NASA Astrophysics Data System (ADS)
Cicek, Paul-Vahe; Elsayed, Mohannad; Nabki, Frederic; El-Gamal, Mourad
2017-11-01
An above-IC compatible multi-level MEMS surface microfabrication technology based on a silicon carbide structural layer is presented. The fabrication process flow provides optimal electrostatic transduction by allowing the creation of independently controlled submicron vertical and lateral gaps without the need for high resolution lithography. Adopting silicon carbide as the structural material, the technology ensures material, chemical and thermal compatibility with modern semiconductor nodes, reporting the lowest peak processing temperature (i.e. 200 °C) of all comparable works. This makes this process ideally suited for integrating capacitive-based MEMS directly above standard CMOS substrates. Process flow design and optimization are presented in the context of bulk-mode disk resonators, devices that are shown to exhibit improved performance with respect to previous generation flexural beam resonators, and that represent relatively complex MEMS structures. The impact of impending improvements to the fabrication technology is discussed.
Advancing MEMS Technology Usage through the MUMPS (Multi-User MEMS Processes) Program
NASA Technical Reports Server (NTRS)
Koester, D. A.; Markus, K. W.; Dhuler, V.; Mahadevan, R.; Cowen, A.
1995-01-01
In order to help provide access to advanced micro-electro-mechanical systems (MEMS) technologies and lower the barriers for both industry and academia, the Microelectronic Center of North Carolina (MCNC) and ARPA have developed a program which provides users with access to both MEMS processes and advanced electronic integration techniques. The four distinct aspects of this program, the multi-user MEMS processes (MUMP's), the consolidated micro-mechanical element library, smart MEMS, and the MEMS technology network are described in this paper. MUMP's is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. It is both a proof-of-concept and educational tool that aids in the development of MEMS in the domestic community. MUMP's technologies currently include a 3-layer poly-silicon surface micromachining process and LIGA (lithography, electroforming, and injection molding) processes that provide reasonable design flexibility within set guidelines. The consolidated micromechanical element library (CaMEL) is a library of active and passive MEMS structures that can be downloaded by the MEMS community via the internet. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology. The MEMS technology network (TechNet) is a menu of standard substrates and MEMS fabrication processes that can be purchased and combined to create unique process flows. TechNet provides the MEMS community greater flexibility and enhanced technology accessibility.
NASA Astrophysics Data System (ADS)
Konishi, Toshifumi; Yamane, Daisuke; Matsushima, Takaaki; Masu, Kazuya; Machida, Katsuyuki; Toshiyoshi, Hiroshi
2014-01-01
This paper reports the design and evaluation results of a capacitive CMOS-MEMS sensor that consists of the proposed sensor circuit and a capacitive MEMS device implemented on the circuit. To design a capacitive CMOS-MEMS sensor, a multi-physics simulation of the electromechanical behavior of both the MEMS structure and the sensing LSI was carried out simultaneously. In order to verify the validity of the design, we applied the capacitive CMOS-MEMS sensor to a MEMS accelerometer implemented by the post-CMOS process onto a 0.35-µm CMOS circuit. The experimental results of the CMOS-MEMS accelerometer exhibited good agreement with the simulation results within the input acceleration range between 0.5 and 6 G (1 G = 9.8 m/s2), corresponding to the output voltages between 908.6 and 915.4 mV, respectively. Therefore, we have confirmed that our capacitive CMOS-MEMS sensor and the multi-physics simulation will be beneficial method to realize integrated CMOS-MEMS technology.
Application of Micro-Electro-Mechanical Sensors Contactless NDT of Concrete Structures.
Ham, Suyun; Popovics, John S
2015-04-17
The utility of micro-electro-mechanical sensors (MEMS) for application in air-coupled (contactless or noncontact) sensing to concrete nondestructive testing (NDT) is studied in this paper. The fundamental operation and characteristics of MEMS are first described. Then application of MEMS sensors toward established concrete test methods, including vibration resonance, impact-echo, ultrasonic surface wave, and multi-channel analysis of surface waves (MASW), is demonstrated. In each test application, the performance of MEMS is compared with conventional contactless and contact sensing technology. Favorable performance of the MEMS sensors demonstrates the potential of the technology for applied contactless NDT efforts. To illustrate the utility of air-coupled MEMS sensors for concrete NDT, as compared with conventional sensor technology.
Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects
NASA Astrophysics Data System (ADS)
Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter
2011-02-01
The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.
Micro/nano electro mechanical systems for practical applications
NASA Astrophysics Data System (ADS)
Esashi, Masayoshi
2009-09-01
Silicon MEMS as electrostatically levitated rotational gyroscope, 2D optical scanner and wafer level packaged devices as integrated capacitive pressure sensor and MEMS switch are described. MEMS which use non-silicon materials as diamond, PZT, conductive polymer, CNT (carbon nano tube), LTCC with electrical feedthrough, SiC (silicon carbide) and LiNbO3 for multi-probe data storage, multi-column electron beam lithography system, probe card for wafer-level burn-in test, mould for glass press moulding and SAW wireless passive sensor respectively are also described.
MEMS-Based Communications Systems for Space-Based Applications
NASA Technical Reports Server (NTRS)
DeLosSantos, Hector J.; Brunner, Robert A.; Lam, Juan F.; Hackett, Le Roy H.; Lohr, Ross F., Jr.; Larson, Lawrence E.; Loo, Robert Y.; Matloubian, Mehran; Tangonan, Gregory L.
1995-01-01
As user demand for higher capacity and flexibility in communications satellites increases, new ways to cope with the inherent limitations posed by the prohibitive mass and power consumption, needed to satisfy those requirements, are under investigation. Recent studies suggest that while new satellite architectures are necessary to enable multi-user, multi-data rate, multi-location satellite links, these new architectures will inevitably increase power consumption, and in turn, spacecraft mass, to such an extent that their successful implementation will demand novel lightweight/low power hardware approaches. In this paper, following a brief introduction to the fundamentals of communications satellites, we address the impact of micro-electro-mechanical systems (MEMS) technology, in particular micro-electro-mechanical (MEM) switches to mitigate the above mentioned problems and show that low-loss/wide bandwidth MEM switches will go a long way towards enabling higher capacity and flexibility space-based communications systems.
MEMS for pico- to micro-satellites
NASA Astrophysics Data System (ADS)
Shea, H. R.
2009-02-01
MEMS sensors, actuators, and sub-systems can enable an important reduction in the size and mass of spacecrafts, first by replacing larger and heavier components, then by replacing entire subsystems, and finally by enabling the microfabrication of highly integrated picosats. Very small satellites (1 to 100 kg) stand to benefit the most from MEMS technologies. These small satellites are typically used for science or technology demonstration missions, with higher risk tolerance than multi-ton telecommunication satellites. While MEMS are playing a growing role on Earth in safety-critical applications, in the harsh and remote environment of space, reliability is still the crucial issue, and the absence of an accepted qualification methodology is holding back MEMS from wider use. An overview is given of the range of MEMS applications in space. An effective way to prove that MEMS can operate reliably in space is to use them in space: we illustrate how Cubesats (1 kg, 1 liter, cubic satellites in a standardized format to reduce launch costs) can serve as low-cost vectors for MEMS technology demonstration in space. The Cubesat SwissCube developed in Switzerland is used as one example of a rapid way to fly new microtechnologies, and also as an example of a spacecraft whose performance is only possible thanks to MEMS.
Standard semiconductor packaging for high-reliability low-cost MEMS applications
NASA Astrophysics Data System (ADS)
Harney, Kieran P.
2005-01-01
Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.
Standard semiconductor packaging for high-reliability low-cost MEMS applications
NASA Astrophysics Data System (ADS)
Harney, Kieran P.
2004-12-01
Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.
NASA Technical Reports Server (NTRS)
Tang, Tony K.
1999-01-01
At NASA, the focus for smaller, less costly missions has given impetus for the development of microspacecraft. MicroElectroMechanical System (MEMS) technology advances in the area of sensor, propulsion systems, and instruments, make the notion of a specialized microspacecraft feasible in the immediate future. Similar to the micro-electronics revolution,the emerging MEMS technology offers the integration of recent advances in micromachining and nanofabrication techniques with microelectronics in a mass-producible format,is viewed as the next step in device and instrument miniaturization. MEMS technology offers the potential of enabling or enhancing NASA missions in a variety of ways. This new technology allows the miniaturization of components and systems, where the primary benefit is a reduction in size, mass and power. MEMS technology also provides new capabilities and enhanced performance, where the most significant impact is in performance, regardless of system size. Finally,with the availability of mass-produced, miniature MEMS instrumentation comes the opportunity to rethink our fundamental measurement paradigms. It is now possible to expand our horizons from a single instrument perspective to one involving multi-node distributed systems. In the distributed systems and missions, a new system in which the functionality is enabled through a multiplicity of elements. Further in the future, the integration of electronics, photonics, and micromechanical functionalities into "instruments-on-a-chip" will provide the ultimate size, cost, function, and performance advantage. In this presentation, I will discuss recent development, requirement, and applications of various MEMS technologies and devices for space applications.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Smith, J.H.; Ellis, J.R.; Montague, S.
1997-03-01
One of the principal applications of monolithically integrated micromechanical/microelectronic systems has been accelerometers for automotive applications. As integrated MEMS/CMOS technologies such as those developed by U.C. Berkeley, Analog Devices, and Sandia National Laboratories mature, additional systems for more sensitive inertial measurements will enter the commercial marketplace. In this paper, the authors will examine key technology design rules which impact the performance and cost of inertial measurement devices manufactured in integrated MEMS/CMOS technologies. These design parameters include: (1) minimum MEMS feature size, (2) minimum CMOS feature size, (3) maximum MEMS linear dimension, (4) number of mechanical MEMS layers, (5) MEMS/CMOS spacing.more » In particular, the embedded approach to integration developed at Sandia will be examined in the context of these technology features. Presently, this technology offers MEMS feature sizes as small as 1 {micro}m, CMOS critical dimensions of 1.25 {micro}m, MEMS linear dimensions of 1,000 {micro}m, a single mechanical level of polysilicon, and a 100 {micro}m space between MEMS and CMOS. This is applicable to modern precision guided munitions.« less
Enabling MEMS technologies for communications systems
NASA Astrophysics Data System (ADS)
Lubecke, Victor M.; Barber, Bradley P.; Arney, Susanne
2001-11-01
Modern communications demands have been steadily growing not only in size, but sophistication. Phone calls over copper wires have evolved into high definition video conferencing over optical fibers, and wireless internet browsing. The technology used to meet these demands is under constant pressure to provide increased capacity, speed, and efficiency, all with reduced size and cost. Various MEMS technologies have shown great promise for meeting these challenges by extending the performance of conventional circuitry and introducing radical new systems approaches. A variety of strategic MEMS structures including various cost-effective free-space optics and high-Q RF components are described, along with related practical implementation issues. These components are rapidly becoming essential for enabling the development of progressive new communications systems technologies including all-optical networks, and low cost multi-system wireless terminals and basestations.
NASA Astrophysics Data System (ADS)
Wang, Wei-Shan; Wiemer, Maik; Froemel, Joerg; Enderlein, Tom; Gessner, Thomas; Lullin, Justine; Bargiel, Sylwester; Passilly, Nicolas; Albero, Jorge; Gorecki, Christophe
2016-04-01
In this work, vertical integration of miniaturized array-type Mirau interferometers at wafer level by using multi-stack anodic bonding is presented. Mirau interferometer is suitable for MEMS metrology and for medical imaging according to its vertical-, lateral- resolutions and working distances. Miniaturized Mirau interferometer can be a promising candidate as a key component of an optical coherence tomography (OCT) system. The miniaturized array-type interferometer consists of a microlens doublet, a Si-based MEMS Z scanner, a spacer for focus-adjustment and a beam splitter. Therefore, bonding technologies which are suitable for heterogeneous substrates are of high interest and necessary for the integration of MEMS/MOEMS devices. Multi-stack anodic bonding, which meets the optical and mechanical requirements of the MOEMS device, is adopted to integrate the array-type interferometers. First, the spacer and the beam splitter are bonded, followed by bonding of the MEMS Z scanner. In the meanwhile, two microlenses, which are composed of Si and glass wafers, are anodically bonded to form a microlens doublet. Then, the microlens doublet is aligned and bonded with the scanner/spacer/beam splitter stack. The bonded array-type interferometer is a 7- wafer stack and the thickness is approximately 5mm. To separate such a thick wafer stack with various substrates, 2-step laser cutting is used to dice the bonded stack into Mirau chips. To simplify fabrication process of each component, electrical connections are created at the last step by mounting a Mirau chip onto a flip chip PCB instead of through wafer vias. Stability of Au/Ti films on the MEMS Z scanner after anodic bonding, laser cutting and flip chip bonding are discussed as well.
Investigation of improving MEMS-type VOA reliability
NASA Astrophysics Data System (ADS)
Hong, Seok K.; Lee, Yeong G.; Park, Moo Y.
2003-12-01
MEMS technologies have been applied to a lot of areas, such as optical communications, Gyroscopes and Bio-medical components and so on. In terms of the applications in the optical communication field, MEMS technologies are essential, especially, in multi dimensional optical switches and Variable Optical Attenuators(VOAs). This paper describes the process for the development of MEMS type VOAs with good optical performance and improved reliability. Generally, MEMS VOAs have been fabricated by silicon micro-machining process, precise fibre alignment and sophisticated packaging process. Because, it is composed of many structures with various materials, it is difficult to make devices reliable. We have developed MEMS type VOSs with many failure mode considerations (FMEA: Failure Mode Effect Analysis) in the initial design step, predicted critical failure factors and revised the design, and confirmed the reliability by preliminary test. These predicted failure factors were moisture, bonding strength of the wire, which wired between the MEMS chip and TO-CAN and instability of supplied signals. Statistical quality control tools (ANOVA, T-test and so on) were used to control these potential failure factors and produce optimum manufacturing conditions. To sum up, we have successfully developed reliable MEMS type VOAs with good optical performances by controlling potential failure factors and using statistical quality control tools. As a result, developed VOAs passed international reliability standards (Telcodia GR-1221-CORE).
Investigation of improving MEMS-type VOA reliability
NASA Astrophysics Data System (ADS)
Hong, Seok K.; Lee, Yeong G.; Park, Moo Y.
2004-01-01
MEMS technologies have been applied to a lot of areas, such as optical communications, Gyroscopes and Bio-medical components and so on. In terms of the applications in the optical communication field, MEMS technologies are essential, especially, in multi dimensional optical switches and Variable Optical Attenuators(VOAs). This paper describes the process for the development of MEMS type VOAs with good optical performance and improved reliability. Generally, MEMS VOAs have been fabricated by silicon micro-machining process, precise fibre alignment and sophisticated packaging process. Because, it is composed of many structures with various materials, it is difficult to make devices reliable. We have developed MEMS type VOSs with many failure mode considerations (FMEA: Failure Mode Effect Analysis) in the initial design step, predicted critical failure factors and revised the design, and confirmed the reliability by preliminary test. These predicted failure factors were moisture, bonding strength of the wire, which wired between the MEMS chip and TO-CAN and instability of supplied signals. Statistical quality control tools (ANOVA, T-test and so on) were used to control these potential failure factors and produce optimum manufacturing conditions. To sum up, we have successfully developed reliable MEMS type VOAs with good optical performances by controlling potential failure factors and using statistical quality control tools. As a result, developed VOAs passed international reliability standards (Telcodia GR-1221-CORE).
Recent progress in MEMS technology development for military applications
NASA Astrophysics Data System (ADS)
Ruffin, Paul B.; Burgett, Sherrie J.
2001-08-01
The recent progress of ongoing efforts at the Army Aviation and Missile Command (AMCOM) to develop microelectromechanical systems (MEMS) technology for military applications is discussed in this paper. The current maturity level of low cost, low power, micro devices in industry, which range from simple temperature and pressure sensors to accelerometers in airbags, provides a viable foundation for the development of rugged MEMS devices for dual-use applications. Early MEMS technology development efforts at AMCOM emphasized inertial MEMS sensors. An Army Science and Technology Objective (STO) project was initiated to develop low cost inertial components with moderate angular rate sensor resolution for measuring pitch and yaw of missile attitude and rotational roll rate. Leveraging the Defense Advanced Research Projects Agency and other Government agencies has resulted in the development of breadboard inertial MEMS devices with improved robustness. During the past two years, MEMS research at AMCOM has been expanded to include environmental MEMS sensors for missile health monitoring, RF-MEMS, optical MEMS devices for beam steering, and micro-optic 'benches' for opto-electronics miniaturization. Additionally, MEMS packaging and integration issues have come into focus and are being addressed. Selected ongoing research efforts in these areas are presented, and some horizon MEMS sensors requirements for Army and law enforcement are presented for consideration.
Sandia Advanced MEMS Design Tools, Version 2.2.5
DOE Office of Scientific and Technical Information (OSTI.GOV)
Yarberry, Victor; Allen, James; Lantz, Jeffery
2010-01-19
The Sandia National Laboratories Advanced MEMS Design Tools, Version 2.2.5, is a collection of menus, prototype drawings, and executables that provide significant productivity enhancements when using AutoCAD to design MEMS components. This release is designed for AutoCAD 2000i, 2002, or 2004 and is supported under Windows NT 4.0, Windows 2000, or XP. SUMMiT V (Sandia Ultra planar Multi level MEMS Technology) is a 5 level surface micromachine fabrication technology, which customers internal and external to Sandia can access to fabricate prototype MEMS devices. This CD contains an integrated set of electronic files that: a) Describe the SUMMiT V fabrication processmore » b) Facilitate the process of designing MEMS with the SUMMiT process (prototype file, Design Rule Checker, Standard Parts Library) New features in this version: AutoCAD 2004 support has been added. SafeExplode ? a new feature that explodes blocks without affecting polylines (avoids exploding polylines into objects that are ignored by the DRC and Visualization tools). Layer control menu ? a pull-down menu for selecting layers to isolate, freeze, or thaw. Updated tools: A check has been added to catch invalid block names. DRC features: Added username/password validation, added a method to update the user?s password. SNL_DRC_WIDTH ? a value to control the width of the DRC error lines. SNL_BIAS_VALUE ? a value use to offset selected geometry SNL_PROCESS_NAME ? a value to specify the process name Documentation changes: The documentation has been updated to include the new features. While there exist some files on the CD that are used in conjunction with software package AutoCAD, these files are not intended for use independent of the CD. Note that the customer must purchase his/her own copy of AutoCAD to use with these files.« less
MEMS packaging: state of the art and future trends
NASA Astrophysics Data System (ADS)
Bossche, Andre; Cotofana, Carmen V. B.; Mollinger, Jeff R.
1998-07-01
Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.
NASA Astrophysics Data System (ADS)
Salomon, Patric R.
2003-01-01
According to the latest release of the NEXUS market study, the market for MEMS or Microsystems Technology (MST) is predicted to grow to $68B by the year 2005, with systems containing these components generating even higher revenues and growth. The latest advances in MST/MEMS technology have enabled the design of a new generation of microsystems that are smaller, cheaper, more reliable, and consume less power. These integrated systems bring together numerous analog/mixed signal microelectronics blocks and MEMS functions on a single chip or on two or more chips assembled within an integrated package. In spite of all these advances in technology and manufacturing, a system manufacturer either faces a substantial up-front R&D investment to create his own infrastructure and expertise, or he can use design and foundry services to get the initial product into the marketplace fast and with an affordable investment. Once he has a viable product, he can still think about his own manufacturing efforts and investments to obtain an optimized high volume manufacturing for the specific product. One of the barriers to successful exploitation of MEMS/MST technology has been the lack of access to industrial foundries capable of producing certified microsystems devices in commercial quantities, including packaging and test. This paper discusses Multi-project wafer (MPW) runs, requirements for foundries and gives some examples of foundry business models. Furthermore, this paper will give an overview on MST/MEMS services that are available in Europe, including pure commercial activities, European project activities (e.g. Europractice), and some academic services.
Wafer-level vacuum/hermetic packaging technologies for MEMS
NASA Astrophysics Data System (ADS)
Lee, Sang-Hyun; Mitchell, Jay; Welch, Warren; Lee, Sangwoo; Najafi, Khalil
2010-02-01
An overview of wafer-level packaging technologies developed at the University of Michigan is presented. Two sets of packaging technologies are discussed: (i) a low temperature wafer-level packaging processes for vacuum/hermeticity sealing, and (ii) an environmentally resistant packaging (ERP) technology for thermal and mechanical control as well as vacuum packaging. The low temperature wafer-level encapsulation processes are implemented using solder bond rings which are first patterned on a cap wafer and then mated with a device wafer in order to encircle and encapsulate the device at temperatures ranging from 200 to 390 °C. Vacuum levels below 10 mTorr were achieved with yields in an optimized process of better than 90%. Pressures were monitored for more than 4 years yielding important information on reliability and process control. The ERP adopts an environment isolation platform in the packaging substrate. The isolation platform is designed to provide low power oven-control, vibration isolation and shock protection. It involves batch flip-chip assembly of a MEMS device onto the isolation platform wafer. The MEMS device and isolation structure are encapsulated at the wafer-level by another substrate with vertical feedthroughs for vacuum/hermetic sealing and electrical signal connections. This technology was developed for high performance gyroscopes, but can be applied to any type of MEMS device.
A review: aluminum nitride MEMS contour-mode resonator
NASA Astrophysics Data System (ADS)
Yunhong, Hou; Meng, Zhang; Guowei, Han; Chaowei, Si; Yongmei, Zhao; Jin, Ning
2016-10-01
Over the past several decades, the technology of micro-electromechanical system (MEMS) has advanced. A clear need of miniaturization and integration of electronics components has had new solutions for the next generation of wireless communications. The aluminum nitride (AlN) MEMS contour-mode resonator (CMR) has emerged and become promising and competitive due to the advantages of the small size, high quality factor and frequency, low resistance, compatibility with integrated circuit (IC) technology, and the ability of integrating multi-frequency devices on a single chip. In this article, a comprehensive review of AlN MEMS CMR technology will be presented, including its basic working principle, main structures, fabrication processes, and methods of performance optimization. Among these, the deposition and etching process of the AlN film will be specially emphasized and recent advances in various performance optimization methods of the CMR will be given through specific examples which are mainly focused on temperature compensation and reducing anchor losses. This review will conclude with an assessment of the challenges and future trends of the CMR. Project supported by National Natural Science Foundation (Nos. 61274001, 61234007, 61504130), the Nurturing and Development Special Projects of Beijing Science and Technology Innovation Base's Financial Support (No. Z131103002813070), and the National Defense Science and Technology Innovation Fund of CAS (No. CXJJ-14-M32).
Novel First-Level Interconnect Techniques for Flip Chip on MEMS Devices
Sutanto, Jemmy; Anand, Sindhu; Patel, Chetan; Muthuswamy, Jit
2013-01-01
Flip-chip packaging is desirable for microelectro-mechanical systems (MEMS) devices because it reduces the overall package size and allows scaling up the number of MEMS chips through 3-D stacks. In this report, we demonstrate three novel techniques to create first-level interconnect (FLI) on MEMS: 1) Dip and attach technology for Ag epoxy; 2) Dispense technology for solder paste; 3) Dispense, pull, and attach technology (DPAT) for solder paste. The above techniques required no additional microfabrication steps, produced no visible surface contamination on the MEMS active structures, and generated high-aspect-ratio interconnects. The developed FLIs were successfully tested on MEMS moveable microelectrodes microfabricated by SUMMiTVTM process producing no apparent detrimental effect due to outgassing. The bumping processes were successfully applied on Al-deposited bond pads of 100 μm × 100 μm with an average bump height of 101.3 μm for Ag and 184.8 μm for solder (63Sn, 37Pb). DPAT for solder paste produced bumps with the aspect ratio of 1.8 or more. The average shear strengths of Ag and solder bumps were 78 MPa and 689 kPa, respectively. The electrical test on Ag bumps at 794 A/cm2 demonstrated reliable electrical interconnects with negligible resistance. These scalable FLI technologies are potentially useful for MEMS flip-chip packaging and 3-D stacking. PMID:24504168
NASA Technical Reports Server (NTRS)
Jah, Muzar; Simon, Eric; Sharma, Ashok
2003-01-01
Micro Electro Mechanical Systems (MEMS) have been heralded for their ability to provide tremendous advantages in electronic systems through increased electrical performance, reduced power consumption, and higher levels of device integration with a reduction of board real estate. RF MEMS switch technology offers advantages such as low insertion loss (0.1- 0.5 dB), wide bandwidth (1 GHz-100 GHz), and compatibility with many different process technologies (quartz, high resistivity Si, GaAs) which can replace the use of traditional electronic switches, such as GaAs FETS and PIN Diodes, in microwave systems for low signal power (x < 500 mW) applications. Although the electrical characteristics of RF MEMS switches far surpass any existing technologies, the unknown reliability, due to the lack of information concerning failure modes and mechanisms inherent to MEMS devices, create an obstacle to insertion of MEMS technology into high reliability applications. All MEMS devices are sensitive to moisture and contaminants, issues easily resolved by hermetic or near-hermetic packaging. Two well-known failure modes of RF MEMS switches are charging in the dielectric layer of capacitive membrane switches and contact interface stiction of metal-metal switches. Determining the integrity of MEMS devices when subjected to the shock, vibration, temperature extremes, and radiation of the space environment is necessary to facilitate integration into space systems. This paper will explore the effects of different environmental stresses, operational life cycling, temperature, mechanical shock, and vibration on the first commercially available RF MEMS switches to identify relevant failure modes and mechanisms inherent to these device and packaging schemes for space applications. This paper will also describe RF MEMS Switch technology under development at NASA GSFC.
Micromachined modulator arrays for use in free-space optical communication systems
NASA Astrophysics Data System (ADS)
Lewis, Keith L.; Ridley, Kevin D.; McNie, Mark E.; Smith, Gilbert W.; Scott, Andrew M.
2004-12-01
A summary is presented of some of the design criteria relevant to the realisation of silicon micromachined modulator arrays for use in free-space optical communication systems. Theoretical performance levels achievable are compared with values measured on experimental devices produced using a modified Multi-User MEMS Process (MUMPS). Devices capable of realising modulation rates in excess of 300 kHz are described and their optical characteristics compared with published data on devices based on multiple quantum well technology.
NASA Astrophysics Data System (ADS)
Ma, Wenying; Ma, Changwei; Wang, Weimin
2018-03-01
Deformable mirrors (DM) based on microelectromechanical system (MEMS) technology are being applied in adaptive optics (AO) system for astronomical telescopes and human eyes more and more. In this paper a MEMS DM with hexagonal actuator is proposed and designed. The relationship between structural design and performance parameters, mainly actuator coupling, is analyzed carefully and calculated. The optimum value of actuator coupling is obtained. A 7-element DM prototype is fabricated using a commercial available standard three-layer polysilicon surface multi-user-MEMS-processes (PolyMUMPs). Some key performances, including surface figure and voltage-displacement curve, are measured through a 3D white light profiler. The measured performances are very consistent with the theoretical values. The proposed DM will benefit the miniaturization of AO systems and lower their cost.
MEMS sensing and control: an aerospace perspective
NASA Astrophysics Data System (ADS)
Schoess, Jeffrey N.; Arch, David K.; Yang, Wei; Cabuz, Cleopatra; Hocker, Ben; Johnson, Burgess R.; Wilson, Mark L.
2000-06-01
Future advanced fixed- and rotary-wing aircraft, launch vehicles, and spacecraft will incorporate smart microsensors to monitor flight integrity and provide flight control inputs. This paper provides an overview of Honeywell's MEMS technologies for aerospace applications of sensing and control. A unique second-generation polysilicon resonant microbeam sensor design is described. It incorporates a micron-level vacuum-encapsulated microbeam to optically sense aerodynamic parameters and to optically excite the sensor pick off: optically excited self-resonant microbeams form the basis for a new class of versatile, high- performance, low-cost MEMS sensors that uniquely combine silicon microfabrication technology with optoelectronic technology that can sense dynamic pressure, acceleration forces, acoustic emission, and many other aerospace parameters of interest. Honeywell's recent work in MEMS tuning fork gyros for inertial sensing and a MEMS free- piston engine are also described.
Fabricating micro-instruments in surface-micromachined polycrystalline silicon
DOE Office of Scientific and Technical Information (OSTI.GOV)
Comtois, J.H.; Michalicek, M.A.; Barron, C.C.
1997-04-01
Smaller, lighter instruments can be fabricated as Micro-Electro-Mechanical Systems (MEMS), having micron scale moving parts packaged together with associated control and measurement electronics. Batch fabrication of these devices will make economical applications such as condition-based machine maintenance and remote sensing. The choice of instrumentation is limited only by the designer`s imagination. This paper presents one genre of MEMS fabrication, surface-micromachined polycrystalline silicon (polysilicon). Two currently available but slightly different polysilicon processes are presented. One is the ARPA-sponsored ``Multi-User MEMS ProcesS`` (MUMPS), available commercially through MCNC; the other is the Sandia National Laboratories ``Sandia Ultra-planar Multilevel MEMS Technology`` (SUMMiT). Example componentsmore » created in both processes will be presented, with an emphasis on actuators, actuator force testing instruments, and incorporating actuators into larger instruments.« less
NASA Astrophysics Data System (ADS)
Ranjan, Pinku; Gangwar, Ravi Kumar
2017-12-01
A novel design and analysis of quarter cylindrical dielectric resonator antenna (q-CDRA) with multi-element and multi-segment (MEMS) approach has been presented. The MEMS q-CDRA has been designed by splitting four identical quarters from a solid cylinder and then multi-segmentation approach has been utilized to design q-CDRA. The proposed antenna has been designed for enhancement in bandwidth as well as for high gain. For bandwidth enhancement, multi-segmentation method has been explained for the selection of dielectric constant of materials. The performance of the proposed MEMS q-CDRA has been demonstrated with design guideline of MEMS approach. To validate the antenna performance, three segments q-CDRA has been fabricated and analyzed practically. The simulated results have been in good agreement with measured one. The MEMS q-CDRA has wide impedance bandwidth (|S11|≤-10 dB) of 133.8 % with monopole-like radiation pattern. The proposed MEMS q-CDRA has been operating at TM01δ mode with the measured gain of 6.65 dBi and minimum gain of 4.5 dBi in entire operating frequency band (5.1-13.7 GHz). The proposed MEMS q-CDRA may find appropriate applications in WiMAX and WLAN band.
Integrated multidisciplinary CAD/CAE environment for micro-electro-mechanical systems (MEMS)
NASA Astrophysics Data System (ADS)
Przekwas, Andrzej J.
1999-03-01
Computational design of MEMS involves several strongly coupled physical disciplines, including fluid mechanics, heat transfer, stress/deformation dynamics, electronics, electro/magneto statics, calorics, biochemistry and others. CFDRC is developing a new generation multi-disciplinary CAD systems for MEMS using high-fidelity field solvers on unstructured, solution-adaptive grids for a full range of disciplines. The software system, ACE + MEMS, includes all essential CAD tools; geometry/grid generation for multi- discipline, multi-equation solvers, GUI, tightly coupled configurable 3D field solvers for FVM, FEM and BEM and a 3D visualization/animation tool. The flow/heat transfer/calorics/chemistry equations are solved with unstructured adaptive FVM solver, stress/deformation are computed with a FEM STRESS solver and a FAST BEM solver is used to solve linear heat transfer, electro/magnetostatics and elastostatics equations on adaptive polygonal surface grids. Tight multidisciplinary coupling and automatic interoperability between the tools was achieved by designing a comprehensive database structure and APIs for complete model definition. The virtual model definition is implemented in data transfer facility, a publicly available tool described in this paper. The paper presents overall description of the software architecture and MEMS design flow in ACE + MEMS. It describes current status, ongoing effort and future plans for the software. The paper also discusses new concepts of mixed-level and mixed- dimensionality capability in which 1D microfluidic networks are simulated concurrently with 3D high-fidelity models of discrete components.
Thermo-optically tunable thin film devices
NASA Astrophysics Data System (ADS)
Domash, Lawrence H.
2003-10-01
We report advances in tunable thin film technology and demonstration of multi-cavity tunable filters. Thin film interference coatings are the most widely used optical technology for telecom filtering, but until recently no tunable versions have been known except for mechanically rotated filters. We describe a new approach to broadly tunable components based on the properties of semiconductor thin films with large thermo-optic coefficients. The technology is based on amorphous silicon deposited by plasma-enhanced chemical vapor deposition (PECVD), a process adapted for telecom applications from its origins in the flat-panel display and solar cell industries. Unlike MEMS devices, tunable thin films can be constructed in sophisticated multi-cavity, multi-layer optical designs.
Sabato, Alessandro; Feng, Maria Q.
2014-01-01
Recent advances in the Micro Electro-Mechanical System (MEMS) technology have made wireless MEMS accelerometers an attractive tool for Structural Health Monitoring (SHM) of civil engineering structures. To date, sensors' low sensitivity and accuracy—especially at very low frequencies—have imposed serious limitations for their application in monitoring large-sized structures. Conventionally, the MEMS sensor's analog signals are converted to digital signals before radio-frequency (RF) wireless transmission. The conversion can cause a low sensitivity to the important low-frequency and low-amplitude signals. To overcome this difficulty, the authors have developed a MEMS accelerometer system, which converts the sensor output voltage to a frequency-modulated signal before RF transmission. This is achieved by using a Voltage to Frequency Conversion (V/F) instead of the conventional Analog to Digital Conversion (ADC). In this paper, a prototype MEMS accelerometer system is presented, which consists of a transmitter and receiver circuit boards. The former is equipped with a MEMS accelerometer, a V/F converter and a wireless RF transmitter, while the latter contains an RF receiver and a F/V converter for demodulating the signal. The efficacy of the MEMS accelerometer system in measuring low-frequency and low-amplitude dynamic responses is demonstrated through extensive laboratory tests and experiments on a flow-loop pipeline. PMID:25198003
Sabato, Alessandro; Feng, Maria Q
2014-09-05
Recent advances in the Micro Electro-Mechanical System (MEMS) technology have made wireless MEMS accelerometers an attractive tool for Structural Health Monitoring (SHM) of civil engineering structures. To date, sensors' low sensitivity and accuracy--especially at very low frequencies--have imposed serious limitations for their application in monitoring large-sized structures. Conventionally, the MEMS sensor's analog signals are converted to digital signals before radio-frequency (RF) wireless transmission. The conversion can cause a low sensitivity to the important low-frequency and low-amplitude signals. To overcome this difficulty, the authors have developed a MEMS accelerometer system, which converts the sensor output voltage to a frequency-modulated signal before RF transmission. This is achieved by using a Voltage to Frequency Conversion (V/F) instead of the conventional Analog to Digital Conversion (ADC). In this paper, a prototype MEMS accelerometer system is presented, which consists of a transmitter and receiver circuit boards. The former is equipped with a MEMS accelerometer, a V/F converter and a wireless RF transmitter, while the latter contains an RF receiver and a F/V converter for demodulating the signal. The efficacy of the MEMS accelerometer system in measuring low-frequency and low-amplitude dynamic responses is demonstrated through extensive laboratory tests and experiments on a flow-loop pipeline.
Multi-scale Modeling and Analysis of Nano-RFID Systems on HPC Setup
NASA Astrophysics Data System (ADS)
Pathak, Rohit; Joshi, Satyadhar
In this paper we have worked out on some the complex modeling aspects such as Multi Scale modeling, MATLAB Sugar based modeling and have shown the complexities involved in the analysis of Nano RFID (Radio Frequency Identification) systems. We have shown the modeling and simulation and demonstrated some novel ideas and library development for Nano RFID. Multi scale modeling plays a very important role in nanotech enabled devices properties of which cannot be explained sometimes by abstraction level theories. Reliability and packaging still remains one the major hindrances in practical implementation of Nano RFID based devices. And to work on them modeling and simulation will play a very important role. CNTs is the future low power material that will replace CMOS and its integration with CMOS, MEMS circuitry will play an important role in realizing the true power in Nano RFID systems. RFID based on innovations in nanotechnology has been shown. MEMS modeling of Antenna, sensors and its integration in the circuitry has been shown. Thus incorporating this we can design a Nano-RFID which can be used in areas like human implantation and complex banking applications. We have proposed modeling of RFID using the concept of multi scale modeling to accurately predict its properties. Also we give the modeling of MEMS devices that are proposed recently that can see possible application in RFID. We have also covered the applications and the advantages of Nano RFID in various areas. RF MEMS has been matured and its devices are being successfully commercialized but taking it to limits of nano domains and integration with singly chip RFID needs a novel approach which is being proposed. We have modeled MEMS based transponder and shown the distribution for multi scale modeling for Nano RFID.
NASA Astrophysics Data System (ADS)
Apte, Prakash R.
1999-11-01
TRIZ is a Russian abbreviation. Genrich Altshuller developed it fifty years ago in the former Soviet Union. He examined thousands of inventions made in different technological systems and formulated a 'Theory of Inventive problem solving' (TRIZ). Altshuller's research of over fifty years on Creativity and Inventive Problem Solving has led to many different classifications, methods and tools of invention. Some of these are, Contradictions table, Level of inventions, Patterns in evolution of technological systems, ARIZ-Algorithm for Inventive Problem Solving, Diagnostic problem solving and Anticipatory Failure Determination. MEMS research consists of conceptual design, process technology and including of various Mechanical, ELectrical, Thermal, Magnetic, Acoustic and other effects. MEMS system s are now rapidly growing in complexity. Each system will thus follow one or more 'patterns of evolution' as given by Altshuller. This paper attempts to indicate how various TRIZ tools can be used in MEMS research activities.
Special Technology Area Review on Micro-Opto-Electro-Mechanical-Systems (MOEMS)
1997-12-01
Optical Interference in Night Vision Systems "* DMD Assisted Intelligent Manufacturing of ................................................... SRI...CONCEPT ......................................... p. 8 FIGURE 3(a): DMD LIGHT SWITCHES...p. 9 FIGURE 3(b): SEM PHOTOMICROGRAPHS OF DMD CHIPS ........................................ p. 9 FIGURE 4: MULTI-USER MEMS PROJECTS (MUMPS
U.S. Army Corrosion Office's storage and quality requirements for military MEMS program
NASA Astrophysics Data System (ADS)
Zunino, J. L., III; Skelton, D. R.
2007-04-01
As the Army transforms into a more lethal, lighter and agile force, the technologies that support these systems must decrease in size while increasing in intelligence. Micro-electromechanical systems (MEMS) are one such technology that the Army and DOD will rely on heavily to accomplish these objectives. Conditions for utilization of MEMS by the military are unique. Operational and storage environments for the military are significantly different than those found in the commercial sector. Issues unique to the military include; high G-forces during gun launch, extreme temperature and humidity ranges, extended periods of inactivity (20 years plus) and interaction with explosives and propellants. The military operational environments in which MEMS will be stored or required to function are extreme and far surpass any commercial operating conditions. Security and encryption are a must for all MEMS communication, tracking, or data reporting devices employed by the military. Current and future military applications of MEMS devices include safety and arming devices, fuzing devices, various guidance systems, sensors/detectors, inertial measurement units, tracking devices, radio frequency devices, wireless Radio Frequency Identifications (RFIDs) and network systems, GPS's, radar systems, mobile base systems and information technology. MEMS embedded into these weapons systems will provide the military with new levels of speed, awareness, lethality, and information dissemination. The system capabilities enhanced by MEMS will translate directly into tactical and strategic military advantages.
[A micro-silicon multi-slit spectrophotometer based on MEMS technology].
Hao, Peng; Wu, Yi-Hui; Zhang, Ping; Liu, Yong-Shun; Zhang, Ke; Li, Hai-Wen
2009-06-01
A new mini-spectrophotometer was developed by adopting micro-silicon slit and pixel segmentation technology, and this spectrophotometer used photoelectron diode array as the detector by the back-dividing-light way. At first, the effect of the spectral bandwidth on the tested absorbance linear correlation was analyzed. A theory for the design of spectrophotometer's slit was brought forward after discussing the relationships between spectrophotometer spectrum band width and pre-and post-slits width. Then, the integrative micro-silicon-slit, which features small volume, high precision, and thin thickness, was manufactured based on the MEMS technology. Finally, a test was carried on linear absorbance solution by this spectrophotometer. The final result showed that the correlation coefficients were larger than 0.999, which means that the new mini-spectrophotometer with micro-silicon slit pixel segmentation has an obvious linear correlation.
NASA Astrophysics Data System (ADS)
German, Kristine A.; Kubby, Joel; Chen, Jingkuang; Diehl, James; Feinberg, Kathleen; Gulvin, Peter; Herko, Larry; Jia, Nancy; Lin, Pinyen; Liu, Xueyuan; Ma, Jun; Meyers, John; Nystrom, Peter; Wang, Yao Rong
2004-07-01
Xerox Corporation has developed a technology platform for on-chip integration of latching MEMS optical waveguide switches and Planar Light Circuit (PLC) components using a Silicon On Insulator (SOI) based process. To illustrate the current state of this new technology platform, working prototypes of a Reconfigurable Optical Add/Drop Multiplexer (ROADM) and a l-router will be presented along with details of the integrated latching MEMS optical switches. On-chip integration of optical switches and PLCs can greatly reduce the size, manufacturing cost and operating cost of multi-component optical equipment. It is anticipated that low-cost, low-overhead optical network products will accelerate the migration of functions and services from high-cost long-haul markets to price sensitive markets, including networks for metropolitan areas and fiber to the home. Compared to the more common silica-on-silicon PLC technology, the high index of refraction of silicon waveguides created in the SOI device layer enables miniaturization of optical components, thereby increasing yield and decreasing cost projections. The latching SOI MEMS switches feature moving waveguides, and are advantaged across multiple attributes relative to alternative switching technologies, such as thermal optical switches and polymer switches. The SOI process employed was jointly developed under the auspice of the NIST APT program in partnership with Coventor, Corning IntelliSense Corp., and MicroScan Systems to enable fabrication of a broad range of free space and guided wave MicroOptoElectroMechanical Systems (MOEMS).
NASA Astrophysics Data System (ADS)
Logsdon, James
2002-03-01
This presentation will provide a brief history of the development of MEMS products and technology, beginning with the manifold absolute pressure sensor in the late seventies through the current variety of Delphi Delco Electronics sensors available today. The technology development of micromachining from uncompensated P plus etch stops to deep reactive ion etching and the technology development of wafer level packaging from electrostatic bonding to glass frit sealing and silicon to silicon direct bonding will be reviewed.
Overview of MEMS/NEMS technology development for space applications at NASA/JPL
NASA Astrophysics Data System (ADS)
George, Thomas
2003-04-01
This paper highlights the current technology development activities of the MEMS Technology Group at JPL. A diverse range of MEMS/NEMS technologies are under development, that are primarily applicable to NASA"s needs in the area of robotic planetary exploration. MEMS/NEMS technologies have obvious advantages for space applications, since they offer the promise of highly capable devices with ultra low mass, size and power consumption. However, the key challenge appears to be in finding efficient means to transition these technologies into "customer" applications. A brief description of this problem is presented along with the Group"s innovative approach to rapidly advance the maturity of technologies via insertion into space missions. Also described are some of the major capabilities of the MEMS Technology Group. A few important examples from among the broad classes of technologies being developed are discussed, these include the "Spider Web Bolometer", High-Performance Miniature Gyroscopes, an Electron Luminescence X-ray Spectrometer, a MEMS-based "Knudsen" Thermal Transpiration pump, MEMS Inchworm Actuators, and Nanowire-based Biological/Chemical Sensors.
Benchmark data for identifying multi-functional types of membrane proteins.
Wan, Shibiao; Mak, Man-Wai; Kung, Sun-Yuan
2016-09-01
Identifying membrane proteins and their multi-functional types is an indispensable yet challenging topic in proteomics and bioinformatics. In this article, we provide data that are used for training and testing Mem-ADSVM (Wan et al., 2016. "Mem-ADSVM: a two-layer multi-label predictor for identifying multi-functional types of membrane proteins" [1]), a two-layer multi-label predictor for predicting multi-functional types of membrane proteins.
MEMS-Based Micro Instruments for In-Situ Planetary Exploration
NASA Technical Reports Server (NTRS)
George, Thomas; Urgiles, Eduardo R; Toda, Risaku; Wilcox, Jaroslava Z.; Douglas, Susanne; Lee, C-S.; Son, Kyung-Ah; Miller, D.; Myung, N.; Madsen, L.;
2005-01-01
NASA's planetary exploration strategy is primarily targeted to the detection of extant or extinct signs of life. Thus, the agency is moving towards more in-situ landed missions as evidenced by the recent, successful demonstration of twin Mars Exploration Rovers. Also, future robotic exploration platforms are expected to evolve towards sophisticated analytical laboratories composed of multi-instrument suites. MEMS technology is very attractive for in-situ planetary exploration because of the promise of a diverse and capable set of advanced, low mass and low-power devices and instruments. At JPL, we are exploiting this diversity of MEMS for the development of a new class of miniaturized instruments for planetary exploration. In particular, two examples of this approach are the development of an Electron Luminescence X-ray Spectrometer (ELXS), and a Force-Detected Nuclear Magnetic Resonance (FDNMR) Spectrometer.
Multi-Probe SPM using Interference Patterns for a Parallel Nano Imaging
NASA Astrophysics Data System (ADS)
Koyama, Hirotaka; Oohira, Fumikazu; Hosogi, Maho; Hashiguchi, Gen
This paper proposes a new composition of the multi-probe using optical interference patterns for a parallel nano imaging in a large area scanning. We achieved large-scale integration with 50,000 probes fabricated with MEMS technology, and measured the optical interference patterns with CCD, which was difficult in a conventional single scanning probe. In this research, the multi-probes are made of Si3N4 by MEMS process, and, the multi-probes are joined with a Pyrex glass by an anodic bonding. We designed, fabricated, and evaluated the characteristics of the probe. In addition, we changed the probe shape to decrease the warpage of the Si3N4 probe. We used the supercritical drying to avoid stiction of the Si3N4 probe with the glass surface and fabricated 4 types of the probe shapes without stiction. We took some interference patterns by CCD and measured the position of them. We calculate the probe height using the interference displacement and compared the result with the theoretical deflection curve. As a result, these interference patterns matched the theoretical deflection curve. We found that this multi-probe chip using interference patterns is effective in measurement for a parallel nano imaging.
Vision for Micro Technology Space Missions. Chapter 2
NASA Technical Reports Server (NTRS)
Dennehy, Neil
2005-01-01
It is exciting to contemplate the various space mission applications that Micro Electro Mechanical Systems (MEMS) technology could enable in the next 10-20 years. The primary objective of this chapter is to both stimulate ideas for MEMS technology infusion on future NASA space missions and to spur adoption of the MEMS technology in the minds of mission designers. This chapter is also intended to inform non-space oriented MEMS technologists, researchers and decision makers about the rich potential application set that future NASA Science and Exploration missions will provide. The motivation for this chapter is therefore to lead the reader down a path to identify and it is exciting to contemplate the various space mission applications that Micro Electro Mechanical Systems (MEMS) technology could enable in the next 10-20 years. The primary objective of this chapter is to both stimulate ideas for MEMS technology infusion on future NASA space missions and to spur adoption of the MEMS technology in the minds of mission designers. This chapter is also intended to inform non-space oriented MEMS technologists, researchers and decision makers about the rich potential application set that future NASA Science and Exploration missions will provide. The motivation for this chapter is therefore to lead the reader down a path to identify and consider potential long-term, perhaps disruptive or revolutionary, impacts that MEMS technology may have for future civilian space applications. A general discussion of the potential for MEMS in space applications is followed by a brief showcasing of a few selected examples of recent MEMS technology developments for future space missions. Using these recent developments as a point of departure, a vision is then presented of several areas where MEMS technology might eventually be exploited in future Science and Exploration mission applications. Lastly, as a stimulus for future research and development, this chapter summarizes a set of barriers to progress, design challenges and key issues that must be overcome in order for the community to move on, from the current nascent phase of developing and infusing MEMS technology into space missions, in order to achieve its full future potential.
NASA Astrophysics Data System (ADS)
Iannacci, J.; Tschoban, C.
2017-04-01
RF-MEMS technology is proposed as a key enabling solution for realising the high-performance and highly reconfigurable passive components that future communication standards will demand. In this work, we present, test and discuss a novel design concept for an 8-bit reconfigurable power attenuator, manufactured using the RF-MEMS technology available at the CMM-FBK, in Italy. The device features electrostatically controlled MEMS ohmic switches in order to select/deselect the resistive loads (both in series and shunt configuration) that attenuate the RF signal, and comprises eight cascaded stages (i.e. 8-bit), thus implementing 256 different network configurations. The fabricated samples are measured (S-parameters) from 10 MHz to 110 GHz in a wide range of different configurations, and modelled/simulated with Ansys HFSS. The device exhibits attenuation levels (S21) in the range from -10 dB to -60 dB, up to 110 GHz. In particular, S21 shows flatness from 15 dB down to 3-5 dB and from 10 MHz to 50 GHz, as well as fewer linear traces up to 110 GHz. A comprehensive discussion is developed regarding the voltage standing wave ratio, which is employed as a quality indicator for the attenuation levels. The margins of improvement at design level which are needed to overcome the limitations of the presented RF-MEMS device are also discussed.
Using two MEMS deformable mirrors in an adaptive optics test bed for multiconjugate correction
NASA Astrophysics Data System (ADS)
Andrews, Jonathan R.; Martinez, Ty; Teare, Scott W.; Restaino, Sergio R.; Wilcox, Christopher C.; Santiago, Freddie; Payne, Don M.
2010-02-01
Adaptive optics systems have advanced considerably over the past decade and have become common tools for optical engineers. The most recent advances in adaptive optics technology have lead to significant reductions in the cost of most of the key components. Most significantly, the cost of deformable elements and wavefront sensor components have dropped to the point where multiple deformable mirrors and Shack- Hartmann array based wavefront sensor cameras can be included in a single system. Matched with the appropriate hardware and software, formidable systems can be operating in nearly any sized research laboratory. The significant advancement of MEMS deformable mirrors has made them very popular for use as the active corrective element in multi-conjugate adaptive optics systems so that, in particular for astronomical applications, this allows correction in more than one plane. The NRL compact AO system and atmospheric simulation systems has now been expanded to support Multi Conjugate Adaptive Optics (MCAO), taking advantage of using the liquid crystal spatial light modulator (SLM) driven aberration generators in two conjugate planes that are well separated spatially. Thus, by using two SLM based aberration generators and two separate wavefront sensors, the system can measure and apply wavefront correction with two MEMS deformable mirrors. This paper describes the multi-conjugate adaptive optics system and the testing and calibration of the system and demonstrates preliminary results with this system.
Converting MEMS technology into profits
NASA Astrophysics Data System (ADS)
Bryzek, Janusz
1998-08-01
This paper discusses issues related to transitioning a company from the advanced technology development phase (with a particular focus on MEMS) to a profitable business, with emphasis on start-up companies. It includes several case studies from (primarily) NovaSensor MEMS development history. These case studies illustrate strategic problems with which advanced MEMS technology developers have to be concerned. Conclusions from these case studies could be used as checkpoints for future MEMS developers to increase probability of profitable operations. The objective for this paper is to share the author's experience from multiple MEMS start-ups to accelerate development of the MEMS market by focusing state- of-the-art technologists on marketing issues.
Long Life MEM Switch Technology
2006-05-23
Dussopt et al. on the two-level switched-capacitors [2], Peroulis et al. on the extended analog varactor [3], B- Kassem at el. on an extended range analog...Katehi, ”Highly reliable analog MEMS varactors,” 2004 IEEE MTT-S Int. Microwave Symp. Dig., vol. 2, pp. 869-872, June 2004. [4] M. Bakri- Kassem , R. R
A multi-conjugate adaptive optics testbed using two MEMS deformable mirrors
NASA Astrophysics Data System (ADS)
Andrews, Jonathan R.; Martinez, Ty; Teare, Scott W.; Restaino, Sergio R.; Wilcox, Christopher C.; Santiago, Freddie; Payne, Don M.
2011-03-01
Adaptive optics (AO) systems are well demonstrated in the literature with both laboratory and real-world systems being developed. Some of these systems have employed MEMS deformable mirrors as their active corrective element. More recent work in AO for astronomical applications has focused on providing correction in more than one conjugate plane. Additionally, horizontal path AO systems are exploring correction in multiple conjugate planes. This provides challenges for a laboratory system as the aberrations need to be generated and corrected in more than one plane in the optical system. Our work with compact AO systems employing MEMS technology in addition to liquid crystal spatial light modulator (SLM) driven aberration generators has been scaled up to a two conjugate plane testbed. Using two SLM based aberration generators and two separate wavefront sensors, the system can apply correction with two MEMS deformable mirrors. The challenges in such a system are to properly match non-identical components and weight the correction algorithm for correcting in two planes. This paper demonstrates preliminary results and analysis with this system with wavefront data and residual error measurements.
Multi-layer plastic/glass microfluidic systems containing electrical and mechanical functionality.
Han, Arum; Wang, Olivia; Graff, Mason; Mohanty, Swomitra K; Edwards, Thayne L; Han, Ki-Ho; Bruno Frazier, A
2003-08-01
This paper describes an approach for fabricating multi-layer microfluidic systems from a combination of glass and plastic materials. Methods and characterization results for the microfabrication technologies underlying the process flow are presented. The approach is used to fabricate and characterize multi-layer plastic/glass microfluidic systems containing electrical and mechanical functionality. Hot embossing, heat staking of plastics, injection molding, microstenciling of electrodes, and stereolithography were combined with conventional MEMS fabrication techniques to realize the multi-layer systems. The approach enabled the integration of multiple plastic/glass materials into a single monolithic system, provided a solution for the integration of electrical functionality throughout the system, provided a mechanism for the inclusion of microactuators such as micropumps/valves, and provided an interconnect technology for interfacing fluids and electrical components between the micro system and the macro world.
Microelectromechanical Systems and Nephrology: The Next Frontier in Renal Replacement Technology
Kim, Steven; Roy, Shuvo
2013-01-01
Microelectromechanical systems (MEMS) is playing a prominent role in the development of many new and innovative biomedical devices, but remains a relatively underutilized technology in nephrology. The future landscape of clinical medicine and research will only see further expansion of MEMS based technologies in device designs and applications. The enthusiasm stems from the ability to create small-scale device features with high precision in a cost effective manner. MEMS also offers the possibility to integrate multiple components into a single device. The adoption of MEMS has the potential to revolutionize how nephrologists manage kidney disease by improving the delivery of renal replacement therapies and enhancing the monitoring of physiologic parameters. To introduce nephrologists to MEMS, this review will first define relevant terms and describe the basic processes used to fabricate MEMS devices. Next, a survey of MEMS devices being developed for various biomedical applications will be illustrated with current examples. Finally, MEMS technology specific to nephrology will be highlighted and future applications will be examined. The adoption of MEMS offers novel avenues to improve the care of kidney disease patients and assist nephrologists in clinical practice. This review will serve as an introduction for nephrologists to the exciting world of MEMS. PMID:24206604
BioMEMS and Lab-on-a-Chip Course Education at West Virginia University
Liu, Yuxin
2011-01-01
With the rapid growth of Biological/Biomedical MicroElectroMechanical Systems (BioMEMS) and microfluidic-based lab-on-a-chip (LOC) technology to biological and biomedical research and applications, demands for educated and trained researchers and technicians in these fields are rapidly expanding. Universities are expected to develop educational plans to address these specialized needs in BioMEMS, microfluidic and LOC science and technology. A course entitled BioMEMS and Lab-on-a-Chip was taught recently at the senior undergraduate and graduate levels in the Department of Computer Science and Electrical Engineering at West Virginia University (WVU). The course focused on the basic principles and applications of BioMEMS and LOC technology to the areas of biomedicine, biology, and biotechnology. The course was well received and the enrolled students had diverse backgrounds in electrical engineering, material science, biology, mechanical engineering, and chemistry. Student feedback and a review of the course evaluations indicated that the course was effective in achieving its objectives. Student presentations at the end of the course were a highlight and a valuable experience for all involved. The course proved successful and will continue to be offered regularly. This paper provides an overview of the course as well as some development and future improvements. PMID:25586697
Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach.
Mariani, Stefano; Ghisi, Aldo; Corigliano, Alberto; Zerbini, Sarah
2009-01-01
Failure of packaged polysilicon micro-electro-mechanical systems (MEMS) subjected to impacts involves phenomena occurring at several length-scales. In this paper we present a multi-scale finite element approach to properly allow for: (i) the propagation of stress waves inside the package; (ii) the dynamics of the whole MEMS; (iii) the spreading of micro-cracking in the failing part(s) of the sensor. Through Monte Carlo simulations, some effects of polysilicon micro-structure on the failure mode are elucidated.
Free-space high data rate communications technologies for near terrestrial space
NASA Astrophysics Data System (ADS)
Edwards, C. L.; Bruzzi, J. R.; Boone, B. G.
2008-08-01
Recent progress at the Applied Physics Laboratory in high data rate communications technology development is described in this paper. System issues for developing and implementing high data rate downlinks from geosynchronous earth orbit to the ground, either for CONUS or in-theater users is considered. Technology is described that supports a viable dual-band multi-channel system concept. Modeling and simulation of micro-electro-mechanical systems (MEMS) beamsteering mirrors has been accomplished to evaluate the potential for this technology to support multi-channel optical links with pointing accuracies approaching 10 microradians. These models were validated experimentally down to levels in which Brownian motion was detected and characterized for single mirror devices only 500 microns across. This multi-channel beamsteering technology can be designed to address environmental compromises to free-space optical links, which derive from turbulence, clouds, as well as spacecraft vibration. Another technology concept is being pursued that is designed to mitigate the adverse effects of weather. It consists of a dual-band (RF/optical) antenna that is optimally designed in both bands simultaneously (e.g., Ku-band and near infrared). This technology would enable optical communications hardware to be seamlessly integrated with existing RF communications hardware on spacecraft platforms, while saving on mass and power, and improving overall system performance. These technology initiatives have been pursued principally because of potential sponsor interest in upgrading existing systems to accommodate quick data recovery and decision support, particularly for the warfighter in future conflicts where the exchange of large data sets such as high resolution imagery would have significant tactical benefits.
CFD-ACE+: a CAD system for simulation and modeling of MEMS
NASA Astrophysics Data System (ADS)
Stout, Phillip J.; Yang, H. Q.; Dionne, Paul; Leonard, Andy; Tan, Zhiqiang; Przekwas, Andrzej J.; Krishnan, Anantha
1999-03-01
Computer aided design (CAD) systems are a key to designing and manufacturing MEMS with higher performance/reliability, reduced costs, shorter prototyping cycles and improved time- to-market. One such system is CFD-ACE+MEMS, a modeling and simulation environment for MEMS which includes grid generation, data visualization, graphical problem setup, and coupled fluidic, thermal, mechanical, electrostatic, and magnetic physical models. The fluid model is a 3D multi- block, structured/unstructured/hybrid, pressure-based, implicit Navier-Stokes code with capabilities for multi- component diffusion, multi-species transport, multi-step gas phase chemical reactions, surface reactions, and multi-media conjugate heat transfer. The thermal model solves the total enthalpy from of the energy equation. The energy equation includes unsteady, convective, conductive, species energy, viscous dissipation, work, and radiation terms. The electrostatic model solves Poisson's equation. Both the finite volume method and the boundary element method (BEM) are available for solving Poisson's equation. The BEM method is useful for unbounded problems. The magnetic model solves for the vector magnetic potential from Maxwell's equations including eddy currents but neglecting displacement currents. The mechanical model is a finite element stress/deformation solver which has been coupled to the flow, heat, electrostatic, and magnetic calculations to study flow, thermal electrostatically, and magnetically included deformations of structures. The mechanical or structural model can accommodate elastic and plastic materials, can handle large non-linear displacements, and can model isotropic and anisotropic materials. The thermal- mechanical coupling involves the solution of the steady state Navier equation with thermoelastic deformation. The electrostatic-mechanical coupling is a calculation of the pressure force due to surface charge on the mechanical structure. Results of CFD-ACE+MEMS modeling of MEMS such as cantilever beams, accelerometers, and comb drives are discussed.
NASA Astrophysics Data System (ADS)
Tanaka, Shuji; Toriyama, Toshiyuki
2005-09-01
This special issue of the Journal of Micromechanics and Microengineering features papers selected from the Fourth International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2004). The workshop was held in Kyoto, Japan, on 28-30 November 2004, by The Ritsumeikan Research Institute of Micro System Technology in cooperation with The Global Emerging Technology Institute, The Institute of Electrical Engineers of Japan, The Sensors and Micromachines Society, The Micromachine Center and The Kyoto Nanotech Cluster. Power MEMS is one of the newest categories of MEMS, which encompasses microdevices and microsystems for power generation, energy conversion and propulsion. The first concept of power MEMS was proposed in the late 1990s by Epstein's group at the Massachusetts Institute of Technology, where they continue to study MEMS-based gas turbine generators. Since then, the research and development of power MEMS have been promoted by the need for compact power sources with high energy and power density. Since its inception, power MEMS has expanded to include not only various MEMS-based power generators but also small energy machines and microdevices for macro power generators. At the last workshop, various devices and systems, such as portable fuel cells and their peripherals, micro and small turbo machinery, energy harvesting microdevices, and microthrusters, were presented. Their power levels vary from ten nanowatts to hundreds of watts, spanning ten orders of magnitude. The first PowerMEMS workshop was held in 2000 in Sendai, Japan, and consisted of only seven invited presentations. The workshop has grown since then, and in 2004 there were 5 invited, 20 oral and 29 poster presentations. From the 54 papers in the proceedings, 12 papers have been selected for this special issue. I would like to express my appreciation to the members of the Organizing Committee and Technical Program Committee. This special issue was edited in collaboration with Professor Toshiyuki Toriyama (Ritsumeikan University), Co-chair of the Technical Program Committee, and the Institute of Physics Publishing staff.
Modeling methods of MEMS micro-speaker with electrostatic working principle
NASA Astrophysics Data System (ADS)
Tumpold, D.; Kaltenbacher, M.; Glacer, C.; Nawaz, M.; Dehé, A.
2013-05-01
The market for mobile devices like tablets, laptops or mobile phones is increasing rapidly. Device housings get thinner and energy efficiency is more and more important. Micro-Electro-Mechanical-System (MEMS) loudspeakers, fabricated in complementary metal oxide semiconductor (CMOS) compatible technology merge energy efficient driving technology with cost economical fabrication processes. In most cases, the fabrication of such devices within the design process is a lengthy and costly task. Therefore, the need for computer modeling tools capable of precisely simulating the multi-field interactions is increasing. The accurate modeling of such MEMS devices results in a system of coupled partial differential equations (PDEs) describing the interaction between the electric, mechanical and acoustic field. For the efficient and accurate solution we apply the Finite Element (FE) method. Thereby, we fully take the nonlinear effects into account: electrostatic force, charged moving body (loaded membrane) in an electric field, geometric nonlinearities and mechanical contact during the snap-in case between loaded membrane and stator. To efficiently handle the coupling between the mechanical and acoustic fields, we apply Mortar FE techniques, which allow different grid sizes along the coupling interface. Furthermore, we present a recently developed PML (Perfectly Matched Layer) technique, which allows limiting the acoustic computational domain even in the near field without getting spurious reflections. For computations towards the acoustic far field we us a Kirchhoff Helmholtz integral (e.g, to compute the directivity pattern). We will present simulations of a MEMS speaker system based on a single sided driving mechanism as well as an outlook on MEMS speakers using double stator systems (pull-pull-system), and discuss their efficiency (SPL) and quality (THD) towards the generated acoustic sound.
Controlling Variable Emittance (MEMS) Coatings for Space Applications
NASA Technical Reports Server (NTRS)
Farrar, D.; Schneider, W.; Osiander, R.; Champion, J. L.; Darrin, A. G.; Douglas, Donya; Swanson, Ted D.
2003-01-01
Small spacecraft, including micro and nanosats, as they are envisioned for future missions, will require an alternative means to achieve thermal control due to their small power and mass budgets. One of the proposed alternatives is Variable Emittance (Vari-E) Coatings for spacecraft radiators. Space Technology-5 (ST-5) is a technology demonstration mission through NASA Goddard Space Flight Center (GSFC) that will utilize Vari-E Coatings. This mission involves a constellation of three (3) satellites in a highly elliptical orbit with a perigee altitude of approximately 200 kilometers and an apogee of approximately 38,000 kilometers. Such an environment will expose the spacecraft to a wide swing in the thermal and radiation environment of the earth's atmosphere. There are three (3) different technologies associated with this mission. The three technologies are electrophoretic, electrochromic, and Micro ElectroMechanical Systems (MEMS). The ultimate goal is to make use of Van-E coatings, in order to achieve various levels of thermal control. The focus of this paper is to highlight the Vari-E Coating MEMS instrument, with an emphasis on the Electronic Control Unit responsible for operating the MEMS device. The Test & Evaluation approach, along with the results, is specific for application on ST-5, yet the information provides a guideline for future experiments and/or thermal applications on the exterior structure of a spacecraft.
NASA Technical Reports Server (NTRS)
Lyke, J. C.; Michalicek, M. A.; Singaraju, B. K.
1995-01-01
Micro-electro-mechanical systems (MEMS) provide an emerging technology that has the potential for revolutionizing the way space systems are designed, assembled, and tested. The high launch costs of current space systems are a major determining factor in the amount of functionality that can be integrated in a typical space system. MEMS devices have the ability to increase the functionality of selected satellite subsystems while simultaneously decreasing spacecraft weight. The Air Force Phillips Laboratory (PL) is supporting the development of a variety of MEMS related technologies as one of several methods to reduce the weight of space systems and increase their performance. MEMS research is a natural extension of PL research objectives in micro-electronics and advanced packaging. Examples of applications that are under research include on-chip micro-coolers, micro-gyroscopes, vibration sensors, and three-dimensional packaging technologies to integrate electronics with MEMS devices. The first on-orbit space flight demonstration of these and other technologies is scheduled for next year.
Human Pulse Wave Measurement by MEMS Electret Condenser Microphone
NASA Astrophysics Data System (ADS)
Nomura, Shusaku; Hanasaka, Yasushi; Ishiguro, Tadashi; Ogawa, Hiroshi
A micro Electret Condenser Microphone (ECM) fabricated by Micro Electro Mechanical System (MEMS) technology was employed as a novel apparatus for human pulse wave measurement. Since ECM frequency response characteristic, i.e. sensitivity, logically maintains a constant level at lower than the resonance frequency (stiffness control), the slightest pressure difference at around 1.0Hz generated by human pulse wave is expected to detect by MEMS-ECM. As a result of the verification of frequency response of MEMS-ECM, it was found that -20dB/dec of reduction in the sensitivity around 1.0Hz was engendered by a high input-impedance amplifier, i.e. the field effect transistor (FET), mounted near MEMS chip for amplifying tiny ECM signal. Therefore, MEMS-ECM is assumed to be equivalent with a differentiation circuit at around human pulse frequency. Introducing compensation circuit, human pulse wave was successfully obtained. In addition, the radial and ulnar artery tracing, and pulse wave velocity measurement at forearm were demonstrated; as illustrating a possible application of this micro device.
MEMS testing and applications in automotive and aerospace industries
NASA Astrophysics Data System (ADS)
Ma, Zhichun; Chen, Xuyuan
2009-05-01
MEMS technology combines micromachining and integrated circuit fabrication technologies to produce highly reliable MEMS transducers. This paper presents an overview of MEMS transducers applications, particularly in automotive and aerospace industries, which includes inertia sensors for safety, navigation, and guidance control, thermal anemometer for temperature and heat-flux sensors in engine applications, MEMS atomizers for fuel injection, and micromachined actuators for flow control applications. Design examples for the devices in above mentioned applications are also presented and test results are given.
Projection displays and MEMS: timely convergence for a bright future
NASA Astrophysics Data System (ADS)
Hornbeck, Larry J.
1995-09-01
Projection displays and microelectromechanical systems (MEMS) have evolved independently, occasionally crossing paths as early as the 1950s. But the commercially viable use of MEMS for projection displays has been illusive until the recent invention of Texas Instruments Digital Light Processing TM (DLP) technology. DLP technology is based on the Digital Micromirror DeviceTM (DMD) microchip, a MEMS technology that is a semiconductor digital light switch that precisely controls a light source for projection display and hardcopy applications. DLP technology provides a unique business opportunity because of the timely convergence of market needs and technology advances. The world is rapidly moving to an all- digital communications and entertainment infrastructure. In the near future, most of the technologies necessary for this infrastrucutre will be available at the right performance and price levels. This will make commercially viable an all-digital chain (capture, compression, transmission, reception decompression, hearing, and viewing). Unfortunately, the digital images received today must be translated into analog signals for viewing on today's televisions. Digital video is the final link in the all-digital infrastructure and DLP technoogy provides that link. DLP technology is an enabler for digital, high-resolution, color projection displays that have high contrast, are bright, seamless, and have the accuracy of color and grayscale that can be achieved only by digital control. This paper contains an introduction to DMD and DLP technology, including the historical context from which to view their developemnt. The architecture, projection operation, and fabrication are presented. Finally, the paper includes an update about current DMD business opportunities in projection displays and hardcopy.
NASA Astrophysics Data System (ADS)
Michalicek, M. Adrian; Comtois, John H.; Schriner, Heather K.
1998-04-01
This paper describes the design and characterization of several types of micromirror devices to include process capabilities, device modeling, and test data resulting in deflection versus applied potential curves and surface contour measurements. These devices are the first to be fabricated in the state-of-the-art four-level planarized polysilicon process available at Sandia National Laboratories known as the Sandia Ultra-planar Multi-level MEMS Technology. This enabling process permits the development of micromirror devices with near-ideal characteristics which have previously been unrealizable in standard three-layer polysilicon processes. This paper describes such characteristics which have previously been unrealizable in standard three-layer polysilicon processes. This paper describes such characteristics as elevated address electrodes, various address wiring techniques, planarized mirror surfaces suing Chemical Mechanical Polishing, unique post-process metallization, and the best active surface area to date.
Design and simulation of multi-color infrared CMOS metamaterial absorbers
NASA Astrophysics Data System (ADS)
Cheng, Zhengxi; Chen, Yongping; Ma, Bin
2016-05-01
Metamaterial electromagnetic wave absorbers, which usually can be fabricated in a low weight thin film structure, have a near unity absorptivity in a special waveband, and therefore have been widely applied from microwave to optical waveband. To increase absorptance of CMOS MEMS devices in 2-5 μmm waveband, multi-color infrared metamaterial absorbers are designed with CSMC 0.5 μmm 2P3M and 0.18 μmm 1P6M CMOS technology in this work. Metal-insulator-metal (MIM) three-layer MMAs and Insulator-metal-insulator-metal (MIMI) four-layer MMAs are formed by CMOS metal interconnect layers and inter metal dielectrics layer. To broaden absorption waveband in 2-5μmm range, MMAs with a combination of different sizes cross bars are designed. The top metal layer is a periodic aluminum square array or cross bar array with width ranging from submicron to several microns. The absorption peak position and intensity of MMAs can be tuned by adjusting the top aluminum micro structure array. Post-CMOS process is adopted to fabricate MMAs. The infrared absorption spectra of MMAs are verified with finite element method simulation, and the effects of top metal structure sizes, patterns, and films thickness are also simulated and intensively discussed. The simulation results show that CMOS MEMS MMAs enhance infrared absorption in 2-20 μmm. The MIM broad MMA has an average absorptance of 0.22 in 2-5 μmm waveband, and 0.76 in 8-14 μm waveband. The CMOS metamaterial absorbers can be inherently integrated in many kinds of MEMS devices fabricated with CMOS technology, such as uncooled bolometers, infrared thermal emitters.
Progress and opportunities in high-voltage microactuator powering technology towards one-chip MEMS
NASA Astrophysics Data System (ADS)
Mita, Yoshio; Hirakawa, Atsushi; Stefanelli, Bruno; Mori, Isao; Okamoto, Yuki; Morishita, Satoshi; Kubota, Masanori; Lebrasseur, Eric; Kaiser, Andreas
2018-04-01
In this paper, we address issues and solutions for micro-electro-mechanical-systems (MEMS) powering through semiconductor devices towards one-chip MEMS, especially those with microactuators that require high voltage (HV, which is more than 10 V, and is often over 100 V) for operation. We experimentally and theoretically demonstrated that the main reason why MEMS actuators need such HV is the tradeoff between resonant frequency and displacement amplitude. Indeed, the product of frequency and displacement is constant regardless of the MEMS design, but proportional to the input energy, which is the square of applied voltage in an electrostatic actuator. A comprehensive study on the principles of HV device technology and associated circuit technologies, especially voltage shifter circuits, was conducted. From the viewpoint of on-chip energy source, series-connected HV photovoltaic cells have been discussed. Isolation and electrical connection methods were identified to be key enabling technologies. Towards future rapid development of such autonomous devices, a technology to convert standard 5 V CMOS devices into HV circuits using SOI substrate and a MEMS postprocess is presented. HV breakdown experiments demonstrated this technology can hold over 700 to 1000 V, depending on the layout.
Data fusion algorithm for rapid multi-mode dust concentration measurement system based on MEMS
NASA Astrophysics Data System (ADS)
Liao, Maohao; Lou, Wenzhong; Wang, Jinkui; Zhang, Yan
2018-03-01
As single measurement method cannot fully meet the technical requirements of dust concentration measurement, the multi-mode detection method is put forward, as well as the new requirements for data processing. This paper presents a new dust concentration measurement system which contains MEMS ultrasonic sensor and MEMS capacitance sensor, and presents a new data fusion algorithm for this multi-mode dust concentration measurement system. After analyzing the relation between the data of the composite measurement method, the data fusion algorithm based on Kalman filtering is established, which effectively improve the measurement accuracy, and ultimately forms a rapid data fusion model of dust concentration measurement. Test results show that the data fusion algorithm is able to realize the rapid and exact concentration detection.
MEMS: A new approach to micro-optics
DOE Office of Scientific and Technical Information (OSTI.GOV)
Sniegowski, J.J.
1997-12-31
MicroElectroMechanical Systems (MEMS) and their fabrication technologies provide great opportunities for application to micro-optical systems (MOEMS). Implementing MOEMS technology ranges from simple, passive components to complicated, active systems. Here, an overview of polysilicon surface micromachining MEMS combined with optics is presented. Recent advancements to the technology, which may enhance its appeal for micro-optics applications are emphasized. Of all the MEMS fabrication technologies, polysilicon surface micromachining technology has the greatest basis in and leverages the most the infrastructure for silicon integrated circuit fabrication. In that respect, it provides the potential for very large volume, inexpensive production of MOEMS. This paper highlightsmore » polysilicon surface micromachining technology in regards to its capability to provide both passive and active mechanical elements with quality optical elements.« less
BioMEMS for multiparameter clinical monitoring
NASA Astrophysics Data System (ADS)
Moser, Isabella
2003-01-01
For diabetes patients glucose monitoring means an important improvement of their life quality and additionally it is a $3-billion-a-year business. Continuous glucose monitoring provides gapless glucose level control, an early warning of hypoglycemia, and is intended to control insulin pumps. An upgrading to multi-parameter monitoring would not only benefit patients with severe metabolism defects but also the metabolism of diabetes patient could be better controlled by monitoring an additional parameter like lactate. Multi-parameter monitoring devices are not commercially available, one of the complications in the integration of different biosensors using the same detecting molecule for all analytes is chemical cross talk between adjacent amperometric biosensors. Recently some integrated biosensors were published but either they were not mass producible or they were realized in an expensive silicon based technology. In addition to it most of them were not tested under monitoring conditions but their integration principles will be discussed. As an example a low cost multi- parameter microsystem and some applications of it in clinical diagnosis will be presented. Also an overlook of non-invasive methods and (minimal) invasive methods will be given with a focus on microdialysis.
New dynamic silicon photonic components enabled by MEMS technology
NASA Astrophysics Data System (ADS)
Errando-Herranz, Carlos; Edinger, Pierre; Colangelo, Marco; Björk, Joel; Ahmed, Samy; Stemme, Göran; Niklaus, Frank; Gylfason, Kristinn B.
