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Sample records for multilevel metallization interconnection

  1. Planarization of metal films for multilevel interconnects

    DOEpatents

    Tuckerman, David B.

    1987-01-01

    In the fabrication of multilevel integrated circuits, each metal layer is anarized by heating to momentarily melt the layer. The layer is melted by sweeping laser pulses of suitable width, typically about 1 microsecond duration, over the layer in small increments. The planarization of each metal layer eliminates irregular and discontinuous conditions between successive layers. The planarization method is particularly applicable to circuits having ground or power planes and allows for multilevel interconnects. Dielectric layers can also be planarized to produce a fully planar multilevel interconnect structure. The method is useful for the fabrication of VLSI circuits, particularly for wafer-scale integration.

  2. Planarization of metal films for multilevel interconnects

    DOEpatents

    Tuckerman, David B.

    1989-01-01

    In the fabrication of multilevel integrated circuits, each metal layer is anarized by heating to momentarily melt the layer. The layer is melted by sweeping laser pulses of suitable width, typically about 1 microsecond duration, over the layer in small increments. The planarization of each metal layer eliminates irregular and discontinuous conditions between successive layers. The planarization method is particularly applicable to circuits having ground or power planes and allows for multilevel interconnects. Dielectric layers can also be planarized to produce a fully planar multilevel interconnect structure. The method is useful for the fabrication of VLSI circuits, particularly for wafer-scale integration.

  3. Planarization of metal films for multilevel interconnects

    DOEpatents

    Tuckerman, D.B.

    1985-06-24

    In the fabrication of multilevel integrated circuits, each metal layer is planarized by heating to momentarily melt the layer. The layer is melted by sweeping lase pulses of suitable width, typically about 1 microsecond duration, over the layer in small increments. The planarization of each metal layer eliminates irregular and discontinuous conditions between successive layers. The planarization method is particularly applicable to circuits having ground or power planes and allows for multilevel interconnects. Dielectric layers can also be planarized to produce a fully planar multilevel interconnect structure. The method is useful for the fabrication of VLSI circuits, particularly for wafer-scale integration.

  4. Planarization of metal films for multilevel interconnects

    DOEpatents

    Tuckerman, D.B.

    1985-08-23

    In the fabrication of multilevel integrated circuits, each metal layer is planarized by heating to momentarily melt the layer. The layer is melted by sweeping laser pulses of suitable width, typically about 1 microsecond duration, over the layer in small increments. The planarization of each metal layer eliminates irregular and discontinuous conditions between successive layers. The planarization method is particularly applicable to circuits having ground or power planes and allows for multilevel interconnects. Dielectric layers can also be planarized to produce a fully planar multilevel interconnect structure. The method is useful for the fabrication of VLSI circuits, particularly for wafer-scale integration.

  5. Pulsed laser planarization of metal films for multilevel interconnects

    SciTech Connect

    Tuckerman, D.B.; Schmitt, R.L.

    1985-05-01

    Multilevel interconnect schemes for integrated circuits generally require one or more planarization steps, in order to maintain an acceptably flat topography for lithography and thin-film step coverage on the higher levels. Traditional approaches have involved planarization of the interlevel insulation (dielectric) layers, either by spin-on application (e.g., polyimide), or by reflow (e.g., phosphosilicate glass). We have pursued an alternative approach, in which each metal level is melted (hence planarized) using a pulsed laser prior to patterning. Short (approx.1 ..mu..s) pulses are used to preclude undesirable metallurgical reactions between the film, adhesion or barrier layer, and dielectric layer. Laser planarization of metals is particularly well suited to multilevel systems which include ground or power planes. Results are presented for planarization of gold films on SiO/sub 2/ dielectric layers using a flashlamp-pumped dye laser. The pulse duration is approx.1 ..mu..s, which allows the heat pulse to uniformly penetrate the gold while not penetrating substantially through the underlying SiO/sub 2/ (hence not perturbing the lower levels of metal). Excellent planarization of the gold films is achieved (less than 0.1 ..mu..m surface roughness, even starting with extreme topographic variations), as well as improved conductivity. To demonstrate the process, numerous planarized two-layer structures (transmission lines under a ground plane) were fabricated and characterized. 9 refs., 2 figs.

  6. Planarization of metal films for multilevel interconnects by pulsed laser heating

    DOEpatents

    Tuckerman, David B.

    1987-01-01

    In the fabrication of multilevel integrated circuits, each metal layer is planarized by heating to momentarily melt the layer. The layer is melted by sweeping laser pulses of suitable width, typically about 1 microsecond duration, over the layer in small increments. The planarization of each metal layer eliminates irregular and discontinuous conditions between successive layers. The planarization method is particularly applicable to circuits having ground or power planes and allows for multilevel interconnects. Dielectric layers can also be planarized to produce a fully planar multilevel interconnect structure. The method is useful for the fabrication of VLSI circuits, particularly for wafer-scale integration.

  7. A novel multi-level interconnect scheme with air as low K inter-metal dielectric for ultradeep submicron application

    NASA Astrophysics Data System (ADS)

    Chen, Chung-Hui; Fang, Yean-Kuen; Lin, Chun-Sheng; Yang, Chih-Wei; Hsieh, Jang-Cheng

    2001-01-01

    In this letter, a novel multi-level interconnect scheme with air as the low K inter-metal dielectric for ultra large scale integrated circuit (ULSI) application in ultradeep submicron (UDSM) range is proposed. The detailed process integration with copper dual damascene processing is described. The feasibility of the scheme is examined by trimethylaluminum Raphael simulation for the effective dielectric constant and the cutoff frequency in a standard divide by three counter. The simulation results are also compared with these reported air gap formation technologies. The results show the developed multi-level interconnect system is suitable for UDSM application.

  8. Multilevel Dual Damascene copper interconnections

    NASA Astrophysics Data System (ADS)

    Lakshminarayanan, S.

    Copper has been acknowledged as the interconnect material for future generations of ICs to overcome the bottlenecks on speed and reliability present with the current Al based wiring. A new set of challenges brought to the forefront when copper replaces aluminum, have to be met and resolved to make it a viable option. Unit step processes related to copper technology have been under development for the last few years. In this work, the application of copper as the interconnect material in multilevel structures with SiO2 as the interlevel dielectric has been explored, with emphasis on integration issues and complete process realization. Interconnect definition was achieved by the Dual Damascene approach using chemical mechanical polishing of oxide and copper. The choice of materials used as adhesion promoter/diffusion barrier included Ti, Ta and CVD TiN. Two different polish chemistries (NH4OH or HNO3 based) were used to form the interconnects. The diffusion barrier was removed during polishing (in the case of TiN) or by a post CMP etch (as with Ti or Ta). Copper surface passivation was performed using boron implantation and PECVD nitride encapsulation. The interlevel dielectric way composed of a multilayer stack of PECVD SiO2 and SixNy. A baseline process sequence which ensured the mechanical and thermal compatibility of the different unit steps was first created. A comprehensive test vehicle was designed and test structures were fabricated using the process flow developed. Suitable modifications were subsequently introduced in the sequence as and when processing problems were encountered. Electrical characterization was performed on the fabricated devices, interconnects, contacts and vias. The structures were subjected to thermal stressing to assess their stability and performance. The measurement of interconnect sheet resistances revealed lower copper loss due to dishing on samples polished using HNO3 based slurry. Interconnect resistances remained stable upto 400o

  9. The MSFC complementary metal oxide semiconductor (including multilevel interconnect metallization) process handbook

    NASA Technical Reports Server (NTRS)

    Bouldin, D. L.; Eastes, R. W.; Feltner, W. R.; Hollis, B. R.; Routh, D. E.

    1979-01-01

    The fabrication techniques for creation of complementary metal oxide semiconductor integrated circuits at George C. Marshall Space Flight Center are described. Examples of C-MOS integrated circuits manufactured at MSFC are presented with functional descriptions of each. Typical electrical characteristics of both p-channel metal oxide semiconductor and n-channel metal oxide semiconductor discrete devices under given conditions are provided. Procedures design, mask making, packaging, and testing are included.

  10. Multi-level interconnects for heterojunction bipolar transistor integrated circuit technologies

    SciTech Connect

    Patrizi, G.A.; Lovejoy, M.L.; Schneider, R.P. Jr.; Hou, H.Q.; Enquist, P.M.

    1995-12-31

    Heterojunction bipolar transistors (HBTs) are mesa structures which present difficult planarization problems in integrated circuit fabrication. The authors report a multilevel metal interconnect technology using Benzocyclobutene (BCB) to implement high-speed, low-power photoreceivers based on InGaAs/InP HBTs. Processes for patterning and dry etching BCB to achieve smooth via holes with sloped sidewalls are presented. Excellent planarization of 1.9 {micro}m mesa topographies on InGaAs/InP device structures is demonstrated using scanning electron microscopy (SEM). Additionally, SEM cross sections of both the multi-level metal interconnect via holes and the base emitter via holes required in the HBT IC process are presented. All via holes exhibit sloped sidewalls with slopes of 0.4 {micro}m/{micro}m to 2 {micro}m/{micro}m which are needed to realize a robust interconnect process. Specific contact resistances of the interconnects are found to be less than 6 {times} 10{sup {minus}8} {Omega}cm{sup 2}. Integrated circuits utilizing InGaAs/InP HBTs are fabricated to demonstrate the applicability and compatibility of the multi-level interconnect technology with integrated circuit processing.

  11. CONDENSED MATTER: STRUCTURE, THERMAL AND MECHANICAL PROPERTIES: A novel analytical thermal model for multilevel nano-scale interconnects considering the via effect

    NASA Astrophysics Data System (ADS)

    Zhu, Zhang-Ming; Li, Ru; Hao, Bao-Tian; Yang, Yin-Tang

    2009-11-01

    Based on the heat diffusion equation of multilevel interconnects, a novel analytical thermal model for multilevel nano-scale interconnects considering the via effect is presented, which can compute quickly the temperature of multilevel interconnects, with substrate temperature given. Based on the proposed model and the 65 nm complementary metal oxide semiconductor (CMOS) process parameter, the temperature of nano-scale interconnects is computed. The computed results show that the via effect has a great effect on local interconnects, but the reduction of thermal conductivity has little effect on local interconnects. With the reduction of thermal conductivity or the increase of current density, however, the temperature of global interconnects rises greatly, which can result in a great deterioration in their performance. The proposed model can be applied to computer aided design (CAD) of very large-scale integrated circuits (VLSIs) in nano-scale technologies.

  12. Laser printing of 3D metallic interconnects

    NASA Astrophysics Data System (ADS)

    Beniam, Iyoel; Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Raymond C. Y.; Piqué, Alberto

    2016-04-01

    The use of laser-induced forward transfer (LIFT) techniques for the printing of functional materials has been demonstrated for numerous applications. The printing gives rise to patterns, which can be used to fabricate planar interconnects. More recently, various groups have demonstrated electrical interconnects from laser-printed 3D structures. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or of pastes containing dispersed metallic particles. However, the generated 3D structures do not posses the same metallic conductivity as a bulk metal interconnect of the same cross-section and length as those formed by wire bonding or tab welding. An alternative is to laser transfer entire 3D structures using a technique known as lase-and-place. Lase-and-place is a LIFT process whereby whole components and parts can be transferred from a donor substrate onto a desired location with one single laser pulse. This paper will describe the use of LIFT to laser print freestanding, solid metal foils or beams precisely over the contact pads of discrete devices to interconnect them into fully functional circuits. Furthermore, this paper will also show how the same laser can be used to bend or fold the bulk metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief for the circuits under flexing or during motion from thermal mismatch. These interconnect "ridges" can span wide gaps (on the order of a millimeter) and accommodate height differences of tens of microns between adjacent devices. Examples of these laser printed 3D metallic bridges and their role in the development of next generation electronics by additive manufacturing will be presented.

  13. Recent Development of SOFC Metallic Interconnect

    SciTech Connect

    Wu JW, Liu XB

    2010-04-01

    Interest in solid oxide fuel cells (SOFC) stems from their higher e±ciencies and lower levels of emitted pollu- tants, compared to traditional power production methods. Interconnects are a critical part in SOFC stacks, which connect cells in series electrically, and also separate air or oxygen at the cathode side from fuel at the anode side. Therefore, the requirements of interconnects are the most demanding, i:e:, to maintain high elec- trical conductivity, good stability in both reducing and oxidizing atmospheres, and close coe±cient of thermal expansion (CTE) match and good compatibility with other SOFC ceramic components. The paper reviewed the interconnect materials, and coatings for metallic interconnect materials.

  14. Metallic Nanowire Interconnections for Integrated Circuit Fabrication

    NASA Technical Reports Server (NTRS)

    Ng, Hou Tee (Inventor); Li, Jun (Inventor); Meyyappan, Meyya (Inventor)

    2007-01-01

    A method for fabricating an electrical interconnect between two or more electrical components. A conductive layer is provided on a substarte and a thin, patterned catalyst array is deposited on an exposed surface of the conductive layer. A gas or vapor of a metallic precursor of a metal nanowire (MeNW) is provided around the catalyst array, and MeNWs grow between the conductive layer and the catalyst array. The catalyst array and a portion of each of the MeNWs are removed to provide exposed ends of the MeNWs.

  15. SEMICONDUCTOR TECHNOLOGY Development of spin-on-glass process for triple metal interconnects

    NASA Astrophysics Data System (ADS)

    Li, Peng; Wenbin, Zhao; Guozhang, Wang; Zongguang, Yu

    2010-12-01

    Spin-on-glass (SOG), an interlayer dielectric material applied in liquid form to fill narrow gaps in the sub-dielectric surface and thus conducive to planarization, is an alternative to silicon dioxide (SiO2) deposited using PECVD processes. However, its inability to adhere to metal and problems such as cracking prevent the easy application of SOG technology to provide an interlayer dielectric in multilevel metal interconnect circuits, particularly in university processing labs. This paper will show that a thin layer of CVD SiO2 and a curing temperature below the sintering temperature of the metal interconnect layer will promote adhesion, reduce gaps, and prevent cracking. Electron scanning microscope analysis has been used to demonstrate the success of the improved technique. This optimized process has been used in batches of double-poly, triple-metal CMOS wafer fabrication to date.

  16. Maskless laser writing of microscopic metallic interconnects

    DOEpatents

    Maya, Leon

    1995-01-01

    A method of forming a metal pattern on a substrate. The method includes depositing an insulative nitride film on a substrate and irradiating a laser beam onto the nitride film, thus decomposing the metal nitride into a metal constituent and a gaseous constituent, the metal constituent remaining in the nitride film as a conductive pattern.

  17. Maskless laser writing of microscopic metallic interconnects

    DOEpatents

    Maya, L.

    1995-10-17

    A method of forming a metal pattern on a substrate is disclosed. The method includes depositing an insulative nitride film on a substrate and irradiating a laser beam onto the nitride film, thus decomposing the metal nitride into a metal constituent and a gaseous constituent, the metal constituent remaining in the nitride film as a conductive pattern. 4 figs.

  18. Scaling of Metal Interconnects: Challenges to Functionality and Reliability

    SciTech Connect

    Engelhardt, M.; Schindler, G.; Traving, M.; Stich, A.; Gabric, Z.; Pamler, W.; Hoenlein, W.

    2006-02-07

    Copper-based nano interconnects featuring CDs well beyond today's chip generations and air gap structures were fabricated and subjected to electrical characterization and tests to get already today insight on functionality and reliability aspects of metallization schemes in future semiconductor products. Size effects observed already in today's advanced products will definitely limit the resistivity in future interconnects. Copper diffusion barrier layers were scaled down to the 1nm regime of thicknesses without observable degradation effects regarding adhesion properties and functionality. Interconnect reliability was found to decrease with decreasing barrier thickness. Worst results regarding adhesion properties and interconnect reliability were obtained for vanishing barrier thickness which promotes unrestricted mass flow of copper along the interconnect line. Air gaps were developed and characterized as an alternative approach to porous ultra low-k materials. They allowed the realization of effective k-values of the insulation of 2.4, which meet requirements of chip generations far in the future, while avoiding the integration issues associated with these soft materials. First reliability results obtained with air gaps are comparable with those obtained on full structures. Whereas leakage current behavior with electrical field strength expected to be present between neighboring lines in chip generations during the next 10 years were similar for air gaps and oxide, interconnects insulated by air gaps displayed lower breakdown fields than those insulated by oxide.

  19. Interconnected hollow carbon nanospheres for stable lithium metal anodes.

    PubMed

    Zheng, Guangyuan; Lee, Seok Woo; Liang, Zheng; Lee, Hyun-Wook; Yan, Kai; Yao, Hongbin; Wang, Haotian; Li, Weiyang; Chu, Steven; Cui, Yi

    2014-08-01

    For future applications in portable electronics, electric vehicles and grid storage, batteries with higher energy storage density than existing lithium ion batteries need to be developed. Recent efforts in this direction have focused on high-capacity electrode materials such as lithium metal, silicon and tin as anodes, and sulphur and oxygen as cathodes. Lithium metal would be the optimal choice as an anode material, because it has the highest specific capacity (3,860 mAh g(-1)) and the lowest anode potential of all. However, the lithium anode forms dendritic and mossy metal deposits, leading to serious safety concerns and low Coulombic efficiency during charge/discharge cycles. Although advanced characterization techniques have helped shed light on the lithium growth process, effective strategies to improve lithium metal anode cycling remain elusive. Here, we show that coating the lithium metal anode with a monolayer of interconnected amorphous hollow carbon nanospheres helps isolate the lithium metal depositions and facilitates the formation of a stable solid electrolyte interphase. We show that lithium dendrites do not form up to a practical current density of 1 mA cm(-2). The Coulombic efficiency improves to ∼ 99% for more than 150 cycles. This is significantly better than the bare unmodified samples, which usually show rapid Coulombic efficiency decay in fewer than 100 cycles. Our results indicate that nanoscale interfacial engineering could be a promising strategy to tackle the intrinsic problems of lithium metal anodes.

  20. Fabrication of Ultralow Density Interconnected Pure Metal Foams

    NASA Astrophysics Data System (ADS)

    Burks, Edward C.; Gilbert, Dustin A.; Liu, Kai; Kucheyev, Sergei O.; Colvin, Jeffrey D.; Felter, Thomas E.

    Ultra-low density metallic nanostructures have been shown to possess interesting thermal, electrical, magnetic, chemical and mechanical properties due to their extremely high surface areas, nanoscale geometries and high porosities. Here we report the synthesis of pure metal foams using interconnected metallic nanowires with densities as low as 0.1% of their bulk density that are still mechanically stable. The highly porous monoliths are macroscopic in size (several mm) and can be created in a wide variety of shapes for application-specific needs. Preliminary studies of such metal foams have already revealed fascinating mechanical and magnetic properties, since the physical dimensions of the foams are below some of the basic length scales that govern the material properties. These foams have been used as targets for ultrabright x-ray sources. They also have a wide variety of other potential applications such as photovoltaic devices, supercapacitors, catalysts, coatings, fuel cells, etc. This work has been supported by DTRA #BRCALL08-Per3-C-2-0006, and in part by NSF DMR-1008791 and DMR-1543582. Work at LLNL was performed under the auspices of the U.S. DOE by LLNL under Contract DE-AC52-07NA27344.

  1. Dual-environment effects on the oxidation of metallic interconnects

    SciTech Connect

    Holcomb, G.R.; Ziomek-Moroz, M.; Covino, B.S., Jr.; Bullard, S.J.

    2006-08-01

    Metallic interconnects in solid oxide fuel cells are exposed to a dual environment: fuel on one side (i.e., H2 gas) and oxidizer on the other side (i.e., air). It has been observed that the oxidation behavior of thin stainless steel sheet in air is changed by the presence of H2 on the other side of the sheet. The resulting dual-environment scales are flaky and more friable than the single-environment scales. The H2 disrupts the scale on the air side. A model to explain some of the effects of a dual environment is presented where hydrogen diffusing through the stainless steel sheet reacts with oxygen diffusing through the scale to form water vapor, which has sufficient vapor pressure to mechanically disrupt the scale. Experiments on preoxidized 316L stainless steel tubing exposed to air-air, H2-air, and H2-Ar environments are reported in support of the model.

  2. Origin and prevention of high contact resistance in multilevel metal-polyimide structures

    NASA Astrophysics Data System (ADS)

    Day, David R.; Senturia, Stephen D.

    1982-05-01

    When polyimide is used as the insulating dielectric in multilevel-metal structures, a high contact resistance can result within the interconnecting vias. This paper examines the particular case of oxygen plasma patterning of the polyimide using a photoresist mask. Auger analysis in combination with compositional depth profiling was employed on a series of samples to measure surface composition of etched vias in polyimide. Results show two effects which, together, can account for high contact resistance: first, there is a thicker than normal aluminum oxide layer on the first level metal surface (due to exposure to the oxygen plasma); second, there is a thin, etch-resistant carbonaceous film (due to redeposition of organic material during plasma etching) that prevents oxide thinning through chemical means. It was found that by lowering the plasma pressure to 50 mTorr near the end of the etch, the organic film can be removed. In the absence of the carbonaceous layer, the oxide can then be chemically thinned to produce clean aluminum surfaces within the vias.

  3. Tight interconnection and multi-level control of Arabidopsis MYB44 in MAPK cascade signalling.

    PubMed

    Persak, Helene; Pitzschke, Andrea

    2013-01-01

    Abiotic stress poses a huge, ever-increasing problem to plants and agriculture. The dissection of signalling pathways mediating stress tolerance is a prerequisite to develop more resistant plant species. Mitogen-activated protein kinase (MAPK) cascades are universal signalling modules. In Arabidopsis, the MAPK MPK3 and its upstream regulator MAPK kinase MKK4 initiate the adaptation response to numerous abiotic and biotic stresses. Yet, molecular steps directly linked with MKK4-MPK3 activation are largely unknown. Starting with a yeast-two-hybrid screen for interacting partners of MKK4, we identified a transcription factor, MYB44. MYB44 is controlled at multiple levels by and strongly inter-connected with MAPK signalling. As we had shown earlier, stress-induced expression of the MYB44 gene is regulated by a MPK3-targeted bZIP transcription factor VIP1. At the protein level, MYB44 interacts with MPK3 in vivo. MYB44 is phosphorylated by MPK3 in vitro at a single residue, Ser145. Although replacement of Ser145 by a non-phosphorylatable (S145A) or phosphomimetic (S145D) residue did not alter MYB44 subcellular localisation, dimerization behaviour nor DNA-binding characteristics, abiotic stress tolerance tests in stable transgenic Arabidopsis plants clearly related S145 phosphorylation to MYB44 function: Compared to Arabidopsis wild type plants, MYB44 overexpressing lines exhibit an enhanced tolerance to osmotic stress and are slightly more sensitive to abscisic acid. Interestingly, overexpression of the S145A variant revealed that impaired phosphorylation does not render the MYB44 protein non-functional. Instead, S145A lines are highly sensitive to abiotic stress, and thereby remarkably similar to mpk3-deficient plants. Its in vivo interaction with the nuclear sub-pools of both MPK3 and MKK4 renders MYB44 the first plant transcription factor to have a second function as putative MAPK cascade scaffolding protein.

  4. Dual Environment Effects on the Oxidation of Metallic Interconnects

    SciTech Connect

    Holcomb, Gordon R.; Ziomek-Moroz, Malgorzata; Cramer, Stephen D.; Covino, Jr., Bernard S.; and Bullard, Sophie J.

    2004-10-20

    Metallic interconnects in solid oxide fuel cells are exposed to a dual environment: fuel on one side (i.e. H2 gas) and oxidizer on the other side (i.e. air). It has been observed that the oxidation behavior of thin stainless steel sheet in air is changed by the presence of H2 on the other side of the sheet. The resulting dual environment scales are flaky and more friable than the single environment scales. The H2 disrupts the scale on the air-side. A model to explain some of the effects of a dual environment is presented where hydrogen diffusing through the stainless steel sheet reacts with oxygen diffusing through the scale to form water vapor, which has sufficient vapor pressure to mechanically disrupt the scale. Experiments on preoxidized 316L stainless steel tubing exposed to air/air, H2/air, and H2/Ar environments are reported in support of the model.

  5. Study of metallic materials for solid oxide fuel cell interconnect applications.

    SciTech Connect

    Natesan, K.; Zeng, Z.; Nuclear Engineering Division

    2009-04-24

    Metallic interconnect acts as a gas separator and a gas distributor and therefore, it needs to function adequately in two widely different environments. The interconnect material will be exposed to air on one side and natural gas or coal-derived synthesis gas on the other side. The viable material for the interconnect application must be resistant not only to oxidation but also carburization in hydrocarbon containing low-oxygen environments. In addition, the scales that develop on the exposed surfaces must possess adequate electrical conductivity for them to function as current leads over long service life of the fuel cell. This report addresses five topics of interest for the development of metallic interconnects with adequate performance in fuel cells for long service life. The research conducted over the years and the conclusions reached were used to identify additional areas of research on materials for improved performance of components, especially metallic interconnects, in the complex fuel cell environments. This report details research conducted in the following areas: measurement of area specific electrical resistivity, corrosion performance in dual gas environments by experiments using alloy 446, long term corrosion performance of ferritic and austenitic alloys in hydrogen and methane-reformed synthesis fuel-gas environments, approaches to reduce the area resistance of metallic interconnect, and reduction of electrical resistivity of alumina scales on metallic interconnect. Based on the key requirements for metallic interconnects and the data developed on the corrosion behavior of candidate materials in meeting those requirements, several areas are recommended for further research to develop metallic interconnects with acceptable and reliable long-term performance in solid oxide fuel cells.

  6. Characterization of nanostructured metals and metal nanowires for chip-to-package interconnections

    NASA Astrophysics Data System (ADS)

    Bansal, Shubhra

    The Packaging Research Center at Georgia Tech is proposing nano-interconnections as a new interconnect paradigm for potential low-cost, highest performance and reliability. The idea is to use nanocrystalline (nc) metals and metal nanowires as potential interconnect materials with good mechanical properties and shortest electrical interconnection. The goal of the present work is to determine, as closely as possible, the intrinsic electrical and mechanical behavior of nc- metals and metal nanowires to assess the suitability of these materials for off-chip interconnections. In this study, the microstructural stability, creep, fatigue and fracture properties of nanocrystalline copper and nickel (grain size ~ 50 nm) have been reported, in such depth, for the first time to the best of our knowledge. Fatigue life of nanostructured interconnects has also been computed through finite element models, and a clear advantage of using such a material has been demonstrated. Nanostructured copper interconnections exhibit better fatigue life as compared to microcrystalline copper interconnects at a pitch of 100 mum and lower. Nanocrystalline copper is quite stable upto 100°C whereas nickel is stable even upto 400°C. The activation energy of grain growth is 33.427 kJ/mol and 53.056 kJ/mol for ECAE nanocrystalline copper and nickel respectively. GB diffusion along with grain rotation and coalescence has been identified as the grain growth mechanism. Ultimate tensile and yield strength of nc- copper are 454 MPa and 438 MPa, respectively. These for nc- nickel are 898 MPa and 867 MPa, respectively. These values are at least 5 times higher than microcrystalline counterparts. Considerable amount of plastic deformation has been observed and the fracture is ductile in nature. Fracture surfaces show dimples much larger than grain size and stretching between dimples indicates localized plastic deformation. Nanoindentation hardness for nc- copper and nickel is 2.33 GPa and 3.92 GPa

  7. Metal Interconnects for Solid Oxide Fuel Cell Power Systems

    SciTech Connect

    S. Elangovan

    2006-04-01

    Interconnect development is identified by the US Department of energy as a key technical area requiring focused research to meet the performance and cost goals under the Solid State Energy Conversion Alliance initiative. In the Phase I SECA Core Technology Program, Ceramatec investigated a commercial ferritic stainless steel composition for oxidation resistance properties by measuring the weight gain when exposed to air at the fuel cell operating temperature. A pre-treatment process that results in a dense, adherent scale was found to reduce the oxide scale growth rate significantly. A process for coating the surface of the alloy in order to reduce the in-plane resistance and potentially inhibit chromium oxide evaporation was also identified. The combination of treatments provided a very low resistance through the scale. The resistance measured was as low as 10 milliohm-cm2 at 750 C in air. The oxide scale was also found to be stable in humidified air at 750 C. The resistance value was stable over several thermal cycles. A similar treatment and coating for the fuel side of the interconnect also showed an exceptionally low resistance of one milliohm-cm2 in humidified hydrogen at 750 c, and was stable through multiple thermal cycles. Measurement of interconnect resistance when it was exposed to both air and humidified hydrogen on opposite sides also showed low, stable resistance after additional modification to the pre-treatment process. Resistance stacks, using an interconnect stack with realistic gas flows, also provided favorable results. Chromium evaporation issue however requires testing of fuel stacks and was outside of the scope of this project. based on results to-date, the alloy selection and the treatment processes appear to be well suited for SOFC interconnect application.

  8. Determination of interfacial adhesion strength between oxide scale and substrate for metallic SOFC interconnects

    NASA Astrophysics Data System (ADS)

    Sun, X.; Liu, W. N.; Stephens, E.; Khaleel, M. A.

    The interfacial adhesion strength between the oxide scale and the substrate is crucial to the reliability and durability of metallic interconnects in solid oxide fuel cell (SOFC) operating environments. It is necessary, therefore, to establish a methodology to quantify the interfacial adhesion strength between the oxide scale and the metallic interconnect substrate, and furthermore to design and optimize the interconnect material as well as the coating materials to meet the design life of an SOFC system. In this paper, we present an integrated experimental/analytical methodology for quantifying the interfacial adhesion strength between the oxide scale and a ferritic stainless steel interconnect. Stair-stepping indentation tests are used in conjunction with subsequent finite element analyses to predict the interfacial strength between the oxide scale and Crofer 22 APU substrate.

  9. Electrical contacts between cathodes and metallic interconnects in solid oxide fuel cells

    NASA Astrophysics Data System (ADS)

    Yang, Zhenguo; Xia, Guanguang; Singh, Prabhakar; Stevenson, Jeffry W.

    In this work, simulated cathode/interconnect structures were used to investigate the effects of different contact materials on the contact resistance between a strontium doped lanthanum ferrite cathode and a Crofer22 APU interconnect. Among the materials studied, Pt, which has a prohibitive cost for the application, demonstrated the best performance as a contact paste. For the relatively cost-effective perovskites, the contact ASR was found to depend on their electrical conductivity, scale growth on the metallic interconnect, and interactions between the contact material and the metallic interconnect or particularly the scale grown on the interconnect. Manganites appeared to promote manganese-containing spinel interlayer formation that helped minimize the increase of contact ASR. Chromium from the interconnects reacted with strontium in the perovskites to form SrCrO 4. An improved performance was achieved by application of a thermally grown (Mn,Co) 3O 4 spinel protection layer on Crofer22 APU that dramatically minimized the contact resistance between the cathodes and interconnects.

  10. Effect of Interfacial characteristics of metal clad polymeric substrates on electrical high frequency interconnection performance

    NASA Technical Reports Server (NTRS)

    Bhasin, K. B.; Romanofsky, R. R.; Ponchak, G. E.; Liu, D. C.

    1984-01-01

    Etched metallic conductor lines on metal clad polymeric substrates are used for electronic component interconnections. Significant signal losses are observed for microstrip conductor lines used for interconnecting high frequency devices. At these frequencies, the electronic signal travels closer to the metal-polymer interface due to the skin effect. Copper-teflon interfaces were characterized by scanning electron microscopy (SEM) and Auger electron spectroscopy (AES) to determine the interfacial properties. Data relating roughness of the copper film to signal losses was compared to theory. Films used to enhance adhesion are found, to contribute to these losses.

  11. LaCrO{sub 3}-dispersed Cr for metallic interconnect of planar SOFC

    SciTech Connect

    Song, Rak-Hyun; Shin, Dong Ryul; Dokiya, Masayuki

    1996-12-31

    In the planar SOFC, the interconnect materials plays two roles as an electrical connection and as a gas separation plate in a cell stack. The interconnect materials must be chemically stable in reducing and oxidizing environments, and have high electronic conductivity, high thermal conductivity, matching thermal expansion with an electrolyte, high mechanical strength, good fabricability, and gas tightness. Lanthanum chromite so far has been mainly used as interconnect materials in planar SOFC. However, the ceramic materials are very weak in mechanical strength and have poor machining property as compared with metal. Also the metallic materials have high electronic conductivity and high thermal conductivity. Recently some researchers have studied metallic interconnects such as Al{sub 2}O{sub 3}/Inconel 600 cermet, Ni-20Cr coated with (LaSr)CoO{sub 3}, and Y{sub 2}O{sub 3-} or La{sub 2}O{sub 3}-dispersed Cr alloy. These alloys have still some problems because Ni-based alloys have high thermal expansion, the added Al{sub 2}O{sub 3}, Y{sub 2}O{sub 3} and La{sub 2}O{sub 3} to metals have no electronic conductivity, and the oxide formed on the surface of Cr alloy has high volatility. To solve these problems, in this study, LaCrO{sub 3}-dispersed Cr for metallic interconnect of planar SOFC was investigated. The LaCrO{sub 3}-dispersed Cr can be one candidate of metallic interconnect because LaCrO{sub 3} possesses electronic conductivity and Cr metal has relatively low thermal expansion. The content of 25 vol.% LaCrO{sub 3} Was selected on the basis of a theoretically calculated thermal expansion. The thermal expansion, electrical and oxidation properties were examined and the results were discussed as related to SOFC requirements.

  12. Super-stretchable metallic interconnects on polymer with a linear strain of up to 100%

    NASA Astrophysics Data System (ADS)

    Arafat, Yeasir; Dutta, Indranath; Panat, Rahul

    2015-08-01

    Metal interconnects in flexible and wearable devices are heterogeneous metal-polymer systems that are expected to sustain large deformation without failure. The principal strategy to make strain tolerant interconnect lines on flexible substrates has comprised of creating serpentine structures of metal films with either in-plane or out-of-plane waves, using porous substrates, or using highly ductile materials such as gold. The wavy and helical serpentine patterns preclude high-density packing of interconnect lines on devices, while ductile materials such as Au are cost prohibitive for real world applications. Ductile copper films can be stretched if bonded to the substrate, but show high level of cracking beyond few tens of % strain. In this paper, we demonstrate a material system consisting of Indium metal film over an elastomer (PDMS) with a discontinuous Cr layer such that the metal interconnect can be stretched to extremely high linear strain (up to 100%) without any visible cracks. Such linear strain in metal interconnects exceeds that reported in literature and is obtained without the use of any geometrical manipulations or porous substrates. Systematic experimentation is carried out to explain the mechanisms that allow the Indium film to sustain the high strain level without failure. The islands forming the discontinuous Cr layer are shown to move apart from each other during stretching without delamination, providing strong adhesion to the Indium film while accommodating the large strain in the system. The Indium film is shown to form surface wrinkles upon release from the large strain, confirming its strong adhesion to PDMS. A model is proposed based upon the observations that can explain the high level of stretch-ability of the Indium metal film over the PDMS substrate.

  13. Super-stretchable metallic interconnects on polymer with a linear strain of up to 100%

    SciTech Connect

    Arafat, Yeasir; Dutta, Indranath; Panat, Rahul

    2015-08-24

    Metal interconnects in flexible and wearable devices are heterogeneous metal-polymer systems that are expected to sustain large deformation without failure. The principal strategy to make strain tolerant interconnect lines on flexible substrates has comprised of creating serpentine structures of metal films with either in-plane or out-of-plane waves, using porous substrates, or using highly ductile materials such as gold. The wavy and helical serpentine patterns preclude high-density packing of interconnect lines on devices, while ductile materials such as Au are cost prohibitive for real world applications. Ductile copper films can be stretched if bonded to the substrate, but show high level of cracking beyond few tens of % strain. In this paper, we demonstrate a material system consisting of Indium metal film over an elastomer (PDMS) with a discontinuous Cr layer such that the metal interconnect can be stretched to extremely high linear strain (up to 100%) without any visible cracks. Such linear strain in metal interconnects exceeds that reported in literature and is obtained without the use of any geometrical manipulations or porous substrates. Systematic experimentation is carried out to explain the mechanisms that allow the Indium film to sustain the high strain level without failure. The islands forming the discontinuous Cr layer are shown to move apart from each other during stretching without delamination, providing strong adhesion to the Indium film while accommodating the large strain in the system. The Indium film is shown to form surface wrinkles upon release from the large strain, confirming its strong adhesion to PDMS. A model is proposed based upon the observations that can explain the high level of stretch-ability of the Indium metal film over the PDMS substrate.

  14. Multilevel radiative thermal memory realized by the hysteretic metal-insulator transition of vanadium dioxide

    NASA Astrophysics Data System (ADS)

    Ito, Kota; Nishikawa, Kazutaka; Iizuka, Hideo

    2016-02-01

    Thermal information processing is attracting much interest as an analog of electronic computing. We experimentally demonstrated a radiative thermal memory utilizing a phase change material. The hysteretic metal-insulator transition of vanadium dioxide (VO2) allows us to obtain a multilevel memory. We developed a Preisach model to explain the hysteretic radiative heat transfer between a VO2 film and a fused quartz substrate. The transient response of our memory predicted by the Preisach model agrees well with the measured response. Our multilevel thermal memory paves the way for thermal information processing as well as contactless thermal management.

  15. Bipolar plating of metal contacts onto oxide interconnection for solid oxide electrochemical cell

    DOEpatents

    Isenberg, Arnold O.

    1987-01-01

    Disclosed is a method of forming an adherent metal deposit on a conducting layer of a tube sealed at one end. The tube is immersed with the sealed end down into an aqueous solution containing ions of the metal to be deposited. An ionically conducting aqueous fluid is placed inside the tube and a direct current is passed from a cathode inside the tube to an anode outside the tube. Also disclosed is a multi-layered solid oxide fuel cell tube which consists of an inner porous ceramic support tube, a porous air electrode covering the support tube, a non-porous electrolyte covering a portion of the air electrode, a non-porous conducting interconnection covering the remaining portion of the electrode, and a metal deposit on the interconnection.

  16. Bipolar plating of metal contacts onto oxide interconnection for solid oxide electrochemical cell

    DOEpatents

    Isenberg, A.O.

    1987-03-10

    Disclosed is a method of forming an adherent metal deposit on a conducting layer of a tube sealed at one end. The tube is immersed with the sealed end down into an aqueous solution containing ions of the metal to be deposited. An ionically conducting aqueous fluid is placed inside the tube and a direct current is passed from a cathode inside the tube to an anode outside the tube. Also disclosed is a multi-layered solid oxide fuel cell tube which consists of an inner porous ceramic support tube, a porous air electrode covering the support tube, a non-porous electrolyte covering a portion of the air electrode, a non-porous conducting interconnection covering the remaining portion of the electrode, and a metal deposit on the interconnection. 1 fig.

  17. On the deformation mechanisms and electrical behavior of highly stretchable metallic interconnects on elastomer substrates

    NASA Astrophysics Data System (ADS)

    Arafat, Yeasir; Dutta, Indranath; Panat, Rahul

    2016-09-01

    Flexible metallic interconnects are highly important in the emerging field of deformable/wearable electronics. In our previous work [Arafat et al., Appl. Phys. Lett. 107, 081906 (2015)], interconnect films of Indium metal, periodically bonded to an elastomer substrate using a thin discontinuous/cracked adhesion interlayer of Cr, were shown to sustain a linear strain of 80%-100% without failure during repeated cycling. In this paper, we investigate the mechanisms that allow such films to be stretched to a large strain without rupture along with strategies to prevent a deterioration in their electrical performance under high linear strain. Scanning Electron Microscopy and Digital Image Correlation are used to map the strain field of the Cr adhesion interlayer and the In interconnect film when the elastomer substrate is stretched. It is shown that the Cr interlayer morphology, consisting of islands separated by bi-axial cracks, accommodates the strain primarily by widening of the cracks between the islands along the tensile direction. This behavior is shown to cause the strain in the In interconnect film to be discontinuous and concentrated in bands perpendicular to the loading direction. This localization of strain at numerous periodically spaced locations preempts strain-localization at one location and makes the In film highly stretchable by delaying rupture. Finally, the elastic-plastic mismatch-driven wrinkling of the In interconnect upon release from first loading cycle is utilized to delay the onset of plasticity and allow the interconnect to be stretched repeatedly up to 25% linear strain in subsequent cycles without a deterioration of its electrical performance.

  18. Phase-Field-Crystal Model for Electromigration in Metal Interconnects

    NASA Astrophysics Data System (ADS)

    Wang, Nan; Bevan, Kirk H.; Provatas, Nikolas

    2016-10-01

    We propose an atomistic model of electromigration (EM) in metals based on a recently developed phase-field-crystal (PFC) technique. By coupling the PFC model's atomic density field with an applied electric field through the EM effective charge parameter, EM is successfully captured on diffusive time scales. Our framework reproduces the well-established EM phenomena known as Black's equation and the Blech effect, and also naturally captures commonly observed phenomena such as void nucleation and migration in bulk crystals. A resistivity dipole field arising from electron scattering on void surfaces is shown to contribute significantly to void migration velocity. With an intrinsic time scale set by atomic diffusion rather than atomic oscillations or hopping events, as in conventional atomistic methods, our theoretical approach makes it possible to investigate EM-induced circuit failure at atomic spatial resolution and experimentally relevant time scales.

  19. Oxidation Resistant, Cr Retaining, Electrically Conductive Coatings on Metallic Alloys for SOFC Interconnects

    SciTech Connect

    Vladimir Gorokhovsky

    2008-03-31

    This report describes significant results from an on-going, collaborative effort to enable the use of inexpensive metallic alloys as interconnects in planar solid oxide fuel cells (SOFCs) through the use of advanced coating technologies. Arcomac Surface Engineering, LLC, under the leadership of Dr. Vladimir Gorokhovsky, is investigating filtered-arc and filtered-arc plasma-assisted hybrid coating deposition technologies to promote oxidation resistance, eliminate Cr volatility, and stabilize the electrical conductivity of both standard and specialty steel alloys of interest for SOFC metallic interconnect (IC) applications. Arcomac has successfully developed technologies and processes to deposit coatings with excellent adhesion, which have demonstrated a substantial increase in high temperature oxidation resistance, stabilization of low Area Specific Resistance values and significantly decrease Cr volatility. An extensive matrix of deposition processes, coating compositions and architectures was evaluated. Technical performance of coated and uncoated sample coupons during exposures to SOFC interconnect-relevant conditions is discussed, and promising future directions are considered. Cost analyses have been prepared based on assessment of plasma processing parameters, which demonstrate the feasibility of the proposed surface engineering process for SOFC metallic IC applications.

  20. Integration of robust fluidic interconnects using metal to glass anodic bonding

    NASA Astrophysics Data System (ADS)

    Briand, Danick; Weber, Patrick; de Rooij, Nicolaas F.

    2005-09-01

    This paper reports on the encapsulation of a piezoresistive silicon/Pyrex liquid flow sensor using metal to glass anodic bonding. The bonding technique allowed integrating robust metallic microfluidic interconnects and eliminating the use of glue and O-rings. The bonding parameters of a silicon/Pyrex/metal triple stack were chosen to minimize the residual stress and to obtain a strong and liquid tight bonding interface. The silicon/Pyrex liquid flow sensor was successfully bonded to metallic plates of Kovar and Alloy 42, on which tubes were fixed and a printed circuit board (PCB) was integrated. A post-bonding annealing procedure was developed to reduce the residual bonding stress. The characteristics of the encapsulated liquid flow sensor, such as the temperature coefficient of sensitivity, fulfilled the specifications. Wafer level packaging using metal to glass anodic bonding was considered to reduce the packaging size and cost.

  1. Metal-slotted hybrid optical waveguides for PCB-compatible optical interconnection.

    PubMed

    Kim, Jin Tae; Ju, Jung Jin; Park, Suntak

    2012-04-23

    For development of electro-optical printed circuit board (PCB) systems, PCB-compatible metal-slotted hybrid optical waveguide was proposed and its optical characteristics are investigated at a wavelength of 1.31 μm. To confine light in a metallic multilayered structure, a metal film with a wide trench is inserted at the center of a dielectric medium that is sandwiched between metal films of infinite width. A circularly symmetric spot of the guided mode was measured at the center of the metal-slotted optical waveguide, which is a good agreement with the theoretical prediction by using the finite-element method. The measured propagation loss is about 1.5 dB/cm. Successful transmission of 2.5 Gbps optical signal without any distortion of the eye diagram confirms that the proposed hybrid optical waveguide holds a potential transmission line for the PCB-compatible optical interconnection.

  2. Floating dielectric slab optical interconnection between metal-dielectric interface surface plasmon polariton waveguides.

    PubMed

    Kang, Minsu; Park, Junghyun; Lee, Il-Min; Lee, Byoungho

    2009-01-19

    A simple and effective optical interconnection which connects two distanced single metal-dielectric interface surface plasmon waveguides by a floating dielectric slab waveguide (slab bridge) is proposed. Transmission characteristics of the suggested structure are numerically studied using rigorous coupled wave analysis, and design rules based on the study are given. In the wave-guiding part, if the slab bridge can support more than the fundamental mode, then the transmission efficiency of the interconnection shows strong periodic dependency on the length of the bridge, due to the multi-mode interference (MMI) effect. Otherwise, only small fluctuation occurs due to the Fabry-Pérot effect. In addition, light beating happens when the slab bridge is relatively short. In the wave-coupling part, on the other hand, gap-assisted transmission occurs at each overlapping region as a consequence of mode hybridization. Periodic dependency on the length of the overlap region also appears due to the MMI effect. According to these results, we propose design principles for achieving both high transmission efficiency and stability with respect to the variation of the interconnection distance, and we show how to obtain the transmission efficiency of 68.3% for the 1mm-long interconnection.

  3. Compatibility between strontium-doped ferrite cathode and metallic interconnects in solid oxide fuel cells

    NASA Astrophysics Data System (ADS)

    Miguel-Pérez, Verónica; Martínez-Amesti, Ana; Arriortua, María Isabel

    2015-04-01

    One of the most important issues related to the performance of solid oxide fuel cells (SOFCs) is the chromium poisoning of the perovskite-type materials used as cathodes by the gaseous chromium species from metallic interconnects. In this study, powder mixtures of LSF40-Cr2O3 were heated at 800 °C and 1000 °C in air and were subsequently analysed by X-ray powder diffraction. For all the mixtures, the crystallisation of SrCrO4 was observed. In addition, the degradation occurring between three alloys with different compositions, Crofer 22 APU, SS430 and Conicro 4023 W 188, as metallic interconnects and La0.6Sr0.4FeO3 (LSF40) ceramic material as a cathode was studied. The results show significant chromium deposition and the formation of SrCrO4, LaCrO3 and La2O3 that block the active LSF40 electrode surface and degrade the stack (YSZ/SDC/LSF40/Interconnect) performance. LSF40 assembled with SS430 exhibited substantial Cr deposition. The deposition of the Cr species and the reaction with the LSF40 cathode is related to the composition of the oxide scales formed at each metallic interconnect and at the same time is related to the composition of the alloys. The best results obtained were for the half-cell (YSZ/SDC/LSF40) in contact with Conicro 4023 W 188 and Crofer 22 APU after heat treatment in air at 800 °C for 100 h.

  4. Porous electrode apparatus for electrodeposition of detailed metal structures or microelectronic interconnections

    DOEpatents

    Griffiths, Stewart K.; Nilson, Robert H.; Hruby, Jill M.

    2002-01-01

    An apparatus and procedure for performing microfabrication of detailed metal structures by electroforming metal deposits within small cavities. Two primary areas of application are: the LIGA process which manufactures complex three-dimensional metal parts and the damascene process used for electroplating line and via interconnections of microelectronic devices. A porous electrode held in contact or in close proximity with a plating substrate or mold top to ensure one-dimensional and uniform current flow into all mold cavities is used. Electrolyte is pumped over the exposed surface of the porous electrode to ensure uniform ion concentrations at this external surface. The porous electrode prevents electrolyte circulation within individual mold cavities, avoiding preferential enhancement of ion transport in cavities having favorable geometries. Both current flow and ion transport are one-dimensional and identical in all mold cavities, so all metal deposits grow at the same rate eliminating nonuniformities of the prior art.

  5. Photolithography-Based Patterning of Liquid Metal Interconnects for Monolithically Integrated Stretchable Circuits.

    PubMed

    Park, Chan Woo; Moon, Yu Gyeong; Seong, Hyejeong; Jung, Soon Won; Oh, Ji-Young; Na, Bock Soon; Park, Nae-Man; Lee, Sang Seok; Im, Sung Gap; Koo, Jae Bon

    2016-06-22

    We demonstrate a new patterning technique for gallium-based liquid metals on flat substrates, which can provide both high pattern resolution (∼20 μm) and alignment precision as required for highly integrated circuits. In a very similar manner as in the patterning of solid metal films by photolithography and lift-off processes, the liquid metal layer painted over the whole substrate area can be selectively removed by dissolving the underlying photoresist layer, leaving behind robust liquid patterns as defined by the photolithography. This quick and simple method makes it possible to integrate fine-scale interconnects with preformed devices precisely, which is indispensable for realizing monolithically integrated stretchable circuits. As a way for constructing stretchable integrated circuits, we propose a hybrid configuration composed of rigid device regions and liquid interconnects, which is constructed on a rigid substrate first but highly stretchable after being transferred onto an elastomeric substrate. This new method can be useful in various applications requiring both high-resolution and precisely aligned patterning of gallium-based liquid metals. PMID:27250997

  6. Photolithography-Based Patterning of Liquid Metal Interconnects for Monolithically Integrated Stretchable Circuits.

    PubMed

    Park, Chan Woo; Moon, Yu Gyeong; Seong, Hyejeong; Jung, Soon Won; Oh, Ji-Young; Na, Bock Soon; Park, Nae-Man; Lee, Sang Seok; Im, Sung Gap; Koo, Jae Bon

    2016-06-22

    We demonstrate a new patterning technique for gallium-based liquid metals on flat substrates, which can provide both high pattern resolution (∼20 μm) and alignment precision as required for highly integrated circuits. In a very similar manner as in the patterning of solid metal films by photolithography and lift-off processes, the liquid metal layer painted over the whole substrate area can be selectively removed by dissolving the underlying photoresist layer, leaving behind robust liquid patterns as defined by the photolithography. This quick and simple method makes it possible to integrate fine-scale interconnects with preformed devices precisely, which is indispensable for realizing monolithically integrated stretchable circuits. As a way for constructing stretchable integrated circuits, we propose a hybrid configuration composed of rigid device regions and liquid interconnects, which is constructed on a rigid substrate first but highly stretchable after being transferred onto an elastomeric substrate. This new method can be useful in various applications requiring both high-resolution and precisely aligned patterning of gallium-based liquid metals.

  7. Solar cell welded interconnection development program. [parallel gap and ultrasonic metal-metal bonding

    NASA Technical Reports Server (NTRS)

    Katzeff, J. S.

    1974-01-01

    Parallel gap welding and ultrasonic bonding techniques were developed for joining selected interconnect materials (silver, aluminum, copper, silver plated molybdenum and Kovar) to silver-titanium and aluminum contact cells. All process variables have been evaluated leading to establishment of optimum solar cell, interconnect, electrodes and equipment criteria for obtainment of consistent high quality welds. Applicability of nondestructive testing of solar cell welds has been studied. A pre-weld monitoring system is being built and will be utilized in the numerically controlled parallel gap weld station.

  8. Electrodeposited porous metal oxide films with interconnected nanoparticles applied as anode of lithium ion battery

    SciTech Connect

    Xiao, Anguo Zhou, Shibiao; Zuo, Chenggang; Zhuan, Yongbing; Ding, Xiang

    2014-12-15

    Highlights: • Highly porous NiO film is prepared by a co-electrodeposition method. • Porous NiO film is composed of interconnected nanoparticles. • Porous structure is favorable for fast ion/electron transfer. • Porous NiO film shows good lithium ion storage properties. - Abstract: Controllable synthesis of porous metal oxide films is highly desirable for high-performance electrochemical devices. In this work, a highly porous NiO film composed of interconnected nanoparticles is prepared by a simple co-electrodeposition method. The nanoparticles in the NiO film have a size ranging from 30 to 100 nm and construct large-quantity pores of 20–120 nm. As an anode material for lithium ion batteries, the highly porous NiO film electrode delivers a high discharge capacity of 700 mA h g{sup −1} at 0.2 C, as well as good high-rate performance. After 100 cycles at 0.2 C, a specific capacitance of 517 mA h g{sup −1} is attained. The good electrochemical performance is attributed to the interconnected porous structure, which facilitates the diffusion of ion and electron, and provides large reaction surface area leading to improved performance.

  9. A multi-level code for metallurgical effects in metal-forming processes

    SciTech Connect

    Taylor, P.A.; Silling, S.A.; Hughes, D.A.; Bammann, D.J.; Chiesa, M.L.

    1997-08-01

    The authors present the final report on a Laboratory-Directed Research and Development (LDRD) project, A Multi-level Code for Metallurgical Effects in metal-Forming Processes, performed during the fiscal years 1995 and 1996. The project focused on the development of new modeling capabilities for simulating forging and extrusion processes that typically display phenomenology occurring on two different length scales. In support of model fitting and code validation, ring compression and extrusion experiments were performed on 304L stainless steel, a material of interest in DOE nuclear weapons applications.

  10. Tubular solid oxide fuel cells with porous metal supports and ceramic interconnections

    SciTech Connect

    Huang, Kevin; Ruka, Roswell J.

    2012-05-08

    An intermediate temperature solid oxide fuel cell structure capable of operating at from 600.degree. C. to 800.degree. C. having a very thin porous hollow elongated metallic support tube having a thickness from 0.10 mm to 1.0 mm, preferably 0.10 mm to 0.35 mm, a porosity of from 25 vol. % to 50 vol. % and a tensile strength from 700 GPa to 900 GPa, which metallic tube supports a reduced thickness air electrode having a thickness from 0.010 mm to 0.2 mm, a solid oxide electrolyte, a cermet fuel electrode, a ceramic interconnection and an electrically conductive cell to cell contact layer.

  11. Capturing buried defects in metal interconnections with electron beam inspection system

    NASA Astrophysics Data System (ADS)

    Xiao, Hong; Jiang, Ximan; Trease, David; Van Riet, Mike; Ramprasad, Shishir; Bhatia, Anadi; Lefebvre, Pierre; Bastard, David; Moreau, Olivier; Maher, Chris; MacDonald, Paul; Campochiaro, Cecelia

    2013-04-01

    In this paper we present a novel mode of electron beam inspection (EBI), entitled super wide optics (SWO) mode, which can effectively detect buried defects in tungsten (W) plugs and copper (Cu) wires. These defects are defects of interest (DOI) to integrated circuit (IC) manufacturers because they are not detectable in optical inspection, voltage contrast (VC) mode EBI or physical mode EBI. We used engineering systems to study two samples, a tungsten chemical mechanical polish (CMP) wafer and a copper CMP wafer with a silicon carbon nitride (SiCN) cap layer. EBI with our novel SWO mode was found to capture many dark defects on these two wafers. Furthermore, defect review with all three EBI modes found some of these dark defects were unique to SWO mode. For verification, physical failure analysis was performed on some SWO-unique DOI. The cross-sectional scanning electron microscope (SEM) images and transmission electron microscope (TEM) images confirmed that the unique DOI were buried voids in W-plugs and copper wire thinning caused by either buried particles or buried particle induced metal trench under-etch. These DOI can significantly increase the resistance of metal interconnects of IC chip and affect the chip yield. This new EBI mode can provide an in-line monitoring solution for these DOI, which does not exist before this study.

  12. A multi-level bioreactor to remove organic matter and metals, together with its associated bacterial diversity.

    PubMed

    Wu, Yonghong; Hu, Zhengyi; Kerr, Philip G; Yang, Linzhang

    2011-01-01

    The purpose of this study was to treat complex wastewater consisting of domestic wastewater, tobacco processing and building materials washings. The proposed multi-level bioreactor consists of a biopond-biofilter, anoxic/aerobic (A/O) fluidized beds and a photoautotrophic system. The results show that when the hydraulic load of the bioreactor was 200 m3/d, it successfully and simultaneously removed the organic matter and metals. When the bioreactor was in a relatively steady-state condition, the overall average organic matter and metals removal efficiencies are as follows, COD (89%), UV245 nm-matter (91%), Cu (78%), Zn (79%) and Fe (84%). The growth conditions of the native bacterial habitat were improved, which resulted from the increase of the in bacterial diversity under the rejuvenated conditions induced by the bioreactor. The results demonstrate that the multi-level bioreactor, without a sludge treatment system, can remove heterogeneous organic matter and metals from wastewater.

