Automated pupil remapping with binary optics

DOEpatents

Neal, D.R.; Mansell, J.

1999-01-26

Methods and apparatuses are disclosed for pupil remapping employing non-standard lenslet shapes in arrays; divergence of lenslet focal spots from on-axis arrangements; use of lenslet arrays to resize two-dimensional inputs to the array; and use of lenslet arrays to map an aperture shape to a different detector shape. Applications include wavefront sensing, astronomical applications, optical interconnects, keylocks, and other binary optics and diffractive optics applications. 24 figs.

Multi-scale reflection modulator-based optical interconnects

NASA Astrophysics Data System (ADS)

Nair, Rohit

This dissertation describes the design, analysis, and experimental validation of micro- and macro-optical components for implementing optical interconnects at multiple scales for varied applications. Three distance scales are explored: millimeter, centimeter, and meter-scales. At the millimeter-scale, we propose the use of optical interconnects at the intra-chip level. With the rapid scaling down of CMOS critical dimensions in accordance to Moore's law, the bandwidth requirements of global interconnects in microprocessors has exceeded the capabilities of metal links. These are the wires that connect the most remote parts of the chip and are disproportionately problematic in terms of chip area and power consumption. Consequently, in the mid-2000s, we saw a shift in the chip architecture: a move towards multicore designs. However, this only delays the inevitable communication bottleneck between cores. To satisfy this bandwidth, we propose to replace the global metal interconnects with optical interconnects. We propose to use the hybrid integration of silicon with GaAs/AlAs-based multiple quantum well devices as optical modulators and photodetectors along with polymeric waveguides to transport the light. We use grayscale lithography to fabricate curved facets into the waveguides to couple light into the modulators and photodetectors. Next, at the chip-to-chip level in high-performance multiprocessor computing systems, communication distances vary from a few centimeters to tens of centimeters. An optical design for coupling light from off-chip lasers to on-chip surface-normal modulators is proposed in order to implement chip-to-chip free-space optical interconnects. The method uses a dual-prism module constructed from prisms made of two different glasses. The various alignment tolerances of the proposed system are investigated and found to be well within pick-and-place accuracies. For the off-chip lasers, vertical cavity surface emitting lasers (VCSELs) are proposed. The rationale behind using on-chip modulators rather than VCSELs is to avoid VCSEL thermal loads on chip, and because of higher reliability of modulators than VCSELs. Particularly above 10Gbps, an empirical model developed shows the rapid decrease of VCSEL median time to failure vs. data rate. Thus the proposed interconnect scheme which utilizes continuous wave VCSELs that are externally modulated by on-chip multiple quantum well modulators is applicable for chip-to-chip optical interconnects at 20Gbps and higher line data rates. Finally, for applications such as remote telemetry, where the interrogation distances can vary from a few meters to tens or even hundreds of meters we demonstrate a modulated retroreflector that utilizes InGaAs/InAlAs-based large-area multiple quantum well modulators on all three faces of a retroreflector. The large-area devices, fabricated by metalorganic chemical vapor deposition, are characterized in terms of the yield and leakage currents. A yield higher than that achieved previously using devices fabricated by molecular beam epitaxy is observed. The retroreflector module is constructed using standard FR4 printed circuit boards, thereby simplifying the wiring issue. A high optical contrast ratio of 8.23dB is observed for a drive of 20V. A free-standing PCB retroreflector is explored and found to have insufficient angular tolerances (+/-0.5 degrees). We show that the angular errors in the corner-cube construction can be corrected for using off-the-shelf optical components as opposed to mounting the PCBs on a precision corner cube, as has been done previously.

Hard and flexible optical printed circuit board

NASA Astrophysics Data System (ADS)

Lee, El-Hang; Lee, Hyun Sik; Lee, S. G.; O, B. H.; Park, S. G.; Kim, K. H.

2007-02-01

We report on the design and fabrication of hard and flexible optical printed circuit boards (O-PCBs). The objective is to realize generic and application-specific O-PCBs, either in hard form or flexible form, that are compact, light-weight, low-energy, high-speed, intelligent, and environmentally friendly, for low-cost and high-volume universal applications. The O-PCBs consist of 2-dimensional planar arrays of micro/nano-scale optical wires, circuits and devices that are interconnected and integrated to perform the functions of sensing, storing, transporting, processing, switching, routing and distributing optical signals on flat modular boards. For fabrication, the polymer and organic optical wires and waveguides are first fabricated on a board and are used to interconnect and integrate micro/nano-scale photonic devices. The micro/nano-optical functional devices include lasers, detectors, switches, sensors, directional couplers, multi-mode interference devices, ring-resonators, photonic crystal devices, plasmonic devices, and quantum devices. For flexible boards, the optical waveguide arrays are fabricated on flexible poly-ethylen terephthalate (PET) substrates by UV embossing. Electrical layer carrying VCSEL and PD array is laminated with the optical layer carrying waveguide arrays. Both hard and flexible electrical lines are replaced with high speed optical interconnection between chips over four waveguide channels up to 10Gbps on each. We discuss uses of hard or flexible O-PCBs for telecommunication systems, computer systems, transportation systems, space/avionic systems, and bio-sensor systems.

Generic three-dimensional wavelength routers based on cross connects of multilayer diffractive elements

NASA Astrophysics Data System (ADS)

Deng, Xuegong; Chen, Ray T.

2001-05-01

We report a generic method to construct 3D wavelength routers by adapting a novel design for multi-optical wavelength interconnects (MOWI's). Optical wavelength- selective (WS) interconnections are realized by resorting to layered diffractive phase elements. Besides, we simultaneously carry out several other integrated operations on the incident beams according to their wavelengths. We demonstrate an 4 X 4 inline 3D WS optical crossconnect and a 1D 1 X 8 WS perfect shuffler. The devices are well feasible for mass production by using current standard microelectronics technologies. It is plausible that the proposed WS MOWI scenario will find critical applications in module-to-module and board-to-board optical interconnect systems, as well as in other devices for short-link multi- wavelength networks that would benefit from function integration.

Fiber optic interconnect and optoelectronic packaging challenges for future generation avionics

NASA Astrophysics Data System (ADS)

Beranek, Mark W.

2007-02-01

Forecasting avionics industry fiber optic interconnect and optoelectronic packaging challenges that lie ahead first requires an assumption that military avionics architectures will evolve from today's centralized/unified concept based on gigabit laser, optical-to-electrical-to-optical switching and optical backplane technology, to a future federated/distributed or centralized/unified concept based on gigabit tunable laser, electro-optical switch and add-drop wavelength division multiplexing (WDM) technology. The requirement to incorporate avionics optical built-in test (BIT) in military avionics fiber optic systems is also assumed to be correct. Taking these assumptions further indicates that future avionics systems engineering will use WDM technology combined with photonic circuit integration and advanced packaging to form the technical basis of the next generation military avionics onboard local area network (LAN). Following this theme, fiber optic cable plants will evolve from today's multimode interconnect solution to a single mode interconnect solution that is highly installable, maintainable, reliable and supportable. Ultimately optical BIT for fiber optic fault detection and isolation will be incorporated as an integral part of a total WDM-based avionics LAN solution. Cost-efficient single mode active and passive photonic component integration and packaging integration is needed to enable reliable operation in the harsh military avionics application environment. Rugged multimode fiber-based transmitters and receivers (transceivers) with in-package optical BIT capability are also needed to enable fully BIT capable single-wavelength fiber optic links on both legacy and future aerospace platforms.

Polycrystalline PLZT/ITO Ceramic Electro-Optic Phase Gratings: Electro- Optically Reconfigurable Diffractive Devices for Free-Space and In-Wafer Interconnects

DTIC Science & Technology

1994-09-01

free-space and waveguide interconnects is investigated through the fabrication, testing and modeling of polycrystalline PLZT/ITO ceramic electro - optic phase...only gratings. PLZT Diffraction grating, Electro - optic diffraction grating, Optical switching, Optical interconnects, Reconfigurable interconnect

3-DIMENSIONAL Optoelectronic

NASA Astrophysics Data System (ADS)

Krishnamoorthy, Ashok Venketaraman

This thesis covers the design, analysis, optimization, and implementation of optoelectronic (N,M,F) networks. (N,M,F) networks are generic space-division networks that are well suited to implementation using optoelectronic integrated circuits and free-space optical interconnects. An (N,M,F) networks consists of N input channels each having a fanout F_{rm o}, M output channels each having a fanin F_{rm i}, and Log_{rm K}(N/F) stages of K x K switches. The functionality of the fanout, switching, and fanin stages depends on the specific application. Three applications of optoelectronic (N,M,F) networks are considered. The first is an optoelectronic (N,1,1) content -addressable memory system that achieves associative recall on two-dimensional images retrieved from a parallel-access optical memory. The design and simulation of the associative memory are discussed, and an experimental emulation of a prototype system using images from a parallel-readout optical disk is presented. The system design provides superior performance to existing electronic content-addressable memory chips in terms of capacity and search rate, and uses readily available optical disk and VLSI technologies. Next, a scalable optoelectronic (N,M,F) neural network that uses free-space holographic optical interconnects is presented. The neural architecture minimizes the number of optical transmitters needed, and provides accurate electronic fanin with low signal skew, and dendritic-type fan-in processing capability in a compact layout. Optimal data-encoding methods and circuit techniques are discussed. The implementation of an prototype optoelectronic neural system, and its application to a simple recognition task is demonstrated. Finally, the design, analysis, and optimization of a (N,N,F) self-routing, packet-switched multistage interconnection network is described. The network is suitable for parallel computing and broadband switching applications. The tradeoff between optical and electronic interconnects is examined quantitatively by varying the electronic switch size K. The performance of the (N,N,F) network versus the fanning parameter F, is also analyzed. It is shown that the optoelectronic (N,N,F) networks provide a range of performance-cost alternatives, and offer superior performance-per-cost to fully electronic switching networks and to previous networks designs.

Gigascale Silicon Photonic Transmitters Integrating HBT-based Carrier-injection Electroabsorption Modulator Structures

NASA Astrophysics Data System (ADS)

Fu, Enjin

Demand for more bandwidth is rapidly increasing, which is driven by data intensive applications such as high-definition (HD) video streaming, cloud storage, and terascale computing applications. Next-generation high-performance computing systems require power efficient chip-to-chip and intra-chip interconnect yielding densities on the order of 1Tbps/cm2. The performance requirements of such system are the driving force behind the development of silicon integrated optical interconnect, providing a cost-effective solution for fully integrated optical interconnect systems on a single substrate. Compared to conventional electrical interconnect, optical interconnects have several advantages, including frequency independent insertion loss resulting in ultra wide bandwidth and link latency reduction. For high-speed optical transmitter modules, the optical modulator is a key component of the optical I/O channel. This thesis presents a silicon integrated optical transmitter module design based on a novel silicon HBT-based carrier injection electroabsorption modulator (EAM), which has the merits of wide optical bandwidth, high speed, low power, low drive voltage, small footprint, and high modulation efficiency. The structure, mechanism, and fabrication of the modulator structure will be discussed which is followed by the electrical modeling of the post-processed modulator device. The design and realization of a 10Gbps monolithic optical transmitter module integrating the driver circuit architecture and the HBT-based EAM device in a 130nm BiCMOS process is discussed. For high power efficiency, a 6Gbps ultra-low power driver IC implemented in a 130nm BiCMOS process is presented. The driver IC incorporates an integrated 27-1 pseudo-random bit sequence (PRBS) generator for reliable high-speed testing, and a driver circuit featuring digitally-tuned pre-emphasis signal strength. With outstanding drive capability, the driver module can be applied to a wide range of carrier injection modulators and light-emitting diodes (LED) with drive voltage requirements below 1.5V. Measurement results show an optical link based on a 70MHz red LED work well at 300Mbps by using the pre-emphasis driver module. A traveling wave electrode (TWE) modulator structure is presented, including a novel design methodology to address process limitations imposed by a commercial silicon fabrication technology. Results from 3D full wave EM simulation demonstrate the application of the design methodology to achieve specifications, including phase velocity matching, insertion loss, and impedance matching. Results show the HBT-based TWE-EAM system has the bandwidth higher than 60GHz.

Semiconductor lasers for versatile applications from global communications to on-chip interconnects

NASA Astrophysics Data System (ADS)

Arai, Shigehisa

2015-01-01

Since semiconductor lasers were realized in 1962, various efforts have been made to enrich human life thorough novel equipments and services. Among them optical fiber communications in global communications have brought out marvelous information technology age represented by the internet. In this paper, emerging topics made on GaInAsP/InP based long-wavelength lasers toward ultra-low power consumption semiconductor lasers for optical interconnects in supercomputers as well as in future LSIs are presented.

Computerized design and generation of space-variant holographic filters. II - Applications of space-variant filters to optical computing

NASA Technical Reports Server (NTRS)

Ambs, P.; Fainman, Y.; Esener, S.; Lee, S. H.

1988-01-01

Holographic optical elements (HOEs) of space-variant impulse response have been designed and generated using a computerized optical system. HOEs made of dichromated gelatin have been produced and used for spatial light modulator defect removal and optical interconnects. Experimental performance and characteristics are presented.

Single-chip photonic transceiver based on bulk-silicon, as a chip-level photonic I/O platform for optical interconnects.

PubMed

Kim, Gyungock; Park, Hyundai; Joo, Jiho; Jang, Ki-Seok; Kwack, Myung-Joon; Kim, Sanghoon; Kim, In Gyoo; Oh, Jin Hyuk; Kim, Sun Ae; Park, Jaegyu; Kim, Sanggi

2015-06-10

When silicon photonic integrated circuits (PICs), defined for transmitting and receiving optical data, are successfully monolithic-integrated into major silicon electronic chips as chip-level optical I/Os (inputs/outputs), it will bring innovative changes in data computing and communications. Here, we propose new photonic integration scheme, a single-chip optical transceiver based on a monolithic-integrated vertical photonic I/O device set including light source on bulk-silicon. This scheme can solve the major issues which impede practical implementation of silicon-based chip-level optical interconnects. We demonstrated a prototype of a single-chip photonic transceiver with monolithic-integrated vertical-illumination type Ge-on-Si photodetectors and VCSELs-on-Si on the same bulk-silicon substrate operating up to 50 Gb/s and 20 Gb/s, respectively. The prototype realized 20 Gb/s low-power chip-level optical interconnects for λ ~ 850 nm between fabricated chips. This approach can have a significant impact on practical electronic-photonic integration in high performance computers (HPC), cpu-memory interface, hybrid memory cube, and LAN, SAN, data center and network applications.

Planar waveguide microlenses for nonblocking photonic switches and optical interconnects

NASA Astrophysics Data System (ADS)

Glebov, Alexei L.; Huang, Lidu; Lee, Michael; Aoki, Shigenori; Yokouchi, Kishio

2004-09-01

Different types of planar waveguide microlenses are fabricated with PLC technologies from a variety of optical materials such as silica, photo-definable epoxy resins, and a number of other optical polymers. Hybrid microlenses are also fabricated in which the base of the lens, with a double concave gap, is formed from silica and the gap is filled with an optical polymer. The optimized lens structures provide the maximum coupling efficiencies between the input and output channels at distances up to 100 mm with a minimum channel pitch of 0.5-0.7 mm. Experimental and theoretical studies provide results on collimation and focusing properties of single and double microlenses made of silica, polymer, and silica/polymer. The evaluation of the temperature and wavelength effects on the collimation characteristics of the lenses demonstrate that the single lenses are more stable and, thus, more suitable for operations under varying conditions. Examples of the planar waveguide microlens applications are presented. In one application the microlens arrays are integrated in fast electrooptic photonic switching modules. In the other application the microlenses are embedded in the backplanes with nonblocking optical interconnects.

Embedded 100 Gbps Photonic Components

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kuznia, Charlie

This innovation to fiber optic component technology increases the performance, reduces the size and reduces the power consumption of optical communications within dense network systems, such as advanced distributed computing systems and data centers. VCSEL technology is enabling short-reach (< 100 m) and >100 Gbps optical interconnections over multi-mode fiber in commercial applications.

Power inverter with optical isolation

DOEpatents

Duncan, Paul G.; Schroeder, John Alan

2005-12-06

An optically isolated power electronic power conversion circuit that includes an input electrical power source, a heat pipe, a power electronic switch or plurality of interconnected power electronic switches, a mechanism for connecting the switch to the input power source, a mechanism for connecting comprising an interconnecting cable and/or bus bar or plurality of interconnecting cables and/or input bus bars, an optically isolated drive circuit connected to the switch, a heat sink assembly upon which the power electronic switch or switches is mounted, an output load, a mechanism for connecting the switch to the output load, the mechanism for connecting including an interconnecting cable and/or bus bar or plurality of interconnecting cables and/or output bus bars, at least one a fiber optic temperature sensor mounted on the heat sink assembly, at least one fiber optic current sensor mounted on the load interconnection cable and/or output bus bar, at least one fiber optic voltage sensor mounted on the load interconnection cable and/or output bus bar, at least one fiber optic current sensor mounted on the input power interconnection cable and/or input bus bar, and at least one fiber optic voltage sensor mounted on the input power interconnection cable and/or input bus bar.

Optical Interconnections for VLSI Computational Systems Using Computer-Generated Holography.

NASA Astrophysics Data System (ADS)

Feldman, Michael Robert

Optical interconnects for VLSI computational systems using computer generated holograms are evaluated in theory and experiment. It is shown that by replacing particular electronic connections with free-space optical communication paths, connection of devices on a single chip or wafer and between chips or modules can be improved. Optical and electrical interconnects are compared in terms of power dissipation, communication bandwidth, and connection density. Conditions are determined for which optical interconnects are advantageous. Based on this analysis, it is shown that by applying computer generated holographic optical interconnects to wafer scale fine grain parallel processing systems, dramatic increases in system performance can be expected. Some new interconnection networks, designed to take full advantage of optical interconnect technology, have been developed. Experimental Computer Generated Holograms (CGH's) have been designed, fabricated and subsequently tested in prototype optical interconnected computational systems. Several new CGH encoding methods have been developed to provide efficient high performance CGH's. One CGH was used to decrease the access time of a 1 kilobit CMOS RAM chip. Another was produced to implement the inter-processor communication paths in a shared memory SIMD parallel processor array.

Optical connections on flexible substrates

NASA Astrophysics Data System (ADS)

Bosman, Erwin; Geerinck, Peter; Christiaens, Wim; Van Steenberge, Geert; Vanfleteren, Jan; Van Daele, Peter

2006-04-01

Optical interconnections integrated on a flexible substrate combine the advantages of optical data transmissions (high bandwidth, no electromagnetic disturbance and low power consumption) and those of flexible substrates (compact, ease of assembly...). Especially the flexible character of the substrates can significantly lower the assembly cost and leads to more compact modules. Especially in automotive-, avionic-, biomedical and sensing applications there is a great potential for these flexible optical interconnections because of the increasing data-rates, increasing use of optical sensors and requirement for smaller size and weight. The research concentrates on the integration of commercially available polymer optical layers (Truemode Backplane TM Polymer, Ormocer®) on a flexible Polyimide film, the fabrication of waveguides and out-of plane deflecting 45° mirrors, the characterization of the optical losses due to the bending of the substrate, and the fabrication of a proof-of-principal demonstrator. The resulting optical structures should be compatible with the standard fabrication of flexible printed circuit boards.

Optical computing research

NASA Astrophysics Data System (ADS)

Goodman, Joseph W.

1987-10-01

Work Accomplished: OPTICAL INTERCONNECTIONS - the powerful interconnect abilities of optical beams have led much optimism about the possible roles for optics in solving interconnect problems at various levels of computer architecture. Examined were the powerful requirements of optical interconnects at the gate-to-gate and chip-to-chip levels. OPTICAL NEUTRAL NETWORKS - basic studies of the convergence properties on the Holfield model, based on mathematical approach - graph theory. OPTICS AND ARTIFICIAL INTELLIGENCE - review the field of optical processing and artificial intelligence, with the aim of finding areas that might be particularly attractive for future investigation(s).

Sense and nonsense of logic-level optical interconnect: reflections on an experiment

NASA Astrophysics Data System (ADS)

Van Campenhout, Jan M.; Brunfaut, Marnik; Meeus, Wim; Dambre, Joni; De Wilde, Michiel

2001-12-01

Centimeter-range high-density optical interconnect between chips is coming into reach with current optical interconnect technology. Many theoretical studies have identified several good reasons why to use such types of interconnect as a replacement of various layers of the traditional electronic interconnect hierarchy. However, the true feasibility and usefulness of optical interconnects can only be established by actually building and evaluating them in a real system setting. This contribution reports on our experience in using short-range high-density optical inter-chip interconnects. It is based on the design and construction of a fully functional optoelectronic demonstrator system. We discuss the rationale for building the demonstrator in the first place, the implications of using many low-level optical interconnections in electronic systems, and the degree to which our expectations have been fulfilled by the demonstrator. The detailed description of the architecture, design and implementation of the demonstrator is not presented here, but can be found elsewhere in this issue.

Deep Proton Writing for the rapid prototyping of polymer micro-components for optical interconnects and optofluidics

NASA Astrophysics Data System (ADS)

Van Erps, Jürgen; Vervaeke, Michael; Ottevaere, Heidi; Hermanne, Alex; Thienpont, Hugo

2013-07-01

The use of photonics in data communication and numerous other industrial applications brought plenty of prospects for innovation and opened up different unexplored market opportunities. This is a major driving force for the fabrication of micro-optical and micro-mechanical structures and their accurate alignment and integration into opto-mechanical modules and systems. To this end, we present Deep Proton Writing (DPW) as a powerful rapid prototyping technology for such micro-components. The DPW process consists of bombarding polymer samples (PMMA or SU-8) with swift protons, which results after chemical processing steps in high-quality micro-optical components. One of the strengths of the DPW micro-fabrication technology is the ability to fabricate monolithic building blocks that include micro-optical and mechanical functionalities which can be precisely integrated into more complex photonic systems. In this paper we comment on how we shifted from using 8.3 to 16.5 MeV protons for DPW and give some examples of micro-optical and micro-mechanical components recently fabricated through DPW, targeting applications in optical interconnections and in optofluidics.

Integrated optical circuit engineering V; Proceedings of the Meeting, San Diego, CA, Aug. 17-20, 1987

NASA Astrophysics Data System (ADS)

Mentzer, Mark A.

Recent advances in the theoretical and practical design and applications of optoelectronic devices and optical circuits are examined in reviews and reports. Topics discussed include system and market considerations, guided-wave phenomena, waveguide devices, processing technology, lithium niobate devices, and coupling problems. Consideration is given to testing and measurement, integrated optics for fiber-optic systems, optical interconnect technology, and optical computing.

Single-chip photonic transceiver based on bulk-silicon, as a chip-level photonic I/O platform for optical interconnects

PubMed Central

Kim, Gyungock; Park, Hyundai; Joo, Jiho; Jang, Ki-Seok; Kwack, Myung-Joon; Kim, Sanghoon; Gyoo Kim, In; Hyuk Oh, Jin; Ae Kim, Sun; Park, Jaegyu; Kim, Sanggi

2015-01-01

When silicon photonic integrated circuits (PICs), defined for transmitting and receiving optical data, are successfully monolithic-integrated into major silicon electronic chips as chip-level optical I/Os (inputs/outputs), it will bring innovative changes in data computing and communications. Here, we propose new photonic integration scheme, a single-chip optical transceiver based on a monolithic-integrated vertical photonic I/O device set including light source on bulk-silicon. This scheme can solve the major issues which impede practical implementation of silicon-based chip-level optical interconnects. We demonstrated a prototype of a single-chip photonic transceiver with monolithic-integrated vertical-illumination type Ge-on-Si photodetectors and VCSELs-on-Si on the same bulk-silicon substrate operating up to 50 Gb/s and 20 Gb/s, respectively. The prototype realized 20 Gb/s low-power chip-level optical interconnects for λ ~ 850 nm between fabricated chips. This approach can have a significant impact on practical electronic-photonic integration in high performance computers (HPC), cpu-memory interface, hybrid memory cube, and LAN, SAN, data center and network applications. PMID:26061463

Optical interconnections and networks; Proceedings of the Meeting, The Hague, Netherlands, Mar. 14, 15, 1990

NASA Technical Reports Server (NTRS)

Bartelt, Hartmut (Editor)

1990-01-01

The conference presents papers on interconnections, clock distribution, neural networks, and components and materials. Particular attention is given to a comparison of optical and electrical data interconnections at the board and backplane levels, a wafer-level optical interconnection network layout, an analysis and simulation of photonic switch networks, and the integration of picosecond GaAs photoconductive devices with silicon circuits for optical clocking and interconnects. Consideration is also given to the optical implementation of neural networks, invariance in an optoelectronic implementation of neural networks, and the recording of reversible patterns in polymer lightguides.

VCSEL Applications and Simulation

NASA Technical Reports Server (NTRS)

Cheung, Samson; Goorjian, Peter; Ning, Cun-Zheng; Li, Jian-Zhong

2000-01-01

This viewgraph presentation gives an overview of Vertical Cavity Surface Emitting Laser (VCSEL) simulation and its applications. Details are given on the optical interconnection in information technology of VCSEL, the formulation of the simulation, its numeric algorithm, and the computational results.

Application of the fractional Fourier transform to the design of LCOS based optical interconnects and fiber switches.

PubMed

Robertson, Brian; Zhang, Zichen; Yang, Haining; Redmond, Maura M; Collings, Neil; Liu, Jinsong; Lin, Ruisheng; Jeziorska-Chapman, Anna M; Moore, John R; Crossland, William A; Chu, D P

2012-04-20

It is shown that reflective liquid crystal on silicon (LCOS) spatial light modulator (SLM) based interconnects or fiber switches that use defocus to reduce crosstalk can be evaluated and optimized using a fractional Fourier transform if certain optical symmetry conditions are met. Theoretically the maximum allowable linear hologram phase error compared to a Fourier switch is increased by a factor of six before the target crosstalk for telecom applications of -40 dB is exceeded. A Gerchberg-Saxton algorithm incorporating a fractional Fourier transform modified for use with a reflective LCOS SLM is used to optimize multi-casting holograms in a prototype telecom switch. Experiments are in close agreement to predicted performance.

Active holographic interconnects for interfacing volume storage

NASA Astrophysics Data System (ADS)

Domash, Lawrence H.; Schwartz, Jay R.; Nelson, Arthur R.; Levin, Philip S.

1992-04-01

In order to achieve the promise of terabit/cm3 data storage capacity for volume holographic optical memory, two technological challenges must be met. Satisfactory storage materials must be developed and the input/output architectures able to match their capacity with corresponding data access rates must also be designed. To date the materials problem has received more attention than devices and architectures for access and addressing. Two philosophies of parallel data access to 3-D storage have been discussed. The bit-oriented approach, represented by recent work on two-photon memories, attempts to store bits at local sites within a volume without affecting neighboring bits. High speed acousto-optic or electro- optic scanners together with dynamically focused lenses not presently available would be required. The second philosophy is that volume optical storage is essentially holographic in nature, and that each data write or read is to be distributed throughout the material volume on the basis of angle multiplexing or other schemes consistent with the principles of holography. The requirements for free space optical interconnects for digital computers and fiber optic network switching interfaces are also closely related to this class of devices. Interconnects, beamlet generators, angle multiplexers, scanners, fiber optic switches, and dynamic lenses are all devices which may be implemented by holographic or microdiffractive devices of various kinds, which we shall refer to collectively as holographic interconnect devices. At present, holographic interconnect devices are either fixed holograms or spatial light modulators. Optically or computer generated holograms (submicron resolution, 2-D or 3-D, encoding 1013 bits, nearly 100 diffraction efficiency) can implement sophisticated mathematical design principles, but of course once fabricated they cannot be changed. Spatial light modulators offer high speed programmability but have limited resolution (512 X 512 pixels, encoding about 106 bits of data) and limited diffraction efficiency. For any application, one must choose between high diffractive performance and programmability.

MQW Optical Feedback Modulators And Phase Shifters

NASA Technical Reports Server (NTRS)

Jackson, Deborah J.

1995-01-01

Laser diodes equipped with proposed multiple-quantum-well (MQW) optical feedback modulators prove useful in variety of analog and digital optical-communication applications, including fiber-optic signal-distribution networks and high-speed, low-crosstalk interconnections among super computers or very-high-speed integrated circuits. Development exploits accompanying electro-optical aspect of QCSE - variation in index of refraction with applied electric field. Also exploits sensitivity of laser diodes to optical feedback. Approach is reverse of prior approach.

A 25-Gbps high-sensitivity optical receiver with 10-Gbps photodiode using inductive input coupling for optical interconnects

NASA Astrophysics Data System (ADS)

Oku, Hideki; Narita, Kiyomi; Shiraishi, Takashi; Ide, Satoshi; Tanaka, Kazuhiro

2012-01-01

A 25-Gbps high-sensitivity optical receiver with a 10-Gbps photodiode (PD) using inductive input coupling has been demonstrated for optical interconnects. We introduced the inductive input coupling technique to achieve the 25-Gbps optical receiver using a 10-Gbps PD. We implemented an input inductor (Lin) between the PD and trans-impedance amplifier (TIA), and optimized inductance to enhance the bandwidth and reduce the input referred noise current through simulation with the RF PD-model. Near the resonance frequency of the tank circuit formed by PD capacitance, Lin, and TIA input capacitance, the PD photo-current through Lin into the TIA is enhanced. This resonance has the effects of enhancing the bandwidth at TIA input and reducing the input equivalent value of the noise current from TIA. We fabricated the 25-Gbps optical receiver with the 10-Gbps PD using an inductive input coupling technique. Due to the application of an inductor, the receiver bandwidth is enhanced from 10 GHz to 14.2 GHz. Thanks to this wide-band and low-noise performance, we were able to improve the sensitivity at an error rate of 1E-12 from non-error-free to -6.5 dBm. These results indicate that our technique is promising for cost-effective optical interconnects.

A high-speed GaAs MESFET optical controller

NASA Technical Reports Server (NTRS)

Claspy, P. C.; Bhasin, K. B.; Richard, M.; Bendett, M.; Gustafson, G.

1989-01-01

Optical interconnects are being considered for control signal distribution in phased array antennas. A packaged hybrid GaAs optical controller with a 1:16 demultiplexed output that is suitable for this application is described. The controller, which was fabricated using enhancement/depletion mode MESFET technology, operates at demultiplexer-limited input data rates up to 305 Mb/s and requires less than 200 microW optical input power.

Optical interconnection and packaging technologies for advanced avionics systems

NASA Astrophysics Data System (ADS)

Schroeder, J. E.; Christian, N. L.; Cotti, B.

1992-09-01

An optical backplane developed to demonstrate the advantages of high-performance optical interconnections and supporting technologies and designed to be compatible with standard avionics racks is described. The hardware demonstrates the three basic components of optical interconnects: optical sources, an optical signal distribution network, and optical receivers. Results from characterization and environmental tests, including a demonstration of the reliable transmission of serial data at a 1 Gb/s, are reported.

Optics vs copper: from the perspective of "Thunderbolt" interconnect technology

NASA Astrophysics Data System (ADS)

Cheng, Hengju; Krause, Christine; Ko, Jamyuen; Gao, Miaobin; Liu, Guobin; Wu, Huichin; Qi, Mike; Lam, Chun-Chit

2013-02-01

Interconnect technology has been progressed at a very fast pace for the past decade. The signaling rates have steadily increased from 100:Mb/s to 25Gb/s. In every generation of interconnect technology evolution, optics always seems to take over at first, however, at the end, the cost advantage of copper wins over. Because of this, optical interconnects are limited to longer distance links where the attenuation in copper cable is too large for the integrated circuits to compensate. Optical interconnect has long been viewed as the premier solution in compared with copper interconnect. With the release of Thunderbolt technology, we are entering a new era in consumer electronics that runs at 10Gb/s line rate (20Gb/s throughput per connector interface). Thunderbolt interconnect technology includes both active copper cables and active optical cables as the transmission media which have very different physical characteristics. In order for optics to succeed in consumer electronics, several technology hurdles need to be cleared. For example, the optical cable needs to handle the consumer abuses such as pinch and bend. Also, the optical engine used in the active optical cable needs to be physically very small so that we don't change the looks and feels of the cable/connector. Most importantly, the cost of optics needs to come down significantly to effectively compete with the copper solution. Two interconnect technologies are compared and discussed on the relative cost, power consumption, form factor, density, and future scalability.

Optical backplane interconnect switch for data processors and computers

NASA Technical Reports Server (NTRS)

Hendricks, Herbert D.; Benz, Harry F.; Hammer, Jacob M.

1989-01-01

An optoelectronic integrated device design is reported which can be used to implement an all-optical backplane interconnect switch. The switch is sized to accommodate an array of processors and memories suitable for direct replacement into the basic avionic multiprocessor backplane. The optical backplane interconnect switch is also suitable for direct replacement of the PI bus traffic switch and at the same time, suitable for supporting pipelining of the processor and memory. The 32 bidirectional switchable interconnects are configured with broadcast capability for controls, reconfiguration, and messages. The approach described here can handle a serial interconnection of data processors or a line-to-link interconnection of data processors. An optical fiber demonstration of this approach is presented.

47 CFR 64.1401 - Expanded interconnection.

Code of Federal Regulations, 2011 CFR

2011-10-01

... such equipment to connect interconnectors' fiber optic systems or microwave radio transmission... interconnectors' fiber optic systems or microwave radio transmission facilities (where reasonably feasible) with... interconnection of fiber optic facilities, local exchange carriers shall provide: (1) An interconnection point or...

47 CFR 64.1401 - Expanded interconnection.

Code of Federal Regulations, 2010 CFR

2010-10-01

... such equipment to connect interconnectors' fiber optic systems or microwave radio transmission... interconnectors' fiber optic systems or microwave radio transmission facilities (where reasonably feasible) with... interconnection of fiber optic facilities, local exchange carriers shall provide: (1) An interconnection point or...

Reconfigurable optical interconnections via dynamic computer-generated holograms

NASA Technical Reports Server (NTRS)

Liu, Hua-Kuang (Inventor); Zhou, Shaomin (Inventor)

1994-01-01

A system is proposed for optically providing one-to-many irregular interconnections, and strength-adjustable many-to-many irregular interconnections which may be provided with strengths (weights) w(sub ij) using multiple laser beams which address multiple holograms and means for combining the beams modified by the holograms to form multiple interconnections, such as a cross-bar switching network. The optical means for interconnection is based on entering a series of complex computer-generated holograms on an electrically addressed spatial light modulator for real-time reconfigurations, thus providing flexibility for interconnection networks for largescale practical use. By employing multiple sources and holograms, the number of interconnection patterns achieved is increased greatly.

High-speed highly temperature stable 980 nm VCSELs operating at 25 Gb/s at up to 85 °C for short reach optical interconnects

NASA Astrophysics Data System (ADS)

Mutig, Alex; Lott, James A.; Blokhin, Sergey A.; Moser, Philip; Wolf, Philip; Hofmann, Werner; Nadtochiy, Alexey M.; Bimberg, Dieter

2011-03-01

The progressive penetration of optical communication links into traditional copper interconnect markets greatly expands the applications of vertical cavity surface emitting lasers (VCSELs) for the next-generation of board-to-board, moduleto- module, chip-to-chip, and on-chip optical interconnects. Stability of the VCSEL parameters at high temperatures is indispensable for such applications, since these lasers typically reside directly on or near integrated circuit chips. Here we present 980 nm oxide-confined VCSELs operating error-free at bit rates up to 25 Gbit/s at temperatures as high as 85 °C without adjustment of the drive current and peak-to-peak modulation voltage. The driver design is therefore simplified and the power consumption of the driver electronics is lowered, reducing the production and operational costs. Small and large signal modulation experiments at various temperatures from 20 up to 85 °C for lasers with different oxide aperture diameters are presented in order to analyze the physical processes controlling the performance of the VCSELs. Temperature insensitive maximum -3 dB bandwidths of around 13-15 GHz for VCSELs with aperture diameters of 10 μm and corresponding parasitic cut-off frequencies exceeding 22 GHz are observed. Presented results demonstrate the suitability of our VCSELs for practical high speed and high temperature stable short-reach optical links.

Board-to-board optical interconnection using novel optical plug and slot

NASA Astrophysics Data System (ADS)

Cho, In K.; Yoon, Keun Byoung; Ahn, Seong H.; Kim, Jin Tae; Lee, Woo Jin; Shin, Kyoung Up; Heo, Young Un; Park, Hyo Hoon

2004-10-01

A novel optical PCB with transmitter/receiver system boards and optical bakcplane was prepared, which is board-to-board interconnection by optical plug and slot. We report an 8Gb/s PRBS NRZ data transmission between transmitter system board and optical backplane embedded multimode polymeric waveguide arrays. The basic concept of ETRI's optical PCB is as follows; 1) Metal optical bench is integrated with optoelectronic devices, driver and receiver circuits, polymeric waveguide and access line PCB module. 2) Multimode polymeric waveguide inside an optical backplane, which is embedded into PCB. 3) Optical slot and plug for high-density(channel pitch : 500um) board-to-board interconnection. The polymeric waveguide technology can be used for transmission of data on transmitter/ receiver system boards and for backplane interconnections. The main components are low-loss tapered polymeric waveguides and a novel optical plug and slot for board-to-board interconnections, respectively. The optical PCB is characteristic of low coupling loss, easy insertion/extraction of the boards and, especially, reliable optical coupling unaffected from external environment after board insertion.

Optical data transmission technology for fixed and drag-on STS payload umbilicals, volume 2

NASA Technical Reports Server (NTRS)

St.denis, R. W.

1981-01-01

Optical data handling methods are studied as applicable to payload communications checkout and monitoring. Both payload umbilicals and interconnecting communication lines carrying payload data are examined for the following: (1) ground checkout requirements; (2) optical approach (technical survey of optical approaches, selection of optimum approach); (3) survey and select components; (4) compare with conventional approach; and (5) definition of follow on activity.

Wavelength-addressed intra-board optical interconnection by plug-in alignment with a micro hole array

NASA Astrophysics Data System (ADS)

Nakama, Kenichi; Tokiwa, Yuu; Mikami, Osamu

2010-09-01

Intra-board interconnection between optical waveguide channels is suitable for assembling high-speed optoelectronic printed wiring boards (OE-PWB). Here, we propose a novel optical interconnection method combining techniques for both wavelength-based optical waveguide addressing and plug-in optical waveguide alignment with a micro-hole array (MHA). This array was fabricated by the mask transfer method. For waveguide addressing, we used a micro passive wavelength selector (MPWS) module, which is a type of Littrow mount monochromator consisting of an optical diffraction grating, a focusing lens, and the MHA. From the experimental results, we found that the wavelength addressing operation of the MPWS module was effective for intra-board optical interconnection.

A nanostructure based on metasurfaces for optical interconnects

NASA Astrophysics Data System (ADS)

Lin, Shulang; Gu, Huarong

2017-08-01

Optical-electronic Integrated Neural Co-processor takes vital part in optical neural network, which is mainly realized by optical interconnects. Because of the accuracy requirement and long-term goal of integration, optical interconnects should be effective and pint-size. In traditional solutions of optical interconnects, holography built on crystalloid or law of Fresnel diffraction exploited on zone plate was used. However, holographic method cannot meet the efficiency requirement and zone plate is too bulk to make the optical neural unit miniaturization. Thus, this paper aims to find a way to replace holographic method or zone plate with enough diffraction efficiency and smaller size. Metasurfaces are composed of subwavelength-spaced phase shifters at an interface of medium. Metasurfaces allow for unprecedented control of light properties. They also have advanced optical technology of enabling versatile functionalities in a planar structure. In this paper, a nanostructure is presented for optical interconnects. The comparisons of light splitting ability and simulated crosstalk between nanostructure and zone plate are also made.

Reconfigurable Optical Interconnections Via Dynamic Computer-Generated Holograms

NASA Technical Reports Server (NTRS)

Liu, Hua-Kuang (Inventor); Zhou, Shao-Min (Inventor)

1996-01-01

A system is presented for optically providing one-to-many irregular interconnections, and strength-adjustable many-to-many irregular interconnections which may be provided with strengths (weights) w(sub ij) using multiple laser beams which address multiple holograms and means for combining the beams modified by the holograms to form multiple interconnections, such as a cross-bar switching network. The optical means for interconnection is based on entering a series of complex computer-generated holograms on an electrically addressed spatial light modulator for real-time reconfigurations, thus providing flexibility for interconnection networks for large-scale practical use. By employing multiple sources and holograms, the number of interconnection patterns achieved is increased greatly.

Optical fiber sensors embedded in flexible polymer foils

NASA Astrophysics Data System (ADS)

van Hoe, Bram; van Steenberge, Geert; Bosman, Erwin; Missinne, Jeroen; Geernaert, Thomas; Berghmans, Francis; Webb, David; van Daele, Peter

2010-04-01

In traditional electrical sensing applications, multiplexing and interconnecting the different sensing elements is a major challenge. Recently, many optical alternatives have been investigated including optical fiber sensors of which the sensing elements consist of fiber Bragg gratings. Different sensing points can be integrated in one optical fiber solving the interconnection problem and avoiding any electromagnetical interference (EMI). Many new sensing applications also require flexible or stretchable sensing foils which can be attached to or wrapped around irregularly shaped objects such as robot fingers and car bumpers or which can even be applied in biomedical applications where a sensor is fixed on a human body. The use of these optical sensors however always implies the use of a light-source, detectors and electronic circuitry to be coupled and integrated with these sensors. The coupling of these fibers with these light sources and detectors is a critical packaging problem and as it is well-known the costs for packaging, especially with optoelectronic components and fiber alignment issues are huge. The end goal of this embedded sensor is to create a flexible optical sensor integrated with (opto)electronic modules and control circuitry. To obtain this flexibility, one can embed the optical sensors and the driving optoelectronics in a stretchable polymer host material. In this article different embedding techniques for optical fiber sensors are described and characterized. Initial tests based on standard manufacturing processes such as molding and laser structuring are reported as well as a more advanced embedding technique based on soft lithography processing.

Misalignment corrections in optical interconnects

NASA Astrophysics Data System (ADS)

Song, Deqiang

Optical interconnects are considered a promising solution for long distance and high bitrate data transmissions, outperforming electrical interconnects in terms of loss and dispersion. Due to the bandwidth and distance advantage of optical interconnects, longer links have been implemented with optics. Recent studies show that optical interconnects have clear advantages even at very short distances---intra system interconnects. The biggest challenge for such optical interconnects is the alignment tolerance. Many free space optical components require very precise assembly and installation, and therefore the overall cost could be increased. This thesis studied the misalignment tolerance and possible alignment correction solutions for optical interconnects at backplane or board level. First the alignment tolerance for free space couplers was simulated and the result indicated the most critical alignments occur between the VCSEL, waveguide and microlens arrays. An in-situ microlens array fabrication method was designed and experimentally demonstrated, with no observable misalignment with the waveguide array. At the receiver side, conical lens arrays were proposed to replace simple microlens arrays for a larger angular alignment tolerance. Multilayer simulation models in CodeV were built to optimized the refractive index and shape profiles of the conical lens arrays. Conical lenses fabricated with micro injection molding machine and fiber etching were characterized. Active component VCSOA was used to correct misalignment in optical connectors between the board and backplane. The alignment correction capability were characterized for both DC and AC (1GHz) optical signal. The speed and bandwidth of the VCSOA was measured and compared with a same structure VCSEL. Based on the optical inverter being studied in our lab, an all-optical flip-flop was demonstrated using a pair of VCSOAs. This memory cell with random access ability can store one bit optical signal with set or reset beam. The operating conditions were studied to generate two stable states between the VCSOA pair. The entire functionality test was implemented with free space optical components.

Optical information processing at NASA Ames Research Center

NASA Technical Reports Server (NTRS)

Reid, Max B.; Bualat, Maria G.; Cho, Young C.; Downie, John D.; Gary, Charles K.; Ma, Paul W.; Ozcan, Meric; Pryor, Anna H.; Spirkovska, Lilly

1993-01-01

The combination of analog optical processors with digital electronic systems offers the potential of tera-OPS computational performance, while often requiring less power and weight relative to all-digital systems. NASA is working to develop and demonstrate optical processing techniques for on-board, real time science and mission applications. Current research areas and applications under investigation include optical matrix processing for space structure vibration control and the analysis of Space Shuttle Main Engine plume spectra, optical correlation-based autonomous vision for robotic vehicles, analog computation for robotic path planning, free-space optical interconnections for information transfer within digital electronic computers, and multiplexed arrays of fiber optic interferometric sensors for acoustic and vibration measurements.

Design of a multi-channel free space optical interconnection component

NASA Astrophysics Data System (ADS)

Jia, Da-Gong; Zhang, Pei-Song; Jing, Wen-Cai; Tan, Jun; Zhang, Hong-Xia; Zhang, Yi-Mo

2008-11-01

A multi-channel free space optical interconnection component, fiber optic rotary joint, was designed using a Dove prism. When the Dove prism is rotated an angle of α around the longitudinal axis, the image rotates an angle of 2 α. The optical interconnection component consists of the signal transmission system, Dove prim and driving mechanism. The planetary gears are used to achieve the speed ratio of 2:1 between the total optical interconnection component and the Dove prism. The C-lenses are employed to couple different optical signals in the signal transmission system. The coupling loss between the receiving fiber of stationary part and the transmitting fiber of rotary part is measured.

Comparison of microrings and microdisks for high-speed optical modulation in silicon photonics

NASA Astrophysics Data System (ADS)

Ying, Zhoufeng; Wang, Zheng; Zhao, Zheng; Dhar, Shounak; Pan, David Z.; Soref, Richard; Chen, Ray T.

2018-03-01

The past several decades have witnessed the gradual transition from electrical to optical interconnects, ranging from long-haul telecommunication to chip-to-chip interconnects. As one type of key component in integrated optical interconnect and high-performance computing, optical modulators have been well developed these past few years, including ultrahigh-speed microring and microdisk modulators. In this paper, a comparison between microring and microdisk modulators is well analyzed in terms of dimensions, static and dynamic power consumption, and fabrication tolerance. The results show that microdisks have advantages over microrings in these aspects, which gives instructions to the chip design of high-density integrated systems for optical interconnects and optical computing.

DISCRETE EVENT SIMULATION OF OPTICAL SWITCH MATRIX PERFORMANCE IN COMPUTER NETWORKS

DOE Office of Scientific and Technical Information (OSTI.GOV)

Imam, Neena; Poole, Stephen W

2013-01-01

In this paper, we present application of a Discrete Event Simulator (DES) for performance modeling of optical switching devices in computer networks. Network simulators are valuable tools in situations where one cannot investigate the system directly. This situation may arise if the system under study does not exist yet or the cost of studying the system directly is prohibitive. Most available network simulators are based on the paradigm of discrete-event-based simulation. As computer networks become increasingly larger and more complex, sophisticated DES tool chains have become available for both commercial and academic research. Some well-known simulators are NS2, NS3, OPNET,more » and OMNEST. For this research, we have applied OMNEST for the purpose of simulating multi-wavelength performance of optical switch matrices in computer interconnection networks. Our results suggest that the application of DES to computer interconnection networks provides valuable insight in device performance and aids in topology and system optimization.« less

A macrochip interconnection network enabled by silicon nanophotonic devices.

PubMed

Zheng, Xuezhe; Cunningham, John E; Koka, Pranay; Schwetman, Herb; Lexau, Jon; Ho, Ron; Shubin, Ivan; Krishnamoorthy, Ashok V; Yao, Jin; Mekis, Attila; Pinguet, Thierry

2010-03-01

We present an advanced wavelength-division multiplexing point-to-point network enabled by silicon nanophotonic devices. This network offers strictly non-blocking all-to-all connectivity while maximizing bisection bandwidth, making it ideal for multi-core and multi-processor interconnections. We introduce one of the key components, the nanophotonic grating coupler, and discuss, for the first time, how this device can be useful for practical implementations of the wavelength-division multiplexing network using optical proximity communications. Finite difference time-domain simulation of the nanophotonic grating coupler device indicates that it can be made compact (20 microm x 50 microm), low loss (3.8 dB), and broadband (100 nm). These couplers require subwavelength material modulation at the nanoscale to achieve the desired functionality. We show that optical proximity communication provides unmatched optical I/O bandwidth density to electrical chips, which enables the application of wavelength-division multiplexing point-to-point network in macrochip with unprecedented bandwidth-density. The envisioned physical implementation is discussed. The benefits of such an interconnect network include a 5-6x improvement in latency when compared to a purely electronic implementation. Performance analysis shows that the wavelength-division multiplexing point-to-point network offers better overall performance over other optical network architectures.

Performance evaluation of multi-stratum resources integration based on network function virtualization in software defined elastic data center optical interconnect.

PubMed

Yang, Hui; Zhang, Jie; Ji, Yuefeng; Tian, Rui; Han, Jianrui; Lee, Young

2015-11-30

Data center interconnect with elastic optical network is a promising scenario to meet the high burstiness and high-bandwidth requirements of data center services. In our previous work, we implemented multi-stratum resilience between IP and elastic optical networks that allows to accommodate data center services. In view of this, this study extends to consider the resource integration by breaking the limit of network device, which can enhance the resource utilization. We propose a novel multi-stratum resources integration (MSRI) architecture based on network function virtualization in software defined elastic data center optical interconnect. A resource integrated mapping (RIM) scheme for MSRI is introduced in the proposed architecture. The MSRI can accommodate the data center services with resources integration when the single function or resource is relatively scarce to provision the services, and enhance globally integrated optimization of optical network and application resources. The overall feasibility and efficiency of the proposed architecture are experimentally verified on the control plane of OpenFlow-based enhanced software defined networking (eSDN) testbed. The performance of RIM scheme under heavy traffic load scenario is also quantitatively evaluated based on MSRI architecture in terms of path blocking probability, provisioning latency and resource utilization, compared with other provisioning schemes.

A MIMO-Inspired Rapidly Switchable Photonic Interconnect Architecture (Postprint)

DTIC Science & Technology

2009-07-01

capabilities of future systems. Highspeed optical processing has been looked to as a means for eliminating this interconnect bottleneck. Presented...here are the results of a study for a novel optical (integrated photonic) processor which would allow for a high-speed, secure means for arbitrarily...regarded as a Multiple Input Multiple Output (MIMO) architecture. 15. SUBJECT TERMS Free-space optical interconnects, Optical Phased Arrays, High-Speed

Fabrication of Fresnel micro lens array in borosilicate glass by F2-laser ablation for glass interposer application

NASA Astrophysics Data System (ADS)

Brusberg, Lars; Neitz, Marcel; Schröder, Henning; Fricke-Begemann, Thomas; Ihlemann, Jürgen

2014-03-01

The future need for more bandwidth forces the development of optical transmission solutions for rack-to-rack, boardto- board and chip-to-chip interconnects. The goals are significant reduction of power consumption, highest density and potential for bandwidth scalability to overcome the limitations of the systems today with mostly copper based interconnects. For system integration the enabling of thin glass as a substrate material for electro-optical components with integrated micro-optics for efficient light coupling to integrated optical waveguides or fibers is becoming important. Our glass based packaging approach merges micro-system packaging and glass integrated optics. This kind of packaging consists of a thin glass substrate with integrated micro lenses providing a platform for photonic component assembly and optical fiber or waveguide interconnection. Thin glass is commercially available in panel and wafer size and characterizes excellent optical and high frequency properties. That makes it perfect for microsystem packaging. A suitable micro lens approach has to be comparable with different commercial glasses and withstand post-processing like soldering. A benefit of using laser ablated Fresnel lenses is the planar integration capability in the substrate for highest integration density. In the paper we introduce our glass based packaging concept and the Fresnel lens design for different scenarios like chip-to-fiber, chip-to-optical-printed-circuit-board coupling. Based on the design the Fresnel lenses were fabricated by using a 157 nm fluorine laser ablation system.

Polarization-independent optical wavelength filter for channel dropping applications

DOEpatents

Deri, R.J.; Patterson, F.

1996-05-07

The polarization dependence of optical wavelength filters is eliminated by using waveguide directional couplers. Material birefringence is used to compensate for the waveguide (electromagnetic) birefringence which is the original cause of the polarization dependence. Material birefringence is introduced in a controllable fashion by replacing bulk waveguide layers by finely layered composites, such as multiple quantum wells using III-V semiconductor materials. The filter has use in wavelength-division multiplexed fiber optic communication systems. This filter has broad application for wavelength-tunable receivers in fiber optic communication links, which may be used for telecommunications, optical computer interconnect links, or fiber optic sensor systems. Since multiple-wavelength systems are increasingly being used for all of these applications, the filter is useable whenever a rapidly tunable, wavelength-filtering receiver is required. 14 figs.

Polarization-independent optical wavelength filter for channel dropping applications

DOEpatents

Deri, Robert J.; Patterson, Frank

1996-01-01

The polarization dependence of optical wavelength filters is eliminated by using waveguide directional couplers. Material birefringence is used to compensate for the waveguide (electromagnetic) birefringence which is the original cause of the polarization dependence. Material birefringence is introduced in a controllable fashion by replacing bulk waveguide layers by finely layered composites, such as multiple quantum wells using III-V semiconductor materials. The filter has use in wavelength-division-multiplexed fiber optic communication systems. This filter has broad application for wavelength-tunable receivers in fiber optic communication links, which may be used for telecommunications, optical computer interconnect links, or fiber optic sensor systems. Since multiple-wavelength systems are increasingly being used for all of these applications, the filter is useable whenever a rapidly tunable, wavelength-filtering receiver is required.

Novel optical interconnect devices and coupling methods applying self-written waveguide technology

NASA Astrophysics Data System (ADS)

Nakama, Kenichi; Mikami, Osamu

2011-05-01

For the use in cost-effective optical interconnection of opt-electronic printed wiring boards (OE-PWBs), we have developed novel optical interconnect devices and coupling methods simplifying board to board optical interconnect. All these are based on the self-written waveguide (SWW) technology by the mask-transfer method with light-curable resin. This method enables fabrication of arrayed M × N optical channels at one shot of UV light. Very precise patterns, as an example, optical rod with diameters of 50μm to 500μm, can be easily fabricated. The length of the fabricated patterns ,, typically up to about 1000μm , can be controlled by a spacer placed between the photomask and the substrate. Using these technologies, several new optical interfaces have been demonstrated. These are a chip VCSEL with an optical output rod and new coupling methods of "plug-in" alignment and "optical socket" based on SWW.

Single MoO3 nanoribbon waveguides: good building blocks as elements and interconnects for nanophotonic applications

NASA Astrophysics Data System (ADS)

Zhang, Li; Wu, Guoqing; Gu, Fuxing; Zeng, Heping

2015-11-01

Exploring new nanowaveguide materials and structures is of great scientific interest and technological significance for optical and photonic applications. In this work, high-quality single-crystal MoO3 nanoribbons (NRs) are synthesized and used for optical guiding. External light sources are efficiently launched into the single MoO3 NRs using silica fiber tapers. It is found that single MoO3 NRs are as good nanowaveguides with loss optical losses (typically less than 0.1 dB/μm) and broadband optical guiding in the visible/near-infrared region. Single MoO3 NRs have good Raman gains that are comparable to those of semiconductor nanowaveguides, but the second harmonic generation efficiencies are about 4 orders less than those of semiconductor nanowaveguides. And also no any third-order nonlinear optical effects are observed at high pump power. A hybrid Fabry-Pérot cavity containing an active CdSe nanowire and a passive MoO3 NR is also demonstrated, and the ability of coupling light from other active nanostructures and fluorescent liquid solutions has been further demonstrated. These optical properties make single MoO3 NRs attractive building blocks as elements and interconnects in miniaturized photonic circuitries and devices.

Three Dimensionally Interconnected Silicon Nanomembranes for Optical Phased Array (OPA) and Optical True Time Delay (TTD) Applications

DTIC Science & Technology

2012-06-01

Nanophotonic Waveguides," J. Lightwave Technol. 25 (1), 151-156 (2007). [7-4] Yongbo Tang, Zhechao Wang, Lech Wosinski, Urban Westergren, and Sailing...Waveguides," Photonics Journal, IEEE 3 (2), 203-208 (2011). [8-25] Zhechao Wang, Ning Zhu, Yongbo Tang, Lech Wosinski, Daoxin Dai, and Sailing He

Low-power chip-level optical interconnects based on bulk-silicon single-chip photonic transceivers

NASA Astrophysics Data System (ADS)

Kim, Gyungock; Park, Hyundai; Joo, Jiho; Jang, Ki-Seok; Kwack, Myung-Joon; Kim, Sanghoon; Kim, In Gyoo; Kim, Sun Ae; Oh, Jin Hyuk; Park, Jaegyu; Kim, Sanggi

2016-03-01

We present new scheme for chip-level photonic I/Os, based on monolithically integrated vertical photonic devices on bulk silicon, which increases the integration level of PICs to a complete photonic transceiver (TRx) including chip-level light source. A prototype of the single-chip photonic TRx based on a bulk silicon substrate demonstrated 20 Gb/s low power chip-level optical interconnects between fabricated chips, proving that this scheme can offer compact low-cost chip-level I/O solutions and have a significant impact on practical electronic-photonic integration in high performance computers (HPC), cpu-memory interface, 3D-IC, and LAN/SAN/data-center and network applications.

High-speed free-space based reconfigurable card-to-card optical interconnects with broadcast capability.

PubMed

Wang, Ke; Nirmalathas, Ampalavanapillai; Lim, Christina; Skafidas, Efstratios; Alameh, Kamal

2013-07-01

In this paper, we propose and experimentally demonstrate a free-space based high-speed reconfigurable card-to-card optical interconnect architecture with broadcast capability, which is required for control functionalities and efficient parallel computing applications. Experimental results show that 10 Gb/s data can be broadcast to all receiving channels for up to 30 cm with a worst-case receiver sensitivity better than -12.20 dBm. In addition, arbitrary multicasting with the same architecture is also investigated. 10 Gb/s reconfigurable point-to-point link and multicast channels are simultaneously demonstrated with a measured receiver sensitivity power penalty of ~1.3 dB due to crosstalk.

A direct modulated optical link for MRI RF receive coil interconnection.

PubMed

Yuan, Jing; Wei, Juan; Shen, G X

2007-11-01

Optical glass fiber is a promising alternative to traditional coaxial cables for MRI RF receive coil interconnection to avoid any crosstalk and electromagnetic interference between multiple channels. A direct modulated optical link is proposed for MRI coil interconnection in this paper. The link performances of power gain, frequency response and dynamic range are measured. Phantom and in vivo human head images have been demonstrated by the connection of this direct modulated optical link to a head coil on a 0.3T MRI scanner for the first time. Comparable image qualities to coaxial cable link verify the feasibility of using the optical link for imaging with minor modification on the existing scanners. This optical link could also be easily extended for multi-channel array interconnections at high field of 1.5 T.

Formation of interconnections to microfluidic devices

DOEpatents

Matzke, Carolyn M [Los Lunas, NM; Ashby, Carol I. H. [Edgewood, NM; Griego, Leonardo [Tijeras, NM

2003-07-29

A method is disclosed to form external interconnections to a microfluidic device for coupling of a fluid or light or both into a microchannel of the device. This method can be used to form optical or fluidic interconnections to microchannels previously formed on a substrate, or to form both the interconnections and microchannels during the same process steps. The optical and fluidic interconnections are formed parallel to the plane of the substrate, and are fluid tight.

Light emission from silicon: Some perspectives and applications

NASA Astrophysics Data System (ADS)

Fiory, A. T.; Ravindra, N. M.

2003-10-01

Research on efficient light emission from silicon devices is moving toward leading-edge advances in components for nano-optoelectronics and related areas. A silicon laser is being eagerly sought and may be at hand soon. A key advantage is in the use of silicon-based materials and processing, thereby using high yield and low-cost fabrication techniques. Anticipated applications include an optical emitter for integrated optical circuits, logic, memory, and interconnects; electro-optic isolators; massively parallel optical interconnects and cross connects for integrated circuit chips; lightwave components; high-power discrete and array emitters; and optoelectronic nanocell arrays for detecting biological and chemical agents. The new technical approaches resolve a basic issue with native interband electro-optical emission from bulk Si, which competes with nonradiative phonon- and defect-mediated pathways for electron-hole recombination. Some of the new ways to enhance optical emission efficiency in Si diode devices rely on carrier confinement, including defect and strain engineering in the bulk material. Others use Si nanocrystallites, nanowires, and alloying with Ge and crystal strain methods to achieve the carrier confinement required to boost radiative recombination efficiency. Another approach draws on the considerable progress that has been made in high-efficiency, solar-cell design and uses the reciprocity between photo- and light-emitting diodes. Important advances are also being made with silicon-oxide materials containing optically active rare-earth impurities.

Photonic Integrated Circuits

NASA Technical Reports Server (NTRS)

Krainak, Michael; Merritt, Scott

2016-01-01

Integrated photonics generally is the integration of multiple lithographically defined photonic and electronic components and devices (e.g. lasers, detectors, waveguides passive structures, modulators, electronic control and optical interconnects) on a single platform with nanometer-scale feature sizes. The development of photonic integrated circuits permits size, weight, power and cost reductions for spacecraft microprocessors, optical communication, processor buses, advanced data processing, and integrated optic science instrument optical systems, subsystems and components. This is particularly critical for small spacecraft platforms. We will give an overview of some NASA applications for integrated photonics.

Optical RISC computer

NASA Astrophysics Data System (ADS)

Guilfoyle, Peter S.; Stone, Richard V.; Hessenbruch, John M.; Zeise, Frederick F.

1993-07-01

A second generation digital optical computer (DOC II) has been developed which utilizes a RISC based operating system as its host. This 32 bit, high performance (12.8 GByte/sec), computing platform demonstrates a number of basic principals that are inherent to parallel free space optical interconnects such as speed (up to 1012 bit operations per second) and low power 1.2 fJ per bit). Although DOC II is a general purpose machine, special purpose applications have been developed and are currently being evaluated on the optical platform.

Current developments in optical engineering and diffraction phenomena; Proceedings of the Meeting, San Diego, CA, Aug. 21, 22, 1986

NASA Astrophysics Data System (ADS)

Fischer, Robert E.; Smith, Warren J.; Harvey, James

1986-01-01

Papers dealing with current materials for gradient-index optics, an intelligent data-base system for optical designers; tilted mirror systems; a null-lens design approach for centrally obscured components; the use of the vector aberration theory to optimize an unobscured optical system; multizone bifocal contact lens design; and the concentric meniscus element are presented. Topics discussed include optical manufacturing in the Far East; the optical performance of molded-glass lenses for optical memory applications; through-wafer optical interconnects for multiwafer wafer-scale integrated architecture; optical thin-flim monitoring using optical fibers; aerooptical testing; optical inspection; and a system analysis program for a 32K microcomputer. Consideration is given to various theories, algorithms, and applications of diffraction, a vector formulation of a ray-equivalent method for Gaussian beam propagation; Fourier optical analysis of aberrations in focused laser beams; holography and moire interferometry; and phase-conjugate optical correctors for diffraction-limited applications.

Application of quantum-dot multi-wavelength lasers and silicon photonic ring resonators to data-center optical interconnects

NASA Astrophysics Data System (ADS)

Beckett, Douglas J. S.; Hickey, Ryan; Logan, Dylan F.; Knights, Andrew P.; Chen, Rong; Cao, Bin; Wheeldon, Jeffery F.

2018-02-01

Quantum dot comb sources integrated with silicon photonic ring-resonator filters and modulators enable the realization of optical sub-components and modules for both inter- and intra-data-center applications. Low-noise, multi-wavelength, single-chip, laser sources, PAM4 modulation and direct detection allow a practical, scalable, architecture for applications beyond 400 Gb/s. Multi-wavelength, single-chip light sources are essential for reducing power dissipation, space and cost, while silicon photonic ring resonators offer high-performance with space and power efficiency.

Spatial and Temporal Resolutions Pixel Level Performance Analysis of the Onboard Remote Sensing Electro-Optical Systems

NASA Astrophysics Data System (ADS)

El-Sheikh, H. M.; Yakushenkov, Y. G.

