to handle hundreds of process modules, and setting up standard run sheets. It is also very important to do real time process development in the manufacturing line. It minimizes the lead-time for the ramp-up of production; to have access to a state of the art Wafer Fab which is well organized, controlled and flexible, with high capacity and short lead-time for prototypes. It is crucial to have intimate control of processes, equipment, organization, production flow control and WIP. This has been addressed by using a fully computerized control and reporting system.
Pre-release plastic packaging of MEMS and IMEMS devices
Peterson, Kenneth A.; Conley, William R.
2002-01-01
A method is disclosed for pre-release plastic packaging of MEMS and IMEMS devices. The method can include encapsulating the MEMS device in a transfer molded plastic package. Next, a perforation can be made in the package to provide access to the MEMS elements. The non-ablative material removal process can include wet etching, dry etching, mechanical machining, water jet cutting, and ultrasonic machining, or any combination thereof. Finally, the MEMS elements can be released by using either a wet etching or dry plasma etching process. The MEMS elements can be protected with a parylene protective coating. After releasing the MEMS elements, an anti-stiction coating can be applied. The perforating step can be applied to both sides of the device or package. A cover lid can be attached to the face of the package after releasing any MEMS elements. The cover lid can include a window for providing optical access. The method can be applied to any plastic packaged microelectronic device that requires access to the environment, including chemical, pressure, or temperature-sensitive microsensors; CCD chips, photocells, laser diodes, VCSEL's, and UV-EPROMS. The present method places the high-risk packaging steps ahead of the release of the fragile portions of the device. It also provides protection for the die in shipment between the molding house and the house that will release the MEMS elements and subsequently treat the surfaces.
The Impact of Emerging MEMS-Based Microsystems on US Defense Applications
DOE Office of Scientific and Technical Information (OSTI.GOV)
STAPLE,BEVAN D.; JAKUBCZAK II,JEROME F.
2000-01-20
This paper examines the impact of inserting Micro-Electro-Mechanical Systems (MEMS) into US defense applications. As specific examples, the impacts of micro Inertial Measurement Units (IMUs), radio frequency MEMS (RF MEMS), and Micro-Opto-Electro-Mechanical Systems (MOEMS) to provide integrated intelligence, communication, and control to the defense infrastructure with increased affordability, functionality, and performance are highlighted.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Menchhofer, Paul A.
PiMEMS Inc. (Santa Barbara, CA) in collaboration with ORNL investigated the use of Titanium Bonded Graphite Foam Composites (TBGC) for thermal mitigation in Micro Electronic Mechanical Systems (MEMS) applications. Also considered were potentially new additive manufacturing routes to producing novel high surface area micro features and diverse shaped heat transfer components for numerous lightweight MEMs applications.
Managing design for manufacture and assembly in the development of MEMS-based products
NASA Astrophysics Data System (ADS)
Hsu, Hung-Yao; Narasimhan, Nachchinarkkinian; Hariz, Alex J.
2006-12-01
Design for manufacturability, assembly and reliability of MEMS products is being applied to a multitude of novel MEMS products to make up for the lack of "Standard Process for MEMS" concept. The latter has proved a major handicap in commercialization of MEMS devices when compared to integrated circuits products. Furthermore, an examination of recent engineering literature seems to suggest convergence towards the development of the design for manufacturability and reliability of MEMS products. This paper will highlight the advantages and disadvantages of conventional techniques that have been pursued up to this point to achieve commercialization of MEMS products, identify some of the problems slowing down development, and explore measures that could be taken to try to address those problems. Successful commercialization critically depends on packaging and assembly, manufacturability, and reliability for micro scale products. However, a methodology that appropriately shadows next generation knowledge management will undoubtedly address most of the critical problems that are hampering development of MEMS industries. Finally this paper will also identify contemporary issues that are challenging the industry in regards to product commercialization and will recommend appropriate measures based on knowledge flow to address those shortcomings and lay out plans to expedient and successful paths to market.
The Development of a Portable Hard Disk Encryption/Decryption System with a MEMS Coded Lock.
Zhang, Weiping; Chen, Wenyuan; Tang, Jian; Xu, Peng; Li, Yibin; Li, Shengyong
2009-01-01
In this paper, a novel portable hard-disk encryption/decryption system with a MEMS coded lock is presented, which can authenticate the user and provide the key for the AES encryption/decryption module. The portable hard-disk encryption/decryption system is composed of the authentication module, the USB portable hard-disk interface card, the ATA protocol command decoder module, the data encryption/decryption module, the cipher key management module, the MEMS coded lock controlling circuit module, the MEMS coded lock and the hard disk. The ATA protocol circuit, the MEMS control circuit and AES encryption/decryption circuit are designed and realized by FPGA(Field Programmable Gate Array). The MEMS coded lock with two couplers and two groups of counter-meshing-gears (CMGs) are fabricated by a LIGA-like process and precision engineering method. The whole prototype was fabricated and tested. The test results show that the user's password could be correctly discriminated by the MEMS coded lock, and the AES encryption module could get the key from the MEMS coded lock. Moreover, the data in the hard-disk could be encrypted or decrypted, and the read-write speed of the dataflow could reach 17 MB/s in Ultra DMA mode.
System Modeling of a MEMS Vibratory Gyroscope and Integration to Circuit Simulation.
Kwon, Hyukjin J; Seok, Seyeong; Lim, Geunbae
2017-11-18
Recently, consumer applications have dramatically created the demand for low-cost and compact gyroscopes. Therefore, on the basis of microelectromechanical systems (MEMS) technology, many gyroscopes have been developed and successfully commercialized. A MEMS gyroscope consists of a MEMS device and an electrical circuit for self-oscillation and angular-rate detection. Since the MEMS device and circuit are interactively related, the entire system should be analyzed together to design or test the gyroscope. In this study, a MEMS vibratory gyroscope is analyzed based on the system dynamic modeling; thus, it can be mathematically expressed and integrated into a circuit simulator. A behavioral simulation of the entire system was conducted to prove the self-oscillation and angular-rate detection and to determine the circuit parameters to be optimized. From the simulation, the operating characteristic according to the vacuum pressure and scale factor was obtained, which indicated similar trends compared with those of the experimental results. The simulation method presented in this paper can be generalized to a wide range of MEMS devices.
Overview of MEMS/NEMS technology development for space applications at NASA/JPL
NASA Astrophysics Data System (ADS)
George, Thomas
2003-04-01
This paper highlights the current technology development activities of the MEMS Technology Group at JPL. A diverse range of MEMS/NEMS technologies are under development, that are primarily applicable to NASA"s needs in the area of robotic planetary exploration. MEMS/NEMS technologies have obvious advantages for space applications, since they offer the promise of highly capable devices with ultra low mass, size and power consumption. However, the key challenge appears to be in finding efficient means to transition these technologies into "customer" applications. A brief description of this problem is presented along with the Group"s innovative approach to rapidly advance the maturity of technologies via insertion into space missions. Also described are some of the major capabilities of the MEMS Technology Group. A few important examples from among the broad classes of technologies being developed are discussed, these include the "Spider Web Bolometer", High-Performance Miniature Gyroscopes, an Electron Luminescence X-ray Spectrometer, a MEMS-based "Knudsen" Thermal Transpiration pump, MEMS Inchworm Actuators, and Nanowire-based Biological/Chemical Sensors.