  13. Electrically Conductive, Corrosion-Resistant Coatings Through Defect Chemistry for Metallic Interconnects

    SciTech Connect

    Anil V. Virkar

    2006-12-31

    The principal objective of this work was to develop oxidation protective coatings for metallic interconnect based on a defect chemistry approach. It was reasoned that the effectiveness of a coating is dictated by oxygen permeation kinetics; the slower the permeation kinetics, the better the protection. All protective coating materials investigated to date are either perovskites or spinels containing metals exhibiting multiple valence states (Co, Fe, Mn, Cr, etc.). As a result, all of these oxides exhibit a reasonable level of electronic conductivity; typically at least about {approx}0.05 S/cm at 800 C. For a 5 micron coating, this equates to a maximum {approx}0.025 {Omega}cm{sup 2} area specific resistance due to the coating. This suggests that the coating should be based on oxygen ion conductivity (the lower the better) and not on electronic conductivity. Measurements of ionic conductivity of prospective coating materials were conducted using Hebb-Wagner method. It was demonstrated that special precautions need to be taken to measure oxygen ion conductivity in these materials with very low oxygen vacancy concentration. A model for oxidation under a protective coating is presented. Defect chemistry based approach was developed such that by suitably doping, oxygen vacancy concentration was suppressed, thus suppressing oxygen ion transport and increasing effectiveness of the coating. For the cathode side, the best coating material identified was LaMnO{sub 3} with Ti dopant on the Mn site (LTM). It was observed that LTM is more than 20 times as effective as Mn-containing spinels. On the anode side, LaCrO3 doped with Nb on the Cr site (LNC) was the material identified. Extensive oxidation kinetics studies were conducted on metallic alloy foils with coating {approx}1 micron in thickness. From these studies, it was projected that a 5 micron coating would be sufficient to ensure 40,000 h life.

  14. Life prediction of coated and uncoated metallic interconnect for solid oxide fuel cell applications

    NASA Astrophysics Data System (ADS)

    Liu, W. N.; Sun, X.; Stephens, E.; Khaleel, M. A.

    In this paper, we present an integrated experimental and modeling methodology in predicting the life of coated and uncoated metallic interconnect (IC) for solid oxide fuel cell (SOFC) applications. The ultimate goal is to provide cell designer and manufacture with a predictive methodology such that the life of the IC system can be managed and optimized through different coating thickness to meet the overall cell designed life. Crofer 22 APU is used as the example IC material system. The life of coated and uncoated Crofer 22 APU under isothermal cooling was predicted by comparing the predicted interfacial strength and the interfacial stresses induced by the cooling process from the operating temperature to room temperature, together with the measured oxide scale growth kinetics. It was found that the interfacial strength between the oxide scale and the Crofer 22 APU substrate decreases with the growth of the oxide scale, and that the interfacial strength for the oxide scale/spinel coating interface is much higher than that of the oxide scale/Crofer 22 APU substrate interface. As expected, the predicted life of the coated Crofer 22 APU is significantly longer than that of the uncoated Crofer 22 APU.

  15. Degradation of solid oxide fuel cell metallic interconnects in fuels containing sulfur

    SciTech Connect

    Ziomek-Moroz, M.; Hawk, Jeffrey A.

    2005-01-01

    Hydrogen is the main fuel for all types of fuel cells except direct methanol fuel cells. Hydrogen can be generated from all manner of fossil fuels, including coal, natural gas, diesel, gasoline, other hydrocarbons, and oxygenates (e.g., methanol, ethanol, butanol, etc.). Impurities in the fuel can cause significant performance problems and sulfur, in particular, can decrease the cell performance of fuel cells, including solid oxide fuel cells (SOFC). In the SOFC, the high (800-1000°C) operating temperature yields advantages (e.g., internal fuel reforming) and disadvantages (e.g., material selection and degradation problems). Significant progress in reducing the operating temperature of the SOFC from ~1000 ºC to ~750 ºC may allow less expensive metallic materials to be used for interconnects and as balance of plant (BOP) materials. This paper provides insight on the material performance of nickel, ferritic steels, and nickel-based alloys in fuels containing sulfur, primarily in the form of H2S, and seeks to quantify the extent of possible degradation due to sulfur in the gas stream.

  16. 3-D perpendicular assembly of single walled carbon nanotubes for complimentary metal oxide semiconductor interconnects.

    PubMed

    Kim, Tae-Hoon; Yilmaz, Cihan; Somu, Sivasubramanian; Busnaina, Ahmed

    2014-05-01

    Due to their superior electrical properties such as high current density and ballistic transport, carbon nanotubes (CNT) are considered as a potential candidate for future Very Large Scale Integration (VLSI) interconnects. However, direct incorporation of CNTs into Complimentary Metal Oxide Semiconductor (CMOS) architecture by conventional chemical vapor deposition (CVD) growth method is problematic since it requires high temperatures that might damage insulators and doped semiconductors in the underlying CMOS circuits. In this paper, we present a directed assembly method to assemble aligned CNTs into pre-patterned vias and perpendicular to the substrate. A dynamic electric field with a static offset is applied to provide the force needed for directing the SWNT assembly. It is also shown that by adjusting assembly parameters the density of the assembled CNTs can be significantly enhanced. This highly scalable directed assembly method is conducted at room temperature and pressure and is accomplished in a few minutes. I-V characterization of the assembled CNTs was conducted using a Zyvex nanomanipulator in a scanning electron microscope (SEM) and the measured value of the resistance is found to be 270 komega s. PMID:24734611

  17. Metal-sulfide melt non-interconnectivity in silicates, even at high pressure, high temperature, and high melt fractions

    SciTech Connect

    Minarik, W.G.; Ryerson, F.J.

    1996-01-01

    The authors have investigated the textural microstructure of iron-nickel-sulfur melts in contact with olivine, pyroxene, and the modified-spinel polymorph of olivine. The experiments were conducted at 1,500 C and pressures ranging from 1 to 17 GPa. For compositions more metal-rich than the monosulfide, including the eutectic composition, the metal sulfide melt has a dihedral angle greater than 60{degree} and does not form an interconnected grain-edge fluid. Increasing pressure does not measurably alter the dihedral angles. Textural evolution results in coarsening of the sulfide melt pockets, resulting in large pockets surrounded by many silicate grains and separated from one another by melt-free grain edges. Chemical communication between these large pockets is limited to lattice and grain-boundary diffusion. Due to the large interfacial energy between sulfide melt and silicates, sulfide melts are unable to separate from solid silicate via grain-boundary percolation and remain stranded in isolated melt pockets. Sulfide melt in excess of the critical melt fraction (5--25%) will develop a transient interconnectivity as sulfide collects into larger melt pockets and interconnectivity is pinched off. Efficient separation of core-forming sulfide melts from silicate requires either melting of the silicate matrix or a very large fraction of metal-sulfide melt (perhaps as large as 40%).

  18. Metal/ceramic composites via infiltration of an interconnected wood-derived ceramic

    NASA Astrophysics Data System (ADS)

    Wilkes, Thomas E.

    The use of composites is increasing as they afford scientists and engineers the ability to combine the advantageous properties of each constituent phase, e.g. metal ductility and ceramic stiffness. With respect to materials design, biomimetics is garnering increasing attention due to the complex, yet efficient, natural microstructures. One such biomimetic, or in this case 'bio-derived,' curiosity is wood-derived ceramic, which is made by either replicating or converting wood into a ceramic. The resulting porous and anisotropic material retains the precursor microstructure. The wide variety of precursors can yield materials with a range of pore sizes and distribution of pores. The purpose of this work was to study the processing, microstructure, and properties of aluminum/silicon carbide composites. The composites were made by infiltrating molten aluminum into porous wood-derived SIC, which was produced by the reactive melt-infiltration of silicon into pyrolyzed wood. The composite microstructure consisted of interconnected SiC surrounding Al-alloy 'fibers.' The strength, modulus, and toughness were measured in both longitudinal and transverse orientations. The Al → SiC load transfer was investigated with high-energy X-ray diffraction in combination with in-situ compressive loading. The properties in flexure were found to decrease with increasing temperature. Despite the complex microstructure, predictions of the composite flexural modulus and longitudinal fracture toughness were obtained using simple models: Halpin-Tsai bounds and the Ashby et al. model of the effect of ductile particle-reinforcements on the toughness of brittle materials (Ashby et al. 1989), respectively. In addition, the Al/SiC research inspired the investigation of carbon-reinforced copper composites. The goal was to explore the feasibility of making a high-thermal conductivity composite by infiltrating copper into wood-derived carbon. Results indicated that Cu/C composites could be made with

  19. CoxFe1-x oxide coatings on metallic interconnects for solid oxide fuel cells

    NASA Astrophysics Data System (ADS)

    Shen, Fengyu; Lu, Kathy

    2016-10-01

    In order to improve the performance of Cr-containing steel as an interconnect material for solid oxide fuel cells, CoFe alloy coatings with Co:Fe ratios of 9:1, 8:2, 7:3, 6:4, and 5:5 are deposited by electrodeposition and then oxidized to CoxFe1-x oxide coatings with a thickness of ∼6 μm as protective layers on the interconnect. The area specific resistance of the coated interconnect increases with the Fe content. Higher Co content oxide coatings are more effective in limiting the growth of the chromia scale while all coatings are effective in inhibiting Cr diffusion and evaporation. With the Co0.8Fe0.2 oxide coated interconnect, the electrochemical performance of the Sm0.5Sr0.5Co0.2Fe0.8O3 cathode is improved. Only 1.54 atomic percentage of Cr is detected on the surface of the Sm0.5Sr0.5Co0.2Fe0.8O3 cathode while no Cr is detected 0.66 μm or more into the cathode. CoxFe1-x oxide coatings are promising candidates for solid oxide fuel cell interconnects with the advantage of using existing cathode species for compatibility and performance enhancement.

  20. Multilevel Green's function interpolation method for scattering from composite metallic and dielectric objects.

    PubMed

    Shi, Yan; Wang, Hao Gang; Li, Long; Chan, Chi Hou

    2008-10-01

    A multilevel Green's function interpolation method based on two kinds of multilevel partitioning schemes--the quasi-2D and the hybrid partitioning scheme--is proposed for analyzing electromagnetic scattering from objects comprising both conducting and dielectric parts. The problem is formulated using the surface integral equation for homogeneous dielectric and conducting bodies. A quasi-2D multilevel partitioning scheme is devised to improve the efficiency of the Green's function interpolation. In contrast to previous multilevel partitioning schemes, noncubic groups are introduced to discretize the whole EM structure in this quasi-2D multilevel partitioning scheme. Based on the detailed analysis of the dimension of the group in this partitioning scheme, a hybrid quasi-2D/3D multilevel partitioning scheme is proposed to effectively handle objects with fine local structures. Selection criteria for some key parameters relating to the interpolation technique are given. The proposed algorithm is ideal for the solution of problems involving objects such as missiles, microstrip antenna arrays, photonic bandgap structures, etc. Numerical examples are presented to show that CPU time is between O(N) and O(N log N) while the computer memory requirement is O(N). PMID:18830332

  1. Fuel cell system with interconnect

    DOEpatents

    Liu, Zhien; Goettler, Richard; Delaforce, Philip Mark

    2016-03-08

    The present invention includes a fuel cell system having an interconnect that reduces or eliminates diffusion (leakage) of fuel and oxidant by providing an increased densification, by forming the interconnect as a ceramic/metal composite.

  2. Metallic interconnects for SOFC: Characterisation of corrosion resistance and conductivity evaluation at operating temperature of differently coated alloys

    NASA Astrophysics Data System (ADS)

    Fontana, S.; Amendola, R.; Chevalier, S.; Piccardo, P.; Caboche, G.; Viviani, M.; Molins, R.; Sennour, M.

    One of challenges in improving the performance and cost-effectiveness of solid oxide fuel cells (SOFCs) is the development of suitable interconnect materials. Recent researches have enabled to decrease the operating temperature of the SOFC from 1000 to 800 °C. Chromia forming alloys are then among the best candidates for interconnects. However, low electronic conductivity and volatility of chromium oxide scale need to be solved to improve interconnect performances. In the field of high temperature oxidation of metals, it is well known that the addition of reactive element into alloys or as thin film coatings, improves their oxidation resistance at high temperature. The elements of beginning of the lanthanide group and yttrium are the most efficient. The goal of this study is to make reactive element oxides (La 2O 3, Nd 2O 3 and Y 2O 3) coatings by metal organic chemical vapour deposition (MOCVD) on Crofer 22 APU, AL 453 and Haynes 230 in order to form perovskite oxides which present a good conductivity at high temperature. The coatings were analysed after 100 h ageing at 800 °C in air under atmospheric pressure by scanning electron microscopy (SEM), energy dispersive X-ray (EDX) analyses, X-ray diffraction (XRD) and transmission electron microscopy (TEM) analyses. Area-specific resistance (ASR) was measured in air for the same times and temperature, using a sandwich technique with Pt paste for electrical contacts between surfaces. The ASR values for the best coating were estimated to be limited to 0.035 Ω cm 2, even after 40,000 h use.

  3. Thin film interconnect processes

    NASA Astrophysics Data System (ADS)

    Malik, Farid

    Interconnects and associated photolithography and etching processes play a dominant role in the feature shrinkage of electronic devices. Most interconnects are fabricated by use of thin film processing techniques. Planarization of dielectrics and novel metal deposition methods are the focus of current investigations. Spin-on glass, polyimides, etch-back, bias-sputtered quartz, and plasma-enhanced conformal films are being used to obtain planarized dielectrics over which metal films can be reliably deposited. Recent trends have been towards chemical vapor depositions of metals and refractory metal silicides. Interconnects of the future will be used in conjunction with planarized dielectric layers. Reliability of devices will depend to a large extent on the quality of the interconnects.

  4. A low-Cr metallic interconnect for intermediate-temperature solid oxide fuel cells

    SciTech Connect

    Geng, Shujiang; Zhu, Jiahong; Brady, Michael P; Anderson, Harlan; ZHOU, XIADONG; YANG, ZHENGUO

    2007-01-01

    Solid oxide fuel cells (SOFCs) have attracted significant attention due to the potential for environmentally-friendly power generation with high efficiency, fuel flexibility, and zero/no emissions. However, the main hurdles thwarting the commercial introduction of SOFCs are the stack cost and durability, particularly related to the long-term stability of stack/cell materials such as the interconnect 1-3. There has been recent interest in utilizing the Cr2O3-forming alloys as interconnect for intermediate-temperature SOFCs4-6. As a consequence, volatile Cr species from the Cr2O3 scale can cause severe degradation of electrical and catalytic properties of the cathode7-9. Here, we report a new low-Cr Fe-Co-Ni base alloy that demonstrates a close match in coefficient of thermal expansion (CTE) with adjacent cell components; good oxidation resistance; and low oxide scale area specific resistance (ASR). The formation of a Cr-free (Fe,Co,Ni)3O4 spinel outer layer over the chromia inner layer upon thermal exposure effectively reduces the chromium evaporation.

  5. Processing and Prolonged 500 C Testing of 4H-SiC JFET Integrated Circuits with Two Levels of Metal Interconnect

    NASA Technical Reports Server (NTRS)

    Spry, David J.; Neudeck, Philip G.; Chen, Liangyu; Lukco, Dorothy; Chang, Carl W.; Beheim, Glenn M.; Krasowski, Michael J.; Prokop, Norman F.

    2015-01-01

    Complex integrated circuit (IC) chips rely on more than one level of interconnect metallization for routing of electrical power and signals. This work reports the processing and testing of 4H-SiC junction field effect transistor (JFET) prototype IC's with two levels of metal interconnect capable of prolonged operation at 500 C. Packaged functional circuits including 3- and 11-stage ring oscillators, a 4-bit digital to analog converter, and a 4-bit address decoder and random access memory cell have been demonstrated at 500 C. A 3-stage oscillator functioned for over 3000 hours at 500 C in air ambient. Improved reproducibility remains to be accomplished.

  6. Processing and Prolonged 500 C Testing of 4H-SiC JFET Integrated Circuits with Two Levels of Metal Interconnect

    NASA Technical Reports Server (NTRS)

    Spry, David J.; Neudeck, Philip G.; Chen, Liangyu; Lukco, Dorothy; Chang, Carl W.; Beheim, Glenn M.; Krasowski, Michael J.; Prokop, Norman F.

    2015-01-01

    Complex integrated circuit (IC) chips rely on more than one level of interconnect metallization for routing of electrical power and signals. This work reports the processing and testing of 4H-SiC junction field effect transistor (JFET) prototype ICs with two levels of metal interconnect capable of prolonged operation at 500 C. Packaged functional circuits including 3-and 11-stage ring oscillators, a 4-bit digital to analog converter, and a 4-bit address decoder and random access memory cell have been demonstrated at 500 C. A 3-stage oscillator functioned for over 3000 hours at 500 C in air ambient.

  7. Multilevel memristor effect in metal-semiconductor core-shell nanoparticles tested by scanning tunneling spectroscopy.

    PubMed

    Chakrabarti, Sudipto; Pal, Amlan J

    2015-06-01

    We have grown gold (Au) and copper-zinc-tin-sulfide (CZTS) nanocrystals and Au-CZTS core-shell nanostructures, with gold in the core and the semiconductor in the shell layer, through a high-temperature colloidal synthetic approach. Following usual characterization, we formed ultrathin layers of these in order to characterize the nanostructures in an ultrahigh-vacuum scanning tunneling microscope. Scanning tunneling spectroscopy of individual nanostructures showed the memristor effect or resistive switching from a low- to a high-conducting state upon application of a suitable voltage pulse. The Au-CZTS core-shell nanostructures also show a multilevel memristor effect with the nanostructures undergoing two transitions in conductance at two magnitudes of voltage pulse. We have studied the reproducibility, reversibility, and retentivity of the multilevel memristors. From the normalized density of states (NDOS), we infer that the memristor effect is correlated to a decrease in the transport gap of the nanostructures. We also infer that the memristor effect occurs in the nanostructures due to an increase in the density of available states upon application of a voltage pulse. PMID:25966930

  8. Multilevel memristor effect in metal-semiconductor core-shell nanoparticles tested by scanning tunneling spectroscopy.

    PubMed

    Chakrabarti, Sudipto; Pal, Amlan J

    2015-06-01

    We have grown gold (Au) and copper-zinc-tin-sulfide (CZTS) nanocrystals and Au-CZTS core-shell nanostructures, with gold in the core and the semiconductor in the shell layer, through a high-temperature colloidal synthetic approach. Following usual characterization, we formed ultrathin layers of these in order to characterize the nanostructures in an ultrahigh-vacuum scanning tunneling microscope. Scanning tunneling spectroscopy of individual nanostructures showed the memristor effect or resistive switching from a low- to a high-conducting state upon application of a suitable voltage pulse. The Au-CZTS core-shell nanostructures also show a multilevel memristor effect with the nanostructures undergoing two transitions in conductance at two magnitudes of voltage pulse. We have studied the reproducibility, reversibility, and retentivity of the multilevel memristors. From the normalized density of states (NDOS), we infer that the memristor effect is correlated to a decrease in the transport gap of the nanostructures. We also infer that the memristor effect occurs in the nanostructures due to an increase in the density of available states upon application of a voltage pulse.

  9. Light-triggered self-construction of supramolecular organic nanowires as metallic interconnects.

    PubMed

    Faramarzi, Vina; Niess, Frédéric; Moulin, Emilie; Maaloum, Mounir; Dayen, Jean-François; Beaufrand, Jean-Baptiste; Zanettini, Silvia; Doudin, Bernard; Giuseppone, Nicolas

    2012-04-22

    The construction of soft and processable organic material able to display metallic conduction properties-a large density of freely moving charges-is a major challenge for electronics. Films of doped conjugated polymers are widely used as semiconductor devices, but metallic-type transport in the bulk of such materials remains extremely rare. On the other hand, single-walled carbon nanotubes can exhibit remarkably low contact resistances with related large currents, but are intrinsically very difficult to isolate and process. Here, we describe the self-assembly of supramolecular organic nanowires between two metallic electrodes, from a solution of triarylamine derivative, under the simultaneous action of light and electric field triggers. They exhibit a combination of large conductivity values (>5 × 10(3) S m(-1)) and a low interface resistance (<2 × 10(-4) Ω m). Moreover, the resistance of nanowires in series with metal interfaces systematically decreases when the temperature is lowered to 1.5 K, revealing an intrinsic metallic behaviour.

  10. High Performance Ceramic Interconnect Material for Solid Oxide Fuel Cells (SOFCs): Ca- and Transition Metal-doped Yttrium Chromite

    SciTech Connect

    Yoon, Kyung J.; Stevenson, Jeffry W.; Marina, Olga A.

    2011-10-15

    The effect of transition metal substitution on thermal and electrical properties of Ca-doped yttrium chromite was investigated in relation to use as a ceramic interconnect in high temperature solid oxide fuel cells (SOFCs). 10 at% Co, 4 at% Ni, and 1 at% Cu substitution on B-site of 20 at% Ca-doped yttrium chromite led to a close match of thermal expansion coefficient (TEC) with that of 8 mol% yttria-stabilized zirconia (YSZ), and a single phase Y0.8Ca0.2Cr0.85Co0.1Ni0.04Cu0.01O3 remained stable between 25 and 1100 degree C over a wide oxygen partial pressure range. Doping with Cu significantly facilitated densification of yttrium chromite. Ni dopant improved both electrical conductivity and dimensional stability in reducing environments, likely through diminishing the oxygen vacancy formation. Substitution with Co substantially enhanced electrical conductivity in oxidizing atmosphere, which was attributed to an increase in charge carrier density and hopping mobility. Electrical conductivity of Y0.8Ca0.2Cr0.85Co0.1Ni0.04Cu0.01O3 at 900 degree C is 57 S/cm in air and 11 S/cm in fuel (pO2=5×10^-17 atm) environments. Chemical compatibility of doped yttrium chromite with other cell components was verified at the processing temperatures. Based on the chemical and dimensional stability, sinterability, and thermal and electrical properties, Y0.8Ca0.2Cr0.85Co0.1Ni0.04Cu0.01O3 is suggested as a promising SOFC ceramic interconnect to potentially overcome technical limitations of conventional acceptor-doped lanthanum chromites.

  11. High performance ceramic interconnect material for solid oxide fuel cells (SOFCs): Ca- and transition metal-doped yttrium chromite

    NASA Astrophysics Data System (ADS)

    Yoon, Kyung Joong; Stevenson, Jeffrey W.; Marina, Olga A.

    2011-10-01

    The effect of transition metal substitution on thermal and electrical properties of Ca-doped yttrium chromite was investigated in relation to use as a ceramic interconnect in high temperature solid oxide fuel cells (SOFCs). 10 at.% Co, 4 at.% Ni, and 1 at.% Cu substitution on B-site of 20 at.% Ca-doped yttrium chromite led to a close match of thermal expansion coefficient (TEC) with that of 8 mol% yttria-stabilized zirconia (YSZ), and a single phase Y0.8Ca0.2Cr0.85Co0.1Ni0.04Cu0.01O3 remained stable between 25 and 1100 °C over a wide oxygen partial pressure range. Doping with Cu significantly facilitated densification of yttrium chromite. Ni dopant improved both electrical conductivity and dimensional stability in reducing environments, likely through diminishing the oxygen vacancy formation. Substitution with Co substantially enhanced electrical conductivity in oxidizing atmosphere, which was attributed to an increase in charge carrier density and hopping mobility. Electrical conductivity of Y0.8Ca0.2Cr0.85Co0.1Ni0.04Cu0.01O3 at 900 °C is 57 S cm-1 in air and 11 S cm-1 in fuel (pO2 = 5 × 10-17 atm) environments. Chemical compatibility of doped yttrium chromite with other cell components was verified at the processing temperatures. Based on the chemical and dimensional stability, sinterability, and thermal and electrical properties, Y0.8Ca0.2Cr0.85Co0.1Ni0.04Cu0.01O3 is suggested as a promising SOFC ceramic interconnect to potentially overcome technical limitations of conventional acceptor-doped lanthanum chromites.

  12. Creep rupture of the joint of a solid oxide fuel cell glass-ceramic sealant with metallic interconnect

    NASA Astrophysics Data System (ADS)

    Lin, Chih-Kuang; Lin, Kun-Liang; Yeh, Jing-Hong; Wu, Si-Han; Lee, Ruey-Yi

    2014-01-01

    Creep properties of sandwich joint specimens made of a newly developed BaO-B2O3-Al2O3-SiO2 glass-ceramic sealant (GC-9) and a ferritic-stainless-steel interconnect (Crofer 22 H) for planar solid oxide fuel cells (pSOFCs) are investigated at 800 °C under constant shear and tensile loadings. The creep rupture time of Crofer 22 H/GC-9/Crofer 22 H joint specimens is increased with a decrease in applied load for both shear and tensile loading modes. The given metal/sealant/metal joint has a greater degradation of joint strength at 800 °C under prolonged, constant tensile loading as compared to shear loading. The tensile creep strength at a rupture time of 1000 h is about 9% of the average tensile joint strength, while the shear creep strength at 1000 h is about 23% of the average shear joint strength. Failure patterns of both shear and tensile joint specimens are similar regardless of the creep rupture time. In general, creep cracks initiate at the interface between the (Cr,Mn)3O4 spinel layer and the BaCrO4 chromate layer, penetrate through the BaCrO4 layer, and propagate along the interface between the chromate layer and glass-ceramic substrate until final fracture. Final, fast fracture occasionally takes place within the glass-ceramic layer.

  13. Metallization and interconnection of HTS YBCO thin film devices and circuits

    NASA Astrophysics Data System (ADS)

    Du, J.; Lam, S. K. H.; Tilbrook, D. L.

    2001-10-01

    A comprehensive study of specific contact resistivity and ultrasonic wire bonding yield and strength was carried out on noble metal-YBa2Cu3O7-x (YBCO) thin film contacts prepared by a variety of methods and with different YBCO surface conditions. The metallization techniques investigated include in situ and ex situ deposition of gold or silver on YBCO films. The ex situ contacts were made with and without lithographic processes. Contact resistivities of less than 5×10-8 Ω cm2 at 77 K were achieved for contacts made by the rapid ex situ deposition of gold or silver on fresh YBCO films with smooth surfaces. These contacts also gave a high wire bonding yield and strength of 10-19 g. High contact resistivities in excess of 5×10-4 Ω cm2 and poor wire bonding yield and strength were observed for the contacts made by standard lithographic lift-off processes on old YBCO films. Surface treatments using either argon ion beam etching or rf O2 plasma cleaning prior to metallization were found to be useful in reducing the contact resistivity and improving the wire bonding results for the lift-off contacts. The influence of YBCO film morphology on the contact resistance and wire bonding yield and strength was also studied.

  14. Material development of polymer/metal paste for flip-chip attach interconnection technology

    SciTech Connect

    Roldann, J.M.; Saraf, R.F.; Sambucetti, C.J.; Cotte, J.

    1996-11-01

    Upon completion of the second year of this contract, we have delivered the next generation of polymer/metal composite, optimum paste H, to Endicott. We have done preliminary flip-chip type bonding at Universal Instruments, working closely with their personnel to enhance their equipment set and process. We have also shown that a PMC bond can withstand over 40% strain without effecting its electrical and mechanical properties. This resilience of the conductive polymer paste both under electrical and mechanical behavior, is a strong indication of the applicability of the material for Flip Chip Attach to organic laminates. We have also confirmed during this phase of the Contract that the Optimum Paste H can be processed and applied under normal ambient conditions, without special precautions of low temperature or inert atmospheres, a property which sets our system apart from many other commercial pastes. We would also like to remark the achievement of optimized paste properties and how these properties address the mayor issues and requirements for flip attach applications, in Table I and II of this report. Use of the PMC to build interposer for chip-testing. Due to the high electrical conductivity of the PMC, a process was developed to use a thin film layer of the paste applied to a metal cathode of an electrochemical cell, to build fully metallized thru hole arrays containing a given C-4 chip foot print. This array interposers can be used for chip test (known-good-chip) applications. This process will be described in detail at the Year-End Review Meeting in Binghanton.

  15. The effect of metal-contacts on carbon nanotube for high frequency interconnects and devices

    SciTech Connect

    Chimowa, George; Bhattacharyya, Somnath

    2014-08-15

    High frequency characterisation of platinum and tungsten contacts on individual multi-walled carbon nanotubes (MWNT) is performed from 10 MHz to 50 GHz. By measuring the scattering parameters of aligned individual MWNTs, we show that metal contacts enhance an inductive response due to the improved MWNT-electrode coupling reducing the capacitive effect. This behaviour is pronounced in the frequency below 10 GHz and strong for tungsten contacts. We explain the inductive response as a result of the interaction of stimulus current with the localized (or defects) states present at the contact region resulting in the current lagging behind the voltage. The results are further supported by direct current measurements that show tungsten to significantly increase carbon nanotube-electrode coupling. The immediate consequence is the reduction of the contact resistance, implying a reduction of electron tunnelling barrier from the electrode to the carbon nanotube.

  16. Electrically robust metal nanowire network formation by in-situ interconnection with single-walled carbon nanotubes.

    PubMed

    Woo, Jong Seok; Han, Joong Tark; Jung, Sunshin; Jang, Jeong In; Kim, Ho Young; Jeong, Hee Jin; Jeong, Seung Yol; Baeg, Kang-Jun; Lee, Geon-Woong

    2014-01-01

    Modulation of the junction resistance between metallic nanowires is a crucial factor for high performance of the network-structured conducting film. Here, we show that under current flow, silver nanowire (AgNW) network films can be stabilised by minimizing the Joule heating at the NW-NW junction assisted by in-situ interconnection with a small amount (less than 3 wt%) of single-walled carbon nanotubes (SWCNTs). This was achieved by direct deposition of AgNW suspension containing SWCNTs functionalised with quadruple hydrogen bonding moieties excluding dispersant molecules. The electrical stabilisation mechanism of AgNW networks involves the modulation of the electrical transportation pathway by the SWCNTs through the SWCNT-AgNW junctions, which results in a relatively lower junction resistance than the NW-NW junction in the network film. In addition, we propose that good contact and Fermi level matching between AgNWs and modified SWCNTs lead to the modulation of the current pathway. The SWCNT-induced stabilisation of the AgNW networks was also demonstrated by irradiating the film with microwaves. The development of the high-throughput fabrication technology provides a robust and scalable strategy for realizing high-performance flexible transparent conductor films.

  17. Electrically Robust Metal Nanowire Network Formation by In-Situ Interconnection with Single-Walled Carbon Nanotubes

    PubMed Central

    Woo, Jong Seok; Han, Joong Tark; Jung, Sunshin; Jang, Jeong In; Kim, Ho Young; Jeong, Hee Jin; Jeong, Seung Yol; Baeg, Kang-Jun; Lee, Geon-Woong

    2014-01-01

    Modulation of the junction resistance between metallic nanowires is a crucial factor for high performance of the network-structured conducting film. Here, we show that under current flow, silver nanowire (AgNW) network films can be stabilised by minimizing the Joule heating at the NW-NW junction assisted by in-situ interconnection with a small amount (less than 3 wt%) of single-walled carbon nanotubes (SWCNTs). This was achieved by direct deposition of AgNW suspension containing SWCNTs functionalised with quadruple hydrogen bonding moieties excluding dispersant molecules. The electrical stabilisation mechanism of AgNW networks involves the modulation of the electrical transportation pathway by the SWCNTs through the SWCNT-AgNW junctions, which results in a relatively lower junction resistance than the NW-NW junction in the network film. In addition, we propose that good contact and Fermi level matching between AgNWs and modified SWCNTs lead to the modulation of the current pathway. The SWCNT-induced stabilisation of the AgNW networks was also demonstrated by irradiating the film with microwaves. The development of the high-throughput fabrication technology provides a robust and scalable strategy for realizing high-performance flexible transparent conductor films. PMID:24763208

  18. Evaluation of nickel-titanium oxide-niobium pentoxide metal ceramic composite as interconnect for solid oxide fuel cell

    NASA Astrophysics Data System (ADS)

    Budur, Abhijith

    With increasing importance for clean energy, fuel cells have gained great significance in recent decades. Solid oxide fuel cells are easy to transport due to presence of solid electrolyte and also have requisite electrical properties,but have been obstructed by their limitation to be used at only temperatures greater than 6000C and less than 8000C. To construct a stack of cells, materials that are good electrical conductors and having necessary mechanical strengths at that temperatures are being considered as interconnects between the cells. Evaluation of Nickel-Titanium dioxide-Niobium pentoxide (NTN) as interconnect and comparison to Stainless Steel 441 alloy has been made in this research. The criteria for evaluation are the resistance, long-term stability and the power density characteristics of the cell for each interconnect. Electrical measurements by impedance spectroscopy techniques were conducted at variousworking temperatures using a gas mixture of 10 % hydrogen and 90% nitrogen to evaluate both interconnect materials in the working range of fuel cells. Scanning Electron Microscopy images of Lanthanum Strontium Manganite paste before and after the fuel cell measurements are shown.The results showed that both NTN and Stainless Steel 441 interconnects exhibit similar electrical properties under operating conditions of the fuel cell. Since theNTN interconnect is less prone to corrosion and does not have the effect of chromium poisoning, it can be considered as a viable interconnect material for solid oxide fuel cells.

  19. Metal-interconnection-free integration of InGaN/GaN light emitting diodes with AlGaN/GaN high electron mobility transistors

    SciTech Connect

    Liu, Chao; Cai, Yuefei; Liu, Zhaojun; Ma, Jun; Lau, Kei May

    2015-05-04

    We report a metal-interconnection-free integration scheme for InGaN/GaN light emitting diodes (LEDs) and AlGaN/GaN high electron mobility transistors (HEMTs) by combining selective epi removal (SER) and selective epitaxial growth (SEG) techniques. SER of HEMT epi was carried out first to expose the bottom unintentionally doped GaN buffer and the sidewall GaN channel. A LED structure was regrown in the SER region with the bottom n-type GaN layer (n-electrode of the LED) connected to the HEMTs laterally, enabling monolithic integration of the HEMTs and LEDs (HEMT-LED) without metal-interconnection. In addition to saving substrate real estate, minimal interface resistance between the regrown n-type GaN and the HEMT channel is a significant improvement over metal-interconnection. Furthermore, excellent off-state leakage characteristics of the driving transistor can also be guaranteed in such an integration scheme.

  20. Metal-interconnection-free integration of InGaN/GaN light emitting diodes with AlGaN/GaN high electron mobility transistors

    NASA Astrophysics Data System (ADS)

    Liu, Chao; Cai, Yuefei; Liu, Zhaojun; Ma, Jun; Lau, Kei May

    2015-05-01

    We report a metal-interconnection-free integration scheme for InGaN/GaN light emitting diodes (LEDs) and AlGaN/GaN high electron mobility transistors (HEMTs) by combining selective epi removal (SER) and selective epitaxial growth (SEG) techniques. SER of HEMT epi was carried out first to expose the bottom unintentionally doped GaN buffer and the sidewall GaN channel. A LED structure was regrown in the SER region with the bottom n-type GaN layer (n-electrode of the LED) connected to the HEMTs laterally, enabling monolithic integration of the HEMTs and LEDs (HEMT-LED) without metal-interconnection. In addition to saving substrate real estate, minimal interface resistance between the regrown n-type GaN and the HEMT channel is a significant improvement over metal-interconnection. Furthermore, excellent off-state leakage characteristics of the driving transistor can also be guaranteed in such an integration scheme.

  1. X-ray photoelectron spectroscopy, depth profiling, and elemental imaging of metal/polyimide interfaces of high density interconnect packages subjected to temperature and humidity

    SciTech Connect

    Jung, David R.; Ibidunni, Bola; Ashraf, Muhammad

    1998-11-24

    X-ray photoelectron spectroscopy (XPS) was used to analyze surfaces and buried interfaces of a tape ball grid array (TBGA) interconnect package that was exposed to temperature and humidity testing (the pressure cooker test or PCT). Two metallization structures, employing 3.5 and 7.5 nm Cr adhesion layers, respectively, showed dramatically different results in the PCT. For the metallization with 3.5 nm Cr, spontaneous failure occurred on the polymer side of the metal/polyimide interface. Copper and other metals were detected by XPS on and below this polymer surface. For the metallization with 7.5 nm Cr, which did not delaminate in the PCT, the metallization was manually peeled away and also showed failure at the polymer side of the interface. Conventional XPS taken from a 1 mm diameter area showed the presence of metals on and below this polymer surface. Detailed spatially-resolved analysis using small area XPS (0.1 mm diameter area) and imaging XPS (7 {mu}m resolution) showed that this metal did not migrate through and below the metal/polymer interface, but around and outside of the metallized area.

  2. Coplanar interconnection module

    NASA Technical Reports Server (NTRS)

    Steward, R. D.; Windsor, H. F.

    1970-01-01

    Module for interconnecting a semiconductor array to external leads or components incorporates a metal external heat sink for cooling the array. Heat sink, extending down from the molded block that supports the array, is immersed in a liquid nitrogen bath which is designed to maintain the desired array temperature.

  3. Multi-level modeling for sensitivity assessment of springback in sheet metal forming

    NASA Astrophysics Data System (ADS)

    Lebon, J.; Lequilliec, G.; Coelho, R. Filomeno; Breitkopf, P.; Villon, P.

    2013-05-01

    In this work, we highlight that sensitivity analysis of metal forming process requires both high precision and low cost numerical models. We propose a two-pronged methodology to address these challenges. The deep drawing simulation process is performed using an original low cost semi-analytical approach based on a bending under tension model (B-U-T) with a good accuracy for small random perturbations of the physical and process parameters. The springback sensitivity analysis is based on the Sobol indices approach and performed using an non intrusive efficient methodology based on the post-treatment of the polynomial chaos coefficients.

  4. SOFC INTERCONNECT DEVELOPMENT

    SciTech Connect

    Diane M. England

    2004-03-16

    An interconnect for an SOFC stack is used to connect fuel cells into a stack. SOFC stacks are expected to run for 40,000 hours and 10 thermal cycles for the stationary application and 10,000 hours and 7000 thermal cycles for the transportation application. The interconnect of a stack must be economical and robust enough to survive the SOFC stack operation temperature of 750 C and must maintain the electrical connection to the fuel cells throughout the lifetime and under thermal cycling conditions. Ferritic and austenitic stainless steels, and nickel-based superalloys were investigated as possible interconnect materials for solid oxide fuel cell (SOFC) stacks. The alloys were thermally cycled in air and in a wet nitrogen-argon-hydrogen (N2-Ar-H2-H2O) atmosphere. Thermogravimetry was used to determine the parabolic oxidation rate constants of the alloys in both atmospheres. The area-specific resistance of the oxide scale and metal substrates were measured using a two-probe technique with platinum contacts. The study identifies two new interconnect designs which can be used with both bonded and compressive stack sealing mechanisms. The new interconnect designs offer a solution to chromium vaporization, which can lead to degradation of some (chromium-sensitive) SOFC cathodes.

  5. The effect of doping (Mn,B)3O4 materials as protective layers in different metallic interconnects for Solid Oxide Fuel Cells

    NASA Astrophysics Data System (ADS)

    Miguel-Pérez, Verónica; Martínez-Amesti, Ana; Nó, María Luisa; Larrañaga, Aitor; Arriortua, María Isabel

    2013-12-01

    Spinel oxides with the general formula of (Mn,B)3O4 (B = Co, Fe) were used as barrier materials between the cathode and the metallic interconnect to reduce the rate of cathode degradation by Cr poisoning. The effect of doping at the B position was investigated terms of microstructure and electrical conductivity to determine its behaviour and effectiveness as a protective layer in contact with three metallic materials (Crofer 22 APU, SS430 and Conicro 4023 W 188). The analysis showed that the use of these materials considerably decreased the reactivity and diffusion of Cr between the cathode and the metallic interconnects. The protective layer doped with Fe at the B position exhibited the least amount of reactivity with the interconnector and cathode materials. The worst results were observed for SS430 cells coated with a protective layer perhaps due to their low Cr content. The Crofer 22 APU and Conicro 4023 W 188 samples exhibited very similar conductivity results in the presence of the MnCo1.9Fe0.1O4 protective coating. As a result, these two material combinations are a promising option for use as bipolar plates in SOFC.

  6. Evidence of Processing Non-Idealities in 4H-SiC Integrated Circuits Fabricated with Two Levels of Metal Interconnect

    NASA Technical Reports Server (NTRS)

    Spry, David J.; Neudeck, Philip G.; Liangyu, Chen; Evans, Laura J.; Lukco, Dorothy; Chang, Carl W.; Beheim, Glenn M.

    2015-01-01

    The fabrication and prolonged 500 C electrical testing of 4H-SiC junction field effect transistor (JFET) integrated circuits (ICs) with two levels of metal interconnect is reported in another submission to this conference proceedings. While some circuits functioned more than 1000 hours at 500 C, the majority of packaged ICs from this wafer electrically failed after less than 200 hours of operation in the same test conditions. This work examines the root physical degradation and failure mechanisms believed responsible for observed large discrepancies in 500 C operating time. Evidence is presented for four distinct issues that significantly impacted 500 C IC operational yield and lifetime for this wafer.

  7. Evidence of Processing Non-Idealities in 4H-SiC Integrated Circuits Fabricated With Two Levels of Metal Interconnect

    NASA Technical Reports Server (NTRS)

    Spry, David J.; Neudeck, Philip G.; Chen, Liangyu; Evans, Laura J.; Lukco, Dorothy; Chang, Carl W.; Beheim, Glenn M.

    2015-01-01

    The fabrication and prolonged 500 C electrical testing of 4H-SiC junction field effect transistor (JFET) integrated circuits (ICs) with two levels of metal interconnect is reported in another submission to this conference proceedings. While some circuits functioned more than 3000 hours at 500 C, the majority of packaged ICs from this wafer electrically failed after less than 200 hours of operation in the same test conditions. This work examines the root physical degradation and failure mechanisms believed responsible for observed large discrepancies in 500 C operating time. Evidence is presented for four distinct issues that significantly impacted 500 C IC operational yield and lifetime for this wafer.

  8. Electrical behavior of aluminosilicate glass-ceramic sealants and their interaction with metallic solid oxide fuel cell interconnects

    NASA Astrophysics Data System (ADS)

    Goel, Ashutosh; Tulyaganov, Dilshat U.; Kharton, Vladislav V.; Yaremchenko, Aleksey A.; Ferreira, José M. F.

    A series of alkaline-earth aluminosilicate glass-ceramics (GCs) were appraised with respect to their suitability as sealants for solid oxide fuel cells (SOFCs). The parent composition with general formula Ca 0.9MgAl 0.1La 0.1Si 1.9O 6 was modified with Cr 2O 3 and BaO. The addition of BaO led to a substantial decrease in the total electrical conductivity of the GCs, thus improving their insulating properties. BaO-containing GCs exhibited higher coefficient of thermal expansion (CTE) in comparison to BaO-free GCs. An extensive segregation of oxides of Ti and Mn, components of the Crofer22 APU interconnect alloy, along with negligible formation of BaCrO 4 was observed at the interface between GC/interconnects diffusion couples. Thermal shock resistance and gas-tightness of GC sealants in contact with yttria-stabilized zirconia electrolyte (8YSZ) was evaluated in air and water. Good matching of CTE and strong, but not reactive, adhesion to the solid electrolyte and interconnect, in conjunction with a high level of electrical resistivity, are all advantageous for potential SOFC applications.

  9. Alloy Films Deposited by Electroplating as Precursors for Protective Oxide Coatings on Solid Oxide Fuel Cells Metallic Interconnect Materials

    SciTech Connect

    Johnson, Christopher; Gemmen, R.S.; Cross, Caleb

    2006-10-01

    The successful development of stainless steel interconnects for intermediate temperature solid oxide fuel cells (SOFC) may be the materials breakthrough that makes SOFC technology truly commercial. Many of the ferritic stainless steels, however, suffer from a relatively high area specific resistance (ASR) after long exposure times at temperature and the Cr in the native oxide can evaporate and contaminate other cell components. Conductive coatings that resist oxide scale growth and chromium evaporation may prevent both of these problems. In the present study electrochemical deposition of binary alloys followed by oxidation of the alloy to form protective and conductive oxide layers is examined. Results are presented for the deposition of Mn/Co and Fe/Ni alloys via electroplating to form a precursor for spinel oxide coating formation. Analysis of the alloy coatings is done by SEM, EDS and XRD.

  10. Electrical interconnect

    DOEpatents

    Frost, John S.; Brandt, Randolph J.; Hebert, Peter; Al Taher, Omar

    2015-10-06

    An interconnect includes a first set of connector pads, a second set of connector pads, and a continuous central portion. A first plurality of legs extends at a first angle from the continuous central portion. Each leg of the first plurality of legs is connected to a connector pad of a first set of connector pads. A second plurality of legs extends at a second angle from the continuous central portion. Each leg of the second plurality of legs is connected to a connector pad of the second set of connector pads. Gaps are defined between legs. The gaps enable movement of the first set of connector pads relative to the second set of connector pads.

  11. Modeling interconnect corners under double patterning misalignment

    NASA Astrophysics Data System (ADS)

    Hyun, Daijoon; Shin, Youngsoo

    2016-03-01

    Publisher's Note: This paper, originally published on March 16th, was replaced with a corrected/revised version on March 28th. If you downloaded the original PDF but are unable to access the revision, please contact SPIE Digital Library Customer Service for assistance. Interconnect corners should accurately reflect the effect of misalingment in LELE double patterning process. Misalignment is usually considered separately from interconnect structure variations; this incurs too much pessimism and fails to reflect a large increase in total capacitance for asymmetric interconnect structure. We model interconnect corners by taking account of misalignment in conjunction with interconnect structure variations; we also characterize misalignment effect more accurately by handling metal pitch at both sides of a target metal independently. Identifying metal space at both sides of a target metal.

  12. Multilevel light bending in nanoplasmonics

    NASA Astrophysics Data System (ADS)

    El Sherif, Mohamed H.; Ahmed, Osman S.; Bakr, Mohamed H.; Swillam, Mohamed A.

    2014-03-01

    Nanoplasmonic optical interconnects is proposed to mitigate challenges facing electronics integration. It provides fast and miniaturized data channel that overcome the diffraction limit. We present a three dimensional plasmonic coupler that vertically bends the light to multilevel circuit configurations. It exploits light guiding in nanoscale plasmonic slot waveguides (PSWs). A triangularly-shaped plasmonic slot waveguide rotator is introduced to attain such coupling with good efficiency over a wide bandwidth. Using this approach, light propagating in a horizontal direction is easily converted and coupled to propagate in the vertical direction and vice versa. The proposed configuration is further extended to the design of a multilayer power divider/combiner with ultra-compact footprint that guides the light to multiple channels. A detailed study of the triangular rotator is demonstrated with the analysis of multiple configurations. This structure is suitable for efficient coupling and splitting in multilevel nano circuit environment.

  13. Joint strength of a solid oxide fuel cell glass-ceramic sealant with metallic interconnect in a reducing environment

    NASA Astrophysics Data System (ADS)

    Lin, Chih-Kuang; Liu, Yu-An; Wu, Si-Han; Liu, Chien-Kuo; Lee, Ruey-Yi

    2015-04-01

    Effects of reducing environment and thermal aging on the joint strength of a BaO-B2O3-Al2O3-SiO2 glass-ceramic sealant (GC-9) with a ferritic-stainless-steel interconnect (Crofer 22 H) for planar solid oxide fuel cells are investigated. A technique is developed for conducting mechanical tests at room temperature and 800 °C in H2-7 vol% H2O under shear and tensile loadings. Given an aged condition and loading mode, the joint strength at 800 °C is lower than that at room temperature in the given humidified hydrogen atmosphere. A thermal aging at 800 °C in H2-7 vol% H2O for 100 h or 1000 h enhances both shear and tensile joint strengths at room temperature but degrades them at 800 °C in the same reducing environment. Non-aged specimens show a comparable joint strength and fracture mode when tested in humidified hydrogen and in air under a given loading mode and testing temperature. The shear strength at 800 °C for joint specimens after a 1000-h thermal aging at 800 °C in air or humidified hydrogen is reduced by a similar extent of 19%, compared to the counterpart of non-aged joint specimens tested in the same oxidizing or reducing environment.

  14. Advanced Interconnect Development

    SciTech Connect

    Yang, Z.G.; Maupin, G.; Simner, S.; Singh, P.; Stevenson, J.; Xia, G.

    2005-01-27

    The objectives of this project are to develop cost-effective, optimized materials for intermediate temperature SOFC interconnect and interconnect/electrode interface applications and identify and understand degradation processes in interconnects and at their interfaces with electrodes.

  15. Interconnected semiconductor devices

    DOEpatents

    Grimmer, Derrick P.; Paulson, Kenneth R.; Gilbert, James R.

    1990-10-23

    Semiconductor layer and conductive layer formed on a flexible substrate, divided into individual devices and interconnected with one another in series by interconnection layers and penetrating terminals.

  16. Breakdown current density in h-BN-capped quasi-1D TaSe3 metallic nanowires: prospects of interconnect applications.

    PubMed

    Stolyarov, Maxim A; Liu, Guanxiong; Bloodgood, Matthew A; Aytan, Ece; Jiang, Chenglong; Samnakay, Rameez; Salguero, Tina T; Nika, Denis L; Rumyantsev, Sergey L; Shur, Michael S; Bozhilov, Krassimir N; Balandin, Alexander A

    2016-08-25

    We report on the current-carrying capacity of the nanowires made from the quasi-1D van der Waals metal tantalum triselenide capped with quasi-2D boron nitride. The chemical vapor transport method followed by chemical and mechanical exfoliation were used to fabricate the mm-long TaSe3 wires with the lateral dimensions in the 20 to 70 nm range. Electrical measurements establish that the TaSe3/h-BN nanowire heterostructures have a breakdown current density exceeding 10 MA cm(-2)-an order-of-magnitude higher than that for copper. Some devices exhibited an intriguing step-like breakdown, which can be explained by the atomic thread bundle structure of the nanowires. The quasi-1D single crystal nature of TaSe3 results in a low surface roughness and in the absence of the grain boundaries. These features can potentially enable the downscaling of the nanowires to lateral dimensions in a few-nm range. Our results suggest that quasi-1D van der Waals metals have potential for applications in the ultimately downscaled local interconnects. PMID:27531559

  17. Interconnection networks

    DOEpatents

    Faber, V.; Moore, J.W.

    1988-06-20

    A network of interconnected processors is formed from a vertex symmetric graph selected from graphs GAMMA/sub d/(k) with degree d, diameter k, and (d + 1)exclamation/ (d /minus/ k + 1)exclamation processors for each d greater than or equal to k and GAMMA/sub d/(k, /minus/1) with degree d /minus/ 1, diameter k + 1, and (d + 1)exclamation/(d /minus/ k + 1)exclamation processors for each d greater than or equal to k greater than or equal to 4. Each processor has an address formed by one of the permutations from a predetermined sequence of letters chosen a selected number of letters at a time, and an extended address formed by appending to the address the remaining ones of the predetermined sequence of letters. A plurality of transmission channels is provided from each of the processors, where each processor has one less channel than the selected number of letters forming the sequence. Where a network GAMMA/sub d/(k, /minus/1) is provided, no processor has a channel connected to form an edge in a direction delta/sub 1/. Each of the channels has an identification number selected from the sequence of letters and connected from a first processor having a first extended address to a second processor having a second address formed from a second extended address defined by moving to the front of the first extended address the letter found in the position within the first extended address defined by the channel identification number. The second address is then formed by selecting the first elements of the second extended address corresponding to the selected number used to form the address permutations. 9 figs.

  18. A Novel, Free-Space Optical Interconnect Employing Vertical-Cavity Surface Emitting Laser Diodes and InGaAs Metal-Semiconductor-Metal Photodetectors for Gbit/s RF/Microwave Systems

    NASA Technical Reports Server (NTRS)

    Savich, Gregory R.; Simons, Rainee N.

    2006-01-01

    Emerging technologies and continuing progress in vertical-cavity surface emitting laser (VCSEL) diode and metal-semiconductor-metal (MSM) photodetector research are making way for novel, high-speed forms of optical data transfer in communication systems. VCSEL diodes operating at 1550 nm have only recently become commercially available, while MSM photodetectors are pushing the limits of contact lithography with interdigitated electrode widths reaching sub micron levels. We propose a novel, free-space optical interconnect operating at about 1Gbit/s utilizing VCSEL diodes and MSM photodetectors. We report on development, progress, and current work, which are as follows: first, analysis of the divergent behavior of VCSEL diodes for coupling to MSM photodetectors with a 50 by 50 m active area and second, the normalized frequency response of the VCSEL diode as a function of the modulating frequency. Third, the calculated response of MSM photodetectors with varying electrode width and spacing on the order of 1 to 3 m as well as the fabrication and characterization of these devices. The work presented here will lead to the formation and characterization of a fully integrated 1Gbit/s free-space optical interconnect at 1550 nm and demonstrates both chip level and board level functionality for RF/microwave digital systems.

  19. Printed Module Interconnects

    SciTech Connect

    Stockert, Talysa R.; Fields, Jeremy D.; Pach, Gregory F.; Mauger, Scott A.; van Hest, Maikel F. A. M.

    2015-06-14

    Monolithic interconnects in photovoltaic modules connect adjacent cells in series, and are typically formed sequentially involving multiple deposition and scribing steps. Interconnect widths of 500 um every 10 mm result in 5% dead area, which does not contribute to power generation in an interconnected solar panel. This work expands on previous work that introduced an alternative interconnection method capable of producing interconnect widths less than 100 um. The interconnect is added to the module in a single step after deposition of the photovoltaic stack, eliminating the need for scribe alignment. This alternative method can be used for all types of thin film photovoltaic modules. Voltage addition with copper-indium-gallium-diselenide (CIGS) solar cells using a 2-scribe printed interconnect approach is demonstrated. Additionally, interconnect widths of 250 um are shown.

  20. Multilevel Model Prediction

    ERIC Educational Resources Information Center

    Frees, Edward W.; Kim, Jee-Seon

    2006-01-01

    Multilevel models are proven tools in social research for modeling complex, hierarchical systems. In multilevel modeling, statistical inference is based largely on quantification of random variables. This paper distinguishes among three types of random variables in multilevel modeling--model disturbances, random coefficients, and future response…

  1. Optical Backplane Interconnection

    NASA Technical Reports Server (NTRS)

    Hendricks, Herbert D.

    1991-01-01

    Optical backplane interconnection (OBIT), method of optically interconnecting many parallel outputs from data processor to many parallel inputs of other data processors by optically changing wavelength of output optical beam. Requires only one command: exact wavelength necessary to make connection between two desired processors. Many features, including smallness advantageous to incorporate OBIT into integrated optical device. Simplifies or eliminates wiring and speeds transfer of data over existing electrical or optical interconnections. Computer hookups and fiber-optical communication networks benefit from concept.

  2. Alignability of Optical Interconnects

    NASA Astrophysics Data System (ADS)

    Beech, Russell Scott

    With the continuing drive towards higher speed, density, and functionality in electronics, electrical interconnects become inadequate. Due to optics' high speed and bandwidth, freedom from capacitive loading effects, and freedom from crosstalk, optical interconnects can meet more stringent interconnect requirements. But, an optical interconnect requires additional components, such as an optical source and detector, lenses, holographic elements, etc. Fabrication and assembly of an optical interconnect requires precise alignment of these components. The successful development and deployment of optical interconnects depend on how easily the interconnect components can be aligned and/or how tolerant the interconnect is to misalignments. In this thesis, a method of quantitatively specifying the relative difficulty of properly aligning an optical interconnect is described. Ways of using this theory of alignment to obtain design and packaging guidelines for optical interconnects are examined. The measure of the ease with which an optical interconnect can be aligned, called the alignability, uses the efficiency of power transfer as a measure of alignment quality. The alignability is related to interconnect package design through the overall cost measure, which depends upon various physical parameters of the interconnect, such as the cost of the components and the time required for fabrication and alignment. Through a mutual dependence on detector size, the relationship between an interconnect's alignability and its bandwidth, signal-to-noise ratio, and bit-error -rate is examined. The results indicate that a range of device sizes exists for which given performance threshold values are satisfied. Next, the alignability of integrated planar-optic backplanes is analyzed in detail. The resulting data show that the alignability can be optimized by varying the substrate thickness or the angle of reflection. By including the effects of crosstalk, in a multi-channel backplane, the

  3. Perforation patterned electrical interconnects

    DOEpatents

    Frey, Jonathan

    2014-01-28

    This disclosure describes systems and methods for increasing the usable surface area of electrical contacts within a device, such as a thin film solid state device, through the implementation of electrically conductive interconnects. Embodiments described herein include the use of a plurality of electrically conductive interconnects that penetrate through a top contact layer, through one or more multiple layers, and into a bottom contact layer. The plurality of conductive interconnects may form horizontal and vertical cross-sectional patterns. The use of lasers to form the plurality of electrically conductive interconnects from reflowed layer material further aids in the manufacturing process of a device.