2014-08-01

Formulas for determination of the interconnection between the spatial resolution from perspective distortions and the temporal resolution of the onboard electro-optical system for remote sensing application for a variety of scene viewing modes is offered. These dependences can be compared with the user's requirements, upon the permission values of the design parameters of the modern main units of the electro-optical system is discussed.

Optical link by using optical wiring method for reducing EMI

NASA Astrophysics Data System (ADS)

Cho, In-Kui; Kwon, Jong-Hwa; Choi, Sung-Woong; Bondarik, Alexander; Yun, Je-Hoon; Kim, Chang-Joo; Ahn, Seung-Beom; Jeong, Myung-Yung; Park, Hyo Hoon

2008-12-01

A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx) for reducing EMI (electromagnetic interference). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy assembly. The key benefit of fiber optic link is the absence of electromagnetic interference (EMI) noise creation and susceptibility. This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the following steps: (i) forming a light source device, an optical detection device, and an optical transmission unit on a substrate (metal optical bench (MOB)); (ii) preparing a flexible optical transmission-connection medium (optical wiring link) to optically connect the light source device formed on the substrate with the optical detection device; and (iii) directly connecting one end of the surface-finished optical transmission connection medium with the light source device and the other end with the optical detection device. Electronic interconnections have uniquely electronic problems such as EMI, shorting, and ground loops. Since these problems only arise during transduction (electronics-to-optics or opticsto- electronics), the purely optical part and optical link(interconnection) is free of these problems. 1 An optical link system constructed with TRx modules was fabricated and the optical characteristics about data links and EMI levels were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust and cost-effective assembly for reducing EMI of inter-chip interconnect. We successfully achieved a 4.5 Gb/s data transmission rate without EMI problems.

Electro-Optic Computing Architectures. Volume I

DTIC Science & Technology

1998-02-01

The objective of the Electro - Optic Computing Architecture (EOCA) program was to develop multi-function electro - optic interfaces and optical...interconnect units to enhance the performance of parallel processor systems and form the building blocks for future electro - optic computing architectures...Specifically, three multi-function interface modules were targeted for development - an Electro - Optic Interface (EOI), an Optical Interconnection Unit (OW

PECVD based silicon oxynitride thin films for nano photonic on chip interconnects applications.

PubMed

Sharma, Satinder K; Barthwal, Sumit; Singh, Vikram; Kumar, Anuj; Dwivedi, Prabhat K; Prasad, B; Kumar, Dinesh

2013-01-01

Thin silicon oxynitride (SiO(x)N(y)) films were deposited by low temperature (~300°C) plasma enhanced chemical vapour deposition (PECVD), using SiH(4), N(2)O, NH(3) precursor of the flow rate 25, 100, 30 sccm and subjected to the post deposition annealing (PDA) treatment at 400°C and 600°C for nano optical/photonics on chip interconnects applications. AFM result reveals the variation of roughness from 60.9 Å to 23.4 Å after PDA treatment with respect to the as-deposited films, favourable surface topography for integrated waveguide applications. A model of decrease in island height with the effect of PDA treatment is proposed in support of AFM results. Raman spectroscopy and FTIR measurements are performed in order to define the change in crystallite and chemical bonding of as-deposited as well as PDA treated samples. These outcomes endorsed to the densification of SiO(x)N(y) thin films, due to decrease in Si-N and Si-O bonds strain, as well the O-H, N-H bonds with in oxynitride network. The increase in refractive index and PL intensity of as deposited SiO(x)N(y) thin films to the PDA treated films at 400°C and 600°C are observed. The significant shift of PL spectra peak positions indicate the change in cluster size as the result of PDA treatment, which influence the optical properties of thin films. It might be due to out diffusion of hydrogen containing species from silicon oxynitride films after PDA treatment. In this way, the structural and optical, feasibility of SiO(x)N(y) films are demonstrated in order to obtain high quality thin films for nano optical/photonics on chip interconnects applications. Copyright © 2012 Elsevier Ltd. All rights reserved.

Novel optical interconnect devices applying mask-transfer self-written method

NASA Astrophysics Data System (ADS)

Ishizawa, Nobuhiko; Matsuzawa, Yusuke; Tokiwa, Yu; Nakama, Kenichi; Mikami, Osamu

2012-01-01

The introduction of optical interconnect technology is expected to solve problems of conventional electric wiring. One of the promising technologies realizing optical interconnect is the self-written waveguide (SWW) technology with lightcurable resin. We have developed a new technology of the "Mask-Transfer Self-Written (MTSW)" method. This new method enables fabrication of arrayed M x N optical channels at one shot of UV-light. Using this technology, several new optical interconnect devices and connection technologies have been proposed and investigated. In this paper, first, we introduce MTSW method briefly. Next, we show plug-in alignment approach using optical waveguide plugs (OWP) and a micro-hole array (MHA) which are made of the light-curable resin. Easy and high efficiency plug-in alignment between fibers and an optoelectronic-printed wiring board (OE-PWB), between a fiber and a VCSEL, so on will be feasible. Then, we propose a new three-dimensional (3D) branch waveguide. By controlling the irradiating angle through the photomask aperture, it will be possible to fabricate 2-branch and 4-branch waveguides with a certain branch angle. The 3D branch waveguide will be very promising in the future optical interconnects and coupler devices of the multicore optical fiber.

Fiber bundle probes for interconnecting miniaturized medical imaging devices

NASA Astrophysics Data System (ADS)

Zamora, Vanessa; Hofmann, Jens; Marx, Sebastian; Herter, Jonas; Nguyen, Dennis; Arndt-Staufenbiel, Norbert; Schröder, Henning

2017-02-01

Miniaturization of medical imaging devices will significantly improve the workflow of physicians in hospitals. Photonic integrated circuit (PIC) technologies offer a high level of miniaturization. However, they need fiber optic interconnection solutions for their functional integration. As part of European funded project (InSPECT) we investigate fiber bundle probes (FBPs) to be used as multi-mode (MM) to single-mode (SM) interconnections for PIC modules. The FBP consists of a set of four or seven SM fibers hexagonally distributed and assembled into a holder that defines a multicore connection. Such a connection can be used to connect MM fibers, while each SM fiber is attached to the PIC module. The manufacturing of these probes is explored by using well-established fiber fusion, epoxy adhesive, innovative adhesive and polishing techniques in order to achieve reliable, low-cost and reproducible samples. An innovative hydrofluoric acid-free fiber etching technology has been recently investigated. The preliminary results show that the reduction of the fiber diameter shows a linear behavior as a function of etching time. Different etch rate values from 0.55 μm/min to 2.3 μm/min were found. Several FBPs with three different type of fibers have been optically interrogated at wavelengths of 630nm and 1550nm. Optical losses are found of approx. 35dB at 1550nm for FBPs composed by 80μm fibers. Although FBPs present moderate optical losses, they might be integrated using different optical fibers, covering a broad spectral range required for imaging applications. Finally, we show the use of FBPs as promising MM-to-SM interconnects for real-world interfacing to PIC's.

Demonstration of fully enabled data center subsystem with embedded optical interconnect

NASA Astrophysics Data System (ADS)

Pitwon, Richard; Worrall, Alex; Stevens, Paul; Miller, Allen; Wang, Kai; Schmidtke, Katharine

2014-03-01

The evolution of data storage communication protocols and corresponding in-system bandwidth densities is set to impose prohibitive cost and performance constraints on future data storage system designs, fuelling proposals for hybrid electronic and optical architectures in data centers. The migration of optical interconnect into the system enclosure itself can substantially mitigate the communications bottlenecks resulting from both the increase in data rate and internal interconnect link lengths. In order to assess the viability of embedding optical links within prevailing data storage architectures, we present the design and assembly of a fully operational data storage array platform, in which all internal high speed links have been implemented optically. This required the deployment of mid-board optical transceivers, an electro-optical midplane and proprietary pluggable optical connectors for storage devices. We present the design of a high density optical layout to accommodate the midplane interconnect requirements of a data storage enclosure with support for 24 Small Form Factor (SFF) solid state or rotating disk drives and the design of a proprietary optical connector and interface cards, enabling standard drives to be plugged into an electro-optical midplane. Crucially, we have also modified the platform to accommodate longer optical interconnect lengths up to 50 meters in order to investigate future datacenter architectures based on disaggregation of modular subsystems. The optically enabled data storage system has been fully validated for both 6 Gb/s and 12 Gb/s SAS data traffic conveyed along internal optical links.

Optically interconnected phased arrays

NASA Technical Reports Server (NTRS)

Bhasin, Kul B.; Kunath, Richard R.

1988-01-01

Phased-array antennas are required for many future NASA missions. They will provide agile electronic beam forming for communications and tracking in the range of 1 to 100 GHz. Such phased arrays are expected to use several hundred GaAs monolithic integrated circuits (MMICs) as transmitting and receiving elements. However, the interconnections of these elements by conventional coaxial cables and waveguides add weight, reduce flexibility, and increase electrical interference. Alternative interconnections based on optical fibers, optical processing, and holography are under evaluation as possible solutions. In this paper, the current status of these techniques is described. Since high-frequency optical components such as photodetectors, lasers, and modulators are key elements in these interconnections, their performance and limitations are discussed.

Design of micro-ring optical sensors and circuits for integration on optical printed circuit boards (O-PCBs)

NASA Astrophysics Data System (ADS)

Lee, El-Hang; Lee, Hyun S.; Lee, S. G.; O, B. H.; Park, S. G.; Kim, K. H.

2007-05-01

We report on the design of micro-ring resonator optical sensors for integration on what we call optical printed circuit boards (O-PCBs). The objective is to realize application-specific O-PCBs, either on hard board or on flexible board, by integrating micro/nano-scale optical sensors for compact, light-weight, low-energy, high-speed, intelligent, and environmentally friendly processing of information. The O-PCBs consist of two-dimensional planar arrays of micro/nano-scale optical wires, circuits and devices that are interconnected and integrated to perform the functions of sensing and then storing, transporting, processing, switching, routing and distributing optical signals that have been collected by means of sensors. For fabrication, the polymer and organic optical wires and waveguides are first fabricated on a board and are used to interconnect and integrate sensors and other micro/ nano-scale photonic devices. Here, in our study, we focus on the sensors based on the micro-ring structures. We designed bio-sensors using silicon based micro-ring resonator. We investigate the characteristics such as sensitivity and selectivity (or quality factor) of micro-ring resonator for their use in bio-sensing application. We performed simulation studies on the quality factor of micro-ring resonators by varying the radius of the ring resonators and the separation between adjacent waveguides. We introduce the effective coupling coefficient as a realistic value to describe the strength of the coupling in micro-ring resonators.

Multi-gigabit optical interconnects for next-generation on-board digital equipment

NASA Astrophysics Data System (ADS)

Venet, Norbert; Favaro, Henri; Sotom, Michel; Maignan, Michel; Berthon, Jacques

2017-11-01

Parallel optical interconnects are experimentally assessed as a technology that may offer the high-throughput data communication capabilities required to the next-generation on-board digital processing units. An optical backplane interconnect was breadboarded, on the basis of a digital transparent processor that provides flexible connectivity and variable bandwidth in telecom missions with multi-beam antenna coverage. The unit selected for the demonstration required that more than tens of Gbit/s be supported by the backplane. The demonstration made use of commercial parallel optical link modules at 850 nm wavelength, with 12 channels running at up to 2.5 Gbit/s. A flexible optical fibre circuit was developed so as to route board-to-board connections. It was plugged to the optical transmitter and receiver modules through 12-fibre MPO connectors. BER below 10-14 and optical link budgets in excess of 12 dB were measured, which would enable to integrate broadcasting. Integration of the optical backplane interconnect was successfully demonstrated by validating the overall digital processor functionality.

Multi-gigabit optical interconnects for next-generation on-board digital equipment

NASA Astrophysics Data System (ADS)

Venet, Norbert; Favaro, Henri; Sotom, Michel; Maignan, Michel; Berthon, Jacques

2004-06-01

Parallel optical interconnects are experimentally assessed as a technology that may offer the high-throughput data communication capabilities required to the next-generation on-board digital processing units. An optical backplane interconnect was breadboarded, on the basis of a digital transparent processor that provides flexible connectivity and variable bandwidth in telecom missions with multi-beam antenna coverage. The unit selected for the demonstration required that more than tens of Gbit/s be supported by the backplane. The demonstration made use of commercial parallel optical link modules at 850 nm wavelength, with 12 channels running at up to 2.5 Gbit/s. A flexible optical fibre circuit was developed so as to route board-to-board connections. It was plugged to the optical transmitter and receiver modules through 12-fibre MPO connectors. BER below 10-14 and optical link budgets in excess of 12 dB were measured, which would enable to integrate broadcasting. Integration of the optical backplane interconnect was successfully demonstrated by validating the overall digital processor functionality.

Optical interconnection using polyimide waveguide for multichip module

NASA Astrophysics Data System (ADS)

Koyanagi, Mitsumasa

1996-01-01

We have developed a parallel processor system with 152 RISC processor chips specific for Monte-Carlo analysis. This system has the ring-bus architecture. The performance of several Gflops is expected in this system according to the computer simulation. However, it was revealed that the data transfer speed of the bus has to be increased more dramatically in order to further increase the performance. Then, we propose to introduce the optical interconnection into the parallel processor system to increase the data transfer speed of the buses. The double ringbus architecture is employed in this new parallel processor system with optical interconnection. The free-space optical interconnection arid the optical waveguide are used for the optical ring-bus. Thin polyimide film was used to form the optical waveguide. A relatively low propagation loss was achieved in the polyimide optical waveguide. In addition, it was confirmed that the propagation direction of signal light can be easily changed by using a micro-mirror.

Optical interconnection using polyimide waveguide for multichip module

NASA Astrophysics Data System (ADS)

Koyanagi, Mitsumasa

1996-01-01

We have developed a parallel processor system with 152 RISC processor chips specific for Monte-Carlo analysis. This system has the ring-bus architecture. The performance of several Gflops is expected in this system according to the computer simulation. However, it was revealed that the data transfer speed of the bus has to be increased more dramatically in order to further increase the performance. Then, we propose to introduce the optical interconnection into the parallel processor system to increase the data transfer speed of the buses. The double ring-bus architecture is employed in this new parallel processor system with optical interconnection. The free-space optical interconnection and the optical waveguide are used for the optical ring-bus. Thin polyimide film was used to form the optical waveguide. A relatively low propagation loss was achieved in the polyimide optical waveguide. In addition, it was confirmed that the propagation direction of signal light can be easily changed by using a micro-mirror.

The potential benefits of photonics in the computing platform

NASA Astrophysics Data System (ADS)

Bautista, Jerry

2005-03-01

The increase in computational requirements for real-time image processing, complex computational fluid dynamics, very large scale data mining in the health industry/Internet, and predictive models for financial markets are driving computer architects to consider new paradigms that rely upon very high speed interconnects within and between computing elements. Further challenges result from reduced power requirements, reduced transmission latency, and greater interconnect density. Optical interconnects may solve many of these problems with the added benefit extended reach. In addition, photonic interconnects provide relative EMI immunity which is becoming an increasing issue with a greater dependence on wireless connectivity. However, to be truly functional, the optical interconnect mesh should be able to support arbitration, addressing, etc. completely in the optical domain with a BER that is more stringent than "traditional" communication requirements. Outlined are challenges in the advanced computing environment, some possible optical architectures and relevant platform technologies, as well roughly sizing these opportunities which are quite large relative to the more "traditional" optical markets.

High frequency GaAlAs modulator and photodetector for phased array antenna applications

NASA Technical Reports Server (NTRS)

Claspy, P. C.; Chorey, C. M.; Hill, S. M.; Bhasin, K. B.

1988-01-01

A waveguide Mach-Zehnder electro-optic modulator and an interdigitated photoconductive detector designed to operate at 820 nm, fabricated on different GaAlAs/GaAs heterostructure materials, are being investigated for use in optical interconnects in phased array antenna systems. Measured optical attenuation effects in the modulator are discussed and the observed modulation performance up to 1 GHz is presented. Measurements of detector frequency response are described and results presented.

Electro-Optic Computing Architectures: Volume II. Components and System Design and Analysis

DTIC Science & Technology

1998-02-01

The objective of the Electro - Optic Computing Architecture (EOCA) program was to develop multi-function electro - optic interfaces and optical...interconnect units to enhance the performance of parallel processor systems and form the building blocks for future electro - optic computing architectures...Specifically, three multi-function interface modules were targeted for development - an Electro - Optic Interface (EOI), an Optical Interconnection Unit

Planned development of a 3D computer based on free-space optical interconnects

NASA Astrophysics Data System (ADS)

Neff, John A.; Guarino, David R.

1994-05-01

Free-space optical interconnection has the potential to provide upwards of a million data channels between planes of electronic circuits. This may result in the planar board and backplane structures of today giving away to 3-D stacks of wafers or multi-chip modules interconnected via channels running perpendicular to the processor planes, thereby eliminating much of the packaging overhead. Three-dimensional packaging is very appealing for tightly coupled fine-grained parallel computing where the need for massive numbers of interconnections is severely taxing the capabilities of the planar structures. This paper describes a coordinated effort by four research organizations to demonstrate an operational fine-grained parallel computer that achieves global connectivity through the use of free space optical interconnects.

Optical data communication: fundamentals and future directions

NASA Astrophysics Data System (ADS)

DeCusatis, Casimer M.

1998-12-01

An overview of optical data communications is provided, beginning with a brief history and discussion of the unique requirements that distinguish this subfield from related areas such as telecommunications. Each of the major datacom standards is then discussed, including the physical layer specification, distances and data rates, fiber and connector types, data frame structures, and network considerations. These standards can be categorized by their prevailing applications, either storage [Enterprise System Connection, Fiber Channel Connection, and Fiber Channel], coupling (Fiber Channel), or networking [Fiber Distributed Data Interface, Gigabit Ethernet, and asynchronous transfer mode/synchronous optical network]. We also present some emerging technologies and their applications, including parallel optical interconnects, plastic optical fiber, wavelength multiplexing, and free- space optical links. We conclude with some cost/performance trade-offs and predictions of future bandwidth trends.

Three-dimensional crossbar interconnection using planar-integrated free-space optics and digital mirror-device

NASA Astrophysics Data System (ADS)

Lohmann, U.; Jahns, J.; Limmer, S.; Fey, D.

2011-01-01

We consider the implementation of a dynamic crossbar interconnect using planar-integrated free-space optics (PIFSO) and a digital mirror-device™ (DMD). Because of the 3D nature of free-space optics, this approach is able to solve geometrical problems with crossings of the signal paths that occur in waveguide optical and electrical interconnection, especially for large number of connections. The DMD device allows one to route the signals dynamically. Due to the large number of individual mirror elements in the DMD, different optical path configurations are possible, thus offering the chance for optimizing the network configuration. The optimization is achieved by using an evolutionary algorithm for finding best values for a skewless parallel interconnection. Here, we present results and experimental examples for the use of the PIFSO/DMD-setup.

Biwavelength transceiver module for parallel simultaneous bidirectional optical interconnections

NASA Astrophysics Data System (ADS)

Nguyen, Nga T. H.; Ukaegbu, Ikechi A.; Sangirov, Jamshid; Cho, Mu-Hee; Lee, Tae-Woo; Park, Hyo-Hoon

2013-12-01

The design of a biwavelength transceiver (TRx) module for parallel simultaneous bidirectional optical interconnects is described. The TRx module has been implemented using two different wavelengths, 850 and 1060 nm, to send and receive signals simultaneously through a common optical interface while optimizing cost and performance. Filtering mirrors are formed in the optical fibers which are embedded on a V-grooved silicon substrate for reflecting and filtering optical signals from/to vertical-cavity surface-emitting laser (VCSEL)/photodiode (PD). The VCSEL and PD are flip-chip bonded on individual silicon optical benches, which are attached on the silicon substrate for optical signal coupling from the VCSEL to fiber and from fiber to the PD. A high-speed and low-loss ceramic printed circuit board, which has a compact size of 0.033 cc, has been designed to carry transmitter and receiver chips for easy packaging of the TRx module. Applied for quad small form-factor pluggable applications at 40-Gbps operation, the four-channel biwavelength TRx module showed clear eye diagrams with a bit error rate (BER) of 10-12 at input powers of -5 and -5.8 dBm for 1060 and 850 nm operation modes, respectively.

Modulated error diffusion CGHs for neural nets

NASA Astrophysics Data System (ADS)

Vermeulen, Pieter J. E.; Casasent, David P.

1990-05-01

New modulated error diffusion CGHs (computer generated holograms) for optical computing are considered. Specific attention is given to their use in optical matrix-vector, associative processor, neural net and optical interconnection architectures. We consider lensless CGH systems (many CGHs use an external Fourier transform (FT) lens), the Fresnel sampling requirements, the effects of finite CGH apertures (sample and hold inputs), dot size correction (for laser recorders), and new applications for this novel encoding method (that devotes attention to quantization noise effects).

Innovative on board payload optical architecture for high throughput satellites

NASA Astrophysics Data System (ADS)

Baudet, D.; Braux, B.; Prieur, O.; Hughes, R.; Wilkinson, M.; Latunde-Dada, K.; Jahns, J.; Lohmann, U.; Fey, D.; Karafolas, N.

2017-11-01

For the next generation of HighThroughPut (HTP) Telecommunications Satellites, space end users' needs will result in higher link speeds and an increase in the number of channels; up to 512 channels running at 10Gbits/s. By keeping electrical interconnections based on copper, the constraints in term of power dissipation, number of electrical wires and signal integrity will become too demanding. The replacement of the electrical links by optical links is the most adapted solution as it provides high speed links with low power consumption and no EMC/EMI. But replacing all electrical links by optical links of an On Board Payload (OBP) is challenging. It is not simply a matter of replacing electrical components with optical but rather the whole concept and architecture have to be rethought to achieve a high reliability and high performance optical solution. In this context, this paper will present the concept of an Innovative OBP Optical Architecture. The optical architecture was defined to meet the critical requirements of the application: signal speed, number of channels, space reliability, power dissipation, optical signals crossing and components availability. The resulting architecture is challenging and the need for new developments is highlighted. But this innovative optically interconnected architecture will substantially outperform standard electrical ones.

3-D integrated heterogeneous intra-chip free-space optical interconnect.

PubMed

Ciftcioglu, Berkehan; Berman, Rebecca; Wang, Shang; Hu, Jianyun; Savidis, Ioannis; Jain, Manish; Moore, Duncan; Huang, Michael; Friedman, Eby G; Wicks, Gary; Wu, Hui

2012-02-13

This paper presents the first chip-scale demonstration of an intra-chip free-space optical interconnect (FSOI) we recently proposed. This interconnect system provides point-to-point free-space optical links between any two communication nodes, and hence constructs an all-to-all intra-chip communication fabric, which can be extended for inter-chip communications as well. Unlike electrical and other waveguide-based optical interconnects, FSOI exhibits low latency, high energy efficiency, and large bandwidth density, and hence can significantly improve the performance of future many-core chips. In this paper, we evaluate the performance of the proposed FSOI interconnect, and compare it to a waveguide-based optical interconnect with wavelength division multiplexing (WDM). It shows that the FSOI system can achieve significantly lower loss and higher energy efficiency than the WDM system, even with optimistic assumptions for the latter. A 1×1-cm2 chip prototype is fabricated on a germanium substrate with integrated photodetectors. Commercial 850-nm GaAs vertical-cavity-surface-emitting-lasers (VCSELs) and fabricated fused silica microlenses are 3-D integrated on top of the substrate. At 1.4-cm distance, the measured optical transmission loss is 5 dB, the crosstalk is less than -20 dB, and the electrical-to-electrical bandwidth is 3.3 GHz. The latter is mainly limited by the 5-GHz VCSEL.

Electro-optic techniques for VLSI interconnect

NASA Astrophysics Data System (ADS)

Neff, J. A.

1985-03-01

A major limitation to achieving significant speed increases in very large scale integration (VLSI) lies in the metallic interconnects. They are costly not only from the charge transport standpoint but also from capacitive loading effects. The Defense Advanced Research Projects Agency, in pursuit of the fifth generation supercomputer, is investigating alternatives to the VLSI metallic interconnects, especially the use of optical techniques to transport the information either inter or intrachip. As the on chip performance of VLSI continues to improve via the scale down of the logic elements, the problems associated with transferring data off and onto the chip become more severe. The use of optical carriers to transfer the information within the computer is very appealing from several viewpoints. Besides the potential for gigabit propagation rates, the conversion from electronics to optics conveniently provides a decoupling of the various circuits from one another. Significant gains will also be realized in reducing cross talk between the metallic routings, and the interconnects need no longer be constrained to the plane of a thin film on the VLSI chip. In addition, optics can offer an increased programming flexibility for restructuring the interconnect network.

Integration of carbon nanotubes in slot waveguides (Conference Presentation)

NASA Astrophysics Data System (ADS)

Durán-Valdeiglesias, Elena; Zhang, Weiwei; Hoang, Thi Hong Cam; Alonso-Ramos, Carlos; Serna, Samuel; Le Roux, Xavier; Cassan, Eric; Balestrieri, Matteo; Keita, Al-Saleh; Sarti, Francesco; Biccari, Francesco; Torrini, Ughetta; Vinattieri, Anna; Yang, Hongliu; Bezugly, Viktor; Cuniberti, Gianaurelio; Filoramo, Arianna; Gurioli, Massimo; Vivien, Laurent

2016-05-01

Demanding applications such as video streaming, social networking, or web search relay on a large network of data centres, interconnected through optical links. The ever-growing data rates and power consumption inside these data centres are pushing copper links close to their fundamental limits. Optical interconnects are being extensively studied with the purpose of solving these limitations. Among the different possible technology platforms, silicon photonics, due to its compatibility with the CMOS platform, has become one of the preferred solutions for the development of the future generation photonic interconnects. However, the on-chip integration of all photonic and optoelectronic building blocks (sources, modulators and detectors…) is very complex and is not cost-effective due to the various materials involved (Ge for detection, doped Si for modulators and III-V for lasing). Carbon nanotubes (CNTs) are nanomaterials of great interest in photonics thanks to their fundamental optical properties, including near-IR room-temperature foto- and electro- luminescence, Stark effect, Kerr effect and absorption. In consequence, CNTs have the ability to emit, modulate and detect light in the telecommunications wavelength range. Furthermore, they are being extensively developed for new nano-electronics applications. In this work, we propose to use CNTs as active material integrated into silicon photonics for the development of all optoelectronic devices. Here, we report on the development of new integration schemes to couple the light emission from CNTs into optical resonators implemented on the silicon-on-insulator and silicon-nitride-on-insulator platforms. A theoretical and experimental analysis of the light interaction of CNTs with micro-ring resonators based on strip and slot waveguides and slot photonic crystal heterostructure cavities were carried out.

Interconnection requirements in avionic systems

NASA Astrophysics Data System (ADS)

Vergnolle, Claude; Houssay, Bruno

1991-04-01

The future aircraft generation will have thousand smart electromagnetic sensors distributed allover. Each sensor is connected with fibers links to the main-frame computer in charge of the real time signal''s correlation. Such a computer must be compactly built and massively parallel: it needs the use of 3 D optical free-space interconnect between neighbouring boards and reconfigurable interconnects via holographic backplane. The optical interconnect facilities will be also used to build fault-tolerant computer through large redundancy.

Interconnection network architectures based on integrated orbital angular momentum emitters

NASA Astrophysics Data System (ADS)

Scaffardi, Mirco; Zhang, Ning; Malik, Muhammad Nouman; Lazzeri, Emma; Klitis, Charalambos; Lavery, Martin; Sorel, Marc; Bogoni, Antonella

2018-02-01

Novel architectures for two-layer interconnection networks based on concentric OAM emitters are presented. A scalability analysis is done in terms of devices characteristics, power budget and optical signal to noise ratio by exploiting experimentally measured parameters. The analysis shows that by exploiting optical amplifications, the proposed interconnection networks can support a number of ports higher than 100. The OAM crosstalk induced-penalty, evaluated through an experimental characterization, do not significantly affect the interconnection network performance.

Integrated optical maze

DOE Office of Scientific and Technical Information (OSTI.GOV)

Roos, E.V.; Hendrix, J.L.

1994-06-01

Improvements to Nuclear Weapons Surety through the development of new detonation control techniques incorporating electro-optic technology are reviewed and proposed in this report. The results of the Kansas City Division`s (KCD`s) literature and vendor search, potential system architecture synthesis, and device test results are the basis of this report. This study has revealed several potential reconfigureable optical interconnect architectures that meet Los Alamos National Laboratory`s preliminary performance specifications. Several planer and global architectures have the potential for meeting the Department of Energy`s applications. Preliminary conclusions on the proposed architectures are discussed. The planer approach of monolithic GaAs amplifier switch arraysmore » is the leading candidate because it meets most of the specifications now. LiNbO{sub 3} and LiTaO{sub 3} planer tree switch arrays are the second choice because they meet all the specifications except for laser power transmission. Although not atop choice, acousto-optical free space switch arrays have been considered and meet most of the specifications. Symmetric-Self Electro-Optic Effect Devices (S-SEED) free space switch arrays are being considered and have excellent potential for smart reconfigureable optical interconnects in the future.« less

Holographic implementation of a binary associative memory for improved recognition

NASA Astrophysics Data System (ADS)

Bandyopadhyay, Somnath; Ghosh, Ajay; Datta, Asit K.

1998-03-01

Neural network associate memory has found wide application sin pattern recognition techniques. We propose an associative memory model for binary character recognition. The interconnection strengths of the memory are binary valued. The concept of sparse coding is sued to enhance the storage efficiency of the model. The question of imposed preconditioning of pattern vectors, which is inherent in a sparsely coded conventional memory, is eliminated by using a multistep correlation technique an the ability of correct association is enhanced in a real-time application. A potential optoelectronic implementation of the proposed associative memory is also described. The learning and recall is possible by using digital optical matrix-vector multiplication, where full use of parallelism and connectivity of optics is made. A hologram is used in the experiment as a longer memory (LTM) for storing all input information. The short-term memory or the interconnection weight matrix required during the recall process is configured by retrieving the necessary information from the holographic LTM.

Digital optical interconnects for photonic computing

NASA Astrophysics Data System (ADS)

Guilfoyle, Peter S.; Stone, Richard V.; Zeise, Frederick F.

1994-05-01

A 32-bit digital optical computer (DOC II) has been implemented in hardware utilizing 8,192 free-space optical interconnects. The architecture exploits parallel interconnect technology by implementing microcode at the primitive level. A burst mode of 0.8192 X 1012 binary operations per sec has been reliably demonstrated. The prototype has been successful in demonstrating general purpose computation. In addition to emulating the RISC instruction set within the UNIX operating environment, relational database text search operations have been implemented on DOC II.

Graphene-MoS2 Heterojunctions for High-Speed Opto-electronics

NASA Astrophysics Data System (ADS)

Horng, Jason; Wang, Alex; Wang, Danqing; Li, Alexander Shengzhi; Wang, Feng

Heterostructures consisting of two-dimensional materials has drawn significant attention in different research fields owning to their novel electronic states and potential applications. Transmitting information with transition metal dichalcogenides(TMDC) electro-optical modulator switch interconnect is of great interest for technological applications. However, their high-speed applications have been slowed by their intrinsically high resistivity as well as the difficulties in making optimized metal contacts. Here, we present a new strategy by using graphene as a tunable contact to two-dimensional semiconductors to explore possible applications in high-speed opto-electronics. We will present an optical study to provide better understanding of band alignment in graphene/MoS2 heterostructures and a demonstration of high-speed opto-electronics based on these heterostructures. The result shows the new scheme could have potential in both opto-modulators and optical sensing applications.

Free-Space Optical Interconnect Employing VCSEL Diodes

NASA Technical Reports Server (NTRS)

Simons, Rainee N.; Savich, Gregory R.; Torres, Heidi

2009-01-01

Sensor signal processing is widely used on aircraft and spacecraft. The scheme employs multiple input/output nodes for data acquisition and CPU (central processing unit) nodes for data processing. To connect 110 nodes and CPU nodes, scalable interconnections such as backplanes are desired because the number of nodes depends on requirements of each mission. An optical backplane consisting of vertical-cavity surface-emitting lasers (VCSELs), VCSEL drivers, photodetectors, and transimpedance amplifiers is the preferred approach since it can handle several hundred megabits per second data throughput.The next generation of satellite-borne systems will require transceivers and processors that can handle several Gb/s of data. Optical interconnects have been praised for both their speed and functionality with hopes that light can relieve the electrical bottleneck predicted for the near future. Optoelectronic interconnects provide a factor of ten improvement over electrical interconnects.

Performance evaluation of multi-stratum resources integrated resilience for software defined inter-data center interconnect.

PubMed

Yang, Hui; Zhang, Jie; Zhao, Yongli; Ji, Yuefeng; Wu, Jialin; Lin, Yi; Han, Jianrui; Lee, Young

2015-05-18

Inter-data center interconnect with IP over elastic optical network (EON) is a promising scenario to meet the high burstiness and high-bandwidth requirements of data center services. In our previous work, we implemented multi-stratum resources integration among IP networks, optical networks and application stratums resources that allows to accommodate data center services. In view of this, this study extends to consider the service resilience in case of edge optical node failure. We propose a novel multi-stratum resources integrated resilience (MSRIR) architecture for the services in software defined inter-data center interconnect based on IP over EON. A global resources integrated resilience (GRIR) algorithm is introduced based on the proposed architecture. The MSRIR can enable cross stratum optimization and provide resilience using the multiple stratums resources, and enhance the data center service resilience responsiveness to the dynamic end-to-end service demands. The overall feasibility and efficiency of the proposed architecture is experimentally verified on the control plane of our OpenFlow-based enhanced SDN (eSDN) testbed. The performance of GRIR algorithm under heavy traffic load scenario is also quantitatively evaluated based on MSRIR architecture in terms of path blocking probability, resilience latency and resource utilization, compared with other resilience algorithms.

Embedded optical interconnect technology in data storage systems

NASA Astrophysics Data System (ADS)

Pitwon, Richard C. A.; Hopkins, Ken; Milward, Dave; Muggeridge, Malcolm

2010-05-01

As both data storage interconnect speeds increase and form factors in hard disk drive technologies continue to shrink, the density of printed channels on the storage array midplane goes up. The dominant interconnect protocol on storage array midplanes is expected to increase to 12 Gb/s by 2012 thereby exacerbating the performance bottleneck in future digital data storage systems. The design challenges inherent to modern data storage systems are discussed and an embedded optical infrastructure proposed to mitigate this bottleneck. The proposed solution is based on the deployment of an electro-optical printed circuit board and active interconnect technology. The connection architecture adopted would allow for electronic line cards with active optical edge connectors to be plugged into and unplugged from a passive electro-optical midplane with embedded polymeric waveguides. A demonstration platform has been developed to assess the viability of embedded electro-optical midplane technology in dense data storage systems and successfully demonstrated at 10.3 Gb/s. Active connectors incorporate optical transceiver interfaces operating at 850 nm and are connected in an in-plane coupling configuration to the embedded waveguides in the midplane. In addition a novel method of passively aligning and assembling passive optical devices to embedded polymer waveguide arrays has also been demonstrated.

Low-cost fabrication of optical waveguides, interconnects and sensing structures on all-polymer-based thin foils

NASA Astrophysics Data System (ADS)

Rezem, Maher; Kelb, Christian; Günther, Axel; Rahlves, Maik; Reithmeier, Eduard; Roth, Bernhard

2016-03-01

Micro-optical sensors based on optical waveguides are widely used to measure temperature, force and strain but also to detect biological and chemical substances such as explosives or toxins. While optical micro-sensors based on silicon technology require complex and expensive process technologies, a new generation of sensors based completely on polymers offer advantages especially in terms of low-cost and fast production techniques. We have developed a process to integrate micro-optical components such as embedded waveguides and optical interconnects into polymer foils with a thickness well below one millimeter. To enable high throughput production, we employ hot embossing technology, which is capable of reel-to-reel fabrication with a surface roughness in the optical range. For the waveguide fabrication, we used the thermoplastic polymethylmethacrylate (PMMA) as cladding and several optical adhesives as core materials. The waveguides are characterized with respect to refractive indices and propagation losses. We achieved propagation losses are as low as 0.3 dB/cm. Furthermore, we demonstrate coupling structures and their fabrication especially suited to integrate various light sources such as vertical-cavity surface-emitting lasers (VCSEL) and organic light emitting diodes (OLED) into thin polymer foils. Also, we present a concept of an all-polymer and waveguide based deformation sensor based on intensity modulation, which can be fabricated by utilizing our process. For future application, we aim at a low-cost and high-throughput reel-to-reel production process enabling the fabrication of large sensor arrays or disposable single-use sensing structures, which will open optical sensing to a large variety of application fields ranging from medical diagnosis to automotive sensing.

Optical computing and image processing using photorefractive gallium arsenide

NASA Technical Reports Server (NTRS)

Cheng, Li-Jen; Liu, Duncan T. H.

1990-01-01

Recent experimental results on matrix-vector multiplication and multiple four-wave mixing using GaAs are presented. Attention is given to a simple concept of using two overlapping holograms in GaAs to do two matrix-vector multiplication processes operating in parallel with a common input vector. This concept can be used to construct high-speed, high-capacity, reconfigurable interconnection and multiplexing modules, important for optical computing and neural-network applications.

High-performance flat data center network architecture based on scalable and flow-controlled optical switching system

NASA Astrophysics Data System (ADS)

Calabretta, Nicola; Miao, Wang; Dorren, Harm

2016-03-01

Traffic in data centers networks (DCNs) is steadily growing to support various applications and virtualization technologies. Multi-tenancy enabling efficient resource utilization is considered as a key requirement for the next generation DCs resulting from the growing demands for services and applications. Virtualization mechanisms and technologies can leverage statistical multiplexing and fast switch reconfiguration to further extend the DC efficiency and agility. We present a novel high performance flat DCN employing bufferless and distributed fast (sub-microsecond) optical switches with wavelength, space, and time switching operation. The fast optical switches can enhance the performance of the DCNs by providing large-capacity switching capability and efficiently sharing the data plane resources by exploiting statistical multiplexing. Benefiting from the Software-Defined Networking (SDN) control of the optical switches, virtual DCNs can be flexibly created and reconfigured by the DCN provider. Numerical and experimental investigations of the DCN based on the fast optical switches show the successful setup of virtual network slices for intra-data center interconnections. Experimental results to assess the DCN performance in terms of latency and packet loss show less than 10^-5 packet loss and 640ns end-to-end latency with 0.4 load and 16- packet size buffer. Numerical investigation on the performance of the systems when the port number of the optical switch is scaled to 32x32 system indicate that more than 1000 ToRs each with Terabit/s interface can be interconnected providing a Petabit/s capacity. The roadmap to photonic integration of large port optical switches will be also presented.

Optical interconnect for large-scale systems

NASA Astrophysics Data System (ADS)

Dress, William

2013-02-01

This paper presents a switchless, optical interconnect module that serves as a node in a network of identical distribution modules for large-scale systems. Thousands to millions of hosts or endpoints may be interconnected by a network of such modules, avoiding the need for multi-level switches. Several common network topologies are reviewed and their scaling properties assessed. The concept of message-flow routing is discussed in conjunction with the unique properties enabled by the optical distribution module where it is shown how top-down software control (global routing tables, spanning-tree algorithms) may be avoided.

Non-Electronic Radio Front-End (NERF)

DTIC Science & Technology

2007-04-01

electro - optic field sensor. The absence of metallic interconnects and the charge isolation provided by the optics removes the soft spots in a traditional receiver. In the proof-of concept experiment, detection of C band electromagnetic signals at 7.38 GHz with a sensitivity of 4.3x10 -3 V/m.Hz(exp 1/2) is demonstrated. The dielectric approach has an added benefit: it reduces physical size of the front end an important benefit in mobile applications. DIELECTRIC RESONATOR ANTENNA, PHOTONICALLY ISOLATED ANTENNA RECEIVER, ELECTRO - OPTIC DIELECTRIC ANTENNA,

Backplane photonic interconnect modules with optical jumpers

NASA Astrophysics Data System (ADS)

Glebov, Alexei L.; Lee, Michael G.; Yokouchi, Kishio

2005-03-01

Prototypes of optical interconnect (OI) modules for backplane applications are presented. The transceivers attached to the linecards E/O convert the signals that are passed to and from the backplane by optical jumpers terminated with MTP-type connectors. The connectors plug into adaptors attached to the backplane and the microlens arrays mounted in the adaptors couple the light between the fibers and waveguides. Planar polymer channel waveguides with 30-50 μm cross-sections route the optical signals across the board with propagation losses as low as 0.05 dB/cm @ 850 nm. The 45¦-tapered integrated micromirrors reflect the light in and out of the waveguide plane with the loss of 0.8 dB per mirror. The connector displacement measurements indicate that the adaptor lateral assembly accuracy can be at least +/-10 μm for the excess loss not exceeding 1 dB. Insertion losses of the test modules with integrated waveguides, 45¦ mirrors, and pluggable optical jumper connectors are about 5 dB. Eye diagrams at 10.7 Gb/s have typical width and height of 70 ps and 400 mV, respectively, and jitter of about 20 ps.

The high speed interconnect system architecture and operation

NASA Astrophysics Data System (ADS)

Anderson, Steven C.

The design and operation of a fiber-optic high-speed interconnect system (HSIS) being developed to meet the requirements of future avionics and flight-control hardware with distributed-system architectures are discussed. The HSIS is intended for 100-Mb/s operation of a local-area network with up to 256 stations. It comprises a bus transmission system (passive star couplers and linear media linked by active elements) and network interface units (NIUs). Each NIU is designed to perform the physical, data link, network, and transport functions defined by the ISO OSI Basic Reference Model (1982 and 1983) and incorporates a fiber-optic transceiver, a high-speed protocol based on the SAE AE-9B linear token-passing data bus (1986), and a specialized application interface unit. The operating modes and capabilities of HSIS are described in detail and illustrated with diagrams.

Fiber optic controls for aircraft engines - Issues and implications

NASA Technical Reports Server (NTRS)

Dasgupta, Samhita; Poppel, Gary L.; Anderson, William P.

1991-01-01

Some of the issues involved with the application of fiber-optic controls for aircraft engines in the harsh operating environment are addressed, with emphasis on fiber-optic temperature, pressure, position, and speed sensors. Criteria are established to evaluate the optical modulation technique, the sensor/control unit interconnection, and the electrooptic architecture. Single mode and polarization dependent sensor types, sensors which depend on the reflection and/or transmission of light through the engine environment, and intensity-based analog sensors are eliminated as a possible candidate for engine implementation. Fiber-optic harnesses tested for their optical integrity, temperature stability, and mechanical strength, exhibit a capacity to meet mechanical strength requirements and still gain a significant reduction in cable weight.

Trinary arithmetic and logic unit (TALU) using savart plate and spatial light modulator (SLM) suitable for optical computation in multivalued logic

NASA Astrophysics Data System (ADS)

Ghosh, Amal K.; Bhattacharya, Animesh; Raul, Moumita; Basuray, Amitabha

2012-07-01

Arithmetic logic unit (ALU) is the most important unit in any computing system. Optical computing is becoming popular day-by-day because of its ultrahigh processing speed and huge data handling capability. Obviously for the fast processing we need the optical TALU compatible with the multivalued logic. In this regard we are communicating the trinary arithmetic and logic unit (TALU) in modified trinary number (MTN) system, which is suitable for the optical computation and other applications in multivalued logic system. Here the savart plate and spatial light modulator (SLM) based optoelectronic circuits have been used to exploit the optical tree architecture (OTA) in optical interconnection network.

High-aggregate-capacity visible light communication links using stacked multimode polymer waveguides and micro-pixelated LED arrays

NASA Astrophysics Data System (ADS)

Bamiedakis, N.; McKendry, J. J. D.; Xie, E.; Gu, E.; Dawson, M. D.; Penty, R. V.; White, I. H.

2018-02-01

In recent years, light emitting diodes (LEDs) have gained renewed interest for use in visible light communication links (VLC) owing to their potential use as both high-quality power-efficient illumination sources as well as low-cost optical transmitters in free-space and guided-wave links. Applications that can benefit from their use include optical wireless systems (LiFi and Internet of Things), in-home and automotive networks, optical USBs and short-reach low-cost optical interconnects. However, VLC links suffer from the limited LED bandwidth (typically 100 MHz). As a result, a combination of novel LED devices, advanced modulation formats and multiplexing methods are employed to overcome this limitation and achieve high-speed (>1 Gb/s) data transmission over such links. In this work, we present recent advances in the formation of high-aggregate-capacity low cost guided wave VLC links using stacked polymer multimode waveguides and matching micro-pixelated LED (μLED) arrays. μLEDs have been shown to exhibit larger bandwidths (>200 MHz) than conventional broad-area LEDs and can be formed in large array configurations, while multimode polymer waveguides enable the formation of low-cost optical links onto standard PCBs. Here, three- and four-layered stacks of multimode waveguides, as well as matching GaN μLED arrays, are fabricated in order to generate high-density yet low-cost optical interconnects. Different waveguide topologies are implemented and are investigated in terms of loss and crosstalk performance. The initial results presented herein demonstrate good intrinsic crosstalk performance and indicate the potential to achieve >= 0.5 Tb/s/mm2 aggregate interconnection capacity using this low-cost technology.

Design, fabrication, and characterization of high density silicon photonic components

NASA Astrophysics Data System (ADS)

Jones, Adam Michael

Our burgeoning appetite for data relentlessly demands exponential scaling of computing and communications resources leading to an overbearing and ever-present drive to improve eciency while reducing on-chip area even as photonic components expand to ll application spaces no longer satised by their electronic counterparts. With a high index contrast, low optical loss, and compatibility with the CMOS fabrication infrastructure, silicon-on-insulator technology delivers a mechanism by which ecient, sub-micron waveguides can be fabricated while enabling monolithic integration of photonic components and their associated electronic infrastructure. The result is a solution leveraging the superior bandwidth of optical signaling on a platform capable of delivering the optical analogue to Moore's Law scaling of transistor density. Device size is expected to end Moore's Law scaling in photonics as Maxwell's equations limit the extent to which this parameter may be reduced. The focus of the work presented here surrounds photonic device miniaturization and the development of 3D optical interconnects as approaches to optimize performance in densely integrated optical interconnects. In this dissertation, several technological barriers inhibiting widespread adoption of photonics in data communications and telecommunications are explored. First, examination of loss and crosstalk performance in silicon nitride over SOI waveguide crossings yields insight into the feasibility of 3D optical interconnects with the rst experimental analysis of such a structure presented herein. A novel measurement platform utilizing a modied racetrack resonator is then presented enabling extraction of insertion loss data for highly ecient structures while requiring minimal on-chip area. Finally, pioneering work in understanding the statistical nature of doublet formation in microphotonic resonators is delivered with the resulting impact on resonant device design detailed.

Design Fabrication and Characterization of High Density Silicon Photonic Components

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jones, Adam

2015-02-01

Our burgeoning appetite for data relentlessly demands exponential scaling of computing and communications resources leading to an overbearing and ever-present drive to improve e ciency while reducing on-chip area even as photonic components expand to ll application spaces no longer satis ed by their electronic counterparts. With a high index contrast, low optical loss, and compatibility with the CMOS fabrication infrastructure, silicon-on-insulator technology delivers a mechanism by which e cient, sub-micron waveguides can be fabricated while enabling monolithic integration of photonic components and their associated electronic infrastructure. The result is a solution leveraging the superior bandwidth of optical signaling onmore » a platform capable of delivering the optical analogue to Moore's Law scaling of transistor density. Device size is expected to end Moore's Law scaling in photonics as Maxwell's equations limit the extent to which this parameter may be reduced. The focus of the work presented here surrounds photonic device miniaturization and the development of 3D optical interconnects as approaches to optimize performance in densely integrated optical interconnects. In this dissertation, several technological barriers inhibiting widespread adoption of photonics in data communications and telecommunications are explored. First, examination of loss and crosstalk performance in silicon nitride over SOI waveguide crossings yields insight into the feasibility of 3D optical interconnects with the rst experimental analysis of such a structure presented herein. A novel measurement platform utilizing a modi ed racetrack resonator is then presented enabling extraction of insertion loss data for highly e cient structures while requiring minimal on-chip area. Finally, pioneering work in understanding the statistical nature of doublet formation in microphotonic resonators is delivered with the resulting impact on resonant device design detailed.« less

Chip-to-chip interconnects based on 3D stacking of optoelectrical dies on Si

NASA Astrophysics Data System (ADS)

Duan, P.; Raz, O.; Smalbrugge, B. E.; Duis, J.; Dorren, H. J. S.

2012-01-01

We demonstrate a new approach to increase the optical interconnection bandwidth density by stacking the opto-electrical dies directly on the CMOS driver. The suggested implementation is aiming to provide a wafer scale process which will make the use of wire bonding redundant and will allow for impedance matched metallic wiring between the electronic driving circuit and its opto-electronic counter part. We suggest the use of a thick photoresist ramp between CMOS driver and opto-electrical dies surface as the bridge for supporting co-plannar waveguides (CPW) electrically plated with lithographic accuracy. In this way all three dimensions of the interconnecting metal layer, width, length and thickness can be completely controlled. In this 1st demonstration all processing is done on commercially available devices and products, and is compatible with CMOS processing technology. To test the applicability of CPW instead of wire bonds for interconnecting the CMOS circuit and opto-electronic chips, we have made test samples and tested their performance at speeds up to 10 Gbps. In this demonstration, a silicon substrate was used on which we evaporated gold co-planar waveguides (CPW) to mimic a wire on the driver. An optical link consisting of a VCSEL chip and a photodiode chip has been assembled and fully characterized using optical coupling into and out of a multimode fiber (MMF). A 10 Gb/s 27-1 NRZ PRBS signal transmitted from one chip to another chip was detected error free. A 4 dB receiver sensitivity penalty is measured for the integrated device compared to a commercial link.

CWDM for very-short-reach and optical-backplane interconnections

NASA Astrophysics Data System (ADS)

Laha, Michael J.

2002-06-01

Course Wavelength Division Multiplexing (CWDM) provides access to next generation optical interconnect data rates by utilizing conventional electro-optical components that are widely available in the market today. This is achieved through the use of CWDM multiplexers and demultiplexers that integrate commodity type active components, lasers and photodiodes, into small optical subassemblies. In contrast to dense wavelength division multiplexing (DWDM), in which multiple serial data streams are combined to create aggregate data pipes perhaps 100s of gigabits wide, CWDM uses multiple laser sources contained in one module to create a serial equivalent data stream. For example, four 2.5 Gb/s lasers are multiplexed to create a 10 Gb/s data pipe. The advantages of CWDM over traditional serial optical interconnects include lower module power consumption, smaller packaging, and a superior electrical interface. This discussion will detail the concept of CWDM and design parameters that are considered when productizing a CWDM module into an industry standard optical interconnect. Additionally, a scalable parallel CWDM hybrid architecture will be described that allows the transport of large amounts of data from rack to rack in an economical fashion. This particular solution is targeted at solving optical backplane bottleneck problems predicted for the next generation terabit and petabit routers.

High-bandwidth and low-loss multimode polymer waveguides and waveguide components for high-speed board-level optical interconnects

NASA Astrophysics Data System (ADS)

Bamiedakis, N.; Chen, J.; Penty, R. V.; White, I. H.

2016-03-01

Multimode polymer waveguides are being increasingly considered for use in short-reach board-level optical interconnects as they exhibit favourable optical properties and allow direct integration onto standard PCBs with conventional methods of the electronics industry. Siloxane-based multimode waveguides have been demonstrated with excellent optical transmission performance, while a wide range of passive waveguide components that offer routing flexibility and enable the implementation of complex on-board interconnection architectures has been reported. In recent work, we have demonstrated that these polymer waveguides can exhibit very high bandwidth-length products in excess of 30 GHz×m despite their highly-multimoded nature, while it has been shown that even larger values of > 60 GHz×m can be achieved by adjusting their refractive index profile. Furthermore, the combination of refractive index engineering and launch conditioning schemes can ensure high bandwidth (> 100 GHz×m) and high coupling efficiency (<1 dB) with standard multimode fibre inputs with relatively large alignment tolerances (~17×15 μm2). In the work presented here, we investigate the effects of refractive index engineering on the performance of passive waveguide components (crossings, bends) and provide suitable design rules for their on-board use. It is shown that, depending on the interconnection layout and link requirements, appropriate choice of refractive index profile can provide enhanced component performance, ensuring low loss interconnection and adequate link bandwidth. The results highlight the strong potential of this versatile optical technology for the formation of high-performance board-level optical interconnects with high routing flexibility.

Optical interconnect technologies for high-bandwidth ICT systems

NASA Astrophysics Data System (ADS)

Chujo, Norio; Takai, Toshiaki; Mizushima, Akiko; Arimoto, Hideo; Matsuoka, Yasunobu; Yamashita, Hiroki; Matsushima, Naoki

2016-03-01

The bandwidth of information and communication technology (ICT) systems is increasing and is predicted to reach more than 10 Tb/s. However, an electrical interconnect cannot achieve such bandwidth because of its density limits. To solve this problem, we propose two types of high-density optical fiber wiring for backplanes and circuit boards such as interface boards and switch boards. One type uses routed ribbon fiber in a circuit board because it has the ability to be formed into complex shapes to avoid interfering with the LSI and electrical components on the board. The backplane is required to exhibit high density and flexibility, so the second type uses loose fiber. We developed a 9.6-Tb/s optical interconnect demonstration system using embedded optical modules, optical backplane, and optical connector in a network apparatus chassis. We achieved 25-Gb/s transmission between FPGAs via the optical backplane.

Multiscale free-space optical interconnects for intrachip global communication: motivation, analysis, and experimental validation.

PubMed

McFadden, Michael J; Iqbal, Muzammil; Dillon, Thomas; Nair, Rohit; Gu, Tian; Prather, Dennis W; Haney, Michael W

2006-09-01

The use of optical interconnects for communication between points on a microchip is motivated by system-level interconnect modeling showing the saturation of metal wire capacity at the global layer. Free-space optical solutions are analyzed for intrachip communication at the global layer. A multiscale solution comprising microlenses, etched compound slope microprisms, and a curved mirror is shown to outperform a single-scale alternative. Microprisms are designed and fabricated and inserted into an optical setup apparatus to experimentally validate the concept. The multiscale free-space system is shown to have the potential to provide the bandwidth density and configuration flexibility required for global communication in future generations of microchips.

A fully-integrated 12.5-Gb/s 850-nm CMOS optical receiver based on a spatially-modulated avalanche photodetector.

PubMed

Lee, Myung-Jae; Youn, Jin-Sung; Park, Kang-Yeob; Choi, Woo-Young

2014-02-10

We present a fully integrated 12.5-Gb/s optical receiver fabricated with standard 0.13-µm complementary metal-oxide-semiconductor (CMOS) technology for 850-nm optical interconnect applications. Our integrated optical receiver includes a newly proposed CMOS-compatible spatially-modulated avalanche photodetector, which provides larger photodetection bandwidth than previously reported CMOS-compatible photodetectors. The receiver also has high-speed CMOS circuits including transimpedance amplifier, DC-balanced buffer, equalizer, and limiting amplifier. With the fabricated optical receiver, detection of 12.5-Gb/s optical data is successfully achieved at 5.8 pJ/bit. Our receiver achieves the highest data rate ever reported for 850-nm integrated CMOS optical receivers.

PICSiP: new system-in-package technology using a high bandwidth photonic interconnection layer for converged microsystems

NASA Astrophysics Data System (ADS)

Tekin, Tolga; Töpper, Michael; Reichl, Herbert

2009-05-01

Technological frontiers between semiconductor technology, packaging, and system design are disappearing. Scaling down geometries [1] alone does not provide improvement of performance, less power, smaller size, and lower cost. It will require "More than Moore" [2] through the tighter integration of system level components at the package level. System-in-Package (SiP) will deliver the efficient use of three dimensions (3D) through innovation in packaging and interconnect technology. A key bottleneck to the implementation of high-performance microelectronic systems, including SiP, is the lack of lowlatency, high-bandwidth, and high density off-chip interconnects. Some of the challenges in achieving high-bandwidth chip-to-chip communication using electrical interconnects include the high losses in the substrate dielectric, reflections and impedance discontinuities, and susceptibility to crosstalk [3]. Obviously, the incentive for the use of photonics to overcome the challenges and leverage low-latency and highbandwidth communication will enable the vision of optical computing within next generation architectures. Supercomputers of today offer sustained performance of more than petaflops, which can be increased by utilizing optical interconnects. Next generation computing architectures are needed with ultra low power consumption; ultra high performance with novel interconnection technologies. In this paper we will discuss a CMOS compatible underlying technology to enable next generation optical computing architectures. By introducing a new optical layer within the 3D SiP, the development of converged microsystems, deployment for next generation optical computing architecture will be leveraged.

Scalability analysis methodology for passive optical interconnects in data center networks using PAM

NASA Astrophysics Data System (ADS)

Lin, R.; Szczerba, Krzysztof; Agrell, Erik; Wosinska, Lena; Tang, M.; Liu, D.; Chen, J.

2017-11-01

A framework is developed for modeling the fundamental impairments in optical datacenter interconnects, i.e., the power loss and the receiver noises. This framework makes it possible, to analyze the trade-offs between data rates, modulation order, and number of ports that can be supported in optical interconnect architectures, while guaranteeing that the required signal-to-noise ratios are satisfied. To the best of our knowledge, this important assessment methodology is not yet available. As a case study, the trade-offs are investigated for three coupler-based top-of-rack interconnect architectures, which suffer from serious insertion loss. The results show that using single-port transceivers with 10 GHz bandwidth, avalanche photodiode detectors, and quadratical pulse amplitude modulation, more than 500 ports can be supported.

Local interconnection neural networks

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zhang Jiajun; Zhang Li; Yan Dapen

1993-06-01

The idea of a local interconnection neural network (LINN) is presentd and compared with the globally interconnected Hopfield model. Under the storage limit requirement, LINN is shown to offer the same associative memory capability as the global interconnection neural network while having a much smaller interconnection matrix. LINN can be readily implemented optically using the currently available spatial light modulators. 15 refs.

A low-cost, manufacturable method for fabricating capillary and optical fiber interconnects for microfluidic devices.

PubMed

Hartmann, Daniel M; Nevill, J Tanner; Pettigrew, Kenneth I; Votaw, Gregory; Kung, Pang-Jen; Crenshaw, Hugh C

2008-04-01

Microfluidic chips require connections to larger macroscopic components, such as light sources, light detectors, and reagent reservoirs. In this article, we present novel methods for integrating capillaries, optical fibers, and wires with the channels of microfluidic chips. The method consists of forming planar interconnect channels in microfluidic chips and inserting capillaries, optical fibers, or wires into these channels. UV light is manually directed onto the ends of the interconnects using a microscope. UV-curable glue is then allowed to wick to the end of the capillaries, fibers, or wires, where it is cured to form rigid, liquid-tight connections. In a variant of this technique, used with light-guiding capillaries and optical fibers, the UV light is directed into the capillaries or fibers, and the UV-glue is cured by the cone of light emerging from the end of each capillary or fiber. This technique is fully self-aligned, greatly improves both the quality and the manufacturability of the interconnects, and has the potential to enable the fabrication of interconnects in a fully automated fashion. Using these methods, including a semi-automated implementation of the second technique, over 10,000 interconnects have been formed in almost 2000 microfluidic chips made of a variety of rigid materials. The resulting interconnects withstand pressures up to at least 800psi, have unswept volumes estimated to be less than 10 femtoliters, and have dead volumes defined only by the length of the capillary.

Design and fabrication of a foldable 3D silicon based package for solid state lighting applications

NASA Astrophysics Data System (ADS)

Sokolovskij, R.; Liu, P.; van Zeijl, H. W.; Mimoun, B.; Zhang, G. Q.

2015-05-01

Miniaturization of solid state lighting (SSL) luminaires as well as reduction of packaging and assembly costs are of prime interest for the SSL lighting industry. A novel silicon based LED package for lighting applications is presented in this paper. The proposed design consists of 5 rigid Si tiles connected by flexible polyimide hinges with embedded interconnects (ICs). Electrical, optical and thermal characteristics were taken into consideration during design. The fabrication process involved polyimide (PI) application and patterning, aluminium interconnect integration in the flexible hinge, LED reflector cavity formation and metalization followed by through wafer DRIE etching for chip formation and release. A method to connect chip front to backside without TSVs was also integrated into the process. Post-fabrication wafer level assembly included LED mounting and wirebond, phosphor-based colour conversion and silicone encapsulation. The package formation was finalized by vacuum assisted wrapping around an assembly structure to form a 3D geometry, which is beneficial for omnidirectional lighting. Bending tests were performed on the flexible ICs and optical performance at different temperatures was evaluated. It is suggested that 3D packages can be expanded to platforms for miniaturized luminaire applications by combining monolithic silicon integration and system-in-package (SiP) technologies.

WDM Nanoscale Laser Diodes for Si Photonic Interconnects

DTIC Science & Technology

2016-07-25

mounting on silicon. The nanoscale VCSELs can achieve small optical modes and present a compact laser diode that is also robust. In this work we have used...Distribution Unlimited UU UU UU UU 25-07-2016 1-Feb-2012 31-Dec-2015 Final Report: WDM Nanoscale Laser Diodes for Si Photonic Interconnects The views...P.O. Box 12211 Research Triangle Park, NC 27709-2211 VCSEL, optical interconnect, laser diode , semiconductor laser, microcavity REPORT DOCUMENTATION

Experimental demonstration of free-space based 120 Gb/s reconfigurable card-to-card optical interconnects.

PubMed

Wang, Ke; Nirmalathas, Ampalavanapillai; Lim, Christina; Skafidas, Efstratios; Alameh, Kamal

2014-10-01

In this Letter, we propose and experimentally demonstrate a free-space based reconfigurable card-to-card optical interconnect architecture with 16-carrierless-amplitude-phase modulation. Experimental results show that up to 120 Gb/s (3×40  Gb/s) flexible interconnection can be achieved for up to 30 cm distance with a worst-case receiver sensitivity of -9.70  dBm.

A 4-channel coil array interconnection by analog direct modulation optical link for 1.5-T MRI.

PubMed

Yuan, Jing; Wei, Juan; Shen, Gary X

2008-10-01

Optical glass fiber shows great advantages over coaxial cables in terms of electromagnetic interference, thus, it should be considered a potential alternative for magnetic resonance imaging (MRI) receive coil interconnection, especially for a large number coil array at high field. In this paper, we propose a 4-channel analog direct modulation optical link for a 1.5-T MRI coil array interconnection. First, a general direct modulated optical link is compared to an external modulated optical link. And then the link performances of the proposed direct modulated optical link, including power gain, frequency response, and dynamic range, are analyzed and measured. Phantom and in vivo head images obtained using this optical link are demonstrated for comparison with those obtained by cable connections. The signal-to-noise (SNR) analysis shows that the optical link achieves 6%-8% SNR a improvement over coaxial cables by elimination of electrical interference between cables during MR signal transmission.

Board-to-Board Free-Space Optical Interconnections Passing through Boards for a Bookshelf-Assembled Terabit-Per-Second-Class ATM Switch.

PubMed

Hirabayashi, K; Yamamoto, T; Matsuo, S; Hino, S

1998-05-10

We propose free-space optical interconnections for a bookshelf-assembled terabit-per-second-class ATM switch. Thousands of arrayed optical beams, each having a rate of a few gigabits per second, propagate vertically to printed circuit boards, passing through some boards, and are connected to arbitrary transmitters and receivers on boards by polarization controllers and prism arrays. We describe a preliminary experiment using a 1-mm-pitch 2 x 2 beam-collimator array that uses vertical-cavity surface-emitting laser diodes. These optical interconnections can be made quite stable in terms of mechanical shock and temperature fluctuation by the attachment of reinforcing frames to the boards and use of an autoalignment system.

Thick-film materials for silicon photovoltaic cell manufacture

NASA Technical Reports Server (NTRS)

Field, M. B.