2018-02-01
Silicon photonics is the study and application of integrated optical systems which use silicon as an optical medium, usually by confining light in optical waveguides etched into the surface of silicon-on-insulator (SOI) wafers. The term microelectromechanical systems (MEMS) refers to the technology of mechanics on the microscale actuated by electrostatic actuators. Due to the low power requirements of electrostatic actuation, MEMS components are very power efficient, making them well suited for dense integration and mobile operation. MEMS components are conventionally also implemented in silicon, and MEMS sensors such as accelerometers, gyros, and microphones are now standard in every smartphone. By combining these two successful technologies, new active photonic components with extremely low power consumption can be made. We discuss our recent experimental work on tunable filters, tunable fiber-to-chip couplers, and dynamic waveguide dispersion tuning, enabled by the marriage of silicon MEMS and silicon photonics.
Dynamic MEMS devices for multi-axial fatigue and elastic modulus measurement
NASA Astrophysics Data System (ADS)
White, Carolyn D.; Xu, Rui; Sun, Xiaotian; Komvopoulos, Kyriakos
2003-01-01
For reliable MEMS device fabrication and operation, there is a continued demand for precise characterization of materials at the micron scale. This paper presents a novel material characterization device for fatigue lifetime testing. The fatigue specimen is subjected to multi-axial loading, which is typical of most MEMS devices. Polycrystalline silicon (polysilicon) fatigue devices were fabricated using the MUMPS process with a three layer mask process ground plane, anchor, and structural layer of polysilicon. A fatigue device consists of two or three beams, attached to a rotating ring and anchored to the substrate on each end. In order to generate a sufficiently large stress, the fatigue devices were tested in resonance to produce a von Mises equivalent stress as high as 1 GPa, which is in the fracture strength range reported for polysilicon. A further increase of the stress in the beam specimens was obtained by introducing a notch with a focused ion beam. The notch resulted into a stress concentration factor of about 3.8, thereby producing maximum von Mises equivalent stress in the range of 1 through 4 GPa. This study provides insight into multi-axial fatigue testing under typical MEMS conditions and additional information about micron-scale polysilicon mechanical behavior, which is the current basic building material for MEMS devices.
Manufacturing process and material selection in concurrent collaborative design of MEMS devices
NASA Astrophysics Data System (ADS)
Zha, Xuan F.; Du, H.
2003-09-01
In this paper we present knowledge of an intensive approach and system for selecting suitable manufacturing processes and materials for microelectromechanical systems (MEMS) devices in concurrent collaborative design environment. In the paper, fundamental issues on MEMS manufacturing process and material selection such as concurrent design framework, manufacturing process and material hierarchies, and selection strategy are first addressed. Then, a fuzzy decision support scheme for a multi-criteria decision-making problem is proposed for estimating, ranking and selecting possible manufacturing processes, materials and their combinations. A Web-based prototype advisory system for the MEMS manufacturing process and material selection, WebMEMS-MASS, is developed based on the client-knowledge server architecture and framework to help the designer find good processes and materials for MEMS devices. The system, as one of the important parts of an advanced simulation and modeling tool for MEMS design, is a concept level process and material selection tool, which can be used as a standalone application or a Java applet via the Web. The running sessions of the system are inter-linked with webpages of tutorials and reference pages to explain the facets, fabrication processes and material choices, and calculations and reasoning in selection are performed using process capability and material property data from a remote Web-based database and interactive knowledge base that can be maintained and updated via the Internet. The use of the developed system including operation scenario, use support, and integration with an MEMS collaborative design system is presented. Finally, an illustration example is provided.
NASA Astrophysics Data System (ADS)
Hebling, C.; Woias, P.
2008-10-01
This special issue of Journal of Micromechanics and Microengineering (JMM) contains a selection of papers from the 7th International Workshop on Micro and Nanotechnologies for Power Generation and Energy Conversion (PowerMEMS 2007). The workshop was held in Freiburg, Germany on 27-29 November 2007 under the joint organization of the Fraunhofer Institute for Solar Energy Systems (FhG-ISE), Freiburg and the Department of Microsystems Engineering (IMTEK) of the Albert-Ludwig-University of Freiburg. PowerMEMS 2007 continues a series of workshops initiated in 2000 in Japan to create an annual discussion forum in the emerging field of micro energy technology. With a single exception in 2001, the workshop has continued as an annual meeting ever since, with a continuous increase in the number of presentations and participants. The program of PowerMEMS 2007 was composed of 2 invited talks, 25 oral talks and 61 poster presentations. From these 88 presentations 16 have been selected for this special issue. It was at the end of 1959 when the Caltech physicist Richard Feynman gave his famous lecture entitled 'There Is Plenty of Room at the Bottom' in which he discussed the possibilities of miniaturization for both storage capacity ('Encyclopaedia Britannica on the head of a pin') as well as micro machining ('rearranging the atoms'), although there were absolutely no technological possibilities in sight for an adequate realization of such ideas. Now, nearly 50 years later, we not only have incredible knowledge about the nanoworld, but even more we are now able to generate microelectromechanical devices which, next to their electronic properties, can integrate physical and analytical functions. Today, Feynman might easily have added a second lecture entitled 'There is Plenty of Energy at the Bottom'. Micro energy technology has seen a tremendous rise in MEMS and material sciences and is regarded today as one of their hot topics. Also, there are more and more companies in this field trying to commercialize micro energy harvesting devices, micro thermo-photovoltaics or micro fuel cells in order to make an impact on our daily life. It is interesting to see the remarkable scientific dynamics and innovations in micro energy technology that have been mirrored in the scope of consecutive PowerMEMS workshops. Micro fuel cells, micro combustion systems and heat engines have been on-going topics from the beginning due to their promising power densities and high power levels up to hundreds of watts. At the other end of the power scale micro energy harvesting has entered the stage, with a remarkable growth rate of presentations during the last three workshops, towering over all other topics with 33 presentations at PowerMEMS 2007. Another significant trend is the slow but steady emergence of electronic energy management as a future key technology. As Guest Editors of this special issue we would like to express our appreciation to the members of the Organizing Committee and the Technical Program Committee of PowerMEMS for their on-going efforts. By selecting the research fields mentioned above they formed the PowerMEMS 2007 program as a comprehensive digest of today's micro energy technology that is reflected, along with selected high quality publications, in this special issue of JMM. We hope that this work will stimulate further innovative research in micro energy technology and will help to mark the trail for further progress in this exciting field of MEMS science and technology.
Novel Low Loss Wide-Band Multi-Port Integrated Circuit Technology for RF/Microwave Applications
NASA Technical Reports Server (NTRS)
Simons, Rainee N.; Goverdhanam, Kavita; Katehi, Linda P. B.; Burke, Thomas P. (Technical Monitor)
2001-01-01
In this paper, novel low loss, wide-band coplanar stripline technology for radio frequency (RF)/microwave integrated circuits is demonstrated on high resistivity silicon wafer. In particular, the fabrication process for the deposition of spin-on-glass (SOG) as a dielectric layer, the etching of microvias for the vertical interconnects, the design methodology for the multiport circuits and their measured/simulated characteristics are graphically illustrated. The study shows that circuits with very low loss, large bandwidth, and compact size are feasible using this technology. This multilayer planar technology has potential to significantly enhance RF/microwave IC performance when combined with semi-conductor devices and microelectromechanical systems (MEMS).
NASA Astrophysics Data System (ADS)
Iannacci, J.; Sordo, G.; Serra, E.; Kucera, M.; Schmid, U.
2015-05-01
In this work, we discuss the verification and preliminary experimental characterization of a MEMS-based vibration Energy Harvester (EH) design. The device, named Four-Leaf Clover (FLC), is based on a circular-shaped mechanical resonator with four petal-like mass-spring cascaded systems. This solution introduces several mechanical Degrees of Freedom (DOFs), and therefore enables multiple resonant modes and deformation shapes in the vibrations frequency range of interest. The target is to realize a wideband multi-modal EH-MEMS device, that overcomes the typical narrowband working characteristics of standard cantilevered EHs, by ensuring flexible and adaptable power source to ultra-low power electronics for integrated remote sensing nodes (e.g. Wireless Sensor Networks - WSNs) in the Internet of Things (IoT) scenario, aiming to self-powered and energy autonomous smart systems. Finite Element Method simulations of the FLC EH-MEMS show the presence of several resonant modes for vibrations up to 4-5 kHz, and level of converted power up to a few μW at resonance and in closed-loop conditions (i.e. with resistive load). On the other hand, the first experimental tests of FLC fabricated samples, conducted with a Laser Doppler Vibrometer (LDV), proved the presence of several resonant modes, and allowed to validate the accuracy of the FEM modeling method. Such a good accordance holds validity for what concerns the coupled field behavior of the FLC EH-MEMS, as well. Both measurements and simulations performed at 190 Hz (i.e. out of resonance) showed the generation of power in the range of nW (Root Mean Square - RMS values). Further steps of this work will include the experimental characterization in a full range of vibrations, aiming to prove the whole functionality of the FLC EH-MEMS proposed design concept.
A low-loss, single-pole, four-throw RF MEMS switch driven by a double stop comb drive
NASA Astrophysics Data System (ADS)
Kang, S.; Kim, H. C.; Chun, K.
2009-03-01
Our goal was to develop a single-pole four-throw (SP4T) radio frequency microelectromechanical system (RF MEMS) switch for band selection in a multi-band, multi-mode, front-end module of a wireless transceiver system. The SP4T RF MEMS switch was based on an arrangement of four single-pole single-throw (SPST) RF MEMS switches. The SP4T RF MEMS switch was driven by a double stop (DS) comb drive, with a lateral resistive contact, and composed of single crystalline silicon (SCS) on glass. A large contact force at a low-drive voltage was achieved by electrostatic actuation of the DS comb drive. Good RF characteristics were achieved by the large contact force and the lateral resistive Au-to-Au contact. Mechanical reliability was achieved by using SCS which has no residual stress as a structure material. The developed SP4T RF MEMS switch has a drive voltage of 15 V, an insertion loss below 0.31 dB at 6 GHz after more than one million cycles under a 10 mW signal, a return loss above 20 dB and an isolation value above 36 dB.
NASA Astrophysics Data System (ADS)
Tapilouw, Abraham Mario; Chen, Liang-Chia; Xuan-Loc, Nguyen; Chen, Jin-Liang
2014-08-01
A Micro-electro-mechanical-system (MEMS) is a widely used component in many industries, including energy, biotechnology, medical, communications, and automotive industries. However, effective inspection systems are also needed to ensure the functional reliability of MEMS. This study developed a stroboscopic coherence scanning Interferometry (SCSI) technique for measuring key characteristics typically used as criteria in MEMS inspections. Surface profiles of MEMS both static and dynamic conditions were measured by means of coherence scanning Interferometry (CSI). Resonant frequencies of vibrating MEMS were measured by deformation of interferogram fringes for out-of-plane vibration and by image correlation for in-plane vibration. The measurement bandwidth of the developed system can be tuned up to three megahertz or higher for both in-plane and out-of-plane measurement of MEMS.
3D printed polymers toxicity profiling: a caution for biodevice applications
NASA Astrophysics Data System (ADS)
Zhu, Feng; Skommer, Joanna; Friedrich, Timo; Kaslin, Jan; Wlodkowic, Donald
2015-12-01
A recent revolution in additive manufacturing technologies and access to 3D Computer Assisted Design (CAD) software has spurred an explosive growth of new technologies in biomedical engineering. This includes biomodels for diagnosis, surgical training, hard and soft tissue replacement, biodevices and tissue engineering. Moreover, recent developments in high-definition additive manufacturing systems such as Multi-Jet Modelling (MJM) and Stereolithography (SLA), capable of reproducing feature sizes close to 100 μm, promise brand new capabilities in fabrication of optical-grade biomicrofluidic Lab-on-a-Chip and MEMS devices. Compared with other rapid prototyping technologies such as soft lithography and infrared laser micromachining in PMMA, SLA and MJM systems can enable user-friendly production of prototypes, superior feature reproduction quality and comparable levels of optical transparency. Prospectively they can revolutionize fabrication of microfluidic devices with complex geometric features and eliminate the need to use clean room environment and conventional microfabrication techniques. In this work we demonstrate preliminary data on toxicity profiling of a panel of common polymers used in 3D printing applications. The main motivation of our work was to evaluate toxicity profiles of most commonly used polymers using standardized biotests according to OECD guidelines for testing of chemic risk assessment. Our work for the first time provides a multispecies view of potential dangers and limitation for building biocompatible devices using FDM, SLA and MJM additive manufacturing systems. Our work shows that additive manufacturing holds significant promise for fabricating LOC and MEMS but requires caution when selecting systems and polymers due to toxicity exhibited by some 3D printing polymers.
MEMS Reaction Control and Maneuvering for Picosat Beyond LEO
NASA Technical Reports Server (NTRS)
Alexeenko, Alina
2016-01-01
The MEMS Reaction Control and Maneuvering for Picosat Beyond LEO project will further develop a multi-functional small satellite technology for low-power attitude control, or orientation, of picosatellites beyond low Earth orbit (LEO). The Film-Evaporation MEMS Tunable Array (FEMTA) concept initially developed in 2013, is a thermal valving system which utilizes capillary forces in a microchannel to offset internal pressures in a bulk fluid. The local vapor pressure is increased by resistive film heating until it exceeds meniscus strength in a nozzle which induces vacuum boiling and provides a stagnation pressure equal to vapor pressure at that point which is used for propulsion. Interplanetary CubeSats can utilize FEMTA for high slew rate attitude corrections in addition to desaturating reaction wheels. The FEMTA in cooling mode can be used for thermal control during high-power communication events, which are likely to accompany the attitude correction. Current small satellite propulsion options are limited to orbit correction whereas picosatellites are lacking attitude control thrusters. The available attitude control systems are either quickly saturated reaction wheels or movable high drag surfaces with long response times.
Piezoelectric microelectromechanical resonant sensors for chemical and biological detection.
Pang, Wei; Zhao, Hongyuan; Kim, Eun Sok; Zhang, Hao; Yu, Hongyu; Hu, Xiaotang
2012-01-07
Piezoelectric microelectromechanical systems (MEMS) resonant sensors, known for their excellent mass resolution, have been studied for many applications, including DNA hybridization, protein-ligand interactions, and immunosensor development. They have also been explored for detecting antigens, organic gas, toxic ions, and explosives. Most piezoelectric MEMS resonant sensors are acoustic sensors (with specific coating layers) that enable selective and label-free detection of biological events in real time. These label-free technologies have recently garnered significant attention for their sensitive and quantitative multi-parameter analysis of biological systems. Since piezoelectric MEMS resonant sensors do more than transform analyte mass or thickness into an electrical signal (e.g., frequency and impedance), special attention must be paid to their potential beyond microweighing, such as measuring elastic and viscous properties, and several types of sensors currently under development operate at different resonant modes (i.e., thickness extensional mode, thickness shear mode, lateral extensional mode, flexural mode, etc.). In this review, we provide an overview of recent developments in micromachined resonant sensors and activities relating to biochemical interfaces for acoustic sensors.
Calibration of High Frequency MEMS Microphones
NASA Technical Reports Server (NTRS)
Shams, Qamar A.; Humphreys, William M.; Bartram, Scott M.; Zuckewar, Allan J.
2007-01-01
Understanding and controlling aircraft noise is one of the major research topics of the NASA Fundamental Aeronautics Program. One of the measurement technologies used to acquire noise data is the microphone directional array (DA). Traditional direction array hardware, consisting of commercially available condenser microphones and preamplifiers can be too expensive and their installation in hard-walled wind tunnel test sections too complicated. An emerging micro-machining technology coupled with the latest cutting edge technologies for smaller and faster systems have opened the way for development of MEMS microphones. The MEMS microphone devices are available in the market but suffer from certain important shortcomings. Based on early experiments with array prototypes, it has been found that both the bandwidth and the sound pressure level dynamic range of the microphones should be increased significantly to improve the performance and flexibility of the overall array. Thus, in collaboration with an outside MEMS design vendor, NASA Langley modified commercially available MEMS microphone as shown in Figure 1 to meet the new requirements. Coupled with the design of the enhanced MEMS microphones was the development of a new calibration method for simultaneously obtaining the sensitivity and phase response of the devices over their entire broadband frequency range. Over the years, several methods have been used for microphone calibration. Some of the common methods of microphone calibration are Coupler (Reciprocity, Substitution, and Simultaneous), Pistonphone, Electrostatic actuator, and Free-field calibration (Reciprocity, Substitution, and Simultaneous). Traditionally, electrostatic actuators (EA) have been used to characterize air-condenser microphones for wideband frequency ranges; however, MEMS microphones are not adaptable to the EA method due to their construction and very small diaphragm size. Hence a substitution-based, free-field method was developed to calibrate these microphones at frequencies up to 80 kHz. The technique relied on the use of a random, ultrasonic broadband centrifugal sound source located in a small anechoic chamber. Phase calibrations of the MEMS microphones were derived from cross spectral phase comparisons between the reference and test substitution microphones and an adjacent and invariant grazing-incidence 1/8-inch standard microphone.
Development of the micro pixel chamber based on MEMS technology
NASA Astrophysics Data System (ADS)
Takemura, T.; Takada, A.; Kishimoto, T.; Komura, S.; Kubo, H.; Matsuoka, Y.; Miuchi, K.; Miyamoto, S.; Mizumoto, T.; Mizumura, Y.; Motomura, T.; Nakamasu, Y.; Nakamura, K.; Oda, M.; Ohta, K.; Parker, J. D.; Sawano, T.; Sonoda, S.; Tanimori, T.; Tomono, D.; Yoshikawa, K.
2018-02-01
Micro pixel chambers (μ-PIC) are gaseous two-dimensional imaging detectors originally manufactured using printed circuit board (PCB) technology. They are used in MeV gamma-ray astronomy, medicalimaging, neutron imaging, the search for dark matter, and dose monitoring. The position resolution of the present μ-PIC is approximately 120 μm (RMS), however some applications require a fine position resolution of less than 100 μm. To this end, we have started to develop a μ-PIC based on micro electro mechanical system (MEMS) technology, which provides better manufacturing accuracy than PCB technology. Our simulation predicted the gains of MEMS μ-PICs to be twice those of PCB μ-PICs at the same anode voltage. We manufactured two MEMS μ-PICs and tested them to study their behavior. In these experiments, we successfully operated the fabricatedMEMS μ-PICs and we achieved a maximum gain of approximately 7×103 and collected their energy spectra under irradiation of X-rays from 55Fe. However, the measured gains of the MEMS μ-PICs were less than half of the values predicted in the simulations. We postulated that the gains of the MEMS μ-PICs are diminished by the effect of the silicon used as a semiconducting substrate.
NASA Astrophysics Data System (ADS)
Chang, Hung-Pin; Qian, Jiangyuan; Bachman, Mark; Congdon, Philip; Li, Guann-pyng
2002-07-01
A novel planarization technique, compressive molding planarization (CMP) is developed for implementation of a multi-layered micro coil device. Applying CMP and other micromachining techniques, a multi-layered micro coil device has been designed and fabricated, and its use in the magnetic micro actuators for hard disk drive applications has been demonstrated, showing that it can produce milli-Newton of magnetic force suitable for driving a micro actuator. The novel CMP technique can be equally applicable in other MEMS devices fabrication to ease the process integration for the complicated structure.
Deep anisotropic ICP plasma etching designed for high-volume MEMS manufacturing
NASA Astrophysics Data System (ADS)
Yu, Keven; Feldbaum, Michael; Pandhumsoporn, Tam; Gadgil, Prashant
1999-08-01
ICP plasma etching is gaining widespread acceptance as an enabling micromachining technology for advanced MEMS fabrication. Whereas this technology has shown a capability of delivering multiple novel applications for R and D, its acceptance by industry for high volume production has been limited. This acceptance into production will only occur when the plasma etching equipment with this technology offers the device performance, throughput, reliability, and uptime criteria required by a production facility. The design of the plasma etcher using this technology and the process capability it consequently delivers, has significant implications in making this a reality. Alcatel has been supplying such a technology to this MEMS industry for over 5 years and in the interim has evolved its product and process to make this technology production worthy. Alcatel's next generation etcher, the Alcatel 601E, offers multiple advantages to MEMS manufacturers in realizing their production goals.
Aligner optimization increases accuracy and decreases compute times in multi-species sequence data.
Robinson, Kelly M; Hawkins, Aziah S; Santana-Cruz, Ivette; Adkins, Ricky S; Shetty, Amol C; Nagaraj, Sushma; Sadzewicz, Lisa; Tallon, Luke J; Rasko, David A; Fraser, Claire M; Mahurkar, Anup; Silva, Joana C; Dunning Hotopp, Julie C
2017-09-01
As sequencing technologies have evolved, the tools to analyze these sequences have made similar advances. However, for multi-species samples, we observed important and adverse differences in alignment specificity and computation time for bwa- mem (Burrows-Wheeler aligner-maximum exact matches) relative to bwa-aln. Therefore, we sought to optimize bwa-mem for alignment of data from multi-species samples in order to reduce alignment time and increase the specificity of alignments. In the multi-species cases examined, there was one majority member (i.e. Plasmodium falciparum or Brugia malayi ) and one minority member (i.e. human or the Wolbachia endosymbiont w Bm) of the sequence data. Increasing bwa-mem seed length from the default value reduced the number of read pairs from the majority sequence member that incorrectly aligned to the reference genome of the minority sequence member. Combining both source genomes into a single reference genome increased the specificity of mapping, while also reducing the central processing unit (CPU) time. In Plasmodium , at a seed length of 18 nt, 24.1 % of reads mapped to the human genome using 1.7±0.1 CPU hours, while 83.6 % of reads mapped to the Plasmodium genome using 0.2±0.0 CPU hours (total: 107.7 % reads mapping; in 1.9±0.1 CPU hours). In contrast, 97.1 % of the reads mapped to a combined Plasmodium- human reference in only 0.7±0.0 CPU hours. Overall, the results suggest that combining all references into a single reference database and using a 23 nt seed length reduces the computational time, while maximizing specificity. Similar results were found for simulated sequence reads from a mock metagenomic data set. We found similar improvements to computation time in a publicly available human-only data set.
Miniaturization of components and systems for space using MEMS-technology
NASA Astrophysics Data System (ADS)
Grönland, Tor-Arne; Rangsten, Pelle; Nese, Martin; Lang, Martin
2007-06-01
Development of MEMS-based (micro electro mechanical system) components and subsystems for space applications has been pursued by various research groups and organizations around the world for at least two decades. The main driver for developing MEMS-based components for space is the miniaturization that can be achieved. Miniaturization can not only save orders of magnitude in mass and volume of individual components, but it can also allow increased redundancy, and enable novel spacecraft designs and mission scenarios. However, the commercial breakthrough of MEMS has not occurred within the space business as it has within other branches such as the IT/telecom or automotive industries, or as it has in biotech or life science applications. A main explanation to this is the highly conservative attitude to new technology within the space community. This conservatism is in many senses motivated by a very low risk acceptance in the few and costly space projects that actually ends with a space flight. To overcome this threshold there is a strong need for flight opportunities where reasonable risks can be accepted. Currently there are a few flight opportunities allowing extensive use of new technology in space, but one of the exceptions is the PRISMA program. PRISMA is an international (Sweden, Germany, France, Denmark, Norway, Greece) technology demonstration program with focus on rendezvous and formation flying. It is a two satellite LEO mission with a launch scheduled for the first half of 2009. On PRISMA, a number of novel technologies e.g. RF metrology sensor for Darwin, autonomous formation flying based on GPS and vision-based sensors, ADN-based "green propulsion" will be demonstrated in space for the first time. One of the satellites will also have a miniaturized propulsion system onboard based on MEMS-technology. This novel propulsion system includes two microthruster modules, each including four thrusters with micro- to milli-Newton thrust capability. The novelty of this micropropulsion system is that all critical components such as thrust chamber/nozzle assembly including internal heaters, valves and filters are manufactured using MEMS technology. Moreover, miniaturized pressure sensors, relying on MEMS technology, is also part of the system as a self-standing component. The flight opportunity on PRISMA represents one of the few and thus important opportunities to demonstrate MEMS technology in space. The present paper aims at describing this development effort and highlights the benefits of miniaturized components and systems for space using MEMS technology.
Integrated wireless systems: The future has arrived (Keynote Address)
NASA Astrophysics Data System (ADS)
Rivoir, Roberto
2005-06-01
It is believed that we are just at the beginning with wireless, and that a new age is dawning for this breakthrough technology. Thanks to several years of industrial manufacturing in mass-market applications such as cellular phones, wireless technology has nowadays reached a level of maturity that, combined with other achievements arising from different fields, such as information technology, artificial intelligence, pervasive computing, science of new materials, and micro-electro-mechanical systems (MEMS), will enable the realization of a networked stream-flow of real-time information, that will accompany us in our daily life, in a total seamless, transparent fashion. As almost any application scenario will require the deployment of complex, miniaturized, almost "invisible" systems, operating with different wireless standards, hard technological challenges will have to be faced for designing and fabricating ultra-low-cost, reconfigurable, and multi-mode heterogeneous smart micro-devices. But ongoing, unending progresses on wireless technology keeps the promise of helping to solve important societal problems in the health-care, safety, security, industry, environment sectors, and in general opening the possibility for an improved quality of life at work, on travel, at home, practically "everywhere, anytime".
NANOSPACE-1: the Impacts of the First Swedish Nanosatellite on Spacecraft Architecture and Design
NASA Astrophysics Data System (ADS)
Bruhn, F.; Köhler, J.; Stenmark, L.
2002-01-01
NanoSpace-1 (NS-1), due to be launched in late 2003 or early 2004 will test highly advanced Micro Systems Technology (MST) for space applications. These devices are highly miniaturized and optimized complete systems in the sense that all parts of the system are processed with MST and integrated as Multifunctional Microsystems (MMS). The very high level of miniaturization and multifunctionallity in the MMS, will enable easier access to space for nanosatellites to perform better scientific research. This new class of high performing small satellites will open areas for research that before only could be done with much larger and costly satellites. Many institutions, universities, and small countries will benefit greatly as that nanosatellites become more capable per mass unit and volume unit than other spacecraft. These new MMS/MST satellites will provide the ground for a better and less expensive exploration of space. NS-1 will be the first high-performing nanosatellite by using MST/MMS to many subsystems and modules. The whole spacecraft will be built around MMS and will include multifunctional 3D-Multi Chip Modules (3D-MCM), a 3D thin film solar sensor, thin film coating for passive thermal control, variable emittance panels, microwave MEMS patch antennas, micromechanical thermal switches, thin film solar cells with record high efficiency and finally silicon as multifunctional active structure elements. The complete spacecraft will weigh about 7 kg and have dimensions of 32x32x15 cm. The overall mission for NS-1 is to test the new technologies mentioned above, and to collect experiences in the field of MMS architecture. However, new technologies in itself will not take us to a new generation spacecraft. Deeply integrated within the structure of the NanoSpace program are new system designs and multifunctional systems thinking. Distributed and autonomous subsystems are very important when incorporating new technologies with high redundancy. Autonomous systems also reduce the complexity of the overall spacecraft design since many functions can be placed in multifunctional multichip modules. This implies an increase of the complexity at the spacecraft subsystem level. NanoSpace-1 will test several new autonomous, distributed, and miniaturized multifunctional systems, including large memories modules, house keeping modules, RF- MEMS, and power conditioning modules. The MMS concept comprises several features, for instance, all 3D-multi chip modules are part of the spacecraft structure itself. The use of 3D-MCM modules as a large part of the spacecraft hull is a direct application of MMS thinking; the modules are load taking structure elements, and also contain many subsystems of the spacecraft. The MMS thinking is illustrated by the RF-MEMS 3D-MCM module. All other modules will be further presented in the paper. The RF-MEMS module comprises micro strips, patch-antennas, solid state power amplifiers, thermal control, micromechanical switches, power conditioning, radiation shields, and command interfaces. The size of the RF-module is 68x68x5 mm and has a weight of less than 70g. The module is designed to handle different frequencies, only by changing the top wafers and the mixer chip. MST and MMS integrated modules pose at least two major challenges compared to conventional technology. First, the processes cannot be changed half way to the product. Any substantial change in the process will almost certainly require a complete redesign of the whole system. Secondly, qualification and product assurance becomes more important since the processes in MMS tend to be long and complicated. The Ångström Space Technology Centre (ÅSTC) is a center for development of Micro Systems Technologies (MST) for Space Applications at the department of Materials Science at Uppsala University in Sweden. The center is now taking the next step in the ongoing Nanosatellite program, called the NanoSpace program. Backed by funding from the Swedish National Space Board (SNSB), the European Space Agency (ESA), and the European Commission (EC), the ÅSTC will begin developing nanosatellites to demonstrate the next generation spacecraft. The Nanosatellite program is built around a launch every 2nd year to test, verify and qualify new MST technologies for space. The Nanosatellite effort is a solid and well founded program with a backbone of technology research and Multifunctional Microsystems (MMS) thinking.
Measurement of the Earth tides with a MEMS gravimeter.
Middlemiss, R P; Samarelli, A; Paul, D J; Hough, J; Rowan, S; Hammond, G D
2016-03-31
The ability to measure tiny variations in the local gravitational acceleration allows, besides other applications, the detection of hidden hydrocarbon reserves, magma build-up before volcanic eruptions, and subterranean tunnels. Several technologies are available that achieve the sensitivities required for such applications (tens of microgal per hertz(1/2)): free-fall gravimeters, spring-based gravimeters, superconducting gravimeters, and atom interferometers. All of these devices can observe the Earth tides: the elastic deformation of the Earth's crust as a result of tidal forces. This is a universally predictable gravitational signal that requires both high sensitivity and high stability over timescales of several days to measure. All present gravimeters, however, have limitations of high cost (more than 100,000 US dollars) and high mass (more than 8 kilograms). Here we present a microelectromechanical system (MEMS) device with a sensitivity of 40 microgal per hertz(1/2) only a few cubic centimetres in size. We use it to measure the Earth tides, revealing the long-term stability of our instrument compared to any other MEMS device. MEMS accelerometers--found in most smart phones--can be mass-produced remarkably cheaply, but none are stable enough to be called a gravimeter. Our device has thus made the transition from accelerometer to gravimeter. The small size and low cost of this MEMS gravimeter suggests many applications in gravity mapping. For example, it could be mounted on a drone instead of low-flying aircraft for distributed land surveying and exploration, deployed to monitor volcanoes, or built into multi-pixel density-contrast imaging arrays.
Design, Fabrication, and Characterization of a Microelectromechanical Directional Microphone
2011-06-01
7. PERFORMING ORGANIZATION NAME(S) AND ADDRESS(ES) 8. PERFORMING ORGANIZATION REPORT NUMBER 9. SPONSORING/MONITORING AGENCY NAME(S) AND ADDRESS(ES...Figure 5.2 SOIC packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Figure 5.3 Laboratory setup...Mean Squared SOC System-On-Chip SOIC Small Outline Integrated Circuit SOIMUMPS Silicon-On-Insulator Multi-User MEMS Process SPL Sound Pressure Level
Microelectromechanical Systems for Aerodynamics Applications
NASA Technical Reports Server (NTRS)
Mehregany, Mehran; DeAnna, Russell G.; Reshotko, Eli
1996-01-01
Microelectromechanical systems (MEMS) embody the integration of sensors, actuators, and electronics on a single substrate using integrated circuit fabrication techniques and compatible micromachining processes. Silicon and its derivatives form the material base for the MEMS technology. MEMS devices, including micro-sensors and micro-actuators, are attractive because they can be made small (characteristic dimension about microns), be produced in large numbers with uniform performance, include electronics for high performance and sophisticated functionality, and be inexpensive. MEMS pressure sensors, wall-shear-stress sensors, and micromachined hot-wires are nearing application in aeronautics. MEMS actuators face a tougher challenge since they have to be scaled (up) to the physical phenomena that are being controlled. MEMS actuators are proposed, for example, for controlling the small structures in a turbulent boundary layer, for aircraft control, for cooling, and for mixing enhancement. Data acquisition or control logistics require integration of electronics along with the transducer elements with appropriate consideration of analog-to-digital conversion, multiplexing, and telemetry. Altogether, MEMS technology offers exciting opportunities for aerodynamics applications both in wind tunnels and in flight
Progress and profit through microtechnologies: commercial applications of MEMS/MOEMS
NASA Astrophysics Data System (ADS)
Ehrfeld, Wolfgang; Ehrfeld, Ursula
2001-09-01
Micro technology deals with miniaturization and integration in all areas of technology outside of microelectronics like micro mechanics, micro optics, micro acoustics, micro fluid technology, micro reaction technology and further disciplines which are focused on technical components and systems with characteristic dimensions in the micrometer range. Within a period of about ten years a multi-billion dollar market has been set up with many products for daily life. The growth rate of the market of micro technology will remain on a high level for the years to come. Mega trends resulting from fundamental human wishes for health, information, mobility and sustainable development are creating a further growing basis for micro technical products. A broad spectrum of production processes and materials has been developed to meet the requirements of a strongly diversified range of applications. For the development of new components and systems the importance of software tools for simulation of functional properties, production processes and comprehensive optimization is growing rapidly. Micro devices are meanwhile used extensively in information, automotive, and medical technologies. In addition, micro technology is generating a completely novel basis for chemical engineering, life sciences, industrial automation and optical communication, to mention only a few disciplines where future innovation will be dominated by miniaturization.
Multifuctional integrated sensors (MFISES).
DOE Office of Scientific and Technical Information (OSTI.GOV)
Homeijer, Brian D.; Roozeboom, Clifton
2015-10-01
Many emerging IoT applications require sensing of multiple physical and environmental parameters for: completeness of information, measurement validation, unexpected demands, improved performance. For example, a typical outdoor weather station measures temperature, humidity, barometric pressure, light intensity, rainfall, wind speed and direction. Existing sensor technologies do not directly address the demand for cost, size, and power reduction in multi-paramater sensing applications. Industry sensor manufacturers have developed integrated sensor systems for inertial measurements that combine accelerometers, gyroscopes, and magnetometers, but do not address environmental sensing functionality. In existing research literature, a technology gap exists between the functionality of MEMS sensors and themore » real world applications of the sensors systems.« less
Hybrid optical security system using photonic crystals and MEMS devices
NASA Astrophysics Data System (ADS)
Ciosek, Jerzy; Ostrowski, Roman
2017-10-01
An important issue in security systems is that of selection of the appropriate detectors or sensors, whose sensitivity guarantees functional reliability whilst avoiding false alarms. Modern technology enables the optimization of sensor systems, tailored to specific risk factors. In optical security systems, one of the safety parameters considered is the spectral range in which the excitation signal is associated with a risk factor. Advanced safety systems should be designed taking into consideration the possible occurrence of, often multiple, complex risk factors, which can be identified individually. The hazards of concern in this work are chemical warfare agents and toxic industrial compounds present in the forms of gases and aerosols. The proposed sensor solution is a hybrid optical system consisting of a multi-spectral structure of photonic crystals associated with a MEMS (Micro Electro-Mechanical System) resonator. The crystallographic structures of carbon present in graphene rings and graphenecarbon nanotube nanocomposites have properties which make them desirable for use in detectors. The advantage of this system is a multi-spectral sensitivity at the same time as narrow-band selectivity for the identification of risk factors. It is possible to design a system optimized for detecting specified types of risk factor from very complex signals.
A Multi-Phase Based Fluid-Structure-Microfluidic interaction sensor for Aerodynamic Shear Stress
NASA Astrophysics Data System (ADS)
Hughes, Christopher; Dutta, Diganta; Bashirzadeh, Yashar; Ahmed, Kareem; Qian, Shizhi
2014-11-01
A novel innovative microfluidic shear stress sensor is developed for measuring shear stress through multi-phase fluid-structure-microfluidic interaction. The device is composed of a microfluidic cavity filled with an electrolyte liquid. Inside the cavity, two electrodes make electrochemical velocimetry measurements of the induced convection. The cavity is sealed with a flexible superhydrophobic membrane. The membrane will dynamically stretch and flex as a result of direct shear cross-flow interaction with the seal structure, forming instability wave modes and inducing fluid motion within the microfluidic cavity. The shear stress on the membrane is measured by sensing the induced convection generated by membrane deflections. The advantages of the sensor over current MEMS based shear stress sensor technology are: a simplified design with no moving parts, optimum relationship between size and sensitivity, no gaps such as those created by micromachining sensors in MEMS processes. We present the findings of a feasibility study of the proposed sensor including wind-tunnel tests, microPIV measurements, electrochemical velocimetry, and simulation data results. The study investigates the sensor in the supersonic and subsonic flow regimes. Supported by a NASA SBIR phase 1 contract.
NASA Astrophysics Data System (ADS)
Bhuiyan, M. M. I.; Alamgir, T.; Bhuiyan, M.; Kajihara, M.
2013-12-01
Gradually the electronic devices are getting more compact dimension with respect to the width and thickness. As a result, the contacts are becoming thinner and which leads the contact to be loose and unstable contact. In comercial stamping methode, connector tip diameter should be more than 300μm due to its size limitation. Consequently, the connector contact resistance is becoming higher due to weak contact force. To overcome this problem there were few more basic research using MEMS and Electro Fine Forming (EFF) technology to make high Hertz-Stress Contact (5μm) due to the limitation in the commercial stamping process and the result was in satisfactory level. However, since the MEMS and EFF fabrication is costly therefore, a new method is introduced in this paper using the commercial Phosphor Bronze stamping method to reduce the production cost. Moreover, scribing method is used to make tip on the contact. Accordingly, more compact fine pitch contact is successfully fabricated and tested with 5μm High Hertz Stress without using the MEMS and EFF technology. Hence the manufactured contact resistance becomes less than 20mΩ ±5mΩ.
Integrated MEMS-based variable optical attenuator and 10Gb/s receiver
NASA Astrophysics Data System (ADS)
Aberson, James; Cusin, Pierre; Fettig, H.; Hickey, Ryan; Wylde, James
2005-03-01
MEMS devices can be successfully commercialized in favour of competing technologies only if they offer an advantage to the customer in terms of lower cost or increased functionality. There are limited markets where MEMS can be manufactured cheaper than similar technologies due to large volumes: automotive, printing technology, wireless communications, etc. However, success in the marketplace can also be realized by adding significant value to a system at minimal cost or leverging MEMS technology when other solutions simply will not work. This paper describes a thermally actuated, MEMS based, variable optical attenuator that is co-packaged with existing opto-electronic devices to develop an integrated 10Gb/s SONET/SDH receiver. The configuration of the receiver opto-electronics and relatively low voltage availability (12V max) in optical systems bar the use of LCD, EO, and electro-chromic style attenuators. The device was designed and fabricated using a silicon-on-insulator (SOI) starting material. The design and performance of the device (displacement, power consumption, reliability, physical geometry) was defined by the receiver parameters geometry. This paper will describe how these design parameters (hence final device geometry) were determined in light of both the MEMS device fabrication process and the receiver performance. Reference will be made to the design tools used and the design flow which was a joint effort between the MEMS vendor and the end customer. The SOI technology offered a robust, manufacturable solution that gave the required performance in a cost-effective process. However, the singulation of the devices required the development of a new singulation technique that allowed large volumes of silicon to be removed during fabrication yet still offer high singulation yields.
NASA Astrophysics Data System (ADS)
Wang, Qian; Choa, Sung-Hoon; Kim, Woonbae; Hwang, Junsik; Ham, Sukjin; Moon, Changyoul
2006-03-01
Development of packaging is one of the critical issues toward realizing commercialization of radio-frequency-microelectromechanical system (RF-MEMS) devices. The RF-MEMS package should be designed to have small size, hermetic protection, good RF performance, and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low-temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at temperatures below 300°C is used. Au-Sn multilayer metallization with a square loop of 70 µm in width is performed. The electrical feed-through is achieved by the vertical through-hole via filling with electroplated Cu. The size of the MEMS package is 1 mm × 1 mm × 700 µm. The shear strength and hermeticity of the package satisfies the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.
Vibration nullification of MEMS device using input shaping
NASA Astrophysics Data System (ADS)
Jordan, Scott; Lawrence, Eric M.
2003-07-01
The active silicon microstructures known as Micro-Electromechanical Systems (MEMS) are improving many existing technologies through simplification and cost reduction. Many industries have already capitalized on MEMS technology such as those in fields as diverse as telecommunications, computing, projection displays, automotive safety, defense and biotechnology. As they grow in sophistication and complexity, the familiar pressures to further reduce costs and increase performance grow for those who design and manufacture MEMS devices and the engineers who specify them for their end applications. One example is MEMS optical switches that have evolved from simple, bistable on/off elements to microscopic, freelypositionable beam steering optics. These can be actuated to discrete angular positions or to continuously-variable angular states through applied command signals. Unfortunately, elaborate closed-loop actuation schemes are often necessitated in order to stabilize the actuation. Furthermore, preventing one actuated micro-element from vibrationally cross-coupling with its neighbors is another reason costly closed-loop approaches are thought to be necessary. The Laser Doppler Vibrometer (LDV) is a valuable tool for MEMS characterization that provides non-contact, real-time measurements of velocity and/or displacement response. The LDV is a proven technology for production metrology to determine dynamical behaviors of MEMS elements, which can be a sensitive indicator of manufacturing variables such as film thickness, etch depth, feature tolerances, handling damage and particulate contamination. They are also important for characterizing the actuation dynamics of MEMS elements for implementation of a patented controls technique called Input Shaping«, which we show here can virtually eliminate the vibratory resonant response of MEMS elements even when subjected to the most severe actuation profiles. In this paper, we will demonstrate the use of the LDV to determine how the application of this compact, efficient algorithm can improve the performance of both open- and closed-loop MEMS devices, eliminating the need for costly closed-loop approaches. This can greatly reduce the complexity, cost and yield of MEMS design and manufacture.
Wavelength specific excitation of gold nanoparticle thin-films
NASA Astrophysics Data System (ADS)
Lucas, Thomas M.; James, Kurtis T.; Beharic, Jasmin; Moiseeva, Evgeniya V.; Keynton, Robert S.; O'Toole, Martin G.; Harnett, Cindy K.
2014-01-01
Advances in microelectromechanical systems (MEMS) continue to empower researchers with the ability to sense and actuate at the micro scale. Thermally driven MEMS components are often used for their rapid response and ability to apply relatively high forces. However, thermally driven MEMS often have high power consumption and require physical wiring to the device. This work demonstrates a basis for designing light-powered MEMS with a wavelength specific response. This is accomplished by patterning surface regions with a thin film containing gold nanoparticles that are tuned to have an absorption peak at a particular wavelength. The heating behavior of these patterned surfaces is selected by the wavelength of laser directed at the sample. This method also eliminates the need for wires to power a device. The results demonstrate that gold nanoparticle films are effective wavelength-selective absorbers. This "hybrid" of infrared absorbent gold nanoparticles and MEMS fabrication technology has potential applications in light-actuated switches and other mechanical structures that must bend at specific regions. Deposition methods and surface chemistry will be integrated with three-dimensional MEMS structures in the next phase of this work. The long-term goal of this project is a system of light-powered microactuators for exploring cellular responses to mechanical stimuli, increasing our fundamental understanding of tissue response to everyday mechanical stresses at the molecular level.
BioMEMS for biosensors and closed-loop drug delivery.
Coffel, Joel; Nuxoll, Eric
2018-06-15
The efficacy of pharmaceutical treatments can be greatly enhanced by physiological feedback from the patient using biosensors, though this is often invasive or infeasible. By adapting microelectromechanical systems (MEMS) technology to miniaturize such biosensors, previously inaccessible signals can be obtained, often from inside the patient. This is enabled by the device's extremely small footprint which minimizes both power consumption and implantation trauma, as well as the transport time for chemical analytes, in turn decreasing the sensor's response time. MEMS fabrication also allows mass production which can be easily scaled without sacrificing its high reproducibility and reliability, and allows seamless integration with control circuitry and telemetry which is already produced using the same materials and fabrication steps. By integrating these systems with drug delivery devices, many of which are also MEMS-based, closed loop drug delivery can be achieved. This paper surveys the types of signal transduction devices available for biosensing-primarily electrochemical, optical, and mechanical-looking at their implementation via MEMS technology. The impact of MEMS technology on the challenges of biosensor development, particularly safety, power consumption, degradation, fouling, and foreign body response, are also discussed. Copyright © 2018 Elsevier B.V. All rights reserved.
Broadly tunable thin-film intereference coatings: active thin films for telecom applications
NASA Astrophysics Data System (ADS)
Domash, Lawrence H.; Ma, Eugene Y.; Lourie, Mark T.; Sharfin, Wayne F.; Wagner, Matthias
2003-06-01
Thin film interference coatings (TFIC) are the most widely used optical technology for telecom filtering, but until recently no tunable versions have been known except for mechanically rotated filters. We describe a new approach to broadly tunable TFIC components based on the thermo-optic properties of semiconductor thin films with large thermo-optic coefficients 3.6X10[-4]/K. The technology is based on amorphous silicon thin films deposited by plasma-enhanced chemical vapor deposition (PECVD), a process adapted for telecom applications from its origins in the flat-panel display and solar cell industries. Unlike MEMS devices, tunable TFIC can be designed as sophisticated multi-cavity, multi-layer optical designs. Applications include flat-top passband filters for add-drop multiplexing, tunable dispersion compensators, tunable gain equalizers and variable optical attenuators. Extremely compact tunable devices may be integrated into modules such as optical channel monitors, tunable lasers, gain-equalized amplifiers, and tunable detectors.
MEMS-Based Waste Vibrational Energy Harvesters
2013-06-01
7 1. Lead Zirconium Titanate ( PZT ) .........................................................7 2. Aluminum...Laboratory PiezoMUMPS Piezoelectric Multi-User MEMS Processes PZT Lead Zirconate Titanate SEM Scanning Electron Microscopy SiO2 Silicon...titanate ( PZT ) possess high 4 coupling between the electrical and mechanical domains [11]. The output voltage, V, is related to the z-component
Three Axes MEMS Combined Sensor for Electronic Stability Control System
NASA Astrophysics Data System (ADS)
Jeong, Heewon; Goto, Yasushi; Aono, Takanori; Nakamura, Toshiaki; Hayashi, Masahide
A microelectromechanical systems (MEMS) combined sensor measuring two-axis accelerations and an angular rate (rotation) has been developed for an electronic stability control system of automobiles. With the recent trend to mount the combined sensors in the engine compartment, the operation temperature range increased drastically, with the request of immunity to environmental disturbances such as vibration. In this paper, we report the combined sensor which has a gyroscopic part and two acceleration parts in single die. A deformation-robust MEMS structure has been adopted to achieve stable operation under wide temperature range (-40 to 125°C) in the engine compartment. A package as small as 10 × 19 × 4 mm is achieved by adopting TSV (through silicon via) and WLP (wafer-level package) technologies with enough performance as automotive grade.
EDITORIAL: International MEMS Conference 2006
NASA Astrophysics Data System (ADS)
Tay, Francis E. H.; Jianmin, Miao; Iliescu, Ciprian
2006-04-01
The International MEMS conference (iMEMS2006) organized by the Institute of Bioengineering and Nanotechnology and Nanyang Technological University aims to provide a platform for academicians, professionals and industrialists in various related fields from all over the world to share and learn from each other. Of great interest is the incorporation of the theme of life sciences application using MEMS. It is the desire of this conference to initiate collaboration and form network of cooperation. This has continued to be the objective of iMEMS since its inception in 1997. The technological advance of MEMS over the past few decades has been truly exciting in terms of development and applications. In order to participate in this rapid development, a conference involving delegates from within the MEMS community and outside the community is very meaningful and timely. With the receipt of over 200 articles, delegates related to MEMS field from all over the world will share their perspectives on topics such as MEMS/MST Design, MEMS Teaching and Education, MEMS/MST Packaging, MEMS/MST Fabrication, Microsystems Applications, System Integration, Wearable Devices, MEMSWear and BioMEMS. Invited speakers and delegates from outside the field have also been involved to provide challenges, especially in the life sciences field, for the MEMS community to potentially address. The proceedings of the conference will be published as an issue in the online Journal of Physics: Conference Series and this can reach a wider audience and will facilitate the reference and citation of the work presented in the conference. We wish to express our deep gratitude to the International Scientific Committee members and the organizing committee members for contributing to the success of this conference. We would like to thank all the delegates, speakers and sponsors from all over the world for presenting and sharing their perspectives on topics related to MEMS and the challenges that MEMS can potentially address.
Through-wafer interrogation of microstructure motion for MEMS feedback control
NASA Astrophysics Data System (ADS)
Dawson, Jeremy M.; Chen, Jingdong; Brown, Kolin S.; Famouri, Parviz F.; Hornak, Lawrence A.
1999-09-01
Closed-loop MEMS control enables mechanical microsystems to adapt to the demands of the environment which they are actuating opening a new window of opportunity for future MEMS applications. Planar diffractive optical microsystems have the potential to enable the integrated optical interrogation of MEMS microstructure position fully decoupled from the means of mechanical actuation which is central to realization of feedback control. This paper presents the results of initial research evaluating through-wafer optical microsystems for MEMS integrated optical monitoring. Positional monitoring results obtained from a 1.3 micrometer wavelength through- wafer free-space optical probe of a lateral comb resonator fabricated using the Multi-User MEMS Process Service (MUMPS) are presented. Given the availability of positional information via probe signal feedback, a simulation of the application of nonlinear sliding control is presented illustrating position control of the lateral comb resonator structure.
Additive direct-write microfabrication for MEMS: A review
NASA Astrophysics Data System (ADS)
Teh, Kwok Siong
2017-12-01
Direct-write additive manufacturing refers to a rich and growing repertoire of well-established fabrication techniques that builds solid objects directly from computer- generated solid models without elaborate intermediate fabrication steps. At the macroscale, direct-write techniques such as stereolithography, selective laser sintering, fused deposition modeling ink-jet printing, and laminated object manufacturing have significantly reduced concept-to-product lead time, enabled complex geometries, and importantly, has led to the renaissance in fabrication known as the maker movement. The technological premises of all direct-write additive manufacturing are identical—converting computer generated three-dimensional models into layers of two-dimensional planes or slices, which are then reconstructed sequentially into threedimensional solid objects in a layer-by-layer format. The key differences between the various additive manufacturing techniques are the means of creating the finished layers and the ancillary processes that accompany them. While still at its infancy, direct-write additive manufacturing techniques at the microscale have the potential to significantly lower the barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMS parts that have larger dimensions, high aspect ratios, and complex shapes. In recent years, significant advancements in materials chemistry, laser technology, heat and fluid modeling, and control systems have enabled additive manufacturing to achieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMS fabrication. Compared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, direct-write additive manufacturing techniques allow for rapid design-to-prototype realization by limiting or circumventing the need for cleanrooms, photolithography and extensive training. With current direct-write additive manufacturing technologies, it is possible to fabricate unsophisticated micrometer scale structures at adequate resolutions and precisions using materials that range from polymers, metals, ceramics, to composites. In both academia and industry, direct-write additive manufacturing offers extraordinary promises to revolutionize research and development in microfabrication and MEMS technologies. Importantly, direct-write additive manufacturing could appreciably augment current MEMS fabrication technologies, enable faster design-to-product cycle, empower new paradigms in MEMS designs, and critically, encourage wider participation in MEMS research at institutions or for individuals with limited or no access to cleanroom facilities. This article aims to provide a limited review of the current landscape of direct-write additive manufacturing techniques that are potentially applicable for MEMS microfabrication.
NASA Astrophysics Data System (ADS)
Dehé, Alfons
2017-06-01
After decades of research and more than ten years of successful production in very high volumes Silicon MEMS microphones are mature and unbeatable in form factor and robustness. Audio applications such as video, noise cancellation and speech recognition are key differentiators in smart phones. Microphones with low self-noise enable those functions. Backplate-free microphones enter the signal to noise ratios above 70dB(A). This talk will describe state of the art MEMS technology of Infineon Technologies. An outlook on future technologies such as the comb sensor microphone will be given.
Deppe, Olaf; Dorner, Georg; König, Stefan; Martin, Tim; Voigt, Sven; Zimmermann, Steffen
2017-01-01
In the following paper, we present an industry perspective of inertial sensors for navigation purposes driven by applications and customer needs. Microelectromechanical system (MEMS) inertial sensors have revolutionized consumer, automotive, and industrial applications and they have started to fulfill the high end tactical grade performance requirements of hybrid navigation systems on a series production scale. The Fiber Optic Gyroscope (FOG) technology, on the other hand, is further pushed into the near navigation grade performance region and beyond. Each technology has its special pros and cons making it more or less suitable for specific applications. In our overview paper, we present latest improvements at NG LITEF in tactical and navigation grade MEMS accelerometers, MEMS gyroscopes, and Fiber Optic Gyroscopes, based on our long-term experience in the field. We demonstrate how accelerometer performance has improved by switching from wet etching to deep reactive ion etching (DRIE) technology. For MEMS gyroscopes, we show that better than 1°/h series production devices are within reach, and for FOGs we present how limitations in noise performance were overcome by signal processing. The paper also intends a comparison of the different technologies, emphasizing suitability for different navigation applications, thus providing guidance to system engineers. PMID:28287483
Piezoelectric MEMS: Ferroelectric thin films for MEMS applications
NASA Astrophysics Data System (ADS)
Kanno, Isaku
2018-04-01
In recent years, piezoelectric microelectromechanical systems (MEMS) have attracted attention as next-generation functional microdevices. Typical applications of piezoelectric MEMS are micropumps for inkjet heads or micro-gyrosensors, which are composed of piezoelectric Pb(Zr,Ti)O3 (PZT) thin films and have already been commercialized. In addition, piezoelectric vibration energy harvesters (PVEHs), which are regarded as one of the key devices for Internet of Things (IoT)-related technologies, are promising future applications of piezoelectric MEMS. Significant features of piezoelectric MEMS are their simple structure and high energy conversion efficiency between mechanical and electrical domains even on the microscale. The device performance strongly depends on the function of the piezoelectric thin films, especially on their transverse piezoelectric properties, indicating that the deposition of high-quality piezoelectric thin films is a crucial technology for piezoelectric MEMS. On the other hand, although the difficulty in measuring the precise piezoelectric coefficients of thin films is a serious obstacle in the research and development of piezoelectric thin films, a simple unimorph cantilever measurement method has been proposed to obtain precise values of the direct or converse transverse piezoelectric coefficient of thin films, and recently this method has become to be the standardized testing method. In this article, I will introduce fundamental technologies of piezoelectric thin films and related microdevices, especially focusing on the deposition of PZT thin films and evaluation methods for their transverse piezoelectric properties.
Advanced Sensor and Packaging Technologies for Intelligent Adaptive Engine Controls (Preprint)
2013-05-01
combination of micro-electromechanical systems (MEMS) sensor technology, novel ceramic materials, high - temperature electronics, and advanced harsh...with simultaneous pressure measurements up to 1,000 psi. The combination of a high - temperature , high -pressure-ratio compressor system, and adaptive...combination of micro-electromechanical systems (MEMS) sensor technology, novel ceramic materials, high temperature electronics, and advanced harsh
Initial animal studies of a wireless, batteryless, MEMS implant for cardiovascular applications.
Najafi, Nader; Ludomirsky, Achiau
2004-03-01
This paper reports the results of the initial animal studies of a wireless, batteryless, implantable pressure sensor using microelectromechanical systems (MEMS) technology. The animal studies were acute and proved the functional feasibility of using MEMS technology for wireless bio sensing. The results are very encouraging and surpassed the majority of the application's requirements, including high sampling speed and high resolution. Based on the lessons learned, second generation wireless sensors are being developed that will provide total system solution.
MEMS: Enabled Drug Delivery Systems.
Cobo, Angelica; Sheybani, Roya; Meng, Ellis
2015-05-01
Drug delivery systems play a crucial role in the treatment and management of medical conditions. Microelectromechanical systems (MEMS) technologies have allowed the development of advanced miniaturized devices for medical and biological applications. This Review presents the use of MEMS technologies to produce drug delivery devices detailing the delivery mechanisms, device formats employed, and various biomedical applications. The integration of dosing control systems, examples of commercially available microtechnology-enabled drug delivery devices, remaining challenges, and future outlook are also discussed. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
NASA Astrophysics Data System (ADS)
Milanovic, Veljko; Kasturi, Abhishek; Hachtel, Volker
2015-02-01
A high brightness Head-Up Display (HUD) module was demonstrated with a fast, dual-axis MEMS mirror that displays vector images and text, utilizing its ~8kHz bandwidth on both axes. Two methodologies were evaluated: in one, the mirror steers a laser at wide angles of <48° on transparent multi-color fluorescent emissive film and displays content directly on the windshield, and in the other the mirror displays content on reflective multi-color emissive phosphor plates reflected off the windshield to create a virtual image for the driver. The display module is compact, consisting of a single laser diode, off-the-shelf lenses and a MEMS mirror in combination with a MEMS controller to enable precise movement of the mirror's X- and Y-axis. The MEMS controller offers both USB and wireless streaming capability and we utilize a library of functions on a host computer for creating content and controlling the mirror. Integration with smart phone applications is demonstrated, utilizing the mobile device both for content generation based on various messages or data, and for content streaming to the MEMS controller via Bluetooth interface. The display unit is highly resistant to vibrations and shock, and requires only ~1.5W to operate, even with content readable in sunlit outdoor conditions. The low power requirement is in part due to a vector graphics approach, allowing the efficient use of laser power, and also due to the use of a single, relatively high efficiency laser and simple optics.
Microelectromechanical Systems (MEMS) Actuators for Antenna Reconfigurability
NASA Technical Reports Server (NTRS)
Simons, Rainee N.; Chun, Donghoon; Katehi, Linda P. B.
2001-01-01
A novel microelectromechanical systems (MEMS) actuator for patch antenna reconfiguration, is presented for the first time. A key feature is the capability of multi-band operation without greatly increasing the antenna element dimensions. Experimental results demonstrate that the center frequency can be reconfigured from few hundred MHz to few GHz away from the nominal operating frequency.
An SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications.
Mansoor, Mohtashim; Haneef, Ibraheem; Akhtar, Suhail; Rafiq, Muhammad Aftab; De Luca, Andrea; Ali, Syed Zeeshan; Udrea, Florin
2016-11-04
An SOI CMOS multi-sensor MEMS chip, which can simultaneously measure temperature, pressure and flow rate, has been reported. The multi-sensor chip has been designed keeping in view the requirements of researchers interested in experimental fluid dynamics. The chip contains ten thermodiodes (temperature sensors), a piezoresistive-type pressure sensor and nine hot film-based flow rate sensors fabricated within the oxide layer of the SOI wafers. The silicon dioxide layers with embedded sensors are relieved from the substrate as membranes with the help of a single DRIE step after chip fabrication from a commercial CMOS foundry. Very dense sensor packing per unit area of the chip has been enabled by using technologies/processes like SOI, CMOS and DRIE. Independent apparatuses were used for the characterization of each sensor. With a drive current of 10 µA-0.1 µA, the thermodiodes exhibited sensitivities of 1.41 mV/°C-1.79 mV/°C in the range 20-300 °C. The sensitivity of the pressure sensor was 0.0686 mV/(V excit kPa) with a non-linearity of 0.25% between 0 and 69 kPa above ambient pressure. Packaged in a micro-channel, the flow rate sensor has a linearized sensitivity of 17.3 mV/(L/min) -0.1 in the tested range of 0-4.7 L/min. The multi-sensor chip can be used for simultaneous measurement of fluid pressure, temperature and flow rate in fluidic experiments and aerospace/automotive/biomedical/process industries.
An SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications †
Mansoor, Mohtashim; Haneef, Ibraheem; Akhtar, Suhail; Rafiq, Muhammad Aftab; De Luca, Andrea; Ali, Syed Zeeshan; Udrea, Florin
2016-01-01
An SOI CMOS multi-sensor MEMS chip, which can simultaneously measure temperature, pressure and flow rate, has been reported. The multi-sensor chip has been designed keeping in view the requirements of researchers interested in experimental fluid dynamics. The chip contains ten thermodiodes (temperature sensors), a piezoresistive-type pressure sensor and nine hot film-based flow rate sensors fabricated within the oxide layer of the SOI wafers. The silicon dioxide layers with embedded sensors are relieved from the substrate as membranes with the help of a single DRIE step after chip fabrication from a commercial CMOS foundry. Very dense sensor packing per unit area of the chip has been enabled by using technologies/processes like SOI, CMOS and DRIE. Independent apparatuses were used for the characterization of each sensor. With a drive current of 10 µA–0.1 µA, the thermodiodes exhibited sensitivities of 1.41 mV/°C–1.79 mV/°C in the range 20–300 °C. The sensitivity of the pressure sensor was 0.0686 mV/(Vexcit kPa) with a non-linearity of 0.25% between 0 and 69 kPa above ambient pressure. Packaged in a micro-channel, the flow rate sensor has a linearized sensitivity of 17.3 mV/(L/min)−0.1 in the tested range of 0–4.7 L/min. The multi-sensor chip can be used for simultaneous measurement of fluid pressure, temperature and flow rate in fluidic experiments and aerospace/automotive/biomedical/process industries. PMID:27827904
MEMS device for spacecraft thermal control applications
NASA Technical Reports Server (NTRS)
Swanson, Theordore D. (Inventor)
2003-01-01
A micro-electromechanical device that comprises miniaturized mechanical louvers, referred to as Micro Electro-Mechanical Systems (MEMS) louvers are employed to achieve a thermal control function for spacecraft and instruments. The MEMS louvers are another form of a variable emittance control coating and employ micro-electromechanical technology. In a function similar to traditional, macroscopic thermal louvers, the MEMS louvers of the present invention change the emissivity of a surface. With the MEMS louvers, as with the traditional macroscopic louvers, a mechanical vane or window is opened and closed to allow an alterable radiative view to space.
Surface chemistry and tribology of MEMS.
Maboudian, Roya; Carraro, Carlo
2004-01-01
The microscopic length scale and high surface-to-volume ratio, characteristic of microelectro-mechanical systems (MEMS), dictate that surface properties are of paramount importance. This review deals with the effects of surface chemical treatments on tribological properties (adhesion, friction, and wear) of MEMS devices. After a brief review of materials and processes that are utilized in MEMS technology, the relevant tribological and chemical issues are discussed. Various MEMS microinstruments are discussed, which are commonly employed to perform adhesion, friction, and wear measurements. The effects of different surface treatments on the reported tribological properties are discussed.
MEMS Technology for Space Applications
NASA Technical Reports Server (NTRS)
vandenBerg, A.; Spiering, V. L.; Lammerink, T. S. J.; Elwenspoek, M.; Bergveld, P.
1995-01-01
Micro-technology enables the manufacturing of all kinds of components for miniature systems or micro-systems, such as sensors, pumps, valves, and channels. The integration of these components into a micro-electro-mechanical system (MEMS) drastically decreases the total system volume and mass. These properties, combined with the increasing need for monitoring and control of small flows in (bio)chemical experiments, makes MEMS attractive for space applications. The level of integration and applied technology depends on the product demands and the market. The ultimate integration is process integration, which results in a one-chip system. An example of process integration is a dosing system of pump, flow sensor, micromixer, and hybrid feedback electronics to regulate the flow. However, for many applications, a hybrid integration of components is sufficient and offers the advantages of design flexibility and even the exchange of components in the case of a modular set up. Currently, we are working on hybrid integration of all kinds of sensors (physical and chemical) and flow system modules towards a modular system; the micro total analysis system (micro TAS). The substrate contains electrical connections as in a printed circuit board (PCB) as well as fluid channels for a circuit channel board (CCB) which, when integrated, form a mixed circuit board (MCB).
MEMS capacitive accelerometer-based middle ear microphone.
Young, Darrin J; Zurcher, Mark A; Semaan, Maroun; Megerian, Cliff A; Ko, Wen H
2012-12-01
The design, implementation, and characterization of a microelectromechanical systems (MEMS) capacitive accelerometer-based middle ear microphone are presented in this paper. The microphone is intended for middle ear hearing aids as well as future fully implantable cochlear prosthesis. Human temporal bones acoustic response characterization results are used to derive the accelerometer design requirements. The prototype accelerometer is fabricated in a commercial silicon-on-insulator (SOI) MEMS process. The sensor occupies a sensing area of 1 mm × 1 mm with a chip area of 2 mm × 2.4 mm and is interfaced with a custom-designed low-noise electronic IC chip over a flexible substrate. The packaged sensor unit occupies an area of 2.5 mm × 6.2 mm with a weight of 25 mg. The sensor unit attached to umbo can detect a sound pressure level (SPL) of 60 dB at 500 Hz, 35 dB at 2 kHz, and 57 dB at 8 kHz. An improved sound detection limit of 34-dB SPL at 150 Hz and 24-dB SPL at 500 Hz can be expected by employing start-of-the-art MEMS fabrication technology, which results in an articulation index of approximately 0.76. Further micro/nanofabrication technology advancement is needed to enhance the microphone sensitivity for improved understanding of normal conversational speech.
A Compact and Low-Cost MEMS Loudspeaker for Digital Hearing Aids.
Sang-Soo Je; Rivas, F; Diaz, R E; Jiuk Kwon; Jeonghwan Kim; Bakkaloglu, B; Kiaei, S; Junseok Chae
2009-10-01
A microelectromechanical-systems (MEMS)-based electromagnetically actuated loudspeaker to reduce form factor, cost, and power consumption, and increase energy efficiency in hearing-aid applications is presented. The MEMS loudspeaker has multilayer copper coils, an NiFe soft magnet on a thin polyimide diaphragm, and an NdFeB permanent magnet on the perimeter. The coil impedance is measured at 1.5 Omega, and the resonant frequency of the diaphragm is located far from the audio frequency range. The device is driven by a power-scalable, 0.25-mum complementary metal-oxide semiconductor class-D SigmaDelta amplifier stage. The class-D amplifier is formed by a differential H-bridge driven by a single bit, pulse-density-modulated SigmaDelta bitstream at a 1.2-MHz clock rate. The fabricated MEMS loudspeaker generates more than 0.8-mum displacement, equivalent to 106-dB sound pressure level (SPL), with 0.13-mW power consumption. Driven by the SigmaDelta class-D amplifier, the MEMS loudspeaker achieves measured 65-dB total harmonic distortion (THD) with a measurement uncertainty of less than 10%. Energy-efficient and cost-effective advanced hearing aids would benefit from further miniaturization via MEMS technology. The results from this study appear very promising for developing a compact, mass-producible, low-power loudspeaker with sufficient sound generation for hearing-aid applications.
DOT National Transportation Integrated Search
2016-08-01
Micro-electromechanical sensors and systems- (MEMS)-based and : wireless-based smart-sensing technologies have, until now, rarely : been used for monitoring pavement response in the field, and the : requirements for using such smart sensing technolog...
Huang, Haoqian; Chen, Xiyuan; Zhang, Bo; Wang, Jian
2017-01-01
The underwater navigation system, mainly consisting of MEMS inertial sensors, is a key technology for the wide application of underwater gliders and plays an important role in achieving high accuracy navigation and positioning for a long time of period. However, the navigation errors will accumulate over time because of the inherent errors of inertial sensors, especially for MEMS grade IMU (Inertial Measurement Unit) generally used in gliders. The dead reckoning module is added to compensate the errors. In the complicated underwater environment, the performance of MEMS sensors is degraded sharply and the errors will become much larger. It is difficult to establish the accurate and fixed error model for the inertial sensor. Therefore, it is very hard to improve the accuracy of navigation information calculated by sensors. In order to solve the problem mentioned, the more suitable filter which integrates the multi-model method with an EKF approach can be designed according to different error models to give the optimal estimation for the state. The key parameters of error models can be used to determine the corresponding filter. The Adams explicit formula which has an advantage of high precision prediction is simultaneously fused into the above filter to achieve the much more improvement in attitudes estimation accuracy. The proposed algorithm has been proved through theory analyses and has been tested by both vehicle experiments and lake trials. Results show that the proposed method has better accuracy and effectiveness in terms of attitudes estimation compared with other methods mentioned in the paper for inertial navigation applied to underwater gliders. Copyright © 2016 ISA. Published by Elsevier Ltd. All rights reserved.
Droogendijk, H.; Brookhuis, R. A.; de Boer, M. J.; Sanders, R. G. P.; Krijnen, G. J. M.
2014-01-01
Flies use so-called halteres to sense body rotation based on Coriolis forces for supporting equilibrium reflexes. Inspired by these halteres, a biomimetic gimbal-suspended gyroscope has been developed using microelectromechanical systems (MEMS) technology. Design rules for this type of gyroscope are derived, in which the haltere-inspired MEMS gyroscope is geared towards a large measurement bandwidth and a fast response, rather than towards a high responsivity. Measurements for the biomimetic gyroscope indicate a (drive mode) resonance frequency of about 550 Hz and a damping ratio of 0.9. Further, the theoretical performance of the fly's gyroscopic system and the developed MEMS haltere-based gyroscope is assessed and the potential of this MEMS gyroscope is discussed. PMID:25100317
Microelectromechanical Systems
NASA Technical Reports Server (NTRS)
Gabriel, Kaigham J.
1995-01-01
Micro-electromechanical systems (MEMS) is an enabling technology that merges computation and communication with sensing and actuation to change the way people and machines interact with the physical world. MEMS is a manufacturing technology that will impact widespread applications including: miniature inertial measurement measurement units for competent munitions and personal navigation; distributed unattended sensors; mass data storage devices; miniature analytical instruments; embedded pressure sensors; non-invasive biomedical sensors; fiber-optics components and networks; distributed aerodynamic control; and on-demand structural strength. The long term goal of ARPA's MEMS program is to merge information processing with sensing and actuation to realize new systems and strategies for both perceiving and controlling systems, processes, and the environment. The MEMS program has three major thrusts: advanced devices and processes, system design, and infrastructure.
Ultrasensitive measurement of microcantilever displacement below the shot-noise limit
Pooser, Raphael C.; Lawrie, Benjamin J.
2015-04-23
The displacement of micro-electro-mechanical-systems (MEMs) cantilevers is used to measure a variety of phe- nomena in devices ranging from force microscopes for single spin detection[1] to biochemical sensors[2] to un- cooled thermal imaging systems[3]. The displacement readout is often performed optically with segmented de- tectors or interference measurements. Until recently, var- ious noise sources have limited the minimum detectable displacement in MEMs systems, but it is now possible to minimize all other sources[4] so that the noise level of the coherent light eld, called the shot noise limit (SNL), becomes the dominant source. Light sources dis- playing quantum-enhanced statistics belowmore » this limit are available[5, 6], with applications in gravitational wave astronomy[7] and bioimaging[8], but direct displacement measurements of MEMS cantilevers below the SNL have been impossible until now. Here, we demonstrate the rst direct measurement of a MEMs cantilever displace- ment with sub-SNL sensitivity, thus enabling ultratrace sensing, imaging, and microscopy applications. By com- bining multi-spatial-mode quantum light sources with a simple dierential measurement, we show that sub-SNL MEMs displacement sensitivity is highly accessible com- pared to previous eorts that measured the displacement of macroscopic mirrors with very distinct spatial struc- tures crafted with multiple optical parametric ampliers and locking loops[9]. We apply this technique to a com- mercially available microcantilever in order to detect dis- placements 60% below the SNL at frequencies where the microcantilever is shot-noise-limited. These results sup- port a new class of quantum MEMS sensor whose ulti- mate signal to noise ratio is determined by the correla- tions possible in quantum optics systems.« less
Ultrasensitive measurement of microcantilever displacement below the shot-noise limit
DOE Office of Scientific and Technical Information (OSTI.GOV)
Pooser, Raphael C.; Lawrie, Benjamin J.
The displacement of micro-electro-mechanical-systems (MEMs) cantilevers is used to measure a variety of phe- nomena in devices ranging from force microscopes for single spin detection[1] to biochemical sensors[2] to un- cooled thermal imaging systems[3]. The displacement readout is often performed optically with segmented de- tectors or interference measurements. Until recently, var- ious noise sources have limited the minimum detectable displacement in MEMs systems, but it is now possible to minimize all other sources[4] so that the noise level of the coherent light eld, called the shot noise limit (SNL), becomes the dominant source. Light sources dis- playing quantum-enhanced statistics belowmore » this limit are available[5, 6], with applications in gravitational wave astronomy[7] and bioimaging[8], but direct displacement measurements of MEMS cantilevers below the SNL have been impossible until now. Here, we demonstrate the rst direct measurement of a MEMs cantilever displace- ment with sub-SNL sensitivity, thus enabling ultratrace sensing, imaging, and microscopy applications. By com- bining multi-spatial-mode quantum light sources with a simple dierential measurement, we show that sub-SNL MEMs displacement sensitivity is highly accessible com- pared to previous eorts that measured the displacement of macroscopic mirrors with very distinct spatial struc- tures crafted with multiple optical parametric ampliers and locking loops[9]. We apply this technique to a com- mercially available microcantilever in order to detect dis- placements 60% below the SNL at frequencies where the microcantilever is shot-noise-limited. These results sup- port a new class of quantum MEMS sensor whose ulti- mate signal to noise ratio is determined by the correla- tions possible in quantum optics systems.« less
MEMS-based thermoelectric infrared sensors: A review
NASA Astrophysics Data System (ADS)
Xu, Dehui; Wang, Yuelin; Xiong, Bin; Li, Tie
2017-12-01
In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.
NASA Astrophysics Data System (ADS)
Jiang, Yuan; Zhang, Menglun; Duan, Xuexin; Zhang, Hao; Pang, Wei
2017-07-01
In this paper, a 2.6 GHz air-gap type thin film piezoelectric MEMS resonator was fabricated on a flexible polyethylene terephthalate film. A fabrication process combining transfer printing and hot-embossing was adopted to form a free-standing structure. The flexible radio frequency MEMS resonator possesses a quality factor of 946 and an effective coupling coefficient of 5.10%, and retains its high performance at a substrate bending radius of 1 cm. The achieved performance is comparable to that of conventional resonators on rigid silicon wafers. Our demonstration provides a viable approach to realizing universal MEMS devices on flexible polymer substrates, which is of great significance for building future fully integrated and multi-functional wireless flexible electronic systems.
Microelectromechanical pump utilizing porous silicon
Lantz, Jeffrey W [Albuquerque, NM; Stalford, Harold L [Norman, OK
2011-07-19
A microelectromechanical (MEM) pump is disclosed which includes a porous silicon region sandwiched between an inlet chamber and an outlet chamber. The porous silicon region is formed in a silicon substrate and contains a number of pores extending between the inlet and outlet chambers, with each pore having a cross-section dimension about equal to or smaller than a mean free path of a gas being pumped. A thermal gradient is provided along the length of each pore by a heat source which can be an electrical resistance heater or an integrated circuit (IC). A channel can be formed through the silicon substrate so that inlet and outlet ports can be formed on the same side of the substrate, or so that multiple MEM pumps can be connected in series to form a multi-stage MEM pump. The MEM pump has applications for use in gas-phase MEM chemical analysis systems, and can also be used for passive cooling of ICs.
Advances in integrated photonic circuits for packet-switched interconnection
NASA Astrophysics Data System (ADS)
Williams, Kevin A.; Stabile, Ripalta
2014-03-01
Sustained increases in capacity and connectivity are needed to overcome congestion in a range of broadband communication network nodes. Packet routing and switching in the electronic domain are leading to unsustainable energy- and bandwidth-densities, motivating research into hybrid solutions: optical switching engines are introduced for massive-bandwidth data transport while the electronic domain is clocked at more modest GHz rates to manage routing. Commercially-deployed optical switching engines using MEMS technologies are unwieldy and too slow to reconfigure for future packet-based networking. Optoelectronic packet-compliant switch technologies have been demonstrated as laboratory prototypes, but they have so far mostly used discretely pigtailed components, which are impractical for control plane development and product assembly. Integrated photonics has long held the promise of reduced hardware complexity and may be the critical step towards packet-compliant optical switching engines. Recently a number of laboratories world-wide have prototyped optical switching circuits using monolithic integration technology with up to several hundreds of integrated optical components per chip. Our own work has focused on multi-input to multi-output switching matrices. Recently we have demonstrated 8×8×8λ space and wavelength selective switches using gated cyclic routers and 16×16 broadband switching chips using monolithic multi-stage networks. We now operate these advanced circuits with custom control planes implemented with FPGAs to explore real time packet routing in multi-wavelength, multi-port test-beds. We review our contributions in the context of state of the art photonic integrated circuit technology and packet optical switching hardware demonstrations.
MEMS startups: disruptive technology and business do's and don'ts
NASA Astrophysics Data System (ADS)
Bryzek, Janusz
2005-02-01
This paper characterizes factors that affect the probability of success for new startups. These guidelines are derived primarily from Venture Capital industry experience in funding disruptive technology companies. It follows with an overview of Silicon Valley MEMS and MOEMS startups and provides with a summary of Do"s and Don"ts for entrepreneurs.