  4. A General Strategy to Fabricate Carbon‐Coated 3D Porous Interconnected Metal Sulfides: Case Study of SnS/C Nanocomposite for High‐Performance Lithium and Sodium Ion Batteries

    PubMed Central

    Zhu, Changbao; Kopold, Peter; Li, Weihan; van Aken, Peter A.; Maier, Joachim

    2015-01-01

    Transition metal sulfides have a great potential for energy storage due to the pronouncedly higher capacity (owing to conversion to metal or even alloy) than traditional insertion electrode materials. However, the poor cycling stability still limits the development and application in lithium and sodium ion batteries. Here, taking SnS as a model material, a novel general strategy is proposed to fabricate a 3D porous interconnected metal sulfide/carbon nanocomposite by the electrostatic spray deposition technique without adding any expensive carbonaceous materials such as graphene or carbon nanotube. In this way, small nanorods of SnS are generated with sizes of ≈10–20 nm embedded in amorphous carbon and self‐assembled into a 3D porous interconnected nanocomposite. The SnS:C is directly deposited on the Ti foil as a current collector and neither conductive additives nor binder are needed for battery assembly. Such electrodes exhibit a high reversible capacity, high rate capability, and long cycling stability for both lithium and sodium storage. PMID:27722078

  5. Interconnections for fluidic circuits

    NASA Technical Reports Server (NTRS)

    Mangion, C.

    1972-01-01

    Circuit elements are grouped on functional basis in rectangular two-dimensional planar arrays or modules. Another interconnection method brings all connections out to module edge. For smaller fluidic circuits, manifold and interconnections are fabricated as single blocks. Advantages of methods are given.

  6. Laser printed interconnects for flexible electronics

    NASA Astrophysics Data System (ADS)

    Pique, Alberto; Beniam, Iyoel; Mathews, Scott; Charipar, Nicholas

    Laser-induced forward transfer (LIFT) can be used to generate microscale 3D structures for interconnect applications non-lithographically. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or dispersed metallic nanoparticles. However, the resulting 3D structures do not achieve the bulk conductivity of metal interconnects of the same cross-section and length as those formed by wire bonding or tab welding. It is possible, however, to laser transfer entire structures using a LIFT technique known as lase-and-place. Lase-and-place allows whole components and parts to be transferred from a donor substrate onto a desired location with one single laser pulse. This talk will present the use of LIFT to laser print freestanding solid metal interconnects to connect individual devices into functional circuits. Furthermore, the same laser can bend or fold the thin metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief due to flexing or thermal mismatch. Examples of these laser printed 3D metallic bridges and their role in the development of next generation flexible electronics by additive manufacturing will be presented. This work was funded by the Office of Naval Research (ONR) through the Naval Research Laboratory Basic Research Program.

  7. Solar cell array interconnects

    DOEpatents

    Carey, Paul G.; Thompson, Jesse B.; Colella, Nicolas J.; Williams, Kenneth A.

    1995-01-01

    Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.

  8. Solar cell array interconnects

    DOEpatents

    Carey, P.G.; Thompson, J.B.; Colella, N.J.; Williams, K.A.

    1995-11-14

    Electrical interconnects are disclosed for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value. 4 figs.

  9. Multilevel and Diverse Classrooms

    ERIC Educational Resources Information Center

    Baurain, Bradley, Ed.; Ha, Phan Le, Ed.

    2010-01-01

    The benefits and advantages of classroom practices incorporating unity-in-diversity and diversity-in-unity are what "Multilevel and Diverse Classrooms" is all about. Multilevel classrooms--also known as mixed-ability or heterogeneous classrooms--are a fact of life in ESOL programs around the world. These classrooms are often not only multilevel…

  10. Multilevel Mixture Factor Models

    ERIC Educational Resources Information Center

    Varriale, Roberta; Vermunt, Jeroen K.

    2012-01-01

    Factor analysis is a statistical method for describing the associations among sets of observed variables in terms of a small number of underlying continuous latent variables. Various authors have proposed multilevel extensions of the factor model for the analysis of data sets with a hierarchical structure. These Multilevel Factor Models (MFMs)…

  11. Double interconnection fuel cell array

    DOEpatents

    Draper, R.; Zymboly, G.E.

    1993-12-28

    A fuel cell array is made, containing number of tubular, elongated fuel cells which are placed next to each other in rows (A, B, C, D), where each cell contains inner electrodes and outer electrodes, with solid electrolyte between the electrodes, where the electrolyte and outer electrode are discontinuous, having two portions, and providing at least two opposed discontinuities which contain at least two oppositely opposed interconnections contacting the inner electrode, each cell having only three metallic felt electrical connectors which contact surrounding cells, where each row is electrically connected to the other. 5 figures.

  12. Double interconnection fuel cell array

    DOEpatents

    Draper, Robert; Zymboly, Gregory E.

    1993-01-01

    A fuel cell array (10) is made, containing number of tubular, elongated fuel cells (12) which are placed next to each other in rows (A, B, C, D), where each cell contains inner electrodes (14) and outer electrodes (18 and 18'), with solid electrolyte (16 and 16') between the electrodes, where the electrolyte and outer electrode are discontinuous, having two portions, and providing at least two opposed discontinuities which contain at least two oppositely opposed interconnections (20 and 20') contacting the inner electrode (14), each cell (12) having only three metallic felt electrical connectors (22) which contact surrounding cells, where each row is electrically connected to the other.

  13. Micro-fluidic interconnect

    DOEpatents

    Okandan, Murat; Galambos, Paul C.; Benavides, Gilbert L.; Hetherington, Dale L.

    2006-02-28

    An apparatus for simultaneously aligning and interconnecting microfluidic ports is presented. Such interconnections are required to utilize microfluidic devices fabricated in Micro-Electromechanical-Systems (MEMS) technologies, that have multiple fluidic access ports (e.g. 100 micron diameter) within a small footprint, (e.g. 3 mm.times.6 mm). Fanout of the small ports of a microfluidic device to a larger diameter (e.g. 500 microns) facilitates packaging and interconnection of the microfluidic device to printed wiring boards, electronics packages, fluidic manifolds etc.

  14. Zee electrical interconnect

    NASA Technical Reports Server (NTRS)

    Rust, Thomas M. (Inventor); Gaddy, Edward M. (Inventor); Herriage, Michael J. (Inventor); Patterson, Robert E. (Inventor); Partin, Richard D. (Inventor)

    2001-01-01

    An interconnect, having some length, that reliably connects two conductors separated by the length of the interconnect when the connection is made but in which one length if unstressed would change relative to the other in operation. The interconnect comprises a base element an intermediate element and a top element. Each element is rectangular and formed of a conducting material and has opposed ends. The elements are arranged in a generally Z-shape with the base element having one end adapted to be connected to one conductor. The top element has one end adapted to be connected to another conductor and the intermediate element has its ends disposed against the other end of the base and the top element. Brazes mechanically and electrically interconnect the intermediate element to the base and the top elements proximate the corresponding ends of the elements. When the respective ends of the base and the top elements are connected to the conductors, an electrical connection is formed therebetween, and when the conductors are relatively moved or the interconnect elements change length the elements accommodate the changes and the associated compression and tension forces in such a way that the interconnect does not mechanically fatigue.

  15. Multilevel ensemble Kalman filtering

    DOE PAGESBeta

    Hoel, Hakon; Law, Kody J. H.; Tempone, Raul

    2016-06-14

    This study embeds a multilevel Monte Carlo sampling strategy into the Monte Carlo step of the ensemble Kalman filter (EnKF) in the setting of finite dimensional signal evolution and noisy discrete-time observations. The signal dynamics is assumed to be governed by a stochastic differential equation (SDE), and a hierarchy of time grids is introduced for multilevel numerical integration of that SDE. Finally, the resulting multilevel EnKF is proved to asymptotically outperform EnKF in terms of computational cost versus approximation accuracy. The theoretical results are illustrated numerically.

  16. Multilevel filtering elliptic preconditioners

    NASA Technical Reports Server (NTRS)

    Kuo, C. C. Jay; Chan, Tony F.; Tong, Charles

    1989-01-01

    A class of preconditioners is presented for elliptic problems built on ideas borrowed from the digital filtering theory and implemented on a multilevel grid structure. They are designed to be both rapidly convergent and highly parallelizable. The digital filtering viewpoint allows the use of filter design techniques for constructing elliptic preconditioners and also provides an alternative framework for understanding several other recently proposed multilevel preconditioners. Numerical results are presented to assess the convergence behavior of the new methods and to compare them with other preconditioners of multilevel type, including the usual multigrid method as preconditioner, the hierarchical basis method and a recent method proposed by Bramble-Pasciak-Xu.

  17. Enabling Inexpensive Metallic Alloys as SOFC Interconnects: An Investigation into Hybrid Coating Technologies to Deposit Nanocomposite Functional Coatings on Ferritic Stainless Steel

    SciTech Connect

    Gannon, Paul; Gorokhovsky, Vladimir I.; Deibert, Max; Smith, Richard J.; Kayani, Asghar N.; White, P T.; Sofie, Stephen W.; Yang, Z Gary; Mccready, David E.; Visco, S.; Jacobson, C.; Kurokawa, H.

    2007-11-01

    Reduced operating temperatures (600-800°C) of Solid Oxide Fuel Cells (SOFCs) may enable the use of inexpensive ferritic steels as interconnects. Due to the demanding SOFC interconnect operating environment, protective coatings are required to increase long-term stability. In this study, large area filtered arc deposition (LAFAD) and hybrid filtered arc-assisted electron beam physical vapor deposition (FA-EBPVD) technologies were used to deposit two-segment coatings with Cr-Al-Y-O nanocomposite bottom segments and Mn-Co-O spinel-based top segments. Coatings were deposited on ferritic steels and subsequently annealed in air for various times. Surface oxidation was investigated using SEM/EDS, XRD and RBS analyses. Cr-volatilization was evaluated by transpiration and ICP-MS analysis of the resultant condensate. Time dependent Area Specific Resistance (ASR) was studied using the four-point technique. The oxidation behavior, Cr volatilization rate, and ASR of coated and uncoated samples are reported. Significant long-term (>1,000 hours) surface stability, low ASR, and dramatically reduced Cr-volatility were observed with the coated specimens. Improvement mechanisms, including the coating diffusion barrier properties and electrical conductivity are discussed.

  18. A multilevel optimization of large-scale dynamic systems

    NASA Technical Reports Server (NTRS)

    Siljak, D. D.; Sundareshan, M. K.

    1976-01-01

    A multilevel feedback control scheme is proposed for optimization of large-scale systems composed of a number of (not necessarily weakly coupled) subsystems. Local controllers are used to optimize each subsystem, ignoring the interconnections. Then, a global controller may be applied to minimize the effect of interconnections and improve the performance of the overall system. At the cost of suboptimal performance, this optimization strategy ensures invariance of suboptimality and stability of the systems under structural perturbations whereby subsystems are disconnected and again connected during operation.

  19. Viewing Integrated-Circuit Interconnections By SEM

    NASA Technical Reports Server (NTRS)

    Lawton, Russel A.; Gauldin, Robert E.; Ruiz, Ronald P.

    1990-01-01

    Back-scattering of energetic electrons reveals hidden metal layers. Experiment shows that with suitable operating adjustments, scanning electron microscopy (SEM) used to look for defects in aluminum interconnections in integrated circuits. Enables monitoring, in situ, of changes in defects caused by changes in temperature. Gives truer picture of defects, as etching can change stress field of metal-and-passivation pattern, causing changes in defects.

  20. Welded solar cell interconnection

    NASA Technical Reports Server (NTRS)

    Stofel, E. J.; Browne, E. R.; Meese, R. A.; Vendura, G. J.

    1982-01-01

    The efficiency of the welding of solar-cell interconnects is compared with the efficiency of soldering such interconnects, and the cases in which welding may be superior are examined. Emphasis is placed on ultrasonic welding; attention is given to the solar-cell welding machine, the application of the welding process to different solar-cell configurations, producibility, and long-life performance of welded interconnects. Much of the present work has been directed toward providing increased confidence in the reliability of welding using conditions approximating those that would occur with large-scale array production. It is concluded that there is as yet insufficient data to determine which of three methods (soldering, parallel gap welding, and ultrasonic welding) provides the longest-duration solar panel life.

  1. Interconnect Between a Waveguide and a Dielectric Waveguide Comprising an Impedance Matched Dielectric Lens

    NASA Technical Reports Server (NTRS)

    Decrossas, Emmanuel (Inventor); Chattopadhyay, Goutam (Inventor); Chahat, Nacer (Inventor); Tang, Adrian J. (Inventor)

    2016-01-01

    A lens for interconnecting a metallic waveguide with a dielectric waveguide is provided. The lens may be coupled a metallic waveguide and a dielectric waveguide, and minimize a signal loss between the metallic waveguide and the dielectric waveguide.

  2. SOFC INTERCONNECT DEVELOPMENT

    SciTech Connect

    Diane M. England

    2003-06-06

    This report summarizes the interconnect work being performed at Delphi. Materials were chosen for this interconnect project were chosen from ferritic and austenitic stainless steels, and nickel-based superalloys. The alloys are thermally cycled in air and a wet hydrogen atmosphere. The oxide scale adherence, electrical resistance and oxidation resistance are determined after long-term oxidation of each alloy. The oxide scale adherence will be observed using a scanning electron microscope. The electrical resistance of the oxidized alloys will be determined using an electrical resistance measurement apparatus which has been designed and is currently being built. Data from the electrical resistance measurement is expected to be provided in the second quarter.

  3. Open Systems Interconnection.

    ERIC Educational Resources Information Center

    Denenberg, Ray

    1985-01-01

    Discusses the need for standards allowing computer-to-computer communication and gives examples of technical issues. The seven-layer framework of the Open Systems Interconnection (OSI) Reference Model is explained and illustrated. Sidebars feature public data networks and Recommendation X.25, OSI standards, OSI layer functions, and a glossary.…

  4. Interconnecting with VIPs

    ERIC Educational Resources Information Center

    Collins, Robert

    2013-01-01

    Interconnectedness changes lives. It can even save lives. Recently the author got to witness and be part of something in his role as a teacher of primary science that has changed lives: it may even have saved lives. It involved primary science teaching--and the climate. Robert Collins describes how it is all interconnected. The "Toilet…

  5. CAISSON: Interconnect Network Simulator

    NASA Technical Reports Server (NTRS)

    Springer, Paul L.

    2006-01-01

    Cray response to HPCS initiative. Model future petaflop computer interconnect. Parallel discrete event simulation techniques for large scale network simulation. Built on WarpIV engine. Run on laptop and Altix 3000. Can be sized up to 1000 simulated nodes per host node. Good parallel scaling characteristics. Flexible: multiple injectors, arbitration strategies, queue iterators, network topologies.

  6. Capillary interconnect device

    SciTech Connect

    Renzi, Ronald F

    2013-11-19

    An interconnecting device for connecting a plurality of first fluid-bearing conduits to a corresponding plurality of second fluid-bearing conduits thereby providing fluid communication between the first fluid-bearing conduits and the second fluid-bearing conduits. The device includes a manifold and one or two ferrule plates that are held by compressive axial forces.

  7. Multilevel corporate environmental responsibility.

    PubMed

    Karassin, Orr; Bar-Haim, Aviad

    2016-12-01

    The multilevel empirical study of the antecedents of corporate social responsibility (CSR) has been identified as "the first knowledge gap" in CSR research. Based on an extensive literature review, the present study outlines a conceptual multilevel model of CSR, then designs and empirically validates an operational multilevel model of the principal driving factors affecting corporate environmental responsibility (CER), as a measure of CSR. Both conceptual and operational models incorporate three levels of analysis: institutional, organizational, and individual. The multilevel nature of the design allows for the assessment of the relative importance of the levels and of their components in the achievement of CER. Unweighted least squares (ULS) regression analysis reveals that the institutional-level variables have medium relationships with CER, some variables having a negative effect. The organizational level is revealed as having strong and positive significant relationships with CER, with organizational culture and managers' attitudes and behaviors as significant driving forces. The study demonstrates the importance of multilevel analysis in improving the understanding of CSR drivers, relative to single level models, even if the significance of specific drivers and levels may vary by context.

  8. Multilevel corporate environmental responsibility.

    PubMed

    Karassin, Orr; Bar-Haim, Aviad

    2016-12-01

    The multilevel empirical study of the antecedents of corporate social responsibility (CSR) has been identified as "the first knowledge gap" in CSR research. Based on an extensive literature review, the present study outlines a conceptual multilevel model of CSR, then designs and empirically validates an operational multilevel model of the principal driving factors affecting corporate environmental responsibility (CER), as a measure of CSR. Both conceptual and operational models incorporate three levels of analysis: institutional, organizational, and individual. The multilevel nature of the design allows for the assessment of the relative importance of the levels and of their components in the achievement of CER. Unweighted least squares (ULS) regression analysis reveals that the institutional-level variables have medium relationships with CER, some variables having a negative effect. The organizational level is revealed as having strong and positive significant relationships with CER, with organizational culture and managers' attitudes and behaviors as significant driving forces. The study demonstrates the importance of multilevel analysis in improving the understanding of CSR drivers, relative to single level models, even if the significance of specific drivers and levels may vary by context. PMID:27595527

  9. Self-assembly of 1D mixed-metal tubular network with coordination bonds through the interconnection of organometallic metallamacrocycles by Ag(I) centers.

    PubMed

    Wang, Guo-Liang; Lin, Yue-Jian; Jin, Guo-Xin

    2011-05-21

    The combination of a ditopic ligand containing a functional "third site" as a bridge and organometallic half-sandwich iridium unit Cp*Ir as the corner leads to the formation of the tetranuclear metallamacrocycle 1, which is reacted with silver compound, resulting in the formation of mixed-metal infinitely tubular coordination network 2.

  10. Prediction in Multilevel Models

    ERIC Educational Resources Information Center

    Afshartous, David; de Leeuw, Jan

    2005-01-01

    Multilevel modeling is an increasingly popular technique for analyzing hierarchical data. This article addresses the problem of predicting a future observable y[subscript *j] in the jth group of a hierarchical data set. Three prediction rules are considered and several analytical results on the relative performance of these prediction rules are…

  11. Material development of polymer/metal paste for flip-chip attach interconnection technology. Quarterly progress report, December 1, 1995--March 31, 1996

    SciTech Connect

    Saraf, R.F.; Roldan, J.M.; Sambucetti, C.J.

    1996-05-01

    In this report on Polymer/Metal Composite (PMC) adhesive the authors describe two aspects of the material that are crucial to its applicability as a viable material for Flip Chip Attach (FCA) technology. They describe the shelf-life of the material at room temperature and its effect on the adhesion. Then they discuss the electrical and mechanical behavior of PMC bond under strain. It is demonstrated that the bond can be subjected to well over 40% strain with insignificant change in its electrical properties.

  12. Multilevel Interventions: Measurement and Measures

    PubMed Central

    Charns, Martin P.; Alligood, Elaine C.; Benzer, Justin K.; Burgess, James F.; Mcintosh, Nathalie M.; Burness, Allison; Partin, Melissa R.; Clauser, Steven B.

    2012-01-01

    Background Multilevel intervention research holds the promise of more accurately representing real-life situations and, thus, with proper research design and measurement approaches, facilitating effective and efficient resolution of health-care system challenges. However, taking a multilevel approach to cancer care interventions creates both measurement challenges and opportunities. Methods One-thousand seventy two cancer care articles from 2005 to 2010 were reviewed to examine the state of measurement in the multilevel intervention cancer care literature. Ultimately, 234 multilevel articles, 40 involving cancer care interventions, were identified. Additionally, literature from health services, social psychology, and organizational behavior was reviewed to identify measures that might be useful in multilevel intervention research. Results The vast majority of measures used in multilevel cancer intervention studies were individual level measures. Group-, organization-, and community-level measures were rarely used. Discussion of the independence, validity, and reliability of measures was scant. Discussion Measurement issues may be especially complex when conducting multilevel intervention research. Measurement considerations that are associated with multilevel intervention research include those related to independence, reliability, validity, sample size, and power. Furthermore, multilevel intervention research requires identification of key constructs and measures by level and consideration of interactions within and across levels. Thus, multilevel intervention research benefits from thoughtful theory-driven planning and design, an interdisciplinary approach, and mixed methods measurement and analysis. PMID:22623598

  13. Building interconnected membrane networks.

    PubMed

    Holden, Matthew A

    2015-01-01

    Reconstituted replica cell membranes are easily created by contacting two lipid-monolayer-encased aqueous droplets under an oil phase. Called the droplet interface bilayer (DIB), this technique has been used to study a wide range of membrane processes. Importantly, this method is compatible with electrical measurements, meaning that membrane protein activities are easily observed in DIBs. By positioning droplets in two- and three-dimensional networks, sophisticated interconnected systems can be created that possess collective properties. The methods described here summarize the approaches used to create DIB networks and how to operate the devices that have been constructed so far.

  14. Carbon Nanotube Interconnect

    NASA Technical Reports Server (NTRS)

    Li, Jun (Inventor); Meyyappan, Meyya (Inventor)

    2006-01-01

    Method and system for fabricating an electrical interconnect capable of supporting very high current densities ( 10(exp 6)-10(exp 10) Amps/sq cm), using an array of one or more carbon nanotubes (CNTs). The CNT array is grown in a selected spaced apart pattern, preferably with multi-wall CNTs, and a selected insulating material, such as SiOw, or SiuNv is deposited using CVD to encapsulate each CNT in the array. An exposed surface of the insulating material is planarized to provide one or more exposed electrical contacts for one or more CNTs.

  15. Electrophoretic deposition of Mn1.5Co1.5O4 on metallic interconnect and interaction with glass-ceramic sealant for solid oxide fuel cells application

    NASA Astrophysics Data System (ADS)

    Smeacetto, Federico; De Miranda, Auristela; Cabanas Polo, Sandra; Molin, Sebastian; Boccaccini, Dino; Salvo, Milena; Boccaccini, Aldo R.

    2015-04-01

    Cr-containing stainless steels are widely used as metallic interconnects for SOFCs. Volatile Cr-containing species, which originate from the oxide formed on steel, can poison the cathode material and subsequently cause degradation in the SOFC stack. Mn1.5Co1.5O4 spinel is one of the most promising coating materials due to its high electrical conductivity, good CTE match with the stainless steel substrate and an excellent chromium retention capability. In this work Mn1.5Co1.5O4 spinel coatings are deposited on Crofer22APU substrates by cathodic electrophoretic deposition (EPD) followed by sintering at 800-1150 °C in different atmospheres. Dense, continuous and crack free Mn1.5Co1.5O4 coatings (with thickness ranging from 10 to 40 μm) are obtained on Crofer22APU substrates. Moreover, electrical properties of the coated Crofer22APU alloy are tested up to 2500 h and an excellent compatibility is found between Mn1.5Co1.5O4 coated Crofer22APU and a new glass-ceramic sealant, after 500 h of thermal tests in air, thus suggesting that the spinel protection layer can effectively act as a barrier to outward diffusion of Cr.

  16. Fuel cell system with interconnect

    DOEpatents

    Goettler, Richard; Liu, Zhien

    2015-03-10

    The present invention includes a fuel cell system having a plurality of adjacent electrochemical cells formed of an anode layer, a cathode layer spaced apart from the anode layer, and an electrolyte layer disposed between the anode layer and the cathode layer. The fuel cell system also includes at least one interconnect, the interconnect being structured to conduct free electrons between adjacent electrochemical cells. Each interconnect includes a primary conductor embedded within the electrolyte layer and structured to conduct the free electrons.

  17. Fuel cell system with interconnect

    DOEpatents

    Goettler, Richard; Liu, Zhien

    2015-08-11

    The present invention includes a fuel cell system having a plurality of adjacent electrochemical cells formed of an anode layer, a cathode layer spaced apart from the anode layer, and an electrolyte layer disposed between the anode layer and the cathode layer. The fuel cell system also includes at least one interconnect, the interconnect being structured to conduct free electrons between adjacent electrochemical cells. Each interconnect includes a primary conductor embedded within the electrolyte layer and structured to conduct the free electrons.

  18. Fuel cell system with interconnect

    DOEpatents

    Liu, Zhien; Goettler, Richard

    2015-09-29

    The present invention includes a fuel cell system having a plurality of adjacent electrochemical cells formed of an anode layer, a cathode layer spaced apart from the anode layer, and an electrolyte layer disposed between the anode layer and the cathode layer. The fuel cell system also includes at least one interconnect, the interconnect being structured to conduct free electrons between adjacent electrochemical cells. Each interconnect includes a primary conductor embedded within the electrolyte layer and structured to conduct the free electrons.

  19. Policy issues in interconnecting networks

    NASA Technical Reports Server (NTRS)

    Leiner, Barry M.

    1989-01-01

    To support the activities of the Federal Research Coordinating Committee (FRICC) in creating an interconnected set of networks to serve the research community, two workshops were held to address the technical support of policy issues that arise when interconnecting such networks. The workshops addressed the required and feasible technologies and architectures that could be used to satisfy the desired policies for interconnection. The results of the workshop are documented.

  20. Copper Nanowire Production for Interconnect Applications

    NASA Technical Reports Server (NTRS)

    Han, Jin-Woo (Inventor); Meyyappan, Meyya (Inventor)

    2014-01-01

    A method of fabricating metallic Cu nanowires with lengths up to about 25 micrometers and diameters in a range 20-100 nanometers, or greater if desired. Vertically oriented or laterally oriented copper oxide structures (CuO and/or Cu2O) are grown on a Cu substrate. The copper oxide structures are reduced with 99+ percent H or H2, and in this reduction process the lengths decrease (to no more than about 25 micrometers), the density of surviving nanostructures on a substrate decreases, and the diameters of the surviving nanostructures have a range, of about 20-100 nanometers. The resulting nanowires are substantially pure Cu and can be oriented laterally (for local or global interconnects) or can be oriented vertically (for standard vertical interconnects).

  1. Stress-induced voiding study in integrated circuit interconnects

    NASA Astrophysics Data System (ADS)

    Hou, Yuejin; Tan, Cher Ming

    2008-07-01

    An analytical equation for an ultralarge-scale integration interconnect lifetime due to stress-induced voiding (SIV) is derived from the energy perspective. It is shown that the SIV lifetime is strongly dependent on the passivation quality at the cap layer/interconnect interface, the confinement effect by the surrounding materials to the interconnects, and the available diffusion paths in the interconnects. Contrary to the traditional power-law creep model, we find that the temperature exponent in SIV lifetime formulation is determined by the available diffusion paths for the interconnect atoms and the interconnect geometries. The critical temperature for the SIV is found to be independent of passivation integrity and dielectric confinement effect. Actual stress-free temperature (SFT) during the SIV process is also found to be different from the dielectric/cap layer deposition temperature or the final annealing temperature of the metallization, and it can be evaluated analytically once the activation energy, temperature exponent and critical temperature are determined experimentally. The smaller actual SFT indicates that a strong stress relaxation occurs before the high temperature storage test. Our results show that our SIV lifetime model can be used to predict the SIV lifetime in nano-interconnects.

  2. Process for electrically interconnecting electrodes

    DOEpatents

    Carey, Paul G.; Thompson, Jesse B.; Colella, Nicolas J.; Williams, Kenneth A.

    2002-01-01

    Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb--Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb--Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.

  3. Multilevel Modeling of Social Segregation

    ERIC Educational Resources Information Center

    Leckie, George; Pillinger, Rebecca; Jones, Kelvyn; Goldstein, Harvey

    2012-01-01

    The traditional approach to measuring segregation is based upon descriptive, non-model-based indices. A recently proposed alternative is multilevel modeling. The authors further develop the argument for a multilevel modeling approach by first describing and expanding upon its notable advantages, which include an ability to model segregation at a…

  4. Supramolecular Organic Nanowires as Plasmonic Interconnects.

    PubMed

    Armao, Joseph J; Domoto, Yuya; Umehara, Teruhiko; Maaloum, Mounir; Contal, Christophe; Fuks, Gad; Moulin, Emilie; Decher, Gero; Javahiraly, Nicolas; Giuseppone, Nicolas

    2016-02-23

    Metallic nanostructures are able to interact with an incident electromagnetic field at subwavelength scales by plasmon resonance which involves the collective oscillation of conduction electrons localized at their surfaces. Among several possible applications of this phenomenon, the theoretical prediction is that optical circuits connecting multiple plasmonic elements will surpass classical electronic circuits at nanoscale because of their much faster light-based information processing. However, the placement and coupling of metallic elements smaller than optical wavelengths currently remain a formidable challenge by top-down manipulations. Here, we show that organic supramolecular triarylamine nanowires of ≈1 nm in diameter are able to act as plasmonic waveguides. Their self-assembly into plasmonic interconnects between arrays of gold nanoparticles leads to the bottom-up construction of basic optical nanocircuits. When the resonance modes of these metallic nanoparticles are coupled through the organic nanowires, the optical conductivity of the plasmonic layer dramatically increases from 259 to 4271 Ω(-1)·cm(-1). We explain this effect by the coupling of a hot electron/hole pair in the nanoparticle antenna with the half-filled polaronic band of the organic nanowire. We also demonstrate that the whole hybrid system can be described by using the abstraction of the lumped circuit theory, with a far field optical response which depends on the number of interconnects. Overall, our supramolecular bottom-up approach opens the possibility to implement processable, soft, and low cost organic plasmonic interconnects into a large number of applications going from sensing to metamaterials and information technologies.

  5. Supramolecular Organic Nanowires as Plasmonic Interconnects.

    PubMed

    Armao, Joseph J; Domoto, Yuya; Umehara, Teruhiko; Maaloum, Mounir; Contal, Christophe; Fuks, Gad; Moulin, Emilie; Decher, Gero; Javahiraly, Nicolas; Giuseppone, Nicolas

    2016-02-23

    Metallic nanostructures are able to interact with an incident electromagnetic field at subwavelength scales by plasmon resonance which involves the collective oscillation of conduction electrons localized at their surfaces. Among several possible applications of this phenomenon, the theoretical prediction is that optical circuits connecting multiple plasmonic elements will surpass classical electronic circuits at nanoscale because of their much faster light-based information processing. However, the placement and coupling of metallic elements smaller than optical wavelengths currently remain a formidable challenge by top-down manipulations. Here, we show that organic supramolecular triarylamine nanowires of ≈1 nm in diameter are able to act as plasmonic waveguides. Their self-assembly into plasmonic interconnects between arrays of gold nanoparticles leads to the bottom-up construction of basic optical nanocircuits. When the resonance modes of these metallic nanoparticles are coupled through the organic nanowires, the optical conductivity of the plasmonic layer dramatically increases from 259 to 4271 Ω(-1)·cm(-1). We explain this effect by the coupling of a hot electron/hole pair in the nanoparticle antenna with the half-filled polaronic band of the organic nanowire. We also demonstrate that the whole hybrid system can be described by using the abstraction of the lumped circuit theory, with a far field optical response which depends on the number of interconnects. Overall, our supramolecular bottom-up approach opens the possibility to implement processable, soft, and low cost organic plasmonic interconnects into a large number of applications going from sensing to metamaterials and information technologies. PMID:26814600

  6. Method of doping interconnections for electrochemical cells

    DOEpatents

    Pal, Uday B.; Singhal, Subhash C.; Moon, David M.; Folser, George R.

    1990-01-01

    A dense, electronically conductive interconnection layer 26 is bonded on a porous, tubular, electronically conductive air electrode structure 16, optionally supported by a ceramic support 22, by (A) forming a layer of oxide particles of at least one of the metals Ca, Sr, Co, Ba or Mg on a part 24 of a first surface of the air electrode 16, (B) heating the electrode structure, (C) applying a halide vapor containing at least lanthanum halide and chromium halide to the first surface and applying a source of oxygen to a second opposite surface of the air electrode so that they contact at said first surface, to cause a reaction of the oxygen and halide and cause a dense lanthanum-chromium oxide structure to grow, from the first electrode surface, between and around the oxide particles, where the metal oxide particles get incoporated into the lanthanum-chromium oxide structure as it grows thicker with time, and the metal ions in the oxide particles diffuse into the bulk of the lanthamum-chromium oxide structure, to provide a dense, top, interconnection layer 26 on top of the air electrode 16. A solid electrolyte layer 18 can be applied to the uncovered portion of the air electrode, and a fuel electrode 20 can be applied to the solid electrolyte, to provide an electrochemical cell 10.

  7. Growing Aligned Carbon Nanotubes for Interconnections in ICs

    NASA Technical Reports Server (NTRS)

    Li, Jun; Ye, Qi; Cassell, Alan; Ng, Hou Tee; Stevens, Ramsey; Han, Jie; Meyyappan, M.

    2005-01-01

    A process for growing multiwalled carbon nanotubes anchored at specified locations and aligned along specified directions has been invented. Typically, one would grow a number of the nanotubes oriented perpendicularly to a silicon integrated-circuit (IC) substrate, starting from (and anchored on) patterned catalytic spots on the substrate. Such arrays of perpendicular carbon nanotubes could be used as electrical interconnections between levels of multilevel ICs. The process (see Figure 1) begins with the formation of a layer, a few hundred nanometers thick, of a compatible electrically insulating material (e.g., SiO(x) or Si(y)N(z) on the silicon substrate. A patterned film of a suitable electrical conductor (Al, Mo, Cr, Ti, Ta, Pt, Ir, or doped Si), having a thickness between 1 nm and 2 m, is deposited on the insulating layer to form the IC conductor pattern. Next, a catalytic material (usually, Ni, Fe, or Co) is deposited to a thickness between 1 and 30 nm on the spots from which it is desired to grow carbon nanotubes. The carbon nanotubes are grown by plasma-enhanced chemical vapor deposition (PECVD). Unlike the matted and tangled carbon nanotubes grown by thermal CVD, the carbon nanotubes grown by PECVD are perpendicular and freestanding because an electric field perpendicular to the substrate is used in PECVD. Next, the free space between the carbon nanotubes is filled with SiO2 by means of CVD from tetraethylorthosilicate (TEOS), thereby forming an array of carbon nanotubes embedded in SiO2. Chemical mechanical polishing (CMP) is then performed to remove excess SiO2 and form a flat-top surface in which the outer ends of the carbon nanotubes are exposed. Optionally, depending on the application, metal lines to connect selected ends of carbon nanotubes may be deposited on the top surface. The top part of Figure 2 is a scanning electron micrograph (SEM) of carbon nanotubes grown, as described above, on catalytic spots of about 100 nm diameter patterned by

  8. Properties of e-beam deposited Pt nano-interconnects

    NASA Astrophysics Data System (ADS)

    Rotkina, Lolita

    2003-03-01

    Connecting nano-objects to macroscopic leads is a tough technical problem of nanotechnology. In this work direct electron beam induced deposition of Pt from metal-organic precursor has been used to form nano-interconnects. For example, nanotubes and nanowires, silicide needle-like islands, all-oxide semiconducting nanocrystals and other nanostructures have been wired to metal leads to perform transport measurements. Material properties of deposited nano-interconnects are in focus of this study. Chemical composition of deposit has been studied by Auger spectroscopy and Transmission Electron Microscopy. Content of the deposited material was shown to be independent on the beam current. The content was contingent on the rate of pumping-out of decomposed precursor residue. Conductivity of the nano-interconnects have been improved dramatically by annealing in low-pressure neutral atmosphere. Structural and material properties of deposit, annealed in the temperature range 100 to 400 C, were studied.

  9. Renewable Systems Interconnection: Executive Summary

    SciTech Connect

    Kroposki, B.; Margolis, R.; Kuswa, G.; Torres, J.; Bower, W.; Key, T.; Ton, D.

    2008-02-01

    The U.S. Department of Energy launched the Renewable Systems Interconnection (RSI) study in 2007 to address the challenges to high penetrations of distributed renewable energy technologies. The RSI study consists of 14 additional reports.

  10. Multilevel DC link inverter

    DOEpatents

    Su, Gui-Jia

    2003-06-10

    A multilevel DC link inverter and method for improving torque response and current regulation in permanent magnet motors and switched reluctance motors having a low inductance includes a plurality of voltage controlled cells connected in series for applying a resulting dc voltage comprised of one or more incremental dc voltages. The cells are provided with switches for increasing the resulting applied dc voltage as speed and back EMF increase, while limiting the voltage that is applied to the commutation switches to perform PWM or dc voltage stepping functions, so as to limit current ripple in the stator windings below an acceptable level, typically 5%. Several embodiments are disclosed including inverters using IGBT's, inverters using thyristors. All of the inverters are operable in both motoring and regenerating modes.

  11. Parallel multilevel preconditioners

    SciTech Connect

    Bramble, J.H.; Pasciak, J.E.; Xu, Jinchao.

    1989-01-01

    In this paper, we shall report on some techniques for the development of preconditioners for the discrete systems which arise in the approximation of solutions to elliptic boundary value problems. Here we shall only state the resulting theorems. It has been demonstrated that preconditioned iteration techniques often lead to the most computationally effective algorithms for the solution of the large algebraic systems corresponding to boundary value problems in two and three dimensional Euclidean space. The use of preconditioned iteration will become even more important on computers with parallel architecture. This paper discusses an approach for developing completely parallel multilevel preconditioners. In order to illustrate the resulting algorithms, we shall describe the simplest application of the technique to a model elliptic problem.

  12. Totally parallel multilevel algorithms

    NASA Technical Reports Server (NTRS)

    Frederickson, Paul O.

    1988-01-01

    Four totally parallel algorithms for the solution of a sparse linear system have common characteristics which become quite apparent when they are implemented on a highly parallel hypercube such as the CM2. These four algorithms are Parallel Superconvergent Multigrid (PSMG) of Frederickson and McBryan, Robust Multigrid (RMG) of Hackbusch, the FFT based Spectral Algorithm, and Parallel Cyclic Reduction. In fact, all four can be formulated as particular cases of the same totally parallel multilevel algorithm, which are referred to as TPMA. In certain cases the spectral radius of TPMA is zero, and it is recognized to be a direct algorithm. In many other cases the spectral radius, although not zero, is small enough that a single iteration per timestep keeps the local error within the required tolerance.

  13. Development of Ceramic Interconnect Materials for SOFC

    SciTech Connect

    Yoon, Kyung J.; Stevenson, Jeffry W.; Marina, Olga A.

    2010-08-05

    Currently, acceptor-doped lanthanum chromite is the state-of-the-art ceramic interconnect material for high temperature solid oxide fuel cells (SOFCs) due to its fairly good electronic conductivity and chemical stability in both oxidizing and reducing atmospheres, and thermal compatibility with other cell components. The major challenge for acceptor-doped lanthanum chromite for SOFC interconnect applications is its inferior sintering behavior in air, which has been attributed to the development of a thin layer of Cr2O3 at the interparticle necks during the initial stages of sintering. In addition, lanthanum chromite is reactive with YSZ electrolyte at high temperatures, forming a highly resistive lanthanum zirconate phase (La2Zr2O7), which further complicates co-firing processes. Acceptor-doped yttrium chromite is considered to be one of the promising alternatives to acceptor-doped lanthanum chromite because it is more stable with respect to the formation of hydroxides in SOFC operating conditions, and the formation of impurity phases can be effectively avoided at co-firing temperatures. In addition, calcium-doped yttrium chromite exhibits higher mechanical strength than lanthanum chromite-based materials. The major drawback of yttrium chromite is considered to be its lower electrical conductivity than lanthanum chromite. The properties of yttrium chromites could possibly be improved and optimized by partial substitution of chromium with various transition metals. During FY10, PNNL investigated the effect of various transition metal doping on chemical stability, sintering and thermal expansion behavior, microstructure, electronic and ionic conductivity, and chemical compatibility with other cell components to develop the optimized ceramic interconnect material.

  14. Cantilevered multilevel LIGA devices and methods

    DOEpatents

    Morales, Alfredo Martin; Domeier, Linda A.

    2002-01-01

    In the formation of multilevel LIGA microstructures, a preformed sheet of photoresist material, such as polymethylmethacrylate (PMMA) is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the exposed photoresist material. A first microstructure is then formed by electroplating metal into the areas from which the photoresist has been removed. Additional levels of microstructure are added to the initial microstructure by covering the first microstructure with a conductive polymer, machining the conductive polymer layer to reveal the surface of the first microstructure, sealing the conductive polymer and surface of the first microstructure with a metal layer, and then forming the second level of structure on top of the first level structure. In such a manner, multiple layers of microstructure can be built up to allow complex cantilevered microstructures to be formed.

  15. Multilevel techniques for nonelliptic problems

    NASA Technical Reports Server (NTRS)

    Jespersen, D. C.

    1981-01-01

    Multigrid and multilevel methods are extended to the solution of nonelliptic problems. A framework for analyzing these methods is established. A simple nonelliptic problem is given, and it is shown how a multilevel technique can be used for its solution. Emphasis is on smoothness properties of eigenvectors and attention is drawn to the possibility of conditioning the eigensystem so that eigenvectors have the desired smoothness properties.

  16. A multilevel voltage-source converter system with balanced dc voltages

    SciTech Connect

    Peng, Fang Zheng; Lai, Jih-Sheng; McKeever, J.; VanCoevering, J.

    1995-04-01

    A multilevel voltage-source converter system is proposed for high-voltage, high-power applications such as large induction motor drives, back-to-back interconnected power systems, and electrical traction drives. Multilevel voltage-source converters have a voltage unbalance problem in the dc capacitors. The problem may be solved by use of additional voltage regulators or separate dc sources. However, these solutions are found not to be practicable for most applications. The proposed converter system can solve the voltage unbalance problem of the conventional multilevel voltage-source converters, without using any additional voltage balance circuits or separate voltage sources. Mechanism of the voltage unbalance problem is analyzed theoretically in this paper. The validity of the new converter system is demonstrated by simulation and experiment.

  17. Fully-integrated, bezel-less transistor arrays using reversibly foldable interconnects and stretchable origami substrates

    NASA Astrophysics Data System (ADS)

    Kim, Mijung; Park, Jihun; Ji, Sangyoon; Shin, Sung-Ho; Kim, So-Yun; Kim, Young-Cheon; Kim, Ju-Young; Park, Jang-Ung

    2016-05-01

    Here we demonstrate fully-integrated, bezel-less transistor arrays using stretchable origami substrates and foldable conducting interconnects. Reversible folding of these arrays is enabled by origami substrates which are composed of rigid support fixtures and foldable elastic joints. In addition, hybrid structures of thin metal films and metallic nanowires worked as foldable interconnects which are located on the elastomeric joints.Here we demonstrate fully-integrated, bezel-less transistor arrays using stretchable origami substrates and foldable conducting interconnects. Reversible folding of these arrays is enabled by origami substrates which are composed of rigid support fixtures and foldable elastic joints. In addition, hybrid structures of thin metal films and metallic nanowires worked as foldable interconnects which are located on the elastomeric joints. Electronic supplementary information (ESI) available. See DOI: 10.1039/c6nr02041k

  18. Novel structures in ceramic interconnect technology.

    SciTech Connect

    Peterson, Kenneth Allen; Rohde, Steven Barney; Casias, Adrian Luther; Stokes, Robert Neal; Turner, Timothy Shawn

    2003-02-01

    Ceramic interconnect technology has been adapted to new structures. In particular, the ability to customize processing order and material choices in Low Temperature Cofired Ceramic (LTCC) has enabled new features to be constructed, which address needs in MEMS packaging as well as other novel structures. Unique shapes in LTCC permit the simplification of complete systems, as in the case of a miniature ion mobility spectrometer (IMS). In this case, a rolled tube has been employed to provide hermetic external contacts to electrodes and structures internal to the tube. Integral windows in LTCC have been fabricated for use in both lids and circuits where either a short term need for observation or a long-term need for functionality exists. These windows are fabricated without adhesive, are fully compatible with LTCC processing, and remain optically clear. Both vented and encapsulated functional volumes have been fabricated using a sacrificial material technique. These hold promise for self-assembly of systems, as well as complex internal structures in cavities, micro fluidic and optical channels, and multilevel integration techniques. Separation of the burnout and firing cycles has permitted custom internal environments to be established. Existing commercial High Temperature Cofired Ceramic (HTCC) and LTCC systems can also be rendered to have improved properties. A rapid prototyping technique for patterned HTCC packages has permitted prototypes to be realized in a few days, and has further applications to micro fluidics, heat pipes, and MEMS, among others. Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Department of Energy under contract DE-AC04-94AL85000.

  19. Multilevel turbulence simulations

    SciTech Connect

    Tziperman, E.

    1994-12-31

    The authors propose a novel method for the simulation of turbulent flows, that is motivated by and based on the Multigrid (MG) formalism. The method, called Multilevel Turbulence Simulations (MTS), is potentially more efficient and more accurate than LES. In many physical problems one is interested in the effects of the small scales on the larger ones, or in a typical realization of the flow, and not in the detailed time history of each small scale feature. MTS takes advantage of the fact that the detailed simulation of small scales is not needed at all times, in order to make the calculation significantly more efficient, while accurately accounting for the effects of the small scales on the larger scale of interest. In MTS, models of several resolutions are used to represent the turbulent flow. The model equations in each coarse level incorporate a closure term roughly corresponding to the tau correction in the MG formalism that accounts for the effects of the unresolvable scales on that grid. The finer resolution grids are used only a small portion of the simulation time in order to evaluate the closure terms for the coarser grids, while the coarse resolution grids are then used to accurately and efficiently calculate the evolution of the larger scales. The methods efficiency relative to direct simulations is of the order of the ratio of required integration time to the smallest eddies turnover time, potentially resulting in orders of magnitude improvement for a large class of turbulence problems.

  20. Multilevel fusion exploitation

    NASA Astrophysics Data System (ADS)

    Lindberg, Perry C.; Dasarathy, Belur V.; McCullough, Claire L.

    1996-06-01

    This paper describes a project that was sponsored by the U.S. Army Space and Strategic Defense Command (USASSDC) to develop, test, and demonstrate sensor fusion algorithms for target recognition. The purpose of the project was to exploit the use of sensor fusion at all levels (signal, feature, and decision levels) and all combinations to improve target recognition capability against tactical ballistic missile (TBM) targets. These algorithms were trained with simulated radar signatures to accurately recognize selected TBM targets. The simulated signatures represent measurements made by two radars (S-band and X- band) with the targets at a variety of aspect and roll angles. Two tests were conducted: one with simulated signatures collected at angles different from those in the training database and one using actual test data. The test results demonstrate a high degree of recognition accuracy. This paper describes the training and testing techniques used; shows the fusion strategy employed; and illustrates the advantages of exploiting multi-level fusion.

  1. Manufacturing of planar ceramic interconnects

    SciTech Connect

    Armstrong, B.L.; Coffey, G.W.; Meinhardt, K.D.; Armstrong, T.R.

    1996-12-31

    The fabrication of ceramic interconnects for solid oxide fuel cells (SOFC) and separator plates for electrochemical separation devices has been a perennial challenge facing developers. Electrochemical vapor deposition (EVD), plasma spraying, pressing, tape casting and tape calendering are processes that are typically utilized to fabricate separator plates or interconnects for the various SOFC designs and electrochemical separation devices. For sake of brevity and the selection of a planar fuel cell or gas separation device design, pressing will be the only fabrication technique discussed here. This paper reports on the effect of the characteristics of two doped lanthanum manganite powders used in the initial studies as a planar porous separator for a fuel cell cathode and as a dense interconnect for an oxygen generator.

  2. An approach to the optical interconnect made in standard CMOS process

    NASA Astrophysics Data System (ADS)

    Changliang, Yu; Luhong, Mao; Xindong, Xiao; Sheng, Xie; Shilin, Zhang

    2009-05-01

    A standard CMOS optical interconnect is proposed, including an octagonal-annular emitter, a field oxide, metal 1-PSG/BPSG-metal 2 dual waveguide, and an ultra high-sensitivity optical receiver integrated with a fingered P+/N-well/P-sub dual photodiode detector. The optical interconnect is implemented in a Chartered 3.3-V 0.35-μm standard analog CMOS process with two schemes for the research of the substrate noise coupling effect on the optical interconnect performance: with or without a GND-guardring around the emitter. The experiment results show that the optical interconnect can work at 100 kHz, and it is feasible to implement optical interconnects in standard CMOS processes.

  3. Simulation of void formation in interconnect lines

    NASA Astrophysics Data System (ADS)

    Sheikholeslami, Alireza; Heitzinger, Clemens; Puchner, Helmut; Badrieh, Fuad; Selberherr, Siegfried

    2003-04-01

    The predictive simulation of the formation of voids in interconnect lines is important for improving capacitance and timing in current memory cells. The cells considered are used in wireless applications such as cell phones, pagers, radios, handheld games, and GPS systems. In backend processes for memory cells, ILD (interlayer dielectric) materials and processes result in void formation during gap fill. This approach lowers the overall k-value of a given metal layer and is economically advantageous. The effect of the voids on the overall capacitive load is tremendous. In order to simulate the shape and positions of the voids and thus the overall capacitance, the topography simulator ELSA (Enhanced Level Set Applications) has been developed which consists of three modules, a level set module, a radiosity module, and a surface reaction module. The deposition process considered is deposition of silicon nitride. Test structures of interconnect lines of memory cells were fabricated and several SEM images thereof were used to validate the corresponding simulations.

  4. Optical interconnection techniques for Hypercube

    NASA Technical Reports Server (NTRS)

    Johnston, A. R.; Bergman, L. A.; Wu, W. H.

    1988-01-01

    Direct free-space optical interconnection techniques are described for the Hypercube concurrent processor machine using a holographic optical element. Computational requirements and optical constraints on implementation are briefly summarized with regard to topology, power consumption, and available technologies. A hybrid lens/HOE approach is described that can support an eight-dimensional cube of 256 nodes.

  5. A General Multilevel SEM Framework for Assessing Multilevel Mediation

    ERIC Educational Resources Information Center

    Preacher, Kristopher J.; Zyphur, Michael J.; Zhang, Zhen

    2010-01-01

    Several methods for testing mediation hypotheses with 2-level nested data have been proposed by researchers using a multilevel modeling (MLM) paradigm. However, these MLM approaches do not accommodate mediation pathways with Level-2 outcomes and may produce conflated estimates of between- and within-level components of indirect effects. Moreover,…

  6. 47 CFR 64.1401 - Expanded interconnection.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... such equipment to connect interconnectors' fiber optic systems or microwave radio transmission... interconnectors' fiber optic systems or microwave radio transmission facilities (where reasonably feasible) with... interconnection of fiber optic facilities, local exchange carriers shall provide: (1) An interconnection point...

  7. 47 CFR 64.1401 - Expanded interconnection.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... such equipment to connect interconnectors' fiber optic systems or microwave radio transmission... interconnectors' fiber optic systems or microwave radio transmission facilities (where reasonably feasible) with... interconnection of fiber optic facilities, local exchange carriers shall provide: (1) An interconnection point...

  8. 47 CFR 64.1401 - Expanded interconnection.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... such equipment to connect interconnectors' fiber optic systems or microwave radio transmission... interconnectors' fiber optic systems or microwave radio transmission facilities (where reasonably feasible) with... interconnection of fiber optic facilities, local exchange carriers shall provide: (1) An interconnection point...

  9. 47 CFR 64.1401 - Expanded interconnection.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... such equipment to connect interconnectors' fiber optic systems or microwave radio transmission... interconnectors' fiber optic systems or microwave radio transmission facilities (where reasonably feasible) with... interconnection of fiber optic facilities, local exchange carriers shall provide: (1) An interconnection point...

  10. 47 CFR 64.1401 - Expanded interconnection.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... such equipment to connect interconnectors' fiber optic systems or microwave radio transmission... interconnectors' fiber optic systems or microwave radio transmission facilities (where reasonably feasible) with... interconnection of fiber optic facilities, local exchange carriers shall provide: (1) An interconnection point...

  11. Formation of interconnections to microfluidic devices

    DOEpatents

    Matzke, Carolyn M.; Ashby, Carol I. H.; Griego, Leonardo

    2003-07-29

    A method is disclosed to form external interconnections to a microfluidic device for coupling of a fluid or light or both into a microchannel of the device. This method can be used to form optical or fluidic interconnections to microchannels previously formed on a substrate, or to form both the interconnections and microchannels during the same process steps. The optical and fluidic interconnections are formed parallel to the plane of the substrate, and are fluid tight.

  12. High temperature superconductors for computer interconnect applications

    SciTech Connect

    Nilsson, B.J.L.

    1994-12-31

    High temperature superconductors, because of their extremely low loss at high frequencies and their high current handling capability, have the potential for use in computer interconnect boards. They offer the potential advantages of high interconnect density, reduced interconnect delays, and higher data rate. Because silicon CMOS circuits dramatically improve in performance at low temperatures, cooled computers may become attractive in the future to capture both the improved interconnect and circuit benefits.

  13. 47 CFR 69.124 - Interconnection charge.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 47 Telecommunication 3 2010-10-01 2010-10-01 false Interconnection charge. 69.124 Section 69.124... Computation of Charges § 69.124 Interconnection charge. (a) Until December 31, 2001, local exchange carriers not subject to price cap regulation shall assess an interconnection charge expressed in dollars...

  14. 47 CFR 51.305 - Interconnection.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 47 Telecommunication 3 2010-10-01 2010-10-01 false Interconnection. 51.305 Section 51.305 Telecommunication FEDERAL COMMUNICATIONS COMMISSION (CONTINUED) COMMON CARRIER SERVICES (CONTINUED) INTERCONNECTION Additional Obligations of Incumbent Local Exchange Carriers § 51.305 Interconnection. (a) An incumbent...

  15. The performance of multicomputer interconnection networks

    NASA Technical Reports Server (NTRS)

    Reed, Daniel A.; Grunwald, Dirk C.

    1987-01-01

    The interdependency of nodes and multicomputer interconnection networks is examined using simple calculations based on the asymptotic properties of queueing networks. Methods are described for choosing interconnection networks that fit individual classes of applications. It is also shown how analytic models can be extended to benchmark existing interconnection networks.

  16. 14 CFR 23.701 - Flap interconnection.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Flap interconnection. 23.701 Section 23.701... Systems § 23.701 Flap interconnection. (a) The main wing flaps and related movable surfaces as a system must— (1) Be synchronized by a mechanical interconnection between the movable flap surfaces that...

  17. 18 CFR 292.306 - Interconnection costs.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 18 Conservation of Power and Water Resources 1 2010-04-01 2010-04-01 false Interconnection costs... § 292.306 Interconnection costs. (a) Obligation to pay. Each qualifying facility shall be obligated to pay any interconnection costs which the State regulatory authority (with respect to any...

  18. Multilevel Assessments of Science Standards

    ERIC Educational Resources Information Center

    Quellmalz, Edys S.; Timms, Michael J.; Silberglitt, Matt D.

    2011-01-01

    The Multilevel Assessment of Science Standards (MASS) project is creating a new generation of technology-enhanced formative assessments that bring the best formative assessment practices into classrooms to transform what, how, when, and where science learning is assessed. The project is investigating the feasibility, utility, technical quality,…

  19. Multilevel Modeling with Correlated Effects

    ERIC Educational Resources Information Center

    Kim, Jee-Seon; Frees, Edward W.

    2007-01-01

    When there exist omitted effects, measurement error, and/or simultaneity in multilevel models, explanatory variables may be correlated with random components, and standard estimation methods do not provide consistent estimates of model parameters. This paper introduces estimators that are consistent under such conditions. By employing generalized…

  20. Multilevel algorithms for nonlinear optimization

    NASA Technical Reports Server (NTRS)

    Alexandrov, Natalia; Dennis, J. E., Jr.

    1994-01-01

    Multidisciplinary design optimization (MDO) gives rise to nonlinear optimization problems characterized by a large number of constraints that naturally occur in blocks. We propose a class of multilevel optimization methods motivated by the structure and number of constraints and by the expense of the derivative computations for MDO. The algorithms are an extension to the nonlinear programming problem of the successful class of local Brown-Brent algorithms for nonlinear equations. Our extensions allow the user to partition constraints into arbitrary blocks to fit the application, and they separately process each block and the objective function, restricted to certain subspaces. The methods use trust regions as a globalization strategy, and they have been shown to be globally convergent under reasonable assumptions. The multilevel algorithms can be applied to all classes of MDO formulations. Multilevel algorithms for solving nonlinear systems of equations are a special case of the multilevel optimization methods. In this case, they can be viewed as a trust-region globalization of the Brown-Brent class.

