Sample records for multichip module technology

  1. Multichip module technology for automotive application

    NASA Astrophysics Data System (ADS)

    Johnson, R. Wayne; Evans, John L.; Bosley, Larry

    1995-01-01

    Advancements in multichip module technology are creating design freedoms previously unavailable to design engineers. These advancements are opening new markets for laminate based multichip module products. In particular, material improvements in laminate printed wiring boards are allowing multichip module technology to meet more stringent environmental conditions. In addition, improvements in encapsulants and adhesives are enhancing the capabilities of multichip module technology to meet harsh environment. Furthermore, improvements in manufacturing techniques are providing the reliability improvements necessary for use in high quality electronic systems. These advances are making multichip module technology viable for high volume, harsh environment applications like under-the-hood automotive electronics. This paper will provide a brief review of multichip module technology, a discussion of specific research activities with Chrysler for use of multichip modules in automotive engine controllers and finally a discussion of prototype multichip modules fabricated and tested.

  2. Compact Multimedia Systems in Multi-chip Module Technology

    NASA Technical Reports Server (NTRS)

    Fang, Wai-Chi; Alkalaj, Leon

    1995-01-01

    This tutorial paper shows advanced multimedia system designs based on multi-chip module (MCM) technologies that provide essential computing, compression, communication, and storage capabilities for various large scale information highway applications.!.

  3. Tunneling Accelerometer Multichip Module

    NASA Technical Reports Server (NTRS)

    Boyadzhyan, V. V.; Choma, J., Jr.

    1998-01-01

    This paper summarizes and reports a radiation hardened Spacecraft Integrated Sensor/Circut Technology that has been delivered for flight applications to be flown on board STRV-2 (Space Technology Research Vehicle-2).

  4. An ultra-compact processor module based on the R3000

    NASA Astrophysics Data System (ADS)

    Mullenhoff, D. J.; Kaschmitter, J. L.; Lyke, J. C.; Forman, G. A.

    1992-08-01

    Viable high density packaging is of critical importance for future military systems, particularly space borne systems which require minimum weight and size and high mechanical integrity. A leading, emerging technology for high density packaging is multi-chip modules (MCM). During the 1980's, a number of different MCM technologies have emerged. In support of Strategic Defense Initiative Organization (SDIO) programs, Lawrence Livermore National Laboratory (LLNL) has developed, utilized, and evaluated several different MCM technologies. Prior LLNL efforts include modules developed in 1986, using hybrid wafer scale packaging, which are still operational in an Air Force satellite mission. More recent efforts have included very high density cache memory modules, developed using laser pantography. As part of the demonstration effort, LLNL and Phillips Laboratory began collaborating in 1990 in the Phase 3 Multi-Chip Module (MCM) technology demonstration project. The goal of this program was to demonstrate the feasibility of General Electric's (GE) High Density Interconnect (HDI) MCM technology. The design chosen for this demonstration was the processor core for a MIPS R3000 based reduced instruction set computer (RISC), which has been described previously. It consists of the R3000 microprocessor, R3010 floating point coprocessor and 128 Kbytes of cache memory.

  5. Programmable Multi-Chip Module

    DOEpatents

    Kautz, David; Morgenstern, Howard; Blazek, Roy J.

    2005-05-24

    A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.

  6. Programmable Multi-Chip Module

    DOEpatents

    Kautz, David; Morgenstern, Howard; Blazek, Roy J.

    2004-11-16

    A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.

  7. Programmable multi-chip module

    DOEpatents

    Kautz, David; Morgenstern, Howard; Blazek, Roy J.

    2004-03-02

    A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.

  8. Technology transfer of military space microprocessor developments

    NASA Astrophysics Data System (ADS)

    Gorden, C.; King, D.; Byington, L.; Lanza, D.

    1999-01-01

    Over the past 13 years the Air Force Research Laboratory (AFRL) has led the development of microprocessors and computers for USAF space and strategic missile applications. As a result of these Air Force development programs, advanced computer technology is available for use by civil and commercial space customers as well. The Generic VHSIC Spaceborne Computer (GVSC) program began in 1985 at AFRL to fulfill a deficiency in the availability of space-qualified data and control processors. GVSC developed a radiation hardened multi-chip version of the 16-bit, Mil-Std 1750A microprocessor. The follow-on to GVSC, the Advanced Spaceborne Computer Module (ASCM) program, was initiated by AFRL to establish two industrial sources for complete, radiation-hardened 16-bit and 32-bit computers and microelectronic components. Development of the Control Processor Module (CPM), the first of two ASCM contract phases, concluded in 1994 with the availability of two sources for space-qualified, 16-bit Mil-Std-1750A computers, cards, multi-chip modules, and integrated circuits. The second phase of the program, the Advanced Technology Insertion Module (ATIM), was completed in December 1997. ATIM developed two single board computers based on 32-bit reduced instruction set computer (RISC) processors. GVSC, CPM, and ATIM technologies are flying or baselined into the majority of today's DoD, NASA, and commercial satellite systems.

  9. A 1-Gigabit Memory System on a multi-Chip Module for Space Applications

    NASA Technical Reports Server (NTRS)

    Louie, Marianne E.; Topliffe, Douglas A.; Alkalai, Leon

    1996-01-01

    Current spaceborne applications desire compact, low weight, and high capacity data storage systems along with the additional requirement of radiation tolerance. This paper discusses a memory system on a multi-chip module (MCM) that is designed for space applications.

  10. Three dimensional, multi-chip module

    DOEpatents

    Bernhardt, A.F.; Petersen, R.W.

    1993-08-31

    A plurality of multi-chip modules are stacked and bonded around the perimeter by sold-bump bonds to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design considerations of the chip set. The multi-chip modules comprise a circuit board, having a planarized interconnect structure formed on a first major surface, and integrated circuit chips bonded to the planarized interconnect surface. Around the periphery of each circuit board, long, narrow dummy chips'' are bonded to the finished circuit board to form a perimeter wall. The wall is higher than any of the chips on the circuit board, so that the flat back surface of the board above will only touch the perimeter wall. Module-to-module interconnect is laser-patterned on the sides of the boards and over the perimeter wall in the same way and at the same time that chip to board interconnect may be laser-patterned.

  11. Three dimensional, multi-chip module

    DOEpatents

    Bernhardt, Anthony F.; Petersen, Robert W.

    1993-01-01

    A plurality of multi-chip modules are stacked and bonded around the perimeter by sold-bump bonds to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design considerations of the chip set. The multi-chip modules comprise a circuit board, having a planarized interconnect structure formed on a first major surface, and integrated circuit chips bonded to the planarized interconnect surface. Around the periphery of each circuit board, long, narrow "dummy chips" are bonded to the finished circuit board to form a perimeter wall. The wall is higher than any of the chips on the circuit board, so that the flat back surface of the board above will only touch the perimeter wall. Module-to-module interconnect is laser-patterned o the sides of the boards and over the perimeter wall in the same way and at the same time that chip to board interconnect may be laser-patterned.

  12. Reliability assessment of Multichip Module technologies via the Triservice/NASA RELTECH program

    NASA Astrophysics Data System (ADS)

    Fayette, Daniel F.

    1994-10-01

    Multichip Module (MCM) packaging/interconnect technologies have seen increased emphasis from both the commercial and military communities as a means of increasing capability and performance while providing a vehicle for reducing cost, power and weight of the end item electronic application. This is accomplished through three basic Multichip module technologies, MCM-L that are laminates, MCM-C that are ceramic type substrates and MCM-D that are deposited substrates (e.g., polymer dielectric with thin film metals). Three types of interconnect structures are also used with these substrates and include, wire bond, Tape Automated Bonds (TAB) and flip chip ball bonds. Application, cost, producibility and reliability are the drivers that will determine which MCM technology will best fit a respective need or requirement. With all the benefits and technologies cited, it would be expected that the use of, or the planned use of, MCM's would be more extensive in both military and commercial applications. However, two significant roadblocks exist to implementation of these new technologies: the absence of reliability data and a single national standard for the procurement of reliable/quality MCM's. To address the preceding issues, the Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH) program has been established. This program, which began in May 1992, has endeavored to evaluate a cross section of MCM technologies covering all classes of MCM's previously cited. NASA and the Tri-Services (Air Force Rome Laboratory, Naval Surface Warfare Center, Crane IN and Army Research Laboratory) have teamed together with sponsorship from ARPA to evaluate the performance, reliability and producibility of MCM's for both military and commercial usage. This is done in close cooperation with our industry partners whose support is critical to the goals of the program. Several tasks are being performed by the RELTECH program and data from this effort, in conjunction with information from our industry partners as well as discussions with industry organizations (IPC, EIA, ISHM, etc.) are being used to develop the qualification and screening requirements for MCM's. Specific tasks being performed by the RELTECH program include technical assessments, product evaluations, reliability modeling, environmental testing, and failure analysis. This paper will describe the various tasks associated with the RELTECH program, status, progress and a description of the national dual use specification being developed for MCM technologies.

  13. Two-Stage, 90-GHz, Low-Noise Amplifier

    NASA Technical Reports Server (NTRS)

    Samoska, Lorene A.; Gaier, Todd C.; Xenos, Stephanie; Soria, Mary M.; Kangaslahti, Pekka P.; Cleary, Kieran A.; Ferreira, Linda; Lai, Richard; Mei, Xiaobing

    2010-01-01

    A device has been developed for coherent detection of the polarization of the cosmic microwave background (CMB). A two-stage amplifier has been designed that covers 75-110 GHz. The device uses the emerging 35-nm InP HEMT technology recently developed at Northrop Grumman Corporation primarily for use at higher frequencies. The amplifier has more than 18 dB gain and less than 35 K noise figure across the band. These devices have noise less than 30 K at 100 GHz. The development started with design activities at JPL, as well as characterization of multichip modules using existing InP. Following processing, a test campaign was carried out using single-chip modules at 100 GHz. Successful development of the chips will lead to development of multichip modules, with simultaneous Q and U Stokes parameter detection. This MMIC (monolithic microwave integrated circuit) amplifier takes advantage of performance improvements intended for higher frequencies, but in this innovation are applied at 90 GHz. The large amount of available gain ultimately leads to lower possible noise performance at 90 GHz.

  14. Miniature MMIC Low Mass/Power Radiometer Modules for the 180 GHz GeoSTAR Array

    NASA Technical Reports Server (NTRS)

    Kangaslahti, Pekka; Tanner, Alan; Pukala, David; Lambrigtsen, Bjorn; Lim, Boon; Mei, Xiaobing; Lai, Richard

    2010-01-01

    We have developed and demonstrated miniature 180 GHz Monolithic Microwave Integrated Circuit (MMIC) radiometer modules that have low noise temperature, low mass and low power consumption. These modules will enable the Geostationary Synthetic Thinned Aperture Radiometer (GeoSTAR) of the Precipitation and All-weather Temperature and Humidity (PATH) Mission for atmospheric temperature and humidity profiling. The GeoSTAR instrument has an array of hundreds of receivers. Technology that was developed included Indium Phosphide (InP) MMIC Low Noise Amplifiers (LNAs) and second harmonic MMIC mixers and I-Q mixers, surface mount Multi-Chip Module (MCM) packages at 180 GHz, and interferometric array at 180 GHz. A complete MMIC chip set for the 180 GHz receiver modules (LNAs and I-Q Second harmonic mixer) was developed. The MMIC LNAs had more than 50% lower noise temperature (NT=300K) than previous state-of-art and MMIC I-Q mixers demonstrated low LO power (3 dBm). Two lots of MMIC wafers were processed with very high DC transconductance of up to 2800 mS/mm for the 35 nm gate length devices. Based on these MMICs a 180 GHz Multichip Module was developed that had a factor of 100 lower mass/volume (16x18x4.5 mm3, 3g) than previous generation 180 GHz receivers.

  15. FERMI: a digital Front End and Readout MIcrosystem for high resolution calorimetry

    NASA Astrophysics Data System (ADS)

    Alexanian, H.; Appelquist, G.; Bailly, P.; Benetta, R.; Berglund, S.; Bezamat, J.; Blouzon, F.; Bohm, C.; Breveglieri, L.; Brigati, S.; Cattaneo, P. W.; Dadda, L.; David, J.; Engström, M.; Genat, J. F.; Givoletti, M.; Goggi, V. G.; Gong, S.; Grieco, G. M.; Hansen, M.; Hentzell, H.; Holmberg, T.; Höglund, I.; Inkinen, S. J.; Kerek, A.; Landi, C.; Ledortz, O.; Lippi, M.; Lofstedt, B.; Lund-Jensen, B.; Maloberti, F.; Mutz, S.; Nayman, P.; Piuri, V.; Polesello, G.; Sami, M.; Savoy-Navarro, A.; Schwemling, P.; Stefanelli, R.; Sundblad, R.; Svensson, C.; Torelli, G.; Vanuxem, J. P.; Yamdagni, N.; Yuan, J.; Ödmark, A.; Fermi Collaboration

    1995-02-01

    We present a digital solution for the front-end electronics of high resolution calorimeters at future colliders. It is based on analogue signal compression, high speed {A}/{D} converters, a fully programmable pipeline and a digital signal processing (DSP) chain with local intelligence and system supervision. This digital solution is aimed at providing maximal front-end processing power by performing waveform analysis using DSP methods. For the system integration of the multichannel device a multi-chip, silicon-on-silicon multi-chip module (MCM) has been adopted. This solution allows a high level of integration of complex analogue and digital functions, with excellent flexibility in mixing technologies for the different functional blocks. This type of multichip integration provides a high degree of reliability and programmability at both the function and the system level, with the additional possibility of customising the microsystem to detector-specific requirements. For enhanced reliability in high radiation environments, fault tolerance strategies, i.e. redundancy, reconfigurability, majority voting and coding for error detection and correction, are integrated into the design.

  16. Designing an Electronics Data Package for Printed Circuit Boards (PCBs)

    DTIC Science & Technology

    2013-08-01

    finished PCB flatness deviation should be less than 0.010 inches per inch. 4  The minimum copper wall thickness of plated-thru holes should be...Memory Card International Association)  IPC-6015 MCM-L (Multi-Chip Module – Laminated )  IPC-6016 HDI (High Density Interconnect)  IPC-6018...Interconnect ICT In Circuit Tester IPC Association Connecting Electronics Industries MCM-L Multi-Chip Module – Laminated MIL Military NEMA National

  17. Ultra low power CMOS technology

    NASA Technical Reports Server (NTRS)

    Burr, J.; Peterson, A.

    1991-01-01

    This paper discusses the motivation, opportunities, and problems associated with implementing digital logic at very low voltages, including the challenge of making use of the available real estate in 3D multichip modules, energy requirements of very large neural networks, energy optimization metrics and their impact on system design, modeling problems, circuit design constraints, possible fabrication process modifications to improve performance, and barriers to practical implementation.

  18. Advanced Interconnect Roadmap for Space Applications

    NASA Technical Reports Server (NTRS)

    Galbraith, Lissa

    1999-01-01

    This paper presents the NASA electronic parts and packaging program for space applications. The topics include: 1) Forecasts; 2) Technology Challenges; 3) Research Directions; 4) Research Directions for Chip on Board (COB); 5) Research Directions for HDPs: Multichip Modules (MCMs); 6) Research Directions for Microelectromechanical systems (MEMS); 7) Research Directions for Photonics; and 8) Research Directions for Materials. This paper is presented in viewgraph form.

  19. An introduction to NASA's advanced computing program: Integrated computing systems in advanced multichip modules

    NASA Technical Reports Server (NTRS)

    Fang, Wai-Chi; Alkalai, Leon

    1996-01-01

    Recent changes within NASA's space exploration program favor the design, implementation, and operation of low cost, lightweight, small and micro spacecraft with multiple launches per year. In order to meet the future needs of these missions with regard to the use of spacecraft microelectronics, NASA's advanced flight computing (AFC) program is currently considering industrial cooperation and advanced packaging architectures. In relation to this, the AFC program is reviewed, considering the design and implementation of NASA's AFC multichip module.

  20. Thermal Characterization for a Modular 3-D Multichip Module

    NASA Technical Reports Server (NTRS)

    Fan, Mark S.; Plante, Jeannette; Shaw, Harry

    2000-01-01

    NASA Goddard Space Flight Center has designed a high-density modular 3-D multichip module (MCM) for future spaceflight use. This MCM features a complete modular structure, i.e., each stack can be removed from the package without damaging the structure. The interconnection to the PCB is through the Column Grid Array (CGA) technology. Because of its high-density nature, large power dissipation from multiple layers of circuitry is anticipated and CVD diamond films are used in the assembly for heat conduction enhancement. Since each stacked layer dissipates certain amount of heat, designing effective heat conduction paths through each stack and balancing the heat dissipation within each stack for optimal thermal performance become a challenging task. To effectively remove the dissipated heat from the package, extensive thermal analysis has been performed with finite element methods. Through these analyses, we are able to improve the thermal design and increase the total wattage of the package for maximum electrical performance. This paper provides details on the design-oriented thermal analysis and performance enhancement. It also addresses issues relating to contact thermal resistance between the diamond film and the metallic heat conduction paths.

  1. JPRS Report, Science & Technology Europe

    DTIC Science & Technology

    1992-08-12

    Head on Chip Industry, Plans [Heinrich von Pierer Interview; Bonn DIE WELT, 15 Jun 92] 33 Swiss Contraves Develops High-Density Multichip Module... Investment costs are low because the method is based on low pressure, 0.1-1.0 MPA, during injection. This permits the use of simpler molds and...For example, ABS Pumpen AG [ABS Pumps German Stock Corporation] in Lohmar needed 1.5 years to define the "Ceramic Compo- nents for Friction

  2. Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

    NASA Astrophysics Data System (ADS)

    Barbagallo, C.; Malgioglio, G. L.; Petrone, G.; Cammarata, G.

    2017-05-01

    For power devices, the reliability of thermal fatigue induced by thermal cycling has been prioritized as an important concern. The main target of this work is to apply a numerical procedure to assess the fatigue life for lead-free solder joints, that represent, in general, the weakest part of the electronic modules. Starting from a real multi-chip power module, FE-based models were built-up by considering different conditions in model implementation in order to simulate, from one hand, the worst working condition for the module and, from another one, the module standing into a climatic test room performing thermal cycles. Simulations were carried-out both in steady and transient conditions in order to estimate the module thermal maps, the stress-strain distributions, the effective plastic strain distributions and finally to assess the number of cycles to failure of the constitutive solder layers.

  3. The Design and Implementation of NASA's Advanced Flight Computing Module

    NASA Technical Reports Server (NTRS)

    Alkakaj, Leon; Straedy, Richard; Jarvis, Bruce

    1995-01-01

    This paper describes a working flight computer Multichip Module developed jointly by JPL and TRW under their respective research programs in a collaborative fashion. The MCM is fabricated by nCHIP and is packaged within a 2 by 4 inch Al package from Coors. This flight computer module is one of three modules under development by NASA's Advanced Flight Computer (AFC) program. Further development of the Mass Memory and the programmable I/O MCM modules will follow. The three building block modules will then be stacked into a 3D MCM configuration. The mass and volume of the flight computer MCM achieved at 89 grams and 1.5 cubic inches respectively, represent a major enabling technology for future deep space as well as commercial remote sensing applications.

  4. Materials Processing and Manufacturing Technologies for Diamond Substrates Multichip Modules

    DTIC Science & Technology

    1994-10-14

    document are those of the authors and should not be intepreted as representing the official policies, either express or implied, of the Defense Advanced...release of the diamond at the end of the deposition step, "* deposition of non-uniform films for stress/flatness control. 75kW Reactor & Modelling Studies...too strong (the film releases partially or not at all) to too weak (the film delaminates during the run from growth stresses), and are continuing to

  5. Advanced flight computer. Special study

    NASA Technical Reports Server (NTRS)

    Coo, Dennis

    1995-01-01

    This report documents a special study to define a 32-bit radiation hardened, SEU tolerant flight computer architecture, and to investigate current or near-term technologies and development efforts that contribute to the Advanced Flight Computer (AFC) design and development. An AFC processing node architecture is defined. Each node may consist of a multi-chip processor as needed. The modular, building block approach uses VLSI technology and packaging methods that demonstrate a feasible AFC module in 1998 that meets that AFC goals. The defined architecture and approach demonstrate a clear low-risk, low-cost path to the 1998 production goal, with intermediate prototypes in 1996.

  6. (abstract) Electronic Packaging for Microspacecraft Applications

    NASA Technical Reports Server (NTRS)

    Wasler, David

    1993-01-01

    The intent of this presentation is to give a brief look into the future of electronic packaging for microspacecraft applications. Advancements in electronic packaging technology areas have developed to the point where a system engineer's visions, concepts, and requirements for a microspacecraft can now be a reality. These new developments are ideal candidates for microspacecraft applications. These technologies are capable of bringing about major changes in how we design future spacecraft while taking advantage of the benefits due to size, weight, power, performance, reliability , and cost. This presentation will also cover some advantages and limitations of surface mount technology (SMT), multichip modules (MCM), and wafer scale integration (WSI), and what is needed to implement these technologies into microspacecraft.

  7. Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH) program

    NASA Astrophysics Data System (ADS)

    Fayette, Daniel F.; Speicher, Patricia; Stoklosa, Mark J.; Evans, Jillian V.; Evans, John W.; Gentile, Mike; Pagel, Chuck A.; Hakim, Edward

    1993-08-01

    A joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screening criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.

  8. Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH) program

    NASA Technical Reports Server (NTRS)

    Fayette, Daniel F.; Speicher, Patricia; Stoklosa, Mark J.; Evans, Jillian V.; Evans, John W.; Gentile, Mike; Pagel, Chuck A.; Hakim, Edward

    1993-01-01

    A joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screening criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.

  9. Smart substrates: Making multi-chip modules smarter

    NASA Astrophysics Data System (ADS)

    Wunsch, T. F.; Treece, R. K.

    1995-05-01

    A novel multi-chip module (MCM) design and manufacturing methodology which utilizes active CMOS circuits in what is normally a passive substrate realizes the 'smart substrate' for use in highly testable, high reliability MCMS. The active devices are used to test the bare substrate, diagnose assembly errors or integrated circuit (IC) failures that require rework, and improve the testability of the final MCM assembly. A static random access memory (SRAM) MCM has been designed and fabricated in Sandia Microelectronics Development Laboratory in order to demonstrate the technical feasibility of this concept and to examine design and manufacturing issues which will ultimately determine the economic viability of this approach. The smart substrate memory MCM represents a first in MCM packaging. At the time the first modules were fabricated, no other company or MCM vendor had incorporated active devices in the substrate to improve manufacturability and testability, and thereby improve MCM reliability and reduce cost.

  10. CVD diamond substrate for microelectronics. Final report

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Burden, J.; Gat, R.

    1996-11-01

    Chemical Vapor Deposition (CVD) of diamond films has evolved dramatically in recent years, and commercial opportunities for diamond substrates in thermal management applications are promising. The objective of this technology transfer initiative (TTI) is for Applied Science and Technology, Inc. (ASTEX) and AlliedSignal Federal Manufacturing and Technologies (FM&T) to jointly develop and document the manufacturing processes and procedures required for the fabrication of multichip module circuits using CVD diamond substrates, with the major emphasis of the project concentrating on lapping/polishing prior to metallization. ASTEX would provide diamond films for the study, and FM&T would use its experience in lapping, polishing,more » and substrate metallization to perform secondary processing on the parts. The primary goal of the project was to establish manufacturing processes that lower the manufacturing cost sufficiently to enable broad commercialization of the technology.« less

  11. Flexible manufacturing for photonics device assembly

    NASA Technical Reports Server (NTRS)

    Lu, Shin-Yee; Pocha, Michael D.; Strand, Oliver T.; Young, K. David

    1994-01-01

    The assembly of photonics devices such as laser diodes, optical modulators, and opto-electronics multi-chip modules (OEMCM), usually requires the placement of micron size devices such as laser diodes, and sub-micron precision attachment between optical fibers and diodes or waveguide modulators (usually referred to as pigtailing). This is a very labor intensive process. Studies done by the opto-electronics (OE) industry have shown that 95 percent of the cost of a pigtailed photonic device is due to the use of manual alignment and bonding techniques, which is the current practice in industry. At Lawrence Livermore National Laboratory, we are working to reduce the cost of packaging OE devices through the use of automation. Our efforts are concentrated on several areas that are directly related to an automated process. This paper will focus on our progress in two of those areas, in particular, an automated fiber pigtailing machine and silicon micro-technology compatible with an automated process.

  12. Interpreter composition issues in the formal verification of a processor-memory module

    NASA Technical Reports Server (NTRS)

    Fura, David A.; Cohen, Gerald C.

    1994-01-01

    This report describes interpreter composition techniques suitable for the formal specification and verification of a processor-memory module using the HOL theorem proving system. The processor-memory module is a multichip subsystem within a fault-tolerant embedded system under development within the Boeing Defense and Space Group. Modeling and verification methods were developed that permit provably secure composition at the transaction-level of specification, significantly reducing the complexity of the hierarchical verification of the system.

  13. Vertically integrated photonic multichip module architecture for vision applications

    NASA Astrophysics Data System (ADS)

    Tanguay, Armand R., Jr.; Jenkins, B. Keith; von der Malsburg, Christoph; Mel, Bartlett; Holt, Gary; O'Brien, John D.; Biederman, Irving; Madhukar, Anupam; Nasiatka, Patrick; Huang, Yunsong

    2000-05-01

    The development of a truly smart camera, with inherent capability for low latency semi-autonomous object recognition, tracking, and optimal image capture, has remained an elusive goal notwithstanding tremendous advances in the processing power afforded by VLSI technologies. These features are essential for a number of emerging multimedia- based applications, including enhanced augmented reality systems. Recent advances in understanding of the mechanisms of biological vision systems, together with similar advances in hybrid electronic/photonic packaging technology, offer the possibility of artificial biologically-inspired vision systems with significantly different, yet complementary, strengths and weaknesses. We describe herein several system implementation architectures based on spatial and temporal integration techniques within a multilayered structure, as well as the corresponding hardware implementation of these architectures based on the hybrid vertical integration of multiple silicon VLSI vision chips by means of dense 3D photonic interconnections.

  14. Possibilities for mixed mode chip manufacturing in EUROPRACTICE

    NASA Astrophysics Data System (ADS)

    Das, C.

    1997-02-01

    EUROPRACTICE is an EC initiative under the ESPRIT programme which aims to stimulate the wider exploitation of state-of-the-art microelectronics technologies by European industry and to enhance European industrial competitiveness in the global market-place. Through EUROPRACTICE, the EC has created a range of Basic Services that offer users a cost-effective and flexible means of accessing three main microelectronics-based technologies: Application Specific Integrated Circuit (ASICs), Multi-Chip Modules (MCMs) and Microsystems. EUROPRACTICE Basic Services reduce the cost and risk for companies wishing to begin using these technologies. EUROPRACTICE offers a fully supported, low cost route for companies to design and fabricate ASICs for their individual applications. Low cost is achieved by consolidating designs from many users onto a single semiconductor wafer (MPW: Multi Project Wafer). The EUROPRACTICE IC Manufacturing Service (ICMS) offers a broad range of fabrication technologies including CMOS, BiCMOS and GaAs. The Service extends from enabling users to produce prototype ASICs for testing and evaluation, through to low-volume production runs.

  15. Materials Research for GHz Multi-Chip Modules

    DTIC Science & Technology

    1993-09-30

    Publications: Laursen, K., Hertling, D., Berry, N., Bidstrup, S.A., Kohl, P., and Arroz , A., "Measurement of the Electrical Properties of Hligh Performance...Materials, Fall 1992. Herding, D.R., Laursen, K., Bidstrup, S.A., Kohl, P.A., Arroz , G.S.., "Measurement of the Electrical Properties of High

  16. Thin-film decoupling capacitors for multi-chip modules

    NASA Astrophysics Data System (ADS)

    Dimos, D.; Lockwood, S. J.; Schwartz, R. W.; Rogers, M. S.

    Thin-film decoupling capacitors based on ferroelectric lead lanthanum zirconate titanate (PLZT) films are being developed for use in advanced packages, such as multi-chip modules. These thin-film decoupling capacitors are intended to replace multi-layer ceramic capacitors for certain applications, since they can be more fully integrated into the packaging architecture. The increased integration that can be achieved should lead to decreased package volume and improved high-speed performance, due to a decrease in interconnect inductance. PLZT films are fabricated by spin coating using metal carboxylate/alkoxide solutions. These films exhibit very high dielectric constants ((var epsilon) greater than or equal to 900), low dielectric losses (tan(delta) = 0.01), excellent insulation resistances (rho greater than 10(exp 13) (Omega)-cm at 125 C), and good breakdown field strengths (E(sub B) = 900 kV/cm). For integrated circuit applications, the PLZT dielectric is less than 1 micron thick, which results in a large capacitance/area (8-9 nF/sq mm). The thin-film geometry and processing conditions also make these capacitors suitable for direct incorporation onto integrated circuits and for packages that require embedded components.

  17. The Neptune/Triton Explorer Mission: A Concept Feasibility Study

    NASA Technical Reports Server (NTRS)

    Esper, Jaime

    2003-01-01

    Technological advances over the next 10 to 15 years promise to enable a number of smaller, more capable science missions to the outer planets. With the inception of miniaturized spacecraft for a wide range of applications, both in large clusters around Earth, and for deep space missions, NASA is currently in the process of redefining the way science is being gathered. Technologies such as 3-Dimensional Multi-Chip Modules, Micro-machined Electromechanical Devices, Multi Functional Structures, miniaturized transponders, miniaturized propulsion systems, variable emissivity thermal coatings, and artificial intelligence systems are currently in research and development, and are scheduled to fly (or have flown) in a number of missions. This study will leverage on these and other technologies in the design of a lightweight Neptune orbiter unlike any other that has been proposed to date. The Neptune/Triton Explorer (NExTEP) spacecraft uses solar electric earth gravity assist and aero capture maneuvers to achieve its intended target orbit. Either a Taurus or Delta-class launch vehicle may be used to accomplish the mission.

  18. The Use of Metal Filled Via Holes for Improving Isolation in LTCC RF and Wireless Multichip Packages

    NASA Technical Reports Server (NTRS)

    Ponchak, George E.; Chun, Donghoon; Yook, Jong-Gwan; Katehi, Linda P. B.

    1999-01-01

    LTCC MCMs (Low Temperature Cofired Ceramic MultiChip Module) for RF and wireless systems often use metal filled via holes to improve isolation between the stripline and microstrip interconnects. In this paper, results from a 3D-FEM electromagnetic characterization of microstrip and stripline interconnects with metal filled via fences for isolation are presented. It is shown that placement of a via hole fence closer than three times the substrate height to the transmission lines increases radiation and coupling. Radiation loss and reflections are increased when a short via fence is used in areas suspected of having high radiation. Also, via posts should not be separated by more than three times the substrate height for low radiation loss, coupling, and suppression of higher order modes in a package.

  19. Low power signal processing research at Stanford

    NASA Technical Reports Server (NTRS)

    Burr, J.; Williamson, P. R.; Peterson, A.

    1991-01-01

    This paper gives an overview of the research being conducted at Stanford University's Space, Telecommunications, and Radioscience Laboratory in the area of low energy computation. It discusses the work we are doing in large scale digital VLSI neural networks, interleaved processor and pipelined memory architectures, energy estimation and optimization, multichip module packaging, and low voltage digital logic.

  20. Silicon Wafer Advanced Packaging (SWAP). Multichip Module (MCM) Foundry Study. Version 2

    DTIC Science & Technology

    1991-04-08

    Next Layer Dielectric Spacing - Additional Metal Thickness Impact on Dielectric Uniformity/Adhiesion. The first step in .!Ie EPerimental design would be... design CAM - computer aided manufacturing CAE - computer aided engineering CALCE - computer aided life cycle engineering center CARMA - computer aided...expansion 5 j- CVD - chemical vapor deposition J . ..- j DA - design automation J , DEC - Digital Equipment Corporation --- DFT - design for testability

  1. SAR processing using SHARC signal processing systems

    NASA Astrophysics Data System (ADS)

    Huxtable, Barton D.; Jackson, Christopher R.; Skaron, Steve A.

    1998-09-01

    Synthetic aperture radar (SAR) is uniquely suited to help solve the Search and Rescue problem since it can be utilized either day or night and through both dense fog or thick cloud cover. Other papers in this session, and in this session in 1997, describe the various SAR image processing algorithms that are being developed and evaluated within the Search and Rescue Program. All of these approaches to using SAR data require substantial amounts of digital signal processing: for the SAR image formation, and possibly for the subsequent image processing. In recognition of the demanding processing that will be required for an operational Search and Rescue Data Processing System (SARDPS), NASA/Goddard Space Flight Center and NASA/Stennis Space Center are conducting a technology demonstration utilizing SHARC multi-chip modules from Boeing to perform SAR image formation processing.

  2. 180-GHz Interferometric Imager

    NASA Technical Reports Server (NTRS)

    Kangaslahti, Pekka P.; Lim, Boon H.; O'Dwyer, Ian J.; Soria, Mary M.; Owen, Heather R.; Gaier, Todd C.; Lambrigtsen, Bjorn, H.; Tanner, Alan B.; Ruf, Christopher

    2011-01-01

    A 180-GHz interferometric imager uses compact receiver modules, combined high- and low-gain antennas, and ASIC (application specific integrated circuit) correlator technology, enabling continuous, all-weather observations of water vapor with 25-km resolution and 0.3-K noise in 15 minutes of observation for numerical weather forecasting and tropical storm prediction. The GeoSTAR-II prototype instrument is broken down into four major subsystems: the compact, low-noise receivers; sub-array modules; IF signal distribution; and the digitizer/correlator. Instead of the single row of antennas adopted in GeoSTAR, this version has four rows of antennas on a coarser grid. This dramatically improves the sensitivity in the desired field of view. The GeoSTAR-II instrument is a 48-element, synthetic, thinned aperture radiometer operating at 165-183 GHz. The instrument has compact receivers integrated into tiles of 16 elements in a 4x4 arrangement. These tiles become the building block of larger arrays. The tiles contain signal distribution for bias controls, IF signal, and local oscillator signals. The IF signals are digitized and correlated using an ASIC correlator to minimize power consumption. Previous synthetic aperture imagers have used comparatively large multichip modules, whereas this approach uses chip-scale modules mounted on circuit boards, which are in turn mounted on the distribution manifolds. This minimizes the number of connectors and reduces system mass. The use of ASIC technology in the digitizers and correlators leads to a power reduction close to an order of magnitude.

  3. Experimental Study on Active Cooling Systems Used for Thermal Management of High-Power Multichip Light-Emitting Diodes

    PubMed Central

    2014-01-01

    The objective of this study was to develop suitable cooling systems for high-power multichip LEDs. To this end, three different active cooling systems were investigated to control the heat generated by the powering of high-power multichip LEDs in two different configurations (30 and 2 × 15 W). The following cooling systems were used in the study: an integrated multi-fin heat sink design with a fan, a cooling system with a thermoelectric cooler (TEC), and a heat pipe cooling device. According to the results, all three systems were observed to be sufficient for cooling high-power LEDs. Furthermore, it was observed that the integrated multifin heat sink design with a fan was the most efficient cooling system for a 30 W high-power multichip LED. The cooling system with a TEC and 46 W input power was the most efficient cooling system for 2 × 15 W high-power multichip LEDs. PMID:25162058

  4. Ultra-Reliable Digital Avionics (URDA) processor

    NASA Astrophysics Data System (ADS)

    Branstetter, Reagan; Ruszczyk, William; Miville, Frank

    1994-10-01

    Texas Instruments Incorporated (TI) developed the URDA processor design under contract with the U.S. Air Force Wright Laboratory and the U.S. Army Night Vision and Electro-Sensors Directorate. TI's approach couples advanced packaging solutions with advanced integrated circuit (IC) technology to provide a high-performance (200 MIPS/800 MFLOPS) modular avionics processor module for a wide range of avionics applications. TI's processor design integrates two Ada-programmable, URDA basic processor modules (BPM's) with a JIAWG-compatible PiBus and TMBus on a single F-22 common integrated processor-compatible form-factor SEM-E avionics card. A separate, high-speed (25-MWord/second 32-bit word) input/output bus is provided for sensor data. Each BPM provides a peak throughput of 100 MIPS scalar concurrent with 400-MFLOPS vector processing in a removable multichip module (MCM) mounted to a liquid-flowthrough (LFT) core and interfacing to a processor interface module printed wiring board (PWB). Commercial RISC technology coupled with TI's advanced bipolar complementary metal oxide semiconductor (BiCMOS) application specific integrated circuit (ASIC) and silicon-on-silicon packaging technologies are used to achieve the high performance in a miniaturized package. A Mips R4000-family reduced instruction set computer (RISC) processor and a TI 100-MHz BiCMOS vector coprocessor (VCP) ASIC provide, respectively, the 100 MIPS of a scalar processor throughput and 400 MFLOPS of vector processing throughput for each BPM. The TI Aladdim ASIC chipset was developed on the TI Aladdin Program under contract with the U.S. Army Communications and Electronics Command and was sponsored by the Advanced Research Projects Agency with technical direction from the U.S. Army Night Vision and Electro-Sensors Directorate.

  5. T/R Multi-Chip MMIC Modules for 150 GHz

    NASA Technical Reports Server (NTRS)

    Samoska, Lorene A.; Pukala, David M.; Soria, Mary M.; Sadowy, Gregory A.

    2009-01-01

    Modules containing multiple monolithic microwave integrated-circuit (MMIC) chips have been built as prototypes of transmitting/receiving (T/R) modules for millimeter-wavelength radar systems, including phased-array radar systems to be used for diverse purposes that could include guidance and avoidance of hazards for landing spacecraft, imaging systems for detecting hidden weapons, and hazard-avoidance systems for automobiles. Whereas prior landing radar systems have operated at frequencies around 35 GHz, the integrated circuits in this module operate in a frequency band centered at about 150 GHz. The higher frequency (and, hence, shorter wavelength), is expected to make it possible to obtain finer spatial resolution while also using smaller antennas and thereby reducing the sizes and masses of the affected systems.

  6. Enhanced thermaly managed packaging for III-nitride light emitters

    NASA Astrophysics Data System (ADS)

    Kudsieh, Nicolas

    In this Dissertation our work on `enhanced thermally managed packaging of high power semiconductor light sources for solid state lighting (SSL)' is presented. The motivation of this research and development is to design thermally high stable cost-efficient packaging of single and multi-chip arrays of III-nitrides wide bandgap semiconductor light sources through mathematical modeling and simulations. Major issues linked with this technology are device overheating which causes serious degradation in their illumination intensity and decrease in the lifetime. In the introduction the basics of III-nitrides WBG semiconductor light emitters are presented along with necessary thermal management of high power cingulated and multi-chip LEDs and laser diodes. This work starts at chip level followed by its extension to fully packaged lighting modules and devices. Different III-nitride structures of multi-quantum well InGaN/GaN and AlGaN/GaN based LEDs and LDs were analyzed using advanced modeling and simulation for different packaging designs and high thermal conductivity materials. Study started with basic surface mounted devices using conventional packaging strategies and was concluded with the latest thermal management of chip-on-plate (COP) method. Newly discovered high thermal conductivity materials have also been incorporated for this work. Our study also presents the new approach of 2D heat spreaders using such materials for SSL and micro LED array packaging. Most of the work has been presented in international conferences proceedings and peer review journals. Some of the latest work has also been submitted to well reputed international journals which are currently been reviewed for publication. .

  7. Update on Development of SiC Multi-Chip Power Modules

    NASA Technical Reports Server (NTRS)

    Lostetter, Alexander; Cilio, Edgar; Mitchell, Gavin; Schupbach, Roberto

    2008-01-01

    Progress has been made in a continuing effort to develop multi-chip power modules (SiC MCPMs). This effort at an earlier stage was reported in 'SiC Multi-Chip Power Modules as Power-System Building Blocks' (LEW-18008-1), NASA Tech Briefs, Vol. 31, No. 2 (February 2007), page 28. The following recapitulation of information from the cited prior article is prerequisite to a meaningful summary of the progress made since then: 1) SiC MCPMs are, more specifically, electronic power-supply modules containing multiple silicon carbide power integrated-circuit chips and silicon-on-insulator (SOI) control integrated-circuit chips. SiC MCPMs are being developed as building blocks of advanced expandable, reconfigurable, fault-tolerant power-supply systems. Exploiting the ability of SiC semiconductor devices to operate at temperatures, breakdown voltages, and current densities significantly greater than those of conventional Si devices, the designs of SiC MCPMs and of systems comprising multiple SiC MCPMs are expected to afford a greater degree of miniaturization through stacking of modules with reduced requirements for heat sinking; 2) The stacked SiC MCPMs in a given system can be electrically connected in series, parallel, or a series/parallel combination to increase the overall power-handling capability of the system. In addition to power connections, the modules have communication connections. The SOI controllers in the modules communicate with each other as nodes of a decentralized control network, in which no single controller exerts overall command of the system. Control functions effected via the network include synchronization of switching of power devices and rapid reconfiguration of power connections to enable the power system to continue to supply power to a load in the event of failure of one of the modules; and, 3) In addition to serving as building blocks of reliable power-supply systems, SiC MCPMs could be augmented with external control circuitry to make them perform additional power-handling functions as needed for specific applications. Because identical SiC MCPM building blocks could be utilized in such a variety of ways, the cost and difficulty of designing new, highly reliable power systems would be reduced considerably. This concludes the information from the cited prior article. The main activity since the previously reported stage of development was the design, fabrication, and testing a 120- VDC-to-28-VDC modular power-converter system composed of eight SiC MCPMs in a 4 (parallel)-by-2 (series) matrix configuration, with normally-off controllable power switches. The SiC MCPM power modules include closed-loop control subsystems and are capable of operating at high power density or high temperature. The system was tested under various configurations, load conditions, load-transient conditions, and failure-recovery conditions. Planned future work includes refinement of the demonstrated modular system concept and development of a new converter hardware topology that would enable sharing of currents without the need for communication among modules. Toward these ends, it is also planned to develop a new converter control algorithm that would provide for improved sharing of current and power under all conditions, and to implement advanced packaging concepts that would enable operation at higher power density.

  8. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Rodenbeck, Christopher T; Girardi, Michael

    Internal nodes of a constituent integrated circuit (IC) package of a multichip module (MCM) are protected from excessive charge during plasma cleaning of the MCM. The protected nodes are coupled to an internal common node of the IC package by respectively associated discharge paths. The common node is connected to a bond pad of the IC package. During MCM assembly, and before plasma cleaning, this bond pad receives a wire bond to a ground bond pad on the MCM substrate.

  9. High Flux Heat Exchanger

    DTIC Science & Technology

    1993-01-01

    maximum jet velocity (6.36 m/s), and maximum number of jets (nine). Wadsworth and Mudawar [49] describe the use of a single slotted nozzle to provide...H00503 (ASME), pp. 121-128, 1989. 40 49. D. C. Wadsworth and I. Mudawar , "Cooling of a Multichip Electronic Module by Means of Confined Two-Dimensional...Jets of Dielectric Liquid," HTD-Vol. 111, Heat Transfer in Electrglif, Book No. H00503 (ASME), pp. 79-87, 1989. 50. D.C. Wadsworth and I. Mudawar

  10. Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration

    DOEpatents

    Passmore, Brandon; Cole, Zach; Whitaker, Bret; Barkley, Adam; McNutt, Ty; Lostetter, Alexander

    2016-08-02

    A multichip power module directly connecting the busboard to a printed-circuit board that is attached to the power substrate enabling extremely low loop inductance for extreme environments such as high temperature operation. Wire bond interconnections are taught from the power die directly to the busboard further enabling enable low parasitic interconnections. Integration of on-board high frequency bus capacitors provide extremely low loop inductance. An extreme environment gate driver board allows close physical proximity of gate driver and power stage to reduce overall volume and reduce impedance in the control circuit. Parallel spring-loaded pin gate driver PCB connections allows a reliable and reworkable power module to gate driver interconnections.

  11. An analog silicon retina with multichip configuration.

    PubMed

    Kameda, Seiji; Yagi, Tetsuya

    2006-01-01

    The neuromorphic silicon retina is a novel analog very large scale integrated circuit that emulates the structure and the function of the retinal neuronal circuit. We fabricated a neuromorphic silicon retina, in which sample/hold circuits were embedded to generate fluctuation-suppressed outputs in the previous study [1]. The applications of this silicon retina, however, are limited because of a low spatial resolution and computational variability. In this paper, we have fabricated a multichip silicon retina in which the functional network circuits are divided into two chips: the photoreceptor network chip (P chip) and the horizontal cell network chip (H chip). The output images of the P chip are transferred to the H chip with analog voltages through the line-parallel transfer bus. The sample/hold circuits embedded in the P and H chips compensate for the pattern noise generated on the circuits, including the analog communication pathway. Using the multichip silicon retina together with an off-chip differential amplifier, spatial filtering of the image with an odd- and an even-symmetric orientation selective receptive fields was carried out in real time. The analog data transfer method in the present multichip silicon retina is useful to design analog neuromorphic multichip systems that mimic the hierarchical structure of neuronal networks in the visual system.

  12. High density electronic circuit and process for making

    DOEpatents

    Morgan, William P.

    1999-01-01

    High density circuits with posts that protrude beyond one surface of a substrate to provide easy mounting of devices such as integrated circuits. The posts also provide stress relief to accommodate differential thermal expansion. The process allows high interconnect density with fewer alignment restrictions and less wasted circuit area than previous processes. The resulting substrates can be test platforms for die testing and for multi-chip module substrate testing. The test platform can contain active components and emulate realistic operational conditions, replacing shorts/opens net testing.

  13. NASA Tech Briefs, June 2009

    NASA Technical Reports Server (NTRS)

    2009-01-01

    Topics covered include: Device for Measuring Low Flow Speed in a Duct, Measuring Thermal Conductivity of a Small Insulation Sample, Alignment Jig for the Precise Measurement of THz Radiation, Autoignition Chamber for Remote Testing of Pyrotechnic Devices, Microwave Power Combiners for Signals of Arbitrary Amplitude, Synthetic Foveal Imaging Technology, Airborne Antenna System for Minimum-Cycle-Slip GPS Reception, Improved Starting Materials for Back-Illuminated Imagers, Multi-Modulator for Bandwidth-Efficient Communication, Some Improvements in Utilization of Flash Memory Devices, GPS/MEMS IMU/Microprocessor Board for Navigation, T/R Multi-Chip MMIC Modules for 150 GHz, Pneumatic Haptic Interfaces, Device Acquires and Retains Rock or Ice Samples, Cryogenic Feedthrough Test Rig, Improved Assembly for Gas Shielding During Welding or Brazing, Two-Step Plasma Process for Cleaning Indium Bonding Bumps, Tool for Crimping Flexible Circuit Leads, Yb14MnSb11 as a High-Efficiency Thermoelectric Material, Polyimide-Foam/Aerogel Composites for Thermal Insulation, Converting CSV Files to RKSML Files, Service Management Database for DSN Equipment, Chemochromic Hydrogen Leak Detectors, Compatibility of Segments of Thermoelectric Generators, Complementary Barrier Infrared Detector, JPL Greenland Moulin Exploration Probe, Ultra-Lightweight Self-Deployable Nanocomposite Structure for Habitat Applications, and Room-Temperature Ionic Liquids for Electrochemical Capacitors.

  14. Custom chipset and compact module design for a 75-110 GHz laboratory signal source

    NASA Astrophysics Data System (ADS)

    Morgan, Matthew A.; Boyd, Tod A.; Castro, Jason J.

    2016-12-01

    We report on the development and characterization of a compact, full-waveguide bandwidth (WR-10) signal source for general-purpose testing of mm-wave components. The monolithic microwave integrated circuit (MMIC) based multichip module is designed for compactness and ease-of-use, especially in size-constrained test sets such as a wafer probe station. It takes as input a cm-wave continuous-wave (CW) reference and provides a factor of three frequency multiplication as well as amplification, output power adjustment, and in situ output power monitoring. It utilizes a number of custom MMIC chips such as a Schottky-diode limiter and a broadband mm-wave detector, both designed explicitly for this module, as well as custom millimeter-wave multipliers and amplifiers reported in previous papers.

  15. Low energy CMOS for space applications

    NASA Technical Reports Server (NTRS)

    Panwar, Ramesh; Alkalaj, Leon

    1992-01-01

    The current focus of NASA's space flight programs reflects a new thrust towards smaller, less costly, and more frequent space missions, when compared to missions such as Galileo, Magellan, or Cassini. Recently, the concept of a microspacecraft was proposed. In this concept, a small, compact spacecraft that weighs tens of kilograms performs focused scientific objectives such as imaging. Similarly, a Mars Lander micro-rover project is under study that will allow miniature robots weighing less than seven kilograms to explore the Martian surface. To bring the microspacecraft and microrover ideas to fruition, one will have to leverage compact 3D multi-chip module-based multiprocessors (MCM) technologies. Low energy CMOS will become increasingly important because of the thermodynamic considerations in cooling compact 3D MCM implementations and also from considerations of the power budget for space applications. In this paper, we show how the operating voltage is related to the threshold voltage of the CMOS transistors for accomplishing a task in VLSI with minimal energy. We also derive expressions for the noise margins at the optimal operating point. We then look at a low voltage CMOS (LVCMOS) technology developed at Stanford University which improves the power consumption over conventional CMOS by a couple of orders of magnitude and consider the suitability of the technology for space applications by characterizing its SEU immunity.

  16. Repairable chip bonding/interconnect process

    DOEpatents

    Bernhardt, Anthony F.; Contolini, Robert J.; Malba, Vincent; Riddle, Robert A.

    1997-01-01

    A repairable, chip-to-board interconnect process which addresses cost and testability issues in the multi-chip modules. This process can be carried out using a chip-on-sacrificial-substrate technique, involving laser processing. This process avoids the curing/solvent evolution problems encountered in prior approaches, as well is resolving prior plating problems and the requirements for fillets. For repairable high speed chip-to-board connection, transmission lines can be formed on the sides of the chip from chip bond pads, ending in a gull wing at the bottom of the chip for subsequent solder.

  17. High density electronic circuit and process for making

    DOEpatents

    Morgan, W.P.

    1999-06-29

    High density circuits with posts that protrude beyond one surface of a substrate to provide easy mounting of devices such as integrated circuits are disclosed. The posts also provide stress relief to accommodate differential thermal expansion. The process allows high interconnect density with fewer alignment restrictions and less wasted circuit area than previous processes. The resulting substrates can be test platforms for die testing and for multi-chip module substrate testing. The test platform can contain active components and emulate realistic operational conditions, replacing shorts/opens net testing. 8 figs.

  18. Development of beam leaded low power logic circuits

    NASA Technical Reports Server (NTRS)

    Smith, B. W.; Malone, F.

    1972-01-01

    The technologies of low power TTL and beam lead processing were merged into a single product family. This family offers the power and thermal advantages of low power(54L), while providing the additional reliability advantages of beam leads. The reduction in the power and heat levels also allows the system designer to take advantage, through beam lead, multichip assemblies, of increased package density to reduce system size and weight.

  19. Thermal management and light extraction in multi-chip and high-voltage LEDs by cup-shaped copper heat spreader technology

    NASA Astrophysics Data System (ADS)

    Horng, Ray-Hua; Hu, Hung-Lieh; Tang, Li-Shen; Ou, Sin-Liang

    2013-03-01

    For LEDs with original structure and copper heat spreader, the highest surface temperatures of 3×3 array LEDs modules were 52.6 and 42.67 °C (with 1050 mA injection current), while the highest surface temperatures of 4×4 array LEDs modules were 58.55 and 48.85 °C (with 1400 mA injection current), respectively. As the 5×5 array LEDs modules with original structure and copper heat spreader were fabricated, the highest surface temperatures at 1750 mA injection current were 68.51 and 56.73 °C, respectively. The thermal resistance of optimal LEDs array module with copper heat spreader on heat sink using compound solder is reduced obviously. On the other hand, the output powers of 3×3, 4×4 and 5×5 array LEDs modules with original structure were 3621.7, 6346.3 and 9760.4 mW at injection currents of 1050, 1400 and 1750 mA, respectively. Meanwhile, the output powers of these samples with copper heat spreader can be improved to 4098.5, 7150.3 and 10919.6 mW, respectively. The optical and thermal characteristics of array LEDs module have been improved significantly using the cup-shaped copper structure. Furthermore, various types of epoxy-packaged LEDs with cup-shaped structure were also fabricated. It is found that the light extraction efficiency of LED with semicircle package has 55% improvement as compared to that of LED with flat package. The cup-shaped copper structure was contacted directly with sapphire to enhance heat dissipation. In addition to efficient heat dissipation, the light extraction of the lateral emitting in high-power LEDs can be improved.

  20. A simple modern correctness condition for a space-based high-performance multiprocessor

    NASA Technical Reports Server (NTRS)

    Probst, David K.; Li, Hon F.

    1992-01-01

    A number of U.S. national programs, including space-based detection of ballistic missile launches, envisage putting significant computing power into space. Given sufficient progress in low-power VLSI, multichip-module packaging and liquid-cooling technologies, we will see design of high-performance multiprocessors for individual satellites. In very high speed implementations, performance depends critically on tolerating large latencies in interprocessor communication; without latency tolerance, performance is limited by the vastly differing time scales in processor and data-memory modules, including interconnect times. The modern approach to tolerating remote-communication cost in scalable, shared-memory multiprocessors is to use a multithreaded architecture, and alter the semantics of shared memory slightly, at the price of forcing the programmer either to reason about program correctness in a relaxed consistency model or to agree to program in a constrained style. The literature on multiprocessor correctness conditions has become increasingly complex, and sometimes confusing, which may hinder its practical application. We propose a simple modern correctness condition for a high-performance, shared-memory multiprocessor; the correctness condition is based on a simple interface between the multiprocessor architecture and a high-performance, shared-memory multiprocessor; the correctness condition is based on a simple interface between the multiprocessor architecture and the parallel programming system.

