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Sample records for oxide semiconductor field-effect

  1. Metal-oxide-semiconductor field effect nanostructure spin lattice devices

    NASA Astrophysics Data System (ADS)

    Yang, Jun

    This dissertation explored and developed technologies for silicon based spin lattice devices. Spin lattices are artificial electron spin systems with a periodic structure having one to a few electrons at each site. They are expected to have various magnetic and even superconducting properties when structured at an optimal scale with a specific number i of electrons. Silicon turns out to be a very good material choice in realizing spin lattices. A metal-oxide-semiconductor field-effect nanostructure (MOSFENS) device, which is closely related to a MOS transistor but with a nanostructured oxide-semiconductor interface, can define the spin lattices potential at the interface and alter the occupation i with the gate electrode potential to change the magnetic phase. The MOSFENS spin lattices engineering challenge addressed in this work has come from the practical difficulty of process integration in modifying a transistor fabrication process to accommodate the interface patterning requirements. Two distinct design choices for the fabrication sequences that create the nanostructure have been examined. Patterning the silicon surface before the MOS gate stack layers gives a "nanostructure first" process, and patterning the interface after forming the gate stack gives a "nanostructure last process." Both processes take advantage of a nano-LOCOS (nano-local oxidation of silicon) invention developed in this work. The nano-LOCOS process plays a central role in defining a clean, sharp confining potential for the spin lattice electrons. The MOSFENS process required a basic transistor fabrication process that can accommodate the nanostructures. The process developed for this purpose has a gate stack with a 15 nm polysilicon gate electrode and a 3 nm thermal gate oxide on a p-type silicon substrate. The measured threshold voltage is 0.25 V. Device processes were examined for either isolating the devices with windows in the field oxide or with mesas defined by the etched trenches

  2. Nanomechanoelectronic signal transduction scheme with metal-oxide-semiconductor field-effect transistor-embedded microcantilevers

    NASA Astrophysics Data System (ADS)

    Tark, Soo-Hyun; Srivastava, Arvind; Chou, Stanley; Shekhawat, Gajendra; Dravid, Vinayak P.

    2009-03-01

    We explore various metal-oxide-semiconductor field-effect transistor (MOSFET)-embedded microcantilever designs to assess their performance as an efficient nanomechanoelectronic signal transduction platform for monitoring deflection in microcantilever-based phenomena such as biochemical sensing and actuation. The current-voltage characteristics of embedded MOSFETs show current noise in the nanoampere range with a large signal-to-noise ratio sufficient to provide measureable output signal. The change in drain current with cantilever deflection is consistent with the effect of stress on carrier mobility and drain current reported in previous studies, validating that the MOSFET cantilevers can directly transduce deflection of a microcantilever into reproducible change in electrical signal.

  3. Effect of Temperature on GaGdO/GaN Metal Oxide Semiconductor Field Effect Transistors

    SciTech Connect

    Abernathy, C.R.; Baca, A.; Chu, S.N.G.; Hong, M.; Lothian, J.R.; Marcus, M.A.; Pearton, S.J.; Ren, F.; Schurman, M.J.

    1998-10-14

    GaGdO was deposited on GaN for use as a gate dielectric in order to fabricate a depletion metal oxide semiconductor field effect transistor (MOSFET). This is the fmt demonstration of such a device in the III-Nitride system. Analysis of the effect of temperature on the device shows that gate leakage is significantly reduced at elevated temperature relative to a conventional metal semiconductor field effeet transistor (MESFET) fabricated on the same GaN layer. MOSFET device operation in fact improved upon heating to 400 C. Modeling of the effeet of temperature on contact resistance suggests that the improvement is due to a reduction in the parasitic resistances present in the device.

  4. Inversion channel diamond metal-oxide-semiconductor field-effect transistor with normally off characteristics.

    PubMed

    Matsumoto, Tsubasa; Kato, Hiromitsu; Oyama, Kazuhiro; Makino, Toshiharu; Ogura, Masahiko; Takeuchi, Daisuke; Inokuma, Takao; Tokuda, Norio; Yamasaki, Satoshi

    2016-01-01

    We fabricated inversion channel diamond metal-oxide-semiconductor field-effect transistors (MOSFETs) with normally off characteristics. At present, Si MOSFETs and insulated gate bipolar transistors (IGBTs) with inversion channels are widely used because of their high controllability of electric power and high tolerance. Although a diamond semiconductor is considered to be a material with a strong potential for application in next-generation power devices, diamond MOSFETs with an inversion channel have not yet been reported. We precisely controlled the MOS interface for diamond by wet annealing and fabricated p-channel and planar-type MOSFETs with phosphorus-doped n-type body on diamond (111) substrate. The gate oxide of Al2O3 was deposited onto the n-type diamond body by atomic layer deposition at 300 °C. The drain current was controlled by the negative gate voltage, indicating that an inversion channel with a p-type character was formed at a high-quality n-type diamond body/Al2O3 interface. The maximum drain current density and the field-effect mobility of a diamond MOSFET with a gate electrode length of 5 μm were 1.6 mA/mm and 8.0 cm(2)/Vs, respectively, at room temperature. PMID:27545201

  5. Inversion channel diamond metal-oxide-semiconductor field-effect transistor with normally off characteristics

    NASA Astrophysics Data System (ADS)

    Matsumoto, Tsubasa; Kato, Hiromitsu; Oyama, Kazuhiro; Makino, Toshiharu; Ogura, Masahiko; Takeuchi, Daisuke; Inokuma, Takao; Tokuda, Norio; Yamasaki, Satoshi

    2016-08-01

    We fabricated inversion channel diamond metal-oxide-semiconductor field-effect transistors (MOSFETs) with normally off characteristics. At present, Si MOSFETs and insulated gate bipolar transistors (IGBTs) with inversion channels are widely used because of their high controllability of electric power and high tolerance. Although a diamond semiconductor is considered to be a material with a strong potential for application in next-generation power devices, diamond MOSFETs with an inversion channel have not yet been reported. We precisely controlled the MOS interface for diamond by wet annealing and fabricated p-channel and planar-type MOSFETs with phosphorus-doped n-type body on diamond (111) substrate. The gate oxide of Al2O3 was deposited onto the n-type diamond body by atomic layer deposition at 300 °C. The drain current was controlled by the negative gate voltage, indicating that an inversion channel with a p-type character was formed at a high-quality n-type diamond body/Al2O3 interface. The maximum drain current density and the field-effect mobility of a diamond MOSFET with a gate electrode length of 5 μm were 1.6 mA/mm and 8.0 cm2/Vs, respectively, at room temperature.

  6. Inversion channel diamond metal-oxide-semiconductor field-effect transistor with normally off characteristics

    PubMed Central

    Matsumoto, Tsubasa; Kato, Hiromitsu; Oyama, Kazuhiro; Makino, Toshiharu; Ogura, Masahiko; Takeuchi, Daisuke; Inokuma, Takao; Tokuda, Norio; Yamasaki, Satoshi

    2016-01-01

    We fabricated inversion channel diamond metal-oxide-semiconductor field-effect transistors (MOSFETs) with normally off characteristics. At present, Si MOSFETs and insulated gate bipolar transistors (IGBTs) with inversion channels are widely used because of their high controllability of electric power and high tolerance. Although a diamond semiconductor is considered to be a material with a strong potential for application in next-generation power devices, diamond MOSFETs with an inversion channel have not yet been reported. We precisely controlled the MOS interface for diamond by wet annealing and fabricated p-channel and planar-type MOSFETs with phosphorus-doped n-type body on diamond (111) substrate. The gate oxide of Al2O3 was deposited onto the n-type diamond body by atomic layer deposition at 300 °C. The drain current was controlled by the negative gate voltage, indicating that an inversion channel with a p-type character was formed at a high-quality n-type diamond body/Al2O3 interface. The maximum drain current density and the field-effect mobility of a diamond MOSFET with a gate electrode length of 5 μm were 1.6 mA/mm and 8.0 cm2/Vs, respectively, at room temperature. PMID:27545201

  7. Extended-Gate Metal Oxide Semiconductor Field Effect Transistor-Based Biosensor for Detection of Deoxynivalenol

    NASA Astrophysics Data System (ADS)

    Kwon, Insu; Lee, Hee-Ho; Choi, Jinhyeon; Shin, Jang-Kyoo; Seo, Sang-Ho; Choi, Sung-Wook; Chun, Hyang Sook

    2011-06-01

    In this work, we present an extended-gate metal oxide semiconductor field effect transistor (MOSFET)-based biosensor for the detection of deoxynivalenol using a null-balancing circuit. An extended-gate MOSFET-based biosensor was fabricated by a standard complementary metal oxide semiconductor (CMOS) process and its characteristics were measured. A null-balancing circuit was used to measure the output voltage of the sensor directly, instead of measuring the drain current of the sensor. Au was used as the gate metal, which has a chemical affinity with thiol, which leads to the immobilization of a self-assembled monolayer (SAM) of mercaptohexadecanoic acid (MHDA). The SAM was used to immobilize the anti-deoxynivalenol antibody. The carboxyl group of the SAM was bound to the anti-deoxynivalenol antibody. The anti-deoxynivalenol antibody and deoxynivalenol were bound by their antigen-antibody reaction. The measurements were performed in phosphate buffered saline (PBS; pH 7.4) solution. A standard Ag/AgCl electrode was employed as a reference electrode. The bindings of a SAM, anti-deoxynivalenol antibody, and deoxynivalenol caused a variation in the output voltage of the extended-gate MOSFET-based biosensor. Surface plasmon resonance (SPR) measurement was performed to verify the interaction among the SAM, deoxynivalenol-antibody, and deoxynivalenol.

  8. Modeling of quasi-ballistic transport in nanowire metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Lee, Yeonghun; Kakushima, Kuniyuki; Natori, Kenji; Iwai, Hiroshi

    2015-10-01

    We developed a semi-analytical quasi-ballistic transport model for the nanowire metal-oxide-semiconductor field-effect transistors, dealing with finite lengths of source, channel, and drain. For the modeling, we used a combination of one-flux scattering matrices and analytical solutions of Boltzmann transport equations. The developed model was in quantitatively good agreement with numerical results, and well represented intermediate-scaled devices. In addition, we illustrated that the finite source seriously affect the distribution function of the carriers injected from the source, and the finite drain does for the backscattering into the channel from the drain. Finally, our model and results would help to understand physical aspects regarding quasi-ballistic transport in nanoscale devices.

  9. Experimental characterization of a metal-oxide-semiconductor field-effect transistor-based Coulter counter.

    PubMed

    Sridhar, Manoj; Xu, Dongyan; Kang, Yuejun; Hmelo, Anthony B; Feldman, Leonard C; Li, Dongqing; Li, Deyu

    2008-05-15

    We report the detailed characterization of an ultrasensitive microfluidic device used to detect the translocation of small particles through a sensing microchannel. The device connects a fluidic circuit to the gate of a metal-oxide-semiconductor field-effect transistor (MOSFET) and detects particles by monitoring the MOSFET drain current modulation instead of the modulation in the ionic current through the sensing channel. The minimum volume ratio of the particle to the sensing channel detected is 0.006%, which is about ten times smaller than the lowest detected volume ratio previously reported in the literature. This volume ratio is detected at a noise level of about 0.6% of the baseline MOSFET drain current, clearly showing the amplification effects from the fluidic circuits and the MOSFETs. We characterize the device sensitivity as a function of the MOSFET gate potential and show that its sensitivity is higher when the MOSFET is operating below its threshold gate voltage than when it is operating above the threshold voltage. In addition, we demonstrate that the device sensitivity linearly increases with the applied electrical bias across the fluidic circuit. Finally, we show that polystyrene beads and glass beads with similar sizes can be distinguished from each other based on their different translocation times, and the size distribution of microbeads can be obtained with accuracy comparable to that of direct scanning electron microscopy measurements. PMID:19479001

  10. Growth and metal-oxide-semiconductor field-effect transistors of corundum-structured alpha indium oxide semiconductors

    NASA Astrophysics Data System (ADS)

    Kaneko, Kentaro; Ito, Yoshito; Uchida, Takayuki; Fujita, Shizuo

    2015-09-01

    The growth of corundum-structured α-In2O3, showing an X-ray diffraction (0006) rocking curve full-width at half maximum of 185 arcsec and electron Hall mobility of 130 cm2 V-1 s-1, was demonstrated on a sapphire substrate with an α-Ga2O3 buffer layer. An MOSFET of α-In2O3 exhibited pinch-off characteristics and an on-off ratio of drain current of 106. The use of mist chemical vapor deposition for the insulator-semiconductor structure was advantageous for low-cost devices.

  11. Characterization of metal oxide semiconductor field effect transistor dosimeters for application in clinical mammography.

    PubMed

    Benevides, Luis A; Hintenlang, David E

    2006-02-01

    Five high-sensitivity metal oxide semiconductor field effect transistor dosimeters in the TN-502 and 1002 series (Thomson Nielsen Electronics Ltd., 25B, Northside Road, Ottawa, ON K2H8S1, Canada) were evaluated for use in the mammography x-ray energy range (22-50 kVp) as a tool to assist in the documentation of patient specific average glandular dose. The dosimeters were interfaced with the Patient Dose Verification System, model No. TN-RD 15, which consisted of a dosimeter reader and up to four dual bias power supplies. Two different dual bias power supplies were evaluated in this study, model No. TN-RD 22 in high-sensitivity mode and a very-high sensitivity prototype. Each bias supply accommodates up to five dosimeters for 20 dosimeters per system. Sensitivity of detectors, defined as the mV/C kg(-1), was measured free in air with the bubble side of the dosimeter facing the x-ray field with a constant exposure. All dosimeter models' angular response showed a marked decrease in response when oriented between 120 degrees and 150 degrees and between at 190 degrees and 220 degrees relative to the incident beam. Sensitivity was evaluated for Mo/Mo, Mo/Rh, and Rh/Rh target-filter combinations. The individual dosimeter model sensitiVity was 4.45 x 10(4) mV/C kg(-1) (11.47 mV R(-1)) for TN-502RDS(micro); 5.93 x 10(4) mV per C kg(-1) (15.31 mV R(-1)) for TN-1002RD; 6.06 x 10(4) mV/C kg(-1) (15.63 mV R(-1)) for TN-1002RDI; 9.49 x 10(4) mV per C kg(-1) (24.49 mV R(-1)) for TN-1002RDM (micro); and 11.20 x 10(4) mV/C kg(-1) (28.82 mV R(-1)) for TN-1002RDS (micro). The energy response is presented and is observed to vary with dosimeter model, generally increasing with tube potential through the mammography energy range. An intercomparison of the high-sensitivity mode of TN-RD-22 was made to the very-high sensitivity bias power supply using a Mo/Mo target-filter. The very-high sensitivity-bias power supply increased dosimeter response by 1.45 +/- 0.04 for dosimeter models TN

  12. Monolithic integration of GaN-based light-emitting diodes and metal-oxide-semiconductor field-effect transistors.

    PubMed

    Lee, Ya-Ju; Yang, Zu-Po; Chen, Pin-Guang; Hsieh, Yung-An; Yao, Yung-Chi; Liao, Ming-Han; Lee, Min-Hung; Wang, Mei-Tan; Hwang, Jung-Min

    2014-10-20

    In this study, we report a novel monolithically integrated GaN-based light-emitting diode (LED) with metal-oxide-semiconductor field-effect transistor (MOSFET). Without additionally introducing complicated epitaxial structures for transistors, the MOSFET is directly fabricated on the exposed n-type GaN layer of the LED after dry etching, and serially connected to the LED through standard semiconductor-manufacturing technologies. Such monolithically integrated LED/MOSFET device is able to circumvent undesirable issues that might be faced by other kinds of integration schemes by growing a transistor on an LED or vice versa. For the performances of resulting device, our monolithically integrated LED/MOSFET device exhibits good characteristics in the modulation of gate voltage and good capability of driving injected current, which are essential for the important applications such as smart lighting, interconnection, and optical communication. PMID:25607316

  13. Electrical characterization of the metal ferroelectric oxide semiconductor and metal ferroelectric nitride semiconductor gate stacks for ferroelectric field effect transistors

    NASA Astrophysics Data System (ADS)

    Verma, Ram Mohan; Rao, Ashwath; Singh, B. R.

    2014-03-01

    This paper presents our work on electrical characterization of metal-ferroelectric-oxide-semiconductor (MFeOS) and metal-ferroelectric-nitride-semiconductor (MFeNS) structures for nonvolatile memory applications. Thin films of lead zirconate titanate (PZT: 35:65) have been used as ferroelectric material on 2.5-5 nm thick thermally grown SiO2 and Si3N4 as buffer layer for MFeOS and MFeNS structures, respectively. Capacitance-Voltage (C-V) and Current-Voltage (I-V) characteristics were used for electrical characterization. Our comparative results reveal that the MFeNS structure with 2.5 nm thick buffer layer has higher memory window of about 3.6 V as compared to 3 V for similar MFeOS structure. Also superior electrical properties such as lower leakage current and higher dielectric strength were observed in MFeNS structures. Higher nitridation time was observed to deteriorate the polarization characteristics resulting in reduced memory window. The highest memory window of 6.5 V was observed for SiO2 buffer layer thickness of 5 nm. We also observed that the annealing temperature influences the leakage current characteristic and memory window of these structures.

  14. Hydrogen-terminated diamond vertical-type metal oxide semiconductor field-effect transistors with a trench gate

    NASA Astrophysics Data System (ADS)

    Inaba, Masafumi; Muta, Tsubasa; Kobayashi, Mikinori; Saito, Toshiki; Shibata, Masanobu; Matsumura, Daisuke; Kudo, Takuya; Hiraiwa, Atsushi; Kawarada, Hiroshi

    2016-07-01

    The hydrogen-terminated diamond surface (C-H diamond) has a two-dimensional hole gas (2DHG) layer independent of the crystal orientation. A 2DHG layer is ubiquitously formed on the C-H diamond surface covered by atomic-layer-deposited-Al2O3. Using Al2O3 as a gate oxide, C-H diamond metal oxide semiconductor field-effect transistors (MOSFETs) operate in a trench gate structure where the diamond side-wall acts as a channel. MOSFETs with a side-wall channel exhibit equivalent performance to the lateral C-H diamond MOSFET without a side-wall channel. Here, a vertical-type MOSFET with a drain on the bottom is demonstrated in diamond with channel current modulation by the gate and pinch off.

  15. Probing Electronic, Structural, and Charge Transfer Properties of Organic Semiconductor/Inorganic Oxide Interfaces Using Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Spalenka, Josef Wade

    Interfaces between organic semiconductors and inorganic oxides provide the functionality for devices including field-effect transistors (FETs) and organic photovoltaics. Organic FETs are sensitive to the physical structure and electronic properties of the few molecular layers of material at the interface between the semiconducting channel and the gate dielectric, and provide quantitative information such as the field-effect mobility of charge carriers and the concentration of trapped charge. In this thesis, FET interfaces between organic small-molecule semiconductors and SiO2, and donor/acceptor interfaces between organic small-molecules and the wide bandgap semiconductor ZnO are studied using electrical measurements of field-effect transistor devices. Monolayer-scale films of dihexyl sexithiophene are shown to have higher hole mobility than other monolayer organic semiconductors, and the origin of the high mobility is discussed. Studies of the crystal structure of the monolayer using X-ray structural probes and atomic force microscopy reveal the crystal structure is different in the monolayer regime compared to thicker films and bulk crystals. Progress and remaining challenges are discussed for in situ X-ray diffraction studies of the dynamic changes in the local crystal structure in organic monolayers due to charge carriers generated during the application of electric fields from the gate electrode in working FETs. Studies were conducted of light sensitive organic/inorganic interfaces that are modified with organic molecules grafted to the surface of ZnO nanoparticles and thin films. These interfaces are models for donor/acceptor interfaces in photovoltaics. The process of exciton dissociation at the donor/acceptor interface was sensitive to the insulating or semiconducting molecules grafted to the ZnO, and the photoinduced charge transfer process is measured by the threshold voltage shift of FETs during illumination. Charge transfer between light sensitive donor

  16. A compact quantum correction model for symmetric double gate metal-oxide-semiconductor field-effect transistor

    SciTech Connect

    Cho, Edward Namkyu; Shin, Yong Hyeon; Yun, Ilgu

    2014-11-07

    A compact quantum correction model for a symmetric double gate (DG) metal-oxide-semiconductor field-effect transistor (MOSFET) is investigated. The compact quantum correction model is proposed from the concepts of the threshold voltage shift (ΔV{sub TH}{sup QM}) and the gate capacitance (C{sub g}) degradation. First of all, ΔV{sub TH}{sup QM} induced by quantum mechanical (QM) effects is modeled. The C{sub g} degradation is then modeled by introducing the inversion layer centroid. With ΔV{sub TH}{sup QM} and the C{sub g} degradation, the QM effects are implemented in previously reported classical model and a comparison between the proposed quantum correction model and numerical simulation results is presented. Based on the results, the proposed quantum correction model can be applicable to the compact model of DG MOSFET.

  17. Semi-classical noise investigation for sub-40nm metal-oxide-semiconductor field-effect transistors

    SciTech Connect

    Spathis, C. Birbas, A.; Georgakopoulou, K.

    2015-08-15

    Device white noise levels in short channel Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) dictate the performance and reliability of high-frequency circuits ranging from high-speed microprocessors to Low-Noise Amplifiers (LNAs) and microwave circuits. Recent experimental noise measurements with very short devices demonstrate the existence of suppressed shot noise, contrary to the predictions of classical channel thermal noise models. In this work we show that, as the dimensions continue to shrink, shot noise has to be considered when the channel resistance becomes comparable to the barrier resistance at the source-channel junction. By adopting a semi-classical approach and taking retrospectively into account transport, short-channel and quantum effects, we investigate the partitioning between shot and thermal noise, and formulate a predictive model that describes the noise characteristics of modern devices.

  18. Extraction of Channel Length Independent Series Resistance for Deeply Scaled Metal-Oxide-Semiconductor Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Ma, Li-Juan; Ji, Xiao-Li; Chen, Yuan-Cong; Xia, Hao-Guang; Zhu, Chen-Xin; Guo, Qiang; Yan, Feng

    2014-09-01

    The recently developed four Rsd extraction methods from a single device, involving the constant-mobility method, the direct Id—Vgs method, the conductance method and the Y-function method, are evaluated on 32 nm n-channel metal-oxide-semiconductor field-effect transistors (nMOSFETs). It is found that Rsd achieved from the constant-mobility method exhibits the channel length independent characteristics. The L-dependent Rsd extracted from the other three methods is proven to be associated with the gate-voltage-induced mobility degradation in the extraction procedures. Based on L-dependent behaviors of Rsd, a new method is proposed for accurate series resistance extraction on deeply scaled MOSFETs.

  19. Experimental study on vertical scaling of InAs-on-insulator metal-oxide-semiconductor field-effect transistors

    SciTech Connect

    Kim, SangHyeon E-mail: sh-kim@kist.re.kr; Yokoyama, Masafumi; Nakane, Ryosho; Takenaka, Mitsuru; Takagi, Shinichi; Ichikawa, Osamu; Osada, Takenori; Hata, Masahiko

    2014-06-30

    We have investigated effects of the vertical scaling on electrical properties in extremely thin-body InAs-on-insulator (-OI) metal-oxide-semiconductor field-effect transistors (MOSFETs). It is found that the body thickness (T{sub body}) scaling provides better short channel effect (SCE) control, whereas the T{sub body} scaling also causes the reduction of the mobility limited by channel thickness fluctuation (δT{sub body}) scattering (μ{sub fluctuation}). Also, in order to achieve better SCEs control, the thickness of InAs channel layer (T{sub channel}) scaling is more favorable than the thickness of MOS interface buffer layer (T{sub buffer}) scaling from a viewpoint of a balance between SCEs control and μ{sub fluctuation} reduction. These results indicate necessity of quantum well channel structure in InAs-OI MOSFETs and these should be considered in future transistor design.

  20. Anomalous degradation of low-field mobility in short-channel metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Natori, Kenji; Iwai, Hiroshi; Kakushima, Kuniyuki

    2015-12-01

    The anomalous degradation of the low-field mobility observed in short-channel metal-oxide-semiconductor field-effect transistors is analyzed by collating various reported data in experiments and simulations. It is inferred that the degradation is not caused by the channel scattering of the carriers. The origin is proposed to be the backscattering of channel carriers on injection into the drain. The expression of the low-field mobility, including the backscattering effect, is derived. The inverse of the low-field mobility is a linear function of the inverse of channel length, the expression of which reproduces that empirically derived by Bidal's group. By fitting the expression to simulated as well as experimental data, we can estimate the value of parameters related to the channel scattering and also to the backscattering from the drain. We find that these values are in reasonable magnitude.

  1. Transport properties of silicon complementary-metal-oxide semiconductor quantum well field-effect transistors

    NASA Astrophysics Data System (ADS)

    Naquin, Clint Alan

    Introducing explicit quantum transport into silicon (Si) transistors in a manner compatible with industrial fabrication has proven challenging, yet has the potential to transform the performance horizons of large scale integrated Si devices and circuits. Explicit quantum transport as evidenced by negative differential transconductances (NDTCs) has been observed in a set of quantum well (QW) n-channel metal-oxide-semiconductor (NMOS) transistors fabricated using industrial silicon complementary MOS processing. The QW potential was formed via lateral ion implantation doping on a commercial 45 nm technology node process line, and measurements of the transfer characteristics show NDTCs up to room temperature. Detailed gate length and temperature dependence characteristics of the NDTCs in these devices have been measured. Gate length dependence of NDTCs shows a correlation of the interface channel length with the number of NDTCs formed as well as with the gate voltage (VG) spacing between NDTCs. The VG spacing between multiple NDTCs suggests a quasi-parabolic QW potential profile. The temperature dependence is consistent with partial freeze-out of carrier concentration against a degenerately doped background. A folding amplifier frequency multiplier circuit using a single QW NMOS transistor to generate a folded current-voltage transfer function via a NDTC was demonstrated. Time domain data shows frequency doubling in the kHz range at room temperature, and Fourier analysis confirms that the output is dominated by the second harmonic of the input. De-embedding the circuit response characteristics from parasitic cable and contact impedances suggests that in the absence of parasitics the doubling bandwidth could be as high as 10 GHz in a monolithic integrated circuit, limited by the transresistance magnitude of the QW NMOS. This is the first example of a QW device fabricated by mainstream Si CMOS technology being used in a circuit application and establishes the feasibility

  2. SEMICONDUCTOR DEVICES: Dose-rate effects of p-channel metal oxide semiconductor field-effect transistors at various biasing conditions

    NASA Astrophysics Data System (ADS)

    Bo, Lan; Qi, Guo; Jing, Sun; Jiangwei, Cui; Maoshun, Li; Rui, Chen; Wuxiong, Fei; Yun, Zhao

    2010-05-01

    The total-dose response and annealing effect of p-channel metal oxide semiconductor field-effect transistors (PMOSFETs) were investigated at various dose rates and biasing conditions. The results show that the shift of threshold voltage is more obvious when the dose rate is decreased. Under the various dose rates and biasing conditions, some have exhibited a time-dependent effect and others showed enhanced low-dose-rate sensitivity (ELDRS). Finally, using the subthreshold-separating method, the threshold-voltage shift is separated into shifts due to interface states and oxide-trapped charges, and the underlying mechanisms of the observed effects are discussed. It has been indicated that the ELDRS effect results from the different quantities of the interface states generated at high and low dose rates.

  3. Evaluation of a dual bias dual metal oxide-silicon semiconductor field effect transistor detector as radiation dosimeter.

    PubMed

    Soubra, M; Cygler, J; Mackay, G

    1994-04-01

    A new type of direct reading semiconductor dosimeter has been investigated as a radiation detector for photon and electron therapy beams of various energies. The operation of this device is based on the measurement of the threshold voltage shift in a custom-built metal oxide-silicon semiconductor field effect transistor (MOSFET). This voltage is a linear function of absorbed dose. The extent of the linearity region is dependent on the voltage controlled operation during irradiation. Operating two MOSFETS at two different biases simultaneously during irradiation will result in sensitivity (V/Gy) reproducibility better than +/- 3% over a range in dose of 100 Gy and at a dose per fraction greater than 20 x 10(-2) Gy. The modes of operation give this device many advantages, such as continuous monitoring during irradiation, immediate reading, and permanent storage of total dose after irradiation. The availability and ease of use of these MOSFET detectors make them very promising in clinical dosimetry. PMID:8058024

  4. A theoretical and experimental evaluation of surface roughness variation in trigate metal oxide semiconductor field effect transistors

    NASA Astrophysics Data System (ADS)

    Hsieh, E. R.; Chung, Steve S.

    2016-05-01

    A gate current variation measurement method is proposed to examine the surface roughness of metal oxide semiconductor field effect transistors (MOSFETs). This gate current variation is demonstrated on the trigate structure MOSFETs. It was found that the standard deviation of oxide-thickness is proportional to the inverse of square-root of device areas, and its slope is defined as the effective surface roughness variation. In particular, for the transistors with varying fin height, this surface roughness effect aggravates with the increasing fin height. More importantly, the gate leakage at off-state, i.e., Vg = 0 V, is strongly dependent on the gate dielectric surface roughness and dominates the drain current variations. This gate leakage may serve as a quality measure of a low power and energy efficient integrated circuit, especially for the transistor with 3-dimensional gate structure. The present results provide us better understandings on an additional source of Vth fluctuations, i.e., the surface roughness variation, in addition to the random dopant fluctuation, that we are usually not noticed. In particular, this study also provides us a simple easy-to-use method for the monitoring of oxide quality in the volume production of trigate MOSFETs.

  5. Tunneling-injection-induced turnaround behavior of threshold voltage in thermally nitrided oxide n-channel metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Ma, Z. J.; Lai, P. T.; Liu, Z. H.; Fleischer, S.; Cheng, Y. C.

    1990-12-01

    The threshold voltage (VT) degradation metal-oxide-semiconductor field-effect transistors (MOSFETs) with thermally nitrided oxide or pure oxide as gate dielectric was determined under Fowler-Nordheim (FN) stressing. A typical VT turnaround behavior was observed for both kinds of devices. The VT for nitrided oxide MOSFETs shifts more negatively than that for pure oxide MOSFETs during the initial period of FN stressing whereas the opposite is true for the positive shift after the critical time at turnaround point. The discovery that the shift of substrate current peak exhibits similar turnaround behavior reinforces the above results. In the meantime, the field-effect electron mobility and the maximum transconductance in the channel for nitrided oxide MOSFETs are only slightly degraded by stressing as compared to that for pure oxide MOSFETs. The VT turnaround behavior can be explained as follows: Net trapped charges in the oxide are initially positive (due to hole traps in the oxide) and result in the negative shift of VT. With increasing injection time, trapped electrons in the oxide as well as acceptortype interface states increase. This results in the positive shift in VT. It is revealed that VT degradation in MOSFETs is dominated by the generation of acceptortype interface states rather than electron trapping in the oxide after the critical time.

  6. Single Event Effects (SEE) for Power Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs)

    NASA Technical Reports Server (NTRS)

    Lauenstein, Jean-Marie

    2011-01-01

    Single-event gate rupture (SEGR) continues to be a key failure mode in power MOSFETs. (1) SEGR is complex, making rate prediction difficult SEGR mechanism has two main components: (1) Oxide damage-- Reduces field required for rupture (2) Epilayer response -- Creates transient high field across the oxide.

  7. Effect of temperature on Ga2O3(Gd2O3)/GaN metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Ren, F.; Hong, M.; Chu, S. N. G.; Marcus, M. A.; Schurman, M. J.; Baca, A.; Pearton, S. J.; Abernathy, C. R.

    1998-12-01

    Ga2O3(Gd2O3) was deposited on GaN for use as a gate dielectric in order to fabricate a depletion metal-oxide-semiconductor field-effect transistor (MOSFET). Analysis of the effect of temperature on the device shows that gate leakage is significantly reduced at elevated temperature relative to a conventional metal-semiconductor field-effect transistor fabricated on the same GaN layer. MOSFET device operation in fact improved upon heating to 400 °C. Modeling of the effect of temperature on contact resistance suggests that the improvement is due to a reduction in the parasitic resistances present in the device.

  8. Quantum Mechanical Effects on the Threshold Voltage of Double-Gate Metal-Oxide-Semiconductor Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Hu, Guang-Xi; Liu, Ran; Qiu, Zhi-Jun; Wang, Ling-Li; Tang, Ting-Ao

    2010-03-01

    A model for a metal-oxide-semiconductor field-effect transistor (MOSFET) with a double gate (DG) is developed. Quantum mechanical effects on the threshold voltage (VTH) are modeled and investigated analytically. The analytic model shows how VTH is increased with quantum mechanical effect. The model is applicable to both symmetric DG (SDG) and asymmetric DG (ADG) nMOSFETs, and is also applicable to both doped and undoped DG nMOSFETs. The analytic results are verified by comparing with the results obtained from simulations using Schred, and good agreement is observed. The VTH of an ADG nMOSFET will shift more than that of an SDG nMOSFET, and the VTH of a DG transistor with (110)-silicon (Si) orientation will shift more than that of a DG transistor with (100)-Si orientation. When the silicon thickness tsi < 3 nm, the VTH shift will be significant, and one should be careful in the use of an extremely thin silicon body. When the body doping density (NA) is not high (<1018 cm-3), the VTH shift is almost the same for different NA. When NA > 1018 cm-3, the higher the NA, the more the VTH shift.

  9. Theoretical Study of Triboelectric-Potential Gated/Driven Metal-Oxide-Semiconductor Field-Effect Transistor.

    PubMed

    Peng, Wenbo; Yu, Ruomeng; He, Yongning; Wang, Zhong Lin

    2016-04-26

    Triboelectric nanogenerator has drawn considerable attentions as a potential candidate for harvesting mechanical energies in our daily life. By utilizing the triboelectric potential generated through the coupling of contact electrification and electrostatic induction, the "tribotronics" has been introduced to tune/control the charge carrier transport behavior of silicon-based metal-oxide-semiconductor field-effect transistor (MOSFET). Here, we perform a theoretical study of the performances of tribotronic MOSFET gated by triboelectric potential in two working modes through finite element analysis. The drain-source current dependence on contact-electrification generated triboelectric charges, gap separation distance, and externally applied bias are investigated. The in-depth physical mechanism of the tribotronic MOSFET operations is thoroughly illustrated by calculating and analyzing the charge transfer process, voltage relationship to gap separation distance, and electric potential distribution. Moreover, a tribotronic MOSFET working concept is proposed, simulated and studied for performing self-powered FET and logic operations. This work provides a deep understanding of working mechanisms and design guidance of tribotronic MOSFET for potential applications in micro/nanoelectromechanical systems (MEMS/NEMS), human-machine interface, flexible electronics, and self-powered active sensors.

  10. Analytic Circuit Model of Ballistic Nanowire Metal-Oxide-Semiconductor Field-Effect Transistor for Transient Analysis

    NASA Astrophysics Data System (ADS)

    Numata, Tatsuhiro; Uno, Shigeyasu; Kamakura, Yoshinari; Mori, Nobuya; Nakazato, Kazuo

    2013-04-01

    A fully analytic and explicit model of device properties in the ballistic transport in gate-all-around metal-oxide-semiconductor field-effect transistors (MOSFETs) is proposed, which enables circuit simulations. The electrostatic potential distribution in the wire cross section is approximated by a parabolic function. Using the applied potential, the energy levels of electrons are analytically obtained in terms of a single unknown parameter by perturbation theory. Ballistic current is obtained in terms of an unknown parameter using the analytic expression of the electron energy level and the current equation for ballistic transport. We analytically derive the parameter with a one-of-a-kind approximate methodology. With the obtained parameter, the fully analytic and explicit model of device properties such as energy levels, ballistic current, and effective capacitance is derived with satisfactory accuracy compared with the numerical simulation results. Finally, we perform a transient simulation using a circuit simulator, introducing our model to it as a Verilog-A script.

  11. Comparison of Measurement Techniques for Gate Shortening in Sub-Micrometer Metal Oxide Semiconductor Field Effect Transistors

    NASA Astrophysics Data System (ADS)

    Bhattacharya, Pradeep; Bari, Mohammad; Rao, Krishnaraj

    1993-08-01

    In this paper, various methods of evaluating the electrical channel length change (or gate shortening) as a result of applied gate voltage in sub-micrometer metal oxide semiconductor field effect transistors (MOSFETs) are investigated and the method best suited for such short channel length devices is reported. Studies were performed on n-channel transistors (n-MOSFETs) fabricated using X-ray and optical lithography and having channel lengths in the range of 0.4 to 4 μm and 1.5 to 10 μm respectively. The effective channel lengths were extracted from the current-voltage (I-V) measurements. The measurements were made for different low and high sets of gate voltages. In comparing various methods it was found that the method due to Terada and Muta, and Chern et al. gave accurate results consistently for short channel MOSFETs, whereas the Whitfield method gave accurate results only for larger channel length MOSFETs. The accuracy of the Whitfield method is sensitive to applied gate voltage during I-V measurements. The Peng and Afromowitz method is unsuitable for finding the effective channel length of sub-micrometer MOSFETs especially if the MOSFETs have high values of external resistance.

  12. Comparison of measurement techniques for gate shortening in sub-micrometer metal oxide semiconductor field effect transistors

    NASA Astrophysics Data System (ADS)

    Bhattacharya, Pradeep; Bari, Mohammad; Rao, Krishnaraj

    1993-08-01

    In this paper, various methods of evaluating the electrical channel length change (or gate shortening) as a result of applied gate voltage in sub-micrometer metal oxide semiconductor field effect transistors (MOSFETs) are investigated and the method best suited for such short channel length devices is reported. Studies were performed on n-channel transistors (n-MOSEFTs) fabricated using X-ray and optical lithography and having channel lengths in the range of 0.4 to 4 micron and 1.5 to 10 micron respectively. The effective channel lengths were extracted from the current-voltage (I-V) measurements. The measurements were made for different low and high sets of gate voltages. In comparing various methods it was found that the method due to Terada and Muta, and Chern et al. gave accurate results consistently for short channel MOSEFTs, whereas the Whitfield method gave accurate results only for larger channel length MOSEFTs. The accuracy of the Whitfield method is sensitive to applied gate voltage during I-V measurements. The Peng and Afromowitz method is unsuitable for finding the effective channel length of sub-micrometer MSFETs especially if the MSFETs have high values of external resistance.

  13. Real-Time Variable-Resolution Complementary Metal-Oxide-Semiconductor Field-Effect Transistors Image Sensor

    NASA Astrophysics Data System (ADS)

    Chen, Chih-Yang; Wang, Jian-Jie; Lin, Chrong-Jung; King, Ya-Chin

    2008-04-01

    In this paper, a new, efficient and simple complementary metal-oxide-semiconductor (CMOS) field-effect transistors (FETs) image sensor (CIS) readout architecture providing both real-time variable-resolution image sensing and dynamic range boosting functions is presented. The proposed correlated-double-sampling (CDS) circuit can not only reduce fixed-pattern noise (FPN) but also output the lower resolution image by real-time averaging of four pixels' signals in square 2 ×2 pixels in variable-resolution mode. Variable-resolution imaging can effectively reduce the complexity of the signal process, release the loading of processing units, and accelerate the data processing in motion detection and object tracking operations. In addition, the new CDS circuit can extend dynamic range of a sensor array by analog combining the signals from different integration lengths. The new designed circuits can replace typical CDS readout circuits in typical CIS arrays to provide real-time, accurate resolution-variable imaging and dynamic range boosting without additional overhead on digital circuits.

  14. Ballistic graphene nanoribbon metal-oxide-semiconductor field-effect transistors: A full real-space quantum transport simulation

    NASA Astrophysics Data System (ADS)

    Liang, Gengchiau; Neophytou, Neophytos; Lundstrom, Mark S.; Nikonov, Dmitri E.

    2007-09-01

    A real-space quantum transport simulator for graphene nanoribbon (GNR) metal-oxide-semiconductor field-effect transistors (MOSFETs) has been developed and used to examine the ballistic performance of GNR MOSFETs. This study focuses on the impact of quantum effects on these devices and on the effect of different type of contacts. We found that two-dimensional (2D) semi-infinite graphene contacts produce metal-induced-gap states (MIGS) in the GNR channel. These states enhance quantum tunneling, particularly in short channel devices, they cause Fermi level pinning and degrade the device performance in both the ON-state and OFF-state. Devices with infinitely long contacts having the same width as the channel do not indicate MIGS. Even without MIGS quantum tunneling effects such as band-to-band tunneling still play an important role in the device characteristics and dominate the OFF-state current. This is accurately captured in our nonequilibrium Greens' function quantum simulations. We show that both narrow (1.4 nm width) and wider (1.8 nm width) GNRs with 12.5 nm channel length have the potential to outperform ultrascaled Si devices in terms of drive current capabilities and electrostatic control. Although their subthreshold swings under forward bias are better than in Si transistors, tunneling currents are important and prevent the achievement of the theoretical limit of 60 mV/dec.

  15. Theoretical Study of Triboelectric-Potential Gated/Driven Metal-Oxide-Semiconductor Field-Effect Transistor.

    PubMed

    Peng, Wenbo; Yu, Ruomeng; He, Yongning; Wang, Zhong Lin

    2016-04-26

    Triboelectric nanogenerator has drawn considerable attentions as a potential candidate for harvesting mechanical energies in our daily life. By utilizing the triboelectric potential generated through the coupling of contact electrification and electrostatic induction, the "tribotronics" has been introduced to tune/control the charge carrier transport behavior of silicon-based metal-oxide-semiconductor field-effect transistor (MOSFET). Here, we perform a theoretical study of the performances of tribotronic MOSFET gated by triboelectric potential in two working modes through finite element analysis. The drain-source current dependence on contact-electrification generated triboelectric charges, gap separation distance, and externally applied bias are investigated. The in-depth physical mechanism of the tribotronic MOSFET operations is thoroughly illustrated by calculating and analyzing the charge transfer process, voltage relationship to gap separation distance, and electric potential distribution. Moreover, a tribotronic MOSFET working concept is proposed, simulated and studied for performing self-powered FET and logic operations. This work provides a deep understanding of working mechanisms and design guidance of tribotronic MOSFET for potential applications in micro/nanoelectromechanical systems (MEMS/NEMS), human-machine interface, flexible electronics, and self-powered active sensors. PMID:27077327

  16. Possible unified model for the Hooge parameter in inversion-layer-channel metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Omura, Yasuhisa

    2013-06-01

    This paper proposes a possible unified model for the Hooge parameter by considering the impact of transport dimensionality on the Hooge parameter behavior of various inversion-layer-channel metal-oxide-semiconductor field-effect transistors. Past experiments show that the Hooge parameter has a couple of peculiar behaviors. Based on a phenomenological consideration, the original mobility-based model for the Hooge parameter is shown to provide only a partial understanding of the results. It is also observed that, in contrast to past models, the interpretation of some aspects of the Hooge parameter strongly depends on how the two fluctuation modes, the carrier-density fluctuation and the mobility fluctuation, correlate. The phenomenological model proposed here gives a fundamental physical basis that allows important aspects of the Hooge parameter to be interpreted; the model also introduces three basic parameters (the Hooge parameter elements for the carrier-density fluctuation, the mobility fluctuation, and the cross-correlation component). Theoretical expressions for the three basic Hooge parameters are given by merging the fundamental Hooge model, Handel's theory, statistical physics, and quantum-mechanical transport physics. The gate voltage dependence of the Hooge parameter can be explained reasonably well by stating that the screening length rules the dielectric function and that the mobility fluctuation and carrier density fluctuation are correlated. Finally, the theoretical models are examined against the results of past experiments.

  17. A silicon metal-oxide-semiconductor field-effect transistor Hall bar for scanning Hall probe microscopy.

    PubMed

    Yamaguchi, Akinobu; Saito, Hiromasa; Shimizu, Masayoshi; Miyajima, Hideki; Matsumoto, Satoru; Nakamura, Yoshiharu; Hirohata, Atsufumi

    2008-08-01

    We demonstrate successful operation of a scanning Hall probe microscope with a few micron-size resolution by using a silicon metal-oxide semiconductor field-effect transistor (Si-MOSFET) Hall bar, which is designed to improve not only the mechanical strength but also the temperature stability. The Si-MOSFET micro-Hall probe is cheaper than the current micro-Hall probes and is found to be as sensitive as a micro-Hall probe with GaAs/AlGaAs heterostructure or an epitaxial InSb two-dimensional electron gas. This was used to magnetically image the surface of a Sm(2)Co(17) permanent magnet during the magnetization reversal process as a function of an external magnetic field below 1.5 T. This revealed firm evidence of the presence of the inverse magnetic seed as theoretically predicted earlier. Magnetically pinned centers, with a typical size 80 mum, are observed to persist even under a high magnetic field, clearly indicating the robustness of the Si Hall probe against the field application as well as the repetition of the measurement. PMID:19044353

  18. A silicon metal-oxide-semiconductor field-effect transistor Hall bar for scanning Hall probe microscopy.

    PubMed

    Yamaguchi, Akinobu; Saito, Hiromasa; Shimizu, Masayoshi; Miyajima, Hideki; Matsumoto, Satoru; Nakamura, Yoshiharu; Hirohata, Atsufumi

    2008-08-01

    We demonstrate successful operation of a scanning Hall probe microscope with a few micron-size resolution by using a silicon metal-oxide semiconductor field-effect transistor (Si-MOSFET) Hall bar, which is designed to improve not only the mechanical strength but also the temperature stability. The Si-MOSFET micro-Hall probe is cheaper than the current micro-Hall probes and is found to be as sensitive as a micro-Hall probe with GaAs/AlGaAs heterostructure or an epitaxial InSb two-dimensional electron gas. This was used to magnetically image the surface of a Sm(2)Co(17) permanent magnet during the magnetization reversal process as a function of an external magnetic field below 1.5 T. This revealed firm evidence of the presence of the inverse magnetic seed as theoretically predicted earlier. Magnetically pinned centers, with a typical size 80 mum, are observed to persist even under a high magnetic field, clearly indicating the robustness of the Si Hall probe against the field application as well as the repetition of the measurement.

  19. Functional integrity of flexible n-channel metal-oxide-semiconductor field-effect transistors on a reversibly bistable platform

    NASA Astrophysics Data System (ADS)

    Alfaraj, Nasir; Hussain, Aftab M.; Torres Sevilla, Galo A.; Ghoneim, Mohamed T.; Rojas, Jhonathan P.; Aljedaani, Abdulrahman B.; Hussain, Muhammad M.

    2015-10-01

    Flexibility can bring a new dimension to state-of-the-art electronics, such as rollable displays and integrated circuit systems being transformed into more powerful resources. Flexible electronics are typically hosted on polymeric substrates. Such substrates can be bent and rolled up, but cannot be independently fixed at the rigid perpendicular position necessary to realize rollable display-integrated gadgets and electronics. A reversibly bistable material can assume two stable states in a reversible way: flexibly rolled state and independently unbent state. Such materials are used in cycling and biking safety wristbands and a variety of ankle bracelets for orthopedic healthcare. They are often wrapped around an object with high impulsive force loading. Here, we study the effects of cumulative impulsive force loading on thinned (25 μm) flexible silicon-based n-channel metal-oxide-semiconductor field-effect transistor devices housed on a reversibly bistable flexible platform. We found that the transistors have maintained their high performance level up to an accumulated 180 kN of impact force loading. The gate dielectric layers have maintained their reliability, which is evidenced by the low leakage current densities. Also, we observed low variation in the effective electron mobility values, which manifests that the device channels have maintained their carrier transport properties.

  20. Are dangling bond centers important interface traps in 4H-SiC metal oxide semiconductor field effect transistors?

    NASA Astrophysics Data System (ADS)

    Anders, M. A.; Lenahan, P. M.; Lelis, A. J.

    2016-10-01

    Silicon carbide (SiC) based metal-oxide-semiconductor field-effect transistors (MOSFETs) have great promise in high power and high temperature applications. Unfortunately, effective channel mobilities remain disappointingly low, typically about 30 cm2/Vs. A major contributor to the disappointing effective channel mobilities is the presence of substantial densities of interface traps at the SiC/SiO2 interface. Many investigators have invoked silicon or carbon dangling bonds to be the dominating source of these interface defects, but very little, if any, direct experimental evidence exists to support this assumption in the SiC/SiO2 system. Cantin et al. [Phys. Rev. Lett. 92, 1 (2004)] have used conventional electron paramagnetic resonance measurements on porous oxidized SiC structures to measure the g tensor for the SiC/SiO2 interface carbon dangling bond. These results provide a particularly straightforward means to search for the presence of carbon dangling bonds in fully processed SiC MOSFETs using electrically detected magnetic resonance. Additionally, simple theory provides guidance to search for silicon dangling bond defects. In this study, we utilize K band electrically detected magnetic resonance via spin dependent charge pumping measurements in which almost all of the SiC band gap at the SiC/SiO2 interface is accessed. Although quite high signal to noise measurements are achieved, we are unable to detect any trace of the carbon dangling bond spectra. However, in very poor quality p-channel devices, we observe a spectrum which could be consistent with silicon dangling bonds. Other defect centers are clearly present and we conclude that these other centers dominate the interface trap density of states.

  1. Verification of the plan dosimetry for high dose rate brachytherapy using metal-oxide-semiconductor field effect transistor detectors

    SciTech Connect

    Qi Zhenyu; Deng Xiaowu; Huang Shaomin; Lu Jie; Lerch, Michael; Cutajar, Dean; Rosenfeld, Anatoly

    2007-06-15

    The feasibility of a recently designed metal-oxide-semiconductor field effect transistor (MOSFET) dosimetry system for dose verification of high dose rate (HDR) brachytherapy treatment planning was investigated. MOSFET detectors were calibrated with a 0.6 cm{sup 3} NE-2571 Farmer-type ionization chamber in water. Key characteristics of the MOSFET detectors, such as the energy dependence, that will affect phantom measurements with HDR {sup 192}Ir sources were measured. The MOSFET detector was then applied to verify the dosimetric accuracy of HDR brachytherapy treatments in a custom-made water phantom. Three MOSFET detectors were calibrated independently, with the calibration factors ranging from 0.187 to 0.215 cGy/mV. A distance dependent energy response was observed, significant within 2 cm from the source. The new MOSFET detector has a good reproducibility (<3%), small angular effect (<2%), and good dose linearity (R{sup 2}=1). It was observed that the MOSFET detectors had a linear response to dose until the threshold voltage reached approximately 24 V for {sup 192}Ir source measurements. Further comparison of phantom measurements using MOSFET detectors with dose calculations by a commercial treatment planning system for computed tomography-based brachytherapy treatment plans showed that the mean relative deviation was 2.2{+-}0.2% for dose points 1 cm away from the source and 2.0{+-}0.1% for dose points located 2 cm away. The percentage deviations between the measured doses and the planned doses were below 5% for all the measurements. The MOSFET detector, with its advantages of small physical size and ease of use, is a reliable tool for quality assurance of HDR brachytherapy. The phantom verification method described here is universal and can be applied to other HDR brachytherapy treatments.

  2. High resolution imaging in cross-section of a metal-oxide-semiconductor field-effect-transistor using super-higher-order nonlinear dielectric microscopy

    NASA Astrophysics Data System (ADS)

    Chinone, N.; Yamasue, K.; Honda, K.; Cho, Y.

    2013-11-01

    Scanning nonlinear dielectric microscopy (SNDM) can evaluate carrier or charge distribution in semiconductor devices. High sensitivity to capacitance variation enables SNDM to measure the super-high-order (higher than 3rd) derivative of local capacitance-voltage (C-V) characteristics directly under the tip (dnC/dVn,n = 3, 4, ...). We demonstrate improvement of carrier density resolution by measurement of dnC/dVn,n = 1, 2, 3, 4 (super-higher-order method) in the cross-sectional observation of metal-oxide-semiconductor field-effect-transistor.

  3. An electrically detected magnetic resonance study of performance limiting defects in SiC metal oxide semiconductor field effect transistors

    NASA Astrophysics Data System (ADS)

    Cochrane, C. J.; Lenahan, P. M.; Lelis, A. J.

    2011-01-01

    In this study, we utilize electrically detected magnetic resonance (EDMR) techniques and electrical measurements to study defects in SiC based metal oxide semiconductor field effect transistors (MOSFETs). We compare results on a series of SiC MOSFETs prepared with significantly different processing parameters. The EDMR is detected through spin dependent recombination (SDR) in most cases. However, in some devices at a fairly high negative bias, the EDMR likely also involves spin dependent trap-assisted tunneling (SDT) between defects on both sides of the SiC/SiO2 interface. At least three different defects have been detected in the magnetic resonance measurements. The defects observed include two at the SiC/SiO2 interface or on the SiC side of the SiC/SiO2 interface: one is very likely a vacancy center with a distribution which extends into the bulk of the SiC and the other is likely a "dangling bond" defect. A third defect, located on the SiO2 side of the SiC/SiO2 interface, has a spectrum very similar to that previously reported for an oxygen deficient silicon coupled to a hydrogen atom. In nearly all cases, we observe a strong dominating single line EDMR spectrum with an isotropic g≈2.0027. In some samples, this strong central line is accompanied by two pairs of considerably weaker side peaks which we link to hyperfine interactions with nearby Si and C atoms. The pattern is physically reasonable for a silicon vacancy in SiC. We therefore tentatively assign it to a silicon vacancy or silicon vacancy associated defect in the SiC. In one set of devices with very high interface trap density we observe another dominating spectrum with g∥=2.0026 and g⊥=2.0010 with the symmetry axis coincident with the [0001] and nearly the SiC/SiO2 interface normal. We ascribe this EDMR spectrum to a "dangling bond" defect. A third EDMR spectrum shows up in some devices at a fairly large negative gate bias. The phase of this spectrum is quite consistently opposite to that of the

  4. Stress Characterization of 4H-SiC Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) using Raman Spectroscopy and the Finite Element Method.

    PubMed

    Yoshikawa, Masanobu; Kosaka, Kenichi; Seki, Hirohumi; Kimoto, Tsunenobu

    2016-07-01

    We measured the depolarized and polarized Raman spectra of a 4H-SiC metal-oxide-semiconductor field-effect transistor (MOSFET) and found that compressive stress of approximately 20 MPa occurs under the source and gate electrodes and tensile stress of approximately 10 MPa occurs between the source and gate electrodes. The experimental result was in close agreement with the result obtained by calculation using the finite element method (FEM). A combination of Raman spectroscopy and FEM provides much data on the stresses in 4H-SiC MOSFET.

  5. Measurement of conduction band deformation potential constants using gate direct tunneling current in n-type metal oxide semiconductor field effect transistors under mechanical stress

    NASA Astrophysics Data System (ADS)

    Lim, Ji-Song; Yang, Xiaodong; Nishida, Toshikazu; Thompson, Scott E.

    2006-08-01

    An experimental method to determine both the hydrostatic and shear deformation potential constants is introduced. The technique is based on the change in the gate tunneling currents of Si-metal oxide semiconductor field effect transistors (MOSFETs) under externally applied mechanical stress and has been applied to industrial n-type MOSFETs. The conduction band hydrostatic and shear deformation potential constants (Ξd and Ξu) are extracted to be 1.0±0.1 and 9.6±1.0eV, respectively, which is consistent with recent theoretical works.

  6. Stress Characterization of 4H-SiC Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) using Raman Spectroscopy and the Finite Element Method.

    PubMed

    Yoshikawa, Masanobu; Kosaka, Kenichi; Seki, Hirohumi; Kimoto, Tsunenobu

    2016-07-01

    We measured the depolarized and polarized Raman spectra of a 4H-SiC metal-oxide-semiconductor field-effect transistor (MOSFET) and found that compressive stress of approximately 20 MPa occurs under the source and gate electrodes and tensile stress of approximately 10 MPa occurs between the source and gate electrodes. The experimental result was in close agreement with the result obtained by calculation using the finite element method (FEM). A combination of Raman spectroscopy and FEM provides much data on the stresses in 4H-SiC MOSFET. PMID:27165155

  7. Ballistic performance comparison of monolayer transition metal dichalcogenide MX2 (M = Mo, W; X = S, Se, Te) metal-oxide-semiconductor field effect transistors

    NASA Astrophysics Data System (ADS)

    Chang, Jiwon; Register, Leonard F.; Banerjee, Sanjay K.

    2014-02-01

    We study the transport properties of monolayer MX2 (M = Mo, W; X = S, Se, Te) n- and p-channel metal-oxide-semiconductor field effect transistors (MOSFETs) using full-band ballistic non-equilibrium Green's function simulations with an atomistic tight-binding Hamiltonian with hopping potentials obtained from density functional theory. We discuss the subthreshold slope, drain-induced barrier lowering (DIBL), as well as gate-induced drain leakage (GIDL) for different monolayer MX2 MOSFETs. We also report the possibility of negative differential resistance behavior in the output characteristics of nanoscale monolayer MX2 MOSFETs.

  8. Spin-dependent transport properties of a GaMnAs-based vertical spin metal-oxide-semiconductor field-effect transistor structure

    SciTech Connect

    Kanaki, Toshiki Asahara, Hirokatsu; Ohya, Shinobu Tanaka, Masaaki

    2015-12-14

    We fabricate a vertical spin metal-oxide-semiconductor field-effect transistor (spin-MOSFET) structure, which is composed of an epitaxial single-crystal heterostructure with a ferromagnetic-semiconductor GaMnAs source/drain, and investigate its spin-dependent transport properties. We modulate the drain-source current I{sub DS} by ∼±0.5% with a gate-source voltage of ±10.8 V and also modulate I{sub DS} by up to 60% with changing the magnetization configuration of the GaMnAs source/drain at 3.5 K. The magnetoresistance ratio is more than two orders of magnitude higher than that obtained in the previous studies on spin MOSFETs. Our result shows that a vertical structure is one of the hopeful candidates for spin MOSFET when the device size is reduced to a sub-micron or nanometer scale.

  9. GaN metal-oxide-semiconductor field-effect transistors on AlGaN/GaN heterostructure with recessed gate

    NASA Astrophysics Data System (ADS)

    Wang, Qingpeng; Ao, Jin-Ping; Wang, Pangpang; Jiang, Ying; Li, Liuan; Kawaharada, Kazuya; Liu, Yang

    2015-04-01

    GaN metal-oxide-semiconductor field-effect transistors (MOSFETs) on AlGaN/GaN heterostructure with a recess gate were fabricated and characterized. The device showed good pinch-off characteristics and a maximum field-effect mobility of 145.2 cm2·V-1·s-1. The effects of etching gas of Cl2 and SiCl4 were investigated in the gate recess process. SiCl4-etched devices showed higher channel mobility and lower threshold voltage. Atomic force microscope measurement was done to investigate the etching profile with different etching protection mask. Compared with photoresist, SiO2-masked sample showed lower surface roughness and better profile with stepper sidewall and weaker trenching effect resulting in higher channel mobility in the MOSFET.

  10. Explicit Compact Surface-Potential and Drain-Current Models for Generic Asymmetric Double-Gate Metal-Oxide-Semiconductor Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Zhu, Zhaomin; Zhou, Xing; Chandrasekaran, Karthik; Rustagi, Subhash C.; See, Guan Huei

    2007-04-01

    In this paper, explicit surface potentials for undoped asymmetric-double-gate (a-DG) metal-oxide-semiconductor field-effect transistors (MOSFETs) suitable for compact model development are presented for the first time. The model is physically derived from Poisson’s equation in each region of operation and adopted in a unified regional approach. The proposed model is physically scalable with oxide/channel thicknesses and has been verified with generic implicit solutions for independent gate biases as well as for different gate/oxide materials. The model is extendable to silicon-on-insulator (SOI) and symmetric-DG (s-DG) MOSFETs. Finally, a continuous, explicit drain-current equation has been derived on the basis of the developed explicit surface-potential solutions.

  11. Trap state passivation improved hot-carrier instability by zirconium-doping in hafnium oxide in a nanoscale n-metal-oxide semiconductor-field effect transistors with high-k/metal gate

    NASA Astrophysics Data System (ADS)

    Liu, Hsi-Wen; Chang, Ting-Chang; Tsai, Jyun-Yu; Chen, Ching-En; Liu, Kuan-Ju; Lu, Ying-Hsin; Lin, Chien-Yu; Tseng, Tseung-Yuen; Cheng, Osbert; Huang, Cheng-Tung; Ye, Yi-Han

    2016-04-01

    This work investigates the effect on hot carrier degradation (HCD) of doping zirconium into the hafnium oxide high-k layer in the nanoscale high-k/metal gate n-channel metal-oxide-semiconductor field-effect-transistors. Previous n-metal-oxide semiconductor-field effect transistor studies demonstrated that zirconium-doped hafnium oxide reduces charge trapping and improves positive bias temperature instability. In this work, a clear reduction in HCD is observed with zirconium-doped hafnium oxide because channel hot electron (CHE) trapping in pre-existing high-k bulk defects is the main degradation mechanism. However, this reduced HCD became ineffective at ultra-low temperature, since CHE traps in the deeper bulk defects at ultra-low temperature, while zirconium-doping only passivates shallow bulk defects.

  12. Polymer/metal oxide hybrid dielectrics for low voltage field-effect transistors with solution-processed, high-mobility semiconductors

    SciTech Connect

    Held, Martin; Schießl, Stefan P.; Gannott, Florentina; Miehler, Dominik; Zaumseil, Jana

    2015-08-24

    Transistors for future flexible organic light-emitting diode (OLED) display backplanes should operate at low voltages and be able to sustain high currents over long times without degradation. Hence, high capacitance dielectrics with low surface trap densities are required that are compatible with solution-processable high-mobility semiconductors. Here, we combine poly(methyl methacrylate) (PMMA) and atomic layer deposition hafnium oxide (HfO{sub x}) into a bilayer hybrid dielectric for field-effect transistors with a donor-acceptor polymer (DPPT-TT) or single-walled carbon nanotubes (SWNTs) as the semiconductor and demonstrate substantially improved device performances for both. The ultra-thin PMMA layer ensures a low density of trap states at the semiconductor-dielectric interface while the metal oxide layer provides high capacitance, low gate leakage and superior barrier properties. Transistors with these thin (≤70 nm), high capacitance (100–300 nF/cm{sup 2}) hybrid dielectrics enable low operating voltages (<5 V), balanced charge carrier mobilities and low threshold voltages. Moreover, the hybrid layers substantially improve the bias stress stability of the transistors compared to those with pure PMMA and HfO{sub x} dielectrics.

  13. Improved Performance of 4H-SiC Double Reduced Surface Field Metal-Oxide-Semiconductor Field-Effect Transistors by Increasing RESURF Doses

    NASA Astrophysics Data System (ADS)

    Noborio, Masato; Suda, Jun; Kimoto, Tsunenobu

    2008-10-01

    For further improvement of lateral power devices, 4H-SiC double reduced surface field (RESURF) metal-oxide-semiconductor field-effect transistors (MOSFETs) with high doses in RESURF region have been fabricated and characterized. The drift resistance was decreased and the breakdown voltage was increased with increasing RESURF doses, although breakdown occurs in the oxide when the RESURF doses are too high. The increase of drift resistance in double RESURF MOSFETs at elevated temperature was smaller than that in single RESURF MOSFETs, due to the higher doping concentration in the RESURF region. The fabricated 4H-SiC(0001) double RESURF MOSFETs exhibited a breakdown voltage (VB) of 1540 V and an on-resistance (RON) of 55 mΩ cm2. The figure-of-merit (VB2/RON) of the fabricated device is 43 MW/cm2, which is the highest value compared with those reported in lateral MOSFETs.

  14. The empirical dependence of radiation-induced charge neutralization on negative bias in dosimeters based on the metal-oxide-semiconductor field-effect transistor

    SciTech Connect

    Benson, Chris; Albadri, Abdulrahman; Joyce, Malcolm J.; Price, Robert A.

    2006-08-15

    The dependence of radiation-induced charge neutralization (RICN) has been studied in metal-oxide-semiconductor field-effect transistor (MOSFET) dosimeters. These devices were first exposed to x rays under positive bias and then to further dose increments at a selection of reverse bias levels. A nonlinear empirical trend has been established that is consistent with that identified in the data obtained in this work. Estimates for the reverse bias level corresponding to the maximum rate of RICN have been extracted from the data. These optimum bias levels appear to be independent of the level of initial absorbed dose under positive bias. The established models for threshold voltage change have been considered and indicate a related nonlinear trend for neutralization cross section {sigma}{sub N} as a function of oxide field. These data are discussed in the context of dose measurement with MOSFETs and within the framework of statistical mechanics associated with neutral traps and their field dependence.

  15. Evaluation of a gate-first process for AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors with low ohmic annealing temperature

    NASA Astrophysics Data System (ADS)

    Liuan, Li; Jiaqi, Zhang; Yang, Liu; Jin-Ping, Ao

    2016-03-01

    In this paper, TiN/AlOx gated AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOS-HFETs) were fabricated for gate-first process evaluation. By employing a low temperature ohmic process, ohmic contact can be obtained by annealing at 600 °C with the contact resistance approximately 1.6 Ω·mm. The ohmic annealing process also acts as a post-deposition annealing on the oxide film, resulting in good device performance. Those results demonstrated that the TiN/AlOx gated MOS-HFETs with low temperature ohmic process can be applied for self-aligned gate AlGaN/GaN MOS-HFETs. Project supported by the International Science and Technology Collaboration Program of China (Grant No. 2012DFG52260).

  16. INTERDISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY: Quantum-Mechanical Study on Surrounding-Gate Metal-Oxide-Semiconductor Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Hu, Guang-Xi; Wang, Ling-Li; Liu, Ran; Tang, Ting-Ao; Qiu, Zhi-Jun

    2010-10-01

    As the channel length of metal-oxide-semiconductor field-effect transistors (MOSFETs) scales into the nanometer regime, quantum mechanical effects are becoming more and more significant. In this work, a model for the surrounding-gate (SG) nMOSFET is developed. The Schrödinger equation is solved analytically. Some of the solutions are verified via results obtained from simulations. It is found that the percentage of the electrons with lighter conductivity mass increases as the silicon body radius decreases, or as the gate voltage reduces, or as the temperature decreases. The centroid of inversion-layer is driven away from the silicon-oxide interface towards the silicon body, therefore the carriers will suffer less scattering from the interface and the electrons effective mobility of the SG nMOSFETs will be enhanced.

  17. HfO2-based InP n-channel metal-oxide-semiconductor field-effect transistors and metal-oxide-semiconductor capacitors using a germanium interfacial passivation layer

    NASA Astrophysics Data System (ADS)

    Kim, Hyoung-Sub; Ok, I.; Zhang, M.; Zhu, F.; Park, S.; Yum, J.; Zhao, H.; Lee, Jack C.; Majhi, Prashant

    2008-09-01

    In this letter, we present our experimental results of HfO2-based n-channel metal-oxide-semiconductor field-effect transistors (MOSFETs) and metal-oxide-semiconductor capacitors (MOSCAPs) on indium phosphide (InP) substrates using a thin germanium (Ge) interfacial passivation layer (IPL). We found that MOSCAPs on n-InP substrates showed good C-V characteristics such as a small capacitance equivalent thickness (14Å ), a small frequency dispersion (<10% and <200mV), and a low dielectric leakage current (˜5×10-4A/cm2 at Vg=1.5V), whereas MOSCAPs on p-InP exhibited poor characteristics, implying severe Fermi level pinning. It was also found that InP was more vulnerable to a high temperature process such that C-V curves showed a characteristic "bump" and inversion capacitance at relatively high frequencies. From n-channel MOSFETs on a semi-insulating InP substrate using Ge IPL, HfO2, and TaN gate electrodes, excellent electrical characteristics such as a large transconductance (9.3mS /mm) and large drain currents (12.3mA/mm at Vd=2V and Vg=Vth+2V) were achieved, which are comparable to other works.

  18. Fabrication and characterization of the normally-off N-channel lateral 4H-SiC metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Qing-Wen, Song; Xiao-Yan, Tang; Yan-Jing, He; Guan-Nan, Tang; Yue-Hu, Wang; Yi-Meng, Zhang; Hui, Guo; Ren-Xu, Jia; Hong-Liang, Lv; Yi-Men, Zhang; Yu-Ming, Zhang

    2016-03-01

    In this paper, the normally-off N-channel lateral 4H-SiC metal-oxide-semiconductor field-effect transistors (MOSFFETs) have been fabricated and characterized. A sandwich- (nitridation-oxidation-nitridation) type process was used to grow the gate dielectric film to obtain high channel mobility. The interface properties of 4H-SiC/SiO2 were examined by the measurement of HF I-V, G-V, and C-V over a range of frequencies. The ideal C-V curve with little hysteresis and the frequency dispersion were observed. As a result, the interface state density near the conduction band edge of 4H-SiC was reduced to 2 × 1011 eV-1·cm-2, the breakdown field of the grown oxides was about 9.8 MV/cm, the median peak field-effect mobility is about 32.5 cm2·V-1·s-1, and the maximum peak field-effect mobility of 38 cm2·V-1·s-1 was achieved in fabricated lateral 4H-SiC MOSFFETs. Projcet supported by the National Natural Science Foundation of China (Grant Nos. 61404098, 61176070, and 61274079), the Doctoral Fund of Ministry of Education of China (Grant Nos. 20110203110010 and 20130203120017), the National Key Basic Research Program of China (Grant No. 2015CB759600), and the Key Specific Projects of Ministry of Education of China (Grant No. 625010101).