Ultra-compact imaging plate scanner module using a MEMS mirror and specially designed MPPC
NASA Astrophysics Data System (ADS)
Miyamoto, Yuichi; Sasaki, Kensuke; Takasaka, Masaomi; Fujimoto, Masatoshi; Yamamoto, Koei
2017-02-01
Computed radiography (CR), which is one of the most useful methods for dental imaging and nondestructive testing, uses a phosphor imaging plate (IP) because it is flexible, reusable, and inexpensive. Conventional IP scanners utilize a galvanometer or a polygon mirror as a scanning device and a photomultiplier as an optical sensor. Microelectromechanical systems (MEMS) technology currently provides silicon-based devices and has the potential to replace such discrete devices and sensors. Using these devices, we constructed an ultra-compact IP scanner. Our extremely compact plate scanner utilizes a module that is composed of a one-dimensional MEMS mirror and a long multi-pixel photon counter (MPPC) that is combined with a specially designed wavelength filter and a rod lens. The MEMS mirror, which is a non-resonant electromagnetic type, is 2.6 mm in diameter with a recommended optical scanning angle up to +/-15°. The CR's wide dynamic range is maintained using a newly developed MPPC. The MPPC is a sort of silicon photomultiplier and is a high-sensitivity photon-counting device. To achieve such a wide dynamic range, we developed a long MPPC that has over 10,000 pixels. For size reduction and high optical efficiency, we set the MPPC close to an IP across the rod lens. To prevent the MPPC from detecting excitation light, which is much more intense than photo-stimulated light, we produced a sharp-cut wavelength filter that has a wide angle (+/-60°) of tolerance. We evaluated our constructed scanner module through gray chart and resolution chart images.
NASA Astrophysics Data System (ADS)
Schifferle, Andreas; Dommann, Alex; Neels, Antonia
2017-12-01
New methods are needed in microsystems technology for evaluating microelectromechanical systems (MEMS) because of their reduced size. The assessment and characterization of mechanical and structural relations of MEMS are essential to assure the long-term functioning of devices, and have a significant impact on design and fabrication.
MEMS device for mass market gas and chemical sensors
NASA Astrophysics Data System (ADS)
Kinkade, Brian R.; Daly, James T.; Johnson, Edward A.
2000-08-01
Gas and chemical sensors are used in many applications. Industrial health and safety monitors allow companies to meet OSHA requirements by detecting harmful levels of toxic or combustible gases. Vehicle emissions are tested during annual inspections. Blood alcohol breathalizers are used by law enforcement. Refrigerant leak detection ensures that the Earth's ozone layer is not being compromised. Industrial combustion emissions are also monitored to minimize pollution. Heating and ventilation systems watch for high levels of carbon dioxide (CO2) to trigger an increase in fresh air exchange. Carbon monoxide detectors are used in homes to prevent poisoning from poor combustion ventilation. Anesthesia gases are monitored during a patients operation. The current economic reality is that two groups of gas sensor technologies are competing in two distinct existing market segments - affordable (less reliable) chemical reaction sensors for consumer markets and reliable (expensive) infrared (IR) spectroscopic sensors for industrial, laboratory, and medical instrumentation markets. Presently high volume mass-market applications are limited to CO detectros and on-board automotive emissions sensors. Due to reliability problems with electrochemical sensor-based CO detectors there is a hesitancy to apply these sensors in other high volume applications. Applications such as: natural gas leak detection, non-invasive blood glucose monitoring, home indoor air quality, personal/portable air quality monitors, home fire/burnt cooking detector, and home food spoilage detectors need a sensor that is a small, efficient, accurate, sensitive, reliable, and inexpensive. Connecting an array of these next generation gas sensors to wireless networks that are starting to proliferate today creates many other applications. Asthmatics could preview the air quality of their destinations as they venture out into the day. HVAC systems could determine if fresh air intake was actually better than the air in the house. Internet grocery delivery services could check for spoiled foods in their clients' refrigerators. City emissions regulators could monitor the various emissions sources throughout the area from their desk to predict how many pollution vouchers they will need to trade in the next week. We describe a new component architecture for mass-market sensors based on silicon microelectromechanical systems (MEMS) technology. MEMS are micrometer-scale devices that can be fabricated as discrete devices or large arrays, using the technology of integrated circuit manufacturing. These new photonic bandgap and MEMS fabricataion technologies will simplify the component technology to provide high-quality gas and chemical sensors at consumer prices.
NASA Astrophysics Data System (ADS)
Allen, Mark G.; Lang, Jeffrey
2013-11-01
Welcome to this special section of the Journal of Micromechanics and Microengineering (JMM). This section, co-edited by myself and by Professor Jeffrey Lang of the Massachusetts Institute of Technology, contains expanded versions of selected papers presented at the Power MEMS meeting held in Atlanta, GA, USA, in December of 2012. Professor Lang and I had the privilege of co-chairing Power MEMS 2012, the 12th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications. The scope of the PowerMEMS series of workshops ranges from basic principles, to materials and fabrication, to devices and systems, to applications. The many applications of power MEMS (microelectromehcanical systems) range from MEMS-enabled energy harvesting, storage, conversion and conditioning, to integrated systems that manage these processes. Why is the power MEMS field growing in importance? Smaller-scale power and power supplies (microwatts to tens of watts) are gaining in prominence due to many factors, including the ubiquity of low power portable electronic equipment and the proliferation of wireless sensor nodes that require extraction of energy from their embedding environment in order to function. MEMS manufacturing methods can be utilized to improve the performance of traditional power supply elements, such as allowing batteries to charge faster or shrinking the physical size of passive elements in small-scale power supplies. MEMS technologies can be used to fabricate energy harvesters that extract energy from an embedding environment to power wireless sensor nodes, in-body medical implants and other devices, in which the harvesters are on the small scales that are appropriately matched to the overall size of these microsystems. MEMS can enable the manufacturing of energy storage elements from nontraditional materials by bringing appropriate structure and surface morphology to these materials as well as fabricating the electrical interfaces required for their operation and interconnection. Clearly, the marriage of MEMS technologies and energy conversion is a vital application space; and we are pleased to bring you some of the latest results from that space in this special section. Approximately 130 papers were presented at the Power MEMS 2012 conference. From these, the 20 papers you have before you were selected based on paper quality and topical balance. As you can see, papers representing many of the important areas of power MEMS are included: energy harvesters using multiple transduction schemes; MEMS-based fabrication of compact passive elements (inductors, supercapacitors, transformers); MEMS-enabled power diagnostics; MEMS-based batteries; and low power circuitry adapted to interfacing MEMS-based harvesters to overall systems. All of the papers you will read in this special section comprise substantial expansion from the proceedings articles and were reviewed through JMM's normal reviewing process. Both Professor Lang and I hope that you will share our enthusiasm for the field of power MEMS and that you will find this special section of JMM exciting, interesting and useful. Sincerely, Mark G Allen
A review of MEMS micropropulsion technologies for CubeSats and PocketQubes
NASA Astrophysics Data System (ADS)
Silva, Marsil A. C.; Guerrieri, Daduí C.; Cervone, Angelo; Gill, Eberhard
2018-02-01
CubeSats have been extensively used in the past decade as scientific tools, technology demonstrators and for education. Recently, PocketQubes have emerged as an interesting and even smaller alternative to CubeSats. However, both satellite types often lack some key capabilities, such as micropropulsion, in order to further extend the range of applications of these small satellites. This paper reviews the current development status of micropropulsion systems fabricated with MEMS (micro electro-mechanical systems) and silicon technology intended to be used in CubeSat or PocketQube missions and compares different technologies with respect to performance parameters such as thrust, specific impulse, and power as well as in terms of operational complexity. More than 30 different devices are analyzed and divided into 7 main categories according to the working principle. A specific outcome of the research is the identification of the current status of MEMS technologies for micropropulsion including key opportunities and challenges.
Thin Film Transistor Control Circuitry for MEMS Acoustic Transducers
NASA Astrophysics Data System (ADS)
Daugherty, Robin
This work seeks to develop a practical solution for short range ultrasonic communications and produce an integrated array of acoustic transmitters on a flexible substrate. This is done using flexible thin film transistor (TFT) and micro electromechanical systems (MEMS). The goal is to develop a flexible system capable of communicating in the ultrasonic frequency range at a distance of 10-100 meters. This requires a great deal of innovation on the part of the FDC team developing the TFT driving circuitry and the MEMS team adapting the technology for fabrication on a flexible substrate. The technologies required for this research are independently developed. The TFT development is driven primarily by research into flexible displays. The MEMS development is driving by research in biosensors and micro actuators. This project involves the integration of TFT flexible circuit capabilities with MEMS micro actuators in the novel area of flexible acoustic transmitter arrays. This thesis focuses on the design, testing and analysis of the circuit components required for this project.
MEMS applications in space exploration
NASA Astrophysics Data System (ADS)
Tang, William C.
1997-09-01
Space exploration in the coming century will emphasize cost effectiveness and highly focused mission objectives, which will result in frequent multiple missions that broaden the scope of space science and to validate new technologies on a timely basis. MEMS is one of the key enabling technology to create cost-effective, ultra-miniaturized, robust, and functionally focused spacecraft for both robotic and human exploration programs. Examples of MEMS devices at various stages of development include microgyroscope, microseismometer, microhygrometer, quadrupole mass spectrometer, and micropropulsion engine. These devices, when proven successful, will serve as models for developing components and systems for new-millennium spacecraft.
Applications of MEMS for Space Exploration
NASA Astrophysics Data System (ADS)
Tang, William C.
1998-03-01
Space exploration in the coming century will emphasize cost effectiveness and highly focused mission objectives, which will result in frequent multiple missions that broaden the scope of space science and to validate new technologies on a timely basis. Micro Electro Mechanical Systems (MEMS) is one of the key enabling technologies to create cost-effective, ultra-miniaturized, robust, and functionally focused spacecraft for both robotic and human exploration programs. Examples of MEMS devices at various stages of development include microgyroscope, microseismometer, microhygrometer, quadrupole mass spectrometer, and micropropulsion engine. These devices, when proven successful, will serve as models for developing components and systems for new-millennium spacecraft.
Centimeter-scale MEMS scanning mirrors for high power laser application
NASA Astrophysics Data System (ADS)
Senger, F.; Hofmann, U.; v. Wantoch, T.; Mallas, C.; Janes, J.; Benecke, W.; Herwig, Patrick; Gawlitza, P.; Ortega-Delgado, M.; Grune, C.; Hannweber, J.; Wetzig, A.
2015-02-01
A higher achievable scan speed and the capability to integrate two scan axes in a very compact device are fundamental advantages of MEMS scanning mirrors over conventional galvanometric scanners. There is a growing demand for biaxial high speed scanning systems complementing the rapid progress of high power lasers for enabling the development of new high throughput manufacturing processes. This paper presents concept, design, fabrication and test of biaxial large aperture MEMS scanning mirrors (LAMM) with aperture sizes up to 20 mm for use in high-power laser applications. To keep static and dynamic deformation of the mirror acceptably low all MEMS mirrors exhibit full substrate thickness of 725 μm. The LAMM-scanners are being vacuum packaged on wafer-level based on a stack of 4 wafers. Scanners with aperture sizes up to 12 mm are designed as a 4-DOF-oscillator with amplitude magnification applying electrostatic actuation for driving a motor-frame. As an example a 7-mm-scanner is presented that achieves an optical scan angle of 32 degrees at 3.2 kHz. LAMM-scanners with apertures sizes of 20 mm are designed as passive high-Q-resonators to be externally excited by low-cost electromagnetic or piezoelectric drives. Multi-layer dielectric coatings with a reflectivity higher than 99.9 % have enabled to apply cw-laser power loads of more than 600 W without damaging the MEMS mirror. Finally, a new excitation concept for resonant scanners is presented providing advantageous shaping of intensity profiles of projected laser patterns without modulating the laser. This is of interest in lighting applications such as automotive laser headlights.
Nano/micro-electro mechanical systems: a patent view
NASA Astrophysics Data System (ADS)
Hu, Guangyuan; Liu, Weishu
2015-12-01
Combining both bibliometrics and citation network analysis, this research evaluates the global development of micro-electro mechanical systems (MEMS) research based on the Derwent Innovations Index database. We found that worldwide, the growth trajectory of MEMS patents demonstrates an approximate S shape, with United States, Japan, China, and Korea leading the global MEMS race. Evidenced by Derwent class codes, the technology structure of global MEMS patents remains steady over time. Yet there does exist a national competitiveness component among the top country players. The latecomer China has become the second most prolific country filing MEMS patents, but its patent quality still lags behind the global average.
RF-MEMS Technology for High-Performance Passives; The challenge of 5G mobile applications
NASA Astrophysics Data System (ADS)
Iannacci, Jacopo
2017-11-01
Commencing with a review of the characteristics of RF-MEMS in relation to 5G, the book proceeds to develop practical insight concerning the design and development of RF-MEMS including case studies of design concepts. Including multiphysics simulation and animated figures, the book will be essential reading for both academic and industrial researchers and engineers.
Multi-GPU maximum entropy image synthesis for radio astronomy
NASA Astrophysics Data System (ADS)
Cárcamo, M.; Román, P. E.; Casassus, S.; Moral, V.; Rannou, F. R.
2018-01-01
The maximum entropy method (MEM) is a well known deconvolution technique in radio-interferometry. This method solves a non-linear optimization problem with an entropy regularization term. Other heuristics such as CLEAN are faster but highly user dependent. Nevertheless, MEM has the following advantages: it is unsupervised, it has a statistical basis, it has a better resolution and better image quality under certain conditions. This work presents a high performance GPU version of non-gridding MEM, which is tested using real and simulated data. We propose a single-GPU and a multi-GPU implementation for single and multi-spectral data, respectively. We also make use of the Peer-to-Peer and Unified Virtual Addressing features of newer GPUs which allows to exploit transparently and efficiently multiple GPUs. Several ALMA data sets are used to demonstrate the effectiveness in imaging and to evaluate GPU performance. The results show that a speedup from 1000 to 5000 times faster than a sequential version can be achieved, depending on data and image size. This allows to reconstruct the HD142527 CO(6-5) short baseline data set in 2.1 min, instead of 2.5 days that takes a sequential version on CPU.
Design and Optimization of AlN based RF MEMS Switches
NASA Astrophysics Data System (ADS)
Hasan Ziko, Mehadi; Koel, Ants
2018-05-01
Radio frequency microelectromechanical system (RF MEMS) switch technology might have potential to replace the semiconductor technology in future communication systems as well as communication satellites, wireless and mobile phones. This study is to explore the possibilities of RF MEMS switch design and optimization with aluminium nitride (AlN) thin film as the piezoelectric actuation material. Achieving low actuation voltage and high contact force with optimal geometry using the principle of piezoelectric effect is the main motivation for this research. Analytical and numerical modelling of single beam type RF MEMS switch used to analyse the design parameters and optimize them for the minimum actuation voltage and high contact force. An analytical model using isotropic AlN material properties used to obtain the optimal parameters. The optimized geometry of the device length, width and thickness are 2000 µm, 500 µm and 0.6 µm respectively obtained for the single beam RF MEMS switch. Low actuation voltage and high contact force with optimal geometry are less than 2 Vand 100 µN obtained by analytical analysis. Additionally, the single beam RF MEMS switch are optimized and validated by comparing the analytical and finite element modelling (FEM) analysis.
Li, Tuan; Zhang, Hongping; Niu, Xiaoji; Gao, Zhouzheng
2017-01-01
Dual-frequency Global Positioning System (GPS) Real-time Kinematics (RTK) has been proven in the past few years to be a reliable and efficient technique to obtain high accuracy positioning. However, there are still challenges for GPS single-frequency RTK, such as low reliability and ambiguity resolution (AR) success rate, especially in kinematic environments. Recently, multi-Global Navigation Satellite System (multi-GNSS) has been applied to enhance the RTK performance in terms of availability and reliability of AR. In order to further enhance the multi-GNSS single-frequency RTK performance in terms of reliability, continuity and accuracy, a low-cost micro-electro-mechanical system (MEMS) inertial measurement unit (IMU) is adopted in this contribution. We tightly integrate the single-frequency GPS/BeiDou/GLONASS and MEMS-IMU through the extended Kalman filter (EKF), which directly fuses the ambiguity-fixed double-differenced (DD) carrier phase observables and IMU data. A field vehicular test was carried out to evaluate the impacts of the multi-GNSS and IMU on the AR and positioning performance in different system configurations. Test results indicate that the empirical success rate of single-epoch AR for the tightly-coupled single-frequency multi-GNSS RTK/INS integration is over 99% even at an elevation cut-off angle of 40°, and the corresponding position time series is much more stable in comparison with the GPS solution. Besides, GNSS outage simulations show that continuous positioning with certain accuracy is possible due to the INS bridging capability when GNSS positioning is not available. PMID:29077070
Li, Tuan; Zhang, Hongping; Niu, Xiaoji; Gao, Zhouzheng
2017-10-27
Dual-frequency Global Positioning System (GPS) Real-time Kinematics (RTK) has been proven in the past few years to be a reliable and efficient technique to obtain high accuracy positioning. However, there are still challenges for GPS single-frequency RTK, such as low reliability and ambiguity resolution (AR) success rate, especially in kinematic environments. Recently, multi-Global Navigation Satellite System (multi-GNSS) has been applied to enhance the RTK performance in terms of availability and reliability of AR. In order to further enhance the multi-GNSS single-frequency RTK performance in terms of reliability, continuity and accuracy, a low-cost micro-electro-mechanical system (MEMS) inertial measurement unit (IMU) is adopted in this contribution. We tightly integrate the single-frequency GPS/BeiDou/GLONASS and MEMS-IMU through the extended Kalman filter (EKF), which directly fuses the ambiguity-fixed double-differenced (DD) carrier phase observables and IMU data. A field vehicular test was carried out to evaluate the impacts of the multi-GNSS and IMU on the AR and positioning performance in different system configurations. Test results indicate that the empirical success rate of single-epoch AR for the tightly-coupled single-frequency multi-GNSS RTK/INS integration is over 99% even at an elevation cut-off angle of 40°, and the corresponding position time series is much more stable in comparison with the GPS solution. Besides, GNSS outage simulations show that continuous positioning with certain accuracy is possible due to the INS bridging capability when GNSS positioning is not available.
MEMS Applications in Aerodynamic Measurement Technology
NASA Technical Reports Server (NTRS)
Reshotko, E.; Mehregany, M.; Bang, C.
1998-01-01
Microelectromechanical systems (MEMS) embodies the integration of sensors, actuators, and electronics on a single substrate using integrated circuit fabrication techniques and compatible bulk and surface micromachining processes. Silicon and its derivatives form the material base for the MEMS technology. MEMS devices, including microsensors and microactuators, are attractive because they can be made small (characteristic dimension about 100 microns), be produced in large numbers with uniform performance, include electronics for high performance and sophisticated functionality, and be inexpensive. For aerodynamic measurements, it is preferred that sensors be small so as to approximate measurement at a point, and in fact, MEMS pressure sensors, wall shear-stress sensors, heat flux sensors and micromachined hot wires are nearing application. For the envisioned application to wind tunnel models, MEMS sensors can be placed on the surface or in very shallow grooves. MEMS devices have often been fabricated on stiff, flat silicon substrates, about 0.5 mm thick, and therefore were not easily mounted on curved surfaces. However, flexible substrates are now available and heat-flux sensor arrays have been wrapped around a curved turbine blade. Electrical leads can also be built into the flexible substrate. Thus MEMS instrumented wind tunnel models do not require deep spanwise grooves for tubes and leads that compromise the strength of conventionally instrumented models. With MEMS, even the electrical leads can potentially be eliminated if telemetry of the signals to an appropriate receiver can be implemented. While semiconductor silicon is well known for its electronic properties, it is also an excellent mechanical material for MEMS applications. However, silicon electronics are limited to operations below about 200 C, and silicon's mechanical properties start to diminish above 400 C. In recent years, silicon carbide (SiC) has emerged as the leading material candidate for applications in high temperature environments and can be used for high-temperature MEMS applications. With SiC, diodes and more complex electronics have been shown to operate to about 600 C, while the mechanical properties of SiC are maintained to much higher temperatures. Even when MEMS devices show benefits in the laboratory, there are many packaging challenges for any aeronautics application. Incorporating MEMS into these applications requires new approaches to packaging that goes beyond traditional integrated circuit (IC) packaging technologies. MEMS must interact mechanically, as well as electrically with their environment, making most traditional chip packaging and mounting techniques inadequate. Wind tunnels operate over wide temperature ranges in an environment that is far from being a 'clean-room.' In flight, aircraft are exposed to natural elements (e.g. rain, sun, ice, insects and dirt) and operational interferences(e.g. cleaning and deicing fluids, and maintenance crews). In propulsion systems applications, MEMS devices will have to operate in environments containing gases with very high temperatures, abrasive particles and combustion products. Hence deployment and packaging that maintains the integrity of the MEMS system is crucial. This paper presents an overview of MEMS fabrication and materials, descriptions of available sensors with more details on those being developed in our laboratories, and a discussion of sensor deployment options for wind tunnel and flight applications.
NASA Astrophysics Data System (ADS)
Siepmann, James P.
2006-05-01
Through the utilization of scanning MEMS mirrors in ladar devices, a whole new range of potential military, Homeland Security, law enforcement, and civilian applications is now possible. Currently, ladar devices are typically large (>15,000 cc), heavy (>15 kg), and expensive (>$100,000) while current MEMS ladar designs are more than a magnitude less, opening up a myriad of potential new applications. One such application with current technology is a GPS integrated MEMS ladar unit, which could be used for real-time border monitoring or the creation of virtual 3D battlefields after being dropped or propelled into hostile territory. Another current technology that can be integrated into a MEMS ladar unit is digital video that can give high resolution and true color to a picture that is then enhanced with range information in a real-time display format that is easier for the user to understand and assimilate than typical gray-scale or false color images. The problem with using 2-axis MEMS mirrors in ladar devices is that in order to have a resonance frequency capable of practical real-time scanning, they must either be quite small and/or have a low maximum tilt angle. Typically, this value has been less than (< or = to 10 mg-mm2-kHz2)-degrees. We have been able to solve this problem by using angle amplification techniques that utilize a series of MEMS mirrors and/or a specialized set of optics to achieve a broad field of view. These techniques and some of their novel applications mentioned will be explained and discussed herein.
Three-dimensional polymer MEMS with functionalized carbon nanotubes by microstereolithography
NASA Astrophysics Data System (ADS)
Varadan, Vijay K.; Xie, Jining
2003-04-01
Microfabrication techniques such as bulk micromachining and surface micromachining currently employed to conceive MEMS are largely derived from the standard IC and microelectronics technology. Even though many MEMS devices with integrated electronics have been achieved by using the traditional micromachining techniques, some limitations have nevertheless to be underlined: 1) these techniques are very expensive and need specific installations as well as a cleanroom environment, 2) the materials that can be used up to now are restricted to silicon and metals, 3) the manufacture of 3D parts having curved surfaces or an important number of layers is not possible. Moreover, for some biological applications, the materials used for sensors must be compatible with human body and the actuators need to have high strain and displacement which the current silicon based MEMS do not provide. It is thus natural for the researchers to look for alternative methods such as Microstereolithography (MSL) to make 3D sensors and actuators using polymeric based materials. For MSL techniques to be successful as their silicon counterparts, one has to come up with multifunctional polymers with electrical properties comparable to silicon. These multifunctional polymers should not only have a high sensing capability but also a high strain and actuation performance. A novel UV-curable polymer uniformly bonded with functionalised nanotubes was synthesized via a modified three-step in-situ polymerization. Purified multi-walled nanotubes, gained from the microwave chemical vapor deposition method, were functionalised by oxidation. The UV curable polymer was prepared from toluene diisocyantae (TDI), functionalised nanotubes, and 2-hydroxyethyl methacrylate (HEMA). The chemical bonds between -NCO groups of TDI and -OH, -COOH groups of functionalised nanotubes help for conceiving polymeric based MEMS devices. A cost effective fabrication techniques was presented using Micro Stereo Lithography and an example of a micropump was also described. The wireless concept of the device has many applications including implanted medical delivery systems, chemical and biological instruments, fluid delivery in engines, pump coolants and refrigerants for local cooling of electronic components.
Three-dimensional polymer MEMS with functionalized carbon nanotubes by microstereolithography
NASA Astrophysics Data System (ADS)
Varadan, Vijay K.; Xie, Jining
2002-11-01
Microfabrication techniques such as bulk micromachining and surface micromachining currently employed to conceive MEMS are largely derived from the standard IC and microelectronics technology. Even though many MEMS devices with integrated electronics have been achieved by using the traditional micromachining techniques, some limitations have nevertheless to be underlined: 1) these techniques are very expensive and need specific installations as well as a cleanroom environment, 2) the materials that can be used up to now are restricted to silicon and metals, 3) the manufacture of 3D parts having curved surfaces or an important numberof layers is not possible. Moreover, for some biological applications, the materials used for sensors must be compatible with human body and the actuators need to have high strain and displacement which the current silicon based MEMS do not provide. It is thus natural for the researchers to 'look' for alternative methods such as Microstereolithography (MSL) to make 3D sensors and actuators using polymeric based materials. For MSL techniques to be successful as their silicon counterparts, one has to come up with multifunctional polyers with electrical properties comparable to silicon. These multifunctional polymers should not only have a high sensing capability but also a high strain and actuation performance. A novel UV-curable polymer uniformly bonded with functionalized nanotubes was synthesized via a modified three-step in-sity polumerization. Purified multi-walled nanotubes, gained from the microwave chemical vapor deposition method, were functionalized by oxidation. The UV curable polymer was prepared from toluene diisocyanate (TDI), functionalized nanotubes, and 2-hydroxyethyl methacrylate (HEMA). The chemical bonds between -NCO groups of TDI and -OH, -COOH groups of functionalized nanotubes help for conceiving polymeric based MEMS devices. A cost effective fabrication techniques was presented using Micro Stereo Lithography and an example of a micropump was also described. The wireless concept of the device has many applications including implanted medical delivery systems, chemical and biological instruments, fluid delivery engines, pump coolants and refrigerants for local cooling of electronic components.
Three-dimensional polymer MEMS with functionalized carbon nanotubes by microstereolithography
NASA Astrophysics Data System (ADS)
Varadan, Vijay K.; Xie, Jining
2003-01-01
Microfabrication techniques such as bulk micromachining and surface micromachining currently employed to conceive MEMS are largely derived from the standard IC and microelectronics technology. Even though many MEMS devices with integrated electronics have been achieved by using the traditional micromachining techniques, some limitations have nevertheless to be underlined: 1) these techniques are very expensive and need specific installations as well as a cleanroom environment, 2) the materials that can be used up to now are restricted to silicon and metals, 3) the manufacture of 3D parts having curved surfaces or an important number of layers is not possible. Moreover, for some biological applications, the materials used for sensors must be compatible with human body and the actuators need to have high strain and displacement which the current silicon based MEMS do not provide. It is thus natural for the researchers to look for alternative methods such as Microstereolithography (MSL) to make 3D sensors and actuators using polymeric based materials. For MSL techniques to be successful as their silicon counterparts, one has to come up with multifunctional polymers with electrical properties comparable to silicon. These multifunctional polymers should not only have a high sensing capability but also a high strain and actuation performance. A novel UV-curable polymer uniformly bonded with functionalized nanotubes was synthesized via a modified three-step in-situ polymerization. Purified multi-walled nanotubes, gained from the microwave chemical vapor deposition method, were functionalized by oxidation. The UV curable polymer was prepared from toluene diisocyanate (TDI), functionalized nanotubes, and 2 hydroxyethyl methacrylate (HEMA). The chemical bonds between NCO groups of TDI and OH, COOH groups of functionalized nanotubes help for conceiving polymeric based MEMS devices. A cost effective fabrication techniques was presented using Micro Stereo Lithography and an example of a micropump was also described. The wireless concept of the device has many applications including implanted medical delivery systems, chemical and biological instruments, fluid delivery in engines, pump coolants and refrigerants for local cooling of electronic components.
Microstereolithography for polymer-based based MEMS
NASA Astrophysics Data System (ADS)
Varadan, Vijay K.; Xie, Jining
2003-07-01
Microfabrication techniques such as bulk micromachining and surface micromachining currently employed to conceive MEMS are largely derived from the standard IC and microelectronics technology. Even though many MEMS devices with integrated electronics have been achieved by using the traditional micromachining techniques, some limitations have nevertheless to be underlined: 1) these techniques are very expensive and need specific installations as well as a cleanroom environment, 2) the materials that can be used up to now are restricted to silicon and metals, 3) the manufacture of 3D parts having curved surfaces or an important number of layers is not possible. Moreover, for some biological applications, the materials used for sensors must be compatible with human body and the actuators need to have high strain and displacement which the current silicon based MEMS do not provide. It is thus natural for the researchers to 'look' for alternative methods such as Microstereolithography (MSL) to make 3D sensors and actuators using polymeric based materials. For MSL techniques to be successful as their silicon counterparts, one has to come up with multifunctional polymers with electrical properties comparable to silicon. These multifunctional polymers should not only have a high sensing capability but also a high strain and actuation performance. A novel UV-curable polymer uniformly bonded with functionalized nanotubes was synthesized via a modified three-step in-situ polymerization. Purified multi-walled nanotubes, gained from the microwave chemical vapor deposition method, were functionalized by oxidation. The UV curable polymer was prepared from toluene diisocyanate (TDI), functionalized nanotubes, and 2-hydroxyethyl methacrylate (HEMA). The chemical bonds between -NCO groups of TDI and -OH, -COOH groups of functionalized nanotubes help for conceiving polymeric based MEMS devices. A cost effective fabrication techniques was presented using Micro Stereo Lithography and an example of a micropump was also described. The wireless concept of the device has many applications including implanted medical delivery systems, chemical and biological instruments, fluid delivery in engines, pump coolants and refrigerants for local cooling of electronic components.
NASA Technical Reports Server (NTRS)
Beach, Duane E.
2003-01-01
High-capacity cooling options remain limited for many small-scale applications such as microelectronic components, miniature sensors, and microsystems. A microelectromechanical system (MEMS) using a Stirling thermodynamic cycle to provide cooling or heating directly to a thermally loaded surface is being developed at the NASA Glenn Research Center to meet this need. The device can be used strictly in the cooling mode or can be switched between cooling and heating modes in milliseconds for precise temperature control. Fabrication and assembly employ techniques routinely used in the semiconductor processing industry. Benefits of the MEMS cooler include scalability to fractions of a millimeter, modularity for increased capacity and staging to low temperatures, simple interfaces, limited failure modes, and minimal induced vibration. The MEMS cooler has potential applications across a broad range of industries such as the biomedical, computer, automotive, and aerospace industries. The basic capabilities it provides can be categorized into four key areas: 1) Extended environmental temperature range in harsh environments; 2) Lower operating temperatures for electronics and other components; 3) Precision spatial and temporal thermal control for temperature-sensitive devices; and 4) The enabling of microsystem devices that require active cooling and/or temperature control. The rapidly expanding capabilities of semiconductor processing in general, and microsystems packaging in particular, present a new opportunity to extend Stirling-cycle cooling to the MEMS domain. The comparatively high capacity and efficiency possible with a MEMS Stirling cooler provides a level of active cooling that is impossible at the microscale with current state-of-the-art techniques. The MEMS cooler technology builds on decades of research at Glenn on Stirling-cycle machines, and capitalizes on Glenn s emerging microsystems capabilities.
On the feasibility to integrate low-cost MEMS accelerometers and GNSS receivers
NASA Astrophysics Data System (ADS)
Benedetti, Elisa; Dermanis, Athanasios; Crespi, Mattia
2017-06-01
The aim of this research was to investigate the feasibility of merging the benefits offered by low-cost GNSS and MEMS accelerometers technology, in order to promote the diffusion of low-cost monitoring solutions. A merging approach was set up at the level of the combination of kinematic results (velocities and displacements) coming from the two kinds of sensors, whose observations were separately processed, following to the so called loose integration, which sounds much more simple and flexible thinking about the possibility of an easy change of the combined sensors. At first, the issues related to the difference in reference systems, time systems and measurement rate and epochs for the two sensors were faced with. An approach was designed and tested to transform into unique reference and time systems the outcomes from GPS and MEMS and to interpolate the usually (much) more dense MEMS observation to common (GPS) epochs. The proposed approach was limited to time-independent (constant) orientation of the MEMS reference system with respect to the GPS one. Then, a data fusion approach based on the use of Discrete Fourier Transform and cubic splines interpolation was proposed both for velocities and displacements: MEMS and GPS derived solutions are firstly separated by a rectangular filter in spectral domain, and secondly back-transformed and combined through a cubic spline interpolation. Accuracies around 5 mm for slow and fast displacements and better than 2 mm/s for velocities were assessed. The obtained solution paves the way to a powerful and appealing use of low-cost single frequency GNSS receivers and MEMS accelerometers for structural and ground monitoring applications. Some additional remarks and prospects for future investigations complete the paper.
Macro, mini, micro and nano (M(sup 3)N) technologies for the future
NASA Technical Reports Server (NTRS)
Friedrich, Craig R.; Warrington, Robert O.; Gao, Robert X.; Lin, Gang
1993-01-01
Microelectromechanical systems (MEMS), micro systems technologies (MST), and micromanufacturing are relatively recent phrases or acronyms that have become synonymous with the design, development, and manufacture of 'micro' devices and systems. Micromanufacturing encompasses MEMS or MST and, in addition, includes all of the processes involved in the production of micro things. Integration of mechanical and electrical components, including built-in computers, can be formed into systems which must be connected to the macroworld. Macro, mini, micro, and nano technologies are all a part of MEMS or micromanufacturing. At this point in the development of the technology, it is becoming apparent that mini systems, with micro components, could very well be the economic drivers of the technology for the foreseeable future. Initial research in the fabrication of microdevices using IC processing technology took place over thirty years ago. Anisotropic etching of silicon was used to produce piezoresistive diaphragms. Since the early 60's, there has been gradual progress in MEMS until the early 1980's when worldwide interest in the technology really started to develop. During this time high aspect ratio micromachining using x rays was started in Germany. In 1987 the concept of a 'silicon micromechanics foundry' was proposed. Since then the interest in the U.S., Germany, and Japan has increased to the point where hundreds of millions of dollars of research monies are being funneled into the technology (at least in Germany and Japan) and the technology has been classified as critical or as a technology or national importance by the U.S. government.
MEMS for Practical Applications
NASA Astrophysics Data System (ADS)
Esashi, Masayoshi
Silicon MEMS as electrostatically levitated rotational gyroscopes and 2D optical scanners, and wafer level packaged devices as integrated capacitive pressure sensors and MEMS switches are described. MEMS which use non-silicon materials as LTCC with electrical feedthrough, SiC and LiNbO3 for probe cards for wafer-level burn-in test, molds for glass press molding and SAW wireless passive sensors respectively are also described.
MEMS scanning micromirror for optical coherence tomography.
Strathman, Matthew; Liu, Yunbo; Keeler, Ethan G; Song, Mingli; Baran, Utku; Xi, Jiefeng; Sun, Ming-Ting; Wang, Ruikang; Li, Xingde; Lin, Lih Y
2015-01-01
This paper describes an endoscopic-inspired imaging system employing a micro-electromechanical system (MEMS) micromirror scanner to achieve beam scanning for optical coherence tomography (OCT) imaging. Miniaturization of a scanning mirror using MEMS technology can allow a fully functional imaging probe to be contained in a package sufficiently small for utilization in a working channel of a standard gastroesophageal endoscope. This work employs advanced image processing techniques to enhance the images acquired using the MEMS scanner to correct non-idealities in mirror performance. The experimental results demonstrate the effectiveness of the proposed technique.
MEMS scanning micromirror for optical coherence tomography
Strathman, Matthew; Liu, Yunbo; Keeler, Ethan G.; Song, Mingli; Baran, Utku; Xi, Jiefeng; Sun, Ming-Ting; Wang, Ruikang; Li, Xingde; Lin, Lih Y.
2014-01-01
This paper describes an endoscopic-inspired imaging system employing a micro-electromechanical system (MEMS) micromirror scanner to achieve beam scanning for optical coherence tomography (OCT) imaging. Miniaturization of a scanning mirror using MEMS technology can allow a fully functional imaging probe to be contained in a package sufficiently small for utilization in a working channel of a standard gastroesophageal endoscope. This work employs advanced image processing techniques to enhance the images acquired using the MEMS scanner to correct non-idealities in mirror performance. The experimental results demonstrate the effectiveness of the proposed technique. PMID:25657887
3D MEMS in Standard Processes: Fabrication, Quality Assurance, and Novel Measurement Microstructures
NASA Technical Reports Server (NTRS)
Lin, Gisela; Lawton, Russell A.
2000-01-01
Three-dimensional MEMS microsystems that are commercially fabricated require minimal post-processing and are easily integrated with CMOS signal processing electronics. Measurements to evaluate the fabrication process (such as cross-sectional imaging and device performance characterization) provide much needed feedback in terms of reliability and quality assurance. MEMS technology is bringing a new class of microscale measurements to fruition. The relatively small size of MEMS microsystems offers the potential for higher fidelity recordings compared to macrosize counterparts, as illustrated in the measurement of muscle cell forces.
Development of a MEMS device for acoustic emission testing
NASA Astrophysics Data System (ADS)
Ozevin, Didem; Pessiki, Stephen P.; Jain, Akash; Greve, David W.; Oppenheim, Irving J.
2003-08-01
Acoustic emission testing is an important technology for evaluating structural materials, and especially for detecting damage in structural members. Significant new capabilities may be gained by developing MEMS transducers for acoustic emission testing, including permanent bonding or embedment for superior coupling, greater density of transducer placement, and a bundle of transducers on each device tuned to different frequencies. Additional advantages include capabilities for maintenance of signal histories and coordination between multiple transducers. We designed a MEMS device for acoustic emission testing that features two different mechanical types, a hexagonal plate design and a spring-mass design, with multiple detectors of each type at ten different frequencies in the range of 100 kHz to 1 MHz. The devices were fabricated in the multi-user polysilicon surface micromachining (MUMPs) process and we have conducted electrical characterization experiments and initial experiments on acoustic emission detection. We first report on C(V) measurements and perform a comparison between predicted (design) and measured response. We next report on admittance measurements conducted at pressures varying from vacuum to atmospheric, identifying the resonant frequencies and again providing a comparison with predicted performance. We then describe initial calibration experiments that compare the performance of the detectors to other acoustic emission transducers, and we discuss the overall performance of the device as a sensor suite, as contrasted to the single-channel performance of most commercial transducers.
NASA Astrophysics Data System (ADS)
Chen, Shaojie; Sivanandam, Suresh; Moon, Dae-Sik
2016-08-01
We discuss the optical design of an infrared multi-object spectrograph (MOS) concept that is designed to take advantage of the multi-conjugate adaptive optics (MCAO) corrected field at the Gemini South telescope. This design employs a unique, cryogenic MEMS-based focal plane mask to select target objects for spectroscopy by utilizing the Micro-Shutter Array (MSA) technology originally developed for the Near Infrared Spectrometer (NIRSpec) of the James Webb Space Telescope (JWST). The optical design is based on all spherical refractive optics, which serves both imaging and spectroscopic modes across the wavelength range of 0.9-2.5 μm. The optical system consists of a reimaging system, MSA, collimator, volume phase holographic (VPH) grisms, and spectrograph camera optics. The VPH grisms, which are VPH gratings sandwiched between two prisms, provide high dispersing efficiencies, and a set of several VPH grisms provide the broad spectral coverage at high throughputs. The imaging mode is implemented by removing the MSA and the dispersing unit out of the beam. We optimize both the imaging and spectrographic modes simultaneously, while paying special attention to the performance of the pupil imaging at the cold stop. Our current design provides a 1' ♢ 1' and a 0.5' ♢ 1' field of views for imaging and spectroscopic modes, respectively, on a 2048 × 2048 pixel HAWAII-2RG detector array. The spectrograph's slit width and spectral resolving power are 0.18'' and 3,000, respectively, and spectra of up to 100 objects can be obtained simultaneously. We present the overall results of simulated performance using optical model we designed.
Sputtered highly oriented PZT thin films for MEMS applications
NASA Astrophysics Data System (ADS)
Kalpat, Sriram S.
Recently there has been an explosion of interest in the field of micro-electro-mechanical systems (MEMS). MEMS device technology has become critical in the growth of various fields like medical, automotive, chemical, and space technology. Among the many applications of ferroelectric thin films in MEMS devices, microfluidics is a field that has drawn considerable amount of research from bio-technology industries as well as chemical and semiconductor manufacturing industries. PZT thin films have been identified as best suited materials for micro-actuators and micro-sensors used in MEMS devices. A promising application for piezoelectric thin film based MEMS devices is disposable drug delivery systems that are capable of sensing biological parameters, mixing and delivering minute and precise amounts of drugs using micro-pumps or micro mixers. These devices call for low driving voltages, so that they can be battery operated. Improving the performance of the actuator material is critical in achieving battery operated disposal drug delivery systems. The device geometry and power consumption in MEMS devices largely depends upon the piezoelectric constant of the films, since they are most commonly used to convert electrical energy into a mechanical response of a membrane or cantilever and vice versa. Phenomenological calculation on the crystal orientation dependence of piezoelectric coefficients for PZT single crystal have reported a significant enhancement of the piezoelectric d33 constant by more than 3 times along [001] in the rhombohedral phase as compared to the conventionally used orientation PZT(111) since [111] is the along the spontaneous polarization direction. This could mean considerable improvement in the MEMS device performance and help drive the operating voltages lower. The motivation of this study is to investigate the crystal orientation dependence of both dielectric and piezoelectric coefficients of PZT thin films in order to select the appropriate orientation that could improve the MEMS device performance. Potential application of these devices is as battery operated disposable drug delivery systems. This work will also investigate the fabrication of a flexural plate wave based microfluidic device using the PZT thin film of appropriate orientation that would enhance the device performance. (Abstract shortened by UMI.)
Flexible MEMS: A novel technology to fabricate flexible sensors and electronics
NASA Astrophysics Data System (ADS)
Tu, Hongen
This dissertation presents the design and fabrication techniques used to fabricate flexible MEMS (Micro Electro Mechanical Systems) devices. MEMS devices and CMOS(Complementary Metal-Oxide-Semiconductor) circuits are traditionally fabricated on rigid substrates with inorganic semiconductor materials such as Silicon. However, it is highly desirable that functional elements like sensors, actuators or micro fluidic components to be fabricated on flexible substrates for a wide variety of applications. Due to the fact that flexible substrate is temperature sensitive, typically only low temperature materials, such as polymers, metals, and organic semiconductor materials, can be directly fabricated on flexible substrates. A novel technology based on XeF2(xenon difluoride) isotropic silicon etching and parylene conformal coating, which is able to monolithically incorporate high temperature materials and fluidic channels, was developed at Wayne State University. The technology was first implemented in the development of out-of-plane parylene microneedle arrays that can be individually addressed by integrated flexible micro-channels. These devices enable the delivery of chemicals with controlled temporal and spatial patterns and allow us to study neurotransmitter-based retinal prosthesis. The technology was further explored by adopting the conventional SOI-CMOS processes. High performance and high density CMOS circuits can be first fabricated on SOI wafers, and then be integrated into flexible substrates. Flexible p-channel MOSFETs (Metal-Oxide-Semiconductor Field-Effect-Transistors) were successfully integrated and tested. Integration of pressure sensors and flow sensors based on single crystal silicon has also been demonstrated. A novel smart yarn technology that enables the invisible integration of sensors and electronics into fabrics has been developed. The most significant advantage of this technology is its post-MEMS and post-CMOS compatibility. Various high-performance MEMS devices and electronics can be integrated into flexible substrates. The potential of our technology is enormous. Many wearable and implantable devices can be developed based on this technology.
Realization of MEMS-IC Vertical Integration Utilizing Smart Bumpless Bonding
NASA Astrophysics Data System (ADS)
Shiozaki, Masayoshi; Moriguchi, Makoto; Sasaki, Sho; Oba, Masatoshi
This paper reports fundamental technologies, properties, and new experimental results of SBB (Smart Bumpless Bonding) to realize MEMS-IC vertical integration. Although conventional bonding technologies have had difficulties integrating MEMS and its processing circuit because of their rough bonding surfaces, fragile structures, and thermal restriction, SBB technology realized the vertical integration without thermal treatment, any adhesive materials including bumps, and chemical mechanical polishing. The SBB technology bonds sealing parts for vacuum sealing and electrodes for electrical connection simultaneously as published in previous experimental study. The plasma CVD SiO2 is utilized to realize vacuum sealing as sealing material. And Au projection studs are formed on each electrode and connected electrically between two wafers by compressive plastic deformation and surface activation. In this paper, new experimental results including vacuum sealing properties, electrical improvement, IC bonding results on the described fundamental concept and properties are reported.
Liquid Tunable Microlenses based on MEMS techniques
Zeng, Xuefeng; Jiang, Hongrui
2013-01-01
The recent rapid development in microlens technology has provided many opportunities for miniaturized optical systems, and has found a wide range of applications. Of these microlenses, tunable-focus microlenses are of special interest as their focal lengths can be tuned using micro-scale actuators integrated with the lens structure. Realization of such tunable microlens generally relies on the microelectromechanical system (MEMS) technologies. Here, we review the recent progress in tunable liquid microlenses. The underlying physics relevant to these microlenses are first discussed, followed by description of three main categories of tunable microlenses involving MEMS techniques, mechanically driven, electrically driven, and those integrated within microfluidic systems. PMID:24163480
MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads
DOE Office of Scientific and Technical Information (OSTI.GOV)
Chanchani, Rajen; Nordquist, Christopher; Olsson, Roy H
In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.
Simulation of Strain Induced Pseudomagnetic Fields in Graphene Suspended on MEMS Chevron Actuators
NASA Astrophysics Data System (ADS)
Vutukuru, Mounika; Christopher, Jason; Bishop, David; Swan, Anna
Graphene has been shown to withstand remarkable levels of mechanical strain an order of magnitude larger than bulk crystalline materials. This exceptional stretchability of graphene allows for the direct tuning of fundamental material properties, as well as for the investigation of novel physics such as generation of strain induced pseudomagnetic fields. However, current methods for strain such as polymer elongation or pressurized wells do not integrate well into devices. We propose microelectromechanical (MEMS) Chevron actuators as a reliable platform for applying strain to graphene. In addition to their advantageous controllable output force, low input power and ease of integration into existing technologies, MEMS allow for different strain orientations to optimize pseudomagnetic field generation in graphene. Here, we model nonuniform strain in suspended graphene on Chevron actuators using COMSOL Multiphysics. By simulating the deformation of the graphene geometry under the device actuation, we explore the pseudomagnetic field map induced by numerically calculating the components of the strain tensor. Our models provide the theoretical framework with which experimental analysis is compared, and optimize our MEMS designs for further exploration of novel physics in graphene. The authors would like to thank NSF DMR 1411008 for their support on this project.
Ciuti, Gastone; Ricotti, Leonardo; Menciassi, Arianna; Dario, Paolo
2015-03-17
Over the past few decades the increased level of public awareness concerning healthcare, physical activities, safety and environmental sensing has created an emerging need for smart sensor technologies and monitoring devices able to sense, classify, and provide feedbacks to users' health status and physical activities, as well as to evaluate environmental and safety conditions in a pervasive, accurate and reliable fashion. Monitoring and precisely quantifying users' physical activity with inertial measurement unit-based devices, for instance, has also proven to be important in health management of patients affected by chronic diseases, e.g., Parkinson's disease, many of which are becoming highly prevalent in Italy and in the Western world. This review paper will focus on MEMS sensor technologies developed in Italy in the last three years describing research achievements for healthcare and physical activity, safety and environmental sensing, in addition to smart systems integration. Innovative and smart integrated solutions for sensing devices, pursued and implemented in Italian research centres, will be highlighted, together with specific applications of such technologies. Finally, the paper will depict the future perspective of sensor technologies and corresponding exploitation opportunities, again with a specific focus on Italy.
MEMS Deformable Mirror Technology Development for Space-Based Exoplanet Detection
NASA Astrophysics Data System (ADS)
Bierden, Paul; Cornelissen, S.; Ryan, P.
2014-01-01
In the search for earth-like extrasolar planets that has become an important objective for NASA, a critical technology development requirement is to advance deformable mirror (DM) technology. High-actuator-count DMs are critical components for nearly all proposed coronagraph instrument concepts. The science case for exoplanet imaging is strong, and rapid recent advances in test beds with DMs made using microelectromechanical system (MEMS) technology have motivated a number of compelling mission concepts that set technical specifications for their use as wavefront controllers. This research will advance the technology readiness of the MEMS DMs components that are currently at the forefront of the field, and the project will be led by the manufacturer of those components, Boston Micromachines Corporation (BMC). The project aims to demonstrate basic functionality and performance of this key component in critical test environments and in simulated operational environments, while establishing model-based predictions of its performance relative to launch and space environments. Presented will be the current status of the project with modeling and initial test results.
MEMS for Space Flight Applications
NASA Technical Reports Server (NTRS)
Lawton, R.
1998-01-01
Micro-Electrical Mechanical Systems (MEMS) are entering the stage of design and verification to demonstrate the utility of the technology for a wide range of applications including sensors and actuators for military, space, medical, industrial, consumer, automotive and instrumentation products.
SMA Foils for MEMS: From Material Properties to the Engineering of Microdevices
NASA Astrophysics Data System (ADS)
Kohl, Manfred; Ossmer, Hinnerk; Gueltig, Marcel; Megnin, Christof
2018-03-01
In the early nineties, microelectromechanical systems (MEMS) technology has been still in its infancy. As silicon (Si) is not a transducer material, it was clear at the very beginning that mechanically active materials had to be introduced to MEMS in order to enable functional microdevices with actuation capability beyond electrostatics. At that time, shape memory alloys (SMAs) have been available in bulk form, mainly as SMA wires and SMA plates. On the macro scale, these materials show highest work densities compared to other actuation principles in the order of 107 J/m3, which stimulated research on the integration of SMA to MEMS. Subsequently, two approaches for producing planar materials have been initiated (1) magnetron sputtering of SMA thin films and (2) the integration of rolled SMA foils, which both turned out to be very successful creating a paradigm change in microactuation technology. The following review covers important milestones of the research and development of SMA foil-based microactuators including materials characterization, design engineering, technology, and demonstrator development as well as first commercial products.
SMA Foils for MEMS: From Material Properties to the Engineering of Microdevices
NASA Astrophysics Data System (ADS)
Kohl, Manfred; Ossmer, Hinnerk; Gueltig, Marcel; Megnin, Christof
2017-12-01
In the early nineties, microelectromechanical systems (MEMS) technology has been still in its infancy. As silicon (Si) is not a transducer material, it was clear at the very beginning that mechanically active materials had to be introduced to MEMS in order to enable functional microdevices with actuation capability beyond electrostatics. At that time, shape memory alloys (SMAs) have been available in bulk form, mainly as SMA wires and SMA plates. On the macro scale, these materials show highest work densities compared to other actuation principles in the order of 107 J/m3, which stimulated research on the integration of SMA to MEMS. Subsequently, two approaches for producing planar materials have been initiated (1) magnetron sputtering of SMA thin films and (2) the integration of rolled SMA foils, which both turned out to be very successful creating a paradigm change in microactuation technology. The following review covers important milestones of the research and development of SMA foil-based microactuators including materials characterization, design engineering, technology, and demonstrator development as well as first commercial products.
Resonant Magnetic Field Sensors Based On MEMS Technology.
Herrera-May, Agustín L; Aguilera-Cortés, Luz A; García-Ramírez, Pedro J; Manjarrez, Elías
2009-01-01
Microelectromechanical systems (MEMS) technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI) and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration.
Resonant Magnetic Field Sensors Based On MEMS Technology
Herrera-May, Agustín L.; Aguilera-Cortés, Luz A.; García-Ramírez, Pedro J.; Manjarrez, Elías
2009-01-01
Microelectromechanical systems (MEMS) technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI) and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration. PMID:22408480
Thermoelectric microdevice fabricated by a MEMS-like electrochemical process
NASA Technical Reports Server (NTRS)
Snyder, G. Jeffrey; Lim, James R.; Huang, Chen-Kuo; Fleurial, Jean-Pierre
2003-01-01
Microelectromechanical systems (MEMS) are the basis of many rapidly growing technologies, because they combine miniature sensors and actuators with communications and electronics at low cost. Commercial MEMS fabrication processes are limited to silicon-based materials or two-dimensional structures. Here we show an inexpensive, electrochemical technique to build MEMS-like structures that contain several different metals and semiconductors with three-dimensional bridging structures. We demonstrate this technique by building a working microthermoelectric device. Using repeated exposure and development of multiple photoresist layers, several different metals and thermoelectric materials are fabricated in a three-dimensional structure. A device containing 126 n-type and p-type (Bi, Sb)2Te3 thermoelectric elements, 20 microm tall and 60 microm in diameter with bridging metal interconnects, was fabricated and cooling demonstrated. Such a device should be of technological importance for precise thermal control when operating as a cooler, and for portable power when operating as a micro power generator.
A MEMS-based super fast dew point hygrometer—construction and medical applications
NASA Astrophysics Data System (ADS)
Jachowicz, Ryszard S.; Weremczuk, Jerzy; Paczesny, Daniel; Tarapata, Grzegorz
2009-12-01
The paper shows how MEMS (micro-electro-mechanical system) technology and a modified principle of fast temperature control (by heat injection instead of careful control of cooling) can considerably improve the dynamic parameters of dew point hygrometers. Some aspects of MEMS-type integrated sensor construction and technology, whole measurement system design, the control algorithm to run the system as well as empirical dynamic parameters from the tests are discussed too. The hygrometer can easily obtain five to six measurements per second with an uncertainty of less than 0.3 K. The meter range is between -10 °C and 40 °C dew point. In the second part of the paper (section 2), two different successful applications in medicine based on fast humidity measurements have been discussed. Some specific constructions of these super fast dew point hygrometers based on a MEMS sensor as well as limited empirical results from clinical tests have been reported too.
Dewetting of thin films on flexible substrates via direct-write laser exposure
NASA Astrophysics Data System (ADS)
Ferrer, Anthony Jesus
Microelectromechanical systems (MEMS) have enabled a wide variety of technologies both in the consumer space and in industrial/research areas. At the market level, such devices advance by the invention and innovation of production techniques. Additionally, there has been increased demand for flexible versions of such MEMS devices. Thin film patterning, represents a key technology for the realization of such flexible electronics. Patterns and methods that can be directly written into the thin film allow for design modification on the fly with the need for harsh chemicals and long etching steps. Laser-induced dewetting has the potential to create patterns in thin films at both the microscopic and nanoscopic level without wasting deposited material. This thesis presents the first demonstration of high-speed direct-write patterning of metallic thin films that uses a laser-induced dewetting phenomenon to prevent material loss. The ability to build film material with this technique is explored using various scanning geometries. Finally, demonstrations of direct-write dewetting of a variety of thin films will be presented with special consideration for high melting point metals deposited upon polymer substrates.
NASA Astrophysics Data System (ADS)
Reza, Syed Azer
This dissertation proposes the use of the emerging Micro-Electro-Mechanical Systems (MEMS) and agile lensing optical device technologies to design novel and powerful signal conditioning and sensing modules for advanced applications in optical communications, physical parameter sensing and RF/optical signal processing. For example, these new module designs have experimentally demonstrated exceptional features such as stable loss broadband operations and high > 60 dB optical dynamic range signal filtering capabilities. The first part of the dissertation describes the design and demonstration of digital MEMS-based signal processing modules for communication systems and sensor networks using the TI DLP (Digital Light Processing) technology. Examples of such modules include optical power splitters, narrowband and broadband variable fiber optical attenuators, spectral shapers and filters. Compared to prior works, these all-digital designs have advantages of repeatability, accuracy, and reliability that are essential for advanced communications and sensor applications. The next part of the dissertation proposes, analyzes and demonstrates the use of analog opto-fluidic agile lensing technology for sensor networks and test and measurement systems. Novel optical module designs for distance sensing, liquid level sensing, three-dimensional object shape sensing and variable photonic delay lines are presented and experimentally demonstrated. Compared to prior art module designs, the proposed analog-mode modules have exceptional performances, particularly for extreme environments (e.g., caustic liquids) where the free-space agile beam-based sensor provide remote non-contact access for physical sensing operations. The dissertation also presents novel modules involving hybrid analog-digital photonic designs that make use of the different optical device technologies to deliver the best features of both analog and digital optical device operations and controls. Digital controls are achieved through the use of the digital MEMS technology and analog controls are realized by employing opto-fluidic agile lensing technology and acousto-optic technology. For example, variable fiber-optic attenuators and spectral filters are proposed using the hybrid design. Compared to prior art module designs, these hybrid designs provide a higher module dynamic range and increased resolution that are critical in various advanced system applications. In summary, the dissertation shows the added power of hybrid optical designs using both the digital and analog photonic signal processing versus just all-digital or all-analog module designs.
MemFlash device: floating gate transistors as memristive devices for neuromorphic computing
NASA Astrophysics Data System (ADS)
Riggert, C.; Ziegler, M.; Schroeder, D.; Krautschneider, W. H.; Kohlstedt, H.
2014-10-01
Memristive devices are promising candidates for future non-volatile memory applications and mixed-signal circuits. In the field of neuromorphic engineering these devices are especially interesting to emulate neuronal functionality. Therefore, new materials and material combinations are currently investigated, which are often not compatible with Si-technology processes. The underlying mechanisms of the device often remain unclear and are paired with low device endurance and yield. These facts define the current most challenging development tasks towards a reliable memristive device technology. In this respect, the MemFlash concept is of particular interest. A MemFlash device results from a diode configuration wiring scheme of a floating gate transistor, which enables the persistent device resistance to be varied according to the history of the charge flow through the device. In this study, we investigate the scaling conditions of the floating gate oxide thickness with respect to possible applications in the field of neuromorphic engineering. We show that MemFlash cells exhibit essential features with respect to neuromorphic applications. In particular, cells with thin floating gate oxides show a limited synaptic weight growth together with low energy dissipation. MemFlash cells present an attractive alternative for state-of-art memresitive devices. The emulation of associative learning is discussed by implementing a single MemFlash cell in an analogue circuit.
Nanotechnology: MEMS and NEMS and their applications to smart systems and devices
NASA Astrophysics Data System (ADS)
Varadan, Vijay K.
2003-10-01
The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with features sizes now down at the sub micron and nanometer level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and systems. This effort offers the promise of: (1) increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed including micro stereo lithographic and micro molding techniques; (2) developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines; (3) development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation; (4) development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems, etc. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composite provide a new avenue for future smart systems. The integration of NEMS (NanoElectroMechanical Systems), MEMS, IDTs (Interdigital Transducers) and required microelectronics and conformal antenna in the multifunctional smart materials and composites results in a smart system suitable for sending and control of a variety functions in automobile, aerospace, marine and civil strutures and food and medical industries. This unique combination of technologies also results in novel conformal sensors that can be remotely sensed by an antenna system with the advantage of no power requirements at the sensor site. This paper provides a brief review of MEMS and NEMS based smart systems for various applications mentioned above. Carbon Nano Tubes (CNT) with their unique structure, have already proven to be valuable in their application as tips for scanning probe microscopy, field emission devices, nanoelectronics, H2-storage, electromagnetic absorbers, ESD, EMI films and coatings and structural composites. For many of these applications, highly purified and functionalized CNT which are compatible with many host polymers are needed. A novel microwave CVD processing technique to meet these requirements has been developed at Penn State Center for the Engineering of Electronic and Acoustic Materials and Devices (CEEAMD). This method enables the production of highly purified carbon nano tubes with variable size (from 5 - 40 nm) at low cost (per gram) and high yield. Whereas, carbon nano tubes synthesized using the laser ablation or arc discharge evaporation method always include impurity due to catalyst or catalyst support. The Penn State research is based on the use of zeolites over other metal/metal oxides in the microwave field for a high production and uniformity of the product. An extended coventional purification method has been employed to purify our products in order to remove left over impurity. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composites will be presented.
MEMS- and NEMS-based smart devices and systems
NASA Astrophysics Data System (ADS)
Varadan, Vijay K.
2001-11-01
The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with features sized now don at the sub micron and nanometer level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and systems. This effort offers the promise of: 1) increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed including micro stereo lithographic an micro molding techniques; 2) developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines; 3) development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation; 4) development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems, etc. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composite provide a new avenue for future smart systems. The integration of NEMS (NanoElectroMechanical Systems), MEMS, IDTs (Interdigital Transducers) and required microelectronics and conformal antenna in the multifunctional smart materials and composites results in a smart system suitable for sensing and control of a variety functions in automobile, aerospace, marine and civil structures and food and medical industries. This unique combination of technologies also results in novel conformal sensors that can be remotely sensed by an antenna system with the advantage of no power requirements at the sensor site. This paper provides a brief review of MEMS and NEMS based smart systems for various applications mentioned above. Carbon Nano Tubes (CNT) with their unique structure, have already proven to be valuable in their application as tips for scanning probe microscopy, field emission devices, nanoelectronics, H2-storage, electromagnetic absorbers, ESD, EMI films and coatings and structural composites. For many of these applications, highly purified and functionalized CNT which are compatible with many host polymers are needed. A novel microwave CVD processing technique to meet these requirements has been developed at Penn State Center for the engineering of Electronic and Acoustic Materials and Devices (CEEAMD). This method enables the production of highly purified carbon nano tubes with variable size (from 5-40 nm) at low cost (per gram) and high yield. Whereas, carbon nano tubes synthesized using the laser ablation or arc discharge evaporation method always include impurity due to catalyst or catalyst support. The Penn State research is based on the use of zeolites over other metal/metal oxides in the microwave field for a high production and uniformity of the product. An extended conventional purification method has been employed to purify our products in order to remove left over impurity. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross- linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composites will be presented.
NASA Technical Reports Server (NTRS)
Curtis, Steven A.
2005-01-01
A report summarizes the design concept of a super miniaturized autonomous reconfigurable technology (SMART) solar sail a proposed deployable, fully autonomous solar sail for use in very fine station keeping of a spacecraft. The SMART solar sail would include a reflective film stretched among nodes of a SMART space frame made partly of nanotubule struts. A microelectromechanical system (MEMS) at each vertex of the frame would spool and unspool nanotubule struts between itself and neighboring nodes to vary the shape of the frame. The MEMSs would be linked, either wirelessly or by thin wires within the struts, to an evolvable neural software system (ENSS) that would control the MEMSs to reconfigure the sail as needed. The solar sail would be highly deformable from an initially highly compressed configuration, yet also capable of enabling very fine maneuvering of the spacecraft by means of small sail-surface deformations. The SMART Solar Sail would be connected to the main body of the spacecraft by a SMART multi-tether structure, which would include MEMS actuators like those of the frame plus tethers in the form of longer versions of the struts in the frame.
Comparative study of 2-DOF micromirrors for precision light manipulation
NASA Astrophysics Data System (ADS)
Young, Johanna I.; Shkel, Andrei M.
2001-08-01
Many industry experts predict that the future of fiber optic telecommunications depends on the development of all-optical components for switching of photonic signals from fiber to fiber throughout the networks. MEMS is a promising technology for providing all-optical switching at high speeds with significant cost reductions. This paper reports on the the analysis of two designs for 2-DOF electrostatically actuated MEMS micromirrors for precision controllable large optical switching arrays. The behavior of the micromirror designs is predicted by coupled-field electrostatic and modal analysis using a finite element analysis (FEA) multi-physics modeling software. The analysis indicates that the commonly used gimbal type mirror design experiences electrostatic interference and would therefore be difficult to precisely control for 2-DOF motion. We propose a new design approach which preserves 2-DOF actuation while minimizing electrostatic interference between the drive electrodes and the mirror. Instead of using two torsional axes, we use one actuator which combines torsional and flexural DOFs. A comparative analysis of the conventional gimbal design and the one proposed in this paper is performed.
Characterizing the reliability of a bioMEMS-based cantilever sensor
NASA Astrophysics Data System (ADS)
Bhalerao, Kaustubh D.
2004-12-01
The cantilever-based BioMEMS sensor represents one instance from many competing ideas of biosensor technology based on Micro Electro Mechanical Systems. The advancement of BioMEMS from laboratory-scale experiments to applications in the field will require standardization of their components and manufacturing procedures as well as frameworks to evaluate their performance. Reliability, the likelihood with which a system performs its intended task, is a compact mathematical description of its performance. The mathematical and statistical foundation of systems-reliability has been applied to the cantilever-based BioMEMS sensor. The sensor is designed to detect one aspect of human ovarian cancer, namely the over-expression of the folate receptor surface protein (FR-alpha). Even as the application chosen is clinically motivated, the objective of this study was to demonstrate the underlying systems-based methodology used to design, develop and evaluate the sensor. The framework development can be readily extended to other BioMEMS-based devices for disease detection and will have an impact in the rapidly growing $30 bn industry. The Unified Modeling Language (UML) is a systems-based framework for design and development of object-oriented information systems which has potential application for use in systems designed to interact with biological environments. The UML has been used to abstract and describe the application of the biosensor, to identify key components of the biosensor, and the technology needed to link them together in a coherent manner. The use of the framework is also demonstrated in computation of system reliability from first principles as a function of the structure and materials of the biosensor. The outcomes of applying the systems-based framework to the study are the following: (1) Characterizing the cantilever-based MEMS device for disease (cell) detection. (2) Development of a novel chemical interface between the analyte and the sensor that provides a degree of selectivity towards the disease. (3) Demonstrating the performance and measuring the reliability of the biosensor prototype, and (4) Identification of opportunities in technological development in order to further refine the proposed biosensor. Application of the methodology to design develop and evaluate the reliability of BioMEMS devices will be beneficial in the streamlining the growth of the BioMEMS industry, while providing a decision-support tool in comparing and adopting suitable technologies from available competing options.
CNES reliability approach for the qualification of MEMS for space
NASA Astrophysics Data System (ADS)
Pressecq, Francis; Lafontan, Xavier; Perez, Guy; Fortea, Jean-Pierre
2001-10-01
This paper describes the reliability approach performs at CNES to evaluate MEMS for space application. After an introduction and a detailed state of the art on the space requirements and on the use of MEMS for space, different approaches for taking into account MEMS in the qualification phases are presented. CNES proposes improvement to theses approaches in term of failure mechanisms identification. Our approach is based on a design and test phase deeply linked with a technology study. This workflow is illustrated with an example: the case of a variable capacitance processed with MUMPS process is presented.
DMD: a digital light processing application to projection displays
NASA Astrophysics Data System (ADS)
Feather, Gary A.
1989-01-01
Summary Revolutionary technologies achieve rapid product and subsequent business diffusion only when the in- ventors focus on technology application, maturation, and proliferation. A revolutionary technology is emerg- ing with micro-electromechanical systems (MEMS). MEMS are being developed by leveraging mature semi- conductor processing coupled with mechanical systems into complete, integrated, useful systems. The digital micromirror device (DMD), a Texas Instruments invented MEMS, has focused on its application to projec- tion displays. The DMD has demonstrated its application as a digital light processor, processing and produc- ing compelling computer and video projection displays. This tutorial discusses requirements in the projection display market and the potential solutions offered by this digital light processing system. The seminar in- cludes an evaluation of the market, system needs, design, fabrication, application, and performance results of a system using digital light processing solutions.
A MEMS Multi-Cantilever Variable Capacitor On Metamaterial
2009-03-26
tuning range [38]. 21 Bakri- Kassem and Mansour [39] have developed a parallel-plate variable capac- itor with carrier beams between the plates to...downwards, however, the carrier beams slightly bend down with the movable plate, still prevent- ing it from pulling-in. Bakri- Kassem and Mansour’s... Kassem and R. R. Mansour, “A high-tuning-range mems variable ca- pacitor using carrier beams,” Canadian Journal of Electrical and Computer En- gineering
Kwon, Ki Yong; Lee, Hyung-Min; Ghovanloo, Maysam; Weber, Arthur; Li, Wen
2015-01-01
The recent development of optogenetics has created an increased demand for advancing engineering tools for optical modulation of neural circuitry. This paper details the design, fabrication, integration, and packaging procedures of a wirelessly-powered, light emitting diode (LED) coupled optrode neural interface for optogenetic studies. The LED-coupled optrode array employs microscale LED (μLED) chips and polymer-based microwaveguides to deliver light into multi-level cortical networks, coupled with microelectrodes to record spontaneous changes in neural activity. An integrated, implantable, switched-capacitor based stimulator (SCS) system provides high instantaneous power to the μLEDs through an inductive link to emit sufficient light and evoke neural activities. The presented system is mechanically flexible, biocompatible, miniaturized, and lightweight, suitable for chronic implantation in small freely behaving animals. The design of this system is scalable and its manufacturing is cost effective through batch fabrication using microelectromechanical systems (MEMS) technology. It can be adopted by other groups and customized for specific needs of individual experiments. PMID:25999823
System Modeling of a MEMS Vibratory Gyroscope and Integration to Circuit Simulation.
Kwon, Hyukjin J; Seok, Seyeong; Lim, Geunbae
2017-11-18
Recently, consumer applications have dramatically created the demand for low-cost and compact gyroscopes. Therefore, on the basis of microelectromechanical systems (MEMS) technology, many gyroscopes have been developed and successfully commercialized. A MEMS gyroscope consists of a MEMS device and an electrical circuit for self-oscillation and angular-rate detection. Since the MEMS device and circuit are interactively related, the entire system should be analyzed together to design or test the gyroscope. In this study, a MEMS vibratory gyroscope is analyzed based on the system dynamic modeling; thus, it can be mathematically expressed and integrated into a circuit simulator. A behavioral simulation of the entire system was conducted to prove the self-oscillation and angular-rate detection and to determine the circuit parameters to be optimized. From the simulation, the operating characteristic according to the vacuum pressure and scale factor was obtained, which indicated similar trends compared with those of the experimental results. The simulation method presented in this paper can be generalized to a wide range of MEMS devices.
Dynamic metasurface lens based on MEMS technology
NASA Astrophysics Data System (ADS)
Roy, Tapashree; Zhang, Shuyan; Jung, Il Woong; Troccoli, Mariano; Capasso, Federico; Lopez, Daniel
2018-02-01
In the recent years, metasurfaces, being flat and lightweight, have been designed to replace bulky optical components with various functions. We demonstrate a monolithic Micro-Electro-Mechanical System (MEMS) integrated with a metasurface-based flat lens that focuses light in the mid-infrared spectrum. A two-dimensional scanning MEMS platform controls the angle of the lens along two orthogonal axes by ±9°, thus enabling dynamic beam steering. The device could be used to compensate for off-axis incident light and thus correct for aberrations such as coma. We show that for low angular displacements, the integrated lens-on-MEMS system does not affect the mechanical performance of the MEMS actuators and preserves the focused beam profile as well as the measured full width at half maximum. We envision a new class of flat optical devices with active control provided by the combination of metasurfaces and MEMS for a wide range of applications, such as miniaturized MEMS-based microscope systems, LIDAR scanners, and projection systems.
BioMEMS –Advancing the Frontiers of Medicine
James, Teena; Mannoor, Manu Sebastian; Ivanov, Dentcho V.
2008-01-01
Biological and medical application of micro-electro-mechanical-systems (MEMS) is currently seen as an area of high potential impact. Integration of biology and microtechnology has resulted in the development of a number of platforms for improving biomedical and pharmaceutical technologies. This review provides a general overview of the applications and the opportunities presented by MEMS in medicine by classifying these platforms according to their applications in the medical field. PMID:27873858
2010-01-01
TERMS MEMS , acoustic wave devices, acoustic wave sensors Qing-Ming Wang University of Pittsburgh 123 University Place University Club Pittsburgh, PA...resonators,” Proc. SPIE Vol. 6223, 62230I, Micro ( MEMS ) and Nanotechnologies for Space Applications; Thomas George, Zhong-Yang Cheng; Eds. (May...microelectromechanical resonators has been recognized as a technological challenge in the current microelectronics and MEMS development. The
NASA Technical Reports Server (NTRS)
Rajagopalan, Harish; Rahmat-Samii, Yahya; Imbriale, William A.
2007-01-01
The purpose of this paper is to investigate potential reflectarray elements by taking into consideration the eventual implementation of MEMS technology for this particular application and detailed characterization of one of the potential element designs.
MEMS high-speed angular-position sensing system with rf wireless transmission
NASA Astrophysics Data System (ADS)
Sun, Winston; Li, Wen J.
2001-08-01
A novel surface-micromachined non-contact high-speed angular-position sensor with total surface area under 4mm2 was developed using the Multi-User MEMS Processes (MUMPs) and integrated with a commercial RF transmitter at 433MHz carrier frequency for wireless signal detection. Currently, a 2.3 MHz internal clock of our data acquisition system and a sensor design with a 13mg seismic mass is sufficient to provide visual observation of a clear sinusoidal response wirelessly generated by the piezoresistive angular-position sensing system within speed range of 180 rpm to around 1000 rpm. Experimental results showed that the oscillation frequency and amplitude are related to the input angular frequency of the rotation disk and the tilt angle of the rotation axis, respectively. These important results could provide groundwork for MEMS researchers to estimate how gravity influences structural properties of MEMS devices under different circumstances.
MEMS micromirrors for optical switching in multichannel spectrophotometers
NASA Astrophysics Data System (ADS)
Tuantranont, Adisorn; Lomas, Tanom; Bright, Victor M.
2004-04-01
This paper reports for the first time that a novel MEMS-based micromirror switch has successfully demonstrated for optical switching in a multi-channel fiber optics spectrophotometer system. The conventional optomechanical fiber optic switches for multi-channel spectrophotometers available in market are bulky, slow, low numbers of channels and expensive. Our foundry MEMS-based micromirror switch designed for integrating with commercially available spectrophotometers offers more compact devices, increased number of probing channels, higher performance and cheaper. Our MEMS-based micromirror switch is a surface micromachined mirror fabricated through MUMPs foundry. The 280 μm x 280 μm gold coated mirror is suspended by the double-gimbal structure for X and Y axis scanning. Self-assembly by solders is used to elevate the torsion mirror 30 μm over the substrate to achieve large scan angle. The solder self-assembly approach dramatically reduces the time to assembly the switch. The scan mirror is electrostatically controlled by applying voltages. The individual probing signal from each probing head is guided by fibers with collimated lenses and incidents on the center of the mirror. The operating scan angle is in the range of 3.5 degrees with driving voltage of 0-100 V. The fastest switching time of 4 millisecond (1 ms rise time and 3 ms fall time) is measured corresponding to the maximum speed of the mirror of 0.25 kHz when the mirror is scanning at +/- 1.5 degrees. The micromirror switch is packaged with a multi-mode fiber bundle using active alignment technique. A centered fiber is the output fiber that is connected to spectrophotometer. Maximum insertion loss of 5 dB has been obtained. The accuracy of measured spectral data is equivalent to the single channel spectrophotometer with a small degradation on probing signal due to fiber coupling.
DOE Office of Scientific and Technical Information (OSTI.GOV)
SPAHN, OLGA B.; GROSSETETE, GRANT D.; CICH, MICHAEL J.
2003-03-01
Many MEMS-based components require optical monitoring techniques using optoelectronic devices for converting mechanical position information into useful electronic signals. While the constituent piece-parts of such hybrid opto-MEMS components can be separately optimized, the resulting component performance, size, ruggedness and cost are substantially compromised due to assembly and packaging limitations. GaAs MOEMS offers the possibility of monolithically integrating high-performance optoelectronics with simple mechanical structures built in very low-stress epitaxial layers with a resulting component performance determined only by GaAs microfabrication technology limitations. GaAs MOEMS implicitly integrates the capability for radiation-hardened optical communications into the MEMS sensor or actuator component, a vitalmore » step towards rugged integrated autonomous microsystems that sense, act, and communicate. This project establishes a new foundational technology that monolithically combines GaAs optoelectronics with simple mechanics. Critical process issues addressed include selectivity, electrochemical characteristics, and anisotropy of the release chemistry, and post-release drying and coating processes. Several types of devices incorporating this novel technology are demonstrated.« less
Bangert, M; Gil, H; Oliva, J; Delgado, C; Vega, T; DE Mateo, S; Larrauri, A
2017-03-01
The intensity of annual Spanish influenza activity is currently estimated from historical data of the Spanish Influenza Sentinel Surveillance System (SISSS) using qualitative indicators from the European Influenza Surveillance Network. However, these indicators are subjective, based on qualitative comparison with historical data of influenza-like illness rates. This pilot study assesses the implementation of Moving Epidemic Method (MEM) intensity levels during the 2014-2015 influenza season within the 17 sentinel networks covered by SISSS, comparing them to historically reported indicators. Intensity levels reported and those obtained with MEM at the epidemic peak of the influenza wave, and at national and regional levels did not show statistical difference (P = 0·74, Wilcoxon signed-rank test), suggesting that the implementation of MEM would have limited disrupting effects on the dynamic of notification within the surveillance system. MEM allows objective influenza surveillance monitoring and standardization of criteria for comparing the intensity of influenza epidemics in regions in Spain. Following this pilot study, MEM has been adopted to harmonize the reporting of intensity levels of influenza activity in Spain, starting in the 2015-2016 season.