A non-resonant fiber scanner based on an electrothermally-actuated MEMS stage
Zhang, Xiaoyang; Duan, Can; Liu, Lin; Li, Xingde; Xie, Huikai
2015-01-01
Scanning fiber tips provides the most convenient way for forward-viewing fiber-optic microendoscopy. In this paper, a distal fiber scanning method based on a large-displacement MEMS actuator is presented. A single-mode fiber is glued on the micro-platform of an electrothermal MEMS stage to realize large range non-resonantscanning. The micro-platform has a large piston scan range of up to 800 µm at only 6V. The tip deflection of the fiber can be further amplified by placing the MEMS stage at a proper location along the fiber. A quasi-static model of the fiber-MEMS assembly has been developed and validated experimentally. The frequency response has also been studied and measured. A fiber tip deflection of up to 1650 µm for the 45 mm-long movable fiber portion has been achieved when the MEMS electrothermal stage was placed 25 mm away from the free end. The electrothermally-actuated MEMS stage shows a great potential for forward viewing fiber scanning and optical applications. PMID:26347583
NASA Astrophysics Data System (ADS)
Warnat, S.; King, H.; Wasay, A.; Sameoto, D.; Hubbard, T.
2016-09-01
We present an approach to form a microfluidic environment on top of MEMS dies using reversibly bonded microfluidics. The reversible polymeric microfluidics moulds bond to the MEMS die using a gecko-inspired gasket architecture. In this study the formed microchannels are demonstrated in conjunction with a MEMS mechanical single cell testing environment for BioMEMS applications. A reversible microfluidics placement technique with an x-y and rotational accuracy of ±2 µm and 1° respectively on a MEMS die was developed. No leaks were observed during pneumatic pumping of common cell media (PBS, sorbitol, water, seawater) through the fluidic channels. Thermal chevron actuators were successful operated inside this fluidic environment and a performance deviation of ~15% was measured compared to an open MEMS configuration. Latex micro-spheres were pumped using traveling wave di-electrophoresis and compared to an open (no-microfluidics) configuration with velocities of 24 µm s-1 and 20 µm s-1.
Dynamic metasurface lens based on MEMS technology
NASA Astrophysics Data System (ADS)
Roy, Tapashree; Zhang, Shuyan; Jung, Il Woong; Troccoli, Mariano; Capasso, Federico; Lopez, Daniel
2018-02-01
In the recent years, metasurfaces, being flat and lightweight, have been designed to replace bulky optical components with various functions. We demonstrate a monolithic Micro-Electro-Mechanical System (MEMS) integrated with a metasurface-based flat lens that focuses light in the mid-infrared spectrum. A two-dimensional scanning MEMS platform controls the angle of the lens along two orthogonal axes by ±9°, thus enabling dynamic beam steering. The device could be used to compensate for off-axis incident light and thus correct for aberrations such as coma. We show that for low angular displacements, the integrated lens-on-MEMS system does not affect the mechanical performance of the MEMS actuators and preserves the focused beam profile as well as the measured full width at half maximum. We envision a new class of flat optical devices with active control provided by the combination of metasurfaces and MEMS for a wide range of applications, such as miniaturized MEMS-based microscope systems, LIDAR scanners, and projection systems.
Thermal Hysteresis of MEMS Packaged Capacitive Pressure Sensor (CPS) Based 3C-SiC
NASA Astrophysics Data System (ADS)
Marsi, N.; Majlis, B. Y.; Mohd-Yasin, F.; Hamzah, A. A.; Mohd Rus, A. Z.
2016-11-01
Presented herein are the effects of thermal hysteresis analyses of the MEMS packaged capacitive pressure sensor (CPS). The MEMS CPS was employed on Si-on-3C-SiC wafer that was performed using the hot wall low-pressure chemical vapour deposition (LPCVD) reactors at the Queensland Micro and Nanotechnology Center (QMNC), Griffith University and fabricated using the bulk-micromachining process. The MEMS CPS was operated at an extreme temperature up to 500°C and high external pressure at 5.0 MPa. The thermal hysteresis phenomenon that causes the deflection, strain and stress on the 3C-SiC diaphragm spontaneously influence the MEMS CPS performances. The differences of temperature, hysteresis, and repeatability test were presented to demonstrate the functionality of the MEMS packaged CPS. As expected, the output hysteresis has a low hysteresis (less than 0.05%) which has the hardness greater than the traditional silicon. By utilizing this low hysteresis, it was revealed that the MEMS packaged CPS has high repeatability and stability of the sensor.
A review of microelectromechanical systems for nanoscale mechanical characterization
NASA Astrophysics Data System (ADS)
Zhu, Yong; Chang, Tzu-Hsuan
2015-09-01
A plethora of nanostructures with outstanding properties have emerged over the past decades. Measuring their mechanical properties and understanding their deformation mechanisms is of paramount importance for many of their device applications. To address this need innovative experimental techniques have been developed, among which a promising one is based upon microelectromechanical systems (MEMS). This article reviews the recent advances in MEMS platforms for the mechanical characterization of one-dimensional (1D) nanostructures over the past decade. A large number of MEMS platforms and related nanomechanics studies are presented to demonstrate the unprecedented capabilities of MEMS for nanoscale mechanical characterization. Focusing on key design considerations, this article aims to provide useful guidelines for developing MEMS platforms. Finally, some of the challenges and future directions in the area of MEMS-enabled nanomechanical characterization are discussed.
Towards memory-aware services and browsing through lifelogging sensing.
Arcega, Lorena; Font, Jaime; Cetina, Carlos
2013-11-05
Every day we receive lots of information through our senses that is lost forever, because it lacked the strength or the repetition needed to generate a lasting memory. Combining the emerging Internet of Things and lifelogging sensors, we believe it is possible to build up a Digital Memory (Dig-Mem) in order to complement the fallible memory of people. This work shows how to realize the Dig-Mem in terms of interactions, affinities, activities, goals and protocols. We also complement this Dig-Mem with memory-aware services and a Dig-Mem browser. Furthermore, we propose a RFID Tag-Sharing technique to speed up the adoption of Dig-Mem. Experimentation reveals an improvement of the user understanding of Dig-Mem as time passes, compared to natural memories where the level of detail decreases over time.
MEMS Applications in Aerodynamic Measurement Technology
NASA Technical Reports Server (NTRS)
Reshotko, E.; Mehregany, M.; Bang, C.