1977-01-01

Thick film technology is applicable to three areas of silicon solar cell fabrication; metallization, junction formation, and coating for protection of screened ohmic contacts, particularly wrap around contacts, interconnection and environmental protection. Both material and process parameters were investigated. Printed ohmic contacts on n- and p-type silicon are very sensitive to the processing parameters of firing time, temperature, and atmosphere. Wrap around contacts are easily achieved by first printing and firing a dielectric over the edge and subsequently applying a low firing temperature conductor. Interconnection of cells into arrays can be achieved by printing and cofiring thick film metal pastes, soldering, or with heat curing conductive epoxies on low cost substrates. Printed (thick) film vitreous protection coatings do not yet offer sufficient optical uniformity and transparency for use on silicon. A sprayed, heat curable SiO2 based resin shows promise of providing both optical matching and environmental protection.

Evaluation of hybrid polymers for high-precision manufacturing of 3D optical interconnects by two-photon absorption lithography

NASA Astrophysics Data System (ADS)

Schleunitz, A.; Klein, J. J.; Krupp, A.; Stender, B.; Houbertz, R.; Gruetzner, G.

2017-02-01

The fabrication of optical interconnects has been widely investigated for the generation of optical circuit boards. Twophoton absorption (TPA) lithography (or high-precision 3D printing) as an innovative production method for direct manufacture of individual 3D photonic structures gains more and more attention when optical polymers are employed. In this regard, we have evaluated novel ORMOCER-based hybrid polymers tailored for the manufacture of optical waveguides by means of high-precision 3D printing. In order to facilitate future industrial implementation, the processability was evaluated and the optical performance of embedded waveguides was assessed. The results illustrate that hybrid polymers are not only viable consumables for industrial manufacture of polymeric micro-optics using generic processes such as UV molding. They also are potential candidates to fabricate optical waveguide systems down to the chip level where TPA-based emerging manufacturing techniques are engaged. Hence, it is shown that hybrid polymers continue to meet the increasing expectations of dynamically growing markets of micro-optics and optical interconnects due to the flexibility of the employed polymer material concept.

WDM mid-board optics for chip-to-chip wavelength routing interconnects in the H2020 ICT-STREAMS

NASA Astrophysics Data System (ADS)

Kanellos, G. T.; Pleros, N.

2017-02-01

Multi-socket server boards have emerged to increase the processing power density on the board level and further flatten the data center networks beyond leaf-spine architectures. Scaling however the number of processors per board puts current electronic technologies into challenge, as it requires high bandwidth interconnects and high throughput switches with increased number of ports that are currently unavailable. On-board optical interconnection has proved the potential to efficiently satisfy the bandwidth needs, but their use has been limited to parallel links without performing any smart routing functionality. With CWDM optical interconnects already a commodity, cyclical wavelength routing proposed to fit the datacom for rack-to-rack and board-to-board communication now becomes a promising on-board routing platform. ICT-STREAMS is a European research project that aims to combine WDM parallel on-board transceivers with a cyclical AWGR, in order to create a new board-level, chip-to-chip interconnection paradigm that will leverage WDM parallel transmission to a powerful wavelength routing platform capable to interconnect multiple processors with unprecedented bandwidth and throughput capacity. Direct, any-to-any, on-board interconnection of multiple processors will significantly contribute to further flatten the data centers and facilitate east-west communication. In the present communication, we present ICT-STREAMS on-board wavelength routing architecture for multiple chip-to-chip interconnections and evaluate the overall system performance in terms of throughput and latency for several schemes and traffic profiles. We also review recent advances of the ICT-STREAMS platform key-enabling technologies that span from Si in-plane lasers and polymer based electro-optical circuit boards to silicon photonics transceivers and photonic-crystal amplifiers.

Non-hermetic fiber optic transceivers for space applications

NASA Astrophysics Data System (ADS)

Tabbert, Chuck

2017-11-01

There is a commercial trend in high data-rate systems to place optical components in close proximity to the data source/sink. This trend forgoes the traditional module packaging approach to create compact components that are embedded near or within the package of high-performance ASICs. This approach reduces the power consumption and electro-magnetic interference (EMI) effects by reducing the length of copper interconnect signal paths. We present an overview of commercial trends and methods for fielding this technology within spacecraft.

Reconfigurable optical interconnection network for multimode optical fiber sensor arrays

NASA Technical Reports Server (NTRS)

Chen, R. T.; Robinson, D.; Lu, H.; Wang, M. R.; Jannson, T.; Baumbick, R.

1992-01-01

A single-source, single-detector architecture has been developed to implement a reconfigurable optical interconnection network multimode optical fiber sensor arrays. The network was realized by integrating LiNbO3 electrooptic (EO) gratings working at the Raman Na regime and a massive fan-out waveguide hologram (WH) working at the Bragg regime onto a multimode glass waveguide. The glass waveguide utilized the whole substrate as a guiding medium. A 1-to-59 massive waveguide fan-out was demonstrated using a WH operating at 514 nm. Measured diffraction efficiency of 59 percent was experimentally confirmed. Reconfigurability of the interconnection was carried out by generating an EO grating through an externally applied electric field. Unlike conventional single-mode integrated optical devices, the guided mode demonstrated has an azimuthal symmetry in mode profile which is the same as that of a fiber mode.

Semiconductor laser joint study program with Rome Laboratory

NASA Astrophysics Data System (ADS)

Schaff, William J.; Okeefe, Sean S.; Eastman, Lester F.

1994-09-01

A program to jointly study vertical-cavity surface emitting lasers (VCSEL) for high speed vertical optical interconnects (VOI) has been conducted under an ES&E between Rome Laboratory and Cornell University. Lasers were designed, grown, and fabricated at Cornell University. A VCSEL measurement laboratory has been designed, built, and utilized at Rome Laboratory. High quality VCSEL material was grown and characterized by fabricating conventional lateral cavity lasers that emitted at the design wavelength of 1.04 microns. The VCSEL's emit at 1.06 microns. Threshold currents of 16 mA at 4.8 volts were obtained for 30 microns diameter devices. Output powers of 5 mW were measured. This is 500 times higher power than from the light emitting diodes employed previously for vertical optical interconnects. A new form of compositional grading using a cosinusoidal function has been developed and is very successful for reducing diode series resistance for high speed interconnection applications. A flip-chip diamond package compatible with high speed operation of 16 VCSEL elements has been designed and characterized. A flip-chip device binding effort at Rome Laboratory was also designed and initiated. This report presents details of the one-year effort, including process recipes and results.

Micro-electro-optical devices in a five-level polysilicon surface-micromachining technology

NASA Astrophysics Data System (ADS)

Smith, James H.; Rodgers, M. Steven; Sniegowski, Jeffry J.; Miller, Samuel L.; Hetherington, Dale L.; McWhorter, Paul J.; Warren, Mial E.

1998-09-01

We recently reported on the development of a 5-level polysilicon surface micromachine fabrication process consisting of four levels of mechanical poly plus an electrical interconnect layer and its application to complex mechanical systems. This paper describes the application of this technology to create micro-optical systems-on-a-chip. These are demonstration systems, which show that give levels of polysilicon provide greater performance, reliability, and significantly increased functionality. This new technology makes it possible to realize levels of system complexity that have so far only existed on paper, while simultaneously adding to the robustness of many of the individual subassemblies.

Tailoring the Optical Properties of Silicon with Ion Beam Created Nanostructures for Advanced Photonics Applications

NASA Astrophysics Data System (ADS)

Akhter, Perveen

In today's fast life, energy consumption has increased more than ever and with that the demand for a renewable and cleaner energy source as a substitute for the fossil fuels has also increased. Solar radiations are the ultimate source of energy but harvesting this energy in a cost effective way is a challenging task. Si is the dominating material for microelectronics and photovoltaics. But owing to its indirect band gap, Si is an inefficient light absorber, thus requiring a thickness of solar cells beyond tens of microns which increases the cost of solar energy. Therefore, techniques to increase light absorption in thin film Si solar cells are of great importance and have been the focus of research for a few decades now. Another big issue of technology in this fast-paced world is the computing rate or data transfer rate between components of a chip in ultra-fast processors. Existing electronic interconnects suffering from the signal delays and heat generation issues are unable to handle high data rates. A possible solution to this problem is in replacing the electronic interconnects with optical interconnects which have large data carrying capacity. However, optical components are limited in size by the fundamental laws of diffraction to about half a wavelength of light and cannot be combined with nanoscale electronic components. Tremendous research efforts have been directed in search of an advanced technology which can bridge the size gap between electronic and photonic worlds. An emerging technology of "plasmonics'' which exploits the extraordinary optical properties of metal nanostructures to tailor the light at nanoscale has been considered a potential solution to both of the above-mentioned problems. Research conducted for this dissertation has an overall goal to investigate the optical properties of silicon with metal nanostructures for photovoltaics and advanced silicon photonics applications. The first part of the research focuses on achieving enhanced light trapping in poly-Si thin films using ion implantation induced surface texturing. In addition to surface texturing produced by H and Ar ion implantations, metal nanostructures are also added to the surface to further suppress light reflection at the plasmonic resonance of metal nanostructures. Remarkable suppression has been achieved resulting in reflection from the air/Si interface to below ˜5%. In the second part, optical properties of embedded metal nanostructures in silicon matrix gettered into the ion implantation created nanocavities are studied. Embedded nanostructures can have a huge impact in future photonics applications by replacing the existing electronic and photonic components such as interconnects, waveguides, modulators and amplifiers with their plasmonic counterparts. This new method of encapsulating metal nanostructures in silicon is cost-effective and compatible with silicon fabrication technology. Spectroscopic ellipsometry is used to study the dielectric properties of silicon with embedded silver nanostructures. High absorption regions around 900 nm, corresponding to plasmonic absorption of Ag nanoparticles in Si, have been observed and compared to theoretical calculations and simulation results. The possibility of modifying the dielectric function of Si with metal nanostructures can lay the foundation for functional base structures for advanced applications in silicon photonics, photovoltaics and plasmonics.

A home-built digital optical MRI console using high-speed serial links.

PubMed

Tang, Weinan; Wang, Weimin; Liu, Wentao; Ma, Yajun; Tang, Xin; Xiao, Liang; Gao, Jia-Hong

2015-08-01

To develop a high performance, cost-effective digital optical console for scalable multichannel MRI. The console system was implemented with flexibility and efficiency based on a modular architecture with distributed pulse sequencers. High-speed serial links were optimally utilized to interconnect the system, providing fast digital communication with a multi-gigabit data rate. The conventional analog radio frequency (RF) chain was replaced with a digital RF manipulation. The acquisition electronics were designed in close proximity to RF coils and preamplifiers, using a digital optical link to transmit the MR signal. A prototype of the console was constructed with a broad frequency range from direct current to 100 MHz. A temporal resolution of 1 μs was achieved for both the RF and gradient operations. The MR signal was digitized in the scanner room with an overall dynamic range between 16 and 24 bits and was transmitted to a master controller over a duplex optic fiber with a high data rate of 3.125 gigabits per second. High-quality phantom and human images were obtained using the prototype on both 0.36T and 1.5T clinical MRI scanners. A homemade digital optical MRI console with high-speed serial interconnection has been developed to better serve imaging research and clinical applications. © 2014 Wiley Periodicals, Inc.

Single-mode glass waveguide technology for optical interchip communication on board level

NASA Astrophysics Data System (ADS)

Brusberg, Lars; Neitz, Marcel; Schröder, Henning

2012-01-01

The large bandwidth demand in long-distance telecom networks lead to single-mode fiber interconnects as result of low dispersion, low loss and dense wavelength multiplexing possibilities. In contrast, multi-mode interconnects are suitable for much shorter lengths up to 300 meters and are promising for optical links between racks and on board level. Active optical cables based on multi-mode fiber links are at the market and research in multi-mode waveguide integration on board level is still going on. Compared to multi-mode, a single-mode waveguide has much more integration potential because of core diameters of around 20% of a multi-mode waveguide by a much larger bandwidth. But light coupling in single-mode waveguides is much more challenging because of lower coupling tolerances. Together with the silicon photonics technology, a single-mode waveguide technology on board-level will be the straight forward development goal for chip-to-chip optical interconnects integration. Such a hybrid packaging platform providing 3D optical single-mode links bridges the gap between novel photonic integrated circuits and the glass fiber based long-distance telecom networks. Following we introduce our 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip interconnects. This novel packaging approach merges micro-system packaging and glass integrated optics. It consists of a thin glass substrate with planar integrated singlemode waveguide circuits, optical mirrors and lenses providing an integration platform for photonic IC assembly and optical fiber interconnect. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties. That makes it perfect for microsystem packaging. The paper presents recent results in single-mode waveguide technology on wafer level and waveguide characterization. Furthermore the integration in a hybrid packaging process and design issues are discussed.

SU-8 Lenses: Simple Methods of Fabrication and Application in Optical Interconnection Between Fiber/LED and Microstructures

NASA Astrophysics Data System (ADS)

Nguyen, Minh-Hang; Nguyen, Hai-Binh; Nguyen, Tuan-Hung; Vu, Xuan-Manh; Lai, Jain-Ren; Tseng, Fan-Gang; Chen, Te-Chang; Lee, Ming-Chang

2016-05-01

This paper presents two facile methods to fabricate off-plane lenses made of SU-8, an epoxy-based negative photoresist from MicroChem, on glass for optical interconnection. The methods allow the fabrication of lenses with flexible spot size and focal length depending on SU-8 well size and SU-8 drop volume and viscosity. In the first method, SU-8 drops were applied directly into patterned SU-8 wells with Teflon-coated micropipettes, and were baked to become (a)-spherical lenses. The lens shape and size were mainly determined by SU-8 viscosity, ratio of drop volume to well volume, and baking temperature and time. In the second method, a glass substrate with SU-8 patterned wells was emerged in diluted SU-8, then drawn up and baked to form lenses. The lens shapes and sizes were mainly determined by SU-8 viscosity and well volume. By the two methods, SU-8 lenses were successfully fabricated with spot sizes varying in range from micrometers to hundred micrometers, and focal lengths varying in range of several millimeters, depending on the lens rim diameters and aspheric sag height. Besides, on-plane SU-8 lenses were fabricated by photolithography to work in conjunction with the off-plane SU-8 lenses. The cascaded lenses produced light spots reduced to several micrometers, and they can be applied as a coupler for light coupling from fiber/Light-emitting diode (LED) to microstructures and nanostructures. The results open up the path for fabricating novel optical microsystems for optical communication and optical sensing applications.

Harsh environment fiber optic connectors/testing

NASA Astrophysics Data System (ADS)

Parker, Douglas A.

2014-09-01

Fiber optic systems are used frequently in military, aerospace and commercial aviation programs. There is a long history of implementing fiber optic data transfer for aircraft control, for harsh environment use in local area networks and more recently for in-flight entertainment systems. The advantages of fiber optics include high data rate capacity, low weight, immunity to EMI/RFI, and security from signal tapping. Technicians must be trained particularly to install and maintain fiber systems, but it is not necessarily more difficult than wire systems. However, the testing of the fiber optic interconnection system must be conducted in a standardized manner to assure proper performance. Testing can be conducted with slight differences in the set-up and procedure that produce significantly different test results. This paper reviews various options of interconnect configurations and discusses how these options can affect the performance, maintenance required and longevity of a fiber optic system, depending on the environment. Proper test methods are discussed. There is a review of the essentials of proper fiber optic testing and impact of changing such test parameters as input launch conditions, wavelength considerations, power meter options and the basic methods of testing. This becomes important right from the start when the supplier test data differs from the user's data check upon receiving the product. It also is important in periodic testing. Properly conducting the fiber optic testing will eliminate confusion and produce meaningful test results for a given harsh environment application.

NITINOL Interconnect Device for Optical Fiber Waveguides

DTIC Science & Technology

1981-07-01

LE EL,~NAVSEA REPORT NO. S27L~kV-NL 4P fNSWNC TR 81-129 1 JULY 1981 0 NITINOL INTERC&INECT DEVICE FOR OPTICAL FIBER WAVEGUIDES FINAL REPORT A...ACCESSION NO. 3. RECIPIENT’S CATALOG NUMBER NSWC TR 81-129I 1-19 -A )ci , ’ 4 TI TL E (and Sbtitle) S. TYPE OF REPORT & PERIOD COVERED NITINOL ... NITINOL Optical Fibers 20. ABSTRACT (Continue on reverse side if neceeewy and identify by block number) Two different interconnect devices for optical

Ultrafast laser inscription of 3D components for spatial multiplexing

NASA Astrophysics Data System (ADS)

Thomson, Robert R.

2016-02-01

The thirst for bandwidth in telecommunications networks is becoming ever larger due to bandwidth hungry applications such as video-on-demand. To further increase the bandwidth capacity, engineers are now seeking to imprint information on the last remaining degree of freedom of the lightwave carrier - space. This has given rise to the field of Space Division Multiplexing (SDM). In essence, the concept of SDM simple; we aim to use the different spatial modes of an optical fibre as multiplexed data transmission channels. These modes could either be in the form of separate singlemodes in a multicore optical fibre, individual spatial modes of a multimode fibre, or indeed the individual spatial modes of a multimode multicore optical fibre. Regardless of the particular "flavour" of SDM in question, it is clear that significant interfacing issues exist between the optical fibres used in SDM and the conventional single-mode planar lightwave circuits that are essential to process the light (e.g. arrayed waveguide gratings and splitters), and efficient interconnect technologies will be required. One fabrication technology that has emerged as a possible route to solve these interconnection issues is ultrafast laser inscription (ULI), which relies on the use of focused ultrashort laser pulses to directly inscribe three-dimensional waveguide structures inside a bulk dielectric. In this paper, I describe some of the work that has been conducted around the world to apply the unique waveguide fabrication capabilities of ULI to the development of 3D photonic components for applications in SDM.

Optical techniques to feed and control GaAs MMIC modules for phased array antenna applications

NASA Astrophysics Data System (ADS)

Bhasin, K. B.; Anzic, G.; Kunath, R. R.; Connolly, D. J.

A complex signal distribution system is required to feed and control GaAs monolithic microwave integrated circuits (MMICs) for phased array antenna applications above 20 GHz. Each MMIC module will require one or more RF lines, one or more bias voltage lines, and digital lines to provide a minimum of 10 bits of combined phase and gain control information. In a closely spaced array, the routing of these multiple lines presents difficult topology problems as well as a high probability of signal interference. To overcome GaAs MMIC phased array signal distribution problems optical fibers interconnected to monolithically integrated optical components with GaAs MMIC array elements are proposed as a solution. System architecture considerations using optical fibers are described. The analog and digital optical links to respectively feed and control MMIC elements are analyzed. It is concluded that a fiber optic network will reduce weight and complexity, and increase reliability and performance, but higher power will be required.

Optical techniques to feed and control GaAs MMIC modules for phased array antenna applications

NASA Technical Reports Server (NTRS)

Bhasin, K. B.; Anzic, G.; Kunath, R. R.; Connolly, D. J.

1986-01-01

A complex signal distribution system is required to feed and control GaAs monolithic microwave integrated circuits (MMICs) for phased array antenna applications above 20 GHz. Each MMIC module will require one or more RF lines, one or more bias voltage lines, and digital lines to provide a minimum of 10 bits of combined phase and gain control information. In a closely spaced array, the routing of these multiple lines presents difficult topology problems as well as a high probability of signal interference. To overcome GaAs MMIC phased array signal distribution problems optical fibers interconnected to monolithically integrated optical components with GaAs MMIC array elements are proposed as a solution. System architecture considerations using optical fibers are described. The analog and digital optical links to respectively feed and control MMIC elements are analyzed. It is concluded that a fiber optic network will reduce weight and complexity, and increase reliability and performance, but higher power will be required.

Photonics for aerospace sensors

NASA Astrophysics Data System (ADS)

Pellegrino, John; Adler, Eric D.; Filipov, Andree N.; Harrison, Lorna J.; van der Gracht, Joseph; Smith, Dale J.; Tayag, Tristan J.; Viveiros, Edward A.

1992-11-01

The maturation in the state-of-the-art of optical components is enabling increased applications for the technology. Most notable is the ever-expanding market for fiber optic data and communications links, familiar in both commercial and military markets. The inherent properties of optics and photonics, however, have suggested that components and processors may be designed that offer advantages over more commonly considered digital approaches for a variety of airborne sensor and signal processing applications. Various academic, industrial, and governmental research groups have been actively investigating and exploiting these properties of high bandwidth, large degree of parallelism in computation (e.g., processing in parallel over a two-dimensional field), and interconnectivity, and have succeeded in advancing the technology to the stage of systems demonstration. Such advantages as computational throughput and low operating power consumption are highly attractive for many computationally intensive problems. This review covers the key devices necessary for optical signal and image processors, some of the system application demonstration programs currently in progress, and active research directions for the implementation of next-generation architectures.

Methods and apparatus for optical switching using electrically movable optical fibers

DOEpatents

Peterson, Kenneth A [Albuquerque, NM

2007-03-13

Methods and apparatuses for electrically controlled optical switches are presented. An electrically controlled optical switch includes a fixture formed using a laminated dielectric material, a first optical fiber having a fixed segment supported by the fixture and a movable segment extending into a cavity, a second optical fiber having a fixed segment supported by the fixture and an extended segment where an optical interconnect may be established between the first optical fiber and the second optical fiber, and a first electrical actuator functionally coupled to the fixture and the first fiber which alters a position of the moveable segment, based upon a control signal, for changing a state of the optical interconnect between one of two states.

An efficient optical architecture for sparsely connected neural networks

NASA Technical Reports Server (NTRS)

Hine, Butler P., III; Downie, John D.; Reid, Max B.

1990-01-01

An architecture for general-purpose optical neural network processor is presented in which the interconnections and weights are formed by directing coherent beams holographically, thereby making use of the space-bandwidth products of the recording medium for sparsely interconnected networks more efficiently that the commonly used vector-matrix multiplier, since all of the hologram area is in use. An investigation is made of the use of computer-generated holograms recorded on such updatable media as thermoplastic materials, in order to define the interconnections and weights of a neural network processor; attention is given to limits on interconnection densities, diffraction efficiencies, and weighing accuracies possible with such an updatable thin film holographic device.

Air Force highly integrated photonics program: development and demonstration of an optically transparent fiber optic network for avionics applications

NASA Astrophysics Data System (ADS)

Whaley, Gregory J.; Karnopp, Roger J.

2010-04-01

The goal of the Air Force Highly Integrated Photonics (HIP) program is to develop and demonstrate single photonic chip components which support a single mode fiber network architecture for use on mobile military platforms. We propose an optically transparent, broadcast and select fiber optic network as the next generation interconnect on avionics platforms. In support of this network, we have developed three principal, single-chip photonic components: a tunable laser transmitter, a 32x32 port star coupler, and a 32 port multi-channel receiver which are all compatible with demanding avionics environmental and size requirements. The performance of the developed components will be presented as well as the results of a demonstration system which integrates the components into a functional network representative of the form factor used in advanced avionics computing and signal processing applications.

Grain-size considerations for optoelectronic multistage interconnection networks.

PubMed

Krishnamoorthy, A V; Marchand, P J; Kiamilev, F E; Esener, S C

1992-09-10

This paper investigates, at the system level, the performance-cost trade-off between optical and electronic interconnects in an optoelectronic interconnection network. The specific system considered is a packet-switched, free-space optoelectronic shuffle-exchange multistage interconnection network (MIN). System bandwidth is used as the performance measure, while system area, system power, and system volume constitute the cost measures. A detailed design and analysis of a two-dimensional (2-D) optoelectronic shuffle-exchange routing network with variable grain size K is presented. The architecture permits the conventional 2 x 2 switches or grains to be generalized to larger K x K grain sizes by replacing optical interconnects with electronic wires without affecting the functionality of the system. Thus the system consists of log(k) N optoelectronic stages interconnected with free-space K-shuffles. When K = N, the MIN consists of a single electronic stage with optical input-output. The system design use an effi ient 2-D VLSI layout and a single diffractive optical element between stages to provide the 2-D K-shuffle interconnection. Results indicate that there is an optimum range of grain sizes that provides the best performance per cost. For the specific VLSI/GaAs multiple quantum well technology and system architecture considered, grain sizes larger than 256 x 256 result in a reduced performance, while grain sizes smaller than 16 x 16 have a high cost. For a network with 4096 channels, the useful range of grain sizes corresponds to approximately 250-400 electronic transistors per optical input-output channel. The effect of varying certain technology parameters such as the number of hologram phase levels, the modulator driving voltage, the minimum detectable power, and VLSI minimum feature size on the optimum grain-size system is studied. For instance, results show that using four phase levels for the interconnection hologram is a good compromise for the cost functions mentioned above. As VLSI minimum feature sizes decrease, the optimum grain size increases, whereas, if optical interconnect performance in terms of the detector power or modulator driving voltage requirements improves, the optimum grain size may be reduced. Finally, several architectural modifications to the system, such as K x K contention-free switches and sorting networks, are investigated and optimized for grain size. Results indicate that system bandwidth can be increased, but at the price of reduced performance/cost. The optoelectronic MIN architectures considered thus provide a broad range of performance/cost alternatives and offer a superior performance over purely electronic MIN's.

Communications and control for electric power systems

NASA Technical Reports Server (NTRS)

Kirkham, H.; Goettsche, A.; Niebur, D.; Friend, H.; Johnston, A.

1991-01-01

The first section of the report describes the AbNET system, a hardware and software communications system designed for distribution automation (it can also find application in substation monitoring and control). The topology of the power system fixes the topology of the communications network, which can therefore be expected to include a larger number of branch points, tap points, and interconnections. These features make this communications network unlike any other. The network operating software has to solve the problem of communicating to all the nodes of a very complex network in as reliable a way as possible even if the network is damaged, and it has to do so with minimum transmission delays and at minimum cost. The design of the operating protocols is described within the framework of the seven-layer Open System Interconnection hierarchy of the International Standards Organization. Section 2 of the report describes the development and testing of a high voltage sensor based on an electro-optic polymer. The theory of operation is reviewed. Bulk fabrication of the polymer is discussed, as well as results of testing of the electro-optic coefficient of the material. Fabrication of a complete prototype sensor suitable for use in the range 1-20 kV is described. The electro-optic polymer is shown to be an important material for fiber optic sensing applications. Appendix A is theoretical support for this work. The third section of the report presents the application of an artificial neural network, Kohonen's self-organizing feature map, for the classification of power system states. This classifier maps vectors of an N-dimensional space to a 2-dimensional neural net in a nonlinear way preserving the topological order of the input vectors. These mappings are studied using a nonlinear power system model.

The Fiber Optic Subsystem Components on Express Logistics Carrier for International Space Station

NASA Technical Reports Server (NTRS)

Ott, Melanie N.; Switzer, Robert; Thomes, William Joe; Chuska, Richard; LaRocca, Frank; Day, Lance

2009-01-01

ISS SSP 50184 HRDL optical fiber communication subsystem, has system level requirements that were changed to accommodate large loss optical fiber links previously installed. SSQ22680 design is difficult to implement, no metal shell over socket/pin combination to protect the weak part of the pin. Additions to ISS are planned for the future. AVIM still used for interconnection in space flight applications without incident. Thermal cycling resulted in less than 0.25 dB max change in Insertion Loss for all types during cycling, nominal as compared to the AVIM. Vibration testing results conclusion; no significant changes, nominal as compared to AVIM.

Optical-fiber-to-waveguide coupling using carbon-dioxide-laser-induced long-period fiber gratings.

PubMed

Bachim, Brent L; Ogunsola, Oluwafemi O; Gaylord, Thomas K

2005-08-15

Optical fibers are expected to play a role in chip-level and board-level optical interconnects because of limitations on the bandwidth and level of integration of electrical interconnects. Therefore, methods are needed to couple optical fibers directly to waveguides on chips and on boards. We demonstrate optical-fiber-to-waveguide coupling using carbon-dioxide laser-induced long-period fiber gratings (LPFGs). Such gratings can be written in standard fiber and offer wavelength multiplexing-demultiplexing performance. The coupler fabrication process and the characterization apparatus are presented. The operation and the wavelength response of a LPFG-based optical-fiber-to-waveguide directional coupler are demonstrated.

Two different ways for waveguides and optoelectronics components on top of C-MOS

NASA Astrophysics Data System (ADS)

Fedeli, J. M.; Jeannot, S.; Kostrzewa, M.; Di Cioccio, L.; Jousseaume, V.; Orobtchouk, R.; Maury, P.; Zussy, M.

2006-02-01

While fabrication of photonic components at the wafer level is a long standing goal of integrated optics, new applications such as optical interconnects are introducing new challenges for waveguides and optoelectronic component fabrication. Indeed, global interconnects are expected to face severe limitations in the near future. To face this problem, optical links on top of a CMOS circuits could be an alternative. The critical points to perform an optical link on a chip are firstly the realization of compact passive optical distribution and secondly the report of optoelectronic components for the sources and detectors. This paper presents two different approaches for the integration of both waveguides and optoelectronic components. In a first "total bonding" approach, waveguides have been elaborated using classical "Silicon On Insulators" technology and then reported using molecular bonding on top off Si wafers. The S0I substrate was then chemically etched, after what InP dies were moleculary bonded on top of the waveguides. With this approach, optical components with low loses and a good equilibrium are demonsrated. Using molecular bonding, InP dies were reported with no degradation of the optoelectronic properties of the films. In a second approach, using PECVD silicon nitride or amorphous silicon coupled to PECVD silicon oxide, basic optical components are demonstrated. This low temperature technology is compatible with a microelectronic Back End process, allowing an integration of the waveguides directly on top of CMOS circuits. InP dies can then be bonded on top of the waveguides.

Transparent, flexible supercapacitors from nano-engineered carbon films.

PubMed

Jung, Hyun Young; Karimi, Majid B; Hahm, Myung Gwan; Ajayan, Pulickel M; Jung, Yung Joon

2012-01-01

Here we construct mechanically flexible and optically transparent thin film solid state supercapacitors by assembling nano-engineered carbon electrodes, prepared in porous templates, with morphology of interconnected arrays of complex shapes and porosity. The highly textured graphitic films act as electrode and current collector and integrated with solid polymer electrolyte, function as thin film supercapacitors. The nanostructured electrode morphology and the conformal electrolyte packaging provide enough energy and power density for the devices in addition to excellent mechanical flexibility and optical transparency, making it a unique design in various power delivery applications.

Transparent, flexible supercapacitors from nano-engineered carbon films

PubMed Central

Jung, Hyun Young; Karimi, Majid B.; Hahm, Myung Gwan; Ajayan, Pulickel M.; Jung, Yung Joon

2012-01-01

Here we construct mechanically flexible and optically transparent thin film solid state supercapacitors by assembling nano-engineered carbon electrodes, prepared in porous templates, with morphology of interconnected arrays of complex shapes and porosity. The highly textured graphitic films act as electrode and current collector and integrated with solid polymer electrolyte, function as thin film supercapacitors. The nanostructured electrode morphology and the conformal electrolyte packaging provide enough energy and power density for the devices in addition to excellent mechanical flexibility and optical transparency, making it a unique design in various power delivery applications. PMID:23105970

Transparent, flexible supercapacitors from nano-engineered carbon films

NASA Astrophysics Data System (ADS)

Jung, Hyun Young; Karimi, Majid B.; Hahm, Myung Gwan; Ajayan, Pulickel M.; Jung, Yung Joon

2012-10-01

Here we construct mechanically flexible and optically transparent thin film solid state supercapacitors by assembling nano-engineered carbon electrodes, prepared in porous templates, with morphology of interconnected arrays of complex shapes and porosity. The highly textured graphitic films act as electrode and current collector and integrated with solid polymer electrolyte, function as thin film supercapacitors. The nanostructured electrode morphology and the conformal electrolyte packaging provide enough energy and power density for the devices in addition to excellent mechanical flexibility and optical transparency, making it a unique design in various power delivery applications.

Performance of a 300 Mbps 1:16 serial/parallel optoelectronic receiver module

NASA Technical Reports Server (NTRS)

Richard, M. A.; Claspy, P. C.; Bhasin, K. B.; Bendett, M. B.

1990-01-01

Optical interconnects are being considered for the high speed distribution of multiplexed control signals in GaAs monolithic microwave integrated circuit (MMIC) based phased array antennas. The performance of a hybrid GaAs optoelectronic integrated circuit (OEIC) is described, as well as its design and fabrication. The OEIC converts a 16-bit serial optical input to a 16 parallel line electrical output using an on-board 1:16 demultiplexer and operates at data rates as high as 30b Mbps. The performance characteristics and potential applications of the device are presented.

Dual-scale topology optoelectronic processor.

PubMed

Marsden, G C; Krishnamoorthy, A V; Esener, S C; Lee, S H

1991-12-15

The dual-scale topology optoelectronic processor (D-STOP) is a parallel optoelectronic architecture for matrix algebraic processing. The architecture can be used for matrix-vector multiplication and two types of vector outer product. The computations are performed electronically, which allows multiplication and summation concepts in linear algebra to be generalized to various nonlinear or symbolic operations. This generalization permits the application of D-STOP to many computational problems. The architecture uses a minimum number of optical transmitters, which thereby reduces fabrication requirements while maintaining area-efficient electronics. The necessary optical interconnections are space invariant, minimizing space-bandwidth requirements.

Chip-scale integrated optical interconnects: a key enabler for future high-performance computing

NASA Astrophysics Data System (ADS)

Haney, Michael; Nair, Rohit; Gu, Tian

2012-01-01

High Performance Computing (HPC) systems are putting ever-increasing demands on the throughput efficiency of their interconnection fabrics. In this paper, the limits of conventional metal trace-based inter-chip interconnect fabrics are examined in the context of state-of-the-art HPC systems, which currently operate near the 1 GFLOPS/W level. The analysis suggests that conventional metal trace interconnects will limit performance to approximately 6 GFLOPS/W in larger HPC systems that require many computer chips to be interconnected in parallel processing architectures. As the HPC communications bottlenecks push closer to the processing chips, integrated Optical Interconnect (OI) technology may provide the ultra-high bandwidths needed at the inter- and intra-chip levels. With inter-chip photonic link energies projected to be less than 1 pJ/bit, integrated OI is projected to enable HPC architecture scaling to the 50 GFLOPS/W level and beyond - providing a path to Peta-FLOPS-level HPC within a single rack, and potentially even Exa-FLOPSlevel HPC for large systems. A new hybrid integrated chip-scale OI approach is described and evaluated. The concept integrates a high-density polymer waveguide fabric directly on top of a multiple quantum well (MQW) modulator array that is area-bonded to the Silicon computing chip. Grayscale lithography is used to fabricate 5 μm x 5 μm polymer waveguides and associated novel small-footprint total internal reflection-based vertical input/output couplers directly onto a layer containing an array of GaAs MQW devices configured to be either absorption modulators or photodetectors. An external continuous wave optical "power supply" is coupled into the waveguide links. Contrast ratios were measured using a test rider chip in place of a Silicon processing chip. The results suggest that sub-pJ/b chip-scale communication is achievable with this concept. When integrated into high-density integrated optical interconnect fabrics, it could provide a seamless interconnect fabric spanning the intra-

Ring-array processor distribution topology for optical interconnects

NASA Technical Reports Server (NTRS)

Li, Yao; Ha, Berlin; Wang, Ting; Wang, Sunyu; Katz, A.; Lu, X. J.; Kanterakis, E.

1992-01-01

The existing linear and rectangular processor distribution topologies for optical interconnects, although promising in many respects, cannot solve problems such as clock skews, the lack of supporting elements for efficient optical implementation, etc. The use of a ring-array processor distribution topology, however, can overcome these problems. Here, a study of the ring-array topology is conducted with an aim of implementing various fast clock rate, high-performance, compact optical networks for digital electronic multiprocessor computers. Practical design issues are addressed. Some proof-of-principle experimental results are included.

Overview of Photonic Materials for Application in Space Environments

NASA Technical Reports Server (NTRS)

Taylor, E. W.; Osinski, M.; Svimonishvili, Tengiz; Watson, M.; Bunton, P.; Pearson, S. D.; Bilbro, J.

1999-01-01

Future space systems will he based on components evolving from the development and refinement of new and existing photonic materials. Optically based sensors, inertial guidance, tracking systems, communications, diagnostics, imaging and high speed optical processing are but a few of the applications expected to widely utilize photonic materials. The response of these materials to space environment effects (SEE) such as spacecraft charging, orbital debris, atomic oxygen, ultraviolet irradiation, temperature and ionizing radiation will be paramount to ensuring successful space applications. The intent of this paper is to, address the latter two environments via a succinct comparison of the known sensitivities of selected photonic materials to the temperature and ionizing radiation conditions found in space and enhanced space environments Delineation of the known temperature and radiation induced responses in LiNbO3, AlGaN, AlGsAs,TeO2, Si:Ge, and several organic polymers are presented. Photonic materials are realizing rapid transition into applications for many proposed space components and systems including: optical interconnects, optical gyros, waveguide and spatial light modulators, light emitting diodes, lasers, optical fibers and fiber optic amplifiers. Changes to material parameters such as electrooptic coefficients, absorption coefficients, polarization, conductivity, coupling coefficients, diffraction efficiencies, and other pertinent material properties examined for thermo-optic and radiation induced effect. Conclusions and recommendations provide the reader with an understanding of the limitations or attributes of material choices for specific applications.

Fabrication of a novel gigabit/second free-space optical interconnect - photodetector characterization and testing and system development

NASA Technical Reports Server (NTRS)

Savich, Gregory R.

2004-01-01

The time when computing power is limited by the copper wire inherent in the computer system and not the speed of the microprocessor is rapidly approaching. With constant advances in computer technology, many researchers believe that in only a few years, optical interconnects will begin to replace copper wires in your Central Processing Unit (CPU). On a more macroscopic scale, the telecommunications industry has already made the switch to optical data transmission as, to date, fiber optic technology is the only reasonable method of reliable, long range data transmission. Within the span of a decade, we will see optical technologies move from the macroscopic world of the telecommunications industry to the microscopic world of the computer chip. Already, the communications industry is marketing commercially available optical links to connect two personal computers, thereby eliminating the need for standard and comparatively slow wired and wireless Ethernet transfers and greatly increasing the distance the computers can be separated. As processing demands continue to increase, the realm of optical communications will continue to move closer to the microprocessor and quite possibly onto the microprocessor itself. A day may come when copper connections are used only to supply power, not transfer data. This summer s work marks some of the beginning stages of a 5 to 10 year, long-term research project to create and study a free-space, 1 Gigabit/sec optical interconnect. The research will result in a novel fabricated, chip-to-chip interconnect consisting of a Vertical Cavity Surface Emitting Laser (VCSEL) Diode linked through free space to a Metal- Semiconductor-Metal (MSM) Photodetector with the possible integration of microlenses for signal focusing and Micro-Electromechanical Systems (MEMS) devices for optical signal steering. The advantages, disadvantages, and practicality of incorporating flip-chip mounting technologies will also be addressed. My work began with the design and construction of a test setup for the experiment and then appropriate characterization of the test system. Specifically, I am involved in the characterization of a commercially available 1550nm wavelength, 5mW diode laser and a study of its modulation bandwidth. Commercially produced photodetectors as well as the incorporation of microwave technology, in the form of RF input and output, are used in the characterization procedure. The next stage involves the use of a probe station and network analyzer to characterize and test a series of photodetectors fabricated on a 2 inch, Indium Gallium Arsenide (InGaAs) wafer in the Branch s microlithography lab. Other project responsibilities include, but are not limited to the incorporation of a transimpedance amplifier to the photodetector circuit; a study of VCSEL technology; bit error rate analysis of an optical interconnect system; and analysis of free space divergence of the VCSEL, optical path length of the interconnect; and any other pertinent optical properties of the one gigabit per second interconnect for fabrication and testing.

Optical interconnects for in-plane high-speed signal distribution at 10 Gb/s: Analysis and demonstration

NASA Astrophysics Data System (ADS)

Chang, Yin-Jung

With decreasing transistor size, increasing chip speed, and larger numbers of processors in a system, the performance of a module/system is being limited by the off-chip and off-module bandwidth-distance products. Optical links have moved from fiber-based long distance communications to the cabinet level of 1m--100m, and recently to the backplane-level (10cm--1m). Board-level inter-chip parallel optical interconnects have been demonstrated recently by researchers from Intel, IBM, Fujitsu, NTT and a few research groups in universities. However, the board-level signal/clock distribution function using optical interconnects, the lightwave circuits, the system design, a practically convenient integration scheme committed to the implementation of a system prototype have not been explored or carefully investigated. In this dissertation, the development of a board-level 1 x 4 optical-to-electrical signal distribution at 10Gb/s is presented. In contrast to other prototypes demonstrating board-level parallel optical interconnects that have been drawing much attention for the past decade, the optical link design for the high-speed signal broadcasting is even more complicated and the pitch between receivers could be varying as opposed to fixed-pitch design that has been widely-used in the parallel optical interconnects. New challenges for the board-level high-speed signal broadcasting include, but are not limited to, a new optical link design, a lightwave circuit as a distribution network, and a novel integration scheme that can be a complete radical departure from the traditional assembly method. One of the key building blocks in the lightwave circuit is the distribution network in which a 1 x 4 multimode interference (MMI) splitter is employed. MMI devices operating at high data rates are important in board-level optical interconnects and need to be characterized in the application of board-level signal broadcasting. To determine the speed limitations of MMI devices, the ultra-short pulse response of these devices is modeled based on the guided-mode theory incorporated with Fourier transform technique. For example, for 50 fs Gaussian input pulses into a 1 x 16 splitter, the output pulses are severely degraded in coupling efficiency (48%) and completely broken up in time primarily due to inter-modal and intra-modal (waveguide) dispersion. Material dispersion is found to play only a minor role in the pulse response of MMI devices. However, for 1ps input pulses into the same 1 x 16 splitter, the output pulses are only moderately degraded in coupling efficiency (86%) and only slightly degraded in shape. With the understanding of the necessary condition of the distortionless high-speed signal transmission through MMI devices, high-speed data transmission at 40Gb/s per channel with a total bandwidth of 320Gb/s for 8 output ports is demonstrated for the first time on a 1 x 8 photo-definable polymer-based MMI power splitter. The device is designed with multimode input/output waveguides of 10mum in width and 7.6mum in height for a better input coupling efficiency for which the high-speed testing demands. The eye diagrams are all clear and fully open with an extinction ratio of 10.1dB and a jitter of 1.65 ps. The transmission validity is further confirmed by the bit-error-rate testing at the pseudoramdom binary sequence of 27--1. The fabrication process developed lays the cornerstone of the integration scheme and system design for the prototype of hybrid interconnects. An important problem regarding the guided-mode attenuation associated with optical-interconnect-polymer waveguides fabricated on FR-4 printed-circuit boards is also quantified for the first time. On-board optical waveguides are receiving more attention recently from Fujitsu American Laboratory, IBM Watson Research Center, and Packaging Research Center here at Georgia Tech. This branch of research work is part of the effort in investigating, scientifically, the attenuation mechanism and the effects of the buffer layer thickness on board-level in-plane optical interconnects. The rigorous transmission-line network approach is used and the FR-4 substrate is treated as a long-period substrate grating. A quantitative metric for an appropriate matrix truncation is presented. The peaks of attenuation are shown to occur near the Bragg conditions that characterize the leaky-wave stop bands. For a typical 400mum period FR-4 substrate with an 8mum corrugation depth, a buffer layer thickness of about 40mum is found to be needed to make the attenuation negligibly small. An experimental prototype for on-board optical-to-electrical signal broadcasting operating at 10Gb/s per channel over an interconnect distance of 10cm is demonstrated. An improved 1 x 4 multimode interference (MMI) splitter at 1550nm with linearly-tapered output facet is heterogeneously integrated with four p-i-n photodetectors (PDs) on a Silicon (Si) bench. The Si bench itself is hybrid integrated onto an FR-4 printed-circuit board with four receiver channels. A novel fabrication/integration approach demonstrates the simultaneous alignment between the four waveguides and the four PDs during the MMI fabrication process. The entire system is fully functional at 10Gb/s.

Design of MOEMS adjustable optical delay line to reduce link set-up time in a tera-bit/s optical interconnection network.

PubMed

Jing, Wencai; Zhang, Yimo; Zhou, Ge

2002-07-15

A new structure for bit synchronization in a tera-bit/s optical interconnection network has been designed using micro-electro-mechanical system (MEMS) technique. Link multiplexing has been adopted to reduce data packet communication latency. To eliminate link set-up time, adjustable optical delay lines (AODLs) have been adopted to shift the phases of the distributed optical clock signals for bit synchronization. By changing the optical path distance of the optical clock signal, the phase of the clock signal can be shifted at a very high resolution. A phase-shift resolution of 0.1 ps can be easily achieved with 30-microm alternation of the optical path length in vacuum.

Fully Integrated Optical Spectrometer in Visible and Near-IR in CMOS.

PubMed

Hong, Lingyu; Sengupta, Kaushik

2017-12-01

Optical spectrometry in the visible and near-infrared range has a wide range of applications in healthcare, sensing, imaging, and diagnostics. This paper presents the first fully integrated optical spectrometer in standard bulk CMOS process without custom fabrication, postprocessing, or any external optical passive structure such as lenses, gratings, collimators, or mirrors. The architecture exploits metal interconnect layers available in CMOS processes with subwavelength feature sizes to guide, manipulate, control, diffract light, integrated photodetector, and read-out circuitry to detect dispersed light, and then back-end signal processing for robust spectral estimation. The chip, realized in bulk 65-nm low power-CMOS process, measures 0.64 mm 0.56 mm in active area, and achieves 1.4 nm in peak detection accuracy for continuous wave excitations between 500 and 830 nm. This paper demonstrates the ability to use these metal-optic nanostructures to miniaturize complex optical instrumentation into a new class of optics-free CMOS-based systems-on-chip in the visible and near-IR for various sensing and imaging applications.

Driver-receiver combined optical transceiver modules for bidirectional optical interconnection

NASA Astrophysics Data System (ADS)

Park, Hyo-Hoon; Kang, Sae-Kyoung; Kim, Do-Won; Nga, Nguyen T. H.; Hwang, Sung-Hwan; Lee, Tae-Woo

2008-02-01

We review a bidirectional optical link scheme for memory-interface applications. A driver-receiver combined optical transceiver (TRx) modules was demonstrated on an optical printed-circuit board (OPCB) platform. To select the bidirectional electric input/output signals, a driver-receiver combined TRx IC with a switching function was designed in 0.18-μm CMOS technology. The TRx IC was integrated with VCSEL/PD chips for optical link in the TRx module. The optical TRx module was assembled on a fiber-embedded OPCB, employing a 90°-bent fiber connector for 90° deflection of light beams between the TRx module and the OPCB. The TRx module and the 90° connector were passively assembled on the OPCB, using ferrule-type guide pins/ holes. Employing these constituent components, the bidirectional optical link between a pair of TRx modules has been successfully demonstrated up to 1.25 Gb/s on the OPCB.

Optical multidimensional multiple access(O-MDMA): a new concept for free-space laser communication based on photonic mixer devices

NASA Astrophysics Data System (ADS)

Hess, Holger; Albrecht, Martin; Grothof, Markus; Hussmann, Stephan; Schwarte, Rudolf

2004-01-01

Working on optical distance measurement a new optical correlator was developed at the Institute for Data Processing of the University of Siegen in the last years. The so called Photonic Mixer Device (PMD), to be meant originally for laser ranging systems, offers a lot of advantages for wireless optical data communication like high speed spatial light demodulation up to the GHz range and inherent backlight suppression. This contribution describes the application of such PMDs in a free space interconnect based on the principle of Multi Dimensional Multiple Access (MDMA) and the advantages of this new approach, starting from the MDMA principle and followed by the fundamental functionality of PMDs. After that an Optical MDMA (O-MDMA) demonstrator and first measurement results will be presented.

Silicon Modulators, Switches and Sub-systems for Optical Interconnect

NASA Astrophysics Data System (ADS)

Li, Qi

Silicon photonics is emerging as a promising platform for manufacturing and integrating photonic devices for light generation, modulation, switching and detection. The compatibility with existing CMOS microelectronic foundries and high index contrast in silicon could enable low cost and high performance photonic systems, which find many applications in optical communication, data center networking and photonic network-on-chip. This thesis first develops and demonstrates several experimental work on high speed silicon modulators and switches with record performance and novel functionality. A 8x40 Gb/s transmitter based on silicon microrings is first presented. Then an end-to-end link using microrings for Binary Phase Shift Keying (BPSK) modulation and demodulation is shown, and its performance with conventional BPSK modulation/ demodulation techniques is compared. Next, a silicon traveling-wave Mach- Zehnder modulator is demonstrated at data rate up to 56 Gb/s for OOK modulation and 48 Gb/s for BPSK modulation, showing its capability at high speed communication systems. Then a single silicon microring is shown with 2x2 full crossbar switching functionality, enabling optical interconnects with ultra small footprint. Then several other experiments in the silicon platform are presented, including a fully integrated in-band Optical Signal to Noise Ratio (OSNR) monitor, characterization of optical power upper bound in a silicon microring modulator, and wavelength conversion in a dispersion-engineered waveguide. The last part of this thesis is on network-level application of photonics, specically a broadcast-and-select network based on star coupler is introduced, and its scalability performance is studied. Finally a novel switch architecture for data center networks is discussed, and its benefits as a disaggregated network are presented.

1060-nm VCSEL-based parallel-optical modules for optical interconnects

NASA Astrophysics Data System (ADS)

Nishimura, N.; Nagashima, K.; Kise, T.; Rizky, A. F.; Uemura, T.; Nekado, Y.; Ishikawa, Y.; Nasu, H.

2015-03-01

The capability of mounting a parallel-optical module onto a PCB through solder-reflow process contributes to reduce the number of piece parts, simplify its assembly process, and minimize a foot print for both AOC and on-board applications. We introduce solder-reflow-capable parallel-optical modules employing 1060-nm InGaAs/GaAs VCSEL which leads to the advantages of realizing wider modulation bandwidth, longer transmission distance, and higher reliability. We demonstrate 4-channel parallel optical link performance operated at a bit stream of 28 Gb/s 231-1 PRBS for each channel and transmitted through a 50-μm-core MMF beyond 500 m. We also introduce a new mounting technology of paralleloptical module to realize maintaining good coupling and robust electrical connection during solder-reflow process between an optical module and a polymer-waveguide-embedded PCB.

DGIC Interconnection Insights | Distributed Generation Interconnection

Science.gov Websites

Collaborative | NREL The State of Pre-Application Reports June 2017 by Zachary Peterson opportunities for improving DER interconnection processes. Some state regulators have sought the use of pre -application reports to improve interconnection data availability and application processing. A pre-application

Optomechanical Design and Characterization of a Printed-Circuit-Board-Based Free-Space Optical Interconnect Package

NASA Astrophysics Data System (ADS)

Zheng, Xuezhe; Marchand, Philippe J.; Huang, Dawei; Kibar, Osman; Ozkan, Nur S. E.; Esener, Sadik C.

1999-09-01

We present a proof of concept and a feasibility demonstration of a practical packaging approach in which free-space optical interconnects (FSOI s) can be integrated simply on electronic multichip modules (MCM s) for intra-MCM board interconnects. Our system-level packaging architecture is based on a modified folded 4 f imaging system that has been implemented with only off-the-shelf optics, conventional electronic packaging, and passive-assembly techniques to yield a potentially low-cost and manufacturable packaging solution. The prototypical system as built supports 48 independent FSOI channels with 8 separate laser and detector chips, for which each chip consists of a one-dimensional array of 12 devices. All the chips are assembled on a single substrate that consists of a printed circuit board or a ceramic MCM. Optical link channel efficiencies of greater than 90% and interchannel cross talk of less than 20 dB at low frequency have been measured. The system is compact at only 10 in. 3 (25.4 cm 3 ) and is scalable, as it can easily accommodate additional chips as well as two-dimensional optoelectronic device arrays for increased interconnection density.

Construction of large scale switch matrix by interconnecting integrated optical switch chips with EDFAs

NASA Astrophysics Data System (ADS)

Liao, Mingle; Wu, Baojian; Hou, Jianhong; Qiu, Kun

2018-03-01

Large scale optical switches are essential components in optical communication network. We aim to build up a large scale optical switch matrix by the interconnection of silicon-based optical switch chips using 3-stage CLOS structure, where EDFAs are needed to compensate for the insertion loss of the chips. The optical signal-to-noise ratio (OSNR) performance of the resulting large scale optical switch matrix is investigated for TE-mode light and the experimental results are in agreement with the theoretical analysis. We build up a 64 ×64 switch matrix by use of 16 ×16 optical switch chips and the OSNR and receiver sensibility can respectively be improved by 0.6 dB and 0.2 dB by optimizing the gain configuration of the EDFAs.

Optical printed circuit board (O-PCB) and VLSI photonic integrated circuits: visions, challenges, and progresses

NASA Astrophysics Data System (ADS)

Lee, El-Hang; Lee, S. G.; O, B. H.; Park, S. G.; Noh, H. S.; Kim, K. H.; Song, S. H.

2006-09-01

A collective overview and review is presented on the original work conducted on the theory, design, fabrication, and in-tegration of micro/nano-scale optical wires and photonic devices for applications in a newly-conceived photonic systems called "optical printed circuit board" (O-PCBs) and "VLSI photonic integrated circuits" (VLSI-PIC). These are aimed for compact, high-speed, multi-functional, intelligent, light-weight, low-energy and environmentally friendly, low-cost, and high-volume applications to complement or surpass the capabilities of electrical PCBs (E-PCBs) and/or VLSI electronic integrated circuit (VLSI-IC) systems. These consist of 2-dimensional or 3-dimensional planar arrays of micro/nano-optical wires and circuits to perform the functions of all-optical sensing, storing, transporting, processing, switching, routing and distributing optical signals on flat modular boards or substrates. The integrated optical devices include micro/nano-scale waveguides, lasers, detectors, switches, sensors, directional couplers, multi-mode interference devices, ring-resonators, photonic crystal devices, plasmonic devices, and quantum devices, made of polymer, silicon and other semiconductor materials. For VLSI photonic integration, photonic crystals and plasmonic structures have been used. Scientific and technological issues concerning the processes of miniaturization, interconnection and integration of these systems as applicable to board-to-board, chip-to-chip, and intra-chip integration, are discussed along with applications for future computers, telecommunications, and sensor-systems. Visions and challenges toward these goals are also discussed.

Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2013-01-01

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.

Review on Photonic Generation of Chirp Arbitrary Microwave Waveforms for Remote Sensing Application

NASA Astrophysics Data System (ADS)

Raghuwanshi, Sanjeev Kumar; Srivastav, Akash; Athokpam, Bidhanshel Singh

2017-12-01

A novel technique to generate an arbitrary chirped waveform by harnessing features of lithium niobate (LiNb O_3) Mach-Zehnder modulator is proposed and demonstrated. The most important application of chirped microwave waveform is that, it improves the range resolution of radar. Microwave photonics system provides high bandwidth capabilities of fiber-optic systems and also contains the ability to provide interconnect transmission properties, which are virtually independent of length. The low-loss wide bandwidth capability of optoelectronic systems makes them attractive for the transmission and processing of microwave signals, while the development of high-capacity optical communication systems has required the use of microwave techniques in optical transmitters and receivers. These two strands have led to the development of the research area of microwave photonics. So, it should be consider that microwave photonics as the field that studies the interaction between microwave and optical waves for applications such as communications, radars, sensors and instrumentations. In this paper, we have thoroughly reviewed the arbitrary chirped microwave generation techniques by using photonics technology.

Rapid prototyping of interfacing microcomponents for printed circuit board-level optical interconnects

NASA Astrophysics Data System (ADS)

Van Erps, Jürgen; Vervaeke, Michael; Thienpont, Hugo

2012-01-01

One of the important challenges for the deployment of the emerging breed of nanotechnology components is interfacing them with the external world, preferably accomplished with low-cost micro-optical devices. For the fabrication of this kind of micro-optical components, we make use of deep proton writing (DPW) as a generic rapid prototyping technology. DPW consists of bombarding polymer samples with swift protons, which results after chemical processing steps in high quality micro-optical components. The strength of the DPW micro-machining technology is the ability to fabricate monolithic building blocks that include micro-optical and mechanical functionalities which can be precisely integrated into more complex photonic systems. In this paper we give an overview of the process steps of the technology and we present several examples of micro-optical and micro-mechanical components, fabricated through DPW, targeting applications in printed circuit baordlevel optical interconnections. These include: high-precision 2-D fiber connectors, discrete out-of-plane coupling structures featuring high-quality 45° and curved micro-mirrors, arrays of high aspect ratio micro-pillars and backplane connectors. While DPW is clearly not a mass fabrication technique as such, one of its assets is that once the master component has been prototyped, a metal mould can be generated from the DPW master by applying electroplating. After removal of the plastic master, this metal mould can be used as a shim in a final microinjection moulding or hot embossing step. This way, the master component can be mass-produced at low cost in a wide variety of high-tech plastics.

Fully optical backplane system using novel optical plug and slot

NASA Astrophysics Data System (ADS)

Cho, In-Kui; Ahn, Seung-Ho; Lee, Woo-Jin; Han, Sang-Pil; Kim, Jin-Tae; Choi, Chun-Ki; Shin, Kyung-Up; Yoon, Keun Byoung; Jeong, Myung-Yung; Park, Hyo Hoon

2005-10-01

A fully optical PCB with transmitter/receiver system boards and optical bakcplane was prepared, which is board-to-board interconnection by an optical slot. We report a 10 Gb/s PRBS NRZ data transmission between transmitter system board and optical backplane embedded multimode polymeric waveguide arrays. The basic concept of the optical PCB is as follows; 1) Metal optical bench is integrated with optoelectronic devices, driver and receiver circuits, polymeric waveguide and access line PCB module. 2) Multimode polymeric waveguide inside an optical backplane, which is embedded into PCB, 3) Optical slot and plug for high-density (channel pitch : 500 um) board-to-board interconnection. The polymeric waveguide technology can be used for transmission of data between transmitter/receiver processing boards and backplane boards. The main components are low-loss tapered polymeric waveguides and a novel optical plug and slot for board-to-board interconnections, respectively. The transmitter/receiver processing boards are designed as plug types, and can be easily plugged-in and -out at an optical backplane board. The optical backplane boards are prepared by employing the lamination processes for conventional electrical PCBs. A practical optical backplane system was implemented with two processing boards and an optical backplane. As connection components between the transmitter/receiver processing boards and backplane board, optical slots made of a 90°-bending structure-embedded optical plug was used. A 10 Gb/s data link was successfully demonstrated. The bit error rate (BER) was determined and is 5.6×10 -9(@10Gb/s) and the BER of 8 Gb/s is < 10 -12.

32 x 16 CMOS smart pixel array for optical interconnects

NASA Astrophysics Data System (ADS)

Kim, Jongwoo; Guilfoyle, Peter S.; Stone, Richard V.; Hessenbruch, John M.; Choquette, Kent D.; Kiamilev, Fouad E.

2000-05-01

Free space optical interconnects can increase throughput capacities and eliminate much of the energy consumption required for `all electronic' systems. High speed optical interconnects can be achieved by integrating optoelectronic devices with conventional electronics. Smart pixel arrays have been developed which use optical interconnects. An individual smart pixel cell is composed of a vertical cavity surface emitting laser (VCSEL), a photodetector, an optical receiver, a laser driver, and digital logic circuitry. Oxide-confined VCSELs are being developed to operate at 850 nm with a threshold current of approximately 1 mA. Multiple quantum well photodetectors are being fabricated from AlGaAs for use with the 850 nm VCSELs. The VCSELs and photodetectors are being integrated with complementary metal oxide semiconductor (CMOS) circuitry using flip-chip bonding. CMOS circuitry is being integrated with a 32 X 16 smart pixel array. The 512 smart pixels are serially linked. Thus, an entire data stream may be clocked through the chip and output electrically by the last pixel. Electrical testing is being performed on the CMOS smart pixel array. Using an on-chip pseudo random number generator, a digital data sequence was cycled through the chip verifying operation of the digital circuitry. Although, the prototype chip was fabricated in 1.2 micrometers technology, simulations have demonstrated that the array can operate at 1 Gb/s per pixel using 0.5 micrometers technology.

Fiber temperature sensor with nanostructured cladding by TiO2 nanoparticles self-assembled onto a side polished optical fiber

NASA Astrophysics Data System (ADS)

Yang, Bing; Chen, Zhe; Wang, Yiting; Zhang, Jun; Liao, Guozhen; Tian, Zhengwen; Yu, Jianhui; Tang, Jieyuan; Luo, Yunhan; Lu, Huihui

2015-07-01

A temperature fiber sensor with nanostructured cladding composed ted by titanium dioxide (TiO2) nanoparticles was demonstrated. The nanoparticles self-assembled onto a side polished optical fiber (SPF). The enhancement of interaction between the propagating light and the TiO2 nanoparticles (TN) can be obtained via strong evanescent field of the SPF. The strong light-TN interaction gives rise to temperature sensing with a optical power variation of ~4dB in SPF experimentally for an environment temperature ranging from -7.8°C to 77.6°C. The novel temperature sensor shows a sensitivity of ~0.044 dB/°C. The TN-based fiber-optic temperature sensor is facile to manufactured, compatible with fiber-optic interconnections and high potential in photonics applications.

Roadmap of optical communications

NASA Astrophysics Data System (ADS)

Agrell, Erik; Karlsson, Magnus; Chraplyvy, A. R.; Richardson, David J.; Krummrich, Peter M.; Winzer, Peter; Roberts, Kim; Fischer, Johannes Karl; Savory, Seb J.; Eggleton, Benjamin J.; Secondini, Marco; Kschischang, Frank R.; Lord, Andrew; Prat, Josep; Tomkos, Ioannis; Bowers, John E.; Srinivasan, Sudha; Brandt-Pearce, Maïté; Gisin, Nicolas

2016-06-01

Lightwave communications is a necessity for the information age. Optical links provide enormous bandwidth, and the optical fiber is the only medium that can meet the modern society's needs for transporting massive amounts of data over long distances. Applications range from global high-capacity networks, which constitute the backbone of the internet, to the massively parallel interconnects that provide data connectivity inside datacenters and supercomputers. Optical communications is a diverse and rapidly changing field, where experts in photonics, communications, electronics, and signal processing work side by side to meet the ever-increasing demands for higher capacity, lower cost, and lower energy consumption, while adapting the system design to novel services and technologies. Due to the interdisciplinary nature of this rich research field, Journal of Optics has invited 16 researchers, each a world-leading expert in their respective subfields, to contribute a section to this invited review article, summarizing their views on state-of-the-art and future developments in optical communications.

Optical waveguide circuit board with a surface-mounted optical receiver array

NASA Astrophysics Data System (ADS)

Thomson, J. E.; Levesque, Harold; Savov, Emil; Horwitz, Fred; Booth, Bruce L.; Marchegiano, Joseph E.

1994-03-01

A photonic circuit board is fabricated for potential application to interchip and interboard parallel optical links. The board comprises photolithographically patterned polymer optical waveguides on a conventional glass-epoxy electrical circuit board and a surface-mounted integrated circuit (IC) package that optically and electrically couples to an optoelectronic IC. The waveguide circuits include eight-channel arrays of straights, cross-throughs, curves, self- aligning interconnects to multi-fiber ribbon, and out-of-plane turning mirrors. A coherent, fused bundle of optical fibers couples light between 45-deg waveguide mirrors and a GaAs receiver array in the IC package. The fiber bundle is easily aligned to the mirrors and the receivers and is amenable to surface mounting and hermetic sealing. The waveguide-receiver- array board achieved error-free data rates up to 1.25 Gbits/s per channel, and modal noise was shown to be negligible.