  1. Medical telesensors

    NASA Astrophysics Data System (ADS)

    Ferrell, Trinidad L.; Crilly, P. B.; Smith, S. F.; Wintenberg, Alan L.; Britton, Charles L., Jr.; Morrison, Gilbert W.; Ericson, M. N.; Hedden, D.; Bouldin, Donald W.; Passian, A.; Downey, Todd R.; Wig, A. G.; Meriaudeau, Fabrice

    1998-05-01

    Medical telesensors are self-contained integrated circuits for measuring and transmitting vital signs over a distance of approximately 1-2 meters. The circuits are unhoused and contain a sensor, signal processing and modulation electronics, a spread-spectrum transmitter, an antenna and a thin-film battery. We report on a body-temperature telesensor, which is sufficiently small to be placed on a tympanic membrane in a child's ear. We also report on a pulse-oximeter telesensor and a micropack receiver/long- range transmitter unit, which receives form a telesensor array and analyzes and re-transmits the vital signs over a longer range. Signal analytics are presented for the pulse oximeter, which is currently in the form of a finger ring. A multichip module is presented as the basic signal-analysis component. The module contains a microprocessor, a field=programmable gate array, memory elements and other components necessary for determining trauma and reporting signals.

  2. Continuing evolution of in-vitro diagnostic instrumentation

    NASA Astrophysics Data System (ADS)

    Cohn, Gerald E.

    2000-04-01

    The synthesis of analytical instrumentation and analytical biochemistry technologies in modern in vitro diagnostic instrumentation continues to generate new systems with improved performance and expanded capability. Detection modalities have expanded to include multichip modes of fluorescence, scattering, luminescence and reflectance so as to accommodate increasingly sophisticated immunochemical and nucleic acid based reagent systems. The time line graph of system development now extends from the earliest automated clinical spectrophotometers through molecule recognition assays and biosensors to the new breakthroughs of biochip and DNA diagnostics. This brief review traces some of the major innovations in the evolution of system technologies and previews the conference program.

  3. 3D packaging of a microfluidic system with sensory applications

    NASA Astrophysics Data System (ADS)

    Morrissey, Anthony; Kelly, Gerard; Alderman, John C.

    1997-09-01

    Among the main benefits of microsystem technology are its contributions to cost reductio, reliability and improved performance. however, the packaging of microsystems, and particularly microsensor, has proven to be one of the biggest limitations to their commercialization and the packaging of silicon sensor devices can be the most costly part of their fabrication. This paper describes the integration of 3D packaging of a microsystem. Central to the operation of the 3D demonstrator is a micromachined silicon membrane pump to supply fluids to a sensing chamber constructed about the active area of a sensor chip. This chip carries ISFET based chemical sensors, pressure sensors and thermal sensors. The electronics required for controlling and regulating the activity of the various sensors ar also available on this chip and as other chips in the 3D assembly. The demonstrator also contains a power supply module with optical fiber interconnections. All of these modules are integrated into a single plastic- encapsulated 3D vertical multichip module. The reliability of such a structure, initially proposed by Val was demonstrated by Barrett et al. An additional module available for inclusion in some of our assemblies is a test chip capable of measuring the packaging-induced stress experienced during and after assembly. The packaging process described produces a module with very high density and utilizes standard off-the-shelf components to minimize costs. As the sensor chip and micropump include micromachined silicon membranes and microvalves, the packaging of such structures has to allow consideration for the minimization of the packaging-induced stresses. With this in mind, low stress techniques, including the use of soft glob-top materials, were employed.

  4. Repairable chip bonding/interconnect process

    DOEpatents

    Bernhardt, A.F.; Contolini, R.J.; Malba, V.; Riddle, R.A.

    1997-08-05

    A repairable, chip-to-board interconnect process which addresses cost and testability issues in the multi-chip modules is disclosed. This process can be carried out using a chip-on-sacrificial-substrate technique, involving laser processing. This process avoids the curing/solvent evolution problems encountered in prior approaches, as well is resolving prior plating problems and the requirements for fillets. For repairable high speed chip-to-board connection, transmission lines can be formed on the sides of the chip from chip bond pads, ending in a gull wing at the bottom of the chip for subsequent solder. 10 figs.

  5. Development of highly durable deep-ultraviolet AlGaN-based LED multichip array with hemispherical encapsulated structures using a selected resin through a detailed feasibility study

    NASA Astrophysics Data System (ADS)

    Nagai, Shoko; Yamada, Kiho; Hirano, Akira; Ippommatsu, Masamichi; Ito, Masahiro; Morishima, Naoki; Aosaki, Ko; Honda, Yoshio; Amano, Hiroshi; Akasaki, Isamu

    2016-08-01

    To replace mercury lamps with AlGaN-based deep-ultraviolet (DUV) LEDs, a simple and low-cost package with increased light extraction efficiency (LEE) is indispensable. Therefore, resin encapsulation is considered to be a key technology. However, the photochemical reactions induced by DUV light cause serious problems, and conventional resins cannot be used. In the former part of this study, a comparison of a silicone resin and fluorine polymers was carried out in terms of their suitability for encapsulation, and we concluded that only one of the fluorine polymers can be used for encapsulation. In the latter part, the endurance of encapsulation using the selected fluorine polymer was investigated, and we confirmed that the selected fluorine polymer can guarantee a lifetime of over 6,000 h at a wavelength of 265 nm. Furthermore, a 3 × 4 array module of encapsulated dies on a simple AlN submount was fabricated, demonstrating the possibility of W/cm2-class lighting.

  6. Methods of fabricating applique circuits

    DOEpatents

    Dimos, Duane B.; Garino, Terry J.

    1999-09-14

    Applique circuits suitable for advanced packaging applications are introduced. These structures are particularly suited for the simple integration of large amounts (many nanoFarads) of capacitance into conventional integrated circuit and multichip packaging technology. In operation, applique circuits are bonded to the integrated circuit or other appropriate structure at the point where the capacitance is required, thereby minimizing the effects of parasitic coupling. An immediate application is to problems of noise reduction and control in modern high-frequency circuitry.

  7. Spacecraft computer technology at Southwest Research Institute

    NASA Technical Reports Server (NTRS)

    Shirley, D. J.

    1993-01-01

    Southwest Research Institute (SwRI) has developed and delivered spacecraft computers for a number of different near-Earth-orbit spacecraft including shuttle experiments and SDIO free-flyer experiments. We describe the evolution of the basic SwRI spacecraft computer design from those weighing in at 20 to 25 lb and using 20 to 30 W to newer models weighing less than 5 lb and using only about 5 W, yet delivering twice the processing throughput. Because of their reduced size, weight, and power, these newer designs are especially applicable to planetary instrument requirements. The basis of our design evolution has been the availability of more powerful processor chip sets and the development of higher density packaging technology, coupled with more aggressive design strategies in incorporating high-density FPGA technology and use of high-density memory chips. In addition to reductions in size, weight, and power, the newer designs also address the necessity of survival in the harsh radiation environment of space. Spurred by participation in such programs as MSTI, LACE, RME, Delta 181, Delta Star, and RADARSAT, our designs have evolved in response to program demands to be small, low-powered units, radiation tolerant enough to be suitable for both Earth-orbit microsats and for planetary instruments. Present designs already include MIL-STD-1750 and Multi-Chip Module (MCM) technology with near-term plans to include RISC processors and higher-density MCM's. Long term plans include development of whole-core processors on one or two MCM's.

  8. Consortia for Known Good Die (KGD), phase 1

    NASA Astrophysics Data System (ADS)

    Andrews, Marshall; Carey, David; Fellows, Mary M.; Gilg, Larry; Murphy, Cindy; Noddings, Chad; Pitts, Greg; Rathmell, Claude; Spooner, Charles

    1994-02-01

    This report describes the results of Phase 1 of the Infrastructure for KGD program at MCC. The objective of the work is to resolve the issues for supplying and procuring Known Good Die (KGD) in a way that fosters industry acceptance and confidence in Application Specific Electronic Modules (ASEM's for military systems) and MultiChip Modules (MCM's for commercial systems). This report is divided into four sections. Section 1 describes the technical assessment of proposed industry approaches to KGD implementation. Section 2 of the report contains an outline for the plan for industry and government cooperation for the demonstration, validation, and implementation of KGD methodologies identified in this Phase 1 study. Section 3 of the report contains the industry-generated requirements for KGD implementation. Section IV of the report contains the KGD specifications for TAB and flip chip IC's.

  9. Broad Frequency LTCC Vertical Interconnect Transition for Multichip Modules and System on Package Applications

    NASA Technical Reports Server (NTRS)

    Decrossas, Emmanuel; Glover, Michael D.; Porter, Kaoru; Cannon, Tom; Mantooth, H. Alan; Hamilton, M. C.

    2013-01-01

    Various stripline structures and flip chip interconnect designs for high-speed digital communication systems implemented in low temperature co-fired ceramic (LTCC) substrates are studied in this paper. Specifically, two different transition designs from edge launch 2.4 millimeter connectors to stripline transmission lines embedded in LTCC are discussed. After characterizing the DuPont (sup trademark) 9K7 green tape, different designs are proposed to improve signal integrity for high-speed digital data. The full-wave simulations and experimental data validate the presented designs over a broad frequency band from Direct Current to 50 gigahertz and beyond.

  10. Flip-chip replacement within the constraints imposed by multilayer ceramic (MLC) modules

    NASA Astrophysics Data System (ADS)

    Puttlitz, Karl J.

    1984-01-01

    Economics often dictates that suitable module rework procedures be established to replace solder bump devices (flip chips) reflowed to multichip carriers. These operations are complicated, owing to various constraints such as the substrate's physical and mechanical properties, close proximity of surface features, etc. This paper describes the constraints and the methods to circumvent them. An order of preference based upon the degree of constraint is recommended to achieve device removal and subsequent site dress of the residual solder left on the substrate. It has been determined that rework (device replacement) can be successfully achieved in even highly constricted situations. This is illustrated by the example of utilizing a localized heating technique, hot gas, to remove solder from microsockets from which chips were previously removed. Microsockets are areas to which chips are reflowed to the top surface of IBM's densely populated multilayer ceramic (MLC) modules, thus forming the so-called controlled collapse chip connection or C-4. The microsocket patterns are thus identical to the chip footprint.

  11. SiC Multi-Chip Power Modules as Power-System Building Blocks

    NASA Technical Reports Server (NTRS)

    Lostetter, Alexander; Franks, Steven

    2007-01-01

    The term "SiC MCPMs" (wherein "MCPM" signifies "multi-chip power module") denotes electronic power-supply modules containing multiple silicon carbide power devices and silicon-on-insulator (SOI) control integrated-circuit chips. SiC MCPMs are being developed as building blocks of advanced expandable, reconfigurable, fault-tolerant power-supply systems. Exploiting the ability of SiC semiconductor devices to operate at temperatures, breakdown voltages, and current densities significantly greater than those of conventional Si devices, the designs of SiC MCPMs and of systems comprising multiple SiC MCPMs are expected to afford a greater degree of miniaturization through stacking of modules with reduced requirements for heat sinking. Moreover, the higher-temperature capabilities of SiC MCPMs could enable operation in environments hotter than Si-based power systems can withstand. The stacked SiC MCPMs in a given system can be electrically connected in series, parallel, or a series/parallel combination to increase the overall power-handling capability of the system. In addition to power connections, the modules have communication connections. The SOI controllers in the modules communicate with each other as nodes of a decentralized control network, in which no single controller exerts overall command of the system. Control functions effected via the network include synchronization of switching of power devices and rapid reconfiguration of power connections to enable the power system to continue to supply power to a load in the event of failure of one of the modules. In addition to serving as building blocks of reliable power-supply systems, SiC MCPMs could be augmented with external control circuitry to make them perform additional power-handling functions as needed for specific applications: typical functions could include regulating voltages, storing energy, and driving motors. Because identical SiC MCPM building blocks could be utilized in a variety of ways, the cost and difficulty of designing new, highly reliable power systems would be reduced considerably. Several prototype DC-to-DC power-converter modules containing SiC power-switching devices were designed and built to demonstrate the feasibility of the SiC MCPM concept. In anticipation of a future need for operation at high temperature, the circuitry in the modules includes high-temperature inductors and capacitors. These modules were designed to be stacked to construct a system of four modules electrically connected in series and/or parallel. The packaging of the modules is designed to satisfy requirements for series and parallel interconnection among modules, high power density, high thermal efficiency, small size, and light weight. Each module includes four output power connectors two for serial and two for parallel output power connections among the modules. Each module also includes two signal connectors, electrically isolated from the power connectors, that afford four zones for signal interconnections among the SOI controllers. Finally, each module includes two input power connectors, through which it receives power from an in-line power bus. This design feature is included in anticipation of a custom-designed power bus incorporating sockets compatible with snap-on type connectors to enable rapid replacement of failed modules.

  12. Argus: a 16-pixel millimeter-wave spectrometer for the Green Bank Telescope

    NASA Astrophysics Data System (ADS)

    Sieth, Matthew; Devaraj, Kiruthika; Voll, Patricia; Church, Sarah; Gawande, Rohit; Cleary, Kieran; Readhead, Anthony C. S.; Kangaslahti, Pekka; Samoska, Lorene; Gaier, Todd; Goldsmith, Paul F.; Harris, Andrew I.; Gundersen, Joshua O.; Frayer, David; White, Steve; Egan, Dennis; Reeves, Rodrigo

    2014-07-01

    We report on the development of Argus, a 16-pixel spectrometer, which will enable fast astronomical imaging over the 85-116 GHz band. Each pixel includes a compact heterodyne receiver module, which integrates two InP MMIC low-noise amplifiers, a coupled-line bandpass filter and a sub-harmonic Schottky diode mixer. The receiver signals are routed to and from the multi-chip MMIC modules with multilayer high frequency printed circuit boards, which includes LO splitters and IF amplifiers. Microstrip lines on flexible circuitry are used to transport signals between temperature stages. The spectrometer frontend is designed to be scalable, so that the array design can be reconfigured for future instruments with hundreds of pixels. Argus is scheduled to be commissioned at the Robert C. Byrd Green Bank Telescope in late 2014. Preliminary data for the first Argus pixels are presented.

  13. Orientation-selective aVLSI spiking neurons.

    PubMed

    Liu, S C; Kramer, J; Indiveri, G; Delbrück, T; Burg, T; Douglas, R

    2001-01-01

    We describe a programmable multi-chip VLSI neuronal system that can be used for exploring spike-based information processing models. The system consists of a silicon retina, a PIC microcontroller, and a transceiver chip whose integrate-and-fire neurons are connected in a soft winner-take-all architecture. The circuit on this multi-neuron chip approximates a cortical microcircuit. The neurons can be configured for different computational properties by the virtual connections of a selected set of pixels on the silicon retina. The virtual wiring between the different chips is effected by an event-driven communication protocol that uses asynchronous digital pulses, similar to spikes in a neuronal system. We used the multi-chip spike-based system to synthesize orientation-tuned neurons using both a feedforward model and a feedback model. The performance of our analog hardware spiking model matched the experimental observations and digital simulations of continuous-valued neurons. The multi-chip VLSI system has advantages over computer neuronal models in that it is real-time, and the computational time does not scale with the size of the neuronal network.

  14. NANOSPACE-1: the Impacts of the First Swedish Nanosatellite on Spacecraft Architecture and Design

    NASA Astrophysics Data System (ADS)

    Bruhn, F.; Köhler, J.; Stenmark, L.

    2002-01-01

    NanoSpace-1 (NS-1), due to be launched in late 2003 or early 2004 will test highly advanced Micro Systems Technology (MST) for space applications. These devices are highly miniaturized and optimized complete systems in the sense that all parts of the system are processed with MST and integrated as Multifunctional Microsystems (MMS). The very high level of miniaturization and multifunctionallity in the MMS, will enable easier access to space for nanosatellites to perform better scientific research. This new class of high performing small satellites will open areas for research that before only could be done with much larger and costly satellites. Many institutions, universities, and small countries will benefit greatly as that nanosatellites become more capable per mass unit and volume unit than other spacecraft. These new MMS/MST satellites will provide the ground for a better and less expensive exploration of space. NS-1 will be the first high-performing nanosatellite by using MST/MMS to many subsystems and modules. The whole spacecraft will be built around MMS and will include multifunctional 3D-Multi Chip Modules (3D-MCM), a 3D thin film solar sensor, thin film coating for passive thermal control, variable emittance panels, microwave MEMS patch antennas, micromechanical thermal switches, thin film solar cells with record high efficiency and finally silicon as multifunctional active structure elements. The complete spacecraft will weigh about 7 kg and have dimensions of 32x32x15 cm. The overall mission for NS-1 is to test the new technologies mentioned above, and to collect experiences in the field of MMS architecture. However, new technologies in itself will not take us to a new generation spacecraft. Deeply integrated within the structure of the NanoSpace program are new system designs and multifunctional systems thinking. Distributed and autonomous subsystems are very important when incorporating new technologies with high redundancy. Autonomous systems also reduce the complexity of the overall spacecraft design since many functions can be placed in multifunctional multichip modules. This implies an increase of the complexity at the spacecraft subsystem level. NanoSpace-1 will test several new autonomous, distributed, and miniaturized multifunctional systems, including large memories modules, house keeping modules, RF- MEMS, and power conditioning modules. The MMS concept comprises several features, for instance, all 3D-multi chip modules are part of the spacecraft structure itself. The use of 3D-MCM modules as a large part of the spacecraft hull is a direct application of MMS thinking; the modules are load taking structure elements, and also contain many subsystems of the spacecraft. The MMS thinking is illustrated by the RF-MEMS 3D-MCM module. All other modules will be further presented in the paper. The RF-MEMS module comprises micro strips, patch-antennas, solid state power amplifiers, thermal control, micromechanical switches, power conditioning, radiation shields, and command interfaces. The size of the RF-module is 68x68x5 mm and has a weight of less than 70g. The module is designed to handle different frequencies, only by changing the top wafers and the mixer chip. MST and MMS integrated modules pose at least two major challenges compared to conventional technology. First, the processes cannot be changed half way to the product. Any substantial change in the process will almost certainly require a complete redesign of the whole system. Secondly, qualification and product assurance becomes more important since the processes in MMS tend to be long and complicated. The Ångström Space Technology Centre (ÅSTC) is a center for development of Micro Systems Technologies (MST) for Space Applications at the department of Materials Science at Uppsala University in Sweden. The center is now taking the next step in the ongoing Nanosatellite program, called the NanoSpace program. Backed by funding from the Swedish National Space Board (SNSB), the European Space Agency (ESA), and the European Commission (EC), the ÅSTC will begin developing nanosatellites to demonstrate the next generation spacecraft. The Nanosatellite program is built around a launch every 2nd year to test, verify and qualify new MST technologies for space. The Nanosatellite effort is a solid and well founded program with a backbone of technology research and Multifunctional Microsystems (MMS) thinking.

  15. Towards co-packaging of photonics and microelectronics in existing manufacturing facilities

    NASA Astrophysics Data System (ADS)

    Janta-Polczynski, Alexander; Cyr, Elaine; Bougie, Jerome; Drouin, Alain; Langlois, Richard; Childers, Darrell; Takenobu, Shotaro; Taira, Yoichi; Lichoulas, Ted W.; Kamlapurkar, Swetha; Engelmann, Sebastian; Fortier, Paul; Boyer, Nicolas; Barwicz, Tymon

    2018-02-01

    The impact of integrated photonics on optical interconnects is currently muted by challenges in photonic packaging and in the dense integration of photonic modules with microelectronic components on printed circuit boards. Single mode optics requires tight alignment tolerance for optical coupling and maintaining this alignment in a cost-efficient package can be challenging during thermal excursions arising from downstream microelectronic assembly processes. In addition, the form factor of typical fiber connectors is incompatible with the dense module integration expected on printed circuit boards. We have implemented novel approaches to interfacing photonic chips to standard optical fibers. These leverage standard high throughput microelectronic assembly tooling and self-alignment techniques resulting in photonic packaging that is scalable in manufacturing volume and in the number of optical IOs per chip. In addition, using dense optical fiber connectors with space-efficient latching of fiber patch cables results in compact module size and efficient board integration, bringing the optics closer to the logic chip to alleviate bandwidth bottlenecks. This packaging direction is also well suited for embedding optics in multi-chip modules, including both photonic and microelectronic chips. We discuss the challenges and rewards in this type of configuration such as thermal management and signal integrity.

  16. Integrating photonics with silicon nanoelectronics for the next generation of systems on a chip.

    PubMed

    Atabaki, Amir H; Moazeni, Sajjad; Pavanello, Fabio; Gevorgyan, Hayk; Notaros, Jelena; Alloatti, Luca; Wade, Mark T; Sun, Chen; Kruger, Seth A; Meng, Huaiyu; Al Qubaisi, Kenaish; Wang, Imbert; Zhang, Bohan; Khilo, Anatol; Baiocco, Christopher V; Popović, Miloš A; Stojanović, Vladimir M; Ram, Rajeev J

    2018-04-01

    Electronic and photonic technologies have transformed our lives-from computing and mobile devices, to information technology and the internet. Our future demands in these fields require innovation in each technology separately, but also depend on our ability to harness their complementary physics through integrated solutions 1,2 . This goal is hindered by the fact that most silicon nanotechnologies-which enable our processors, computer memory, communications chips and image sensors-rely on bulk silicon substrates, a cost-effective solution with an abundant supply chain, but with substantial limitations for the integration of photonic functions. Here we introduce photonics into bulk silicon complementary metal-oxide-semiconductor (CMOS) chips using a layer of polycrystalline silicon deposited on silicon oxide (glass) islands fabricated alongside transistors. We use this single deposited layer to realize optical waveguides and resonators, high-speed optical modulators and sensitive avalanche photodetectors. We integrated this photonic platform with a 65-nanometre-transistor bulk CMOS process technology inside a 300-millimetre-diameter-wafer microelectronics foundry. We then implemented integrated high-speed optical transceivers in this platform that operate at ten gigabits per second, composed of millions of transistors, and arrayed on a single optical bus for wavelength division multiplexing, to address the demand for high-bandwidth optical interconnects in data centres and high-performance computing 3,4 . By decoupling the formation of photonic devices from that of transistors, this integration approach can achieve many of the goals of multi-chip solutions 5 , but with the performance, complexity and scalability of 'systems on a chip' 1,6-8 . As transistors smaller than ten nanometres across become commercially available 9 , and as new nanotechnologies emerge 10,11 , this approach could provide a way to integrate photonics with state-of-the-art nanoelectronics.

  17. Dry soldering with hot filament produced atomic hydrogen

    DOEpatents

    Panitz, Janda K. G.; Jellison, James L.; Staley, David J.

    1995-01-01

    A system for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs.

  18. Design and implementation of GaAs HBT circuits with ACME

    NASA Technical Reports Server (NTRS)

    Hutchings, Brad L.; Carter, Tony M.

    1993-01-01

    GaAs HBT circuits offer high performance (5-20 GHz) and radiation hardness (500 Mrad) that is attractive for space applications. ACME is a CAD tool specifically developed for HBT circuits. ACME implements a novel physical schematic-capture design technique where designers simultaneously view the structure and physical organization of a circuit. ACME's design interface is similar to schematic capture; however, unlike conventional schematic capture, designers can directly control the physical placement of both function and interconnect at the schematic level. In addition, ACME provides design-time parasitic extraction, complex wire models, and extensions to Multi-Chip Modules (MCM's). A GaAs HBT gate-array and semi-custom circuits have been developed with ACME; several circuits have been fabricated and found to be fully functional .

  19. Planned development of a 3D computer based on free-space optical interconnects

    NASA Astrophysics Data System (ADS)

    Neff, John A.; Guarino, David R.

    1994-05-01

    Free-space optical interconnection has the potential to provide upwards of a million data channels between planes of electronic circuits. This may result in the planar board and backplane structures of today giving away to 3-D stacks of wafers or multi-chip modules interconnected via channels running perpendicular to the processor planes, thereby eliminating much of the packaging overhead. Three-dimensional packaging is very appealing for tightly coupled fine-grained parallel computing where the need for massive numbers of interconnections is severely taxing the capabilities of the planar structures. This paper describes a coordinated effort by four research organizations to demonstrate an operational fine-grained parallel computer that achieves global connectivity through the use of free space optical interconnects.

  20. Dry-film polymer waveguide for silicon photonics chip packaging.

    PubMed

    Hsu, Hsiang-Han; Nakagawa, Shigeru

    2014-09-22

    Polymer waveguide made by dry film process is demonstrated for silicon photonics chip packaging. With 8 μm × 11.5 μm core waveguide, little penalty is observed up to 25 Gbps before or after the light propagate through a 10-km long single-mode fiber (SMF). Coupling loss to SMF is 0.24 dB and 1.31 dB at the polymer waveguide input and output ends, respectively. Alignment tolerance for 0.5 dB loss increase is +/- 1.0 μm along both vertical and horizontal directions for the coupling from the polymer waveguide to SMF. The dry-film polymer waveguide demonstrates promising performance for silicon photonics chip packaging used in next generation optical multi-chip module.

  1. Silicon Drift Detectors - A Novel Technology for Vertex Detectors

    NASA Astrophysics Data System (ADS)

    Lynn, D.

    1996-10-01

    Silicon Drift Detectors (SDD) are novel position sensing silicon detectors which operate in a manner analogous to gas drift detectors. Single SDD's were shown in the CERN NA45 experiment to permit excellent spatial resolution (< 10 μm), to handle large particle occupancy, and to require a small fraction of the number of electronic channels of an equivalent pixel detector. The Silicon Vertex Tracker (SVT) for the STAR experiment at RHIC is based on this new technology. The SVT will consist of 216 SDD's, each 6.3 cm by 6.3 cm, arranged in a three layer barrel design, covering 2 π in azimuth and ±1 in pseudo-rapidity. Over the last three years we undertook a concentrated R+D effort to optimize the performance of the detector by minimizing the inactive area, the operating voltage and the data volume. We will present test results from several wafer prototypes. The charge produced by the passage of ionizing particles through the bulk of the detectors is collected on segmented anodes, with a pitch of 250 μm, on the far edges of the detector. The anodes are wire-bonded to a thick film multi-chip module which contains preamplifier/shaper chips and CMOS based switched capacitor arrays used as an analog memory pipeline. The ADC is located off-detector. The complete readout chain from the wafer to the DAQ will be presented. Finally we will show physics performance simulations based on the resolution achieved by the SVT prototypes.

  2. Vertical-cavity surface-emitting lasers: the applications

    NASA Astrophysics Data System (ADS)

    Morgan, Robert A.; Lehman, John A.; Hibbs-Brenner, Mary K.; Liu, Yue; Bristow, Julian P. G.

    1997-05-01

    In this paper, we focus on how vertical-cavity surface- emitting lasers (VCSELs) and arrays have led to many feasible advanced technological applications. Their intrinsic characteristics, performance, and producibility offer substantial advantages over alternative sources. Demonstrated performance of `commercial-grade' VCSELs include low operating powers (< 2 V, mAs), high speeds (3 dB BWs > 15 GHz), and high temperature operating ranges (10 K to 400 K and -55 degree(s)C to 125 degree(s)C, and T > 200 degree(s)C). Moreover, their robustness is manifest by high reliability in excess of 107 hours mean time between failures at room temperature and tenfold improvement over existing rad-hard LEDs. Hence, even these `commercial-grade' VCSELs offer potential within cryogenic and avionics/military or space environments. We have also demonstrated submilliamp ITH, stable, single-mode VCSELs utilized within bias-free 1-Gbit/s data links. These low- power VCSELs may also serve in applications from printers to low-cost atomic clocks. The greatest near-term VCSEL applications are upgrades to low-cost LEDs and high-grade copper wire in data links and sensors. Exploiting their surface-emitting geometry, VCSELs are also compatible with established multichip module packaging. Hence VCSELs and VCSEL arrays are ideal components for interconnect-intensive processing applications between and within computing systems.

  3. Photodiodes integration on a suspended ridge structure VOA using 2-step flip-chip bonding method

    NASA Astrophysics Data System (ADS)

    Kim, Seon Hoon; Kim, Tae Un; Ki, Hyun Chul; Kim, Doo Gun; Kim, Hwe Jong; Lim, Jung Woon; Lee, Dong Yeol; Park, Chul Hee

    2015-01-01

    In this works, we have demonstrated a VOA integrated with mPDs, based on silica-on-silicon PLC and flip-chip bonding technologies. The suspended ridge structure was applied to reduce the power consumption. It achieves the attenuation of 30dB in open loop operation with the power consumption of below 30W. We have applied two-step flipchip bonding method using passive alignment to perform high density multi-chip integration on a VOA with eutectic AuSn solder bumps. The average bonding strength of the two-step flip-chip bonding method was about 90gf.

  4. Dry soldering with hot filament produced atomic hydrogen

    DOEpatents

    Panitz, J.K.G.; Jellison, J.L.; Staley, D.J.

    1995-04-25

    A system is disclosed for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs. 1 fig.

  5. Powerful, Efficient Electric Vehicle Chargers: Low-Cost, Highly-Integrated Silicon Carbide (SiC) Multichip Power Modules (MCPMs) for Plug-In Hybrid Electric

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    None

    2010-09-14

    ADEPT Project: Currently, charging the battery of an electric vehicle (EV) is a time-consuming process because chargers can only draw about as much power from the grid as a hair dryer. APEI is developing an EV charger that can draw as much power as a clothes dryer, which would drastically speed up charging time. APEI's charger uses silicon carbide (SiC)-based power transistors. These transistors control the electrical energy flowing through the charger's circuits more effectively and efficiently than traditional transistors made of straight silicon. The SiC-based transistors also require less cooling, enabling APEI to create EV chargers that are 10more » times smaller than existing chargers.« less

  6. Ultra-thin silicon (UTSi) on insulator CMOS transceiver and time-division multiplexed switch chips for smart pixel integration

    NASA Astrophysics Data System (ADS)

    Zhang, Liping; Sawchuk, Alexander A.

    2001-12-01

    We describe the design, fabrication and functionality of two different 0.5 micron CMOS optoelectronic integrated circuit (OEIC) chips based on the Peregrine Semiconductor Ultra-Thin Silicon on insulator technology. The Peregrine UTSi silicon- on-sapphire (SOS) technology is a member of the silicon-on- insulator (SOI) family. The low-loss synthetic sapphire substrate is optically transparent and has good thermal conductivity and coefficient of thermal expansion properties, which meet the requirements for flip-chip bonding of VCSELs and other optoelectronic input-output components. One chip contains transceiver and network components, including four channel high-speed CMOS transceiver modules, pseudo-random bit stream (PRBS) generators, a voltage controlled oscillator (VCO) and other test circuits. The transceiver chips can operate in both self-testing mode and networking mode. An on- chip clock and true-single-phase-clock (TSPC) D-flip-flop have been designed to generate a PRBS at over 2.5 Gb/s for the high-speed transceiver arrays to operate in self-testing mode. In the networking mode, an even number of transceiver chips forms a ring network through free-space or fiber ribbon interconnections. The second chip contains four channel optical time-division multiplex (TDM) switches, optical transceiver arrays, an active pixel detector and additional test devices. The eventual applications of these chips will require monolithic OEICs with integrated optical input and output. After fabrication and testing, the CMOS transceiver array dies will be packaged with 850 nm vertical cavity surface emitting lasers (VCSELs), and metal-semiconductor- metal (MSM) or GaAs p-i-n detector die arrays to achieve high- speed optical interconnections. The hybrid technique could be either wire bonding or flip-chip bonding of the CMOS SOS smart-pixel arrays with arrays of VCSELs and photodetectors onto an optoelectronic chip carrier as a multi-chip module (MCM).

  7. High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

    NASA Technical Reports Server (NTRS)

    Shalkhauser, K. A.; Li, K.; Shih, Y. C.

    1992-01-01

    Packaging schemes were developed that provide low-loss, hermetic enclosure for advanced monolithic microwave and millimeter-wave integrated circuits (MMICs). The package designs are based on a fused quartz substrate material that offers improved radio frequency (RF) performance through 44 gigahertz (GHz). The small size and weight of the packages make them appropriate for a variety of applications, including phased array antenna systems. Packages were designed in two forms; one for housing a single MMIC chip, the second in the form of a multi-chip phased array module. The single chip array module was developed in three separate sizes, for chips of different geometry and frequency requirements. The phased array module was developed to address packaging directly for antenna applications, and includes transmission line and interconnect structures to support multi-element operation. All packages are fabricated using fused quartz substrate materials. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices. The package and test fixture designs were both developed in a generic sense, optimizing performance for a wide range of possible applications and devices.

  8. A multichip aVLSI system emulating orientation selectivity of primary visual cortical cells.

    PubMed

    Shimonomura, Kazuhiro; Yagi, Tetsuya

    2005-07-01

    In this paper, we designed and fabricated a multichip neuromorphic analog very large scale integrated (aVLSI) system, which emulates the orientation selective response of the simple cell in the primary visual cortex. The system consists of a silicon retina and an orientation chip. An image, which is filtered by a concentric center-surround (CS) antagonistic receptive field of the silicon retina, is transferred to the orientation chip. The image transfer from the silicon retina to the orientation chip is carried out with analog signals. The orientation chip selectively aggregates multiple pixels of the silicon retina, mimicking the feedforward model proposed by Hubel and Wiesel. The chip provides the orientation-selective (OS) outputs which are tuned to 0 degrees, 60 degrees, and 120 degrees. The feed-forward aggregation reduces the fixed pattern noise that is due to the mismatch of the transistors in the orientation chip. The spatial properties of the orientation selective response were examined in terms of the adjustable parameters of the chip, i.e., the number of aggregated pixels and size of the receptive field of the silicon retina. The multichip aVLSI architecture used in the present study can be applied to implement higher order cells such as the complex cell of the primary visual cortex.

  9. Selective attention in multi-chip address-event systems.

    PubMed

    Bartolozzi, Chiara; Indiveri, Giacomo

    2009-01-01

    Selective attention is the strategy used by biological systems to cope with the inherent limits in their available computational resources, in order to efficiently process sensory information. The same strategy can be used in artificial systems that have to process vast amounts of sensory data with limited resources. In this paper we present a neuromorphic VLSI device, the "Selective Attention Chip" (SAC), which can be used to implement these models in multi-chip address-event systems. We also describe a real-time sensory-motor system, which integrates the SAC with a dynamic vision sensor and a robotic actuator. We present experimental results from each component in the system, and demonstrate how the complete system implements a real-time stimulus-driven selective attention model.

  10. Experiences with integral microelectronics on smart structures for space

    NASA Astrophysics Data System (ADS)

    Nye, Ted; Casteel, Scott; Navarro, Sergio A.; Kraml, Bob

    1995-05-01

    One feature of a smart structure implies that some computational and signal processing capability can be performed at a local level, perhaps integral to the controlled structure. This requires electronics with a minimal mechanical influence regarding structural stiffening, heat dissipation, weight, and electrical interface connectivity. The Advanced Controls Technology Experiment II (ACTEX II) space-flight experiments implemented such a local control electronics scheme by utilizing composite smart members with integral processing electronics. These microelectronics, tested to MIL-STD-883B levels, were fabricated with conventional thick film on ceramic multichip module techniques. Kovar housings and aluminum-kapton multilayer insulation was used to protect against harsh space radiation and thermal environments. Development and acceptance testing showed the electronics design was extremely robust, operating in vacuum and at temperature range with minimal gain variations occurring just above room temperatures. Four electronics modules, used for the flight hardware configuration, were connected by a RS-485 2 Mbit per second serial data bus. The data bus was controlled by Actel field programmable gate arrays arranged in a single master, four slave configuration. An Intel 80C196KD microprocessor was chosen as the digital compensator in each controller. It was used to apply a series of selectable biquad filters, implemented via Delta Transforms. Instability in any compensator was expected to appear as large amplitude oscillations in the deployed structure. Thus, over-vibration detection circuitry with automatic output isolation was incorporated into the design. This was not used however, since during experiment integration and test, intentionally induced compensator instabilities resulted in benign mechanical oscillation symptoms. Not too surprisingly, it was determined that instabilities were most detectable by large temperature increases in the electronics, typically noticeable within minutes of unstable operation.

  11. Trade-offs between lens complexity and real estate utilization in a free-space multichip global interconnection module.

    PubMed

    Milojkovic, Predrag; Christensen, Marc P; Haney, Michael W

    2006-07-01

    The FAST-Net (Free-space Accelerator for Switching Terabit Networks) concept uses an array of wide-field-of-view imaging lenses to realize a high-density shuffle interconnect pattern across an array of smart-pixel integrated circuits. To simplify the optics we evaluated the efficiency gained in replacing spherical surfaces with aspherical surfaces by exploiting the large disparity between narrow vertical cavity surface emitting laser (VCSEL) beams and the wide field of view of the imaging optics. We then analyzed trade-offs between lens complexity and chip real estate utilization and determined that there exists an optimal numerical aperture for VCSELs that maximizes their area density. The results provide a general framework for the design of wide-field-of-view free-space interconnection systems that incorporate high-density VCSEL arrays.

  12. High temperature charge amplifier for geothermal applications

    DOEpatents

    Lindblom, Scott C.; Maldonado, Frank J.; Henfling, Joseph A.

    2015-12-08

    An amplifier circuit in a multi-chip module includes a charge to voltage converter circuit, a voltage amplifier a low pass filter and a voltage to current converter. The charge to voltage converter receives a signal representing an electrical charge and generates a voltage signal proportional to the input signal. The voltage amplifier receives the voltage signal from the charge to voltage converter, then amplifies the voltage signal by the gain factor to output an amplified voltage signal. The lowpass filter passes low frequency components of the amplified voltage signal and attenuates frequency components greater than a cutoff frequency. The voltage to current converter receives the output signal of the lowpass filter and converts the output signal to a current output signal; wherein an amplifier circuit output is selectable between the output signal of the lowpass filter and the current output signal.

  13. Compact VLSI neural computer integrated with active pixel sensor for real-time ATR applications

    NASA Astrophysics Data System (ADS)

    Fang, Wai-Chi; Udomkesmalee, Gabriel; Alkalai, Leon

    1997-04-01

    A compact VLSI neural computer integrated with an active pixel sensor has been under development to mimic what is inherent in biological vision systems. This electronic eye- brain computer is targeted for real-time machine vision applications which require both high-bandwidth communication and high-performance computing for data sensing, synergy of multiple types of sensory information, feature extraction, target detection, target recognition, and control functions. The neural computer is based on a composite structure which combines Annealing Cellular Neural Network (ACNN) and Hierarchical Self-Organization Neural Network (HSONN). The ACNN architecture is a programmable and scalable multi- dimensional array of annealing neurons which are locally connected with their local neurons. Meanwhile, the HSONN adopts a hierarchical structure with nonlinear basis functions. The ACNN+HSONN neural computer is effectively designed to perform programmable functions for machine vision processing in all levels with its embedded host processor. It provides a two order-of-magnitude increase in computation power over the state-of-the-art microcomputer and DSP microelectronics. A compact current-mode VLSI design feasibility of the ACNN+HSONN neural computer is demonstrated by a 3D 16X8X9-cube neural processor chip design in a 2-micrometers CMOS technology. Integration of this neural computer as one slice of a 4'X4' multichip module into the 3D MCM based avionics architecture for NASA's New Millennium Program is also described.

  14. Challenges and Opportunities in Gen3 Embedded Cooling with High-Quality Microgap Flow

    NASA Technical Reports Server (NTRS)

    Bar-Cohen, Avram; Robinson, Franklin L.; Deisenroth, David C.

    2018-01-01

    Gen3, Embedded Cooling, promises to revolutionize thermal management of advanced microelectronic systems by eliminating the sequential conductive and interfacial thermal resistances which dominate the present 'remote cooling' paradigm. Single-phase interchip microfluidic flow with high thermal conductivity chips and substrates has been used successfully to cool single transistors dissipating more than 40kW/sq cm, but efficient heat removal from transistor arrays, larger chips, and chip stacks operating at these prodigious heat fluxes would require the use of high vapor fraction (quality), two-phase cooling in intra- and inter-chip microgap channels. The motivation, as well as the challenges and opportunities associated with evaporative embedded cooling in realistic form factors, is the focus of this paper. The paper will begin with a brief review of the history of thermal packaging, reflecting the 70-year 'inward migration' of cooling technology from the computer-room, to the rack, and then to the single chip and multichip module with 'remote' or attached air- and liquid-cooled coldplates. Discussion of the limitations of this approach and recent results from single-phase embedded cooling will follow. This will set the stage for discussion of the development challenges associated with application of this Gen3 thermal management paradigm to commercial semiconductor hardware, including dealing with the effects of channel length, orientation, and manifold-driven centrifugal acceleration on the governing behavior.

  15. A digital front-end and readout microsystem for calorimetry at LHC

    NASA Astrophysics Data System (ADS)

    Alippi, C.; Appelquist, G.; Berglund, S.; Bohm, C.; Breveglieri, L.; Brigati, S.; Carlson, P.; Cattaneo, P.; Dadda, L.; David, J.; Del Buono, L.; Dell'Acqua, A.; Engström, M.; Fumagalli, G.; Gatti, U.; Genat, J. F.; Goggi, G.; Hansen, M.; Hentzell, H.; Höglund, I.; Inkinen, S.; Kerek, A.; Lebbolo, H.; LeDortz, O.; Lofstedt, B.; Maloberti, F.; Nayman, P.; Persson, S.-T.; Piuri, V.; Salice, F.; Sami, M.; Savoy-Navarro, A.; Stefanelli, R.; Sundblad, R.; Svensson, C.; Torelli, G.; Vanuxem, J. P.; Yamdagni, N.; Yuan, J.; Zitoun, R.

    1994-04-01

    A digital solution to the front-end electronics for calorimetric detectors at future supercolliders is presented. The solution is based on high speed {A}/{D} converters, a fully programmable pipeline/digital filter chain and local intelligence. Questions of error correction, fault-tolerance and system redundancy are also being considered. A system integration of a multichannel device in a multichip, Silicon-on-Silicon Microsystem hybrid, is used. This solution allows a new level of integration of complex analogue and digital functions, with an excellent flexibility in mixing technologies for the different functional blocks. It also allows a high degree of programmability at both the function and the system level, and offers the possibility of customising the microsystem with detector-specific functions.

  16. Modeling selective attention using a neuromorphic analog VLSI device.

    PubMed

    Indiveri, G

    2000-12-01

    Attentional mechanisms are required to overcome the problem of flooding a limited processing capacity system with information. They are present in biological sensory systems and can be a useful engineering tool for artificial visual systems. In this article we present a hardware model of a selective attention mechanism implemented on a very large-scale integration (VLSI) chip, using analog neuromorphic circuits. The chip exploits a spike-based representation to receive, process, and transmit signals. It can be used as a transceiver module for building multichip neuromorphic vision systems. We describe the circuits that carry out the main processing stages of the selective attention mechanism and provide experimental data for each circuit. We demonstrate the expected behavior of the model at the system level by stimulating the chip with both artificially generated control signals and signals obtained from a saliency map, computed from an image containing several salient features.

  17. Fourier plane image amplifier

    DOEpatents

    Hackel, Lloyd A.; Hermann, Mark R.; Dane, C. Brent; Tiszauer, Detlev H.

    1995-01-01

    A solid state laser is frequency tripled to 0.3 .mu.m. A small portion of the laser is split off and generates a Stokes seed in a low power oscillator. The low power output passes through a mask with the appropriate hole pattern. Meanwhile, the bulk of the laser output is focused into a larger stimulated Brillouin scattering (SBS) amplifier. The low power beam is directed through the same cell in the opposite direction. The majority of the amplification takes place at the focus which is the fourier transform plane of the mask image. The small holes occupy large area at the focus and thus are preferentially amplified. The amplified output is now imaged onto the multichip module where the holes are drilled. Because of the fourier plane amplifier, only .about.1/10th the power of a competitive system is needed. This concept allows less expensive masks to be used in the process and requires much less laser power.

  18. Fourier plane image amplifier

    DOEpatents

    Hackel, L.A.; Hermann, M.R.; Dane, C.B.; Tiszauer, D.H.

    1995-12-12

    A solid state laser is frequency tripled to 0.3 {micro}m. A small portion of the laser is split off and generates a Stokes seed in a low power oscillator. The low power output passes through a mask with the appropriate hole pattern. Meanwhile, the bulk of the laser output is focused into a larger stimulated Brillouin scattering (SBS) amplifier. The low power beam is directed through the same cell in the opposite direction. The majority of the amplification takes place at the focus which is the fourier transform plane of the mask image. The small holes occupy large area at the focus and thus are preferentially amplified. The amplified output is now imaged onto the multichip module where the holes are drilled. Because of the fourier plane amplifier, only about 1/10th the power of a competitive system is needed. This concept allows less expensive masks to be used in the process and requires much less laser power. 1 fig.

  19. Experimental study on the application of paraffin slurry to high density electronic package cooling

    NASA Astrophysics Data System (ADS)

    Cho, K.; Choi, M.

    Experiments were performed by using water and paraffin slurry to investigate thermal characteristics from a test multichip module. The parameters were the mass fraction of paraffin slurry (0, 2.5, 5, 7.5%), heat flux (10, 20, 30, 40W/cm2) and channel Reynolds numbers. The size of paraffin slurry particles was within 10-40μm. The local heat transfer coefficients for the paraffin slurry were larger than those for water. Thermally fully developed conditions were observed after the third or fourth row. The paraffin slurry with a mass fraction of 5% showed the most efficient cooling performance when the heat transfer and the pressure drop in the test section were considered simultaneously. A new correlation for the water and the paraffin slurry with a mass fraction of 5% was obtained for a channel Reynolds number over 5300.

  20. An integrated circuit switch

    NASA Technical Reports Server (NTRS)

    Bonin, E. L.

    1969-01-01

    Multi-chip integrated circuit switch consists of a GaAs photon-emitting diode in close proximity with S1 phototransistor. A high current gain is obtained when the transistor has a high forward common-emitter current gain.

  1. Fabrication and demonstration of 1 × 8 silicon-silica multi-chip switch based on optical phased array

    NASA Astrophysics Data System (ADS)

    Katayose, Satomi; Hashizume, Yasuaki; Itoh, Mikitaka

    2016-08-01

    We experimentally demonstrated a 1 × 8 silicon-silica hybrid thermo-optic switch based on an optical phased array using a multi-chip integration technique. The switch consists of a silicon chip with optical phase shifters and two silica-based planar lightwave circuit (PLC) chips composed of optical couplers and fiber connections. We adopted a rib waveguide as the silicon waveguide to reduce the coupling loss and increase the alignment tolerance for coupling between silicon and silica waveguides. As a result, we achieved a fast switching response of 81 µs, a high extinction ratio of over 18 dB and a low insertion loss of 4.9-8.1 dB including a silicon-silica coupling loss of 0.5 ± 0.3 dB at a wavelength of 1.55 µm.

  2. Quartz/fused silica chip carriers

    NASA Technical Reports Server (NTRS)

    1992-01-01

    The primary objective of this research and development effort was to develop monolithic microwave integrated circuit (MMIC) packaging which will operate efficiently at millimeter-wave frequencies. The packages incorporated fused silica as the substrate material which was selected due to its favorable electrical properties and potential performance improvement over more conventional materials for Ka-band operation. The first step towards meeting this objective is to develop a package that meets standard mechanical and thermal requirements using fused silica and to be compatible with semiconductor devices operating up to at least 44 GHz. The second step is to modify the package design and add multilayer and multicavity capacity to allow for application specific integrated circuits (ASIC's) to control multiple phase shifters. The final step is to adapt the package design to a phased array module with integral radiating elements. The first task was a continuation of the SBIR Phase 1 work. Phase 1 identified fused silica as a viable substrate material by demonstrating various plating, machining, and adhesion properties. In Phase 2 Task 1, a package was designed and fabricated to validate these findings. Task 2 was to take the next step in packaging and fabricate a multilayer, multichip module (MCM). This package is the predecessor to the phased array module and demonstrates the ability to via fill, circuit print, laminate, and to form vertical interconnects. The final task was to build a phased array module. The radiating elements were to be incorporated into the package instead of connecting to it with wire or ribbon bonds.

  3. Advanced Materials for High Temperature, High Performance, Wide Bandgap Power Modules

    NASA Astrophysics Data System (ADS)

    O'Neal, Chad B.; McGee, Brad; McPherson, Brice; Stabach, Jennifer; Lollar, Richard; Liederbach, Ross; Passmore, Brandon

    2016-01-01

    Advanced packaging materials must be utilized to take full advantage of the benefits of the superior electrical and thermal properties of wide bandgap power devices in the development of next generation power electronics systems. In this manuscript, the use of advanced materials for key packaging processes and components in multi-chip power modules will be discussed. For example, to date, there has been significant development in silver sintering paste as a high temperature die attach material replacement for conventional solder-based attach due to the improved thermal and mechanical characteristics as well as lower processing temperatures. In order to evaluate the bond quality and performance of this material, shear strength, thermal characteristics, and void quality for a number of silver sintering paste materials were analyzed as a die attach alternative to solder. In addition, as high voltage wide bandgap devices shift from engineering samples to commercial components, passivation materials become key in preventing premature breakdown in power modules. High temperature, high dielectric strength potting materials were investigated to be used to encapsulate and passivate components internal to a power module. The breakdown voltage up to 30 kV and corresponding leakage current for these materials as a function of temperature is also presented. Lastly, high temperature plastic housing materials are important for not only discrete devices but also for power modules. As the operational temperature of the device and/or ambient temperature increases, the mechanical strength and dielectric properties are dramatically reduced. Therefore, the electrical characteristics such as breakdown voltage and leakage current as a function of temperature for housing materials are presented.

  4. Universal sensor interface module (USIM)

    NASA Astrophysics Data System (ADS)

    King, Don; Torres, A.; Wynn, John

    1999-01-01

    A universal sensor interface model (USIM) is being developed by the Raytheon-TI Systems Company for use with fields of unattended distributed sensors. In its production configuration, the USIM will be a multichip module consisting of a set of common modules. The common module USIM set consists of (1) a sensor adapter interface (SAI) module, (2) digital signal processor (DSP) and associated memory module, and (3) a RF transceiver model. The multispectral sensor interface is designed around a low-power A/D converted, whose input/output interface consists of: -8 buffered, sampled inputs from various devices including environmental, acoustic seismic and magnetic sensors. The eight sensor inputs are each high-impedance, low- capacitance, differential amplifiers. The inputs are ideally suited for interface with discrete or MEMS sensors, since the differential input will allow direct connection with high-impedance bridge sensors and capacitance voltage sources. Each amplifier is connected to a 22-bit (Delta) (Sigma) A/D converter to enable simultaneous samples. The low power (Delta) (Sigma) converter provides 22-bit resolution at sample frequencies up to 142 hertz (used for magnetic sensors) and 16-bit resolution at frequencies up to 1168 hertz (used for acoustic and seismic sensors). The video interface module is based around the TMS320C5410 DSP. It can provide sensor array addressing, video data input, data calibration and correction. The processor module is based upon a MPC555. It will be used for mode control, synchronization of complex sensors, sensor signal processing, array processing, target classification and tracking. Many functions of the A/D, DSP and transceiver can be powered down by using variable clock speeds under software command or chip power switches. They can be returned to intermediate or full operation by DSP command. Power management may be based on the USIM's internal timer, command from the USIM transceiver, or by sleep mode processing management. The low power detection mode is implemented by monitoring any of the sensor analog outputs at lower sample rates for detection over a software controllable threshold.

  5. Optical interconnection using polyimide waveguide for multichip module

    NASA Astrophysics Data System (ADS)

    Koyanagi, Mitsumasa

    1996-01-01

    We have developed a parallel processor system with 152 RISC processor chips specific for Monte-Carlo analysis. This system has the ring-bus architecture. The performance of several Gflops is expected in this system according to the computer simulation. However, it was revealed that the data transfer speed of the bus has to be increased more dramatically in order to further increase the performance. Then, we propose to introduce the optical interconnection into the parallel processor system to increase the data transfer speed of the buses. The double ringbus architecture is employed in this new parallel processor system with optical interconnection. The free-space optical interconnection arid the optical waveguide are used for the optical ring-bus. Thin polyimide film was used to form the optical waveguide. A relatively low propagation loss was achieved in the polyimide optical waveguide. In addition, it was confirmed that the propagation direction of signal light can be easily changed by using a micro-mirror.

  6. Optical interconnection using polyimide waveguide for multichip module

    NASA Astrophysics Data System (ADS)

    Koyanagi, Mitsumasa

    1996-01-01

    We have developed a parallel processor system with 152 RISC processor chips specific for Monte-Carlo analysis. This system has the ring-bus architecture. The performance of several Gflops is expected in this system according to the computer simulation. However, it was revealed that the data transfer speed of the bus has to be increased more dramatically in order to further increase the performance. Then, we propose to introduce the optical interconnection into the parallel processor system to increase the data transfer speed of the buses. The double ring-bus architecture is employed in this new parallel processor system with optical interconnection. The free-space optical interconnection and the optical waveguide are used for the optical ring-bus. Thin polyimide film was used to form the optical waveguide. A relatively low propagation loss was achieved in the polyimide optical waveguide. In addition, it was confirmed that the propagation direction of signal light can be easily changed by using a micro-mirror.

  7. Tunable All-Solid-State Local Oscillators to 1900 GHz

    NASA Technical Reports Server (NTRS)

    Ward, John; Chattopadhyay, Goutam; Maestrini, Alain; Schlecht, Erich; Gill, John; Javadi, Hamid; Pukala, David; Maiwald, Frank; Mehdi, Imran

    2004-01-01

    We present a status report of an ongoing effort to develop robust tunable all-solid-state sources up to 1900 GHz for the Heterodyne Instrument for the Far Infrared (HIFI) on the Herschel Space Observatory. GaAs based multi-chip power amplifier modules at W-band are used to drive cascaded chains of multipliers. We have demonstrated performance from chains comprised of four doublers up to 1600 GHz as well as from a x2x3x3 chain to 1900 GHz. Measured peak output power of 23 (micro)W at 1782 GHz and 2.6 (micro)W at 1900 GHz has been achieved when the multipliers are cooled to 120K. The 1900 GHz tripler was pumped with a four anode tripler that produces a peak of 4 mW at 630 GHz when cooled to 120 K. We believe that these sources can now be used to pump hot electron bolometer (HEB) heterodyne mixers.ter (HEB) heterodyne mixers.