Integrated MEMS-tunable VCSELs for reconfigurable optical interconnects
NASA Astrophysics Data System (ADS)
Kögel, Benjamin; Debernardi, Pierluigi; Westbergh, Petter; Gustavsson, Johan S.; Haglund, Åsa; Haglund, Erik; Bengtsson, Jörgen; Larsson, Anders
2012-03-01
A simple and low-cost technology for tunable vertical-cavity surface-emitting lasers (VCSELs) with curved movable micromirror is presented. The micro-electro-mechanical system (MEMS) is integrated with the active optical component (so-called half-VCSEL) by means of surface-micromachining using a reflown photoresist droplet as sacrificial layer. The technology is demonstrated for electrically pumped, short-wavelength (850 nm) tunable VCSELs. Fabricated devices with 10 μm oxide aperture are singlemode with sidemode suppression >35 dB, tunable over 24 nm with output power up to 0.5mW, and have a beam divergence angle <6 °. An improved high-speed design with reduced parasitic capacitance enables direct modulation with 3dB-bandwidths up to 6GHz and error-free data transmission at 5Gbit/s. The modulation response of the MEMS under electrothermal actuation has a bandwidth of 400 Hz corresponding to switching times of about 10ms. The thermal crosstalk between MEMS and half-VCSEL is negligible and not degrading the device performance. With these characteristics the integrated MEMS-tunable VCSELs are basically suitable for use in reconfigurable optical interconnects and ready for test in a prototype system. Schemes for improving output power, tuning speed, and modulation bandwidth are briefly discussed.
MEMS Louvers for Thermal Control
NASA Technical Reports Server (NTRS)
Champion, J. L.; Osiander, R.; Darrin, M. A. Garrison; Swanson, T. D.
1998-01-01
Mechanical louvers have frequently been used for spacecraft and instrument thermal control purposes. These devices typically consist of parallel or radial vanes, which can be opened or closed to vary the effective emissivity of the underlying surface. This project demonstrates the feasibility of using Micro-Electromechanical Systems (MEMS) technology to miniaturize louvers for such purposes. This concept offers the possibility of substituting the smaller, lighter weight, more rugged, and less costly MEMS devices for such mechanical louvers. In effect, a smart skin that self adjusts in response to environmental influences could be developed composed of arrays of thousands of miniaturized louvers. Several orders of magnitude size, weight, and volume decreases are potentially achieved using micro-electromechanical techniques. The use of this technology offers substantial benefits in spacecraft/instrument design, integration and testing, and flight operations. It will be particularly beneficial for the emerging smaller spacecraft and instruments of the future. In addition, this MEMS thermal louver technology can form the basis for related spacecraft instrument applications. The specific goal of this effort was to develop a preliminary MEMS device capable of modulating the effective emissivity of radiators on spacecraft. The concept pursued uses hinged panels, or louvers, in a manner such that heat emitted from the radiators is a function of louver angle. An electrostatic comb drive or other such actuator can control the louver position. The initial design calls for the louvers to be gold coated while the underlying surface is of high emissivity. Since, the base MEMS material, silicon, is transparent in the InfraRed (IR) spectrum, the device has a minimum emissivity when closed and a maximum emissivity when open. An initial set of polysilicon louver devices was designed at the Johns Hopkins Applied Physics Laboratory in conjunction with the Thermal Engineering Branch at NASA's Goddard Space Flight Center.
MEMS tunable optical filter based on multi-ring resonator
DOE Office of Scientific and Technical Information (OSTI.GOV)
Dessalegn, Hailu, E-mail: hailudessalegn@yahoo.com, E-mail: tsrinu@ece.iisc.ernet.in; Srinivas, T., E-mail: hailudessalegn@yahoo.com, E-mail: tsrinu@ece.iisc.ernet.in
We propose a novel MEMS tunable optical filter with a flat-top pass band based on multi-ring resonator in an electrostatically actuated microcantilever for communication application. The filter is basically structured on a microcantilever beam and built in optical integrated ring resonator which is placed in one end of the beam to gain maximum stress on the resonator. Thus, when a DC voltage is applied, the beam will bend, that induces a stress and strain in the ring, which brings a change in refractive index and perimeter of the rings leading to change in the output spectrum shift, providing the tenabilitymore » as high as 0.68nm/μN and it is capable of tuning up to 1.7nm.« less
From magic to technology: materials integration by wafer bonding
NASA Astrophysics Data System (ADS)
Dragoi, Viorel
2006-02-01
Wafer bonding became in the last decade a very powerful technology for MEMS/MOEMS manufacturing. Being able to offer a solution to overcome some problems of the standard processes used for materials integration (e.g. epitaxy, thin films deposition), wafer bonding is nowadays considered an important item in the MEMS engineer toolbox. Different principles governing the wafer bonding processes will be reviewed in this paper. Various types of applications will be presented as examples.
MEMS for optical switching: technologies, applications, and perspectives
NASA Astrophysics Data System (ADS)
Lin, Lih-Y.; Goldstein, Evan L.
1999-09-01
Micro-electro-mechanical-systems (MEMS), due to their unique ability to integrate electrical, mechanical, and optical elements on a single chip, have recently begun to exhibit great potential for realizing optical components and subsystems in compact, lowcost form. Recently, this technology has been applied to wavelength-division-multiplexed (WDM) networks, and resulted in advances in several network elements, including switches, filters, modulators, and wavelength-add/drop multiplexers. Due largely to the exploding capacity demand arising from data traffic, the transmission capacity demanded of and available from WDM networks is anticipated to increase rapidly. For managing such networks, optical switching is of particular interest due to the fact that its complexity is essentially immune to steady advances in the per-channel bit-rate. We will review various micromachined optical-switching technologies, emphasizing studies of their reliability. We then summarizing recent progress in the free-space MEMS optical switch we have demonstrated.
MEMS for optical switching: technologies, applications, and perspectives
NASA Astrophysics Data System (ADS)
Lin, Lih-Yuan; Goldstein, Evan L.
1999-09-01
Micro-electro-mechanical-systems (MEMS), due to their unique ability to integrate electrical, mechanical, and optical elements on a single chip, have recently begun to exhibit great potential for realizing optical components and subsystems in compact, low-cost form. Recently, this technology has been applied to wavelength-division-multiplexed (WDM) networks, and resulted in advances in several network elements, including switches, filters, modulators, and wavelength-add/drop multiplexers. Due largely to the exploding capacity demand arising from data traffic, the transmission capacity demanded of and available from WDM networks is anticipated to increase rapidly. For managing such networks, optical switching is of particular interest due to the fact that its complexity is essentially immune to steady advances in the per-channel bit-rate. We will review various micromachined optical-switching technologies, emphasizing studies of their reliability. We then summarizing recent progress in the free-space MEMS optical switch we have demonstrated.
NASA Technical Reports Server (NTRS)
Edmonds, Jessica
2015-01-01
Aurora Flight Sciences, in partnership with Draper Laboratory, has developed a miniaturized system to count white blood cells in microgravity environments. The system uses MEMS technology to simultaneously count total white blood cells, the five white blood cell differential subgroups, and various lymphocyte subtypes. The OILWBCS-MEMS detection technology works by immobilizing an array of white blood cell-specific antibodies on small, gold-coated membranes. When blood flows across the membranes, specific cells' surface protein antigens bind to their corresponding antibodies. This binding can be measured and correlated to cell counts. In Phase I, the partners demonstrated surface chemistry sensitivity and specificity for total white blood cells and two lymphocyte subtypes. In Phase II, a functional prototype demonstrated end-to-end operation. This rugged, miniaturized device requires minimal blood sample preparation and will be useful for both space flight and terrestrial applications.
Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors
Hera, Daniel; Berndt, Armin; Günther, Thomas; Schmiel, Stephan; Harendt, Christine; Zimmermann, André
2017-01-01
Packaging represents an important part in the microintegration of sensors based on microelectromechanical system (MEMS). Besides miniaturization and integration density, functionality and reliability in combination with flexibility in packaging design at moderate costs and consequently high-mix, low-volume production are the main requirements for future solutions in packaging. This study investigates possibilities employing printed circuit board (PCB-)based assemblies to provide high flexibility for circuit designs together with film-assisted transfer molding (FAM) to package sensors. The feasibility of FAM in combination with PCB and MEMS as a packaging technology for highly sensitive inertia sensors is being demonstrated. The results prove the technology to be a viable method for damage-free packaging of stress- and pressure-sensitive MEMS. PMID:28653992
Design, Simulation and Fabrication of Triaxial MEMS High Shock Accelerometer.
Zhang, Zhenhai; Shi, Zhiguo; Yang, Zhan; Xie, Zhihong; Zhang, Donghong; Cai, De; Li, Kejie; Shen, Yajing
2015-04-01
On the basis of analyzing the disadvantage of other structural accelerometer, three-axis high g MEMS piezoresistive accelerometer was put forward in order to apply to the high-shock test field. The accelerometer's structure and working principle were discussed in details. The simulation results show that three-axis high shock MEMS accelerometer can bear high shock. After bearing high shock impact in high-shock shooting test, three-axis high shock MEMS accelerometer can obtain the intact metrical information of the penetration process and still guarantee the accurate precision of measurement in high shock load range, so we can not only analyze the law of stress wave spreading and the penetration rule of the penetration process of the body of the missile, but also furnish the testing technology of the burst point controlling. The accelerometer has far-ranging application in recording the typical data that projectile penetrating hard target and furnish both technology guarantees for penetration rule and defend engineering.
MEMS-based thin-film fuel cells
Jankowksi, Alan F.; Morse, Jeffrey D.
2003-10-28
A micro-electro-mechanical systems (MEMS) based thin-film fuel cells for electrical power applications. The MEMS-based fuel cell may be of a solid oxide type (SOFC), a solid polymer type (SPFC), or a proton exchange membrane type (PEMFC), and each fuel cell basically consists of an anode and a cathode separated by an electrolyte layer. Additionally catalyst layers can also separate the electrodes (cathode and anode) from the electrolyte. Gas manifolds are utilized to transport the fuel and oxidant to each cell and provide a path for exhaust gases. The electrical current generated from each cell is drawn away with an interconnect and support structure integrated with the gas manifold. The fuel cells utilize integrated resistive heaters for efficient heating of the materials. By combining MEMS technology with thin-film deposition technology, thin-film fuel cells having microflow channels and full-integrated circuitry can be produced that will lower the operating temperature an will yield an order of magnitude greater power density than the currently known fuel cells.
Stability, Nonlinearity and Reliability of Electrostatically Actuated MEMS Devices
Zhang, Wen-Ming; Meng, Guang; Chen, Di
2007-01-01
Electrostatic micro-electro-mechanical system (MEMS) is a special branch with a wide range of applications in sensing and actuating devices in MEMS. This paper provides a survey and analysis of the electrostatic force of importance in MEMS, its physical model, scaling effect, stability, nonlinearity and reliability in detail. It is necessary to understand the effects of electrostatic forces in MEMS and then many phenomena of practical importance, such as pull-in instability and the effects of effective stiffness, dielectric charging, stress gradient, temperature on the pull-in voltage, nonlinear dynamic effects and reliability due to electrostatic forces occurred in MEMS can be explained scientifically, and consequently the great potential of MEMS technology could be explored effectively and utilized optimally. A simplified parallel-plate capacitor model is proposed to investigate the resonance response, inherent nonlinearity, stiffness softened effect and coupled nonlinear effect of the typical electrostatically actuated MEMS devices. Many failure modes and mechanisms and various methods and techniques, including materials selection, reasonable design and extending the controllable travel range used to analyze and reduce the failures are discussed in the electrostatically actuated MEMS devices. Numerical simulations and discussions indicate that the effects of instability, nonlinear characteristics and reliability subjected to electrostatic forces cannot be ignored and are in need of further investigation.
Ciuti, Gastone; Ricotti, Leonardo; Menciassi, Arianna; Dario, Paolo
2015-01-01
Over the past few decades the increased level of public awareness concerning healthcare, physical activities, safety and environmental sensing has created an emerging need for smart sensor technologies and monitoring devices able to sense, classify, and provide feedbacks to users’ health status and physical activities, as well as to evaluate environmental and safety conditions in a pervasive, accurate and reliable fashion. Monitoring and precisely quantifying users’ physical activity with inertial measurement unit-based devices, for instance, has also proven to be important in health management of patients affected by chronic diseases, e.g., Parkinson’s disease, many of which are becoming highly prevalent in Italy and in the Western world. This review paper will focus on MEMS sensor technologies developed in Italy in the last three years describing research achievements for healthcare and physical activity, safety and environmental sensing, in addition to smart systems integration. Innovative and smart integrated solutions for sensing devices, pursued and implemented in Italian research centres, will be highlighted, together with specific applications of such technologies. Finally, the paper will depict the future perspective of sensor technologies and corresponding exploitation opportunities, again with a specific focus on Italy. PMID:25808763
Breath analysis based on micropreconcentrator for early cancer diagnosis
NASA Astrophysics Data System (ADS)
Lee, Sang-Seok
2018-02-01
We are developing micropreconcentrators based on micro/nanotechnology to detect trace levels of volatile organic compound (VOC) gases contained in human and canine exhaled breath. The possibility of using exhaled VOC gases as biomarkers for various cancer diagnoses has been previously discussed. For early cancer diagnosis, detection of trace levels of VOC gas is indispensable. Using micropreconcentrators based on MEMS technology or nanotechnology is very promising for detection of VOC gas. A micropreconcentrator based breath analysis technique also has advantages from the viewpoints of cost performance and availability for various cancers diagnosis. In this paper, we introduce design, fabrication and evaluation results of our MEMS and nanotechnology based micropreconcentrators. In the MEMS based device, we propose a flower leaf type Si microstructure, and its shape and configuration are optimized quantitatively by finite element method simulation. The nanotechnology based micropreconcentrator consists of carbon nanotube (CNT) structures. As a result, we achieve ppb level VOC gas detection with our micropreconcentrators and usual gas chromatography system that can detect on the order of ppm VOC in gas samples. In performance evaluation, we also confirm that the CNT based micropreconcentrator shows 115 times better concentration ratio than that of the Si based micropreconcentrator. Moreover, we discuss a commercialization idea for new cancer diagnosis using breath analysis. Future work and preliminary clinical testing in dogs is also discussed.
NASA Astrophysics Data System (ADS)
Teo, Adrian J. T.; Li, Holden; Tan, Say Hwa; Yoon, Yong-Jin
2017-06-01
Optical MEMS devices provide fast detection, electromagnetic resilience and high sensitivity. Using this technology, an optical gratings based accelerometer design concept was developed for seismic motion detection purposes that provides miniaturization, high manufacturability, low costs and high sensitivity. Detailed in-house fabrication procedures of a double-sided deep reactive ion etching (DRIE) on a silicon-on-insulator (SOI) wafer for a micro opto electro mechanical system (MOEMS) device are presented and discussed. Experimental results obtained show that the conceptual device successfully captured motion similar to a commercial accelerometer with an average sensitivity of 13.6 mV G-1, and a highest recorded sensitivity of 44.1 mV G-1. A noise level of 13.5 mV was detected due to experimental setup limitations. This is the first MOEMS accelerometer developed using double-sided DRIE on SOI wafer for the application of seismic motion detection, and is a breakthrough technology platform to open up options for lower cost MOEMS devices.
The MEMS process of a micro friction sensor
NASA Astrophysics Data System (ADS)
Yuan, Ming-Quan; Lei, Qiang; Wang, Xiong
2018-02-01
The research and testing techniques of friction sensor is an important support for hypersonic aircraft. Compared with the conventional skin friction sensor, the MEMS skin friction sensor has the advantages of small size, high sensitivity, good stability and dynamic response. The MEMS skin friction sensor can be integrated with other flow field sensors whose process is compatible with MEMS skin friction sensor to achieve multi-physical measurement of the flow field; and the micro-friction balance sensor array enable to achieve large area and accurate measurement for the near-wall flow. A MEMS skin friction sensor structure is proposed, which sensing element not directly contacted with the flow field. The MEMS fabrication process of the sensing element is described in detail. The thermal silicon oxide is used as the mask to solve the selection ratio problem of silicon DRIE. The optimized process parameters of silicon DRIE: etching power 1600W/LF power 100 W; SF6 flux 360 sccm; C4F8 flux 300 sccm; O2 flux 300 sccm. With Cr/Au mask, etch depth of glass shallow groove can be controlled in 30°C low concentration HF solution; the spray etch and wafer rotate improve the corrosion surface quality of glass shallow groove. The MEMS skin friction sensor samples were fabricated by the above MEMS process, and results show that the error of the length and width of the elastic cantilever is within 2 μm, the depth error of the shallow groove is less than 0.03 μm, and the static capacitance error is within 0.2 pF, which satisfy the design requirements.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Michalicek, M.A.; Comtois, J.H.; Barron, C.C.
This paper describes the design and characterization of several types of micromirror devices to include process capabilities, device modeling, and test data resulting in deflection versus applied potential curves. These micromirror devices are the first to be fabricated in the state-of-the-art four-level planarized polysilicon process available at Sandia National Laboratories known as the Sandia Ultra-planar Multi-level MEMS Technology (SUMMiT). This enabling process permits the development of micromirror devices with near-ideal characteristics which have previously been unrealizable in standard three-layer polysilicon processes. This paper describes such characteristics as elevated address electrodes, individual address wiring beneath the device, planarized mirror surfaces usingmore » Chemical Mechanical Polishing (CMP), unique post-process metallization, and the best active surface area to date. This paper presents the design, fabrication, modeling, and characterization of several variations of Flexure-Beam (FBMD) and Axial-Rotation Micromirror Devices (ARMD). The released devices are first metallized using a standard sputtering technique relying on metallization guards and masks that are fabricated next to the devices. Such guards are shown to enable the sharing of bond pads between numerous arrays of micromirrors in order to maximize the number of on-chip test arrays. The devices are modeled and then empirically characterized using a laser interferometer setup located at the Air Force Institute of Technology (AFIT) at Wright-Patterson AFB in Dayton, Ohio. Unique design considerations for these devices and the process are also discussed.« less
Zao, John K.; Gan, Tchin-Tze; You, Chun-Kai; Chung, Cheng-En; Wang, Yu-Te; Rodríguez Méndez, Sergio José; Mullen, Tim; Yu, Chieh; Kothe, Christian; Hsiao, Ching-Teng; Chu, San-Liang; Shieh, Ce-Kuen; Jung, Tzyy-Ping
2014-01-01
EEG-based Brain-computer interfaces (BCI) are facing basic challenges in real-world applications. The technical difficulties in developing truly wearable BCI systems that are capable of making reliable real-time prediction of users' cognitive states in dynamic real-life situations may seem almost insurmountable at times. Fortunately, recent advances in miniature sensors, wireless communication and distributed computing technologies offered promising ways to bridge these chasms. In this paper, we report an attempt to develop a pervasive on-line EEG-BCI system using state-of-art technologies including multi-tier Fog and Cloud Computing, semantic Linked Data search, and adaptive prediction/classification models. To verify our approach, we implement a pilot system by employing wireless dry-electrode EEG headsets and MEMS motion sensors as the front-end devices, Android mobile phones as the personal user interfaces, compact personal computers as the near-end Fog Servers and the computer clusters hosted by the Taiwan National Center for High-performance Computing (NCHC) as the far-end Cloud Servers. We succeeded in conducting synchronous multi-modal global data streaming in March and then running a multi-player on-line EEG-BCI game in September, 2013. We are currently working with the ARL Translational Neuroscience Branch to use our system in real-life personal stress monitoring and the UCSD Movement Disorder Center to conduct in-home Parkinson's disease patient monitoring experiments. We shall proceed to develop the necessary BCI ontology and introduce automatic semantic annotation and progressive model refinement capability to our system. PMID:24917804
Zao, John K; Gan, Tchin-Tze; You, Chun-Kai; Chung, Cheng-En; Wang, Yu-Te; Rodríguez Méndez, Sergio José; Mullen, Tim; Yu, Chieh; Kothe, Christian; Hsiao, Ching-Teng; Chu, San-Liang; Shieh, Ce-Kuen; Jung, Tzyy-Ping
2014-01-01
EEG-based Brain-computer interfaces (BCI) are facing basic challenges in real-world applications. The technical difficulties in developing truly wearable BCI systems that are capable of making reliable real-time prediction of users' cognitive states in dynamic real-life situations may seem almost insurmountable at times. Fortunately, recent advances in miniature sensors, wireless communication and distributed computing technologies offered promising ways to bridge these chasms. In this paper, we report an attempt to develop a pervasive on-line EEG-BCI system using state-of-art technologies including multi-tier Fog and Cloud Computing, semantic Linked Data search, and adaptive prediction/classification models. To verify our approach, we implement a pilot system by employing wireless dry-electrode EEG headsets and MEMS motion sensors as the front-end devices, Android mobile phones as the personal user interfaces, compact personal computers as the near-end Fog Servers and the computer clusters hosted by the Taiwan National Center for High-performance Computing (NCHC) as the far-end Cloud Servers. We succeeded in conducting synchronous multi-modal global data streaming in March and then running a multi-player on-line EEG-BCI game in September, 2013. We are currently working with the ARL Translational Neuroscience Branch to use our system in real-life personal stress monitoring and the UCSD Movement Disorder Center to conduct in-home Parkinson's disease patient monitoring experiments. We shall proceed to develop the necessary BCI ontology and introduce automatic semantic annotation and progressive model refinement capability to our system.
Rodgers, M. Steven; Sniegowski, Jeffry J.; Miller, Samuel L.; McWhorter, Paul J.
2000-01-01
A process for forming complex microelectromechanical (MEM) devices having five layers or levels of polysilicon, including four structural polysilicon layers wherein mechanical elements can be formed, and an underlying polysilicon layer forming a voltage reference plane. A particular type of MEM device that can be formed with the five-level polysilicon process is a MEM transmission for controlling or interlocking mechanical power transfer between an electrostatic motor and a self-assembling structure (e.g. a hinged pop-up mirror for use with an incident laser beam). The MEM transmission is based on an incomplete gear train and a bridging set of gears that can be moved into place to complete the gear train to enable power transfer. The MEM transmission has particular applications as a safety component for surety, and for this purpose can incorporate a pin-in-maze discriminator responsive to a coded input signal.
Heat convection in a micro impinging jet system
NASA Astrophysics Data System (ADS)
Mai, John Dzung Hoang
2000-10-01
This thesis covers the development of an efficient micro impinging jet heat exchanger, using MEMS technology, to provide localized cooling for present and next generation microelectronic computer chips. Before designing an efficient localized heat exchanger, it is necessary to investigate fluid dynamics and heat transfer in the micro scale. MEMS technology has been used in this project because it is the only tool currently available that can provide a large array of batch-fabricated, micro-scale nozzles for localized cooling. Our investigation of potential MEMS heat exchanger designs begins with experiments that measure the pressure drops and temperature changes in a micro scale tubing system that will be necessary to carry fluid to the impingement point. Our basic MEMS model is a freestanding micro channel with integrated temperature microsensors. The temperature distribution along the channel in a vacuum is measured. The measured flow rates are compared with an analytical model developed for capillary flow that accounts for 2-D, slip and compressibility effects. The work is focused on obtaining correlations in the form of the Nussult number, the Reynolds number and a H/d geometric factor. A set of single MEMS nozzles have been designed to test heat transfer effectiveness as a function of nozzle diameter, ranging from 1.0 mm to 250 um. In addition, nozzle and slot array MEMS devices have been fabricated. In order to obtain quantitative measurements from these micron scale devices, a series of target temperature sensor chips were custom made and characterized for these experiments. The heat transfer characteristics of various MEMS nozzle configurations operating at various steady inlet pressures, at different heights above the heated substrate, have been characterized. These steady results showed that the average heat transfer coefficient, averaged over a 1 cm2 test area, was usually less than 0.035 W/cm 2K for any situation. However, the local heat transfer coefficient, as measured by a single 4mum x 4mum temperature sensor, was as high as 0.5 W/cm2K. Using a mechanical valve and piezo actuator to perturb the flow at frequencies from 10 Hz to 1 kHz, we identify that enhanced heat transfer can occur in an unsteady forced jet. The functional dependence of the enhanced heat transfer on the mean jet speed, perturbation level and perturbing frequency has been established. The expected trend that increased heat transfer at higher values of St number was noticed. In addition the effect of a confined and free jet geometry on an unsteady flow was observed.
Yuan, Xuebing; Yu, Shuai; Zhang, Shengzhi; Wang, Guoping; Liu, Sheng
2015-01-01
Inertial navigation based on micro-electromechanical system (MEMS) inertial measurement units (IMUs) has attracted numerous researchers due to its high reliability and independence. The heading estimation, as one of the most important parts of inertial navigation, has been a research focus in this field. Heading estimation using magnetometers is perturbed by magnetic disturbances, such as indoor concrete structures and electronic equipment. The MEMS gyroscope is also used for heading estimation. However, the accuracy of gyroscope is unreliable with time. In this paper, a wearable multi-sensor system has been designed to obtain the high-accuracy indoor heading estimation, according to a quaternion-based unscented Kalman filter (UKF) algorithm. The proposed multi-sensor system including one three-axis accelerometer, three single-axis gyroscopes, one three-axis magnetometer and one microprocessor minimizes the size and cost. The wearable multi-sensor system was fixed on waist of pedestrian and the quadrotor unmanned aerial vehicle (UAV) for heading estimation experiments in our college building. The results show that the mean heading estimation errors are less 10° and 5° to multi-sensor system fixed on waist of pedestrian and the quadrotor UAV, respectively, compared to the reference path. PMID:25961384
NASA Astrophysics Data System (ADS)
Mitcheson, Paul; Beeby, Steve
2013-12-01
It is a pleasure to welcome you to The Royal Society in London and the 13th International Conference on Micro- and Nano-Technology for Power Generation and Energy Conversion Applications, or PowerMEMS 2013. The objective of PowerMEMS 2013 is to catalyse innovation in miniature, micro- and nano-scale technologies for power generation and energy conversion. The conference aims to stimulate the exchange of insights and information, and the development of new ideas in the Power MEMS/NEMS field as well as at the meso-scale. It will allow the attendees to interact and network within our multidisciplinary community that includes professionals from many branches of science and engineering. The technical program is led by four invited speakers covering inductive power transfer, chip scale power sources, thermal energy harvesting and implantable biofuel cells. We received 177 abstracts and following a careful reviewing process by the Technical Program Committee a total of 137 papers were selected for presentation. These have been organised into 16 oral sessions in two parallel streams and two poster sessions that have been augmented by 10 late news papers. The oral and regular poster papers are, for the first time, being published by the Institute of Physics. We have made every effort to make PowerMEMS 2013 the busiest yet and have included for the first time the PowerMEMS School. This two-day school held at Imperial College London covered a wide range of power-MEMS topics including technologies for power generation, power transmission, energy storage, power electronics interfaces and metrology. Registrations for the School exceeded our expectations and it was full by early November. We hope this, and other activities such as the Discussion Panel and the inclusion of late news papers, will make PowerMEMS 2013 a memorable success. We have also reached out to new communities, such as those working in wireless power transfer and RF harvesting to broaden the technology remit of our conference. The social program is an important aspect of any conference and the PowerMEMS 2013 banquet will be held in the Science Museum. This provides a fantastic opportunity to network whilst viewing some of the fundamental engineering innovations that have ultimately bought us all here today. There is a long list of individuals we would like to thank for their support in organising PowerMEMS 2013. Once again the TPC, chaired by Eric Yeatman and Douglas Paul, have given us their valuable time and effort in reviewing abstracts. The PowerMEMS School chairs Einar Halvorsen and Shad Roundy and the expert speakers made the School possible. The local organising committee, led by Alwyn Elliott, have provided us with invaluable assistance in making PowerMEMS 2013 happen. The financial support from Imperial College London, the University of Southampton and conference sponsors has also been gratefully appreciated. Finally, we would like to thank you all for attending and helping in making PowerMEMS 2013 a success. We wish you a productive and enjoyable conference and a wonderful stay in London. Paul Mitcheson and Steve Beeby CONFERENCE OFFICIALS Conference Co-Chairs Stephen Beeby, University of Southampton, UK Paul Mitcheson, Imperial College London, UK Technical Program Committee Co-Chairs Douglas Paul, University of Glasgow, UK Eric Yeatman, Imperial College London, UK PowerMEMS School Co Chairs Einar Halvorsen, Vestfold University College, Norway Shad Roundy, University of Utah, USA Local Organising Committee Chair Alwyn Elliott, Imperial College London, UK International Steering Committee Mark Allen, Georgia Institute of Technology, USA Steve Beeby, University of Southampton, UK Young-Ho Cho, KAIST, South Korea Alan Epstein, Massachusetts Institute of Technology, USA Masayoshi Esashi, Tohoku University, Japan Luc Fréchette, Université de Sherbrooke, Canada Reza Ghodssi, University of Maryland, USA Hiroki Kuwano, Tohoku University, Japan Jeff Lang, Massachusetts Institute of Technology, USA Ryutaro Maeda, National Institute of Advanced Industrial Science and Technology, Japan Kazusuke Maenaka, University of Hyogo, Japan Paul Mitcheson, Imperial College London, UK Albert Pisano, UC San Diego, USA Susumu Sugiyama, Ritsumeikan University, Japan Yuju Suzuki, University of Tokyo, Japan Shuji Tanaka, Tohoku University, Japan Miwako Waga, Susano Berkeley LLC, Japan Peter Woias, University Freiburg IMTEK, Germany Technical Program Committee David Arnold, University of Florida, USA Seiji Aoyagi, Kansai University, Japan Skandar Basrour, Tima Laboratory, France Philippe Basset, Université Paris Est/ESIEE Paris, France Mustafa Ilker Beyaz, Antalya International University, Turkey Danick Briand, École Polytechnique Fédérale de Lausanne (EPFL), Switzerland Steve Burrow, University of Bristol, UK Luc Fréchette, University of Sherbrooke, Canada Takayuki Fujita, University of Hyogo, Japan Florian Herrault, Georgia Institute of Technology, USA Andrew Holmes, Imperial College London, UK Hanseup Kim, University of Utah, USA Seong-Hyok Kim, Georgia Institute of Technology, USA Sejin Kwon, KAIST, South Korea Carol Livermore, Northeastern University, USA Matthew McCarthy, Drexel University, USA Jae Park, Kwangwoon University, South Korea Paul Ronney, University of Southern California, USA Nico de Rooij, École Polytechnique Fédérale de Lausanne (EPFL), Switzerland Yuji Suzuki, University of Tokyo, Japan Shuji Tanaka, Tohoku University, Japan Luis Velasque-Garcia, Massachusetts Institute of Technology, USA Huib Visser, Imec Netherlands Ruud Vullers, Imec, Netherlands C Mike Waits, US Army Research Laboratory, USA Xiaohong Wang, Tsinghua University, China David Yates, Imperial College London, UK Local Organising Committee Dibin Zhu, University of Southampton, UK Alex Weddell, University of Southampton, UK Tzern Toh, Imperial College London, UK Michail Kiziroglou, Imperial College London, UK Christopher Kwan, Imperial College London, UK
Radio Frequency Microelectromechanical Systems [Book Chapter Manuscript
DOE Office of Scientific and Technical Information (OSTI.GOV)
Nordquist, Christopher; Olsson, Roy H.
2014-12-15
Radio frequency microelectromechanical system (RF MEMS) devices are microscale devices that achieve superior performance relative to other technologies by taking advantage of the accuracy, precision, materials, and miniaturization available through microfabrication. To do this, these devices use their mechanical and electrical properties to perform a specific RF electrical function such as switching, transmission, or filtering. RF MEMS has been a popular area of research since the early 1990s, and within the last several years, the technology has matured sufficiently for commercialization and use in commercial market systems.
Haptic Technologies for MEMS Design
NASA Astrophysics Data System (ADS)
Calis, Mustafa; Desmulliez, Marc P. Y.
2006-04-01
This paper presents for the first time a design methodology for MEMS/NEMS based on haptic sensing technologies. The software tool created as a result of this methodology will enable designers to model and interact in real time with their virtual prototype. One of the main advantages of haptic sensing is the ability to bring unusual microscopic forces back to the designer's world. Other significant benefits for developing such a methodology include gain productivity and the capability to include manufacturing costs within the design cycle.
Can mobile phones used in strong motion seismology?
NASA Astrophysics Data System (ADS)
D'Alessandro, Antonino; D'Anna, Giuseppe
2013-04-01
Micro Electro-Mechanical Systems (MEMS) accelerometers are electromechanical devices able to measure static or dynamic accelerations. In the 1990s MEMS accelerometers revolutionized the automotive-airbag system industry and are currently widely used in laptops, game controllers and mobile phones. Nowadays MEMS accelerometers seems provide adequate sensitivity, noise level and dynamic range to be applicable to earthquake strong motion acquisition. The current use of 3 axes MEMS accelerometers in mobile phone maybe provide a new means to easy increase the number of observations when a strong earthquake occurs. However, before utilize the signals recorded by a mobile phone equipped with a 3 axes MEMS accelerometer for any scientific porpoise, it is fundamental to verify that the signal collected provide reliable records of ground motion. For this reason we have investigated the suitability of the iPhone 5 mobile phone (one of the most popular mobile phone in the world) for strong motion acquisition. It is provided by several MEMS devise like a three-axis gyroscope, a three-axis electronic compass and a the LIS331DLH three-axis accelerometer. The LIS331DLH sensor is a low-cost high performance three axes linear accelerometer, with 16 bit digital output, produced by STMicroelectronics Inc. We have tested the LIS331DLH MEMS accelerometer using a vibrating table and the EpiSensor FBA ES-T as reference sensor. In our experiments the reference sensor was rigidly co-mounted with the LIS331DHL MEMS sensor on the vibrating table. We assessment the MEMS accelerometer in the frequency range 0.2-20 Hz, typical range of interesting in strong motion seismology and earthquake engineering. We generate both constant and damped sine waves with central frequency starting from 0.2 Hz until 20 Hz with step of 0.2 Hz. For each frequency analyzed we generate sine waves with mean amplitude 50, 100, 200, 400, 800 and 1600 mg0. For damped sine waves we generate waveforms with initial amplitude of 2 g0. Our tests show as, in the frequency and amplitude range analyzed (0.2-20 Hz, 10-2000 mg0), the LIS331DLH MEMS accelerometer have excellent frequency and phase response, comparable with that of some standard FBA accelerometer used in strong motion seismology. However, we found that the signal recorded by the LIS331DLH MEMS accelerometer slightly underestimates the real acceleration (of about 2.5%). This suggests that may be important to calibrate a MEMS sensor before using it in scientific applications. A drawback of the LIS331DLH MEMS accelerometer is its low sensitivity. This is an important limitation of all the low cost MEMS accelerometers; therefore nowadays they are desirable to use only in strong motion seismology. However, the rapid development of this technology will lead in the coming years to the development of high sensitivity and low noise digital MEMS sensors that may be replace the current seismic accelerometer used in seismology. Actually, the real main advantage of these sensors is their common use in the mobile phones.
Novel ultra-lightweight and high-resolution MEMS x-ray optics
NASA Astrophysics Data System (ADS)
Mitsuishi, Ikuyuki; Ezoe, Yuichiro; Takagi, Utako; Mita, Makoto; Riveros, Raul; Yamaguchi, Hitomi; Kato, Fumiki; Sugiyama, Susumu; Fujiwara, Kouzou; Morishita, Kohei; Nakajima, Kazuo; Fujihira, Shinya; Kanamori, Yoshiaki; Yamasaki, Noriko Y.; Mitsuda, Kazuhisa; Maeda, Ryutaro
2009-05-01
We have been developing ultra light-weight X-ray optics using MEMS (Micro Electro Mechanical Systems) technologies.We utilized crystal planes after anisotropic wet etching of silicon (110) wafers as X-ray mirrors and succeeded in X-ray reflection and imaging. Since we can etch tiny pores in thin wafers, this type of optics can be the lightest X-ray telescope. However, because the crystal planes are alinged in certain directions, we must approximate ideal optical surfaces with flat planes, which limits angular resolution of the optics on the order of arcmin. In order to overcome this issue, we propose novel X-ray optics based on a combination of five recently developed MEMS technologies, namely silicon dry etching, X-ray LIGA, silicon hydrogen anneal, magnetic fluid assisted polishing and hot plastic deformation of silicon. In this paper, we describe this new method and report on our development of X-ray mirrors fabricated by these technologies and X-ray reflection experiments of two types of MEMS X-ray mirrors made of silicon and nickel. For the first time, X-ray reflections on these mirrors were detected in the angular response measurements. Compared to model calculations, surface roughness of the silicon and nickel mirrors were estimated to be 5 nm and 3 nm, respectively.
NASA Technical Reports Server (NTRS)
Krabach, Timothy
1998-01-01
Some of the many new and advanced exploration technologies which will enable space missions in the 21st century and specifically the Manned Mars Mission are explored in this presentation. Some of these are the system on a chip, the Computed-Tomography imaging Spectrometer, the digital camera on a chip, and other Micro Electro Mechanical Systems (MEMS) technology for space. Some of these MEMS are the silicon micromachined microgyroscope, a subliming solid micro-thruster, a micro-ion thruster, a silicon seismometer, a dewpoint microhygrometer, a micro laser doppler anemometer, and tunable diode laser (TDL) sensors. The advanced technology insertion is critical for NASA to decrease mass, volume, power and mission costs, and increase functionality, science potential and robustness.
NASA Astrophysics Data System (ADS)
Vescovo, P.; Joseph, E.; Bourbon, G.; Le Moal, P.; Minotti, P.; Hibert, C.; Pont, G.
2003-09-01
This paper focuses on recent advances in the field of MEMS-based actuators and distributed microelectromechanical systems (MEMS). IC-processed actuators (e.g. actuators that are machined using integrated circuit batch processes) are expected to open a wide range of industrial applications on the near term. The most promising investigations deal with high-aspect ratio electric field driven microactuators suitable for use in numerous technical fields such as aeronautics and space industry. Because the silicon micromachining technology have the potential to integrate both mechanical components and control circuits within a single process, MEMS-based active control of microscopic and macroscopic structures appears to be one of the most promising challenges for the next decade. As a first step towards new generations of MEMS-based smart structures, recent investigations dealing with silicon mechanisms involving MEMS-based actuators are briefly discussed in this paper.
MEMS reliability: coming of age
NASA Astrophysics Data System (ADS)
Douglass, Michael R.
2008-02-01
In today's high-volume semiconductor world, one could easily take reliability for granted. As the MOEMS/MEMS industry continues to establish itself as a viable alternative to conventional manufacturing in the macro world, reliability can be of high concern. Currently, there are several emerging market opportunities in which MOEMS/MEMS is gaining a foothold. Markets such as mobile media, consumer electronics, biomedical devices, and homeland security are all showing great interest in microfabricated products. At the same time, these markets are among the most demanding when it comes to reliability assurance. To be successful, each company developing a MOEMS/MEMS device must consider reliability on an equal footing with cost, performance and manufacturability. What can this maturing industry learn from the successful development of DLP technology, air bag accelerometers and inkjet printheads? This paper discusses some basic reliability principles which any MOEMS/MEMS device development must use. Examples from the commercially successful and highly reliable Digital Micromirror Device complement the discussion.
Concepts, characterization, and modeling of MEMS microswitches with gold contacts in MUMPs
NASA Astrophysics Data System (ADS)
Lafontan, Xavier; Dufaza, Christian; Robert, Michel; Pressecq, Francis; Perez, Guy
2001-04-01
This paper demonstrates that RF MEMS micro-switches can be realized with a low cost MEMS technology such as MUMPs. Two different switches are proposed, namely the hinged beam switch and the gold overflowing switch. Their concepts, design and characterization are described in details. On-resistance as low as 5 - 6 (Omega) for the gold overflowing switch and 2 - 3 (Omega) for the hinged beam switch have been measured. Finally, experimental measurements showed that force and electrical current had strong influences on the overall electrical contact.
3-D Printing as an Effective Educational Tool for MEMS Design and Fabrication
ERIC Educational Resources Information Center
Dahle, Reena; Rasel, Rafiul
2016-01-01
This paper presents a series of course modules developed as a high-impact and cost-effective learning tool for modeling and simulating the microfabrication process and design of microelectromechanical systems (MEMS) devices using three-dimensional (3-D) printing. Microfabrication technology is an established fabrication technique for small and…
Urban MEMS based seismic network for post-earthquakes rapid disaster assessment
NASA Astrophysics Data System (ADS)
D'Alessandro, A.; Luzio, D.; D'Anna, G.
2014-09-01
In this paper, we introduce a project for the realization of the first European real-time urban seismic network based on Micro Electro-Mechanical Systems (MEMS) technology. MEMS accelerometers are a highly enabling technology, and nowadays, the sensitivity and the dynamic range of these sensors are such as to allow the recording of earthquakes of moderate magnitude even at a distance of several tens of kilometers. Moreover, thanks to their low cost and smaller size, MEMS accelerometers can be easily installed in urban areas in order to achieve an urban seismic network constituted by high density of observation points. The network is being implemented in the Acireale Municipality (Sicily, Italy), an area among those with the highest hazard, vulnerability and exposure to the earthquake of the Italian territory. The main objective of the implemented urban network will be to achieve an effective system for post-earthquake rapid disaster assessment. The earthquake recorded, also that with moderate magnitude will be used for the effective seismic microzonation of the area covered by the network. The implemented system will be also used to realize a site-specific earthquakes early warning system.
Solid oxide MEMS-based fuel cells
Jankowksi, Alan F.; Morse, Jeffrey D.
2007-03-13
A micro-electro-mechanical systems (MEMS) based thin-film fuel cells for electrical power applications. The MEMS-based fuel cell may be of a solid oxide type (SOFC), a solid polymer type (SPFC), or a proton exchange membrane type (PEMFC), and each fuel cell basically consists of an anode and a cathode separated by an electrolyte layer. The electrolyte layer can consist of either a solid oxide or solid polymer material, or proton exchange membrane electrolyte materials may be used. Additionally catalyst layers can also separate the electrodes (cathode and anode) from the electrolyte. Gas manifolds are utilized to transport the fuel and oxidant to each cell and provide a path for exhaust gases. The electrical current generated from each cell is drawn away with an interconnect and support structure integrated with the gas manifold. The fuel cells utilize integrated resistive heaters for efficient heating of the materials. By combining MEMS technology with thin-film deposition technology, thin-film fuel cells having microflow channels and full-integrated circuitry can be produced that will lower the operating temperature an will yield an order of magnitude greater power density than the currently known fuel cells.
Solid polymer MEMS-based fuel cells
Jankowski, Alan F [Livermore, CA; Morse, Jeffrey D [Pleasant Hill, CA
2008-04-22
A micro-electro-mechanical systems (MEMS) based thin-film fuel cells for electrical power applications. The MEMS-based fuel cell may be of a solid oxide type (SOFC), a solid polymer type (SPFC), or a proton exchange membrane type (PEMFC), and each fuel cell basically consists of an anode and a cathode separated by an electrolyte layer. The electrolyte layer can consist of either a solid oxide or solid polymer material, or proton exchange membrane electrolyte materials may be used. Additionally catalyst layers can also separate the electrodes (cathode and anode) from the electrolyte. Gas manifolds are utilized to transport the fuel and oxidant to each cell and provide a path for exhaust gases. The electrical current generated from each cell is drawn away with an interconnect and support structure integrated with the gas manifold. The fuel cells utilize integrated resistive heaters for efficient heating of the materials. By combining MEMS technology with thin-film deposition technology, thin-film fuel cells having microflow channels and full-integrated circuitry can be produced that will lower the operating temperature an will yield an order of magnitude greater power density than the currently known fuel cells.
Schifferle, Andreas; Dommann, Alex; Neels, Antonia
2017-01-01
New methods are needed in microsystems technology for evaluating microelectromechanical systems (MEMS) because of their reduced size. The assessment and characterization of mechanical and structural relations of MEMS are essential to assure the long-term functioning of devices, and have a significant impact on design and fabrication. Within this study a concept for the investigation of mechanically loaded MEMS materials on an atomic level is introduced, combining high-resolution X-ray diffraction (HRXRD) measurements with finite element analysis (FEA) and mechanical testing. In situ HRXRD measurements were performed on tensile loaded single crystal silicon (SCSi) specimens by means of profile scans and reciprocal space mapping (RSM) on symmetrical (004) and (440) reflections. A comprehensive evaluation of the rather complex XRD patterns and features was enabled by the correlation of measured with simulated, 'theoretical' patterns. Latter were calculated by a specifically developed, simple and fast approach on the basis of continuum mechanical relations. Qualitative and quantitative analysis confirmed the admissibility and accuracy of the presented method. In this context [001] Poisson's ratio was determined providing an error of less than 1.5% with respect to analytical prediction. Consequently, the introduced procedure contributes to further going investigations of weak scattering being related to strain and defects in crystalline structures and therefore supports investigations on materials and devices failure mechanisms.
Schifferle, Andreas; Dommann, Alex; Neels, Antonia
2017-01-01
Abstract New methods are needed in microsystems technology for evaluating microelectromechanical systems (MEMS) because of their reduced size. The assessment and characterization of mechanical and structural relations of MEMS are essential to assure the long-term functioning of devices, and have a significant impact on design and fabrication. Within this study a concept for the investigation of mechanically loaded MEMS materials on an atomic level is introduced, combining high-resolution X-ray diffraction (HRXRD) measurements with finite element analysis (FEA) and mechanical testing. In situ HRXRD measurements were performed on tensile loaded single crystal silicon (SCSi) specimens by means of profile scans and reciprocal space mapping (RSM) on symmetrical (004) and (440) reflections. A comprehensive evaluation of the rather complex XRD patterns and features was enabled by the correlation of measured with simulated, ‘theoretical’ patterns. Latter were calculated by a specifically developed, simple and fast approach on the basis of continuum mechanical relations. Qualitative and quantitative analysis confirmed the admissibility and accuracy of the presented method. In this context [001] Poisson’s ratio was determined providing an error of less than 1.5% with respect to analytical prediction. Consequently, the introduced procedure contributes to further going investigations of weak scattering being related to strain and defects in crystalline structures and therefore supports investigations on materials and devices failure mechanisms. PMID:28533825
Tightly Coupled Inertial Navigation System/Global Positioning System (TCMIG)
NASA Technical Reports Server (NTRS)
Watson, Michael D.; Jackson, Kurt (Technical Monitor)
2002-01-01
Many NASA applications planned for execution later this decade are seeking high performance, miniaturized, low power Inertial Management Units (IMU). Much research has gone into Micro-Electro-Mechanical System (MEMS) over the past decade as a solution to these needs. While MEMS devices have proven to provide high accuracy acceleration measurements, they have not yet proven to have the accuracy required by many NASA missions in rotational measurements. Therefore, a new solution has been formulated integrating the best of all IMU technologies to address these mid-term needs in the form of a Tightly Coupled Micro Inertial Navigation System (INS)/Global Positioning System (GPS) (TCMIG). The TCMIG consists of an INS and a GPS tightly coupled by a Kalman filter executing on an embedded Field Programmable Gate Array (FPGA) processor. The INS consists of a highly integrated Interferometric Fiber Optic Gyroscope (IFOG) and a MEMS accelerometer. The IFOG utilizes a tightly wound fiber coil to reduce volume and the high level of integration and advanced optical components to reduce power. The MEMS accelerometer utilizes a newly developed deep etch process to increase the proof mass and yield a highly accurate accelerometer. The GPS receiver consists of a low power miniaturized version of the Blackjack receiver. Such an IMU configuration is ideal to meet the mid-term needs of the NASA Science Enterprises and the new launch vehicles being developed for the Space Launch Initiative (SLI).
MMI-based MOEMS FT spectrometer for visible and IR spectral ranges
NASA Astrophysics Data System (ADS)
Al-Demerdash, Bassem M.; Medhat, Mostafa; Sabry, Yasser M.; Saadany, Bassam; Khalil, Diaa
2014-03-01
MEMS spectrometers have very strong potential in future healthcare and environmental monitoring applications, where Michelson interferometers are the core optical engine. Recently, MEMS Michelson interferometers based on using silicon interface as a beam splitter (BS) has been proposed [7, 8]. This allows having a monolithically-integrated on-chip FTIR spectrometer. However silicon BS exhibits high absorption loss in the visible range and high material dispersion in the near infrared (NIR) range. For this reason, we propose in this work a novel MOEMS interferometer allowing operation over wider spectral range covering both the infrared (IR) and the visible ranges. The proposed architecture is based on spatial splitting and combining of optical beams using the imaging properties of Multi-Mode Interference MMI waveguide. The proposed structure includes an optical splitter for spatial splitting an input beam into two beams and a combiner for spatial combining the two interferometer beams. A MEMS moveable mirror is provided to produce an optical path difference between the two beams. The new interferometer is fabricated using DRIE technology on an SOI wafer. The movable mirror is metalized and attached to a comb-drive actuator fabricated in the same lithography step in a self-aligned manner on chip. The novel interferometer is tested as a Fourier transform spectrometer. Red laser, IR laser and absorption spectra of different materials are measured with a resolution of 2.5 nm at 635-nm wavelength. The structure is a very compact one that allows its integration and fabrication on a large scale with very low cost.
New optoelectronic methodology for nondestructive evaluation of MEMS at the wafer level
NASA Astrophysics Data System (ADS)
Furlong, Cosme; Ferguson, Curtis F.; Melson, Michael J.
2004-02-01
One of the approaches to fabrication of MEMS involves surface micromachining to define dies on single crystal silicon wafers, dicing of the wafers to separate the dies, and electronic packaging of the individual dies. Dicing and packaging of MEMS accounts for a large fraction of the fabrication costs, therefore, nondestructive evaluation at the wafer level, before dicing, can have significant implications on improving production yield and costs. In this paper, advances in development of optoelectronic holography (OEH) techniques for nondestructive, noninvasive, full-field of view evaluation of MEMS at the wafer level are described. With OEH techniques, quantitative measurements of shape and deformation of MEMS, as related to their performance and integrity, are obtained with sub-micrometer spatial resolution and nanometer measuring accuracy. To inspect an entire wafer with OEH methodologies, measurements of overlapping regions of interest (ROI) on a wafer are recorded and adjacent ROIs are stitched together through efficient 3D correlation analysis algorithms. Capabilities of the OEH techniques are illustrated with representative applications, including determination of optimal inspection conditions to minimize inspection time while achieving sufficient levels of accuracy and resolution.
Arshak, A; Arshak, K; Waldron, D; Morris, D; Korostynska, O; Jafer, E; Lyons, G
2005-06-01
Telemetry capsules have existed since the 1950s and were used to measure temperature, pH or pressure inside the gastrointestinal (GI) tract. It was hoped that these capsules would replace invasive techniques in the diagnosis of function disorders in the GI tract. However, problems such as signal loss and uncertainty of the pills position limited their use in a clinical setting. In this paper, a review of the capabilities of MicroElectroMechanical Systems (MEMS) and thick film technology (TFT) for the fabrication of a wireless pressure sensing microsystem is presented. The circuit requirements and methods of data transfer are examined. The available fabrication methods for MEMS sensors are also discussed and examples of wireless sensors are given. Finally the limitations of each technology are examined.
NASA Astrophysics Data System (ADS)
Dascalu, Dan; Muller, Alexandru
2003-07-01
It is a great pleasure for us to introduce this special issue featuring selected papers from the 13th European Micromechanics Workshop, MME'02, organized by the National Institute for R&D in Microtechnologies (IMT Bucharest). The conference was held in the beautiful mountain resort Sinaia, a former Romanian royal residence, 120 km north of Bucharest. In 1989 the first MME workshop was held in Twente, since then it has traveled from one Western European country to another. MME'02 is the first workshop to have been held in Eastern Europe. MEMS consolidated as an exciting field for research and development over the past decade and the MEMS industry is now a substantial presence. Commercial applications of MEMS technology now include pressure, chemical, acceleration, rotation rate sensors, microphones, microdevices in microfluidic systems for bio-engineering, RF switches and fiber optic networks (optical switches), etc. Microtechnology is one of the major growth markets of the 21st century. Microsystems are now key products in information and communication technology, automotive engineering and are also increasing in the fields of chemistry and life sciences. The 6th Framework Programme, already underway, promotes long-term initiatives in this area of research. After reviewing 72 high-quality abstracts submitted for the conference, the programme organizers selected 68 for presentation during the one and half days of the workshop. There were 62 papers from Europe and six papers from outside Europe (USA, Canada and Singapore). The papers covered materials, processing, modeling and applications of micromachining and micromachined devices. Following the tradition of the MME workshops, non-invited papers were discussed at poster sessions after a short oral presentation. This formula was again highly appreciated and stimulated much discussion between scientists. Five invited papers were also presented orally. These invited talks reviewed the latest technological developments in MEMS topics. This year special attention was devoted to the emerging RF MEMS technology. In addition, a presentation of `Microsystems in FP6' was held as a special invited talk at the end of the conference. The selection of papers for inclusion in this issue was difficult, due to the high quality of the papers of the workshop. The final content is a result of the collaboration of the programme committee and Institute of Physics Publishing staff. We wish to thank our colleagues from the MME'02 programme committee: A G R Evans (Southampton University), M Hill (Cork Institute of Technology) and R Wolffenbuttel (Delft University of Technology). We are grateful to all participants for making the workshop a very stimulating meeting place for the MEMS community in Europe.
Damage assessment in multilayered MEMS structures under thermal fatigue
NASA Astrophysics Data System (ADS)
Maligno, A. R.; Whalley, D. C.; Silberschmidt, V. V.
2011-07-01
This paper reports on the application of a Physics of Failure (PoF) methodology to assessing the reliability of a micro electro mechanical system (MEMS). Numerical simulations, based on the finite element method (FEM) using a sub-domain approach was used to examine the damage onset due to temperature variations (e.g. yielding of metals which may lead to thermal fatigue). In this work remeshing techniques were employed in order to develop a damage tolerance approach based on the assumption that initial flaws exist in the multi-layered.
NASA Astrophysics Data System (ADS)
Tanaka, Shuji
2009-09-01
This special issue of the Journal of Micromechanics and Microengineering features papers selected from The 8th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2008) with the 2nd Symposium on Micro Environmental Machine Systems (μMEMS 2008). The workshop was held in Sendai, Japan on 9-12 November 2008 by Tohoku University. This is the second time that the PowerMEMS workshop has been held in Sendai, following the first workshop in 2000. Power MEMS is one of the newest categories of MEMS, which encompasses microdevices and microsystems for power generation, energy conversion and propulsion. The first concept of Power MEMS was born in the late 1990's from a MEMS-based gas turbine project at Massachusetts Institute of Technology. After that, the research and development of Power MEMS have been promoted by the strong need for compact power sources with high energy and/or power density. Since its inception, Power MEMS has expanded to include not only various MEMS-based power generators but also small energy machines and microdevices for macro power generators. Previously, the main topics of the PowerMEMS workshop were miniaturized gas turbines and micro fuel cells, but recently, energy harvesting has been the hottest topic. In 2008, energy harvesting had a 41% share in the 118 accepted regular papers. This special issue includes 19 papers on various topics. Finally, I would like to express my sincere appreciation to the members of the International Steering Committee, the Technical Program Committee, the Local Organizing Committee and financial supporters. This special issue was edited in collaboration with the staff of IOP Publishing.
Adaptive optics for high-contrast imaging of faint substellar companions
NASA Astrophysics Data System (ADS)
Morzinski, Katie M.
Direct imaging of faint objects around bright stars is challenging because the primary star's diffracted light can overwhelm low-mass companions. Nevertheless, advances in adaptive optics (AO) and high-contrast imaging have revealed the first pictures of extrasolar planets. In this dissertation I employ today's high-contrast AO techniques to image brown dwarfs around stars in the nearby Hyades cluster. Furthermore, I prepare for the next generation of high-contrast AO instrumentation, by qualifying MEMS deformable mirrors for wavefront control in the Gemini Planet Imager. In Part I, I present discovery of 3 new brown dwarfs and 36 low-mass stellar companions to 85 stars in the Hyades, imaged with AO at Keck and Lick Observatories. The "locally-optimized combination of images" (LOCI) image-diversity technique filters out the primary star to reveal faint companions. This survey is complete to the hydrogen-burning limit at separations beyond 20 AU. In the complete sample, multiplicity increases as primary star mass decreases. Additionally, the brown dwarfs are at wide >150 AU separations. Finding this preference for low binding-energy systems is an unexpected result, as the Hyades is 625 Myr old and dynamically relaxed. Future work will continue to explore this trend to understand the dynamical and star formation history of the Hyades. The brown dwarfs are near interesting transition regimes for low-mass objects; therefore, characterizing their atmospheres with spectrophotometry will serve as an important benchmark for our understanding of these cool objects. In Part II, I demonstrate micro-electro-mechanical systems (MEMS) deformable mirrors for high-order wavefront control in the Gemini Planet Imager (GPI). MEMS micromirrors have thousands of degrees of freedom and represent a significant cost efficiency over conventional glass deformable mirrors, making them ideal for high-contrast AO. In Chapter 7, I present experimental evidence that MEMS actuators function well and are stable and repeatable at the sub-nm level over the course of an hour. In Chapter 8, I prove MEMS ability to correct high-order Kolmogorov turbulence and maintain the high-contrast "dark hole" in the GPI woofer-tweeter architecture. Finally, in Chapter 9, I analyze MEMS performance on sky with Villages, a telescope testbed for MEMS technology, visible-light AO, and open-loop control. The MEMS remains repeatably flat and controllable over ˜4 years and ˜800 hours of operation. Open loop control of the hysteresis-free MEMS produces a diffraction-limited core in I-band, while internal static errors dominate the on-sky error budget. This work establishes MEMS deformable mirrors as excellent wavefront correctors for high-order AO. The MEMS in GPI will produce a deeper, broader dark hole, allowing for detection and characterization of directly-imaged planets in a fainter, wider search space.
NASA Astrophysics Data System (ADS)
Kenda, A.; Kraft, M.; Tortschanoff, A.; Scherf, Werner; Sandner, T.; Schenk, Harald; Luettjohann, Stephan; Simon, A.
2014-05-01
With a trend towards the use of spectroscopic systems in various fields of science and industry, there is an increasing demand for compact spectrometers. For UV/VIS to the shortwave near-infrared spectral range, compact hand-held polychromator type devices are widely used and have replaced larger conventional instruments in many applications. Still, for longer wavelengths this type of compact spectrometers is lacking suitable and affordable detector arrays. In perennial development Carinthian Tech Research AG together with the Fraunhofer Institute for Photonic Microsystems endeavor to close this gap by developing spectrometer systems based on photonic MEMS. Here, we review on two different spectrometer developments, a scanning grating spectrometer working in the NIR and a FT-spectrometer accessing the mid-IR range up to 14 μm. Both systems are using photonic MEMS devices actuated by in-plane comb drive structures. This principle allows for high mechanical amplitudes at low driving voltages but results in gratings respectively mirrors oscillating harmonically. Both systems feature special MEMS structures as well as aspects in terms of system integration which shall tease out the best possible overall performance on the basis of this technology. However, the advantages of MEMS as enabling technology for high scanning speed, miniaturization, energy efficiency, etc. are pointed out. Whereas the scanning grating spectrometer has already evolved to a product for the point of sale analysis of traditional Chinese medicine products, the purpose of the FT-spectrometer as presented is to demonstrate what is achievable in terms of performance. Current developments topics address MEMS packaging issues towards long term stability, further miniaturization and usability.
Optically transduced MEMS magnetometer
Nielson, Gregory N; Langlois, Eric
2014-03-18
MEMS magnetometers with optically transduced resonator displacement are described herein. Improved sensitivity, crosstalk reduction, and extended dynamic range may be achieved with devices including a deflectable resonator suspended from the support, a first grating extending from the support and disposed over the resonator, a pair of drive electrodes to drive an alternating current through the resonator, and a second grating in the resonator overlapping the first grating to form a multi-layer grating having apertures that vary dimensionally in response to deflection occurring as the resonator mechanically resonates in a plane parallel to the first grating in the presence of a magnetic field as a function of the Lorentz force resulting from the alternating current. A plurality of such multi-layer gratings may be disposed across a length of the resonator to provide greater dynamic range and/or accommodate fabrication tolerances.
MEMS tandem ion-sorption micropump
NASA Astrophysics Data System (ADS)
Grzebyk, T.
2017-12-01
This paper presents a two-stage MEMS ion-sorption micropump, which works in a wide range of pressures—it allows efficient evacuation of gases from the internal volume of any microsystem starting from atmospheric pressure down to 10-6 hPa. The miniature pre-vacuum pump is realized as a two-electrode silicon-glass structure with a very close inter-electrode distance. The use of the silicon substrate as a getter material instead of a metallic layer significantly increases the pumping capacity and as a result, the initial pressure can be reduced to a level of 1 hPa. From this point the pumping is continued with the second glow-discharge high vacuum micropump. This pump is a multilayer structure, in which ions are trapped in crossed electric and magnetic fields. It allows further reduction of pressure down to 10-6 hPa. Both pumps are technologically compatible and together they enable the on-chip generation of avacuum at the desired level in a variety of miniaturized devices.
Correlation of Radiation Dosage With Mechanical Properties of Thin Films
NASA Technical Reports Server (NTRS)
Newton, R. L.
2003-01-01
The objective of this investigation was to examine the relationship between irradiation level (proton dose), microstructure, and stress levels in chemical vapor deposited diamond and polysilicon film using crosssectioned specimens. However, the emphasis was placed on the diamond specimen because diamond holds much promise for use in advanced technologies. The use of protons allows not only the study of the charged particle that may cause the most microstructural damage in Earth-orbit microelectromechanical systems (MEMS) devices, but also allows the study of relatively deeply buried damage inside the diamond material. Using protons allows these studies without having to resort to megaelectronvolt implant energies that may create extensive damage due to the high energy that is needed for the implantation process. Since 1 MEMS devices operating in space will not have an opportunity to reverse radiation damage via annealing, only nonannealed specimens were investigated. The following three high spatial resolution techniques were used to examine these relationships: (I) Scanning electron microscopy, (2) micro-Raman spectroscopy, and (3) micro x-ray diffraction.
Advanced Measurement Systems Available to PIWG Members
NASA Technical Reports Server (NTRS)
Anderson, Robert; Lei, Jih-Fen (Technical Monitor)
2002-01-01
It was developed advanced measurement technologies to meet NASA goals: reduce design cycle time, reduce emission, reduce testing time, increase safety. The technology are saving money. This technology are available now for technology transfer: optical diagnostics, the film technology and MEMS devices.
Applications of Digital Micromirror Devices to Astronomical Instrumentation
NASA Astrophysics Data System (ADS)
Robberto, M.
MEMS devices are among the major technological breakthroughs of the last two decades. Besides finding widespread use in high-tech and consumer market electronics, MEMS enable new types of astronomical instruments. I concentrate on Digital Micromirror Devices, which have been already adopted in astronomy and can enable scientific investigations that would otherwise remain beyond our technical capabilities.
ERIC Educational Resources Information Center
Grundbacher, R.; Hoetzel, J. E.; Hierold, C.
2009-01-01
A microelectro-mechanical systems (MEMS) laboratory course (MEMSlab) in the Mechanical and Process Engineering Department at the Swiss Federal Institute of Technology (ETH Zurich), is presented. The course has been taught for four years and has been attended primarily by Master's students from mechanical and electrical engineering; since fall…
Characterization of wafer-level bonded hermetic packages using optical leak detection
NASA Astrophysics Data System (ADS)
Duan, Ani; Wang, Kaiying; Aasmundtveit, Knut; Hoivik, Nils
2009-07-01
For MEMS devices required to be operated in a hermetic environment, one of the main reliability issues is related to the packaging methods applied. In this paper, an optical method for testing low volume hermetic cavities formed by anodic bonding between glass and SOI (silicon on insulator) wafer is presented. Several different cavity-geometry structures have been designed, fabricated and applied to monitor the hermeticity of wafer level anodic bonding. SOI wafer was used as the cap wafer on which the different-geometry structures were fabricated using standard MEMS technology. The test cavities were bonded using SOI wafers to glass wafers at 400C and 1000mbar pressure inside a vacuum bonding chamber. The bonding voltage varies from 200V to 600V. The bonding strength between glass and SOI wafer was mechanically tested using shear tester. The deformation amplitudes of the cavity cap surface were monitored by using an optical interferometer. The hermeticity of the glass-to-SOI wafer level bonding was characterized through observing the surface deformation in a 6 months period in atmospheric environment. We have observed a relatively stable micro vacuum-cavity.
Technology Developments in Radiation-Hardened Electronics for Space Environments
NASA Technical Reports Server (NTRS)
Keys, Andrew S.; Howell, Joe T.
2008-01-01
The Radiation Hardened Electronics for Space Environments (RHESE) project consists of a series of tasks designed to develop and mature a broad spectrum of radiation hardened and low temperature electronics technologies. Three approaches are being taken to address radiation hardening: improved material hardness, design techniques to improve radiation tolerance, and software methods to improve radiation tolerance. Within these approaches various technology products are being addressed including Field Programmable Gate Arrays (FPGA), Field Programmable Analog Arrays (FPAA), MEMS, Serial Processors, Reconfigurable Processors, and Parallel Processors. In addition to radiation hardening, low temperature extremes are addressed with a focus on material and design approaches. System level applications for the RHESE technology products are discussed.
Jackson, Nathan; Muthuswamy, Jit
2009-01-01
We report here a novel approach called MEMS microflex interconnect (MMFI) technology for packaging a new generation of Bio-MEMS devices that involve movable microelectrodes implanted in brain tissue. MMFI addresses the need for (i) operating space for movable parts and (ii) flexible interconnects for mechanical isolation. We fabricated a thin polyimide substrate with embedded bond-pads, vias, and conducting traces for the interconnect with a backside dry etch, so that the flexible substrate can act as a thin-film cap for the MEMS package. A double gold stud bump rivet bonding mechanism was used to form electrical connections to the chip and also to provide a spacing of approximately 15–20 µm for the movable parts. The MMFI approach achieved a chip scale package (CSP) that is lightweight, biocompatible, having flexible interconnects, without an underfill. Reliability tests demonstrated minimal increases of 0.35 mΩ, 0.23 mΩ and 0.15 mΩ in mean contact resistances under high humidity, thermal cycling, and thermal shock conditions respectively. High temperature tests resulted in an increase in resistance of > 90 mΩ when aluminum bond pads were used, but an increase of ~ 4.2 mΩ with gold bond pads. The mean-time-to-failure (MTTF) was estimated to be at least one year under physiological conditions. We conclude that MMFI technology is a feasible and reliable approach for packaging and interconnecting Bio-MEMS devices. PMID:20160981
Ultra-compact MEMS FTIR spectrometer
NASA Astrophysics Data System (ADS)
Sabry, Yasser M.; Hassan, Khaled; Anwar, Momen; Alharon, Mohamed H.; Medhat, Mostafa; Adib, George A.; Dumont, Rich; Saadany, Bassam; Khalil, Diaa
2017-05-01
Portable and handheld spectrometers are being developed and commercialized in the late few years leveraging the rapidly-progressing technology and triggering new markets in the field of on-site spectroscopic analysis. Although handheld devices were commercialized for the near-infrared spectroscopy (NIRS), their size and cost stand as an obstacle against the deployment of the spectrometer as spectral sensing components needed for the smart phone industry and the IoT applications. In this work we report a chip-sized microelectromechanical system (MEMS)-based FTIR spectrometer. The core optical engine of the solution is built using a passive-alignment integration technique for a selfaligned MEMS chip; self-aligned microoptics and a single detector in a tiny package sized about 1 cm3. The MEMS chip is a monolithic, high-throughput scanning Michelson interferometer fabricated using deep reactive ion etching technology of silicon-on-insulator substrate. The micro-optical part is used for conditioning the input/output light to/from the MEMS and for further light direction to the detector. Thanks to the all-reflective design of the conditioning microoptics, the performance is free of chromatic aberration. Complemented by the excellent transmission properties of the silicon in the infrared region, the integrated solution allows very wide spectral range of operation. The reported sensor's spectral resolution is about 33 cm-1 and working in the range of 1270 nm to 2700 nm; upper limited by the extended InGaAs detector. The presented solution provides a low cost, low power, tiny size, wide wavelength range NIR spectral sensor that can be manufactured with extremely high volumes. All these features promise the compatibility of this technology with the forthcoming demand of smart portable and IoT devices.
Millimeter-scale MEMS enabled autonomous systems: system feasibility and mobility
NASA Astrophysics Data System (ADS)
Pulskamp, Jeffrey S.
2012-06-01
Millimeter-scale robotic systems based on highly integrated microelectronics and micro-electromechanical systems (MEMS) could offer unique benefits and attributes for small-scale autonomous systems. This extreme scale for robotics will naturally constrain the realizable system capabilities significantly. This paper assesses the feasibility of developing such systems by defining the fundamental design trade spaces between component design variables and system level performance parameters. This permits the development of mobility enabling component technologies within a system relevant context. Feasible ranges of system mass, required aerodynamic power, available battery power, load supported power, flight endurance, and required leg load bearing capability are presented for millimeter-scale platforms. The analysis illustrates the feasibility of developing both flight capable and ground mobile millimeter-scale autonomous systems while highlighting the significant challenges that must be overcome to realize their potential.
NASA Astrophysics Data System (ADS)
2014-11-01
It is our great pleasure to welcome you to the 14th International Conference on Micro- and Nano-Technology for Power Generation and Energy Conversion Applications, or PowerMEMS 2014, in Awaji Island, Japan. The aim of PowerMEM is to present the latest research results in the field of miniature, micro- and nano-scale technologies for power generation and energy conversion. The conference will also- give us the opportunity to exchange informations and new ideas in the field of Power MEMS/NEMS. The current status of the field of PowerMEMS spans the full spectrum from basic research to practical applications. We will enjoy valuable discussions not only from the viewpoint of academia but from commercial and industrial perspectives. In the conference, three invited speakers lead the technical program. We received 172 abstracts and after a careful reviewing process by the Technical Program Committee a total of 133 papers were selected for presentation. These have been organized into 16 Oral sessions in two parallel streams and two poster sessions including some late-news papers. The oral and regular poster papers are published by the Institute of Physics (IOP). We have also organized a PowerMEMS School in Kobe-Sannomiya contiguous to the main conference. This two-day school will cover various topics of energy harvesting. World leading experts will give invited lectures on their main topics. This is a new experiment to broaden the technology remit of our conference by organizing mini symposiums that aim to gather the latest research on the following topics by the organizers: Microscale Combustion, Wideband Vibration Energy Harvesting, RF Energy Transfer and Industrial Application. We hope this, and other activities will make PowerMEMS2014 a memorable success. One of the important programs in an international conference is the social program, and we prepare the PowerMEMS2014 banquet in the banquet room at the Westin Awaji Island Hotel. This will provide an opportunity to create strong networks between researchers. We also provide nice opportunities to experience Japanese nature and culture. The special cruise to see the magnificent whirlpool up close will definitely be one of the highlights. Additionally, we will serve Awaji's traditional performing art, Awaji Ningyo Joruri, which has a history of over 500 years and has been inherited through the generations. There are many individuals we would like to thank for their support in organizing PowerMEMS2014. The TPC, chaired by Takayuki Fujita, have given us their valuable time and best effort in reviewing abstracts. The PowerMEMS School chair Yuji Suzuki and the expert speakers made the School possible. The local organizing committee, led by Kensuke Kanda has provided us with invaluable assistance in preparing the PowerMEMS2014 venue. The financial support from both the Tsutomu Nakauchi Foundation, the Hyogo International Association and the conference sponsors have also been gratefully appreciated. Finally, we would like to thank each of you for attending the conference and bringing your expertise. We wish you all a successful conference and an exciting and relaxing stay in Awaji Island.
High Sensitivity MEMS Strain Sensor: Design and Simulation
Mohammed, Ahmed A. S.; Moussa, Walied A.; Lou, Edmond
2008-01-01
In this article, we report on the new design of a miniaturized strain microsensor. The proposed sensor utilizes the piezoresistive properties of doped single crystal silicon. Employing the Micro Electro Mechanical Systems (MEMS) technology, high sensor sensitivities and resolutions have been achieved. The current sensor design employs different levels of signal amplifications. These amplifications include geometric, material and electronic levels. The sensor and the electronic circuits can be integrated on a single chip, and packaged as a small functional unit. The sensor converts input strain to resistance change, which can be transformed to bridge imbalance voltage. An analog output that demonstrates high sensitivity (0.03mV/με), high absolute resolution (1με) and low power consumption (100μA) with a maximum range of ±4000με has been reported. These performance characteristics have been achieved with high signal stability over a wide temperature range (±50°C), which introduces the proposed MEMS strain sensor as a strong candidate for wireless strain sensing applications under harsh environmental conditions. Moreover, this sensor has been designed, verified and can be easily modified to measure other values such as force, torque…etc. In this work, the sensor design is achieved using Finite Element Method (FEM) with the application of the piezoresistivity theory. This design process and the microfabrication process flow to prototype the design have been presented. PMID:27879841
Review of Polyimides Used in the Manufacturing of Micro Systems
NASA Technical Reports Server (NTRS)
Wilson, William C.; Atkinson, Gary M.
2007-01-01
Since their invention, polyimides have found numerous uses in MicroElectroMechanical Systems (MEMS) technology. Polyimides can act as photoresist, sacrificial layers, structural layers, and even as a replacement for silicon as the substrate during MEMS fabrication. They enable fabrication of both low and high aspect ratio devices. Polyimides have been used to fabricate expendable molds and reusable flexible molds. Development of a variety of devices that employ polyimides for sensor applications has occurred. Micro-robotic actuator applications include hinges, thermal actuators and residual stress actuators. Currently, polyimides are being used to create new sensors and devices for aerospace applications. This paper presents a review of some of the many uses of polyimides in the development of MEMS devices, including a new polyimide based MEMS fabrication process.