Review of Microwave Photonics Technique to Generate the Microwave Signal by Using Photonics Technology

NASA Astrophysics Data System (ADS)

Raghuwanshi, Sanjeev Kumar; Srivastav, Akash

2017-12-01

Microwave photonics system provides high bandwidth capabilities of fiber optic systems and also contains the ability to provide interconnect transmission properties, which are virtually independent of length. The low-loss wide bandwidth capability of optoelectronic systems makes them attractive for the transmission and processing of microwave signals, while the development of high-capacity optical communication systems has required the use of microwave techniques in optical transmitters and receivers. These two strands have led to the development of the research area of microwave photonics. So, we can considered microwave photonics as the field that studies the interaction between microwave and optical waves for applications such as communications, radars, sensors and instrumentations. In this paper we have thoroughly reviewed the microwave generation techniques by using photonics technology.

Rejuvenating direct modulation and direct detection for modern optical communications

NASA Astrophysics Data System (ADS)

Che, Di; Li, An; Chen, Xi; Hu, Qian; Shieh, William

2018-02-01

High-speed transoceanic optical fiber transmission using direct modulation (DM) and direct detection (DD) was one of the most stirring breakthroughs for telecommunication in 1990s, which drove the internet as a global phenomenon. However, the later evolution of optical coherent communications in 2000s gradually took over the long-haul applications, due to its superior optical spectral efficiency. Nowadays, DM-DD systems are dominant mainly in cost- and power-sensitive short-reach applications, because of its natural characteristics-the simplicity. This paper reviews the recent advances of DM-DD transceivers from both hardware and signal processing perspectives. It introduces a variety of modified DM and/or DD systems for 3 application scenarios: very-short-reach interconnect with little fiber channel impact; single or a few spans of fiber transmission up to several hundred km; and distance beyond the 2nd scenario. Besides the DM-DD and multi-dimension DM-DD with polarization diversity, this paper focuses on how to rejuvenate traditional DM and DD technologies in order to bridge the transmission application gap between DM-DD and coherent transceivers, using technologies such as dispersion compensation, signal field recovery from the intensity-only DD receiver, and complex direct modulation with coherent detection. More than 30 years since the birth, DM and DD still hold indispensable roles in modern optical communications.

3 x 3 free-space optical router based on crossbar network and its control algorithm

NASA Astrophysics Data System (ADS)

Hou, Peipei; Sun, Jianfeng; Yu, Zhou; Lu, Wei; Wang, Lijuan; Liu, Liren

2015-08-01

A 3 × 3 free-space optical router, which comprises optical switches and polarizing beam splitter (PBS) and based on crossbar network, is proposed in this paper. A control algorithm for the 3 × 3 free-space optical router is also developed to achieve rapid control without rearrangement. In order to test the performance of the network based on 3 × 3 free-space optical router and that of the algorithm developed for the optical router, experiments are designed. The experiment results show that the interconnection network based on the 3 × 3 free-space optical router has low cross talk, fast connection speed. Under the control of the algorithm developed, a non-block and real free interconnection network is obtained based on the 3 × 3 free-space optical router we proposed.

Optical interconnection for a polymeric PLC device using simple positional alignment.

PubMed

Ryu, Jin Hwa; Kim, Po Jin; Cho, Cheon Soo; Lee, El-Hang; Kim, Chang-Seok; Jeong, Myung Yung

2011-04-25

This study proposes a simple cost-effective method of optical interconnection between a planar lightwave circuit (PLC) device chip and an optical fiber. It was conducted to minimize and overcome the coupling loss caused by lateral offset which is due to the process tolerance and the dimensional limitation existing between PLC device chips and fiber array blocks with groove structures. A PLC device chip and a fiber array block were simultaneously fabricated in a series of polymer replication processes using the original master. The dimensions (i.e., width and thickness) of the under-clad of the PLC device chip were identical to those of the fiber array block. The PLC device chip and optical fiber were aligned by simple positional control for the vertical direction of the PLC device chip under a particular condition. The insertion loss of the proposed 1 x 2 multimode optical splitter device interconnection was 4.0 dB at 850 nm and the coupling loss was below 0.1 dB compared with single-fiber based active alignment.

Light coupling for on-chip optical interconnects

NASA Astrophysics Data System (ADS)

Gao, Xumin; Yuan, Jialei; Yang, Yongchao; Li, Yuanhang; Cai, Wei; Li, Xin; Wang, Yongjin

2017-12-01

An on-chip optical interconnect of a light emitter, waveguide and photodetector based on p-n junction InGaN/GaN multiple quantum wells (MQWs) is fabricated to investigate the light coupling efficiency of suspended waveguides connecting the light emitter and photodetector. Optical characterizations indicate that the photocurrent of the photodetector is mainly induced by the emitted light that is transmitted through the waveguides. Suspended waveguides with and without air gaps are reported in this paper. A 1 mA current injection into the light emitter induces a photocurrent of 17.3 nA and 205.5 nA for the photodetector connected to the waveguides that with 10 μm air gaps and without air gaps, respectively. Finite-difference time-domain simulations are performed to analyze the gap effect on the coupling efficiency of the light transmission. Both the gap distance and the index variation of the gap materials are analyzed to verify the potential optical sensing functions of the on-chip optical interconnect. A possible strategy for increasing the light coupling efficiency is proven by simulations.

Optoelectronic interconnects for 3D wafer stacks

NASA Astrophysics Data System (ADS)

Ludwig, David E.; Carson, John C.; Lome, Louis S.

1996-01-01

Wafer and chip stacking are envisioned as a means of providing increased processing power within the small confines of a three-dimensional structure. Optoelectronic devices can play an important role in these dense 3-D processing electronic packages in two ways. In pure electronic processing, optoelectronics can provide a method for increasing the number of input/output communication channels within the layers of the 3-D chip stack. Non-free space communication links allow the density of highly parallel input/output ports to increase dramatically over typical edge bus connections. In hybrid processors, where electronics and optics play a role in defining the computational algorithm, free space communication links are typically utilized for, among other reasons, the increased network link complexity which can be achieved. Free space optical interconnections provide bandwidths and interconnection complexity unobtainable in pure electrical interconnections. Stacked 3-D architectures can provide the electronics real estate and structure to deal with the increased bandwidth and global information provided by free space optical communications. This paper provides definitions and examples of 3-D stacked architectures in optoelectronics processors. The benefits and issues of these technologies are discussed.

Optoelectronic interconnects for 3D wafer stacks

NASA Astrophysics Data System (ADS)

Ludwig, David; Carson, John C.; Lome, Louis S.

1996-01-01

Wafer and chip stacking are envisioned as means of providing increased processing power within the small confines of a three-dimensional structure. Optoelectronic devices can play an important role in these dense 3-D processing electronic packages in two ways. In pure electronic processing, optoelectronics can provide a method for increasing the number of input/output communication channels within the layers of the 3-D chip stack. Non-free space communication links allow the density of highly parallel input/output ports to increase dramatically over typical edge bus connections. In hybrid processors, where electronics and optics play a role in defining the computational algorithm, free space communication links are typically utilized for, among other reasons, the increased network link complexity which can be achieved. Free space optical interconnections provide bandwidths and interconnection complexity unobtainable in pure electrical interconnections. Stacked 3-D architectures can provide the electronics real estate and structure to deal with the increased bandwidth and global information provided by free space optical communications. This paper will provide definitions and examples of 3-D stacked architectures in optoelectronics processors. The benefits and issues of these technologies will be discussed.

Preface to the special issue on ;Optical Communications Exploiting the Space Domain;

NASA Astrophysics Data System (ADS)

Wang, Jian; Yu, Siyuan; Li, Guifang

2018-02-01

The demand for high capacity optical communications will continue to be driven by the exponential growth of global internet traffic. Optical communications are about the exploitation of different physical dimensions of light waves, including complex amplitude, frequency (or wavelength), time, polarization, etc. Conventional techniques such as wavelength-division multiplexing (WDM), time-division multiplexing (TDM) and polarization-division multiplexing (PDM) have almost reached their scalability limits. Space domain is the only known physical dimension left and space-division multiplexing (SDM) seems the only option to further scale the transmission capacity and spectral efficiency of optical communications. In recent years, few-mode fiber (FMF), multi-mode fiber (MMF), multi-core fiber (MCF) and few-mode multi-core fiber (FM-MCF) have been widely explored as promising candidates for fiber-based SDM. The challenges for SDM include efficient (de)multiplexer, amplifiers, and multiple-input multiple-output (MIMO) digital signal processing (DSP) techniques. Photonic integration will also be a key technology to SDM. Meanwhile, free-space and underwater optical communications have also exploited the space domain to increase the transmission capacity and spectral efficiency. The challenges include long-distance transmission limited by propagation loss, divergence, scattering and turbulence. Very recently, helically phased light beams carrying orbital angular momentum (OAM) have also seen potential applications both in free-space, underwater and fiber-based optical communications. Actually, different mode bases such as linearly polarized (LP) modes and OAM modes can be employed for SDM. Additionally, SDM could be used in chip-scale photonic interconnects and data center optical interconnects. Quantum processing exploiting the space domain is of great interest. The information capacity limit and physical layer security in SDM optical communications systems are important issues to be addressed.

Graphene-Boron Nitride Heterostructure Based Optoelectronic Devices for On-Chip Optical Interconnects

NASA Astrophysics Data System (ADS)

Gao, Yuanda

Graphene has emerged as an appealing material for a variety of optoelectronic applications due to its unique electrical and optical characteristics. In this thesis, I will present recent advances in integrating graphene and graphene-boron nitride (BN) heterostructures with confined optical architectures, e.g. planar photonic crystal (PPC) nanocavities and silicon channel waveguides, to make this otherwise weakly absorbing material optically opaque. Based on these integrations, I will further demonstrate the resulting chip-integrated optoelectronic devices for optical interconnects. After transferring a layer of graphene onto PPC nanocavities, spectral selectivity at the resonance frequency and orders-of-magnitude enhancement of optical coupling with graphene have been observed in infrared spectrum. By applying electrostatic potential to graphene, electro-optic modulation of the cavity reflection is possible with contrast in excess of 10 dB. And furthermore, a novel and complex modulator device structure based on the cavity-coupled and BN-encapsulated dual-layer graphene capacitor is demonstrated to operate at a speed of 1.2 GHz. On the other hand, an enhanced broad-spectrum light-graphene interaction coupled with silicon channel waveguides is also demonstrated with ?0.1 dB/?m transmission attenuation due to graphene absorption. A waveguide-integrated graphene photodetector is fabricated and shown 0.1 A/W photoresponsivity and 20 GHz operation speed. An improved version of a similar photodetector using graphene-BN heterostructure exhibits 0.36 A/W photoresponsivity and 42 GHz response speed. The integration of graphene and graphene-BN heterostructures with nanophotonic architectures promises a new generation of compact, energy-efficient, high-speed optoelectronic device concepts for on-chip optical communications that are not yet feasible or very difficult to realize using traditional bulk semiconductors.

Low-power, transparent optical network interface for high bandwidth off-chip interconnects.

PubMed

Liboiron-Ladouceur, Odile; Wang, Howard; Garg, Ajay S; Bergman, Keren

2009-04-13

The recent emergence of multicore architectures and chip multiprocessors (CMPs) has accelerated the bandwidth requirements in high-performance processors for both on-chip and off-chip interconnects. For next generation computing clusters, the delivery of scalable power efficient off-chip communications to each compute node has emerged as a key bottleneck to realizing the full computational performance of these systems. The power dissipation is dominated by the off-chip interface and the necessity to drive high-speed signals over long distances. We present a scalable photonic network interface approach that fully exploits the bandwidth capacity offered by optical interconnects while offering significant power savings over traditional E/O and O/E approaches. The power-efficient interface optically aggregates electronic serial data streams into a multiple WDM channel packet structure at time-of-flight latencies. We demonstrate a scalable optical network interface with 70% improvement in power efficiency for a complete end-to-end PCI Express data transfer.

Multimode fiber for high-density optical interconnects

NASA Astrophysics Data System (ADS)

Bickham, Scott R.; Ripumaree, Radawan; Chalk, Julie A.; Paap, Mark T.; Hurley, William C.; McClure, Randy L.

2017-02-01

Data centers (DCs) are facing the challenge of delivering more capacity over longer distances. As line rates increase to 25 Gb/s and higher, DCs are being challenged with signal integrity issues due to the long electrical traces that require retiming. In addition, the density of interconnects on the front panel is limited by the size and power dissipation requirements of the pluggable modules. One proposal to overcome these issues is to use embedded optical transceivers in which optical fibers are used to transport data to and from the front panel. These embedded modules will utilize arrays of VCSEL or silicon-photonic transceivers, and in both cases, the capacity may be limited by the density of the optical connections on the chip. To address this constraint, we have prototyped optical fibers in which the glass and coating diameters are reduced to 80 and 125 microns, respectively. These smaller diameters enable twice as many optical interconnects in the same footprint, and this in turn will allow the transceiver arrays to be collinearly located on small chips with dimensions on the order of (5x5mm2)1,2. We have also incorporated these reduced diameter fibers into small, flexible 8-fiber ribbon cables which can simplify routing constraints inside modules and optical backplanes.

Polymer waveguides for electro-optical integration in data centers and high-performance computers.

PubMed

Dangel, Roger; Hofrichter, Jens; Horst, Folkert; Jubin, Daniel; La Porta, Antonio; Meier, Norbert; Soganci, Ibrahim Murat; Weiss, Jonas; Offrein, Bert Jan

2015-02-23

To satisfy the intra- and inter-system bandwidth requirements of future data centers and high-performance computers, low-cost low-power high-throughput optical interconnects will become a key enabling technology. To tightly integrate optics with the computing hardware, particularly in the context of CMOS-compatible silicon photonics, optical printed circuit boards using polymer waveguides are considered as a formidable platform. IBM Research has already demonstrated the essential silicon photonics and interconnection building blocks. A remaining challenge is electro-optical packaging, i.e., the connection of the silicon photonics chips with the system. In this paper, we present a new single-mode polymer waveguide technology and a scalable method for building the optical interface between silicon photonics chips and single-mode polymer waveguides.

Fast and Scalable Fabrication of Microscopic Optical Surfaces and its Application for Optical Interconnect Devices

NASA Astrophysics Data System (ADS)

Summitt, Christopher Ryan

The use of optical interconnects is a promising solution to the increasing demand for high speed mass data transmission used in integrated circuits as well as device to device data transfer applications. For the purpose, low cost polymer waveguides are a popular choice for routing signal between devices due to their compatibility with printed circuit boards. In optical interconnect, coupling from an external light source to such waveguides is a critical step, thus a variety of couplers have been investigated such as grating based couplers [1,2], evanescent couplers [3], and embedded mirrors [4-6]. These couplers are inherently micro-optical components which require fast and scalable fabrication for mass production with optical quality surfaces/structures. Low NA laser direct writing has been used for fast fabrication of structures such as gratings and Fresnel lenses using a linear laser direct writing scheme, though the length scale of such structures are an order of magnitude larger than the spot size of the focused laser of the tool. Nonlinear writing techniques such as with 2-photon absorption offer increased write resolution which makes it possible to fabricate sub-wavelength structures as well as having a flexibility in feature shape. However it does not allow a high speed fabrication and in general are not scalable due to limitations of speed and area induced by the tool's high NA optics. To overcome such limitations primarily imposed by NA, we propose a new micro-optic fabrication process which extends the capabilities of 1D, low NA, and thus fast and scalable, laser direct writing to fabricate a structure having a length scale close to the tool's spot size, for example, a mirror based and 45 degree optical coupler with optical surface quality. The newly developed process allows a high speed fabrication with a write speed of 2600 mm²/min by incorporating a mask based lithography method providing a blank structure which is critical to creating a 45 degree slope to form the coupler surface. In this method, instead of using an entire exposure in a pixelated manner, only a portion of the Gaussian profile is used, allowing a reduced surface roughness and better control of the surface shape than previously possible with this low NA beam. The surface figure of the mirror is well controlled below 0.04 waves in root-mean-square (RMS) at 1.55 mum wavelength, with mirror angle of 45+/-1 degrees. The coupling efficiency is evaluated using a set of polymer waveguides fabricated on the same substrate as the complete proof of concept device. Device insertion loss was measured using a custom built optical test station and a detailed loss analysis was completed to characterize the optical coupling efficiency of the mirror. Surface roughness and angle were also experimentally confirmed. This process opens up a pathway towards large volume fabrication of free-form and high aspect ratio optical components which have not yet pursued, along with well-defined optical structures on a single substrate. In this dissertation, in Chapter 1, we provide an overview of optical surface fabrication in conjunction with current state of the art on fabrication of free form surfaces in macro and microscopic length scale. The need for optical interconnects is introduced and fabrication methods of micro-optical couplers are reviewed in Chapter 2. In Chapter 3, the complete fabrication process of a mirror based coupler is presented including a custom alignment procedure. In Chapter 4, we provide the integration procedure of the optical couplers with waveguides. In Chapter 5, the alignment of two-lithographic methods is discussed. In Chapter 6, we provide the fabrication procedure used for the waveguides. In Chapter 7, the experimental evaluation and testing of the optical coupler is described. We present a custom test station used for angle verification and optical coupler efficiency measurement. In Chapter 8, a detailed loss analysis of the device is presented including suggestions for future reductions in loss. Conclusions and future work considerations are addressed in Chapter 9.

A Fully Implemented 12 × 12 Data Vortex Optical Packet Switching Interconnection Network

NASA Astrophysics Data System (ADS)

Shacham, Assaf; Small, Benjamin A.; Liboiron-Ladouceur, Odile; Bergman, Keren

2005-10-01

A fully functional optical packet switching (OPS) interconnection network based on the data vortex architecture is presented. The photonic switching fabric uniquely capitalizes on the enormous bandwidth advantage of wavelength division multiplexing (WDM) wavelength parallelism while delivering minimal packet transit latency. Utilizing semiconductor optical amplifier (SOA)-based switching nodes and conventional fiber-optic technology, the 12-port system exhibits a capacity of nearly 1 Tb/s. Optical packets containing an eight-wavelength WDM payload with 10 Gb/s per wavelength are routed successfully to all 12 ports while maintaining a bit error rate (BER) of 10-12 or better. Median port-to-port latencies of 110 ns are achieved with a distributed deflection routing network that resolves packet contention on-the-fly without the use of optical buffers and maintains the entire payload path in the optical domain.

Low threshold all-optical crossbar switch on GaAs-GaAlAs channel waveguide arrays

NASA Astrophysics Data System (ADS)

Jannson, Tomasz; Kostrzewski, Andrew

1994-09-01

During the Phase 2 project entitled 'Low Threshold All-Optical Crossbar Switch on GaAs - GaAlAs Channel Waveguide Array,' Physical Optics Corporation (POC) developed the basic principles for the fabrication of all-optical crossbar switches. Based on this development. POC fabricated a 2 x 2 GaAs/GaAlAs switch that changes the direction of incident light with minimum insertion loss and nonlinear distortion. This unique technology can be used in both analog and digital networks. The applications of this technology are widespread. Because the all-optical network does not have any speed limitations (RC time constant), POC's approach will be beneficial to SONET networks, phased array radar networks, very high speed oscilloscopes, all-optical networks, IR countermeasure systems, BER equipment, and the fast growing video conferencing network market. The novel all-optical crossbar switch developed in this program will solve interconnect problems. and will be a key component in the widely proposed all-optical 200 Gb/s SONET/ATM networks.

Design Sketches For Optical Crossbar Switches Intended For Large-Scale Parallel Processing Applications

NASA Astrophysics Data System (ADS)

Hartmann, Alfred; Redfield, Steve

1989-04-01

This paper discusses design of large-scale (1000x 1000) optical crossbar switching networks for use in parallel processing supercom-puters. Alternative design sketches for an optical crossbar switching network are presented using free-space optical transmission with either a beam spreading/masking model or a beam steering model for internodal communications. The performances of alternative multiple access channel communications protocol-unslotted and slotted ALOHA and carrier sense multiple access (CSMA)-are compared with the performance of the classic arbitrated bus crossbar of conventional electronic parallel computing. These comparisons indicate an almost inverse relationship between ease of implementation and speed of operation. Practical issues of optical system design are addressed, and an optically addressed, composite spatial light modulator design is presented for fabrication to arbitrarily large scale. The wide range of switch architecture, communications protocol, optical systems design, device fabrication, and system performance problems presented by these design sketches poses a serious challenge to practical exploitation of highly parallel optical interconnects in advanced computer designs.

Porous silicon based micro-opto-electro-mechanical-systems (MOEMS) components for free space optical interconnects

NASA Astrophysics Data System (ADS)

Song, Da

2008-02-01

One of the major challenges confronting the current integrated circuits (IC) industry is the metal "interconnect bottleneck". To overcome this obstacle, free space optical interconnects (FSOIs) can be used to address the demand for high speed data transmission, multi-functionality and multi-dimensional integration for the next generation IC. One of the crucial elements in FSOIs system is to develop a high performance and flexible optical network to transform the incoming optical signal into a distributed set of optical signals whose direction, alignment and power can be independently controlled. Among all the optical materials for the realization of FSOI components, porous silicon (PSi) is one of the most promising candidates because of its unique optical properties, flexible fabrication methods and integration with conventional IC material sets. PSi-based Distributed Bragg Reflector (DBR) and Fabry-Perot (F-P) structures with unique optical properties are realized by electrochemical etching of silicon. By incorporating PSi optical structures with Micro-Opto-Electro-Mechanical-Systems (MOEMS), several components required for FSOI have been developed. The first type of component is the out-of-plane freestanding optical switch. Implementing a PSi DBR structure as an optically active region, the device can realize channel selection by changing the tilting angle of the micromirror supported by the thermal bimorph actuator. All the fabricated optical switches have reached kHz working frequency and life time of millions of cycles. The second type of component is the in-plane tunable optical filter. By introducing PSi F-P structure into the in-plane PSi film, a thermally tunable optical filter with a sensitivity of 7.9nm/V has been realized for add/drop optical signal selection. Also, for the first time, a new type of PSi based reconfigurable diffractive optical element (DOE) has been developed. By using patterned photoresist as a protective mask for electrochemical etching, the freestanding PSi-based MOEMS DOE has been created as a beam splitter to redistribute the incoming optical signal with onto desired detector arrays. All the developed devices are realized in array fashion and can be addressed and controlled individually. The combination of PSi and MOEMS opens the door for a new generation of silicon compatible optical interconnects.

Two-dimensional optoelectronic interconnect-processor and its operational bit error rate

NASA Astrophysics Data System (ADS)

Liu, J. Jiang; Gollsneider, Brian; Chang, Wayne H.; Carhart, Gary W.; Vorontsov, Mikhail A.; Simonis, George J.; Shoop, Barry L.

2004-10-01

Two-dimensional (2-D) multi-channel 8x8 optical interconnect and processor system were designed and developed using complementary metal-oxide-semiconductor (CMOS) driven 850-nm vertical-cavity surface-emitting laser (VCSEL) arrays and the photodetector (PD) arrays with corresponding wavelengths. We performed operation and bit-error-rate (BER) analysis on this free-space integrated 8x8 VCSEL optical interconnects driven by silicon-on-sapphire (SOS) circuits. Pseudo-random bit stream (PRBS) data sequence was used in operation of the interconnects. Eye diagrams were measured from individual channels and analyzed using a digital oscilloscope at data rates from 155 Mb/s to 1.5 Gb/s. Using a statistical model of Gaussian distribution for the random noise in the transmission, we developed a method to compute the BER instantaneously with the digital eye-diagrams. Direct measurements on this interconnects were also taken on a standard BER tester for verification. We found that the results of two methods were in the same order and within 50% accuracy. The integrated interconnects were investigated in an optoelectronic processing architecture of digital halftoning image processor. Error diffusion networks implemented by the inherently parallel nature of photonics promise to provide high quality digital halftoned images.

On-chip spin-controlled orbital angular momentum directional coupling

NASA Astrophysics Data System (ADS)

Xie, Zhenwei; Lei, Ting; Si, Guangyuan; Du, Luping; Lin, Jiao; Min, Changjun; Yuan, Xiaocong

2018-01-01

Optical vortex beams have many potential applications in the particle trapping, quantum encoding, optical orbital angular momentum (OAM) communications and interconnects. However, the on-chip compact OAM detection is still a big challenge. Based on a holographic configuration and a spin-dependent structure design, we propose and demonstrate an on-chip spin-controlled OAM-mode directional coupler, which can couple the OAM signal to different directions due to its topological charge. While the directional coupling function can be switched on/off by altering the spin of incident beam. Both simulation and experimental measurements verify the validity of the proposed approach. This work would benefit the on-chip OAM devices for optical communications and high dimensional quantum coding/decoding in the future.

Improvement of multiprocessing performance by using optical centralized shared bus

NASA Astrophysics Data System (ADS)

Han, Xuliang; Chen, Ray T.

2004-06-01

With the ever-increasing need to solve larger and more complex problems, multiprocessing is attracting more and more research efforts. One of the challenges facing the multiprocessor designers is to fulfill in an effective manner the communications among the processes running in parallel on multiple multiprocessors. The conventional electrical backplane bus provides narrow bandwidth as restricted by the physical limitations of electrical interconnects. In the electrical domain, in order to operate at high frequency, the backplane topology has been changed from the simple shared bus to the complicated switched medium. However, the switched medium is an indirect network. It cannot support multicast/broadcast as effectively as the shared bus. Besides the additional latency of going through the intermediate switching nodes, signal routing introduces substantial delay and considerable system complexity. Alternatively, optics has been well known for its interconnect capability. Therefore, it has become imperative to investigate how to improve multiprocessing performance by utilizing optical interconnects. From the implementation standpoint, the existing optical technologies still cannot fulfill the intelligent functions that a switch fabric should provide as effectively as their electronic counterparts. Thus, an innovative optical technology that can provide sufficient bandwidth capacity, while at the same time, retaining the essential merits of the shared bus topology, is highly desirable for the multiprocessing performance improvement. In this paper, the optical centralized shared bus is proposed for use in the multiprocessing systems. This novel optical interconnect architecture not only utilizes the beneficial characteristics of optics, but also retains the desirable properties of the shared bus topology. Meanwhile, from the architecture standpoint, it fits well in the centralized shared-memory multiprocessing scheme. Therefore, a smooth migration with substantial multiprocessing performance improvement is expected. To prove the technical feasibility from the architecture standpoint, a conceptual emulation of the centralized shared-memory multiprocessing scheme is demonstrated on a generic PCI subsystem with an optical centralized shared bus.

Gateway design specification for fiber optic local area networks

NASA Technical Reports Server (NTRS)

1985-01-01

This is a Design Specification for a gateway to interconnect fiber optic local area networks (LAN's). The internetworking protocols for a gateway device that will interconnect multiple local area networks are defined. This specification serves as input for preparation of detailed design specifications for the hardware and software of a gateway device. General characteristics to be incorporated in the gateway such as node address mapping, packet fragmentation, and gateway routing features are described.

Comparison of two reconfigurable N×N interconnects for a recurrent neural network

NASA Astrophysics Data System (ADS)

Berger, Christoph; Collings, Neil; Pourzand, Ali R.; Volkel, Reinnard

1996-11-01

Two different methods of pattern replication (conventional and interlaced fan-out) have been investigated and experimentally tested in a reconfigurable 5X5 optical interconnect. Similar alignment problems due to imaging errors (field curvature) were observed in both systems. We conclude that of the two methods the interlaced fan-out is better suited to avoid these imaging errors, to reduce system size and to implement an optical feedback loop.

Optical interconnection network for parallel access to multi-rank memory in future computing systems.

PubMed

Wang, Kang; Gu, Huaxi; Yang, Yintang; Wang, Kun

2015-08-10

With the number of cores increasing, there is an emerging need for a high-bandwidth low-latency interconnection network, serving core-to-memory communication. In this paper, aiming at the goal of simultaneous access to multi-rank memory, we propose an optical interconnection network for core-to-memory communication. In the proposed network, the wavelength usage is delicately arranged so that cores can communicate with different ranks at the same time and broadcast for flow control can be achieved. A distributed memory controller architecture that works in a pipeline mode is also designed for efficient optical communication and transaction address processes. The scaling method and wavelength assignment for the proposed network are investigated. Compared with traditional electronic bus-based core-to-memory communication, the simulation results based on the PARSEC benchmark show that the bandwidth enhancement and latency reduction are apparent.

Elastic all-optical multi-hop interconnection in data centers with adaptive spectrum allocation

NASA Astrophysics Data System (ADS)

Hong, Yuanyuan; Hong, Xuezhi; Chen, Jiajia; He, Sailing

2017-01-01

In this paper, a novel flex-grid all-optical interconnect scheme that supports transparent multi-hop connections in data centers is proposed. An inter-rack all-optical multi-hop connection is realized with an optical loop employed at flex-grid wavelength selective switches (WSSs) in an intermediate rack rather than by relaying through optical-electric-optical (O-E-O) conversions. Compared with the conventional O-E-O based approach, the proposed all-optical scheme is able to off-load the traffic at intermediate racks, leading to a reduction of the power consumption and cost. The transmission performance of the proposed flex-grid multi-hop all-optical interconnect scheme with various modulation formats, including both coherently detected and directly detected approaches, are investigated by Monte-Carlo simulations. To enhance the spectrum efficiency (SE), number-of-hop adaptive bandwidth allocation is introduced. Numerical results show that the SE can be improved by up to 33.3% at 40 Gbps, and by up to 25% at 100 Gbps. The impact of parameters, such as targeted bit error rate (BER) level and insertion loss of components, on the transmission performance of the proposed approach are also explored. The results show that the maximum SE improvement of the adaptive approach over the non-adaptive one is enhanced with the decrease of the targeted BER levels and the component insertion loss.

Thick-SOI Echelle grating for any-to-any wavelength routing interconnection in multi-socket computing environments

NASA Astrophysics Data System (ADS)

Dabos, G.; Pitris, S.; Mitsolidou, C.; Alexoudi, T.; Fitsios, D.; Cherchi, M.; Harjanne, M.; Aalto, T.; Kanellos, G. T.; Pleros, N.

2017-02-01

As data centers constantly expand, electronic switches are facing the challenge of enhanced scalability and the request for increased pin-count and bandwidth. Photonic technology and wavelength division multiplexing have always been a strong alternative for efficient routing and their potential was already proven in the telecoms. CWDM transceivers have emerged in the board-to-board level interconnection, revealing the potential for wavelength-routing to be applied in the datacom and an AWGR-based approach has recently been proposed towards building an optical multi-socket interconnection to offer any-to-any connectivity with high aggregated throughput and reduced power consumption. Echelle gratings have long been recognized as the multiplexing block exhibiting smallest footprint and robustness in a wide number of applications compared to other alternatives such as the Arrayed Waveguide Grating. Such filtering devices can also perform in a similar way to cyclical AWGR and serve as mid-board routing platforms in multi-socket environments. In this communication, we present such a 3x3 Echelle grating integrated on thick SOI platform with aluminum-coated facets that is shown to perform successful wavelength-routing functionality at 10 Gb/s. The device exhibits a footprint of 60x270 μm2, while the static characterization showed a 3 dB on-chip loss for the best channel. The 3 dB-bandwidth of the channels was 4.5 nm and the free spectral range was 90 nm. The echelle was evaluated in a 2x2 wavelength routing topology, exhibiting a power penalty of below 0.4 dB at 10-9 BER for the C-band. Further experimental evaluations of the platform involve commercially available CWDM datacenter transceivers, towards emulating an optically-interconnected multi-socket environment traffic scenario.

Monolithically mode division multiplexing photonic integrated circuit for large-capacity optical interconnection.

PubMed

Chen, Guanyu; Yu, Yu; Zhang, Xinliang

2016-08-01

We propose and fabricate an on-chip mode division multiplexed (MDM) photonic interconnection system. Such a monolithically photonic integrated circuit (PIC) is composed of a grating coupler, two micro-ring modulators, mode multiplexer/demultiplexer, and two germanium photodetectors. The signals' generation, multiplexing, transmission, demultiplexing, and detection are successfully demonstrated on the same chip. Twenty Gb/s MDM signals are successfully processed with clear and open eye diagrams, validating the feasibility of the proposed circuit. The measured power penalties show a good performance of the MDM link. The proposed on-chip MDM system can be potentially used for large-capacity optical interconnection in future high-performance computers and big data centers.

Hybridization of active and passive elements for planar photonic components and interconnects

NASA Astrophysics Data System (ADS)

Pearson, M.; Bidnyk, S.; Balakrishnan, A.

2007-02-01

The deployment of Passive Optical Networks (PON) for Fiber-to-the-Home (FTTH) applications currently represents the fastest growing sector of the telecommunication industry. Traditionally, FTTH transceivers have been manufactured using commodity bulk optics subcomponents, such as thin film filters (TFFs), micro-optic collimating lenses, TO-packaged lasers, and photodetectors. Assembling these subcomponents into a single housing requires active alignment and labor-intensive techniques. Today, the majority of cost reducing strategies using bulk subcomponents has been implemented making future reductions in the price of manufacturing FTTH transceivers unlikely. Future success of large scale deployments of FTTH depends on further cost reductions of transceivers. Realizing the necessity of a radically new packaging approach for assembly of photonic components and interconnects, we designed a novel way of hybridizing active and passive elements into a planar lightwave circuit (PLC) platform. In our approach, all the filtering components were monolithically integrated into the chip using advancements in planar reflective gratings. Subsequently, active components were passively hybridized with the chip using fully-automated high-capacity flip-chip bonders. In this approach, the assembly of the transceiver package required no active alignment and was readily suitable for large-scale production. This paper describes the monolithic integration of filters and hybridization of active components in both silica-on-silicon and silicon-on-insulator PLCs.

Low-voltage high-performance silicon photonic devices and photonic integrated circuits operating up to 30 Gb/s.

PubMed

Kim, Gyungock; Park, Jeong Woo; Kim, In Gyoo; Kim, Sanghoon; Kim, Sanggi; Lee, Jong Moo; Park, Gun Sik; Joo, Jiho; Jang, Ki-Seok; Oh, Jin Hyuk; Kim, Sun Ae; Kim, Jong Hoon; Lee, Jun Young; Park, Jong Moon; Kim, Do-Won; Jeong, Deog-Kyoon; Hwang, Moon-Sang; Kim, Jeong-Kyoum; Park, Kyu-Sang; Chi, Han-Kyu; Kim, Hyun-Chang; Kim, Dong-Wook; Cho, Mu Hee

2011-12-19

We present high performance silicon photonic circuits (PICs) defined for off-chip or on-chip photonic interconnects, where PN depletion Mach-Zehnder modulators and evanescent-coupled waveguide Ge-on-Si photodetectors were monolithically integrated on an SOI wafer with CMOS-compatible process. The fabricated silicon PIC(off-chip) for off-chip optical interconnects showed operation up to 30 Gb/s. Under differential drive of low-voltage 1.2 V(pp), the integrated 1 mm-phase-shifter modulator in the PIC(off-chip) demonstrated an extinction ratio (ER) of 10.5dB for 12.5 Gb/s, an ER of 9.1dB for 20 Gb/s, and an ER of 7.2 dB for 30 Gb/s operation, without adoption of travelling-wave electrodes. The device showed the modulation efficiency of V(π)L(π) ~1.59 Vcm, and the phase-shifter loss of 3.2 dB/mm for maximum optical transmission. The Ge photodetector, which allows simpler integration process based on reduced pressure chemical vapor deposition exhibited operation over 30 Gb/s with a low dark current of 700 nA at -1V. The fabricated silicon PIC(intra-chip) for on-chip (intra-chip) photonic interconnects, where the monolithically integrated modulator and Ge photodetector were connected by a silicon waveguide on the same chip, showed on-chip data transmissions up to 20 Gb/s, indicating potential application in future silicon on-chip optical network. We also report the performance of the hybrid silicon electronic-photonic IC (EPIC), where a PIC(intra-chip) chip and 0.13μm CMOS interface IC chips were hybrid-integrated.

MO detector (MOD): a dual-function optical modulator-detector for on-chip communication

NASA Astrophysics Data System (ADS)

Sun, Shuai; Zhang, Ruoyu; Peng, Jiaxin; Narayana, Vikram K.; Dalir, Hamed; El-Ghazawi, Tarek; Sorger, Volker J.

2018-04-01

Physical challenges at the device and interconnect level limit both network and computing energy efficiency. While photonics is being considered to address interconnect bottlenecks, optical routing is still limited by electronic circuitry, requiring substantial overhead for optical-electrical-optical conversion. Here we show a novel design of an integrated broadband photonic-plasmonic hybrid device termed MODetector featuring dual light modulation and detection function to act as an optical transceiver in the photonic network-on-chip. With over 10 dB extinction ratio and 0.8 dB insertion loss at the modulation state, this MODetector provides 0.7 W/A responsivity in the detection state with 36 ps response time. This multi-functional device: (i) eliminates OEO conversion, (ii) reduces optical losses from photodetectors when not needed, and (iii) enables cognitive routing strategies for network-on-chips.

Monolithic optoelectronic integrated broadband optical receiver with graphene photodetectors

NASA Astrophysics Data System (ADS)

Cheng, Chuantong; Huang, Beiju; Mao, Xurui; Zhang, Zanyun; Zhang, Zan; Geng, Zhaoxin; Xue, Ping; Chen, Hongda

2017-07-01

Optical receivers with potentially high operation bandwidth and low cost have received considerable interest due to rapidly growing data traffic and potential Tb/s optical interconnect requirements. Experimental realization of 65 GHz optical signal detection and 262 GHz intrinsic operation speed reveals the significance role of graphene photodetectors (PDs) in optical interconnect domains. In this work, a novel complementary metal oxide semiconductor post-backend process has been developed for integrating graphene PDs onto silicon integrated circuit chips. A prototype monolithic optoelectronic integrated optical receiver has been successfully demonstrated for the first time. Moreover, this is a firstly reported broadband optical receiver benefiting from natural broadband light absorption features of graphene material. This work is a perfect exhibition of the concept of monolithic optoelectronic integration and will pave way to monolithically integrated graphene optoelectronic devices with silicon ICs for three-dimensional optoelectronic integrated circuit chips.

A fast low-power optical memory based on coupled micro-ring lasers

NASA Astrophysics Data System (ADS)

Hill, Martin T.; Dorren, Harmen J. S.; de Vries, Tjibbe; Leijtens, Xaveer J. M.; den Besten, Jan Hendrik; Smalbrugge, Barry; Oei, Yok-Siang; Binsma, Hans; Khoe, Giok-Djan; Smit, Meint K.

2004-11-01

The increasing speed of fibre-optic-based telecommunications has focused attention on high-speed optical processing of digital information. Complex optical processing requires a high-density, high-speed, low-power optical memory that can be integrated with planar semiconductor technology for buffering of decisions and telecommunication data. Recently, ring lasers with extremely small size and low operating power have been made, and we demonstrate here a memory element constructed by interconnecting these microscopic lasers. Our device occupies an area of 18 × 40µm2 on an InP/InGaAsP photonic integrated circuit, and switches within 20ps with 5.5fJ optical switching energy. Simulations show that the element has the potential for much smaller dimensions and switching times. Large numbers of such memory elements can be densely integrated and interconnected on a photonic integrated circuit: fast digital optical information processing systems employing large-scale integration should now be viable.

Optical interconnects based on VCSELs and low-loss silicon photonics

NASA Astrophysics Data System (ADS)

Aalto, Timo; Harjanne, Mikko; Karppinen, Mikko; Cherchi, Matteo; Sitomaniemi, Aila; Ollila, Jyrki; Malacarne, Antonio; Neumeyr, Christian

2018-02-01

Silicon photonics with micron-scale Si waveguides offers most of the benefits of submicron SOI technology while avoiding most of its limitations. In particular, thick silicon-on-insulator (SOI) waveguides offer 0.1 dB/cm propagation loss, polarization independency, broadband single-mode (SM) operation from 1.2 to >4 µm wavelength and ability to transmit high optical powers (>1 W). Here we describe the feasibility of Thick-SOI technology for advanced optical interconnects. With 12 μm SOI waveguides we demonstrate efficient coupling between standard single-mode fibers, vertical-cavity surface-emitting lasers (VCSELs) and photodetectors (PDs), as well as wavelength multiplexing in small footprint. Discrete VCSELs and PDs already support 28 Gb/s on-off keying (OOK), which shows a path towards 50-100 Gb/s bandwidth per wavelength by using more advanced modulation formats like PAM4. Directly modulated VCSELs enable very power-efficient optical interconnects for up to 40 km distance. Furthermore, with 3 μm SOI waveguides we demonstrate extremely dense and low-loss integration of numerous optical functions, such as multiplexers, filters, switches and delay lines. Also polarization independent and athermal operation is demonstrated. The latter is achieved by using short polymer waveguides to compensate for the thermo-optic effect in silicon. New concepts for isolator integration and polarization rotation are also explained.

Experimental demonstration of the optical multi-mesh hypercube: scaleable interconnection network for multiprocessors and multicomputers.

PubMed

Louri, A; Furlonge, S; Neocleous, C

1996-12-10

A prototype of a novel topology for scaleable optical interconnection networks called the optical multi-mesh hypercube (OMMH) is experimentally demonstrated to as high as a 150-Mbit/s data rate (2(7) - 1 nonreturn-to-zero pseudo-random data pattern) at a bit error rate of 10(-13)/link by the use of commercially available devices. OMMH is a scaleable network [Appl. Opt. 33, 7558 (1994); J. Lightwave Technol. 12, 704 (1994)] architecture that combines the positive features of the hypercube (small diameter, connectivity, symmetry, simple routing, and fault tolerance) and the mesh (constant node degree and size scaleability). The optical implementation method is divided into two levels: high-density local connections for the hypercube modules, and high-bit-rate, low-density, long connections for the mesh links connecting the hypercube modules. Free-space imaging systems utilizing vertical-cavity surface-emitting laser (VCSEL) arrays, lenslet arrays, space-invariant holographic techniques, and photodiode arrays are demonstrated for the local connections. Optobus fiber interconnects from Motorola are used for the long-distance connections. The OMMH was optimized to operate at the data rate of Motorola's Optobus (10-bit-wide, VCSEL-based bidirectional data interconnects at 150 Mbits/s). Difficulties encountered included the varying fan-out efficiencies of the different orders of the hologram, misalignment sensitivity of the free-space links, low power (1 mW) of the individual VCSEL's, and noise.

Novel Three-Dimensional Vertical Interconnect Technology for Microwave and RF Applications

NASA Technical Reports Server (NTRS)

Goverdhanam, Kavita; Simons, Rainee N.; Katehi, Linda P. B.

1999-01-01

In this paper, novel 3D interconnects suitable for applications in microwave and RF integrated circuit technology have been presented. The interconnect fabrication process and design details are presented. In addition, measured and numerically modeled results of the performance of the interconnects have been shown. The results indicate that the proposed technology has tremendous potential applications in integrated circuit technology. C,

A new perspective on plasmonics: Confinement and propagation length of surface plasmons for different materials and geometries [A new perspective on materials for plasmonics

DOE PAGES

Dastmalchi, Babak; Tassin, Philippe; Koschny, Thomas; ...

2015-09-21

Surface-plasmon polaritons are electromagnetic waves propagating on the surface of a metal. Thanks to subwavelength confinement, they can concentrate optical energy on the micrometer or even nanometer scale, enabling new applications in bio-sensing, optical interconnects, and nonlinear optics, where small footprint and strong field concentration are essential. The major obstacle in developing plasmonic applications is dissipative loss, which limits the propagation length of surface plasmons and broadens the bandwidth of surface-plasmon resonances. Here, a new analysis of plasmonic materials and geometries is presented which fully considers the tradeoff between propagation length and degree of confinement. It is based on amore » two-dimensional analysis of two independent figures of merit and the analysis is applied to relevant plasmonic materials, e.g., noble metals, aluminum, silicon carbide, doped semiconductors, graphene, etc. Furthermore, the analysis provides guidance on how to improve the performance of any particular plasmonic application and substantially eases the selection of the plasmonic material.« less

76 FR 53672 - Combined Notice of Filings #2

Federal Register 2010, 2011, 2012, 2013, 2014

2011-08-29

.... Applicants: PJM Interconnection, L.L.C. Description: PJM Interconnection, L.L.C. submits tariff filing per 35... Time on Monday, September 12, 2011. Docket Numbers: ER11-4343-000. Applicants: PJM Interconnection, L.L.C. Description: PJM Interconnection, L.L.C. submits tariff filing per 35.13(a)(2)(iii: Certificate...

Optical links in handheld multimedia devices

NASA Astrophysics Data System (ADS)

van Geffen, S.; Duis, J.; Miller, R.

2008-04-01

Ever emerging applications in handheld multimedia devices such as mobile phones, laptop computers, portable video games and digital cameras requiring increased screen resolutions are driving higher aggregate bitrates between host processor and display(s) enabling services such as mobile video conferencing, video on demand and TV broadcasting. Larger displays and smaller phones require complex mechanical 3D hinge configurations striving to combine maximum functionality with compact building volumes. Conventional galvanic interconnections such as Micro-Coax and FPC carrying parallel digital data between host processor and display module may produce Electromagnetic Interference (EMI) and bandwidth limitations caused by small cable size and tight cable bends. To reduce the number of signals through a hinge, the mobile phone industry, organized in the MIPI (Mobile Industry Processor Interface) alliance, is currently defining an electrical interface transmitting serialized digital data at speeds >1Gbps. This interface allows for electrical or optical interconnects. Above 1Gbps optical links may offer a cost effective alternative because of their flexibility, increased bandwidth and immunity to EMI. This paper describes the development of optical links for handheld communication devices. A cable assembly based on a special Plastic Optical Fiber (POF) selected for its mechanical durability is terminated with a small form factor molded lens assembly which interfaces between an 850nm VCSEL transmitter and a receiving device on the printed circuit board of the display module. A statistical approach based on a Lean Design For Six Sigma (LDFSS) roadmap for new product development tries to find an optimum link definition which will be robust and low cost meeting the power consumption requirements appropriate for battery operated systems.

Application de la technologie des materiaux sol-gel et polymere a l'optique integree

NASA Astrophysics Data System (ADS)

Saddiki, Zakaria

2002-01-01

With the advancement of optical telecommunication systems, "integrated optics" and "optical interconnect" technology are becoming more and more important. The major components of these two technologies are photonic integrated circuits (PICs), optoelectronic integrated circuits (OEICs), and optoelectronic multichip modules ( OE-MCMs). Optical signals are transmitted through optical waveguides that interconnect such components. The principle of optical transmission in waveguides is the same as that in optical fibres. To implement these technologies, both passive and active optical devices are needed. A wide variety of optical materials has been studied, e.g., glasses, lithium niobate, III-V semiconductors, sol-gel and polymers. In particular, passive optical components have been fabricated using glass optical waveguides by ion-exchange, or by flame hydrolysis deposition and reactive ion etching (FHD and RIE ). When using FHD and RIE, a very high temperatures (up to 1300°C) are needed to consolidate silica. This work reports on the fabrication and characterization of a new photo-patternable hybrid organic-inorganic glass sol-gel and polymer materials for the realisation of integrated optic and opto-electronic devices. They exhibit low losses in the NIR range, especially at the most important wavelengths windows for optical communications (1320 nm and 1550 nm). The sol-gel and polymer process is based on photo polymerization and thermo polymerization effects to create the wave-guide. The single-layer film is at low temperature and deep UV-light is employed to make the wave-guide by means of the well-known photolithography process. Like any photo-imaging process, the UV energy should exceed the threshold energy of chemical bonds in the photoactive component of hybrid glass material to form the expected integrated optic pattern with excellent line width control and vertical sidewalls. To achieve optical wave-guide, a refractive index difference Delta n occurred between the isolated (guiding layer) and the surrounding region (buffer and cladding). Accordingly, the refractive index emerges as a fundamental device performance material parameter and it is investigated using slab wave-guide. (Abstract shortened by UMI.)

Scalable Optical-Fiber Communication Networks

NASA Technical Reports Server (NTRS)

Chow, Edward T.; Peterson, John C.

1993-01-01

Scalable arbitrary fiber extension network (SAFEnet) is conceptual fiber-optic communication network passing digital signals among variety of computers and input/output devices at rates from 200 Mb/s to more than 100 Gb/s. Intended for use with very-high-speed computers and other data-processing and communication systems in which message-passing delays must be kept short. Inherent flexibility makes it possible to match performance of network to computers by optimizing configuration of interconnections. In addition, interconnections made redundant to provide tolerance to faults.

Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2012-01-01

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

47 CFR 64.1401 - Expanded interconnection.

Code of Federal Regulations, 2014 CFR

2014-10-01

... own equipment needed to terminate basic transmission facilities, including optical terminating... such equipment to connect interconnectors' fiber optic systems or microwave radio transmission..., including optical terminating equipment and multiplexers, to be located within or upon the local exchange...

47 CFR 64.1401 - Expanded interconnection.

Code of Federal Regulations, 2013 CFR

2013-10-01

... own equipment needed to terminate basic transmission facilities, including optical terminating... such equipment to connect interconnectors' fiber optic systems or microwave radio transmission..., including optical terminating equipment and multiplexers, to be located within or upon the local exchange...

47 CFR 64.1401 - Expanded interconnection.

Code of Federal Regulations, 2012 CFR

2012-10-01

... own equipment needed to terminate basic transmission facilities, including optical terminating... such equipment to connect interconnectors' fiber optic systems or microwave radio transmission..., including optical terminating equipment and multiplexers, to be located within or upon the local exchange...

Doping-enhanced radiative efficiency enables lasing in unpassivated GaAs nanowires

PubMed Central

Burgess, Tim; Saxena, Dhruv; Mokkapati, Sudha; Li, Zhe; Hall, Christopher R.; Davis, Jeffrey A.; Wang, Yuda; Smith, Leigh M.; Fu, Lan; Caroff, Philippe; Tan, Hark Hoe; Jagadish, Chennupati

2016-01-01

Nanolasers hold promise for applications including integrated photonics, on-chip optical interconnects and optical sensing. Key to the realization of current cavity designs is the use of nanomaterials combining high gain with high radiative efficiency. Until now, efforts to enhance the performance of semiconductor nanomaterials have focused on reducing the rate of non-radiative recombination through improvements to material quality and complex passivation schemes. Here we employ controlled impurity doping to increase the rate of radiative recombination. This unique approach enables us to improve the radiative efficiency of unpassivated GaAs nanowires by a factor of several hundred times while also increasing differential gain and reducing the transparency carrier density. In this way, we demonstrate lasing from a nanomaterial that combines high radiative efficiency with a picosecond carrier lifetime ready for high speed applications. PMID:27311597

Structural colored gels for tunable soft photonic crystals.

PubMed

Harun-Ur-Rashid, Mohammad; Seki, Takahiro; Takeoka, Yukikazu

2009-01-01

A periodically ordered interconnecting porous structure can be embodied in chemical gels by using closest-packed colloidal crystals as templates. The interconnecting porosity not only provides a quick response but also endows the porous gels with structural color arising from coherent Bragg optical diffraction. The structural colors revealed by porous gels can be regulated by several techniques, and thus, it is feasible to obtain desirable, smart, soft materials. A well-known thermosensitive monomer, N-isopropylacrylamide (NIPA), and other minor monomers were used to fabricate various structural colored gels. The selection of minor monomers depended on the targeted properties. This review focuses on the synthesis of templates, structural colored porous gels, and the applications of structural colored gel as smart soft materials for tunable photonic crystals. (c) 2009 The Japan Chemical Journal Forum and Wiley Periodicals, Inc.

Simultaneous wavelength and format conversion in SDN/NFV for flexible optical network based on FWM in SOA

NASA Astrophysics Data System (ADS)

Zhan, Yueying; Wang, Danshi; Zhang, Min

2018-04-01

We propose an all-optical wavelength and format conversion model (CM) for a dynamic data center interconnect node and coherent passive optical network (PON) optical network unit (ONU) in software-defined networking and network function virtualization system based on four-wave mixing in a semiconductor optical amplifier. Five wavelength converted DQPSK signals and two format converted DPSK signals are generated; the performances of the generated signals for two strategies of setting CM in the data center interconnect node and coherent PON ONU, which are over 10 km fiber transmission, have been verified. All of the converted signals are with a power penalty less than 2.2 dB at FEC threshold of 3.8 × 10 - 3, and the optimum bias current of SOA is 300 mA.

DGIC Interconnection Insights | Distributed Generation Interconnection

Science.gov Websites

reading. The State of Pre-Application Reports June 2017 by Zachary Peterson, National Renewable Energy DER interconnection processes. Some state regulators have sought the use of pre-application reports to

Performance evaluation of data center service localization based on virtual resource migration in software defined elastic optical network.

PubMed

Yang, Hui; Zhang, Jie; Ji, Yuefeng; Tan, Yuanlong; Lin, Yi; Han, Jianrui; Lee, Young

2015-09-07

Data center interconnection with elastic optical network is a promising scenario to meet the high burstiness and high-bandwidth requirements of data center services. In our previous work, we implemented cross stratum optimization of optical network and application stratums resources that allows to accommodate data center services. In view of this, this study extends the data center resources to user side to enhance the end-to-end quality of service. We propose a novel data center service localization (DCSL) architecture based on virtual resource migration in software defined elastic data center optical network. A migration evaluation scheme (MES) is introduced for DCSL based on the proposed architecture. The DCSL can enhance the responsiveness to the dynamic end-to-end data center demands, and effectively reduce the blocking probability to globally optimize optical network and application resources. The overall feasibility and efficiency of the proposed architecture are experimentally verified on the control plane of our OpenFlow-based enhanced SDN testbed. The performance of MES scheme under heavy traffic load scenario is also quantitatively evaluated based on DCSL architecture in terms of path blocking probability, provisioning latency and resource utilization, compared with other provisioning scheme.

III-V quantum light source and cavity-QED on silicon.

PubMed

Luxmoore, I J; Toro, R; Del Pozo-Zamudio, O; Wasley, N A; Chekhovich, E A; Sanchez, A M; Beanland, R; Fox, A M; Skolnick, M S; Liu, H Y; Tartakovskii, A I

2013-01-01

Non-classical light sources offer a myriad of possibilities in both fundamental science and commercial applications. Single photons are the most robust carriers of quantum information and can be exploited for linear optics quantum information processing. Scale-up requires miniaturisation of the waveguide circuit and multiple single photon sources. Silicon photonics, driven by the incentive of optical interconnects is a highly promising platform for the passive optical components, but integrated light sources are limited by silicon's indirect band-gap. III-V semiconductor quantum-dots, on the other hand, are proven quantum emitters. Here we demonstrate single-photon emission from quantum-dots coupled to photonic crystal nanocavities fabricated from III-V material grown directly on silicon substrates. The high quality of the III-V material and photonic structures is emphasized by observation of the strong-coupling regime. This work opens-up the advantages of silicon photonics to the integration and scale-up of solid-state quantum optical systems.

Towards energy aware optical networks and interconnects

NASA Astrophysics Data System (ADS)

Glesk, Ivan; Osadola, Tolulope; Idris, Siti

2013-10-01

In a today's world, information technology has been identified as one of the major factors driving economic prosperity. Datacenters businesses have been growing significantly in the past few years. The equipments in these datacenters need to be efficiently connected to each other and also to the outside world in order to enable effective exchange of information. This is why there is need for highly scalable, energy savvy and reliable network connectivity infrastructure that is capable of accommodating the large volume of data being exchanged at any time within the datacenter network and the outside network in general. These devices that can ensure such effective connectivity currently require large amount of energy in order to meet up with these increasing demands. In this paper, an overview of works being done towards realizing energy aware optical networks and interconnects for datacenters is presented. Also an OCDMA approach is discussed as potential multiple access technique for future optical network interconnections. We also presented some challenges that might inhibit effective implementation of the OCDMA multiplexing scheme.

A large-scale photonic node architecture that utilizes interconnected OXC subsystems.

PubMed

Iwai, Yuto; Hasegawa, Hiroshi; Sato, Ken-ichi

2013-01-14

We propose a novel photonic node architecture that is composed of interconnected small-scale optical cross-connect subsystems. We also developed an efficient dynamic network control algorithm that complies with a restriction on the number of intra-node fibers used for subsystem interconnection. Numerical evaluations verify that the proposed architecture offers almost the same performance as the equivalent single large-scale cross-connect switch, while enabling substantial hardware scale reductions.

Multifaceted free-space image distributor for optical interconnects in massively parrallel processing

NASA Astrophysics Data System (ADS)

Zhao, Feng; Frietman, Edward E. E.; Han, Zhong; Chen, Ray T.

1999-04-01

A characteristic feature of a conventional von Neumann computer is that computing power is delivered by a single processing unit. Although increasing the clock frequency improves the performance of the computer, the switching speed of the semiconductor devices and the finite speed at which electrical signals propagate along the bus set the boundaries. Architectures containing large numbers of nodes can solve this performance dilemma, with the comment that main obstacles in designing such systems are caused by difficulties to come up with solutions that guarantee efficient communications among the nodes. Exchanging data becomes really a bottleneck should al nodes be connected by a shared resource. Only optics, due to its inherent parallelism, could solve that bottleneck. Here, we explore a multi-faceted free space image distributor to be used in optical interconnects in massively parallel processing. In this paper, physical and optical models of the image distributor are focused on from diffraction theory of light wave to optical simulations. the general features and the performance of the image distributor are also described. The new structure of an image distributor and the simulations for it are discussed. From the digital simulation and experiment, it is found that the multi-faceted free space image distributing technique is quite suitable for free space optical interconnection in massively parallel processing and new structure of the multifaceted free space image distributor would perform better.

Integration of micro-/nano-/quantum-scale photonic devices: scientific and technological considerations

NASA Astrophysics Data System (ADS)

Lee, El-Hang; Lee, Seung-Gol; O, Beom Hoan; Park, Se Geun

2004-08-01

Scientific and technological issues and considerations regarding the integration of miniaturized microphotonic devices, circuits and systems in micron, submicron, and quantum scale, are presented. First, we examine the issues regarding the miniaturization of photonic devices including the size effect, proximity effect, energy confinement effect, microcavity effect, optical and quantum interference effect, high field effect, nonlinear effect, noise effect, quantum optical effect, and chaotic effect. Secondly, we examine the issues regarding the interconnection including the optical alignment, minimizing the interconnection losses, and maintaining optical modes. Thirdly, we address the issues regarding the two-dimensional or three-dimensional integration either in a hybrid format or in a monolithic format between active devices and passive devices of varying functions. We find that the concept of optical printed circuit board (O-PCB) that we propose is highly attractive as a platform for micro/nano/quantum-scale photonic integration. We examine the technological issues to be addressed in the process of fabrication, characterization, and packaging for actual implementation of the miniaturization, interconnection and integration. Devices that we have used for our study include: mode conversion schemes, micro-ring and micro-racetrack resonator devices, multimode interference devices, lasers, vertical cavity surface emitting microlasers, and their arrays. Future prospects are also discussed.

Optical interconnection networks for high-performance computing systems

NASA Astrophysics Data System (ADS)

Biberman, Aleksandr; Bergman, Keren

2012-04-01

Enabled by silicon photonic technology, optical interconnection networks have the potential to be a key disruptive technology in computing and communication industries. The enduring pursuit of performance gains in computing, combined with stringent power constraints, has fostered the ever-growing computational parallelism associated with chip multiprocessors, memory systems, high-performance computing systems and data centers. Sustaining these parallelism growths introduces unique challenges for on- and off-chip communications, shifting the focus toward novel and fundamentally different communication approaches. Chip-scale photonic interconnection networks, enabled by high-performance silicon photonic devices, offer unprecedented bandwidth scalability with reduced power consumption. We demonstrate that the silicon photonic platforms have already produced all the high-performance photonic devices required to realize these types of networks. Through extensive empirical characterization in much of our work, we demonstrate such feasibility of waveguides, modulators, switches and photodetectors. We also demonstrate systems that simultaneously combine many functionalities to achieve more complex building blocks. We propose novel silicon photonic devices, subsystems, network topologies and architectures to enable unprecedented performance of these photonic interconnection networks. Furthermore, the advantages of photonic interconnection networks extend far beyond the chip, offering advanced communication environments for memory systems, high-performance computing systems, and data centers.

Concurrent Design used in the Design of Space Instruments

NASA Technical Reports Server (NTRS)

Oxnevad, Knut I.

1998-01-01

At the Project Design Center at the Jet Propulsion Laboratory, a concurrent design environment is under development for supporting development and analyses of space instruments in the early, conceptual design phases. This environment is being utilized by a Team I, a multidisciplinary group of experts. Team I is providing study and proposal support. To provide the required support, the Team I concurrent design environment features effectively interconnected high-end optics, CAD, and thermal design and analysis tools. Innovative approaches for linking tools, and for transferring files between applications have been implemented. These approaches together with effective sharing of geometry between the optics, CAD, and thermal tools are already showing significant timesavings.

Review of Random Phase Encoding in Volume Holographic Storage

PubMed Central

Su, Wei-Chia; Sun, Ching-Cherng

2012-01-01

Random phase encoding is a unique technique for volume hologram which can be applied to various applications such as holographic multiplexing storage, image encryption, and optical sensing. In this review article, we first review and discuss diffraction selectivity of random phase encoding in volume holograms, which is the most important parameter related to multiplexing capacity of volume holographic storage. We then review an image encryption system based on random phase encoding. The alignment of phase key for decryption of the encoded image stored in holographic memory is analyzed and discussed. In the latter part of the review, an all-optical sensing system implemented by random phase encoding and holographic interconnection is presented.

CATO: a CAD tool for intelligent design of optical networks and interconnects

NASA Astrophysics Data System (ADS)

Chlamtac, Imrich; Ciesielski, Maciej; Fumagalli, Andrea F.; Ruszczyk, Chester; Wedzinga, Gosse

1997-10-01

Increasing communication speed requirements have created a great interest in very high speed optical and all-optical networks and interconnects. The design of these optical systems is a highly complex task, requiring the simultaneous optimization of various parts of the system, ranging from optical components' characteristics to access protocol techniques. Currently there are no computer aided design (CAD) tools on the market to support the interrelated design of all parts of optical communication systems, thus the designer has to rely on costly and time consuming testbed evaluations. The objective of the CATO (CAD tool for optical networks and interconnects) project is to develop a prototype of an intelligent CAD tool for the specification, design, simulation and optimization of optical communication networks. CATO allows the user to build an abstract, possible incomplete, model of the system, and determine its expected performance. Based on design constraints provided by the user, CATO will automatically complete an optimum design, using mathematical programming techniques, intelligent search methods and artificial intelligence (AI). Initial design and testing of a CATO prototype (CATO-1) has been completed recently. The objective was to prove the feasibility of combining AI techniques, simulation techniques, an optical device library and a graphical user interface into a flexible CAD tool for obtaining optimal communication network designs in terms of system cost and performance. CATO-1 is an experimental tool for designing packet-switching wavelength division multiplexing all-optical communication systems using a LAN/MAN ring topology as the underlying network. The two specific AI algorithms incorporated are simulated annealing and a genetic algorithm. CATO-1 finds the optimal number of transceivers for each network node, using an objective function that includes the cost of the devices and the overall system performance.

Clad metals, roll bonding and their applications for SOFC interconnects

NASA Astrophysics Data System (ADS)

Chen, Lichun; Yang, Zhenguo; Jha, Bijendra; Xia, Guanguang; Stevenson, Jeffry W.

Metallic interconnects have been becoming an increasingly interesting topic in the development in intermediate temperature solid oxide fuel cells (SOFC). High temperature oxidation resistant alloys are currently considered as candidate materials. Among these alloys however, different groups of alloys demonstrate different advantages and disadvantages, and few if any can completely satisfy the stringent requirements for the application. To integrate the advantages and avoid the disadvantages of different groups of alloys, clad metal has been proposed for SOFC interconnect applications and interconnect structures. This paper gives a brief overview of the cladding approach and its applications, and discuss the viability of this technology to fabricate the metallic layered-structure interconnects. To examine the feasibility of this approach, the austenitic Ni-base alloy Haynes 230 and the ferritic stainless steel AL 453 were selected as examples and manufactured into a clad metal. Its suitability as an interconnect construction material was investigated.

Potential for integrated optical circuits in advanced aircraft with fiber optic control and monitoring systems

NASA Astrophysics Data System (ADS)

Baumbick, Robert J.