  19. Performance enhancement of multiple-gate ZnO metal-oxide-semiconductor field-effect transistors fabricated using self-aligned and laser interference photolithography techniques

    PubMed Central

    2014-01-01

    The simple self-aligned photolithography technique and laser interference photolithography technique were proposed and utilized to fabricate multiple-gate ZnO metal-oxide-semiconductor field-effect transistors (MOSFETs). Since the multiple-gate structure could improve the electrical field distribution along the ZnO channel, the performance of the ZnO MOSFETs could be enhanced. The performance of the multiple-gate ZnO MOSFETs was better than that of the conventional single-gate ZnO MOSFETs. The higher the drain-source saturation current (12.41 mA/mm), the higher the transconductance (5.35 mS/mm) and the lower the anomalous off-current (5.7 μA/mm) for the multiple-gate ZnO MOSFETs were obtained. PMID:24948884

  20. Interface trap density and mobility extraction in InGaAs buried quantum well metal-oxide-semiconductor field-effect-transistors by gated Hall method

    SciTech Connect

    Chidambaram, Thenappan; Madisetti, Shailesh; Greene, Andrew; Yakimov, Michael; Tokranov, Vadim; Oktyabrsky, Serge; Veksler, Dmitry; Hill, Richard

    2014-03-31

    In this work, we are using a gated Hall method for measurement of free carrier density and electron mobility in buried InGaAs quantum well metal-oxide-semiconductor field-effect-transistor channels. At room temperature, mobility over 8000 cm{sup 2}/Vs is observed at ∼1.4 × 10{sup 12} cm{sup −2}. Temperature dependence of the electron mobility gives the evidence that remote Coulomb scattering dominates at electron density <2 × 10{sup 11} cm{sup −2}. Spectrum of the interface/border traps is quantified from comparison of Hall data with capacitance-voltage measurements or electrostatic modeling. Above the threshold voltage, gate control is strongly limited by fast traps that cannot be distinguished from free channel carriers just by capacitance-based methods and can be the reason for significant overestimation of channel density and underestimation of carrier mobility from transistor measurements.

  1. High-gain complementary metal-oxide-semiconductor inverter based on multi-layer WSe2 field effect transistors without doping

    NASA Astrophysics Data System (ADS)

    Kang, Won-Mook; Cho, In-Tak; Roh, Jeongkyun; Lee, Changhee; Lee, Jong-Ho

    2016-10-01

    A high-gain complementary metal-oxide-semiconductor (CMOS) logic inverter was implemented by fabricating p- and n-type field effect transistors (FETs) based on multi-layer WSe2 on the same wafer. Au as a high work-function metal is contacted to WSe2 for the source/drain of the p-type FET. The n-type FET has an Al electrode contacted to WSe2 for the source/drain. Both FETs were designed to have similar on-current densities (>10-7 A μm-1) and high on/off current ratios (>106). The inverter shows excellent switching characteristics including relatively high voltage gains (>25) and high noise margins (>0.9) in the range of supply voltage from 2 V to 8 V. This work has a great significance in the realization of a CMOS logic gate based on WSe2 without an additional doping scheme.

  2. Analysis of Channel Stress Induced by NiPt-Silicide in Metal-Oxide-Semiconductor Field-Effect Transistor and Its Generation Mechanism

    NASA Astrophysics Data System (ADS)

    Mizuo, Mariko; Yamaguchi, Tadashi; Kudo, Shuichi; Hirose, Yukinori; Kimura, Hiroshi; Tsuchimoto, Jun-ichi; Hattori, Nobuyoshi

    2013-09-01

    Channel stress induced by NiPt-silicide films in metal-oxide-semiconductor field-effect transistors (MOSFETs) was demonstrated using UV-Raman spectroscopy, and its generation mechanism was revealed. It was possible to accurately measure the channel stress with the Raman test structure. The channel stress depends on the source/drain doping type and the second silicide annealing method. In order to discuss the channel stress generation mechanism, NiPt-silicide microstructure analyses were performed using X-ray diffraction analysis and scanning transmission electron microscopy. The channel stress generation mechanism can be elucidated by the following two factors: the change in the NiSi lattice spacing, which depends on the annealing temperature, and the NiSi crystal orientation. The analyses of these factors are important for controlling channel stress in stress engineering for high-performance transistors.

  3. Performance enhancement of multiple-gate ZnO metal-oxide-semiconductor field-effect transistors fabricated using self-aligned and laser interference photolithography techniques.

    PubMed

    Lee, Hsin-Ying; Huang, Hung-Lin; Tseng, Chun-Yen

    2014-01-01

    The simple self-aligned photolithography technique and laser interference photolithography technique were proposed and utilized to fabricate multiple-gate ZnO metal-oxide-semiconductor field-effect transistors (MOSFETs). Since the multiple-gate structure could improve the electrical field distribution along the ZnO channel, the performance of the ZnO MOSFETs could be enhanced. The performance of the multiple-gate ZnO MOSFETs was better than that of the conventional single-gate ZnO MOSFETs. The higher the drain-source saturation current (12.41 mA/mm), the higher the transconductance (5.35 mS/mm) and the lower the anomalous off-current (5.7 μA/mm) for the multiple-gate ZnO MOSFETs were obtained.

  4. P-Channel InGaN/GaN heterostructure metal-oxide-semiconductor field effect transistor based on polarization-induced two-dimensional hole gas.

    PubMed

    Zhang, Kexiong; Sumiya, Masatomo; Liao, Meiyong; Koide, Yasuo; Sang, Liwen

    2016-01-01

    The concept of p-channel InGaN/GaN heterostructure field effect transistor (FET) using a two-dimensional hole gas (2DHG) induced by polarization effect is demonstrated. The existence of 2DHG near the lower interface of InGaN/GaN heterostructure is verified by theoretical simulation and capacitance-voltage profiling. The metal-oxide-semiconductor FET (MOSFET) with Al2O3 gate dielectric shows a drain-source current density of 0.51 mA/mm at the gate voltage of -2 V and drain bias of -15 V, an ON/OFF ratio of two orders of magnitude and effective hole mobility of 10 cm(2)/Vs at room temperature. The normal operation of MOSFET without freeze-out at 8 K further proves that the p-channel behavior is originated from the polarization-induced 2DHG. PMID:27021054

  5. P-Channel InGaN/GaN heterostructure metal-oxide-semiconductor field effect transistor based on polarization-induced two-dimensional hole gas

    NASA Astrophysics Data System (ADS)

    Zhang, Kexiong; Sumiya, Masatomo; Liao, Meiyong; Koide, Yasuo; Sang, Liwen

    2016-03-01

    The concept of p-channel InGaN/GaN heterostructure field effect transistor (FET) using a two-dimensional hole gas (2DHG) induced by polarization effect is demonstrated. The existence of 2DHG near the lower interface of InGaN/GaN heterostructure is verified by theoretical simulation and capacitance-voltage profiling. The metal-oxide-semiconductor FET (MOSFET) with Al2O3 gate dielectric shows a drain-source current density of 0.51 mA/mm at the gate voltage of ‑2 V and drain bias of ‑15 V, an ON/OFF ratio of two orders of magnitude and effective hole mobility of 10 cm2/Vs at room temperature. The normal operation of MOSFET without freeze-out at 8 K further proves that the p-channel behavior is originated from the polarization-induced 2DHG.

  6. Multi-frequency inversion-charge pumping for charge separation and mobility analysis in high-k/InGaAs metal-oxide-semiconductor field-effect transistors

    SciTech Connect

    Djara, V.; Cherkaoui, K.; Negara, M. A.; Hurley, P. K.

    2015-11-28

    An alternative multi-frequency inversion-charge pumping (MFICP) technique was developed to directly separate the inversion charge density (N{sub inv}) from the trapped charge density in high-k/InGaAs metal-oxide-semiconductor field-effect transistors (MOSFETs). This approach relies on the fitting of the frequency response of border traps, obtained from inversion-charge pumping measurements performed over a wide range of frequencies at room temperature on a single MOSFET, using a modified charge trapping model. The obtained model yielded the capture time constant and density of border traps located at energy levels aligned with the InGaAs conduction band. Moreover, the combination of MFICP and pulsed I{sub d}-V{sub g} measurements enabled an accurate effective mobility vs N{sub inv} extraction and analysis. The data obtained using the MFICP approach are consistent with the most recent reports on high-k/InGaAs.

  7. Mobility enhancement of strained GaSb p-channel metal-oxide-semiconductor field-effect transistors with biaxial compressive strain

    NASA Astrophysics Data System (ADS)

    Yan-Wen, Chen; Zhen, Tan; Lian-Feng, Zhao; Jing, Wang; Yi-Zhou, Liu; Chen, Si; Fang, Yuan; Wen-Hui, Duan; Jun, Xu

    2016-03-01

    Various biaxial compressive strained GaSb p-channel metal-oxide-semiconductor field-effect transistors (MOSFETs) are experimentally and theoretically investigated. The biaxial compressive strained GaSb MOSFETs show a high peak mobility of 638 cm2/V·s, which is 3.86 times of the extracted mobility of the fabricated GaSb MOSFETs without strain. Meanwhile, first principles calculations show that the hole effective mass of GaSb depends on the biaxial compressive strain. The biaxial compressive strain brings a remarkable enhancement of the hole mobility caused by a significant reduction in the hole effective mass due to the modulation of the valence bands. Project supported by the National Basic Research Program of China (Grant No. 2011CBA00602) and the National Science and Technology Major Project of the Ministry of Science and Technology of China (Grant No. 2011ZX02708-002).

  8. Origin of the performances degradation of two-dimensional-based metal-oxide-semiconductor field effect transistors in the sub-10 nm regime: A first-principles study

    NASA Astrophysics Data System (ADS)

    Lu, Anh Khoa Augustin; Pourtois, Geoffrey; Agarwal, Tarun; Afzalian, Aryan; Radu, Iuliana P.; Houssa, Michel

    2016-01-01

    The impact of the scaling of the channel length on the performances of metal-oxide-semiconductor field effect transistors, based on two-dimensional (2D) channel materials, is theoretically investigated, using density functional theory combined with the non-equilibrium Green's function method. It is found that the scaling of the channel length below 10 nm leads to strong device performance degradations. Our simulations reveal that this degradation is essentially due to the tunneling current flowing between the source and the drain in these aggressively scaled devices. It is shown that this electron tunneling process is modulated by the effective mass of the 2D channel material, and sets the limit of the scaling in future transistor designs.

  9. Room-temperature detection of spin accumulation in silicon across Schottky tunnel barriers using a metal-oxide-semiconductor field effect transistor structure (invited)

    NASA Astrophysics Data System (ADS)

    Hamaya, K.; Ando, Y.; Masaki, K.; Maeda, Y.; Fujita, Y.; Yamada, S.; Sawano, K.; Miyao, M.

    2013-05-01

    Using a metal-oxide-semiconductor field effect transistor structure with a high-quality CoFe/n+-Si contact, we systematically study spin injection and spin accumulation in a nondegenerated Si channel with a doping density of ˜4.5 × 1015 cm-3 at room temperature. By applying the gate voltage (VG) to the channel, we obtain sufficient bias currents (IBias) for creating spin accumulation in the channel and observe clear spin-accumulation signals even at room temperature. Whereas the magnitude of the spin signals is enhanced by increasing IBias, it is reduced by increasing VG interestingly. These features can be understood within the framework of the conventional spin diffusion model. As a result, a room-temperature spin injection technique for the nondegenerated Si channel without using insulating tunnel barriers is established, which indicates a technological progress for Si-based spintronic applications with gate electrodes.

  10. Band-to-band tunneling in a carbon nanotube metal-oxide-semiconductor field-effect transistor is dominated by phonon-assisted tunneling.

    PubMed

    Koswatta, Siyuranga O; Lundstrom, Mark S; Nikonov, Dmitri E

    2007-05-01

    Band-to-band tunneling (BTBT) devices have recently gained a lot of interest due to their potential for reducing power dissipation in integrated circuits. We have performed extensive simulations for the BTBT operation of carbon nanotube metal-oxide-semiconductor field-effect transistors (CNT-MOSFETs) using the nonequilibrium Green's function formalism for both ballistic and dissipative quantum transport. In comparison with recently reported experimental data (J. Am. Chem. Soc. 2006, 128, 3518-3519), we have obtained strong evidence that BTBT in CNT-MOSFETs is dominated by optical phonon assisted inelastic transport, which can have important implications on the transistor characteristics. It is shown that, under large biasing conditions, two-phonon scattering may also become important. PMID:17388638

  11. Homostructured ZnO-based metal-oxide-semiconductor field-effect transistors deposited at low temperature by vapor cooling condensation system

    NASA Astrophysics Data System (ADS)

    Lin, Tzu-Shun; Lee, Ching-Ting

    2015-11-01

    The vapor cooling condensation system was designed and used to deposit homostructured ZnO-based metal-oxide-semiconductor field-effect transistors (MOSFETs) on sapphire substrates. Owing to the high quality of the deposited, various ZnO films and interfaces, the resulting MOSFETs manifested attractive characteristics, such as the low gate leakage current of 24 nA, the low average interface state density of 2.92 × 1011 cm-2 eV-1, and the complete pinch-off performance. The saturation drain-source current, the maximum transconductance, and the gate voltage swing of the resulting homostructured ZnO-based MOSFETs were 5.64 mA/mm, 1.31 mS/mm, and 3.2 V, respectively.

  12. Schrödinger equation Monte Carlo in three dimensions for simulation of carrier transport in three-dimensional nanoscale metal oxide semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Liu, Keng-Ming; Chen, Wanqiang; Register, Leonard F.; Banerjee, Sanjay K.

    2008-12-01

    A quantum transport simulator, Schrödinger equation Monte Carlo (SEMC) in three dimensions, is presented that provides a rigorous yet reasonably computationally efficient quantum mechanical treatment of real scattering processes within quantum transport simulations of nanoscale three-dimensional (3D) metal oxide semiconductor field-effect transistor (MOSFET) geometries such as quantum wire and multigate field-effect transistors. This work represents an extension of earlier versions of SEMC for simulating quantum transport and scattering in systems with relatively simpler quasi-one-dimensional and quasi-two-dimensional geometries such as quantum-cascade lasers (via SEMC in one dimension) and silicon-on-insulator or dual-gate MOSFETs (via SEMC in two dimensions), respectively. However, the limiting computational considerations can be significantly different. The SEMC approach represents a variation in nonequilibrium Green's function techniques with scattering as well as carrier injection into the simulation region treated via Monte Carlo techniques. Scattering mechanisms include intravalley and intervalley scatterings, intrasubband and intersubband scatterings via acoustic and optical phonons, and, in the former case, surface roughness scattering. SEMC-3D simulations of a silicon omega-gate nanoscale n-channel MOSFET are provided to illustrate the modeling technique as well as the complexity of scattering effects in such nanoscale devices.

  13. Microwave assisted synthesis and characterisation of a zinc oxide/tobacco mosaic virus hybrid material. An active hybrid semiconductor in a field-effect transistor device.

    PubMed

    Sanctis, Shawn; Hoffmann, Rudolf C; Eiben, Sabine; Schneider, Jörg J

    2015-01-01

    Tobacco mosaic virus (TMV) has been employed as a robust functional template for the fabrication of a TMV/zinc oxide field effect transistor (FET). A microwave based approach, under mild conditions was employed to synthesize stable zinc oxide (ZnO) nanoparticles, employing a molecular precursor. Insightful studies of the decomposition of the precursor were done using NMR spectroscopy and material characterization of the hybrid material derived from the decomposition was achieved using dynamic light scattering (DLS), transmission electron microscopy (TEM), grazing incidence X-ray diffractometry (GI-XRD) and atomic force microscopy (AFM). TEM and DLS data confirm the formation of crystalline ZnO nanoparticles tethered on top of the virus template. GI-XRD investigations exhibit an orientated nature of the deposited ZnO film along the c-axis. FET devices fabricated using the zinc oxide mineralized virus template material demonstrates an operational transistor performance which was achieved without any high-temperature post-processing steps. Moreover, a further improvement in FET performance was observed by adjusting an optimal layer thickness of the deposited ZnO on top of the TMV. Such a bio-inorganic nanocomposite semiconductor material accessible using a mild and straightforward microwave processing technique could open up new future avenues within the field of bio-electronics.

  14. A New Two-Dimensional Analytical Model for Short-Channel Symmetrical Dual-Material Double-Gate Metal-Oxide-Semiconductor Field Effect Transistors

    NASA Astrophysics Data System (ADS)

    Chiang, Te-Kuang; Chen, Mei-Li

    2007-06-01

    Based on resultant solution of a two-dimensional (2D) Poisson’s equation in the silicon region, a new analytical model for short-channel fully depleted, symmetrical dual-material double-gate (SDMDG) metal-oxide-semiconductor field effect transistors (MOSFETs) has been developed. The SDMDG MOSFET exhibits significantly reduced short-channel effects (SCEs) when compared with the symmetrical double-gate (SDG) MOSFET due to the step potential profile at the interface between different gate materials. It is found that the threshold voltage roll-off can be effectively reduced using both the thin Si film and thin gate oxide. A considerable portion of the large workfunction of metal gate 1 (M1) when laterally merged with the small workfunction of metal gate 2 (M2) can efficiently suppress drain-induced barrier lowering (DIBL) and maintain the low threshold voltage degradation. In this work, not only a precise 2D analytical model of the surface potential and threshold voltage is presented, but also the minimum surface potential in M1 of the shorter channel device that brings about subthreshold swing degradation for the SDMDG MOSFET is discussed. The new model is verified to be in good agreement with numerical simulation results over a wide range of device parameters.

  15. Negative differential transconductance in silicon quantum well metal-oxide-semiconductor field effect/bipolar hybrid transistors

    NASA Astrophysics Data System (ADS)

    Naquin, Clint; Lee, Mark; Edwards, Hal; Mathur, Guru; Chatterjee, Tathagata; Maggio, Ken

    2014-11-01

    Introducing explicit quantum transport into Si transistors in a manner amenable to industrial fabrication has proven challenging. Hybrid field-effect/bipolar Si transistors fabricated on an industrial 45 nm process line are shown to demonstrate explicit quantum transport signatures. These transistors incorporate a lateral ion implantation-defined quantum well (QW) whose potential depth is controlled by a gate voltage (VG). Quantum transport in the form of negative differential transconductance (NDTC) is observed to temperatures >200 K. The NDTC is tied to a non-monotonic dependence of bipolar current gain on VG that reduces drain-source current through the QW. These devices establish the feasibility of exploiting quantum transport to transform the performance horizons of Si devices fabricated in an industrially scalable manner.

  16. Negative differential transconductance in silicon quantum well metal-oxide-semiconductor field effect/bipolar hybrid transistors

    SciTech Connect

    Naquin, Clint; Lee, Mark; Edwards, Hal; Mathur, Guru; Chatterjee, Tathagata; Maggio, Ken

    2014-11-24

    Introducing explicit quantum transport into Si transistors in a manner amenable to industrial fabrication has proven challenging. Hybrid field-effect/bipolar Si transistors fabricated on an industrial 45 nm process line are shown to demonstrate explicit quantum transport signatures. These transistors incorporate a lateral ion implantation-defined quantum well (QW) whose potential depth is controlled by a gate voltage (V{sub G}). Quantum transport in the form of negative differential transconductance (NDTC) is observed to temperatures >200 K. The NDTC is tied to a non-monotonic dependence of bipolar current gain on V{sub G} that reduces drain-source current through the QW. These devices establish the feasibility of exploiting quantum transport to transform the performance horizons of Si devices fabricated in an industrially scalable manner.

  17. Ge0.83Sn0.17 p-channel metal-oxide-semiconductor field-effect transistors: Impact of sulfur passivation on gate stack quality

    NASA Astrophysics Data System (ADS)

    Lei, Dian; Wang, Wei; Zhang, Zheng; Pan, Jisheng; Gong, Xiao; Liang, Gengchiau; Tok, Eng-Soon; Yeo, Yee-Chia

    2016-01-01

    The effect of room temperature sulfur passivation of the surface of Ge0.83Sn0.17 prior to high-k dielectric (HfO2) deposition is investigated. X-ray photoelectron spectroscopy (XPS) was used to examine the chemical bonding at the interface of HfO2 and Ge0.83Sn0.17. Sulfur passivation is found to be effective in suppressing the formation of both Ge oxides and Sn oxides. A comparison of XPS results for sulfur-passivated and non-passivated Ge0.83Sn0.17 samples shows that sulfur passivation of the GeSn surface could also suppress the surface segregation of Sn atoms. In addition, sulfur passivation reduces the interface trap density Dit at the high-k dielectric/Ge0.83Sn0.17 interface from the valence band edge to the midgap of Ge0.83Sn0.17, as compared with a non-passivated control. The impact of the improved Dit is demonstrated in Ge0.83Sn0.17 p-channel metal-oxide-semiconductor field-effect transistors (p-MOSFETs). Ge0.83Sn0.17 p-MOSFETs with sulfur passivation show improved subthreshold swing S, intrinsic transconductance Gm,int, and effective hole mobility μeff as compared with the non-passivated control. At a high inversion carrier density Ninv of 1 × 1013 cm-2, sulfur passivation increases μeff by 25% in Ge0.83Sn0.17 p-MOSFETs.

  18. Modeling of anisotropic two-dimensional materials monolayer HfS{sub 2} and phosphorene metal-oxide semiconductor field effect transistors

    SciTech Connect

    Chang, Jiwon

    2015-06-07

    Ballistic transport characteristics of metal-oxide semiconductor field effect transistors (MOSFETs) based on anisotropic two-dimensional materials monolayer HfS{sub 2} and phosphorene are explored through quantum transport simulations. We focus on the effects of the channel crystal orientation and the channel length scaling on device performances. Especially, the role of degenerate conduction band (CB) valleys in monolayer HfS{sub 2} is comprehensively analyzed. Benchmarking monolayer HfS{sub 2} with phosphorene MOSFETs, we predict that the effect of channel orientation on device performances is much weaker in monolayer HfS{sub 2} than in phosphorene due to the degenerate CB valleys of monolayer HfS{sub 2}. Our simulations also reveal that at 10 nm channel length scale, phosphorene MOSFETs outperform monolayer HfS{sub 2} MOSFETs in terms of the on-state current. However, it is observed that monolayer HfS{sub 2} MOSFETs may offer comparable, but a little bit degraded, device performances as compared with phosphorene MOSFETs at 5 nm channel length.

  19. Thin film three-dimensional topological insulator metal-oxide-semiconductor field-effect-transistors: A candidate for sub-10 nm devices

    SciTech Connect

    Akhavan, N. D. Jolley, G.; Umana-Membreno, G. A.; Antoszewski, J.; Faraone, L.

    2014-08-28

    Three-dimensional (3D) topological insulators (TI) are a new state of quantum matter in which surface states reside in the bulk insulating energy bandgap and are protected by time-reversal symmetry. It is possible to create an energy bandgap as a consequence of the interaction between the conduction band and valence band surface states from the opposite surfaces of a TI thin film, and the width of the bandgap can be controlled by the thin film thickness. The formation of an energy bandgap raises the possibility of thin-film TI-based metal-oxide-semiconductor field-effect-transistors (MOSFETs). In this paper, we explore the performance of MOSFETs based on thin film 3D-TI structures by employing quantum ballistic transport simulations using the effective continuous Hamiltonian with fitting parameters extracted from ab-initio calculations. We demonstrate that thin film transistors based on a 3D-TI structure provide similar electrical characteristics compared to a Si-MOSFET for gate lengths down to 10 nm. Thus, such a device can be a potential candidate to replace Si-based MOSFETs in the sub-10 nm regime.

  20. Characterization of high-sensitivity metal oxide semiconductor field effect transistor dosimeters system and LiF:Mg,Cu,P thermoluminescence dosimeters for use in diagnostic radiology.

    PubMed

    Dong, S L; Chu, T C; Lan, G Y; Wu, T H; Lin, Y C; Lee, J S

    2002-12-01

    Monitoring radiation exposure during diagnostic radiographic procedures has recently become an area of interest. In recent years, the LiF:Mg,Cu,P thermoluminescence dosimeter (TLD-100H) and the highly sensitive metal oxide semiconductor field effect transistor (MOSFET) dosimeter were introduced as good candidates for entrance skin dose measurements in diagnostic radiology. In the present study, the TLD-100H and the MOSFET dosimeters were evaluated for sensitivity, linearity, energy, angular dependence, and post-exposure response. Our results indicate that the TLD-100H dosimeter has excellent linearity within diagnostic energy ranges and its sensitivity variations were under 3% at tube potentials from 40Vp to 125kVp. Good linearity was also observed with the MOSFET dosimeter, but in low-dose regions the values are less reliable and were found to be a function of the tube potentials. Both dosimeters also presented predictable angular dependence in this study. Our findings suggest that the TLD-100H dosimeter is more appropriate for low-dose diagnostic procedures such as chest and skull projections. The MOSFET dosimeter system is valuable for entrance skin dose measurement with lumbar spine projections and certain fluoroscopic procedures.

  1. Lg = 60 nm recessed In0.7Ga0.3As metal-oxide-semiconductor field-effect transistors with Al2O3 insulator

    NASA Astrophysics Data System (ADS)

    Kim, D.-H.; del Alamo, J. A.; Antoniadis, D. A.; Li, J.; Kuo, J.-M.; Pinsukanjana, P.; Kao, Y.-C.; Chen, P.; Papavasiliou, A.; King, C.; Regan, E.; Urteaga, M.; Brar, B.; Kim, T.-W.

    2012-11-01

    In this Letter, we report on sub-100 nm recessed In0.7Ga0.3As metal-oxide-semiconductor field-effect transistors (MOSFETs) with outstanding logic and high-frequency performance. The device features ex-situ atomic-layer-deposition (ALD) 2-nm Al2O3 layer on a molecular-beam-epitaxy (MBE) 1-nm InP layer and is fabricated through a triple-recess process. An Lg = 60 nm MOSFET exhibits on-resistance (RON) = 220 Ω-μm, subthreshold-swing (S) = 110 mV/decade, and drain-induced-barrier-lowering (DIBL) = 200 mV/V at VDS = 0.5 V, together with enhancement-mode operation. More importantly, this device displays record maximum transconductance (gm_max) = 2000 μs/μm and current-gain cutoff frequency (fT) = 370 GHz at VDS = 0.5 V, in any III-V MOSFET technology.

  2. Structural Dependence of Source-and-Drain Series Resistance on Saturation Drain Current for Sub-20 nm Metal-Oxide-Semiconductor Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Yoon, JongChul; Hiroki, Akira; Kobayashi, Kazutoshi

    2013-07-01

    The structural dependence of series-resistance effects on the saturation current is investigated in sub-20 nm metal-oxide-semiconductor field-effect transistors (MOSFETs). For planer bulk, silicon-on-insulator (SOI), and multi gate (MG) MOSFETs, the reduction rate of the saturation current is calculated using an analytical current model in high-performance (HP), low-operating-power (LOP), and low-standby-power (LSTP) technologies. In HP technology, the reduction rates are 29.0, 25.3, and 22.1% for bulk, SOI, and MG MOSFETs, respectively. In LOP technology, the reduction rates are 23.8, 21.5, and 20.7% for bulk, SOI, and MG MOSFETs, respectively. In LSTP technology, the reduction rates are about 17% for all devices. In HP technology, the ratio of the series resistance to the channel resistance is the dominant factor for the reduction rate. In LOP technology, the ratio of the over drive voltage to the supply voltage is the dominant factor. In LSTP technology, both the resistance and voltage ratios are the dominant factors.

  3. Monolithic integration of a silicon nanowire field-effect transistors array on a complementary metal-oxide semiconductor chip for biochemical sensor applications.

    PubMed

    Livi, Paolo; Kwiat, Moria; Shadmani, Amir; Pevzner, Alexander; Navarra, Giulio; Rothe, Jörg; Stettler, Alexander; Chen, Yihui; Patolsky, Fernando; Hierlemann, Andreas

    2015-10-01

    We present a monolithic complementary metal-oxide semiconductor (CMOS)-based sensor system comprising an array of silicon nanowire field-effect transistors (FETs) and the signal-conditioning circuitry on the same chip. The silicon nanowires were fabricated by chemical vapor deposition methods and then transferred to the CMOS chip, where Ti/Pd/Ti contacts had been patterned via e-beam lithography. The on-chip circuitry measures the current flowing through each nanowire FET upon applying a constant source-drain voltage. The analog signal is digitized on chip and then transmitted to a receiving unit. The system has been successfully fabricated and tested by acquiring I-V curves of the bare nanowire-based FETs. Furthermore, the sensing capabilities of the complete system have been demonstrated by recording current changes upon nanowire exposure to solutions of different pHs, as well as by detecting different concentrations of Troponin T biomarkers (cTnT) through antibody-functionalized nanowire FETs.

  4. P-Channel InGaN/GaN heterostructure metal-oxide-semiconductor field effect transistor based on polarization-induced two-dimensional hole gas

    PubMed Central

    Zhang, Kexiong; Sumiya, Masatomo; Liao, Meiyong; Koide, Yasuo; Sang, Liwen

    2016-01-01

    The concept of p-channel InGaN/GaN heterostructure field effect transistor (FET) using a two-dimensional hole gas (2DHG) induced by polarization effect is demonstrated. The existence of 2DHG near the lower interface of InGaN/GaN heterostructure is verified by theoretical simulation and capacitance-voltage profiling. The metal-oxide-semiconductor FET (MOSFET) with Al2O3 gate dielectric shows a drain-source current density of 0.51 mA/mm at the gate voltage of −2 V and drain bias of −15 V, an ON/OFF ratio of two orders of magnitude and effective hole mobility of 10 cm2/Vs at room temperature. The normal operation of MOSFET without freeze-out at 8 K further proves that the p-channel behavior is originated from the polarization-induced 2DHG. PMID:27021054

  5. Radiofrequency current source (RFCS) drive and decoupling technique for parallel transmit arrays using a high-power metal oxide semiconductor field-effect transistor (MOSFET).

    PubMed

    Lee, Wonje; Boskamp, Eddy; Grist, Thomas; Kurpad, Krishna

    2009-07-01

    A radiofrequency current source (RFCS) design using a high-power metal oxide semiconductor field effect transistor (MOSFET) that enables independent current control for parallel transmit applications is presented. The design of an RFCS integrated with a series tuned transmitting loop and its associated control circuitry is described. The current source is operated in a gated class AB push-pull configuration for linear operation at high efficiency. The pulsed RF current amplitude driven into the low impedance transmitting loop was found to be relatively insensitive to the various loaded loop impedances ranging from 0.4 to 10.3 ohms, confirming current mode operation. The suppression of current induced by a neighboring loop was quantified as a function of center-to-center loop distance, and was measured to be 17 dB for nonoverlapping, adjacent loops. Deterministic manipulation of the B(1) field pattern was demonstrated by the independent control of RF phase and amplitude in a head-sized two-channel volume transmit array. It was found that a high-voltage rated RF power MOSFET with a minimum load resistance, exhibits current source behavior, which aids in transmit array design.

  6. A Novel Step-Doping Fully-Depleted Silicon-on-Insulator Metal-Oxide-Semiconductor Field-Effect Transistor for Reliable Deep Sub-micron Devices

    NASA Astrophysics Data System (ADS)

    Elahipanah, Hossein; Orouji, Ali A.

    2009-11-01

    For first time, we report a novel deep sub-micron fully-depleted silicon-on-insulator metal-oxide-semiconductor field-effect-transistor (FD SOI MOSFET) where the channel layer consists of two sections with a step doping (SD) region in order to increase performance and reliability of the device. This new structure that called SD FD SOI structure (SDFD-SOI MOSFET), were used for reaching suitable threshold voltage upon device scaling and reliability improvement. We demonstrate that the electric field was modified in the channel and common peak near the source junction have been reduced in the SDFD-SOI structure. The device demonstrates large enhancements in performance areas such as current drive capability, output resistance, hot-carrier reliability and threshold voltage roll-off. It was found that the device performance is very much dependent upon the SD region parameters. Simulation results show that the proposed structure improved on/off current ratio, and saturated output characteristics compared with conventional SOI structure (C-SOI MOSFET). Also, it was shown that substrate current of SDFD-SOI MOSFET is much lower than the C-SOI MOSFET which presented the lower hot-carrier degradation in proposed MOSFET. Results show that the most short-channel problems in very large scale integrated circuits (VLSI) could be solved and the proposed SDFD-SOI MOSFETs can work very well in deep sub-micron and nanoscale regime.

  7. Characteristics and Modeling of a Nonplanar Nonrectangular Metal Oxide Semiconductor Field Effect Transistor for Charge Sensing in the Si Micro-Fluidic Channel

    NASA Astrophysics Data System (ADS)

    Lim, Geunbae; Kim, Dong-Sun; Lyu, Hong-Kun; Park, Hey-Jung; Shin, Jang-Kyoo; Choi, Pyung; Lee, Jong-Hyun; Lee, Minho

    2004-06-01

    In this work, a nonplanar, nonrectangular metal-oxide-semiconductor field effect transistor (MOSFET) with an asymmetrical channel structure for sensing charge in the Si micro-fluidic channel was fabricated, and the electrical characteristics of the fabricated three-dimensional (3-D) MOSFET were measured. The device was formed in the convex corner of a Si micro-fluidic channel using tetramethyl ammonium hydroxide (TMAH) anistropic etching solution, so that it would be suitable for combination with a micro-fluidic system. We approximated the nonplanar, nonrectangular 3-D MOSFET to a two-dimensional rectangular structure using the Schwartz-Christoffel transformation. The LEVEL1 device parameters of the 3-D MOSFET were extracted from the measured electrical device characteristics and were used in a simulation program with integrated circuit emphasis (SPICE) simulation. The measured and simulated results for the 3-D MOSFET were compared and found to show good agreement. We also investigated the feasibility of the proposed 3-D MOSFET as a charge sensor for detecting charged biomolecules.

  8. Fabrication of 3-Dimensional Structure of Metal Oxide Semiconductor Field Effect Transistor Embodied in the Convex Corner of the Silicon Micro-Fluidic Channel

    NASA Astrophysics Data System (ADS)

    Lim, Geunbae; Park, Chin-Sung; Lyu, Hong-Kun; Kim, Dong-Sun; Jeong, Yong-Taek; Park, Hey-Jung; Kim, Hyoung Sik; Shin, Jang-Kyoo; Choi, Pyung; Lee, Jong-Hyun

    2003-06-01

    As micro-fluidic systems and biochemical detection systems are scaled to smaller dimensions, the realization of small and portable biochemical detection systems has become increasingly important. In this paper, we propose a 3-dimensional structure of a metal oxide semiconductor field-effect transistor(3-D MOSFET) using tetramethyl ammonium hydroxide (TMAH) anisotropic etching, which is a suitable device for combining with a micro-fluidic system. After fabricating a trapezoidal micro-fluidic channel, the 3-D MOSFET embodied in the convex corner of the micro-fluidic channel was fabricated. The length of the gate is about 20 μm and the width is about 9 μm. The depth and top width of the trapezoidal micro-fluidic channel are about 8 μm and 60 μm, respectively. The measured drain saturation current of the 3-D MOSFET was about -22 μA at VGS=-5 V and VDS=-5 V, and the device characteristics exhibit a typical MOSFET behavior. Moreover, a gold layer was used for the MOSFET’s gate metal to detect charged biochemical samples using the affinity between gold and thiol.

  9. Effects of substrate voltage on noise characteristics and hole lifetime in SOI metal-oxide-semiconductor field-effect transistor photon detector.

    PubMed

    Putranto, Dedy Septono Catur; Priambodo, Purnomo Sidi; Hartanto, Djoko; Du, Wei; Satoh, Hiroaki; Ono, Atsushi; Inokawa, Hiroshi

    2014-09-01

    Low-frequency noise and hole lifetime in silicon-on-insulator (SOI) metal-oxide-semiconductor field-effect transistors (MOSFETs) are analyzed, considering their use in photon detection based on single-hole counting. The noise becomes minimum at around the transition point between front- and back-channel operations when the substrate voltage is varied, and increases largely on both negative and positive sides of the substrate voltage showing peculiar Lorentzian (generation-recombination) noise spectra. Hole lifetime is evaluated by the analysis of drain current histogram at different substrate voltages. It is found that the peaks in the histogram corresponding to the larger number of stored holes become higher as the substrate bias becomes larger. This can be attributed to the prolonged lifetime caused by the higher electric field inside the body of SOI MOSFET. It can be concluded that, once the inversion channel is induced for detection of the photo-generated holes, the small absolute substrate bias is favorable for short lifetime and low noise, leading to high-speed operation. PMID:25321581

  10. Radiofrequency current source (RFCS) drive and decoupling technique for parallel transmit arrays using a high-power metal oxide semiconductor field-effect transistor (MOSFET).

    PubMed

    Lee, Wonje; Boskamp, Eddy; Grist, Thomas; Kurpad, Krishna

    2009-07-01

    A radiofrequency current source (RFCS) design using a high-power metal oxide semiconductor field effect transistor (MOSFET) that enables independent current control for parallel transmit applications is presented. The design of an RFCS integrated with a series tuned transmitting loop and its associated control circuitry is described. The current source is operated in a gated class AB push-pull configuration for linear operation at high efficiency. The pulsed RF current amplitude driven into the low impedance transmitting loop was found to be relatively insensitive to the various loaded loop impedances ranging from 0.4 to 10.3 ohms, confirming current mode operation. The suppression of current induced by a neighboring loop was quantified as a function of center-to-center loop distance, and was measured to be 17 dB for nonoverlapping, adjacent loops. Deterministic manipulation of the B(1) field pattern was demonstrated by the independent control of RF phase and amplitude in a head-sized two-channel volume transmit array. It was found that a high-voltage rated RF power MOSFET with a minimum load resistance, exhibits current source behavior, which aids in transmit array design. PMID:19353658

  11. Characterization of high-sensitivity metal oxide semiconductor field effect transistor dosimeters system and LiF:Mg,Cu,P thermoluminescence dosimeters for use in diagnostic radiology.

    PubMed

    Dong, S L; Chu, T C; Lan, G Y; Wu, T H; Lin, Y C; Lee, J S

    2002-12-01

    Monitoring radiation exposure during diagnostic radiographic procedures has recently become an area of interest. In recent years, the LiF:Mg,Cu,P thermoluminescence dosimeter (TLD-100H) and the highly sensitive metal oxide semiconductor field effect transistor (MOSFET) dosimeter were introduced as good candidates for entrance skin dose measurements in diagnostic radiology. In the present study, the TLD-100H and the MOSFET dosimeters were evaluated for sensitivity, linearity, energy, angular dependence, and post-exposure response. Our results indicate that the TLD-100H dosimeter has excellent linearity within diagnostic energy ranges and its sensitivity variations were under 3% at tube potentials from 40Vp to 125kVp. Good linearity was also observed with the MOSFET dosimeter, but in low-dose regions the values are less reliable and were found to be a function of the tube potentials. Both dosimeters also presented predictable angular dependence in this study. Our findings suggest that the TLD-100H dosimeter is more appropriate for low-dose diagnostic procedures such as chest and skull projections. The MOSFET dosimeter system is valuable for entrance skin dose measurement with lumbar spine projections and certain fluoroscopic procedures. PMID:12406633

  12. Ultrathin body GaSb-on-insulator p-channel metal-oxide-semiconductor field-effect transistors on Si fabricated by direct wafer bonding

    SciTech Connect

    Yokoyama, Masafumi Takenaka, Mitsuru; Takagi, Shinichi; Yokoyama, Haruki

    2015-02-16

    We have realized ultrathin body GaSb-on-insulator (GaSb-OI) on Si wafers by direct wafer bonding technology using atomic-layer deposition (ALD) Al{sub 2}O{sub 3} and have demonstrated GaSb-OI p-channel metal-oxide-semiconductor field-effect transistors (p-MOSFETs) on Si. A 23-nm-thick GaSb-OI p-MOSFET exhibits the peak effective mobility of ∼76 cm{sup 2}/V s. We have found that the effective hole mobility of the thin-body GaSb-OI p-MOSFETs decreases with a decrease in the GaSb-OI thickness or with an increase in Al{sub 2}O{sub 3} ALD temperature. The InAs passivation of GaSb-OI MOS interfaces can enhance the peak effective mobility up to 159 cm{sup 2}/V s for GaSb-OI p-MOSFETs with the 20-nm-thick GaSb layer.

  13. Hole Confinement and 1/ f Noise Characteristics of SiGe Double-Quantum-Well p-Type Metal-Oxide-Semiconductor Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Lin, Yu Min; Wu, San Lein; Chang, Shoou Jinn; Chen, Pang Shiu; Liu, Chee Wee

    2006-05-01

    A working p-type SiGe double-quantum-well metal-oxide-semiconductor field effect transistor (DQW-pMOSFETs) has been fabricated and characterized. The upper quantum well with 15%-Ge acts as an induced-carrier buffer to slow holes into the Si surface channel and increases the number of high-mobility holes in the 30%-Ge well at the bottom under high gate voltage by improving carrier confinement. DQW devices with a thinner Si-spacer layer between the two SiGe quantum wells exhibit an improved effective hole mobility and wider gate voltage swings but also reduced 1/ f noise levels than Si-controlled pMOSFETs. The DQW has an enhanced carrier confinement compared to a single quantum-well (SQW) device; however, the degradation of mobility and transconductance observed in a sample DQW indicates that this poor transport mechanism may result from an additional hole scattering effect at the Si/SiGe interface.

  14. A methodology to identify and quantify mobility-reducing defects in 4H-silicon carbide power metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Ettisserry, D. P.; Goldsman, N.; Lelis, A.

    2014-03-01

    In this paper, we present a methodology for the identification and quantification of defects responsible for low channel mobility in 4H-Silicon Carbide (SiC) power metal-oxide-semiconductor field-effect transistors (MOSFETs). To achieve this, we use an algorithm based on 2D-device simulations of a power MOSFET, density functional simulations, and measurement data. Using physical modeling of carrier mobility and interface traps, we reproduce the experimental I-V characteristics of a 4H-SiC doubly implanted MOSFET through drift-diffusion simulation. We extract the position of Fermi level and the occupied trap density as a function of applied bias and temperature. Using these inputs, our algorithm estimates the number of possible trap types, their energy levels, and concentrations at 4H-SiC/SiO2 interface. Subsequently, we use density functional theory (DFT)-based ab initio simulations to identify the atomic make-up of defects causing these trap levels. We study silicon vacancy and carbon di-interstitial defects in the SiC side of the interface. Our algorithm indicates that the Dit spectrum near the conduction band edge (3.25 eV) is composed of three trap types located at 2.8-2.85 eV, 3.05 eV, and 3.1-3.2 eV, and also calculates their densities. Based on DFT simulations, this work attributes the trap levels very close to the conduction band edge to the C di-interstitial defect.

  15. Sample size requirements for estimating effective dose from computed tomography using solid-state metal-oxide-semiconductor field-effect transistor dosimetry

    SciTech Connect

    Trattner, Sigal; Cheng, Bin; Pieniazek, Radoslaw L.; Hoffmann, Udo; Douglas, Pamela S.; Einstein, Andrew J.

    2014-04-15

    Purpose: Effective dose (ED) is a widely used metric for comparing ionizing radiation burden between different imaging modalities, scanners, and scan protocols. In computed tomography (CT), ED can be estimated by performing scans on an anthropomorphic phantom in which metal-oxide-semiconductor field-effect transistor (MOSFET) solid-state dosimeters have been placed to enable organ dose measurements. Here a statistical framework is established to determine the sample size (number of scans) needed for estimating ED to a desired precision and confidence, for a particular scanner and scan protocol, subject to practical limitations. Methods: The statistical scheme involves solving equations which minimize the sample size required for estimating ED to desired precision and confidence. It is subject to a constrained variation of the estimated ED and solved using the Lagrange multiplier method. The scheme incorporates measurement variation introduced both by MOSFET calibration, and by variation in MOSFET readings between repeated CT scans. Sample size requirements are illustrated on cardiac, chest, and abdomen–pelvis CT scans performed on a 320-row scanner and chest CT performed on a 16-row scanner. Results: Sample sizes for estimating ED vary considerably between scanners and protocols. Sample size increases as the required precision or confidence is higher and also as the anticipated ED is lower. For example, for a helical chest protocol, for 95% confidence and 5% precision for the ED, 30 measurements are required on the 320-row scanner and 11 on the 16-row scanner when the anticipated ED is 4 mSv; these sample sizes are 5 and 2, respectively, when the anticipated ED is 10 mSv. Conclusions: Applying the suggested scheme, it was found that even at modest sample sizes, it is feasible to estimate ED with high precision and a high degree of confidence. As CT technology develops enabling ED to be lowered, more MOSFET measurements are needed to estimate ED with the same

  16. The Impacts of Contact Etch Stop Layer Thickness and Gate Height on Channel Stress in Strained N-Metal Oxide Semiconductor Field Effect Transistors.

    PubMed

    Lin, K C; Twu, M J; Deng, R H; Liu, C H

    2015-04-01

    The stress induced by strain in the channel of metal oxide semiconductor field effect transistors (MOSFET) is an effective method to boost the device performance. The geometric dimensions of spacer, gate height, and the contact etch stop layer (CESL) are important factors among the feasible booster. This study utilized the mismatch of the thermal expansion coefficients of stressors to simulate the process-induced stress in the N-MOSFET. Different temperatures are applied to different region of the device to generate the required strain. The analysis was performed by well-developed finite element package. The composite spacers with variant width of inserted silicon nitride (SiO2/SiN/SiO2, ONO) were proposed and their impacts on channel stress were compared. Two aspects of the impacts of those factors on the channel stress in the longitudinal direction for N-MOSFET with variant channel length were investigated. Firstly, the channel stresses of device without CESL for different gate heights were studied. Secondly, with stress applied to CESL and ONO spacers, the induced stresses in the channel were analyzed for long/short gate length. Two conclusions were drawn from the results of simulation. The N-MOSFET device without CESL shows that the stressed spacer alone generates compressive stress and the magnitude increases along with higher gate height. The channel stress becomes tensile for device with CESL and increases when the thickness of CESL and the height of gate increase, especially for device with shorter gate length. The gate height plays more significant role in inducing channel stress compared with the thickness of CESL. The channel stress can be used to quantify the mobility of electron/hole for strained MOSFET device. Therefore, with the guideline disclosed in this study, better device performance can be expected for N-MOSFET. PMID:26353480

  17. A methodology to identify and quantify mobility-reducing defects in 4H-silicon carbide power metal-oxide-semiconductor field-effect transistors

    SciTech Connect

    Ettisserry, D. P. Goldsman, N.; Lelis, A.

    2014-03-14

    In this paper, we present a methodology for the identification and quantification of defects responsible for low channel mobility in 4H-Silicon Carbide (SiC) power metal-oxide-semiconductor field-effect transistors (MOSFETs). To achieve this, we use an algorithm based on 2D-device simulations of a power MOSFET, density functional simulations, and measurement data. Using physical modeling of carrier mobility and interface traps, we reproduce the experimental I-V characteristics of a 4H-SiC doubly implanted MOSFET through drift-diffusion simulation. We extract the position of Fermi level and the occupied trap density as a function of applied bias and temperature. Using these inputs, our algorithm estimates the number of possible trap types, their energy levels, and concentrations at 4H-SiC/SiO{sub 2} interface. Subsequently, we use density functional theory (DFT)-based ab initio simulations to identify the atomic make-up of defects causing these trap levels. We study silicon vacancy and carbon di-interstitial defects in the SiC side of the interface. Our algorithm indicates that the D{sub it} spectrum near the conduction band edge (3.25 eV) is composed of three trap types located at 2.8–2.85 eV, 3.05 eV, and 3.1–3.2 eV, and also calculates their densities. Based on DFT simulations, this work attributes the trap levels very close to the conduction band edge to the C di-interstitial defect.

  18. Sample size requirements for estimating effective dose from computed tomography using solid-state metal-oxide-semiconductor field-effect transistor dosimetry

    PubMed Central

    Trattner, Sigal; Cheng, Bin; Pieniazek, Radoslaw L.; Hoffmann, Udo; Douglas, Pamela S.; Einstein, Andrew J.

    2014-01-01

    Purpose: Effective dose (ED) is a widely used metric for comparing ionizing radiation burden between different imaging modalities, scanners, and scan protocols. In computed tomography (CT), ED can be estimated by performing scans on an anthropomorphic phantom in which metal-oxide-semiconductor field-effect transistor (MOSFET) solid-state dosimeters have been placed to enable organ dose measurements. Here a statistical framework is established to determine the sample size (number of scans) needed for estimating ED to a desired precision and confidence, for a particular scanner and scan protocol, subject to practical limitations. Methods: The statistical scheme involves solving equations which minimize the sample size required for estimating ED to desired precision and confidence. It is subject to a constrained variation of the estimated ED and solved using the Lagrange multiplier method. The scheme incorporates measurement variation introduced both by MOSFET calibration, and by variation in MOSFET readings between repeated CT scans. Sample size requirements are illustrated on cardiac, chest, and abdomen–pelvis CT scans performed on a 320-row scanner and chest CT performed on a 16-row scanner. Results: Sample sizes for estimating ED vary considerably between scanners and protocols. Sample size increases as the required precision or confidence is higher and also as the anticipated ED is lower. For example, for a helical chest protocol, for 95% confidence and 5% precision for the ED, 30 measurements are required on the 320-row scanner and 11 on the 16-row scanner when the anticipated ED is 4 mSv; these sample sizes are 5 and 2, respectively, when the anticipated ED is 10 mSv. Conclusions: Applying the suggested scheme, it was found that even at modest sample sizes, it is feasible to estimate ED with high precision and a high degree of confidence. As CT technology develops enabling ED to be lowered, more MOSFET measurements are needed to estimate ED with the same

  19. Ultra-low specific on-resistance high-voltage vertical double diffusion metal-oxide-semiconductor field-effect transistor with continuous electron accumulation layer

    NASA Astrophysics Data System (ADS)

    Da, Ma; Xiao-Rong, Luo; Jie, Wei; Qiao, Tan; Kun, Zhou; Jun-Feng, Wu

    2016-04-01

    A new ultra-low specific on-resistance (R on,sp) vertical double diffusion metal-oxide-semiconductor field-effect transistor (VDMOS) with continuous electron accumulation (CEA) layer, denoted as CEA-VDMOS, is proposed and its new current transport mechanism is investigated. It features a trench gate directly extended to the drain, which includes two PN junctions. In on-state, the electron accumulation layers are formed along the sides of the extended gate and introduce two continuous low-resistance current paths from the source to the drain in a cell pitch. This mechanism not only dramatically reduces the R on,sp but also makes the R on,sp almost independent of the n-pillar doping concentration (N n). In off-state, the depletion between the n-pillar and p-pillar within the extended trench gate increases the N n, and further reduces the R on,sp. Especially, the two PN junctions within the trench gate support a high gate-drain voltage in the off-state and on-state, respectively. However, the extended gate increases the gate capacitance and thus weakens the dynamic performance to some extent. Therefore, the CEA-VDMOS is more suitable for low and medium frequencies application. Simulation indicates that the CEA-VDMOS reduces the R on,sp by 80% compared with the conventional super-junction VDMOS (CSJ-VDMOS) at the same high breakdown voltage (BV). Project supported by the National Natural Science Foundation of China (Grant Nos. 61176069 and 61376079) and the Fundamental Research Funds for the Central Universities, China (Grant No. ZYGX2014Z006).

  20. Impact of additional Pt and NiSi crystal orientation on channel stress induced by Ni silicide film in metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Mizuo, Mariko; Yamaguchi, Tadashi; Kudo, Shuichi; Hirose, Yukinori; Kimura, Hiroshi; Tsuchimoto, Jun-ichi; Hattori, Nobuyoshi

    2014-01-01

    The impact of additional Pt and Ni monosilicide (NiSi) crystal orientation on channel stress from Ni silicide in metal-oxide-semiconductor field-effect transistors (MOSFETs) has been demonstrated. The channel stress generation mechanism can be explained by the NiSi crystal orientation. In pure Ni silicide films, the channel stress in the p-type substrate is much larger than that in the n-type one, since the NiSi a-axis parallel to the channel direction is strongly aligned on the p-type substrate compared with on the n-type one. On the other hand, in NiPt silicide films, the difference in the channel stress between the p- and n-type substrates is small, because the NiSi crystal orientation on the p-type substrate is similar to that on the n-type one. These results can be explained by the Pt segregation at the interface between the NiSi film and the Si surface. Segregated Pt atoms cause the NiSi b-axis to align normal to the Si(001) surface in the nucleation step owing to the expansion of the NiSi lattice spacing at the NiSi/Si interface. Furthermore, the Pt segregation mechanism is considered to be caused by the grain boundary diffusion in the Ni2Si film during NiSi formation. We confirmed that the grains of Ni2Si on the p-type substrate are smaller than those on the n-type one. The Ni2Si film on the p-type substrate has more grain boundary diffusion paths than that on the n-type one. Therefore, the amount of Pt segregation at the NiSi/Si interface on the p-type substrate is larger than that on the n-type one. Consequently, the number of NiSi grains with the b-axis aligned normal to the Si(001) in the p-type substrate is larger than that in the n-type one. As a result, the channel stress induced by NiPt silicide in PMOS is larger than that in NMOS. According to this mechanism, controlling the Pt concentration at the NiSi/Si interface is one of the key factors for channel stress engineering.

  1. Effective dose assessment in the maxillofacial region using thermoluminescent (TLD) and metal oxide semiconductor field-effect transistor (MOSFET) dosemeters: a comparative study

    PubMed Central

    Schulze, D; Wolff, J; Rottke, D

    2014-01-01

    Objectives: The objective of this study was to compare the performance of metal oxide semiconductor field-effect transistor (MOSFET) technology dosemeters with thermoluminescent dosemeters (TLDs) (TLD 100; Thermo Fisher Scientific, Waltham, MA) in the maxillofacial area. Methods: Organ and effective dose measurements were performed using 40 TLD and 20 MOSFET dosemeters that were alternately placed in 20 different locations in 1 anthropomorphic RANDO® head phantom (the Phantom Laboratory, Salem, NY). The phantom was exposed to four different CBCT default maxillofacial protocols using small (4 × 5 cm) to full face (20 × 17 cm) fields of view (FOVs). Results: The TLD effective doses ranged between 7.0 and 158.0 µSv and the MOSFET doses between 6.1 and 175.0 µSv. The MOSFET and TLD effective doses acquired using four different (FOV) protocols were as follows: face maxillofacial (FOV 20 × 17 cm) (MOSFET, 83.4 µSv; TLD, 87.6 µSv; −5%); teeth, upper jaw (FOV, 8.5 × 5.0 cm) (MOSFET, 6.1 µSv; TLD, 7.0 µSv; −14%); tooth, mandible and left molar (FOV, 4 × 5 cm) (MOSFET, 10.3 µSv; TLD, 12.3 µSv; −16%) and teeth, both jaws (FOV, 10 × 10 cm) (MOSFET, 175 µSv; TLD, 158 µSv; +11%). The largest variation in organ and effective dose was recorded in the small FOV protocols. Conclusions: Taking into account the uncertainties of both measurement methods and the results of the statistical analysis, the effective doses acquired using MOSFET dosemeters were found to be in good agreement with those obtained using TLD dosemeters. The MOSFET dosemeters constitute a feasible alternative for TLDs for the effective dose assessment of CBCT devices in the maxillofacial region. PMID:25143020

  2. Temperature-Independent Switching Rates for a Random Telegraph Signal in a Silicon Metal-Oxide-Semiconductor Field-Effect Transistor at Low Temperatures

    SciTech Connect

    Borland, Nick; Fleetwood, D.M.; Scofield, John H.

    1999-07-19

    We have observed discrete random telegraph signals (RTS'S) in the drain voltages of three, observed above 30 K were thermally activated. The switching rate for the only RTS observed below 30 K was thermally activated above 30 K but temperature-independent below 10 K. To our knowledge, this cross-over from thermal activation to tunneling behavior has not been previously observed for RTS's Metal-oxide-semiconductor field-effect transistors (MCEWETS) often exhibit relatively large levels of low-frequency (1/fl noise) [1,2]. Much evidence suggests that this noise is related to the capture all cases, switching rates have been thermally activated, often with different activation energies for capture and/or emission is accompanied by lattice relaxation. Though thermally activated behavior has sufficiently low temperatures [7,9]. While not observed in MOSFETS, cross-over from thermal activation to configurational tunneling has been observed for RTS's in junctions [13]. drain voltage was observed to randomly switch between two discrete levels, designated as Vup and Vdn, similar to RTS's reported by others [2,7'- 11 ]. We have characterized six RTS `S for temperatures above 30 K where thermally activated switching rates are observed. The properties of five of these have been the trap, i.e., the mean time a captured charge carrier spends in the trap before it is emitted. Similarly, we identify the mean time in the low resistance state ( trup in state Vup) as the capture time rc. F@ure 1 shows a typical time trace of the drain-voltage fluctuation &d(t)= Vd(t)+Vd>. This indicate that both the mean capture and emission times become independent of Tat low temperatures and where a= capture or emission, is temperature independent. The solid curve in Figure 3(a) (mean capture time) was obtained using a weighted nonlinear charge carriers are not in thermal equilibrium with the lattice, i.e., that while the lattice is being cooled Instead, we believe that the transition from thermally

  3. Effect of temperature on Ga{sub 2}O{sub 3}(Gd{sub 2}O{sub 3})/GaN metal{endash}oxide{endash}semiconductor field-effect transistors

    SciTech Connect

    Ren, F.; Hong, M.; Chu, S.N.; Marcus, M.A.; Schurman, M.J.; Baca, A.; Pearton, S.J.; Abernathy, C.R.

    1998-12-01

    Ga{sub 2}O{sub 3}(Gd{sub 2}O{sub 3}) was deposited on GaN for use as a gate dielectric in order to fabricate a depletion metal{endash}oxide{endash}semiconductor field-effect transistor (MOSFET). Analysis of the effect of temperature on the device shows that gate leakage is significantly reduced at elevated temperature relative to a conventional metal{endash}semiconductor field-effect transistor fabricated on the same GaN layer. MOSFET device operation in fact improved upon heating to 400 {degree}C. Modeling of the effect of temperature on contact resistance suggests that the improvement is due to a reduction in the parasitic resistances present in the device. {copyright} {ital 1998 American Institute of Physics.}

  4. Thermally stable, sub-nanometer equivalent oxide thickness gate stack for gate-first In0.53Ga0.47As metal-oxide-semiconductor field-effect-transistors

    NASA Astrophysics Data System (ADS)

    El Kazzi, M.; Czornomaz, L.; Rossel, C.; Gerl, C.; Caimi, D.; Siegwart, H.; Fompeyrine, J.; Marchiori, C.

    2012-02-01

    Metal-oxide-semiconductor (MOS) capacitors were fabricated by depositing composite 2 nm HfO2/1 nm Al2O3/1 nm a-Si gate stacks on p-In0.53Ga0.47As/InP (001) substrates. Thanks to the presence of the Al2O3 barrier layer, a minimum amount of the a-Si passivating layer is oxidized during the whole fabrication process. The capacitors exhibit excellent electrical characteristics with scaled equivalent oxide thickness (EOT) of 0.89 nm and mid-gap interface state density of 5 × 1011 eV-1 cm-2 upon post-metallization anneal up to 550 °C. Gate-first, self-aligned MOS field-effect-transistors were fabricated with a similar 5 nm HfO2/1 nm Al2O3/1 nm a-Si gate stack and raised source and drain (600 °C for 30 min). Owing to the excellent thermal stability of the stack, no degradation of the gate stack/semiconductor interface is observed, as demonstrated by the excellent capacitance vs voltage characteristics and the good mobility values (peak at 1030 cm2 V-1 s-1 and 740 cm2 V-1 s-1 at carrier density of 6.5 × 1012 cm-2) for a 1.3 nm EOT.

  5. Impact of acceptor concentration on electrical properties and density of interface states of 4H-SiC n-metal-oxide-semiconductor field effect transistors studied by Hall effect

    NASA Astrophysics Data System (ADS)

    Ortiz, G.; Strenger, C.; Uhnevionak, V.; Burenkov, A.; Bauer, A. J.; Pichler, P.; Cristiano, F.; Bedel-Pereira, E.; Mortet, V.

    2015-02-01

    Silicon carbide n-type metal-oxide-semiconductor field effect transistors (MOSFETs) with different p-body acceptor concentrations were characterized by Hall effect. Normally OFF MOSFETs with good transfer characteristics and low threshold voltage were obtained with a peak mobility of ˜145 cm2 V-1 s-1 for the lowest acceptor concentration. The results are explained in terms of an increase of Coulomb scattering centers when increasing the background doping. These scattering centers are associated to fixed oxide and trapped interface charges. Additionally, the observed mobility improvement is not related to a decrease of the interface states density as a function of background doping.

  6. Charge trapping at the MoS2-SiO2 interface and its effects on the characteristics of MoS2 metal-oxide-semiconductor field effect transistors

    NASA Astrophysics Data System (ADS)

    Guo, Yao; Wei, Xianlong; Shu, Jiapei; Liu, Bo; Yin, Jianbo; Guan, Changrong; Han, Yuxiang; Gao, Song; Chen, Qing

    2015-03-01

    The field effect transistors (FETs) based on thin layer MoS2 often have large hysteresis and unstable threshold voltage in their transfer curves, mainly due to the charge trapping at the oxide-semiconductor interface. In this paper, the charge trapping and de-trapping processes at the SiO2-MoS2 interface are studied. The trapping charge density and time constant at different temperatures are extracted. Making use of the trapped charges, the threshold voltage of the MoS2 based metal-oxide-semiconductor FETs is adjusted from 4 V to -45 V. Furthermore, the impact of the trapped charges on the carrier transport is evaluated. The trapped charges are suggested to give rise to the unscreened Coulomb scattering and/or the variable range hopping in the carrier transport of the MoS2 sheet.

  7. Comparison between chemical vapor deposited and physical vapor deposited WSi{sub 2} metal gate for InGaAs n-metal-oxide-semiconductor field-effect transistors

    SciTech Connect

    Ong, B. S.; Pey, K. L.; Ong, C. Y.; Tan, C. S.; Antoniadis, D. A.; Fitzgerald, E. A.

    2011-05-02

    We compare chemical vapor deposition (CVD) and physical vapor deposition (PVD) WSi{sub 2} metal gate process for In{sub 0.53}Ga{sub 0.47}As n-metal-oxide-semiconductor field-effect transistors using 10 and 6.5 nm Al{sub 2}O{sub 3} as dielectric layer. The CVD-processed metal gate device with 6.5 nm Al{sub 2}O{sub 3} shows enhanced transistor performance such as drive current, maximum transconductance and maximum effective mobility. These values are relatively better than the PVD-processed counterpart device with improvement of 51.8%, 46.4%, and 47.8%, respectively. The improvement for the performance of the CVD-processed metal gate device is due to the fluorine passivation at the oxide/semiconductor interface and a nondestructive deposition process.

  8. Comparison of junctionless and inversion-mode p-type metal-oxide-semiconductor field-effect transistors in presence of hole-phonon interactions

    NASA Astrophysics Data System (ADS)

    Dib, E.; Carrillo-Nuñez, H.; Cavassilas, N.; Bescond, M.

    2016-01-01

    Junctionless transistors are being considered as one of the alternatives to conventional metal-oxide field-effect transistors. In this work, it is then presented a simulation study of silicon double-gated p-type junctionless transistors compared with its inversion-mode counterpart. The quantum transport problem is solved within the non-equilibrium Green's function formalism, whereas hole-phonon interactions are tackled by means of the self-consistent Born approximation. Our findings show that junctionless transistors should perform as good as a conventional transistor only for ultra-thin channels, with the disadvantage of requiring higher supply voltages in thicker channel configurations.

  9. Metal-semiconductor hybrid thin films in field-effect transistors

    SciTech Connect

    Okamura, Koshi Dehm, Simone; Hahn, Horst

    2013-12-16

    Metal-semiconductor hybrid thin films consisting of an amorphous oxide semiconductor and a number of aluminum dots in different diameters and arrangements are formed by electron beam lithography and employed for thin-film transistors (TFTs). Experimental and computational demonstrations systematically reveal that the field-effect mobility of the TFTs enhances but levels off as the dot density increases, which originates from variations of the effective channel length that strongly depends on the electric field distribution in a transistor channel.

  10. Fabricating metal-oxide-semiconductor field-effect transistors on a polyethylene terephthalate substrate by applying low-temperature layer transfer of a single-crystalline silicon layer by meniscus force

    NASA Astrophysics Data System (ADS)

    Sakaike, Kohei; Akazawa, Muneki; Nakamura, Shogo; Higashi, Seiichiro

    2013-12-01

    A low-temperature local-layer technique for transferring a single-crystalline silicon (c-Si) film by using a meniscus force was proposed, and an n-channel metal-oxide-semiconductor field-effect transistor (MOSFET) was fabricated on polyethylene terephthalate (PET) substrate. It was demonstrated that it is possible to transfer and form c-Si films in the required shape at the required position on PET substrates at extremely low temperatures by utilizing a meniscus force. The proposed technique for layer transfer was applied for fabricating high-performance c-Si MOSFETs on a PET substrate. The fabricated MOSFET showed a high on/off ratio of more than 108 and a high field-effect mobility of 609 cm2 V-1 s-1.

  11. Fabricating metal-oxide-semiconductor field-effect transistors on a polyethylene terephthalate substrate by applying low-temperature layer transfer of a single-crystalline silicon layer by meniscus force

    SciTech Connect

    Sakaike, Kohei; Akazawa, Muneki; Nakamura, Shogo; Higashi, Seiichiro

    2013-12-02

    A low-temperature local-layer technique for transferring a single-crystalline silicon (c-Si) film by using a meniscus force was proposed, and an n-channel metal-oxide-semiconductor field-effect transistor (MOSFET) was fabricated on polyethylene terephthalate (PET) substrate. It was demonstrated that it is possible to transfer and form c-Si films in the required shape at the required position on PET substrates at extremely low temperatures by utilizing a meniscus force. The proposed technique for layer transfer was applied for fabricating high-performance c-Si MOSFETs on a PET substrate. The fabricated MOSFET showed a high on/off ratio of more than 10{sup 8} and a high field-effect mobility of 609 cm{sup 2} V{sup −1} s{sup −1}.

  12. Near interface traps in SiO2/4H-SiC metal-oxide-semiconductor field effect transistors monitored by temperature dependent gate current transient measurements

    NASA Astrophysics Data System (ADS)

    Fiorenza, Patrick; La Magna, Antonino; Vivona, Marilena; Roccaforte, Fabrizio

    2016-07-01

    This letter reports on the impact of gate oxide trapping states on the conduction mechanisms in SiO2/4H-SiC metal-oxide-semiconductor field effect transistors (MOSFETs). The phenomena were studied by gate current transient measurements, performed on n-channel MOSFETs operated in "gate-controlled-diode" configuration. The measurements revealed an anomalous non-steady conduction under negative bias (VG > |20 V|) through the SiO2/4H-SiC interface. The phenomenon was explained by the coexistence of a electron variable range hopping and a hole Fowler-Nordheim (FN) tunnelling. A semi-empirical modified FN model with a time-depended electric field is used to estimate the near interface traps in the gate oxide (Ntrap ˜ 2 × 1011 cm-2).

  13. Temperature-independent switching rates for a random telegraph signal in a silicon metal-oxide-semiconductor field-effect transistor at low temperatures

    SciTech Connect

    Scofield, John H.; Borland, Nick; Fleetwood, D. M.

    2000-05-29

    We have observed discrete random telegraph signals (RTSs) in the drain voltages of three, nominally 1.25 {mu}mx1.25 {mu}m, enhancement-mode p-channel metal-oxide-semiconductor transistors operated in strong inversion in their linear regimes with constant drain-current and gate-voltage bias, for temperatures ranging from 4.2 to 300 K. The switching rates for all RTSs observed above 30 K were thermally activated. The switching rate for the only RTS observed below 30 K was thermally activated above 30 K but temperature independent below 10 K. This response is consistent with a crossover from thermal activation to tunneling at low temperatures. Implications are discussed for models of change exchange between the Si and the near-interfacial SiO{sub 2}. (c) 2000 American Institute of Physics.

  14. Schottky source/drain germanium-based metal-oxide-semiconductor field-effect transistors with self-aligned NiGe/Ge junction and aggressively scaled high-k gate stack

    NASA Astrophysics Data System (ADS)

    Hosoi, Takuji; Minoura, Yuya; Asahara, Ryohei; Oka, Hiroshi; Shimura, Takayoshi; Watanabe, Heiji

    2015-12-01

    Schottky source/drain (S/D) Ge-based metal-oxide-semiconductor field-effect transistors (MOSFETs) were fabricated by combining high permittivity (high-k) gate stacks with ultrathin AlOx interlayers and Fermi level depinning process by means of phosphorous ion implantation into NiGe/Ge contacts. Improved thermal stability of the metal/high-k/Ge stacks enabled self-aligned integration scheme for Schottky S/D complementary MOS applications. Significantly reduced parasitic resistance and aggressively scaled high-k gate stacks with sub-1-nm equivalent oxide thickness were demonstrated for both p- and n-channel Schottky Ge-FETs with the proposed combined technology.

  15. Impact of SF{sub 6} plasma treatment on performance of TaN-HfO{sub 2}-InP metal-oxide-semiconductor field-effect transistor

    SciTech Connect

    Wang Yanzhen; Chen Yenting; Zhao Han; Xue Fei; Zhou Fei; Lee, Jack C.

    2011-01-24

    In this work, the experimental impact of SF{sub 6} plasma treatment on the performance of InP metal-oxide-semiconductor field-effect transistors is presented. S and F are incorporated into atomic layer deposited HfO{sub 2} via postgate SF{sub 6} plasma treatment. The decreased subthreshold swing, gate leakage (I{sub g}), and increased effective channel mobility ({mu}{sub eff}) indicate that better interface and bulk oxide quality have been achieved with SF{sub 6} plasma treatment due to the formation of stronger Hf-F bonds. Drive current (I{sub d}), transconductance (G{sub m}), and effective channel mobility ({mu}{sub eff}) are improved by 22.3%, 35%, and 35%, respectively, compared with those of control devices.