  1. Generalized Multilevel Structural Equation Modeling

    ERIC Educational Resources Information Center

    Rabe-Hesketh, Sophia; Skrondal, Anders; Pickles, Andrew

    2004-01-01

    A unifying framework for generalized multilevel structural equation modeling is introduced. The models in the framework, called generalized linear latent and mixed models (GLLAMM), combine features of generalized linear mixed models (GLMM) and structural equation models (SEM) and consist of a response model and a structural model for the latent…

  2. Flexible interconnects for fuel cell stacks

    DOEpatents

    Lenz, David J.; Chung, Brandon W.; Pham, Ai Quoc

    2004-11-09

    An interconnect that facilitates electrical connection and mechanical support with minimal mechanical stress for fuel cell stacks. The interconnects are flexible and provide mechanically robust fuel cell stacks with higher stack performance at lower cost. The flexible interconnects replace the prior rigid rib interconnects with flexible "fingers" or contact pads which will accommodate the imperfect flatness of the ceramic fuel cells. Also, the mechanical stress of stacked fuel cells will be smaller due to the flexibility of the fingers. The interconnects can be one-sided or double-sided.

  3. Chromium Vaporization Reduction by Nickel Coatings For SOEC Interconnect Materials

    SciTech Connect

    Michael V. Glazoff; Sergey N. Rashkeev; J. Stephen Herring

    2014-09-01

    The vaporization of Cr-rich volatile species from interconnect materials is a major source of degradation that limits the lifetime of planar solid oxide devices systems with metallic interconnects, including Solid Oxide Electrolysis Cells, or SOECs. Some metallic coatings (Ni, Co, and Cu) significantly reduce the Cr release from interconnects and slow down the oxide scale growth on the steel substrate. To shed additional light upon the mechanisms of such protection and find a suitable coating material for ferritic stainless steel materials, we used a combination of first-principles calculations, thermodynamics, and diffusion modeling to investigate which factors determine the quality of the Ni metallic coating at stainless steel interconnector. We found that the Cr migration in Ni coating is determined by a delicate combination of the nickel oxidation, Cr diffusion, and phase transformation processes. Although the formation of Cr2O3 oxide is more exothermic than that of NiO, the kinetic rate of the chromia formation in the coating layer and its surface is significantly reduced by the low mobility of Cr in nickel oxide and in NiCr2O4 spinel. These results are in a good agreement with diffusion modeling for Cr diffusion through Ni coating layer on the ferritic 441 steel substrate.

  4. Interconnectivity structure of a general interdependent network.

    PubMed

    Van Mieghem, P

    2016-04-01

    A general two-layer network consists of two networks G_{1} and G_{2}, whose interconnection pattern is specified by the interconnectivity matrix B. We deduce desirable properties of B from a dynamic process point of view. Many dynamic processes are described by the Laplacian matrix Q. A regular topological structure of the interconnectivity matrix B (constant row and column sum) enables the computation of a nontrivial eigenmode (eigenvector and eigenvalue) of Q. The latter eigenmode is independent from G_{1} and G_{2}. Such a regularity in B, associated to equitable partitions, suggests design rules for the construction of interconnected networks and is deemed crucial for the interconnected network to show intriguing behavior, as discovered earlier for the special case where B=wI refers to an individual node to node interconnection with interconnection strength w. Extensions to a general m-layer network are also discussed.

  5. Advanced micromechanisms in a multi-level polysilicon technology

    SciTech Connect

    Rodgers, M.S.; Sniegowski, J.J.; Miller, S.L.; Barron, C.C.; McWhorter, P.J.

    1997-08-01

    Quad-level polysilicon surface micromachining technology, comprising three mechanical levels plus an electrical interconnect layer, is giving rise to a new generation of micro-electromechanical devices and assemblies. Enhanced components can not be produced through greater flexibility in fabrication and design. New levels of design complexity that include multi-level gears, single-attempt locks, and optical elements have recently been realized. Extensive utilization of the fourth layer of polysilicon differentiates these latter generation devices from their predecessors. This level of poly enables the fabrication of pin joints, linkage arms, hinges on moveable plates, and multi-level gear assemblies. The mechanical design aspects of these latest micromachines will be discussed with particular emphasis on a number of design aspects of these latest micromachines will be discussed with particular emphasis on a number of design modifications that improve the power, reliability, and smoothness of operation of the microengine. The microengine is the primary actuation mechanism that is being used to drive mirrors out of plane and rotate 1600-{mu}m diameter gears. Also discussed is the authors most advanced micromechanical system to date, a complex proof-of-concept batch-fabricated assembly that, upon transmitting the proper electrical code to a mechanical lock, permits the operation of a micro-optical shutter.

  6. Interconnects for intermediate temperature solid oxide fuel cells

    NASA Astrophysics Data System (ADS)

    Huang, Wenhua

    Presently, one of the principal goals of solid oxide fuel cells (SOFCs) research is to reduce the stack operating temperature to between 600 and 800°C. However, one of the principal technological barriers is the non-availability of a suitable material satisfying all of the stability requirements for the interconnect. In this work two approaches for intermediate temperature SOFC interconnects have been explored. The first approach comprises an interconnect consisting of a bi-layer structure, a p-type oxide (La0.96Sr0.08MnO 2.001/LSM) layer exposed to a cathodic environment, and an n-type oxide (Y0.08Sr0.88Ti0.95Al0.05O 3-delta/YSTA) layer exposed to anodic conditions. Theoretical analysis based on the bi-layer structure has established design criteria to implement this approach. The analysis shows that the interfacial oxygen partial pressure, which determines the interconnect stability, is independent of the electronic conductivities of both layers but dependent on the oxygen ion layer interconnects, the oxygen ion conductivities of LSM and YSTA were measured as a function of temperature and oxygen partial pressure. Based on the measured data, it has been determined that if the thickness of YSTA layer is around 0.1cm, the thickness of LSM layer should be around 0.6 mum in order to maintain the stability of LSM. In a second approach, a less expensive stainless steel interconnect has been studied. However, one of the major concerns associated with the use of metallic interconnects is the development of a semi-conducting or insulating oxide scale and chromium volatility during extended exposure to the SOFC operating environment. Dense and well adhered Mn-Cu spinet oxide coatings were successfully deposited on stainless steel by an electrophoretic deposition (EPD) technique. It was found that the Mn-Cu-O coating significantly reduced the oxidation rate of the stainless steel and the volatility of chromium. The area specific resistance (ASR) of coated Crofer 22 APU is

  7. Thin-film chip-to-substrate interconnect and methods for making same

    DOEpatents

    Tuckerman, David B.

    1991-01-01

    Integrated circuit chips are electrically connected to a silica wafer interconnection substrate. Thin film wiring is fabricated down bevelled edges of the chips. A subtractive wire fabrication method uses a series of masks and etching steps to form wires in a metal layer. An additive method direct laser writes or deposits very thin metal lines which can then be plated up to form wires. A quasi-additive or subtractive/additive method forms a pattern of trenches to expose a metal surface which can nucleate subsequent electrolytic deposition of wires. Low inductance interconnections on a 25 micron pitch (1600 wires on a 1 cm square chip) can be produced. The thin film hybrid interconnect eliminates solder joints or welds, and minimizes the levels of metallization. Advantages include good electrical properties, very high wiring density, excellent backside contact, compactness, and high thermal and mechanical reliability.

  8. An alternate interconnect method for joining flexible circuits using conductive adhesives

    SciTech Connect

    Schurman, W.R.

    1990-04-17

    Conductive adhesives were evaluated as a labor-saving alternate method for interconnecting flexible circuit layers in slapper detonators. Short-term aging, high temperature and high humidity storage, thermal cycle, and thermal shock studies were done. The adhesive interconnections were also studied under the high voltage and high current operating conditions of a slapper detonator. In all tests, interconnections made with conductive adhesive compared favorably with standard diffusion bonded joints, demonstrating the feasibility of joining flexible circuit components without metallic solders, brazes, thermo-compression bonds, diffusion bonds, or welds. 8 refs., 4 figs., 5 tabs.

  9. Multilevel Compression of Random Walks on Networks Reveals Hierarchical Organization in Large Integrated Systems

    PubMed Central

    Rosvall, Martin; Bergstrom, Carl T.

    2011-01-01

    To comprehend the hierarchical organization of large integrated systems, we introduce the hierarchical map equation, which reveals multilevel structures in networks. In this information-theoretic approach, we exploit the duality between compression and pattern detection; by compressing a description of a random walker as a proxy for real flow on a network, we find regularities in the network that induce this system-wide flow. Finding the shortest multilevel description of the random walker therefore gives us the best hierarchical clustering of the network — the optimal number of levels and modular partition at each level — with respect to the dynamics on the network. With a novel search algorithm, we extract and illustrate the rich multilevel organization of several large social and biological networks. For example, from the global air traffic network we uncover countries and continents, and from the pattern of scientific communication we reveal more than 100 scientific fields organized in four major disciplines: life sciences, physical sciences, ecology and earth sciences, and social sciences. In general, we find shallow hierarchical structures in globally interconnected systems, such as neural networks, and rich multilevel organizations in systems with highly separated regions, such as road networks. PMID:21494658

  10. Interconnect fatigue design for terrestrial photovoltaic modules

    NASA Technical Reports Server (NTRS)

    Mon, G. R.; Moore, D. M.; Ross, R. G., Jr.

    1982-01-01

    The results of comprehensive investigation of interconnect fatigue that has led to the definition of useful reliability-design and life-prediction algorithms are presented. Experimental data indicate that the classical strain-cycle (fatigue) curve for the interconnect material is a good model of mean interconnect fatigue performance, but it fails to account for the broad statistical scatter, which is critical to reliability prediction. To fill this shortcoming the classical fatigue curve is combined with experimental cumulative interconnect failure rate data to yield statistical fatigue curves (having failure probability as a parameter) which enable (1) the prediction of cumulative interconnect failures during the design life of an array field, and (2) the unambiguous--ie., quantitative--interpretation of data from field-service qualification (accelerated thermal cycling) tests. Optimal interconnect cost-reliability design algorithms are derived based on minimizing the cost of energy over the design life of the array field.

  11. Cascade solar cell having conductive interconnects

    DOEpatents

    Borden, Peter G.; Saxena, Ram R.

    1982-10-26

    Direct ohmic contact between the cells in an epitaxially grown cascade solar cell is obtained by means of conductive interconnects formed through grooves etched intermittently in the upper cell. The base of the upper cell is directly connected by the conductive interconnects to the emitter of the bottom cell. The conductive interconnects preferably terminate on a ledge formed in the base of the upper cell.

  12. Anisotropy of low dielectric constant materials and reliability of copper/low-k interconnects

    NASA Astrophysics Data System (ADS)

    Cho, Taiheui

    2000-10-01

    Cu/low-k material interconnects are a solution to overcome problems that occur in deep submicron Al/SiO2 based interconnects. Several challenges have to be resolved before successfully integrating copper and low-k dielectric materials into interconnects. In this work, Cu and several low-k polymers were used for interconnect applications and their effects on interconnect performance were investigated. Dielectric anisotropy is one of the factors that affect interconnect performance. Two fluorinated polymers, a rigid rod-like polyimide (Dupont FPI-136M) and a flexible poly(aryl ether) (Allied Signal FLARE 1.51) were used to investigate the relationship between dielectric anisotropy and molecular orientation. The dielectric anisotropy of the rigid rod-like polyimide was reduced relative to that in blanket films when it was confined in submicron trenches. Such a reduction was not observed in the flexible polymer. Polarized FTIR experiments showed that when rigid rod-like polymer was confined in submicron trenches polymer chains preferentially oriented parallel to metal lines. The preferential orientation reduced the in-plane dielectric constant of the polymer. A barrier layer has to be used to prevent Cu diffusion into an interlayer dielectric material. Ta, TaN, and TaSiN were used to investigate the relationship between barrier capability and microstructures using a bias temperature stress. TaSiN performed best because TaSiN was amorphous, followed by TaN then Ta because TaN had impurities segregated in grain boundaries. When Cu/BCB interconnects were fabricated and their reliability was investigated with the bias temperature stress, some of the interconnect structures performed properly and their life times were comparable to those of Cu/SiO2 interconnects, while other interconnect structures rapidly failed because the Cu readily diffused through defects in the barrier. The defects were introduced during chemical-mechanical polishing and plasma etching processes.

  13. Visualizing interconnections among climate risks

    NASA Astrophysics Data System (ADS)

    Tanaka, K.; Yokohata, T.; Nishina, K.; Takahashi, K.; Emori, S.; Kiguchi, M.; Iseri, Y.; Honda, Y.; Okada, M.; Masaki, Y.; Yamamoto, A.; Shigemitsu, M.; Yoshimori, M.; Sueyoshi, T.; Hanasaki, N.; Ito, A.; Sakurai, G.; Iizumi, T.; Nishimori, M.; Lim, W. H.; Miyazaki, C.; Kanae, S.; Oki, T.

    2015-12-01

    It is now widely recognized that climate change is affecting various sectors of the world. Climate change impact on one sector may spread out to other sectors including those seemingly remote, which we call "interconnections of climate risks". While a number of climate risks have been identified in the Intergovernmental Panel on Climate Change (IPCC) Fifth Assessment Report (AR5), there has been no attempt to explore their interconnections comprehensively. Here we present a first and most exhaustive visualization of climate risks drawn based on a systematic literature survey. Our risk network diagrams depict that changes in the climate system impact natural capitals (terrestrial water, crop, and agricultural land) as well as social infrastructures, influencing the socio-economic system and ultimately our access to food, water, and energy. Our findings suggest the importance of incorporating climate risk interconnections into impact and vulnerability assessments and call into question the widely used damage function approaches, which address a limited number of climate change impacts in isolation. Furthermore, the diagram is useful to educate decision makers, stakeholders, and general public about cascading risks that can be triggered by the climate change. Socio-economic activities today are becoming increasingly more inter-dependent because of the rapid technological progress, urbanization, and the globalization among others. Equally complex is the ecosystem that is susceptible to climate change, which comprises interwoven processes affecting one another. In the context of climate change, a number of climate risks have been identified and classified according to regions and sectors. These reports, however, did not fully address the inter-relations among risks because of the complexity inherent in this issue. Climate risks may ripple through sectors in the present inter-dependent world, posing a challenge ahead of us to maintain the resilience of the system. It is

  14. Holographic optical interconnects for VLSI

    NASA Technical Reports Server (NTRS)

    Bergman, L. A.; Wu, W. H.; Johnston, A. R.; Nixon, R.; Esener, Sadik C.

    1986-01-01

    This paper introduces new applications and design trade-offs anticipated for free-space optical interconnections of VLSI chips. New implementation s of VLSI functions are described that use the capability of making optical inputs at any point on a chip and take advantage of greater flexibility in on-chip signal routing. These include n-port addressable memories, CPU clock phase distribution, hardware multipliers, and dynamic memory refresh, as well as enhanced testability. Fault tolerance and production yields may be improved by reprogramming the optical imaging system to circumvent defective elements. These attributes, as well as those related to performance alone, will affect the design methodology of future VLSI ICs. This paper focuses on identifying the design issues, their possible solutions, and their impact on VLSI design techniques and, finally, presents some preliminary measurements on various system components.

  15. Holographic optical interconnects for VLSI

    NASA Astrophysics Data System (ADS)

    Bergman, L. A.; Wu, W. H.; Johnston, A. R.; Nixon, R.; Esener, Sadik C.

    1986-10-01

    This paper introduces new applications and design trade-offs anticipated for free-space optical interconnections of VLSI chips. New implementation s of VLSI functions are described that use the capability of making optical inputs at any point on a chip and take advantage of greater flexibility in on-chip signal routing. These include n-port addressable memories, CPU clock phase distribution, hardware multipliers, and dynamic memory refresh, as well as enhanced testability. Fault tolerance and production yields may be improved by reprogramming the optical imaging system to circumvent defective elements. These attributes, as well as those related to performance alone, will affect the design methodology of future VLSI ICs. This paper focuses on identifying the design issues, their possible solutions, and their impact on VLSI design techniques and, finally, presents some preliminary measurements on various system components.

  16. Thin-film chip-to-substrate interconnect and methods for making same

    DOEpatents

    Tuckerman, D.B.

    1988-06-06

    Integrated circuit chips are electrically connected to a silicon wafer interconnection substrate. Thin film wiring is fabricated down bevelled edges of the chips. A subtractive wire fabrication method uses a series of masks and etching steps to form wires in a metal layer. An additive method direct laser writes or deposits very thin lines which can then be plated up to form wires. A quasi-additive or subtractive/additive method forms a pattern of trenches to expose a metal surface which can nucleate subsequent electrolytic deposition of wires. Low inductance interconnections on a 25 micron pitch (1600 wires on a 1 cm square chip) can be produced. The thin film hybrid interconnect eliminates solder joints or welds, and minimizes the levels of metallization. Advantages include good electrical properties, very high wiring density, excellent backside contact, compactness, and high thermal and mechanical reliability. 6 figs.

  17. A Multilevel Assessment of Differential Item Functioning.

    ERIC Educational Resources Information Center

    Shen, Linjun

    A multilevel approach was proposed for the assessment of differential item functioning and compared with the traditional logistic regression approach. Data from the Comprehensive Osteopathic Medical Licensing Examination for 2,300 freshman osteopathic medical students were analyzed. The multilevel approach used three-level hierarchical generalized…

  18. Structural optimization by multilevel decomposition

    NASA Technical Reports Server (NTRS)

    Sobieszczanski-Sobieski, J.; James, B.; Dovi, A.

    1983-01-01

    A method is described for decomposing an optimization problem into a set of subproblems and a coordination problem which preserves coupling between the subproblems. The method is introduced as a special case of multilevel, multidisciplinary system optimization and its algorithm is fully described for two level optimization for structures assembled of finite elements of arbitrary type. Numerical results are given for an example of a framework to show that the decomposition method converges and yields results comparable to those obtained without decomposition. It is pointed out that optimization by decomposition should reduce the design time by allowing groups of engineers, using different computers to work concurrently on the same large problem.

  19. 47 CFR 101.519 - Interconnection.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 47 Telecommunication 5 2011-10-01 2011-10-01 false Interconnection. 101.519 Section 101.519 Telecommunication FEDERAL COMMUNICATIONS COMMISSION (CONTINUED) SAFETY AND SPECIAL RADIO SERVICES FIXED MICROWAVE SERVICES 24 GHz Service and Digital Electronic Message Service § 101.519 Interconnection. (a) All...

  20. 47 CFR 101.519 - Interconnection.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 47 Telecommunication 5 2010-10-01 2010-10-01 false Interconnection. 101.519 Section 101.519 Telecommunication FEDERAL COMMUNICATIONS COMMISSION (CONTINUED) SAFETY AND SPECIAL RADIO SERVICES FIXED MICROWAVE SERVICES 24 GHz Service and Digital Electronic Message Service § 101.519 Interconnection. (a) All...

  1. 47 CFR 90.477 - Interconnected systems.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ...) Applicants for new land stations to be interconnected with the public switched telephone network must... switched telephone network only after modifying their license. See § 1.929 of this chapter. In all cases a..., 896-901 MHz, and 935-940 MHz, interconnection with the public switched telephone network is...

  2. Stretchable Si Logic Devices with Graphene Interconnects.

    PubMed

    Lee, Wonho; Jang, Houk; Jang, Bongkyun; Kim, Jae-Hyun; Ahn, Jong-Hyun

    2015-12-16

    Stretchable integrated circuits consisting of ultrathin Si transistors connected by multilayer graphene are demonstrated. Graphene interconnects act as an effective countervailing component to maintain the electrical performance of Si integrated circuits against external strain. Concentration of the applied strain on the graphene interconnect parts can stably protect the Si active devices against applied strains over 10%.

  3. Updating Technical Screens for PV Interconnection: Preprint

    SciTech Connect

    Coddington, M.; Ellis, A.; Lynn, K.; Razon, A.; Key, T.; Kroposki, B.; Mather, B.; Hill, R.; Nicole, K.; Smith, J.

    2012-08-01

    Solar photovoltaics (PV) is the dominant type of distributed generation (DG) technology interconnected to electric distribution systems in the United States, and deployment of PV systems continues to increase rapidly. Considering the rapid growth and widespread deployment of PV systems in United States electric distribution grids, it is important that interconnection procedures be as streamlined as possible to avoid unnecessary interconnection studies, costs, and delays. Because many PV interconnection applications involve high penetration scenarios, the process needs to allow for a sufficiently rigorous technical evaluation to identify and address possible system impacts. Existing interconnection procedures are designed to balance the need for efficiency and technical rigor for all DG. However, there is an implicit expectation that those procedures will be updated over time in order to remain relevant with respect to evolving standards, technology, and practical experience. Modifications to interconnection screens and procedures must focus on maintaining or improving safety and reliability, as well as accurately allocating costs and improving expediency of the interconnection process. This paper evaluates the origins and usefulness of the capacity penetration screen, offers potential short-term solutions which could effectively allow fast-track interconnection to many PV system applications, and considers longer-term solutions for increasing PV deployment levels in a safe and reliable manner while reducing or eliminating the emphasis on the penetration screen.

  4. 14 CFR 27.674 - Interconnected controls.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... AIRWORTHINESS STANDARDS: NORMAL CATEGORY ROTORCRAFT Design and Construction Control Systems § 27.674 Interconnected controls. Each primary flight control system must provide for safe flight and landing and operate... 14 Aeronautics and Space 1 2012-01-01 2012-01-01 false Interconnected controls. 27.674 Section...

  5. 14 CFR 27.674 - Interconnected controls.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... AIRWORTHINESS STANDARDS: NORMAL CATEGORY ROTORCRAFT Design and Construction Control Systems § 27.674 Interconnected controls. Each primary flight control system must provide for safe flight and landing and operate... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Interconnected controls. 27.674 Section...

  6. 14 CFR 27.674 - Interconnected controls.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... AIRWORTHINESS STANDARDS: NORMAL CATEGORY ROTORCRAFT Design and Construction Control Systems § 27.674 Interconnected controls. Each primary flight control system must provide for safe flight and landing and operate... 14 Aeronautics and Space 1 2013-01-01 2013-01-01 false Interconnected controls. 27.674 Section...

  7. 14 CFR 27.674 - Interconnected controls.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... AIRWORTHINESS STANDARDS: NORMAL CATEGORY ROTORCRAFT Design and Construction Control Systems § 27.674 Interconnected controls. Each primary flight control system must provide for safe flight and landing and operate... 14 Aeronautics and Space 1 2011-01-01 2011-01-01 false Interconnected controls. 27.674 Section...

  8. 14 CFR 29.674 - Interconnected controls.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Design and Construction Control Systems § 29.674 Interconnected controls. Each primary flight control system must provide for safe flight and landing and operate... 14 Aeronautics and Space 1 2012-01-01 2012-01-01 false Interconnected controls. 29.674 Section...

  9. 14 CFR 29.674 - Interconnected controls.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Design and Construction Control Systems § 29.674 Interconnected controls. Each primary flight control system must provide for safe flight and landing and operate... 14 Aeronautics and Space 1 2011-01-01 2011-01-01 false Interconnected controls. 29.674 Section...

  10. 14 CFR 29.674 - Interconnected controls.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Design and Construction Control Systems § 29.674 Interconnected controls. Each primary flight control system must provide for safe flight and landing and operate... 14 Aeronautics and Space 1 2013-01-01 2013-01-01 false Interconnected controls. 29.674 Section...

  11. 14 CFR 27.674 - Interconnected controls.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... AIRWORTHINESS STANDARDS: NORMAL CATEGORY ROTORCRAFT Design and Construction Control Systems § 27.674 Interconnected controls. Each primary flight control system must provide for safe flight and landing and operate... 14 Aeronautics and Space 1 2014-01-01 2014-01-01 false Interconnected controls. 27.674 Section...

  12. 14 CFR 29.674 - Interconnected controls.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Design and Construction Control Systems § 29.674 Interconnected controls. Each primary flight control system must provide for safe flight and landing and operate... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Interconnected controls. 29.674 Section...

  13. 14 CFR 29.674 - Interconnected controls.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Design and Construction Control Systems § 29.674 Interconnected controls. Each primary flight control system must provide for safe flight and landing and operate... 14 Aeronautics and Space 1 2014-01-01 2014-01-01 false Interconnected controls. 29.674 Section...

  14. Interconnect fatigue design for terrestrial photovoltaic modules

    SciTech Connect

    Mon, G. R.; Moore, D. M.; Ross, Jr., R. G.

    1982-03-01

    Fatigue of solar cell electrical interconnects due to thermal cycling has historically been a major failure mechanism in photovoltaic arrays; the results of a comprehensive investigation of interconnect fatigue that has led to the definition of useful reliability-design and life-prediction algorithms are presented. Experimental data gathered in this study indicate that the classical strain-cycle (fatigue) curve for the interconnect material is a good model of mean interconnect fatigue performance, but it fails to account for the broad statistical scatter, which is critical to reliability prediction. To fill this shortcoming the classical fatigue curve is combined with experimental cumulative interconnect failure rate data to yield statistical fatigue curves (having failure probability as a parameter) which enable: (1) the prediction of cumulative interconnect failures during the design life of an array field; and (2) the unambiguous - i.e., quantitative - interpretation of data from field-service qualification (accelerated thermal cycling) tests. Optimal interconnect cost-reliability design algorithms are derived based on minimizing the cost of energy over the design life of the array field. This procedure yields not only the minimum break-even cost of delivered energy, but also the required degree of interconnect redundancy and an estimate of array power degradation during the design life of the array field. The usefulness of the design algorithms is demonstrated with realistic examples of design optimization, prediction, and service qualification testing.

  15. Interconnections For Stacked Parallel Computer Modules

    NASA Technical Reports Server (NTRS)

    Johannesson, Richard T.

    1996-01-01

    Concept for interconnecting modules in parallel computers leads to cheaper, smaller, lighter, lower-power computing systems for aerospace, industrial, business, and consumer applications. Computer modules stacked and interconnected in various configurations. Connections among stacks controlled by switching within gateways and/or by addresses on buses.

  16. 47 CFR 95.141 - Interconnection prohibited.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 47 Telecommunication 5 2010-10-01 2010-10-01 false Interconnection prohibited. 95.141 Section 95.141 Telecommunication FEDERAL COMMUNICATIONS COMMISSION (CONTINUED) SAFETY AND SPECIAL RADIO SERVICES PERSONAL RADIO SERVICES General Mobile Radio Service (GMRS) § 95.141 Interconnection prohibited. No...

  17. Tevatron low-beta quadrupole triplet interconnects

    SciTech Connect

    Oleck, A.R.; Carson, J.A.; Koepke, K.; Sorenson, D.

    1992-04-01

    Installation of cold iron quadrupole magnets in the Low Beta (Superconducting High-Luminosity) upgrade at Fermilab required a newly designed magnet interconnect. The interconnect design and construction experience is presented. Considered are the connections carrying cryogenic fluids, beam vacuum, insulating vacuum, superconducting bus leads, their insulation and mechanical support. Details of the assembly and assembly experience are presented. 2 refs.

  18. Government Open Systems Interconnection: Profile in Progress.

    ERIC Educational Resources Information Center

    Mills, Kevin L.

    1990-01-01

    Describes the emergence of Open Systems Interconnection (OSI) as it relates to the U.S. Government Open Systems Interconnection Profile (GOSIP); defines GOSIP; and speculates about its future. Challenges facing GOSIP that are related to test policies and procedures, strategic and tactical planning, additional functionality, and international…

  19. Factorial invariance in multilevel confirmatory factor analysis.

    PubMed

    Ryu, Ehri

    2014-02-01

    This paper presents a procedure to test factorial invariance in multilevel confirmatory factor analysis. When the group membership is at level 2, multilevel factorial invariance can be tested by a simple extension of the standard procedure. However level-1 group membership raises problems which cannot be appropriately handled by the standard procedure, because the dependency between members of different level-1 groups is not appropriately taken into account. The procedure presented in this article provides a solution to this problem. This paper also shows Muthén's maximum likelihood (MUML) estimation for testing multilevel factorial invariance across level-1 groups as a viable alternative to maximum likelihood estimation. Testing multilevel factorial invariance across level-2 groups and testing multilevel factorial invariance across level-1 groups are illustrated using empirical examples. SAS macro and Mplus syntax are provided.

  20. A multilevel nonvolatile magnetoelectric memory

    PubMed Central

    Shen, Jianxin; Cong, Junzhuang; Shang, Dashan; Chai, Yisheng; Shen, Shipeng; Zhai, Kun; Sun, Young

    2016-01-01

    The coexistence and coupling between magnetization and electric polarization in multiferroic materials provide extra degrees of freedom for creating next-generation memory devices. A variety of concepts of multiferroic or magnetoelectric memories have been proposed and explored in the past decade. Here we propose a new principle to realize a multilevel nonvolatile memory based on the multiple states of the magnetoelectric coefficient (α) of multiferroics. Because the states of α depends on the relative orientation between magnetization and polarization, one can reach different levels of α by controlling the ratio of up and down ferroelectric domains with external electric fields. Our experiments in a device made of the PMN-PT/Terfenol-D multiferroic heterostructure confirm that the states of α can be well controlled between positive and negative by applying selective electric fields. Consequently, two-level, four-level, and eight-level nonvolatile memory devices are demonstrated at room temperature. This kind of multilevel magnetoelectric memory retains all the advantages of ferroelectric random access memory but overcomes the drawback of destructive reading of polarization. In contrast, the reading of α is nondestructive and highly efficient in a parallel way, with an independent reading coil shared by all the memory cells. PMID:27681812

  1. Chip-Level Electromigration Reliability for Cu Interconnects

    NASA Astrophysics Data System (ADS)

    Gall, M.; Oh, C.; Haznedar, H.; Grinshpon, A.; Zolotov, V.; Ku, P.; Panda, R.; Demircan, E.; Müller, J.; Justison, P.; Ramakrishna, K.; Thrasher, S.; Hernandez, R.; Herrick, M.; Fox, R.; Boeck, B.; Kawasaki, H.

    2004-12-01

    Even after the successful introduction of Cu-based metallization, the electromigration (EM) failure risk has remained one of the most important reliability concerns for most advanced process technologies. Ever increasing operating current densities and the introduction of low-k materials in the backend process scheme are some of the issues that threaten reliable, long-term operation at elevated temperatures. The traditional method of verifying EM reliability only through current density limit checks is proving to be inadequate in general, or quite expensive at the best. A Statistical EM Budgeting (SEB) methodology has been proposed to assess more realistic chip-level EM reliability from the complex statistical distribution of currents in a chip. To be valuable, this approach requires accurate estimation of currents for all interconnect segments in a chip. However, no efficient technique to manage the complexity of such a task for very large chip designs is known. We present an efficient method to estimate currents exhaustively for all interconnects in a chip. The proposed method uses pre-characterization of cells and macros, and steps to identify and filter out symmetrically bi-directional interconnects. We illustrate the strength of the proposed approach using a high-performance microprocessor design for embedded applications as a case study.

  2. EPRI PEAC Corp.: Certification Model Program and Interconnection Agreement Tools

    SciTech Connect

    Not Available

    2003-10-01

    Summarizes the work of EPRI PEAC Corp., under contract to DOE's Distribution and Interconnection R&D, to develop a certification model program and interconnection agreement tools to support the interconnection of distributed energy resources.

  3. Substrate-facilitated nanoparticle sintering and component interconnection procedure.

    PubMed

    Allen, Mark; Leppäniemi, Jaakko; Vilkman, Marja; Alastalo, Ari; Mattila, Tomi

    2010-11-26

    Room temperature substrate-facilitated sintering of nanoparticles is demonstrated using commercially available silver nanoparticle ink and inkjet printing substrates. The sintering mechanism is based on the chemical removal of the nanoparticle stabilizing ligand and is shown to provide conductivity above one-fourth that of bulk silver. A novel approach to attach discrete components to printed conductors is presented, where the sintered silver provides the metallic interconnects with good electrical and mechanical properties. A process for printing and chip-on-demand assembly is suggested.

  4. Note: Cryogenic microstripline-on-Kapton microwave interconnects

    NASA Astrophysics Data System (ADS)

    Harris, A. I.; Sieth, M.; Lau, J. M.; Church, S. E.; Samoska, L. A.; Cleary, K.

    2012-08-01

    Simple broadband microwave interconnects are needed for increasing the size of focal plane heterodyne radiometer arrays. We have measured loss and crosstalk for arrays of microstrip transmission lines in flex circuit technology at 297 and 77 K, finding good performance to at least 20 GHz. The dielectric constant of Kapton substrates changes very little from 297 to 77 K, and the electrical loss drops. The small cross-sectional area of metal in a printed circuit structure yields overall thermal conductivities similar to stainless steel coaxial cable. Operationally, the main performance tradeoffs are between crosstalk and thermal conductivity. We tested a patterned ground plane to reduce heat flux.

  5. Multi-scale reflection modulator-based optical interconnects

    NASA Astrophysics Data System (ADS)

    Nair, Rohit

    This dissertation describes the design, analysis, and experimental validation of micro- and macro-optical components for implementing optical interconnects at multiple scales for varied applications. Three distance scales are explored: millimeter, centimeter, and meter-scales. At the millimeter-scale, we propose the use of optical interconnects at the intra-chip level. With the rapid scaling down of CMOS critical dimensions in accordance to Moore's law, the bandwidth requirements of global interconnects in microprocessors has exceeded the capabilities of metal links. These are the wires that connect the most remote parts of the chip and are disproportionately problematic in terms of chip area and power consumption. Consequently, in the mid-2000s, we saw a shift in the chip architecture: a move towards multicore designs. However, this only delays the inevitable communication bottleneck between cores. To satisfy this bandwidth, we propose to replace the global metal interconnects with optical interconnects. We propose to use the hybrid integration of silicon with GaAs/AlAs-based multiple quantum well devices as optical modulators and photodetectors along with polymeric waveguides to transport the light. We use grayscale lithography to fabricate curved facets into the waveguides to couple light into the modulators and photodetectors. Next, at the chip-to-chip level in high-performance multiprocessor computing systems, communication distances vary from a few centimeters to tens of centimeters. An optical design for coupling light from off-chip lasers to on-chip surface-normal modulators is proposed in order to implement chip-to-chip free-space optical interconnects. The method uses a dual-prism module constructed from prisms made of two different glasses. The various alignment tolerances of the proposed system are investigated and found to be well within pick-and-place accuracies. For the off-chip lasers, vertical cavity surface emitting lasers (VCSELs) are proposed

  6. Laser processes for multichip module's high-density multilevel thin film packaging

    NASA Astrophysics Data System (ADS)

    Patel, Rajesh S.; Wassick, Thomas A.

    1997-05-01

    Today multichip modules (MCMs) have found applications in a variety of fields including computers, telecommunication, automotive industry, and medical diagnosis devices. Lasers are being used as a processing tool for fabricating high density multilevel thin film packages for MCMs. The two most commonly practiced laser processes for multilevel thin film packaging are, laser via ablation and laser based circuit repair processes. Laser via ablation is used for creating via holes in polyimide to provide vertical connection between two adjacent layers of multilevel thin film. It is a dry, precise, and highly robust patterning technology available today in packaging industry. The three major aspects of via ablation technology are ablation process, mask technology, and tooling. IBM has pioneered the laser via ablation technology and has developed all three aspects to use it as a primary technology for via formation for thin film packages. Laser based circuit repair processes have also been developed to a mature state where they are being used on a routine basis to repair circuits in multilevel thin film packages. The need for repair of circuit arises for variety of reasons including, contamination, yield improvement, to accommodate engineering changes or to correct design errors. The commonly practiced laser based repair processes are deleting metal shorts using a laser, depositing metal using laser chemical vapor deposition technique, and stitching metal lines using laser sonic bonding technique.

  7. Interconnection of VSAT and public data networks

    NASA Astrophysics Data System (ADS)

    Ramirez, Angel; Solana, Jesus; Berberana, Ignacio; Jimenez, Jose

    1991-10-01

    Technology advancements have made it possible to think of Very Small Aperture Terminals (VSAT) networks as a good technical alternative for WAN's development. With the foreseen single European market and the legal frame changes expected a rapid development of these systems is likely. A draft of standards for the interconnection of VSAT systems to Packet Switched Public Data Network (PSPDN's) has been issued in such an environment. An experiment with a two way VSAT system is being performed. The experiment covers several topics including sizing availability and reliability. Those related to the interconnection to the Spanish PSPDN, IBERPAC; interconnection scenarios, connection quality requirements, addressing and facilities are considered.

  8. Multilevel converters for power system applications

    SciTech Connect

    Lai, J.S.; Stovall, J.P.; Peng, F.Z. |

    1995-09-01

    Multilevel converters are emerging as a new breed of power converter options for power system applications. These converters are most suitable for high voltage high power applications because they connect devices in series without the need for component matching. One of the major limitations of the multilevel converters is the voltage unbalance between different levels. To avoid voltage unbalance between different levels, several techniques have been proposed for different applications. Excluding magnetic-coupled converters, this paper introduces three multilevel voltage source converters: (1) diode-clamp, (2) flying-capacitors, and (3) cascaded inverters with separate dc sources. The operation principle, features, constraints, and potential applications of these converters will be discussed.

  9. Method for fabricating an interconnected array of semiconductor devices

    DOEpatents

    Grimmer, Derrick P.; Paulson, Kenneth R.; Gilbert, James R.

    1989-10-10

    Semiconductor layer and conductive layer formed on a flexible substrate, divided into individual devices and interconnected with one another in series by interconnection layers and penetrating terminals.

  10. High-Density, High-Bandwidth, Multilevel Holographic Memory

    NASA Technical Reports Server (NTRS)

    Chao, Tien-Hsin

    2008-01-01

    A proposed holographic memory system would be capable of storing data at unprecedentedly high density, and its data transfer performance in both reading and writing would be characterized by exceptionally high bandwidth. The capabilities of the proposed system would greatly exceed even those of a state-of-the art memory system, based on binary holograms (in which each pixel value represents 0 or 1), that can hold .1 terabyte of data and can support a reading or writing rate as high as 1 Gb/s. The storage capacity of the state-of-theart system cannot be increased without also increasing the volume and mass of the system. However, in principle, the storage capacity could be increased greatly, without significantly increasing the volume and mass, if multilevel holograms were used instead of binary holograms. For example, a 3-bit (8-level) hologram could store 8 terabytes, or an 8-bit (256-level) hologram could store 256 terabytes, in a system having little or no more size and mass than does the state-of-the-art 1-terabyte binary holographic memory. The proposed system would utilize multilevel holograms. The system would include lasers, imaging lenses and other beam-forming optics, a block photorefractive crystal wherein the holograms would be formed, and two multilevel spatial light modulators in the form of commercially available deformable-mirror-device spatial light modulators (DMDSLMs) made for use in high speed input conversion of data up to 12 bits. For readout, the system would also include two arrays of complementary metal oxide/semiconductor (CMOS) photodetectors matching the spatial light modulators. The system would further include a reference-beam sterring device (equivalent of a scanning mirror), containing no sliding parts, that could be either a liquid-crystal phased-array device or a microscopic mirror actuated by a high-speed microelectromechanical system. Time-multiplexing and the multilevel nature of the DMDSLM would be exploited to enable writing

  11. Hybrid silicon evanescent approach to optical interconnects

    NASA Astrophysics Data System (ADS)

    Liang, Di; Fang, Alexander W.; Chen, Hui-Wen; Sysak, Matthew N.; Koch, Brian R.; Lively, Erica; Raday, Omri; Kuo, Ying-Hao; Jones, Richard; Bowers, John E.

    2009-06-01

    We discuss the recently developed hybrid silicon evanescent platform (HSEP), and its application as a promising candidate for optical interconnects in silicon. A number of key discrete components and a wafer-scale integration process are reviewed. The motivation behind this work is to realize silicon-based photonic integrated circuits possessing unique advantages of III-V materials and silicon-on-insulator waveguides simultaneously through a complementary metal-oxide semiconductor fabrication process. Electrically pumped hybrid silicon distributed feedback and distributed Bragg reflector lasers with integrated hybrid silicon photodetectors are demonstrated coupled to SOI waveguides, serving as the reliable on-chip single-frequency light sources. For the external signal processing, Mach-Zehnder interferometer modulators are demonstrated, showing a resistance-capacitance-limited, 3 dB electrical bandwidth up to 8 GHz and a modulation efficiency of 1.5 V mm. The successful implementation of quantum well intermixing technique opens up the possibility to realize multiple III-V bandgaps in this platform. Sampled grating DBR devices integrated with electroabsorption modulators (EAM) are fabricated, where the bandgaps in gain, mirror, and EAM regions are 1520, 1440 and 1480 nm, respectively. The high-temperature operation characteristics of the HSEP are studied experimentally and theoretically. An overall characteristic temperature ( T 0) of 51°C, an above threshold characteristic temperature ( T 1) of 100°C, and a thermal impedance ( Z T ) of 41.8°C/W, which agrees with the theoretical prediction of 43.5°C/W, are extracted from the Fabry-Perot devices. Scaling this platform to larger dimensions is demonstrated up to 150 mm wafer diameter. A vertical outgassing channel design is developed to accomplish high-quality III-V epitaxial transfer to silicon in a timely and dimension-independent fashion.

  12. Traffic congestion in interconnected complex networks

    NASA Astrophysics Data System (ADS)

    Tan, Fei; Wu, Jiajing; Xia, Yongxiang; Tse, Chi K.

    2014-06-01

    Traffic congestion in isolated complex networks has been investigated extensively over the last decade. Coupled network models have recently been developed to facilitate further understanding of real complex systems. Analysis of traffic congestion in coupled complex networks, however, is still relatively unexplored. In this paper, we try to explore the effect of interconnections on traffic congestion in interconnected Barabási-Albert scale-free networks. We find that assortative coupling can alleviate traffic congestion more readily than disassortative and random coupling when the node processing capacity is allocated based on node usage probability. Furthermore, the optimal coupling probability can be found for assortative coupling. However, three types of coupling preferences achieve similar traffic performance if all nodes share the same processing capacity. We analyze interconnected Internet autonomous-system-level graphs of South Korea and Japan and obtain similar results. Some practical suggestions are presented to optimize such real-world interconnected networks accordingly.

  13. Implementation of optical interconnections for VLSI

    NASA Technical Reports Server (NTRS)

    Wu, Wennie H.; Bergman, Larry A.; Johnston, Alan R.; Guest, Clark C.; Esener, Sadik C.

    1987-01-01

    This paper reports on the progress in implementing optical interconnections for VLSI. Four areas are covered: (1) the holographic optical element (HOE), (2) the laser sources, (3) the detectors and associated circuits forming an optically addressed gate, and (4) interconnection experiments in which five gates are actuated from one source. A laser scanner system with a resolution of 12 x 20 microns has been utilized to generate the HOEs. Diffraction efficiency of the HOE and diffracted spot size have been measured. Stock lasers have been modified with a high-frequency package for interconnect experiments, and buried heterostructure fabrication techniques have been pursued. Measurements have been made on the fabricated photodetectors to determine dark current, responsivity, and response time. The optical gates and the overall chip have been driven successfully with an input light beam, as well as with the optical signal interconnected through the one to five holograms.

  14. One-dimensional nano-interconnection formation.

    PubMed

    Ji, Jianlong; Zhou, Zhaoying; Yang, Xing; Zhang, Wendong; Sang, Shengbo; Li, Pengwei

    2013-09-23

    Interconnection of one-dimensional nanomaterials such as nanowires and carbon nanotubes with other parts or components is crucial for nanodevices to realize electrical contacts and mechanical fixings. Interconnection has been being gradually paid great attention since it is as significant as nanomaterials properties, and determines nanodevices performance in some cases. This paper provides an overview of recent progress on techniques that are commonly used for one-dimensional interconnection formation. In this review, these techniques could be categorized into two different types: two-step and one-step methods according to their established process. The two-step method is constituted by assembly and pinning processes, while the one-step method is a direct formation process of nano-interconnections. In both methods, the electrodeposition approach is illustrated in detail, and its potential mechanism is emphasized.

  15. Epidemics in interconnected small-world networks.

    PubMed

    Liu, Meng; Li, Daqing; Qin, Pengju; Liu, Chaoran; Wang, Huijuan; Wang, Feilong

    2015-01-01

    Networks can be used to describe the interconnections among individuals, which play an important role in the spread of disease. Although the small-world effect has been found to have a significant impact on epidemics in single networks, the small-world effect on epidemics in interconnected networks has rarely been considered. Here, we study the susceptible-infected-susceptible (SIS) model of epidemic spreading in a system comprising two interconnected small-world networks. We find that the epidemic threshold in such networks decreases when the rewiring probability of the component small-world networks increases. When the infection rate is low, the rewiring probability affects the global steady-state infection density, whereas when the infection rate is high, the infection density is insensitive to the rewiring probability. Moreover, epidemics in interconnected small-world networks are found to spread at different velocities that depend on the rewiring probability.

  16. INTERCONNECTIONS BETWEEN HUMAN HEALTH AND ECOLOGICAL INTEGRITY

    EPA Science Inventory

    Interconnections between Human Health and Ecological Integrity emanates from a June 2000 Pellston Workshop in Snowbird, Utah, USA. Jointly sponsored by the Society of Environmental Toxicology and Chemistry (SETAC) and the Society of Toxicology (SOT), the workshop was motivated by...

  17. Five-Segment Interconnection For Electromigration Tests

    NASA Technical Reports Server (NTRS)

    Hannaman, David J.; Buehler, Martin G.

    1991-01-01

    Proposed integrated-circuit conductive pattern intended for use in electromigration lifetime testing of interconnection lines of integrated circuits. Designed for collection of statistics on electromigration from smallest possible area. Includes 5 interconnection segments with Kelvin voltage taps, with total of 12 contact pads, and provides for simultaneous measurements on all of segments. Attempts to minimize thermal gradients within each segment and conforms to guidelines on electromigration test structures promulgated by National Institute of Standards and Technology (NIST).

  18. Scalable Adaptive Multilevel Solvers for Multiphysics Problems

    SciTech Connect

    Xu, Jinchao

    2014-12-01

    In this project, we investigated adaptive, parallel, and multilevel methods for numerical modeling of various real-world applications, including Magnetohydrodynamics (MHD), complex fluids, Electromagnetism, Navier-Stokes equations, and reservoir simulation. First, we have designed improved mathematical models and numerical discretizaitons for viscoelastic fluids and MHD. Second, we have derived new a posteriori error estimators and extended the applicability of adaptivity to various problems. Third, we have developed multilevel solvers for solving scalar partial differential equations (PDEs) as well as coupled systems of PDEs, especially on unstructured grids. Moreover, we have integrated the study between adaptive method and multilevel methods, and made significant efforts and advances in adaptive multilevel methods of the multi-physics problems.

  19. An interconnected network of core-forming melts produced by shear deformation

    PubMed

    Bruhn; Groebner; Kohlstedt

    2000-02-24

    The formation mechanism of terrestrial planetary cores is still poorly understood, and has been the subject of numerous experimental studies. Several mechanisms have been proposed by which metal--mainly iron with some nickel--could have been extracted from a silicate mantle to form the core. Most recent models involve gravitational sinking of molten metal or metal sulphide through a partially or fully molten mantle that is often referred to as a 'magma ocean'. Alternative models invoke percolation of molten metal along an interconnected network (that is, porous flow) through a solid silicate matrix. But experimental studies performed at high pressures have shown that, under hydrostatic conditions, these melts do not form an interconnected network, leading to the widespread assumption that formation of metallic cores requires a magma ocean. In contrast, here we present experiments which demonstrate that shear deformation to large strains can interconnect a significant fraction of initially isolated pockets of metal and metal sulphide melts in a solid matrix of polycrystalline olivine. Therefore, in a dynamic (non-hydrostatic) environment, percolation remains a viable mechanism for the segregation and migration of core-forming melts in a solid silicate mantle. PMID:10706283

  20. An Interconnected Network of Core-Forming Melts Produced by Shear Deformation

    NASA Technical Reports Server (NTRS)

    Bruhn, D.; Groebner, N.; Kohlstedt, D. L.

    2000-01-01

    The formation mechanism of terrestrial planetary is still poorly understood, and has been the subject of numerous experimental studies. Several mechanisms have been proposed by which metal-mainly iron with some nickel-could have been extracted from a silicate mantle to form the core. Most recent models involve gravitational sinking of molten metal or metal sulphide through a partially or fully molten mantle that is often referred to as a'magma ocean. Alternative models invoke percolation of molten metal along an interconnected network (that is, porous flow) through a solid silicate matrix. But experimental studies performed at high pressures have shown that, under hydrostatic conditions, these melts do not form an interconnected network, leading to the widespread assumption that formation of metallic cores requires a magma ocean. In contrast, here we present experiments which demonstrate that shear deformation to large strains can interconnect a significant fraction of initially isolated pockets of metal and metal sulphide melts in a solid matrix of polycrystalline olivine. Therefore, in a dynamic (nonhydrostatic) environment, percolation remains a viable mechanism for the segregation and migration of core-forming melts in a solid silicate mantle.

  1. FUNDAMENTAL STUDIES OF THE DURABILITY OF MATERIALS FOR INTERCONNECTS IN SOLID OXIDE FUEL CELLS

    SciTech Connect

    Hammer, J.; Laney, S.; Jackson, W.; Pettit, F.; Meier, J.; Dhanaraj, N.; Beuth, J.

    2005-01-28

    This task involves theoretical analysis of possible alternative metallic interconnect schemes including: Ni and dispersion-strengthened Ni, low CTE alloys based on Fe-Ni (Invar), coatings to suppress evaporation, and incorporation of high conductivity paths. The most promising systems are being evaluated experimentally with regard to durability and oxide conductivity.

  2. Adhesion and reliability of copper interconnects with Ta and TaN barrier layers

    SciTech Connect

    Lane, Michael; Dauskardt, Reinhold H.; Krishna, Nety; Hashim, Imran

    2000-01-01

    With the advent of copper metallization in interconnect structures, new barrier layers are required to prevent copper diffusion into adjacent dielectrics and the underlying silicon. The barrier must also provide adequate adhesion to both the dielectric and copper. While Ta and TaN barrier layers have been incorporated for these purposes in copper metallization schemes, little quantitative data exist on their adhesive properties. In this study, the critical interface fracture energy and the subcritical debonding behavior of ion-metal-plasma sputtered Ta and TaN barrier layers in Cu interconnect structures were investigated. Specifically, the effects of interfacial chemistry, Cu layer thickness, and oxide type were examined. Behavior is rationalized in terms of relevant reactions at the barrier/dielectric interface and plasticity in adjacent metal layers. (c) 2000 Materials Research Society.

  3. Alternative Methods for Assessing Mediation in Multilevel Data: The Advantages of Multilevel SEM

    ERIC Educational Resources Information Center

    Preacher, Kristopher J.; Zhang, Zhen; Zyphur, Michael J.

    2011-01-01

    Multilevel modeling (MLM) is a popular way of assessing mediation effects with clustered data. Two important limitations of this approach have been identified in prior research and a theoretical rationale has been provided for why multilevel structural equation modeling (MSEM) should be preferred. However, to date, no empirical evidence of MSEM's…

  4. Committed regional electrical interconnection projects in the Middle East

    SciTech Connect

    Azzam, M.; Al-Said, A.

    1994-12-01

    Due to the well-known advantages of electrical interconnections and their consequent benefits, Jordan considers the interconnection of its electrical network with the neighboring electrical networks as one of its main corporate strategies. At present the electrical interconnection project of the networks of Egypt, Iraq, Jordan, Syria, and Turkey is progressing. To achieve this interconnection project, two feasibility studies were conducted: interconnection of the Egyptian and Jordanian electrical power systems; interconnection of the electrical networks of Egypt, Iraq, Jordan, Syria, and Turkey (EIJST interconnection). This presentation reviews these studies and their results.

  5. Multilevel sequential Monte Carlo samplers

    DOE PAGESBeta

    Beskos, Alexandros; Jasra, Ajay; Law, Kody; Tempone, Raul; Zhou, Yan

    2016-08-24

    Here, we study the approximation of expectations w.r.t. probability distributions associated to the solution of partial differential equations (PDEs); this scenario appears routinely in Bayesian inverse problems. In practice, one often has to solve the associated PDE numerically, using, for instance finite element methods and leading to a discretisation bias, with the step-size level hL. In addition, the expectation cannot be computed analytically and one often resorts to Monte Carlo methods. In the context of this problem, it is known that the introduction of the multilevel Monte Carlo (MLMC) method can reduce the amount of computational effort to estimate expectations, for a given level of error. This is achieved via a telescoping identity associated to a Monte Carlo approximation of a sequence of probability distributions with discretisation levelsmore » $${\\infty}$$ >h0>h1 ...>hL. In many practical problems of interest, one cannot achieve an i.i.d. sampling of the associated sequence of probability distributions. A sequential Monte Carlo (SMC) version of the MLMC method is introduced to deal with this problem. In conclusion, it is shown that under appropriate assumptions, the attractive property of a reduction of the amount of computational effort to estimate expectations, for a given level of error, can be maintained within the SMC context.« less

  6. Applications of cascade multilevel inverters.

    PubMed

    Peng, Fang-zen; Qian, Zhao-ming

    2003-01-01

    Cascade multilevel inverters have been developed for electric utility applications. A cascade M-level inverter consists of (M-1)/2 H-bridges in which each bridge's dc voltage is supported by its own dc capacitor. The new inverter can: (1) generate almost sinusoidal waveform voltage while only switching one time per fundamental cycle; (2) dispense with multi-pulse inverters' transformers used in conventional utility interfaces and static var compensators; (3) enables direct parallel or series transformer-less connection to medium- and high-voltage power systems. In short, the cascade inverter is much more efficient and suitable for utility applications than traditional multi-pulse and pulse width modulation (PWM) inverters. The authors have experimentally demonstrated the superiority of the new inverter for power supply, (hybrid) electric vehicle (EV) motor drive, reactive power (var) and harmonic compensation. This paper summarizes the features, feasibility, and control schemes of the cascade inverter for utility applications including utility interface of renewable energy, voltage regulation, var compensation, and harmonic filtering in power systems. Analytical, simulated, and experimental results demonstrated the superiority of the new inverters. PMID:14566981

  7. Multilevel Complex Networks and Systems

    NASA Astrophysics Data System (ADS)

    Caldarelli, Guido

    2014-03-01

    Network theory has been a powerful tool to model isolated complex systems. However, the classical approach does not take into account the interactions often present among different systems. Hence, the scientific community is nowadays concentrating the efforts on the foundations of new mathematical tools for understanding what happens when multiple networks interact. The case of economic and financial networks represents a paramount example of multilevel networks. In the case of trade, trade among countries the different levels can be described by the different granularity of the trading relations. Indeed, we have now data from the scale of consumers to that of the country level. In the case of financial institutions, we have a variety of levels at the same scale. For example one bank can appear in the interbank networks, ownership network and cds networks in which the same institution can take place. In both cases the systemically important vertices need to be determined by different procedures of centrality definition and community detection. In this talk I will present some specific cases of study related to these topics and present the regularities found. Acknowledged support from EU FET Project ``Multiplex'' 317532.

  8. Metallic nanowire networks

    DOEpatents

    Song, Yujiang; Shelnutt, John A.

    2012-11-06

    A metallic nanowire network synthesized using chemical reduction of a metal ion source by a reducing agent in the presence of a soft template comprising a tubular inverse micellar network. The network of interconnected polycrystalline nanowires has a very high surface-area/volume ratio, which makes it highly suitable for use in catalytic applications.

  9. Testing Group Mean Differences of Latent Variables in Multilevel Data Using Multiple-Group Multilevel CFA and Multilevel MIMIC Modeling.

    PubMed

    Kim, Eun Sook; Cao, Chunhua

    2015-01-01

    Considering that group comparisons are common in social science, we examined two latent group mean testing methods when groups of interest were either at the between or within level of multilevel data: multiple-group multilevel confirmatory factor analysis (MG ML CFA) and multilevel multiple-indicators multiple-causes modeling (ML MIMIC). The performance of these methods were investigated through three Monte Carlo studies. In Studies 1 and 2, either factor variances or residual variances were manipulated to be heterogeneous between groups. In Study 3, which focused on within-level multiple-group analysis, six different model specifications were considered depending on how to model the intra-class group correlation (i.e., correlation between random effect factors for groups within cluster). The results of simulations generally supported the adequacy of MG ML CFA and ML MIMIC for multiple-group analysis with multilevel data. The two methods did not show any notable difference in the latent group mean testing across three studies. Finally, a demonstration with real data and guidelines in selecting an appropriate approach to multilevel multiple-group analysis are provided.

