Micro-battery Development for Juvenile Salmon Acoustic Telemetry System Applications

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chen, Honghao; Cartmell, Samuel S.; Wang, Qiang

2014-01-21

The Juvenile Salmon Acoustic Telemetry System (JSATS) project supported by the U.S. Army Corps of Engineers, Portland District, has yielded the smallest acoustic fish tag transmitter commercially available to date. In order to study even smaller fish populations and make the transmitter injectable by needles, the JSATS acoustic micro transmitter needs to be further downsized. This study focuses on the optimization of microbattery design based on Li/CFx chemistry. Through appropriate modifications, a steady high-rate pulse current with desirable life time has been achieved while the weight and volume of the battery is largely reduced. The impedance variation in as-designed microbatteriesmore » is systematically compared with that of currently used watch batteries in JSATS with an attempt to understand the intrinsic factors that control the performances of microbatteries under the real testing environments.« less

Design and simulation of GaN based Schottky betavoltaic nuclear micro-battery.

PubMed

San, Haisheng; Yao, Shulin; Wang, Xiang; Cheng, Zaijun; Chen, Xuyuan

2013-10-01

The current paper presents a theoretical analysis of Ni-63 nuclear micro-battery based on a wide-band gap semiconductor GaN thin-film covered with thin Ni/Au films to form Schottky barrier for carrier separation. The total energy deposition in GaN was calculated using Monte Carlo methods by taking into account the full beta spectral energy, which provided an optimal design on Schottky barrier width. The calculated results show that an 8 μm thick Schottky barrier can collect about 95% of the incident beta particle energy. Considering the actual limitations of current GaN growth technique, a Fe-doped compensation technique by MOCVD method can be used to realize the n-type GaN with a carrier concentration of 1×10(15) cm(-3), by which a GaN based Schottky betavoltaic micro-battery can achieve an energy conversion efficiency of 2.25% based on the theoretical calculations of semiconductor device physics. Copyright © 2013 Elsevier Ltd. All rights reserved.

In-situ deposition of sodium titanate thin film as anode for sodium-ion micro-batteries developed by pulsed laser deposition.

PubMed

Rambabu, A; Senthilkumar, B; Sada, K; Krupanidhi, S B; Barpanda, P

2018-03-15

Sodium-ion thin-film micro-batteries form a niche sector of energy storage devices. Sodium titanate, Na 2 Ti 6 O 13 (NTO) thin films were deposited by pulsed laser deposition (PLD) using solid-state synthesized polycrystalline Na 2 Ti 6 O 13 compound. The phase-purity and crystallinity of NTO in bulk and thin-film forms were confirmed by Rietveld refinement. Electron microscopy and atomic force microscopy revealed the formation of uniform ∼100 nm thin film with roughness of ∼4 nm consisting of homogeneous nanoscale grains. These PLD-deposited NTO thin-films, when tested in Na-half cell architecture, delivered a near theoretical reversible capacity close to 42 mA h g -1 involving Ti 4+ /Ti 3+ redox activity along with good cycling stability and rate kinetics. Na 2 Ti 6 O 13 can work as an efficient and safe anode in designing sodium-ion thin-film micro-batteries. Copyright © 2017 Elsevier Inc. All rights reserved.

Architecturing hierarchical function layers on self-assembled viral templates as 3D nano-array electrodes for integrated Li-ion microbatteries.

PubMed

Liu, Yihang; Zhang, Wei; Zhu, Yujie; Luo, Yanting; Xu, Yunhua; Brown, Adam; Culver, James N; Lundgren, Cynthia A; Xu, Kang; Wang, Yuan; Wang, Chunsheng

2013-01-09

This work enables an elegant bottom-up solution to engineer 3D microbattery arrays as integral power sources for microelectronics. Thus, multilayers of functional materials were hierarchically architectured over tobacco mosaic virus (TMV) templates that were genetically modified to self-assemble in a vertical manner on current-collectors, so that optimum power and energy densities accompanied with excellent cycle-life could be achieved on a minimum footprint. The resultant microbattery based on self-aligned LiFePO(4) nanoforests of shell-core-shell structure, with precise arrangement of various auxiliary material layers including a central nanometric metal core as direct electronic pathway to current collector, delivers excellent energy density and stable cycling stability only rivaled by the best Li-ion batteries of conventional configurations, while providing rate performance per foot-print and on-site manufacturability unavailable from the latter. This approach could open a new avenue for microelectromechanical systems (MEMS) applications, which would significantly benefit from the concept that electrochemically active components be directly engineered and fabricated as an integral part of the integrated circuit (IC).

Holographic Patterning of High Performance on-chip 3D Lithium-ion Microbatteries

DOE PAGES

Ning, Hailong; Pikul, James H.; Wang, Runyu; ...

2015-05-11

As sensors, wireless communication devices, personal health monitoring systems, and autonomous microelectromechanical systems (MEMS) become distributed and smaller, there is an increasing demand for miniaturized integrated power sources. Although thin-film batteries are well-suited for on-chip integration, their energy and power per unit area are limited. Three-dimensional electrode designs have potential to offer much greater power and energy per unit area; however, efforts to date to realize 3D microbatteries have led to prototypes with solid electrodes (and therefore low power) or mesostructured electrodes not compatible with manufacturing or on-chip integration. Here in this paper, we demonstrate an on-chip compatible method tomore » fabricate high energy density (6.5 μWh cm -2∙μm -1) 3D mesostructured Li-ion microbatteries based on LiMnO 2 cathodes, and NiSn anodes that possess supercapacitor-like power (3,600 μW cm(-2)∙μm(-1) peak). The mesostructured electrodes are fabricated by combining 3D holographic lithography with conventional photolithography, enabling deterministic control of both the internal electrode mesostructure and the spatial distribution of the electrodes on the substrate. The resultant full cells exhibit impressive performances, for example a conventional light-emitting diode (LED) is driven with a 500-μA peak current (600-C discharge) from a 10-μm-thick microbattery with an area of 4 mm 2 for 200 cycles with only 12% capacity fade. Lastly, a combined experimental and modeling study where the structural parameters of the battery are modulated illustrates the unique design flexibility enabled by 3D holographic lithography and provides guidance for optimization for a given application.« less

Holographic patterning of high-performance on-chip 3D lithium-ion microbatteries

PubMed Central

Ning, Hailong; Pikul, James H.; Zhang, Runyu; Li, Xuejiao; Xu, Sheng; Wang, Junjie; Rogers, John A.; King, William P.; Braun, Paul V.

2015-01-01

As sensors, wireless communication devices, personal health monitoring systems, and autonomous microelectromechanical systems (MEMS) become distributed and smaller, there is an increasing demand for miniaturized integrated power sources. Although thin-film batteries are well-suited for on-chip integration, their energy and power per unit area are limited. Three-dimensional electrode designs have potential to offer much greater power and energy per unit area; however, efforts to date to realize 3D microbatteries have led to prototypes with solid electrodes (and therefore low power) or mesostructured electrodes not compatible with manufacturing or on-chip integration. Here, we demonstrate an on-chip compatible method to fabricate high energy density (6.5 μWh cm−2⋅μm−1) 3D mesostructured Li-ion microbatteries based on LiMnO2 cathodes, and NiSn anodes that possess supercapacitor-like power (3,600 μW cm−2⋅μm−1 peak). The mesostructured electrodes are fabricated by combining 3D holographic lithography with conventional photolithography, enabling deterministic control of both the internal electrode mesostructure and the spatial distribution of the electrodes on the substrate. The resultant full cells exhibit impressive performances, for example a conventional light-emitting diode (LED) is driven with a 500-μA peak current (600-C discharge) from a 10-μm-thick microbattery with an area of 4 mm2 for 200 cycles with only 12% capacity fade. A combined experimental and modeling study where the structural parameters of the battery are modulated illustrates the unique design flexibility enabled by 3D holographic lithography and provides guidance for optimization for a given application. PMID:25964360

Heat Stress Monitor

NASA Technical Reports Server (NTRS)

1994-01-01

The heavy, cumbersome body protection suits worn by members of hazardous materials response teams cause marked elevation of body temperatures, which can reduce effectiveness and lead to heat stress and injury. The CorTemp System, marketed by Human Technologies, Inc., provides the basis for a body temperature monitoring alarm system. Encased in a three-quarter-inch ingestible capsule, the system includes a mini-thermometer, miniature telemetry system, a microbattery and temperature sensor. It makes its way through the digestive system, continuously monitoring temperature. Findings are sent to the recorder by telemetry, and then displayed and stored for transfer to a computer.

Electrodeposition of polymer electrolyte in nanostructured electrodes for enhanced electrochemical performance of thin-film Li-ion microbatteries

NASA Astrophysics Data System (ADS)

Salian, Girish D.; Lebouin, Chrystelle; Demoulin, A.; Lepihin, M. S.; Maria, S.; Galeyeva, A. K.; Kurbatov, A. P.; Djenizian, Thierry

2017-02-01

We report that electrodeposition of polymer electrolyte in nanostructured electrodes has a strong influence on the electrochemical properties of thin-film Li-ion microbatteries. Electropolymerization of PMMA-PEG (polymethyl methacrylate-polyethylene glycol) was carried out on both the anode (self-supported titania nanotubes) and the cathode (porous LiNi0.5Mn1.5O4) by cyclic voltammetry and the resulting electrode-electrolyte interface was examined by scanning electron microscopy. The electrochemical characterizations performed by galvanostatic experiments reveal that the capacity values obtained at different C-rates are doubled when the electrodes are completely filled by the polymer electrolyte.

Electra-optical device including a nitrogen containing electrolyte

DOEpatents

Bates, J.B.; Dudney, N.J.; Gruzalski, G.R.; Luck, C.F.

1995-10-03

Described is a thin-film battery, especially a thin-film microbattery, and a method for making same having application as a backup or primary integrated power source for electronic devices. The battery includes a novel electrolyte which is electrochemically stable and does not react with the lithium anode and a novel vanadium oxide cathode. Configured as a microbattery, the battery can be fabricated directly onto a semiconductor chip, onto the semiconductor die or onto any portion of the chip carrier. The battery can be fabricated to any specified size or shape to meet the requirements of a particular application. The battery is fabricated of solid state materials and is capable of operation between {minus}15 C and 150 C.

Cathode for an electrochemical cell

DOEpatents

Bates, John B.; Dudney, Nancy J.; Gruzalski, Greg R.; Luck, Christopher F.

2001-01-01

Described is a thin-film battery, especially a thin-film microbattery, and a method for making same having application as a backup or primary integrated power source for electronic devices. The battery includes a novel electrolyte which is electrochemically stable and does not react with the lithium anode and a novel vanadium oxide cathode. Configured as a microbattery, the battery can be fabricated directly onto a semiconductor chip, onto the semiconductor die or onto any portion of the chip carrier. The battery can be fabricated to any specified size or shape to meet the requirements of a particular application. The battery is fabricated of solid state materials and is capable of operation between -15.degree. C. and 150.degree. C.

Method for making an electrochemical cell

DOEpatents

Bates, John B.; Dudney, Nancy J.

1996-01-01

Described is a thin-film battery, especially a thin-film microbattery, and a method for making same having application as a backup or primary integrated power source for electronic devices. The battery includes a novel electrolyte which is electrochemically stable and does not react with the lithium anode and a novel vanadium oxide cathode Configured as a microbattery, the battery can be fabricated directly onto a semiconductor chip, onto the semiconductor die or onto any portion of the chip carrier. The battery can be fabricated to any specified size or shape to meet the requirements of a particular application. The battery is fabricated of solid state materials and is capable of operation between -15.degree. C. and 150.degree. C.

Electrical Stimulation Technologies for Wound Healing

PubMed Central

Kloth, Luther C.

2014-01-01

Objective: To discuss the physiological bases for using exogenously applied electric field (EF) energy to enhance wound healing with conductive electrical stimulation (ES) devices. Approach: To describe the types of electrical currents that have been reported to enhance chronic wound-healing rate and closure. Results: Commercial ES devices that generate direct current (DC), and mono and biphasic pulsed current waveforms represent the principal ES technologies which are reported to enhance wound healing. Innovation: Wafer-thin, disposable ES technologies (wound dressings) that utilize mini or micro-batteries to deliver low-level DC for wound healing and antibacterial wound-treatment purposes are commercially available. Microfluidic wound-healing chips are currently being used with greater accuracy to investigate the EF effects on cellular electrotaxis. Conclusion: Numerous clinical trials described in subsequent sections of this issue have demonstrated that ES used adjunctively with standard wound care (SWC), enhances wound healing rate faster than SWC alone. PMID:24761348

Remote radio control of insect flight.

PubMed

Sato, Hirotaka; Berry, Christopher W; Peeri, Yoav; Baghoomian, Emen; Casey, Brendan E; Lavella, Gabriel; Vandenbrooks, John M; Harrison, Jon F; Maharbiz, Michel M

2009-01-01

We demonstrated the remote control of insects in free flight via an implantable radio-equipped miniature neural stimulating system. The pronotum mounted system consisted of neural stimulators, muscular stimulators, a radio transceiver-equipped microcontroller and a microbattery. Flight initiation, cessation and elevation control were accomplished through neural stimulus of the brain which elicited, suppressed or modulated wing oscillation. Turns were triggered through the direct muscular stimulus of either of the basalar muscles. We characterized the response times, success rates, and free-flight trajectories elicited by our neural control systems in remotely controlled beetles. We believe this type of technology will open the door to in-flight perturbation and recording of insect flight responses.

NASA Tech Briefs, February 2008

NASA Technical Reports Server (NTRS)

2008-01-01

Topics discussed include: Optical Measurement of Mass Flow of a Two-Phase Fluid; Selectable-Tip Corrosion-Testing Electrochemical Cell; Piezoelectric Bolt Breakers and Bolt Fatigue Testers; Improved Measurement of B(sub 22) of Macromolecules in a Flow Cell; Measurements by a Vector Network Analyzer at 325 to 508 GHz; Using Light to Treat Mucositis and Help Wounds Heal; Increasing Discharge Capacities of Li-(CF)(sub n) Cells; Dot-in-Well Quantum-Dot Infrared Photodetectors; Integrated Microbatteries for Implantable Medical Devices; Oxidation Behavior of Carbon Fiber-Reinforced Composites; GIDEP Batching Tool; Generic Spacecraft Model for Real-Time Simulation; Parallel-Processing Software for Creating Mosaic Images; Software for Verifying Image-Correlation Tie Points; Flexcam Image Capture Viewing and Spot Tracking; Low-Pt-Content Anode Catalyst for Direct Methanol Fuel Cells; Graphite/Cyanate Ester Face Sheets for Adaptive Optics; Atomized BaF2-CaF7 for Better-Flowing Plasma-Spray Feedstock; Nanophase Nickel-Zirconium Alloys for Fuel Cells; Vacuum Packaging of MEMS With Multiple Internal Seal Rings; Compact Two-Dimensional Spectrometer Optics; and Fault-Tolerant Coding for State Machines.

Electra-optical device including a nitrogen containing electrolyte

DOEpatents

Bates, John B.; Dudney, Nancy J.; Gruzalski, Greg R.; Luck, Christopher F.

1995-01-01

Described is a thin-film battery, especially a thin-film microbattery, and a method for making same having application as a backup or primary integrated power source for electronic devices. The battery includes a novel electrolyte which is electrochemically stable and does not react with the lithium anode and a novel vanadium oxide cathode Configured as a microbattery, the battery can be fabricated directly onto a semiconductor chip, onto the semiconductor die or onto any portion of the chip carrier. The battery can be fabricated to any specified size or shape to meet the requirements of a particular application. The battery is fabricated of solid state materials and is capable of operation between -15.degree. C. and 150.degree. C.

Electrolyte for an electrochemical cell

DOEpatents

Bates, John B.; Dudney, Nancy J.

1997-01-01

Described is a thin-film battery, especially a thin-film microbattery, and a method for making same having application as a backup or primary integrated power source for electronic devices. The battery includes a novel electrolyte amorphous lithium phosphorus oxynitride which is electrochemically stable and does not react with the lithium anode and a novel vanadium oxide cathode Configured as a microbattery, the battery can be fabricated directly onto a semiconductor chip, onto the semiconductor die or onto any portion of the chip carrier. The battery can be fabricated to any specified size or shape to meet the requirements of a particular application. The battery is fabricated of solid state materials and is capable of operation between -15.degree. C. and 150.degree. C.

Electrolyte for an electrochemical cell

DOEpatents

Bates, J.B.; Dudney, N.J.

1997-01-28

Described is a thin-film battery, especially a thin-film microbattery, and a method for making the same having application as a backup or primary integrated power source for electronic devices. The battery includes a novel electrolyte amorphous lithium phosphorus oxynitride which is electrochemically stable and does not react with the lithium anode and a novel vanadium oxide cathode Configured as a microbattery, the battery can be fabricated directly onto a semiconductor chip, onto the semiconductor die or onto any portion of the chip carrier. The battery can be fabricated to any specified size or shape to meet the requirements of a particular application. The battery is fabricated of solid state materials and is capable of operation between {minus}15 C and 150 C. 9 figs.

Method of making an electrolyte for an electrochemical cell

DOEpatents

Bates, J.B.; Dudney, N.J.

1996-04-30

Described is a thin-film battery, especially a thin-film microbattery, and a method for making same having application as a backup or primary integrated power source for electronic devices. The battery includes a novel electrolyte which is electrochemically stable and does not react with the lithium anode and a novel vanadium oxide cathode. Configured as a microbattery, the battery can be fabricated directly onto a semiconductor chip, onto the semiconductor die or onto any portion of the chip carrier. The battery can be fabricated to any specified size or shape to meet the requirements of a particular application. The battery is fabricated of solid state materials and is capable of operation between {minus}15 C and 150 C. 9 figs.

Method of making an electrolyte for an electrochemical cell

DOEpatents

Bates, John B.; Dudney, Nancy J.

1996-01-01

Described is a thin-film battery, especially a thin-film microbattery, and a method for making same having application as a backup or primary integrated power source for electronic devices. The battery includes a novel electrolyte which is electrochemically stable and does not react with the lithium anode and a novel vanadium oxide cathode Configured as a microbattery, the battery can be fabricated directly onto a semiconductor chip, onto the semiconductor die or onto any portion of the chip carrier. The battery can be fabricated to any specified size or shape to meet the requirements of a particular application. The battery is fabricated of solid state materials and is capable of operation between -15.degree. C. and 150.degree. C.

Method for making an electrochemical cell

DOEpatents

Bates, J.B.; Dudney, N.J.

1996-10-22

Described is a thin-film battery, especially a thin-film microbattery, and a method for making the same, having application as a backup or primary integrated power source for electronic devices. The battery includes a novel electrolyte which is electrochemically stable and does not react with the lithium anode and a novel vanadium oxide cathode. Configured as a microbattery, the battery can be fabricated directly onto a semiconductor chip, onto the semiconductor die or onto any portion of the chip carrier. The battery can be fabricated to any specified size or shape to meet the requirements of a particular application. The battery is fabricated of solid state materials and is capable of operation between {minus}15 C and 150 C. 9 figs.

Thin film battery and method for making same

DOEpatents

Bates, J.B.; Dudney, N.J.; Gruzalski, G.R.; Luck, C.F.

1994-08-16

Described is a thin-film battery, especially a thin-film microbattery, and a method for making same having application as a backup or primary integrated power source for electronic devices. The battery includes a novel electrolyte which is electrochemically stable and does not react with the lithium anode and a novel vanadium oxide cathode. Configured as a microbattery, the battery can be fabricated directly onto a semiconductor chip, onto the semiconductor die or onto any portion of the chip carrier. The battery can be fabricated to any specified size or shape to meet the requirements of a particular application. The battery is fabricated of solid state materials and is capable of operation between [minus]15 C and 150 C. 9 figs.

Thin film battery and method for making same

DOEpatents

Bates, John B.; Dudney, Nancy J.; Gruzalski, Greg R.; Luck, Christopher F.

1994-01-01

Described is a thin-film battery, especially a thin-film microbattery, and a method for making same having application as a backup or primary integrated power source for electronic devices. The battery includes a novel electrolyte which is electrochemically stable and does not react with the lithium anode and a novel vanadium oxide cathode Configured as a microbattery, the battery can be fabricated directly onto a semiconductor chip, onto the semiconductor die or onto any portion of the chip carrier. The battery can be fabricated to any specified size or shape to meet the requirements of a particular application. The battery is fabricated of solid state materials and is capable of operation between -15.degree. C. and 150.degree. C.

Atomic layer deposition of lithium phosphates as solid-state electrolytes for all-solid-state microbatteries

NASA Astrophysics Data System (ADS)

Wang, Biqiong; Liu, Jian; Sun, Qian; Li, Ruying; Sham, Tsun-Kong; Sun, Xueliang

2014-12-01

Atomic layer deposition (ALD) has been shown as a powerful technique to build three-dimensional (3D) all-solid-state microbattery, because of its unique advantages in fabricating uniform and pinhole-free thin films in 3D structures. The development of solid-state electrolyte by ALD is a crucial step to achieve the fabrication of 3D all-solid-state microbattery by ALD. In this work, lithium phosphate solid-state electrolytes were grown by ALD at four different temperatures (250, 275, 300, and 325 °C) using two precursors (lithium tert-butoxide and trimethylphosphate). A linear dependence of film thickness on ALD cycle number was observed and uniform growth was achieved at all four temperatures. The growth rate was 0.57, 0.66, 0.69, and 0.72 Å/cycle at deposition temperatures of 250, 275, 300, and 325 °C, respectively. Furthermore, x-ray photoelectron spectroscopy confirmed the compositions and chemical structures of lithium phosphates deposited by ALD. Moreover, the lithium phosphate thin films deposited at 300 °C presented the highest ionic conductivity of 1.73 × 10-8 S cm-1 at 323 K with ˜0.51 eV activation energy based on the electrochemical impedance spectroscopy. The ionic conductivity was calculated to be 3.3 × 10-8 S cm-1 at 26 °C (299 K).

Improved Fabrication of Lithium Films Having Micron Features

NASA Technical Reports Server (NTRS)

Whitacre, Jay

2006-01-01

An improved method has been devised for fabricating micron-dimension Li features. This approach is intended for application in the fabrication of lithium-based microelectrochemical devices -- particularly solid-state thin-film lithium microbatteries.

Microbatteries for Combinatorial Studies of Conventional Lithium-Ion Batteries

NASA Technical Reports Server (NTRS)

West, William; Whitacre, Jay; Bugga, Ratnakumar

2003-01-01

Integrated arrays of microscopic solid-state batteries have been demonstrated in a continuing effort to develop microscopic sources of power and of voltage reference circuits to be incorporated into low-power integrated circuits. Perhaps even more importantly, arrays of microscopic batteries can be fabricated and tested in combinatorial experiments directed toward optimization and discovery of battery materials. The value of the combinatorial approach to optimization and discovery has been proven in the optoelectronic, pharmaceutical, and bioengineering industries. Depending on the specific application, the combinatorial approach can involve the investigation of hundreds or even thousands of different combinations; hence, it is time-consuming and expensive to attempt to implement the combinatorial approach by building and testing full-size, discrete cells and batteries. The conception of microbattery arrays makes it practical to bring the advantages of the combinatorial approach to the development of batteries.

Fabrication and demonstration of high energy density lithium ion microbatteries

NASA Astrophysics Data System (ADS)

Sun, Ke

Since their commercialization by Sony two decades ago, Li-ion batteries have only experienced mild improvement in energy and power performance, which remains one of the main hurdles for their widespread implementation in applications outside of powering compact portable devices, such as in electric vehicles. Li-ion batteries must be advanced through a disruptive technological development or a series of incremental improvements in chemistry and design in order to be competitive enough for advanced applications. As it will be introduced in this work, achieving this goal by new chemistries and chemical modifications does not seem to be promising in the short term, so efforts to fully optimize existing systems must be pursued at in parallel. This optimization must be mainly relying on the modification and optimizations of micro and macro structures of current battery systems. This kind of battery architecture study will be even more important when small energy storage devices are desired to power miniaturized and autonomous gadgets, such as MEMs, micro-robots, biomedical sensors, etc. In this regime, the limited space available makes requirements on electrode architecture more stringent and the assembly process more challenging. Therefore, the study of battery assembly strategies for Li-ion microbatteries will benefit not only micro-devices but also the development of more powerful and energetic large scale battery systems based on available chemistries. In chapter 2, preliminary research related to the mechanism for the improved rate capability of cathodes by amorphous lithium phosphate surficial films will be used to motivate the potential for structural optimization of existing commercial lithium ion battery electrode. In the following chapters, novel battery assembly techniques will be explored to achieve new battery architectures. In chapter 3, direct ink writing will be used to fabricate 3D interdigitated microbattery structures that have superior areal energy density on a limited footprint area. In chapter 4, Li-ion batteries based on the LiMn2O4-TiP 2O7 couple are manufactured on flexible paper substrates; where the use of light-weight paper substrates significantly increase the gravimetric energy density of this electrode couple as compared to traditional metal current collectors. In chapter 5, a novel nanowire growth mechanism will be explored to grow interdigitated metal oxide nanowire micro battery electrodes. The growth kinetics of this mechanism is systematically studied to understand how to optimize the growth process to produce electrodes with improved electrochemical properties.

Monolithic Carbide-Derived Carbon Films for Micro-Supercapacitors

NASA Astrophysics Data System (ADS)

Chmiola, John; Largeot, Celine; Taberna, Pierre-Louis; Simon, Patrice; Gogotsi, Yury

2010-04-01

Microbatteries with dimensions of tens to hundreds of micrometers that are produced by common microfabrication techniques are poised to provide integration of power sources onto electronic devices, but they still suffer from poor cycle lifetime, as well as power and temperature range of operation issues that are alleviated with the use of supercapacitors. There have been a few reports on thin-film and other micro-supercapacitors, but they are either too thin to provide sufficient energy or the technology is not scalable. By etching supercapacitor electrodes into conductive titanium carbide substrates, we demonstrate that monolithic carbon films lead to a volumetric capacity exceeding that of micro- and macroscale supercapacitors reported thus far, by a factor of 2. This study also provides the framework for integration of high-performance micro-supercapacitors onto a variety of devices.

Monolithic carbide-derived carbon films for micro-supercapacitors.

PubMed

Chmiola, John; Largeot, Celine; Taberna, Pierre-Louis; Simon, Patrice; Gogotsi, Yury

2010-04-23

Microbatteries with dimensions of tens to hundreds of micrometers that are produced by common microfabrication techniques are poised to provide integration of power sources onto electronic devices, but they still suffer from poor cycle lifetime, as well as power and temperature range of operation issues that are alleviated with the use of supercapacitors. There have been a few reports on thin-film and other micro-supercapacitors, but they are either too thin to provide sufficient energy or the technology is not scalable. By etching supercapacitor electrodes into conductive titanium carbide substrates, we demonstrate that monolithic carbon films lead to a volumetric capacity exceeding that of micro- and macroscale supercapacitors reported thus far, by a factor of 2. This study also provides the framework for integration of high-performance micro-supercapacitors onto a variety of devices.

Silicon algae with carbon topping as thin-film anodes for lithium-ion microbatteries by a two-step facile method

NASA Astrophysics Data System (ADS)

Biserni, E.; Xie, M.; Brescia, R.; Scarpellini, A.; Hashempour, M.; Movahed, P.; George, S. M.; Bestetti, M.; Li Bassi, A.; Bruno, P.

2015-01-01

Silicon-based electrodes for Li-ion batteries (LIB) attract much attention because of their high theoretical capacity. However, their large volume change during lithiation results in poor cycling due to mechanical cracking. Moreover, silicon can hardly form a stable solid electrolyte interphase (SEI) layer with common electrolytes. We present a safe, innovative strategy to prepare nanostructured silicon-carbon anodes in a two-step process. The nanoporosity of Si films accommodates the volume expansion while a disordered graphitic C layer on top promotes the formation of a stable SEI. This approach shows its promises: carbon-coated porous silicon anodes perform in a very stable way, reaching the areal capacity of ∼175 μAh cm-2, and showing no decay for at least 1000 cycles. With requiring only a two-step deposition process at moderate temperatures, this novel very simple cell concept introduces a promising way to possibly viable up-scaled production of next-generation nanostructured Si anodes for lithium-ion microbatteries.

Glassy materials for lithium batteries: electrochemical properties and devices performances

NASA Astrophysics Data System (ADS)

Duclot, Michel; Souquet, Jean-Louis

Amorphous or glassy materials may be used as electrolyte or electrode materials for lithium primary or secondary batteries. A first generation proceeded from classical coin cells in which the organic electrolyte was replaced by a high lithium conductive glassy electrolyte. The solid components were assembled under isostatic pressure. The main advantages of such cells are a good storage stability and ability to operate until 200°C. Nevertheless, the high resistivity of the glassy electrolyte below room temperature and a limited depth for charge and discharge cycles makes these cells not competitive compared to conventional lithium-ion batteries. More promising, are the thin films solid state microbatteries realised by successive depositions of electrodes and electrolyte. The low resistance of the electrolyte amorphous layer allows cycling at temperatures as low as -10°C. The total thickness of thin film batteries, including packaging is less than 100 μm. A capacity of about 100 μAh cm -2 with over 10 4 charge-discharge cycles at 90% in depth of discharge is well suited for energy independent smart cards or intelligent labels, which represent for these devices a large and unrivalled market.

Ingestible Thermometer Pill Aids Athletes in Beating the Heat

NASA Technical Reports Server (NTRS)

2006-01-01

Developed by Goddard Space Flight Center and the Johns Hopkins University Applied Physics Laboratory to monitor the core body temperature of astronauts during space flight, the ingestible "thermometer pill" has a silicone-coated exterior, with a microbattery, a quartz crystal temperature sensor, a space-aged telemetry system, and microminiaturized circuitry on the interior.

Direct Observations of the Formation and Redox-Mediator-Assisted Decomposition of Li2 O2 in a Liquid-Cell Li-O2 Microbattery by Scanning Transmission Electron Microscopy.

PubMed

Yang, Chuchu; Han, Jiuhui; Liu, Pan; Hou, Chen; Huang, Gang; Fujita, Takeshi; Hirata, Akihiko; Chen, Mingwei

2017-11-01

Operando scanning transmission electron microscopy observations of cathodic reactions in a liquid-cell Li-O 2 microbattery in the presence of the redox mediator tetrathiafulvalene (TTF) in 1.0 m LiClO 4 dissolved dimethyl sulfoxide electrolyte are reported. It is found that the TTF addition does not obviously affect the discharge reaction for the formation of a solid Li 2 O 2 phase. The coarsening of Li 2 O 2 nanoparticles occurs via both conventional Ostwald ripening and nonclassical crystallization by particle attachment. During charging, the oxidation reaction at significantly reduced charge potentials mainly takes place at Li 2 O 2 /electrolyte interfaces and has obvious correspondence with the oxidized TTF + distributions in the electric fields of the charged electrode. This study provides direct evidence that TTF truly plays a role in promoting the decomposition of Li 2 O 2 as a soluble charge-transfer agent between the electrode and the Li 2 O 2 . © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Operando characterization of cathodic reactions in a liquid-state lithium-oxygen micro-battery by scanning transmission electron microscopy.

PubMed

Liu, Pan; Han, Jiuhui; Guo, Xianwei; Ito, Yoshikazu; Yang, Chuchu; Ning, Shoucong; Fujita, Takeshi; Hirata, Akihiko; Chen, Mingwei

2018-02-16

Rechargeable non-aqueous lithium-oxygen batteries with a large theoretical capacity are emerging as a high-energy electrochemical device for sustainable energy strategy. Despite many efforts made to understand the fundamental Li-O 2 electrochemistry, the kinetic process of cathodic reactions, associated with the formation and decomposition of a solid Li 2 O 2 phase during charging and discharging, remains debate. Here we report direct visualization of the charge/discharge reactions on a gold cathode in a non-aqueous lithium-oxygen micro-battery using liquid-cell aberration-corrected scanning transmission electron microscopy (STEM) combining with synchronized electrochemical measurements. The real-time and real-space characterization by time-resolved STEM reveals the electrochemical correspondence of discharge/charge overpotentials to the nucleation, growth and decomposition of Li 2 O 2 at a constant current density. The nano-scale operando observations would enrich our knowledge on the underlying reaction mechanisms of lithium-oxygen batteries during round-trip discharging and charging and shed lights on the strategies in improving the performances of lithium-oxygen batteries by tailoring the cathodic reactions.

Integrated Microbatteries for Implantable Medical Devices

NASA Technical Reports Server (NTRS)

Whitacre, Jay; West, William

2008-01-01

Integrated microbatteries have been proposed to satisfy an anticipated need for long-life, low-rate primary batteries, having volumes less than 1 mm3, to power electronic circuitry in implantable medical devices. In one contemplated application, such a battery would be incorporated into a tubular hearing-aid device to be installed against an eardrum. This device is based on existing tube structures that have already been approved by the FDA for use in human ears. As shown in the figure, the battery would comprise a single cell at one end of the implantable tube. A small volume of Li-based primary battery cathode material would be compacted and inserted in the tube near one end, followed by a thin porous separator, followed by a pressed powder of a Li-containing alloy. Current-collecting wires would be inserted, with suitably positioned insulators to prevent a short circuit. The battery would contain a liquid electrolyte consisting of a Li-based salt in an appropriate solvent. Hermetic seals would be created by plugging both ends with a waterproof polymer followed by deposition of parylene.

Packaging Technologies for 500C SiC Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2013-01-01

Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

NREL Research Garners Three Prestigious R&D 100 Awards | News | NREL

Science.gov Websites

, SkyFuel, to create a ground-breaking and low-cost system for utility-sized power generation. The SkyTrough installation costs into competition with gas-fired power plants. NREL shares this award with SkyFuel, Inc. NREL -film lithium microbattery. Its ideal applications are remote wireless sensors, smart homes, smart cars

Layer-by-layer assembled polyaniline nanofiber/multiwall carbon nanotube thin film electrodes for high-power and high-energy storage applications.

PubMed

Hyder, Md Nasim; Lee, Seung Woo; Cebeci, Fevzi Ç; Schmidt, Daniel J; Shao-Horn, Yang; Hammond, Paula T

2011-11-22

Thin film electrodes of polyaniline (PANi) nanofibers and functionalized multiwall carbon nanotubes (MWNTs) are created by layer-by-layer (LbL) assembly for microbatteries or -electrochemical capacitors. Highly stable cationic PANi nanofibers, synthesized from the rapid aqueous phase polymerization of aniline, are assembled with carboxylic acid functionalized MWNT into LbL films. The pH-dependent surface charge of PANi nanofibers and MWNTs allows the system to behave like weak polyelectrolytes with controllable LbL film thickness and morphology by varying the number of bilayers. The LbL-PANi/MWNT films consist of a nanoscale interpenetrating network structure with well developed nanopores that yield excellent electrochemical performance for energy storage applications. These LbL-PANi/MWNT films in lithium cell can store high volumetric capacitance (~238 ± 32 F/cm(3)) and high volumetric capacity (~210 mAh/cm(3)). In addition, rate-dependent galvanostatic tests show LbL-PANi/MWNT films can deliver both high power and high energy density (~220 Wh/L(electrode) at ~100 kW/L(electrode)) and could be promising positive electrode materials for thin film microbatteries or electrochemical capacitors. © 2011 American Chemical Society

Research and Development of Fully Automatic Alien Smoke Stack and Packaging System

NASA Astrophysics Data System (ADS)

Yang, Xudong; Ge, Qingkuan; Peng, Tao; Zuo, Ping; Dong, Weifu

2017-12-01

The problem of low efficiency of manual sorting packaging for the current tobacco distribution center, which developed a set of safe efficient and automatic type of alien smoke stack and packaging system. The functions of fully automatic alien smoke stack and packaging system adopt PLC control technology, servo control technology, robot technology, image recognition technology and human-computer interaction technology. The characteristics, principles, control process and key technology of the system are discussed in detail. Through the installation and commissioning fully automatic alien smoke stack and packaging system has a good performance and has completed the requirements for shaped cigarette.

Smart packaging systems for food applications: a review.

PubMed

Biji, K B; Ravishankar, C N; Mohan, C O; Srinivasa Gopal, T K

2015-10-01

Changes in consumer preference for safe food have led to innovations in packaging technologies. This article reviews about different smart packaging systems and their applications in food packaging, packaging research with latest innovations. Active and intelligent packing are such packaging technologies which offer to deliver safer and quality products. Active packaging refers to the incorporation of additives into the package with the aim of maintaining or extending the product quality and shelf life. The intelligent systems are those that monitor the condition of packaged food to give information regarding the quality of the packaged food during transportation and storage. These technologies are designed to the increasing demand for safer foods with better shelf life. The market for active and intelligent packaging systems is expected to have a promising future by their integration into packaging materials or systems.

Design and Characterization of p-i-n Devices for Betavoltaic Microbatteries on Gallium Nitride

NASA Astrophysics Data System (ADS)

Khan, Muhammad Raziuddin A.

Betavoltaic microbatteries convert nuclear energy released as beta particles directly into electrical energy. These batteries are well suited for electrical applications such as micro-electro-mechanical systems (MEMS), implantable medical devices and sensors. Such devices are often located in hard to access places where long life, micro-size and lightweight are required. The working principle of a betavoltaic device is similar to a photovoltaic device; they differ only in that the electron hole pairs (EHPs) are generated in the device by electrons instead of photons. In this study, the performance of a betavoltaic device fabricated from gallium nitride (GaN) is investigated for beta particle energies equivalent to Tritium (3H) and Nickel-63 (N63) beta sources. GaN is an attractive choice for fabricating betavoltaic devices due to its wide band gap and radiation resistance. Another advantage GaN has is that it can be alloyed with aluminum (Al) to further increase the bandgap, resulting in a higher output power and increased efficiency. Betavoltaic devices were fabricated on p-i-n GaN structures grown by metalorganic chemical vapor deposition (MOCVD). The devices were characterized using current - voltage (IV) measurements without illumination (light or beta), using a laser driven light source, and under an electron beam. Dark IV measurements showed a turn on-voltage of ~ 3.4 V, specific-on-resistance of 15.1 m O-cm2, and a leakage current of 0.5 mA at -- 10 V. A clear photo-response was observed when IV curves were measured for these devices under a light source at a wavelength of 310 nm (4.0 eV). These devices were tested under an electron beam in order to evaluate their behavior as betavoltaic microbatteries without using radioactive materials. Output power of 70 nW and 640 nW with overall efficiencies of 1.2% and 4.0% were determined at the average energy emission of 3H (5.6 keV) and 63N (17 keV) respectively.

European consumer response to packaging technologies for improved beef safety.

PubMed

Van Wezemael, Lynn; Ueland, Øydis; Verbeke, Wim

2011-09-01

Beef packaging can influence consumer perceptions of beef. Although consumer perceptions and acceptance are considered to be among the most limiting factors in the application of new technologies, there is a lack of knowledge about the acceptability to consumers of beef packaging systems aimed at improved safety. This paper explores European consumers' acceptance levels of different beef packaging technologies. An online consumer survey was conducted in five European countries (n=2520). Acceptance levels among the sample ranged between 23% for packaging releasing preservative additives up to 73% for vacuum packaging. Factor analysis revealed that familiar packaging technologies were clearly preferred over non-familiar technologies. Four consumer segments were identified: the negative (31% of the sample), cautious (30%), conservative (17%) and enthusiast (22%) consumers, which were profiled based on their attitudes and beef consumption behaviour. Differences between consumer acceptance levels should be taken into account while optimising beef packaging and communicating its benefits. Copyright © 2011 Elsevier Ltd. All rights reserved.

Modeling and fabrication of lithium polymer ion batteries designed for wireless sensor network applications and printed directly on device

NASA Astrophysics Data System (ADS)

Steingart, Daniel Artemis

Microfabrication has enabled devices that were unimaginable just a century ago. The ability to create structured channels of metal and ceramic within the confines of half a micron took four decades to perfect but the reward has created cheap, reliable, and small computer devices, some of which communicate with no wires to the rest of the world. Conversely, electrochemical energy cells, or batteries, were well known to the scientific community one hundred years ago, and a 19th century chemist would be hard pressed to find a radical difference in the size, structure and performance of most batteries. While materials have been purified, and new chemistries have been implemented, modern batteries only offer, at most, an order of magnitude improvement in energy and power density over their original counter parts. Moore's "Law" [1] regarding integrated circuits only applies to semiconductor devices for a very simple reason: energy storage capacity is directly related to size. While transistor performance increases as size decreases, battery performance in terms of deliverable power and not. Though some performance gain can be made by modifying the battery chemistry or microstructure, more mass will always provide more capacity. With the advent of the "smart dust" class computers a critical point was reached. The devices became significantly smaller than the batteries required to do useful work, inspiring a new kind of battery, the microbattery, or a battery of a size of less than a few cubic millimeters and capable of delivering a continuous current of roughly 50 to 100 muA at 1 to 4 V. The pioneering microbatteries created by Bates [2] were promising in that they (1) used common microfabrication techniques and (2) were completely solid state. These cells are only now beginning to see commercialization, and are beset by a variety of problems. Though some are related to manufacturing control, others are inherent to the nature of the production processes. Sputtering and CVD produce excellent thin film microstructures, but face considerable problems with regard to stress build up as thickness grows beyond 10 mum. When total battery area is constrained to 1 cm2 a single electrode thickness of 10 mum is simply insufficient to create a useful battery. The second major issue is processing temperature. The processes that are used to deposit most thin film battery materials require temperatures greater than 300°C [3], which is greater than the temperature most CMOS devices can withstand. While electrical engineers may get around this by (1) using a separate chip for the battery or (2) use the battery as the substrate to build the device both cases would require more packaging to protect the batteries, to some degree defeating the purpose of reducing the packaging. To overcome this obstacle, a new method to place the materials necessary to make a battery on a chip has been developed. This process was done at room temperature, at packaging to protect the batteries, to some degree defeating the purpose of reducing the packaging. To overcome this obstacle, a new method to place the materials necessary to make a battery on a chip has been developed. This process is done at room temperature, at atmospheric pressure, and with thicknesses great enough to provide significantly more capacity than thin film solutions. The method uses tools used to apply adhesives, traditionally, including screen-printing and pneumatic extrusion. These methods produce structures that in theory should provide the energy and power density available in large-scale batteries (a feat heretofore not replicated by thin film fabrication methods) and with improvements in solid polymer electrolytes, may provide the necessary power density. These tools can be used to produce capacitors as well, which can help in load leveling the battery, thereby increasing both discharge time and cycle life. Finally, in the course of this research conventional battery test equipment was either too expensive or unable to meet the low current required. A wirelessly controlled nanoamp/millivolt resolution galvanostat/potentiostat, was created to test the cells. This device costs 1/20th the price of similar commercial solutions, per channel, and allows testing in inert atmosphere without bulkhead adapters.

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2005-01-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2004-12-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Bluetooth technology for prevention of dental caries.

PubMed

Kolahi, Jafar; Fazilati, Mohamad

2009-12-01

Caries is caused when the pH at the tooth surface drops below 5.5. A miniaturized and autonomous pH monitoring nodes can be attached to the tooth surface, like a tooth jewel. This intelligent sensor includes three components: (a) digital micro pH meter, (b) power supply, (c) wireless communicating device. The micro pH meter facilitates long term tooth surface pH monitoring and providing real time feedback to the patients and dental experts. Power supply of this system will be microfabricated biocatalytic fuel cell (enzymatic micro-battery) using organic compounds (e.g. formate or glucose) as the fuel to generate electricity. When micro pH meter detects the pH lower than 5.5, wireless Bluetooth device sends a caution (e.g. "you are at risk of dental caries") to external monitoring equipment such as mobile phone or a hands-free heads. After reception of the caution, subjects should use routine brushing and flossing procedure or use a medicated chewing gum (e.g. chlorhexidine containing chewing gum) or rinse with a mouthwash.

Technological developments and future perspectives on graphene-based metamaterials: a primer for neurosurgeons.

PubMed

Mattei, Tobias A; Rehman, Azeem A

2014-05-01

Graphene, a monolayer atomic-scale honeycomb lattice of carbon atoms, has been considered the greatest revolution in metamaterials research in the past 5 years. Its developers were awarded the Nobel Prize in Physics in 2010, and massive funding has been directed to graphene-based experimental research in the last years. For instance, an international scientific collaboration has recently received a €1 billion grant from the European Flagship Initiative, the largest amount of financial resources ever granted for a single research project in the history of modern science. Because of graphene's unique optical, thermal, mechanical, electronic, and quantum properties, the incorporation of graphene-based metamaterials to biomedical applications is expected to lead to major technological breakthroughs in the next few decades. Current frontline research in graphene technology includes the development of high-performance, lightweight, and malleable electronic devices, new optical modulators, ultracapacitors, molecular biodevices, organic photovoltaic cells, lithium-ion microbatteries, frequency multipliers, quantum dots, and integrated circuits, just to mention a few. With such advances, graphene technology is expected to significantly impact several areas of neurosurgery, including neuro-oncology, neurointensive care, neuroregeneration research, peripheral nerve surgery, functional neurosurgery, and spine surgery. In this topic review, the authors provide a basic introduction to the main electrophysical properties of graphene. Additionally, future perspectives of ongoing frontline investigations on this new metamaterial are discussed, with special emphasis on those research fields that are expected to most substantially impact experimental and clinical neurosurgery in the near future.

NASA Electronic Parts and Packaging Program

NASA Technical Reports Server (NTRS)

Kayali, Sammy

2000-01-01

NEPP program objectives are to: (1) Access the reliability of newly available electronic parts and packaging technologies for usage on NASA projects through validations, assessments, and characterizations, and the development of test methods/tools; (2)Expedite infusion paths for advanced (emerging) electronic parts and packaging technologies by evaluations of readiness for manufacturability and project usage consideration; (3) Provide NASA projects with technology selection, application, and validation guidelines for electronic parts and packaging hardware and processes; nd (4) Retain and disseminate electronic parts and packaging quality assurance, reliability validations, tools, and availability information to the NASA community.

Microfabricated biocatalytic fuel cells: a new approach to accelerating the orthodontic tooth movement.

PubMed

Kolahi, Jafar; Abrishami, Mohamadreza; Davidovitch, Zéev

2009-09-01

Direct electric current is a potent biologic mean to accelerate periodontal tissue turnover and orthodontic tooth movement. The main problem associated with this approach is the source of electricity. A noninvasive, removable enzymatic micro-battery, will administer minute electric currents to the alveolar bone and oral soft tissues, utilizing glucose as a fuel, becoming a possible source of the electrical power required for accelerating the velocity of orthodontic tooth movement.

Rational design of atomic-layer-deposited LiFePO4 as a high-performance cathode for lithium-ion batteries.

PubMed

Liu, Jian; Banis, Mohammad N; Sun, Qian; Lushington, Andrew; Li, Ruying; Sham, Tsun-Kong; Sun, Xueliang

2014-10-08

Atomic layer deposition is successfully applied to synthesize lithium iron phosphate in a layer-by-layer manner by using self-limiting surface reactions. The lithium iron phosphate exhibits high power density, excellent rate capability, and ultra-long lifetime, showing great potential for vehicular lithium batteries and 3D all-solid-state microbatteries. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Neudeck, Philip G.; Behelm, Glenn M.; Spry, David J.; Meredith, Roger D.; Hunter, Gary W.

2015-01-01

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

Temperature dependence of 63Ni-Si betavoltaic microbattery.

PubMed

Yunpeng, Liu; Xiao, Guo; Zhangang, Jin; Xiaobin, Tang

2018-05-01

This paper theoretically presented the temperature effects on the 63 Ni-Si betavoltaic microbattery irradiated by a source with different thicknesses and activity densities at a temperature range 170-340K. Temperature dependences of the monolayer and interbedded 63 Ni-Si betavoltaics at 213.15-333.15K were tested with respect to calculations. Results showed that the higher the thickness, activity density, and average energy of the source, the lower is the betavoltaic performance responds to temperature. With the increase in temperature, the V oc and P max of the upper, lower, and interbedded betavoltaics decreased linearly at low temperatures and decreased exponentially at high temperatures in the experiment. As predicted, the measured V oc and P max sensitivities of the lower betavoltaic with 4.90mCi/cm 2 63 Ni, -2.230mV/K and -1.132%, respectively, were lower than those with 1.96mCi/cm 2 63 Ni, -2.490mV/K and -1.348%, respectively. Compared with the calculated results, the prepared betavoltaics had lower V oc sensitivity and higher P max sensitivity. In addition, the measured V oc sensitivity of the interbedded betavoltaic in series is equal to the sum of those of the upper and lower ones as predicted. Moreover, the measured P max sensitivity of the interbedded betavoltaic is equal to the average of those of the two monolayers. Copyright © 2018 Elsevier Ltd. All rights reserved.

Integrated Approach to Industrial Packaging Design

NASA Astrophysics Data System (ADS)

Vorobeva, O.

2017-11-01

The article reviews studies in the field of industrial packaging design. The major factors which influence technological, ergonomic, economic and ecological features of packaging are established. The main modern trends in packaging design are defined, the principles of marketing communications and their influence on consumers’ consciousness are indicated, and the function of packaging as a transmitter of brand values is specified. Peculiarities of packaging technology and printing techniques in modern printing industry are considered. The role of designers in the stage-by-stage development of the construction, form and graphic design concept of packaging is defined. The examples of authentic packaging are given and the mention of the tetrahedron packaging history is made. At the end of the article, conclusions on the key research aspects are made.

PACKAGE PLANTS FOR SMALL SYSTEMS: A FIELD STUDY

EPA Science Inventory

A joint field study was conducted by AWWA and the Drinking Water Research Division of USEPA to evaluate existing small community systems that use package plant technology. Forty-eight package plant systems representing a geographic and technological cross section were evaluated t...

Participation in the Center for Advanced Processing and Packaging Studies

DTIC Science & Technology

2009-11-24

University, the University ofCalifomia, Davis, and North Carolina State University to assist in advancing food processing and packaging technology and...University, the University of California, Davis, and North Carolina State University to assist in advancing food processing and packaging technology and...amyloliquefaciens, spore inactivation, FT-IR spectroscopy, infrared 11 spectroscopy 12 13 14 15 16 17 Department of Food Science and Technology

Novel Ruggedized Packaging Technology for VCSELs

DTIC Science & Technology

2017-03-01

Novel Ruggedized Packaging Technology for VCSELs Charlie Kuznia ckuznia@ultracomm-inc.com Ultra Communications, Inc. Vista, CA, USA, 92081...n ac hieve l ow-power, E MI-immune links within hi gh-performance m ilitary computing an d sensor systems. Figure 1. Chip-scale-packaging of

The Packaging Technology Study on Smart Composite Structure Based on The Embedded FBG Sensor

NASA Astrophysics Data System (ADS)

Zhang, Youhong; Chang, Xinlong; Zhang, Xiaojun; He, Xiangyong

2018-03-01

It is convenient to carry out the health monitoring of the solid rocket engine composite shell based on the embedded FBG sensor. In this paper, the packaging technology using one-way fiber layer of prepreg fiberglass/epoxy resin was proposed. The proposed packaging process is simple, and the packaged sensor structure size is flexible and convenient to use, at the mean time, the packaged structure has little effect on the pristine composite material structure.

A QR code identification technology in package auto-sorting system

NASA Astrophysics Data System (ADS)

di, Yi-Juan; Shi, Jian-Ping; Mao, Guo-Yong

2017-07-01

Traditional manual sorting operation is not suitable for the development of Chinese logistics. For better sorting packages, a QR code recognition technology is proposed to identify the QR code label on the packages in package auto-sorting system. The experimental results compared with other algorithms in literatures demonstrate that the proposed method is valid and its performance is superior to other algorithms.