1998-01-01
Microelectromechanical systems (MEMS) embodies the integration of sensors, actuators, and electronics on a single substrate using integrated circuit fabrication techniques and compatible bulk and surface micromachining processes. Silicon and its derivatives form the material base for the MEMS technology. MEMS devices, including microsensors and microactuators, are attractive because they can be made small (characteristic dimension about 100 microns), be produced in large numbers with uniform performance, include electronics for high performance and sophisticated functionality, and be inexpensive. For aerodynamic measurements, it is preferred that sensors be small so as to approximate measurement at a point, and in fact, MEMS pressure sensors, wall shear-stress sensors, heat flux sensors and micromachined hot wires are nearing application. For the envisioned application to wind tunnel models, MEMS sensors can be placed on the surface or in very shallow grooves. MEMS devices have often been fabricated on stiff, flat silicon substrates, about 0.5 mm thick, and therefore were not easily mounted on curved surfaces. However, flexible substrates are now available and heat-flux sensor arrays have been wrapped around a curved turbine blade. Electrical leads can also be built into the flexible substrate. Thus MEMS instrumented wind tunnel models do not require deep spanwise grooves for tubes and leads that compromise the strength of conventionally instrumented models. With MEMS, even the electrical leads can potentially be eliminated if telemetry of the signals to an appropriate receiver can be implemented. While semiconductor silicon is well known for its electronic properties, it is also an excellent mechanical material for MEMS applications. However, silicon electronics are limited to operations below about 200 C, and silicon's mechanical properties start to diminish above 400 C. In recent years, silicon carbide (SiC) has emerged as the leading material candidate for applications in high temperature environments and can be used for high-temperature MEMS applications. With SiC, diodes and more complex electronics have been shown to operate to about 600 C, while the mechanical properties of SiC are maintained to much higher temperatures. Even when MEMS devices show benefits in the laboratory, there are many packaging challenges for any aeronautics application. Incorporating MEMS into these applications requires new approaches to packaging that goes beyond traditional integrated circuit (IC) packaging technologies. MEMS must interact mechanically, as well as electrically with their environment, making most traditional chip packaging and mounting techniques inadequate. Wind tunnels operate over wide temperature ranges in an environment that is far from being a 'clean-room.' In flight, aircraft are exposed to natural elements (e.g. rain, sun, ice, insects and dirt) and operational interferences(e.g. cleaning and deicing fluids, and maintenance crews). In propulsion systems applications, MEMS devices will have to operate in environments containing gases with very high temperatures, abrasive particles and combustion products. Hence deployment and packaging that maintains the integrity of the MEMS system is crucial. This paper presents an overview of MEMS fabrication and materials, descriptions of available sensors with more details on those being developed in our laboratories, and a discussion of sensor deployment options for wind tunnel and flight applications.
Modelling MEMS deformable mirrors for astronomical adaptive optics
NASA Astrophysics Data System (ADS)
Blain, Celia
As of July 2012, 777 exoplanets have been discovered utilizing mainly indirect detection techniques. The direct imaging of exoplanets is the next goal for astronomers, because it will reveal the diversity of planets and planetary systems, and will give access to the exoplanet's chemical composition via spectroscopy. With this spectroscopic knowledge, astronomers will be able to know, if a planet is terrestrial and, possibly, even find evidence of life. With so much potential, this branch of astronomy has also captivated the general public attention. The direct imaging of exoplanets remains a challenging task, due to (i) the extremely high contrast between the parent star and the orbiting exoplanet and (ii) their small angular separation. For ground-based observatories, this task is made even more difficult, due to the presence of atmospheric turbulence. High Contrast Imaging (HCI) instruments have been designed to meet this challenge. HCI instruments are usually composed of a coronagraph coupled with the full onaxis corrective capability of an Extreme Adaptive Optics (ExAO) system. An efficient coronagraph separates the faint planet's light from the much brighter starlight, but the dynamic boiling speckles, created by the stellar image, make exoplanet detection impossible without the help of a wavefront correction device. The Subaru Coronagraphic Extreme Adaptive Optics (SCExAO) system is a high performance HCI instrument developed at Subaru Telescope. The wavefront control system of SCExAO consists of three wavefront sensors (WFS) coupled with a 1024- actuator Micro-Electro-Mechanical-System (MEMS) deformable mirror (DM). MEMS DMs offer a large actuator density, allowing high count DMs to be deployed in small size beams. Therefore, MEMS DMs are an attractive technology for Adaptive Optics (AO) systems and are particularly well suited for HCI instruments employing ExAO technologies. SCExAO uses coherent light modulation in the focal plane introduced by the DM, for both wavefront sensing and correction. In this scheme, the DM is used to introduce known aberrations (speckles in the focal plane), which interfere with existing speckles. By monitoring the interference between the pre-existing speckles and the speckles added deliberately by the DM, it is possible to reconstruct the complex amplitude (amplitude and phase) of the focal plane speckles. Thus, the DM is used for wavefront sensing, in a scheme akin to phase diversity. For SCExAO and other HCI systems using phase diversity, the wavefront compensation is a mix of closed-loop and open-loop control of the DM. The successful implementation of MEMS DMs open-loop control relies on a thorough modelling of the DM response to the control system commands. The work presented in this thesis, motivated by the need to provide accurate DM control for the wavefront control system of SCExAO, was centred around the development of MEMS DM models. This dissertation reports the characterization of MEMS DMs and the development of two efficient modelling approaches. The open-loop performance of both approaches has been investigated. The model providing the best result has been implemented within the SCExAO wavefront control software. Within SCExAO, the model was used to command the DM to create focal plane speckles. The work is now focused on using the model within a full speckle nulling process and on increasing the execution speed to make the model suitable for on-sky operation.
Printed Antennas Made Reconfigurable by Use of MEMS Switches
NASA Technical Reports Server (NTRS)
Simons, Rainee N.
2005-01-01
A class of reconfigurable microwave antennas now undergoing development comprise fairly conventional printed-circuit feed elements and radiating patches integrated with novel switches containing actuators of the microelectromechanical systems (MEMS) type. In comparison with solid-state electronic control devices incorporated into some prior printed microwave antennas, the MEMS-based switches in these antennas impose lower insertion losses and consume less power. Because the radio-frequency responses of the MEMS switches are more nearly linear, they introduce less signal distortion. In addition, construction and operation are simplified because only a single DC bias line is needed to control each MEMS actuator.
Effects of standard ethanolic extract from Erythrina velutina in acute cerebral ischemia in mice.
Rodrigues, Francisca Taciana Sousa; de Sousa, Caren Nádia Soares; Ximenes, Naiara Coelho; Almeida, Anália Barbosa; Cabral, Lucas Moraes; Patrocínio, Cláudio Felipe Vasconcelos; Silva, Aline Holanda; Leal, Luzia Kalyne Almeida Moreira; Honório Júnior, José Eduardo Ribeiro; Macedo, Danielle; Vasconcelos, Silvânia Maria Mendes
2017-12-01
The objective of this study was to verify a possible neuroprotective effect of the ethanolic extract of Erythrina velutina (EEEV). Male Swiss mice were submitted to transient cerebral ischemia by occlusion of both carotid arteries for 30 min and treated for 5 days with EEEV (200 or 400 mg/kg) or Memantine (MEM) 10 mg/kg, with initiation of treatment 2 or 24 h after Ischemia. On the 6th day after the induction of ischemia, the animals were submitted to evaluation of locomotor activity and memory and then sacrificed. The brains were dissected for the removal of the prefrontal cortex (PFC), hippocampus (HC) and striatum (ST) for determination of amino acid concentrations. In the step down and Y-maze tests, ischemia caused damage to the animals and treatment with EEEV or MEM reversed this effect. The animals submitted to ischemia also showed memory deficit in the object recognition test, an effect that was reverted by EEEV400 and MEM10. Amino acid dosage showed an increase in excitatory amino acid concentrations in the PFC of the ischemic animals and this effect was reversed by the treatment with EEEV400/24H. Regarding the inhibitory amino acids, ischemia caused an increase of taurine in the PFC while treatment with MEM10/24H or EEEV400/24H reversed this effect. In HC, an increase in excitatory amino acids was also observed in ischemiated animals having treatment with EEEV200/2H or EEEV400/24H reversed this effect. Similar effect was also observed in the same area in relation to the inhibitory amino acids with treatment with MEM10/24H or EEEV400/24H. In the ST, ischemia was also able to cause an increase in excitatory amino acids that was reversed more efficiently by the treatments with MEM10/24H and EEEV200. Also in this area, an increase of taurine and GABA was observed and only the treatment with EEEV200/2H showed a reversion of this effect. In view of these findings, EEEV presents a neuroprotective effect possibly due to its action on amino acid concentrations, and is therefore a potential therapeutic tool in reducing the damage caused by ischemia. Copyright © 2017 Elsevier Masson SAS. All rights reserved.