  16. SEMICONDUCTOR DEVICES: Humidity sensitive organic field effect transistor

    NASA Astrophysics Data System (ADS)

    Murtaza, I.; Karimov, Kh S.; Ahmad, Zubair; Qazi, I.; Mahroof-Tahir, M.; Khan, T. A.; Amin, T.

    2010-05-01

    This paper reports the experimental results for the humidity dependent properties of an organic field effect transistor. The organic field effect transistor was fabricated on thoroughly cleaned glass substrate, in which the junction between the metal gate and the organic channel plays the role of gate dielectric. Thin films of organic semiconductor copper phthalocynanine (CuPc) and semitransparent Al were deposited in sequence by vacuum thermal evaporation on the glass substrate with preliminarily deposited Ag source and drain electrodes. The output and transfer characteristics of the fabricated device were performed. The effect of humidity on the drain current, drain current-drain voltage relationship, and threshold voltage was investigated. It was observed that humidity has a strong effect on the characteristics of the organic field effect transistor.

  17. Gate length and temperature dependence of negative differential transconductance in silicon quantum well metal-oxide-semiconductor field-effect transistors

    SciTech Connect

    Naquin, Clint; Lee, Mark; Edwards, Hal; Mathur, Guru; Chatterjee, Tathagata; Maggio, Ken

    2015-09-28

    Introducing quantum transport into silicon transistors in a manner compatible with industrial fabrication has the potential to transform the performance horizons of large scale integrated silicon devices and circuits. Explicit quantum transport as evidenced by negative differential transconductances (NDTCs) has been observed in a set of quantum well (QW) transistors fabricated using industrial silicon complementary metal-oxide-semiconductor processing. Detailed gate length and temperature dependence characteristics of the NDTCs in these devices have been measured. The QW potential was formed via lateral ion implantation doping on a commercial 45 nm technology node process line, and measurements of the transfer characteristics show NDTCs up to room temperature. Gate length dependence of NDTCs shows a correlation of the interface channel length with the number of NDTCs formed as well as with the gate voltage (V{sub G}) spacing between NDTCs. The V{sub G} spacing between multiple NDTCs suggests a quasi-parabolic QW potential profile. The temperature dependence is consistent with partial freeze-out of carrier concentration against a degenerately doped background.

  18. Gate length and temperature dependence of negative differential transconductance in silicon quantum well metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Naquin, Clint; Lee, Mark; Edwards, Hal; Mathur, Guru; Chatterjee, Tathagata; Maggio, Ken

    2015-09-01

    Introducing quantum transport into silicon transistors in a manner compatible with industrial fabrication has the potential to transform the performance horizons of large scale integrated silicon devices and circuits. Explicit quantum transport as evidenced by negative differential transconductances (NDTCs) has been observed in a set of quantum well (QW) transistors fabricated using industrial silicon complementary metal-oxide-semiconductor processing. Detailed gate length and temperature dependence characteristics of the NDTCs in these devices have been measured. The QW potential was formed via lateral ion implantation doping on a commercial 45 nm technology node process line, and measurements of the transfer characteristics show NDTCs up to room temperature. Gate length dependence of NDTCs shows a correlation of the interface channel length with the number of NDTCs formed as well as with the gate voltage (VG) spacing between NDTCs. The VG spacing between multiple NDTCs suggests a quasi-parabolic QW potential profile. The temperature dependence is consistent with partial freeze-out of carrier concentration against a degenerately doped background.

  19. Multifunctional phosphonic acid self-assembled monolayers on metal oxides as dielectrics, interface modification layers and semiconductors for low-voltage high-performance organic field-effect transistors.

    PubMed

    Ma, Hong; Acton, Orb; Hutchins, Daniel O; Cernetic, Nathan; Jen, Alex K-Y

    2012-11-01

    Insulating and semiconducting molecular phosphonic acid (PA) self-assembled monolayers (SAMs) have been developed for applications in organic field-effect transistors (OFETs) for low-power, low-cost flexible electronics. Multifunctional SAMs on ultrathin metal oxides, such as hafnium oxide and aluminum oxide, are shown to enable (1) low-voltage (sub 2 V) OFETs through dielectric and interface engineering on rigid and plastic substrates, (2) simultaneous one-component modification of source-drain and dielectric surfaces in bottom-contact OFETs, and (3) SAM-FETs based on molecular monolayer semiconductors. The combination of excellent dielectric and interfacial properties results in high-performance OFETs with low-subthreshold slopes down to 75 mV dec(-1), high I(on)/I(off) ratios of 10(5)-10(7), contact resistance down to 700 Ω cm, charge carrier mobilities of 0.1-4.6 cm(2) V(-1) s(-1), and general applicability to solution-processed and vacuum-deposited n-type and p-type organic and polymer semiconductors.

  20. Investigation of trap properties in high-k/metal gate p-type metal-oxide-semiconductor field-effect-transistors with aluminum ion implantation using random telegraph noise analysis

    SciTech Connect

    Kao, Tsung-Hsien; Chang, Shoou-Jinn Fang, Yean-Kuen; Huang, Po-Chin; Wu, Chung-Yi; Wu, San-Lein

    2014-08-11

    In this study, the impact of aluminum ion implantation (Al I/I) on random telegraph noise (RTN) in high-k/metal gate (HK/MG) p-type metal-oxide-semiconductor field-effect-transistors (pMOSFETs) was investigated. The trap parameters of HK/MG pMOSFETs with Al I/I, such as trap energy level, capture time and emission time, activation energies for capture and emission, and trap location in the gate dielectric, were determined. The configuration coordinate diagram was also established. It was observed that the implanted Al could fill defects and form a thin Al{sub 2}O{sub 3} layer and thus increase the tunneling barrier height for holes. It was also observed that the trap position in the Al I/I samples was lower due to the Al I/I-induced dipole at the HfO{sub 2}/SiO{sub 2} interface.

  1. Electron-electron scattering-induced channel hot electron injection in nanoscale n-channel metal-oxide-semiconductor field-effect-transistors with high-k/metal gate stacks

    SciTech Connect

    Tsai, Jyun-Yu; Liu, Kuan-Ju; Lu, Ying-Hsin; Liu, Xi-Wen; Chang, Ting-Chang; Chen, Ching-En; Ho, Szu-Han; Tseng, Tseung-Yuen; Cheng, Osbert; Huang, Cheng-Tung; Lu, Ching-Sen

    2014-10-06

    This work investigates electron-electron scattering (EES)-induced channel hot electron (CHE) injection in nanoscale n-channel metal-oxide-semiconductor field-effect-transistors (n-MOSFETs) with high-k/metal gate stacks. Many groups have proposed new models (i.e., single-particle and multiple-particle process) to well explain the hot carrier degradation in nanoscale devices and all mechanisms focused on Si-H bond dissociation at the Si/SiO{sub 2} interface. However, for high-k dielectric devices, experiment results show that the channel hot carrier trapping in the pre-existing high-k bulk defects is the main degradation mechanism. Therefore, we propose a model of EES-induced CHE injection to illustrate the trapping-dominant mechanism in nanoscale n-MOSFETs with high-k/metal gate stacks.

  2. Performance enhancement of n-channel inversion type In{sub x}Ga{sub 1-x}As metal-oxide-semiconductor field effect transistor using ex situ deposited thin amorphous silicon layer

    SciTech Connect

    Sonnet, A. M.; Hinkle, C. L.; Jivani, M. N.; Chapman, R. A.; Pollack, G. P.; Wallace, R. M.; Vogel, E. M.

    2008-09-22

    Significant enhancement in metal-oxide-semiconductor field effect transistor (MOSFET) transport characteristics is achieved with In{sub x}Ga{sub 1-x}As (x=0.53, x=0.20) channel material using ex situ plasma enhanced chemical vapor deposited amorphous Si layer. In{sub x}Ga{sub 1-x}As MOSFETs (L=2 {mu}m, V{sub gs}-V{sub t}=2.0 V) with Si interlayer show a maximum drain current of 290 mA/mm (x=0.53) and 2 {mu}A/mm (x=0.20), which are much higher compared to devices without a Si interlayer. However, charge pumping measurements show a lower average interface state density near the intrinsic Fermi level for devices without the silicon interlayer indicating that a reduction in the midgap interface state density is not responsible for the improved transport characteristics.

  3. Modeling of Metal-Ferroelectric-Semiconductor Field Effect Transistors

    NASA Technical Reports Server (NTRS)

    Duen Ho, Fat; Macleod, Todd C.

    1998-01-01

    The characteristics for a MFSFET (metal-ferroelectric-semiconductor field effect transistor) is very different than a conventional MOSFET and must be modeled differently. The drain current has a hysteresis shape with respect to the gate voltage. The position along the hysteresis curve is dependent on the last positive or negative polling of the ferroelectric material. The drain current also has a logarithmic decay after the last polling. A model has been developed to describe the MFSFET drain current for both gate voltage on and gate voltage off conditions. This model takes into account the hysteresis nature of the MFSFET and the time dependent decay. The model is based on the shape of the Fermi-Dirac function which has been modified to describe the MFSFET's drain current. This is different from the model proposed by Chen et. al. and that by Wu.

  4. Biomolecular detection using a metal semiconductor field effect transistor

    NASA Astrophysics Data System (ADS)

    Estephan, Elias; Saab, Marie-Belle; Buzatu, Petre; Aulombard, Roger; Cuisinier, Frédéric J. G.; Gergely, Csilla; Cloitre, Thierry

    2010-04-01

    In this work, our attention was drawn towards developing affinity-based electrical biosensors, using a MESFET (Metal Semiconductor Field Effect Transistor). Semiconductor (SC) surfaces must be prepared before the incubations with biomolecules. The peptides route was adapted to exceed and bypass the limits revealed by other types of surface modification due to the unwanted unspecific interactions. As these peptides reveal specific recognition of materials, then controlled functionalization can be achieved. Peptides were produced by phage display technology using a library of M13 bacteriophage. After several rounds of bio-panning, the phages presenting affinities for GaAs SC were isolated; the DNA of these specific phages were sequenced, and the peptide with the highest affinity was synthesized and biotinylated. To explore the possibility of electrical detection, the MESFET fabricated with the GaAs SC were used to detect the streptavidin via the biotinylated peptide in the presence of the bovine Serum Albumin. After each surface modification step, the IDS (current between the drain and the source) of the transistor was measured and a decrease in the intensity was detected. Furthermore, fluorescent microscopy was used in order to prove the specificity of this peptide and the specific localisation of biomolecules. In conclusion, the feasibility of producing an electrical biosensor using a MESFET has been demonstrated. Controlled placement, specific localization and detection of biomolecules on a MESFET transistor were achieved without covering the drain and the source. This method of functionalization and detection can be of great utility for biosensing application opening a new way for developing bioFETs (Biomolecular Field-Effect Transistor).

  5. Negative bias-and-temperature stress-assisted activation of oxygen-vacancy hole traps in 4H-silicon carbide metal-oxide-semiconductor field-effect transistors

    SciTech Connect

    Ettisserry, D. P. E-mail: neil@umd.edu; Goldsman, N. E-mail: neil@umd.edu; Akturk, A.; Lelis, A. J.

    2015-07-28

    We use hybrid-functional density functional theory-based Charge Transition Levels (CTLs) to study the electrical activity of near-interfacial oxygen vacancies located in the oxide side of 4H-Silicon Carbide (4H-SiC) power Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs). Based on the “amorphousness” of their local atomic environment, oxygen vacancies are shown to introduce their CTLs either within (permanently electrically active) or outside of (electrically inactive) the 4H-SiC bandgap. The “permanently electrically active” centers are likely to cause threshold voltage (V{sub th}) instability at room temperature. On the other hand, we show that the “electrically inactive” defects could be transformed into various “electrically active” configurations under simultaneous application of negative bias and high temperature stresses. Based on this observation, we present a model for plausible oxygen vacancy defects that could be responsible for the recently observed excessive worsening of V{sub th} instability in 4H-SiC power MOSFETs under high temperature-and-gate bias stress. This model could also explain the recent electrically detected magnetic resonance observations in 4H-SiC MOSFETs.

  6. Impact of metal gates on remote phonon scattering in titanium nitride/hafnium dioxide n-channel metal-oxide-semiconductor field effect transistors-low temperature electron mobility study

    NASA Astrophysics Data System (ADS)

    Maitra, Kingsuk; Frank, Martin M.; Narayanan, Vijay; Misra, Veena; Cartier, Eduard A.

    2007-12-01

    We report low temperature (40-300 K) electron mobility measurements on aggressively scaled [equivalent oxide thickness (EOT)=1 nm] n-channel metal-oxide-semiconductor field effect transistors (nMOSFETs) with HfO2 gate dielectrics and metal gate electrodes (TiN). A comparison is made with conventional nMOSFETs containing HfO2 with polycrystalline Si (poly-Si) gate electrodes. No substantial change in the temperature acceleration factor is observed when poly-Si is replaced with a metal gate, showing that soft optical phonons are not significantly screened by metal gates. A qualitative argument based on an analogy between remote phonon scattering and high-resolution electron energy-loss spectroscopy (HREELS) is provided to explain the underlying physics of the observed phenomenon. It is also shown that soft optical phonon scattering is strongly damped by thin SiO2 interface layers, such that room temperature electron mobility values at EOT=1 nm become competitive with values measured in nMOSFETs with SiON gate dielectrics used in current high performance processors.

  7. Negative bias-and-temperature stress-assisted activation of oxygen-vacancy hole traps in 4H-silicon carbide metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Ettisserry, D. P.; Goldsman, N.; Akturk, A.; Lelis, A. J.

    2015-07-01

    We use hybrid-functional density functional theory-based Charge Transition Levels (CTLs) to study the electrical activity of near-interfacial oxygen vacancies located in the oxide side of 4H-Silicon Carbide (4H-SiC) power Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs). Based on the "amorphousness" of their local atomic environment, oxygen vacancies are shown to introduce their CTLs either within (permanently electrically active) or outside of (electrically inactive) the 4H-SiC bandgap. The "permanently electrically active" centers are likely to cause threshold voltage (Vth) instability at room temperature. On the other hand, we show that the "electrically inactive" defects could be transformed into various "electrically active" configurations under simultaneous application of negative bias and high temperature stresses. Based on this observation, we present a model for plausible oxygen vacancy defects that could be responsible for the recently observed excessive worsening of Vth instability in 4H-SiC power MOSFETs under high temperature-and-gate bias stress. This model could also explain the recent electrically detected magnetic resonance observations in 4H-SiC MOSFETs.

  8. Enhanced Radiation Sensitivity in Short-Channel Partially Depleted Silicon-on-Insulator n-Type Metal-Oxide-Semiconductor Field Effect Transistors

    NASA Astrophysics Data System (ADS)

    Peng, Chao; Zhang, Zheng-Xuan; Hu, Zhi-Yuan; Huang, Hui-Xiang; Ning, Bing-Xu; Bi, Da-Wei

    2013-09-01

    The total ionizing dose effects of partially depleted silicon-on-insulator (SOI) transistors in a 0.13 μm technology are studied by 60Co γ-ray irradiation. Radiation enhanced drain-induced barrier lowering (DIBL) under different bias conditions is related to the parasitic bipolar in the SOI transistor and oxide trapped charge in the buried oxide, and it is experimentally observed for short channel transistors. The enhanced DIBL effect manifests as the DIBL parameter increases with total dose. Body doping concentration is a key factor affecting the total ionizing dose effect of the transistor. The low body doping transistor exhibits not only significant front gate threshold voltage shift as a result of the coupling effect, but also great off-state leakage at high drain voltage due to the enhanced DIBL effect.

  9. Low interface defect density of atomic layer deposition BeO with self-cleaning reaction for InGaAs metal oxide semiconductor field effect transistors

    SciTech Connect

    Shin, H. S.; Yum, J. H.; Johnson, D. W.; Harris, H. R.; Hudnall, Todd W.; Oh, J.; Kirsch, P.; Wang, W.-E.; Bielawski, C. W.; Banerjee, S. K.; Lee, J. C.; Lee, H. D.

    2013-11-25

    In this paper, we discuss atomic configuration of atomic layer deposition (ALD) beryllium oxide (BeO) using the quantum chemistry to understand the theoretical origin. BeO has shorter bond length, higher reaction enthalpy, and larger bandgap energy compared with those of ALD aluminum oxide. It is shown that the excellent material properties of ALD BeO can reduce interface defect density due to the self-cleaning reaction and this contributes to the improvement of device performance of InGaAs MOSFETs. The low interface defect density and low leakage current of InGaAs MOSFET were demonstrated using X-ray photoelectron spectroscopy and the corresponding electrical results.

  10. Phosphorus and boron diffusion paths in polycrystalline silicon gate of a trench-type three-dimensional metal-oxide-semiconductor field effect transistor investigated by atom probe tomography

    SciTech Connect

    Han, Bin Takamizawa, Hisashi Shimizu, Yasuo; Inoue, Koji; Nagai, Yasuyoshi; Yano, Fumiko; Kunimune, Yorinobu; Inoue, Masao; Nishida, Akio

    2015-07-13

    The dopant (P and B) diffusion path in n- and p-types polycrystalline-Si gates of trench-type three-dimensional (3D) metal-oxide-semiconductor field-effect transistors (MOSFETs) were investigated using atom probe tomography, based on the annealing time dependence of the dopant distribution at 900 °C. Remarkable differences were observed between P and B diffusion behavior. In the initial stage of diffusion, P atoms diffuse into deeper regions from the implanted region along grain boundaries in the n-type polycrystalline-Si gate. With longer annealing times, segregation of P on the grain boundaries was observed; however, few P atoms were observed within the large grains or on the gate/gate oxide interface distant from grain boundaries. These results indicate that P atoms diffuse along grain boundaries much faster than through the bulk or along the gate/gate oxide interface. On the other hand, in the p-type polycrystalline-Si gate, segregation of B was observed only at the initial stage of diffusion. After further annealing, the B atoms became uniformly distributed, and no clear segregation of B was observed. Therefore, B atoms diffuse not only along the grain boundary but also through the bulk. Furthermore, B atoms diffused deeper than P atoms along the grain boundaries under the same annealing conditions. This information on the diffusion behavior of P and B is essential for optimizing annealing conditions in order to control the P and B distributions in the polycrystalline-Si gates of trench-type 3D MOSFETs.

  11. Analytical Model for Direct Tunneling Gate Current in Long-Channel Undoped Cylindrical Surrounding Gate Metal-Oxide-Semiconductor Field Effect Transistors

    NASA Astrophysics Data System (ADS)

    Han, Ru; Li, Cong

    2013-02-01

    In this study, an analytical direct tunneling gate current model for long-channel undoped cylindrical surrounding gate (CSG) MOSFETs is developed. On the basis of an analytical model, the direct tunneling gate current in CSG MOSFETs is investigated. It is found that direct tunneling gate current is a strong function of gate oxide thickness, but less affected by the change in channel radius. It is also revealed that considering the influence of the source and drain, as the length of the underlap region decreases to zero, the direct tunneling gate current drastically increases. The accuracy of the analytical model is verified by the good agreement of its results with those obtained by the three-dimensional numerical device simulator ISE.

  12. Effect of barrier recess on transport and electrostatic interface properties of GaN-based normally-off and normally-on metal oxide semiconductor heterostructure field effect transistors

    NASA Astrophysics Data System (ADS)

    Capriotti, M.; Bahat Treidel, E.; Fleury, C.; Bethge, O.; Ostermaier, C.; Rigato, M.; Lancaster, S. L. C.; Brunner, F.; Detz, H.; Hilt, O.; Würfl, J.; Pogany, D.; Strasser, G.

    2016-11-01

    We perform a comprehensive electrical transport and physical characterization of metal oxide semiconductor heterostructure field effect transistors with ZrO2 gate dielectrics, having partially (referred here as MOS-HFET) and fully (here called true-MOS-FET) recessed GaN/AlGaN/GaN barrier, giving normally-on and normally-off behavior, respectively. The mobility of the MOS-HFETs decreases with the proximity of the Coulomb scattering centers, situated at the ZrO2/AlGaN interface. The effect of the etching procedure and ZrO2 deposition on the formation of the interfacial charges, Nint, is evaluated by X-ray Photoelectron Spectroscopy and by fitting the threshold voltage values to numerical model. For the both device types, the extracted value of Nint lies within 15% around 2.8 × 1013 cm-2, which is of the order of polarization charge, showing that our low-damage three step etching procedure does not introduce extra interface states.

  13. High quality PECVD SiO2 process for recessed MOS-gate of AlGaN/GaN-on-Si metal-oxide-semiconductor heterostructure field-effect transistors

    NASA Astrophysics Data System (ADS)

    Lee, Jae-Gil; Kim, Hyun-Seop; Seo, Kwang-Seok; Cho, Chun-Hyung; Cha, Ho-Young

    2016-08-01

    A high quality SiO2 deposition process using a plasma enhanced chemical vapor deposition system has been developed for the gate insulator process of normally-off recessed-gate AlGaN/GaN metal-oxide-semiconductor-heterostructure field-effect transistors (MOS-HFETs). SiO2 films were deposited by using SiH4 and N2O mixtures as reactant gases. The breakdown field increased with increasing the N2O flow rate. The optimum SiH4/N2O ratio was 0.05, which resulted in a maximum breakdown field of 11 MV/cm for the SiO2 film deposited on recessed GaN surface. The deposition conditions were optimized as follows; a gas flow rate of SiH4/N2O (=27/540 sccm), a source RF power of 100 W, a pressure of 2 Torr, and a deposition temperature of 350 °C. A fabricated normally-off MOS-HFET exhibited a threshold voltage of 3.2 V, a specific on-resistance of 4.46 mΩ cm2, and a breakdown voltage of 810 V.

  14. Modeling of a triple reduced surface field silicon-on-insulator lateral double-diffused metal-oxide-semiconductor field-effect transistor with low on-state resistance

    NASA Astrophysics Data System (ADS)

    Yu-Ru, Wang; Yi-He, Liu; Zhao-Jiang, Lin; Dong, Fang; Cheng-Zhou, Li; Ming, Qiao; Bo, Zhang

    2016-02-01

    An analytical model for a novel triple reduced surface field (RESURF) silicon-on-insulator (SOI) lateral double-diffused metal-oxide-semiconductor (LDMOS) field effect transistor with n-type top (N-top) layer, which can obtain a low on-state resistance, is proposed in this paper. The analytical model for surface potential and electric field distributions of the novel triple RESURF SOI LDMOS is presented by solving the two-dimensional (2D) Poisson’s equation, which can also be applied to single, double and conventional triple RESURF SOI structures. The breakdown voltage (BV) is formulized to quantify the breakdown characteristic. Besides, the optimal integrated charge of N-top layer (Qntop) is derived, which can give guidance for doping the N-top layer. All the analytical results are well verified by numerical simulation results, showing the validity of the presented model. Hence, the proposed model can be a good tool for the device designers to provide accurate first-order design schemes and physical insights into the high voltage triple RESURF SOI device with N-top layer. Project supported by the National Natural Science Foundation of China (Grant No. 61376080), the Natural Science Foundation of Guangdong Province, China (Grant No. 2014A030313736), and the Fundamental Research Funds for the Central Universities, China (Grant No. ZYGX2013J030).

  15. Oxidation and crystal field effects in uranium

    NASA Astrophysics Data System (ADS)

    Tobin, J. G.; Yu, S.-W.; Booth, C. H.; Tyliszczak, T.; Shuh, D. K.; van der Laan, G.; Sokaras, D.; Nordlund, D.; Weng, T.-C.; Bagus, P. S.

    2015-07-01

    An extensive investigation of oxidation in uranium has been pursued. This includes the utilization of soft x-ray absorption spectroscopy, hard x-ray absorption near-edge structure, resonant (hard) x-ray emission spectroscopy, cluster calculations, and a branching ratio analysis founded on atomic theory. The samples utilized were uranium dioxide (U O2) , uranium trioxide (U O3) , and uranium tetrafluoride (U F4) . A discussion of the role of nonspherical perturbations, i.e., crystal or ligand field effects, will be presented.

  16. Oxidation and crystal field effects in uranium

    SciTech Connect

    Tobin, J. G.; Booth, C. H.; Shuh, D. K.; van der Laan, G.; Sokaras, D.; Weng, T. -C.; Yu, S. W.; Bagus, P. S.; Tyliszczak, T.; Nordlund, D.

    2015-07-06

    An extensive investigation of oxidation in uranium has been pursued. This includes the utilization of soft x-ray absorption spectroscopy, hard x-ray absorption near-edge structure, resonant (hard) x-ray emission spectroscopy, cluster calculations, and a branching ratio analysis founded on atomic theory. The samples utilized were uranium dioxide (UO2), uranium trioxide (UO3), and uranium tetrafluoride (UF4). As a result, a discussion of the role of non-spherical perturbations, i.e., crystal or ligand field effects, will be presented.

  17. Reduction in the interface-states density of metal-oxide-semiconductor field-effect transistors fabricated on high-index Si (114) surfaces by using an external magnetic field

    SciTech Connect

    Molina, J. De La Hidalga, J.; Gutierrez, E.

    2014-08-14

    After fabrication of Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) devices on high-index silicon (114) surfaces, their threshold voltage (Vth) and interface-states density (Dit) characteristics were measured under the influence of an externally applied magnetic field of B = 6 μT at room temperature. The electron flow of the MOSFET's channel presents high anisotropy on Si (114), and this effect is enhanced by using an external magnetic field B, applied parallel to the Si (114) surface but perpendicular to the electron flow direction. This special configuration results in the channel electrons experiencing a Lorentzian force which pushes the electrons closer to the Si (114)-SiO{sub 2} interface and therefore to the special morphology of the Si (114) surface. Interestingly, Dit evaluation of n-type MOSFETs fabricated on Si (114) surfaces shows that the Si (114)-SiO{sub 2} interface is of high quality so that Dit as low as ∼10{sup 10 }cm{sup −2}·eV{sup −1} are obtained for MOSFETs with channels aligned at specific orientations. Additionally, using both a small positive Vds ≤ 100 mV and B = 6 μT, the former Dit is reduced by 35% in MOSFETs whose channels are aligned parallel to row-like nanostructures formed atop Si (114) surfaces (channels having a 90° rotation), whereas Dit is increased by 25% in MOSFETs whose channels are aligned perpendicular to these nanostructures (channels having a 0° rotation). From these results, the special morphology of a high-index Si (114) plane having nanochannels on its surface opens the possibility to reduce the electron-trapping characteristics of MOSFET devices having deep-submicron features and operating at very high frequencies.

  18. Interfacial band configuration and electrical properties of LaAlO{sub 3}/Al{sub 2}O{sub 3}/hydrogenated-diamond metal-oxide-semiconductor field effect transistors

    SciTech Connect

    Liu, J. W.; Liao, M. Y.; Imura, M.; Oosato, H.; Watanabe, E.; Tanaka, A.; Iwai, H.; Koide, Y.

    2013-08-28

    In order to search a gate dielectric with high permittivity on hydrogenated-diamond (H-diamond), LaAlO{sub 3} films with thin Al{sub 2}O{sub 3} buffer layers are fabricated on the H-diamond epilayers by sputtering-deposition (SD) and atomic layer deposition (ALD) techniques, respectively. Interfacial band configuration and electrical properties of the SD-LaAlO{sub 3}/ALD-Al{sub 2}O{sub 3}/H-diamond metal-oxide-semiconductor field effect transistors (MOSFETs) with gate lengths of 10, 20, and 30 μm have been investigated. The valence and conduction band offsets of the SD-LaAlO{sub 3}/ALD-Al{sub 2}O{sub 3} structure are measured by X-ray photoelectron spectroscopy to be 1.1 ± 0.2 and 1.6 ± 0.2 eV, respectively. The valence band discontinuity between H-diamond and LaAlO{sub 3} is evaluated to be 4.0 ± 0.2 eV, showing that the MOS structure acts as the gate which controls a hole carrier density. The leakage current density of the SD-LaAlO{sub 3}/ALD-Al{sub 2}O{sub 3}/H-diamond MOS diode is smaller than 10{sup −8} A cm{sup −2} at gate bias from −4 to 2 V. The capacitance-voltage curve in the depletion mode shows sharp dependence, small flat band voltage, and small hysteresis shift, which implies low positive and trapped charge densities. The MOSFETs show p-type channel and complete normally off characteristics with threshold voltages changing from −3.6 ± 0.1 to −5.0 ± 0.1 V dependent on the gate length. The drain current maximum and the extrinsic transconductance of the MOSFET with gate length of 10 μm are −7.5 mA mm{sup −1} and 2.3 ± 0.1 mS mm{sup −1}, respectively. The enhancement mode SD-LaAlO{sub 3}/ALD-Al{sub 2}O{sub 3}/H-diamond MOSFET is concluded to be suitable for the applications of high power and high frequency electrical devices.

  19. Laboratory Experiment in Semiconductor Surface-Field Effects

    ERIC Educational Resources Information Center

    Goodman, F. R.; And Others

    1974-01-01

    A laboratory instructional program involving metal-insulator-semiconductor (MIS) devices is described. In the first of a two-part experiment, students become familiar with the important parameters of a simple MIS device and learn measurement techniques; in the second part, device fabrication procedures are learned. (DT)

  20. Exploring graphene field effect transistor devices to improve spectral resolution of semiconductor radiation detectors

    SciTech Connect

    Harrison, Richard Karl; Howell, Stephen Wayne; Martin, Jeffrey B.; Hamilton, Allister B.

    2013-12-01

    Graphene, a planar, atomically thin form of carbon, has unique electrical and material properties that could enable new high performance semiconductor devices. Graphene could be of specific interest in the development of room-temperature, high-resolution semiconductor radiation spectrometers. Incorporating graphene into a field-effect transistor architecture could provide an extremely high sensitivity readout mechanism for sensing charge carriers in a semiconductor detector, thus enabling the fabrication of a sensitive radiation sensor. In addition, the field effect transistor architecture allows us to sense only a single charge carrier type, such as electrons. This is an advantage for room-temperature semiconductor radiation detectors, which often suffer from significant hole trapping. Here we report on initial efforts towards device fabrication and proof-of-concept testing. This work investigates the use of graphene transferred onto silicon and silicon carbide, and the response of these fabricated graphene field effect transistor devices to stimuli such as light and alpha radiation.

  1. A new era of semiconductor genetics using ion-sensitive field-effect transistors: the gene-sensitive integrated cell.

    PubMed

    Toumazou, Christofer; Thay, Tan Sri Lim Kok; Georgiou, Pantelis

    2014-03-28

    Semiconductor genetics is now disrupting the field of healthcare owing to the rapid parallelization and scaling of DNA sensing using ion-sensitive field-effect transistors (ISFETs) fabricated using commercial complementary metal -oxide semiconductor technology. The enabling concept of DNA reaction monitoring introduced by Toumazou has made this a reality and we are now seeing relentless scaling with Moore's law ultimately achieving the $100 genome. In this paper, we present the next evolution of this technology through the creation of the gene-sensitive integrated cell (GSIC) for label-free real-time analysis based on ISFETs. This device is derived from the traditional metal-oxide semiconductor field-effect transistor (MOSFET) and has electrical performance identical to that of a MOSFET in a standard semiconductor process, yet is capable of incorporating DNA reaction chemistries for applications in single nucleotide polymorphism microarrays and DNA sequencing. Just as application-specific integrated circuits, which are developed in much the same way, have shaped our consumer electronics industry and modern communications and memory technology, so, too, do GSICs based on a single underlying technology principle have the capacity to transform the life science and healthcare industries.

  2. Rational design and preparation of organic semiconductors for use in field effect transistors and photovoltaic cells

    NASA Astrophysics Data System (ADS)

    Mauldin, Clayton Edward

    The goal of this research was to develop methods to control the material properties of organic semiconductors, like solubility, stability, charge mobility, and self-assembly, through structural design. Investigations of structure-property relationships were conducted to optimize the properties of organic semiconductors for applications in organic field effect transistors (OFETs) and organic photovoltaics (OPVs). Chapter 1 gives an introduction to charge transport in organic semiconductors, and describes how the structure of conjugated molecules can affect their electrical performance and facilitate facile solution deposition. Furthermore, factors that can affect the stability of organic semiconductors to ambient conditions are discussed. Also, the device characteristics of OFETs and OPVs are summarized as a reference for subsequent chapters. Chapter 2 discusses the investigation of the air stability of distyryl oligothiophenes in OFETs. This work made use of thermally labile solubilizing groups to facilitate solution deposition of the oligothiophenes. In addition to device characterization, an extensive analysis of the thin film morphology using AFM, NEXAFS and GIXD is presented. This work revealed the general stability of distyryl oligothiophenes to oxidative degradation, and the high degree of crystallinity in our thin films. In Chapter 3, the charge transporting properties of pentathiophene monolayer islands is analyzed using current sensing AFM. The pentathiophenes were prepared with carboxylic acid moieties for self assembly, and the sub-monolayer films were transferred onto conductive substrates using the Langmuir-Blodgett technique. The morphology of the monolayers was observed to be sensitive to the alkyl substitution pattern of the pentathiophenes, which in turn affected charge transport. Hierarchical supramolecular assemblies of oligothiophenes and block copolymers are studied in Chapter 4. The structure of the assemblies is studied by TEM and small angle

  3. New Material Transistor with Record-High Field-Effect Mobility among Wide-Band-Gap Semiconductors.

    PubMed

    Shih, Cheng Wei; Chin, Albert

    2016-08-01

    At an ultrathin 5 nm, we report a new high-mobility tin oxide (SnO2) metal-oxide-semiconductor field-effect transistor (MOSFET) exhibiting extremely high field-effect mobility values of 279 and 255 cm(2)/V-s at 145 and 205 °C, respectively. These values are the highest reported mobility values among all wide-band-gap semiconductors of GaN, SiC, and metal-oxide MOSFETs, and they also exceed those of silicon devices at the aforementioned elevated temperatures. For the first time among existing semiconductor transistors, a new device physical phenomenon of a higher mobility value was measured at 45-205 °C than at 25 °C, which is due to the lower optical phonon scattering by the large SnO2 phonon energy. Moreover, the high on-current/off-current of 4 × 10(6) and the positive threshold voltage of 0.14 V at 25 °C are significantly better than those of a graphene transistor. This wide-band-gap SnO2 MOSFET exhibits high mobility in a 25-205 °C temperature range, a wide operating voltage of 1.5-20 V, and the ability to form on an amorphous substrate, rendering it an ideal candidate for multifunctional low-power integrated circuit (IC), display, and brain-mimicking three-dimensional IC applications.

  4. New Material Transistor with Record-High Field-Effect Mobility among Wide-Band-Gap Semiconductors.

    PubMed

    Shih, Cheng Wei; Chin, Albert

    2016-08-01

    At an ultrathin 5 nm, we report a new high-mobility tin oxide (SnO2) metal-oxide-semiconductor field-effect transistor (MOSFET) exhibiting extremely high field-effect mobility values of 279 and 255 cm(2)/V-s at 145 and 205 °C, respectively. These values are the highest reported mobility values among all wide-band-gap semiconductors of GaN, SiC, and metal-oxide MOSFETs, and they also exceed those of silicon devices at the aforementioned elevated temperatures. For the first time among existing semiconductor transistors, a new device physical phenomenon of a higher mobility value was measured at 45-205 °C than at 25 °C, which is due to the lower optical phonon scattering by the large SnO2 phonon energy. Moreover, the high on-current/off-current of 4 × 10(6) and the positive threshold voltage of 0.14 V at 25 °C are significantly better than those of a graphene transistor. This wide-band-gap SnO2 MOSFET exhibits high mobility in a 25-205 °C temperature range, a wide operating voltage of 1.5-20 V, and the ability to form on an amorphous substrate, rendering it an ideal candidate for multifunctional low-power integrated circuit (IC), display, and brain-mimicking three-dimensional IC applications. PMID:27454211

  5. Anomalous Random Telegraph Signal Extractions from a Very Large Number of n-Metal Oxide Semiconductor Field-Effect Transistors Using Test Element Groups with 0.47 Hz-3.0 MHz Sampling Frequency

    NASA Astrophysics Data System (ADS)

    Abe, Kenichi; Fujisawa, Takafumi; Teramoto, Akinobu; Watabe, Shunichi; Sugawa, Shigetoshi; Ohmi, Tadahiro

    2009-04-01

    Random telegraph signal (RTS) noise in small gate area metal oxide semiconductor (MOS) transistors occurs frequently and causes serious problems in the field of flash memories and complementary MOS (CMOS) image sensors. The trap in the gate insulator, which is considered the origin of RTS, varies widely in terms of spatial location and energy level, so that RTS characteristics including the amplitude and time constants have large variability by nature and statistical analysis of RTS should become indispensable. In this paper, we propose a high-speed RTS measurement system with a newly developed test circuit and discuss the drain current and temperature dependences of RTS amplitude distributions. Moreover, we expand the sampling frequency between 0.47 Hz-3.0 MHz and the observation length up to about 4 h and can thereby observe some anomalous RTSs such as ones with long time constants, ones generated abruptly, and ones disappearing.

  6. L{sub g} = 100 nm In{sub 0.7}Ga{sub 0.3}As quantum well metal-oxide semiconductor field-effect transistors with atomic layer deposited beryllium oxide as interfacial layer

    SciTech Connect

    Koh, D. E-mail: Taewoo.Kim@sematech.org; Kwon, H. M.; Kim, T.-W. E-mail: Taewoo.Kim@sematech.org; Veksler, D.; Gilmer, D.; Kirsch, P. D.; Kim, D.-H.; Hudnall, Todd W.; Bielawski, Christopher W.; Maszara, W.; Banerjee, S. K.

    2014-04-21

    In this study, we have fabricated nanometer-scale channel length quantum-well (QW) metal-oxide-semiconductor field effect transistors (MOSFETs) incorporating beryllium oxide (BeO) as an interfacial layer. BeO has high thermal stability, excellent electrical insulating characteristics, and a large band-gap, which make it an attractive candidate for use as a gate dielectric in making MOSFETs. BeO can also act as a good diffusion barrier to oxygen owing to its small atomic bonding length. In this work, we have fabricated In{sub 0.53}Ga{sub 0.47}As MOS capacitors with BeO and Al{sub 2}O{sub 3} and compared their electrical characteristics. As interface passivation layer, BeO/HfO{sub 2} bilayer gate stack presented effective oxide thickness less 1 nm. Furthermore, we have demonstrated In{sub 0.7}Ga{sub 0.3}As QW MOSFETs with a BeO/HfO{sub 2} dielectric, showing a sub-threshold slope of 100 mV/dec, and a transconductance (g{sub m,max}) of 1.1 mS/μm, while displaying low values of gate leakage current. These results highlight the potential of atomic layer deposited BeO for use as a gate dielectric or interface passivation layer for III–V MOSFETs at the 7 nm technology node and/or beyond.

  7. Facile fabrication of electrolyte-gated single-crystalline cuprous oxide nanowire field-effect transistors.

    PubMed

    Stoesser, Anna; von Seggern, Falk; Purohit, Suneeti; Nasr, Babak; Kruk, Robert; Dehm, Simone; Di Wang; Hahn, Horst; Dasgupta, Subho

    2016-10-14

    Oxide semiconductors are considered to be one of the forefront candidates for the new generation, high-performance electronics. However, one of the major limitations for oxide electronics is the scarcity of an equally good hole-conducting semiconductor, which can provide identical performance for the p-type metal oxide semiconductor field-effect transistors as compared to their electron conducting counterparts. In this quest, here we present a bulk synthesis method for single crystalline cuprous oxide (Cu2O) nanowires, their chemical and morphological characterization and suitability as active channel material in electrolyte-gated, low-power, field-effect transistors (FETs) for portable and flexible logic circuits. The bulk synthesis method used in the present study includes two steps: namely hydrothermal synthesis of the nanowires and the removal of the surface organic contaminants. The surface treated nanowires are then dispersed on a receiver substrate where the passive electrodes are structured, followed by printing of a composite solid polymer electrolyte (CSPE), chosen as the gate insulator. The characteristic electrical properties of individual nanowire FETs are found to be quite interesting including accumulation-mode operation and field-effect mobility of 0.15 cm(2) V(-1) s(-1). PMID:27609560

  8. Facile fabrication of electrolyte-gated single-crystalline cuprous oxide nanowire field-effect transistors

    NASA Astrophysics Data System (ADS)

    Stoesser, Anna; von Seggern, Falk; Purohit, Suneeti; Nasr, Babak; Kruk, Robert; Dehm, Simone; Wang, Di; Hahn, Horst; Dasgupta, Subho

    2016-10-01

    Oxide semiconductors are considered to be one of the forefront candidates for the new generation, high-performance electronics. However, one of the major limitations for oxide electronics is the scarcity of an equally good hole-conducting semiconductor, which can provide identical performance for the p-type metal oxide semiconductor field-effect transistors as compared to their electron conducting counterparts. In this quest, here we present a bulk synthesis method for single crystalline cuprous oxide (Cu2O) nanowires, their chemical and morphological characterization and suitability as active channel material in electrolyte-gated, low-power, field-effect transistors (FETs) for portable and flexible logic circuits. The bulk synthesis method used in the present study includes two steps: namely hydrothermal synthesis of the nanowires and the removal of the surface organic contaminants. The surface treated nanowires are then dispersed on a receiver substrate where the passive electrodes are structured, followed by printing of a composite solid polymer electrolyte (CSPE), chosen as the gate insulator. The characteristic electrical properties of individual nanowire FETs are found to be quite interesting including accumulation-mode operation and field-effect mobility of 0.15 cm2 V-1 s-1.

  9. Facile fabrication of electrolyte-gated single-crystalline cuprous oxide nanowire field-effect transistors.

    PubMed

    Stoesser, Anna; von Seggern, Falk; Purohit, Suneeti; Nasr, Babak; Kruk, Robert; Dehm, Simone; Di Wang; Hahn, Horst; Dasgupta, Subho

    2016-10-14

    Oxide semiconductors are considered to be one of the forefront candidates for the new generation, high-performance electronics. However, one of the major limitations for oxide electronics is the scarcity of an equally good hole-conducting semiconductor, which can provide identical performance for the p-type metal oxide semiconductor field-effect transistors as compared to their electron conducting counterparts. In this quest, here we present a bulk synthesis method for single crystalline cuprous oxide (Cu2O) nanowires, their chemical and morphological characterization and suitability as active channel material in electrolyte-gated, low-power, field-effect transistors (FETs) for portable and flexible logic circuits. The bulk synthesis method used in the present study includes two steps: namely hydrothermal synthesis of the nanowires and the removal of the surface organic contaminants. The surface treated nanowires are then dispersed on a receiver substrate where the passive electrodes are structured, followed by printing of a composite solid polymer electrolyte (CSPE), chosen as the gate insulator. The characteristic electrical properties of individual nanowire FETs are found to be quite interesting including accumulation-mode operation and field-effect mobility of 0.15 cm(2) V(-1) s(-1).

  10. Investigation of abnormal negative threshold voltage shift under positive bias stress in input/output n-channel metal-oxide-semiconductor field-effect transistors with TiN/HfO{sub 2} structure using fast I-V measurement

    SciTech Connect

    Ho, Szu-Han; Chen, Ching-En; Tseng, Tseung-Yuen; Chang, Ting-Chang Lu, Ying-Hsin; Tsai, Jyun-Yu; Liu, Kuan-Ju; Cheng, Osbert; Huang, Cheng-Tung; Lu, Ching-Sen

    2014-03-17

    This letter investigates abnormal negative threshold voltage shifts under positive bias stress in input/output (I/O) TiN/HfO{sub 2} n-channel metal-oxide-semiconductor field-effect transistors using fast I-V measurement. This phenomenon is attributed to a reversible charge/discharge effect in pre-existing bulk traps. Moreover, in standard performance devices, threshold-voltage (V{sub t}) shifts positively during fast I-V double sweep measurement. However, in I/O devices, V{sub t} shifts negatively since electrons escape from bulk traps to metal gate rather than channel electrons injecting to bulk traps. Consequently, decreasing pre-existing bulk traps in I/O devices, which can be achieved by adopting Hf{sub x}Zr{sub 1−x}O{sub 2} as gate oxide, can reduce the charge/discharge effect.

  11. Ambipolar organic field-effect transistors based on a low band gap semiconductor with balanced hole and electron mobilities

    NASA Astrophysics Data System (ADS)

    Chikamatsu, Masayuki; Mikami, Takefumi; Chisaka, Jiro; Yoshida, Yuji; Azumi, Reiko; Yase, Kiyoshi; Shimizu, Akihiro; Kubo, Takashi; Morita, Yasushi; Nakasuji, Kazuhiro

    2007-07-01

    The authors have demonstrated the thin-film properties and the ambipolar transport of a delocalized singlet biradical hydrocarbon with two phenalenyl radical moieties (Ph2-IDPL). The organic field-effect transistors (OFETs) based on Ph2-IDPL exhibit ambipolar transport with balanced hole and electron mobilities in the order of 10-3cm2/Vs. The Ph2-IDPL film is an organic semiconductor with a low band gap of 0.8eV and has small injection barriers from gold electrodes to both the highest occupied molecular orbital and the lowest unoccupied molecular orbital. A complementary metal-oxide-semiconductor-like inverter using two identical Ph2-IDPL based ambipolar OFETs shows a sharp inversion of the input voltage with high gain.

  12. Passivation of GaSb using molecular beam epitaxy Y{sub 2}O{sub 3} to achieve low interfacial trap density and high-performance self-aligned inversion-channel p-metal-oxide-semiconductor field-effect-transistors

    SciTech Connect

    Chu, R. L.; Chiang, T. H.; Hsueh, W. J.; Chyi, J. I.; Chen, K. H.; Lin, K. Y.; Hong, M. E-mail: mhong@phys.ntu.edu.tw; Brown, G. J.; Kwo, J. E-mail: mhong@phys.ntu.edu.tw

    2014-11-03

    Molecular beam epitaxy deposited rare-earth oxide of Y{sub 2}O{sub 3} has effectively passivated GaSb, leading to low interfacial trap densities of (1–4) × 10{sup 12 }cm{sup −2} eV{sup −1} across the energy bandgap of GaSb. A high saturation drain current density of 130 μA/μm, a peak transconductance of 90 μS/μm, a low subthreshold slope of 147 mV/decade, and a peak field-effect hole mobility of 200 cm{sup 2}/V-s were obtained in 1 μm-gate-length self-aligned inversion-channel GaSb p-Metal-Oxide-Semiconductor Field-Effect-Transistors (MOSFETs). In this work, high-κ/GaSb interfacial properties were better in samples with a high substrate temperature of 200 °C than in those with high κ's deposited at room temperature, in terms of the interfacial electrical properties, particularly, the reduction of interfacial trap densities near the conduction band and the MOSFET device performance.

  13. Transparent field-effect transistors based on AlN-gate dielectric and IGZO-channel semiconductor

    NASA Astrophysics Data System (ADS)

    Besleaga, C.; Stan, G. E.; Pintilie, I.; Barquinha, P.; Fortunato, E.; Martins, R.

    2016-08-01

    The degradation of thin-film transistors (TFTs) caused by the self-heating effect constitutes a problem to be solved for the next generation of displays. Aluminum nitride (AlN) is a viable alternative for gate dielectric of TFTs due to its good thermal conductivity, matching coefficient of thermal expansion to indium-gallium-zinc-oxide, and excellent stability at high temperatures. Here, AlN thin films of different thicknesses were fabricated by a low temperature reactive radio-frequency magnetron sputtering process, using a low cost, metallic Al target. Their electrical properties have been thoroughly assessed. Furthermore, the 200 nm and 500 nm thick AlN layers have been integrated as gate-dielectric in transparent TFTs with indium-gallium-zinc-oxide as channel semiconductor. Our study emphasizes the potential of AlN thin films for transparent electronics, whilst the functionality of the fabricated field-effect transistors is explored and discussed.

  14. n-Type reduced graphene oxide field-effect transistors (FETs) from photoactive metal oxides.

    PubMed

    Yoo, Heejoun; Kim, Youngmin; Lee, Junghyun; Lee, Hyemi; Yoon, Yeoheung; Kim, Giyoun; Lee, Hyoyoung

    2012-04-16

    Graphene is of considerable interest as a next-generation semiconductor material to serve as a possible substitute for silicon. For real device applications with complete circuits, effective n-type graphene field effect transistors (FETs) capable of operating even under atmospheric conditions are necessary. In this study, we investigated n-type reduced graphene oxide (rGO) FETs of photoactive metal oxides, such as TiO(2) and ZnO. These metal oxide doped FETs showed slight n-type electric properties without irradiation. Under UV light these photoactive materials readily generated electrons and holes, and the generated electrons easily transferred to graphene channels. As a result, the graphene FET showed strong n-type electric behavior and its drain current was increased. These n-doping effects showed saturation curves and slowly returned back to their original state in darkness. Finally, the n-type rGO FET was also highly stable in air due to the use of highly resistant metal oxides and robust graphene as a channel. PMID:22422712

  15. Controlled deposition or organic semiconductor single crystals and its application in field-effect transistors

    NASA Astrophysics Data System (ADS)

    Liu, Shuhong

    The search for low-cost, large area, flexible devices has led to a remarkable increase in the research and development of organic semiconductors. Single-crystal organic field-effect transistors (OFETs) are ideal device structures for studying fundamental science associated with charge transport in organic materials and have demonstrated high mobility and outstanding electrical characteristics. For example, an exceptionally high carrier mobility of 20 cm2/Vs has been demonstrated for rubrene single crystal field effect transistors. However, it remains a technical challenge to integrate single-crystal devices into practical electronic applications. A key difficulty is that organic single-crystal devices are usually fabricated one device at a time by handpicking a single crystal and placing it onto the device substrate. This makes it impossible to mass-produce at high density with reasonable throughput. Therefore, there is a great need for a high-throughput method for depositing large arrays of organic semiconductor single crystals directly onto device structures. In this dissertation, I develop several approaches towards realizing this goal. The first approach is a solution-processing technique, which relies on solvent wetting and de-wetting on substrates with patterned wettability to selectively direct the deposition or removal of organic crystals. The assembly of different organic crystals over centimeter-squared areas on Au, SiO 2 and flexible plastic substrates is demonstrated. By designing line features on the substrate, alignment of needle-like crystals is also achieved. As a demonstration of the potential application of this approach, arrays of organic single crystal FETs are fabricated by patterning organic single crystals directly onto and between transistor source and drain electrodes. Besides organic single crystals, this self-assembly strategy is also applicable for patterning other objects such as metallic nanowires. In the second technique, organic

  16. Graphene-graphite oxide field-effect transistors.

    PubMed

    Standley, Brian; Mendez, Anthony; Schmidgall, Emma; Bockrath, Marc

    2012-03-14

    Graphene's high mobility and two-dimensional nature make it an attractive material for field-effect transistors. Previous efforts in this area have used bulk gate dielectric materials such as SiO(2) or HfO(2). In contrast, we have studied the use of an ultrathin layered material, graphene's insulating analogue, graphite oxide. We have fabricated transistors comprising single or bilayer graphene channels, graphite oxide gate insulators, and metal top-gates. The graphite oxide layers show relatively minimal leakage at room temperature. The breakdown electric field of graphite oxide was found to be comparable to SiO(2), typically ~1-3 × 10(8) V/m, while its dielectric constant is slightly higher, κ ≈ 4.3.

  17. Method for manufacturing compound semiconductor field-effect transistors with improved DC and high frequency performance

    DOEpatents

    Zolper, John C.; Sherwin, Marc E.; Baca, Albert G.

    2000-01-01

    A method for making compound semiconductor devices including the use of a p-type dopant is disclosed wherein the dopant is co-implanted with an n-type donor species at the time the n-channel is formed and a single anneal at moderate temperature is then performed. Also disclosed are devices manufactured using the method. In the preferred embodiment n-MESFETs and other similar field effect transistor devices are manufactured using C ions co-implanted with Si atoms in GaAs to form an n-channel. C exhibits a unique characteristic in the context of the invention in that it exhibits a low activation efficiency (typically, 50% or less) as a p-type dopant, and consequently, it acts to sharpen the Si n-channel by compensating Si donors in the region of the Si-channel tail, but does not contribute substantially to the acceptor concentration in the buried p region. As a result, the invention provides for improved field effect semiconductor and related devices with enhancement of both DC and high-frequency performance.

  18. Crystal field effect induced topological crystalline insulators in monolayer IV-VI semiconductors.

    PubMed

    Liu, Junwei; Qian, Xiaofeng; Fu, Liang

    2015-04-01

    Two-dimensional (2D) topological crystalline insulators (TCIs) were recently predicted in thin films of the SnTe class of IV-VI semiconductors, which can host metallic edge states protected by mirror symmetry. As thickness decreases, quantum confinement effect will increase and surpass the inverted gap below a critical thickness, turning TCIs into normal insulators. Surprisingly, based on first-principles calculations, here we demonstrate that (001) monolayers of rocksalt IV-VI semiconductors XY (X = Ge, Sn, Pb and Y = S, Se, Te) are 2D TCIs with the fundamental band gap as large as 260 meV in monolayer PbTe. This unexpected nontrivial topological phase stems from the strong crystal field effect in the monolayer, which lifts the degeneracy between p(x,y) and p(z) orbitals and leads to band inversion between cation pz and anion px,y orbitals. This crystal field effect induced topological phase offers a new strategy to find and design other atomically thin 2D topological materials.

  19. Method for manufacturing compound semiconductor field-effect transistors with improved DC and high frequency performance

    SciTech Connect

    Zolper, J.C.; Sherwin, M.E.; Baca, A.G.

    2000-07-04

    A method for making compound semiconductor devices including the use of a p-type dopant is disclosed wherein the dopant is co-implanted with an n-type donor species at the time the n-channel is formed and a single anneal at moderate temperature is then performed. Also disclosed are devices manufactured using the method. In the preferred embodiment n-MESFETs and other similar field effect transistor devices are manufactured using C ions co-implanted with Si atoms in GaAs to form an n-channel. C exhibits a unique characteristic in the context of the invention in that it exhibits a low activation efficiency (typically, 50% or less) as a p-type dopant, and consequently, it acts to sharpen the Si n-channel by compensating Si donors in the region of the Si-channel tail, but does not contribute substantially to the acceptor concentration in the buried p region. As a result, the invention provides for improved field effect semiconductor and related devices with enhancement of both DC and high-frequency performance.

  20. Stability of In-Ga-Zn-O metal-semiconductor field-effect-transistors under bias, illumination, and temperature stress

    NASA Astrophysics Data System (ADS)

    Dang, Giang T.; Kawaharamura, Toshiyuki; Furuta, Mamoru; Saxena, Saurabh; Allen, Martin W.

    2015-10-01

    The stability of metal-semiconductor field-effect-transistors (MESFETs) with silver oxide Schottky gates on In-Ga-Zn-O (IGZO) channels, grown by mist chemical-vapor-deposition, was examined under different combinations of positive and negative bias, illumination, and temperature stress. These devices were remarkably stable, even under the most severe condition of negative-bias-illumination-temperature-stress (NBITS), where the threshold voltage shift after 10 h NBITS was only +0.12 V and was mainly attributed to a decrease in the carrier density of the channel. The stability of these IGZO MESFETs is associated with the use of a conducting Schottky gate that significantly reduces charge trapping at the gate-channel interface.

  1. Ferroelectric-field-effect-enhanced electroresistance in metal/ferroelectric/semiconductor tunnel junctions.

    PubMed

    Wen, Zheng; Li, Chen; Wu, Di; Li, Aidong; Ming, Naiben

    2013-07-01

    Ferroelectric tunnel junctions (FTJs), composed of two metal electrodes separated by an ultrathin ferroelectric barrier, have attracted much attention as promising candidates for non-volatile resistive memories. Theoretical and experimental works have revealed that the tunnelling resistance switching in FTJs originates mainly from a ferroelectric modulation on the barrier height. However, in these devices, modulation on the barrier width is very limited, although the tunnelling transmittance depends on it exponentially as well. Here we propose a novel tunnelling heterostructure by replacing one of the metal electrodes in a normal FTJ with a heavily doped semiconductor. In these metal/ferroelectric/semiconductor FTJs, not only the height but also the width of the barrier can be electrically modulated as a result of a ferroelectric field effect, leading to a greatly enhanced tunnelling electroresistance. This idea is implemented in Pt/BaTiO3/Nb:SrTiO3 heterostructures, in which an ON/OFF conductance ratio above 10(4), about one to two orders greater than those reported in normal FTJs, can be achieved at room temperature. The giant tunnelling electroresistance, reliable switching reproducibility and long data retention observed in these metal/ferroelectric/semiconductor FTJs suggest their great potential in non-destructive readout non-volatile memories.

  2. High-performance self-aligned inversion-channel In{sub 0.53}Ga{sub 0.47}As metal-oxide-semiconductor field-effect-transistors by in-situ atomic-layer-deposited HfO{sub 2}

    SciTech Connect

    Lin, T. D.; Chang, W. H.; Chang, Y. C.; Hong, M. E-mail: mhong@phys.ntu.edu.tw; Chu, R. L.; Chang, Y. H.; Lee, M. Y.; Hong, P. F.; Chen, Min-Cheng; Kwo, J. E-mail: mhong@phys.ntu.edu.tw

    2013-12-16

    Self-aligned inversion-channel In{sub 0.53}Ga{sub 0.47}As metal-oxide-semiconductor field-effect-transistors (MOSFETs) have been fabricated using the gate dielectrics of in-situ directly atomic-layer-deposited (ALD) HfO{sub 2} followed by ALD-Al{sub 2}O{sub 3}. There were no surface pretreatments and no interfacial passivation/barrier layers prior to the ALD. TiN/Al{sub 2}O{sub 3} (4 nm)/HfO{sub 2} (1 nm)/In{sub 0.53}Ga{sub 0.47}As/InP MOS capacitors exhibited well-behaved capacitance-voltage characteristics with true inversion behavior, low leakage current densities of ∼10{sup −8} A/cm{sup 2} at ±1 MV/cm, and thermodynamic stability at high temperatures. Al{sub 2}O{sub 3} (3 nm)/HfO{sub 2} (1 nm)/In{sub 0.53}Ga{sub 0.47}As MOSFETs of 1 μm gate length, with 700 °C–800 °C rapid thermal annealing in source/drain activation, have exhibited high extrinsic drain current (I{sub D}) of 1.5 mA/μm, transconductance (G{sub m}) of 0.84 mS/μm, I{sub ON}/I{sub OFF} of ∼10{sup 4}, low sub-threshold swing of 103 mV/decade, and field-effect electron mobility of 1100 cm{sup 2}/V · s. The devices have also achieved very high intrinsic I{sub D} and G{sub m} of 2 mA/μm and 1.2 mS/μm, respectively.

  3. A Novel Metal-Ferroelectric-Semiconductor Field-Effect Transistor Memory Cell Design

    NASA Technical Reports Server (NTRS)

    Phillips, Thomas A.; Bailey, Mark; Ho, Fat Duen

    2004-01-01

    The use of a Metal-Ferroelectric-Semiconductor Field-Effect Transistor (MFSFET) in a resistive-load SRAM memory cell has been investigated A typical two-transistor resistive-load SRAM memory cell architecture is modified by replacing one of the NMOS transistors with an n-channel MFSFET. The gate of the MFSFET is connected to a polling voltage pulse instead of the other NMOS transistor drain. The polling voltage pulses are of sufficient magnitude to saturate the ferroelectric gate material and force the MFSFET into a particular logic state. The memory cell circuit is further modified by the addition of a PMOS transistor and a load resistor in order to improve the retention characteristics of the memory cell. The retention characteristics of both the "1" and "0" logic states are simulated. The simulations show that the MFSFET memory cell design can maintain both the "1" and "0" logic states for a long period of time.

  4. Adaptation of the pseudo-metal-oxide-semiconductor field effect transistor technique to ultrathin silicon-on-insulator wafers characterization: Improved set-up, measurement procedure, parameter extraction, and modeling

    NASA Astrophysics Data System (ADS)

    Van Den Daele, W.; Malaquin, C.; Baumel, N.; Kononchuk, O.; Cristoloveanu, S.

    2013-10-01

    This paper revisits and adapts of the pseudo-MOSFET (Ψ-MOSFET) characterization technique for advanced fully depleted silicon on insulator (FDSOI) wafers. We review the current challenges for standard Ψ-MOSFET set-up on ultra-thin body (12 nm) over ultra-thin buried oxide (25 nm BOX) and propose a novel set-up enabling the technique on FDSOI structures. This novel configuration embeds 4 probes with large tip radius (100-200 μm) and low pressure to avoid oxide damage. Compared with previous 4-point probe measurements, we introduce a simplified and faster methodology together with an adapted Y-function. The models for parameters extraction are revisited and calibrated through systematic measurements of SOI wafers with variable film thickness. We propose an in-depth analysis of the FDSOI structure through comparison of experimental data, TCAD (Technology Computed Aided Design) simulations, and analytical modeling. TCAD simulations are used to unify previously reported thickness-dependent analytical models by analyzing the BOX/substrate potential and the electrical field in ultrathin films. Our updated analytical models are used to explain the results and to extract correct electrical parameters such as low-field electron and hole mobility, subthreshold slope, and film/BOX interface traps density.

  5. Crystalline ZrTiO{sub 4} gated p-metal–oxide–semiconductor field effect transistors with sub-nm equivalent oxide thickness featuring good electrical characteristics and reliability

    SciTech Connect

    Wu, Chao-Yi; Hsieh, Ching-Heng; Lee, Ching-Wei; Wu, Yung-Hsien

    2015-02-02

    ZrTiO{sub 4} crystallized in orthorhombic (o-) phase was stacked with an amorphous Yb{sub 2}O{sub 3} interfacial layer as the gate dielectric for Si-based p-MOSFETs. With thermal annealing after gate electrode, the gate stack with equivalent oxide thickness (EOT) of 0.82 nm achieves high dielectric quality by showing a low interface trap density (D{sub it}) of 2.75 × 10{sup 11 }cm{sup −2}eV{sup −1} near the midgap and low oxide traps. Crystallization of ZrTiO{sub 4} and post metal annealing are also proven to introduce very limited amount of metal induced gap states or interfacial dipole. The p-MOSFETs exhibit good sub-threshold swing of 75 mV/dec which is ascribed to the low D{sub it} value and small EOT. Owing to the Y{sub 2}O{sub 3} interfacial layer and smooth interface with Si substrate that, respectively, suppress phonon and surface roughness scattering, the p-MOSFETs also display high hole mobility of 49 cm{sup 2}/V-s at 1 MV/cm. In addition, I{sub on}/I{sub off} ratio larger than 10{sup 6} is also observed. From the reliability evaluation by negative bias temperature instability test, after stressing with an electric field of −10 MV/cm at 85 °C for 1000 s, satisfactory threshold voltage shift of 12 mV and sub-threshold swing degradation of 3% were obtained. With these promising characteristics, the Yb{sub 2}O{sub 3}/o-ZrTiO{sub 4} gate stack holds the great potential for next-generation electronics.

  6. Vacuum-and-solvent-free fabrication of organic semiconductor layers for field-effect transistors

    NASA Astrophysics Data System (ADS)

    Matsushima, Toshinori; Sandanayaka, Atula S. D.; Esaki, Yu; Adachi, Chihaya

    2015-09-01

    We demonstrate that cold and hot isostatic pressing (CIP and HIP) is a novel, alternative method for organic semiconductor layer fabrication, where organic powder is compressed into a layer shape directly on a substrate with 200 MPa pressure. Spatial gaps between powder particles and the other particles, substrates, or electrodes are crushed after CIP and HIP, making it possible to operate organic field-effect transistors (OFETs) containing the compressed powder as the semiconductor. The CIP-compressed powder of 2,7-dioctyl[1]benzothieno[3,2-b][1]benzothiophene (C8-BTBT) had a hole mobility of (1.6 ± 0.4) × 10-2 cm2/Vs. HIP of C8-BTBT powder increased the hole mobility to an amorphous silicon-like value (0.22 ± 0.07 cm2/Vs) because of the growth of the C8-BTBT crystallites and the improved continuity between the powder particles. The vacuum and solution processes are not involved in our CIP and HIP techniques, offering a possibility of manufacturing OFETs at low cost.

  7. Vacuum-and-solvent-free fabrication of organic semiconductor layers for field-effect transistors

    PubMed Central

    Matsushima, Toshinori; Sandanayaka, Atula S. D.; Esaki, Yu; Adachi, Chihaya

    2015-01-01

    We demonstrate that cold and hot isostatic pressing (CIP and HIP) is a novel, alternative method for organic semiconductor layer fabrication, where organic powder is compressed into a layer shape directly on a substrate with 200 MPa pressure. Spatial gaps between powder particles and the other particles, substrates, or electrodes are crushed after CIP and HIP, making it possible to operate organic field-effect transistors (OFETs) containing the compressed powder as the semiconductor. The CIP-compressed powder of 2,7-dioctyl[1]benzothieno[3,2-b][1]benzothiophene (C8-BTBT) had a hole mobility of (1.6 ± 0.4) × 10–2 cm2/Vs. HIP of C8-BTBT powder increased the hole mobility to an amorphous silicon-like value (0.22 ± 0.07 cm2/Vs) because of the growth of the C8-BTBT crystallites and the improved continuity between the powder particles. The vacuum and solution processes are not involved in our CIP and HIP techniques, offering a possibility of manufacturing OFETs at low cost. PMID:26416434

  8. Room-temperature terahertz detectors based on semiconductor nanowire field-effect transistors.

    PubMed

    Vitiello, Miriam S; Coquillat, Dominique; Viti, Leonardo; Ercolani, Daniele; Teppe, Frederic; Pitanti, Alessandro; Beltram, Fabio; Sorba, Lucia; Knap, Wojciech; Tredicucci, Alessandro

    2012-01-11

    The growth of semiconductor nanowires (NWs) has recently opened new paths to silicon integration of device families such as light-emitting diodes, high-efficiency photovoltaics, or high-responsivity photodetectors. It is also offering a wealth of new approaches for the development of a future generation of nanoelectronic devices. Here we demonstrate that semiconductor nanowires can also be used as building blocks for the realization of high-sensitivity terahertz detectors based on a 1D field-effect transistor configuration. In order to take advantage of the low effective mass and high mobilities achievable in III-V compounds, we have used InAs nanowires, grown by vapor-phase epitaxy, and properly doped with selenium to control the charge density and to optimize source-drain and contact resistance. The detection mechanism exploits the nonlinearity of the transfer characteristics: the terahertz radiation field is fed at the gate-source electrodes with wide band antennas, and the rectified signal is then read at the output in the form of a DC drain voltage. Significant responsivity values (>1 V/W) at 0.3 THz have been obtained with noise equivalent powers (NEP) < 2 × 10(-9) W/(Hz)(1/2) at room temperature. The large existing margins for technology improvements, the scalability to higher frequencies, and the possibility of realizing multipixel arrays, make these devices highly competitive as a future solution for terahertz detection. PMID:22149118

  9. Low dielectric constant-based organic field-effect transistors and metal-insulator-semiconductor capacitors

    NASA Astrophysics Data System (ADS)

    Ukah, Ndubuisi Benjamin

    This thesis describes a study of PFB and pentacene-based organic field-effect transistors (OFET) and metal-insulator-semiconductor (MIS) capacitors with low dielectric constant (k) poly(methyl methacrylate) (PMMA), poly(4-vinyl phenol) (PVP) and cross-linked PVP (c-PVP) gate dielectrics. A physical method -- matrix assisted pulsed laser evaporation (MAPLE) -- of fabricating all-polymer field-effect transistors and MIS capacitors that circumvents inherent polymer dissolution and solvent-selectivity problems, is demonstrated. Pentacene-based OFETs incorporating PMMA and PVP gate dielectrics usually have high operating voltages related to the thickness of the dielectric layer. Reduced PMMA layer thickness (≤ 70 nm) was obtained by dissolving the PMMA in propylene carbonate (PC). The resulting pentacene-based transistors exhibited very low operating voltage (below -3 V), minimal hysteresis in their transfer characteristics, and decent electrical performance. Also low voltage (within -2 V) operation using thin (≤ 80 nm) low-k and hydrophilic PVP and c-PVP dielectric layers obtained via dissolution in high dipole moment and high-k solvents -- PC and dimethyl sulfoxide (DMSO), is demonstrated to be a robust means of achieving improved electrical characteristics and high operational stability in OFETs incorporating PVP and c-PVP dielectrics.

  10. Systematic structural and chemical characterization of the transition layer at the interface of NO-annealed 4H-SiC/SiO2 metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Taillon, Joshua A.; Hyuk Yang, Joon; Ahyi, Claude A.; Rozen, John; Williams, John R.; Feldman, Leonard C.; Zheleva, Tsvetanka S.; Lelis, Aivars J.; Salamanca-Riba, Lourdes G.

    2013-01-01

    We present a systematic characterization of the transition layer at the 4H-SiC/SiO2 interface as a function of nitric oxide (NO) post-annealing time, using high-resolution transmission electron microscopy for structural characterization and spatially resolved electron energy-loss spectroscopy for chemical analysis. We propose a systematic method for determining transition layer width by measuring the monotonic chemical shift of the Si-L2,3 edge across the interface, and compare its efficacy to traditional measures from the literature, revealing the proposed method to be most reliable. A gradual shift in the Si-L2,3 edge onset energy suggests mixed Si-C/Si-O bonding in the transition layer. We confirm an inverse relationship between NO-anneal time and transition layer width, which correlates with improved channel mobility, enhanced N density at the interface, and decreased interface trap density. No excess C was noted in the interfacial region.