Wafer-level vacuum/hermetic packaging technologies for MEMS

NASA Astrophysics Data System (ADS)

Lee, Sang-Hyun; Mitchell, Jay; Welch, Warren; Lee, Sangwoo; Najafi, Khalil

2010-02-01

An overview of wafer-level packaging technologies developed at the University of Michigan is presented. Two sets of packaging technologies are discussed: (i) a low temperature wafer-level packaging processes for vacuum/hermeticity sealing, and (ii) an environmentally resistant packaging (ERP) technology for thermal and mechanical control as well as vacuum packaging. The low temperature wafer-level encapsulation processes are implemented using solder bond rings which are first patterned on a cap wafer and then mated with a device wafer in order to encircle and encapsulate the device at temperatures ranging from 200 to 390 °C. Vacuum levels below 10 mTorr were achieved with yields in an optimized process of better than 90%. Pressures were monitored for more than 4 years yielding important information on reliability and process control. The ERP adopts an environment isolation platform in the packaging substrate. The isolation platform is designed to provide low power oven-control, vibration isolation and shock protection. It involves batch flip-chip assembly of a MEMS device onto the isolation platform wafer. The MEMS device and isolation structure are encapsulated at the wafer-level by another substrate with vertical feedthroughs for vacuum/hermetic sealing and electrical signal connections. This technology was developed for high performance gyroscopes, but can be applied to any type of MEMS device.

MEMS packaging: state of the art and future trends

NASA Astrophysics Data System (ADS)

Bossche, Andre; Cotofana, Carmen V. B.; Mollinger, Jeff R.

1998-07-01

Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.

An evaluation of the effectiveness of FreshCase technology to extend the storage life of whole-muscle pork and ground pork sausage.

PubMed

Yang, X; Woerner, D R; McCullough, K R; Hasty, J D; Geornaras, I; Smith, G C; Sofos, J N; Belk, K E

2016-11-01

The objective of this study was to identify the maximum time of refrigerated storage before aerobic psychrotrophic bacteria grew to a level indicative of spoilage (7 log cfu/g) or other indicators of spoilage were observed for whole-muscle pork and ground pork sausage packaged using FreshCase technology. Pork chops and pork sausage were packaged using conventional vacuum packaging without nitrite in film (Control) or using FreshCase technology and were compared with respect to microbial counts, pH, instrumental color measurements, lipid oxidation level, and sensory properties. The storage life was 45 d for pork chops stored in FreshCase packages at 1°C and 19 d for ground pork sausage stored under the same condition. Results indicated that both pork chops and sausage stored in FreshCase packages retained redder color ( < 0.05) than those stored in Control packages. No differences ( > 0.05) existed between Control and FreshCase packaged samples for any off-odor detection for either pork chops or sausage. Moreover, levels of oxidative rancidity in all packages had low thiobarbituric acid reactive substances values. The results indicated that FreshCase technology can be used to extend storage life of pork products without having adverse effects on pork quality.

Book of Knowledge (BOK) for NASA Electronic Packaging Roadmap

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2015-01-01

The objective of this document is to update the NASA roadmap on packaging technologies (initially released in 2007) and to present the current trends toward further reducing size and increasing functionality. Due to the breadth of work being performed in the area of microelectronics packaging, this report presents only a number of key packaging technologies detailed in three industry roadmaps for conventional microelectronics and a more recently introduced roadmap for organic and printed electronics applications. The topics for each category were down-selected by reviewing the 2012 reports of the International Technology Roadmap for Semiconductor (ITRS), the 2013 roadmap reports of the International Electronics Manufacturing Initiative (iNEMI), the 2013 roadmap of association connecting electronics industry (IPC), the Organic Printed Electronics Association (OE-A). The report also summarizes the results of numerous articles and websites specifically discussing the trends in microelectronics packaging technologies.

Integrated Avionics System (IAS), Integrating 3-D Technology On A Spacecraft Panel

NASA Technical Reports Server (NTRS)

Hunter, Don J.; Halpert, Gerald

1999-01-01

As spacecraft designs converge toward miniaturization, and with the volumetric and mass challenges placed on avionics, programs will continue to advance the "state of the art" in spacecraft system development with new challenges to reduce power, mass and volume. Traditionally, the trend is to focus on high-density 3-D packaging technologies. Industry has made significant progress in 3-D technologies, and other related internal and external interconnection schemes. Although new technologies have improved packaging densities, a system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increase integration efficiencies, provide modularity and flexibility to accommodate multiple missions while maintaining a low recurring cost. With these challenges in mind, a novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. The Integrated Avionics System (IAS) provides for a low-mass, modular distributed or centralized packaging architecture which combines ridged-flex technologies, high-density COTS hardware and a new 3-D mechanical packaging approach, Horizontal Mounted Cube (HMC). This paper will describe the fundamental elements of the IAS, HMC hardware design, system integration and environmental test results.

Packaging of silicon photonic devices: from prototypes to production

NASA Astrophysics Data System (ADS)

Morrissey, Padraic E.; Gradkowski, Kamil; Carroll, Lee; O'Brien, Peter

2018-02-01

The challenges associated with the photonic packaging of silicon devices is often underestimated and remains technically challenging. In this paper, we review some key enabling technologies that will allow us to overcome the current bottleneck in silicon photonic packaging; while also describing the recent developments in standardisation, including the establishment of PIXAPP as the worlds first open-access PIC packaging and assembly Pilot Line. These developments will allow the community to move from low volume prototype photonic packaged devices to large scale volume manufacturing, where the full commercialisation of PIC technology can be realised.

Impact of external influences on food packaging.

PubMed

Brody, A L

1977-09-01

Since the food supply is dependent upon an effective packaging system, threats to packaging represent implied threats to food processing and distribution. Enacted and potential legislation and regulation are retarding technological and commercial progress in food packaging and have already restricted some food packaging/processins systems. The results of these external influences is not simply the sum of the individual acts, but is a cascading self-imposed arresting of food packaging/processing advancement. The technological bases for the enacted and proposed legislation and regulation are presented in the enumeration of the external influences on food packaging. Economic and sociological arguments and facts surrounding the issues are also presented. Among the external influences on food packaging detailed are indirect additives, nutritional labeling, benefit:risk, solid waste and litter, environmental pollution, universal product code, and food industry productivity. The magnitude of the total impact of these external influences upon the food supply is so large that assertive action must be taken to channel these influences into more productive awareness. An objective and comprehensive public communications program supported by the technological community appears mandatory.

Radiometric packaging of uncooled bolometric infrared focal plane arrays

NASA Astrophysics Data System (ADS)

García-Blanco, Sonia; Pope, Timothy; Côté, Patrice; Leclerc, Mélanie; Ngo Phong, Linh; Châteauneuf, François

2017-11-01

INO has a wide experience in the design and fabrication of different kinds of microbolometer focal plane arrays (FPAs). In particular, a 512x3 pixel microbolometer FPA has been selected as the sensor for the New Infrared Sensor Technology (NIRST) instrument, one of the payloads of the SACD/Aquarius mission. In order to make the absolute temperature measurements necessary for many infrared Earth observation applications, the microbolometer FPA must be integrated into a package offering a very stable thermal environment. The radiometric packaging technology developed at INO presents an innovative approach since it was conceived to be modular and adaptable for the packaging of different microbolometer FPAs and for different sets of assembly requirements without need for requalification of the assembly process. The development of the radiometric packaging technology has broadened the position of INO as a supplier of radiometric detector modules integrating FPAs of microbolometers inside a radiometric package capable of achieving the requirements of different space missions. This paper gives an overview of the design of INO's radiometric package. Key performance parameters are also discussed and the test campaign conducted with the radiometric package is presented.

Use of optical technique for inspection of warpage of IC packages

NASA Astrophysics Data System (ADS)

Toh, Siew-Lok; Chau, Fook S.; Ong, Sim Heng

2001-06-01

The packaging of IC packages has changed over the years, form dual-in-line, wire-bond, and pin-through-hole in printed wiring board technologies in the 1970s to ball grid array, chip scale and surface mount technologies in the 1990s. Reliability has been a big problem for manufacturers for some moisture-sensitive packages. One of the potential problems in plastic IC packages is moisture-induced popcorn effect which can arise during the reflow process. Shearography is a non-destructive inspection technique that may be used to detect the delamination and warpage of IC packages. It is non-contacting and permits a full-field observation of surface displacement derivatives. Another advantage of this technique is that it is able to give the real-time formation of the fringes which indicate flaws in the IC package under real-time simulation condition of Surface Mount Technology (SMT) IR reflow profile. It is extremely fast and convenient to study the true behavior of the packaging deformation during the SMT process. It can be concluded that shearography has the potential for the real- time detection, in situ and non-destructive inspection of IC packages during the surface mount process.

Quality and safety aspects of meat products as affected by various physical manipulations of packaging materials.

PubMed

Lee, Keun Taik

2010-09-01

This article explores the effects of physically manipulated packaging materials on the quality and safety of meat products. Recently, innovative measures for improving quality and extending the shelf-life of packaged meat products have been developed, utilizing technologies including barrier film, active packaging, nanotechnology, microperforation, irradiation, plasma and far-infrared ray (FIR) treatments. Despite these developments, each technology has peculiar drawbacks which will need to be addressed by meat scientists in the future. To develop successful meat packaging systems, key product characteristics affecting stability, environmental conditions during storage until consumption, and consumers' packaging expectations must all be taken into consideration. Furthermore, the safety issues related to packaging materials must also be taken into account when processing, packaging and storing meat products.

Miniature stick-packaging--an industrial technology for pre-storage and release of reagents in lab-on-a-chip systems.

PubMed

van Oordt, Thomas; Barb, Yannick; Smetana, Jan; Zengerle, Roland; von Stetten, Felix

2013-08-07

Stick-packaging of goods in tubular-shaped composite-foil pouches has become a popular technology for food and drug packaging. We miniaturized stick-packaging for use in lab-on-a-chip (LOAC) systems to pre-store and on-demand release the liquid and dry reagents in a volume range of 80-500 μl. An integrated frangible seal enables the pressure-controlled release of reagents and simplifies the layout of LOAC systems, thereby making the package a functional microfluidic release unit. The frangible seal is adjusted to defined burst pressures ranging from 20 to 140 kPa. The applied ultrasonic welding process allows the packaging of temperature sensitive reagents. Stick-packs have been successfully tested applying recovery tests (where 99% (STDV = 1%) of 250 μl pre-stored liquid is released), long-term storage tests (where there is loss of only <0.5% for simulated 2 years) and air transport simulation tests. The developed technology enables the storage of a combination of liquid and dry reagents. It is a scalable technology suitable for rapid prototyping and low-cost mass production.

IFT Scientific Status Summary 2008: Innovative Food Packaging Solutions

USDA-ARS?s Scientific Manuscript database

Food and beverage packaging comprises 55-65% of the $110 billion value of packaging in the United States. This review provides a summary of innovative technology developments in food packaging. The expanded role of food and beverage packaging is reviewed. Active and intelligent food packaging, ba...

JTEC Panel report on electronic manufacturing and packaging in Japan

NASA Technical Reports Server (NTRS)

Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John; Meieran, Gene; Pecht, Michael; Peeples, John; Tummala, Rao; Dehaemer, Michael J.; Holdridge, Geoff (Editor); Gamota, George

1995-01-01

This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies.

Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors

PubMed Central

Hera, Daniel; Berndt, Armin; Günther, Thomas; Schmiel, Stephan; Harendt, Christine; Zimmermann, André

2017-01-01

Packaging represents an important part in the microintegration of sensors based on microelectromechanical system (MEMS). Besides miniaturization and integration density, functionality and reliability in combination with flexibility in packaging design at moderate costs and consequently high-mix, low-volume production are the main requirements for future solutions in packaging. This study investigates possibilities employing printed circuit board (PCB-)based assemblies to provide high flexibility for circuit designs together with film-assisted transfer molding (FAM) to package sensors. The feasibility of FAM in combination with PCB and MEMS as a packaging technology for highly sensitive inertia sensors is being demonstrated. The results prove the technology to be a viable method for damage-free packaging of stress- and pressure-sensitive MEMS. PMID:28653992

Performance assessment of small-package-class nonintrusive inspection systems

NASA Astrophysics Data System (ADS)

Spradling, Michael L.; Hyatt, Roger

1997-02-01

The DoD Counterdrug Technology Development Program has addressed the development and demonstration of technology to enhance nonintrusive inspection of small packages such as passenger baggage, commercially delivered parcels, and breakbulk cargo items. Within the past year they have supported several small package-class nonintrusive inspection system performance assessment activities. All performance assessment programs involved the use of a red/blue team concept and were conducted in accordance with approved assessment protocols. This paper presents a discussion related to the systematic performance assessment of small package-class nonintrusive inspection technologies, including transmission, backscatter and computed tomography x-ray imaging, and protocol-related considerations for the assessment of these systems.

Prediction of 4H-SiC betavoltaic microbattery characteristics based on practical Ni-63 sources.

PubMed

Gui, Gui; Zhang, Kan; Blanchard, James P; Ma, Zhenqiang

2016-01-01

We have investigated the performance of 4H-SiC betavoltaic microbatteries under exposure to the practical Ni-63 sources using the Monte Carlo method and Synopsys® Medici device simulator. A typical planar p-n junction betavoltaic device with the Ni-63 source of 20% purity on top is modeled in the simulation. The p-n junction structure includes a p+ layer, a p- layer, an n+ layer, and an n- layer. In order to obtain an accurate and valid predication, our simulations consider several practical factors, including isotope impurities, self-absorption, and full beta energy spectra. By simulating the effects of both the p-n junction configuration and the isotope source thickness on the battery output performance, we have achieved the optimal design of the device and maximum energy conversion efficiency. Our simulation results show that the energy conversion efficiency increases as the doping concentration and thickness of the p- layer increase, whereas it is independent of the total depth of the p-n junction. Furthermore, the energy conversion efficiency decreases as the thickness of the practical Ni-63 source increases, because of self-absorption in the isotope source. Therefore, we propose that a p-n junction betavoltaic cell with a thicker and heavily doped p- layer under exposure to a practical Ni-63 source with an appreciable thickness could produce the optimal energy conversion efficiency. Copyright © 2015 Elsevier Ltd. All rights reserved.

Inkjet-Printed Lithium-Sulfur Microcathodes for All-Printed, Integrated Nanomanufacturing.

PubMed

Milroy, Craig A; Jang, Seonpil; Fujimori, Toshihiko; Dodabalapur, Ananth; Manthiram, Arumugam

2017-03-01

Improved thin-film microbatteries are needed to provide appropriate energy-storage options to power the multitude of devices that will bring the proposed "Internet of Things" network to fruition (e.g., active radio-frequency identification tags and microcontrollers for wearable and implantable devices). Although impressive efforts have been made to improve the energy density of 3D microbatteries, they have all used low energy-density lithium-ion chemistries, which present a fundamental barrier to miniaturization. In addition, they require complicated microfabrication processes that hinder cost-competitiveness. Here, inkjet-printed lithium-sulfur (Li-S) cathodes for integrated nanomanufacturing are reported. Single-wall carbon nanotubes infused with electronically conductive straight-chain sulfur (S@SWNT) are adopted as an integrated current-collector/active-material composite, and inkjet printing as a top-down approach to achieve thin-film shape control over printed electrode dimensions is used. The novel Li-S cathodes may be directly printed on traditional microelectronic semicoductor substrates (e.g., SiO 2 ) or on flexible aluminum foil. Profilometry indicates that these microelectrodes are less than 10 µm thick, while cyclic voltammetry analyses show that the S@SWNT possesses pseudocapacitive characteristics and corroborates a previous study suggesting the S@SWNT discharge via a purely solid-state mechanism. The printed electrodes produce ≈800 mAh g -1 S initially and ≈700 mAh g -1 after 100 charge/discharge cycles at C/2 rate. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Technology Assessment Software Package: Final Report.

ERIC Educational Resources Information Center

Hutinger, Patricia L.

This final report describes the Technology Assessment Software Package (TASP) Project, which produced developmentally appropriate technology assessment software for children from 18 months through 8 years of age who have moderate to severe disabilities that interfere with their interaction with people, objects, tasks, and events in their…

Technological challenges of addressing new and more complex migrating products from novel food packaging materials.

PubMed

Munro, Ian C; Haighton, Lois A; Lynch, Barry S; Tafazoli, Shahrzad

2009-12-01

The risk assessment of migration products resulting from packaging material has and continues to pose a difficult challenge. In most jurisdictions, there are regulatory requirements for the approval or notification of food contact substances that will be used in packaging. These processes generally require risk assessment to ensure safety concerns are addressed. The science of assessing food contact materials was instrumental in the development of the concept of Threshold of Regulation and the Threshold of Toxicological Concern procedures. While the risk assessment process is in place, the technology of food packaging continues to evolve to include new initiatives, such as the inclusion of antimicrobial substances or enzyme systems to prevent spoilage, use of plastic packaging intended to remain on foods as they are being cooked, to the introduction of more rigid, stable and reusable materials, and active packaging to extend the shelf-life of food. Each new technology brings with it the potential for exposure to new and possibly novel substances as a result of migration, interaction with other chemical packaging components, or, in the case of plastics now used in direct cooking of products, degradation products formed during heating. Furthermore, the presence of trace levels of certain chemicals from packaging that were once accepted as being of low risk based on traditional toxicology studies are being challenged on the basis of reports of adverse effects, particularly with respect to endocrine disruption, alleged to occur at very low doses. A recent example is the case of bisphenol A. The way forward to assess new packaging technologies and reports of very low dose effects in non-standard studies of food contact substances is likely to remain controversial. However, the risk assessment paradigm is sufficiently robust and flexible to be adapted to meet these challenges. The use of the Threshold of Regulation and the Threshold of Toxicological Concern concepts may play a critical role in the risk assessment of new food packaging technologies in the future.

Advanced Manufacturing Systems in Food Processing and Packaging Industry

NASA Astrophysics Data System (ADS)

Shafie Sani, Mohd; Aziz, Faieza Abdul

2013-06-01

In this paper, several advanced manufacturing systems in food processing and packaging industry are reviewed, including: biodegradable smart packaging and Nano composites, advanced automation control system consists of fieldbus technology, distributed control system and food safety inspection features. The main purpose of current technology in food processing and packaging industry is discussed due to major concern on efficiency of the plant process, productivity, quality, as well as safety. These application were chosen because they are robust, flexible, reconfigurable, preserve the quality of the food, and efficient.

Recent developments in intelligent packaging for enhancing food quality and safety.

PubMed

Sohail, Muhammad; Sun, Da-Wen; Zhu, Zhiwei

2018-03-07

The role of packaging cannot be denied in the life cycle of any food product. Intelligent packaging is an emerging technology in the food packaging sector. Although it still needs its full emergence in the market, its importance has been proved for the maintenance of food quality and safety. The present review describes several aspects of intelligent packaging. It first highlights different tools used in intelligent packaging and elucidates the role of these packaging devices for maintaining the quality of different food items in terms of controlling microbial growth and gas concentration, and for providing convenience and easiness to its users in the form of time temperature indication. This review also discusses other intelligent packaging solutions in supply chain management of food products to control theft and counterfeiting conducts and broaden the image of the food companies in terms of branding and marketing. Overall, intelligent packaging can ensure food quality and safety in the food industry, however there are still some concerns over this emerging technology including high cost and legal aspects, and thus future work should be performed to overcome these problems for further promoting its applications in the food industry. Moreover, work should also be carried out to combine several single intelligent packaging devices into a single one, so that most of the benefits from this emerging technology can be achieved.

Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology

NASA Astrophysics Data System (ADS)

Wang, Jingwei; Zhu, Pengfei; Liu, Hui; Liang, Xuejie; Wu, Dihai; Liu, Yalong; Yu, Dongshan; Zah, Chung-en; Liu, Xingsheng

2017-02-01

High power diode lasers have been widely used in many fields. To meet the requirements of high power and high reliability, passively cooled single bar CS-packaged diode lasers must be robust to withstand thermal fatigue and operate long lifetime. In this work, a novel complete indium-free double-side cooling technology has been applied to package passively cooled high power diode lasers. Thermal behavior of hard solder CS-package diode lasers with different packaging structures was simulated and analyzed. Based on these results, the device structure and packaging process of double-side cooled CS-packaged diode lasers were optimized. A series of CW 200W 940nm high power diode lasers were developed and fabricated using hard solder bonding technology. The performance of the CW 200W 940nm high power diode lasers, such as output power, spectrum, thermal resistance, near field, far field, smile, lifetime, etc., is characterized and analyzed.

A reliable sealing method for microbatteries

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wang, Yuxing; Cartmell, Samuel; Li, Qiuyan

2017-02-01

With continuous downsizing of electronic devices, lithium batteries of traditional shapes cannot meet the demand where small-size high energy density batteries are needed. Conventional sealing methods become increasingly difficult to apply and impose high processing cost as the size of batteries decreases. In this report, a facile sealing method is proposed and demonstrated in CFx/Li mini-batteries. The method employs a temporary barrier to liquid electrolytes while relies on the epoxies/cell casings bond for the hermetic sealing. Cells sealed by this method show no degradation for an extended period of storage time.

Recent trends and future of pharmaceutical packaging technology

PubMed Central

Zadbuke, Nityanand; Shahi, Sadhana; Gulecha, Bhushan; Padalkar, Abhay; Thube, Mahesh

2013-01-01

The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS) vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD) coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future. PMID:23833515

Innovative on-chip packaging applied to uncooled IRFPA

NASA Astrophysics Data System (ADS)

Dumont, Geoffroy; Arnaud, Agnès; Impérinetti, Pierre; Vialle, Claire; Rabaud, Wilfried; Goudon, Valérie; Yon, Jean-Jacques

2008-04-01

The Laboratoire Infrarouge (LIR) of the Laboratoire d'Electronique et de Technologie de l'Information (LETI) has been involved in the development of microbolometers for over fifteen years. Two generations of technology have been transferred to ULIS and LETI is still working to improve performances of low cost detectors. Simultaneously, packaging still represents a significant part of detectors price. Reducing production costs would contribute to keep on extending applications of uncooled IRFPA to high volume markets like automotive. Therefore LETI is developing an on-chip packaging technology dedicated to microbolometers. This paper presents an original microcap structure that enables the use of IR window materials as sealing layers to maintain the expected vacuum level. The modelling and integration of an IR window suitable for this structure is also presented. This monolithic packaging technology is performed in a standard collective way, in continuation of bolometers' technology. The CEA-LETI, MINATEC presents status of these developments concerning this innovating technology including optical simulations results and SEM views of technical realizations.

Trends in Food Packaging.

ERIC Educational Resources Information Center

Ott, Dana B.

1988-01-01

This article discusses developments in food packaging, processing, and preservation techniques in terms of packaging materials, technologies, consumer benefits, and current and potential food product applications. Covers implications due to consumer life-style changes, cost-effectiveness of packaging materials, and the ecological impact of…

SMALL DRINKING WATER SYSTEMS HANDBOOK A GUIDE TO "PACKAGED" FILTRATION AND DISINFECTION TECHNOLOGIES WITH REMOTE MONITORING AND CONTROL TOOLS

EPA Science Inventory

The intent of this handbook is to highlight information appropriate to small systems with an emphasis on filtration and disinfection technologies and how they can be "packaged" with remote monitoring and control technologies to provide a healthy and affordable solution for small ...

Design Brief--Packaging: More than Just a Box! Communications: Getting the Message across with Advertising. Technology Learning Activities.

ERIC Educational Resources Information Center

Technology Teacher, 1991

1991-01-01

Each technology learning activity in this article includes content description, objectives, required materials, challenge, and evaluation questions. Subjects are designing product packages and communication through advertising. (SK)

High Frequency Electronic Packaging Technology

NASA Technical Reports Server (NTRS)

Herman, M.; Lowry, L.; Lee, K.; Kolawa, E.; Tulintseff, A.; Shalkhauser, K.; Whitaker, J.; Piket-May, M.

1994-01-01

Commercial and government communication, radar, and information systems face the challenge of cost and mass reduction via the application of advanced packaging technology. A majority of both government and industry support has been focused on low frequency digital electronics.

Advanced Space Suit Portable Life Support Subsystem Packaging Design

NASA Technical Reports Server (NTRS)

Howe, Robert; Diep, Chuong; Barnett, Bob; Thomas, Gretchen; Rouen, Michael; Kobus, Jack

2006-01-01

This paper discusses the Portable Life Support Subsystem (PLSS) packaging design work done by the NASA and Hamilton Sundstrand in support of the 3 future space missions; Lunar, Mars and zero-g. The goal is to seek ways to reduce the weight of PLSS packaging, and at the same time, develop a packaging scheme that would make PLSS technology changes less costly than the current packaging methods. This study builds on the results of NASA s in-house 1998 study, which resulted in the "Flex PLSS" concept. For this study the present EMU schematic (low earth orbit) was used so that the work team could concentrate on the packaging. The Flex PLSS packaging is required to: protect, connect, and hold the PLSS and its components together internally and externally while providing access to PLSS components internally for maintenance and for technology change without extensive redesign impact. The goal of this study was two fold: 1. Bring the advanced space suit integrated Flex PLSS concept from its current state of development to a preliminary design level and build a proof of concept mockup of the proposed design, and; 2. "Design" a Design Process, which accommodates both the initial Flex PLSS design and the package modifications, required to accommodate new technology.

Literacity: A multimedia adult literacy package combining NASA technology, recursive ID theory, and authentic instruction theory

NASA Technical Reports Server (NTRS)

Willis, Jerry; Willis, Dee Anna; Walsh, Clare; Stephens, Elizabeth; Murphy, Timothy; Price, Jerry; Stevens, William; Jackson, Kevin; Villareal, James A.; Way, Bob

1994-01-01

An important part of NASA's mission involves the secondary application of its technologies in the public and private sectors. One current application under development is LiteraCity, a simulation-based instructional package for adults who do not have functional reading skills. Using fuzzy logic routines and other technologies developed by NASA's Information Systems Directorate and hypermedia sound, graphics, and animation technologies the project attempts to overcome the limited impact of adult literacy assessment and instruction by involving the adult in an interactive simulation of real-life literacy activities. The project uses a recursive instructional development model and authentic instruction theory. This paper describes one component of a project to design, develop, and produce a series of computer-based, multimedia instructional packages. The packages are being developed for use in adult literacy programs, particularly in correctional education centers. They use the concepts of authentic instruction and authentic assessment to guide development. All the packages to be developed are instructional simulations. The first is a simulation of 'finding a friend a job.'

Packaging and Embedded Electronics for the Next Generation

NASA Technical Reports Server (NTRS)

Sampson, Michael J.

2010-01-01

This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

PtCu substrates subjected to AC and DC electric fields in a solution of benzene sulfonic acid-phenol as novel batteries and their use in glucose biofuel cells

NASA Astrophysics Data System (ADS)

Ammam, Malika; Fransaer, Jan

2013-11-01

We describe how bi-metal PtCu connected wires, immersed in a solution of benzene sulfonic acid (BSA)-phenol (P) or 2,2‧-azino-bis(3-ethylbenzothiazoline-6-sulphonic acid) (ABTS)-phenol (P), then subjected to simultaneous alternating current (AC) and direct current (DC) electric fields generate power. We discovered that PtCu substrate covered by the deposit containing (BSA-PP-Pt-Cu), abbreviated as PtCu(BSA-PP-Pt-Cu) electrode, plays the role of a substantial anode and cathode. The latter was related to the formation of micro-batteries in the deposited film (BSA-PP-Pt-Cu) that are able to take or deliver electrons from the deposited Pt and Cu, respectively. PP-BSA plays probably the role of bridge for proton conduction in the formed micro-batteries. The power density of the fuel cell (FC)-based PtCu(BSA-PP-Pt-Cu) anode and PtCu(BSA-PP-Pt-Cu) cathode in phosphate buffer solution pH 7.4 at room temperature reaches ˜10.8 μW mm-2. Addition of enzymes, glucose oxidase at the anode and laccase at the cathode and, replacement of BSA by ABTS at the cathode in the deposited films increases the power density to 13.3 μW mm-2. This new procedure might be of great relevance for construction of a new generation of FCs operating at mild conditions or boost the power outputs of BFCs and make them suitable for diverse applications.

The NASA Electronic Parts and Packaging (NEPP) Program: Insertion of New Electronics Technologies

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2007-01-01

This viewgraph presentation gives an overview of NASA Electronic Parts and Packaging (NEPP) Program's new electronics technology trends. The topics include: 1) The Changing World of Radiation Testing of Memories; 2) Even Application-Specific Tests are Costly!; 3) Hypothetical New Technology Part Qualification Cost; 4) Where we are; 5) Approaching FPGAs as a More Than a "Part" for Reliability; 6) FPGAs Beget Novel Radiation Test Setups; 7) Understanding the Complex Radiation Data; 8) Tracking Packaging Complexity and Reliability for FPGAs; 9) Devices Supporting the FPGA Need to be Considered; 10) Summary of the New Electronic Technologies and Insertion into Flight Programs Workshop; and 11) Highlights of Panel Notes and Comments

(abstract) Electronic Packaging for Microspacecraft Applications

NASA Technical Reports Server (NTRS)

Wasler, David

1993-01-01

The intent of this presentation is to give a brief look into the future of electronic packaging for microspacecraft applications. Advancements in electronic packaging technology areas have developed to the point where a system engineer's visions, concepts, and requirements for a microspacecraft can now be a reality. These new developments are ideal candidates for microspacecraft applications. These technologies are capable of bringing about major changes in how we design future spacecraft while taking advantage of the benefits due to size, weight, power, performance, reliability , and cost. This presentation will also cover some advantages and limitations of surface mount technology (SMT), multichip modules (MCM), and wafer scale integration (WSI), and what is needed to implement these technologies into microspacecraft.

Adoption of Aquaculture Technology by Fish Farmers in Imo State of Nigeria

ERIC Educational Resources Information Center

Ike, Nwachukwu; Roseline, Onuegbu

2007-01-01

This paper evaluated the level of adoption of aquaculture technology extended to farmers in Imo State, Nigeria. To improve aquaculture practice in Nigeria, a technology package was developed and disseminated to farmers in the state. This package included ten practices that the farmers were supposed to adopt. Eighty-two respondents were randomly…

The Integration of an API619 Screw Compressor Package into the Industrial Internet of Things

NASA Astrophysics Data System (ADS)

Milligan, W. J.; Poli, G.; Harrison, D. K.

2017-08-01

The Industrial Internet of Things (IIoT) is the industrial subset of the Internet of Things (IoT). IIoT incorporates big data technology, harnessing the instrumentation data, machine to machine communication and automation technologies that have existed in industrial settings for years. As industry in general trends towards the IIoT and as the screw compressor packages developed by Howden Compressors are designed with a minimum design life of 25 years, it is imperative this technology is embedded immediately. This paper provides the reader with a description on the Industrial Internet of Things before moving onto describing the scope of the problem for an organisation like Howden Compressors who deploy multiple compressor technologies across multiple locations and focuses on the critical measurements particular to high specification screw compressor packages. A brief analysis of how this differs from high volume package manufacturers deploying similar systems is offered. Then follows a description on how the measured information gets from the tip of the instrument in the process pipework or drive train through the different layers, with a description of each layer, into the final presentation layer. The functions available within the presentation layer are taken in turn and the benefits analysed with specific focus on efficiency and availability. The paper concludes with how packagers adopting the IIoT can not only optimise their package but by utilising the machine learning technology and pattern detection applications can adopt completely new business models.

Technological substitution: the potential of plastic as primary packaging material in the US brewing industry

DOE Office of Scientific and Technical Information (OSTI.GOV)

Roeleveld, J.J.

1985-01-01

This dissertation develops a general model of technological substitution that could be of help to planners and decision makers in industry who are faced with the problems created by continual technological change. The model as presented differs from existing models in the theoretical literature because of its emphasis on analyzing current and potential technologies in an attempt to understand the underlying factors contributing to technological substitution. The general model and the cost model that is part of it belong to that step in the interactive planning cycle called the formulation of the mess. The methodology underlying the cost model ismore » a combination of life-cycle analysis (i.e., from raw materials in nature, through all intermediate products, to waste returned to the environment) and resoumetrics, which is an engineering approach to measuring all physical inputs required to produce a certain level of output. The models are illustrated with a specific field of interest: substitution of primary packaging technologies in the US brewing industry. The physical costs of packaging beer in different containers are compared. Strategic considerations for a brewery deciding to adopt plastic packaging technology are discussed. Attention is given to another potential fruitful application of the model in the field of technology transfer to developing countries.« less

High-pressure processing and antimicrobial biodegradable packaging to control Listeria monocytogenes during storage of cooked ham.

PubMed

Marcos, Begonya; Aymerich, Teresa; Monfort, Josep M; Garriga, Margarita

2008-02-01

The efficiency of combining high-pressure processing (HPP) and active packaging technologies to control Listeria monocytogenes growth during the shelf life of artificially inoculated cooked ham was assessed. Three lots of cooked ham were prepared: control, packaging with alginate films, and packaging with antimicrobial alginate films containing enterocins. After packaging, half of the samples were pressurized. Sliced cooked ham stored at 6 degrees C experienced a quick growth of L. monocytogenes. Both antimicrobial packaging and pressurization delayed the growth of the pathogen. However, at 6 degrees C the combination of antimicrobial packaging and HPP was necessary to achieve a reduction of inoculated levels without recovery during 60 days of storage. Further storage at 6 degrees C of pressurized antimicrobial packed cooked ham resulted in L. monocytogenes levels below the detection limit (day 90). On the other hand, storage at 1 degrees C controlled the growth of the pathogen until day 39 in non-pressurized ham, while antimicrobial packaging and storage at 1 degrees C exerted a bacteriostatic effect for 60 days. All HPP lots stored at 1 degrees C led to counts <100CFU/g at day 60. Similar results were observed when combining both technologies. After a cold chain break no growth of L. monocytogenes was observed in pressurized ham packed with antimicrobial films, showing the efficiency of combining both technologies.

Introducing Current Technologies

NASA Technical Reports Server (NTRS)

Mitchell, Tiffany

1995-01-01

The objective of the study was a continuation of the 'technology push' activities that the Technology Transfer Team conducts at this time. It was my responsibility to research current technologies at Langley Research Center and find a commercial market for these technologies in the private industry. After locating a market for the technologies, a mailing package was put together which informed the companies of the benefits of NASA Langley's technologies. The mailing package included articles written about the technology, patent material, abstracts from technical papers, and one-pagers which were used at the Technology Opportunities Showcase (TOPS) exhibitions. The companies were encouraged to consult key team members for further information on the technologies.

Fecundity of Tribolium castaneum and Tribolium confusum adults after exposure to deltamethrin packaging

USDA-ARS?s Scientific Manuscript database

The red flour beetle, Tribolium castaneum (Herbst), and the confused flour beetle, Tribolium confusum Jacquelin du Val, are packaging invaders and will exploit any rip, tear, or defect in packaged food and infest the contents. Impregnating packaging materials with insecticides is a novel technologic...

Japan's electronic packaging technologies

NASA Technical Reports Server (NTRS)

Tummala, Rao R.; Pecht, Michael

1995-01-01

The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

Next-generation avionics packaging and cooling 'test results from a prototype system'

NASA Astrophysics Data System (ADS)

Seals, J. D.

The author reports on the design, material characteristics, and test results obtained under the US Air Force's advanced aircraft avionics packaging technologies (AAAPT) program, whose charter is to investigate new designs and technologies for reliable packaging, interconnection, and thermal management. Under this program, AT&T Bell Laboratories has completed the preliminary testing of and is evaluating a number of promising materials and technologies, including conformal encapsulation, liquid flow-through cooling, and a cyanate ester backplane. A fifty-two module system incorporating these and and other technologies has undergone preliminary cooling efficiency, shock, sine and random vibration, and maintenance testing. One of the primary objectives was to evaluate the interaction compatibility of new materials and designs with other components in the system.

Exploring new packaging and delivery options for the immunization supply chain.

PubMed

Zehrung, Darin; Jarrahian, Courtney; Giersing, Birgitte; Kristensen, Debra

2017-04-19

A variety of vaccine packaging and delivery technologies may benefit the immunization supply chain. These include alternative primary packaging, such as blow-fill-seal polymer containers, and novel delivery technologies, such intradermal delivery devices, microarray patches, and sublingual formulations of vaccines, and others in development. The potential timeline to availability of these technologies varies and depends on their stage of development and the type of data necessary to achieve licensure. Some new delivery devices are anticipated to be introduced in 2017, such as intradermal devices for delivery of inactivated poliovirus vaccine to stretch vaccine supplies due to a supply limitation. Other new technologies requiring vaccine reformulation, such as microarray patches and sublingual vaccines, may become available in the long term (2021 and beyond). Development of many new technologies requires partnership between vaccine and technology manufacturers and identification of the applicable regulatory pathway. Interaction with public-sector stakeholders early on (through engagement with forums such as the World Health Organization's Immunization Practices Advisory Committee Delivery Technologies Working Group) is important to ensure suitability for immunization program use. Key considerations for programmatic suitability of a new vaccine, packaging, and delivery device include cold chain volume, costs, and health impact. Copyright © 2017 The Authors. Published by Elsevier Ltd.. All rights reserved.

PICSiP: new system-in-package technology using a high bandwidth photonic interconnection layer for converged microsystems

NASA Astrophysics Data System (ADS)

Tekin, Tolga; Töpper, Michael; Reichl, Herbert

2009-05-01

Technological frontiers between semiconductor technology, packaging, and system design are disappearing. Scaling down geometries [1] alone does not provide improvement of performance, less power, smaller size, and lower cost. It will require "More than Moore" [2] through the tighter integration of system level components at the package level. System-in-Package (SiP) will deliver the efficient use of three dimensions (3D) through innovation in packaging and interconnect technology. A key bottleneck to the implementation of high-performance microelectronic systems, including SiP, is the lack of lowlatency, high-bandwidth, and high density off-chip interconnects. Some of the challenges in achieving high-bandwidth chip-to-chip communication using electrical interconnects include the high losses in the substrate dielectric, reflections and impedance discontinuities, and susceptibility to crosstalk [3]. Obviously, the incentive for the use of photonics to overcome the challenges and leverage low-latency and highbandwidth communication will enable the vision of optical computing within next generation architectures. Supercomputers of today offer sustained performance of more than petaflops, which can be increased by utilizing optical interconnects. Next generation computing architectures are needed with ultra low power consumption; ultra high performance with novel interconnection technologies. In this paper we will discuss a CMOS compatible underlying technology to enable next generation optical computing architectures. By introducing a new optical layer within the 3D SiP, the development of converged microsystems, deployment for next generation optical computing architecture will be leveraged.

Power Electronics Packaging Reliability | Transportation Research | NREL

Science.gov Websites

interface materials, are a key enabling technology for compact, lightweight, low-cost, and reliable power , reliability, and cost. High-temperature bonded interface materials are an important facilitating technology for compact, lightweight, low-cost, reliable power electronics packaging that fully utilizes the

Performance Stability of Silicone Oxide-Coated Plastic Parenteral Vials.

PubMed

Weikart, Christopher M; Pantano, Carlo G; Shallenberger, Jeff R

2017-01-01

A new packaging system was developed for parenteral pharmaceuticals that combines the best attributes of plastic and glass without their respective drawbacks. This technological advancement is based on the synergy between high-precision injection-molded plastics and plasma coating technology. The result is a shatter-resistant, optically clear, low-particulate, and chemically durable packaging system. The demand for this product is driven by the expanding market, regulatory constraints, and product recalls for injectable drugs and biologics packaged in traditional glass materials. It is shown that this new packaging system meets or exceeds the important performance characteristics of glass, especially in eliminating the glass delamination and breakage that has been observed in many products. The new packaging system is an engineered, multilayer, glass-coated plastic composite that provides a chemically stable contact surface and oxygen barrier performance that exceeds a 2 year shelf life requirement. Evaluation of the coating system characteristics and performance stability to chemical, temperature, and mechanical extremes are reported herein. LAY ABSTRACT: A new packaging system for parenteral pharmaceuticals was developed that combines the best attributes of plastic and glass without their respective drawbacks. This technological advancement is based on the synergy between high-precision injection-molded plastics and plasma coating technology. The result is a shatter-resistant, optically clear, low-particulate, and chemically durable packaging system. It is shown that this new packaging system meets or exceeds the important performance characteristics of glass, especially in eliminating the glass delamination and breakage that has been observed in many products. The new packaging system is an engineered, multilayer, glass-coated plastic composite that provides a chemically stable contact surface and oxygen barrier performance that exceeds a 2 year shelf life requirement. Evaluation of the coating system characteristics and performance stability to chemical, temperature, and mechanical extremes are reported herein. © PDA, Inc. 2017.

Technology for Space Station Evolution. Executive summary and overview

NASA Technical Reports Server (NTRS)

1990-01-01

NASA's Office of Aeronautics and Space Technology (OAST) conducted a workshop on technology for space station evolution 16-19 Jan. 1990. The purpose of this workshop was to collect and clarify Space Station Freedom technology requirements for evolution and to describe technologies that can potentially fill those requirements. These proceedings are organized into an Executive Summary and Overview and five volumes containing the technology discipline presentations. The Executive Summary and Overview contains an executive summary for the workshop, the technology discipline summary packages, and the keynote address. The executive summary provides a synopsis of the events and results of the workshop and the technology discipline summary packages.

Advanced Packaging Materials and Techniques for High Power TR Module: Standard Flight vs. Advanced Packaging

NASA Technical Reports Server (NTRS)

Hoffman, James Patrick; Del Castillo, Linda; Miller, Jennifer; Jenabi, Masud; Hunter, Donald; Birur, Gajanana

2011-01-01

The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires advances in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and compared to standard technologies.

Transmitter experiment package for the communications technology satellite

NASA Technical Reports Server (NTRS)

Farber, B.; Goldin, D. S.; Marcus, B.; Mock, P.

1977-01-01

The operating requirements, system design characteristics, high voltage packaging considerations, nonstandard components development, and test results for the transmitter experiment package (TEP) are described. The TEP is used for broadcasting power transmission from the Communications Technology Satellite. The TEP consists of a 12 GHz, 200-watt output stage tube (OST), a high voltage processing system that converts the unregulated spacecraft solar array power to the regulated voltages required for OST operation, and a variable conductance heat pipe system that is used to cool the OST body.

Multimedia package for LRFD concrete bridge design.

DOT National Transportation Integrated Search

2009-02-01

This Project developed a Load and Resistance Factor Design (LRFD) multimedia package to provide a practical introduction and an in-depth understanding of the technological advances in the design of concrete bridges. This package can be used to train ...

Modeling and MBL: Software Tools for Science.

ERIC Educational Resources Information Center

Tinker, Robert F.

Recent technological advances and new software packages put unprecedented power for experimenting and theory-building in the hands of students at all levels. Microcomputer-based laboratory (MBL) and model-solving tools illustrate the educational potential of the technology. These tools include modeling software and three MBL packages (which are…

Aligned TiO₂ nanotube/nanoparticle heterostructures with enhanced electrochemical performance as three-dimensional anode for lithium-ion microbatteries.

PubMed

Xie, Keyu; Guo, Min; Lu, Wei; Huang, Haitao

2014-11-14

A novel TiO₂ three-dimensional (3D) anode with an aligned TiO₂ nanotube/nanoparticle heterostructure (TiO₂ NTs/NPs) is developed by simply immersing as-anodized TiO₂ NTs into water and further crystallizing the TiO₂ NTs by post-annealing. The heterostructure, with its core in a tubular morphology and with both the outer and inner surface consisting of nanoparticles, is confirmed by FESEM and TEM. A reversible areal capacity of 0.126 mAh · cm(-2) is retained after 50 cycles for the TiO₂ NTs/NPs heterostructure electrode, which is higher than that of the TiO₂ NTs electrode (0.102 mAh · cm(-2) after 50 cycles). At the current densities of 0.02, 0.04, 0.06, 0.08, 0.10 and 0.20 mA · cm(-2), the areal capacities are 0.142, 0.127, 0.117, 0.110, 0.104 and 0.089 mAh · cm(-2), respectively, for the TiO₂ NTs/NPs heterostructure electrode compared to the areal capacities of 0.123, 0.112, 0.105, 0.101, 0.094 and 0.083 mAh · cm(-2), respectively, for the the TiO₂ NTs electrode. The enhanced electrochemical performance is attributed to the unique microstructure of the TiO₂ NTs/NPs heterostructure electrode with the TiO₂ NT core used as a straight pathway for electronic transport and with TiO₂ NP offering enhanced surface areas for facile Li+ insertion/extraction. The results described here inspire a facile approach to fabricate a 3D anode with an enhanced electrochemical performance for lithium-ion microbattery applications.

Electronic Switch Arrays for Managing Microbattery Arrays

NASA Technical Reports Server (NTRS)

Mojarradi, Mohammad; Alahmad, Mahmoud; Sukumar, Vinesh; Zghoul, Fadi; Buck, Kevin; Hess, Herbert; Li, Harry; Cox, David

2008-01-01

Integrated circuits have been invented for managing the charging and discharging of such advanced miniature energy-storage devices as planar arrays of microscopic energy-storage elements [typically, microscopic electrochemical cells (microbatteries) or microcapacitors]. The architecture of these circuits enables implementation of the following energy-management options: dynamic configuration of the elements of an array into a series or parallel combination of banks (subarrarys), each array comprising a series of parallel combination of elements; direct addressing of individual banks for charging/or discharging; and, disconnection of defective elements and corresponding reconfiguration of the rest of the array to utilize the remaining functional elements to obtain the desited voltage and current performance. An integrated circuit according to the invention consists partly of a planar array of field-effect transistors that function as switches for routing electric power among the energy-storage elements, the power source, and the load. To connect the energy-storage elements to the power source for charging, a specific subset of switches is closed; to connect the energy-storage elements to the load for discharging, a different specific set of switches is closed. Also included in the integrated circuit is circuitry for monitoring and controlling charging and discharging. The control and monitoring circuitry, the switching transistors, and interconnecting metal lines are laid out on the integrated-circuit chip in a pattern that registers with the array of energy-storage elements. There is a design option to either (1) fabricate the energy-storage elements in the corresponding locations on, and as an integral part of, this integrated circuit; or (2) following a flip-chip approach, fabricate the array of energy-storage elements on a separate integrated-circuit chip and then align and bond the two chips together.

Terahertz MMICs and Antenna-in-Package Technology at 300 GHz for KIOSK Download System

NASA Astrophysics Data System (ADS)

Tajima, Takuro; Kosugi, Toshihiko; Song, Ho-Jin; Hamada, Hiroshi; El Moutaouakil, Amine; Sugiyama, Hiroki; Matsuzaki, Hideaki; Yaita, Makoto; Kagami, Osamu

2016-12-01

Toward the realization of ultra-fast wireless communications systems, the inherent broad bandwidth of the terahertz (THz) band is attracting attention, especially for short-range instant download applications. In this paper, we present our recent progress on InP-based THz MMICs and packaging techniques based on low-temperature co-fibered ceramic (LTCC) technology. The transmitter MMICs are based on 80-nm InP-based high electron mobility transistors (HEMTs). Using the transmitter packaged in an E-plane split-block waveguide and compact lens receiver packaged in LTCC multilayered substrates, we tested wireless data transmission up to 27 Gbps with the simple amplitude key shifting (ASK) modulation scheme. We also present several THz antenna-in-packaging solutions based on substrate integrated waveguide (SIW) technology. A vertical hollow (VH) SIW was applied to a compact medium-gain SIW antenna and low-loss interconnection integrated in LTCC multi-layer substrates. The size of the LTCC antennas with 15-dBi gain is less than 0.1 cm3. For feeding the antenna, we investigated an LTCC-integrated transition and polyimide transition to LTCC VH SIWs. These transitions exhibit around 1-dB estimated loss at 300 GHz and more than 35 GHz bandwidth with 10-dB return loss. The proposed package solutions make antennas and interconnections easy to integrate in a compact LTCC package with an MMIC chip for practical applications.

Combining an Analytic Hierarchy Process and TOPSIS for Selecting Postharvest Technology Method for Selayar Citrus in Indonesia

NASA Astrophysics Data System (ADS)

Dirpan, Andi

2018-05-01

This research was intended to select the best handling methods or postharvest technologies that can be used to maintain the quality of citrus fruit in Selayar, South Sulawesi, Indonesia among (1) modified atmosphere packaging (MAP (2) Controlled atmosphere storage (CAS) (3) coatings (4) hot water treatment (5) Hot Calcium Dip (HCD) by using combination between an analytic hierarchy process (AHP) and TOPSIS. Improving quality, applicability, increasing shelf life and reducing cost are used as the criteria to determine the best postharvest technologies. The results show that the most important criteria for selecting postharvest technology is improving quality followed by increasing shelf life, reducing cost and applicability. Furthermore, by using TOPSIS, it is clear that the postharvest technology that had the lowest rangking is modified atmosphere packaging (MAP), followed by controlled atmosphere storage (CAS), coatings, hot calcium dip (HCD) and hot water treatment (HWT). Therefore, it can be concluded that the best postharvest technology method for Selayar citrus is modified atmosphere packaging (MAP).

High barrier multilayer packaging by the coextrusion method: The effect of nanocomposites and biodegradable polymers on flexible film properties

NASA Astrophysics Data System (ADS)

Thellen, Christopher T.

The objective of this research was to investigate the use of nanocomposite and multilayer co-extrusion technologies for the development of high gas barrier packaging that is more environmentally friendly than many current packaging system. Co-extruded bio-based and biodegradable polymers that could be composted in a municipal landfill were one direction that this research was aimed. Down-gauging of high performance barrier films using nanocomposite technology and co-extrusion was also investigated in order to reduce the amount of solid waste being generated by the packaging. Although the research is focused on military ration packaging, the technologies could easily be introduced into the commercial flexible packaging market. Multilayer packaging consisting of poly(m-xylylene adipamide) nanocomposite layers along with adhesive and tie layers was co-extruded using both laboratory and pilot-scale film extrusion equipment. Co-extrusion of biodegradable polyhydroxyalkanoates (PHA) along with polyvinyl alcohol (PVOH) and tie layers was also accomplished using similar co-extrusion technology. All multilayer films were characterized for gas barrier, mechanical, and thermal properties. The biodegradability of the PVOH and PHA materials in a marine environment was also investigated. The research has shown that co-extrusion of these materials is possible at a research and pilot level. The use of nanocomposite poly(m-xylylene adipamide) was effective in down-gauging the un-filled barrier film to thinner structures. Bio-based PHA/PVOH films required the use of a malefic anhydride grafted PHA tie layer to improve layer to layer adhesion in the structure to avoid delamination. The PHA polymer demonstrated a high rate of biodegradability/mineralization in the marine environment while the rate of biodegradation of the PVOH polymer was slower.

Modular avionics packaging standardization

NASA Astrophysics Data System (ADS)

Austin, M.; McNichols, J. K.

The Modular Avionics Packaging (MAP) Program for packaging future military avionics systems with the objective of improving reliability, maintainability, and supportability, and reducing equipment life cycle costs is addressed. The basic MAP packaging concepts called the Standard Avionics Module, the Standard Enclosure, and the Integrated Rack are summarized, and the benefits of modular avionics packaging, including low risk design, technology independence with common functions, improved maintainability and life cycle costs are discussed. Progress made in MAP is briefly reviewed.

Use of Dual Electromagnetic Radiation Technology to Reduce Salmonella and Listeria monocytogenes Risk on Cooked and Packaged Meat Products

USDA-ARS?s Scientific Manuscript database

Pathogenic bacteria including Salmonella and Listeria can potentially contaminate ready-to-eat meats. These bacteria compromise the safety of our food supply. The objective of this research was to develop and test new low temperature pasteurization technology for packaged or thermally sensitive food...