MEMS for Practical Applications
NASA Astrophysics Data System (ADS)
Esashi, Masayoshi
Silicon MEMS as electrostatically levitated rotational gyroscopes and 2D optical scanners, and wafer level packaged devices as integrated capacitive pressure sensors and MEMS switches are described. MEMS which use non-silicon materials as LTCC with electrical feedthrough, SiC and LiNbO3 for probe cards for wafer-level burn-in test, molds for glass press molding and SAW wireless passive sensors respectively are also described.
Characterization of sapphire: For its material properties at high temperatures
NASA Astrophysics Data System (ADS)
Bal, Harman Singh
There are numerous needs for sensing, one of which is in pressure sensing for high temperature application such as combustion related process and embedded in aircraft wings for reusable space vehicles. Currently, silicon based MEMS technology is used for pressure sensing. However, due to material properties the sensors have a limited range of approximately 600 °C which is capable of being pushed towards 1000 °C with active cooling. This can introduce reliability issues when you add more parts and high flow rates to remove large amounts of heat. To overcome this challenge, sapphire is investigated for optical based pressure transducers at temperatures approaching 1400 °C. Due to its hardness and chemical inertness, traditional cutting and etching methods used in MEMS technology are not applicable. A method that is being investigated as a possible alternative is laser machining using a picosecond laser. In this research, we study the material property changes that occur from laser machining and quantify the changes with the experimental results obtained by testing sapphire at high-temperature with a standard 4-point bending set-up.
Sleep Estimates Using Microelectromechanical Systems (MEMS)
te Lindert, Bart H. W.; Van Someren, Eus J. W.
2013-01-01
Study Objectives: Although currently more affordable than polysomnography, actigraphic sleep estimates have disadvantages. Brand-specific differences in data reduction impede pooling of data in large-scale cohorts and may not fully exploit movement information. Sleep estimate reliability might improve by advanced analyses of three-axial, linear accelerometry data sampled at a high rate, which is now feasible using microelectromechanical systems (MEMS). However, it might take some time before these analyses become available. To provide ongoing studies with backward compatibility while already switching from actigraphy to MEMS accelerometry, we designed and validated a method to transform accelerometry data into the traditional actigraphic movement counts, thus allowing for the use of validated algorithms to estimate sleep parameters. Design: Simultaneous actigraphy and MEMS-accelerometry recording. Setting: Home, unrestrained. Participants: Fifteen healthy adults (23-36 y, 10 males, 5 females). Interventions: None. Measurements: Actigraphic movement counts/15-sec and 50-Hz digitized MEMS-accelerometry. Analyses: Passing-Bablok regression optimized transformation of MEMS-accelerometry signals to movement counts. Kappa statistics calculated agreement between individual epochs scored as wake or sleep. Bland-Altman plots evaluated reliability of common sleep variables both between and within actigraphs and MEMS-accelerometers. Results: Agreement between epochs was almost perfect at the low, medium, and high threshold (kappa = 0.87 ± 0.05, 0.85 ± 0.06, and 0.83 ± 0.07). Sleep parameter agreement was better between two MEMS-accelerometers or a MEMS-accelerometer and an actigraph than between two actigraphs. Conclusions: The algorithm allows for continuity of outcome parameters in ongoing actigraphy studies that consider switching to MEMS-accelerometers. Its implementation makes backward compatibility feasible, while collecting raw data that, in time, could provide better sleep estimates and promote cross-study data pooling. Citation: te Lindert BHW; Van Someren EJW. Sleep estimates using microelectromechanical systems (MEMS). SLEEP 2013;36(5):781-789. PMID:23633761
Vibration nullification of MEMS device using input shaping
NASA Astrophysics Data System (ADS)
Jordan, Scott; Lawrence, Eric M.
2003-07-01
The active silicon microstructures known as Micro-Electromechanical Systems (MEMS) are improving many existing technologies through simplification and cost reduction. Many industries have already capitalized on MEMS technology such as those in fields as diverse as telecommunications, computing, projection displays, automotive safety, defense and biotechnology. As they grow in sophistication and complexity, the familiar pressures to further reduce costs and increase performance grow for those who design and manufacture MEMS devices and the engineers who specify them for their end applications. One example is MEMS optical switches that have evolved from simple, bistable on/off elements to microscopic, freelypositionable beam steering optics. These can be actuated to discrete angular positions or to continuously-variable angular states through applied command signals. Unfortunately, elaborate closed-loop actuation schemes are often necessitated in order to stabilize the actuation. Furthermore, preventing one actuated micro-element from vibrationally cross-coupling with its neighbors is another reason costly closed-loop approaches are thought to be necessary. The Laser Doppler Vibrometer (LDV) is a valuable tool for MEMS characterization that provides non-contact, real-time measurements of velocity and/or displacement response. The LDV is a proven technology for production metrology to determine dynamical behaviors of MEMS elements, which can be a sensitive indicator of manufacturing variables such as film thickness, etch depth, feature tolerances, handling damage and particulate contamination. They are also important for characterizing the actuation dynamics of MEMS elements for implementation of a patented controls technique called Input Shaping«, which we show here can virtually eliminate the vibratory resonant response of MEMS elements even when subjected to the most severe actuation profiles. In this paper, we will demonstrate the use of the LDV to determine how the application of this compact, efficient algorithm can improve the performance of both open- and closed-loop MEMS devices, eliminating the need for costly closed-loop approaches. This can greatly reduce the complexity, cost and yield of MEMS design and manufacture.
Effectiveness of BaTiO 3 dielectric patches on YBa 2Cu 3O 7 thin films for MEM switches
Vargas, J.; Hijazi, Y.; Noel, J.; ...
2014-05-12
A micro-electro-mechanical (MEM) switch built on a superconducting microstrip filter will be utilized to investigate BaTiO 3 dielectric patches for functional switching points of contact. Actuation voltage resulting from the MEM switch provokes static friction between the bridge membrane and BaTiO 3 insulation layer. Furthermore, the dielectric patch crystal structure and roughness affect the ability of repetitively switching cycles and lifetime. We performed a series of experiments using different deposition methods and RF magnetron sputtering was found to be the best deposition process for the BaTiO 3 layer. The effect examination of surface morphology will be presented using characterization techniquesmore » as x-ray diffraction, SEM and AFM for an optimum switching device. The thin film is made of YBa 2Cu 3O 7 deposited on LaAlO 3 substrate by pulsed laser deposition. In our work, the dielectric material sputtering pressure is set at 9.5x10 -6 Torr. The argon gas is released through a mass-flow controller to purge the system prior to deposition. RF power is 85 W at a distance of 9 cm. The behavior of Au membranes built on ultimate BaTiO 3 patches will be shown as part of the results. These novel surface patterns will in turn be used in modelling other RF MEM switch devices such as distributed-satellite communication system operating at cryogenic temperatures.« less
Shock reliability analysis and improvement of MEMS electret-based vibration energy harvesters
NASA Astrophysics Data System (ADS)
Renaud, M.; Fujita, T.; Goedbloed, M.; de Nooijer, C.; van Schaijk, R.