  10. 76 FR 39870 - PJM Interconnection, LLC; PJM Power Providers Group v. PJM Interconnection, LLC; Notice of Date...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2011-07-07

    ... Energy Regulatory Commission PJM Interconnection, LLC; PJM Power Providers Group v. PJM Interconnection... applicability of the PJM Interconnection, LLC (PJM) Minimum Offer Price Rule (MOPR) as it relates to self-supply... base residual auction.\\2\\ \\1\\ PJM Interconnection, LLC, 135 FERC ] 61,022 (2011). \\2\\...

  11. Evolution of intrachip interconnects and performance constraints

    NASA Astrophysics Data System (ADS)

    Caignet, Fabrice; Collet, Jacques H.; Sellaye, F.

    2003-04-01

    This work aims at defining the marks that optoelectronic solutions will have to beat for replacing electric interconnects at chip level. Thus, we first anlayze the communication performance of future electrical interconnects considering the reduction of the lithographic feature size λ from 0.7 to 0.05 μm. We mostly analyze the results with reduced units: Lengths are calculated in multiples of λ times are compared to the chip clock cycle Tc that we estimate from the foreseeable evolution of the processor operation frequency. From our simulations, we conclude that: 1) it does not seem necessary to consider the integration of optical interconnects (OI) over distance shorter than 1000λ, because the performacne of electric interconnects is sufficient; 2) The penetration of IOs between blocks separated by more than 10λ could be envisaged provided that the present performence of OIs could be dramatically improved to beat electric solutions at chip level. New generations of low-threshold high-effieincy VCSELs and ultra-fast high-efficiency photodiode are needed; 3) The first possible application of OIs in chips is likely not for inter-block communication but for clock distribution as the energy constaints are weaker and because the clock tree is an extremely long interconnect.

  12. Interconnection Testing of Distributed Resources: Preprint

    SciTech Connect

    Kroposki, B.; Basso, T.; DeBlasio, R.

    2004-02-01

    With the publication of IEEE 1547-2003(TM) Standard for Interconnecting Distributed Resources With Electric Power Systems, the electric power industry has a need to develop tests and procedures to verify that interconnection equipment meets 1547 technical requirements. A new standard, IEEE P1547.1(TM), is being written to give detailed tests and procedures for confirming that equipment meets the interconnection requirements. The National Renewable Energy Laboratory has been validating test procedures being developed as part of IEEE P1547.1. As work progresses on the validation of those procedures, information and test reports are passed on to the working group of IEEE P1547.1 for future revisions.

  13. Ssip-a processor interconnection simulator

    SciTech Connect

    Navaux, P.; Weber, R.; Prezzi, J.; Tazza, M.

    1982-01-01

    Recent growing interest in multiple processor architectures has given rise to the study of procesor-memory interconnections for the determination of better architectures. This paper concerns the development of the SSIP-sistema simulador de interconexao de processadores (processor interconnection simulating system) which allows the evaluation of different interconnection structures comparing its performance in order to provide parameters which would help the designer to define an architcture. A wide spectrum of systems may be evaluated, and their behaviour observed due to the features incorporated into the simulator program. The system modelling and the simulator program implementation are described. Some results that can be obtained are shown, along with the discussion of their usefulness. 12 references.

  14. Global optical free-space smart interconnects

    NASA Astrophysics Data System (ADS)

    Guilfoyle, Peter S.; Hessenbruch, John M.; Zeise, Frederick F.

    1993-07-01

    High fan-in/fan-out, low power (1 fJ per gate), high performance computing (HPC) modules are being developed that integrate global (multidimensional) free space `smart' optical interconnects with GaAs DANE technology. This new architecture implements N4 global free space optical interconnects coupled with 2-D arrays of N-bit Boolean multiplications by DeMorgan's theorem on wide word fan-ins. `Smart' interconnects provide a high speed inter- module alternative without the power requirements and cross-talk limitations of GaAs circuitry. Selected algorithms such as 64-bit addition can operate at lower power and higher speeds using global technology and GaAs logic. Thus, faster processing can be fully realized which allows for a reduction in pipeline delays.

  15. The motion of interconnected flexible bodies

    NASA Technical Reports Server (NTRS)

    Hopkins, A. S.

    1975-01-01

    The equations of motion for an arbitrarily interconnected collection of substructures are derived. The substructures are elastic bodies which may be idealized as finite element assemblies and are subject to small deformations relative to a nominal state. Interconnections between the elastic substructures permit large relative translations and rotations between substructures, governed by Pfaffian constraints describing the connections. Screw connections (permitting rotation about and translation along a single axis) eliminate constraint forces and incorporate modal coupling. The problem of flexible spacecraft simulation is discussed. Hurty's component mode approach is extended by permitting interconnected elastic substructures large motions relative to each other and relative to inertial space. The hybrid coordinate methods are generalized by permitting all substructures to be flexible (rather than only the terminal members of a topological tree of substructures). The basic relationships of continuum mechanics are developed.

  16. Random walk centrality in interconnected multilayer networks

    NASA Astrophysics Data System (ADS)

    Solé-Ribalta, Albert; De Domenico, Manlio; Gómez, Sergio; Arenas, Alex

    2016-06-01

    Real-world complex systems exhibit multiple levels of relationships. In many cases they require to be modeled as interconnected multilayer networks, characterizing interactions of several types simultaneously. It is of crucial importance in many fields, from economics to biology and from urban planning to social sciences, to identify the most (or the less) influent nodes in a network using centrality measures. However, defining the centrality of actors in interconnected complex networks is not trivial. In this paper, we rely on the tensorial formalism recently proposed to characterize and investigate this kind of complex topologies, and extend two well known random walk centrality measures, the random walk betweenness and closeness centrality, to interconnected multilayer networks. For each of the measures we provide analytical expressions that completely agree with numerically results.

  17. Fiber optic interconnects: physical design for reliability

    NASA Astrophysics Data System (ADS)

    Suhir, E.

    2010-02-01

    The paper deals with the application of methods and approaches of the engineering mechanics to fiber optics systems. The emphasis is on fiber optics interconnects. We address traditional problems of the mechanical behavior of optical fiber interconnects subjected to mechanical and/or thermally induced loading, as well as the application of nanotechnology in optical fiber engineering. Particularly, we elaborate on the application of a newly developed advanced nano-particle material (NPM) as an attractive substitute for the existing optical fiber coatings and perhaps even claddings. The solutions to the majority of the examined problems were obtained using analytical ("mathematical") modeling, i.e., methods of classical structural analysis.

  18. Graphene Nanoribbons (GNRs) for Future Interconnect

    NASA Astrophysics Data System (ADS)

    Saptono Duryat, Rahmat

    2016-05-01

    Selecting and developing materials for the future devices require a sound understanding of design requirements. Miniaturization of electronic devices, as commonly expressed by Moore Law, has involved the integration level. Increase of the level has caused some consequences in the design and selection of materials for interconnection. The present paper deals with the challenge of materials design and selection beyond the nanoscale limit and the ability of traditional materials to cope with. One of the emerging materials, i.e. Graphene, will be reviewed with particular reference to its characteristics and potentials for future interconnection.

  19. Multi-level block permutation

    PubMed Central

    Winkler, Anderson M.; Webster, Matthew A.; Vidaurre, Diego; Nichols, Thomas E.; Smith, Stephen M.

    2015-01-01

    Under weak and reasonable assumptions, mainly that data are exchangeable under the null hypothesis, permutation tests can provide exact control of false positives and allow the use of various non-standard statistics. There are, however, various common examples in which global exchangeability can be violated, including paired tests, tests that involve repeated measurements, tests in which subjects are relatives (members of pedigrees) — any dataset with known dependence among observations. In these cases, some permutations, if performed, would create data that would not possess the original dependence structure, and thus, should not be used to construct the reference (null) distribution. To allow permutation inference in such cases, we test the null hypothesis using only a subset of all otherwise possible permutations, i.e., using only the rearrangements of the data that respect exchangeability, thus retaining the original joint distribution unaltered. In a previous study, we defined exchangeability for blocks of data, as opposed to each datum individually, then allowing permutations to happen within block, or the blocks as a whole to be permuted. Here we extend that notion to allow blocks to be nested, in a hierarchical, multi-level definition. We do not explicitly model the degree of dependence between observations, only the lack of independence; the dependence is implicitly accounted for by the hierarchy and by the permutation scheme. The strategy is compatible with heteroscedasticity and variance groups, and can be used with permutations, sign flippings, or both combined. We evaluate the method for various dependence structures, apply it to real data from the Human Connectome Project (HCP) as an example application, show that false positives can be avoided in such cases, and provide a software implementation of the proposed approach. PMID:26074200

  20. A multilevel preconditioner for domain decomposition boundary systems

    SciTech Connect

    Bramble, J.H.; Pasciak, J.E.; Xu, Jinchao.

    1991-12-11

    In this note, we consider multilevel preconditioning of the reduced boundary systems which arise in non-overlapping domain decomposition methods. It will be shown that the resulting preconditioned systems have condition numbers which be bounded in the case of multilevel spaces on the whole domain and grow at most proportional to the number of levels in the case of multilevel boundary spaces without multilevel extensions into the interior.

  1. Revised Record of Decision for the Electrical Interconnection of the Summit/Westward Project

    SciTech Connect

    N /A

    2004-10-21

    The Bonneville Power Administration (BPA) has decided to amend its July 25, 2003, Record of Decision (ROD) regarding the proposed Summit/Westward Project (Project) to offer contract terms for an optional interconnection of this Project into the Federal Columbia River Transmission System (FCRTS). Under this optional interconnection plan, BPA would integrate electric power from the Project into the FCRTS at a point adjacent to Clatskanie People's Utility District (CPUD) existing Wauna Substation. In order to deliver power to this location, CPUD would develop a new substation (Bradbury Substation) at a site near the Project and a new 230-kV transmission line from there to CPUD's Wauna Substation, which is already connected to the FCRTS. As part of this revised decision, BPA will facilitate CPUD development of the Bradbury-Wauna transmission line by allowing joint use of BPA right-of-way. This will involve reconstructing a section of BPA's 115-kV Allston-Astoria No. 1 transmission line from single-circuit H-frame wood-pole design to double-circuit single metal pole design. Terms of BPA participation in CPUD's development of the Bradbury-Wauna transmission line will be documented in a Construction Agreement. This optional interconnection plan is in addition to BPA's previous offer for interconnection of the Project at BPA's Allston Substation, as documented in the July 25, 2003, ROD. As with the initial interconnection plan, the decision to offer terms to interconnect the Project through the optional interconnection plan is consistent with BPA's Business Plan Final Environmental Impact Statement (BP EIS) (DOE/EIS-0183, June 1995), and the Business Plan Record of Decision (BP ROD, August 1995). This decision thus is similarly tiered to the Business Plan ROD.

  2. Propensity score weighting with multilevel data.

    PubMed

    Li, Fan; Zaslavsky, Alan M; Landrum, Mary Beth

    2013-08-30

    Propensity score methods are being increasingly used as a less parametric alternative to traditional regression to balance observed differences across groups in both descriptive and causal comparisons. Data collected in many disciplines often have analytically relevant multilevel or clustered structure. The propensity score, however, was developed and has been used primarily with unstructured data. We present and compare several propensity-score-weighted estimators for clustered data, including marginal, cluster-weighted, and doubly robust estimators. Using both analytical derivations and Monte Carlo simulations, we illustrate bias arising when the usual assumptions of propensity score analysis do not hold for multilevel data. We show that exploiting the multilevel structure, either parametrically or nonparametrically, in at least one stage of the propensity score analysis can greatly reduce these biases. We applied these methods to a study of racial disparities in breast cancer screening among beneficiaries of Medicare health plans.

  3. Analysis of Phase Multilevel Recording on Microholograms

    NASA Astrophysics Data System (ADS)

    Ide, Tatsuro; Mikami, Hideharu; Osawa, Kentaro; Watanabe, Koichi

    2011-09-01

    An optical phase multilevel recording technique using a microholographic system and phase-diversity homodyne detection for enhancement of optical disc capacity is investigated. In this technique, multilevel phase signals are stored as the fringe shifts along the optical axis and recovered from the arctangent of two homodyne-detected signals. For comparison, phase signals from Blu-ray Disc read-only memory (BD-ROM) and Blu-ray Disc recordable (BD-R) media obtained by phase-diversity homodyne detection are experimentally evaluated. From the experimental results, we demonstrated that phase-diversity homodyne detection is useful for detecting the phase signal modulation of the signal beam from an optical disc. Furthermore, simulation results on microholograms indicate that phase signals from the microholograms are much more stable despite the variety of their sizes than those from BD-ROM. These results demonstrate the potential of this multilevel recording method.

  4. Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications

    NASA Astrophysics Data System (ADS)

    Jiang, Hongjin

    SnPb solders have long been used as interconnect materials in microelectronic packaging. Due to the health threat of lead to human beings, the use of lead-free interconnect materials is imperative. Three kinds of lead-free interconnect materials are being investigated, namely lead-free metal solders (SnAg, SnAgCu, etc.), electrically conductive adhesives (ECAs) and carbon nanotubes (CNTs). However, there are still limitations for the full utilization of these lead-free interconnect materials in the microelectronic packaging, such as higher melting point of lead-free metal solders, lower electrical conductivity of the ECAs and poor adhesion of CNTs to substrates. This thesis is devoted to the research and development of low processing temperature lead-free interconnect materials for microelectronic packaging applications with an emphasis on fundamental studies of nanoparticles synthesis, dispersion and oxidation prevention, and nanocomposites fabrication. Oxide-free tin (Sn), tin/silver (96.5Sn3.5Ag) and tin/silver/copper (96.5Sn3.0Ag0.5Cu) alloy nanoparticles with different sizes were synthesized by a low temperature chemical reduction method. Both size dependent melting point and latent heat of fusion of the synthesized nanoparticles were obtained. The nano lead-free solder pastes/composites created by dispersing the SnAg or SnAgCu alloy nanoparticles into an acidic type flux spread and wet on the cleaned copper surface at 220 to 230°C. This study demonstrated the feasibility of nano sized SnAg or SnAgCu alloy particle pastes for low processing temperature lead-free interconnect applications in microelectronic packaging.

  5. Pressure activated interconnection of micro transfer printed components

    NASA Astrophysics Data System (ADS)

    Prevatte, Carl; Guven, Ibrahim; Ghosal, Kanchan; Gomez, David; Moore, Tanya; Bonafede, Salvatore; Raymond, Brook; Trindade, António Jose; Fecioru, Alin; Kneeburg, David; Meitl, Matthew A.; Bower, Christopher A.

    2016-05-01

    Micro transfer printing and other forms of micro assembly deterministically produce heterogeneously integrated systems of miniaturized components on non-native substrates. Most micro assembled systems include electrical interconnections to the miniaturized components, typically accomplished by metal wires formed on the non-native substrate after the assembly operation. An alternative scheme establishing interconnections during the assembly operation is a cost-effective manufacturing method for producing heterogeneous microsystems, and facilitates the repair of integrated microsystems, such as displays, by ex post facto addition of components to correct defects after system-level tests. This letter describes pressure-concentrating conductor structures formed on silicon (1 0 0) wafers to establish connections to preexisting conductive traces on glass and plastic substrates during micro transfer printing with an elastomer stamp. The pressure concentrators penetrate a polymer layer to form the connection, and reflow of the polymer layer bonds the components securely to the target substrate. The experimental yield of series-connected test systems with >1000 electrical connections demonstrates the suitability of the process for manufacturing, and robustness of the test systems against exposure to thermal shock, damp heat, and mechanical flexure shows reliability of the resulting bonds.

  6. Multilevel transport solution of LWR reactor cores

    SciTech Connect

    Jose Ignacio Marquez Damian; Cassiano R.E. de Oliveira; HyeonKae Park

    2008-09-01

    This work presents a multilevel approach for the solution of the transport equation in typical LWR assemblies and core configurations. It is based on the second-order, even-parity formulation of the transport equation, which is solved within the framework provided by the finite element-spherical harmonics code EVENT. The performance of the new solver has been compared with that of the standard conjugate gradient solver for diffusion and transport problems on structured and unstruc-tured grids. Numerical results demonstrate the potential of the multilevel scheme for realistic reactor calculations.

  7. 47 CFR 95.1313 - Interconnection prohibited.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... facilities of the public switched telephone network to permit the transmission of messages or signals between points in the wireline or radio network of a public telephone company and persons served by multi-use... prohibited. MURS stations are prohibited from interconnection with the public switched...

  8. Electric network interconnection of Mashreq Arab Countries

    SciTech Connect

    El-Amin, I.M.; Al-Shehri, A.M.; Opoku, G.; Al-Baiyat, S.A.; Zedan, F.M.

    1994-12-01

    Power system interconnection is a well established practice for a variety of technical and economical reasons. Several interconnected networks exist worldwide for a number of factors. Some of these networks cross international boundaries. This presentation discusses the future developments of the power systems of Mashreq Arab Countries (MAC). MAC consists of Bahrain, Egypt, Iraq, Jordan, Kuwait, Lebanon, Oman, Qatar, Saudi Arabia, United Arab Emirates (UAE), and Yemen. Mac power systems are operated by government or semigovernment bodies. Many of these countries have national or regional electric grids but are generally isolated from each other. With the exception of Saudi Arabia power systems, which employ 60 Hz, all other MAC utilities use 50 Hz frequency. Each country is served by one utility, except Saudi Arabia, which is served by four major utilities and some smaller utilities serving remote towns and small load centers. The major utilities are the Saudi Consolidated electric Company in the Eastern Province (SCECO East), SCECO Center, SCECO West, and SCECO South. These are the ones considered in this study. The energy resources in MAC are varied. Countries such as Egypt, Iraq, and Syria have significant hydro resources.The gulf countries and Iraq have abundant fossil fuel, The variation in energy resources as well as the characteristics of the electric load make it essential to look into interconnections beyond the national boundaries. Most of the existing or planned interconnections involve few power systems. A study involving 12 countries and over 20 utilities with different characteristics represents a very large scale undertaking.

  9. Healing Voids In Interconnections In Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Cuddihy, Edward F.; Lawton, Russell A.; Gavin, Thomas

    1989-01-01

    Unusual heat treatment heals voids in aluminum interconnections on integrated circuits (IC's). Treatment consists of heating IC to temperature between 200 degrees C and 400 degrees C, holding it at that temperature, and then plunging IC immediately into liquid nitrogen. Typical holding time at evaluated temperature is 30 minutes.

  10. Demonstrated results of welded and soldered interconnections

    NASA Technical Reports Server (NTRS)

    Hart, R. E., Jr.

    1985-01-01

    Solar cell modules with welded and soldered interconnections were constructed using a flexible substrate material. These modules were thermally cycled between approx. 80 deg C at rates 100 cycles/day to demonstrate survivability under simulated low Earth orbit (LEO) temperature conditions. The modules, cycled in an inert atmosphere, show durability for 36,000 cycles.

  11. Novel Composite Materials for SOFC Cathode-Interconnect Contact

    SciTech Connect

    J. H. Zhu

    2009-07-31

    This report summarized the research efforts and major conclusions of our University Coal Research Project, which focused on developing a new class of electrically-conductive, Cr-blocking, damage-tolerant Ag-perovksite composite materials for the cathode-interconnect contact of intermediate-temperature solid oxide fuel cell (SOFC) stacks. The Ag evaporation rate increased linearly with air flow rate initially and became constant for the air flow rate {ge} {approx} 1.0 cm {center_dot} s{sup -1}. An activation energy of 280 KJ.mol{sup -1} was obtained for Ag evaporation in both air and Ar+5%H{sub 2}+3%H{sub 2}O. The exposure environment had no measurable influence on the Ag evaporation rate as well as its dependence on the gas flow rate, while different surface morphological features were developed after thermal exposure in the oxidizing and reducing environments. Pure Ag is too volatile at the SOFC operating temperature and its evaporation rate needs to be reduced to facilitate its application as the cathode-interconnect contact. Based on extensive evaporation testing, it was found that none of the alloying additions reduced the evaporation rate of Ag over the long-term exposure, except the noble metals Au, Pt, and Pd; however, these noble elements are too expensive to justify their practical use in contact materials. Furthermore, the addition of La{sub 0.8}Sr{sub 0.2}MnO{sub 3} (LSM) into Ag to form a composite material also did not significantly modify the Ag evaporation rate. The Ag-perovskite composites with the perovskite being either (La{sub 0.6}Sr{sub 0.4})(Co{sub 0.8}Fe{sub 0.2})O{sub 3} (LSCF) or LSM were systematically evaluated as the contact material between the ferritic interconnect alloy Crofer 22 APU and the LSM cathode. The area specific resistances (ASRs) of the test specimens were shown to be highly dependent on the volume percentage and the type of the perovskite present in the composite contact material as well as the amount of thermal cycling

  12. Multilevel resistive switching nonvolatile memory based on MoS2 nanosheet-embedded graphene oxide

    NASA Astrophysics Data System (ADS)

    Shin, Gwang Hyuk; Kim, Choong-Ki; Bang, Gyeong Sook; Kim, Jong Yun; Jang, Byung Chul; Koo, Beom Jun; Woo, Myung Hun; Choi, Yang-Kyu; Choi, Sung-Yool

    2016-09-01

    An increasing demand for nonvolatile memory has driven extensive research on resistive switching memory because it uses simple structures with high density, fast switching speed, and low power consumption. To improve the storage density, the application of multilevel cells is among the most promising solutions, including three-dimensional cross-point array architectures. Two-dimensional nanomaterials have several advantages as resistive switching media, including flexibility, low cost, and simple fabrication processes. However, few reports exist on multilevel nonvolatile memory and its switching mechanism. We herein present a multilevel resistive switching memory based on graphene oxide (GO) and MoS2 fabricated by a simple spin-coating process. Metallic 1T-MoS2 nanosheets, chemically exfoliated by Li intercalation, were successfully embedded between two GO layers as charge-trapping sites. The resulting stacks of GO/MoS2/GO exhibited excellent nonvolatile memory performance with at least four resistance states, >102 endurance cycles, and >104 s retention time. Furthermore, the charge transport mechanism was systematically investigated through the analysis of low-frequency 1/f noise in various resistance states, which could be modulated by the input voltage bias in the negative differential resistance region. Accordingly, we propose a strategy to achieve multilevel nonvolatile memory in which the stacked layers of two-dimensional nanosheets are utilized as resistive and charge-storage materials.

  13. Displacement based multilevel structural optimization

    NASA Technical Reports Server (NTRS)

    Striz, Alfred G.

    1995-01-01

    Multidisciplinary design optimization (MDO) is expected to play a major role in the competitive transportation industries of tomorrow, i.e., in the design of aircraft and spacecraft, of high speed trains, boats, and automobiles. All of these vehicles require maximum performance at minimum weight to keep fuel consumption low and conserve resources. Here, MDO can deliver mathematically based design tools to create systems with optimum performance subject to the constraints of disciplines such as structures, aerodynamics, controls, etc. Although some applications of MDO are beginning to surface, the key to a widespread use of this technology lies in the improvement of its efficiency. This aspect is investigated here for the MDO subset of structural optimization, i.e., for the weight minimization of a given structure under size, strength, and displacement constraints. Specifically, finite element based multilevel optimization of structures (here, statically indeterminate trusses and beams for proof of concept) is performed. In the system level optimization, the design variables are the coefficients of assumed displacement functions, and the load unbalance resulting from the solution of the stiffness equations is minimized. Constraints are placed on the deflection amplitudes and the weight of the structure. In the subsystems level optimizations, the weight of each element is minimized under the action of stress constraints, with the cross sectional dimensions as design variables. This approach is expected to prove very efficient, especially for complex structures, since the design task is broken down into a large number of small and efficiently handled subtasks, each with only a small number of variables. This partitioning will also allow for the use of parallel computing, first, by sending the system and subsystems level computations to two different processors, ultimately, by performing all subsystems level optimizations in a massively parallel manner on separate

  14. Protective/conductive coatings for ferritic stainless steel interconnects used in solid oxide fuel cells

    NASA Astrophysics Data System (ADS)

    Shaigan, Nima

    Ferritic stainless steels are the most commonly used materials for solid oxide fuel cell interconnect application. Although these alloys may meet the criteria for interconnect application for short periods of service, their application is limited for long-term use (i.e., 40,000 h) due to poor oxidation behaviour that results in a rapid increase in contact resistance. In addition, volatile Cr species migrating from the chromia scale can poison the cathode resulting in a considerable drop in performance of the cell. Coatings and surface modifications have been developed in order to mitigate the abovementioned problems. In this study, composite electrodeposition of reactive element containing particles in a metal matrix was considered as a solution to the interconnect problems. Nickel and Co were used as the metal matrix and LaCrO3 particles as the reactive element containing particles. The role of the particles was to improve the oxidation resistance and oxide scale adhesion, while the role of Ni or Co was to provide a matrix for embedding of the particles. Also, oxidation of the Ni or Co matrix led to the formation of conductive oxides. Moreover, as another part of this study, the effect of substrate composition on performance of steel interconnects was investigated. Numerous experimental techniques were used to study and characterise the oxidation behaviour of the composite coatings, as well as the metal-oxide scale interface properties. Scanning electron microscopy/energy dispersive X-ray spectroscopy (SEM/EDX), as well as surface analysis techniques including Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectroscopy (SIMS), were used for the purpose of characterization. The substrate used for coating was AISI-SAE 430 stainless steel that is considered as a typical, formerly used interconnect material. Also, for the purpose of the metal-oxide scale interfacial study, ZMG232 stainless steel that is a specially

  15. Towards energy-efficient photonic interconnects

    NASA Astrophysics Data System (ADS)

    Demir, Yigit; Hardavellas, Nikos

    2015-03-01

    Silicon photonics have emerged as a promising solution to meet the growing demand for high-bandwidth, low-latency, and energy-efficient on-chip and off-chip communication in many-core processors. However, current silicon-photonic interconnect designs for many-core processors waste a significant amount of power because (a) lasers are always on, even during periods of interconnect inactivity, and (b) microring resonators employ heaters which consume a significant amount of power just to overcome thermal variations and maintain communication on the photonic links, especially in a 3D-stacked design. The problem of high laser power consumption is particularly important as lasers typically have very low energy efficiency, and photonic interconnects often remain underutilized both in scientific computing (compute-intensive execution phases underutilize the interconnect), and in server computing (servers in Google-scale datacenters have a typical utilization of less than 30%). We address the high laser power consumption by proposing EcoLaser+, which is a laser control scheme that saves energy by predicting the interconnect activity and opportunistically turning the on-chip laser off when possible, and also by scaling the width of the communication link based on a runtime prediction of the expected message length. Our laser control scheme can save up to 62 - 92% of the laser energy, and improve the energy efficiency of a manycore processor with negligible performance penalty. We address the high trimming (heating) power consumption of the microrings by proposing insulation methods that reduce the impact of localized heating induced by highly-active components on the 3D-stacked logic die.

  16. Interconnect assembly for an electronic assembly and assembly method therefor

    DOEpatents

    Gerbsch, Erich William

    2003-06-10

    An interconnect assembly and method for a semiconductor device, in which the interconnect assembly can be used in lieu of wirebond connections to form an electronic assembly. The interconnect assembly includes first and second interconnect members. The first interconnect member has a first surface with a first contact and a second surface with a second contact electrically connected to the first contact, while the second interconnect member has a flexible finger contacting the second contact of the first interconnect member. The first interconnect member is adapted to be aligned and registered with a semiconductor device having a contact on a first surface thereof, so that the first contact of the first interconnect member electrically contacts the contact of the semiconductor device. Consequently, the assembly method does not require any wirebonds, but instead merely entails aligning and registering the first interconnect member with the semiconductor device so that the contacts of the first interconnect member and the semiconductor device make electrically contact, and then contacting the second contact of the first interconnect member with the flexible finger of the second interconnect member.

  17. Hierarchical optical ring interconnection (HORN): scalable interconnection network for multiprocessors and multicomputers.

    PubMed

    Louri, A; Gupta, R

    1997-01-10

    A new interconnection network for massively parallel computing is introduced. This network is called a hierarchal optical ring interconnection (HORN). The HORN consists of a single-hop, scalable, constant-degree, strictly nonblocking, fault-tolerant interconnection topology that uses wavelength-division multiple access to provide better utilization of the terahertz bandwidth offered by optics. The proposed optical network integrates the attractive features of hierarchical ring interconnections, e.g., a simple node interface, a constant node degree, better support for the locality of reference, and fault tolerance, with the advantages of optics. The HORN topology is presented, its architectural properties are analyzed, and an optical design methodology for it is described. Furthermore, a brief feasibility study of the HORN is conducted. The study shows that the topology is highly amenable to optical implementation with commercially available optical elements.

  18. Mechanical characterization of oxide coating-interconnect interfaces for solid oxide fuel cells

    NASA Astrophysics Data System (ADS)

    Akanda, Sajedur R.; Walter, Mark E.; Kidner, Neil J.; Seabaugh, Matthew M.

    2012-07-01

    This paper reports on the characterization of interfaces between oxide coatings and metallic interconnects that are used in planar solid oxide fuel cells. With the reduction of operating temperatures to 800 °C, it is possible to replace ceramic interconnects with less expensive stainless steels. However, when incorporating chromia-forming metallic interconnects, steps must be taken to inhibit chromium poisoning. One approach to prevent chromium poisoning, is to deposit dense, protective coatings, such as manganese cobalt spinel oxide (MCO). The brittle nature of MCO makes it susceptible to damage under mechanical and thermal stresses during operation. A four point bend experiment is designed to assess the strength and adhesion of reduced and oxidized coatings deposited on SS441 or Crofer interconnects. Resulting tensile cracking patterns on the convex side of bend specimen are used to quantify the interfacial shear strength with a shear lag model. Using energy based fracture mechanics, interfacial fracture energy is calculated from the strain at the onset of coating spallation. Scanning electron microscopy images of the cracked coating surfaces are processed to analyze the failure mechanisms, crack spacing and spalled areas. At 3% strain, the weakest interface is found in the Crofer system with the oxidized coating.

  19. FUNDAMENTAL STUDIES OF THE DURABILITY OF MATERIALS FOR INTERCONNECTS IN SOLID OXIDE FUEL CELLS

    SciTech Connect

    Frederick S. Pettit; Gerald H. Meier

    2003-06-30

    This report describes the result of the first eight months of effort on a project directed at improving metallic interconnect materials for solid oxide fuel cells (SOFCs). The results include cyclic oxidation studies of a group of ferritic alloys, which are candidate interconnect materials. The exposures have been carried out in simulated fuel cell atmospheres. The oxidation morphologies have been characterized and the ASR has been measured for the oxide scales. The effect of fuel cell electric current density on chromia growth rates has been considered The thermomechanical behavior of the scales has been investigated by stress measurements using x-ray diffraction and interfacial fracture toughness measurements using indentation. The ultimate goal of this thrust is to use knowledge of changes in oxide thickness, stress and adhesion to develop accelerated testing methods for evaluating SOFC interconnect alloys. Finally a theoretical assessment of the potential for use of ''new'' metallic materials as interconnect materials has been conducted and is presented in this report. Alloys being considered include materials based on pure nickel, materials based on the ''Invar'' concept, and coated materials to optimize properties in both the anode and cathode gases.

  20. Multilevel Design Efficiency in Educational Effectiveness Research

    ERIC Educational Resources Information Center

    Cools, Wilfried; De Fraine, Bieke; Van den Noortgate, Wim; Onghena, Patrick

    2009-01-01

    In educational effectiveness research, multilevel data analyses are often used because research units (most frequently, pupils or teachers) are studied that are nested in groups (schools and classes). This hierarchical data structure complicates designing the study because the structure has to be taken into account when approximating the accuracy…

  1. Engineering applications of heuristic multilevel optimization methods

    NASA Technical Reports Server (NTRS)

    Barthelemy, Jean-Francois M.

    1988-01-01

    Some engineering applications of heuristic multilevel optimization methods are presented and the discussion focuses on the dependency matrix that indicates the relationship between problem functions and variables. Coordination of the subproblem optimizations is shown to be typically achieved through the use of exact or approximate sensitivity analysis. Areas for further development are identified.

  2. Engineering applications of heuristic multilevel optimization methods

    NASA Technical Reports Server (NTRS)

    Barthelemy, Jean-Francois M.

    1989-01-01

    Some engineering applications of heuristic multilevel optimization methods are presented and the discussion focuses on the dependency matrix that indicates the relationship between problem functions and variables. Coordination of the subproblem optimizations is shown to be typically achieved through the use of exact or approximate sensitivity analysis. Areas for further development are identified.

  3. Efficiently Exploring Multilevel Data with Recursive Partitioning

    ERIC Educational Resources Information Center

    Martin, Daniel P.; von Oertzen, Timo; Rimm-Kaufman, Sara E.

    2015-01-01

    There is an increasing number of datasets with many participants, variables, or both, in education and other fields that often deal with large, multilevel data structures. Once initial confirmatory hypotheses are exhausted, it can be difficult to determine how best to explore the dataset to discover hidden relationships that could help to inform…

  4. The Economic Cost of Homosexuality: Multilevel Analyses

    ERIC Educational Resources Information Center

    Baumle, Amanda K.; Poston, Dudley, Jr.

    2011-01-01

    This article builds on earlier studies that have examined "the economic cost of homosexuality," by using data from the 2000 U.S. Census and by employing multilevel analyses. Our findings indicate that partnered gay men experience a 12.5 percent earnings penalty compared to married heterosexual men, and a statistically insignificant earnings…

  5. A Practical Guide to Multilevel Modeling

    ERIC Educational Resources Information Center

    Peugh, James L.

    2010-01-01

    Collecting data from students within classrooms or schools, and collecting data from students on multiple occasions over time, are two common sampling methods used in educational research that often require multilevel modeling (MLM) data analysis techniques to avoid Type-1 errors. The purpose of this article is to clarify the seven major steps…

  6. Using Multilevel Modeling in Counseling Research

    ERIC Educational Resources Information Center

    Lynch, Martin F.

    2012-01-01

    This conceptual and practical overview of multilevel modeling (MLM) for researchers in counseling and development provides guidelines on setting up SPSS to perform MLM and an example of how to present the findings. It also provides a discussion on how counseling and developmental researchers can use MLM to address their own research questions.…

  7. Suppressor Variables and Multilevel Mixture Modelling

    ERIC Educational Resources Information Center

    Darmawan, I Gusti Ngurah; Keeves, John P.

    2006-01-01

    A major issue in educational research involves taking into consideration the multilevel nature of the data. Since the late 1980s, attempts have been made to model social science data that conform to a nested structure. Among other models, two-level structural equation modelling or two-level path modelling and hierarchical linear modelling are two…

  8. Single-Level and Multilevel Mediation Analysis

    ERIC Educational Resources Information Center

    Tofighi, Davood; Thoemmes, Felix

    2014-01-01

    Mediation analysis is a statistical approach used to examine how the effect of an independent variable on an outcome is transmitted through an intervening variable (mediator). In this article, we provide a gentle introduction to single-level and multilevel mediation analyses. Using single-level data, we demonstrate an application of structural…

  9. High temperature solid electrolyte fuel cell configurations and interconnections

    DOEpatents

    Isenberg, Arnold O.

    1984-01-01

    High temperature fuel cell configurations and interconnections are made including annular cells having a solid electrolyte sandwiched between thin film electrodes. The cells are electrically interconnected along an elongated axial outer surface.

  10. National Offshore Wind Energy Grid Interconnection Study Executive Summary

    SciTech Connect

    Daniel, John P.; Liu, Shu; Ibanez, Eduardo; Pennock, Ken; Reed, Gregory; Hanes, Spencer

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States.

  11. National Offshore Wind Energy Grid Interconnection Study Full Report

    SciTech Connect

    Daniel, John P.; Liu, Shu; Ibanez, Eduardo; Pennock, Ken; Reed, Gregory; Hanes, Spencer

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States.

  12. Integrated silicon photonic interconnect with surface-normal optical interface

    NASA Astrophysics Data System (ADS)

    Zhang, Zanyun; Huang, Beiju; Zhang, Zan; Cheng, Chuantong; Liu, Hongwei; Li, Hongqiang; Chen, Hongda

    2016-05-01

    An integrated silicon photonic interconnect with surface-normal optical interface is demonstrated by connecting a bidirectional grating based E-O modulator and a germanium waveguide photodetector. To investigate this photonic interconnect, both static and dynamic performance of the discrete devices are characterized respectively. Based on the characterization work, data transmission experiment is carried out for the photonic interconnect. Eye diagram results indicate the photonic interconnect can operate up to 7 Gb/s.

  13. High-Temperature Stable Au-Sn and Cu-Sn Interconnects for 3D Stacked Applications

    NASA Astrophysics Data System (ADS)

    Hoivik, Nils; Liu, He; Wang, Kaiying; Salomonsen, Guttorm; Aasmundtveit, Knut

    The desire to directly integrate MEMS with ASICs in a 3D stack is the main motivation behind the development of a bonding technology suitable for both interconnects and seal rings. SLID (Solid-Liquid Inter-Diffusion) bonding processes based upon Au-Sn and Cu-Sn (high melting point metal/low melting point metal) are therefore investigated. SLID bonding allows for repeated high temperature processing cycles as in the case for chip stacking, or for interconnections and seal rings bonded at different process steps. This work describes results obtained for fluxless bonding of SLID Au-Sn and Cu-Sn interconnects and seal rings, where a thin layer of intermetallic compound (IMC) on the Cu or Sn surface protects the metal surfaces from oxidizing at elevated temperatures. To evaluate the bond strength, test dies bonded at various temperatures were subjected to SEM/EDX bond line analysis, and shear testing at both room and elevated temperatures. Au-Sn samples bonded at 280°C re-melt at elevated temperatures; whereas samples bonded at 350°C remain intact past the initial bonding temperature. For the Cu-Sn samples, the measured shear strength is comparable to conventionally bonded interconnects. In order to remain within the uniformity requirements for SLID bonding, the pattern density of electroplated interconnects and seal rings require an optimized layout which can be calculated based upon the effective area.

  14. Real-Time Reconfigurable Interconnections for Parallel Optical Processing

    NASA Astrophysics Data System (ADS)

    McArdle, Neil; Taghizadeh, Mohammad R.

    1995-06-01

    In this letter we describe the advantages of a dynamic optical interconnection system for parallel information processing applications. The system is based on a liquid crystal television which acts as a binary phase-only spatial light modulator. We describe example algorithms where reconfigurable interconnects would be useful and present results of several interconnection topologies which have been implemented.

  15. 14 CFR 23.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 14 Aeronautics and Space 1 2012-01-01 2012-01-01 false Flow between interconnected tanks. 23.957... Fuel System § 23.957 Flow between interconnected tanks. (a) It must be impossible, in a gravity feed system with interconnected tank outlets, for enough fuel to flow between the tanks to cause an...

  16. 14 CFR 29.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 14 Aeronautics and Space 1 2011-01-01 2011-01-01 false Flow between interconnected tanks. 29.957... AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Powerplant Fuel System § 29.957 Flow between interconnected tanks. (a) Where tank outlets are interconnected and allow fuel to flow...

  17. 14 CFR 23.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Flow between interconnected tanks. 23.957... Fuel System § 23.957 Flow between interconnected tanks. (a) It must be impossible, in a gravity feed system with interconnected tank outlets, for enough fuel to flow between the tanks to cause an...

  18. 14 CFR 29.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 14 Aeronautics and Space 1 2012-01-01 2012-01-01 false Flow between interconnected tanks. 29.957... AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Powerplant Fuel System § 29.957 Flow between interconnected tanks. (a) Where tank outlets are interconnected and allow fuel to flow...

  19. 14 CFR 29.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Flow between interconnected tanks. 29.957... AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Powerplant Fuel System § 29.957 Flow between interconnected tanks. (a) Where tank outlets are interconnected and allow fuel to flow...

  20. 14 CFR 29.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 14 Aeronautics and Space 1 2014-01-01 2014-01-01 false Flow between interconnected tanks. 29.957... AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Powerplant Fuel System § 29.957 Flow between interconnected tanks. (a) Where tank outlets are interconnected and allow fuel to flow...

  1. 14 CFR 23.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 14 Aeronautics and Space 1 2014-01-01 2014-01-01 false Flow between interconnected tanks. 23.957... Fuel System § 23.957 Flow between interconnected tanks. (a) It must be impossible, in a gravity feed system with interconnected tank outlets, for enough fuel to flow between the tanks to cause an...

  2. 14 CFR 23.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 14 Aeronautics and Space 1 2011-01-01 2011-01-01 false Flow between interconnected tanks. 23.957... Fuel System § 23.957 Flow between interconnected tanks. (a) It must be impossible, in a gravity feed system with interconnected tank outlets, for enough fuel to flow between the tanks to cause an...

  3. Optical interconnects for multiprocessors in computer backplane

    NASA Astrophysics Data System (ADS)

    Kim, Tae-Jin; Tu, Kun-Yii; Ramsey, Darrell; Oh, Tchang-Hun; Kostuk, Raymond K.

    1995-04-01

    Optical interconnects have potential advantage over electrical methods at the backplane level. In this paper we present a free-space optical connection cube for backplane interconnect applications. The connection cube has a symmetric structure which reduces skew between boards. It can be expanded into a 3-dimensional configuration for parallel communication using vertical-cavity surface-emitting laser (VCSEL) and receiver arrays. Fan-out and fan-in of propagation beams for the connection cube are realized using volume holographic optical elements formed in dichromated gelatin (DCG) emulsion. A four-port communication system has been demonstrated using the connection cube and tested at 500 MHz. In this paper, advantages and detailed implementation of the free-space optical connection cube are presented. Design considerations for fan-out/in holographic gratings and alignment tolerances for the connection cube are discussed. Characteristics of the connection cube are also presented.

  4. Interconnection of bundled solid oxide fuel cells

    DOEpatents

    Brown, Michael; Bessette, II, Norman F; Litka, Anthony F; Schmidt, Douglas S

    2014-01-14

    A system and method for electrically interconnecting a plurality of fuel cells to provide dense packing of the fuel cells. Each one of the plurality of fuel cells has a plurality of discrete electrical connection points along an outer surface. Electrical connections are made directly between the discrete electrical connection points of adjacent fuel cells so that the fuel cells can be packed more densely. Fuel cells have at least one outer electrode and at least one discrete interconnection to an inner electrode, wherein the outer electrode is one of a cathode and and anode and wherein the inner electrode is the other of the cathode and the anode. In tubular solid oxide fuel cells the discrete electrical connection points are spaced along the length of the fuel cell.

  5. Epidemic spread on interconnected metapopulation networks.

    PubMed

    Wang, Bing; Tanaka, Gouhei; Suzuki, Hideyuki; Aihara, Kazuyuki

    2014-09-01

    Numerous real-world networks have been observed to interact with each other, resulting in interconnected networks that exhibit diverse, nontrivial behavior with dynamical processes. Here we investigate epidemic spreading on interconnected networks at the level of metapopulation. Through a mean-field approximation for a metapopulation model, we find that both the interaction network topology and the mobility probabilities between subnetworks jointly influence the epidemic spread. Depending on the interaction between subnetworks, proper controls of mobility can efficiently mitigate epidemics, whereas an extremely biased mobility to one subnetwork will typically cause a severe outbreak and promote the epidemic spreading. Our analysis provides a basic framework for better understanding of epidemic behavior in related transportation systems as well as for better control of epidemics by guiding human mobility patterns.

  6. Development of Interconnect Technologies for Particle Detectors

    SciTech Connect

    Tripathi, Mani

    2015-01-29

    This final report covers the three years of this grant, for the funding period 9/1/2010 - 8/31/2013. The project consisted of generic detector R&D work at UC Davis, with an emphasis on developing interconnect technologies for applications in HEP. Much of the work is done at our Facility for Interconnect Technologies (FIT) at UC Davis. FIT was established using ARRA funds, with further studies supported by this grant. Besides generic R&D work at UC Davis, FIT is engaged in providing bump bonding help to several DOE supported detector R&D efforts. Some of the developmental work was also supported by funding from other sources: continuing CMS project funds and the Linear Collider R&D funds. The latter program is now terminated. The three year program saw a good deal of progress on several fronts, which are reported here.

  7. Architecture for on-die interconnect

    DOEpatents

    Khare, Surhud; More, Ankit; Somasekhar, Dinesh; Dunning, David S.

    2016-03-15

    In an embodiment, an apparatus includes: a plurality of islands configured on a semiconductor die, each of the plurality of islands having a plurality of cores; and a plurality of network switches configured on the semiconductor die and each associated with one of the plurality of islands, where each network switch includes a plurality of output ports, a first set of the output ports are each to couple to the associated network switch of an island via a point-to-point interconnect and a second set of the output ports are each to couple to the associated network switches of a plurality of islands via a point-to-multipoint interconnect. Other embodiments are described and claimed.

  8. Release Resistant Electrical Interconnections For Mems Devices

    DOEpatents

    Peterson, Kenneth A.; Garrett, Stephen E.; Reber, Cathleen A.

    2005-02-22

    A release resistant electrical interconnection comprising a gold-based electrical conductor compression bonded directly to a highly-doped polysilicon bonding pad in a MEMS, IMEMS, or MOEMS device, without using any intermediate layers of aluminum, titanium, solder, or conductive adhesive disposed in-between the conductor and polysilicon pad. After the initial compression bond has been formed, subsequent heat treatment of the joint above 363 C creates a liquid eutectic phase at the bondline comprising gold plus approximately 3 wt % silicon, which, upon re-solidification, significantly improves the bond strength by reforming and enhancing the initial bond. This type of electrical interconnection is resistant to chemical attack from acids used for releasing MEMS elements (HF, HCL), thereby enabling the use of a "package-first, release-second" sequence for fabricating MEMS devices. Likewise, the bond strength of an Au--Ge compression bond may be increased by forming a transient liquid eutectic phase comprising Au-12 wt % Ge.

  9. A covariance analysis algorithm for interconnected systems

    NASA Technical Reports Server (NTRS)

    Cheng, Victor H. L.; Curley, Robert D.; Lin, Ching-An

    1987-01-01

    A covariance analysis algorithm for propagation of signal statistics in arbitrarily interconnected nonlinear systems is presented which is applied to six-degree-of-freedom systems. The algorithm uses statistical linearization theory to linearize the nonlinear subsystems, and the resulting linearized subsystems are considered in the original interconnection framework for propagation of the signal statistics. Some nonlinearities commonly encountered in six-degree-of-freedom space-vehicle models are referred to in order to illustrate the limitations of this method, along with problems not encountered in standard deterministic simulation analysis. Moreover, the performance of the algorithm shall be numerically exhibited by comparing results using such techniques to Monte Carlo analysis results, both applied to a simple two-dimensional space-intercept problem.

  10. Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

    SciTech Connect

    Tamura, Nobumichi; Chen, Kai; Kunz, Martin

    2009-12-01

    Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature.

  11. Active holographic interconnects for interfacing volume storage

    NASA Astrophysics Data System (ADS)

    Domash, Lawrence H.; Schwartz, Jay R.; Nelson, Arthur R.; Levin, Philip S.

    1992-04-01

    In order to achieve the promise of terabit/cm3 data storage capacity for volume holographic optical memory, two technological challenges must be met. Satisfactory storage materials must be developed and the input/output architectures able to match their capacity with corresponding data access rates must also be designed. To date the materials problem has received more attention than devices and architectures for access and addressing. Two philosophies of parallel data access to 3-D storage have been discussed. The bit-oriented approach, represented by recent work on two-photon memories, attempts to store bits at local sites within a volume without affecting neighboring bits. High speed acousto-optic or electro- optic scanners together with dynamically focused lenses not presently available would be required. The second philosophy is that volume optical storage is essentially holographic in nature, and that each data write or read is to be distributed throughout the material volume on the basis of angle multiplexing or other schemes consistent with the principles of holography. The requirements for free space optical interconnects for digital computers and fiber optic network switching interfaces are also closely related to this class of devices. Interconnects, beamlet generators, angle multiplexers, scanners, fiber optic switches, and dynamic lenses are all devices which may be implemented by holographic or microdiffractive devices of various kinds, which we shall refer to collectively as holographic interconnect devices. At present, holographic interconnect devices are either fixed holograms or spatial light modulators. Optically or computer generated holograms (submicron resolution, 2-D or 3-D, encoding 1013 bits, nearly 100 diffraction efficiency) can implement sophisticated mathematical design principles, but of course once fabricated they cannot be changed. Spatial light modulators offer high speed programmability but have limited resolution (512 X 512 pixels

  12. Hydraulically interconnected vehicle suspension: background and modelling

    NASA Astrophysics Data System (ADS)

    Zhang, Nong; Smith, Wade A.; Jeyakumaran, Jeku

    2010-01-01

    This paper presents a novel approach for the frequency domain analysis of a vehicle fitted with a general hydraulically interconnected suspension (HIS) system. Ideally, interconnected suspensions have the capability, unique among passive systems, to provide stiffness and damping characteristics dependent on the all-wheel suspension mode in operation. A basic, lumped-mass, four-degree-of-freedom half-car model is used to illustrate the proposed methodology. The mechanical-fluid boundary condition in the double-acting cylinders is modelled as an external force on the mechanical system and a moving boundary on the fluid system. The fluid system itself is modelled using the hydraulic impedance method, in which the relationships between the dynamic fluid states, i.e. pressures and flows, at the extremities of a single fluid circuit are determined by the transfer matrix method. A set of coupled, frequency-dependent equations, which govern the dynamics of the integrated half-car system, are then derived and the application of these equations to both free and forced vibration analysis is explained. The fluid system impedance matrix for the two general wheel-pair interconnection types-anti-synchronous and anti-oppositional-is also given. To further outline the application of the proposed methodology, the paper finishes with an example using a typical anti-roll HIS system. The integrated half-car system's free vibration solutions and frequency response functions are then obtained and discussed in some detail. The presented approach provides a scientific basis for investigating the dynamic characteristics of HIS-equipped vehicles, and the results offer further confirmation that interconnected suspension schemes can provide, at least to some extent, individual control of modal stiffness and damping characteristics.

  13. Bioactive macroporous titanium implants highly interconnected.

    PubMed

    Caparrós, Cristina; Ortiz-Hernandez, Mónica; Molmeneu, Meritxell; Punset, Miguel; Calero, José Antonio; Aparicio, Conrado; Fernández-Fairén, Mariano; Perez, Román; Gil, Francisco Javier

    2016-10-01

    Intervertebral implants should be designed with low load requirements, high friction coefficient and low elastic modulus in order to avoid the stress shielding effect on bone. Furthermore, the presence of a highly interconnected porous structure allows stimulating bone in-growth and enhancing implant-bone fixation. The aim of this study was to obtain bioactive porous titanium implants with highly interconnected pores with a total porosity of approximately 57 %. Porous Titanium implants were produced by powder sintering route using the space holder technique with a binder phase and were then evaluated in an in vivo study. The size of the interconnection diameter between the macropores was about 210 μm in order to guarantee bone in-growth through osteblastic cell penetration. Surface roughness and mechanical properties were analyzed. Stiffness was reduced as a result of the powder sintering technique which allowed the formation of a porous network. Compression and fatigue tests exhibited suitable properties in order to guarantee a proper compromise between mechanical properties and pore interconnectivity. Bioactivity treatment effect in novel sintered porous titanium materials was studied by thermo-chemical treatments and were compared with the same material that had undergone different bioactive treatments. Bioactive thermo-chemical treatment was confirmed by the presence of sodium titanates on the surface of the implants as well as inside the porous network. Raman spectroscopy results suggested that the identified titanate structures would enhance in vivo apatite formation by promoting ion exchange for the apatite formation process. In vivo results demonstrated that the bioactive titanium achieved over 75 % tissue colonization compared to the 40 % value for the untreated titanium. PMID:27582071

  14. Stackable Electronic Computer Modules And Interconnections

    NASA Technical Reports Server (NTRS)

    Bolotin, Gary S.

    1996-01-01

    Design concept for multiprocessor computer system calls for digital electronic processing circuits of various functionalities contained within identically shaped and sized regular polygonal modules interconnected and stacked by use of rings around edges. Rings contain wide-band bus circuits configured to provide connections to adjacent modules in same layer of stack and/or to modules in different layers. Provides flexibility of configuration to implement any of large variety of designs.

  15. Bioactive macroporous titanium implants highly interconnected.

    PubMed

    Caparrós, Cristina; Ortiz-Hernandez, Mónica; Molmeneu, Meritxell; Punset, Miguel; Calero, José Antonio; Aparicio, Conrado; Fernández-Fairén, Mariano; Perez, Román; Gil, Francisco Javier

    2016-10-01

    Intervertebral implants should be designed with low load requirements, high friction coefficient and low elastic modulus in order to avoid the stress shielding effect on bone. Furthermore, the presence of a highly interconnected porous structure allows stimulating bone in-growth and enhancing implant-bone fixation. The aim of this study was to obtain bioactive porous titanium implants with highly interconnected pores with a total porosity of approximately 57 %. Porous Titanium implants were produced by powder sintering route using the space holder technique with a binder phase and were then evaluated in an in vivo study. The size of the interconnection diameter between the macropores was about 210 μm in order to guarantee bone in-growth through osteblastic cell penetration. Surface roughness and mechanical properties were analyzed. Stiffness was reduced as a result of the powder sintering technique which allowed the formation of a porous network. Compression and fatigue tests exhibited suitable properties in order to guarantee a proper compromise between mechanical properties and pore interconnectivity. Bioactivity treatment effect in novel sintered porous titanium materials was studied by thermo-chemical treatments and were compared with the same material that had undergone different bioactive treatments. Bioactive thermo-chemical treatment was confirmed by the presence of sodium titanates on the surface of the implants as well as inside the porous network. Raman spectroscopy results suggested that the identified titanate structures would enhance in vivo apatite formation by promoting ion exchange for the apatite formation process. In vivo results demonstrated that the bioactive titanium achieved over 75 % tissue colonization compared to the 40 % value for the untreated titanium.

  16. Implementation of interconnect simulation tools in spice

    NASA Technical Reports Server (NTRS)

    Satsangi, H.; Schutt-Aine, J. E.

    1993-01-01

    Accurate computer simulation of high speed digital computer circuits and communication circuits requires a multimode approach to simulate both the devices and the interconnects between devices. Classical circuit analysis algorithms (lumped parameter) are needed for circuit devices and the network formed by the interconnected devices. The interconnects, however, have to be modeled as transmission lines which incorporate electromagnetic field analysis. An approach to writing a multimode simulator is to take an existing software package which performs either lumped parameter analysis or field analysis and add the missing type of analysis routines to the package. In this work a traditionally lumped parameter simulator, SPICE, is modified so that it will perform lossy transmission line analysis using a different model approach. Modifying SPICE3E2 or any other large software package is not a trivial task. An understanding of the programming conventions used, simulation software, and simulation algorithms is required. This thesis was written to clarify the procedure for installing a device into SPICE3E2. The installation of three devices is documented and the installations of the first two provide a foundation for installation of the lossy line which is the third device. The details of discussions are specific to SPICE, but the concepts will be helpful when performing installations into other circuit analysis packages.

  17. Optimizing Baseload Power of Interconnected Wind Farms

    NASA Astrophysics Data System (ADS)

    Kobrin, B. H.

    2010-12-01

    Interconnecting wind farms has been proposed as a way to reduce the natural unreliability of wind power caused by the intermittency of winds. In a previous study, the benefits of interconnecting up to 19 sites in the Midwestern United States were evaluated with the assumption that the same number of turbines would be installed at each site. The goal of this study was to avoid this assumption and examine the advantages of optimizing the ratio of turbines at each site. An optimization algorithm based on the gradient method was used to maximize the baseload power, or guaranteed power 87.5% of the year, using hourly wind speed data for the same 19 sites. The result was a significant improvement in the reliability of the array, increasing the baseload power by 38% compared to the array with equally-weighted sites. Further analysis showed that the turbines were generally distributed according to the average wind power at each site and the wind correlation among sites. In addition to optimizing the average baseload of the array, this study examined the benefits of optimizing the baseload for peak usage time (between noon and 7 p.m), and thus a simplified model was created to analyze how interconnecting wind farms could increase correlation with energy consumption. Optimization for peak usage hours, however, provided no additional benefit over the original optimized array because the variation of average hourly wind speeds was well-correlated among the sites.