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Hunter, Gary W.; Neudeck, Philip G.

2001-01-01

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/bottom Termination Components (QFN/BTC) Package Trends and Reliability

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2014-01-01

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2014-01-01

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

Polymer dispensing and embossing technology for the lens type LED packaging

NASA Astrophysics Data System (ADS)

Chien, Chien-Lin Chang; Huang, Yu-Che; Hu, Syue-Fong; Chang, Chung-Min; Yip, Ming-Chuen; Fang, Weileun

2013-06-01

This study presents a ring-type micro-structure design on the substrate and its corresponding micro fabrication processes for a lens-type light-emitting diode (LED) package. The dome-type or crater-type silicone lenses are achieved by a dispensing and embossing process rather than a molding process. Silicone with a high viscosity and thixotropy index is used as the encapsulant material. The ring-type micro structure is adopted to confine the dispensed silicone encapsulant so as to form the packaged lens. With the architecture and process described, this LED package technology herein has three merits: (1) the flexibility of lens-type LED package designs is enhanced; (2) a dome-type package design is used to enhance the intensity; (3) a crater-type package design is used to enhance the view angle. Measurement results show the ratio between the lens height and lens radius can vary from 0.4 to 1 by changing the volume of dispensed silicone. The view angles of dome-type and crater-type packages can reach 155° ± 5° and 175° ± 5°, respectively. As compared with the commercial plastic leaded chip carrier-type package, the luminous flux of a monochromatic blue light LED is improved by 15% by the dome-type package (improved by 7% by the crater-type package) and the luminous flux of a white light LED is improved by 25% by the dome-type package (improved by 13% by the crater-type package). The luminous flux of monochromatic blue light LED and white light LED are respectively improved by 8% and 12% by the dome-type package as compare with the crater-type package.

Packaging for Food Service

NASA Technical Reports Server (NTRS)

Stilwell, E. J.

1985-01-01

Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

Japan's technology and manufacturing infrastructure

NASA Astrophysics Data System (ADS)

Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

1995-02-01

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Japan's technology and manufacturing infrastructure

NASA Technical Reports Server (NTRS)

Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

1995-01-01

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Comparison of TAPS Packages for Engineering

ERIC Educational Resources Information Center

Sidhu, S. Manjit

2008-01-01

Purpose: This paper aims to present the development of technology-assisted problem solving (TAPS) packages at University Tenaga Nasional (UNITEN). The project is the further work of the development of interactive multimedia based packages targeted for students having problems in understanding the subject of engineering mechanics dynamics.…

10 CFR 431.92 - Definitions concerning commercial air conditioners and heat pumps.

Code of Federal Regulations, 2014 CFR

2014-01-01

... measurement. Commercial package air-conditioning and heating equipment means air-cooled, water-cooled... Conditioner means a basic model of commercial package air-conditioning and heating equipment (packaged or split) that is: Used in computer rooms, data processing rooms, or other information technology cooling...

Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas

NASA Technical Reports Server (NTRS)

Gaucher, Brian P. (Inventor); Grzyb, Janusz (Inventor); Liu, Duixian (Inventor); Pfeiffer, Ullrich R. (Inventor)

2008-01-01

Apparatus and methods are provided for packaging IC chips together with integrated antenna modules designed to provide a closed EM (electromagnetic) environment for antenna radiators, thereby allowing antennas to be designed independent from the packaging technology.

Biosensors and Biofuel Cells based on Vertically Aligned Carbon Nanotubes for Integrated Energy Sensing, Generation, and Storage (SGS) Systems

NASA Astrophysics Data System (ADS)

Pandey, Archana; Prasad, Abhishek; Khin Yap, Yoke

2010-03-01

Diabetes is a growing health issue in the nation. Thus in-situ glucose sensors that can monitor the glucose level in our body are in high demand. Furthermore, it will be exciting if the excessive blood sugar can be converted into usable energy, and be stored in miniature batteries for applications. This will be the basis for an integrated energy sensing, generation, and storage (SGS) system in the future. Here we report the use of functionalized carbon nanotubes arrays as the glucose sensors as well as fuel cells that can convert glucose into energy. In principle, these devices can be integrated to detect excessive blood glucose and then convert the glucose into energy. They are also inline with our efforts on miniature 3D microbatteries using CNTs [1]. All these devices will be the basis for future SGS systems. Details of these results will be discussed in the meeting. [1] Wang et al., in 206^th Meeting of the Electrochemical Society, October 3-8, Honolulu, Hawaii (2004), Symposium Q1, abstract 1492. Y. K. Yap acknowledges supports from DARPA (DAAD17-03-C-0115), USDA (2007-35603-17740), and the Multi-Scale Technologies Institute (MuSTI) at MTU.

Technology Instructional Package Mediated Instruction and Senior Secondary School Students' Academic Performance in Biology Concepts

ERIC Educational Resources Information Center

Yaki, Akawo Angwal; Babagana, Mohammed

2016-01-01

The paper examined the effects of a Technological Instructional Package (TIP) on secondary school students' performance in biology. The study adopted a pre-test, post-test experimental control group design. The sample size of the study was 80 students from Minna metropolis, Niger state, Nigeria; the samples were randomly assigned into treatment…

Using a Computerised Graphics Package to Achieve a Technology-Oriented Classroom

ERIC Educational Resources Information Center

Aladejana, Francisca; Idowu, Lanre

2009-01-01

The present situation in Nigeria involves students of fine arts, a practical-oriented subject, being exposed to poor methods of teaching with consequent poor performances. This study examined the extent to which the use of a computerised graphics package could make the classroom technology-oriented and affect the performance of learners. This is…

Technology transfer package on seismic base isolation - Volume II

DOE Office of Scientific and Technical Information (OSTI.GOV)

NONE

1995-02-14

This Technology Transfer Package provides some detailed information for the U.S. Department of Energy (DOE) and its contractors about seismic base isolation. Intended users of this three-volume package are DOE Design and Safety Engineers as well as DOE Facility Managers who are responsible for reducing the effects of natural phenomena hazards (NPH), specifically earthquakes, on their facilities. The package was developed as part of DOE's efforts to study and implement techniques for protecting lives and property from the effects of natural phenomena and to support the International Decade for Natural Disaster Reduction. Volume II contains the proceedings for the Shortmore » Course on Seismic Base Isolation held in Berkeley, California, August 10-14, 1992.« less

Innovative on-chip packaging applied to uncooled IRFPA

NASA Astrophysics Data System (ADS)

Dumont, Geoffroy; Arnaud, Agnès; Imperinetti, Pierre; Mottin, Eric; Simoens, François; Vialle, Claire; Rabaud, Wilfried; Grand, Gilles; Baclet, Nathalie

2008-03-01

The Laboratoire Infrarouge (LIR) of the Laboratoire d'Electronique et de Technologie de l'Information (LETI) has been involved in the development of microbolometers for over fifteen years. Two generations of technology have been transferred to ULIS and LETI is still working to improve performances of low cost detectors. Simultaneously, packaging still represents a significant part of detectors price. Reducing production costs would contribute to keep on extending applications of uncooled IRFPA to high volume markets like automotive. Therefore LETI develops an onchip packaging technology dedicated to microbolometers. The efficiency of a micropackaging technology for microbolometers relies on two major technical specifications. First, it must include an optical window with a high transmittance for the IR band, so as to maximize the detector absorption. Secondly, in order to preserve the thermal insulation of the detector, the micropackaging must be hermetically closed to maintain a vacuum level lower than 10 -3mbar. This paper presents an original microcap structure that enables the use of IR window materials as sealing layers to maintain the expected vacuum level. The modelling and integration of an IR window suitable for this structure is also presented. This zero level packaging technology is performed in a standard collective way, in continuation of bolometers' technology. The CEA-LETI, MINATEC presents status of these developments concerning this innovating technology including optical simulations results and SEM views of technical realizations.

Canputer Science and Technology: Introduction to Software Packages

DTIC Science & Technology

1984-04-01

Table 5 Sources of Software Packages.20 Table 6 Reference Services Matrix . 33 Table 7 Reference Matrix.40 LIST OF FIGURES Figure 1 Document...consideration should be given to the acquisition of appropriate software packages to replace or upgrade existing services and to provide services not...Consequently, there are many companies that produce only software packages, and are committed to providing training, service , and support. These vendors

Packaging Technologies for High Temperature Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

2013-01-01

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Packaging Technologies for High Temperature Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liangyu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

2013-01-01

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Short communication: Effect of active food packaging materials on fluid milk quality and shelf life.

PubMed

Wong, Dana E; Goddard, Julie M

2014-01-01

Active packaging, in which active agents are embedded into or on the surface of food packaging materials, can enhance the nutritive value, economics, and stability of food, as well as enable in-package processing. In one embodiment of active food packaging, lactase was covalently immobilized onto packaging films for in-package lactose hydrolysis. In prior work, lactase was covalently bound to low-density polyethylene using polyethyleneimine and glutaraldehyde cross-linkers to form the packaging film. Because of the potential contaminants of proteases, lipases, and spoilage organisms in typical enzyme preparations, the goal of the current work was to determine the effect of immobilized-lactase active packaging technology on unanticipated side effects, such as shortened shelf-life and reduced product quality. Results suggested no evidence of lipase or protease activity on the active packaging films, indicating that such active packaging films could enable in-package lactose hydrolysis without adversely affecting product quality in terms of dairy protein or lipid stability. Storage stability studies indicated that lactase did not migrate from the film over a 49-d period, and that dry storage resulted in 13.41% retained activity, whereas wet storage conditions enabled retention of 62.52% activity. Results of a standard plate count indicated that the film modification reagents introduced minor microbial contamination; however, the microbial population remained under the 20,000 cfu/mL limit through the manufacturer's suggested 14-d storage period for all film samples. This suggests that commercially produced immobilized lactase active packaging should use purified cross-linkers and enzymes. Characterization of unanticipated effects of active packaging on food quality reported here is important in demonstrating the commercial potential of such technologies. Copyright © 2014 American Dairy Science Association. Published by Elsevier Inc. All rights reserved.

An evaluation of the effectiveness of FreshCase technology to extend the storage life of whole muscle beef and ground beef.

PubMed

Yang, X; Woerner, D R; Hasty, J D; McCullough, K R; Geornaras, I; Sofos, J N; Belk, K E

2016-11-01

The objective of this study was to identify the maximum time of refrigerated storage before aerobic psychrotrophic bacteria (APB) grew to a level indicative of spoilage (7 log cfu/g) or other indicators of spoilage were observed for whole muscle beef and ground beef packaged using FreshCase technology. Storage life for beef steaks stored in FreshCase packages at 4°C was 36 d, with ground beef stored in FreshCase packages at 4°C lasting 10 d. Additionally, greater ( < 0.05) a* (redness) values were detected in FreshCase packaged samples of both beef steaks and ground beef over storage time. At the point of spoilage, off-odors were detected at very low levels in all samples along with low thiobarbituric acid values (< 2 mg malonaldehyde/kg). Therefore, use of FreshCase technology in whole muscle beef and ground beef is a viable option to extend storage life.

Packaging and testing of multi-wavelength DFB laser array using REC technology

NASA Astrophysics Data System (ADS)

Ni, Yi; Kong, Xuan; Gu, Xiaofeng; Chen, Xiangfei; Zheng, Guanghui; Luan, Jia

2014-02-01

Packaging of distributed feedback (DFB) laser array based on reconstruction-equivalent-chirp (REC) technology is a bridge from chip to system, and influences the practical process of REC chip. In this paper, DFB laser arrays of 4-channel @1310 nm and 8-channel @1550 nm are packaged. Our experimental results show that both these laser arrays have uniform wavelength spacing and larger than 35 dB average Side Mode Suppression Ratio (SMSR). When I=35 mA, we obtain the total output power of 1 mW for 4-channel @1310 nm, and 227 μw for 8-channel @1550 nm respectively. The high frequency characteristics of the packaged chips are also obtained, and the requirements for 4×10 G or even 8×10 G systems can be reached. Our results demonstrate the practical and low cost performance of REC technology and indicate its potential in the future fiber-to-the-home (FTTH) application.

Nanotechnology: An Untapped Resource for Food Packaging.

PubMed

Sharma, Chetan; Dhiman, Romika; Rokana, Namita; Panwar, Harsh

2017-01-01

Food commodities are packaged and hygienically transported to protect and preserve them from any un-acceptable alteration in quality, before reaching the end-consumer. Food packaging continues to evolve along-with the innovations in material science and technology, as well as in light of consumer's demand. Presently, the modern consumers of competitive economies demands for food with natural quality, assured safety, minimal processing, extended shelf-life and ready-to-eat concept. Innovative packaging systems, not only ascertains transit preservation and effective distribution, but also facilitates communication at the consumer levels. The technological advances in the domain of food packaging in twenty-first century are mainly chaired by nanotechnology, the science of nano-materials. Nanotechnology manipulates and creates nanometer scale materials, of commercial and scientific relevance. Introduction of nanotechnology in food packaging sector has significantly addressed the food quality, safety and stability concerns. Besides, nanotechnology based packaging intimate's consumers about the real time quality of food product. Additionally, nanotechnology has been explored for controlled release of preservatives/antimicrobials, extending the product shelf life within the package. The promising reports for nanotechnology interventions in food packaging have established this as an independent priority research area. Nanoparticles based food packages offer improved barrier and mechanical properties, along with food preservation and have gained welcoming response from market and end users. In contrary, recent advances and up-liftment in this area have raised various ethical, environmental and safety concerns. Policies and regulation regarding nanoparticles incorporation in food packaging are being reviewed. This review presents the existing knowledge, recent advances, concerns and future applications of nanotechnology in food packaging sector.

Nanotechnology: An Untapped Resource for Food Packaging

PubMed Central

Sharma, Chetan; Dhiman, Romika; Rokana, Namita; Panwar, Harsh

2017-01-01

Food commodities are packaged and hygienically transported to protect and preserve them from any un-acceptable alteration in quality, before reaching the end-consumer. Food packaging continues to evolve along-with the innovations in material science and technology, as well as in light of consumer's demand. Presently, the modern consumers of competitive economies demands for food with natural quality, assured safety, minimal processing, extended shelf-life and ready-to-eat concept. Innovative packaging systems, not only ascertains transit preservation and effective distribution, but also facilitates communication at the consumer levels. The technological advances in the domain of food packaging in twenty-first century are mainly chaired by nanotechnology, the science of nano-materials. Nanotechnology manipulates and creates nanometer scale materials, of commercial and scientific relevance. Introduction of nanotechnology in food packaging sector has significantly addressed the food quality, safety and stability concerns. Besides, nanotechnology based packaging intimate's consumers about the real time quality of food product. Additionally, nanotechnology has been explored for controlled release of preservatives/antimicrobials, extending the product shelf life within the package. The promising reports for nanotechnology interventions in food packaging have established this as an independent priority research area. Nanoparticles based food packages offer improved barrier and mechanical properties, along with food preservation and have gained welcoming response from market and end users. In contrary, recent advances and up-liftment in this area have raised various ethical, environmental and safety concerns. Policies and regulation regarding nanoparticles incorporation in food packaging are being reviewed. This review presents the existing knowledge, recent advances, concerns and future applications of nanotechnology in food packaging sector. PMID:28955314

Life testing of reflowed and reworked advanced CCGA surface mount packages in harsh thermal environments

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2013-03-01

Life testing/qualification of reflowed (1st reflow) and reworked (1st reflow, 1st removal, and then 1st rework) advanced ceramic column grid array (CCGA) surface mount interconnect electronic packaging technologies for future flight projects has been studied to enhance the mission assurance of JPL-NASA projects. The reliability of reworked/reflowed surface mount technology (SMT) packages is very important for short-duration and long-duration deep space harsh extreme thermal environmental missions. The life testing of CCGA electronic packages under extreme thermal environments (for example: -185°C to +125°C) has been performed with reference to various JPL/NASA project requirements which encompass the temperature range studied. The test boards of reflowed and reworked CCGA packages (717 Xilinx package, 624, 1152, and 1272 column Actel Packages) were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases or cycles to failure to assess the life of the hardware. Qualification/life testing was performed by subjecting test boards to the environmental harsh temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance solder-joint failures due to either overstress or thermal cycle fatigue. The large, high density, high input/output (I/O) electronic interconnect SMT packages such as CCGA have increased usage in avionics hardware of NASA projects during the last two decades. The test boards built with CCGA packages are expensive and often require a rework to replace a reflowed, reprogrammed, failed, redesigned, etc., CCGA packages. Theoretically speaking, a good rework process should have similar temperature-time profile as that used for the original manufacturing process of solder reflow. A multiple rework processes may be implemented with CCGA packaging technology to understand the effect of number of reworks on the reliability of this technology for harsh thermal environments. In general, reliability of the assembled electronic packages reduces as a function of number of reworks and the extent is not known yet. A CCGA rework process has been tried and implemented to design a daisy-chain test board consists of 624 and 717 packages. Reworked CCGA interconnect electronic packages of printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging and optical microscope techniques. The assembled boards after 1st rework and 1st reflow were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space JPL/NASA for moderate to harsh thermal mission environments. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling to determine intermittent failures. This paper provides the experimental reliability test results to failure of assemblies for the first time of reflowed and reworked CCGA packages under extreme harsh thermal environments.

Technology transfer initiatives

NASA Technical Reports Server (NTRS)

Mccain, Wayne; Schroer, Bernard J.; Ziemke, M. Carl

1994-01-01

This report summarizes the University of Alabama in Huntsville (UAH) technology transfer activities with the Marshall Space Flight Center (MSFC) for the period of April 1993 through December 1993. Early in 1993, the MSFC/TUO and UAH conceived of the concept of developing stand-alone, integrated data packages on MSFC technology that would serve industrial needs previously determined to be critical. Furthermore, after reviewing over 500 problem statements received by MSFC, it became obvious that many of these requests could be satisfied by a standard type of response. As a result, UAH has developed two critical area response (CAR) packages: CFC (chlorofluorocarbon) replacements and modular manufacturing and simulation. Publicity included news releases, seminars, articles and conference papers. The Huntsville Chamber of Commerce established the Technology Transfer Subcommittee with the charge to identify approaches for the Chamber to assist its members, as well as non-members, access to the technologies at the federal laboratories in North Alabama. The Birmingham Chamber of Commerce has expressed interest in establishing a similar technology transfer program. This report concludes with a section containing a tabulation of the problem statements, including CAR packages, submitted to MSFC from January 1992 through December 1993.

Fresh meat packaging: consumer acceptance of modified atmosphere packaging including carbon monoxide.

PubMed

Grebitus, Carola; Jensen, Helen H; Roosen, Jutta; Sebranek, Joseph G

2013-01-01

Consumers' perceptions and evaluations of meat quality attributes such as color and shelf life influence purchasing decisions, and these product attributes can be affected by the type of fresh meat packaging system. Modified atmosphere packaging (MAP) extends the shelf life of fresh meat and, with the inclusion of carbon monoxide (CO-MAP), achieves significant color stabilization. The objective of this study was to assess whether consumers would accept specific packaging technologies and what value consumers place on ground beef packaged under various atmospheres when their choices involved the attributes of color and shelf life. The study used nonhypothetical consumer choice experiments to determine the premiums that consumers are willing to pay for extended shelf life resulting from MAP and for the "cherry red" color in meat resulting from CO-MAP. The experimental design allowed determination of whether consumers would discount foods with MAP or CO-MAP when (i) they are given more detailed information about the technologies and (ii) they have different levels of individual knowledge and media exposure. The empirical analysis was conducted using multinomial logit models. Results indicate that consumers prefer an extension of shelf life as long as the applied technology is known and understood. Consumers had clear preferences for brighter (aerobic and CO) red color and were willing to pay $0.16/lb ($0.35/kg) for each level of change to the preferred color. More information on MAP for extending the shelf life and on CO-MAP for stabilizing color decreased consumers' willingness to pay. An increase in personal knowledge and media exposure influenced acceptance of CO-MAP negatively. The results provide quantitative measures of how packaging affects consumers' acceptance and willingness to pay for products. Such information can benefit food producers and retailers who make decisions about investing in new packaging methods.

A multimedia adult literacy program: Combining NASA technology, instructional design theory, and authentic literacy concepts

NASA Technical Reports Server (NTRS)

Willis, Jerry W.

1993-01-01

For a number of years, the Software Technology Branch of the Information Systems Directorate has been involved in the application of cutting edge hardware and software technologies to instructional tasks related to NASA projects. The branch has developed intelligent computer aided training shells, instructional applications of virtual reality and multimedia, and computer-based instructional packages that use fuzzy logic for both instructional and diagnostic decision making. One outcome of the work on space-related technology-supported instruction has been the creation of a significant pool of human talent in the branch with current expertise on the cutting edges of instructional technologies. When the human talent is combined with advanced technologies for graphics, sound, video, CD-ROM, and high speed computing, the result is a powerful research and development group that both contributes to the applied foundations of instructional technology and creates effective instructional packages that take advantage of a range of advanced technologies. Several branch projects are currently underway that combine NASA-developed expertise to significant instructional problems in public education. The branch, for example, has developed intelligent computer aided software to help high school students learn physics and staff are currently working on a project to produce educational software for young children with language deficits. This report deals with another project, the adult literacy tutor. Unfortunately, while there are a number of computer-based instructional packages available for adult literacy instruction, most of them are based on the same instructional models that failed these students when they were in school. The teacher-centered, discrete skill and drill-oriented, instructional strategies, even when they are supported by color computer graphics and animation, that form the foundation for most of the computer-based literacy packages currently on the market may not be the most effective or most desirable way to use computer technology in literacy programs. This project is developing a series of instructional packages that are based on a different instructional model - authentic instruction. The instructional development model used to create these packages is also different. Instead of using the traditional five stage linear, sequential model based on behavioral learning theory, the project uses the recursive, reflective design and development model (R2D2) that is based on cognitive learning theory, particularly the social constructivism of Vygotsky, and an epistemology based on critical theory. Using alternative instructional and instructional development theories, the result of the summer faculty fellowship is LiteraCity, a multimedia adult literacy instructional package that is a simulation of finding and applying for a job. The program, which is about 120 megabytes, is distributed on CD-ROM.

Merging parallel optics packaging and surface mount technologies

NASA Astrophysics Data System (ADS)

Kopp, Christophe; Volpert, Marion; Routin, Julien; Bernabé, Stéphane; Rossat, Cyrille; Tournaire, Myriam; Hamelin, Régis

2008-02-01

Optical links are well known to present significant advantages over electrical links for very high-speed data rate at 10Gpbs and above per channel. However, the transition towards optical interconnects solutions for short and very short reach applications requires the development of innovative packaging solutions that would deal with very high volume production capability and very low cost per unit. Moreover, the optoelectronic transceiver components must be able to move from the edge to anywhere on the printed circuit board, for instance close to integrated circuits with high speed IO. In this paper, we present an original packaging design to manufacture parallel optic transceivers that are surface mount devices. The package combines highly integrated Multi-Chip-Module on glass and usual IC ceramics packaging. The use of ceramic and the development of sealing technologies achieve hermetic requirements. Moreover, thanks to a chip scale package approach the final device exhibits a much minimized footprint. One of the main advantages of the package is its flexibility to be soldered or plugged anywhere on the printed circuit board as any other electronic device. As a demonstrator we present a 2 by 4 10Gbps transceiver operating at 850nm.

Selection of human consumables for future space missions

NASA Technical Reports Server (NTRS)

Bourland, C. T.; Smith, M. C.

1991-01-01

Consumables for human spaceflight include oxygen, water, food and food packaging, personal hygiene items, and clothing. This paper deals with the requirements for food and water, and their impact on waste product generation. Just as urbanization of society has been made possible by improved food processing and packaging, manned spaceflight has benefitted from this technology. The downside of this technology is increased food package waste product. Since consumables make up a major portion of the vehicle onboard stowage and generate most of the waste products, selection of consumables is a very critical process. Food and package waste comprise the majority of the trash generated on the current shuttle orbiter missions. Plans for future missions must include accurate assessment of the waste products to be generated, and the methods for processing and disposing of these wastes.

Design Approaches and Comparison of TAPS Packages for Engineering

ERIC Educational Resources Information Center

Sidhu, S. Manjit

2007-01-01

Purpose: The paper's purpose is to promote the use of modern technologies such as multimedia packages to engineering students. The aim is to help them to learning in their learning, visualization, problem solving and understanding engineering concepts such as in mechanics dynamics. Design/methodology/approach: TAPS packages are developed to help…

A TAPS Interactive Multimedia Package to Solve Engineering Dynamics Problem

ERIC Educational Resources Information Center

Sidhu, S. Manjit; Selvanathan, N.

2005-01-01

Purpose: To expose engineering students to using modern technologies, such as multimedia packages, to learn, visualize and solve engineering problems, such as in mechanics dynamics. Design/methodology/approach: A multimedia problem-solving prototype package is developed to help students solve an engineering problem in a step-by-step approach. A…

21 CFR 801.40 - Form of a unique device identifier.

Code of Federal Regulations, 2014 CFR

2014-04-01

...) Automatic identification and data capture (AIDC) technology. (b) The UDI must include a device identifier... evident upon visual examination of the label or device package, the label or device package must disclose... label and device packages is deemed to meet all requirements of subpart B of this part. The UPC will...

Packaging & Other Structures. Stuff That Works! A Technology Curriculum for the Elementary Grades.

ERIC Educational Resources Information Center

Benenson, Gary

This book explores all kinds of packaging materials including bags, boxes, etc. and how they are used to protect and display products. Contents are divided into six chapters: (1) "Appetizers" includes activities that can be done individually to become familiar with the topic of packaging and structures; (2) "Concepts" provides…

A Wireless, Passive Sensor for Quantifying Packaged Food Quality

PubMed Central

Tan, Ee Lim; Ng, Wen Ni; Shao, Ranyuan; Pereles, Brandon D.; Ong, Keat Ghee

2007-01-01

This paper describes the fabrication of a wireless, passive sensor based on an inductive-capacitive resonant circuit, and its application for in situ monitoring of the quality of dry, packaged food such as cereals, and fried and baked snacks. The sensor is made of a planar inductor and capacitor printed on a paper substrate. To monitor food quality, the sensor is embedded inside the food package by adhering it to the package's inner wall; its response is remotely detected through a coil connected to a sensor reader. As food quality degrades due to increasing humidity inside the package, the paper substrate absorbs water vapor, changing the capacitor's capacitance and the sensor's resonant frequency. Therefore, the taste quality of the packaged food can be indirectly determined by measuring the change in the sensor's resonant frequency. The novelty of this sensor technology is its wireless and passive nature, which allows in situ determination of food quality. In addition, the simple fabrication process and inexpensive sensor material ensure a low sensor cost, thus making this technology economically viable. PMID:28903195

Transformation of food packaging from passive to innovative via nanotechnology: concepts and critiques.

PubMed

Mlalila, Nichrous; Kadam, Dattatreya M; Swai, Hulda; Hilonga, Askwar

2016-09-01

In recent decades, there is a global advancement in manufacturing industry due to increased applications of nanotechnology. Food industry also has been tremendously changing from passive packaging to innovative packaging, to cope with global trends, technological advancements, and consumer preferences. Active research is taking place in food industry and other scientific fields to develop innovative packages including smart, intelligent and active food packaging for more effective and efficient packaging materials with balanced environmental issues. However, in food industry the features behind smart packaging are narrowly defined to be distinguished from intelligent packaging as in other scientific fields, where smart materials are under critical investigations. This review presents some scientific concepts and features pertaining innovative food packaging. The review opens new research window in innovative food packaging to cover the existing disparities for further precise research and development of food packaging industry.

A microelectronics approach for the ROSETTA surface science package

NASA Technical Reports Server (NTRS)

Sandau, Rainer (Editor); Alkalaj, Leon

1996-01-01

In relation to the Rosetta surface science package, the benefits of the application of advanced microelectronics packaging technologies and other output from the Mars environmental survey (MESUR) integrated microelectronics study are reported on. The surface science package will be designed to operate for tens of hours. Its limited mass and power consumption make necessary a highly integrated design with all the instruments and subunits operated from a centralized control and information management subsystem.

Control Technologies for Room Air-conditioner and Packaged Air-conditioner

NASA Astrophysics Data System (ADS)

Ito, Nobuhisa

Trends of control technologies about air-conditioning machineries, especially room or packaged air conditioners, are presented in this paper. Multiple air conditioning systems for office buildings are mainly described as one application of the refrigeration cycle control technologies including sensors for thermal comfort and heating/ cooling loads are also described as one of the system control technologies. Inverter systems and related technologies for driving variable speed compressors are described in both case of including induction motors and brushless DC motors. Technologies for more accurate control to meet various kind of regulations such as ozone layer destruction, energy saving and global warming, and for eliminating harmonic distortion of power source current, as a typical EMC problem, will be urgently desired.

Automated work packages architecture: An initial set of human factors and instrumentation and controls requirements

DOE Office of Scientific and Technical Information (OSTI.GOV)

Agarwal, Vivek; Oxstrand, Johanna H.; Le Blanc, Katya L.

The work management process in current fleets of national nuclear power plants is so highly dependent on large technical staffs and quality of work instruction, i.e., paper-based, that this puts nuclear energy at somewhat of a long-term economic disadvantage and increase the possibility of human errors. Technologies like mobile portable devices and computer-based procedures can play a key role in improving the plant work management process, thereby increasing productivity and decreasing cost. Automated work packages are a fundamentally an enabling technology for improving worker productivity and human performance in nuclear power plants work activities because virtually every plant work activitymore » is accomplished using some form of a work package. As part of this year’s research effort, automated work packages architecture is identified and an initial set of requirements identified, that are essential and necessary for implementation of automated work packages in nuclear power plants.« less

Comparison of Traditional and Innovative Techniques to Solve Technical Challenges

NASA Technical Reports Server (NTRS)

Perchonok, Michele

2011-01-01

This slide presentation reviews the use of traditional and innovative techniques to solve technical challenges in food storage technology. The planning for a mission to Mars is underway, and the food storage technology improvements requires that improvements be made. This new technology is required, because current food storage technology is inadequate,refrigerators or freezers are not available for food preservation, and that a shelf life of 5 years is expected. A 10 year effort to improve food packaging technology has not enhanced significantly food packaging capabilities. Two innovation techniques were attempted InnoCentive and Yet2.com and have provided good results, and are still under due diligence for solver verification.

Introduction to Human Services, Chapter III. Video Script Package, Text, and Audio Script Package.

ERIC Educational Resources Information Center

Miami-Dade Community Coll., FL.

Video, textual, and audio components of the third module of a multi-media, introductory course on Human Services are presented. The module packages, developed at Miami-Dade Community College, deal with technology, social change, and problem dependencies. A video cassette script is first provided that explores the "traditional,""inner," and "other…

An Integrated Software Package to Enable Predictive Simulation Capabilities

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chen, Yousu; Fitzhenry, Erin B.; Jin, Shuangshuang

The power grid is increasing in complexity due to the deployment of smart grid technologies. Such technologies vastly increase the size and complexity of power grid systems for simulation and modeling. This increasing complexity necessitates not only the use of high-performance-computing (HPC) techniques, but a smooth, well-integrated interplay between HPC applications. This paper presents a new integrated software package that integrates HPC applications and a web-based visualization tool based on a middleware framework. This framework can support the data communication between different applications. Case studies with a large power system demonstrate the predictive capability brought by the integrated software package,more » as well as the better situational awareness provided by the web-based visualization tool in a live mode. Test results validate the effectiveness and usability of the integrated software package.« less

Food system advances towards more nutritious and sustainable mantou production in China.

PubMed

Hu, Xinzhong; Sheng, Xialu; Liu, Liu; Ma, Zhen; Li, Xiaoping; Zhao, Wuqi

2015-01-01

Mantou, a traditional Chinese food, is widely consumed in the North China due to its nutritional value and good mouth-feel. However, its current family-style production is impeded due to short shelf-life caused by mold and starch retrogradation. The current packaging and storage methods are not efficient enough for mantou preservation. Recently, a novel, hot online package technology has attracted attention due to its high processing efficiency and low cost. Most importantly, by using this methodology, secondary contamination by microbes can be avoided and starch retrogradation can be markedly delayed, with mantou shelf-life under room temperature extended from a few to at least 90 days without any additives. In this review, the mechanisms of mantou quality deterioration are explained and the advantages of hot package technology addressed and compared with other packaging methods, such as frozen chain storage. In this way, not only wheat, but also other grains (including whole-grains) and ingredients may be mantou constituents, to enhance nutrition of traditional mantou. There is now a technological opportunity for mantou to become a more nutritious, sustainable and affordable foodstuff in local communities.

CSP Manufacturing Challenges and Assembly Reliability

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2000-01-01

Although the expression of CSP is widely used by industry from suppliers to users, its implied definition had evolved as the technology has matured. There are "expert definition"- package that is up to 1.5 time die- or "interim definition". CSPs are miniature new packages that industry is starting to implement and there are many unresolved technical issues associated with their implementation. For example, in early 1997, packages with 1 mm pitch and lower were the dominant CSPs, whereas in early 1998 packages with 0.8 mm and lower became the norm for CSPs. Other changes included the use of flip chip die rather than wire bond in CSP. Nonetheless the emerging CSPs are competing with bare die assemblies and are becoming the package of choice for size reduction applications. These packages provide the benefits of small size and performance of the bare die or flip chip, with the advantage of standard die packages. The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. This talk will cover specifically the experience of our consortium on technology implementation challenges, including design and build of both standard and microvia boards, assembly of two types of test vehicles, and the most current environmental thermal cycling test results.

Comparison of Traditional and Innovative Techniques to Solve Technical Challenges

NASA Technical Reports Server (NTRS)

Perchonok, Michele

2010-01-01

Although NASA has an adequate food system for current missions, research is required to accommodate new requirements for future NASA exploration missions. The Inadequate Food System risk reflects the need to develop requirements and technologies that will enable NASA to provide the crew with a safe, nutritious and acceptable food system while effectively balancing appropriate resources such as mass, volume, and crew time in exploratory missions. As we go deeper into space or spend more time on the International Space Station (ISS), there will be requirements for packaged food to be stored for 3 5 years. New food packaging technologies are needed that have adequate oxygen and water barrier properties to maintain the foods' quality over this extended shelf life. NASA has been unsuccessful in identify packaging materials that meet the necessary requirements when using several traditional routes including literature reviews, workshops, and internal shelf life studies on foods packaged in various packaging materials. Small Business Innovative Research grants were used for accelerating food packaging materials research with limited success. In order to accelerate the process, a theoretical challenge was submitted to InnoCentive resulting in a partial award. A similar food packaging challenge was submitted to Yet2.com and several potential commercial packaging material suppliers were identified that, at least partially, met the requirements. Comparisons and results of these challenges will be discussed.

Efficacy of Antimicrobial Agents for Food Contact Applications: Biological Activity, Incorporation into Packaging, and Assessment Methods: A Review.

PubMed

Mousavi Khaneghah, Amin; Hashemi, Seyed Mohammad Bagher; Eş, Ismail; Fracassetti, Daniela; Limbo, Sara

2018-07-01

Interest in the utilization of antimicrobial active packaging for food products has increased in recent years. Antimicrobial active packaging involves the incorporation of antimicrobial compounds into packaging materials, with the aim of maintaining or extending food quality and shelf life. Plant extracts, essential oils, organic acids, bacteriocins, inorganic substances, enzymes, and proteins are used as antimicrobial agents in active packaging. Evaluation of the antimicrobial activity of packaging materials using different methods has become a critical issue for both food safety and the commercial utilization of such packaging technology. This article reviews the different types of antimicrobial agents used for active food packaging materials, the main incorporation techniques, and the assessment methods used to examine the antimicrobial activity of packaging materials, taking into account their safety as food contact materials.

Chip-on-Board Technology 1996 Year-end Report (Design, Manufacturing, and Reliability Study)

NASA Technical Reports Server (NTRS)

Le, Binh Q.; Nhan, Elbert; Maurer, Richard H.; Lew, Ark L.; Lander, Juan R.

1996-01-01

The major impetus for flight qualifying Chip-On-Board (COB) packaging technology is the shift in emphasis for space missions to smaller, better, and cheaper spacecraft and satellites resulting from the NASA New Millenium initiative and similar requirements in DoD-sponsored programs. The most important benefit that can potentially be derived from miniaturizing spacecraft and satellites is the significant cost saving realizable if a smaller launch vehicle may be employed. Besides the program cost saving, there are several other advantages to building COB-based space hardware. First, once a well-controlled process is established, COB can be low cost compared to standard Multi-Chip Module (MCM) technology. This cost competitiveness is regarded as a result of the generally greater availability and lower cost of Known Good Die (KGD). Coupled with the elimination of the first level of packaging (chip package), compact, high-density circuit boards can be realized with Printed Wiring Boards (PWB) that can now be made with ever-decreasing feature size in line width and via hole. Since the COB packaging technique in this study is based mainly on populating bare dice on a suitable multi-layer laminate substrate which is not hermetically sealed, die coating for protection from the environment is required. In recent years, significant improvements have been made in die coating materials which further enhance the appeal of COB. Hysol epoxies, silicone, parylene and silicon nitride are desirable because of their compatible Thermal Coefficient of Expansion (TCE) and good moisture resistant capability. These die coating materials have all been used in the space and other industries with varying degrees of success. COB technology, specifically siliconnitride coated hardware, has been flown by Lockheed on the Polar satellite. In addition, DARPA has invested a substantial amount of resources on MCM and COB-related activities recently. With COB on the verge of becoming a dominant player in DoD programs, DARPA is increasing its support of the availability of KGDs which will help decrease their cost. Aside from the various major developments and trends in the space and defense industries that are favorable to the acceptance and widespread use of'COB packaging technology, implementing COB can be appealing in other aspects. Since the interconnection interface is usually the weak link in a system, the overall circuit or system reliability may actually be improved because of the elimination of a level of interconnect/packaging at the chip. With COB, mixing packaging technologies is possible. Because some devices are only available in commercial plastic packages, populating a multi-layer laminate substrate with both bare dice and plastic-package parts is inevitable. Another attractive feature of COB is that re-workability is possible if die coating is applied only on the die top. This method allows local replacement of individual dice that were found to be defective instead of replacing an entire board. In terms of thermal management, unpackaged devices offer a shorter thermal resistance path than their packaged counterparts thereby improving thermal sinking and heat removal from the parts.

Multispectral Linear Array detector technology

NASA Astrophysics Data System (ADS)

Tower, J. R.; McCarthy, B. M.; Pellon, L. E.; Strong, R. T.; Elabd, H.

1984-01-01

The Multispectral Linear Array (MLA) program sponsored by NASA has the aim to extend space-based remote sensor capabilities. The technology development effort involves the realization of very large, all-solid-state, pushbroom focal planes. The pushbroom, staring focal planes will contain thousands of detectors with the objective to provide two orders of magnitude improvement in detector dwell time compared to present Landsat mechanically scanned systems. Attenton is given to visible and near-infrared sensor development, the shortwave infrared sensor, aspects of filter technology development, the packaging concept, and questions of system performance. First-sample, four-band interference filters have been fabricated successfully, and a hybrid packaging technology is being developed.

Technical Support Document: 50% Energy Savings Design Technology Packages for Highway Lodging Buildings

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jiang, Wei; Gowri, Krishnan; Lane, Michael D.

2009-09-28

This Technical Support Document (TSD) describes the process, methodology and assumptions for development of the 50% Energy Savings Design Technology Packages for Highway Lodging Buildings, a design guidance document intended to provide recommendations for achieving 50% energy savings in highway lodging properties over the energy-efficiency levels contained in ANSI/ASHRAE/IESNA Standard 90.1-2004, Energy Standard for Buildings Except Low-Rise Residential Buildings.

Packaging of electro-microfluidic devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

2003-04-15

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Packaging of electro-microfluidic devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Watson, Robert D.

2002-01-01

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Industrial packaging and assembly infrastructure for MOEMS

NASA Astrophysics Data System (ADS)

van Heeren, Henne

2004-01-01

In a mature industry all elements of the supply chain are available and are more or less in balance. Mainstream technologies are defined and well supported by a chain of specialist companies. Those specialist companies, offering services ranging from consultancy to manufacturing subcontracting, are an essential element in the industrialization. There specialization and dedication to one or a few elements in the technology increases professionalism and efficiency. The MOEMS industry however, is still in its infancy. After the birth and growth of many companies aiming at development of products, the appearance of companies aiming at the production of components and systems, we see know the first companies concentrating on the delivering of services to this industry. We can divide them in the like : * Design and Engineering companies * Foundries * Assembly and Packaging providers * Design and simulation software providers For manufacturing suppliers and customers the lack of industry standards and mainstream technologies is a serious drawback. Insight in availability and trends in technology is important to make the right choices in the field of industrialization and production. This awareness was the reason to perform a detailed study to the companies supplying commercial services in this field. This article focuses on one important part of this study: packaging and assembly. This tends to remain a bottleneck at the end of the design cycle, often delaying and sometimes preventing industrialization and commercialization. For nearly all MEMS/MST products literally everything comes together in the packaging and assembly. This is the area of full integration: electrical, mechanical, optical fluidic, magnetic etc. functionalities come together. The problems associated with the concentration of functionalities forms a big headache for the designer. Conflicting demands, of which functionality versus economics is only one, and technical hurdles have to overcome. Besides that, packaging and assembly is from nature application specific and solutions found are not always transferable from one product to another. But designers can often benefit from experience from other and general available technologies. A number of companies offer packaging and assembly services for MEMS/MST and this report give typical examples of those commercial services. The companies range from small start-ups, offering very specialized services, to large semiconductor packaging companies, having production lines for microsystem based products. Selecting the proper packaging method may tip the scales towards a product success or towards a product failure, while it nearly always present s a substantial part of the cost of the product. This is therefore is not a marginal concern, but a crucial part of the product design. The presentation will also address mayor trends and technologies. Finally, the article provides sufficient levels of classification and categorisation for various aspects for the technologies, in specific, and the industry, in general, to provide particularly useful insights into the activities and the developments in this market. With over 50 companies studied and assessed, it provides an up to date account of the state of this business and its future potential.

Sterile Product Packaging and Delivery Systems.

PubMed

Akers, Michael J

2015-01-01

Both conventional and more advanced product container and delivery systems are the focus of this brief article. Six different product container systems will be discussed, plus advances in primary packaging for special delivery systems and needle technology.

IIP Update: A Packaged Coherent Doppler Wind Lidar Transceiver. Doppler Aerosol WiNd Lidar (DAWN)

NASA Technical Reports Server (NTRS)

Kavaya, Michael J.; Koch, Grady J.; Yu, Jirong; Trieu, Bo C.; Amzajerdian, Farzin; Singh, Upendra N.; Petros, Mulugeta

2006-01-01

The state-of-the-art 2-micron coherent Doppler wind lidar breadboard at NASA/LaRC will be engineered and compactly packaged consistent with future aircraft flights. The packaged transceiver will be integrated into a coherent Doppler wind lidar system test bed at LaRC. Atmospheric wind measurements will be made to validate the packaged technology. This will greatly advance the coherent part of the hybrid Doppler wind lidar solution to the need for global tropospheric wind measurements.

Delidding and resealing hybrid microelectronic packages

NASA Astrophysics Data System (ADS)

Luce, W. F.

1982-05-01

The objective of this single phase MM and T contract was to develop the manufacturing technology necessary for the precision removal (delidding) and replacement (resealing) of covers on hermetically sealed hybrid microelectronic packages. The equipment and processes developed provide a rework technique which does not degrade the reliability of the package of the enclosed circuitry. A qualification test was conducted on 88 functional hybrid packages, with excellent results. A petition will be filed, accompanied by this report, requesting Mil-M-38510 be amended to allow this rework method.

From Amorphous to Defined: Balancing the Risks of Spiral Development

DTIC Science & Technology

2007-04-30

630 675 720 765 810 855 900 Time (Week) Work started and active PhIt [Requirements,Iter1] : JavelinCalibration work packages1 1 1 Work started and...active PhIt [Technology,Iter1] : JavelinCalibration work packages2 2 2 Work started and active PhIt [Design,Iter1] : JavelinCalibration work packages3 3 3 3...Work started and active PhIt [Manufacturing,Iter1] : JavelinCalibration work packages4 4 Work started and active PhIt [Use,Iter1] : JavelinCalibration

Status and Trend of Automotive Power Packaging

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liang, Zhenxian

2012-01-01

Comprehensive requirements in aspects of cost, reliability, efficiency, form factor, weight, and volume for power electronics modules in modern electric drive vehicles have driven the development of automotive power packaging technology intensively. Innovation in materials, interconnections, and processing techniques is leading to enormous improvements in power modules. In this paper, the technical development of and trends in power module packaging are evaluated by examining technical details with examples of industrial products. The issues and development directions for future automotive power module packaging are also discussed.

Design requirements for SRB production control system. Volume 3: Package evaluation, modification and hardware

NASA Technical Reports Server (NTRS)

1981-01-01

The software package evaluation was designed to analyze commercially available, field-proven, production control or manufacturing resource planning management technology and software package. The analysis was conducted by comparing SRB production control software requirements and conceptual system design to software package capabilities. The methodology of evaluation and the findings at each stage of evaluation are described. Topics covered include: vendor listing; request for information (RFI) document; RFI response rate and quality; RFI evaluation process; and capabilities versus requirements.

Risk Management of Microelectronics: The NASA Electronic Parts and Packaging (NEPP) Program

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2005-01-01

This viewgraph information provides information on how the NASA Electronic Parts and Packaging (NEPP) Program evaluates the reliability of technologies for Electrical, Electronic, and Electromechanical (EEE) parts, and their suitability for spacecraft applications.

Water-soluble nanocrystalline cellulose films with highly transparent and oxygen barrier properties

NASA Astrophysics Data System (ADS)

Cheng, Shaoling; Zhang, Yapei; Cha, Ruitao; Yang, Jinliang; Jiang, Xingyu

2015-12-01

By mixing a guar gum (GG) solution with a nanocrystalline cellulose (NCC) dispersion using a novel circular casting technology, we manufactured biodegradable films as packaging materials with improved optical and mechanical properties. These films could act as barriers for oxygen and could completely dissolve in water within 5 h. We also compared the effect of nanocomposite films and commercial food packaging materials on the preservation of food.By mixing a guar gum (GG) solution with a nanocrystalline cellulose (NCC) dispersion using a novel circular casting technology, we manufactured biodegradable films as packaging materials with improved optical and mechanical properties. These films could act as barriers for oxygen and could completely dissolve in water within 5 h. We also compared the effect of nanocomposite films and commercial food packaging materials on the preservation of food. Electronic supplementary information (ESI) available. See DOI: 10.1039/c5nr07647a

Evaluation Framework and Analyses for Thermal Energy Storage Integrated with Packaged Air Conditioning

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kung, F.; Deru, M.; Bonnema, E.

2013-10-01

Few third-party guidance documents or tools are available for evaluating thermal energy storage (TES) integrated with packaged air conditioning (AC), as this type of TES is relatively new compared to TES integrated with chillers or hot water systems. To address this gap, researchers at the National Renewable Energy Laboratory conducted a project to improve the ability of potential technology adopters to evaluate TES technologies. Major project outcomes included: development of an evaluation framework to describe key metrics, methodologies, and issues to consider when assessing the performance of TES systems integrated with packaged AC; application of multiple concepts from the evaluationmore » framework to analyze performance data from four demonstration sites; and production of a new simulation capability that enables modeling of TES integrated with packaged AC in EnergyPlus. This report includes the evaluation framework and analysis results from the project.« less

Test program for transmitter experiment package and heat pipe system for the communications technology satellite

NASA Technical Reports Server (NTRS)

Depauw, J. F.; Reader, K. E.; Staskus, J. V.

1976-01-01

The test program is described for the 200 watt transmitter experiment package and the variable conductance heat pipe system which are components of the high-power transponder aboard the Communications Technology Satellite. The program includes qualification tests to demonstrate design adequacy, acceptance tests to expose latent defects in flight hardware, and development tests to integrate the components into the transponder system and to demonstrate compatibility.

Conceptual definition of a high voltage power supply test facility

NASA Technical Reports Server (NTRS)

Biess, John J.; Chu, Teh-Ming; Stevens, N. John

1989-01-01

NASA Lewis Research Center is presently developing a 60 GHz traveling wave tube for satellite cross-link communications. The operating voltage for this new tube is - 20 kV. There is concern about the high voltage insulation system and NASA is planning a space station high voltage experiment that will demonstrate both the 60 GHz communications and high voltage electronics technology. The experiment interfaces, requirements, conceptual design, technology issues and safety issues are determined. A block diagram of the high voltage power supply test facility was generated. It includes the high voltage power supply, the 60 GHz traveling wave tube, the communications package, the antenna package, a high voltage diagnostics package and a command and data processor system. The interfaces with the space station and the attached payload accommodations equipment were determined. A brief description of the different subsystems and a discussion of the technology development needs are presented.

Enabling More than Moore: Accelerated Reliability Testing and Risk Analysis for Advanced Electronics Packaging

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza; Evans, John W.

2014-01-01

For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products-Moore's Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or ak.a "More than Moore". This paper presents packaging technology trends and accelerated reliability testing methods currently being practiced. Then, it presents industry status on key advanced electronic packages, factors affecting accelerated solder joint reliability of area array packages, and IPC/JEDEC/Mil specifications for characterizations of assemblies under accelerated thermal and mechanical loading. Finally, it presents an examples demonstrating how Accelerated Testing and Analysis have been effectively employed in the development of complex spacecraft thereby reducing risk. Quantitative assessments necessarily involve the mathematics of probability and statistics. In addition, accelerated tests need to be designed which consider the desired risk posture and schedule for particular project. Such assessments relieve risks without imposing additional costs. and constraints that are not value added for a particular mission. Furthermore, in the course of development of complex systems, variances and defects will inevitably present themselves and require a decision concerning their disposition, necessitating quantitative assessments. In summary, this paper presents a comprehensive view point, from technology to systems, including the benefits and impact of accelerated testing in offsetting risk.

Method Of Packaging And Assembling Electro-Microfluidic Devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

2004-11-23

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

NDE Software Developed at NASA Glenn Research Center

NASA Technical Reports Server (NTRS)

Roth, Donald J.; Martin, Richard E.; Rauser, Richard W.; Nichols, Charles; Bonacuse, Peter J.

2014-01-01

NASA Glenn Research Center has developed several important Nondestructive Evaluation (NDE) related software packages for different projects in the last 10 years. Three of the software packages have been created with commercial-grade user interfaces and are available to United States entities for download on the NASA Technology Transfer and Partnership Office server (https://sr.grc.nasa.gov/). This article provides brief overviews of the software packages.

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2003-01-01

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

REBURNING APPLICATION TO FIRETUBE PACKAGE BOILERS

EPA Science Inventory

The report gives results of pilot-scale experimental research that examined the physical and chemical phenomena associated with the NOx control technology of reburning applied to gas- and liquid-fired firetube package boilers. Reburning (staged fuel combustion) diverts some of th...

78 FR 77656 - Aerosols and Similar Pressurized Containers-Meeting To Discuss the Method of Sale for Packages...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-12-24

..., Packaging and Labeling Regulation (UPLR) in NIST Handbook 130, ``Uniform Laws and Regulations in the Areas... permit price and quantity comparison is forbidden.'' Products using BOV technology versus traditional...

Transit safety retrofit package development : TRP concept of operations.

DOT National Transportation Integrated Search

2014-05-01

This document describes the Concept of Operations (ConOps) for the Transit Safety Retrofit Package (TRP). The ConOps describes the current state of operations with respect to the integration of Connected Vehicle technology in transit buses, establish...