2015-10-01
Vibration energy harvesters can serve as a replacement solution to batteries for powering tire pressure monitoring systems (TPMS). Autonomous wireless TPMS powered by microelectromechanical system (MEMS) electret-based vibration energy harvester have been demonstrated. The mechanical reliability of the MEMS harvester still has to be assessed in order to bring the harvester to the requirements of the consumer market. It should survive the mechanical shocks occurring in the tire environment. A testing procedure to quantify the shock resilience of harvesters is described in this article. Our first generation of harvesters has a shock resilience of 400 g, which is far from being sufficient for the targeted application. In order to improve this aspect, the first important aspect is to understand the failure mechanism. Failure is found to occur in the form of fracture of the device’s springs. It results from impacts between the anchors of the springs when the harvester undergoes a shock. The shock resilience of the harvesters can be improved by redirecting these impacts to nonvital parts of the device. With this philosophy in mind, we design three types of shock absorbing structures and test their effect on the shock resilience of our MEMS harvesters. The solution leading to the best results consists of rigid silicon stoppers covered by a layer of Parylene. The shock resilience of the harvesters is brought above 2500 g. Results in the same range are also obtained with flexible silicon bumpers, which are simpler to manufacture.
Transmission-enabled fiber Fabry-Perot cavity based on a deeply etched slotted micromirror.
Othman, Muhammad A; Sabry, Yasser M; Sadek, Mohamed; Nassar, Ismail M; Khalil, Diaa A
2018-06-01
In this work, we report the analysis, fabrication, and characterization of an optical cavity built using a Bragg-coated fiber (BCF) mirror and a metal-coated microelectromechanical systems (MEMS) slotted micromirror, where the latter allows transmission output from the cavity. Theoretical modeling, using Fourier optics analysis for the cavity response based on tracing the propagation of light back and forth between the mirrors, is presented. Detailed simulation analysis is carried out for the spectral response of the cavity under different design conditions. MEMS chips of the slotted micromirror are fabricated using deep reactive ion etching of a silicon-on-insulator substrate with different device-etching depths of 150 μm and 80 μm with aluminum and gold metal coating, respectively. The cavity is characterized as an optical filter using a BCF with reflectivity that is larger than 95% in a 300 nm range across the E-band and the L-band. Versatile filter characteristics were obtained for different values of the MEMS micromirror slit width and cavity length. A free spectral range (FSR) of about 33 nm and a quality factor of about 196 were obtained for a 5.5 μm width aluminum slit, while an FSR of about 148 nm and a quality factor of about 148 were obtained for a 1.5 μm width gold slit. The presented structure opens the door for wide spectral response transmission-type MEMS filters.
Method of forming a package for mems-based fuel cell
Morse, Jeffrey D.; Jankowski, Alan F.
2004-11-23
A MEMS-based fuel cell package and method thereof is disclosed. The fuel cell package comprises seven layers: (1) a sub-package fuel reservoir interface layer, (2) an anode manifold support layer, (3) a fuel/anode manifold and resistive heater layer, (4) a Thick Film Microporous Flow Host Structure layer containing a fuel cell, (5) an air manifold layer, (6) a cathode manifold support structure layer, and (7) a cap. Fuel cell packages with more than one fuel cell are formed by positioning stacks of these layers in series and/or parallel. The fuel cell package materials such as a molded plastic or a ceramic green tape material can be patterned, aligned and stacked to form three dimensional microfluidic channels that provide electrical feedthroughs from various layers which are bonded together and mechanically support a MEMOS-based miniature fuel cell. The package incorporates resistive heating elements to control the temperature of the fuel cell stack. The package is fired to form a bond between the layers and one or more microporous flow host structures containing fuel cells are inserted within the Thick Film Microporous Flow Host Structure layer of the package.
Determination of the glycosylation-pattern of the middle ear mucosa in guinea pigs.
Engleder, Elisabeth; Demmerer, Elisabeth; Wang, Xueyan; Honeder, Clemens; Zhu, Chengjing; Studenik, Christian; Wirth, Michael; Arnoldner, Christoph; Gabor, Franz
2015-04-30
In the present study the glycosylation pattern of the middle ear mucosa (MEM) of guinea pigs, an approved model for middle ear research, was characterized with the purpose to identify bioadhesive ligands which might prolong the contact time of drug delivery systems with the middle ear mucosa (MEM). To assess the utility of five fluorescein labeled plant lectins with different carbohydrate specificities as bioadhesive ligands, viable MEM specimens were incubated at 4°C and the lectin binding capacities were calculated from the MEM-associated relative fluorescence intensities. Among all lectins under investigation, fluorescein-labeled wheat germ agglutinin (F-WGA) emerged as the highest bioadhesive lectin. In general, the accessibility of carbohydrate moieties of the MEM followed the order: sialic acid and N-acetyl-d-glucosamine (WGA)>mannose and galactosamine (Lensculinaris agglutinin)>N-acetyl-d-glucosamine (Solanumtuberosum agglutinin)>fucose (Ulexeuropaeus isoagglutinin I)>terminal mannose α-(1,3)-mannose (Galanthusnivalis agglutinin). Competitive inhibition studies with the corresponding carbohydrate revealed that F-WGA-binding was inhibited up to 90% confirming specificity of the F-WGA-MEM interaction. The cilia of the MEM were identified as F-WGA binding sites by fluorescence imaging as well as a z-stack of overlays of transmission, F-WGA- and nuclei-stained images of the MEM. Additionally, co-localisation experiments revealed that F-WGA bound to acidic mucopolysaccharides of the MEM. All in all, lectin-mediated bioadhesion to the MEM is proposed as a new concept for drug delivery to prolong the residence time of the drug in the tympanic cavity especially for successful therapy for difficult-to-treat diseases such as otitis media. Copyright © 2015 The Authors. Published by Elsevier B.V. All rights reserved.