  18. Integrated nanophotonic devices for optical interconnections

    NASA Astrophysics Data System (ADS)

    Huang, Yidong; Feng, Xue; Cui, Kaiyu; Li, Yongzhuo; Wang, Yu

    2016-03-01

    Nanostructure is an effective solution for realizing optoelectronic devices with compact size and high performances simultaneously. This paper reports our research progress on integrated nanophotonic devices for optical interconnections. We proposed a parent-sub micro ring structure for optical add-drop multiplexer (OADM) with compact footprint, large free spectral range, and uniform channel spacing. All eight channels can be multiplexed and de-multiplexed with 2.6 dB drop loss, 0.36 nm bandwidth (>40 GHz), -20 dB channel crosstalk, and high thermal tuning efficiency of 0.15 nm/mW. A novel principle of optical switch was proposed and demonstrated based on the coupling of the defect modes in photonic crystal waveguide. Switching functionality with bandwidth up to 24 nm and extinction ratio in excess of 15 dB over the entire bandwidth was achieved, while the footprint was only 8 μm×17.6 μm. We proposed an optical orbital angular momentum (OAM) coding and decoding method to increase the data-carrying capacity of wireless optical interconnect. An integrated OAM emitter, where the topological charge can be continuously varied from -4 to 4 was realized. Also we studied ultrafast modulated nLED as the integrated light source for optical interconnections using a nanobeam cavity with stagger holes.

  19. Modeling and synthesis of multicomputer interconnection networks

    NASA Technical Reports Server (NTRS)

    Standley, Hilda M.; Auxter, D. Steve

    1990-01-01

    The type of interconnection network employed has a profound effect on the performance of a multicomputer and multiprocessor design. Adequate models are needed to aid in the design and development of interconnection networks. A novel modeling approach using statistical and optimization techniques is described. This method represents an attempt to compare diverse interconnection network designs in a way that allows not only the best of existing designs to be identified but to suggest other, perhaps hybrid, networks that may offer better performance. Stepwise linear regression is used to develop a polynomial surface representation of performance in a (k+1) space with a total of k quantitative and qualitative independent variables describing graph-theoretic characteristics such as size, average degree, diameter, radius, girth, node-connectivity, edge-connectivity, minimum dominating set size, and maximum number of prime node and edge cutsets. Dependent variables used to measure performance are average message delay and the ratio of message completion rate to network connection cost. Response Surface Methodology (RSM) optimizes a response variable from a polynomial function of several independent variables. Steepest ascent path may also be used to approach optimum points.

  20. Dimensioning of nearby substations interconnected ground system

    SciTech Connect

    Sobral, S.T. ); Costa, V.S. ); Campos, M.S.; Goldman, B. ); Mukhedkar, D. )

    1988-10-01

    This paper deals with the ground mat dimensioning of two or more neighbor interconnected substations, a situation that is very common in the Electrical Industry. The paper recalls that the external ground circuits connected to the ground grid of each substation can drastically reduce the percentage of total ground current injected into the soil through the mat (from 40% up to 2% of the total fault current). The paper presents a set of specific calculation procedures to deal with nearby interconnected ground mats. These procedures correspond to a particular illustration of the general ''Decoupled Method'' (3,4,5), showing how to apply its 8 sequencial steps to solve this type of circuit. The paper shows that the electric neighborhood of nearby substations depends on the ''Space Constant'' (or ''Characteristic Length'') of the ground circuits interconnecting them such as transmission line ground-wires, power cable sheaths, etc. This paper complements also Ref. (3,4), introducing the complete derivation of useful expressions used to solve lumped parameter ladder circuits of any size (from one pi to an infinite number of pis). The derivation of these expressions also used in (3,4) were not included in these References due to lack of space. In the paper it is also shown a simple procedure to determine the suitable number of ACSR ground-wire spans near a substation necessary to allow a reduction of the ground grid conductor extension.

  1. Reconfigurable Optical Interconnections Using Dynamic Optoelectronic Holograms

    NASA Astrophysics Data System (ADS)

    Schulze, Elmar

    1988-04-01

    Increasing complexity and processing speed of electronic circuits and a high device density have led to serious problems in electrical interconnections. Their limitations arise from their signal transmission capacity. power consumption. crosstalk. and reliability. Optical links may solve such problems by offering high data rates of several gigabits per second. large fanouts of up to 100 loads. good reliability and less power expenditure. Optical fibers, integrated optical waveguides or free-space transmission links may be applicable. For the free-space links, lenses. mirrors and holograms can be used to guide the light waves. In this paper, reconfigurable optical interconnection schemes are proposed and described which are based on optoelectronic holograms. Their interference patterns can be changed dynamically. To establish connections as free-space links, the light beams emitted from even hundreds of light sources are imaged onto an array of small dynamic holograms. Their interference patterns are optically and electronically controllable. These holograms diffract and focus each of the incident light beams individually onto the receiving photo-diodes. By changing the hologram interference patterns dynamically. an optical switch is obtained. It renders the establishment of reconfigurable optical interconnections. As optoelectronic holograms very-high-resolution spatial light modulators are proposed.

  2. Growth and characterization of high-density mats of single-walled carbon nanotubes for interconnects

    SciTech Connect

    Robertson, J.; Zhong, G.; Telg, H.; Thomsen, C.; Warner, J. H.; Briggs, G. A. D.; Dettlaff-Weglikowska, U.; Roth, S.

    2008-10-20

    We grow high-density, aligned single wall carbon nanotube mats for use as interconnects in integrated circuits by remote plasma chemical vapor deposition from a Fe-Al{sub 2}O{sub 3} thin film catalyst. We carry out extensive Raman characterization of the resulting mats, and find that this catalyst system gives rise to a broad range of nanotube diameters, with no preferential selectivity of semiconducting tubes, but with at least 1/3 of metallic tubes.

  3. Multilevel integration of patternable low-κ material into advanced Cu BEOL

    NASA Astrophysics Data System (ADS)

    Lin, Qinghuang; Chen, S. T.; Nelson, A.; Brock, P.; Cohen, S.; Davis, B.; Fuller, N.; Kaplan, R.; Kwong, R.; Liniger, E.; Neumayer, D.; Patel, J.; Shobha, H.; Sooriyakumaran, R.; Purushothaman, S.; Spooner, T.; Miller, R.; Allen, R.; Wisnieff, R.

    2010-04-01

    In this paper, we wish to report, for the first time, on a simple, low-cost, novel way to form dual-damascene copper (Cu) on-chip interconnect or Back-End-Of-the-Line (BEOL) structures using a patternable low dielectric constant (low-κ) dielectric material concept. A patternable low-κ dielectric material combines the functions of a traditional resist and a dielectric material into one single material. It acts as a traditional resist during patterning and is subsequently converted to a low-κ dielectric material during a post-patterning curing process. No sacrificial materials (separate resists or hardmasks) and their related deposition, pattern transfer (etch) and removal (strip) are required to form dual-damascene BEOL patterns. We have successfully demonstrated multi-level dual-damascene integration of a novel patternable low-κ dielectric material into advanced Cu BEOL. This κ=2.7 patternable low-κ material is based on the industry standard SiCOH-based (silsesquioxane polymer) material platform and is compatible with 248 nm optical lithography. Multilevel integration of this patternable low-κ material at 45 nm node Cu BEOL fatwire levels has been demonstrated with very high electrical yields using the current manufacturing infrastructure.

  4. Potential roles of optical interconnections within broadband switching modules

    NASA Astrophysics Data System (ADS)

    Lalk, Gail R.; Habiby, Sarry F.; Hartman, Davis H.; Krchnavek, Robert R.; Wilson, Donald K.; Young, Kenneth C., Jr.

    1991-04-01

    An investigation of potential physical design bottlenecks in future broadband telecommunication switches has led to the identification of several areas where optical interconnections may play a role in the practical realization of required system performance. In the model used the speed and interconnection densities as well as requirements for ease-of-access and efficient power utilization challenge conventional partitioning and packaging strategies. Potential areas where optical interconnections may relieve some of the physical design bottlenecks include fiber management at the customer interface to the switch routing and distribution of high-density interconnections within the fabric of the switch and backplane interconnections to increase system throughput.

  5. Translating multilevel theory into multilevel research: Challenges and opportunities for understanding the social determinants of psychiatric disorders

    PubMed Central

    Dunn, Erin C.; Masyn, Katherine E.; Yudron, Monica; Jones, Stephanie M.; Subramanian, S.V.

    2014-01-01

    The observation that features of the social environment, including family, school, and neighborhood characteristics, are associated with individual-level outcomes has spurred the development of dozens of multilevel or ecological theoretical frameworks in epidemiology, public health, psychology, and sociology, among other disciplines. Despite the widespread use of such theories in etiological, intervention, and policy studies, challenges remain in bridging multilevel theory and empirical research. This paper set out to synthesize these challenges and provide specific examples of methodological and analytical strategies researchers are using to gain a more nuanced understanding of the social determinants of psychiatric disorders, with a focus on children’s mental health. To accomplish this goal, we begin by describing multilevel theories, defining their core elements, and discussing what these theories suggest is needed in empirical work. In the second part, we outline the main challenges researchers face in translating multilevel theory into research. These challenges are presented for each stage of the research process. In the third section, we describe two methods being used as alternatives to traditional multilevel modeling techniques to better bridge multilevel theory and multilevel research. These are: (1) multilevel factor analysis and multilevel structural equation modeling; and (2) dynamic systems approaches. Through its review of multilevel theory, assessment of existing strategies, and examination of emerging methodologies, this paper offers a framework to evaluate and guide empirical studies on the social determinants of child psychiatric disorders as well as health across the lifecourse. PMID:24469555

  6. Multilevel structured program design: formalization and applications

    SciTech Connect

    Glushkov, V.M.; Tseitlin, G.E.; Yushchenko, E.L.

    1981-07-01

    The authors present the conception of structured design grammars (SDG), which provide the basis for the MSPD method. A classification of program development methods according to top-down, bottom-up, and mixed strategy is proposed. The SDG formalism makes it possible to consider the problem of multilevel partial program verification, program transformation, and documentation generation during program development and subsequent maintenance. The MSPD method is demonstrated in application to a number of program design projects. They develop the arsenal of structured programming using MSPD method. Language and software tools constituting the basis of structured programming are considered. The problem of multilevel optimizing translation is treated in the context of the mul'tiprotsessist system oriented to automatic structured parallel programming by the MSPD method. Applications of the MSPD method to symbolic processing are considered. The process of structured design of the partran system and of software modules for mini- and microcomputers is described. 70 references.

  7. Multilevel Inverters for Electric Vehicle Applications

    SciTech Connect

    Habetler, T.G.; Peng, F.Z.; Tolbert, L.M.

    1998-10-22

    This paper presents multilevel inverters as an application for all-electric vehicle (EV) and hybrid-electric vehicle (HEV) motor drives. Diode-clamped inverters and cascaded H-bridge inverters, (1) can generate near-sinusoidal voltages with only fundamental frequency switching; (2) have almost no electromagnetic interference (EMI) and common-mode voltage; and (3) make an EV more accessible/safer and open wiring possible for most of an EV'S power system. This paper explores the benefits and discusses control schemes of the cascade inverter for use as an EV motor drive or a parallel HEV drive and the diode-clamped inverter as a series HEV motor drive. Analytical, simulated, and experimental results show the superiority of these multilevel inverters for this new niche.

  8. Computational modeling and multilevel cancer control interventions.

    PubMed

    Morrissey, Joseph P; Lich, Kristen Hassmiller; Price, Rebecca Anhang; Mandelblatt, Jeanne

    2012-05-01

    This chapter presents an overview of computational modeling as a tool for multilevel cancer care and intervention research. Model-based analyses have been conducted at various "beneath the skin" or biological scales as well as at various "above the skin" or socioecological levels of cancer care delivery. We review the basic elements of computational modeling and illustrate its applications in four cancer control intervention areas: tobacco use, colorectal cancer screening, cervical cancer screening, and racial disparities in access to breast cancer care. Most of these models have examined cancer processes and outcomes at only one or two levels. We suggest ways these models can be expanded to consider interactions involving three or more levels. Looking forward, a number of methodological, structural, and communication barriers must be overcome to create useful computational models of multilevel cancer interventions and population health.

  9. Multilevel Selection in Kin Selection Language.

    PubMed

    Lehtonen, Jussi

    2016-10-01

    Few issues have raised more debate among evolutionary biologists than kin selection (KS) versus multilevel selection (MLS). They are formally equivalent, but use different-looking mathematical approaches, and are not causally equivalent: for a given problem KS can be a more suitable causal explanation than MLS, and vice versa. Methods for analyzing a given model from both viewpoints would therefore be valuable. I argue that there is often an easy way to achieve this: MLS can be written using the components of KS. This applies to the very general regression approach as well as to the practical evolutionarily stable strategy (ESS) maximization approach, and can hence be used to analyze many common ESS models from a multilevel perspective. I demonstrate this with example models of gamete competition and limitation. PMID:27590987

  10. Multilevel resistive information storage and retrieval

    DOEpatents

    Lohn, Andrew; Mickel, Patrick R.

    2016-08-09

    The present invention relates to resistive random-access memory (RRAM or ReRAM) systems, as well as methods of employing multiple state variables to form degenerate states in such memory systems. The methods herein allow for precise write and read steps to form multiple state variables, and these steps can be performed electrically. Such an approach allows for multilevel, high density memory systems with enhanced information storage capacity and simplified information retrieval.

  11. Spinal deformity after multilevel osteoplastic laminotomy

    PubMed Central

    Juergen, Krauss; Gloger, Harald; Soerensen, Nils; Wild, Alexander

    2007-01-01

    Multilevel laminectomy in children has a significant rate of postoperative spinal deformity. To decrease the incidence of this complication, the use of osteoplastic laminotomy is advocated to minimise the risk of spinal deformity by preserving the normal architecture of the spine. In this retrospective study, a 10-year series of a paediatric population undergoing multilevel osteoplastic laminotomy is reviewed to determine the incidence, especially in contrast to laminectomies, and to identify factors that affect the occurrence of spinal column deformity. Seventy patients (mean age 4.2 years) underwent multilevel osteoplastic laminotomy for congenital anomalies or removal of spinal tumours. All patients had a clinical and radiographic examination preoperatively, 12 months postoperatively and at follow-up. Mean follow-up was 5.3 years (range 3–12.6 years). Nineteen patients (27%) had a new or progressive spinal deformity. There was an increased incidence in patients who had surgery for spinal tumours (P < 0.05), surgery of the cervical spine (P < 0.01), and who had more than five levels of the spine included (P < 0.05). A review of the literature on children with multilevel laminectomy (n = 330), the incidence of spinal deformity found a significantly higher (46%) compared to our study group. This study demonstrates that osteoplastic laminotomy was found to be very effective in decreasing the incidence of spinal deformities after spinal-canal surgery for spinal-cord tumours or congenital anomalies in children and adolescents. The choice of an anatomical reconstructive surgical technique such as osteoplastic laminotomy seems to be essential to minimise secondary problems due to the surgical technique itself. Nevertheless, growing patients should be followed up for several years after the initial operation for early detection and consequent management of any possible deformity of the spinal column. PMID:17323095

  12. Automatic Multilevel Parallelization Using OpenMP

    NASA Technical Reports Server (NTRS)

    Jin, Hao-Qiang; Jost, Gabriele; Yan, Jerry; Ayguade, Eduard; Gonzalez, Marc; Martorell, Xavier; Biegel, Bryan (Technical Monitor)

    2002-01-01

    In this paper we describe the extension of the CAPO (CAPtools (Computer Aided Parallelization Toolkit) OpenMP) parallelization support tool to support multilevel parallelism based on OpenMP directives. CAPO generates OpenMP directives with extensions supported by the NanosCompiler to allow for directive nesting and definition of thread groups. We report some results for several benchmark codes and one full application that have been parallelized using our system.

  13. On the effectiveness of multilevel selection.

    PubMed

    Goodnight, Charles J

    2016-01-01

    Experimental studies of group selection show that higher levels of selection act on indirect genetic effects, making the response to group and community selection qualitatively different from that of individual selection. This suggests that multilevel selection plays a key role in the evolution of supersocial societies. Experiments showing the effectiveness of community selection indicate that we should consider the possibility that selection among communities may be important in the evolution of supersocial species. PMID:27562604

  14. Voltage balanced multilevel voltage source converter system

    DOEpatents

    Peng, Fang Zheng; Lai, Jih-Sheng

    1997-01-01

    A voltage balanced multilevel converter for high power AC applications such as adjustable speed motor drives and back-to-back DC intertie of adjacent power systems. This converter provides a multilevel rectifier, a multilevel inverter, and a DC link between the rectifier and the inverter allowing voltage balancing between each of the voltage levels within the multilevel converter. The rectifier is equipped with at least one phase leg and a source input node for each of the phases. The rectifier is further equipped with a plurality of rectifier DC output nodes. The inverter is equipped with at least one phase leg and a load output node for each of the phases. The inverter is further equipped with a plurality of inverter DC input nodes. The DC link is equipped with a plurality of rectifier charging means and a plurality of inverter discharging means. The plurality of rectifier charging means are connected in series with one of the rectifier charging means disposed between and connected in an operable relationship with each adjacent pair of rectifier DC output nodes. The plurality of inverter discharging means are connected in series with one of the inverter discharging means disposed between and connected in an operable relationship with each adjacent pair of inverter DC input nodes. Each of said rectifier DC output nodes are individually electrically connected to the respective inverter DC input nodes. By this means, each of the rectifier DC output nodes and each of the inverter DC input nodes are voltage balanced by the respective charging and discharging of the rectifier charging means and the inverter discharging means.

  15. Voltage balanced multilevel voltage source converter system

    DOEpatents

    Peng, F.Z.; Lai, J.S.

    1997-07-01

    Disclosed is a voltage balanced multilevel converter for high power AC applications such as adjustable speed motor drives and back-to-back DC intertie of adjacent power systems. This converter provides a multilevel rectifier, a multilevel inverter, and a DC link between the rectifier and the inverter allowing voltage balancing between each of the voltage levels within the multilevel converter. The rectifier is equipped with at least one phase leg and a source input node for each of the phases. The rectifier is further equipped with a plurality of rectifier DC output nodes. The inverter is equipped with at least one phase leg and a load output node for each of the phases. The inverter is further equipped with a plurality of inverter DC input nodes. The DC link is equipped with a plurality of rectifier charging means and a plurality of inverter discharging means. The plurality of rectifier charging means are connected in series with one of the rectifier charging means disposed between and connected in an operable relationship with each adjacent pair of rectifier DC output nodes. The plurality of inverter discharging means are connected in series with one of the inverter discharging means disposed between and connected in an operable relationship with each adjacent pair of inverter DC input nodes. Each of said rectifier DC output nodes are individually electrically connected to the respective inverter DC input nodes. By this means, each of the rectifier DC output nodes and each of the inverter DC input nodes are voltage balanced by the respective charging and discharging of the rectifier charging means and the inverter discharging means. 15 figs.

  16. Automatic Multilevel Parallelization Using OpenMP

    NASA Technical Reports Server (NTRS)

    Jin, Hao-Qiang; Jost, Gabriele; Yan, Jerry; Ayguade, Eduard; Gonzalez, Marc; Martorell, Xavier; Biegel, Bryan (Technical Monitor)

    2002-01-01

    In this paper we describe the extension of the CAPO parallelization support tool to support multilevel parallelism based on OpenMP directives. CAPO generates OpenMP directives with extensions supported by the NanosCompiler to allow for directive nesting and definition of thread groups. We report first results for several benchmark codes and one full application that have been parallelized using our system.

  17. Multilevel sparse functional principal component analysis.

    PubMed

    Di, Chongzhi; Crainiceanu, Ciprian M; Jank, Wolfgang S

    2014-01-29

    We consider analysis of sparsely sampled multilevel functional data, where the basic observational unit is a function and data have a natural hierarchy of basic units. An example is when functions are recorded at multiple visits for each subject. Multilevel functional principal component analysis (MFPCA; Di et al. 2009) was proposed for such data when functions are densely recorded. Here we consider the case when functions are sparsely sampled and may contain only a few observations per function. We exploit the multilevel structure of covariance operators and achieve data reduction by principal component decompositions at both between and within subject levels. We address inherent methodological differences in the sparse sampling context to: 1) estimate the covariance operators; 2) estimate the functional principal component scores; 3) predict the underlying curves. Through simulations the proposed method is able to discover dominating modes of variations and reconstruct underlying curves well even in sparse settings. Our approach is illustrated by two applications, the Sleep Heart Health Study and eBay auctions. PMID:24872597

  18. Multilevel sparse functional principal component analysis

    PubMed Central

    Di, Chongzhi; Crainiceanu, Ciprian M.; Jank, Wolfgang S.

    2014-01-01

    We consider analysis of sparsely sampled multilevel functional data, where the basic observational unit is a function and data have a natural hierarchy of basic units. An example is when functions are recorded at multiple visits for each subject. Multilevel functional principal component analysis (MFPCA; Di et al. 2009) was proposed for such data when functions are densely recorded. Here we consider the case when functions are sparsely sampled and may contain only a few observations per function. We exploit the multilevel structure of covariance operators and achieve data reduction by principal component decompositions at both between and within subject levels. We address inherent methodological differences in the sparse sampling context to: 1) estimate the covariance operators; 2) estimate the functional principal component scores; 3) predict the underlying curves. Through simulations the proposed method is able to discover dominating modes of variations and reconstruct underlying curves well even in sparse settings. Our approach is illustrated by two applications, the Sleep Heart Health Study and eBay auctions. PMID:24872597

  19. Computational analyses of multilevel discourse comprehension.

    PubMed

    Graesser, Arthur C; McNamara, Danielle S

    2011-04-01

    The proposed multilevel framework of discourse comprehension includes the surface code, the textbase, the situation model, the genre and rhetorical structure, and the pragmatic communication level. We describe these five levels when comprehension succeeds and also when there are communication misalignments and comprehension breakdowns. A computer tool has been developed, called Coh-Metrix, that scales discourse (oral or print) on dozens of measures associated with the first four discourse levels. The measurement of these levels with an automated tool helps researchers track and better understand multilevel discourse comprehension. Two sets of analyses illustrate the utility of Coh-Metrix in discourse theory and educational practice. First, Coh-Metrix was used to measure the cohesion of the text base and situation model, as well as potential extraneous variables, in a sample of published studies that manipulated text cohesion. This analysis helped us better understand what was precisely manipulated in these studies and the implications for discourse comprehension mechanisms. Second, Coh-Metrix analyses are reported for samples of narrative and science texts in order to advance the argument that traditional text difficulty measures are limited because they fail to accommodate most of the levels of the multilevel discourse comprehension framework.

  20. Chromium vaporization from mechanically deformed pre-coated interconnects in Solid Oxide Fuel Cells

    NASA Astrophysics Data System (ADS)

    Falk-Windisch, Hannes; Sattari, Mohammad; Svensson, Jan-Erik; Froitzheim, Jan

    2015-11-01

    Cathode poisoning, associated with Cr evaporation from interconnect material, is one of the most important degradation mechanisms in Solid Oxide Fuel Cells when Cr2O3-forming steels are used as the interconnect material. Coating these steels with a thin Co layer has proven to decrease Cr vaporization. To reduce production costs, it is suggested that thin metallic PVD coatings be applied to each steel strip before pressing the material into interconnect shape. This process would enable high volume production without the need for an extra post-coating step. However, when the pre-coated material is mechanically deformed, cracks may form and lower the quality of the coating. In the present study, Chromium volatilization is measured in an air-3% H2O environment at 850 °C for 336 h. Three materials coated with 600 nm Co are investigated and compared to an uncoated material. The effect of deformation is investigated on real interconnects. Microscopy observations reveal the presence of cracks in the order of several μm on the deformed pre-coated steel. However, upon exposure, the cracks can heal and form a continuous surface oxide rich in Co and Mn. As an effect of the rapid healing, no increase in Cr vaporization is measured for the pre-coated material.

  1. Mapping the global journey of anthropogenic aluminum: a trade-linked multilevel material flow analysis.

    PubMed

    Liu, Gang; Müller, Daniel B

    2013-10-15

    Material cycles have become increasingly coupled and interconnected in a globalizing era. While material flow analysis (MFA) has been widely used to characterize stocks and flows along technological life cycle within a specific geographical area, trade networks among individual cycles have remained largely unexplored. Here we developed a trade-linked multilevel MFA model to map the contemporary global journey of anthropogenic aluminum. We demonstrate that the anthropogenic aluminum cycle depends substantially on international trade of aluminum in all forms and becomes highly interconnected in nature. While the Southern hemisphere is the main primary resource supplier, aluminum production and consumption concentrate in the Northern hemisphere, where we also find the largest potential for recycling. The more developed countries tend to have a substantial and increasing presence throughout the stages after bauxite refining and possess highly consumption-based cycles, thus maintaining advantages both economically and environmentally. A small group of countries plays a key role in the global redistribution of aluminum and in the connectivity of the network, which may render some countries vulnerable to supply disruption. The model provides potential insights to inform government and industry policies in resource criticality, supply chain security, value chain management, and cross-boundary environmental impacts mitigation.

  2. Mapping the global journey of anthropogenic aluminum: a trade-linked multilevel material flow analysis.

    PubMed

    Liu, Gang; Müller, Daniel B

    2013-10-15

    Material cycles have become increasingly coupled and interconnected in a globalizing era. While material flow analysis (MFA) has been widely used to characterize stocks and flows along technological life cycle within a specific geographical area, trade networks among individual cycles have remained largely unexplored. Here we developed a trade-linked multilevel MFA model to map the contemporary global journey of anthropogenic aluminum. We demonstrate that the anthropogenic aluminum cycle depends substantially on international trade of aluminum in all forms and becomes highly interconnected in nature. While the Southern hemisphere is the main primary resource supplier, aluminum production and consumption concentrate in the Northern hemisphere, where we also find the largest potential for recycling. The more developed countries tend to have a substantial and increasing presence throughout the stages after bauxite refining and possess highly consumption-based cycles, thus maintaining advantages both economically and environmentally. A small group of countries plays a key role in the global redistribution of aluminum and in the connectivity of the network, which may render some countries vulnerable to supply disruption. The model provides potential insights to inform government and industry policies in resource criticality, supply chain security, value chain management, and cross-boundary environmental impacts mitigation. PMID:24025046

  3. Silver flip chip interconnect technology and solid state bonding

    NASA Astrophysics Data System (ADS)

    Sha, Chu-Hsuan

    In this dissertation, fluxless transient liquid phase (TLP) bonding and solid state bonding between thermal expansion mismatch materials have been developed using Ag-In binary systems, pure Au, Ag, and Cu-Ag composite. In contrast to the conventional soldering process, fluxless bonding technique eliminates any corrosion and contamination problems caused by flux. Without flux, it is possible to fabricate high quality joints in large bonding areas where the flux is difficult to clean entirely. High quality joints are crucial to bonding thermal expansion mismatch materials since shear stress develops in the bonded pair. Stress concentration at voids in joints could increases breakage probability. In addition, intermetallic compound (IMC) formation between solder and underbump metallurgy (UBM) is essential for interconnect joint formation in conventional soldering process. However, the interface between IMC and solder is shown to be the weak interface that tends to break first during thermal cycling and drop tests. In our solid state bonding technique, there is no IMC involved in the bonding between Au to Au, Ag and Cu, and Ag and Au. All the reliability issues related to IMC or IMC growth is not our concern. To sum up, ductile bonding media, such as Ag or Au, and proper metallic layered structure are utilized in this research to produce high quality joints. The research starts with developing a low temperature fluxless bonding process using electroplated Ag/In/Ag multilayer structures between Si chip and 304 stainless steel (304SS) substrate. Because the outer thin Ag layer effectively protects inner In layer from oxidation, In layer dissolves Ag layer and joints to Ag layer on the to-be-bonded Si chip when temperature reaches the reflow temperature of 166ºC. Joints consist of mainly Ag-rich Ag-In solid solution and Ag2In. Using this fluxless bonding technique, two 304SS substrates can be bonded together as well. From the high magnification SEM images taken at cross

  4. Updating Interconnection Screens for PV System Integration

    SciTech Connect

    Coddington, M.; Mather, B.; Kroposki, B.; Lynn, K.; Razon, A.; Ellis, A.; Hill, R.; Key, T.; Nicole, K.; Smith, J.

    2012-02-01

    This white paper evaluates the origins and usefulness of the capacity penetration screen, offer short-term solutions which could effectively allow fast-track interconnection to many PV system applications, and considers longer-term solutions for increasing PV deployment levels in a safe and reliable manner while reducing or eliminating the emphasis on the penetration screen. Short-term and longer-term alternatives approaches are offered as examples; however, specific modifications to screening procedures should be discussed with stakeholders and must ultimately be adopted by state and federal regulatory bodies.

  5. Repairable chip bonding/interconnect process

    DOEpatents

    Bernhardt, Anthony F.; Contolini, Robert J.; Malba, Vincent; Riddle, Robert A.

    1997-01-01

    A repairable, chip-to-board interconnect process which addresses cost and testability issues in the multi-chip modules. This process can be carried out using a chip-on-sacrificial-substrate technique, involving laser processing. This process avoids the curing/solvent evolution problems encountered in prior approaches, as well is resolving prior plating problems and the requirements for fillets. For repairable high speed chip-to-board connection, transmission lines can be formed on the sides of the chip from chip bond pads, ending in a gull wing at the bottom of the chip for subsequent solder.

  6. Repairable chip bonding/interconnect process

    DOEpatents

    Bernhardt, A.F.; Contolini, R.J.; Malba, V.; Riddle, R.A.

    1997-08-05

    A repairable, chip-to-board interconnect process which addresses cost and testability issues in the multi-chip modules is disclosed. This process can be carried out using a chip-on-sacrificial-substrate technique, involving laser processing. This process avoids the curing/solvent evolution problems encountered in prior approaches, as well is resolving prior plating problems and the requirements for fillets. For repairable high speed chip-to-board connection, transmission lines can be formed on the sides of the chip from chip bond pads, ending in a gull wing at the bottom of the chip for subsequent solder. 10 figs.

  7. Optical Interconnection Via Computer-Generated Holograms

    NASA Technical Reports Server (NTRS)

    Liu, Hua-Kuang; Zhou, Shaomin

    1995-01-01

    Method of free-space optical interconnection developed for data-processing applications like parallel optical computing, neural-network computing, and switching in optical communication networks. In method, multiple optical connections between multiple sources of light in one array and multiple photodetectors in another array made via computer-generated holograms in electrically addressed spatial light modulators (ESLMs). Offers potential advantages of massive parallelism, high space-bandwidth product, high time-bandwidth product, low power consumption, low cross talk, and low time skew. Also offers advantage of programmability with flexibility of reconfiguration, including variation of strengths of optical connections in real time.

  8. Environmental Regulation Impacts on Eastern Interconnection Performance

    SciTech Connect

    Markham, Penn N; Liu, Yilu; Young II, Marcus Aaron

    2013-07-01

    In the United States, recent environmental regulations will likely result in the removal of nearly 30 GW of oil and coal-fired generation from the power grid, mostly in the Eastern Interconnection (EI). The effects of this transition on voltage stability and transmission line flows have previously not been studied from a system-wide perspective. This report discusses the results of power flow studies designed to simulate the evolution of the EI over the next few years as traditional generation sources are replaced with environmentally friendlier ones such as natural gas and wind.

  9. Interconnection of Europe`s power systems

    SciTech Connect

    Manos, P.

    1996-03-01

    More than six years have passed since the Berlin Wall fell during Christmas of 1989, and a unified pan-European electricity-supply system is still not a reality. Progress toward that goal has been certain but slow. Technical and political differences still block the final step in the integration process: a full hookup between the grids of western and northern Europe and the transmission networks of the former Warsaw Pact nations. It has fallen to unified Germany, as the bridge between East and West, to serve as the catalyst of Europe`s electrical congress. This paper discusses the existing and planned interconnection along with a historical perspective.

  10. Spatial-light-modulator interconnected computers

    SciTech Connect

    Mc Aulay, A.D.

    1987-10-01

    Optical technologies perform the basic computer operations of communications, switching, and storage, have already proven superior to electronics for many communications situations, and advances in devices and materials suggest that optics are important for switching and storage. The spatial light modulator (SLM) is one of the devices expected to play an important role in optical computing. An SLM acts as a piece of film whose transmittance or reflectance may be varied spatially and temporally by electronic or optical means. Types of SLMs, the use of optics for computation and three proposed, as well as diverse optical computing systems that use SLMs for interconnections are described in this article.

  11. Approaching Gas Phase Electrodeposition: Process and Optimization to Enable the Self-Aligned Growth of 3D Nanobridge-Based Interconnects.

    PubMed

    Fang, Jun; Schlag, Leslie; Park, Se-Chul; Stauden, Thomas; Pezoldt, Jörg; Schaaf, Peter; Jacobs, Heiko O

    2016-03-01

    A nanowire bonding process referred to as gas-phase electrodeposition is reported to form nanobridge-based interconnects. The process is able to grow free-standing point-to-point electrical connections using metallic wires. As a demonstration, programmable interconnects and an interdigitated electrode array are shown. The process is more material efficient when compared with conventional vapor deposition since the material is directed to the point of use.

  12. Modular assembly and interconnects for fluidic microsystems

    NASA Astrophysics Data System (ADS)

    Gonzalez, Carlos; Collins, Scott D.; Smith, Rosemary L.

    1998-03-01

    At this early phase in the development of microfabricated fluidic systems, only a few components or functions have been microfabricated. Some sort of interface to the remaining 'off chip' components is required. For example, a variety of analysis techniques have been demonstrated in microfabricated channels, and cells, but sample preparation is to date still mostly performed off chip, involving pipetting, tubing and titer plate interfacing. The transition from micro to macro components has been to date rather crude, consisting mostly of tubing glued into or over holes etched into silicon or glass substrates. This paper presents new, micromachinable, joining and interconnecting structures that enable the modular, plug-in assembly of fluidic components to one another, to tubing, and into a fluid channel breadboard. Micro-to-miniature interfacing elements for making connections between microchannels and standard tubing, and both horizontal and vertical channel- to-channel interconnects will be demonstrated. Excellent seals are created using photopatternable silicone O-rings that are held in compression by the connecting structure. This technology allows one to assemble a fluidic microsystem with both custom and off the shelf, micro or miniature components. The connections are all reversible, making the system design reconfigurable and components easily exchanged.

  13. National Offshore Wind Energy Grid Interconnection Study

    SciTech Connect

    Daniel, John P.; Liu, Shu; Ibanez, Eduardo; Pennock, Ken; Reed, Greg; Hanes, Spencer

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States. A total of 54GW of offshore wind was assumed to be the target for the analyses conducted. A variety of issues are considered including: the anticipated staging of offshore wind; the offshore wind resource availability; offshore wind energy power production profiles; offshore wind variability; present and potential technologies for collection and delivery of offshore wind energy to the onshore grid; potential impacts to existing utility systems most likely to receive large amounts of offshore wind; and regulatory influences on offshore wind development. The technologies considered the reliability of various high-voltage ac (HVAC) and high-voltage dc (HVDC) technology options and configurations. The utility system impacts of GW-scale integration of offshore wind are considered from an operational steady-state perspective and from a regional and national production cost perspective.

  14. European Transmission Interconnection; Eurasian power grid

    SciTech Connect

    Posch, J. )

    1991-09-01

    Systems and philosophies perceived on a grand scale, encompassing new ideas, are often characterized as a dream. But in fact, such dreams often lead to the first step to fruitful development. This article is based on a preliminary study of the existing electrical high-tension networks of Western Europe, Eastern Europe and the Soviet Union - which, as explained herein, may be merged into a multinational energy supply system. Such a system would constitute a completely interconnected Eurasian Power Grid. The idea of a Eurasian super grid, spanning from the Atlantic to the Ural and Siberia, is not new. Various studies have been conducted by both western Europe and the Soviet Union on this topic. Our world is currently in an era of extra high voltage (EHV) and ultra high voltage (UHV) electrical systems. This translates into existing UHV lines of 1150 kV which have already been proven in successful operation. Such UHV systems are capable of transmitting thousands of megawatts over a distance of a 1000 miles. Furthermore, national boundaries are not more a hindrance than the challenge of interconnecting complete networks into an overall synchronized working system with load exchange capabilities in all directions.

  15. IETI – Isogeometric Tearing and Interconnecting

    PubMed Central

    Kleiss, Stefan K.; Pechstein, Clemens; Jüttler, Bert; Tomar, Satyendra

    2012-01-01

    Finite Element Tearing and Interconnecting (FETI) methods are a powerful approach to designing solvers for large-scale problems in computational mechanics. The numerical simulation problem is subdivided into a number of independent sub-problems, which are then coupled in appropriate ways. NURBS- (Non-Uniform Rational B-spline) based isogeometric analysis (IGA) applied to complex geometries requires to represent the computational domain as a collection of several NURBS geometries. Since there is a natural decomposition of the computational domain into several subdomains, NURBS-based IGA is particularly well suited for using FETI methods. This paper proposes the new IsogEometric Tearing and Interconnecting (IETI) method, which combines the advanced solver design of FETI with the exact geometry representation of IGA. We describe the IETI framework for two classes of simple model problems (Poisson and linearized elasticity) and discuss the coupling of the subdomains along interfaces (both for matching interfaces and for interfaces with T-joints, i.e. hanging nodes). Special attention is paid to the construction of a suitable preconditioner for the iterative linear solver used for the interface problem. We report several computational experiments to demonstrate the performance of the proposed IETI method. PMID:24511167

  16. Thermoelectric Coolers with Sintered Silver Interconnects

    NASA Astrophysics Data System (ADS)

    Kähler, Julian; Stranz, Andrej; Waag, Andreas; Peiner, Erwin

    2014-06-01

    The fabrication and performance of a sintered Peltier cooler (SPC) based on bismuth telluride with sintered silver interconnects are described. Miniature SPC modules with a footprint of 20 mm2 were assembled using pick-and-place pressure-assisted silver sintering at low pressure (5.5 N/mm2) and moderate temperature (250°C to 270°C). A modified flip-chip bonder combined with screen/stencil printing for paste transfer was used for the pick-and-place process, enabling high positioning accuracy, easy handling of the tiny bismuth telluride pellets, and immediate visual process control. A specific contact resistance of (1.4 ± 0.1) × 10-5 Ω cm2 was found, which is in the range of values reported for high-temperature solder interconnects of bismuth telluride pellets. The realized SPCs were evaluated from room temperature to 300°C, considerably outperforming the operating temperature range of standard commercial Peltier coolers. Temperature cycling capability was investigated from 100°C to 235°C over more than 200 h, i.e., 850 cycles, during which no degradation of module resistance or cooling performance occurred.

  17. Towards energy aware optical networks and interconnects

    NASA Astrophysics Data System (ADS)

    Glesk, Ivan; Osadola, Tolulope; Idris, Siti

    2013-10-01

    In a today's world, information technology has been identified as one of the major factors driving economic prosperity. Datacenters businesses have been growing significantly in the past few years. The equipments in these datacenters need to be efficiently connected to each other and also to the outside world in order to enable effective exchange of information. This is why there is need for highly scalable, energy savvy and reliable network connectivity infrastructure that is capable of accommodating the large volume of data being exchanged at any time within the datacenter network and the outside network in general. These devices that can ensure such effective connectivity currently require large amount of energy in order to meet up with these increasing demands. In this paper, an overview of works being done towards realizing energy aware optical networks and interconnects for datacenters is presented. Also an OCDMA approach is discussed as potential multiple access technique for future optical network interconnections. We also presented some challenges that might inhibit effective implementation of the OCDMA multiplexing scheme.

  18. Interconnected ponds operation for flood hazard distribution

    NASA Astrophysics Data System (ADS)

    Putra, S. S.; Ridwan, B. W.

    2016-05-01

    The climatic anomaly, which comes with extreme rainfall, will increase the flood hazard in an area within a short period of time. The river capacity in discharging the flood is not continuous along the river stretch and sensitive to the flood peak. This paper contains the alternatives on how to locate the flood retention pond that are physically feasible to reduce the flood peak. The flood ponds were designed based on flood curve number criteria (TR-55, USDA) with the aim of rapid flood peak capturing and gradual flood retuning back to the river. As a case study, the hydrologic condition of upper Ciliwung river basin with several presumed flood pond locations was conceptually designed. A fundamental tank model that reproducing the operation of interconnected ponds was elaborated to achieve the designed flood discharge that will flows to the downstream area. The flood hazard distribution status, as the model performance criteria, will be computed within Ciliwung river reach in Manggarai Sluice Gate spot. The predicted hazard reduction with the operation of the interconnected retention area result had been bench marked with the normal flow condition.

  19. Aspects of short-range interconnect packaging

    NASA Astrophysics Data System (ADS)

    Wohlfeld, Denis; Brenner, Karl-Heinz

    2012-01-01

    In short-range interconnect applications, one question arises frequently: When should optical solutions be chosen over electrical wiring? The answer to this question of course depends on several factors like costs, performance, reliability, availability of testing equipment and knowledge about optical technologies, and last but not least, it strongly depends on the application itself. Networking in high performance computing (HPC) is one such example. With bit rates around 10 Gbit/s per channel and cable length above 2 m, the high attenuation of electrical cables leads to a clear preference of optical or active optical cables (AOC) for most planned HPC systems. For AOCs, the electro-optical conversion is realized inside the connector housing, while for purely optical cables, the conversion is done at the edge of the board. Proceeding to 25 Gbit/s and higher, attenuation and loss of signal quality become critical. Therefore, either significantly more effort has to be spent on the electrical side, or the package for conversion has to be integrated closer to the chip, thus requiring new packaging technologies. The paper provides a state of the art overview of packaging concepts for short range interconnects, it describes the main challenges of optical package integration and illustrates new concepts and trends in this research area.

  20. Message Passing Framework for Globally Interconnected Clusters

    NASA Astrophysics Data System (ADS)

    Hafeez, M.; Asghar, S.; Malik, U. A.; Rehman, A.; Riaz, N.

    2011-12-01

    In prevailing technology trends it is apparent that the network requirements and technologies will advance in future. Therefore the need of High Performance Computing (HPC) based implementation for interconnecting clusters is comprehensible for scalability of clusters. Grid computing provides global infrastructure of interconnecting clusters consisting of dispersed computing resources over Internet. On the other hand the leading model for HPC programming is Message Passing Interface (MPI). As compared to Grid computing, MPI is better suited for solving most of the complex computational problems. MPI itself is restricted to a single cluster. It does not support message passing over the internet to use the computing resources of different clusters in an optimal way. We propose a model that provides message passing capabilities between parallel applications over the internet. The proposed model is based on Architecture for Java Universal Message Passing (A-JUMP) framework and Enterprise Service Bus (ESB) named as High Performance Computing Bus. The HPC Bus is built using ActiveMQ. HPC Bus is responsible for communication and message passing in an asynchronous manner. Asynchronous mode of communication offers an assurance for message delivery as well as a fault tolerance mechanism for message passing. The idea presented in this paper effectively utilizes wide-area intercluster networks. It also provides scheduling, dynamic resource discovery and allocation, and sub-clustering of resources for different jobs. Performance analysis and comparison study of the proposed framework with P2P-MPI are also presented in this paper.

  1. Reconfigurable optical interconnections via dynamic computer-generated holograms

    NASA Technical Reports Server (NTRS)

    Liu, Hua-Kuang (Inventor); Zhou, Shaomin (Inventor)

    1994-01-01

    A system is proposed for optically providing one-to-many irregular interconnections, and strength-adjustable many-to-many irregular interconnections which may be provided with strengths (weights) w(sub ij) using multiple laser beams which address multiple holograms and means for combining the beams modified by the holograms to form multiple interconnections, such as a cross-bar switching network. The optical means for interconnection is based on entering a series of complex computer-generated holograms on an electrically addressed spatial light modulator for real-time reconfigurations, thus providing flexibility for interconnection networks for largescale practical use. By employing multiple sources and holograms, the number of interconnection patterns achieved is increased greatly.

  2. Reconfigurable Optical Interconnections Via Dynamic Computer-Generated Holograms

    NASA Technical Reports Server (NTRS)

    Liu, Hua-Kuang (Inventor); Zhou, Shao-Min (Inventor)

    1996-01-01

    A system is presented for optically providing one-to-many irregular interconnections, and strength-adjustable many-to-many irregular interconnections which may be provided with strengths (weights) w(sub ij) using multiple laser beams which address multiple holograms and means for combining the beams modified by the holograms to form multiple interconnections, such as a cross-bar switching network. The optical means for interconnection is based on entering a series of complex computer-generated holograms on an electrically addressed spatial light modulator for real-time reconfigurations, thus providing flexibility for interconnection networks for large-scale practical use. By employing multiple sources and holograms, the number of interconnection patterns achieved is increased greatly.

  3. Development and Application of HVOF Sprayed Spinel Protective Coating for SOFC Interconnects

    NASA Astrophysics Data System (ADS)

    Thomann, O.; Pihlatie, M.; Rautanen, M.; Himanen, O.; Lagerbom, J.; Mäkinen, M.; Varis, T.; Suhonen, T.; Kiviaho, J.

    2013-06-01

    Protective coatings are needed for metallic interconnects used in solid oxide fuel cell (SOFC) stacks to prevent excessive high-temperature oxidation and evaporation of chromium species. These phenomena affect the lifetime of the stacks by increasing the area-specific resistance (ASR) and poisoning of the cathode. Protective MnCo2O4 and MnCo1.8Fe0.2O4 coatings were applied on ferritic steel interconnect material (Crofer 22 APU) by high velocity oxy fuel spraying. The substrate-coating systems were tested in long-term exposure tests to investigate their high-temperature oxidation behavior. Additionally, the ASRs were measured at 700 °C for 1000 h. Finally, a real coated interconnect was used in a SOFC single-cell stack for 6000 h. Post-mortem analysis was carried out with scanning electron microscopy. The deposited coatings reduced significantly the oxidation of the metal, exhibited low and stable ASR and reduced effectively the migration of chromium.

  4. Investigation of welded interconnection of large area wraparound contacted silicon solar cells

    NASA Technical Reports Server (NTRS)

    Lott, D. R.

    1984-01-01

    An investigation was conducted to evaluate the welding and temperature cycle testing of large area 5.9 x 5.9 wraparound silicon solar cells utilizing printed circuit substrates with SSC-155 interconnect copper metals and the LMSC Infrared Controlled weld station. An initial group of 5 welded modules containing Phase 2 developmental 5.9 x 5.9 cm cells were subjected to cyclical temperatures of + or 80 C at a rate of 120 cycles per day. Anomalies were noted in the adhesion of the cell contact metallization; therefore, 5 additional modules were fabricated and tested using available Phase I cells with demonstrated contact integrity. Cycling of the later module type through 12,000 cycles indicated the viability of this type of lightweight flexible array concept. This project demonstrated acceptable use of an alternate interconnect copper in combination with large area wraparound cells and emphasized the necessity to implement weld pull as opposed to solder pull procedures at the cell vendors for cells that will be interconnected by welding.

  5. Thin and Thick Films Materials Based Interconnection Technology for 500 C Operation

    NASA Technical Reports Server (NTRS)

    Chen, Liang-Yu; Hunter, Gary W.; Neudeck, Philip G.

    2000-01-01

    Precious metal based thick-film material was used for printed wires, wire bond pads, test lead-attach, and conductive die-attach for high temperature (up to 500 C and beyond) chip level packaging. A SiC Shottky diode with a thin-film coated backside was attached to a ceramic substrate using precious metal based thick-film material as the electrically conductive bonding layer. After a 500-hour soak test in atmospheric oxygen, these basic interconnection elements, including attached test diode survived both electrically and mechanically. The electrical resistance of these interconnections (including thick-film printed wire/pad, bonded wire, and test lead attach) were low and stable at both room and elevated temperatures. The electrical resistance of the die-attach interface estimated by I-V characterization of the attached diode, during and after high temperature heat treatment, remained desirably low over the course of a 500-hour anneal. Further durability testing of this high temperature interconnection technology is also discussed.

  6. Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

    SciTech Connect

    Tamura, Nobumichi; Chen, Kai; Kunz, Martin

    2009-05-01

    Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature. This paper presents an overview of the principal results obtained from X-ray microdiffraction studies of electromigration effects on aluminum and copper interconnects at the ALS throughout continuous efforts that spanned over a decade (1998-2008) from approximately 40 weeks of combined beamtime.

  7. Probability density function modeling for sub-powered interconnects

    NASA Astrophysics Data System (ADS)

    Pater, Flavius; Amaricǎi, Alexandru

    2016-06-01

    This paper proposes three mathematical models for reliability probability density function modeling the interconnect supplied at sub-threshold voltages: spline curve approximations, Gaussian models,and sine interpolation. The proposed analysis aims at determining the most appropriate fitting for the switching delay - probability of correct switching for sub-powered interconnects. We compare the three mathematical models with the Monte-Carlo simulations of interconnects for 45 nm CMOS technology supplied at 0.25V.

  8. Application of optical interconnect technology at Lawrence Livermore National Laboratory

    SciTech Connect

    Haigh, R.E.; Lowry, M.E.; McCammon, K.; Hills, R.; Mitchell, R.; Sweider, D.

    1995-08-10

    Optical interconnects will be required to meet the information bandwidth requirements of future communication and computing applications. At Lawrence Livermore National Laboratory, the authors are involved in applying optical interconnect technologies in two distinct application areas: Multi-Gigabit/sec Computer Backplanes and Gigabit/sec Wide Area Networking using Wavelength Division Multiplexing. In this paper, the authors discuss their efforts to integrate optical interconnect technologies into prototype computing and communication systems.

  9. Oscillations in interconnected complex networks under intentional attack

    NASA Astrophysics Data System (ADS)

    Zhang, Wen-Ping; Xia, Yongxiang; Tan, Fei

    2016-01-01

    Many real-world networks are interconnected with each other. In this paper, we study the traffic dynamics in interconnected complex networks under an intentional attack. We find that with the shortest time delay routing strategy, the traffic dynamics can show the stable state, periodic, quasi-periodic and chaotic oscillations, when the capacity redundancy parameter changes. Moreover, compared with isolated complex networks, oscillations always take place in interconnected networks more easily. Thirdly, in interconnected networks, oscillations are affected strongly by the coupling probability and coupling preference.

  10. Reaction-diffusion processes on interconnected scale-free networks

    NASA Astrophysics Data System (ADS)

    Garas, Antonios

    2015-08-01

    We study the two-particle annihilation reaction A +B →∅ on interconnected scale-free networks, using different interconnecting strategies. We explore how the mixing of particles and the process evolution are influenced by the number of interconnecting links, by their functional properties, and by the interconnectivity strategies in use. We show that the reaction rates on this system are faster than what was observed in other topologies, due to the better particle mixing that suppresses the segregation effect, in line with previous studies performed on single scale-free networks.

  11. Interplay between the magnetic and magneto-transport properties of 3D interconnected nanowire networks

    NASA Astrophysics Data System (ADS)

    da Câmara Santa Clara Gomes, Tristan; De La Torre Medina, Joaquín; Velázquez-Galván, Yenni G.; Martínez-Huerta, Juan Manuel; Encinas, Armando; Piraux, Luc

    2016-07-01

    We have explored the interplay between the magnetic and magneto-transport properties of 3D interconnected nanowire networks made of various magnetic metals by electrodeposition into nanoporous membranes with crossed channels and controlled topology. The close relationship between their magnetic and structural properties has a direct impact on their magneto-transport behavior. In order to accurately and reliably describe the effective magnetic anisotropy and anisotropic magnetoresistance, an analytical model inherent to the topology of 3D nanowire networks is proposed and validated. The feasibility to obtain magneto-transport responses in nanowire network films based on interconnected nanowires makes them very attractive for the development of mechanically stable superstructures that are suitable for potential technological applications.

  12. Three-dimensional optical lines fabricated onto substrate for on-board interconnection

    NASA Astrophysics Data System (ADS)

    Matsubara, Takahiro; Oda, Keiko; Watanabe, Keiichiro; Maetani, Maraki; Tanaka, Kaori; Tanahashi, Shigeo

    2009-02-01

    Optical lines using polymer materials fabricated on an organic substrate with metal lines and pads are proposed to realize fully optical interconnections among high performance LSIs. This optical line enable transmit high speed optical signals not only on a plane surface but to vertical direction. It has following four particular portions; (1) Curved parallel optical waveguide; (2) 45 degree reflection mirror; (3) Optical via hole with coaxial structure; (4) Optical joint between package and board. The optical line characterized by transmission loss and passed through eye diagram, and good optical signal transmission is confirmed to really use for optical interconnection between LSIs. Then on-board optical signal transmission is demonstrated by that VCSEL and PIN-PD are assembled using flip-chip technology on a circuit board with other electric devices of driving circuit, and also package-to-board optical joint are demonstrated by passing through solder reflow process.

  13. Wired up: interconnecting two-dimensional materials with one-dimensional atomic chains.

    PubMed

    Rong, Youmin; Warner, Jamie H

    2014-12-23

    Atomic wires are chains of atoms sequentially bonded together and epitomize the structural form of a one-dimensional (1D) material. In graphene, they form as interconnects between regions when the nanoconstriction eventually becomes so narrow that it is reduced to one atom thick. In this issue of ACS Nano, Cretu et al. extend the discovery of 1D atomic wire interconnects in two-dimensional (2D) materials to hexagonal boron nitride. We highlight recent progress in the area of 1D atomic wires within 2D materials, with a focus on their atomic-level structural analysis using aberration-corrected transmission electron microscopy. We extend this discussion to the formation of nanowires in transition metal dichalcogenides under similar electron-beam irradiation conditions. The future outlook for atomic wires is considered in the context of new 2D materials and hybrids of C, B, and N. PMID:25474120

  14. Wired up: interconnecting two-dimensional materials with one-dimensional atomic chains.

    PubMed

    Rong, Youmin; Warner, Jamie H

    2014-12-23

    Atomic wires are chains of atoms sequentially bonded together and epitomize the structural form of a one-dimensional (1D) material. In graphene, they form as interconnects between regions when the nanoconstriction eventually becomes so narrow that it is reduced to one atom thick. In this issue of ACS Nano, Cretu et al. extend the discovery of 1D atomic wire interconnects in two-dimensional (2D) materials to hexagonal boron nitride. We highlight recent progress in the area of 1D atomic wires within 2D materials, with a focus on their atomic-level structural analysis using aberration-corrected transmission electron microscopy. We extend this discussion to the formation of nanowires in transition metal dichalcogenides under similar electron-beam irradiation conditions. The future outlook for atomic wires is considered in the context of new 2D materials and hybrids of C, B, and N.

  15. Compact Interconnection Networks Based on Quantum Dots

    NASA Technical Reports Server (NTRS)

    Fijany, Amir; Toomarian, Nikzad; Modarress, Katayoon; Spotnitz, Matthew

    2003-01-01

    Architectures that would exploit the distinct characteristics of quantum-dot cellular automata (QCA) have been proposed for digital communication networks that connect advanced digital computing circuits. In comparison with networks of wires in conventional very-large-scale integrated (VLSI) circuitry, the networks according to the proposed architectures would be more compact. The proposed architectures would make it possible to implement complex interconnection schemes that are required for some advanced parallel-computing algorithms and that are difficult (and in many cases impractical) to implement in VLSI circuitry. The difficulty of implementation in VLSI and the major potential advantage afforded by QCA were described previously in Implementing Permutation Matrices by Use of Quantum Dots (NPO-20801), NASA Tech Briefs, Vol. 25, No. 10 (October 2001), page 42. To recapitulate: Wherever two wires in a conventional VLSI circuit cross each other and are required not to be in electrical contact with each other, there must be a layer of electrical insulation between them. This, in turn, makes it necessary to resort to a noncoplanar and possibly a multilayer design, which can be complex, expensive, and even impractical. As a result, much of the cost of designing VLSI circuits is associated with minimization of data routing and assignment of layers to minimize crossing of wires. Heretofore, these considerations have impeded the development of VLSI circuitry to implement complex, advanced interconnection schemes. On the other hand, with suitable design and under suitable operating conditions, QCA-based signal paths can be allowed to cross each other in the same plane without adverse effect. In principle, this characteristic could be exploited to design compact, coplanar, simple (relative to VLSI) QCA-based networks to implement complex, advanced interconnection schemes. The proposed architectures require two advances in QCA-based circuitry beyond basic QCA-based binary

  16. Multilevel Higher-Order Item Response Theory Models

    ERIC Educational Resources Information Center

    Huang, Hung-Yu; Wang, Wen-Chung

    2014-01-01

    In the social sciences, latent traits often have a hierarchical structure, and data can be sampled from multiple levels. Both hierarchical latent traits and multilevel data can occur simultaneously. In this study, we developed a general class of item response theory models to accommodate both hierarchical latent traits and multilevel data. The…

  17. Extensions of Mantel-Haenszel for Multilevel DIF Detection

    ERIC Educational Resources Information Center

    French, Brian F.; Finch, W. Holmes

    2013-01-01

    Multilevel data structures are ubiquitous in the assessment of differential item functioning (DIF), particularly in large-scale testing programs. There are a handful of DIF procures for researchers to select from that appropriately account for multilevel data structures. However, little, if any, work has been completed to extend a popular DIF…

  18. Matching Strategies for Observational Data with Multilevel Structure

    ERIC Educational Resources Information Center

    Steiner, Peter M.