  11. Electrospun Polyaniline/Polyethylene Oxide Nanofiber Field Effect Transistor

    NASA Technical Reports Server (NTRS)

    Pinto, N. J.; Johnson, A. T.; MacDiarmid, A. G.; Mueller, C. H.; Theofylaktos, N.; Robinson, D. C.; Miranda, F. A.

    2003-01-01

    We report on the observation of field effect transistor (FET) behavior in electrospun camphorsulfonic acid doped polyaniline(PANi)/polyethylene oxide(PE0) nanofibers. Saturation channel currents are observed at surprisingly low source/drain voltages. The hole mobility in the depletion regime is 1.4 x 10(exp -4) sq cm/V s while the 1-D charge density (at zero gate bias) is calculated to be approximately 1 hole per 50 two-ring repeat units of polyaniline, consistent with the rather high channel conductivity (approx. 10(exp -3) S/cm). Reducing or eliminating the PEO content in the fiber is expected to enhance device parameters. Electrospinning is thus proposed as a simple method of fabricating 1-D polymer FET's.

  12. Solution-Processed Donor-Acceptor Polymer Nanowire Network Semiconductors For High-Performance Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Lei, Yanlian; Deng, Ping; Li, Jun; Lin, Ming; Zhu, Furong; Ng, Tsz-Wai; Lee, Chun-Sing; Ong, Beng S.

    2016-04-01

    Organic field-effect transistors (OFETs) represent a low-cost transistor technology for creating next-generation large-area, flexible and ultra-low-cost electronics. Conjugated electron donor-acceptor (D-A) polymers have surfaced as ideal channel semiconductor candidates for OFETs. However, high-molecular weight (MW) D-A polymer semiconductors, which offer high field-effect mobility, generally suffer from processing complications due to limited solubility. Conversely, the readily soluble, low-MW D-A polymers give low mobility. We report herein a facile solution process which transformed a lower-MW, low-mobility diketopyrrolopyrrole-dithienylthieno[3,2-b]thiophene (I) into a high crystalline order and high-mobility semiconductor for OFETs applications. The process involved solution fabrication of a channel semiconductor film from a lower-MW (I) and polystyrene blends. With the help of cooperative shifting motion of polystyrene chain segments, (I) readily self-assembled and crystallized out in the polystyrene matrix as an interpenetrating, nanowire semiconductor network, providing significantly enhanced mobility (over 8 cm2V‑1s‑1), on/off ratio (107), and other desirable field-effect properties that meet impactful OFET application requirements.

  13. Solution-Processed Donor-Acceptor Polymer Nanowire Network Semiconductors For High-Performance Field-Effect Transistors.

    PubMed

    Lei, Yanlian; Deng, Ping; Li, Jun; Lin, Ming; Zhu, Furong; Ng, Tsz-Wai; Lee, Chun-Sing; Ong, Beng S

    2016-01-01

    Organic field-effect transistors (OFETs) represent a low-cost transistor technology for creating next-generation large-area, flexible and ultra-low-cost electronics. Conjugated electron donor-acceptor (D-A) polymers have surfaced as ideal channel semiconductor candidates for OFETs. However, high-molecular weight (MW) D-A polymer semiconductors, which offer high field-effect mobility, generally suffer from processing complications due to limited solubility. Conversely, the readily soluble, low-MW D-A polymers give low mobility. We report herein a facile solution process which transformed a lower-MW, low-mobility diketopyrrolopyrrole-dithienylthieno[3,2-b]thiophene (I) into a high crystalline order and high-mobility semiconductor for OFETs applications. The process involved solution fabrication of a channel semiconductor film from a lower-MW (I) and polystyrene blends. With the help of cooperative shifting motion of polystyrene chain segments, (I) readily self-assembled and crystallized out in the polystyrene matrix as an interpenetrating, nanowire semiconductor network, providing significantly enhanced mobility (over 8 cm(2)V(-1)s(-1)), on/off ratio (10(7)), and other desirable field-effect properties that meet impactful OFET application requirements. PMID:27091315

  14. Solution-Processed Donor-Acceptor Polymer Nanowire Network Semiconductors For High-Performance Field-Effect Transistors

    PubMed Central

    Lei, Yanlian; Deng, Ping; Li, Jun; Lin, Ming; Zhu, Furong; Ng, Tsz-Wai; Lee, Chun-Sing; Ong, Beng S.

    2016-01-01

    Organic field-effect transistors (OFETs) represent a low-cost transistor technology for creating next-generation large-area, flexible and ultra-low-cost electronics. Conjugated electron donor-acceptor (D-A) polymers have surfaced as ideal channel semiconductor candidates for OFETs. However, high-molecular weight (MW) D-A polymer semiconductors, which offer high field-effect mobility, generally suffer from processing complications due to limited solubility. Conversely, the readily soluble, low-MW D-A polymers give low mobility. We report herein a facile solution process which transformed a lower-MW, low-mobility diketopyrrolopyrrole-dithienylthieno[3,2-b]thiophene (I) into a high crystalline order and high-mobility semiconductor for OFETs applications. The process involved solution fabrication of a channel semiconductor film from a lower-MW (I) and polystyrene blends. With the help of cooperative shifting motion of polystyrene chain segments, (I) readily self-assembled and crystallized out in the polystyrene matrix as an interpenetrating, nanowire semiconductor network, providing significantly enhanced mobility (over 8 cm2V−1s−1), on/off ratio (107), and other desirable field-effect properties that meet impactful OFET application requirements. PMID:27091315

  15. Modeling of a Metal-Ferroelectric-Semiconductor Field-Effect Transistor NAND Gate

    NASA Technical Reports Server (NTRS)

    Phillips, Thomas A.; MacLeod, Todd C.; Ho, Fat Duen

    2005-01-01

    Considerable research has been performed by several organizations in the use of the Metal- Ferroelectric-Semiconductor Field-Effect Transistors (MFSFET) in memory circuits. However, research has been limited in expanding the use of the MFSFET to other electronic circuits. This research project investigates the modeling of a NAND gate constructed from MFSFETs. The NAND gate is one of the fundamental building blocks of digital electronic circuits. The first step in forming a NAND gate is to develop an inverter circuit. The inverter circuit was modeled similar to a standard CMOS inverter. A n-channel MFSFET with positive polarization was used for the n-channel transistor, and a n-channel MFSFET with negative polarization was used for the p-channel transistor. The MFSFETs were simulated by using a previously developed current model which utilized a partitioned ferroelectric layer. The inverter voltage transfer curve was obtained over a standard input of zero to five volts. Then a 2-input NAND gate was modeled similar to the inverter circuit. Voltage transfer curves were obtained for the NAND gate for various configurations of input voltages. The resultant data shows that it is feasible to construct a NAND gate with MFSFET transistors.

  16. Diamond logic inverter with enhancement-mode metal-insulator-semiconductor field effect transistor

    SciTech Connect

    Liu, J. W.; Liao, M. Y.; Imura, M.; Watanabe, E.; Oosato, H.; Koide, Y.

    2014-08-25

    A diamond logic inverter is demonstrated using an enhancement-mode hydrogenated-diamond metal-insulator-semiconductor field effect transistor (MISFET) coupled with a load resistor. The gate insulator has a bilayer structure of a sputtering-deposited LaAlO{sub 3} layer and a thin atomic-layer-deposited Al{sub 2}O{sub 3} buffer layer. The source-drain current maximum, extrinsic transconductance, and threshold voltage of the MISFET are measured to be −40.7 mA·mm{sup −1}, 13.2 ± 0.1 mS·mm{sup −1}, and −3.1 ± 0.1 V, respectively. The logic inverters show distinct inversion (NOT-gate) characteristics for input voltages ranging from 4.0 to −10.0 V. With increasing the load resistance, the gain of the logic inverter increases from 5.6 to as large as 19.4. The pulse response against the high and low input voltages shows the inversion response with the low and high output voltages.

  17. Metal-Ferroelectric-Semiconductor Field-Effect Transistor NAND Gate Switching Time Analysis

    NASA Technical Reports Server (NTRS)

    Phillips, Thomas A.; Macleod, Todd C.; Ho, Fat D.

    2006-01-01

    Previous research investigated the modeling of a N Wga te constructed of Metal-Ferroelectric- Semiconductor Field-Effect Transistors (MFSFETs) to obtain voltage transfer curves. The NAND gate was modeled using n-channel MFSFETs with positive polarization for the standard CMOS n-channel transistors and n-channel MFSFETs with negative polarization for the standard CMOS p-channel transistors. This paper investigates the MFSFET NAND gate switching time propagation delay, which is one of the other important parameters required to characterize the performance of a logic gate. Initially, the switching time of an inverter circuit was analyzed. The low-to-high and high-to-low propagation time delays were calculated. During the low-to-high transition, the negatively polarized transistor pulls up the output voltage, and during the high-to-low transition, the positively polarized transistor pulls down the output voltage. The MFSFETs were simulated by using a previously developed model which utilized a partitioned ferroelectric layer. Then the switching time of a 2-input NAND gate was analyzed similarly to the inverter gate. Extension of this technique to more complicated logic gates using MFSFETs will be studied.

  18. Integrating Partial Polarization into a Metal-Ferroelectric-Semiconductor Field Effect Transistor Model

    NASA Technical Reports Server (NTRS)

    MacLeod, Todd C.; Ho, Fat Duen

    1999-01-01

    The ferroelectric channel in a Metal-Ferroelectric-Semiconductor Field Effect Transistor (MFSFET) can partially change its polarization when the gate voltage near the polarization threshold voltage. This causes the MFSFET Drain current to change with repeated pulses of the same gate voltage near the polarization threshold voltage. A previously developed model [11, based on the Fermi-Dirac function, assumed that for a given gate voltage and channel polarization, a sin-le Drain current value would be generated. A study has been done to characterize the effects of partial polarization on the Drain current of a MFSFET. These effects have been described mathematically and these equations have been incorporated into a more comprehensive mathematical model of the MFSFET. The model takes into account the hysteresis nature of the MFSFET and the time dependent decay as well as the effects of partial polarization. This model defines the Drain current based on calculating the degree of polarization from previous gate pulses, the present Gate voltage, and the amount of time since the last Gate volta-e pulse.

  19. A Pt-Ti-O gate Si-metal-insulator-semiconductor field-effect transistor hydrogen gas sensor

    NASA Astrophysics Data System (ADS)

    Usagawa, Toshiyuki; Kikuchi, Yota

    2010-10-01

    A hydrogen gas sensor based on platinum-titanium-oxygen (Pt-Ti-O) gate silicon-metal-insulator-semiconductor field-effect transistors (Si-MISFETs) was developed. The sensor has a unique gate structure composed of titanium and oxygen accumulated around platinum grains on top of a novel mixed layer of nanocrystalline TiOx and superheavily oxygen-doped amorphous titanium formed on SiO2/Si substrates. The FET hydrogen sensor shows high reliability and high sensing amplitude (Δ Vg) defined by the magnitude of the threshold voltage shift. Δ Vg is well fitted by a linear function of the logarithm of air-diluted hydrogen concentration C (ppm), i.e., Δ Vg(V) =0.355 log C(ppm ) -0.610 , between 100 ppm and 1%. This high gradient coefficient of Δ Vg for the wide sensing range demonstrates that the sensor is suitable for most hydrogen-safety-monitoring sensor systems. The Pt-Ti-O structures of the sensor are typically realized by annealing Pt (15 nm)/Ti (5 nm)-gate Si-metal-oxide-semiconductor structures in air at 400 °C for 2 h. The Pt-Ti-O gate MIS structures were analyzed by transmission electron microscope (TEM), x-ray diffraction, Auger electron spectroscopy, and TEM energy dispersive x-ray spectroscopy. From the viewpoint of practical sensing applications, hydrogen postannealing of the Pt-Ti-O gate Si-MISFETs is necessary to reduce the residual sensing amplitudes with long tailing profiles.

  20. Automated semiconductor diffusion and oxidation facility

    NASA Technical Reports Server (NTRS)

    1982-01-01

    A semiconductor diffusion and oxidation facility (totally automated) was developed. Wafers arrived on an air track, automatically loaded into a furnace tube, processed, returned to track, and sent on to the next process. The entire process was controlled by a computer.

  1. Influence of Temperature Variation on Field Effect Transistor Properties Using a Solution-Processed Liquid Crystalline Semiconductor, 8TNAT8.

    PubMed

    Monobe, Hirosato; Kimoto, Masaomi; Shimizu, Yo

    2016-04-01

    In this study, we used a liquid crystalline (LC) semiconductor, 8TNAT8, solution (e.g., 0.1 wt% in toluene) for forming an organic semiconductor layer by solution casting method, and fabricated bottom-gate/bottom-contact type field effect transistors (FETs). These LC semiconductors show FET characteristic properties and have high carrier mobility of 0.01 cm2 V-1 s-1. We have investigated the surface morphology and the influence of temperature variation on LC FET properties across the phase transition from crystal to mesophase of a LC semiconductor, 8TNAT8. In the most cases, FET mobility was irreversibly decreased after. temperature heat stress above the melting point of 8TNAT8, owing to the morphological change of LC layer. PMID:27451617

  2. Control of normally on/off characteristics in hydrogenated diamond metal-insulator-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Liu, J. W.; Liao, M. Y.; Imura, M.; Matsumoto, T.; Shibata, N.; Ikuhara, Y.; Koide, Y.

    2015-09-01

    Normally on/off operation in hydrogenated diamond (H-diamond) metal-insulator-semiconductor field-effect transistors (MISFETs) is reproducibly controlled by annealing at 180 °C. The transfer characteristics of the MISFETs reveal that the threshold gate voltage changes from 0.8 ± 0.1 to -0.5 ± 0.1 V after annealing, which indicates the MISFETs switch from normally on to normally off operation. Annealing also shifts the flat-band voltage in the capacitance-voltage curve of MIS capacitors from zero to -0.47 V. The mechanism behind the switch of normally on/off characteristics induced by annealing is explained by a change of transfer doping as follows. Adsorbed acceptors at the insulator/H-diamond interface allow the holes to accumulate in the H-diamond channel layer, so the MISFETs before annealing show normally on characteristics. Annealing causes loss of the adsorbed acceptors or provides compensatory positive charge in the insulator oxide, so the hole density in the H-diamond channel layer decreases markedly, and the MISFETs show normally off characteristics.

  3. Compound semiconductor oxide antireflection coatings

    NASA Astrophysics Data System (ADS)

    Knopp, K. J.; Mirin, R. P.; Bertness, K. A.; Silverman, K. L.; Christensen, D. H.

    2000-05-01

    We report the development of high quality, broad-bandwidth, antireflection (AR) coatings using the low index provided by wet thermally oxidized Al0.98Ga0.02As. We address the design criteria, fabrication, and characterizations of AR coatings composed of surface and buried oxide layers on GaAs. We show, using native-oxide dispersion data, that surface oxide coatings can be designed to offer a nearly zero minimum of reflectance and a reflectance of <1% over bandwidths as large as 500 nm. Surface coatings having a reflectance minimum of 0.4% and a reflectance of <1% over >250 nm have been experimentally demonstrated at a design wavelength of 1 micrometer. Additionally, buried oxide coatings can be designed with an AlxGa1-xAs matching layer of any composition to exactly match the admittance of any substrate with effective index between 2.5 and 3.5. We have demonstrated buried oxide coatings, also designed for 1 micrometer, having a reflectance minimum of 0.4% and a reflectance of <1% over 21 nm. The calculated optical scattering loss from measured roughness data indicates that reflectance minima as low as 10-4 % are ultimately achievable with native-oxide antireflection coatings.

  4. "Liquid-liquid-solid"-type superoleophobic surfaces to pattern polymeric semiconductors towards high-quality organic field-effect transistors.

    PubMed

    Wu, Yuchen; Su, Bin; Jiang, Lei; Heeger, Alan J

    2013-12-01

    Precisely aligned organic-liquid-soluble semiconductor microwire arrays have been fabricated by "liquid-liquid-solid" type superoleophobic surfaces directed fluid drying. Aligned organic 1D micro-architectures can be built as high-quality organic field-effect transistors with high mobilities of >10 cm(2) ·V(-1) ·s(-1) and current on/off ratio of more than 10(6) . All these studies will boost the development of 1D microstructures of organic semiconductor materials for potential application in organic electronics.

  5. Investigating Organic Field Effect Transistors with Reduced Graphene Oxide Electrodes of Different Reduction Efficiency

    NASA Astrophysics Data System (ADS)

    Kang, Narae; Khondaker, Saiful I.

    2014-03-01

    Organic field-effect transistors (OFETs) have received much attention owing to their flexibility, transparency, and low-cost of fabrication. One of the major limiting factors in fabricating high-performance OFET is the large injection barrier at metal electrodes/organic semiconductor interface, which results in low charge injection from metal electrodes to organic semiconductor. Graphene has been suggested as an alternative electrode material due to its high work function, extraordinary electronic properties and strong π- π interaction with organic molecule; all of which can reduce the injection barrier at the electrode/organic interface. In particular, due to its solubility, large scale production, and its chemical functionality, reduced graphene oxide (RGO) has been introduced as a promising electrode for OFETs. Its tunability of electrical and optical properties can make RGO a highly desired electrode material because the work function match is essential for better charge injection at electrode/organic interface. In this talk, we will discuss the fabrication of OFETs with RGO of different reduction efficiency as an electrode material. We will also present the electrical transport properties fabricated devices.

  6. Method of physical vapor deposition of metal oxides on semiconductors

    DOEpatents

    Norton, David P.

    2001-01-01

    A process for growing a metal oxide thin film upon a semiconductor surface with a physical vapor deposition technique in a high-vacuum environment and a structure formed with the process involves the steps of heating the semiconductor surface and introducing hydrogen gas into the high-vacuum environment to develop conditions at the semiconductor surface which are favorable for growing the desired metal oxide upon the semiconductor surface yet is unfavorable for the formation of any native oxides upon the semiconductor. More specifically, the temperature of the semiconductor surface and the ratio of hydrogen partial pressure to water pressure within the vacuum environment are high enough to render the formation of native oxides on the semiconductor surface thermodynamically unstable yet are not so high that the formation of the desired metal oxide on the semiconductor surface is thermodynamically unstable. Having established these conditions, constituent atoms of the metal oxide to be deposited upon the semiconductor surface are directed toward the surface of the semiconductor by a physical vapor deposition technique so that the atoms come to rest upon the semiconductor surface as a thin film of metal oxide with no native oxide at the semiconductor surface/thin film interface. An example of a structure formed by this method includes an epitaxial thin film of (001)-oriented CeO.sub.2 overlying a substrate of (001) Ge.

  7. The Photoresponse of the Gallium Arsenide Metal Semiconductor Field Effect Transistor

    NASA Astrophysics Data System (ADS)

    Paolella, Arthur

    The combining of optical and microwave technology is imminent, especially the integration of optical and microwave circuit functions on the same circuit or chip. Exploring the properties of the metal semiconductor field effect transistor (MESFET) as an optical detector for the detection of microwave and control signals in fiber optic links make sense because the MESFET is the main active component of GaAs MMICs. In this thesis, photocurrents and photovoltages of three MESFETs were measured as a function of the optical input (wavelength, intensity and modulation frequency), electrical input (gate voltage and gate resistance), and device characteristics. A model of the photoresponse, based on the drift and diffusion equations for the current density was developed, which established the internal photovoltaic effect at the channel-substrate interface as the dominant mechanism for the generation of photocurrent in the MESFET. The gain, bandwidth and gain-bandwidth products for each of the major photoeffects were determined mathematically. A maximum photocurrent of 16 mA, and an internal photovoltage of -0.5 volts was measured at 3.5 mW of optical power. The addition of a resistance in the gate circuit enhanced the photoresponse. With a resistor of 1 MOmega, the maximum photocurrent produced was 84.0 mA, resulting from an external photovoltage of 3.07 volts. The dynamic photoresponse of the MESFET as measured, showed a strong dependence with the intensity of the optical signal as well as with bias. The low frequency response varied from -15 dB to -41 dB, and the bandwidth changed from 50 MHz to 5 MHz as the optical signal decreased 18 dB. The low frequency response and bandwidth also showed strong dependence of bias. The low frequency response varied over a 7 dB range and the bandwidth changed from 45 MHz to 100 MHz as the gate was reversed biased (0 to -3.0 volts). Used as an optical detector, the MESFET function successfully in controlling the gain (15 dB) and phase

  8. Field effect and magnetically induced capacitive tuning in hole doped lanthanum(1-x) strontium(x) manganese oxide

    NASA Astrophysics Data System (ADS)

    Marton, Zsolt

    Electrostatic modulation of interface conduction between semiconductors and insulating oxides is the foundation of semiconductor technology. This field effect concept can be applied on complex oxides, such as high temperature superconductors and colossal magnetoresistive manganites, in order to create new electronic and magnetic phases. Competition and coexistence of multiple nanoscale phases make them exciting to study around phase transitions. This study on hole doped La1-xSrxMnO3 systems has a two-fold purpose. One is the demonstration of the field effect on La1-xSr xMnO3 (x = 0.125, 0.2, 0.3, 0.5) thin films. It is an important step towards electrostatic control of material properties, however, a challenging task because of their charge carrier densities of 0.01-1 hole/unit cell, a few orders of magnitude larger than in doped semiconductors. Control by linear dielectrics needs huge, constantly applied bias. Energy efficient tuning with low voltages requires highly polar ferroelectric. Pb(Zr0.2Ti 0.8)O3 was chosen, whose remanence provides 0.5 charge carrier/unit cell on the manganite/ferroelectric interface. La1-xSrxMnO 3/Pb(Zr0.2Ti0.8)O3 heterostructures were synthesized by pulsed laser epitaxy and remarkable conduction modifications were observed in the La1-xSrxMnO3. This can be a strong foundation of a new tool to research electronic oxides. The second purpose of this work is to utilize the phase separation in manganites. There has been extensive research on multiferroic materials, in which dielectric and magnetic responses are controlled by magnetic and electric field, respectively. In order to demonstrate magnetically tuned capacitance, insulating La7/8Sr1/8MnO3 was studied. Drastic capacitance change in magnetic field was shown through a phase transitions and explained in the framework of electronic phase separation. It makes this material eligible for high frequency magnetoelectric applications. Modulating charge carriers, mobility and magnetism in

  9. Theory aided design and analysis of dielectric and semiconductor components for organic field-effect transistors

    NASA Astrophysics Data System (ADS)

    Dibenedetto, Sara Arlene

    Perfluoroacyl/acyl-derivatized quaterthiophens are developed and synthesized. The frontier molecular orbital energies of these compounds are studied by optical spectroscopy and electrochemistry while solid-state/film properties are investigated by thermal analysis, x-ray diffraction, and scanning electron microscopy. Organic thin film transistors (OTFTs) performance parameters are discussed in terms of the interplay between semiconductor molecular energetics and film morphologies/microstructures. The majority charge carrier type and mobility exhibit a strong correlation with the regiochemistry of perfluoroarene incorporation. In quaterthiophene-based semiconductors, carbonyl-functionalization allows tuning of the majority carrier type from p-type to ambipolar and to n-type. In situ conversion of a p-type semiconducting film to n-type film is also demonstrated. The design of chemical and film microstructural alternative hybrid organic-inorganic gate dielectrics is described using the classic Clausius-Mossotti relation. The Maxwell-Wagner effective medium model is used to compute the effective dielectric permittivity of two types of dielectrics self-assembled nanodielectrics (SANDs) and crosslinked polymer blends (CPBs). In these calculations showing good agreement between theory and experiment, it is found that greater capacitances should be achievable with mixed composites than with layered composites. With this insight, a series of mixed metal oxide-polyolefin nanocomposites is synthesized via in-situ olefin polymerization using the single-site metallocene catalysts. By integrating organic and inorganic constituents, the resulting hybrid material exhibit high permittivity (from the inorganic inclusions) and high breakdown strength, mechanical flexibility, and facile processability (from the polymer matrices). In order to better optimize the capacitance and leakage current of hybrid organic-inorganic dielectrics, the capacitance, leakage current and OFET gate

  10. Solution combustion synthesis of oxide semiconductors

    NASA Astrophysics Data System (ADS)

    Thomas, Abegayl Lorenda Shara-Lynn

    The quest for stable and efficient photocatalytic materials beyond TiO2 and WO3 has over the years led to the development of new materials that possess varied interfacial energetics. This dissertation study focused on using for the first time a novel method, solution combustion synthesis (SCS), to prepare two distinct families of binary metal-based oxide semiconductor materials. Detailed studies on material characteristics and applications were carried out on tungsten- and niobium-based oxide semiconductors with varying principal metals. Initial emphasis was placed on the SCS of tungsten-based oxide semiconductors (ZnWO4, CuWO4, and Ag2WO4). The influence of different tungsten precursor's on the resultant product was of particular relevance to this study, with the most significant effects highlighted. Upon characterization, each sample's photocatalytic activity towards methyl orange dye degradation was studied, and benchmarked against their respective commercial oxide sample, obtained by solid-state ceramic synthesis. Detailed analysis highlighted the importance of the SCS process as a time- and energy-efficient method to produce crystalline nano-sized materials even without additional or excessive heat treatment. It was observed that using different tungstate precursors does influence the structural and morphological make-up of the resulting materials. The as-synthesized tungstate materials showed good photocatalytic performance for the degradation of methyl orange dye, while taking into account specific surface area and adsorbed dye amount on the surface of the material. Like the tungstate's, niobium-based oxide semiconductors CuNb 2O6 and ZnNb2O6 were the first to be synthesized via solution combustion synthesis. Particular attention was placed on the crystal structures formed while using an oxalate niobium precursor during the reaction process. X-ray patterns yielded a multiphase structure for the ZnNb2O6 and a single phase structure for CuNb 2O6

  11. High-performance carbon-nanotube-based complementary field-effect-transistors and integrated circuits with yttrium oxide

    SciTech Connect

    Liang, Shibo; Zhang, Zhiyong Si, Jia; Zhong, Donglai; Peng, Lian-Mao

    2014-08-11

    High-performance p-type carbon nanotube (CNT) transistors utilizing yttrium oxide as gate dielectric are presented by optimizing oxidization and annealing processes. Complementary metal-oxide-semiconductor (CMOS) field-effect-transistors (FETs) are then fabricated on CNTs, and the p- and n-type devices exhibit symmetrical high performances, especially with low threshold voltage near to zero. The corresponding CMOS CNT inverter is demonstrated to operate at an ultra-low supply voltage down to 0.2 V, while displaying sufficient voltage gain, high noise margin, and low power consumption. Yttrium oxide is proven to be a competitive gate dielectric for constructing high-performance CNT CMOS FETs and integrated circuits.

  12. Thin-film transistor fabricated in single-crystalline transparent oxide semiconductor.

    PubMed

    Nomura, Kenji; Ohta, Hiromichi; Ueda, Kazushige; Kamiya, Toshio; Hirano, Masahiro; Hosono, Hideo

    2003-05-23

    We report the fabrication of transparent field-effect transistors using a single-crystalline thin-film transparent oxide semiconductor, InGaO3(ZnO)5, as an electron channel and amorphous hafnium oxide as a gate insulator. The device exhibits an on-to-off current ratio of approximately 106 and a field-effect mobility of approximately 80 square centimeters per volt per second at room temperature, with operation insensitive to visible light irradiation. The result provides a step toward the realization of transparent electronics for next-generation optoelectronics. PMID:12764192

  13. High-performance GaAs metal-insulator-semiconductor field-effect transistors enabled by self-assembled nanodielectrics

    NASA Astrophysics Data System (ADS)

    Lin, H. C.; Ye, P. D.; Xuan, Y.; Lu, G.; Facchetti, A.; Marks, T. J.

    2006-10-01

    High-performance GaAs metal-insulator-semiconductor field-effect-transistors (MISFETs) fabricated with very thin self-assembled organic nanodielectrics (SANDs), deposited from solution at room temperature, are demonstrated. A submicron gate-length depletion-mode n-channel GaAs MISFET with SAND thicknesses ranging from 5.5to16.5nm exhibit a gate leakage current density <10-5A/cm2 at a gate bias smaller than 3V, a maximum drain current of 370mA/mm at a forward gate bias of 2V, and a maximum intrinsic transconductance of 170mS/mm. The importance of appropriate GaAs surface chemistry treatments on SAND/GaAs interface properties is also presented. Application of SANDs to III-V compound semiconductors affords more opportunities to manipulate the complex III-V surface chemistry with broad materials options.

  14. Oxide charge accumulation in metal oxide semiconductor devices during irradiation

    SciTech Connect

    Lee, D. ); Chan, C. )

    1991-05-15

    An analysis of a simple physical model for radiation induced oxide charge accumulation in the SiO{sub 2} layer of metal oxide semiconductor (MOS) structure has been developed. The model assumes that both electron and hole traps exist in the oxide layer. These traps can capture electrons as well as holes during irradiation. Using this model, final oxide charge distributions in the oxide layer of MOS capacitors exposed to a total dose radiation can be predicted. The resulting charge distribution is calculated to yield the midgap voltage shifts as functions of total dose, bias voltage, and oxide thickness. The results are shown to agree well with the experimental data. Furthermore, the model successfully analyzes the radiation-induced negative oxide charge distribution in an ion-implanted, radiation-hard MOS capacitor. These negative oxide charge distributions not only partially compensate the effects of trapped positive oxide charges but also reduced the density of positive oxide charges trapped near the Si/SiO{sub 2} interface. We found the reduction of the positive oxide charge density near the Si/SiO{sub 2} interface is due to internal electric field modification in the oxide layer.

  15. Enhanced mobility in organic field-effect transistors due to semiconductor/dielectric interface control and very thin single crystal

    NASA Astrophysics Data System (ADS)

    Dong, Ji; Yu, Peng; Atika Arabi, Syeda; Wang, Jiawei; He, Jun; Jiang, Chao

    2016-07-01

    A perfect organic crystal while keeping high quality semiconductor/dielectric interface with minimal defects and disorder is crucial for the realization of high performance organic single crystal field-effect transistors (OSCFETs). However, in most reported OSCFET devices, the crystal transfer processes is extensively used. Therefore, the semiconductor/dielectric interface is inevitably damaged. Carrier traps and scattering centers are brought into the conduction channel, so that the intrinsic high mobility of OSCFET devices is entirely disguised. Here, very thin pentacene single crystal is grown directly on bare SiO2 by developing a ‘seed-controlled’ pentacene single crystal method. The interface quality is controlled by an in situ fabrication of OSCFETs. The interface is kept intact without any transfer process. Furthermore, we quantitatively analyze the influence of crystal thickness on device performance. With a pristine interface and very thin crystal, we have achieved the highest mobility: 5.7 cm2 V‑1 s‑1—more than twice the highest ever reported pentacene OSCFET mobility on bare SiO2. This study may provide a universal route for the use of small organic molecules to achieve high performance in lamellar single crystal field-effect devices.

  16. Optically enhanced oxidation of III-V compound semiconductors

    NASA Astrophysics Data System (ADS)

    Fukuda, Mitsuo; Takahei, Kenichiro

    1985-01-01

    Oxidation of III-V compound semiconductor (110) cleaved surfaces under light irradiation is studied. The light irradiation enhanced the reaction rate of oxidation but the relationship between oxide growth and oxidation time under logarithmic law scarcely changed within this experimental range. The oxidation trend observed under light irradiation is similar to that of thermal oxidation for GaP, GaAs, InP, InAs, InGaAs, and InGaAsP. Semiconductors having As as the V element tend to be easily oxidized, while those of the above mentioned six kinds of materials having Ga as the III element are quickly oxidized in their initial stage. Ternary and quaternary compound semiconductors have less tendency to be oxidized compared to their constituent binary materials. off

  17. Intense laser field effects on the linear and nonlinear optical properties in a semiconductor quantum wire with triangle cross section

    NASA Astrophysics Data System (ADS)

    Barseghyan, M. G.; Duque, C. A.; Niculescu, E. C.; Radu, A.

    2014-02-01

    We study the laser field effects on the intersubband optical absorption and the refractive index changes in a GaAs/AlGaAs quantum wire with equilateral triangle cross section. The wire is under the action of a laser beam which is assumed to be non-resonant with the semiconductor structure and linearly polarized perpendicularly to the triangle side. In the effective mass approximation and for a finite potential barrier we calculate the subband states by using a finite element method. Linear, non linear and total absorption coefficients and refractive index changes are calculated as functions of the laser field for the allowed intersubband transitions. Two polarizations of the pump radiation, parallel and perpendicular to the laser field direction, are discussed.

  18. C-band superconductor/semiconductor hybrid field-effect transistor amplifier on a LaAlO3 substrate

    NASA Technical Reports Server (NTRS)

    Nahra, J. J.; Bhasin, K. B.; Toncich, S. S.; Subramanyam, G.; Kapoor, V. J.

    1992-01-01

    A single-stage C-band superconductor/semiconductor hybrid field-effect transistor amplifier was designed, fabricated, and tested at 77 K. The large area (1 inch x 0.5 inches) high temperature superconducting Tl-Ba-Ca-Cu-O (TBCCO) thin film was rf magnetron sputtered onto a LaAlO3 substrate. The film had a transition temperature of about 92 K after it was patterned and etched. The amplifier showed a gain of 6 dB and a 3 dB bandwidth of 100 MHz centered at 7.9 GHz. An identical gold amplifier circuit was tested at 77 K, and these results are compared with those from the hybrid amplifier.

  19. Wide band gap ferromagnetic semiconductors and oxides

    NASA Astrophysics Data System (ADS)

    Pearton, S. J.; Abernathy, C. R.; Overberg, M. E.; Thaler, G. T.; Norton, D. P.; Theodoropoulou, N.; Hebard, A. F.; Park, Y. D.; Ren, F.; Kim, J.; Boatner, L. A.

    2003-01-01

    Recent advances in the theory and experimental realization of ferromagnetic semiconductors give hope that a new generation of microelectronic devices based on the spin degree of freedom of the electron can be developed. This review focuses primarily on promising candidate materials (such as GaN, GaP and ZnO) in which there is already a technology base and a fairly good understanding of the basic electrical and optical properties. The introduction of Mn into these and other materials under the right conditions is found to produce ferromagnetism near or above room temperature. There are a number of other potential dopant ions that could be employed (such as Fe, Ni, Co, Cr) as suggested by theory [see, for example, Sato and Katayama-Yoshida, Jpn. J. Appl. Phys., Part 2 39, L555 (2000)]. Growth of these ferromagnetic materials by thin film techniques, such as molecular beam epitaxy or pulsed laser deposition, provides excellent control of the dopant concentration and the ability to grow single-phase layers. The mechanism for the observed magnetic behavior is complex and appears to depend on a number of factors, including Mn-Mn spacing, and carrier density and type. For example, in a simple Ruderman-Kittel-Kasuya-Yosida carrier-mediated exchange mechanism, the free-carrier/Mn ion interaction can be either ferromagnetic or antiferromagnetic depending on the separation of the Mn ions. Potential applications for ferromagnetic semiconductors and oxides include electrically controlled magnetic sensors and actuators, high-density ultralow-power memory and logic, spin-polarized light emitters for optical encoding, advanced optical switches and modulators and devices with integrated magnetic, electronic and optical functionality.

  20. Field-induced activation of metal oxide semiconductor for low temperature flexible transparent electronic device applications

    NASA Astrophysics Data System (ADS)

    Pudasaini, Pushpa Raj; Noh, Joo Hyon; Wong, Anthony; Haglund, Amada; Ward, Thomas Zac; Mandrus, David; Rack, Philip

    Amorphous metal-oxide semiconductors have been extensively studied as an active channel material in thin film transistors due to their high carrier mobility, and excellent large-area uniformity. Here, we report the athermal activation of amorphous indium gallium zinc oxide semiconductor channels by an electric field-induced oxygen migration via gating through an ionic liquid. Using field-induced activation, a transparent flexible thin film transistor is demonstrated on a polyamide substrate with transistor characteristics having a current ON-OFF ratio exceeding 108, and saturation field effect mobility of 8.32 cm2/(V.s) without a post-deposition thermal treatment. This study demonstrates the potential of field-induced activation as an athermal alternative to traditional post-deposition thermal annealing for metal oxide electronic devices suitable for transparent and flexible polymer substrates. Materials Science and Technology Division, ORBL, Oak Ridge, TN 37831, USA.

  1. Nanoscale Metal Oxide Semiconductors for Gas Sensing

    NASA Technical Reports Server (NTRS)

    Hunter, Gary W.; Evans, Laura; Xu, Jennifer C.; VanderWal, Randy L.; Berger, Gordon M.; Kulis, Michael J.

    2011-01-01

    A report describes the fabrication and testing of nanoscale metal oxide semiconductors (MOSs) for gas and chemical sensing. This document examines the relationship between processing approaches and resulting sensor behavior. This is a core question related to a range of applications of nanotechnology and a number of different synthesis methods are discussed: thermal evaporation- condensation (TEC), controlled oxidation, and electrospinning. Advantages and limitations of each technique are listed, providing a processing overview to developers of nanotechnology- based systems. The results of a significant amount of testing and comparison are also described. A comparison is made between SnO2, ZnO, and TiO2 single-crystal nanowires and SnO2 polycrystalline nanofibers for gas sensing. The TECsynthesized single-crystal nanowires offer uniform crystal surfaces, resistance to sintering, and their synthesis may be done apart from the substrate. The TECproduced nanowire response is very low, even at the operating temperature of 200 C. In contrast, the electrospun polycrystalline nanofiber response is high, suggesting that junction potentials are superior to a continuous surface depletion layer as a transduction mechanism for chemisorption. Using a catalyst deposited upon the surface in the form of nanoparticles yields dramatic gains in sensitivity for both nanostructured, one-dimensional forms. For the nanowire materials, the response magnitude and response rate uniformly increase with increasing operating temperature. Such changes are interpreted in terms of accelerated surface diffusional processes, yielding greater access to chemisorbed oxygen species and faster dissociative chemisorption, respectively. Regardless of operating temperature, sensitivity of the nanofibers is a factor of 10 to 100 greater than that of nanowires with the same catalyst for the same test condition. In summary, nanostructure appears critical to governing the reactivity, as measured by electrical

  2. Scalability of Schottky barrier metal-oxide-semiconductor transistors

    NASA Astrophysics Data System (ADS)

    Jang, Moongyu

    2016-05-01

    In this paper, the general characteristics and the scalability of Schottky barrier metal-oxide-semiconductor field effect transistors (SB-MOSFETs) are introduced and reviewed. The most important factors, i.e., interface-trap density, lifetime and Schottky barrier height of erbium-silicided Schottky diode are estimated using equivalent circuit method. The extracted interface trap density, lifetime and Schottky barrier height for hole are estimated as 1.5 × 1013 traps/cm2, 3.75 ms and 0.76 eV, respectively. The interface traps are efficiently cured by N2 annealing. Based on the diode characteristics, various sizes of erbium-silicided/platinum-silicided n/p-type SB-MOSFETs are manufactured and analyzed. The manufactured SB-MOSFETs show enhanced drain induced barrier lowering (DIBL) characteristics due to the existence of Schottky barrier between source and channel. DIBL and subthreshold swing characteristics are comparable with the ultimate scaling limit of double gate MOSFETs which shows the possible application of SB-MOSFETs in nanoscale regime.

  3. High-κ insulating materials for AlGaN/GaN metal insulator semiconductor heterojunction field effect transistors

    NASA Astrophysics Data System (ADS)

    Colón, Albert; Shi, Junxia

    2014-09-01

    High-κ insulating materials (HfO2, HfO2/Al2O3, HfAlOx, and HfSiOx) were deposited by atomic layer deposition (ALD) on AlGaN/GaN to form Metal-Insulator-Semiconductor Heterostructure Field Effect Transistors (MISHFETs) and were electrically and structurally characterized. The objective of this study is to characterize the interface quality and correlate the results with electrical phenomena for each insulating material. Although there are many studies using HfO2 and Al2O3 on AlGaN, there is limited experimental data using ternary compounds such as HfAlOx or HfSiOx, compared to their binary counterparts. In this work, interface trap density, Dit, was extracted by the conductance method using on-chip metal-insulator-semiconductor heterostructure capacitors (MISHCAPs). HfO2 was measured to have the lowest trap density at low energies on the order of 1012 cm-2 eV-1 and quickly reduced about one order of magnitude less than the others at higher trap energies. HfO2/Al2O3, HfAlOx, and HfSiOx all had similar trap densities on the order of 1012 cm-2 eV-1. Ultra-low gate leakage levels were achieved, especially for HfAlOx on the orders of 10-12 A/mm. Our studies indicate that HfAlOx provides the best electrical characteristics such as lowest gate leakage current, largest channel carrier density and resistance to self-heating effects without the vulnerability to low crystallization temperatures.

  4. A more than six orders of magnitude UV-responsive organic field-effect transistor utilizing a benzothiophene semiconductor and Disperse Red 1 for enhanced charge separation.

    PubMed

    Smithson, Chad S; Wu, Yiliang; Wigglesworth, Tony; Zhu, Shiping

    2015-01-14

    A more than six orders of magnitude UV-responsive organic field-effect transistor is developed using a benzothiophene (BTBT) semiconductor and strong donor-acceptor Disperse Red 1 as the traps to enhance charge separation. The device can be returned to its low drain current state by applying a short gate bias, and is completely reversible with excellent stability under ambient conditions.

  5. The AMOS cell - An improved metal-semiconductor solar cell. [Antireflection coated Metal Oxide Semiconductor

    NASA Technical Reports Server (NTRS)

    Stirn, R. J.; Yeh, Y.-C. M.

    1975-01-01

    A new fabrication process is being developed which significantly improves the efficiency of metal-semiconductor solar cells. The resultant effect, a marked increase in the open-circuit voltage, is produced by the addition of an interfacial layer oxide on the semiconductor. Cells using gold on n-type gallium arsenide have been made in small areas (0.17 sq cm) with conversion efficiencies of 15% in terrestrial sunlight.

  6. Functional integrity of flexible n-channel metal–oxide–semiconductor field-effect transistors on a reversibly bistable platform

    SciTech Connect

    Alfaraj, Nasir; Hussain, Aftab M.; Torres Sevilla, Galo A.; Ghoneim, Mohamed T.; Rojas, Jhonathan P.; Hussain, Muhammad M.; Aljedaani, Abdulrahman B.

    2015-10-26

    Flexibility can bring a new dimension to state-of-the-art electronics, such as rollable displays and integrated circuit systems being transformed into more powerful resources. Flexible electronics are typically hosted on polymeric substrates. Such substrates can be bent and rolled up, but cannot be independently fixed at the rigid perpendicular position necessary to realize rollable display-integrated gadgets and electronics. A reversibly bistable material can assume two stable states in a reversible way: flexibly rolled state and independently unbent state. Such materials are used in cycling and biking safety wristbands and a variety of ankle bracelets for orthopedic healthcare. They are often wrapped around an object with high impulsive force loading. Here, we study the effects of cumulative impulsive force loading on thinned (25 μm) flexible silicon-based n-channel metal–oxide–semiconductor field-effect transistor devices housed on a reversibly bistable flexible platform. We found that the transistors have maintained their high performance level up to an accumulated 180 kN of impact force loading. The gate dielectric layers have maintained their reliability, which is evidenced by the low leakage current densities. Also, we observed low variation in the effective electron mobility values, which manifests that the device channels have maintained their carrier transport properties.

  7. CdSe Nanowire-Based Flexible Devices: Schottky Diodes, Metal-Semiconductor Field-Effect Transistors, and Inverters.

    PubMed

    Jin, Weifeng; Zhang, Kun; Gao, Zhiwei; Li, Yanping; Yao, Li; Wang, Yilun; Dai, Lun

    2015-06-24

    Novel CdSe nanowire (NW)-based flexible devices, including Schottky diodes, metal-semiconductor field-effect transistors (MESFETs), and inverters, have been fabricated and investigated. The turn-on voltage of a typical Schottky diode is about 0.7 V, and the rectification ratio is larger than 1 × 10(7). The threshold voltage, on/off current ratio, subthreshold swing, and peak transconductance of a typical MESFET are about -0.3 V, 4 × 10(5), 78 mV/dec, and 2.7 μS, respectively. The inverter, constructed with two MESFETs, exhibits clear inverting behavior with the gain to be about 28, 34, and 38, at the supply voltages (V(DD)) of 3, 5, and 7 V, respectively. The inverter also shows good dynamic behavior. The rising and falling times of the output signals are about 0.18 and 0.09 ms, respectively, under 1000 Hz square wave signals input. The performances of the flexible devices are stable and reliable under different bending conditions. Our work demonstrates these flexible NW-based Schottky diodes, MESFETs, and inverters are promising candidate components for future portable transparent nanoelectronic devices.

  8. Pt-Ti-O gate silicon-metal-insulator-semiconductor field-effect transistor hydrogen gas sensors in harsh environments

    NASA Astrophysics Data System (ADS)

    Usagawa, Toshiyuki; Ueda, Kazuhiro; Nambu, Akira; Yoneyama, Akio; Kikuchi, Yota; Watanabe, Atsushi

    2016-06-01

    The influence of radiation damages to developed hydrogen gas sensor chips from γ-rays (60Co) and/or X-rays (synchrotron radiation) is manageably avoided for sensor operations even at extremely high integral doses such as 1.8 and/or 18 MGy. Platinum-titanium-oxygen (Pt-Ti-O) gate silicon-metal-insulator-semiconductor field-effect transistor (Si-MISFET) hydrogen gas sensors can work stably as hydrogen sensors up to about 270 °C and also show environmental hardness as follows: When nitrogen-diluted 10-ppm hexamethyldisiloxane (HMDS) was exposed to the sensor FETs for 40 min at a working temperature of 115 °C, large sensing amplitude (ΔV g) changed little within repetition errors before and after HMDS exposures. The variations of ΔV g among relative humidity of 20 and 80% are very small within ±4.4% around 50% under 40 °C atmosphere. The Pt-Ti-O sensors have been found to show large ΔV g of 624.4 mV with σΔV g of 7.27 mV for nine times repeated measurements under nitrogen-diluted 1.0%-hydrogen gas, which are nearly the same values of 654.5 mV with σΔV g of 3.77 mV under air-diluted 1.0%-hydrogen gas.

  9. DNA detection using a complementary metal-oxide semiconductor ring oscillator circuit

    NASA Astrophysics Data System (ADS)

    Kocanda, Martin; Abdel-Motaleb, Ibrahim

    2010-10-01

    A DNA detection scheme has been implemented that utilizes a simple complementary metal-oxide semiconductor (CMOS) ring oscillator circuit. The detector oscillates at a fundamental frequency when using a nonhybridized single-strand DNA probe layer. Upon hybridization with a complimentary DNA strand, the oscillator output exhibits an increased frequency shift, indicating a genetic match. The probe assembly consists of a p-GaAs substrate containing a pulsed laser deposition-applied barium strontium titanate layer and an overlying sodium dodecyl sulfate lipid layer that serves to anchor a functionalized oligonucleotide probe. The oscillator circuit consisting of cascaded discrete complimentary n-channel and p-channel metal-oxide-semiconductor field-effect transistors was implemented using passive components arranged in a T-network to provide the associated fundamental time constant.

  10. Epitaxial Electronic Oxides on Semiconductors Using Pulsed-Laser Deposition

    SciTech Connect

    Norton, D.P.; Budai, J.D.; Chisholm, M.F.

    1999-12-01

    We describe the growth and properties of epitaxial (OO1) CeO{sub 2} on a (001) Ge surface using a hydrogen-assisted pulsed-laser deposition method. Hydrogen gas is introduced during film growth to eliminate the presence of the GeOs from the semiconductor surface during the initial nucleation of the metal oxide film. The hydrogen partial pressure and substrate temperature are selected to be sufficiently high such that the germanium native oxides are thermodynamically unstable. The Gibbs free energy of CeO{sub 2} is larger in magnitude than that of the Ge native oxides, making it more favorable for the metal oxide to reside at the interface in comparison to the native Ge oxides. By satisfying these criteria. the metal oxide/semiconductor interface is shown to be atomically abrupt with no native oxide present. Preliminary structural and electrical properties are reported.

  11. Low-frequency noise in AlTiO/AlGaN/GaN metal-insulator-semiconductor heterojunction field-effect transistors

    NASA Astrophysics Data System (ADS)

    Le, Son Phuong; Ui, Toshimasa; Nguyen, Tuan Quy; Shih, Hong-An; Suzuki, Toshi-kazu

    2016-05-01

    Using aluminum titanium oxide (AlTiO, an alloy of Al2O3 and TiO2) as a high-k gate insulator, we fabricated and investigated AlTiO/AlGaN/GaN metal-insulator-semiconductor heterojunction field-effect transistors. From current low-frequency noise (LFN) characterization, we find Lorentzian spectra near the threshold voltage, in addition to 1/f spectra for the well-above-threshold regime. The Lorentzian spectra are attributed to electron trapping/detrapping with two specific time constants, ˜25 ms and ˜3 ms, which are independent of the gate length and the gate voltage, corresponding to two trap level depths of 0.5-0.7 eV with a 0.06 eV difference in the AlTiO insulator. In addition, gate leakage currents are analyzed and attributed to the Poole-Frenkel mechanism due to traps in the AlTiO insulator, where the extracted trap level depth is consistent with the Lorentzian LFN.

  12. Effect of charge on the ferroelectric field effect in strongly correlated oxides

    NASA Astrophysics Data System (ADS)

    Chen, Xuegang; Xiao, Zhiyong; Zhang, Xiaozhe; Zhang, Le; Zhao, Weiwei; Xu, Xiaoshan; Hong, Xia

    We present a systematic study of the effect of charge on the ferroelectric field effect modulation of various strongly correlated oxide materials. We have fabricated high quality epitaxial heterostructures composed of a ferroelectric Pb(Zr,Ti)O3 (PZT) gate and a correlated oxide channel, including Sm0.5Nd0.5NiO3 (SNNO), La0.7Sr0.3MnO3 (LSMO), SNNO/LSMO bilayers, and NiCo2O4 (NCO). The Hall effect measurements reveal a carrier density of ~4 holes/u.c. (0.4 cm2V-1s-1) for SNNO to ~2 holes/u.c. (27 cm2V-1s-1) for NCO. We find the magnitude of the field effect is closely related to both the intrinsic carrier density and carrier mobility of the channel material. For devices employing the SNNO/LSMO bilayer channel, we believe the charge transfer between the two correlated oxides play an important role in the observed resistance modulation. The screening capacitor of the channel materials and the interfacial defect states also have significant impact on the retention characteristics of the field effect. Our study reveals the critical role of charge in determining the interfacial coupling between ferroelectric and magnetic oxides, and has important implications in developing ferroelectric-controlled Mott memory devices.

  13. Combined Jonker and Ioffe Analysis of Oxide Conductors and Semiconductors

    SciTech Connect

    Zhu, Q.M.; Hopper, E.M.; Ingram, B.J.; Mason, Thomas O.

    2010-09-27

    Jonker plots (Seebeck coefficient versus logarithm of conductivity) have been utilized to obtain the product of the density of states (DOS) and mobility (μ) in oxide semiconductors, from which the maximum electrical conductivity can be estimated for degenerate transparent conducting oxide (TCO) applications. In addition, the DOS–μ product can be utilized to predict the maximum achievable “power factor” (PF, Seebeck coefficient squared times conductivity) for oxide semiconductors. The PF is an important parameter governing the figure of merit for thermoelectric oxide (TEO) applications. The procedure employs an analysis developed by Ioffe, and provides an important screening tool for oxide (and other) thermoelectric materials, based upon data from polycrystalline ceramic specimens. Several oxides, including known transparent conductors, are considered as TCO and TEO case studies in the present work.

  14. Possible Deviation from the well-known Threshold Behavior of Field-Effect Doping Phenomenon in Extremely Thin Organic Semiconductor Layer

    NASA Astrophysics Data System (ADS)

    Ikegami, Keiichi

    2004-05-01

    Field-effect doping in a metal/insulator/semiconductor/metal four-layer model indicates that the well-known threshold behavior Q\\propto(VG-Vth), where Q is the induced charge and VG and Vth are the bias voltage and its threshold value, respectively, should be realized even when the thickness of the semiconductor layer (ds) is on the 10 nm scale. At the same time, however, this model suggests that the doping phenomenon deviates from this simple threshold behavior when the density of states is small and ds is on the 1 nm scale.

  15. Graphene oxide-zinc oxide nanocomposite as channel layer for field effect transistors: effect of ZnO loading on field effect transport.

    PubMed

    Jilani, S Mahaboob; Banerji, Pallab

    2014-10-01

    The effects of ZnO on graphene oxide (GO)-ZnO nanocomposites are investigated to tune the conductivity in GO under field effect regime. Zinc oxides with different concentrations from 5 wt % to 25 wt % are used in a GO matrix to increase the conductivity in the composite. Six sets of field effect transistors with pristine GO and GO-ZnO as the channel layer at varying ZnO concentrations were fabricated. From the transfer characteristics, it is observed that GO exhibited an insulating behavior and the transistors with low ZnO (5 wt %) concentration initially showed p-type conductivity that changes to n-type with increases in ZnO loading. This n-type dominance in conductivity is a consequence of the transfer of electrons from ZnO to the GO matrix. From X-ray photoelectron spectroscopic measurements, it is observed that the progressive reduction in the C-OH oxygen group took place with increases in ZnO loading. Thus, from insulating GO to p- and then n-type, conductivity in GO could be achieved with reduction in the C-OH oxygen group by photocatalytic reduction of GO with varying degrees of ZnO. The restoration of sp(2) electron network in the GO matrix with the anchoring of ZnO nanostructures was observed from Raman spectra. From UV-visible spectra, the band gap in pristine GO was found to be 3.98 eV and reduced to 2.8 eV with increase in ZnO attachment.

  16. Field-effect optical modulation based on epsilon-near-zero conductive oxide

    NASA Astrophysics Data System (ADS)

    Shi, Kaifeng; Lu, Zhaolin

    2016-07-01

    Epsilon-near-zero (ENZ, dielectric constant εr ≈ 0) materials have attracted significant research interest, however, their applications in the near-infrared regime are very limited. Conductive oxide (COx), owing to its moderate carrier concentration, is a candidate for ENZ material at telecom wavelengths based on the Drude model. Herein, we report an indium tin oxide (ITO) thin film as an ENZ material with cross-over wavelength, where real part of permittivity crosses zero, and enhanced light absorption at telecom wavelengths. We also report the investigation of electro-absorption modulation based on a metal-oxide-semiconductor (MOS)-like structure, more specifically a metal-oxide-ITO stack, where ITO works around ENZ. Based on the attenuated total reflectance (ATR) configuration, our test shows great promise for future electro-optical (EO) modulators. The operation speed of the MOS-like structure is limited mainly by RC delay.

  17. Anisotropy-based crystalline oxide-on-semiconductor material

    DOEpatents

    McKee, Rodney Allen; Walker, Frederick Joseph

    2000-01-01

    A semiconductor structure and device for use in a semiconductor application utilizes a substrate of semiconductor-based material, such as silicon, and a thin film of a crystalline oxide whose unit cells are capable of exhibiting anisotropic behavior overlying the substrate surface. Within the structure, the unit cells of the crystalline oxide are exposed to an in-plane stain which influences the geometric shape of the unit cells and thereby arranges a directional-dependent quality of the unit cells in a predisposed orientation relative to the substrate. This predisposition of the directional-dependent quality of the unit cells enables the device to take beneficial advantage of characteristics of the structure during operation. For example, in the instance in which the crystalline oxide of the structure is a perovskite, a spinel or an oxide of similarly-related cubic structure, the structure can, within an appropriate semiconductor device, exhibit ferroelectric, piezoelectric, pyroelectric, electro-optic, ferromagnetic, antiferromagnetic, magneto-optic or large dielectric properties that synergistically couple to the underlying semiconductor substrate.

  18. Silicon dioxide with a silicon interfacial layer as an insulating gate for highly stable indium phosphide metal-insulator-semiconductor field effect transistors

    NASA Technical Reports Server (NTRS)

    Kapoor, V. J.; Shokrani, M.

    1991-01-01

    A novel gate insulator consisting of silicon dioxide (SiO2) with a thin silicon (Si) interfacial layer has been investigated for high-power microwave indium phosphide (InP) metal-insulator-semiconductor field effect transistors (MISFETs). The role of the silicon interfacial layer on the chemical nature of the SiO2/Si/InP interface was studied by high-resolution X-ray photoelectron spectroscopy. The results indicated that the silicon interfacial layer reacted with the native oxide at the InP surface, thus producing silicon dioxide, while reducing the native oxide which has been shown to be responsible for the instabilities in InP MISFETs. While a 1.2-V hysteresis was present in the capacitance-voltage (C-V) curve of the MIS capacitors with silicon dioxide, less than 0.1 V hysteresis was observed in the C-V curve of the capacitors with the silicon interfacial layer incorporated in the insulator. InP MISFETs fabricated with the silicon dioxide in combination with the silicon interfacial layer exhibited excellent stability with drain current drift of less than 3 percent in 10,000 sec, as compared to 15-18 percent drift in 10,000 sec for devices without the silicon interfacial layer. High-power microwave InP MISFETs with Si/SiO2 gate insulators resulted in an output power density of 1.75 W/mm gate width at 9.7 GHz, with an associated power gain of 2.5 dB and 24 percent power added efficiency.

  19. Detection of a 2.8 THz quantum cascade laser with a semiconductor nanowire field-effect transistor coupled to a bow-tie antenna

    SciTech Connect

    Ravaro, M. Locatelli, M.; Consolino, L.; Bartalini, S.; De Natale, P.; Viti, L.; Ercolani, D.; Sorba, L.; Vitiello, M. S.

    2014-02-24

    The use of a high-electron mobility semiconductor nanowire as transistor channel has recently allowed the extension of the spectral coverage of THz field-effect transistor detectors up to 1.5 THz. In this report, we demonstrate efficient operation of a field-effect transistor detector based on a semiconductor nanowire at a much higher frequency, 2.8 THz, with a responsivity ≈5 V/W in a bandwidth ≈100 kHz, thus proving the full potential of such approach for the detection of THz quantum cascade lasers. Finally, such a THz sensing system is exploited to perform raster scan transmission imaging, with high spatial resolution, signal-to-noise ratio, and acquisition rate.

  20. Hybrid Integration of Graphene Analog and Silicon Complementary Metal-Oxide-Semiconductor Digital Circuits.

    PubMed

    Hong, Seul Ki; Kim, Choong Sun; Hwang, Wan Sik; Cho, Byung Jin

    2016-07-26

    We demonstrate a hybrid integration of a graphene-based analog circuit and a silicon-based digital circuit in order to exploit the strengths of both graphene and silicon devices. This mixed signal circuit integration was achieved using a three-dimensional (3-D) integration technique where a graphene FET multimode phase shifter is fabricated on top of a silicon complementary metal-oxide-semiconductor field-effect transistor (CMOS FET) ring oscillator. The process integration scheme presented here is compatible with the conventional silicon CMOS process, and thus the graphene circuit can successfully be integrated on current semiconductor technology platforms for various applications. This 3-D integration technique allows us to take advantage of graphene's excellent inherent properties and the maturity of current silicon CMOS technology for future electronics. PMID:27403730

  1. Fabrication and characterization on reduced graphene oxide field effect transistor (RGOFET) based biosensor

    NASA Astrophysics Data System (ADS)

    Rashid, A. Diyana; Ruslinda, A. Rahim; Fatin, M. F.; Hashim, U.; Arshad, M. K.

    2016-07-01

    The fabrication and characterization on reduced graphene oxide field effect transistor (RGO-FET) were demonstrated using a spray deposition method for biological sensing device purpose. A spray method is a fast, low-cost and simple technique to deposit graphene and the most promising technology due to ideal coating on variety of substrates and high production speed. The fabrication method was demonstrated for developing a label free aptamer reduced graphene oxide field effect transistor biosensor. Reduced graphene oxide (RGO) was obtained by heating on hot plate fixed at various temperatures of 100, 200 and 300°C, respectively. The surface morphology of RGO were examined via atomic force microscopy to observed the temperature effect of produced RGO. The electrical measurement verify the performance of electrical conducting RGO-FET at temperature 300°C is better as compared to other temperature due to the removal of oxygen groups in GO. Thus, reduced graphene oxide was a promising material for biosensor application.

  2. Radiation hardening of metal-oxide semi-conductor (MOS) devices by boron

    NASA Technical Reports Server (NTRS)

    Danchenko, V.

    1974-01-01

    Technique using boron effectively protects metal-oxide semiconductor devices from ionizing radiation without using shielding materials. Boron is introduced into insulating gate oxide layer at semiconductor-insulator interface.

  3. High-temperature Complementary Metal Oxide Semiconductors (CMOS)

    NASA Technical Reports Server (NTRS)

    Mcbrayer, J. D.

    1981-01-01

    The results of an investigation into the possibility of using complementary metal oxide semiconductor (CMOS) technology for high temperature electronics are presented. A CMOS test chip was specifically developed as the test bed. This test chip incorporates CMOS transistors that have no gate protection diodes; these diodes are the major cause of leakage in commercial devices.

  4. Integrated photo-responsive metal oxide semiconductor circuit

    NASA Technical Reports Server (NTRS)

    Jhabvala, Murzban D. (Inventor); Dargo, David R. (Inventor); Lyons, John C. (Inventor)

    1987-01-01

    An infrared photoresponsive element (RD) is monolithically integrated into a source follower circuit of a metal oxide semiconductor device by depositing a layer of a lead chalcogenide as a photoresistive element forming an ohmic bridge between two metallization strips serving as electrodes of the circuit. Voltage from the circuit varies in response to illumination of the layer by infrared radiation.

  5. Metal-oxide-semiconductor photocapacitor for sensing surface plasmon polaritons

    NASA Astrophysics Data System (ADS)

    Khalilzade-Rezaie, Farnood; Peale, Robert E.; Panjwani, Deep; Smith, Christian W.; Nath, Janardan; Lodge, Michael; Ishigami, Masa; Nader, Nima; Vangala, Shiva; Yannuzzi, Mark; Cleary, Justin W.

    2015-09-01

    An electronic detector of surface plasmon polaritons (SPP) is reported. SPPs optically excited on a metal surface using a prism coupler are detected by using a close-coupled metal-oxide-semiconductor capacitor. Semitransparent metal and graphene gates function similarly. We report the dependence of the photoresponse on substrate carrier type, carrier concentration, and back-contact biasing.

  6. CMOS array design automation techniques. [metal oxide semiconductors

    NASA Technical Reports Server (NTRS)

    Ramondetta, P.; Feller, A.; Noto, R.; Lombardi, T.

    1975-01-01

    A low cost, quick turnaround technique for generating custom metal oxide semiconductor arrays using the standard cell approach was developed, implemented, tested and validated. Basic cell design topology and guidelines are defined based on an extensive analysis that includes circuit, layout, process, array topology and required performance considerations particularly high circuit speed.

  7. High mobility field effect transistor based on BaSnO{sub 3} with Al{sub 2}O{sub 3} gate oxide

    SciTech Connect

    Park, Chulkwon; Kim, Useong; Ju, Chan Jong; Park, Ji Sung; Kim, Young Mo; Char, Kookrin

    2014-11-17

    We fabricated an n-type accumulation-mode field effect transistor based on BaSnO{sub 3} transparent perovskite semiconductor, taking advantage of its high mobility and oxygen stability. We used the conventional metal-insulator-semiconductor structures: (In,Sn){sub 2}O{sub 3} as the source, drain, and gate electrodes, Al{sub 2}O{sub 3} as the gate insulator, and La-doped BaSnO{sub 3} as the semiconducting channel. The Al{sub 2}O{sub 3} gate oxide was deposited by atomic layer deposition technique. At room temperature, we achieved the field effect mobility value of 17.8 cm{sup 2}/Vs and the I{sub on}/I{sub off} ratio value higher than 10{sup 5} for V{sub DS} = 1 V. These values are higher than those previously reported on other perovskite oxides, in spite of the large density of threading dislocations in the BaSnO{sub 3} on SrTiO{sub 3} substrates. However, a relatively large subthreshold swing value was found, which we attribute to the large density of charge traps in the Al{sub 2}O{sub 3} as well as the threading dislocations.

  8. Metal oxide semiconductor thin-film transistors for flexible electronics

    NASA Astrophysics Data System (ADS)

    Petti, Luisa; Münzenrieder, Niko; Vogt, Christian; Faber, Hendrik; Büthe, Lars; Cantarella, Giuseppe; Bottacchi, Francesca; Anthopoulos, Thomas D.; Tröster, Gerhard

    2016-06-01

    The field of flexible electronics has rapidly expanded over the last decades, pioneering novel applications, such as wearable and textile integrated devices, seamless and embedded patch-like systems, soft electronic skins, as well as imperceptible and transient implants. The possibility to revolutionize our daily life with such disruptive appliances has fueled the quest for electronic devices which yield good electrical and mechanical performance and are at the same time light-weight, transparent, conformable, stretchable, and even biodegradable. Flexible metal oxide semiconductor thin-film transistors (TFTs) can fulfill all these requirements and are therefore considered the most promising technology for tomorrow's electronics. This review reflects the establishment of flexible metal oxide semiconductor TFTs, from the development of single devices, large-area circuits, up to entirely integrated systems. First, an introduction on metal oxide semiconductor TFTs is given, where the history of the field is revisited, the TFT configurations and operating principles are presented, and the main issues and technological challenges faced in the area are analyzed. Then, the recent advances achieved for flexible n-type metal oxide semiconductor TFTs manufactured by physical vapor deposition methods and solution-processing techniques are summarized. In particular, the ability of flexible metal oxide semiconductor TFTs to combine low temperature fabrication, high carrier mobility, large frequency operation, extreme mechanical bendability, together with transparency, conformability, stretchability, and water dissolubility is shown. Afterward, a detailed analysis of the most promising metal oxide semiconducting materials developed to realize the state-of-the-art flexible p-type TFTs is given. Next, the recent progresses obtained for flexible metal oxide semiconductor-based electronic circuits, realized with both unipolar and complementary technology, are reported. In particular

  9. III-V Nanowire Complementary Metal-Oxide Semiconductor Transistors Monolithically Integrated on Si.

    PubMed

    Svensson, Johannes; Dey, Anil W; Jacobsson, Daniel; Wernersson, Lars-Erik

    2015-12-01

    III-V semiconductors have attractive transport properties suitable for low-power, high-speed complementary metal-oxide-semiconductor (CMOS) implementation, but major challenges related to cointegration of III-V n- and p-type metal-oxide-semiconductor field-effect transistors (MOSFETs) on low-cost Si substrates have so far hindered their use for large scale logic circuits. By using a novel approach to grow both InAs and InAs/GaSb vertical nanowires of equal length simultaneously in one single growth step, we here demonstrate n- and p-type III-V MOSFETs monolithically integrated on a Si substrate with high I(on)/I(off) ratios using a dual channel, single gate-stack design processed simultaneously for both types of transistors. In addition, we demonstrate fundamental CMOS logic gates, such as inverters and NAND gates, which illustrate the viability of our approach for large scale III-V MOSFET circuits on Si. PMID:26595174

  10. Graphene field-effect devices

    NASA Astrophysics Data System (ADS)

    Echtermeyer, T. J.; Lemme, M. C.; Bolten, J.; Baus, M.; Ramsteiner, M.; Kurz, H.

    2007-09-01

    In this article, graphene is investigated with respect to its electronic properties when introduced into field effect devices (FED). With the exception of manual graphene deposition, conventional top-down CMOS-compatible processes are applied. Few and monolayer graphene sheets are characterized by scanning electron microscopy, atomic force microscopy and Raman spectroscopy. The electrical properties of monolayer graphene sandwiched between two silicon dioxide films are studied. Carrier mobilities in graphene pseudo-MOS structures are compared to those obtained from double-gated Graphene-FEDs and silicon metal-oxide-semiconductor field-effect-transistors (MOSFETs).

  11. Controlling Leakage Currents in Organic Field-Effect Transistors using Molecular Dipole Monolayers on Nanoscale Oxides

    NASA Astrophysics Data System (ADS)

    Martinez Hardigree, Josue F.; Dawidczyk, Thomas; Ireland, Robert; Johns, Gary; Jung, Byung-Jun; Markovic, Nina; Katz, Howard

    2013-03-01

    Self-assembled monolayers (SAM) have been explored as easily-processed, ultrathin interfacial layers in organic field-effect transistors (OFETs) for tuning the threshold voltage (Vt). We investigated the influence of Fermi-level pinning of the gate electrode by SAMs on leakage currents in OFETs fabricated on highly-doped n- and p-type Si gates with an intentionally marginal-quality, high leakage 8 nm SiO2 dielectric. Two dipolar alkyl SAMs, octyltriethoxysilane (OTS) and its fluorinated analogue (FOTS), were employed under a 40 nm active layer of a naphthalenetetracarboxylic diimide (NTCDI) derivative. Transistors on nSi displayed more positive Vt for OTS (+0.23 V) and FOTS (+1.09 V) than bare oxide (-0.56 V), while OFETs on pSi showed a lower Vt for OTS (+0.26 V) and a higher Vt for FOTS (+1.25 V) devices relative to bare oxide (+1.15 V). Differences in gate and subthreshold leakage between bare and SAM-treated oxides match the trends in Vt. Scanning Kelvin-probe measurements were consistent with this trend, indicating FOTS made both nSi and pSi oxide surfaces more negative relative to bare oxide, while OTS treatment resulted in more positive surface potentials on pSi and more negative surface potentials on nSi. Now at University of Seoul

  12. Visible light water splitting using dye-sensitized oxide semiconductors.

    PubMed

    Youngblood, W Justin; Lee, Seung-Hyun Anna; Maeda, Kazuhiko; Mallouk, Thomas E

    2009-12-21

    Researchers are intensively investigating photochemical water splitting as a means of converting solar to chemical energy in the form of fuels. Hydrogen is a key solar fuel because it can be used directly in combustion engines or fuel cells, or combined catalytically with CO(2) to make carbon containing fuels. Different approaches to solar water splitting include semiconductor particles as photocatalysts and photoelectrodes, molecular donor-acceptor systems linked to catalysts for hydrogen and oxygen evolution, and photovoltaic cells coupled directly or indirectly to electrocatalysts. Despite several decades of research, solar hydrogen generation is efficient only in systems that use expensive photovoltaic cells to power water electrolysis. Direct photocatalytic water splitting is a challenging problem because the reaction is thermodynamically uphill. Light absorption results in the formation of energetic charge-separated states in both molecular donor-acceptor systems and semiconductor particles. Unfortunately, energetically favorable charge recombination reactions tend to be much faster than the slow multielectron processes of water oxidation and reduction. Consequently, visible light water splitting has only recently been achieved in semiconductor-based photocatalytic systems and remains an inefficient process. This Account describes our approach to two problems in solar water splitting: the organization of molecules into assemblies that promote long-lived charge separation, and catalysis of the electrolysis reactions, in particular the four-electron oxidation of water. The building blocks of our artificial photosynthetic systems are wide band gap semiconductor particles, photosensitizer and electron relay molecules, and nanoparticle catalysts. We intercalate layered metal oxide semiconductors with metal nanoparticles. These intercalation compounds, when sensitized with [Ru(bpy)(3)](2+) derivatives, catalyze the photoproduction of hydrogen from sacrificial

  13. Implications of mercury interactions with band-gap semiconductor oxides

    SciTech Connect

    Granite, E.J.; King, W.P.; Stanko, D.C.; Pennline, H.W.