Towards Memory-Aware Services and Browsing through Lifelogging Sensing
Arcega, Lorena; Font, Jaime; Cetina, Carlos
2013-01-01
Every day we receive lots of information through our senses that is lost forever, because it lacked the strength or the repetition needed to generate a lasting memory. Combining the emerging Internet of Things and lifelogging sensors, we believe it is possible to build up a Digital Memory (Dig-Mem) in order to complement the fallible memory of people. This work shows how to realize the Dig-Mem in terms of interactions, affinities, activities, goals and protocols. We also complement this Dig-Mem with memory-aware services and a Dig-Mem browser. Furthermore, we propose a RFID Tag-Sharing technique to speed up the adoption of Dig-Mem. Experimentation reveals an improvement of the user understanding of Dig-Mem as time passes, compared to natural memories where the level of detail decreases over time. PMID:24196436
Signal bi-amplification in networks of unidirectionally coupled MEMS
NASA Astrophysics Data System (ADS)
Tchakui, Murielle Vanessa; Woafo, Paul; Colet, Pere
2016-01-01
The purpose of this paper is to analyze the propagation and the amplification of an input signal in networks of unidirectionally coupled micro-electro-mechanical systems (MEMS). Two types of external excitations are considered: sinusoidal and stochastic signals. We show that sinusoidal signals are amplified up to a saturation level which depends on the transmission rate and despite MEMS being nonlinear the sinusoidal shape is well preserved if the number of MEMS is not too large. However, increasing the number of MEMS, there is an instability that leads to chaotic behavior and which is triggered by the amplification of the harmonics generated by the nonlinearities. We also show that for stochastic input signals, the MEMS array acts as a band-pass filter and after just a few elements the signal has a narrow power spectra.
NASA Astrophysics Data System (ADS)
Orlianges, Jean-Christophe; Crunteanu, Aurelian; Pothier, Arnaud; Merle-Mejean, Therese; Blondy, Pierre; Champeaux, Corinne
2012-12-01
Titanium dioxide presents a wide range of technological application possibilities due to its dielectric, electrochemical, photocatalytic and optical properties. The three TiO2 allotropic forms: anatase, rutile and brookite are also interesting, since they exhibit different properties, stabilities and growth modes. For instance, rutile has a high dielectric permittivity, of particular interest for the integration as dielectric in components such as microelectromechanical systems (MEMS) for radio frequency (RF) devices. In this study, titanium dioxide thin films are deposited by pulsed laser deposition. Characterizations by Raman spectroscopy and X-ray diffraction show the evolution of the structural properties. Thin films optical properties are investigated using spectroscopic ellipsometry and transmission measurements from UV to IR range. Co-planar waveguide (CPW) devices are fabricated based on these films. Their performances are measured in the RF domain and compared to simulation, leading to relative permittivity values in the range 30-120, showing the potentialities of the deposited material for capacitive switches applications.
Micro thermal diode with glass thermal insulation structure embedded in a vapor chamber
NASA Astrophysics Data System (ADS)
Tsukamoto, Takashiro; Hirayanagi, Takashi; Tanaka, Shuji
2017-04-01
This paper reports a micro thermal diode based on one-way working fluid circulation driven by surface tension force. In forward mode, working fluid evaporates and condenses at a heated and cooled area, respectively, and the condensed liquid returns to the evaporation area due to the wettability difference. By this vapor-liquid phase change mechanism, the overall heat transfer coefficient becomes high. On the other hand, in reverse mode, no continuous evaporation-condensation cycle exists. The conductive heat loss in reverse mode was minimized by an embedded glass thermal isolation structure, which makes overall heat transfer coefficient low. The test device was made by a standard MEMS process combined with glass reflow and gold bump sealing. The overall heat transfer coefficients of 13 300 \\text{W}~{{\\text{m}}-2}~\\text{K} for forward mode and 4790 \\text{W}~{{\\text{m}}-2}~\\text{K} for reverse mode were measured. The performance index of the micro thermal diode was about 2.8.
A Molecularly Imprinted Polymer (MIP)-Coated Microbeam MEMS Sensor for Chemical Detection
2015-09-01
ARL-RP-0536 ● SEP 2015 US Army Research Laboratory A Molecularly Imprinted Polymer (MIP)- Coated Microbeam MEMS Sensor for...ARL-RP-0536 ● SEP 2015 US Army Research Laboratory A Molecularly Imprinted Polymer (MIP)- Coated Microbeam MEMS Sensor for Chemical...TITLE AND SUBTITLE A Molecularly Imprinted Polymer (MIP)-Coated Microbeam MEMS Sensor for Chemical Detection 5a. CONTRACT NUMBER 5b. GRANT NUMBER
MEMS/ECD Method for Making Bi(2-x)Sb(x)Te3 Thermoelectric Devices
NASA Technical Reports Server (NTRS)
Lim, James; Huang, Chen-Kuo; Ryan, Margaret; Snyder, G. Jeffrey; Herman, Jennifer; Fleurial, Jean-Pierre
2008-01-01
A method of fabricating Bi(2-x)Sb(x)Te3-based thermoelectric microdevices involves a combination of (1) techniques used previously in the fabrication of integrated circuits and of microelectromechanical systems (MEMS) and (2) a relatively inexpensive MEMS-oriented electrochemical-deposition (ECD) technique. The present method overcomes the limitations of prior MEMS fabrication techniques and makes it possible to satisfy requirements.
Development of a MEMS-Scale Turbomachinery Based Vacuum Pump
2012-06-01
MEMS -SCALE TURBOMACHINERY BASED VACUUM PUMP by Michael J. Shea June 2012 Thesis Advisor: Anthony J. Gannon Second Reader...June 2012 3. REPORT TYPE AND DATES COVERED Master’s Thesis 4. TITLE AND SUBTITLE Development of a MEMS -Scale Turbomachinery Based Vacuum Pump 5...to develop a MEMS scale turbomachinery based vacuum pump. This would allow very high vacuum to be drawn for handheld mass spectroscopy. This
Miniaturized GPS/MEMS IMU integrated board
NASA Technical Reports Server (NTRS)
Lin, Ching-Fang (Inventor)
2012-01-01
This invention documents the efforts on the research and development of a miniaturized GPS/MEMS IMU integrated navigation system. A miniaturized GPS/MEMS IMU integrated navigation system is presented; Laser Dynamic Range Imager (LDRI) based alignment algorithm for space applications is discussed. Two navigation cameras are also included to measure the range and range rate which can be integrated into the GPS/MEMS IMU system to enhance the navigation solution.
A MEMS-based, wireless, biometric-like security system
NASA Astrophysics Data System (ADS)
Cross, Joshua D.; Schneiter, John L.; Leiby, Grant A.; McCarter, Steven; Smith, Jeremiah; Budka, Thomas P.
2010-04-01
We present a system for secure identification applications that is based upon biometric-like MEMS chips. The MEMS chips have unique frequency signatures resulting from fabrication process variations. The MEMS chips possess something analogous to a "voiceprint". The chips are vacuum encapsulated, rugged, and suitable for low-cost, highvolume mass production. Furthermore, the fabrication process is fully integrated with standard CMOS fabrication methods. One is able to operate the MEMS-based identification system similarly to a conventional RFID system: the reader (essentially a custom network analyzer) detects the power reflected across a frequency spectrum from a MEMS chip in its vicinity. We demonstrate prototype "tags" - MEMS chips placed on a credit card-like substrate - to show how the system could be used in standard identification or authentication applications. We have integrated power scavenging to provide DC bias for the MEMS chips through the use of a 915 MHz source in the reader and a RF-DC conversion circuit on the tag. The system enables a high level of protection against typical RFID hacking attacks. There is no need for signal encryption, so back-end infrastructure is minimal. We believe this system would make a viable low-cost, high-security system for a variety of identification and authentication applications.