Recent Developments in Film and Gas Research in Modified Atmosphere Packaging of Fresh Foods.

PubMed

Zhang, Min; Meng, Xiangyong; Bhandari, Bhesh; Fang, Zhongxiang

2016-10-02

Due to the rise of consumer's awareness of fresh foods to health, in the past few years, the consumption of fresh and fresh-cut produces has increased sturdily. Modified atmosphere packaging (MAP) possesses a potential to become one of the most appropriate technologies for packaging fresh and fresh-cut produces. The MAP has advantages of extending the shelf-life, preserving or stabilizing the desired properties of fresh produces, and convenience in handing and distribution. The success of MAP-fresh foods depends on many factors including types of fresh foods, storage temperature and humidity, gas composition, and the characteristics of package materials. This paper reviews the recent developments highlighting the most critical factors of film and gas on the quality of MAP fresh foods. Although the innovations and development of food packaging technology will continue to promote the development of novel MAP, concentrated research and endeavors from scientists and engineers are still important to the development of MAP that focuses on consumers' requirements, enhancing product quality, environmental friendly design, and cost-effective application.

Thin glass based packaging and photonic single-mode waveguide integration by ion-exchange technology on board and module level

NASA Astrophysics Data System (ADS)

Brusberg, Lars; Lang, Günter; Schröder, Henning

2011-01-01

The proposed novel packaging approach merges micro-system packaging and glass integrated optics. It provides 3D optical single-mode intra system links to bridge the gap between novel photonic integrated circuits and the glass fibers for inter system interconnects. We introduce our hybrid 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip links. Optical mirrors and lenses provide optical mode matching for photonic IC assemblies and optical fiber interconnects. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties as reviewed in the paper. That makes it perfect for micro-system packaging. The adopted planar waveguide process based on ion-exchange technology is capable for high-volume manufacturing. This ion-exchange process and the optical propagation are described in detail for thin glass substrates. An extensive characterization of all basic circuit elements like straight and curved waveguides, couplers and crosses proves the low attenuation of the optical circuit elements.

Single-mode glass waveguide technology for optical interchip communication on board level

NASA Astrophysics Data System (ADS)

Brusberg, Lars; Neitz, Marcel; Schröder, Henning

2012-01-01

The large bandwidth demand in long-distance telecom networks lead to single-mode fiber interconnects as result of low dispersion, low loss and dense wavelength multiplexing possibilities. In contrast, multi-mode interconnects are suitable for much shorter lengths up to 300 meters and are promising for optical links between racks and on board level. Active optical cables based on multi-mode fiber links are at the market and research in multi-mode waveguide integration on board level is still going on. Compared to multi-mode, a single-mode waveguide has much more integration potential because of core diameters of around 20% of a multi-mode waveguide by a much larger bandwidth. But light coupling in single-mode waveguides is much more challenging because of lower coupling tolerances. Together with the silicon photonics technology, a single-mode waveguide technology on board-level will be the straight forward development goal for chip-to-chip optical interconnects integration. Such a hybrid packaging platform providing 3D optical single-mode links bridges the gap between novel photonic integrated circuits and the glass fiber based long-distance telecom networks. Following we introduce our 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip interconnects. This novel packaging approach merges micro-system packaging and glass integrated optics. It consists of a thin glass substrate with planar integrated singlemode waveguide circuits, optical mirrors and lenses providing an integration platform for photonic IC assembly and optical fiber interconnect. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties. That makes it perfect for microsystem packaging. The paper presents recent results in single-mode waveguide technology on wafer level and waveguide characterization. Furthermore the integration in a hybrid packaging process and design issues are discussed.

Antimicrobial food packaging: potential and pitfalls

PubMed Central

Malhotra, Bhanu; Keshwani, Anu; Kharkwal, Harsha

2015-01-01

Nowadays food preservation, quality maintenance, and safety are major growing concerns of the food industry. It is evident that over time consumers’ demand for natural and safe food products with stringent regulations to prevent food-borne infectious diseases. Antimicrobial packaging which is thought to be a subset of active packaging and controlled release packaging is one such promising technology which effectively impregnates the antimicrobial into the food packaging film material and subsequently delivers it over the stipulated period of time to kill the pathogenic microorganisms affecting food products thereby increasing the shelf life to severe folds. This paper presents a picture of the recent research on antimicrobial agents that are aimed at enhancing and improving food quality and safety by reduction of pathogen growth and extension of shelf life, in a form of a comprehensive review. Examination of the available antimicrobial packaging technologies is also presented along with their significant impact on food safety. This article entails various antimicrobial agents for commercial applications, as well as the difference between the use of antimicrobials under laboratory scale and real time applications. Development of resistance amongst microorganisms is considered as a future implication of antimicrobials with an aim to come up with actual efficacies in extension of shelf life as well as reduction in bacterial growth through the upcoming and promising use of antimicrobials in food packaging for the forthcoming research down the line. PMID:26136740

An ultra-compact processor module based on the R3000

NASA Astrophysics Data System (ADS)

Mullenhoff, D. J.; Kaschmitter, J. L.; Lyke, J. C.; Forman, G. A.

1992-08-01

Viable high density packaging is of critical importance for future military systems, particularly space borne systems which require minimum weight and size and high mechanical integrity. A leading, emerging technology for high density packaging is multi-chip modules (MCM). During the 1980's, a number of different MCM technologies have emerged. In support of Strategic Defense Initiative Organization (SDIO) programs, Lawrence Livermore National Laboratory (LLNL) has developed, utilized, and evaluated several different MCM technologies. Prior LLNL efforts include modules developed in 1986, using hybrid wafer scale packaging, which are still operational in an Air Force satellite mission. More recent efforts have included very high density cache memory modules, developed using laser pantography. As part of the demonstration effort, LLNL and Phillips Laboratory began collaborating in 1990 in the Phase 3 Multi-Chip Module (MCM) technology demonstration project. The goal of this program was to demonstrate the feasibility of General Electric's (GE) High Density Interconnect (HDI) MCM technology. The design chosen for this demonstration was the processor core for a MIPS R3000 based reduced instruction set computer (RISC), which has been described previously. It consists of the R3000 microprocessor, R3010 floating point coprocessor and 128 Kbytes of cache memory.

320 x 240 uncooled IRFPA with pixel wise thin film vacuum packaging

NASA Astrophysics Data System (ADS)

Yon, J.-J.; Dumont, G.; Rabaud, W.; Becker, S.; Carle, L.; Goudon, V.; Vialle, C.; Hamelin, A.; Arnaud, A.

2012-10-01

Silicon based vacuum packaging is a key enabling technology for achieving affordable uncooled Infrared Focal Plane Arrays (IRFPA) as required by the promising mass market for very low cost IR applications, such as automotive driving assistance, energy loss monitoring in buildings, motion sensors… Among the various approaches studied worldwide, the CEA, LETI is developing a unique technology where each bolometer pixel is sealed under vacuum at the wafer level, using an IR transparent thin film deposition. This technology referred to as PLP (Pixel Level Packaging), leads to an array of hermetic micro-caps each containing a single microbolometer. Since the successful demonstration that the PLP technology, when applied on a single microbolometer pixel, can provide the required vacuum < 10-3 mbar, the authors have pushed forward the development of the technology on fully operational QVGA readout circuits CMOS base wafers (320 x 240 pixels). In this outlook, the article reports on the electro optical performance obtained from this preliminary PLP based QVGA demonstrator. Apart from the response, noise and NETD distributions, the paper also puts emphasis on additional key features such as thermal time constant, image quality, and ageing properties.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kreutzer, Cory J.; Rugh, John; Tomerlin, Jeff

Increased market penetration of electric drive vehicles (EDVs) requires overcoming a number of hurdles, including limited vehicle range and the elevated cost in comparison to conventional vehicles. Climate control loads have a significant impact on range, cutting it by over 50% in both cooling and heating conditions. To minimize the impact of climate control on EDV range, the National Renewable Energy Laboratory has partnered with Hyundai America and key industry partners to quantify the performance of thermal load reduction technologies on a Hyundai Sonata plug-in hybrid electric vehicle. Technologies that impact vehicle cabin heating in cold weather conditions and cabinmore » cooling in warm weather conditions were evaluated. Tests included thermal transient and steady-state periods for all technologies, including the development of a new test methodology to evaluate the performance of occupant thermal conditioning. Heated surfaces demonstrated significant reductions in energy use from steady-state heating, including a 29%-59% reduction from heated surfaces. Solar control glass packages demonstrated significant reductions in energy use for both transient and steady-state cooling, with up to a 42% reduction in transient and 12.8% reduction in steady-state energy use for the packages evaluated. Technologies that demonstrated significant climate control load reduction were selected for incorporation into a complete thermal load reduction package. The complete package is set to be evaluated in the second phase of the ongoing project.« less

Molding compound trends in a denser packaging world: Qualification tests and reliability concerns

NASA Astrophysics Data System (ADS)

Nguyen, L. T.; Lo, R. H. Y.; Chen, A. S.; Belani, J. G.

1993-12-01

Molding compound development has traditionally been driven by the memory market, then subsequent applications filter down to other IC technologies such as logic, analog, and ASIC. However, this strategy has changed lately with the introduction of thin packages such as PQFP & TSOP. Rather than targeting a compound for a family of IC such as DRAM or SRAM, compound development efforts are now focused at specific classes of packages. The configurations of these thin packages impose new functional requirements that need to be revisited to provide the optimized combination of properties. The evolution of qualification tests mirrors the advances in epoxy and compounding technologies. From the first standard novolac-based epoxies of the 1970s to the latest 3(sup rd)-generation ultra-low stress materials, longer test times at increasingly harsher environments were achieved. This paper benchmarks the current reliability tests used by the electronic industry, examines those tests that affect and are affected by the molding compounds, discusses the relevance of accelerated testing, and addresses the major reliability issues facing current molding compound development efforts. Six compound-related reliability concerns were selected: moldability, package stresses, package cracking, halogen-induced intermetallic growth at bond pads, moisture-induced corrosion, and interfacial delamination. Causes of each failure type are surveyed and remedies are recommended. Accelerated tests are designed to apply to a limited quantity of devices, bias, or environmental conditions larger than usual ratings, to intensify failure mechanisms that would occur under normal operating conditions. The observed behavior is then extrapolated from the lot to the entire population. Emphasis is on compressing the time necessary to obtain reliability data. This approach has two main drawbacks. With increasingly complex devices, even accelerated tests are expensive. And with new technologies, it becomes difficult to ascertain that the applied stress 1) induces the failure phenomenon linked with usual field conditions, and 2) does not create any new ones. Technology evolution and reliability testing are interdependent. Devices get larger with increasingly smaller features and more complex geometries. Molding compounds have evolved considerably over the past decade to provide ultra-low stress levels and moldability for thin packages.

Radiation treatment for sterilization of packaging materials

NASA Astrophysics Data System (ADS)

Haji-Saeid, Mohammad; Sampa, Maria Helena O.; Chmielewski, Andrzej G.

2007-08-01

Treatment with gamma and electron radiation is becoming a common process for the sterilization of packages, mostly made of natural or synthetic plastics, used in the aseptic processing of foods and pharmaceuticals. The effect of irradiation on these materials is crucial for packaging engineering to understand the effects of these new treatments. Packaging material may be irradiated either prior to or after filling. The irradiation prior to filling is usually chosen for dairy products, processed food, beverages, pharmaceutical, and medical device industries in the United States, Europe, and Canada. Radiation effects on packaging material properties still need further investigation. This paper summarizes the work done by different groups and discusses recent developments in regulations and testing procedures in the field of packaging technology.

Packaging and transportation of radioactive materials

DOE Office of Scientific and Technical Information (OSTI.GOV)

None

1978-01-01

The presentations made at the Symposium on Packaging and Transportation of Radioactive Materials are included. The purpose of the meeting was for the interchange of information on the technology and politics of radioactive material transportation. Separate abstracts were prepared for individual items. (DC)

40 CFR 157.21 - Definitions.

Code of Federal Regulations, 2010 CFR

2010-07-01

... the technology exists to produce the child-resistant packaging for a particular pesticide. Unit... REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.21 Definitions. Terms used in this subpart shall have the following meanings: Appropriate, when used with respect to child-resistant...

40 CFR 157.21 - Definitions.

Code of Federal Regulations, 2014 CFR

2014-07-01

... the technology exists to produce the child-resistant packaging for a particular pesticide. Unit... REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.21 Definitions. Terms used in this subpart shall have the following meanings: Appropriate, when used with respect to child-resistant...

40 CFR 157.21 - Definitions.

Code of Federal Regulations, 2011 CFR

2011-07-01

... the technology exists to produce the child-resistant packaging for a particular pesticide. Unit... REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.21 Definitions. Terms used in this subpart shall have the following meanings: Appropriate, when used with respect to child-resistant...

40 CFR 157.21 - Definitions.

Code of Federal Regulations, 2013 CFR

2013-07-01

... the technology exists to produce the child-resistant packaging for a particular pesticide. Unit... REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.21 Definitions. Terms used in this subpart shall have the following meanings: Appropriate, when used with respect to child-resistant...

40 CFR 157.21 - Definitions.

Code of Federal Regulations, 2012 CFR

2012-07-01

... the technology exists to produce the child-resistant packaging for a particular pesticide. Unit... REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.21 Definitions. Terms used in this subpart shall have the following meanings: Appropriate, when used with respect to child-resistant...

49 CFR 1104.3 - Copies.

Code of Federal Regulations, 2013 CFR

2013-10-01

... fully evaluate evidence, all spreadsheets must be fully accessible and manipulable. Electronic databases... Microsoft Open Database Connectivity (ODBC) standard. ODBC is a Windows technology that allows a database software package to import data from a database created using a different software package. We currently...

49 CFR 1104.3 - Copies.

Code of Federal Regulations, 2014 CFR

2014-10-01

... fully evaluate evidence, all spreadsheets must be fully accessible and manipulable. Electronic databases... Microsoft Open Database Connectivity (ODBC) standard. ODBC is a Windows technology that allows a database software package to import data from a database created using a different software package. We currently...

49 CFR 1104.3 - Copies.

Code of Federal Regulations, 2012 CFR

2012-10-01

... fully evaluate evidence, all spreadsheets must be fully accessible and manipulable. Electronic databases... Microsoft Open Database Connectivity (ODBC) standard. ODBC is a Windows technology that allows a database software package to import data from a database created using a different software package. We currently...

49 CFR 1104.3 - Copies.

Code of Federal Regulations, 2010 CFR

2010-10-01

... fully evaluate evidence, all spreadsheets must be fully accessible and manipulable. Electronic databases... Microsoft Open Database Connectivity (ODBC) standard. ODBC is a Windows technology that allows a database software package to import data from a database created using a different software package. We currently...

DEMONSTRATION OF PACKAGING MATERIALS ALTERNATIVES TO EXPANDED POLYSTYRENE

EPA Science Inventory

This report represents the second demonstration of cleaner technologies to support the goals of the 33/50 Program under the EPA Cooperative Agreement No. CR-821848. The report presents assessment results of alternative packaging materials which could potentially replace expanded...

Too Little Too Soon? Modeling the Risks of Spiral Development

DTIC Science & Technology

2007-04-30

270 315 360 405 450 495 540 585 630 675 720 765 810 855 900 Time (Week) Work started and active PhIt [Requirements,Iter1] : JavelinCalibration work...packages1 1 1 Work started and active PhIt [Technology,Iter1] : JavelinCalibration work packages2 2 2 Work started and active PhIt [Design,Iter1...JavelinCalibration work packages3 3 3 3 Work started and active PhIt [Manufacturing,Iter1] : JavelinCalibration work packages4 4 Work started and active PhIt

Recent innovations in the area of edible films and coatings.

PubMed

Maftoonazad, Neda; Badii, Fojan; Shahamirian, Maryam

2013-12-01

Edible films/coatings have been considered as one of the potential technologies that can be used to increase the storability of foods and to improve the existent packaging technology, helping to ensure the microbial safety and the preservation of food from the influence of external factors. Innovations constantly appear in food packaging, always aiming at creating a more efficient quality preservation system while improving foods' attractiveness and marketability. The utilization of renewable sources for packaging materials, such as hydrocolloids and lipids from biological origin, is one the main trends of the industry. These films should have acceptable sensory characteristics, appropriate barrier properties (CO2, O2, water, oil), microbial, biochemical and physicochemical stability, they should be safe, and produced by simple technology in low cost. Also they can act as effective carrier for antioxidant, flavor, color and nutritional or anti-microbial additives. Nowadays, a great discussion exists about the potential applications of edible films/coatings on food products. The general trend is to find the correct combination between the food product and the edible film/coating, which will ensure the success of the technology.

Conformal piezoelectric energy harvesting and storage from motions of the heart, lung, and diaphragm

PubMed Central

Dagdeviren, Canan; Yang, Byung Duk; Su, Yewang; Tran, Phat L.; Joe, Pauline; Anderson, Eric; Xia, Jing; Doraiswamy, Vijay; Dehdashti, Behrooz; Feng, Xue; Lu, Bingwei; Poston, Robert; Khalpey, Zain; Ghaffari, Roozbeh; Huang, Yonggang; Slepian, Marvin J.; Rogers, John A.

2014-01-01

Here, we report advanced materials and devices that enable high-efficiency mechanical-to-electrical energy conversion from the natural contractile and relaxation motions of the heart, lung, and diaphragm, demonstrated in several different animal models, each of which has organs with sizes that approach human scales. A cointegrated collection of such energy-harvesting elements with rectifiers and microbatteries provides an entire flexible system, capable of viable integration with the beating heart via medical sutures and operation with efficiencies of ∼2%. Additional experiments, computational models, and results in multilayer configurations capture the key behaviors, illuminate essential design aspects, and offer sufficient power outputs for operation of pacemakers, with or without battery assist. PMID:24449853

Spacecraft System Integration and Test: SSTI Lewis critical design audit

NASA Technical Reports Server (NTRS)

Brooks, R. P.; Cha, K. K.

1995-01-01

The Critical Design Audit package is the final detailed design package which provides a comprehensive description of the SSTI mission. This package includes the program overview, the system requirements, the science and applications activities, the ground segment development, the assembly, integration and test description, the payload and technology demonstrations, and the spacecraft bus subsystems. Publication and presentation of this document marks the final requirements and design freeze for SSTI.

Development of high impedance measurement system for water leakage detection in implantable neuroprosthetic devices.

PubMed

Yousif, Aziz; Kelly, Shawn K

2016-08-01

There has been a push for a greater number of channels in implantable neuroprosthetic devices; but, that number has largely been limited by current hermetic packaging technology. Microfabricated packaging is becoming reality, but a standard testing system is needed to prepare these devices for clinical trials. Impedance measurements of electrodes built into the packaging layers may give an early warning of device failure and predict device lifetime. Because the impedance magnitudes of such devices can be on the order of gigaohms, a versatile system was designed to accommodate ultra-high impedances and allow future integrated circuit implementation in current neural prosthetic technologies. Here we present the circuitry, control software, and preliminary testing results of our designed system.

Compact fiber optic gyroscopes for platform stabilization

NASA Astrophysics Data System (ADS)

Dickson, William C.; Yee, Ting K.; Coward, James F.; McClaren, Andrew; Pechner, David A.

2013-09-01

SA Photonics has developed a family of compact Fiber Optic Gyroscopes (FOGs) for platform stabilization applications. The use of short fiber coils enables the high update rates required for stabilization applications but presents challenges to maintain high performance. We are able to match the performance of much larger FOGs by utilizing several innovative technologies. These technologies include source noise reduction to minimize Angular Random Walk (ARW), advanced digital signal processing that minimizes bias drift at high update rates, and advanced passive thermal packaging that minimizes temperature induced bias drift while not significantly affecting size, weight, or power. In addition, SA Photonics has developed unique distributed FOG packaging technologies allowing the FOG electronics and photonics to be packaged remotely from the sensor head or independent axis heads to minimize size, weight, and power at the sensing location(s). The use of these technologies has resulted in high performance, including ARW less than 0.001 deg/rt-hr and bias drift less than 0.004 deg/hr at an update rate of 10 kHz, and total packaged volume less than 30 cu. in. for a 6 degree of freedom FOG-based IMU. Specific applications include optical beam stabilization for LIDAR and LADAR, beam stabilization for long-range free-space optical communication, Optical Inertial Reference Units for HEL stabilization, and Ka band antenna pedestal pointing and stabilization. The high performance of our FOGs also enables their use in traditional navigation and positioning applications. This paper will review the technologies enabling our high-performance compact FOGs, and will provide performance test results.

49 CFR 1104.3 - Copies.

Code of Federal Regulations, 2011 CFR

2011-10-01

... Microsoft Open Database Connectivity (ODBC) standard. ODBC is a Windows technology that allows a database software package to import data from a database created using a different software package. We currently...-compatible format. All databases must be supported with adequate documentation on data attributes, SQL...

Natural biopolymer-based nanocomposite films for packaging applications.

PubMed

Rhim, Jong-Whan; Ng, Perry K W

2007-01-01

Concerns on environmental waste problems caused by non-biodegradable petrochemical-based plastic packaging materials as well as the consumer's demand for high quality food products has caused an increasing interest in developing biodegradable packaging materials using annually renewable natural biopolymers such as polysaccharides and proteins. Inherent shortcomings of natural polymer-based packaging materials such as low mechanical properties and low water resistance can be recovered by applying a nanocomposite technology. Polymer nanocomposites, especially natural biopolymer-layered silicate nanocomposites, exhibit markedly improved packaging properties due to their nanometer size dispersion. These improvements include increased modulus and strength, decreased gas permeability, and increased water resistance. Additionally, biologically active ingredients can be added to impart the desired functional properties to the resulting packaging materials. Consequently, natural biopolymer-based nanocomposite packaging materials with bio-functional properties have a huge potential for application in the active food packaging industry. In this review, recent advances in the preparation of natural biopolymer-based films and their nanocomposites, and their potential use in packaging applications are addressed.

Industrial Technology Modernization Program. Phase 3 Proposal, Category 1 Project Countermeasures Assembly Improvements

DTIC Science & Technology

1985-05-24

Tracor INDUSTRIAL TECHNOLOGY MODERNIZATION PROGRAM DTICRt .1ECTE CDJUN07 1989 00 PHASE 3 PROPOSAL CATEGORY 1 PROJECT COUNTERMEASURES ASSEMBLY...package in bin C V_ Put-package back in bin C Put part in plastic bag 0CDV _7 _ ] Seal plastic bag with stapler CDDV _ _- 1 Mark paperwork CDV __ I Peel...part in plastic bag CDV7 Seal plastic bag with stapler C>CDV _ Mark paperwork ~CV_ _ Peel preprinted tag from sheet ~ D Put preprinted tag on plastic

Satellite Power Systems (SPS) concept definition study (Exhibit D). Volume 5: Systems engineering/integration research and technology

NASA Technical Reports Server (NTRS)

Hanley, G. M.

1981-01-01

Guidelines and ground rules followed in the development of requirements for the SPS are presented. Development planning objectives are specified in each of these areas, and evolutionary SPS program scenarios are described for the various concepts studied during the past one year contract. Program descriptions are presented as planning packages of technical tasks, and schedule phasing. Each package identifies the ground based technology effort that will facilitate SPS definitions, designs, development, and operations.

Establishing a store baseline during interim storage of waste packages and a review of potential technologies for base-lining

DOE Office of Scientific and Technical Information (OSTI.GOV)

McTeer, Jennifer; Morris, Jenny; Wickham, Stephen

Interim storage is an essential component of the waste management lifecycle, providing a safe, secure environment for waste packages awaiting final disposal. In order to be able to monitor and detect change or degradation of the waste packages, storage building or equipment, it is necessary to know the original condition of these components (the 'waste storage system'). This paper presents an approach to establishing the baseline for a waste-storage system, and provides guidance on the selection and implementation of potential base-lining technologies. The approach is made up of two sections; assessment of base-lining needs and definition of base-lining approach. Duringmore » the assessment of base-lining needs a review of available monitoring data and store/package records should be undertaken (if the store is operational). Evolutionary processes (affecting safety functions), and their corresponding indicators, that can be measured to provide a baseline for the waste-storage system should then be identified in order for the most suitable indicators to be selected for base-lining. In defining the approach, identification of opportunities to collect data and constraints is undertaken before selecting the techniques for base-lining and developing a base-lining plan. Base-lining data may be used to establish that the state of the packages is consistent with the waste acceptance criteria for the storage facility and to support the interpretation of monitoring and inspection data collected during store operations. Opportunities and constraints are identified for different store and package types. Technologies that could potentially be used to measure baseline indicators are also reviewed. (authors)« less

Vault Nanoparticles Packaged with Enzymes as an Efficient Pollutant Biodegradation Technology.

PubMed

Wang, Meng; Abad, Danny; Kickhoefer, Valerie A; Rome, Leonard H; Mahendra, Shaily

2015-11-24

Vault nanoparticles packaged with enzymes were synthesized as agents for efficiently degrading environmental contaminants. Enzymatic biodegradation is an attractive technology for in situ cleanup of contaminated environments because enzyme-catalyzed reactions are not constrained by nutrient requirements for microbial growth and often have higher biodegradation rates. However, the limited stability of extracellular enzymes remains a major challenge for practical applications. Encapsulation is a recognized method to enhance enzymatic stability, but it can increase substrate diffusion resistance, lower catalytic rates, and increase the apparent half-saturation constants. Here, we report an effective approach for boosting enzymatic stability by single-step packaging into vault nanoparticles. With hollow core structures, assembled vault nanoparticles can simultaneously contain multiple enzymes. Manganese peroxidase (MnP), which is widely used in biodegradation of organic contaminants, was chosen as a model enzyme in the present study. MnP was incorporated into vaults via fusion to a packaging domain called INT, which strongly interacts with vaults' interior surface. MnP fused to INT and vaults packaged with the MnP-INT fusion protein maintained peroxidase activity. Furthermore, MnP-INT packaged in vaults displayed stability significantly higher than that of free MnP-INT, with slightly increased Km value. Additionally, vault-packaged MnP-INT exhibited 3 times higher phenol biodegradation in 24 h than did unpackaged MnP-INT. These results indicate that the packaging of MnP enzymes in vault nanoparticles extends their stability without compromising catalytic activity. This research will serve as the foundation for the development of efficient and sustainable vault-based bioremediation approaches for removing multiple contaminants from drinking water and groundwater.

Fiber optic interconnect and optoelectronic packaging challenges for future generation avionics

NASA Astrophysics Data System (ADS)

Beranek, Mark W.

2007-02-01

Forecasting avionics industry fiber optic interconnect and optoelectronic packaging challenges that lie ahead first requires an assumption that military avionics architectures will evolve from today's centralized/unified concept based on gigabit laser, optical-to-electrical-to-optical switching and optical backplane technology, to a future federated/distributed or centralized/unified concept based on gigabit tunable laser, electro-optical switch and add-drop wavelength division multiplexing (WDM) technology. The requirement to incorporate avionics optical built-in test (BIT) in military avionics fiber optic systems is also assumed to be correct. Taking these assumptions further indicates that future avionics systems engineering will use WDM technology combined with photonic circuit integration and advanced packaging to form the technical basis of the next generation military avionics onboard local area network (LAN). Following this theme, fiber optic cable plants will evolve from today's multimode interconnect solution to a single mode interconnect solution that is highly installable, maintainable, reliable and supportable. Ultimately optical BIT for fiber optic fault detection and isolation will be incorporated as an integral part of a total WDM-based avionics LAN solution. Cost-efficient single mode active and passive photonic component integration and packaging integration is needed to enable reliable operation in the harsh military avionics application environment. Rugged multimode fiber-based transmitters and receivers (transceivers) with in-package optical BIT capability are also needed to enable fully BIT capable single-wavelength fiber optic links on both legacy and future aerospace platforms.

IEEE WMED 2016 Homepage

Science.gov Websites

characterization, design, and new device technologies. This workshop will consist of invited talks, contributed and Reliability Semiconductor package reliability, Design for Manufacturability, Stacked die packaging and Novel assembly processes Microelectronic Circuit Design New product design, high-speed and/or low

1st NASA Electronic Parts Packaging (NEPP) Program Electronic Technology Workshop (ETW)

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2010-01-01

NEPP supports all of NASA for >20 years - 7 NASA Centers and JPL actively participate The NEPP Program focuses on the reliability aspects of electronic devices - Three prime technical areas: Parts (die), Packaging, and Radiation Alternately, reliability may be viewed as: -

The demise of plastic encapsulated microcircuit myths

NASA Astrophysics Data System (ADS)

Hakim, E. B.; Agarwal, R. K.; Pecht, M.

1994-10-01

Production of microelectronic devices encapsulated in solid, molded plastic packages has rapidly increased since the early 1980's. Today, millions of plastic-encapsulated devices are produced daily. On the other hand, only a few million hermetic (cavity) packages are produced per year. Reasons for the increased use of plastic-encapsulated packages include cost, availability, size, weight, quality, and reliability. Markets taking advantage of this technology range from computers and telecommunications to automotive uses. Yet, several industries, the military in particular, will not accept such devices. One reason for this reluctance to use the best available commercial parts is a perceived risk of poor reliability, derived from antiquated military specifications, standards, and handbooks; other common justifications cite differing environments; inadequate screens; inadequate test data, and required government audits of suppliers' processes. This paper describes failure mechanisms associated with plastic encapsulation and their elimination. It provides data indicating the relative reliability of cavity and solid-encapsulated packaging, and presents possible approaches to assuring quality and reliability in the procuring and applying this successful commercial technology.

Flexible packaging of solid-state integrated circuit chips with elastomeric microfluidics

PubMed Central

Zhang, Bowei; Dong, Quan; Korman, Can E.; Li, Zhenyu; Zaghloul, Mona E.

2013-01-01

A flexible technology is proposed to integrate smart electronics and microfluidics all embedded in an elastomer package. The microfluidic channels are used to deliver both liquid samples and liquid metals to the integrated circuits (ICs). The liquid metals are used to realize electrical interconnects to the IC chip. This avoids the traditional IC packaging challenges, such as wire-bonding and flip-chip bonding, which are not compatible with current microfluidic technologies. As a demonstration we integrated a CMOS magnetic sensor chip and associate microfluidic channels on a polydimethylsiloxane (PDMS) substrate that allows precise delivery of small liquid samples to the sensor. Furthermore, the packaged system is fully functional under bending curvature radius of one centimetre and uniaxial strain of 15%. The flexible integration of solid-state ICs with microfluidics enables compact flexible electronic and lab-on-a-chip systems, which hold great potential for wearable health monitoring, point-of-care diagnostics and environmental sensing among many other applications.

Nanotechnology for the Solid Waste Reduction of Military Food Packaging

DTIC Science & Technology

2016-06-01

WP-200816) Nanotechnology for the Solid Waste Reduction of Military Food Packaging June 2016 This document has been cleared for public release...NAME OF RESPONSIBLE PERSON 19b. TELEPHONE NUMBER (Include area code) 01/06/2016 Cost and Performance Report 04/01/2008 - 01/01/2015 Nanotechnology for... nanotechnology packaging. The PIs have been dedicated to these efforts, and it is anticipated that this technology will be used someday by the Warfighter

Battery packaging - Technology review

DOE Office of Scientific and Technical Information (OSTI.GOV)

Maiser, Eric

2014-06-16

This paper gives a brief overview of battery packaging concepts, their specific advantages and drawbacks, as well as the importance of packaging for performance and cost. Production processes, scaling and automation are discussed in detail to reveal opportunities for cost reduction. Module standardization as an additional path to drive down cost is introduced. A comparison to electronics and photovoltaics production shows 'lessons learned' in those related industries and how they can accelerate learning curves in battery production.

500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

NASA Technical Reports Server (NTRS)

Chen, Liang-yu; Neudeck, Philip G.; Spry, David J.; Beheim, Glenn M.; Hunter, Gary W.

2016-01-01

High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

Photonics and nanophotonics and information and communication technologies in modern food packaging.

PubMed

Sarapulova, Olha; Sherstiuk, Valentyn; Shvalagin, Vitaliy; Kukhta, Aleksander

2015-01-01

The analysis of the problem of conjunction of information and communication technologies (ICT) with packaging industry and food production was made. The perspective of combining the latest advances of nanotechnology, including nanophotonics, and ICT for creating modern smart packaging was shown. There were investigated luminescent films with zinc oxide nanoparticles, which change luminescence intensity as nano-ZnO interacts with decay compounds of food products, for active and intelligent packaging. High luminescent transparent films were obtained from colloidal suspension of ZnO and polyvinylpyrrolidone (PVP). The influence of molecular mass, concentration of nano-ZnO, and film thickness on luminescent properties of films was studied in order to optimize the content of the compositions. The possibility of covering the obtained films with polyvinyl alcohol was considered for eliminating water soluble properties of PVP. The luminescent properties of films with different covers were studied. The insoluble in water composition based on ZnO stabilized with colloidal silicon dioxide and PVP in polymethylmethacrylate was developed, and the luminescent properties of films were investigated. The compositions are non-toxic, safe, and suitable for applying to the inner surface of active and intelligent packaging by printing techniques, such as screen printing, flexography, inkjet, and pad printing.

Photonics and Nanophotonics and Information and Communication Technologies in Modern Food Packaging

NASA Astrophysics Data System (ADS)

Sarapulova, Olha; Sherstiuk, Valentyn; Shvalagin, Vitaliy; Kukhta, Aleksander

2015-05-01

The analysis of the problem of conjunction of information and communication technologies (ICT) with packaging industry and food production was made. The perspective of combining the latest advances of nanotechnology, including nanophotonics, and ICT for creating modern smart packaging was shown. There were investigated luminescent films with zinc oxide nanoparticles, which change luminescence intensity as nano-ZnO interacts with decay compounds of food products, for active and intelligent packaging. High luminescent transparent films were obtained from colloidal suspension of ZnO and polyvinylpyrrolidone (PVP). The influence of molecular mass, concentration of nano-ZnO, and film thickness on luminescent properties of films was studied in order to optimize the content of the compositions. The possibility of covering the obtained films with polyvinyl alcohol was considered for eliminating water soluble properties of PVP. The luminescent properties of films with different covers were studied. The insoluble in water composition based on ZnO stabilized with colloidal silicon dioxide and PVP in polymethylmethacrylate was developed, and the luminescent properties of films were investigated. The compositions are non-toxic, safe, and suitable for applying to the inner surface of active and intelligent packaging by printing techniques, such as screen printing, flexography, inkjet, and pad printing.

Packaging Technology for SiC High Temperature Electronics

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Neudeck, Philip G.; Spry, David J.; Meredith, Roger D.; Nakley, Leah M.; Beheim, Glenn M.; Hunter, Gary W.

2017-01-01

High-temperature environment operable sensors and electronics are required for long-term exploration of Venus and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500 C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors in relevant environments. This talk will discuss a ceramic packaging system developed for high temperature electronics, and related testing results of SiC integrated circuits at 500 C facilitated by this high temperature packaging system, including the most recent progress.

FRAMES and Other IEM Technologies

EPA Science Inventory

A presentation package is developed that describes the FRAMES software technology system. The philosophy of FRAMES is discussed; its components and editors are reviewed; its relationship to integrated environmental modeling technologies; such as D4EM and SuperMUSE, are described;...

Design and Implementation of a Thermal Load Reduction System in a Hyundai PHEV

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kreutzer, Cory J; Rugh, John P

Increased market penetration of electric drive vehicles (EDVs) requires overcoming a number of hurdles including limited vehicle range and the elevated cost of EDVs as compared to conventional vehicles. Climate control loads have a significant impact on range, cutting it by over 50% in both cooling and heating conditions. In order to minimize the impact of climate control on EDV range, the National Renewable Energy Laboratory has partnered with Hyundai America and key industry partners to quantify the performance of thermal load reduction technologies on a Hyundai Sonata PHEV. Technologies that impact vehicle cabin heating in cold weather conditions andmore » cabin cooling in warm weather conditions were evaluated. Tests included thermal transient and steady-state periods for all technologies, including the development of a new test methodology to evaluate the performance of occupant thermal conditioning. Heated surfaces and increased insulation demonstrated significant reductions in energy use from steady-state heating, including a 29% - 59% reduction from heated surfaces. Solar control glass packages demonstrated significant reductions in energy use for both transient and steady-state cooling, with up to a 42% reduction in transient and 12.8% reduction in steady-state energy use for the packages evaluated. Technologies that demonstrated significant climate control load reduction were selected for incorporation into a complete thermal load reduction package. The complete package is set to be evaluated in the second phase of the ongoing project.« less

RD2-MolPack-Chim3, a packaging cell line for stable production of lentiviral vectors for anti-HIV gene therapy.

PubMed

Stornaiuolo, Anna; Piovani, Bianca Maria; Bossi, Sergio; Zucchelli, Eleonora; Corna, Stefano; Salvatori, Francesca; Mavilio, Fulvio; Bordignon, Claudio; Rizzardi, Gian Paolo; Bovolenta, Chiara

2013-08-01

Over the last two decades, several attempts to generate packaging cells for lentiviral vectors (LV) have been made. Despite different technologies, no packaging clone is currently employed in clinical trials. We developed a new strategy for LV stable production based on the HEK-293T progenitor cells; the sequential insertion of the viral genes by integrating vectors; the constitutive expression of the viral components; and the RD114-TR envelope pseudotyping. We generated the intermediate clone PK-7 expressing constitutively gag/pol and rev genes and, by adding tat and rd114-tr genes, the stable packaging cell line RD2-MolPack, which can produce LV carrying any transfer vector (TV). Finally, we obtained the RD2-MolPack-Chim3 producer clone by transducing RD2-MolPack cells with the TV expressing the anti-HIV transgene Chim3. Remarkably, RD114-TR pseudovirions have much higher potency when produced by stable compared with transient technology. Most importantly, comparable transduction efficiency in hematopoietic stem cells (HSC) is obtained with 2-logs less physical particles respect to VSV-G pseudovirions produced by transient transfection. Altogether, RD2-MolPack technology should be considered a valid option for large-scale production of LV to be used in gene therapy protocols employing HSC, resulting in the possibility of downsizing the manufacturing scale by about 10-fold in respect to transient technology.

Latest improvements in microbolometer thin film packaging: paving the way for low-cost consumer applications

NASA Astrophysics Data System (ADS)

Yon, J. J.; Dumont, G.; Goudon, V.; Becker, S.; Arnaud, A.; Cortial, S.; Tisse, C. L.

2014-06-01

Silicon-based vacuum packaging is a key enabling technology for achieving affordable uncooled Infrared Focal Plane Arrays (IRFPA) required by a promising mass market that shows momentum for some extensive consumer applications, such as automotive driving assistance, smart presence localization and building management. Among the various approaches studied worldwide, CEA, LETI in partnership with ULIS is committed to the development of a unique technology referred to as PLP (Pixel Level Packaging). In this PLP technology, each bolometer pixel is sealed under vacuum using a transparent thin film deposition on wafer. PLP operates as an array of hermetic micro caps above the focal plane, each enclosing a single microbolometer. In continuation of our on-going studies on PLP for regular QVGA IRFPAs, this paper emphasizes on the innate scalability of the technology which was successfully demonstrated through the development of an 80 × 80 pixel IRFPA. The relevance of the technology with regard to the two formats is discussed, considering both performance and cost issues. We show that the suboptimal fill factor inherent to the PLP arrangement is not so critical when considering smaller arrays preferably fitted for consumer applications. The discussion is supported with the electro-optical performance measurements of the PLP-based 80×80 demonstrator.

Original Courseware for Introductory Psychology: Implementation and Evaluation.

ERIC Educational Resources Information Center

Slotnick, Robert S.

1988-01-01

Describes the implementation and field testing of PsychWare, a courseware package for introductory psychology developed and field tested at New York Institute of Technology. Highlights include the courseware package (10 software programs, a faculty manual, and a student workbook), and instructional design features (simulations, real-time…

The effect of nano-silver packaging in increasing the shelf life of nuts: An in vitro model

PubMed Central

Tavakoli, Hamidreza; Rastegar, Hossein; Taherian, Mahdi; Samadi, Mohammad; Rostami, Hossein

2017-01-01

Nano packaging is currently one of the most important topics in food packaging technologies. The aim of the application of this technology in food packaging is increasing shelf life of foods by preventing internal and external corruption and microbial contaminations. Use of silver nanoparticles in food packaging has recently attracted much attention. The aim of this study was to investigate the effect of nano-silver packaging in increasing the shelf life packages of nuts in an In vitro model. In this experimental study, the effects of different nano-silver concentrations (0, 1, 2 and 3 percent) on biological and chemical properties of 432 samples of nuts including walnuts, hazelnuts, almonds and pistachios were evaluated during 0, 3, 6, 9, 12, 15, 18, 21 and 24 months. In most samples, different concentrations of nano-silver (1, 2 and 3 %) significantly reduced total microbial count, mold and coliform counts compared to control group and the 3% nano-silver concentration was more effective than other concentrations (P<0.05). Moreover, using this packaging yielded an antioxidant effect especially when 2% and 3% nano-silver concentrations were used. Nano-silver also prevented growth of mold and so prevented aflatoxin production in all treatment groups. Results of chemical and biological tests showed that the silver nanoparticles had a significant effect on increasing the shelf life of nuts. The highest shelf life belonged to pistachios, almonds, hazelnuts and walnuts with 20, 19, 18 and 18 months, respectively. The shelf life was associated with amount of silver nanoparticles. The highest antimicrobial activity was observed when 3% nano-silver concentration was used in pistachios. The shelf life of control groups in similar storage conditions were calculated for an average of 13 months. In conclusion, the results of this study demonstrate the efficacy of nano-silver packing in increasing shelf life of nuts. Hence, use of nano-silver packaging in food industry, especially in food packaging is recommended. PMID:29564232

The effect of nano-silver packaging in increasing the shelf life of nuts: An in vitro model.

PubMed

Tavakoli, Hamidreza; Rastegar, Hossein; Taherian, Mahdi; Samadi, Mohammad; Rostami, Hossein

2017-10-20

Nano packaging is currently one of the most important topics in food packaging technologies. The aim of the application of this technology in food packaging is increasing shelf life of foods by preventing internal and external corruption and microbial contaminations. Use of silver nanoparticles in food packaging has recently attracted much attention. The aim of this study was to investigate the effect of nano-silver packaging in increasing the shelf life packages of nuts in an In vitro model. In this experimental study, the effects of different nano-silver concentrations (0, 1, 2 and 3 percent) on biological and chemical properties of 432 samples of nuts including walnuts, hazelnuts, almonds and pistachios were evaluated during 0, 3, 6, 9, 12, 15, 18, 21 and 24 months. In most samples, different concentrations of nano-silver (1, 2 and 3 %) significantly reduced total microbial count, mold and coliform counts compared to control group and the 3% nano-silver concentration was more effective than other concentrations (P<0.05). Moreover, using this packaging yielded an antioxidant effect especially when 2% and 3% nano-silver concentrations were used. Nano-silver also prevented growth of mold and so prevented aflatoxin production in all treatment groups. Results of chemical and biological tests showed that the silver nanoparticles had a significant effect on increasing the shelf life of nuts. The highest shelf life belonged to pistachios, almonds, hazelnuts and walnuts with 20, 19, 18 and 18 months, respectively. The shelf life was associated with amount of silver nanoparticles. The highest antimicrobial activity was observed when 3% nano-silver concentration was used in pistachios. The shelf life of control groups in similar storage conditions were calculated for an average of 13 months. In conclusion, the results of this study demonstrate the efficacy of nano-silver packing in increasing shelf life of nuts. Hence, use of nano-silver packaging in food industry, especially in food packaging is recommended.

Photo-Curable Metal-Chelating Coatings Offer a Scalable Approach to Production of Antioxidant Active Packaging.

PubMed

Lin, Zhuangsheng; Goddard, Julie

2018-02-01

Synthetic metal chelators (for example, ethylenediaminetetraacetic acid, EDTA) are widely used as additives to control trace transition metal induced oxidation in consumer products. To enable removal of synthetic chelators in response to increasing consumer demand for clean label products, metal-chelating active food packaging technologies have been developed with demonstrated antioxidant efficacy in simulated food systems. However, prior work in fabrication of metal-chelating materials leveraged batch chemical reactions to tether metal-chelating ligands, a process with limited industrial translatability for large-scale fabrication. To improve the industrial translatability, we have designed a 2-step laminated photo-grafting process to introduce metal chelating functionality onto common polymeric packaging materials. Iminodiacetic acid (IDA) functionalized materials were fabricated by photo-grafting poly(acrylic acid) onto polypropylene (PP) films, followed by a second photo-grafting process to graft-polymerize an IDA functionalized vinyl monomer (GMA-IDA). The photo-grafting was conducted under atmospheric conditions and was completed in 2 min. The resulting IDA functionalized metal-chelating material was able to chelate iron and copper, and showed antioxidant efficacy against ascorbic acid degradation, supporting its potential to be used synergistically with natural antioxidants for preservation of food and beverage products. The 2-step photo-grafting process improves the throughput of active packaging coatings, enabling potential roll-to-roll fabrication of metal-chelating active packaging materials for antioxidant food packaging applications. To address consumer and retail demands for "clean label" foods and beverages without a corresponding loss in product quality and shelf life, producers are seeking next generation technologies such as active packaging. In this work, we will report the synthesis of metal-chelating active packaging films, which enable removal of the synthetic additive, ethylenediamine tetraacetic acid. The new synthesis technique improves the throughput of metal-chelating active packaging coatings, enabling potential roll-to-roll fabrication of the materials for antioxidant food packaging applications. © 2018 Institute of Food Technologists®.

Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging

NASA Astrophysics Data System (ADS)

Wang, Qian; Choa, Sung-Hoon; Kim, Woonbae; Hwang, Junsik; Ham, Sukjin; Moon, Changyoul

2006-03-01

Development of packaging is one of the critical issues toward realizing commercialization of radio-frequency-microelectromechanical system (RF-MEMS) devices. The RF-MEMS package should be designed to have small size, hermetic protection, good RF performance, and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low-temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at temperatures below 300°C is used. Au-Sn multilayer metallization with a square loop of 70 µm in width is performed. The electrical feed-through is achieved by the vertical through-hole via filling with electroplated Cu. The size of the MEMS package is 1 mm × 1 mm × 700 µm. The shear strength and hermeticity of the package satisfies the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bornea, A.; Zamfirache, M.; Stefan, L.

ICIT (Institute for Cryogenics and Isotopic Technologies) has used its experience in cryogenic water distillation process to propose a similar process for hydrogen distillation that can be used in detritiation technologies. This process relies on the same packages but a stainless filling is tested instead of the phosphorous bronze filling used for water distillation. This paper presents two types of packages developed for hydrogen distillation, both have a stainless filling but it differs in terms of density, exchange surface and specific volume. Performance data have been obtained on laboratory scale. In order to determine the characteristics of the package, themore » installation was operated in the total reflux mode, for different flow rate for the liquid. There were made several experiments considering different operating conditions. Samples extracted at the top and bottom of cryogenic distillation column allowed mathematical processing to determine the separation performance. The experiments show a better efficiency for the package whose exchange surface was higher and there were no relevant differences between both packages as the operating pressure of the cryogenic column was increasing. For a complete characterization of the packages, future experiments will be considered to determine performance at various velocities in the column and their correlation with the pressure in the column. We plan further experiments to separate tritium from the mixture of isotopes DT, having in view that our goal is to apply this results to a detritiation plant.« less

ReadqPCR and NormqPCR: R packages for the reading, quality checking and normalisation of RT-qPCR quantification cycle (Cq) data.

PubMed

Perkins, James R; Dawes, John M; McMahon, Steve B; Bennett, David L H; Orengo, Christine; Kohl, Matthias

2012-07-02

Measuring gene transcription using real-time reverse transcription polymerase chain reaction (RT-qPCR) technology is a mainstay of molecular biology. Technologies now exist to measure the abundance of many transcripts in parallel. The selection of the optimal reference gene for the normalisation of this data is a recurring problem, and several algorithms have been developed in order to solve it. So far nothing in R exists to unite these methods, together with other functions to read in and normalise the data using the chosen reference gene(s). We have developed two R/Bioconductor packages, ReadqPCR and NormqPCR, intended for a user with some experience with high-throughput data analysis using R, who wishes to use R to analyse RT-qPCR data. We illustrate their potential use in a workflow analysing a generic RT-qPCR experiment, and apply this to a real dataset. Packages are available from http://www.bioconductor.org/packages/release/bioc/html/ReadqPCR.htmland http://www.bioconductor.org/packages/release/bioc/html/NormqPCR.html These packages increase the repetoire of RT-qPCR analysis tools available to the R user and allow them to (amongst other things) read their data into R, hold it in an ExpressionSet compatible R object, choose appropriate reference genes, normalise the data and look for differential expression between samples.

30 CFR 7.107 - New technology.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false New technology. 7.107 Section 7.107 Mineral... Underground Coal Mines Where Permissible Electric Equipment is Required § 7.107 New technology. MSHA may approve a diesel power package that incorporates technology for which the requirements of this subpart are...

30 CFR 7.107 - New technology.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 30 Mineral Resources 1 2012-07-01 2012-07-01 false New technology. 7.107 Section 7.107 Mineral... Underground Coal Mines Where Permissible Electric Equipment is Required § 7.107 New technology. MSHA may approve a diesel power package that incorporates technology for which the requirements of this subpart are...

30 CFR 7.107 - New technology.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 30 Mineral Resources 1 2013-07-01 2013-07-01 false New technology. 7.107 Section 7.107 Mineral... Underground Coal Mines Where Permissible Electric Equipment is Required § 7.107 New technology. MSHA may approve a diesel power package that incorporates technology for which the requirements of this subpart are...

30 CFR 7.107 - New technology.

Code of Federal Regulations, 2014 CFR

2014-07-01

... 30 Mineral Resources 1 2014-07-01 2014-07-01 false New technology. 7.107 Section 7.107 Mineral... Underground Coal Mines Where Permissible Electric Equipment is Required § 7.107 New technology. MSHA may approve a diesel power package that incorporates technology for which the requirements of this subpart are...

30 CFR 7.107 - New technology.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false New technology. 7.107 Section 7.107 Mineral... Underground Coal Mines Where Permissible Electric Equipment is Required § 7.107 New technology. MSHA may approve a diesel power package that incorporates technology for which the requirements of this subpart are...

Antimicrobial activity of biodegradable polysaccharide and protein-based films containing active agents.

PubMed

Kuorwel, Kuorwel K; Cran, Marlene J; Sonneveld, Kees; Miltz, Joseph; Bigger, Stephen W

2011-04-01

Significant interest has emerged in the introduction of food packaging materials manufactured from biodegradable polymers that have the potential to reduce the environmental impacts associated with conventional packaging materials. Current technologies in active packaging enable effective antimicrobial (AM) packaging films to be prepared from biodegradable materials that have been modified and/or blended with different compatible materials and/or plasticisers. A wide range of AM films prepared from modified biodegradable materials have the potential to be used for packaging of various food products. This review examines biodegradable polymers derived from polysaccharides and protein-based materials for their potential use in packaging systems designed for the protection of food products from microbial contamination. A comprehensive table that systematically analyses and categorizes much of the current literature in this area is included in the review.

Study on vacuum packaging reliability of micromachined quartz tuning fork gyroscopes

NASA Astrophysics Data System (ADS)

Fan, Maoyan; Zhang, Lifang

2017-09-01

Packaging technology of the micromachined quartz tuning fork gyroscopes by vacuum welding has been experimentally studied. The performance of quartz tuning fork is influenced by the encapsulation shell, encapsulation method and fixation of forks. Alloy solder thick film is widely used in the package to avoid the damage of the chip structure by the heat resistance and hot temperature, and this can improve the device performance and welding reliability. The results show that the bases and the lids plated with gold and nickel can significantly improve the airtightness and reliability of the vacuum package. Vacuum packaging is an effective method to reduce the vibration damping, improve the quality factor and further enhance the performance. The threshold can be improved nearly by 10 times.