    2011-01-01

    Given the different possibilities of matching in the context of multilevel data and the lack of research on corresponding matching strategies, the author investigates two main research questions. The first research question investigates the advantages and disadvantages of different matching strategies that can be pursued with multilevel data…

  19. Multilevel Modeling and School Psychology: A Review and Practical Example

    ERIC Educational Resources Information Center

    Graves, Scott L., Jr.; Frohwerk, April

    2009-01-01

    The purpose of this article is to provide an overview of the state of multilevel modeling in the field of school psychology. The authors provide a systematic assessment of published research of multilevel modeling studies in 5 journals devoted to the research and practice of school psychology. In addition, a practical example from the nationally…

  20. Consequences of Unmodeled Nonlinear Effects in Multilevel Models

    ERIC Educational Resources Information Center

    Bauer, Daniel J.; Cai, Li

    2009-01-01

    Applications of multilevel models have increased markedly during the past decade. In incorporating lower-level predictors into multilevel models, a key interest is often whether or not a given predictor requires a random slope, that is, whether the effect of the predictor varies over upper-level units. If the variance of a random slope…

  1. Alternatives to Multilevel Modeling for the Analysis of Clustered Data

    ERIC Educational Resources Information Center

    Huang, Francis L.

    2016-01-01

    Multilevel modeling has grown in use over the years as a way to deal with the nonindependent nature of observations found in clustered data. However, other alternatives to multilevel modeling are available that can account for observations nested within clusters, including the use of Taylor series linearization for variance estimation, the design…

  2. The multilevel CC3 coupled cluster model

    NASA Astrophysics Data System (ADS)

    Myhre, Rolf H.; Koch, Henrik

    2016-07-01

    We present an efficient implementation of the closed shell multilevel coupled cluster method where coupled cluster singles and doubles (CCSD) is used for the inactive orbital space and CCSD with perturbative triples (CC3) is employed for the smaller active orbital space. Using Cholesky orbitals, the active space can be spatially localized and the computational cost is greatly reduced compared to full CC3 while retaining the accuracy of CC3 excitation energies. For the small organic molecules considered we achieve up to two orders of magnitude reduction in the computational requirements.

  3. Virtual interconnection platform initiative scoping study

    SciTech Connect

    Liu, Yong; Kou, Gefei; Pan, Zuohong; Liu, Yilu; King Jr., Thomas J.

    2016-01-01

    Due to security and liability concerns, the research community has limited access to realistic large-scale power grid models to test and validate new operation and control methodologies. It is also difficult for industry to evaluate the relative value of competing new tools without a common platform for comparison. This report proposes to develop a large-scale virtual power grid model that retains basic features and represents future trends of major U.S. electric interconnections. This model will include realistic power flow and dynamics information as well as a relevant geospatial distribution of assets. This model will be made widely available to the research community for various power system stability and control studies and can be used as a common platform for comparing the efficacies of various new technologies.

  4. Microfabricated structures with electrical isolation and interconnections

    NASA Technical Reports Server (NTRS)

    Clark, William A. (Inventor); Juneau, Thor N. (Inventor); Roessig, Allen W. (Inventor); Lemkin, Mark A. (Inventor)

    2001-01-01

    The invention is directed to a microfabricated device. The device includes a substrate that is etched to define mechanical structures at least some of which are anchored laterally to the remainder of the substrate. Electrical isolation at points where mechanical structures are attached to the substrate is provided by filled isolation trenches. Filled trenches may also be used to electrically isolate structure elements from each other at points where mechanical attachment of structure elements is desired. The performance of microelectromechanical devices is improved by 1) having a high-aspect-ratio between vertical and lateral dimensions of the mechanical elements, 2) integrating electronics on the same substrate as the mechanical elements, 3) good electrical isolation among mechanical elements and circuits except where electrical interconnection is desired.

  5. Efficient hierarchical interconnection for multiprocessor systems

    NASA Technical Reports Server (NTRS)

    Wei, Sizheng; Levy, Saul

    1992-01-01

    The authors present a novel approach to the design of a class of hierarchical interconnection networks for multiprocessor systems. This approach, based on an architecture providing separate networks for each level, gives a general and flexible way to construct efficient hierarchical networks. The performance and cost-effectiveness of the resulting networks are analyzed and compared in detail, using both unbuffered and buffered network models. It is shown that, if the design parameters are determined based on the degree of locality, the cost-effectiveness of a hierarchical network can be significantly improved. In addition, the authors investigate how to construct a cost-effectiveness hierarchical network by determining appropriate design parameters. Two associated algorithms are developed for this purpose.

  6. Forming electrical interconnections through semiconductor wafers

    NASA Technical Reports Server (NTRS)

    Anthony, T. R.

    1981-01-01

    An information processing system based on CMOS/SOS technology is being developed by NASA to process digital image data collected by satellites. An array of holes is laser drilled in a semiconductor wafer, and a conductor is formed in the holes to fabricate electrical interconnections through the wafers. Six techniques are used to form conductors in the silicon-on-sapphire (SOS) wafers, including capillary wetting, wedge extrusion, wire intersection, electroless plating, electroforming, double-sided sputtering and through-hole electroplating. The respective strengths and weaknesses of these techniques are discussed and compared, with double-sided sputtering and the through-hole plating method achieving best results. In addition, hollow conductors provided by the technique are available for solder refill, providing a natural way of forming an electrically connected stack of SOS wafers.

  7. High throughput network for multiprocessor interconnections

    NASA Astrophysics Data System (ADS)

    Raatikainen, Pertti; Zidbeck, Juha

    1993-05-01

    Multiprocessor architectures are needed to support modern broadband applications, since traditional bus structures are not capable of providing high throughput. New bus structures are needed, especially in the area of network components and terminals. A study to find an efficient and cost effective interconnection topology for the future high speed products is presented. The most common bus topologies are introduced, and their characteristics are estimated to decide which one of them offers best performance and lowest implementation cost. The ring topology is chosen to be studied in more detail. Four competing bus access schemes for the high throughput ring are introduced as well as simulation models for each of them. Using transfer delay and throughput results, as well as keeping the implementation point of view in mind, the best candidate is selected to be studied and experimented in the succeeding research project.

  8. Interconnection capacitance models for VLSI circuits

    NASA Astrophysics Data System (ADS)

    Wong, Shyh-Chyi; Liu, Patrick S.; Ru, Jien-Wen; Lin, Shi-Tron

    1998-06-01

    A new set of capacitance models is developed for delay estimation of VLSI interconnections. The set of models is derived for five representative wiring structures, with their combinations covering arbitrary VLSI layouts. A semi-empirical approach is adopted to deal with complicated geometry nature in VLSI and to allow for closed-form capacitance formulas to be developed to provide direct observation of capacitance variation vs process parameters as well as computational efficiency for circuit simulation. The formulas are given explicitly in terms of wire width, wire thickness, dielectric thickness and inter-wire spacing. The models show good agreement with numerical solutions from RAPHAEL and measurement data of fabricated capacitance test structures. The models are further applied and validated on a ring oscillator. It is shown that the frequency of the ring oscillator obtained from HSPICE simulation with our models agrees well with the bench measurement.

  9. Interconnecting compressors control coalbed gas production

    SciTech Connect

    Payton, R.; Niederhofer, J. )

    1992-10-05

    This paper reports that centralized compressors afford Taurus Exploration Inc.'s coalbed gas operations optimum control of gas production. Unlike satellite stations, the centralized system allows methane gas to e shifted from station to station via the interconnecting low-pressure pipeline network. The operations area encompasses approximately 40,000 acres, about 40 miles southwest of Birmingham, Ala. The project includes about 250-miles of low-pressure gas flow lines to almost 400 wells. The centralized system is less costly than a satellite station to build and operate. Unlike a satellite station that requires each compressor to have a complete set of ancillary equipment, the centralized system requires only one suction manifold, one dehydration setup, and one metering facility for every five compressor sets.

  10. Multilevel converters -- A new breed of power converters

    SciTech Connect

    Lai, J.S.; Peng, F.Z. |

    1995-09-01

    Multilevel voltage source converters are emerging as a new breed of power converter options for high-power applications. The multilevel voltage source converters typically synthesize the staircase voltage wave from several levels of dc capacitor voltages. One of the major limitations of the multilevel converters is the voltage unbalance between different levels. The techniques to balance the voltage between different levels normally involve voltage clamping or capacitor charge control. There are several ways of implementing voltage balance in multilevel converters. Without considering the traditional magnetic coupled converters, this paper presents three recently developed multilevel voltage source converters: (1) diode-clamp, (2) flying-capacitors, and (3) cascaded-inverters with separate dc sources. The operating principle, features, constraints, and potential applications of these converters will be discussed.

  11. Multilevel design optimization and the effect of epistemic uncertainty

    NASA Astrophysics Data System (ADS)

    Nesbit, Benjamin Edward

    This work presents the state of the art in hierarchically decomposed multilevel optimization. This work is expanded with the inclusion of evidence theory with the multilevel framework for the quantification of epistemic uncertainty. The novel method, Evidence-Based Multilevel Design optimization, is then used to solve two analytical optimization problems. This method is also used to explore the effect of the belief structure on the final solution. A methodology is presented to reduce the costs of evidence-based optimization through manipulation of the belief structure. In addition, a transport aircraft wing is also solved with multilevel optimization without uncertainty. This complex, real world optimization problem shows the capability of decomposed multilevel framework to reduce costs of solving computationally expensive problems with black box analyses.

  12. Sticky interconnect for solution-processed tandem solar cells.

    PubMed

    Tung, Vincent C; Kim, Jaemyung; Cote, Laura J; Huang, Jiaxing

    2011-06-22

    Graphene oxide (GO) can be viewed as a two-dimensional, random diblock copolymer with distributed nanosize graphitic patches and highly oxidized domains, thus capable of guiding the assembly of other materials through both π-π stacking and hydrogen bonding. Upon mixing GO and conducting polymer poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) in water, a dispersion with dramatically increased viscosity is obtained, which turns into sticky thin films upon casting. Surprisingly, the insulating GO makes PEDOT much more conductive by altering its chain conformation and morphology. The GO/PEDOT gel can function as a metal-free solder for creating mechanical and electrical connections in organic optoelectronic devices. As a proof-of-concept, polymer tandem solar cells have been fabricated by a direct adhesive lamination process enabled by the sticky GO/PEDOT film. The sticky interconnect can greatly simplify the fabrication of organic tandem architectures, which has been quite challenging via solution processing. Thus, it could facilitate the construction of high-efficiency tandem solar cells with different combinations of solution-processable materials. PMID:21615169

  13. Multilevel converters for large electric drives

    SciTech Connect

    Tolbert, L.M.; Peng, F.Z.

    1997-11-01

    Traditional two-level high frequency pulse width modulation (PWM) inverters for motor drives have several problems associated with their high frequency switching which produces common-mode voltage and high voltage change (dV/dt) rates to the motor windings. Multilevel inverters solve these problems because their devices can switch at a much lower frequency. Two different multilevel topologies are identified for use as a converter for electric drives, a cascade inverter with separate dc sources and a back-to-back diode clamped converter. The cascade inverter is a natural fit for large automotive all electric drives because of the high VA ratings possible and because it uses several levels of dc voltage sources which would be available from batteries or fuel cells. The back to back diode damped converter is ideal where a source of ac voltage is available such as a hybrid electric vehicle. Simulation and experimental results show the superiority of these two converters over PWM based drives.

  14. The treatment for multilevel noncontiguous spinal fractures

    PubMed Central

    Lian, Xiao Feng; Hou, Tie Sheng; Yuan, Jian Dong; Jin, Gen Yang; Li, Zhong Hai

    2006-01-01

    We report the outcome of 30 patients with multilevel noncontiguous spinal fractures treated between 2000 and 2005. Ten cases were treated conservatively (group A), eight cases were operated on at only one level (group B), and 12 cases were treated surgically at both levels (group C). All cases were followed up for 14–60 months (mean 32 months). Initial mobilisation with a wheelchair or crutches in group A was 9.2±1.1 weeks, which was significantly longer than groups B and C with 6.8±0.7 weeks and 3.1±0.4 weeks, respectively. Operative time and blood loss in group C were significantly more than group B. The neurological deficit improved in six cases in group A (60%), six in group B (75%) and eight in group C (80%). Correction of kyphotic deformity was significantly superior in groups C and B at the operated level, and increasing deformity occurred in groups A and B at the non-operated level. From the results we believe that three treatment strategies were suitable for multilevel noncontiguous spinal fractures, and individualised treatment should be used in these patients. In the patients treated surgically, the clinical and radiographic outcomes are much better. PMID:17043863

  15. Plasma simulation studies using multilevel physics models

    SciTech Connect

    Park, W.; Belova, E.V.; Fu, G.Y.

    2000-01-19

    The question of how to proceed toward ever more realistic plasma simulation studies using ever increasing computing power is addressed. The answer presented here is the M3D (Multilevel 3D) project, which has developed a code package with a hierarchy of physics levels that resolve increasingly complete subsets of phase-spaces and are thus increasingly more realistic. The rationale for the multilevel physics models is given. Each physics level is described and examples of its application are given. The existing physics levels are fluid models (3D configuration space), namely magnetohydrodynamic (MHD) and two-fluids; and hybrid models, namely gyrokinetic-energetic-particle/MHD (5D energetic particle phase-space), gyrokinetic-particle-ion/fluid-electron (5D ion phase-space), and full-kinetic-particle-ion/fluid-electron level (6D ion phase-space). Resolving electron phase-space (5D or 6D) remains a future project. Phase-space-fluid models are not used in favor of delta f particle models. A practical and accurate nonlinear fluid closure for noncollisional plasmas seems not likely in the near future.

  16. Modelling of asymmetrical interconnect T-tree laminated on flexible substrate

    NASA Astrophysics Data System (ADS)

    Ravelo, Blaise

    2015-11-01

    A fast and accurate behavioral modelling of asymmetrical microstrip tree printed on plastic substrate is investigated. The methodology for extracting the asymmetrical tree transfer responses based on the ABCD-matrix analysis is presented. The elements of the interconnect T-tree are constituted by transmission lines (TLs) defined by their characteristic impedance and physical length. The distributed tree network can be assumed as a single input multiple output (SIMO) topology. By considering the circuit equivalent between the electrical path from the tree input and output, the single input single output (SISO) simplified circuit can be established. In order to determine the frequency response of the interconnect tree system, the elementary TLs constituting the tree branches are modelled with their equivalent frequency dependent RLCG network. The novelty of the present paper is the application of the model to the microstrip structure printed on the plastic substrate by analyzing the influence of the metallization conductivity. As proof of concept (POC), a single input and three output distributed interconnect T-tree having branches presented physical lengths from 3 cm to 20 cm was designed. The POC was printed on the Cu metal deposited plastic Kapton substrate. Then, the frequency dependent per unit length resistance, inductance, capacitance and conductance of the elementary branches of the T-tree from DC to 10 GHz were extracted. By implementing the behavioral model of the circuit, the frequency- and time-domain responses of the proposed asymmetrical T-tree are computed. Then, the analyses of the asymmetrical T-tree responses in function of the thin film conductivity of the microstrip interconnect lines were discussed. In addition, time domain analysis enabling to predict the influence of the deposited metallic ink conductivity on the signal integrity is realized by considering a mixed signal corresponding to the digital data "010110000" having 0.5 Gbps rate

  17. Surface-normal cascaded planar interconnection with easy alignment

    NASA Astrophysics Data System (ADS)

    Kakizaki, Sunao; Horan, Paul; Hegarty, John

    1995-11-01

    A robust scheme for the surface-normal optical interconnection of arrays of optoelectronic devices is demonstrated. Allowing for inversion, the optical system maintains registration between input and image planes in one direction and full registration between every second plane, thus making for stable and accurate interconnection between elements of arrays.

  18. 78 FR 73239 - Small Generator Interconnection Agreements and Procedures

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-12-05

    ... about system conditions at a Point of Interconnection in order to help that customer select the best... Interconnection Customer with the option of requesting from the Transmission Provider a pre-application report... SGIP; revise the customer options meeting and the supplemental review following failure of the...

  19. Updating Small Generator Interconnection Procedures for New Market Conditions

    SciTech Connect

    Coddington, M.; Fox, K.; Stanfield, S.; Varnado, L.; Culley, T.; Sheehan, M.

    2012-12-01

    Federal and state regulators are faced with the challenge of keeping interconnection procedures updated against a backdrop of evolving technology, new codes and standards, and considerably transformed market conditions. This report is intended to educate policymakers and stakeholders on beneficial reforms that will keep interconnection processes efficient and cost-effective while maintaining a safe and reliable power system.

  20. 14 CFR 25.701 - Flap and slat interconnection.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... sides of the plane of symmetry must be synchronized by a mechanical interconnection or approved... engines on one side of the plane of symmetry inoperative and the remaining engines at takeoff power. (c... resulting when interconnected flap or slat surfaces on one side of the plane of symmetry are jammed...

  1. 14 CFR 25.701 - Flap and slat interconnection.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... sides of the plane of symmetry must be synchronized by a mechanical interconnection or approved... engines on one side of the plane of symmetry inoperative and the remaining engines at takeoff power. (c... resulting when interconnected flap or slat surfaces on one side of the plane of symmetry are jammed...

  2. 14 CFR 25.701 - Flap and slat interconnection.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... sides of the plane of symmetry must be synchronized by a mechanical interconnection or approved... engines on one side of the plane of symmetry inoperative and the remaining engines at takeoff power. (c... resulting when interconnected flap or slat surfaces on one side of the plane of symmetry are jammed...

  3. 14 CFR 25.701 - Flap and slat interconnection.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... sides of the plane of symmetry must be synchronized by a mechanical interconnection or approved... engines on one side of the plane of symmetry inoperative and the remaining engines at takeoff power. (c... resulting when interconnected flap or slat surfaces on one side of the plane of symmetry are jammed...

  4. 14 CFR 25.701 - Flap and slat interconnection.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... sides of the plane of symmetry must be synchronized by a mechanical interconnection or approved... engines on one side of the plane of symmetry inoperative and the remaining engines at takeoff power. (c... resulting when interconnected flap or slat surfaces on one side of the plane of symmetry are jammed...

  5. 14 CFR 25.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 14 Aeronautics and Space 1 2013-01-01 2013-01-01 false Flow between interconnected tanks. 25.957 Section 25.957 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION, DEPARTMENT OF TRANSPORTATION AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY AIRPLANES Powerplant Fuel System § 25.957 Flow between interconnected tanks. If fuel can be...

  6. 14 CFR 29.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 14 Aeronautics and Space 1 2013-01-01 2013-01-01 false Flow between interconnected tanks. 29.957 Section 29.957 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION, DEPARTMENT OF TRANSPORTATION AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Powerplant Fuel System § 29.957 Flow between interconnected tanks. (a) Where...

  7. Determining the Utility Value of Water-Supply Interconnections.

    ERIC Educational Resources Information Center

    Hardman, James L.; Cheremisinoff, Paul N.

    1979-01-01

    This article is the third in a series which discusses a mathematical methodology for evaluating interconnections of water supply systems. The model can be used to analyze the carrying capacity of proposed links or predict the impact of abandoning interconnections. (AS)

  8. ENVIRONMENTAL-HUMAN HEALTH INTERCONNECTIONS: A WORKSHOP REPORT

    EPA Science Inventory

    A Pellston Workshop jointly sponsored by SETAC and SOT to discuss this topic of "Interconnections" was held in June, 2000 in Snowbird, Utah. This workshop was motivated by a deep concern shared by many human health, environmental, and social scientists for the interconnections, ...

  9. Optical backplane interconnect switch for data processors and computers

    NASA Technical Reports Server (NTRS)

    Hendricks, Herbert D.; Benz, Harry F.; Hammer, Jacob M.

    1989-01-01

    An optoelectronic integrated device design is reported which can be used to implement an all-optical backplane interconnect switch. The switch is sized to accommodate an array of processors and memories suitable for direct replacement into the basic avionic multiprocessor backplane. The optical backplane interconnect switch is also suitable for direct replacement of the PI bus traffic switch and at the same time, suitable for supporting pipelining of the processor and memory. The 32 bidirectional switchable interconnects are configured with broadcast capability for controls, reconfiguration, and messages. The approach described here can handle a serial interconnection of data processors or a line-to-link interconnection of data processors. An optical fiber demonstration of this approach is presented.

  10. Solar-cell interconnect design for terrestrial photovoltaic modules

    NASA Technical Reports Server (NTRS)

    Mon, G. R.; Moore, D. M.; Ross, R. G., Jr.

    1984-01-01

    Useful solar cell interconnect reliability design and life prediction algorithms are presented, together with experimental data indicating that the classical strain cycle (fatigue) curve for the interconnect material does not account for the statistical scatter that is required in reliability predictions. This shortcoming is presently addressed by fitting a functional form to experimental cumulative interconnect failure rate data, which thereby yields statistical fatigue curves enabling not only the prediction of cumulative interconnect failures during the design life of an array field, but also the quantitative interpretation of data from accelerated thermal cycling tests. Optimal interconnect cost reliability design algorithms are also derived which may allow the minimization of energy cost over the design life of the array field.

  11. Fuel cell electrode interconnect contact material encapsulation and method

    DOEpatents

    Derose, Anthony J.; Haltiner, Jr., Karl J.; Gudyka, Russell A.; Bonadies, Joseph V.; Silvis, Thomas W.

    2016-05-31

    A fuel cell stack includes a plurality of fuel cell cassettes each including a fuel cell with an anode and a cathode. Each fuel cell cassette also includes an electrode interconnect adjacent to the anode or the cathode for providing electrical communication between an adjacent fuel cell cassette and the anode or the cathode. The interconnect includes a plurality of electrode interconnect protrusions defining a flow passage along the anode or the cathode for communicating oxidant or fuel to the anode or the cathode. An electrically conductive material is disposed between at least one of the electrode interconnect protrusions and the anode or the cathode in order to provide a stable electrical contact between the electrode interconnect and the anode or cathode. An encapsulating arrangement segregates the electrically conductive material from the flow passage thereby, preventing volatilization of the electrically conductive material in use of the fuel cell stack.

  12. Optimum intermediate fibers for reducing interconnection loss: exact solution.

    PubMed

    Yablon, Andrew D; Sumetsky, M

    2007-03-15

    We derive an exact analytical solution for a transmission line of N single-mode intermediate optical fibers that minimize the interconnection loss between any two dissimilar fiber modes that are well described by that paraxial scalar wave equation. Our solution shows that N optimum intermediate fibers reduce the original interconnection loss by a factor of least 1/(N+1) and that the total interconnection loss is only a function of N and the original direct interconnection loss. Our solution is not restricted to axisymmetric fibers or mode fields and therefore could be useful for reducing the interconnection loss between microstructured optical fibers, between certain slab waveguides, or between fibers and optical sources or detectors.

  13. Solid-state energy storage module employing integrated interconnect board

    DOEpatents

    Rouillard, Jean; Comte, Christophe; Daigle, Dominik; Hagen, Ronald A.; Knudson, Orlin B.; Morin, Andre; Ranger, Michel; Ross, Guy; Rouillard, Roger; St-Germain, Philippe; Sudano, Anthony; Turgeon, Thomas A.

    2004-09-28

    An electrochemical energy storage device includes a number of solid-state thin-film electrochemical cells which are selectively interconnected in series or parallel through use of an integrated interconnect board. The interconnect board is typically disposed within a sealed housing which also houses the electrochemical cells, and includes a first contact and a second contact respectively coupled to first and second power terminals of the energy storage device. The interconnect board advantageously provides for selective series or parallel connectivity with the electrochemical cells, irrespective of electrochemical cell position within the housing. Fuses and various electrical and electro-mechanical devices, such as bypass, equalization, and communication devices for example, may also be mounted to the interconnect board and selectively connected to the electrochemical cells.

  14. Solid-state energy storage module employing integrated interconnect board

    DOEpatents

    Rouillard, Jean; Comte, Christophe; Daigle, Dominik; Hagen, Ronald A.; Knudson, Orlin B.; Morin, Andre; Ranger, Michel; Ross, Guy; Rouillard, Roger; St-Germain, Philippe; Sudano, Anthony; Turgeon, Thomas A.

    2003-11-04

    The present invention is directed to an improved electrochemical energy storage device. The electrochemical energy storage device includes a number of solid-state, thin-film electrochemical cells which are selectively interconnected in series or parallel through use of an integrated interconnect board. The interconnect board is typically disposed within a sealed housing which also houses the electrochemical cells, and includes a first contact and a second contact respectively coupled to first and second power terminals of the energy storage device. The interconnect board advantageously provides for selective series or parallel connectivity with the electrochemical cells, irrespective of electrochemical cell position within the housing. Fuses and various electrical and electromechanical devices, such as bypass, equalization, and communication devices for example, may also be mounted to the interconnect board and selectively connected to the electrochemical cells.

  15. Method of producing microporous joints in metal bodies

    DOEpatents

    Danko, Joseph C.

    1982-01-01

    Tungsten is placed in contact with either molybdenum, tantalum, niobium, vanadium, rhenium, or other metal of atoms having a different diffusion coefficient than tungsten. The metals are heated so that the atoms having the higher diffusion coefficient migrate to the metal having the lower diffusion rate, leaving voids in the higher diffusion coefficient metal. Heating is continued until the voids are interconnected.

  16. Ultra-low energy photoreceivers for optical interconnects

    NASA Astrophysics Data System (ADS)

    Going, Ryan Wayne

    Optical interconnects are increasingly important for our communication and data center systems, and are forecasted to be an essential component of future computers. In order to meet these future demands, optical interconnects must be improved to consume less power than they do today. To do this, both more efficient transmitters and more sensitive receivers must be developed. This work addresses the latter, focusing on device level improvements to tightly couple a low capacitance photodiode with the first stage transistor of the receiver as a single phototransistor device. First I motivate the need for a coupled phototransistor using a simple circuit model which shows how receiver sensitivity is determined by photodiode capacitance and the length of wire connecting it to the first transistor in a receiver amplifier. Then I describe our use of the unique rapid melt growth technique, which is used to integrate crystalline germanium on silicon photonics substrates without an epitaxial reactor. The resulting material quality is demonstrated with high quality (0.95 A/W, 40+ GHz) germanium photodiodes on silicon waveguides. Next I describe two germanium phototransistors I have developed. One is a germanium- gated MOSFET on silicon photonics which has up to 18 A/W gate-controlled responsivity at 1550 nm. Simulations show how MOSFET scaling rules can be easily applied to increase both speed and sensitivity. The second is a floating base germanium bipolar phototransistor on silicon photonics with a 15 GHz gain x bandwidth product. The photoBJT also has a clear scaling path, and it is proposed to create a separate gain and absorption region photoBJT to realize the maximum benefit of scaling the BJT without negatively affecting its absorption and photocarrier collection. Following this design a 120 GHz gain x bandwidth photoBJT is simulated. Finally I present a metal-cavity, which can have over 50% quantum efficiency absorption in sub-100 aF germanium photodiodes, which

  17. Energy and water in the Western and Texas interconnects.

    SciTech Connect

    Tidwell, Vincent Carroll

    2010-08-01

    The Department of Energy's Office of Electricity has initiated a $60M program to assist the electric industry in interconnection-level analysis and planning. The objective of this effort is to facilitate the development or strengthening of capabilities in each of the three interconnections serving the lower 48 states of the United States, to prepare analyses of transmission requirements under a broad range of alternative futures and develop long-term interconnection-wide transmission expansion plans. The interconnections are the Western Interconnection, the Eastern Interconnection, and the Texas Interconnection. One element of this program address the support and development of an integrated energy-water Decision Support System (DSS) that will enable planners in the Western and Texas Interconnections to analyze the potential implications of water stress for transmission and resource planning (the Eastern Interconnection is not participating in this element). Specific objectives include: (1) Develop an integrated Energy-Water Decision Support System (DSS) that will enable planners in the Western and Texas Interconnections to analyze the potential implications of water stress for transmission and resource planning. (2) Pursue the formulation and development of the Energy-Water DSS through a strongly collaborative process between members of this proposal team and the Western Electricity Coordinating Council (WECC), Western Governors Association (WGA), the Electric Reliability Council of Texas (ERCOT) and their associated stakeholder teams. (3) Exercise the Energy-Water DSS to investigate water stress implications of the transmission planning scenarios put forward by WECC, WGA, and ERCOT. The goals of this project are: (1) Develop an integrated Energy-Water Decision Support System (DSS) that will enable planners to analyze the potential implications of water stress for transmission and resource planning. (2) Pursue the formulation and development of the Energy

  18. 76 FR 45248 - PJM Interconnection, L.L.C., PJM Power Providers Group v. PJM Interconnection, L.L.C...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2011-07-28

    ... Energy Regulatory Commission PJM Interconnection, L.L.C., PJM Power Providers Group v. PJM Interconnection, L.L.C.; Supplemental Notice of Staff Technical Conference On June 13, 2011, the Commission issued... Resources Services, Inc., Maryland Public Service Commission, Monitoring Analytics, L.L.C., National...

  19. Monte Carlo Method Applied to the ABV Model of an Interconnect Alloy

    NASA Astrophysics Data System (ADS)

    Dahoo, P. R.; Linares, J.; Chiruta, D.; Chong, C.; Pougnet, P.; Meis, C.; El Hami, A.

    2016-08-01

    A Monte Carlo (MC) simulation of a 2D microscopic ABV (metal A, metal B and void V) Ising model of an interconnect alloy is performed by taking into account results of Finite Element methods (FEM) calculations on correlated void-thermal effects. The evolution of a homogeneous structure of a binary alloy containing a small percentage of voids is studied with temperature cycling. The diffusion of voids and segregation of A type or B type metals is a function of the relative interaction energy of the different pairs AA, BB, AB, AV and BV, the initial concentrations of A, B and V and local heating effect due to the presence of clusters of voids. Voids segregates in a matrix of A type, of B type or AB type and form large localized clusters or smaller delocalized ones of different shapes.

  20. [Applying multilevel models in evaluation of bioequivalence (I)].

    PubMed

    Liu, Qiao-lan; Shen, Zhuo-zhi; Chen, Feng; Li, Xiao-song; Yang, Min

    2009-12-01

    This study aims to explore the application value of multilevel models for bioequivalence evaluation. Using a real example of 2 x 4 cross-over experimental design in evaluating bioequivalence of antihypertensive drug, this paper explores complex variance components corresponding to criteria statistics in existing methods recommended by FDA but obtained in multilevel models analysis. Results are compared with those from FDA standard Method of Moments, specifically on the feasibility and applicability of multilevel models in directly assessing the bioequivalence (ABE), the population bioequivalence (PBE) and the individual bioequivalence (IBE). When measuring ln (AUC), results from all variance components of the test and reference groups such as total variance (sigma(TT)(2) and sigma(TR)(2)), between-subject variance (sigma(BT)(2) and sigma(BR)(2)) and within-subject variance (sigma(WT)(2) and sigma(WR)(2)) estimated by simple 2-level models are very close to those that using the FDA Method of Moments. In practice, bioequivalence evaluation can be carried out directly by multilevel models, or by FDA criteria, based on variance components estimated from multilevel models. Both approaches produce consistent results. Multilevel models can be used to evaluate bioequivalence in cross-over test design. Compared to FDA methods, this one is more flexible in decomposing total variance into sub components in order to evaluate the ABE, PBE and IBE. Multilevel model provides a new way into the practice of bioequivalence evaluation.

  1. Mapping of interconnection of climate risks

    NASA Astrophysics Data System (ADS)

    Yokohata, Tokuta; Tanaka, Katsumasa; Nishina, Kazuya; Takanashi, Kiyoshi; Emori, Seita; Kiguchi, Masashi; Iseri, Yoshihiko; Honda, Yasushi; Okada, Masashi; Masaki, Yoshimitsu; Yamamoto, Akitomo; Shigemitsu, Masahito; Yoshimori, Masakazu; Sueyoshi, Tetsuo; Iwase, Kenta; Hanasaki, Naota; Ito, Akihiko; Sakurai, Gen; Iizumi, Toshichika; Oki, Taikan

    2015-04-01

    Anthropogenic climate change possibly causes various impacts on human society and ecosystem. Here, we call possible damages or benefits caused by the future climate change as "climate risks". Many climate risks are closely interconnected with each other by direct cause-effect relationship. In this study, the major climate risks are comprehensively summarized based on the survey of studies in the literature using IPCC AR5 etc, and their cause-effect relationship are visualized by a "network diagram". This research is conducted by the collaboration between the experts of various fields, such as water, energy, agriculture, health, society, and eco-system under the project called ICA-RUS (Integrated Climate Assessment - Risks, Uncertainties and Society). First, the climate risks are classified into 9 categories (water, energy, food, health, disaster, industry, society, ecosystem, and tipping elements). Second, researchers of these fields in our project survey the research articles, and pick up items of climate risks, and possible cause-effect relationship between the risk items. A long list of the climate risks is summarized into ~130, and that of possible cause-effect relationship between the risk items is summarized into ~300, because the network diagram would be illegible if the number of the risk items and cause-effect relationship is too large. Here, we only consider the risks that could occur if climate mitigation policies are not conducted. Finally, the chain of climate risks is visualized by creating a "network diagram" based on a network graph theory (Fruchtman & Reingold algorithm). Through the analysis of network diagram, we find that climate risks at various sectors are closely related. For example, the decrease in the precipitation under the global climate change possibly causes the decrease in river runoff and the decrease in soil moisture, which causes the changes in crop production. The changes in crop production can have an impact on society by

  2. Evolution of Multilevel Social Systems in Nonhuman Primates and Humans.

    PubMed

    Grueter, Cyril C; Chapais, Bernard; Zinner, Dietmar

    2012-10-01

    Multilevel (or modular) societies are a distinct type of primate social system whose key features are single-male-multifemale, core units nested within larger social bands. They are not equivalent to fission-fusion societies, with the latter referring to routine variability in associations, either on an individual or subunit level. The purpose of this review is to characterize and operationalize multilevel societies and to outline their putative evolutionary origins. Multilevel societies are prevalent in three primate clades: papionins, Asian colobines, and hominins. For each clade, we portray the most parsimonious phylogenetic pathway leading to a modular system and then review and discuss likely socioecological conditions promoting the establishment and maintenance of these societies. The multilevel system in colobines (most notably Rhinopithecus and Nasalis) has likely evolved as single-male harem systems coalesced, whereas the multilevel system of papionins (Papio hamadryas, Theropithecus gelada) and hominins most likely arose as multimale-multifemale groups split into smaller units. We hypothesize that, although ecological conditions acted as preconditions for the origin of multilevel systems in all three clades, a potentially important catalyst was intraspecific social threat, predominantly bachelor threat in colobines and female coercion/infanticide in papionins and humans. We emphasize that female transfers within bands or genetic relationships among leader males help to maintain modular societies by facilitating interunit tolerance. We still lack a good or even basic understanding of many facets of multilevel sociality. Key remaining questions are how the genetic structure of a multilevel society matches the observed social effort of its members, to what degree cooperation of males of different units is manifest and contributes to band cohesion, and how group coordination, communication, and decision making are achieved. Affiliative and cooperative

  3. Producing thin film photovoltaic modules with high integrity interconnects and dual layer contacts

    DOEpatents

    Jansen, Kai W.; Maley, Nagi

    2000-01-01

    High performance photovoltaic modules are produced with improved interconnects by a special process. Advantageously, the photovoltaic modules have a dual layer back (rear) contact and a front contact with at least one layer. The front contact and the inner layer of the back contact can comprise a transparent conductive oxide. The outer layer of the back contact can comprise a metal or metal oxide. The front contact can also have a dielectric layer. In one form, the dual layer back contact comprises a zinc oxide inner layer and an aluminum outer layer and the front contact comprises a tin oxide inner layer and a silicon dioxide dielectric outer layer. One or more amorphous silicon-containing thin film semiconductors can be deposited between the front and back contacts. The contacts can be positioned between a substrate and an optional superstrate. During production, the transparent conductive oxide layer of the front contact is scribed by a laser, then the amorphous silicon-containing semiconductors and inner layer of the dual layer back contact are simultaneously scribed and trenched (drilled) by the laser and the trench is subsequently filled with the same metal as the outer layer of the dual layer back contact to provide a superb mechanical and electrical interconnect between the front contact and the outer layer of the dual layer back contact. The outer layer of the dual layer back contact can then be scribed by the laser. For enhanced environmental protection, the photovoltaic modules can be encapsulated.

  4. Producing thin film photovoltaic modules with high integrity interconnects and dual layer contacts

    DOEpatents

    Jansen, Kai W.; Maley, Nagi

    2001-01-01

    High performance photovoltaic modules are produced with improved interconnects by a special process. Advantageously, the photovoltaic modules have a dual layer back (rear) contact and a front contact with at least one layer. The front contact and the inner layer of the back contact can comprise a transparent conductive oxide. The outer layer of the back contact can comprise a metal or metal oxide. The front contact can also have a dielectric layer. In one form, the dual layer back contact comprises a zinc oxide inner layer and an aluminum outer layer and the front contact comprises a tin oxide inner layer and a silicon dioxide dielectric outer layer. One or more amorphous silicon-containing thin film semiconductors can be deposited between the front and back contacts. The contacts can be positioned between a substrate and an optional superstrate. During production, the transparent conductive oxide layer of the front contact is scribed by a laser, then the amorphous silicon-containing semiconductors and inner layer of the dual layer back contact are simultaneously scribed and trenched (drilled) by the laser and the trench is subsequently filled with the same metal as the outer layer of the dual layer back contact to provide a superb mechanical and electrical interconnect between the front contact and the outer layer of the dual layer back contact. The outer layer of the dual layer back contact can then be scribed by the laser. For enhanced environmental protection, the photovoltaic modules can be encapsulated.

  5. Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects

    NASA Astrophysics Data System (ADS)

    Chiodarelli, Nicolo'; Masahito, Sugiura; Kashiwagi, Yusaku; Li, Yunlong; Arstila, Kai; Richard, Olivier; Cott, Daire J.; Heyns, Marc; De Gendt, Stefan; Groeseneken, Guido; Vereecken, Philippe M.

    2011-02-01

    Carbon nanotubes (CNT) are known to be materials with potential for manufacturing sub-20 nm high aspect ratio vertical interconnects in future microchips. In order to be successful with respect to contending against established tungsten or copper based interconnects, though, CNT must fulfil their promise of also providing low electrical resistance in integrated structures using scalable integration processes fully compatible with silicon technology. Hence, carefully engineered growth and integration solutions are required before we can fully exploit their potentialities. This work tackles the problem of optimizing a CNT integration process from the electrical perspective. The technique of measuring the CNT resistance as a function of the CNT length is here extended to CNT integrated in vertical contacts. This allows extracting the linear resistivity and the contact resistance of the CNT, two parameters to our knowledge never reported separately for vertical CNT contacts and which are of utmost importance, as they respectively measure the quality of the CNT and that of their metal contacts. The technique proposed allows electrically distinguishing the impact of each processing step individually on the CNT resistivity and the CNT contact resistance. Hence it constitutes a powerful technique for optimizing the process and developing CNT contacts of superior quality. This can be of relevant technological importance not only for interconnects but also for all those applications that rely on the electrical properties of CNT grown with a catalytic chemical vapor deposition method at low temperature.

  6. A sewing-enabled stitch-and-transfer method for robust, ultra-stretchable, conductive interconnects

    NASA Astrophysics Data System (ADS)

    Rahimi, Rahim; Ochoa, Manuel; Yu, Wuyang; Ziaie, Babak

    2014-09-01

    Fabricating highly stretchable and robust electrical interconnects at low-cost remains an unmet challenge in stretchable electronics. Previously reported stretchable interconnects require complicated fabrication processes with resulting devices exhibiting limited stretchability, poor reliability, and large gauge factors. Here, we demonstrate a novel sew-and-transfer method for rapid fabrication of low-cost, highly stretchable interconnects. Using a commercial sewing machine and double-thread stitch with one of the threads being water soluble polyvinyl alcohol (PVA), thin zigzag-pattern metallic wires are sewn into a polymeric film and are subsequently transferred onto a stretchable elastomeric substrate by dissolving PVA in warm water. The resulting structures exhibit extreme stretchability (exceeding 500% strain for a zigzag angle of 18 °) and robustness (capable of withstanding repeated stretch-and-release cycles of 15000 at 110% strain, 50000 at 55% strain, and  > 120000 at 30% strain without any noticeable change in resistance even at maximum strain levels). Using this technique, we demonstrate a stretchable inductive strain sensor for monitoring balloon expansion in a Foley urinary catheter capable of detecting the balloon diameter change from 9 mm to 38 mm with an average sensitivity of 4 nH/mm.

  7. CO2 laser micromachining of optical waveguides for interconnection on circuit boards

    NASA Astrophysics Data System (ADS)

    Zakariyah, Shefiu S.; Conway, Paul P.; Hutt, David A.; Wang, Kai; Selviah, David R.

    2012-12-01

    The introduction of microvia and surface mount technologies into the manufacturing process for printed circuit boards (PCBs) has significantly improved the interconnection density. However, as the speed of signals for data communication on the board approaches and begins to exceed 10 Gb/s, the loss and crosstalk of copper interconnections increase. To resolve these problems, optical interconnections (OI) have been suggested as a viable solution. Literature reports have proved the photochemical nature of excimer laser ablation with its minimal thermal effect, and other ultra-violet lasers are also being investigated for the fabrication of polymer waveguides by laser ablation. In this paper, the authors demonstrate the fabrication of multimode optical polymer waveguides by using infra-red 10.6 μm CO2 laser micromachining to etch acrylate-based photopolymer (Truemode™). CO2 lasers offer a low cost and high speed fabrication route as CO2 lasers can be used to cut through various engineering materials including polymers and metals. The paper characterises the relationship between the laser ablation power, the fabrication speed and the resulting effect on the waveguide optical insertion loss for the first time.

  8. Adaptive optical interconnects: the ADDAPT project

    NASA Astrophysics Data System (ADS)

    Henker, Ronny; Pliva, Jan; Khafaji, Mahdi; Ellinger, Frank; Toifl, Thomas; Offrein, Bert; Cevrero, Alessandro; Oezkaya, Ilter; Seifried, Marc; Ledentsov, Nikolay; Kropp, Joerg-R.; Shchukin, Vitaly; Zoldak, Martin; Halmo, Leos; Turkiewicz, Jaroslaw; Meredith, Wyn; Eddie, Iain; Georgiades, Michael; Charalambides, Savvas; Duis, Jeroen; van Leeuwen, Pieter

    2015-09-01

    Existing optical networks are driven by dynamic user and application demands but operate statically at their maximum performance. Thus, optical links do not offer much adaptability and are not very energy-efficient. In this paper a novel approach of implementing performance and power adaptivity from system down to optical device, electrical circuit and transistor level is proposed. Depending on the actual data load, the number of activated link paths and individual device parameters like bandwidth, clock rate, modulation format and gain are adapted to enable lowering the components supply power. This enables flexible energy-efficient optical transmission links which pave the way for massive reductions of CO2 emission and operating costs in data center and high performance computing applications. Within the FP7 research project Adaptive Data and Power Aware Transceivers for Optical Communications (ADDAPT) dynamic high-speed energy-efficient transceiver subsystems are developed for short-range optical interconnects taking up new adaptive technologies and methods. The research of eight partners from industry, research and education spanning seven European countries includes the investigation of several adaptive control types and algorithms, the development of a full transceiver system, the design and fabrication of optical components and integrated circuits as well as the development of high-speed, low loss packaging solutions. This paper describes and discusses the idea of ADDAPT and provides an overview about the latest research results in this field.

  9. Maximizing algebraic connectivity in interconnected networks

    NASA Astrophysics Data System (ADS)

    Shakeri, Heman; Albin, Nathan; Darabi Sahneh, Faryad; Poggi-Corradini, Pietro; Scoglio, Caterina

    2016-03-01

    Algebraic connectivity, the second eigenvalue of the Laplacian matrix, is a measure of node and link connectivity on networks. When studying interconnected networks it is useful to consider a multiplex model, where the component networks operate together with interlayer links among them. In order to have a well-connected multilayer structure, it is necessary to optimally design these interlayer links considering realistic constraints. In this work, we solve the problem of finding an optimal weight distribution for one-to-one interlayer links under budget constraint. We show that for the special multiplex configurations with identical layers, the uniform weight distribution is always optimal. On the other hand, when the two layers are arbitrary, increasing the budget reveals the existence of two different regimes. Up to a certain threshold budget, the second eigenvalue of the supra-Laplacian is simple, the optimal weight distribution is uniform, and the Fiedler vector is constant on each layer. Increasing the budget past the threshold, the optimal weight distribution can be nonuniform. The interesting consequence of this result is that there is no need to solve the optimization problem when the available budget is less than the threshold, which can be easily found analytically.

  10. PCB with fully integrated optical interconnects

    NASA Astrophysics Data System (ADS)

    Langer, Gregor; Satzinger, Valentin; Schmidt, Volker; Schmid, Gerhard; Leeb, Walter R.

    2011-01-01

    The increasing demand for miniaturization and design flexibility of polymer optical waveguides integrated into electrical printed circuit boards (PCB) calls for new coupling and integration concepts. We report on a method that allows the coupling of optical waveguides to electro-optical components as well as the integration of an entire optical link into the PCB. The electro-optical devices such as lasers and photodiodes are assembled on the PCB and then embedded in an optically transparent material. A focused femtosecond laser beam stimulates a polymerization reaction based on a two-photon absorption effect in the optical material and locally increases the refractive index of the material. In this way waveguide cores can be realized and the embedded components can be connected optically. This approach does not only allow a precise alignment of the waveguide end faces to the components but also offers a truly 3-dimensional routing capability of the waveguides. Using this technology we were able to realize butt-coupling and mirror-coupling interface solutions in several demonstrators. We were also manufacturing demonstrator boards with fully integrated driver and preamplifier chips, which show very low power consumption of down to 10 mW for about 2.5 Gbit/s. Furthermore, demonstrators with interconnects at two different optical layers were realized.

  11. Ceramic Interconnects with Low Sintering Temperature

    NASA Technical Reports Server (NTRS)

    Zhong, Zhi-Min; Goldsby, Jon C.

    2004-01-01

    Ceramic interconnects for use in solid oxide he1 cells are expected to operate between 900 to approximately 1000 C, sinter below 1400 C to allow co-firing and meet a number thermal mechanical requirements. The pervoskite type (ABO3) lanthanum chromite based materials have emerged as a leading candidate that will meet these criteria by varying the composition on the A and B sites. A need therefore exists to determine this material's temperature dependent electrical and mechanical properties with respect to these site substitutions. In this investigation oxide powders were prepared by the glycine-nitrate process. Ionic substitutions were carried out on A sites with Ca or Sr, and B sites with Co and Al, respectively. Only stoichiometric compositions were considered for the sake of stability. The powders and their ability to sinter were investigated by XRD, SEM, dilatometry and density measurements. The sintered materials were further examined by SEM, thermal expansion and electric conductivity measurements in order to elucidate the resulting microstructure, electrical and mechanical properties. In addition quantum mechanical calculations were performed to obtain insight into the effects of these dopants on the materials electronic band structure and lattice parameter.

  12. Maximizing algebraic connectivity in interconnected networks.

    PubMed

    Shakeri, Heman; Albin, Nathan; Darabi Sahneh, Faryad; Poggi-Corradini, Pietro; Scoglio, Caterina

    2016-03-01

    Algebraic connectivity, the second eigenvalue of the Laplacian matrix, is a measure of node and link connectivity on networks. When studying interconnected networks it is useful to consider a multiplex model, where the component networks operate together with interlayer links among them. In order to have a well-connected multilayer structure, it is necessary to optimally design these interlayer links considering realistic constraints. In this work, we solve the problem of finding an optimal weight distribution for one-to-one interlayer links under budget constraint. We show that for the special multiplex configurations with identical layers, the uniform weight distribution is always optimal. On the other hand, when the two layers are arbitrary, increasing the budget reveals the existence of two different regimes. Up to a certain threshold budget, the second eigenvalue of the supra-Laplacian is simple, the optimal weight distribution is uniform, and the Fiedler vector is constant on each layer. Increasing the budget past the threshold, the optimal weight distribution can be nonuniform. The interesting consequence of this result is that there is no need to solve the optimization problem when the available budget is less than the threshold, which can be easily found analytically. PMID:27078276

  13. Interconnected Cavernous Structure of Bacterial Fruiting Bodies

    PubMed Central

    Harvey, Cameron W.; Du, Huijing; Xu, Zhiliang; Kaiser, Dale; Aranson, Igor; Alber, Mark

    2012-01-01

    The formation of spore-filled fruiting bodies by myxobacteria is a fascinating case of multicellular self-organization by bacteria. The organization of Myxococcus xanthus into fruiting bodies has long been studied not only as an important example of collective motion of bacteria, but also as a simplified model for developmental morphogenesis. Sporulation within the nascent fruiting body requires signaling between moving cells in order that the rod-shaped self-propelled cells differentiate into spores at the appropriate time. Probing the three-dimensional structure of myxobacteria fruiting bodies has previously presented a challenge due to limitations of different imaging methods. A new technique using Infrared Optical Coherence Tomography (OCT) revealed previously unknown details of the internal structure of M. xanthus fruiting bodies consisting of interconnected pockets of relative high and low spore density regions. To make sense of the experimentally observed structure, modeling and computer simulations were used to test a hypothesized mechanism that could produce high-density pockets of spores. The mechanism consists of self-propelled cells aligning with each other and signaling by end-to-end contact to coordinate the process of differentiation resulting in a pattern of clusters observed in the experiment. The integration of novel OCT experimental techniques with computational simulations can provide new insight into the mechanisms that can give rise to the pattern formation seen in other biological systems such as dictyostelids, social amoeba known to form multicellular aggregates observed as slugs under starvation conditions. PMID:23300427

  14. Optics vs copper: from the perspective of "Thunderbolt" interconnect technology

    NASA Astrophysics Data System (ADS)

    Cheng, Hengju; Krause, Christine; Ko, Jamyuen; Gao, Miaobin; Liu, Guobin; Wu, Huichin; Qi, Mike; Lam, Chun-Chit

    2013-02-01

    Interconnect technology has been progressed at a very fast pace for the past decade. The signaling rates have steadily increased from 100:Mb/s to 25Gb/s. In every generation of interconnect technology evolution, optics always seems to take over at first, however, at the end, the cost advantage of copper wins over. Because of this, optical interconnects are limited to longer distance links where the attenuation in copper cable is too large for the integrated circuits to compensate. Optical interconnect has long been viewed as the premier solution in compared with copper interconnect. With the release of Thunderbolt technology, we are entering a new era in consumer electronics that runs at 10Gb/s line rate (20Gb/s throughput per connector interface). Thunderbolt interconnect technology includes both active copper cables and active optical cables as the transmission media which have very different physical characteristics. In order for optics to succeed in consumer electronics, several technology hurdles need to be cleared. For example, the optical cable needs to handle the consumer abuses such as pinch and bend. Also, the optical engine used in the active optical cable needs to be physically very small so that we don't change the looks and feels of the cable/connector. Most importantly, the cost of optics needs to come down significantly to effectively compete with the copper solution. Two interconnect technologies are compared and discussed on the relative cost, power consumption, form factor, density, and future scalability.

  15. Discrete fluorescent saturation regimes in multilevel systems

    NASA Technical Reports Server (NTRS)

    Kastner, S. O.; Bhatia, A. K.

    1988-01-01

    Using models of multilevel atoms, the fluorescent process was examined for the ratio of the photooxidation rate, Pij, to the collisional oxidation rate, Cij, in the pumped resonance transition i-j. It is shown that, in the full range of the parameter Pij/Cij, there exist three distinct regimes (I, II, and III) which may be usefully exploited. These regimes are defined, respectively, by the following conditions: Pij/Cij smaller than about 1; Pij/Cij much greater than 1 and Pij much lower than Cki; and Pij/Cij much greater than 1 and Pij much higher than Cki, where Cki is the collisional rate populating the source level i. The only regime which is characterized by the sensitivity of fluorescent-fluorescent line intensity ratios to Pij is regime I. If regime III is reached, even fluorescent-nonfluorescent line ratios become independent of Pij. The analysis is applied to the resonant photoexcitation of a carbonlike ion.

  16. Multilevel wireless capsule endoscopy video segmentation

    NASA Astrophysics Data System (ADS)

    Hwang, Sae; Celebi, M. Emre

    2010-03-01

    Wireless Capsule Endoscopy (WCE) is a relatively new technology (FDA approved in 2002) allowing doctors to view most of the small intestine. WCE transmits more than 50,000 video frames per examination and the visual inspection of the resulting video is a highly time-consuming task even for the experienced gastroenterologist. Typically, a medical clinician spends one or two hours to analyze a WCE video. To reduce the assessment time, it is critical to develop a technique to automatically discriminate digestive organs and shots each of which consists of the same or similar shots. In this paper a multi-level WCE video segmentation methodology is presented to reduce the examination time.

  17. Multi-level coupled cluster theory

    SciTech Connect

    Myhre, Rolf H.; Koch, Henrik; Sánchez de Merás, Alfredo M. J.

    2014-12-14

    We present a general formalism where different levels of coupled cluster theory can be applied to different parts of the molecular system. The system is partitioned into subsystems by Cholesky decomposition of the one-electron Hartree-Fock density matrix. In this way the system can be divided across chemical bonds without discontinuities arising. The coupled cluster wave function is defined in terms of cluster operators for each part and these are determined from a set of coupled equations. The total wave function fulfills the Pauli-principle across all borders and levels of electron correlation. We develop the associated response theory for this multi-level coupled cluster theory and present proof of principle applications. The formalism is an essential tool in order to obtain size-intensive complexity in the calculation of local molecular properties.

  18. Multilevel library instruction for emerging nursing roles.

    PubMed Central

    Francis, B W; Fisher, C C

    1995-01-01

    As new nursing roles emerge that involve greater decision making than in the past, added responsibility for outcomes and cost control, and increased emphasis on primary care, the information-seeking skills needed by nurses change. A search of library and nursing literature indicates that there is little comprehensive library instruction covering all levels of nursing programs: undergraduate, returning registered nurses, and graduate students. The University of Florida is one of the few places that has such a multilevel, course-integrated curriculum in place for all entrants into the nursing program. Objectives have been developed for each stage of learning. The courses include instruction in the use of the online public access catalog, printed resources, and electronic databases. A library classroom equipped with the latest technology enables student interaction with electronic databases. This paper discusses the program and several methods used to evaluate it. PMID:8547913

  19. Multilevel library instruction for emerging nursing roles.

    PubMed

    Francis, B W; Fisher, C C

    1995-10-01

    As new nursing roles emerge that involve greater decision making than in the past, added responsibility for outcomes and cost control, and increased emphasis on primary care, the information-seeking skills needed by nurses change. A search of library and nursing literature indicates that there is little comprehensive library instruction covering all levels of nursing programs: undergraduate, returning registered nurses, and graduate students. The University of Florida is one of the few places that has such a multilevel, course-integrated curriculum in place for all entrants into the nursing program. Objectives have been developed for each stage of learning. The courses include instruction in the use of the online public access catalog, printed resources, and electronic databases. A library classroom equipped with the latest technology enables student interaction with electronic databases. This paper discusses the program and several methods used to evaluate it. PMID:8547913

  20. Multilevel domain decomposition for electronic structure calculations

    SciTech Connect

    Barrault, M. . E-mail: maxime.barrault@edf.fr; Cances, E. . E-mail: cances@cermics.enpc.fr; Hager, W.W. . E-mail: hager@math.ufl.edu; Le Bris, C. . E-mail: lebris@cermics.enpc.fr

    2007-03-01

    We introduce a new multilevel domain decomposition method (MDD) for electronic structure calculations within semi-empirical and density functional theory (DFT) frameworks. This method iterates between local fine solvers and global coarse solvers, in the spirit of domain decomposition methods. Using this approach, calculations have been successfully performed on several linear polymer chains containing up to 40,000 atoms and 200,000 atomic orbitals. Both the computational cost and the memory requirement scale linearly with the number of atoms. Additional speed-up can easily be obtained by parallelization. We show that this domain decomposition method outperforms the density matrix minimization (DMM) method for poor initial guesses. Our method provides an efficient preconditioner for DMM and other linear scaling methods, variational in nature, such as the orbital minimization (OM) procedure.