  8. Ion implantation enhanced metal-Si-metal photodetectors

    NASA Astrophysics Data System (ADS)

    Sharma, A. K.; Scott, K. A. M.; Brueck, S. R. J.; Zolper, J. C.; Myers, D. R.

    1994-05-01

    The quantum efficiency and frequency response of simple Ni-Si-Ni metal-semiconductor-metal (MSM) photodetectors at long wavelengths are significantly enhanced with a simple, ion-implantation step to create a highly absorbing region approx. 1 micron below the Si surface. The internal quantum efficiency is improved by a factor of approx. 3 at 860 nm (to 64%) and a full factor of ten at 1.06 microns (to 23%) as compared with otherwise identical unimplanted devices. Dark currents are only slightly affected by the implantation process and are as low as 630 pA for a 4.5-micron gap device at 10-V bias. Dramatic improvement in the impulse response is observed, 100 ps vs. 600 ps, also at 10-V bias and 4.5-micron gap, due to the elimination of carrier diffusion tails in the implanted devices. Due to its planar structure, this device is fully VLSI compatible. Potential applications include optical interconnections for local area networks and multi-chip modules.

  9. Microchannel cooling of face down bonded chips

    DOEpatents

    Bernhardt, Anthony F.

    1993-01-01

    Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multichip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.

  10. Novel Techniques for Millimeter-Wave Packages

    NASA Technical Reports Server (NTRS)

    Herman, Martin I.; Lee, Karen A.; Kolawa, Elzbieta A.; Lowry, Lynn E.; Tulintseff, Ann N.

    1995-01-01

    A new millimeter-wave package architecture with supporting electrical, mechanical and material science experiment and analysis is presented. This package is well suited for discrete devices, monolithic microwave integrated circuits (MMIC's) and multichip module (MCM) applications. It has low-loss wide-band RF transitions which are necessary to overcome manufacturing tolerances leading to lower per unit cost Potential applications of this new packaging architecture which go beyond the standard requirements of device protection include integration of antennas, compatibility to photonic networks and direct transitions to waveguide systems. Techniques for electromagnetic analysis, thermal control and hermetic sealing were explored. Three dimensional electromagnetic analysis was performed using a finite difference time-domain (FDTD) algorithm and experimentally verified for millimeter-wave package input and output transitions. New multi-material system concepts (AlN, Cu, and diamond thin films) which allow excellent surface finishes to be achieved with enhanced thermal management have been investigated. A new approach utilizing block copolymer coatings was employed to hermetically seal packages which met MIL STD-883.

  11. In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration

    NASA Astrophysics Data System (ADS)

    Dietrich, P.-I.; Blaicher, M.; Reuter, I.; Billah, M.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Troppenz, U.; Moehrle, M.; Freude, W.; Koos, C.

    2018-04-01

    Hybrid photonic integration combines complementary advantages of different material platforms, offering superior performance and flexibility compared with monolithic approaches. This applies in particular to multi-chip concepts, where components can be individually optimized and tested. The assembly of such systems, however, requires expensive high-precision alignment and adaptation of optical mode profiles. We show that these challenges can be overcome by in situ printing of facet-attached beam-shaping elements. Our approach allows precise adaptation of vastly dissimilar mode profiles and permits alignment tolerances compatible with cost-efficient passive assembly techniques. We demonstrate a selection of beam-shaping elements at chip and fibre facets, achieving coupling efficiencies of up to 88% between edge-emitting lasers and single-mode fibres. We also realize printed free-form mirrors that simultaneously adapt beam shape and propagation direction, and we explore multi-lens systems for beam expansion. The concept paves the way to automated assembly of photonic multi-chip systems with unprecedented performance and versatility.

  12. Silicon Heat Pipe Array

    NASA Technical Reports Server (NTRS)

    Yee, Karl Y.; Ganapathi, Gani B.; Sunada, Eric T.; Bae, Youngsam; Miller, Jennifer R.; Beinsford, Daniel F.

    2013-01-01

    Improved methods of heat dissipation are required for modern, high-power density electronic systems. As increased functionality is progressively compacted into decreasing volumes, this need will be exacerbated. High-performance chip power is predicted to increase monotonically and rapidly with time. Systems utilizing these chips are currently reliant upon decades of old cooling technology. Heat pipes offer a solution to this problem. Heat pipes are passive, self-contained, two-phase heat dissipation devices. Heat conducted into the device through a wick structure converts the working fluid into a vapor, which then releases the heat via condensation after being transported away from the heat source. Heat pipes have high thermal conductivities, are inexpensive, and have been utilized in previous space missions. However, the cylindrical geometry of commercial heat pipes is a poor fit to the planar geometries of microelectronic assemblies, the copper that commercial heat pipes are typically constructed of is a poor CTE (coefficient of thermal expansion) match to the semiconductor die utilized in these assemblies, and the functionality and reliability of heat pipes in general is strongly dependent on the orientation of the assembly with respect to the gravity vector. What is needed is a planar, semiconductor-based heat pipe array that can be used for cooling of generic MCM (multichip module) assemblies that can also function in all orientations. Such a structure would not only have applications in the cooling of space electronics, but would have commercial applications as well (e.g. cooling of microprocessors and high-power laser diodes). This technology is an improvement over existing heat pipe designs due to the finer porosity of the wick, which enhances capillary pumping pressure, resulting in greater effective thermal conductivity and performance in any orientation with respect to the gravity vector. In addition, it is constructed of silicon, and thus is better suited for the cooling of semiconductor devices.

  13. Application de la technologie des materiaux sol-gel et polymere a l'optique integree

    NASA Astrophysics Data System (ADS)

    Saddiki, Zakaria

    2002-01-01

    With the advancement of optical telecommunication systems, "integrated optics" and "optical interconnect" technology are becoming more and more important. The major components of these two technologies are photonic integrated circuits (PICs), optoelectronic integrated circuits (OEICs), and optoelectronic multichip modules ( OE-MCMs). Optical signals are transmitted through optical waveguides that interconnect such components. The principle of optical transmission in waveguides is the same as that in optical fibres. To implement these technologies, both passive and active optical devices are needed. A wide variety of optical materials has been studied, e.g., glasses, lithium niobate, III-V semiconductors, sol-gel and polymers. In particular, passive optical components have been fabricated using glass optical waveguides by ion-exchange, or by flame hydrolysis deposition and reactive ion etching (FHD and RIE ). When using FHD and RIE, a very high temperatures (up to 1300°C) are needed to consolidate silica. This work reports on the fabrication and characterization of a new photo-patternable hybrid organic-inorganic glass sol-gel and polymer materials for the realisation of integrated optic and opto-electronic devices. They exhibit low losses in the NIR range, especially at the most important wavelengths windows for optical communications (1320 nm and 1550 nm). The sol-gel and polymer process is based on photo polymerization and thermo polymerization effects to create the wave-guide. The single-layer film is at low temperature and deep UV-light is employed to make the wave-guide by means of the well-known photolithography process. Like any photo-imaging process, the UV energy should exceed the threshold energy of chemical bonds in the photoactive component of hybrid glass material to form the expected integrated optic pattern with excellent line width control and vertical sidewalls. To achieve optical wave-guide, a refractive index difference Delta n occurred between the isolated (guiding layer) and the surrounding region (buffer and cladding). Accordingly, the refractive index emerges as a fundamental device performance material parameter and it is investigated using slab wave-guide. (Abstract shortened by UMI.)

  14. Neuromorphic VLSI Models of Selective Attention: From Single Chip Vision Sensors to Multi-chip Systems

    PubMed Central

    Indiveri, Giacomo

    2008-01-01

    Biological organisms perform complex selective attention operations continuously and effortlessly. These operations allow them to quickly determine the motor actions to take in response to combinations of external stimuli and internal states, and to pay attention to subsets of sensory inputs suppressing non salient ones. Selective attention strategies are extremely effective in both natural and artificial systems which have to cope with large amounts of input data and have limited computational resources. One of the main computational primitives used to perform these selection operations is the Winner-Take-All (WTA) network. These types of networks are formed by arrays of coupled computational nodes that selectively amplify the strongest input signals, and suppress the weaker ones. Neuromorphic circuits are an optimal medium for constructing WTA networks and for implementing efficient hardware models of selective attention systems. In this paper we present an overview of selective attention systems based on neuromorphic WTA circuits ranging from single-chip vision sensors for selecting and tracking the position of salient features, to multi-chip systems implement saliency-map based models of selective attention. PMID:27873818

  15. Neuromorphic VLSI Models of Selective Attention: From Single Chip Vision Sensors to Multi-chip Systems.

    PubMed

    Indiveri, Giacomo

    2008-09-03

    Biological organisms perform complex selective attention operations continuously and effortlessly. These operations allow them to quickly determine the motor actions to take in response to combinations of external stimuli and internal states, and to pay attention to subsets of sensory inputs suppressing non salient ones. Selective attention strategies are extremely effective in both natural and artificial systems which have to cope with large amounts of input data and have limited computational resources. One of the main computational primitives used to perform these selection operations is the Winner-Take-All (WTA) network. These types of networks are formed by arrays of coupled computational nodes that selectively amplify the strongest input signals, and suppress the weaker ones. Neuromorphic circuits are an optimal medium for constructing WTA networks and for implementing efficient hardware models of selective attention systems. In this paper we present an overview of selective attention systems based on neuromorphic WTA circuits ranging from single-chip vision sensors for selecting and tracking the position of salient features, to multi-chip systems implement saliency-map based models of selective attention.

  16. Planar millimeter wave radar frontend for automotive applications

    NASA Astrophysics Data System (ADS)

    Grubert, J.; Heyen, J.; Metz, C.; Stange, L. C.; Jacob, A. F.

    2003-05-01

    A fully integrated planar sensor for 77 GHz automotive applications is presented. The frontend consists of a transceiver multichip module and an electronically steerable microstrip patch array. The antenna feed network is based on a modified Rotman-lens and connected to the array in a multilayer approach offering higher integration. Furthermore, the frontend comprises a phase lock loop to allow proper frequency-modulated continuous wave (FMCW) radar operation. The latest experimental results verify the functionality of this advanced frontend design featuring automatic cruise control, precrash sensing and cut-in detection. These promising radar measurements give reason to a detailed theoretical investigation of system performance. Employing commercially available MMIC various circuit topologies are compared based on signal-tonoise considerations. Different scenarios for both sequential and parallel lobing hint to more advanced sensor designs and better performance. These improvements strongly depend on the availability of suitable MMIC and reliable packaging technologies. Within our present approach possible future MMIC developments are already considered and, thus, can be easily adapted by the flexible frontend design. Es wird ein integrierter planarer Sensor für 77 GHz Radaranwendungen vorgestellt. Das Frontend besteht aus einem Sende- und Empfangs-Multi-Chip-Modul und einer elektronisch schwenkbaren Antenne. Das Speisenetzwerk der Antenne basiert auf einer modifizierten Rotman- Linse. Für eine kompakte Bauweise sind Antenne und Speisenetzwerk mehrlagig integriert. Weiterhin umfasst das Frontend eine Phasenregelschleife für eine präzise Steuerung des frequenzmodulierten Dauerstrichradars. Die aktuellen Messergebnisse bestätigen die Funktionalit¨at dieses neuartigen Frontend-Designs, das automatische Geschwindigkeitsregelung, Kollisionswarnung sowie Nahbereichsüberwachung ermöglicht. Die Qualität der Messergebnisse hat weiterführende theoretische Untersuchungen über die potenzielle Systemleistungsfähigkeit motiviert. Unter Berücksichtigung von kommerziell erhältlichenMMICs werden verschiedene Schaltungstopologien auf der Grundlage des Signal-Rausch-Verhältnisses verglichen. Sowohl für sequenzielle als auch für parallele Ansteuerung der Antennenkeulen wird eine deutliche Leistungssteigerung ermittelt. Diese Verbesserungen hängen maßgeblich von der Verfügbarkeit geeigneter MMICs und einer zuverlässigen Aufbau- und Verbindungstechnik ab. Das vorliegende Frontend-Konzept kann auf Grund seiner Flexibilität leicht an derlei zukünftige Entwicklungen angepasst werden.

  17. MEMS packaging: state of the art and future trends

    NASA Astrophysics Data System (ADS)

    Bossche, Andre; Cotofana, Carmen V. B.; Mollinger, Jeff R.

    1998-07-01

    Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.

  18. A CMOS ASIC Design for SiPM Arrays

    PubMed Central

    Dey, Samrat; Banks, Lushon; Chen, Shaw-Pin; Xu, Wenbin; Lewellen, Thomas K.; Miyaoka, Robert S.; Rudell, Jacques C.

    2012-01-01

    Our lab has previously reported on novel board-level readout electronics for an 8×8 silicon photomultiplier (SiPM) array featuring row/column summation technique to reduce the hardware requirements for signal processing. We are taking the next step by implementing a monolithic CMOS chip which is based on the row-column architecture. In addition, this paper explores the option of using diagonal summation as well as calibration to compensate for temperature and process variations. Further description of a timing pickoff signal which aligns all of the positioning (spatial channels) pulses in the array is described. The ASIC design is targeted to be scalable with the detector size and flexible to accommodate detectors from different vendors. This paper focuses on circuit implementation issues associated with the design of the ASIC to interface our Phase II MiCES FPGA board with a SiPM array. Moreover, a discussion is provided for strategies to eventually integrate all the analog and mixed-signal electronics with the SiPM, on either a single-silicon substrate or multi-chip module (MCM). PMID:24825923

  19. An application protocol for CAD to CAD transfer of electronic information

    NASA Technical Reports Server (NTRS)

    Azu, Charles C., Jr.

    1993-01-01

    The exchange of Computer Aided Design (CAD) information between dissimilar CAD systems is a problem. This is especially true for transferring electronics CAD information such as multi-chip module (MCM), hybrid microcircuit assembly (HMA), and printed circuit board (PCB) designs. Currently, there exists several neutral data formats for transferring electronics CAD information. These include IGES, EDIF, and DXF formats. All these formats have limitations for use in exchanging electronic data. In an attempt to overcome these limitations, the Navy's MicroCIM program implemented a project to transfer hybrid microcircuit design information between dissimilar CAD systems. The IGES (Initial Graphics Exchange Specification) format is used since it is well established within the CAD industry. The goal of the project is to have a complete transfer of microelectronic CAD information, using IGES, without any data loss. An Application Protocol (AP) is being developed to specify how hybrid microcircuit CAD information will be represented by IGES entity constructs. The AP defines which IGES data items are appropriate for describing HMA geometry, connectivity, and processing as well as HMA material characteristics.

  20. Miniature X-Ray Bone Densitometer

    NASA Technical Reports Server (NTRS)

    Charles, Harry K., Jr.

    1999-01-01

    The purpose of the Dual Energy X-ray Absorptiometry (DEXA) project is to design, build, and test an advanced X-ray absorptiometry scanner capable of being used to monitor the deleterious effects of weightlessness on the human musculoskeletal system during prolonged spaceflight. The instrument is based on the principles of dual energy x-ray absorptiometry and is designed not only to measure bone, muscle, and fat masses but also to generate structural information about these tissues so that the effects on mechanical integrity may be assessed using biomechanical principles. A skeletal strength assessment could be particularly important for an astronaut embarking on a remote planet where the consequences of a fragility fracture may be catastrophic. The scanner will employ multiple projection images about the long axis of the scanned subject to provide geometric properties in three dimensions, suitable for a three-dimensional structural analysis of the scanned region. The instrument will employ advanced fabrication techniques to minimize volume and mass (100 kg current target with a long-term goal of 60 kg) of the scanner as appropriate for the space environment, while maintaining the required mechanical stability for high precision measurement. The unit will have the precision required to detect changes in bone mass and geometry as small as 1% and changes in muscle mass as small as 5%. As the system evolves, advanced electronic fabrication technologies such as chip-on-board and multichip modules will be combined with commercial (off-the-shelf) parts to produce a reliable, integrated system which not only minimizes size and weight, but, because of its simplicity, is also cost effective to build and maintain. Additionally, the system is being designed to minimize power consumption. Methods of heat dissipation and mechanical stowage (for the unit when not in use) are being optimized for the space environment.

  1. Partition resampling and extrapolation averaging: approximation methods for quantifying gene expression in large numbers of short oligonucleotide arrays.

    PubMed

    Goldstein, Darlene R

    2006-10-01

    Studies of gene expression using high-density short oligonucleotide arrays have become a standard in a variety of biological contexts. Of the expression measures that have been proposed to quantify expression in these arrays, multi-chip-based measures have been shown to perform well. As gene expression studies increase in size, however, utilizing multi-chip expression measures is more challenging in terms of computing memory requirements and time. A strategic alternative to exact multi-chip quantification on a full large chip set is to approximate expression values based on subsets of chips. This paper introduces an extrapolation method, Extrapolation Averaging (EA), and a resampling method, Partition Resampling (PR), to approximate expression in large studies. An examination of properties indicates that subset-based methods can perform well compared with exact expression quantification. The focus is on short oligonucleotide chips, but the same ideas apply equally well to any array type for which expression is quantified using an entire set of arrays, rather than for only a single array at a time. Software implementing Partition Resampling and Extrapolation Averaging is under development as an R package for the BioConductor project.

  2. Autonomous micro and nano sensors for upstream oil and gas

    NASA Astrophysics Data System (ADS)

    Chapman, David; Trybula, Walt

    2015-06-01

    This paper describes the development of autonomous electronic micro and nanoscale sensor systems for very harsh downhole oilfield conditions and provides an overview of the operational requirements necessary to survive and make direct measurements of subsurface conditions. One of several significant developmental challenges is selecting appropriate technologies that are simultaneously miniaturize-able, integrate-able, harsh environment capable, and economically viable. The Advanced Energy Consortium (AEC) is employing a platform approach to developing and testing multi-chip, millimeter and micron-scale systems in a package at elevated temperature and pressure in API brine and oil analogs, with the future goal of miniaturized systems that enable the collection of previously unattainable data. The ultimate goal is to develop subsurface nanosensor systems that can be injected into oil and gas well bores, to gather and record data, providing an unparalleled level of direct reservoir characterization. This paper provides a status update on the research efforts and developmental successes at the AEC.

  3. A Novel Silicon Micromachined Integrated MCM Thermal Management System

    NASA Technical Reports Server (NTRS)

    Kazmierczak, M. J.; Henderson, H. T.; Gerner, F. M.

    1997-01-01

    "Micromachining" is a chemical means of etching three-dimensional structures, typically in single- crystalline silicon. These techniques are leading toward what is coming to be referred to as MEMS (Micro Electro Mechanical Systems), where in addition to the ordinary two-dimensional (planar) microelectronics, it is possible to build three-dimensional n-ticromotors, electrically- actuated raicrovalves, hydraulic systems and much more on the same microchip. These techniques become possible because of differential etching rates of various crystallographic planes and materials used for semiconductor n-ticrofabfication. The University of Cincinnati group in collaboration with Karl Baker at NASA Lewis were the first to form micro heat pipes in silicon by the above techniques. Current work now in progress using MEMS technology is now directed towards the development of the next generation in MCM (Multi Chip Module) packaging. Here we propose to develop a complete electronic thermal management system which will allow densifica6on in chip stacking by perhaps two orders of magnitude. Furthermore the proposed technique will allow ordinary conu-nercial integrated chips to be utilized. Basically, the new technique involves etching square holes into a silicon substrate and then inserting and bonding commercially available integrated chips into these holes. For example, over a 100 1/4 in. by 1 /4 in. integrated chips can be placed on a 4 in. by 4 in. silicon substrate to form a Multi-Chip Module (MCM). Placing these MCM's in-line within an integrated rack then allows for three-diniensional stacking. Increased miniaturization of microelectronic circuits will lead to very high local heat fluxes. A high performance thermal management system will be specifically designed to remove the generated energy. More specifically, a compact heat exchanger with milli / microchannels will be developed and tested to remove the heat through the back side of this MCM assembly for moderate and high heat flux applications, respectively. The high heat load application of particular interest in mind is the motor controller developed by Martin Marietta for Nasa to control the thruster's directional actuators on space vechicles. Work is also proposed to develop highly advanced and improved porous wick structures for use in advanced heat loops. The porous wick will be micromachined from silicon using MEMS technology, thus permitting far superior control of pore size and pore distribution (over wicks made from sintered n-ietals), which in turn is expected to led to significantly improved heat loop performance.

  4. NASA Tech Briefs, February 2007

    NASA Technical Reports Server (NTRS)

    2007-01-01

    Topics covered include: Calibration Test Set for a Phase-Comparison Digital Tracker; Wireless Acoustic Measurement System; Spiral Orbit Tribometer; Arrays of Miniature Microphones for Aeroacoustic Testing; Predicting Rocket or Jet Noise in Real Time; Computational Workbench for Multibody Dynamics; High-Power, High-Efficiency Ka-Band Space Traveling-Wave Tube; Gratings and Random Reflectors for Near-Infrared PIN Diodes; Optically Transparent Split-Ring Antennas for 1 to 10 GHz; Ice-Penetrating Robot for Scientific Exploration; Power-Amplifier Module for 145 to 165 GHz; Aerial Videography From Locally Launched Rockets; SiC Multi-Chip Power Modules as Power-System Building Blocks; Automated Design of Restraint Layer of an Inflatable Vessel; TMS for Instantiating a Knowledge Base With Incomplete Data; Simulating Flights of Future Launch Vehicles and Spacecraft; Control Code for Bearingless Switched- Reluctance Motor; Machine Aided Indexing and the NASA Thesaurus; Arbitrating Control of Control and Display Units; Web-Based Software for Managing Research; Driver Code for Adaptive Optics; Ceramic Paste for Patching High-Temperature Insulation; Fabrication of Polyimide-Matrix/Carbon and Boron-Fiber Tape; Protective Skins for Aerogel Monoliths; Code Assesses Risks Posed by Meteoroids and Orbital Debris; Asymmetric Bulkheads for Cylindrical Pressure Vessels; Self-Regulating Water-Separator System for Fuel Cells; Self-Advancing Step-Tap Drills; Array of Bolometers for Submillimeter- Wavelength Operation; Delta-Doped CCDs as Detector Arrays in Mass Spectrometers; Arrays of Bundles of Carbon Nanotubes as Field Emitters; Staggering Inflation To Stabilize Attitude of a Solar Sail; and Bare Conductive Tether for Decelerating a Spacecraft.

  5. Boeing's STAR-FODB test results

    NASA Astrophysics Data System (ADS)

    Fritz, Martin E.; de la Chapelle, Michael; Van Ausdal, Arthur W.

    1995-05-01

    Boeing has successfully concluded a 2 1/2 year, two phase developmental contract for the STAR-Fiber Optic Data Bus (FODB) that is intended for future space-based applications. The first phase included system analysis, trade studies, behavior modeling, and architecture and protocal selection. During this phase we selected AS4074 Linear Token Passing Bus (LTPB) protocol operating at 200 Mbps, along with the passive, star-coupled fiber media. The second phase involved design, build, integration, and performance and environmental test of brassboard hardware. The resulting brassboard hardware successfully passed performance testing, providing 200 Mbps operation with a 32 X 32 star-coupled medium. This hardware is suitable for a spaceflight experiment to validate ground testing and analysis and to demonstrate performace in the intended environment. The fiber bus interface unit (FBIU) is a multichip module containing transceiver, protocol, and data formatting chips, buffer memory, and a station management controller. The FBIU has been designed for low power, high reliability, and radiation tolerance. Nine FBIUs were built and integrated with the fiber optic physical layer consisting of the fiber cable plant (FCP) and star coupler assembly (SCA). Performance and environmental testing, including radiation exposure, was performed on selected FBIUs and the physical layer. The integrated system was demonstrated with a full motion color video image transfer across the bus while simultaneously performing utility functions with a fiber bus control module (FBCM) over a telemetry and control (T&C) bus, in this case AS1773.

  6. MM&T for VHSIC Multichip Packages

    DTIC Science & Technology

    1989-09-20

    broader the network bandwidth must be in order to preserve the integrity of the rising and falling edges of the signal. However, for very fast ...inch of path length adds approximately 100-300 ps of delay to the signal. System designers of fast ECL type devices must incorporate these delays into... intermittently in low temperature areas. Permanent changes in operating characteristics and physical damage produced during temperature shock occur

  7. Development of the command data system and ground software for the SEDSAT-1 microsatellite

    NASA Technical Reports Server (NTRS)

    Wells, B. Earl

    1996-01-01

    SEDSAT-1 is designed to be a low cost scientific satellite which is to be used to perform a minimum of five tasks which include: (1) the acquisition of a number of important parameters associated with the tethering processes from the payloads perspective (such as accelerations incurred and imaging data of the tether during deployment), (2) to act as a remote sensing platform for making measurements of the Earth's Atmosphere (allowing research to be performed in such areas as vertical lightning observation, visible light spectrography, and cloud cover studies, (3) to act as a general purpose amateur radio communication satellite relaying information back to earth, (4) to demonstrate the feasibility of the deployment in low earth orbit of advanced technology such as the Gallium Arsenide Solar Cells, Nickel Metal Hydride batteries, and multi-chip module technology and, (5) to support student's active participation in applying the disciplines of engineering and science to space-based hardware platforms. The project includes the Three-axis Accelerometer System, TAS, Experiment which is designed to report the accelerations that the satellite undergoes during the tethering operations and during the second phase of the mission when the free floating satellite comes in contact with orbit debris. The SEASIS (SEDS Earth, Atmosphere, and Space Imaging System) is another SEDSAT experiment designed to provide images of the tether during its deployment and the earth during the second phase of the mission. To control these experiments and virtually all other satellite operations the Command Data System, CDS is employed. This system utilizes a moderate complexity micro-controller controlled by tasks operating under a real-time operating system to dynamically monitor and control the satellite. The scope of this researchers efforts has been in the general area of coordinating and assisting the student researchers with the development of the CDS and ground station interfaces. This included the low level CDS hardware design and the formulization of a general software plan and schedule for both the CDS and ground station portions of the project.

  8. Capacitive charge generation apparatus and method for testing circuits

    DOEpatents

    Cole, E.I. Jr.; Peterson, K.A.; Barton, D.L.

    1998-07-14

    An electron beam apparatus and method for testing a circuit are disclosed. The electron beam apparatus comprises an electron beam incident on an outer surface of an insulating layer overlying one or more electrical conductors of the circuit for generating a time varying or alternating current electrical potential on the surface; and a measurement unit connected to the circuit for measuring an electrical signal capacitively coupled to the electrical conductors to identify and map a conduction state of each of the electrical conductors, with or without an electrical bias signal being applied to the circuit. The electron beam apparatus can further include a secondary electron detector for forming a secondary electron image for registration with a map of the conduction state of the electrical conductors. The apparatus and method are useful for failure analysis or qualification testing to determine the presence of any open-circuits or short-circuits, and to verify the continuity or integrity of electrical conductors buried below an insulating layer thickness of 1-100 {micro}m or more without damaging or breaking down the insulating layer. The types of electrical circuits that can be tested include integrated circuits, multi-chip modules, printed circuit boards and flexible printed circuits. 7 figs.

  9. Capacitive charge generation apparatus and method for testing circuits

    DOEpatents

    Cole, Jr., Edward I.; Peterson, Kenneth A.; Barton, Daniel L.

    1998-01-01

    An electron beam apparatus and method for testing a circuit. The electron beam apparatus comprises an electron beam incident on an outer surface of an insulating layer overlying one or more electrical conductors of the circuit for generating a time varying or alternating current electrical potential on the surface; and a measurement unit connected to the circuit for measuring an electrical signal capacitively coupled to the electrical conductors to identify and map a conduction state of each of the electrical conductors, with or without an electrical bias signal being applied to the circuit. The electron beam apparatus can further include a secondary electron detector for forming a secondary electron image for registration with a map of the conduction state of the electrical conductors. The apparatus and method are useful for failure analysis or qualification testing to determine the presence of any open-circuits or short-circuits, and to verify the continuity or integrity of electrical conductors buried below an insulating layer thickness of 1-100 .mu.m or more without damaging or breaking down the insulating layer. The types of electrical circuits that can be tested include integrated circuits, multi-chip modules, printed circuit boards and flexible printed circuits.

  10. Micromechanical die attachment surcharge

    DOEpatents

    Filter, William F.; Hohimer, John P.

    2002-01-01

    An attachment structure is disclosed for attaching a die to a supporting substrate without the use of adhesives or solder. The attachment structure, which can be formed by micromachining, functions purely mechanically in utilizing a plurality of shaped pillars (e.g. round, square or polygonal and solid, hollow or slotted) that are formed on one of the die or supporting substrate and which can be urged into contact with various types of mating structures including other pillars, a deformable layer or a plurality of receptacles that are formed on the other of the die or supporting substrate, thereby forming a friction bond that holds the die to the supporting substrate. The attachment structure can further include an alignment structure for precise positioning of the die and supporting substrate to facilitate mounting the die to the supporting substrate. The attachment structure has applications for mounting semiconductor die containing a microelectromechanical (MEM) device, a microsensor or an integrated circuit (IC), and can be used to form a multichip module. The attachment structure is particularly useful for mounting die containing released MEM devices since these devices are fragile and can otherwise be damaged or degraded by adhesive or solder mounting.

  11. Optomechanical Design and Characterization of a Printed-Circuit-Board-Based Free-Space Optical Interconnect Package

    NASA Astrophysics Data System (ADS)

    Zheng, Xuezhe; Marchand, Philippe J.; Huang, Dawei; Kibar, Osman; Ozkan, Nur S. E.; Esener, Sadik C.

    1999-09-01

    We present a proof of concept and a feasibility demonstration of a practical packaging approach in which free-space optical interconnects (FSOI s) can be integrated simply on electronic multichip modules (MCM s) for intra-MCM board interconnects. Our system-level packaging architecture is based on a modified folded 4 f imaging system that has been implemented with only off-the-shelf optics, conventional electronic packaging, and passive-assembly techniques to yield a potentially low-cost and manufacturable packaging solution. The prototypical system as built supports 48 independent FSOI channels with 8 separate laser and detector chips, for which each chip consists of a one-dimensional array of 12 devices. All the chips are assembled on a single substrate that consists of a printed circuit board or a ceramic MCM. Optical link channel efficiencies of greater than 90% and interchannel cross talk of less than 20 dB at low frequency have been measured. The system is compact at only 10 in. 3 (25.4 cm 3 ) and is scalable, as it can easily accommodate additional chips as well as two-dimensional optoelectronic device arrays for increased interconnection density.

  12. Panoramic Images Mapping Tools Integrated Within the ESRI ArcGIS Software

    NASA Astrophysics Data System (ADS)

    Guo, Jiao; Zhong, Ruofei; Zeng, Fanyang

    2014-03-01

    There is a general study on panoramic images which are presented along with appearance of the Google street map. Despite 360 degree viewing of street, we can realize more applications over panoramic images. This paper developed a toolkits plugged in ArcGIS, which can view panoramic photographs at street level directly from ArcMap and measure and capture all visible elements as frontages, trees and bridges. We use a series of panoramic images adjoined with absolute coordinate through GPS and IMU. There are two methods in this paper to measure object from these panoramic images: one is to intersect object position through a stereogram; the other one is multichip matching involved more than three images which all cover the object. While someone wants to measure objects from these panoramic images, each two panoramic images which both contain the object can be chosen to display on ArcMap. Then we calculate correlation coefficient of the two chosen panoramic images so as to calculate the coordinate of object. Our study test different patterns of panoramic pairs and compare the results of measurement to the real value of objects so as to offer the best choosing suggestion. The article has mainly elaborated the principles of calculating correlation coefficient and multichip matching.

  13. Read-In Integrated Circuits for Large-Format Multi-Chip Emitter Arrays

    DTIC Science & Technology

    2015-03-31

    chip has been designed and fabricated using ONSEMI C5N process to verify our approach. Keywords: Large scale arrays; Tiling; Mosaic; Abutment ...required. X and y addressing is not a sustainable and easily expanded addressing architecture nor will it work well with abutted RIICs. Abutment Method... Abutting RIICs into an array is challenging because of the precise positioning required to achieve a uniform image. This problem is a new design

  14. CMOS-compatible InP/InGaAs digital photoreceiver

    DOEpatents

    Lovejoy, Michael L.; Rose, Benny H.; Craft, David C.; Enquist, Paul M.; Slater, Jr., David B.

    1997-01-01

    A digital photoreceiver is formed monolithically on an InP semiconductor substrate and comprises a p-i-n photodetector formed from a plurality of InP/InGaAs layers deposited by an epitaxial growth process and an adjacent heterojunction bipolar transistor (HBT) amplifier formed from the same InP/InGaAs layers. The photoreceiver amplifier operates in a large-signal mode to convert a detected photocurrent signal into an amplified output capable of directly driving integrated circuits such as CMOS. In combination with an optical transmitter, the photoreceiver may be used to establish a short-range channel of digital optical communications between integrated circuits with applications to multi-chip modules (MCMs). The photoreceiver may also be used with fiber optic coupling for establishing longer-range digital communications (i.e. optical interconnects) between distributed computers or the like. Arrays of digital photoreceivers may be formed on a common substrate for establishing a plurality of channels of digital optical communication, with each photoreceiver being spaced by less than about 1 mm and consuming less than about 20 mW of power, and preferably less than about 10 mW. Such photoreceiver arrays are useful for transferring huge amounts of digital data between integrated circuits at bit rates of up to about 1000 Mb/s or more.

  15. SpaceWire Driver Software for Special DSPs

    NASA Technical Reports Server (NTRS)

    Clark, Douglas; Lux, James; Nishimoto, Kouji; Lang, Minh

    2003-01-01

    A computer program provides a high-level C-language interface to electronics circuitry that controls a SpaceWire interface in a system based on a space qualified version of the ADSP-21020 digital signal processor (DSP). SpaceWire is a spacecraft-oriented standard for packet-switching data-communication networks that comprise nodes connected through bidirectional digital serial links that utilize low-voltage differential signaling (LVDS). The software is tailored to the SMCS-332 application-specific integrated circuit (ASIC) (also available as the TSS901E), which provides three highspeed (150 Mbps) serial point-to-point links compliant with the proposed Institute of Electrical and Electronics Engineers (IEEE) Standard 1355.2 and equivalent European Space Agency (ESA) Standard ECSS-E-50-12. In the specific application of this software, the SpaceWire ASIC was combined with the DSP processor, memory, and control logic in a Multi-Chip Module DSP (MCM-DSP). The software is a collection of low-level driver routines that provide a simple message-passing application programming interface (API) for software running on the DSP. Routines are provided for interrupt-driven access to the two styles of interface provided by the SMCS: (1) the "word at a time" conventional host interface (HOCI); and (2) a higher performance "dual port memory" style interface (COMI).

  16. CMOS-compatible InP/InGaAs digital photoreceiver

    DOEpatents

    Lovejoy, M.L.; Rose, B.H.; Craft, D.C.; Enquist, P.M.; Slater, D.B. Jr.

    1997-11-04

    A digital photoreceiver is formed monolithically on an InP semiconductor substrate and comprises a p-i-n photodetector formed from a plurality of InP/InGaAs layers deposited by an epitaxial growth process and an adjacent heterojunction bipolar transistor (HBT) amplifier formed from the same InP/InGaAs layers. The photoreceiver amplifier operates in a large-signal mode to convert a detected photocurrent signal into an amplified output capable of directly driving integrated circuits such as CMOS. In combination with an optical transmitter, the photoreceiver may be used to establish a short-range channel of digital optical communications between integrated circuits with applications to multi-chip modules (MCMs). The photoreceiver may also be used with fiber optic coupling for establishing longer-range digital communications (i.e. optical interconnects) between distributed computers or the like. Arrays of digital photoreceivers may be formed on a common substrate for establishing a plurality of channels of digital optical communication, with each photoreceiver being spaced by less than about 1 mm and consuming less than about 20 mW of power, and preferably less than about 10 mW. Such photoreceiver arrays are useful for transferring huge amounts of digital data between integrated circuits at bit rates of up to about 1,000 Mb/s or more. 4 figs.

  17. A High-Density, High-Efficiency, Isolated On-Board Vehicle Battery Charger Utilizing Silicon Carbide Power Devices

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Whitaker, B; Barkley, A; Cole, Z

    2014-05-01

    This paper presents an isolated on-board vehicular battery charger that utilizes silicon carbide (SiC) power devices to achieve high density and high efficiency for application in electric vehicles (EVs) and plug-in hybrid EVs (PHEVs). The proposed level 2 charger has a two-stage architecture where the first stage is a bridgeless boost ac-dc converter and the second stage is a phase-shifted full-bridge isolated dc-dc converter. The operation of both topologies is presented and the specific advantages gained through the use of SiC power devices are discussed. The design of power stage components, the packaging of the multichip power module, and themore » system-level packaging is presented with a primary focus on system density and a secondary focus on system efficiency. In this work, a hardware prototype is developed and a peak system efficiency of 95% is measured while operating both power stages with a switching frequency of 200 kHz. A maximum output power of 6.1 kW results in a volumetric power density of 5.0 kW/L and a gravimetric power density of 3.8 kW/kg when considering the volume and mass of the system including a case.« less

  18. Prototype Parts of a Digital Beam-Forming Wide-Band Receiver

    NASA Technical Reports Server (NTRS)

    Kaplan, Steven B.; Pylov, Sergey V.; Pambianchi, Michael

    2003-01-01

    Some prototype parts of a digital beamforming (DBF) receiver that would operate at multigigahertz carrier frequencies have been developed. The beam-forming algorithm in a DBF receiver processes signals from multiple antenna elements with appropriate time delays and weighting factors chosen to enhance the reception of signals from a specific direction while suppressing signals from other directions. Such a receiver would be used in the directional reception of weak wideband signals -- for example, spread-spectrum signals from a low-power transmitter on an Earth-orbiting spacecraft or other distant source. The prototype parts include superconducting components on integrated-circuit chips, and a multichip module (MCM), within which the chips are to be packaged and connected via special inter-chip-communication circuits. The design and the underlying principle of operation are based on the use of the rapid single-flux quantum (RSFQ) family of logic circuits to obtain the required processing speed and signal-to-noise ratio. RSFQ circuits are superconducting circuits that exploit the Josephson effect. They are well suited for this application, having been proven to perform well in some circuits at frequencies above 100 GHz. In order to maintain the superconductivity needed for proper functioning of the RSFQ circuits, the MCM must be kept in a cryogenic environment during operation.

  19. Development of the SEASIS instrument for SEDSAT

    NASA Technical Reports Server (NTRS)

    Maier, Mark W.

    1996-01-01

    Two SEASIS experiment objectives are key: take images that allow three axis attitude determination and take multi-spectral images of the earth. During the tether mission it is also desirable to capture images for the recoiling tether from the endmass perspective (which has never been observed). SEASIS must store all its imagery taken during the tether mission until the earth downlink can be established. SEASIS determines attitude with a panoramic camera and performs earth observation with a telephoto lens camera. Camera video is digitized, compressed, and stored in solid state memory. These objectives are addressed through the following architectural choices: (1) A camera system using a Panoramic Annular Lens (PAL). This lens has a 360 deg. azimuthal field of view by a +45 degree vertical field measured from a plan normal to the lens boresight axis. It has been shown in Mr. Mark Steadham's UAH M.S. thesis that his camera can determine three axis attitude anytime the earth and one other recognizable celestial object (for example, the sun) is in the field of view. This will be essentially all the time during tether deployment. (2) A second camera system using telephoto lens and filter wheel. The camera is a black and white standard video camera. The filters are chosen to cover the visible spectral bands of remote sensing interest. (3) A processor and mass memory arrangement linked to the cameras. Video signals from the cameras are digitized, compressed in the processor, and stored in a large static RAM bank. The processor is a multi-chip module consisting of a T800 Transputer and three Zoran floating point Digital Signal Processors. This processor module was supplied under ARPA contract by the Space Computer Corporation to demonstrate its use in space.

  20. Single-Chip T/R Module for 1.2 GHz

    NASA Technical Reports Server (NTRS)

    Moussessian, Alina; Mojarradi, Mohammad; Johnson, Travis; Davis, John; Grigorian, Edwin; Hoffman, James; Caro, Edward; Kuhn, William

    2006-01-01

    A single-chip CMOS-based (complementary-metal-oxide-semiconductorbased) transmit/receive (T/R) module is being developed for L-band radar systems. Previous T/R module implementations required multiple chips employing different technologies (GaAs, Si, and others) combined with off-chip transmission lines and discrete components including circulators. The new design eliminates the bulky circulator, significantly reducing the size and mass of the T/R module. Compared to multi-chip designs, the single-chip CMOS can be implemented with lower cost. These innovations enable cost-effective realization of advanced phased array and synthetic aperture radar systems that require integration of thousands of T/R modules. The circulator is a ferromagnetic device that directs the flow of the RF (radio frequency) power during transmission and reception. During transmission, the circulator delivers the transmitted power from the amplifier to the antenna, while preventing it from damaging the sensitive receiver circuitry. During reception, the circulator directs the energy from the antenna to the low-noise amplifier (LNA) while isolating the output of the power amplifier (PA). In principle, a circulator could be replaced by series transistors acting as electronic switches. However, in practice, the integration of conventional series transistors into a T/R chip introduces significant losses and noise. The prototype single-chip T/R module contains integrated transistor switches, but not connected in series; instead, they are connected in a shunt configuration with resonant circuits (see figure). The shunt/resonant circuit topology not only reduces the losses associated with conventional semiconductor switches but also provides beneficial transformation of impedances for the PA and the LNA. It provides full singlepole/ double-throw switching for the antenna, isolating the LNA from the transmitted signal and isolating the PA from the received signal. During reception, the voltage on control line RX/TX (raised bar) is high, causing the field-effect transistor (FET) switch S1 to be closed, forming a parallel resonant tank circuit L1||C1. This circuit presents high impedance to the left of the antenna, so that the received signal is coupled to the LNA. At the same time, FET switches S2 and S3 are open, so that C2 is removed from the circuit (except for a small parasitic capacitance). The combination of L2 and C3 forms a matching network that transforms the antenna impedance of 50 ohms to a higher value from the perspective of the LNA input terminal. This transformation of impedance improves LNA noise figure by increasing the received voltage delivered to the input transistor. This allows lower transconductance and therefore a smaller transistor, which makes it possible to design the CMOS LNA for low power consumption. During transmission, the voltage on control line RX/TX (raised bar) is low, causing switch S1 to be open. In this configuration, the combination of L1 and C1 transforms the antenna impedance to a lower value from the perspective of the PA. This low impedance is helpful in producing a relatively high output power compatible with the low CMOS operating potential. At the same time, switches S2 and S3 are closed, forming the parallel resonant tank circuit L2||C2. This circuit presents high impedance to the right of the antenna, directing the PA output signal to the antenna and away from the LNA. During this time, S3 presents a short circuit across the LNA input terminals to guarantee that the voltage seen by the LNA is small enough to prevent damage.

  1. Miniaturized ultrasound imaging probes enabled by CMUT arrays with integrated frontend electronic circuits.

    PubMed

    Khuri-Yakub, B T; Oralkan, Omer; Nikoozadeh, Amin; Wygant, Ira O; Zhuang, Steve; Gencel, Mustafa; Choe, Jung Woo; Stephens, Douglas N; de la Rama, Alan; Chen, Peter; Lin, Feng; Dentinger, Aaron; Wildes, Douglas; Thomenius, Kai; Shivkumar, Kalyanam; Mahajan, Aman; Seo, Chi Hyung; O'Donnell, Matthew; Truong, Uyen; Sahn, David J

    2010-01-01

    Capacitive micromachined ultrasonic transducer (CMUT) arrays are conveniently integrated with frontend integrated circuits either monolithically or in a hybrid multichip form. This integration helps with reducing the number of active data processing channels for 2D arrays. This approach also preserves the signal integrity for arrays with small elements. Therefore CMUT arrays integrated with electronic circuits are most suitable to implement miniaturized probes required for many intravascular, intracardiac, and endoscopic applications. This paper presents examples of miniaturized CMUT probes utilizing 1D, 2D, and ring arrays with integrated electronics.

  2. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Zhu, Xiaojun; Lei, Guangtsai; Pan, Guangwen

    In this paper, the continuous operator is discretized into matrix forms by Galerkin`s procedure, using periodic Battle-Lemarie wavelets as basis/testing functions. The polynomial decomposition of wavelets is applied to the evaluation of matrix elements, which makes the computational effort of the matrix elements no more expensive than that of method of moments (MoM) with conventional piecewise basis/testing functions. A new algorithm is developed employing the fast wavelet transform (FWT). Owing to localization, cancellation, and orthogonal properties of wavelets, very sparse matrices have been obtained, which are then solved by the LSQR iterative method. This algorithm is also adaptive in thatmore » one can add at will finer wavelet bases in the regions where fields vary rapidly, without any damage to the system orthogonality of the wavelet basis functions. To demonstrate the effectiveness of the new algorithm, we applied it to the evaluation of frequency-dependent resistance and inductance matrices of multiple lossy transmission lines. Numerical results agree with previously published data and laboratory measurements. The valid frequency range of the boundary integral equation results has been extended two to three decades in comparison with the traditional MoM approach. The new algorithm has been integrated into the computer aided design tool, MagiCAD, which is used for the design and simulation of high-speed digital systems and multichip modules Pan et al. 29 refs., 7 figs., 6 tabs.« less

  3. A Digital Lock-In Amplifier for Use at Temperatures of up to 200 °C

    PubMed Central

    Cheng, Jingjing; Xu, Yingjun; Wu, Lei; Wang, Guangwei

    2016-01-01

    Weak voltage signals cannot be reliably measured using currently available logging tools when these tools are subject to high-temperature (up to 200 °C) environments for prolonged periods. In this paper, we present a digital lock-in amplifier (DLIA) capable of operating at temperatures of up to 200 °C. The DLIA contains a low-noise instrument amplifier and signal acquisition and the corresponding signal processing electronics. The high-temperature stability of the DLIA is achieved by designing system-in-package (SiP) and multi-chip module (MCM) components with low thermal resistances. An effective look-up-table (LUT) method was developed for the lock-in amplifier algorithm, to decrease the complexity of the calculations and generate less heat than the traditional way. The performance of the design was tested by determining the linearity, gain, Q value, and frequency characteristic of the DLIA between 25 and 200 °C. The maximal nonlinear error in the linearity of the DLIA working at 200 °C was about 1.736% when the equivalent input was a sine wave signal with an amplitude of between 94.8 and 1896.0 nV and a frequency of 800 kHz. The tests showed that the DLIA proposed could work effectively in high-temperature environments up to 200 °C. PMID:27845710

  4. Chip-on-Board Technology 1996 Year-end Report (Design, Manufacturing, and Reliability Study)

    NASA Technical Reports Server (NTRS)

    Le, Binh Q.; Nhan, Elbert; Maurer, Richard H.; Lew, Ark L.; Lander, Juan R.

    1996-01-01

    The major impetus for flight qualifying Chip-On-Board (COB) packaging technology is the shift in emphasis for space missions to smaller, better, and cheaper spacecraft and satellites resulting from the NASA New Millenium initiative and similar requirements in DoD-sponsored programs. The most important benefit that can potentially be derived from miniaturizing spacecraft and satellites is the significant cost saving realizable if a smaller launch vehicle may be employed. Besides the program cost saving, there are several other advantages to building COB-based space hardware. First, once a well-controlled process is established, COB can be low cost compared to standard Multi-Chip Module (MCM) technology. This cost competitiveness is regarded as a result of the generally greater availability and lower cost of Known Good Die (KGD). Coupled with the elimination of the first level of packaging (chip package), compact, high-density circuit boards can be realized with Printed Wiring Boards (PWB) that can now be made with ever-decreasing feature size in line width and via hole. Since the COB packaging technique in this study is based mainly on populating bare dice on a suitable multi-layer laminate substrate which is not hermetically sealed, die coating for protection from the environment is required. In recent years, significant improvements have been made in die coating materials which further enhance the appeal of COB. Hysol epoxies, silicone, parylene and silicon nitride are desirable because of their compatible Thermal Coefficient of Expansion (TCE) and good moisture resistant capability. These die coating materials have all been used in the space and other industries with varying degrees of success. COB technology, specifically siliconnitride coated hardware, has been flown by Lockheed on the Polar satellite. In addition, DARPA has invested a substantial amount of resources on MCM and COB-related activities recently. With COB on the verge of becoming a dominant player in DoD programs, DARPA is increasing its support of the availability of KGDs which will help decrease their cost. Aside from the various major developments and trends in the space and defense industries that are favorable to the acceptance and widespread use of'COB packaging technology, implementing COB can be appealing in other aspects. Since the interconnection interface is usually the weak link in a system, the overall circuit or system reliability may actually be improved because of the elimination of a level of interconnect/packaging at the chip. With COB, mixing packaging technologies is possible. Because some devices are only available in commercial plastic packages, populating a multi-layer laminate substrate with both bare dice and plastic-package parts is inevitable. Another attractive feature of COB is that re-workability is possible if die coating is applied only on the die top. This method allows local replacement of individual dice that were found to be defective instead of replacing an entire board. In terms of thermal management, unpackaged devices offer a shorter thermal resistance path than their packaged counterparts thereby improving thermal sinking and heat removal from the parts.

  5. Reconfigurable tree architectures using subtree oriented fault tolerance

    NASA Technical Reports Server (NTRS)

    Lowrie, Matthew B.

    1987-01-01

    An approach to the design of reconfigurable tree architecture is presented in which spare processors are allocated at the leaves. The approach is unique in that spares are associated with subtrees and sharing of spares between these subtrees can occur. The Subtree Oriented Fault Tolerance (SOFT) approach is more reliable than previous approaches capable of tolerating link and switch failures for both single chip and multichip tree implementations while reducing redundancy in terms of both spare processors and links. VLSI layout is 0(n) for binary trees and is directly extensible to N-ary trees and fault tolerance through performance degradation.

  6. Miniaturized Ultrasound Imaging Probes Enabled by CMUT Arrays with Integrated Frontend Electronic Circuits

    PubMed Central

    Khuri-Yakub, B. (Pierre) T.; Oralkan, Ömer; Nikoozadeh, Amin; Wygant, Ira O.; Zhuang, Steve; Gencel, Mustafa; Choe, Jung Woo; Stephens, Douglas N.; de la Rama, Alan; Chen, Peter; Lin, Feng; Dentinger, Aaron; Wildes, Douglas; Thomenius, Kai; Shivkumar, Kalyanam; Mahajan, Aman; Seo, Chi Hyung; O’Donnell, Matthew; Truong, Uyen; Sahn, David J.

    2010-01-01

    Capacitive micromachined ultrasonic transducer (CMUT) arrays are conveniently integrated with frontend integrated circuits either monolithically or in a hybrid multichip form. This integration helps with reducing the number of active data processing channels for 2D arrays. This approach also preserves the signal integrity for arrays with small elements. Therefore CMUT arrays integrated with electronic circuits are most suitable to implement miniaturized probes required for many intravascular, intracardiac, and endoscopic applications. This paper presents examples of miniaturized CMUT probes utilizing 1D, 2D, and ring arrays with integrated electronics. PMID:21097106

  7. ODIN system technology module library, 1972 - 1973

    NASA Technical Reports Server (NTRS)

    Hague, D. S.; Watson, D. A.; Glatt, C. R.; Jones, R. T.; Galipeau, J.; Phoa, Y. T.; White, R. J.

    1978-01-01

    ODIN/RLV is a digital computing system for the synthesis and optimization of reusable launch vehicle preliminary designs. The system consists of a library of technology modules in the form of independent computer programs and an executive program, ODINEX, which operates on the technology modules. The technology module library contains programs for estimating all major military flight vehicle system characteristics, for example, geometry, aerodynamics, economics, propulsion, inertia and volumetric properties, trajectories and missions, steady state aeroelasticity and flutter, and stability and control. A general system optimization module, a computer graphics module, and a program precompiler are available as user aids in the ODIN/RLV program technology module library.

  8. Neuromorphic VLSI vision system for real-time texture segregation.

    PubMed

    Shimonomura, Kazuhiro; Yagi, Tetsuya

    2008-10-01

    The visual system of the brain can perceive an external scene in real-time with extremely low power dissipation, although the response speed of an individual neuron is considerably lower than that of semiconductor devices. The neurons in the visual pathway generate their receptive fields using a parallel and hierarchical architecture. This architecture of the visual cortex is interesting and important for designing a novel perception system from an engineering perspective. The aim of this study is to develop a vision system hardware, which is designed inspired by a hierarchical visual processing in V1, for real time texture segregation. The system consists of a silicon retina, orientation chip, and field programmable gate array (FPGA) circuit. The silicon retina emulates the neural circuits of the vertebrate retina and exhibits a Laplacian-Gaussian-like receptive field. The orientation chip selectively aggregates multiple pixels of the silicon retina in order to produce Gabor-like receptive fields that are tuned to various orientations by mimicking the feed-forward model proposed by Hubel and Wiesel. The FPGA circuit receives the output of the orientation chip and computes the responses of the complex cells. Using this system, the neural images of simple cells were computed in real-time for various orientations and spatial frequencies. Using the orientation-selective outputs obtained from the multi-chip system, a real-time texture segregation was conducted based on a computational model inspired by psychophysics and neurophysiology. The texture image was filtered by the two orthogonally oriented receptive fields of the multi-chip system and the filtered images were combined to segregate the area of different texture orientation with the aid of FPGA. The present system is also useful for the investigation of the functions of the higher-order cells that can be obtained by combining the simple and complex cells.