The Development of a Portable Hard Disk Encryption/Decryption System with a MEMS Coded Lock
Zhang, Weiping; Chen, Wenyuan; Tang, Jian; Xu, Peng; Li, Yibin; Li, Shengyong
2009-01-01
In this paper, a novel portable hard-disk encryption/decryption system with a MEMS coded lock is presented, which can authenticate the user and provide the key for the AES encryption/decryption module. The portable hard-disk encryption/decryption system is composed of the authentication module, the USB portable hard-disk interface card, the ATA protocol command decoder module, the data encryption/decryption module, the cipher key management module, the MEMS coded lock controlling circuit module, the MEMS coded lock and the hard disk. The ATA protocol circuit, the MEMS control circuit and AES encryption/decryption circuit are designed and realized by FPGA(Field Programmable Gate Array). The MEMS coded lock with two couplers and two groups of counter-meshing-gears (CMGs) are fabricated by a LIGA-like process and precision engineering method. The whole prototype was fabricated and tested. The test results show that the user's password could be correctly discriminated by the MEMS coded lock, and the AES encryption module could get the key from the MEMS coded lock. Moreover, the data in the hard-disk could be encrypted or decrypted, and the read-write speed of the dataflow could reach 17 MB/s in Ultra DMA mode. PMID:22291566
Design and simulation of multi-color infrared CMOS metamaterial absorbers
NASA Astrophysics Data System (ADS)
Cheng, Zhengxi; Chen, Yongping; Ma, Bin
2016-05-01
Metamaterial electromagnetic wave absorbers, which usually can be fabricated in a low weight thin film structure, have a near unity absorptivity in a special waveband, and therefore have been widely applied from microwave to optical waveband. To increase absorptance of CMOS MEMS devices in 2-5 μmm waveband, multi-color infrared metamaterial absorbers are designed with CSMC 0.5 μmm 2P3M and 0.18 μmm 1P6M CMOS technology in this work. Metal-insulator-metal (MIM) three-layer MMAs and Insulator-metal-insulator-metal (MIMI) four-layer MMAs are formed by CMOS metal interconnect layers and inter metal dielectrics layer. To broaden absorption waveband in 2-5μmm range, MMAs with a combination of different sizes cross bars are designed. The top metal layer is a periodic aluminum square array or cross bar array with width ranging from submicron to several microns. The absorption peak position and intensity of MMAs can be tuned by adjusting the top aluminum micro structure array. Post-CMOS process is adopted to fabricate MMAs. The infrared absorption spectra of MMAs are verified with finite element method simulation, and the effects of top metal structure sizes, patterns, and films thickness are also simulated and intensively discussed. The simulation results show that CMOS MEMS MMAs enhance infrared absorption in 2-20 μmm. The MIM broad MMA has an average absorptance of 0.22 in 2-5 μmm waveband, and 0.76 in 8-14 μm waveband. The CMOS metamaterial absorbers can be inherently integrated in many kinds of MEMS devices fabricated with CMOS technology, such as uncooled bolometers, infrared thermal emitters.
Evaluation of Air Coupled Ultrasound for Composite Aerospace Structure
NASA Astrophysics Data System (ADS)
Tat, H.; Georgeson, G.; Bossi, R.
2009-03-01
Non-contact air coupled ultrasound suffers from the high acoustic impedance mismatch characteristics of air to solid interfaces. Advances in transducer technology, particularly MEMS, have improved the acoustic impedance match at the transmission stage and the signal to noise at the reception stage. Comparisons of through transmission (TTU) scanning of laminate and honeycomb test samples using conventional piezoelectric air coupled transducers, new MEMS air coupled transducers, and standard water coupled inspections have been performed to assess the capability. An additional issue for air coupled UT inspection is the need for a lean implementation for both manufacturing and in-service operations. Concepts and applications utilizing magnetic coupling of transducers have been developed that allows air coupled inspection operations in compact low cost configurations.
Design and Analyses of a MEMS Based Resonant Magnetometer
Ren, Dahai; Wu, Lingqi; Yan, Meizhi; Cui, Mingyang; You, Zheng; Hu, Muzhi
2009-01-01
A novel design of a MEMS torsional resonant magnetometer based on Lorentz force is presented and fabricated. The magnetometer consists of a silicon resonator, torsional beam, excitation coil, capacitance plates and glass substrate. Working in a resonant condition, the sensor’s vibration amplitude is converted into the sensing capacitance change, which reflects the outside magnetic flux-density. Based on the simulation, the key structure parameters are optimized and the air damping effect is estimated. The test results of the prototype are in accordance with the simulation results of the designed model. The resolution of the magnetometer can reach 30 nT. The test results indicate its sensitivity of more than 400 mV/μT when operating in a 10 Pa vacuum environment. PMID:22399981
MEMS based hair flow-sensors as model systems for acoustic perception studies
NASA Astrophysics Data System (ADS)
Krijnen, Gijs J. M.; Dijkstra, Marcel; van Baar, John J.; Shankar, Siripurapu S.; Kuipers, Winfred J.; de Boer, Rik J. H.; Altpeter, Dominique; Lammerink, Theo S. J.; Wiegerink, Remco
2006-02-01
Arrays of MEMS fabricated flow sensors inspired by the acoustic flow-sensitive hairs found on the cerci of crickets have been designed, fabricated and characterized. The hairs consist of up to 1 mm long SU-8 structures mounted on suspended membranes with normal translational and rotational degrees of freedom. Electrodes on the membrane and on the substrate form variable capacitors, allowing for capacitive read-out. Capacitance versus voltage, frequency dependence and directional sensitivity measurements have been successfully carried out on fabricated sensor arrays, showing the viability of the concept. The sensors form a model system allowing for investigations on sensory acoustics by their arrayed nature, their adaptivity via electrostatic interaction (frequency tuning and parametric amplification) and their susceptibility to noise (stochastic resonance).
MEMS tunable optical filter based on multi-ring resonator
DOE Office of Scientific and Technical Information (OSTI.GOV)
Dessalegn, Hailu, E-mail: hailudessalegn@yahoo.com, E-mail: tsrinu@ece.iisc.ernet.in; Srinivas, T., E-mail: hailudessalegn@yahoo.com, E-mail: tsrinu@ece.iisc.ernet.in
We propose a novel MEMS tunable optical filter with a flat-top pass band based on multi-ring resonator in an electrostatically actuated microcantilever for communication application. The filter is basically structured on a microcantilever beam and built in optical integrated ring resonator which is placed in one end of the beam to gain maximum stress on the resonator. Thus, when a DC voltage is applied, the beam will bend, that induces a stress and strain in the ring, which brings a change in refractive index and perimeter of the rings leading to change in the output spectrum shift, providing the tenabilitymore » as high as 0.68nm/μN and it is capable of tuning up to 1.7nm.« less
Review of MEMS differential scanning calorimetry for biomolecular study
NASA Astrophysics Data System (ADS)
Yu, Shifeng; Wang, Shuyu; Lu, Ming; Zuo, Lei
2017-12-01
Differential scanning calorimetry (DSC) is one of the few techniques that allow direct determination of enthalpy values for binding reactions and conformational transitions in biomolecules. It provides the thermodynamics information of the biomolecules which consists of Gibbs free energy, enthalpy and entropy in a straightforward manner that enables deep understanding of the structure function relationship in biomolecules such as the folding/unfolding of protein and DNA, and ligand bindings. This review provides an up to date overview of the applications of DSC in biomolecular study such as the bovine serum albumin denaturation study, the relationship between the melting point of lysozyme and the scanning rate. We also introduce the recent advances of the development of micro-electro-mechanic-system (MEMS) based DSCs.