1991-02-01

Fiber optic technology is expected to be used in future advanced weapons platforms as well as commercial aerospace applications. Fiber optic waveguides will be used to transmit noise free high speed data between a multitude of computers as well as audio and video information to the flight crew. Passive optical sensors connected to control computers with optical fiber interconnects will serve both control and monitoring functions. Implementation of fiber optic technology has already begun. Both the military and NASA have several programs in place. A cooperative program called FOCSI (Fiber Optic Control System Integration) between NASA Lewis and the NAVY to build environmentally test and flight demonstrate sensor systems for propul sion and flight control systems is currently underway. Integrated Optical Circuits (IOC''s) are also being given serious consideration for use in advanced aircraft sys tems. IOC''s will result in miniaturization and localization of components to gener ate detect optical signals and process them for use by the control computers. In some complex systems IOC''s may be required to perform calculations optically if the technology is ready replacing some of the electronic systems used today. IOC''s are attractive because they will result in rugged components capable of withstanding severe environments in advanced aerospace vehicles. Manufacturing technology devel oped for microelectronic integrated circuits applied to IOC''s will result in cost effective manufacturing. This paper reviews the current FOCSI program and describes the role of IOC''s in FOCSI applications.

Printed polymer photonic devices for optical interconnect systems

NASA Astrophysics Data System (ADS)

Subbaraman, Harish; Pan, Zeyu; Zhang, Cheng; Li, Qiaochu; Guo, L. J.; Chen, Ray T.

2016-03-01

Polymer photonic device fabrication usually relies on the utilization of clean-room processes, including photolithography, e-beam lithography, reactive ion etching (RIE) and lift-off methods etc, which are expensive and are limited to areas as large as a wafer. Utilizing a novel and a scalable printing process involving ink-jet printing and imprinting, we have fabricated polymer based photonic interconnect components, such as electro-optic polymer based modulators and ring resonator switches, and thermo-optic polymer switch based delay networks and demonstrated their operation. Specifically, a modulator operating at 15MHz and a 2-bit delay network providing up to 35.4ps are presented. In this paper, we also discuss the manufacturing challenges that need to be overcome in order to make roll-to-roll manufacturing practically viable. We discuss a few manufacturing challenges, such as inspection and quality control, registration, and web control, that need to be overcome in order to realize true implementation of roll-to-roll manufacturing of flexible polymer photonic systems. We have overcome these challenges, and currently utilizing our inhouse developed hardware and software tools, <10μm alignment accuracy at a 5m/min is demonstrated. Such a scalable roll-to-roll manufacturing scheme will enable the development of unique optoelectronic devices which can be used in a myriad of different applications, including communication, sensing, medicine, security, imaging, energy, lighting etc.

Chip-To-Chip Optical Interconnection Using MEMS Mirrors

DTIC Science & Technology

2009-03-26

the Figure 2.3: SEM of a 2D micromirror with embedded polysilicon circuit paths within the frame structures which drives individual thermal actuation...single-crystal silicon micromirror for large bi-directional 2d scanning applications,” Sens. and Actuators, A, vol. 130-131, pp. 454–460, 8/14 2006. 14...thesis (m.s.), AFIT, Mar 2008. AFIT/GEO/ENP/08-03. 17. B. McCarthy, V. M. Bright, and J. A. Neff, “A multi-component solder self- assembled micromirror

Thin glass based packaging and photonic single-mode waveguide integration by ion-exchange technology on board and module level

NASA Astrophysics Data System (ADS)

Brusberg, Lars; Lang, Günter; Schröder, Henning

2011-01-01

The proposed novel packaging approach merges micro-system packaging and glass integrated optics. It provides 3D optical single-mode intra system links to bridge the gap between novel photonic integrated circuits and the glass fibers for inter system interconnects. We introduce our hybrid 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip links. Optical mirrors and lenses provide optical mode matching for photonic IC assemblies and optical fiber interconnects. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties as reviewed in the paper. That makes it perfect for micro-system packaging. The adopted planar waveguide process based on ion-exchange technology is capable for high-volume manufacturing. This ion-exchange process and the optical propagation are described in detail for thin glass substrates. An extensive characterization of all basic circuit elements like straight and curved waveguides, couplers and crosses proves the low attenuation of the optical circuit elements.

Optimal wavelength-space crossbar switches for supercomputer optical interconnects.

PubMed

Roudas, Ioannis; Hemenway, B Roe; Grzybowski, Richard R; Karinou, Fotini

2012-08-27

We propose a most economical design of the Optical Shared MemOry Supercomputer Interconnect System (OSMOSIS) all-optical, wavelength-space crossbar switch fabric. It is shown, by analysis and simulation, that the total number of on-off gates required for the proposed N × N switch fabric can scale asymptotically as N ln N if the number of input/output ports N can be factored into a product of small primes. This is of the same order of magnitude as Shannon's lower bound for switch complexity, according to which the minimum number of two-state switches required for the construction of a N × N permutation switch is log2 (N!).

Monolithic InP strictly non-blocking 8×8 switch for high-speed WDM optical interconnection.

PubMed

Kwack, Myung-Joon; Tanemura, Takuo; Higo, Akio; Nakano, Yoshiaki

2012-12-17

A strictly non-blocking 8 × 8 switch for high-speed WDM optical interconnection is realized on InP by using the phased-array scheme for the first time. The matrix switch architecture consists of over 200 functional devices such as star couplers, phase-shifters and so on without any waveguide cross-section. We demonstrate ultra-broad optical bandwidth covering the entire C-band through several Input/Output ports combination with extinction ratio performance of more than 20dB. Also, nanoseconds reconfiguration time was successfully achieved by dynamic switching experiment. Error-free transmission was verified for 40-Gbps (10-Gbps × 4ch) WDM signal.

Integration of the White Sands Complex into a Wide Area Network

NASA Technical Reports Server (NTRS)

Boucher, Phillip Larry; Horan, Sheila, B.

1996-01-01

The NASA White Sands Complex (WSC) satellite communications facility consists of two main ground stations, an auxiliary ground station, a technical support facility, and a power plant building located on White Sands Missile Range. When constructed, terrestrial communication access to these facilities was limited to copper telephone circuits. There was no local or wide area communications network capability. This project incorporated a baseband local area network (LAN) topology at WSC and connected it to NASA's wide area network using the Program Support Communications Network-Internet (PSCN-I). A campus-style LAN is configured in conformance with the International Standards Organization (ISO) Open Systems Interconnect (ISO) model. Ethernet provides the physical and data link layers. Transmission Control Protocol and Internet Protocol (TCP/IP) are used for the network and transport layers. The session, presentation, and application layers employ commercial software packages. Copper-based Ethernet collision domains are constructed in each of the primary facilities and these are interconnected by routers over optical fiber links. The network and each of its collision domains are shown to meet IEEE technical configuration guidelines. The optical fiber links are analyzed for the optical power budget and bandwidth allocation and are found to provide sufficient margin for this application. Personal computers and work stations attached to the LAN communicate with and apply a wide variety of local and remote administrative software tools. The Internet connection provides wide area network (WAN) electronic access to other NASA centers and the world wide web (WWW). The WSC network reduces and simplifies the administrative workload while providing enhanced and advanced inter-communications capabilities among White Sands Complex departments and with other NASA centers.

Optical wireless link between a nanoscale antenna and a transducing rectenna.

PubMed

Dasgupta, Arindam; Mennemanteuil, Marie-Maxime; Buret, Mickaël; Cazier, Nicolas; Colas-des-Francs, Gérard; Bouhelier, Alexandre

2018-05-18

Initiated as a cable-replacement solution, short-range wireless power transfer has rapidly become ubiquitous in the development of modern high-data throughput networking in centimeter to meter accessibility range. Wireless technology is now penetrating a higher level of system integration for chip-to-chip and on-chip radiofrequency interconnects. However, standard CMOS integrated millimeter-wave antennas have typical size commensurable with the operating wavelength, and are thus an unrealistic solution for downsizing transmitters and receivers to the micrometer and nanometer scale. Herein, we demonstrate a light-in and electrical signal-out, on-chip wireless near-infrared link between a 220 nm optical antenna and a sub-nanometer rectifying antenna converting the transmitted optical energy into direct electrical current. The co-integration of subwavelength optical functional devices with electronic transduction offers a disruptive solution to interface photons and electrons at the nanoscale for on-chip wireless optical interconnects.

Twelve Channel Optical Fiber Connector Assembly: From Commercial Off the Shelf to Space Flight Use

NASA Technical Reports Server (NTRS)

Ott, Melaine N.

1998-01-01

The commercial off the shelf (COTS) twelve channel optical fiber MTP array connector and ribbon cable assembly is being validated for space flight use and the results of this study to date are presented here. The interconnection system implemented for the Parallel Fiber Optic Data Bus (PFODB) physical layer will include a 100/140 micron diameter optical fiber in the cable configuration among other enhancements. As part of this investigation, the COTS 62.5/125 microns optical fiber cable assembly has been characterized for space environment performance as a baseline for improving the performance of the 100/140 micron diameter ribbon cable for the Parallel FODB application. Presented here are the testing and results of random vibration and thermal environmental characterization of this commercial off the shelf (COTS) MTP twelve channel ribbon cable assembly. This paper is the first in a series of papers which will characterize and document the performance of Parallel FODB's physical layer from COTS to space flight worthy.

Behavioral modeling of VCSELs for high-speed optical interconnects

NASA Astrophysics Data System (ADS)

Szczerba, Krzysztof; Kocot, Chris

2018-02-01

Transition from on-off keying to 4-level pulse amplitude modulation (PAM) in VCSEL based optical interconnects allows for an increase of data rates, at the cost of 4.8 dB sensitivity penalty. The resulting strained link budget creates a need for accurate VCSEL models for driver integrated circuit (IC) design and system level simulations. Rate equation based equivalent circuit models are convenient for the IC design, but system level analysis requires computationally efficient closed form behavioral models based Volterra series and neural networks. In this paper we present and compare these models.

Physical-layer network coding for passive optical interconnect in datacenter networks.

PubMed

Lin, Rui; Cheng, Yuxin; Guan, Xun; Tang, Ming; Liu, Deming; Chan, Chun-Kit; Chen, Jiajia

2017-07-24

We introduce physical-layer network coding (PLNC) technique in a passive optical interconnect (POI) architecture for datacenter networks. The implementation of the PLNC in the POI at 2.5 Gb/s and 10Gb/s have been experimentally validated while the gains in terms of network layer performances have been investigated by simulation. The results reveal that in order to realize negligible packet drop, the wavelengths usage can be reduced by half while a significant improvement in packet delay especially under high traffic load can be achieved by employing PLNC over POI.

Phase change material based tunable reflectarray for free-space optical inter/intra chip interconnects.

PubMed

Zou, Longfang; Cryan, Martin; Klemm, Maciej

2014-10-06

The concept of phase change material (PCM) based optical antennas and antenna arrays is proposed for dynamic beam shaping and steering utilized in free-space optical inter/intra chip interconnects. The essence of this concept lies in the fact that the behaviour of PCM based optical antennas will change due to the different optical properties of the amorphous and crystalline state of the PCM. By engineering optical antennas or antenna arrays, it is feasible to design dynamic optical links in a desired manner. In order to illustrate this concept, a PCM based tunable reflectarray is proposed for a scenario of a dynamic optical link between a source and two receivers. The designed reflectarray is able to switch the optical link between two receivers by switching the two states of the PCM. Two types of antennas are employed in the proposed tunable reflectarray to achieve full control of the wavefront of the reflected beam. Numerical studies show the expected binary beam steering at the optical communication wavelength of 1.55 μm. This study suggests a new research area of PCM based optical antennas and antenna arrays for dynamic optical switching and routing.

Chip-to-chip optical link by using optical wiring method

NASA Astrophysics Data System (ADS)

Cho, In-Kui; Ahn, Seoung Ho; Jeong, Myung-Yung; Rho, Byung Sup; Park, Hyo Hoon

2008-01-01

A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy assembly. This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the following steps: (a) forming a light source device, an optical detection device, and an optical transmission unit on a substrate (metal optical bench (MOB)); (b) preparing a flexible optical transmission-connection medium (optical wiring link) to optically connect the light source device formed on the substrate with the optical detection device; and (c) directly connecting one end of the surface-finished optical transmission connection medium with the light source device and the other end with the optical detection device. A chip-to-chip optical link system constructed with TRx modules was fabricated and the optical characteristics were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust and cost-effective assembly for vertical-cavity surface-emitting lasers (VCSELs) and photodiodes (PDs). We successfully achieved a 5 Gb/s data transmission rate with this optical link.

Research on Optical Transmitter and Receiver Module Used for High-Speed Interconnection between CPU and Memory

NASA Astrophysics Data System (ADS)

He, Huimin; Liu, Fengman; Li, Baoxia; Xue, Haiyun; Wang, Haidong; Qiu, Delong; Zhou, Yunyan; Cao, Liqiang

2016-11-01

With the development of the multicore processor, the bandwidth and capacity of the memory, rather than the memory area, are the key factors in server performance. At present, however, the new architectures, such as fully buffered DIMM (FBDIMM), hybrid memory cube (HMC), and high bandwidth memory (HBM), cannot be commercially applied in the server. Therefore, a new architecture for the server is proposed. CPU and memory are separated onto different boards, and optical interconnection is used for the communication between them. Each optical module corresponds to each dual inline memory module (DIMM) with 64 channels. Compared to the previous technology, not only can the architecture realize high-capacity and wide-bandwidth memory, it also can reduce power consumption and cost, and be compatible with the existing dynamic random access memory (DRAM). In this article, the proposed module with system-in-package (SiP) integration is demonstrated. In the optical module, the silicon photonic chip is included, which is a promising technology to be applied in the next-generation data exchanging centers. And due to the bandwidth-distance performance of the optical interconnection, SerDes chips are introduced to convert the 64-bit data at 800 Mbps from/to 4-channel data at 12.8 Gbps after/before they are transmitted though optical fiber. All the devices are packaged on cheap organic substrates. To ensure the performance of the whole system, several optimization efforts have been performed on the two modules. High-speed interconnection traces have been designed and simulated with electromagnetic simulation software. Steady-state thermal characteristics of the transceiver module have been evaluated by ANSYS APLD based on finite-element methodology (FEM). Heat sinks are placed at the hotspot area to ensure the reliability of all working chips. Finally, this transceiver system based on silicon photonics is measured, and the eye diagrams of data and clock signals are verified.

Field-programmable logic devices with optical input-output.

PubMed

Szymanski, T H; Saint-Laurent, M; Tyan, V; Au, A; Supmonchai, B

2000-02-10

A field-programmable logic device (FPLD) with optical I/O is described. FPLD's with optical I/O can have their functionality specified in the field by means of downloading a control-bit stream and can be used in a wide range of applications, such as optical signal processing, optical image processing, and optical interconnects. Our device implements six state-of-the-art dynamically programmable logic arrays (PLA's) on a 2 mm x 2 mm die. The devices were fabricated through the Lucent Technologies-Advanced Research Projects Agency-Consortium for Optical and Optoelectronic Technologies in Computing (Lucent/ARPA/COOP) workshop by use of 0.5-microm complementary metal-oxide semiconductor-self-electro-optic device technology and were delivered in 1998. All devices are fully functional: The electronic data paths have been verified at 200 MHz, and optical tests are pending. The device has been programmed to implement a two-stage optical switching network with six 4 x 4 crossbar switches, which can realize more than 190 x 10(6) unique programmable input-output permutations. The same device scaled to a 2 cm x 2 cm substrate could support as many as 4000 optical I/O and 1 Tbit/s of optical I/O bandwidth and offer fully programmable digital functionality with approximately 110,000 programmable logic gates. The proposed optoelectronic FPLD is also ideally suited to realizing dense, statically reconfigurable crossbar switches. We describe an attractive application area for such devices: a rearrangeable three-stage optical switch for a wide-area-network backbone, switching 1000 traffic streams at the OC-48 data rate and supporting several terabits of traffic.

Trade-offs between lens complexity and real estate utilization in a free-space multichip global interconnection module.

PubMed

Milojkovic, Predrag; Christensen, Marc P; Haney, Michael W

2006-07-01

The FAST-Net (Free-space Accelerator for Switching Terabit Networks) concept uses an array of wide-field-of-view imaging lenses to realize a high-density shuffle interconnect pattern across an array of smart-pixel integrated circuits. To simplify the optics we evaluated the efficiency gained in replacing spherical surfaces with aspherical surfaces by exploiting the large disparity between narrow vertical cavity surface emitting laser (VCSEL) beams and the wide field of view of the imaging optics. We then analyzed trade-offs between lens complexity and chip real estate utilization and determined that there exists an optimal numerical aperture for VCSELs that maximizes their area density. The results provide a general framework for the design of wide-field-of-view free-space interconnection systems that incorporate high-density VCSEL arrays.

Roughness measurements on coupling structures for optical interconnections integrated on a printed circuit board

NASA Astrophysics Data System (ADS)

Hendrickx, Nina; Van Erps, Jürgen; Suyal, Himanshu; Taghizadeh, Mohammad; Thienpont, Hugo; Van Daele, Peter

2006-04-01

In this paper, laser ablation (at UGent), deep proton writing (at VUB) and laser direct writing (at HWU) are presented as versatile technologies that can be used for the fabrication of coupling structures for optical interconnections integrated on a printed circuit board (PCB). The optical layer, a highly cross-linked acrylate based polymer, is applied on an FR4 substrate. Both laser ablation and laser direct writing are used for the definition of arrays of multimode optical waveguides, which guide the light in the plane of the optical layer. In order to couple light vertically in/out of the plane of the optical waveguides, coupling structures have to be integrated into the optical layer. Out-of-plane turning mirrors, that deflect the light beam over 90°, are used for this purpose. The surface roughness and angle of three mirror configurations are evaluated: a laser ablated one that is integrated into the optical waveguide, a laser direct written one that is also directly written onto the waveguide and a DPW insert that is plugged into a cavity into the waveguiding layer.

Frequency-encoded photonic qubits for scalable quantum information processing

DOE PAGES

Lukens, Joseph M.; Lougovski, Pavel

2016-12-21

Among the objectives for large-scale quantum computation is the quantum interconnect: a device that uses photons to interface qubits that otherwise could not interact. However, the current approaches require photons indistinguishable in frequency—a major challenge for systems experiencing different local environments or of different physical compositions altogether. Here, we develop an entirely new platform that actually exploits such frequency mismatch for processing quantum information. Labeled “spectral linear optical quantum computation” (spectral LOQC), our protocol offers favorable linear scaling of optical resources and enjoys an unprecedented degree of parallelism, as an arbitrary Ν-qubit quantum gate may be performed in parallel onmore » multiple Ν-qubit sets in the same linear optical device. Here, not only does spectral LOQC offer new potential for optical interconnects, but it also brings the ubiquitous technology of high-speed fiber optics to bear on photonic quantum information, making wavelength-configurable and robust optical quantum systems within reach.« less

Frequency-encoded photonic qubits for scalable quantum information processing

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lukens, Joseph M.; Lougovski, Pavel

Among the objectives for large-scale quantum computation is the quantum interconnect: a device that uses photons to interface qubits that otherwise could not interact. However, the current approaches require photons indistinguishable in frequency—a major challenge for systems experiencing different local environments or of different physical compositions altogether. Here, we develop an entirely new platform that actually exploits such frequency mismatch for processing quantum information. Labeled “spectral linear optical quantum computation” (spectral LOQC), our protocol offers favorable linear scaling of optical resources and enjoys an unprecedented degree of parallelism, as an arbitrary Ν-qubit quantum gate may be performed in parallel onmore » multiple Ν-qubit sets in the same linear optical device. Here, not only does spectral LOQC offer new potential for optical interconnects, but it also brings the ubiquitous technology of high-speed fiber optics to bear on photonic quantum information, making wavelength-configurable and robust optical quantum systems within reach.« less

Motivation for DOC III: 64-bit digital optical computer

NASA Astrophysics Data System (ADS)

Guilfoyle, Peter S.

1991-09-01

OptiComp has focused on a digital optical logic family in order to capitalize on the inherent benefits of optical computing, which include (1) high FAN-IN and FAN-OUT, (2) low power consumption, (3) high noise margin, (4) high algorithmic efficiency using 'smart' interconnects, and (5) free-space leverage of gate interconnect bandwidth product. Other well-known secondary advantages of optical logic include zero capacitive loading of signals at a detector, zero cross-talk between signals, zero signal dispersion, and minimal clock skew (a few picoseconds or less in an imaging system). The primary focus of this paper is to demonstrate how each of the five advantages can be used to leverage other logic family performance such as GaAs; the secondary attributes are discussed only in the context of introducing the DOC III architecture.

Automated brush plating process for solid oxide fuel cells

DOEpatents

Long, Jeffrey William

2003-01-01

A method of depositing a metal coating (28) on the interconnect (26) of a tubular, hollow fuel cell (10) contains the steps of providing the fuel cell (10) having an exposed interconnect surface (26); contacting the inside of the fuel cell (10) with a cathode (45) without use of any liquid materials; passing electrical current through a contacting applicator (46) which contains a metal electrolyte solution; passing the current from the applicator (46) to the cathode (45) and contacting the interconnect (26) with the applicator (46) and coating all of the exposed interconnect surface.

76 FR 35205 - Combined Notice of Filings #1

Federal Register 2010, 2011, 2012, 2013, 2014

2011-06-16

... Tuesday, June 28, 2011. Docket Numbers: ER11-3743-000. Applicants: PJM Interconnection, L.L.C. Description: PJM Interconnection, L.L.C. submits tariff filing per 35.13(a)(2)(iii: Queue No. W2-082; Original.... Applicants: PJM Interconnection, L.L.C. [[Page 35206

Improvements in Fabrication of 3D SU-8 Prisms for Low-Coupling-Loss Interconnections Between Fibers and Waveguides

NASA Astrophysics Data System (ADS)

Nguyen, Minh-Hang; Chu, Thi-Xuan; Nguyen, Long; Nguyen, Hai-Binh; Lee, Chun-Wei; Tseng, Fan-Gang; Chen, Te-Chang; Lee, Ming-Chang

2016-11-01

Fabrication of three-dimensional (3D) SU-8 (an epoxy-based negative photoresist from MicroChem) prisms as low-loss couplers for interconnection between optical components, particularly optical fibers and silicon-on-isolator waveguides (SOI WGs), which have mismatched mode sizes, has been investigated. With an interfacial structure formed by a 3D SU-8 prism partly overlaying an SOI WG end with a portion of buried oxide (BOX) removed under the interface, low-loss coupling is ensured and the transmission efficiency can reach 70%. To fabricate these 3D SU-8 prisms, a simple method with two photolithography steps was used for SU-8 hinges and CYTOP (an amorphous fluoropolymer from AGC Chemicals) prism windows, with mild soft and hard bakes, to define the prism profiles with diluted SU-8 filled in the CYTOP prism windows. A buffered oxide etchant is used to remove BOX parts under the interfaces. Some of the fabricated structures were tested, demonstrating the contribution of overlaying SU-8 prisms to the transmission efficiency of optical interconnections between fibers and SOI WGs.

Compound semiconductor optical waveguide switch

DOEpatents

Spahn, Olga B.; Sullivan, Charles T.; Garcia, Ernest J.

2003-06-10

An optical waveguide switch is disclosed which is formed from III-V compound semiconductors and which has a moveable optical waveguide with a cantilevered portion that can be bent laterally by an integral electrostatic actuator to route an optical signal (i.e. light) between the moveable optical waveguide and one of a plurality of fixed optical waveguides. A plurality of optical waveguide switches can be formed on a common substrate and interconnected to form an optical switching network.

Flexible, FEP-Teflon covered solar cell module development

NASA Technical Reports Server (NTRS)

Rauschenbach, H. S.; Cannady, M. D.

1976-01-01

Techniques and equipment were developed for the large scale, low-cost fabrication of lightweight, roll-up and fold-up, FEP-Teflon encapsulated solar cell modules. Modules were fabricated by interconnecting solderless single-crystal silicon solar cells and heat laminating them at approximately 300 C between layers of optically clear FEP and to a loadbearing Kapton substrate sheet. Modules were fabricated from both conventional and wraparound contact solar cells. A heat seal technique was developed for mechanically interconnecting modules into an array. The electrical interconnections for both roll-up and fold-up arrays were also developed. The use of parallel-gap resistance welding, ultrasonic bonding, and thermocompression bonding processes for attaching interconnects to solar cells were investigated. Parallel-gap welding was found to be best suited for interconnecting the solderless solar cells into modules. Details of the fabrication equipment, fabrication processes, module and interconnect designs, environmental test equipment, and test results are presented.

Design process of a photonics network for military platforms

NASA Astrophysics Data System (ADS)

Nelson, George F.; Rao, Nagarajan M.; Krawczak, John A.; Stevens, Rick C.

1999-02-01

Technology development in photonics is rapidly progressing. The concept of a Unified Network will provide re- configurable network access to platform sensors, Vehicle Management Systems, Stores and avionics. The re-configurable taps into the network will accommodate present interface standards and provide scaleability for the insertion of future interfaces. Significant to this development is the design and test of the Optical Backplane Interconnect System funded by Naval Air Systems Command and developed by Lockheed Martin Tactical Defense Systems - Eagan. OBIS results in the merging of the electrical backplane and the optical backplane, with interconnect fabric and card edge connectors finally providing adequate electrical and optical card access. Presently OBIS will support 1.2 Gb/s per fiber over multiples of 12 fibers per ribbon cable.

Scaling single-wavelength optical interconnects to 180 Gb/s with PAM-M and pulse shaping

NASA Astrophysics Data System (ADS)

Dris, Stefanos; Bakopoulos, Paraskevas; Argyris, Nikolaos; Spatharakis, Christos; Avramopoulos, Hercules

2016-03-01

Faced with surging datacenter traffic demand, system designers are turning to multi-level optical modulation with direct detection as the means of reaching 100 Gb/s in a single optical lane; a further upgrade to 400 Gb/s is envisaged through wavelength-multiplexing of multiple 100 Gb/s strands. In terms of modulation formats, PAM-4 and PAM-8 are considered the front-runners, striking a good balance between bandwidth-efficiency and implementation complexity. In addition, the emergence of energy-efficient, high-speed CMOS digital-to-analog converters (DACs) opens up new possibilities: Spectral shaping through digital filtering will allow squeezing even more data through low-cost, low-bandwidth electro-optic components. In this work we demonstrate an optical interconnect based on an EAM that is driven directly with sub-volt electrical swing by a 65 GSa/s arbitrary waveform generator (AWG). Low-voltage drive is particularly attractive since it allows direct interfacing with the switch/server ASIC, eliminating the need for dedicated, power-hungry and expensive electrical drivers. Single-wavelength throughputs of 180 and 120 Gb/s are experimentally demonstrated with 60 Gbaud optical PAM-8 and PAM-4 respectively. Successful transmission over 1250 m SMF is achieved with direct-detection, using linear equalization via offline digital signal processing in order to overcome the strong bandwidth limitation of the overall link (~20 GHz). The suitability of Nyquist pulse shaping for optical interconnects is also investigated experimentally with PAM-4 and PAM-8, at a lower symbol rate of 40 Gbaud (limited by the sampling rate of the AWG). To the best of our knowledge, the rates achieved are the highest ever using optical PAM-M formats.

Optical diffraction properties of multimicrogratings

DOE PAGES

Rothenbach, Christian A.; Kravchenko, Ivan I.; Gupta, Mool C.

2015-02-27

This paper shows the results of optical diffraction properties of multimicrograting structures fabricated by e-beam lithography. Multimicrograting consist of arrays of hexagonally shaped cells containing periodic one-dimensional (1D) grating lines in different orientations and arrayed to form large area patterns. We analyzed the optical diffraction properties of multimicrogratings by studying the individual effects of the several periodic elements of multimicrogratings. The observed optical diffraction pattern is shown to be the combined effect of the periodic and non-periodic elements that define the multimicrogratings and the interaction between different elements. We measured the total transverse electric (TE) diffraction efficiency of multimicrogratings andmore » found it to be 32.1%, which is closely related to the diffraction efficiency of 1D periodic grating lines of the same characteristics, measured to be 33.7%. Beam profiles of the optical diffraction patterns from multimicrogratings are captured with a CCD sensor technique. Interference fringes were observed under certain conditions formed by multimicrograting beams interfering with each other. Finally, these diffraction structures may find applications in sensing, nanometrology, and optical interconnects.« less

Challenges in paper-based fluorogenic optical sensing with smartphones

NASA Astrophysics Data System (ADS)

Ulep, Tiffany-Heather; Yoon, Jeong-Yeol

2018-05-01

Application of optically superior, tunable fluorescent nanotechnologies have long been demonstrated throughout many chemical and biological sensing applications. Combined with microfluidics technologies, i.e. on lab-on-a-chip platforms, such fluorescent nanotechnologies have often enabled extreme sensitivity, sometimes down to single molecule level. Within recent years there has been a peak interest in translating fluorescent nanotechnology onto paper-based platforms for chemical and biological sensing, as a simple, low-cost, disposable alternative to conventional silicone-based microfluidic substrates. On the other hand, smartphone integration as an optical detection system as well as user interface and data processing component has been widely attempted, serving as a gateway to on-board quantitative processing, enhanced mobility, and interconnectivity with informational networks. Smartphone sensing can be integrated to these paper-based fluorogenic assays towards demonstrating extreme sensitivity as well as ease-of-use and low-cost. However, with these emerging technologies there are always technical limitations that must be addressed; for example, paper's autofluorescence that perturbs fluorogenic sensing; smartphone flash's limitations in fluorescent excitation; smartphone camera's limitations in detecting narrow-band fluorescent emission, etc. In this review, physical optical setups, digital enhancement algorithms, and various fluorescent measurement techniques are discussed and pinpointed as areas of opportunities to further improve paper-based fluorogenic optical sensing with smartphones.

Si photonics technology for future optical interconnection

NASA Astrophysics Data System (ADS)

Zheng, Xuezhe; Krishnamoorthy, Ashok V.

2011-12-01

Scaling of computing systems require ultra-efficient interconnects with large bandwidth density. Silicon photonics offers a disruptive solution with advantages in reach, energy efficiency and bandwidth density. We review our progress in developing building blocks for ultra-efficient WDM silicon photonic links. Employing microsolder based hybrid integration with low parasitics and high density, we optimize photonic devices on SOI platforms and VLSI circuits on more advanced bulk CMOS technology nodes independently. Progressively, we successfully demonstrated single channel hybrid silicon photonic transceivers at 5 Gbps and 10 Gbps, and 80 Gbps arrayed WDM silicon photonic transceiver using reverse biased depletion ring modulators and Ge waveguide photo detectors. Record-high energy efficiency of less than 100fJ/bit and 385 fJ/bit were achieved for the hybrid integrated transmitter and receiver, respectively. Waveguide grating based optical proximity couplers were developed with low loss and large optical bandwidth to enable multi-layer intra/inter-chip optical interconnects. Thermal engineering of WDM devices by selective substrate removal, together with WDM link using synthetic wavelength comb, we significantly improved the device tuning efficiency and reduced the tuning range. Using these innovative techniques, two orders of magnitude tuning power reduction was achieved. And tuning cost of only a few 10s of fJ/bit is expected for high data rate WDM silicon photonic links.

Chemical and Physical Approaches to the Modulation of the Electronic Structure, Conductivities and Optical Properties of SWNT Thin Films

NASA Astrophysics Data System (ADS)

Moser, Matthew Lee

Since their discovery two decades ago, single walled carbon nanotubes (SWNT) have created an expansion of scientific interest that continues to grow to this day. This is due to a good balance between presence of bandgap, chemical reactivity and electrical conductivity. By interconnection of the individual nanotubes or modulation of the SWNT's electronic states, electronic devices made with thin films can become candidates for next generation electronics in areas such as memory devices, spintronics, energy storage devices and optoelectronics. My thesis focuses on the modulation of the electronic structure, optical properties and transport characteristics of single walled carbon nanotube films and their application in electronic and optoelectronic devices. Individual SWNTs have exceptional electronic properties but are difficult to manipulate for use in electronic devices. Alternatively, devices utilize SWNTs in thin films. SWNT thin films, however, may lose some of the properties due to Schottky barriers and electron hoping between metal-nanotube junctions and individual nanotubes within the film, respectively. Until recently, there has been no known route to preserve both conjugation and electrical properties. Prior attempts using covalent chemical functionalization led to re-hybridization of sp2 carbon centers to sp3, which introduces defects into the material and results in a decrease of electron mobility. As was discovered in Haddon Research group, depositing Group VI transition metals via atomic vapor deposition into SWNT films results in formation of bis-hexahapto covalent bonds. This (eta6-SWNT) Metal (eta6-SWNT) type of bonding was found to interconnect the delocalized systems without inducing structural re-hybridization and results in a decrease of the thin films electrical resistance. Recently, with the assistance of electron beam deposition, we deposited atomic metal vapor of various lanthanide metals on the SWNT thin films with the idea that they would also form covalent interconnects between nanotube sidewalls. In the case of highly electropositive lanthanides, the possibility of hexahapto bonding combined with ionic character can be evaluated and theorized. We have reported the first use of lanthanides to enhance the conductivities of SWNT thin films and showed that these metals can not only form bis-hexahapto interconnects at the SWNT junctions but can also inject electrons into the conduction bands of the SWNTs, forming a new type of mixed covalent-ionic bonding in the SWNT network. By monitoring electrical resistance and taking spectroscopic measurements of the Near-Infrared region we are able to show the correlation between enhanced conductivity and suppression of the S 11 interband transition of semiconducting SWNTs. Potential applications of SWNT thin films as electrochromic windows require reversible modulation of the electronic structure. In order to fabricate SWNTs devices which allow for this behavior it is necessary to modulate the electronic structure by physical means such as the application of an electrical potential. We found that ionic solutions can assist with maintaining complete suppression of two Van Hove singularities in the Density of States of semiconducting SWNTs which results in optically transparent windows in the Near-Infrared region, similar to the effect seen with the incorporation of atomic lanthanide metals in thin films. We demonstrate this behavior to provide a route to nanotube based optoelectronic devices in which we use electric fields to reversibly dope the SWNT films and thereby achieve controllable modulation of optical properties of SWNT thin film.

A Review on Radio-Over-Fiber Technology-Based Integrated (Optical/Wireless) Networks

NASA Astrophysics Data System (ADS)

Rajpal, Shivika; Goyal, Rakesh

2017-06-01

In the present paper, radio-over-fiber (RoF) technology has been proposed, which is the integration of the optical and radio networks. With a high transmission capacity, comparatively low cost and low attenuation, optical fiber provides an ideal solution for accomplishing the interconnections. In addition, a radio system enables the significant mobility, flexibility and easy access. Therefore, the system integration can meet the increasing demands of subscribers for voice, data and multimedia services that require the access network to support high data rates at any time and any place inexpensively. RoF has the potentiality to the backbone of the wireless access network and it has gained significant momentum in the last decade as a potential last-mile access scheme. This paper gives the comprehensive review of RoF technology used in the communication system. Concept, applications, advantages and limitations of RoF technology are also discussed in this paper.

An integrated 12.5-Gb/s optoelectronic receiver with a silicon avalanche photodetector in standard SiGe BiCMOS technology.

PubMed

Youn, Jin-Sung; Lee, Myung-Jae; Park, Kang-Yeob; Rücker, Holger; Choi, Woo-Young

2012-12-17

An optoelectronic integrated circuit (OEIC) receiver is realized with standard 0.25-μm SiGe BiCMOS technology for 850-nm optical interconnect applications. The OEIC receiver consists of a Si avalanche photodetector, a transimpedance amplifier with a DC-balanced buffer, a tunable equalizer, and a limiting amplifier. The fabricated OEIC receiver successfully detects 12.5-Gb/s 2(31)-1 pseudorandom bit sequence optical data with the bit-error rate less than 10(-12) at incident optical power of -7 dBm. The OEIC core has 1000 μm x 280 μm chip area, and consumes 59 mW from 2.5-V supply. To the best of our knowledge, this OEIC receiver achieves the highest data rate with the smallest sensitivity as well as the best power efficiency among integrated OEIC receivers fabricated with standard Si technology.

Silicon nanowire photodetectors made by metal-assisted chemical etching

NASA Astrophysics Data System (ADS)

Xu, Ying; Ni, Chuan; Sarangan, Andrew

2016-09-01

Silicon nanowires have unique optical effects, and have potential applications in photodetectors. They can exhibit simple optical effects such as anti-reflection, but can also produce quantum confined effects. In this work, we have fabricated silicon photodetectors, and then post-processed them by etching nanowires on the incident surface. These nanowires were produced by a wet-chemical etching process known as the metal-assisted-chemical etching, abbreviated as MACE. N-type silicon substrates were doped by thermal diffusion from a solid ceramic source, followed by etching, patterning and contact metallization. The detectors were first tested for functionality and optical performance. The nanowires were then made by depositing an ultra-thin film of gold below its percolation thickness to produce an interconnected porous film. This was then used as a template to etch high aspect ratio nanowires into the face of the detectors with a HF:H2O2 mixture.

Indoor and outdoor characterization of the HIRL prototype: An innovative highly integrated receiverless LCPV concept using multijunction cells

NASA Astrophysics Data System (ADS)

Weick, Clément; De Betelu, Romain; Tauzin, Aurélie; Baudrit, Mathieu

2017-09-01

Concentrator photovoltaic (CPV) modules are composed of many components and interfaces, which require complex assembling processes, resulting in fabrication complexity and often lack of reliability. The present work addresses these issues, by proposing an innovative low concentration photovoltaic (LCPV) concept. In particular, the purpose here is to develop a module with a high level of integration by lowering the number of components and interfaces. The mirror used as the concentrator optic is multifunctional, as it combines thermal, structural and optical function. Moreover, the proposed design claims to demonstrate the applicability of reliable flat PV processes (such as lamination and cells interconnections), for the manufacturing of this LCPV module. The paper describes both indoor and outdoor characterization of a new prototype. Performances by means of IV curves tracing will be discussed regarding the losses distribution within the optical chain.

Motivation for DOC III: 64-bit digital optical computer

NASA Astrophysics Data System (ADS)

Guilfoyle, Peter S.

1991-09-01

This paper suggests a new class of digital logic. OptiComp has focused on a digital optical logic family in order to capitalize on the inherent benefits of optical computing, which include (1) high FAN-IN and FAN-OUT, (2) low power consumption, (3) high noise margin, (4) high algorithmic efficiency using 'smart' interconnects, (5) free space leverage of GIBP (gate interconnect bandwidth product). Other well-known secondary advantages of optical logic include (but are not limited to) zero capacitive loading of signals at a detector, zero cross-talk between signals, zero signal dispersion, minimal clock skew (a few picoseconds or less in an imaging system). The primary focus of this paper is to demonstrate how each of the five advantages can be used to leverage other logic family performance such as GaAs; the secondary attributes will be discussed only in the context of introducing the DOC III architecture.

Motivation for DOC III: 64-bit digital optical computer

NASA Astrophysics Data System (ADS)

Guilfoyle, Peter S.

1991-09-01

The objective of this paper is to motivate a new class of digital logic. OptiComp has focused on a digital optical logic family in order to capitalize on the inherent benefits of optical computing, which include: (1) high FAN-IN and FAN-OUT, (2) low power consumption, (3) high noise margin, (4) high algorithmic efficiency using 'smart' interconnects, (5) free space leverage of GIBP (gate interconnect bandwidth product). Other well-known secondary advantages of optical logic include (but are not limited to): zero capacitive loading of signals at a detector, zero cross-talk between signals, zero signal dispersion, and minimal clock skew (a few picoseconds or less in an imaging system). The primary focus of this paper is on demonstrating how each of the five advantages can be used to leverage other logic family performance such as GaAs; the secondary attributes will be discussed only in the context of introducing the DOC III architecture.

Mode selecting switch using multimode interference for on-chip optical interconnects.

PubMed

Priti, Rubana B; Pishvai Bazargani, Hamed; Xiong, Yule; Liboiron-Ladouceur, Odile

2017-10-15

A novel mode selecting switch (MSS) is experimentally demonstrated for on-chip mode-division multiplexing (MDM) optical interconnects. The MSS consists of a Mach-Zehnder interferometer with tapered multi-mode interference couplers and TiN thermo-optic phase shifters for conversion and switching between the optical data encoded on the fundamental and first-order quasi-transverse electric (TE) modes. The C-band MSS exhibits a >25  dB switching extinction ratio and < -12 dB crosstalk. We validate the dynamic switching with a 25.8 kHz gating signal measuring switching times for both TE0 and TE1 modes of <10.9  μs. All channels exhibit less than 1.7 dB power penalty at a 10 -12 bit error rate, while switching the non-return-to-zero PRBS-31 data signals at 10  Gb/s.

III–V quantum light source and cavity-QED on Silicon

PubMed Central

Luxmoore, I. J.; Toro, R.; Pozo-Zamudio, O. Del; Wasley, N. A.; Chekhovich, E. A.; Sanchez, A. M.; Beanland, R.; Fox, A. M.; Skolnick, M. S.; Liu, H. Y.; Tartakovskii, A. I.

2013-01-01

Non-classical light sources offer a myriad of possibilities in both fundamental science and commercial applications. Single photons are the most robust carriers of quantum information and can be exploited for linear optics quantum information processing. Scale-up requires miniaturisation of the waveguide circuit and multiple single photon sources. Silicon photonics, driven by the incentive of optical interconnects is a highly promising platform for the passive optical components, but integrated light sources are limited by silicon's indirect band-gap. III–V semiconductor quantum-dots, on the other hand, are proven quantum emitters. Here we demonstrate single-photon emission from quantum-dots coupled to photonic crystal nanocavities fabricated from III–V material grown directly on silicon substrates. The high quality of the III–V material and photonic structures is emphasized by observation of the strong-coupling regime. This work opens-up the advantages of silicon photonics to the integration and scale-up of solid-state quantum optical systems. PMID:23393621

850-nm Zn-diffusion vertical-cavity surface-emitting lasers with with oxide-relief structure for high-speed and energy-efficient optical interconnects from very-short to medium (2km) reaches

NASA Astrophysics Data System (ADS)

Shi, Jin-Wei; Wei, Chia-Chien; Chen, Jason (Jyehong); Yang, Ying-Jay

2015-03-01

High-speed and "green" ~850 nm vertical-cavity surface-emitting lasers (VCSELs) have lately attracted lots of attention due to their suitability for applications in optical interconnects (OIs). To further enhance the speed and its maximum allowable linking distance of VCSELs are two major trends to meet the requirement of OI in next generation data centers. Recently, by use of the advanced 850 nm VCSEL technique, data rate as high as 64 Gbit/sec over 57m and 20 Gbit/sec over 2km MMF transmission have been demonstrated, respectively. Here, we will review our recent work about 850 nm Zn-diffusion VCSELs with oxide-relief apertures to further enhance the above-mentioned performances. By using Zn-diffusion, we can not only reduce the device resistance but also manipulate the number of optical modes to benefit transmission. Combing such device, which has excellent single-mode (SMSR >30 dB) and high-power (~7mW) performance, with advanced modulation format (OFDM), record-high bit-rate-distance-product through MMF (2.3 km×28 Gbit/sec) has been demonstrated. Furthermore, by selective etching away the oxide aperture inside Zn-diffusion VCSEL, significant enhancement of device speed, D-factor, and reliability can be observed. With such unique VCSEL structure, >40 Gbit/sec energy-efficient transmission over 100m MMF under extremely low-driving current density (<10kA/cm2) has been successfully demonstrated.

Heterogeneously integrated microsystem-on-a-chip

DOEpatents

Chanchani, Rajen [Albuquerque, NM

2008-02-26

A microsystem-on-a-chip comprises a bottom wafer of normal thickness and a series of thinned wafers can be stacked on the bottom wafer, glued and electrically interconnected. The interconnection layer comprises a compliant dielectric material, an interconnect structure, and can include embedded passives. The stacked wafer technology provides a heterogeneously integrated, ultra-miniaturized, higher performing, robust and cost-effective microsystem package. The highly integrated microsystem package, comprising electronics, sensors, optics, and MEMS, can be miniaturized both in volume and footprint to the size of a bottle-cap or less.

Real-time validation of receiver state information in optical space-time block code systems.

PubMed

Alamia, John; Kurzweg, Timothy

2014-06-15

Free space optical interconnect (FSOI) systems are a promising solution to interconnect bottlenecks in high-speed systems. To overcome some sources of diminished FSOI performance caused by close proximity of multiple optical channels, multiple-input multiple-output (MIMO) systems implementing encoding schemes such as space-time block coding (STBC) have been developed. These schemes utilize information pertaining to the optical channel to reconstruct transmitted data. The STBC system is dependent on accurate channel state information (CSI) for optimal system performance. As a result of dynamic changes in optical channels, a system in operation will need to have updated CSI. Therefore, validation of the CSI during operation is a necessary tool to ensure FSOI systems operate efficiently. In this Letter, we demonstrate a method of validating CSI, in real time, through the use of moving averages of the maximum likelihood decoder data, and its capacity to predict the bit error rate (BER) of the system.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Thomas, H. P.; Basso, T. S.; Kroposki, B.

The Department of Energy (DOE) Distributed Power Program (DPP) is conducting work to complete, validate in the field, and support the development of a national interconnection standard for distributed energy resources (DER), and to address the institutional and regulatory barriers slowing the commercial adoption of DER systems. This work includes support for the IEEE standards, including P1547 Standard for Interconnecting Distributed Resources with Electric Power Systems, P1589 Standard for Conformance Test Procedures for Equipment Interconnecting Distributed Resources with Electric Power Systems, and the P1608 Application Guide. Work is also in progress on system integration research and development (R&D) on themore » interface and control of DER with local energy systems. Additional efforts are supporting high-reliability power for industry, evaluating innovative concepts for DER applications, and exploring plug-and-play interface and control technologies for intelligent autonomous interconnection systems. This paper summarizes (1) the current status of the IEEE interconnection standards and application guides in support of DER, and (2) the R&D in progress at the National Renewable Energy Laboratory (NREL) for interconnection and system integration and application of distributed energy resources.« less

Microgroove fabrication with excimer laser ablation techniques for optical fiber array alignment purposes

NASA Astrophysics Data System (ADS)

Naessens, Kris; Van Hove, An; Coosemans, Thierry; Verstuyft, Steven; Vanwassenhove, Luc; Van Daele, Peter; Baets, Roel G.

2000-11-01

Currently, an ever increasing need for bandwidth, compactness and efficiency characterizes the world of interconnect and data communication. This tendency has already led to serial links being gradually replaced by parallel optical interconnect solutions. However, as the maximum capacity for the latter will be reached in the near future, new approaches are required to meet demand. One possible option is to switch to 2D parallel implementations of fiber arrays. In this paper we present the fabrication of a 2D connector for coupling a 4x8 array of plastic optical fibers to RCLED or VCSEL arrays. The connector consists primarily of dedicated PMMA plates in which arrays of 8 precisely dimensioned grooves at a pitch of 250 micrometers are introduced. The trenches are each 127 micrometers deep and their width is optimized to allow fixation of plastic optical fibers. We used excimer laser ablation for prototype fabrication of these alignment microstructures. In a later stage, the plates can be replicated using standard molding techniques. The laser ablation technique is extremely well suited for rapid prototyping and proves to be a versatile process yielding high accuracy dimensioning and repeatability of features in a wide diversity of materials. The dependency of the performance in terms of quality of the trenches (bottom roughness) and wall angle on various parameters (wavelength, energy density, pulse frequency and substrate material) is discussed. The fabricated polymer sheets with grooves are used to hold optical fibers by means of a UV-curable adhesive. In a final phase, the plates are stacked and glued in order to realize the 2D-connector of plastic optical fibers for short distance optical interconnects.

Polyhedral integrated and free space optical interconnection

DOEpatents

Erteza, I.A.

1998-01-06

An optical communication system uses holographic optical elements to provide guided wave and non-guided communication, resulting in high bandwidth, high connectivity optical communications. Holograms within holographic optical elements route optical signals between elements and between nodes connected to elements. Angular and wavelength multiplexing allow the elements to provide high connectivity. The combination of guided and non-guided communication allows compact polyhedral system geometries. Guided wave communications provided by multiplexed substrate-mode holographic optical elements eases system alignment. 7 figs.

Polyhedral integrated and free space optical interconnection

DOEpatents

Erteza, Ireena A.

1998-01-01

An optical communication system uses holographic optical elements to provide guided wave and non-guided communication, resulting in high bandwidth, high connectivity optical communications. Holograms within holographic optical elements route optical signals between elements and between nodes connected to elements. Angular and wavelength multiplexing allow the elements to provide high connectivity. The combination of guided and non-guided communication allows compact polyhedral system geometries. Guided wave communications provided by multiplexed substrate-mode holographic optical elements eases system alignment.

Si-rich SiNx based Kerr switch enables optical data conversion up to 12 Gbit/s

PubMed Central

Lin, Gong-Ru; Su, Sheng-Pin; Wu, Chung-Lun; Lin, Yung-Hsiang; Huang, Bo-Ji; Wang, Huai-Yung; Tsai, Cheng-Ting; Wu, Chih-I; Chi, Yu-Chieh

2015-01-01

Silicon photonic interconnection on chip is the emerging issue for next-generation integrated circuits. With the Si-rich SiNx micro-ring based optical Kerr switch, we demonstrate for the first time the wavelength and format conversion of optical on-off-keying data with a bit-rate of 12 Gbit/s. The field-resonant nonlinear Kerr effect enhances the transient refractive index change when coupling the optical data-stream into the micro-ring through the bus waveguide. This effectively red-shifts the notched dip wavelength to cause the format preserved or inversed conversion of data carried by the on-resonant or off-resonant probe, respectively. The Si quantum dots doped Si-rich SiNx strengthens its nonlinear Kerr coefficient by two-orders of magnitude higher than that of bulk Si or Si3N4. The wavelength-converted and cross-amplitude-modulated probe data-stream at up to 12-Gbit/s through the Si-rich SiNx micro-ring with penalty of −7 dB on transmission has shown very promising applicability to all-optical communication networks. PMID:25923653

Si-rich SiNx based Kerr switch enables optical data conversion up to 12 Gbit/s.

PubMed

Lin, Gong-Ru; Su, Sheng-Pin; Wu, Chung-Lun; Lin, Yung-Hsiang; Huang, Bo-Ji; Wang, Huai-Yung; Tsai, Cheng-Ting; Wu, Chih-I; Chi, Yu-Chieh

2015-04-29

Silicon photonic interconnection on chip is the emerging issue for next-generation integrated circuits. With the Si-rich SiNx micro-ring based optical Kerr switch, we demonstrate for the first time the wavelength and format conversion of optical on-off-keying data with a bit-rate of 12 Gbit/s. The field-resonant nonlinear Kerr effect enhances the transient refractive index change when coupling the optical data-stream into the micro-ring through the bus waveguide. This effectively red-shifts the notched dip wavelength to cause the format preserved or inversed conversion of data carried by the on-resonant or off-resonant probe, respectively. The Si quantum dots doped Si-rich SiNx strengthens its nonlinear Kerr coefficient by two-orders of magnitude higher than that of bulk Si or Si3N4. The wavelength-converted and cross-amplitude-modulated probe data-stream at up to 12-Gbit/s through the Si-rich SiNx micro-ring with penalty of -7 dB on transmission has shown very promising applicability to all-optical communication networks.

Silicon photonics devices for metro applications

NASA Astrophysics Data System (ADS)

Fukuda, H.; Kikuchi, K.; Jizodo, M.; Kawamura, Y.; Takeda, K.; Honda, K.

2017-01-01

Digital coherent technology is considered an attractive way of realizing both high-speed metro links and long distance transmissions. In metro areas, there is a strong demand for a smaller, faster transceiver module. This demand is mainly driven by the rapidly increasing data center interconnection traffic, where transmission capacity per faceplane is a key feature. Therefore, optical integration technology is desired. Since compensation in digital coherent technology is performed in the electrical or digital domain, users can deal with those optics performances that are not compensated for digitally. This means using a new material that cannot provide perfect characteristics but that is suitable for miniaturization and integration is possible. Silicon photonics (SiPh) is considered an attractive technology that would enable the significant miniaturization of optical circuits and be capable of optical integration with high manufacturability. While SiPh-based devices have begun to be deployed for very short or short reach links on the basis of direct detection technology, their digital coherent applications have recently been investigated in view of their integration capability. This paper describes recent progress on SiPh-based integrated optical devices for high-speed digital coherent transceivers targeting metro links. An optical modulator and receiver with related circuits have been integrated into a single SiPh chip. TEC-free operation under non-hermetic conditions and the direct attachment of optical fibers have both been realized. Very thin and small packaging with sufficient performance has been demonstrated by using the SiPh chip co-packaged with high-speed ICs.

Electrical contacts between cathodes and metallic interconnects in solid oxide fuel cells

NASA Astrophysics Data System (ADS)

Yang, Zhenguo; Xia, Guanguang; Singh, Prabhakar; Stevenson, Jeffry W.

In this work, simulated cathode/interconnect structures were used to investigate the effects of different contact materials on the contact resistance between a strontium doped lanthanum ferrite cathode and a Crofer22 APU interconnect. Among the materials studied, Pt, which has a prohibitive cost for the application, demonstrated the best performance as a contact paste. For the relatively cost-effective perovskites, the contact ASR was found to depend on their electrical conductivity, scale growth on the metallic interconnect, and interactions between the contact material and the metallic interconnect or particularly the scale grown on the interconnect. Manganites appeared to promote manganese-containing spinel interlayer formation that helped minimize the increase of contact ASR. Chromium from the interconnects reacted with strontium in the perovskites to form SrCrO 4. An improved performance was achieved by application of a thermally grown (Mn,Co) 3O 4 spinel protection layer on Crofer22 APU that dramatically minimized the contact resistance between the cathodes and interconnects.

Monolithic interconnected module with a tunnel junction for enhanced electrical and optical performance

DOEpatents

Murray, Christopher S.; Wilt, David M.

2000-01-01

An improved thermophotovoltaic (TPV) n/p/n device is provided. Monolithic Interconnected Modules (MIMS), semiconductor devices converting infrared radiation to electricity, have been developed with improved electrical and optical performance. The structure is an n-type emitter on a p-type base with an n-type lateral conduction layer. The incorporation of a tunnel junction and the reduction in the amount of p-type material used results in negligible parasitic absorption, decreased series resistance, increased voltage and increased active area. The novel use of a tunnel junction results in the potential for a TPV device with efficiency greater than 24%.

Cellular computational platform and neurally inspired elements thereof

DOEpatents

Okandan, Murat

2016-11-22

A cellular computational platform is disclosed that includes a multiplicity of functionally identical, repeating computational hardware units that are interconnected electrically and optically. Each computational hardware unit includes a reprogrammable local memory and has interconnections to other such units that have reconfigurable weights. Each computational hardware unit is configured to transmit signals into the network for broadcast in a protocol-less manner to other such units in the network, and to respond to protocol-less broadcast messages that it receives from the network. Each computational hardware unit is further configured to reprogram the local memory in response to incoming electrical and/or optical signals.

Shift-phase code multiplexing technique for holographic memories and optical interconnection

NASA Astrophysics Data System (ADS)

Honma, Satoshi; Muto, Shinzo; Okamoto, Atsushi

2008-03-01

Holographic technologies for optical memories and interconnection devices have been studied actively because of high storage capacity, many wiring patterns and high transmission rate. Among multiplexing techniques such as angular, phase code and wavelength-multiplexing, speckle multiplexing technique have gotten attention due to the simple optical setup having an adjustable random phase filter in only one direction. To keep simple construction and to suppress crosstalk among adjacent page data or wiring patterns for efficient holographic memories and interconnection, we have to consider about optimum randomness of the phase filter. The high randomness causes expanding an illumination area of reference beam on holographic media. On the other hands, the small randomness causes the crosstalk between adjacent hologram data. We have proposed the method of holographic multiplexing, shift-phase code multiplexing with a two-dimensional orthogonal matrix phase filter. A lot of orthogonal phase codes can be produced by shifting the phase filter in one direction. It is able to read and record the individual holograms with low crosstalk. We give the basic experimental result on holographic data multiplexing and consider the phase pattern of the filter to suppress the crosstalk between adjacent holograms sufficiently.

OSI Upper Layers Support for Applications.

ERIC Educational Resources Information Center

Davison, Wayne

1990-01-01

Discusses how various Open Systems Interconnection (OSI) application layer protocols can be used together, along with the Presentation and Session protocols, to support the interconnection requirements of applications. Application layer protocol standards that are currently available or under development are reviewed, and the File, Transfer,…

A smart-pixel holographic competitive learning network

NASA Astrophysics Data System (ADS)

Slagle, Timothy Michael

Neural networks are adaptive classifiers which modify their decision boundaries based on feedback from externally- or internally-generated error signals. Optics is an attractive technology for neural network implementation because it offers the possibility of parallel, nearly instantaneous computation of the weighted neuron inputs by the propagation of light through the optical system. Using current optical device technology, system performance levels of 3 × 1011 connection updates per second can be achieved. This thesis presents an architecture for an optical competitive learning network which offers advantages over previous optical implementations, including smart-pixel-based optical neurons, phase- conjugate self-alignment of a single neuron plane, and high-density, parallel-access weight storage, interconnection, and learning in a volume hologram. The competitive learning algorithm with modifications for optical implementation is described, and algorithm simulations are performed for an example problem. The optical competitive learning architecture is then introduced. The optical system is simulated using the ``beamprop'' algorithm at the level of light propagating through the system components, and results showing competitive learning operation in agreement with the algorithm simulations are presented. The optical competitive learning requires a non-linear, non-local ``winner-take-all'' (WTA) neuron function. Custom-designed smart-pixel WTA neuron arrays were fabricated using CMOS VLSI/liquid crystal technology. Results of laboratory tests of the WTA arrays' switching characteristics, time response, and uniformity are then presented. The system uses a phase-conjugate mirror to write the self-aligning interconnection weight holograms, and energy gain is required from the reflection to minimize erasure of the existing weights. An experimental system for characterizing the PCM response is described. Useful gains of 20 were obtained with a polarization-multiplexed PCM readout, and gains of up to 60 were observed when a time-sequential read-out technique was used. Finally, the optical competitive learning laboratory system is described, including some necessary modifications to the previous architectures, and the data acquisition and control system developed for the system. Experimental results showing phase conjugation of the WTA outputs, holographic interconnect storage, associative storage between input images and WTA neuron outputs, and WTA array switching are presented, demonstrating the functions necessary for the operation of the optical learning system.

A Novel, Free-Space Optical Interconnect Employing Vertical-Cavity Surface Emitting Laser Diodes and InGaAs Metal-Semiconductor-Metal Photodetectors for Gbit/s RF/Microwave Systems

NASA Technical Reports Server (NTRS)

Savich, Gregory R.; Simons, Rainee N.

2006-01-01

Emerging technologies and continuing progress in vertical-cavity surface emitting laser (VCSEL) diode and metal-semiconductor-metal (MSM) photodetector research are making way for novel, high-speed forms of optical data transfer in communication systems. VCSEL diodes operating at 1550 nm have only recently become commercially available, while MSM photodetectors are pushing the limits of contact lithography with interdigitated electrode widths reaching sub micron levels. We propose a novel, free-space optical interconnect operating at about 1Gbit/s utilizing VCSEL diodes and MSM photodetectors. We report on development, progress, and current work, which are as follows: first, analysis of the divergent behavior of VCSEL diodes for coupling to MSM photodetectors with a 50 by 50 m active area and second, the normalized frequency response of the VCSEL diode as a function of the modulating frequency. Third, the calculated response of MSM photodetectors with varying electrode width and spacing on the order of 1 to 3 m as well as the fabrication and characterization of these devices. The work presented here will lead to the formation and characterization of a fully integrated 1Gbit/s free-space optical interconnect at 1550 nm and demonstrates both chip level and board level functionality for RF/microwave digital systems.

VCSELs for exascale computing, computer farms, and green photonics

NASA Astrophysics Data System (ADS)

Hofmann, Werner; Moser, Philip; Wolf, Philip; Larisch, Gunter; Li, Hui; Li, Wei; Lott, James; Bimberg, Dieter

2012-11-01

The bandwidth-induced communication bottleneck due to the intrinsic limitations of metal interconnects is inhibiting the performance and environmental friendliness of todaýs supercomputers, data centers, and in fact all other modern electrically interconnected and interoperable networks such as data farms and "cloud" fabrics. The same is true for systems of optical interconnects (OIs), where even when the metal interconnects are replaced with OIs the systems remain limited by bandwidth, physical size, and most critically the power consumption and lifecycle operating costs. Vertical-cavity surface-emitting lasers (VCSELs) are ideally suited to solve this dilemma. Global communication providers like Google Inc., Intel Inc., HP Inc., and IBM Inc. are now producing optical interconnects based on VCSELs. The optimal bandwidth per link may be analyzed by by using Amdahĺs Law and depends on the architecture of the data center and the performance of the servers within the data center. According to Google Inc., a bandwidth of 40 Gb/s has to be accommodated in the future. IBM Inc. demands 80 Tbps interconnects between solitary server chips in 2020. We recently realized ultrahigh bit rate VCSELs up to 49 Gb/s suited for such optical interconnects emitting at 980 nm. These devices show error-free transmission at temperatures up to 155°C and operate beyond 200°C. Single channel data-rates of 40 Gb/s were achieved up to 75°C. Record high energy efficiencies close to 50 fJ/bit were demonstrated for VCSELs emitting at 850 nm. Our devices are fabricated using a full three-inch wafer process, and the apertures were formed by in-situ controlled selective wet oxidation using stainless steel-based vacuum equipment of our own design. assembly, and operation. All device data are measured, recorded, and evaluated by our proprietary fully automated wafer mapping probe station. The bandwidth density of our present devices is expected to be scalable from about 100 Gbps/mm² to a physical limit of roughly 15 Tbps/mm² based on the current 12.5 Gb/s VCSEL technology. Still more energy-efficient and smaller volume laser diode devices dissipating less heat are mandatory for further up scaling of the bandwidth. Novel metal-clad VCSELs enable a reduction of the device's footprint for potentially ultrashort range interconnects by 1 to 2 orders of magnitude compared to conventional VCSELs thus enabling a similar increase of device density and bandwidth.

Interchip link system using an optical wiring method.

PubMed

Cho, In-Kui; Ryu, Jin-Hwa; Jeong, Myung-Yung

2008-08-15

A chip-scale optical link system is presented with a transmitter/receiver and optical wire link. The interchip link system consists of a metal optical bench, a printed circuit board module, a driver/receiver integrated circuit, a vertical cavity surface-emitting laser/photodiode array, and an optical wire link composed of plastic optical fibers (POFs). We have developed a downsized POF and an optical wiring method that allows on-site installation with a simple annealing as optical wiring technologies for achieving high-density optical interchip interconnection within such devices. Successful data transfer measurements are presented.

Calculation of near optimum design of InP/In(0.53)Ga(0.47)As monolithic tandem solar cells

NASA Technical Reports Server (NTRS)

Renaud, P.; Vilela, M. F.; Freundlich, A.; Medelci, N.; Bensaoula, A.

1994-01-01

An analysis of InP/GaAs tandem solar cell structure has been undertaken to allow for maximum AMO conversion efficiencies (space applications) while still taking into account both the theoretical and technological limitations. The dependence of intrinsic and extrinsic parameters such as diffusion lengths and generation-recombination (GR) lifetimes on N/P and P/N devices performances are clearly demonstrated. We also report for the first time the improvement attainable through the use of a new patterned tunnel junction as the inter cell ohmic interconnect. Such a design minimizes the light absorption in the interconnect region and leads to a noticeable increase in the cell efficiency. Our computations predict 27 percent AMO efficiency for N/P tandems with ideality factor gamma = 2 (GR lifetimes approximately equal 1 micron), and 36 percent for gamma = 1 (GR lifetimes approximately equals 100 microns). The method of optimization and the values of the physical and optical parameters are discussed.