    2008-09-01

    Titanium dioxide is a well-known photooxidation catalyst. It will oxidize mercury in the presence of ultraviolet light from the sun and oxygen and/or moisture to form mercuric oxide. Several companies manufacture self-cleaning windows. These windows have a transparent coating of titanium dioxide. The titanium dioxide is capable of destroying organic contaminants in air in the presence of ultraviolet light from the sun, thereby keeping the windows clean. The commercially available self-cleaning windows were used to sequester mercury from oxygen–nitrogen mixtures. Samples of the self-cleaning glass were placed into specially designed photo-reactors in order to study the removal of elemental mercury from oxygen–nitrogen mixtures resembling air. The possibility of removing mercury from ambient air with a self-cleaning glass apparatus is examined. The intensity of 365-nm ultraviolet light was similar to the natural intensity from sunlight in the Pittsburgh region. Passive removal of mercury from the air may represent an option in lieu of, or in addition to, point source clean-up at combustion facilities. There are several common band-gap semiconductor oxide photocatalysts. Sunlight (both the ultraviolet and visible light components) and band-gap semiconductor particles may have a small impact on the global cycle of mercury in the environment. The potential environmental consequences of mercury interactions with band-gap semiconductor oxides are discussed. Heterogeneous photooxidation might impact the global transport of elemental mercury emanating from flue gases.

  14. Direct-current and radio-frequency characterizations of GaAs metal-insulator-semiconductor field-effect transistors enabled by self-assembled nanodielectrics

    NASA Astrophysics Data System (ADS)

    Lin, H. C.; Kim, S. K.; Chang, D.; Xuan, Y.; Mohammadi, S.; Ye, P. D.; Lu, G.; Facchetti, A.; Marks, T. J.

    2007-08-01

    Direct-current and radio-frequency characterizations of GaAs metal-insulator-semiconductor field-effect transistors (MISFETs) with very thin self-assembled organic nanodielectrics (SANDs) are presented. The application of SAND on compound semiconductors offers unique opportunities for high-performance devices. Thus, 1μm gate-length depletion-mode n-channel SAND/GaAs MISFETs exhibit low gate leakage current densities of 10-2-10-5A/cm2, a maximum drain current of 260mA/mm at 2V forward gate bias, and a maximum intrinsic transconductance of 127mS/mm. These devices achieve a current cutoff frequency (fT) of 10.6GHz and a maximum oscillation frequency (fmax) of 6.9GHz. Nearly hysteresis-free Ids-Vgs characteristics and low flicker noise indicate that a high-quality SAND-GaAs interface is achieved.

  15. Extended Characterization of the Common-Source and Common-Gate Amplifiers using a Metal-Ferroelectric-Semiconductor Field Effect Transistor

    NASA Technical Reports Server (NTRS)

    Hunt, Mitchell; Sayyah, Rana; Mitchell, Cody; Laws, Crystal; MacLeod, Todd C.; Ho, Fat D.

    2013-01-01

    Collected data for both common-source and common-gate amplifiers is presented in this paper. Characterizations of the two amplifier circuits using metal-ferroelectric-semiconductor field effect transistors (MFSFETs) are developed with wider input frequency ranges and varying device sizes compared to earlier characterizations. The effects of the ferroelectric layer's capacitance and variation load, quiescent point, or input signal on each circuit are discussed. Comparisons between the MFSFET and MOSFET circuit operation and performance are discussed at length as well as applications and advantages for the MFSFETs.

  16. Mathematical Models of the Common-Source and Common-Gate Amplifiers using a Metal-Ferroelectric-Semiconductor Field effect Transistor

    NASA Technical Reports Server (NTRS)

    Hunt, Mitchell; Sayyah, Rana; Mitchell, Cody; Laws, Crystal; MacLeod, Todd C.; Ho, Fat D.

    2013-01-01

    Mathematical models of the common-source and common-gate amplifiers using metal-ferroelectric- semiconductor field effect transistors (MOSFETs) are developed in this paper. The models are compared against data collected with MOSFETs of varying channel lengths and widths, and circuit parameters such as biasing conditions are varied as well. Considerations are made for the capacitance formed by the ferroelectric layer present between the gate and substrate of the transistors. Comparisons between the modeled and measured data are presented in depth as well as differences and advantages as compared to the performance of each circuit using a MOSFET.

  17. Metal Oxide Semi-Conductor Gas Sensors in Environmental Monitoring

    PubMed Central

    Fine, George F.; Cavanagh, Leon M.; Afonja, Ayo; Binions, Russell

    2010-01-01

    Metal oxide semiconductor gas sensors are utilised in a variety of different roles and industries. They are relatively inexpensive compared to other sensing technologies, robust, lightweight, long lasting and benefit from high material sensitivity and quick response times. They have been used extensively to measure and monitor trace amounts of environmentally important gases such as carbon monoxide and nitrogen dioxide. In this review the nature of the gas response and how it is fundamentally linked to surface structure is explored. Synthetic routes to metal oxide semiconductor gas sensors are also discussed and related to their affect on surface structure. An overview of important contributions and recent advances are discussed for the use of metal oxide semiconductor sensors for the detection of a variety of gases—CO, NOx, NH3 and the particularly challenging case of CO2. Finally a description of recent advances in work completed at University College London is presented including the use of selective zeolites layers, new perovskite type materials and an innovative chemical vapour deposition approach to film deposition. PMID:22219672

  18. Complementary Metal-Oxide-Semiconductor Integrated Carbon Nanotube Arrays: Toward Wide-Bandwidth Single-Molecule Sensing Systems.

    PubMed

    Warren, Steven B; Vernick, Sefi; Romano, Ethan; Shepard, Kenneth L

    2016-04-13

    There is strong interest in realizing genomic molecular diagnostic platforms that are label-free, electronic, and single-molecule. One attractive transducer for such efforts is the single-molecule field-effect transistor (smFET), capable of detecting a single electronic charge and realized with a point-functionalized exposed-gate one-dimensional carbon nanotube field-effect device. In this work, smFETs are integrated directly onto a custom complementary metal-oxide-semiconductor chip, which results in an array of up to 6000 devices delivering a measurement bandwidth of 1 MHz. In a first exploitation of these high-bandwidth measurement capabilities, point functionalization through electrochemical oxidation of the devices is observed with microsecond temporal resolution, which reveals complex reaction pathways with resolvable scattering signatures. High-rate random telegraph noise is detected in certain oxidized devices, further illustrating the measurement capabilities of the platform. PMID:26999579

  19. Generic process for preparing a crystalline oxide upon a group IV semiconductor substrate

    DOEpatents

    McKee, Rodney A.; Walker, Frederick J.; Chisholm, Matthew F.

    2000-01-01

    A process for growing a crystalline oxide epitaxially upon the surface of a Group IV semiconductor, as well as a structure constructed by the process, is described. The semiconductor can be germanium or silicon, and the crystalline oxide can generally be represented by the formula (AO).sub.n (A'BO.sub.3).sub.m in which "n" and "m" are non-negative integer repeats of planes of the alkaline earth oxides or the alkaline earth-containing perovskite oxides. With atomic level control of interfacial thermodynamics in a multicomponent semiconductor/oxide system, a highly perfect interface between a semiconductor and a crystalline oxide can be obtained.

  20. Characterization of Amorphous Zinc Tin Oxide Semiconductors

    SciTech Connect

    Rajachidambaram, Jaana Saranya; Sanghavi, Shail P.; Nachimuthu, Ponnusamy; Shutthanandan, V.; Varga, Tamas; Flynn, Brendan T.; Thevuthasan, Suntharampillai; Herman, Gregory S.

    2012-06-12

    Amorphous zinc tin oxide (ZTO) was investigated to determine the effect of deposition and post annealing conditions on film structure, composition, surface contamination, and thin film transistor (TFT) device performance. X-ray diffraction results indicated that the ZTO films remain amorphous even after annealing to 600 °C. We found that the bulk Zn:Sn ratio of the sputter deposited films were slightly tin rich compared to the composition of the ceramic sputter target, and there was a significant depletion of zinc at the surface. X-ray photoelectron spectroscopy also indicated that residual surface contamination depended strongly on the sample post-annealing conditions where water, carbonate and hydroxyl species were absorbed to the surface. Electrical characterization of ZTO films, using TFT test structures, indicated that mobilities as high as 17 cm2/Vs could be obtained for depletion mode devices.

  1. Depletion effect of oxide semiconductor analyzed by Hall effects.

    PubMed

    Oh, Teresa

    2014-12-01

    This letter discusses the tunneling behavior of amorphous indium-gallium-zinc-oxide (a-IGZO) analyzed through the observation of its Hall effects. The properties of the a-IGZO changed from those of a majority carrier to those of a minority carrier after the annealing process as a result of the electron-hole recombination due to the thermal activation energy and the formation of a depletion layer with a high-potential Schottky barrier. Therefore, the diffusion current of these minority charge carriers caused ambipolar transfer characteristics, a tunneling behavior, in the metal-oxide semiconductor (MOS) transistor. PMID:25971008

  2. Electric field effects in transition metal oxides, their surfaces and heterostructures

    NASA Astrophysics Data System (ADS)

    Held, Karsten

    2015-03-01

    Modern computational tools such as density functional theory and its merger with dynamical mean field theory are nowadays inevitable for the modeling and understanding of oxides, their heterostructures and surfaces. In this talk, I will concentrate on the impact of electric fields, how they affect the physical properties and how to make use of them. Substantial internal electric fields are created at polar surfaces, and even for an isopolar-interface the electronic reconstruction can lead to a charge transfer and hence a dipole field. Such internal fields can be employed to efficiently separate electrons and holes in a oxide solar cell. Even if the polar dipole field is compensated by a surface reconstruction, a local surface potential remains, and makes SrTiO3 (110) the arguably simplest 2 dimensional electron gas (2DEG). External electric fields, on the other hand, can trigger ``gigantic'' responses, since correlated oxides are prone to small perturbations. For example, a field effect Mott transistor can be realized in a few layers of SrVO3 with ideal on-off (metal-insulator) switching properties; and interfacing a ferroelectric, BaTiO3, plus a 2DEG with large spin-orbit coupling, BaOsO3, allows for a giant switchable Rashba effect. Support by the ERC through Grant Agreement No. 306447 is gratefully acknowledged.

  3. Field effect devices and sensors based on electrospun polymer assisted tin oxide nanoribbons.

    PubMed

    Rojas, Richard; Meléndez, Anamaris; Ramos, Idalia; Santiago-Avilés, Jorge J; Pinto, Nicholas J

    2010-04-01

    Electrospinning is presented as a facile method of preparing relatively long tin oxide (SnO2) nanofibers that are robust and stable in air. Upon heat treatment, the fibers collapse into a ribbon-like structure with surfaces that are not smooth, rather, are marked with several interconnected pathways. These nanoribbons were electrically characterized in a field effect transistor configuration in vacuum, with and without ultra violet (UV) light exposure. The resultant variable resistor device exhibits n-type behavior having an on/off ratio of approximately 6000. The devices show a direct response to UV with faster response times upon exposure to longer wavelength light. In the presence of UV, the device conductance and mobility increases, reaching a value approximately 2 cm2/-s for the 364 nm UV light source, comparable to amorphous Si. PMID:20355506

  4. DNA aptamer functionalized zinc oxide field effect transistors for liquid state selective sensing of small molecules

    NASA Astrophysics Data System (ADS)

    Hagen, Joshua A.; Kim, Sang N.; Bayraktaroglu, Burhan; Kelley-Loughnane, Nancy; Naik, Rajesh R.; Stone, Morley O.

    2010-08-01

    In this work, we show the use of single stranded DNA aptamers as selective biorecognition elements in a sensor based on a field effect transistor (FET) platform. Aptamers are chemically attached to the semiconducting material in the FET through the use of linker molecules and confirmed through atomic force microscopy and positive target detection. Highly selective sensing of a small molecule, riboflavin is shown down to the nano-molar level in zinc oxide FET and micro-molar level in a carbon nanotube FET. High selectivity is determined through the use of negative control target molecules with similar molecular structures as the positive control targets with little to no sensor response. The goal of this work is to develop a sensor platform where biorecognition elements can be used to functionalize an array of transistors for simultaneous sensing of multiple targets in biological fluids.

  5. Detection of Orexin A Neuropeptide in Biological Fluids Using a Zinc Oxide Field Effect Transistor

    PubMed Central

    2013-01-01

    Biomarkers which are indicative of acute physiological and emotional states are studied in a number of different areas in cognitive neuroscience. Currently, many cognitive studies are conducted based on programmed tasks followed by timed biofluid sampling, central laboratory processing, and followed by data analysis. In this work, we present a sensor platform capable of rapid biomarker detection specific for detecting neuropeptide orexin A, found in blood and saliva and known as an indicator of fatigue and cognitive performance. A peptide recognition element that selectively binds to orexin A was designed, characterized, and functionalized onto a zinc oxide field effect transistor to enable rapid detection. The detection limit using the sensor platform was sub-picomolar in water, and picomolar to nanomolar levels in saliva and serum. The transistor and recognition element sensor platform can be easily expanded, allowing for multiple biomarkers to be detected simultaneously, lending itself to complex biomarker analysis applicable to rapid feedback for neuroscience research and physiological monitoring. PMID:23509980

  6. Thermal oxidation of 3-5 compound semiconductors

    NASA Astrophysics Data System (ADS)

    Monteironeto, Othon Derego

    1988-11-01

    Thermal oxidation of 3-5 compound semiconductors has been studied in the temperature range of 300 to 600 C. Two members of this class of materials, namely InP and GaAs, were the object of the experimental work carried out here. The main analytical tools used were transmission electron microscopy (TEM) and secondary ion mass spectroscopy (SIMS). TEM was employed to access microstructural changes and SIMS to access the composition redistribution that takes place as a consequence of the oxidation reaction. Below 400 C oxidation of both materials led to the formation of amorphous scales, which consisted of a mixture of gallium and arsenic oxides in the case of GaAs, and indium phosphate and oxide in the case of InP. The oxidation kinetics of InP was found to be slower than that of GaAs. In the high temperature regime, i.e., above 400 C, the oxidation of both materials resulted in crystalline products. Precipitation of the group 5 element at the scale/semiconductor interface took place during oxidation. At the GaAs/Ga2O3interface, As precipitates were formed with a truncated square pyramid shape bound by (111) sub GaAs planes. The precipitates found at the InPO4/InP interface were either a phosphorus rich phase or red phosphorus. Strong vaporization under the electron beam prohibited a more accurate determination. The morphology of those precipitates were very similar to the As ones in GaAs.

  7. Thermal oxidation of III-V compound semiconductors

    SciTech Connect

    Neto, O.R.M.

    1988-11-01

    Thermal oxidation of III-V compound semiconductors has been studied in the temperature range of 300/degree/C to 600/degree/C. Two members of this class of materials, namely InP and GaAs, were the object of the experimental work carried out here. The main analytical tools used were transmission electron microscopy (TEM) and secondary ion mass spectroscopy (SIMS). TEM was employed to access microstructural changes and SIMS to access the composition redistribution that takes place as a consequence of the oxidation reaction. Below 400/degree/C oxidation of both materials led to the formation of amorphous scales, which consisted of a mixture of gallium and arsenic oxides in the case of GaAs, and indium phosphate and oxide in the case of InP. The oxidation kinetics of InP was found to be slower than that of GaAs. In the high temperature regime, i.e., above 400/degree/C, the oxidation of both materials resulted in crystalline products. Precipitation of the group V element at the scale/semiconductor interface took place during oxidation. At the GaAs/Ga/sub 2/O/sub 3/interface, As precipitates were formed with a truncated square pyramid shape bound by /l brace/111/r brace//sub GaAs/ planes. The precipitates found at the InPO/sub 4//InP interface were either a phosphorus rich phase or red phosphorus. Strong vaporization under the electron beam prohibited a more accurate determination. The morphology of those precipitates were very similar to the As ones in GaAs. 83 refs., 48 figs., 6 tabs.

  8. Enhanced mobility in organic field-effect transistors due to semiconductor/dielectric iInterface control and very thin single crystal.

    PubMed

    Dong, Ji; Yu, Peng; Arabi, Syeda Atika; Wang, Jiawei; He, Jun; Jiang, Chao

    2016-07-01

    A perfect organic crystal while keeping high quality semiconductor/dielectric interface with minimal defects and disorder is crucial for the realization of high performance organic single crystal field-effect transistors (OSCFETs). However, in most reported OSCFET devices, the crystal transfer processes is extensively used. Therefore, the semiconductor/dielectric interface is inevitably damaged. Carrier traps and scattering centers are brought into the conduction channel, so that the intrinsic high mobility of OSCFET devices is entirely disguised. Here, very thin pentacene single crystal is grown directly on bare SiO2 by developing a 'seed-controlled' pentacene single crystal method. The interface quality is controlled by an in situ fabrication of OSCFETs. The interface is kept intact without any transfer process. Furthermore, we quantitatively analyze the influence of crystal thickness on device performance. With a pristine interface and very thin crystal, we have achieved the highest mobility: 5.7 cm(2) V(-1) s(-1)-more than twice the highest ever reported pentacene OSCFET mobility on bare SiO2. This study may provide a universal route for the use of small organic molecules to achieve high performance in lamellar single crystal field-effect devices. PMID:27211506

  9. Enhanced mobility in organic field-effect transistors due to semiconductor/dielectric iInterface control and very thin single crystal.

    PubMed

    Dong, Ji; Yu, Peng; Arabi, Syeda Atika; Wang, Jiawei; He, Jun; Jiang, Chao

    2016-07-01

    A perfect organic crystal while keeping high quality semiconductor/dielectric interface with minimal defects and disorder is crucial for the realization of high performance organic single crystal field-effect transistors (OSCFETs). However, in most reported OSCFET devices, the crystal transfer processes is extensively used. Therefore, the semiconductor/dielectric interface is inevitably damaged. Carrier traps and scattering centers are brought into the conduction channel, so that the intrinsic high mobility of OSCFET devices is entirely disguised. Here, very thin pentacene single crystal is grown directly on bare SiO2 by developing a 'seed-controlled' pentacene single crystal method. The interface quality is controlled by an in situ fabrication of OSCFETs. The interface is kept intact without any transfer process. Furthermore, we quantitatively analyze the influence of crystal thickness on device performance. With a pristine interface and very thin crystal, we have achieved the highest mobility: 5.7 cm(2) V(-1) s(-1)-more than twice the highest ever reported pentacene OSCFET mobility on bare SiO2. This study may provide a universal route for the use of small organic molecules to achieve high performance in lamellar single crystal field-effect devices.

  10. Silicon carbide: A unique platform for metal-oxide-semiconductor physics

    SciTech Connect

    Liu, Gang; Tuttle, Blair R.; Dhar, Sarit

    2015-06-15

    A sustainable energy future requires power electronics that can enable significantly higher efficiencies in the generation, distribution, and usage of electrical energy. Silicon carbide (4H-SiC) is one of the most technologically advanced wide bandgap semiconductor that can outperform conventional silicon in terms of power handling, maximum operating temperature, and power conversion efficiency in power modules. While SiC Schottky diode is a mature technology, SiC power Metal Oxide Semiconductor Field Effect Transistors are relatively novel and there is large room for performance improvement. Specifically, major initiatives are under way to improve the inversion channel mobility and gate oxide stability in order to further reduce the on-resistance and enhance the gate reliability. Both problems relate to the defects near the SiO{sub 2}/SiC interface, which have been the focus of intensive studies for more than a decade. Here we review research on the SiC MOS physics and technology, including its brief history, the state-of-art, and the latest progress in this field. We focus on the two main scientific problems, namely, low channel mobility and bias temperature instability. The possible mechanisms behind these issues are discussed at the device physics level as well as the atomic scale, with the support of published physical analysis and theoretical studies results. Some of the most exciting recent progress in interface engineering for improving the channel mobility and fundamental understanding of channel transport is reviewed.

  11. Structural and optical properties of silicon metal-oxide-semiconductor light-emitting devices

    NASA Astrophysics Data System (ADS)

    Xu, Kaikai; Zhang, Zhengyuan; Zhang, Zhengping

    2016-01-01

    A silicon p-channel metal oxide semiconductor field-effect transistor (Si-PMOSFET) that is fully compatible with the standard complementary metal oxide semiconductor process is investigated based on the phenomenon of optical radiation observed in the reverse-biased p-n junction in the Si-PMOSFET device. The device can be used either as a two-terminal silicon diode light-emitting device (Si-diode LED) or as a three-terminal silicon gate-controlled diode light-emitting device (Si gate-controlled diode LED). It is seen that the three-terminal operating mode could provide much higher power transfer efficiency than the two-terminal operating mode. A new solution based on the concept of a theoretical quantum efficiency model combined with calculated results is proposed for interpreting the evidence of light intensity reduction at high operating voltages. The Si-LED that can be easily integrated into CMOS fabrication process is an important step toward optical interconnects.

  12. Silicon carbide: A unique platform for metal-oxide-semiconductor physics

    NASA Astrophysics Data System (ADS)

    Liu, Gang; Tuttle, Blair R.; Dhar, Sarit

    2015-06-01

    A sustainable energy future requires power electronics that can enable significantly higher efficiencies in the generation, distribution, and usage of electrical energy. Silicon carbide (4H-SiC) is one of the most technologically advanced wide bandgap semiconductor that can outperform conventional silicon in terms of power handling, maximum operating temperature, and power conversion efficiency in power modules. While SiC Schottky diode is a mature technology, SiC power Metal Oxide Semiconductor Field Effect Transistors are relatively novel and there is large room for performance improvement. Specifically, major initiatives are under way to improve the inversion channel mobility and gate oxide stability in order to further reduce the on-resistance and enhance the gate reliability. Both problems relate to the defects near the SiO2/SiC interface, which have been the focus of intensive studies for more than a decade. Here we review research on the SiC MOS physics and technology, including its brief history, the state-of-art, and the latest progress in this field. We focus on the two main scientific problems, namely, low channel mobility and bias temperature instability. The possible mechanisms behind these issues are discussed at the device physics level as well as the atomic scale, with the support of published physical analysis and theoretical studies results. Some of the most exciting recent progress in interface engineering for improving the channel mobility and fundamental understanding of channel transport is reviewed.

  13. Design issues for lateral double-diffused metal-oxide-semiconductor with higher breakdown voltage.

    PubMed

    Sung, Kunsik; Won, Taeyoung

    2013-05-01

    In this paper, we discuss a new High-Side nLDMOSFET whose breakdown voltage is over 100 V while meeting the thermal budget for the conventional process. The proposed n-channel lateral double-diffused metal-oxide-semiconductor field-effect transistor (LDMOSFET) has a feature in that the structure comprises a gap of 5 microm between the DEEP N-WELL and the center of the source, the surface of which is implanted by the NADJUST-layer for high breakdown voltage and simultaneously the low specific on-resistance. The computer simulation of the proposed High-Side nLDMOS exhibits BVdss of 126 V and R(ON,sp) of as low as 2.50 m(omega) x cm2. The NBL, which plays a significant role as a blocking layer against the punch-through seems to function as a hurdle for increasing the breakdown voltage. PMID:23858840

  14. Energy levels and far-infrared optical absorption of impurity doped semiconductor nanorings: Intense laser and electric fields effects

    NASA Astrophysics Data System (ADS)

    Barseghyan, M. G.

    2016-11-01

    The effects of electron-impurity interaction on energy levels and far-infrared absorption in semiconductor nanoring under the action of intense laser and lateral electric fields have been investigated. Numerical calculations are performed using exact diagonalization technique. It is found that the electron-impurity interaction and external fields change the energy spectrum dramatically, and also have significant influence on the absorption spectrum. Strong dependence on laser field intensity and electric field of lowest energy levels, also supported by the Coulomb interaction with impurity, is clearly revealed.

  15. The MSFC complementary metal oxide semiconductor (including multilevel interconnect metallization) process handbook

    NASA Technical Reports Server (NTRS)

    Bouldin, D. L.; Eastes, R. W.; Feltner, W. R.; Hollis, B. R.; Routh, D. E.

    1979-01-01

    The fabrication techniques for creation of complementary metal oxide semiconductor integrated circuits at George C. Marshall Space Flight Center are described. Examples of C-MOS integrated circuits manufactured at MSFC are presented with functional descriptions of each. Typical electrical characteristics of both p-channel metal oxide semiconductor and n-channel metal oxide semiconductor discrete devices under given conditions are provided. Procedures design, mask making, packaging, and testing are included.

  16. Field-effect transistor replaces bulky transformer in analog-gate circuit

    NASA Technical Reports Server (NTRS)

    1965-01-01

    Metal-oxide semiconductor field-effect transistor /MOSFET/ analog-gate circuit adapts well to integrated circuits. It provides better system isolation than a transformer, while size and weight are appreciably reduced.

  17. Plasma-deposited germanium nitride gate insulators for indium phosphide metal-insulator-semiconductor field-effect transistors

    NASA Technical Reports Server (NTRS)

    Johnson, Gregory A.; Kapoor, Vik J.

    1991-01-01

    Plasma-deposited germanium nitride was investigated for the first time as a possible gate insulator for InP compound semiconductor metal-insulator-semiconductor FET (MISFET) technology. The germanium nitride films were successfully deposited in a capacitively coupled parallel plate reactor at 13.56 MHz operation using GeH4/N2/NH3 and GeH4/N2 mixtures as reactant gases. The former process produced better quality films with enhanced uniformity, increased deposition rates, and increased resistivity. The breakdown field strength of the films was greater than 10 to the 6th V/cm. Auger electron spectroscopy did not indicate significant chemical composition differences between the two processes. For MISFETs with 2-micron channel lengths fabricated on InP, the device transconductance and threshold voltage for the GeH4/N2/NH3 process were 17 mS/mm and -3.6 V, respectively. The drain-source breakdown voltages were greater than 10 V.

  18. Physical structure and inversion charge at a semiconductor interface with a crystalline oxide.

    PubMed

    McKee, R A; Walker, F J; Chisholm, M F

    2001-07-20

    We show that the physical and electrical structure and hence the inversion charge for crystalline oxides on semiconductors can be understood and systematically manipulated at the atomic level. Heterojunction band offset and alignment are adjusted by atomic-level structural and chemical changes, resulting in the demonstration of an electrical interface between a polar oxide and a semiconductor free of interface charge. In a broader sense, we take the metal oxide semiconductor device to a new and prominent position in the solid-state electronics timeline. It can now be extensively developed using an entirely new physical system: the crystalline oxides-on-semiconductors interface.

  19. Atomic Layer Deposited Thin Films for Dielectrics, Semiconductor Passivation, and Solid Oxide Fuel Cells

    NASA Astrophysics Data System (ADS)

    Xu, Runshen

    Atomic layer deposition (ALD) utilizes sequential precursor gas pulses to deposit one monolayer or sub-monolayer of material per cycle based on its self-limiting surface reaction, which offers advantages, such as precise thickness control, thickness uniformity, and conformality. ALD is a powerful means of fabricating nanoscale features in future nanoelectronics, such as contemporary sub-45 nm metal-oxide-semiconductor field effect transistors, photovoltaic cells, near- and far-infrared detectors, and intermediate temperature solid oxide fuel cells. High dielectric constant, kappa, materials have been recognized to be promising candidates to replace traditional SiO2 and SiON, because they enable good scalability of sub-45 nm MOSFET (metal-oxide-semiconductor field-effect transistor) without inducing additional power consumption and heat dissipation. In addition to high dielectric constant, high-kappa materials must meet a number of other requirements, such as low leakage current, high mobility, good thermal and structure stability with Si to withstand high-temperature source-drain activation annealing. In this thesis, atomic layer deposited Er2O3 doped TiO2 is studied and proposed as a thermally stable amorphous high-kappa dielectric on Si substrate. The stabilization of TiO2 in its amorphous state is found to achieve a high permittivity of 36, a hysteresis voltage of less than 10 mV, and a low leakage current density of 10-8 A/cm-2 at -1 MV/cm. In III-V semiconductors, issues including unsatisfied dangling bonds and native oxides often result in inferior surface quality that yields non-negligible leakage currents and degrades the long-term performance of devices. The traditional means for passivating the surface of III-V semiconductors are based on the use of sulfide solutions; however, that only offers good protection against oxidation for a short-term (i.e., one day). In this work, in order to improve the chemical passivation efficacy of III-V semiconductors

  20. Field Effect Transistor Behavior in Electrospun Polyaniline/Polyethylene Oxide Demonstrated

    NASA Technical Reports Server (NTRS)

    Mueller, Carl H.; Theofylaktos, Onoufrios; Robinson, Daryl C.; Miranda, Felix A.

    2004-01-01

    Novel transistors and logic devices based on nanotechnology concepts are under intense development. The potential for ultra-low-power circuitry makes nanotechnology attractive for applications such as digital electronics and sensors. For NASA applications, nanotechnology offers tremendous opportunities for increased onboard data processing, and thus autonomous decisionmaking ability, and novel sensors that detect and respond to environmental stimuli with little oversight requirements. Polyaniline/polyethylene oxide (PANi/PEO) nanofibers are of interest because they have electrical conductivities that can be changed from insulating to metallic by varying the doping levels and conformations of the polymer chain. At the NASA Glenn Research Center, we have observed field effect transistor (FET) behavior in electrospun PANi/PEO nanofibers doped with camphorsulfonic acid. The nanofibers were deposited onto Au electrodes, which had been prepatterned onto oxidized silicon substrates. The preceding scanning electron image shows the device used in the transistor measurements. Saturation channel currents are observed at surprisingly low source/drain voltages (see the following graph). The hole mobility in the depletion regime is 1.4x10(exp -4)sq cm/V sec, whereas the one-dimensional charge density (at zero gate bias) is calculated to be approximately 1 hole per 50 two-ring repeat units of polyaniline, consistent with the rather high channel conductivity (approx.10(exp -3) S/cm). Reducing or eliminating the PEO content in the fiber is expected to enhance device parameters. Electrospinning is thus proposed as a simple method of fabricating one-dimensional polymer FET's.

  1. Improved synthesis and growth of graphene oxide for field effect transistor biosensors.

    PubMed

    Huang, Jingfeng; Chen, Hu; Jing, Lin; Fam, Derrick; Tok, Alfred Iing Yoong

    2016-08-01

    Reduced graphene oxide (RGO) has many advantages over graphene such as low-cost, aqueous processable and industrial-scalable. However, two main limitations that prevent the use of RGO in electronics are the high electrical resistance and large electrical resistance deviation between fabricated devices. This limits RGO's use in biosensors, capacitors and other electronic devices. Herein, we present (1) a modified Hummer's method to obtain large RGO flakes via in-situ size fractionation and (2) the novel growth of RGO which can bridge the gaps in-between existing RGO flakes. Together, these two processes reduced the electrical resistance drastically from 1.99E + 06 to 4.68E + 03 Ω/square and the standard deviation decreased from 80.5 % to 16.5 %. The RGO was then fabricated into a field-effect transistor biosensor. A 1 pmol to 100 nmol change in Cytochrome C protein corresponded to a 3 % change in electrical resistance. The reported improved RGO synthesis method and subsequent growth enable large-scale application of RGO in practical electronic devices such as biosensors.

  2. Detection of Matrilysin Activity Using Polypeptide Functionalized Reduced Graphene Oxide Field-Effect Transistor Sensor.

    PubMed

    Chen, Hu; Chen, Peng; Huang, Jingfeng; Selegård, Robert; Platt, Mark; Palaniappan, Alagappan; Aili, Daniel; Tok, Alfred Iing Yoong; Liedberg, Bo

    2016-03-15

    A novel approach for rapid and sensitive detection of matrilysin (MMP-7, a biomarker involved in the degradation of various macromolecules) based on a polypeptide (JR2EC) functionalized reduced graphene oxide (rGO) field effect transistor (FET) is reported. MMP-7 specifically digests negatively charged JR2EC immobilized on rGO, thereby modulating the conductance of rGO-FET. The proposed assay enabled detection of MMP-7 at clinically relevant concentrations with a limit of detection (LOD) of 10 ng/mL (400 pM), attributed to the significant reduction of the net charge of JR2EC upon digestion by MMP-7. Quantitative detection of MMP-7 in human plasma was further demonstrated with a LOD of 40 ng/mL, illustrating the potential for the proposed methodology for tumor detection and carcinoma diagnostic (e.g., lung cancer and salivary gland cancer). Additionally, excellent specificity of the proposed assay was demonstrated using matrix metallopeptidase 1 (MMP-1), a protease of the same family. With appropriate selection and modification of polypeptides, the proposed assay could be extended for detection of other enzymes with polypeptide digestion capability. PMID:26887256

  3. Improved synthesis and growth of graphene oxide for field effect transistor biosensors.

    PubMed

    Huang, Jingfeng; Chen, Hu; Jing, Lin; Fam, Derrick; Tok, Alfred Iing Yoong

    2016-08-01

    Reduced graphene oxide (RGO) has many advantages over graphene such as low-cost, aqueous processable and industrial-scalable. However, two main limitations that prevent the use of RGO in electronics are the high electrical resistance and large electrical resistance deviation between fabricated devices. This limits RGO's use in biosensors, capacitors and other electronic devices. Herein, we present (1) a modified Hummer's method to obtain large RGO flakes via in-situ size fractionation and (2) the novel growth of RGO which can bridge the gaps in-between existing RGO flakes. Together, these two processes reduced the electrical resistance drastically from 1.99E + 06 to 4.68E + 03 Ω/square and the standard deviation decreased from 80.5 % to 16.5 %. The RGO was then fabricated into a field-effect transistor biosensor. A 1 pmol to 100 nmol change in Cytochrome C protein corresponded to a 3 % change in electrical resistance. The reported improved RGO synthesis method and subsequent growth enable large-scale application of RGO in practical electronic devices such as biosensors. PMID:27379845

  4. Epitaxial growth of In-rich InGaN on yttria-stabilized zirconia and its application to metal-insulator-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Kobayashi, Atsushi; Lye, Khe Shin; Ueno, Kohei; Ohta, Jitsuo; Fujioka, Hiroshi

    2016-08-01

    We grew In-rich InxGa1-xN films on yttria-stabilized zirconia (YSZ) substrates at low temperatures by pulsed sputtering deposition. It was found that single-crystal InxGa1-xN (0.63 ≤ x ≤ 0.82) films can be prepared without significant compositional fluctuations at growth temperatures below 500 °C. It was also found that the electrical properties of InGaN are strongly dependent on In composition, growth temperature, and film polarity. N-channel operation of the metal-insulator-semiconductor field-effect transistor (MISFET) with an ultrathin InGaN channel on the YSZ substrates was successfully demonstrated. These results indicate that an InGaN-based MISFET is a promising device for next-generation high-speed electronics.

  5. High performance organic field-effect transistors with ultra-thin HfO{sub 2} gate insulator deposited directly onto the organic semiconductor

    SciTech Connect

    Ono, S.; Häusermann, R.; Chiba, D.; Shimamura, K.; Ono, T.; Batlogg, B.

    2014-01-06

    We have produced stable organic field-effect transistors (OFETs) with an ultra-thin HfO{sub 2} gate insulator deposited directly on top of rubrene single crystals by atomic layer deposition (ALD). We find that ALD is a gentle deposition process to grow thin films without damaging rubrene single crystals, as results these devices have a negligibly small threshold voltage and are very stable against gate-bias-stress, and the mobility exceeds 1 cm{sup 2}/V s. Moreover, the devices show very little degradation even when kept in air for more than 2 months. These results demonstrate thin HfO{sub 2} layers deposited by ALD to be well suited as high capacitance gate dielectrics in OFETs operating at small gate voltage. In addition, the dielectric layer acts as an effective passivation layer to protect the organic semiconductor.

  6. High performance organic field-effect transistors with ultra-thin HfO2 gate insulator deposited directly onto the organic semiconductor

    NASA Astrophysics Data System (ADS)

    Ono, S.; Häusermann, R.; Chiba, D.; Shimamura, K.; Ono, T.; Batlogg, B.

    2014-01-01

    We have produced stable organic field-effect transistors (OFETs) with an ultra-thin HfO2 gate insulator deposited directly on top of rubrene single crystals by atomic layer deposition (ALD). We find that ALD is a gentle deposition process to grow thin films without damaging rubrene single crystals, as results these devices have a negligibly small threshold voltage and are very stable against gate-bias-stress, and the mobility exceeds 1 cm2/V s. Moreover, the devices show very little degradation even when kept in air for more than 2 months. These results demonstrate thin HfO2 layers deposited by ALD to be well suited as high capacitance gate dielectrics in OFETs operating at small gate voltage. In addition, the dielectric layer acts as an effective passivation layer to protect the organic semiconductor.

  7. Chemical Gated Field Effect Transistor by Hybrid Integration of One-Dimensional Silicon Nanowire and Two-Dimensional Tin Oxide Thin Film for Low Power Gas Sensor.

    PubMed

    Han, Jin-Woo; Rim, Taiuk; Baek, Chang-Ki; Meyyappan, M

    2015-09-30

    Gas sensors based on metal-oxide-semiconductor transistor with the polysilicon gate replaced by a gas sensitive thin film have been around for over 50 years. These are not suitable for the emerging mobile and wearable sensor platforms due to operating voltages and powers far exceeding the supply capability of batteries. Here we present a novel approach to decouple the chemically sensitive region from the conducting channel for reducing the drive voltage and increasing reliability. This chemically gated field effect transistor uses silicon nanowire for the current conduction channel with a tin oxide film on top of the nanowire serving as the gas sensitive medium. The potential change induced by the molecular adsorption and desorption allows the electrically floating tin oxide film to gate the silicon channel. As the device is designed to be normally off, the power is consumed only during the gas sensing event. This feature is attractive for the battery operated sensor and wearable electronics. In addition, the decoupling of the chemical reaction and the current conduction regions allows the gas sensitive material to be free from electrical stress, thus increasing reliability. The device shows excellent gas sensitivity to the tested analytes relative to conventional metal oxide transistors and resistive sensors.

  8. Chemical Gated Field Effect Transistor by Hybrid Integration of One-Dimensional Silicon Nanowire and Two-Dimensional Tin Oxide Thin Film for Low Power Gas Sensor.

    PubMed

    Han, Jin-Woo; Rim, Taiuk; Baek, Chang-Ki; Meyyappan, M

    2015-09-30

    Gas sensors based on metal-oxide-semiconductor transistor with the polysilicon gate replaced by a gas sensitive thin film have been around for over 50 years. These are not suitable for the emerging mobile and wearable sensor platforms due to operating voltages and powers far exceeding the supply capability of batteries. Here we present a novel approach to decouple the chemically sensitive region from the conducting channel for reducing the drive voltage and increasing reliability. This chemically gated field effect transistor uses silicon nanowire for the current conduction channel with a tin oxide film on top of the nanowire serving as the gas sensitive medium. The potential change induced by the molecular adsorption and desorption allows the electrically floating tin oxide film to gate the silicon channel. As the device is designed to be normally off, the power is consumed only during the gas sensing event. This feature is attractive for the battery operated sensor and wearable electronics. In addition, the decoupling of the chemical reaction and the current conduction regions allows the gas sensitive material to be free from electrical stress, thus increasing reliability. The device shows excellent gas sensitivity to the tested analytes relative to conventional metal oxide transistors and resistive sensors. PMID:26381613

  9. NO2 sensitive Au gate metal-oxide-semiconductor capacitors

    NASA Astrophysics Data System (ADS)

    Filippini, D.; Aragón, R.; Weimar, U.

    2001-08-01

    Au gate metal-oxide-semiconductor capacitors are sensitive to NO2 in air up to 200 ppm, depending on operating temperature (100 °C to 200 °C), gate thickness (50 to 900 nm), and morphology. In the absence of catalytic properties or lattice diffusivity, a model invoking molecular surface adsorption and grain boundary diffusion is proposed, which quantitatively describes the transient and steady state response of the devices. Sensitivity is given by the arrival of the diffusing species to the gate-dielectric interface, where capacitive coupling of the adsorbed molecules induces work function changes, which shift the flat band voltage positively, opposite that observed for H2 with Pd gates, consistently with an oxidizing, rather than reducing, character.

  10. Comparative analysis of breakdown mechanism in thin SiO2 oxide films in metal-oxide-semiconductor structures under the action of heavy charged particles and a pulsed voltage

    NASA Astrophysics Data System (ADS)

    Zinchenko, V. F.; Lavrent'ev, K. V.; Emel'yanov, V. V.; Vatuev, A. S.

    2016-02-01

    Regularities in the breakdown of thin SiO2 oxide films in metal-oxide-semiconductors structures of power field-effect transistors under the action of single heavy charged particles and a pulsed voltage are studied experimentally. Using a phenomenological approach, we carry out comparative analysis of physical mechanisms and energy criteria of the SiO2 breakdown in extreme conditions of excitation of the electron subsystem in the subpicosecond time range.

  11. Improved gate oxide integrity of strained Si n-channel metal oxide silicon field effect transistors using thin virtual substrates

    NASA Astrophysics Data System (ADS)

    Yan, L.; Olsen, S. H.; Escobedo-Cousin, E.; O'Neill, A. G.

    2008-05-01

    This work presents a detailed study of ultrathin gate oxide integrity in strained Si metal oxide silicon field effect transistors (MOSFETs) fabricated on thin virtual substrates aimed at reducing device self-heating. The gate oxide quality and reliability of the devices are compared to those of simultaneously processed Si control devices and conventional thick virtual substrate devices that have the same Ge content (20%), strained Si channel thickness, and channel strain. The thin virtual substrates offer the same mobility enhancement as the thick virtual substrates (˜100% compared to universal mobility data) and are effective at reducing device self-heating. Up to 90% improvement in gate leakage current is demonstrated for the strained Si n-channel MOSFETs compared to that for the bulk Si controls. The lower leakage arises from the increased electron affinity in tensile strained Si and is significant due to the sizeable strain generated by using wafer-level stressors. The strain-induced leakage reductions also lead to major improvements in stress-induced leakage current (SILC) and oxide reliability. The lower leakage current of the thin and thick virtual substrate devices compares well to theoretical estimates based on the Wentzel-Kramers-Brillouin approximation. Breakdown characteristics also differ considerably between the devices, with the strained Si devices exhibiting a one order of magnitude increase in time to hard breakdown (THBD) compared to the Si control devices following high-field stressing at 17 MV cm-1. The strained Si devices are exempted from soft breakdown. Experimental based analytical leakage modeling has been carried out across the field range for the first time in thin oxides and demonstrates that Poole-Frenkel (PF) emissions followed by Fowler-Nordheim tunneling dominate gate leakage current at low fields in all of the devices. This contrasts to the frequently reported assumption that direct tunneling dominates gate leakage in ultrathin

  12. Low Temperature Processed Complementary Metal Oxide Semiconductor (CMOS) Device by Oxidation Effect from Capping Layer

    PubMed Central

    Wang, Zhenwei; Al-Jawhari, Hala A.; Nayak, Pradipta K.; Caraveo-Frescas, J. A.; Wei, Nini; Hedhili, M. N.; Alshareef, H. N.

    2015-01-01

    In this report, both p- and n-type tin oxide thin-film transistors (TFTs) were simultaneously achieved using single-step deposition of the tin oxide channel layer. The tuning of charge carrier polarity in the tin oxide channel is achieved by selectively depositing a copper oxide capping layer on top of tin oxide, which serves as an oxygen source, providing additional oxygen to form an n-type tin dioxide phase. The oxidation process can be realized by annealing at temperature as low as 190°C in air, which is significantly lower than the temperature generally required to form tin dioxide. Based on this approach, CMOS inverters based entirely on tin oxide TFTs were fabricated. Our method provides a solution to lower the process temperature for tin dioxide phase, which facilitates the application of this transparent oxide semiconductor in emerging electronic devices field. PMID:25892711

  13. Low temperature processed complementary metal oxide semiconductor (CMOS) device by oxidation effect from capping layer.

    PubMed

    Wang, Zhenwei; Al-Jawhari, Hala A; Nayak, Pradipta K; Caraveo-Frescas, J A; Wei, Nini; Hedhili, M N; Alshareef, H N

    2015-04-20

    In this report, both p- and n-type tin oxide thin-film transistors (TFTs) were simultaneously achieved using single-step deposition of the tin oxide channel layer. The tuning of charge carrier polarity in the tin oxide channel is achieved by selectively depositing a copper oxide capping layer on top of tin oxide, which serves as an oxygen source, providing additional oxygen to form an n-type tin dioxide phase. The oxidation process can be realized by annealing at temperature as low as 190 °C in air, which is significantly lower than the temperature generally required to form tin dioxide. Based on this approach, CMOS inverters based entirely on tin oxide TFTs were fabricated. Our method provides a solution to lower the process temperature for tin dioxide phase, which facilitates the application of this transparent oxide semiconductor in emerging electronic devices field.

  14. Band-Gap Engineering at a Semiconductor-Crystalline Oxide Interface

    SciTech Connect

    Jahangir-Moghadam, Mohammadreza; Ahmadi-Majlan, Kamyar; Shen, Xuan; Droubay, Timothy; Bowden, Mark; Chrysler, Matthew; Su, Dong; Chambers, Scott A.; Ngai, Joseph H.

    2015-02-09

    The epitaxial growth of crystalline oxides on semiconductors provides a pathway to introduce new functionalities to semiconductor devices. Key to integrating the functionalities of oxides onto semiconductors is controlling the band alignment at interfaces between the two materials. Here we apply principles of band gap engineering traditionally used at heterojunctions between conventional semiconductors to control the band offset between a single crystalline oxide and a semiconductor. Reactive molecular beam epitaxy is used to realize atomically abrupt and structurally coherent interfaces between SrZrxTi1-xO₃ and Ge, in which the band gap of the former is enhanced with Zr content x. We present structural and electrical characterization of SrZrxTi1-xO₃-Ge heterojunctions and demonstrate a type-I band offset can be achieved. These results demonstrate that band gap engineering can be exploited to realize functional semiconductor crystalline oxide heterojunctions.

  15. Band-Gap Engineering at a Semiconductor-Crystalline Oxide Interface

    DOE PAGES

    Jahangir-Moghadam, Mohammadreza; Ahmadi-Majlan, Kamyar; Shen, Xuan; Droubay, Timothy; Bowden, Mark; Chrysler, Matthew; Su, Dong; Chambers, Scott A.; Ngai, Joseph H.

    2015-02-09

    The epitaxial growth of crystalline oxides on semiconductors provides a pathway to introduce new functionalities to semiconductor devices. Key to integrating the functionalities of oxides onto semiconductors is controlling the band alignment at interfaces between the two materials. Here we apply principles of band gap engineering traditionally used at heterojunctions between conventional semiconductors to control the band offset between a single crystalline oxide and a semiconductor. Reactive molecular beam epitaxy is used to realize atomically abrupt and structurally coherent interfaces between SrZrxTi1-xO₃ and Ge, in which the band gap of the former is enhanced with Zr content x. We presentmore » structural and electrical characterization of SrZrxTi1-xO₃-Ge heterojunctions and demonstrate a type-I band offset can be achieved. These results demonstrate that band gap engineering can be exploited to realize functional semiconductor crystalline oxide heterojunctions.« less

  16. Plasma Deposited SiO2 for Planar Self-Aligned Gate Metal-Insulator-Semiconductor Field Effect Transistors on Semi-Insulating InP

    NASA Technical Reports Server (NTRS)

    Tabory, Charles N.; Young, Paul G.; Smith, Edwyn D.; Alterovitz, Samuel A.

    1994-01-01

    Metal-insulator-semiconductor (MIS) field effect transistors were fabricated on InP substrates using a planar self-aligned gate process. A 700-1000 A gate insulator of Si02 doped with phosphorus was deposited by a direct plasma enhanced chemical vapor deposition at 400 mTorr, 275 C, 5 W, and power density of 8.5 MW/sq cm. High frequency capacitance-voltage measurements were taken on MIS capacitors which have been subjected to a 700 C anneal and an interface state density of lxl0(exp 11)/eV/cq cm was found. Current-voltage measurements of the capacitors show a breakdown voltage of 107 V/cm and a insulator resistivity of 10(exp 14) omega cm. Transistors were fabricated on semi-insulating InP using a standard planar self-aligned gate process in which the gate insulator was subjected to an ion implantation activation anneal of 700 C. MIS field effect transistors gave a maximum extrinsic transconductance of 23 mS/mm for a gate length of 3 microns. The drain current drift saturated at 87.5% of the initial current, while reaching to within 1% of the saturated value after only 1x10(exp 3). This is the first reported viable planar InP self-aligned gate transistor process reported to date.

  17. Crystalline oxides on semiconductors: a future for the nanotransistor

    NASA Astrophysics Data System (ADS)

    Buongiorno Nardelli, M.; Walker, F. J.; McKee, R. A.

    2004-08-01

    This issue's Editor's Choice [1] is a brief review on promises and advantages of crystalline oxides on semiconductors, especially the role of interfaces, for semiconductor technology.The cover picture shows at the top a Z-contrast image of the Si:SrSi2:SrO interface, where on the left side the positions of the atoms are highlighted, and on the right side a theoretical simulation of the image is overlayed, using the theoretical equilibrium geometry of the interface as obtained from first principles (bottom, green: Si, blue: O, orange: Sr). Purple isosurfaces show the electron density of the Si-O bonding state, and the arrows give the direction of the microscopic dipoles at the interface.The first author Marco Buongiorno Nardelli is Professor at the Department of Physics of North Carolina State University, where he heads a research group focusing on the application of ab-initio electronic structure calculation techniques for the study of important aspects of the physics of materials (ERMES).This paper is a presentation from the 5th Motorola Workshop on Computational Materials and Electronics (MWCME 2003), held in Austin, Texas, 13-14 November 2003. The proceedings were guest-edited, for the fourth time in this journal, by Alex Demkov (now Freescale Semiconductor).This issue of physica status solidi (b) also contains Original Papers presented at the XI Latin American Congress of Surface Science and Its Applications (XI CLACSA), Pucón, Chile, 7-12 December 2003. The Proceedings of this conference are to be continued in phys. stat. sol. (a) 201, No. 10 (2004) and in an online issue of phys. stat. sol. (c) 1, No. S1 (2004).

  18. Recent progress in magnetic iron oxide-semiconductor composite nanomaterials as promising photocatalysts

    NASA Astrophysics Data System (ADS)

    Wu, Wei; Changzhong Jiang, Affc; Roy, Vellaisamy A. L.

    2014-11-01

    Photocatalytic degradation of toxic organic pollutants is a challenging tasks in ecological and environmental protection. Recent research shows that the magnetic iron oxide-semiconductor composite photocatalytic system can effectively break through the bottleneck of single-component semiconductor oxides with low activity under visible light and the challenging recycling of the photocatalyst from the final products. With high reactivity in visible light, magnetic iron oxide-semiconductors can be exploited as an important magnetic recovery photocatalyst (MRP) with a bright future. On this regard, various composite structures, the charge-transfer mechanism and outstanding properties of magnetic iron oxide-semiconductor composite nanomaterials are sketched. The latest synthesis methods and recent progress in the photocatalytic applications of magnetic iron oxide-semiconductor composite nanomaterials are reviewed. The problems and challenges still need to be resolved and development strategies are discussed.

  19. Recent progress in magnetic iron oxide-semiconductor composite nanomaterials as promising photocatalysts.

    PubMed

    Wu, Wei; Changzhong Jiang; Roy, Vellaisamy A L

    2015-01-01

    Photocatalytic degradation of toxic organic pollutants is a challenging tasks in ecological and environmental protection. Recent research shows that the magnetic iron oxide-semiconductor composite photocatalytic system can effectively break through the bottleneck of single-component semiconductor oxides with low activity under visible light and the challenging recycling of the photocatalyst from the final products. With high reactivity in visible light, magnetic iron oxide-semiconductors can be exploited as an important magnetic recovery photocatalyst (MRP) with a bright future. On this regard, various composite structures, the charge-transfer mechanism and outstanding properties of magnetic iron oxide-semiconductor composite nanomaterials are sketched. The latest synthesis methods and recent progress in the photocatalytic applications of magnetic iron oxide-semiconductor composite nanomaterials are reviewed. The problems and challenges still need to be resolved and development strategies are discussed. PMID:25406760

  20. Semiconductor metal oxide compounds based gas sensors: A literature review

    NASA Astrophysics Data System (ADS)

    Patil, Sunil Jagannath; Patil, Arun Vithal; Dighavkar, Chandrakant Govindrao; Thakare, Kashinath Shravan; Borase, Ratan Yadav; Nandre, Sachin Jayaram; Deshpande, Nishad Gopal; Ahire, Rajendra Ramdas

    2015-03-01

    This paper gives a statistical view about important contributions and advances on semiconductor metal oxide (SMO) compounds based gas sensors developed to detect the air pollutants such as liquefied petroleum gas (LPG), H2S, NH3, CO2, acetone, ethanol, other volatile compounds and hazardous gases. Moreover, it is revealed that the alloy/composite made up of SMO gas sensors show better gas response than their counterpart single component gas sensors, i.e., they are found to enhance the 4S characteristics namely speed, sensitivity, selectivity and stability. Improvement of such types of sensors used for detection of various air pollutants, which are reported in last two decades, is highlighted herein.

  1. A divalent rare earth oxide semiconductor: Yttrium monoxide

    NASA Astrophysics Data System (ADS)

    Kaminaga, Kenichi; Sei, Ryosuke; Hayashi, Kouichi; Happo, Naohisa; Tajiri, Hiroo; Oka, Daichi; Fukumura, Tomoteru; Hasegawa, Tetsuya

    2016-03-01

    Rare earth oxides are usually widegap insulators like Y2O3 with closed shell trivalent rare earth ions. In this study, solid phase rock salt structure yttrium monoxide, YO, with unusual valence of Y2+ (4d1) was synthesized in a form of epitaxial thin film by pulsed laser deposition method. YO has been recognized as gaseous phase in previous studies. In contrast with Y2O3, YO was dark-brown colored and narrow gap semiconductor. The tunable electrical conductivity ranging from 10-1 to 103 Ω-1 cm-1 was attributed to the presence of oxygen vacancies serving as electron donor. Weak antilocalization behavior observed in magnetoresistance indicated significant role of spin-orbit coupling as a manifestation of 4d electron carrier.

  2. Hydrogen Gas Sensors Based on Semiconductor Oxide Nanostructures

    PubMed Central

    Gu, Haoshuang; Wang, Zhao; Hu, Yongming

    2012-01-01

    Recently, the hydrogen gas sensing properties of semiconductor oxide (SMO) nanostructures have been widely investigated. In this article, we provide a comprehensive review of the research progress in the last five years concerning hydrogen gas sensors based on SMO thin film and one-dimensional (1D) nanostructures. The hydrogen sensing mechanism of SMO nanostructures and some critical issues are discussed. Doping, noble metal-decoration, heterojunctions and size reduction have been investigated and proved to be effective methods for improving the sensing performance of SMO thin films and 1D nanostructures. The effect on the hydrogen response of SMO thin films and 1D nanostructures of grain boundary and crystal orientation, as well as the sensor architecture, including electrode size and nanojunctions have also been studied. Finally, we also discuss some challenges for the future applications of SMO nanostructured hydrogen sensors. PMID:22778599

  3. Surface potential determination in metal-oxide-semiconductor capacitors

    NASA Astrophysics Data System (ADS)

    Moragues, J. M.; Ciantar, E.; Jerisian, R.; Sagnes, B.; Oualid, J.

    1994-11-01

    Different methods using the relationship between surface potential Psi(sub S) and gate bias V(sub G) in metal-oxide-semiconductor (MOS) capacitors have been compared. These methods can be applied even if the doping profile is very abrupt and the interface state density very high. The shifts of midgap, flatband, and threshold voltages, observed after Fowler-Nordheim electron injection, and deduced from the various Psi(sub S(V (sub G)) relationships obtained by these different methods, are in good agreement. These shifts give the number of effective oxide trapped charges (N(sub ox)) per unit area and acceptor-like and donor-like interface states (N(sub SS)A and N(sub SS)D) which are created during the electron injection. We reveal that the number of positive charges created in the gate oxide, unlike the number of generated interface states, strongly depends on the position of the post-metallization annealing step in the process. After relaxation of the stressed MOS capacitors, most of the generated positive charges can be attributed, in the MOS capacitors studied, to hydrogen-related species. It seems that the interface states are essentially created by the recombination of holes generated by electron impact.

  4. Exploration of oxide-based diluted magnetic semiconductors toward transparent spintronics

    NASA Astrophysics Data System (ADS)

    Fukumura, T.; Yamada, Y.; Toyosaki, H.; Hasegawa, T.; Koinuma, H.; Kawasaki, M.

    2004-02-01

    A review is given for the recent progress of research in the field of oxide-based diluted magnetic semiconductor (DMS), which was triggered by combinatorial discovery of transparent ferromagnet. The possible advantages of oxide semiconductor as a host of DMS are described in comparison with conventional compound semiconductors. Limits and problems for identifying novel ferromagnetic DMS are described in view of recent reports in this field. Several characterization techniques are proposed in order to eliminate unidentified ferromagnetism of oxide-based DMS unidentified ferromagnetic oxide (UFO). Perspectives and possible devices are also given.

  5. Spintronic effects in metallic, semiconductor, metal oxide and metal semiconductor heterostructures

    NASA Astrophysics Data System (ADS)

    Bratkovsky, A. M.

    2008-02-01

    Spintronics is a rapidly growing field focusing on phenomena and related devices essentially dependent on spin transport. Some of them are already an established part of microelectronics. We review recent theoretical and experimental advances in achieving large spin injection efficiency (polarization of current) and accumulated spin polarization. These include tunnel and giant magnetoresistance, spin-torque and spin-orbit effects on electron transport in various heterostructures. We give a microscopic description of spin tunneling through oxide and modified Schottky barriers between a ferromagnet (FM) and a semiconductor (S). It is shown that in such FM-S junctions electrons with a certain spin projection can be efficiently injected into (or extracted from) S, while electrons with the opposite spin can accumulate in S near the interface. The criterion for efficient injection is opposite to a known Rashba criterion, since the barrier should be rather transparent. In degenerate semiconductors, extraction of spin can proceed at low temperatures. We mention a few novel spin-valve ultrafast devices with small dissipated power: a magnetic sensor, a spin transistor, an amplifier, a frequency multiplier, a square-law detector and a source of polarized radiation. We also discuss effects related to spin-orbital interactions, such as the spin Hall effect (SHE) and a recently predicted positive magnetoresistance accompanying SHE. Some esoteric devices such as 'spinFET', interacting spin logic and spin-based quantum computing are discussed and problems with their realization are highlighted. We demonstrate that the so-called 'ferroelectric tunnel junctions' are unlikely to provide additional functionality because in all realistic situations the ferroelectric barrier would be split into domains by the depolarizing field.

  6. Oxide semiconductors for organic opto-electronic devices

    NASA Astrophysics Data System (ADS)

    Sigdel, Ajaya K.

    In this dissertation, I have introduced various concepts on the modulations of various surface, interface and bulk opto-electronic properties of ZnO based semiconductor for charge transport, charge selectivity and optimal device performance. I have categorized transparent semiconductors into two sub groups depending upon their role in a device. Electrodes, usually 200 to 500 nm thick, optimized for good transparency and transporting the charges to the external circuit. Here, the electrical conductivity in parallel direction to thin film, i.e bulk conductivity is important. And contacts, usually 5 to 50 nm thick, are optimized in case of solar cells for providing charge selectivity and asymmetry to manipulate the built in field inside the device for charge separation and collection. Whereas in Organic LEDs (OLEDs), contacts provide optimum energy level alignment at organic oxide interface for improved charge injections. For an optimal solar cell performance, transparent electrodes are designed with maximum transparency in the region of interest to maximize the light to pass through to the absorber layer for photo-generation, plus they are designed for minimum sheet resistance for efficient charge collection and transport. As such there is need for material with high conductivity and transparency. Doping ZnO with some common elements such as B, Al, Ga, In, Ge, Si, and F result in n-type doping with increase in carriers resulting in high conductivity electrode, with better or comparable opto-electronic properties compared to current industry-standard indium tin oxide (ITO). Furthermore, improvement in mobility due to improvement on crystallographic structure also provide alternative path for high conductivity ZnO TCOs. Implementing these two aspects, various studies were done on gallium doped zinc oxide (GZO) transparent electrode, a very promising indium free electrode. The dynamics of the superimposed RF and DC power sputtering was utilized to improve the

  7. Self-aligned graphene field-effect transistors on SiC (0001) substrates with self-oxidized gate dielectric

    NASA Astrophysics Data System (ADS)

    Jia, Li; Cui, Yu; Li, Wang; Qingbin, Liu; Zezhao, He; Shujun, Cai; Zhihong, Feng

    2014-07-01

    A scalable self-aligned approach is employed to fabricate monolayer graphene field-effect transistors on semi-insulated 4H-SiC (0001) substrates. The self-aligned process minimized access resistance and parasitic capacitance. Self-oxidized Al2O3, formed by deposition of 2 nm Al followed by exposure in air to be oxidized, is used as gate dielectric and shows excellent insulation. An intrinsic cutoff frequency of 34 GHz and maximum oscillation frequency of 36.4 GHz are realized for the monolayer graphene field-effect transistor with a gate length of 0.2 μm. These studies show a pathway to fabricate graphene transistors for future applications in ultra-high frequency circuits.

  8. Investigations on Substrate Temperature-Induced Growth Modes of Organic Semiconductors at Dielectric/semiconductor Interface and Their Correlation with Threshold Voltage Stability in Organic Field-Effect Transistors.

    PubMed

    Padma, Narayanan; Maheshwari, Priya; Bhattacharya, Debarati; Tokas, Raj B; Sen, Shashwati; Honda, Yoshihide; Basu, Saibal; Pujari, Pradeep Kumar; Rao, T V Chandrasekhar

    2016-02-10

    Influence of substrate temperature on growth modes of copper phthalocyanine (CuPc) thin films at the dielectric/semiconductor interface in organic field effect transistors (OFETs) is investigated. Atomic force microscopy (AFM) imaging at the interface reveals a change from 'layer+island' to "island" growth mode with increasing substrate temperatures, further confirmed by probing the buried interfaces using X-ray reflectivity (XRR) and positron annihilation spectroscopic (PAS) techniques. PAS depth profiling provides insight into the details of molecular ordering while positron lifetime measurements reveal the difference in packing modes of CuPc molecules at the interface. XRR measurements show systematic increase in interface width and electron density correlating well with the change from layer + island to coalesced huge 3D islands at higher substrate temperatures. Study demonstrates the usefulness of XRR and PAS techniques to study growth modes at buried interfaces and reveals the influence of growth modes of semiconductor at the interface on hole and electron trap concentrations individually, thereby affecting hysteresis and threshold voltage stability. Minimum hole trapping is correlated to near layer by layer formation close to the interface at 100 °C and maximum to the island formation with large voids between the grains at 225 °C.

  9. Investigations on Substrate Temperature-Induced Growth Modes of Organic Semiconductors at Dielectric/semiconductor Interface and Their Correlation with Threshold Voltage Stability in Organic Field-Effect Transistors.

    PubMed

    Padma, Narayanan; Maheshwari, Priya; Bhattacharya, Debarati; Tokas, Raj B; Sen, Shashwati; Honda, Yoshihide; Basu, Saibal; Pujari, Pradeep Kumar; Rao, T V Chandrasekhar

    2016-02-10

    Influence of substrate temperature on growth modes of copper phthalocyanine (CuPc) thin films at the dielectric/semiconductor interface in organic field effect transistors (OFETs) is investigated. Atomic force microscopy (AFM) imaging at the interface reveals a change from 'layer+island' to "island" growth mode with increasing substrate temperatures, further confirmed by probing the buried interfaces using X-ray reflectivity (XRR) and positron annihilation spectroscopic (PAS) techniques. PAS depth profiling provides insight into the details of molecular ordering while positron lifetime measurements reveal the difference in packing modes of CuPc molecules at the interface. XRR measurements show systematic increase in interface width and electron density correlating well with the change from layer + island to coalesced huge 3D islands at higher substrate temperatures. Study demonstrates the usefulness of XRR and PAS techniques to study growth modes at buried interfaces and reveals the influence of growth modes of semiconductor at the interface on hole and electron trap concentrations individually, thereby affecting hysteresis and threshold voltage stability. Minimum hole trapping is correlated to near layer by layer formation close to the interface at 100 °C and maximum to the island formation with large voids between the grains at 225 °C. PMID:26761590

  10. Cu2O-based solar cells using oxide semiconductors

    NASA Astrophysics Data System (ADS)

    Minami, Tadatsugu; Nishi, Yuki; Miyata, Toshihiro

    2016-01-01

    We describe significant improvements of the photovoltaic properties that were achieved in Al-doped ZnO (AZO)/n-type oxide semiconductor/p-type Cu2O heterojunction solar cells fabricated using p-type Cu2O sheets prepared by thermally oxidizing Cu sheets. The multicomponent oxide thin film used as the n-type semiconductor layer was prepared with various chemical compositions on non-intentionally heated Cu2O sheets under various deposition conditions using a pulsed laser deposition method. In Cu2O-based heterojunction solar cells fabricated using various ternary compounds as the n-type oxide thin-film layer, the best photovoltaic performance was obtained with an n-ZnGa2O4 thin-film layer. In most of the Cu2O-based heterojunction solar cells using multicomponent oxides composed of combinations of various binary compounds, the obtained photovoltaic properties changed gradually as the chemical composition was varied. However, with the ZnO-MgO and Ga2O3-Al2O3 systems, higher conversion efficiencies (η) as well as a high open circuit voltage (Voc) were obtained by using a relatively small amount of MgO or Al2O3, e.g., (ZnO)0.91-(MgO)0.09 and (Ga2O3)0.975-(Al2O3)0.025, respectively. When Cu2O-based heterojunction solar cells were fabricated using Al2O3-Ga2O3-MgO-ZnO (AGMZO) multicomponent oxide thin films deposited with metal atomic ratios of 10, 60, 10 and 20 at.% for the Al, Ga, Mg and Zn, respectively, a high Voc of 0.98 V and an η of 4.82% were obtained. In addition, an enhanced η and an improved fill factor could be achieved in AZO/n-type multicomponent oxide/p-type Cu2O heterojunction solar cells fabricated using Na-doped Cu2O (Cu2O:Na) sheets that featured a resistivity controlled by optimizing the post-annealing temperature and duration. Consequently, an η of 6.25% and a Voc of 0.84 V were obtained in a MgF2/AZO/n-(Ga2O3-Al2O3)/p-Cu2O:Na heterojunction solar cell fabricated using a Cu2O:Na sheet with a resistivity of approximately 10 Ω·cm and a (Ga0.975Al0

  11. Indium oxide: A transparent, conducting ferromagnetic semiconductor for spintronic applications

    NASA Astrophysics Data System (ADS)

    Babu, S. Harinath; Kaleemulla, S.; Rao, N. Madhusudhana; Krishnamoorthi, C.

    2016-10-01

    The optical and electrical properties are the two important dimensions of Indium oxide and its derivatives (indium tin oxide) and were well studied to understand the origin of wide electronic band gap and high electrical conductivity at room temperature. In2O3 and its derivatives find many applications in electronic and optoelectronic domains based on the above properties. The recent discovery of ferromagnetism in In2O3 at room temperature become a third dimension and lead to intensive research on enhancement of ferromagnetic strength by various means such as dopants and synthesis protocols and extrinsic parameters. The research lead to enormous experimental data and theoretical models proliferation over the past one decade with diverse insights into the origin of ferromagnetism in In2O3 based dilute magnetic semiconductors. The experimental data and theoretical models of ferromagnetism in In2O3 has been thoroughly surveyed in the literature and compiled all the data and presented for easy of understanding in this review. We have identified best chemical composition, geometry and synthesis protocols for strongest ferromagnetic strength and suitable theoretical model of magnetism has been presented in this review.