NASA Astrophysics Data System (ADS)
Sokolov, Leonid V.
2010-08-01
There is a need of measuring distributed pressure on the aircraft engine inlet with high precision within a wide operating temperature range in the severe environment to improve the efficiency of aircraft engine control. The basic solutions and principles of designing high-temperature (to 523K) microelectromechanical pressure sensors based on a membrane-type SOI heterostructure with a monolithic integral tensoframe (MEMS-SOIMT) are proposed in accordance with the developed concept, which excludes the use of electric p-n junctions in semiconductor microelectromechanical sensors. The MEMS-SOIMT technology relies on the group processes of microelectronics and micromechanics for high-precision microprofiling of a three-dimension micromechanical structure, which exclude high-temperature silicon doping processes.
NASA Astrophysics Data System (ADS)
Fishlock, S. J.; O'Shea, S. J.; McBride, J. W.; Chong, H. M. H.; Pu, S. H.
2017-09-01
The simulation, fabrication and characterisation of nanographite MEMS resonators is reported in this paper. The deposition of nanographite is achieved using plasma-enhanced chemical vapour deposition directly onto numerous substrates such as commercial silicon wafers. As a result, many of the reliability issues of devices based on transferred graphene are avoided. The fabrication of the resonators is presented along with a simple undercutting method to overcome buckling, by changing the effective stress of the structure from ~436 MPa compressive, to ~13 MPa tensile. The characterisation of the resonators using electrostatic actuation and laser Doppler vibrometry is reported, demonstrating resonator frequencies from 5-640 kHz and quality factor above 1819 in vacuum obtained.
Method for integrating microelectromechanical devices with electronic circuitry
Barron, Carole C.; Fleming, James G.; Montague, Stephen
1999-01-01
A method is disclosed for integrating one or more microelectromechanical (MEM) devices with electronic circuitry on a common substrate. The MEM device can be fabricated within a substrate cavity and encapsulated with a sacrificial material. This allows the MEM device to be annealed and the substrate planarized prior to forming electronic circuitry on the substrate using a series of standard processing steps. After fabrication of the electronic circuitry, the electronic circuitry can be protected by a two-ply protection layer of titanium nitride (TiN) and tungsten (W) during an etch release process whereby the MEM device is released for operation by etching away a portion of a sacrificial material (e.g. silicon dioxide or a silicate glass) that encapsulates the MEM device. The etch release process is preferably performed using a mixture of hydrofluoric acid (HF) and hydrochloric acid (HCI) which reduces the time for releasing the MEM device compared to use of a buffered oxide etchant. After release of the MEM device, the TiN:W protection layer can be removed with a peroxide-based etchant without damaging the electronic circuitry.
NASA Astrophysics Data System (ADS)
Livermore, C.; Velásquez-García, L. F.
2015-12-01
Greetings, and welcome to Boston, MA and PowerMEMS 2015 - the 15th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications! The objective of PowerMEMS 2015 is to catalyze innovation in micro- and nano-scale technologies for the energy domain. The scope of the meeting ranges from basic principles, to materials and fabrication, to devices and systems, to applications. The many applications of Power MEMS range from the harvesting, storage, conversion and conditioning of energy, to integrated systems that manage these processes, to actuation, pumping, and propulsion. Our Conference aims to stimulate the exchange of insights and information, as well as the development of new ideas, in the Power MEMS field. Our goal is to allow the attendees to interact and network within our multidisciplinary community that includes professionals from many branches of science and engineering, as well as energy, policy, and entrepreneurial specialists interested in the commercialization of Power MEMS technologies. Since the first PowerMEMS in Sendai, Japan in 2000, the Conference has grown in size, reputation, impact, and technical breadth. This continuing growth is evident in this year's technical program, which includes an increasing number of papers on nanomaterials, additive manufacturing for energy systems, actuators, energy storage, harvesting strategies and integrated energy harvesting systems, for example. This year's technical program is highlighted by six plenary talks from prominent experts on piezoelectrics, robotic insects, thermoelectrics, photovoltaics, nanocomposite cathodes, and thermal energy conversion systems. The contributed program received a large number of abstract submissions this year, 169 in total. After careful review by the 34-member Technical Program Committee, a total of 135 papers were selected for presentation. The 60 contributed oral presentations are arranged in two parallel sessions. The 75 posters are arranged in a ''two-in-one'' poster session in which the poster session time is divided in two; half the posters will be presented during each half-session, allowing the poster presenters to also browse the posters during the poster session. Posters will remain up during the meeting, so please feel free to peruse them at your leisure. The Proceedings will be visible and accessible through IOP after conclusion of the Conference. We hope to maximize interaction among participants and stimulate lively discussion through the technical program and social events. For the first time at the Conference, a great many sponsors are making their presence known at PowerMEMS through tabletop displays, which will catalyze engaging conversations between our industrial partners and the research community. Also, for the first time at PowerMEMS, we will host a Rump Session - an informal event in which Conference participants engage in honest and fun discussions of topics of relevance to the community while strengthening bonds within the community. This meeting is made possible by many generous contributions of time, effort, and financial support. Thanks are due to the Technical Program Committee for their intensive efforts in reviewing abstract submissions, and to the International Steering Committee for their advice and support. We are grateful to Preferred Meeting Management Inc. for their many and key contributions to the management and organization of our Conference. Finally, we gratefully acknowledge the organizational and financial support provided for this meeting by the Transducers Research Foundation, Northeastern University, the Massachusetts Institute of Technology, and our exhibitors and other supporters. We hope that you find our Conference enjoyable and fruitful, and that you enjoy your stay in the Boston, MA area.
Electronic structure and bonding interactions in Ba1- x Sr x Zr0.1Ti0.9O3 ceramics
NASA Astrophysics Data System (ADS)
Mangaiyarkkarasi, Jegannathan; Sasikumar, Subramanian; Saravanan, Olai Vasu; Saravanan, Ramachandran
2017-06-01
An investigation on the precise electronic structure and bonding interactions has been carried out on Ba1- x Sr x Zr0.1Ti0.9O3 (short for BSZT, x = 0, 0.05, 0.07 and 0.14) ceramic systems prepared via high-temperature solid state reaction technique. The influence of Sr doping on the BSZT structure has been examined by characterizing the prepared samples using PXRD, UV-visible spectrophotometry, SEM and EDS. Powder profile refinement of X-ray data confirms that all the synthesized samples have been crystallized in cubic perovskite structure with single phase. Charge density distribution of the BSZT systems has been completely analyzed by the maximum entropy method (MEM). Co-substitution of Sr at the Ba site and Zr at the Ti site into the BaTiO3 structure presents the ionic nature between Ba and O ions and the covalent nature between Ti and O ions, revealed from MEM calculations. Optical band gap values have been evaluated from UV-visible absorption spectra. Particles with irregular shapes and well defined grain boundaries are clearly visualized from SEM images. The phase purity of the prepared samples is further confirmed by EDS qualitative spectral analysis.