Optical interconnects for satellite payloads: overview of the state-of-the-art

NASA Astrophysics Data System (ADS)

Vervaeke, Michael; Debaes, Christof; Van Erps, Jürgen; Karppinen, Mikko; Tanskanen, Antti; Aalto, Timo; Harjanne, Mikko; Thienpont, Hugo

2010-05-01

The increased demand of broadband communication services like High Definition Television, Video On Demand, Triple Play, fuels the technologies to enhance the bandwidth of individual users towards service providers and hence the increase of aggregate bandwidths on terrestial networks. Optical solutions clearly leverage the bandwidth appetite easily whereas electrical interconnection schemes require an ever-increasing effort to counteract signal distortions at higher bitrates. Dense wavelength division multiplexing and all-optical signal regeneration and switching solve the bandwidth demands of network trunks. Fiber-to-the-home, and fiber-to-the-desk are trends towards providing individual users with greatly increased bandwidth. Operators in the satellite telecommunication sector face similar challenges fuelled by the same demands as for their terrestial counterparts. Moreover, the limited number of orbital positions for new satellites set the trend for an increase in payload datacommunication capacity using an ever-increasing number of complex multi-beam active antennas and a larger aggregate bandwidth. Only satellites with very large capacity, high computational density and flexible, transparent fully digital payload solutions achieve affordable communication prices. To keep pace with the bandwidth and flexibility requirements, designers have to come up with systems requiring a total digital througput of a few Tb/s resulting in a high power consuming satellite payload. An estimated 90 % of the total power consumption per chip is used for the off-chip communication lines. We have undertaken a study to assess the viability of optical datacommunication solutions to alleviate the demands regarding power consumption and aggregate bandwidth imposed on future satellite communication payloads. The review on optical interconnects given here is especially focussed on the demands of the satellite communication business and the particular environment in which the optics have to perform their functionality: space.

Controllable optical modulation of blue/green up-conversion fluorescence from Tm3+ (Er3+) single-doped glass ceramics upon two-step excitation of two-wavelengths

PubMed Central

Chen, Zhi; Kang, Shiliang; Zhang, Hang; Wang, Ting; Lv, Shichao; Chen, Qiuqun; Dong, Guoping; Qiu, Jianrong

2017-01-01

Optical modulation is a crucial operation in photonics for network data processing with the aim to overcome information bottleneck in terms of speed, energy consumption, dispersion and cross-talking from conventional electronic interconnection approach. However, due to the weak interactions between photons, a facile physical approach is required to efficiently manipulate photon-photon interactions. Herein, we demonstrate that transparent glass ceramics containing LaF3: Tm3+ (Er3+) nanocrystals can enable fast-slow optical modulation of blue/green up-conversion fluorescence upon two-step excitation of two-wavelengths at telecom windows (0.8–1.8 μm). We show an optical modulation of more than 1500% (800%) of the green (blue) up-conversion fluorescence intensity, and fast response of 280 μs (367 μs) as well as slow response of 5.82 ms (618 μs) in the green (blue) up-conversion fluorescence signal, respectively. The success of manipulating laser at telecom windows for fast-slow optical modulation from rear-earth single-doped glass ceramics may find application in all-optical fiber telecommunication areas. PMID:28368041

Compact holographic optical neural network system for real-time pattern recognition

NASA Astrophysics Data System (ADS)

Lu, Taiwei; Mintzer, David T.; Kostrzewski, Andrew A.; Lin, Freddie S.

1996-08-01

One of the important characteristics of artificial neural networks is their capability for massive interconnection and parallel processing. Recently, specialized electronic neural network processors and VLSI neural chips have been introduced in the commercial market. The number of parallel channels they can handle is limited because of the limited parallel interconnections that can be implemented with 1D electronic wires. High-resolution pattern recognition problems can require a large number of neurons for parallel processing of an image. This paper describes a holographic optical neural network (HONN) that is based on high- resolution volume holographic materials and is capable of performing massive 3D parallel interconnection of tens of thousands of neurons. A HONN with more than 16,000 neurons packaged in an attache case has been developed. Rotation- shift-scale-invariant pattern recognition operations have been demonstrated with this system. System parameters such as the signal-to-noise ratio, dynamic range, and processing speed are discussed.

Composite embedded fiber optic data links in Standard Electronic Modules

NASA Astrophysics Data System (ADS)

Ehlers, S. L.; Jones, K. J.; Morgan, R. E.; Hixson, Jay

1990-12-01

The goal of this project is to fabricate a chassis/circuit card demonstration entirely 'wired' with embedded and interconnected optical fibers. Graphite/epoxy Standard Electronic Module E (SEM-E) configured panels have been successfully fabricated. Fiber-embedded SEM-E configured panels have been subjected to simultaneous signal transmission and vibration testing. Packaging constraints will require tapping composite-embedded optical fibers at right angles to the direction of optical transmission.

40-Gb/s directly-modulated photonic crystal lasers under optical injection-locking

NASA Astrophysics Data System (ADS)

Chen, Chin-Hui; Takeda, Koji; Shinya, Akihiko; Nozaki, Kengo; Sato, Tomonari; Kawaguchi, Yoshihiro; Notomi, Masaya; Matsuo, Shinji

2011-08-01

CMOS integrated circuits (IC) usually requires high data bandwidth for off-chip input/output (I/O) data transport with sufficiently low power consumption in order to overcome pin-count limitation. In order to meet future requirements of photonic network interconnect, we propose an optical output device based on an optical injection-locked photonic crystal (PhC) laser to realize low-power and high-speed off-chip interconnects. This device enables ultralow-power operation and is suitable for highly integrated photonic circuits because of its strong light-matter interaction in the PhC nanocavity and ultra-compact size. High-speed operation is achieved by using the optical injection-locking (OIL) technique, which has been shown as an effective means to enhance modulation bandwidth beyond the relaxation resonance frequency limit. In this paper, we report experimental results of the OIL-PhC laser under various injection conditions and also demonstrate 40-Gb/s large-signal direct modulation with an ultralow energy consumption of 6.6 fJ/bit.

Ultrahigh refractive index chalcogenide based copolymers for infrared optics (Conference Presentation)

NASA Astrophysics Data System (ADS)

Anderson, Laura E.; Namnabat, Soha; Char, Kookheon; Glass, Richard; Norwood, Robert A.; Pyun, Jeffrey

2016-09-01

Current trends in technology development demand increased miniaturization and higher level integration of electronic and photonic components. Such needs arise in emerging imaging systems, optoelectronic devices, optical interconnects and photonic integrated circuits. Compact, integrated photonics requires high refractive index materials, which primarily comprise crystalline and amorphous semiconductors, as well as chalcogenide glasses, which can possess refractive indices higher than 4 and good infrared transparency. There is currently no high refractive index (n 2 or above) that has the low cost production and ease of processing available in optical polymers. Such polymers would potentially cover applications that are not convenient or possible with crystalline and vitreous semiconductors. Examples of such applications include micro lens arrays for image sensors, optical adhesives for bonding and antireflection coatings, and high contrast optical waveguides. While much of the focus has been in the telecommunications transparency regions, significant new opportunities exist for a polymer which is capable of transmitting efficiently in the MWIR region. While there are polymers that have been synthesized with refractive indices as high as 1.75, these polymers are generally conjugated and incorporate heteroatoms such as sulfur or metals, and generally have complex and expensive syntheses. Here we report on new chalcogenide based copolymers with very high refractive index (n 2) that also have good optical transmission properties in the near-, short- and mid-wave infrared up to 5µm. These polymers are rich in sulfur, have low hydrogen content and were made using inverse vulcanization.

Ultra-thin silicon (UTSi) on insulator CMOS transceiver and time-division multiplexed switch chips for smart pixel integration

NASA Astrophysics Data System (ADS)

Zhang, Liping; Sawchuk, Alexander A.

2001-12-01

We describe the design, fabrication and functionality of two different 0.5 micron CMOS optoelectronic integrated circuit (OEIC) chips based on the Peregrine Semiconductor Ultra-Thin Silicon on insulator technology. The Peregrine UTSi silicon- on-sapphire (SOS) technology is a member of the silicon-on- insulator (SOI) family. The low-loss synthetic sapphire substrate is optically transparent and has good thermal conductivity and coefficient of thermal expansion properties, which meet the requirements for flip-chip bonding of VCSELs and other optoelectronic input-output components. One chip contains transceiver and network components, including four channel high-speed CMOS transceiver modules, pseudo-random bit stream (PRBS) generators, a voltage controlled oscillator (VCO) and other test circuits. The transceiver chips can operate in both self-testing mode and networking mode. An on- chip clock and true-single-phase-clock (TSPC) D-flip-flop have been designed to generate a PRBS at over 2.5 Gb/s for the high-speed transceiver arrays to operate in self-testing mode. In the networking mode, an even number of transceiver chips forms a ring network through free-space or fiber ribbon interconnections. The second chip contains four channel optical time-division multiplex (TDM) switches, optical transceiver arrays, an active pixel detector and additional test devices. The eventual applications of these chips will require monolithic OEICs with integrated optical input and output. After fabrication and testing, the CMOS transceiver array dies will be packaged with 850 nm vertical cavity surface emitting lasers (VCSELs), and metal-semiconductor- metal (MSM) or GaAs p-i-n detector die arrays to achieve high- speed optical interconnections. The hybrid technique could be either wire bonding or flip-chip bonding of the CMOS SOS smart-pixel arrays with arrays of VCSELs and photodetectors onto an optoelectronic chip carrier as a multi-chip module (MCM).

Reliability of Ceramic Column Grid Array Interconnect Packages Under Extreme Temperatures

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2011-01-01

A paper describes advanced ceramic column grid array (CCGA) packaging interconnects technology test objects that were subjected to extreme temperature thermal cycles. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide were assembled, inspected nondestructively, and, subsequently, subjected to ex - treme-temperature thermal cycling to assess reliability for future deep-space, short- and long-term, extreme-temperature missions. The test hardware consisted of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The package is 33 33 mm with a 27 27 array of 80%/20% Pb/Sn columns on a 1.27-mm pitch. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of the increasing number of thermal cycles. Several catastrophic failures were observed after 137 extreme-temperature thermal cycles, as per electrical resistance measurements, and then the tests were continued through 1,058 thermal cycles to corroborate and understand the test results. X-ray and optical inspection have been made after thermal cycling. Optical inspections were also conducted on the CCGA vs. thermal cycles. The optical inspections were conclusive; the x-ray images were not. Process qualification and assembly is required to optimize the CCGA assembly, which is very clear from the x-rays. Six daisy chains were open out of seven daisy chains, as per experimental test data reported. The daisy chains are open during the cold cycle, and then recover during the hot cycle, though some of them also opened during the hot thermal cycle..

Numerical simulation of CTE mismatch and thermal-structural stresses in the design of interconnects

NASA Astrophysics Data System (ADS)

Peter, Geoffrey John M.

With the ever-increasing chip complexity, interconnects have to be designed to meet the new challenges. Advances in optical lithography have made chip feature sizes available today at 70 nm dimensions. With advances in Extreme Ultraviolet Lithography, X-ray Lithography, and Ion Projection Lithography it is expected that the line width will further decrease to 20 nm or less. With the decrease in feature size, the number of active devices on the chip increases. With higher levels of circuit integration, the challenge is to dissipate the increased heat flux from the chip surface area. Thermal management considerations include coefficient of thermal expansion (CTE) matching to prevent failure between the chip and the board. This in turn calls for improved system performance and reliability of the electronic structural systems. Experience has shown that in most electronic systems, failures are mostly due to CTE mismatch between the chip, board, and the solder joint (solder interconnect). The resulting high thermal-structural stress and strain due to CTE mismatch produces cracks in the solder joints with eventual failure of the electronic component. In order to reduce the thermal stress between the chip, board, and the solder joint, this dissertation examines the effect of inserting wire bundle (wire interconnect) between the chip and the board. The flexibility of the wires or fibers would reduce the stress at the rigid joints. Numerical simulations of two, and three-dimensional models of the solder and wire interconnects are examined. The numerical simulation is linear in nature and is based on linear isotropic material properties. The effect of different wire material properties is examined. The effect of varying the wire diameter is studied by changing the wire diameter. A major cause of electronic equipment failure is due to fatigue failure caused by thermal cycling, and vibrations. A two-dimensional modal and harmonic analysis was simulated for the wire interconnect and the solder interconnect. The numerical model simulated using ANSYS program was validated with the numerical/experimental results of other published researchers. In addition the results were cross-checked by IDEAS program. A prototype non-working wire interconnect is proposed to emphasize practical application. The numerical analysis, in this dissertation is based on a U.S. Patent granted to G. Peter(42).

Stretchable and semitransparent conductive hybrid hydrogels for flexible supercapacitors.

PubMed

Hao, Guang-Ping; Hippauf, Felix; Oschatz, Martin; Wisser, Florian M; Leifert, Annika; Nickel, Winfried; Mohamed-Noriega, Nasser; Zheng, Zhikun; Kaskel, Stefan

2014-07-22

Conductive polymers showing stretchable and transparent properties have received extensive attention due to their enormous potential in flexible electronic devices. Here, we demonstrate a facile and smart strategy for the preparation of structurally stretchable, electrically conductive, and optically semitransparent polyaniline-containing hybrid hydrogel networks as electrode, which show high-performances in supercapacitor application. Remarkably, the stability can extend up to 35,000 cycles at a high current density of 8 A/g, because of the combined structural advantages in terms of flexible polymer chains, highly interconnected pores, and excellent contact between the host and guest functional polymer phase.

Development of GaInNAs-based 1.3-μm VCSEL

NASA Astrophysics Data System (ADS)

Ramakrishnan, Arun; Ebbinghaus, G.; Lima, A.; Supper, D.; Kristen, Guenter; Popp, M.; Degen, C.; Althaus, H.-L.; Killer, T.; Scholz, R.; Melinde, M.; Sauter, M.; Weigert, M.; Riechert, Henning; Steinle, Gunther

2003-12-01

In this paper the realization, development and production of 1.3μm vertical cavity surface emitting lasers (VCSEL) with datacom suitable performance are presented. These low cost laser diodes are well suited for optical interconnect applications for LAN and MAN with transmission distances up to 15 km. The possibilities as well as the advantages and limits of shifting the wavelength from commercially available VCSEL emitting at 850nm to 1300nm are discussed. 1300nm VCSELs in a low cost SMD plastic package assembled into an intelligent SFP-module developed by Infineon Technologies are demonstrated.

Cosine-Gauss plasmon beam: a localized long-range nondiffracting surface wave.

PubMed

Lin, Jiao; Dellinger, Jean; Genevet, Patrice; Cluzel, Benoit; de Fornel, Frederique; Capasso, Federico

2012-08-31

A new surface wave is introduced, the cosine-Gauss beam, which does not diffract while it propagates in a straight line and tightly bound to the metallic surface for distances up to 80 μm. The generation of this highly localized wave is shown to be straightforward and highly controllable, with varying degrees of transverse confinement and directionality, by fabricating a plasmon launcher consisting of intersecting metallic gratings. Cosine-Gauss beams have potential for applications in plasmonics, notably for efficient coupling to nanophotonic devices, opening up new design possibilities for next-generation optical interconnects.

Theoretical study of nanophotonic directional couplers comprising near-field-coupled metal nanoparticles.

PubMed

Holmström, Petter; Yuan, Jun; Qiu, Min; Thylén, Lars; Bratkovsky, Alexander M

2011-04-11

The properties of integrated-photonics directional couplers composed of near-field-coupled arrays of metal nanoparticles are analyzed theoretically. It is found that it is possible to generate very compact, submicron length, high field-confinement and functionality devices with very low switch energies. The analysis is carried out for a hypothetical lossless silver to demonstrate the potential of this type of circuits for applications in telecom and interconnects. Employing losses of real silver, standalone devices with the above properties are still feasible in optimized metal nanoparticle structures. © 2011 Optical Society of America

mpiGraph

DOE Office of Scientific and Technical Information (OSTI.GOV)

Moody, Adam

2007-05-22

MpiGraph consists of an MPI application called mpiGraph written in C to measure message bandwidth and an associated crunch_mpiGraph script written in Perl to process the application output into an HTMO report. The mpiGraph application is designed to inspect the health and scalability of a high-performance interconnect while under heavy load. This is useful to detect hardware and software problems in a system, such as slow nodes, links, switches, or contention in switch routing. It is also useful to characterize how interconnect performance changes with different settings or how one interconnect type compares to another.

76 FR 39129 - Tensolite, LLC D/B/A Carlisle Interconnect Assemblies Including On-Site Leased Workers From Volt...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-07-05

... Carlisle Interconnect Assemblies Including On-Site Leased Workers From Volt Services Group and Adecco..., applicable to workers of Tensolite, LLC, d/b/a Carlisle Interconnect Assemblies, including on-site leased... interconnect assemblies. The notice was published in the Federal Register on September 2, 2009 (74 FR 45476...

Next-generation optical wireless communications for data centers

NASA Astrophysics Data System (ADS)

Arnon, Shlomi

2015-01-01

Data centers collect and process information with a capacity that has been increasing from year to year at an almost exponential pace. Traditional fiber/cable data center network interconnections suffer from bandwidth overload, as well as flexibility and scalability issues. Therefore, a technology-shift from the fiber and cable to wireless has already been initiated in order to meet the required data-rate, flexibility and scalability demands for next-generation data center network interconnects. In addition, the shift to wireless reduces the volume allocated to the cabling/fiber and increases the cooling efficiency. Optical wireless communication (OWC), or free space optics (FSO), is one of the most effective wireless technologies that could be used in future data centers and could provide ultra-high capacity, very high cyber security and minimum latency, due to the low index of refraction of air in comparison to fiber technologies. In this paper we review the main concepts and configurations for next generation OWC for data centers. Two families of technologies are reviewed: the first technology regards interconnects between rack units in the same rack and the second technology regards the data center network that connects the server top of rack (TOR) to the switch. A comparison between different network technologies is presented.

Fiber-Optic Network Architectures for Onboard Avionics Applications Investigated

NASA Technical Reports Server (NTRS)

Nguyen, Hung D.; Ngo, Duc H.

2003-01-01

This project is part of a study within the Advanced Air Transportation Technologies program undertaken at the NASA Glenn Research Center. The main focus of the program is the improvement of air transportation, with particular emphasis on air transportation safety. Current and future advances in digital data communications between an aircraft and the outside world will require high-bandwidth onboard communication networks. Radiofrequency (RF) systems, with their interconnection network based on coaxial cables and waveguides, increase the complexity of communication systems onboard modern civil and military aircraft with respect to weight, power consumption, and safety. In addition, safety and reliability concerns from electromagnetic interference between the RF components embedded in these communication systems exist. A simple, reliable, and lightweight network that is free from the effects of electromagnetic interference and capable of supporting the broadband communications needs of future onboard digital avionics systems cannot be easily implemented using existing coaxial cable-based systems. Fiber-optical communication systems can meet all these challenges of modern avionics applications in an efficient, cost-effective manner. The objective of this project is to present a number of optical network architectures for onboard RF signal distribution. Because of the emergence of a number of digital avionics devices requiring high-bandwidth connectivity, fiber-optic RF networks onboard modern aircraft will play a vital role in ensuring a low-noise, highly reliable RF communication system. Two approaches are being used for network architectures for aircraft onboard fiber-optic distribution systems: a hybrid RF-optical network and an all-optical wavelength division multiplexing (WDM) network.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Blansett, Ethan L.; Schroeppel, Richard Crabtree; Tang, Jason D.

With the build-out of large transport networks utilizing optical technologies, more and more capacity is being made available. Innovations in Dense Wave Division Multiplexing (DWDM) and the elimination of optical-electrical-optical conversions have brought on advances in communication speeds as we move into 10 Gigabit Ethernet and above. Of course, there is a need to encrypt data on these optical links as the data traverses public and private network backbones. Unfortunately, as the communications infrastructure becomes increasingly optical, advances in encryption (done electronically) have failed to keep up. This project examines the use of optical logic for implementing encryption in themore » photonic domain to achieve the requisite encryption rates. In order to realize photonic encryption designs, technology developed for electrical logic circuits must be translated to the photonic regime. This paper examines two classes of all optical logic (SEED, gain competition) and how each discrete logic element can be interconnected and cascaded to form an optical circuit. Because there is no known software that can model these devices at a circuit level, the functionality of the SEED and gain competition devices in an optical circuit were modeled in PSpice. PSpice allows modeling of the macro characteristics of the devices in context of a logic element as opposed to device level computational modeling. By representing light intensity as voltage, 'black box' models are generated that accurately represent the intensity response and logic levels in both technologies. By modeling the behavior at the systems level, one can incorporate systems design tools and a simulation environment to aid in the overall functional design. Each black box model of the SEED or gain competition device takes certain parameters (reflectance, intensity, input response), and models the optical ripple and time delay characteristics. These 'black box' models are interconnected and cascaded in an encrypting/scrambling algorithm based on a study of candidate encryption algorithms. We found that a low gate count, cascadable encryption algorithm is most feasible given device and processing constraints. The modeling and simulation of optical designs using these components is proceeding in parallel with efforts to perfect the physical devices and their interconnect. We have applied these techniques to the development of a 'toy' algorithm that may pave the way for more robust optical algorithms. These design/modeling/simulation techniques are now ready to be applied to larger optical designs in advance of our ability to implement such systems in hardware.« less

Dense modifiable interconnections utilizing photorefractive volume holograms

NASA Astrophysics Data System (ADS)

Psaltis, Demetri; Qiao, Yong

1990-11-01

This report describes an experimental two-layer optical neural network built at Caltech. The system uses photorefractive volume holograms to implement dense, modifiable synaptic interconnections and liquid crystal light valves (LCVS) to perform nonlinear thresholding operations. Kanerva's Sparse, Distributed Memory was implemented using this network and its ability to recognize handwritten character-alphabet (A-Z) has been demonstrated experimentally. According to Kanerva's model, the first layer has fixed, random weights of interconnections and the second layer is trained by sum-of-outer-products rule. After training, the recognition rates of the network on the training set (104 patterns) and test set (520 patterns) are 100 and 50 percent, respectively.

On-chip integratable all-optical quantizer using strong cross-phase modulation in a silicon-organic hybrid slot waveguide

PubMed Central

Kang, Zhe; Yuan, Jinhui; Zhang, Xianting; Sang, Xinzhu; Wang, Kuiru; Wu, Qiang; Yan, Binbin; Li, Feng; Zhou, Xian; Zhong, Kangping; Zhou, Guiyao; Yu, Chongxiu; Farrell, Gerald; Lu, Chao; Yaw Tam, Hwa; Wai, P. K. A.

2016-01-01

High performance all-optical quantizer based on silicon waveguide is believed to have significant applications in photonic integratable optical communication links, optical interconnection networks, and real-time signal processing systems. In this paper, we propose an integratable all-optical quantizer for on-chip and low power consumption all-optical analog-to-digital converters. The quantization is realized by the strong cross-phase modulation and interference in a silicon-organic hybrid (SOH) slot waveguide based Mach-Zehnder interferometer. By carefully designing the dimension of the SOH waveguide, large nonlinear coefficients up to 16,000 and 18,069 W−1/m for the pump and probe signals can be obtained respectively, along with a low pulse walk-off parameter of 66.7 fs/mm, and all-normal dispersion in the wavelength regime considered. Simulation results show that the phase shift of the probe signal can reach 8π at a low pump pulse peak power of 206 mW and propagation length of 5 mm such that a 4-bit all-optical quantizer can be realized. The corresponding signal-to-noise ratio is 23.42 dB and effective number of bit is 3.89-bit. PMID:26777054

Near-infrared sub-bandgap all-silicon photodetectors: state of the art and perspectives.

PubMed

Casalino, Maurizio; Coppola, Giuseppe; Iodice, Mario; Rendina, Ivo; Sirleto, Luigi

2010-01-01

Due to recent breakthroughs, silicon photonics is now the most active discipline within the field of integrated optics and, at the same time, a present reality with commercial products available on the market. Silicon photodiodes are excellent detectors at visible wavelengths, but the development of high-performance photodetectors on silicon CMOS platforms at wavelengths of interest for telecommunications has remained an imperative but unaccomplished task so far. In recent years, however, a number of near-infrared all-silicon photodetectors have been proposed and demonstrated for optical interconnect and power-monitoring applications. In this paper, a review of the state of the art is presented. Devices based on mid-bandgap absorption, surface-state absorption, internal photoemission absorption and two-photon absorption are reported, their working principles elucidated and their performance discussed and compared.

Near-Infrared Sub-Bandgap All-Silicon Photodetectors: State of the Art and Perspectives

PubMed Central

Casalino, Maurizio; Coppola, Giuseppe; Iodice, Mario; Rendina, Ivo; Sirleto, Luigi

2010-01-01

Due to recent breakthroughs, silicon photonics is now the most active discipline within the field of integrated optics and, at the same time, a present reality with commercial products available on the market. Silicon photodiodes are excellent detectors at visible wavelengths, but the development of high-performance photodetectors on silicon CMOS platforms at wavelengths of interest for telecommunications has remained an imperative but unaccomplished task so far. In recent years, however, a number of near-infrared all-silicon photodetectors have been proposed and demonstrated for optical interconnect and power-monitoring applications. In this paper, a review of the state of the art is presented. Devices based on mid-bandgap absorption, surface-state absorption, internal photoemission absorption and two-photon absorption are reported, their working principles elucidated and their performance discussed and compared. PMID:22163487

10 CFR 205.373 - Application procedures.

Code of Federal Regulations, 2013 CFR

2013-01-01

... interconnection: (i) Proposed location; (ii) Required thermal capacity or power transfer capability of the... interconnection: (i) Location; (ii) Thermal capacity of power transfer capability of interconnection facilities... DEPARTMENT OF ENERGY OIL ADMINISTRATIVE PROCEDURES AND SANCTIONS Electric Power System Permits and Reports...

10 CFR 205.373 - Application procedures.

Code of Federal Regulations, 2014 CFR

2014-01-01

... interconnection: (i) Proposed location; (ii) Required thermal capacity or power transfer capability of the... interconnection: (i) Location; (ii) Thermal capacity of power transfer capability of interconnection facilities... DEPARTMENT OF ENERGY OIL ADMINISTRATIVE PROCEDURES AND SANCTIONS Electric Power System Permits and Reports...

10 CFR 205.373 - Application procedures.

Code of Federal Regulations, 2011 CFR

2011-01-01

... interconnection: (i) Proposed location; (ii) Required thermal capacity or power transfer capability of the... interconnection: (i) Location; (ii) Thermal capacity of power transfer capability of interconnection facilities... DEPARTMENT OF ENERGY OIL ADMINISTRATIVE PROCEDURES AND SANCTIONS Electric Power System Permits and Reports...

10 CFR 205.373 - Application procedures.

Code of Federal Regulations, 2012 CFR

2012-01-01

... interconnection: (i) Proposed location; (ii) Required thermal capacity or power transfer capability of the... interconnection: (i) Location; (ii) Thermal capacity of power transfer capability of interconnection facilities... DEPARTMENT OF ENERGY OIL ADMINISTRATIVE PROCEDURES AND SANCTIONS Electric Power System Permits and Reports...

Improved room-temperature luminescence of core-shell InGaAs/GaAs nanopillars via lattice-matched passivation

NASA Astrophysics Data System (ADS)

Komolibus, Katarzyna; Scofield, Adam C.; Gradkowski, Kamil; Ochalski, Tomasz J.; Kim, Hyunseok; Huffaker, Diana L.; Huyet, Guillaume

2016-02-01

Optical properties of GaAs/InGaAs/GaAs nanopillars (NPs) grown on GaAs(111)B were investigated. Employment of a mask-etching technique allowed for an accurate control over the geometry of NP arrays in terms of both their diameter and separation. This work describes both the steady-state and time-resolved photoluminescence of these structures as a function of the ensemble geometry, composition of the insert, and various shell compounds. The effects of the NP geometry on a parasitic radiative recombination channel, originating from an overgrown lateral sidewall layer, are discussed. Optical characterization reveals a profound influence of the core-shell lattice mismatch on the carrier lifetime and emission quenching at room temperature. When the lattice-matching conditions are satisfied, an efficient emission from the NP arrays at room temperature and below the band-gap of silicon is observed, clearly highlighting their potential application as emitters in optical interconnects integrated with silicon platforms.

Optical beams with embedded vortices: building blocks for atom optics and quantum information

NASA Astrophysics Data System (ADS)

Chattrapiban, N.; Arakelyan, I.; Mitra, S.; Hill, W. T., III

2006-05-01

Laser beams with embedded vortices, Bessel or Laguerre-Gaussian modes, provide a unique opportunity for creating elements for atom optics, entangling photons and, potentially, mediating novel quantum interconnects between photons and matter. High-order Bessel modes, for example, contain intensity voids and propagate nearly diffraction-free for tens of meters. These vortices can be exploited to produce dark channels oriented longitudinally (hollow beams) or transversely to the laser propagation direction. Such channels are ideal for generating networks or circuits to guide and manipulate cold neutral atoms, an essential requirement for realizing future applications associated with atom interferometry, atom lithography and even some neutral atom-based quantum computing architectures. Recently, we divided a thermal cloud of neutral atoms moving within a blue-detuned beam into two clouds with two different momenta by crossing two hollow beams. In this presentation, we will describe these results and discuss the prospects for extending the process to coherent ensembles of matter.

Shift-invariant optical associative memories

NASA Astrophysics Data System (ADS)

Psaltis, Demetri; Hong, John

1987-01-01

Shift invariance in the context of associative memories is discussed. Two optical systems that exhibit shift invariance are described in detail with attention given to the analysis of storage capacities. It is shown that full shift invariance cannot be achieved with systems that employ only linear interconnections to store the associations.

High-Speed Optical Wide-Area Data-Communication Network

NASA Technical Reports Server (NTRS)

Monacos, Steve P.

1994-01-01

Proposed fiber-optic wide-area network (WAN) for digital communication balances input and output flows of data with its internal capacity by routing traffic via dynamically interconnected routing planes. Data transmitted optically through network by wavelength-division multiplexing in synchronous or asynchronous packets. WAN implemented with currently available technology. Network is multiple-ring cyclic shuffle exchange network ensuring traffic reaches its destination with minimum number of hops.

Solid State Research

DTIC Science & Technology

1988-11-15

Reduction of Intermodulation L.M. Johnson Opt. Lett. 13, 928 (1988) Distortion in Interferometric H.V. Roussell Optical Modulators * Author not at Lincoln...Engineering V, Proc. Niobate Interferometric Modulators SPIE 835, 29 (1988), DTIC AD-A198029 7553 Advanced Device Fabrication with W.D. Goodhue Proc...Colorado, 3 October 1988 7741 B Integrated-Optical Interferometric L.M. Johnson 2 X 2 Switches H.V.Roussell 7927B Free-Space Optical Interconnects

Bi cluster-assembled interconnects produced using SU8 templates

NASA Astrophysics Data System (ADS)

Partridge, J. G.; Matthewson, T.; Brown, S. A.

2007-04-01

Bi clusters with an average diameter of 25 nm have been deposited from an inert gas aggregation source and assembled into thin-film interconnects which are formed between planar electrical contacts and supported on Si substrates passivated with Si3N4 or thermally grown oxide. A layer of SU8 (a negative photoresist based on EPON SU-8 epoxy resin) is patterned using optical or electron-beam lithography, and it defines the position and dimensions of the cluster film. The conduction between the contacts is monitored throughout the deposition/assembly process, and subsequent I(V) characterization is performed in situ. Bi cluster-assembled interconnects have been fabricated with nanoscale widths and with up to 1:1 thickness:width aspect ratios. The conductivity of these interconnects has been increased, post-deposition, using a simple thermal annealing process.

Protocol and Topology Issues for Wide-Area Satellite Interconnection of Terrestrial Optical LANs

NASA Astrophysics Data System (ADS)

Parraga, N.

2002-01-01

Apart from broadcasting, the satellite business is targeting niche markets. Wide area interconnection is considered as one of these niche markets, since it addresses operators and business LANs (B2B, business to business) in remote areas where terrestrial infrastructure is not available. These LANs - if high-speed - are typically based on optical networks such as SONET. One of the advantages of SONET is its architecture flexibility and capacity to transport all kind of applications including multimedia with a range of different transmission rates. The applications can be carried by different protocols among which the Internet Protocol (IP) or the Asynchronous Transfer Mode (ATM) are the most prominent ones. Thus, the question arises how these protocols can be interconnected via the satellite segment. The paper addresses several solutions for interworking with different protocols. For this investigation we distinguish first of all between the topology and the switching technology of the satellites. In case of a star network with transparent satellite, the satellite protocol consists of physical layer and data layer which can be directly interconnected with layer 2 interworking function to their terrestrial counterparts in the SONET backbone. For regenerative satellites the situation is more complex: here we need to distinguish the types of transport protocols being used in the terrestrial and satellite segment. Whereas IP, ATM, MPEG dominate in the terrestrial networks, satellite systems usually do not follow these standards. Some might employ minor additions (for instance, satellite specific packet headers), some might be completely proprietary. In general, interworking must be done for the data plane on top of layer 2 (data link layer), whereas for the signaling plane the interworking is on top of layer 3. In the paper we will discuss the protocol stacks for ATM, IP, and MPEG with a regenerative satellite system. As an example we will use the EuroSkyWay satellite system for multimedia services. EuroSkyWay uses a GEO satellite with onboard switching. It has its own proprietary protocol stack for data link control (DLC), logical link control (LLC) and layer 3 functions such as resource management, call admission control and authentication. Special attention is paid to the IP interworking with Layer 3 function since IP does not support connection set-up and session protocols, thus proper interworking functions with IP signaling protocols for resource reservation routing such as RSVP, BGP, and ICMP need to be developed. Whereas the EuroSkyWay system is an representative for a meshed topology, DVB-RCS systems have usually star configuration with a central hub station. Different data streams are distinguished by program identifiers (PIDs). Recent proposals aim at the evolution of DVB-RCS towards a fully meshed structure. The paper will also discuss the protocol architecture for interconnect SONET LANs over these systems. Finally, a performance comparison of the different solutions will be given in terms of cell overhead rate and signalling effort for selected scenarios.

A programmable Si-photonic node for SDN-enabled Bloom filter forwarding in disaggregated data centers

NASA Astrophysics Data System (ADS)

Moralis-Pegios, M.; Terzenidis, N.; Vagionas, C.; Pitris, S.; Chatzianagnostou, E.; Brimont, A.; Zanzi, A.; Sanchis, P.; Marti, J.; Kraft, J.; Rochracher, K.; Dorrestein, S.; Bogdan, M.; Tekin, T.; Syrivelis, D.; Tassiulas, L.; Miliou, A.; Pleros, N.; Vyrsokinos, K.

2017-02-01

Programmable switching nodes supporting Software-Defined Networking (SDN) over optical interconnecting technologies arise as a key enabling technology for future disaggregated Data Center (DC) environments. The SDNenabling roadmap of intra-DC optical solutions is already a reality for rack-to-rack interconnects, with recent research reporting on interesting applications of programmable silicon photonic switching fabrics addressing board-to-board and even on-board applications. In this perspective, simplified information addressing schemes like Bloom filter (BF)-based labels emerge as a highly promising solution for ensuring rapid switch reconfiguration, following quickly the changes enforced in network size, network topology or even in content location. The benefits of BF-based forwarding have been so far successfully demonstrated in the Information-Centric Network (ICN) paradigm, while theoretical studies have also revealed the energy consumption and speed advantages when applied in DCs. In this paper we present for the first time a programmable 4x4 Silicon Photonic switch that supports SDN through the use of BF-labeled router ports. Our scheme significantly simplifies packet forwarding as it negates the need for large forwarding tables, allowing for its remote control through modifications in the assigned BF labels. We demonstrate 1x4 switch operation controlling the Si-Pho switch by a Stratix V FPGA module, which is responsible for processing the packet ID and correlating its destination with the appropriate BF-labeled outgoing port. DAC- and amplifier-less control of the carrier-injection Si-Pho switches is demonstrated, revealing successful switching of 10Gb/s data packets with BF-based forwarding information changes taking place at a time-scale that equals the duration of four consecutive packets.

Electrooptical adaptive switching network for the hypercube computer

NASA Technical Reports Server (NTRS)

Chow, E.; Peterson, J.

1988-01-01

An all-optical network design for the hyperswitch network using regular free-space interconnects between electronic processor nodes is presented. The adaptive routing model used is described, and an adaptive routing control example is presented. The design demonstrates that existing electrooptical techniques are sufficient for implementing efficient parallel architectures without the need for more complex means of implementing arbitrary interconnection schemes. The electrooptical hyperswitch network significantly improves the communication performance of the hypercube computer.

A full-duplex working integrated optoelectronic device for optical interconnect

NASA Astrophysics Data System (ADS)

Liu, Kai; Fan, Huize; Huang, Yongqing; Duan, Xiaofeng; Wang, Qi; Ren, Xiaomin; Wei, Qi; Cai, Shiwei

2018-05-01

In this paper, a full-duplex working integrated optoelectronic device is proposed. It is constructed by integrating a vertical cavity surface emitting laser (VCSEL) unit above a resonant cavity enhanced photodetector (RCE-PD) unit. Analysis shows that, the VCSEL unit has a threshold current of 1 mA and a slop efficiency of 0.66 W/A at 849.7 nm, the RCE-PD unit obtains its maximal absorption quantum efficiency of 90.24% at 811 nm with a FWHM of 4 nm. Moreover, the two units of the proposed integrated device can work independently from each other. So that the proposed integrated optoelectronic device can work full-duplex. It can be applied for single fiber bidirectional optical interconnects system.

Improved passive optical network architectures to support local area network emulation and protection

NASA Astrophysics Data System (ADS)

Wong, Elaine; Nadarajah, Nishaanthan; Chae, Chang-Joon; Nirmalathas, Ampalavanapillai; Attygalle, Sanjeewa M.

2006-01-01

We describe two optical layer schemes which simultaneously facilitate local area network emulation and automatic protection switching against distribution fiber breaks in passive optical networks. One scheme employs a narrowband fiber Bragg grating placed close to the star coupler in the feeder fiber of the passive optical network, while the other uses an additional short length distribution fiber from the star coupler to each customer for the redirection of the customer traffic. Both schemes use RF subcarrier multiplexed transmission for intercommunication between customers in conjunction with upstream access to the central office at baseband. Failure detection and automatic protection switching are performed independently by each optical network unit that is located at the customer premises in a distributed manner. The restoration of traffic transported between the central office and an optical network unit in the event of the distribution fiber break is performed by interconnecting adjacent optical network units and carrying out signal transmissions via an independent but interconnected optical network unit. Such a protection mechanism enables multiple adjacent optical network units to be simultaneously protected by a single optical network unit utilizing its maximum available bandwidth. We experimentally verify the feasibility of both schemes with 1.25 Gb/s upstream baseband transmission to the central office and 155 Mb/s local area network data transmission on a RF subcarrier frequency. The experimental results obtained from both schemes are compared, and the power budgets are calculated to analyze the scalability of each scheme.

Optical Material Characterization Using Microdisk Cavities

NASA Astrophysics Data System (ADS)

Michael, Christopher P.

Since Jack Kilby recorded his "Monolithic Idea" for integrated circuits in 1958, microelectronics companies have invested billions of dollars in developing the silicon material system to increase performance and reduce cost. For decades, the industry has made Moore's Law, concerning cost and transistor density, a self-fulfilling prophecy by integrating technical and material requirements vertically down their supply chains and horizontally across competitors in the market. At recent technology nodes, the unacceptable scaling behavior of copper interconnects has become a major design constraint by increasing latency and power consumption---more than 50% of the power consumed by high speed processors is dissipated by intrachip communications. Optical networks at the chip scale are a potential low-power high-bandwidth replacement for conventional global interconnects, but the lack of efficient on-chip optical sources has remained an outstanding problem despite significant advances in silicon optoelectronics. Many material systems are being researched, but there is no ideal candidate even though the established infrastructure strongly favors a CMOS-compatible solution. This thesis focuses on assessing the optical properties of materials using microdisk cavities with the intention to advance processing techniques and materials relevant to silicon photonics. Low-loss microdisk resonators are chosen because of their simplicity and long optical path lengths. A localized photonic probe is developed and characterized that employs a tapered optical-fiber waveguide, and it is utilized in practical demonstrations to test tightly arranged devices and to help prototype new fabrication methods. A case study in AlxGa1-xAs illustrates how the optical scattering and absorption losses can be obtained from the cavity-waveguide transmission. Finally, single-crystal Er2O3 epitaxially grown on silicon is analyzed in detail as a potential CMOS-compatable gain medium due to its high Er3+ density and the control offered by the precise epitaxy. The growth and fabrication methods are discussed. Spectral measurements at cryogenic and room temperatures show negligible background losses and resonant Er3+ absorption strong enough to produce cavity-polaritons that persist to above 361 K. Cooperative relaxation and upconversion limit the optical performance in the telecommunications bands by transferring the excitations to quenching sites or by further exciting the ions up to visible transitions. Future prospects and alternative applications for Er2O3 and other epitaxial rare-earth oxides are also considered.

An optimized routing algorithm for the automated assembly of standard multimode ribbon fibers in a full-mesh optical backplane

NASA Astrophysics Data System (ADS)

Basile, Vito; Guadagno, Gianluca; Ferrario, Maddalena; Fassi, Irene

2018-03-01

In this paper a parametric, modular and scalable algorithm allowing a fully automated assembly of a backplane fiber-optic interconnection circuit is presented. This approach guarantees the optimization of the optical fiber routing inside the backplane with respect to specific criteria (i.e. bending power losses), addressing both transmission performance and overall costs issues. Graph theory has been exploited to simplify the complexity of the NxN full-mesh backplane interconnection topology, firstly, into N independent sub-circuits and then, recursively, into a limited number of loops easier to be generated. Afterwards, the proposed algorithm selects a set of geometrical and architectural parameters whose optimization allows to identify the optimal fiber optic routing for each sub-circuit of the backplane. The topological and numerical information provided by the algorithm are then exploited to control a robot which performs the automated assembly of the backplane sub-circuits. The proposed routing algorithm can be extended to any array architecture and number of connections thanks to its modularity and scalability. Finally, the algorithm has been exploited for the automated assembly of an 8x8 optical backplane realized with standard multimode (MM) 12-fiber ribbons.

Cost-effective parallel optical interconnection module based on fully passive-alignment process

NASA Astrophysics Data System (ADS)

Son, Dong Hoon; Heo, Young Soon; Park, Hyoung-Jun; Kang, Hyun Seo; Kim, Sung Chang

2017-11-01

In optical interconnection technology, high-speed and large data transitions with low error rate and cost reduction are key issues for the upcoming 8K media era. The researchers present notable types of optical manufacturing structures of a four-channel parallel optical module by fully passive alignment, which are able to reduce manufacturing time and cost. Each of the components, such as vertical-cavity surface laser/positive-intrinsic negative-photodiode array, microlens array, fiber array, and receiver (RX)/transmitter (TX) integrated circuit, is integrated successfully using flip-chip bonding, die bonding, and passive alignment with a microscope. Clear eye diagrams are obtained by 25.78-Gb/s (for TX) and 25.7-Gb/s (for RX) nonreturn-to-zero signals of pseudorandom binary sequence with a pattern length of 231 to 1. The measured responsivity and minimum sensitivity of the RX are about 0.5 A/W and ≤-6.5 dBm at a bit error rate (BER) of 10-12, respectively. The optical power margin at a BER of 10-12 is 7.5 dB, and cross talk by the adjacent channel is ≤1 dB.

Standard Hardware Acquisition and Reliability Program's (SHARP's) efforts in incorporating fiber optic interconnects into standard electronic module (SEM) connectors

NASA Astrophysics Data System (ADS)

Riggs, William R.

1994-05-01

SHARP is a Navy wide logistics technology development effort aimed at reducing the acquisition costs, support costs, and risks of military electronic weapon systems while increasing the performance capability, reliability, maintainability, and readiness of these systems. Lower life cycle costs for electronic hardware are achieved through technology transition, standardization, and reliability enhancement to improve system affordability and availability as well as enhancing fleet modernization. Advanced technology is transferred into the fleet through hardware specifications for weapon system building blocks of standard electronic modules, standard power systems, and standard electronic systems. The product lines are all defined with respect to their size, weight, I/O, environmental performance, and operational performance. This method of defining the standard is very conducive to inserting new technologies into systems using the standard hardware. This is the approach taken thus far in inserting photonic technologies into SHARP hardware. All of the efforts have been related to module packaging; i.e. interconnects, component packaging, and module developments. Fiber optic interconnects are discussed in this paper.

Optical clock distribution in supercomputers using polyimide-based waveguides

NASA Astrophysics Data System (ADS)

Bihari, Bipin; Gan, Jianhua; Wu, Linghui; Liu, Yujie; Tang, Suning; Chen, Ray T.

1999-04-01

Guided-wave optics is a promising way to deliver high-speed clock-signal in supercomputer with minimized clock-skew. Si- CMOS compatible polymer-based waveguides for optoelectronic interconnects and packaging have been fabricated and characterized. A 1-to-48 fanout optoelectronic interconnection layer (OIL) structure based on Ultradel 9120/9020 for the high-speed massive clock signal distribution for a Cray T-90 supercomputer board has been constructed. The OIL employs multimode polymeric channel waveguides in conjunction with surface-normal waveguide output coupler and 1-to-2 splitters. Surface-normal couplers can couple the optical clock signals into and out from the H-tree polyimide waveguides surface-normally, which facilitates the integration of photodetectors to convert optical-signal to electrical-signal. A 45-degree surface- normal couplers has been integrated at each output end. The measured output coupling efficiency is nearly 100 percent. The output profile from 45-degree surface-normal coupler were calculated using Fresnel approximation. the theoretical result is in good agreement with experimental result. A total insertion loss of 7.98 dB at 850 nm was measured experimentally.

VCSEL-based optical transceiver module for high-speed short-reach interconnect

NASA Astrophysics Data System (ADS)

Yagisawa, Takatoshi; Oku, Hideki; Mori, Tatsuhiro; Tsudome, Rie; Tanaka, Kazuhiro; Daikuhara, Osamu; Komiyama, Takeshi; Ide, Satoshi

2017-02-01

Interconnects have been more important in high-performance computing systems and high-end servers beside its improvements in computing capability. Recently, active optical cables (AOCs) have started being used for this purpose instead of conventionally used copper cables. The AOC enables to extend the transmission distance of the high-speed signals dramatically by its broadband characteristics, however, it tend to increase the cost. In this paper, we report our developed quad small form-factor pluggable (QSFP) AOC utilizing cost-effective optical-module technologies. These are a unique structure using generally used flexible printed circuit (FPC) in combination with an optical waveguide that enables low-cost high-precision assembly with passive alignment, a lens-integrated ferrule that improves productivity by eliminating a polishing process for physical contact of standard PMT connector for the optical waveguide, and an overdrive technology that enables 100 Gb/s (25 Gb/s × 4-channel) operation with low-cost 14 Gb/s vertical-cavity surfaceemitting laser (VCSEL) array. The QSFP AOC demonstrated clear eye opening and error-free operation at 100 Gb/s with high yield rate even though the 14 Gb/s VCSEL was used thanks to the low-coupling loss resulting from the highprecision alignment of optical devices and the over-drive technology.

FireFly: reconfigurable optical wireless networking data centers

NASA Astrophysics Data System (ADS)

Kavehrad, Mohsen; Deng, Peng; Gupta, H.; Longtin, J.; Das, S. R.; Sekar, V.

2017-01-01

We explore a novel, free-space optics based approach for building data center interconnects. Data centers (DCs) are a critical piece of today's networked applications in both private and public sectors. The key factors that have driven this trend are economies of scale, reduced management costs, better utilization of hardware via statistical multiplexing, and the ability to elastically scale applications in response to changing workload patterns. A robust DC network fabric is fundamental to the success of DCs and to ensure that the network does not become a bottleneck for high-performance applications. In this context, DC network design must satisfy several goals: high performance (e.g., high throughput and low latency), low equipment and management cost, robustness to dynamic traffic patterns, incremental expandability to add new servers or racks, and other practical concerns such as cabling complexity, and power and cooling costs. Current DC network architectures do not seem to provide a satisfactory solution, with respect to the above requirements. In particular, traditional static (wired) networks are either overprovisioned or oversubscribed. Recent works have tried to overcome the above limitations by augmenting a static (wired) "core" with some flexible links (RF-wireless or optical). These augmented architectures show promise, but offer only incremental improvement in performance. Specifically, RFwireless based augmented solutions also offer only limited performance improvement, due to inherent interference and range constraints of RF links. This paper explores an alternative design point—a fully flexible and all-wireless DC interrack network based on free-space optical (FSO) links. We call this FireFly as in; Free-space optical Inter-Rack nEtwork with high FLexibilitY. We will present our designs and tests using various configurations that can help the performance and reliability of the FSO links.

Intra-Chip Free-Space Optical Interconnect: System, Device, Integration and Prototyping

NASA Astrophysics Data System (ADS)

Ciftcioglu, Berkehan

Currently, on-chip optical interconnect schemes already proposed utilize circuit switching using wavelength division multiplexing (WDM) or all-optical packet switching, all based on planar optical waveguides and related photonic devices such as microrings. These proposed approaches pose significant challenges in latency, energy efficiency, integration, and scalability. This thesis presents a new alternative approach by utilizing free-space optics. This 3-D integrated intra-chip free-space optical interconnect (FSOI) leverages mature photonic devices such as integrated lasers, photodiodes, microlenses and mirrors. It takes full advantages of the latest developments in 3-D integration technologies. This interconnect system provides point-to-point free-space optical links between any two communication nodes to construct an all-to-all intra-chip communication network with little or no arbitration. Therefore, it has significant networking advantages over conventional electrical and waveguide-based optical interconnects. An FSOI system is evaluated based on the real device parameters, predictive technology models and International Roadmap of Semiconductor's predictions. A single FSOI link achieves 10-Gbps data rate with 0.5-pJ/bit energy efficiency and less than 10--12 bit-error-rate (BER). A system using this individual link can provide scalability up to 36 nodes, providing 10-Tbps aggregate bandwidth. A comparison analysis performed between a WDM-based waveguide interconnect system and the proposed FSOI system shows that FSOI achieves better energy efficiency than the WDM one as the technology scales. Similarly, network simulation on a 16-core microprocessor using the proposed FSOI system instead of mesh networks has been shown to speed up the system by 12% and reduce the energy consumption by 33%. As a part of the development of a 3-D integrated FSOI system, operating at 850 nm with a 10-Gbps data rate per optical link, the photonics devices and optical components are individually designed and fabricated. The photodiodes (PDs) are designed to have large area for efficient light coupling and low capacitance to achieve large bandwidth, while achieving reasonably high responsivity. A metal-semiconductor-metal (MSM) structure is chosen over p-i-n ones to reduce parasitic capacitance per area, to allow less stringent microlens-to-PD alignment for efficient light coupling with a large bandwidth. A novel MSM germanium PD is implemented using an amorphous silicon (a-Si) layer on top of the undoped germanium substrate, serving as a barrier enhancement layer, mitigating the low Schottky barrier height for holes due to fermi level pinning and a surface passivation layer, preventing charge accumulation and image force lowering of the barrier. Therefore, the dark current is reduced and low-frequency gain is eliminated. The PDs achieve a 13-GHz bandwidth with a 0.315-A/W responsivity and a 1.7-nAmum² dark current density. The microlenses are fabricated on a fused silica substrate based on the photoresist melt-and-reflow technique, followed by dry etching into fused silica substrate. The measured focal length of a 220-mum aperture size microlens is 350-mum away from the backside of the substrate. The vertical-cavity surface-emitting lasers (VCSELs) are fabricated on a commercial molecular beam epitaxially (MBE) grown GaAs wafer. The fabricated 8-mum aperture size VCSEL can achieve 0.65-mW optical power at a 1.5-mA forward bias current with a threshold current of 0.48 mA and a 0.67-A/W slope efficiency. Three prototypes are implemented via integrating the individually fabricated components using non-conductive epoxy and wirebonding. The first prototype, built on a printed circuit board (PCB) using commercial VCSEL arrays, achieves a 5-dB transmission loss and less than -30-dB crosstalk at 1-cm distance with a small-signal bandwidth of 10 GHz, limited by the VCSEL. The second board-level prototype uses all fabricated components integrated on a PCB. The prototype achieves a 9-dB transmission loss at 3-cm distance and a 4.4-GHz bandwidth. The chip-level prototype is built on a germanium carrier with integrated MSM Ge PDs, microlenses on fused silica and VCSEL chip on GaAs substrates. The prototype achieves 4-dB transmission loss at 1 cm and 3.3-GHz bandwidth, limited by commercial VCSEL bandwidth. (Abstract shortened by UMI.)

Design and fabrication of embedded micro-mirror inserts for out-of-plane coupling in PCB-level optical interconnections

NASA Astrophysics Data System (ADS)

Van Erps, Jurgen; Hendrickx, Nina; Bosman, Erwin; Van Daele, Peter; Debaes, Christof; Thienpont, Hugo

2010-05-01

Optical interconnections have gained interest over the last years, and several approaches have been presented for the integration of optics to the printed circuit board (PCB)-level. The use of a polymer optical waveguide layer appears to be the prevailing solution to route optical signals on the PCB. The most difficult issue is the efficient out-of-plane coupling of light between surface-normal optoelectronic devices (lasers and photodetectors) and PCB-integrated waveguides. The most common approach consists of using 45° reflecting micro-mirrors. The micro-mirror performance significantly affects the total insertion loss of the optical interconnect system, and hence has a crucial role on the system's bit error rate (BER) characteristics. Several technologies have been proposed for the fabrication of 45° reflector micro-mirrors directly into waveguides. Alternatively, it is possible to make use of discrete coupling components which have to be inserted into cavities formed in the PCB-integrated waveguides. In this paper, we present a hybrid approach where we try to combine the advantages of integrated and discrete coupling mirrors, i.e. low coupling loss and maintenance of the planararity of the top surface of the optical layer, allowing the lamination of additional layers or the mounting of optoelectronic devices. The micro-mirror inserts are designed through non-sequential ray tracing simulations, including a tolerance analysis, and subsequently prototyped with Deep Proton Writing (DPW). The DPW prototypes are compatible with mass fabrication at low cost in a wide variety of high-tech plastics. The DPW micro-mirror insert is metallized and inserted in a laser ablated cavity in the optical layer and in a next step covered with cladding material. Surface roughness measurements confirm the excellent quality of the mirror facet. An average mirror loss of 0.35-dB was measured in a receiver scheme, which is the most stringent configuration. Finally, the configuration is robust, since the mirror is embedded and thus protected from environmental contamination, like dust or moisture adsorption, which makes them interesting candidates for out-of-plane coupling in high-end boards.

All-zigzag graphene nanoribbons for planar interconnect application

NASA Astrophysics Data System (ADS)

Chen, Po-An; Chiang, Meng-Hsueh; Hsu, Wei-Chou

2017-07-01

A feasible "lightning-shaped" zigzag graphene nanoribbon (ZGNR) structure for planar interconnects is proposed. Based on the density functional theory and non-equilibrium Green's function, the electron transport properties are evaluated. The lightning-shaped structure increases significantly the conductance of the graphene interconnect with an odd number of zigzag chains. This proposed technique can effectively utilize the linear I-V characteristic of asymmetric ZGNRs for interconnect application. Variability study accounting for width/length variation and the edge effect is also included. The transmission spectra, transmission eigenstates, and transmission pathways are analyzed to gain the physical insights. This lightning-shaped ZGNR enables all 2D material-based devices and circuits on flexible and transparent substrates.

Solar steam generation by heat localization.

PubMed

Ghasemi, Hadi; Ni, George; Marconnet, Amy Marie; Loomis, James; Yerci, Selcuk; Miljkovic, Nenad; Chen, Gang

2014-07-21

Currently, steam generation using solar energy is based on heating bulk liquid to high temperatures. This approach requires either costly high optical concentrations leading to heat loss by the hot bulk liquid and heated surfaces or vacuum. New solar receiver concepts such as porous volumetric receivers or nanofluids have been proposed to decrease these losses. Here we report development of an approach and corresponding material structure for solar steam generation while maintaining low optical concentration and keeping the bulk liquid at low temperature with no vacuum. We achieve solar thermal efficiency up to 85% at only 10 kW m(-2). This high performance results from four structure characteristics: absorbing in the solar spectrum, thermally insulating, hydrophilic and interconnected pores. The structure concentrates thermal energy and fluid flow where needed for phase change and minimizes dissipated energy. This new structure provides a novel approach to harvesting solar energy for a broad range of phase-change applications.

Chamber for the optical manipulation of microscopic particles

DOEpatents

Buican, Tudor N.; Upham, Bryan D.

1992-01-01

A particle control chamber enables experiments to be carried out on biological cells and the like using a laser system to trap and manipulate the particles. A manipulation chamber provides a plurality of inlet and outlet ports for the particles and for fluids used to control or to contact the particles. A central manipulation area is optically accessible by the laser and includes first enlarged volumes for containing a selected number of particles for experimentation. A number of first enlarged volumes are connected by flow channels through second enlarged volumes. The second enlarged volumes act as bubble valves for controlling the interconnections between the first enlarged volumes. Electrode surfaces may be applied above the first enlarged volumes to enable experimentation using the application of electric fields within the first enlarged volumes. A variety of chemical and environmental conditions may be established within individual first enlarged volumes to enable experimental conditions for small scale cellular interactions.

Recent advancements towards green optical networks

NASA Astrophysics Data System (ADS)

Davidson, Alan; Glesk, Ivan; Buis, Adrianus; Wang, Junjia; Chen, Lawrence

2014-12-01

Recent years have seen a rapid growth in demand for ultra high speed data transmission with end users expecting fast, high bandwidth network access. With this rapid growth in demand, data centres are under pressure to provide ever increasing data rates through their networks and at the same time improve the quality of data handling in terms of reduced latency, increased scalability and improved channel speed for users. However as data rates increase, present technology based on well-established CMOS technology is becoming increasingly difficult to scale and consequently data networks are struggling to satisfy current network demand. In this paper the interrelated issues of electronic scalability, power consumption, limited copper interconnect bandwidth and the limited speed of CMOS electronics will be explored alongside the tremendous bandwidth potential of optical fibre based photonic networks. Some applications of photonics to help alleviate the speed and latency in data networks will be discussed.

Three-mode all-optical (de)multiplexing on a SOI chip

NASA Astrophysics Data System (ADS)

Le, Yan-Si; Wang, Zhi; Li, Zhi-Yong; Li, Ying; Li, Qiang; Cui, Can; Wu, Chong-Qing

2018-01-01

An on-chip three-mode division multiplexing circuit using a simple ADC-based TE0 & TE1 & TE2 (de)multiplexer is demonstrated to improve the link capacity of on-chip optical interconnects. The proposed (de)multiplexer does not contain any tapered waveguide which is different from the previous mode (de)multiplexer based on ADCs. Here, we choose multimode waveguide width first and then confirm corresponding width of the other two waveguides. Thus the bus waveguide without any tapers can not only reduce complexity of (de)multiplexer but also reduce difficulty of the fabrication. Our simulation results show that the hybrid multiplexer has relatively low loss and low crosstalk about -40 dB, -26.99 dB and -28.72 dB for each mode around 1550 nm with a width-variation w =± 25 nm. These properties make the proposed mode-(de)multiplexer suitable for application in high-capacity data transmission.

Electro-optical line cards with multimode polymer waveguides for chip-to-chip interconnects

NASA Astrophysics Data System (ADS)

Zhu, Long Xiu; Immonen, Marika; Wu, Jinhua; Yan, Hui Juan; Shi, Ruizhi; Chen, Peifeng; Rapala-Virtanen, Tarja

2014-10-01

In this paper, we report developments of electro-optical PCBs (EO-PCB) with low-loss (<0.05dB/cm) polymer waveguides. Our results shows successful fabrication of complex waveguide structures part of hybrid EO-PCBs utilizing production scale process on standard board panels. Test patterns include 90° bends of varying radii (40mm - 2mm), waveguide crossing with varied crossing angles (90°-20°), cascaded bends with varying radii, splitters and tapered waveguides. Full ranges of geometric configurations are required to meet practical optical routing functions and layouts. Moreover, we report results obtained to realize structures to integrate optical connectors with waveguides. Experimental results are shown for MT in-plane and 90° out-of-plane optical connectors realized with coupling loss < 2dB and < 2.5 dB, respectively. These connectors are crucial to realize efficient light coupling from/to TX/RX chip-to-waveguide and within waveguide-to-fiber connections in practical optical PCBs. Furthermore, we show results for fabricating electrical interconnect structures e.g. tracing layers, vias, plated vias top/bottom and through optical layers. Process compatibility with accepted practices and production scale up for high volumes are key concerns to meet the yield target and cost efficiency. Results include waveguide characterization, transmission loss, misalignment tolerance, and effect of lamination. Critical link metrics are reported.

Hybrid Silicon Photonic Integration using Quantum Well Intermixing

NASA Astrophysics Data System (ADS)

Jain, Siddharth R.

With the push for faster data transfer across all domains of telecommunication, optical interconnects are transitioning into shorter range applications such as in data centers and personal computing. Silicon photonics, with its economic advantages of leveraging well-established silicon manufacturing facilities, is considered the most promising approach to further scale down the cost and size of optical interconnects for chip-to-chip communication. Intrinsic properties of silicon however limit its ability to generate and modulate light, both of which are key to realizing on-chip optical data transfer. The hybrid silicon approach directly addresses this problem by using molecularly bonded III-V epitaxial layers on silicon for optical gain and absorption. This technology includes direct transfer of III-V wafer to a pre-patterned silicon-on-insulator wafer. Several discrete devices for light generation, modulation, amplification and detection have already been demonstrated on this platform. As in the case of electronics, multiple photonic elements can be integrated on a single chip to improve performance and functionality. However, scalable photonic integration requires the ability to control the bandgap for individual devices along with design changes to simplify fabrication. In the research presented here, quantum well intermixing is used as a technique to define multiple bandgaps for integration on the hybrid silicon platform. Implantation enhanced disordering is used to generate four bandgaps spread over 120+ nm. By combining these selectively intermixed III-V layers with pre-defined gratings and waveguides on silicon, we fabricate distributed feedback, distributed Bragg reflector, Fabry-Perot and mode-locked lasers along with photodetectors, electro-absorption modulators and other test structures, all on a single chip. We demonstrate a broadband laser source with continuous-wave operational lasers over a 200 nm bandwidth. Some of these lasers are integrated with modulators with a 3-dB bandwidth above 25 GHz, thus demonstrating coarse wavelength division multiplexing transmitter on silicon.

Reliability of high I/O high density CCGA interconnect electronic packages under extreme thermal environments

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2012-03-01

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surfacemount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions.

47 CFR 90.477 - Interconnected systems.

Code of Federal Regulations, 2013 CFR

2013-10-01

...) Applicants for new land stations to be interconnected with the public switched telephone network must... switched telephone network only after modifying their license. See § 1.929 of this chapter. In all cases a..., 896-901 MHz, and 935-940 MHz, interconnection with the public switched telephone network is authorized...

47 CFR 90.477 - Interconnected systems.

Code of Federal Regulations, 2011 CFR

2011-10-01

...) Applicants for new land stations to be interconnected with the public switched telephone network must... switched telephone network only after modifying their license. See § 1.929 of this chapter. In all cases a..., 896-901 MHz, and 935-940 MHz, interconnection with the public switched telephone network is authorized...

47 CFR 90.477 - Interconnected systems.

Code of Federal Regulations, 2014 CFR

2014-10-01

...) Applicants for new land stations to be interconnected with the public switched telephone network must... switched telephone network only after modifying their license. See § 1.929 of this chapter. In all cases a..., 896-901 MHz, and 935-940 MHz, interconnection with the public switched telephone network is authorized...

47 CFR 90.477 - Interconnected systems.

Code of Federal Regulations, 2012 CFR

2012-10-01

...) Applicants for new land stations to be interconnected with the public switched telephone network must... switched telephone network only after modifying their license. See § 1.929 of this chapter. In all cases a..., 896-901 MHz, and 935-940 MHz, interconnection with the public switched telephone network is authorized...