Effect of novel food processing methods on packaging: structure, composition, and migration properties.

PubMed

Guillard, V; Mauricio-Iglesias, M; Gontard, N

2010-11-01

Classical stabilization techniques (thermal treatments) usually involve food to be packed after being processed. On the contrary and increasingly, novel food processing methods, such as high pressure or microwaves, imply that both packaging and foodstuff undergo the stabilization treatment. Moreover, novel treatments (UV light, irradiation, ozone, cold plasma) are specifically used for disinfection and sterilization of the packaging material itself. Therefore, in the last several years a number of papers have focused on the effects of these new treatments on food-packaging interactions with a special emphasis on chemical migration and safety concerns. New packaging materials merged on the market with specific interest regarding the environment (i.e. bio-sourced materials) or mechanical and barrier properties (i.e. nanocomposites packaging materials). It is time to evaluate the knowledge about how these in-package food technologies affect food/packaging interactions, and especially for novel biodegradable and/or active materials. This article presents the effect of high pressure treatment, microwave heating, irradiation, UV-light, ozone and, cold plasma treatment on food/packaging interactions.

Robust, Rework-able Thermal Electronic Packaging: Applications in High Power TR Modules for Space

NASA Technical Reports Server (NTRS)

Hoffman, James Patrick; Del Castillo, Linda; Hunter, Don; Miller, Jennifer

2012-01-01

The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires improvements in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and are now being implemented side-by-side with more standard technology typically used in flight hardware.

Frosta: a new technology for making fast-melting tablets.

PubMed

Jeong, Seong Hoon; Fu, Yourong; Park, Kinam

2005-11-01

The fast-melting tablet (FMT) technology, which is known to be one of the most innovated methods in oral drug delivery systems, is a rapidly growing area of drug delivery. The initial success of the FMT formulation led to the development of various technologies. These technologies, however, still have some limitations. Recently, a new technology called Frosta (Akina) was developed for making FMTs. The Frosta technology utilises the conventional wet granulation process and tablet press for cost-effective production of tablets. The Frosta tablets are mechanically strong with friability of < 1% and are stable in accelerated stability conditions when packaged into a bottle container. They are robust enough to be packaged in multi-tablet vials. Conventional rotary tablet presses can be used for the production of the tablets and no other special instruments are required. Thus, the cost of making FMTs is lower than that of other existing technologies. Depending on the size, Frosta tablets can melt in < 10 s after placing them in the oral cavity for easy swallowing. The Frosta technology is ideal for wide application of FMTs technology to various drug and nutritional formulations.

Synthesis and characterization of lithium intercalation electrodes based on iron oxide thin films

NASA Astrophysics Data System (ADS)

Sarradin, J.; Guessous, A.; Ribes, M.

Sputter-deposited iron oxide thin films are investigated as a possible negative electrode for rocking-chair microbatteries. Experimental conditions related to the manufacturing of amorphous thin films suitable to a large number of available intercalation sites are described. Structural and physical properties of the thin layer films are presented. The conductivities of the amorphous thin films were found to be very high compared with those of the respective crystalline forms. Regarding the electrochemical behaviour, Fe 2O 3-based thin films electrodes are able to store and reversibly exchange lithium ions. At a C/2 charge/discharge rate with 100% depth-of-discharge (DOD), the specific capacity of these amorphous thin film electrodes remains almost constant and close to 330 Ah/kg after more than 120 charge/discharge cycles.

Compact, Engineered 2-Micron Coherent Doppler Wind Lidar Prototype for Field and Airborne Evaluation

NASA Technical Reports Server (NTRS)

Kavaya, Michael J.; Amzajerdian, Farzin; Koch, Grady J.

2006-01-01

The state-of-the-art 2-micron coherent Doppler wind lidar breadboard at NASA/LaRC will be engineered and compactly packaged consistent with future aircraft flights. The packaged transceiver will be integrated into a coherent Doppler wind lidar system test bed at LaRC. Atmospheric wind measurements will be made to validate the packaged technology. This will greatly advance the coherent part of the hybrid Doppler wind lidar solution to the need for global tropospheric wind measurements.

Critical review of controlled release packaging to improve food safety and quality.

PubMed

Chen, Xi; Chen, Mo; Xu, Chenyi; Yam, Kit L

2018-03-19

Controlled release packaging (CRP) is an innovative technology that uses the package to release active compounds in a controlled manner to improve safety and quality for a wide range of food products during storage. This paper provides a critical review of the uniqueness, design considerations, and research gaps of CRP, with a focus on the kinetics and mechanism of active compounds releasing from the package. Literature data and practical examples are presented to illustrate how CRP controls what active compounds to release, when and how to release, how much and how fast to release, in order to improve food safety and quality.

Vacuum decay container closure integrity leak test method development and validation for a lyophilized product-package system.

PubMed

Patel, Jayshree; Mulhall, Brian; Wolf, Heinz; Klohr, Steven; Guazzo, Dana Morton

2011-01-01

A leak test performed according to ASTM F2338-09 Standard Test Method for Nondestructive Detection of Leaks in Packages by Vacuum Decay Method was developed and validated for container-closure integrity verification of a lyophilized product in a parenteral vial package system. This nondestructive leak test method is intended for use in manufacturing as an in-process package integrity check, and for testing product stored on stability in lieu of sterility tests. Method development and optimization challenge studies incorporated artificially defective packages representing a range of glass vial wall and sealing surface defects, as well as various elastomeric stopper defects. Method validation required 3 days of random-order replicate testing of a test sample population of negative-control, no-defect packages and positive-control, with-defect packages. Positive-control packages were prepared using vials each with a single hole laser-drilled through the glass vial wall. Hole creation and hole size certification was performed by Lenox Laser. Validation study results successfully demonstrated the vacuum decay leak test method's ability to accurately and reliably detect those packages with laser-drilled holes greater than or equal to approximately 5 μm in nominal diameter. All development and validation studies were performed at Whitehouse Analytical Laboratories in Whitehouse, NJ, under the direction of consultant Dana Guazzo of RxPax, LLC, using a VeriPac 455 Micro Leak Test System by Packaging Technologies & Inspection (Tuckahoe, NY). Bristol Myers Squibb (New Brunswick, NJ) fully subsidized all work. A leak test performed according to ASTM F2338-09 Standard Test Method for Nondestructive Detection of Leaks in Packages by Vacuum Decay Method was developed and validated to detect defects in stoppered vial packages containing lyophilized product for injection. This nondestructive leak test method is intended for use in manufacturing as an in-process package integrity check, and for testing product stored on stability in lieu of sterility tests. Test method validation study results proved the method capable of detecting holes laser-drilled through the glass vial wall greater than or equal to 5 μm in nominal diameter. Total test time is less than 1 min per package. All method development and validation studies were performed at Whitehouse Analytical Laboratories in Whitehouse, NJ, under the direction of consultant Dana Guazzo of RxPax, LLC, using a VeriPac 455 Micro Leak Test System by Packaging Technologies & Inspection (Tuckahoe, NY). Bristol Myers Squibb (New Brunswick, NJ) fully subsidized all work.

Facilitating hydrological data analysis workflows in R: the RHydro package

NASA Astrophysics Data System (ADS)

Buytaert, Wouter; Moulds, Simon; Skoien, Jon; Pebesma, Edzer; Reusser, Dominik

2015-04-01

The advent of new technologies such as web-services and big data analytics holds great promise for hydrological data analysis and simulation. Driven by the need for better water management tools, it allows for the construction of much more complex workflows, that integrate more and potentially more heterogeneous data sources with longer tool chains of algorithms and models. With the scientific challenge of designing the most adequate processing workflow comes the technical challenge of implementing the workflow with a minimal risk for errors. A wide variety of new workbench technologies and other data handling systems are being developed. At the same time, the functionality of available data processing languages such as R and Python is increasing at an accelerating pace. Because of the large diversity of scientific questions and simulation needs in hydrology, it is unlikely that one single optimal method for constructing hydrological data analysis workflows will emerge. Nevertheless, languages such as R and Python are quickly gaining popularity because they combine a wide array of functionality with high flexibility and versatility. The object-oriented nature of high-level data processing languages makes them particularly suited for the handling of complex and potentially large datasets. In this paper, we explore how handling and processing of hydrological data in R can be facilitated further by designing and implementing a set of relevant classes and methods in the experimental R package RHydro. We build upon existing efforts such as the sp and raster packages for spatial data and the spacetime package for spatiotemporal data to define classes for hydrological data (HydroST). In order to handle simulation data from hydrological models conveniently, a HM class is defined. Relevant methods are implemented to allow for an optimal integration of the HM class with existing model fitting and simulation functionality in R. Lastly, we discuss some of the design challenges of the RHydro package, including integration with big data technologies, web technologies, and emerging data models in hydrology.

Energy Efficiency Opportunities in Highway Lodging Buildings: Development of 50% Energy Savings Design Technology Packages

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jiang, Wei; Gowri, Krishnan; Thornton, Brian A.

2010-06-30

This paper presents the process, methodology, and assumptions for development of the 50% Energy Savings Design Technology Packages for Highway Lodging Buildings, a design guidance document that provides specific recommendations for achieving 50% energy savings in roadside motels (highway lodging) above the requirements of ANSI/ASHRAE/IESNA Standard 90.1-2004. This 50% solution represents a further step toward realization of the U.S. Department of Energy’s net-zero energy building goal, and go beyond the 30% savings in the Advanced Energy Design Guide series (upon which this work was built). This work can serve as the technical feasibility study for the development of a 50%more » saving Advanced Energy Design Guide for highway lodging, and thus should greatly expedite the development process. The purpose of this design package is to provide user-friendly design assistance to designers, developers, and owners of highway lodging properties. It is intended to encourage energy-efficient design by providing prescriptive energy-efficiency recommendations for each climate zone that attains the 50% the energy savings target. This paper describes the steps that were taken to demonstrate the technical feasibility of achieving a 50% reduction in whole-building energy use with practical and commercially available technologies. The energy analysis results are presented, indicating the recommended energy-efficient measures achieved a national-weighted average energy savings of 55%, relative to Standard 90.1-2004. The cost-effectiveness of the recommended technology package is evaluated and the result shows an average simple payback of 11.3 years.« less

Transfer research and impact studies program

NASA Technical Reports Server (NTRS)

Freeman, J. E. (Editor)

1975-01-01

Methods developed for stimulating interest in the transfer of NASA-originated technology are described. These include: new information packaging concepts; technology transfer via people transfer; information management systems; data bank operations; and professional communication activities.

Review of Stack CSP Technologies

NASA Technical Reports Server (NTRS)

Ghaffarian, R.

1999-01-01

CSP is an emerging technology with significant potential growth in stacking. Many of the stacking techniques for conventional packages could be implemented for CSP once materials, process, and system development for finer features are developed.

The NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond and Recent Radiation Highlights

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2015-01-01

This presentation is a NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond. This roadmap provides a snapshot for current plans and collaborations on testing and evaluation of electronics as well as a discussion of the technology selection approach.

Home page | prc.gatech.edu | Georgia Institute of Technology | Atlanta, GA

Science.gov Websites

Interconnections & Assembly Low Cost Glass Interposers & Packages MEMS and Sensors GRA Opportunities addressing electrical, mechanical and thermal barriers. Low-cost Glass Interposer and Package Panel-based ultra-thin glass as a high performance, high I/O density, and low cost platform. Interconnections and

Marriages of Convenience? Teachers and Coursebooks in the Digital Age

ERIC Educational Resources Information Center

Allen, Christopher

2015-01-01

This article reports on a survey of Swedish EFL teachers' attitudes towards, and dependence on, ELT coursebook packages in the light of recent research into digital literacy. The results showed that while ICT is making massive inroads into language classrooms in technologically advantaged countries like Sweden, the coursebook package still has its…

Silicon Carbide Integrated Circuit Chip

NASA Image and Video Library

2015-02-17

A multilevel interconnect silicon carbide integrated circuit chip with co-fired ceramic package and circuit board recently developed at the NASA GRC Smart Sensors and Electronics Systems Branch for high temperature applications. High temperature silicon carbide electronics and compatible packaging technologies are elements of instrumentation for aerospace engine control and long term inner-solar planet explorations.

Overview of NASA Langley's Piezoelectric Ceramic Packaging Technology and Applications

NASA Technical Reports Server (NTRS)

Bryant, Robert G.

2007-01-01

Over the past decade, NASA Langley Research Center (LaRC) has developed several actuator packaging concepts designed to enhance the performance of commercial electroactive ceramics. NASA LaRC focused on properly designed actuator and sensor packaging for the following reasons, increased durability, protect the working material from the environment, allow for proper mechanical and electrical contact, afford "ready to use" mechanisms that are scalable, and develop fabrication methodology applicable to any active material of the same physical class. It is more cost effective to enhance or tailor the performance of existing systems, through innovative packaging, than to develop, test and manufacture new materials. This approach led to the development of several solid state actuators that include THUNDER, the Macrofiber Composite or (MFC) and the Radial Field Diaphragm or (RFD). All these actuators are fabricated using standard materials and processes derived from earlier concepts. NASA s fabrication and packaging technology as yielded, piezoelectric actuators and sensors that are easy to implement, reliable, consistent in properties, and of lower cost to manufacture in quantity, than their predecessors (as evidenced by their continued commercial availability.) These piezoelectric actuators have helped foster new research and development in areas involving computational modeling, actuator specific refinements, and engineering system redesign which led to new applications for piezo-based devices that replace traditional systems currently in use.

Design of an interactive digital nutritional education package for elderly people.

PubMed

Ali, Nazlena Mohamad; Shahar, Suzana; Kee, You Lee; Norizan, Azir Rezha; Noah, Shahrul Azman Mohd

2012-12-01

Designing a system for the elderly is crucial, as aging is associated with physiological changes that may impair perception, cognition and other social aspects; therefore, many aspects need consideration, especially in interface design. This study was conducted to develop a digital nutritional education package (WE Sihat) by following appropriate guidelines for elderly people to achieve better design interface and interaction. Touch-screen technology was used as a platform for user interaction. The nutritional content was based on previous nutrition studies and a lifestyle education package on healthy aging, which contains four modules. The questionnaires were distributed to 31 Malay subjects aged 60-76 years old, containing an evaluation about the overall content, graphics, design layout, colour, font size, audio/video, user-perceived satisfaction and acceptance levels. The findings showed positive feedback and acceptance. Most subjects agreed that the digital nutritional education package can increase their nutritional knowledge for a healthy lifestyle and is easy to use. The touch-screen technology was also well accepted by elderly people and can be used as a kiosk for disseminating nutrition education for healthy aging.

Electronic manufacturing and packaging in Japan

NASA Technical Reports Server (NTRS)

Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John A.; Meieran, Eugene S.; Pecht, Michael; Peeples, John W.; Tummala, Rao R.

1995-01-01

This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies. Japan has established this marked competitive advantage in electronics as a consequence of developing low-cost, high-volume consumer products. Japan's infrastructure, and the remarkable cohesiveness of vision and purpose in government and industry, are key factors in the success of Japan's electronics industry. Although Japan will continue to dominate consumer electronics in the foreseeable future, opportunities exist for the United States and other industrial countries to capture an increasingly large part of the market. The JTEC panel has identified no insurmountable barriers that would prevent the United States from regaining a significant share of the consumer electronics market; in fact, there is ample evidence that the United States needs to aggressively pursue high-volume, low-cost electronic assembly, because it is a critical path leading to high-performance electronic systems.

GSFC Cutting Edge Avionics Technologies for Spacecraft

NASA Technical Reports Server (NTRS)

Luers, Philip J.; Culver, Harry L.; Plante, Jeannette

1998-01-01

With the launch of NASA's first fiber optic bus on SAMPEX in 1992, GSFC has ushered in an era of new technology development and insertion into flight programs. Predating such programs the Lewis and Clark missions and the New Millenium Program, GSFC has spearheaded the drive to use cutting edge technologies on spacecraft for three reasons: to enable next generation Space and Earth Science, to shorten spacecraft development schedules, and to reduce the cost of NASA missions. The technologies developed have addressed three focus areas: standard interface components, high performance processing, and high-density packaging techniques enabling lower cost systems. To realize the benefits of standard interface components GSFC has developed and utilized radiation hardened/tolerant devices such as PCI target ASICs, Parallel Fiber Optic Data Bus terminals, MIL-STD-1773 and AS1773 transceivers, and Essential Services Node. High performance processing has been the focus of the Mongoose I and Mongoose V rad-hard 32-bit processor programs as well as the SMEX-Lite Computation Hub. High-density packaging techniques have resulted in 3-D stack DRAM packages and Chip-On-Board processes. Lower cost systems have been demonstrated by judiciously using all of our technology developments to enable "plug and play" scalable architectures. The paper will present a survey of development and insertion experiences for the above technologies, as well as future plans to enable more "better, faster, cheaper" spacecraft. Details of ongoing GSFC programs such as Ultra-Low Power electronics, Rad-Hard FPGAs, PCI master ASICs, and Next Generation Mongoose processors.

Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays

NASA Astrophysics Data System (ADS)

Forsberg, Fredrik; Roxhed, Niclas; Fischer, Andreas C.; Samel, Björn; Ericsson, Per; Hoivik, Nils; Lapadatu, Adriana; Bring, Martin; Kittilsland, Gjermund; Stemme, Göran; Niklaus, Frank

2013-09-01

Imaging in the long wavelength infrared (LWIR) range from 8 to 14 μm is an extremely useful tool for non-contact measurement and imaging of temperature in many industrial, automotive and security applications. However, the cost of the infrared (IR) imaging components has to be significantly reduced to make IR imaging a viable technology for many cost-sensitive applications. This paper demonstrates new and improved fabrication and packaging technologies for next-generation IR imaging detectors based on uncooled IR bolometer focal plane arrays. The proposed technologies include very large scale heterogeneous integration for combining high-performance, SiGe quantum-well bolometers with electronic integrated read-out circuits and CMOS compatible wafer-level vacuum packing. The fabrication and characterization of bolometers with a pitch of 25 μm × 25 μm that are arranged on read-out-wafers in arrays with 320 × 240 pixels are presented. The bolometers contain a multi-layer quantum well SiGe thermistor with a temperature coefficient of resistance of -3.0%/K. The proposed CMOS compatible wafer-level vacuum packaging technology uses Cu-Sn solid-liquid interdiffusion (SLID) bonding. The presented technologies are suitable for implementation in cost-efficient fabless business models with the potential to bring about the cost reduction needed to enable low-cost IR imaging products for industrial, security and automotive applications.

Chip Scale Package Integrity Assessment by Isothermal Aging

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

1998-01-01

Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attachment processes. These test vehicles use numerous package types. To understand potential failure mechanisms of the packages, particularly solder ball attachment, the grid CSPs were subjected to environmental exposure. Package I/Os ranged from 40 to nearly 300. This paper presents both as assembled, up to 1, 000 hours of isothermal aging shear test results and photo micrographs, and tensile test results before and after 1,500 cycles in the range of -30/100 C for CSPs. Results will be compared to BGAs with the same the same isothermal aging environmental exposures.

Low-cost CWDM transmitter package

NASA Astrophysics Data System (ADS)

Bhandarkar, Navin; Castillega, Jaime

2005-03-01

A low-cost coarse-wavelength-division multiplexer (CWDM) transmitter that combines four channels (wavelengths) in the infrared spectrum (~1310 nm) in a small form-factor un-cooled package is demonstrated. The package utilizes precision molded optics to multiplex beams from four grating-outcoupled surface-emitting (GSE) lasers into a single beam suitable for coupling into multimode fiber. This paper summarizes the optical and opto-mechanical design, fabrication and assembly of prototypes, and optical, thermal and electrical measurement results of the prototypes. This unique design enables multiplexing of wavelengths without the use of filters, waveguides, couplers and fiber splicing. Commercial fabrication and alignment technology is used to manufacture the package, resulting in a more robust, reliable and low-cost transmitter. The transmitter package is enabled by the unique characteristics of the long-wavelength GSE laser.

Thick photosensitive polyimide film side wall angle variability and scum improvement for IC packaging stress control

NASA Astrophysics Data System (ADS)

Mehta, Sohan Singh; Yeung, Marco; Mirza, Fahad; Raman, Thiagarajan; Longenbach, Travis; Morgan, Justin; Duggan, Mark; Soedibyo, Rio A.; Reidy, Sean; Rabie, Mohamed; Cho, Jae Kyu; Premachandran, C. S.; Faruqui, Danish

2018-03-01

In this paper, we demonstrate photosensitive polyimide (PSPI) profile optimization to effectively reduce stress concentrations and enable PSPI as protection package-induced stress. Through detailed package simulation, we demonstrate 45% reduction in stress as the sidewall angle (SWA) of PSPI is increased from 45 to 80 degrees in Cu pillar package types. Through modulation of coating and develop multi-step baking temperature and time, as well as dose energy and post litho surface treatments, we demonstrate a method for reliably obtaining PSPI sidewall angle >75 degree. Additionally, we experimentally validate the simulation findings that PSPI sidewall angle impacts chip package interaction (CPI). Finally, we conclude this paper with PSPI material and tool qualification requirements for future technology node based on current challenges.

New SOFRADIR 10μm pixel pitch infrared products

NASA Astrophysics Data System (ADS)

Lefoul, X.; Pere-Laperne, N.; Augey, T.; Rubaldo, L.; Aufranc, Sébastien; Decaens, G.; Ricard, N.; Mazaleyrat, E.; Billon-Lanfrey, D.; Gravrand, Olivier; Bisotto, Sylvette

2014-10-01

Recent advances in miniaturization of IR imaging technology have led to a growing market for mini thermal-imaging sensors. In that respect, Sofradir development on smaller pixel pitch has made much more compact products available to the users. When this competitive advantage is mixed with smaller coolers, made possible by HOT technology, we achieved valuable reductions in the size, weight and power of the overall package. At the same time, we are moving towards a global offer based on digital interfaces that provides our customers simplifications at the IR system design process while freeing up more space. This paper discusses recent developments on hot and small pixel pitch technologies as well as efforts made on compact packaging solution developed by SOFRADIR in collaboration with CEA-LETI.

ReadqPCR and NormqPCR: R packages for the reading, quality checking and normalisation of RT-qPCR quantification cycle (Cq) data

PubMed Central

2012-01-01

Background Measuring gene transcription using real-time reverse transcription polymerase chain reaction (RT-qPCR) technology is a mainstay of molecular biology. Technologies now exist to measure the abundance of many transcripts in parallel. The selection of the optimal reference gene for the normalisation of this data is a recurring problem, and several algorithms have been developed in order to solve it. So far nothing in R exists to unite these methods, together with other functions to read in and normalise the data using the chosen reference gene(s). Results We have developed two R/Bioconductor packages, ReadqPCR and NormqPCR, intended for a user with some experience with high-throughput data analysis using R, who wishes to use R to analyse RT-qPCR data. We illustrate their potential use in a workflow analysing a generic RT-qPCR experiment, and apply this to a real dataset. Packages are available from http://www.bioconductor.org/packages/release/bioc/html/ReadqPCR.htmland http://www.bioconductor.org/packages/release/bioc/html/NormqPCR.html Conclusions These packages increase the repetoire of RT-qPCR analysis tools available to the R user and allow them to (amongst other things) read their data into R, hold it in an ExpressionSet compatible R object, choose appropriate reference genes, normalise the data and look for differential expression between samples. PMID:22748112

Development of a CFC Critical Area Response (CAR) package

NASA Technical Reports Server (NTRS)

Mccain, J. Wayne

1995-01-01

During the past two years, the NASA Marshall Space Flight Center (MSFC) has studied means to improve the transfer of technology from a major federal lab to a significant portion of an industrial segment. In the past, technology transfers had taken place with individual firms, or small groups of firms. This method of 'customized' transfer is often time consuming and can reduce the effectiveness of a response. Thus, a method was achieved to develop a standardized package on replacement of Chlorofluorocarbons (CFC's) that could be sent out to a large number of firms with minimum follow-up.

NASA Electronic Parts and Packaging (NEPP) Program

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2008-01-01

This viewgraph presentation reviews NASA's Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission needs. The NEPP Program focuses on the reliability aspects of electronic devices. Three principal aspects to this reliability: (1) lifetime, (2) effects of space radiation and the space environment, and (3) creation and maintenance of the assurance support infrastructure required for success.

The NASA Electronic Parts and Packaging (NEPP) Program: Results and Direction

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.

2007-01-01

The NASA Electronic Parts and Packaging (NEPP) Program's mission is to provide guidance to NASA for the selection and application of microelectronic technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. This viewgraph presentation reviews the NEPP program's goals and objectives, and reviews many of the missions that the NEPP program has impacted, both in and out of NASA. Also included are examples of the evaluation that the program performed.

Volvo drivers' experiences with advanced crash avoidance and related technologies.

PubMed

Eichelberger, Angela H; McCartt, Anne T

2014-01-01

Crash avoidance technologies can potentially prevent or mitigate many crashes, but their success depends in part on driver acceptance. Owners of 2010-2012 model Volvo vehicles with several technologies were interviewed about their experiences. Interviews were conducted in summer 2012 with 155 owners of vehicles with City Safety as a standard feature; 145 owners with an optional technology package that included adaptive cruise control, distance alert, collision warning with full auto brake (and pedestrian detection on certain models), driver alert control, and lane departure warning; and 172 owners with both City Safety and the technology package. The survey response rates were 21 percent for owners with City Safety, 30 percent for owners with the technology package, and 27 percent for owners with both. Ten percent of owners opted out before the telephone survey began, and 18 percent declined to participate when called. Despite some annoyance, most respondents always leave the systems on, although fewer do so for lane departure warning (59%). For each of the systems, at least 80 percent of respondents with the system would want it on their next vehicle. Many respondents reported safer driving habits with the systems (e.g., following less closely with adaptive cruise control, using turn signals more often with lane departure warning). Fewer respondents reported potentially unsafe behavior, such as allowing the vehicle to brake for them at least some of the time. About one third of respondents experienced autonomous braking when they believed they were at risk of crashing, and about one fifth of respondents thought it had prevented a crash. About one fifth of respondents with the technology package reported that they were confused or misunderstood which safety system had activated in their vehicle. Consistent with the results for early adopters in the previous survey of Volvo and Infiniti owners, the present survey found that driver acceptance of the technologies remains high, although less so for lane departure warning. This study is the first to report drivers' experiences with City Safety, a collision avoidance system provided as standard equipment on certain Volvo 2010-2012 models, and driver acceptance of this system was high, although not to the same extent as the optional forward collision avoidance system. Future research should continue to monitor drivers' experiences with these technologies as they become available in more vehicles.

Sensor array for the detection of organic and inorganic contaminants in post-consumer recycled plastics for food contact.

PubMed

Davis, Nathan; Danes, Jeffrey E; Vorst, Keith

2017-10-01

Post-consumer recycled (PCR) plastic material is made by collecting used plastic products (e.g., bottles and other plastic packaging materials) and reprocessing them into solid-state pellets or flakes. Plastic recycling has positive environmental benefits, but may also carry potential drawbacks due to unwanted organic and inorganic contaminants. These contaminants can migrate into food packaging made from these recycled plastic materials. The purpose of this research was to identify economically viable real-time monitoring technologies that can be used during the conversion of virgin and recycled resin feedstocks (i.e., various blends of virgin pellets and recycled solid-state pellet or mechanically ground flake) to final articles to ensure the safety, quality and sustainability of packaging feedstocks. Baseline analysis (validation) of real-time technologies was conducted using industry-standard practices for polymer analysis. The data yielded supervised predictive models developed by training sessions completed in a controlled laboratory setting. This technology can be employed to evaluate compliance and aid converters in commodity sourcing of resin without exceeding regulatory thresholds. Furthermore, this technology allowed for real-time decision and diversion strategies during the conversion of resin and flake to final articles or products to minimise the negative impact on human health and environmental exposure.

Spooled packaging of shape memory alloy actuators

NASA Astrophysics Data System (ADS)

Redmond, John A.

A vast cross-section of transportation, manufacturing, consumer product, and medical technologies rely heavily on actuation. Accordingly, progress in these industries is often strongly coupled to the advancement of actuation technologies. As the field of actuation continues to evolve, smart materials show significant promise for satisfying the growing needs of industry. In particular, shape memory alloy (SMA) wire actuators present an opportunity for low-cost, high performance actuation, but until now, they have been limited or restricted from use in many otherwise suitable applications by the difficulty in packaging the SMA wires within tight or unusually shaped form constraints. To address this packaging problem, SMA wires can be spool-packaged by wrapping around mandrels to make the actuator more compact or by redirecting around multiple mandrels to customize SMA wire pathways to unusual form factors. The goal of this dissertation is to develop the scientific knowledge base for spooled packaging of low-cost SMA wire actuators that enables high, predictable performance within compact, customizable form factors. In developing the scientific knowledge base, this dissertation defines a systematic general representation of single and multiple mandrel spool-packaged SMA actuators and provides tools for their analysis, understanding, and synthesis. A quasi-static analytical model distills the underlying mechanics down to the three effects of friction, bending, and binding, which enables prediction of the behavior of generic spool-packaged SMA actuators with specifiable geometric, loading, frictional, and SMA material parameters. An extensive experimental and simulation-based parameter study establishes the necessary understanding of how primary design tradeoffs between performance, packaging, and cost are governed by the underlying mechanics of spooled actuators. A design methodology outlines a systematic approach to synthesizing high performance SMA wire actuators with mitigated material, power, and packaging costs and compact, customizable form factors. By examining the multi-faceted connections between performance, packaging, and cost, this dissertation builds a knowledge base that goes beyond implementing SMA actuators for particular applications. Rather, it provides a well-developed strategy for realizing the advantages of SMA actuation for a broadened range of applications, thereby enabling opportunities for new functionality and capabilities in industry.

Real100G.RF: A Fully Packaged 240 GHz Transmitter with In-Antenna Power Combining in 0.13 μm SiGe Technology

NASA Astrophysics Data System (ADS)

Malz, Stefan; Goettel, Benjamin; Eisenbeis, Joerg; Boes, Florian; Grzyb, Janusz; Vazquez, Pedro Rodriguez; Zwick, Thomas; Pfeiffer, Ullrich R.

2017-09-01

This paper reports on the research activities during the first phase of the project Real100G.RF, which is part of the German Research Foundation (DFG) priority programm SPP1655. The project's main objective is to research silicon-based wireless communication above 200 GHz to enable data rates in excess of 100 gigabit per second (Gbps). To that end, this paper presents a fully packaged 240 GHz RF transmitter front-end with power combining antenna in 0.13 μm SiGe technology. The design of circuit building blocks, passives, antenna and high-speed packaging is discussed. Communication measurements show data rates of 8 Gbps with an EVM of 12.4% using 16-QAM, 24 Gbps with 26.5% EVM using QPSK and 30 Gbps with 27.9% EVM using 8-PSK.

Using Technology to Improve Student Learning. NCREL Viewpoints, Volume 12

ERIC Educational Resources Information Center

Gahala, Jan, Ed.

2004-01-01

"Viewpoints" is a multimedia package containing two audio CDs and a short, informative booklet. This volume of "Viewpoints" focuses on how technology can help improve student learning. The audio CDs provide the voices, or viewpoints, of various leaders from the education field who work closely with technology issues. Their…

Health Instruction Packages: Medical Technologies--EEG, Radiology, & Biomedical Photography.

ERIC Educational Resources Information Center

Brittenham, Dorothea; And Others

Text, illustrations, and exercises are utilized in this set of four learning modules to instruct medical technology students in a variety of job-related skills. The first module, "EEG Technology: Measurement Technique of the 'International 10-20 System'" by Dorothea Brittenham, describes a procedure used by electroencephalograph…

Mechanical properties and release rates of cinnamon oil infused into PLA and Waxy Starch for single-serving cups

USDA-ARS?s Scientific Manuscript database

Consumers demand a safe food supply and are increasingly demanding natural options. Packaging is one of the most important technologies for preserving the quality of food and food products and for ensuring their safety. Food packaging, either rigid or flexible, functions as a barrier to light, humid...

Joint Services Electronics Program.

DTIC Science & Technology

1993-03-05

Mary- land, June 1992. Interconnection Network Design Based on Packaging Considerations Professor Abhiram Ranade with M. T. Raghunath A central...characterized by our abstract models of packaging technology. JSEP Publications [1] M.T. Raghunath and Abhiram Ranade, "Customizing Interconnection...94720, January 1993. [21 M.T. Raghunath and Abhiram Ranade, "Fault-Tolerant Routing in Partitioned Butterfly Networks," submitted to the 1993

Combat Ration Network for Technology Implementation. Universal Benchtop Package Tester

DTIC Science & Technology

2006-10-01

of three years of shelf life, but this packaging is susceptible to tears and holes during the manufacturing process. To avoid package integrity...characteristics, cannot provide a measurement of container contents. April 2003 - Precision Automation and PTI-USA expressed interest in manufacturing systems to... Noodles (185cc) • 212cc(+14.6%) • 209cc(+13.0%) – Chicken Brst. (150cc) • 160cc(+6.3%) • 154cc(+2.6%) • Water Trays – Tray A4 (185cc) • 200cc(+8.1

Development of multimedia resource and short courses for LRFR rating.

DOT National Transportation Integrated Search

2011-09-01

Multimedia technology is an important instrument in the training of graduate engineers. This multimedia package : provides an exclusive background and an in-depth understanding of recent technological advances in the evaluation : and rating of highwa...

Lumped Parameter Model (LPM) for Light-Duty Vehicles

EPA Pesticide Factsheets

EPA’s Lumped Parameter Model (LPM) is a free, desktop computer application that estimates the effectiveness (CO2 Reduction) of various technology combinations or “packages,” in a manner that accounts for synergies between technologies.

Applied technology section. Monthly report, December 1993

DOE Office of Scientific and Technical Information (OSTI.GOV)

Buckner, M.R.

1994-01-28

This monthly report contains abstracts of the progress made in various projects from the applied technology section at the Savannah River Plant. Research areas include engineering modeling and simulation, applied physics, experimental thermal hydraulics, and packaging and transportation.

MEMS in Space Systems

NASA Technical Reports Server (NTRS)

Lyke, J. C.; Michalicek, M. A.; Singaraju, B. K.

1995-01-01

Micro-electro-mechanical systems (MEMS) provide an emerging technology that has the potential for revolutionizing the way space systems are designed, assembled, and tested. The high launch costs of current space systems are a major determining factor in the amount of functionality that can be integrated in a typical space system. MEMS devices have the ability to increase the functionality of selected satellite subsystems while simultaneously decreasing spacecraft weight. The Air Force Phillips Laboratory (PL) is supporting the development of a variety of MEMS related technologies as one of several methods to reduce the weight of space systems and increase their performance. MEMS research is a natural extension of PL research objectives in micro-electronics and advanced packaging. Examples of applications that are under research include on-chip micro-coolers, micro-gyroscopes, vibration sensors, and three-dimensional packaging technologies to integrate electronics with MEMS devices. The first on-orbit space flight demonstration of these and other technologies is scheduled for next year.

Compact, High Power, Multi-Spectral Mid-Infrared Semiconductor Laser Package

NASA Astrophysics Data System (ADS)

Guo, Bujin; Hwang, Wen-Yen; Lin, Chich-Hsiang

2001-10-01

Through a vertically integrated effort involving atomic level material engineering, advanced device processing development, state-of-the-art optomechanical packaging, and thermal management, Applied Optoelectronics, Inc. (AOI), University of Houston (U H), and Physical Science, Inc. (PSI) have made progress in both Sb-based type-II semiconductor material and in P-based type-I laser device development. We have achieved record performance on inP based quantum cascade continuous wave (CW) laser (with more than 5 mW CW power at 210 K). Grating-coupled external-cavity quantum cascade lasers were studied for temperatures from 20 to 230 K. A tuning range of 88 nm has been obtained at 80 K. The technology can be made commercially available and represents a significant milestone with regard to the Dual Use Science and Technology (DUST) intention of fostering dual use commercial technology for defense need. AOI is the first commercial company to ship products of this licensed technology.

Technological developments and the need for technical competencies in food services.

PubMed

Rodgers, Svetlana

2005-05-01

The growing scale of institutional and commercial food services poses a technological challenge of producing large quantities of high quality meals in terms of their safety, sensory and nutritional attributes. Developments in food service technology and systems (cook-freeze, cook-chill and others) allow the replacement of fast food with the service of cooked meals, which are often nutritionally superior. Reliance on equipment, packaging and technological 'know-how' makes food service operations more complex. Operators have to minimise the impact of the numerous steps in the production process, the fundamental weaknesses of cook-chill food safety design, coupled with the practical limitations of Hazard Analysis Critical Control Points management, the potential unevenness of temperature distribution and product deterioration during storage. The fundamental knowledge of food science and microbiology, engineering and packaging technologies is needed. At present, the 'high tech' options, which can improve a product's nutritional value, such as natural preservation hurdles or functional meals, are not used in practice.

Design, fabrication, and evaluation of on-chip micro-supercapacitors

NASA Astrophysics Data System (ADS)

Beidaghi, Majid; Chen, Wei; Wang, Chunlei

2011-06-01

Development of miniaturized electronic systems has stimulated the demand for miniaturized power sources that can be integrated into such systems. Among the different micro power sources micro electrochemical energy storage and conversion devices are particularly attractive because of their high efficiency and relatively high energy density. Electrochemical micro-capacitors or micro-supercapacitors offer higher power density compared to micro-batteries and micro-fuel cells. In this paper, development of on-chip micro-supercapacitors based on interdigitated C-MEMS electrode microarrays is introduced. C-MEMS electrodes are employed both as electrode material for electric double layer capacitor (EDLC) or as three dimensional (3D) current collectors of EDLC or pseudo-capacitive materials. Recent advancements in fabrication methods of C-MEMS based micro-supercapacitors are discussed and electrochemical properties of C-MEMS electrodes and it composites are reviewed.

NASA Tech Briefs, May 2003

NASA Technical Reports Server (NTRS)

2003-01-01

Topics covered include: Using Diffusion Bonding in Making Piezoelectric Actuators; Wireless Temperature-Monitoring System; Analog Binaural Circuits for Detecting and Locating Leaks; Mirrors Containing Biomimetic Shape-Control Actuators; Surface-Micromachined Planar Arrays of Thermopiles; Cascade Back-Propagation Learning in Neural Networks; Perovskite Superlattices as Tunable Microwave Devices; Rollable Thin-Shell Nanolaminate Mirrors; Flight Tests of a Ministick Controller in an F/A-18 Airplane; Piezoelectrically Actuated Shutter for High Vacuum; Bio-Inspired Engineering of Exploration Systems; Microscope Cells Containing Multiple Micromachined Wells; Electrophoretic Deposition for Fabricating Microbatteries; Integrated Arrays of Ion-Sensitive Electrodes; Model of Fluidized Bed Containing Reacting Solids and Gases; Membrane Mirrors With Bimorph Shape Actuators; Using Fractional Clock-Period Delays in Telemetry Arraying; Developing Generic Software for Spacecraft Avionics; Numerical Study of Pyrolysis of Biomass in Fluidized Beds; and Assessment of Models of Chemically Reacting Granular Flows.

Microsupercapacitors as miniaturized energy-storage components for on-chip electronics

NASA Astrophysics Data System (ADS)

Kyeremateng, Nana Amponsah; Brousse, Thierry; Pech, David

2017-01-01

The push towards miniaturized electronics calls for the development of miniaturized energy-storage components that can enable sustained, autonomous operation of electronic devices for applications such as wearable gadgets and wireless sensor networks. Microsupercapacitors have been targeted as a viable route for this purpose, because, though storing less energy than microbatteries, they can be charged and discharged much more rapidly and have an almost unlimited lifetime. In this Review, we discuss the progress and the prospects of integrated miniaturized supercapacitors. In particular, we discuss their power performances and emphasize the need of a three-dimensional design to boost their energy-storage capacity. This is obtainable, for example, through self-supported nanostructured electrodes. We also critically evaluate the performance metrics currently used in the literature to characterize microsupercapacitors and offer general guidelines to benchmark performances towards prospective applications.

Microsupercapacitors as miniaturized energy-storage components for on-chip electronics.

PubMed

Kyeremateng, Nana Amponsah; Brousse, Thierry; Pech, David

2017-01-01

The push towards miniaturized electronics calls for the development of miniaturized energy-storage components that can enable sustained, autonomous operation of electronic devices for applications such as wearable gadgets and wireless sensor networks. Microsupercapacitors have been targeted as a viable route for this purpose, because, though storing less energy than microbatteries, they can be charged and discharged much more rapidly and have an almost unlimited lifetime. In this Review, we discuss the progress and the prospects of integrated miniaturized supercapacitors. In particular, we discuss their power performances and emphasize the need of a three-dimensional design to boost their energy-storage capacity. This is obtainable, for example, through self-supported nanostructured electrodes. We also critically evaluate the performance metrics currently used in the literature to characterize microsupercapacitors and offer general guidelines to benchmark performances towards prospective applications.

Natural biopolimers in organic food packaging

NASA Astrophysics Data System (ADS)

Wieczynska, Justyna; Cavoski, Ivana; Chami, Ziad Al; Mondelli, Donato; Di Donato, Paola; Di Terlizzi, Biagio

2014-05-01

Concerns on environmental and waste problems caused by use of non-biodegradable and non-renewable based plastic packaging have caused an increase interest in developing biodegradable packaging using renewable natural biopolymers. Recently, different types of biopolymers like starch, cellulose, chitosan, casein, whey protein, collagen, egg white, soybean protein, corn zein, gelatin and wheat gluten have attracted considerable attention as potential food packaging materials. Recyclable or biodegradable packaging material in organic processing standards is preferable where possible but specific principles of packaging are not precisely defined and standards have to be assessed. There is evidence that consumers of organic products have specific expectations not only with respect to quality characteristics of processed food but also in social and environmental aspects of food production. Growing consumer sophistication is leading to a proliferation in food eco-label like carbon footprint. Biopolymers based packaging for organic products can help to create a green industry. Moreover, biopolymers can be appropriate materials for the development of an active surfaces designed to deliver incorporated natural antimicrobials into environment surrounding packaged food. Active packaging is an innovative mode of packaging in which the product and the environment interact to prolong shelf life or enhance safety or sensory properties, while maintaining the quality of the product. The work will discuss the various techniques that have been used for development of an active antimicrobial biodegradable packaging materials focusing on a recent findings in research studies. With the current focus on exploring a new generation of biopolymer-based food packaging materials with possible applications in organic food packaging. Keywords: organic food, active packaging, biopolymers , green technology

Evaluating Penetration Ability of Plodia interpunctella (Hübner) (Lepidoptera: Pyralidae) Larvae into Multilayer Polypropylene Packages.

PubMed

Scheff, Deanna S; Sehgal, Blossom; Subramanyam, Bhadriraju

2018-04-18

The larvae of the Indian meal moth, Plodia interpunctella (Hübner), can invade or penetrate packaging materials and infest food products. Energy bars with three polypropylene packaging types were challenged with eggs (first instars), third instars, and fifth instars of P. interpunctella to determine package resistance at 28 °C and 65% r.h. The packing types were also challenged with two male and two female pupae of P. interpunctella under similar conditions in order to determine which package provided the greatest protection against larval penetration. Samples infested with eggs, third instars, and pupae were evaluated after 21 days and 42 days to count the number of larvae, pupae, and adults found inside the packages. Packages challenged with fifth instars were observed after 21 days to count the number of larvae, pupae, and adults inside each package. The number and diameter of the holes were determined in each package, followed by the amount of damage sustained to the energy bar. Third and fifth instars showed a higher tendency to penetrate all of the packaging types. First instars showed a reduction in package penetration ability compared with third and fifth instars. The increase in exposure time resulted in an increase in the damage sustained to the energy bars. Among packaging types, the thickest package (Test A) was most resilient to penetration by all of the larval stages. In conclusion, energy bar manufacturers need to invest more effort into improving packaging designs, creating thicker gauge films, or advancing odor barrier technology, in order to prevent penetration and infestation by P. interpunctella larvae.

Flexible Chip Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain

PubMed Central

Jackson, Nathan; Muthuswamy, Jit

2009-01-01

We report here a novel approach called MEMS microflex interconnect (MMFI) technology for packaging a new generation of Bio-MEMS devices that involve movable microelectrodes implanted in brain tissue. MMFI addresses the need for (i) operating space for movable parts and (ii) flexible interconnects for mechanical isolation. We fabricated a thin polyimide substrate with embedded bond-pads, vias, and conducting traces for the interconnect with a backside dry etch, so that the flexible substrate can act as a thin-film cap for the MEMS package. A double gold stud bump rivet bonding mechanism was used to form electrical connections to the chip and also to provide a spacing of approximately 15–20 µm for the movable parts. The MMFI approach achieved a chip scale package (CSP) that is lightweight, biocompatible, having flexible interconnects, without an underfill. Reliability tests demonstrated minimal increases of 0.35 mΩ, 0.23 mΩ and 0.15 mΩ in mean contact resistances under high humidity, thermal cycling, and thermal shock conditions respectively. High temperature tests resulted in an increase in resistance of > 90 mΩ when aluminum bond pads were used, but an increase of ~ 4.2 mΩ with gold bond pads. The mean-time-to-failure (MTTF) was estimated to be at least one year under physiological conditions. We conclude that MMFI technology is a feasible and reliable approach for packaging and interconnecting Bio-MEMS devices. PMID:20160981

The Development of a Framework for and a Model Teaching-Learning System in Electronics Technology for the Elementary School.

ERIC Educational Resources Information Center

Inaba, Lawrence Akio

Developing a rationale and a structure of knowledge as the basis for an instructional system in electronics technology and designing and developing a packaged instructional system in electronics technology for the sixth grade is the two-fold purpose of this study. The study identifies electronics technology within the broad framework of industrial…

Educational Technology Project, Volume One. The Development of Materials for the Training of Science Education Personnel in Educational Technology. Final Report.

ERIC Educational Resources Information Center

Ziener, George H.; And Others

The planning, production, validation, and revision of learning materials designed for use in institutes for science supervisors is described in this first of five volumes. Four sets of packages, ("Role of the Science Supervisor,""Introduction to Educational Technology,""An Application of Educational Technology," and "Management Kits,") each using…

Webs Wires Waves: The Science & Technology of Communication. National Science and Technology Week, April 20-26, 1997.

ERIC Educational Resources Information Center

National Science Foundation, Arlington, VA.

This collection of activities revolves around the theme of National Science and Technology Week (NSTW). The six 8-page booklets that make up this package present activities that follow a pathway from natural, simple forms of communication toward increasingly complex and technological forms. They are designed to be undertaken in sequence, but can…

Development of multimedia resource and short courses for LRFD design.

DOT National Transportation Integrated Search

2011-03-01

Multimedia technology is an essential instrument in the development of graduate engineers. This : multimedia package provides an exclusive background and an in-depth understanding of the new : technological advances in the design of concrete, steel a...

10 CFR 960.5-2-7 - Transportation.

Code of Federal Regulations, 2013 CFR

2013-01-01

... using reasonably available technology; (iii) will not require transportation system components to meet... require the development of new packaging containment technology; (iv) will allow transportation operations... impacts, taking into account programmatic, technical, social, economic, and environmental factors; and (2...

10 CFR 960.5-2-7 - Transportation.

Code of Federal Regulations, 2014 CFR

2014-01-01

... using reasonably available technology; (iii) will not require transportation system components to meet... require the development of new packaging containment technology; (iv) will allow transportation operations... impacts, taking into account programmatic, technical, social, economic, and environmental factors; and (2...

10 CFR 960.5-2-7 - Transportation.

Code of Federal Regulations, 2012 CFR

2012-01-01

... using reasonably available technology; (iii) will not require transportation system components to meet... require the development of new packaging containment technology; (iv) will allow transportation operations... impacts, taking into account programmatic, technical, social, economic, and environmental factors; and (2...

10 CFR 960.5-2-7 - Transportation.

Code of Federal Regulations, 2010 CFR

2010-01-01

... using reasonably available technology; (iii) will not require transportation system components to meet... require the development of new packaging containment technology; (iv) will allow transportation operations... the affected State that are completed or being developed. (9) A regional meteorological history...

Trends in microbial control techniques for poultry products.

PubMed

Silva, Filomena; Domingues, Fernanda C; Nerín, Cristina

2018-03-04

Fresh poultry meat and poultry products are highly perishable foods and high potential sources of human infection due to the presence of several foodborne pathogens. Focusing on the microbial control of poultry products, the food industry generally implements numerous preventive measures based on the Hazard Analysis and Critical Control Points (HACCP) food safety management system certification together with technological steps, such as refrigeration coupled to modified atmosphere packaging that are able to control identified potential microbial hazards during food processing. However, in recent years, to meet the demand of consumers for minimally processed, high-quality, and additive-free foods, technologies are emerging associated with nonthermal microbial inactivation, such as high hydrostatic pressure, irradiation, and natural alternatives, such as biopreservation or the incorporation of natural preservatives in packaging materials. These technologies are discussed throughout this article, emphasizing their pros and cons regarding the control of poultry microbiota and their effects on poultry sensory properties. The discussion for each of the preservation techniques mentioned will be provided with as much detail as the data and studies provided in the literature for poultry meat and products allow. These new approaches, on their own, have proved to be effective against a wide range of microorganisms in poultry meat. However, since some of these emergent technologies still do not have full consumer's acceptability and, taking into consideration the hurdle technology concept for poultry processing, it is suggested that they will be used as combined treatments or, more frequently, in combination with modified atmosphere packaging.

Inorganic and metal nanoparticles and their antimicrobial activity in food packaging applications.

PubMed

Hoseinnejad, Mahmoud; Jafari, Seid Mahdi; Katouzian, Iman

2018-03-01

Nanotechnology has revolutionized almost all the fields of science and technology, particularly the food packaging industry. Accordingly, some nanoparticles can be used in food contact materials to preserve food products for longer periods. To date, many inorganic and metal nanoparticles have been implemented to synthesize active food packaging materials and to extend the shelf-life of foods. Packaging with nanocomposites containing these nanoparticles offers advantages, such as reduction in the usage of preservatives and higher rate of reactions to inhibit the microbial growth. Nevertheless, the safety issues of employing the metal and inorganic nanoparticles in food packaging are still a major concern and more studies along with clinical trials need to be carried out prior to the mass production of these promising food containers. In this review, we have evaluated recent studies plus the applications of inorganic and metal nanoparticles mostly in food packaging applications along with their antimicrobial properties and reaction mechanisms. Many examples have been provided with the aim of opening new horizons for researchers to implement inorganic and metal nanoparticles in active food packaging field.

Continued advances in high brightness fiber-coupled laser modules for efficient pumping of fiber and solid-state lasers

NASA Astrophysics Data System (ADS)

Hemenway, M.; Chen, Z.; Urbanek, W.; Dawson, D.; Bao, L.; Kanskar, M.; DeVito, M.; Martinsen, R.

2018-02-01

Both the fibber laser and diode-pumped solid-state laser market continue to drive advances in pump diode module brightness. We report on the continued progress by nLIGHT to develop and deliver the highest brightness diode-laser pumps using single-emitter technology. Continued advances in multimode laser diode technology [13] and fiber-coupling techniques have enabled higher emitter counts in the element packages, enabling us to demonstrate 305 W into 105 μm - 0.16 NA. This brightness improvement is achieved by leveraging our prior-reported package re-optimization, allowing an increase in the emitter count from two rows of nine emitters to two rows of twelve emitters. Leveraging the two rows off twelve emitter architecture,, product development has commenced on a 400 W into 200 μm - 00.16 NA package. Additionally, the advances in pump technology intended for CW Yb-doped fiber laser pumping has been leveraged to develop the highest brightness 793 nm pump modules for 2 μm Thulium fiber laser pumping, generating 150 W into 200 μm - 0.18 NA and 100 W into 105 μm - 0.15 NA. Lastly, renewed interest in direct diode materials processing led us to experiment with wavelength multiplexing our existing state of the art 200 W, 105 μm - 00.15 NA package into a combined output of 395 WW into 105 μm - 0.16 NA.