  9. Nanosensors for Evaluating Hazardous Environments

    NASA Technical Reports Server (NTRS)

    2008-01-01

    Personnel working in a confined environment can be exposed to hazardous gases, and certain gases can be extremely dangerous even in concentrations as low as a few parts per billion. Nanosensors can be placed in multiple locations over a large area, thus allowing for more precise and timely detection of gas leaks. ASRC Aerospace and its research partners are developing nanosensors to detect various gases, including hydrogen, ammonia, nitrogen tetroxide, and hydrazine. Initial laboratory testing demonstrated the capability to detect these gases in concentrations lower than parts per million, and current testing is evaluating sensitivity at concentration levels three orders of magnitude lower. Testing and development continue to improve the response and recovery times and to increase the sensitivity of the devices. The development team is evaluating different coatings and electrodes to determine the optimum configuration for detecting and identifying a variety of gases. The small footprint of the nanosensors allows several devices to be placed into a single substrate. Each sensor is responsive in a different way to different gases. Embedding multiple devices into a single substrate results in better reliability and less frequent calibrations. The use of different coatings for individual elements of a multichannel sensor allows different gases to be identified. The sensor system is implemented by the use of a custom multichannel signal conditioner amplifier built on a small multichip module. This device processes the output of the sensors and transmits a signal that can be monitored and analyzed remotely.

  10. Applied Physics Modules Selected for Automotive and Diesel Technologies.

    ERIC Educational Resources Information Center

    Waring, Gene

    Designed for individualized use in an applied physics course in postsecondary vocational-technical education, this series of ten learning modules is equivalent to the content of a five-credit hour class in automotive technology or diesel technology. Almost all the modules contain technological application in the form of laboratory experiments or…

  11. Communication Module. Technology in the Classroom, Applications and Strategies for the Education of Children with Severe Disabilities.

    ERIC Educational Resources Information Center

    Blackstone, Sarah W.

    This training module is part of a series that provides a basic introduction to using assistive technology with young children (ages 2 to 7) who have severe disabilities in more than one area of development. This module focuses on technology that gives children another way to communicate when speaking is difficult or impossible. The module presents…

  12. Emergent Auditory Feature Tuning in a Real-Time Neuromorphic VLSI System.

    PubMed

    Sheik, Sadique; Coath, Martin; Indiveri, Giacomo; Denham, Susan L; Wennekers, Thomas; Chicca, Elisabetta

    2012-01-01

    Many sounds of ecological importance, such as communication calls, are characterized by time-varying spectra. However, most neuromorphic auditory models to date have focused on distinguishing mainly static patterns, under the assumption that dynamic patterns can be learned as sequences of static ones. In contrast, the emergence of dynamic feature sensitivity through exposure to formative stimuli has been recently modeled in a network of spiking neurons based on the thalamo-cortical architecture. The proposed network models the effect of lateral and recurrent connections between cortical layers, distance-dependent axonal transmission delays, and learning in the form of Spike Timing Dependent Plasticity (STDP), which effects stimulus-driven changes in the pattern of network connectivity. In this paper we demonstrate how these principles can be efficiently implemented in neuromorphic hardware. In doing so we address two principle problems in the design of neuromorphic systems: real-time event-based asynchronous communication in multi-chip systems, and the realization in hybrid analog/digital VLSI technology of neural computational principles that we propose underlie plasticity in neural processing of dynamic stimuli. The result is a hardware neural network that learns in real-time and shows preferential responses, after exposure, to stimuli exhibiting particular spectro-temporal patterns. The availability of hardware on which the model can be implemented, makes this a significant step toward the development of adaptive, neurobiologically plausible, spike-based, artificial sensory systems.

  13. Emergent Auditory Feature Tuning in a Real-Time Neuromorphic VLSI System

    PubMed Central

    Sheik, Sadique; Coath, Martin; Indiveri, Giacomo; Denham, Susan L.; Wennekers, Thomas; Chicca, Elisabetta

    2011-01-01

    Many sounds of ecological importance, such as communication calls, are characterized by time-varying spectra. However, most neuromorphic auditory models to date have focused on distinguishing mainly static patterns, under the assumption that dynamic patterns can be learned as sequences of static ones. In contrast, the emergence of dynamic feature sensitivity through exposure to formative stimuli has been recently modeled in a network of spiking neurons based on the thalamo-cortical architecture. The proposed network models the effect of lateral and recurrent connections between cortical layers, distance-dependent axonal transmission delays, and learning in the form of Spike Timing Dependent Plasticity (STDP), which effects stimulus-driven changes in the pattern of network connectivity. In this paper we demonstrate how these principles can be efficiently implemented in neuromorphic hardware. In doing so we address two principle problems in the design of neuromorphic systems: real-time event-based asynchronous communication in multi-chip systems, and the realization in hybrid analog/digital VLSI technology of neural computational principles that we propose underlie plasticity in neural processing of dynamic stimuli. The result is a hardware neural network that learns in real-time and shows preferential responses, after exposure, to stimuli exhibiting particular spectro-temporal patterns. The availability of hardware on which the model can be implemented, makes this a significant step toward the development of adaptive, neurobiologically plausible, spike-based, artificial sensory systems. PMID:22347163

  14. Macro-meso-microsystems integration in LTCC : LDRD report.

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    De Smet, Dennis J.; Nordquist, Christopher Daniel; Turner, Timothy Shawn

    2007-03-01

    Low Temperature Cofired Ceramic (LTCC) has proven to be an enabling medium for microsystem technologies, because of its desirable electrical, physical, and chemical properties coupled with its capability for rapid prototyping and scalable manufacturing of components. LTCC is viewed as an extension of hybrid microcircuits, and in that function it enables development, testing, and deployment of silicon microsystems. However, its versatility has allowed it to succeed as a microsystem medium in its own right, with applications in non-microelectronic meso-scale devices and in a range of sensor devices. Applications include silicon microfluidic ''chip-and-wire'' systems and fluid grid array (FGA)/microfluidic multichip modulesmore » using embedded channels in LTCC, and cofired electro-mechanical systems with moving parts. Both the microfluidic and mechanical system applications are enabled by sacrificial volume materials (SVM), which serve to create and maintain cavities and separation gaps during the lamination and cofiring process. SVMs consisting of thermally fugitive or partially inert materials are easily incorporated. Recognizing the premium on devices that are cofired rather than assembled, we report on functional-as-released and functional-as-fired moving parts. Additional applications for cofired transparent windows, some as small as an optical fiber, are also described. The applications described help pave the way for widespread application of LTCC to biomedical, control, analysis, characterization, and radio frequency (RF) functions for macro-meso-microsystems.« less

  15. Technology for the Organic Chemist: Three Exploratory Modules

    ERIC Educational Resources Information Center

    Esteb, John J.; McNulty, LuAnne M.; Magers, John; Morgan, Paul; Wilson, Anne M.

    2010-01-01

    The ability to use computer-based technology is an essential skill set for students majoring in chemistry. This exercise details the introduction of appropriate uses for this technology in the organic chemistry series. The incorporation of chemically appropriate online resources (module 1), scientific databases (module 2), and the use of a…

  16. Pittsburgh Science Technology Society Project: Instruction Modules. Interrelationships Science--Technology--Society.

    ERIC Educational Resources Information Center

    O'Brien, George, Ed.

    This collection of instruction modules studies the interactions of science, technology, and society (STS) using five activity sets. The introduction module includes activities which show students the STS relationships in their world, develop good organizational skills, develop an understanding of who and what a scientist is, develop graphing…

  17. Outdoor module testing and comparison of photovoltaic technologies

    NASA Astrophysics Data System (ADS)

    Fabick, L. B.; Rifai, R.; Mitchell, K.; Woolston, T.; Canale, J.

    A comparison of outdoor test results for several module technologies is presented. The technologies include thin-film silicon:hydrogen alloys (TFS), TFS modules with semitransparent conductor back contacts, and CuInSe2 module prototypes. A method for calculating open-circuit voltage and fill-factor temperature coefficients is proposed. The method relies on the acquisition of large statistical data samples to average effects due to varying insolation level.

  18. The Impact on Space Radiation Requirements and Effects on ASIMS

    NASA Technical Reports Server (NTRS)

    Barnes, C.; Johnston, A.; Swift, G.

    1995-01-01

    The evolution of highly miniaturized electronic and mechanical systems will be accompanied by new problems and issues regarding the radiation response of these systems in the space environment. In this paper we discuss some of the more prominent radiation problems brought about by miniaturization. For example, autonomous micro-spacecraft will require large amounts of high density memory, most likely in the form of stacked, multichip modules of DRAM's, that must tolerate the radiation environment. However, advanced DRAM's (16 to 256 Mbit) are quite susceptible to radiation, particularly single event effects, and even exhibit new radiation phenomena that were not a problem for older, less dense memory chips. Another important trend in micro-spacecraft electronics is toward the use of low-voltage microelectronic systems that consume less power. However, the reduction in operating voltage also caries with it an increased susceptibility to radiation. In the case of application specific integrated microcircuits (ASIM's), advanced devices of this type, such as high density field programmable gate arrays (FPGA's) exhibit new single event effects (SEE), such as single particle reprogramming of anti-fuse links. New advanced bipolar circuits have been shown recently to degrade more rapidly in the low dose rate space environment than in the typical laboratory total dose radiation test used to qualify such devices. Thus total dose testing of these parts is no longer an appropriately conservative measure to be used for hardness assurance. We also note that the functionality of micromechanical Si-based devices may be altered due to the radiation-induced deposition of charge in the oxide passivation layers.

  19. RF to millimeter wave integration and module technologies

    NASA Astrophysics Data System (ADS)

    Vähä-Heikkilä, T.

    2015-04-01

    Radio Frequency (RF) consumer applications have boosted silicon integrated circuits (IC) and corresponding technologies. More and more functions are integrated to ICs and their performance is also increasing. However, RF front-end modules with filters and switches as well as antennas still need other way of integration. This paper focuses to RF front-end module and antenna developments as well as to the integration of millimeter wave radios. VTT Technical Research Centre of Finland has developed both Low Temperature Co-fired Ceramics (LTCC) and Integrated Passive Devices (IPD) integration platforms for RF and millimeter wave integrated modules. In addition to in-house technologies, VTT is using module and component technologies from other commercial sources.

  20. Aviation Maintenance Technology. General. G101 Aviation Mathematics and Physics. Instructor Material.

    ERIC Educational Resources Information Center

    Oklahoma State Board of Vocational and Technical Education, Stillwater. Curriculum and Instructional Materials Center.

    These instructor materials for an aviation maintenance technology course contain three instructional modules covering safety, aviation mathematics, and aviation physics. Each module may contain an introduction and module objective, specific objectives, an instructor's module implementation guide, technical information supplements, transparency…

  1. Technology Education. Introduction to Technology. Grades 7 & 8.

    ERIC Educational Resources Information Center

    New York State Education Dept., Albany. Div. of Occupational Education Programs.

    This syllabus contains 10 modules that satisfy the one-unit requirement for technology education to be completed by the end of Grade 8 in New York. An introduction provides information on its use. Suggested content outlines of the modules follow. Module components include suggested teaching time; overview; enabling vocabulary; major concepts;…

  2. Electronics Troubleshooting. High-Technology Training Module.

    ERIC Educational Resources Information Center

    Lodahl, Dan

    This learning module for a postsecondary electronics course in solid state circuits is designed to help teachers lead students through electronics troubleshooting. The module is intended to be used for a second-semester technical college course for electromechanical technology majors. The module introduces students to semiconductor devices and…

  3. New Technologies for Managing Cotton Modules

    USDA-ARS?s Scientific Manuscript database

    The use of RFID transponders in the module tags on round modules formed by John Deere harvesters has opened up new possibilities for managing modules and harvest data. Tools are needed to help integrate this new technology and provide additional value to growers and ginners. A mobile application w...

  4. New technologies for managing cotton modules

    USDA-ARS?s Scientific Manuscript database

    The use of RFID transponders in the module tags on round modules formed by John Deere harvesters has opened up new possibilities for managing modules and harvest data. Tools are needed to help integrate this new technology and provide additional value to growers and ginners. A mobile application w...

  5. Wireless Interconnects for Intra-chip & Inter-chip Transmission

    NASA Astrophysics Data System (ADS)

    Narde, Rounak Singh

    With the emergence of Internet of Things and information revolution, the demand of high performance computing systems is increasing. The copper interconnects inside the computing chips have evolved into a sophisticated network of interconnects known as Network on Chip (NoC) comprising of routers, switches, repeaters, just like computer networks. When network on chip is implemented on a large scale like in Multicore Multichip (MCMC) systems for High Performance Computing (HPC) systems, length of interconnects increases and so are the problems like power dissipation, interconnect delays, clock synchronization and electrical noise. In this thesis, wireless interconnects are chosen as the substitute for wired copper interconnects. Wireless interconnects offer easy integration with CMOS fabrication and chip packaging. Using wireless interconnects working at unlicensed mm-wave band (57-64GHz), high data rate of Gbps can be achieved. This thesis presents study of transmission between zigzag antennas as wireless interconnects for Multichip multicores (MCMC) systems and 3D IC. For MCMC systems, a four-chips 16-cores model is analyzed with only four wireless interconnects in three configurations with different antenna orientations and locations. Return loss and transmission coefficients are simulated in ANSYS HFSS. Moreover, wireless interconnects are designed, fabricated and tested on a 6'' silicon wafer with resistivity of 55O-cm using a basic standard CMOS process. Wireless interconnect are designed to work at 30GHz using ANSYS HFSS. The fabricated antennas are resonating around 20GHz with a return loss of less than -10dB. The transmission coefficients between antenna pair within a 20mm x 20mm silicon die is found to be varying between -45dB to -55dB. Furthermore, wireless interconnect approach is extended for 3D IC. Wireless interconnects are implemented as zigzag antenna. This thesis extends the work of analyzing the wireless interconnects in 3D IC with different configurations of antenna orientations and coolants. The return loss and transmission coefficients are simulated using ANSYS HFSS.

  6. Introduction to CAD/Computers. High-Technology Training Module.

    ERIC Educational Resources Information Center

    Lockerby, Hugh

    This learning module for an eighth-grade introductory technology course is designed to help teachers introduce students to computer-assisted design (CAD) in a communications unit on graphics. The module contains a module objective and five specific objectives, a content outline, suggested instructor methodology, student activities, a list of six…

  7. Applied Physics Modules Selected for Architectural and Civil Drafting Technologies.

    ERIC Educational Resources Information Center

    Waring, Gene

    Designed for individualized use in an applied physics course in postsecondary vocational-technical education, this series of six learning modules is equivalent to the content of a three-credit hour class in surveying and drafting technology, architectural drafting technology, building construction technology, and civil engineering technology.…

  8. 45 CFR 170.302 - General certification criteria for Complete EHRs or EHR Modules.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Certification Criteria for Health Information Technology § 170.302 General certification criteria for Complete EHRs or EHR Modules...

  9. 45 CFR 170.302 - General certification criteria for Complete EHRs or EHR Modules.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Certification Criteria for Health Information Technology § 170.302 General certification criteria for Complete EHRs or EHR Modules...

  10. 45 CFR 170.302 - General certification criteria for Complete EHRs or EHR Modules.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Certification Criteria for Health Information Technology § 170.302 General certification criteria for Complete EHRs or EHR Modules...

  11. 45 CFR 170.302 - General certification criteria for Complete EHRs or EHR Modules.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Certification Criteria for Health Information Technology § 170.302 General certification criteria for Complete EHRs or EHR Modules...

  12. 45 CFR 170.302 - General certification criteria for Complete EHRs or EHR Modules.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Certification Criteria for Health Information Technology § 170.302 General certification criteria for Complete EHRs or EHR Modules...

  13. The Air Force Manufacturing Technology (MANTECH): Technology transfer methodology as exemplified by the radar transmit/receive module program

    NASA Technical Reports Server (NTRS)

    Houpt, Tracy; Ridgely, Margaret

    1991-01-01

    The Air Force Manufacturing Technology program is involved with the improvement of radar transmit/receive modules for use in active phased array radars for advanced fighter aircraft. Improvements in all areas of manufacture and test of these modules resulting in order of magnitude improvements in the cost of and the rate of production are addressed, as well as the ongoing transfer of this technology to the Navy.

  14. Development of Manufacturing Technology to Accelerate Cost Reduction of Low Concentration and

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Detrick, Adam

    The purpose of this project was to accelerate deployment of cost-effective US-based manufacturing of Solaria’s unique c-Si module technology. This effort successfully resulted in the development of US-based manufacturing technology to support two highly-differentiated, market leading product platforms. The project was initially predicated on developing Solaria’s low-concentration PV (LCPV) module technology which at the time of the award was uniquely positioned to exceed the SunShot price goal of $0.50/Wp for standard c-Si modules. The Solaria LCPV module is a 2.5x concentrator that leverages proven, high-reliability PV module materials and low silicon cell usage into a technology package that already hadmore » the lowest direct material cost and leading Levelized Cost of Electricity (LCOE). With over 25 MW commercially deployed globally, the Solaria module was well positioned to continue to lead in PV module cost reduction. Throughout the term of the contract, market conditions changed dramatically and so to did Solaria’s product offerings to support this. However, the manufacturing technology developed for the LCPV module was successfully leveraged and optimized to support two new and different product platforms. BIPV “PowerVision” and High-efficiency “PowerXT” modules. The primary barrier to enabling high-volume PV module manufacturing in the US is the high manual labor component in certain unique aspects of our manufacturing process. The funding was used to develop unique manufacturing automation which makes the manual labor components of these key processes more efficient and increase throughput. At the core of Solaria’s product offerings are its unique and proprietary techniques for dicing and re-arranging solar cells into modules with highly-differentiated characteristics that address key gaps in the c-Si market. It is these techniques that were successfully evolved and deployed into US-based manufacturing site with SunShot funding. Today, Solaria is currently positioned to become the market leader with these two technologies over the coming 24 months largely due to the successful innovations of the underlying manufacturing technology. This success will leverage US-based manufacturing technology and the associated US-jobs to support. Solaria views the project as highly successful and a great example of SunShot funding enabling the creating of US jobs and the deployment of ubiquitous solar energy products.« less

  15. 45 CFR 170.570 - Effect of revocation on the certifications issued to Complete EHRs and EHR Module(s).

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY ONC HIT...

  16. 45 CFR 170.570 - Effect of revocation on the certifications issued to Complete EHRs and EHR Module(s).

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Permanent...

  17. 45 CFR 170.570 - Effect of revocation on the certifications issued to Complete EHRs and EHR Module(s).

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Permanent...

  18. 45 CFR 170.570 - Effect of revocation on the certifications issued to Complete EHRs and EHR Module(s).

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... Human Services HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY ONC HIT...

  19. Automated software configuration in the MONSOON system

    NASA Astrophysics Data System (ADS)

    Daly, Philip N.; Buchholz, Nick C.; Moore, Peter C.

    2004-09-01

    MONSOON is the next generation OUV-IR controller project being developed at NOAO. The design is flexible, emphasizing code re-use, maintainability and scalability as key factors. The software needs to support widely divergent detector systems ranging from multi-chip mosaics (for LSST, QUOTA, ODI and NEWFIRM) down to large single or multi-detector laboratory development systems. In order for this flexibility to be effective and safe, the software must be able to configure itself to the requirements of the attached detector system at startup. The basic building block of all MONSOON systems is the PAN-DHE pair which make up a single data acquisition node. In this paper we discuss the software solutions used in the automatic PAN configuration system.

  20. Development of a 150-GHz MMIC Module Prototype for Large-Scale CMB Radiation

    NASA Technical Reports Server (NTRS)

    Kangaslahti, Pekka P.; Samoska, Lorene A.; Gaier, Todd C.; Soria, Mary M.; Lau, Judy M.; Sieth, Matthew M.; VanWinkle, Daniel; Tantawi, Sami

    2011-01-01

    HEMT-based receiver arrays with excellent noise and scalability are already starting to be manufactured at 100 GHz, but the advances in technology should make it possible to develop receiver modules with even greater operation frequency up to 200 GHz. A prototype heterodyne amplifier module has been developed for operation from 140 to 170 GHz using monolithic millimeter-wave integrated circuit (MMIC) low-noise InP high electron mobility transistor (HEMT) amplifiers. The compact, scalable module is centered on the 150-GHz atmospheric window using components known to operate well at these frequencies. Arrays equipped with hundreds of these modules can be optimized for many different astrophysical measurement techniques, including spectroscopy and interferometry. This module is a heterodyne receiver module that is extremely compact, and makes use of 35-nm InP HEMT technology, and which has been shown to have excellent noise temperatures when cooled cryogenically to 30 K. This reduction in system noise over prior art has been demonstrated in commercial mixers (uncooled) at frequencies of 160-180 GHz. The module is expected to achieve a system noise temperature of 60 K when cooled. An MMIC amplifier module has been designed to demonstrate the feasibility of expanding heterodyne amplifier technology to the 140 to 170-GHz frequency range for astronomical observations. The miniaturization of many standard components and the refinement of RF interconnect technology have cleared the way to mass-production of heterodyne amplifier receivers, making it a feasible technology for many large-population arrays. This work furthers the recent research efforts in compact coherent receiver modules, including the development of the Q/U Imaging ExperimenT (QUIET) modules centered at 40 and 90 GHz, and the production of heterodyne module prototypes at 90 GHz.

  1. Photo-induced spatial modulation of THz waves: opportunities and limitations.

    PubMed

    Kannegulla, Akash; Shams, Md Itrat Bin; Liu, Lei; Cheng, Li-Jing

    2015-12-14

    Programmable conductive patterns created by photoexcitation of semiconductor substrates using digital light processing (DLP) provides a versatile approach for spatial and temporal modulation of THz waves. The reconfigurable nature of the technology has great potential in implementing several promising THz applications, such as THz beam steering, THz imaging or THz remote sensing, in a simple, cost-effective manner. In this paper, we provide physical insight about how the semiconducting materials, substrate dimension, optical illumination wavelength and illumination size impact the performance of THz modulation, including modulation depth, modulation speed and spatial resolution. The analysis establishes design guidelines for the development of photo-induced THz modulation technology. Evolved from the theoretical analysis, a new mesa array technology composed by a matrix of sub-THz wavelength structures is introduced to maximize both spatial resolution and modulation depth for THz modulation with low-power photoexcitation by prohibiting the lateral diffusion of photogenerated carriers.

  2. Applied Physics Modules Selected for Electrical and Electronic Technologies.

    ERIC Educational Resources Information Center

    Waring, Gene

    Designed for individualized use in an applied physics course in postsecondary vocational-technical education, this series of twenty-three learning modules is equivalent to the content of two quarters of a five-credit hour class in electrical technology, electronic service technology, electronic engineering technology, or electromechanical…

  3. Performance Based Education. Technology Activity Modules.

    ERIC Educational Resources Information Center

    Custer, Rodney L., Ed.

    These Technology Activity Modules are designed to serve as an implementation resource for technology education teachers as they integrate technology education with Missouri's Academic Performance Standards and provide a source of activities and activity ideas that can be used to integrate and reinforce learning across the curriculum. The modules…

  4. 45 CFR 170.550 - EHR Module certification.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... Public Welfare DEPARTMENT OF HEALTH AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY ONC HIT Certification Program § 170.550 EHR Module certification. (a...

  5. 45 CFR 170.550 - EHR Module certification.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... Public Welfare DEPARTMENT OF HEALTH AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Permanent Certification Program for HIT § 170.550 EHR Module...

  6. 45 CFR 170.550 - EHR Module certification.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... Public Welfare Department of Health and Human Services HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY ONC HIT Certification Program § 170.550 EHR Module certification...

  7. 45 CFR 170.550 - EHR Module certification.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... Public Welfare DEPARTMENT OF HEALTH AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Permanent Certification Program for HIT § 170.550 EHR Module...

  8. Applied Physics Modules Selected for Manufacturing and Metal Technologies.

    ERIC Educational Resources Information Center

    Waring, Gene

    Designed for individualized use in an applied physics course in postsecondary vocational-technical education, this series of eighteen learning modules is equivalent to the content of two quarters of a five-credit hour class in manufacturing engineering technology, machine tool and design technology, welding technology, and industrial plastics…

  9. Technology Systems. Laboratory Activities.

    ERIC Educational Resources Information Center

    Brame, Ray; And Others

    This guide contains 43 modules of laboratory activities for technology education courses. Each module includes an instructor's resource sheet and the student laboratory activity. Instructor's resource sheets include some or all of the following elements: module number, course title, activity topic, estimated time, essential elements, objectives,…

  10. Micro-electro-mechanical systems (MEMS) and agile lensing-based modules for communications, sensing and signal processing

    NASA Astrophysics Data System (ADS)

    Reza, Syed Azer

    This dissertation proposes the use of the emerging Micro-Electro-Mechanical Systems (MEMS) and agile lensing optical device technologies to design novel and powerful signal conditioning and sensing modules for advanced applications in optical communications, physical parameter sensing and RF/optical signal processing. For example, these new module designs have experimentally demonstrated exceptional features such as stable loss broadband operations and high > 60 dB optical dynamic range signal filtering capabilities. The first part of the dissertation describes the design and demonstration of digital MEMS-based signal processing modules for communication systems and sensor networks using the TI DLP (Digital Light Processing) technology. Examples of such modules include optical power splitters, narrowband and broadband variable fiber optical attenuators, spectral shapers and filters. Compared to prior works, these all-digital designs have advantages of repeatability, accuracy, and reliability that are essential for advanced communications and sensor applications. The next part of the dissertation proposes, analyzes and demonstrates the use of analog opto-fluidic agile lensing technology for sensor networks and test and measurement systems. Novel optical module designs for distance sensing, liquid level sensing, three-dimensional object shape sensing and variable photonic delay lines are presented and experimentally demonstrated. Compared to prior art module designs, the proposed analog-mode modules have exceptional performances, particularly for extreme environments (e.g., caustic liquids) where the free-space agile beam-based sensor provide remote non-contact access for physical sensing operations. The dissertation also presents novel modules involving hybrid analog-digital photonic designs that make use of the different optical device technologies to deliver the best features of both analog and digital optical device operations and controls. Digital controls are achieved through the use of the digital MEMS technology and analog controls are realized by employing opto-fluidic agile lensing technology and acousto-optic technology. For example, variable fiber-optic attenuators and spectral filters are proposed using the hybrid design. Compared to prior art module designs, these hybrid designs provide a higher module dynamic range and increased resolution that are critical in various advanced system applications. In summary, the dissertation shows the added power of hybrid optical designs using both the digital and analog photonic signal processing versus just all-digital or all-analog module designs.

  11. Outlook and Challenges of Perovskite Solar Cells toward Terawatt-Scale Photovoltaic Module Technology

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Zhu, Kai; Kim, Donghoe; Whitaker, James B

    Rapid development of perovskite solar cells (PSCs) during the past several years has made this photovoltaic (PV) technology a serious contender for potential large-scale deployment on the terawatt scale in the PV market. To successfully transition PSC technology from the laboratory to industry scale, substantial efforts need to focus on scalable fabrication of high-performance perovskite modules with minimum negative environmental impact. Here, we provide an overview of the current research and our perspective regarding PSC technology toward future large-scale manufacturing and deployment. Several key challenges discussed are (1) a scalable process for large-area perovskite module fabrication; (2) less hazardous chemicalmore » routes for PSC fabrication; and (3) suitable perovskite module designs for different applications.« less

  12. Advanced packaging for Integrated Micro-Instruments

    NASA Technical Reports Server (NTRS)

    Lyke, James L.

    1995-01-01

    The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.

  13. Development of Hybrid Courses Utilizing Modules as an Objective in ATE Projects

    ERIC Educational Resources Information Center

    Payne, James E.; Murphy, Richard M.; Payne, Linda L.

    2017-01-01

    Orangeburg-Calhoun Technical College (OCtech) has been awarded two National Science Foundation Advanced Technological Education (NSF-ATE) grants since 2011 that have the development of module-based hybrid courses in Engineering Technology and Mechatronics as objectives. In this article, the advantages and challenges associated with module-based…

  14. Photovoltaic Module Reliability Workshop 2011: February 16-17, 2011

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Kurtz, S.

    2013-11-01

    NREL's Photovoltaic (PV) Module Reliability Workshop (PVMRW) brings together PV reliability experts to share information, leading to the improvement of PV module reliability. Such improvement reduces the cost of solar electricity and promotes investor confidence in the technology--both critical goals for moving PV technologies deeper into the electricity marketplace.

  15. Photovoltaic Module Reliability Workshop 2014: February 25-26, 2014

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Kurtz, S.

    2014-02-01

    NREL's Photovoltaic (PV) Module Reliability Workshop (PVMRW) brings together PV reliability experts to share information, leading to the improvement of PV module reliability. Such improvement reduces the cost of solar electricity and promotes investor confidence in the technology--both critical goals for moving PV technologies deeper into the electricity marketplace.

  16. Photovoltaic Module Reliability Workshop 2013: February 26-27, 2013

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Kurtz, S.

    2013-10-01

    NREL's Photovoltaic (PV) Module Reliability Workshop (PVMRW) brings together PV reliability experts to share information, leading to the improvement of PV module reliability. Such improvement reduces the cost of solar electricity and promotes investor confidence in the technology--both critical goals for moving PV technologies deeper into the electricity marketplace.

  17. Photovoltaic Module Reliability Workshop 2010: February 18-19, 2010

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Kurtz, J.

    2013-11-01

    NREL's Photovoltaic (PV) Module Reliability Workshop (PVMRW) brings together PV reliability experts to share information, leading to the improvement of PV module reliability. Such improvement reduces the cost of solar electricity and promotes investor confidence in the technology--both critical goals for moving PV technologies deeper into the electricity marketplace.

  18. Popular Science Recognizes Innovative Solar Technologies

    Science.gov Websites

    photovoltaic (solar electric) modules to produce standard household current are listed among the magazine's photovoltaic module that produces standard household, or alternating current (AC). Ascension Technology's SunSineTM 300 AC photovoltaic module has a built-in microinverter that eliminates the need for direct

  19. Aviation Maintenance Technology. General. G103 Fundamentals of Regulations, Publications, and Records. Instructor Material.

    ERIC Educational Resources Information Center

    Oklahoma State Board of Vocational and Technical Education, Stillwater. Curriculum and Instructional Materials Center.

    These instructor materials for an aviation maintenance technology course contain three instructional modules. The modules cover the following topics: selecting and using regulations, publications, and records; documenting aircraft records; and exercising mechanic's privileges and limitations. Each module contains some or all of these nine basic…

  20. 2016 NREL Photovoltaic Module Reliability Workshop

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Kurtz, Sarah

    NREL's Photovoltaic (PV) Module Reliability Workshop (PVMRW) brings together PV reliability experts to share information, leading to the improvement of PV module reliability. Such improvement reduces the cost of solar electricity and promotes investor confidence in the technology - both critical goals for moving PV technologies deeper into the electricity marketplace.

  1. 2015 NREL Photovoltaic Module Reliability Workshops

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Kurtz, Sarah

    NREL's Photovoltaic (PV) Module Reliability Workshop (PVMRW) brings together PV reliability experts to share information, leading to the improvement of PV module reliability. Such improvement reduces the cost of solar electricity and promotes investor confidence in the technology--both critical goals for moving PV technologies deeper into the electricity marketplace.

  2. Multichip imager with improved optical performance near the butt region

    NASA Technical Reports Server (NTRS)

    Kinnard, Kenneth P. (Inventor); Strong, Jr., Richard T. (Inventor); Goldfarb, Samuel (Inventor); Tower, John R. (Inventor)

    1991-01-01

    A compound imager consists of two or more individual chips, each with at least one line array of sensors thereupon. Each chip has a glass support plate attached to the side from which light reaches the line arrays. The chips are butted together end-to-end to make large line arrays of sensors. Because of imperfections in cutting, the butted surfaces define a gap. Light entering in the region of the gap is either lost or falls on an individual imager other than the one for which it is intended. This results in vignetting and/or crosstalk near the butted region. The gap is filled with an epoxy resin or other similar material which, when hardened, has an index of referaction near that of the glass support plate.

  3. VCSEL Scaling, Laser Integration on Silicon, and Bit Energy

    DTIC Science & Technology

    2017-03-01

    need of high efficiency with high temperature operation eliminates essentially all laser diode technologies except VCSELs. Therefore scaling of the...CW laser diode and separate modulator. Lower diagram circuitry shows the case for a DML VCSEL. The small gain volume and high speed modulation...speed of the modulator. However the CW laser that is needed for the modulator appears to create a technological roadblock for laser diode platforms

  4. ROCHEM SEPARATION SYSTEMS, INC. DISC TUBE™ MODULE TECHNOLOGY - INNOVATIVE TECHNOLOGY EVALUATION REPORT

    EPA Science Inventory

    SITE program demonstration of the Rochem Disc Tube™ Module (DTM) developed by Rochem Separation systems Inc. The demonstration test was conducted at the central landfill Superfund site in Johnston, Rhode Island in August 1994. The DTM technology is an innovative membrane filtra...

  5. Potential of thin-film solar cell module technology

    NASA Technical Reports Server (NTRS)

    Shimada, K.; Ferber, R. R.; Costogue, E. N.

    1985-01-01

    During the past five years, thin-film cell technology has made remarkable progress as a potential alternative to crystalline silicon cell technology. The efficiency of a single-junction thin-film cell, which is the most promising for use in flat-plate modules, is now in the range of 11 percent with 1-sq cm cells consisting of amorphous silicon, CuInSe2 or CdTe materials. Cell efficiencies higher than 18 percent, suitable for 15 percent-efficient flat plate modules, would require a multijunction configuration such as the CdTe/CuInSe2 and tandem amorphous-silicon (a-Si) alloy cells. Assessments are presented of the technology status of thin-film-cell module research and the potential of achieving the higher efficiencies required for large-scale penetration into the photovoltaic (PV) energy market.

  6. Development Module Oriented Science Technology Society Indue Science Literacy Assessment for 7th-Grade Junior High School Students in 2nd -Semester

    NASA Astrophysics Data System (ADS)

    Arbi, Y. R.; Sumarmin, R.; Putri, D. H.

    2018-04-01

    The problem in the science learning process is the application of the scientific approach takes a long time in order to provide conceptual understanding to the students, there is no teaching materials that can measure students reasoning and thinking ability, and the assessment has not measured students reasoning and literacy skills.The effort can be done is to develop science technology society module indue science literacy assessment. The purpose of the research was to produce a module oriented society indue science science technology literacy assessment. The research is development research using Plomp model, consist of preliminary, prototyping, and assessment phase. Data collect by questionnare and documantion. The result there is science technology society module indue science literacy assessment is very valid.

  7. A Photovoltaics Module for Incoming Science, Technology, Engineering and Mathematics Undergraduates

    ERIC Educational Resources Information Center

    Dark, Marta L.

    2011-01-01

    Photovoltaic-cell-based projects have been used to train eight incoming undergraduate women who were part of a residential summer programme at a women's college. A module on renewable energy and photovoltaic cells was developed in the physics department. The module's objectives were to introduce women in science, technology, engineering and…

  8. Rapid Deposition Technology Holds the Key for the World's Largest Manufacturer of Thin-Film Solar Modules (Fact Sheet)

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Not Available

    2013-08-01

    First Solar, Inc. has been collaborating with NREL since 1991, advancing its thin-film cadmium telluride solar technology to grow from a startup company to become one of the world's largest manufacturers of solar modules, and the world's largest manufacturer of thin-film solar modules.

  9. Use of Handwriting Recognition Technologies in Tablet-Based Learning Modules for First Grade Education

    ERIC Educational Resources Information Center

    Yanikoglu, Berrin; Gogus, Aytac; Inal, Emre

    2017-01-01

    Learning through modules on a tablet helps students participate effectively in learning activities in classrooms and provides flexibility in the learning process. This study presents the design and evaluation of an application that is based on handwriting recognition technologies and e-content for the developed learning modules. The application…

  10. Photovoltaic Module Reliability Workshop 2012: February 28 - March 1, 2012

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Kurtz, S.

    2013-11-01

    NREL's Photovoltaic (PV) Module Reliability Workshop (PVMRW) brings together PV reliability experts to share information, leading to the improvement of PV module reliability. Such improvement reduces the cost of solar electricity and promotes investor confidence in the technology--both critical goals for moving PV technologies deeper into the electricity marketplace.

  11. Specific energy yield comparison between crystalline silicon and amorphous silicon based PV modules

    NASA Astrophysics Data System (ADS)

    Ferenczi, Toby; Stern, Omar; Hartung, Marianne; Mueggenburg, Eike; Lynass, Mark; Bernal, Eva; Mayer, Oliver; Zettl, Marcus

    2009-08-01

    As emerging thin-film PV technologies continue to penetrate the market and the number of utility scale installations substantially increase, detailed understanding of the performance of the various PV technologies becomes more important. An accurate database for each technology is essential for precise project planning, energy yield prediction and project financing. However recent publications showed that it is very difficult to get accurate and reliable performance data of theses technologies. This paper evaluates previously reported claims the amorphous silicon based PV modules have a higher annual energy yield compared to crystalline silicon modules relative to their rated performance. In order to acquire a detailed understanding of this effect, outdoor module tests were performed at GE Global Research Center in Munich. In this study we examine closely two of the five reported factors that contribute to enhanced energy yield of amorphous silicon modules. We find evidence to support each of these factors and evaluate their relative significance. We discuss aspects for improvement in how PV modules are sold and identify areas for further study further study.

  12. Maisotsenko cycle applications in multi-stage ejector recycling module for chemical production

    NASA Astrophysics Data System (ADS)

    Levchenko, D. O.; Artyukhov, A. E.; Yurko, I. V.

    2017-08-01

    The article is devoted to the theoretical bases of multistage (multi-level) utilization modules as part of chemical plants (on the example of the technological line for obtaining nitrogen fertilizers). The possibility of recycling production waste (ammonia vapors, dust and substandard nitrogen fertilizers) using ejection devices and waste heat using Maisotsenko cycle technology (Maisotsenko heat and mass exchanger (HMX), Maisotsenko power cycles and recuperators, etc.) is substantiated. The principle of operation of studied recycling module and prospects for its implementation are presented. An improved technological scheme for obtaining granular fertilizers and granules with porous structure with multistage (multi-level) recycling module is proposed.

  13. V-band integrated quadriphase modulator

    NASA Technical Reports Server (NTRS)

    Grote, A.; Chang, K.

    1983-01-01

    A V-band integrated circuit quadriphase shift keyed modulator/exciter for space communications systems was developed. Intersatellite communications systems require direct modulation at 60 GHz to enhance signal processing capability. For most systems, particularly space applications, small and lightweight components are essential to alleviate severe system design constraints. Thus to achieve wideband, high data rate systems, direct modulation techniques at millimeter waves using solid state integrated circuit technology are an integral part of the overall technology developments.

  14. [MATCHE: Management Approach to Teaching Consumer and Homemaking Education.] Consumer Approach Strand: Foods and Nutrition. Module I-C-1: Technological, Sociological, Ecological, and Environmental Factors Related to Food.

    ERIC Educational Resources Information Center

    Newsome, Ratana

    This competency-based preservice home economics teacher education module on technological, sociological, ecological, and environmental factors related to food is the first in a set of five modules on consumer education related to foods and nutrition. (This set is part of a larger series of sixty-seven modules on the Management Approach to Teaching…

  15. Health Instruction Packages: Medical Technologies--EEG, Radiology, & Biomedical Photography.

    ERIC Educational Resources Information Center

    Brittenham, Dorothea; And Others

    Text, illustrations, and exercises are utilized in this set of four learning modules to instruct medical technology students in a variety of job-related skills. The first module, "EEG Technology: Measurement Technique of the 'International 10-20 System'" by Dorothea Brittenham, describes a procedure used by electroencephalograph…

  16. Advanced modulation technology development for earth station demodulator applications

    NASA Technical Reports Server (NTRS)

    Davis, R. C.; Wernlund, J. V.; Gann, J. A.; Roesch, J. F.; Wright, T.; Crowley, R. D.

    1989-01-01

    The purpose of this contract was to develop a high rate (200 Mbps), bandwidth efficient, modulation format using low cost hardware, in 1990's technology. The modulation format chosen is 16-ary continuous phase frequency shift keying (CPFSK). The implementation of the modulation format uses a unique combination of a limiter/discriminator followed by an accumulator to determine transmitted phase. An important feature of the modulation scheme is the way coding is applied to efficiently gain back the performance lost by the close spacing of the phase points.

  17. Laser space communication experiment: Modulator technology

    NASA Technical Reports Server (NTRS)

    Goodwin, F. E.

    1973-01-01

    Results are presented of a contractual program to develop the modulator technology necessary for a 10.6 micron laser communication system using cadmium telluride as the modulator material. The program consisted of the following tasks: (1) The growth of cadmium telluride crystals of sufficient size and purity and with the necessary optical properties for use as laser modulator rods. (2) Develop a low loss antireflection coating for the cadmium telluride rods. (3) Design and build a modulator capable of 300 MHz modulation. (4) Develop a modulator driver capable of a data rate of 300 MBits/sec, 12 W rms output power, and 40 percent efficiency. (5) Assemble and test the modulator system. All design goals were met and the system was built and tested.

  18. Mirror Technology Development for The International X-Ray Observatory Mission

    NASA Technical Reports Server (NTRS)

    Zhang, Will

    2010-01-01

    Presentation slides include: International X-ray Observatory (IXO), Lightweight and High Resolution X-ray Optics is Needed; Modular Design of Mirror Assembly, IXO Mirror Technology Development Objectives, Focus of Technology Development, Slumping - Status, Mirror Fabrication Progress, Temporary Bonding - Status, Alignment - Status, Permanent Bonding - Status, Mirror Housing Simulator (MHS) - TRL-4, Mini-Module (TRL-5), Flight-Like Module (TRL-6), Mirror Technology Development Team, Outlook, and Small Technology Firms that Have Made Direct Contributions to IXO Mirror Technology Development.

  19. Multilevel photonic modules for millimeter-wave phased-array antennas

    NASA Astrophysics Data System (ADS)

    Paolella, Arthur C.; Bauerle, Athena; Joshi, Abhay M.; Wright, James G.; Coryell, Louis A.

    2000-09-01

    Millimeter wave phased array systems have antenna element sizes and spacings similar to MMIC chip dimensions by virtue of the operating wavelength. Designing modules in traditional planar packaing techniques are therefore difficult to implement. An advantageous way to maintain a small module footprint compatible with Ka-Band and high frequency systems is to take advantage of two leading edge technologies, opto- electronic integrated circuits (OEICs) and multilevel packaging technology. Under a Phase II SBIR these technologies are combined to form photonic modules for optically controlled millimeter wave phased array antennas. The proposed module, consisting of an OEIC integrated with a planar antenna array will operate on the 40GHz region. The OEIC consists of an InP based dual-depletion PIN photodetector and distributed amplifier. The multi-level module will be fabricated using an enhanced circuit processing thick film process. Since the modules are batch fabricated using an enhanced circuit processing thick film process. Since the modules are batch fabricated, using standard commercial processes, it has the potential to be low cost while maintaining high performance, impacting both military and commercial communications systems.

  20. Identifying Effective Design Features of Technology-Infused Inquiry Learning Modules: A Two-Year Study of Students' Inquiry Abilities

    ERIC Educational Resources Information Center

    Hsu, Ying-Shao; Fang, Su-Chi; Zhang, Wen-Xin; Hsin-Kai, Wu; Wu, Pai-Hsing; Hwang, Fu-Kwun

    2016-01-01

    The two-year study aimed to explore how students' development of different inquiry abilities actually benefited from the design of technology-infused learning modules. Three learning modules on the topics of seasons, environmental issues and air pollution were developed to facilitate students' inquiry abilities: questioning, planning, analyzing,…

  1. [MATCHE: Management Approach to Teaching Consumer and Homemaking Education.] Consumer Approach Strand: Textiles and Clothing. Module I-D-4: Applications and Implications of New Technology in Textiles and Clothing.

    ERIC Educational Resources Information Center

    Joseph, Marjory

    This competency-based preservice home economics teacher education module on applications and implications of new technology in textiles and clothing is the fourth in a set of four modules on consumer education related to textiles and clothing. (This set is part of a larger series of sixty-seven modules on the Management Approach to Teaching…

  2. Evolving technologies for Space Station Freedom computer-based workstations

    NASA Technical Reports Server (NTRS)

    Jensen, Dean G.; Rudisill, Marianne

    1990-01-01

    Viewgraphs on evolving technologies for Space Station Freedom computer-based workstations are presented. The human-computer computer software environment modules are described. The following topics are addressed: command and control workstation concept; cupola workstation concept; Japanese experiment module RMS workstation concept; remote devices controlled from workstations; orbital maneuvering vehicle free flyer; remote manipulator system; Japanese experiment module exposed facility; Japanese experiment module small fine arm; flight telerobotic servicer; human-computer interaction; and workstation/robotics related activities.

  3. Heat Transfer in Structures: The Development of a M/S/T Construction Experience.

    ERIC Educational Resources Information Center

    Wescott, Jack; Leduc, Alan

    1994-01-01

    The objectives of this construction activity are to develop user-friendly instructional modules that apply concepts of mathematics, science, and technology to solve energy problems; develop an exchange between faculty of technology teacher education and manufacturing technology programs; and serve as a pilot for the development of future modules.…

  4. Development and Implementation of High School Chemistry Modules Using Touch-Screen Technologies

    ERIC Educational Resources Information Center

    Lewis, Maurica S.; Zhao, Jinhui; Montclare, Jin Kim

    2012-01-01

    Technology was employed to motivate and captivate students while enriching their in-class education. An outreach program is described that involved college mentors introducing touch-screen technology into a high school chemistry classroom. Three modules were developed, with two of them specifically tailored to encourage comprehension of molecular…

  5. A Survey of Hardware and Software Technologies for the Rapid Development of Multimedia Instructional Modules

    ERIC Educational Resources Information Center

    Ganesan, Nanda

    2008-01-01

    A survey of hardware and software technologies was conducted to identify suitable technologies for the development of instructional modules representing various instructional approaches. The approaches modeled were short PowerPoint presentations, chalk-and-talk type of lectures and software tutorials. The survey focused on identifying application…

  6. System and method for design and optimization of grid connected photovoltaic power plant with multiple photovoltaic module technologies

    DOEpatents

    Thomas, Bex George; Elasser, Ahmed; Bollapragada, Srinivas; Galbraith, Anthony William; Agamy, Mohammed; Garifullin, Maxim Valeryevich

    2016-03-29

    A system and method of using one or more DC-DC/DC-AC converters and/or alternative devices allows strings of multiple module technologies to coexist within the same PV power plant. A computing (optimization) framework estimates the percentage allocation of PV power plant capacity to selected PV module technologies. The framework and its supporting components considers irradiation, temperature, spectral profiles, cost and other practical constraints to achieve the lowest levelized cost of electricity, maximum output and minimum system cost. The system and method can function using any device enabling distributed maximum power point tracking at the module, string or combiner level.

  7. On the sensitivity of 4 different CPV module technologies to relevant ambient and operation conditions

    NASA Astrophysics Data System (ADS)

    Domínguez, César; Besson, Pierre

    2014-09-01

    The sensitivity of four different CPV module technologies to most operating conditions relevant to CPV systems has been studied, namely DNI, spectrum, cell and lens temperature and clearness of the sky. In order to isolate the influence of a single operation parameter, the analysis of long-term outdoor monitoring data is required. The effect of lens temperature on cell current has been found to vary greatly between modules due to the different optical architectures studied. Maximum sensitivity is found for silicone-on-glass primary lenses. The VOC thermal coefficient was found to vary between module technologies, probably due to differences in maximum local effective concentration.

  8. Electromagnetic DM technology meets future AO demands

    NASA Astrophysics Data System (ADS)

    Hamelinck, Roger; Rosielle, Nick; Steinbuch, Maarten; Doelman, Niek

    New deformable mirror technology is developed by the Technische Universiteit Eindhoven, Delft University of Technology and TNO Science and Industry. Several prototype adaptive deformable mirrors are realized mirrors, up to 427 actuators and ∅150mm diameter, with characteristics suitable for future AO systems. The prototypes consist of a 100µm thick, continuous facesheet on which low voltage, electromagnetic, push-pull actuators impose out-of-plane displacements. The variable reluctance actuators with ±10µm stroke and nanometer resolution are located in a standard actuator module. Each module with 61 actuators connects to a single PCB with dedicated, 16 bit, PWM based, drivers. A LVDS multi-drop cable connects up to 32 actuator modules. With the actuator module, accompanying PCB and multi-drop system the deformable mirror technology is made modular in its mechanics and electronics. An Ethernet-LVDS bridge enables any commercial PC to control the mirror using the UDP standard. Latest results of the deformable mirror technology development are presented.

  9. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates.

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark

    2008-09-01

    The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15more » min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in inconsistent proportions of metal and glassy phase particles present during the subsequent firing process. The consequences were subtle, intermittent changes to the thick film microstructure that gave rise to the reaction layer and, thus, the low pull strength phenomenon. A mitigation strategy would be the use of physical vapor deposition (PVD) techniques to create thin film bond pads; this is multi-chip module, deposited (MCM-D) technology.« less

  10. 77 FR 63791 - Crystalline Silicon Photovoltaic Cells, Whether or Not Assembled into Modules, from the People's...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-10-17

    ...., Jiangsu Sunlink PV Technology Co., Ltd., and JA Solar Technology Yangzhou Co., Ltd. On June 25, 2012, Wuxi... (Chengdu) PV Tianwei New Energy 25.96 Module Co., Ltd. (Chengdu) PV Module Co., Ltd. Canadian Solar.... Chint Solar (Zhejiang) Co., Ltd Chint Solar (Zhejiang) 25.96 Co., Ltd. Suzhou Shenglong PV-Tech Co...

  11. Adding Instruction about Technology Infusion to the Secondary Social Studies Course with Web-Based Modules.

    ERIC Educational Resources Information Center

    Ehman, Lee H.

    Modules to teach the appropriate integration of technology into social studies teaching were pilot-taught in a secondary social studies methods course. The seven modules emphasized the World Wide Web as a resource for teachers and students. Pre- and post-course surveys were conducted with the 24 students in the course. Both qualitative and…

  12. Mathematics for the Workplace. Applications from Machine Tool Technology (Michelin Tire Corporation). A Teacher's Guide.

    ERIC Educational Resources Information Center

    Wallace, Johnny M.; Stewart, Grover

    This module presents a real-world context in which mathematics skills (geometry and trigonometry) are used as part of a daily routine. The context is the machine tool technology field, and the module aims to help students develop the ability to analyze diagrams in order to make mathematical computations. The modules, which features applications…

  13. Mathematics for the Workplace. Applications from Radiological Technology. A Teacher's Guide.

    ERIC Educational Resources Information Center

    Wallace, Johnny M.; Nichols, Gay

    This module presents a real-world context in which mathematics skills are used as part of a daily routine. The context is the radiological technology field, and the module aims to help students use ratios and exponents as part of real-life problem solving. Materials in the module, most of which are designed for the teacher to duplicate and…

  14. Technology and Society: A Futuristic Perspective. [Student's Guide.] Preparing for Tomorrow's World.

    ERIC Educational Resources Information Center

    Iozzi, Louis A.; And Others

    This module is designed to provide students (grades 10-11) with experiences in examining how technology has changed our lives and in anticipating future changes. The module is divided into three sections. Role-playing simulations and readings are used in section 1 to examine the dynamic relationship between science/technology/society. Five…

  15. An abuttable CCD imager for visible and X-ray focal plane arrays

    NASA Technical Reports Server (NTRS)

    Burke, Barry E.; Mountain, Robert W.; Harrison, David C.; Bautz, Marshall W.; Doty, John P.

    1991-01-01

    A frame-transfer silicon charge-coupled-device (CCD) imager has been developed that can be closely abutted to other imagers on three sides of the imaging array. It is intended for use in multichip arrays. The device has 420 x 420 pixels in the imaging and frame-store regions and is constructed using a three-phase triple-polysilicon process. Particular emphasis has been placed on achieving low-noise charge detection for low-light-level imaging in the visible and maximum energy resolution for X-ray spectroscopic applications. Noise levels of 6 electrons at 1-MHz and less than 3 electrons at 100-kHz data rates have been achieved. Imagers have been fabricated on 1000-Ohm-cm material to maximize quantum efficiency and minimize split events in the soft X-ray regime.

  16. Programmable synaptic chip for electronic neural networks

    NASA Technical Reports Server (NTRS)

    Moopenn, A.; Langenbacher, H.; Thakoor, A. P.; Khanna, S. K.

    1988-01-01

    A binary synaptic matrix chip has been developed for electronic neural networks. The matrix chip contains a programmable 32X32 array of 'long channel' NMOSFET binary connection elements implemented in a 3-micron bulk CMOS process. Since the neurons are kept off-chip, the synaptic chip serves as a 'cascadable' building block for a multi-chip synaptic network as large as 512X512 in size. As an alternative to the programmable NMOSFET (long channel) connection elements, tailored thin film resistors are deposited, in series with FET switches, on some CMOS test chips, to obtain the weak synaptic connections. Although deposition and patterning of the resistors require additional processing steps, they promise substantial savings in silicon area. The performance of synaptic chip in a 32-neuron breadboard system in an associative memory test application is discussed.

  17. Compact illumination optic with three freeform surfaces for improved beam control.

    PubMed

    Sorgato, Simone; Mohedano, Rubén; Chaves, Julio; Hernández, Maikel; Blen, José; Grabovičkić, Dejan; Benítez, Pablo; Miñano, Juan Carlos; Thienpont, Hugo; Duerr, Fabian

    2017-11-27

    Multi-chip and large size LEDs dominate the lighting market in developed countries these days. Nevertheless, a general optical design method to create prescribed intensity patterns for this type of extended sources does not exist. We present a design strategy in which the source and the target pattern are described by means of "edge wavefronts" of the system. The goal is then finding an optic coupling these wavefronts, which in the current work is a monolithic part comprising up to three freeform surfaces calculated with the simultaneous multiple surface (SMS) method. The resulting optic fully controls, for the first time, three freeform wavefronts, one more than previous SMS designs. Simulations with extended LEDs demonstrate improved intensity tailoring capabilities, confirming the effectiveness of our method and suggesting that enhanced performance features can be achieved by controlling additional wavefronts.

  18. Ubiquitous Adoption of Innovative and Supportive Information and Communications Technology Across Health and Social Care Needs Education for Clinicians.

    PubMed

    Procter, Paula M

    2017-01-01

    The paper presents the development, use and evaluation of an on-line undergraduate module delivering an academic-led programme of eHealth learning within nursing, midwifery, allied health professional and social work courses. The health information technology competency frameworks are explored along with an overview of the resulting module. The need for an academically led module will be made along with a description of the management required to maintain validity of content materials. A review of student evaluations will be presented. In conclusion the positive change in attitude and understanding of academic staff members towards health information technology through the inclusion of the module across all of the undergraduate courses will be explored.