47 CFR 6.1 - Applicability.

Code of Federal Regulations, 2011 CFR

2011-10-01

... telecommunications carrier; (d) Any provider of interconnected Voice over Internet Protocol (VoIP) service, as that... equipment that is specially designed to provide interconnected VoIP service and that is needed for the effective use of an interconnected VoIP service. [64 FR 63251, Nov. 19, 1999, as amended at 72 FR 43558, Aug...

47 CFR 6.1 - Applicability.

Code of Federal Regulations, 2010 CFR

2010-10-01

... telecommunications carrier; (d) Any provider of interconnected Voice over Internet Protocol (VoIP) service, as that... equipment that is specially designed to provide interconnected VoIP service and that is needed for the effective use of an interconnected VoIP service. [64 FR 63251, Nov. 19, 1999, as amended at 72 FR 43558, Aug...

DGIC Interconnection Insights | Distributed Generation Interconnection

Science.gov Websites

time and resources from utilities, customers, and local permitting authorities. Past research by the interconnection processes can benefit all parties by reducing the financial and time commitments involved. In this susceptible to time-consuming setbacks-for example, if an application is submitted with incomplete information

Microfluidic Model Porous Media: Fabrication and Applications.

PubMed

Anbari, Alimohammad; Chien, Hung-Ta; Datta, Sujit S; Deng, Wen; Weitz, David A; Fan, Jing

2018-05-01

Complex fluid flow in porous media is ubiquitous in many natural and industrial processes. Direct visualization of the fluid structure and flow dynamics is critical for understanding and eventually manipulating these processes. However, the opacity of realistic porous media makes such visualization very challenging. Micromodels, microfluidic model porous media systems, have been developed to address this challenge. They provide a transparent interconnected porous network that enables the optical visualization of the complex fluid flow occurring inside at the pore scale. In this Review, the materials and fabrication methods to make micromodels, the main research activities that are conducted with micromodels and their applications in petroleum, geologic, and environmental engineering, as well as in the food and wood industries, are discussed. The potential applications of micromodels in other areas are also discussed and the key issues that should be addressed in the near future are proposed. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

25 Gbps 850 nm photodiode for emerging 100 Gb ethernet applications

NASA Astrophysics Data System (ADS)

Joshi, Abhay; Rue, Jim; Becker, Don; Datta, Shubhashish; McFaul, Will

2011-06-01

The IEEE Std 802.3ba-2010 for 40 Gb and 100 Gb Ethernet was released in July, 2010. This standard will continue to evolve over the next several years. Two of the challenging transmit/receive architectures contained in this standard are the 100GBASE-LR4 (<10 km range) and 100GBASE-ER4 (<40 km range). Although presently envisioned for 1310 nm optical wavelengths, both of these 4 lane, 25.78 GBaud formats may be adopted for the impending 850 nm short reach optical backplane market, whose range is below 150 m. Driven by major computer server companies, such as IBM, HP and Oracle, the 850 nm Active Optical Cable (AOC) market is presently undergoing an increase of serial rates up to 25 Gbaud to enhance backplane interconnectivity. With AOCs up to 16 channels, the potential for up to 400 Gbps backhaul composite data rates will soon be possible. We report a 25 Gbps photodiode with quantum efficiency ~ 0.6 at 850 nm. This InGaAs/InP device was optimized for high quantum efficiency at 850 nm. When pigtailed with multimode fiber and integrated with an application-specific RF amplifier, the resultant photoreceiver will provide multiple functionalities for these 100 Gb Ethernet markets.

Realization of optical multimode TSV waveguides for Si-Interposer in 3D-chip-stacks

NASA Astrophysics Data System (ADS)

Killge, S.; Charania, S.; Richter, K.; Neumann, N.; Al-Husseini, Z.; Plettemeier, D.; Bartha, J. W.

2017-05-01

Optical connectivity has the potential to outperform copper-based TSVs in terms of bandwidth at the cost of more complexity due to the required electro-optical and opto-electrical conversion. The continuously increasing demand for higher bandwidth pushes the breakeven point for a profitable operation to shorter distances. To integrate an optical communication network in a 3D-chip-stack optical through-silicon vertical VIAs (TSV) are required. While the necessary effort for the electrical/optical and vice versa conversion makes it hard to envision an on-chip optical interconnect, a chip-to-chip optical link appears practicable. In general, the interposer offers the potential advantage to realize electro-optical transceivers on affordable expense by specific, but not necessarily CMOS technology. We investigated the realization and characterization of optical interconnects as a polymer based waveguide in high aspect ratio (HAR) TSVs proved on waferlevel. To guide the optical field inside a TSV as optical-waveguide or fiber, its core has to have a higher refractive index than the surrounding material. Comparing different material / technology options it turned out that thermal grown silicon dioxide (SiO2) is a perfect candidate for the cladding (nSiO2 = 1.4525 at 850 nm). In combination with SiO2 as the adjacent polymer layer, the negative resist SU-8 is very well suited as waveguide material (nSU-8 = 1.56) for the core. Here, we present the fabrication of an optical polymer based multimode waveguide in TSVs proved on waferlevel using SU-8 as core and SiO2 as cladding. The process resulted in a defect-free filling of waveguide TSVs with SU-8 core and SiO2 cladding up to aspect ratio (AR) 20:1 and losses less than 3 dB.

High-speed ADC and DAC modules with fibre optic interconnections for telecom satellites

NASA Astrophysics Data System (ADS)

Heikkinen, Veli; Juntunen, Eveliina; Karppinen, Mikko; Kautio, Kari; Ollila, Jyrki; Sitomaniemi, Aila; Tanskanen, Antti; Casey, Rory; Scott, Shane; Gachon, Hélène; Sotom, Michel; Venet, Norbert; Toivonen, Jaakko; Tuominen, Taisto; Karafolas, Nikos

2017-11-01

The flexibility required for future telecom payloads calls for the introduction of more and more digital processing capabilities. Aggregate data throughputs of several Tbps will have to be handled onboard, thus creating the need for effective, ADCDSP and DACDSP highspeed links. ADC and DAC modules with optical interconnections is an attractive option as it can solve easily the transmission and routing of the expected huge amount of data. This technique will enable to increase the bandwidth and/or the number of beams/channels to be treated, or to support advanced digital processing architectures including beam forming. We realised electrooptic ADC and DAC modules containing an 8 bit, 2 GSa/s A/D converter and a 12 bit, 2 GSa/s D/A converter. The 4channel parallel fibre optic link employs 850nm VCSELs and GaAs PIN photodiodes coupled to 50/125μm fibre ribbon cable. ADCDSP and DSPDAC links both have an aggregate data rate of 25 Gbps. The paper presents the current status of this development.

Design and Fabrication of NxN Optical Couplers Based on Organic Polymer Opti al WaveGuides

DTIC Science & Technology

1994-08-01

lOxlO optical coupler utilizing photopolymerizable organic polymers. Background information on the theory of operation of the coupler culminating in a...Channel Waveguides Based on Photopolymerizable Di/Tri Acrylates," in Optoelecwonic Interconnects Ii, Ray T. Chen, John A. Neff, Editors, Proc. SPIE 2153, pp...demonstrated that acrylic polymers can be used to fabricate single-mode optical wavguides. The resins that we have formulated are photopolymerizable

Heterostructure Quantum Confined Stark Effect Electrooptic Modulators Operating at 938 nm

DTIC Science & Technology

1993-12-01

type of modulator, suitable for use in optical interconnects, is an asymmetric Fabry-Perot reflection modulator (ARM). This type of an intensity ...calibrated spectrometer/diode array (Princeton Instruments Model ST-100) used in conjunction with an optical multichannel analyzer (OMA). The transmission...AD-A279 342 -" RL-TR-93-259 In -House Report December 1993N~I HETEROSTRUCTURE QUANTUM CONFINED STARK EFFECT ELECTRO- OPTIC MODULATORS OPERATING AT 938

Fiber-optic interconnection networks for spacecraft

NASA Technical Reports Server (NTRS)

Powers, Robert S.

1992-01-01

The overall goal of this effort was to perform the detailed design, development, and construction of a prototype 8x8 all-optical fiber optic crossbar switch using low power liquid crystal shutters capable of operation in a network with suitable fiber optic transmitters and receivers at a data rate of 1 Gb/s. During the earlier Phase 1 feasibility study, it was determined that the all-optical crossbar system had significant advantages compared to electronic crossbars in terms of power consumption, weight, size, and reliability. The result is primarily due to the fact that no optical transmitters and receivers are required for electro-optic conversion within the crossbar switch itself.

Optical information-processing systems and architectures II; Proceedings of the Meeting, San Diego, CA, July 9-13, 1990

NASA Astrophysics Data System (ADS)

Javidi, Bahram

The present conference discusses topics in the fields of neural networks, acoustooptic signal processing, pattern recognition, phase-only processing, nonlinear signal processing, image processing, optical computing, and optical information processing. Attention is given to the optical implementation of an inner-product neural associative memory, optoelectronic associative recall via motionless-head/parallel-readout optical disk, a compact real-time acoustooptic image correlator, a multidimensional synthetic estimation filter, and a light-efficient joint transform optical correlator. Also discussed are a high-resolution spatial light modulator, compact real-time interferometric Fourier-transform processors, a fast decorrelation algorithm for permutation arrays, the optical interconnection of optical modules, and carry-free optical binary adders.

78 FR 14781 - Combined Notice of Filings #2

Federal Register 2010, 2011, 2012, 2013, 2014

2013-03-07

.... Comments Due: 5 p.m. ET 3/21/13. Docket Numbers: ER13-486-001. Applicants: PJM Interconnection, L.L.C. Description: PJM Interconnection, L.L.C. submits Response to the Commission's 1/29/2013 Letter Requesting.... Docket Numbers: ER13-698-001. Applicants: Southard Energy Partners LLC. Description: Southard Energy...

Merging parallel optics packaging and surface mount technologies

NASA Astrophysics Data System (ADS)

Kopp, Christophe; Volpert, Marion; Routin, Julien; Bernabé, Stéphane; Rossat, Cyrille; Tournaire, Myriam; Hamelin, Régis

2008-02-01

Optical links are well known to present significant advantages over electrical links for very high-speed data rate at 10Gpbs and above per channel. However, the transition towards optical interconnects solutions for short and very short reach applications requires the development of innovative packaging solutions that would deal with very high volume production capability and very low cost per unit. Moreover, the optoelectronic transceiver components must be able to move from the edge to anywhere on the printed circuit board, for instance close to integrated circuits with high speed IO. In this paper, we present an original packaging design to manufacture parallel optic transceivers that are surface mount devices. The package combines highly integrated Multi-Chip-Module on glass and usual IC ceramics packaging. The use of ceramic and the development of sealing technologies achieve hermetic requirements. Moreover, thanks to a chip scale package approach the final device exhibits a much minimized footprint. One of the main advantages of the package is its flexibility to be soldered or plugged anywhere on the printed circuit board as any other electronic device. As a demonstrator we present a 2 by 4 10Gbps transceiver operating at 850nm.

High Resolution Fabrication of Interconnection Lines Using Picosecond Laser and Controlled Deposition of Gold Nanoparticles

NASA Astrophysics Data System (ADS)

Shahmoon, Asaf; Strauß, Johnnes; Zafri, Hadar; Schmidt, Michael; Zalevsky, Zeev

In this paper we present the fabrication procedure as well as the preliminary experimental results of a novel method for construction of high resolution nanometric interconnection lines. The fabrication procedure relies on a self-assembly process of gold nanoparticles at specific predetermined nanostructures. The nanostructures for the self-assembly process are based on the focused ion beam (FIB) or scanning electron beam (SEM) technology. The assembled nanoparticles are being illuminated using a picosecond laser with a wavelength of 532 nm. Different pulse energies have been investigated. The paper aimed at developing a novel and reliable process for fabrication of interconnection lines encompass three different disciplines, self-assembly of nanometric particles, optics and microelectronic.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tauke-Pedretti, Anna; Skogen, Erik J; Vawter, Gregory A

An optical sampler includes a first and second 1.times.n optical beam splitters splitting an input optical sampling signal and an optical analog input signal into n parallel channels, respectively, a plurality of optical delay elements providing n parallel delayed input optical sampling signals, n photodiodes converting the n parallel optical analog input signals into n respective electrical output signals, and n optical modulators modulating the input optical sampling signal or the optical analog input signal by the respective electrical output signals, and providing n successive optical samples of the optical analog input signal. A plurality of output photodiodes and eADCsmore » convert the n successive optical samples to n successive digital samples. The optical modulator may be a photodiode interconnected Mach-Zehnder Modulator. A method of sampling the optical analog input signal is disclosed.« less

Portable guided-mode resonance biosensor platform for point-of-care testing

NASA Astrophysics Data System (ADS)

Sung, Gun Yong; Kim, Wan-Joong; Ko, Hyunsung; Kim, Bong K.; Kim, Kyung-Hyun; Huh, Chul; Hong, Jongcheol

2012-10-01

It represents a viable solution for the realization of a portable biosensor platform that could screen/diagnose acute myocardial infarction by measuring cardiac marker concentrations such as cardiac troponin I (cTnI), creatine kinase MB (CK-MB), and myoglobin (MYO) for application to u-health monitoring system. The portable biosensor platform introduced in this presentation has a more compact structure and a much higher measuring resolution than a conventional spectrometer system. Portable guided-mode resonance (GMR) biosensor platform was composed of a biosensor chip stage, an optical pick-up module, and a data display panel. Disposable plastic GMR biosensor chips with nano-grating patterns were fabricated by injection-molding. Whole blood filtration and label-free immunoassay were performed on these single chips, automatically. Optical pick-up module was fabricated by using the miniaturized bulk optics and the interconnecting optical fibers and a tunable VCSEL (vertical cavity surface emitting laser). The reflectance spectrum from the GMR biosensor was measured by the optical pick-up module. Cardiac markers in human serum with concentrations less than 0.1ng/mL were analyzed using a GMR biosensor. Analysis time was 30min, which is short enough to meet clinical requirements. Our results show that the GMR biosensor will be very useful in developing lowcost portable biosensors that can screen for cardiac diseases.

CMOS-compatible InP/InGaAs digital photoreceiver

DOEpatents

Lovejoy, Michael L.; Rose, Benny H.; Craft, David C.; Enquist, Paul M.; Slater, Jr., David B.

1997-01-01

A digital photoreceiver is formed monolithically on an InP semiconductor substrate and comprises a p-i-n photodetector formed from a plurality of InP/InGaAs layers deposited by an epitaxial growth process and an adjacent heterojunction bipolar transistor (HBT) amplifier formed from the same InP/InGaAs layers. The photoreceiver amplifier operates in a large-signal mode to convert a detected photocurrent signal into an amplified output capable of directly driving integrated circuits such as CMOS. In combination with an optical transmitter, the photoreceiver may be used to establish a short-range channel of digital optical communications between integrated circuits with applications to multi-chip modules (MCMs). The photoreceiver may also be used with fiber optic coupling for establishing longer-range digital communications (i.e. optical interconnects) between distributed computers or the like. Arrays of digital photoreceivers may be formed on a common substrate for establishing a plurality of channels of digital optical communication, with each photoreceiver being spaced by less than about 1 mm and consuming less than about 20 mW of power, and preferably less than about 10 mW. Such photoreceiver arrays are useful for transferring huge amounts of digital data between integrated circuits at bit rates of up to about 1000 Mb/s or more.

CMOS-compatible InP/InGaAs digital photoreceiver

DOEpatents

Lovejoy, M.L.; Rose, B.H.; Craft, D.C.; Enquist, P.M.; Slater, D.B. Jr.

1997-11-04

A digital photoreceiver is formed monolithically on an InP semiconductor substrate and comprises a p-i-n photodetector formed from a plurality of InP/InGaAs layers deposited by an epitaxial growth process and an adjacent heterojunction bipolar transistor (HBT) amplifier formed from the same InP/InGaAs layers. The photoreceiver amplifier operates in a large-signal mode to convert a detected photocurrent signal into an amplified output capable of directly driving integrated circuits such as CMOS. In combination with an optical transmitter, the photoreceiver may be used to establish a short-range channel of digital optical communications between integrated circuits with applications to multi-chip modules (MCMs). The photoreceiver may also be used with fiber optic coupling for establishing longer-range digital communications (i.e. optical interconnects) between distributed computers or the like. Arrays of digital photoreceivers may be formed on a common substrate for establishing a plurality of channels of digital optical communication, with each photoreceiver being spaced by less than about 1 mm and consuming less than about 20 mW of power, and preferably less than about 10 mW. Such photoreceiver arrays are useful for transferring huge amounts of digital data between integrated circuits at bit rates of up to about 1,000 Mb/s or more. 4 figs.

Application Processing | Distributed Generation Interconnection

Science.gov Websites

delivering swift customer service. The rapid rise of distributed generation (DG) PV interconnection speed processing, reduce paperwork, and improve customer service. Webinars and publications are

The Need for Optical Means as an Alternative for Electronic Computing

NASA Technical Reports Server (NTRS)

Adbeldayem, Hossin; Frazier, Donald; Witherow, William; Paley, Steve; Penn, Benjamin; Bank, Curtis; Whitaker, Ann F. (Technical Monitor)

2001-01-01

An increasing demand for faster computers is rapidly growing to encounter the fast growing rate of Internet, space communication, and robotic industry. Unfortunately, the Very Large Scale Integration technology is approaching its fundamental limits beyond which the device will be unreliable. Optical interconnections and optical integrated circuits are strongly believed to provide the way out of the extreme limitations imposed on the growth of speed and complexity of nowadays computations by conventional electronics. This paper demonstrates two ultra-fast, all-optical logic gates and a high-density storage medium, which are essential components in building the future optical computer.

2 Gbit/s 0.5 μm complementary metal-oxide semiconductor optical transceiver with event-driven dynamic power-on capability

NASA Astrophysics Data System (ADS)

Wang, Xingle; Kiamilev, Fouad; Gui, Ping; Wang, Xiaoqing; Ekman, Jeremy; Zuo, Yongrong; Blankenberg, Jason; Haney, Michael

2006-06-01

A 2 Gb/s0.5 μm complementary metal-oxide semiconductor optical transceiver designed for board- or backplane level power-efficient interconnections is presented. The transceiver supports optical wake-on-link (OWL), an event-driven dynamic power-on technique. Depending on external events, the transceiver resides in either the active mode or the sleep mode and switches accordingly. The active-to-sleep transition shuts off the normal, gigabit link and turns on dedicated circuits to establish a low-power (~1.8 mW), low data rate (less than 100 Mbits/s) link. In contrast the normal, gigabit link consumes over 100 mW. Similarly the sleep-to-active transition shuts off the low-power link and turns on the normal, gigabit link. The low-power link, sharing the same optical channel with the normal, gigabit link, is used to achieve transmitter/receiver pair power-on synchronization and greatly reduces the power consumption of the transceiver. A free-space optical platform was built to evaluate the transceiver performance. The experiment successfully demonstrated the event-driven dynamic power-on operation. To our knowledge, this is the first time a dynamic power-on scheme has been implemented for optical interconnects. The areas of the circuits that implement the low-power link are approximately one-tenth of the areas of the gigabit link circuits.

78 FR 62346 - Combined Notice of Filings #1

Federal Register 2010, 2011, 2012, 2013, 2014

2013-10-18

... Due: 5 p.m. ET 10/29/13. Docket Numbers: ER14-58-000. Applicants: The Potomac Edison Company, PJM Interconnection, L.L.C. Description: FirstEnergy and Potomac Edison Co submit PJM Service Agreement No. 3649 to be.... Docket Numbers: ER14-59-000. Applicants: The Potomac Edison Company, PJM Interconnection, L.L.C...

Universal test system for system embedded optical interconnect

NASA Astrophysics Data System (ADS)

Pitwon, R.; Wang, K.; Immonen, M.; Schröder, H.; Neitz, M.

2018-02-01

We introduce a universal test and measurement system allowing comparative characterisation of optical transceivers, board-to-board optical connectors and both embedded and passive optical circuit boards. The system comprises a test enclosure with interlocking and interchangeable test cards, allowing different technologies spanning different Technology Readiness Levels to be both characterised alone and in combination with other technologies. They form part of the open test design standards portfolio developed on the FP7 PhoxTroT and H2020 COSMICC projects and allow testing on a common test platform.

Comparison of self-written waveguide techniques and bulk index matching for low-loss polymer waveguide interconnects

NASA Astrophysics Data System (ADS)

Burrell, Derek; Middlebrook, Christopher

2016-03-01

Polymer waveguides (PWGs) are used within photonic interconnects as inexpensive and versatile substitutes for traditional optical fibers. The PWGs are typically aligned to silica-based optical fibers for coupling. An epoxide elastomer is then applied and cured at the interface for index matching and rigid attachment. Self-written waveguides (SWWs) are proposed as an alternative to further reduce connection insertion loss (IL) and alleviate marginal misalignment issues. Elastomer material is deposited after the initial alignment, and SWWs are formed by injecting ultraviolet (UV) light into the fiber or waveguide. The coupled UV light cures a channel between the two differing structures. A suitable cladding layer can be applied after development. Such factors as longitudinal gap distance, UV cure time, input power level, polymer material selection and choice of solvent affect the resulting SWWs. Experimental data are compared between purely index-matched samples and those with SWWs at the fiber-PWG interface. It is shown that < 1 dB IL per connection can be achieved by either method and results indicate lowest potential losses associated with a fine-tuned self-writing process. Successfully fabricated SWWs reduce overall processing time and enable an effectively continuous low-loss rigid interconnect.

Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications

NASA Astrophysics Data System (ADS)

Jiang, Hongjin

SnPb solders have long been used as interconnect materials in microelectronic packaging. Due to the health threat of lead to human beings, the use of lead-free interconnect materials is imperative. Three kinds of lead-free interconnect materials are being investigated, namely lead-free metal solders (SnAg, SnAgCu, etc.), electrically conductive adhesives (ECAs) and carbon nanotubes (CNTs). However, there are still limitations for the full utilization of these lead-free interconnect materials in the microelectronic packaging, such as higher melting point of lead-free metal solders, lower electrical conductivity of the ECAs and poor adhesion of CNTs to substrates. This thesis is devoted to the research and development of low processing temperature lead-free interconnect materials for microelectronic packaging applications with an emphasis on fundamental studies of nanoparticles synthesis, dispersion and oxidation prevention, and nanocomposites fabrication. Oxide-free tin (Sn), tin/silver (96.5Sn3.5Ag) and tin/silver/copper (96.5Sn3.0Ag0.5Cu) alloy nanoparticles with different sizes were synthesized by a low temperature chemical reduction method. Both size dependent melting point and latent heat of fusion of the synthesized nanoparticles were obtained. The nano lead-free solder pastes/composites created by dispersing the SnAg or SnAgCu alloy nanoparticles into an acidic type flux spread and wet on the cleaned copper surface at 220 to 230°C. This study demonstrated the feasibility of nano sized SnAg or SnAgCu alloy particle pastes for low processing temperature lead-free interconnect applications in microelectronic packaging.

In plane optical sensor based on organic electronic devices

NASA Astrophysics Data System (ADS)

Koetse, Marc; Rensing, Peter; van Heck, Gert; Sharpe, Ruben; Allard, Bart; Wieringa, Fokko; Kruijt, Peter; Meulendijks, Nicole; Jansen, Henk; Schoo, Herman

2008-08-01

Sensors based on organic electronic devices are emerging in a wide range of application areas. Here we present a sensor platform using organic light emitting diodes (OLED) and organic photodiodes (OPD) as active components. By means of lamination and interconnection technology the functional foils with OLED and OPD arrays form an in-plane optical sensor platform (IPOS). This platform can be extended with a wireless data and signal processing unit yielding a sensor node. The focus of our research is to engage the node in a healthcare application, in which a bandage is able to monitor the vital signs of a person, a so-called Smart Bandage. One of the principles that is described here is based on measuring the absorption modulation of blood volume induced by the pulse (photoplethysmography). The information from such a bandage could be used to monitor wound healing by measuring the perfusion in the skin. The OLED and OPD devices are manufactured on separate foils and glass substrates by means of printing and coating technologies. Furthermore, the modular approach allows for the application of the optical sensing unit in a variety of other fields including chemical sensing. This, ultimately enables the measurement of a large variety of physiological parameters using the same bandage and the same basic sensor architecture. Here we discuss the build-up of our device in general terms. Specific characteristics of the used OLEDs and OPDs are shown and finally we demonstrate the functionality by simultaneously recorded photoplethysmograms of our device and a clinical pulseoximeter.

Reliability assessment of ceramic column grid array (CCGA717) interconnect packages under extreme temperatures for space applications (-185°C to +125°C)

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2010-02-01

Ceramic Column Grid Array packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performance, compatibility with standard surface-mount packaging assembly processes, etc. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, payload electronics, etc. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short and long-term space missions. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide have been assembled, inspected non-destructively and subsequently subjected to extreme temperature thermal cycling to assess the reliability for future deep space, short and long-term, extreme temperature missions. In this investigation, the employed temperature range covers from -185°C to +125°C extreme thermal environments. The test hardware consists of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The CCGA717 package is 33 mm × 33 mm with a 27×27 array of 80%/20% Pb/Sn columns on a 1.27 mm pitch. The resistance of daisy-chained, CCGA interconnects were continuously monitored as a function of thermal cycling. Electrical resistance measurements as a function of thermal cycling are reported and the tests to date have shown significant change in daisy chain resistance as a function of thermal cycling. The change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. This paper will describe the experimental test results of CCGA testing under wide extreme temperatures. Standard Weibull analysis tools were used to extract the Weibull parameters to understand the CCGA failures. Optical inspection results clearly indicate that the solder joints of columns with the board and the ceramic package have failed as a function of thermal cycling. The first failure was observed at 137th thermal cycle and 63.2% failures of daisy chains have occurred at about 664 thermal cycles. The shape parameter extracted from Weibull plot was about 1.47 which indicates the failures were related to failures occurred during the flat region or useful life region of standard bath tub curve. Based on this experimental test data one can use the CCGAs for the temperature range studied for ~100 thermal cycles (ΔT = 310°C, 5oC/minute, and 15 minutes dwell) with high degree of confidence for high reliability space and other applications.

Optical mass memory system (AMM-13). AMM/DBMS interface control document

NASA Technical Reports Server (NTRS)

Bailey, G. A.

1980-01-01

The baseline for external interfaces of a 10 to the 13th power bit, optical archival mass memory system (AMM-13) is established. The types of interfaces addressed include data transfer; AMM-13, Data Base Management System, NASA End-to-End Data System computer interconnect; data/control input and output interfaces; test input data source; file management; and facilities interface.

Information engineering

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hunt, D.N.

1997-02-01

The Information Engineering thrust area develops information technology to support the programmatic needs of Lawrence Livermore National Laboratory`s Engineering Directorate. Progress in five programmatic areas are described in separate reports contained herein. These are entitled Three-dimensional Object Creation, Manipulation, and Transport, Zephyr:A Secure Internet-Based Process to Streamline Engineering Procurements, Subcarrier Multiplexing: Optical Network Demonstrations, Parallel Optical Interconnect Technology Demonstration, and Intelligent Automation Architecture.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tweedie, A.; Doris, E.

Establishing interconnection to the grid is a recognized barrier to the deployment of distributed energy generation. This report compares interconnection processes for photovoltaic projects in California and Germany. This report summarizes the steps of the interconnection process for developers and utilities, the average length of time utilities take to process applications, and paperwork required of project developers. Based on a review of the available literature, this report finds that while the interconnection procedures and timelines are similar in California and Germany, differences in the legal and regulatory frameworks are substantial.

Interconnections between various analytic approaches applicable to third-order nonlinear differential equations

PubMed Central

Mohanasubha, R.; Chandrasekar, V. K.; Senthilvelan, M.; Lakshmanan, M.

2015-01-01

We unearth the interconnection between various analytical methods which are widely used in the current literature to identify integrable nonlinear dynamical systems described by third-order nonlinear ODEs. We establish an important interconnection between the extended Prelle–Singer procedure and λ-symmetries approach applicable to third-order ODEs to bring out the various linkages associated with these different techniques. By establishing this interconnection we demonstrate that given any one of the quantities as a starting point in the family consisting of Jacobi last multipliers, Darboux polynomials, Lie point symmetries, adjoint-symmetries, λ-symmetries, integrating factors and null forms one can derive the rest of the quantities in this family in a straightforward and unambiguous manner. We also illustrate our findings with three specific examples. PMID:27547076

Interconnections between various analytic approaches applicable to third-order nonlinear differential equations.

PubMed

Mohanasubha, R; Chandrasekar, V K; Senthilvelan, M; Lakshmanan, M

2015-04-08

We unearth the interconnection between various analytical methods which are widely used in the current literature to identify integrable nonlinear dynamical systems described by third-order nonlinear ODEs. We establish an important interconnection between the extended Prelle-Singer procedure and λ-symmetries approach applicable to third-order ODEs to bring out the various linkages associated with these different techniques. By establishing this interconnection we demonstrate that given any one of the quantities as a starting point in the family consisting of Jacobi last multipliers, Darboux polynomials, Lie point symmetries, adjoint-symmetries, λ-symmetries, integrating factors and null forms one can derive the rest of the quantities in this family in a straightforward and unambiguous manner. We also illustrate our findings with three specific examples.

Development of a networked four-million-pixel pathological and radiological digital image presentation system and its application to medical conferences

NASA Astrophysics Data System (ADS)

Sakano, Toshikazu; Furukawa, Isao; Okumura, Akira; Yamaguchi, Takahiro; Fujii, Tetsuro; Ono, Sadayasu; Suzuki, Junji; Matsuya, Shoji; Ishihara, Teruo

2001-08-01

The wide spread of digital technology in the medical field has led to a demand for the high-quality, high-speed, and user-friendly digital image presentation system in the daily medical conferences. To fulfill this demand, we developed a presentation system for radiological and pathological images. It is composed of a super-high-definition (SHD) imaging system, a radiological image database (R-DB), a pathological image database (P-DB), and the network interconnecting these three. The R-DB consists of a 270GB RAID, a database server workstation, and a film digitizer. The P-DB includes an optical microscope, a four-million-pixel digital camera, a 90GB RAID, and a database server workstation. A 100Mbps Ethernet LAN interconnects all the sub-systems. The Web-based system operation software was developed for easy operation. We installed the whole system in NTT East Kanto Hospital to evaluate it in the weekly case conferences. The SHD system could display digital full-color images of 2048 x 2048 pixels on a 28-inch CRT monitor. The doctors evaluated the image quality and size, and found them applicable to the actual medical diagnosis. They also appreciated short image switching time that contributed to smooth presentation. Thus, we confirmed that its characteristics met the requirements.

77 FR 64975 - Combined Notice of Filings #1

Federal Register 2010, 2011, 2012, 2013, 2014

2012-10-24

...; ER13-111-000. Applicants: Peetz Logan Interconnect, LLC, Sagebrush, a California partnership, Sky River LLC. Description: Peetz Logan Interconnect, LLC, Sagebrush, a California partnership and Sky River LLC...

Nonlinear Silicon Photonics: Extending Platforms, Control, and Applications

NASA Astrophysics Data System (ADS)

Miller, Steven Andrew

Silicon photonics is a revolutionary technology that enables the control of light inside a silicon chip and holds promise to impact many applications from data center optical interconnects to optical sensing and even quantum optics. The tight confinement of light inside these chips greatly enhances light-matter interactions, making this an ideal platform for nonlinear photonics. Recently, microresonator-based Kerr frequency comb generation has become a prevalent emerging field, enabling the generation of a broadband optical pulse train by inputting a low-power continuous-wave laser into a low-loss chip-scale micro-cavity. These chip-scale combs have a wide variety of applications, including optical clocks, optical spectroscopy, and data communications. Several important applications in biological, chemical and atmospheric areas require combs generated in the visible and mid-infrared wavelength ranges, where there has been far less research and development compared with the near-infrared. Additionally, most platforms widely for combs are passive, limiting the ability to control and optimize the frequency combs. In this dissertation, we set out to address these shortcomings and introduce new tunability as well as wavelength flexibility in order to enable new applications for microresonator frequency combs. The silicon nitride platform for near-infrared combs is generally a passive platform with limited tuning capabilities. We overcome dispersion limitations in the visible range by leveraging the second-order nonlinearity of silicon nitride and demonstrate visible comb lines. We then further investigate the second-order nonlinearity of silicon nitride by measuring the linear electro-optic effect, a potential tuning mechanism. Finally, we introduce thermal tuning onto the silicon nitride platform and demonstrate tuning of the resonance extinction and dispersion of a micro-cavity using a coupled cavity design. We also address the silicon mid-infrared frequency comb platform. The transparency range of the traditional silicon platform prohibits operation beyond 4 mum wavelength. Here we show that a silicon photonics platform can be leveraged for broadband mid-infrared operation without introducing complexity in fabrication. Both an air-clad and fully suspended silicon platform can enable broadband, low-loss propagation and comb generation as high as 6 mum. We demonstrate a high quality factor resonator near 4 mum wavelength, more than an order of magnitude higher than the traditional platform. Finally, we discuss future avenues of research building on the work presented here.

Solar cell array design handbook, volume 1

NASA Technical Reports Server (NTRS)

Rauschenbach, H. S.

1976-01-01

Twelve chapters discuss the following: historical developments, the environment and its effects, solar cells, solar cell filters and covers, solar cell and other electrical interconnections, blocking and shunt diodes, substrates and deployment mechanisms, material properties, design synthesis and optimization, design analysis, procurement, production and cost aspects, evaluation and test, orbital performance, and illustrative design examples. A comprehensive index permits rapid locating of desired topics. The handbook consists of two volumes: Volume 1 is of an expository nature while Volume 2 contains detailed design data in an appendix-like fashion. Volume 2 includes solar cell performance data, applicable unit conversion factors and physical constants, and mechanical, electrical, thermal optical, magnetic, and outgassing material properties. Extensive references are provided.

Using SPEEDES to simulate the blue gene interconnect network

NASA Technical Reports Server (NTRS)

Springer, P.; Upchurch, E.

2003-01-01

JPL and the Center for Advanced Computer Architecture (CACR) is conducting application and simulation analyses of BG/L in order to establish a range of effectiveness for the Blue Gene/L MPP architecture in performing important classes of computations and to determine the design sensitivity of the global interconnect network in support of real world ASCI application execution.

Development of an optical parallel logic device and a half-adder circuit for digital optical processing

NASA Technical Reports Server (NTRS)

Athale, R. A.; Lee, S. H.

1978-01-01

The paper describes the fabrication and operation of an optical parallel logic (OPAL) device which performs Boolean algebraic operations on binary images. Several logic operations on two input binary images were demonstrated using an 8 x 8 device with a CdS photoconductor and a twisted nematic liquid crystal. Two such OPAL devices can be interconnected to form a half-adder circuit which is one of the essential components of a CPU in a digital signal processor.

Challenges in the implementation of dense wavelength division multiplexed (DWDM) optical interconnects using resonant silicon photonics (invited)

DOE PAGES

Lentine, Anthony L.; DeRose, Christopher T.

2016-02-12

In this study, small silicon photonics micro-resonator modulators and filters hold the promise for multi-terabit per-second interconnects at energy consumptions well below 1 pJ/bit. To date, no products exist and little known commercial development is occurring using this technology. Why? In this talk, we review the many challenges that remain to be overcome in bringing this technology from the research labs to the field where they can overcome important commercial, industrial, and national security limitations of existing photonic technologies.

Board-level optical clock signal distribution using Si CMOS-compatible polyimide-based 1- to 48-fanout H-tree

NASA Astrophysics Data System (ADS)

Wu, Linghui; Bihari, Bipin; Gan, Jianhua; Chen, Ray T.; Tang, Suning

1998-08-01

Si-CMOS compatible polymer-based waveguides for optoelectronic interconnects and packaging have been fabricated and characterized. A 1-to-48 fanout optoelectronic interconnection layer (OIL) structure based on Ultradel 9120/9020 for the high-speed massive clock signal distribution for a Cray T-90 supercomputer board has been constructed. The OIL employs multimode polymeric channel waveguides in conjunction with surface-normal waveguide output coupler and 1-to-2 splitter. A total insertion loss of 7.98 dB at 850 nm was measured experimentally.

Fatigue failure kinetics and structural changes in lead-free interconnects due to mechanical and thermal cycling

NASA Astrophysics Data System (ADS)

Fiedler, Brent Alan

Environmental and human health concerns drove European parliament to mandate the Reduction of Hazardous Substances (RoHS) for electronics. This was enacted in July 2006 and has practically eliminated lead in solder interconnects. There is concern in the electronics packaging community because modern lead-free solder is rich in tin. Presently, near-eutectic tin-silver-copper solders are favored by industry. These solders are stiffer than the lead-tin near-eutectic alloys, have a higher melting temperature, fewer slip systems, and form intermetallic compounds (IMC) with Cu, Ni and Ag, each of which tend to have a negative effect on lifetime. In order to design more reliable interconnects, the experimental observation of cracking mechanisms is necessary for the correct application of existing theories. The goal of this research is to observe the failure modes resulting from mode II strain and to determine the damage mechanisms which describe fatigue failures in 95.5 Sn- 4.0 Ag - 0.5 Cu wt% (SAC405) lead-free solder interconnects. In this work the initiation sites and crack paths were characterized for SAC405 ball-grid array (BGA) interconnects with electroless-nickel immersion-gold (ENIG) pad-finish. The interconnects were arranged in a perimeter array and tested in fully assembled packages. Evaluation methods included monotonic and displacement controlled mechanical shear fatigue tests, and temperature cycling. The specimens were characterized using metallogaphy, including optical and electron microscopy as well as energy dispersive spectroscopy (EDS) and precise real-time electrical resistance structural health monitoring (SHM). In mechanical shear fatigue tests, strain was applied by the substrates, simulating dissimilar coefficients of thermal expansion (CTE) between the board and chip-carrier. This type of strain caused cracks to initiate in the soft Sn-rich solder and grow near the interface between the solder and intermetallic compounds (IMC). The growth near the interface was found to be caused by dislocation pile-ups at the IMC when the plastic zone ahead of the crack tip reached this interface. In temperature cycling testing, strains arose within the interconnect due to CTE mismatch between the solder and IMC. The substrates had matched CTE for all specimens in this research. Because of this, all the temperature cycling cracks were observed at interfaces, generally between the solder and IMC. Additionally, real-time electrical resistance may be a useful non-destructive evaluation (NDE) tool for the empirical observation of fatigue cracking in ball-grid arrays (BGA) during both mechanical and temperature cycling tests.

Realization of 10 GHz minus 30dB on-chip micro-optical links with Si-Ge RF bi-polar technology

NASA Astrophysics Data System (ADS)

Ogudo, Kingsley A.; Snyman, Lukas W.; Polleux, Jean-Luc; Viana, Carlos; Tegegne, Zerihun

2014-06-01

Si Avalanche based LEDs technology has been developed in the 650 -850nm wavelength regime [1, 2]. Correspondingly, small micro-dimensioned detectors with pW/μm2 sensitivity have been developed for the same wavelength range utilizing Si-Ge detector technology with detection efficiencies of up to 0.85, and with a transition frequencies of up to 80 GHz [3] A series of on-chip optical links of 50 micron length, utilizing 650 - 850 nm propagation wavelength have been designed and realized, utilizing a Si Ge radio frequency bipolar process. Micron dimensioned optical sources, waveguides and detectors were all integrated on the same chip to form a complete optical link on-chip. Avalanche based Si LEDs (Si Av LEDs), Schottky contacting, TEOS densification strategies, silicon nitride based waveguides, and state of the art Si-Ge bipolar detector technologies were used as key design strategies. Best performances show optical coupling from source to detector of up to 10GHz and - 40dBm total optical link budget loss with a potential transition frequency coupling of up to 40GHz utilizing Si Ge based LEDs. The technology is particularly suitable for application as on-chip optical links, optical MEMS and MOEMS, as well as for optical interconnects utilizing low loss, side surface, waveguide- to-optical fiber coupling. Most particularly is one of our designed waveguide which have a good core axis alignment with the optical source and yield 10GHz -30dB on-chip micro-optical links as shown in Fig 9 (c). The technology as developed has been appropriately IP protected.

Integration and manufacture of multifunctional planar lightwave circuits

NASA Astrophysics Data System (ADS)

Lipscomb, George F.; Ticknor, Anthony J.; Stiller, Marc A.; Chen, Wenjie; Schroeter, Paul

2001-11-01

The demands of exponentially growing Internet traffic, coupled with the advent of Dense Wavelength Division Multiplexing (DWDM) fiber optic systems to meet those demands, have triggered a revolution in the telecommunications industry. This dramatic change has been built upon, and has driven, improvements in fiber optic component technology. The next generation of systems for the all optical network will require higher performance components coupled with dramatically lower costs. One approach to achieve significantly lower costs per function is to employ Planar Lightwave Circuits (PLC) to integrate multiple optical functions in a single package. PLCs are optical circuits laid out on a silicon wafer, and are made using tools and techniques developed to extremely high levels by the semi-conductor industry. In this way multiple components can be fabricated and interconnected at once, significantly reducing both the manufacturing and the packaging/assembly costs. Currently, the predominant commercial application of PLC technology is arrayed-waveguide gratings (AWG's) for multiplexing and demultiplexing multiple wavelength channels in a DWDM system. Although this is generally perceived as a single-function device, it can be performing the function of more than 100 discrete fiber-optic components and already represents a considerable degree of integration. Furthermore, programmable functions such as variable-optical attenuators (VOAs) and switches made with compatible PLC technology are now moving into commercial production. In this paper, we present results on the integration of active and passive functions together using PLC technology, e.g. a 40 channel AWG multiplexer with 40 individually controllable VOAs.

Time skewing and amplitude nonlinearity mitigation by feedback equalization for 56 Gbps VCSEL-based PAM-4 links

NASA Astrophysics Data System (ADS)

You, Yue; Zhang, Wenjia; Sun, Lin; Du, Jiangbing; Liang, Chenyu; Yang, Fan; He, Zuyuan

2018-03-01

The vertical cavity surface emitting laser (VCSEL)-based multimode optical transceivers enabled by pulse amplitude modulation (PAM)-4 will be commercialized in near future to meet the 400-Gbps standard short reach optical interconnects. It is still challenging to achieve over 56/112-Gbps with the multilevel signaling as the multimode property of the device and link would introduce the nonlinear temporal response for the different levels. In this work, we scrutinize the distortions that relates to the multilevel feature of PAM-4 modulation, and propose an effective feedback equalization scheme for 56-Gbps VCSEL-based PAM-4 optical interconnects system to mitigate the distortions caused by eye timing-skew and nonlinear power-dependent noise. Level redistribution at Tx side is theoretically modeled and constructed to achieve equivalent symbol error ratios (SERs) of four levels and improved BER performance. The cause of the eye skewing and the mitigation approach are also simulated at 100-Gbps and experimentally investigated at 56-Gbps. The results indicate more than 2-dB power penalty improvement has been achieved by using such a distortion aware equalizer.

Fiber Optic Cable Feedthrough and Sealing

NASA Technical Reports Server (NTRS)

Fan, Robert J.

1998-01-01

A novel fiberoptic hermetic bulkhead feedthrough has been developed which will offer cryogenic sealing at leak rates of 10(exp -11) cc/sec helium. This feedthrough was developed for NASA in response to needs for a hermetically sealed feedthrough which could withstand a range of temperatures from low cryogenic (-196 C), due to liquid fuels and oxidizers, to high temperatures (+200 C) encountered in the proximity of combustion gasses. The development effort will be reported from conceptual design of single and multi-channel feedthrough units with single interconnection interfaces to units with double-ended interconnection interfaces. Various combinations of fiber/buffers are reported with recommendations based on test results. A comprehensive series of environmental and mechanical tests were performed to evaluate the feedthroughs in adverse conditions. Test results are reported including insertion loss, salt spray, sinusoidal vibration, random vibration, mechanical shock, thermal shock and humidity. A second set of feedthrough units was exposed to 3 different types of radiation. Optical transmittance changes during the tests were monitored and leak rate testing was done after each test. State-of-the-art technology in optical fiber feedthroughs constructed with polycrystalline ceramic is presented.

OPTICAL PROCESSING OF INFORMATION: Multistage optoelectronic two-dimensional image switches

NASA Astrophysics Data System (ADS)

Fedorov, V. B.

1994-06-01

The implementation principles and the feasibility of construction of high-throughput multistage optoelectronic switches, capable of transmitting data in the form of two-dimensional images along interconnected pairs of optical channels, are considered. Different ways of realising compact switches are proposed. They are based on the use of polarisation-sensitive elements, arrays of modulators of the plane of polarisation of light, arrays of objectives, and free-space optics. Optical systems of such switches can theoretically ensure that the resolution and optical losses in two-dimensional image transmission are limited only by diffraction. Estimates are obtained of the main maximum-performance parameters of the proposed optoelectronic image switches.

Optical wireless networked-systems: applications to aircrafts

NASA Astrophysics Data System (ADS)

Kavehrad, Mohsen; Fadlullah, Jarir

2011-01-01

This paper focuses on leveraging the progress in semiconductor technologies to facilitate production of efficient light-based in-flight entertainment (IFE), distributed sensing, navigation and control systems. We demonstrate the ease of configuring "engineered pipes" using cheap lenses, etc. to achieve simple linear transmission capacity growth. Investigation of energy-efficient, miniaturized transceivers will create a wireless medium, for both inter and intra aircrafts, providing enhanced security, and improved quality-of-service for communications links in greater harmony with onboard systems. The applications will seamlessly inter-connect multiple intelligent devices in a network that is deployable for aircrafts navigation systems, onboard sensors and entertainment data delivery systems, and high-definition audio-visual broadcasting systems. Recent experimental results on a high-capacity infrared (808 nm) system are presented. The light source can be applied in a hybrid package along with a visible lighting LED for both lighting and communications. Also, we present a pragmatic combination of light communications through "Spotlighting" and existing onboard power-lines. It is demonstrated in details that a high-capacity IFE visible light system communicating over existing power-lines (VLC/PLC) may lead to savings in many areas through reduction of size, weight and energy consumption. This paper addresses the challenges of integrating optimized optical devices in the variety of environments described above, and presents mitigation and tailoring approaches for a multi-purpose optical network.

Electro-optic guided-mode resonance tuning suppressible by optically induced screening in a vertically coupled hybrid GaN/Si microring resonator

NASA Astrophysics Data System (ADS)

Thubthimthong, B.; Sasaki, T.; Hane, K.

2018-02-01

GaN as a nanophotonic material has gained much attention in recent years. Using the hybrid GaN/Si platform, we report the electro-optic tuning of guided-mode resonance in a vertically coupled hybrid GaN/Si microring resonator operating in the 1.5 μm window with up to a 6 dB extinction ratio and a 1.5 MHz modulation frequency (test equipment limit). The electro-optic tuning could be optically suppressed by electron-hole-originated screening induced by an ultraviolet excitation at 325 nm. Our work may benefit in externally intervenable optical interconnects for uninterrupted secure photonic networks.

Si-based optical I/O for optical memory interface

NASA Astrophysics Data System (ADS)

Ha, Kyoungho; Shin, Dongjae; Byun, Hyunil; Cho, Kwansik; Na, Kyoungwon; Ji, Hochul; Pyo, Junghyung; Hong, Seokyong; Lee, Kwanghyun; Lee, Beomseok; Shin, Yong-hwack; Kim, Junghye; Kim, Seong-gu; Joe, Insung; Suh, Sungdong; Choi, Sanghoon; Han, Sangdeok; Park, Yoondong; Choi, Hanmei; Kuh, Bongjin; Kim, Kichul; Choi, Jinwoo; Park, Sujin; Kim, Hyeunsu; Kim, Kiho; Choi, Jinyong; Lee, Hyunjoo; Yang, Sujin; Park, Sungho; Lee, Minwoo; Cho, Minchang; Kim, Saebyeol; Jeong, Taejin; Hyun, Seokhun; Cho, Cheongryong; Kim, Jeong-kyoum; Yoon, Hong-gu; Nam, Jeongsik; Kwon, Hyukjoon; Lee, Hocheol; Choi, Junghwan; Jang, Sungjin; Choi, Joosun; Chung, Chilhee

2012-01-01

Optical interconnects may provide solutions to the capacity-bandwidth trade-off of recent memory interface systems. For cost-effective optical memory interfaces, Samsung Electronics has been developing silicon photonics platforms on memory-compatible bulk-Si 300-mm wafers. The waveguide of 0.6 dB/mm propagation loss, vertical grating coupler of 2.7 dB coupling loss, modulator of 10 Gbps speed, and Ge/Si photodiode of 12.5 Gbps bandwidth have been achieved on the bulk-Si platform. 2x6.4 Gbps electrical driver circuits have been also fabricated using a CMOS process.

Comparative study on stained InGaAs quantum wells for high-speed optical-interconnect VCSELs

NASA Astrophysics Data System (ADS)

Li, Hui; Jia, Xiaowei

2018-05-01

The gain-carrier characteristics of InGaAs quantum well for 980 nm high-speed, energy-efficient vertical-cavity surface-emitting lasers are investigated. We specially studied the potentially InGaAs quantum well designs can be used for the active region of energy-efficient, temperature-stable 980-nm VCSEL, which introduced a quantum well gain peak wavelength-to-cavity resonance wavelength offset to improve the dynamic performance at high operation temperature. Several candidate quantum wells are being compared in theory and measurement. We found that ∼5 nm InGaAs QW with ∼6 nm barrier thickness is suitable for the active region of high-speed optical interconnect 980 nm VCSELs, and no significant improvement in the 20% range of In content of InGaAs QWs. The results are useful for next generation green photonic device design.

Novel WRM-based architecture of hybrid PON featuring online access and full-fiber-fault protection for smart grid

NASA Astrophysics Data System (ADS)

Li, Xingfeng; Gan, Chaoqin; Liu, Zongkang; Yan, Yuqi; Qiao, HuBao

2018-01-01

In this paper, a novel architecture of hybrid PON for smart grid is proposed by introducing a wavelength-routing module (WRM). By using conventional optical passive components, a WRM with M ports is designed. The symmetry and passivity of the WRM makes it be easily integrated and very cheap in practice. Via the WRM, two types of network based on different ONU-interconnected manner can realize online access. Depending on optical switches and interconnecting fibers, full-fiber-fault protection and dynamic bandwidth allocation are realized in these networks. With the help of amplitude modulation, DPSK modulation and RSOA technology, wavelength triple-reuse is achieved. By means of injecting signals into left and right branches in access ring simultaneously, the transmission delay is decreased. Finally, the performance analysis and simulation of the network verifies the feasibility of the proposed architecture.

Self assembled sulfur induced interconnected nanostructure TiO2 electrode for visible light photoresponse and photocatalytic application

NASA Astrophysics Data System (ADS)

Anitha, B.; Ravidhas, C.; Venkatesh, R.; Raj, A. Moses Ezhil; Ravichandran, K.; Subramanian, B.; Sanjeeviraja, C.

2017-07-01

Pristine TiO2 and sulfur doped TiO2 (S-TiO2) thin films were coated over the glass substrates by varying the concentration of sulfur source (thiourea - 2, 4, 6, 8 and 10 at%) using a cost-effective Jet nebulizer spray technique. The deposited thin films were in anatase phase with the tetragonal structure analyzed from the XRD pattern. The chemical state of the elements was determined from XPS analysis. Pristine TiO2 and S-TiO2 thin films depict the presence of spherical particles embedded over 3-D interconnected wire-like structure from SEM analysis. Optical studies revealed reduction in band gap of S-TiO2 films on increasing the sulfur concentration (3.2-2.8 eV). The sulfur incorporation in TiO2 lattice confirmed by the fall in intensity of near band edge emission as observed from room temperature PL spectra. The charge carrier dynamics of the prepared thin films were studied by means of steady state and transient photoconduction measurements. The photocatalytic performance of pristine TiO2 and S-TiO2 thin films for the degradation of malachite green dye was investigated under visible light.

Applications of SPICE for modeling miniaturized biomedical sensor systems

NASA Technical Reports Server (NTRS)

Mundt, C. W.; Nagle, H. T.

2000-01-01

This paper proposes a model for a miniaturized signal conditioning system for biopotential and ion-selective electrode arrays. The system consists of three main components: sensors, interconnections, and signal conditioning chip. The model for this system is based on SPICE. Transmission-line based equivalent circuits are used to represent the sensors, lumped resistance-capacitance circuits describe the interconnections, and a model for the signal conditioning chip is extracted from its layout. A system for measurements of biopotentials and ionic activities can be miniaturized and optimized for cardiovascular applications based on the development of an integrated SPICE system model of its electrochemical, interconnection, and electronic components.

Open System Interconnection - NASA program communications of the future. [developed by International aorganization for Standardization

NASA Technical Reports Server (NTRS)

Brady, Charles D.

1987-01-01

Open Systems Interconnection (OSI) standards are being developed by the ISO and the Consultative Committee on International Telephone and Telegraph with the support of industry. These standards are being developed to allow the interconnecting of computer systems and the interworking of applications such that the applications can be independent of any equipment manufacturer. Significant progress has been made, and the establishment of government OSI standards is being considered. There is considerable interest within NASA in the potential benefits of OSI and in communications standards in general. The OSI standards are being considered for possible application in the Space Station onboard data management system. The OSI standards have reached a high level of maturity, and it is now imperative that NASA plan for future migration to OSI where appropriate.

Interfacing broadband photonic qubits to on-chip cavity-protected rare-earth ensembles

PubMed Central

Zhong, Tian; Kindem, Jonathan M.; Rochman, Jake; Faraon, Andrei

2017-01-01

Ensembles of solid-state optical emitters enable broadband quantum storage and transduction of photonic qubits, with applications in high-rate quantum networks for secure communications and interconnecting future quantum computers. To transfer quantum states using ensembles, rephasing techniques are used to mitigate fast decoherence resulting from inhomogeneous broadening, but these techniques generally limit the bandwidth, efficiency and active times of the quantum interface. Here, we use a dense ensemble of neodymium rare-earth ions strongly coupled to a nanophotonic resonator to demonstrate a significant cavity protection effect at the single-photon level—a technique to suppress ensemble decoherence due to inhomogeneous broadening. The protected Rabi oscillations between the cavity field and the atomic super-radiant state enable ultra-fast transfer of photonic frequency qubits to the ions (∼50 GHz bandwidth) followed by retrieval with 98.7% fidelity. With the prospect of coupling to other long-lived rare-earth spin states, this technique opens the possibilities for broadband, always-ready quantum memories and fast optical-to-microwave transducers. PMID:28090078

A family of neuromuscular stimulators with optical transcutaneous control.

PubMed

Jarvis, J C; Salmons, S

1991-01-01

A family of miniature implantable neuromuscular stimulators has been developed using surface-mounted Philips 4000-series integrated circuits. The electronic components are mounted by hand on printed circuits (platinum/gold on alumina) and the electrical connections are made by reflow soldering. The plastic integrated-circuit packages, ceramic resistors and metal interconnections are protected from the body fluids by a coating of biocompatible silicone rubber. This simple technology provides reliable function for at least 4 months under implanted conditions. The circuits have in common a single lithium cell power-supply (3.2 V) and an optical sensor which can be used to detect light flashes through the skin after the device has been implanted. This information channel may be used to switch the output of a device on or off, or to cycle through a series of pre-set programs. The devices are currently finding application in studies which provide an experimental basis for the clinical exploitation of electrically stimulated skeletal muscle in cardiac assistance, sphincter reconstruction or functional electrical stimulation of paralysed limbs.

Enhanced photo response of mesoporous nanostructured CdS thin film via electrospray aerosol deposition technique

NASA Astrophysics Data System (ADS)

Logu, T.; Soundarrajan, P.; Sankarasubramanian, K.; Sethuraman, K.

2018-04-01

In this work, a high crystalline and mesoporous nanostructured cadmium sulfide (CdS) thin film was successfully grown on the FTO substrates using facile Electrospray Aerosol Deposition (ESAD) technique. The structural, optical, morphological and electrical properties of CdS thin film have been systematically examined. CdS thin film exhibits the hexagonal wurtzite crystal structure with polycrystalline nature. The optical band gap energy of the prepared film was estimated from the Tauc plot and is 2.43 eV. The SEM and AFM images show that the well-interconnected CdS nanoparticles gives mesoporous like morphology. The fine aerosol generated from the ESAD process induces the alteration in the surface morphological structure of deposited CdS film that consequences in enhanced electrical and photo-physical properties. The photoconductivity of the sample has been studied which demonstrates significant photo current. The present study predicts that mesoporous nanostructured CdS thin film would be given a special interest for optoelectronic applications.

Photogeneration of refractive-index patterns in doped polyimide films.

PubMed

Chakravorty, K K

1993-05-01

A photosensitive benzophenone tetracarboxylic dianhyride-alkylated diamine polyimide formulation has been evaluated for application in an optical interconnection area. The refractive-index patterns in this material were optically recorded by UV-assisted photodoping of sensitizers. The polyimide films were selectively doped with benzoin-type photosensitizers such as benzildimethylketal and benzoin ethyl ether, which cause a decrease in the refractive index. High-dose UV irradiation that causes cross linking of the polyimide chains was also employed for augmenting the refractive-index difference to 0.017 between the doped and undoped regions. Refractive-index variations and lightguiding properties were investigated as a function of doping concentrations and other processing conditions. The author utilized this technique for the fabrication of embedded polyimide channel waveguides. The two photosensitizers have different effects on the waveguiding characteristics of the polyimide films. Losses for benzoin ethyl ether remained low whereas doping with benzildimethylketal caused significant increase in the waveguiding loss at high doping concentrations. Near-field imaging of the output from such waveguides shows good confinement of 815-nm light.

A combined method for correlative 3D imaging of biological samples from macro to nano scale

NASA Astrophysics Data System (ADS)

Kellner, Manuela; Heidrich, Marko; Lorbeer, Raoul-Amadeus; Antonopoulos, Georgios C.; Knudsen, Lars; Wrede, Christoph; Izykowski, Nicole; Grothausmann, Roman; Jonigk, Danny; Ochs, Matthias; Ripken, Tammo; Kühnel, Mark P.; Meyer, Heiko

2016-10-01

Correlative analysis requires examination of a specimen from macro to nano scale as well as applicability of analytical methods ranging from morphological to molecular. Accomplishing this with one and the same sample is laborious at best, due to deformation and biodegradation during measurements or intermediary preparation steps. Furthermore, data alignment using differing imaging techniques turns out to be a complex task, which considerably complicates the interconnection of results. We present correlative imaging of the accessory rat lung lobe by combining a modified Scanning Laser Optical Tomography (SLOT) setup with a specially developed sample preparation method (CRISTAL). CRISTAL is a resin-based embedding method that optically clears the specimen while allowing sectioning and preventing degradation. We applied and correlated SLOT with Multi Photon Microscopy, histological and immunofluorescence analysis as well as Transmission Electron Microscopy, all in the same sample. Thus, combining CRISTAL with SLOT enables the correlative utilization of a vast variety of imaging techniques.

Interfacing broadband photonic qubits to on-chip cavity-protected rare-earth ensembles

NASA Astrophysics Data System (ADS)

Zhong, Tian; Kindem, Jonathan M.; Rochman, Jake; Faraon, Andrei

2017-01-01

Ensembles of solid-state optical emitters enable broadband quantum storage and transduction of photonic qubits, with applications in high-rate quantum networks for secure communications and interconnecting future quantum computers. To transfer quantum states using ensembles, rephasing techniques are used to mitigate fast decoherence resulting from inhomogeneous broadening, but these techniques generally limit the bandwidth, efficiency and active times of the quantum interface. Here, we use a dense ensemble of neodymium rare-earth ions strongly coupled to a nanophotonic resonator to demonstrate a significant cavity protection effect at the single-photon level--a technique to suppress ensemble decoherence due to inhomogeneous broadening. The protected Rabi oscillations between the cavity field and the atomic super-radiant state enable ultra-fast transfer of photonic frequency qubits to the ions (~50 GHz bandwidth) followed by retrieval with 98.7% fidelity. With the prospect of coupling to other long-lived rare-earth spin states, this technique opens the possibilities for broadband, always-ready quantum memories and fast optical-to-microwave transducers.

Photogeneration of refractive-index patterns in doped polyimide films

NASA Astrophysics Data System (ADS)

Chakravorty, K. K.

1993-05-01

A photosensitive benzophenone tetracarboxylic dianhyride-alkylated diamine polyimide formulation has been evaluated for application in an optical interconnection area. The refractive-index patterns in this material were optically recorded by UV-assisted photodoping of sensitizers. The polyimide films were selectively doped with benzoin-type photosensitizers such as benzildimethylketal and benzoin ethyl ether, which cause a decrease in the refractive index. High-dose UV irradiation that causes cross linking of the polyimide chains was also employed for augmenting the refractive-index difference to 0.017 between the doped and undoped regions. Refractive-index variations and lightguiding properties were investigated as a function of doping concentrations and other processing conditions. The author utilized this technique for the fabrication of embedded polyimide channel waveguides. The two photosensitizers have different effects on the waveguiding characteristics of the polyimide films. Losses for benzoin ethyl ether remained low whereas doping with benzildimethylketal caused significant increase in the waveguiding loss at high doping concentrations. Near-field imaging of the output from such waveguides shows good confinement of 815-nm light.

GLOBECOM '84 - Global Telecommunications Conference, Atlanta, GA, November 26-29, 1984, Conference Record. Volume 1

NASA Astrophysics Data System (ADS)

The subjects discussed are related to LSI/VLSI based subscriber transmission and customer access for the Integrated Services Digital Network (ISDN), special applications of fiber optics, ISDN and competitive telecommunication services, technical preparations for the Geostationary-Satellite Orbit Conference, high-capacity statistical switching fabrics, networking and distributed systems software, adaptive arrays and cancelers, synchronization and tracking, speech processing, advances in communication terminals, full-color videotex, and a performance analysis of protocols. Advances in data communications are considered along with transmission network plans and progress, direct broadcast satellite systems, packet radio system aspects, radio-new and developing technologies and applications, the management of software quality, and Open Systems Interconnection (OSI) aspects of telematic services. Attention is given to personal computers and OSI, the role of software reliability measurement in information systems, and an active array antenna for the next-generation direct broadcast satellite.

Waterproof AlInGaP optoelectronics on stretchable substrates with applications in biomedicine and robotics.

PubMed

Kim, Rak-Hwan; Kim, Dae-Hyeong; Xiao, Jianliang; Kim, Bong Hoon; Park, Sang-Il; Panilaitis, Bruce; Ghaffari, Roozbeh; Yao, Jimin; Li, Ming; Liu, Zhuangjian; Malyarchuk, Viktor; Kim, Dae Gon; Le, An-Phong; Nuzzo, Ralph G; Kaplan, David L; Omenetto, Fiorenzo G; Huang, Yonggang; Kang, Zhan; Rogers, John A

2010-11-01

Inorganic light-emitting diodes and photodetectors represent important, established technologies for solid-state lighting, digital imaging and many other applications. Eliminating mechanical and geometrical design constraints imposed by the supporting semiconductor wafers can enable alternative uses in areas such as biomedicine and robotics. Here we describe systems that consist of arrays of interconnected, ultrathin inorganic light-emitting diodes and photodetectors configured in mechanically optimized layouts on unusual substrates. Light-emitting sutures, implantable sheets and illuminated plasmonic crystals that are compatible with complete immersion in biofluids illustrate the suitability of these technologies for use in biomedicine. Waterproof optical-proximity-sensor tapes capable of conformal integration on curved surfaces of gloves and thin, refractive-index monitors wrapped on tubing for intravenous delivery systems demonstrate possibilities in robotics and clinical medicine. These and related systems may create important, unconventional opportunities for optoelectronic devices.

Submicron x-ray diffraction and its applications to problems in materials and environmental science

NASA Astrophysics Data System (ADS)

Tamura, N.; Celestre, R. S.; MacDowell, A. A.; Padmore, H. A.; Spolenak, R.; Valek, B. C.; Meier Chang, N.; Manceau, A.; Patel, J. R.