Internal evaluation of the European network for health technology assessment project.

PubMed

Håheim, Lise Lund; Imaz, Iñaki; Loud, Marlène Läubli; Gasparetto, Teresa; González-Enriquez, Jesús; Dahlgren, Helena; Trofimovs, Igor; Berti, Elena; Mørland, Berit

2009-12-01

The internal evaluation studied the development of the European network for Health Technology Assessment (EUnetHTA) Project in achieving the general objective of establishing an effective and a sustainable network of health technology assessment (HTA) in Europe. The Work Package 3 group was dedicated to this task and performed the work. Information on activities during the project was collected from three sources. First, three yearly cross-sectional studies surveyed the participants' opinions. Responses were by individuals or by institutions. The last round included surveys to the Steering Committee, the Stakeholder Forum, and the Secretariat. Second, the Work Package Lead Partners were interviewed bi-annually, five times in total, to update the information on the Project's progress. Third, additional information was sought in available documents. The organizational structure remained stable. The Project succeeded in developing tools aimed at providing common methodology with intent to establish a standard of conducting and reporting HTA and to facilitate greater collaboration among agencies. The participants/agencies expressed their belief in a network and in maintaining local/national autonomy. The Work Package Leaders expressed a strong belief in the solid base of the Project for a future network on which to build, but were aware of the need for funding and governmental support. Participants and Work Package Leaders have expressed support for a future network that will improve national and international collaboration in HTA based on the experience from the EUnetHTA project.

Device and Container for Reheating and Sterilization

NASA Technical Reports Server (NTRS)

Sastry, Sudhir K.; Heskitt, Brian F.; Jun, Soojin; Marcy, Joseph E.; Mahna, Ritesh

2012-01-01

Long-duration space missions require the development of improved foods and novel packages that do not represent a significant disposal issue. In addition, it would also be desirable if rapid heating technologies could be used on Earth as well, to improve food quality during a sterilization process. For this purpose, a package equipped with electrodes was developed that will enable rapid reheating of contents via ohmic heating to serving temperature during space vehicle transit. Further, the package is designed with a resealing feature, which enables the package, once used, to contain and sterilize waste, including human waste for storage prior to jettison during a long-duration mission. Ohmic heating is a technology that has been investigated on and off for over a century. Literature indicates that foods processed by ohmic heating are of superior quality to their conventionally processed counterparts. This is due to the speed and uniformity of ohmic heating, which minimizes exposure of sensitive materials to high temperatures. In principle, the material may be heated rapidly to sterilization conditions, cooled rapidly, and stored. The ohmic heating device herein is incorporated within a package. While this by itself is not novel, a reusable feature also was developed with the intent that waste may be stored and re-sterilized within the packages. These would then serve a useful function after their use in food processing and storage. The enclosure should be designed to minimize mass (and for NASA's purposes, Equivalent System Mass, or ESM), while enabling the sterilization function. It should also be electrically insulating. For this reason, Ultem high-strength, machinable electrical insulator was used.

Promoting Adaptive Behavior in Persons with Acquired Brain Injury, Extensive Motor and Communication Disabilities, and Consciousness Disorders

ERIC Educational Resources Information Center

Lancioni, Giulio E.; Singh, Nirbhay N.; O'Reilly, Mark F.; Sigafoos, Jeff; Belardinelli, Marta Olivetti; Buonocunto, Francesca; Sacco, Valentina; Navarro, Jorge; Lanzilotti, Crocifissa; De Tommaso, Marina; Megna, Marisa; Badagliacca, Francesco

2012-01-01

These two studies extended the evidence on the use of technology-based intervention packages to promote adaptive behavior in persons with acquired brain injury and multiple disabilities. Study I involved five participants in a minimally conscious state who were provided with intervention packages based on specific arrangements of optic, tilt, or…

Preliminary Evaluation of Commercial Off the Shelf (COTS) Packing Materials for Flight Medication Dispenser (FMD) Technology Development

NASA Technical Reports Server (NTRS)

Du, B.; Daniels, V.; Crady, C.; Putcha, L.

2011-01-01

This slide presentation reviews preliminary results of the program to evaluate Commercial Off the Shelf (COTS) packaging materials for pharmaceutical stability. The need for improved packaging is due to possible changes in chemical and/or physical properties of the drugs, which cause reported reduced potency and/or altered bioavailability and decreased efficacy.

Seafood Packaging

NASA Technical Reports Server (NTRS)

1996-01-01

NASA's Technology Transfer Office at Stennis Space Center worked with a New Orleans seafood packaging company to develop a container to improve the shipping longevity of seafood, primarily frozen and fresh fish, while preserving the taste. A NASA engineer developed metalized heat resistant polybags with thermal foam liners using an enhanced version of the metalized mylar commonly known as 'space blanket material,' which was produced during the Apollo era.

Coverage of genetic technologies under national health reform.

PubMed Central

Mehlman, M. J.; Botkin, J. R.; Scarrow, A.; Woodhall, A.; Kass, J.; Siebenschuh, E.

1994-01-01

This article examines the extent to which the technologies expected to emerge from genetic research are likely to be covered under Government-mandated health insurance programs such as those being proposed by advocates of national health reform. Genetic technologies are divided into three broad categories; genetic information services, including screening, testing, and counseling; experimental technologies; and gene therapy. This article concludes that coverage of these technologies under national health reform is uncertain. The basic benefits packages provided for in the major health reform plans are likely to provide partial coverage of experimental technologies; relatively broad coverage of information services; and varying coverage of gene therapies, on the basis of an evaluation of their costs, benefits, and the degree to which they raise objections on political and religious grounds. Genetic services that are not included in the basic benefits package will be available only to those who can purchase supplemental insurance or to those who can purchase the services with personal funds. The resulting multitiered system of access to genetic services raises serious questions of fairness. PMID:7977343

Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring.

PubMed

Halonen, Niina; Kilpijärvi, Joni; Sobocinski, Maciej; Datta-Chaudhuri, Timir; Hassinen, Antti; Prakash, Someshekar B; Möller, Peter; Abshire, Pamela; Kellokumpu, Sakari; Lloyd Spetz, Anita

2016-01-01

Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC) microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC) technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.

A Wireless, Passive Sensor for Quantifying Packaged Food Quality.

PubMed

Tan, Ee Lim; Ng, Wen Ni; Shao, Ranyuan; Pereles, Brandon D; Ong, Keat Ghee

2007-09-05

This paper describes the fabrication of a wireless, passive sensor based on aninductive-capacitive resonant circuit, and its application for in situ monitoring of thequality of dry, packaged food such as cereals, and fried and baked snacks. The sensor ismade of a planar inductor and capacitor printed on a paper substrate. To monitor foodquality, the sensor is embedded inside the food package by adhering it to the package'sinner wall; its response is remotely detected through a coil connected to a sensor reader. Asfood quality degrades due to increasing humidity inside the package, the paper substrateabsorbs water vapor, changing the capacitor's capacitance and the sensor's resonantfrequency. Therefore, the taste quality of the packaged food can be indirectly determined bymeasuring the change in the sensor's resonant frequency. The novelty of this sensortechnology is its wireless and passive nature, which allows in situ determination of foodquality. In addition, the simple fabrication process and inexpensive sensor material ensure alow sensor cost, thus making this technology economically viable.

Fully Roll-to-Roll Gravure Printable Wireless (13.56 MHz) Sensor-Signage Tags for Smart Packaging

NASA Astrophysics Data System (ADS)

Kang, Hwiwon; Park, Hyejin; Park, Yongsu; Jung, Minhoon; Kim, Byung Chul; Wallace, Gordon; Cho, Gyoujin

2014-06-01

Integration of sensing capabilities with an interactive signage through wireless communication is enabling the development of smart packaging wherein wireless (13.56 MHz) power transmission is used to interlock the smart packaging with a wireless (13.56 MHz) reader or a smart phone. Assembly of the necessary componentry for smart packaging on plastic or paper foils is limited by the manufacturing costs involved with Si based technologies. Here, the issue of manufacturing cost for smart packaging has been obviated by materials that allow R2R (roll-to-roll) gravure in combination with R2R coating processes to be employed. R2R gravure was used to print the wireless power transmission device, called rectenna (antenna, diode and capacitor), and humidity sensor on poly(ethylene terephtalate) (PET) films while electrochromic signage units were fabricated by R2R coating. The signage units were laminated with the R2R gravure printed rectenna and sensor to complete the prototype smart packaging.

Fully Roll-to-Roll Gravure Printable Wireless (13.56 MHz) Sensor-Signage Tags for Smart Packaging

PubMed Central

Kang, Hwiwon; Park, Hyejin; Park, Yongsu; Jung, Minhoon; Kim, Byung Chul; Wallace, Gordon; Cho, Gyoujin

2014-01-01

Integration of sensing capabilities with an interactive signage through wireless communication is enabling the development of smart packaging wherein wireless (13.56 MHz) power transmission is used to interlock the smart packaging with a wireless (13.56 MHz) reader or a smart phone. Assembly of the necessary componentry for smart packaging on plastic or paper foils is limited by the manufacturing costs involved with Si based technologies. Here, the issue of manufacturing cost for smart packaging has been obviated by materials that allow R2R (roll-to-roll) gravure in combination with R2R coating processes to be employed. R2R gravure was used to print the wireless power transmission device, called rectenna (antenna, diode and capacitor), and humidity sensor on poly(ethylene terephtalate) (PET) films while electrochromic signage units were fabricated by R2R coating. The signage units were laminated with the R2R gravure printed rectenna and sensor to complete the prototype smart packaging. PMID:24953037

Fully roll-to-roll gravure printable wireless (13.56 MHz) sensor-signage tags for smart packaging.

PubMed

Kang, Hwiwon; Park, Hyejin; Park, Yongsu; Jung, Minhoon; Kim, Byung Chul; Wallace, Gordon; Cho, Gyoujin

2014-06-23

Integration of sensing capabilities with an interactive signage through wireless communication is enabling the development of smart packaging wherein wireless (13.56 MHz) power transmission is used to interlock the smart packaging with a wireless (13.56 MHz) reader or a smart phone. Assembly of the necessary componentry for smart packaging on plastic or paper foils is limited by the manufacturing costs involved with Si based technologies. Here, the issue of manufacturing cost for smart packaging has been obviated by materials that allow R2R (roll-to-roll) gravure in combination with R2R coating processes to be employed. R2R gravure was used to print the wireless power transmission device, called rectenna (antenna, diode and capacitor), and humidity sensor on poly(ethylene terephtalate) (PET) films while electrochromic signage units were fabricated by R2R coating. The signage units were laminated with the R2R gravure printed rectenna and sensor to complete the prototype smart packaging.

Packaging of structural health monitoring components

NASA Astrophysics Data System (ADS)

Kessler, Seth S.; Spearing, S. Mark; Shi, Yong; Dunn, Christopher T.

2004-07-01

Structural Health Monitoring (SHM) technologies have the potential to realize economic benefits in a broad range of commercial and defense markets. Previous research conducted by Metis Design and MIT has demonstrated the ability of Lamb waves methods to provide reliable information regarding the presence, location and type of damage in composite specimens. The present NSF funded program was aimed to study manufacturing, packaging and interface concepts for critical SHM components. The intention is to be able to cheaply manufacture robust actuating/sensing devices, and isolate them from harsh operating environments including natural, mechanical, or electrical extremes. Currently the issues related to SHM system durability have remained undressed. During the course of this research several sets of test devices were fabricated and packaged to protect the piezoelectric component assemblies for robust operation. These assemblies were then tested in hot and wet conditions, as well as in electrically noisy environments. Future work will aim to package the other supporting components such as the battery and wireless chip, as well as integrating all of these components together for operation. SHM technology will enable the reduction or complete elimination of scheduled inspections, and will allow condition-based maintenance for increased reliability and reduced overall life-cycle costs.

Active food packaging evolution: transformation from micro- to nanotechnology.

PubMed

Imran, Muhammad; Revol-Junelles, Anne-Marie; Martyn, Agnieszka; Tehrany, Elmira Arab; Jacquot, Muriel; Linder, Michel; Desobry, Stéphane

2010-10-01

Predicting which attributes consumers are willing to pay extra for has become straightforward in recent years. The demands for the prime necessity of food of natural quality, elevated safety, minimally processed, ready-to-eat, and longer shelf-life have turned out to be matters of paramount importance. The increased awareness of environmental conservation and the escalating rate of foodborne illnesses have driven the food industry to implement a more innovative solution, i.e. bioactive packaging. Owing to nanotechnology application in eco-favorable coatings and encapsulation systems, the probabilities of enhancing food quality, safety, stability, and efficiency have been augmented. In this review article, the collective results highlight the food nanotechnology potentials with special focus on its application in active packaging, novel nano- and microencapsulation techniques, regulatory issues, and socio-ethical scepticism between nano-technophiles and nano-technophobes. No one has yet indicated the comparison of data concerning food nano- versus micro-technology; therefore noteworthy results of recent investigations are interpreted in the context of bioactive packaging. The next technological revolution in the domain of food science and nutrition would be the 3-BIOS concept enabling a controlled release of active agents through bioactive, biodegradable, and bionanocomposite combined strategy.

Microsystems: from technologies to products

NASA Astrophysics Data System (ADS)

Ryser, Peter

2003-10-01

In this paper, we outline the process leading from technologies to successful products in the MEMS (Microelectromechanical Systems) and MST (Microsystems Technology) field. The development of new products involves a lot of factors, such as mature technologies, interdisciplinary team, identifying the right business potential and long term oriented investors. The paper summarizes a survey of different technologies and point out that packaging, test and calibration are still major shortcomings for the concerned industries.

Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH) program

NASA Astrophysics Data System (ADS)

Fayette, Daniel F.; Speicher, Patricia; Stoklosa, Mark J.; Evans, Jillian V.; Evans, John W.; Gentile, Mike; Pagel, Chuck A.; Hakim, Edward

1993-08-01

A joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screening criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.

Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH) program

NASA Technical Reports Server (NTRS)

Fayette, Daniel F.; Speicher, Patricia; Stoklosa, Mark J.; Evans, Jillian V.; Evans, John W.; Gentile, Mike; Pagel, Chuck A.; Hakim, Edward

1993-01-01

A joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screening criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.

Microelectronics in Japan

NASA Astrophysics Data System (ADS)

Boulton, William R.

1995-02-01

The purpose of this JTEC study is to evaluate Japan's electronic manufacturing and packaging capabilities within the context of global economic competition. To carry out this study, the JTEC panel evaluated the framework of the Japanese consumer electronics industry and various technological and organizational factors that are likely to determine who will win and lose in the marketplace. This study begins with a brief overview of the electronics industry, especially as it operates in Japan today. Succeeding chapters examine the electronics infrastructure in Japan and take an in-depth look at the central issues of product development in order to identify those parameters that will determine future directions for electronic packaging technologies.

Microelectronics in Japan

NASA Technical Reports Server (NTRS)

Boulton, William R.

1995-01-01

The purpose of this JTEC study is to evaluate Japan's electronic manufacturing and packaging capabilities within the context of global economic competition. To carry out this study, the JTEC panel evaluated the framework of the Japanese consumer electronics industry and various technological and organizational factors that are likely to determine who will win and lose in the marketplace. This study begins with a brief overview of the electronics industry, especially as it operates in Japan today. Succeeding chapters examine the electronics infrastructure in Japan and take an in-depth look at the central issues of product development in order to identify those parameters that will determine future directions for electronic packaging technologies.

Vacuum decay container/closure integrity testing technology. Part 2. Comparison to dye ingress tests.

PubMed

Wolf, Heinz; Stauffer, Tony; Chen, Shu-Chen Y; Lee, Yoojin; Forster, Ronald; Ludzinski, Miron; Kamat, Madhav; Mulhall, Brian; Guazzo, Dana Morton

2009-01-01

Part 1 of this series demonstrated that a container closure integrity test performed according to ASTM F2338-09 Standard Test Method for Nondestructive Detection of Leaks in Packages by Vacuum Decay Method using a VeriPac 325/LV vacuum decay leak tester by Packaging Technologies & Inspection, LLC (PTI) is capable of detecting leaks > or = 5.0 microm (nominal diameter) in rigid, nonporous package systems, such as prefilled glass syringes. The current study compared USP, Ph.Eur. and ISO dye ingress integrity test methods to PTI's vacuum decay technology for the detection of these same 5-, 10-, and 15-microm laser-drilled hole defects in 1-mL glass prefilled syringes. The study was performed at three test sites using several inspectors and a variety of inspection conditions. No standard dye ingress method was found to reliably identify all holed syringes. Modifications to these standard dye tests' challenge conditions increased the potential for dye ingress, and adjustments to the visual inspection environment improved dye ingress detection. However, the risk of false positive test results with dye ingress tests remained. In contrast, the nondestructive vacuum decay leak test method reliably identified syringes with holes > or = 5.0 microm.

Microfluidics on compliant substrates: recent developments in foldable and bendable devices and system packaging

NASA Astrophysics Data System (ADS)

Gray, Bonnie L.

2012-04-01

Microfluidics is revolutionizing laboratory methods and biomedical devices, offering new capabilities and instrumentation in multiple areas such as DNA analysis, proteomics, enzymatic analysis, single cell analysis, immunology, point-of-care medicine, personalized medicine, drug delivery, and environmental toxin and pathogen detection. For many applications (e.g., wearable and implantable health monitors, drug delivery devices, and prosthetics) mechanically flexible polymer devices and systems that can conform to the body offer benefits that cannot be achieved using systems based on conventional rigid substrate materials. However, difficulties in implementing active devices and reliable packaging technologies have limited the success of flexible microfluidics. Employing highly compliant materials such as PDMS that are typically employed for prototyping, we review mechanically flexible polymer microfluidic technologies based on free-standing polymer substrates and novel electronic and microfluidic interconnection schemes. Central to these new technologies are hybrid microfabrication methods employing novel nanocomposite polymer materials and devices. We review microfabrication methods using these materials, along with demonstrations of example devices and packaging schemes that employ them. We review these recent developments and place them in the context of the fields of flexible microfluidics and conformable systems, and discuss cross-over applications to conventional rigid-substrate microfluidics.

Thick resist for MEMS processing

NASA Astrophysics Data System (ADS)

Brown, Joe; Hamel, Clifford

2001-11-01

The need for technical innovation is always present in today's economy. Microfabrication methods have evolved in support of the demand for smaller and faster integrated circuits with price performance improvements always in the scope of the manufacturing design engineer. The dispersion of processing technology spans well beyond IC fabrication today with batch fabrication and wafer scale processing lending advantages to MEMES applications from biotechnology to consumer electronics from oil exploration to aerospace. Today the demand for innovative processing techniques that enable technology is apparent where only a few years ago appeared too costly or not reliable. In high volume applications where yield and cost improvements are measured in fractions of a percent it is imperative to have process technologies that produce consistent results. Only a few years ago thick resist coatings were limited to thickness less than 20 microns. Factors such as uniformity, edge bead and multiple coatings made high volume production impossible. New developments in photoresist formulation combined with advanced coating equipment techniques that closely controls process parameters have enable thick photoresist coatings of 70 microns with acceptable uniformity and edge bead in one pass. Packaging of microelectronic and micromechanical devices is often a significant cost factor and a reliability issue for high volume low cost production. Technologies such as flip- chip assembly provide a solution for cost and reliability improvements over wire bond techniques. The processing for such technology demands dimensional control and presents a significant cost savings if it were compatible with mainstream technologies. Thick photoresist layers, with good sidewall control would allow wafer-bumping technologies to penetrate the barriers to yield and production where costs for technology are the overriding issue. Single pass processing is paramount to the manufacturability of packaging technology. Uniformity and edge bead control defined the success of process implementation. Today advanced packaging solutions are created with thick photoresist coatings. The techniques and results will be presented.

Applied technology section. Monthly report, March 1994

DOE Office of Scientific and Technical Information (OSTI.GOV)

Buckner, M.R.

1994-04-20

This is a monthly report giving the details on research currently being conducted at the Savannah River Technology Center. The following are areas of the research, engineering modeling and simulation, applied statistics, applied physics,experimental thermal hydraulics,and packaging and transportation.

Active and intelligent packaging: The indication of quality and safety.

PubMed

Janjarasskul, Theeranun; Suppakul, Panuwat

2018-03-24

The food industry has been under growing pressure to feed an exponentially increasing world population and challenged to meet rigorous food safety law and regulation. The plethora of media consumption has provoked consumer demand for safe, sustainable, organic, and wholesome products with "clean" labels. The application of active and intelligent packaging has been commercially adopted by food and pharmaceutical industries as a solution for the future for extending shelf life and simplifying production processes; facilitating complex distribution logistics; reducing, if not eliminating the need for preservatives in food formulations; enabling restricted food packaging applications; providing convenience, improving quality, variety and marketing features; as well as providing essential information to ensure consumer safety. This chapter reviews innovations of active and intelligent packaging which advance packaging technology through both scavenging and releasing systems for shelf life extension, and through diagnostic and identification systems for communicating quality, tracking and brand protection.

LED lighting efficacy: Status and directions

DOE PAGES

Morgan Pattison, Paul; Hansen, Monica; Tsao, Jeffrey Y.

2017-12-28

A monumental shift from conventional lighting technologies (incandescent, fluorescent, high intensity discharge) to LED lighting is currently transpiring. The primary driver for this shift has been energy and associated cost savings. LED lighting is now more efficacious than any of the conventional lighting technologies with room to still improve. Near term, phosphor converted LED packages have the potential for efficacy improvement from 160 lm/W to 255 lm/W. Longer term, color-mixed LED packages have the potential for efficacy levels conceivably as high as 330 lm/W, though reaching these performance levels requires breakthroughs in green and amber LED efficiency. LED package efficacymore » sets the upper limit to luminaire efficacy, with the luminaire containing its own efficacy loss channels. In this paper, based on analyses performed through the U.S. Department of Energy Solid State Lighting Program, various LED and luminaire loss channels are elucidated, and critical areas for improvement identified. Beyond massive energy savings, LED technology enables a host of new applications and added value not possible or economical with previous lighting technologies. These include connected lighting, lighting tailored for human physiological responses, horticultural lighting, and ecologically conscious lighting. Finally, none of these new applications would be viable if not for the high efficacies that have been achieved, and are themselves just the beginning of what LED lighting can do.« less

Novel First-Level Interconnect Techniques for Flip Chip on MEMS Devices

PubMed Central

Sutanto, Jemmy; Anand, Sindhu; Patel, Chetan; Muthuswamy, Jit

2013-01-01

Flip-chip packaging is desirable for microelectro-mechanical systems (MEMS) devices because it reduces the overall package size and allows scaling up the number of MEMS chips through 3-D stacks. In this report, we demonstrate three novel techniques to create first-level interconnect (FLI) on MEMS: 1) Dip and attach technology for Ag epoxy; 2) Dispense technology for solder paste; 3) Dispense, pull, and attach technology (DPAT) for solder paste. The above techniques required no additional microfabrication steps, produced no visible surface contamination on the MEMS active structures, and generated high-aspect-ratio interconnects. The developed FLIs were successfully tested on MEMS moveable microelectrodes microfabricated by SUMMiTVTM process producing no apparent detrimental effect due to outgassing. The bumping processes were successfully applied on Al-deposited bond pads of 100 μm × 100 μm with an average bump height of 101.3 μm for Ag and 184.8 μm for solder (63Sn, 37Pb). DPAT for solder paste produced bumps with the aspect ratio of 1.8 or more. The average shear strengths of Ag and solder bumps were 78 MPa and 689 kPa, respectively. The electrical test on Ag bumps at 794 A/cm2 demonstrated reliable electrical interconnects with negligible resistance. These scalable FLI technologies are potentially useful for MEMS flip-chip packaging and 3-D stacking. PMID:24504168

LED lighting efficacy: Status and directions

DOE Office of Scientific and Technical Information (OSTI.GOV)

Morgan Pattison, Paul; Hansen, Monica; Tsao, Jeffrey Y.

A monumental shift from conventional lighting technologies (incandescent, fluorescent, high intensity discharge) to LED lighting is currently transpiring. The primary driver for this shift has been energy and associated cost savings. LED lighting is now more efficacious than any of the conventional lighting technologies with room to still improve. Near term, phosphor converted LED packages have the potential for efficacy improvement from 160 lm/W to 255 lm/W. Longer term, color-mixed LED packages have the potential for efficacy levels conceivably as high as 330 lm/W, though reaching these performance levels requires breakthroughs in green and amber LED efficiency. LED package efficacymore » sets the upper limit to luminaire efficacy, with the luminaire containing its own efficacy loss channels. In this paper, based on analyses performed through the U.S. Department of Energy Solid State Lighting Program, various LED and luminaire loss channels are elucidated, and critical areas for improvement identified. Beyond massive energy savings, LED technology enables a host of new applications and added value not possible or economical with previous lighting technologies. These include connected lighting, lighting tailored for human physiological responses, horticultural lighting, and ecologically conscious lighting. Finally, none of these new applications would be viable if not for the high efficacies that have been achieved, and are themselves just the beginning of what LED lighting can do.« less

Environmental databases and other computerized information tools

NASA Technical Reports Server (NTRS)

Clark-Ingram, Marceia

1995-01-01

Increasing environmental legislation has brought about the development of many new environmental databases and software application packages to aid in the quest for environmental compliance. These databases and software packages are useful tools and applicable to a wide range of environmental areas from atmospheric modeling to materials replacement technology. The great abundance of such products and services can be very overwhelming when trying to identify the tools which best meet specific needs. This paper will discuss the types of environmental databases and software packages available. This discussion will also encompass the affected environmental areas of concern, product capabilities, and hardware requirements for product utilization.

Program for transfer research and impact studies

NASA Technical Reports Server (NTRS)

Kottenstette, J. P.; Rusnak, J. J.; Staskin, E. R.

1972-01-01

The progress made in achieving TRIS research objectives during the first six months of 1972 is reviewed. The Tech Brief-Technical Support Package Program and technology transfer profiles are presented along with summaries of technology transfer in nondestructive testing, and visual display systems.

Intelligent structures technology

NASA Astrophysics Data System (ADS)

Crawley, Edward F.

1991-07-01

Viewgraphs on intelligent structures technology are presented. Topics covered include: embedding electronics; electrical and mechanical compatibility; integrated circuit chip packaged for embedding; embedding devices within composite structures; test of embedded circuit in G/E coupon; temperature/humidity/bias test; single-chip microcomputer control experiment; and structural shape determination.

Intelligent structures technology

NASA Technical Reports Server (NTRS)

Crawley, Edward F.

1991-01-01

Viewgraphs on intelligent structures technology are presented. Topics covered include: embedding electronics; electrical and mechanical compatibility; integrated circuit chip packaged for embedding; embedding devices within composite structures; test of embedded circuit in G/E coupon; temperature/humidity/bias test; single-chip microcomputer control experiment; and structural shape determination.

Pre-Packaged Commercial PACE Financing Solutions

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wallander, Michael

The objective of this project was to demonstrate a more streamlined method for facilitating commercial property assessed clean energy (PACE) retrofits. The Recipient aimed to prove that energy efficiency performance of simple, pre-packaged technologies (e.g., lighting and heating, ventilation and air conditioning (HVAC)) can be accurately estimated without the need for a detailed energy audit. A successful project would inspire consumer confidence in undertaking cost-effective retrofits.

Lumber and panel products consumption for packaging and shipping in the United States, perspective for the 1980`s

Treesearch

D. B. McKeever; H. E. Dickerhoof

Trends in demand for lumber and panel products in packaging and materials handling are examined both for the past and the future. Effects of recent technological developments and innovations such as molded particleboard pallets, medium-density fiberboard pallets, and plywood pallets, are analyzed. Increased use of pallets is seen as the main reason for the expected...

’Pushing a Big Rock Up a Steep Hill’: Acquisition Lessons Learned from DoD Applications Storefront

DTIC Science & Technology

2014-04-30

software patches, web applications, widgets, and mobile application packages. The envisioned application store will deliver software from a central...automated delivery of software patches, web applications, widgets, and mobile application packages. The envisioned application store will deliver... mobile technologies, hoping to enhance warfighter situational awareness and access to information. Unfortunately, the Defense Acquisition System has not

Thermoelectric Outer Planets Spacecraft (TOPS) electronic packaging and cabling development summary report

NASA Technical Reports Server (NTRS)

Dawe, R. H.; Arnett, J. C.

1974-01-01

Electronic packaging and cabling activities performed in support of the Thermoelectric Outer Planets Spacecraft (TOPS) Advanced Systems Technology (AST) project are detailed. It describes new electronic compartment, electronic assembly, and module concepts, and a new high-density, planar interconnection technique called discrete multilayer (DML). Development and qualification of high density cabling techniques, using small gage wire and microminiature connectors, are also reported.

Advanced Sensor and Packaging Technologies for Intelligent Adaptive Engine Controls (Preprint)

DTIC Science & Technology

2013-05-01

combination of micro-electromechanical systems (MEMS) sensor technology, novel ceramic materials, high - temperature electronics, and advanced harsh...with simultaneous pressure measurements up to 1,000 psi. The combination of a high - temperature , high -pressure-ratio compressor system, and adaptive...combination of micro-electromechanical systems (MEMS) sensor technology, novel ceramic materials, high temperature electronics, and advanced harsh

Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

NASA Astrophysics Data System (ADS)

Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter

2011-02-01

The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

Pilot Project Technology Business Case: Mobile Work Packages

DOE Office of Scientific and Technical Information (OSTI.GOV)

Thomas, Ken; Lawrie, Sean; Niedermuller, Josef

Performance advantages of the new pilot project technologies are widely acknowledged, but it has proven difficult for utilities to derive business cases for justifying investment in these new capabilities. Lack of a business case is often cited by utilities as a barrier to pursuing wide-scale application of digital technologies to nuclear plant work activities. The decision to move forward with funding usually hinges on demonstrating actual cost reductions that can be credited to budgets and thereby truly reduce O&M or capital costs. Technology enhancements, while enhancing work methods and making work more efficient, often fail to eliminate workload such thatmore » it changes overall staffing and material cost requirements. It is critical to demonstrate cost reductions or impacts on non-cost performance objectives in order for the business case to justify investment by nuclear operators. The Business Case Methodology (BCM) was developed in September of 2015 to frame the benefit side of II&C technologies to address the “benefit” side of the analysis—as opposed to the cost side—and how the organization evaluates discretionary projects (net present value (NPV), accounting effects of taxes, discount rates, etc.). The cost and analysis side is not particularly difficult for the organization and can usually be determined with a fair amount of precision (not withstanding implementation project cost overruns). It is in determining the “benefits” side of the analysis that utilities have more difficulty in technology projects and that is the focus of this methodology. The methodology is presented in the context of the entire process, but the tool provided is limited to determining the organizational benefits only. This report describes a the use of the BCM in building a business case for mobile work packages, which includes computer-based procedures and other automated elements of a work package. Key to those impacts will be identifying where the savings are “harvestable,” meaning they result in an actual reduction in headcount and/or cost. The report describes the specific activities conducted with a partner utility to examine the various work activities associated with mobile work packages to determine what time savings and error rate reductions are available. The report summarizes these findings in the form of a business case for the technology.« less

Effect of Nisin's Controlled Release on Microbial Growth as Modeled for Micrococcus luteus.

PubMed

Balasubramanian, Aishwarya; Lee, Dong Sun; Chikindas, Michael L; Yam, Kit L

2011-06-01

The need for safe food products has motivated food scientists and industry to find novel technologies for antimicrobial delivery for improving food safety and quality. Controlled release packaging is a novel technology that uses the package to deliver antimicrobials in a controlled manner and sustain antimicrobial stress on the targeted microorganism over the required shelf life. This work studied the effect of controlled release of nisin to inhibit growth of Micrococcus luteus (a model microorganism) using a computerized syringe pump system to mimic the release of nisin from packaging films which was characterized by an initially fast rate and a slower rate as time progressed. The results show that controlled release of nisin was strikingly more effective than instantly added ("formulated") nisin. While instant addition experiments achieved microbial inhibition only at the beginning, controlled release experiments achieved complete microbial inhibition for a longer time, even when as little as 15% of the amount of nisin was used as compared to instant addition.

edgeR: a Bioconductor package for differential expression analysis of digital gene expression data.

PubMed

Robinson, Mark D; McCarthy, Davis J; Smyth, Gordon K

2010-01-01

It is expected that emerging digital gene expression (DGE) technologies will overtake microarray technologies in the near future for many functional genomics applications. One of the fundamental data analysis tasks, especially for gene expression studies, involves determining whether there is evidence that counts for a transcript or exon are significantly different across experimental conditions. edgeR is a Bioconductor software package for examining differential expression of replicated count data. An overdispersed Poisson model is used to account for both biological and technical variability. Empirical Bayes methods are used to moderate the degree of overdispersion across transcripts, improving the reliability of inference. The methodology can be used even with the most minimal levels of replication, provided at least one phenotype or experimental condition is replicated. The software may have other applications beyond sequencing data, such as proteome peptide count data. The package is freely available under the LGPL licence from the Bioconductor web site (http://bioconductor.org).

Thermal Analysis of the NASA Integrated Vehicle Health Monitoring Experiment Technology for X-Vehicles (NITEX)

NASA Technical Reports Server (NTRS)

Hegab, Hisham E.

2002-01-01

The purpose of this project was to perform a thermal analysis for the NASA Integrated Vehicle Health Monitoring (IVHM) Technology Experiment for X-vehicles (NITEX). This electronics package monitors vehicle sensor information in flight and downlinks vehicle health summary information via telemetry. The experiment will be tested on the X-34 in an unpressurized compartment, in the vicinity of one of the vehicle's liquid oxygen tanks. The transient temperature profile for the electronics package has been determined using finite element analysis for possible mission profiles that will most likely expose the package to the most extreme hot and cold environmental conditions. From the analyses, it was determined that temperature limits for the electronics would be exceeded for the worst case cold environment mission profile. The finite element model used for the analyses was modified to examine the use of insulation to address this problem. Recommendations for insulating the experiment for the cold environment are presented, and were analyzed to determine their effect on a nominal mission profile.

Thermal Analysis Of The NASA Integrated Vehicle Health Monitoring Experiment Technology For X-Vehicles (NITEX)

NASA Technical Reports Server (NTRS)

Hegab, Hisham E.

2001-01-01

The purpose of this project was to perform a thermal analysis for the NASA Integrated Vehicle Health Monitoring (IVHM) Technology Experiment for X-vehicles (NITEX). This electronics package monitors vehicle sensor information in flight and downlinks vehicle health summary information via telemetry. The experiment will be tested on the X-34 in an unpressurized compartment, in the vicinity of one of the vehicle's liquid oxygen tanks. The transient temperature profile for the electronics package has been determined using finite element analysis for possible mission profiles that will most likely expose the package to the most extreme hot and cold environmental conditions. From the analyses, it was determined that temperature limits for the electronics would be exceeded for the worst case cold environment mission profile. The finite element model used for the analyses was modified to examine the use of insulation to address this problem. Recommendations for insulating the experiment for the cold environment are presented, and were analyzed to determine their effect on a nominal mission profile.

A review of laser electrode processing for development and manufacturing of lithium-ion batteries

NASA Astrophysics Data System (ADS)

Pfleging, Wilhelm

2018-02-01

Laser processes for cutting, annealing, structuring, and printing of battery materials have a great potential in order to minimize the fabrication costs and to increase the electrochemical performance and operational lifetime of lithium-ion cells. Hereby, a broad range of applications can be covered such as micro-batteries, mobile applications, electric vehicles, and stand-alone electric energy storage devices. Cost-efficient nanosecond (ns)-laser cutting of electrodes was one of the first laser technologies which were successfully transferred to industrial high-energy battery production. A defined thermal impact can be useful in electrode manufacturing which was demonstrated by laser annealing of thin-film electrodes for adjusting of battery active crystalline phases or by laser-based drying of composite thick-film electrodes for high-energy batteries. Ultrafast or ns-laser direct structuring or printing of electrode materials is a rather new technical approach in order to realize three-dimensional (3D) electrode architectures. Three-dimensional electrode configurations lead to a better electrochemical performance in comparison to conventional 2D one, due to an increased active surface area, reduced mechanical tensions during electrochemical cycling, and an overall reduced cell impedance. Furthermore, it was shown that for thick-film composite electrodes an increase of electrolyte wetting could be achieved by introducing 3D micro-/nano-structures. Laser structuring can turn electrodes into superwicking. This has a positive impact regarding an increased battery lifetime and a reliable battery production. Finally, laser processes can be up-scaled in order to transfer the 3D battery concept to high-energy and high-power lithium-ion cells.

K-Basins Sludge Treatment and Packaging at the Hanford Site - 13585

DOE Office of Scientific and Technical Information (OSTI.GOV)

Fogwell, Thomas W.; Honeyman, James O.; Stegen, Gary

Highly radioactive sludge resulting from the storage of degraded spent nuclear fuel has been consolidated in Engineered Containers (ECs) in the 105-K West Storage Basin located on the Hanford site near the Columbia River in Washington State. CH2M Hill Plateau Remediation Company (CHPRC) is proceeding with a project to retrieve the sludge, place it in Sludge Transport and Storage Containers (STSCs) and store those filled containers within the T Plant Canyon facility on the Hanford Site Central Plateau (Phase 1). Retrieval and transfer of the sludge material will enable removal of the 105-K West Basin and allow remediation of themore » subsurface contamination plumes under the basin. The U.S. Department of Energy (DOE) plans to treat and dispose of this K Basins sludge (Phase 2) as Remote Handled Transuranic Waste (RH TRU) at the Waste Isolation Pilot Plant (WIPP) located in New Mexico. The K Basin sludge currently contains uranium metal which reacts with water present in the stored slurry, generating hydrogen and other byproducts. The established transportation and disposal requirements require the transformation of the K Basins sludge to a chemically stable, liquid-free, packaged waste form. The Treatment and Packaging Project includes removal of the containerised sludge from T Plant, the treatment of the sludge as required, and packaging of all the sludge into a form that is certifiable for transportation to and disposal at WIPP. Completion of this scope will require construction and operation of a Sludge Treatment and Packaging Facility (STPF), which could be either a completely new facility or a modification of an existing Hanford Site facility. A Technology Evaluation and Alternatives Analysis (TEAA) for the STP Phase 2 was completed in 2011. A Request for Technology Information (RFI) had been issued in October 2009 to solicit candidate technologies for use in Phase 2. The RFI also included a preliminary definition of Phase 2 functions and requirements. Potentially applicable technologies were identified through a commercial procurement process, technical workshops, and review of the numerous previous sludge treatment technology studies. The identified technology approaches were screened using the criteria established in the Decision Plan, and focused bench top feasibility testing was conducted. Engineering evaluations of the costs, schedules, and technical maturity were developed and evaluated. Recommendations were developed based on technical evaluations. The criteria used in the evaluation process were as follows: (1) Safety, (2) Regulatory/stakeholder acceptance, (3) Technical maturity, (4) Operability and maintainability, (5) Life cycle cost and schedule, (6) Potential for beneficial integration with ongoing STP-Phase 1 activities, and (7) Integration with Site-wide RH-TRU processing/packaging, planning, schedule, and approach. The TEAA recommended Warm Water Oxidation (WWO) as the baseline treatment technology and two risk reduction enhancement options for further consideration during development of the process - size reduction and chemical oxidation (Fenton's reagent). The enhancement options would potentially allow a useful reduction in the total operating time required to process the K Basins sludge. The U.S. Department of Energy's Richland Field Office (DOE-RL) has approved this recommended technical approach. The baseline process can be broken down into the following main process steps: (1) STSC transfer from T Plant to the Sludge Treatment and Packaging Facility (STPF). (2) Retrieval of sludge from the STSCs and transfer to the Receipt and Reaction Tank (RRT). (3) Preparation for immobilization by oxidation using heated water (i.e., WWO) for those batches that require it and concentration by evaporating water at about atmospheric pressure in the RRT. (4) Immobilization by using additives to eliminate free liquids and packaging of the treated sludge into drums. (5) Inspection and handling of the filled drums prior to transfer to a separate storage and shipping facility. (6) Handling of vapor, condensate, and other waste streams generated by the process. Each of these steps is discussed in the paper, together with the current state of progress in developing the technology and requirements for continued development. A schematic of the recommended baseline WWO treatment process is given below. (authors)« less

Qualification of Engineering Camera for Long-Duration Deep Space Missions

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni; Maki, Justin N.; Pourangi, Ali M.; Lee, Steven W.

2012-01-01

Qualification and verification of advanced electronic packaging and interconnect technologies, and various other types of hardware elements for the Mars Exploration Rover s Spirit and Opportunity (MER)/Mars Science Laboratory (MSL) flight projects, has been performed to enhance the mission assurance. The qualification of hardware (engineering camera) under extreme cold temperatures has been performed with reference to various Mars-related project requirements. The flight-like packages, sensors, and subassemblies have been selected for the study to survive three times the total number of expected diurnal temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware, including all relevant manufacturing, ground operations, and mission phases. Qualification has been performed by subjecting above flight-like hardware to the environmental temperature extremes, and assessing any structural failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Engineering camera packaging designs, charge-coupled devices (CCDs), and temperature sensors were successfully qualified for MER and MSL per JPL design principles. Package failures were observed during qualification processes and the package redesigns were then made to enhance the reliability and subsequent mission assurance. These results show the technology certainly is promising for MSL, and especially for longterm extreme temperature missions to the extreme temperature conditions. The engineering camera has been completely qualified for the MSL project, with the proven ability to survive on Mars for 2010 sols, or 670 sols times three. Finally, the camera continued to be functional, even after 2010 thermal cycles.

VLED for Si wafer-level packaging

NASA Astrophysics Data System (ADS)

Chu, Chen-Fu; Chen, Chiming; Yen, Jui-Kang; Chen, Yung-Wei; Tsou, Chingfu; Chang, Chunming; Doan, Trung; Tran, Chuong Anh

2012-03-01

In this paper, we introduced the advantages of Vertical Light emitting diode (VLED) on copper alloy with Si-wafer level packaging technologies. The silicon-based packaging substrate starts with a <100> dou-ble-side polished p-type silicon wafer, then anisotropic wet etching technology is done to construct the re-flector depression and micro through-holes on the silicon substrate. The operating voltage, at a typical cur-rent of 350 milli-ampere (mA), is 3.2V. The operation voltage is less than 3.7V under higher current driving conditions of 1A. The VLED chip on Si package has excellent heat dissipation and can be operated at high currents up to 1A without efficiency degradation. The typical spatial radiation pattern emits a uniform light lambertian distribution from -65° to 65° which can be easily fit for secondary optics. The correlated color temperature (CCT) has only 5% variation for daylight and less than 2% variation for warm white, when the junction temperature is increased from 25°C to 110°C, suggesting a stable CCT during operation for general lighting application. Coupled with aspheric lens and micro lens array in a wafer level process, it has almost the same light distribution intensity for special secondary optics lighting applications. In addition, the ul-tra-violet (UV) VLED, featuring a silicon substrate and hard glass cover, manufactured by wafer level pack-aging emits high power UV wavelengths appropriate for curing, currency, document verification, tanning, medical, and sterilization applications.

Flexible Chip Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain.

PubMed

Jackson, Nathan; Muthuswamy, Jit

2009-04-01

We report here a novel approach called MEMS microflex interconnect (MMFI) technology for packaging a new generation of Bio-MEMS devices that involve movable microelectrodes implanted in brain tissue. MMFI addresses the need for (i) operating space for movable parts and (ii) flexible interconnects for mechanical isolation. We fabricated a thin polyimide substrate with embedded bond-pads, vias, and conducting traces for the interconnect with a backside dry etch, so that the flexible substrate can act as a thin-film cap for the MEMS package. A double gold stud bump rivet bonding mechanism was used to form electrical connections to the chip and also to provide a spacing of approximately 15-20 µm for the movable parts. The MMFI approach achieved a chip scale package (CSP) that is lightweight, biocompatible, having flexible interconnects, without an underfill. Reliability tests demonstrated minimal increases of 0.35 mΩ, 0.23 mΩ and 0.15 mΩ in mean contact resistances under high humidity, thermal cycling, and thermal shock conditions respectively. High temperature tests resulted in an increase in resistance of > 90 mΩ when aluminum bond pads were used, but an increase of ~ 4.2 mΩ with gold bond pads. The mean-time-to-failure (MTTF) was estimated to be at least one year under physiological conditions. We conclude that MMFI technology is a feasible and reliable approach for packaging and interconnecting Bio-MEMS devices.

Smart Packaging Technologies and Their Application in Conventional Meat Packaging Systems

NASA Astrophysics Data System (ADS)

O'Grady, Michael N.; Kerry, Joseph P.

Preservative packaging of meat and meat products should maintain acceptable appearance, odour and flavour and should delay the onset of microbial spoilage. Typically fresh red meats are placed on trays and over-wrapped with an oxygen permeable film or alternatively, meats are stored in modified atmosphere packages (MAP) containing high levels of oxygen and carbon dioxide (80% O2:20% CO2) (Georgala & Davidson, 1970). Cooked meats are usually stored in 70% N2:30% CO2 (Smiddy, Papkovsky, & Kerry, 2002). The function of oxygen in MAP is to maintain acceptable fresh meat colour and carbon dioxide inhibits the growth of spoilage bacteria (Seideman & Durland, 1984). Nitrogen is used as an inert filler gas either to reduce the proportions of the other gases or to maintain the pack shape (Bell & Bourke, 1996).

Understanding surgery: multimedia comes to theatre.

PubMed

Dakin, S; Garner, M; Plura, M

1997-01-01

Educational technology is well established within Schools of Nursing, however there are few computer based learning packages within the clinical environment. It was felt within the Operating Services Directorate, Royal Hallamshire Hospital, that the development of a multimedia package would enhance and complement existing teaching methods. This paper describes the theory behind the choice of a multimedia presentation and its development within the operating theatres. The package, concentrating on general surgery, has been developed by two experienced theatre nurses and a graphic designer. This has resulted in a structured but flexible, fun package which is relevant to all learners within the operating theatre environment and allied healthcare fields. The feedback obtained from users within the clinical area has reinforced the project team's original feeling that multimedia is a highly appropriate resource for clinical education.

DOE-EM-45 PACKAGING OPERATIONS AND MAINTENANCE COURSE

DOE Office of Scientific and Technical Information (OSTI.GOV)

Watkins, R.; England, J.

2010-05-28

Savannah River National Laboratory - Savannah River Packaging Technology (SRNL-SRPT) delivered the inaugural offering of the Packaging Operations and Maintenance Course for DOE-EM-45's Packaging Certification Program (PCP) at the University of South Carolina Aiken on September 1 and 2, 2009. Twenty-nine students registered, attended, and completed this training. The DOE-EM-45 Packaging Certification Program (PCP) sponsored the presentation of a new training course, Packaging Maintenance and Operations, on September 1-2, 2009 at the University of South Carolina Aiken (USC-Aiken) campus in Aiken, SC. The premier offering of the course was developed and presented by the Savannah River National Laboratory, and attendedmore » by twenty-nine students across the DOE, NNSA and private industry. This training informed package users of the requirements associated with handling shipping containers at a facility (user) level and provided a basic overview of the requirements typically outlined in Safety Analysis Report for Packaging (SARP) Chapters 1, 7, and 8. The course taught packaging personnel about the regulatory nature of SARPs to help reduce associated and often costly packaging errors. Some of the topics covered were package contents, loading, unloading, storage, torque requirements, maintaining records, how to handle abnormal conditions, lessons learned, leakage testing (including demonstration), and replacement parts. The target audience for this course was facility operations personnel, facility maintenance personnel, and field quality assurance personnel who are directly involved in the handling of shipping containers. The training also aimed at writers of SARP Chapters 1, 7, and 8, package designers, and anyone else involved in radioactive material packaging and transportation safety. Student feedback and critiques of the training were very positive. SRNL will offer the course again at USC Aiken in September 2010.« less

ETV COLLABORATIVE EVALUATIONS OF MARKET-READY TECHNOLOGIES FOR ARSENIC REMOVAL IN DRINKING WATER

EPA Science Inventory

How well do some commercially marketed package treatment systems perform to reduce arsenic from drinking water supplies? The Environmental Technology Verification (ETV) Drinking Water Systems (DWS) Center is a partnership between the U.S. Environmental Protection Agency (U.S. EPA...

Evaluation of Emerging Technologies on a 1.6 L Turbocharged GDI Engine

EPA Science Inventory

Low-pressure loop exhaust gas recirculation (LPL- EGR) combined with a higher compression ratio is a technology package that has been the focus of significant research to increase engine thermal efficiency of downsized, turbocharged GDI engines. Research shows that the addition ...

Development of active, nanoparticle, antimicrobial technologies for muscle-based packaging applications.

PubMed

Morris, Michael A; Padmanabhan, Sibu C; Cruz-Romero, Malco C; Cummins, Enda; Kerry, Joseph P

2017-10-01

Fresh and processed muscle-based foods are highly perishable food products and packaging plays a crucial role in providing containment so that the full effect of preservation can be achieved through the provision of shelf-life extension. Conventional packaging materials and systems have served the industry well, however, greater demands are being placed upon industrial packaging formats owing to the movement of muscle-based products to increasingly distant markets, as well as increased customer demands for longer product shelf-life and storage capability. Consequently, conventional packaging materials and systems will have to evolve to meet these challenges. This review presents some of the new strategies that have been developed by employing novel nanotechnological concepts which have demonstrated some promise in significantly extending the shelf-life of muscle-based foods by providing commercially-applicable, antimicrobially-active, smart packaging solutions. The primary focus of this paper is applied to subject aspects, such as; material chemistries employed, forming methods utilised, interactions of the packaging functionalities including nanomaterials employed with polymer substrates and how such materials ultimately affect microbes. In order that such materials become industrially feasible, it is important that safe, stable and commercially-viable packaging materials are shown to be producible and effective in order to gain public acceptance, legislative approval and industrial adoption. Copyright © 2017. Published by Elsevier Ltd.

High-Temperature, Wirebondless, Ultracompact Wide Bandgap Power Semiconductor Modules

NASA Technical Reports Server (NTRS)

Elmes, John

2015-01-01

Silicon carbide (SiC) and other wide bandgap semiconductors offer great promise of high power rating, high operating temperature, simple thermal management, and ultrahigh power density for both space and commercial power electronic systems. However, this great potential is seriously limited by the lack of reliable high-temperature device packaging technology. This Phase II project developed an ultracompact hybrid power module packaging technology based on the use of double lead frames and direct lead frame-to-chip transient liquid phase (TLP) bonding that allows device operation up to 450 degC. The new power module will have a very small form factor with 3-5X reduction in size and weight from the prior art, and it will be capable of operating from 450 degC to -125 degC. This technology will have a profound impact on power electronics and energy conversion technologies and help to conserve energy and the environment as well as reduce the nation's dependence on fossil fuels.