  12. Oxide Ferromagnetic Semiconductors for Spin-Electronic Transprt

    SciTech Connect

    Dr. R. K. Pandey, Cudworth Endowed Professor Ingram Endowed Professor, Ingram School of Engineering and Physics Department, Texas State University, San Marocs, TX78666

    2008-11-24

    The objective of this research was to investigate the viability of oxide magnetic semiconductors as potential materials for spintronics. We identified some members of the solid solution series of ilmenite (FeTiO3) and hematite (Fe2O3), abbreviated as (IH) for simplicity, for our investigations based on their ferromagnetic and semiconducting properties. With this objective in focus we limited our investigations to the following members of the modified Fe-titanates: IH33 (ilmenitehematite with 33 atomic percent hematite), IH45 (ilmenite-hematite with 45 atomic percent hematite), Mn-substituted ilmenite (Mn-FeTiO3), and Mn-substituted pseudobrookite (Mn- Fe2TiO5). All of them are: 1. wide bandgap semiconductors with band gaps ranging in values between 2.5 to 3.5 eV; 2. n-type semiconductors; 3.they exhibit well defined magnetic hysteresis loops and 4. their magnetic Curie points are greater than 400K. Ceramic, film and single crystal samples were studied and based on their properties we produced varistors (also known as voltage dependent resistors) for microelectronic circuit protection from power surges, three-terminal microelectronic devices capable of generating bipolar currents, and an integrated structured device with controlled magnetic switching of spins. Eleven refereed journal papers, three refereed conference papers and three invention disclosures resulted from our investigations. We also presented invited papers in three international conferences and one national conference. Furthermore two students graduated with Ph.D. degrees, three with M.S. degrees and one with B.S. degree. Also two post-doctoral fellows were actively involved in this research. We established the radiation hardness of our devices in collaboration with a colleague in an HBCU institution, at the Cyclotron Center at Texas A&M University, and at DOE National Labs (Los Alamos and Brookhaven). It is to be appreciated that we met most of our goals and expanded vastly the scope of research by

  13. Black Phosphorus-Zinc Oxide Nanomaterial Heterojunction for p-n Diode and Junction Field-Effect Transistor.

    PubMed

    Jeon, Pyo Jin; Lee, Young Tack; Lim, June Yeong; Kim, Jin Sung; Hwang, Do Kyung; Im, Seongil

    2016-02-10

    Black phosphorus (BP) nanosheet is two-dimensional (2D) semiconductor with distinct band gap and attracting recent attention from researches because it has some similarity to gapless 2D semiconductor graphene in the following two aspects: single element (P) for its composition and quite high mobilities depending on its fabrication conditions. Apart from several electronic applications reported with BP nanosheet, here we report for the first time BP nanosheet-ZnO nanowire 2D-1D heterojunction applications for p-n diodes and BP-gated junction field effect transistors (JFETs) with n-ZnO channel on glass. For these nanodevices, we take advantages of the mechanical flexibility of p-type conducting of BP and van der Waals junction interface between BP and ZnO. As a result, our BP-ZnO nanodimension p-n diode displays a high ON/OFF ratio of ∼10(4) in static rectification and shows kilohertz dynamic rectification as well while ZnO nanowire channel JFET operations are nicely demonstrated by BP gate switching in both electrostatics and kilohertz dynamics. PMID:26771206

  14. Black Phosphorus-Zinc Oxide Nanomaterial Heterojunction for p-n Diode and Junction Field-Effect Transistor.

    PubMed

    Jeon, Pyo Jin; Lee, Young Tack; Lim, June Yeong; Kim, Jin Sung; Hwang, Do Kyung; Im, Seongil

    2016-02-10

    Black phosphorus (BP) nanosheet is two-dimensional (2D) semiconductor with distinct band gap and attracting recent attention from researches because it has some similarity to gapless 2D semiconductor graphene in the following two aspects: single element (P) for its composition and quite high mobilities depending on its fabrication conditions. Apart from several electronic applications reported with BP nanosheet, here we report for the first time BP nanosheet-ZnO nanowire 2D-1D heterojunction applications for p-n diodes and BP-gated junction field effect transistors (JFETs) with n-ZnO channel on glass. For these nanodevices, we take advantages of the mechanical flexibility of p-type conducting of BP and van der Waals junction interface between BP and ZnO. As a result, our BP-ZnO nanodimension p-n diode displays a high ON/OFF ratio of ∼10(4) in static rectification and shows kilohertz dynamic rectification as well while ZnO nanowire channel JFET operations are nicely demonstrated by BP gate switching in both electrostatics and kilohertz dynamics.

  15. Extended characterization of the damage by hot charge carriers in gate oxide by short channel MOS field effect transistors

    NASA Astrophysics Data System (ADS)

    Mahnkopf, Reinhard

    Transistors from several technologies are tested by measurements of the capacities and the characteristic curves. A model allows obtaining of the gate and substrate currents. The damages at the phase limit and in the oxide are characterized by macroscopic current and voltage variations and by generated charge densities. For p-MOS (Metal Oxide Semiconductor) transistors, the production of oxide charges is the most important fact, in relation to the injected hot electrons; for n-MOS transistors, the generation of phase limit states is the main phenomenon. It is proved that the damages are located at the chain contact in the lateral direction but appear in the transistor channel with increasing functioning time or voltage.

  16. Radiation tolerant silicon nitride insulated gate field effect transistors

    NASA Technical Reports Server (NTRS)

    Newman, P. A.

    1969-01-01

    Metal-Insulated-Semiconductor Field Effect Transistor /MISFET/ device uses a silicon nitride passivation layer over a thin silicon oxide layer to enhance the radiation tolerance. It is useful in electronic systems exposed to space radiation environment or the effects of nuclear weapons.

  17. High quality PECVD SiO2 process for recessed MOS-gate of AlGaN/GaN-on-Si metal–oxide–semiconductor heterostructure field-effect transistors

    NASA Astrophysics Data System (ADS)

    Lee, Jae-Gil; Kim, Hyun-Seop; Seo, Kwang-Seok; Cho, Chun-Hyung; Cha, Ho-Young

    2016-08-01

    A high quality SiO2 deposition process using a plasma enhanced chemical vapor deposition system has been developed for the gate insulator process of normally-off recessed-gate AlGaN/GaN metal-oxide-semiconductor-heterostructure field-effect transistors (MOS-HFETs). SiO2 films were deposited by using SiH4 and N2O mixtures as reactant gases. The breakdown field increased with increasing the N2O flow rate. The optimum SiH4/N2O ratio was 0.05, which resulted in a maximum breakdown field of 11 MV/cm for the SiO2 film deposited on recessed GaN surface. The deposition conditions were optimized as follows; a gas flow rate of SiH4/N2O (=27/540 sccm), a source RF power of 100 W, a pressure of 2 Torr, and a deposition temperature of 350 °C. A fabricated normally-off MOS-HFET exhibited a threshold voltage of 3.2 V, a specific on-resistance of 4.46 mΩ cm2, and a breakdown voltage of 810 V.

  18. Optical evidence for quantization in transparent amorphous oxide semiconductor superlattice

    NASA Astrophysics Data System (ADS)

    Abe, Katsumi; Nomura, Kenji; Kamiya, Toshio; Hosono, Hideo

    2012-08-01

    We fabricated transparent amorphous oxide semiconductor superlattices composed of In-Ga-Zn-O (a-IGZO) well layers and Ga2O3 (a-Ga2O3) barrier layers, and investigated their optical absorption properties to examine energy quantization in the a-IGZO well layer. The Tauc gap of a-IGZO well layers monotonically increases with decreasing well thickness at ≤5 nm. The thickness dependence of the Tauc gap is quantitatively explained by a Krönig-Penny model employing a conduction band offset of 1.2 eV between the a-IGZO and the a-Ga2O3, and the effective masses of 0.35m0 for the a-IGZO well layer and 0.5m0 for the a-Ga2O3 barrier layer, where m0 is the electron rest mass. This result demonstrates the quantization in the a-IGZO well layer. The phase relaxation length of the a-IGZO is estimated to be larger than 3.5 nm.

  19. Single-photon imaging in complementary metal oxide semiconductor processes

    PubMed Central

    Charbon, E.

    2014-01-01

    This paper describes the basics of single-photon counting in complementary metal oxide semiconductors, through single-photon avalanche diodes (SPADs), and the making of miniaturized pixels with photon-counting capability based on SPADs. Some applications, which may take advantage of SPAD image sensors, are outlined, such as fluorescence-based microscopy, three-dimensional time-of-flight imaging and biomedical imaging, to name just a few. The paper focuses on architectures that are best suited to those applications and the trade-offs they generate. In this context, architectures are described that efficiently collect the output of single pixels when designed in large arrays. Off-chip readout circuit requirements are described for a variety of applications in physics, medicine and the life sciences. Owing to the dynamic nature of SPADs, designs featuring a large number of SPADs require careful analysis of the target application for an optimal use of silicon real estate and of limited readout bandwidth. The paper also describes the main trade-offs involved in architecting such chips and the solutions adopted with focus on scalability and miniaturization. PMID:24567470

  20. Field effect in an n-GaAs metal-anodic oxide-film injunction

    SciTech Connect

    Tikhov, S.V.; Karpovich, I.A.; Martynov, V.V.; Funina, G.V.

    1986-10-01

    In this paper the authors present results attained in parallel investigations of mobility ..mu../sub F/ in the field effect, capacitance C, and the active conductance component G for a wide range of frequencies and controlling voltages, as well as of the capacitor saturation photoelectron-motive force phi/sub sat/(V) in an n-GaAs metal-AO-epitaxial film structure. A new combined method is offered for the determination of separation-boundary parameters, based on an analysis of the relationships between ..mu../sub F/, C, and G and the controlling voltage and the test frequency

  1. Sustained hole inversion layer in a wide-bandgap metal-oxide semiconductor with enhanced tunnel current

    NASA Astrophysics Data System (ADS)

    Shoute, Gem; Afshar, Amir; Muneshwar, Triratna; Cadien, Kenneth; Barlage, Douglas

    2016-02-01

    Wide-bandgap, metal-oxide thin-film transistors have been limited to low-power, n-type electronic applications because of the unipolar nature of these devices. Variations from the n-type field-effect transistor architecture have not been widely investigated as a result of the lack of available p-type wide-bandgap inorganic semiconductors. Here, we present a wide-bandgap metal-oxide n-type semiconductor that is able to sustain a strong p-type inversion layer using a high-dielectric-constant barrier dielectric when sourced with a heterogeneous p-type material. A demonstration of the utility of the inversion layer was also investigated and utilized as the controlling element in a unique tunnelling junction transistor. The resulting electrical performance of this prototype device exhibited among the highest reported current, power and transconductance densities. Further utilization of the p-type inversion layer is critical to unlocking the previously unexplored capability of metal-oxide thin-film transistors, such applications with next-generation display switches, sensors, radio frequency circuits and power converters.

  2. Sustained hole inversion layer in a wide-bandgap metal-oxide semiconductor with enhanced tunnel current.

    PubMed

    Shoute, Gem; Afshar, Amir; Muneshwar, Triratna; Cadien, Kenneth; Barlage, Douglas

    2016-01-01

    Wide-bandgap, metal-oxide thin-film transistors have been limited to low-power, n-type electronic applications because of the unipolar nature of these devices. Variations from the n-type field-effect transistor architecture have not been widely investigated as a result of the lack of available p-type wide-bandgap inorganic semiconductors. Here, we present a wide-bandgap metal-oxide n-type semiconductor that is able to sustain a strong p-type inversion layer using a high-dielectric-constant barrier dielectric when sourced with a heterogeneous p-type material. A demonstration of the utility of the inversion layer was also investigated and utilized as the controlling element in a unique tunnelling junction transistor. The resulting electrical performance of this prototype device exhibited among the highest reported current, power and transconductance densities. Further utilization of the p-type inversion layer is critical to unlocking the previously unexplored capability of metal-oxide thin-film transistors, such applications with next-generation display switches, sensors, radio frequency circuits and power converters. PMID:26842997

  3. Sustained hole inversion layer in a wide-bandgap metal-oxide semiconductor with enhanced tunnel current

    PubMed Central

    Shoute, Gem; Afshar, Amir; Muneshwar, Triratna; Cadien, Kenneth; Barlage, Douglas

    2016-01-01

    Wide-bandgap, metal-oxide thin-film transistors have been limited to low-power, n-type electronic applications because of the unipolar nature of these devices. Variations from the n-type field-effect transistor architecture have not been widely investigated as a result of the lack of available p-type wide-bandgap inorganic semiconductors. Here, we present a wide-bandgap metal-oxide n-type semiconductor that is able to sustain a strong p-type inversion layer using a high-dielectric-constant barrier dielectric when sourced with a heterogeneous p-type material. A demonstration of the utility of the inversion layer was also investigated and utilized as the controlling element in a unique tunnelling junction transistor. The resulting electrical performance of this prototype device exhibited among the highest reported current, power and transconductance densities. Further utilization of the p-type inversion layer is critical to unlocking the previously unexplored capability of metal-oxide thin-film transistors, such applications with next-generation display switches, sensors, radio frequency circuits and power converters. PMID:26842997

  4. Ultra-low specific on-resistance high-voltage vertical double diffusion metal–oxide–semiconductor field-effect transistor with continuous electron accumulation layer

    NASA Astrophysics Data System (ADS)

    Da, Ma; Xiao-Rong, Luo; Jie, Wei; Qiao, Tan; Kun, Zhou; Jun-Feng, Wu

    2016-04-01

    A new ultra-low specific on-resistance (R on,sp) vertical double diffusion metal–oxide–semiconductor field-effect transistor (VDMOS) with continuous electron accumulation (CEA) layer, denoted as CEA-VDMOS, is proposed and its new current transport mechanism is investigated. It features a trench gate directly extended to the drain, which includes two PN junctions. In on-state, the electron accumulation layers are formed along the sides of the extended gate and introduce two continuous low-resistance current paths from the source to the drain in a cell pitch. This mechanism not only dramatically reduces the R on,sp but also makes the R on,sp almost independent of the n-pillar doping concentration (N n). In off-state, the depletion between the n-pillar and p-pillar within the extended trench gate increases the N n, and further reduces the R on,sp. Especially, the two PN junctions within the trench gate support a high gate–drain voltage in the off-state and on-state, respectively. However, the extended gate increases the gate capacitance and thus weakens the dynamic performance to some extent. Therefore, the CEA-VDMOS is more suitable for low and medium frequencies application. Simulation indicates that the CEA-VDMOS reduces the R on,sp by 80% compared with the conventional super-junction VDMOS (CSJ-VDMOS) at the same high breakdown voltage (BV). Project supported by the National Natural Science Foundation of China (Grant Nos. 61176069 and 61376079) and the Fundamental Research Funds for the Central Universities, China (Grant No. ZYGX2014Z006).

  5. Dependence of GaAs-AlxGa1 - xAs heterostructures on Al composition for metal-semiconductor field-effect transistor operation

    NASA Astrophysics Data System (ADS)

    Hiruma, Kenji; Mori, Mitsuhiro; Kakibayashi, Hiroji; Ihara, Ayako; Takahashi, Susumu; Yanokura, Eiji

    1989-08-01

    High-quality GaAs-AlxGa1-xAs heterostructures for metal-semiconductor field-effect transistor (MESFET) applications have been grown by metalorganic vapor-phase epitaxy. High electron Hall mobility of up to 4000 cm2/(V s) for a carrier concentration of 3.5×1017 cm-3 was obtained for Si-doped GaAs grown on AlxGa1-xAs. It was learned that the electron Hall mobility of GaAs is not dependent on the Al composition of the AlxGa1-xAs buffer layer for 0≤x≤0.8. Good drain current-voltage saturation characteristics were observed for GaAs MESFETs with a 0.3-μm gate length and AlxGa1-xAs buffer layers. At drain voltages below 3 V, the drain conductance was at its lowest for Al composition around x=0.6. However, an anomalous peak in the drain conductance was observed at drain voltages of 3-6 V and at Al compositions of x=0.6 and 0.8. Drain conductance also increased as x did for x≥0.45 when measured at a microwave frequency. These phenomena can be understood by considering electron injection into the buffer/substrate region from the GaAs channel. The amount of this injection coincided well with the reduction in the conduction-band energy barrier at the GaAs-AlxGa1-xAs heterointerface for x>0.45 for electron transport.

  6. Nitrogen-doped amorphous oxide semiconductor thin film transistors with double-stacked channel layers

    NASA Astrophysics Data System (ADS)

    Xie, Haiting; Wu, Qi; Xu, Ling; Zhang, Lei; Liu, Guochao; Dong, Chengyuan

    2016-11-01

    The amorphous oxide semiconductor (AOS) thin film transistors (TFTs) with the double-stacked channel layers (DSCL) combing the amorphous InZnO (a-IZO) films and the nitrogen-doped amorphous InGaZnO (a-IGZO:N) films were proposed and fabricated, which showed the excellent performance with the field-effect mobility of 49.6 cm2 V-1 s-1 and the subthreshold swing of 0.5 V/dec. More interestingly, very stable properties were observed in the bias stress and light illumination tests for these a-IZO/a-IGZO:N TFTs, as seemed to be the evident improvements over the prior arts. The improved performance and stability might be mainly due to the hetero-junctions in the channel layers and less interface/bulk trap density from the in situ nitrogen doping process in the a-IGZO layers. In addition, the passivation effect of the a-IGZO:N films also made some contributions to the stable properties exhibited in these novel DSCL TFTs.

  7. Vertically integrated, three-dimensional nanowire complementary metal-oxide-semiconductor circuits.

    PubMed

    Nam, SungWoo; Jiang, Xiaocheng; Xiong, Qihua; Ham, Donhee; Lieber, Charles M

    2009-12-15

    Three-dimensional (3D), multi-transistor-layer, integrated circuits represent an important technological pursuit promising advantages in integration density, operation speed, and power consumption compared with 2D circuits. We report fully functional, 3D integrated complementary metal-oxide-semiconductor (CMOS) circuits based on separate interconnected layers of high-mobility n-type indium arsenide (n-InAs) and p-type germanium/silicon core/shell (p-Ge/Si) nanowire (NW) field-effect transistors (FETs). The DC voltage output (V(out)) versus input (V(in)) response of vertically interconnected CMOS inverters showed sharp switching at close to the ideal value of one-half the supply voltage and, moreover, exhibited substantial DC gain of approximately 45. The gain and the rail-to-rail output switching are consistent with the large noise margin and minimal static power consumption of CMOS. Vertically interconnected, three-stage CMOS ring oscillators were also fabricated by using layer-1 InAs NW n-FETs and layer-2 Ge/Si NW p-FETs. Significantly, measurements of these circuits demonstrated stable, self-sustained oscillations with a maximum frequency of 108 MHz, which represents the highest-frequency integrated circuit based on chemically synthesized nanoscale materials. These results highlight the flexibility of bottom-up assembly of distinct nanoscale materials and suggest substantial promise for 3D integrated circuits. PMID:19940239

  8. Vertically integrated, three-dimensional nanowire complementary metal-oxide-semiconductor circuits

    PubMed Central

    Nam, SungWoo; Jiang, Xiaocheng; Xiong, Qihua; Ham, Donhee; Lieber, Charles M.

    2009-01-01

    Three-dimensional (3D), multi-transistor-layer, integrated circuits represent an important technological pursuit promising advantages in integration density, operation speed, and power consumption compared with 2D circuits. We report fully functional, 3D integrated complementary metal-oxide-semiconductor (CMOS) circuits based on separate interconnected layers of high-mobility n-type indium arsenide (n-InAs) and p-type germanium/silicon core/shell (p-Ge/Si) nanowire (NW) field-effect transistors (FETs). The DC voltage output (Vout) versus input (Vin) response of vertically interconnected CMOS inverters showed sharp switching at close to the ideal value of one-half the supply voltage and, moreover, exhibited substantial DC gain of ≈45. The gain and the rail-to-rail output switching are consistent with the large noise margin and minimal static power consumption of CMOS. Vertically interconnected, three-stage CMOS ring oscillators were also fabricated by using layer-1 InAs NW n-FETs and layer-2 Ge/Si NW p-FETs. Significantly, measurements of these circuits demonstrated stable, self-sustained oscillations with a maximum frequency of 108 MHz, which represents the highest-frequency integrated circuit based on chemically synthesized nanoscale materials. These results highlight the flexibility of bottom-up assembly of distinct nanoscale materials and suggest substantial promise for 3D integrated circuits. PMID:19940239

  9. Complementary metal oxide semiconductor-compatible silicon nanowire biofield-effect transistors as affinity biosensors.

    PubMed

    Duan, Xuexin; Rajan, Nitin K; Izadi, Mohammad Hadi; Reed, Mark A

    2013-11-01

    Affinity biosensors use biorecognition elements and transducers to convert a biochemical event into a recordable signal. They provides the molecule binding information, which includes the dynamics of biomolecular association and dissociation, and the equilibrium association constant. Complementary metal oxide semiconductor-compatible silicon (Si) nanowires configured as a field-effect transistor (NW FET) have shown significant advantages for real-time, label-free and highly sensitive detection of a wide range of biomolecules. Most research has focused on reducing the detection limit of Si-NW FETs but has provided less information about the real binding parameters of the biomolecular interactions. Recently, Si-NW FETs have been demonstrated as affinity biosensors to quantify biomolecular binding affinities and kinetics. They open new applications for NW FETs in the nanomedicine field and will bring such sensor technology a step closer to commercial point-of-care applications. This article summarizes the recent advances in bioaffinity measurement using Si-NW FETs, with an emphasis on the different approaches used to address the issues of sensor calibration, regeneration, binding kinetic measurements, limit of detection, sensor surface modification, biomolecule charge screening, reference electrode integration and nonspecific molecular binding.

  10. Pulsed direct flame deposition and thermal annealing of transparent amorphous indium zinc oxide films as active layers in field effect transistors.

    PubMed

    Kilian, Daniel; Polster, Sebastian; Vogeler, Isabell; Jank, Michael P M; Frey, Lothar; Peukert, Wolfgang

    2014-08-13

    Indium-zinc oxide (IZO) films were deposited via flame spray pyrolysis (FSP) by pulsewise shooting a Si/SiO2 substrate directly into the combustion area of the flame. Based on UV-vis measurements of thin-films deposited on glass substrates, the optimal deposition parameters with respect to low haze values and film thicknesses of around 100 nm were determined. Thermal annealing of the deposited films at temperatures between 300 and 700 °C was carried out and staggered bottom gate thin-film transistors (TFT) were fabricated. The thin films were investigated by scanning electron microscopy, atomic force microscopy, X-ray diffraction, Fourier transformed infrared spectroscopy, and room-temperature photoluminescence measurements. The outcome of these investigations lead to two major requirements in order to implement a working TFT: (i) organic residues from the deposition process need to be removed and (ii) the net free charge carrier concentration has to be minimized by controlling the trap states in the semiconductor. The optimal annealing temperature was 300 °C as both requirements are fulfilled best in this case. This leads to field effect transistors with a low hysteresis, a saturation mobility of μSat = 0.1 cm(2)/(V s), a threshold voltage of Vth = -18.9 V, and an Ion/Ioff ratio on the order of 10(7). Depending on thermal treatment, the defect density changes significantly strongly influencing the transfer characteristics of the device. PMID:25029269

  11. Low-power bacteriorhodopsin-silicon n-channel metal-oxide field-effect transistor photoreceiver.

    PubMed

    Shin, Jonghyun; Bhattacharya, Pallab; Yuan, Hao-Chih; Ma, Zhenqiang; Váró, György

    2007-03-01

    A bacteriorhodopsin (bR)-silicon n-channel metal-oxide field-effect transistor (NMOSFET) monolithically integrated photoreceiver is demonstrated. The bR film is selectively formed on an external gate electrode of the transistor by electrophoretic deposition. A modified biasing circuit is incorporated, which helps to match the resistance of the bR film to the input impedance of the NMOSFET and to shift the operating point of the transistor to coincide with the maximum gain. The photoreceiver exhibits a responsivity of 4.7 mA/W. PMID:17392901

  12. Recent Developments in p-Type Oxide Semiconductor Materials and Devices.

    PubMed

    Wang, Zhenwei; Nayak, Pradipta K; Caraveo-Frescas, Jesus A; Alshareef, Husam N

    2016-05-01

    The development of transparent p-type oxide semiconductors with good performance may be a true enabler for a variety of applications where transparency, power efficiency, and greater circuit complexity are needed. Such applications include transparent electronics, displays, sensors, photovoltaics, memristors, and electrochromics. Hence, here, recent developments in materials and devices based on p-type oxide semiconductors are reviewed, including ternary Cu-bearing oxides, binary copper oxides, tin monoxide, spinel oxides, and nickel oxides. The crystal and electronic structures of these materials are discussed, along with approaches to enhance valence-band dispersion to reduce effective mass and increase mobility. Strategies to reduce interfacial defects, off-state current, and material instability are suggested. Furthermore, it is shown that promising progress has been made in the performance of various types of devices based on p-type oxides. Several innovative approaches exist to fabricate transparent complementary metal oxide semiconductor (CMOS) devices, including novel device fabrication schemes and utilization of surface chemistry effects, resulting in good inverter gains. However, despite recent developments, p-type oxides still lag in performance behind their n-type counterparts, which have entered volume production in the display market. Recent successes along with the hurdles that stand in the way of commercial success of p-type oxide semiconductors are presented. PMID:26879813

  13. Recent Developments in p-Type Oxide Semiconductor Materials and Devices.

    PubMed

    Wang, Zhenwei; Nayak, Pradipta K; Caraveo-Frescas, Jesus A; Alshareef, Husam N

    2016-05-01

    The development of transparent p-type oxide semiconductors with good performance may be a true enabler for a variety of applications where transparency, power efficiency, and greater circuit complexity are needed. Such applications include transparent electronics, displays, sensors, photovoltaics, memristors, and electrochromics. Hence, here, recent developments in materials and devices based on p-type oxide semiconductors are reviewed, including ternary Cu-bearing oxides, binary copper oxides, tin monoxide, spinel oxides, and nickel oxides. The crystal and electronic structures of these materials are discussed, along with approaches to enhance valence-band dispersion to reduce effective mass and increase mobility. Strategies to reduce interfacial defects, off-state current, and material instability are suggested. Furthermore, it is shown that promising progress has been made in the performance of various types of devices based on p-type oxides. Several innovative approaches exist to fabricate transparent complementary metal oxide semiconductor (CMOS) devices, including novel device fabrication schemes and utilization of surface chemistry effects, resulting in good inverter gains. However, despite recent developments, p-type oxides still lag in performance behind their n-type counterparts, which have entered volume production in the display market. Recent successes along with the hurdles that stand in the way of commercial success of p-type oxide semiconductors are presented.

  14. Atomic scale alignment of copper-germanide contacts for ge nanowire metal oxide field effect transistors.

    PubMed

    Burchhart, T; Lugstein, A; Hyun, Y J; Hochleitner, G; Bertagnolli, E

    2009-11-01

    In this letter, we report on the formation, of copper-germanide/germanium nanowire (NW) heterostructures with atomically sharp interfaces. The copper-germanide (Cu3Ge) formation process is enabled by a chemical reaction between metallic Cu pads and vapor-liquid-solid (VLS) grown Ge-NWs. The atomic scale aligned formation of the Cu3Ge segments is controlled by in situ SEM monitoring at 310 degrees C thereby enabling length control of the intrinsic Ge-NW down to a few nanometers. The single crystal Cu3Ge/Ge/Cu3Ge heterostructures were used to fabricate p-type Ge-NW field effect transistors with Schottky Cu3Ge source/drain contacts. Temperature dependent I /V measurements revealed the metallic properties of the Cu3Ge contacts with a maximum current density of 5 x 10(7) A/cm2. According to the thermoionic emission theory, we determined an effective Schottky barrier height of 218 meV.

  15. Capacitance-voltage characteristics of Si and Ge nanomembrane based flexible metal-oxide-semiconductor devices under bending conditions

    NASA Astrophysics Data System (ADS)

    Cho, Minkyu; Seo, Jung-Hun; Park, Dong-Wook; Zhou, Weidong; Ma, Zhenqiang

    2016-06-01

    Metal-oxide-semiconductor (MOS) device is the basic building block for field effect transistors (FET). The majority of thin-film transistors (TFTs) are FETs. When MOSFET are mechanically bent, the MOS structure will be inevitably subject to mechanical strain. In this paper, flexible MOS devices using single crystalline Silicon (Si) and Germanium (Ge) nanomembranes (NM) with SiO2, SiO, and Al2O3 dielectric layers are fabricated on a plastic substrate. The relationships between semiconductor nanomembranes and various oxide materials are carefully investigated under tensile/compressive strain. The flatband voltage, threshold voltage, and effective charge density in various MOS combinations revealed that Si NM-SiO2 configuration shows the best interface charge behavior, while Ge NM-Al2O3 shows the worst. This investigation of flexible MOS devices can help us understand the impact of charges in the active region of the flexible TFTs and capacitance changes under the tensile/compressive strains on the change in electrical characteristics in flexible NM based TFTs.

  16. Electrical Characterization of Polyaniline/polyethylene Oxide Nanofibers for Field Effect Transistors

    NASA Technical Reports Server (NTRS)

    Mueller, Carl H.; Theofylaktos, Noulie; Pinto, Nicholas J.; Robinson, Daryl C.; Miranda, Felix A.

    2002-01-01

    Nanofibers comprised of polyaniline/polyethylene oxide (PANI/PEO) are being developed for novel logic devices. We report the electrical conductivity of PANI/PEO nanofibers with diameters in the 100 to 200 nm range. We measured conductivity values of approx. 0.3 to 1.0 S/cm, which is higher than the values reported for thicker nanofibers, but less than the bulk value of PANI. The electrical measurements were performed by depositing the fibers on pre-electroded, oxidized silicon (Si) substrates. The excellent adherence of the nanofibers to the SiO2 as well as the gold (Au) electrodes may be useful in the design of future devices.

  17. Anisotropy of piezoresistance in n-channel inversion layers of metal-oxide-semiconductor transistors on (001)Si

    NASA Astrophysics Data System (ADS)

    Maruyama, T.; Zaima, S.; Koide, Y.; Kanda, Y.; Yasuda, Y.

    1990-12-01

    The crystallographic orientation dependence of piezoresistance of n-channel inversion layers in metal-oxide-semiconductor field-effect transistors on p-type (001)Si has been studied by using a diaphragm at room temperature. The experimental results have been compared with self-consistent calculations based on a surface quantization effect. The main feature of the crystallographic orientation dependence can be explained by an electron repopulation effect induced by applied strain and an effective mass anisotropy. It can be found that the difference between longitudinal and transverse piezoresistance in the devices nearly along the [110] directions is mainly due to an orthorhombic distortion of Si, and the shear deformation coefficients Ξu is determined to be 5.8 eV from comparing the experimental results with the calculated ones. An expression of the shear piezoresistance component π44 is also derived.

  18. A metal-oxide-semiconductor radiation dosimeter with a thick and defect-rich oxide layer

    NASA Astrophysics Data System (ADS)

    Liu, Hongrui; Yang, Yuhao; Zhang, Jinwen

    2016-04-01

    Enhancing the density of defects in the oxide layer is the main factor in improving the sensitivity of a metal-oxide-semiconductor (MOS) radiation dosimeter. This paper reports a novel MOS dosimeter with a very thick and defect-rich oxide layer fabricated by MEMS technology. The category of defects in SiO2 and their possible effect on the radiation dose sensing was analyzed. Then, we proposed combining deep-reactive-ion etching, thermal oxidation and low pressure chemical vapor deposition to realize an oxide layer containing multiple and large interfaces which can increase defects significantly. The trench-and-beam structure of silicon was considered in detail. The fabrication process was developed for obtaining a thick and compact MEMS-made SiO2. Our devices were irradiated by γ-rays of 60Co at 2 Gy per minute for 2 h and a thermally stimulated current (TSC) method was used to determine the readout of the dosimeters. Results show that there is a peak current of about 450 nA, indicating a total TSC charge of 158 μC and sensitivity of 1.1 μC mm-3·Gy, which is 40 times the sensitivity of previous MOS dosimeters.

  19. Solution-Processable Low-Molecular Weight Extended Arylacetylenes: Versatile p-Type Semiconductors for Field-Effect Transistors and Bulk Heterojunction Solar Cells

    SciTech Connect

    Silvestri, Fabio; Marrocchi, Assunta; Seri, Mirko; Kim, Choongik; Marks, Tobin J.; Facchetti, Antonio; Taticchi, Aldo

    2010-04-08

    We report the synthesis and characterization of a series of five extended arylacetylenes, 9,10-bis-{[m,p-bis(hexyloxy)phenyl]ethynyl}-anthracene (A-P6t, 1), 9,10-bis-[(p-{[m,p-bis(hexyloxy) phenyl]ethynyl}phenyl)ethynyl]-anthracene (PA-P6t, 2), 4,7-bis-{[m,p-bis(hexyloxy)phenyl]ethynyl}-2,1,3-benzothiadiazole (BTZ-P6t, 5), 4,7-bis(5-{[m,p-bis(hexyloxy)phenyl]ethynyl}thien-2-yl)-2,1,3-benzothiadiazole (TBTZ-P6t, 6), and 7,7'-({[m,p-bis(hexyloxy)phenyl]ethynyl}-2,1,3-benzothiadiazol-4,4'-ethynyl)-2,5-thiophene (BTZT-P6t, 7), and two arylvinylenes, 9,10-bis-{(E)-[m,p-bis(hexyloxy)phenyl]vinyl}-anthracene (A-P6d, 3), 9,10-bis-[(E)-(p-{(E)-[m,p-bis(hexyloxy)phenyl]vinyl}phenyl)vinyl]-anthracene (PA-P6d, 4). Trends in optical absorption spectra and electrochemical redox processes are first described. Next, the thin-film microstructures and morphologies of films deposited from solution under various conditions are investigated, and organic field-effect transistors (OFETs) and bulk heterojunction photovoltaic (OPV) cells fabricated. We find that substituting acetylenic for olefinic linkers on the molecular cores significantly enhances device performance. OFET measurements reveal that all seven of the semiconductors are FET-active and, depending on the backbone architecture, the arylacetylenes exhibit good p-type mobilities (μ up to ~0.1 cm2 V-1 s-1) when optimum film microstructural order is achieved. OPV cells using [6,6]-phenyl C61-butyric acid methyl ester (PCBM) as the electron acceptor exhibit power conversion efficiencies (PCEs) up to 1.3% under a simulated AM 1.5 solar irradiation of 100 mW/cm2. These results demonstrate that arylacetylenes are promising hole-transport materials for p-channel OFETs and promising donors for organic solar cells applications. A direct correlation between OFET arylacetylene hole mobility and OPV performance is identified and analyzed.

  20. Growth of chalcogenide semiconductors within a nanoporous aluminum oxide template

    NASA Astrophysics Data System (ADS)

    Zelenski, Catherine Mary

    This dissertation reports investigations on the synthesis of metal chalcogenide semiconductor nanoparticles grown within the pores of a nanoporous aluminum oxide template. The template used to restrict the growth of the materials contained cylindrical pores, yielding nanoparticles with non-spherical shapes. Two classes of metal chalcogenides were studied: those with three dimensional structures and those with layered structures. Three different methods were developed and investigated for the growth of MQ compounds (M = Cd, Zn, Cu, Hg; Q = S, Te): (1) a dipping method, (2) a U-tube method, and (3) a sublimation. The dipping method produced material on the template's outer surface and within the pores only within ˜2 mum of their ends. Within the limits of the template pore size, particle size and shape could not be controlled. The U-tube method deposited multiple oval shaped particles within each pore of the template. The oval particles were polycrystalline, had sizes ranging from ˜5-120 nm, and were concentrated in only one location in the pores. Reasons for the uneven distribution of particles throughout the pores were investigated. The sublimation method only deposited material on the outer surfaces of the template, and the conditions used for the sublimation altered the morphology of the template. Layered MSsb2 compounds (M = Mo, W, Re, Ti) were prepared by the thermal decomposition of selected precursor molecules within the pores of the template. The fibers produced had the same dimensions as the pores of the template. When MoSsb2 was prepared by this method, tubules of oriented crystals were formed with multiple plugs in each tubule. When WSsb2 was prepared, more solid fibers were formed. The preparation of ReSsb2 and TiSsb2 resulted in fibers that were similar in morphology to the MoSsb2 fibers. The effect of template loading method, precursor concentration, precursor type, solvent, presence of a surfactant, and annealing temperature on morphology and

  1. Field Effect Transistor Behavior in Electrospun Polyaniline/Polyethylene Oxide Nanofibers

    NASA Technical Reports Server (NTRS)

    Miranda, Felix A.; Theofylaktos, Noulle; Robinson, Daryl C.; Mueller, Carl H.; Pinto, Nicholas J.

    2004-01-01

    Novel translators and logic devices based on nanotechnology concepts are under intense development. The potential for ultra-low power circuitry makes nanotechnology attractive for applications such as digital electronics and sensors. Furthermore, the ability to form devices on flexible substrates expands the range of applications where electronic circuitry can be introduced. For NASA, nonotechndogy offers opportunities for increased onboard data processing and thus autonomous decision-making ability, ad novel sensors that detect and respond to external stimuli with few oversight requirements. The goat of this work is to demonstrate transistor behavior in polyaniline/ polyethylene oxide nanofibers, thus creating a foundation for future logic devices.

  2. Control of threshold voltage in E-mode and D-mode GaN-on-Si metal-insulator-semiconductor heterostructure field effect transistors by in-situ fluorine doping of atomic layer deposition Al2O3 gate dielectrics

    NASA Astrophysics Data System (ADS)

    Roberts, J. W.; Chalker, P. R.; Lee, K. B.; Houston, P. A.; Cho, S. J.; Thayne, I. G.; Guiney, I.; Wallis, D.; Humphreys, C. J.

    2016-02-01

    We report the modification and control of threshold voltage in enhancement and depletion mode AlGaN/GaN metal-insulator-semiconductor heterostructure field effect transistors through the use of in-situ fluorine doping of atomic layer deposition Al2O3. Uniform distribution of F ions throughout the oxide thickness are achievable, with a doping level of up to 5.5 × 1019 cm-3 as quantified by secondary ion mass spectrometry. This fluorine doping level reduces capacitive hysteretic effects when exploited in GaN metal-oxide-semiconductor capacitors. The fluorine doping and forming gas anneal also induces an average positive threshold voltage shift of between 0.75 and 1.36 V in both enhancement mode and depletion mode GaN-based transistors compared with the undoped gate oxide via a reduction of positive fixed charge in the gate oxide from +4.67 × 1012 cm-2 to -6.60 × 1012 cm-2. The application of this process in GaN based power transistors advances the realisation of normally off, high power, high speed devices.

  3. High Performance Metal Oxide Field-Effect Transistors with a Reverse Offset Printed Cu Source/Drain Electrode.

    PubMed

    Han, Young Hun; Won, Ju-Yeon; Yoo, Hyun-Seok; Kim, Jae-Hyun; Choi, Rino; Jeong, Jae Kyeong

    2016-01-20

    Nonvacuum and photolithography-free copper (Cu) films were prepared by reverse offset printing. The mechanical, morphological, structural, and chemical properties of the Cu films annealed at different temperatures were examined in detail. The Ostwald ripening-induced coalescence and grain growth in the printing Cu films were enhanced with increasing annealing temperature in N2 ambient up to 400 °C. Simultaneously, unwanted chemical impurities such as oxygen, hydrogen, and carbon in the Cu films decreased as the annealing temperature increased. The high electrical conductivity (∼6.2 μΩ·cm) of the printing Cu films annealed at 400 °C is attributed to the enlargement of the grain size and reduction of the incorporation of impurities. A printing Cu film was adopted as a source/drain (S/D) electrode in solution processable zinc tin oxide (ZTO) field-effect transistors (FETs), where the ZTO film was prepared by simple spin-coating. The ZTO FETs fabricated at a contact annealing temperature of 250 °C exhibited a promising field-effect mobility of 2.6 cm(2)/(V s), a threshold voltage of 7.0 V, and an ION/OFF modulation ratio of 2 × 10(5).

  4. Field Effect Transistor Behavior in Electrospun Polyaniline/Polyethylene Oxide Nanofibers

    NASA Technical Reports Server (NTRS)

    Miranda, Felix A.; Theofylaktos, Noulie; Mueller, Carl H.; Pinto, Nicholas J.

    2004-01-01

    Novel transistors and logic devices based on nanotechnology concepts are under intense development. The potential for ultra-low-power circuitry makes nanotechnology attractive for applications such as digital electronics and sensors. For NASA applications, nanotechnology offers tremendous opportunities for increased onboard data processing, and thus autonomous decision-making ability, and novel sensors that detect and respond to environmental stimuli with little oversight requirements. Polyaniline (PANi) is an intriguing material because its electrical conductivity can be changed from insulating to metallic by varying the doping levels and conformations of the polymer chain, and when combined with polyethylene oxide (PEO), can be formed into nanofibers with diameters ranging from approximately 50 to 500 nm (depending on the deposition conditions). The initial goal of this work was to demonstrate transistor behavior in these nanofibers, thus creating a foundation for future logic devices.

  5. Quantum dot made in metal oxide silicon-nanowire field effect transistor working at room temperature.

    PubMed

    Lavieville, Romain; Triozon, François; Barraud, Sylvain; Corna, Andrea; Jehl, Xavier; Sanquer, Marc; Li, Jing; Abisset, Antoine; Duchemin, Ivan; Niquet, Yann-Michel

    2015-05-13

    We report the observation of an atomic like behavior from T = 4.2 K up to room temperature in n- and p-type Ω-gate silicon nanowire (NW) transistors. For that purpose, we modified the design of a NW transistor and introduced long spacers between the source/drain and the channel in order to separate the channel from the electrodes. The channel was made extremely small (3.4 nm in diameter with 10 nm gate length) with a thick gate oxide (7 nm) in order to enhance the Coulomb repulsion between carriers, which can be as large as 200 meV when surface roughness promotes charge confinement. Parasitic stochastic Coulomb blockade effect can be eliminated in our devices by choosing proper control voltages. Moreover, the quantum dot can be tuned so that the resonant current at T = 4.2 K exceeds that at room temperature.

  6. Direct fabrication of thin layer MoS{sub 2} field-effect nanoscale transistors by oxidation scanning probe lithography

    SciTech Connect

    Espinosa, Francisco M.; Ryu, Yu K.; Garcia, Ricardo; Marinov, Kolyo; Dumcenco, Dumitru; Kis, Andras

    2015-03-09

    Thin layer MoS{sub 2}-based field effect transistors (FET) are emerging candidates to fabricate very fast and sensitive devices. Here, we demonstrate a method to fabricate very narrow transistor channel widths on a single layer MoS{sub 2} flake connected to gold electrodes. Oxidation scanning probe lithography is applied to pattern insulating barriers on the flake. The process narrows the electron path to about 200 nm. The output and transfer characteristics of the fabricated FET show a behavior that is consistent with the minimum channel width of the device. The method relies on the direct and local chemical modification of MoS{sub 2}. The straightforward character and the lack of specific requirements envisage the controlled patterning of sub-100 nm electron channels in MoS{sub 2} FETs.

  7. Printable Ultrathin Metal Oxide Semiconductor-Based Conformal Biosensors.

    PubMed

    Rim, You Seung; Bae, Sang-Hoon; Chen, Huajun; Yang, Jonathan L; Kim, Jaemyung; Andrews, Anne M; Weiss, Paul S; Yang, Yang; Tseng, Hsian-Rong

    2015-12-22

    Conformal bioelectronics enable wearable, noninvasive, and health-monitoring platforms. We demonstrate a simple and straightforward method for producing thin, sensitive In2O3-based conformal biosensors based on field-effect transistors using facile solution-based processing. One-step coating via aqueous In2O3 solution resulted in ultrathin (3.5 nm), high-density, uniform films over large areas. Conformal In2O3-based biosensors on ultrathin polyimide films displayed good device performance, low mechanical stress, and highly conformal contact determined using polydimethylsiloxane artificial skin having complex curvilinear surfaces or an artificial eye. Immobilized In2O3 field-effect transistors with self-assembled monolayers of NH2-terminated silanes functioned as pH sensors. Functionalization with glucose oxidase enabled d-glucose detection at physiologically relevant levels. The conformal ultrathin field-effect transistor biosensors developed here offer new opportunities for future wearable human technologies. PMID:26498319

  8. Printable Ultrathin Metal Oxide Semiconductor-Based Conformal Biosensors.

    PubMed

    Rim, You Seung; Bae, Sang-Hoon; Chen, Huajun; Yang, Jonathan L; Kim, Jaemyung; Andrews, Anne M; Weiss, Paul S; Yang, Yang; Tseng, Hsian-Rong

    2015-12-22

    Conformal bioelectronics enable wearable, noninvasive, and health-monitoring platforms. We demonstrate a simple and straightforward method for producing thin, sensitive In2O3-based conformal biosensors based on field-effect transistors using facile solution-based processing. One-step coating via aqueous In2O3 solution resulted in ultrathin (3.5 nm), high-density, uniform films over large areas. Conformal In2O3-based biosensors on ultrathin polyimide films displayed good device performance, low mechanical stress, and highly conformal contact determined using polydimethylsiloxane artificial skin having complex curvilinear surfaces or an artificial eye. Immobilized In2O3 field-effect transistors with self-assembled monolayers of NH2-terminated silanes functioned as pH sensors. Functionalization with glucose oxidase enabled d-glucose detection at physiologically relevant levels. The conformal ultrathin field-effect transistor biosensors developed here offer new opportunities for future wearable human technologies.

  9. Near-field effects and energy transfer in hybrid metal-oxide nanostructures

    PubMed Central

    Kuerbanjiang, Balati; Benel, Cahit; Papageorgiou, Giorgos; Goncalves, Manuel; Boneberg, Johannes; Leiderer, Paul; Ziemann, Paul; Marek, Peter; Hahn, Horst

    2013-01-01

    Summary One of the big challenges of the 21st century is the utilization of nanotechnology for energy technology. Nanoscale structures may provide novel functionality, which has been demonstrated most convincingly by successful applications such as dye-sensitized solar cells introduced by M. Grätzel. Applications in energy technology are based on the transfer and conversion of energy. Following the example of photosynthesis, this requires a combination of light harvesting, transfer of energy to a reaction center, and conversion to other forms of energy by charge separation and transfer. This may be achieved by utilizing hybrid nanostructures, which combine metallic and nonmetallic components. Metallic nanostructures can interact strongly with light. Plasmonic excitations of such structures can cause local enhancement of the electrical field, which has been utilized in spectroscopy for many years. On the other hand, the excited states in metallic structures decay over very short lifetimes. Longer lifetimes of excited states occur in nonmetallic nanostructures, which makes them attractive for further energy transfer before recombination or relaxation sets in. Therefore, the combination of metallic nanostructures with nonmetallic materials is of great interest. We report investigations of hybrid nanostructured model systems that consist of a combination of metallic nanoantennas (fabricated by nanosphere lithography, NSL) and oxide nanoparticles. The oxide particles were doped with rare-earth (RE) ions, which show a large shift between absorption and emission wavelengths, allowing us to investigate the energy-transfer processes in detail. The main focus is on TiO2 nanoparticles doped with Eu3+, since the material is interesting for applications such as the generation of hydrogen by photocatalytic splitting of water molecules. We use high-resolution techniques such as confocal fluorescence microscopy for the investigation of energy-transfer processes. The experiments

  10. Near-field effects and energy transfer in hybrid metal-oxide nanostructures.

    PubMed

    Herr, Ulrich; Kuerbanjiang, Balati; Benel, Cahit; Papageorgiou, Giorgos; Goncalves, Manuel; Boneberg, Johannes; Leiderer, Paul; Ziemann, Paul; Marek, Peter; Hahn, Horst

    2013-01-01

    One of the big challenges of the 21st century is the utilization of nanotechnology for energy technology. Nanoscale structures may provide novel functionality, which has been demonstrated most convincingly by successful applications such as dye-sensitized solar cells introduced by M. Grätzel. Applications in energy technology are based on the transfer and conversion of energy. Following the example of photosynthesis, this requires a combination of light harvesting, transfer of energy to a reaction center, and conversion to other forms of energy by charge separation and transfer. This may be achieved by utilizing hybrid nanostructures, which combine metallic and nonmetallic components. Metallic nanostructures can interact strongly with light. Plasmonic excitations of such structures can cause local enhancement of the electrical field, which has been utilized in spectroscopy for many years. On the other hand, the excited states in metallic structures decay over very short lifetimes. Longer lifetimes of excited states occur in nonmetallic nanostructures, which makes them attractive for further energy transfer before recombination or relaxation sets in. Therefore, the combination of metallic nanostructures with nonmetallic materials is of great interest. We report investigations of hybrid nanostructured model systems that consist of a combination of metallic nanoantennas (fabricated by nanosphere lithography, NSL) and oxide nanoparticles. The oxide particles were doped with rare-earth (RE) ions, which show a large shift between absorption and emission wavelengths, allowing us to investigate the energy-transfer processes in detail. The main focus is on TiO2 nanoparticles doped with Eu(3+), since the material is interesting for applications such as the generation of hydrogen by photocatalytic splitting of water molecules. We use high-resolution techniques such as confocal fluorescence microscopy for the investigation of energy-transfer processes. The experiments are

  11. Low-temperature solution-processed amorphous indium tin oxide field-effect transistors.

    PubMed

    Kim, Hyun Sung; Kim, Myung-Gil; Ha, Young-Geun; Kanatzidis, Mercouri G; Marks, Tobin J; Facchetti, Antonio

    2009-08-12

    Amorphous indium tin oxide (ITO)-based thin-film transistors (TFTs) were fabricated on various dielectrics [SiO(2) and self-assembled nanodielectrics (SANDs)] by spin-coating an ITO film precursor solution consisting of InCl(3) and SnCl(4) as the sources of In(3+) and Sn(4+), respectively, methoxyethanol (solvent), and ethanolamine (base). These films can be annealed at temperatures T(a) < or = 250 degrees C and afford devices with excellent electrical characteristics. The optimized [In(3+)]/[In(3+) + Sn(4+)] molar ratio (0.7) and annealing temperature (T(a) = 250 degrees C) afford TFTs exhibiting electron mobilities of approximately 2 and approximately 10-20 cm(2) V(-1) s(-1) with SiO(2) and SAND, respectively, as the gate dielectric. Remarkably, ITO TFTs processed at 220 degrees C still exhibit electron mobilities of >0.2 cm(2) V(-1) s(-1), which is encouraging for processing on plastic substrates.

  12. Band-Gap Engineering at a Semiconductor-Crystalline Oxide Interface

    SciTech Connect

    Moghadam, Mohammadreza J.; Ahmadi-Majlan, K.; Shen, Xuan; Droubay, Timothy C.; Bowden, Mark E.; Chrysler, M.; Su, Dong; Chambers, Scott A.; Ngai, Joseph

    2015-02-09

    The epitaxial growth of crystalline oxides on semiconductors provides a pathway to introduce new functionalities to semiconductor devices. Key to electrically coupling crystalline oxides with semiconductors to realize functional behavior is controlling the manner in which their bands align at interfaces. Here we apply principles of band gap engineering traditionally used at heterojunctions between conventional semiconductors to control the band offset between a single crystalline oxide and a semiconductor. Reactive molecular beam epitaxy is used to realize atomically abrupt and structurally coherent interfaces between SrZrxTi1-xO3 and Ge, in which the band gap of the former is enhanced with Zr content x. We present structural, electrical and photoemission characterization of SrZrxTi1-xO33-Ge heterojunctions for x = 0.2 to 0.75 and demonstrate the band offset can be tuned from type-II to type-I. The type-I band offset provides a platform to integrate the dielectric, ferroelectric and ferromagnetic functionalities of oxides with semiconducting devices.

  13. A comprehensive study of charge trapping in organic field-effect devices with promising semiconductors and different contact metals by displacement current measurements

    NASA Astrophysics Data System (ADS)

    Bisoyi, Sibani; Rödel, Reinhold; Zschieschang, Ute; Kang, Myeong Jin; Takimiya, Kazuo; Klauk, Hagen; Tiwari, Shree Prakash

    2016-02-01

    A systematic and comprehensive study on the charge-carrier injection and trapping behavior was performed using displacement current measurements in long-channel capacitors based on four promising small-molecule organic semiconductors (pentacene, DNTT, C10-DNTT and DPh-DNTT). In thin-film transistors, these semiconductors showed charge-carrier mobilities ranging from 1.0 to 7.8 cm2 V-1 s-1. The number of charges injected into and extracted from the semiconductor and the density of charges trapped in the device during each measurement were calculated from the displacement current characteristics and it was found that the density of trapped charges is very similar in all devices and of the order 1012 cm-2, despite the fact that the four semiconductors show significantly different charge-carrier mobilities. The choice of the contact metal (Au, Ag, Cu, Pd) was also found to have no significant effect on the trapping behavior.

  14. Atomic layer deposition of perovskite oxides and their epitaxial integration with Si, Ge, and other semiconductors

    SciTech Connect

    McDaniel, Martin D.; Ngo, Thong Q.; Hu, Shen; Ekerdt, John G.; Posadas, Agham; Demkov, Alexander A.

    2015-12-15

    Atomic layer deposition (ALD) is a proven technique for the conformal deposition of oxide thin films with nanoscale thickness control. Most successful industrial applications have been with binary oxides, such as Al{sub 2}O{sub 3} and HfO{sub 2}. However, there has been much effort to deposit ternary oxides, such as perovskites (ABO{sub 3}), with desirable properties for advanced thin film applications. Distinct challenges are presented by the deposition of multi-component oxides using ALD. This review is intended to highlight the research of the many groups that have deposited perovskite oxides by ALD methods. Several commonalities between the studies are discussed. Special emphasis is put on precursor selection, deposition temperatures, and specific property performance (high-k, ferroelectric, ferromagnetic, etc.). Finally, the monolithic integration of perovskite oxides with semiconductors by ALD is reviewed. High-quality epitaxial growth of oxide thin films has traditionally been limited to physical vapor deposition techniques (e.g., molecular beam epitaxy). However, recent studies have demonstrated that epitaxial oxide thin films may be deposited on semiconductor substrates using ALD. This presents an exciting opportunity to integrate functional perovskite oxides for advanced semiconductor applications in a process that is economical and scalable.

  15. Monolithic integration of rare-earth oxides and semiconductors for on-silicon technology

    SciTech Connect

    Dargis, Rytis Clark, Andrew; Erdem Arkun, Fevzi; Grinys, Tomas; Tomasiunas, Rolandas; O'Hara, Andy; Demkov, Alexander A.

    2014-07-01

    Several concepts of integration of the epitaxial rare-earth oxides into the emerging advanced semiconductor on silicon technology are presented. Germanium grows epitaxially on gadolinium oxide despite lattice mismatch of more than 4%. Additionally, polymorphism of some of the rare-earth oxides allows engineering of their crystal structure from hexagonal to cubic and formation of buffer layers that can be used for growth of germanium on a lattice matched oxide layer. Molecular beam epitaxy and metal organic chemical vapor deposition of gallium nitride on the rare-earth oxide buffer layers on silicon is discussed.

  16. Pulsed-Laser Deposition of Electronic Oxides: Superconductor and Semiconductor Applications

    SciTech Connect

    Norton, D.P.; Park, C.; Lee, Y.E.; Budai, J.D.; Chisholm, M.F.; Verebelyi, D.T.; Christen, D.K.; Kroeger, D.M.

    2000-01-24

    Over the past decade, pulsed-laser deposition (PLD) has proven to be one of the most versatile and effective methods for obtaining high-quality electronic oxide thin-film materials. Much of this success can be attributed to its initial use in depositing high temperature superconducting materials. However, pulsed-laser deposition is now a leading research tool in the development of various electronic oxide thin-film technologies, In this paper, recent progress in the deposition of oxide materials on dissimilar materials for both superconductor and semiconductor applications is discussed. Recent developments in the synthesis of superconducting wires via epitaxial growth of superconducting oxides on biaxially textured metal tapes is described. In addition, efforts to integrate high-k dielectric oxides on semiconductor surfaces using pulsed-laser deposition are highlighted.

  17. Thin Film Transistor Gas Sensors Incorporating High-Mobility Diketopyrrolopyrole-Based Polymeric Semiconductor Doped with Graphene Oxide.

    PubMed

    Cheon, Kwang Hee; Cho, Jangwhan; Kim, Yun-Hi; Chung, Dae Sung

    2015-07-01

    In this work, we fabricated a diketopyrrolopyrole-based donor-acceptor copolymer composite film. This is a high-mobility semiconductor component with a functionalized-graphene-oxide (GO) gas-adsorbing dopant, used as an active layer in gas-sensing organic-field-effect transistor (OFET) devices. The GO content of the composite film was carefully controlled so that the crystalline orientation of the semiconducting polymer could be conserved, without compromising its gas-adsorbing ability. The resulting optimized device exhibited high mobility (>1 cm(2) V(-1) s(-1)) and revealed sensitive response during programmed exposure to various polar organic molecules (i.e., ethanol, acetone, and acetonitrile). This can be attributed to the high mobility of polymeric semiconductors, and also to their high surface-to-volume ratio of GO. The operating mechanism of the gas sensing GO-OFET is fully discussed in conjunction with charge-carrier trap theory. It was found that each transistor parameter (e.g., mobility, threshold voltage), responds independently to each gas molecule, which enables high selectivity of GO-OFETs for various gases. Furthermore, we also demonstrated practical GO-OFET devices that operated at low voltage (<1.5 V), and which successfully responded to gas exposure.

  18. Thin Film Transistor Gas Sensors Incorporating High-Mobility Diketopyrrolopyrole-Based Polymeric Semiconductor Doped with Graphene Oxide.

    PubMed

    Cheon, Kwang Hee; Cho, Jangwhan; Kim, Yun-Hi; Chung, Dae Sung

    2015-07-01

    In this work, we fabricated a diketopyrrolopyrole-based donor-acceptor copolymer composite film. This is a high-mobility semiconductor component with a functionalized-graphene-oxide (GO) gas-adsorbing dopant, used as an active layer in gas-sensing organic-field-effect transistor (OFET) devices. The GO content of the composite film was carefully controlled so that the crystalline orientation of the semiconducting polymer could be conserved, without compromising its gas-adsorbing ability. The resulting optimized device exhibited high mobility (>1 cm(2) V(-1) s(-1)) and revealed sensitive response during programmed exposure to various polar organic molecules (i.e., ethanol, acetone, and acetonitrile). This can be attributed to the high mobility of polymeric semiconductors, and also to their high surface-to-volume ratio of GO. The operating mechanism of the gas sensing GO-OFET is fully discussed in conjunction with charge-carrier trap theory. It was found that each transistor parameter (e.g., mobility, threshold voltage), responds independently to each gas molecule, which enables high selectivity of GO-OFETs for various gases. Furthermore, we also demonstrated practical GO-OFET devices that operated at low voltage (<1.5 V), and which successfully responded to gas exposure. PMID:26068504

  19. A spectroscopic method for the evaluation of surface passivation treatments on metal-oxide-semiconductor structures

    NASA Astrophysics Data System (ADS)

    Walsh, Lee A.; Hurley, Paul K.; Lin, Jun; Cockayne, Eric; O'Regan, T. P.; Woicik, Joseph C.; Hughes, Greg

    2014-05-01

    Combined hard x-ray photoelectron spectroscopy (HAXPES) and electrical characterisation measurements have been shown to provide complementary information on the electrical performance of Si and GaAs based metal-oxide-semiconductor (MOS) structures. The results obtained indicate that surface potential changes at the semiconductor/dielectric interface due to the presence of different work function metals can be detected from HAXPES measurements. Changes in the semiconductor band bending at zero gate voltage and the flat band voltage values derived from C-V measurements are in agreement with the semiconductor core level shifts measured from the HAXPES spectra. These results highlight the potential application of this measurement approach in the evaluation of the efficacy of surface passivation treatments: HAXPES—hard x-ray photoelectron spectroscopy; C-V—capacitance voltage; Dit—interface state density; BE—binding energy, at reducing defect states densities in MOS structures.

  20. A Back-Gated Ferroelectric Field-Effect Transistor with an Al-Doped Zinc Oxide Channel

    NASA Astrophysics Data System (ADS)

    Jia, Ze; Xu, Jian-Long; Wu, Xiao; Zhang, Ming-Ming; Liou, Juin-J.

    2015-02-01

    We report a back-gated metal-oxide-ferroelectric-metal (MOFM) field-effect transistor (FET) with lead zirconate titanate (PZT) material, in which an Al doped zinc oxide (AZO) channel layer with an optimized doping concentration of 1% is applied to reduce the channel resistance of the channel layer, thus guaranteeing a large enough load capacity of the transistor. The hysteresis loops of the Pt/PZT/AZO/Ti/Pt capacitor are measured and compared with a Pt/PZT/Pt capacitor, indicating that the remnant polarization is almost 40 μC/cm2 and the polarization is saturated at 20 V. The measured capacitance-voltage properties are analyzed as a result of the electron depletion and accumulation switching operation conducted by the modulation of PZT on AZO channel resistance caused by the switchable remnant polarization of PZT. The switching properties of the AZO channel layer are also proved by the current-voltage transfer curves measured in the back-gated MOFM ferroelectric FET, which also show a drain current switching ratio up to about 100 times.

  1. Centro-Apical Self-Organization of Organic Semiconductors in a Line-Printed Organic Semiconductor: Polymer Blend for One-Step Printing Fabrication of Organic Field-Effect Transistors

    PubMed Central

    Jin Lee, Su; Kim, Yong-Jae; Young Yeo, So; Lee, Eunji; Sun Lim, Ho; Kim, Min; Song, Yong-Won; Cho, Jinhan; Ah Lim, Jung

    2015-01-01

    Here we report the first demonstration for centro-apical self-organization of organic semiconductors in a line-printed organic semiconductor: polymer blend. Key feature of this work is that organic semiconductor molecules were vertically segregated on top of the polymer phase and simultaneously crystallized at the center of the printed line pattern after solvent evaporation without an additive process. The thickness and width of the centro-apically segregated organic semiconductor crystalline stripe in the printed blend pattern were controlled by varying the relative content of the organic semiconductors, printing speed, and solution concentrations. The centro-apical self-organization of organic semiconductor molecules in a printed polymer blend may be attributed to the combination of an energetically favorable vertical phase-separation and hydrodynamic fluids inside the droplet during solvent evaporation. Finally, a centro-apically phase-separated bilayer structure of organic semiconductor: polymer blend was successfully demonstrated as a facile method to form the semiconductor and dielectric layer for OFETs in one- step. PMID:26359068

  2. Centro-Apical Self-Organization of Organic Semiconductors in a Line-Printed Organic Semiconductor: Polymer Blend for One-Step Printing Fabrication of Organic Field-Effect Transistors.

    PubMed

    Lee, Su Jin; Kim, Yong-Jae; Yeo, So Young; Lee, Eunji; Lim, Ho Sun; Kim, Min; Song, Yong-Won; Cho, Jinhan; Lim, Jung Ah

    2015-01-01

    Here we report the first demonstration for centro-apical self-organization of organic semiconductors in a line-printed organic semiconductor: polymer blend. Key feature of this work is that organic semiconductor molecules were vertically segregated on top of the polymer phase and simultaneously crystallized at the center of the printed line pattern after solvent evaporation without an additive process. The thickness and width of the centro-apically segregated organic semiconductor crystalline stripe in the printed blend pattern were controlled by varying the relative content of the organic semiconductors, printing speed, and solution concentrations. The centro-apical self-organization of organic semiconductor molecules in a printed polymer blend may be attributed to the combination of an energetically favorable vertical phase-separation and hydrodynamic fluids inside the droplet during solvent evaporation. Finally, a centro-apically phase-separated bilayer structure of organic semiconductor: polymer blend was successfully demonstrated as a facile method to form the semiconductor and dielectric layer for OFETs in one- step.

  3. Partial Oxidized Arsenene: Emerging Tunable Direct Bandgap Semiconductor

    NASA Astrophysics Data System (ADS)

    Wang, Yu-Jiao; Zhou, Kai-Ge; Yu, Geliang; Zhong, Xing; Zhang, Hao-Li

    2016-04-01

    Arsenene, as a member of the Group V elemental two-dimensional materials appears on the horizon, has shown great prospects. However, its indirect bandgap limits the applications in optoelectronics. In this theoretical work, we reported that partial oxidation can tune the indirect bandgap of arsenene into the direct one. Attributed to the enthalpy decreasing linear to the oxygen ratio, partial oxidized arsenene can be controllably produced by the progressive oxidation under low temperature. Importantly, by increasing the oxygen content from 1O/18As to 18O/18As, the oxidation can narrow the direct bandgap of oxidized arsenene from 1.29 to 0.02 eV. The bandgap of partial oxidized arsenene is proportional to the oxygen content. Consequently, the partial oxidized arsenene with tunable direct bandgap has great potentials in the high efficient infra light emitter and photo-voltaic devices.

  4. Partial Oxidized Arsenene: Emerging Tunable Direct Bandgap Semiconductor

    PubMed Central

    Wang, Yu-Jiao; Zhou, Kai-Ge; Yu, Geliang; Zhong, Xing; Zhang, Hao-Li

    2016-01-01

    Arsenene, as a member of the Group V elemental two-dimensional materials appears on the horizon, has shown great prospects. However, its indirect bandgap limits the applications in optoelectronics. In this theoretical work, we reported that partial oxidation can tune the indirect bandgap of arsenene into the direct one. Attributed to the enthalpy decreasing linear to the oxygen ratio, partial oxidized arsenene can be controllably produced by the progressive oxidation under low temperature. Importantly, by increasing the oxygen content from 1O/18As to 18O/18As, the oxidation can narrow the direct bandgap of oxidized arsenene from 1.29 to 0.02 eV. The bandgap of partial oxidized arsenene is proportional to the oxygen content. Consequently, the partial oxidized arsenene with tunable direct bandgap has great potentials in the high efficient infra light emitter and photo-voltaic devices. PMID:27114052

  5. Reducing leakage currents in n-channel organic field-effect transistors using molecular dipole monolayers on nanoscale oxides.

    PubMed

    Martínez Hardigree, Josué F; Dawidczyk, Thomas J; Ireland, Robert M; Johns, Gary L; Jung, Byung-Jun; Nyman, Mathias; Osterbacka, Ronald; Marković, Nina; Katz, Howard E

    2013-08-14

    Leakage currents through the gate dielectric of thin film transistors remain a roadblock to the fabrication of organic field-effect transistors (OFETs) on ultrathin dielectrics. We report the first investigation of a self-assembled monolayer (SAM) dipole as an electrostatic barrier to reduce leakage currents in n-channel OFETs fabricated on a minimal, leaky ∼10 nm SiO2 dielectric on highly doped Si. The electric field associated with 1H,1H,2H,2H-perfluoro-octyltriethoxysilane (FOTS) and octyltriethoxysilane (OTS) dipolar chains affixed to the oxide surface of n-Si gave an order of magnitude decrease in gate leakage current and subthreshold leakage and a two order-of-magnitude increase in ON/OFF ratio for a naphthalenetetracarboxylic diimide (NTCDI) transistor. Identically fabricated devices on p-Si showed similarly reduced leakage and improved performance for oxides treated with the larger dipole FOTS monolayer, while OTS devices showed poorer transfer characteristics than those on bare oxide. Comparison of OFETs on both substrates revealed that relative device performance from OTS and FOTS treatments was dictated primarily by the organosilane chain and not the underlying siloxane-substrate bond. This conclusion is supported by the similar threshold voltages (VT) extrapolated for SAM-treated devices, which display positive relative VT shifts for FOTS on either substrate but opposite VT shifts for OTS treatment on n-Si and p-Si. Our results highlight the potential of dipolar SAMs as performance-enhancing layers for marginal quality dielectrics, broadening the material spectrum for low power, ultrathin organic electronics.

  6. Modification of Wide-Band-Gap Oxide Semiconductors with Cobalt Hydroxide Nanoclusters for Visible-Light Water Oxidation.

    PubMed

    Maeda, Kazuhiko; Ishimaki, Koki; Tokunaga, Yuki; Lu, Daling; Eguchi, Miharu

    2016-07-11

    Cobalt-based compounds, such as cobalt(II) hydroxide, are known to be good catalysts for water oxidation. Herein, we report that such cobalt species can also activate wide-band-gap semiconductors towards visible-light water oxidation. Rutile TiO2 powder, a well-known wide-band-gap semiconductor, was capable of harvesting visible light with wavelengths of up to 850 nm, and thus catalyzed water oxidation to produce molecular oxygen, when decorated with cobalt(II) hydroxide nanoclusters. To the best of our knowledge, this system constitutes the first example that a particulate photocatalytic material that is capable of water oxidation upon excitation by visible light can also operate at such long wavelengths, even when it is based on earth-abundant elements only. PMID:27225394

  7. Catalyzed Water Oxidation by Solar Irradiation of Band-Gap-Narrowed Semiconductors (Part 2. Overview).

    SciTech Connect

    Fujita,E.; Khalifah, P.; Lymar, S.; Muckerman, J.T.; Rodriguez, J.

    2008-03-18

    The objectives of this report are: (1) Investigate the catalysis of water oxidation by cobalt and manganese hydrous oxides immobilized on titania or silica nanoparticles, and dinuclear metal complexes with quinonoid ligands in order to develop a better understanding of the critical water oxidation chemistry, and rationally search for improved catalysts. (2) Optimize the light-harvesting and charge-separation abilities of stable semiconductors including both a focused effort to improve the best existing materials by investigating their structural and electronic properties using a full suite of characterization tools, and a parallel effort to discover and characterize new materials. (3) Combine these elements to examine the function of oxidation catalysts on Band-Gap-Narrowed Semiconductor (BGNSC) surfaces and elucidate the core scientific challenges to the efficient coupling of the materials functions.

  8. Catalyzed Water Oxidation by Solar Irradiation of Band-Gap-Narrowed Semiconductors (Part 1. Overview).

    SciTech Connect

    Fujita,E.; Khalifah, P.; Lymar, S.; Muckerman, J.T.; Rodgriguez, J.