  19. Proceedings of the 21st Project Integration Meeting

    NASA Technical Reports Server (NTRS)

    1983-01-01

    Progress made by the Flat Plate Solar Array Project during the period April 1982 to January 1983 is described. Reports on polysilicon refining, thin film solar cell and module technology development, central station electric utility activities, silicon sheet growth and characteristics, advanced photovoltaic materials, cell and processes research, module technology, environmental isolation, engineering sciences, module performance and failure analysis and project analysis and integration are included.

  20. Construct mine environment monitoring system based on wireless mesh network

    NASA Astrophysics Data System (ADS)

    Chen, Xin; Ge, Gengyu; Liu, Yinmei; Cheng, Aimin; Wu, Jun; Fu, Jun

    2018-04-01

    The system uses wireless Mesh network as a network transmission medium, and strive to establish an effective and reliable underground environment monitoring system. The system combines wireless network technology and embedded technology to monitor the internal data collected in the mine and send it to the processing center for analysis and environmental assessment. The system can be divided into two parts: the main control network module and the data acquisition terminal, and the SPI bus technology is used for mutual communication between them. Multi-channel acquisition and control interface design Data acquisition and control terminal in the analog signal acquisition module, digital signal acquisition module, and digital signal output module. The main control network module running Linux operating system, in which the transplant SPI driver, USB card driver and AODV routing protocol. As a result, the internal data collection and reporting of the mine are realized.

  1. Documentation of the analysis of the benefits and costs of aeronautical research and technology models, volume 1

    NASA Technical Reports Server (NTRS)

    Bobick, J. C.; Braun, R. L.; Denny, R. E.

    1979-01-01

    The analysis of the benefits and costs of aeronautical research and technology (ABC-ART) models are documented. These models were developed by NASA for use in analyzing the economic feasibility of applying advanced aeronautical technology to future civil aircraft. The methodology is composed of three major modules: fleet accounting module, airframe manufacturing module, and air carrier module. The fleet accounting module is used to estimate the number of new aircraft required as a function of time to meet demand. This estimation is based primarily upon the expected retirement age of existing aircraft and the expected change in revenue passenger miles demanded. Fuel consumption estimates are also generated by this module. The airframe manufacturer module is used to analyze the feasibility of the manufacturing the new aircraft demanded. The module includes logic for production scheduling and estimating manufacturing costs. For a series of aircraft selling prices, a cash flow analysis is performed and a rate of return on investment is calculated. The air carrier module provides a tool for analyzing the financial feasibility of an airline purchasing and operating the new aircraft. This module includes a methodology for computing the air carrier direct and indirect operating costs, performing a cash flow analysis, and estimating the internal rate of return on investment for a set of aircraft purchase prices.

  2. High efficiency low cost monolithic module for SARSAT distress beacons

    NASA Technical Reports Server (NTRS)

    Petersen, Wendell C.; Siu, Daniel P.

    1992-01-01

    The program objectives were to develop a highly efficient, low cost RF module for SARSAT beacons; achieve significantly lower battery current drain, amount of heat generated, and size of battery required; utilize MMIC technology to improve efficiency, reliability, packaging, and cost; and provide a technology database for GaAs based UHF RF circuit architectures. Presented in viewgraph form are functional block diagrams of the SARSAT distress beacon and beacon RF module as well as performance goals, schematic diagrams, predicted performances, and measured performances for the phase modulator and power amplifier.

  3. Standard Hardware Acquisition and Reliability Program's (SHARP's) efforts in incorporating fiber optic interconnects into standard electronic module (SEM) connectors

    NASA Astrophysics Data System (ADS)

    Riggs, William R.

    1994-05-01

    SHARP is a Navy wide logistics technology development effort aimed at reducing the acquisition costs, support costs, and risks of military electronic weapon systems while increasing the performance capability, reliability, maintainability, and readiness of these systems. Lower life cycle costs for electronic hardware are achieved through technology transition, standardization, and reliability enhancement to improve system affordability and availability as well as enhancing fleet modernization. Advanced technology is transferred into the fleet through hardware specifications for weapon system building blocks of standard electronic modules, standard power systems, and standard electronic systems. The product lines are all defined with respect to their size, weight, I/O, environmental performance, and operational performance. This method of defining the standard is very conducive to inserting new technologies into systems using the standard hardware. This is the approach taken thus far in inserting photonic technologies into SHARP hardware. All of the efforts have been related to module packaging; i.e. interconnects, component packaging, and module developments. Fiber optic interconnects are discussed in this paper.

  4. Aquatic Contaminant and Mercury Simulation Modules Developed for Hydrologic and Hydraulic Models

    DTIC Science & Technology

    2016-07-01

    through the food chain. Human health may also be affected by ingesting contaminated water or fish. As a result, the criteria for protecting human...ER D C/ EL T R- 16 -8 Environmental Quality Technology Research Program Aquatic Contaminant and Mercury Simulation Modules Developed...Quality Technology Research Program ERDC/EL TR-16-8 July 2016 Aquatic Contaminant and Mercury Simulation Modules Developed for Hydrologic and

  5. A high reliability module with thermoelectric device by molding technology for M2M wireless sensor network

    NASA Astrophysics Data System (ADS)

    Nakagawa, K.; Tanaka, T.; Suzuki, T.

    2015-10-01

    This paper presents the fabrication of a new energy harvesting module that uses a thermoelectric device (TED) by using molding technology. Through molding technology, the TED and circuit board can be properly protected and a heat-radiating fin structure can be simultaneously constructed. The output voltage per heater temperature of the TED module at 20 °C ambient temperature is 8 mV K-1, similar to the result with the aluminum heat sink which is almost the same fin size as the TED module. The accelerated environmental tests are performed on a damp heat test, which is an aging test under high temperature and high humidity, highly accelerated temperature, and humidity stress test (HAST) for the purpose of evaluating the electrical reliability in harsh environments, cold test and thermal cycle test to evaluate degrading characteristics by cycling through two temperatures. All test results indicate that the TED and circuit board can be properly protected from harsh temperature and humidity by using molding technology because the output voltage of after-tested modules is reduced by less than 5%. This study presents a novel fabrication method for a high reliability TED-installed module appropriate for Machine to Machine wireless sensor networks.

  6. Research progress of free space coherent optical communication

    NASA Astrophysics Data System (ADS)

    Tan, Zhenkun; Ke, Xizheng

    2018-02-01

    This paper mainly introduces the research progress of free space coherent optical communication in Xi'an University of Technology. In recent years, the research on the outer modulation technology of the laser, free-space-to-fiber coupling technique, the design of transmitting and receiving optical antenna, adaptive optical technology with or without wave-front sensor, automatic polarization control technology, frequency stabilization technology, heterodyne detection technology and high speed signal processing technology. Based on the above related research, the digital signal modulation, transmission, detection and data recovery are realized by the heterodyne detection technology in the free space optical communication system, and finally the function of smooth viewing high-definition video is realized.

  7. Teller Training Module: Off-Line Banking System. High-Technology Training Module.

    ERIC Educational Resources Information Center

    Lund, Candyce J.

    This teller training module on offline banking systems is intended to be part of a postsecondary financial applications course. The module contains the following sections: module objective; specific objective; content--electronic audit machine key functions, practice packet--sample bank transactions and practicing procedures, and…

  8. Introductory Industrial Technology I. Laboratory Activities.

    ERIC Educational Resources Information Center

    Towler, Alan L.; And Others

    This guide contains 36 learning modules intended for use by technology teachers and students in grades 7 and 8. Each module includes a student laboratory activity and instructor's resource sheet. Each student activity includes the following: activity topic and overview, challenge statement, objectives, vocabulary/concepts reinforced,…

  9. Introductory Industrial Technology II. Laboratory Activities.

    ERIC Educational Resources Information Center

    Towler, Alan L.

    This guide contains 29 learning modules intended for use by technology teachers and students in grade 8. Each module includes a student laboratory activity and instructor's resource sheet. Each student activity includes the following: activity topic and overview, challenge statement, objectives, vocabulary/concepts reinforced, equipment/supplies,…

  10. Aviation Maintenance Technology. General. G102 Fundamentals of Aircraft Maintenance. Instructor Material.

    ERIC Educational Resources Information Center

    Oklahoma State Board of Vocational and Technical Education, Stillwater. Curriculum and Instructional Materials Center.

    These instructor materials for an aviation maintenance technology course contain four instructional modules. The modules cover the following topics: identifying basic components of aircraft, performing aircraft cleaning and corrosion control, interpreting blueprints and drawing sketches, identifying structural materials, and performing basic…

  11. Technology Review for Mobile Multimedia Learning Environments

    ERIC Educational Resources Information Center

    Styliaras, Georgios

    2015-01-01

    Nowadays, the technological advancement in mobile devices has made possible the development of hypermedia applications that exploit their features. A potential application domain for mobile devices is multimedia educational applications and modules. Such modules may be shared, commented and further reused under other circumstances through the…

  12. Bigelow Expandable Activity Module (BEAM) Monitoring System

    NASA Technical Reports Server (NTRS)

    Wells, Nathan

    2017-01-01

    What is Bigelow Expandable Activity Module (BEAM)? The Bigelow Expandable Activity Module (BEAM) is an expandable habitat technology demonstration on ISS; increase human-rated inflatable structure Technology Readiness Level (TRL) to level 9. NASA managed ISS payload project in partnership with Bigelow Aerospace. Launched to ISS on Space X 8 (April 8th, 2016). Fully expanded on May 28th, 2016. Jeff Williams/Exp. 48 Commander first entered BEAM on June 5th, 2016.

  13. Advanced Waste Treatment, Wastewater Technology: A Two-Year Post High School Instructional Program. An Instructor's Guide for Use of Instructional Material in Wastewater Technology Training Programs. Volume VI.

    ERIC Educational Resources Information Center

    Gearheart, Robert A.; And Others

    This document is one in a series which outlines performance objectives and instructional modules for a course of study which explains the relationship and functions of the process units in a wastewater treatment plant. The modules are arranged in order appropriate for teaching students with no experience. The modules can also be rearranged and…

  14. Seventh workshop on the role of impurities and defects in silicon device processing

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    NONE

    1997-08-01

    This workshop is the latest in a series which has looked at technological issues related to the commercial development and success of silicon based photovoltaic (PV) modules. PV modules based on silicon are the most common at present, but face pressure from other technologies in terms of cell performance and cell cost. This workshop addresses a problem which is a factor in the production costs of silicon based PV modules.

  15. Historical Analysis of Champion Photovoltaic Module Efficiencies

    DOE PAGES

    Kurtz, Sarah; Repins, Ingrid; Metzger, Wyatt K.; ...

    2018-02-14

    Champion photovoltaic (PV) cell and module efficiencies have been reported in Progress in PV since 1993. Following the evolution of these efficiencies enables researchers to track the progress of various technologies. National Renewable Energy Laboratory has maintained a historical chart of the champion cell efficiencies, but has not published a similar chart of champion module efficiencies. Here, we analyze champion module efficiencies and compare them to champion cell efficiencies to better understand technology trends over the last three decades, highlighting that, in some cases, module efficiencies exceed 90% of cell efficiencies. Recommendations are provided on how to change the datamore » collection and reporting for champion efficiencies to increase the value of these records.« less

  16. Historical Analysis of Champion Photovoltaic Module Efficiencies

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Kurtz, Sarah; Repins, Ingrid; Metzger, Wyatt K.

    Champion photovoltaic (PV) cell and module efficiencies have been reported in Progress in PV since 1993. Following the evolution of these efficiencies enables researchers to track the progress of various technologies. National Renewable Energy Laboratory has maintained a historical chart of the champion cell efficiencies, but has not published a similar chart of champion module efficiencies. Here, we analyze champion module efficiencies and compare them to champion cell efficiencies to better understand technology trends over the last three decades, highlighting that, in some cases, module efficiencies exceed 90% of cell efficiencies. Recommendations are provided on how to change the datamore » collection and reporting for champion efficiencies to increase the value of these records.« less

  17. Current Trends of Blanket Research and Deveopment in Japan 4.Blanket Technology Development Using ITER for Demonstration and Commercial Fusion Power Plant

    NASA Astrophysics Data System (ADS)

    Akiba, Masato; Jitsukawa, Shiroh; Muroga, Takeo

    This paper describes the status of blanket technology and material development for fusion power demonstration plants and commercial fusion plants. In particular, the ITER Test Blanket Module, IFMIF, JAERI/DOE HFIR and JUPITER-II projects are highlighted, which have the important role to develop these technology. The ITER Test Blanket Module project has been conducted to demonstrate tritium breeding and power generation using test blanket modules, which will be installed into the ITER facility. For structural material development, the present research status is overviewed on reduced activation ferritic steel, vanadium alloys, and SiC/SiC composites.

  18. A study on Aerosol jet printing technology in LED module manufacturing

    NASA Astrophysics Data System (ADS)

    Rudorfer, Andreas; Tscherner, Martin; Palfinger, Christian; Reil, Frank; Hartmann, Paul; Seferis, Ioannis E.; Zych, Eugeniusz; Wenzl, Franz P.

    2016-09-01

    State of the art fabrication of LED modules based on chip-on-board (COB) technology comprises some shortcomings both with respect to the manufacturing process itself but also with regard to potential sources of failures and manufacturing impreciseness. One promising alternative is additive manufacturing, a technology which has gained a lot of attention during the last years due to its materials and cost saving capabilities. Especially direct-write technologies like Aerosol jet printing have demonstrated advantages compared to other technological approaches when printing high precision layers or high precision electronic circuits on substrates which, as an additional advantage, also can be flexible and 3D shaped. Based on test samples and test structures manufactured by Aerosol jet printing technology, in this context we discuss the potentials of additive manufacturing in various aspects of LED module fabrication, ranging from the deposition of the die-attach material, wire bond replacement by printed electrical connects as well as aspects of high-precision phosphor layer deposition for color conversion and white light generation.

  19. Research on Retro-reflecting Modulation in Space Optical Communication System

    NASA Astrophysics Data System (ADS)

    Zhu, Yifeng; Wang, Guannan

    2018-01-01

    Retro-reflecting modulation space optical communication is a new type of free space optical communication technology. Unlike traditional free space optical communication system, it applys asymmetric optical systems to reduce the size, weight and power consumption of the system and can effectively solve the limits of traditional free space optical communication system application, so it can achieve the information transmission. This paper introduces the composition and working principle of retro-reflecting modulation optical communication system, analyzes the link budget of this system, reviews the types of optical system and optical modulator, summarizes this technology future research direction and application prospects.

  20. Aviation Maintenance Technology. General. G105 Aviation Electricity and Electronics. Instructor Material.

    ERIC Educational Resources Information Center

    Oklahoma State Board of Vocational and Technical Education, Stillwater. Curriculum and Instructional Materials Center.

    These instructor materials for an aviation maintenance technology course contain five instructional modules. The modules cover the following topics: determining the relationship of voltage, current, resistance, and power in electrical circuits; computing and measuring capacitance and inductance; measuring voltage, current, resistance, and…

  1. Aviation Maintenance Technology. General. G104 Technical Mechanics. Instructor Material.

    ERIC Educational Resources Information Center

    Oklahoma State Board of Vocational and Technical Education, Stillwater. Curriculum and Instructional Materials Center.

    These instructor materials for an aviation maintenance technology course contain five instructional modules. The modules cover the following topics: performing aircraft ground handling and servicing, using hand and power tools and precision measuring instruments, identifying and selecting aircraft hardware, fabricating and installing rigid and…

  2. ADEpedia: a scalable and standardized knowledge base of Adverse Drug Events using semantic web technology.

    PubMed

    Jiang, Guoqian; Solbrig, Harold R; Chute, Christopher G

    2011-01-01

    A source of semantically coded Adverse Drug Event (ADE) data can be useful for identifying common phenotypes related to ADEs. We proposed a comprehensive framework for building a standardized ADE knowledge base (called ADEpedia) through combining ontology-based approach with semantic web technology. The framework comprises four primary modules: 1) an XML2RDF transformation module; 2) a data normalization module based on NCBO Open Biomedical Annotator; 3) a RDF store based persistence module; and 4) a front-end module based on a Semantic Wiki for the review and curation. A prototype is successfully implemented to demonstrate the capability of the system to integrate multiple drug data and ontology resources and open web services for the ADE data standardization. A preliminary evaluation is performed to demonstrate the usefulness of the system, including the performance of the NCBO annotator. In conclusion, the semantic web technology provides a highly scalable framework for ADE data source integration and standard query service.

  3. ARN Program, PDIT Final Technical Report - Deliver Orders 3, 12, 13

    DTIC Science & Technology

    2005-07-05

    Product Data Integration Technologies , Inc. dba Modulant 444 W Ocean Blvd, Suite 620 Long Beach, CA 90802 9. SPONSORING / MONITORING AGENCY NAME(S...HQ, Fort Belvoir, VA Prepared by: Product Data Integration Technologies , DBA Modulant 444 West Ocean Blvd, Suite 620 Long Beach, California...we originally planned. We had planned to simply stay generally aware of the DOD’s initiates and technology advances, thinking that the application

  4. Adjustment of multi-CCD-chip-color-camera heads

    NASA Astrophysics Data System (ADS)

    Guyenot, Volker; Tittelbach, Guenther; Palme, Martin

    1999-09-01

    The principle of beam-splitter-multi-chip cameras consists in splitting an image into differential multiple images of different spectral ranges and in distributing these onto separate black and white CCD-sensors. The resulting electrical signals from the chips are recombined to produce a high quality color picture on the monitor. Because this principle guarantees higher resolution and sensitivity in comparison to conventional single-chip camera heads, the greater effort is acceptable. Furthermore, multi-chip cameras obtain the compete spectral information for each individual object point while single-chip system must rely on interpolation. In a joint project, Fraunhofer IOF and STRACON GmbH and in future COBRA electronic GmbH develop methods for designing the optics and dichroitic mirror system of such prism color beam splitter devices. Additionally, techniques and equipment for the alignment and assembly of color beam splitter-multi-CCD-devices on the basis of gluing with UV-curable adhesives have been developed, too.

  5. Opportunities of CMOS-MEMS integration through LSI foundry and open facility

    NASA Astrophysics Data System (ADS)

    Mita, Yoshio; Lebrasseur, Eric; Okamoto, Yuki; Marty, Frédéfic; Setoguchi, Ryota; Yamada, Kentaro; Mori, Isao; Morishita, Satoshi; Imai, Yoshiaki; Hosaka, Kota; Hirakawa, Atsushi; Inoue, Shu; Kubota, Masanori; Denoual, Matthieu

    2017-06-01

    Since the 2000s, several countries have established micro- and nanofabrication platforms for the research and education community as national projects. By combining such platforms with VLSI multichip foundry services, various integrated devices, referred to as “CMOS-MEMS”, can be realized without constructing an entire cleanroom. In this paper, we summarize MEMS-last postprocess schemes for CMOS devices on a bulk silicon wafer as well as on a silicon-on-insulator (SOI) wafer using an open-access cleanroom of the Nanotechnology Platform of MEXT Japan. The integration devices presented in this article are free-standing structures and postprocess isolated LSI devices. Postprocess issues are identified with their solutions, such as the reactive ion etching (RIE) lag for dry release and the impact of the deep RIE (DRIE) postprocess on transistor characteristics. Integration with nonsilicon materials is proposed as one of the future directions.

  6. Hierarchical Address Event Routing for Reconfigurable Large-Scale Neuromorphic Systems.

    PubMed

    Park, Jongkil; Yu, Theodore; Joshi, Siddharth; Maier, Christoph; Cauwenberghs, Gert

    2017-10-01

    We present a hierarchical address-event routing (HiAER) architecture for scalable communication of neural and synaptic spike events between neuromorphic processors, implemented with five Xilinx Spartan-6 field-programmable gate arrays and four custom analog neuromophic integrated circuits serving 262k neurons and 262M synapses. The architecture extends the single-bus address-event representation protocol to a hierarchy of multiple nested buses, routing events across increasing scales of spatial distance. The HiAER protocol provides individually programmable axonal delay in addition to strength for each synapse, lending itself toward biologically plausible neural network architectures, and scales across a range of hierarchies suitable for multichip and multiboard systems in reconfigurable large-scale neuromorphic systems. We show approximately linear scaling of net global synaptic event throughput with number of routing nodes in the network, at 3.6×10 7 synaptic events per second per 16k-neuron node in the hierarchy.

  7. Implementation of the Timepix ASIC in the Scalable Readout System

    NASA Astrophysics Data System (ADS)

    Lupberger, M.; Desch, K.; Kaminski, J.

    2016-09-01

    We report on the development of electronics hardware, FPGA firmware and software to provide a flexible multi-chip readout of the Timepix ASIC within the framework of the Scalable Readout System (SRS). The system features FPGA-based zero-suppression and the possibility to read out up to 4×8 chips with a single Front End Concentrator (FEC). By operating several FECs in parallel, in principle an arbitrary number of chips can be read out, exploiting the scaling features of SRS. Specifically, we tested the system with a setup consisting of 160 Timepix ASICs, operated as GridPix devices in a large TPC field cage in a 1 T magnetic field at a DESY test beam facility providing an electron beam of up to 6 GeV. We discuss the design choices, the dedicated hardware components, the FPGA firmware as well as the performance of the system in the test beam.

  8. Emerging technologies in Si active photonics

    NASA Astrophysics Data System (ADS)

    Wang, Xiaoxin; Liu, Jifeng

    2018-06-01

    Silicon photonics for synergistic electronic–photonic integration has achieved remarkable progress in the past two decades. Active photonic devices, including lasers, modulators, and photodetectors, are the key challenges for Si photonics to meet the requirement of high bandwidth and low power consumption in photonic datalinks. Here we review recent efforts and progress in high-performance active photonic devices on Si, focusing on emerging technologies beyond conventional foundry-ready Si photonics devices. For emerging laser sources, we will discuss recent progress towards efficient monolithic Ge lasers, mid-infrared GeSn lasers, and high-performance InAs quantum dot lasers on Si for data center applications in the near future. We will then review novel modulator materials and devices beyond the free carrier plasma dispersion effect in Si, including GeSi and graphene electro-absorption modulators and plasmonic-organic electro-optical modulators, to achieve ultralow power and high speed modulation. Finally, we discuss emerging photodetectors beyond epitaxial Ge p–i–n photodiodes, including GeSn mid-infrared photodetectors, all-Si plasmonic Schottky infrared photodetectors, and Si quanta image sensors for non-avalanche, low noise single photon detection and photon counting. These emerging technologies, though still under development, could make a significant impact on the future of large-scale electronicSilicon photonics for synergistic electronic-photonic integration has achieved remarkable progress in the past two decades. Active photonic devices, including lasers, modulators, and photodetectors, are the key challenges for Si photonics to meet the requirement of high bandwidth and low power consumption in photonic datalinks. Here we review recent efforts and progress in high-performance active photonic devices on Si, focusing on emerging technologies beyond conventional foundry-ready Si photonics devices. For emerging laser sources, we will discuss recent progress towards efficient monolithic Ge lasers, mid-infrared GeSn lasers, and high-performance InAs quantum dot lasers on Si for data center applications in the near future. We will then review novel modulator materials and devices beyond the free carrier plasma dispersion effect in Si, including GeSi and graphene electro-absorption modulators and plasmonic-organic electro–optical modulators, to achieve ultralow power and high speed modulation. Finally, we discuss emerging photodetectors beyond epitaxial Ge p–i–n photodiodes, including GeSn mid-infrared photodetectors, all-Si plasmonic Schottky infrared photodetectors, and Si quanta image sensors for non-avalanche, low noise single photon detection and photon counting. These emerging technologies, though still under development, could make a significant impact on the future of large-scale electronic–photonic integration with performance inaccessible from conventional Si photonics technologies-photonic integration with performance inaccessible from conventional Si photonics technologies.

  9. Management and Supervision Procedures for Wastewater Facilities, Wastewater Technology: A Two-Year Post High School Instructional Program. An Instructor's Guide for Use of Instructional Material in Wastewater Technology Training Programs. Volume IV.

    ERIC Educational Resources Information Center

    Mason, George J.; And Others

    This document is one in a series which outlines performance objectives and instructional modules for a course of study in the management of wastewater treatment plants. The modules are arranged in an order appropriate for teaching students with no experience. The modules can also be rearranged and adapted for courses to upgrade personnel moving…

  10. Process Interaction for Wastewater Facilities, Wastewater Technology: A Two-Year Post High School Instructional Program. An Instructor's Guide for Use of Instructional Material in Wastewater Technology Training Programs. Volume V.

    ERIC Educational Resources Information Center

    Gearheart, Robert A.; And Others

    This document is one in a series which outlines performance objectives and instructional modules for a course of study which explains the relationships and functions of the process units in a wastewater treatment plant. The modules are arranged in an order appropriate for teaching students with no experience. The modules can also be rearranged and…

  11. Analogue and digital linear modulation techniques for mobile satellite

    NASA Technical Reports Server (NTRS)

    Whitmarsh, W. J.; Bateman, A.; Mcgeehan, J. P.

    1990-01-01

    The choice of modulation format for a mobile satellite service is complex. The subjective performance is summarized of candidate schemes and voice coder technologies. It is shown that good performance can be achieved with both analogue and digital voice systems, although the analogue system gives superior performance in fading. The results highlight the need for flexibility in the choice of signaling format. Linear transceiver technology capable of using many forms of narrowband modulation is described.

  12. Advanced Modulation and Coding Technology Conference

    NASA Technical Reports Server (NTRS)

    1992-01-01

    The objectives, approach, and status of all current LeRC-sponsored industry contracts and university grants are presented. The following topics are covered: (1) the LeRC Space Communications Program, and Advanced Modulation and Coding Projects; (2) the status of four contracts for development of proof-of-concept modems; (3) modulation and coding work done under three university grants, two small business innovation research contracts, and two demonstration model hardware development contracts; and (4) technology needs and opportunities for future missions.

  13. Analysis of interference of QPSK and QDPSK modulation signals by mathematical

    NASA Astrophysics Data System (ADS)

    Li, Dairuo; Xu, Kai

    2017-03-01

    In today's society, with the rapid development and extensive application of the information technology of the network central station and the integrated information system technology, information plays an important role in the military communication, mastering the information right to the competition Important role, how to protect one's own security, smooth access to and transmission of information, and to maximize the elimination of interference has become an important issue at home and abroad. QPSK modulation and its improved QPSK modulation as the mainstream signal modulation, the most widely used. In this paper, the principle of QPSK and QDPSK modulation and demodulation are introduced in this paper. Then, how to interfere with QPSK modulation signal is analyzed, and the interference of QPSK modulation signal is simulated by Matlab scripting program, which can be used in the next step. And to study the next step of anti-jamming measures provided the basis and preparatory work.

  14. The Science-Mathematics Connection: Using Technology in an Interdisciplinary Module.

    ERIC Educational Resources Information Center

    Flournoy, Bonita E.; Cook-Bax, Janice E.; Harris, Lillian

    2001-01-01

    Points out the importance of mathematics and science connections in the curriculum and introduces the Science Teachers Open Support System (STOSS) program which aims to assist African American middle school and high school teachers in designing and implementing technology-based interdisciplinary science and mathematics modules for culturally…

  15. Use of Electronic Technologies to Manage Seed Cotton Modules

    USDA-ARS?s Scientific Manuscript database

    Most U.S. farmers and ginners still use paper tags to identify cotton modules along with a large number painted on the side of traditional modules. The gin typically assigns tags for the modules. When the gin gets the module, the paper tag is removed and the information is manually entered into a s...

  16. Automated Composites Processing Technology: Film Module

    NASA Technical Reports Server (NTRS)

    Hulcher, A. Bruce

    2004-01-01

    NASA's Marshall Space Flight Center (MSFC) has developed a technology that combines a film/adhesive laydown module with fiber placement technology to enable the processing of composite prepreg tow/tape and films, foils or adhesives on the same placement machine. The development of this technology grew out of NASA's need for lightweight, permeation-resistant cryogenic propellant tanks. Autoclave processing of high performance composites results in thermally-induced stresses due to differences in the coefficients of thermal expansion of the fiber and matrix resin components. These stresses, together with the reduction in temperature due to cryogen storage, tend to initiate microcracking within the composite tank wall. One way in which to mitigate this problem is to introduce a thin, crack-resistant polymer film or foil into the tank wall. Investigation into methods to automate the processing of thin film or foil materials into composites led to the development of this technology. The concept employs an automated film supply and feed module that may be designed to fit existing fiber placement machines, or may be designed as integral equipment to new machines. This patent-pending technology can be designed such that both film and foil materials may be processed simultaneously, leading to a decrease in part build cycle time. The module may be designed having a compaction device independent of the host machine, or may utilize the host machine's compactor. The film module functions are controlled by a dedicated system independent of the fiber placement machine controls. The film, foil, or adhesive is processed via pre-existing placement machine run programs, further reducing operational expense.

  17. Solar Electric System

    NASA Technical Reports Server (NTRS)

    1987-01-01

    Heat Pipe Technology, Inc. undertook the development of a PV system that could bring solar electricity to the individual home at reasonable cost. His system employs high efficiency PV modules plus a set of polished reflectors that concentrate the solar energy and enhance the output of the modules. Dinh incorporated a sun tracking system derived from space tracking technology. It automatically follows the sun throughout the day and turns the modules so that they get maximum exposure to the solar radiation, further enhancing the system efficiency.

  18. Nonlinear Optics Technology. Volume 1. Solid State Laser Technology. Phase 3

    DTIC Science & Technology

    1991-01-12

    84 Figure 5.6 Modulator diffraction efficiency as a function of peak power for several 86 RF frequencies Figure 5.7 Thermal effects in the modulator. a...far-field profile of a beam making a 87 double pass through the modulator operating with a peak power of 80 W and average power of 1.6 W. b) same...AU three shown incorporate phase conjugation to provide good beam quality. Figure 1.1a is a standard phase conjugated master oscillator power

  19. Development of ATHENA mirror modules

    NASA Astrophysics Data System (ADS)

    Collon, Maximilien J.; Vacanti, Giuseppe; Barrière, Nicolas M.; Landgraf, Boris; Günther, Ramses; Vervest, Mark; van der Hoeven, Roy; Dekker, Danielle; Chatbi, Abdel; Girou, David; Sforzini, Jessica; Beijersbergen, Marco W.; Bavdaz, Marcos; Wille, Eric; Fransen, Sebastiaan; Shortt, Brian; Haneveld, Jeroen; Koelewijn, Arenda; Booysen, Karin; Wijnperle, Maurice; van Baren, Coen; Eigenraam, Alexander; Müller, Peter; Krumrey, Michael; Burwitz, Vadim; Pareschi, Giovanni; Massahi, Sonny; Christensen, Finn E.; Della Monica Ferreira, Desirée.; Valsecchi, Giuseppe; Oliver, Paul; Checquer, Ian; Ball, Kevin; Zuknik, Karl-Heinz

    2017-08-01

    Silicon Pore Optics (SPO), developed at cosine with the European Space Agency (ESA) and several academic and industrial partners, provides lightweight, yet stiff, high-resolution x-ray optics. This technology enables ATHENA to reach an unprecedentedly large effective area in the 0.2 - 12 keV band with an angular resolution better than 5''. After developing the technology for 50 m and 20 m focal length, this year has witnessed the first 12 m focal length mirror modules being produced. The technology development is also gaining momentum with three different radii under study: mirror modules for the inner radii (Rmin = 250 mm), outer radii (Rmax = 1500 mm) and middle radii (Rmid = 737 mm) are being developed in parallel.

  20. Innovative manufacturing technologies for low-cost, high efficiency PERC-based PV modules

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Yelundur, Vijay

    2017-04-19

    The goal this project was to accelerate the deployment of innovative solar cell and module technologies that reduce the cost of PERC-based modules to best-in-class. New module integration technology was to be used to reduce the cost and reliance on conventional silver bus bar pastes and enhance cell efficiency. On the cell manufacturing front, the cost of PERC solar cells was to be reduced by introducing advanced metallization approaches to increase cell efficiency. These advancements will be combined with process optimization to target cell efficiencies in the range of 21 to 21.5%. This project will also explore the viability ofmore » a bifacial PERC solar cell design to enable cost savings through the use of thin silicon wafers. This project was terminated on 4/30/17 after four months of activity due financial challenges facing the recipient.« less

  1. High throughput manufacturing of thin-film CdTe photovoltaic modules. Annual subcontract report, 16 November 1993--15 November 1994

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Sandwisch, D W

    1995-11-01

    This report describes work performed by Solar Cells, Inc. (SCI), under a 3-year subcontract to advance SCI`s PV manufacturing technologies, reduce module production costs, increase module performance, and provide the groundwork for SCI to expand its commercial production capacities. SCI will meet these objectives in three phases by designing, debugging, and operating a 20-MW/year, automated, continuous PV manufacturing line that produces 60-cm {times} 120-cm thin-film CdTe PV modules. This report describes tasks completed under Phase 1 of the US Department of Energy`s PV Manufacturing Technology program.

  2. Research on the trace detection of carbon dioxide gas and modulation parameter optimization based on the TDLAS technology

    NASA Astrophysics Data System (ADS)

    Zhao, Peng; Tao, Jun; Yu, Chang-rui; Li, Ye

    2014-02-01

    Based on the technology of tunable diode laser absorption spectroscopy, modulation of the center wavelength of 2004 nm distributed feedback laser diode at a room-temperature, the second harmonic amplitude of CO2 at 2004nm can be obtained. The CO2 concentration can be calculated via the Beer-Lambert law. Sinusoidal modulation parameter is an important factor that affects the sensitivity and accuracy of the system, through the research on the relationship between sinusoidal modulation signal frequency, amplitude and Second harmonic linetype, we finally achieve the detection limit of 10ppm under 12 m optical path.

  3. CAD/CAM. High-Technology Training Module.

    ERIC Educational Resources Information Center

    Zuleger, Robert

    This high technology training module is an advanced course on computer-assisted design/computer-assisted manufacturing (CAD/CAM) for grades 11 and 12. This unit, to be used with students in advanced drafting courses, introduces the concept of CAD/CAM. The content outline includes the following seven sections: (1) CAD/CAM software; (2) computer…

  4. PVMaT 1998 overview

    NASA Astrophysics Data System (ADS)

    Mittchell, Richard L.; Symko-Davies, Martha; Thomas, Holly P.; Witt, C. Edwin

    1999-03-01

    The Photovoltaic Manufacturing Technology (PVMaT) Project is a government/industry research and development (R&D) partnership between the U.S. federal government (through the U.S. Department of Energy [DOE]) and members of the U.S. PV industry. The goals of PVMaT are to assist the U.S. PV industry improve module manufacturing processes and equipment; accelerate manufacturing cost reductions for PV modules, balance-of-systems components, and integrated systems; increase commercial product performance and reliability; and enhance investment opportunities for substantial scale-ups of U.S.-based PV manufacturing plant capacities. The approach for PVMaT has been to cost-share the R&D risk as industry explores new manufacturing options and ideas for improved PV modules and components, advances system and product integration, and develops new system designs. These activities will lead to overall reduced system life-cycle costs for reliable PV end-products. The 1994 PVMaT Product-Driven BOS and Systems activities, as well as Product-Driven Module Manufacturing R&D activities, are just being completed. Fourteen new subcontracts have just been awarded in the areas of PV System and Component Technology and Module Manufacturing Technology. Government funding, subcontractor cost-sharing, and a comparison of the relative efforts by PV technology throughout the PVMaT project are also discussed.

  5. Analysis of mismatch and shading effects in a photovoltaic array using different technologies

    NASA Astrophysics Data System (ADS)

    Guerrero, J.; Muñoz, Y.; Ibáñez, F.; Ospino, A.

    2014-06-01

    In this paper, we analyze the performance of a photovoltaic array implemented in the Universidad Politécnica de Valencia which consists of modules of different technologies and power, connected in series, in order to quantify the energy losses due to mismatch and the effect of the shadows. To do this, the performance of the modules was measured in operation under ambient conditions with field measurement equipment (AMPROBE Solar Analyzer, Solar - 4000), which allows the extrapolation of measures to standard conditions STC. For the data validation, measures under controlled conditions were taken to some modules in the flash test laboratory of the Institute of Energy Technology ITE of Valencia in Spain. Subsequently the array curves measured were validated with a photovoltaic array model developed in MATLAB-Simulink for the same conditions and technologies. The results of this particular array are lost up to 20% of the energy supplied due to the modules mismatch. The study shows the curves and the energy loss due to shadows modules. This result opens scenarios for conceivable modifications to the PV field configurations today, chosen during the design stage and unchangeable during the operating stage; and gives greater importance to the energy loss by mismatch in the PV array.

  6. Development of an e-Learning Research Module Using Multimedia Instruction Approach.

    PubMed

    Kowitlawakul, Yanika; Chan, Moon Fai; Tan, Sharon Swee Lin; Soong, Alan Swee Kit; Chan, Sally Wai Chi

    2017-03-01

    Students nowadays feel more comfortable with new technologies, which increase their motivation and, as a result, improve their academic performance. In the last two decades, the use of information communication technology has been increasing in many disciplines in higher education. Online learning or e-learning has been used and integrated into the curriculum around the world. A team of nursing faculty and educational technology specialists have developed an e-learning research module and integrate it into the nursing curriculum. The aim was to assist master of nursing and postgraduate nursing students in developing their research knowledge before and throughout their enrollment in the research course. This e-learning module includes interactive multimedia such as audiovisual presentation, graphical theme, animation, case-based learning, and pretest and posttest for each topic area. The module focuses on three main topic areas: (1) basic research principles (for review), (2) quantitative method, and (3) qualitative method. The e-learning module is an innovative use of the information and communication technology to enhance student engagement and learning outcomes in a local context. This article discusses the development journey, piloting process, including the variety of evaluation perspectives, and the ways in which the results influenced the e-learning resource before its wider distribution.

  7. Hydrogen Fuel Cell Engines and Related Technologies

    NASA Astrophysics Data System (ADS)

    2001-12-01

    The Hydrogen Fuel Cell Engines and Related Technologies report documents the first training course ever developed and made available to the transportation community and general public on the use hydrogen fuel cells in transportation. The course is designed to train a new generation of technicians in gaining a more complete understanding of the concepts, procedures, and technologies involved with hydrogen fuel cell use in transportation purposes. The manual contains 11 modules (chapters). The first eight modules cover (1) hydrogen properties, use and safety; and (2) fuel cell technology and its systems, fuel cell engine design and safety, and design and maintenance of a heavy duty fuel cell bus engine. The different types of fuel cells and hybrid electric vehicles are presented, however, the system descriptions and maintenance procedures focus on proton-exchange-membrane (PEM) fuel cells with respect to heavy duty transit applications. Modules 9 and 10 are intended to provide a better understanding of the acts, codes, regulations and guidelines concerning the use of hydrogen, as well as the safety guidelines for both hydrogen maintenance and fueling facilities. Module 11 presents a glossary and conversions.

  8. Demonstration of Plasma Arc Environmental Technology Applications for the Demilitrization of DOD Stockpiles

    NASA Technical Reports Server (NTRS)

    Smith, Ed; Dee, P. E.; Zaghloul, Hany; Filius, Krag; Rivers, Tim

    2000-01-01

    Since 1989 the US Army Construction Engineering Research Laboratories (USACERL) have been active participants in the research and development towards establishing Plasma Arc Technology (PAT) as an efficient, economical, and safe hazardous waste immobilization tool. A plasma torch capable of generating high temperatures makes this technology a viable and powerful tool for the thermal destruction of various military industrial waste streams into an innocuous ceramic material no longer requiring hazardous waste landfill disposal. The emerging plasma environmental thermal treatment process has been used to safely and efficiently meet the waste disposal needs for various demilitarized components disposal needs, such as: (1) pyrotechnic smoke assemblies, (2) thermal batteries, (3) proximity fuses, (4) cartridge actuated devices (CADs), and (5) propellant actuated devices (PADs). MSE Technology Applications, Inc., (MSE) has proposed and fabricated a Mobile Plasma Treatment System to be a technology demonstrator for pilotscale mobile plasma waste processing. The system is capable of providing small-scale waste remediation services, and conducting waste stream applicability demonstrations. The Mobile Plasma Treatment System's innovative concept provides the flexibility to treat waste streams at numerous sites and sites with only a limited quantity of waste, yet too hazardous to transport to a regional fixed facility. The system was designed to be operated as skid mounted modules; consisting of a furnace module, controls module, offgas module, and ancillary systems module. All system components have been integrated to be operated from a single control station with both semi-continuous feeding and batch slag-pouring capability.

  9. Demonstration of Plasma Arc Environmental Technology Applications for the Demilitarization of DOD Stockpiles

    NASA Technical Reports Server (NTRS)

    Smith, Ed; Zaghloul, Hany; Filius, Krag; Rivers, Tim

    2000-01-01

    Since 1989 the U.S. Army Construction Engineering Research Laboratories (USACERL) have been active participants in the research and development toward establishing Plasma Arc Technology (PAT) as an efficient, economical, and safe hazardous waste immobilization tool. A plasma torch capable of generating high temperatures makes this technology a viable and powerful tool for the thermal destruction of various military industrial waste streams into an innocuous ceramic material no longer requiring hazardous waste landfill (Class 1) disposal. The emerging pl asma environmental thermal treatment process, has been used to safely and efficiently meet the waste disposal needs for various demilitarized components disposal needs, such as: pyrotechnic smoke assemblies, thermal batteries, proximity fuses, cartridge actuated devices (CAD's), and propellant actuated devices (PAD's). MSE Technology Applications, Inc., (MSE) has proposed and fabricated a Mobile Plasma Treatment System to be a technology demonstrator for pilot-scale mobile plasma waste processing. The system is capable of providing small-scale waste remediation services, and conducting waste stream applicability demonstrations. The Mobile Plasma Treatment System's innovative concept provides the flexibility to treat waste streams at numerous sites and sites with only a limited quantity of waste, yet too hazardous to transport to a regional fixed facility. The system was designed to be operated as skid mounted modules; consisting of a furnace module, controls module, offgas module, and ancillary systems module. All system components have been integrated to be operated from a single control station with both semi-continuous feeding and batch slag-pouring capability.

  10. Design and implementation of digital controllers for smart structures using field-programmable gate arrays

    NASA Astrophysics Data System (ADS)

    Kelly, Jamie S.; Bowman, Hiroshi C.; Rao, Vittal S.; Pottinger, Hardy J.

    1997-06-01

    Implementation issues represent an unfamiliar challenge to most control engineers, and many techniques for controller design ignore these issues outright. Consequently, the design of controllers for smart structural systems usually proceeds without regard for their eventual implementation, thus resulting either in serious performance degradation or in hardware requirements that squander power, complicate integration, and drive up cost. The level of integration assumed by the Smart Patch further exacerbates these difficulties, and any design inefficiency may render the realization of a single-package sensor-controller-actuator system infeasible. The goal of this research is to automate the controller implementation process and to relieve the design engineer of implementation concerns like quantization, computational efficiency, and device selection. We specifically target Field Programmable Gate Arrays (FPGAs) as our hardware platform because these devices are highly flexible, power efficient, and reprogrammable. The current study develops an automated implementation sequence that minimizes hardware requirements while maintaining controller performance. Beginning with a state space representation of the controller, the sequence automatically generates a configuration bitstream for a suitable FPGA implementation. MATLAB functions optimize and simulate the control algorithm before translating it into the VHSIC hardware description language. These functions improve power efficiency and simplify integration in the final implementation by performing a linear transformation that renders the controller computationally friendly. The transformation favors sparse matrices in order to reduce multiply operations and the hardware necessary to support them; simultaneously, the remaining matrix elements take on values that minimize limit cycles and parameter sensitivity. The proposed controller design methodology is implemented on a simple cantilever beam test structure using FPGA hardware. The experimental closed loop response is compared with that of an automated FPGA controller implementation. Finally, we explore the integration of FPGA based controllers into a multi-chip module, which we believe represents the next step towards the realization of the Smart Patch.

  11. NASA Tech Briefs, December 2008

    NASA Technical Reports Server (NTRS)

    2008-01-01

    Topics covered include: Crew Activity Analyzer; Distributing Data to Hand-Held Devices in a Wireless Network; Reducing Surface Clutter in Cloud Profiling Radar Data; MODIS Atmospheric Data Handler; Multibeam Altimeter Navigation Update Using Faceted Shape Model; Spaceborne Hybrid-FPGA System for Processing FTIR Data; FPGA Coprocessor for Accelerated Classification of Images; SiC JFET Transistor Circuit Model for Extreme Temperature Range; TDR Using Autocorrelation and Varying-Duration Pulses; Update on Development of SiC Multi-Chip Power Modules; Radio Ranging System for Guidance of Approaching Spacecraft; Electromagnetically Clean Solar Arrays; Improved Short-Circuit Protection for Power Cells in Series; Electromagnetically Clean Solar Arrays; Logic Gates Made of N-Channel JFETs and Epitaxial Resistors; Improved Short-Circuit Protection for Power Cells in Series; Communication Limits Due to Photon-Detector Jitter; System for Removing Pollutants from Incinerator Exhaust; Sealing and External Sterilization of a Sample Container; Converting EOS Data from HDF-EOS to netCDF; HDF-EOS 2 and HDF-EOS 5 Compatibility Library; HDF-EOS Web Server; HDF-EOS 5 Validator; XML DTD and Schemas for HDF-EOS; Converting from XML to HDF-EOS; Simulating Attitudes and Trajectories of Multiple Spacecraft; Specialized Color Function for Display of Signed Data; Delivering Alert Messages to Members of a Work Force; Delivering Images for Mars Rover Science Planning; Oxide Fiber Cathode Materials for Rechargeable Lithium Cells; Electrocatalytic Reduction of Carbon Dioxide to Methane; Heterogeneous Superconducting Low-Noise Sensing Coils; Progress toward Making Epoxy/Carbon-Nanotube Composites; Predicting Properties of Unidirectional-Nanofiber Composites; Deployable Crew Quarters; Nonventing, Regenerable, Lightweight Heat Absorber; Miniature High-Force, Long-Stroke SMA Linear Actuators; "Bootstrap" Configuration for Multistage Pulse-Tube Coolers; Reducing Liquid Loss during Ullage Venting in Microgravity; Ka-Band Transponder for Deep-Space Radio Science; Replication of Space-Shuttle Computers in FPGAs and ASICs; Demisable Reaction-Wheel Assembly; Spatial and Temporal Low-Dimensional Models for Fluid Flow; Advanced Land Imager Assessment System; Range Imaging without Moving Parts.

  12. Preliminary design for a standard 10 sup 7 bit Solid State Memory (SSM)

    NASA Technical Reports Server (NTRS)

    Hayes, P. J.; Howle, W. M., Jr.; Stermer, R. L., Jr.

    1978-01-01

    A modular concept with three separate modules roughly separating bubble domain technology, control logic technology, and power supply technology was employed. These modules were respectively the standard memory module (SMM), the data control unit (DCU), and power supply module (PSM). The storage medium was provided by bubble domain chips organized into memory cells. These cells and the circuitry for parallel data access to the cells make up the SMM. The DCU provides a flexible serial data interface to the SMM. The PSM provides adequate power to enable one DCU and one SMM to operate simultaneously at the maximum data rate. The SSM was designed to handle asynchronous data rates from dc to 1.024 Mbs with a bit error rate less than 1 error in 10 to the eight power bits. Two versions of the SSM, a serial data memory and a dual parallel data memory were specified using the standard modules. The SSM specification includes requirements for radiation hardness, temperature and mechanical environments, dc magnetic field emission and susceptibility, electromagnetic compatibility, and reliability.

  13. Research on radiation characteristics of dipole antenna modulation by sub-wavelength inhomogeneous plasma layer

    NASA Astrophysics Data System (ADS)

    Kong, Fanrong; Chen, Peiqi; Nie, Qiuyue; Zhang, Xiaoning; Zhang, Zhen; Jiang, Binhao

    2018-02-01

    The modulation and enhancement effect of sub-wavelength plasma structures on compact antennas exhibits obvious technological advantage and considerable progress. In order to extend the availability of this technology under complex and actual environment with inhomogeneous plasma structure, a numerical simulation analysis based on finite element method has been conducted in this paper. The modulation function of the antenna radiation with sub-wavelength plasma layer located at different positions was investigated, and the inhomogeneous plasma layer with multiple electron density distribution profiles were employed to explore the effect of plasma density distribution on the antenna radiation. It has been revealed that the optical near-field modulated distance and reduced plasma distribution are more beneficial to enhance the radiation. On the basis above, an application-focused research about communication through the plasma sheath surrounding a hypersonic vehicle has been carried out aiming at exploring an effective communication window. The relevant results devote guiding significance in the field of antenna radiation modulation and enhancement, as well as the development of communication technology in hypersonic flight.

  14. Long-term leaching of photovoltaic modules

    NASA Astrophysics Data System (ADS)

    Nover, Jessica; Zapf-Gottwick, Renate; Feifel, Carolin; Koch, Michael; Metzger, Jörg W.; Werner, Jürgen H.

    2017-08-01

    Some photovoltaic module technologies use toxic materials. We report long-term leaching on photovoltaic module pieces of 5 × 5 cm2 size. The pieces are cut out from modules of the four major commercial photovoltaic technologies: crystalline and amorphous silicon, cadmium telluride as well as from copper indium gallium diselenide. To simulate different environmental conditions, leaching occurs at room temperature in three different water-based solutions with pH 3, 7, and 11. No agitation is performed to simulate more representative field conditions. After 360 days, about 1.4% of lead from crystalline silicon module pieces and 62% of cadmium from cadmium telluride module pieces are leached out in acidic solutions. The leaching depends heavily on the pH and the redox potential of the aqueous solutions and it increases with time. The leaching behavior is predictable by thermodynamic stability considerations. These predictions are in good agreement with the experimental results.

  15. When PV modules are becoming real building elements: White solar module, a revolution for BIPV (Presentation Recording)

    NASA Astrophysics Data System (ADS)

    Perret-Aebi, Laure-Emmanuelle; Escarré, Jordi; Li, Heng-Yu; Sansonnens, Laurent; Galliano, Federico; Cattaneo, Gianluca; Heinstein, Patrick; Nicolay, Sylvain; Bailat, Julien; Eberhard, Sébastien; Ballif, Christophe

    2015-09-01

    The use of photovoltaic (PV) is not anymore an option but a real need in the construction of nearly zero energy buildings. To date, the lack of PV products specifically designed for building integration, considering aesthetics and architectural aspects, is one important limiting factor allowing a massive deployment of PV in the built environment. Architects are continuously asking for new solutions to customize the colour of PV elements to better integrate them into the building skin. Among these colours, white is especially attractive as it is widely used in architecture for its elegance, versatility and fresh look. Until now, white solar modules were not considered to be an option and even never been though to be a technological possibility. Nonetheless, CSEM recently developed a new technology to make white solar modules a reality. Furthermore, the new Swiss company called Solaxess is now working on the industrialisation of this very innovative technology and the first products are expecting to be on the market at the end of 2015. The technology is based on the combination of two different elements: a solar cell able to convert solar infrared light into electricity and a selective filter which reflects and diffuse the whole visible spectrum. Any PV technology based on crystalline silicon can be used as they have a good response in the infrared. Approximately 55% of the current generated under standard test conditions comes from the infrared leading to conversion efficiencies above 11%. We will demonstrate, that thanks to this very innovative technology PV modules can become attractive and real active building elements and therefore meets the requirements of any future energy management through advanced building skins.

  16. White LED visible light communication technology research

    NASA Astrophysics Data System (ADS)

    Yang, Chao

    2017-03-01

    Visible light communication is a new type of wireless optical communication technology. White LED to the success of development, the LED lighting technology is facing a new revolution. Because the LED has high sensitivity, modulation, the advantages of good performance, large transmission power, can make it in light transmission light signal at the same time. Use white LED light-emitting characteristics, on the modulation signals to the visible light transmission, can constitute a LED visible light communication system. We built a small visible optical communication system. The system composition and structure has certain value in the field of practical application, and we also research the key technology of transmitters and receivers, the key problem has been resolved. By studying on the optical and LED the characteristics of a high speed modulation driving circuit and a high sensitive receiving circuit was designed. And information transmission through the single chip microcomputer test, a preliminary verification has realized the data transmission function.

  17. Electricity from photovoltaic solar cells. Flat-Plate Solar Array Project of the US Department of Energy's National Photovoltaics Program: 10 years of progress

    NASA Technical Reports Server (NTRS)

    Christensen, Elmer

    1985-01-01

    The objectives were to develop the flat-plate photovoltaic (PV) array technologies required for large-scale terrestrial use late in the 1980s and in the 1990s; advance crystalline silicon PV technologies; develop the technologies required to convert thin-film PV research results into viable module and array technology; and to stimulate transfer of knowledge of advanced PV materials, solar cells, modules, and arrays to the PV community. Progress reached on attaining these goals, along with future recommendations are discussed.

  18. Advanced digital modulation: Communication techniques and monolithic GaAs technology

    NASA Technical Reports Server (NTRS)

    Wilson, S. G.; Oliver, J. D., Jr.; Kot, R. C.; Richards, C. R.

    1983-01-01

    Communications theory and practice are merged with state-of-the-art technology in IC fabrication, especially monolithic GaAs technology, to examine the general feasibility of a number of advanced technology digital transmission systems. Satellite-channel models with (1) superior throughput, perhaps 2 Gbps; (2) attractive weight and cost; and (3) high RF power and spectrum efficiency are discussed. Transmission techniques possessing reasonably simple architectures capable of monolithic fabrication at high speeds were surveyed. This included a review of amplitude/phase shift keying (APSK) techniques and the continuous-phase-modulation (CPM) methods, of which MSK represents the simplest case.

  19. Using Interactive Technology to Support Students' Understanding of the Greenhouse Effect and Global Warming

    ERIC Educational Resources Information Center

    Varma, Keisha; Linn, Marcia C.