Alternative technological development for RF hybridization

NASA Astrophysics Data System (ADS)

Antônio Finardi, Célio; da Fontoura Ponchet, André; Battesini Adamo, Cristina; Flacker, Alexander; Cotrin Teixeira, Ricardo; Panepucci, Roberto Ricardo

2017-03-01

The paper presents a technological solution for high frequency packaging platform evaluated up to 40 GHz. The main purpose of this development was to define an alternative hybrid technology that is more flexible and faster to prototype compared with thin film or multi chip module (MCM-D). The alternative technology also shows adequate performance for high bit rate solutions integrating optical and electronics blocks. This approach consists of a soft substrate (laminate material), plating processes (electroless Ni-P/Au, electrolytic Au) and lithography patterning. Ground coplanar waveguide was used for microwave structures with excellent ground planes connections due to easy via holes implementation. We present results of high frequency packaging of important RF blocks, such as integrated broadband bias-T, transimpedance amplifier ICs and silicon photonics optical modulators. The paper demonstrates a solution for high frequency hybridization that can be implemented with standard substrates, designed with any shape and with large numbers of metalized via holes and compatible with usual assembling techniques.

Standard Hardware Acquisition and Reliability Program's (SHARP's) efforts in incorporating fiber optic interconnects into standard electronic module (SEM) connectors

NASA Astrophysics Data System (ADS)

Riggs, William R.

1994-05-01

SHARP is a Navy wide logistics technology development effort aimed at reducing the acquisition costs, support costs, and risks of military electronic weapon systems while increasing the performance capability, reliability, maintainability, and readiness of these systems. Lower life cycle costs for electronic hardware are achieved through technology transition, standardization, and reliability enhancement to improve system affordability and availability as well as enhancing fleet modernization. Advanced technology is transferred into the fleet through hardware specifications for weapon system building blocks of standard electronic modules, standard power systems, and standard electronic systems. The product lines are all defined with respect to their size, weight, I/O, environmental performance, and operational performance. This method of defining the standard is very conducive to inserting new technologies into systems using the standard hardware. This is the approach taken thus far in inserting photonic technologies into SHARP hardware. All of the efforts have been related to module packaging; i.e. interconnects, component packaging, and module developments. Fiber optic interconnects are discussed in this paper.

The results of pre-design studies on the development of a new design of gas turbine compressor package of GPA-C-16 type

NASA Astrophysics Data System (ADS)

Smirnov, A. V.; Chobenko, V. M.; Shcherbakov, O. M.; Ushakov, S. M.; Parafiynyk, V. P.; Sereda, R. M.

2017-08-01

The article summarizes the results of analysis of data concerning the operation of turbocompressor packages at compressor stations for the natural gas transmission system of Ukraine. The basic requirements for gas turbine compressor packages used for modernization and reconstruction of compressor stations are considered. Using a 16 MW gas turbine package GPA-C-16S/76-1,44M1 as an example, the results of pre-design studies and some technical solutions that improve the energy efficiency of gas turbine compressor packages and their reliability, as well as its environmental performance are given. In particular, the article deals with the matching of performance characteristics of a centrifugal compressor (hereinafter compressor) and gas turbine drive to reduce fuel gas consumption; as well as application of energy efficient technologies, in particular, exhaust gas heat recovery units and gas-oil heat exchangers in turbocompressor packages oil system; as well as reducing emissions of carbon monoxide into the atmosphere using a catalytic exhaust system. Described technical solutions can be used for development of other types of gas turbine compressor packages.

An Assessment of the Influence of the Industry Distribution Chain on the Oxygen Levels in Commercial Modified Atmosphere Packaged Cheddar Cheese Using Non-Destructive Oxygen Sensor Technology.

PubMed

O' Callaghan, Karen A M; Papkovsky, Dmitri B; Kerry, Joseph P

2016-06-20

The establishment and control of oxygen levels in packs of oxygen-sensitive food products such as cheese is imperative in order to maintain product quality over a determined shelf life. Oxygen sensors quantify oxygen concentrations within packaging using a reversible optical measurement process, and this non-destructive nature ensures the entire supply chain can be monitored and can assist in pinpointing negative issues pertaining to product packaging. This study was carried out in a commercial cheese packaging plant and involved the insertion of 768 sensors into 384 flow-wrapped cheese packs (two sensors per pack) that were flushed with 100% carbon dioxide prior to sealing. The cheese blocks were randomly assigned to two different storage groups to assess the effects of package quality, packaging process efficiency, and handling and distribution on package containment. Results demonstrated that oxygen levels increased in both experimental groups examined over the 30-day assessment period. The group subjected to a simulated industrial distribution route and handling procedures of commercial retailed cheese exhibited the highest level of oxygen detected on every day examined and experienced the highest rate of package failure. The study concluded that fluctuating storage conditions, product movement associated with distribution activities, and the possible presence of cheese-derived contaminants such as calcium lactate crystals were chief contributors to package failure.

An Assessment of the Influence of the Industry Distribution Chain on the Oxygen Levels in Commercial Modified Atmosphere Packaged Cheddar Cheese Using Non-Destructive Oxygen Sensor Technology

PubMed Central

O’ Callaghan, Karen A.M.; Papkovsky, Dmitri B.; Kerry, Joseph P.

2016-01-01

The establishment and control of oxygen levels in packs of oxygen-sensitive food products such as cheese is imperative in order to maintain product quality over a determined shelf life. Oxygen sensors quantify oxygen concentrations within packaging using a reversible optical measurement process, and this non-destructive nature ensures the entire supply chain can be monitored and can assist in pinpointing negative issues pertaining to product packaging. This study was carried out in a commercial cheese packaging plant and involved the insertion of 768 sensors into 384 flow-wrapped cheese packs (two sensors per pack) that were flushed with 100% carbon dioxide prior to sealing. The cheese blocks were randomly assigned to two different storage groups to assess the effects of package quality, packaging process efficiency, and handling and distribution on package containment. Results demonstrated that oxygen levels increased in both experimental groups examined over the 30-day assessment period. The group subjected to a simulated industrial distribution route and handling procedures of commercial retailed cheese exhibited the highest level of oxygen detected on every day examined and experienced the highest rate of package failure. The study concluded that fluctuating storage conditions, product movement associated with distribution activities, and the possible presence of cheese-derived contaminants such as calcium lactate crystals were chief contributors to package failure. PMID:27331815

Fuel Cells and Other Emerging Manportable Power Technologies for the NATO Warfighter. Part 1: Power Sources for Manportable/Manwearable Applications (Piles a combustible et autres technologies portatives d’alimentation en energie pour les combattants de l’OTAN - Partie 1: Sources d’alimentation pour les applications transportables/portables par l’homme)

DTIC Science & Technology

2014-10-01

increases, the power source weight budget has to be traded against traditional soldier commodities such as ammunition, water and food . As the...When one considers the other commodities he is required to carry such as food , water, ammunition, etc., the weight burden will undoubtedly have a...Others have flexible outer packaging similar to that used in food processing, which are flexible. Flexible packages are emerging which enable the

Engineering three-dimensionally electrodeposited Si-on-Ni inverse opal structure for high volumetric capacity Li-ion microbattery anode.

PubMed

Liu, Hao; Cho, Hyung-Man; Meng, Ying Shirley; Li, Quan

2014-06-25

Aiming at improving the volumetric capacity of nanostructured Li-ion battery anode, an electrodeposited Si-on-Ni inverse opal structure has been proposed in the present work. This type of electrode provides three-dimensional bi-continuous pathways for ion/electron transport and high surface area-to-volume ratios, and thus exhibits lower interfacial resistance, but higher effective Li ions diffusion coefficients, when compared to the Si-on-Ni nanocable array electrode of the same active material mass. As a result, improved volumetric capacities and rate capabilities have been demonstrated in the Si-on-Ni inverse opal anode. We also show that optimization of the volumetric capacities and the rate performance of the inverse opal electrode can be realized by manipulating the pore size of the Ni scaffold and the thickness of the Si deposit.

Iron doped LiCoPO4 thin films for lithium-ion microbatteries obtained by ns pulsed laser deposition

NASA Astrophysics Data System (ADS)

Smaldone, A.; Brutti, S.; De Bonis, A.; Ciarfaglia, N.; Santagata, A.; Teghil, R.

2018-07-01

Well crystallized and homogeneous iron doped LiCoPO4 (LCfP) thin films have been grown by ns Pulsed Laser Ablation, at ambient temperature without any substrate heating or post-annealing treatments. The films have been deposited in vacuum and in the presence of buffer gases (O2, Ar) and it has been found that their crystallinity, structure and morphology depend on pressure conditions. The films have been studied by Scanning Electron Microscopy and X Ray Diffraction, while their first steps of growth have been characterized by Transmission Electron Microscopy. A study of the plasma produced by the laser ablation in the different pressure conditions has been carried out with the aim of elucidate the mechanisms involved in the films deposition. LCfP thin films have been also tested as microelectrodes in lithium cells in galvanostatic condition for analyzing the reversibility of the lithium-ion battery.

Single crystal CVD diamond membranes for betavoltaic cells

NASA Astrophysics Data System (ADS)

Delfaure, C.; Pomorski, M.; de Sanoit, J.; Bergonzo, P.; Saada, S.

2016-06-01

A single crystal diamond large area thin membrane was assembled as a p-doped/Intrinsic/Metal (PIM) structure and used in a betavoltaic configuration. When tested with a 20 keV electron beam from a high resolution scanning electron microscope, we measured an open circuit voltage (Voc) of 1.85 V, a charge collection efficiency (CCE) of 98%, a fill-factor of 80%, and a total conversion efficiency of 9.4%. These parameters are inherently linked to the diamond membrane PIM structure that allows full device depletion even at 0 V and are among the highest reported up to now for any other material tested for betavoltaic devices. It enables to drive a high short-circuit current Isc up to 7.12 μA, to reach a maximum power Pmax of 10.48 μW, a remarkable value demonstrating the high-benefit of diamond for the realization of long-life radioisotope based micro-batteries.

Atomic force microscopy studies on molybdenum disulfide flakes as sodium-ion anodes.

PubMed

Lacey, Steven D; Wan, Jiayu; von Wald Cresce, Arthur; Russell, Selena M; Dai, Jiaqi; Bao, Wenzhong; Xu, Kang; Hu, Liangbing

2015-02-11

A microscale battery comprised of mechanically exfoliated molybdenum disulfide (MoS2) flakes with copper connections and a sodium metal reference was created and investigated as an intercalation model using in situ atomic force microscopy in a dry room environment. While an ethylene carbonate-based electrolyte with a low vapor pressure allowed topographical observations in an open cell configuration, the planar microbattery was used to conduct in situ measurements to understand the structural changes and the concomitant solid electrolyte interphase (SEI) formation at the nanoscale. Topographical observations demonstrated permanent wrinkling behavior of MoS2 electrodes upon sodiation at 0.4 V. SEI formation occurred quickly on both flake edges and planes at voltages before sodium intercalation. Force spectroscopy measurements provided quantitative data on the SEI thickness for MoS2 electrodes in sodium-ion batteries for the first time.

Packaging optical sensors for the real world

NASA Astrophysics Data System (ADS)

Kachmar, Wayne; Nardone, Kenneth C.

2007-09-01

Optical fiber based sensing has now moved from laboratory demonstrations to actual applications in the real world. This has necessitated an entirely new area of extrusion - the packaging (cabling) of optical fibers and sensor arrays to protect them from the intended environment and installation handling while not masking or attenuating the phenomenon that is being sensed. Although each application presents new and unique challenges, the goal is to create a packaging concept for fiber sensors. Fiber sensing applications can be narrowed down to the five items below: 1. Conventional cable packages 2. Assembled (typically by hand) discrete sensor packages 3. Package enhanced sensors (where the packaging improves the effect of the sensor) 4. Linear sensor installation packaging 5. Scalar packaging (where the cabling adds to the range of the sensor) The above applications can be accomplished in a number of ways, and methods are still being developed in this relatively new science. Some of the new technology methods being explored include: UV cured liquids; Voided space cores; Conventional cable extrusion & its determination of mechanical characteristics. This paper reviews the pluses and minuses of the above methods and how their combination ultimately determines how the fiber or sensor array is to be jacketed in order to meet the specific application requirements. This paper will also review non-standard material characteristics, strength members and their role in measuring strain and stress values along with the overall influence of packaging on optical fibers and sensor arrays.

Nanocomposites in food packaging applications and their risk assessment for health.

PubMed

Honarvar, Zohreh; Hadian, Zahra; Mashayekh, Morteza

2016-06-01

Nanotechnology has shown many advantages in different fields. As the uses of nanotechnology have progressed, it has been found to be a promising technology for the food packaging industry in the global market. It has proven capabilities that are valuable in packaging foods, including improved barriers; mechanical, thermal, and biodegradable properties; and applications in active and intelligent food packaging. Examples of the latter are anti-microbial agents and nanosensors, respectively. However, the use of nanocomposites in food packaging might be challenging due to the reduced particle size of nanomaterials and the fact that the chemical and physical characteristics of such tiny materials may be quite different from those of their macro-scale counterparts. In order to discuss the potential risks of nanoparticles for consumers, in addition to the quantification of data, a thorough investigation of their characteristics is required. Migration studies must be conducted to determine the amounts of nanomaterials released into the food matrices. In this article, different applications of nanocomposites in food packaging, migration issues, analyzing techniques, and the main concerns about their usage are discussed briefly.

Nanocomposites in food packaging applications and their risk assessment for health

PubMed Central

Honarvar, Zohreh; Hadian, Zahra; Mashayekh, Morteza

2016-01-01

Nanotechnology has shown many advantages in different fields. As the uses of nanotechnology have progressed, it has been found to be a promising technology for the food packaging industry in the global market. It has proven capabilities that are valuable in packaging foods, including improved barriers; mechanical, thermal, and biodegradable properties; and applications in active and intelligent food packaging. Examples of the latter are anti-microbial agents and nanosensors, respectively. However, the use of nanocomposites in food packaging might be challenging due to the reduced particle size of nanomaterials and the fact that the chemical and physical characteristics of such tiny materials may be quite different from those of their macro-scale counterparts. In order to discuss the potential risks of nanoparticles for consumers, in addition to the quantification of data, a thorough investigation of their characteristics is required. Migration studies must be conducted to determine the amounts of nanomaterials released into the food matrices. In this article, different applications of nanocomposites in food packaging, migration issues, analyzing techniques, and the main concerns about their usage are discussed briefly. PMID:27504168

Thermally Stabilized Transmit/Receive Modules

NASA Technical Reports Server (NTRS)

Hoffman, James; DelCastillo, Linda; Miller, Jennifer; Birur, Gaj

2011-01-01

RF-hybrid technologies enable smaller packaging and mass reduction in radar instruments, especially for subsystems with dense electronics, such as electronically steered arrays. We are designing thermally stabilized RF-hybrid T/R modules using new materials for improved thermal performance of electronics. We are combining advanced substrate and housing materials with a thermal reservoir material, and develop new packaging techniques to significantly improve thermal-cycling reliability and performance stability over temperature.

Construction of a Chemical Sensor/Instrumentation Package Using Fiber Optic and Miniaturization Technology

NASA Technical Reports Server (NTRS)

Newton, R. L.

1999-01-01

The objective of this research was to construct a chemical sensor/instrumentation package that was smaller in weight and volume than conventional instrumentation. This reduction in weight and volume is needed to assist in further reducing the cost of launching payloads into space. To accomplish this, fiber optic sensors, miniaturized spectrometers, and wireless modems were employed. The system was evaluated using iodine as a calibration analyte.

Water-soluble nanocrystalline cellulose films with highly transparent and oxygen barrier properties.

PubMed

Cheng, Shaoling; Zhang, Yapei; Cha, Ruitao; Yang, Jinliang; Jiang, Xingyu

2016-01-14

By mixing a guar gum (GG) solution with a nanocrystalline cellulose (NCC) dispersion using a novel circular casting technology, we manufactured biodegradable films as packaging materials with improved optical and mechanical properties. These films could act as barriers for oxygen and could completely dissolve in water within 5 h. We also compared the effect of nanocomposite films and commercial food packaging materials on the preservation of food.

Wafer-Level Vacuum Packaging of Smart Sensors.

PubMed

Hilton, Allan; Temple, Dorota S

2016-10-31

The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors-"low cost" for ubiquitous presence, and "smart" for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS) integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology.

Wafer-Level Vacuum Packaging of Smart Sensors

PubMed Central

Hilton, Allan; Temple, Dorota S.

2016-01-01

The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS) integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology. PMID:27809249

FOREWORD: Proceedings of the 39th International Microelectronics and Packaging IMAPS Poland Conference

NASA Astrophysics Data System (ADS)

Jasiński, Piotr; Górecki, Krzysztof; Bogdanowicz, Robert

2016-01-01

These proceedings are a collection of the selected articles presented at the 39th International Microelectronics and Packaging IMAPS Poland Conference, held in Gdansk, Poland on September 20-23, 2015 (IMAPS Poland 2015). The conference has been held under the scientific patronage of the International Microelectronics and Packaging Society Poland Chapter and the Committee of Electronics and Telecommunication, Polish Academy of Science and jointly hosted by the Gdansk University of Technology, Faculty of Electronics, Telecommunication and Informatics (GUT) and the Gdynia Maritime University, Faculty of Electrical Engineering (GMU). The IMAPS Poland conference series aims to advance interdisciplinary scientific information exchange and the discussion of the science and technology of advanced electronics. The IMAPS Poland 2015 conference took place in the heart of Gdansk, two minutes walking distance from the beach. The surroundings and location of the venue guaranteed excellent working and leisure conditions. The three-day conference highlighted invited talks by outstanding scientists working in important areas of electronics and electronic material science. The eight sessions covered areas in the fields of electronics packaging, interconnects on PCB, Low Temperature Co-fired Ceramic (LTCC), MEMS devices, transducers, sensors and modelling of electronic devices. The conference was attended by 99 participants from 11 countries. The conference schedule included 18 invited presentations and 78 poster presentations.

Compact electro-optical module with polymer waveguides on a flexible substrate for high-density board-level communication

NASA Astrophysics Data System (ADS)

Weiss, J. R. M.; Lamprecht, T.; Meier, N.; Dangel, R.; Horst, F.; Jubin, D.; Beyeler, R.; Offrein, B. J.

2010-02-01

We report on the co-packaging of electrical CMOS transceiver and VCSEL chip arrays on a flexible electrical substrate with optical polymer waveguides. The electro-optical components are attached to the substrate edge and butt-coupled to the waveguides. Electrically conductive silver-ink connects them to the substrate at an angle of 90°. The final assembly contacts the surface of a package laminate with an integrated compressible connector. The module can be folded to save space, requires only a small footprint on the package laminate and provides short electrical high-speed signal paths. With our approach, the electro-optical package becomes a compact electro-optical module with integrated polymer waveguides terminated with either optical connectors (e.g., at the card edge) or with an identical assembly for a second processor on the board. Consequently, no costly subassemblies and connectors are needed, and a very high integration density and scalability to virtually arbitrary channel counts and towards very high data rates (20+ Gbps) become possible. Future cost targets of much less than US$1 per Gbps will be reached by employing standard PCB materials and technologies that are well established in the industry. Moreover, our technology platform has both electrical and optical connectivity and functionality.

Chip-package nano-structured copper and nickel interconnections with metallic and polymeric bonding interfaces

NASA Astrophysics Data System (ADS)

Aggarwal, Ankur

With the semiconductor industry racing toward a historic transition, nano chips with less than 45 nm features demand I/Os in excess of 20,000 that support computing speed in terabits per second, with multi-core processors aggregately providing highest bandwidth at lowest power. On the other hand, emerging mixed signal systems are driving the need for 3D packaging with embedded active components and ultra-short interconnections. Decreasing I/O pitch together with low cost, high electrical performance and high reliability are the key technological challenges identified by the 2005 International Technology Roadmap for Semiconductors (ITRS). Being able to provide several fold increase in the chip-to-package vertical interconnect density is essential for garnering the true benefits of nanotechnology that will utilize nano-scale devices. Electrical interconnections are multi-functional materials that must also be able to withstand complex, sustained and cyclic thermo-mechanical loads. In addition, the materials must be environmentally-friendly, corrosion resistant, thermally stable over a long time, and resistant to electro-migration. A major challenge is also to develop economic processes that can be integrated into back end of the wafer foundry, i.e. with wafer level packaging. Device-to-system board interconnections are typically accomplished today with either wire bonding or solders. Both of these are incremental and run into either electrical or mechanical barriers as they are extended to higher density of interconnections. Downscaling traditional solder bump interconnect will not satisfy the thermo-mechanical reliability requirements at very fine pitches of the order of 30 microns and less. Alternate interconnection approaches such as compliant interconnects typically require lengthy connections and are therefore limited in terms of electrical properties, although expected to meet the mechanical requirements. A novel chip-package interconnection technology is developed to address the IC packaging requirements beyond the ITRS projections and to introduce innovative design and fabrication concepts that will further advance the performance of the chip, the package, and the system board. The nano-structured interconnect technology simultaneously packages all the ICs intact in wafer form with quantum jump in the number of interconnections with the lowest electrical parasitics. The intrinsic properties of nano materials also enable several orders of magnitude higher interconnect densities with the best mechanical properties for the highest reliability and yet provide higher current and heat transfer densities. Nano-structured interconnects provides the ability to assemble the packaged parts on the system board without the use of underfill materials and to enable advanced analog/digital testing, reliability testing, and burn-in at wafer level. This thesis investigates the electrical and mechanical performance of nanostructured interconnections through modeling and test vehicle fabrication. The analytical models evaluate the performance improvements over solder and compliant interconnections. Test vehicles with nano-interconnections were fabricated using low cost electro-deposition techniques and assembled with various bonding interfaces. Interconnections were fabricated at 200 micron pitch to compare with the existing solder joints and at 50 micron pitch to demonstrate fabrication processes at fine pitches. Experimental and modeling results show that the proposed nano-interconnections could enhance the reliability and potentially meet all the system performance requirements for the emerging micro/nano-systems.

A Look at Technologies Vis-a-vis Information Handling Techniques.

ERIC Educational Resources Information Center

Swanson, Rowena W.

The paper examines several ideas for information handling implemented with new technologies that suggest directions for future development. These are grouped under the topic headings: Handling Large Data Banks, Providing Personalized Information Packages, Providing Information Specialist Services, and Expanding Man-Machine Interaction. Guides in…

Performance Contracting: Taking School Technology Green

ERIC Educational Resources Information Center

Taival, Dane

2009-01-01

Energy efficiency makes fiscal and environmental sense, and so does energy savings performance contracting. Because an energy savings performance contract can create a self-funding package of products and services that reduce energy and operating costs, over time, school districts' sometimes-large initial investment in emerging technologies saves…

Arizona Industrial Arts Manufacturing Technology. Teacher's Curriculum Guide.

ERIC Educational Resources Information Center

Miller, Milton; And Others

This curriculum guide is intended to assist junior and senior high school vocational instructors in presenting a course in manufacturing technology. The package contains a competency/skill and task list, an instructor's guide, and a bibliography. The following competencies are covered: the historical development of manufacturing (the…

Technology Trends: Buying a Computer.

ERIC Educational Resources Information Center

Strot, Melody; Benno, Mark

1997-01-01

Provides guidelines for buying computers for parents of gifted children. Steps for making decisions include deciding who will use the computer, deciding its purposes and what software packages will be used, determining current and future needs, setting a budget, and reviewing needs with salespersons and school-based technology specialists. (CR)

Next Generation Lighting Technologies (LBNL Summer Lecture Series)

ScienceCinema

Siminovittch, Micheal

2018-04-27

For the past several years, Michael Siminovittch, a researcher in the Environmental Energy Technologies Division of Lawrence Berkeley National Laboratory, has worked to package efficient lighting in an easy-to-use and good-looking lamp. His immensely popular "Berkeley Lamp" has redefined how America lights its offices.

WEB - A Wireless Experiment Box for the Dextre Pointing Package ELC Payload

NASA Technical Reports Server (NTRS)

Bleier, Leor Z.; Marrero-Fontanez, Victor J.; Sparacino, Pietro A.; Moreau, Michael C.; Mitchell, Jason William

2012-01-01

The Wireless Experiment Box (WEB) was proposed to work with the International Space Station (ISS) External Wireless Communication (EWC) system to support high-definition video from the Dextre Pointing Package (DPP). DPP/WEB was a NASA GSFC proposed ExPRESS Logistics Carrier (ELC) payload designed to flight test an integrated suite of Autonomous Rendezvous and Docking (AR&D) technologies to enable a wide spectrum of future missions across NASA and other US Government agencies. The ISS EWC uses COTS Wireless Access Points (WAPs) to provide high-rate bi-directional communications to ISS. In this paper, we discuss WEB s packaging, operation, antenna development, and performance testing.

Web: A Wireless Experiment Box for the Dextre Pointing Package ELC Payload

NASA Technical Reports Server (NTRS)

Bleier, Leor Z.; Marrero-Fontanez, Victor J.; Sparacino, Pietro A.; Moreau, Michael C.; Mitchell, Jason W.

2012-01-01

The Wireless Experiment Box (WEB) was proposed to work with the International Space Station (ISS) External Wireless Communication (EWC) system to support high-definition video from the Dextre Pointing Package (DPP). DPP/WEB was a NASA GSFC proposed ExPRESS Logistics Carrier (ELC) payload designed to flight test an integrated suite of Autonomous Rendezvous and Docking (AR&D) technologies to enable a wide spectrum of future missions across NASA and other US Government agencies. The ISS EWC uses COTS Wireless Access Points (WAPs) to provide high-rate bi-directional communications to ISS. In this paper, we discuss WEB s packaging, operation, antenna development, and performance testing.

1998 IEEE Aerospace Conference. Proceedings.

NASA Astrophysics Data System (ADS)

The following topics were covered: science frontiers and aerospace; flight systems technologies; spacecraft attitude determination and control; space power systems; smart structures and dynamics; military avionics; electronic packaging; MEMS; hyperspectral remote sensing for GVP; space laser technology; pointing, control, tracking and stabilization technologies; payload support technologies; protection technologies; 21st century space mission management and design; aircraft flight testing; aerospace test and evaluation; small satellites and enabling technologies; systems design optimisation; advanced launch vehicles; GPS applications and technologies; antennas and radar; software and systems engineering; scalable systems; communications; target tracking applications; remote sensing; advanced sensors; and optoelectronics.

Speech Output Technologies in Interventions for Individuals with Autism Spectrum Disorders: A Scoping Review.

PubMed

Schlosser, Ralf W; Koul, Rajinder K

2015-01-01

The purpose of this scoping review was to (a) map the research evidence on the effectiveness of augmentative and alternative communication (AAC) interventions using speech output technologies (e.g., speech-generating devices, mobile technologies with AAC-specific applications, talking word processors) for individuals with autism spectrum disorders, (b) identify gaps in the existing literature, and (c) posit directions for future research. Outcomes related to speech, language, and communication were considered. A total of 48 studies (47 single case experimental designs and 1 randomized control trial) involving 187 individuals were included. Results were reviewed in terms of three study groupings: (a) studies that evaluated the effectiveness of treatment packages involving speech output, (b) studies comparing one treatment package with speech output to other AAC modalities, and (c) studies comparing the presence with the absence of speech output. The state of the evidence base is discussed and several directions for future research are posited.

Getting small: new 10μm pixel pitch cooled infrared products

NASA Astrophysics Data System (ADS)

Reibel, Y.; Pere-Laperne, N.; Augey, T.; Rubaldo, L.; Decaens, G.; Bourqui, M.-L.; Manissadjian, A.; Billon-Lanfrey, D.; Bisotto, S.; Gravrand, O.; Destefanis, G.; Druart, G.; Guerineau, N.

2014-06-01

Recent advances in miniaturization of IR imaging technology have led to a burgeoning market for mini thermalimaging sensors. Seen in this context our development on smaller pixel pitch has opened the door to very compact products. When this competitive advantage is mixed with smaller coolers, thanks to HOT technology, we achieve valuable reductions in size, weight and power of the overall package. In the same time, we are moving towards a global offer based on digital interfaces that provides our customers lower power consumption and simplification on the IR system design process while freeing up more space. Additionally, we are also investigating new wafer level camera solution taking advantage of the progress in micro-optics. This paper discusses recent developments on hot and small pixel pitch technologies as well as efforts made on compact packaging solution developed by SOFRADIR in collaboration with CEA-LETI and ONERA.

Ethylene vinyl alcohol: a review of barrier properties for packaging shelf stable foods.

PubMed

Mokwena, K Khanah; Tang, Juming

2012-01-01

Ethylene vinyl alcohol (EVOH) is one of the best known flexible thermoplastic oxygen barrier materials in use today. It is especially important for refrigerated and shelf-stable foods where oxygen deteriorates the quality of packaged products and reduces their shelf life. EVOH accounts for a majority of thermoplastic barrier materials used for rigid or semi-rigid retortable food containers. However. it is of limited use in flexible packages or lid films for rigid trays used for packaging thermally processed shelf-stable low acid foods due to its moisture sensitivity. Nevertheless, current use of other oxygen barrier materials such as polyvinylidene chloride and aluminum foil creates environmental concerns. Innovations in food processing technologies provide opportunities for increased use of EVOH in food packaging. The aim of this review is to give an overview of research on the oxygen barrier properties of EVOH from the perspective of structure-barrier property relationships and the consequences of food processing conditions.

Energy use and life cycle greenhouse gas emissions of drones for commercial package delivery

DOE PAGES

Stolaroff, Joshuah K.; Samaras, Constantine; O'Neill, Emma R.; ...

2018-02-13

Here, the use of automated, unmanned aerial vehicles (drones) to deliver commercial packages is poised to become a new industry, significantly shifting energy use in the freight sector. Here we find the current practical range of multi-copters to be about 4 km with current battery technology, requiring a new network of urban warehouses or waystations as support. We show that, although drones consume less energy per package-km than delivery trucks, the additional warehouse energy required and the longer distances traveled by drones per package greatly increase the life-cycle impacts. Still, in most cases examined, the impacts of package delivery bymore » small drone are lower than ground-based delivery. Results suggest that, if carefully deployed, drone-based delivery could reduce greenhouse gas emissions and energy use in the freight sector. To realize the environmental benefits of drone delivery, regulators and firms should focus on minimizing extra warehousing and limiting the size of drones.« less

Energy use and life cycle greenhouse gas emissions of drones for commercial package delivery

DOE Office of Scientific and Technical Information (OSTI.GOV)

Stolaroff, Joshuah K.; Samaras, Constantine; O'Neill, Emma R.

Here, the use of automated, unmanned aerial vehicles (drones) to deliver commercial packages is poised to become a new industry, significantly shifting energy use in the freight sector. Here we find the current practical range of multi-copters to be about 4 km with current battery technology, requiring a new network of urban warehouses or waystations as support. We show that, although drones consume less energy per package-km than delivery trucks, the additional warehouse energy required and the longer distances traveled by drones per package greatly increase the life-cycle impacts. Still, in most cases examined, the impacts of package delivery bymore » small drone are lower than ground-based delivery. Results suggest that, if carefully deployed, drone-based delivery could reduce greenhouse gas emissions and energy use in the freight sector. To realize the environmental benefits of drone delivery, regulators and firms should focus on minimizing extra warehousing and limiting the size of drones.« less

Fully Packaged Carbon Nanotube Supercapacitors by Direct Ink Writing on Flexible Substrates.

PubMed

Chen, Bolin; Jiang, Yizhou; Tang, Xiaohui; Pan, Yayue; Hu, Shan

2017-08-30

The ability to print fully packaged integrated energy storage components (e.g., supercapacitors) is of critical importance for practical applications of printed electronics. Due to the limited variety of printable materials, most studies on printed supercapacitors focus on printing the electrode materials but rarely the full-packaged cell. This work presents for the first time the printing of a fully packaged single-wall carbon nanotube-based supercapacitor with direct ink writing (DIW) technology. Enabled by the developed ink formula, DIW setup, and cell architecture, the whole printing process is mask free, transfer free, and alignment free with precise and repeatable control on the spatial distribution of all constituent materials. Studies on cell design show that a wider electrode pattern and narrower gap distance between electrodes lead to higher specific capacitance. The as-printed fully packaged supercapacitors have energy and power performances that are among the best in recently reported planar carbon-based supercapacitors that are only partially printed or nonprinted.

Energy use and life cycle greenhouse gas emissions of drones for commercial package delivery.

PubMed

Stolaroff, Joshuah K; Samaras, Constantine; O'Neill, Emma R; Lubers, Alia; Mitchell, Alexandra S; Ceperley, Daniel

2018-02-13

The use of automated, unmanned aerial vehicles (drones) to deliver commercial packages is poised to become a new industry, significantly shifting energy use in the freight sector. Here we find the current practical range of multi-copters to be about 4 km with current battery technology, requiring a new network of urban warehouses or waystations as support. We show that, although drones consume less energy per package-km than delivery trucks, the additional warehouse energy required and the longer distances traveled by drones per package greatly increase the life-cycle impacts. Still, in most cases examined, the impacts of package delivery by small drone are lower than ground-based delivery. Results suggest that, if carefully deployed, drone-based delivery could reduce greenhouse gas emissions and energy use in the freight sector. To realize the environmental benefits of drone delivery, regulators and firms should focus on minimizing extra warehousing and limiting the size of drones.

Project BILLET Curriculum Package. Bilingual Vocational Skill Training Program 1986-1987.

ERIC Educational Resources Information Center

Community Coll. of Rhode Island, Warwick.

This document describes a project that provided vocational skills and job-specific English-as-a-second-language (ESL) training to Spanish-speaking adults in Lincoln, Rhode Island. Project BILLET (Bilingual Learning and Employment Training) offered training in five vocational skill areas: machine technology, welding technology, geriatric nursing…

NASA Electronic Parts and Packaging (NEPP) Program - Radiation Activities

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2008-01-01

The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs.

Unmanned Ground Vehicle Communications Relays: Lessons Learned

DTIC Science & Technology

2014-04-01

technology, specifically an open-source VPN package, OpenVPN . This technology provides a wrapper around the network messages, providing a plug-and-play...performed in OpenVPN :  Set the Maximum Transmission Unit (MTU) to 1600. This is because each VPN endpoint has an MTU of 1500 (the default for Ethernet

Geometry + Technology = Proof

ERIC Educational Resources Information Center

Lyublinskaya, Irina; Funsch, Dan

2012-01-01

Several interactive geometry software packages are available today to secondary school teachers. An example is The Geometer's Sketchpad[R] (GSP), also known as Dynamic Geometry[R] software, developed by Key Curriculum Press. This numeric based technology has been widely adopted in the last twenty years, and a vast amount of creativity has been…

Overcoming the Grammar Deficit: The Role of Information Technology in Teaching German Grammar to Undergraduates.

ERIC Educational Resources Information Center

Hall, Christopher

1998-01-01

Examines how application of computer-assisted language learning (CALL) and information technology can be used to overcome "grammar deficit" seen in many British undergraduate German students. A combination of explicit, implicit, and exploratory grammar teaching approaches uses diverse resources, including word processing packages,…

OVERVIEW OF SOURCE WATER PROTECTION (SWP) AND WET-WEATHER FLOW (WWF) ENVIRONMENTAL TECHNOLOGY VERIFICATION (ETV) PILOT PROGRAMS

EPA Science Inventory

The USEPA Environmental Technology Verification (ETV) Program objectives, goals and benefits were described in detail in the presentation for the ETV Package Drinking Water Treatment System pilot earlier in this session. As mentioned in the presentation, three of the twelve piul...

Education for Educators in Medical Technology.

ERIC Educational Resources Information Center

Olson, Thomas Hans

A slide/tape self-instructional package was developed to be used to teach instructional skills in medical technology courses. Although medical technologists need to obtain these skills in order to function effectively in internship programs and employee training, they do not have the time for their inclusion in the standard curriculum. An…

Instructional Technology and Objectification

ERIC Educational Resources Information Center

Gur, Bekir S.; Wiley, David A.

2007-01-01

Objectification refers to the way in which everything (including human beings) is treated as an object, raw material, or resource to be manipulated and used. In this article, objectification refers to the way that education is often reduced to the packaging and delivery of information. A critique of objectification in instructional technology is…

Commentary: Learner-Based Listening and Technological Authenticity

ERIC Educational Resources Information Center

Robin, Richard

2007-01-01

Language teachers know that even the best technology cannot provide the high degree of interaction required to acquire meaningful proficiency in a foreign language. Even the most polished packages available today cannot evaluate learner input and provide subtle shades of context-based feedback, except in the narrowest of circumstances. In this…

Simulation Based Evaluation of Integrated Adaptive Control and Flight Planning Technologies

NASA Technical Reports Server (NTRS)

Campbell, Stefan Forrest; Kaneshige, John T.

2008-01-01

The objective of this work is to leverage NASA resources to enable effective evaluation of resilient aircraft technologies through simulation. This includes examining strengths and weaknesses of adaptive controllers, emergency flight planning algorithms, and flight envelope determination algorithms both individually and as an integrated package.

Uses of Technology in Community Colleges: A Resource Book for Community College Teachers and Administrators.

ERIC Educational Resources Information Center

Gooler, Dennis D., Ed.

This resource guide for community college teachers and administrators focuses on hardware and software. The following are discussed: (1) individual technologies--computer-assisted instruction, audio tape, films, filmstrips/slides, dial access, programmed instruction, learning activity packages, video cassettes, cable TV, independent learning labs,…

Leadless Chip Carrier Packaging and CAD/CAM-Supported Wire Wrap Interconnect Technology for Subnanosecond ECL.

DTIC Science & Technology

1981-11-01

Showing Wire . 99 Impregnanted Silicone Rubber Contacts, Chip Carrier, ard Lid 35. Technit Connector For 68-Pad JEDEC Type A Leadless . . 100 Chip Carrier...Points of Various . . . . 124 Solders 4. Composition of Alloys Employed in Dual-In-Line . . . . 128 Package Pins and Plating by Mass Spectrographic...swings, and subnanosecond gate delays and risetimes. Presently, emitter coupled logic (ECL) and current mode logic (CML), both fabricated with silicon tech

Packaging Of Control Circuits In A Robot Arm

NASA Technical Reports Server (NTRS)

Kast, William

1994-01-01

Packaging system houses and connects control circuitry mounted on circuit boards within shoulder, upper section, and lower section of seven-degree-of-freedom robot arm. Has modular design that incorporates surface-mount technology, multilayer circuit boards, large-scale integrated circuits, and multi-layer flat cables between sections for compactness. Three sections of robot arm contain circuit modules in form of stardardized circuit boards. Each module contains two printed-circuit cards, one of each face.

Whither Space Weapons: A Capability in Need of an Advocate

DTIC Science & Technology

2005-05-17

organizations may be particularly resistant. “ Disruptive technologies introduce a very different package of attributes from the one mainstream customers...and Clayton M. Christensen, “ Disruptive Technologies : Catching the Wave,” Harvard Business Review on Managing Uncertainty, (Boston, MA: Harvard...way to deter and win wars in their theater. However, if fundamentally different disruptive technologies such as space weapons are to be introduced

Ceramic ball grid array package stress analysis

NASA Astrophysics Data System (ADS)

Badri, S. H. B. S.; Aziz, M. H. A.; Ong, N. R.; Sauli, Z.; Alcain, J. B.; Retnasamy, V.

2017-09-01

The ball grid array (BGA), a form of chip scale package (CSP), was developed as one of the most advanced surface mount devices, which may be assembled by an ordinary surface ball bumps are used instead of plated nickel and gold (Ni/Au) bumps. Assembly and reliability of the BGA's printed circuit board (PCB), which is soldered by conventional surface mount technology is considered in this study. The Ceramic Ball Grid Array (CBGA) is a rectangular ceramic package or square-shaped that will use the solder ball for external electrical connections instead of leads or wire for connections. The solder balls will be arranged in an array or grid at the bottom of the ceramic package body. In this study, ANSYS software is used to investigate the stress on the package for 2 balls and 4 balls of the CBGA package with the various force range of 1-3 Newton applied to the top of the die, top of the substrate and side of the substrate. The highest maximum stress was analyzed and the maximum equivalent stress was observed on the solder ball and the die. From the simulation result, the CBGA package with less solder balls experience higher stress compared to the package with many solder balls. Therefore, less number of solder ball on the CBGA package results higher stress and critically affect the reliability of the solder balls itself, substrate and die which can lead to the solder crack and also die crack.

Development Of A Three-Dimensional Circuit Integration Technology And Computer Architecture

NASA Astrophysics Data System (ADS)

Etchells, R. D.; Grinberg, J.; Nudd, G. R.

1981-12-01

This paper is the first of a series 1,2,3 describing a range of efforts at Hughes Research Laboratories, which are collectively referred to as "Three-Dimensional Microelectronics." The technology being developed is a combination of a unique circuit fabrication/packaging technology and a novel processing architecture. The packaging technology greatly reduces the parasitic impedances associated with signal-routing in complex VLSI structures, while simultaneously allowing circuit densities orders of magnitude higher than the current state-of-the-art. When combined with the 3-D processor architecture, the resulting machine exhibits a one- to two-order of magnitude simultaneous improvement over current state-of-the-art machines in the three areas of processing speed, power consumption, and physical volume. The 3-D architecture is essentially that commonly referred to as a "cellular array", with the ultimate implementation having as many as 512 x 512 processors working in parallel. The three-dimensional nature of the assembled machine arises from the fact that the chips containing the active circuitry of the processor are stacked on top of each other. In this structure, electrical signals are passed vertically through the chips via thermomigrated aluminum feedthroughs. Signals are passed between adjacent chips by micro-interconnects. This discussion presents a broad view of the total effort, as well as a more detailed treatment of the fabrication and packaging technologies themselves. The results of performance simulations of the completed 3-D processor executing a variety of algorithms are also presented. Of particular pertinence to the interests of the focal-plane array community is the simulation of the UNICORNS nonuniformity correction algorithms as executed by the 3-D architecture.

Technology and design of an active-matrix OLED on crystalline silicon direct-view display for a wristwatch computer

NASA Astrophysics Data System (ADS)

Sanford, James L.; Schlig, Eugene S.; Prache, Olivier; Dove, Derek B.; Ali, Tariq A.; Howard, Webster E.

2002-02-01

The IBM Research Division and eMagin Corp. jointly have developed a low-power VGA direct view active matrix OLED display, fabricated on a crystalline silicon CMOS chip. The display is incorporated in IBM prototype wristwatch computers running the Linus operating system. IBM designed the silicon chip and eMagin developed the organic stack and performed the back-end-of line processing and packaging. Each pixel is driven by a constant current source controlled by a CMOS RAM cell, and the display receives its data from the processor memory bus. This paper describes the OLED technology and packaging, and outlines the design of the pixel and display electronics and the processor interface. Experimental results are presented.

Reliability and Characteristics of Wafer-Level Chip-Scale Packages under Current Stress

NASA Astrophysics Data System (ADS)

Chen, Po-Ying; Kung, Heng-Yu; Lai, Yi-Shao; Hsiung Tsai, Ming; Yeh, Wen-Kuan

2008-02-01

In this work, we present a novel approach and method for elucidating the characteristics of wafer-level chip-scale packages (WLCSPs) for electromigration (EM) tests. The die in WLCSP was directly attached to the substrate via a soldered interconnect. The shrinking of the area of the die that is available for power, and the solder bump also shrinks the volume and increases the density of electrons for interconnect efficiency. The bump current density now approaches to 106 A/cm2, at which point the EM becomes a significant reliability issue. As known, the EM failure depends on numerous factors, including the working temperature and the under bump metallization (UBM) thickness. A new interconnection geometry is adopted extensively with moderate success in overcoming larger mismatches between the displacements of components during current and temperature changes. Both environments and testing parameters for WLCSP are increasingly demanded. Although failure mechanisms are considered to have been eliminated or at least made manageable, new package technologies are again challenging its process, integrity and reliability. WLCSP technology was developed to eliminate the need for encapsulation to ensure compatibility with smart-mount technology (SMT). The package has good handing properties but is now facing serious reliability problems. In this work, we investigated the reliability of a WLCSP subjected to different accelerated current stressing conditions at a fixed ambient temperature of 125 °C. A very strong correlation exists between the mean time to failure (MTTF) of the WLCSP test vehicle and the mean current density that is carried by a solder joint. A series of current densities were applied to the WLCSP architecture; Black's power law was employed in a failure mode simulation. Additionally, scanning electron microscopy (SEM) was adopted to determine the differences existing between high- and low-current-density failure modes.

Functions of Nano-Materials in Food Packaging

NASA Astrophysics Data System (ADS)

Yap, Ray Chin Chong; Kwablah, Amegadze Paul Seyram; He, Jiating; Li, Xu

Food packaging has been changing from bulky and rigid form in the past to different variation of lights and plastic packagings. Regardless of the changes, the packaging must be able to uphold its original function which is to serve as food containment as well as to protect the food from the external environment. Coupled with the increasing consumer’s awareness on food waste, higher standard of living, technological developments are underway to enhance the shelf-life of packed food as well as methods to provide indications of food packaging environment. There are many different indicators for food spoilage, but two commonly found gases in food packaging are oxygen and carbon dioxide. Oxygen is the main mechanism for food spoilage, while carbon dioxide is often used in modified-atmosphere-packaging. There are also different methods of gas scavenging and/or sensing techniques based on different concepts in the literature. In this review, the focus will be on nano-materials, namely titanium dioxide, silica, zeolites and metal organic frameworks. This review is structured in a manner to highlight how each material can be used in both gas scavenging and/or indicators applications. The last part of the review focuses on the approach and some key considerations when integrating nano-materials into the plastic film.

iGC-an integrated analysis package of gene expression and copy number alteration.

PubMed

Lai, Yi-Pin; Wang, Liang-Bo; Wang, Wei-An; Lai, Liang-Chuan; Tsai, Mong-Hsun; Lu, Tzu-Pin; Chuang, Eric Y

2017-01-14

With the advancement in high-throughput technologies, researchers can simultaneously investigate gene expression and copy number alteration (CNA) data from individual patients at a lower cost. Traditional analysis methods analyze each type of data individually and integrate their results using Venn diagrams. Challenges arise, however, when the results are irreproducible and inconsistent across multiple platforms. To address these issues, one possible approach is to concurrently analyze both gene expression profiling and CNAs in the same individual. We have developed an open-source R/Bioconductor package (iGC). Multiple input formats are supported and users can define their own criteria for identifying differentially expressed genes driven by CNAs. The analysis of two real microarray datasets demonstrated that the CNA-driven genes identified by the iGC package showed significantly higher Pearson correlation coefficients with their gene expression levels and copy numbers than those genes located in a genomic region with CNA. Compared with the Venn diagram approach, the iGC package showed better performance. The iGC package is effective and useful for identifying CNA-driven genes. By simultaneously considering both comparative genomic and transcriptomic data, it can provide better understanding of biological and medical questions. The iGC package's source code and manual are freely available at https://www.bioconductor.org/packages/release/bioc/html/iGC.html .

From Cells to Virus Particles: Quantitative Methods to Monitor RNA Packaging

PubMed Central

Ferrer, Mireia; Henriet, Simon; Chamontin, Célia; Lainé, Sébastien; Mougel, Marylène

2016-01-01

In cells, positive strand RNA viruses, such as Retroviridae, must selectively recognize their full-length RNA genome among abundant cellular RNAs to assemble and release particles. How viruses coordinate the intracellular trafficking of both RNA and protein components to the assembly sites of infectious particles at the cell surface remains a long-standing question. The mechanisms ensuring packaging of genomic RNA are essential for viral infectivity. Since RNA packaging impacts on several essential functions of retroviral replication such as RNA dimerization, translation and recombination events, there are many studies that require the determination of RNA packaging efficiency and/or RNA packaging ability. Studies of RNA encapsidation rely upon techniques for the identification and quantification of RNA species packaged by the virus. This review focuses on the different approaches available to monitor RNA packaging: Northern blot analysis, ribonuclease protection assay and quantitative reverse transcriptase-coupled polymerase chain reaction as well as the most recent RNA imaging and sequencing technologies. Advantages, disadvantages and limitations of these approaches will be discussed in order to help the investigator to choose the most appropriate technique. Although the review was written with the prototypic simple murine leukemia virus (MLV) and complex human immunodeficiency virus type 1 (HIV-1) in mind, the techniques were described in order to benefit to a larger community. PMID:27556480

Laser Looking at Earth

NASA Technical Reports Server (NTRS)

1999-01-01

TerraPoint (TM) LLC is a company that combines the technologies developed at NASA's Goddard Space Flight Center (GSFC) and the Houston Advanced Research Center (HARC) with the concept of topographic real estate imaging. TerraPoint provides its customers with digital, topographical data generated by laser technology rather than commonly used microwave (radar) and photographic technologies. This product's technology merges Goddard's and HARC's laser ranging, global positioning systems, and mapping software into a miniaturized package that can be mounted in a light aircraft.

Development of antimicrobial films for microbiological control of packaged salad.

PubMed

Muriel-Galet, Virginia; Cerisuelo, Josep P; López-Carballo, Gracia; Lara, Marta; Gavara, Rafael; Hernández-Muñoz, Pilar

2012-07-02

The aim of the present work was to characterize the antimicrobial efficiency of films consisting of PP/EVOH structures with oregano essential oil and citral. Both substances are known for their antimicrobial activity based on their interaction with the cell membrane. The films developed were used to pack minimally processed salads, combining modified atmosphere technology to extend shelf-life and active packaging technology to reduce possible microbiological risks. The antimicrobial activity of the films against the pathogenic microorganisms Escherichia coli, Salmonella enterica and Listeria monocytogenes and natural microflora was investigated "in vitro" and also on the food itself. The effect of release of the antimicrobial agent on the sensory characteristics of the salad was also studied. The results showed that antimicrobial activity reduced spoilage flora on the salad as well as inhibited the growth of pathogens in contaminated salads. This effect was greater against Gram-negative bacteria. Sensory studies showed that the package that was most effective and most accepted by customers was the one containing 5% oregano essential oil. Copyright © 2012 Elsevier B.V. All rights reserved.

Information Technology.

ERIC Educational Resources Information Center

Marcum, Deanna; Boss, Richard

1983-01-01

Relates office automation to its application in libraries, discussing computer software packages for microcomputers performing tasks involved in word processing, accounting, statistical analysis, electronic filing cabinets, and electronic mail systems. (EJS)

Applications of nanotechnology in food packaging and food safety: barrier materials, antimicrobials and sensors.

PubMed

Duncan, Timothy V

2011-11-01

In this article, several applications of nanomaterials in food packaging and food safety are reviewed, including: polymer/clay nanocomposites as high barrier packaging materials, silver nanoparticles as potent antimicrobial agents, and nanosensors and nanomaterial-based assays for the detection of food-relevant analytes (gasses, small organic molecules and food-borne pathogens). In addition to covering the technical aspects of these topics, the current commercial status and understanding of health implications of these technologies are also discussed. These applications were chosen because they do not involve direct addition of nanoparticles to consumed foods, and thus are more likely to be marketed to the public in the short term. Published by Elsevier Inc.

Silicon-based products and solutions

NASA Astrophysics Data System (ADS)

Painchaud, Y.; Poulin, M.; Pelletier, F.; Latrasse, C.; Gagné, J.-F.; Savard, S.; Robidoux, G.; Picard, M.-.; Paquet, S.; Davidson, C.-.; Pelletier, M.; Cyr, M.; Paquet, C.; Guy, M.; Morsy-Osman, M.; Chagnon, M.; Plant, D. V.

2014-03-01

TeraXion started silicon photonics activities aiming at developing building blocks for new products and customized solutions. Passive and active devices have been developed including MMI couplers, power splitters, Bragg grating filters, high responsivity photodetectors, high speed modulators and variable optical attenuators. Packaging solutions including fiber attachment and hybrid integration using flip-chip were also developed. More specifically, a compact packaged integrated coherent receiver has been realized. Good performances were obtained as demonstrated by our system tests results showing transmission up to 4800 km with BER below hard FEC threshold. The package size is small but still limited by the electrical interface. Migrating to more compact RF interface would allow realizing the full benefit of this technology.