NASA Astrophysics Data System (ADS)
Khosla, Ajit
2017-04-01
This talk focuses on preparation, characterization and micropatterning of electrically conducting KETJENBLACK carbon black nanoparticle (80 nm-diameter) doped Polydimethylsiloxane (PDMS) by employing extrusion mixing. Previously, we had reported fabrication of various micropatternable nanocomposites for wearable sensing applications vis solvent assisted ultrasonic mixing technique[1-16] . Extrusion mixing has an advantage as no organic solvents are used and homogenous dispersion of carbon nanoparticles is observed, which is confirmed by SEM analysis. The developed nanocomposite can be micropatterened using standard microfabrication techniques. It is also observed that percolation threshold occurs at 0.51 wt% of carbon nanoparticles in polymer matrix. Examples of developed nano-composites for wearable sensing applications for precision medicine will also be discussed. References: 1.http://summit.sfu.ca/item/12017 A. Khosla. Micropatternable multifunctional nanocomposite polymers for flexible soft MEMS applications. Diss. Applied Science: School of Engineering Science, 2011. 2. A. Khosla ; B. L. Gray; Fabrication of multiwalled carbon nanotube polydimethylsiloxne nanocomposite polymer flexible microelectrodes for microfluidics and MEMS. Proc. SPIE 7642, Electroactive Polymer Actuators and Devices (EAPAD) 2010, 76421V (April 09, 2010); doi:10.1117/12.847292. 3. Ang Li ; Ajit Khosla ; Connie Drewbrook ; Bonnie L. Gray; Fabrication and testing of thermally responsive hydrogel-based actuators using polymer heater elements for flexible microvalves. Proc. SPIE 7929, Microfluidics, BioMEMS, and Medical Microsystems IX, 79290G (February 14, 2011); doi:10.1117/12.873197. 4. Khosla, A. and Gray, B. L. (2010), Preparation, Micro-Patterning and Electrical Characterization of Functionalized Carbon-Nanotube Polydimethylsiloxane Nanocomposite Polymer. Macromol. Symp., 297: 210-218. doi:10.1002/masy.200900165 5. A. Khosla ; D. Hilbich ; C. Drewbrook ; D. Chung ; B. L. Gray; Large scale micropatterning of multi-walled carbon nanotube/polydimethylsiloxane nanocomposite polymer on highly flexible 12×24 inch substrates. Proc. SPIE 7926, Micromachining and Microfabrication Process Technology XVI, 79260L (February 15, 2011); doi:10.1117/12.876738. 6. A. Khosla, and Bonnie L. Gray. "(Invited) Micropatternable Multifunctional Nanocomposite Polymers for Flexible Soft NEMS and MEMS Applications." ECS Transactions 45.3 (2012): 477-494. doi: 10.1149/1.3700913 7. Khosla, Ajit. "Nanoparticle-doped electrically-conducting polymers for flexible nano-micro Systems." Electrochemical Society Interface 21.3-4 (2012): 67-70. 8. Ajit Khosla; Smart garments in chronic disease management: progress and challenges. Proc. SPIE 8548, Nanosystems in Engineering and Medicine, 85482O (October 24, 2012); doi:10.1117/12.979667. 9. D. Chung ; A. Khosla ; B. L. Gray; Screen printable flexible conductive nanocomposite polymer with applications to wearable sensors. Proc. SPIE 9060, Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2014, 90600U (April 16, 2014); doi:10.1117/12.2046548. 10. Daehan Chung ; Sam Seyfollahi ; Ajit Khosla ; Bonnie Gray ; Ash Parameswaran ; Ramani Ramaseshan ; Kirpal Kohli; Initial experiments with flexible conductive electrodes for potential applications in cancer tissue screening. Proc. SPIE 7929, Microfluidics, BioMEMS, and Medical Microsystems IX, 79290Z (February 14, 2011); doi:10.1117/12.875563. 11. A. Khosla ; B. L. Gray; New technologies for large-scale micropatterning of functional nanocomposite polymers. Proc. SPIE 8344, Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2012, 83440W (April 26, 2012); doi:10.1117/12.915178. 12. A. Khosla, B.L. Gray, Preparation, characterization and micromolding of multi-walled carbon nanotube polydimethylsiloxane conducting nanocomposite polymer, Materials Letters, Volume 63, Issues 13-14, 31 May 2009, Pages 1203-1206, ISSN 0167-577X, http://dx.doi.org/10.1016/j.matlet.2009.02.043. 13. Giassa, M., Khosla, A., Gray, B. et al. J Electron Test (2010) 26: 139. doi:10.1007/s10836-009-5125-3 14.Ozhikandathil, Jayan, Ajit Khosla, and Muthukumaran Packirisamy. "Electrically Conducting PDMS Nanocomposite Using In Situ Reduction of Gold Nanostructures and Mechanical Stimulation of Carbon Nanotubes and Silver Nanoparticles." ECS Journal of Solid State Science and Technology 4.10 (2015): S3048-S3052. doi:10.1149/2.0091510jss 15. Kassegne, Sam, Maria Vomero, Roberto Gavuglio, Mieko Hirabayashi, Emre Özyilmaz, Sebastien Nguyen, Jesus Rodriguez, Eda Özyilmaz, Pieter van Niekerk, and Ajit Khosla. "Electrical impedance, electrochemistry, mechanical stiffness, and hardness tunability in glassy carbon MEMS μECoG electrodes." Microelectronic Engineering 133 (2015): 36-44. 16. A. Khosla ; B. L. Gray; Fabrication and properties of conductive micromoldable thermosetting polymer for electronic routing in highly flexible microfluidic systems. Proc. SPIE 7593, Microfluidics, BioMEMS, and Medical Microsystems VIII, 759314 (February 17, 2010); doi:10.1117/12.840911.
Wearable Wireless Telemetry System for Implantable BioMEMS Sensors
NASA Technical Reports Server (NTRS)
Simons, Rainee N.; Miranda, Felix A.; Wilson, Jeffrey D.; Simons, Renita E.
2008-01-01
Telemetry systems of a type that have been proposed for the monitoring of physiological functions in humans would include the following subsystems: Surgically implanted or ingested units that would comprise combinations of microelectromechanical systems (MEMS)- based sensors [bioMEMS sensors] and passive radio-frequency (RF) readout circuits that would include miniature loop antennas. Compact radio transceiver units integrated into external garments for wirelessly powering and interrogating the implanted or ingested units. The basic principles of operation of these systems are the same as those of the bioMEMS-sensor-unit/external-RFpowering- and-interrogating-unit systems described in "Printed Multi-Turn Loop Antennas for Biotelemetry" (LEW-17879-1) NASA Tech Briefs, Vol. 31, No. 6 (June 2007), page 48, and in the immediately preceding article, "Hand-Held Units for Short-Range Wireless Biotelemetry" (LEW-17483-1). The differences between what is reported here and what was reported in the cited prior articles lie in proposed design features and a proposed mode of operation. In a specific system of the type now proposed, the sensor unit would comprise mainly a capacitive MEMS pressure sensor located in the annular region of a loop antenna (more specifically, a square spiral inductor/ antenna), all fabricated as an integral unit on a high-resistivity silicon chip. The capacitor electrodes, the spiral inductor/antenna, and the conductor lines interconnecting them would all be made of gold. The dimensions of the sensor unit have been estimated to be about 110.4 mm. The external garment-mounted powering/ interrogating unit would include a multi-turn loop antenna and signal-processing circuits. During operation, this external unit would be positioned in proximity to the implanted or ingested unit to provide for near-field, inductive coupling between the loop antennas, which we have as the primary and secondary windings of an electrical transformer.
A Novel Silicon Micromachined Integrated MCM Thermal Management System
NASA Technical Reports Server (NTRS)
Kazmierczak, M. J.; Henderson, H. T.; Gerner, F. M.
1997-01-01
"Micromachining" is a chemical means of etching three-dimensional structures, typically in single- crystalline silicon. These techniques are leading toward what is coming to be referred to as MEMS (Micro Electro Mechanical Systems), where in addition to the ordinary two-dimensional (planar) microelectronics, it is possible to build three-dimensional n-ticromotors, electrically- actuated raicrovalves, hydraulic systems and much more on the same microchip. These techniques become possible because of differential etching rates of various crystallographic planes and materials used for semiconductor n-ticrofabfication. The University of Cincinnati group in collaboration with Karl Baker at NASA Lewis were the first to form micro heat pipes in silicon by the above techniques. Current work now in progress using MEMS technology is now directed towards the development of the next generation in MCM (Multi Chip Module) packaging. Here we propose to develop a complete electronic thermal management system which will allow densifica6on in chip stacking by perhaps two orders of magnitude. Furthermore the proposed technique will allow ordinary conu-nercial integrated chips to be utilized. Basically, the new technique involves etching square holes into a silicon substrate and then inserting and bonding commercially available integrated chips into these holes. For example, over a 100 1/4 in. by 1 /4 in. integrated chips can be placed on a 4 in. by 4 in. silicon substrate to form a Multi-Chip Module (MCM). Placing these MCM's in-line within an integrated rack then allows for three-diniensional stacking. Increased miniaturization of microelectronic circuits will lead to very high local heat fluxes. A high performance thermal management system will be specifically designed to remove the generated energy. More specifically, a compact heat exchanger with milli / microchannels will be developed and tested to remove the heat through the back side of this MCM assembly for moderate and high heat flux applications, respectively. The high heat load application of particular interest in mind is the motor controller developed by Martin Marietta for Nasa to control the thruster's directional actuators on space vechicles. Work is also proposed to develop highly advanced and improved porous wick structures for use in advanced heat loops. The porous wick will be micromachined from silicon using MEMS technology, thus permitting far superior control of pore size and pore distribution (over wicks made from sintered n-ietals), which in turn is expected to led to significantly improved heat loop performance.
Evolution from MEMS-based Linear Drives to Bio-based Nano Drives
NASA Astrophysics Data System (ADS)
Fujita, Hiroyuki
The successful extension of semiconductor technology to fabricate mechanical parts of the sizes from 10 to 100 micrometers opened wide ranges of possibilities for micromechanical devices and systems. The fabrication technique is called micromachining. Micromachining processes are based on silicon integrated circuits (IC) technology and used to build three-dimensional structures and movable parts by the combination of lithography, etching, film deposition, and wafer bonding. Microactuators are the key devices allowing MEMS to perform physical functions. Some of them are driven by electric, magnetic, and fluidic forces. Some others utilize actuator materials including piezoelectric (PZT, ZnO, quartz) and magnetostrictive materials (TbFe), shape memory alloy (TiNi) and bio molecular motors. This paper deals with the development of MEMS based microactuators, especially linear drives, following my own research experience. They include an electrostatic actuator, a superconductive levitated actuator, arrayed actuators, and a bio-motor-driven actuator.
MEMS- and LC-adaptive optics at the Naval Research Laboratory
NASA Astrophysics Data System (ADS)
Restaino, S. R.; Wilcox, C. C.; Martinez, T.; Andrews, J. R.; Santiago, F.; Payne, D. M.
2012-06-01
Adaptive Optics (AO) is an ensemble of techniques that aims at the remedial of the deleterious effects that the Earth's turbulent atmosphere induces on both imagery and signal gathering in real time. It has been over four decades since the first AO system was developed and tested. During this time important technological advances have changed profoundly the way that we think and develop AO systems. The use of Micro-Electro-Mechanical-Systems (MEMS) devices and Liquid Crystal Devices (LCD) has revolutionized these technologies making possible to go from very expensive, very large and power consuming systems to very compact and inexpensive systems. These changes have rendered AO systems useful and applicable in other fields ranging from medical imaging to industry. In this paper we will review the research efforts at the Naval research Laboratory (NRL) to develop AO systems based on both MEMs and LCD in order to produce more compact and light weight AO systems.
Piezoelectric devices for generating low power
NASA Astrophysics Data System (ADS)
Chilibon, Irinela
2016-12-01
This paper reviews concepts and applications in low-power electronics and energy harvesting technologies. Various piezoelectric materials and devices for small power generators useful in renewable electricity are presented. The vibrating piezoelectric device differs from the typical electrical power source in that it has capacitive rather than inductive source impedance, and may be driven by mechanical vibrations of varying amplitude. In general, vibration energy could be converted into electrical energy using one of three techniques: electrostatic charge, magnetic fields and piezoelectric. A low power piezoelectric generator, having a PZT element was realised in order to supply small electronic elements, such as optoelectronic small devices, LEDs, electronic watches, small sensors, interferometry with lasers or Micro-electro-mechanical System (MEMS) array with multi-cantilevers.
NASA Astrophysics Data System (ADS)
Furlong, Cosme; Pryputniewicz, Ryszard J.
2002-06-01
Recent technological trends based on miniaturization of mechanical, electro-mechanical, and photonic devices to the microscopic scale, have led to the development of microelectromechanical systems (MEMS). Effective development of MEMS components requires the synergism of advanced design, analysis, and fabrication methodologies, and also of quantitative metrology techniques for characterizing their performance, reliability, and integrity during the electronic packaging cycle. In this paper, we describe opto-electronic techniques for measuring, with sub-micrometer accuracy, shape and changes in states of deformation of MEMS strictures. With the described opto-electronic techniques, it is possible to characterize MEMS components using the display and data modes. In the display mode, interferometric information related to shape and deformation is displayed at video frame rates, providing the capability for adjusting and setting experimental conditions. In the data mode, interferometric information related to shape and deformation is recorded as high-spatial and high-digital resolution images, which are further processed to provide quantitative 3D information. Furthermore, the quantitative 3D data are exported to computer-aided design (CAD) environments and utilized for analysis and optimization of MEMS devices. Capabilities of opto- electronic techniques are illustrated with representative applications demonstrating their applicability to provide indispensable quantitative information for the effective development and optimization of MEMS devices.
MOEMS FPI sensors for NIR-MIR microspectrometer applications
NASA Astrophysics Data System (ADS)
Akujärvi, A.; Guo, B.; Mannila, R.; Rissanen, A.
2016-03-01
This paper presents near- and mid- infrared (NIR-MIR) wavelength range optical MEMS Fabry-Perot interferometers (FPIs) developed for automotive and multi-gas sensing applications. MEMS FPI platform for NIR-range consist of LPCVD (low-pressure chemical vapour) deposited polySi-SiN λ/4-thin film Bragg reflectors, with the air gap formed by sacrificial SiO2 etching in HF vapour. Characterization results for the NIR MFPI devices for λ = 1.5 - 2.0 μm show resolution of 15 nm at the optimization wavelength of 1750 nm. We also present a MIR-range MEMS FPI for λ = 2.5 - 3.5 μm, which utilizes silicon and air in within the Bragg reflector structure to provide a high contrast for improved resolution. Characterization results show a FWHM (Full Width Half Maximum) of 20 nm in comparison to the 50 nm resolution provided by earlier MEMS FPIs realized for hydrocarbon sensing with conventional CVD-thin film materials. The improved resolution and the extended operation region shows potential to enable simultaneous sensing of CO2 and multiple hydrocarbons.
Finite element based contact analysis of radio frequency MEMs switch membrane surfaces
NASA Astrophysics Data System (ADS)
Liu, Jin-Ya; Chalivendra, Vijaya; Huang, Wenzhen
2017-10-01
Finite element simulations were performed to determine the contact behavior of radio frequency (RF) micro-electro-mechanical (MEM) switch contact surfaces under monotonic and cyclic loading conditions. Atomic force microscopy (AFM) was used to capture the topography of RF-MEM switch membranes and later they were analyzed for multi-scale regular as well as fractal structures. Frictionless, non-adhesive contact 3D finite element analysis was carried out at different length scales to investigate the contact behavior of the regular-fractal surface using an elasto-plastic material model. Dominant micro-scale regular patterns were found to significantly change the contact behavior. Contact areas mainly cluster around the regular pattern. The contribution from the fractal structure is not significant. Under cyclic loading conditions, plastic deformation in the 1st loading/unloading cycle smooth the surface. The subsequent repetitive loading/unloading cycles undergo elastic contact without changing the morphology of the contacting surfaces. The work is expected to shed light on the quality of the switch surface contact as well as the optimum design of RF MEM switch surfaces.
Urban MEMS based seismic network for post-earthquakes rapid disaster assessment
NASA Astrophysics Data System (ADS)
D'Alessandro, Antonino; Luzio, Dario; D'Anna, Giuseppe
2014-05-01
Life losses following disastrous earthquake depends mainly by the building vulnerability, intensity of shaking and timeliness of rescue operations. In recent decades, the increase in population and industrial density has significantly increased the exposure to earthquakes of urban areas. The potential impact of a strong earthquake on a town center can be reduced by timely and correct actions of the emergency management centers. A real time urban seismic network can drastically reduce casualties immediately following a strong earthquake, by timely providing information about the distribution of the ground shaking level. Emergency management centers, with functions in the immediate post-earthquake period, could be use this information to allocate and prioritize resources to minimize loss of human life. However, due to the high charges of the seismological instrumentation, the realization of an urban seismic network, which may allow reducing the rate of fatalities, has not been achieved. Recent technological developments in MEMS (Micro Electro-Mechanical Systems) technology could allow today the realization of a high-density urban seismic network for post-earthquakes rapid disaster assessment, suitable for the earthquake effects mitigation. In the 1990s, MEMS accelerometers revolutionized the automotive-airbag system industry and are today widely used in laptops, games controllers and mobile phones. Due to their great commercial successes, the research into and development of MEMS accelerometers are actively pursued around the world. Nowadays, the sensitivity and dynamics of these sensors are such to allow accurate recording of earthquakes with moderate to strong magnitude. Due to their low cost and small size, the MEMS accelerometers may be employed for the realization of high-density seismic networks. The MEMS accelerometers could be installed inside sensitive places (high vulnerability and exposure), such as schools, hospitals, public buildings and places of worship. The waveforms recorded could be promptly used to determine ground-shaking parameters, like peak ground acceleration/velocity/displacement, Arias and Housner intensity, that could be all used to create, few seconds after a strong earthquakes, shaking maps at urban scale. These shaking maps could allow to quickly identify areas of the town center that have had the greatest earthquake resentment. When a strong seismic event occur, the beginning of the ground motion observed at the site could be used to predict the ensuing ground motion at the same site and so to realize a short term earthquake early warning system. The data acquired after a moderate magnitude earthquake, would provide valuable information for the detail seismic microzonation of the area based on direct earthquake shaking observations rather than from a model-based or indirect methods. In this work, we evaluate the feasibility and effectiveness of such seismic network taking in to account both technological, scientific and economic issues. For this purpose, we have simulated the creation of a MEMS based urban seismic network in a medium size city. For the selected town, taking into account the instrumental specifics, the array geometry and the environmental noise, we investigated the ability of the planned network to detect and measure earthquakes of different magnitude generated from realistic near seismogentic sources.
NASA Astrophysics Data System (ADS)
Weise, Sebastian; Steinbach, Bastian; Biermann, Steffen
2016-03-01
The series JSIR350 sources are MEMS based infrared emitters. These IR sources are characterized by a high radiation output. Thus, they are excellent for NDIR gas analysis and are ideally suited for using with our pyro-electric or thermopile detectors. The MEMS chips used in Micro-Hybrid's infrared emitters consist of nano-amorphous carbon (NAC). The MEMS chips are produced in the USA. All Micro-Hybrid Emitter are designed and specified to operate up to 850°C. The improvements we have made in the source's packaging enable us to provide IR sources with the best performance on the market. This new technology enables us to seal the housings of infrared radiation sources with soldered infrared filters or windows and thus cause the parts to be impenetrable to gases. Micro-Hybrid provide various ways of adapting our MEMS based infrared emitter JSIR350 to customer specifications, like specific burn-in parameters/characteristic, different industrial standard housings, producible with customized cap, reflector or pin-out.
Gas detection with microelectromechanical Fabry-Perot interferometer technology in cell phone
NASA Astrophysics Data System (ADS)
Mannila, Rami; Hyypiö, Risto; Korkalainen, Marko; Blomberg, Martti; Kattelus, Hannu; Rissanen, Anna
2015-06-01
VTT Technical Research Centre of Finland has developed a miniaturized optical sensor for gas detection in a cell phone. The sensor is based on a microelectromechanical (MEMS) Fabry-Perot interferometer, which is a structure with two highly reflective surfaces separated by a tunable air gap. The MEMS FPI is a monolithic device, i.e. it is made entirely on one substrate in a batch process, without assembling separate pieces together. The gap is adjusted by moving the upper mirror with electrostatic force, so there are no actual moving parts. VTT has designed and manufactured a MEMS FPI based carbon dioxide sensor demonstrator which is integrated to a cell phone shield cover. The demonstrator contains light source, gas cell, MEMS FPI, detector, control electronics and two coin cell batteries as a power source. It is connected to the cell phone by Bluetooth. By adjusting the wavelength range and customizing the MEMS FPI structure, it is possible to selectively sense multiple gases.
MEMS-based tunable gratings and their applications
NASA Astrophysics Data System (ADS)
Yu, Yiting; Yuan, Weizheng; Qiao, Dayong
2015-03-01
The marriage of optics and MEMS has resulted in a new category of optical devices and systems that have unprecedented advantages compared with their traditional counterparts. As an important spatial light modulating technology, diffractive optical MEMS obtains a wide variety of successful commercial applications, e.g. projection displays, optical communication and spectral analysis, due to its features of highly compact, low-cost, IC-compatible, excellent performance, and providing possibilities for developing totally new, yet smart devices and systems. Three most successful MEMS diffraction gratings (GLVs, Polychromator and DMDs) are briefly introduced and their potential applications are analyzed. Then, three different MEMS tunable gratings developed by our group, named as micro programmable blazed gratings (μPBGs) and micro pitch-tunable gratings (μPTGs) working in either digital or analog mode, are demonstrated. The strategies to largely enhance the maximum blazed angle and grating period are described. Some preliminary application explorations based on the developed grating devices are also shown. For our ongoing research focus, we will further improve the device performance to meet the engineering application requirements.
ViLLaGEs: opto-mechanical design of an on-sky visible-light MEMS-based AO system
NASA Astrophysics Data System (ADS)
Grigsby, Bryant; Lockwood, Chris; Baumann, Brian; Gavel, Don; Johnson, Jess; Ammons, S. Mark; Dillon, Daren; Morzinski, Katie; Reinig, Marc; Palmer, Dave; Severson, Scott; Gates, Elinor
2008-07-01
Visible Light Laser Guidestar Experiments (ViLLaGEs) is a new Micro-Electro Mechanical Systems (MEMS) based visible-wavelength adaptive optics (AO) testbed on the Nickel 1-meter telescope at Lick Observatory. Closed loop Natural Guide Star (NGS) experiments were successfully carried out during engineering during the fall of 2007. This is a major evolutionary step, signaling the movement of AO technologies into visible light with a MEMS mirror. With on-sky Strehls in I-band of greater than 20% during second light tests, the science possibilities have become evident. Described here is the advanced engineering used in the design and construction of the ViLLaGEs system, comparing it to the LickAO infrared system, and a discussion of Nickel dome infrastructural improvements necessary for this system. A significant portion of the engineering discussion revolves around the sizable effort that went towards eliminating flexure. Then, we detail upgrades to ViLLaGEs to make it a facility class instrument. These upgrades will focus on Nyquist sampling the diffraction limited point spread function during open loop operations, motorization and automation for technician level alignments, adding dithering capabilities and changes for near infrared science.
MEMS ultrasonic transducer for monitoring of steel structures
NASA Astrophysics Data System (ADS)
Jain, Akash; Greve, David W.; Oppenheim, Irving J.
2002-06-01
Ultrasonic methods can be used to monitor crack propagation, weld failure, or section loss at critical locations in steel structures. However, ultrasonic inspection requires a skilled technician, and most commonly the signal obtained at any inspection is not preserved for later use. A preferred technology would use a MEMS device permanently installed at a critical location, polled remotely, and capable of on-chip signal processing using a signal history. We review questions related to wave geometry, signal levels, flaw localization, and electromechanical design issues for microscale transducers, and then describe the design, characterization, and initial testing of a MEMS transducer to function as a detector array. The device is approximately 1-cm square and was fabricated by the MUMPS process. The chip has 23 sensor elements to function in a phased array geometry, each element containing 180 hexagonal polysilicon diaphragms with a typical leg length of 49 microns and an unloaded natural frequency near 3.5 MHz. We first report characterization studies including capacitance-voltage measurements and admittance measurements, and then report initial experiments using a conventional piezoelectric transducer for excitation, with successful detection of signals in an on-axis transmission experiment and successful source localization from phased array performance in an off-axis transmission experiment.
MEMS Stirling Cooler Development Update
NASA Technical Reports Server (NTRS)
Moran, Matthew E.; Wesolek, Danielle
2003-01-01
This presentation provides an update on the effort to build and test a prototype unit of the patented MEMS Stirling cooler concept. A micro-scale regenerator has been fabricated by Polar Thermal Technologies and is currently being integrated into a Stirling cycle simulator at Johns Hopkins University Applied Physics Laboratory. A discussion of the analysis, design, assembly, and test plans for the prototype will be presented.
Applications of Non-linearities in RF MEMS Switches and Resonators
NASA Astrophysics Data System (ADS)
Vummidi Murali, Krishna Prasad
The 21st century is emerging into an era of wireless ubiquity. To support this trend, the RF (Radio Frequency) front end must be capable of processing a range of wireless signals (cellular phone, data connectivity, broadcast TV, GPS positioning, etc.) spanning a total bandwidth of nearly 6 GHz. This warrants the need for multi-band/multi-mode radio architectures. For such architectures to satisfy the constraints on size, battery life, functionality and cost, the radio front-end must be made reconfigurable. RF-MEMS (RF Micro-Electro-Mechanical Systems) are seen as an enabling technology for such reconfigurable radios. RF-MEMS mainly include micromechanical switches (used in phase shifters, switched capacitor banks, impedance tuners etc.) and micromechanical resonators (used in tunable filters, oscillators, reference clocks etc.). MEMS technology also has the potential to be directly integrated into CMOS (Complementary metal-oxide semiconductor) ICs (Integrated Circuits) leading to further potential reductions of cost and size. However, RF-MEMS face challenges that must be addressed before they can gain widespread commercial acceptance. Relatively low switching speed, power handling, and high-voltage drive are some of the key issues in MEMS switches. Phase noise influenced by non-linearities, need for temperature compensation (especially Si based resonators), large start-up times, and aging are the key issues in Si MEMS Resonators. In this work potential solutions are proposed to address some of these key issues, specifically the reduction of high voltage drives in switches and the reduction of phase noise in MEMS resonators for timing applications. MEMS devices that are electrostatically actuated exhibit significant non-linearities. The origins of the non-linearities are both electrical (electrostatic actuation) and mechanical (dimensions and material properties). The influence of spring non-linearities (cubic and quadratic) on the performance of switches and resonators are studied. Gold electroplated fixed-fixed beams were fabricated to test the phenomenon of dynamic (or resonant) pull-in in shunt switches. The dynamic pull-in phenomenon was also tested on commercially fabricated lateral switches. It is shown that the resonant pull-in technique reduces the overall voltage required to actuate the switch. There is an additional reduction of total actuation voltage possible via applying an AC actuation signal at the correct non-linear resonant frequency. The demonstrated best case savings from operating at the non-linear resonance is 50% (for the lateral switch) and 60% (for the vertical switch) as compared to 25% and 40% respectively using a fixed frequency approach. However, the timing response for resonant pull-in has been experimentally shown to be slower than the static actuation. To reduce the switching time, a shifted-frequency method is proposed where the excitation frequency is shifted up or down by a discrete amount deltaO after a brief hold time. It was theoretically shown that the shifted-frequency method enables a minimum realizable switching time comparable to the static switching time for a given set of actuation frequencies. The influence of VDC on the effective non-linearities of a fixed-fixed beam is also studied. Based on the dimensions of the resonator and the type of resonance there is a certain VDC,Lin where the response is near linear (S ≈ 0). In the near-linear domain, the dynamic pull-in is the only upper bound to the amplitude of vibrations, and hence the amplitude of output current, thereby maximizing the power handling capacity of the resonator. Apart from maximizing the output current, it is essential to reduce the amplitude and phase variations of the displacement response which are due to noise mixing into frequency of interest, and are eventually manifested as output phase noise due to capacitive current nonlinearity. Two major aliasing schemes were analyzed and it was shown that the capacitive force non-linearity is the major source of mixing that causes the up-conversion of 1/f frequency into signal sidebands. The resonator's periodic response (displacement) is defined by a set of two first-order nonlinear ordinary differential equations that describe the modulation of amplitude and phase of the response. Frequency response curves of amplitude and frequency are determined from these modulation equations. The zero slope point on the amplitude resonance curve is the peak of the resonance curve where the phase (gammadc) of the response is +/-pi/2. For a strongly non-linear system, the resonance curves are skewed based on the amount of total non-linearity S. For systems that are strongly non-linear, the best region to operate the resonator is the fixed point that correspond to infinite slope (gammadc = +/-2pi/3) in the frequency response of the system. The best case phase noise response was analytically developed for such a fixed point. Theoretically at this fixed point, phase noise will have contributions only from 1/ fnoise and not from 1/f2 and 1/ f3. The resonators phase can be set by controlling the rest of the phase in the loop such that the total phase around the loop is zero or 2pi. In addition, this work has also developed an analytical model for a lateral MEMS switch fabricated in a commercial foundry that has the potential to be processed as MEMS on CMOS. This model accounts for trapezoidal cross sections of the electrodes and springs and also models electrostatic fringing as a function of the moving gap. The analytical model matches closely with the Finite Element (FEA) model.
NASA Astrophysics Data System (ADS)
Wu, Mingching; Fang, Weileun
2005-03-01
This work integrates multi-depth DRIE etching, trench-refilled molding, two poly-Si layers MUMPs and bulk releasing to improve the variety and performance of MEMS devices. In summary, the present fabrication process, named MOSBE II, has three merits. First, this process can monolithically fabricate and integrate poly-Si thin-film structures with different thicknesses and stiffnesses, such as the flexible spring and the stiff mirror plate. Second, multi-depth structures, such as vertical comb electrodes, are available from the DRIE processes. Third, a cavity under the micromachined device is provided by the bulk silicon etching process, so that a large out-of-plane motion is allowed. In application, an optical scanner driven by the self-aligned vertical comb actuator was demonstrated. The poly-Si micromachined components fabricated by MOSBE II can further integrate with the MUMPs devices to establish a more powerful MOEMS platform.
Deformable Mirrors Correct Optical Distortions
NASA Technical Reports Server (NTRS)
2010-01-01
By combining the high sensitivity of space telescopes with revolutionary imaging technologies consisting primarily of adaptive optics, the Terrestrial Planet Finder is slated to have imaging power 100 times greater than the Hubble Space Telescope. To this end, Boston Micromachines Corporation, of Cambridge, Massachusetts, received Small Business Innovation Research (SBIR) contracts from the Jet Propulsion Laboratory for space-based adaptive optical technology. The work resulted in a microelectromechanical systems (MEMS) deformable mirror (DM) called the Kilo-DM. The company now offers a full line of MEMS DMs, which are being used in observatories across the world, in laser communication, and microscopy.
Towards memory-aware services and browsing through lifelogging sensing.
Arcega, Lorena; Font, Jaime; Cetina, Carlos
2013-11-05
Every day we receive lots of information through our senses that is lost forever, because it lacked the strength or the repetition needed to generate a lasting memory. Combining the emerging Internet of Things and lifelogging sensors, we believe it is possible to build up a Digital Memory (Dig-Mem) in order to complement the fallible memory of people. This work shows how to realize the Dig-Mem in terms of interactions, affinities, activities, goals and protocols. We also complement this Dig-Mem with memory-aware services and a Dig-Mem browser. Furthermore, we propose a RFID Tag-Sharing technique to speed up the adoption of Dig-Mem. Experimentation reveals an improvement of the user understanding of Dig-Mem as time passes, compared to natural memories where the level of detail decreases over time.
Printed Multi-Turn Loop Antenna for RF Bio-Telemetry
NASA Technical Reports Server (NTRS)
Simons, Rainee N.; Hall, David G.; Miranda, Felix A.
2004-01-01
In this paper, a novel printed multi-turn loop antenna for contact-less powering and RF telemetry from implantable bio- MEMS sensors at a design frequency of 300 MHz is demonstrated. In addition, computed values of input reactance, radiation resistance, skin effect resistance, and radiation efficiency for the printed multi-turn loop antenna are presented. The computed input reactance is compared with the measured values and shown to be in fair agreement. The computed radiation efficiency at the design frequency is about 24 percent.
MEMS (Micro-Electro-Mechanical Systems) for Automotive and Consumer Electronics
NASA Astrophysics Data System (ADS)
Marek, Jiri; Gómez, Udo-Martin
MEMS sensors gained over the last two decades an impressive width of applications: (a) ESP: A car is skidding and stabilizes itself without driver intervention (b) Free-fall detection: A laptop falls to the floor and protects the hard drive by parking the read/write drive head automatically before impact. (c) Airbag: An airbag fires before the driver/occupant involved in an impending automotive crash impacts the steering wheel, thereby significantly reducing physical injury risk. MEMS sensors are sensing the environmental conditions and are giving input to electronic control systems. These crucial MEMS sensors are making system reactions to human needs more intelligent, precise, and at much faster reaction rates than humanly possible. Important prerequisites for the success of sensors are their size, functionality, power consumption, and costs. This technical progress in sensor development is realized by micro-machining. The development of these processes was the breakthrough to industrial mass-production for micro-electro-mechanical systems (MEMS). Besides leading-edge micromechanical processes, innovative and robust ASIC designs, thorough simulations of the electrical and mechanical behaviour, a deep understanding of the interactions (mainly over temperature and lifetime) of the package and the mechanical structures are needed. This was achieved over the last 20 years by intense and successful development activities combined with the experience of volume production of billions of sensors. This chapter gives an overview of current MEMS technology, its applications and the market share. The MEMS processes are described, and the challenges of MEMS, compared to standard IC fabrication, are discussed. The evolution of MEMS requirements is presented, and a short survey of MEMS applications is shown. Concepts of newest inertial sensors for ESP-systems are given with an emphasis on the design concepts of the sensing element and the evaluation circuit for achieving excellent noise performance. The chapter concludes with an outlook on arising new MEMS applications such as energy harvester and micro fuel cells.
RF-MEMS tunable interdigitated capacitor and fixed spiral inductor for band pass filter applications
NASA Astrophysics Data System (ADS)
Bade, Ladon Ahmed; Dennis, John Ojur; Khir, M. Haris Md; Wen, Wong Peng
2016-11-01
This research presents the tunable Radio Frequency Micro Electromechanical Systems (RF-MEMS) coupled band-pass filter (BPF), which possess a wide tuning range and constructed by using the Chebyshev fourth degree equivalent circuit consisting of fixed inductors and interdigitated tunable capacitors. The suggested method was authenticated by designing a new tunable BPF with a 100% tuning range from 3.1 GHz to 4.9 GHz. The Metal Multi-User MEMS Process (Metal MUMPs) was involved in the process of design of this band-pass filter. It aimed to achieve the reconfiguration of frequencies and show high efficiency of RF in the applications that using Ultra Wide Band (UWB) such as wireless sensor networks. The RF performance of this filter was found to be very satisfactory due to its simple fabrication. Moreover, it showed less insertion loss of around 4 dB and high return loss of around 20 dB.
Investigation of improved designs for rotational micromirrors using multiuser MEMS processes
NASA Astrophysics Data System (ADS)
Lin, Julianna E.; Michael, Feras S. J.; Kirk, Andrew G.
2001-04-01
In recent years, the design of rotational micromirrors for use in optical cross connects has received much attention. Although several companies have already produced and marketed a number of torsional mirror devices, more work is still needed to determine how these mirrors can be integrated into optical systems to form compact optical switches. However, recently several commercial MEMS foundry services have become available. Thus, due to the low cost of these prototyping services, new devices can be fabricated in short amounts of time and the designs adapted to meet the needs of different applications. The purpose of this work is to investigate the fabrication of new micromirror designs using the Multi-User MEMS Processes (MUMPs) foundry service available from Cronos Integrated Microsystems, located in North Carolina, USA). Several sets of mirror designs were submitted for fabrication and the resulting structures characterized using a phase-shifting Mirau interferometer. The results of these devices are presented.
Mechanical behavior simulation of MEMS-based cantilever beam using COMSOL multiphysics
DOE Office of Scientific and Technical Information (OSTI.GOV)
Acheli, A., E-mail: aacheli@cdta.dz; Serhane, R.
This paper presents the studies of mechanical behavior of MEMS cantilever beam made of poly-silicon material, using the coupling of three application modes (plane strain, electrostatics and the moving mesh) of COMSOL Multi-physics software. The cantilevers playing a key role in Micro Electro-Mechanical Systems (MEMS) devices (switches, resonators, etc) working under potential shock. This is why they require actuation under predetermined conditions, such as electrostatic force or inertial force. In this paper, we present mechanical behavior of a cantilever actuated by an electrostatic force. In addition to the simplification of calculations, the weight of the cantilever was not taken intomore » account. Different parameters like beam displacement, electrostatics force and stress over the beam have been calculated by finite element method after having defining the geometry, the material of the cantilever model (fixed at one of ends but is free to move otherwise) and his operational space.« less
Jackson, Nathan; Muthuswamy, Jit
2009-04-01
We report here a novel approach called MEMS microflex interconnect (MMFI) technology for packaging a new generation of Bio-MEMS devices that involve movable microelectrodes implanted in brain tissue. MMFI addresses the need for (i) operating space for movable parts and (ii) flexible interconnects for mechanical isolation. We fabricated a thin polyimide substrate with embedded bond-pads, vias, and conducting traces for the interconnect with a backside dry etch, so that the flexible substrate can act as a thin-film cap for the MEMS package. A double gold stud bump rivet bonding mechanism was used to form electrical connections to the chip and also to provide a spacing of approximately 15-20 µm for the movable parts. The MMFI approach achieved a chip scale package (CSP) that is lightweight, biocompatible, having flexible interconnects, without an underfill. Reliability tests demonstrated minimal increases of 0.35 mΩ, 0.23 mΩ and 0.15 mΩ in mean contact resistances under high humidity, thermal cycling, and thermal shock conditions respectively. High temperature tests resulted in an increase in resistance of > 90 mΩ when aluminum bond pads were used, but an increase of ~ 4.2 mΩ with gold bond pads. The mean-time-to-failure (MTTF) was estimated to be at least one year under physiological conditions. We conclude that MMFI technology is a feasible and reliable approach for packaging and interconnecting Bio-MEMS devices.
NASA Astrophysics Data System (ADS)
Azmi, Noraini; Sudin, Sukhairi; Munirah Kamarudin, Latifah; Zakaria, Ammar; Visvanathan, Retnam; Chew Cheik, Goh; Mamduh Syed Zakaria, Syed Muhammad; Abdullah Alfarhan, Khudhur; Badlishah Ahmad, R.
2018-03-01
The advancement of Micro-Electro-Mechanical-Systems (MEMS), microcontroller technologies and the idea of Internet of Things (IoT) motivates the development of wireless modules (e.g. WiFi, Bluetooth, Zigbee, and LoRa) that are small and affordable. This paper aims to provide detailed information on the development of the LoRaFi board. The LoRaFi 1.0 is a multi-protocol communication board developed by Centre of Excellence for Advanced Sensor Technology (CEASTech). The board was developed for but not limited to monitor the indoor air quality. The board comprises two different wireless communication modules namely, Long-range technology (LoRa) and WiFi (using ESP8266). The board can be configured to communicate either using LoRa or WiFi or both. The board has been tested and the wireless communication operates successfully. Apart from LoRa, WiFi enables data to be forwarded to the cloud/server where the data can be stored for further data analysis. This helps provide users with real-time information on their smartphones or other applications. In the future, researchers will conduct tests to investigate the communication link quality. Newer version with reduced board size and additional wireless communication module will be developed in the future as to increase board flexibility and widen the range of applications that can use the board.
A novel multi-actuation CMOS RF MEMS switch
NASA Astrophysics Data System (ADS)
Lee, Chiung-I.; Ko, Chih-Hsiang; Huang, Tsun-Che
2008-12-01
This paper demonstrates a capacitive shunt type RF MEMS switch, which is actuated by electro-thermal actuator and electrostatic actuator at the same time, and than latching the switching status by electrostatic force only. Since thermal actuators need relative low voltage compare to electrostatic actuators, and electrostatic force needs almost no power to maintain the switching status, the benefits of the mechanism are very low actuation voltage and low power consumption. Moreover, the RF MEMS switch has considered issues for integrated circuit compatible in design phase. So the switch is fabricated by a standard 0.35um 2P4M CMOS process and uses wet etching and dry etching technologies for postprocess. This compatible ability is important because the RF characteristics are not only related to the device itself. If a packaged RF switch and a packaged IC wired together, the parasitic capacitance will cause the problem for optimization. The structure of the switch consists of a set of CPW transmission lines and a suspended membrane. The CPW lines and the membrane are in metal layers of CMOS process. Besides, the electro-thermal actuators are designed by polysilicon layer of the CMOS process. So the RF switch is only CMOS process layers needed for both electro-thermal and electrostatic actuations in switch. The thermal actuator is composed of a three-dimensional membrane and two heaters. The membrane is a stacked step structure including two metal layers in CMOS process, and heat is generated by poly silicon resistors near the anchors of membrane. Measured results show that the actuation voltage of the switch is under 7V for electro-thermal added electrostatic actuation.
MEMS-based, RF-driven, compact accelerators
NASA Astrophysics Data System (ADS)
Persaud, A.; Seidl, P. A.; Ji, Q.; Breinyn, I.; Waldron, W. L.; Schenkel, T.; Vinayakumar, K. B.; Ni, D.; Lal, A.
2017-10-01
Shrinking existing accelerators in size can reduce their cost by orders of magnitude. Furthermore, by using radio frequency (RF) technology and accelerating ions in several stages, the applied voltages can be kept low paving the way to new ion beam applications. We make use of the concept of a Multiple Electrostatic Quadrupole Array Linear Accelerator (MEQALAC) and have previously shown the implementation of its basic components using printed circuit boards, thereby reducing the size of earlier MEQALACs by an order of magnitude. We now demonstrate the combined integration of these components to form a basic accelerator structure, including an initial beam-matching section. In this presentation, we will discuss the results from the integrated multi-beam ion accelerator and also ion acceleration using RF voltages generated on-board. Furthermore, we will show results from Micro-Electro-Mechanical Systems (MEMS) fabricated focusing wafers, which can shrink the dimension of the system to the sub-mm regime and lead to cheaper fabrication. Based on these proof-of-concept results we outline a scaling path to high beam power for applications in plasma heating in magnetized target fusion and in neutral beam injectors for future Tokamaks. This work was supported by the Office of Science of the US Department of Energy through the ARPA-e ALPHA program under contracts DE-AC02-05CH11231.
Improved Design of Optical MEMS Using the SUMMiT Fabrication Process
DOE Office of Scientific and Technical Information (OSTI.GOV)
Michalicek, M.A.; Comtois, J.H.; Barron, C.C.
This paper describes the design and fabrication of optical Microelectromechanical Systems (MEMS) devices using the Sandia Ultra planar Multilevel MEMS Technology (SUMMiT) fabrication process. This state of the art process, offered by Sandia National Laboratories, provides unique and very advantageous features which make it ideal for optical devices. This enabling process permits the development of micromirror devices with near ideal characteristics which have previously been unrealizable in standard polysilicon processes. This paper describes such characteristics as elevated address electrodes, individual address wiring beneath the device, planarized mirror surfaces, unique post-process metallization, and the best active surface area to date.
Fabrication and electrical characterization of partially metallized vias fabricated by inkjet
NASA Astrophysics Data System (ADS)
Khorramdel, B.; Mäntysalo, M.
2016-04-01
Through silicon vias (TSVs), acting as vertical interconnections, play an important role in micro-electro-mechanical systems (MEMS) 3D wafer level packaging. Today, taking advantage of nanoparticle inks, inkjet technologies as local filling methods could be used to plate the inside the vias with a conductive material, rather than using a current method, such as chemical vapor deposition or electrolytic growth. This could decrease the processing time, cost and waste material produced. In this work, we have fabricated and demonstrated electrical characterization of TSVs with a top diameter of 85 μm, and partially metallized on their inside walls using silver nanoparticle ink and drop-on-demand inkjet printing. Electrical measurement showed that the resistance of a single via with a void free coverage from top to bottom could be less than 4 Ω, which is still acceptable for MEMS applications.
A low-noise MEMS accelerometer for unattended ground sensor applications
NASA Astrophysics Data System (ADS)
Speller, Kevin E.; Yu, Duli
2004-09-01
A low-noise micro-machined servo accelerometer has been developed for use in Unattended Ground Sensors (UGS). Compared to conventional coil-and-magnet based velocity transducers, this Micro-Electro-Mechanical System (MEMS) accelerometer offers several key benefits for battlefield monitoring. Many UGS require a compass to determine deployment orientation with respect to magnetic North. This orientation information is critical for determining the bearing of incoming signals. Conventional sensors with sensing technology based on a permanent magnet can cause interference with a compass when used in close proximity. This problem is solved with a MEMS accelerometer which does not require any magnetic materials. Frequency information below 10 Hz is valuable for identification of signal sources. Conventional seismometers used in UGS are typically limited in frequency response from 20 to 200 Hz. The MEMS accelerometer has a flat frequency response from DC to 5 kHz. The wider spectrum of signals received improves detection, classification and monitoring on the battlefield. The DC-coupled output of the MEMS accelerometer also has the added benefit of providing tilt orientation data for the deployed UGS. Other performance parameters of the MEMS accelerometer that are important to UGS such as size, weight, shock survivability, phase response, distortion, and cross-axis rejection will be discussed. Additionally, field test data from human footsteps recorded with the MEMS accelerometer will be presented.
NASA Astrophysics Data System (ADS)
Arnhardt, C.; Fernández-Steeger, T. M.; Azzam, R.
2009-04-01
In most mountainous regions, landslides represent a major threat to human life, properties and infrastructures. Nowadays existing landslide monitoring systems are often characterized by high efforts in terms of purchase, installation, maintenance, manpower and material. In addition (or because of this) only small areas or selective points of the endangered zone can be observed by the system. Therefore the improvement of existing and the development of new monitoring and warning systems are of high relevance. The joint project "Sensor based Landslide Early Warning Systems" (SLEWS) deals with the development of a prototypic Alarm- and Early Warning system (EWS) for different types of landslides using low-cost micro-sensors (MEMS) integrated in a wireless sensor network (WSN). Modern so called Ad-Hoc, Multi-Hop wireless sensor networks (WSN) are characterized by a self organizing and self-healing capacity of the system (autonomous systems). The network consists of numerous individual and own energy-supply operating sensor nodes, that can send data packages from their measuring devices (here: MEMS) over other nodes (Multi-Hop) to a collection point (gateway). The gateway provides the interface to central processing and data retrieval units (PC, Laptop or server) outside the network. In order to detect and monitor the different landslide processes (like fall, topple, spreading or sliding) 3D MEMS capacitive sensors made from single silicon crystals and glass were chosen to measure acceleration, tilting and altitude changes. Based on the so called MEMS (Micro-Electro-Mechanical Systems) technology, the sensors combine very small mechanical and electronic units, sensing elements and transducers on a small microchip. The mass production of such type of sensors allows low cost applications in different areas (like automobile industries, medicine, and automation technology). Apart from the small and so space saving size and the low costs another advantage is the energy efficiency that permits measurements over a long period of time. A special sensor-board that accommodates the measuring sensors and the node of the WSN was developed. The standardized interfaces of the measuring sensors permit an easy interaction with the node and thus enable an uncomplicated data transfer to the gateway. The 3-axis acceleration sensor (measuring range: +/- 2g), the 2-axis inclination sensor (measuring range: +/- 30°) for measuring tilt and the barometric pressure sensor (measuring rang: 30kPa - 120 kPa) for measuring sub-meter height changes (altimeter) are currently integrated into the sensor network and are tested in realistic experiments. In addition sensor nodes with precise potentiometric displacement and linear magnetorestrictive position transducer are used for extension and convergence measurements. According to the accuracy of the first developed test stations, the results of the experiments showed that the selected sensors meet the requirement profile, as the stability is satisfying and the spreading of the data is quite low. Therefore the jet developed sensor boards can be tested in a larger environment of a sensor network. In order to get more information about accuracy in detail, experiments in a new more precise test bed and tests with different sampling rates will follow. Another increasingly important aspect for the future is the fusion of sensor data (i.e. combination and comparison) to identify malfunctions and to reduce false alarm rates, while increasing data quality at the same time. The correlation of different (complementary sensor fusion) but also identical sensor-types (redundant sensor fusion) permits a validation of measuring data. The development of special algorithms allows in a further step to analyze and evaluate the data from all nodes of the network together (sensor node fusion). The sensor fusion contributes to the decision making of alarm and early warning systems and allows a better interpretation of data. The network data are processed outside the network in a service orientated special data infrastructure (SDI) by standardized OGC (open Geospatial Consortium) conformal services and visualized according to the requirements of the end-user. The modular setup of the hardware, combined with standardized interfaces and open services for data processing allows an easy adaption or integration in existing solutions and other networks. The Monitoring system described here is characterized by very flexible structure, cost efficiency and high fail-safe level. The application of WSN in combination with MEMS provides an inexpensive, easy to set up and intelligent monitoring system for spatial data gathering in large areas.
Modeling methodology for a CMOS-MEMS electrostatic comb
NASA Astrophysics Data System (ADS)
Iyer, Sitaraman V.; Lakdawala, Hasnain; Mukherjee, Tamal; Fedder, Gary K.
2002-04-01
A methodology for combined modeling of capacitance and force 9in a multi-layer electrostatic comb is demonstrated in this paper. Conformal mapping-based analytical methods are limited to 2D symmetric cross-sections and cannot account for charge concentration effects at corners. Vertex capacitance can be more than 30% of the total capacitance in a single-layer 2 micrometers thick comb with 10 micrometers overlap. Furthermore, analytical equations are strictly valid only for perfectly symmetrical finger positions. Fringing and corner effects are likely to be more significant in a multi- layered CMOS-MEMS comb because of the presence of more edges and vertices. Vertical curling of CMOS-MEMS comb fingers may also lead to reduced capacitance and vertical forces. Gyroscopes are particularly sensitive to such undesirable forces, which therefore, need to be well-quantified. In order to address the above issues, a hybrid approach of superposing linear regression models over a set of core analytical models is implemented. Design of experiments is used to obtain data for capacitance and force using a commercial 3D boundary-element solver. Since accurate force values require significantly higher mesh refinement than accurate capacitance, we use numerical derivatives of capacitance values to compute the forces. The model is formulated such that the capacitance and force models use the same regression coefficients. The comb model thus obtained, fits the numerical capacitance data to within +/- 3% and force to within +/- 10%. The model is experimentally verified by measuring capacitance change in a specially designed test structure. The capacitance model matches measurements to within 10%. The comb model is implemented in an Analog Hardware Description Language (ADHL) for use in behavioral simulation of manufacturing variations in a CMOS-MEMS gyroscope.
Urbanchek, Melanie G; Wei, Benjamin; Egeland, Brent M; Abidian, Mohammad R; Kipke, Daryl R; Cederna, Paul S
2011-01-01
Background Our goal is to develop a peripheral nerve electrode with long-term stability and fidelity for use in nerve-machine interfaces. Microelectromechanical systems (MEMS) use silicon probes that contain multi-channel actuators, sensors, and electronics. We tested the null hypothesis that implantation of MEMS probes do not have a detrimental effect on peripheral nerve function or regeneration. Methods A rat hindlimb, peroneal nerve model was utilized in all experimental groups: a) intact nerve (Control, n= 10); b) nerve division and repair (Repair, n= 9); and c) Nerve division, insertion of MEMS probe, and repair (Repair + Probe, n=9). Nerve morphology, nerve to muscle compound action potential (CMAP) studies, walking tracks, and extensor digitorum longus (EDL) muscle function tests were evaluated following an 80 day recovery. Results Repair and Repair + Probe showed no differences in axon count, axon size, percent non-neural area, CMAP amplitude, latency, muscle mass, muscle force, or walking track scores. Though there was some local fibrosis around each MEMS probe, this did not lead to measurable detrimental effects in any anatomic or functional outcome measurements. Conclusions The lack of a significant difference between Repair and Repair + Probe groups in histology, CMAP, walking tracks, and muscle force suggests that MEMS electrodes are compatible with regenerating axons and show promise for establishing chemical and electrical interfaces with peripheral nerves. PMID:21921739
MEMS Integrated Submount Alignment for Optoelectronics
NASA Astrophysics Data System (ADS)
Shakespeare, W. Jeffrey; Pearson, Raymond A.; Grenestedt, Joachim L.; Hutapea, Parsaoran; Gupta, Vikas
2005-02-01
One of the most expensive and time-consuming production processes for single-mode fiber-optic components is the alignment of the photonic chip or waveguide to the fiber. The alignment equipment is capital intensive and usually requires trained technicians to achieve desired results. Current technology requires active alignment since tolerances are only ~0.2 μ m or less for a typical laser diode. This is accomplished using piezoelectric actuated stages and active optical feedback. Joining technologies such as soldering, epoxy bonding, or laser welding may contribute significant postbond shift, and final coupling efficiencies are often less than 80%. This paper presents a method of adaptive optical alignment to freeze in place directly on an optical submount using a microelectromechanical system (MEMS) shape memory alloy (SMA) actuation technology. Postbond shift is eliminated since the phase change is the alignment actuation. This technology is not limited to optical alignment but can be applied to a variety of MEMS actuations, including nano-actuation and nano-alignment for biomedical applications. Experimental proof-of-concept results are discussed, and a simple analytical model is proposed to predict the stress strain behavior of the optical submount. Optical coupling efficiencies and alignment times are compared with traditional processes. The feasibility of this technique in high-volume production is discussed.
A brief test of the Hewlett-Packard MEMS seismic accelerometer
Homeijer, Brian D.; Milligan, Donald J.; Hutt, Charles R.
2014-01-01
Testing was performed on a prototype of Hewlett-Packard (HP) Micro-Electro-Mechanical Systems (MEMS) seismic accelerometer at the U.S. Geological Survey’s Albuquerque Seismological Laboratory. This prototype was built using discrete electronic components. The self-noise level was measured during low seismic background conditions and found to be 9.8 ng/√Hz at periods below 0.2 s (frequencies above 5 Hz). The six-second microseism noise was also discernible. The HP MEMS accelerometer was compared to a Geotech Model GS-13 reference seismometer during seismic noise and signal levels well above the self-noise of the accelerometer. Matching power spectral densities (corrected for accelerometer and seismometer responses to represent true ground motion) indicated that the HP MEMS accelerometer has a flat (constant) response to acceleration from 0.0125 Hz to at least 62.5 Hz. Tilt calibrations of the HP MEMS accelerometer verified that the flat response to acceleration extends to 0 Hz. Future development of the HP MEMS accelerometer includes replacing the discreet electronic boards with a low power application-specific integrated circuit (ASIC) and increasing the dynamic range of the sensor to detect strong motion signals above one gravitational acceleration, while maintaining the self-noise observed during these tests.
Towards Memory-Aware Services and Browsing through Lifelogging Sensing
Arcega, Lorena; Font, Jaime; Cetina, Carlos
2013-01-01
Every day we receive lots of information through our senses that is lost forever, because it lacked the strength or the repetition needed to generate a lasting memory. Combining the emerging Internet of Things and lifelogging sensors, we believe it is possible to build up a Digital Memory (Dig-Mem) in order to complement the fallible memory of people. This work shows how to realize the Dig-Mem in terms of interactions, affinities, activities, goals and protocols. We also complement this Dig-Mem with memory-aware services and a Dig-Mem browser. Furthermore, we propose a RFID Tag-Sharing technique to speed up the adoption of Dig-Mem. Experimentation reveals an improvement of the user understanding of Dig-Mem as time passes, compared to natural memories where the level of detail decreases over time. PMID:24196436
Signal bi-amplification in networks of unidirectionally coupled MEMS
NASA Astrophysics Data System (ADS)
Tchakui, Murielle Vanessa; Woafo, Paul; Colet, Pere
2016-01-01
The purpose of this paper is to analyze the propagation and the amplification of an input signal in networks of unidirectionally coupled micro-electro-mechanical systems (MEMS). Two types of external excitations are considered: sinusoidal and stochastic signals. We show that sinusoidal signals are amplified up to a saturation level which depends on the transmission rate and despite MEMS being nonlinear the sinusoidal shape is well preserved if the number of MEMS is not too large. However, increasing the number of MEMS, there is an instability that leads to chaotic behavior and which is triggered by the amplification of the harmonics generated by the nonlinearities. We also show that for stochastic input signals, the MEMS array acts as a band-pass filter and after just a few elements the signal has a narrow power spectra.
Shi, Yunbo; Luo, Yi; Zhao, Wenjie; Shang, Chunxue; Wang, Yadong; Chen, Yinsheng
2013-01-01
This paper describes the design and implementation of a radiosonde which can measure the meteorological temperature, humidity, pressure, and other atmospheric data. The system is composed of a CPU, microwave module, temperature sensor, pressure sensor and humidity sensor array. In order to effectively solve the humidity sensor condensation problem due to the low temperatures in the high altitude environment, a capacitive humidity sensor including four humidity sensors to collect meteorological humidity and a platinum resistance heater was developed using micro-electro-mechanical-system (MEMS) technology. A platinum resistance wire with 99.999% purity and 0.023 mm in diameter was used to obtain the meteorological temperature. A multi-sensor data fusion technique was applied to process the atmospheric data. Static and dynamic experimental results show that the designed humidity sensor with platinum resistance heater can effectively tackle the sensor condensation problem, shorten response times and enhance sensitivity. The humidity sensor array can improve measurement accuracy and obtain a reliable initial meteorological humidity data, while the multi-sensor data fusion technique eliminates the uncertainty in the measurement. The radiosonde can accurately reflect the meteorological changes. PMID:23857263
Shi, Yunbo; Luo, Yi; Zhao, Wenjie; Shang, Chunxue; Wang, Yadong; Chen, Yinsheng
2013-07-12
This paper describes the design and implementation of a radiosonde which can measure the meteorological temperature, humidity, pressure, and other atmospheric data. The system is composed of a CPU, microwave module, temperature sensor, pressure sensor and humidity sensor array. In order to effectively solve the humidity sensor condensation problem due to the low temperatures in the high altitude environment, a capacitive humidity sensor including four humidity sensors to collect meteorological humidity and a platinum resistance heater was developed using micro-electro-mechanical-system (MEMS) technology. A platinum resistance wire with 99.999% purity and 0.023 mm in diameter was used to obtain the meteorological temperature. A multi-sensor data fusion technique was applied to process the atmospheric data. Static and dynamic experimental results show that the designed humidity sensor with platinum resistance heater can effectively tackle the sensor condensation problem, shorten response times and enhance sensitivity. The humidity sensor array can improve measurement accuracy and obtain a reliable initial meteorological humidity data, while the multi-sensor data fusion technique eliminates the uncertainty in the measurement. The radiosonde can accurately reflect the meteorological changes.
Possibilities of electrical impedance tomography in gynecology
NASA Astrophysics Data System (ADS)
V, Trokhanova O.; A, Chijova Y.; B, Okhapkin M.; V, Korjenevsky A.; S, Tuykin T.
2013-04-01
The paper describes results of comprehensive EIT diagnostics of mammary glands and cervix. The data were obtained from examinations of 170 patients by EIT system MEM (multi-frequency electrical impedance mammograph) and EIT system GIT (gynecological impedance tomograph). Mutual dependence is discussed.
NASA Technical Reports Server (NTRS)
Patterson, Richard; Hammoud, Ahmad
2009-01-01
Semiconductor chips based on MEMS (Micro-Electro-Mechanical Systems) technology, such as sensors, transducers, and actuators, are becoming widely used in today s electronics due to their high performance, low power consumption, tolerance to shock and vibration, and immunity to electro-static discharge. In addition, the MEMS fabrication process allows for the miniaturization of individual chips as well as the integration of various electronic circuits into one module, such as system-on-a-chip. These measures would simplify overall system design, reduce parts count and interface, improve reliability, and reduce cost; and they would meet requirements of systems destined for use in space exploration missions. In this work, the performance of a recently-developed MEMS voltage-controlled oscillator was evaluated under a wide temperature range. Operation of this new commercial-off-the-shelf (COTS) device was also assessed under thermal cycling to address some operational conditions of the space environment
New Research on MEMS Acoustic Vector Sensors Used in Pipeline Ground Markers
Song, Xiaopeng; Jian, Zeming; Zhang, Guojun; Liu, Mengran; Guo, Nan; Zhang, Wendong
2015-01-01
According to the demands of current pipeline detection systems, the above-ground marker (AGM) system based on sound detection principle has been a major development trend in pipeline technology. A novel MEMS acoustic vector sensor for AGM systems which has advantages of high sensitivity, high signal-to-noise ratio (SNR), and good low frequency performance has been put forward. Firstly, it is presented that the frequency of the detected sound signal is concentrated in a lower frequency range, and the sound attenuation is relatively low in soil. Secondly, the MEMS acoustic vector sensor structure and basic principles are introduced. Finally, experimental tests are conducted and the results show that in the range of 0°∼90°, when r = 5 m, the proposed MEMS acoustic vector sensor can effectively detect sound signals in soil. The measurement errors of all angles are less than 5°. PMID:25609046
Millimeter scale robots for the nanofactory
NASA Astrophysics Data System (ADS)
Murthy, Rakesh
The top down approach is a commonly employed miniaturization pathway into micro and nanomanufacturing. Its popularity is due to the fact that it adapts traditionally engineered macro scale positioning, manipulation and processing technology with micro and nano scale precision and part sizes. However, state of the art top down systems such as the Atomic Force Microscope (AFM) span four to five orders of magnitude larger than the parts being handled. This dissertation addresses the need for creating millimeter size robotic positioning technology that closes the size gap between equipment and part sizes. Such microrobot manufacturing methodology comprising of micro component-level design, fabrication and high yield assembly, system-level packaging, modeling, precision evaluation and control is presented and exemplified using two classes of microrobots. Both microrobots incorporate Micro Electro Mechanical Systems (MEMS) to combine high precision and low foot-print. The first microrobot type, the "ARRIpede" is a multi legged autonomous crawler, and is designed to operate as a mobile unit enabling parts transfer in a nanoassembly environment. An embodiment of this microrobot is demonstrated for planar motions with three degrees of freedom (XYtheta). The microrobot consists of a MEMS die "belly" spanning 10mm x 10mm x 1mm with in-plane electrothermal actuators and vertically assembled legs, and an electronic "backpack" spanning 15mmx15mmx10mm to generate a leg gait sequence. By incorporating bulk micromachined parts and precise epoxy dispensing at the assembled leg joint, the microrobot has a high payload bearing capacity (at least 9g). Simulations with a nonholonomic robot predict microcrawler velocities of a few mm/s under realistic assumptions. The open loop crawling velocity is experimentally characterized for various actuator frequencies and a close match with simulations is observed. A Linear Quadratic Regulator (LQR) based controller consisting of a high magnification camera and a laser displacement sensor for feedback is implemented. The open/closed loop positioning repeatabilities are evaluated and compared. The second micro robot called the "AFAM" (Articulated Four Axes Micro Robot) is a fixed base articulated design targeting micro and nano scale manipulation and probing applications. An embodiment of this microrobot is constructed incorporating four degrees of freedom (X, Y, Pitch and Yaw), occupying a total volume of 3mm x 2mm x 1mm, and operating within a workspace envelope of 50mum x 50mum x 75mum. This is by far the largest operating envelope of any other independent MEMS positioner with non-planar dexterity. A cable based transmission and motion amplification mechanism is designed to achieve the pitch and yaw degrees of freedom. The de-coupled motion of the microrobot is achieved by kinematic identification of the Jacobian and using a 3D flexure based kinematic model of the microrobot. By using the derived kinematics, the microrobot is driven to create nanoindents on a polymer surface. The end-effector positioning accuracy, repeatability and resolution are characterized using the nanoindents.
Study of the Use of Time-Mean Vortices to Generate Lift for MAV Applications
2011-05-31
microplate to in-plane resonance. Computational effort centers around optimization of a range of parameters (geometry, frequency, amplitude of oscillation, etc...issue involved. Towards this end, a suspended microplate was fabricated via MEMS technology and driven to in-plane resonance via Lorentz force...force to drive the suspended MEMS-based microplate to in-plane resonance. Computational effort centers around optimization of a range of parameters
NASA Technical Reports Server (NTRS)
1995-01-01
The recent evolution of microelectronic technologies coupled with the growth of micro-electro-mechanical systems (MEMS) has had significant impact in the commercial sector. The focus of this conference was to anticipate and extend the incorporation of nano-electronics and MEMS into application specific integrated microinstruments (ASIM's) in space systems. Presentations ranged from mission application of nano-satellites to silicon micromachining for photonic applications.
Three-Dimensionally Printed Micro-electromechanical Switches.
Lee, Yongwoo; Han, Jungmin; Choi, Bongsik; Yoon, Jinsu; Park, Jinhee; Kim, Yeamin; Lee, Jieun; Kim, Dae Hwan; Kim, Dong Myong; Lim, Meehyun; Kang, Min-Ho; Kim, Sungho; Choi, Sung-Jin
2018-05-09
Three-dimensional (3D) printers have attracted considerable attention from both industry and academia and especially in recent years because of their ability to overcome the limitations of two-dimensional (2D) processes and to enable large-scale facile integration techniques. With 3D printing technologies, complex structures can be created using only a computer-aided design file as a reference; consequently, complex shapes can be manufactured in a single step with little dependence on manufacturer technologies. In this work, we provide a first demonstration of the facile and time-saving 3D printing of two-terminal micro-electromechanical (MEM) switches. Two widely used thermoplastic materials were used to form 3D-printed MEM switches; freely suspended and fixed electrodes were printed from conductive polylactic acid, and a water-soluble sacrificial layer for air-gap formation was printed from poly(vinyl alcohol). Our 3D-printed MEM switches exhibit excellent electromechanical properties, with abrupt switching characteristics and an excellent on/off current ratio value exceeding 10 6 . Therefore, we believe that our study makes an innovative contribution with implications for the development of a broader range of 3D printer applications (e.g., the manufacturing of various MEM devices and sensors), and the work highlights a uniquely attractive path toward the realization of 3D-printed electronics.
Light addressable potentiometric sensor with an array of sensing regions
NASA Astrophysics Data System (ADS)
Liang, Weiguo; Han, JingHong; Zhang, Hong; Chen, Deyong
2001-09-01
This paper describes the mechanism of light addressable poteniometric sensors (LAPS) from the viewpoints of Semiconductor Physics, and introduces the fabrication of a multi-parameter LAPS chip. The MEMS technology is applied to produce a matrix of sensing regions on the wafer. By doing that, the cross talk among these regions is reduced, and the precision of the LAPS is increased. An IR-LED matrix is used as the light source, and the flow-injection method is used to input samples. The sensor system is compact and highly integrated. The measure and control system is composed of a personal computer, a lock-in amplifier, a potentiostat, a singlechip system, and an addressing circuit. Some experiments have been done with this device. The results show that this device is very promising for practical use.
A low-cost CMOS-MEMS piezoresistive accelerometer with large proof mass.
Khir, Mohd Haris Md; Qu, Peng; Qu, Hongwei
2011-01-01
This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive sensing material. A full Wheatstone bridge was constructed through easy wiring allowed by the three metal layers in the 0.5 μm CMOS technology. The device fabrication process consisted of a standard CMOS process for sensor configuration, and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. A bulk single-crystal silicon (SCS) substrate is included in the proof mass to increase sensor sensitivity. In device design and analysis, the self heating of the polysilicon piezoresistors and its effect to the sensor performance is also discussed. With a low operating power of 1.5 mW, the accelerometer demonstrates a sensitivity of 0.077 mV/g prior to any amplification. Dynamic tests have been conducted with a high-end commercial calibrating accelerometer as reference.
NASA Astrophysics Data System (ADS)
Di, Si; Lin, Hui; Du, Ruxu
2011-05-01
Displacement measurement of moving objects is one of the most important issues in the field of computer vision. This paper introduces a new binocular vision system (BVS) based on micro-electro-mechanical system (MEMS) technology. The eyes of the system are two microlenses fabricated on a substrate by MEMS technology. The imaging results of two microlenses are collected by one complementary metal-oxide-semiconductor (CMOS) array. An algorithm is developed for computing the displacement. Experimental results show that as long as the object is moving in two-dimensional (2D) space, the system can effectively estimate the 2D displacement without camera calibration. It is also shown that the average error of the displacement measurement is about 3.5% at different object distances ranging from 10 cm to 35 cm. Because of its low cost, small size and simple setting, this new method is particularly suitable for 2D displacement measurement applications such as vision-based electronics assembly and biomedical cell culture.
MEMS-based liquid lens for capsule endoscope
NASA Astrophysics Data System (ADS)
Seo, S. W.; Han, S.; Seo, J. H.; Kim, Y. M.; Kang, M. S.; Min, N. G.; Choi, W. B.; Sung, M. Y.
2008-03-01
The capsule endoscope, a new application area of digital imaging, is growing rapidly but needs the versatile imaging capabilities such as auto-focusing and zoom-in to be an active diagnostic tool. The liquid lens based on MEMS technology can be a strong candidate because it is able to be small enough. In this paper, a cylinder-type liquid lens was designed based on Young-Lippmann model and then fabricated with MEMS technology combining the silicon thin-film process and the wafer bonding process. The focal length of the lens module including the fabricated liquid lens was changed reproducibly as a function of the applied voltage. With the change of 30V in the applied bias, the focal length of the constructed lens module could be tuned in the range of about 42cm. The fabricated liquid lens was also proven to be small enough to be adopted in the capsule endoscope, which means the liquid lens can be utilized for the imaging capability improvement of the capsule endoscope.
NASA Astrophysics Data System (ADS)
Kim, Ilkyu
Recent developments in mobile communications have led to an increased appearance of short-range communications and high data-rate signal transmission. New technologies provides the need for an accurate near-field coupling analysis and novel antenna designs. An ability to effectively estimate the coupling within the near-field region is required to realize short-range communications. Currently, two common techniques that are applicable to the near-field coupling problem are 1) integral form of coupling formula and 2) generalized Friis formula. These formulas are investigated with an emphasis on straightforward calculation and accuracy for various distances between the two antennas. The coupling formulas are computed for a variety of antennas, and several antenna configurations are evaluated through full-wave simulation and indoor measurement in order to validate these techniques. In addition, this research aims to design multi-functional and high performance antennas based on MEMS (Microelectromechanical Systems) switches, EBG (Electromagnetic Bandgap) structures, and septum polarizers. A MEMS switch is incorporated into a slot loaded patch antenna to attain frequency reconfigurability. The resonant frequency of the patch antenna can be shifted using the MEM switch, which is actuated by the integrated bias networks. Furthermore, a high gain base-station antenna utilizing beam-tilting is designed to maximize gain for tilted beam applications. To realize this base-station antenna, an array of four dipole-EBG elements is constructed to implement a fixed down-tilt main beam with application in base station arrays. An improvement of the operating range with the EBG-dipole array is evaluated using a simple linkbudget analysis. The septum polarizer has been widely used in circularly polarized antenna systems due to its simple and compact design and high quality of circularity. In this research, the sigmoid function is used to smoothen the edge in the septum design, which makes it suitable for HPM systems. The PSO (Particle Swarm Optimization) technique is applied to the septum design to achieve a high performance antenna design. The electric field intensity above the septum is evaluated through the simulation and its properties are compared to simple half-plane scattering phenomena.
Diffraction-Based Optical Switching with MEMS
Blanche, Pierre-Alexandre; LaComb, Lloyd; Wang, Youmin; ...
2017-04-19
In this article, we are presenting an overview of MEMS-based (Micro-Electro-Mechanical System) optical switch technology starting from the reflective two-dimensional (2D) and three-dimensional (3D) MEMS implementations. To further increase the speed of the MEMS from these devices, the mirror size needs to be reduced. Small mirror size prevents efficient reflection but favors a diffraction-based approach. Two implementations have been demonstrated, one using the Texas Instruments DLP (Digital Light Processing), and the other an LCoS-based (Liquid Crystal on Silicon) SLM (Spatial Light Modulator). These switches demonstrated the benefit of diffraction, by independently achieving high speed, efficiency, and high number of ports.more » We also demonstrated for the first time that PSK (Phase Shift Keying) modulation format can be used with diffraction-based devices. To be truly effective in diffraction mode, the MEMS pixels should modulate the phase of the incident light. We are presenting our past and current efforts to manufacture a new type of MEMS where the pixels are moving in the vertical direction. The original structure is a 32 x 32 phase modulator array with high contrast grating pixels, and we are introducing a new sub-wavelength linear array capable of a 310 kHz modulation rate« less
NASA Astrophysics Data System (ADS)
Makarczuk, Teresa; Matin, Tina R.; Karman, Salmah B.; Diah, S. Zaleha M.; Davaji, Benyamin; Macqueen, Mark O.; Mueller, Jeanette; Schmid, Ulrich; Gebeshuber, Ille C.
2011-06-01
The human senses are of extraordinary value but we cannot change them even if this proves to be a disadvantage in modern times. However, we can assist, enhance and expand these senses via MEMS. Current MEMS cover the range of the human sensory system, and additionally provide data about signals that are too weak for the human sensory system (in terms of signal strength) and signal types that are not covered by the human sensory system. Biomimetics deals with knowledge transfer from biology to technology. In our interdisciplinary approach existing MEMS sensor designs shall be modified and adapted (to keep costs at bay), via biomimetic knowledge transfer of outstanding sensory perception in 'best practice' organisms (e.g. thermoreception, UV sensing, electromagnetic sense). The MEMS shall then be linked to the human body (mainly ex corpore to avoid ethics conflicts), to assist, enhance and expand human sensory perception. This paper gives an overview of senses in humans and animals, respective MEMS sensors that are already on the market and gives a list of possible applications of such devices including sensors that vibrate when a blind person approaches a kerb stone edge and devices that allow divers better orientation under water (echolocation, ultrasound).
Ball driven type MEMS SAD for artillery fuse
NASA Astrophysics Data System (ADS)
Seok, Jin Oh; Jeong, Ji-hun; Eom, Junseong; Lee, Seung S.; Lee, Chun Jae; Ryu, Sung Moon; Oh, Jong Soo
2017-01-01
The SAD (safety and arming device) is an indispensable fuse component that ensures safe and reliable performance during the use of ammunition. Because the application of electronic devices for smart munitions is increasing, miniaturization of the SAD has become one of the key issues for next-generation artillery fuses. Based on MEMS technology, various types of miniaturized SADs have been proposed and fabricated. However, none of them have been reported to have been used in actual munitions due to their lack of high impact endurance and complicated explosive train arrangements. In this research, a new MEMS SAD using a ball driven mechanism, is successfully demonstrated based on a UV LIGA (lithography, electroplating and molding) process. Unlike other MEMS SADs, both high impact endurance and simple structure were achieved by using a ball driven mechanism. The simple structural design also simplified the fabrication process and increased the processing yield. The ball driven type MEMS SAD performed successfully under the desired safe and arming conditions of a spin test and showed fine agreement with the FEM simulation result, conducted prior to its fabrication. A field test was also performed with a grenade launcher to evaluate the SAD performance in the firing environment. All 30 of the grenade samples equipped with the proposed MEMS SAD operated successfully under the high-G setback condition.
Diffraction-Based Optical Switching with MEMS
DOE Office of Scientific and Technical Information (OSTI.GOV)
Blanche, Pierre-Alexandre; LaComb, Lloyd; Wang, Youmin
In this article, we are presenting an overview of MEMS-based (Micro-Electro-Mechanical System) optical switch technology starting from the reflective two-dimensional (2D) and three-dimensional (3D) MEMS implementations. To further increase the speed of the MEMS from these devices, the mirror size needs to be reduced. Small mirror size prevents efficient reflection but favors a diffraction-based approach. Two implementations have been demonstrated, one using the Texas Instruments DLP (Digital Light Processing), and the other an LCoS-based (Liquid Crystal on Silicon) SLM (Spatial Light Modulator). These switches demonstrated the benefit of diffraction, by independently achieving high speed, efficiency, and high number of ports.more » We also demonstrated for the first time that PSK (Phase Shift Keying) modulation format can be used with diffraction-based devices. To be truly effective in diffraction mode, the MEMS pixels should modulate the phase of the incident light. We are presenting our past and current efforts to manufacture a new type of MEMS where the pixels are moving in the vertical direction. The original structure is a 32 x 32 phase modulator array with high contrast grating pixels, and we are introducing a new sub-wavelength linear array capable of a 310 kHz modulation rate« less
NASA Astrophysics Data System (ADS)
Francis, Laurent A.; Gkotsis, Petros; Kilchytska, Valeriya; Tang, Xiaohui; Druart, Sylvain; Raskin, Jean-Pierre; Flandre, Denis
2013-03-01
The impact of different types of radiation on the electromechanical properties of materials used in microfabrication and on the capacitive and piezoresistive transduction mechanisms of MEMS is investigated. MEMS technologies could revolutionize avionics, satellite and space applications provided that the stress conditions which can compromise the reliability of microsystems in these environments are well understood. Initial tests with MEMS revealed a vulnerability of some types of devices to radiation induced dielectric charging, a physical mechanism which also affects microelectronics, however integration of novel functional materials in microfabrication and the current trend to substitute SiO2 with high-k dielectrics in ICs pose new questions regarding reliability in radiation environments. The performance of MEMS devices with moving parts could also degrade due to radiation induced changes in the mechanical properties of the materials. It is thus necessary to investigate the effects of radiation on the properties of thin films used in microfabrication and here we report on tests with γ, high energy protons and fast neutrons radiation. Prototype SOI based MEMS magnetometers which were developed in UCL are also used as test vehicles to investigate radiation effects on the reliability of magnetically actuated and capacitively coupled MEMS.