  1. Structural optimization by generalized, multilevel decomposition

    NASA Technical Reports Server (NTRS)

    Sobieszczanski-Sobieski, J.; James, B. B.; Riley, M. F.

    1985-01-01

    The developments toward a general multilevel optimization capability and results for a three-level structural optimization are described. The method partitions a structure into a number of substructuring levels where each substructure corresponds to a subsystem in the general case of an engineering system. The method is illustrated by a portal framework that decomposes into individual beams. Each beam is a box that can be further decomposed into stiffened plates. Substructuring for this example spans three different levels: (1) the bottom level of finite elements representing the plates; (2) an intermediate level of beams treated as substructures; and (3) the top level for the assembled structure. The three-level case is now considered to be qualitatively complete.

  2. Multilevel Atomic Coherent States and Atomic Holomorphic Representation

    NASA Technical Reports Server (NTRS)

    Cao, Chang-Qi; Haake, Fritz

    1996-01-01

    The notion of atomic coherent states is extended to the case of multilevel atom collective. Based on atomic coherent states, a holomorphic representation for atom collective states and operators is defined. An example is given to illustrate its application.

  3. Novel multilevel inverter carrier-based PWM method

    SciTech Connect

    Tolbert, L.M.; Habetler, T.G.

    1999-10-01

    The advent of the transformerless multilevel inverter topology has brought forth various pulsewidth modulation (PWM) schemes as a means to control the switching of the active devices in each of the multiple voltage levels in the inverter. An analysis of how existing multilevel carrier-based PWM affects switch utilization for the different levels of a diode-clamped inverter is conducted. Two novel carrier-based multilevel PWM schemes are presented which help to optimize or balance the switch utilization in multilevel inverters. A 10-kW prototype six-level diode-clamped inverter has been built and controlled with the novel PWM strategies proposed in this paper to act as a voltage-source inverter for a motor drive.

  4. Integrated structure/control law design by multilevel optimization

    NASA Technical Reports Server (NTRS)

    Gilbert, Michael G.; Schmidt, David K.

    1989-01-01

    A new approach to integrated structure/control law design based on multilevel optimization is presented. This new approach is applicable to aircraft and spacecraft and allows for the independent design of the structure and control law. Integration of the designs is achieved through use of an upper level coordination problem formulation within the multilevel optimization framework. The method requires the use of structure and control law design sensitivity information. A general multilevel structure/control law design problem formulation is given, and the use of Linear Quadratic Gaussian (LQG) control law design and design sensitivity methods within the formulation is illustrated. Results of three simple integrated structure/control law design examples are presented. These results show the capability of structure and control law design tradeoffs to improve controlled system performance within the multilevel approach.

  5. Stability of chromite interconnections in dual environments

    NASA Astrophysics Data System (ADS)

    Armstrong, T. R.; Stevenson, J. W.; Raney, P.; Pederson, L. R.

    1994-11-01

    One of the most critical technical concerns in high-temperature SOFC's is the physical, chemical, and electrical stability of the interconnect (typically a doped lanthanum chromite) in the dual (oxidizing and reducing atmosphere) SOFC environment. The reducing or fuel side may experience oxygen partial pressures (P(O2)) from 10(exp -18) to 10(exp -6) atmospheres, while the oxidizing side may have P(O2) from 10(exp -6) to greater than 1 atm. These conditions limit the possible candidate materials to lanthanum or yttrium chromites. In the past decade, much work has centered on development of air-sinterable chromites and understanding their physical properties; little work, however, has focused on the stability of these chromites in dual environments. Chromite powders were synthesized using the glycine-nitrate process. The powders were calcined at 1,000 C for 1 hour and then uniaxially pressed into bars (46mm x 16mm x 3mm) at 55 MPa and isostatically pressed at 138 MPa. Samples were sintered in air. The dependence of the physical properties of sintered lanthanum chromites upon ambient P(O2) and temperature (using dilatometry, thermogravimetric analysis, and oxygen permeation measurements) were studied. La(1-x)A(x)CrO3 and Y(1-x)Ca(x)CrO3, where A is Ca or Sr and x was varied from 0.1 to 0.4 were evaluated in this study. The P(O2) was varied using a buffered CO2/Ar-4%H2 gas system, enabling expansion measurements to be made over a partial pressure range from 10(exp -5) to 10(exp -18) atmosphere at 800, 900, and 1,000 C.

  6. Interacting Social Processes on Interconnected Networks

    PubMed Central

    Alvarez-Zuzek, Lucila G.; La Rocca, Cristian E.; Vazquez, Federico; Braunstein, Lidia A.

    2016-01-01

    We propose and study a model for the interplay between two different dynamical processes –one for opinion formation and the other for decision making– on two interconnected networks A and B. The opinion dynamics on network A corresponds to that of the M-model, where the state of each agent can take one of four possible values (S = −2,−1, 1, 2), describing its level of agreement on a given issue. The likelihood to become an extremist (S = ±2) or a moderate (S = ±1) is controlled by a reinforcement parameter r ≥ 0. The decision making dynamics on network B is akin to that of the Abrams-Strogatz model, where agents can be either in favor (S = +1) or against (S = −1) the issue. The probability that an agent changes its state is proportional to the fraction of neighbors that hold the opposite state raised to a power β. Starting from a polarized case scenario in which all agents of network A hold positive orientations while all agents of network B have a negative orientation, we explore the conditions under which one of the dynamics prevails over the other, imposing its initial orientation. We find that, for a given value of β, the two-network system reaches a consensus in the positive state (initial state of network A) when the reinforcement overcomes a crossover value r*(β), while a negative consensus happens for r < r*(β). In the r − β phase space, the system displays a transition at a critical threshold βc, from a coexistence of both orientations for β < βc to a dominance of one orientation for β > βc. We develop an analytical mean-field approach that gives an insight into these regimes and shows that both dynamics are equivalent along the crossover line (r*, β*). PMID:27689698

  7. Stability of chromite interconnections in dual environments

    SciTech Connect

    Armstrong, T.R.; Stevenson, J.W.; Raney, P.; Pederson, L.R.

    1994-11-01

    One of the most critical technical concerns in high-temperature SOFCs is the physical, chemical, and electrical stability of the interconnect (typically a doped lanthanum chromite) in the dual (oxidizing and reducing atmosphere) SOFC environment. The reducing or fuel side may experience oxygen partial pressures (P(O{sub 2})) from 10{sup {minus}18} to 10{sup {minus}6} atmospheres, while the oxidizing side may have P(O{sub 2}) from 10{sup {minus}6} to greater than 1 atm. These conditions limit the possible candidate materials to lanthanum or yttrium chromites. In the past decade, much work has centered on development of air-sinterable chromites and understanding their physical properties; little work, however, has focused on the stability of these chromites in dual environments. Chromite powders were synthesized using the glycine-nitrate process. The powders were calcined at 1,000 C for 1 hour and then uniaxially pressed into bars (46mm x 16mm x 3mm) at 55 MPa and isostatically pressed at 138 MPa. Samples were sintered in air. The dependence of the physical properties of sintered lanthanum chromites upon ambient P(O{sub 2}) and temperature (using dilatometry, thermogravimetric analysis, and oxygen permeation measurements) were studied. La{sub 1{minus}x}A{sub x}CrO{sub 3} and Y{sub 1{minus}x}Ca{sub x}CrO{sub 3}, where A is Ca or Sr and x was varied from 0.1 to 0.4 were evaluated in this study. The P(O{sub 2}) was varied using a buffered CO{sub 2}/Ar-4%H{sub 2} gas system, enabling expansion measurements to be made over a partial pressure range from 10{sup {minus}5} to 10{sup {minus}18} atmosphere at 800, 900, and 1,000 C.

  8. Free-Space Optical Interconnect Employing VCSEL Diodes

    NASA Technical Reports Server (NTRS)

    Simons, Rainee N.; Savich, Gregory R.; Torres, Heidi

    2009-01-01

    Sensor signal processing is widely used on aircraft and spacecraft. The scheme employs multiple input/output nodes for data acquisition and CPU (central processing unit) nodes for data processing. To connect 110 nodes and CPU nodes, scalable interconnections such as backplanes are desired because the number of nodes depends on requirements of each mission. An optical backplane consisting of vertical-cavity surface-emitting lasers (VCSELs), VCSEL drivers, photodetectors, and transimpedance amplifiers is the preferred approach since it can handle several hundred megabits per second data throughput.The next generation of satellite-borne systems will require transceivers and processors that can handle several Gb/s of data. Optical interconnects have been praised for both their speed and functionality with hopes that light can relieve the electrical bottleneck predicted for the near future. Optoelectronic interconnects provide a factor of ten improvement over electrical interconnects.

  9. 15. Control Area, Interconnecting Corridor VIEW NORTHEAST, SOUTH AND WEST ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    15. Control Area, Interconnecting Corridor VIEW NORTHEAST, SOUTH AND WEST ELEVATION - NIKE Missile Battery PR-79, Control Area, Tucker Hollow Road south of State Route 101, Foster, Providence County, RI

  10. 14. Control Area, Interconnecting Corridor and Frequency Changer and Generator ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    14. Control Area, Interconnecting Corridor and Frequency Changer and Generator Building, general view VIEW SOUTHWEST, NORTH ELEVATION - NIKE Missile Battery PR-79, Control Area, Tucker Hollow Road south of State Route 101, Foster, Providence County, RI

  11. IEEE P1547 Series of Standards for Interconnection: Preprint

    SciTech Connect

    Basso, T. S.; DeBlasio, R.

    2003-05-01

    The IEEE P1547 Standard For Interconnecting Distributed Resources With Electric Power Systems is the first in the P1547 series of planned interconnection standards, and additional standards are needed. There are major issues and obstacles to an orderly transition to the use and integration of distributed power resources with electric power systems (grid or utility grid). The lack of uniform national interconnection standards and tests for interconnection operation and certification-as well as the lack of uniform national building, electrical, and safety codes-is understood, and resolving this needs reasonable lead time to develop and promulgate consensus. The P1547 standard is a benchmark milestone for the IEEE standards consensus process and successfully demonstrates a model for ongoing success in the development of further national standards and for moving forward in modernizing our nation's electric power system.

  12. Design of an optical interconnect for photonic backplane applications.

    PubMed

    Robertson, B

    1998-05-10

    A compact alignment-tolerant interconnect has been developed for use within a prototype modulator-based free-space photonic backplane. The interconnect design encompasses several unique features. Microlens arrays are used, and several beams share each microlens by clustering the optical input-output in a small field about the optical axis of each lens. For simplifying the layout, the optical input and output of each smart-pixel array are clustered separately, thereby allowing a Fourier plane patterned-mirror array to be used in the beam-combination optics. This allows a suitable balance between high interconnection densities and reasonable optical relay distances between adjacent boards to be achieved. The primary advantages of this scheme are the simplicity of the optical design and its alignability, making it ideally suited for high-density interconnection applications. PMID:18273244

  13. Printing Stretchable Spiral Interconnects Using Reactive Ink Chemistries.

    PubMed

    Mamidanna, Avinash; Song, Zeming; Lv, Cheng; Lefky, Christopher S; Jiang, Hanqing; Hildreth, Owen J

    2016-05-25

    Stretchable electronics have important applications in health monitoring and integrated lab-on-a-chip devices. This paper discusses the performance of serpentine stretchable interconnects printed using self-reducing, silver reactive inks. It details process optimization, device fabrication, and device characterization, while demonstrating the potential applications for reactive inks and new design strategies in stretchable electronics. Devices were printed with an ethanol stabilized silver diamine reactive ink and cycled to stretch ratios of 140 and 160% over 1000 cycles with less than 2.5% variation in electrical resistance. Maximum deformation before failure was measured at 180% elongation. Additionally, interconnect deformation was compared to finite element analysis (FEA) simulations to show that FEA can be used to accurately model the deformation of low-strain printed interconnects. Overall, this paper demonstrates a simple and affordable route toward stretchable electrical interconnects. PMID:27158736

  14. Fault-tolerant interconnection networks for multiprocessor systems

    SciTech Connect

    Nassar, H.M.

    1989-01-01

    Interconnection networks represent the backbone of multiprocessor systems. A failure in the network, therefore, could seriously degrade the system performance. For this reason, fault tolerance has been regarded as a major consideration in interconnection network design. This thesis presents two novel techniques to provide fault tolerance capabilities to three major networks: the Beneline network and the Clos network. First, the Simple Fault Tolerance Technique (SFT) is presented. The SFT technique is in fact the result of merging two widely known interconnection mechanisms: a normal interconnection network and a shared bus. This technique is most suitable for networks with small switches, such as the Baseline network and the Benes network. For the Clos network, whose switches may be large for the SFT, another technique is developed to produce the Fault-Tolerant Clos (FTC) network. In the FTC, one switch is added to each stage. The two techniques are described and thoroughly analyzed.

  15. Manufacturing and quality control of interconnecting wire harnesses, Volume 2

    NASA Technical Reports Server (NTRS)

    1972-01-01

    Interconnecting wire harnesses defined in the design standard are considered, including type 4, open bundle (not enclosed). Knowledge gained through experience on the Saturn 5 program coupled with recent advances in techniques, materials, and processes was incorporated into the document.

  16. Design of an optical interconnect for photonic backplane applications.

    PubMed

    Robertson, B

    1998-05-10

    A compact alignment-tolerant interconnect has been developed for use within a prototype modulator-based free-space photonic backplane. The interconnect design encompasses several unique features. Microlens arrays are used, and several beams share each microlens by clustering the optical input-output in a small field about the optical axis of each lens. For simplifying the layout, the optical input and output of each smart-pixel array are clustered separately, thereby allowing a Fourier plane patterned-mirror array to be used in the beam-combination optics. This allows a suitable balance between high interconnection densities and reasonable optical relay distances between adjacent boards to be achieved. The primary advantages of this scheme are the simplicity of the optical design and its alignability, making it ideally suited for high-density interconnection applications.

  17. On the Equilibrium States of Interconnected Bubbles or Balloons.

    ERIC Educational Resources Information Center

    Weinhaus, F.; Barker, W.

    1978-01-01

    Describes the equilibrium states of a system composed of two interconnected, air-filled spherical membranes of different sizes. The equilibrium configurations are determined by the method of minimization of the availability of the system at constant temperature. (GA)

  18. In-plane biocompatible microfluidic interconnects for implantable microsystems.

    PubMed

    Johnson, Dean G; Frisina, Robert D; Borkholder, David A

    2011-04-01

    Small mammals, particularly mice, are very useful animal models for biomedical research. Extremely small anatomical dimensions, however, make design of implantable microsystems quite challenging. A method for coupling external fluidic systems to microfluidic channels via in-plane interconnects is presented. Capillary tubing is inserted into channels etched in the surface of a Si wafer with a seal created by Parylene-C deposition. Prediction of Parylene-C deposition into tapered channels based on Knudsen diffusion and deposition characterizations allows for design optimization. Low-volume interconnects using biocompatible, chemical resistant materials have been demonstrated and shown to withstand pressure as high as 827 kPa (120 psi) with an average pull test strength of 2.9 N. Each interconnect consumes less than 0.018 mm3 (18 nL) of volume. The low added volume makes this an ideal interconnect technology for medical applications where implant volume is critical.

  19. In-Plane Biocompatible Microfluidic Interconnects for Implantable Microsystems

    PubMed Central

    Johnson, Dean G.; Frisina, Robert D.; Borkholder, David A.

    2011-01-01

    Small mammals, particularly mice, are very useful animal models for biomedical research. Extremely small anatomical dimensions, however, make design of implantable microsystems quite challenging. A method for coupling external fluidic systems to microfluidic channels via in-plane interconnects is presented. Capillary tubing is inserted into channels etched in the surface of a Si wafer with a seal created by Parylene-C deposition. Prediction of Parylene-C deposition into tapered channels based on Knudsen diffusion and deposition characterizations allows for design optimization. Low-volume interconnects using biocompatible, chemical resistant materials have been demonstrated and shown to withstand pressure as high as 827 kPa (120 psi) with an average pull test strength of 2.9 N. Each interconnect consumes less than 0.018 mm3 (18 nL) of volume. The low added volume makes this an ideal interconnect technology for medical applications where implant volume is critical. PMID:21147591

  20. Multi-level bandwidth efficient block modulation codes

    NASA Technical Reports Server (NTRS)

    Lin, Shu

    1989-01-01

    The multilevel technique is investigated for combining block coding and modulation. There are four parts. In the first part, a formulation is presented for signal sets on which modulation codes are to be constructed. Distance measures on a signal set are defined and their properties are developed. In the second part, a general formulation is presented for multilevel modulation codes in terms of component codes with appropriate Euclidean distances. The distance properties, Euclidean weight distribution and linear structure of multilevel modulation codes are investigated. In the third part, several specific methods for constructing multilevel block modulation codes with interdependency among component codes are proposed. Given a multilevel block modulation code C with no interdependency among the binary component codes, the proposed methods give a multilevel block modulation code C which has the same rate as C, a minimum squared Euclidean distance not less than that of code C, a trellis diagram with the same number of states as that of C and a smaller number of nearest neighbor codewords than that of C. In the last part, error performance of block modulation codes is analyzed for an AWGN channel based on soft-decision maximum likelihood decoding. Error probabilities of some specific codes are evaluated based on their Euclidean weight distributions and simulation results.

  1. The organization of permutation architectures with bussed interconnections

    NASA Astrophysics Data System (ADS)

    Kilian, Joe; Kipnis, Sholomo; Leiserson, Charles E.

    1989-01-01

    The problem of efficiently permuting data stored in VLSI chips is explored in accordance with a predetermined set of permutations. By connecting chips with shared bus interconnections, as opposed to point-to-point interconnections, it is shown that the number of pins per chip can often be reduced. Uniform permutation architectures were also considered that realize permutations in several clock ticks, instead of one, and show that further savings in the number of pins per chip can be obtained.

  2. The organization of permutation architectures with bused interconnections

    NASA Astrophysics Data System (ADS)

    Kilian, Joe; Kipnis, Shlomo; Leiserson, Charles E.

    1990-11-01

    The problem of efficiently permuting data stored in VLSI chips is explored, in accordance with a predetermined set of permutations. By connecting chips with shared bus interconnections, as opposed to point-to-point interconnections, it is shown that the number of pins per chip can often be reduced. Uniform permutation architectures are also considered that realize permutations in several clock ticks, instead of one, and it is demonstrated that further savings in the number of pins per chip can be obtained.

  3. Light emitters and modulators on SOI for optical interconnects

    NASA Astrophysics Data System (ADS)

    Su, Yikai; Qiu, Ciyuan; Zhang, Yong; Liu, Ruili

    2016-03-01

    We discuss light emitters and modulators in silicon photonic interconnects. In particular, we experimentally demonstrate resonant luminescence from Ge quantum dots embedded in a photonic crystal ring resonator (PCRR) at room temperature. Six sharp resonant peaks are observed, which correspond to the resonant modes supported by the PCRR. We further study a high speed silicon-graphene nanobeam modulator, and a silicon spatial light modulator. These devices show great potential in future high density and high capacity interconnection systems.

  4. Preliminary reliability evaluation of flip chip on flex interconnect technology

    NASA Technical Reports Server (NTRS)

    Shaw, Jack J.; Virmani, Naresh

    1997-01-01

    The study was carried out to evaluate the flip-chip-on-flex (FCOF) interconnection process in order to determine its feasibility for space flight applications. The key objectives were to: develop and apply simple and cost effective process steps needed to manufacture FCOFs and build test samples; perform a preliminary technology validation, and determine any initial environmental or application risks. The FCOF was shown to be simpler and more economical than other chip interconnection schemes.

  5. Monolithic microwave integrated circuits: Interconnections and packaging considerations

    NASA Technical Reports Server (NTRS)

    Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.

    1984-01-01

    Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

  6. Hybrid interconnection structures for real-time parallel processing

    NASA Technical Reports Server (NTRS)

    Kim, K. H.; Samson, John R., Jr.

    1989-01-01

    The use of hybrid interconnection structures that combine link connections and bus connections for real-time parallel processing is discussed. Idealistic parallel computation models for two real-time computing applications are described with attention given to a tightly coupled network model for object tracking and a network model for image processing. Consideration is given to the following different interconnection structures: the crossbar, the hypercube, the circular linked array, and the bus array.

  7. Developing Generic Dynamic Models for the 2030 Eastern Interconnection Grid

    SciTech Connect

    Kou, Gefei; Hadley, Stanton W; Markham, Penn N; Liu, Yilu

    2013-12-01

    The Eastern Interconnection Planning Collaborative (EIPC) has built three major power flow cases for the 2030 Eastern Interconnection (EI) based on various levels of energy/environmental policy conditions, technology advances, and load growth. Using the power flow cases, this report documents the process of developing the generic 2030 dynamic models using typical dynamic parameters. The constructed model was validated indirectly using the synchronized phasor measurements by removing the wind generation temporarily.

  8. Method for fabricating an interconnected array of semiconductor devices

    NASA Technical Reports Server (NTRS)

    Grimmer, Derrick P. (Inventor)

    1995-01-01

    A method of forming an array of interconnected solar cells. A flexible substrate carrying semiconductor and conductive layers is divided into individual devices by slitting the substrate along the web length. The individual devices are then connected with one another in series by laminating the substrate onto an insulating backing and by depositing conducting interconnection layers which join the lower conductor of one device with the top conductor of the adjoining device.

  9. Development of metallization process

    NASA Astrophysics Data System (ADS)

    Garcia, A., III

    1983-04-01

    Solar cells were produced using a Mo/Sn/TiH screen printed paste with a lead/borosilicate frit that are electrically comparable to control silver cells. The process is currently unsuccessful because the soldering of interconnects to these cells has proved difficult. Future work will investigate using CO instead of H2 as the reducing gas and putting an ITO coating on the cell prior to metallization.

  10. Laser micromachining of through via interconnects in active die for 3-D multichip module

    NASA Astrophysics Data System (ADS)

    Chu, D.; Miller, W. D.

    One method to increase density in integrated circuits (IC) is to stack die to create a 3-D multichip module (MCM). In the past, special post wafer processing was done to bring interconnects out to the edge of the die. The die were sawed, glued, and stacked. Special processing was done to create interconnects on the edge to provide for interconnects to each of the die. These processes require an IC type fabrication facility (fab) and special processing equipment. In contrast, we have developed packaging assembly methods to create vertical through vias in bond pads of active silicon die, isolate these vias, and metal fill these vias without the use of a special IC fab. These die with through vias can then be joined and stacked to create a 3-D MCM. Vertical through vias in active die are created by laser micromachining using a Nd:YAG laser. Besides the fundamental 1064 nm (infrared) laser wavelength of a Nd:YAG laser, modifications to our Nd:YAG laser allowed us to generate the second harmonic 532 nm (green) laser wavelength and fourth harmonic 266 nm (ultraviolet) laser wavelength in laser micromachining for these vias. Experiments were conducted to determine the best laser wavelengths to use for laser micromachining of vertical through vias in order to minimize damage to the active die. Via isolation experiments were done in order to determine the best method in isolating the bond pads of the die. Die thinning techniques were developed to allow for die thickness as thin as 50 microns. This would allow for high 3-D density when the die are stacked. A method was developed to metal fill the vias with solder using a wire bonder with solder wire.

  11. Laser micromachining of through via interconnects in active die for 3-D multichip module

    SciTech Connect

    Chu, D.; Miller, W.D.

    1995-09-01

    One method to increase density in integrated circuits (IC) is to stack die to create a 3-D multichip module (MCM). In the past, special post wafer processing was done to bring interconnects out to the edge of the die. The die were sawed, glued, and stacked. Special processing was done to create interconnects on the edge to provide for interconnects to each of the die. These processes require an IC type fabrication facility (fab) and special processing equipment. In contrast, we have developed packaging assembly methods to created vertical through vias in bond pads of active silicon die, isolate these vias, and metal fill these vias without the use of a special IC fab. These die with through vias can then be joined and stacked to create a 3-D MCM. Vertical through vias in active die are created by laser micromachining using a Nd:YAG laser. Besides the fundamental 1064 nm (infra-red) laser wavelength of a Nd:YAG laser, modifications to our Nd:YAG laser allowed us to generate the second harmonic 532 nm (green) laser wavelength and fourth harmonic 266nm (ultra violet) laser wavelength in laser micromachining for these vias. Experiments were conducted to determine the best laser wavelengths to use for laser micromachining of vertical through vias in order to minimize damage to the active die. Via isolation experiments were done in order to determine the best method in isolating the bond pads of the die. Die thinning techniques were developed to allow for die thickness as thin as 50 {mu}m. This would allow for high 3-D density when the die are stacked. A method was developed to metal fill the vias with solder using a wire bonder with solder wire.

  12. Chip-to-chip interconnects based on 3D stacking of optoelectrical dies on Si

    NASA Astrophysics Data System (ADS)

    Duan, P.; Raz, O.; Smalbrugge, B. E.; Duis, J.; Dorren, H. J. S.

    2012-01-01

    We demonstrate a new approach to increase the optical interconnection bandwidth density by stacking the opto-electrical dies directly on the CMOS driver. The suggested implementation is aiming to provide a wafer scale process which will make the use of wire bonding redundant and will allow for impedance matched metallic wiring between the electronic driving circuit and its opto-electronic counter part. We suggest the use of a thick photoresist ramp between CMOS driver and opto-electrical dies surface as the bridge for supporting co-plannar waveguides (CPW) electrically plated with lithographic accuracy. In this way all three dimensions of the interconnecting metal layer, width, length and thickness can be completely controlled. In this 1st demonstration all processing is done on commercially available devices and products, and is compatible with CMOS processing technology. To test the applicability of CPW instead of wire bonds for interconnecting the CMOS circuit and opto-electronic chips, we have made test samples and tested their performance at speeds up to 10 Gbps. In this demonstration, a silicon substrate was used on which we evaporated gold co-planar waveguides (CPW) to mimic a wire on the driver. An optical link consisting of a VCSEL chip and a photodiode chip has been assembled and fully characterized using optical coupling into and out of a multimode fiber (MMF). A 10 Gb/s 27-1 NRZ PRBS signal transmitted from one chip to another chip was detected error free. A 4 dB receiver sensitivity penalty is measured for the integrated device compared to a commercial link.

  13. Feasibility of optically interconnected parallel processors using wavelength division multiplexing

    SciTech Connect

    Deri, R.J.; De Groot, A.J.; Haigh, R.E.

    1996-03-01

    New national security demands require enhanced computing systems for nearly ab initio simulations of extremely complex systems and analyzing unprecedented quantities of remote sensing data. This computational performance is being sought using parallel processing systems, in which many less powerful processors are ganged together to achieve high aggregate performance. Such systems require increased capability to communicate information between individual processor and memory elements. As it is likely that the limited performance of today`s electronic interconnects will prevent the system from achieving its ultimate performance, there is great interest in using fiber optic technology to improve interconnect communication. However, little information is available to quantify the requirements on fiber optical hardware technology for this application. Furthermore, we have sought to explore interconnect architectures that use the complete communication richness of the optical domain rather than using optics as a simple replacement for electronic interconnects. These considerations have led us to study the performance of a moderate size parallel processor with optical interconnects using multiple optical wavelengths. We quantify the bandwidth, latency, and concurrency requirements which allow a bus-type interconnect to achieve scalable computing performance using up to 256 nodes, each operating at GFLOP performance. Our key conclusion is that scalable performance, to {approx}150 GFLOPS, is achievable for several scientific codes using an optical bus with a small number of WDM channels (8 to 32), only one WDM channel received per node, and achievable optoelectronic bandwidth and latency requirements. 21 refs. , 10 figs.

  14. Isothermal test as a WLR monitor for Cu interconnects

    NASA Astrophysics Data System (ADS)

    Marathe, Amit P.; Pham, Van; Chan, Jay; Weidner, Jorg-Oliver; Heinig, Volker; Thierbach, Steffi

    2000-08-01

    The need for higher interconnect current densities has been increasing rapidly for advanced integrated circuits. Cu interconnects have emerged as viable candidates to replace Aluminium due to the lower sheet resistivity and increased electro migration lifetime of Cu. Previously, we had reported the use of the isothermal test as a WLR monitor for detecting process defects such as voids in the Aluminium interconnects. This paper further extends the application of the isothermal test methodology for detecting and characterizing process defects in Cu interconnect technology. Package electro migration test are time consuming and may be impractical in detecting process defects in a timely manner. Isothermal test, on the other hand, can be effectively used as a fast WLR process monitor. This paper reports the influence of direction of test current as well as different types of test structures, such as a single level NIST structure and a via chain structure and a via chain structure, on the isothermal test results for Cu interconnects. The isothermal test data has been shown to be helpful in evaluating the location and severity of the process defects through a proper choice of test structures. Joule heating due to high current density is found to be the major driving force for the sensitivity of isothermal test failures. A good correlation is also seen with the package electro migration data. A simple wafer level isothermal test has thus been successfully demonstrated as a reliability tool for process monitoring in Cu VLSI interconnects.

  15. Reconfigurable Hybrid Interconnection for Static and DynamicScientific Applications

    SciTech Connect

    Kamil, Shoaib; Pinar, Ali; Gunter, Daniel; Lijewski, Michael; Oliker, Leonid; Shalf, John; Skinner, David

    2006-04-25

    As we enter the era of petascale computing, system architects must plan for machines composed of tens of thousands or even hundreds of thousands of processors. Although fully connected networks such as fat-tree interconnects currently dominate HPC network designs, such approaches are inadequate for thousands of processors due to the superlinear growth of component costs. Traditional low-degree interconnect topologies, such as the 3D torus, have reemerged as a competitive solution because the number of switch components scales linearly with the node count, but such networks are poorly suited for the requirements of many scientific applications. We present our latest work on a hybrid switch architecture called HFAST that uses circuit switches to dynamically reconfigure a lower-degree interconnect to suit the topological requirements of each scientific application. This paper expands upon our prior work on the requirements of non-adaptive applications by analyzing the communication characteristics of dynamically adapting AMR code and presents a methodology that captures the evolving communication requirements. We also present a new optimization that computes the under-utilization of fat-tree interconnects for a given communication topology, showing the potential of constructing a ''fit-tree'' for the application by using the HFAST circuit switches to provision an optimal interconnect topology for each application. Finally, we apply our new optimization technique to the communication requirements of the AMR code to demonstrate the potential of using dynamic reconfiguration of the HFAST interconnect between the communication intensive phases of a dynamically adapting application.

  16. Solid-state energy storage module employing integrated interconnect board

    DOEpatents

    Rouillard, Jean; Comte, Christophe; Daigle, Dominik; Hagen, Ronald A.; Knudson, Orlin B.; Morin, Andre; Ranger, Michel; Ross, Guy; Rouillard, Roger; St-Germain, Philippe; Sudano, Anthony; Turgeon, Thomas A.

    2000-01-01

    The present invention is directed to an improved electrochemical energy storage device. The electrochemical energy storage device includes a number of solid-state, thin-film electrochemical cells which are selectively interconnected in series or parallel through use of an integrated interconnect board. The interconnect board is typically disposed within a sealed housing which also houses the electrochemical cells, and includes a first contact and a second contact respectively coupled to first and second power terminals of the energy storage device. The interconnect board advantageously provides for selective series or parallel connectivity with the electrochemical cells, irrespective of electrochemical cell position within the housing. In one embodiment, a sheet of conductive material is processed by employing a known milling, stamping, or chemical etching technique to include a connection pattern which provides for flexible and selective interconnecting of individual electrochemical cells within the housing, which may be a hermetically sealed housing. Fuses and various electrical and electro-mechanical devices, such as bypass, equalization, and communication devices for example, may also be mounted to the interconnect board and selectively connected to the electrochemical cells.

  17. A wet chemistry approach to sub-micron, removable flip chip interconnects.

    SciTech Connect

    Rowen, Adam M.; Barker, Joy M.; Gillen, J. Rusty; Orendorff, Christopher J.; Arrington, Christian L.; Yelton, William Graham

    2008-08-01

    Higher performance is the main driver in the integrated circuit (IC) market, but along with added function comes the cost of increased input/output connections and larger die sizes. Space saving approaches aimed at solving these challenges includes two technologies; 3D stacking (3D-ICs) and flip chip assemblies. Emerging ICs require sub-micron scale interconnects which include vias for 3D-ICs and bump bonds for flip chips. Photolithographic techniques are commonly used to prepare templates followed by metal vapor deposition to create flip chip bump bonds. Both the lithography step and the metal properties required for bump bonding contribute to limiting this approach to a minimum bump size of -10 ?m. Here, we present a wet chemistry approach to fabricating uniform bump bonds of tunable size and height down to the nanoscale. Nanosphere lithography (NSL), a soft lithographic technique, is used to create a bump bond template or mask for nanoscale bumps. Electrochemical deposition is also used through photoresist templates to create uniform bump bonds across large area wafers or dies. This template approach affords bumps with tunable diameters from 100s of nanometers to microns (allowing for tunable interconnect pitch and via diameters) while the use of constant current electroplating gives uniform bump height over large areas (>1 cm{sup 2}).

  18. Metallization of Large Silicon Wafers

    NASA Technical Reports Server (NTRS)

    Pryor, R. A.

    1978-01-01

    A metallization scheme was developed which allows selective plating of silicon solar cell surfaces. The system is comprised of three layers. Palladium, through the formation of palladium silicide at 300 C in nitrogen, makes ohmic contact to the silicon surface. Nickel, plated on top of the palladium silicide layer, forms a solderable interface. Lead-tin solder on the nickel provides conductivity and allows a convenient means for interconnection of cells. To apply this metallization, three chemical plating baths are employed.

  19. Multi-level Simulation of a Real Time Vibration Monitoring System Component

    NASA Technical Reports Server (NTRS)

    Robertson, Bryan A.; Wilkerson, Delisa

    2005-01-01

    This paper describes the development of a custom built Digital Signal Processing (DSP) printed circuit board designed to implement the Advanced Real Time Vibration Monitoring Subsystem proposed by Marshall Space Flight Center (MSFC) Transportation Directorate in 2000 for the Space Shuttle Main Engine Advanced Health Management System (AHMS). This Real Time Vibration Monitoring System (RTVMS) is being developed for ground use as part of the AHMS Health Management Computer-Integrated Rack Assembly (HMC-IRA). The HMC-IRA RTVMS design contains five DSPs which are highly interconnected through individual communication ports, shared memory, and a unique communication router that allows all the DSPs to receive digitized data fiom two multi-channel analog boards simultaneously. This paper will briefly cover the overall board design but will focus primarily on the state-of-the-art simulation environment within which this board was developed. This 16-layer board with over 1800 components and an additional mezzanine card has been an extremely challenging design. Utilization of a Mentor Graphics simulation environment provided the unique board and system level simulation capability to ascertain any timing or functional concerns before production. By combining VHDL, Synopsys Software and Hardware Models, and the Mentor Design Capture Environment, multiple simulations were developed to verify the RTVMS design. This multi-level simulation allowed the designers to achieve complete operability without error the first time the RTVMS printed circuit board was powered. The HMC-IRA design has completed all engineering and deliverable unit testing. P

  20. Multi-level Simulation of a Real Time Vibration Monitoring System Component

    NASA Technical Reports Server (NTRS)

    Roberston, Bryan; Wilkerson, DeLisa

    2004-01-01

    This paper describes the development of a custom built Digital Signal Processing (DSP) printed circuit board designed to implement the Advanced Real Time Vibration Monitoring Subsystem proposed by MSFC Transportation Directorate in 2000 for the Space Shuttle Main Engine Advanced Health Management System (AHMS). This Real Time Vibration Monitoring System (RTVMS) is being developed for ground use as part of the AHMS Health Management Computer-Integrated Rack Assembly (HMC-IRA). The HMC-IRA RTVMS design contains five DSPs which are highly interconnected through individual communication ports, shared memory, and a unique communication router that allows all the DSPs to receive digitized data from two multi-channel analog boards simultaneously. This paper will briefly cover the overall board design but will focus primarily on the state-of-the-art simulation environment within which this board was developed. This 16-layer board with over 1800 components and an additional mezzanine card has been an extremely challenging design. Utilization of a Mentor Graphics simulation environment provided the unique board and system level simulation capability to ascertain any timing or functional concerns before production. By combining VHDL, Synopsys Software and Hardware Models, and the Mentor Design Capture Environment, multiple simulations were developed to verify the RTVMS design. This multi-level simulation allowed the designers to achieve complete operability without error the first time the RTVMS printed circuit board was powered. The HMCIRA design has completed all engineering unit testing and the deliverable unit is currently under development.

  1. Stress-Induced Phenomena in Metallization 8th International Workshop on Stress-Induced Phenomena in Metallization

    NASA Astrophysics Data System (ADS)

    Zschech, Ehrenfried; Maex, Karen; Ho, Paul S.; Kawasaki, Hisao; Nakamura, Tomoji

    All papers were peer reviewed. This proceedings presents current research on issues related to stress-induced phenomena in on-chip metal interconnects and solder joints. Stresses arising in on-chip metal interconnects and surrounding dielectric materials due to thermal mismatch, electromigration, microstructure changes or process integration can lead to degradation and failure of microelectronic products. The implementation of low dielectric constant materials into the inlaid copper backend-of-line process has brought new challenges for process integration and reliability.

  2. Cascade Multilevel Inverters for Utility Applications

    SciTech Connect

    Peng, F.Z., McKeever, J.W., Adams, D.J.

    1997-12-31

    Cascade multilevel inverters have been developed by the authors for utility applications. A cascade M-level inverter consists of (M-1)/2 H- bridges in which each bridge has its own separate dc source. The new inverter: (1) can generate almost sinusoidal waveform voltage while only switching one time per fundamental cycle, (2) can eliminate transformers of multipulse inverters used in conventional utility interfaces and static var compensators, and (3) makes possible direct parallel or series connection to medium- and high-voltage power systems without any transformers. In other words, the cascade inverter is much more efficient and suitable for utility applications than traditional multipulse and pulse width modulation (PWM) inverters. The authors have experimentally demonstrated the superiority of the new inverter for reactive power (var) and harmonic compensation. This paper will summarize features,feasibility, and control schemes of the cascade inverter for utility applications including utility interface of renewable energy, voltage regulation, var compensation, and harmonic filtering in power systems.Analytical, simulated, and experimental results demonstrate the superiority of the new inverters.

  3. Learning Stable Multilevel Dictionaries for Sparse Representations.

    PubMed

    Thiagarajan, Jayaraman J; Ramamurthy, Karthikeyan Natesan; Spanias, Andreas

    2015-09-01

    Sparse representations using learned dictionaries are being increasingly used with success in several data processing and machine learning applications. The increasing need for learning sparse models in large-scale applications motivates the development of efficient, robust, and provably good dictionary learning algorithms. Algorithmic stability and generalizability are desirable characteristics for dictionary learning algorithms that aim to build global dictionaries, which can efficiently model any test data similar to the training samples. In this paper, we propose an algorithm to learn dictionaries for sparse representations from large scale data, and prove that the proposed learning algorithm is stable and generalizable asymptotically. The algorithm employs a 1-D subspace clustering procedure, the K-hyperline clustering, to learn a hierarchical dictionary with multiple levels. We also propose an information-theoretic scheme to estimate the number of atoms needed in each level of learning and develop an ensemble approach to learn robust dictionaries. Using the proposed dictionaries, the sparse code for novel test data can be computed using a low-complexity pursuit procedure. We demonstrate the stability and generalization characteristics of the proposed algorithm using simulations. We also evaluate the utility of the multilevel dictionaries in compressed recovery and subspace learning applications.

  4. Gaussian translation operator in a multilevel scheme

    NASA Astrophysics Data System (ADS)

    Hansen, Thorkild B.; Borries, Oscar

    2015-08-01

    A multilevel computation scheme for time-harmonic fields in three dimensions will be formulated with a new Gaussian translation operator that decays exponentially outside a circular cone centered on the line connecting the source and observation groups. This Gaussian translation operator is directional and diagonal with its sharpness determined by a beam parameter. When the beam parameter is set to zero, the Gaussian translation operator reduces to the standard fast multipole method translation operator. The directionality of the Gaussian translation operator makes it possible to reduce the number of plane waves required to achieve a given accuracy. The sampling rate can be determined straightforwardly to achieve any desired accuracy. The use of the computation scheme will be illustrated through a near-field scanning problem where the far-field pattern of a source is determined from near-field measurements with a known probe. Here the Gaussian translation operator improves the condition number of the matrix equation that determines the far-field pattern. The Gaussian translation operator can also be used when the probe pattern is known only in one hemisphere, as is common in practice. Also, the Gaussian translation operator will be used to solve the scattering problem of the perfectly conducting sphere.

  5. Multi-level Conceptual Modeling and OWL

    NASA Astrophysics Data System (ADS)

    Neumayr, Bernd; Schrefl, Michael

    Ontological metamodeling or multilevel-modeling refers to describing complex domains at multiple levels of abstraction, especially in domains where the borderline between individuals and classes is not clear cut. Punning in OWL2 provides decideable metamodeling support by allowing to use one symbol both as identifier of a class as well as of an individual. In conceptual modeling more powerful approaches to ontological metamodeling exist: materialization, potency-based deep instantiation, and m-objects/m-relationships. These approaches not only support to treat classes as individuals but also to describe domain concepts with members at multiple levels of abstraction. Based on a mapping from m-objects/m-relationships to OWL we show how to transfer these ideas from conceptual modeling to ontology engineering. Therefore we have to combine closed world and open world reasoning. We provide semantic-preserving mappings from m-objects and m-relationships to the decideable fragment of OWL, extended by integrity constraints, and sketch basic tool support for applying this approach.

  6. Experiments in encoding multilevel images as quadtrees

    NASA Technical Reports Server (NTRS)

    Lansing, Donald L.

    1987-01-01

    Image storage requirements for several encoding methods are investigated and the use of quadtrees with multigray level or multicolor images are explored. The results of encoding a variety of images having up to 256 gray levels using three schemes (full raster, runlength and quadtree) are presented. Although there is considerable literature on the use of quadtrees to store and manipulate binary images, their application to multilevel images is relatively undeveloped. The potential advantage of quadtree encoding is that an entire area with a uniform gray level may be encoded as a unit. A pointerless quadtree encoding scheme is described. Data are presented on the size of the quadtree required to encode selected images and on the relative storage requirements of the three encoding schemes. A segmentation scheme based on the statistical variation of gray levels within a quadtree quadrant is described. This parametric scheme may be used to control the storage required by an encoded image and to preprocess a scene for feature identification. Several sets of black and white and pseudocolor images obtained by varying the segmentation parameter are shown.

  7. Analysis of biomedical data with multilevel glyphs

    PubMed Central

    2014-01-01

    Background This paper presents multilevel data glyphs optimized for the interactive knowledge discovery and visualization of large biomedical data sets. Data glyphs are three- dimensional objects defined by multiple levels of geometric descriptions (levels of detail) combined with a mapping of data attributes to graphical elements and methods, which specify their spatial position. Methods In the data mapping phase, which is done by a biomedical expert, meta information about the data attributes (scale, number of distinct values) are compared with the visual capabilities of the graphical elements in order to give a feedback to the user about the correctness of the variable mapping. The spatial arrangement of glyphs is done in a dimetric view, which leads to high data density, a simplified 3D navigation and avoids perspective distortion. Results We show the usage of data glyphs in the disease analyser a visual analytics application for personalized medicine and provide an outlook to a biomedical web visualization scenario. Conclusions Data glyphs can be successfully applied in the disease analyser for the analysis of big medical data sets. Especially the automatic validation of the data mapping, selection of subgroups within histograms and the visual comparison of the value distributions were seen by experts as an important functionality. PMID:25079119

  8. The genetical theory of multilevel selection

    PubMed Central

    Gardner, A

    2015-01-01

    The theory of multilevel selection (MLS) is beset with conceptual difficulties. Although it is widely agreed that covariance between group trait and group fitness may arise in the natural world and drive a response to ‘group selection’, ambiguity exists over the precise meaning of group trait and group fitness and as to whether group selection should be defined according to changes in frequencies of different types of individual or different types of group. Moreover, the theory of MLS has failed to properly engage with the problem of class structure, which greatly limits its empirical application to, for example, social insects whose colonies are structured into separate age, sex, caste and ploidy classes. Here, I develop a genetical theory of MLS, to address these problems. I show that taking a genetical approach facilitates a decomposition of group-level traits – including reproductive success – into the separate contributions made by each constituent individual, even in the context of so-called emergence. However, I uncover a novel problem with the group-oriented approach: in many scenarios, it may not be possible to express a meaningful covariance between trait and fitness at the level of the social group, because the group's constituents belong to separate, irreconcilable classes. PMID:25475922

  9. Multilevel Monte Carlo simulation of Coulomb collisions

    SciTech Connect

    Rosin, M.S.; Ricketson, L.F.; Dimits, A.M.; Caflisch, R.E.; Cohen, B.I.

    2014-10-01

    We present a new, for plasma physics, highly efficient multilevel Monte Carlo numerical method for simulating Coulomb collisions. The method separates and optimally minimizes the finite-timestep and finite-sampling errors inherent in the Langevin representation of the Landau–Fokker–Planck equation. It does so by combining multiple solutions to the underlying equations with varying numbers of timesteps. For a desired level of accuracy ε, the computational cost of the method is O(ε{sup −2}) or O(ε{sup −2}(lnε){sup 2}), depending on the underlying discretization, Milstein or Euler–Maruyama respectively. This is to be contrasted with a cost of O(ε{sup −3}) for direct simulation Monte Carlo or binary collision methods. We successfully demonstrate the method with a classic beam diffusion test case in 2D, making use of the Lévy area approximation for the correlated Milstein cross terms, and generating a computational saving of a factor of 100 for ε=10{sup −5}. We discuss the importance of the method for problems in which collisions constitute the computational rate limiting step, and its limitations.

  10. Multilevel Monte Carlo simulation of Coulomb collisions

    DOE PAGESBeta

    Rosin, M. S.; Ricketson, L. F.; Dimits, A. M.; Caflisch, R. E.; Cohen, B. I.

    2014-05-29

    We present a new, for plasma physics, highly efficient multilevel Monte Carlo numerical method for simulating Coulomb collisions. The method separates and optimally minimizes the finite-timestep and finite-sampling errors inherent in the Langevin representation of the Landau–Fokker–Planck equation. It does so by combining multiple solutions to the underlying equations with varying numbers of timesteps. For a desired level of accuracy ε , the computational cost of the method is O(ε–2) or (ε–2(lnε)2), depending on the underlying discretization, Milstein or Euler–Maruyama respectively. This is to be contrasted with a cost of O(ε–3) for direct simulation Monte Carlo or binary collision methods.more » We successfully demonstrate the method with a classic beam diffusion test case in 2D, making use of the Lévy area approximation for the correlated Milstein cross terms, and generating a computational saving of a factor of 100 for ε=10–5. Lastly, we discuss the importance of the method for problems in which collisions constitute the computational rate limiting step, and its limitations.« less

  11. Multilevel Monte Carlo simulation of Coulomb collisions

    SciTech Connect

    Rosin, M. S.; Ricketson, L. F.; Dimits, A. M.; Caflisch, R. E.; Cohen, B. I.

    2014-05-29

    We present a new, for plasma physics, highly efficient multilevel Monte Carlo numerical method for simulating Coulomb collisions. The method separates and optimally minimizes the finite-timestep and finite-sampling errors inherent in the Langevin representation of the Landau–Fokker–Planck equation. It does so by combining multiple solutions to the underlying equations with varying numbers of timesteps. For a desired level of accuracy ε , the computational cost of the method is O(ε–2) or (ε–2(lnε)2), depending on the underlying discretization, Milstein or Euler–Maruyama respectively. This is to be contrasted with a cost of O(ε–3) for direct simulation Monte Carlo or binary collision methods. We successfully demonstrate the method with a classic beam diffusion test case in 2D, making use of the Lévy area approximation for the correlated Milstein cross terms, and generating a computational saving of a factor of 100 for ε=10–5. Lastly, we discuss the importance of the method for problems in which collisions constitute the computational rate limiting step, and its limitations.

  12. Electronic interconnects and devices with topological surface states and methods for fabricating same

    DOEpatents

    Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.

    2016-05-03

    An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

  13. Electrode and interconnect for miniature fuel cells using direct methanol feed

    NASA Technical Reports Server (NTRS)

    Narayanan, Sekharipuram R. (Inventor); Valdez, Thomas I. (Inventor); Clara, Filiberto (Inventor)

    2004-01-01

    An improved system for interconnects in a fuel cell. In one embodiment, the membranes are located in parallel with one another, and current flow between them is facilitated by interconnects. In another embodiment, all of the current flow is through the interconnects which are located on the membranes. The interconnects are located between two electrodes.

  14. Best Practice Elements of Multilevel Suicide Prevention Strategies

    PubMed Central

    van der Feltz-Cornelis, Christina M.; Sarchiapone, Marco; Postuvan, Vita; Volker, Daniëlle; Roskar, Saska; Grum, Alenka Tančič; Carli, Vladimir; McDaid, David; O’Connor, Rory; Maxwell, Margaret; Ibelshäuser, Angela; Van Audenhove, Chantal; Scheerder, Gert; Sisask, Merike; Gusmão, Ricardo; Hegerl, Ulrich

    2011-01-01

    Background: Evidence-based best practices for incorporation into an optimal multilevel intervention for suicide prevention should be identifiable in the literature. Aims: To identify effective interventions for the prevention of suicidal behavior. Methods: Review of systematic reviews found in the Pubmed, Cochrane, and DARE databases. Steps include risk-of-bias assessment, data extraction, summarization of best practices, and identification of synergistic potentials of such practices in multilevel approaches. Results: Six relevant systematic reviews were found. Best practices identified as effective were as follows: training general practitioners (GPs) to recognize and treat depression and suicidality, improving accessibility of care for at-risk people, and restricting access to means of suicide. Although no outcomes were reported for multilevel interventions or for synergistic effects of multiple interventions applied together, indirect support was found for possible synergies in particular combinations of interventions within multilevel strategies. Conclusions: A number of evidence-based best practices for the prevention of suicide and suicide attempts were identified. Research is needed on the nature and extent of potential synergistic effects of various preventive activities within multilevel interventions. PMID:21945840

  15. Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Strickland, S. M.; Hester, J. D.; Gowan, A. K.; Montgomery, R. K.; Geist, D. L.; Blanche, J. F.; McGuire, G. D.; Nash, T. S.

    2011-01-01

    As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

  16. Polyguide polymeric technology for optical interconnect circuits and components

    NASA Astrophysics Data System (ADS)

    Booth, Bruce L.; Marchegiano, Joseph E.; Chang, Catherine T.; Furmanak, Robert J.; Graham, Douglas M.; Wagner, Richard G.

    1997-04-01

    The expanding information revolution has been made possible by the development of optical communication technology. To meet the escalating demand for information transmitted and processed at high data rates and the need to circumvent the growing electronic circuit bottlenecks, mass deployment of not only optical fiber networks but manufacturable optical interconnect circuits, components and connectors for interfacing fibers and electronics that meet economic and performance constraints are absolutely necessary. Polymeric waveguide optical interconnection are considered increasingly important to meet these market needs. DuPont's polyguide polymeric integrated optic channel waveguide system is thought by many to have considerable potential for a broad range of passive optical interconnect applications. In this paper the recent advances, status, and unique attributes of the technology are reviewed. Product and technology developments currently in progress including parallel optical ink organization and polymer optical interconnect technology developments funded by DARPA are used as examples to describe polyguide breadth and potential for manufacture and deployment of optical interconnection products for single and multimode telecom and datacom waveguide applications.

  17. Impact of photolithography and mask variability on interconnect parasitics

    NASA Astrophysics Data System (ADS)

    Tian, Yuxin; Shi, Weiping; Mercer, M. Ray

    2005-11-01

    Due to photolithography effects and manufacture process variations, the actual features printed on wafer are different from the designed ones. This difference results in the inaccuracy on parasitic extraction, which is critical for timing verification and design for manufacturability. Most of the current layout parasitic extraction (LPE) tools ignore these effects and can cause as high as 20% errors. This paper proposes a new strategy to extract interconnect parasitics with the consideration of photolithography effects and process variations. Based on the feedback from lithography simulation, a shape correction process is setup to adjust the interconnect structure for LPE tools. Compared with the traditional extraction methodology, the parasitics extracted from this adjusted geometry are more accurate. This method can be implanted into the current design flow with minimum change. Meanwhile, this paper studies the impacts of mask critical dimension (CD) variations on interconnect parasitics. The variability analysis is based on PROLITH lithography simulation software and is tested on RAPHAEL interconnect library. The results show a high nonlinear relationship between the mask variation and the interconnect parasitics.

  18. Diffusion and structural changes in microcircuit interconnections

    NASA Technical Reports Server (NTRS)

    Nowak, W. B.

    1973-01-01

    The interdiffusion of platimum and gold films, a couple utilized in beam lead microcircuits, has been studied for temperatures up to 550 C. Gold-on-platinum couples and separate platimum and gold films 80-450 nm thick, were deposited by electron beam evaporation onto oxidized (111) silicon substrates. Diffusion was monitored by means of spectral reflectance versus wavelength in the band 500-1000 nm. The separate metal films showed good adhesion and stable reflectances (after an initial change) for at least 6 h at diffusion temperatures, in contrast to the couples. Analysis of platinum diffusion through the gold films yielded an activation energy about 38 kcal/g-atom and a pre-exponential factor of the order 0.001 sq cm/sec, values close to those for volume diffusion. The pre-exponential factor especially is dependent upon film deposition conditions.

  19. 76 FR 46793 - PJM Interconnection, L.L.C.; PJM Power Providers Group v. PJM Interconnection, L.L.C.; Notice...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2011-08-03

    ... Energy Regulatory Commission PJM Interconnection, L.L.C.; PJM Power Providers Group v. PJM Interconnection, L.L.C.; Notice Establishing Post-Technical Comment Period As indicated in the June 29, 2011... issues related to PJM Interconnection, L.L.C. (PJM)'s Minimum Offer Price Rule (MOPR) and...

  20. Multilevel summation method for electrostatic force evaluation.

    PubMed

    Hardy, David J; Wu, Zhe; Phillips, James C; Stone, John E; Skeel, Robert D; Schulten, Klaus

    2015-02-10

    The multilevel summation method (MSM) offers an efficient algorithm utilizing convolution for evaluating long-range forces arising in molecular dynamics simulations. Shifting the balance of computation and communication, MSM provides key advantages over the ubiquitous particle–mesh Ewald (PME) method, offering better scaling on parallel computers and permitting more modeling flexibility, with support for periodic systems as does PME but also for semiperiodic and nonperiodic systems. The version of MSM available in the simulation program NAMD is described, and its performance and accuracy are compared with the PME method. The accuracy feasible for MSM in practical applications reproduces PME results for water property calculations of density, diffusion constant, dielectric constant, surface tension, radial distribution function, and distance-dependent Kirkwood factor, even though the numerical accuracy of PME is higher than that of MSM. Excellent agreement between MSM and PME is found also for interface potentials of air–water and membrane–water interfaces, where long-range Coulombic interactions are crucial. Applications demonstrate also the suitability of MSM for systems with semiperiodic and nonperiodic boundaries. For this purpose, simulations have been performed with periodic boundaries along directions parallel to a membrane surface but not along the surface normal, yielding membrane pore formation induced by an imbalance of charge across the membrane. Using a similar semiperiodic boundary condition, ion conduction through a graphene nanopore driven by an ion gradient has been simulated. Furthermore, proteins have been simulated inside a single spherical water droplet. Finally, parallel scalability results show the ability of MSM to outperform PME when scaling a system of modest size (less than 100 K atoms) to over a thousand processors, demonstrating the suitability of MSM for large-scale parallel simulation. PMID:25691833