2002-03-01

The availability of high brilliance third generation synchrotron sources together with progress in achromatic focusing optics allows us to add submicron spatial resolution to the conventional century-old x-ray diffraction technique. The new capabilities include the possibility to map in situ, grain orientations, crystalline phase distribution, and full strain/stress tensors at a very local level, by combining white and monochromatic x-ray microbeam diffraction. This is particularly relevant for high technology industry where the understanding of material properties at a microstructural level becomes increasingly important. After describing the latest advances in the submicron x-ray diffraction techniques at the Advanced Light Source, we will give some examples of its application in material science for the measurement of strain/stress in metallic thin films and interconnects. Its use in the field of environmental science will also be discussed.

Power smart in-door optical wireless link design

NASA Astrophysics Data System (ADS)

Marraccini, P. J.; Riza, N. A.

2011-12-01

Presented for the first time, to the best of the authors´ knowledge, is the design of a power smart in-door optical wireless link that provides lossless beam propagation between Transmitter (T) and Receiver (R) for changing link distances. Each T/R unit uses a combination of fixed and variable focal length optics to smartly adjust the laser beam propagation parameters of minimum beam waist size and its location to produce the optimal zero propagation loss coupling condition at the R for that link distance. An Electronically Controlled Variable Focus Lens (ECVFL) is used to form the wide field-of-view search beam and change the beam size at R to form a low loss beam. The T/R unit can also deploy camera optics and thermal energy harvesting electronics to improve link operational smartness and efficiency. To demonstrate the principles of the beam conditioned low loss indoor link, a visible 633 nm laser link using an electro-wetting technology liquid ECVFL is demonstrated for a variable 1 to 4 m link range. Measurements indicate a 53% improvement over an unconditioned laser link at 4 m. Applications for this power efficient wireless link includes mobile computer platform communications and agile server rack interconnections in data centres.

Silicon photonic Mach Zehnder modulators for next-generation short-reach optical communication networks

NASA Astrophysics Data System (ADS)

Lacava, C.; Liu, Z.; Thomson, D.; Ke, Li; Fedeli, J. M.; Richardson, D. J.; Reed, G. T.; Petropoulos, P.

2016-02-01

Communication traffic grows relentlessly in today's networks, and with ever more machines connected to the network, this trend is set to continue for the foreseeable future. It is widely accepted that increasingly faster communications are required at the point of the end users, and consequently optical transmission plays a progressively greater role even in short- and medium-reach networks. Silicon photonic technologies are becoming increasingly attractive for such networks, due to their potential for low cost, energetically efficient, high-speed optical components. A representative example is the silicon-based optical modulator, which has been actively studied. Researchers have demonstrated silicon modulators in different types of structures, such as ring resonators or slow light based devices. These approaches have shown remarkably good performance in terms of modulation efficiency, however their operation could be severely affected by temperature drifts or fabrication errors. Mach-Zehnder modulators (MZM), on the other hand, show good performance and resilience to different environmental conditions. In this paper we present a CMOS-compatible compact silicon MZM. We study the application of the modulator to short-reach interconnects by realizing data modulation using some relevant advanced modulation formats, such as 4-level Pulse Amplitude Modulation (PAM-4) and Discrete Multi-Tone (DMT) modulation and compare the performance of the different systems in transmission.

Athermal silicon optical add-drop multiplexers based on thermo-optic coefficient tuning of sol-gel material.

PubMed

Namnabat, Soha; Kim, Kyung-Jo; Jones, Adam; Himmelhuber, Roland; DeRose, Christopher T; Trotter, Douglas C; Starbuck, Andrew L; Pomerene, Andrew; Lentine, Anthony L; Norwood, Robert A

2017-09-04

Silicon photonics has gained interest for its potential to provide higher efficiency, bandwidth and reduced power consumption compared to electrical interconnects in datacenters and high performance computing environments. However, it is well known that silicon photonic devices suffer from temperature fluctuations due to silicon's high thermo-optic coefficient and therefore, temperature control in many applications is required. Here we present an athermal optical add-drop multiplexer fabricated from ring resonators. We used a sol-gel inorganic-organic hybrid material as an alternative to previously used materials such as polymers and titanium dioxide. In this work we studied the thermal curing parameters of the sol-gel and their effect on thermal wavelength shift of the rings. With this method, we were able to demonstrate a thermal shift down to -6.8 pm/°C for transverse electric (TE) polarization in ring resonators with waveguide widths of 325 nm when the sol-gel was cured at 130°C for 10.5 hours. We also achieved thermal shifts below 1 pm/°C for transverse magnetic (TM) polarization in the C band under different curing conditions. Curing time compared to curing temperature shows to be the most important factor to control sol-gel's thermo-optic value in order to obtain an athermal device in a wide temperature range.

A Summary of the Naval Postgraduate School Research Program.

DTIC Science & Technology

1982-05-01

and testing of PCM modu- lation formats, design and test of an underwater video line using a diver’s handheld camera and bi-directional interconnection...to design and develop advanced control schemes which successfully optimize the tor- pedo steering performance for Project Courageous. cummary: Work...investigating the feasibility and design of fiber optic communications in underwater torpedo ranges. Summary: An underwater fiber optic video uplink was

Electro-Optical and Optical Components for Processor to Processor Interconnects

DTIC Science & Technology

2013-04-01

Kwiat and others were instrumental in explicitly co-entangling other properties such as momentum (path) [4]. Others such as Barnett and Zeilinger ...19 4. References: 1. D. Bouwmeester, J.W. Pan, K. Mattle, M. Eibl, H. Weinfurter and A. Zeilinger , “Experimental quantum teleportation...Nature, Vol. 390, 11 December 1997, pp. 575- 579. 2. Jian-Wei Pan, Dik Bouwmeester, Harald Weinfurter, and Anton Zeilinger , “Experimental Entanglement

Monolithically Integrated High-β Nanowire Lasers on Silicon.

PubMed

Mayer, B; Janker, L; Loitsch, B; Treu, J; Kostenbader, T; Lichtmannecker, S; Reichert, T; Morkötter, S; Kaniber, M; Abstreiter, G; Gies, C; Koblmüller, G; Finley, J J

2016-01-13

Reliable technologies for the monolithic integration of lasers onto silicon represent the holy grail for chip-level optical interconnects. In this context, nanowires (NWs) fabricated using III-V semiconductors are of strong interest since they can be grown site-selectively on silicon using conventional epitaxial approaches. Their unique one-dimensional structure and high refractive index naturally facilitate low loss optical waveguiding and optical recirculation in the active NW-core region. However, lasing from NWs on silicon has not been achieved to date, due to the poor modal reflectivity at the NW-silicon interface. We demonstrate how, by inserting a tailored dielectric interlayer at the NW-Si interface, low-threshold single mode lasing can be achieved in vertical-cavity GaAs-AlGaAs core-shell NW lasers on silicon as measured at low temperature. By exploring the output characteristics along a detection direction parallel to the NW-axis, we measure very high spontaneous emission factors comparable to nanocavity lasers (β = 0.2) and achieve ultralow threshold pump energies ≤11 pJ/pulse. Analysis of the input-output characteristics of the NW lasers and the power dependence of the lasing emission line width demonstrate the potential for high pulsation rates ≥250 GHz. Such highly efficient nanolasers grown monolithically on silicon are highly promising for the realization of chip-level optical interconnects.

Silicon Photonics: All-Optical Devices for Linear and Nonlinear Applications

NASA Astrophysics Data System (ADS)

Driscoll, Jeffrey B.

Silicon photonics has grown rapidly since the first Si electro-optic switch was demonstrated in 1987, and the field has never grown more quickly than it has over the past decade, fueled by milestone achievements in semiconductor processing technologies for low loss waveguides, high-speed Si modulators, Si lasers, Si detectors, and an enormous toolbox of passive and active integrated devices. Silicon photonics is now on the verge of major commercialization breakthroughs, and optical communication links remain the force driving integrated and Si photonics towards the first commercial telecom and datacom transceivers; however other potential and future applications are becoming uncovered and refined as researchers reveal the benefits of manipulating photons on the nanoscale. This thesis documents an exploration into the unique guided-wave and nonlinear properties of deeply-scaled high-index-contrast sub-wavelength Si waveguides. It is found that the tight confinement inherent to single-mode channel waveguides on the silicon-on-insulator platform lead to a rich physics, which can be leveraged for new devices extending well beyond simple passive interconnects and electro-optic devices. The following chapters will concentrate, in detail, on a number of unique physical features of Si waveguides and extend these attributes towards new and interesting devices. Linear optical properties and nonlinear optical properties are investigated, both of which are strongly affected by tight optical confinement of the guided waveguide modes. As will be shown, tight optical confinement directly results in strongly vectoral modal components, where the electric and magnetic fields of the guided modes extend into all spatial dimensions, even along the axis of propagation. In fact, the longitudinal electric and magnetic field components can be just as strong as the transverse fields, directly affecting the modal group velocity and energy transport properties since the longitudinal fields are shown to contribute no time-averaged momentum. Furthermore, the vectoral modal components, in conjunction with the tensoral nature of the third-order susceptibility of Si, lead to nonlinear properties which are dependent on waveguide orientation with respect to the Si parent crystal and the construction of the modal electric field components. This consideration is used to maximize effective nonlinearity and realize nonlinear Kerr gratings along specific waveguide trajectories. Tight optical confinement leads to a natural enhancement of the intrinsically large effective nonlinearty of Si waveguides, and in fact, the effective nonlinearty can be made to be almost 106 times greater in Si waveguides than that of standard single-mode fiber. Such a large nonlinearity motivates chip-scale all-optical signal processing techniques. Wavelength conversion by both four-wave-mixing (FWM) and cross-phase-modulation (XPM) will be discussed, including a technique that allows for enhanced broadband discrete FWM over arbitrary spectral spans by modulating both the linear and nonlinear waveguide properties through periodic changes in waveguide geometry. This quasi-phase-matching approach has very real applications towards connecting mature telecom sources detectors and components to other spectral regimes, including the mid-IR. Other signal processing techniques such as all-optical modulation format conversion via XPM will also be discussed. This thesis will conclude by looking at ways to extend the bandwidth capacity of Si waveguide interconnects on chip. As the number of processing cores continues to scale as a means for computational performance gains, on-chip link capacity will become an increasingly important issue. Metallic traces have severe limitations and are envisioned to eventually bow to integrated photonic links. The aggregate bandwidth supported by a single waveguide link will therefore become a crucial consideration as integrated photonics approaches the CPU. One way to increase aggregate bandwidth is to utilize different eigen-modes of a multimode waveguide, and integrated waveguide mode-muxes and demuxes for achieving simultaneous mode-division-multiplexing and wavelength-division-multiplexing will be demonstrated.

Optical Computers and Space Technology

NASA Technical Reports Server (NTRS)

Abdeldayem, Hossin A.; Frazier, Donald O.; Penn, Benjamin; Paley, Mark S.; Witherow, William K.; Banks, Curtis; Hicks, Rosilen; Shields, Angela

1995-01-01

The rapidly increasing demand for greater speed and efficiency on the information superhighway requires significant improvements over conventional electronic logic circuits. Optical interconnections and optical integrated circuits are strong candidates to provide the way out of the extreme limitations imposed on the growth of speed and complexity of nowadays computations by the conventional electronic logic circuits. The new optical technology has increased the demand for high quality optical materials. NASA's recent involvement in processing optical materials in space has demonstrated that a new and unique class of high quality optical materials are processible in a microgravity environment. Microgravity processing can induce improved orders in these materials and could have a significant impact on the development of optical computers. We will discuss NASA's role in processing these materials and report on some of the associated nonlinear optical properties which are quite useful for optical computers technology.

Direct write fabrication of waveguides and interconnects for optical printed wiring boards

NASA Astrophysics Data System (ADS)

Dingeldein, Joseph C.

Current copper based circuit technology is becoming a limiting factor in high speed data transfer applications as processors are improving at a faster rate than are developments to increase on board data transfer. One solution is to utilize optical waveguide technology to overcome these bandwidth and loss restrictions. The use of this technology virtually eliminates the heat and cross-talk loss seen in copper circuitry, while also operating at a higher bandwidth. Transitioning current fabrication techniques from small scale laboratory environments to large scale manufacturing presents significant challenges. Optical-to-electrical connections and out-of-plane coupling are significant hurdles in the advancement of optical interconnects. The main goals of this research are the development of direct write material deposition and patterning tools for the fabrication of waveguide systems on large substrates, and the development of out-of-plane coupler components compatible with standard fiber optic cabling. Combining these elements with standard printed circuit boards allows for the fabrication of fully functional optical-electrical-printed-wiring-boards (OEPWBs). A direct dispense tool was designed, assembled, and characterized for the repeatable dispensing of blanket waveguide layers over a range of thicknesses (25-225 μm), eliminating waste material and affording the ability to utilize large substrates. This tool was used to directly dispense multimode waveguide cores which required no UV definition or development. These cores had circular cross sections and were comparable in optical performance to lithographically fabricated square waveguides. Laser direct writing is a non-contact process that allows for the dynamic UV patterning of waveguide material on large substrates, eliminating the need for high resolution masks. A laser direct write tool was designed, assembled, and characterized for direct write patterning waveguides that were comparable in quality to those produced using standard lithographic practices (0.047 dB/cm loss for laser written waveguides compared to 0.043 dB/cm for lithographic waveguides). Straight waveguides, and waveguide turns were patterned at multimode and single mode sizes, and the process was characterized and documented. Support structures such as angled reflectors and vertical posts were produced, showing the versatility of the laser direct write tool. Commercially available components were implanted into the optical layer for out-of-plane routing of the optical signals. These devices featured spherical lenses on the input and output sides of a total internal reflection (TIR) mirror, as well as alignment pins compatible with standard MT design. Fully functional OEPWBs were fabricated featuring input and output out-of-plane optical signal routing with total optical losses not exceeding 10 dB. These prototypes survived thermal cycling (-40°C to 85°C) and humidity exposure (95±4% humidity), showing minimal degradation in optical performance. Operational failure occurred after environmental aging life testing at 110°C for 216 hours.

Single-mode 850-nm vertical-cavity surface-emitting lasers with Zn-diffusion and oxide-relief apertures for > 50 Gbit/sec OOK and 4-PAM transmission

NASA Astrophysics Data System (ADS)

Shi, Jin-Wei; Wei, Chia-Chien; Chen, Jyehong; Ledentsov, N. N.; Yang, Ying-Jay

2017-02-01

Vertical-cavity surface-emitting lasers (VCSELs) has become the most important light source in the booming market of short-reach (< 300 meters) optical interconnect (OI). The next generation OI has been targeted at 56 Gbit/sec data rate per channel (CEI-56G) with the total data rate up to 400 Gbit/sec. However, the serious modal dispersion of multi-mode fiber (MMF), limited speed of VCSEL, and its high resistance (> 150 Ω) seriously limits the >50 Gbit/sec linking distance (< 10 m) by using only on-off keying (OOK) modulation scheme without any signal processing techniques. In contrast to OOK, 4-PAM modulation format is attractive for >50 Gbit/sec transmission due to that it can save one-half of the required bandwidth. Nevertheless, a 4.7 dB optical power penalty and the linearity of transmitter would become issues in the 4-PAM linking performance. Besides, in the modern OI system, the optics transreceiver module must be packaged as close as possible with the integrated circuits (ICs). The heat generated from ICs will become an issue in speed of VSCEL. Here, we review our recent work about 850 nm VCSEL, which has unique Zn-diffusion/oxide-relief apertures and special p- doping active layer with strong wavelength detuning to further enhance its modulation speed and high-temperature (85°C) performances. Single-mode (SM) devices with high-speed ( 26 GHz), reasonable resistance ( 70 Ω) and moderate output power ( 1.5 mW) can be achieved. Error-free 54 Gbit/sec OOK transmission through 1km MMF has been realized by using such SM device with signal processing techniques. Besides, the volterra nonlinear equalizer has been applied in our 4-PAM 64 Gbit/sec transmission through 2-km OM4 MMF, which significantly enhance the linearity of device and outperforms fed forward equalization (FFE) technique. Record high bit-rate distance product of 128.km is confirmed for optical-interconnect applications.

Hyper-branched CdTe nanostructures based on the self-assembling of quantum dots and their optical properties.

PubMed

Pan, Ling-Yun; Pan, Gen-Cai; Zhang, Yong-Lai; Gao, Bing-Rong; Dai, Zhen-Wen

2013-02-01

As the priority of interconnects and active components in nanoscale optical and electronic devices, three-dimensional hyper-branched nanostructures came into focus of research. Recently, a novel crystallization route, named as "nonclassical crystallization," has been reported for three-dimensional nanostructuring. In this process, Quantum dots are used as building blocks for the construction of the whole hyper-branched structures instead of ions or single-molecules in conventional crystallization. The specialty of these nanostructures is the inheritability of pristine quantum dots' physical integrity because of their polycrystalline structures, such as quantum confinement effect and thus the luminescence. Moreover, since a longer diffusion length could exist in polycrystalline nanostructures due to the dramatically decreased distance between pristine quantum dots, the exciton-exciton interaction would be different with well dispersed quantum dots and single crystal nanostructures. This may be a benefit for electron transport in solar cell application. Therefore, it is very necessary to investigate the exciton-exciton interaction in such kind of polycrystalline nanostructures and their optical properites for solar cell application. In this research, we report a novel CdTe hyper-branched nanostructures based on self-assembly of CdTe quantum dots. Each branch shows polycrystalline with pristine quantum dots as the building units. Both steady state and time-resolved spectroscopy were performed to investigate the properties of carrier transport. Steady state optical properties of pristine quantum dots are well inherited by formed structures. While a suppressed multi-exciton recombination rate was observed. This result supports the percolation of carriers through the branches' network.

Multiple-Ring Digital Communication Network

NASA Technical Reports Server (NTRS)

Kirkham, Harold

1992-01-01

Optical-fiber digital communication network to support data-acquisition and control functions of electric-power-distribution networks. Optical-fiber links of communication network follow power-distribution routes. Since fiber crosses open power switches, communication network includes multiple interconnected loops with occasional spurs. At each intersection node is needed. Nodes of communication network include power-distribution substations and power-controlling units. In addition to serving data acquisition and control functions, each node acts as repeater, passing on messages to next node(s). Multiple-ring communication network operates on new AbNET protocol and features fiber-optic communication.

Cascading failures in interconnected networks with dynamical redistribution of loads

NASA Astrophysics Data System (ADS)

Zhao, Zhuang; Zhang, Peng; Yang, Hujiang

2015-09-01

Cascading failures of loads in isolated networks and coupled networks have been studied in the past few years. In most of the corresponding results, the topologies of the networks are destroyed. Here, we present an interconnected network model considering cascading failures based on the dynamic redistribution of flow in the networks. Compared with the results of single scale-free networks, we find that interconnected scale-free networks have higher vulnerability. Additionally, the network heterogeneity plays an important role in the robustness of interconnected networks under intentional attacks. Considering the effects of various coupling preferences, the results show that there are almost no differences. Finally, the application of our model to the Beijing interconnected traffic network, which consists of a subway network and a bus network, shows that the subway network suffers more damage under the attack. Moreover, the interconnected traffic network may be more exposed to damage after initial attacks on the bus network. These discussions are important for the design and optimization of interconnected networks.

Flow Measurement

NASA Technical Reports Server (NTRS)

1988-01-01

Macrodyne, Inc.'s laser velocimeter (LV) is a system used in wind tunnel testing of aircraft, missiles and spacecraft employing electro optical techniques to probe the flow field as the tunnel blows air over a model of flight vehicle and to determine velocity of air and its direction at many points around the model. However, current state-of-the-art minicomputers cannot handle the massive flow of real time data from several sources simultaneously. Langley developed instrument Laser Velocimeter Autocovariance Buffer Interface (LVABI). LVABI is interconnecting instrument between LV and computer. It acquires data from as many as six LV channels at high real time data rates, stores it in memory and sends it to computer on command. LVABI has application in variety of research, industrial and defense functions requiring precise flow measurement.

Evaluation of glass resin coatings for solar cell applications

NASA Technical Reports Server (NTRS)

Field, M. B.

1978-01-01

Using a variety of non-vacuum deposition techniques coatings were implemented on silicon solar cells and arrays of cells interconnected on Kapton substrates. The coatings provide both antireflection optical matching and environmental protection. Reflectance minima near 2% was achieved at a single wavelength in the visible. Reflectance averaging below 5% across the useful collection range was demonstrated. The coatings and methods of deposition were: (1) Ta2O5 spun, dipped or sprayed; (2) Ta2O5.SiO2 spun, dipped or sprayed; (3) GR908 (SiO2) spun, dipped, or sprayed. Total coating thickness were in the range of 18 microns to 25 microns. The coatings and processes are compatible with single cells or cells mounted on Kapton substrates.

Polarization-interference mapping of biological fluids polycrystalline films in differentiation of weak changes of optical anisotropy

NASA Astrophysics Data System (ADS)

Ushenko, V. O.; Vanchuliak, O.; Sakhnovskiy, M. Y.; Dubolazov, O. V.; Grygoryshyn, P.; Soltys, I. V.; Olar, O. V.; Antoniv, A.

2017-09-01

The theoretical background of the azimuthally stable method of polarization-interference mapping of the histological sections of the biopsy of the prostate tissue on the basis of the spatial frequency selection of the mechanisms of linear and circular birefringence is presented. The diagnostic application of a new correlation parameter - complex degree of mutual anisotropy - is analytically substantiated. The method of measuring coordinate distributions of complex degree of mutual anisotropy with further spatial filtration of their high- and low-frequency components is developed. The interconnections of such distributions with parameters of linear and circular birefringence of prostate tissue histological sections are found. The objective criteria of differentiation of benign and malignant conditions of prostate tissue are determined.

Enhancing UV photoconductivity of ZnO nanobelt by polyacrylonitrile functionalization

NASA Astrophysics Data System (ADS)

He, J. H.; Lin, Yen H.; McConney, Michael E.; Tsukruk, Vladimir V.; Wang, Zhong L.; Bao, Gang

2007-10-01

UV photodetector fabricated using a single ZnO nanobelt (NB) has shown a photoresponse enhancement up to 750 times higher than that of a bare ZnO NB after coating with ˜20nm plasma polymerized acrylonitrile (PP-AN) nanoscale film. The mechanism for this colossal photoconductivity is suggested as a consequence of the efficient exciton dissociation under UV illumination due to enhanced electron transfer from valence band of ZnO NB to the PP-AN and then back to the conduction band of ZnO. This process has demonstrated an easy and effective method for improving the performance of the nanowire/NB-based devices, possibly leading to supersensitive UV detector for applications in imaging, photosensing, and intrachip optical interconnects.

Porous Networks Through Colloidal Templates

NASA Astrophysics Data System (ADS)

Li, Qin; Retsch, Markus; Wang, Jianjun; Knoll, Wolfgang; Jonas, Ulrich

Porous networks represent a class of materials with interconnected voids with specific properties concerning adsorption, mass and heat transport, and spatial confinement, which lead to a wide range of applications ranging from oil recovery and water purification to tissue engineering. Porous networks with well-defined, highly ordered structure and periodicities around the wavelength of light can furthermore show very sophisticated optical properties. Such networks can be fabricated from a very large range of materials by infiltration of a sacrificial colloidal crystal template and subsequent removal of the template. The preparation procedures reported in the literature are discussed in this review and the resulting porous networks are presented with respect to the underlying material class. Furthermore, methods for hierarchical superstructure formation and functionalization of the network walls are discussed.

High-resolution determination of the stress in individual interconnect lines and the variation due to electromigration

NASA Astrophysics Data System (ADS)

Ma, Qing; Chiras, S.; Clarke, D. R.; Suo, Z.

1995-08-01

Large tensile stresses usually exist in metallic interconnect lines on silicon substrates as a result of thermal mismatch. When a current is subsequently passed any divergence of atomic flux can create superimposed stress variations along the line. Together, these stresses can significantly influence the growth of voids and therefore affect interconnect reliability. In this work, a high-resolution (˜2 μm) optical spectroscopy method has been used to measure the localized stresses around passivated aluminum lines on a silicon wafer, both as-fabricated and after electromigration testing. The method is based on the piezospectroscopic properties of silicon, specifically the frequency shift of the Raman line at 520 R cm-1. By focusing a laser beam at points adjacent to the aluminum lines, the Raman signal was excited and collected. The stresses in the aluminum lines can then be derived from the stresses in the silicon using finite element methods. Large variations of stress along an electromigration-tested line were observed and compared to a theoretical model based on differences in effective diffusivities from grain to grain in a polycrystalline interconnect line.

Reflectively Coupled Waveguide Photodetector for High Speed Optical Interconnection

PubMed Central

Hsu*, Shih-Hsiang

2010-01-01

To fully utilize GaAs high drift mobility, techniques to monolithically integrate In0.53Ga0.47As p-i-n photodetectors with GaAs based optical waveguides using total internal reflection coupling are reviewed. Metal coplanar waveguides, deposited on top of the polyimide layer for the photodetector’s planarization and passivation, were then uniquely connected as a bridge between the photonics and electronics to illustrate the high-speed monitoring function. The photodetectors were efficiently implemented and imposed on the echelle grating circle for wavelength division multiplexing monitoring. In optical filtering performance, the monolithically integrated photodetector channel spacing was 2 nm over the 1,520–1,550 nm wavelength range and the pass band was 1 nm at the −1 dB level. For high-speed applications the full-width half-maximum of the temporal response and 3-dB bandwidth for the reflectively coupled waveguide photodetectors were demonstrated to be 30 ps and 11 GHz, respectively. The bit error rate performance of this integrated photodetector at 10 Gbit/s with 27-1 long pseudo-random bit sequence non-return to zero input data also showed error-free operation. PMID:22163502

A high-speed, large-capacity, 'jukebox' optical disk system

NASA Technical Reports Server (NTRS)

Ammon, G. J.; Calabria, J. A.; Thomas, D. T.

1985-01-01

Two optical disk 'jukebox' mass storage systems which provide access to any data in a store of 10 to the 13th bits (1250G bytes) within six seconds have been developed. The optical disk jukebox system is divided into two units, including a hardware/software controller and a disk drive. The controller provides flexibility and adaptability, through a ROM-based microcode-driven data processor and a ROM-based software-driven control processor. The cartridge storage module contains 125 optical disks housed in protective cartridges. Attention is given to a conceptual view of the disk drive unit, the NASA optical disk system, the NASA database management system configuration, the NASA optical disk system interface, and an open systems interconnect reference model.

Supplemental Information for New York State Standardized Interconnection Requirements

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ingram, Michael; Narang, David J.; Mather, Barry A.

This document is intended to aid in the understanding and application of the New York State Standardized Interconnection Requirements (SIR) and Application Process for New Distributed Generators 5 MW or Less Connected in Parallel with Utility Distribution Systems, and it aims to provide supplemental information and discussion on selected topics relevant to the SIR. This guide focuses on technical issues that have to date resulted in the majority of utility findings within the context of interconnecting photovoltaic (PV) inverters. This guide provides background on the overall issue and related mitigation measures for selected topics, including substation backfeeding, anti-islanding and considerationsmore » for monitoring and controlling distributed energy resources (DER).« less

Center for the Integration of Optical Computing

DTIC Science & Technology

1992-03-15

their photorefractive properties, calculating the possible interconnect capacities, and collaborating with industry( Brimrose Corp. and Hughes Research...cooperation with Hughes Research Laboratories and Brimrose Corporation we have proceeded with a basic study of CdTe, ZnTe, and the mixed crystals Cd

47 CFR 9.1 - Purposes.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 47 Telecommunication 1 2013-10-01 2013-10-01 false Purposes. 9.1 Section 9.1 Telecommunication FEDERAL COMMUNICATIONS COMMISSION GENERAL INTERCONNECTED VOICE OVER INTERNET PROTOCOL SERVICES § 9.1... applicable to interconnected Voice over Internet Protocol service providers, and to ensure that those...

47 CFR 9.1 - Purposes.

Code of Federal Regulations, 2014 CFR

2014-10-01

... 47 Telecommunication 1 2014-10-01 2014-10-01 false Purposes. 9.1 Section 9.1 Telecommunication FEDERAL COMMUNICATIONS COMMISSION GENERAL INTERCONNECTED VOICE OVER INTERNET PROTOCOL SERVICES § 9.1... applicable to interconnected Voice over Internet Protocol service providers, and to ensure that those...

47 CFR 9.1 - Purposes.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 47 Telecommunication 1 2012-10-01 2012-10-01 false Purposes. 9.1 Section 9.1 Telecommunication FEDERAL COMMUNICATIONS COMMISSION GENERAL INTERCONNECTED VOICE OVER INTERNET PROTOCOL SERVICES § 9.1... applicable to interconnected Voice over Internet Protocol service providers, and to ensure that those...

47 CFR 9.1 - Purposes.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 47 Telecommunication 1 2011-10-01 2011-10-01 false Purposes. 9.1 Section 9.1 Telecommunication FEDERAL COMMUNICATIONS COMMISSION GENERAL INTERCONNECTED VOICE OVER INTERNET PROTOCOL SERVICES § 9.1... applicable to interconnected Voice over Internet Protocol service providers, and to ensure that those...

47 CFR 9.1 - Purposes.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 47 Telecommunication 1 2010-10-01 2010-10-01 false Purposes. 9.1 Section 9.1 Telecommunication FEDERAL COMMUNICATIONS COMMISSION GENERAL INTERCONNECTED VOICE OVER INTERNET PROTOCOL SERVICES § 9.1... applicable to interconnected Voice over Internet Protocol service providers, and to ensure that those...

Optical RAM-enabled cache memory and optical routing for chip multiprocessors: technologies and architectures

NASA Astrophysics Data System (ADS)

Pleros, Nikos; Maniotis, Pavlos; Alexoudi, Theonitsa; Fitsios, Dimitris; Vagionas, Christos; Papaioannou, Sotiris; Vyrsokinos, K.; Kanellos, George T.

2014-03-01

The processor-memory performance gap, commonly referred to as "Memory Wall" problem, owes to the speed mismatch between processor and electronic RAM clock frequencies, forcing current Chip Multiprocessor (CMP) configurations to consume more than 50% of the chip real-estate for caching purposes. In this article, we present our recent work spanning from Si-based integrated optical RAM cell architectures up to complete optical cache memory architectures for Chip Multiprocessor configurations. Moreover, we discuss on e/o router subsystems with up to Tb/s routing capacity for cache interconnection purposes within CMP configurations, currently pursued within the FP7 PhoxTrot project.

Recent Advances in Photonic Devices for Optical Computing and the Role of Nonlinear Optics-Part II

NASA Technical Reports Server (NTRS)

Abdeldayem, Hossin; Frazier, Donald O.; Witherow, William K.; Banks, Curtis E.; Paley, Mark S.

2007-01-01

The twentieth century has been the era of semiconductor materials and electronic technology while this millennium is expected to be the age of photonic materials and all-optical technology. Optical technology has led to countless optical devices that have become indispensable in our daily lives in storage area networks, parallel processing, optical switches, all-optical data networks, holographic storage devices, and biometric devices at airports. This chapters intends to bring some awareness to the state-of-the-art of optical technologies, which have potential for optical computing and demonstrate the role of nonlinear optics in many of these components. Our intent, in this Chapter, is to present an overview of the current status of optical computing, and a brief evaluation of the recent advances and performance of the following key components necessary to build an optical computing system: all-optical logic gates, adders, optical processors, optical storage, holographic storage, optical interconnects, spatial light modulators and optical materials.

Single level microelectronic device package with an integral window

DOEpatents

Peterson, Kenneth A.; Watson, Robert D.

2003-12-09

A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The package can be formed of a multilayered LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during cofiring. The microelectronic device can be flip-chip interconnected so that the light-sensitive side is optically accessible through the window. A glob-top encapsulant or protective cover can be used to protect the microelectronic device and electrical interconnections. The result is a compact, low profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device.

Data Transparency | Distributed Generation Interconnection Collaborative |

Science.gov Websites

quality and availability are increasingly vital for reducing the costs of distributed generation completion in certain areas, increasing accountability for utility application processing. As distributed PV NREL, HECO, TSRG Improving Data Transparency for the Distributed PV Interconnection Process: Emergent

Oxide-confined 2D VCSEL arrays for high-density inter/intra-chip interconnects

NASA Astrophysics Data System (ADS)

King, Roger; Michalzik, Rainer; Jung, Christian; Grabherr, Martin; Eberhard, Franz; Jaeger, Roland; Schnitzer, Peter; Ebeling, Karl J.

1998-04-01

We have designed and fabricated 4 X 8 vertical-cavity surface-emitting laser (VCSEL) arrays intended to be used as transmitters in short-distance parallel optical interconnects. In order to meet the requirements of 2D, high-speed optical links, each of the 32 laser diodes is supplied with two individual top contacts. The metallization scheme allows flip-chip mounting of the array modules junction-side down on silicon complementary metal oxide semiconductor (CMOS) chips. The optical and electrical characteristics across the arrays with device pitch of 250 micrometers are quite homogeneous. Arrays with 3 micrometers , 6 micrometers and 10 micrometers active diameter lasers have been investigated. The small devices show threshold currents of 600 (mu) A, single-mode output powers as high as 3 mW and maximum wavelength deviations of only 3 nm. The driving characteristics of all arrays are fully compatible to advanced 3.3 V CMOS technology. Using these arrays, we have measured small-signal modulation bandwidths exceeding 10 GHz and transmitted pseudo random data at 8 Gbit/s channel over 500 m graded index multimode fiber. This corresponds to a data transmission rate of 256 Gbit/s per array of 1 X 2 mm2 footprint area.

Integrated MEMS-tunable VCSELs for reconfigurable optical interconnects

NASA Astrophysics Data System (ADS)

Kögel, Benjamin; Debernardi, Pierluigi; Westbergh, Petter; Gustavsson, Johan S.; Haglund, Åsa; Haglund, Erik; Bengtsson, Jörgen; Larsson, Anders

2012-03-01

A simple and low-cost technology for tunable vertical-cavity surface-emitting lasers (VCSELs) with curved movable micromirror is presented. The micro-electro-mechanical system (MEMS) is integrated with the active optical component (so-called half-VCSEL) by means of surface-micromachining using a reflown photoresist droplet as sacrificial layer. The technology is demonstrated for electrically pumped, short-wavelength (850 nm) tunable VCSELs. Fabricated devices with 10 μm oxide aperture are singlemode with sidemode suppression >35 dB, tunable over 24 nm with output power up to 0.5mW, and have a beam divergence angle <6 °. An improved high-speed design with reduced parasitic capacitance enables direct modulation with 3dB-bandwidths up to 6GHz and error-free data transmission at 5Gbit/s. The modulation response of the MEMS under electrothermal actuation has a bandwidth of 400 Hz corresponding to switching times of about 10ms. The thermal crosstalk between MEMS and half-VCSEL is negligible and not degrading the device performance. With these characteristics the integrated MEMS-tunable VCSELs are basically suitable for use in reconfigurable optical interconnects and ready for test in a prototype system. Schemes for improving output power, tuning speed, and modulation bandwidth are briefly discussed.

Millimeter-wave interconnects for microwave-frequency quantum machines

NASA Astrophysics Data System (ADS)

Pechal, Marek; Safavi-Naeini, Amir H.

2017-10-01

Superconducting microwave circuits form a versatile platform for storing and manipulating quantum information. A major challenge to further scalability is to find approaches for connecting these systems over long distances and at high rates. One approach is to convert the quantum state of a microwave circuit to optical photons that can be transmitted over kilometers at room temperature with little loss. Many proposals for electro-optic conversion between microwave and optics use optical driving of a weak three-wave mixing nonlinearity to convert the frequency of an excitation. Residual absorption of this optical pump leads to heating, which is problematic at cryogenic temperatures. Here we propose an alternative approach where a nonlinear superconducting circuit is driven to interconvert between microwave-frequency (7 ×109 Hz) and millimeter-wave-frequency photons (3 ×1011 Hz). To understand the potential for quantum state conversion between microwave and millimeter-wave photons, we consider the driven four-wave mixing quantum dynamics of nonlinear circuits. In contrast to the linear dynamics of the driven three-wave mixing converters, the proposed four-wave mixing converter has nonlinear decoherence channels that lead to a more complex parameter space of couplings and pump powers that we map out. We consider physical realizations of such converter circuits by deriving theoretically the upper bound on the maximum obtainable nonlinear coupling between any two modes in a lossless circuit, and synthesizing an optimal circuit based on realistic materials that saturates this bound. Our proposed circuit dissipates less than 10-9 times the energy of current electro-optic converters per qubit. Finally, we outline the quantum link budget for optical, microwave, and millimeter-wave connections, showing that our approach is viable for realizing interconnected quantum processors for intracity or quantum data center environments.

Launching applications on compute and service processors running under different operating systems in scalable network of processor boards with routers

DOEpatents

Tomkins, James L [Albuquerque, NM; Camp, William J [Albuquerque, NM

2009-03-17

A multiple processor computing apparatus includes a physical interconnect structure that is flexibly configurable to support selective segregation of classified and unclassified users. The physical interconnect structure also permits easy physical scalability of the computing apparatus. The computing apparatus can include an emulator which permits applications from the same job to be launched on processors that use different operating systems.

78 FR 58975 - Airworthiness Directives; Airbus Airplanes

Federal Register 2010, 2011, 2012, 2013, 2014

2013-09-25

... a certain combination of a target/proximity sensor serial number is installed on a flap... target and proximity sensor if applicable, and replacing or re-identifying the flap interconnecting strut... flap down drive disconnection due to an already-failed interconnecting strut sensor, which could result...

Where Might We Be Headed? Signposts from Other States

DOE Office of Scientific and Technical Information (OSTI.GOV)

Reiter, Emerson

2017-04-07

Presentation on the state of distributed energy resources interconnection in Wisconsin from the Wisconsin Distributed Resources Collaborative (WIDRC) Interconnection Forum for Distributed Generation. It addresses concerns over application submission and processing, lack of visibility into the distribution system, and uncertainty in upgrade costs.

Pore Interconnectivity Influences Growth Factor-Mediated Vascularization in Sphere-Templated Hydrogels

PubMed Central

Somo, Sami I.; Akar, Banu; Bayrak, Elif S.; Larson, Jeffery C.; Appel, Alyssa A.; Mehdizadeh, Hamidreza; Cinar, Ali

2015-01-01

Rapid and controlled vascularization within biomaterials is essential for many applications in regenerative medicine. The extent of vascularization is influenced by a number of factors, including scaffold architecture. While properties such as pore size and total porosity have been studied extensively, the importance of controlling the interconnectivity of pores has received less attention. A sintering method was used to generate hydrogel scaffolds with controlled pore interconnectivity. Poly(methyl methacrylate) microspheres were used as a sacrificial agent to generate porous poly(ethylene glycol) diacrylate hydrogels with interconnectivity varying based on microsphere sintering conditions. Interconnectivity levels increased with sintering time and temperature with resultant hydrogel structure showing agreement with template structure. Porous hydrogels with a narrow pore size distribution (130–150 μm) and varying interconnectivity were investigated for their ability to influence vascularization in response to gradients of platelet-derived growth factor-BB (PDGF-BB). A rodent subcutaneous model was used to evaluate vascularized tissue formation in the hydrogels in vivo. Vascularized tissue invasion varied with interconnectivity. At week 3, higher interconnectivity hydrogels had completely vascularized with twice as much invasion. Interconnectivity also influenced PDGF-BB transport within the scaffolds. An agent-based model was used to explore the relative roles of steric and transport effects on the observed results. In conclusion, a technique for the preparation of hydrogels with controlled pore interconnectivity has been developed and evaluated. This method has been used to show that pore interconnectivity can independently influence vascularization of biomaterials. PMID:25603533

The Open System Interconnection as a building block in a health sciences information network.

PubMed Central

Boss, R W

1985-01-01

The interconnection of integrated health sciences library systems with other health sciences computer systems to achieve information networks will require either custom linkages among specific devices or the adoption of standards that all systems support. The most appropriate standards appear to be those being developed under the Open System Interconnection (OSI) reference model, which specifies a set of rules and functions that computers must follow to exchange information. The protocols have been modularized into seven different layers. The lowest three layers are generally available as off-the-shelf interfacing products. The higher layers require special development for particular applications. This paper describes the OSI, its application in health sciences networks, and specific tasks that remain to be undertaken. PMID:4052672

Spectral and spatial characterization of perfluorinated graded-index polymer optical fibers for the distribution of optical wireless communication cells.

PubMed

Hajjar, Hani Al; Montero, David S; Lallana, Pedro C; Vázquez, Carmen; Fracasso, Bruno

2015-02-10

In this paper, the characterization of a perfluorinated graded-index polymer optical fiber (PF-GIPOF) for a high-bitrate indoor optical wireless system is reported. PF-GIPOF is used here to interconnect different optical wireless access points that distribute optical free-space high-bitrate wireless communication cells. The PF-GIPOF channel is first studied in terms of transmission attenuation and frequency response and, in a second step, the spatial power profile distribution at the fiber output is analyzed. Both characterizations are performed under varying restricted mode launch conditions, enabling us to assess the transmission channel performance subject to potential connectorization errors within an environment where the end users may intervene by themselves on the home network infrastructure.

Highly integrated 3×3 silicon thermo-optical switch using a single combined phase shifter for optical interconnects.

PubMed

Wang, Wanjun; Zhou, Haifeng; Yang, Jianyi; Wang, Minghua; Jiang, Xiaoqing

2012-06-15

We report on an experimental 3×3 thermo-optical switch on silicon on insulator. By controlling a single combined phase shifter, light from any input waveguide can be directed to any output waveguide, showing a simple control method and highly integrated structure as compared to the conventional multiway optical switches. Furthermore, the proposed optical switch can be generalized to be a 1×N and N×N optical switch without an extra phase shifter. The switch is fabricated by complementary metal oxide semiconductor technology. By experiment, full 3×3 switching functionality is demonstrated at a wavelength of 1.55 μm, with an average cross talk of -11.1  dB and a power consumption of 97.5 mW.

Nonlinear Real-Time Optical Signal Processing.

DTIC Science & Technology

1984-10-01

I 1.8 IIII III1 1 / U , 0 7 USCIPI Report 1130 E ~C~,OUTfitA N Ivj) UNIVERSITY OF SOUTHERN CALIFORNIA - I FINAL TECHNICAL REPORT April 15, 1981 - June...30, 1984 N NONLINEAR REAL-TIME OPTICAL SIGNAL PROCESSING i E ~ A.A. Sawchuk, Principal Investigator T.C. Strand and A.R. Tanguay. Jr. October 1, 1984...Erter.d) logic system. A computer generated hologram fabricated on an e -beam system serves as a beamsteering interconnection element. A completely

Optical properties of electrically connected plasmonic nanoantenna dimer arrays

NASA Astrophysics Data System (ADS)

Zimmerman, Darin T.; Borst, Benjamin D.; Carrick, Cassandra J.; Lent, Joseph M.; Wambold, Raymond A.; Weisel, Gary J.; Willis, Brian G.

2018-02-01

We fabricate electrically connected gold nanoantenna arrays of homodimers and heterodimers on silica substrates and present a systematic study of their optical properties. Electrically connected arrays of plasmonic nanoantennas make possible the realization of novel photonic devices, including optical sensors and rectifiers. Although the plasmonic response of unconnected arrays has been studied extensively, the present study shows that the inclusion of nanowire connections modifies the device response significantly. After presenting experimental measurements of optical extinction for unconnected dimer arrays, we compare these to measurements of dimers that are interconnected by gold nanowire "busbars." The connected devices show the familiar dipole response associated with the unconnected dimers but also show a second localized surface plasmon resonance (LSPR) that we refer to as the "coupled-busbar mode." Our experimental study also demonstrates that the placement of the nanowire along the antenna modifies the LSPR. Using finite-difference time-domain simulations, we confirm the experimental results and investigate the variation of dimer gap and spacing. Changing the dimer gap in connected devices has a significantly smaller effect on the dipole response than it does in unconnected devices. On the other hand, both LSPR modes respond strongly to changing the spacing between devices in the direction along the interconnecting wires. We also give results for the variation of E-field strength in the dimer gap, which will be important for any working sensor or rectenna device.

Parallel Optical Random Access Memory (PORAM)

NASA Technical Reports Server (NTRS)

Alphonse, G. A.

1989-01-01

It is shown that the need to minimize component count, power and size, and to maximize packing density require a parallel optical random access memory to be designed in a two-level hierarchy: a modular level and an interconnect level. Three module designs are proposed, in the order of research and development requirements. The first uses state-of-the-art components, including individually addressed laser diode arrays, acousto-optic (AO) deflectors and magneto-optic (MO) storage medium, aimed at moderate size, moderate power, and high packing density. The next design level uses an electron-trapping (ET) medium to reduce optical power requirements. The third design uses a beam-steering grating surface emitter (GSE) array to reduce size further and minimize the number of components.

Novel Highly Parallel and Systolic Architectures Using Quantum Dot-Based Hardware

NASA Technical Reports Server (NTRS)

Fijany, Amir; Toomarian, Benny N.; Spotnitz, Matthew

1997-01-01

VLSI technology has made possible the integration of massive number of components (processors, memory, etc.) into a single chip. In VLSI design, memory and processing power are relatively cheap and the main emphasis of the design is on reducing the overall interconnection complexity since data routing costs dominate the power, time, and area required to implement a computation. Communication is costly because wires occupy the most space on a circuit and it can also degrade clock time. In fact, much of the complexity (and hence the cost) of VLSI design results from minimization of data routing. The main difficulty in VLSI routing is due to the fact that crossing of the lines carrying data, instruction, control, etc. is not possible in a plane. Thus, in order to meet this constraint, the VLSI design aims at keeping the architecture highly regular with local and short interconnection. As a result, while the high level of integration has opened the way for massively parallel computation, practical and full exploitation of such a capability in many applications of interest has been hindered by the constraints on interconnection pattern. More precisely. the use of only localized communication significantly simplifies the design of interconnection architecture but at the expense of somewhat restricted class of applications. For example, there are currently commercially available products integrating; hundreds of simple processor elements within a single chip. However, the lack of adequate interconnection pattern among these processing elements make them inefficient for exploiting a large degree of parallelism in many applications.

Seeing through Musculoskeletal Tissues: Improving In Situ Imaging of Bone and the Lacunar Canalicular System through Optical Clearing

PubMed Central

Berke, Ian M.; Miola, Joseph P.; David, Michael A.; Smith, Melanie K.; Price, Christopher

2016-01-01

In situ, cells of the musculoskeletal system reside within complex and often interconnected 3-D environments. Key to better understanding how 3-D tissue and cellular environments regulate musculoskeletal physiology, homeostasis, and health is the use of robust methodologies for directly visualizing cell-cell and cell-matrix architecture in situ. However, the use of standard optical imaging techniques is often of limited utility in deep imaging of intact musculoskeletal tissues due to the highly scattering nature of biological tissues. Drawing inspiration from recent developments in the deep-tissue imaging field, we describe the application of immersion based optical clearing techniques, which utilize the principle of refractive index (RI) matching between the clearing/mounting media and tissue under observation, to improve the deep, in situ imaging of musculoskeletal tissues. To date, few optical clearing techniques have been applied specifically to musculoskeletal tissues, and a systematic comparison of the clearing ability of optical clearing agents in musculoskeletal tissues has yet to be fully demonstrated. In this study we tested the ability of eight different aqueous and non-aqueous clearing agents, with RIs ranging from 1.45 to 1.56, to optically clear murine knee joints and cortical bone. We demonstrated and quantified the ability of these optical clearing agents to clear musculoskeletal tissues and improve both macro- and micro-scale imaging of musculoskeletal tissue across several imaging modalities (stereomicroscopy, spectroscopy, and one-, and two-photon confocal microscopy) and investigational techniques (dynamic bone labeling and en bloc tissue staining). Based upon these findings we believe that optical clearing, in combination with advanced imaging techniques, has the potential to complement classical musculoskeletal analysis techniques; opening the door for improved in situ investigation and quantification of musculoskeletal tissues. PMID:26930293

Seeing through Musculoskeletal Tissues: Improving In Situ Imaging of Bone and the Lacunar Canalicular System through Optical Clearing.

PubMed

Berke, Ian M; Miola, Joseph P; David, Michael A; Smith, Melanie K; Price, Christopher

2016-01-01

In situ, cells of the musculoskeletal system reside within complex and often interconnected 3-D environments. Key to better understanding how 3-D tissue and cellular environments regulate musculoskeletal physiology, homeostasis, and health is the use of robust methodologies for directly visualizing cell-cell and cell-matrix architecture in situ. However, the use of standard optical imaging techniques is often of limited utility in deep imaging of intact musculoskeletal tissues due to the highly scattering nature of biological tissues. Drawing inspiration from recent developments in the deep-tissue imaging field, we describe the application of immersion based optical clearing techniques, which utilize the principle of refractive index (RI) matching between the clearing/mounting media and tissue under observation, to improve the deep, in situ imaging of musculoskeletal tissues. To date, few optical clearing techniques have been applied specifically to musculoskeletal tissues, and a systematic comparison of the clearing ability of optical clearing agents in musculoskeletal tissues has yet to be fully demonstrated. In this study we tested the ability of eight different aqueous and non-aqueous clearing agents, with RIs ranging from 1.45 to 1.56, to optically clear murine knee joints and cortical bone. We demonstrated and quantified the ability of these optical clearing agents to clear musculoskeletal tissues and improve both macro- and micro-scale imaging of musculoskeletal tissue across several imaging modalities (stereomicroscopy, spectroscopy, and one-, and two-photon confocal microscopy) and investigational techniques (dynamic bone labeling and en bloc tissue staining). Based upon these findings we believe that optical clearing, in combination with advanced imaging techniques, has the potential to complement classical musculoskeletal analysis techniques; opening the door for improved in situ investigation and quantification of musculoskeletal tissues.

All-optical LAN architectures based on arrayed waveguide grating multiplexers

NASA Astrophysics Data System (ADS)

Woesner, Hagen

1998-10-01

The paper presents optical LAN topologies which are made possible using an Arrayed Waveguide Grating Multiplexer (AWGM) instead of a passive star coupler to interconnect stations in an all-optical LAN. Due to the collision-free nature of an AWGM it offers the n-fold bandwidth compared to the star coupler. Virtual ring topologies appear (one ring on each wavelength) if the number of stations attached to the AWGM is a prime number. A method to construct larger networks using Cayley graphs is shown. An access protocol to avoid collisions on the proposed network is outlined.

VCSEL-based fiber optic link for avionics: implementation and performance analyses

NASA Astrophysics Data System (ADS)

Shi, Jieqin; Zhang, Chunxi; Duan, Jingyuan; Wen, Huaitao

2006-11-01

A Gb/s fiber optic link with built-in test capability (BIT) basing on vertical-cavity surface-emitting laser (VCSEL) sources for military avionics bus for next generation has been presented in this paper. To accurately predict link performance, statistical methods and Bit Error Rate (BER) measurements have been examined. The results show that the 1Gb/s fiber optic link meets the BER requirement and values for link margin can reach up to 13dB. Analysis shows that the suggested photonic network may provide high performance and low cost interconnections alternative for future military avionics.

A high-speed fiber optic data bus for local data communications

NASA Astrophysics Data System (ADS)

Porter, D. R.; Couch, P. R.; Schelin, J. W.

1983-04-01

A 100 Mbit/s fiber optic data bus is described which is capable of inter-connecting up to 16 terminals by means of a passive optical star coupler for terminal separation distance of up to 2 km. The system shows substantial performance margins and a BER of less than 10 to the -10th. Descriptions are also given of techniques for rapid laser stabilization, clock recovery, and the detection of bursty data over a wide dynamic range. The dynamic time slot allocations (DTSA) access protocol, which makes efficient use of the data bus under heavy bus loading conditions, is defined.

Trinary flip-flops using Savart plate and spatial light modulator for optical computation in multivalued logic

NASA Astrophysics Data System (ADS)

Ghosh, Amal K.; Basuray, Amitabha

2008-11-01

The memory devices in multi-valued logic are of most significance in modern research. This paper deals with the implementation of basic memory devices in multi-valued logic using Savart plate and spatial light modulator (SLM) based optoelectronic circuits. Photons are used here as the carrier to speed up the operations. Optical tree architecture (OTA) has been also utilized in the optical interconnection network. We have exploited the advantages of Savart plates, SLMs and OTA and proposed the SLM based high speed JK, D-type and T-type flip-flops in a trinary system.

Nonlinear optical properties of interconnected gold nanoparticles on silicon

NASA Astrophysics Data System (ADS)

Lesuffleur, Antoine; Gogol, Philippe; Beauvillain, Pierre; Guizal, B.; Van Labeke, D.; Georges, P.

2008-12-01

We report second harmonic generation (SHG) measurements in reflectivity from chains of gold nanoparticles interconnected with metallic bridges. We measured more than 30 times a SHG enhancement when a surface plasmon resonance was excited in the chains of nanoparticles, which was influenced by coupling due to the electrical connectivity of the bridges. This enhancement was confirmed by rigorous coupled wave method calculations and came from high localization of the electric field at the bridge. The introduction of 10% random defects into the chains of nanoparticles dropped the SHG by a factor of 2 and was shown to be very sensitive to the fundamental wavelength.

Inorganic Janus particles for biomedical applications

PubMed Central

Schick, Isabel; Lorenz, Steffen; Gehrig, Dominik; Tenzer, Stefan; Storck, Wiebke; Fischer, Karl; Strand, Dennis; Laquai, Frédéric

2014-01-01

Summary Based on recent developments regarding the synthesis and design of Janus nanoparticles, they have attracted increased scientific interest due to their outstanding properties. There are several combinations of multicomponent hetero-nanostructures including either purely organic or inorganic, as well as composite organic–inorganic compounds. Janus particles are interconnected by solid state interfaces and, therefore, are distinguished by two physically or chemically distinct surfaces. They may be, for instance, hydrophilic on one side and hydrophobic on the other, thus, creating giant amphiphiles revealing the endeavor of self-assembly. Novel optical, electronic, magnetic, and superficial properties emerge in inorganic Janus particles from their dimensions and unique morphology at the nanoscale. As a result, inorganic Janus nanoparticles are highly versatile nanomaterials with great potential in different scientific and technological fields. In this paper, we highlight some advances in the synthesis of inorganic Janus nanoparticles, focusing on the heterogeneous nucleation technique and characteristics of the resulting high quality nanoparticles. The properties emphasized in this review range from the monodispersity and size-tunability and, therefore, precise control over size-dependent features, to the biomedical application as theranostic agents. Hence, we show their optical properties based on plasmonic resonance, the two-photon activity, the magnetic properties, as well as their biocompatibility and interaction with human blood serum. PMID:25551063

78 FR 39717 - Iroquois Gas Transmission System, LP; Notice of Application

Federal Register 2010, 2011, 2012, 2013, 2014

2013-07-02

... associated with these new and modified facilities to Constitution Pipeline Company, LLC (Constitution), a... to establish a new receipt interconnection with Constitution and create an incremental 650,000... Constitution to interconnections with Iroquois' mainline system as well as Tennessee Gas Pipeline Company, LLC...

Clad metals by roll bonding for SOFC interconnects

NASA Astrophysics Data System (ADS)

Chen, L.; Jha, B.; Yang, Zhenguo; Xia, Guang-Guang; Stevenson, Jeffry W.; Singh, Prabhakar

2006-08-01

High-temperature oxidation-resistant alloys are currently considered as a candidate material for construction of interconnects in intermediate-temperature solid oxide fuel cells. Among these alloys, however, different groups of alloys demonstrate different advantages and disadvantages, and few, if any, can completely satisfy the stringent requirements for the application. To integrate the advantages and avoid the disadvantages of different groups of alloys, cladding has been proposed as one approach in fabricating metallic layered interconnect structures. To examine the feasibility of this approach, the austenitic Ni-base alloy Haynes 230 and the ferritic stainless steel AL 453 were selected as examples and manufactured into a clad metal. Its suitability as an interconnect construction material was investigated. This paper provides a brief overview of the cladding approach and discusses the viability of this technology to fabricate the metallic layered-structure interconnects.

Fast photorefractive self focusing in InP:Fe semiconductor at near infrared wavelengths

NASA Astrophysics Data System (ADS)

Wolfersberger, Delphine; Dan, Cristian; Khelfaoui, Naïma; Fressengeas, Nicolas; Hervé, Leblond

2008-04-01

Self-trapping of optical beams in photorefractive (PR) materials at telecommunications wavelengths has been studied at steady state in insulators such as SBN [1] and in semiconductor InP:Fe [2], CdTe [3]. PR self-focusing and soliton interactions in semiconductors find interesting applications in optical communications such as optical routing and interconnections because of several advantages over insulators: their sensitivity to near-infrared wavelengths and shorter response time. Photorefractive self focusing in InP:Fe is characterized as a function of beam intensity and temperature. Transient self focusing is found to occur on two time scales for input intensities of tens of W/cm2 (one on the order of tens of μs, one on the order of milliseconds). A theory developed describes the photorefractive self focusing in InP:Fe and confirmed by steady state and transient regime measurements. PR associated phenomena (bending and self focusing) are taking place in InP:Fe as fast as a μs for intensities on the order of 10W/cm2 at 1.06 μm. Currently we are conducting more experiments in order to estimate the self focusing response time at 1.55μm, to clarify the temporal dynamic of the self focusing and to build up a demonstrator of fast optical routing by photorefractive spatial solitons interactions.

Fabrication of microgrooves with excimer laser ablation techniques for plastic optical fiber array alignment purposes

NASA Astrophysics Data System (ADS)

Naessens, Kris; Van Hove, An; Coosemans, Thierry; Verstuyft, Steven; Ottevaere, Heidi; Vanwassenhove, Luc; Van Daele, Peter; Baets, Roel G.

2000-06-01

Laser ablation is extremely well suited for rapid prototyping and proves to be a versatile technique delivering high accuracy dimensioning and repeatability of features in a wide diversity of materials. In this paper, we present laser ablation as a fabrication method for micro machining in of arrays consisting of precisely dimensioned U-grooves in dedicated polycarbonate and polymethylmetacrylate plates. The dependency of the performance on various parameters is discussed. The fabricated plates are used to hold optical fibers by means of a UV-curable adhesive. Stacking and gluing of the plates allows the assembly of a 2D connector of plastic optical fibers for short distance optical interconnects.

Ge-Photodetectors for Si-Based Optoelectronic Integration

PubMed Central

Wang, Jian; Lee, Sungjoo

2011-01-01

High speed photodetectors are a key building block, which allow a large wavelength range of detection from 850 nm to telecommunication standards at optical fiber band passes of 1.3–1.55 μm. Such devices are key components in several applications such as local area networks, board to board, chip to chip and intrachip interconnects. Recent technological achievements in growth of high quality SiGe/Ge films on Si wafers have opened up the possibility of low cost Ge-based photodetectors for near infrared communication bands and high resolution spectral imaging with high quantum efficiencies. In this review article, the recent progress in the development and integration of Ge-photodetectors on Si-based photonics will be comprehensively reviewed, along with remaining technological issues to be overcome and future research trends. PMID:22346598

Panel A report: Standards needed to interconnect ADS pilots for data sharing for catalogues, directories, and dictionaries

NASA Technical Reports Server (NTRS)

1981-01-01

User requirements, guidelines, and standards for interconnecting an Applications Data Service (ADS) program for data sharing are discussed. Methods for effective sharing of information (catalogues, directories, and dictionaries) among member installations are addressed. An ADS Directory/Catalog architectural model is also given.

Statistical metrology—measurement and modeling of variation for advanced process development and design rule generation

NASA Astrophysics Data System (ADS)

Boning, Duane S.; Chung, James E.

1998-11-01

Advanced process technology will require more detailed understanding and tighter control of variation in devices and interconnects. The purpose of statistical metrology is to provide methods to measure and characterize variation, to model systematic and random components of that variation, and to understand the impact of variation on both yield and performance of advanced circuits. Of particular concern are spatial or pattern-dependencies within individual chips; such systematic variation within the chip can have a much larger impact on performance than wafer-level random variation. Statistical metrology methods will play an important role in the creation of design rules for advanced technologies. For example, a key issue in multilayer interconnect is the uniformity of interlevel dielectric (ILD) thickness within the chip. For the case of ILD thickness, we describe phases of statistical metrology development and application to understanding and modeling thickness variation arising from chemical-mechanical polishing (CMP). These phases include screening experiments including design of test structures and test masks to gather electrical or optical data, techniques for statistical decomposition and analysis of the data, and approaches to calibrating empirical and physical variation models. These models can be integrated with circuit CAD tools to evaluate different process integration or design rule strategies. One focus for the generation of interconnect design rules are guidelines for the use of "dummy fill" or "metal fill" to improve the uniformity of underlying metal density and thus improve the uniformity of oxide thickness within the die. Trade-offs that can be evaluated via statistical metrology include the improvements to uniformity possible versus the effect of increased capacitance due to additional metal.

Characterization of micro-contact resistance between a gold nanocrystalline line and a tungsten electrode probe in interconnect fatigue testing.

PubMed

Ling, Xue; Wang, Yusheng; Li, Xide

2014-10-01

An electromechanically-coupled micro-contact resistance measurement system is built to mimic the contact process during fatigue testing of nanoscale-thickness interconnects using multiple probe methods. The design combines an optical microscope, high-resolution electronic balance, and micromanipulator-controlled electric probe, and is coupled with electrical measurements to investigate microscale contact physics. Experimental measurements are performed to characterize the contact resistance response of the gold nanocrystalline pad of a 35-nm-thick interconnect under mechanical force applied by a tungsten electrode probe. Location of a stable region for the contact resistance and the critical contact force provides better understanding of micro-contact behavior relative to the effects of the contact force and the nature of the contact surface. Increasing contact temperature leads to reduced contact resistance, softens the pad material, and modifies the contact surface. The stability of both contact resistance and interconnect resistance is studied under increasing contact force. Major fluctuations emerge when the contact force is less than the critical contact force, which shows that temporal contact resistance will affect interconnect resistance measurement accuracy, even when using the four-wire method. This performance is demonstrated experimentally by heating the Au line locally with a laser beam. Finally, the contact resistances are calculated using the LET (Li-Etsion-Talke) model together with combined Holm and Sharvin theory under various contact forces. Good agreement between the results is obtained. This research provides a way to measure change in interconnect line resistance directly under a stable contact resistance regime with a two-wire method that will greatly reduce the experimental costs.

Characterization of micro-contact resistance between a gold nanocrystalline line and a tungsten electrode probe in interconnect fatigue testing

NASA Astrophysics Data System (ADS)

Ling, Xue; Wang, Yusheng; Li, Xide

2014-10-01

An electromechanically-coupled micro-contact resistance measurement system is built to mimic the contact process during fatigue testing of nanoscale-thickness interconnects using multiple probe methods. The design combines an optical microscope, high-resolution electronic balance, and micromanipulator-controlled electric probe, and is coupled with electrical measurements to investigate microscale contact physics. Experimental measurements are performed to characterize the contact resistance response of the gold nanocrystalline pad of a 35-nm-thick interconnect under mechanical force applied by a tungsten electrode probe. Location of a stable region for the contact resistance and the critical contact force provides better understanding of micro-contact behavior relative to the effects of the contact force and the nature of the contact surface. Increasing contact temperature leads to reduced contact resistance, softens the pad material, and modifies the contact surface. The stability of both contact resistance and interconnect resistance is studied under increasing contact force. Major fluctuations emerge when the contact force is less than the critical contact force, which shows that temporal contact resistance will affect interconnect resistance measurement accuracy, even when using the four-wire method. This performance is demonstrated experimentally by heating the Au line locally with a laser beam. Finally, the contact resistances are calculated using the LET (Li-Etsion-Talke) model together with combined Holm and Sharvin theory under various contact forces. Good agreement between the results is obtained. This research provides a way to measure change in interconnect line resistance directly under a stable contact resistance regime with a two-wire method that will greatly reduce the experimental costs.