    2008-03-18

    The objectives of this report are: (1) Investigate the catalysis of water oxidation by cobalt and manganese hydrous oxides immobilized on titania or silica nanoparticles, and dinuclear metal complexes with quinonoid ligands in order to develop a better understanding of the critical water oxidation chemistry, and rationally search for improved catalysts. (2) Optimize the light-harvesting and charge-separation abilities of stable semiconductors including both a focused effort to improve the best existing materials by investigating their structural and electronic properties using a full suite of characterization tools, and a parallel effort to discover and characterize new materials. (3) Combine these elements to examine the function of oxidation catalysts on Band-Gap-Narrowed Semiconductor (BGNSC) surfaces and elucidate the core scientific challenges to the efficient coupling of the materials functions.

  9. Microbially-mediated method for synthesis of non-oxide semiconductor nanoparticles

    DOEpatents

    Phelps, Tommy J.; Lauf, Robert J.; Moon, Ji Won; Rondinone, Adam J.; Love, Lonnie J.; Duty, Chad Edward; Madden, Andrew Stephen; Li, Yiliang; Ivanov, Ilia N.; Rawn, Claudia Jeanette

    2014-06-24

    The invention is directed to a method for producing non-oxide semiconductor nanoparticles, the method comprising: (a) subjecting a combination of reaction components to conditions conducive to microbially-mediated formation of non-oxide semiconductor nanoparticles, wherein said combination of reaction components comprises i) anaerobic microbes, ii) a culture medium suitable for sustaining said anaerobic microbes, iii) a metal component comprising at least one type of metal ion, iv) a non-metal component containing at least one non-metal selected from the group consisting of S, Se, Te, and As, and v) one or more electron donors that provide donatable electrons to said anaerobic microbes during consumption of the electron donor by said anaerobic microbes; and (b) isolating said non-oxide semiconductor nanoparticles, which contain at least one of said metal ions and at least one of said non-metals. The invention is also directed to non-oxide semiconductor nanoparticle compositions produced as above and having distinctive properties.

  10. Screening method for selecting semiconductor substrates having defects below a predetermined level in an oxide layer

    DOEpatents

    Warren, W.L.; Vanheusden, K.J.R.; Schwank, J.R.; Fleetwood, D.M.; Shaneyfelt, M.R.; Winokur, P.S.; Devine, R.A.B.

    1998-07-28

    A method is disclosed for screening or qualifying semiconductor substrates for integrated circuit fabrication. The method comprises the steps of annealing at least one semiconductor substrate at a first temperature in a defect-activating ambient (e.g. hydrogen, forming gas, or ammonia) for sufficient time for activating any defects within on oxide layer of the substrate; measuring a defect-revealing electrical characteristic of at least a portion of the oxide layer for determining a quantity of activated defects therein; and selecting substrates for which the quantity of activated defects is below a predetermined level. The defect-revealing electrical characteristic may be a capacitance-versus voltage (C-V) characteristic or a current-versus-voltage (I-V) characteristic that is dependent on an electrical charge in the oxide layer generated by the activated defects. Embodiments of the present invention may be applied for screening any type of semiconductor substrate or wafer having an oxide layer formed thereon or therein. This includes silicon-on-insulator substrates formed by a separation by the implantation of oxygen (SIMOX) process or the bond and etch back silicon-on-insulator (BESOI) process, as well as silicon substrates having a thermal oxide layer or a deposited oxide layer. 5 figs.

  11. Screening method for selecting semiconductor substrates having defects below a predetermined level in an oxide layer

    DOEpatents

    Warren, William L.; Vanheusden, Karel J. R.; Schwank, James R.; Fleetwood, Daniel M.; Shaneyfelt, Marty R.; Winokur, Peter S.; Devine, Roderick A. B.

    1998-01-01

    A method for screening or qualifying semiconductor substrates for integrated circuit fabrication. The method comprises the steps of annealing at least one semiconductor substrate at a first temperature in a defect-activating ambient (e.g. hydrogen, forming gas, or ammonia) for sufficient time for activating any defects within on oxide layer of the substrate; measuring a defect-revealing electrical characteristic of at least a portion of the oxide layer for determining a quantity of activated defects therein; and selecting substrates for which the quantity of activated defects is below a predetermined level. The defect-revealing electrical characteristic may be a capacitance-versus-voltage (C-V) characteristic or a current-versus-voltage (I-V) characteristic that is dependent on an electrical charge in the oxide layer generated by the activated defects. Embodiments of the present invention may be applied for screening any type of semiconductor substrate or wafer having an oxide layer formed thereon or therein. This includes silicon-on-insulator substrates formed by a separation by the implantation of oxygen (SIMOX) process or the bond and etch back silicon-on-insulator (BESOI) process, as well as silicon substrates having a thermal oxide layer or a deposited oxide layer.

  12. Single-walled carbon nanotube field-effect transistors with graphene oxide passivation for fast, sensitive, and selective protein detection.

    PubMed

    Chang, Jingbo; Mao, Shun; Zhang, Yang; Cui, Shumao; Steeber, Douglas A; Chen, Junhong

    2013-04-15

    We report a novel technique to design an insulating membrane with attachment sites on top of single-walled carbon nanotubes (SWNTs) for achieving high sensitivity and selectivity in an SWNT field-effect transistor (FET) biosensor. Because electronic properties of SWNTs are extremely sensitive to the surface state, direct immobilization of proteins or DNAs onto SWNTs will generate surface defects through chemical reactions or physical adsorption, resulting in degradation of performance and instability of SWNT-FET biosensor devices. Here we demonstrate fabrication of novel FET biosensor devices using SWNTs as semiconducting channels, and a monolayer of graphene oxide (GO) membrane covered on the SWNTs as a passivating layer to avoid direct attachment of biomaterials on SWNTs, thereby preserving intrinsic electrical properties of SWNTs. Gold nanoparticles (Au NPs) are decorated on the GO layer for the covalent attachment of biotin, which is then used to selectively detect the target avidin. The passivation with GO layers can effectively lead to enhanced sensitivity of biosensor devices through increasing the on/off ratio of FET sensors.

  13. Single-walled carbon nanotube field-effect transistors with graphene oxide passivation for fast, sensitive, and selective protein detection.

    PubMed

    Chang, Jingbo; Mao, Shun; Zhang, Yang; Cui, Shumao; Steeber, Douglas A; Chen, Junhong

    2013-04-15

    We report a novel technique to design an insulating membrane with attachment sites on top of single-walled carbon nanotubes (SWNTs) for achieving high sensitivity and selectivity in an SWNT field-effect transistor (FET) biosensor. Because electronic properties of SWNTs are extremely sensitive to the surface state, direct immobilization of proteins or DNAs onto SWNTs will generate surface defects through chemical reactions or physical adsorption, resulting in degradation of performance and instability of SWNT-FET biosensor devices. Here we demonstrate fabrication of novel FET biosensor devices using SWNTs as semiconducting channels, and a monolayer of graphene oxide (GO) membrane covered on the SWNTs as a passivating layer to avoid direct attachment of biomaterials on SWNTs, thereby preserving intrinsic electrical properties of SWNTs. Gold nanoparticles (Au NPs) are decorated on the GO layer for the covalent attachment of biotin, which is then used to selectively detect the target avidin. The passivation with GO layers can effectively lead to enhanced sensitivity of biosensor devices through increasing the on/off ratio of FET sensors. PMID:23202350

  14. Technology of GaAs metal-oxide-semiconductor solar cells

    NASA Technical Reports Server (NTRS)

    Stirn, R. J.; Yeh, Y. C. M.

    1977-01-01

    The growth of an oxide interfacial layer was recently found to increase the open-circuit voltage (OCV) and efficiency by up to 60 per cent in GaAs metal-semiconductor solar cells. Details of oxidation techniques to provide the necessary oxide thickness and chemical structure and using ozone, water-vapor-saturated oxygen, or oxygen gas discharges are described, as well as apparent crystallographic orientation effects. Preliminary results of the oxide chemistry obtained from X-ray, photoelectron spectroscopy are given. Ratios of arsenic oxide to gallium oxide of unity or less seem to be preferable. Samples with the highest OVC predominantly have As(+3) in the arsenic oxide rather than As(+5). A major difficulty at this time is a reduction in OCV by 100-200 mV when the antireflection coating is vacuum deposited.

  15. Radiation induced failures of complementary metal oxide semiconductor containing pacemakers: a potentially lethal complication

    SciTech Connect

    Lewin, A.A.; Serago, C.F.; Schwade, J.G.; Abitbol, A.A.; Margolis, S.C.

    1984-10-01

    New multi-programmable pacemakers frequently employ complementary metal oxide semiconductors (CMOS). This circuitry appears more sensitive to the effects of ionizing radiation when compared to the semiconductor circuits used in older pacemakers. A case of radiation induced runaway pacemaker in a CMOS device is described. Because of this and other recent reports of radiation therapy-induced CMOS type pacemaker failure, these pacemakers should not be irradiated. If necessary, the pacemaker can be shielded or moved to a site which can be shielded before institution of radiation therapy. This is done to prevent damage to the CMOS circuit and the life threatening arrythmias which may result from such damage.

  16. Determination of Fowler-Nordheim tunneling parameters in Metal-Oxide-Semiconductor structure including oxide field correction using a vertical optimization method

    NASA Astrophysics Data System (ADS)

    Toumi, S.; Ouennoughi, Z.; Strenger, K. C.; Frey, L.

    2016-08-01

    Current conduction mechanisms through a Metal-Oxide-Semiconductor structure are characterized via Fowler-Nordheim (FN) plots. The extraction of the FN parameters like the electron/hole effective mass in oxide mox and in semiconductor msc, the barrier height at the semiconductor-oxide interface ϕB, and the correction oxide voltage Vcorr for a MOS structure is made using a vertical optimization process on the current density without any assumption about ϕB or mox. An excellent agreement is obtained between the FN plots calculated with the FN parameters extracted using a vertical optimization process with the experimental one.

  17. Halogens on Semiconductor Surfaces: Adsorption, Oxidation, and Etching.

    NASA Astrophysics Data System (ADS)

    Stepniak, Frank

    This dissertation presents studies of Si, GaAs, and InP surfaces following exposure to the halogens Cl _2 and Br_2. Synchrotron radiation photoemission is used to investigate the oxidation states of Si near the Si/SiO_2 interface as a function of Cl_2 exposure. Oxidation of highly ordered surfaces shows no dependence of the oxidation state concentration on Cl_2 inclusion in the gas mixture. For less-than-ideal Si surfaces, oxidation with O_2 -only results in a broader transition region, and presumably, inferior electrical properties. The addition of Cl_2 in the oxidizing gas reduced the concentration of intermediate oxides by a factor of two for these disordered starting Si surfaces. A new feature is also measured from Cl-Si bonds that we associate with passivation of Si defects at the oxide interface. The adsorption and reactivity of Br_2 and Cl_2 on GaAs(110) and InP(110) was studied in the temperature range of 25 K < T < 625 K with photoemission spectroscopy and scanning tunneling microscopy. Initial halogen adsorption was dissociative at all temperatures and we find that a simple model where the halogen atoms bond to a single Ga or As surface site can not account for the complex surface chemistry and morphology. Thermally-activated etching was observed after warming a surface with chemisorbed Br or Cl. Etching resulted from the formation and eventual temperature dependent desorption of the trihalides of Ga and As. For halogen exposures where T < 650 K, monohalide-like surface bonding persist during the etching process and the etched surface is rough. For T > 700 K, the surface is essentially free of halogen and etching occurs in a nearly layer-by-layer fashion.

  18. Near interface oxide trap capture kinetics in metal-oxide-semiconductor transistors: Modeling and measurements

    NASA Astrophysics Data System (ADS)

    Bauza, D.

    1998-12-01

    The traps situated in the oxide in the vicinity of the Si-SiO2 interface in metal-oxide-semiconductor (MOS) transistors, are studied. This is achieved using a new technique, based on the measurement of drain current transients and called T-CDLTS (tunnel-current deep level transient spectroscopy). For this, the traps are repeatedly filled with majority carriers using gate pulses which bias the device in accumulation. Each time the device returns in inversion, the drain current transient induced by the filling of the traps with minority carriers is monitored. A model for extracting the interface trap depth concentration profiles from the current transients is derived. It is based on Shockley-Read-Hall's statistics [R. N. Hall, Phys. Rev. 87, 387 (1952), W. Shockley and W. T. Read, Phys. Rev. 87, 835 (1952)] and on the Heiman and Warfield tunneling model [F. P. Heiman and G. Warfield, IEEE Trans. Electron Devices ED-12, 167 (1965)]. The slow trap densities measured in a virgin device agree with those obtained in state-of-the-art MOS transistors using noise measurements. In virgin and stressed devices they also compare favorably with the trap densities obtained using a recently proposed charge pumping technique. The evolution, with the experimental conditions, of the trap concentrations measured is discussed with respect to that expected from the model. In some experimental conditions, a very good agreement is obtained while in some others, discrepancies are observed. These discrepancies are discussed as regard to the hypothesis introduced in the model.

  19. Oxide semiconductor thin-film transistors: a review of recent advances.

    PubMed

    Fortunato, E; Barquinha, P; Martins, R

    2012-06-12

    Transparent electronics is today one of the most advanced topics for a wide range of device applications. The key components are wide bandgap semiconductors, where oxides of different origins play an important role, not only as passive component but also as active component, similar to what is observed in conventional semiconductors like silicon. Transparent electronics has gained special attention during the last few years and is today established as one of the most promising technologies for leading the next generation of flat panel display due to its excellent electronic performance. In this paper the recent progress in n- and p-type oxide based thin-film transistors (TFT) is reviewed, with special emphasis on solution-processed and p-type, and the major milestones already achieved with this emerging and very promising technology are summarizeed. After a short introduction where the main advantages of these semiconductors are presented, as well as the industry expectations, the beautiful history of TFTs is revisited, including the main landmarks in the last 80 years, finishing by referring to some papers that have played an important role in shaping transparent electronics. Then, an overview is presented of state of the art n-type TFTs processed by physical vapour deposition methods, and finally one of the most exciting, promising, and low cost but powerful technologies is discussed: solution-processed oxide TFTs. Moreover, a more detailed focus analysis will be given concerning p-type oxide TFTs, mainly centred on two of the most promising semiconductor candidates: copper oxide and tin oxide. The most recent data related to the production of complementary metal oxide semiconductor (CMOS) devices based on n- and p-type oxide TFT is also be presented. The last topic of this review is devoted to some emerging applications, finalizing with the main conclusions. Related work that originated at CENIMAT|I3N during the last six years is included in more detail, which

  20. Metal-oxide-semiconductor characterization of silicon surfaces thermally oxidized after reactive ion etching and magnetically enhanced reactive ion etching

    SciTech Connect

    Settlemyer, K.T. Jr.; Ruzyllo, J.; Hwang, D.K.

    1993-03-01

    In this study the performance of reactive ion etching (RIE) and magnetically enhanced reactive ion etching (MERIE) processes in pregate oxidation etching of the field oxide are compared. The comparison is carried out through metal-oxide-semiconductor (MOS) characterization of oxides and interfaces formed on etched silicon surfaces. The results revealed differences in the outcome of RIE and MERIE processes with the latter displaying overall superior characteristics. MERIE induced surface damage is shallower, and is mostly removed during oxide growth. RIE damage propagates deeper into the Si bulk and still influences the MOS devices even after the top Si layers are converted into the oxide. The results obtained emphasize the importance of adequate cleaning of silicon surfaces following RIE/MERIE processes. 5 refs., 4 figs.

  1. Generation and annihilation of traps in metal-oxide-semiconductor devices after negative air corona charging

    NASA Astrophysics Data System (ADS)

    Prasad, Ila; Srivastava, R. S.

    1993-07-01

    Surface and bulk traps along with positive oxide charge accumulation have been found to be generated in metal-oxide-semiconductor capacitors, when subjected to negative air corona discharge at slightly reduced pressure (≂10-1 Torr). The effects are neutralized and device quality improved when annealed at 200 °C in air. The bulk traps and a fraction of oxide charges were annealable when kept at room temperature for several months. The results have been analyzed by Nicollian-Goetzberger's conductance technique and a plausible explanation is given.

  2. Method for restoring the resistance of indium oxide semiconductors after heating while in sealed structures

    DOEpatents

    Seager, Carleton H.; Evans, Jr., Joseph Tate

    1998-01-01

    A method for counteracting increases in resistivity encountered when Indium Oxide resistive layers are subjected to high temperature annealing steps during semiconductor device fabrication. The method utilizes a recovery annealing step which returns the Indium Oxide layer to its original resistivity after a high temperature annealing step has caused the resistivity to increase. The recovery anneal comprises heating the resistive layer to a temperature between 100.degree. C. and 300.degree. C. for a period of time that depends on the annealing temperature. The recovery is observed even when the Indium Oxide layer is sealed under a dielectric layer.

  3. Method for restoring the resistance of indium oxide semiconductors after heating while in sealed structures

    DOEpatents

    Seager, C.H.; Evans, J.T. Jr.

    1998-11-24

    A method is described for counteracting increases in resistivity encountered when Indium Oxide resistive layers are subjected to high temperature annealing steps during semiconductor device fabrication. The method utilizes a recovery annealing step which returns the Indium Oxide layer to its original resistivity after a high temperature annealing step has caused the resistivity to increase. The recovery anneal comprises heating the resistive layer to a temperature between 100 C and 300 C for a period of time that depends on the annealing temperature. The recovery is observed even when the Indium Oxide layer is sealed under a dielectric layer. 1 fig.

  4. Diluted II-VI oxide semiconductors with multiple band gaps.

    PubMed

    Yu, K M; Walukiewicz, W; Wu, J; Shan, W; Beeman, J W; Scarpulla, M A; Dubon, O D; Becla, P

    2003-12-12

    We report the realization of a new mult-band-gap semiconductor. Zn(1-y)Mn(y)OxTe1-x alloys have been synthesized using the combination of oxygen ion implantation and pulsed laser melting. Incorporation of small quantities of isovalent oxygen leads to the formation of a narrow, oxygen-derived band of extended states located within the band gap of the Zn(1-y)Mn(y)Te host. When only 1.3% of Te atoms are replaced with oxygen in a Zn0.88Mn0.12Te crystal the resulting band structure consists of two direct band gaps with interband transitions at approximately 1.77 and 2.7 eV. This remarkable modification of the band structure is well described by the band anticrossing model. With multiple band gaps that fall within the solar energy spectrum, Zn(1-y)Mn(y)OxTe1-x is a material perfectly satisfying the conditions for single-junction photovoltaics with the potential for power conversion efficiencies surpassing 50%.

  5. Ferroelectric switching of poly(vinylidene difluoride-trifluoroethylene) in metal-ferroelectric-semiconductor non-volatile memories with an amorphous oxide semiconductor

    SciTech Connect

    Gelinck, G. H.; Breemen, A. J. J. M. van; Cobb, B.

    2015-03-02

    Ferroelectric polarization switching of poly(vinylidene difluoride-trifluoroethylene) is investigated in different thin-film device structures, ranging from simple capacitors to dual-gate thin-film transistors (TFT). Indium gallium zinc oxide, a high mobility amorphous oxide material, is used as semiconductor. We find that the ferroelectric can be polarized in both directions in the metal-ferroelectric-semiconductor (MFS) structure and in the dual-gate TFT under certain biasing conditions, but not in the single-gate thin-film transistors. These results disprove the common belief that MFS structures serve as a good model system for ferroelectric polarization switching in thin-film transistors.

  6. Ferroelectric switching of poly(vinylidene difluoride-trifluoroethylene) in metal-ferroelectric-semiconductor non-volatile memories with an amorphous oxide semiconductor

    NASA Astrophysics Data System (ADS)

    Gelinck, G. H.; van Breemen, A. J. J. M.; Cobb, B.

    2015-03-01

    Ferroelectric polarization switching of poly(vinylidene difluoride-trifluoroethylene) is investigated in different thin-film device structures, ranging from simple capacitors to dual-gate thin-film transistors (TFT). Indium gallium zinc oxide, a high mobility amorphous oxide material, is used as semiconductor. We find that the ferroelectric can be polarized in both directions in the metal-ferroelectric-semiconductor (MFS) structure and in the dual-gate TFT under certain biasing conditions, but not in the single-gate thin-film transistors. These results disprove the common belief that MFS structures serve as a good model system for ferroelectric polarization switching in thin-film transistors.

  7. Influence of Scattering in Near Ballistic Silicon NanoWire Metal-Oxide-Semiconductor Field Effect Transistor.

    PubMed

    Arafat, I Sheik; Balamurugan, N B

    2016-06-01

    The present work explores the impact of scattering in carrier transport of near-ballistic SiNW MOSFET. For the first time, a scattered SiNW MOSFET model is revealed which includes the effects of optical phonon emission, elastic scattering, surface roughness scattering and random discrete dopants. Impact of above mentioned combined scatterings in the device limits electron mobility which makes a remarkable decrease in device current and transconductance compared with our previous model and Natori's Ballistic transport model. This work discusses the detailed behavior of analog parameters like Transconductance (g(m)), Transconductance generation factor (g(m)/I(d)) and Early Voltage (VA). The proposed model has been validated by comparing the analytical results with the TCAD simulation results and it shows the good agreement. PMID:27427667

  8. A planar Al-Si Schottky barrier metal-oxide-semiconductor field effect transistor operated at cryogenic temperatures

    NASA Astrophysics Data System (ADS)

    Purches, W. E.; Rossi, A.; Zhao, R.; Kafanov, S.; Duty, T. L.; Dzurak, A. S.; Rogge, S.; Tettamanzi, G. C.

    2015-08-01

    Schottky Barrier-MOSFET technology offers intriguing possibilities for cryogenic nano-scale devices, such as Si quantum devices and superconducting devices. We present experimental results on a device architecture where the gate electrode is self-aligned with the device channel and overlaps the source and drain electrodes. This facilitates a sub-5 nm gap between the source/drain and channel, and no spacers are required. At cryogenic temperatures, such devices function as p-MOS Tunnel FETs, as determined by the Schottky barrier at the Al-Si interface, and as a further advantage, fabrication processes are compatible with both CMOS and superconducting logic technology.

  9. Performance analysis of boron nitride embedded armchair graphene nanoribbon metal-oxide-semiconductor field effect transistor with Stone Wales defects

    NASA Astrophysics Data System (ADS)

    Chanana, Anuja; Sengupta, Amretashis; Mahapatra, Santanu

    2014-01-01

    We study the performance of a hybrid Graphene-Boron Nitride armchair nanoribbon (a-GNR-BN) n-MOSFET at its ballistic transport limit. We consider three geometric configurations 3p, 3p + 1, and 3p + 2 of a-GNR-BN with BN atoms embedded on either side (2, 4, and 6 BN) on the GNR. Material properties like band gap, effective mass, and density of states of these H-passivated structures are evaluated using the Density Functional Theory. Using these material parameters, self-consistent Poisson-Schrodinger simulations are carried out under the Non Equilibrium Green's Function formalism to calculate the ballistic n-MOSFET device characteristics. For a hybrid nanoribbon of width ˜5 nm, the simulated ON current is found to be in the range of 265 μA-280 μA with an ON/OFF ratio 7.1 × 106-7.4 × 106 for a VDD = 0.68 V corresponding to 10 nm technology node. We further study the impact of randomly distributed Stone Wales (SW) defects in these hybrid structures and only 2.5% degradation of ON current is observed for SW defect density of 3.18%.

  10. Modeling of n-InAs metal oxide semiconductor capacitors with high-κ gate dielectric

    NASA Astrophysics Data System (ADS)

    Babadi, A. S.; Lind, E.; Wernersson, L. E.

    2014-12-01

    A qualitative analysis on capacitance-voltage and conductance data for high-κ/InAs capacitors is presented. Our measured data were evaluated with a full equivalent circuit model, including both majority and minority carriers, as well as interface and border traps, formulated for narrow band gap metal-oxide-semiconductor capacitors. By careful determination of interface trap densities, distribution of border traps across the oxide thickness, and taking into account the bulk semiconductor response, it is shown that the trap response has a strong effect on the measured capacitances. Due to the narrow bandgap of InAs, there can be a large surface concentration of electrons and holes even in depletion, so a full charge treatment is necessary.

  11. Modeling of n-InAs metal oxide semiconductor capacitors with high-κ gate dielectric

    SciTech Connect

    Babadi, A. S. Lind, E.; Wernersson, L. E.

    2014-12-07

    A qualitative analysis on capacitance-voltage and conductance data for high-κ/InAs capacitors is presented. Our measured data were evaluated with a full equivalent circuit model, including both majority and minority carriers, as well as interface and border traps, formulated for narrow band gap metal-oxide-semiconductor capacitors. By careful determination of interface trap densities, distribution of border traps across the oxide thickness, and taking into account the bulk semiconductor response, it is shown that the trap response has a strong effect on the measured capacitances. Due to the narrow bandgap of InAs, there can be a large surface concentration of electrons and holes even in depletion, so a full charge treatment is necessary.

  12. Physical model for trap-assisted inelastic tunneling in metal-oxide-semiconductor structures

    NASA Astrophysics Data System (ADS)

    Jiménez-Molinos, F.; Palma, A.; Gámiz, F.; Banqueri, J.; López-Villanueva, J. A.

    2001-10-01

    A physical model for trap-assisted inelastic tunnel current through potential barriers in semiconductor structures has been developed. The model is based on the theory of multiphonon transitions between detrapped and trapped states and the only fitting parameters are those of the traps (energy level and concentration) and the Huang-Rhys factor. Therefore, dependences of the trapping and detrapping processes on the bias, position, and temperature can be obtained with this model. The results of the model are compared with experimental data of stress induced leakage current in metal-oxide-semiconductor devices. The average energy loss has been obtained and an interpretation is given of the curves of average energy loss versus oxide voltage. This allows us to identify the entrance of the assisted tunnel current in the Fowler-Nordheim regime. In addition, the dependence of the tunnel current and average energy loss on the model parameters has been studied.

  13. Contact electrification field-effect transistor.

    PubMed

    Zhang, Chi; Tang, Wei; Zhang, Limin; Han, Changbao; Wang, Zhong Lin

    2014-08-26

    Utilizing the coupled metal oxide semiconductor field-effect transistor and triboelectric nanogenerator, we demonstrate an external force triggered/controlled contact electrification field-effect transistor (CE-FET), in which an electrostatic potential across the gate and source is created by a vertical contact electrification between the gate material and a “foreign” object, and the carrier transport between drain and source can be tuned/controlled by the contact-induced electrostatic potential instead of the traditional gate voltage. With the two contacted frictional layers vertically separated by 80 μm, the drain current is decreased from 13.4 to 1.9 μA in depletion mode and increased from 2.4 to 12.1 μA in enhancement mode at a drain voltage of 5 V. Compared with the piezotronic devices that are controlled by the strain-induced piezoelectric polarization charged at an interface/junction, the CE-FET has greatly expanded the sensing range and choices of materials in conjunction with semiconductors. The CE-FET is likely to have important applications in sensors, human–silicon technology interfacing, MEMS, nanorobotics, and active flexible electronics. Based on the basic principle of the CE-FET, a field of tribotronics is proposed for devices fabricated using the electrostatic potential created by triboelectrification as a “gate” voltage to tune/control charge carrier transport in conventional semiconductor devices. By the three-way coupling among triboelectricity, semiconductor, and photoexcitation, plenty of potentially important research fields are expected to be explored in the near future. PMID:25119657

  14. Retinal Stimulation on Rabbit Using Complementary Metal Oxide Semiconductor Based Multichip Flexible Stimulator toward Retinal Prosthesis

    NASA Astrophysics Data System (ADS)

    Tokuda, Takashi; Asano, Ryosuke; Sugitani, Sachie; Taniyama, Mari; Terasawa, Yasuo; Nunoshita, Masahiro; Nakauchi, Kazuaki; Fujikado, Takashi; Tano, Yasuo; Ohta, Jun

    2008-04-01

    The Functionality of a complementary metal oxide semiconductor (CMOS) LSI-based, multichip flexible retinal stimulator was demonstrated in retinal stimulation experiments on rabbits. A 1×4-configured multichip stimulator was fabricated for application to experiments on animals. An experimental procedure including surgical operations was developed, and retinal stimulation was performed with the fabricated multichip stimulator. Neural responses on the visual cortex were successfully evoked by the fabricated stimulator. The stimulator is confirmed to be applicable to acute animal experiments.

  15. Complementary Metal-Oxide-Semiconductor Image Sensor with Microchamber Array for Fluorescent Bead Counting

    NASA Astrophysics Data System (ADS)

    Sasagawa, Kiyotaka; Ando, Keisuke; Kobayashi, Takuma; Noda, Toshihiko; Tokuda, Takashi; Kim, Soo Hyeon; Iino, Ryota; Noji, Hiroyuki; Ohta, Jun

    2012-02-01

    We fabricated a complementary metal-oxide-semiconductor image sensor with a femtoliter microchamber array. The microchamber array plate is used for trapping microbeads and limiting the incident angle of light detected by the sensor. The sensor has an interference filter for fluorescent microbeads imaging. We detected fluorescent and nonfluorescent microbead with this sensor and showed its capability for counting the number of fluorescent chambers.

  16. Photodegradation of neonicotinoid insecticides in water by semiconductor oxides.

    PubMed

    Fenoll, José; Garrido, Isabel; Hellín, Pilar; Flores, Pilar; Navarro, Simón

    2015-10-01

    The photocatalytic degradation of three neonicotinoid insecticides (NIs), thiamethoxam (TH), imidacloprid (IM) and acetamiprid (AC), in pure water has been studied using zinc oxide (ZnO) and titanium dioxide (TiO2) as photocatalysts under natural sunlight and artificial light irradiation. Photocatalytic experiments showed that the addition of these chalcogenide oxides in tandem with the electron acceptor (Na2S2O8) strongly enhances the degradation rate of these compounds in comparison with those carried out with ZnO and TiO2 alone and photolytic tests. Comparison of catalysts showed that ZnO is the most efficient for the removal of such insecticides in optimal conditions and at constant volumetric rate of photon absorption. Thus, the complete disappearance of all the studied compounds was achieved after 10 and 30 min of artificial light irradiation, in the ZnO/Na2S2O8 and TiO2/Na2S2O8 systems, respectively. The highest degradation rate was noticed for IM, while the lowest rate constant was obtained for AC under artificial light irradiation. In addition, solar irradiation was more efficient compared to artificial light for the removal of these insecticides from water. The main photocatalytic intermediates detected during the degradation of NIs were identified. PMID:26002372

  17. Photodegradation of neonicotinoid insecticides in water by semiconductor oxides.

    PubMed

    Fenoll, José; Garrido, Isabel; Hellín, Pilar; Flores, Pilar; Navarro, Simón

    2015-10-01

    The photocatalytic degradation of three neonicotinoid insecticides (NIs), thiamethoxam (TH), imidacloprid (IM) and acetamiprid (AC), in pure water has been studied using zinc oxide (ZnO) and titanium dioxide (TiO2) as photocatalysts under natural sunlight and artificial light irradiation. Photocatalytic experiments showed that the addition of these chalcogenide oxides in tandem with the electron acceptor (Na2S2O8) strongly enhances the degradation rate of these compounds in comparison with those carried out with ZnO and TiO2 alone and photolytic tests. Comparison of catalysts showed that ZnO is the most efficient for the removal of such insecticides in optimal conditions and at constant volumetric rate of photon absorption. Thus, the complete disappearance of all the studied compounds was achieved after 10 and 30 min of artificial light irradiation, in the ZnO/Na2S2O8 and TiO2/Na2S2O8 systems, respectively. The highest degradation rate was noticed for IM, while the lowest rate constant was obtained for AC under artificial light irradiation. In addition, solar irradiation was more efficient compared to artificial light for the removal of these insecticides from water. The main photocatalytic intermediates detected during the degradation of NIs were identified.

  18. Ionic Liquid Activation of Amorphous Metal-Oxide Semiconductors for Flexible Transparent Electronic Devices

    DOE PAGES

    Pudasaini, Pushpa Raj; Noh, Joo Hyon; Wong, Anthony T.; Ovchinnikova, Olga S.; Haglund, Amanda V.; Dai, Sheng; Ward, Thomas Zac; Mandrus, David; Rack, Philip D.

    2016-02-09

    To begin this abstract, amorphous metal-oxide semiconductors offer the high carrier mobilities and excellent large-area uniformity required for high performance, transparent, flexible electronic devices; however, a critical bottleneck to their widespread implementation is the need to activate these materials at high temperatures which are not compatible with flexible polymer substrates. The highly controllable activation of amorphous indium gallium zinc oxide semiconductor channels using ionic liquid gating at room temperature is reported. Activation is controlled by electric field-induced oxygen migration across the ionic liquid-semiconductor interface. In addition to activation of unannealed devices, it is shown that threshold voltages of a transistormore » can be linearly tuned between the enhancement and depletion modes. Finally, the first ever example of transparent flexible thin film metal oxide transistor on a polyamide substrate created using this simple technique is demonstrated. Finally, this study demonstrates the potential of field-induced activation as a promising alternative to traditional postdeposition thermal annealing which opens the door to wide scale implementation into flexible electronic applications.« less

  19. Interfacial insertion of a poly(3,4-ethylenedioxythiophene): poly(styrenesulfonate) layer between the poly(3-hexyl thiophene) semiconductor and cross-linked poly(vinyl alcohol) insulator layer in organic field-effect transistors

    NASA Astrophysics Data System (ADS)

    Cruz-Cruz, Isidro; Tavares, Ana C. B.; Reyes-Reyes, Marisol; López-Sandoval, Román; Hümmelgen, Ivo A.

    2014-02-01

    The role of a thin layer of conductive poly(3,4-ethylenedioxythiophene) doped with polystyrene sulfonate (PEDOT : PSS), inserted between the gate dielectric and the active layer in poly(3-hexylthiophene)-based transistors was investigated. The devices were fabricated in the bottom-gate top-contact geometry by using cross-linked poly(vinyl alcohol) as the dielectric, whereas the PEDOT : PSS layer was prepared by using an aged aqueous dispersion with addition of different amounts of dimethyl sulfoxide (DMSO) as a secondary dopant. Under these conditions, both a significant reduction in the number of electrically active traps at the interface with the semiconductor and an improvement in the field-effect mobility were obtained, whereas the low power consumption was preserved. The threshold voltage was also displaced by approximately -1 V.

  20. Continuously Controlled Optical Band Gap in Oxide Semiconductor Thin Films.

    PubMed

    Herklotz, Andreas; Rus, Stefania Florina; Ward, Thomas Zac

    2016-03-01

    The optical band gap of the prototypical semiconducting oxide SnO2 is shown to be continuously controlled through single axis lattice expansion of nanometric films induced by low-energy helium implantation. While traditional epitaxy-induced strain results in Poisson driven multidirectional lattice changes shown to only allow discrete increases in bandgap, we find that a downward shift in the band gap can be linearly dictated as a function of out-of-plane lattice expansion. Our experimental observations closely match density functional theory that demonstrates that uniaxial strain provides a fundamentally different effect on the band structure than traditional epitaxy-induced multiaxes strain effects. Charge density calculations further support these findings and provide evidence that uniaxial strain can be used to drive orbital hybridization inaccessible with traditional strain engineering techniques. PMID:26836282

  1. Continuously controlled optical band gap in oxide semiconductor thin films

    DOE PAGES

    Herklotz, Andreas; Rus, Stefania Florina; Ward, Thomas Zac

    2016-02-02

    The optical band gap of the prototypical semiconducting oxide SnO2 is shown to be continuously controlled through single axis lattice expansion of nanometric films induced by low-energy helium implantation. While traditional epitaxy-induced strain results in Poisson driven multidirectional lattice changes shown to only allow discrete increases in bandgap, we find that a downward shift in the band gap can be linearly dictated as a function of out-of-plane lattice expansion. Our experimental observations closely match density functional theory that demonstrates that uniaxial strain provides a fundamentally different effect on the band structure than traditional epitaxy-induced multiaxes strain effects. In conclusion, chargemore » density calculations further support these findings and provide evidence that uniaxial strain can be used to drive orbital hybridization inaccessible with traditional strain engineering techniques.« less

  2. Fabrication of OSOS cells by neutral ion beam sputtering. [Oxide Semiconductor On Silicon solar cells

    NASA Technical Reports Server (NTRS)

    Burk, D. E.; Dubow, J. B.; Sites, J. R.

    1976-01-01

    Oxide semiconductor on silicon (OSOS) solar cells have been fabricated from various indium tin oxide (In2O3)x(SnO2)1-x compositions sputtered onto p-type single crystal silicon substrates with a neutralized argon ion beam. High temperature processing or annealing was not required. The highest efficiency was achieved with x = 0.91 and was 12 percent. The cells are environmentally rugged, chemically stable, and show promise for still higher efficiencies. Moreover, the ion beam sputtering fabrication technique is amenable to low cost, continuous processing.

  3. Label-free electrical detection of cardiac biomarker with complementary metal-oxide semiconductor-compatible silicon nanowire sensor arrays.

    PubMed

    Chua, Jay Huiyi; Chee, Ru-Ern; Agarwal, Ajay; Wong, She Mein; Zhang, Guo-Jun

    2009-08-01

    Arrays of highly ordered silicon nanowire (SiNW) clusters are fabricated using complementary metal-oxide semiconductor (CMOS) field effect transistor-compatible technology, and the ultrasensitive, label-free, electrical detection of cardiac biomarker in real time using the array sensor is presented. The successful detection of human cardiac troponin-T (cTnT) has been demonstrated in an assay buffer solution of concentration down to 1 fg/mL, as well as in an undiluted human serum environment of concentration as low as 30 fg/mL. The high specificity, selectivity, and swift response time of the SiNWs to the presence of ultralow concentrations of a target protein in a biological analyte solution, even in the presence of a high total protein concentration, paves the way for the development of a medical diagnostic system for point-of-care application that is able to provide an early and accurate indication of cardiac cellular necrosis. PMID:20337397

  4. An electrodeposited inhomogeneous metal-insulator-semiconductor junction for efficient photoelectrochemical water oxidation

    NASA Astrophysics Data System (ADS)

    Hill, James C.; Landers, Alan T.; Switzer, Jay A.

    2015-11-01

    The photoelectrochemical splitting of water into hydrogen and oxygen requires a semiconductor to absorb light and generate electron-hole pairs, and a catalyst to enhance the kinetics of electron transfer between the semiconductor and solution. A crucial question is how this catalyst affects the band bending in the semiconductor, and, therefore, the photovoltage of the cell. We introduce a simple and inexpensive electrodeposition method to produce an efficient n-Si/SiOx/Co/CoOOH photoanode for the photoelectrochemical oxidation of water to oxygen. The photoanode functions as a solid-state, metal-insulator-semiconductor photovoltaic cell with spatially non-uniform barrier heights in series with a low overpotential water-splitting electrochemical cell. The barrier height is a function of the Co coverage; it increases from 0.74 eV for a thick, continuous film to 0.91 eV for a thin, inhomogeneous film that has not reached coalescence. The larger barrier height leads to a 360 mV photovoltage enhancement relative to a solid-state Schottky barrier.

  5. Confirmation of filament dissolution behavior by analyzing electrical field effect during reset process in oxide-based RRAM

    NASA Astrophysics Data System (ADS)

    Pan, Chih-Hung; Chang, Ting-Chang; Tsai, Tsung-Ming; Chang, Kuan-Chang; Chu, Tian-Jian; Lin, Wen-Yan; Chen, Min-Chen; Sze, Simon M.

    2016-09-01

    In this letter, we demonstrate completely different characteristics with different operating modes and analyze the electrical field effect to confirm the filament dissolution behavior. The device exhibited a larger memory window when using a single voltage sweep method during reset process rather than the traditional double sweep method. The phenomenon was verified by using fast I-V measurement to simulate the two operating methods. A better high resistance state (HRS) will be obtained with a very short rising time pulse, but quite notably, lower power consumption was needed. We proposed the electrical field effect to explain the phenomenon and demonstrate distribution by COMSOL simulation.

  6. Magnetic field effects on the Rabi splitting and radiative decay rates of the exciton-polariton states in a semiconductor microcavity

    NASA Astrophysics Data System (ADS)

    Fenniche, H.; Jaziri, S.; Bennaceur, R.

    1998-12-01

    We study theoretically a particular type of semiconductor microcavity formed by a quantum well embedded inside it and the distributed Bragg reflectors presenting a gradual structure. We apply to this structure a static magnetic field along the growth direction. In the strong coupling regime between the confined exciton and cavity modes, we evaluate the polariton Rabi splitting corresponding to the two lowest lying exciton states: HH1-CB1 and HH2-CB2 as a function of the applied magnetic field. In high magnetic field and for distinct reflectivities, we find that the Rabi splitting magnitude of the HH2-CB2 exciton is close to the fundamental one (HH1-CB1). In the presence of the magnetic field, the polariton Rabi splitting can be obtained even in low reflectivity. The dispersion polariton radiative decay rates related to the two lowest lying exciton states: HH1-CB1 and HH2-CB2 are calculated for different magnetic field values. At k //=0 and in the weak coupling regime, the polariton radiative decay rates are evaluated for both the HH1-CB1 and HH2-CB2 excitons. We show that for the fundamental excitonic state, the magnetic field value which determines the transition from the weak to the strong coupling regime is different from the HH2-CB2 exciton state.

  7. Rare-Earth Doped Wide Bandgap Oxide Semiconductor Materials and Devices

    NASA Astrophysics Data System (ADS)

    Wellenius, Ian Patrick

    Amorphous oxide semiconductors composed of indium gallium zinc oxide are transparent to visible light and have higher electron mobilities than conventional amorphous semiconductors, such as amorphous silicon. The advantages of higher switching speed, lack of dangling bonds leading to good electronic stability and visible spectrum transparency of amorphous oxide semiconductor devices are expected to lead to numerous applications, including transparent displays and flexible electronics. In this thesis the integration of transparent thin film transistors with transparent electroluminescent pixels was investigated. Compared with display technologies employing organic semiconductors that degrade with exposure to moisture and ultraviolet light, the all-oxide structure of this device is expected to be environmentally robust. This is believed to be the first demonstration of an integrated active matrix pixel using amorphous oxide semiconductor materials as both the light emitter and addressing circuit elements. The transparent active matrix pixel was designed, fabricated and characterized, that integrated amorphous indium gallium zinc oxide (IGZO) thin film transistors (TFTs) with a europium-doped IGZO thin film electroluminescent (TFEL) device. The integrated circuits were fabricated using room temperature pulsed laser deposition (PLD) of IGZO and ITO thin films onto substrates of Corning 7059 glass, sputter coated with an ITO back contact and subsequent atomic layer deposited ATO high-k dielectric. A second ITO layer is deposited by PLD as a contact and interconnect layer. All deposition steps were carried out at room temperature. In addition to the integration task, an important part of this thesis concerns the investigation of europium as a dopant in different oxide hosts including gallium oxide, gadolinium oxide, and amorphous IGZO. Amorphous IGZO was chosen for the integration task since it could be deposited at room temperature, however it was found that the

  8. Solution-processable n-type semiconductors based on unsymmetrical naphthalene imides: synthesis, characterization, and applications in field-effect transistors.

    PubMed

    Shao, Jinjun; Chang, Jingjing; Chi, Chunyan

    2014-01-01

    A series of unsymmetrical naphthalene imide derivatives (1-5) with high electron affinity was synthesized and used in n-channel organic field-effect transistors (OFETs). They have very good solubility in common organic solvents and good thermal stability up to 320 °C. Their photophysical, electrochemical, and thermal properties were investigated in detail. They showed low-lying LUMO energy levels from -3.90 to -4.15 eV owing to a strong electron-withdrawing character. Solution-processed thin-film OFETs based on 1-4 were measured in both N2 and air. They all showed n-type FET behavior. The liquid-crystalline compounds 1a, 1b, and 3 showed good performance owing to the self-healing properties of the film in the liquid-crystal phase. Compound 3 has an electron mobility of up to 0.016 cm(2)V(-1) s(-1) and current on/off ratios of 10(4)-10(5). PMID:24136858

  9. Fabrication of porous materials (metal, metal oxide and semiconductor) through an aerosol-assisted route

    NASA Astrophysics Data System (ADS)

    Sohn, Hiesang

    Porous materials have gained attraction owing to their vast applications in catalysts, sensors, energy storage devices, bio-devices and other areas. To date, various porous materials were synthesized through soft and hard templating approaches. However, a general synthesis method for porous non-oxide materials, metal alloys and semiconductors with tunable structure, composition and morphology has not been developed yet. To address this challenge, this thesis presents an aerosol method towards the synthesis of such materials and their applications for catalysis, hydrogen storage, Li-batteries and photo-catalysis. The first part of this thesis presents the synthesis of porous metals, metal oxides, and semiconductors with controlled pore structure, crystalline structure and morphology. In these synthesis processes, metal salts and organic ligands were employed as precursors to create porous metal-carbon frameworks. During the aerosol process, primary metal clusters and nanoparticles were formed, which were coagulated/ aggregated forming the porous particles. Various porous particles, such as those of metals (e.g., Ni, Pt, Co, Fe, and Ni xPt(1-x)), metal oxides (e.g., Fe3O4 and SnO2) and semiconductors (e.g., CdS, CuInS2, CuInS 2x-ZnS(1-x), and CuInS2x-TiO2(1-x)) were synthesized. The morphology, porous structure and crystalline structure of the particles were regulated through both templating and non-templating methods. The second part of this thesis explores the applications of these materials, including propylene hydrogenation and H2 uptake capacity of porous Ni, NiPt alloys and Ni-Pt composites, Li-storage of Fe3O4 and SnO2, photodegradation of CuInS2-based semiconductors. The effects of morphology, compositions, and porous structure on the device performance were systematically investigated. Overall, this dissertation work unveiled a simple synthesis approach for porous particles of metals, metal alloys, metal oxides, and semiconductors with controlled

  10. Dielectric Engineering of a Boron Nitride/Hafnium Oxide Heterostructure for High-Performance 2D Field Effect Transistors.

    PubMed

    Zou, Xuming; Huang, Chun-Wei; Wang, Lifeng; Yin, Long-Jing; Li, Wenqing; Wang, Jingli; Wu, Bin; Liu, Yunqi; Yao, Qian; Jiang, Changzhong; Wu, Wen-Wei; He, Lin; Chen, Shanshan; Ho, Johnny C; Liao, Lei

    2016-03-01

    A unique design of a hexagonal boron nitride (h-BN)/HfO2 dielectric heterostructure stack is demonstrated, with few-layer h-BN to alleviate the surface optical phonon scattering, followed by high-κ HfO2 deposition to suppress Coulombic impurity scattering so that high-performance top-gated two-dimensional semiconductor transistors are achieved. Furthermore, this dielectric stack can also be extended to GaN-based transistors to enhance their performance.

  11. Interface state density of SiO2/p-type 4H-SiC ( 0001 ), ( 11 2 ¯ 0 ), ( 1 1 ¯ 00 ) metal-oxide-semiconductor structures characterized by low-temperature subthreshold slopes

    NASA Astrophysics Data System (ADS)

    Kobayashi, Takuma; Nakazawa, Seiya; Okuda, Takafumi; Suda, Jun; Kimoto, Tsunenobu

    2016-04-01

    Interface properties of heavily Al-doped 4H-SiC ( 0001 ) (Si-face), ( 11 2 ¯ 0 ) (a-face), and ( 1 1 ¯ 00 ) (m-face) metal-oxide-semiconductor (MOS) structures were characterized from the low-temperature gate characteristics of metal-oxide-semiconductor field-effect transistors (MOSFETs). From low-temperature subthreshold slopes, interface state density (Dit) at very shallow energy levels (ET) near the conduction band edge (Ec) was evaluated. We discovered that the Dit near Ec (Ec - 0.01 eV < ET < Ec) increases in MOS structures with higher Al doping density for every crystal face (Si-, a-, and m-face). Linear correlation is observed between the channel mobility and Dit near Ec, and we concluded that the mobility drop observed in heavily doped MOSFETs is mainly caused by the increase of Dit near Ec.

  12. Organic Field-Effect Transistors for CMOS Devices

    NASA Astrophysics Data System (ADS)

    Melzer, Christian; von Seggern, Heinz

    Organic field-effect transistors (OFETs) are the key elements of future low cost electronics such as radio frequency identification tags. In order to take full advantage of organic electronics, low power consumption is mandatory, requiring the use of a complementary metal oxide semiconductor (CMOS) like technique. To realize CMOS-devices p-type and n-type organic field-effect transistors on one substrate have to be provided. Here, the latest concepts to produce in a straightforward way complementary acting OFETs for CMOS-like elements are illustrated on basis of the inverter. Starting from a simple description of thin-film transistors, the basic design rules for the development of complementary OFETs are given and some realizations of CMOS-like inverters are discussed. A CMOS-like inverter based on two identical field-effect transistors disclosing almost unipolar p-type and n-type behavior is presented.

  13. Characterization of Interface State in Silicon Carbide Metal Oxide Semiconductor Capacitors

    NASA Astrophysics Data System (ADS)

    Kao, Wei-Chieh

    Silicon carbide (SiC) has always been considered as an excellent material for high temperature and high power devices. Since SiC is the only compound semiconductor whose native oxide is silicon dioxide (SiO2), it puts SiC in a unique position. Although SiC metal oxide semiconductor (MOS) technology has made significant progress in recent years, there are still a number of issues to be overcome before more commercial SiC devices can enter the market. The prevailing issues surrounding SiC MOSFET devices are the low channel mobility, the low quality of the oxide layer and the high interface state density at the SiC/SiO2 interface. Consequently, there is a need for research to be performed in order to have a better understanding of the factors causing the poor SiC/SiO2 interface properties. In this work, we investigated the generation lifetime in SiC materials by using the pulsed metal oxide semiconductor (MOS) capacitor method and measured the interface state density distribution at the SiC/SiO2 interface by using the conductance measurement and the high-low frequency capacitance technique. These measurement techniques have been performed on n-type and p-type SiC MOS capacitors. In the course of our investigation, we observed fast interface states at semiconductor-dielectric interfaces in SiC MOS capacitors that underwent three different interface passivation processes, such states were detected in the nitrided samples but not observed in PSG-passivated samples. This result indicate that the lack of fast states at PSG-passivated interface is one of the main reasons for higher channel mobility in PSG MOSFETs. In addition, the effect of mobile ions in the oxide on the response time of interface states has been investigated. In the last chapter we propose additional methods of investigation that can help elucidate the origin of the particular interface states, enabling a more complete understanding of the SiC/SiO2 material system.

  14. Novel photoinduced phase transitions in transition metal oxides and diluted magnetic semiconductors

    PubMed Central

    2012-01-01

    Some transition metal oxides have frustrated electronic states under multiphase competition due to strongly correlated d electrons with spin, charge, and orbital degrees of freedom and exhibit drastic responses to external stimuli such as optical excitation. Here, we present photoemission studies on Pr0.55(Ca1 − ySry)0.45MnO3 (y = 0.25), SrTiO3, and Ti1 − xCoxO2 (x = 0.05, 0.10) under laser illumination and discuss electronic structural changes induced by optical excitation in these strongly correlated oxides. We discuss the novel photoinduced phase transitions in these transition metal oxides and diluted magnetic semiconductors on the basis of polaronic pictures such as orbital, ferromagnetic, and ferroelectric polarons. PMID:23092248

  15. InAs-based metal-oxide-semiconductor structure formation in low-energy Townsend discharge

    NASA Astrophysics Data System (ADS)

    Aksenov, M. S.; Kokhanovskii, A. Yu.; Polovodov, P. A.; Devyatova, S. F.; Golyashov, V. A.; Kozhukhov, A. S.; Prosvirin, I. P.; Khandarkhaeva, S. E.; Gutakovskii, A. K.; Valisheva, N. A.; Tereshchenko, O. E.

    2015-10-01

    We developed and applied a method of InAs passivation in the low-energy plasma of Townsend discharge. The controlled interface oxidation in the Ar:O2:CF4 gas mixture under visualization of gas discharge plasma allowed growing thin homogeneous films in the range of 5-15 nm thickness. Oxidation with the addition of CF4 in gas-discharge plasma led to the formation of In and As oxyfluorides with a wide insulating gap and isostructural interface with unpinned Fermi level behavior. The metal-oxide-semiconductor structure showed excellent capacitance-voltage characteristics: small frequency dispersion (<15 mV), density of interface states (Dit) in the gap below 5 × 1010 eV-1cm-2, and fixed charge (Qfix) below 5 × 1011 cm-2.

  16. Complementary metal oxide semiconductor compatible silicon nanowires-on-a-chip: fabrication and preclinical validation for the detection of a cancer prognostic protein marker in serum.

    PubMed

    Tran, Duy P; Wolfrum, Bernhard; Stockmann, Regina; Pai, Jing-Hong; Pourhassan-Moghaddam, Mohammad; Offenhäusser, Andreas; Thierry, Benjamin

    2015-02-01

    An integrated translational biosensing technology based on arrays of silicon nanowire field-effect transistors (SiNW FETs) is described and has been preclinically validated for the ultrasensitive detection of the cancer biomarker ALCAM in serum. High-quality SiNW arrays have been rationally designed toward their implementation as molecular biosensors. The FET sensing platform has been fabricated using a complementary metal oxide semiconductor (CMOS)-compatible process. Reliable and reproducible electrical performance has been demonstrated via electrical characterization using a custom-designed portable readout device. Using this platform, the cancer prognostic marker ALCAM could be detected in serum with a detection limit of 15.5 pg/mL. Importantly, the detection could be completed in less than 30 min and span a wide dynamic detection range (∼10(5)). The SiNW-on-a-chip biosensing technology paves the way to the translational clinical application of FET in the detection of cancer protein markers.

  17. Polarity dependent thermochemical E-model for describing time dependent dielectric breakdown in metal-oxide-semiconductor devices with hyper-thin gate dielectrics

    NASA Astrophysics Data System (ADS)

    McPherson, J. W.

    2016-09-01

    The Lorentz factor L, which is used for describing the local electric fields in hyper-thin (<3.0 nm) gate dielectrics, is found to be polarity dependent for an inversion and accumulation-mode testing of Metal-Oxide-Semiconductor Field Effect Transistors. L is strongly impacted by the dipole layers that are induced in the depletion regions in the poly and silicon-substrate electrodes. While time dependent dielectric breakdown (TDDB) results are much improved with the inversion-mode testing, the reason for this is due to a smaller Lorentz factor (thus smaller Eloc). In fact, when compared at the same local electric field Eloc, there is no difference in TDDB between the inversion and accumulation mode testing. Thus, when properly corrected for the depletion effects in the MOS electrodes, the Thermochemical E-Model becomes polarity dependent and describes well both the inversion and accumulation-mode TDDB testing of the hyper-thin gate dielectrics.

  18. The role of the substrate on the dispersion in accumulation in III-V compound semiconductor based metal-oxide-semiconductor gate stacks

    SciTech Connect

    Krylov, Igor; Ritter, Dan; Eizenberg, Moshe

    2015-09-07

    Dispersion in accumulation is a widely observed phenomenon in metal-oxide-semiconductor gate stacks based on III-V compound semiconductors. The physical origin of this phenomenon is attributed to border traps located in the dielectric material adjacent to the semiconductor. Here, we study the role of the semiconductor substrate on the electrical quality of the first layers at atomic layer deposited (ALD) dielectrics. For this purpose, either Al{sub 2}O{sub 3} or HfO{sub 2} dielectrics with variable thicknesses were deposited simultaneously on two technology important semiconductors—InGaAs and InP. Significantly larger dispersion was observed in InP based gate stacks compared to those based on InGaAs. The observed difference is attributed to a higher border trap density in dielectrics deposited on InP compared to those deposited on InGaAs. We therefore conclude that the substrate plays an important role in the determination of the electrical quality of the first dielectric monolayers deposited by ALD. An additional observation is that larger dispersion was obtained in HfO{sub 2} based capacitors compared to Al{sub 2}O{sub 3} based capacitors, deposited on the same semiconductor. This phenomenon is attributed to the lower conduction band offset rather than to a higher border trap density.

  19. Hydrogen Doped Metal Oxide Semiconductors with Exceptional and Tunable Localized Surface Plasmon Resonances.

    PubMed

    Cheng, Hefeng; Wen, Meicheng; Ma, Xiangchao; Kuwahara, Yasutaka; Mori, Kohsuke; Dai, Ying; Huang, Baibiao; Yamashita, Hiromi

    2016-07-27

    Heavily doped semiconductors have recently emerged as a remarkable class of plasmonic alternative to conventional noble metals; however, controlled manipulation of their surface plasmon bands toward short wavelengths, especially in the visible light spectrum, still remains a challenge. Here we demonstrate that hydrogen doped given MoO3 and WO3 via a facile H-spillover approach, namely, hydrogen bronzes, exhibit strong localized surface plasmon resonances in the visible light region. Through variation of their stoichiometric compositions, tunable plasmon resonances could be observed in a wide range, which hinge upon the reduction temperatures, metal species, the nature and the size of metal oxide supports in the synthetic H2 reduction process as well as oxidation treatment in the postsynthetic process. Density functional theory calculations unravel that the intercalation of hydrogen atoms into the given host structures yields appreciable delocalized electrons, enabling their plasmonic properties. The plasmonic hybrids show potentials in heterogeneous catalysis, in which visible light irradiation enhanced catalytic performance toward p-nitrophenol reduction relative to dark condition. Our findings provide direct evidence for achieving plasmon resonances in hydrogen doped metal oxide semiconductors, and may allow large-scale applications with low-price and earth-abundant elements.

  20. Solar hydrogen production with semiconductor metal oxides: new directions in experiment and theory.

    PubMed

    Valdés, Álvaro; Brillet, Jeremie; Grätzel, Michael; Gudmundsdóttir, Hildur; Hansen, Heine A; Jónsson, Hannes; Klüpfel, Peter; Kroes, Geert-Jan; Le Formal, Florian; Man, Isabela C; Martins, Rafael S; Nørskov, Jens K; Rossmeisl, Jan; Sivula, Kevin; Vojvodic, Aleksandra; Zäch, Michael

    2012-01-01

    An overview of a collaborative experimental and theoretical effort toward efficient hydrogen production via photoelectrochemical splitting of water into di-hydrogen and di-oxygen is presented here. We present state-of-the-art experimental studies using hematite and TiO(2) functionalized with gold nanoparticles as photoanode materials, and theoretical studies on electro and photo-catalysis of water on a range of metal oxide semiconductor materials, including recently developed implementation of self-interaction corrected energy functionals. PMID:22083224

  1. Complementary metal-oxide-semiconductor compatible 1060 nm photodetector with ultrahigh gain under low bias.

    PubMed

    Hall, David; Li, Baoxia; Liu, Yu-Hsin; Yan, Lujiang; Lo, Yu-Hwa

    2015-10-01

    Falling on the tail of the absorption spectrum of silicon, 1060 nm Si detectors often suffer from low responsivity unless an exceedingly thick absorption layer is used, a design that requires high operation voltage and high purity epitaxial or substrate material. We report an all-silicon 1060 nm detector with ultrahigh gain to allow for low operation voltage (<4  V) and thin (200 nm) effective absorption layer, using the recently discovered cycling excitation process. With 1% external quantum efficiency, a responsivity of 93 A/W was demonstrated in a p/n junction device compatible with the complementary metal-oxide-semiconductor process. PMID:26421551

  2. Total dose effect on soft error rate for dynamic metal-oxide-semiconductor memory cells

    NASA Technical Reports Server (NTRS)

    Benumof, Reuben

    1989-01-01

    A simple model for the soft error rate for dynamic metal-oxide-semiconductor random access memories due to normal galactic radiation was devised and then used to calculate the rate of decrease of the single-event-upset rate with total radiation dose. The computation shows that the decrease in the soft error rate is less than 10 percent per day if the shielding is 0.5 g/sq cm and the spacecraft is in a geosynchronous orbit. The decrease is considerably less in a polar orbiting device.

  3. Wide-band-gap, alkaline-earth-oxide semiconductor and devices utilizing same

    DOEpatents

    Abraham, Marvin M.; Chen, Yok; Kernohan, Robert H.

    1981-01-01

    This invention relates to novel and comparatively inexpensive semiconductor devices utilizing semiconducting alkaline-earth-oxide crystals doped with alkali metal. The semiconducting crystals are produced by a simple and relatively inexpensive process. As a specific example, a high-purity lithium-doped MgO crystal is grown by conventional techniques. The crystal then is heated in an oxygen-containing atmosphere to form many [Li].degree. defects therein, and the resulting defect-rich hot crystal is promptly quenched to render the defects stable at room temperature and temperatures well above the same. Quenching can be effected conveniently by contacting the hot crystal with room-temperature air.

  4. Room-temperature fabrication of light-emitting thin films based on amorphous oxide semiconductor

    NASA Astrophysics Data System (ADS)

    Kim, Junghwan; Miyokawa, Norihiko; Ide, Keisuke; Toda, Yoshitake; Hiramatsu, Hidenori; Hosono, Hideo; Kamiya, Toshio

    2016-01-01

    We propose a light-emitting thin film using an amorphous oxide semiconductor (AOS) because AOS has low defect density even fabricated at room temperature. Eu-doped amorphous In-Ga-Zn-O thin films fabricated at room temperature emitted intense red emission at 614 nm. It is achieved by precise control of oxygen pressure so as to suppress oxygen-deficiency/excess-related defects and free carriers. An electronic structure model is proposed, suggesting that non-radiative process is enhanced mainly by defects near the excited states. AOS would be a promising host for a thin film phosphor applicable to flexible displays as well as to light-emitting transistors.

  5. Reduction method of gate-to-drain capacitance by oxide spacer formation in tunnel field-effect transistor with elevated drain

    NASA Astrophysics Data System (ADS)

    Kwon, Dae Woong; Kim, Jang Hyun; Park, Euyhwan; Lee, Junil; Park, Taehyung; Lee, Ryoongbin; Kim, Sihyun; Park, Byung-Gook

    2016-06-01

    A novel fabrication method is proposed to reduce large gate-to-drain capacitance (C GD) and to improve AC switching characteristics in tunnel field-effect transistor (TFETs) with elevated drain (TFETED). In the proposed method, gate oxide at drain region (GDOX) is selectively formed through oxide deposition and spacer-etch process. Furthermore, the thicknesses of the GDOX are simply controlled by the amount of the oxide deposition and etch. Mixed-mode device and circuit technology computer aided design (TCAD) simulations are performed to verify the effects of the GDOX thickness on DC and AC switching characteristics of a TFETED inverter. As a result, it is found that AC switching characteristics such as output voltage pre-shoot and falling/rising delay are improved with nearly unchanged DC characteristics by thicker GDOX. This improvement is explained successfully by reduced C GD and positive shifted gate voltage (V G) versus C GD curves with the thicker GDOX.

  6. Simulation of Nanoscale Two-Bit Not-And-type Silicon-Oxide-Nitride-Oxide-Silicon Nonvolatile Memory Devices with a Separated Double-Gate Fin Field Effect Transistor Structure Containing Different Tunneling Oxide Thicknesses

    NASA Astrophysics Data System (ADS)

    Oh, Se Woong; Park, Sang Su; Kim, Dong Hun; Kim, Hyun Woo; Kim, Tae Whan

    2009-06-01

    Not-and (NAND)-type silicon-oxide-nitride-oxide-silicon (SONOS) nonvolatile memory (NVM) devices with a separated double-gate (SDG) Fin field effect transistor structure were proposed to reduce the unit cell size of such memory devices and increase their memory density in comparison with that of conventional NVM devices. The proposed memory device consisted of a pair of control gates separated along the length of the Fin channel direction. Each SDG had a different thickness of the tunneling oxide to operate the proposed memory device as a two-bit/cell device. A technology computer-aided design simulation was performed to investigate the program/erase and two-bit characteristics. The simulation results show that the proposed devices can be used to increase the scaling down capability and charge storage density of NAND-type SONOS NVM devices.

  7. Energy Harvesting Thermoelectric Generators Manufactured Using the Complementary Metal Oxide Semiconductor Process

    PubMed Central

    Yang, Ming-Zhi; Wu, Chyan-Chyi; Dai, Ching-Liang; Tsai, Wen-Jung

    2013-01-01

    This paper presents the fabrication and characterization of energy harvesting thermoelectric micro generators using the commercial complementary metal oxide semiconductor (CMOS) process. The micro generator consists of 33 thermocouples in series. Thermocouple materials are p-type and n-type polysilicon since they have a large Seebeck coefficient difference. The output power of the micro generator depends on the temperature difference in the hot and cold parts of the thermocouples. In order to increase this temperature difference, the hot part of the thermocouples is suspended to reduce heat-sinking. The micro generator needs a post-CMOS process to release the suspended structures of hot part, which the post-process includes an anisotropic dry etching to etch the sacrificial oxide layer and an isotropic dry etching to remove the silicon substrate. Experiments show that the output power of the micro generator is 9.4 μW at a temperature difference of 15 K. PMID:23396193

  8. Energy harvesting thermoelectric generators manufactured using the complementary metal oxide semiconductor process.

    PubMed

    Yang, Ming-Zhi; Wu, Chyan-Chyi; Dai, Ching-Liang; Tsai, Wen-Jung

    2013-02-08

    This paper presents the fabrication and characterization of energy harvesting thermoelectric micro generators using the commercial complementary metal oxide semiconductor (CMOS) process. The micro generator consists of 33 thermocouples in series. Thermocouple materials are p-type and n-type polysilicon since they have a large Seebeck coefficient difference. The output power of the micro generator depends on the temperature difference in the hot and cold parts of the thermocouples. In order to increase this temperature difference, the hot part of the thermocouples is suspended to reduce heat-sinking. The micro generator needs a post-CMOS process to release the suspended structures of hot part, which the post-process includes an anisotropic dry etching to etch the sacrificial oxide layer and an isotropic dry etching to remove the silicon substrate. Experiments show that the output power of the micro generator is 9.4 mW at a temperature difference of 15 K.

  9. Energy harvesting thermoelectric generators manufactured using the complementary metal oxide semiconductor process.

    PubMed

    Yang, Ming-Zhi; Wu, Chyan-Chyi; Dai, Ching-Liang; Tsai, Wen-Jung

    2013-01-01

    This paper presents the fabrication and characterization of energy harvesting thermoelectric micro generators using the commercial complementary metal oxide semiconductor (CMOS) process. The micro generator consists of 33 thermocouples in series. Thermocouple materials are p-type and n-type polysilicon since they have a large Seebeck coefficient difference. The output power of the micro generator depends on the temperature difference in the hot and cold parts of the thermocouples. In order to increase this temperature difference, the hot part of the thermocouples is suspended to reduce heat-sinking. The micro generator needs a post-CMOS process to release the suspended structures of hot part, which the post-process includes an anisotropic dry etching to etch the sacrificial oxide layer and an isotropic dry etching to remove the silicon substrate. Experiments show that the output power of the micro generator is 9.4 mW at a temperature difference of 15 K. PMID:23396193

  10. Metal-oxide-semiconductor-compatible ultra-long-range surface plasmon modes

    NASA Astrophysics Data System (ADS)

    Durfee, C. G.; Furtak, T. E.; Collins, R. T.; Hollingsworth, R. E.

    2008-06-01

    Long-range surface plasmons traveling on thin metal films have demonstrated promising potential in subwavelength waveguide applications. In work toward device applications that can leverage existing silicon microelectronics technology, it is of interest to explore the propagation of surface plasmons in a metal-oxide-semiconductor geometry. In such a structure, there is a high refractive index contrast between the semiconductor (n ≈3.5 for silicon) and the insulating oxide (typically n ≈1.5-2.5). However, the introduction of dielectrics with disparate refractive indices is known to strongly affect the guiding properties of surface plasmons. In this paper, we analyze the implications of high index contrast in 1D layered surface plasmon structures. We show that it is possible to introduce a thin dielectric layer with a low refractive index positioned next to the metal without adversely affecting the guiding quality. In fact, such a configuration can dramatically increase the propagation length of the conventional long-range mode. While this study is directed at silicon-compatible waveguides working at telecommunications wavelengths, this configuration has general implications for surface plasmon structure design using other materials and operating at alternative wavelengths.

  11. Trap densities and transport properties of pentacene metal-oxide-semiconductor transistors. I. Analytical modeling of time-dependent characteristics

    NASA Astrophysics Data System (ADS)

    Basile, A. F.; Cramer, T.; Kyndiah, A.; Biscarini, F.; Fraboni, B.

    2014-06-01

    Metal-oxide-semiconductor (MOS) transistors fabricated with pentacene thin films were characterized by temperature-dependent current-voltage (I-V) characteristics, time-dependent current measurements, and admittance spectroscopy. The channel mobility shows almost linear variation with temperature, suggesting that only shallow traps are present in the semiconductor and at the oxide/semiconductor interface. The admittance spectra feature a broad peak, which can be modeled as the sum of a continuous distribution of relaxation times. The activation energy of this peak is comparable to the polaron binding energy in pentacene. The absence of trap signals in the admittance spectra confirmed that both the semiconductor and the oxide/semiconductor interface have negligible density of deep traps, likely owing to the passivation of SiO2 before pentacene growth. Nevertheless, current instabilities were observed in time-dependent current measurements following the application of gate-voltage pulses. The corresponding activation energy matches the energy of a hole trap in SiO2. We show that hole trapping in the oxide can explain both the temperature and the time dependences of the current instabilities observed in pentacene MOS transistors. The combination of these experimental techniques allows us to derive a comprehensive model for charge transport in hybrid architectures where trapping processes occur at various time and length scales.