Internet MEMS design tools based on component technology
NASA Astrophysics Data System (ADS)
Brueck, Rainer; Schumer, Christian
1999-03-01
The micro electromechanical systems (MEMS) industry in Europe is characterized by small and medium sized enterprises specialized on products to solve problems in specific domains like medicine, automotive sensor technology, etc. In this field of business the technology driven design approach known from micro electronics is not appropriate. Instead each design problem aims at its own, specific technology to be used for the solution. The variety of technologies at hand, like Si-surface, Si-bulk, LIGA, laser, precision engineering requires a huge set of different design tools to be available. No single SME can afford to hold licenses for all these tools. This calls for a new and flexible way of designing, implementing and distributing design software. The Internet provides a flexible manner of offering software access along with methodologies of flexible licensing e.g. on a pay-per-use basis. New communication technologies like ADSL, TV cable of satellites as carriers promise to offer a bandwidth sufficient even for interactive tools with graphical interfaces in the near future. INTERLIDO is an experimental tool suite for process specification and layout verification for lithography based MEMS technologies to be accessed via the Internet. The first version provides a Java implementation even including a graphical editor for process specification. Currently, a new version is brought into operation that is based on JavaBeans component technology. JavaBeans offers the possibility to realize independent interactive design assistants, like a design rule checking assistants, a process consistency checking assistants, a technology definition assistants, a graphical editor assistants, etc. that may reside distributed over the Internet, communicating via Internet protocols. Each potential user thus is able to configure his own dedicated version of a design tool set dedicated to the requirements of the current problem to be solved.
CMOS compatible thin-film ALD tungsten nanoelectromechanical devices
NASA Astrophysics Data System (ADS)
Davidson, Bradley Darren
This research focuses on the development of a novel, low-temperature, CMOS compatible, atomic-layer-deposition (ALD) enabled NEMS fabrication process for the development of ALD Tungsten (WALD) NEMS devices. The devices are intended for use in CMOS/NEMS hybrid systems, and NEMS based micro-processors/controllers capable of reliable operation in harsh environments not accessible to standard CMOS technologies. The majority of NEMS switches/devices to date have been based on carbon-nano-tube (CNT) designs. The devices consume little power during actuation, and as expected, have demonstrated actuation voltages much smaller than MEMS switches. Unfortunately, NEMS CNT switches are not typically CMOS integrable due to the high temperatures required for their growth, and their fabrication typically results in extremely low and unpredictable yields. Thin-film NEMS devices offer great advantages over reported CNT devices for several reasons, including: higher fabrication yields, low-temperature (CMOS compatible) deposition techniques like ALD, and increased control over design parameters/device performance metrics, i.e., device geometry. Furthermore, top-down, thin-film, nano-fabrication techniques are better capable of producing complicated device geometries than CNT based processes, enabling the design and development of multi-terminal switches well-suited for low-power hybrid NEMS/CMOS systems as well as electromechanical transistors and logic devices for use in temperature/radiation hard computing architectures. In this work several novel, low-temperature, CMOS compatible fabrication technologies, employing WALD as a structural layer for MEMS or NEMS devices, were developed. The technologies developed are top-down nano-scale fabrication processes based on traditional micro-machining techniques commonly used in the fabrication of MEMS devices. Using these processes a variety of novel WALD NEMS devices have been successfully fabricated and characterized. Using two different WALD fabrication technologies two generations of 2-terminal WALD NEMS switches have been developed. These devices have functional gap heights of 30-50 nm, and actuation voltages typically ranging from 3--5 Volts. Via the extension of a two terminal WALD technology novel 3-terminal WALD NEMS devices were developed. These devices have actuation voltages ranging from 1.5--3 Volts, reliabilities in excess of 2 million cycles, and have been designed to be the fundamental building blocks for WALD NEMS complementary inverters. Through the development of these devices several advancements in the modeling and design of thin-film NEMS devices were achieved. A new model was developed to better characterize pre-actuation currents commonly measured for NEMS switches with nano-scale gate-to-source gap heights. The developed model is an extension of the standard field-emission model and considers the electromechanical response, and electric field effects specific to thin-film NEMS switches. Finally, a multi-physics FEM/FD based model was developed to simulate the dynamic behavior of 2 or 3-terminal electrostatically actuated devices whose electrostatic domains have an aspect ratio on the order of 10-3. The model uses a faux-Lagrangian finite difference method to solve Laplaces equation in a quasi-statatically deforming domain. This model allows for the numerical characterization and design of thin-film NEMS devices not feasible using typical non-specialized BEM/FEM based software. Using this model several novel and feasible designs for fixed-fixed 3-terminal WALD NEMS switches capable for the construction of complementary inverters were discovered.
NASA NDE Applications for Mobile MEMS Devices and Sensors
NASA Technical Reports Server (NTRS)
Wilson, William C.; Atkinson, Gary M.; Barclay, R. O.
2008-01-01
NASA would like new devices and sensors for performing nondestructive evaluation (NDE) of aerospace vehicles. These devices must be small in size/volume, mass, and power consumption. The devices must be autonomous and mobile so they can access the internal structures of aircraft and spacecraft and adequately monitor the structural health of these craft. The platforms must be mobile in order to transport NDE sensors for evaluating structural integrity and determining whether further investigations will be required. Microelectromechanical systems (MEMS) technology is crucial to the development of the mobile platforms and sensor systems. This paper presents NASA s needs for micro mobile platforms and MEMS sensors that will enable NDE to be performed on aerospace vehicles.
An approach to optimal semi-active control of vibration energy harvesting based on MEMS
NASA Astrophysics Data System (ADS)
Rojas, Rafael A.; Carcaterra, Antonio
2018-07-01
In this paper the energy harvesting problem involving typical MEMS technology is reduced to an optimal control problem, where the objective function is the absorption of the maximum amount of energy in a given time interval from a vibrating environment. The interest here is to identify a physical upper bound for this energy storage. The mathematical tool is a new optimal control called Krotov's method, that has not yet been applied to engineering problems, except in quantum dynamics. This approach leads to identify new maximum bounds to the energy harvesting performance. Novel MEMS-based device control configurations for vibration energy harvesting are proposed with particular emphasis to piezoelectric, electromagnetic and capacitive circuits.
Design and characterization of MEMS interferometric sensing
NASA Astrophysics Data System (ADS)
Snyder, R.; Siahmakoun, A.
2010-02-01
A MEMS-based interferometric sensor is produced using the multi-user MEMS processing standard (MUMPS) micromirrors, movable by thermal actuation. The interferometer is comprised of gold reflection surfaces, polysilicon thermal actuators, hinges, latches and thin film polarization beam splitters. A polysilicon film of 3.5 microns reflects and transmits incident polarized light from an external laser source coupled to a multi-mode optical fiber. The input beam is shaped to a diameter of 10 to 20 microns for incidence upon the 100 micron mirrors. Losses in the optical path include diffraction effects from etch holes created in the manufacturing process, surface roughness of both gold and polysilicon layers, and misalignment of micro-scale optical components. Numerous optical paths on the chip vary by length, number of reflections, and mirror subsystems employed. Subsystems include thermal actuator batteries producing lateral position displacement, angularly tunable mirrors, double reflection surfaces, and static vertical mirrors. All mirror systems are raised via manual stimulation using two micron, residue-free probe tips and some may be aligned using electrical signals causing resistive heating in thermal actuators. The characterization of thermal actuator batteries includes maximum displacement, deflection, and frequency response that coincides with theoretical thermodynamic simulations using finite-element analysis. Maximum deflection of 35 microns at 400 mW input electrical power is shown for three types of actuator batteries as is deflection dependent frequency response data for electrical input signals up to 10 kHz.
A Hazardous Gas Detection System for Aerospace and Commercial Applications
NASA Technical Reports Server (NTRS)
Hunter, G. W.; Neudeck, P. G.; Chen, L. - Y.; Makel, D. B.; Liu, C. C.; Wu, Q. H.; Knight, D.
1998-01-01
The detection of explosive conditions in aerospace propulsion applications is important for safety and economic reasons. Microfabricated hydrogen, oxygen, and hydrocarbon sensors as well as the accompanying hardware and software are being developed for a range of aerospace safety applications. The development of these sensors is being done using MEMS (Micro ElectroMechanical Systems) based technology and SiC-based semiconductor technology. The hardware and software allows control and interrogation of each sensor head and reduces accompanying cabling through multiplexing. These systems are being applied on the X-33 and on an upcoming STS-95 Shuttle mission. A number of commercial applications are also being pursued. It is concluded that this MEMS-based technology has significant potential to reduce costs and increase safety in a variety of aerospace applications.
A Hazardous Gas Detection System for Aerospace and Commercial Applications
NASA Technical Reports Server (NTRS)
Hunter, G. W.; Neudeck, P. G.; Chen, L.-Y.; Makel, D. B.; Liu, C. C.; Wu, Q. H.; Knight, D.
1998-01-01
The detection of explosive conditions in aerospace propulsion applications is important for safety and economic reasons. Microfabricated hydrogen, oxygen, and hydrocarbon sensors as well as the accompanying hardware and software are being, developed for a range of aerospace safety applications. The development of these sensors is being done using MEMS (Micro ElectroMechanical Systems) based technology and SiC-based semiconductor technology. The hardware and software allows control and interrocation of each sensor head and reduces accompanying cabling through multiplexing. These systems are being, applied on the X-33 and on an upcoming STS-95 Shuttle mission. A number of commercial applications are also being pursued. It is concluded that this MEMS-based technology has significant potential to reduce costs and increase safety in a variety of aerospace applications.
Single Crystal DMs for Space-Based Observatories
NASA Astrophysics Data System (ADS)
Bierden, Paul
We propose to demonstrate the feasibility of a new manufacturing process for large aperture, high-actuator count microelectromechanical deformable mirrors (MEMS-DMs). These DMs are designed to fill a critical technology gap in NASA s plan for high- contrast space-based exoplanet observatories. We will manufacture a prototype DM with a continuous mirror facesheet, having an active aperture of 50mm diameter, supported by 2040 electrostatic actuators (50 across the diameter of the active aperture), spaced at a pitch of 1mm. The DM will be manufactured using silicon microfabrication tools. The strategic motivation for the proposed project is to advance MEMS DMs as an enabling technology in NASA s rapidly emerging program for extrasolar planet exploration. That goal is supported by an Astro2010 white paper on Technologies for Direct Optical Imaging of Exoplanets, which concluded that DMs are a critical component for all proposed internal coronagraph instrument concepts. That white paper pointed to great strides made by DM developers in the past decade, and acknowledged the components made by Boston Micromachines Corporation to be the most notable MEMS-based technology option. The principal manufacturing innovation in this project will be assembly of the DM through fusion bonding of three separate single crystal silicon wafers comprising the device s substrate, actuator array, and facesheet. The most significant challenge of this project will be to develop processes that allow reliable fusion bonds between multiple compliant silicon layers while yielding an optically flat surface and a robust electromechanical system. The compliance of the DM, which is required for its electromechanical function, will make it challenging to achieve the intimate, planar contact that is generally needed for success in fusion bonding. The manufacturing approach will use photolithography and reactive ion etching to pattern structural layers. Three wafer-scale devices will be patterned and etched independently: one for the substrate and fixed electrode layer, one for the actuator layer, and one for the mirror layer. Subsequently, each of these wafers will be bonded through a thermal fusion process to the others. In an innovative new processing technique, we will employ sacrificial oxide pillars to add temporary support to the otherwise compliant device structures. These pillars will be dissolved after assembly. The result will be a stress-free, single crystal silicon device with broadly expanded design space for geometric parameters such as actuator pitch, mirror diameter, array size, and actuator gap. Consequently, this approach will allow us to make devices with characteristics that are needed for some important NASA applications in space-based coronography, especially where larger array sizes, greater actuator pitch, and better optical surface quality are needed. The significance of this work is that it will provide a technology platform that meets or exceeds the superb optical performance that has been demonstrated in conventional pizezoelectrically actuated DMs, while retaining the advantages in cost, repeatability, and thermal insensitivity that have been demonstrated in the newer generation of MEMS electrostatically actuated DMs. The shift to bonded single-crystal structures will eliminate the single biggest drawback in previously reported NASA-fielded MEMS DM technology: device susceptibility to stress-induced scalloping and print through artifacts resulting from polycrystalline thin film surface micromachining. With single crystal structures bonded at atomic scales, uncorrected surface topography can be controlled to subnanometer levels, enabling the advancement of NASA s next-generation space-based coronagraphs.
Concept for a Micro Autonomous Ultrasonic Instrument (MAUI)
NASA Technical Reports Server (NTRS)
Wilson, William C.; Atkinson, Gary M.
2002-01-01
We investigate a concept for the construction a mobile Micro Optical ElectroMechanical Systems (MOEMS) based laser ultrasonic instrument to serve as a Micro Autonomous Ultrasonic Instrument (MAUI). The system will consist of a laser ultrasonic instrument fabricated using Micro Electro-Mechanical Systems (MEMS) technology, and a MEMS based walking platform like those developed by Pister et al. at Berkeley. This small system will allow for automated remote Non-Destructive Evaluation (NDE) of aerospace vehicles.
Programmable differential capacitance-to-voltage converter for MEMS accelerometers
NASA Astrophysics Data System (ADS)
Royo, G.; Sánchez-Azqueta, C.; Gimeno, C.; Aldea, C.; Celma, S.
2017-05-01
Capacitive MEMS sensors exhibit an excellent noise performance, high sensitivity and low power consumption. They offer a huge range of applications, being the accelerometer one of its main uses. In this work, we present the design of a capacitance-to-voltage converter in CMOS technology to measure the acceleration from the capacitance variations. It is based on a low-power, fully-differential transimpedance amplifier with low input impedance and a very low input noise.
The Fundamentals of Using the Digital Micromirror Device (DMD(TM)) for Projection Display
NASA Technical Reports Server (NTRS)
Yoder, Lars A.
1995-01-01
Developed by Texas Instruments (TI) the digital micromirror device (DMD(tm)) is a quickly emerging and highly useful micro-electro-mechanical structures (MEMS) device. Using standard semiconductor fabrication technology, the DMD's simplicity in concept and design will provide advantageous solutions for many different applications. At the rudimentary level, the DMD is a precision, semiconductor light switch. In the initial commercial development of DMD technology, TI has concentrated on projection display and hardcopy. This paper will focus on how the DMD is used for projection display. Other application areas are being explored and evaluated to find appropriate and beneficial uses for the DMD.
NASA Astrophysics Data System (ADS)
Martowicz, Adam; Uhl, Tadeusz
2012-10-01
The paper discusses the applicability of a reliability- and performance-based multi-criteria robust design optimization technique for micro-electromechanical systems, considering their technological uncertainties. Nowadays, micro-devices are commonly applied systems, especially in the automotive industry, taking advantage of utilizing both the mechanical structure and electronic control circuit on one board. Their frequent use motivates the elaboration of virtual prototyping tools that can be applied in design optimization with the introduction of technological uncertainties and reliability. The authors present a procedure for the optimization of micro-devices, which is based on the theory of reliability-based robust design optimization. This takes into consideration the performance of a micro-device and its reliability assessed by means of uncertainty analysis. The procedure assumes that, for each checked design configuration, the assessment of uncertainty propagation is performed with the meta-modeling technique. The described procedure is illustrated with an example of the optimization carried out for a finite element model of a micro-mirror. The multi-physics approach allowed the introduction of several physical phenomena to correctly model the electrostatic actuation and the squeezing effect present between electrodes. The optimization was preceded by sensitivity analysis to establish the design and uncertain domains. The genetic algorithms fulfilled the defined optimization task effectively. The best discovered individuals are characterized by a minimized value of the multi-criteria objective function, simultaneously satisfying the constraint on material strength. The restriction of the maximum equivalent stresses was introduced with the conditionally formulated objective function with a penalty component. The yielded results were successfully verified with a global uniform search through the input design domain.
Microtechnology management considering test and cost aspects for stacked 3D ICs with MEMS
NASA Astrophysics Data System (ADS)
Hahn, K.; Wahl, M.; Busch, R.; Grünewald, A.; Brück, R.
2018-01-01
Innovative automotive systems require complex semiconductor devices currently only available in consumer grade quality. The European project TRACE will develop and demonstrate methods, processes, and tools to facilitate usage of Consumer Electronics (CE) components to be deployable more rapidly in the life-critical automotive domain. Consumer electronics increasingly use heterogeneous system integration methods and "More than Moore" technologies, which are capable to combine different circuit domains (Analog, Digital, RF, MEMS) and which are integrated within SiP or 3D stacks. Making these technologies or at least some of the process steps available under automotive electronics requirements is an important goal to keep pace with the growing demand for information processing within cars. The approach presented in this paper aims at a technology management and recommendation system that covers technology data, functional and non-functional constraints, and application scenarios, and that will comprehend test planning and cost consideration capabilities.
NASA Astrophysics Data System (ADS)
Gray, Kory Forrest
The goal of this project was to examine the possibility of creating a novel thermal infrared detector based on silicon CMOS technology that has been enhanced by the latest nano-engineering discoveries. Silicon typically is not thought as an efficient thermoelectric material. However recent advancements in nanotechnology have improved the potential for a highly sensitive infrared detector based on nano-structured silicon. The thermal conductivity of silicon has been shown to be reduced from 150 W/mK down to 60 W/mK just by decreasing the scale of the silicon from bulk down to the sub-micron scale. Further reduction of the thermal conductivity has been shown by patterning silicon with a phonon crystal structure which has been reported to have thermal conductivities down to 10 W/mK. The phonon crystal structure consists of a 2D array of holes that are etched into the silicon. The size and pitch of the holes are on the order of the mean free path of the phonons in silicon which is approximately 200-500nm. This particular device had 200nm holes on a 400nm pitch. The Seebeck coefficient of silicon can also be enhanced by the reduction of the material from the bulk to sub-micron scale and with degenerate level doping. The combination of decreased thermal conductivity and increased Seebeck coefficient allow silicon to be a promising material for thermoelectric infrared detectors. The highly doped silicon is desired to reduce the electrical resistance of the device. The low electrical resistance is required to reduce the Johnson noise of the device which is the dominant noise source for most thermal detectors. This project designed a MEMS thermopile using a silicon-on-insulator substrate, and a CMOS compatible process. The basic thermopile consists of a silicon dioxide membrane with phononic crystal patterned silicon thermocouples around the edges of the membrane. Vertical aligned, multi-walled, carbon nanotubes were used as the infrared absorption layer. A MEMS thermoelectric detector with a D* of 3 * 107 cm Hz 0.5/W was demonstrated with a time response of 3-10 milliseconds. With this initial research, it is possible to improve the D* to the high 108 cm Hz 0.5/W range by slightly changing the design of the thermopile and patterning the absorption layer.
The multi-level perspective analysis: Indonesia geothermal energy transition study
NASA Astrophysics Data System (ADS)
Wisaksono, A.; Murphy, J.; Sharp, J. H.; Younger, P. L.
2018-01-01
The study adopts a multi-level perspective in technology transition to analyse how the transition process in the development of geothermal energy in Indonesia is able to compete against the incumbent fossil-fuelled energy sources. Three levels of multi-level perspective are socio-technical landscape (ST-landscape), socio-technical regime (ST-regime) and niche innovations in Indonesia geothermal development. The identification, mapping and analysis of the dynamic relationship between each level are the important pillars of the multi-level perspective framework. The analysis considers the set of rules, actors and controversies that may arise in the technological transition process. The identified geothermal resource risks are the basis of the emerging geothermal technological innovations in Indonesian geothermal. The analysis of this study reveals the transition pathway, which yields a forecast for the Indonesian geothermal technology transition in the form of scenarios and probable impacts.
Development of a Self-Calibrated MEMS Gyrocompass for North-Finding and Tracking
NASA Astrophysics Data System (ADS)
Prikhodko, Igor P.
This Ph.D. dissertation presents development of a microelectromechanical (MEMS) gyrocompass for north-finding and north-tracking applications. The central part of this work enabling these applications is control and self-calibration architectures for drift mitigation over thermal environments, validated using a MEMS quadruple mass gyroscope. The thesis contributions are the following: • Adapted and implemented bias and scale-factor drifts compensation algorithm relying on temperature self-sensing for MEMS gyroscopes with high quality factors. The real-time self-compensation reduced a total bias error to 2 °/hr and a scale-factor error to 500 ppm over temperature range of 25 °C to 55 °C (on par with the state-of-the-art). • Adapted and implemented a scale-factor self-calibration algorithm previously employed for macroscale hemispherical resonator gyroscope to MEMS Coriolis vibratory gyroscopes. An accuracy of 100 ppm was demonstrated by simultaneously measuring the true and estimated scale-factors over temperature variations (on par with the state-of-the art). • Demonstrated north-finding accuracy satisfying a typical mission requirement of 4 meter target location error at 1 kilometer stand-off distance (on par with a GPS accuracy). Analyzed north-finding mechanizations trade-offs for MEMS vibratory gyroscopes and demonstrated measurements of the Earth's rotation (15 °/hr). • Demonstrated, for the first time, an angle measuring MEMS gyroscope operation for north-tracking applications in a +/-500 °/s rate range and 100 Hz bandwidth, eliminating both bandwidth and range constraints of conventional open-loop Coriolis vibratory gyroscopes. • Investigated hypothesis that surface-tension driven glass-blowing microfabrication can create highly spherical shells for 3-D MEMS. Without any trimming or tuning of the natural frequencies, a 1 MHz glass-blown 3-D microshell resonator demonstrated a 0.63 % frequency mismatch between two degenerate 4-node wineglass modes. • Multi-axis rotation detection for nuclear magnetic resonance (NMR) gyroscope was proposed and developed. The analysis of cross-axis sensitivities for NMR gyroscope was performed. The framework for the analysis of NMR gyroscope dynamics for both open loop and closed loop modes of operation was developed.
Simulation of MEMS for the Next Generation Space Telescope
NASA Technical Reports Server (NTRS)
Mott, Brent; Kuhn, Jonathan; Broduer, Steve (Technical Monitor)
2001-01-01
The NASA Goddard Space Flight Center (GSFC) is developing optical micro-electromechanical system (MEMS) components for potential application in Next Generation Space Telescope (NGST) science instruments. In this work, we present an overview of the electro-mechanical simulation of three MEMS components for NGST, which include a reflective micro-mirror array and transmissive microshutter array for aperture control for a near infrared (NIR) multi-object spectrometer and a large aperture MEMS Fabry-Perot tunable filter for a NIR wide field camera. In all cases the device must operate at cryogenic temperatures with low power consumption and low, complementary metal oxide semiconductor (CMOS) compatible, voltages. The goal of our simulation efforts is to adequately predict both the performance and the reliability of the devices during ground handling, launch, and operation to prevent failures late in the development process and during flight. This goal requires detailed modeling and validation of complex electro-thermal-mechanical interactions and very large non-linear deformations, often involving surface contact. Various parameters such as spatial dimensions and device response are often difficult to measure reliably at these small scales. In addition, these devices are fabricated from a wide variety of materials including surface micro-machined aluminum, reactive ion etched (RIE) silicon nitride, and deep reactive ion etched (DRIE) bulk single crystal silicon. The above broad set of conditions combine to be a formidable challenge for space flight qualification analysis. These simulations represent NASA/GSFC's first attempts at implementing a comprehensive strategy to address complex MEMS structures.
Design and Simulation of an Electrothermal Actuator Based Rotational Drive
NASA Astrophysics Data System (ADS)
Beeson, Sterling; Dallas, Tim
2008-10-01
As a participant in the Micro and Nano Device Engineering (MANDE) Research Experience for Undergraduates program at Texas Tech University, I learned how MEMS devices operate and the limits of their operation. Using specialized AutoCAD-based design software and the ANSYS simulation program, I learned the MEMS fabrication process used at Sandia National Labs, the design limitations of this process, the abilities and drawbacks of micro devices, and finally, I redesigned a MEMS device called the Chevron Torsional Ratcheting Actuator (CTRA). Motion is achieved through electrothermal actuation. The chevron (bent-beam) actuators cause a ratcheting motion on top of a hub-less gear so that as voltage is applied the CTRA spins. The voltage applied needs to be pulsed and the frequency of the pulses determine the angular frequency of the device. The main objective was to design electromechanical structures capable of transforming the electrical signals into mechanical motion without overheating. The design was optimized using finite element analysis in ANSYS allowing multi-physics simulations of our model system.
NASA Astrophysics Data System (ADS)
Sun, Yuan; Bhattacherjee, Anol
2011-11-01
Information technology (IT) usage within organisations is a multi-level phenomenon that is influenced by individual-level and organisational-level variables. Yet, current theories, such as the unified theory of acceptance and use of technology, describe IT usage as solely an individual-level phenomenon. This article postulates a model of organisational IT usage that integrates salient organisational-level variables such as user training, top management support and technical support within an individual-level model to postulate a multi-level model of IT usage. The multi-level model was then empirically validated using multi-level data collected from 128 end users and 26 managers in 26 firms in China regarding their use of enterprise resource planning systems and analysed using the multi-level structural equation modelling (MSEM) technique. We demonstrate the utility of MSEM analysis of multi-level data relative to the more common structural equation modelling analysis of single-level data and show how single-level data can be aggregated to approximate multi-level analysis when multi-level data collection is not possible. We hope that this article will motivate future scholars to employ multi-level data and multi-level analysis for understanding organisational phenomena that are truly multi-level in nature.
NASA Astrophysics Data System (ADS)
Lin, Ming-Tzer
The Semiconductor Industry has grown rapidly in the last twenty years. The national technology roadmap for semiconductors plans for developing the complexity and packing density of semiconductor devices into the next decade, allowing ever smaller and more densely packed structures to be fabricated. Recently, MEMS (Micro-Electro-Mechanical Systems) have become important in modern technology. The goal of MEMs is to integrate many types of miniature devices on a single chip, creating a new micro-world. The oxidation of silicon is one of the most important processes in semiconductor technology. Producing high-quality IC's and MEMS devices requires an understanding of the basic oxidation mechanism. In addition, for the reliability of IC's and MEMS devices, the mechanical properties of the oxide play a critical role. There has been an apparent convergence of opinion on the relevant mechanism leading to the "standard computational model" for stress effects on silicon oxidation. This model has recently become suspect. Most of the reasonably direct experimental data on the flow properties of SiO 2 thin film do not support a stress-dependent viscosity of the sort envisioned by the model. Gold and gold vanadium alloys are used in electrical interconnections and in radio frequency switch contacts for the semiconductor industry, MEMs sensors for the aerospace industry and also in brain probes by the bioelectronics mechanical industry. Despite the strong potential usage of gold and gold vanadium thin films at the small scale, very little is known about their mechanical properties. Our goal was to experimentally investigate stress and its influence on SiO2 thin films and the mechanical properties of gold and gold vanadium thin films at room temperature and at elevated temperature of different vanadium concentration. We found that the application of relatively small amounts of bending to an oxidizing silicon substrate leads to significant decreases in oxide thickness in the ultrathin oxide regime. Both tensile and compressive bending retard oxide growth, although compressive bending results in somewhat thinner oxides than does tensile bending. We also determined the modulus of gold and gold vanadium, and discovered that there is some evidence for a vanadium concentration dependence of the mechanical properties.
Miniature vibration isolation system for space applications
NASA Astrophysics Data System (ADS)
Quenon, Dan; Boyd, Jim; Buchele, Paul; Self, Rick; Davis, Torey; Hintz, Timothy L.; Jacobs, Jack H.
2001-06-01
In recent years, there has been a significant interest in, and move towards using highly sensitive, precision payloads on space vehicles. In order to perform tasks such as communicating at extremely high data rates between satellites using laser cross-links, or searching for new planets in distant solar systems using sparse aperture optical elements, a satellite bus and its payload must remain relatively motionless. The ability to hold a precision payload steady is complicated by disturbances from reaction wheels, control moment gyroscopes, solar array drives, stepper motors, and other devices. Because every satellite is essentially unique in its construction, isolating or damping unwanted vibrations usually requires a robust system over a wide bandwidth. The disadvantage of these systems is that they typically are not retrofittable and not tunable to changes in payload size or inertias. Previous work, funded by AFRL, DARPA, BMDO and others, developed technology building blocks that provide new methods to control vibrations of spacecraft. The technology of smart materials enables an unprecedented level of integration of sensors, actuators, and structures; this integration provides the opportunity for new structural designs that can adaptively influence their surrounding environment. To date, several demonstrations have been conducted to mature these technologies. Making use of recent advances in smart materials, microelectronics, Micro-Electro Mechanical Systems (MEMS) sensors, and Multi-Functional Structures (MFS), the Air Force Research Laboratory along with its partner DARPA, have initiated an aggressive program to develop a Miniature Vibration Isolation System (MVIS) (patent pending) for space applications. The MVIS program is a systems-level demonstration of the application of advanced smart materials and structures technology that will enable programmable and retrofittable vibration control of spacecraft precision payloads. The current effort has been awarded to Honeywell Space Systems Operation. AFRL is providing in-house research and testing in support of the program as well. The MVIS program will culminate in a flight demonstration that shows the benefits of applying smart materials for vibration isolation in space and precision payload control.
Liu, Lifeng; Ding, Xiangdong; Li, Ju; Lookman, Turab; Sun, Jun
2014-02-21
Martensitic transformation usually creates hierarchical internal structures beyond mere change of the atomic crystal structure. Multi-stage nucleation is thus required, where nucleation (level-1) of the underlying atomic crystal lattice does not have to be immediately followed by the nucleation of higher-order superstructures (level-2 and above), such as polysynthetic laths. Using in situ transmission electron microscopy (TEM), we directly observe the nucleation of the level-2 superstructure in a Cu-Al-Ni single crystal under compression, with critical super-nuclei size L2c around 500 nm. When the sample size D decreases below L2c, the superelasticity behavior changes from a flat stress plateau to a continuously rising stress-strain curve. Such size dependence definitely would impact the application of shape memory alloys in miniaturized MEMS/NEMS devices.
Poly-SiGe MEMS actuators for adaptive optics
NASA Astrophysics Data System (ADS)
Lin, Blake C.; King, Tsu-Jae; Muller, Richard S.
2006-01-01
Many adaptive optics (AO) applications require mirror arrays with hundreds to thousands of segments, necessitating a CMOS-compatible MEMS process to integrate the mirrors with their driving electronics. This paper proposes a MEMS actuator that is fabricated using low-temperature polycrystalline silicon-germanium (poly-SiGe) surface-micromaching technology (total thermal budget is 6 hours at or below 425°C). The MEMS actuator consists of three flexures and a hexagonal platform, on which a micromirror is to be assembled. The flexures are made of single-layer poly-SiGe with stress gradient across thickness of the film, making them bend out-of-plane after sacrificial-layer release to create a large nominal gap. The platform, on the other hand, has an additional stress-balancing SiGe layer deposited on top, making the dual-layer stack stay flat after release. Using this process, we have successfully fabricated the MEMS actuator which is lifted 14.6 μm out-of-plane by 290-μm-long flexures. The 2-μm-thick hexagonal mirror-platform exhibits a strain gradient of -5.5×10 -5 μm -1 (equivalent to 18 mm radius-of-curvature), which would be further reduced once the micromirror is assembled.
Producing fluid flow using 3D carbon electrodes
NASA Astrophysics Data System (ADS)
Rouabah, H. A.; Park, B. Y.; Zaouk, R. B.; Madou, M. J.; Green, Nicolas G.
2008-12-01
Moving and manipulating bio-particles and fluids on the microscale is central to many lab-on-a-chip applications. Techniques for pumping fluids which use electric fields have shown promise using both DC and AC voltages. AC techniques, however, require the use of integrated metal electrodes which have a low resistance but can suffer from unwanted chemical reactions even at low potentials. In this paper we introduce the use of carbon MEMS technology (C-MEMS), a fabrication method which produces 3D conductive polymeric structures. Results are presented of the fabrication of an innovative design of 3D AC-electroosmotic micropump and preliminary experimental measurements which demonstrate the potential of both the technology and the design.
NASA Astrophysics Data System (ADS)
Zhang, Weiping; Chen, Wenyuan; Zhao, Xiaolin; Li, Shengyong; Jiang, Yong
2005-08-01
In a novel safety device based on MEMS technology for high consequence systems, the discriminator consists of two groups of metal counter meshing gears and two pawl/ratchet wheel mechanisms. Each group of counter meshing gears is onepiece and driven directly by an axial flux permanent magnet micromotor respectively. The energy-coupling element is an optical shutter with two collimators and a coupler wheel. The safety device's probability is less than 1/106. It is fabricated by combination of an LiGA-like process and precision mechanical engineering. The device has simple structure, few dynamic problems, high strength and strong reliability.
RF MEMS devices for multifunctional integrated circuits and antennas
NASA Astrophysics Data System (ADS)
Peroulis, Dimitrios
Micromachining and RF Micro-Electro-Mechanical Systems (RF MEMS) have been identified as two of the most significant enabling technologies in developing miniaturized low-cost communications systems and sensor networks. The key components in these MEMS-based architectures are the RF MEMS switches and varactors. The first part of this thesis focuses on three novel RF MEMS components with state-of-the-art performance. In particular, a broadband 6 V capacitive MEMS switch is presented with insertion loss of only 0.04 and 0.17 dB at 10 and 40 GHz respectively. Special consideration is given to particularly challenging issues, such as residual stress, planarity, power handling capability and switching speed. The need for switches operating below 1 GHz is also identified and a spring-loaded metal-to-metal contact switch is developed. The measured on-state contact resistance and off-state series capacitance are 0.5 O and 10 fF respectively for this switch. An analog millimeter-wave variable capacitor is the third MEMS component presented in this thesis. This variable capacitor shows an ultra high measured tuning range of nearly 4:1, which is the highest reported value for the millimeter-wave region. The second part of this thesis primarily concentrates on MEMS-based reconfigurable systems and their potential to revolutionize the design of future RF/microwave multifunctional systems. High-isolation switches and switch packets with isolation of more than 60 dB are designed and implemented. Furthermore, lowpass and bandpass tunable filters with 3:1 and 2:1 tuning ratios respectively are demonstrated. Similar methods have been also applied to the field of slot antennas and a novel design technique for compact reconfigurable antennas has been developed. The main advantage of these antennas is that they essentially preserve their impedance, radiation pattern, polarization, gain and efficiency for all operating frequencies. The thesis concludes by discussing the future challenges of RF MEMS, such as packaging and reliability.
Faster sensitivity and non-antimonite permanent photoresist for MEMS
NASA Astrophysics Data System (ADS)
Misumi, Koichi; Saito, Koji; Yamanouchi, Atsushi; Senzaki, Takahiro; Okui, Toshiki; Honma, Hideo
2006-03-01
Micro Electro Mechanical Systems (MEMS) is a three-dimensional micro-fabrication technology based on photolithography. The fields of application are extensive and wide-ranging. Among the applications, those that have already acquired a large market include acceleration sensors for airbags of automobiles, pressure sensors for engine control, inkjet printer heads and thin film magnetic heads. The market is expected to further expand in the optic and biology-related fields in the future. In the MEMS field, the packaging accounts for the cost, and it is difficult to standardize due to the low production volume of highly specific technology application. A typical application in the MEMS process would be to conduct plating and etching (Deep RIE) through an intermediate layer of photoresist patterns, but there are cases where the photoresist itself is left therein as a permanent film. A photoresist composed of epoxy resin as the main component can form the permanent film through a catalyst of the optical cationic polymerizating initiator. In general, the optical cationic polymerizating initiator is of onium salt with antimonite as the anion group due to the nature of the hardening rate or the exposure energy. This paper presents the development status of a high sensitivity permanent photoresist made of epoxy resin as the main component with non-antimonite optical cationic polymerizating initiator with concerns to the impact to the environment and material for packaging.
Microelectromechanical systems for experimental physics and optical telecommunications
NASA Astrophysics Data System (ADS)
Aksyuk, Vladimir Anatolyevich
1999-12-01
Micro-Electro-Mechanical Systems (MEMS) are an emerging technology, which, when applied to the field of physical sensors, offers not only an obvious advantage of being small and cheap, but more importantly, provides some unique experimental opportunities. These are based on the way physical properties scale with decreasing size. This thesis discusses these basic principles and corresponding advantages and limitations of MEMS technology and presents several experiments in which micromachines are used to do physical measurements that could not be done before. Three types of micromechanical magnetometers are demonstrated. When compared to the state of the art traditional techniques they show greater sensitivity, faster response and can be applied over a wider range of experimental conditions. The high-Q micromechanical torsional oscillator magnetometer is used to observe mesoscopic vortex physics, including single flux lines penetrating into a type-II superconductor just above the first critical field. The Faraday balance ``Trampoline'' magnetometer combines high sensitivity, high bandwidth and can be operated in a wide temperature range. It is used in both high pulsed magnetic fields to record deHaas-vanAlphen oscillations and in DC magnetic fields for magnetization measurements at temperatures down to 100mK. The high sensitivity DC torque magnetometer offers yet higher sensitivity and can be used for a variety of magnetization measurements. Several other MEMS devices for physics and telecommunications applications are presented, including a micromachined near field scanning optical microscope, MEMS fiberoptic switches and large-area large-angle scanners. They provide examples of complex functionality that can be achieved with micromechanics by combining sensors with inherently low-power electrostatic actuators. The optically powered optical power limiter demonstrates the possibility of operating MEMS with optical rather than electrical power.
Finite Element Modeling of Micromachined MEMS Photon Devices
DOE Office of Scientific and Technical Information (OSTI.GOV)
Datskos, P.G.; Evans, B.M.; Schonberger, D.
1999-09-20
The technology of microelectronics that has evolved over the past half century is one of great power and sophistication and can now be extended to many applications (MEMS and MOEMS) other than electronics. An interesting application of MEMS quantum devices is the detection of electromagnetic radiation. The operation principle of MEMS quantum devices is based on the photoinduced stress in semiconductors, and the photon detection results from the measurement of the photoinduced bending. These devices can be described as micromechanical photon detectors. In this work, we have developed a technique for simulating electronic stresses using finite element analysis. We havemore » used our technique to model the response of micromechanical photon devices to external stimuli and compared these results with experimental data. Material properties, geometry, and bimaterial design play an important role in the performance of micromechanical photon detectors. We have modeled these effects using finite element analysis and included the effects of bimaterial thickness coating, effective length of the device, width, and thickness.« less
NASA Astrophysics Data System (ADS)
Iwaya, Takamitsu; Akao, Shingo; Sakamoto, Toshihiro; Tsuji, Toshihiro; Nakaso, Noritaka; Yamanaka, Kazushi
2012-07-01
In the field of environmental measurement and security, a portable gas chromatograph (GC) is required for the on-site analysis of multiple hazardous gases. Although the gas separation column has been downsized using micro-electro-mechanical-systems (MEMS) technology, an MEMS column made of silicon and glass still does not have sufficient robustness and a sufficiently low fabrication cost for a portable GC. In this study, we fabricated a robust and inexpensive high-precision metal MEMS column by combining diffusion-bonded etched stainless-steel plates with alignment evaluation using acoustic microscopy. The separation performance was evaluated using a desktop GC with a flame ionization detector and we achieved the high separation performance comparable to the best silicon MEMS column fabricated using a dynamic coating method. As an application, we fabricated a palm-size surface acoustic wave (SAW) GC combining this column with a ball SAW sensor and succeeded in separating and detecting a mixture of volatile organic compounds.
Finite element modeling of micromachined MEMS photon devices
NASA Astrophysics Data System (ADS)
Evans, Boyd M., III; Schonberger, D. W.; Datskos, Panos G.
1999-09-01
The technology of microelectronics that has evolved over the past half century is one of great power and sophistication and can now be extended to many applications (MEMS and MOEMS) other than electronics. An interesting application of MEMS quantum devices is the detection of electromagnetic radiation. The operation principle of MEMS quantum devices is based on the photoinduced stress in semiconductors, and the photon detection results from the measurement of the photoinduced bending. These devices can be described as micromechanical photon detectors. In this work, we have developed a technique for simulating electronic stresses using finite element analysis. We have used our technique to model the response of micromechanical photon devices to external stimuli and compared these results with experimental data. Material properties, geometry, and bimaterial design play an important role in the performance of micromechanical photon detectors. We have modeled these effects using finite element analysis and included the effects of bimaterial thickness coating, effective length of the device, width, and thickness.
High Volume Manufacturing and Field Stability of MEMS Products
NASA Astrophysics Data System (ADS)
Martin, Jack
Low volume MEMS/NEMS production is practical when an attractive concept is implemented with business, manufacturing, packaging, and test support. Moving beyond this to high volume production adds requirements on design, process control, quality, product stability, market size, market maturity, capital investment, and business systems. In a broad sense, this chapter uses a case study approach: It describes and compares the silicon-based MEMS accelerometers, pressure sensors, image projection systems, and gyroscopes that are in high volume production. Although they serve several markets, these businesses have common characteristics. For example, the manufacturing lines use automated semiconductor equipment and standard material sets to make consistent products in large quantities. Standard, well controlled processes are sometimes modified for a MEMS product. However, novel processes that cannot run with standard equipment and material sets are avoided when possible. This reliance on semiconductor tools, as well as the organizational practices required to manufacture clean, particle-free products partially explains why the MEMS market leaders are integrated circuit manufacturers. There are other factors. MEMS and NEMS are enabling technologies, so it can take several years for high volume applications to develop. Indeed, market size is usually a strong function of price. This becomes a vicious circle, because low price requires low cost - a result that is normally achieved only after a product is in high volume production. During the early years, IC companies reduced cost and financial risk by using existing facilities for low volume MEMS production. As a result, product architectures are partially determined by capabilities developed for previous products. This chapter includes a discussion of MEMS product architecture with particular attention to the impact of electronic integration, packaging, and surfaces. Packaging and testing are critical, because they are significant factors in MEMS product cost. These devices have extremelyhigh surface/volume ratios, so performance and stability may depend on the control of surface characteristics after packaging. Looking into the future, the competitive advantage of IC suppliers will decrease as small companies learn to integrate MEMS/NEMS devices on CMOS foundry wafers. Packaging challenges still remain, because most MEMS/NEMS products must interact with the environment without degrading stability or reliability. Generic packaging solutions are unlikely. However, packaging subcontractors recognize that MEMS/NEMS is a growth opportunity. They will spread the overhead burden of high-capital-cost-facilities by developing flexible processes in order to package several types of moderate volume integrated MEMS/NEMS products on the same equipment.
High Volume Manufacturing and Field Stability of MEMS Products
NASA Astrophysics Data System (ADS)
Martin, Jack
Low volume MEMS/NEMS production is practical when an attractive concept is implemented with business, manufacturing, packaging, and test support. Moving beyond this to high volume production adds requirements on design, process control, quality, product stability, market size, market maturity, capital investment, and business systems. In a broad sense, this chapter uses a case study approach: It describes and compares the silicon-based MEMS accelerometers, pressure sensors, image projection systems, and gyroscopes that are in high volume production. Although they serve several markets, these businesses have common characteristics. For example, the manufacturing lines use automated semiconductor equipment and standard material sets to make consistent products in large quantities. Standard, well controlled processes are sometimes modified for a MEMS product. However, novel processes that cannot run with standard equipment and material sets are avoided when possible. This reliance on semiconductor tools, as well as the organizational practices required to manufacture clean, particle-free products partially explains why the MEMS market leaders are integrated circuit manufacturers. There are other factors. MEMS and NEMS are enabling technologies, so it can take several years for high volume applications to develop. Indeed, market size is usually a strong function of price. This becomes a vicious circle, because low price requires low cost - a result that is normally achieved only after a product is in high volume production. During the early years, IC companies reduced cost and financial risk by using existing facilities for low volume MEMS production. As a result, product architectures are partially determined by capabilities developed for previous products. This chapter includes a discussion of MEMS product architecture with particular attention to the impact of electronic integration, packaging, and surfaces. Packaging and testing are critical, because they are significant factors in MEMS product cost. These devices have extremely high surface/volume ratios, so performance and stability may depend on the control of surface characteristics after packaging. Looking into the future, the competitive advantage of IC suppliers will decrease as small companies learn to integrate MEMS/NEMS devices on CMOS foundry wafers. Packaging challenges still remain, because most MEMS/NEMS products must interact with the environment without degrading stability or reliability. Generic packaging solutions are unlikely. However, packaging subcontractors recognize that MEMS/NEMS is a growth opportunity. They will spread the overhead burden of high-capital-cost-facilities by developing flexible processes in order to package several types of moderate volume integrated MEMS/NEMS products on the same equipment.
A Highly Reliable and Cost-Efficient Multi-Sensor System for Land Vehicle Positioning.
Li, Xu; Xu, Qimin; Li, Bin; Song, Xianghui
2016-05-25
In this paper, we propose a novel positioning solution for land vehicles which is highly reliable and cost-efficient. The proposed positioning system fuses information from the MEMS-based reduced inertial sensor system (RISS) which consists of one vertical gyroscope and two horizontal accelerometers, low-cost GPS, and supplementary sensors and sources. First, pitch and roll angle are accurately estimated based on a vehicle kinematic model. Meanwhile, the negative effect of the uncertain nonlinear drift of MEMS inertial sensors is eliminated by an H∞ filter. Further, a distributed-dual-H∞ filtering (DDHF) mechanism is adopted to address the uncertain nonlinear drift of the MEMS-RISS and make full use of the supplementary sensors and sources. The DDHF is composed of a main H∞ filter (MHF) and an auxiliary H∞ filter (AHF). Finally, a generalized regression neural network (GRNN) module with good approximation capability is specially designed for the MEMS-RISS. A hybrid methodology which combines the GRNN module and the AHF is utilized to compensate for RISS position errors during GPS outages. To verify the effectiveness of the proposed solution, road-test experiments with various scenarios were performed. The experimental results illustrate that the proposed system can achieve accurate and reliable positioning for land vehicles.
A Highly Reliable and Cost-Efficient Multi-Sensor System for Land Vehicle Positioning
Li, Xu; Xu, Qimin; Li, Bin; Song, Xianghui
2016-01-01
In this paper, we propose a novel positioning solution for land vehicles which is highly reliable and cost-efficient. The proposed positioning system fuses information from the MEMS-based reduced inertial sensor system (RISS) which consists of one vertical gyroscope and two horizontal accelerometers, low-cost GPS, and supplementary sensors and sources. First, pitch and roll angle are accurately estimated based on a vehicle kinematic model. Meanwhile, the negative effect of the uncertain nonlinear drift of MEMS inertial sensors is eliminated by an H∞ filter. Further, a distributed-dual-H∞ filtering (DDHF) mechanism is adopted to address the uncertain nonlinear drift of the MEMS-RISS and make full use of the supplementary sensors and sources. The DDHF is composed of a main H∞ filter (MHF) and an auxiliary H∞ filter (AHF). Finally, a generalized regression neural network (GRNN) module with good approximation capability is specially designed for the MEMS-RISS. A hybrid methodology which combines the GRNN module and the AHF is utilized to compensate for RISS position errors during GPS outages. To verify the effectiveness of the proposed solution, road-test experiments with various scenarios were performed. The experimental results illustrate that the proposed system can achieve accurate and reliable positioning for land vehicles. PMID:27231917
A MEMS-based, wireless, biometric-like security system
NASA Astrophysics Data System (ADS)
Cross, Joshua D.; Schneiter, John L.; Leiby, Grant A.; McCarter, Steven; Smith, Jeremiah; Budka, Thomas P.
2010-04-01
We present a system for secure identification applications that is based upon biometric-like MEMS chips. The MEMS chips have unique frequency signatures resulting from fabrication process variations. The MEMS chips possess something analogous to a "voiceprint". The chips are vacuum encapsulated, rugged, and suitable for low-cost, highvolume mass production. Furthermore, the fabrication process is fully integrated with standard CMOS fabrication methods. One is able to operate the MEMS-based identification system similarly to a conventional RFID system: the reader (essentially a custom network analyzer) detects the power reflected across a frequency spectrum from a MEMS chip in its vicinity. We demonstrate prototype "tags" - MEMS chips placed on a credit card-like substrate - to show how the system could be used in standard identification or authentication applications. We have integrated power scavenging to provide DC bias for the MEMS chips through the use of a 915 MHz source in the reader and a RF-DC conversion circuit on the tag. The system enables a high level of protection against typical RFID hacking attacks. There is no need for signal encryption, so back-end infrastructure is minimal. We believe this system would make a viable low-cost, high-security system for a variety of identification and authentication applications.
Chen, Jiawen; Li, Jianhua; Li, Yiyuan; Chen, Yulong
2018-01-01
A miniaturized Co-based amorphous wire GMI (Giant magneto-impedance) magnetic sensor was designed and fabricated in this paper. The Co-based amorphous wire was used as the sense element due to its high sensitivity to the magnetic field. A three-dimensional micro coil surrounding the Co-based amorphous wire was fabricated by MEMS (Micro-Electro-Mechanical System) technology, which was used to extract the electrical signal. The three-dimensional micro pick-up coil was designed and simulated with HFSS (High Frequency Structure Simulator) software to determine the key parameters. Surface micro machining MEMS (Micro-Electro-Mechanical System) technology was employed to fabricate the three-dimensional coil. The size of the developed amorphous wire magnetic sensor is 5.6 × 1.5 × 1.1 mm3. Helmholtz coil was used to characterize the performance of the device. The test results of the sensor sample show that the voltage change is 130 mV/Oe and the linearity error is 4.83% in the range of 0~45,000 nT. The results indicate that the developed miniaturized magnetic sensor has high sensitivity. By testing the electrical resistance of the samples, the results also showed high uniformity of each device. PMID:29494477
Hommen, Udo; Forbes, Valery; Grimm, Volker; Preuss, Thomas G; Thorbek, Pernille; Ducrot, Virginie
2016-01-01
Mechanistic effect models (MEMs) are useful tools for ecological risk assessment of chemicals to complement experimentation. However, currently no recommendations exist for how to use them in risk assessments. Therefore, the Society of Environmental Toxicology and Chemistry (SETAC) MODELINK workshop aimed at providing guidance for when and how to apply MEMs in regulatory risk assessments. The workshop focused on risk assessment of plant protection products under Regulation (EC) No 1107/2009 using MEMs at the organism and population levels. Realistic applications of MEMs were demonstrated in 6 case studies covering assessments for plants, invertebrates, and vertebrates in aquatic and terrestrial habitats. From the case studies and their evaluation, 12 recommendations on the future use of MEMs were formulated, addressing the issues of how to translate specific protection goals into workable questions, how to select species and scenarios to be modeled, and where and how to fit MEMs into current and future risk assessment schemes. The most important recommendations are that protection goals should be made more quantitative; the species to be modeled must be vulnerable not only regarding toxic effects but also regarding their life history and dispersal traits; the models should be as realistic as possible for a specific risk assessment question, and the level of conservatism required for a specific risk assessment should be reached by designing appropriately conservative environmental and exposure scenarios; scenarios should include different regions of the European Union (EU) and different crops; in the long run, generic MEMs covering relevant species based on representative scenarios should be developed, which will require EU-level joint initiatives of all stakeholders involved. The main conclusion from the MODELINK workshop is that the considerable effort required for making MEMs an integral part of environmental risk assessment of pesticides is worthwhile, because it will make risk assessments not only more ecologically relevant and less uncertain but also more comprehensive, coherent, and cost effective. © 2015 The Authors. Integrated Environmental Assessment and Management published by Wiley Periodicals, Inc. on behalf of SETAC.
Application of MEMS Microphone Array Technology to Airframe Noise Measurements
NASA Technical Reports Server (NTRS)
Humphreys, William M., Jr.; Shams, Qamar A.; Graves, Sharon S.; Sealey, Bradley S.; Bartram, Scott M.; Comeaux, Toby
2005-01-01
Current generation microphone directional array instrumentation is capable of extracting accurate noise source location and directivity data on a variety of aircraft components, resulting in significant gains in test productivity. However, with this gain in productivity has come the desire to install larger and more complex arrays in a variety of ground test facilities, creating new challenges for the designers of array systems. To overcome these challenges, a research study was initiated to identify and develop hardware and fabrication technologies which could be used to construct an array system exhibiting acceptable measurement performance but at much lower cost and with much simpler installation requirements. This paper describes an effort to fabricate a 128-sensor array using commercially available Micro-Electro-Mechanical System (MEMS) microphones. The MEMS array was used to acquire noise data for an isolated 26%-scale high-fidelity Boeing 777 landing gear in the Virginia Polytechnic Institute and State University Stability Tunnel across a range of Mach numbers. The overall performance of the array was excellent, and major noise sources were successfully identified from the measurements.
Operational characterization of CSFH MEMS technology based hinges
NASA Astrophysics Data System (ADS)
Crescenzi, Rocco; Balucani, Marco; Belfiore, Nicola Pio
2018-05-01
Progress in MEMS technology continuously stimulates new developments in the mechanical structure of micro systems, such as, for example, the concept of so-called CSFH (conjugate surfaces flexural hinge), which makes it possible, simultaneously, to minimize the internal stresses and to increase motion range and robustness. Such a hinge may be actuated by means of a rotary comb-drive, provided that a proper set of simulations and tests are capable to assess its feasibility. In this paper, a CSFH has been analyzed with both theoretical and finite element (FEM) methods, in order to obtain the relation between voltage and generated torque. The FEM model considers also the fringe effect on the comb drive finger. Electromechanical couple-field analysis is performed by means of both direct and load transfer methods. Experimental tests have been also performed on a CSFH embedded in a MEMS prototype, which has been fabricated starting from a SOI wafer and using D-RIE (deep reactive ion etching). Results showed that CSFH performs better than linear flexure hinges in terms of larger rotations and less stress for given applied voltage.
A Low-Cost CMOS-MEMS Piezoresistive Accelerometer with Large Proof Mass
Khir, Mohd Haris Md; Qu, Peng; Qu, Hongwei
2011-01-01
This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive sensing material. A full Wheatstone bridge was constructed through easy wiring allowed by the three metal layers in the 0.5 μm CMOS technology. The device fabrication process consisted of a standard CMOS process for sensor configuration, and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. A bulk single-crystal silicon (SCS) substrate is included in the proof mass to increase sensor sensitivity. In device design and analysis, the self heating of the polysilicon piezoresistors and its effect to the sensor performance is also discussed. With a low operating power of 1.5 mW, the accelerometer demonstrates a sensitivity of 0.077 mV/g prior to any amplification. Dynamic tests have been conducted with a high-end commercial calibrating accelerometer as reference. PMID:22164052
Design of a multi-axis implantable MEMS sensor for intraosseous bone stress monitoring
NASA Astrophysics Data System (ADS)
Alfaro, Fernando; Weiss, Lee; Campbell, Phil; Miller, Mark; Fedder, Gary K.
2009-08-01
The capability to assess the biomechanical properties of living bone is important for basic research as well as the clinical management of skeletal trauma and disease. Even though radiodensitometric imaging is commonly used to infer bone quality, bone strength does not necessarily correlate well with these non-invasive measurements. This paper reports on the design, fabrication and initial testing of an implantable ultra-miniature multi-axis sensor for directly measuring bone stresses at a micro-scale. The device, which is fabricated with CMOS-MEMS processes, is intended to be permanently implanted within open fractures, or embedded in bone grafts, or placed on implants at the interfaces between bone and prosthetics. The stress sensor comprises an array of piezoresistive pixels to detect a stress tensor at the interfacial area between the MEMS chip and bone, with a resolution to 100 Pa, in 1 s averaging. The sensor system design and manufacture is also compatible with the integration of wireless RF telemetry, for power and data retrieval, all within a 3 mm × 3 mm × 0.3 mm footprint. The piezoresistive elements are integrated within a textured surface to enhance sensor integration with bone. Finite element analysis led to a sensor design for normal and shear stress detection. A wired sensor was fabricated in the Jazz 0.35 µm BiCMOS process and then embedded in mock bone material to characterize its response to tensile and bending loads up to 250 kPa.
Micro-Raman Analysis of Irradiated Diamond Films
NASA Technical Reports Server (NTRS)
Newton, R. L.; Munafo, Paul M. (Technical Monitor)
2002-01-01
Owing to its unique and robust physical properties, diamond is a much sought after material for use in advanced technologies such as Microelectromechanical Systems (MEMS). The volume and weight savings promised by MEMS-based devices are of particular interest to spaceflight applications. However, much basic materials science research remains to be completed in this field. Results of micro-Raman analysis of proton (1015 - 1017 H+/cm2 doses) irradiated chemical vapor deposited (CVD) diamond reveals that the microstructure is retained even after high radiation exposure.
New technologies for the actuation and controls of large aperture lightweight quality mirrors
NASA Technical Reports Server (NTRS)
Lih, S. S.; Yang, E. H.; Gullapalli, S. N.; Flood, R.
2003-01-01
This paper presents a set of candidate components: MEMS based large stroke (>100 microns) ultra lightweight (0.01 gm) discrete inch worm actuator technology, and a distributed actuator technology, in the context of a novel lightweight active flexure-hinged substrate concept that uses the nanolaminate face sheet.
2007-03-28
Photos for Web Feature by Victoria (Tori) Woods; Micro-Electro Mechanical Systems (MEMS) using vacuum technology; fabricating High Temperature Electronics for Harsh Environments using silicon carbide substrates
MEMS-based platforms for mechanical manipulation and characterization of cells
NASA Astrophysics Data System (ADS)
Pan, Peng; Wang, Wenhui; Ru, Changhai; Sun, Yu; Liu, Xinyu
2017-12-01
Mechanical manipulation and characterization of single cells are important experimental techniques in biological and medical research. Because of the microscale sizes and highly fragile structures of cells, conventional cell manipulation and characterization techniques are not accurate and/or efficient enough or even cannot meet the more and more demanding needs in different types of cell-based studies. To this end, novel microelectromechanical systems (MEMS)-based technologies have been developed to improve the accuracy, efficiency, and consistency of various cell manipulation and characterization tasks, and enable new types of cell research. This article summarizes existing MEMS-based platforms developed for cell mechanical manipulation and characterization, highlights their specific design considerations making them suitable for their designated tasks, and discuss their advantages and limitations. In closing, an outlook into future trends is also provided.
Internal Model-Based Robust Tracking Control Design for the MEMS Electromagnetic Micromirror.
Tan, Jiazheng; Sun, Weijie; Yeow, John T W
2017-05-26
The micromirror based on micro-electro-mechanical systems (MEMS) technology is widely employed in different areas, such as scanning, imaging and optical switching. This paper studies the MEMS electromagnetic micromirror for scanning or imaging application. In these application scenarios, the micromirror is required to track the command sinusoidal signal, which can be converted to an output regulation problem theoretically. In this paper, based on the internal model principle, the output regulation problem is solved by designing a robust controller that is able to force the micromirror to track the command signal accurately. The proposed controller relies little on the accuracy of the model. Further, the proposed controller is implemented, and its effectiveness is examined by experiments. The experimental results demonstrate that the performance of the proposed controller is satisfying.
Internal Model-Based Robust Tracking Control Design for the MEMS Electromagnetic Micromirror
Tan, Jiazheng; Sun, Weijie; Yeow, John T. W.
2017-01-01
The micromirror based on micro-electro-mechanical systems (MEMS) technology is widely employed in different areas, such as scanning, imaging and optical switching. This paper studies the MEMS electromagnetic micromirror for scanning or imaging application. In these application scenarios, the micromirror is required to track the command sinusoidal signal, which can be converted to an output regulation problem theoretically. In this paper, based on the internal model principle, the output regulation problem is solved by designing a robust controller that is able to force the micromirror to track the command signal accurately. The proposed controller relies little on the accuracy of the model. Further, the proposed controller is implemented, and its effectiveness is examined by experiments. The experimental results demonstrate that the performance of the proposed controller is satisfying. PMID:28587105
Dynamic focus-tracking MEMS scanning micromirror with low actuation voltages for endoscopic imaging.
Strathman, Matthew; Liu, Yunbo; Li, Xingde; Lin, Lih Y
2013-10-07
We demonstrate a 3-D scanning micromirror device that combines 2-D beam scanning with focus control in the same device using micro-electro-mechanical-systems (MEMS) technology. 2-D beam scanning is achieved with a biaxial gimbal structure and focus control is obtained with a deformable mirror membrane surface. The micromirror with 800 micrometer diameter is designed to be sufficiently compact and efficient so that it can be incorporated into an endoscopic imaging probe in the future. The design, fabrication and characterization of the device are described in this paper. Using the focus-tracking MEMS scanning mirror, we achieved an optical scanning range of >16 degrees with <40 V actuation voltage at resonance and a tunable focal length between infinity and 25 mm with <100V applied bias.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Grau, Mario, E-mail: mario.grau@hs-rm.de; Völklein, Friedemann; Meier, Andreas
A method for measuring the thermal accommodation coefficient α for surface-/gas interfaces is presented. It allows the determination of α for thin films produced by a variety of deposition technologies, such as chemical vapor deposition, physical vapor deposition, and atomic layer deposition (ALD). The setup is based on two microelectromechanical systems (MEMS) Pirani sensors facing each other in a defined positioning. Because these MEMS sensors show a very high sensitivity in their individual molecular flow regimes, it is possible to measure the accommodation coefficients of gases without the disturbing influence of the transition regime. This paper presents the analytical backgroundmore » and the actual measurement principle. The results for air and nitrogen molecules on sputtered Au and Pt surfaces are presented.« less
MEMS Microshutter Arrays for James Webb Space Telescope
NASA Technical Reports Server (NTRS)
Li, Mary J.; Beamesderfer, Michael; Babu, Sachi; Bajikar, Sateesh; Ewin, Audrey; Franz, Dave; Hess, Larry; Hu, Ron; Jhabvala, Murzy; Kelly, Dan;
2006-01-01
MEMS microshutter arrays are being developed at NASA Goddard Space Flight Center for use as an aperture array for a Near-Infrared Spectrometer (NirSpec). The instruments will be carried on the James Webb Space Telescope (JWST), the next generation of space telescope after Hubble Space Telescope retires. The microshutter arrays are designed for the selective transmission of light with high efficiency and high contrast, Arrays are close-packed silicon nitride membranes with a pixel size of 100x200 microns. Individual shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. Light shields are made on to each shutter for light leak prevention so to enhance optical contrast, Shutters are actuated magnetically, latched and addressed electrostatically. The shutter arrays are fabricated using MEMS technologies.
NASA Astrophysics Data System (ADS)
Goshi, Noah; Castagnola, Elisa; Vomero, Maria; Gueli, Calogero; Cea, Claudia; Zucchini, Elena; Bjanes, David; Maggiolini, Emma; Moritz, Chet; Kassegne, Sam; Ricci, Davide; Fadiga, Luciano
2018-06-01
We report on a novel technology for microfabricating 3D origami-styled micro electro-mechanical systems (MEMS) structures with glassy carbon (GC) features and a supporting polymer substrate. GC MEMS devices that open to form 3D microstructures are microfabricated from GC patterns that are made through pyrolysis of polymer precursors on high-temperature resisting substrates like silicon or quartz and then transferring the patterned devices to a flexible substrate like polyimide followed by deposition of an insulation layer. The devices on flexible substrate are then folded into 3D form in an origami-fashion. These 3D MEMS devices have tunable mechanical properties that are achieved by selectively varying the thickness of the polymeric substrate and insulation layers at any desired location. This technology opens new possibilities by enabling microfabrication of a variety of 3D GC MEMS structures suited to applications ranging from biochemical sensing to implantable microelectrode arrays. As a demonstration of the technology, a neural signal recording microelectrode array platform that integrates both surface (cortical) and depth (intracortical) GC microelectrodes onto a single flexible thin-film device is introduced. When the device is unfurled, a pre-shaped shank of polyimide automatically comes off the substrate and forms the penetrating part of the device in a 3D fashion. With the advantage of being highly reproducible and batch-fabricated, the device introduced here allows for simultaneous recording of electrophysiological signals from both the brain surface (electrocorticography—ECoG) and depth (single neuron). Our device, therefore, has the potential to elucidate the roles of underlying neurons on the different components of µECoG signals. For in vivo validation of the design capabilities, the recording sites are coated with a poly(3,4-ethylenedioxythiophene)—polystyrene sulfonate—carbon nanotube composite, to improve the electrical conductivity of the electrodes and consequently the quality of the recorded signals. Results show that both µECoG and intracortical arrays were able to acquire neural signals with high-sensitivity that increased with depth, thereby verifying the device functionality.
NASA Astrophysics Data System (ADS)
Livermore, C.; Velásquez-García, L. F.
2015-12-01
Greetings, and welcome to Boston, MA and PowerMEMS 2015 - the 15th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications! The objective of PowerMEMS 2015 is to catalyze innovation in micro- and nano-scale technologies for the energy domain. The scope of the meeting ranges from basic principles, to materials and fabrication, to devices and systems, to applications. The many applications of Power MEMS range from the harvesting, storage, conversion and conditioning of energy, to integrated systems that manage these processes, to actuation, pumping, and propulsion. Our Conference aims to stimulate the exchange of insights and information, as well as the development of new ideas, in the Power MEMS field. Our goal is to allow the attendees to interact and network within our multidisciplinary community that includes professionals from many branches of science and engineering, as well as energy, policy, and entrepreneurial specialists interested in the commercialization of Power MEMS technologies. Since the first PowerMEMS in Sendai, Japan in 2000, the Conference has grown in size, reputation, impact, and technical breadth. This continuing growth is evident in this year's technical program, which includes an increasing number of papers on nanomaterials, additive manufacturing for energy systems, actuators, energy storage, harvesting strategies and integrated energy harvesting systems, for example. This year's technical program is highlighted by six plenary talks from prominent experts on piezoelectrics, robotic insects, thermoelectrics, photovoltaics, nanocomposite cathodes, and thermal energy conversion systems. The contributed program received a large number of abstract submissions this year, 169 in total. After careful review by the 34-member Technical Program Committee, a total of 135 papers were selected for presentation. The 60 contributed oral presentations are arranged in two parallel sessions. The 75 posters are arranged in a ''two-in-one'' poster session in which the poster session time is divided in two; half the posters will be presented during each half-session, allowing the poster presenters to also browse the posters during the poster session. Posters will remain up during the meeting, so please feel free to peruse them at your leisure. The Proceedings will be visible and accessible through IOP after conclusion of the Conference. We hope to maximize interaction among participants and stimulate lively discussion through the technical program and social events. For the first time at the Conference, a great many sponsors are making their presence known at PowerMEMS through tabletop displays, which will catalyze engaging conversations between our industrial partners and the research community. Also, for the first time at PowerMEMS, we will host a Rump Session - an informal event in which Conference participants engage in honest and fun discussions of topics of relevance to the community while strengthening bonds within the community. This meeting is made possible by many generous contributions of time, effort, and financial support. Thanks are due to the Technical Program Committee for their intensive efforts in reviewing abstract submissions, and to the International Steering Committee for their advice and support. We are grateful to Preferred Meeting Management Inc. for their many and key contributions to the management and organization of our Conference. Finally, we gratefully acknowledge the organizational and financial support provided for this meeting by the Transducers Research Foundation, Northeastern University, the Massachusetts Institute of Technology, and our exhibitors and other supporters. We hope that you find our Conference enjoyable and fruitful, and that you enjoy your stay in the Boston, MA area.
Nanotwinned metal MEMS films with unprecedented strength and stability
Sim, Gi-Dong; Krogstad, Jessica A.; Reddy, K. Madhav; Xie, Kelvin Y.; Valentino, Gianna M.; Weihs, Timothy P.; Hemker, Kevin J.
2017-01-01
Silicon-based microelectromechanical systems (MEMS) sensors have become ubiquitous in consumer-based products, but realization of an interconnected network of MEMS devices that allows components to be remotely monitored and controlled, a concept often described as the “Internet of Things,” will require a suite of MEMS materials and properties that are not currently available. We report on the synthesis of metallic nickel-molybdenum-tungsten films with direct current sputter deposition, which results in fully dense crystallographically textured films that are filled with nanotwins. These films exhibit linear elastic mechanical behavior and tensile strengths exceeding 3 GPa, which is unprecedented for materials that are compatible with wafer-level device fabrication processes. The ultrahigh strength is attributed to a combination of solid solution strengthening and the presence of dense nanotwins. These films also have excellent thermal and mechanical stability, high density, and electrical properties that are attractive for next-generation metal MEMS applications. PMID:28782015
The MEMS Knudsen Compressor as a Vacuum Pump for Space Exploration Applications
NASA Technical Reports Server (NTRS)
Vargo, S. E.; Muntz, E. P.; Tang, W. C.
2000-01-01
Several lander, probe and rover missions currently under study at the Jet Propulsion Laboratory (JPL) and especially in the Microdevices Laboratory (MDL) Center for Space Microelectronics Technology, focus on utilizing microelectromechanical systems (MEMS) based instruments for science data gathering. These small instruments and NASA's commitment to "faster, better, cheaper" type missions has brought about the need for novel approaches to satisfying mission requirements. Existing in-situ instrument systems clearly lack novel and integrated methods for satisfying their vacuum needs. One attractive candidate for a MEMS vacuum pump is the Knudsen Compressor, which operates based on thermal transpiration. Thermal transpiration describes gas flows induced by temperature differences maintained across orifices, porous membranes or capillary tubes under rarefied conditions. This device has two overwhelmingly attractive features as a MEMS vacuum pump - no moving parts and no fluids. An initial estimate of a Knudsen Compressor's pumping power requirements for a surface atmospheric sampling task on Mars is less than 80 mW, significantly below than alternative pumps. Due to the relatively low energy use for this task and the applicability of the Knudsen Compressor to other applications, the development of a Knudsen Compressor utilizing MEMS fabrication techniques has been initiated. This paper discusses the initial fabrication of a single-stage MEMS Knudsen Compressor vacuum pump, provides performance criteria such as pumping speed, size, energy use and ultimate pressure and details vacuum pump applications in several MDL related in-situ instruments.
Factors Influencing Teachers' Technology Self-Efficacy: A Case Study
ERIC Educational Resources Information Center
Farah, Amy Caroline
2012-01-01
Factors influencing teachers' levels of technology self-efficacy were examined through a qualitative multi-site, multi-subject case study research design. An initial survey was administered to all full-time, certified teachers at three school sites in order to gauge teachers' current level of technology self-efficacy. From that…
UAV-borne lidar with MEMS mirror-based scanning capability
NASA Astrophysics Data System (ADS)
Kasturi, Abhishek; Milanovic, Veljko; Atwood, Bryan H.; Yang, James
2016-05-01
Firstly, we demonstrated a wirelessly controlled MEMS scan module with imaging and laser tracking capability which can be mounted and flown on a small UAV quadcopter. The MEMS scan module was reduced down to a small volume of <90mm x 60mm x 40mm, weighing less than 40g and consuming less than 750mW of power using a ~5mW laser. This MEMS scan module was controlled by a smartphone via Bluetooth while flying on a drone, and could project vector content, text, and perform laser based tracking. Also, a "point-and-range" LiDAR module was developed for UAV applications based on low SWaP (Size, Weight and Power) gimbal-less MEMS mirror beam-steering technology and off-the-shelf OEM LRF modules. For demonstration purposes of an integrated laser range finder module, we used a simple off-the-shelf OEM laser range finder (LRF) with a 100m range, +/-1.5mm accuracy, and 4Hz ranging capability. The LRFs receiver optics were modified to accept 20° of angle, matching the transmitter's FoR. A relatively large (5.0mm) diameter MEMS mirror with +/-10° optical scanning angle was utilized in the demonstration to maintain the small beam divergence of the module. The complete LiDAR prototype can fit into a small volume of <70mm x 60mm x 60mm, and weigh <50g when powered by the UAV's battery. The MEMS mirror based LiDAR system allows for ondemand ranging of points or areas within the FoR without altering the UAV's position. Increasing the LRF ranging frequency and stabilizing the pointing of the laser beam by utilizing the onboard inertial sensors and the camera are additional goals of the next design.
Benefits of combined GPS/GLONASS with low-cost MEMS IMUs for vehicular urban navigation.
Angrisano, Antonio; Petovello, Mark; Pugliano, Giovanni
2012-01-01
The integration of Global Navigation Satellite Systems (GNSS) with Inertial Navigation Systems (INS) has been very actively researched for many years due to the complementary nature of the two systems. In particular, during the last few years the integration with micro-electromechanical system (MEMS) inertial measurement units (IMUs) has been investigated. In fact, recent advances in MEMS technology have made possible the development of a new generation of low cost inertial sensors characterized by small size and light weight, which represents an attractive option for mass-market applications such as vehicular and pedestrian navigation. However, whereas there has been much interest in the integration of GPS with a MEMS-based INS, few research studies have been conducted on expanding this application to the revitalized GLONASS system. This paper looks at the benefits of adding GLONASS to existing GPS/INS(MEMS) systems using loose and tight integration strategies. The relative benefits of various constraints are also assessed. Results show that when satellite visibility is poor (approximately 50% solution availability) the benefits of GLONASS are only seen with tight integration algorithms. For more benign environments, a loosely coupled GPS/GLONASS/INS system offers performance comparable to that of a tightly coupled GPS/INS system, but with reduced complexity and development time.
A MEMS Condenser Microphone-Based Intracochlear Acoustic Receiver.
Pfiffner, Flurin; Prochazka, Lukas; Peus, Dominik; Dobrev, Ivo; Dalbert, Adrian; Sim, Jae Hoon; Kesterke, Rahel; Walraevens, Joris; Harris, Francesca; Roosli, Christof; Obrist, Dominik; Huber, Alexander
2017-10-01
Intracochlear sound pressure (ICSP) measurements are limited by the small dimensions of the human inner ear and the requirements imposed by the liquid medium. A robust intracochlear acoustic receiver (ICAR) for repeated use with a simple data acquisition system that provides the required high sensitivity and small dimensions does not yet exist. The work described in this report aims to fill this gap and presents a new microelectromechanical systems (MEMS) condenser microphone (CMIC)-based ICAR concept suitable for ICSP measurements in human temporal bones. The ICAR head consisted of a passive protective diaphragm (PD) sealing the MEMS CMIC against the liquid medium, enabling insertion into the inner ear. The components of the MEMS CMIC-based ICAR were expressed by a lumped element model (LEM) and compared to the performance of successfully fabricated ICARs. Good agreement was achieved between the LEM and the measurements with different sizes of the PD. The ICSP measurements in a human cadaver temporal bone yielded data in agreement with the literature. Our results confirm that the presented MEMS CMIC-based ICAR is a promising technology for measuring ICSP in human temporal bones in the audible frequency range. A sensor for evaluation of the biomechanical hearing process by quantification of ICSP is presented. The concept has potential as an acoustic receiver in totally implantable cochlear implants.
Goodman, Shawn S; Keefe, Douglas H
2006-06-01
Otoacoustic emissions serve as a noninvasive probe of the medial olivocochlear (MOC) reflex. Stimulus frequency otoacoustic emissions (SFOAEs) elicited by a low-level probe tone may be the optimal type of emission for studying MOC effects because at low levels, the probe itself does not elicit the MOC reflex [Guinan et al. (2003) J. Assoc. Res. Otolaryngol. 4:521]. Based on anatomical considerations, the MOC reflex activated by ipsilateral acoustic stimulation (mediated by the crossed olivocochlear bundle) is predicted to be stronger than the reflex to contralateral stimulation. Broadband noise is an effective activator of the MOC reflex; however, it is also an effective activator of the middle-ear muscle (MEM) reflex, which can make results difficult to interpret. The MEM reflex may be activated at lower levels than measured clinically, and most previous human studies have not explicitly included measurements to rule out MEM reflex contamination. The current study addressed these issues using a higher-frequency SFOAE probe tone to test for cochlear changes mediated by the MOC reflex, while simultaneously monitoring the MEM reflex using a low-frequency probe tone. Broadband notched noise was presented ipsilaterally at various levels to elicit probe-tone shifts. Measurements are reported for 15 normal-hearing subjects. With the higher-frequency probe near 1.5 kHz, only 20% of subjects showed shifts consistent with an MOC reflex in the absence of an MEM-induced shift. With the higher-frequency probe near 3.5 kHz, up to 40% of subjects showed shifts in the absence of an MEM-induced shift. However, these responses had longer time courses than expected for MOC-induced shifts, and may have been dominated by other cochlear processes, rather than MOC reflex. These results suggest caution in the interpretation of effects observed using ipsilaterally presented acoustic activators intended to excite the MOC reflex.
Multi-Dimensional Sensors and Sensing Systems
NASA Technical Reports Server (NTRS)
Stetter, Joseph R. (Inventor); Shirke, Amol G. (Inventor)
2014-01-01
A universal microelectromechanical (MEMS) nano-sensor platform having a substrate and conductive layer deposited in a pattern on the surface to make several devices at the same time, a patterned insulation layer, wherein the insulation layer is configured to expose one or more portions of the conductive layer, and one or more functionalization layers deposited on the exposed portions of the conductive layer to make multiple sensing capability on a single MEMS fabricated device. The functionalization layers are adapted to provide one or more transducer sensor classes selected from the group consisting of: radiant, electrochemical, electronic, mechanical, magnetic, and thermal sensors for chemical and physical variables and producing more than one type of sensor for one or more significant parameters that need to be monitored.