    2012-01-01

    In this work, we examine middle school students' understanding of the greenhouse effect and global warming. We designed and refined a technology-enhanced curriculum module called "Global Warming: Virtual Earth". In the module activities, students conduct virtual experiments with a visualization of the greenhouse effect. They analyze data and draw…

  20. Mathematics for the Workplace. Applications from Medical Laboratory Technology. A Teacher's Guide.

    ERIC Educational Resources Information Center

    Wallace, Johnny M.; Jones, Dallas

    This module presents a real-world context in which mathematics skills are used as part of a daily routine. The context is the medical laboratory technology field, and the module aims to help students develop the ability to use mathematics computations while performing tasks similar to those performed by a medical technologist. Materials in the…

  1. Evaluation on the Usability of Physics Module in a Secondary School in Malaysia: Students' Retrospective

    ERIC Educational Resources Information Center

    Alias, Norlidah; Siraj, Saedah; DeWitt, Dorothy; Attaran, Mohammad; Nordin, Abu Bakar

    2013-01-01

    The main objective of this study is to implement and evaluate the Physics module based on technology and learning style using students' retrospective evaluation. Physics has always been thought of as the most difficult subject as it involves abstract concepts. Research has shown that technology has the potential to increase understanding of…

  2. High Efficiency Solar Integrated Roof Membrane Product

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Partyka, Eric; Shenoy, Anil

    2013-05-15

    This project was designed to address the Solar Energy Technology Program objective, to develop new methods to integrate photovoltaic (PV) cells or modules within a building-integrated photovoltaic (BIPV) application that will result in lower installed cost as well as higher efficiencies of the encapsulated/embedded PV module. The technology assessment and development focused on the evaluation and identification of manufacturing technologies and equipment capable of producing such low-cost, high-efficiency, flexible BIPV solar cells on single-ply roofing membranes.

  3. Disassemblability modeling technology of configurable product based on disassembly constraint relation weighted design structure matrix(DSM)

    NASA Astrophysics Data System (ADS)

    Qiu, Lemiao; Liu, Xiaojian; Zhang, Shuyou; Sun, Liangfeng

    2014-05-01

    The current research of configurable product disassemblability focuses on disassemblability evaluation and disassembly sequence planning. Little work has been done on quantitative analysis of configurable product disassemblability. The disassemblability modeling technology for configurable product based on disassembly constraint relation weighted design structure matrix (DSM) is proposed. Major factors affecting the disassemblability of configurable product are analyzed, and the disassembling degrees between components in configurable product are obtained by calculating disassembly entropies such as joint type, joint quantity, disassembly path, disassembly accessibility and material compatibility. The disassembly constraint relation weighted DSM of configurable product is constructed and configuration modules are formed by matrix decomposition and tearing operations. The disassembly constraint relation in configuration modules is strong coupling, and the disassembly constraint relation between modules is weak coupling, and the disassemblability configuration model is constructed based on configuration module. Finally, taking a hydraulic forging press as an example, the decomposed weak coupling components are used as configuration modules alone, components with a strong coupling are aggregated into configuration modules, and the disassembly sequence of components inside configuration modules is optimized by tearing operation. A disassemblability configuration model of the hydraulic forging press is constructed. By researching the disassemblability modeling technology of product configuration design based on disassembly constraint relation weighted DSM, the disassembly property in maintenance, recycling and reuse of configurable product are optimized.

  4. Physiologically Modulating Videogames or Simulations which use Motion-Sensing Input Devices

    NASA Technical Reports Server (NTRS)

    Pope, Alan T. (Inventor); Stephens, Chad L. (Inventor); Blanson, Nina Marie (Inventor)

    2014-01-01

    New types of controllers allow players to make inputs to a video game or simulation by moving the entire controller itself. This capability is typically accomplished using a wireless input device having accelerometers, gyroscopes, and an infrared LED tracking camera. The present invention exploits these wireless motion-sensing technologies to modulate the player's movement inputs to the videogame based upon physiological signals. Such biofeedback-modulated video games train valuable mental skills beyond eye-hand coordination. These psychophysiological training technologies enhance personal improvement, not just the diversion, of the user.

  5. Progress in amorphous silicon based large-area multijunction modules

    NASA Astrophysics Data System (ADS)

    Carlson, D. E.; Arya, R. R.; Bennett, M.; Chen, L.-F.; Jansen, K.; Li, Y.-M.; Maley, N.; Morris, J.; Newton, J.; Oswald, R. S.; Rajan, K.; Vezzetti, D.; Willing, F.; Yang, L.

    1996-01-01

    Solarex, a business unit of Amoco/Enron Solar, is scaling up its a-Si:H/a-SiGe:H tandem device technology for the production of 8 ft2 modules. The current R&D effort is focused on improving the performance, reliability and cost-effectiveness of the tandem junction technology by systematically optimizing the materials and interfaces in small-area single- and tandem junction cells. Average initial conversion efficiencies of 8.8% at 85% yield have been obtained in pilot production runs with 4 ft2 tandem modules.

  6. Nuclear Technology. Course 28: Welding Inspection. Module 28-5, Qualifications.

    ERIC Educational Resources Information Center

    Espy, John

    This fifth in a series of ten modules for a course titled Welding Inspection describes qualification requirements for welding procedures and welders and the role of the nuclear quality assurance/quality control technician. The module follows a typical format that includes the following sections: (1) introduction, (2) module prerequisites, (3)…

  7. Nuclear Technology. Course 28: Welding Inspection. Module 28-4, Weld Joint Verification.

    ERIC Educational Resources Information Center

    Espy, John

    This fourth in a series of ten modules for a course titled Welding Inspection discusses the nomenclature, symbols, and the purposes of most common joint designs, preparations, and fit-ups. The module follows a typical format that includes the following sections: (1) introduction, (2) module prerequisites, (3) objectives, (4) notes to…

  8. Nuclear Technology. Course 28: Welding Inspection. Module 28-1, Welding Fundamentals and Processes.

    ERIC Educational Resources Information Center

    Espy, John

    This first in a series of ten modules for a course titled Welding Inspection describes the role and responsbilities of the quality assurance/quality control technician in welding inspections. The module follows a typical format that includes the following sections: (1) introduction, (2) module prerequisites, (3) objectives, (4) notes to…

  9. Project T.E.A.M. (Technical Education Advancement Modules). Fundementals of Workplace Integration.

    ERIC Educational Resources Information Center

    Kraeling, Vicki

    This module is one of a series of instructional guides developed by Project TEAM (Technical Education Advancement Modules), a cooperative demonstration program for high technology training for unemployed, underemployed, and existing industrial employees whose basic technical skills are in need of upgrading. The module is a 27-hour overview course…

  10. Nuclear Technology. Course 28: Welding Inspection. Module 28-9, Weld Repair Control.

    ERIC Educational Resources Information Center

    Espy, John

    This ninth in a series of ten modules for a course titled Welding Inspection describes the purposes, essential elements, and application of a weld control program. The module follows a typical format that includes the following sections: (1) introduction, (2) module prerequisites, (3) objectives, (4) notes to instructor/student, (5) subject…

  11. Nuclear Technology. Course 31: Quality Assurance Practices. Module 31-5, Nonconforming Materials.

    ERIC Educational Resources Information Center

    Pritchard, Jim; Espy, John

    This fifth in a series of eight modules for a course titled Quality Assurance Practices describes the essential elements of a nonconforming material control system, including purpose and application. The module follows a typical format that includes the following sections: (1) introduction, (2) module prerequisites, (3) objectives, (4) notes to…

  12. A Usability Study of Interactive Web-Based Modules

    ERIC Educational Resources Information Center

    Girard, Tulay; Pinar, Musa

    2011-01-01

    This research advances the understanding of the usability of marketing case study modules in the area of interactive web-based technologies through the assignment of seven interactive case modules in a Principles of Marketing course. The case modules were provided for marketing students by the publisher, McGraw Hill Irwin, of the…

  13. Nuclear Technology. Course 28: Welding Inspection. Module 28-6, Process Controls.

    ERIC Educational Resources Information Center

    Espy, John

    This sixth in a series of ten modules for a course titled Welding Inspection describes procedures review, process monitoring, and weld defect analysis. The module follows a typical format that includes the following sections: (1) introduction, (2) module prerequisites, (3) objectives, (4) notes to instructor/student, (5) subject matter, (6)…

  14. Wind effect on PV module temperature: Analysis of different techniques for an accurate estimation.

    NASA Astrophysics Data System (ADS)

    Schwingshackl, Clemens; Petitta, Marcello; Ernst Wagner, Jochen; Belluardo, Giorgio; Moser, David; Castelli, Mariapina; Zebisch, Marc; Tetzlaff, Anke

    2013-04-01

    In this abstract a study on the influence of wind to model the PV module temperature is presented. This study is carried out in the framework of the PV-Alps INTERREG project in which the potential of different photovoltaic technologies is analysed for alpine regions. The PV module temperature depends on different parameters, such as ambient temperature, irradiance, wind speed and PV technology [1]. In most models, a very simple approach is used, where the PV module temperature is calculated from NOCT (nominal operating cell temperature), ambient temperature and irradiance alone [2]. In this study the influence of wind speed on the PV module temperature was investigated. First, different approaches suggested by various authors were tested [1], [2], [3], [4], [5]. For our analysis, temperature, irradiance and wind data from a PV test facility at the airport Bolzano (South Tyrol, Italy) from the EURAC Institute of Renewable Energies were used. The PV module temperature was calculated with different models and compared to the measured PV module temperature at the single panels. The best results were achieved with the approach suggested by Skoplaki et al. [1]. Preliminary results indicate that for all PV technologies which were tested (monocrystalline, amorphous, microcrystalline and polycrystalline silicon and cadmium telluride), modelled and measured PV module temperatures show a higher agreement (RMSE about 3-4 K) compared to standard approaches in which wind is not considered. For further investigation the in-situ measured wind velocities were replaced with wind data from numerical weather forecast models (ECMWF, reanalysis fields). Our results show that the PV module temperature calculated with wind data from ECMWF is still in very good agreement with the measured one (R² > 0.9 for all technologies). Compared to the previous analysis, we find comparable mean values and an increasing standard deviation. These results open a promising approach for PV module temperature estimation using meteorological parameters. References: [1] Skoplaki, E. et al., 2008: A simple correlation for the operating temperature of photovoltaic modules of arbitrary mounting, Solar Energy Materials & Solar Cells 92, 1393-1402 [2] Skoplaki, E. et al., 2008: Operating temperature of photovoltaic modules: A survey of pertinent correlations, Renewable Energy 34, 23-29 [3] Koehl, M. et al., 2011: Modeling of the nominal operating cell temperature based on outdoor weathering, Solar Energy Materials & Solar Cells 95, 1638-1646 [4] Mattei, M. et al., 2005: Calculation of the polycrystalline PV module temperature using a simple method of energy balance, Renewable Energy 31, 553-567 [5] Kurtz, S. et al.: Evaluation of high-temperature exposure of rack-mounted photovoltaic modules

  15. Cu(In,Ga)(Se,S)2 solar cell research in Solar Frontier: Progress and current status

    NASA Astrophysics Data System (ADS)

    Kato, Takuya

    2017-04-01

    As the largest manufacturer of Cu(In,Ga)(Se,S)2 (CIGS) thin-film photovoltaic modules with more than 1 GW/year production volume, Solar Frontier K.K. has continuously improved module performance and small-area cell efficiencies in the laboratory. Because of our low-cost and environmentally-friendly process, Solar Frontier’s CIGS is a promising technology for the mass production of photovoltaic modules to fill ever-increasing demand. Recently we have achieved certified efficiencies of 22.3 and 22.0% on CdS-buffered and Cd-free buffered small-area cells, respectively, as well as 18.6% on a Cd-free mini-module. In this paper, a review of our CIGS technology and recent progress on the development of the module and the small-area cell is presented.

  16. The Use of Uas for Rapid 3d Mapping in Geomatics Education

    NASA Astrophysics Data System (ADS)

    Teo, Tee-Ann; Tian-Yuan Shih, Peter; Yu, Sz-Cheng; Tsai, Fuan

    2016-06-01

    With the development of technology, UAS is an advance technology to support rapid mapping for disaster response. The aim of this study is to develop educational modules for UAS data processing in rapid 3D mapping. The designed modules for this study are focused on UAV data processing from available freeware or trial software for education purpose. The key modules include orientation modelling, 3D point clouds generation, image georeferencing and visualization. The orientation modelling modules adopts VisualSFM to determine the projection matrix for each image station. Besides, the approximate ground control points are measured from OpenStreetMap for absolute orientation. The second module uses SURE and the orientation files from previous module for 3D point clouds generation. Then, the ground point selection and digital terrain model generation can be archived by LAStools. The third module stitches individual rectified images into a mosaic image using Microsoft ICE (Image Composite Editor). The last module visualizes and measures the generated dense point clouds in CloudCompare. These comprehensive UAS processing modules allow the students to gain the skills to process and deliver UAS photogrammetric products in rapid 3D mapping. Moreover, they can also apply the photogrammetric products for analysis in practice.

  17. Introduction to MacDraft. High-Technology Training Module.

    ERIC Educational Resources Information Center

    Traxler, Gene

    This training module on MacDraft is part of a computer drafting skills unit on communications technology for grades 9-12. The objective is for each student to complete a drawing on the MacIntosh computer using the MacDraft software program. This drawing is to be dimensioned with a dual system and is to include a border and title block. This module…

  18. Education and Outreach on Space Sciences and Technologies in Taiwan

    NASA Astrophysics Data System (ADS)

    Tiger Liu, Jann-Yeng; Chen, hao-Yen; Lee, I.-Te

    2014-05-01

    The Ionospheric Radio Science Laboratory (IRSL) at Institute of Space Science, National Central University in Taiwan has been conducting a program for public outreach educations on space science by giving lectures, organizing camps, touring exhibits, and experiencing hand-on experiments to elementary school, high school, and college students as well as general public since 1991. The program began with a topic of traveling/living in space, and was followed by space environment, space mission, and space weather monitoring, etc. and a series of course module and experiment (i.e. experiencing activity) module was carried out. For past decadal, the course modules have been developed to cover the space environment of the Sun, interplanetary space, and geospace, as well as the space technology of the rocket, satellite, space shuttle (plane), space station, living in space, observing the Earth from space, and weather observation. Each course module highlights the current status and latest new finding as well as discusses 1-3 key/core issues/concepts and equip with 2-3 activity/experiment modules to make students more easily to understand the topics/issues. Regarding the space technologies, we focus on remote sensing of Earth's surface by FORMOSAT-2 and occultation sounding by FORMOSAT-3/COSMIC of Taiwan space mission. Moreover, scientific camps are given to lead students a better understanding and interesting on space sciences/ technologies. Currently, a visualized image projecting system, Dagik Earth, is developed to demonstrate the scientific results on a sphere together with the course modules. This system will dramatically improve the educational skill and increase interests of participators.

  19. Universal lab-on-a-chip platform for complex, perfused 3D cell cultures

    NASA Astrophysics Data System (ADS)

    Sonntag, F.; Schmieder, F.; Ströbel, J.; Grünzner, S.; Busek, M.; Günther, K.; Steege, T.; Polk, C.; Klotzbach, U.

    2016-03-01

    The miniaturization, rapid prototyping and automation of lab-on-a-chip technology play nowadays a very important role. Lab-on-a-chip technology is successfully implemented not only for environmental analysis and medical diagnostics, but also as replacement of animals used for the testing of substances in the pharmaceutical and cosmetics industries. For that purpose the Fraunhofer IWS and partners developed a lab-on-a-chip platform for perfused cell-based assays in the last years, which includes different micropumps, valves, channels, reservoirs and customized cell culture modules. This technology is already implemented for the characterization of different human cell cultures and organoids, like skin, liver, endothelium, hair follicle and nephron. The advanced universal lab-on-a-chip platform for complex, perfused 3D cell cultures is divided into a multilayer basic chip with integrated micropump and application-specific 3D printed cell culture modules. Moreover a technology for surface modification of the printed cell culture modules by laser micro structuring and a complex and flexibly programmable controlling device based on an embedded Linux system was developed. A universal lab-on-a-chip platform with an optional oxygenator and a cell culture module for cubic scaffolds as well as first cell culture experiments within the cell culture device will be presented. The module is designed for direct interaction with robotic dispenser systems. This offers the opportunity to combine direct organ printing of cells and scaffolds with the microfluidic cell culture module. The characterization of the developed system was done by means of Micro-Particle Image Velocimetry (μPIV) and an optical oxygen measuring system.

  20. Final Technical Report for Automated Manufacturing of Innovative CPV/PV Modules

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Okawa, David

    Cogenra’s Dense Cell Interconnect system was designed to use traditional front-contact cells and string them together into high efficiency and high reliability “supercells”. This novel stringer allows one to take advantage of the ~100 GW/year of existing cell production capacity and create a solar product for the customer that will produce more power and last longer than traditional PV products. The goal for this program was for Cogenra Solar to design and develop a first-of-kind automated solar manufacturing line that produces strings of overlapping cells or “supercells” based on Cogenra’s Dense Cell Interconnect (DCI) technology for their Low Concentration Photovoltaicmore » (LCPV) systems. This will enable the commercialization of DCI technology to improve the efficiency, reliability and economics for their Low Concentration Photovoltaic systems. In this program, Cogenra Solar very successfully designed, developed, built, installed, and started up the ground-breaking manufacturing tools required to assemble supercells. Cogenra then successfully demonstrated operation of the integrated line at high yield and throughput far exceeding expectations. The development of a supercell production line represents a critical step toward a high volume and low cost Low Concentration Photovoltaic Module with Dense Cell Interconnect technology and has enabled the evaluation of the technology for reliability and yield. Unfortunately, performance and cost headwinds on Low Concentration Photovoltaics systems including lack of diffuse capture (10-15% hit) and more expensive tracker requirements resulted in a move away from LCPV technology. Fortunately, the versatility of Dense Cell Interconnect technology allows for application to flat plate module technology as well and Cogenra has worked with the DOE to utilize the learning from this grant to commercialize DCI technology for the solar market through the on-going grant: Catalyzing PV Manufacturing in the US With Cogenra Solar’s Next-Generation Dense Cell Interconnect PV Module Manufacturing Technology. This program is now very successfully building off of this work and commercializing the technology to enable increased solar adoption.« less

  1. Electromechanical Componentry. High-Technology Training Module.

    ERIC Educational Resources Information Center

    Lindemann, Don

    This training module on electromechanical components contains 10 units for a two-year vocational program packaging system equipment control course at Wisconsin Indianhead Technical College. This module describes the functions of electromechanical devices essential for understanding input/output devices for Programmable Logic Control (PLC)…

  2. Nuclear Technology. Course 28: Welding Inspection. Module 28-7, Acceptance Inspection.

    ERIC Educational Resources Information Center

    Espy, John; Selleck, Ben

    This seventh in a series of ten modules for a course titled Welding Inspection describes how to determine what inspection is required for a given weld, when the inspection should be performed, and what acceptance standards apply. The module follows a typical format that includes the following sections: (1) introduction, (2) module prerequisites,…

  3. Nuclear Technology. Course 26: Nondestructive Examination (NDE) Techniques I. Module 26-3, Hydrostatic Tests.

    ERIC Educational Resources Information Center

    Pelton, Rick; Espy, John

    This third in a series of seven modules for a course titled Nondestructive Examination (NDE) Techniques I describes the principles and practices associated with hydrostatic testing. The module follows a typical format that includes the following sections: (1) introduction, (2) module prerequisites, (3) objectives, (4) notes to instructor/student,…

  4. owl-qa | Informatics Technology for Cancer Research (ITCR)

    Cancer.gov

    owl-qa is an OWL-based QA tool for cancer study CDEs. The tool uses the combination of the NCI Thesaurus and additional disjointness axioms to detect potential errors and duplications in the data element definitions. The tool comprises three modules: Data Integration and Services Module; Compositional Expression Transformation Module; and OWL-based Quality Assurance Module.

  5. Nuclear Technology. Course 32: Nondestructive Examination (NDE) Techniques II. Module 32-5, Fundamentals of Eddy Current Testing.

    ERIC Educational Resources Information Center

    Espy, John

    This fifth in a series of six modules for a course titled Nondestructive Examination (NDE) Techniques II describes the fundamental concepts applicable to eddy current testing in general. The module follows a typical format that includes the following sections: (1) introduction, (2) module prerequisites, (3) objectives, (4) notes to…

  6. 45 CFR 170.553 - Certification of health information technology other than Complete EHRs and EHR Modules.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 45 Public Welfare 1 2011-10-01 2011-10-01 false Certification of health information technology... AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS... TECHNOLOGY Permanent Certification Program for HIT § 170.553 Certification of health information technology...

  7. 45 CFR 170.553 - Certification of health information technology other than Complete EHRs and EHR Modules.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 45 Public Welfare 1 2014-10-01 2014-10-01 false Certification of health information technology... and Human Services HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS... TECHNOLOGY ONC HIT Certification Program § 170.553 Certification of health information technology other than...

  8. 45 CFR 170.553 - Certification of health information technology other than Complete EHRs and EHR Modules.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 45 Public Welfare 1 2012-10-01 2012-10-01 false Certification of health information technology... AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS... TECHNOLOGY Permanent Certification Program for HIT § 170.553 Certification of health information technology...

  9. 45 CFR 170.553 - Certification of health information technology other than Complete EHRs and EHR Modules.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 45 Public Welfare 1 2013-10-01 2013-10-01 false Certification of health information technology... AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS... TECHNOLOGY ONC HIT Certification Program § 170.553 Certification of health information technology other than...

  10. Space station thermal control surfaces. Volume 1: Interim report

    NASA Technical Reports Server (NTRS)

    Maag, C. R.; Millard, J. M.

    1978-01-01

    The U.S. space program goals for long-duration manned missions place particular demands on thermal-control systems. The objective of this program is to develop plans which are based on the present thermal-control technology, and which will keep pace with the other space program elements. The program tasks are as follows: (1) requirements analysis, with the objectives to define the thermal-control-surface requirements for both space station and 25 kW power module, to analyze the missions, and to determine the thermal-control-surface technology needed to satisfy both sets of requirements; (2) technology assessment, with the objectives to perform a literature/industry survey on thermal-control surfaces, to compare current technology with the requirements developed in the first task, and to determine what technology advancements are required for both the space station and the 25 kW power module; and (3) program planning that defines new initiative and/or program augmentation for development and testing areas required to provide the proper environment control for the space station and the 25 kW power module.

  11. Training mechanical engineering students to utilize biological inspiration during product development.

    PubMed

    Bruck, Hugh A; Gershon, Alan L; Golden, Ira; Gupta, Satyandra K; Gyger, Lawrence S; Magrab, Edward B; Spranklin, Brent W

    2007-12-01

    The use of bio-inspiration for the development of new products and devices requires new educational tools for students consisting of appropriate design and manufacturing technologies, as well as curriculum. At the University of Maryland, new educational tools have been developed that introduce bio-inspired product realization to undergraduate mechanical engineering students. These tools include the development of a bio-inspired design repository, a concurrent fabrication and assembly manufacturing technology, a series of undergraduate curriculum modules and a new senior elective in the bio-inspired robotics area. This paper first presents an overview of the two new design and manufacturing technologies that enable students to realize bio-inspired products, and describes how these technologies are integrated into the undergraduate educational experience. Then, the undergraduate curriculum modules are presented, which provide students with the fundamental design and manufacturing principles needed to support bio-inspired product and device development. Finally, an elective bio-inspired robotics project course is present, which provides undergraduates with the opportunity to demonstrate the application of the knowledge acquired through the curriculum modules in their senior year using the new design and manufacturing technologies.

  12. A photovoltaics module for incoming science, technology, engineering and mathematics undergraduates

    NASA Astrophysics Data System (ADS)

    Dark, Marta L.

    2011-05-01

    Photovoltaic-cell-based projects have been used to train eight incoming undergraduate women who were part of a residential summer programme at a women's college. A module on renewable energy and photovoltaic cells was developed in the physics department. The module's objectives were to introduce women in science, technology, engineering and mathematics (STEM) majors to physical phenomena, to develop quantitative literacy and communication skills, and to increase the students' interest in physics. The students investigated the performance of commercially available silicon semiconductors through experiments they designed, carried out and analysed. They fabricated and tested organic dye-based solar cells. This article describes the programme, the solar cell module, and presents some experimental results obtained by the students.

  13. Economically Sustainable Scaling of Photovoltaics to Meet Climate Targets

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Needleman, David Berney; Poindexter, Jeremy R.; Kurchin, Rachel C.

    To meet climate goals, photovoltaics (PV) deployment will have to grow rapidly over the next fifteen years. We identify two barriers to this growth: scale-up of manufacturing capacity and the cost of PV module production. We explore several technoeconomic approaches to overcoming these barriers and identify deep reductions in the capital intensity (capex) of PV module manufacturing and large increases in module efficiency as the most promising routes to rapid deployment. Given the lag inherent in rolling out new technology, we explore an approach where growth is fueled by debt or subsidies in the short-term and technological advances in themore » medium term. Finally, we analyze the current capex structure of crystalline silicon PV module manufacturing to identify potential savings.« less

  14. Long-range, full-duplex, modulated-reflector cell phone for voice/data transmission

    DOEpatents

    Neagley, Daniel L.; Briles, Scott D.; Coates, Don M.; Freund, Samuel M.

    2002-01-01

    A long-range communications apparatus utilizing modulated-reflector technology is described. The apparatus includes an energy-transmitting base station and remote units that do not emit radiation in order to communicate with the base station since modulated-reflector technology is used whereby information is attached to an RF carrier wave originating from the base station which is reflected by the remote unit back to the base station. Since the remote unit does not emit radiation, only a low-power power source is required for its operation. Information from the base station is transmitted to the remote unit using a transmitter and receiver, respectively. The range of such a communications system is determined by the properties of a modulated-reflector half-duplex link.

  15. Comparison of efficiency degradation in polycrystalline-Si and CdTe thin-film PV modules via accelerated lifecycle testing

    NASA Astrophysics Data System (ADS)

    Lai, T.; Potter, B. G.; Simmons-Potter, K.

    2017-08-01

    Thin-film solar cells normally have the shortest energy payback time due to their simpler mass-production process compared to polycrystalline-Si photovoltaic (PV) modules, despite the fact that crystalline-Si-based technology typically has a longer total lifetime and a higher initial power conversion efficiency. For both types of modules, significant aging occurs during the first two years of usage with slower long-term aging over the module lifetime. The PV lifetime and the return-on-investment for local PV system installations rely on long-term device performance. Understanding the efficiency degradation behavior under a given set of environmental conditions is, therefore, a primary goal for experimental research and economic analysis. In the present work, in-situ measurements of key electrical characteristics (J, V, Pmax, etc.) in polycrystalline-Si and CdTe thin-film PV modules have been analyzed. The modules were subjected to identical environmental conditions, representative of southern Arizona, in a full-scale, industrial-standard, environmental degradation chamber, equipped with a single-sun irradiance source, temperature, and humidity controls, and operating an accelerated lifecycle test (ALT) sequence. Initial results highlight differences in module performance with environmental conditions, including temperature de-rating effects, for the two technologies. Notably, the thin-film CdTe PV module was shown to be approximately 15% less sensitive to ambient temperature variation. After exposure to a seven-month equivalent compressed night-day weather cycling regimen the efficiency degradation rates of both PV technology types were obtained and will be discussed.

  16. Evaluation of 3D printed optofluidic smart glass prototypes.

    PubMed

    Wolfe, Daniel; Goossen, K W

    2018-01-22

    Smart glass or smart windows are an innovative technology used for thermal management, energy efficiency, and privacy applications. Notable commercially available smart glass relies on an electric stimuli to modulate the glass from a transparent to a translucent mode of operation. However, the current market technologies, such as electrochromic, polymer dispersed liquid crystal, and suspended particle devices are expensive and suffer from solar absorption, poor transmittance modulation, and in some cases, continuous power consumption. The authors of this paper present a novel optofluidic smart glass prototype capable of modulating visible light transmittance from 8% to 85%.

  17. Analysis of a Single Year of Performance Data for Thin Film Modules Deployed at NREL and NISE

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    MacAlpine, Sara; Deceglie, Michael; Kurtz, Sarah

    2016-08-01

    The National Renewable Energy Laboratory (NREL) and National Institute of Solar Energy (NISE), located in the United States and India, respectively, have partnered to deploy and monitor modules of three different thin film technologies, to compare the performance and/or degradation between the two sites. This report analyzes a single year of performance data (May 2014 -- May 2015) for the three thin film technologies, exploring the modules' performance under standard test conditions and monthly performance ratios, as well as fill factors varying season, light level, and temperature.

  18. Electrochemical Energy Storage for an Orbiting Space Station

    NASA Technical Reports Server (NTRS)

    Martin, R. E.

    1981-01-01

    The system weight of a multi hundred kilowatt fuel cell electrolysis cell energy storage system based upon alkaline electrochemical cell technology for use in a future orbiting space station in low Earth orbit (LEO) was studied. Preliminary system conceptual design, fuel cell module performance characteristics, subsystem and system weights, and overall system efficiency are identified. The impact of fuel cell module operating temperature and efficiency upon energy storage system weight is investigated. The weight of an advanced technology system featuring high strength filament wound reactant tanks and a fuel cell module employing lightweight graphite electrolyte reservoir plates is defined.

  19. A New Approach to Developing Interactive Software Modules Through Graduate Education

    NASA Astrophysics Data System (ADS)

    Sanders, Nathan E.; Faesi, Chris; Goodman, Alyssa A.

    2014-06-01

    Educational technology has attained significant importance as a mechanism for supporting experiential learning of science concepts. However, the growth of this mechanism is limited by the significant time and technical expertise needed to develop such products, particularly in specialized fields of science. We sought to test whether interactive, educational, online software modules can be developed effectively by students as a curriculum component of an advanced science course. We discuss a set of 15 such modules developed by Harvard University graduate students to demonstrate various concepts related to astronomy and physics. Their successful development of these modules demonstrates that online software tools for education and outreach on specialized topics can be produced while simultaneously fulfilling project-based learning objectives. We describe a set of technologies suitable for module development and present in detail four examples of modules developed by the students. We offer recommendations for incorporating educational software development within a graduate curriculum and conclude by discussing the relevance of this novel approach to new online learning environments like edX.

  20. Space Operations Learning Center

    NASA Technical Reports Server (NTRS)

    Lui, Ben; Milner, Barbara; Binebrink, Dan; Kuok, Heng

    2012-01-01

    The Space Operations Learning Center (SOLC) is a tool that provides an online learning environment where students can learn science, technology, engineering, and mathematics (STEM) through a series of training modules. SOLC is also an effective media for NASA to showcase its contributions to the general public. SOLC is a Web-based environment with a learning platform for students to understand STEM through interactive modules in various engineering topics. SOLC is unique in its approach to develop learning materials to teach schoolaged students the basic concepts of space operations. SOLC utilizes the latest Web and software technologies to present this educational content in a fun and engaging way for all grade levels. SOLC uses animations, streaming video, cartoon characters, audio narration, interactive games and more to deliver educational concepts. The Web portal organizes all of these training modules in an easily accessible way for visitors worldwide. SOLC provides multiple training modules on various topics. At the time of this reporting, seven modules have been developed: Space Communication, Flight Dynamics, Information Processing, Mission Operations, Kids Zone 1, Kids Zone 2, and Save The Forest. For the first four modules, each contains three components: Flight Training, Flight License, and Fly It! Kids Zone 1 and 2 include a number of educational videos and games designed specifically for grades K-6. Save The Forest is a space operations mission with four simulations and activities to complete, optimized for new touch screen technology. The Kids Zone 1 module has recently been ported to Facebook to attract wider audience.

  1. U.S. Laboratory Module (Destiny) for the International Space Station

    NASA Technical Reports Server (NTRS)

    1997-01-01

    In this photograph, the U.S. Laboratory Module (also called Destiny) for the International Space Station (ISS) is shown under construction in the West High Bay of the Space Station manufacturing facility (building 4708) at the Marshall Space Flight Center. The U.S. Laboratory module is the centerpiece of the ISS, where science experiments will be performed in the near-zero gravity of space. The Destiny Module was launched aboard the Space Shuttle orbiter Atlantis (STS-98 mission) on February 7, 2001. The aluminum module is 8.5 meters (28 feet) long and 4.3 meters (14 feet) in diameter. The laboratory consists of three cylindrical sections and two endcones with hatches that will be mated to other station components. A 50.9-centimeter- (20-inch-) diameter window is located on one side of the center module segment. This pressurized module is designed to accommodate pressurized payloads. It has a capacity of 24 rack locations, and payload racks will occupy 13 locations especially designed to support experiments. The ISS is a multidisciplinary laboratory, technology test bed, and observatory that will provide unprecedented undertakings in scientific, technological, and international experimentation.

  2. U.S. Laboratory Module (Destiny) for the International Space Station

    NASA Technical Reports Server (NTRS)

    1998-01-01

    This photograph shows the U.S. Laboratory Module (also called Destiny) for the International Space Station (ISS), in the Space Station manufacturing facility at the Marshall Space Flight Center, being readied for shipment to the Kennedy Space Center. The U.S. Laboratory module is the centerpiece of the ISS, where science experiments will be performed in the near-zero gravity of space. The Destiny Module was launched aboard the Space Shuttle orbiter Atlantis (STS-67 mission) on February 7, 2001. The aluminum module is 8.5 meters (28 feet) long and 4.3 meters (14 feet) in diameter. The laboratory consists of three cylindrical sections and two endcones with hatches that will be mated to other station components. A 50.9-centimeter- (20-inch-) diameter window is located on one side of the center module segment. This pressurized module is designed to accommodate pressurized payloads. It has a capacity of 24 rack locations, and payload racks will occupy 13 locations especially designed to support experiments. The ISS is a multidisciplinary laboratory, technology test bed, and observatory that will provide unprecedented undertakings in scientific, technological, and international experimentation.

  3. U.S. Laboratory Module (Destiny) for the International Space Station

    NASA Technical Reports Server (NTRS)

    1997-01-01

    This photograph shows the U.S. Laboratory Module (also called Destiny) for the International Space Station (ISS), under construction in the Space Station manufacturing facility at the Marshall Space Flight Center. The U.S. Laboratory module is the centerpiece of the ISS, where science experiments will be performed in the near-zero gravity of space. The Destiny Module was launched aboard the Space Shuttle orbiter Atlantis (STS-67 mission) on February 7, 2001. The aluminum module is 8.5 meters (28 feet) long and 4.3 meters (14 feet) in diameter. The laboratory consists of three cylindrical sections and two end cones with hatches that will be mated to other station components. A 50.9-centimeter- (20-inch-) diameter window is located on one side of the center module segment. This pressurized module is designed to accommodate pressurized payloads. It has a capacity of 24 rack locations, and payload racks will occupy 13 locations especially designed to support experiments. The ISS is a multidisciplinary laboratory, technology test bed, and observatory that will provide unprecedented undertakings in scientific, technological, and international experimentation.

  4. Technology Requirements and Development for Affordable High-Temperature Distributed Engine Controls

    DTIC Science & Technology

    2012-06-04

    long lasting, high temperature modules is to use high temperature electronics on ceramic modules. The electronic components are “ brazed ” onto the...Copyright © 2012 by ISA Technology Requirements and Development for Affordable High - Temperature Distributed Engine Controls Alireza Behbahani 1...with regards to high temperature capability. The Government and Industry Distributed Engine Controls Working Group (DECWG) [5] has been established

  5. Defence Technology Strategy for the Demands of the 21st Century

    DTIC Science & Technology

    2006-10-01

    understanding of human capability in the CBM role. Ownership of the intellectual property behind algorithms may be sovereign10, but implementation will...synchronisation schemes. · coding schemes. · modulation techniques. · access schemes. · smart spectrum usage . · low probability of intercept. · implementation...modulation techniques; access schemes; smart spectrum usage ; low probability of intercept Spectrum and bandwidth management · cross layer technologies to

  6. User-centered design and usability testing of an innovative health-related quality of life module.

    PubMed

    Nagykaldi, Z J; Jordan, M; Quitoriano, J; Ciro, C A; Mold, J W

    2014-01-01

    Various computerized health risk appraisals (HRAs) are available, but few of them assess health-related quality of life (HRQoL) in a goal-directed framework. This study describes the user-centered development and usability testing of an innovative HRQoL module that extends a validated HRA tool in primary care settings. Systematic user-centered design, usability testing, and qualitative methods were used to develop the HRQoL module in primary care practices. Twenty two patients and 5 clinicians participated in two rounds of interactive technology think-out-loud sessions (TOLs) and semi-structured interviews (SSIs) to iteratively develop a four-step, computerized process that collects information on patient goals for meaningful life activities and current level of disability and presents a personalized and prioritized list of preventive recommendations linked to online resources. Analysis of TOLs and SSIs generated 5 categories and 11 sub-categories related to facilitators and barriers to usability and human-technology interaction. The categories included: Understanding the Purpose, Usability, Perceived Value, Literacy, and Participant Motivation. Some categories were inter-connected. The technology was continually and iteratively improved between sessions until saturation of positive feedback was achieved in 4 categories (addressing motivation will require more research). Usability of all screen units of the module was improved substantially. Clinician feedback emphasized the importance of the module's ability to translate the patient-centered HRQoL Report into actionable items for clinicians to facilitate shared decision-making. Complete integration of the HRQoL module into the existing HRA will require further development and testing. Systematic application of user-centered design and human factors principles in technology development and testing may significantly improve the usability and clinical value of health information systems. This more sophisticated approach helped us translate complex clinical concepts, goal-setting steps, and decision-support processes into an accepted and value-added technology.

  7. Progress in developing ultrathin solar cell blanket technology

    NASA Technical Reports Server (NTRS)

    Patterson, R. E.; Mesch, H. G.; Scott-Monck, J.

    1984-01-01

    A program was conducted to develop technologies for welding interconnects to three types of 50-micron-thick, 2 by 2-cm solar cells. Parallel-gap resistance welding was used for interconnect attachment. Weld schedules were independently developed for each of the three cell types and were coincidentally identical. Six 48-cell modules were assembled with 50-micron (nominal) thick cells, frosted fused-silica covers, silver-plated Invar interconnectors, and four different substrate designs. Three modules (one for each cell type) have single-layer Kapton (50-micron-thick) substrates. The other three modules each have a different substrate (Kapton-Kevlar-Kapton, Kapton-graphite-Kapton, and Kapton-graphite-aluminum honeycomb-graphite). All six modules were subjected to 4112 thermal cycles from -175 to 65 C (corresponding to over 40 years of simulated geosynchronous orbit thermal cycling) and experienced only negligible electrical degradation (1.1 percent average of six 48-cell modules).

  8. Understanding the cell-to-module efficiency gap in Cu(In,Ga)(S,Se)2 photovoltaics scale-up

    NASA Astrophysics Data System (ADS)

    Bermudez, Veronica; Perez-Rodriguez, Alejandro

    2018-06-01

    Cu(In,Ga)(S,Se)2 (CIGS) solar cells show record efficiencies comparable to those of crystalline Si-based technologies. Their industrial module production costs are also comparable to those of Si photovoltaics in spite of their much lower production volume. However, the competitiveness of CIGS is compromised by the difference in performance between cell and module scales, known as the cell-to-module efficiency gap, which is significantly higher than in competing industrial photovoltaic technologies. In this Review, we quantify the main cell-to-module efficiency loss mechanisms and discuss the various strategies explored in academia and industry to reduce the efficiency gap: new transparent conductive oxides, hybrid modularization approaches and the use of wide-bandgap solar absorbers in the 1.4-1.5 eV range. To implement these strategies, research gaps relating to various device layers need to be filled.

  9. International Space Station (ISS)

    NASA Image and Video Library

    1997-06-01

    This Boeing photograph shows the Node 1, Unity module, Flight Article (at right) and the U.S. Laboratory module, Destiny, Flight Article for the International Space Station (ISS) being manufactured in the High Bay Clean Room of the Space Station Manufacturing Facility at the Marshall Space Flight Center. The Node 1, or Unity, serves as a cornecting passageway to Space Station modules. The U.S. built Unity module was launched aboard the orbiter Endeavour (STS-88 mission) on December 4, 1998 and connected to the Zarya, the Russian-built Functional Energy Block (FGB). The U.S. Laboratory (Destiny) module is the centerpiece of the ISS, where science experiments will be performed in the near-zero gravity of space. The U.S. Laboratory/Destiny was launched aboard the orbiter Atlantis (STS-98 mission) on February 7, 2001. The ISS is a multidisciplinary laboratory, technology test bed, and observatory that will provide unprecedented undertakings in scientific, technological, and international experimentation.

  10. STS-88 Onboard Photograph - The Unity Module and the Zarya

    NASA Technical Reports Server (NTRS)

    1998-01-01

    This photograph taken during the STS-88 mission, shows the cornected Zarya (top with solar wings) and the Unity Module after having been released from the Orbiter Endeavour's cargo bay. The Unity (also called Node 1), the first U.S. Module for the International Space Station (ISS), is a six-sided connector to which all future U.S. Station modules will attach and was manufactured by the Boeing Company at the Marshall Space Flight Center from 1994 to 1997. The U.S. built Unity module was launched aboard the orbiter Endeavour (STS-88 mission) on December 4, 1998 and connected to the Zarya, the Russian built Functional Energy Block (FGB). The Zarya was launched on a Russian proton rocket prior to the launch of the Unity. The ISS is a multidisciplinary laboratory, technology test bed, and observatory that will provide unprecedented undertakings in scientific, technological, and international experimentation.

  11. STS-88 Onboard Photograph - Unity and Zarya Modules

    NASA Technical Reports Server (NTRS)

    1998-01-01

    This photograph, taken during the STS-88 mission, shows the cornected Unity Module or Node 1 and Zarya or the Functional Cargo Block (FGB) after having been released from the Orbiter Endeavour's cargo bay. The Unity (also called Node 1), the first U.S. Module for the International Space Station (ISS), is a six-sided connector to which all future U.S. Station modules will attach. It was manufactured by the Boeing Company at the Marshall Space Flight Center from 1994 to 1997. The U.S. built Unity Module was launched aboard the orbiter Endeavour (STS-88 mission) on December 4, 1998 and connected to the Zarya, the Russian built Functional Energy Block (FGB). The Zarya was launched on a Russian proton rocket prior to the launch of the Unity. The ISS is a multidisciplinary laboratory, technology test bed, and observatory that will provide unprecedented undertakings in scientific, technological, and international experimentation.

  12. High-Temperature, Wirebondless, Ultracompact Wide Bandgap Power Semiconductor Modules

    NASA Technical Reports Server (NTRS)

    Elmes, John

    2015-01-01

    Silicon carbide (SiC) and other wide bandgap semiconductors offer great promise of high power rating, high operating temperature, simple thermal management, and ultrahigh power density for both space and commercial power electronic systems. However, this great potential is seriously limited by the lack of reliable high-temperature device packaging technology. This Phase II project developed an ultracompact hybrid power module packaging technology based on the use of double lead frames and direct lead frame-to-chip transient liquid phase (TLP) bonding that allows device operation up to 450 degC. The new power module will have a very small form factor with 3-5X reduction in size and weight from the prior art, and it will be capable of operating from 450 degC to -125 degC. This technology will have a profound impact on power electronics and energy conversion technologies and help to conserve energy and the environment as well as reduce the nation's dependence on fossil fuels.

  13. 45 CFR 170.470 - Effect of revocation on the certifications issued to complete EHRs and EHR Modules.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Temporary...

  14. 45 CFR 170.470 - Effect of revocation on the certifications issued to complete EHRs and EHR Modules.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Temporary...

  15. 45 CFR 170.470 - Effect of revocation on the certifications issued to complete EHRs and EHR Modules.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... Human Services HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Temporary...

  16. 45 CFR 170.470 - Effect of revocation on the certifications issued to complete EHRs and EHR Modules.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Temporary...

  17. 45 CFR 170.470 - Effect of revocation on the certifications issued to complete EHRs and EHR Modules.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Temporary...

  18. Nuclear Technology. Course 31: Quality Assurance Practices. Module 31-7, Auditing for Quality Assurance.

    ERIC Educational Resources Information Center

    Pritchard, Jim; Espy, John

    This seventh in a series of eight modules for a course titled Quality Assurance Practices describes the key features of an audit system and offers practice in carrying out tasks of the technicians. The module follows a typical format that includes the following sections: (1) introduction, (2) module prerequisites, (3) objectives, (4) notes to…

  19. Nuclear Technology. Course 27: Metrology. Module 27-4, Angle Measurement Instruments, Optical Projections and Surface Texture Gages.

    ERIC Educational Resources Information Center

    Selleck, Ben; Espy, John

    This fourth in a series of eight modules for a course titled Metrology describes the universal bevel protractor and the sine bar, the engineering microscope and optical projector, and several types of surface texture gages. The module follows a typical format that includes the following sections: (1) introduction, (2) module prerequisites, (3)…

  20. Nuclear Technology. Course 32: Nondestructive Examination (NDE) Techniques II. Module 32-6, Operation of Eddy Current Test Equipment.

    ERIC Educational Resources Information Center

    Espy, John; Selleck, Ben

    This sixth in a series of six modules for a course titled Nondestructive Examination (NDE) Techniques II details eddy current examination of steam generator tubing. The module follows a typical format that includes the following sections: (1) introduction, (2) module prerequisites, (3) objectives, (4) notes to instructor/student, (5) subject…

  1. A Design of a Modular GPHS-Stirling Power System for a Lunar Habitation Module

    NASA Technical Reports Server (NTRS)

    Schmitz, Paul C.; Penswick, L. Barry; Shaltens, Richard K.

    2005-01-01

    Lunar habitation modules need electricity and potentially heat to operate. Because of the low amounts of radiation emitted by General Purpose Heat Source (GPHS) modules, power plants incorporating these as heat sources could be placed in close proximity to habitation modules. A design concept is discussed for a high efficiency power plant based on a GPHS assembly integrated with a Stirling convertor. This system could provide both electrical power and heat, if required, for a lunar habitation module. The conceptual GPHS/Stirling system is modular in nature and made up of a basic 5.5 KWe Stirling convertor/GPHS module assembly, convertor controller/PMAD electronics, waste heat radiators, and associated thermal insulation. For the specific lunar application under investigation eight modules are employed to deliver 40 KWe to the habitation module. This design looks at three levels of Stirling convertor technology and addresses the issues of integrating the Stirling convertors with the GPHS heat sources assembly using proven technology whenever possible. In addition, issues related to the high-temperature heat transport system, power management, convertor control, vibration isolation, and potential system packaging configurations to ensure safe operation during all phases of deployment will be discussed.

  2. Promoter library-based module combination (PLMC) technology for optimization of threonine biosynthesis in Corynebacterium glutamicum.

    PubMed

    Wei, Liang; Xu, Ning; Wang, Yiran; Zhou, Wei; Han, Guoqiang; Ma, Yanhe; Liu, Jun

    2018-05-01

    Due to the lack of efficient control elements and tools, the fine-tuning of gene expression in the multi-gene metabolic pathways is still a great challenge for engineering microbial cell factories, especially for the important industrial microorganism Corynebacterium glutamicum. In this study, the promoter library-based module combination (PLMC) technology was developed to efficiently optimize the expression of genes in C. glutamicum. A random promoter library was designed to contain the putative - 10 (NNTANANT) and - 35 (NNGNCN) consensus motifs, and refined through a three-step screening procedure to achieve numerous genetic control elements with different strength levels, including fluorescence-activated cell sorting (FACS) screening, agar plate screening, and 96-well plate screening. Multiple conventional strategies were employed for further precise characterizations of the promoter library, such as real-time quantitative PCR, sodium dodecyl sulfate polyacrylamide gel electrophoresis, FACS analysis, and the lacZ reporter system. These results suggested that the established promoter elements effectively regulated gene expression and showed varying strengths over a wide range. Subsequently, a multi-module combination technology was created based on the efficient promoter elements for combination and optimization of modules in the multi-gene pathways. Using this technology, the threonine biosynthesis pathway was reconstructed and optimized by predictable tuning expression of five modules in C. glutamicum. The threonine titer of the optimized strain was significantly improved to 12.8 g/L, an approximate 6.1-fold higher than that of the control strain. Overall, the PLMC technology presented in this study provides a rapid and effective method for combination and optimization of multi-gene pathways in C. glutamicum.

  3. An auto-bias control scheme for IQ-modulator with various modulation formats

    NASA Astrophysics Data System (ADS)

    Zhang, Wenqi; Yuan, Xueguang; Zhang, Yang'an

    2016-10-01

    We propose and demonstrate an auto-bias control scheme for the IQ-modulator of a flexible optical PSK or QAM or other modulation formats transmitter in this paper. Due to IQ-modulators usually producing higher-order modulation format, these modulation formats involve phase mostly. It is based on that the bias drift will change the operating point and result in varying the output optical phase. This technology has no restrictions on modulation formats, so it has good flexibility. The experimental result show the three biases can be stabilized when the proposed scheme is implemented.

  4. Combining research-enhanced and technology-enhanced teaching approaches in module design: A case study of an undergraduate course in Solar Physics

    NASA Astrophysics Data System (ADS)

    Tong, V.

    2011-12-01

    There is a growing emphasis on the research-teaching nexus, and there are many innovative ways to incorporate research materials and methods in undergraduate teaching. Solar Physics is a cross-disciplinary subject and offers the ideal opportunity for research-enhanced teaching (1). In this presentation, I outline i) how student-led teaching of research content and methods is introduced in an undergraduate module in Solar Physics, and ii) how electronic learning and teaching can be used to improve students' learning of mathematical concepts in Solar Physics. More specifically, I discuss how research literature reviewing and reporting methods can be embedded and developed systematically throughout the module with aligned assessments. Electronic feedback and feedforward (2) are given to the students in order to enhance their understanding of the subject and improve their research skills. Other technology-enhanced teaching approaches (3) are used to support students' learning of the more quantitative components of the module. This case study is particularly relevant to a wide range of pedagogical contexts (4) as the Solar Physics module is taught to students following undergraduate programs in Geology, Earth Sciences, Environmental Geology as well as Planetary Science with Astronomy in the host Department. Related references: (1) Tong, C. H., Let interdisciplinary research begin in undergraduate years, Nature (2010) v. 463, p. 157. (2) Tong, V. C. H., Linking summative assessments? Electronic feedback and feedforward in module design, British Journal of Educational Technology (2011), accepted for publication. (3) Tong, V. C. H., Using asynchronous electronic surveys to help in-class revision: A case study, British Journal of Educational Technology (2011), doi:10.1111/j.1467-8535.2011.01207.x (4) Tong, V. C. H. (ed.), Geoscience Research and Education, Springer, Dordrecht (2012)

  5. Analysis of Buoyancy Module Auxiliary Installation Technology Based on Numerical Simulation

    NASA Astrophysics Data System (ADS)

    Xu, Songsen; Jiao, Chunshuo; Ning, Meng; Dong, Sheng

    2018-04-01

    To reduce the requirement for lifting capacity and decrease the hoist cable force during the descending and laying process of a subsea production system (SPS), a buoyancy module auxiliary installation technology was proposed by loading buoyancy modules on the SPS to reduce the lifting weight. Two models are established, namely, the SPS lowering-down model and the buoyancy module floating-up model. The main study results are the following: 1) When the buoyancy module enters the water under wave condition, the amplitude of tension fluctuation is twice that when SPS enters water; 2) Under current condition, the displacement of SPS becomes three times larger because of the existence of the buoyancy module; 3) After being released, the velocity of the buoyancy module increases to a large speed rapidly and then reaches a balancing speed gradually. The buoyancy module floats up at a balancing speed and rushes out from the water at a pop-up distance; 4) In deep water, the floating-up velocity of the buoyancy module is related to its mass density and shape, and it is not related to water depth; 5) A drag parachute can reduce floating-up velocity and pop-up distance effectively. Good agreement was found between the simulation and experiment results.

  6. Laboratory evaluation of advanced battery technologies for electric vehicle applications

    NASA Astrophysics Data System (ADS)

    Deluca, W. H.; Kulaga, J. E.; Hogrefe, R. L.; Tummilo, A. F.; Webster, C. E.

    1989-03-01

    During 1988, battery technology evaluations were performed for the Department of Energy and Electric Power Research Institute at the Argonne Analysis and Diagnostic Laboratory. Cells and multicell modules from four developers were examined to determine their performance and life characteristics for electric vehicle propulsion applications. The results provide an interim measure of the progress being made in battery R and D programs, a comparison of battery technologies, and a source of basic data for modeling and continuing R and D. This paper summarizes the performance and life characterizations of twelve single cells and six 3- to 24-cell modules that encompass four technologies (Na/S, Ni/Fe, lead-acid, and Fe/Air).

  7. The Node 1 (or Unity) Module for the International Space Station

    NASA Technical Reports Server (NTRS)

    1997-01-01

    This photograph, taken by the Boeing Company, shows Node 1 (also called Unity), the first U.S. Module for the International Space Station (ISS), with its hatch door installed. The Node 1, or Unity, serves as a cornecting passageway to Space Station modules and was manufactured by the Boeing Company at the Marshall Space Flight Center from 1994 to 1997. The U.S. built Unity module was launched aboard the orbiter Endeavour (STS-88 mission) on December 4, 1998 and connected to the Zarya, the Russian-built Functional Energy Block (FGB). The Zarya was launched on a Russian proton rocket prior to the launch of the Unity. The ISS is a multidisciplinary laboratory, technology test bed, and observatory that will provide unprecedented undertakings in scientific, technological, and international experimentation.

  8. Modulated Chlorophyll "a" Fluorescence: A Tool for Teaching Photosynthesis

    ERIC Educational Resources Information Center

    Marques da Silva, Jorge; Bernardes da Silva, Anabela; Padua, Mario

    2007-01-01

    "In vivo" chlorophyll "a" fluorescence is a key technique in photosynthesis research. The recent release of a low cost, commercial, modulated fluorometer enables this powerful technology to be used in education. Modulated chlorophyll a fluorescence measurement "in vivo" is here proposed as a tool to demonstrate basic…

  9. Programming Programmable Logic Controller. High-Technology Training Module.

    ERIC Educational Resources Information Center

    Lipsky, Kevin

    This training module on programming programmable logic controllers (PLC) is part of the memory structure and programming unit used in a packaging systems equipment control course. In the course, students assemble, install, maintain, and repair industrial machinery used in industry. The module contains description, objectives, content outline,…

  10. New technologies for managing cotton modules

    USDA-ARS?s Scientific Manuscript database

    New cotton harvesters with the ability to form seed cotton modules have changed the way that cotton is stored and handled before ginning. Cylindrical or “round” modules formed by John Deere cotton pickers and strippers are wrapped in three layers of plastic material to protect the cotton and mainta...