Advances in miniature spectrometer and sensor development

NASA Astrophysics Data System (ADS)

Malinen, Jouko; Rissanen, Anna; Saari, Heikki; Karioja, Pentti; Karppinen, Mikko; Aalto, Timo; Tukkiniemi, Kari

2014-05-01

Miniaturization and cost reduction of spectrometer and sensor technologies has great potential to open up new applications areas and business opportunities for analytical technology in hand held, mobile and on-line applications. Advances in microfabrication have resulted in high-performance MEMS and MOEMS devices for spectrometer applications. Many other enabling technologies are useful for miniature analytical solutions, such as silicon photonics, nanoimprint lithography (NIL), system-on-chip, system-on-package techniques for integration of electronics and photonics, 3D printing, powerful embedded computing platforms, networked solutions as well as advances in chemometrics modeling. This paper will summarize recent work on spectrometer and sensor miniaturization at VTT Technical Research Centre of Finland. Fabry-Perot interferometer (FPI) tunable filter technology has been developed in two technical versions: Piezoactuated FPIs have been applied in miniature hyperspectral imaging needs in light weight UAV and nanosatellite applications, chemical imaging as well as medical applications. Microfabricated MOEMS FPIs have been developed as cost-effective sensor platforms for visible, NIR and IR applications. Further examples of sensor miniaturization will be discussed, including system-on-package sensor head for mid-IR gas analyzer, roll-to-roll printed Surface Enhanced Raman Scattering (SERS) technology as well as UV imprinted waveguide sensor for formaldehyde detection.

Crush Testing at Oak Ridge National Laboratory

DOE Office of Scientific and Technical Information (OSTI.GOV)

Feldman, Matthew R

2011-01-01

The dynamic crush test is required in the certification testing of some small Type B transportation packages. International Atomic Energy Agency regulations state that the test article must be 'subjected to a dynamic crush test by positioning the specimen on the target so as to suffer maximum damage.' Oak Ridge National Laboratory (ORNL) Transportation Technologies Group performs testing of Type B transportation packages, including the crush test, at the National Transportation Research Center in Knoxville, Tennessee (United States). This paper documents ORNL's experiences performing crush tests on several different Type B packages. ORNL has crush tested five different drum-type packagemore » designs, continuing its 60 year history of RAM package testing. A total of 26 crush tests have been performed in a wide variety of package orientations and crush plate CG alignments. In all cases, the deformation of the outer drum created by the crush test was significantly greater than the deformation damage caused by the 9 m drop test. The crush test is a highly effective means for testing structural soundness of smaller nondense Type B shipping package designs. Further regulatory guidance could alleviate the need to perform the crush test in a wide range of orientations and crush plate CG alignments.« less

AlgoRun: a Docker-based packaging system for platform-agnostic implemented algorithms.

PubMed

Hosny, Abdelrahman; Vera-Licona, Paola; Laubenbacher, Reinhard; Favre, Thibauld

2016-08-01

There is a growing need in bioinformatics for easy-to-use software implementations of algorithms that are usable across platforms. At the same time, reproducibility of computational results is critical and often a challenge due to source code changes over time and dependencies. The approach introduced in this paper addresses both of these needs with AlgoRun, a dedicated packaging system for implemented algorithms, using Docker technology. Implemented algorithms, packaged with AlgoRun, can be executed through a user-friendly interface directly from a web browser or via a standardized RESTful web API to allow easy integration into more complex workflows. The packaged algorithm includes the entire software execution environment, thereby eliminating the common problem of software dependencies and the irreproducibility of computations over time. AlgoRun-packaged algorithms can be published on http://algorun.org, a centralized searchable directory to find existing AlgoRun-packaged algorithms. AlgoRun is available at http://algorun.org and the source code under GPL license is available at https://github.com/algorun laubenbacher@uchc.edu Supplementary data are available at Bioinformatics online. © The Author 2016. Published by Oxford University Press. All rights reserved. For Permissions, please e-mail: journals.permissions@oup.com.

Electronic packaging: new results in singulation by Laser Microjet

NASA Astrophysics Data System (ADS)

Wagner, Frank; Sibailly, Ochelio; Richerzhagen, Bernold

2004-07-01

Cutting electronic packages that are produced in a matrix array fashion is an important process and deals with the ready-to-use devices. Thus an increase in the singulation yield is directly correlated to an increase in benefit. Due to the usage of different substrate materials, the saws encounter big problems in terms of lifetime and constancy of cut quality in these applications. Today"s equipment manufacturers are not yet in the position to propose an adequate solution for all types of packages. Compared to classical laser cutting, the water-jet guided laser technology minimizes the heat damages in any kind of sample. This new material processing method consists in guiding a laser beam inside a hair thin, lowpressure water-jet by total internal reflection, and is applied to package singulation since two years approximately. Using a frequency doubled Nd:YAG laser guided by a water jet, an LTCC-ceramics based package is singulated according to a scribe and break process. Speeds of 2-10 mm/s are reached in the LTTC and 40 mm/s in the mold compound. The process is wear-free and provides very good edge quality of the LTCC and the mold compound as well as reliable separation of the packages.

77 FR 39353 - Wassenaar Arrangement 2011 Plenary Agreements Implementation: Commerce Control List, Definitions...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-07-02

... Controls for Conventional Arms and Dual-Use Goods and Technologies is a group of 41 like-minded states... specified and packaged as medical products, are not subject to control. ECCN 1C008 (Non-Fluorinated... technology and computer system design have made control of fault tolerance neither warranted nor feasible...

Applying Technology to Inquiry-Based Learning in Early Childhood Education

ERIC Educational Resources Information Center

Wang, Feng; Kinzie, Mable B.; McGuire, Patrick; Pan, Edward

2009-01-01

Children naturally explore and learn about their environments through inquiry, and computer technologies offer an accessible vehicle for extending the domain and range of this inquiry. Over the past decade, a growing number of interactive games and educational software packages have been implemented in early childhood education and addressed a…

How Word Processing Is Changing Our Teaching: New Technologies, New Approaches, New Challenges.

ERIC Educational Resources Information Center

Rodrigues, Dawn; Rodrigues, Raymond

1989-01-01

Presents teaching variations with a word-processing package and related tools that enable teachers to develop different computer-writing pedagogies for their distinct contexts: traditional classroom, computer lab, or some combination of both. Emphasizes that teachers who re-envision teaching with regard to available technology can create dynamic…

Evaluation of a Telehealth Training Package to Remotely Train Staff to Conduct a Preference Assessment

ERIC Educational Resources Information Center

Higgins, William J.; Luczynski, Kevin C.; Carroll, Regina A.; Fisher, Wayne W.; Mudford, Oliver C.

2017-01-01

Recent advancements in telecommunication technologies make it possible to conduct a variety of healthcare services remotely (e.g., behavioral-analytic intervention services), thereby bridging the gap between qualified providers and consumers in isolated locations. In this study, web-based telehealth technologies were used to remotely train…

Pixel Paradise

NASA Technical Reports Server (NTRS)

1998-01-01

PixelVision, Inc., has developed a series of integrated imaging engines capable of high-resolution image capture at dynamic speeds. This technology was used originally at Jet Propulsion Laboratory in a series of imaging engines for a NASA mission to Pluto. By producing this integrated package, Charge-Coupled Device (CCD) technology has been made accessible to a wide range of users.

Technological Tools in the Introductory Statistics Classroom: Effects on Student Understanding of Inferential Statistics

ERIC Educational Resources Information Center

Meletiou-Mavrotheris, Maria

2004-01-01

While technology has become an integral part of introductory statistics courses, the programs typically employed are professional packages designed primarily for data analysis rather than for learning. Findings from several studies suggest that use of such software in the introductory statistics classroom may not be very effective in helping…

Micro-fluidic interconnect

DOEpatents

Okandan, Murat [Albuquerque, NM; Galambos, Paul C [Albuquerque, NM; Benavides, Gilbert L [Los Ranchos, NM; Hetherington, Dale L [Albuquerque, NM

2006-02-28

An apparatus for simultaneously aligning and interconnecting microfluidic ports is presented. Such interconnections are required to utilize microfluidic devices fabricated in Micro-Electromechanical-Systems (MEMS) technologies, that have multiple fluidic access ports (e.g. 100 micron diameter) within a small footprint, (e.g. 3 mm.times.6 mm). Fanout of the small ports of a microfluidic device to a larger diameter (e.g. 500 microns) facilitates packaging and interconnection of the microfluidic device to printed wiring boards, electronics packages, fluidic manifolds etc.

Common Ada Missile Packages. Phase 2. (CAMP-2). Volume 2. 11th Missile Demonstration

DTIC Science & Technology

1988-11-01

report describes the work performed, Ihe results obtained, and the conclusions reached during the Common Ada Missile Packages Phase-2 (CAMP-2) contract ... contract was performed between Sep- tember 1985. and March 1988. The MDAC-STL CAMP program manager was: Dr. Daniel G. McNicholl Technology Branch...j DEC Code Management System X X Software Development Files x x Development Status Database x ! X i Smart Cade Counter X j

Reducing the Time and Expenditure: From Prototype to Production in Information Technology Application Development

DTIC Science & Technology

2004-09-01

It also combines the properties of procedures and data into one package . Objects are instances of some class or group of items that exhibit similar...Encapsulation—a means of packaging an object so that only valid operations on it are allowed • Modularity—decomposing a system into cohesive, loosely coupled...Advertise availability during special occasions ( holidays , seasons, etc…) Request for Password -Returns message that e- mail has been sent to

Passengers, Crew, Life Support, and Insurance Considerations

NASA Technical Reports Server (NTRS)

ONeil, Daniel A.; Young, Lawrence R.

1999-01-01

This section describes the key issues, barriers, opportunities, and potential trip packages related to the needs and expectations of initial space adventure travelers. A variety of ideas to overcome barriers is presented that address financial, psychological, and sociological problems expected to be encountered in establishing a general PST and tourism business. Tour package descriptions range from near-term surface training facilities to far-term lunar ones. Recommendations include requirements pertaining to human factors in design and needed technology.

Methods of fabricating applique circuits

DOEpatents

Dimos, Duane B.; Garino, Terry J.

1999-09-14

Applique circuits suitable for advanced packaging applications are introduced. These structures are particularly suited for the simple integration of large amounts (many nanoFarads) of capacitance into conventional integrated circuit and multichip packaging technology. In operation, applique circuits are bonded to the integrated circuit or other appropriate structure at the point where the capacitance is required, thereby minimizing the effects of parasitic coupling. An immediate application is to problems of noise reduction and control in modern high-frequency circuitry.

The learning of aquaponics practice in university

NASA Astrophysics Data System (ADS)

Agustina, T. W.; Rustaman, N. Y.; Riandi; Purwianingsih, W.

2018-05-01

This study aims to obtain a description of the perfomance capabilities of aquaponic technology and the assessment of product and packaging of harvest kale. The aquaponic practice used a STREAM (Science Technology Religion Art Matematics) approach. The method was explanatory sequential mixed method. The research was conducted on one class of Biology Education students in 6th semester. The sample was chosen purposively with 49 students. The study instruments are student worksheet, observation sheet, rubric performance and product assessment, interview sheet and field notes. The indicator of performance rubrics on the manufacture of aquaponic technology consisted of the product rubric, cultivation criteria and packing method of kale. The interview rubric is in the form of student constraints on the manufacture of aquaponics. Based on the results, most students have performance in designing technology that is categorized as enough up to good. Almost all students produce a very good kale harvest. Most of the students produce kale packaging products that are categorized as enough. The implications of this research are the learning of aquaponic with the STREAM approach can equip student’s performance and product capabilities.

Advanced Technology Lifecycle Analysis System (ATLAS) Technology Tool Box (TTB)

NASA Technical Reports Server (NTRS)

Doyle, Monica; ONeil, Daniel A.; Christensen, Carissa B.

2005-01-01

The Advanced Technology Lifecycle Analysis System (ATLAS) is a decision support tool designed to aid program managers and strategic planners in determining how to invest technology research and development dollars. It is an Excel-based modeling package that allows a user to build complex space architectures and evaluate the impact of various technology choices. ATLAS contains system models, cost and operations models, a campaign timeline and a centralized technology database. Technology data for all system models is drawn from a common database, the ATLAS Technology Tool Box (TTB). The TTB provides a comprehensive, architecture-independent technology database that is keyed to current and future timeframes.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Townsend, M.W.

The Monsanto Chemical Company operates a plastics and resins plant located in Addyston, Ohio. The process equipment requires routine rinsing with technical grade acetone between batches. Due to the volumes of spent acetone generated and the associated RCRA hazardous waste regulations, the plant sought to recycle and reuse the acetone to reduce the purchase cost of virgin acetone and the cost of spent acetone disposal. One of the first options explored was package unit distillation units. The cost of these units was in the $20--$30,000 range in 1989 dollars. Even though the cost of a package unit was not deemedmore » unreasonable, there were additional costs and concerns that led to elimination of this option. The unit would have required additional manpower to operate and maintain, i.e., at least a fraction of an operator and mechanic. For plant safety reasons, it was desired to operate this package unit outside the production building, thus construction of an outbuilding would have added to the expense of the project. Additionally, there were concerns of package unit reliability. During this evaluation, tractor-trailer mounted distillation units were discovered. The portable units were equipped with either thin-film evaporator technology capable of processing 240 to 480 gallons per hour, or pot still (batch) distillation technology capable of rates from 120 to 240 gallons per hour. Both units were constructed of stainless steel.« less

Compact, Engineered, 2-Micron Coherent Doppler Wind Lidar Prototype for Field and Airborne Validation: Doppler Aerosol WiNd Lidar (DAWN). Interim Review #1 (6 months)

NASA Technical Reports Server (NTRS)

Kavaya, Michael J.; Singh, Upendra N.; Koch, Grady J.; Yu, Jirong; Amzajerdian, Farzin; Trieu, Bo C.; Petros, Mulugeta

2006-01-01

A new project, selected in 2005 by NASA's Science Mission Directorate (SMD), under the Instrument Incubator Program (IIP), will be described. The 3-year effort is intended to design, fabricate, and demonstrate a packaged, rugged, compact, space-qualifiable coherent Doppler wind lidar (DWL) transceiver capable of future validation in an aircraft and/or Unmanned Aerial Vehicle (UAV). The state-of-the-art 2-micron coherent DWL breadboard at NASA/LaRC will be engineered and compactly packaged consistent with future aircraft flights. The packaged transceiver will be integrated into a coherent DWL system test bed at LaRC. Atmospheric wind measurements will be made to validate the packaged technology. This will greatly advance the coherent part of the hybrid DWL solution to the need for global tropospheric wind measurements.

Design of Control System for Flexible Packaging Bags Palletizing Production Line Based on PLC

NASA Astrophysics Data System (ADS)

Zheng, Huiping; Chen, Lin; Zhao, Xiaoming; Liu, Zhanyang

Flexible packaging bags palletizing production line is to put the bags in the required area according to particular order and size, in order to finish handling, storage, loading and unloading, transportation and other logistics work of goods. Flexible packaging bags palletizing line is composed of turning bags mechanism, shaping mechanism, indexing mechanism, marshalling mechanism, pushing bags mechanism, pressing bags mechanism, laminating mechanism, elevator, tray warehouse, tray conveyor and loaded tray conveyor. Whether the whole production line can smoothly run depends on each of the above equipment and precision control among them. In this paper the technological process and the control logic of flexible packaging bags palletizing production line is introduced. Palletizing process of the production line realized automation by means of a control system based on programmable logic controller (PLC). It has the advantages of simple structure, reliable and easy maintenance etc.

Advanced Spacesuit Portable Life Support System Packaging Concept Mock-Up Design & Development

NASA Technical Reports Server (NTRS)

O''Connell, Mary K.; Slade, Howard G.; Stinson, Richard G.

1998-01-01

A concentrated development effort was begun at NASA Johnson Space Center to create an advanced Portable Life Support System (PLSS) packaging concept. Ease of maintenance, technological flexibility, low weight, and minimal volume are targeted in the design of future micro-gravity and planetary PLSS configurations. Three main design concepts emerged from conceptual design techniques and were carried forth into detailed design, then full scale mock-up creation. "Foam", "Motherboard", and "LEGOtm" packaging design concepts are described in detail. Results of the evaluation process targeted maintenance, robustness, mass properties, and flexibility as key aspects to a new PLSS packaging configuration. The various design tools used to evolve concepts into high fidelity mock ups revealed that no single tool was all encompassing, several combinations were complimentary, the devil is in the details, and, despite efforts, many lessons were learned only after working with hardware.

Compact DFB laser modules with integrated isolator at 935 nm

NASA Astrophysics Data System (ADS)

Reggentin, M.; Thiem, H.; Tsianos, G.; Malach, M.; Hofmann, J.; Plocke, T.; Kneier, M.; Richter, L.

2018-02-01

New developments in industrial applications and applications under rough environmental conditions within the field of spectroscopy and quantum technology in the 935 nm wavelength regime demand new compact, stable and robust laser systems. Beside a stable laser source the integration of a compact optical isolator is necessary to reduce size and power consumption for the whole laser system. The integration of a suitable optical isolator suppresses back reflections from the following optical system efficiently. However, the miniaturization of the optics inside the package leads to high optical power density levels that make a more detailed analysis of the components and their laser damage threshold necessary. We present test results on compact stable DFB laser sources (butterfly style packages) with newly integrated optical isolators operating around 935 nm. The presented data includes performance and lifetime tests for the laser diodes as well as package components. Overall performance data of the packaged laser diodes will be shown as well.

Packaging Technology for SiC High Temperature Circuits Operable up to 500 Degrees Centigrade

NASA Technical Reports Server (NTRS)

Chen, Lian-Yu

2002-01-01

New high temperature low power 8-pin packages have been fabricated using commercial fabrication service. These packages are made of aluminum nitride and 96 percent alumina with Au metallization. The new design of these packages provides the chips inside with EM shielding. Wirebond geometry control has been achieved for precise mechanical tests. Au wirebond samples with 45 degree heel-angle have been tested using wireloop test module. The geometry control improves the consistency of measurement of the wireloop breaking point.Also reported on is a parametric study of the thermomechanical reliability of a Au thick-film based SiC die-attach assembly using nonlinear finite element analysis (FEA) was conducted to optimize the die-attach thermo-mechanical performance for operation at temperatures from room temperature to 500 degrees Centigrade. This parametric study centered on material selection, structure design and process control.

chimeraviz: a tool for visualizing chimeric RNA.

PubMed

Lågstad, Stian; Zhao, Sen; Hoff, Andreas M; Johannessen, Bjarne; Lingjærde, Ole Christian; Skotheim, Rolf I

2017-09-15

Advances in high-throughput RNA sequencing have enabled more efficient detection of fusion transcripts, but the technology and associated software used for fusion detection from sequencing data often yield a high false discovery rate. Good prioritization of the results is important, and this can be helped by a visualization framework that automatically integrates RNA data with known genomic features. Here we present chimeraviz , a Bioconductor package that automates the creation of chimeric RNA visualizations. The package supports input from nine different fusion-finder tools: deFuse, EricScript, InFusion, JAFFA, FusionCatcher, FusionMap, PRADA, SOAPfuse and STAR-FUSION. chimeraviz is an R package available via Bioconductor ( https://bioconductor.org/packages/release/bioc/html/chimeraviz.html ) under Artistic-2.0. Source code and support is available at GitHub ( https://github.com/stianlagstad/chimeraviz ). rolf.i.skotheim@rr-research.no. Supplementary data are available at Bioinformatics online. © The Author(s) 2017. Published by Oxford University Press.

poRe: an R package for the visualization and analysis of nanopore sequencing data.

PubMed

Watson, Mick; Thomson, Marian; Risse, Judith; Talbot, Richard; Santoyo-Lopez, Javier; Gharbi, Karim; Blaxter, Mark

2015-01-01

The Oxford Nanopore MinION device represents a unique sequencing technology. As a mobile sequencing device powered by the USB port of a laptop, the MinION has huge potential applications. To enable these applications, the bioinformatics community will need to design and build a suite of tools specifically for MinION data. Here we present poRe, a package for R that enables users to manipulate, organize, summarize and visualize MinION nanopore sequencing data. As a package for R, poRe has been tested on Windows, Linux and MacOSX. Crucially, the Windows version allows users to analyse MinION data on the Windows laptop attached to the device. poRe is released as a package for R at http://sourceforge.net/projects/rpore/. A tutorial and further information are available at https://sourceforge.net/p/rpore/wiki/Home/. © The Author 2014. Published by Oxford University Press.

DDR Memories

NASA Technical Reports Server (NTRS)

Wyrwas, Edward J.

2017-01-01

This presentation will include information about Double Data Rate (DDR) technology, NASA Electronic Parts and Packaging (NEPP) tasks and their purpose, collaborations, a roadmap, NEPP partners, results to date, and future plans.

Systems Engineering Programmatic Estimation Using Technology Variance

NASA Technical Reports Server (NTRS)

Mog, Robert A.

2000-01-01

Unique and innovative system programmatic estimation is conducted using the variance of the packaged technologies. Covariance analysis is performed on the subsystems and components comprising the system of interest. Technological "return" and "variation" parameters are estimated. These parameters are combined with the model error to arrive at a measure of system development stability. The resulting estimates provide valuable information concerning the potential cost growth of the system under development.

Are Current SEE Test Procedures Adequate for Modern Devices and Electronics Technologies?

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Cohn, Lewis M.; Ladbury, Ray

2008-01-01

Believe it or not, this has been a simplistic look at starting a checklist for SEE testing. Given a memory that has 68 operating modes, when a SEU occurs that changes the mode, just how do you determine what's going on? Laser and microbeam tests can help, but not easily for modern packaged devices. Expanding this approach to other more complex devices such as ADCs or processors as well as analog devices should be considered. The recommendation is to use the existing text standards as the starting point. Just make your own checklist for the device/technology/issues being considered. At HEART 2007, we presented some of the burgeoning challenges associated with single event effect(SEE) testing of modern commercial memories: a) Package, device complexity, test fixture, and data analysis issues were discussed; b) "Complete" SEE Characterization would take 15 years; c) Qualification test costs have a greater than 4 times increase over the last decade. In this talk, we continue to explore the roles of technology with an emphasis on the existing SEE Test Procedures and some of the concerns related to modern devices. The primary objective of the briefing is to provide some overarching guidance concerning the many considerations involved in the formulation of a SEE test plan provided in a " Checklist" format.we note that there is no such thing as a complete check list and that the best approach is to develop a flexible test plan that takes into account the device type and functions, the device technology, circuit and package design, and, of course, test facility and beam characteristics.

Feedstock recycling program gets go ahead

DOE Office of Scientific and Technical Information (OSTI.GOV)

Layman, P.

1994-03-28

Feedstock recycling--recycling mixed plastics wastes back into chemical feedstocks such as olefins and naphtha--has received a commercial go ahead in Germany. DKR--Deutsche Kunstsoff recycling, a subsidiary of a commercial company, Duales System Deutschland, responsible for recycling packaging wastes in Germany--has issued three contracts to companies with feedstock recycling technology to convert to liquid feedstocks a total of some 500,000 metric tons per year of mixed plastics packaging wastes by 1996. DKR has also pledged to discontinue exports of used plastics packaging to foreign countries by that date. The three contracts go to a consortium between BASF and OTTO Kunststoff service,more » of Dossenheim; the oil and chemical producer Veba; and the electric power utilities company RWE. DKR's current processing costs are about $1,765 per ton of wastes. That total includes all costs for collecting, sorting, cleaning, and transporting the wastes. In its bid, the BASF-OTTO consortium envisioned a fee of about $190 per ton. That fee, says Niess, was determined by looking at BASF's and OTTO's costs, offset by the savings in raw materials BASF would be making as its technology converts mixed plastics wastes to a mixture of naphtha, aromatics, and oils, all of which can be used in BASF's processes in Ludwigshafen. And because BASF's technology requires no presorting or cleaning before it gets the wastes, the process will trim DKR's costs significantly.« less

Long-Haul Truck Sleeper Heating Load Reduction Package for Rest Period Idling

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lustbader, Jason Aaron; Kekelia, Bidzina; Tomerlin, Jeff

Annual fuel use for sleeper cab truck rest period idling is estimated at 667 million gallons in the United States, or 6.8% of long-haul truck fuel use. Truck idling during a rest period represents zero freight efficiency and is largely done to supply accessory power for climate conditioning of the cab. The National Renewable Energy Laboratory's CoolCab project aims to reduce heating, ventilating, and air conditioning (HVAC) loads and resulting fuel use from rest period idling by working closely with industry to design efficient long-haul truck thermal management systems while maintaining occupant comfort. Enhancing the thermal performance of cab/sleepers willmore » enable smaller, lighter, and more cost-effective idle reduction solutions. In addition, if the fuel savings provide a one- to three-year payback period, fleet owners will be economically motivated to incorporate them. For candidate idle reduction technologies to be implemented by original equipment manufacturers and fleets, their effectiveness must be quantified. To address this need, several promising candidate technologies were evaluated through experimentation and modeling to determine their effectiveness in reducing rest period HVAC loads. Load reduction strategies were grouped into the focus areas of solar envelope, occupant environment, conductive pathways, and efficient equipment. Technologies in each of these focus areas were investigated in collaboration with industry partners. The most promising of these technologies were then combined with the goal of exceeding a 30% reduction in HVAC loads. These technologies included 'ultra-white' paint, advanced insulation, and advanced curtain design. Previous testing showed more than a 35.7% reduction in air conditioning loads. This paper describes the overall heat transfer coefficient testing of this advanced load reduction technology package that showed more than a 43% reduction in heating load. Adding an additional layer of advanced insulation with a reflective barrier to the thermal load reduction package resulted in a 53.3% reduction in the overall heat transfer coefficient.« less

Long-Haul Truck Sleeper Heating Load Reduction Package for Rest Period Idling: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lustbader, Jason; Kekelia, Bidzina; Tomerlin, Jeff

Annual fuel use for sleeper cab truck rest period idling is estimated at 667 million gallons in the United States, or 6.8% of long-haul truck fuel use. Truck idling during a rest period represents zero freight efficiency and is largely done to supply accessory power for climate conditioning of the cab. The National Renewable Energy Laboratory's CoolCab project aims to reduce heating, ventilating, and air conditioning (HVAC) loads and resulting fuel use from rest period idling by working closely with industry to design efficient long-haul truck thermal management systems while maintaining occupant comfort. Enhancing the thermal performance of cab/sleepers willmore » enable smaller, lighter, and more cost-effective idle reduction solutions. In addition, if the fuel savings provide a one- to three-year payback period, fleet owners will be economically motivated to incorporate them. For candidate idle reduction technologies to be implemented by original equipment manufacturers and fleets, their effectiveness must be quantified. To address this need, several promising candidate technologies were evaluated through experimentation and modeling to determine their effectiveness in reducing rest period HVAC loads. Load reduction strategies were grouped into the focus areas of solar envelope, occupant environment, conductive pathways, and efficient equipment. Technologies in each of these focus areas were investigated in collaboration with industry partners. The most promising of these technologies were then combined with the goal of exceeding a 30% reduction in HVAC loads. These technologies included 'ultra-white' paint, advanced insulation, and advanced curtain design. Previous testing showed more than a 35.7% reduction in air conditioning loads. This paper describes the overall heat transfer coefficient testing of this advanced load reduction technology package that showed more than a 43% reduction in heating load. Adding an additional layer of advanced insulation with a reflective barrier to the thermal load reduction package resulted in a 53.3% reduction in the overall heat transfer coefficient.« less

Non-Volatile Memory Technology Symposium 2001: Proceedings

NASA Technical Reports Server (NTRS)

Aranki, Nazeeh; Daud, Taher; Strauss, Karl

2001-01-01

This publication contains the proceedings for the Non-Volatile Memory Technology Symposium 2001 that was held on November 7-8, 2001 in San Diego, CA. The proceedings contains a a wide range of papers that cover current and new memory technologies including Flash memories, Magnetic Random Access Memories (MRAM and GMRAM), Ferro-electric RAM (FeRAM), and Chalcogenide RAM (CRAM). The papers presented in the proceedings address the use of these technologies for space applications as well as radiation effects and packaging issues.

Non-Volatile Memory Technology Symposium 2000: Proceedings

NASA Technical Reports Server (NTRS)

Aranki, Nazeeh (Editor)

2000-01-01

This publication contains the proceedings for the Non-Volatile Memory Technology Symposium 2000 that was held on November 15-16, 2000 in Arlington, Virginia. The proceedings contains a wide range of papers that cover the presentations of myriad advances in the nonvolatile memory technology during the recent past including memory cell design, simulations, radiation environment, and emerging memory technologies. The papers presented in the proceedings address the design challenges and applications and deals with newer, emerging memory technologies as well as related issues of radiation environment and die packaging.

BoolFilter: an R package for estimation and identification of partially-observed Boolean dynamical systems.

PubMed

Mcclenny, Levi D; Imani, Mahdi; Braga-Neto, Ulisses M

2017-11-25

Gene regulatory networks govern the function of key cellular processes, such as control of the cell cycle, response to stress, DNA repair mechanisms, and more. Boolean networks have been used successfully in modeling gene regulatory networks. In the Boolean network model, the transcriptional state of each gene is represented by 0 (inactive) or 1 (active), and the relationship among genes is represented by logical gates updated at discrete time points. However, the Boolean gene states are never observed directly, but only indirectly and incompletely through noisy measurements based on expression technologies such as cDNA microarrays, RNA-Seq, and cell imaging-based assays. The Partially-Observed Boolean Dynamical System (POBDS) signal model is distinct from other deterministic and stochastic Boolean network models in removing the requirement of a directly observable Boolean state vector and allowing uncertainty in the measurement process, addressing the scenario encountered in practice in transcriptomic analysis. BoolFilter is an R package that implements the POBDS model and associated algorithms for state and parameter estimation. It allows the user to estimate the Boolean states, network topology, and measurement parameters from time series of transcriptomic data using exact and approximated (particle) filters, as well as simulate the transcriptomic data for a given Boolean network model. Some of its infrastructure, such as the network interface, is the same as in the previously published R package for Boolean Networks BoolNet, which enhances compatibility and user accessibility to the new package. We introduce the R package BoolFilter for Partially-Observed Boolean Dynamical Systems (POBDS). The BoolFilter package provides a useful toolbox for the bioinformatics community, with state-of-the-art algorithms for simulation of time series transcriptomic data as well as the inverse process of system identification from data obtained with various expression technologies such as cDNA microarrays, RNA-Seq, and cell imaging-based assays.

Management of packaging waste in Poland--development agenda and accession to the EU.

PubMed

Grodzińska-Jurczak, Małgorzata; Zakowska, Hanna; Read, Adam

2004-06-01

In recent years the issue of the municipal waste in Poland has become increasingly topical, with a considerable rise in the waste generation, much of which can be attributed to a boom in product packaging (mainly plastic). The annual production of plastics packaging has been constantly increasing over the last 20 to 30 years, and now exceeds 3.7 million tons. Due to a lack of processing technologies and poorly developed selective segregation system, packaging waste is still treated as a part of the municipal solid waste (MSW) stream, most of which is landfilled. As a result of Poland's access to the European Union, previous legal regulations governing municipal waste management have been harmonized with those binding on the member countries. One of the main changes, the most revolutionary one, is to make entrepreneurs liable for environmental risks resulting from the introduction of packaging to the market, and for its recycling. In practice, all entrepreneurs are to ensure recovery, and recycling, of used packaging from products introduced to the market at the required level. In recent year, the required recycling levels were fulfilled for all types of materials but mainly by large institutions using grouped and transport packaging waste for that matter. Household packaging gathered in the selective segregation system at the municipalities was practically left alone. This paper is an attempt to describe the system and assess the first year of functioning of the new, revamped system of packaging waste management in Poland. Recommendations are made relating to those features that need to be included in packaging waste management systems in order to maximize their sustainability and harmonization with the EU legal system.

NASA, We Have a Challenge and It's Food Packaging

NASA Technical Reports Server (NTRS)

Perchonok, Michele

2014-01-01

Current Packaging: Freeze Dried Foods Packaging ? The thermoformed base is fabricated from Combitherm PAXX230 [a coextrusion of nylon/medium-density polyethylene (MDPE)/nylon/ethylene-vinyl alcohol (EVOH)/nylon/MDPE/linear low-density polyethylene (LLDPE)]. ? The lid is fabricated from Combitherm PAXX115 (a coextrusion of nylon/EVOH/nylon/LF adhesive/HV polyethylene/LLDPE) ? Natural form (Bite size) foods ? The bite-size food package is fabricated from Combitherm PAXX115, a coextrusion of nylon/EVOH/nylon/LF adhesive/HV polyethylene/LLDPE. ? Overwrap ? Packages are wrapped in a white pouch,.003-mm thick, fabricated from a laminate of polyester/polyethylene/aluminum foil/Surlyn®. This overwrap is removed before the food is prepared and heated. Requirements ? High barrier packaging - low oxygen and water vapor transmission rates ? No aluminum layer ? Mass - <145 grams per m2 ? Flexible ? Puncture resistant ? Approved for food use ? Amenable to sterilization ? Able to be heat sealed ? Preferred (not required) ? Transparent ? Retortable, microwavable, high pressure use. Small Business Innovative Research Program - 7 years ? 8 Phase I contracts ? 4 Phase II contracts ? Two workshops to bring together food packaging experts ? Three internal research tasks ? Public Outreach - average of 3 presentations/yr. for 8 years describing NASA's challenges ? Department of Defense Collaboration - Combat Feeding Program No significant improvement in food packaging capabilities after these efforts. It was unlikely that a food packaging solution could be found within the food science community ? There was a need to go outside to other industries such as pharmaceutical or electrical ? Although a positive result was preferred, a negative result would also be useful ? Two Innovation Techniques were used as a comparison ? InnoCentive - Theoretical Challenge to identify new technologies ? Yet2.com - A matchmaker between NASA and commercial packaging manufacturers

The Assurance Challenges of Advanced Packaging Technologies for Electronics

NASA Technical Reports Server (NTRS)

Sampson, Michael J.

2010-01-01

Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2013-01-01

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.

Predictive model for the Dutch post-consumer plastic packaging recycling system and implications for the circular economy.

PubMed

Brouwer, Marieke T; Thoden van Velzen, Eggo U; Augustinus, Antje; Soethoudt, Han; De Meester, Steven; Ragaert, Kim

2018-01-01

The Dutch post-consumer plastic packaging recycling network has been described in detail (both on the level of packaging types and of materials) from the household potential to the polymeric composition of the recycled milled goods. The compositional analyses of 173 different samples of post-consumer plastic packaging from different locations in the network were combined to indicatively describe the complete network with material flow analysis, data reconciliation techniques and process technological parameters. The derived potential of post-consumer plastic packages in the Netherlands in 2014 amounted to 341 Gg net (or 20.2 kg net.cap -1 .a -1 ). The complete recycling network produced 75.2 Gg milled goods, 28.1 Gg side products and 16.7 Gg process waste. Hence the net recycling chain yield for post-consumer plastic packages equalled 30%. The end-of-life fates for 35 different plastic packaging types were resolved. Additionally, the polymeric compositions of the milled goods and the recovered masses were derived with this model. These compositions were compared with experimentally determined polymeric compositions of recycled milled goods, which confirmed that the model predicts these compositions reasonably well. Also the modelled recovered masses corresponded reasonably well with those measured experimentally. The model clarified the origin of polymeric contaminants in recycled plastics, either sorting faults or packaging components, which gives directions for future improvement measures. Copyright © 2017 Elsevier Ltd. All rights reserved.

dartr: An r package to facilitate analysis of SNP data generated from reduced representation genome sequencing.

PubMed

Gruber, Bernd; Unmack, Peter J; Berry, Oliver F; Georges, Arthur

2018-05-01

Although vast technological advances have been made and genetic software packages are growing in number, it is not a trivial task to analyse SNP data. We announce a new r package, dartr, enabling the analysis of single nucleotide polymorphism data for population genomic and phylogenomic applications. dartr provides user-friendly functions for data quality control and marker selection, and permits rigorous evaluations of conformation to Hardy-Weinberg equilibrium, gametic-phase disequilibrium and neutrality. The package reports standard descriptive statistics, permits exploration of patterns in the data through principal components analysis and conducts standard F-statistics, as well as basic phylogenetic analyses, population assignment, isolation by distance and exports data to a variety of commonly used downstream applications (e.g., newhybrids, faststructure and phylogeny applications) outside of the r environment. The package serves two main purposes: first, a user-friendly approach to lower the hurdle to analyse such data-therefore, the package comes with a detailed tutorial targeted to the r beginner to allow data analysis without requiring deep knowledge of r. Second, we use a single, well-established format-genlight from the adegenet package-as input for all our functions to avoid data reformatting. By strictly using the genlight format, we hope to facilitate this format as the de facto standard of future software developments and hence reduce the format jungle of genetic data sets. The dartr package is available via the r CRAN network and GitHub. © 2017 John Wiley & Sons Ltd.

Fabrication of 3D Carbon Microelectromechanical Systems (C-MEMS).

PubMed

Pramanick, Bidhan; Martinez-Chapa, Sergio O; Madou, Marc; Hwang, Hyundoo

2017-06-17

A wide range of carbon sources are available in nature, with a variety of micro-/nanostructure configurations. Here, a novel technique to fabricate long and hollow glassy carbon microfibers derived from human hairs is introduced. The long and hollow carbon structures were made by the pyrolysis of human hair at 900 °C in a N2 atmosphere. The morphology and chemical composition of natural and pyrolyzed human hairs were investigated using scanning electron microscopy (SEM) and electron-dispersive X-ray spectroscopy (EDX), respectively, to estimate the physical and chemical changes due to pyrolysis. Raman spectroscopy was used to confirm the glassy nature of the carbon microstructures. Pyrolyzed hair carbon was introduced to modify screen-printed carbon electrodes ; the modified electrodes were then applied to the electrochemical sensing of dopamine and ascorbic acid. Sensing performance of the modified sensors was improved as compared to the unmodified sensors. To obtain the desired carbon structure design, carbon micro-/nanoelectromechanical system (C-MEMS/C-NEMS) technology was developed. The most common C-MEMS/C-NEMS fabrication process consists of two steps: (i) the patterning of a carbon-rich base material, such as a photosensitive polymer, using photolithography; and (ii) carbonization through the pyrolysis of the patterned polymer in an oxygen-free environment. The C-MEMS/NEMS process has been widely used to develop microelectronic devices for various applications, including in micro-batteries, supercapacitors, glucose sensors, gas sensors, fuel cells, and triboelectric nanogenerators. Here, recent developments of a high-aspect ratio solid and hollow carbon microstructures with SU8 photoresists are discussed. The structural shrinkage during pyrolysis was investigated using confocal microscopy and SEM. Raman spectroscopy was used to confirm the crystallinity of the structure, and the atomic percentage of the elements present in the material before and after pyrolysis was measured using EDX.

Market packages.

DOT National Transportation Integrated Search

1997-09-11

Safety is a major goal of the National Intelligent Transportation System (ITS) Program. To promote safety, the Federal Highway Administration (FHWA) funded several field operational tests to evaluate technologies designed to decrease transportation r...

Effect of packaging technology on microbiological and sensory quality of a cooked blood sausage, Morcela de Arroz, from Monchique region of Portugal.

PubMed

Pereira, J A; Dionísio, L; Patarata, L; Matos, T J S

2015-03-01

Morcela de Arroz (MA), a popular Portuguese blood sausage, with high pH and water activity (aw), is traditionally commercialized without preservatives and unpacked. This study evaluated the best packaging solution to extend MA shelf life stored at 4±1°C for 44days: without packaging (WP), vacuum (VP) and modified atmosphere packaging (MAP) (80% CO2; 20% N2). Mesophilic (MTVC), psychrotrophic (PTVC), lactic acid bacteria (LAB), pseudomonads, molds and yeasts, Enterobacteriaceae, Listeria monocytogenes, Salmonella spp., Bacillus cereus, Clostridium perfringens, sensory properties, pH, moisture and aw were studied. Moisture and aw decreased (p<0.05) in WP. pH decreased in WP and MAP during storage. MTVC and PTVC counts increased to values around 7logCFU/g at 44days of storage. LAB and Enterobacteriaceae counts were higher (p<0.05) in VP. Pseudomonads were inhibited (p<0.05) by MAP after 8days of storage. Sensory parameters were affected (p<0.05) by packaging and storage time. Globally, MAP performed better. Copyright © 2014 Elsevier Ltd. All rights reserved.

Quality of hurdle treated pork sausages during refrigerated (4 ± 1°C) storage.

PubMed

Thomas, R; Anjaneyulu, A S R; Kondaiah, N

2010-06-01

Pork sausages developed using hurdle technology was evaluated during refrigerated storage (4 ± 1°C). Hurdles incorporated were low pH, low water activity, vacuum packaging and post package reheating. Dipping in potassium sorbate solution prior to vacuum packaging was also tried. Hurdle treatment significantly (p <0.05) reduced the rate of deterioration of quality characteristics of pork sausages during storage, as indicated by TBARS and tyrosine values. Incorporation of hurdles decreased the growth of different spoilage and pathogenic microorganisms. Combination of pH, water activity, vacuum packaging and reheating inhibited the growth of yeast and molds up to 12 days, while additional dipping of sausages in 1% potassium sorbate solution prior to packaging inhibited their growth even on 30(th) day of storage. Incorporation of hurdles resulted in initial reduction in all the sensory attributes, but they helped to maintain these attributes for significantly longer period compared to control. Hurdle treated sausages exhibited no spoilage signs even on day 30, while the control sausages were found acceptable only up to 18 days.

High-power lightweight external-cavity quantum cascade lasers

NASA Astrophysics Data System (ADS)

Day, Timothy; Takeuchi, Eric B.; Weida, Miles; Arnone, David; Pushkarsky, Michael; Boyden, David; Caffey, David

2009-05-01

Commercially available quantum cascade gain media has been integrated with advanced coating and die attach technologies, mid-IR micro-optics and telecom-style assembly and packaging to yield cutting edge performance. When combined into Daylight's external-cavity quantum cascade laser (ECqcL) platform, multi-Watt output power has been obtained. Daylight will describe their most recent results obtained from this platform, including high cw power from compact hermetically sealed packages and narrow spectral linewidth devices. Fiber-coupling and direct amplitude modulation from such multi-Watt lasers will also be described. In addition, Daylight will present the most recent results from their compact, portable, battery-operated "thermal laser pointers" that are being used for illumination and aiming applications. When combined with thermal imaging technology, such devices provide significant benefits in contrast and identification.

Development of low cost custom hybrid microcircuit technology

NASA Technical Reports Server (NTRS)

Perkins, K. L.; Licari, J. J.

1981-01-01

Selected potentially low cost, alternate packaging and interconnection techniques were developed and implemented in the manufacture of specific NASA/MSFC hardware, and the actual cost savings achieved by their use. The hardware chosen as the test bed for this evaluation ws the hybrids and modules manufactured by Rockwell International fo the MSFC Flight Accelerometer Safety Cut-Off System (FASCOS). Three potentially low cost packaging and interconnection alternates were selected for evaluation. This study was performed in three phases: hardware fabrication and testing, cost comparison, and reliability evaluation.

Study of the Use of Oxygen-Absorbing Packaging Material to Prolong Shelf-Life of Rations

DTIC Science & Technology

2010-05-28

technology can be used for retortable items (MRE 28 “Italian” entrée, chicken pesto with noodles ) since it maintained the 4 product shelf-life and...packages that have head spacing issues (e.g., retort item or those containing olive oil). Products included chicken pest with noodles (retorted entrée...of the MRE applesauce, they did not prevent the darkening problem. It is suspected that the retort processing step for applesauce manufacture may

Organizational Response to the Introduction of New Computer Software Technology

DTIC Science & Technology

1991-07-01

the documentation to be much use at all." Another said that "the tutorial did a good job, but ... the manual did an average job." The Lotus Manuscript...when they have a specific use in mind and believe they can find the information easily in the manual . 12 The AutoCAD users were also split on their...AutoCAD user with AutoLISP , a programming language included in the package. (Some CADD packages come with these features and others as part of the

Reflective Packaging

NASA Technical Reports Server (NTRS)

1994-01-01

The aluminized polymer film used in spacecraft as a radiation barrier to protect both astronauts and delicate instruments has led to a number of spinoff applications. Among them are aluminized shipping bags, food cart covers and medical bags. Radiant Technologies purchases component materials and assembles a barrier made of layers of aluminized foil. The packaging reflects outside heat away from the product inside the container. The company is developing new aluminized lines, express mailers, large shipping bags, gel packs and insulated panels for the building industry.

Reliability Evaluation of Next Generation Inverter: Cooperative Research and Development Final Report, CRADA Number CRD-12-478

DOE Office of Scientific and Technical Information (OSTI.GOV)

Paret, Paul

The National Renewable Energy Laboratory (NREL) will conduct thermal and reliability modeling on three sets of power modules for the development of a next generation inverter for electric traction drive vehicles. These modules will be chosen by General Motors (GM) to represent three distinct technological approaches to inverter power module packaging. Likely failure mechanisms will be identified in each package and a physics-of-failure-based reliability assessment will be conducted.

Non-hermetic fiber optic transceivers for space applications

NASA Astrophysics Data System (ADS)

Tabbert, Chuck

2017-11-01

There is a commercial trend in high data-rate systems to place optical components in close proximity to the data source/sink. This trend forgoes the traditional module packaging approach to create compact components that are embedded near or within the package of high-performance ASICs. This approach reduces the power consumption and electro-magnetic interference (EMI) effects by reducing the length of copper interconnect signal paths. We present an overview of commercial trends and methods for fielding this technology within spacecraft.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Trentadue, R.; Clemencic, M.; Dykstra, D.

The LCG Persistency Framework consists of three software packages (CORAL, COOL and POOL) that address the data access requirements of the LHC experiments in several different areas. The project is the result of the collaboration between the CERN IT Department and the three experiments (ATLAS, CMS and LHCb) that are using some or all of the Persistency Framework components to access their data. POOL is a hybrid technology store for C++ objects, using a mixture of streaming and relational technologies to implement both object persistency and object metadata catalogs and collections. CORAL is an abstraction layer with an SQL-free APImore » for accessing data stored using relational database technologies. COOL provides specific software components and tools for the handling of the time variation and versioning of the experiment conditions data. This presentation reports on the status and outlook in each of the three sub-projects at the time of the CHEP2012 conference, reviewing the usage of each package in the three LHC experiments.« less

Principles and application of high pressure-based technologies in the food industry.

PubMed

Balasubramaniam, V M Bala; Martínez-Monteagudo, Sergio I; Gupta, Rockendra

2015-01-01

High pressure processing (HPP) has emerged as a commercially viable food manufacturing tool that satisfies consumers' demand for mildly processed, convenient, fresh-tasting foods with minimal to no preservatives. Pressure treatment, with or without heat, inactivates pathogenic and spoilage bacteria, yeast, mold, viruses, and also spores and extends shelf life. Pressure treatment at ambient or chilled temperatures has minimal impact on product chemistry. The product quality and shelf life are often influenced more by storage conditions and packaging material barrier properties than the treatment itself. Application of pressure reduces the thermal exposure of the food during processing, thereby protecting a variety of bioactive compounds. This review discusses recent scientific advances of high pressure technology for food processing and preservation applications such as pasteurization, sterilization, blanching, freezing, and thawing. We highlight the importance of in situ engineering and thermodynamic properties of food and packaging materials in process design. Current and potential future promising applications of pressure technology are summarized.

Innovative food processing technology using ohmic heating and aseptic packaging for meat.

PubMed

Ito, Ruri; Fukuoka, Mika; Hamada-Sato, Naoko

2014-02-01

Since the Tohoku earthquake, there is much interest in processed foods, which can be stored for long periods at room temperature. Retort heating is one of the main technologies employed for producing it. We developed the innovative food processing technology, which supersede retort, using ohmic heating and aseptic packaging. Electrical heating involves the application of alternating voltage to food. Compared with retort heating, which uses a heat transfer medium, ohmic heating allows for high heating efficiency and rapid heating. In this paper we ohmically heated chicken breast samples and conducted various tests on the heated samples. The measurement results of water content, IMP, and glutamic acid suggest that the quality of the ohmically heated samples was similar or superior to that of the retort-heated samples. Furthermore, based on the monitoring of these samples, it was observed that sample quality did not deteriorate during storage. © 2013. Published by Elsevier Ltd on behalf of The American Meat Science Association. All rights reserved.

NASA Electronic Parts and Packaging (NEPP) Program - Update

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2010-01-01

This slide presentation reviews the goals and mission of the NASA Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. The program has been supporting NASA for over 20 years. The focus is on the reliability aspects of electronic devices. In this work the program also supports the electronics industry. There are several areas that the program is involved in: Memories, systems on a chip (SOCs), data conversion devices, power MOSFETS, power converters, scaled CMOS, capacitors, linear devices, fiber optics, and other electronics such as sensors, cryogenic and SiGe that are used in space systems. Each of these area are reviewed with the work that is being done in reliability and effects of radiation on these technologies.

Definition of a high-affinity Gag recognition structure mediating packaging of a retroviral RNA genome

PubMed Central

Gherghe, Cristina; Lombo, Tania; Leonard, Christopher W.; Datta, Siddhartha A. K.; Bess, Julian W.; Gorelick, Robert J.; Rein, Alan; Weeks, Kevin M.

2010-01-01

All retroviral genomic RNAs contain a cis-acting packaging signal by which dimeric genomes are selectively packaged into nascent virions. However, it is not understood how Gag (the viral structural protein) interacts with these signals to package the genome with high selectivity. We probed the structure of murine leukemia virus RNA inside virus particles using SHAPE, a high-throughput RNA structure analysis technology. These experiments showed that NC (the nucleic acid binding domain derived from Gag) binds within the virus to the sequence UCUG-UR-UCUG. Recombinant Gag and NC proteins bound to this same RNA sequence in dimeric RNA in vitro; in all cases, interactions were strongest with the first U and final G in each UCUG element. The RNA structural context is critical: High-affinity binding requires base-paired regions flanking this motif, and two UCUG-UR-UCUG motifs are specifically exposed in the viral RNA dimer. Mutating the guanosine residues in these two motifs—only four nucleotides per genomic RNA—reduced packaging 100-fold, comparable to the level of nonspecific packaging. These results thus explain the selective packaging of dimeric RNA. This paradigm has implications for RNA recognition in general, illustrating how local context and RNA structure can create information-rich recognition signals from simple single-stranded sequence elements in large RNAs. PMID:20974908

Water Sample Concentrator

ScienceCinema

Idaho National Laboratory

2017-12-09

Automated portable device that concentrates and packages a sample of suspected contaminated water for safe, efficient transport to a qualified analytical laboratory. This technology will help safeguard against pathogen contamination or chemical and biolog

An application specific integrated circuit based multi-anode microchannel array readout system

NASA Technical Reports Server (NTRS)

Smeins, Larry G.; Stechman, John M.; Cole, Edward H.

1991-01-01

Size reduction of two new multi-anode microchannel array (MAMA) readout systems is described. The systems are based on two analog and one digital application specific integrated circuits (ASICs). The new readout systems reduce volume over previous discrete designs by 80 percent while improving electrical performance on virtually every significant parameter. Emphasis is made on the packaging used to achieve the volume reduction. Surface mount technology (SMT) is combined with modular construction for the analog portion of the readout. SMT reliability concerns and the board area impact of MIL SPEC SMT components is addressed. Package selection for the analog ASIC is discussed. Future sytems will require even denser packaging and the volume reduction progression is shown.