Design and Evaluation of a Scalable and Reconfigurable Multi-Platform System for Acoustic Imaging
Izquierdo, Alberto; Villacorta, Juan José; del Val Puente, Lara; Suárez, Luis
2016-01-01
This paper proposes a scalable and multi-platform framework for signal acquisition and processing, which allows for the generation of acoustic images using planar arrays of MEMS (Micro-Electro-Mechanical Systems) microphones with low development and deployment costs. Acoustic characterization of MEMS sensors was performed, and the beam pattern of a module, based on an 8 × 8 planar array and of several clusters of modules, was obtained. A flexible framework, formed by an FPGA, an embedded processor, a computer desktop, and a graphic processing unit, was defined. The processing times of the algorithms used to obtain the acoustic images, including signal processing and wideband beamforming via FFT, were evaluated in each subsystem of the framework. Based on this analysis, three frameworks are proposed, defined by the specific subsystems used and the algorithms shared. Finally, a set of acoustic images obtained from sound reflected from a person are presented as a case study in the field of biometric identification. These results reveal the feasibility of the proposed system. PMID:27727174
NASA Astrophysics Data System (ADS)
Yamada, Shooji; Yamaguchi, Hiroshi; Ishihara, Sunao
2009-06-01
Microelectromechanical systems (MEMS) are widely used small electromechanical systems made of micrometre-sized components. Presently, we are witnessing a transition from MEMS to nanoelectromechanical systems (NEMS), which comprise devices integrating electrical and mechanical functionality on the nanoscale and offer new exciting applications. Similarly to MEMS, NEMS typically include a central transistor-like nanoelectronic unit for data processing, as well as mechanical actuators, pumps, and motors; and they may combine with physical, biological and chemical sensors. In the transition from MEMS to NEMS, component sizes need to be reduced. Therefore, many fabrication methods previously developed for MEMS are unsuitable for the production of high-precision NEMS components. The key challenge in NEMS is therefore the development of new methods for routine and reproducible nanofabrication. Two complementary types of method for NEMS fabrication are available: 'top-down' and 'bottom-up'. The top-down approach uses traditional lithography technologies, whereas bottom-up techniques include molecular self-organization, self-assembly and nanodeposition. The NT2008 conference, held at Ishikawa High-Tech Conference Center, Ishikawa, Japan, between 23-25 October 2008, focused on novel NEMS fabricated from new materials and on process technologies. The topics included compound semiconductors, small mechanical structures, nanostructures for micro-fluid and bio-sensors, bio-hybrid micro-machines, as well as their design and simulation. This focus issue compiles seven articles selected from 13 submitted manuscripts. The articles by Prinz et al and Kehrbusch et al introduce the frontiers of the top-down production of various operational NEMS devices, and Kometani et al present an example of the bottom-up approach, namely ion-beam induced deposition of MEMS and NEMS. The remaining articles report novel technologies for biological sensors. Taira et al have used manganese nanoparticles to improve the chemical analysis of biological samples by laser desorption/ionization mass spectrometry. Matsumoto et al have prepared sugar microarrays via click chemistry and have applied this to the detection and characterization of proteins. Yoshimura et al have expanded the single-nucleotide polymorphism typing method to differentiate genes from various food crops, such as indica and japonica rice. Finally, Takashi et al have designed a nanoparticle-based strip sensor, which can be used for rapid evaluation of the psychological condition of animals and humans. We hope that this focus issue will help readers to understand, from a materials science viewpoint, different aspects of frontier research into NEMS.
van Witteloostuijn, Arjen
2018-01-01
In this paper, we develop an ecological, multi-level model that can be used to study the evolution of emerging technology. More specifically, by defining technology as a system composed of a set of interacting components, we can build upon the argument of multi-level density dependence from organizational ecology to develop a distribution-independent model of technological evolution. This allows us to distinguish between different stages of component development, which provides more insight into the emergence of stable component configurations, or dominant designs. We validate our hypotheses in the biotechnology industry by using patent data from the USPTO from 1976 to 2003. PMID:29795575
Microsystems: from technologies to products
NASA Astrophysics Data System (ADS)
Ryser, Peter
2003-10-01
In this paper, we outline the process leading from technologies to successful products in the MEMS (Microelectromechanical Systems) and MST (Microsystems Technology) field. The development of new products involves a lot of factors, such as mature technologies, interdisciplinary team, identifying the right business potential and long term oriented investors. The paper summarizes a survey of different technologies and point out that packaging, test and calibration are still major shortcomings for the concerned industries.
Radioistopes to Solar to High Energy Accelerators - Chip-Scale Energy Sources
NASA Astrophysics Data System (ADS)
Lal, Amit
2013-12-01
This talk will present MEMS based power sources that utilize radioisotopes, solar energy, and potentially nuclear energy through advancements in integration of new structures and materials within MEMS. Micro power harvesters can harness power from vibration, radioisotopes, light, sound, and biology may provide pathways to minimize or even eliminate batteries in sensor nodes. In this talk work on radioisotope thin films for MEMS will be include the self-reciprocating cantilever, betavoltaic cells, and high DC voltages. The self-reciprocating cantilever energy harvester allows small commercially viable amounts of radioisotopes to generate mW to Watts of power so that very reliable power sources that last 100s of years are possible. The tradeoffs between reliability and potential stigma with radioisotopes allow one to span a useful design space with reliability as a key parameter. These power sources provide pulsed power at three different time scales using mechanical, RF, and static extraction of energy from collected charge. Multi-use capability, both harvesting radioisotope power and local vibration energy extends the reliability of micro-power sources further.
Fabrication of Quench Condensed Thin Films Using an Integrated MEMS Fab on a Chip
NASA Astrophysics Data System (ADS)
Lally, Richard; Reeves, Jeremy; Stark, Thomas; Barrett, Lawrence; Bishop, David
Atomic calligraphy is a microelectromechanical systems (MEMS)-based dynamic stencil nanolithography technique. Integrating MEMS devices into a bonded stacked array of three die provides a unique platform for conducting quench condensed thin film mesoscopic experiments. The atomic calligraphy Fab on a Chip process incorporates metal film sources, electrostatic comb driven stencil plate, mass sensor, temperature sensor, and target surface into one multi-die assembly. Three separate die are created using the PolyMUMPs process and are flip-chip bonded together. A die containing joule heated sources must be prepared with metal for evaporation prior to assembly. A backside etch of the middle/central die exposes the moveable stencil plate allowing the flux to pass through the stencil from the source die to the target die. The chip assembly is mounted in a cryogenic system at ultra-high vacuum for depositing extremely thin films down to single layers of atoms across targeted electrodes. Experiments such as the effect of thin film alloys or added impurities on their superconductivity can be measured in situ with this process.
On the measurement of stationary electric fields in air
NASA Technical Reports Server (NTRS)
Kirkham, H.
2002-01-01
Applications and measurement methods for field measurements are reviewed. Recent developments using optical technology are examined. The various methods are compared. It is concluded that the best general purpose instrument is the isolated cylindrical field mill, but MEMS technology could furnish better instruments in the future.
Shaker, Mohamed A; Shaaban, Mona I
2017-06-15
Despite the fact that carbapenems (powerful β-lactams antibiotics) were able to fight serious infectious diseases, nowadays the spread of carbapenems-resistant bacteria is considered the main challenge in antibacterial therapy. In this study, we focused on evaluating the surface conjugation of carbapenems (imipenem and meropenem) with gold nanoparticles as a delivering strategy to specifically and safely maximize their therapeutic efficacy while destroying the developing resistance of the pathogens. Different particle size formulae (35, 70 and 200nm) were prepared by citrate reduction method. The prepared nanoparticles were functionalized with imipenem (Ipm) or meropenem (Mem) and physico-chemically characterized for loading efficiency, particle size, morphology, and in-vitro release. The antibacterial efficacy was also evaluated against carbapenems resistant Gram-negative bacteria isolated from infected human, through measuring the minimum inhibitory concentration and antibiotic kill test. All the obtained gold nanoparticles showed a distinct nano-size with loading efficiency up to 72% and 74% for Ipm and Mem, respectively. The conjugation and physico-chemical stability of the formulated carbapenems were confirmed by FTIR and X-RPD. Diffusion driven release behavior was observed for both Ipm and Mem from all of the loaded gold nanoparticles. For both Ipm and Mem, formula with 35nm diameter showed the most significant enhancement in antibacterial activity against all the selected isolates including Klebsiella pneumoniae, Proteus mirabilis and Acinteobacter baumanii. Ipm loaded Gold nanoparticles demonstrated decrease in the MIC of Ipm down to four folds, whereas, Mem loaded gold nanoparticles showed decrease in the MIC of Mem down to three folds on the tested bacterial isolates. Based on these results, the formulation of carbapenems-loaded gold nanoparticles demonstrated to be a promising nano-size delivery vehicle for improving the therapeutic activity and destroying the bacterial resistance for carbapenems. Copyright © 2017 Elsevier B.V. All rights reserved.
NASA Astrophysics Data System (ADS)
Zhang, Guojun; Ding, Junwen; Xu, Wei; Liu, Yuan; Wang, Renxin; Han, Janjun; Bai, Bing; Xue, Chenyang; Liu, Jun; Zhang, Wendong
2018-05-01
A micro hydrophone based on piezoresistive effect, "MEMS vector hydrophone" was developed for acoustic detection application. To improve the sensitivity of MEMS vector hydrophone at low frequency, we reported a stress centralized MEMS vector hydrophone (SCVH) mainly used in 20-500 Hz. Stress concentration area was actualized in sensitive unit of hydrophone by silicon micromachining technology. Then piezoresistors were placed in stress concentration area for better mechanical response, thereby obtaining higher sensitivity. Static analysis was done to compare the mechanical response of three different sensitive microstructure: SCVH, conventional micro-silicon four-beam vector hydrophone (CFVH) and Lollipop-shaped vector hydrophone (LVH) respectively. And fluid-structure interaction (FSI) was used to analyze the natural frequency of SCVH for ensuring the measurable bandwidth. Eventually, the calibration experiment in standing wave field was done to test the property of SCVH and verify the accuracy of simulation. The results show that the sensitivity of SCVH has nearly increased by 17.2 dB in contrast to CFVH and 7.6 dB in contrast to LVH during 20-500 Hz.
NASA Astrophysics Data System (ADS)
Su, Y.; Ong, E. T.; Lee, K. H.
2002-05-01
The past decade has seen an accelerated growth of technology in the field of microelectromechanical systems (MEMS). The development of MEMS products has generated the need for efficient analytical and simulation methods for minimizing the requirement for actual prototyping. The boundary element method is widely used in the electrostatic analysis for MEMS devices. However, singular elements are needed to accurately capture the behavior at singular regions, such as sharp corners and edges, where standard elements fail to give an accurate result. The manual classification of boundary elements based on their singularity conditions is an immensely laborious task, especially when the boundary element model is large. This process can be automated by querying the geometric model of the MEMS device for convex edges based on geometric information of the model. The associated nodes of the boundary elements on these edges can then be retrieved. The whole process is implemented in the MSC/PATRAN platform using the Patran Command Language (the source code is available as supplementary data in the electronic version of this journal issue).
Improved contact resistance stability in a MEMS separable electrical connector
NASA Astrophysics Data System (ADS)
Larsson, M. P.
2005-12-01
A MEMS in-line separable electrical connector with improved contact resistance stability to thermal fluctuations and mating cycles is described. The design allows sliding, in-line connection between separate halves, inducing vertical deflections on a set of flexible conductors to establish stable electrical contacts. Features are present on both halves to ensure precise lateral and vertical self-alignment; preventing shorts and maintaining consistent conductor deflections. Characterisation on early prototypes revealed significant variability in contact resistance with thermal fluctuations and mating cycle history. As flexible conductors are multi-layered structures of Au supported by a thick structural layer of Ni, they undergo differential thermal expansion, introducing variability in contact resistance with temperature. Sliding contact wear during repeated mating leads to removal of portions of the Au surface coating, and electrical contact between underlying (non-noble) Ni layers. By using a harder Co-Au alloy as the contact surface layer and modifying the arrangement of constituent conductor layers to balance thermal stresses, improvements to both wear and thermal tolerance of contact resistance can be obtained. Devices implementing the above design modifications show stable contact resistance over 100 mating cycles and an increase in contact resistance of between 3.5 and 7% over a temperature rise of 60°C. The electrical performance improvements increase the attractiveness of the MEMS in-line separable connector concept for applications in portable electronics and MEMS integration.
ZnO on nickel RF micromechanical resonators for monolithic wireless communication applications
NASA Astrophysics Data System (ADS)
Wei, Mian; Avila, Adrian; Rivera, Ivan; Baghelani, Masoud; Wang, Jing
2017-05-01
On-chip integrability of high-Q RF passives alongside CMOS transistors is crucial for the implementation of monolithic radio transceivers. One of the most significant bottlenecks in back-end-of-line (BEoL) integration of MEMS devices on CMOS processed wafers is their relatively low thermal budget, which is less than that required for typical MEMS material deposition processes. This paper investigates electroplated nickel as a structural material for piezoelectrically-transduced resonators to demonstrate ZnO-on-nickel resonators with a CMOS-compatible low temperature process for the first time. Aside from the obvious manufacturing cost benefit, electroplated nickel is a reasonable substitute for polycrystalline or single crystal silicon and thin-film microcrystalline diamond device layers, while realizing decent acoustic velocity and moderate Q. Electroplated nickel has been already adopted by MEMSCAP, a multi-user MEMS process foundry, in its MetalMUMPs process. Furthermore, it is observed that a localized annealing process through Joule heating can be exploited to significantly improve the effective mechanical quality factor for the ZnO-on-nickel resonators, which is still lower than the reported AlN resonators. This work demonstrates ZnO-on-nickel piezoelectrically-actuated MEMS resonators and resonator arrays by using an IC compatible low temperature process. There is room for performance improvement by lowering the acoustic energy losses in the ZnO and nickel layers.
EDITORIAL: MEMS in biology and medicine MEMS in biology and medicine
NASA Astrophysics Data System (ADS)
Pruitt, Beth L.; Herr, Amy E.
2011-05-01
Stimulating—the first word that springs to mind regarding the emerging and expanding role of MEMS in biological inquiry. When invited to guest-edit this special issue on 'MEMS in biology and medicine' for JMM, we jumped at the opportunity. Partly owing to the breadth of the stimulating research in this nascent area and partly owing to the stimulating of biological function made possible with MEMS accessible length and time scales, we were eager to assemble manuscripts detailing some of the most cutting edge biological research being conducted around the globe. In addition to cutting edge engineering, this special issue features challenging biological questions addressed with innovative MEMS technologies. Topics span from Yetisen and colleagues' inquiry into quantifying pollen tube behaviour in response to pistil tissues [1] to Morimoto and colleagues' engineering efforts to produce monodisperse droplets capable of encapsulating single cells (without surface modification) [2]. Questions are bold, including a means to achieve therapeutically-relevant scaling for enrichment of leukocytes from blood (Inglis et al [3]), assessing the dependence of Escherichia coli biofilm formation on bacterial signalling (Meyer et al [4]), and elucidation of adhesion dynamics of circulating tumour cells (Cheung et al [5]) among others. Technologies are diverse, including microfabricated magnetic actuators (Lee et al [6]), stimuli-responsive polymer nanocomposites (Hess et al [7]), and SU-8 electrothermal microgrippers (Chu et al [8]) to name but a few. Contributing authors do indeed span a large swathe of the globe, with contributions from Australia, Italy, China, Canada, Denmark, Japan, the USA and numerous other locations. Collaboration finds a home here—with researchers from macromolecular science and electrical engineering collaborating with the Veterans Affairs Medical Center or neurosurgery researchers working with biological and electrical engineers. The questions posed by this generation of MEMS researchers encapsulate the mission of JMM to 'cover all aspects of microelectromechanical systems, devices and structures as well as micromechanics, microengineering and microfabrication' as the physics and chemical processes under study match the scales of the MEMS technologies now possible. As evidenced by the articles assembled in this issue, the combined maturation of both our biological model systems and our tools is driving a new paradigm in the formulation of biological hypotheses. The intersection of MEMS with cell biology is evidenced in reviews of both methods for applying microscale forces in biological environments by Zheng and Zhang [9] as well as the manipulation of biology through mechanical interactions by Rajagopalan and Saif [10]. Additionally, the potential for microfluidic platforms to miniaturize and improve for a diverse set of biological measurements and assays for medical diagnostics is further reviewed by Tentori and Herr [11]. We hope that you find, as we do, this special issue to be 'essential reading for all MEMS researchers' and perhaps even of technical interest to your life sciences colleagues. References [1] Yetisen A K et al 2011 J. Micromech. Microeng. 21 054018 [2] Morimoto Y et al 2011 J. Micromech. Microeng. 21 054031 [3] Inglis D W et al 2011 J. Micromech. Microeng. 21 054024 [4] Meyer M T et al 2011 J. Micromech. Microeng. 21 054023 [5] Cheung L S-L et al 2011 J. Micromech. Microeng. 21 054033 [6] Lee S A et al 2011 J. Micromech. Microeng. 21 054006 [7] Hess A E et al 2011 J. Micromech. Microeng. 21 054009 [8] Chu J et al 2011 J. Micromech. Microeng. 21 054030 [9] Zheng X R and Zhang X 2011 J. Micromech. Microeng. 21 054003 [10] Rajagopalan J and Saif M T A 2011 J. Micromech. Microeng. 21 054002 [11] Tentori A M and Herr A E 2011 J. Micromech. Microeng. 21 054001
Programmable solid state atom sources for nanofabrication.
Han, Han; Imboden, Matthias; Stark, Thomas; del Corro, Pablo G; Pardo, Flavio; Bolle, Cristian A; Lally, Richard W; Bishop, David J
2015-06-28
In this paper we discuss the development of a MEMS-based solid state atom source that can provide controllable atom deposition ranging over eight orders of magnitude, from ten atoms per square micron up to hundreds of atomic layers, on a target ∼1 mm away. Using a micron-scale silicon plate as a thermal evaporation source we demonstrate the deposition of indium, silver, gold, copper, iron, aluminum, lead and tin. Because of their small sizes and rapid thermal response times, pulse width modulation techniques are a powerful way to control the atomic flux. Pulsing the source with precise voltages and timing provides control in terms of when and how many atoms get deposited. By arranging many of these devices into an array, one has a multi-material, programmable solid state evaporation source. These micro atom sources are a complementary technology that can enhance the capability of a variety of nano-fabrication techniques.
The Laser MicroJet (LMJ): a multi-solution technology for high quality micro-machining
NASA Astrophysics Data System (ADS)
Mai, Tuan Anh; Richerzhagen, Bernold; Snowdon, Paul C.; Wood, David; Maropoulos, Paul G.
2007-02-01
The field of laser micromachining is highly diverse. There are many different types of lasers available in the market. Due to their differences in irradiating wavelength, output power and pulse characteristic they can be selected for different applications depending on material and feature size [1]. The main issues by using these lasers are heat damages, contamination and low ablation rates. This report examines on the application of the Laser MicroJet(R) (LMJ), a unique combination of a laser beam with a hair-thin water jet as a universal tool for micro-machining of MEMS substrates, as well as ferrous and non-ferrous materials. The materials include gallium arsenide (GaAs) & silicon wafers, steel, tantalum and alumina ceramic. A Nd:YAG laser operating at 1064 nm (infra red) and frequency doubled 532 nm (green) were employed for the micro-machining of these materials.
Study on film resistivity of Energy Conversion Components for MEMS Initiating Explosive Device
NASA Astrophysics Data System (ADS)
Ren, Wei; Zhang, Bin; Zhao, Yulong; Chu, Enyi; Yin, Ming; Li, Hui; Wang, Kexuan
2018-03-01
Resistivity of Plane-film Energy Conversion Components is a key parameter to influence its resistance and explosive performance, and also it has important relations with the preparation of thin film technology, scale, structure and etc. In order to improve the design of Energy Conversion Components for MEMS Initiating Explosive Device, and reduce the design deviation of Energy Conversion Components in microscale, guarantee the design resistance and ignition performance of MEMS Initiating Explosive Device, this paper theoretically analyzed the influence factors of film resistivity in microscale, through the preparation of Al film and Ni-Cr film at different thickness with micro/nano, then obtain the film resistivity parameter of the typical metal under different thickness, and reveals the effect rule of the scale to the resistivity in microscale, at the same time we obtain the corresponding inflection point data.
Differential wide temperature range CMOS interface circuit for capacitive MEMS pressure sensors.
Wang, Yucai; Chodavarapu, Vamsy P
2015-02-12
We describe a Complementary Metal-Oxide Semiconductor (CMOS) differential interface circuit for capacitive Micro-Electro-Mechanical Systems (MEMS) pressure sensors that is functional over a wide temperature range between -55 °C and 225 °C. The circuit is implemented using IBM 0.13 μm CMOS technology with 2.5 V power supply. A constant-gm biasing technique is used to mitigate performance degradation at high temperatures. The circuit offers the flexibility to interface with MEMS sensors with a wide range of the steady-state capacitance values from 0.5 pF to 10 pF. Simulation results show that the circuitry has excellent linearity and stability over the wide temperature range. Experimental results confirm that the temperature effects on the circuitry are small, with an overall linearity error around 2%.
Differential Wide Temperature Range CMOS Interface Circuit for Capacitive MEMS Pressure Sensors
Wang, Yucai; Chodavarapu, Vamsy P.
2015-01-01
We describe a Complementary Metal-Oxide Semiconductor (CMOS) differential interface circuit for capacitive Micro-Electro-Mechanical Systems (MEMS) pressure sensors that is functional over a wide temperature range between −55 °C and 225 °C. The circuit is implemented using IBM 0.13 μm CMOS technology with 2.5 V power supply. A constant-gm biasing technique is used to mitigate performance degradation at high temperatures. The circuit offers the flexibility to interface with MEMS sensors with a wide range of the steady-state capacitance values from 0.5 pF to 10 pF. Simulation results show that the circuitry has excellent linearity and stability over the wide temperature range. Experimental results confirm that the temperature effects on the circuitry are small, with an overall linearity error around 2%. PMID:25686312
Dynamic focus-tracking MEMS scanning micromirror with low actuation voltages for endoscopic imaging
Strathman, Matthew; Liu, Yunbo; Li, Xingde; Lin, Lih Y.
2013-01-01
We demonstrate a 3-D scanning micromirror device that combines 2-D beam scanning with focus control in the same device using micro-electro-mechanical-systems (MEMS) technology. 2-D beam scanning is achieved with a biaxial gimbal structure and focus control is obtained with a deformable mirror membrane surface. The micromirror with 800 micrometer diameter is designed to be sufficiently compact and efficient so that it can be incorporated into an endoscopic imaging probe in the future. The design, fabrication and characterization of the device are described in this paper. Using the focus-tracking MEMS scanning mirror, we achieved an optical scanning range of >16 degrees with <40 V actuation voltage at resonance and a tunable focal length between infinity and 25 mm with <100V applied bias. PMID:24104304
Large-area multiplexed sensing using MEMS and fiber optics
NASA Astrophysics Data System (ADS)
Miller, Michael B.; Clark, Richard L., Jr.; Bell, Clifton R.; Russler, Patrick M.
2000-06-01
Micro-electro-mechanical (MEMS) technology offers the ability to implement local and independent sensing and actuation functions through the coordinated response of discrete micro-electro-mechanical 'basis function' elements. The small size of micromechanical components coupled with the ability to reduce costs using volume manufacturing techniques opens up significant potential not only in military applications such as flight and engine monitoring and control, but in autonomous vehicle control, smart munitions, airborne reconnaissance, LADAR, missile guidance, and even in intelligent transportation systems and automotive guidance applications. In this program, Luna Innovations is developing a flexible, programmable interface which can be integrated direction with different types of MEMS sensors, and then used to multiplex many sensors ona single optical fiber to provide a unique combination of functions that will allow larger quantities of sensory input with better resolution than ever before possible.
NASA Astrophysics Data System (ADS)
Teves, André da Costa; Lima, Cícero Ribeiro de; Passaro, Angelo; Silva, Emílio Carlos Nelli
2017-03-01
Electrostatic or capacitive accelerometers are among the highest volume microelectromechanical systems (MEMS) products nowadays. The design of such devices is a complex task, since they depend on many performance requirements, which are often conflicting. Therefore, optimization techniques are often used in the design stage of these MEMS devices. Because of problems with reliability, the technology of MEMS is not yet well established. Thus, in this work, size optimization is combined with the reliability-based design optimization (RBDO) method to improve the performance of accelerometers. To account for uncertainties in the dimensions and material properties of these devices, the first order reliability method is applied to calculate the probabilities involved in the RBDO formulation. Practical examples of bulk-type capacitive accelerometer designs are presented and discussed to evaluate the potential of the implemented RBDO solver.
Micro-Raman Analysis of Irradiated Diamond Films
NASA Technical Reports Server (NTRS)
Newton, Robert L.
2003-01-01
Owing to its unique and robust physical properties, diamond is a much sought after material for use in advanced technologies, even in Microelectromechanical Systems (MEMS). The volume and weight savings promised by MEMS-based devices are of particular interest to spaceflight applications. However, much basic materials science research remains to be completed in this field. Results of micro-Raman analysis of proton (10(exp 15) - 10(exp 17) H(+)/sq cm doses) irradiated chemical vapor deposited (CVD) films are presented and indicate that their microstructure is retained even after high radiation exposure.
Radio Relays Improve Wireless Products
NASA Technical Reports Server (NTRS)
2009-01-01
Signal Hill, California-based XCOM Wireless Inc. developed radio frequency micromachine (RF MEMS) relays with a Phase II Small Business Innovation Research (SBIR) contract through NASA?s Jet Propulsion Laboratory. In order to improve satellite communication systems, XCOM produced wireless RF MEMS relays and tunable capacitors that use metal-to-metal contact and have the potential to outperform most semiconductor technologies while using less power. These relays are used in high-frequency test equipment and instrumentation, where increased speed can mean significant cost savings. Applications now also include mainstream wireless applications and greatly improved tactical radios.
Large optical 3D MEMS switches in access networks
NASA Astrophysics Data System (ADS)
Madamopoulos, Nicholas; Kaman, Volkan; Yuan, Shifu; Jerphagnon, Olivier; Helkey, Roger; Bowers, John E.
2007-09-01
Interest is high among residential customers and businesses for advanced, broadband services such as fast Internet access, electronic commerce, video-on-demand, digital broadcasting, teleconferencing and telemedicine. In order to satisfy such growing demand of end-customers, access technologies such as fiber-to-the-home/building (FTTH/B) are increasingly being deployed. Carriers can reduce maintenance costs, minimize technology obsolescence and introduce new services easily by reducing active elements in the fiber access network. However, having a passive optical network (PON) also introduces operational and maintenance challenges. Increased diagnostic monitoring capability of the network becomes a necessity as more and more fibers are provisioned to deliver services to the end-customers. This paper demonstrates the clear advantages that large 3D optical MEMS switches offer in solving these access network problems. The advantages in preventative maintenance, remote monitoring, test and diagnostic capability are highlighted. The low optical insertion loss for all switch optical connections of the switch enables the monitoring, grooming and serving of a large number of PON lines and customers. Furthermore, the 3D MEMS switch is transparent to optical wavelengths and data formats, thus making it easy to incorporate future upgrades, such higher bit rates or DWDM overlay to a PON.
A learnable parallel processing architecture towards unity of memory and computing
NASA Astrophysics Data System (ADS)
Li, H.; Gao, B.; Chen, Z.; Zhao, Y.; Huang, P.; Ye, H.; Liu, L.; Liu, X.; Kang, J.
2015-08-01
Developing energy-efficient parallel information processing systems beyond von Neumann architecture is a long-standing goal of modern information technologies. The widely used von Neumann computer architecture separates memory and computing units, which leads to energy-hungry data movement when computers work. In order to meet the need of efficient information processing for the data-driven applications such as big data and Internet of Things, an energy-efficient processing architecture beyond von Neumann is critical for the information society. Here we show a non-von Neumann architecture built of resistive switching (RS) devices named “iMemComp”, where memory and logic are unified with single-type devices. Leveraging nonvolatile nature and structural parallelism of crossbar RS arrays, we have equipped “iMemComp” with capabilities of computing in parallel and learning user-defined logic functions for large-scale information processing tasks. Such architecture eliminates the energy-hungry data movement in von Neumann computers. Compared with contemporary silicon technology, adder circuits based on “iMemComp” can improve the speed by 76.8% and the power dissipation by 60.3%, together with a 700 times aggressive reduction in the circuit area.
Scanning laser beam displays based on a 2D MEMS
NASA Astrophysics Data System (ADS)
Niesten, Maarten; Masood, Taha; Miller, Josh; Tauscher, Jason
2010-05-01
The combination of laser light sources and MEMS technology enables a range of display systems such as ultra small projectors for mobile devices, head-up displays for vehicles, wearable near-eye displays and projection systems for 3D imaging. Images are created by scanning red, green and blue lasers horizontally and vertically with a single two-dimensional MEMS. Due to the excellent beam quality of laser beams, the optical designs are efficient and compact. In addition, the laser illumination enables saturated display colors that are desirable for augmented reality applications where a virtual image is used. With this technology, the smallest projector engine for high volume manufacturing to date has been developed. This projector module has a height of 7 mm and a volume of 5 cc. The resolution of this projector is WVGA. No additional projection optics is required, resulting in an infinite focus depth. Unlike with micro-display projection displays, an increase in resolution will not lead to an increase in size or a decrease in efficiency. Therefore future projectors can be developed that combine a higher resolution in an even smaller and thinner form factor with increased efficiencies that will lead to lower power consumption.
Analysis of dual-frequency MEMS antenna using H-MRTD method
NASA Astrophysics Data System (ADS)
Yu, Wenge; Zhong, Xianxin; Chen, Yu; Wu, Zhengzhong
2004-10-01
For applying micro/nano technologies and Micro-Electro-Mechanical System (MEMS) technologies in the Radio Frequency (RF) field to manufacture miniature microstrip antennas. A novel MEMS dual-band patch antenna designed using slot-loaded and short-circuited size-reduction techniques is presented in this paper. By controlling the short-plane width, the two resonant frequencies, f10 and f30, can be significantly reduced and the frequency ratio (f30/f10) is tunable in the range 1.7~2.3. The Haar-Wavelet-Based multiresolution time domain (H-MRTD) with compactly supported scaling function for a full three-dimensional (3-D) wave to Yee's staggered cell is used for modeling and analyzing the antenna for the first time. Associated with practical model, an uniaxial perfectly matched layer (UPML) absorbing boundary conditions was developed, In addition , extending the mathematical formulae to an inhomogenous media. Numerical simulation results are compared with those using the conventional 3-D finite-difference time-domain (FDTD) method and measured. It has been demonstrated that, with this technique, space discretization with only a few cells per wavelength gives accurate results, leading to a reduction of both memory requirement and computation time.
A learnable parallel processing architecture towards unity of memory and computing.
Li, H; Gao, B; Chen, Z; Zhao, Y; Huang, P; Ye, H; Liu, L; Liu, X; Kang, J
2015-08-14
Developing energy-efficient parallel information processing systems beyond von Neumann architecture is a long-standing goal of modern information technologies. The widely used von Neumann computer architecture separates memory and computing units, which leads to energy-hungry data movement when computers work. In order to meet the need of efficient information processing for the data-driven applications such as big data and Internet of Things, an energy-efficient processing architecture beyond von Neumann is critical for the information society. Here we show a non-von Neumann architecture built of resistive switching (RS) devices named "iMemComp", where memory and logic are unified with single-type devices. Leveraging nonvolatile nature and structural parallelism of crossbar RS arrays, we have equipped "iMemComp" with capabilities of computing in parallel and learning user-defined logic functions for large-scale information processing tasks. Such architecture eliminates the energy-hungry data movement in von Neumann computers. Compared with contemporary silicon technology, adder circuits based on "iMemComp" can improve the speed by 76.8% and the power dissipation by 60.3%, together with a 700 times aggressive reduction in the circuit area.
MEMS product engineering: methodology and tools
NASA Astrophysics Data System (ADS)
Ortloff, Dirk; Popp, Jens; Schmidt, Thilo; Hahn, Kai; Mielke, Matthias; Brück, Rainer
2011-03-01
The development of MEMS comprises the structural design as well as the definition of an appropriate manufacturing process. Technology constraints have a considerable impact on the device design and vice-versa. Product design and technology development are therefore concurrent tasks. Based on a comprehensive methodology the authors introduce a software environment that links commercial design tools from both area into a common design flow. In this paper emphasis is put on automatic low threshold data acquisition. The intention is to collect and categorize development data for further developments with minimum overhead and minimum disturbance of established business processes. As a first step software tools that automatically extract data from spreadsheets or file-systems and put them in context with existing information are presented. The developments are currently carried out in a European research project.
Nanometal particle reagents for sensitive, MEMS based fiber-optic, multi-analyte, immuno-biosensing
NASA Astrophysics Data System (ADS)
Hong, Bin
Integration of nanotechnology to medical diagnostics has brought a new era to public health practice. An excellent example is the utilization of unique optoelectronic properties of nanoparticles to develop highly sensitive biosensing devices for point-of-care (POC) disease diagnosis/prognosis. Fluorophore mediated, immuno-biosensors are important disease detection tools. The property of intra-molecular fluorescence quenching of most fluorophores, however, limits the sensitivity of this type of sensors. A plasmon-rich nanometal particle (NMP) can transfer the lone pair electrons of a fluorophore, which normally participate in the fluorescence self-quenching, to its surface plasmon field, resulting in artificial fluorescence enhancement. The enhancement was found to depend on the metal type, the particle size, the distance between a particle and a fluorophore, and the quantum yield of a fluorophore. Some biocompatible solvents were also found to increase the fluorescence emission efficiency via effective dipole coupling between the fluorophore and the solvent molecule. The application of solvents in inmuno-sensing could additionally improve the fluorescence light retrieval by the conformational change of the protein complexes in solvent. The mixture of the NMP and the solvent, which we defined as nanometal particle reagent (NMPR), provided even higher enhancements. Cardiovascular diseases (CVDs) kill 1 person in every 6 seconds. Among the CVDs, acute myocardial infarction (AMI; commonly known as heart attack) is the most dangerous and time-sensitive killer. A rapid and accurate AMI diagnosis is crucial for saving many lives. For this purpose, a fluorophore mediated, immuno-reaction based, multi-cardiac-marker sensing device was developed, to quantify four myocardium-specific proteins simultaneously, accurately, rapidly, and user-friendly. The four cardiac markers of our choice were myoglobin (MG), C-reactive protein (CRP), cardiac troponin I (cTnI), and B-type natriuretic peptide (BNP). Two of these cardiac markers, cTnI and BNP, were rather difficult to sense due to their low concentrations (tens of picomolar) in blood plasma immediately after the AMI. The NMPRs that we have developed enhanced the sensor signals as high as 8 times, accomplishing a sensitive and accurate quantification of all four markers in 7 minutes with an average signal-to-noise ratio of 35. As a promising POC sensing device, system portability, sensing reliability, and user-friendly operation are important. Micro-electro-mechanical system (MEMS) technology was, therefore, integrated to the immuno-sensing device with microfluidic control and microfabrication. A LabVIEW(TM) computer code was also written for a "one-click" automated immunoassay and a real-time data analysis. Our four-cardiac-marker immuno-sensing device incorporated with nanotechnology and MEMS technology is capable of simultaneous quantification at a near-real time, which can save many lives. This device can be also used for measuring any disease-representing biomarkers (e.g., cancer markers) for rapid and accurate disease diagnosis/prognosis.
Advanced packaging for Integrated Micro-Instruments
NASA Technical Reports Server (NTRS)
Lyke, James L.
1995-01-01
The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.
A Wafer Transfer Technology for MEMS Adaptive Optics
NASA Technical Reports Server (NTRS)
Yang, Eui-Hyeok; Wiberg, Dean V.
2001-01-01
Adaptive optics systems require the combination of several advanced technologies such as precision optics, wavefront sensors, deformable mirrors, and lasers with high-speed control systems. The deformable mirror with a continuous membrane is a key component of these systems. This paper describes a new technique for transferring an entire wafer-level silicon membrane from one substrate to another. This technology is developed for the fabrication of a compact deformable mirror with a continuous facet. A 1 (mu)m thick silicon membrane, 100 mm in diameter, has been successfully transferred without using adhesives or polymers (i.e. wax, epoxy, or photoresist). Smaller or larger diameter membranes can also be transferred using this technique. The fabricated actuator membrane with an electrode gap of 1.5 (mu)m shows a vertical deflection of 0.37 (mu)m at 55 V.
Advanced adaptive optics technology development
NASA Astrophysics Data System (ADS)
Olivier, Scot S.
2002-02-01
The NSF Center for Adaptive Optics (CfAO) is supporting research on advanced adaptive optics technologies. CfAO research activities include development and characterization of micro-electro-mechanical systems (MEMS) deformable mirror (DM) technology, as well as development and characterization of high-resolution adaptive optics systems using liquid crystal (LC) spatial light modulator (SLM) technology. This paper presents an overview of the CfAO advanced adaptive optics technology development activities including current status and future plans.
NASA Technical Reports Server (NTRS)
Sharma, Ashok K.; Teverovksy, Alexander; Day, John H. (Technical Monitor)
2000-01-01
Microelectromechanical systems in MEMS is one of the fastest growing technologies in microelectronics, and is of great interest for military and aerospace applications. Accelerometers are the earliest and most developed representatives of MEMS. First demonstrated in 1979, micromachined accelerometers were used in automobile industry for air bag crash- sensing applications since 1990. In 1999, N4EMS accelerometers were used in NASA-JPL Mars Microprobe. The most developed accelerometers for airbag crash- sensing are rated for a full range of +/- 50 G. The range of sensitivity for accelerometers required for military or aerospace applications is much larger, varying from 20,000 G (to measure acceleration during gun and ballistic munition launches), and to 10(exp -6) G, when used as guidance sensors (to measure attitude and position of a spacecraft). The presence of moving parts on the surface of chip is specific to MEMS, and particularly, to accelerometers. This characteristic brings new reliability issues to micromachined accelerometers, including cyclic fatigue cracking of polysilicon cantilevers and springs, mechanical stresses that are caused by packaging and contamination in the internal cavity of the package. Studies of fatigue cracks initiation and growth in polysilicon showed that the fatigue damage may influence MEMS device performance, and the presence of water vapor significantly enhances crack initiation and growth. Environmentally induced failures, particularly, failures due to thermal cycling and mechanical shock are considered as one of major reliability concerns in MEMS. These environmental conditions are also critical for space applications of the parts. For example, the Mars pathfinder mission had experienced 80 mechanical shock events during the pyrotechnic separation processes.
Variable Emissivity Through MEMS Technology
NASA Technical Reports Server (NTRS)
Darrin, Ann Garrison; Osiander, Robert; Champion, John; Swanson, Ted; Douglas, Donya; Grob, Lisa M.; Powers, Edward I. (Technical Monitor)
2000-01-01
This paper discusses a new technology for variable emissivity (vari-e) radiator surfaces, which has significant advantages over traditional radiators and promises an alternative design technique for future spacecraft thermal control systems. All spacecraft rely on radiative surfaces to dissipate waste heat. These radiators have special coatings, typically with a low solar absorptivity and a high infrared-red emissivity, that are intended to optimize performance under the expected heat load and thermal sink environment. The dynamics of the heat loads and thermal environment make it a challenge to properly size the radiator and often require some means of regulating the heat rejection rate of the radiators in order to achieve proper thermal balance. Specialized thermal control coatings, which can passively or actively adjust their emissivity offer an attractive solution to these design challenges. Such systems would allow intelligent control of the rate of heat loss from a radiator in response to heat load and thermal environmental variations. Intelligent thermal control through variable emissivity systems is well suited for nano and pico spacecraft applications where large thermal fluctuations are expected due to the small thermal mass and limited electric resources. Presently there are three different types of vari-e technologies under development: Micro ElectroMechanical Systems (MEMS) louvers, Electrochromic devices, and Electrophoretic devices. This paper will describe several prototypes of micromachined (MEMS) louvers and experimental results for the emissivity variations measured on theses prototypes. It will further discuss possible actuation mechanisms and space reliability aspects for different designs. Finally, for comparison parametric evaluations of the thermal performances of the new vari-e technology and standard thermal control systems are presented in this paper.
NASA Technical Reports Server (NTRS)
2009-01-01
Topics covered include: Device for Measuring Low Flow Speed in a Duct, Measuring Thermal Conductivity of a Small Insulation Sample, Alignment Jig for the Precise Measurement of THz Radiation, Autoignition Chamber for Remote Testing of Pyrotechnic Devices, Microwave Power Combiners for Signals of Arbitrary Amplitude, Synthetic Foveal Imaging Technology, Airborne Antenna System for Minimum-Cycle-Slip GPS Reception, Improved Starting Materials for Back-Illuminated Imagers, Multi-Modulator for Bandwidth-Efficient Communication, Some Improvements in Utilization of Flash Memory Devices, GPS/MEMS IMU/Microprocessor Board for Navigation, T/R Multi-Chip MMIC Modules for 150 GHz, Pneumatic Haptic Interfaces, Device Acquires and Retains Rock or Ice Samples, Cryogenic Feedthrough Test Rig, Improved Assembly for Gas Shielding During Welding or Brazing, Two-Step Plasma Process for Cleaning Indium Bonding Bumps, Tool for Crimping Flexible Circuit Leads, Yb14MnSb11 as a High-Efficiency Thermoelectric Material, Polyimide-Foam/Aerogel Composites for Thermal Insulation, Converting CSV Files to RKSML Files, Service Management Database for DSN Equipment, Chemochromic Hydrogen Leak Detectors, Compatibility of Segments of Thermoelectric Generators, Complementary Barrier Infrared Detector, JPL Greenland Moulin Exploration Probe, Ultra-Lightweight Self-Deployable Nanocomposite Structure for Habitat Applications, and Room-Temperature Ionic Liquids for Electrochemical Capacitors.
NASA Astrophysics Data System (ADS)
Arsyah, D. M.; Kardena, E.; Helmy, Q.
2018-01-01
The study adopts a multi-level perspective in technology transition to analyse how the transition process in the development of geothermal energy in Indonesia is able to compete against the incumbent fossil-fuelled energy sources. Three levels of multi-level perspective are socio-technical landscape (ST-landscape), socio-technical regime (ST-regime) and niche innovations in Indonesia geothermal development. The identification, mapping and analysis of the dynamic relationship between each level are the important pillars of the multi-level perspective framework. The analysis considers the set of rules, actors and controversies that may arise in the technological transition process. The identified geothermal resource risks are the basis of the emerging geothermal technological innovations in Indonesian geothermal. The analysis of this study reveals the transition pathway, which yields a forecast for the Indonesian geothermal technology transition in the form of scenarios and probable impacts.
Multi-layered Poly-Dimethylsiloxane As A Non-Hermetic Packaging Material For Medical MEMS
Lachhman, S.; Zorman, C.A.; Ko, W.H.
2012-01-01
Poly-dimethylsiloxane (PDMS) is an attractive material for packaging implantable biomedical microdevices owing to its biocompatibility, ease in application, and bio-friendly mechanical properties. Unfortunately, devices encapsulated by PDMS lack the longevity for use in chronic implant applications due to defect-related moisture penetration through the packaging layer. This paper describes an effort to improve the performance of PDMS as packaging material by constructing the encapsulant from multiple, thin layers of PDMS as a part of a polymeric multi-material package PMID:23366225
Wafer-level hermetic vacuum packaging by bonding with a copper-tin thin film sealing ring
NASA Astrophysics Data System (ADS)
Akashi, Teruhisa; Funabashi, Hirofumi; Takagi, Hideki; Omura, Yoshiteru; Hata, Yoshiyuki
2018-04-01
A wafer-level hermetic vacuum packaging technology intended for use with MEMS devices was developed based on a copper-tin (CuSn) thin film sealing ring. To allow hermetic packaging, the shear strength of the CuSn thin film bond was improved by optimizing the pretreatment conditions. As a result, an average shear strength of 72.3 MPa was obtained and a cavity that had been hermetically sealed using wafer-level packaging (WLP) maintained its vacuum for 1.84 years. The total pressures in the cavities and the partial pressures of residual gases were directly determined with an ultra-low outgassing residual gas analyzer (RGA) system. Hermeticity was evaluated based on helium leak rates, which were calculated from helium pressures determined with the RGA system. The resulting data showed that a vacuum cavity following 1.84 years storage had a total pressure of 83.1 Pa, contained argon as the main residual gas and exhibited a helium leak rate as low as 1.67 × 10-17 Pa · m3 s-1, corresponding to an air leak rate of 6.19 × 10-18 Pa · m3 s-1. The RGA data demonstrate that WLP using a CuSn thin film sealing ring permits ultra-high hermeticity in conjunction with long-term vacuum packaging that is applicable to MEMS devices.
NASA Astrophysics Data System (ADS)
Lee, Sanghyo; Kim, Jong-Man; Kim, Yong-Kweon; Kwon, Youngwoo
2009-01-01
In this paper, a new absorptive single-pole four-throw (SP4T) switch based on multiple-contact switching is proposed and integrated with a Butler matrix to demonstrate a monolithic beam-forming network at millimeter waves (mm waves). In order to simplify the switching driving circuit and reduce the number of unit switches in an absorptive SP4T switch, the individual switches were replaced with long-span multiple-contact switches using stress-free single-crystalline-silicon MEMS technology. This approach improves the mechanical stability as well as the manufacturing yield, thereby allowing successful integration into a monolithic beam former. The fabricated absorptive SP4T MEMS switch shows insertion loss less than 1.3 dB, return losses better than 11 dB at 30 GHz and wideband isolation performance higher than 39 dB from 20 to 40 GHz. The absorptive SP4T MEMS switch is integrated with a 4 × 4 Butler matrix on a single chip to implement a monolithic beam-forming network, directing beam into four distinct angles. Array factors from the measured data show that the proposed absorptive SPnT MEMS switch can be effectively used for high-performance mm-wave beam-switching systems. This work corresponds to the first demonstration of a monolithic beam-forming network using switched beams.
An investigation into graphene exfoliation and potential graphene application in MEMS devices
NASA Astrophysics Data System (ADS)
Fercana, George; Kletetschka, Gunther; Mikula, Vilem; Li, Mary
2011-02-01
The design of microelectromecanical systems (MEMS) and micro-opto-electromechanical systems (MOEMS) are often materials-limited with respect to the efficiency and capability of the material. Graphene, a one atom thick honeycomb lattice of carbon, is a highly desired material for MEMS applications. Relevant properties of graphene include the material's optical transparency, mechanical strength, energy efficiency, and electrical and thermal conductivity due to its electron mobility. Aforementioned properties make graphene a strong candidate to supplant existing transparent electrode technology and replace the conventionally used material, indium-tin oxide. In this paper we present preliminary results on work toward integration of graphene with MEMS structures. We are studying mechanical exfoliation of highly ordered pyrolytic graphite (HOPG) crystals by repeatedly applying and separating adhesive materials from the HOPG surface. The resulting graphene sheets are then transferred to silicon oxide substrate using the previously applied adhesive material. We explored different adhesive options, particularly the use of Kapton tape, to improve the yield of graphene isolation along with chemical cross-linking agents which operate on a mechanism of photoinsertion of disassociated nitrene groups. These perfluorophenyl nitrenes participate in C=C addition reactions with graphene monolayers creating a covalent binding between the substrate and graphene. We are focusing on maximizing the size of isolated graphene sheets and comparing to conventional exfoliation. Preliminary results allow isolation of few layer graphene (FLG) sheets (n<3) of approximately 10μm x 44μm. Photolithography could possibly be utilized to tailor designs for microshutter technology to be used in future deep space telescopes.
2014-09-01
Micromechanics and Microengineering . 2005;15:176–184. 10. Mohite SS, Kesari H, Sonti VR, Pratap R. Analytical solutions for the stiffness and damping...coefficients of squeeze films in MEMS devices with perforated back plates. Journal of Micromechanics and Microengineering . 2005;15:2083–2092. 11. Younis MI
Compact MEMS external cavity tunable laser with ultra-narrow linewidth for coherent detection.
Zhang, Di; Zhao, Jianyi; Yang, Qi; Liu, Wen; Fu, Yanfeng; Li, Chao; Luo, Ming; Hu, Shenglei; Hu, Qianggao; Wang, Lei
2012-08-27
A compact and ultra-narrow linewidth tunable laser with an external cavity based on a simple single-axis-MEMS mirror is presented in this paper. We discuss the simulation of this tunable laser using a two-step hybrid analysis method to obtain an optimal design of the device. A wide wavelength tuning range about 40 nm in C-band with a narrow linewidth of less than 50 kHz and wavelength accuracy of ± 1 GHz over the entire tuning range can be achieved experimentally. We also conduct several experiments under different conditions to test the tunable laser. This device shows an excellent performance in both single-carrier polarization-multiplexed quadrature phase-shift keying (PM-QPSK) and multi-carrier orthogonal frequency division multiplexing (OFDM) coherent systems.
Programmable Aperture with MEMS Microshutter Arrays
NASA Technical Reports Server (NTRS)
Moseley, Samuel; Li, Mary; Kutyrev, Alexander; Kletetschka, Gunther; Fettig, Rainer
2011-01-01
A microshutter array (MSA) has been developed for use as an aperture array for multi-object selections in James Webb Space Telescope (JWST) technology. Light shields, molybdenum nitride (MoN) coating on shutters, and aluminum/aluminum oxide coatings on interior walls are put on each shutter for light leak prevention, and to enhance optical contrast. Individual shutters are patterned with a torsion flexure that permits shutters to open 90 deg. with a minimized mechanical stress concentration. The shutters are actuated magnetically, latched, and addressed electrostatically. Also, micromechanical features are tailored onto individual shutters to prevent stiction. An individual shutter consists of a torsion hinge, a shutter blade, a front electrode that is coated on the shutter blade, a backside electrode that is coated on the interior walls, and a magnetic cobalt-iron coating. The magnetic coating is patterned into stripes on microshutters so that shutters can respond to an external magnetic field for the magnetic actuation. A set of column electrodes is placed on top of shutters, and a set of row electrodes on sidewalls is underneath the shutters so that they can be electrostatically latched open. A linear permanent magnet is aligned with the shutter rows and is positioned above a flipped upside-down array, and sweeps across the array in a direction parallel to shutter columns. As the magnet sweeps across the array, sequential rows of shutters are rotated from their natural horizontal orientation to a vertical open position, where they approach vertical electrodes on the sidewalls. When the electrodes are biased with a sufficient electrostatic force to overcome the mechanical restoring force of torsion bars, shutters remain latched to vertical electrodes in their open state. When the bias is removed, or is insufficient, the shutters return to their horizontal, closed positions. To release a shutter, both the electrode on the shutter and the one on the back wall where the shutter sits are grounded. The shutters with one or both ungrounded electrodes are held open. Sub-micron bumps underneath light shields and silicon ribs on back walls are the two features to prevent stiction. These features ensure that the microshutter array functions properly in mechanical motions. The MSA technology can be used primarily in multi-object imaging and spectroscopy, photomask generation, light switches, and in the stepper equipment used to make integrated circuits and MEMS (microelectromechanical systems) devices.
A novel approach to the analysis of squeezed-film air damping in microelectromechanical systems
NASA Astrophysics Data System (ADS)
Yang, Weilin; Li, Hongxia; Chatterjee, Aveek N.; Elfadel, Ibrahim (Abe M.; Ender Ocak, Ilker; Zhang, TieJun
2017-01-01
Squeezed-film damping (SFD) is a phenomenon that significantly affects the performance of micro-electro-mechanical systems (MEMS). The total damping force in MEMS mainly include the viscous damping force and elastic damping force. Quality factor (Q factor) is usually used to evaluate the damping in MEMS. In this work, we measure the Q factor of a resonator through experiments in a wide range of pressure levels. In fact, experimental characterizations of MEMS have some limitations because it is difficult to conduct experiments at very high vacuum and also hard to differentiate the damping mechanisms from the overall Q factor measurements. On the other hand, classical theoretical analysis of SFD is restricted to strong assumptions and simple geometries. In this paper, a novel numerical approach, which is based on lattice Boltzmann simulations, is proposed to investigate SFD in MEMS. Our method considers the dynamics of squeezed air flow as well as fluid-solid interactions in MEMS. It is demonstrated that Q factor can be directly predicted by numerical simulation, and our simulation results agree well with experimental data. Factors that influence SFD, such as pressure, oscillating amplitude, and driving frequency, are investigated separately. Furthermore, viscous damping and elastic damping forces are quantitatively compared based on comprehensive simulation. The proposed numerical approach as well as experimental characterization enables us to reveal the insightful physics of squeezed-film air damping in MEMS.
Low-Cost MEMS Sensors and Vision System for Motion and Position Estimation of a Scooter
Guarnieri, Alberto; Pirotti, Francesco; Vettore, Antonio
2013-01-01
The possibility to identify with significant accuracy the position of a vehicle in a mapping reference frame for driving directions and best-route analysis is a topic which is attracting a lot of interest from the research and development sector. To reach the objective of accurate vehicle positioning and integrate response events, it is necessary to estimate position, orientation and velocity of the system with high measurement rates. In this work we test a system which uses low-cost sensors, based on Micro Electro-Mechanical Systems (MEMS) technology, coupled with information derived from a video camera placed on a two-wheel motor vehicle (scooter). In comparison to a four-wheel vehicle; the dynamics of a two-wheel vehicle feature a higher level of complexity given that more degrees of freedom must be taken into account. For example a motorcycle can twist sideways; thus generating a roll angle. A slight pitch angle has to be considered as well; since wheel suspensions have a higher degree of motion compared to four-wheel motor vehicles. In this paper we present a method for the accurate reconstruction of the trajectory of a “Vespa” scooter; which can be used as alternative to the “classical” approach based on GPS/INS sensor integration. Position and orientation of the scooter are obtained by integrating MEMS-based orientation sensor data with digital images through a cascade of a Kalman filter and a Bayesian particle filter. PMID:23348036
Low-Cost MEMS sensors and vision system for motion and position estimation of a scooter.
Guarnieri, Alberto; Pirotti, Francesco; Vettore, Antonio
2013-01-24
The possibility to identify with significant accuracy the position of a vehicle in a mapping reference frame for driving directions and best-route analysis is a topic which is attracting a lot of interest from the research and development sector. To reach the objective of accurate vehicle positioning and integrate response events, it is necessary to estimate position, orientation and velocity of the system with high measurement rates. In this work we test a system which uses low-cost sensors, based on Micro Electro-Mechanical Systems (MEMS) technology, coupled with information derived from a video camera placed on a two-wheel motor vehicle (scooter). In comparison to a four-wheel vehicle; the dynamics of a two-wheel vehicle feature a higher level of complexity given that more degrees of freedom must be taken into account. For example a motorcycle can twist sideways; thus generating a roll angle. A slight pitch angle has to be considered as well; since wheel suspensions have a higher degree of motion compared to four-wheel motor vehicles. In this paper we present a method for the accurate reconstruction of the trajectory of a "Vespa" scooter; which can be used as alternative to the "classical" approach based on GPS/INS sensor integration. Position and orientation of the scooter are obtained by integrating MEMS-based orientation sensor data with digital images through a cascade of a Kalman filter and a Bayesian particle filter.
MEMS-based thermally-actuated image stabilizer for cellular phone camera
NASA Astrophysics Data System (ADS)
Lin, Chun-Ying; Chiou, Jin-Chern
2012-11-01
This work develops an image stabilizer (IS) that is fabricated using micro-electro-mechanical system (MEMS) technology and is designed to counteract the vibrations when human using cellular phone cameras. The proposed IS has dimensions of 8.8 × 8.8 × 0.3 mm3 and is strong enough to suspend an image sensor. The processes that is utilized to fabricate the IS includes inductive coupled plasma (ICP) processes, reactive ion etching (RIE) processes and the flip-chip bonding method. The IS is designed to enable the electrical signals from the suspended image sensor to be successfully emitted out using signal output beams, and the maximum actuating distance of the stage exceeds 24.835 µm when the driving current is 155 mA. Depending on integration of MEMS device and designed controller, the proposed IS can decrease the hand tremor by 72.5%.
NASA Astrophysics Data System (ADS)
Wisniewiski, David
2014-03-01
The need to quantify and to improve long-term stability of pressure transducers is a persistent requirement from the aerospace sector. Specifically, the incorporation of real-time pressure monitoring in aircraft landing gear, as exemplified in Tire Pressure Monitoring Systems (TPMS), has placed greater demand on the pressure transducer for improved performance and increased reliability which is manifested in low lifecycle cost and minimal maintenance downtime through fuel savings and increased life of the tire. Piezoresistive (PR) silicon MEMS pressure transducers are the primary choice as a transduction method for this measurement owing to their ability to be designed for the harsh environment seen in aircraft landing gear. However, these pressure transducers are only as valuable as the long-term stability they possess to ensure reliable, real-time monitoring over tens of years. The "heart" of the pressure transducer is the silicon MEMS element, and it is at this basic level where the long-term stability is established and needs to be quantified. A novel High Pressure, High Temperature (HPHT) vessel has been designed and constructed to facilitate this critical measurement of the silicon MEMS element directly through a process of mechanically "floating" the silicon MEMS element while being subjected to the extreme environments of pressure and temperature, simultaneously. Furthermore, the HPHT vessel is scalable to permit up to fifty specimens to be tested at one time to provide a statistically significant data population on which to draw reasonable conclusions on long-term stability. With the knowledge gained on the silicon MEMS element, higher level assembly to the pressure transducer envelope package can also be quantified as to the build-effects contribution to long-term stability in the same HPHT vessel due to its accommodating size. Accordingly, a HPHT vessel offering multiple levels of configurability and robustness in data measurement is presented, along with 10 year long-term stability results.
Rutter, W Cliff; Burgess, David S
2018-07-01
Acute kidney injury (AKI) increases during empirical antimicrobial therapy with the combination of piperacillin-tazobactam (TZP) and vancomycin (VAN) compared to the number of incidences with monotherapy or the combination of cefepime and VAN. Limited data regarding the impact of meropenem (MEM) combined with VAN exist. This study examined the AKI incidence among patients treated with MEM plus VAN (MEM+VAN) or TZP+VAN. Data were collected from the University of Kentucky Center for Clinical and Translational Science Enterprise Data Trust from September 2007 through October 2015. Adults without previous renal disease who received MEM+VAN or TZP+VAN for at least 2 days were included. AKI was assessed using risk, injury, failure, loss, and end-stage (RIFLE) criteria. Inverse probability of treatment weighting was utilized to control for differences between groups. In total, 10,236 patients met inclusion criteria, with 9,898 receiving TZP+VAN and 338 receiving MEM+VAN. AKI occurred in 15.4% of MEM+VAN patients and in 27.4% of TZP+VAN patients ( P < 0.001). TZP+VAN was associated with increased AKI compared to the level with MEM+VAN (odds ratio [OR], 2.53; 95% confidence interval [CI], 1.82 to 3.52), after controlling for confounders. Use of MEM+VAN should be considered an appropriate alternative therapy to TZP+VAN if nephrotoxicity is a major concern. The results of this study demonstrate that judicial use of TZP+VAN for empirical coverage of infection is needed. Copyright © 2018 American Society for Microbiology.
NASA Astrophysics Data System (ADS)
Ruffin, Paul B.
2004-07-01
Nanotechnology development is progressing very rapidly. Several billions of dollars have been invested in nanoscience research since 2000. Pioneering nanotechnology research efforts have been primarily conducted at research institutions and centers. This paper identifies developments in nanoscience and technology that could provide significant advances in missile systems applications. Nanotechnology offers opportunities in the areas of advanced materials for coatings, including thin-film optical coatings, light-weight, strong armor and missile structural components, embedded computing, and "smart" structures; nano-particles for explosives, warheads, turbine engine systems, and propellants to enhance missile propulsion; nano-sensors for autonomous chemical detection; and nano-tube arrays for fuel storage and power generation. The Aviation and Missile Research, Development, and Engineering Center (AMRDEC) is actively collaborating with academia, industry, and other Government agencies to accelerate the development and transition of nanotechnology to favorably impact Army Transformation. Currently, we are identifying near-term applications and quantifying requirements for nanotechnology use in Army missile systems, as well as monitoring and screening research and developmental efforts in the industrial community for military applications. Combining MicroElectroMechanical Systems (MEMS) and nanotechnology is the next step toward providing technical solutions for the Army"s transformation. Several research and development projects that are currently underway at AMRDEC in this technology area are discussed. A top-level roadmap of MEMS/nanotechnology development projects for aviation and missile applications is presented at the end.
MEMS-Based Satellite Micropropulsion Via Catalyzed Hydrogen Peroxide Decomposition
NASA Technical Reports Server (NTRS)
Hitt, Darren L.; Zakrzwski, Charles M.; Thomas, Michael A.; Bauer, Frank H. (Technical Monitor)
2001-01-01
Micro-electromechanical systems (MEMS) techniques offer great potential in satisfying the mission requirements for the next generation of "micro-scale" satellites being designed by NASA and Department of Defense agencies. More commonly referred to as "nanosats", these miniature satellites feature masses in the range of 10-100 kg and therefore have unique propulsion requirements. The propulsion systems must be capable of providing extremely low levels of thrust and impulse while also satisfying stringent demands on size, mass, power consumption and cost. We begin with an overview of micropropulsion requirements and some current MEMS-based strategies being developed to meet these needs. The remainder of the article focuses the progress being made at NASA Goddard Space Flight Center towards the development of a prototype monopropellant MEMS thruster which uses the catalyzed chemical decomposition of high concentration hydrogen peroxide as a propulsion mechanism. The products of decomposition are delivered to a micro-scale converging/diverging supersonic nozzle which produces the thrust vector; the targeted thrust level approximately 500 N with a specific impulse of 140-180 seconds. Macro-scale hydrogen peroxide thrusters have been used for satellite propulsion for decades; however, the implementation of traditional thruster designs on a MEMS scale has uncovered new challenges in fabrication, materials compatibility, and combustion and hydrodynamic modeling. A summary of the achievements of the project to date is given, as is a discussion of remaining challenges and future prospects.
NASA Technical Reports Server (NTRS)
Patterson, James D.
1997-01-01
The MEMS (Micro-Electro-Mechanical-Systems) technology is quickly evolving as a viable means to combine micro-mechanical and micro-optical elements on the same chip. One MEMS technology that has recently gained attention by the research community is the micro-mechanical Fabry-Perot optical filter. A MEMS based Fabry-Perot consists of a vertically integrated structure composed of two mirrors separated by an air gap. Wavelength tuning is achieved by applying a bias between the two mirrors resulting in an attractive electrostatic force which pulls the mirrors closer. In this work, we present a new micro-mechanical Fabry-Perot structure which is simple to fabricate and is integratable with low cost silicon photodetectors and transistors. The structure consists of a movable gold coated oxide cantilever for the top mirror and a stationary Au/Ni plated silicon bottom mirror. The fabrication process is single mask level, self aligned, and requires only one grown or deposited layer. Undercutting of the oxide cantilever is carried out by a combination of RIE and anisotropic KOH etching of the (111) silicon substrate. Metallization of the mirrors is provided by thermal evaporation and electroplating. The optical and electrical characteristics of the fabricated devices were studied and show promissing results. A wavelength shift of 120nm with 53V applied bias was demonstrated by one device geometry using 6.27 micrometer air gap. The finesse of the structure was 2.4. Modulation bandwidths ranging from 91KHz to greater than 920KHz were also observed. Theoretical calculations show that if mirror reflectivity, smoothness, and parallelism are improved, a finesse of 30 is attainable. The predictions also suggest that a reduction of the air gap to 1 micrometer results in an increased wavelength tuning range of 175 nm with a CMOS compatible 4.75V.
Advanced materials and techniques for fibre-optic sensing
NASA Astrophysics Data System (ADS)
Henderson, Philip J.
2014-06-01
Fibre-optic monitoring systems came of age in about 1999 upon the emergence of the world's first significant commercialising company - a spin-out from the UK's collaborative MAST project. By using embedded fibre-optic technology, the MAST project successfully measured transient strain within high-performance composite yacht masts. Since then, applications have extended from smart composites into civil engineering, energy, military, aerospace, medicine and other sectors. Fibre-optic sensors come in various forms, and may be subject to embedment, retrofitting, and remote interrogation. The unique challenges presented by each implementation require careful scrutiny before widespread adoption can take place. Accordingly, various aspects of design and reliability are discussed spanning a range of representative technologies that include resonant microsilicon structures, MEMS, Bragg gratings, advanced forms of spectroscopy, and modern trends in nanotechnology. Keywords: Fibre-optic sensors, fibre Bragg gratings, MEMS, MOEMS, nanotechnology, plasmon.
Novel Micro ElectroMechanical Systems (MEMS) Packaging for the Skin of the Satellite
NASA Technical Reports Server (NTRS)
Darrin, M. Ann; Osiander, Robert; Lehtonen, John; Farrar, Dawnielle; Douglas, Donya; Swanson, Ted
2004-01-01
This paper includes a discussion of the novel packaging techniques that are needed to place MEMS based thermal control devices on the skin of various satellites, eliminating the concern associated with potential particulates &om integration and test or the launch environment. Protection of this MEMS based thermal device is achieved using a novel polymer that is both IR transmissive and electrically conductive. This polymer was originally developed and qualified for space flight application by NASA at the Langley Research Center. The polymer material, commercially known as CPI, is coated with a thin layer of ITO and sandwiched between two window-like frames. The packaging of the MEMS based radiator assembly offers the benefits of micro-scale devices in a chip on board fashion, with the level of protection generally found in packaged parts.
The NASA GSFC MEMS Colloidal Thruster
NASA Technical Reports Server (NTRS)
Cardiff, Eric H.; Jamieson, Brian G.; Norgaard, Peter C.; Chepko, Ariane B.
2004-01-01
A number of upcoming missions require different thrust levels on the same spacecraft. A highly scaleable and efficient propulsion system would allow substantial mass savings. One type of thruster that can throttle from high to low thrust while maintaining a high specific impulse is a Micro-Electro-Mechanical System (MEMS) colloidal thruster. The NASA GSFC MEMS colloidal thruster has solved the problem of electrical breakdown to permit the integration of the electrode on top of the emitter by a novel MEMS fabrication technique. Devices have been successfully fabricated and the insulation properties have been tested to show they can support the required electric field. A computational finite element model was created and used to verify the voltage required to successfully operate the thruster. An experimental setup has been prepared to test the devices with both optical and Time-Of-Flight diagnostics.
Lee, Chiara; Kang, Hae Joo; Hjelm, Anna; Qureshi, Abdul Aziz; Nji, Emmanuel; Choudhury, Hassanul; Beis, Konstantinos; de Gier, Jan-Willem; Drew, David
2014-10-16
Optimising membrane protein production yields in Escherichiacoli can be time- and resource-consuming. Here, we present a simple and effective Membrane protein Single shot amplification recipe: MemStar. This one-shot amplification recipe is based on the E. coli strain Lemo21(DE3), the PASM-5052 auto-induction medium and, contradictorily, an IPTG induction step. Using MemStar, production yields for most bacterial membrane proteins tested were improved to reach an average of 5 mg L(-1) per OD600 unit, which is significantly higher than yields obtained with other common production strategies. With MemStar, we have been able to obtain new structural information for several transporters, including the sodium/proton antiporter NapA. Copyright © 2014 Federation of European Biochemical Societies. Published by Elsevier B.V. All rights reserved.
Optically transduced MEMS gyro device
Nielson, Gregory N; Bogart, Gregory R; Langlois, Eric; Okandan, Murat
2014-05-20
A bulk micromachined vibratory gyro in which a proof mass has a bulk substrate thickness for a large mass and high inertial sensitivity. In embodiments, optical displacement transduction is with multi-layer sub-wavelength gratings for high sensitivity and low cross-talk with non-optical drive elements. In embodiments, the vibratory gyro includes a plurality of multi-layer sub-wavelength gratings and a plurality of drive electrodes to measure motion of the proof mass induced by drive forces and/or moments and induced by the Coriolis Effect when the gyro experiences a rotation. In embodiments, phase is varied across the plurality gratings and a multi-layer grating having the best performance is selected from the plurality.
NASA Astrophysics Data System (ADS)
Yang, Zhenyin
Metal-contact MEMS switches hold great promise for implementing agile radio frequency (RF) systems because of their small size, low fabrication cost, low power consumption, wide operational band, excellent isolation and exceptionally low signal insertion loss. Gold is often utilized as a contact material for metal-contact MEMS switches due to its excellent electrical conductivity and corrosion resistance. However contact wear and stiction are the two major failure modes for these switches due to its material softness and high surface adhesion energy. To strengthen the contact material, pure gold was alloyed with other metal elements. We designed and constructed a new micro-contacting test facility that closely mimic the typical MEMS operation and utilized this facility to efficiently evaluate optimized contact materials. Au-Ni binary alloy system as the candidate contact material for MEMS switches was systematically investigated. A correlation between contact material properties (etc. microstructure, micro-hardness, electrical resistivity, topology, surface structures and composition) and micro-contacting performance was established. It was demonstrated nano-scale graded two-phase Au-Ni film could possibly yield an improved device performance. Gold micro-contact degradation mechanisms were also systematically investigated by running the MEMS switching tests under a wide range of test conditions. According to our quantitative failure analysis, field evaporation could be the dominant failure mode for highfield (> critical threshold field) hot switching; transient thermal-assisted wear could be the dominant failure mode for low-field hot switching; on the other hand, pure mechanical wear and steady current heating (1 mA) caused much less contact degradation in cold switching tests. Results from low-force (50 muN/micro-contact), low current (0.1 mA) tests on real MEMS switches indicated that continuous adsorbed films from ambient air could degrade the switch contact resistance. Our work also contributes to the field of general nano-science and technology by resolving the transfer directionality of field evaporation of gold in atomic force microscope (AFM)/scanning tunneling microscope (STM).
A flexible Li-ion battery with design towards electrodes electrical insulation
NASA Astrophysics Data System (ADS)
Vieira, E. M. F.; Ribeiro, J. F.; Sousa, R.; Correia, J. H.; Goncalves, L. M.
2016-08-01
The application of micro electromechanical systems (MEMS) technology in several consumer electronics leads to the development of micro/nano power sources with high power and MEMS integration possibility. This work presents the fabrication of a flexible solid-state Li-ion battery (LIB) (~2.1 μm thick) with a design towards electrodes electrical insulation, using conventional, low cost and compatible MEMS fabrication processes. Kapton® substrate provides flexibility to the battery. E-beam deposited 300 nm thick Ge anode was coupled with LiCoO2/LiPON (cathode/solid-state electrolyte) in a battery system. LiCoO2 and LiPON films were deposited by RF-sputtering with a power source of 120 W and 100 W, respectively. LiCoO2 film was annealed at 400 °C after deposition. The new design includes Si3N4 and LiPO thin-films, providing electrode electrical insulation and a battery chemical stability safeguard, respectively. Microstructure and battery performance were investigated by scanning electron microscopy, electric resistivity and electrochemical measurements (open circuit potential, charge/discharge cycles and electrochemical impedance spectroscopy). A rechargeable thin-film and lightweight flexible LIB using MEMS processing compatible materials and techniques is reported.
Design, modeling and simulation of MEMS-based silicon Microneedles
NASA Astrophysics Data System (ADS)
Amin, F.; Ahmed, S.
2013-06-01
The advancement in semiconductor process engineering and nano-scale fabrication technology has made it convenient to transport specific biological fluid into or out of human skin with minimum discomfort. Fluid transdermal delivery systems such as Microneedle arrays are one such emerging and exciting Micro-Electro Mechanical System (MEMS) application which could lead to a total painless fluid delivery into skin with controllability and desirable yield. In this study, we aimed to revisit the problem with modeling, design and simulations carried out for MEMS based silicon hollow out of plane microneedle arrays for biomedical applications particularly for transdermal drug delivery. An approximate 200 μm length of microneedle with 40 μm diameter of lumen has been successfully shown formed by isotropic and anisotropic etching techniques using MEMS Pro design tool. These microneedles are arranged in size of 2 × 4 matrix array with center to center spacing of 750 μm. Furthermore, comparisons for fluid flow characteristics through these microneedle channels have been modeled with and without the contribution of the gravitational forces using mathematical models derived from Bernoulli Equation. Physical Process simulations have also been performed on TCAD SILVACO to optimize the design of these microneedles aligned with the standard Si-Fabrication lines.
Liquid Metal Droplet and Micro Corrugated Diaphragm RF-MEMS for reconfigurable RF filters
NASA Astrophysics Data System (ADS)
Irshad, Wasim
Widely Tunable RF Filters that are small, cost-effective and offer ultra low power consumption are extremely desirable. Indeed, such filters would allow drastic simplification of RF front-ends in countless applications from cell phones to satellites in space by replacing switched-array of static acoustic filters and YIG filters respectively. Switched array of acoustic filters are de facto means of channel selection in mobile applications such as cell phones. SAW and BAW filters satisfy most criteria needed by mobile applications such as low cost, size and power consumption. However, the trade-off is a significant loss of 3-4 dB in modern cell phone RF front-end. This leads to need for power-hungry amplifiers and short battery life. It is a necessary trade-off since there are no better alternatives. These devices are in mm scale and consume mW. YIG filters dominate applications where size or power is not a constraint but demand excellent RF performance like low loss and high tuning ratio. These devices are measured in inches and require several watts to operate. Clearly, a tunable RF filter technology that would combine the cost, size and power consumption benefits of acoustic filters with excellent RF performance of YIG filters would be extremely desirable and imminently useful. The objective of this dissertation is to develop such a technology based upon RF-MEMS Evanescent-mode cavity filter. Two highly novel RF-MEMS devices have been developed over the course of this PhD to address the unique MEMS needs of this technology. The first part of the dissertation is dedicated to introducing the fundamental concepts of tunable cavity resonators and filters. This includes the physics behind it, key performance metrics and what they depend on and requirements of the MEMS tuners. Initial gap control and MEMS attachment method are identified as potential hurdles towards achieving very high RF performance. Simple and elegant solutions to both these issues are discussed in detail and have proved pivotal to this work. The second part of the dissertation focuses on the Liquid Metal Droplet RF-MEMS. A novel tunable RF MEMS resonator that is based upon electrostatic control over the morphology of a liquid metal droplet (LMD) is conceived. We demonstrate an LMD evanescent-mode cavity resonator that simultaneously achieves wide analog tuning from 12 to 18 GHz with a measured quality factor of 1400-1840. A droplet of 250-mum diameter is utilized and the applied bias is limited to 100 V. This device operates on a principle called Electro-Wetting On Dielectric (EWOD). The liquid metal employed is a non-toxic eutectic alloy of Gallium, Indium and Tin known as Galinstan. This device also exploits interfacial surface energy and viscous body forces that dominate at nanoliter scale. We then apply our Liquid Metal Droplet (LMD) RF-MEMS architecture to demonstrate a continuously tunable electrostatic Ku-Band Filter. A 2-pole bandpass filter with measured insertion loss of less than 0.4dB and 3dB FBW of 3.4% is achieved using a Galinstan droplet of 250mum diameter and bias limited to 100V. We demonstrate that the LMD is insensitive to gravity by performing inversion and tilt experiments. In addition, we study its thermal tolerance by subjecting the LMD up to 150° C. The third part of the dissertation is dedicated to the Micro-Corrugated Diaphragm (MCD) RF-MEMS. We present an evanescent-mode cavity bandpass filter with state-of-the-art RF performance metrics like 4:1 tuning ratio from 5 to 20 GHz with less than 2dB insertion loss and 2-6% 3dB bandwidth. Micro-Corrugated Diaphragm (MCD) is a novel electrostatic MEMS design specifically engineered to provide large-scale analog deflections necessary for such continuous and wide tunable filtering with very high quality factor. We demonstrate a 1.25mm radius and 2mum thick Gold MCD which provides 30mum total deflection with nearly 60% analog range. We also present a detailed and systematic MCD design methodology for relevant applications. To further demonstrate MCD versatility, we implement a bandstop MCD filter that cascades nine separate resonators to achieve a 6-24 GHz continuous tuning. The disseration concludes with a Galinstan Magnetohydrodynamic (MHD) micropump and summary of my doctoral work. Although presented at the very end of this dissertation, the MHD micropump was indeed the very starting point for all my doctoral research efforts. The invaluable lessons learned here paved the way for development of both LMD and MCD RF-MEMS.