  11. Ultrafast Modulation and Switching of Quantum-Well Lasers using Terahertz Fields

    NASA Technical Reports Server (NTRS)

    Ning, Cun-Zheng; Hughes, S.; Citrin, D.; Saini, Subhash (Technical Monitor)

    1998-01-01

    Modulation and switching of semiconductor lasers are important for laser-based information technology. Typically the speed of modulation and switching is limited by interband processes such as stimulated and spontaneous recombinations which occur on a nanosecond time scale. This is why the diode laser modulation has been restricted to tens of GHz. Modulation at higher speed is highly desirable as the information technology enters into the so-called tera-era. In this paper, we study the possibility of utilizing THz-field-induced plasma heating to modulate quantum-well lasers. This is a timely study since, with the advancement of THz solid-state sources and free-electron lasers, THz physics and related technology is currently coming out of its infancy. The investigation of interplaying THz and optical fields is also of intruiging fundamental interest. First, we introduce theoretical plasma heating results for the quantum-well optical amplifier in the presense of an intense half-cycle THz pulse. The heated carrier distributions are then utilized to calculate the THz-pulse-induced change in refractive index and gain profile. Since the electron-hole-plasma is heated using intraband transitions, we circumvent the usual complications due to an overall change in density, and the nonlinear recovery is governed solely by the carrier-LO-phonon interactions, typically 5 ps for a complete recovery. This procedure implies THz and sub-THz switching and recovery rates, respectively; using either gain modulation or index modulation. Plasma heating via steady-state THz fields is also studied. Finally, numerical simulation of a coupled set of equations to investigate the THz modulation based on a simplified model for quantum-well lasers is presented. Our results show that a semiconductor laser can be modulated at up to 1 THz with little distortion with a THz field amplitude at the order of a few kV/cm. Laser responses to a change in THz frequency will be shown. Constraints, practicalities, and applications will be discussed.

  12. Thin-film reliability and engineering overview

    NASA Technical Reports Server (NTRS)

    Ross, R. G., Jr.

    1984-01-01

    The reliability and engineering technology base required for thin film solar energy conversions modules is discussed. The emphasis is on the integration of amorphous silicon cells into power modules. The effort is being coordinated with SERI's thin film cell research activities as part of DOE's Amorphous Silicon Program. Program concentration is on temperature humidity reliability research, glass breaking strength research, point defect system analysis, hot spot heating assessment, and electrical measurements technology.

  13. Thin-film reliability and engineering overview

    NASA Astrophysics Data System (ADS)

    Ross, R. G., Jr.

    1984-10-01

    The reliability and engineering technology base required for thin film solar energy conversions modules is discussed. The emphasis is on the integration of amorphous silicon cells into power modules. The effort is being coordinated with SERI's thin film cell research activities as part of DOE's Amorphous Silicon Program. Program concentration is on temperature humidity reliability research, glass breaking strength research, point defect system analysis, hot spot heating assessment, and electrical measurements technology.

  14. Phase 1 of the automated array assembly task of the low cost silicon solar array project

    NASA Technical Reports Server (NTRS)

    Coleman, M. G.; Pryor, R. A.; Grenon, L. A.; Lesk, I. A.

    1977-01-01

    The state of technology readiness for the automated production of solar cells and modules is reviewed. Individual process steps and process sequences for making solar cells and modules were evaluated both technically and economically. High efficiency with a suggested cell goal of 15% was stressed. It is concluded that the technology exists to manufacture solar cells which will meet program goals.

  15. Development of an Autonomous Broadband Acoustic Scattering System for Remote Characterization of Zooplankton

    DTIC Science & Technology

    2008-01-01

    backscatter at a single narrowband frequency, and some AUVs carry single-frequency sidescan sonars (and this technology has been adapted for gliders), the...broadband acoustic scattering system by adapting existing technology that has been recently developed at WHOI for a monostatic Doppler sonar module...broadband acoustic backscattering system: 1) Modifications to the monostatic Doppler sonar module, recently developed at WHOI for turbulence studies

  16. Emerging photovoltaic module technologies at PVUSA: A five-year assessment

    NASA Astrophysics Data System (ADS)

    Townsend, Tim

    1995-04-01

    The Photovoltaics for Utility Scale Applications (PVUSA) project tests two types of photovoltaic systems: new modules fielded as 20-kW emerging module technology (EMT) arrays, and more mature technologies fielded as 20- to 500-kW turnkey utility scale (US) systems. This report summarizes experiences of the PVUSA project in operating the first six 20-kW EMT photovoltaic systems. Five systems are installed at Davis, California, and one at Kihei, Hawaii. Products selected for testing and demonstration were judged to have potential for significant technical advancement or reduction in manufacturing cost. Features leading to selection of each system and findings over the average 5 years of operation are compared in the report. Factory product qualification test experiences along with field acceptance test results are documented. Evaluation includes a broad range of performance parameters, including long-term efficiency, seasonal generation patterns, and maintenance. While some of the arrays have operated as well as any commercial system, others have fared poorly. Throughout the procurement and operation of these precommercial PV modules, PVUSA has provided feedback to vendors, critical for product improvement. The data and evaluations in this report will be of further benefit to manufacturers and provide general comparative information on a variety of technologies to researchers in utilities, government, and industry alike.

  17. Multi-purpose greenhouse of changeable geometry (MGCG)

    NASA Astrophysics Data System (ADS)

    Kordium, V.; Kornejchuk, A.

    In the frames of scientific program of National Cosmic Agency of Ukraine the multipurpose greenhouse is being developed. It is destined for the performance of biological and biotechnological experiments as well as for planting of fast growing vegetable cultures for crew ration enrichment and positive psychological influence under the conditions of long-term flight in the international space station or in other cosmic flying objects. Main principle of greenhouse arrangement is the existence of unified modules. Their sets and combinations permit to form executively different space greenhouse configurations. The minimal structural greenhouse unit suitable either for construction of total configuration or for autonomous functioning, is a carrying composite platform (CCP). The experimental vegetative module (EVM) and the module, supporting microclimate needed inside EVM, are launched to CCP. The amount of these modules and their configuration depend on quantity and complexity of tasks to be solved as well as on duration of their performance. These modules form the experimental block. Four modules of much larger sizes, which form experimentally technological block, are used for further studies of objectives approved in the experimental block. The technologies developed for growing plants are used in the third, technological block, which is a one large vegetative module. All three greenhouse blocks can be changed in their sizes in three dimensions, and function either in a complete greenhouse structure, or autonomously. The control is performed from a board computer, or, if necessary, it is governed with automation devices placed on a front panel of blocks. All three blocks are pulled out along the directing base into the station passage, and this makes free access to the base modules, convenient work with them, and à good survey.

  18. Recommendations for the development of e-modules for the continuing professional development of European dentists.

    PubMed

    Kavadella, A; Kossioni, A E; Tsiklakis, K; Cowpe, J; Bullock, A; Barnes, E; Bailey, S; Thomas, H; Thomas, R; Karaharju-Suvanto, T; Suomalainen, K; Kersten, H; Povel, E; Giles, M; Walmsley, D; Soboleva, U; Liepa, A; Akota, I

    2013-05-01

    To provide evidence-based and peer-reviewed recommendations for the development of dental continuing professional development (CPD) learning e-modules. The present recommendations are consensus recommendations of the DentCPD project team and were informed by a literature research, consultations from e-learning and IT expert, discussions amongst the participants attending a special interest group during the 2012 ADEE meeting, and feedback from the evaluation procedures of the exemplar e-module (as described in a companion paper within this Supplement). The main focus of these recommendations is on the courses and modules organised and offered by dental schools. E-modules for dental CPD, as well as for other health professionals' continuing education, have been implemented and evaluated for a number of years. Research shows that the development of e-modules is a team process, undertaken by academics, subject experts, pedagogists, IT and web designers, learning technologists and librarians. The e-module must have clear learning objectives (outcomes), addressing the learners' individual needs, and must be visually attractive, relevant, interactive, promoting critical thinking and providing feedback. The text, graphics and animations must support the objectives and enable the learning process by creating an attractive, easy to navigate and interactive electronic environment. Technology is usually a concern for learners and tutors; therefore, it must be kept simple and interoperable within different systems and software. The pedagogical and technological proficiency of educators is of paramount importance, yet remains a challenge in many instances. The development of e-courses and modules for dental CPD is an endeavour undertaken by a group of professionals. It must be underpinned by sound pedagogical and e-learning principles and must incorporate elements for effective visual learning and visual design and a simple, consistent technology. © 2013 John Wiley & Sons A/S.

  19. Indoor Unmanned Airship System Airborne Control Module Design

    NASA Astrophysics Data System (ADS)

    YongXia, Gao; YiBo, Li

    By adopting STC12C5A60S2 SCM as a system control unit, assisted by appropriate software and hardware resources, we complete the airborne control module's design of unmanned airship system. This paper introduces hardware control module's structure, airship-driven composition and software realization. Verified by the China Science and Technology Museum special-shaped airship,this control module can work well.

  20. High Frequency Alternator, Power Frequency Conversion (HFA-PFC) Technology for Lightweight Tactical Power Generation

    DTIC Science & Technology

    1995-09-22

    Modules 345-800 Amperes/400-3000 Votts - Current and Thermal Ratings of Module * Circuit Currents Element Data Model* Current Thermal Units...IGBTs modules (Powerex) 56 Main components for rectifiers, Diode Bridge modules (Powerex) 65 Heat Sinks (Aavid Engineering) 85 Westinghouse...exciter circuit , are not reliable enough for military applications, and they were replaced by brushless alternators. The brushless AC alternator

  1. Module encapsulation technology

    NASA Technical Reports Server (NTRS)

    Willis, P.

    1986-01-01

    The identification and development techniques for low-cost module encapsulation materials were reviewed. Test results were displayed for a variety of materials. The improved prospects for modeling encapsulation systems for life prediction were reported.

  2. Packaging of ferroelectric liquid crystal-on-silicon spatial light modulators

    NASA Astrophysics Data System (ADS)

    Lin, W.; Morozova, Nina D.; Ju, TehHua; Zhang, Weidong; Lee, Yung-Cheng; McKnight, Douglas J.; Johnson, Kristina M.

    1996-11-01

    A self-pulling soldering technology has been demonstrated for assembling liquid crystal on silicon (LCOS) spatial light modulators (SLMs). One of the major challenges in manufacturing the LCOS modules is to reproducibly control the thickness of the gap between the very large scale integrated circuit (VLSI) chip and the cover glass. The liquid crystal material is sandwiched between the VLSI chop and the cover glass which is coated with a transparent conductor. Solder joints with different profiles and sizes have been designed to provide surface tension forces to control the gap accommodating the ferroelectric liquid crystal layer in the range of a micron level with sub- micron uniformity. The optimum solder joint design is defined as a joint that results in the maximum pulling force. This technology provides an automatic, batch assembly process for a LCOS SLM through one reflow process. Fluxless soldering technology is used to assemble the module. This approach avoids residues from chemical of flux and oxides, and eliminates potential contamination to the device. Two different LCOS SLM designs and the process optimization are described.

  3. Design and construction of a VHGT-attached WDM-type triplex transceiver module using polymer PLC hybrid integration technology

    NASA Astrophysics Data System (ADS)

    Jerábek, Vitezslav; Hüttel, Ivan; Prajzler, Václav; Busek, K.; Seliger, P.

    2008-11-01

    We report about design and construction of the bidirectional transceiver TRx module for subscriber part of the passive optical network PON for a fiber to the home FTTH topology. The TRx module consists of a epoxy novolak resin polymer planar lightwave circuit (PLC) hybrid integration technology with volume holographic grating triplex filter VHGT, surface-illuminated photodetectors and spot-size converted Fabry-Pérot laser diode in SMD package. The hybrid PLC has composed from a two parts-polymer optical waveguide including VHGT filter section and a optoelectronic microwave section. The both parts are placed on the composite substrate.

  4. Teaching "Digital Earth" technologies in Environmental Sciences

    NASA Astrophysics Data System (ADS)

    Griffiths, J. A.

    2014-04-01

    As part of a review process for a module entitled "Digital Earth" which is currently taught as part of a BSc in Environmental Sciences program, research into the current provision of Geographical Information Science and Technology (GIS&T) related modules on UKbased Environmental Science degrees is made. The result of this search is used with DiBiase et al. (2006) "Body of Knowledge of GIS&T" to develop a foundation level module for Environmental Sciences. Reference is also made to the current provision geospatial analysis techniques in secondary and tertiary education in the UK, US and China, and the optimal use of IT and multimedia in geo-education.

  5. Physiologically Modulating Videogames or Simulations which Use Motion-Sensing Input Devices

    NASA Technical Reports Server (NTRS)

    Blanson, Nina Marie (Inventor); Stephens, Chad L. (Inventor); Pope, Alan T. (Inventor)

    2017-01-01

    New types of controllers allow a player to make inputs to a video game or simulation by moving the entire controller itself or by gesturing or by moving the player's body in whole or in part. This capability is typically accomplished using a wireless input device having accelerometers, gyroscopes, and a camera. The present invention exploits these wireless motion-sensing technologies to modulate the player's movement inputs to the videogame based upon physiological signals. Such biofeedback-modulated video games train valuable mental skills beyond eye-hand coordination. These psychophysiological training technologies enhance personal improvement, not just the diversion, of the user.

  6. LCoS-SLM technology based on Digital Electro-optics Platform and using in dynamic optics for application development

    NASA Astrophysics Data System (ADS)

    Tsai, Chun-Wei; Wang, Chen; Lyu, Bo-Han; Chu, Chen-Hsien

    2017-08-01

    Digital Electro-optics Platform is the main concept of Jasper Display Corp. (JDC) to develop various applications. These applications are based on our X-on-Silicon technologies, for example, X-on-Silicon technologies could be used on Liquid Crystal on Silicon (LCoS), Micro Light-Emitting Diode on Silicon (μLEDoS), Organic Light-Emitting Diode on Silicon (OLEDoS), and Cell on Silicon (CELLoS), etc. LCoS technology is applied to Spatial Light Modulator (SLM), Dynamic Optics, Wavelength Selective Switch (WSS), Holographic Display, Microscopy, Bio-tech, 3D Printing and Adaptive Optics, etc. In addition, μLEDoS technology is applied to Augmented Reality (AR), Head Up Display (HUD), Head-mounted Display (HMD), and Wearable Devices. Liquid Crystal on Silicon - Spatial Light Modulator (LCoSSLM) based on JDC's On-Silicon technology for both amplitude and phase modulation, have an expanding role in several optical areas where light control on a pixel-by-pixel basis is critical for optimum system performance. Combination of the advantage of hardware and software, we can establish a "dynamic optics" for the above applications or more. Moreover, through the software operation, we can control the light more flexible and easily as programmable light processor.

  7. Study of Multimission Modular Spacecraft (MMS) propulsion requirements

    NASA Technical Reports Server (NTRS)

    Fischer, N. H.; Tischer, A. E.

    1977-01-01

    The cost effectiveness of various propulsion technologies for shuttle-launched multimission modular spacecraft (MMS) missions was determined with special attention to the potential role of ion propulsion. The primary criterion chosen for comparison for the different types of propulsion technologies was the total propulsion related cost, including the Shuttle charges, propulsion module costs, upper stage costs, and propulsion module development. In addition to the cost comparison, other criteria such as reliability, risk, and STS compatibility are examined. Topics covered include MMS mission models, propulsion technology definition, trajectory/performance analysis, cost assessment, program evaluation, sensitivity analysis, and conclusions and recommendations.

  8. Concentrator photovoltaic module architectures with capabilities for capture and conversion of full global solar radiation

    PubMed Central

    Lee, Kyu-Tae; Yao, Yuan; He, Junwen; Fisher, Brent; Sheng, Xing; Lumb, Matthew; Xu, Lu; Anderson, Mikayla A.; Scheiman, David; Han, Seungyong; Kang, Yongseon; Gumus, Abdurrahman; Bahabry, Rabab R.; Lee, Jung Woo; Paik, Ungyu; Bronstein, Noah D.; Alivisatos, A. Paul; Meitl, Matthew; Burroughs, Scott; Hussain, Muhammad Mustafa; Lee, Jeong Chul; Nuzzo, Ralph G.; Rogers, John A.

    2016-01-01

    Emerging classes of concentrator photovoltaic (CPV) modules reach efficiencies that are far greater than those of even the highest performance flat-plate PV technologies, with architectures that have the potential to provide the lowest cost of energy in locations with high direct normal irradiance (DNI). A disadvantage is their inability to effectively use diffuse sunlight, thereby constraining widespread geographic deployment and limiting performance even under the most favorable DNI conditions. This study introduces a module design that integrates capabilities in flat-plate PV directly with the most sophisticated CPV technologies, for capture of both direct and diffuse sunlight, thereby achieving efficiency in PV conversion of the global solar radiation. Specific examples of this scheme exploit commodity silicon (Si) cells integrated with two different CPV module designs, where they capture light that is not efficiently directed by the concentrator optics onto large-scale arrays of miniature multijunction (MJ) solar cells that use advanced III–V semiconductor technologies. In this CPV+ scheme (“+” denotes the addition of diffuse collector), the Si and MJ cells operate independently on indirect and direct solar radiation, respectively. On-sun experimental studies of CPV+ modules at latitudes of 35.9886° N (Durham, NC), 40.1125° N (Bondville, IL), and 38.9072° N (Washington, DC) show improvements in absolute module efficiencies of between 1.02% and 8.45% over values obtained using otherwise similar CPV modules, depending on weather conditions. These concepts have the potential to expand the geographic reach and improve the cost-effectiveness of the highest efficiency forms of PV power generation. PMID:27930331

  9. Concentrator photovoltaic module architectures with capabilities for capture and conversion of full global solar radiation

    DOE PAGES

    Lee, Kyu-Tae; Yao, Yuan; He, Junwen; ...

    2016-12-05

    Emerging classes ofconcentrator photovoltaic (CPV) modules reach efficiencies that are far greater than those of even the highest performance flat-plate PV technologies, with architectures that have the potential to provide the lowest cost of energy in locations with high direct normal irradiance (DNI). A disadvantage is their inability to effectively use diffuse sunlight, thereby constraining widespread geographic deployment and limiting performance even under the most favorable DNI conditions. This study introduces a module design that integrates capabilities in flat-plate PV directly with the most sophisticated CPV technologies, for capture of both direct and diffuse sunlight, thereby achieving efficiency in PVmore » conversion of the global solar radiation. Specific examples of this scheme exploit commodity silicon (Si) cells integrated with two different CPV module designs, where they capture light that is not efficiently directed by the concentrator optics onto large-scale arrays of miniature multijunction (MJ) solar cells that use advanced III-V semiconductor technologies. In this CPV + scheme ("+" denotes the addition of diffuse collector), the Si and MJ cells operate independently on indirect and direct solar radiation, respectively. On-sun experimental studies of CPV + modules at latitudes of 35.9886° N (Durham, NC), 40.1125° N (Bondville, IL), and 38.9072° N (Washington, DC) show improvements in absolute module efficiencies of between 1.02% and 8.45% over values obtained using otherwise similar CPV modules, depending on weather conditions. These concepts have the potential to expand the geographic reach and improve the cost-effectiveness of the highest efficiency forms of PV power generation.« less

  10. Concentrator photovoltaic module architectures with capabilities for capture and conversion of full global solar radiation

    NASA Astrophysics Data System (ADS)

    Lee, Kyu-Tae; Yao, Yuan; He, Junwen; Fisher, Brent; Sheng, Xing; Lumb, Matthew; Xu, Lu; Anderson, Mikayla A.; Scheiman, David; Han, Seungyong; Kang, Yongseon; Gumus, Abdurrahman; Bahabry, Rabab R.; Lee, Jung Woo; Paik, Ungyu; Bronstein, Noah D.; Alivisatos, A. Paul; Meitl, Matthew; Burroughs, Scott; Mustafa Hussain, Muhammad; Lee, Jeong Chul; Nuzzo, Ralph G.; Rogers, John A.

    2016-12-01

    Emerging classes of concentrator photovoltaic (CPV) modules reach efficiencies that are far greater than those of even the highest performance flat-plate PV technologies, with architectures that have the potential to provide the lowest cost of energy in locations with high direct normal irradiance (DNI). A disadvantage is their inability to effectively use diffuse sunlight, thereby constraining widespread geographic deployment and limiting performance even under the most favorable DNI conditions. This study introduces a module design that integrates capabilities in flat-plate PV directly with the most sophisticated CPV technologies, for capture of both direct and diffuse sunlight, thereby achieving efficiency in PV conversion of the global solar radiation. Specific examples of this scheme exploit commodity silicon (Si) cells integrated with two different CPV module designs, where they capture light that is not efficiently directed by the concentrator optics onto large-scale arrays of miniature multijunction (MJ) solar cells that use advanced III-V semiconductor technologies. In this CPV+ scheme (“+” denotes the addition of diffuse collector), the Si and MJ cells operate independently on indirect and direct solar radiation, respectively. On-sun experimental studies of CPV+ modules at latitudes of 35.9886° N (Durham, NC), 40.1125° N (Bondville, IL), and 38.9072° N (Washington, DC) show improvements in absolute module efficiencies of between 1.02% and 8.45% over values obtained using otherwise similar CPV modules, depending on weather conditions. These concepts have the potential to expand the geographic reach and improve the cost-effectiveness of the highest efficiency forms of PV power generation.

  11. Study on a low complexity adaptive modulation algorithm in OFDM-ROF system with sub-carrier grouping technology

    NASA Astrophysics Data System (ADS)

    Liu, Chong-xin; Liu, Bo; Zhang, Li-jia; Xin, Xiang-jun; Tian, Qing-hua; Tian, Feng; Wang, Yong-jun; Rao, Lan; Mao, Yaya; Li, Deng-ao

    2018-01-01

    During the last decade, the orthogonal frequency division multiplexing radio-over-fiber (OFDM-ROF) system with adaptive modulation technology is of great interest due to its capability of raising the spectral efficiency dramatically, reducing the effects of fiber link or wireless channel, and improving the communication quality. In this study, according to theoretical analysis of nonlinear distortion and frequency selective fading on the transmitted signal, a low-complexity adaptive modulation algorithm is proposed in combination with sub-carrier grouping technology. This algorithm achieves the optimal performance of the system by calculating the average combined signal-to-noise ratio of each group and dynamically adjusting the origination modulation format according to the preset threshold and user's requirements. At the same time, this algorithm takes the sub-carrier group as the smallest unit in the initial bit allocation and the subsequent bit adjustment. So, the algorithm complexity is only 1 /M (M is the number of sub-carriers in each group) of Fischer algorithm, which is much smaller than many classic adaptive modulation algorithms, such as Hughes-Hartogs algorithm, Chow algorithm, and is in line with the development direction of green and high speed communication. Simulation results show that the performance of OFDM-ROF system with the improved algorithm is much better than those without adaptive modulation, and the BER of the former achieves 10e1 to 10e2 times lower than the latter when SNR values gets larger. We can obtain that this low complexity adaptive modulation algorithm is extremely useful for the OFDM-ROF system.

  12. Concentrator photovoltaic module architectures with capabilities for capture and conversion of full global solar radiation.

    PubMed

    Lee, Kyu-Tae; Yao, Yuan; He, Junwen; Fisher, Brent; Sheng, Xing; Lumb, Matthew; Xu, Lu; Anderson, Mikayla A; Scheiman, David; Han, Seungyong; Kang, Yongseon; Gumus, Abdurrahman; Bahabry, Rabab R; Lee, Jung Woo; Paik, Ungyu; Bronstein, Noah D; Alivisatos, A Paul; Meitl, Matthew; Burroughs, Scott; Hussain, Muhammad Mustafa; Lee, Jeong Chul; Nuzzo, Ralph G; Rogers, John A

    2016-12-20

    Emerging classes of concentrator photovoltaic (CPV) modules reach efficiencies that are far greater than those of even the highest performance flat-plate PV technologies, with architectures that have the potential to provide the lowest cost of energy in locations with high direct normal irradiance (DNI). A disadvantage is their inability to effectively use diffuse sunlight, thereby constraining widespread geographic deployment and limiting performance even under the most favorable DNI conditions. This study introduces a module design that integrates capabilities in flat-plate PV directly with the most sophisticated CPV technologies, for capture of both direct and diffuse sunlight, thereby achieving efficiency in PV conversion of the global solar radiation. Specific examples of this scheme exploit commodity silicon (Si) cells integrated with two different CPV module designs, where they capture light that is not efficiently directed by the concentrator optics onto large-scale arrays of miniature multijunction (MJ) solar cells that use advanced III-V semiconductor technologies. In this CPV + scheme ("+" denotes the addition of diffuse collector), the Si and MJ cells operate independently on indirect and direct solar radiation, respectively. On-sun experimental studies of CPV + modules at latitudes of 35.9886° N (Durham, NC), 40.1125° N (Bondville, IL), and 38.9072° N (Washington, DC) show improvements in absolute module efficiencies of between 1.02% and 8.45% over values obtained using otherwise similar CPV modules, depending on weather conditions. These concepts have the potential to expand the geographic reach and improve the cost-effectiveness of the highest efficiency forms of PV power generation.

  13. Resources in Technology 7.

    ERIC Educational Resources Information Center

    International Technology Education Association, Reston, VA.

    This volume of Resources in Technology contains the following eight instructional modules: (1) "Processing Technology"; (2) "Water--A Magic Resource"; (3) "Hazardous Waste Disposal--The NIMBY (Not in My Backyard) Syndrome"; (4) "Processing Fibers and Fabrics"; (5) "Robotics--An Emerging…

  14. Space Shuttle Projects

    NASA Image and Video Library

    1995-11-01

    This is a view of the Russian Mir Space Station photographed by a crewmember of the second Shuttle/Mir docking mission, STS-74. The image shows: top - Progress supply vehicle, Kvant-1 module, and the Core module; middle left - Spektr module; middle center - Kristall module and Docking module; middle right - Kvant-2 module; and bottom - Soyuz. The Progress was an unmarned, automated version of the Soyuz crew transfer vehicle, designed to resupply the Mir. The Kvant-1 provided research in the physics of galaxies, quasars, and neutron stars by measuring electromagnetic spectra and x-ray emissions. The Core module served as the heart of the space station and contained the primary living and working areas, life support, and power, as well as the main computer, communications, and control equipment. The Spektr module provided Earth observation. It also supported research into biotechnology, life sciences, materials science, and space technologies. American astronauts used the Spektr as their living quarters. A main purpose of the Kristall module was to develop biological and materials production technologies in the space environment. The Docking module made it possible for the Space Shuttle to dock easily with the Mir. Kvant-2 was a scientific and airlock module, providing biological research, Earth observations, and EVA (extravehicular activity) capability. The Soyuz typically ferried three crewmembers to and from the Mir. The journey of the 15-year-old Russian Mir Space Station ended March 23, 2001, as the Mir re-entered the Earth's atmosphere and fell into the south Pacific Ocean.

  15. Ecology of Flows and Drift Wave Turbulence: Reduced Models and Applications

    NASA Astrophysics Data System (ADS)

    Huang, Wen-Hsi

    A major obstacle to sustainable solar technologies is end-of-life solar modules. In this thesis, a recycling process is proposed for crystalline-Si solar modules. It is a three-step process to break down Si modules and recover various materials. Over 95% of a module by weight can be recovered with this process. Two new technologies are demonstrated to enable the proposed recycling process. One is sequential electrowinning which allows multiple metals to be recovered one by one from Si modules, Ag, Pb, Sn and Cu. The other is sheet resistance monitoring by the 4-point probe which maximizes the amount of solar-grade Si recovered from Si modules with high throughput. The purity of the recovered metals is above 99% and the recovery rate can achieve between 70 80%. The recovered Si meets the specifications for solar-grade Si and at least 91% of Si from c-Si solar cells can be recovered. The recovered Si and metals are new feedstocks to the solar industry and generate over $12/module in revenue. This revenue enables a profitable recycling business for Si modules without any government support. The chemicals for recycling are carefully selected to minimize their environmental impact and also the cost. A network for collecting end-of-life solar modules is proposed based on the current distribution network for solar modules to contain the collection cost. As a result, the proposed recycling process for c-Si modules is technically, environmentally and financially sustainable.

  16. The PHM-Ethics methodology: interdisciplinary technology assessment of personal health monitoring.

    PubMed

    Schmidt, Silke; Verweij, Marcel

    2013-01-01

    The contribution briefly introduces the PHM Ethics project and the PHM methodology. Within the PHM-Ethics project, a set of tools and modules had been developed that may assist in the evaluation and assessment of new technologies for personal health monitoring, referred to as "PHM methodology" or "PHM toolbox". An overview on this interdisciplinary methodology and its comprising modules is provided, areas of application and intended target groups are indicated.

  17. Hybrid-integrated coherent receiver using silica-based planar lightwave circuit technology

    NASA Astrophysics Data System (ADS)

    Kim, Jong-Hoi; Choe, Joong-Seon; Choi, Kwang-Seong; Youn, Chun-Ju; Kim, Duk-Jun; Jang, Sun-Hyok; Kwon, Yong-Hwan; Nam, Eun-Soo

    2011-12-01

    A hybrid-integrated coherent receiver module has been achieved using flip-chip bonding technology, consisting of a silica-based 90°-hybrid planar lightwave circuit (PLC) platform, a spot-size converter integrated waveguide photodiode (SSC-WG-PD), and a dual-channel transimpedance amplifier (TIA). The receiver module shows error-free operation up to 40Gb/s and OSNR sensitivity of 11.5 dB for BER = 10-3 at 25 Gb/s.

  18. Stability issues pertaining large area perovskite and dye-sensitized solar cells and modules

    NASA Astrophysics Data System (ADS)

    Castro-Hermosa, S.; Yadav, S. K.; Vesce, L.; Guidobaldi, A.; Reale, A.; Di Carlo, A.; Brown, T. M.

    2017-01-01

    Perovskite and dye-sensitized solar cells are PV technologies which hold promise for PV application. Arguably, the biggest issue facing these technologies is stability. The vast majority of studies have been limited to small area laboratory cells. Moisture, oxygen, UV light, thermal and electrical stresses are leading the degradation causes. There remains a shortage of stability investigations on large area devices, in particular modules. At the module level there exist particular challenges which can be different from those at the small cell level such as encapsulation (not only of the unit cells but of interconnections and contacts), non-uniformity of the layer stacks and unit cells, reverse bias stresses, which are important to investigate for technologies that aim for industrial acceptance. Herein we present a review of stability investigations published in the literature pertaining large area perovskite and dye-sensitized solar devices fabricated both on rigid (glass) and flexible substrates.

  19. A Sign Language Screen Reader for Deaf

    NASA Astrophysics Data System (ADS)

    El Ghoul, Oussama; Jemni, Mohamed

    Screen reader technology has appeared first to allow blind and people with reading difficulties to use computer and to access to the digital information. Until now, this technology is exploited mainly to help blind community. During our work with deaf people, we noticed that a screen reader can facilitate the manipulation of computers and the reading of textual information. In this paper, we propose a novel screen reader dedicated to deaf. The output of the reader is a visual translation of the text to sign language. The screen reader is composed by two essential modules: the first one is designed to capture the activities of users (mouse and keyboard events). For this purpose, we adopted Microsoft MSAA application programming interfaces. The second module, which is in classical screen readers a text to speech engine (TTS), is replaced by a novel text to sign (TTSign) engine. This module converts text into sign language animation based on avatar technology.

  20. A 30 GHz monolithic receive module technology assessment

    NASA Technical Reports Server (NTRS)

    Geddes, J.; Sokolov, V.; Bauhahn, P.; Contolatis, T.

    1988-01-01

    This report is a technology assessment relevant to the 30 GHz Monolithic Receive Module development. It is based on results obtained on the present NASA Contract (NAS3-23356) as well as on information gathered from literature and other industry sources. To date the on-going Honeywell program has concentrated on demonstrating the so-called interconnected receive module which consists of four monolithic chips - the low noise front-end amplifier (LNA), the five bit phase shifter (PS), the gain control amplifier (GC), and the RF to IF downconverter (RF/IF). Results on all four individual chips have been obtained and interconnection of the first three functions has been accomplished. Future work on this contract is aimed at a higher level of integration, i.e., integration of the first three functions (LNA + PS + GC) on a single GaAs chip. The report presents the status of this technology and projections of its future directions.

  1. Nuclear Technology. Course 28: Welding Inspection. Module 28-10, Records.

    ERIC Educational Resources Information Center

    Espy, John

    This tenth in a series of ten modules for a course titled Welding Inspection describes records associated with welding which serve three functions: specification of agreements, initiation of action in fulfillment of agreement, and historical evidence of action taken. The module follows a typical format that includes the following sections: (1)…

  2. Sigmund Freud's Personality Theory: Learning Module Employing Computer-Assisted Instruction Technology.

    ERIC Educational Resources Information Center

    Saavedra, Jose M.

    This interactive module contains 33 windows of text and three graphics, in which Freud's topographical (unconscious, pre-conscious, and conscious) and structural (id, ego, and superego) models of the psyche are studied. Seventeen fill-in questions are interspersed within the text. The module stresses the importance of comprehending the concept of…

  3. Nuclear Technology. Course 30: Mechanical Inspection. Module 30-2, Pump Functional Testing.

    ERIC Educational Resources Information Center

    Wasel, Ed; Espy, John

    This second in a series of eight modules for a course titled Mechanical Inspection describes typical pump functional tests which are performed after pump installation and prior to release of the plant for unrestricted power operation. The module follows a typical format that includes the following sections: (1) introduction, (2) module…

  4. Nuclear Technology. Course 27: Metrology. Module 27-5, Tolerancing.

    ERIC Educational Resources Information Center

    Selleck, Ben; Espy, John

    This fifth in a series of eight modules for a course titled Metrology describes the application of the American National Standard (ANSI Y14.5-1973) for dimensioning and tolerancing and gives guidance on interpreting form and location controls consistent with the national standard. The module follows a typical format that includes the following…

  5. The Human Genome Project: Biology, Computers, and Privacy.

    ERIC Educational Resources Information Center

    Cutter, Mary Ann G.; Drexler, Edward; Gottesman, Kay S.; Goulding, Philip G.; McCullough, Laurence B.; McInerney, Joseph D.; Micikas, Lynda B.; Mural, Richard J.; Murray, Jeffrey C.; Zola, John

    This module, for high school teachers, is the second of two modules about the Human Genome Project (HGP) produced by the Biological Sciences Curriculum Study (BSCS). The first section of this module provides background information for teachers about the structure and objectives of the HGP, aspects of the science and technology that underlie the…

  6. The 25 kW power module evolution study. Part 3: Conceptual designs for power module evolution. Volume 4: Design analyses

    NASA Technical Reports Server (NTRS)

    1979-01-01

    Topics covered include growth options evaluation, mass properties, attitude control and structural dynamics, contamination evaluation, berthing concepts, orbit reboost options and growth kit concepts. Systems support elements and space support equipment are reviewed with emphasis on power module operations and technology planning.

  7. 45 CFR 170.304 - Specific certification criteria for Complete EHRs or EHR Modules designed for an ambulatory setting.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... OF HEALTH AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Certification Criteria for Health Information Technology § 170.304 Specific certification criteria...

  8. 45 CFR 170.306 - Specific certification criteria for Complete EHRs or EHR Modules designed for an inpatient setting.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... OF HEALTH AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Certification Criteria for Health Information Technology § 170.306 Specific certification criteria...

  9. 45 CFR 170.306 - Specific certification criteria for Complete EHRs or EHR Modules designed for an inpatient setting.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... OF HEALTH AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Certification Criteria for Health Information Technology § 170.306 Specific certification criteria...

  10. 45 CFR 170.304 - Specific certification criteria for Complete EHRs or EHR Modules designed for an ambulatory setting.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... of Health and Human Services HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Certification Criteria for Health Information Technology § 170.304 Specific certification criteria...

  11. 45 CFR 170.306 - Specific certification criteria for Complete EHRs or EHR Modules designed for an inpatient setting.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... OF HEALTH AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Certification Criteria for Health Information Technology § 170.306 Specific certification criteria...

  12. 45 CFR 170.304 - Specific certification criteria for Complete EHRs or EHR Modules designed for an ambulatory setting.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... OF HEALTH AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Certification Criteria for Health Information Technology § 170.304 Specific certification criteria...

  13. 45 CFR 170.304 - Specific certification criteria for Complete EHRs or EHR Modules designed for an ambulatory setting.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... OF HEALTH AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Certification Criteria for Health Information Technology § 170.304 Specific certification criteria...

  14. 45 CFR 170.304 - Specific certification criteria for Complete EHRs or EHR Modules designed for an ambulatory setting.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... OF HEALTH AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Certification Criteria for Health Information Technology § 170.304 Specific certification criteria...

  15. 45 CFR 170.306 - Specific certification criteria for Complete EHRs or EHR Modules designed for an inpatient setting.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... of Health and Human Services HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Certification Criteria for Health Information Technology § 170.306 Specific certification criteria...

  16. 45 CFR 170.306 - Specific certification criteria for Complete EHRs or EHR Modules designed for an inpatient setting.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... OF HEALTH AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Certification Criteria for Health Information Technology § 170.306 Specific certification criteria...

  17. Development of 6-DOF painting robot control system

    NASA Astrophysics Data System (ADS)

    Huang, Junbiao; Liu, Jianqun; Gao, Weiqiang

    2017-01-01

    With the development of society, the spraying technology of manufacturing industry in China has changed from the manual operation to the 6-DOF (Degree Of Freedom)robot automatic spraying. Spraying painting robot can not only complete the work which does harm to human being, but also improve the production efficiency and save labor costs. Control system is the most critical part of the 6-DOF robots, however, there is still a lack of relevant technology research in China. It is very necessary to study a kind of control system of 6-DOF spraying painting robots which is easy to operation, and has high efficiency and stable performance. With Googol controller platform, this paper develops programs based on Windows CE embedded systems to control the robot to finish the painting work. Software development is the core of the robot control system, including the direct teaching module, playback module, motion control module, setting module, man-machine interface, alarm module, log module, etc. All the development work of the entire software system has been completed, and it has been verified that the entire software works steady and efficient.

  18. Jumping the energetics queue: Modulation of pulsar signals by extraterrestrial civilizations

    NASA Astrophysics Data System (ADS)

    Chennamangalam, Jayanth; Siemion, Andrew P. V.; Lorimer, D. R.; Werthimer, Dan

    2015-01-01

    It has been speculated that technological civilizations evolve along an energy consumption scale first formulated by Kardashev, ranging from human-like civilizations that consume energy at a rate of ∼1019 erg s-1 to hypothetical highly advanced civilizations that can consume ∼1044 erg s-1. Since the transmission power of a beacon a civilization can build depends on the energy it possesses, to make it bright enough to be seen across the Galaxy would require high technological advancement. In this paper, we discuss the possibility of a civilization using naturally-occurring radio transmitters - specifically, radio pulsars - to overcome the Kardashev limit of their developmental stage and transmit super-Kardashev power. This is achieved by the use of a modulator situated around a pulsar, that modulates the pulsar signal, encoding information onto its natural emission. We discuss a simple modulation model using pulse nulling and considerations for detecting such a signal. We find that a pulsar with a nulling modulator will exhibit an excess of thermal emission peaking in the ultraviolet during its null phases, revealing the existence of a modulator.

  19. International Space Station (ISS)

    NASA Image and Video Library

    1998-11-01

    This photograph shows the U.S. Laboratory Module (also called Destiny) for the International Space Station (ISS), in the Space Station manufacturing facility at the Marshall Space Flight Center, being readied for shipment to the Kennedy Space Center. The U.S. Laboratory module is the centerpiece of the ISS, where science experiments will be performed in the near-zero gravity of space. The Destiny Module was launched aboard the Space Shuttle orbiter Atlantis (STS-67 mission) on February 7, 2001. The aluminum module is 8.5 meters (28 feet) long and 4.3 meters (14 feet) in diameter. The laboratory consists of three cylindrical sections and two endcones with hatches that will be mated to other station components. A 50.9-centimeter- (20-inch-) diameter window is located on one side of the center module segment. This pressurized module is designed to accommodate pressurized payloads. It has a capacity of 24 rack locations, and payload racks will occupy 13 locations especially designed to support experiments. The ISS is a multidisciplinary laboratory, technology test bed, and observatory that will provide unprecedented undertakings in scientific, technological, and international experimentation.

  20. International Space Station (ISS)

    NASA Image and Video Library

    1997-01-01

    In this photograph, the U.S. Laboratory Module (also called Destiny) for the International Space Station (ISS) is shown under construction in the West High Bay of the Space Station manufacturing facility (building 4708) at the Marshall Space Flight Center. The U.S. Laboratory module is the centerpiece of the ISS, where science experiments will be performed in the near-zero gravity of space. The Destiny Module was launched aboard the Space Shuttle orbiter Atlantis (STS-98 mission) on February 7, 2001. The aluminum module is 8.5 meters (28 feet) long and 4.3 meters (14 feet) in diameter. The laboratory consists of three cylindrical sections and two endcones with hatches that will be mated to other station components. A 50.9-centimeter- (20-inch-) diameter window is located on one side of the center module segment. This pressurized module is designed to accommodate pressurized payloads. It has a capacity of 24 rack locations, and payload racks will occupy 13 locations especially designed to support experiments. The ISS is a multidisciplinary laboratory, technology test bed, and observatory that will provide unprecedented undertakings in scientific, technological, and international experimentation.

  1. International Space Station (ISS)

    NASA Image and Video Library

    1997-11-01

    In this photograph, the U.S. Laboratory Module (also called Destiny) for the International Space Station (ISS) is shown under construction in the West High Bay of the Space Station manufacturing facility (building 4708) at the Marshall Space Flight Center. The U.S. Laboratory module is the centerpiece of the ISS, where science experiments will be performed in the near-zero gravity of space. The Destiny Module was launched aboard the Space Shuttle orbiter Atlantis (STS-98 mission) on February 7, 2001. The aluminum module is 8.5 meters (28 feet) long and 4.3 meters (14 feet) in diameter. The laboratory consists of three cylindrical sections and two endcones with hatches that will be mated to other station components. A 50.9-centimeter- (20-inch-) diameter window is located on one side of the center module segment. This pressurized module is designed to accommodate pressurized payloads. It has a capacity of 24 rack locations, and payload racks will occupy 13 locations especially designed to support experiments. The ISS is a multidisciplinary laboratory, technology test bed, and observatory that will provide unprecedented undertakings in scientific, technological, and international experimentation.

  2. International Space Station (ISS)

    NASA Image and Video Library

    1997-11-26

    This photograph shows the U.S. Laboratory Module (also called Destiny) for the International Space Station (ISS), under construction in the Space Station manufacturing facility at the Marshall Space Flight Center. The U.S. Laboratory module is the centerpiece of the ISS, where science experiments will be performed in the near-zero gravity of space. The Destiny Module was launched aboard the Space Shuttle orbiter Atlantis (STS-67 mission) on February 7, 2001. The aluminum module is 8.5 meters (28 feet) long and 4.3 meters (14 feet) in diameter. The laboratory consists of three cylindrical sections and two end cones with hatches that will be mated to other station components. A 50.9-centimeter- (20-inch-) diameter window is located on one side of the center module segment. This pressurized module is designed to accommodate pressurized payloads. It has a capacity of 24 rack locations, and payload racks will occupy 13 locations especially designed to support experiments. The ISS is a multidisciplinary laboratory, technology test bed, and observatory that will provide unprecedented undertakings in scientific, technological, and international experimentation.

  3. Design of smart home terminal controller based on ZigBee

    NASA Astrophysics Data System (ADS)

    Li, Biqing; Li, Zhao; Zhang, Hongyan

    2018-04-01

    With the development in scienc and technology, and the improvement of living conditions, people pay more and more attention to the comfort of household life. Therefore, smart home has become the development trend of the future furniture. This design is composed of three blocks: transmitting module, receiving module and data acquisition module. ZigBee and STC89C52 belong to launch module as well as belong to receive module. Launch module contains ZigBee, serial communication module and monolithic STC89C52. The receiving module contains light control parts, curtain control part, ZigBee and microcontroller STC89C52. Data acquisition module includes temperature and humidity detection.

  4. Code division multiple access signaling for modulated reflector technology

    DOEpatents

    Briles, Scott D [Los Alamos, NM

    2012-05-01

    A method and apparatus for utilizing code division multiple access in modulated reflectance transmissions comprises the steps of generating a phase-modulated reflectance data bit stream; modifying the modulated reflectance data bit stream; providing the modified modulated reflectance data bit stream to a switch that connects an antenna to an infinite impedance in the event a "+1" is to be sent, or connects the antenna to ground in the event a "0" or a "-1" is to be sent.

  5. Broadband, Spectrally Flat, Graphene-based Terahertz Modulators.

    PubMed

    Shi, Fenghua; Chen, Yihang; Han, Peng; Tassin, Philippe

    2015-12-02

    Advances in the efficient manipulation of terahertz waves are crucial for the further development of terahertz technology, promising applications in many diverse areas, such as biotechnology and spectroscopy, to name just a few. Due to its exceptional electronic and optical properties, graphene is a good candidate for terahertz electro-absorption modulators. However, graphene-based modulators demonstrated to date are limited in bandwidth due to Fabry-Perot oscillations in the modulators' substrate. Here, a novel method is demonstrated to design electrically controlled graphene-based modulators that can achieve broadband and spectrally flat modulation of terahertz beams. In our design, a graphene layer is sandwiched between a dielectric and a slightly doped substrate on a metal reflector. It is shown that the spectral dependence of the electric field intensity at the graphene layer can be dramatically modified by optimizing the structural parameters of the device. In this way, the electric field intensity can be spectrally flat and even compensate for the dispersion of the graphene conductivity, resulting in almost invariant absorption in a wide frequency range. Modulation depths up to 76% can be achieved within a fractional operational bandwidth of over 55%. It is expected that our modulator designs will enable the use of terahertz technology in applications requiring broadband operation. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  6. NASA. Lewis Research Center Advanced Modulation and Coding Project: Introduction and overview

    NASA Technical Reports Server (NTRS)

    Budinger, James M.

    1992-01-01

    The Advanced Modulation and Coding Project at LeRC is sponsored by the Office of Space Science and Applications, Communications Division, Code EC, at NASA Headquarters and conducted by the Digital Systems Technology Branch of the Space Electronics Division. Advanced Modulation and Coding is one of three focused technology development projects within the branch's overall Processing and Switching Program. The program consists of industry contracts for developing proof-of-concept (POC) and demonstration model hardware, university grants for analyzing advanced techniques, and in-house integration and testing of performance verification and systems evaluation. The Advanced Modulation and Coding Project is broken into five elements: (1) bandwidth- and power-efficient modems; (2) high-speed codecs; (3) digital modems; (4) multichannel demodulators; and (5) very high-data-rate modems. At least one contract and one grant were awarded for each element.

  7. The Node 1 (or Unity) Module for the International Space Station

    NASA Technical Reports Server (NTRS)

    1997-01-01

    This photograph, taken by the Boeing Company,shows Boeing technicians preparing to install one of six hatches or doors to the Node 1 (also called Unity), the first U.S. Module for the International Space Station (ISS). The Node 1, or Unity, serves as a cornecting passageway to Space Station modules and was manufactured by the Boeing Company at the Marshall Space Flight Center from 1994 to 1997. The U.S. built Unity module was launched aboard the orbiter Endeavour (STS-88 mission) on December 4, 1998 and connected to the Zarya, the Russian-built Functional Energy Block (FGB). The Zarya was launched on a Russian proton rocket prior to the launch of the Unity. The ISS is a multidisciplinary laboratory, technology test bed, and observatory that will provide unprecedented undertakings in scientific, technological, and international experimentation.

  8. The Node 1 (or Unity) Module for the International Space Station

    NASA Technical Reports Server (NTRS)

    1997-01-01

    This photograph, taken by the Boeing Company, shows Boeing technicians preparing to install one of six hatches or doors to the Node 1 (also called Unity), the first U.S. Module for the International Space Station (ISS). The Node 1, or Unity, serves as a cornecting passageway to Space Station modules and was manufactured by the Boeing Company at the Marshall Space Flight Center from 1994 to 1997. The U.S. built Unity module was launched aboard the orbiter Endeavour (STS-88 mission) on December 4, 1998 and connected to the Zarya, the Russian-built Functional Energy Block (FGB). The Zarya was launched on a Russian proton rocket prior to the launch of the Unity. The ISS is a multidisciplinary laboratory, technology test bed, and observatory that will provide unprecedented undertakings in scientific, technological, and international experimentation.

  9. Performance evaluation of advanced battery technologies for electric vehicle applications

    NASA Astrophysics Data System (ADS)

    Deluca, W. H.; Tummillo, A. F.; Kulaga, J. E.; Webster, C. E.; Gillie, K. R.; Hogrefe, R. L.

    1990-01-01

    At the Argonne Analysis and Diagnostic Laboratory, advanced battery technology evaluations are performed under simulated electric vehicle operating conditions. During 1989 and the first quarter of 1990, single cell and multicell modules from seven developers were examined for the Department of Energy and Electric Power Research Institute. The results provide battery users, developers, and program managers with an interim measure of the progress being made in battery R&D programs, a comparison of battery technologies, and a source of basic data for modeling and continuing R&D. This paper summarizes the performance and life characterizations of two single cells and seven 3- to 960-cell modules that encompass six technologies (Na/S, Ni/Fe, Ni/Cd, Ni-metal hydride, lead-acid, and Zn/Br).

  10. DEMONSTRATION BULLETIN: MEMBRANE FILTRATION - SBP TECHNOLOGIES, INC.

    EPA Science Inventory

    SBP Technologies Inc. (SBP) has developed a membrane-based separation technology that can reduce the volume of contaminated groundwater requiring treatment. The SBP Filtration Unit consists of porous, sintered, stainless steel tubes arranged in a shell-and-tube module configurati...

  11. Space Shuttle Projects

    NASA Image and Video Library

    1997-01-01

    This is a view of the Russian Mir Space Station photographed by a crewmember of the fifth Shuttle/Mir docking mission, STS-81. The image shows: upper center - Progress supply vehicle, Kvant-1 module, and Core module; center left - Priroda module; center right - Spektr module; bottom left - Kvant-2 module; bottom center - Soyuz; and bottom right - Kristall module and Docking module. The Progress was an unmarned, automated version of the Soyuz crew transfer vehicle, designed to resupply the Mir. The Kvant-1 provided research in the physics of galaxies, quasars, and neutron stars, by measuring electromagnetic spectra and x-ray emissions. The Core module served as the heart of the space station and contained the primary living and working areas, life support, and power, as well as the main computer, communications, and control equipment. Priroda's main purpose was Earth remote sensing. The Spektr module provided Earth observation. It also supported research into biotechnology, life sciences, materials science, and space technologies. American astronauts used the Spektr as their living quarters. Kvant-2 was a scientific and airlock module, providing biological research, Earth observations, and EVA (extravehicular activity) capability. The Soyuz typically ferried three crewmembers to and from the Mir. A main purpose of the Kristall module was to develop biological and materials production technologies in the space environment. The Docking module made it possible for the Space Shuttle to dock easily with the Mir. The journey of the 15-year-old Russian Mir Space Station ended March 23, 2001, as the Mir re-entered the Earth's atmosphere and fell into the south Pacific Ocean.

  12. An electromagnetic modulator based on electrically controllable metamaterial analogue to electromagnetically induced transparency.

    PubMed

    Fan, Yuancheng; Qiao, Tong; Zhang, Fuli; Fu, Quanhong; Dong, Jiajia; Kong, Botao; Li, Hongqiang

    2017-01-16

    Electromagnetically induced transparency (EIT) is a promising technology for the enhancement of light-matter interactions, and recent demonstrations of the EIT analogue realized in artificial micro-structured medium have remarkably reduced the extreme requirement for experimental observation of EIT spectrum. In this paper, we propose to electrically control the EIT-like spectrum in a metamaterial as an electromagnetic modulator. A diode acting as a tunable resistor is loaded in the gap of paired wires to inductively tune the magnetic resonance, which induces remarkable modulation on the EIT-like spectrum through the metamaterial sample. The experimental measurements confirmed that the prediction of electromagnetic modulation in three narrow bands on the EIT-like spectrum, and a modulation contrast of up to 31 dB was achieved on the transmission through the metamaterial. Our results may facilitate the study on active/dynamical technology in translational metamaterials, which connect extraordinary manipulations on the flow of light in metamaterials, e.g., the exotic EIT, and practical applications in industry.

  13. TiO x -Based Thermoelectric Modules: Manufacturing, Properties, and Operational Behavior

    NASA Astrophysics Data System (ADS)

    Martin, Hans-Peter; Pönicke, Andreas; Kluge, Martin; Sichert, Ina; Rost, Axel; Conze, Susan; Wätzig, Katja; Schilm, Jochen; Michaelis, Alexander

    2016-03-01

    Substoichiometric titanium oxides are attractive thermoelectric materials for high-temperature modules. Their advantages are availability, economy, and safety. This paper gives results of thermoelectric data on scale-up titanium suboxides, manufacturing technologies of TiO x modules, glass coating as an option for oxidation protection, and test results of TiO x modules. The thermoelectric efficiency of TiO x is low compared with established thermoelectric materials. However, TiO x is very attractive for economic reasons, and there are still expectations for efficiency rise by modification of the material's microstructure. TiO x can be produced in large quantities of several tens of kilograms. A manufacturing process for TiO x -based unileg n-type modules has been established, including all technological steps. The design of the TiO x -based modules was optimized for the thermoelectric conversion process and thermal robustness. A test device was used for experimental analysis with maximum temperature of 600°C at the hot side and 100°C at the cold side. This initial test revealed similar power output and internal resistance of all fabricated modules. Furthermore, thermal cycles with increasing and decreasing temperatures at the hot side were realized to characterize the reliability and stability of the modules. Additionally, modules were tested in a hot gas test rig to simulate the thermal stresses during power generation in the exhaust line of a passenger car.