NASA Astrophysics Data System (ADS)
Fréchette, Luc G.
2007-09-01
Energy is a sector of paramount importance over the coming decades if we are to ensure sustainable development that respects our environment. The research and development of novel approaches to convert available energy into usable forms using micro and nanotechnologies can contribute towards this goal and meet the growing need for power in small scale portable applications. The dominant power sources for handheld and other portable electronics are currently primary and rechargeable batteries. Their limited energy density and adverse effects on the environment upon disposal suggest that alternative approaches need to be explored. This special issue will showcase some of the leading work in this area, initially presented at PowerMEMS 2006, the 6th International Workshop on Micro and Nanotechnologies for Power Generation and Energy Conversion Applications. Power MEMS are defined as microsystems for electrical power generation and other energy conversion applications, including propulsion and cooling. The range of power MEMS technologies includes micro thermodynamic machines, such as microturbines, miniature internal combustion engines and micro-coolers; solid-state direct energy conversion, such as thermoelectric and photovoltaic microstructures; micro electrochemical devices, such as micro fuel cells and nanostructure batteries; vibration energy harvesting devices, such as piezoelectric, magnetic or electrostatic micro generators, as well as micro thrusters and rocket engines for propulsion. These can either be driven by scavenging thermal, mechanical or solar energy from the environment, or from a stored energy source, such as chemical fuel or radioactive material. The unique scope leads to unique challenges in the development of power MEMS, ranging from the integration of novel materials to the efficient small scale implementation of energy conversion principles. In this special issue, Mitcheson et al provide a comparative assessment of three inertial vibration energy harvesting approaches. Technologies and approaches for micro heat engines are shared, ranging from a complete microsystem for thermal energy harvesting (Cho et al) to core bearing and microturbomachinery technologies for rotating micro heat engines (Waits et al, Nakajima et al). Electrochemical microsystems are also presented, based on methanol as fuel (Morse et al), as well as novel micro and nanofabrication approaches (Chu et al). Fuel cell microsystems with integrated hydrogen generation approaches are also investigated by Peterson et al and Varady et al, illustrating the benefits and challenges of miniaturizing complete power sources. Finally, biological micro fuel cells that leverage the principles found in nature are presented, in contrast to chemical fuel cells (Chen et al, Morishima et al). We hope that this work will inspire others to pursue innovative research and development activities in the area of power MEMS, and consequently contribute to addressing our energy challenges for the 21st century.
Noise, fluctuation, and HADAMARD-transform spectrometry
NASA Astrophysics Data System (ADS)
Nitzsche, Guenter; Riesenberg, Rainer
2003-05-01
The HADAMARD principle is known in optics as a multiplex technique. It describes the mode with the most advantageous increase of the signal-to-noise ratio (SNR) in terms of scanning (Fellget advantage). The maximum increase of SNR, we call it gain, is (n+1)/(2On), where n is the number of multiplexing. It is valid in the case of pure detector noise. The multiplex encoding Hadamard pattern in case of n = 7 is 1110100, whereby 1 stands for a switched on channel performed by a field selector. The signals of all (switched on) channels are detected by a single detector. n measurement steps with a cyclic change of the pattern is necessary to perform the Hadamard transformation and to get the result of each individual channel. In case of n = 7 the theoretical gain is 1.51. For all possible multiplex pattern (1100000, 1110000 and so on) the gain is theoretically investigated. A multiplexing advantage (gain > 1) is reached only by the Hadamard pattern, the inverse Hadamard pattern and for (0111111)-pattern (gain=1.08). Most of the multiplex pattern are disadvantageous. The reason for maximum gain of the HADAMARD transformation is analysed theoretically. Signal fluctuations during the measurement caused by fluctuations of the illumination or by the object under test, reduce the multiplex gain, too. So the limits for realizing a gain are estimated theoretically. Essential is the transformation procedure and its influence on the error propagation. The results could be verified by experiments with array spectrometeres. Requirements are derived by numerical simulation concerning the stability of the signals to be multiplexed. It is simulated the needed stability of the signals with increasing order of multiplexing. So the increase of the multiplex gain is limited by signal fluctuations. A realized 96 channel spectral reader is presented as a modern application of an optical multiplexing arrangement. ! M. Harvid, N. J. A. Sloane, Hadamard Transform Optics, Academic Press, 1979 ! R.A. De Verse, R.M. Hammaker, W. G. Fately, J.A.Graham, J.D.Tate, "Spectrometry and imaging using a digital micromirror array" American Laboratory, Vol. 30, 21, pp. 112-120, 1998 ! R. Riesenberg, A. Wuttig, B. Harnisch, "Optical MEMS Technology for Multiplexing in High-End Micro-Scpectrometers", Proc. SPIE 4928, 6-14, 2002 ! A. Wuttig, R. Riesenberg, "Hyperspectral imager with a facile MEMS", Proc. SPIE 4881A, 2002, to be published ! R. Riesenberg, G. Nitzsche, W. Voigt, 'HADAMARD Encoding and other optical Multiplexing', VDI-Berichte 1694, pp. 345-350, 2002 ! A. Wuttig, R. Riesenberg, G. Nitzsche, "Subpixel Analysis of Double Array Grating Spectrometer", Proc. SPIE 4480, pp. 334-344, 2002 ! A. Wuttig, R. Riesenberg, G. Nitzsche, "Integral Field and Multi Object Spectrometry with MEMS", Proc. SPIE 4480, pp. 367-376, 2002 ! R. Riesenberg, G. Nitzsche, A. Wuttig, B. Harnisch, "Micro Spectrometer and MEMS for Space" in "Smaller Satellites: Bigger Business?", edited by M. Rycroft, N. Crosby, Kluwer Academic Publisher, pp. 403-406, 2002 ! R. Riesenberg, A. Wuttig, "Optical sensors with MEMS, slit masks and micromechanical devices", Proc. SPIE 4561, pp. 315-322, 2001 ! R. Riesenberg, "MicroMechanical Slit Positioning System as a transmissive spatial Light Modulator", Proc. SPIE 4457, pp.197-203, 2001 ! R. Riesenberg, J. Lonschinski, "HADAMARD-Minispectrometer made by a Micro Device", Proc. "3rd Round Table on Micro/NanoTechnologies for Space", ESTEC, Noordwijk, The Netherlands, pp. 291 - 297, 2000 ! R. Riesenberg, U. Dillner, "HADAMARD Imaging Spectrometers", Proc. SPIE 3753, pp. 203-213, 1999 ! R. Riesenberg, Th. Seifert, "Design of spatial Light Modulator Microdevices - Micro Slit Arrays", Proc. SPIE 3680, Part One, pp. 406-414, 1999 ! R. Riesenberg, W. Voigt, J. Schoneich, "Compact Spectrometers made by Micro System Technology", Sensor 97, Proc. Vol. 2, pp. 145-150,1997
NeuroMEMS: Neural Probe Microtechnologies
HajjHassan, Mohamad; Chodavarapu, Vamsy; Musallam, Sam
2008-01-01
Neural probe technologies have already had a significant positive effect on our understanding of the brain by revealing the functioning of networks of biological neurons. Probes are implanted in different areas of the brain to record and/or stimulate specific sites in the brain. Neural probes are currently used in many clinical settings for diagnosis of brain diseases such as seizers, epilepsy, migraine, Alzheimer's, and dementia. We find these devices assisting paralyzed patients by allowing them to operate computers or robots using their neural activity. In recent years, probe technologies were assisted by rapid advancements in microfabrication and microelectronic technologies and thus are enabling highly functional and robust neural probes which are opening new and exciting avenues in neural sciences and brain machine interfaces. With a wide variety of probes that have been designed, fabricated, and tested to date, this review aims to provide an overview of the advances and recent progress in the microfabrication techniques of neural probes. In addition, we aim to highlight the challenges faced in developing and implementing ultra-long multi-site recording probes that are needed to monitor neural activity from deeper regions in the brain. Finally, we review techniques that can improve the biocompatibility of the neural probes to minimize the immune response and encourage neural growth around the electrodes for long term implantation studies. PMID:27873894
Wilson, Kerry; Das, Mainak; Wahl, Kathryn J.; Colton, Richard J.; Hickman, James
2010-01-01
Background To date, biological components have been incorporated into MEMS devices to create cell-based sensors and assays, motors and actuators, and pumps. Bio-MEMS technologies present a unique opportunity to study fundamental biological processes at a level unrealized with previous methods. The capability to miniaturize analytical systems enables researchers to perform multiple experiments in parallel and with a high degree of control over experimental variables for high-content screening applications. Methodology/Principal Findings We have demonstrated a biological microelectromechanical system (BioMEMS) based on silicon cantilevers and an AFM detection system for studying the physiology and kinetics of myotubes derived from embryonic rat skeletal muscle. It was shown that it is possible to interrogate and observe muscle behavior in real time, as well as selectively stimulate the contraction of myotubes with the device. Stress generation of the tissue was estimated using a modification of Stoney's equation. Calculated stress values were in excellent agreement with previously published results for cultured myotubes, but not adult skeletal muscle. Other parameters such as time to peak tension (TPT), the time to half relaxation (½RT) were compared to the literature. It was observed that the myotubes grown on the BioMEMS device, while generating stress magnitudes comparable to those previously published, exhibited slower TPT and ½RT values. However, growth in an enhanced media increased these values. From these data it was concluded that the myotubes cultured on the cantilevers were of an embryonic phenotype. The system was also shown to be responsive to the application of a toxin, veratridine. Conclusions/Significance The device demonstrated here will provide a useful foundation for studying various aspects of muscle physiology and behavior in a controlled high-throughput manner as well as be useful for biosensor and drug discovery applications. PMID:20548775
NASA Astrophysics Data System (ADS)
Larbalestier, D. C.; Osamura, K.; Hampshire, D. P.
2008-05-01
MEM07 was the 5th international workshop concentrating on the mechanical and electrical properties of composite superconductors, which are the technological conductor forms from which practical superconducting devices are made. Such superconducting conductors respond to important challenges we currently face, especially those concerned with the proper management of the world's energy resources. Superconductivity provides a means to address the challenges in the generation, transmission and distribution, and use of energy. For energy generation, the ITER Fusion Tokomak (now underway in France) provides exciting new challenges for the whole superconductivity community, due to the enormous size and strong fields of the plasma confinement superconducting magnets that will form the largest and most powerful superconducting machine yet built. Significant attention was paid at MEM07 to the modeling, characterization, testing and validation of the high-amperage Nb3Sn cable-in-conduit conductors needed for ITER. As for electric energy industry uses, there was much discussion of both first generation (Bi,Pb)2Sr2Ca2Cu3Ox conductors and the rapidly emerging second generation coated conductors made from YBa2Cu37-x. High-performing, affordable conductors of these materials are vital for large capacity transmission cables, energy storage systems, fault current limiters, generators and motors—many prototypes of which are being pursued in technologically advanced countries. There is a broad consensus that the prototype stage for high-current-high-field superconducting applications is nearing its end and that large scale applications are technologically feasible. However full industrialization of large-scale superconducting technologies in electric utility applications will benefit from continuous improvement in critical current, lower ac loss, higher strength and other vital conductor properties. The establishment of optimal procedures for the system design accompanying scale-up is a second vital task. As system design is dependent on material development, there is a critical need to study the key issues in developing high performance superconducting materials. The emphases of MEM07 were The mechanical properties of superconductors including the influence of stress and strain on the critical current of practical conductors including YBCO and ReBCO coated conductors, BSCCO tapes, MgB2 wires and Nb3Sn filamentary conductors. The intrinsic strain effects on critical current density in Nb3Sn, YBCO, BSCCO and MgB2. Recent advances in critical current, the mechanical properties and the reduction in ac losses of HTS tapes and wires. The compositional and microstructural dependence of E-J characteristics and explanations based on flux pinning, grain boundary weak-links and other mechanisms. Standardized test-methods: international cooperative research work to establish test methods for assessing the mechano-electromagnetic properties of superconductors based on the activities of IEC/TC90 and VAMAS/TWA-16. More than 60 researchers from more than 12 countries attended the MEM07 workshop, and about 40 presentations were made. A small selection of papers (15) from the workshop are included in this special issue of Superconductor Science and Technology. Taken together with papers published at earlier MEM meetings, this issue provides an updated view of some of the current state-of-the-art research in the mechano-electromagnetic properties of composite superconductors. The workshop was organized under the activities of the NEDO Grant Project (Applied Superconductivity, 2004EA004) and VAMAS/TWA-16. The meeting was organized by a committee composed of David Larbalestier (Conference Chair) aided by MEM05 and MEM06 Conference Chairs Kozo Osamura (Research Institute for Applied Sciences, Kyoto, Japan), Damian Hampshire (Durham University, UK) and Arman Nyilas (CEME). The Program Committee was composed of Ettore Salpietro (European Fusion Development Agreement), Neil Mitchell (ITER), Kozo Osamura, Damian Hampshire and Arman Nyilas. We express our great thanks to all those whose efforts were key in organizing the meeting, with very special thanks to our Meeting Planner Kate Liu who organized matters large and small with discretion and great efficiency.
NMR relaxation in natural soils: Fast Field Cycling and T1-T2 Determination by IR-MEMS
NASA Astrophysics Data System (ADS)
Haber-Pohlmeier, S.; Pohlmeier, A.; Stapf, S.; van Dusschoten, D.
2009-04-01
Soils are natural porous media of highest importance for food production and sustainment of water resources. For these functions, prominent properties are their ability of water retainment and transport, which are mainly controlled by pore size distribution. The latter is related to NMR relaxation times of water molecules, of which the longitudinal relaxation time can be determined non-invasively by fast-field cycling relaxometry (FFC) and both are obtainable by inversion recovery - multi-echo- imaging (IR-MEMS) methods. The advantage of the FFC method is the determination of the field dependent dispersion of the spin-lattice relaxation rate, whereas MRI at high field is capable of yielding spatially resolved T1 and T2 times. Here we present results of T1- relaxation time distributions of water in three natural soils, obtained by the analysis of FFC data by means of the inverse Laplace transformation (CONTIN)1. Kaldenkirchen soil shows relatively broad bimodal distribution functions D(T1) which shift to higher relaxation rates with increasing relaxation field. These data are compared to spatially resolved T1- and T2 distributions, obtained by IR-MEMS. The distribution of T1 corresponds well to that obtained by FFC.
Electrofluidic systems for contrast management
NASA Astrophysics Data System (ADS)
Rebello, Keith J.; Maranchi, Jeffrey P.; Tiffany, Jason E.; Brown, Christopher Y.; Maisano, Adam J.; Hagedon, Matthew A.; Heikenfeld, Jason C.
2012-06-01
Operating in dynamic lighting conditions and in greatly varying backgrounds is challenging. Current paints and state-ofthe- art passive adaptive coatings (e.g. photochromics) are not suitable for multi- environment situations. A semi-active, low power, skin is needed that can adapt its reflective properties based on the background environment to minimize contrast through the development and incorporation of suitable pigment materials. Electrofluidic skins are a reflective display technology for electronic ink and paper applications. The technology is similar to that in E Ink but makes use of MEMS based microfluidic structures, instead of simple black and white ink microcapsules dispersed in clear oil. Electrofluidic skin's low power operation and fast switching speeds (~20 ms) are an improvement over current state-ofthe- art contrast management technologies. We report on a microfluidic display which utilizes diffuse pigment dispersion inks to change the contrast of the underlying substrate from 5.8% to 100%. Voltage is applied and an electromechanical pressure is used to pull a pigment dispersion based ink from a hydrophobic coated reservoir into a hydrophobic coated surface channel. When no voltage is applied, the Young-Laplace pressure pushes the pigment dispersion ink back down into the reservoir. This allows the pixel to switch from the on and off state by balancing the two pressures. Taking a systems engineering approach from the beginning of development has enabled the technology to be integrated into larger systems.
Multi-interface level in oil tanks and applications of optical fiber sensors
NASA Astrophysics Data System (ADS)
Leal-Junior, Arnaldo G.; Marques, Carlos; Frizera, Anselmo; Pontes, Maria José
2018-01-01
On the oil production also involves the production of water, gas and suspended solids, which are separated from the oil on three-phase separators. However, the control strategies of an oil separator are limited due to unavailability of suitable multi-interface level sensors. This paper presents a description of the multi-phase level problem on the oil industry and a review of the current technologies for multi-interface level assessment. Since optical fiber sensors present chemical stability, intrinsic safety, electromagnetic immunity, lightweight and multiplexing capabilities, it can be an alternative for multi-interface level measurement that can overcome some of the limitations of the current technologies. For this reason, Fiber Bragg Gratings (FBGs) based optical fiber sensor system for multi-interface level assessment is proposed, simulated and experimentally assessed. The results show that the proposed sensor system is capable of measuring interface level with a relative error of only 2.38%. Furthermore, the proposed sensor system is also capable of measuring the oil density with an error of 0.8 kg/m3.
NASA Astrophysics Data System (ADS)
Chang, Chun-I.; Tsai, Ming-Han; Liu, Yu-Chia; Sun, Chih-Ming; Fang, Weileun
2013-09-01
This study exploits the foundry available complimentary metal-oxide-semiconductor (CMOS) process and the packaging house available pick-and-place technology to implement a capacitive type micromachined 2-axis tilt sensor. The suspended micro mechanical structures such as the spring, stage and sensing electrodes are fabricated using the CMOS microelectromechanical systems (MEMS) processes. A bulk block is assembled onto the suspended stage by pick-and-place technology to increase the proof-mass of the tilt sensor. The low temperature UV-glue dispensing and curing processes are employed to bond the block onto the stage. Thus, the sensitivity of the CMOS MEMS capacitive type 2-axis tilt sensor is significantly improved. In application, this study successfully demonstrates the bonding of a bulk solder ball of 100 µm in diameter with a 2-axis tilt sensor fabricated using the standard TSMC 0.35 µm 2P4M CMOS process. Measurements show the sensitivities of the 2-axis tilt sensor are increased for 2.06-fold (x-axis) and 1.78-fold (y-axis) after adding the solder ball. Note that the sensitivity can be further improved by reducing the parasitic capacitance and the mismatch of sensing electrodes caused by the solder ball.
High-productivity DRIE solutions for 3D-SiP and MEMS volume manufacturing
NASA Astrophysics Data System (ADS)
Puech, M.; Thevenoud, J. M.; Launay, N.; Arnal, N.; Godinat, P.; Andrieu, B.; Gruffat, J. M.
2006-12-01
Emerging 3D-SiP technologies and high volume MEMS applications require high productivity mass production DRIE systems. The Alcatel DRIE product range has recently been optimized to reach the highest process and hardware production performances. A study based on sub-micron high aspect ratio structures encountered in the most stringent 3D-SiP has been carried out. The optimization of the Bosch process parameters have shown ultra high silicon etch rate, with unrivaled uniformity and repeatability leading to excellent process yields. In parallel, most recent hardware and proprietary design optimization including vacuum pumping lines, process chamber, wafer chucks, pressure control system, gas delivery are discussed. A key factor for achieving the highest performances was the recognized expertise of Alcatel vacuum and plasma science technologies. These improvements have been monitored in a mass production environment for a mobile phone application. Field data analysis shows a significant reduction of cost of ownership thanks to increased throughput and much lower running costs. These benefits are now available for all 3D-SiP and high volume MEMS applications. The typical etched patterns include tapered trenches for CMOS imagers, through silicon via holes for die stacking, well controlled profile angle for 3D high precision inertial sensors, and large exposed area features for inkjet printer head and Silicon microphones.
PLL application research of a broadband MEMS phase detector: Theory, measurement and modeling
NASA Astrophysics Data System (ADS)
Han, Juzheng; Liao, Xiaoping
2017-06-01
This paper evaluates the capability of a broadband MEMS phase detector in the application of phase locked loops (PLLs) through the aspect of theory, measurement and modeling. For the first time, it demonstrates how broadband property and optimized structure are realized through cascaded transmission lines and ANSYS simulations. The broadband MEMS phase detector shows potential in PLL application for its dc voltage output and large power handling ability which is important for munition applications. S-parameters of the power combiner in the MEMS phase detector are measured with S11 better than -15 dB and S23 better than -10 dB over the whole X-band. Compared to our previous works, developed phase detection measurements are performed and focused on signals at larger power levels up to 1 W. Cosine tendencies are revealed between the output voltage and the phase difference for both small and large signals. Simulation approach through equivalent circuit modeling is proposed to study the PLL application of the broadband MEMS phase detector. Synchronization and tracking properties are revealed.
NASA Astrophysics Data System (ADS)
Picard, Francis; Ilias, Samir; Asselin, Daniel; Boucher, Marc-André; Duchesne, François; Jacob, Michel; Larouche, Carl; Vachon, Carl; Niall, Keith K.; Jerominek, Hubert
2011-02-01
A MEMS based technology for projection display is reviewed. This technology relies on mechanically flexible and reflective microbridges made of aluminum alloy. A linear array of such micromirrors is combined with illumination and Schlieren optics to produce a pixels line. Each microbridge in the array is individually controlled using electrostatic actuation to adjust the pixels intensities. Results of the simulation, fabrication and characterization of these microdevices are presented. Activation voltages below 250 V with response times below 10 μs were obtained for 25 μm × 25 μm micromirrors. With appropriate actuation voltage waveforms, response times of 5 μs and less are achievable. A damage threshold of the mirrors above 8 kW/cm2 has been evaluated. Development of the technology has produced projector engines demonstrating this light modulation principle. The most recent of these engines is DVI compatible and displays VGA video streams at 60 Hz. Recently applications have emerged that impose more stringent requirements on the dimensions of the MEMS array and associated optical system. This triggered a scale down study to evaluate the minimum micromirror size achievable, the impact of this reduced size on the damage threshold and the achievable minimum size of the associated optical system. Preliminary results of this scale down study are reported. FRAM with active surface as small as 5 μm × 5 μm have been investigated. Simulations have shown that such micromirrors could be activated with 107 V to achieve f-number of 1.25. The damage threshold has been estimated for various FRAM sizes. Finally, design of a conceptual miniaturized projector based on 1000×1 array of 5 μm × 5 μm micromirrors is presented. The volume of this projector concept is about 12 cm3.
Vasilyev, Nikolay V.; Gosline, Andrew H.; Butler, Evan; Lang, Nora; Codd, Patrick J.; Yamauchi, Haruo; Feins, Eric N.; Folk, Chris R.; Cohen, Adam L.; Chen, Richard; Zurakowski, David; del Nido, Pedro J.; Dupont, Pierre E
2013-01-01
Background Beating-heart image-guided intracardiac interventions have been evolving rapidly. To extend the domain of catheter-based and transcardiac interventions into reconstructive surgery, a new robotic tool delivery platform (TDP) and tissue approximation device have been developed. Initial results employing these tools to perform patent foramen ovale (PFO) closure are described. Methods and Results A robotic TDP comprised of superelastic metal tubes provides the capability of delivering and manipulating tools and devices inside the beating heart. A new device technology is also presented that utilizes a metal-based MicroElectroMechanical Systems (MEMS) manufacturing process to produce fully-assembled and fully-functional millimeter-scale tools. As a demonstration of both technologies, a PFO creation and closure was performed in a swine model. In the first group of animals (N=10), a preliminary study was performed. The procedural technique was validated with a transcardiac handheld delivery platform and epicardial echocardiography, video-assisted cardioscopy and fluoroscopy. In the second group (N=9), the procedure was performed percutaneously using the robotic TDP under epicardial echocardiography and fluoroscopy imaging. All PFO’s were completely closed in the first group. In the second group, the PFO was not successfully created in 1 animal, and the defects were completely closed in 6 of the 8 remaining animals. Conclusions In contrast to existing robotic catheter technologies, the robotic TDP utilizes a combination of stiffness and active steerability along its length to provide the positioning accuracy and force application capability necessary for tissue manipulation. In combination with a MEMS tool technology, it can enable reconstructive procedures inside the beating heart. PMID:23899870
Micromachined fiber optic Fabry-Perot underwater acoustic probe
NASA Astrophysics Data System (ADS)
Wang, Fuyin; Shao, Zhengzheng; Hu, Zhengliang; Luo, Hong; Xie, Jiehui; Hu, Yongming
2014-08-01
One of the most important branches in the development trend of the traditional fiber optic physical sensor is the miniaturization of sensor structure. Miniature fiber optic sensor can realize point measurement, and then to develop sensor networks to achieve quasi-distributed or distributed sensing as well as line measurement to area monitoring, which will greatly extend the application area of fiber optic sensors. The development of MEMS technology brings a light path to address the problems brought by the procedure of sensor miniaturization. Sensors manufactured by MEMS technology possess the advantages of small volume, light weight, easy fabricated and low cost. In this paper, a fiber optic extrinsic Fabry-Perot interferometric underwater acoustic probe utilizing micromachined diaphragm collaborated with fiber optic technology and MEMS technology has been designed and implemented to actualize underwater acoustic sensing. Diaphragm with central embossment, where the embossment is used to anti-hydrostatic pressure which would largely deflect the diaphragm that induce interferometric fringe fading, has been made by double-sided etching of silicon on insulator. By bonding the acoustic-sensitive diaphragm as well as a cleaved fiber end in ferrule with an outer sleeve, an extrinsic Fabry-Perot interferometer has been constructed. The sensor has been interrogated by quadrature-point control method and tested in field-stable acoustic standing wave tube. Results have been shown that the recovered signal detected by the sensor coincided well with the corresponding transmitted signal and the sensitivity response was flat in frequency range from 10 Hz to 2kHz with the value about -154.6 dB re. 1/μPa. It has been manifest that the designed sensor could be used as an underwater acoustic probe.
1998 IEEE Aerospace Conference. Proceedings.
NASA Astrophysics Data System (ADS)
The following topics were covered: science frontiers and aerospace; flight systems technologies; spacecraft attitude determination and control; space power systems; smart structures and dynamics; military avionics; electronic packaging; MEMS; hyperspectral remote sensing for GVP; space laser technology; pointing, control, tracking and stabilization technologies; payload support technologies; protection technologies; 21st century space mission management and design; aircraft flight testing; aerospace test and evaluation; small satellites and enabling technologies; systems design optimisation; advanced launch vehicles; GPS applications and technologies; antennas and radar; software and systems engineering; scalable systems; communications; target tracking applications; remote sensing; advanced sensors; and optoelectronics.
Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer
NASA Astrophysics Data System (ADS)
Wang, Wei-Shan; Lullin, Justine; Froemel, Joerg; Wiemer, Maik; Bargiel, Sylwester; Passilly, Nicolas; Gorecki, Christophe; Gessner, Thomas
2015-02-01
The paper presents the multi-wafer bonding technology as well as the integration of electrical connection to the zscanner wafer of the micromachined array-type Mirau interferometer. A Mirau interferometer, which is a key-component of optical coherence tomography (OCT) microsystem, consists of a microlens doublet, a MOEMS Z-scanner, a focusadjustment spacer and a beam splitter plate. For the integration of this MOEMS device heterogeneous bonding of Si, glass and SOI wafers is necessary. Previously, most of the existing methods for multilayer wafer bonding require annealing at high temperature, i.e., 1100°C. To be compatible with MEMS devices, bonding of different material stacks at temperatures lower than 400°C has also been investigated. However, if more components are involved, it becomes less effective due to the alignment accuracy or degradation of surface quality of the not-bonded side after each bonding operation. The proposed technology focuses on 3D integration of heterogeneous building blocks, where the assembly process is compatible with the materials of each wafer stack and with position accuracy which fits optical requirement. A demonstrator with up to 5 wafers bonded lower than 400°C is presented and bond interfaces are evaluated. To avoid the complexity of through wafer vias, a design which creates electrical connections along vertical direction by mounting a wafer stack on a flip chip PCB is proposed. The approach, which adopts vertically-stacked wafers along with electrical connection functionality, provides not only a space-effective integration of MOEMS device but also a design where the Mirau stack can be further integrated with other components of the OCT microsystem easily.
Design of a MEMS-Based Oscillator Using 180nm CMOS Technology.
Roy, Sukanta; Ramiah, Harikrishnan; Reza, Ahmed Wasif; Lim, Chee Cheow; Ferrer, Eloi Marigo
2016-01-01
Micro-electro mechanical system (MEMS) based oscillators are revolutionizing the timing industry as a cost effective solution, enhanced with more features, superior performance and better reliability. The design of a sustaining amplifier was triggered primarily to replenish MEMS resonator's high motion losses due to the possibility of their 'system-on-chip' integrated circuit solution. The design of a sustaining amplifier observing high gain and adequate phase shift for an electrostatic clamp-clamp (C-C) beam MEMS resonator, involves the use of an 180nm CMOS process with an unloaded Q of 1000 in realizing a fixed frequency oscillator. A net 122dBΩ transimpedance gain with adequate phase shift has ensured 17.22MHz resonant frequency oscillation with a layout area consumption of 0.121 mm2 in the integrated chip solution, the sustaining amplifier draws 6.3mW with a respective phase noise of -84dBc/Hz at 1kHz offset is achieved within a noise floor of -103dBC/Hz. In this work, a comparison is drawn among similar design studies on the basis of a defined figure of merit (FOM). A low phase noise of 1kHz, high figure of merit and the smaller size of the chip has accredited to the design's applicability towards in the implementation of a clock generative integrated circuit. In addition to that, this complete silicon based MEMS oscillator in a monolithic solution has offered a cost effective solution for industrial or biomedical electronic applications.
Cost-Effectiveness of Remote Cardiac Monitoring With the CardioMEMS Heart Failure System.
Schmier, Jordana K; Ong, Kevin L; Fonarow, Gregg C
2017-07-01
Heart failure (HF) is a leading cause of cardiovascular mortality in the United States and presents a substantial economic burden. A recently approved implantable wireless pulmonary artery pressure remote monitor, the CardioMEMS HF System, has been shown to be effective in reducing hospitalizations among New York Heart Association (NYHA) class III HF patients. The objective of this study was to estimate the cost-effectiveness of this remote monitoring technology compared to standard of care treatment for HF. A Markov cohort model relying on the CHAMPION (CardioMEMS Heart Sensor Allows Monitoring of Pressure to Improve Outcomes in NYHA Class III Heart Failure Patients) clinical trial for mortality and hospitalization data, published sources for cost data, and a mix of CHAMPION data and published sources for utility data, was developed. The model compares outcomes over 5 years for implanted vs standard of care patients, allowing patients to accrue costs and utilities while they remain alive. Sensitivity analyses explored uncertainty in input parameters. The CardioMEMS HF System was found to be cost-effective, with an incremental cost-effectiveness ratio of $44,832 per quality-adjusted life year (QALY). Sensitivity analysis found the model was sensitive to the device cost and to whether mortality benefits were sustained, although there were no scenarios in which the cost/QALY exceeded $100,000. Compared with standard of care, the CardioMEMS HF System was cost-effective when leveraging trial data to populate the model. © 2017 Wiley Periodicals, Inc.
Human organ-on-a-chip BioMEMS devices for testing new diagnostic and therapeutic strategies
NASA Astrophysics Data System (ADS)
Leary, James F.; Key, Jaehong; Vidi, Pierre-Alexandre; Cooper, Christy L.; Kole, Ayeeshik; Reece, Lisa M.; Lelièvre, Sophie A.
2013-03-01
MEMS human "organs-on-a-chip" can be used to create model human organ systems for developing new diagnostic and therapeutic strategies. They represent a promising new strategy for rapid testing of new diagnostic and therapeutic approaches without the need for involving risks to human subjects. We are developing multicomponent, superparamagnetic and fluorescent nanoparticles as X-ray and MRI contrast agents for noninvasive multimodal imaging and for antibody- or peptide-targeted drug delivery to tumor and precancerous cells inside these artificial organ MEMS devices. Magnetic fields can be used to move the nanoparticles "upstream" to find their target cells in an organs-on-achip model of human ductal breast cancer. Theoretically, unbound nanoparticles can then be removed by reversing the magnetic field to give a greatly enhanced image of tumor cells within these artificial organ structures. Using branched PDMS microchannels and 3D tissue engineering of normal and malignant human breast cancer cells inside those MEMS channels, we can mimic the early stages of human ductal breast cancer with the goal to improve the sensitivity and resolution of mammography and MRI of very small tumors and test new strategies for treatments. Nanomedical systems can easily be imaged by multicolor confocal microscopy inside the artificial organs to test targeting and therapeutic responses including the differential viability of normal and tumor cells during treatments. Currently we are using 2-dimensional MEMS structures, but these studies can be extended to more complex 3D structures using new 3D printing technologies.
Large-aperture MOEMS Fabry-Perot interferometer for miniaturized spectral imagers
NASA Astrophysics Data System (ADS)
Rissanen, Anna; Langner, Andreas; Viherkanto, Kai; Mannila, Rami
2015-02-01
VTT's optical MEMS Fabry-Perot interferometers (FPIs) are tunable optical filters, which enable miniaturization of spectral imagers into small, mass producible hand-held sensors with versatile optical measurement capabilities. FPI technology has also created a basis for various hyperspectral imaging instruments, ranging from nanosatellites, environmental sensing and precision agriculture with UAVs to instruments for skin cancer detection. Until now, these application demonstrations have been mostly realized with piezo-actuated FPIs fabricated by non-monolithical assembly method, suitable for achieving very large optical apertures and with capacity to small-to-medium volumes; however large-volume production of MEMS manufacturing supports the potential for emerging spectral imaging applications also in large-volume applications, such as in consumer/mobile products. Previously reported optical apertures of MEMS FPIs in the visible range have been up to 2 mm in size; this paper presents the design, successful fabrication and characterization of MEMS FPIs for central wavelengths of λ = 500 nm and λ = 650 nm with optical apertures up to 4 mm in diameter. The mirror membranes of the FPI structures consist of ALD (atomic layer deposited) TiO2-Al2O3 λ/4- thin film Bragg reflectors, with the air gap formed by sacrificial polymer etching in O2 plasma. The entire fabrication process is conducted below 150 °C, which makes it possible to monolithically integrate the filter structures on other ICdevices such as detectors. The realized MEMS devices are aimed for nanosatellite space application as breadboard hyperspectral imager demonstrators.
Cantilever-type Thermal Microactuators Fabricated by SOI-MUMPs with U-type and I-type Configurations
NASA Astrophysics Data System (ADS)
Osada, Takahiro; Ochiai, Kuniyuki; Osada, Kazuki; Muro, Hideo
Recently, the micro fluid systems have been extensively studied, where microactuators such as micro valves fabricated by MEMS technology are essential for realizing these systems. In this paper thermal microactuators with U-type and I-type shapes fabricated by SOI-MUMPs technology have been investigated for optimizing their configurations.
Radio frequency telemetry system for sensors and actuators
NASA Technical Reports Server (NTRS)
Simons, Rainee N. (Inventor); Miranda, Felix A. (Inventor)
2003-01-01
The present invention discloses and teaches apparatus for combining Radio Frequency (RF) technology with novel micro-inductor antennas and signal processing circuits for RF telemetry of real time, measured data, from microelectromechanical system (MEMS) sensors, through electromagnetic coupling with a remote powering/receiving device. Such technology has many applications, but is especially useful in the biomedical area.
Radio Frequency Telemetry System for Sensors and Actuators
NASA Technical Reports Server (NTRS)
Simons, Rainee N. (Inventor); Miranda, Felix A. (Inventor)
2003-01-01
The present invention discloses and teaches apparatus for combining Radio Frequency (RF) technology with novel micro-inductor antennas and signal processing circuits for RF telemetry of real time, measured data, from microelectromechanical system (MEMS) sensors, through electromagnetic coupling with a remote poweringheceiving device. Such technology has many applications, but is especially useful in the biomedical area.
Nanoelectronics and More-than-Moore at IMEC
NASA Astrophysics Data System (ADS)
Cartuyvels, Rudi; Biesemans, Serge; Vandervorst, Wilfried; De Boeck, Jo
2011-11-01
This paper presents an overview of imec's R&D addressing the challenges of CMOS scaling towards the 10 nm node and its outlook beyond. In addition to the relentless geometrical shrinks, opportunities to further increase nanoelectronic system functionality and performance by co-integration and chip stacking technologies combined with emerging MEMS and optoelectronic technologies will be presented.
Transparent contacts for stacked compound photovoltaic cells
Tauke-Pedretti, Anna; Cederberg, Jeffrey; Nielson, Gregory N.; Okandan, Murat; Cruz-Campa, Jose Luis
2016-11-29
A microsystems-enabled multi-junction photovoltaic (MEM-PV) cell includes a first photovoltaic cell having a first junction, the first photovoltaic cell including a first semiconductor material employed to form the first junction, the first semiconductor material having a first bandgap. The MEM-PV cell also includes a second photovoltaic cell comprising a second junction. The second photovoltaic cell comprises a second semiconductor material employed to form the second junction, the second semiconductor material having a second bandgap that is less than the first bandgap, the second photovoltaic cell further comprising a first contact layer disposed between the first junction of the first photovoltaic cell and the second junction of the second photovoltaic cell, the first contact layer composed of a third semiconductor material having a third bandgap, the third bandgap being greater than or equal to the first bandgap.
Gyroscope Technology and Applications: A Review in the Industrial Perspective
Cuccovillo, Antonello; Vaiani, Lorenzo; De Carlo, Martino
2017-01-01
This paper is an overview of current gyroscopes and their roles based on their applications. The considered gyroscopes include mechanical gyroscopes and optical gyroscopes at macro- and micro-scale. Particularly, gyroscope technologies commercially available, such as Mechanical Gyroscopes, silicon MEMS Gyroscopes, Ring Laser Gyroscopes (RLGs) and Fiber-Optic Gyroscopes (FOGs), are discussed. The main features of these gyroscopes and their technologies are linked to their performance. PMID:28991175
Sources of stress gradients in electrodeposited Ni MEMS.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Hearne, Sean Joseph; Floro, Jerrold Anthony; Dyck, Christopher William
2004-06-01
The ability of future integrated metal-semiconductor micro-systems such as RF MEMS to perform highly complex functions will depend on developing freestanding metal structures that offer improved conductivity and reflectivity over polysilicon structures. For example, metal-based RF MEMS technology could replace the bulky RF system presently used in communications, navigation, and avionics systems. However, stress gradients that induce warpage of active components have prevented the implementation of this technology. Figure 1, is an interference micrograph image of a series of cantilever beams fabricated from electrodeposited Ni. The curvature in the beams was the result of stress gradients intrinsic to the electrodepositionmore » process. To study the sources of the stress in electrodeposition of Ni we have incorporated a wafer curvature based stress sensor, the multibeam optical stress sensor, into an electrodeposition cell. We have determined that there are two regions of stress induced by electrodepositing Ni from a sulfamate-based bath (Fig 2). The stress evolution during the first region, 0-1000{angstrom}, was determined to be dependent only on the substrate material (Au vs. Cu), whereas the stress evolution during the second region, >1000{angstrom}, was highly dependent on the deposition conditions. In this region, the stress varied from +0.5 GPa to -0.5GPa, depending solely on the deposition rate. We examined four likely sources for the compressive intrinsic stress, i.e. reduction in tensile stress, and determined that only the adatom diffusion into grain boundaries model of Sheldon, et al. could account for the observed compressive stress. In the presentation, we shall discuss the compressive stress generation mechanisms considered and the ramifications of these results on fabrication of electrodeposited Ni for MEMS applications.« less
Optical MEMS for Earth observation
NASA Astrophysics Data System (ADS)
Liotard, Arnaud; Viard, Thierry; Noell, Wilfried; Zamkotsian, Frédéric; Freire, Marco; Guldimann, Benedikt; Kraft, Stefan
2017-11-01
Due to the relatively large number of optical Earth Observation missions at ESA, this area is interesting for new space technology developments. In addition to their compactness, scalability and specific task customization, optical MEMS could generate new functions not available with current technologies and are thus candidates for the design of future space instruments. Most mature components for space applications are the digital mirror arrays, the micro-deformable mirrors, the programmable micro diffraction gratings and tiltable micromirrors. A first selection of market-pull and techno-push concepts is done. In addition, some concepts are coming from outside Earth Observation. Finally two concepts are more deeply analyzed. The first concept is a programmable slit for straylight control for space spectro-imagers. This instrument is a push-broom spectroimager for which some images cannot be exploited because of bright sources in the field-of-view. The proposed concept consists in replacing the current entrance spectrometer slit by an active row of micro-mirrors. The MEMS will permit to dynamically remove the bright sources and then to obtain a field-of-view with an optically enhanced signal-to-noise ratio. The second concept is a push-broom imager for which the acquired spectrum can be tuned by optical MEMS. This system is composed of two diffractive elements and a digital mirror array. The first diffractive element spreads the spectrum. A micromirror array is set at the location of the spectral focal plane. By putting the micro-mirrors ON or OFF, we can select parts of field-of-view or spectrum. The second diffractive element then recombines the light on a push-broom detector. Dichroics filters, strip filter, band-pass filter could be replaced by a unique instrument.
Bieberle-Hütter, A; Santis-Alvarez, A J; Jiang, B; Heeb, P; Maeder, T; Nabavi, M; Poulikakos, D; Niedermann, P; Dommann, A; Muralt, P; Bernard, A; Gauckler, L J
2012-11-21
An integrated system of a microreformer and a carrier allowing for syngas generation from liquefied petroleum gas (LPG) for micro-SOFC application is discussed. The microreformer with an overall size of 12.7 mm × 12.7 mm × 1.9 mm is fabricated with micro-electro-mechanical system (MEMS) technologies. As a catalyst, a special foam-like material made from ceria-zirconia nanoparticles doped with rhodium is used to fill the reformer cavity of 58.5 mm(3). The microreformer is fixed onto a microfabricated structure with built-in fluidic channels and integrated heaters, the so-called functional carrier. It allows for thermal decoupling of the cold inlet gas and the hot fuel processing zone. Two methods for heating the microreformer are compared in this study: a) heating in an external furnace and b) heating with the two built-in heaters on the functional carrier. With both methods, high butane conversion rates of 74%-85% are obtained at around 550 °C. In addition, high hydrogen and carbon monoxide yields and selectivities are achieved. The results confirm those from classical lab reformers built without MEMS technology (N. Hotz et al., Chem. Eng. Sci., 2008, 63, 5193; N. Hotz et al., Appl. Catal., B, 2007, 73, 336). The material combinations and processing techniques enable syngas production with the present MEMS based microreformer with high performance for temperatures up to 700 °C. The functional carrier is the basis for a new platform, which can integrate the micro-SOFC membranes and the gas processing unit as subsystem of an entire micro-SOFC system.
Quantitative Accelerated Life Testing of MEMS Accelerometers
Bâzu, Marius; Gălăţeanu, Lucian; Ilian, Virgil Emil; Loicq, Jerome; Habraken, Serge; Collette, Jean-Paul
2007-01-01
Quantitative Accelerated Life Testing (QALT) is a solution for assessing the reliability of Micro Electro Mechanical Systems (MEMS). A procedure for QALT is shown in this paper and an attempt to assess the reliability level for a batch of MEMS accelerometers is reported. The testing plan is application-driven and contains combined tests: thermal (high temperature) and mechanical stress. Two variants of mechanical stress are used: vibration (at a fixed frequency) and tilting. Original equipment for testing at tilting and high temperature is used. Tilting is appropriate as application-driven stress, because the tilt movement is a natural environment for devices used for automotive and aerospace applications. Also, tilting is used by MEMS accelerometers for anti-theft systems. The test results demonstrated the excellent reliability of the studied devices, the failure rate in the “worst case” being smaller than 10-7h-1. PMID:28903265
DOE Office of Scientific and Technical Information (OSTI.GOV)
J.D. Sanders
Under the U.S.-Russian Material Protection, Control and Accounting (MPC&A) Program, the Material Control and Accounting Measurements (MCAM) Project has supported a joint U.S.-Russian effort to coordinate improvements of the Russian MC&A measurement system. These efforts have resulted in the development of a MC&A Equipment and Methodological Support (MEMS) Strategic Plan (SP), developed by the Russian MEM Working Group. The MEMS SP covers implementation of MC&A measurement equipment, as well as the development, attestation and implementation of measurement methodologies and reference materials at the facility and industry levels. This paper provides an overview of the activities conducted under the MEMS SP,more » as well as a status on current efforts to develop reference materials, implement destructive and nondestructive assay measurement methodologies, and implement sample exchange, scrap and holdup measurement programs across Russian nuclear facilities.« less
Multi-layered poly-dimethylsiloxane as a non-hermetic packaging material for medical MEMS.
Lachhman, S; Zorman, C A; Ko, W H
2012-01-01
Poly-dimethylsiloxane (PDMS) is an attractive material for packaging implantable biomedical microdevices owing to its biocompatibility, ease in application, and bio-friendly mechanical properties. Unfortunately, devices encapsulated solely by PDMS lack the longevity for use in chronic implant applications due to defect-related moisture penetration through the packaging layer caused by conventional deposition processes such as spin coating. This paper describes an effort to improve the performance of PDMS as a packaging material by constructing the encapsulant from multiple, thin roller casted layers of PDMS as a part of a polymeric multi-material package.
Evaluation of MEMS-based in-place inclinometers in cold regions : [summary].
DOT National Transportation Integrated Search
2013-03-01
Inclinometer probes are used to measure ground movement. While an industry standard, this technology has drawbacks, including costly trips for manual measurements, : operator error, and limited measurements due to casing deformation. Relatively new M...
Evaluation of MEMS-based in-place inclinometers in cold regions.
DOT National Transportation Integrated Search
2013-03-01
Inclinometer probes are used to measure ground movement. While an industry standard, this technology has drawbacks, including costly trips for manual measurements, : operator error, and limited measurements due to casing deformation. Relatively new M...
Sampling and Control Circuit Board for an Inertial Measurement Unit
NASA Technical Reports Server (NTRS)
Chelmins, David; Powis, Rick
2012-01-01
Spacesuit navigation is one component of NASA s efforts to return humans to the Moon. Studies performed at the NASA Glenn Research Center (GRC) considered various navigation technologies and filtering approaches to enable navigation on the lunar surface. As part of this effort, microelectromechanical systems (MEMS) inertial measurement units (IMUs) were studied to determine if they could supplement a radiometric infrastructure. MEMS IMUs were included in the Lunar Extra-Vehicular Activity Crewmember Location Determination System (LECLDS) testbed during NASA s annual Desert Research and Technology Studies (D-RATS) event in 2009 and 2010. The testbed included one IMU in 2009 and three IMUs in 2010, along with a custom circuit board interfacing between the navigation processor and each IMU. The board was revised for the 2010 test, and this paper documents the design details of this latest revision of the interface circuit board and firmware.
Hemispherical array of sensors with contractively wrapped polymer petals for flow sensing
NASA Astrophysics Data System (ADS)
Kanhere, Elgar; Wang, Nan; Kottapalli, Ajay Giri Prakash; Miao, Jianmin; Triantafyllou, Michael
2017-11-01
Hemispherical arrays have inherent advantages that allow simultaneous detection of flow speed and direction due to their shape. Though MEMS technology has progressed leaps and bounds, fabrication of array of sensors on a hemispherical surface is still a challenge. In this work, a novel approach of constructing hemispherical array is presented which employs a technique of contractively wrapping a hemispherical surface with flexible liquid crystal polymer petals. This approach also leverages the offerings from rapid prototyping technology and established standard MEMS fabrication processes. Hemispherical arrays of piezoresistive sensors are constructed with two types of petal wrappings, 4-petals and 8-petals, on a dome. The flow sensing and direction detection abilities of the dome are evaluated through experiments in wind tunnel. Experimental results demonstrate that a dome equipped with a dense array of sensors can provide information pertaining to the stimulus, through visualization of output profile over the entire surface.
A multilevel Lab on chip platform for DNA analysis.
Marasso, Simone Luigi; Giuri, Eros; Canavese, Giancarlo; Castagna, Riccardo; Quaglio, Marzia; Ferrante, Ivan; Perrone, Denis; Cocuzza, Matteo
2011-02-01
Lab-on-chips (LOCs) are critical systems that have been introduced to speed up and reduce the cost of traditional, laborious and extensive analyses in biological and biomedical fields. These ambitious and challenging issues ask for multi-disciplinary competences that range from engineering to biology. Starting from the aim to integrate microarray technology and microfluidic devices, a complex multilevel analysis platform has been designed, fabricated and tested (All rights reserved-IT Patent number TO2009A000915). This LOC successfully manages to interface microfluidic channels with standard DNA microarray glass slides, in order to implement a complete biological protocol. Typical Micro Electro Mechanical Systems (MEMS) materials and process technologies were employed. A silicon/glass microfluidic chip and a Polydimethylsiloxane (PDMS) reaction chamber were fabricated and interfaced with a standard microarray glass slide. In order to have a high disposable system all micro-elements were passive and an external apparatus provided fluidic driving and thermal control. The major microfluidic and handling problems were investigated and innovative solutions were found. Finally, an entirely automated DNA hybridization protocol was successfully tested with a significant reduction in analysis time and reagent consumption with respect to a conventional protocol.
Maisotsenko cycle applications in multi-stage ejector recycling module for chemical production
NASA Astrophysics Data System (ADS)
Levchenko, D. O.; Artyukhov, A. E.; Yurko, I. V.
2017-08-01
The article is devoted to the theoretical bases of multistage (multi-level) utilization modules as part of chemical plants (on the example of the technological line for obtaining nitrogen fertilizers). The possibility of recycling production waste (ammonia vapors, dust and substandard nitrogen fertilizers) using ejection devices and waste heat using Maisotsenko cycle technology (Maisotsenko heat and mass exchanger (HMX), Maisotsenko power cycles and recuperators, etc.) is substantiated. The principle of operation of studied recycling module and prospects for its implementation are presented. An improved technological scheme for obtaining granular fertilizers and granules with porous structure with multistage (multi-level) recycling module is proposed.
Zhang, Shengzhi; Yu, Shuai; Liu, Chaojun; Yuan, Xuebing; Liu, Sheng
2016-02-20
To provide a long-time reliable orientation, sensor fusion technologies are widely used to integrate available inertial sensors for the low-cost orientation estimation. In this paper, a novel dual-linear Kalman filter was designed for a multi-sensor system integrating MEMS gyros, an accelerometer, and a magnetometer. The proposed filter precludes the impacts of magnetic disturbances on the pitch and roll which the heading is subjected to. The filter can achieve robust orientation estimation for different statistical models of the sensors. The root mean square errors (RMSE) of the estimated attitude angles are reduced by 30.6% under magnetic disturbances. Owing to the reduction of system complexity achieved by smaller matrix operations, the mean total time consumption is reduced by 23.8%. Meanwhile, the separated filter offers greater flexibility for the system configuration, as it is possible to switch on or off the second stage filter to include or exclude the magnetometer compensation for the heading. Online experiments were performed on the homemade miniature orientation determination system (MODS) with the turntable. The average RMSE of estimated orientation are less than 0.4° and 1° during the static and low-dynamic tests, respectively. More realistic tests on two-wheel self-balancing vehicle driving and indoor pedestrian walking were carried out to evaluate the performance of the designed MODS when high accelerations and angular rates were introduced. Test results demonstrate that the MODS is applicable for the orientation estimation under various dynamic conditions. This paper provides a feasible alternative for low-cost orientation determination.
Zhang, Shengzhi; Yu, Shuai; Liu, Chaojun; Yuan, Xuebing; Liu, Sheng
2016-01-01
To provide a long-time reliable orientation, sensor fusion technologies are widely used to integrate available inertial sensors for the low-cost orientation estimation. In this paper, a novel dual-linear Kalman filter was designed for a multi-sensor system integrating MEMS gyros, an accelerometer, and a magnetometer. The proposed filter precludes the impacts of magnetic disturbances on the pitch and roll which the heading is subjected to. The filter can achieve robust orientation estimation for different statistical models of the sensors. The root mean square errors (RMSE) of the estimated attitude angles are reduced by 30.6% under magnetic disturbances. Owing to the reduction of system complexity achieved by smaller matrix operations, the mean total time consumption is reduced by 23.8%. Meanwhile, the separated filter offers greater flexibility for the system configuration, as it is possible to switch on or off the second stage filter to include or exclude the magnetometer compensation for the heading. Online experiments were performed on the homemade miniature orientation determination system (MODS) with the turntable. The average RMSE of estimated orientation are less than 0.4° and 1° during the static and low-dynamic tests, respectively. More realistic tests on two-wheel self-balancing vehicle driving and indoor pedestrian walking were carried out to evaluate the performance of the designed MODS when high accelerations and angular rates were introduced. Test results demonstrate that the MODS is applicable for the orientation estimation under various dynamic conditions. This paper provides a feasible alternative for low-cost orientation determination. PMID:26907294
NASA Astrophysics Data System (ADS)
Zhang, Ping
Microelectromechanical systems (MEMS) have a wide range of applications. In the field of wireless and microwave technology, considerable attention has been given to the development and integration of MEMS-based RF (radio frequency) components. An RF MEMS switch requires low insertion loss, high isolation, and low actuation voltage - electrical aspects that have been extensively studied. The mechanical requirements of the switch, such as low sensitivity to built-in stress and high reliability, greatly depend on the micromechanical properties of the switch materials, and have not been thoroughly explored. RF MEMS switches are typically in the form of a free-standing thin film structure. Large stress gradients and across-wafer stress variations developed during fabrication severely degrade their electrical performance. A micromachined stress measurement sensor has been developed that can potentially be employed for in-situ monitoring of stress evolution and stress variation. The sensors were micromachined using five masks on two wafer levels, each measuring 5x3x1 mm. They function by means of an electron tunneling mechanism, where a 2x2 mm silicon nitride membrane elastically deflects under an applied deflection voltage via an external feedback circuitry. For the current design, the sensors are capable of measuring tensile stresses up to the GPa range under deflection voltages of 50--100 V. Sensor functionality was studied by finite element modeling and a theoretical analysis of square membrane deflection. While the mechanical properties of thin films on substrates have been extensively studied, studies of free-standing thin films have been limited due to the practical difficulties in sample handling and testing. Free-standing Al and Al-Ti thin films specimens have been successfully fabricated and microtensile and stress relaxation tests have been performed using a custom-designed micromechanical testing apparatus. A dedicated TEM (transmission electron microscopy) sample preparation technique allows the investigation of the microstructures of these thin films both before and after mechanical testing to correlate the microstructural findings with the mechanical behavior. Major studies include grain boundary strengthening in pure Al, plastic deformation in pure Al by inhomogeneous deformation and localized grain thinning, solid solution and precipitate strengthening in Al-Ti alloys, and stress relaxation of Al and Al-Ti.
On-Chip Transport of Biological Fluids in MEMS Devices
1999-02-01
this model has been extended for multi-dimensional geometries to simulate electroosmotic flow in microdevices. Electrophoresis model in CFD- ACE + will...integrated with CFD- ACE +. 7.0 REFERENCES 1. N. A. Patankar and H. H. Hu, "Numerical Simulation of Electroosmotic Flow," Analytical Chemistry, 70...Electroosmosis has been developed and successfully integrated with CFD- ACE + code. (ii) Extension of the above-mentioned model to simulate
Strong Motion Seismograph Based On MEMS Accelerometer
NASA Astrophysics Data System (ADS)
Teng, Y.; Hu, X.
2013-12-01
The MEMS strong motion seismograph we developed used the modularization method to design its software and hardware.It can fit various needs in different application situation.The hardware of the instrument is composed of a MEMS accelerometer,a control processor system,a data-storage system,a wired real-time data transmission system by IP network,a wireless data transmission module by 3G broadband,a GPS calibration module and power supply system with a large-volumn lithium battery in it. Among it,the seismograph's sensor adopted a three-axis with 14-bit high resolution and digital output MEMS accelerometer.Its noise level just reach about 99μg/√Hz and ×2g to ×8g dynamically selectable full-scale.Its output data rates from 1.56Hz to 800Hz. Its maximum current consumption is merely 165μA,and the device is so small that it is available in a 3mm×3mm×1mm QFN package. Furthermore,there is access to both low pass filtered data as well as high pass filtered data,which minimizes the data analysis required for earthquake signal detection. So,the data post-processing can be simplified. Controlling process system adopts a 32-bit low power consumption embedded ARM9 processor-S3C2440 and is based on the Linux operation system.The processor's operating clock at 400MHz.The controlling system's main memory is a 64MB SDRAM with a 256MB flash-memory.Besides,an external high-capacity SD card data memory can be easily added.So the system can meet the requirements for data acquisition,data processing,data transmission,data storage,and so on. Both wired and wireless network can satisfy remote real-time monitoring, data transmission,system maintenance,status monitoring or updating software.Linux was embedded and multi-layer designed conception was used.The code, including sensor hardware driver,the data acquisition,earthquake setting out and so on,was written on medium layer.The hardware driver consist of IIC-Bus interface driver, IO driver and asynchronous notification driver. The application program layer mainly concludes: earthquake parameter module, local database managing module, data transmission module, remote monitoring, FTP service and so on. The application layer adopted multi-thread process. The whole strong motion seismograph was encapsulated in a small aluminum box, which size is 80mm×120mm×55mm. The inner battery can work continuesly more than 24 hours. The MEMS accelerograph uses modular design for its software part and hardware part. It has remote software update function and can meet the following needs: a) Auto picking up the earthquake event; saving the data on wave-event files and hours files; It may be used for monitoring strong earthquake, explosion, bridge and house health. b) Auto calculate the earthquake parameters, and transferring those parameters by 3G wireless broadband network. This kind of seismograph has characteristics of low cost, easy installation. They can be concentrated in the urban region or areas need to specially care. We can set up a ground motion parameters quick report sensor network while large earthquake break out. Then high-resolution-fine shake-map can be easily produced for the need of emergency rescue. c) By loading P-wave detection program modules, it can be used for earthquake early warning for large earthquakes; d) Can easily construct a high-density layout seismic monitoring network owning remote control and modern intelligent earthquake sensor.
NASA Astrophysics Data System (ADS)
Fink, Wolfgang; George, Thomas; Tarbell, Mark A.
2007-04-01
Robotic reconnaissance operations are called for in extreme environments, not only those such as space, including planetary atmospheres, surfaces, and subsurfaces, but also in potentially hazardous or inaccessible operational areas on Earth, such as mine fields, battlefield environments, enemy occupied territories, terrorist infiltrated environments, or areas that have been exposed to biochemical agents or radiation. Real time reconnaissance enables the identification and characterization of transient events. A fundamentally new mission concept for tier-scalable reconnaissance of operational areas, originated by Fink et al., is aimed at replacing the engineering and safety constrained mission designs of the past. The tier-scalable paradigm integrates multi-tier (orbit atmosphere surface/subsurface) and multi-agent (satellite UAV/blimp surface/subsurface sensing platforms) hierarchical mission architectures, introducing not only mission redundancy and safety, but also enabling and optimizing intelligent, less constrained, and distributed reconnaissance in real time. Given the mass, size, and power constraints faced by such a multi-platform approach, this is an ideal application scenario for a diverse set of MEMS sensors. To support such mission architectures, a high degree of operational autonomy is required. Essential elements of such operational autonomy are: (1) automatic mapping of an operational area from different vantage points (including vehicle health monitoring); (2) automatic feature extraction and target/region-of-interest identification within the mapped operational area; and (3) automatic target prioritization for close-up examination. These requirements imply the optimal deployment of MEMS sensors and sensor platforms, sensor fusion, and sensor interoperability.
High quality factor single-crystal diamond mechanical resonators
NASA Astrophysics Data System (ADS)
Ovartchaiyapong, P.; Pascal, L. M. A.; Myers, B. A.; Lauria, P.; Bleszynski Jayich, A. C.
2012-10-01
Single-crystal diamond is a promising material for microelectromechanical systems (MEMs) because of its low mechanical loss, compatibility with extreme environments, and built-in interface to high-quality spin centers. But its use has been limited by challenges in processing and growth. We demonstrate a wafer bonding-based technique to form diamond on insulator, from which we make single-crystal diamond micromechanical resonators with mechanical quality factors as high as 338 000 at room temperature. Variable temperature measurements down to 10 K reveal a nonmonotonic dependence of quality factor on temperature. These resonators enable integration of single-crystal diamond into MEMs technology for classical and quantum applications.
Parylene-based active micro space radiator with thermal contact switch
DOE Office of Scientific and Technical Information (OSTI.GOV)
Ueno, Ai; Suzuki, Yuji
2014-03-03
Thermal management is crucial for highly functional spacecrafts exposed to large fluctuations of internal heat dissipation and/or thermal boundary conditions. Since thermal radiation is the only means for heat removal, effective control of radiation is required for advanced space missions. In the present study, a MEMS (Micro Electro Mechanical Systems) active radiator using the contact resistance change has been proposed. Unlike previous bulky thermal louvers/shutters, higher fill factor can be accomplished with an array of electrostatically driven micro diaphragms suspended with polymer tethers. With an early prototype developed with parylene MEMS technologies, radiation heat flux enhancement up to 42% hasmore » been achieved.« less
Applications of Ferro-Nanofluid on a Micro-Transformer
Tsai, Tsung-Han; Kuo, Long-Sheng; Chen, Ping-Hei; Lee, Da-sheng; Yang, Chin-Ting
2010-01-01
An on-chip transformer with a ferrofluid magnetic core has been developed and tested. The transformer consists of solenoid-type coil and a magnetic core of ferrofluid, with the former fabricated by MEMS technology and the latter by a chemical co-precipitation method. The performance of the MEMS transformer with a ferrofluid magnetic core was measured and simulated with frequencies ranging from 100 kHz to 100 MHz. Experimental results reveal that the presence of the ferrofluid increases the inductance of coils and the coupling coefficient of transformer; however, it also increases the resistance owing to the lag between the external magnetic field and the magnetization of the material. PMID:22163647
Applications of ferro-nanofluid on a micro-transformer.
Tsai, Tsung-Han; Kuo, Long-Sheng; Chen, Ping-Hei; Lee, Da-Sheng; Yang, Chin-Ting
2010-01-01
An on-chip transformer with a ferrofluid magnetic core has been developed and tested. The transformer consists of solenoid-type coil and a magnetic core of ferrofluid, with the former fabricated by MEMS technology and the latter by a chemical co-precipitation method. The performance of the MEMS transformer with a ferrofluid magnetic core was measured and simulated with frequencies ranging from 100 kHz to 100 MHz. Experimental results reveal that the presence of the ferrofluid increases the inductance of coils and the coupling coefficient of transformer; however, it also increases the resistance owing to the lag between the external magnetic field and the magnetization of the material.
Strategies for dynamic soft-landing in capacitive microelectromechanical switches
NASA Astrophysics Data System (ADS)
Jain, Ankit; Nair, Pradeep R.; Alam, Muhammad A.
2011-06-01
Electromechanical dielectric degradation associated with the hard landing of movable electrode is a technology-inhibiting reliability concern for capacitive RF-MEMS switches. In this letter, we propose two schemes for dynamic soft-landing that obviate the need for external feedback circuitry. Instead, the proposed resistive and capacitive braking schemes can reduce impact velocity significantly without compromising other performance characteristics like pull-in voltage and pull-in time. Resistive braking is achieved by inserting a resistance in series with the voltage source whereas capacitive braking requires patterning of the electrode or the dielectric. Our results have important implications to the design and optimization of reliability aware electrostatically actuated MEMS switches.
System-in Package of Integrated Humidity Sensor Using CMOS-MEMS Technology.
Lee, Sung Pil
2015-10-01
Temperature/humidity microchips with micropump were fabricated using a CMOS-MEMS process and combined with ZigBee modules to implement a sensor system in package (SIP) for a ubiquitous sensor network (USN) and/or a wireless communication system. The current of a diode temperature sensor to temperature and a normalized current of FET humidity sensor to relative humidity showed linear characteristics, respectively, and the use of the micropump has enabled a faster response. A wireless reception module using the same protocol as that in transmission systems processed the received data within 10 m and showed temperature and humidity values in the display.
MEMS deformable mirror for wavefront correction of large telescopes
NASA Astrophysics Data System (ADS)
Manhart, Sigmund; Vdovin, Gleb; Collings, Neil; Sodnik, Zoran; Nikolov, Susanne; Hupfer, Werner
2017-11-01
A 50 mm diameter membrane mirror was designed and manufactured at TU Delft. It is made from bulk silicon by micromachining - a technology primarily used for micro-electromechanical systems (MEMS). The mirror unit is equipped with 39 actuator electrodes and can be electrostatically deformed to correct wavefront errors in optical imaging systems. Performance tests on the deformable mirror were carried out at Astrium GmbH using a breadboard setup with a wavefront sensor and a closed-loop control system. It was found that the deformable membrane mirror is well suited for correction of low order wavefront errors as they must be expected in lightweighted space telescopes.
Modelling of mercury emissions from background soils.
Scholtz, M T; Van Heyst, B J; Schroeder, W H
2003-03-20
Emissions of volatile mercury species from natural soils are believed to be a significant contributor to the atmospheric burden of mercury, but only order-of-magnitude estimates of emissions from these sources are available. The scaling-up of mercury flux measurements to regional or global scales is confounded by a limited understanding of the physical, chemical and biochemical processes that occur in the soil, a complex environmental matrix. This study is a first step toward the development of an air-surface exchange model for mercury (known as the mercury emission model (MEM)). The objective of the study is to model the partitioning and movement of inorganic Hg(II) and Hg(0) in open field soils, and to use MEM to interpret published data on mercury emissions to the atmosphere. MEM is a multi-layered, dynamic finite-element soil and atmospheric surface-layer model that simulates the exchange of heat, moisture and mercury between soils and the atmosphere. The model includes a simple formulation of the reduction of inorganic Hg(II) to Hg(0). Good agreement was found between the meteorological dependence of observed mercury emission fluxes, and hourly modelled fluxes, and it is concluded that MEM is able to simulate well the soil and atmospheric processes influencing the emission of Hg(0) to the atmosphere. The heretofore unexplained close correlation between soil temperature and mercury emission flux is fully modelled by MEM and is attributed to the temperature dependence of the Hg(0) Henry's Law coefficient and the control of the volumetric soil-air fraction on the diffusion of Hg(0) near the surface. The observed correlation between solar radiation intensity and mercury flux, appears in part to be due to the surface-energy balance between radiation, and sensible and latent heat fluxes which determines the soil temperature. The modelled results imply that empirical correlations that are based only on flux chamber data, may not extend to the open atmosphere for all weather scenarios.
A polymer-based Fabry-Perot filter integrated with 3-D MEMS structures
NASA Astrophysics Data System (ADS)
Zhang, Ping (Cerina); Le, Kevin; Malalur-Nagaraja-Rao, Smitha; Hsu, Lun-Chen; Chiao, J.-C.
2006-01-01
Polymers have been considered as one of the most versatile materials in making optical devices for communication and sensor applications. They provide good optical transparency to form filters, lenses and many optical components with ease of fabrication. They are scalable and compatible in dimensions with requirements in optics and can be fabricated on inorganic substrates, such as silicon and quartz. Recent polymer synthesis also made great progresses on conductive and nonlinear polymers, opening opportunities for new applications. In this paper, we discussed hybrid-material integration of polymers on silicon-based microelectromechanical system (MEMS) devices. The motivation is to combine the advantages of demonstrated silicon-based MEMS actuators and excellent optical performance of polymers. We demonstrated the idea with a polymer-based out-of-plane Fabry-Perot filter that can be self-assembled by scratch drive actuators. We utilized a fabrication foundry service, MUMPS (Multi-User MEMS Process), to demonstrate the feasibility and flexibility of integration. The polysilicon, used as the structural material for construction of 3-D framework and actuators, has high absorption in the visible and near infrared ranges. Therefore, previous efforts using a polysilicon layer as optical interfaces suffer from high losses. We applied the organic compound materials on the silicon-based framework within the optical signal propagation path to form the optical interfaces. In this paper, we have shown low losses in the optical signal processing and feasibility of building a thin-film Fabry-Perot filter. We discussed the optical filter designs, mechanical design, actuation mechanism, fabrication issues, optical measurements, and results.
ERIC Educational Resources Information Center
Delale, Feridun; Liaw, Benjamin M.; Jiji, Latif M.; Voiculescu, Ioana; Yu, Honghui
2011-01-01
From October 2003 to April 2008 a systemic reform of the Mechanical Engineering program at The City College of New York was undertaken with the goal of incorporating emerging technologies (such as nanotechnology, biotechnology, Micro-Electro-Mechanical Systems (MEMS), intelligent systems) and new teaching methodologies (such as project based…
Introduction to Micro/Nanofabrication
NASA Astrophysics Data System (ADS)
Ziaie, Babak; Baldi, Antonio; Atashbar, Massood
This chapter outlines and discusses important micro- and nanofabrication techniques. We start with the most basic methods borrowed from the integrated circuit (IC) industry, such as thin film deposition, lithography and etching, and then move on to look at MEMS and nanofabrication technologies. We cover a broad range of dimensions, from the micron to the nanometer scale. Although most of the current research is geared towards the nanodomain, a good understanding of top-down methods for fabricating micron-sized objects can aid our understanding of this research. Due to space constraints, we have focused here on the most important technologies; in the microdomain these include surface, bulk and high aspect ratio micromachining; in the nanodomain we concentrate on e-beam lithography, epitaxial growth, template manufacturing and self-assembly. MEMS technology is maturing rapidly, with some new technologies displacing older ones that have proven to be unsuited to manufacture on a commercial scale. However, the jury is still out on methods used in the nanodomain, although it appears that bottom-up methods are the most feasible, and these will have a major impact in a variety of application areas such as biology, medicine, environmental monitoring and nanoelectronics.
Biomimetic patterned surfaces for controllable friction in micro- and nanoscale devices
NASA Astrophysics Data System (ADS)
Singh, Arvind; Suh, Kahp-Yang
2013-12-01
Biomimetics is the study and simulation of biological systems for desired functional properties. It involves the transformation of underlying principles discovered in nature into man-made technologies. In this context, natural surfaces have significantly inspired and motivated new solutions for micro- and nano-scale devices (e.g., Micro/Nano-Electro-Mechanical Systems, MEMS/NEMS) towards controllable friction, during their operation. As a generic solution to reduce friction at small scale, various thin films/coatings have been employed in the last few decades. In recent years, inspiration from `Lotus Effect' has initiated a new research direction for controllable friction with biomimetic patterned surfaces. By exploiting the intrinsic hydrophobicity and ability to reduce contact area, such micro- or nano-patterned surfaces have demonstrated great strength and potential for applications in MEMS/NEMS devices. This review highlights recent advancements on the design, development and performance of these biomimetic patterned surfaces. Also, we present some hybrid approaches to tackle current challenges in biomimetic tribological applications for MEMS/NEMS devices.
High sensitivity capacitive MEMS microphone with spring supported diaphragm
NASA Astrophysics Data System (ADS)
Mohamad, Norizan; Iovenitti, Pio; Vinay, Thurai
2007-12-01
Capacitive microphones (condenser microphones) work on a principle of variable capacitance and voltage by the movement of its electrically charged diaphragm and back plate in response to sound pressure. There has been considerable research carried out to increase the sensing performance of microphones while reducing their size to cater for various modern applications such as mobile communication and hearing aid devices. This paper reviews the development and current performance of several condenser MEMS microphone designs, and introduces a microphone with spring supported diaphragm to further improve condenser microphone performance. The numerical analysis using Coventor FEM software shows that this new microphone design has a higher mechanical sensitivity compared to the existing edge clamped flat diaphragm condenser MEMS microphone. The spring supported diaphragm is shown to have a flat frequency response up to 7 kHz and more stable under the variations of the diaphragm residual stress. The microphone is designed to be easily fabricated using the existing silicon fabrication technology and the stability against the residual stress increases its reproducibility.
The Electrophysiological MEMS Device with Micro Channel Array for Cellular Network Analysis
NASA Astrophysics Data System (ADS)
Tonomura, Wataru; Kurashima, Toshiaki; Takayama, Yuzo; Moriguchi, Hiroyuki; Jimbo, Yasuhiko; Konishi, Satoshi
This paper describes a new type of MCA (Micro Channel Array) for simultaneous multipoint measurement of cellular network. Presented MCA employing the measurement principles of the patch-clamp technique is designed for advanced neural network analysis which has been studied by co-authors using 64ch MEA (Micro Electrode Arrays) system. First of all, sucking and clamping of cells through channels of developed MCA is expected to improve electrophysiological signal detections. Electrophysiological sensing electrodes integrated around individual channels of MCA by using MEMS (Micro Electro Mechanical System) technologies are electrically isolated for simultaneous multipoint measurement. In this study, we tested the developed MCA using the non-cultured rat's cerebral cortical slice and the hippocampal neurons. We could measure the spontaneous action potential of the slice simultaneously at multiple points and culture the neurons on developed MCA. Herein, we describe the experimental results together with the design and fabrication of the electrophysiological MEMS device with MCA for cellular network analysis.
NASA Astrophysics Data System (ADS)
Varady, M. J.; McLeod, L.; Meacham, J. M.; Degertekin, F. L.; Fedorov, A. G.
2007-09-01
Portable fuel cells are an enabling technology for high efficiency and ultra-high density distributed power generation, which is essential for many terrestrial and aerospace applications. A key element of fuel cell power sources is the fuel processor, which should have the capability to efficiently reform liquid fuels and produce high purity hydrogen that is consumed by the fuel cells. To this end, we are reporting on the development of two novel MEMS hydrogen generators with improved functionality achieved through an innovative process organization and system integration approach that exploits the advantages of transport and catalysis on the micro/nano scale. One fuel processor design utilizes transient, reverse-flow operation of an autothermal MEMS microreactor with an intimately integrated, micromachined ultrasonic fuel atomizer and a Pd/Ag membrane for in situ hydrogen separation from the product stream. The other design features a simpler, more compact planar structure with the atomized fuel ejected directly onto the catalyst layer, which is coupled to an integrated hydrogen selective membrane.
A Capacitance-To-Digital Converter for MEMS Sensors for Smart Applications.
Pérez Sanjurjo, Javier; Prefasi, Enrique; Buffa, Cesare; Gaggl, Richard
2017-06-07
The use of MEMS sensors has been increasing in recent years. To cover all the applications, many different readout circuits are needed. To reduce the cost and time to market, a generic capacitance-to-digital converter (CDC) seems to be the logical next step. This work presents a configurable CDC designed for capacitive MEMS sensors. The sensor is built with a bridge of MEMS, where some of them function with pressure. Then, the capacitive to digital conversion is realized using two steps. First, a switched-capacitor (SC) preamplifier is used to make the capacitive to voltage (C-V) conversion. Second, a self-oscillated noise-shaping integrating dual-slope (DS) converter is used to digitize this magnitude. The proposed converter uses time instead of amplitude resolution to generate a multibit digital output stream. In addition it performs noise shaping of the quantization error to reduce measurement time. This article shows the effectiveness of this method by measurements performed on a prototype, designed and fabricated using standard 0.13 µm CMOS technology. Experimental measurements show that the CDC achieves a resolution of 17 bits, with an effective area of 0.317 mm², which means a pressure resolution of 1 Pa, while consuming 146 µA from a 1.5 V power supply.
Fan, Shicheng; Dan, Li; Meng, Lingju; Zheng, Wei; Elias, Anastasia; Wang, Xihua
2017-11-09
Flexible force/pressure sensors are of interest for academia and industry and have applications in wearable technologies. Most of such sensors on the market or reported in journal publications are based on the operation mechanism of probing capacitance or resistance changes of the materials under pressure. Recently, we reported the microelectromechanical (MEM) sensors based on a different mechanism: mechanical switches. Multiples of such MEM sensors can be integrated to achieve the same function of regular force/pressure sensors while having the advantages of ease of fabrication and long-term stability in operation. Herein, we report the dramatically improved response time (more than one order of magnitude) of these MEM sensors by employing eco-friendly nanomaterials-cellulose nanocrystals. For instance, the incorporation of polydimethysiloxane filled with cellulose nanocrystals shortened the response time of MEM sensors from sub-seconds to several milliseconds, leading to the detection of both diastolic and systolic pressures in the radial arterial blood pressure measurement. Comprehensive mechanical and electrical characterization of the materials and the devices reveal that greatly enhanced storage modulus and loss modulus play key roles in this improved response time. The demonstrated fast-response flexible sensors enabled continuous monitoring of heart rate and complex cardiovascular signals using pressure sensors for future wearable sensing platforms.