  14. Technology in the Freshman Biology Classroom: Breaking the Dual Learning Curve.

    ERIC Educational Resources Information Center

    Windelspecht, Michael

    2001-01-01

    Introduces the Instructional Technology Project (ITP) which provides universal, 24 hours/7 days a week Internet access to both students and faculty and incorporates technology into the curriculum. Uses five different modules involving technology that include e-mail, electronic discussion board, CD-ROM and multimedia, internet browsers, and…

  15. NEWS BRIEF: Keeping Cool with Carbon Capture Technologies

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    None

    NETL scientists have created unique sorbents to capture indoor air pollutants. The sorbents are used in enVerid System’s new HLR modules. The modules can be incorporated into HVAC systems to scrub the air.

  16. Summary of flat-plate solar array project documentation. Abstracts of published documents, 1975 to June 1982

    NASA Technical Reports Server (NTRS)

    1982-01-01

    Technologies that will enable the private sector to manufacture and widely use photovoltaic systems for the generation of electricity in residential, commercial, industrial, and government applications at a cost per watt that is competitive with other means is investigated. Silicon refinement processes, advanced silicon sheet growth techniques, solar cell development, encapsulation, automated fabrication process technology, advanced module/array design, and module/array test and evaluation techniques are developed.

  17. Automated array assembly task, phase 1

    NASA Technical Reports Server (NTRS)

    Carbajal, B. G.

    1977-01-01

    State-of-the-art technologies applicable to silicon solar cell and solar cell module fabrication were assessed. The assessment consisted of a technical feasibility evaluation and a cost projection for high volume production of solar cell modules. Design equations based on minimum power loss were used as a tool in the evaluation of metallization technologies. A solar cell process sensitivity study using models, computer calculations, and experimental data was used to identify process step variation and cell output variation correlations.

  18. Technology Developments Integrating a Space Network Communications Testbed

    NASA Technical Reports Server (NTRS)

    Kwong, Winston; Jennings, Esther; Clare, Loren; Leang, Dee

    2006-01-01

    As future manned and robotic space explorations missions involve more complex systems, it is essential to verify, validate, and optimize such systems through simulation and emulation in a low cost testbed environment. The goal of such a testbed is to perform detailed testing of advanced space and ground communications networks, technologies, and client applications that are essential for future space exploration missions. We describe the development of new technologies enhancing our Multi-mission Advanced Communications Hybrid Environment for Test and Evaluation (MACHETE) that enable its integration in a distributed space communications testbed. MACHETE combines orbital modeling, link analysis, and protocol and service modeling to quantify system performance based on comprehensive considerations of different aspects of space missions. It can simulate entire networks and can interface with external (testbed) systems. The key technology developments enabling the integration of MACHETE into a distributed testbed are the Monitor and Control module and the QualNet IP Network Emulator module. Specifically, the Monitor and Control module establishes a standard interface mechanism to centralize the management of each testbed component. The QualNet IP Network Emulator module allows externally generated network traffic to be passed through MACHETE to experience simulated network behaviors such as propagation delay, data loss, orbital effects and other communications characteristics, including entire network behaviors. We report a successful integration of MACHETE with a space communication testbed modeling a lunar exploration scenario. This document is the viewgraph slides of the presentation.

  19. Chemical Bonding Technology: Direct Investigation of Interfacial Bonds

    NASA Technical Reports Server (NTRS)

    Koenig, J. L.; Boerio, F. J.; Plueddemann, E. P.; Miller, J.; Willis, P. B.; Cuddihy, E. F.

    1986-01-01

    This is the third Flat-Plate Solar Array (FSA) Project document reporting on chemical bonding technology for terrestrial photovoltaic (PV) modules. The impetus for this work originated in the late 1970s when PV modules employing silicone encapsulation materials were undergoing delamination during outdoor exposure. At that time, manufacturers were not employing adhesion promoters and, hence, module interfaces in common with the silicone materials were only in physical contact and therefore easily prone to separation if, for example, water were to penetrate to the interfaces. Delamination with silicone materials virtually vanished when adhesion promoters, recommended by silicone manufacturers, were used. The activities related to the direct investigation of chemically bonded interfaces are described.

  20. 45 CFR 170.450 - EHR module testing and certification.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... Section 170.450 Public Welfare DEPARTMENT OF HEALTH AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Temporary Certification Program for HIT § 170.450 EHR...

  1. 45 CFR 170.450 - EHR module testing and certification.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... Section 170.450 Public Welfare Department of Health and Human Services HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Temporary Certification Program for HIT § 170.450 EHR...

  2. 45 CFR 170.450 - EHR module testing and certification.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... Section 170.450 Public Welfare DEPARTMENT OF HEALTH AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Temporary Certification Program for HIT § 170.450 EHR...

  3. 45 CFR 170.450 - EHR module testing and certification.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... Section 170.450 Public Welfare DEPARTMENT OF HEALTH AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Temporary Certification Program for HIT § 170.450 EHR...

  4. 45 CFR 170.450 - EHR module testing and certification.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... Section 170.450 Public Welfare DEPARTMENT OF HEALTH AND HUMAN SERVICES HEALTH INFORMATION TECHNOLOGY HEALTH INFORMATION TECHNOLOGY STANDARDS, IMPLEMENTATION SPECIFICATIONS, AND CERTIFICATION CRITERIA AND CERTIFICATION PROGRAMS FOR HEALTH INFORMATION TECHNOLOGY Temporary Certification Program for HIT § 170.450 EHR...

  5. 21 CFR 1311.08 - Incorporation by reference.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... of Standards and Technology, Computer Security Division, Information Technology Laboratory, National... standards are available from the National Institute of Standards and Technology, Computer Security Division... 140-2, Security Requirements for Cryptographic Modules, May 25, 2001, as amended by Change Notices 2...

  6. Germanium detector vacuum encapsulation

    NASA Technical Reports Server (NTRS)

    Madden, N. W.; Malone, D. F.; Pehl, R. H.; Cork, C. P.; Luke, P. N.; Landis, D. A.; Pollard, M. J.

    1991-01-01

    This paper describes an encapsulation technology that should significantly improve the viability of germanium gamma-ray detectors for a number of important applications. A specialized vacuum chamber has been constructed in which the detector and the encapsulating module are processed in high vacuum. Very high vacuum conductance is achieved within the valveless encapsulating module. The detector module is then sealed without breaking the chamber vacuum. The details of the vacuum chamber, valveless module, processing, and sealing method are presented.

  7. Identification coding schemes for modulated reflectance systems

    DOEpatents

    Coates, Don M [Santa Fe, NM; Briles, Scott D [Los Alamos, NM; Neagley, Daniel L [Albuquerque, NM; Platts, David [Santa Fe, NM; Clark, David D [Santa Fe, NM

    2006-08-22

    An identifying coding apparatus employing modulated reflectance technology involving a base station emitting a RF signal, with a tag, located remotely from the base station, and containing at least one antenna and predetermined other passive circuit components, receiving the RF signal and reflecting back to the base station a modulated signal indicative of characteristics related to the tag.

  8. Development of a Computer-Assisted Cranial Nerve Simulation from the Visible Human Dataset

    ERIC Educational Resources Information Center

    Yeung, Jeffrey C.; Fung, Kevin; Wilson, Timothy D.

    2011-01-01

    Advancements in technology and personal computing have allowed for the development of novel teaching modalities such as online web-based modules. These modules are currently being incorporated into medical curricula and, in some paradigms, have been shown to be superior to classroom instruction. We believe that these modules have the potential of…

  9. Nuclear Technology. Course 30: Mechanical Inspection. Module 30-1, Pump Inspection.

    ERIC Educational Resources Information Center

    Wasil, Ed; Espy, John

    This first in a series of eight modules for a course titled Mechanical Inspection describes the type of pumps used in nuclear power plant systems, the basic operating principles of each type, and the inspection activities performed by the quality assurance/quality control technician. The module follows a typical format that includes the following…

  10. Nuclear Technology. Course 28: Welding Inspection. Module 28-2, Shielded Metal Arc and Oxyacetylene Welding.

    ERIC Educational Resources Information Center

    Espy, John; Selleck, Ben

    This second in a series of ten modules for a course titled Welding Inspection describes the key features of the oxyacetylene and shielded metal arc welding process. The apparatus, process techniques, procedures, applications, associated defects, and inspections are presented. The module follows a typical format that includes the following…

  11. Nuclear Technology. Course 28: Welding Inspection. Module 28-8, Filler Metal Control.

    ERIC Educational Resources Information Center

    Espy, John

    This eighth in a series of ten modules for a course titled Welding Inspection describes controls necessary to place the proper electrode or rod at each welding station. More specifically, the module describes use of the American Welding Society specifications, control of weld filler material after receipt from the supplier, and methods of ensuring…

  12. The 20 and 30 GHz MMIC technology for future space communication antenna system

    NASA Technical Reports Server (NTRS)

    Anzic, G.; Connolly, D. J.

    1984-01-01

    The development of fully monolithic gallium arsenide receive and transmit modules is described. These modules are slated for phased array antenna applications in future 30/20 gigahertz communications satellite systems. Performance goals and various approaches to achieve them are discussed. The latest design and performance results of components, submodules and modules are presented.

  13. The 20 and 30 GHz MMIC technology for future space communication antenna system

    NASA Astrophysics Data System (ADS)

    Anzic, G.; Connolly, D. J.

    1984-10-01

    The development of fully monolithic gallium arsenide receive and transmit modules is described. These modules are slated for phased array antenna applications in future 30/20 gigahertz communications satellite systems. Performance goals and various approaches to achieve them are discussed. The latest design and performance results of components, submodules and modules are presented.

  14. Terrestrial photovoltaic collector technology trends

    NASA Technical Reports Server (NTRS)

    Shimada, K.; Costogue, E.

    1984-01-01

    Following the path of space PV collector development in its early stages, terrestrial PV technologies based upon single-crystal silicon have matured rapidly. Currently, terrestrial PV cells with efficiencies approaching space cell efficiencies are being fabricated into modules at a fraction of the space PV module cost. New materials, including CuInSe2 and amorphous silicon, are being developed for lowering the cost, and multijunction materials for achieving higher efficiency. Large grid-interactive, tracking flat-plate power systems and concentrator PV systems totaling about 10 MW, are already in operation. Collector technology development both flat-plate and concentrator, will continue under an extensive government and private industry partnership.

  15. Image quality testing of assembled IR camera modules

    NASA Astrophysics Data System (ADS)

    Winters, Daniel; Erichsen, Patrik

    2013-10-01

    Infrared (IR) camera modules for the LWIR (8-12_m) that combine IR imaging optics with microbolometer focal plane array (FPA) sensors with readout electronics are becoming more and more a mass market product. At the same time, steady improvements in sensor resolution in the higher priced markets raise the requirement for imaging performance of objectives and the proper alignment between objective and FPA. This puts pressure on camera manufacturers and system integrators to assess the image quality of finished camera modules in a cost-efficient and automated way for quality control or during end-of-line testing. In this paper we present recent development work done in the field of image quality testing of IR camera modules. This technology provides a wealth of additional information in contrast to the more traditional test methods like minimum resolvable temperature difference (MRTD) which give only a subjective overall test result. Parameters that can be measured are image quality via the modulation transfer function (MTF) for broadband or with various bandpass filters on- and off-axis and optical parameters like e.g. effective focal length (EFL) and distortion. If the camera module allows for refocusing the optics, additional parameters like best focus plane, image plane tilt, auto-focus quality, chief ray angle etc. can be characterized. Additionally, the homogeneity and response of the sensor with the optics can be characterized in order to calculate the appropriate tables for non-uniformity correction (NUC). The technology can also be used to control active alignment methods during mechanical assembly of optics to high resolution sensors. Other important points that are discussed are the flexibility of the technology to test IR modules with different form factors, electrical interfaces and last but not least the suitability for fully automated measurements in mass production.

  16. Analysis of twelve-month degradation in three polycrystalline photovoltaic modules

    NASA Astrophysics Data System (ADS)

    Lai, T.; Potter, B. G.; Simmons-Potter, K.

    2016-09-01

    Polycrystalline silicon photovoltaic (PV) modules have the advantage of lower manufacturing cost as compared to their monocrystalline counterparts, but generally exhibit both lower initial module efficiencies and more significant early-stage efficiency degradation than do similar monocrystalline PV modules. For both technologies, noticeable deterioration in power conversion efficiency typically occurs over the first two years of usage. Estimating PV lifetime by examining the performance degradation behavior under given environmental conditions is, therefore, one of continual goals for experimental research and economic analysis. In the present work, accelerated lifecycle testing (ALT) on three polycrystalline PV technologies was performed in a full-scale, industrial-standard environmental chamber equipped with single-sun irradiance capability, providing an illumination uniformity of 98% over a 2 x 1.6m area. In order to investigate environmental aging effects, timedependent PV performance (I-V characteristic) was evaluated over a recurring, compressed day-night cycle, which simulated local daily solar insolation for the southwestern United States, followed by dark (night) periods. During a total test time of just under 4 months that corresponded to a year equivalent exposure on a fielded module, the temperature and humidity varied in ranges from 3°C to 40°C and 5% to 85% based on annual weather profiles for Tucson, AZ. Removing the temperature de-rating effect that was clearly seen in the data enabled the computation of normalized efficiency degradation with time and environmental exposure. Results confirm the impact of environmental conditions on the module long-term performance. Overall, more than 2% efficiency degradation in the first year of usage was observed for all thee polycrystalline Si solar modules. The average 5-year degradation of each PV technology was estimated based on their determined degradation rates.

  17. Demonstration of a simplified optical mouse lighting module by integrating the non-Lambertian LED chip and the free-form surface.

    PubMed

    Pan, Jui-Wen; Tu, Sheng-Han

    2012-05-20

    A cost-effective, high-throughput, and high-yield method for the efficiency enhancement of an optical mouse lighting module is proposed. We integrated imprinting technology and free-form surface design to obtain a lighting module with high illumination efficiency and uniform intensity distribution. The imprinting technique can increase the light extraction efficiency and modulate the intensity distribution of light-emitting diodes. A modulated light source was utilized to add a compact free-form surface element to create a lighting module with 95% uniformity and 80% optical efficiency.

  18. Monitoring and control technologies for bioregenerative life support systems/CELSS

    NASA Technical Reports Server (NTRS)

    Knott, William M.; Sager, John C.

    1991-01-01

    The development of a controlled Ecological Life Support System (CELSS) will require NASA to develop innovative monitoring and control technologies to operate the different components of the system. Primary effort over the past three to four years has been directed toward the development of technologies to operate a biomass production module. Computer hardware and software required to operate, collect, and summarize environmental data for a large plant growth chamber facility were developed and refined. Sensors and controls required to collect information on such physical parameters as relative humidity, temperature, irradiance, pressure, and gases in the atmosphere; and PH, dissolved oxygen, fluid flow rates, and electrical conductivity in the nutrient solutions are being developed and tested. Technologies required to produce high artificial irradiance for plant growth and those required to collect and transport natural light into a plant growth chamber are also being evaluated. Significant effort was directed towards the development and testing of a membrane nutrient delivery system required to manipulate, seed, and harvest crops, and to determine plant health prior to stress impacting plant productivity are also being researched. Tissue culture technologies are being developed for use in management and propagation of crop plants. Though previous efforts have focussed on development of technologies required to operate a biomass production module for a CELSS, current efforts are expanding to include technologies required to operate modules such as food preparation, biomass processing, and resource (waste) recovery which are integral parts of the CELSS.

  19. Crystalline-silicon reliability lessons for thin-film modules

    NASA Technical Reports Server (NTRS)

    Ross, Ronald G., Jr.

    1985-01-01

    Key reliability and engineering lessons learned from the 10-year history of the Jet Propulsion Laboratory's Flat-Plate Solar Array Project are presented and analyzed. Particular emphasis is placed on lessons applicable to the evolving new thin-film cell and module technologies and the organizations involved with these technologies. The user-specific demand for reliability is a strong function of the application, its location, and its expected duration. Lessons relative to effective means of specifying reliability are described, and commonly used test requirements are assessed from the standpoint of which are the most troublesome to pass, and which correlate best with field experience. Module design lessons are also summarized, including the significance of the most frequently encountered failure mechanisms and the role of encapsulant and cell reliability in determining module reliability. Lessons pertaining to research, design, and test approaches include the historical role and usefulness of qualification tests and field tests.

  20. Scalable fabrication of perovskite solar cells

    DOE PAGES

    Li, Zhen; Klein, Talysa R.; Kim, Dong Hoe; ...

    2018-03-27

    Perovskite materials use earth-abundant elements, have low formation energies for deposition and are compatible with roll-to-roll and other high-volume manufacturing techniques. These features make perovskite solar cells (PSCs) suitable for terawatt-scale energy production with low production costs and low capital expenditure. Demonstrations of performance comparable to that of other thin-film photovoltaics (PVs) and improvements in laboratory-scale cell stability have recently made scale up of this PV technology an intense area of research focus. Here, we review recent progress and challenges in scaling up PSCs and related efforts to enable the terawatt-scale manufacturing and deployment of this PV technology. We discussmore » common device and module architectures, scalable deposition methods and progress in the scalable deposition of perovskite and charge-transport layers. We also provide an overview of device and module stability, module-level characterization techniques and techno-economic analyses of perovskite PV modules.« less

  1. PV Reliability Development Lessons from JPL's Flat Plate Solar Array Project

    NASA Technical Reports Server (NTRS)

    Ross, Ronald G., Jr.

    2013-01-01

    Key reliability and engineering lessons learned from the 20-year history of the Jet Propulsion Laboratory's Flat-Plate Solar Array Project and thin film module reliability research activities are presented and analyzed. Particular emphasis is placed on lessons applicable to evolving new module technologies and the organizations involved with these technologies. The user-specific demand for reliability is a strong function of the application, its location, and its expected duration. Lessons relative to effective means of specifying reliability are described, and commonly used test requirements are assessed from the standpoint of which are the most troublesome to pass, and which correlate best with field experience. Module design lessons are also summarized, including the significance of the most frequently encountered failure mechanisms and the role of encapsulate and cell reliability in determining module reliability. Lessons pertaining to research, design, and test approaches include the historical role and usefulness of qualification tests and field tests.

  2. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Li, Zhen; Klein, Talysa R.; Kim, Dong Hoe

    Perovskite materials use earth-abundant elements, have low formation energies for deposition and are compatible with roll-to-roll and other high-volume manufacturing techniques. These features make perovskite solar cells (PSCs) suitable for terawatt-scale energy production with low production costs and low capital expenditure. Demonstrations of performance comparable to that of other thin-film photovoltaics (PVs) and improvements in laboratory-scale cell stability have recently made scale up of this PV technology an intense area of research focus. Here, we review recent progress and challenges in scaling up PSCs and related efforts to enable the terawatt-scale manufacturing and deployment of this PV technology. We discussmore » common device and module architectures, scalable deposition methods and progress in the scalable deposition of perovskite and charge-transport layers. We also provide an overview of device and module stability, module-level characterization techniques and techno-economic analyses of perovskite PV modules.« less

  3. Dairy propionibacteria as probiotics: recent evidences.

    PubMed

    Altieri, Clelia

    2016-10-01

    Nowdays there is evidence that dairy propionibacteria display probiotic properties, which as yet have been underestimated. The aim of this paper is to review the recent highlights of data representing the probiotic potential of dairy propionibacteria, studied both by general selection criteria (useful for all probiotic potentials), and by more specific and innovative approach. Dairy propionibacteria show a robust nature, that makes them able to overcome technological hurdles, allowing their future use in various fermented probiotic foods. In addition to the general selection criteria for probiotics in areas such as food safety, technological and digestive stress tolerance, many potential health benefits have been recently described for dairy propionibacteria, including, production of several active molecules and adhesion capability, that can mean a steady action in modulation of microbiota and of metabolic activity in the gut; their impact on intestinal inflammation, modulation of the immune system, potential modulation of risk factors for cancer development modulation of intestinal absorption.

  4. An Integrated Decision Support System for Water Quality Management of Songhua River Basin

    NASA Astrophysics Data System (ADS)

    Zhang, Haiping; Yin, Qiuxiao; Chen, Ling

    2010-11-01

    In the Songhua River Basin of China, many water resource and water environment conflicts interact. A Decision Support System (DSS) for the water quality management has been established for the Basin. The System is featured by the incorporation of a numerical water quality model system into a conventional water quality management system which usually consists of geographic information system (GIS), WebGIS technology, database system and network technology. The model system is built based on DHI MIKE software comprising of a basin rainfall-runoff module, a basin pollution load evaluation module, a river hydrodynamic module and a river water quality module. The DSS provides a friendly graphical user interface that enables the rapid and transparent calculation of various water quality management scenarios, and also enables the convenient access and interpretation of the modeling results to assist the decision-making.

  5. Repurposing traditional instructor-led lectures for continuing education: rewarding instructors as authors and maximizing return on investment.

    PubMed

    Rushinek, Avi; Rushinek, Sara; Lippincott, Christine; Ambrosia, Todd

    2014-04-01

    The aim of this article is to describe the repurposing of classroom video surveillance and on-screen archives (RCVSOSA) model, which is an innovative, technology-enabled approach to continuing education in nursing. The RCVSOSA model leverages network Internet-protocol, high-definition surveillance cameras to record videos of classroom lectures that can be automatically uploaded to the Internet or converted to DVD, either in their entirety or as content-specific modules, with the production work embedded in the technology. The proposed model supports health care continuing education through the use of online assessments for focused education modules, access to archived online recordings and DVD training courses, voice-to-text transcripts, and possibly continuing education modules that may be translated into multiple languages. Potential benefits of this model include increased access to educational modules for students, instant authorship, and financial compensation for instructors and their respective organizations.

  6. Ultrahigh capacity 2 × 2 MIMO RoF system at 60  GHz employing single-sideband single-carrier modulation.

    PubMed

    Lin, Chun-Ting; Ho, Chun-Hung; Huang, Hou-Tzu; Cheng, Yu-Hsuan

    2014-03-15

    This article proposes and experimentally demonstrates a radio-over-fiber system employing single-sideband single-carrier (SSB-SC) modulation at 60 GHz. SSB-SC modulation has a lower peak-to-average-power ratio than orthogonal frequency division multiplex (OFDM) modulation; therefore, the SSB-SC signals provide superior nonlinear tolerance, compared to OFDM signals. Moreover, multiple-input multiple-output (MIMO) technology was used extensively to enhance spectral efficiency. A least-mean-square-based equalizer was implemented, including MIMO channel estimation, frequency response equalization, and I/Q imbalance compensation to recover the MIMO signals. Thus, using 2×2 MIMO technology and 64-QAM SSB-SC signals, we achieved the highest data rate of 84 Gbps with 12  bit/s/Hz spectral efficiency using the 7-GHz license-free band at 60 GHz.

  7. Biomedical Technology. Innovations: The Social Consequences of Science and Technology Program.

    ERIC Educational Resources Information Center

    McInerney, Joseph D.; And Others

    This module is part of an interdisciplinary program designed to educate the general citizenry regarding the issues of science/technology/society that have important consequences for both present and future social policies. Specifically, the program provides an opportunity for students to assess the effects of selected technological innovations in…

  8. Transceivers and receivers for quantum key distribution and methods pertaining thereto

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    DeRose, Christopher; Sarovar, Mohan; Soh, Daniel B.S.

    Various technologies for performing continuous-variable (CV) and discrete-variable (DV) quantum key distribution (QKD) with integrated electro-optical circuits are described herein. An integrated DV-QKD system uses Mach-Zehnder modulators to modulate a polarization of photons at a transmitter and select a photon polarization measurement basis at a receiver. An integrated CV-QKD system uses wavelength division multiplexing to send and receive amplitude-modulated and phase-modulated optical signals with a local oscillator signal while maintaining phase coherence between the modulated signals and the local oscillator signal.

  9. Development of ITM Oxygen Technology for Low-cost and Low-emission Gasification and Other Industrial Applications

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Fogash, Kevin

    2015-12-15

    Air Products carried out a scope of work under DOE Award No. DE-FE0012065 “Development of ITM Oxygen Technology for Low-cost and Low-emission Gasification and Other Industrial Applications” with subcontractors Ceramatec, Penn State, and WorleyParsons. The scope of work under this award was aimed at furthering the development of the Ion Transport Membrane (ITM) Oxygen production process toward a demonstration-scale facility known as the Oxygen Development Facility (ODF). Specific activities will help to enable design and construction of the ODF through advancement of a number of challenging technical elements that are required to manage risk in the initial deployment of ITMmore » technology. Major objectives of the work included developing ITM Oxygen ceramic membrane materials with improved performance and reliability, optimizing ceramic module geometry and fabrication methods, testing module performance, trialing the improved fabrication process at commercial scale in the Ceramic Membrane Module Fabrication Facility (CerFab), and advancing engineering development of the ITM oxygen production process, including vessel design and contaminant control measures to prepare for deployment of the ODF. The comprehensive report that follows details the team’s work, which includes several notable accomplishments: 1) compressive creep, a likely limiter of ceramic module lifetime in service, was demonstrated to be retarded by an order of magnitude by changes in material formulation, module joining dimensions, and internal wafer geometry; 2) two promising new materials were shown to be superior to the incumbent ITM material in a key material parameter related to oxygen flux; 3) module degradation mechanisms were identified following operation in large pilot-scale equipment; 4) options for utilizing ITM in a coal-to-liquids (CTL) facility to enable liquids production with carbon capture were identified and studied; and 5) the benefits of potential improvements to the technology were assessed for their cost impact on ITM Oxygen applications to clean power, fuels, and other applications.« less

  10. Development of ITM Oxygen Technology for Low-cost and Low-emission Gasification and Other Industrial Applications

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Fogash, Kevin

    Air Products carried out a scope of work under DOE Award No. DE-FE0012065 “Development of ITM Oxygen Technology for Low-cost and Low-emission Gasification and Other Industrial Applications” with subcontractors Ceramatec, Penn State, and WorleyParsons. The scope of work under this award was aimed at furthering the development of the Ion Transport Membrane (ITM) Oxygen production process toward a demonstration-scale facility known as the Oxygen Development Facility (ODF). Specific activities will help to enable design and construction of the ODF through advancement of a number of challenging technical elements that are required to manage risk in the initial deployment of ITMmore » technology. Major objectives of the work included developing ITM Oxygen ceramic membrane materials with improved performance and reliability, optimizing ceramic module geometry and fabrication methods, testing module performance, trialing the improved fabrication process at commercial scale in the Ceramic Membrane Module Fabrication Facility (CerFab), and advancing engineering development of the ITM oxygen production process, including vessel design and contaminant control measures to prepare for deployment of the ODF. The comprehensive report that follows details the team’s work, which includes several notable accomplishments: 1) compressive creep, a likely limiter of ceramic module lifetime in service, was demonstrated to be retarded by an order of magnitude by changes in material formulation, module joining dimensions, and internal wafer geometry; 2) two promising new materials were shown to be superior to the incumbent ITM material in a key material parameter related to oxygen flux; 3) module degradation mechanisms were identified following operation in large pilot-scale equipment; 4) options for utilizing ITM in a coal-to-liquids (CTL) facility to enable liquids production with carbon capture were identified and studied; and 5) the benefits of potential improvements to the technology were assessed for their cost impact on ITM Oxygen applications to clean power, fuels, and other applications.« less

  11. Technology modules from micro- and nano-electronics for the life sciences.

    PubMed

    Birkholz, M; Mai, A; Wenger, C; Meliani, C; Scholz, R

    2016-05-01

    The capabilities of modern semiconductor manufacturing offer remarkable possibilities to be applied in life science research as well as for its commercialization. In this review, the technology modules available in micro- and nano-electronics are exemplarily presented for the case of 250 and 130 nm technology nodes. Preparation procedures and the different transistor types as available in complementary metal-oxide-silicon devices (CMOS) and BipolarCMOS (BiCMOS) technologies are introduced as key elements of comprehensive chip architectures. Techniques for circuit design and the elements of completely integrated bioelectronics systems are outlined. The possibility for life scientists to make use of these technology modules for their research and development projects via so-called multi-project wafer services is emphasized. Various examples from diverse fields such as (1) immobilization of biomolecules and cells on semiconductor surfaces, (2) biosensors operating by different principles such as affinity viscosimetry, impedance spectroscopy, and dielectrophoresis, (3) complete systems for human body implants and monitors for bioreactors, and (4) the combination of microelectronics with microfluidics either by chip-in-polymer integration as well as Si-based microfluidics are demonstrated from joint developments with partners from biotechnology and medicine. WIREs Nanomed Nanobiotechnol 2016, 8:355-377. doi: 10.1002/wnan.1367 For further resources related to this article, please visit the WIREs website. © 2015 Wiley Periodicals, Inc.

  12. Technological processes of grating light valve as diffractive spatial light modulator in laser phototypesetting system

    NASA Astrophysics Data System (ADS)

    Zhang, Wei; Geng, Yu; Hou, Changlun; Yang, Guoguang; Bai, Jian

    2008-11-01

    Grating Light Valve (GLV) is a kind of optics device based on Micro-Opto-Electro-Mechanical System (MOEMS) technology, utilizing diffraction principle to switch, attenuate and modulate light. In this paper, traditional GLV device's structure and its working principle are illuminated, and a kind of modified GLV structure is presented, with details introduction of the fabrication technology. The GLV structure includes single crystal silicon substrate, silicon dioxide isolating layer, aluminum layer of fixed ribbons and silicon nitride of movable ribbons. In the fabrication, lots of techniques are adopted, such as low-pressure chemical vapor deposition (LPCVD), photolithography, etching and evaporation. During the fabrication processes, Photolithography is a fundamental and fatal technology, which determines etching result and GLV quality. Some methods are proposed through repeated experiments, to improve etching result greatly and guide the practical application. This kind of GLV device can be made both small and inexpensively, and has been tested to show proper range of actuation under DC bias, with good performance. The GLV device also has merits such as low cost, simple technology, high fill ratio and low driving voltage. It can properly be well used and match the demands of high light power needed in laser phototypesetting system, as a high-speed, high-resolution light modulator.

  13. Orbit Transfer Rocket Engine Technology Program: Advanced engine study, task D.1/D.3

    NASA Technical Reports Server (NTRS)

    Martinez, A.; Erickson, C.; Hines, B.

    1986-01-01

    Concepts for space maintainability of OTV engines were examined. An engine design was developed which was driven by space maintenance requirements and by a failure mode and effects (FME) analysis. Modularity within the engine was shown to offer cost benefits and improved space maintenance capabilities. Space operable disconnects were conceptualized for both engine change-out and for module replacement. Through FME mitigation the modules were conceptualized to contain the least reliable and most often replaced engine components. A preliminary space maintenance plan was developed around a controls and condition monitoring system using advanced sensors, controls, and condition monitoring concepts. A complete engine layout was prepared satisfying current vehicle requirements and utilizing projected component advanced technologies. A technology plan for developing the required technology was assembled.

  14. White LEDs and modules in chip-on-board technology for general lighting

    NASA Astrophysics Data System (ADS)

    Hartmann, Paul; Wenzl, Franz P.; Sommer, Christian; Pachler, Peter; Hoschopf, Hans; Schweighart, Marko; Hartmann, Martin; Kuna, Ladislav; Jakopic, Georg; Leising, Guenther; Tasch, Stefan

    2006-08-01

    At present, light-emitting diode (LED) modules in various shapes are developed and designed for the general lighting, advertisement, emergency lighting, design and architectural markets. To compete with and to surpass the performance of traditional lighting systems, enhancement of Lumen output and the white light quality as well as the thermal management and the luminary integration are key factors for success. Regarding these issues, white LEDs based on the chip-on-board (COB) technology show pronounced advantages. State-of-the-art LEDs exploiting this technology are now ready to enter the general lighting segments. We introduce and discuss the specific properties of the Tridonic COB technology dedicated for general lighting. This technology, in combination with a comprehensive set of tools to improve and to enhance the Lumen output and the white light quality, including optical simulation, is the scaffolding for the application of white LEDs in emerging areas, for which an outlook will be given.

  15. Advanced Packaging Materials and Techniques for High Power TR Module: Standard Flight vs. Advanced Packaging

    NASA Technical Reports Server (NTRS)

    Hoffman, James Patrick; Del Castillo, Linda; Miller, Jennifer; Jenabi, Masud; Hunter, Donald; Birur, Gajanana

    2011-01-01

    The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires advances in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and compared to standard technologies.

  16. Advanced Artificial Intelligence Technology Testbed

    NASA Technical Reports Server (NTRS)

    Anken, Craig S.

    1993-01-01

    The Advanced Artificial Intelligence Technology Testbed (AAITT) is a laboratory testbed for the design, analysis, integration, evaluation, and exercising of large-scale, complex, software systems, composed of both knowledge-based and conventional components. The AAITT assists its users in the following ways: configuring various problem-solving application suites; observing and measuring the behavior of these applications and the interactions between their constituent modules; gathering and analyzing statistics about the occurrence of key events; and flexibly and quickly altering the interaction of modules within the applications for further study.

  17. Harnessing Information Technology to Inform Patients Facing Routine Decisions: Cancer Screening as a Test Case.

    PubMed

    Krist, Alex H; Woolf, Steven H; Hochheimer, Camille; Sabo, Roy T; Kashiri, Paulette; Jones, Resa M; Lafata, Jennifer Elston; Etz, Rebecca S; Tu, Shin-Ping

    2017-05-01

    Technology could transform routine decision making by anticipating patients' information needs, assessing where patients are with decisions and preferences, personalizing educational experiences, facilitating patient-clinician information exchange, and supporting follow-up. This study evaluated whether patients and clinicians will use such a decision module and its impact on care, using 3 cancer screening decisions as test cases. Twelve practices with 55,453 patients using a patient portal participated in this prospective observational cohort study. Participation was open to patients who might face a cancer screening decision: women aged 40 to 49 who had not had a mammogram in 2 years, men aged 55 to 69 who had not had a prostate-specific antigen test in 2 years, and adults aged 50 to 74 overdue for colorectal cancer screening. Data sources included module responses, electronic health record data, and a postencounter survey. In 1 year, one-fifth of the portal users (11,458 patients) faced a potential cancer screening decision. Among these patients, 20.6% started and 7.9% completed the decision module. Fully 47.2% of module completers shared responses with their clinician. After their next office visit, 57.8% of those surveyed thought their clinician had seen their responses, and many reported the module made their appointment more productive (40.7%), helped engage them in the decision (47.7%), broadened their knowledge (48.1%), and improved communication (37.5%). Many patients face decisions that can be anticipated and proactively facilitated through technology. Although use of technology has the potential to make visits more efficient and effective, cultural, workflow, and technical changes are needed before it could be widely disseminated. © 2017 Annals of Family Medicine, Inc.

  18. High-speed, Low Voltage, Miniature Electro-optic Modulators Based on Hybrid Photonic-Crystal/Polymer/Sol-Gel Technology

    DTIC Science & Technology

    2012-02-01

    code) 01/02/2012 FINAL 15/11/2008 - 15/11/2011 High-speed, Low Voltage, Miniature Electro - optic Modulators Based on Hybrid Photonic-Crystal/Polymer... optic modulator, silicon photonics, integrated optics, electro - optic polymer, avionics, optical communications, sol-gel, nanotechnology U U U UU 25...2011 Program Manager: Dr. Charles Y-C Lee High-speed, Low Voltage, Miniature Electro - optic Modulators Based on Hybrid Photonic-Crystal/Polymer/Sol

  19. Traumatic Brain Injury: A Guide for Caregivers of Service Members and Veterans. Welcome

    DTIC Science & Technology

    2010-04-01

    Reed Army Medical Center, 33 percent had traumatic brain injury (as of March 2009). Due to medical and technological advances, we have seen a...Right to Appeal PEB Decision - Module 4, pages 139-141 PEG Tube (Per Cutaneous Gastronomy Tube) - Module 1, page 23 PRC (VA Polytrauma Rehabilitation...Per Cutaneous Gastronomy Tube (PEG tube) - Module 1, page 23 Peripheral Fatigue - Module 2, page 17 IN D EX 29 Permanent Disability Retired List (PDRL

  20. A RFID specific participatory design approach to support design and implementation of real-time location systems in the operating room.

    PubMed

    Guédon, A C P; Wauben, L S G L; de Korne, D F; Overvelde, M; Dankelman, J; van den Dobbelsteen, J J

    2015-01-01

    Information technology, such as real-time location (RTL) systems using Radio Frequency IDentification (RFID) may contribute to overcome patient safety issues and high costs in healthcare. The aim of this work is to study if a RFID specific Participatory Design (PD) approach supports the design and the implementation of RTL systems in the Operating Room (OR). A RFID specific PD approach was used to design and implement two RFID based modules. The Device Module monitors the safety status of OR devices and the Patient Module tracks the patients' locations during their hospital stay. The PD principles 'multidisciplinary team', 'participation users (active involvement)' and 'early adopters' were used to include users from the RFID company, the university and the hospital. The design and implementation process consisted of two 'structured cycles' ('iterations'). The effectiveness of this approach was assessed by the acceptance in terms of level of use, continuity of the project and purchase. The Device Module included eight strategic and twelve tactical actions and the Patient Module included six strategic and twelve tactical actions. Both modules are now used on a daily basis and are purchased by the hospitals for continued use. The RFID specific PD approach was effective in guiding and supporting the design and implementation process of RFID technology in the OR. The multidisciplinary teams and their active participation provided insights in the social and the organizational context of the hospitals making it possible to better fit the technology to the hospitals' (future) needs.

  1. Nuclear Technology. Course 32: Nondestructive Examination (NDE) Techniques II. Module 32-1, Fundamentals of Ultrasonic Testing.

    ERIC Educational Resources Information Center

    Spaulding, Bruce

    This first in a series of six modules for a course titled Nondestructive Examination (NDE) Techniques II introduces the student/trainee to the basic behavior of ultrasound, describes ultrasonic test equipment, and outlines the principal methods of ultrasonic testing. The module follows a typical format that includes the following sections: (1)…

  2. Overview of EO polymers and polymer modulator stability

    NASA Astrophysics Data System (ADS)

    Lindsay, Geoffrey A.; Ashley, Paul R.; Guenther, Andrew P.; Sanghadasa, Mohan

    2005-09-01

    This is a brief overview of the technology of nonlinear optical polymers (NLOP) and their use in electro-optic (EO) modulators. This paper also covers preliminary results from the authors' laboratories on highly active CLD- and FTC-type chromophores in guest-host films of APC amorphous polycarbonate. Emphasis will be given to thermal stability and long-term EO modulator aging.

  3. Supply Constraints Analysis | Energy Analysis | NREL

    Science.gov Websites

    module cost, and future price could be critical to the economic viability of this PV technology. Even constraints on future CdTe PV module deployment and found that: CdTe PV modules can remain cost-competitive and 4070 GW of annual CdTe production by 2030. Cost estimates were based on NREL's manufacturing cost

  4. Anatomy and Physiology. Module Set II: Major Body Systems. Teacher Edition [and] Student Edition. Surgical Technology.

    ERIC Educational Resources Information Center

    Hilley, Robert

    This document, which is the second part of a two-part set of modules on anatomy and physiology for future surgical technicians, contains the teacher and student editions of an introduction to anatomy and physiology that consists of modules on the following body systems: integumentary system; skeletal system; muscular system; nervous system;…

  5. Technical Reliability Studies. EOS/ESD Technology Abstracts

    DTIC Science & Technology

    1982-01-01

    RESISTANT BIPOLAR TRANSISTOR DESIGN AND ITS APPLICATIONS TO LINEAR INTEGRATED CIRCUITS 16145 MODULE ELECTROSTATIC DISCHARGE SIMULATOR 15786 SOME...T.M. 16476 STATIC DISCHARGE MODELING TECHNIQUES FOR EVALUATION OF INTEGRATED (FET) CIRCUIT DESTRUCTION 16145 MODULE ELECTAOSTATIC DISCHARGE SIMULATOR...PLASTIC LSI CIRCUITS PRklE, L.A., II 16145 MODULE ELECTROSTATIC DISCHARGE SIMULATOR PRICE, R.D. 13455 EVALUATION OF PLASTIC LSI CIRCUITS PSHAENICH, A

  6. Autonomous mine detection system (AMDS) neutralization payload module

    NASA Astrophysics Data System (ADS)

    Majerus, M.; Vanaman, R.; Wright, N.

    2010-04-01

    The Autonomous Mine Detection System (AMDS) program is developing a landmine and explosive hazards standoff detection, marking, and neutralization system for dismounted soldiers. The AMDS Capabilities Development Document (CDD) has identified the requirement to deploy three payload modules for small robotic platforms: mine detection and marking, explosives detection and marking, and neutralization. This paper addresses the neutralization payload module. There are a number of challenges that must be overcome for the neutralization payload module to be successfully integrated into AMDS. The neutralizer must meet stringent size, weight, and power (SWaP) requirements to be compatible with a small robot. The neutralizer must be effective against a broad threat, to include metal and plastic-cased Anti-Personnel (AP) and Anti-Tank (AT) landmines, explosive devices, and Unexploded Explosive Ordnance (UXO.) It must adapt to a variety of threat concealments, overburdens, and emplacement methods, to include soil, gravel, asphalt, and concrete. A unique neutralization technology is being investigated for adaptation to the AMDS Neutralization Module. This paper will describe review this technology and how the other two payload modules influence its design for minimizing SWaP. Recent modeling and experimental efforts will be included.

  7. Blueprint for a microwave trapped ion quantum computer.

    PubMed

    Lekitsch, Bjoern; Weidt, Sebastian; Fowler, Austin G; Mølmer, Klaus; Devitt, Simon J; Wunderlich, Christof; Hensinger, Winfried K

    2017-02-01

    The availability of a universal quantum computer may have a fundamental impact on a vast number of research fields and on society as a whole. An increasingly large scientific and industrial community is working toward the realization of such a device. An arbitrarily large quantum computer may best be constructed using a modular approach. We present a blueprint for a trapped ion-based scalable quantum computer module, making it possible to create a scalable quantum computer architecture based on long-wavelength radiation quantum gates. The modules control all operations as stand-alone units, are constructed using silicon microfabrication techniques, and are within reach of current technology. To perform the required quantum computations, the modules make use of long-wavelength radiation-based quantum gate technology. To scale this microwave quantum computer architecture to a large size, we present a fully scalable design that makes use of ion transport between different modules, thereby allowing arbitrarily many modules to be connected to construct a large-scale device. A high error-threshold surface error correction code can be implemented in the proposed architecture to execute fault-tolerant operations. With appropriate adjustments, the proposed modules are also suitable for alternative trapped ion quantum computer architectures, such as schemes using photonic interconnects.

  8. Midstream Modulation of Technology: Governance from Within

    ERIC Educational Resources Information Center

    Fisher, Erik; Mahajan, Roop L.; Mitcham, Carl

    2006-01-01

    Public "upstream engagement" and other approaches to the social control of technology are currently receiving international attention in policy discourses around emerging technologies such as nanotechnology. To the extent that such approaches hold implications for research and development (R&D) activities, the distinct participation of scientists…

  9. Technology and Changing Lifestyles. Teacher's Guide. Preparing for Tomorrow's World.

    ERIC Educational Resources Information Center

    Iozzi, Louis A.

    "Technology and Changing Lifestyles" is one of the "Preparing for Tomorrow's World" (PTW) program modules. PTW is an interdisciplinary, future-oriented program incorporating information from the sciences and social sciences and addressing societal concerns which interface science/technology/society. The program promotes…

  10. SITE TECHNOLOGY CAPSULE: ROCHEM SEPARATION SYSTEMS, INC. - DISC TUBE MODULE TECHNOLOGY

    EPA Science Inventory

    SITE Program demonstration of the Rochem Disc Tube Module™(DTM) developed by Rochem Separations Systems, Inc. The demonstration test was conducted at the central landfill superfund site in Johnston, Rhode island in August, 1994. The DTM technology is an innovative membrane filt...

  11. Automotive Technology. Career Education Guide.

    ERIC Educational Resources Information Center

    Dependents Schools (DOD), Washington, DC. European Area.

    The curriculum guide is designed to provide students with realistic training in automotive technology theory and practice within the secondary educational framework and to prepare them for entry into an occupation or continuing postsecondary education. The learning modules are grouped into three areas: small engines, automotive technology, and…

  12. SMART- Small Motor AerRospace Technology

    NASA Astrophysics Data System (ADS)

    Balucani, M.; Crescenzi, R.; Ferrari, A.; Guarrea, G.; Pontetti, G.; Orsini, F.; Quattrino, L.; Viola, F.

    2004-11-01

    This paper presents the "SMART" (Small Motor AerRospace Tecnology) propulsion system, constituted of microthrusters array realised by semiconductor technology on silicon wafers. SMART system is obtained gluing three main modules: combustion chambers, igniters and nozzles. The module was then filled with propellant and closed by gluing a piece of silicon wafer in the back side of the combustion chambers. The complete assembled module composed of 25 micro- thrusters with a 3 x 5 nozzle is presented. The measurement showed a thrust of 129 mN and impulse of 56,8 mNs burning about 70mg of propellant for the micro-thruster with nozzle and a thrust of 21 mN and impulse of 8,4 mNs for the micro-thruster without nozzle.

  13. Synthetic biology for microbial heavy metal biosensors.

    PubMed

    Kim, Hyun Ju; Jeong, Haeyoung; Lee, Sang Jun

    2018-02-01

    Using recombinant DNA technology, various whole-cell biosensors have been developed for detection of environmental pollutants, including heavy metal ions. Whole-cell biosensors have several advantages: easy and inexpensive cultivation, multiple assays, and no requirement of any special techniques for analysis. In the era of synthetic biology, cutting-edge DNA sequencing and gene synthesis technologies have accelerated the development of cell-based biosensors. Here, we summarize current technological advances in whole-cell heavy metal biosensors, including the synthetic biological components (bioparts), sensing and reporter modules, genetic circuits, and chassis cells. We discuss several opportunities for improvement of synthetic cell-based biosensors. First, new functional modules must be discovered in genome databases, and this knowledge must be used to upgrade specific bioparts through molecular engineering. Second, modules must be assembled into functional biosystems in chassis cells. Third, heterogeneity of individual cells in the microbial population must be eliminated. In the perspectives, the development of whole-cell biosensors is also discussed in the aspects of cultivation methods and synthetic cells.

  14. Bitsy Thinks Big

    NASA Technical Reports Server (NTRS)

    2001-01-01

    AeroAstro, of Herndon, Virginia, developed a nanospacecraft core module capable of developing recyclable spacecraft designs using standard interfaces. From this core module, known as the Bitsy(TM) kernel, custom spacecraft are able to connect mission-specific instruments and subsystems for variation in mission usage. The nanospacecraft core module may be used in conjunction with an existing microsatellite bus or customized to meet specific requirements. Building on this premise, AeroAstro has developed a line of satellite communications equipment, sun sensors, and Lithium-Ion batteries which are all incorporated in its complete line of mission-specific nanospacecraft. The Bitsy technology is also a key component in AeroAstro#s satellite inspection products and orbital transfer services. In the future, AeroAstro plans to market an even less expensive version of the Bitsy technology. The plan, which is targeted to universities, markets a sort of "satellite in a kit," for less than $1 million. This technology would allow universities to build true space hardware for a fraction of the cost of launching a regular satellite.

  15. Human Reproduction: Social and Technological Aspects. Innovations: The Social Consequences of Science and Technology Program.

    ERIC Educational Resources Information Center

    McConnell, Mary C.; And Others

    This module is part of an interdisciplinary program designed to educate the general citizenry regarding the issues of science/technology/society that have important consequences for both present and future social policies. Specifically, the program provides an opportunity for students to assess the effects of selected technological innovations in…

  16. Adaption of Space Station technology for lunar operations

    NASA Technical Reports Server (NTRS)

    Garvey, J. M.

    1988-01-01

    The possible use of Space Station technology in a lunar base program is discussed, focusing on the lunar lander/ascent vehicles and surface modules. The application of the Space Station data management system, software, and communications, tracking, guidance, navigation, control, and power technologies is examined. The benefits of utilizing this technology for lunar operations are considered.

  17. Modular high-voltage bias generator powered by dual-looped self-adaptive wireless power transmission.

    PubMed

    Xie, Kai; Huang, An-Feng; Li, Xiao-Ping; Guo, Shi-Zhong; Zhang, Han-Lu

    2015-04-01

    We proposed a modular high-voltage (HV) bias generator powered by a novel transmitter-sharing inductive coupled wireless power transmission technology, aimed to extend the generator's flexibility and configurability. To solve the problems caused through an uncertain number of modules, a dual-looped self-adaptive control method is proposed that is capable of tracking resonance frequency while maintaining a relatively stable induction voltage for each HV module. The method combines a phase-locked loop and a current feedback loop, which ensures an accurate resonance state and a relatively constant boost ratio for each module, simplifying the architecture of the boost stage and improving the total efficiency. The prototype was built and tested. The input voltage drop of each module is less than 14% if the module number varies from 3 to 10; resonance tracking is completed within 60 ms. The efficiency of the coupling structure reaches up to 95%, whereas the total efficiency approaches 73% for a rated output. Furthermore, this technology can be used in various multi-load wireless power supply applications.

  18. Mass production of silicon pore optics for ATHENA

    NASA Astrophysics Data System (ADS)

    Wille, Eric; Bavdaz, Marcos; Collon, Maximilien

    2016-07-01

    Silicon Pore Optics (SPO) provide high angular resolution with low effective area density as required for the Advanced Telescope for High Energy Astrophysics (Athena). The x-ray telescope consists of several hundreds of SPO mirror modules. During the development of the process steps of the SPO technology, specific requirements of a future mass production have been considered right from the beginning. The manufacturing methods heavily utilise off-the-shelf equipment from the semiconductor industry, robotic automation and parallel processing. This allows to upscale the present production flow in a cost effective way, to produce hundreds of mirror modules per year. Considering manufacturing predictions based on the current technology status, we present an analysis of the time and resources required for the Athena flight programme. This includes the full production process starting with Si wafers up to the integration of the mirror modules. We present the times required for the individual process steps and identify the equipment required to produce two mirror modules per day. A preliminary timeline for building and commissioning the required infrastructure, and for flight model production of about 1000 mirror modules, is presented.

  19. Fabrication of a TFF-Attached WDM-Type Triplex Transceiver Module Using Silica PLC Hybrid Integration Technology

    NASA Astrophysics Data System (ADS)

    Han, Young-Tak; Park, Yoon-Jung; Park, Sang-Ho; Shin, Jang-Uk; Lee, Chul-Wook; Ko, Hyunsung; Baek, Yongsoon; Park, Chul-Hee; Kwon, Yoon-Koo; Hwang, Wol-Yon; Oh, Kwang-Ryong; Sung, Heekyung

    2006-12-01

    An optical triplex transceiver (TRx) module, which consists of thin-film filter (TFF)-attached wavelength-division multiplexer (WDM) and photodiode (PD) carriers, has been fabricated using a silica planar lightwave circuit (PLC) hybrid integration technology. Two types of TFFs were attached to a diced sidewall of a silica-terraced PLC platform to realize the TFF-attached WDM. The PD carriers with a 45° mirror, on which receiving surface-illuminated PDs were bonded, were assembled with the PLC platform to form receiver (Rx) parts. As the main performances of the packaged TRx module, a very clear transmitter (Tx) eye pattern and minimum Rx sensitivity of -25.7 dBm were obtained under a 1.25-Gb/s Tx Rx operation for digital applications. For an analog Rx application, a module responsivity of about 0.8 A/W was achieved, and a second-order intermodulation distortion value of less than -70 dBc at an optical modulation index of 40% was obtained under a two-tone test of 400 and 450 MHz.

  20. Cold hybrid electronics for CIRS-Cassini

    NASA Astrophysics Data System (ADS)

    Picault, Robert; Royer, Michel; Vannier, Patrice; De Antoni, Philippe; Lapegue, Jacques; Quatrehomme, Franck

    1995-09-01

    Cassini/Huygens is a joint NASA/ESA planetary mission to the Saturnian system. Titan, the largest Saturn moon, is the major target of the mission. Cassini is the Saturn orbiter provided by NASA to be launched on October 1997. To reach planet Saturn in 2004 and to study the rings, the planet and its satellites, the Cassini/Huygens planetary mission, a NASA-JPL project, includes among 12 instruments, the composite infrared spectrometer (CIRS) with GSFC as prime contractor of this instrument. The French participants are the Service d'Astrophysique (SAp) of CEA-Saclay and the DESPA-Observatoire de Meudon. CEA/SAp is in charge of the focal plane 4 electronics (detector, cold preamplifier, and analog processing electronic). SAT has developed under a CEA-SAp contract the hybrid micro-circuit which ensures the preamplifying function. These transimpedance amplifiers operate at 170 K and consist of 10 channels. The input current from the detector is up to 60 nA (mainly background current, modulated by a signal in the pA-nA range) and is converted into voltage up to 1.2 V through a 20 M(Omega) feedback resistor. The noise is < 15 nV/(root)Hz. The stability of the resistors is expected to be 0.1% for a duration of 16 years. The lifetime reuqirement consists of: 1) ground storage: 3-4 years, 2) transfer orbit: 7 years (instrument not operating), 3) Saturnian orbit: 4-5 years (instrument operating) and more than 40 Saturn-centered orbits. The preamplifier hybrid is an operational amplifier using a resistor multichip substrate designed, manufactured, and selected according to ESA PSS and MIL applicable documents. This amplifier integrated circuit has been chosen taking into account its cold temperature electrical performance and on the basis of its radiation resistance to 100 krad (at 170 K and operating). The model philosophy includes 2 main deliveries: engineering models and flight/spare models. The evaluation program consists of the electrical testing of all component parameters at 293 K and 170 K, and lifetime tests (burn-in, thermal cycling). The preamplifier hybrids are mounted in packages, hermetically laser-sealed with dry gas atmosphere.

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