  12. Electrosprayed Metal Oxide Semiconductor Films for Sensitive and Selective Detection of Hydrogen Sulfide

    PubMed Central

    Ghimbeu, Camelia Matei; Lumbreras, Martine; Schoonman, Joop; Siadat, Maryam

    2009-01-01

    Semiconductor metal oxide films of copper-doped tin oxide (Cu-SnO2), tungsten oxide (WO3) and indium oxide (In2O3) were deposited on a platinum coated alumina substrate employing the electrostatic spray deposition technique (ESD). The morphology studied with scanning electron microscopy (SEM) and atomic force microscopy (AFM) shows porous homogeneous films comprising uniformly distributed aggregates of nano particles. The X-ray diffraction technique (XRD) proves the formation of crystalline phases with no impurities. Besides, the Raman cartographies provided information about the structural homogeneity. Some of the films are highly sensitive to low concentrations of H2S (10 ppm) at low operating temperatures (100 and 200 °C) and the best response in terms of Rair/Rgas is given by Cu-SnO2 films (2500) followed by WO3 (1200) and In2O3 (75). Moreover, all the films exhibit no cross-sensitivity to other reducing (SO2) or oxidizing (NO2) gases. PMID:22291557

  13. Electrosprayed metal oxide semiconductor films for sensitive and selective detection of hydrogen sulfide.

    PubMed

    Ghimbeu, Camelia Matei; Lumbreras, Martine; Schoonman, Joop; Siadat, Maryam

    2009-01-01

    Semiconductor metal oxide films of copper-doped tin oxide (Cu-SnO(2)), tungsten oxide (WO(3)) and indium oxide (In(2)O(3)) were deposited on a platinum coated alumina substrate employing the electrostatic spray deposition technique (ESD). The morphology studied with scanning electron microscopy (SEM) and atomic force microscopy (AFM) shows porous homogeneous films comprising uniformly distributed aggregates of nano particles. The X-ray diffraction technique (XRD) proves the formation of crystalline phases with no impurities. Besides, the Raman cartographies provided information about the structural homogeneity. Some of the films are highly sensitive to low concentrations of H(2)S (10 ppm) at low operating temperatures (100 and 200 °C) and the best response in terms of R(air)/R(gas) is given by Cu-SnO(2) films (2500) followed by WO(3) (1200) and In(2)O(3) (75). Moreover, all the films exhibit no cross-sensitivity to other reducing (SO(2)) or oxidizing (NO(2)) gases. PMID:22291557

  14. Memory effects in a Al/Ti:HfO2/CuPc metal-oxide-semiconductor device

    NASA Astrophysics Data System (ADS)

    Tripathi, Udbhav; Kaur, Ramneek

    2016-05-01

    Metal oxide semiconductor structured organic memory device has been successfully fabricated. Ti doped hafnium oxide (Ti:HfO2) nanoparticles has been fabricated by precipitation method and further calcinated at 800 °C. Copper phthalocyanine, a hole transporting material has been utilized as an organic semiconductor. The electrical properties of the fabricated device have been studied by measuring the current-voltage and capacitance-voltage characteristics. The amount of charge stored in the nanoparticles has been calculated by using flat band condition. This simple approach for fabricating MOS memory device has opens up opportunities for the development of next generation memory devices.

  15. Compound semiconductor native oxide-based technologies for optical and electrical devices grown on gallium arsenide substrates using MOCVD

    NASA Astrophysics Data System (ADS)

    Holmes, Adrian Lawrence

    1999-11-01

    The beginning of the modern microelectronics industry can be traced back to an invention made in 1947 when Bardeen and Brattain created the first semiconductor switch, called a transistor. Several other important discoveries followed; however, two of the more significant were (i) the development of the first planar process using silicon dioxide (SiO2) as a mask for diffusions into silicon by Frosch in 1955, and (ii) the subsequent integration of several transistors in tiny circuits by Kilby in 1958. Due to the superior quality of the SiO2-silicon interface, Si-based metal-oxide-semiconductor (MOS) transistors have primarily been used in integrated circuits. Until recently, compound semiconductors did not have a native oxide of sufficient quality to create similar MOS transistors. In 1990, research performed by Professor Holonyak and his group at the University of Illinois at Urbana-Champaign has led to a high-quality, stable, and insulating native oxide created from aluminum-containing compound semiconductor alloys. This study investigates native oxide films that are formed by the thermal oxidation of AlAs and InAlP epitaxial layers grown lattice-matched on GaAs substrates using metalorganic chemical vapor deposition (MOCVD). The primary goal is to evaluate how these native oxides can help form novel device structures and transistors. To qualify the material properties of these native oxide films, we have used several characterization techniques including photoluminescence, cross-sectional scanning electron microscopy (SEM), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS). Additionally, we have performed leakage current and capacitance-voltage measurements to evaluate the electrical characteristics of the native oxide-semiconductor interface. The kinetics of the thermal oxidation process for both the surface oxidation of InAlP and lateral oxidation of AlAs are studied and contrasted. Aided by this knowledge, we have created a sealed

  16. Instability analysis of charges trapped in the oxide of metal-ultra thin oxide-semiconductor structures

    NASA Astrophysics Data System (ADS)

    Aziz, A.; Kassmi, K.; Maimouni, R.; Olivié, F.; Sarrabayrouse, G.; Martinez, A.

    2005-09-01

    In this paper, we present the theoretical and experimental results of the influence of a charge trapped in ultra-thin oxide of metal/ultra-thin oxide/semiconductor structures (MOS) on the I(Vg) current-voltage characteristics when the conduction is of the Fowler-Nordheim (FN) tunneling type. The charge, which is negative, is trapped near the cathode (metal/oxide interface) after constant current injection by the metal (Vg<0). Of particular interest is the influence on the Δ Vg(Vg) shift over the whole I(Vg) characteristic at high field (greater than the injection field (>12.5 MV/cm)). It is shown that the charge centroid varies linearly with respect to the voltage Vg. The behavior at low field (<12.5 MV/cm) is analyzed in référence A. Aziz, K. Kassmi, Ka. Kassmi, F. Olivié, Semicond. Sci. Technol. 19, 877 (2004) and considers that the trapped charge centroid is fixed. The results obtained make it possible to analyze the influence of the injected charge and the applied field on the centroid position of the trapped charge, and to highlight the charge instability in the ultra-thin oxide of MOS structures.

  17. Combinatorial Approaches for the Identification and Optimization of Oxide Semiconductors for Efficient Solar Photoelectrolysis

    SciTech Connect

    Woodhouse, M.; Parkinson, B.

    2009-01-01

    The cost effective generation of hydrogen with sunlight viawater photoelectrolysis is the critical breakthrough needed to transition the world to a renewable energy based hydrogen economy. A semiconductor based photoelectrolysis system may have cost advantages over using either a photovoltaic cell coupled to an electrolyzer or solar thermochemical cycles for water splitting. Unfortunately there is no known semiconducting material or combination of materials with the electronic properties and stability needed to efficiently photoelectrolyze water. Semiconducting oxides can have the required stability but present theoretical methods are insufficient to a priori identify materials with the required properties. Most likely, the discovered material will be a complex oxide containing many elements whereby each contributes to the required material properties such as light absorption across the solar spectrum, stability and electrocatalytic activity. The large number of possible multicomponent metal oxides, even if only ternary or quaternary materials are considered, points to the use of high-throughput combinatorial methods to discover and optimize candidate materials. In this critical review, we will cover some techniques for the combinatorial production and screening of metal oxides for their ability to efficiently split water with sunlight (88 references).

  18. Edge-tailored graphene oxide nanosheet-based field effect transistors for fast and reversible electronic detection of sulfur dioxide.

    PubMed

    Shen, Fangping; Wang, Dong; Liu, Rui; Pei, Xianfeng; Zhang, Ting; Jin, Jian

    2013-01-21

    Graphene oxide was tailored into GO nanosheets with periodic acid treatment. Interestingly, the latter have a superior sensing performance for the fast and reversible detection of SO(2) compared with the former at room temperature. Its sensing mechanism was proposed from the structural changes of the GO nanosheets during the sensing and recovering processes.

  19. EDITORIAL: Challenges for first-principles based properties of defects in semiconductors and oxides Challenges for first-principles based properties of defects in semiconductors and oxides

    NASA Astrophysics Data System (ADS)

    2009-12-01

    First-principles methods based on density functional theory (DFT) have been the mainstay of theoretical studies of the properties of semiconductor and oxide materials. Despite the tremendous successes of the past few decades, significant challenges remain in adapting these methods for predictive simulations that are quantitatively useful in predicting device behavior. Recent advances in computational capabilities, and improved theoretical methods taking advantage of ever more powerful computer hardware, offer the possibility that computational modeling may finally fulfill the long-sought goal of truly predictive simulations for defect properties. The exciting prospect of using modelling as `virtual experiments' to obtain quantitatively accurate predictions of semiconductor behavior seems tantalizingly close, but challenges still remain, which is evident in the many divergent approaches adopted for the modelling and simulation of various aspects of defect behavior. This special issue consists of papers describing different approaches to the study of defects, and the challenges that remain from the perspective of leading scientists in the field. It includes contributions on the theoretical and computational issues of using density functional methods for defect calculations [Nieminen], treatments to account for finite computational cell effects in periodic defect supercell calculations using analytical constructions [Lany and Zunger], or cell-size extrapolation techniques [Castleton et al], or instead using embedded cluster calculations to model charge-trapping defects [Shluger et al]. This issue also includes a description of the computation of g-tensor and hyperfine splitting for defect centers [Valentin and Pacchione], computation of vibrational properties of impurities from dynamical DFT calculations [Estreicher et al], and the use of DFT supercell calculations to predict charge transition energy levels of intrinsic defects in GaAs [Schultz and von Lilienfeld

  20. Electromagnetic Field Effects in Semiconductor Crystal Growth

    NASA Technical Reports Server (NTRS)

    Dulikravich, George S.

    1996-01-01

    This proposed two-year research project was to involve development of an analytical model, a numerical algorithm for its integration, and a software for the analysis of a solidification process under the influence of electric and magnetic fields in microgravity. Due to the complexity of the analytical model that was developed and its boundary conditions, only a preliminary version of the numerical algorithm was developed while the development of the software package was not completed.

  1. Fabrication of Smooth Patterned Structures of Refractory Metals, Semiconductors, and Oxides via Template Stripping

    PubMed Central

    2013-01-01

    The template-stripping method can yield smooth patterned films without surface contamination. However, the process is typically limited to coinage metals such as silver and gold because other materials cannot be readily stripped from silicon templates due to strong adhesion. Herein, we report a more general template-stripping method that is applicable to a larger variety of materials, including refractory metals, semiconductors, and oxides. To address the adhesion issue, we introduce a thin gold layer between the template and the deposited materials. After peeling off the combined film from the template, the gold layer can be selectively removed via wet etching to reveal a smooth patterned structure of the desired material. Further, we demonstrate template-stripped multilayer structures that have potential applications for photovoltaics and solar absorbers. An entire patterned device, which can include a transparent conductor, semiconductor absorber, and back contact, can be fabricated. Since our approach can also produce many copies of the patterned structure with high fidelity by reusing the template, a low-cost and high-throughput process in micro- and nanofabrication is provided that is useful for electronics, plasmonics, and nanophotonics. PMID:24001174

  2. Interpreting anomalies observed in oxide semiconductor TFTs under negative and positive bias stress

    NASA Astrophysics Data System (ADS)

    Jin, Jong Woo; Nathan, Arokia; Barquinha, Pedro; Pereira, Luís; Fortunato, Elvira; Martins, Rodrigo; Cobb, Brian

    2016-08-01

    Oxide semiconductor thin-film transistors can show anomalous behavior under bias stress. Two types of anomalies are discussed in this paper. The first is the shift in threshold voltage (VTH) in a direction opposite to the applied bias stress, and highly dependent on gate dielectric material. We attribute this to charge trapping/detrapping and charge migration within the gate dielectric. We emphasize the fundamental difference between trapping/detrapping events occurring at the semiconductor/dielectric interface and those occurring at gate/dielectric interface, and show that charge migration is essential to explain the first anomaly. We model charge migration in terms of the non-instantaneous polarization density. The second type of anomaly is negative VTH shift under high positive bias stress, with logarithmic evolution in time. This can be argued as electron-donating reactions involving H2O molecules or derived species, with a reaction rate exponentially accelerated by positive gate bias and exponentially decreased by the number of reactions already occurred.

  3. Fabrication of smooth patterned structures of refractory metals, semiconductors, and oxides via template stripping.

    PubMed

    Park, Jong Hyuk; Nagpal, Prashant; McPeak, Kevin M; Lindquist, Nathan C; Oh, Sang-Hyun; Norris, David J

    2013-10-01

    The template-stripping method can yield smooth patterned films without surface contamination. However, the process is typically limited to coinage metals such as silver and gold because other materials cannot be readily stripped from silicon templates due to strong adhesion. Herein, we report a more general template-stripping method that is applicable to a larger variety of materials, including refractory metals, semiconductors, and oxides. To address the adhesion issue, we introduce a thin gold layer between the template and the deposited materials. After peeling off the combined film from the template, the gold layer can be selectively removed via wet etching to reveal a smooth patterned structure of the desired material. Further, we demonstrate template-stripped multilayer structures that have potential applications for photovoltaics and solar absorbers. An entire patterned device, which can include a transparent conductor, semiconductor absorber, and back contact, can be fabricated. Since our approach can also produce many copies of the patterned structure with high fidelity by reusing the template, a low-cost and high-throughput process in micro- and nanofabrication is provided that is useful for electronics, plasmonics, and nanophotonics.

  4. 3-D perpendicular assembly of single walled carbon nanotubes for complimentary metal oxide semiconductor interconnects.

    PubMed

    Kim, Tae-Hoon; Yilmaz, Cihan; Somu, Sivasubramanian; Busnaina, Ahmed

    2014-05-01

    Due to their superior electrical properties such as high current density and ballistic transport, carbon nanotubes (CNT) are considered as a potential candidate for future Very Large Scale Integration (VLSI) interconnects. However, direct incorporation of CNTs into Complimentary Metal Oxide Semiconductor (CMOS) architecture by conventional chemical vapor deposition (CVD) growth method is problematic since it requires high temperatures that might damage insulators and doped semiconductors in the underlying CMOS circuits. In this paper, we present a directed assembly method to assemble aligned CNTs into pre-patterned vias and perpendicular to the substrate. A dynamic electric field with a static offset is applied to provide the force needed for directing the SWNT assembly. It is also shown that by adjusting assembly parameters the density of the assembled CNTs can be significantly enhanced. This highly scalable directed assembly method is conducted at room temperature and pressure and is accomplished in a few minutes. I-V characterization of the assembled CNTs was conducted using a Zyvex nanomanipulator in a scanning electron microscope (SEM) and the measured value of the resistance is found to be 270 komega s. PMID:24734611

  5. Electrical properties of metal-oxide-semiconductor structures with low-energy Ge-implanted and annealed thin gate oxides

    NASA Astrophysics Data System (ADS)

    Kapetanakis, E.; Normand, P.; Holliger, P.

    2008-03-01

    The electrical characteristics of low-energy (3keV) Ge-implanted and, subsequently, thermal annealed SiO2 layers are investigated through capacitance-voltage (C-V ) and conductance-voltage (G-V) measurements of metal-oxide-semiconductor capacitors. Particular emphasis is placed on the properties of such gate oxides for memory applications. Capacitance measurements at flatband voltage before and after the application of constant voltage stress in the accumulation regime indicate that the charge trapping behavior of the devices undergoes a major change after annealing at temperatures higher than 910°C. The latter change is identified as a relocation of Ge atoms mainly toward the upper portion of the oxide with a significant fraction of them leaving the oxide; a finding in harmony with secondary ion mass spectroscopy analysis. The interface trap density (Dit) for the thin (9-12nm) implanted oxides decreases with increasing annealing temperature, approaching at 950°C the Dit levels in the mid-1010eV-1cm-2 range of the nonimplanted samples. At elevated annealing temperatures (>1000°C), the device C-V characteristics are substantially disturbed. In this case, the presence of electrically active Ge atoms at an extended depth in the substrate modifies the intrinsic electrical properties of the n-Si substrate, lending a p-type conductivity character to the device high-frequency C-V curves. Substrate electrical modification is interpreted through a model that takes into account the formation of a SiO2/Ge-rich-Si /n-Si system. The SiO2/Ge-rich-Si interface presents very low Dit levels as revealed by conductance loss characteristics. The present study suggests that a combination of Ge implantation into SiO2 films and thermal annealing may be exploited in damage-free SiGe epitaxial growth technology based on Ge implantation.

  6. Effects of hole localization on limiting p-type conductivity in oxide and nitride semiconductors

    SciTech Connect

    Lyons, J. L.; Janotti, A.; Van de Walle, C. G.

    2014-01-07

    We examine how hole localization limits the effectiveness of substitutional acceptors in oxide and nitride semiconductors and explain why p-type doping of these materials has proven so difficult. Using hybrid density functional calculations, we find that anion-site substitutional impurities in AlN, GaN, InN, and ZnO lead to atomic-like states that localize on the impurity atom itself. Substitution with cation-site impurities, on the other hand, triggers the formation of polarons that become trapped on nearest-neighbor anions, generally leading to large ionization energies for these acceptors. Unlike shallow effective-mass acceptors, these two types of deep acceptors couple strongly with the lattice, significantly affecting the optical properties and severely limiting prospects for achieving p-type conductivity in these wide-band-gap materials.

  7. High and low threshold P-channel metal oxide semiconductor process and description of microelectronics facility

    NASA Technical Reports Server (NTRS)

    Bouldin, D. L.; Feltner, W. R.; Hollis, B. R.; Routh, D. E.

    1976-01-01

    The fabrication techniques and detail procedures for creating P-channel Metal-Oxide-Semiconductor (P-MOS) integrated circuits at George C. Marshall Space Flight Center (MSFC) are described. Examples of P-MOS integrated circuits fabricated at MSFC together with functional descriptions of each are given. Typical electrical characteristics of high and low threshold P-MOS discrete devices under given conditions are provided. A general description of MSFC design, mask making, packaging, and testing procedures is included. The capabilities described in this report are being utilized in: (1) research and development of new technology, (2) education of individuals in the various disciplines and technologies of the field of microelectronics, and (3) fabrication of many types of specially designed integrated circuits which are not commercially feasible in small quantities for in-house research and development programs.

  8. Photoelectrochemical water splitting enhanced by self-assembled metal nanopillars embedded in an oxide semiconductor photoelectrode

    NASA Astrophysics Data System (ADS)

    Kawasaki, Seiji; Takahashi, Ryota; Yamamoto, Takahisa; Kobayashi, Masaki; Kumigashira, Hiroshi; Yoshinobu, Jun; Komori, Fumio; Kudo, Akihiko; Lippmaa, Mikk

    2016-06-01

    Production of chemical fuels by direct solar energy conversion in a photoelectrochemical cell is of great practical interest for developing a sustainable energy system. Various nanoscale designs such as nanowires, nanotubes, heterostructures and nanocomposites have been explored to increase the energy conversion efficiency of photoelectrochemical water splitting. Here we demonstrate a self-organized nanocomposite material concept for enhancing the efficiency of photocarrier separation and electrochemical energy conversion. Mechanically robust photoelectrodes are formed by embedding self-assembled metal nanopillars in a semiconductor thin film, forming tubular Schottky junctions around each pillar. The photocarrier transport efficiency is strongly enhanced in the Schottky space charge regions while the pillars provide an efficient charge extraction path. Ir-doped SrTiO3 with embedded iridium metal nanopillars shows good operational stability in a water oxidation reaction and achieves over 80% utilization of photogenerated carriers under visible light in the 400- to 600-nm wavelength range.

  9. Implementation of Surface Acoustic Wave Vapor Sensor Using Complementary Metal-Oxide-Semiconductor Amplifiers

    NASA Astrophysics Data System (ADS)

    Chiu, Chia-Sung; Chang, Ching-Chun; Ku, Chia-Lin; Peng, Kang-Ming; Jeng, Erik S.; Chen, Wen-Lin; Huang, Guo-Wei; Wu, Lin-Kun

    2009-04-01

    A surface acoustic wave (SAW) vapor sensor is presented in this work. A SAW delay line oscillator on quartz substrate with the high gain complementary metal-oxide-semiconductor (CMOS) amplifier using a two-poly-two-metal (2P2M) 0.35 µm process was designed. The gain of the CMOS amplifier and its total power consumption are 20 dB and 70 mW, respectively. The achieved phase noise of this SAW oscillator is -150 dBc/Hz at 100 kHz offset. The sensing is successfully demonstrated by a thin poly(epichlorohydrin) (PECH) polymer film on a SAW oscillator with alcohol vapor. This two-in-one sensor unit includes the SAW device and the CMOS amplifier provides designers with comprehensive model for using these components for sensor circuit fabrication. Furthermore it will be promising for future chemical and biological sensing applications.

  10. Photoelectrochemical water splitting enhanced by self-assembled metal nanopillars embedded in an oxide semiconductor photoelectrode

    PubMed Central

    Kawasaki, Seiji; Takahashi, Ryota; Yamamoto, Takahisa; Kobayashi, Masaki; Kumigashira, Hiroshi; Yoshinobu, Jun; Komori, Fumio; Kudo, Akihiko; Lippmaa, Mikk

    2016-01-01

    Production of chemical fuels by direct solar energy conversion in a photoelectrochemical cell is of great practical interest for developing a sustainable energy system. Various nanoscale designs such as nanowires, nanotubes, heterostructures and nanocomposites have been explored to increase the energy conversion efficiency of photoelectrochemical water splitting. Here we demonstrate a self-organized nanocomposite material concept for enhancing the efficiency of photocarrier separation and electrochemical energy conversion. Mechanically robust photoelectrodes are formed by embedding self-assembled metal nanopillars in a semiconductor thin film, forming tubular Schottky junctions around each pillar. The photocarrier transport efficiency is strongly enhanced in the Schottky space charge regions while the pillars provide an efficient charge extraction path. Ir-doped SrTiO3 with embedded iridium metal nanopillars shows good operational stability in a water oxidation reaction and achieves over 80% utilization of photogenerated carriers under visible light in the 400- to 600-nm wavelength range. PMID:27255209

  11. Impedance analysis of Al2O3/H-terminated diamond metal-oxide-semiconductor structures

    NASA Astrophysics Data System (ADS)

    Liao, Meiyong; Liu, Jiangwei; Sang, Liwen; Coathup, David; Li, Jiangling; Imura, Masataka; Koide, Yasuo; Ye, Haitao

    2015-02-01

    Impedance spectroscopy (IS) analysis is carried out to investigate the electrical properties of the metal-oxide-semiconductor (MOS) structure fabricated on hydrogen-terminated single crystal diamond. The low-temperature atomic layer deposition Al2O3 is employed as the insulator in the MOS structure. By numerically analysing the impedance of the MOS structure at various biases, the equivalent circuit of the diamond MOS structure is derived, which is composed of two parallel capacitive and resistance pairs, in series connection with both resistance and inductance. The two capacitive components are resulted from the insulator, the hydrogenated-diamond surface, and their interface. The physical parameters such as the insulator capacitance are obtained, circumventing the series resistance and inductance effect. By comparing the IS and capacitance-voltage measurements, the frequency dispersion of the capacitance-voltage characteristic is discussed.

  12. Flexible complementary metal oxide semiconductor microelectrode arrays with applications in single cell characterization

    NASA Astrophysics Data System (ADS)

    Pajouhi, H.; Jou, A. Y.; Jain, R.; Ziabari, A.; Shakouri, A.; Savran, C. A.; Mohammadi, S.

    2015-11-01

    A highly flexible microelectrode array with an embedded complementary metal oxide semiconductor (CMOS) instrumentation amplifier suitable for sensing surfaces of biological entities is developed. The array is based on ultrathin CMOS islands that are thermally isolated from each other and are interconnected by meandered nano-scale wires that can adapt to cellular surfaces with micro-scale curvatures. CMOS temperature sensors are placed in the islands and are optimally biased to have high temperature sensitivity. While no live cell thermometry is conducted, a measured temperature sensitivity of 0.15 °C in the temperature range of 35 to 40 °C is achieved by utilizing a low noise CMOS lock-in amplifier implemented in the same technology. The monolithic nature of CMOS sensors and amplifier circuits and their versatile flexible interconnecting wires overcome the sensitivity and yield limitations of microelectrode arrays fabricated in competing technologies.

  13. Control of Nanostructures and Interfaces of Metal Oxide Semiconductors for Quantum-Dots-Sensitized Solar Cells.

    PubMed

    Tian, Jianjun; Cao, Guozhong

    2015-05-21

    Nanostructured metal oxide semiconductors (MOS), such as TiO2 and ZnO, have been regarded as an attractive material for the quantum dots sensitized solar cells (QDSCs), owing to their large specific surface area for loading a large amount of quantum dots (QDs) and strong scattering effect for capturing a sufficient fraction of photons. However, the large surface area of such nanostructures also provides easy pathways for charge recombination, and surface defects and connections between adjacent nanoparticles may retard effective charge injection and charge transport, leading to a loss of power conversion efficiency. Introduction of the surface modification for MOS or QDs has been thought an effective approach to improve the performance of QDSC. In this paper, the recent advances in the control of nanostructures and interfaces in QDSCs and prospects for the further development with higher power conversion efficiency (PCE) have been discussed. PMID:26263261

  14. Photoelectrochemical water splitting enhanced by self-assembled metal nanopillars embedded in an oxide semiconductor photoelectrode.

    PubMed

    Kawasaki, Seiji; Takahashi, Ryota; Yamamoto, Takahisa; Kobayashi, Masaki; Kumigashira, Hiroshi; Yoshinobu, Jun; Komori, Fumio; Kudo, Akihiko; Lippmaa, Mikk

    2016-01-01

    Production of chemical fuels by direct solar energy conversion in a photoelectrochemical cell is of great practical interest for developing a sustainable energy system. Various nanoscale designs such as nanowires, nanotubes, heterostructures and nanocomposites have been explored to increase the energy conversion efficiency of photoelectrochemical water splitting. Here we demonstrate a self-organized nanocomposite material concept for enhancing the efficiency of photocarrier separation and electrochemical energy conversion. Mechanically robust photoelectrodes are formed by embedding self-assembled metal nanopillars in a semiconductor thin film, forming tubular Schottky junctions around each pillar. The photocarrier transport efficiency is strongly enhanced in the Schottky space charge regions while the pillars provide an efficient charge extraction path. Ir-doped SrTiO3 with embedded iridium metal nanopillars shows good operational stability in a water oxidation reaction and achieves over 80% utilization of photogenerated carriers under visible light in the 400- to 600-nm wavelength range. PMID:27255209

  15. High-Performance WSe2 Complementary Metal Oxide Semiconductor Technology and Integrated Circuits.

    PubMed

    Yu, Lili; Zubair, Ahmad; Santos, Elton J G; Zhang, Xu; Lin, Yuxuan; Zhang, Yuhao; Palacios, Tomás

    2015-08-12

    Because of their extraordinary structural and electrical properties, two-dimensional materials are currently being pursued for applications such as thin-film transistors and integrated circuit. One of the main challenges that still needs to be overcome for these applications is the fabrication of air-stable transistors with industry-compatible complementary metal oxide semiconductor (CMOS) technology. In this work, we experimentally demonstrate a novel high performance air-stable WSe2 CMOS technology with almost ideal voltage transfer characteristic, full logic swing and high noise margin with different supply voltages. More importantly, the inverter shows large voltage gain (∼38) and small static power (picowatts), paving the way for low power electronic system in 2D materials.

  16. Interfacial oxide re-growth in thin film metal oxide III-V semiconductor systems

    SciTech Connect

    McDonnell, S.; Dong, H.; Hawkins, J. M.; Brennan, B.; Milojevic, M.; Aguirre-Tostado, F. S.; Zhernokletov, D. M.; Hinkle, C. L.; Kim, J.; Wallace, R. M.

    2012-04-02

    The Al{sub 2}O{sub 3}/GaAs and HfO{sub 2}/GaAs interfaces after atomic layer deposition are studied using in situ monochromatic x-ray photoelectron spectroscopy. Samples are deliberately exposed to atmospheric conditions and interfacial oxide re-growth is observed. The extent of this re-growth is found to depend on the dielectric material and the exposure temperature. Comparisons with previous studies show that ex situ characterization can result in misleading conclusions about the interface reactions occurring during the metal oxide deposition process.

  17. Geometrical study of nanoscale field effect diodes

    NASA Astrophysics Data System (ADS)

    Manavizadeh, Negin; Raissi, Farshid; Asl Soleimani, Ebrahim; Pourfath, Mahdi

    2012-04-01

    In this paper, the previously proposed side-contacted field effect diode (FED) is carefully studied and its characteristic is compared against that of a modified FED and a metal oxide semiconductor field effect transistor (MOSFET). The influences of the body thickness, each gate length and access resistance are investigated. The figures of merit including intrinsic gate delay time and energy-delay product, which represent the speed and switching energy of the device, respectively, are studied. Our results highlight that FEDs are good candidates for obtaining a high Ion/Ioff ratio with a relatively short delay time compared to conventional FEDs and MOSFETs. We show that by a careful scaling of the source-drain region, the access resistance can be optimized. We demonstrate that a well-tempered device with a high switching response and a lower energy consumption can be achieved with a 30 nm body thickness, 85 nm source-drain length and a drain gate length longer than the source gate length.

  18. Parameters affecting the accuracy of oxide thickness prediction in thin metal-oxide-semiconductor structures

    NASA Astrophysics Data System (ADS)

    Mohaidat, J. M.; Ahmad-Bitar, Riyad N.

    2004-01-01

    On the basis of the solution of the time dependent Schrödinger equation within the framework of the effective mass theory, a complete quantum mechanical electron tunneling through a biased square potential model with abrupt interfaces was deduced. Barriers of 3 eV height and widths up to 140 Å were investigated. Current density-voltage ( J- V) curves were computed for Al/SiO 2/ n+Si structure. The computed J- V curves exhibited oscillations at applied voltages above (Fowler-Nordheim tunneling) and below (direct tunneling) 3 V. For oxide thickness estimation, the position of the oscillation extrema from this quantum mechanical model were fitted to a wave interference formula and showed excellent agreement for oxide layer widths less than 50 Å. However, a systematic deviation appeared for layers larger than 50 Å. We show that the electron energy distribution at the injection layer and the electron effective mass on layers other than the oxide layer are important parameters for accurate oxide thickness estimation.

  19. Explicit drain current model of junctionless double-gate field-effect transistors

    NASA Astrophysics Data System (ADS)

    Yesayan, Ashkhen; Prégaldiny, Fabien; Sallese, Jean-Michel

    2013-11-01

    This paper presents an explicit drain current model for the junctionless double-gate metal-oxide-semiconductor field-effect transistor. Analytical relationships for the channel charge densities and for the drain current are derived as explicit functions of applied terminal voltages and structural parameters. The model is validated with 2D numerical simulations for a large range of channel thicknesses and is found to be very accurate for doping densities exceeding 1018 cm-3, which are actually used for such devices.

  20. Ti-Doped Indium Tin Oxide Thin Films for Transparent Field-Effect Transistors: Control of Charge-Carrier Density and Crystalline Structure

    SciTech Connect

    J Kim; K Ji; M Jang; H Yang; R Choi; J Jeong

    2011-12-31

    Indium tin oxide (ITO) films are representative transparent conducting oxide media for organic light-emitting diodes, liquid crystal displays, and solar cell applications. Extending the utility of ITO films from passive electrodes to active channel layers in transparent field-effect transistors (FETs), however, has been largely limited because of the materials' high carrier density (>1 x 10{sup 20} cm{sup 03}), wide band gap, and polycrystalline structure. Here, we demonstrate that control over the cation composition in ITO-based oxide films via solid doping of titanium (Ti) can optimize the carrier concentration and suppress film crystallization. On 120 nm thick SiO{sub 2}/Mo (200 nm)/glass substrates, transparent n-type FETs prepared with 4 at % Ti-doped ITO films and fabricated via the cosputtering of ITO and TiO{sub 2} exhibited high electron mobilities of 13.4 cm{sup 2} V{sup -1} s{sup -1}, a low subthreshold gate swing of 0.25 V decade{sup -1}, and a high I{sub on}/I{sub off} ratio of >1 x 10{sup 8}.

  1. Permanent optical doping of amorphous metal oxide semiconductors by deep ultraviolet irradiation at room temperature

    SciTech Connect

    Seo, Hyungtak; Cho, Young-Je; Bobade, Santosh M.; Park, Kyoung-Youn; Choi, Duck-Kyun; Kim, Jinwoo; Lee, Jaegab

    2010-05-31

    We report an investigation of two photon ultraviolet (UV) irradiation induced permanent n-type doping of amorphous InGaZnO (a-IGZO) at room temperature. The photoinduced excess electrons were donated to change the Fermi-level to a conduction band edge under the UV irradiation, owing to the hole scavenging process at the oxide interface. The use of optically n-doped a-IGZO channel increased the carrier density to approx10{sup 18} cm{sup -3} from the background level of 10{sup 16} cm{sup -3}, as well as the comprehensive enhancement upon UV irradiation of a-IGZO thin film transistor parameters, such as an on-off current ratio at approx10{sup 8} and field-effect mobility at 22.7 cm{sup 2}/V s.

  2. Self-correction of field-effect transistor characteristics in the mode of spontaneous space-charge ion polarization of gate oxide

    SciTech Connect

    Zhdan, A. G.; Naryshkina, V. G.; Chucheva, G. V.

    2009-05-15

    Spontaneous space-charge ion polarization of gate oxide in the inversion n-channel silicon field-effect transistor was accomplished in the mode of its Joule heating by the drain current I{sub d}. The transistor characteristics measured at room temperature (T{sub r}) before and after thermal-field treatment show that positive ion (Na{sup +}) localization near the SiO{sub 2}/Si interface is accompanied by an increase in the effective electron mobility (by a factor of {approx} 2.3), steepness, I{sub d}, and by a small decrease in the threshold voltage ({delta}V{sub th} = 0.58 V). At T = T{sub r}, the modified transistor characteristics are retained for months; they can be easily and predictably varied by changing I{sub d} and heating duration.

  3. Electronic Olfactory Sensor Based on A. mellifera Odorant-Binding Protein 14 on a Reduced Graphene Oxide Field-Effect Transistor.

    PubMed

    Larisika, Melanie; Kotlowski, Caroline; Steininger, Christoph; Mastrogiacomo, Rosa; Pelosi, Paolo; Schütz, Stefan; Peteu, Serban F; Kleber, Christoph; Reiner-Rozman, Ciril; Nowak, Christoph; Knoll, Wolfgang

    2015-11-01

    An olfactory biosensor based on a reduced graphene oxide (rGO) field-effect transistor (FET), functionalized by the odorant-binding protein 14 (OBP14) from the honey bee (Apis mellifera) has been designed for the in situ and real-time monitoring of a broad spectrum of odorants in aqueous solutions known to be attractants for bees. The electrical measurements of the binding of all tested odorants are shown to follow the Langmuir model for ligand-receptor interactions. The results demonstrate that OBP14 is able to bind odorants even after immobilization on rGO and can discriminate between ligands binding within a range of dissociation constants from K(d)=4 μM to K(d)=3.3 mM. The strongest ligands, such as homovanillic acid, eugenol, and methyl vanillate all contain a hydroxy group which is apparently important for the strong interaction with the protein. PMID:26364873

  4. The understanding on the evolution of stress-induced gate leakage in high-k dielectric metal-oxide-field-effect transistor by random-telegraph-noise measurement

    NASA Astrophysics Data System (ADS)

    Hsieh, E. R.; Chung, Steve S.

    2015-12-01

    The evolution of gate-current leakage path has been observed and depicted by RTN signals on metal-oxide-silicon field effect transistor with high-k gate dielectric. An experimental method based on gate-current random telegraph noise (Ig-RTN) technique was developed to observe the formation of gate-leakage path for the device under certain electrical stress, such as Bias Temperature Instability. The results show that the evolution of gate-current path consists of three stages. In the beginning, only direct-tunnelling gate current and discrete traps inducing Ig-RTN are observed; in the middle stage, interaction between traps and the percolation paths presents a multi-level gate-current variation, and finally two different patterns of the hard or soft breakdown path can be identified. These observations provide us a better understanding of the gate-leakage and its impact on the device reliability.

  5. Unipolar resistive switching in metal oxide/organic semiconductor non-volatile memories as a critical phenomenon

    SciTech Connect

    Bory, Benjamin F.; Meskers, Stefan C. J.; Rocha, Paulo R. F.; Gomes, Henrique L.; Leeuw, Dago M. de

    2015-11-28

    Diodes incorporating a bilayer of an organic semiconductor and a wide bandgap metal oxide can show unipolar, non-volatile memory behavior after electroforming. The prolonged bias voltage stress induces defects in the metal oxide with an areal density exceeding 10{sup 17 }m{sup −2}. We explain the electrical bistability by the coexistence of two thermodynamically stable phases at the interface between an organic semiconductor and metal oxide. One phase contains mainly ionized defects and has a low work function, while the other phase has mainly neutral defects and a high work function. In the diodes, domains of the phase with a low work function constitute current filaments. The phase composition and critical temperature are derived from a 2D Ising model as a function of chemical potential. The model predicts filamentary conduction exhibiting a negative differential resistance and nonvolatile memory behavior. The model is expected to be generally applicable to any bilayer system that shows unipolar resistive switching.

  6. Free-carrier effects on electronic and optical properties of binary oxide semiconductors

    NASA Astrophysics Data System (ADS)

    Schleife, Andre; Roedl, Claudia

    2014-03-01

    While there is persistent interest in oxides, e.g., for semiconductor technology or optoelectronics, it remains difficult to achieve n-type and p-type doping of one and the same material. At the same time, higher and higher conductivities are reported for both types of doping individually. Hence, it is important to understand the corresponding influence of free carriers on electronic structure and optical properties. Modern electronic-structure calculations, based on hybrid exchange-correlation functionals and the GW approximation, were performed for n-type (ZnO, CdO, SnO2) and p-type (MnO, NiO) binary oxides. We use these results to analyze the influence of free carriers by computing contributions that increase (Burstein-Moss shift) or reduce (electron-electron interaction and ionized-impurity scattering) the band gaps as a function of free-carrier concentration. We also compute the carrier-concentration dependence of effective electron and hole masses and compare to experimental data. For n-type ZnO we compute optical absorption spectra by means of a recent extension of the Bethe-Salpeter framework. This allows us to take excitonic effects as well as the influence of free carriers on the electron-hole interaction into account. Prepared by LLNL under Contract DE-AC52-07NA27344.

  7. Metal oxide semiconductors for dye- and quantum-dot-sensitized solar cells.

    PubMed

    Concina, Isabella; Vomiero, Alberto

    2015-04-17

    This Review provides a brief summary of the most recent research developments in the synthesis and application of nanostructured metal oxide semiconductors for dye sensitized and quantum dot sensitized solar cells. In these devices, the wide bandgap semiconducting oxide acts as the photoanode, which provides the scaffold for light harvesters (either dye molecules or quantum dots) and electron collection. For this reason, proper tailoring of the optical and electronic properties of the photoanode can significantly boost the functionalities of the operating device. Optimization of the functional properties relies with modulation of the shape and structure of the photoanode, as well as on application of different materials (TiO2, ZnO, SnO2) and/or composite systems, which allow fine tuning of electronic band structure. This aspect is critical because it determines exciton and charge dynamics in the photoelectrochemical system and is strictly connected to the photoconversion efficiency of the solar cell. The different strategies for increasing light harvesting and charge collection, inhibiting charge losses due to recombination phenomena, are reviewed thoroughly, highlighting the benefits of proper photoanode preparation, and its crucial role in the development of high efficiency dye sensitized and quantum dot sensitized solar cells.

  8. Alkyl monolayer passivated metal-semiconductor diodes: 2: Comparison with native silicon oxide.

    PubMed

    Liu, Yong-Jun; Yu, Hua-Zhong

    2003-04-14

    To understand the electrical properties at passivated metal-semiconductor interfaces, two types of mercury-insulator-silicon (n-type) junctions, Hg\\C10H21-Si and Hg\\SiO2-Si, were fabricated and their current-voltage and capacitance-voltage characteristics compared. Both of them exhibited near-ideal rectifying characteristics with an excellent saturation current at reverse bias, which is in contrast to the previously reported ohmic behavior of an unmodified mercury-silicon junction. The experimental results also indicated that the n-decyl monolayer passivated junction possesses a higher effective barrier height, a lower ideality factor (that is, closer to unity), and better reproducibility than that of native silicon oxide. In addition, the dopant density and build-in potential, extracted from capacitance-voltage measurements of these passivated mercury-silicon junctions, revealed that alkyl monolayer derivatization does not alter the intrinsic properties of the silicon substrate. The calculated surface state density at the alkyl monolayer\\silicon interface is lower than that of the silicon oxide\\silicon interface. The present study increases the possibility of using advanced organic materials as ultrathin insulator layers for miniaturized, silicon-based microelectronic devices.

  9. Achievement of a high-mobility FET with a cloud-aligned composite oxide semiconductor

    NASA Astrophysics Data System (ADS)

    Yamazaki, Shunpei; Shima, Yukinori; Hosaka, Yasuharu; Okazaki, Kenichi; Koezuka, Junichi

    2016-11-01

    We have recently discovered that films of a widely used In–Ga–Zn oxide (IGZO) with \\text{In}:\\text{Ga}:\\text{Zn} = 1:1:1 have different material composition states when sputter-deposited under different conditions using the same polycrystalline IGZO target. Significant improvements in on-state current and mobility (as high as 40 cm2·V‑1·s‑1) are obtained. The results of local composition analysis indicate that the deposited film is not composed of any known homogeneous IGZO compound and that the components of this film are separated into two types of nanoparticle regions: one type is composed mainly of GaO x and GaZnO x , which contribute to on/off (switching) characteristics, and the other is composed mainly of InO x and InZnO x , which contribute to on-state characteristics. These regions constitute a new type of oxide semiconductor (OS) film. The nanoparticles with a blurry boundary extend like a cloud, probably complementing one another. We consider that this OS film has a novel composition, which can be described as a “cloud-aligned composite OS” (CAC-OS).

  10. Impact of carbon and nitrogen on gate dielectrics in metal-oxide-semiconductor devices

    NASA Astrophysics Data System (ADS)

    Choi, Minseok; Lyons, John; Janotti, Anderson; van de Walle, Chris

    2013-03-01

    Al2O3 and HfO2 are used as alternative gate oxides in CMOS technology. Promising results have been achieved with Al2O3/III-V and HfO2/Si MOS structures, which exhibit relatively low densities of interface states. However, the presence of charge traps and fixed-charge centers near the oxide/semiconductor interface still poses serious limitations in device performance. Native point defects are usually proposed as an explanation; unintentional incorporation of impurities in the gate dielectric during the deposition process has so far received less attention. Using first-principles calculations based on hybrid functionals we investigate the effects of carbon and nitrogen impurities in Al2O3 and HfO2. By analyzing the position of the impurity levels with respect to the III-V and Si band edges, we determine if these impurities can act as charge traps or sources of fixed charge. Our results show that carbon can act as a charge trap and lead to leakage current through the gate dielectric. Nitrogen can act as a source of negative fixed charge, but may be effective in alleviating the problem of charge traps and fixed charges associated with Al, Hf, and O vacancies. This work was supported by the ONR DEFINE MURI program.

  11. A normally-off microcontroller unit with an 85% power overhead reduction based on crystalline indium gallium zinc oxide field effect transistors

    NASA Astrophysics Data System (ADS)

    Ohshima, Kazuaki; Kobayashi, Hidetomo; Nishijima, Tatsuji; Yoneda, Seiichi; Tomatsu, Hiroyuki; Maeda, Shuhei; Tsukida, Kazuki; Takahashi, Kei; Sato, Takehisa; Watanabe, Kazunori; Yamamoto, Ro; Kozuma, Munehiro; Aoki, Takeshi; Yamade, Naoto; Ieda, Yoshinori; Miyairi, Hidekazu; Atsumi, Tomoaki; Shionoiri, Yutaka; Kato, Kiyoshi; Maehashi, Yukio; Koyama, Jun; Yamazaki, Shunpei

    2014-01-01

    A low-power normally-off microcontroller unit (NMCU) having state-retention flip-flops (SRFFs) using a c-axis aligned crystalline oxide semiconductor (CAAC-OS) such as indium gallium zinc oxide (IGZO) transistors and employing a distributed backup and recovery method (distributed method) is fabricated. Compared to an NMCU employing a centralized backup and recovery method (centralized method), the NMCU employing the distributed method can be powered off approximately 75 µs earlier after main processing and can start the main processing approximately 75 µs earlier after power-on. The NMCU employing the distributed method can reduce power overhead by approximately 85% and power consumption by approximately 18% compared to the NMCU employing the centralized method. The NMCU employing the distributed method can retain data even when it is powered off, can back up data at high speed, and can start effective processing immediately after power-on. The NMCU could be applied to a low-power MCU.

  12. Electron-beam-enhanced oxidation processes in II-VI compound semiconductors observed by high-resolution electron microscopy

    SciTech Connect

    Thangaraj, N.; Wessels, B.W.

    1990-02-01

    Enhanced oxidation of ZnS and ZnSe semiconductor surfaces has been observed in situ during electron irradiation in a high-resolution electron microscope. The phase present at the surface region has been identified as ZnO by optical diffractogram and selected area electron diffraction techniques. For ZnS oxidation, both hexagonal ZnO having a random orientation and cubic ZnO in perfect epitaxial relationship with the bulk ZnS were observed. Enhanced oxidation of ZnSe to ZnO has also been observed under electron beam irradiation. However, only the hexagonal form was observed. The oxidation rates for both ZnS and ZnSe depended on electron flux but was independent of orientation. A model in which the oxidation process is limited by diffusion through the oxide film is proposed. By electron irradiation the diffusion rate is enhanced presumably by a nonthermal process.

  13. An electric detection of immunoglobulin G in the enzyme-linked immunosorbent assay using an indium oxide nanoparticle ion-sensitive field-effect transistor

    NASA Astrophysics Data System (ADS)

    Lee, Dongjin; Cui, Tianhong

    2012-01-01

    Semiconducting nanoparticle ion-sensitive field-effect transistors (ISFETs) are used to detect immunoglobulin G (IgG) in the conventional enzyme-linked immunosorbent assay (ELISA). Indium oxide and silica nanoparticles were layer-by-layer self-assembled with the oppositely charged polyelectrolyte as the electrochemical transducer and antibody immobilization site, respectively. The assay was conducted on a novel platform of indium oxide nanoparticle ISFETs, where the electric signals are generated in response to the concentration of target IgG using the labeled detecting antibody. The sandwiched ELISA structure catalyzed the conversion of the acidic substrate into neutral substance with the aid of horseradish peroxidase. The pH change in the substrate solution was detected by nanoparticle ISFETs. Normal rabbit IgG was used as a model antigen whose detection limit of 0.04 ng ml-1 was found. The facile electric detection in the conventional assay through the semiconducting nanoparticle ISFET has potential applications as a point-of-care detection or a sensing element in a lab-on-a-chip system.

  14. Low-Temperature Solution Processing of Amorphous Metal Oxide Semiconductors for High-Performance Thin-Film Transistors

    NASA Astrophysics Data System (ADS)

    Hennek, Jonathan W.

    The growing field of large-area flexible electronics presents the need for amorphous materials with electrical performances superior to amorphous hydrogenated silicon (a-Si:H). Metal oxide semiconductors show great promise in thin film transistors (TFTs) due to their high electron mobility (micro, 1--100 cm2V-1s-1), mechanical flexibility, and electrical stability. However, most oxide semiconductor fabrication still relies on expensive, inflexible and energy intensive vacuum deposition methods. To overcome these limitations, my thesis work has focused on developing low-temperature solution processing routes to functional metal oxide materials. In Chapter 2, we demonstrate an optimized "ink" and printing process for inkjet patterning of amorphous indium gallium zinc oxide (a-IGZO) and investigate the effects of device structure on derived electron mobility. Bottom-gate top-contact (BGTC) TFTs are fabricated and shown to exhibit electron mobilities comparable to a-Si:H. Furthermore, a record micro of 2.5 cm 2V-1s-1 is demonstrated for bottom-gate bottom-contact (BGBC) TFTs. The mechanism underlying such impressive performance is investigated using transmission line techniques, and it is shown that the semiconductor-source/drain electrode interface contact resistance is nearly an order of magnitude lower for BGBC transistors versus BGTC devices. In Chapter 3, we report the implementation of amorphous indium yttrium oxide (a-IYO) as a TFT semiconductor for the first time. Amorphous and polycrystalline IYO films are grown via a low-temperature solution process utilizing exothermic "combustion" precursors. Precursor transformation and the IYO films are analyzed by DTA, TGA, XRD, AFM, XPS, and optical transmission, revealing efficient conversion to the metal-oxide lattice, and smooth, transparent films. a-IYO TFTs fabricated with a hybrid nanodielectric exhibit impressive electron mobilities of 7.3 cm2V-1s-1 (Tanneal = 300 °C) and 5.0 cm2V-1s -1 (Tanneal = 250 °C) for 2

  15. Field-effect P-N junction

    DOEpatents

    Regan, William; Zettl, Alexander

    2015-05-05

    This disclosure provides systems, methods, and apparatus related to field-effect p-n junctions. In one aspect, a device includes an ohmic contact, a semiconductor layer disposed on the ohmic contact, at least one rectifying contact disposed on the semiconductor layer, a gate including a layer disposed on the at least one rectifying contact and the semiconductor layer and a gate contact disposed on the layer. A lateral width of the rectifying contact is less than a semiconductor depletion width of the semiconductor layer. The gate contact is electrically connected to the ohmic contact to create a self-gating feedback loop that is configured to maintain a gate electric field of the gate.

  16. ZrO2 on GaN metal oxide semiconductor capacitors via plasma assisted atomic layer deposition

    NASA Astrophysics Data System (ADS)

    von Hauff, P.; Afshar, A.; Foroughi-Abari, A.; Bothe, K.; Cadien, K.; Barlage, D.

    2013-06-01

    ZrO2 has been deposited on GaN by Atomic Layer Deposition. Multiple Metal-Oxide-Semiconductor Capacitors with 4.4 nm, 5.4 nm, and 8.5 nm of ZrO2 oxide were fabricated with Cr electrodes. Capacitance measurements produce capacitance densities as high as 3.8 μF/cm2. Current densities of 0.88 A/cm2 at 1 V for the 4.4 nm oxides and hysteresis values of less than 6 mV were observed for the 5.8 nm oxide, indicating an interfacial Dit not greater than 6.4 × 1010 cm2. Temperature dependent current measurements revealed no signature Poole-Frankel component. Comprehensive assessment of these measurements indicates a low defect density oxide formed on GaN with a low number of interface states.

  17. Estimation of near-interface oxide trap density at SiO2/SiC metal-oxide-semiconductor interfaces by transient capacitance measurements at various temperatures

    NASA Astrophysics Data System (ADS)

    Fujino, Yuki; Kita, Koji

    2016-08-01

    A method for estimating near-interface oxide trap density in silicon carbide metal-oxide-semiconductor (MOS) capacitors by transient capacitance measurements was investigated. The fitting of the transient capacitance characteristics measured at room and low temperatures to a simple model describing the de-trapping process enables us to characterize the responses of the traps at various distances from the interface. The distribution of the trap locations in the oxide and that of response times were taken into account in this fitting. This method was applied to MOS-capacitor samples to show the significant reduction in interface state density by tuning the thermal oxidation conditions. It was found that the density of the oxide traps, especially in the spatially shallow region within several angstroms from the interface, is sensitive to thermal oxide growth conditions.

  18. Silicon Metal-oxide-semiconductor Quantum Dots for Single-electron Pumping

    PubMed Central

    Rossi, Alessandro; Tanttu, Tuomo; Hudson, Fay E.; Sun, Yuxin; Möttönen, Mikko; Dzurak, Andrew S.

    2015-01-01

    As mass-produced silicon transistors have reached the nano-scale, their behavior and performances are increasingly affected, and often deteriorated, by quantum mechanical effects such as tunneling through single dopants, scattering via interface defects, and discrete trap charge states. However, progress in silicon technology has shown that these phenomena can be harnessed and exploited for a new class of quantum-based electronics. Among others, multi-layer-gated silicon metal-oxide-semiconductor (MOS) technology can be used to control single charge or spin confined in electrostatically-defined quantum dots (QD). These QD-based devices are an excellent platform for quantum computing applications and, recently, it has been demonstrated that they can also be used as single-electron pumps, which are accurate sources of quantized current for metrological purposes. Here, we discuss in detail the fabrication protocol for silicon MOS QDs which is relevant to both quantum computing and quantum metrology applications. Moreover, we describe characterization methods to test the integrity of the devices after fabrication. Finally, we give a brief description of the measurement set-up used for charge pumping experiments and show representative results of electric current quantization. PMID:26067215

  19. Polycrystalline silicon ring resonator photodiodes in a bulk complementary metal-oxide-semiconductor process.

    PubMed

    Mehta, Karan K; Orcutt, Jason S; Shainline, Jeffrey M; Tehar-Zahav, Ofer; Sternberg, Zvi; Meade, Roy; Popović, Miloš A; Ram, Rajeev J

    2014-02-15

    We present measurements on resonant photodetectors utilizing sub-bandgap absorption in polycrystalline silicon ring resonators, in which light is localized in the intrinsic region of a p+/p/i/n/n+ diode. The devices, operating both at λ=1280 and λ=1550  nm and fabricated in a complementary metal-oxide-semiconductor (CMOS) dynamic random-access memory emulation process, exhibit detection quantum efficiencies around 20% and few-gigahertz response bandwidths. We observe this performance at low reverse biases in the range of a few volts and in devices with dark currents below 50 pA at 10 V. These results demonstrate that such photodetector behavior, previously reported by Preston et al. [Opt. Lett. 36, 52 (2011)], is achievable in bulk CMOS processes, with significant improvements with respect to the previous work in quantum efficiency, dark current, linearity, bandwidth, and operating bias due to additional midlevel doping implants and different material deposition. The present work thus offers a robust realization of a fully CMOS-fabricated all-silicon photodetector functional across a wide wavelength range. PMID:24562278

  20. Silicon Metal-oxide-semiconductor Quantum Dots for Single-electron Pumping.

    PubMed

    Rossi, Alessandro; Tanttu, Tuomo; Hudson, Fay E; Sun, Yuxin; Möttönen, Mikko; Dzurak, Andrew S

    2015-06-03

    As mass-produced silicon transistors have reached the nano-scale, their behavior and performances are increasingly affected, and often deteriorated, by quantum mechanical effects such as tunneling through single dopants, scattering via interface defects, and discrete trap charge states. However, progress in silicon technology has shown that these phenomena can be harnessed and exploited for a new class of quantum-based electronics. Among others, multi-layer-gated silicon metal-oxide-semiconductor (MOS) technology can be used to control single charge or spin confined in electrostatically-defined quantum dots (QD). These QD-based devices are an excellent platform for quantum computing applications and, recently, it has been demonstrated that they can also be used as single-electron pumps, which are accurate sources of quantized current for metrological purposes. Here, we discuss in detail the fabrication protocol for silicon MOS QDs which is relevant to both quantum computing and quantum metrology applications. Moreover, we describe characterization methods to test the integrity of the devices after fabrication. Finally, we give a brief description of the measurement set-up used for charge pumping experiments and show representative results of electric current quantization.

  1. Laser Doppler blood flow complementary metal oxide semiconductor imaging sensor with analog on-chip processing

    SciTech Connect

    Gu Quan; Hayes-Gill, Barrie R.; Morgan, Stephen P

    2008-04-20

    A 4x4 pixel array with analog on-chip processing has been fabricated within a 0.35 {mu}m complementary metal oxide semiconductor process as a prototype sensor for laser Doppler blood flow imaging. At each pixel the bandpass and frequency weighted filters necessary for processing laser Doppler blood flow signals have been designed and fabricated. Because of the space constraints of implementing an accurate {omega}{sup 0.5} filter at the pixel level, this has been approximated using the ''roll off'' of a high-pass filter with a cutoff frequency set at 10 kHz. The sensor has been characterized using a modulated laser source. Fixed pattern noise is present that is demonstrated to be repeatable across the array and can be calibrated. Preliminary blood flow results on a finger before and after occlusion demonstrate that the sensor array provides the potential for a system that can be scaled to a larger number of pixels for blood flow imaging.

  2. Reclamation of Water Polluted with Flubendiamide Residues by Photocatalytic Treatment with Semiconductor Oxides.

    PubMed

    Fenoll, José; Vela, Nuria; Garrido, Isabel; Navarro, Ginés; Pérez-Lucas, Gabriel; Navarro, Simón

    2015-01-01

    The photodegradation of flubendiamide (benzenedicarboxamide insecticide), a relatively new insecticide was investigated in aqueous suspensions binary (ZnO of and TiO2 ) and ternary (Zn2 TiO4 and ZnTiO3 ) oxides under artificial light (300-460 nm) irradiation. Photocatalytic experiments showed that the addition of semiconductors, especially ZnO and TiO2 , in tandem with an electron acceptor (Na2 S2 O8 ) enhances the degradation rate of this compound in comparison with those carried out with catalyst alone and photolytic tests. The photocatalytical degradation of flubendiamide using ZnO/Na2 S2 O8 and TiO2 /Na2 S2 O8 followed first-order kinetics. In addition, desiodo-flubendiamide was identified during the degradation of flubendiamide. Finally, application of these reaction systems in different waters (tap, leaching and watercourse) showed the validity of the treatments, which allowed the removal of flubendiamide residues in these drinking and environmental water samples.

  3. Enhancing the far-ultraviolet sensitivity of silicon complementary metal oxide semiconductor imaging arrays

    NASA Astrophysics Data System (ADS)

    Retherford, Kurt D.; Bai, Yibin; Ryu, Kevin K.; Gregory, James A.; Welander, Paul B.; Davis, Michael W.; Greathouse, Thomas K.; Winters, Gregory S.; Suntharalingam, Vyshnavi; Beletic, James W.

    2015-10-01

    We report our progress toward optimizing backside-illuminated silicon P-type intrinsic N-type complementary metal oxide semiconductor devices developed by Teledyne Imaging Sensors (TIS) for far-ultraviolet (UV) planetary science applications. This project was motivated by initial measurements at Southwest Research Institute of the far-UV responsivity of backside-illuminated silicon PIN photodiode test structures, which revealed a promising QE in the 100 to 200 nm range. Our effort to advance the capabilities of thinned silicon wafers capitalizes on recent innovations in molecular beam epitaxy (MBE) doping processes. Key achievements to date include the following: (1) representative silicon test wafers were fabricated by TIS, and set up for MBE processing at MIT Lincoln Laboratory; (2) preliminary far-UV detector QE simulation runs were completed to aid MBE layer design; (3) detector fabrication was completed through the pre-MBE step; and (4) initial testing of the MBE doping process was performed on monitoring wafers, with detailed quality assessments.

  4. Laser Doppler blood flow complementary metal oxide semiconductor imaging sensor with analog on-chip processing.

    PubMed

    Gu, Quan; Hayes-Gill, Barrie R; Morgan, Stephen P

    2008-04-20

    A 4 x 4 pixel array with analog on-chip processing has been fabricated within a 0.35 mum complementary metal oxide semiconductor process as a prototype sensor for laser Doppler blood flow imaging. At each pixel the bandpass and frequency weighted filters necessary for processing laser Doppler blood flow signals have been designed and fabricated. Because of the space constraints of implementing an accurate omega(0.5) filter at the pixel level, this has been approximated using the "roll off" of a high-pass filter with a cutoff frequency set at 10 kHz. The sensor has been characterized using a modulated laser source. Fixed pattern noise is present that is demonstrated to be repeatable across the array and can be calibrated. Preliminary blood flow results on a finger before and after occlusion demonstrate that the sensor array provides the potential for a system that can be scaled to a larger number of pixels for blood flow imaging.

  5. Π Band Dispersion along Conjugated Organic Nanowires Synthesized on a Metal Oxide Semiconductor

    PubMed Central

    2016-01-01

    Surface-confined dehalogenation reactions are versatile bottom-up approaches for the synthesis of carbon-based nanostructures with predefined chemical properties. However, for devices generally requiring low-conductivity substrates, potential applications are so far severely hampered by the necessity of a metallic surface to catalyze the reactions. In this work we report the synthesis of ordered arrays of poly(p-phenylene) chains on the surface of semiconducting TiO2(110) via a dehalogenative homocoupling of 4,4″-dibromoterphenyl precursors. The supramolecular phase is clearly distinguished from the polymeric one using low-energy electron diffraction and scanning tunneling microscopy as the substrate temperature used for deposition is varied. X-ray photoelectron spectroscopy of C 1s and Br 3d core levels traces the temperature of the onset of dehalogenation to around 475 K. Moreover, angle-resolved photoemission spectroscopy and tight-binding calculations identify a highly dispersive band characteristic of a substantial overlap between the precursor’s π states along the polymer, considered as the fingerprint of a successful polymerization. Thus, these results establish the first spectroscopic evidence that atomically precise carbon-based nanostructures can readily be synthesized on top of a transition-metal oxide surface, opening the prospect for the bottom-up production of novel molecule–semiconductor devices. PMID:27115554

  6. Highly stable and imperceptible electronics utilizing photoactivated heterogeneous sol-gel metal-oxide dielectrics and semiconductors.

    PubMed

    Jo, Jeong-Wan; Kim, Jaekyun; Kim, Kyung-Tae; Kang, Jin-Gu; Kim, Myung-Gil; Kim, Kwang-Ho; Ko, Hyungduk; Kim, Jiwan; Kim, Yong-Hoon; Park, Sung Kyu

    2015-02-18

    Incorporation of Zr into an AlOx matrix generates an intrinsically activated ZAO surface enabling the formation of a stable semiconducting IGZO film and good interfacial properties. Photochemically annealed metal-oxide devices and circuits with the optimized sol-gel ZAO dielectric and IGZO semiconductor layers demonstrate the high performance and electrically/mechanically stable operation of flexible electronics fabricated via a low-temperature solution process.

  7. Long-term research in Japan: amorphous metals, metal oxide varistors, high-power semiconductors and superconducting generators

    SciTech Connect

    Hane, G.J.; Yorozu, M.; Sogabe, T.; Suzuki, S.

    1985-04-01

    The review revealed that significant activity is under way in the research of amorphous metals, but that little fundamental work is being pursued on metal oxide varistors and high-power semiconductors. Also, the investigation of long-term research program plans for superconducting generators reveals that activity is at a low level, pending the recommendations of a study currently being conducted through Japan's Central Electric Power Council.

  8. Multifunctional Self-Assembled Monolayers for Organic Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Cernetic, Nathan

    Organic field effect transistors (OFETs) have the potential to reach commercialization for a wide variety of applications such as active matrix display circuitry, chemical and biological sensing, radio-frequency identification devices and flexible electronics. In order to be commercially competitive with already at-market amorphous silicon devices, OFETs need to approach similar performance levels. Significant progress has been made in developing high performance organic semiconductors and dielectric materials. Additionally, a common route to improve the performance metric of OFETs is via interface modification at the critical dielectric/semiconductor and electrode/semiconductor interface which often play a significant role in charge transport properties. These metal oxide interfaces are typically modified with rationally designed multifunctional self-assembled monolayers. As means toward improving the performance metrics of OFETs, rationally designed multifunctional self-assembled monolayers are used to explore the relationship between surface energy, SAM order, and SAM dipole on OFET performance. The studies presented within are (1) development of a multifunctional SAM capable of simultaneously modifying dielectric and metal surface while maintaining compatibility with solution processed techniques (2) exploration of the relationship between SAM dipole and anchor group on graphene transistors, and (3) development of self-assembled monolayer field-effect transistor in which the traditional thick organic semiconductor is replaced by a rationally designed self-assembled monolayer semiconductor. The findings presented within represent advancement in the understanding of the influence of self-assembled monolayers on OFETs as well as progress towards rationally designed monolayer transistors.

  9. Infrared rectification in a nanoantenna-coupled metal-oxide-semiconductor tunnel diode.

    PubMed

    Davids, Paul S; Jarecki, Robert L; Starbuck, Andrew; Burckel, D Bruce; Kadlec, Emil A; Ribaudo, Troy; Shaner, Eric A; Peters, David W

    2015-12-01

    Direct rectification of electromagnetic radiation is a well-established method for wireless power conversion in the microwave region of the spectrum, for which conversion efficiencies in excess of 84% have been demonstrated. Scaling to the infrared or optical part of the spectrum requires ultrafast rectification that can only be obtained by direct tunnelling. Many research groups have looked to plasmonics to overcome antenna-scaling limits and to increase the confinement. Recently, surface plasmons on heavily doped Si surfaces were investigated as a way of extending surface-mode confinement to the thermal infrared region. Here we combine a nanostructured metallic surface with a heavily doped Si infrared-reflective ground plane designed to confine infrared radiation in an active electronic direct-conversion device. The interplay of strong infrared photon-phonon coupling and electromagnetic confinement in nanoscale devices is demonstrated to have a large impact on ultrafast electronic tunnelling in metal-oxide-semiconductor (MOS) structures. Infrared dispersion of SiO2 near a longitudinal optical (LO) phonon mode gives large transverse-field confinement in a nanometre-scale oxide-tunnel gap as the wavelength-dependent permittivity changes from 1 to 0, which leads to enhanced electromagnetic fields at material interfaces and a rectified displacement current that provides a direct conversion of infrared radiation into electric current. The spectral and electrical signatures of the nanoantenna-coupled tunnel diodes are examined under broadband blackbody and quantum-cascade laser (QCL) illumination. In the region near the LO phonon resonance, we obtained a measured photoresponsivity of 2.7 mA W(-1) cm(-2) at -0.1 V.

  10. Infrared rectification in a nanoantenna-coupled metal-oxide-semiconductor tunnel diode.

    PubMed

    Davids, Paul S; Jarecki, Robert L; Starbuck, Andrew; Burckel, D Bruce; Kadlec, Emil A; Ribaudo, Troy; Shaner, Eric A; Peters, David W

    2015-12-01

    Direct rectification of electromagnetic radiation is a well-established method for wireless power conversion in the microwave region of the spectrum, for which conversion efficiencies in excess of 84% have been demonstrated. Scaling to the infrared or optical part of the spectrum requires ultrafast rectification that can only be obtained by direct tunnelling. Many research groups have looked to plasmonics to overcome antenna-scaling limits and to increase the confinement. Recently, surface plasmons on heavily doped Si surfaces were investigated as a way of extending surface-mode confinement to the thermal infrared region. Here we combine a nanostructured metallic surface with a heavily doped Si infrared-reflective ground plane designed to confine infrared radiation in an active electronic direct-conversion device. The interplay of strong infrared photon-phonon coupling and electromagnetic confinement in nanoscale devices is demonstrated to have a large impact on ultrafast electronic tunnelling in metal-oxide-semiconductor (MOS) structures. Infrared dispersion of SiO2 near a longitudinal optical (LO) phonon mode gives large transverse-field confinement in a nanometre-scale oxide-tunnel gap as the wavelength-dependent permittivity changes from 1 to 0, which leads to enhanced electromagnetic fields at material interfaces and a rectified displacement current that provides a direct conversion of infrared radiation into electric current. The spectral and electrical signatures of the nanoantenna-coupled tunnel diodes are examined under broadband blackbody and quantum-cascade laser (QCL) illumination. In the region near the LO phonon resonance, we obtained a measured photoresponsivity of 2.7 mA W(-1) cm(-2) at -0.1 V. PMID:26414194

  11. Infrared rectification in a nanoantenna-coupled metal-oxide-semiconductor tunnel diode

    NASA Astrophysics Data System (ADS)

    Davids, Paul S.; Jarecki, Robert L.; Starbuck, Andrew; Burckel, D. Bruce; Kadlec, Emil A.; Ribaudo, Troy; Shaner, Eric A.; Peters, David W.

    2015-12-01

    Direct rectification of electromagnetic radiation is a well-established method for wireless power conversion in the microwave region of the spectrum, for which conversion efficiencies in excess of 84% have been demonstrated. Scaling to the infrared or optical part of the spectrum requires ultrafast rectification that can only be obtained by direct tunnelling. Many research groups have looked to plasmonics to overcome antenna-scaling limits and to increase the confinement. Recently, surface plasmons on heavily doped Si surfaces were investigated as a way of extending surface-mode confinement to the thermal infrared region. Here we combine a nanostructured metallic surface with a heavily doped Si infrared-reflective ground plane designed to confine infrared radiation in an active electronic direct-conversion device. The interplay of strong infrared photon-phonon coupling and electromagnetic confinement in nanoscale devices is demonstrated to have a large impact on ultrafast electronic tunnelling in metal-oxide-semiconductor (MOS) structures. Infrared dispersion of SiO2 near a longitudinal optical (LO) phonon mode gives large transverse-field confinement in a nanometre-scale oxide-tunnel gap as the wavelength-dependent permittivity changes from 1 to 0, which leads to enhanced electromagnetic fields at material interfaces and a rectified displacement current that provides a direct conversion of infrared radiation into electric current. The spectral and electrical signatures of the nanoantenna-coupled tunnel diodes are examined under broadband blackbody and quantum-cascade laser (QCL) illumination. In the region near the LO phonon resonance, we obtained a measured photoresponsivity of 2.7 mA W-1 cm-2 at -0.1 V.

  12. Gallium nitride junction field-effect transistor

    DOEpatents

    Zolper, John C.; Shul, Randy J.

    1999-01-01

    An all-ion implanted gallium-nitride (GaN) junction field-effect transistor (JFET) and method of making the same. Also disclosed are various ion implants, both n- and p-type, together with or without phosphorous co-implantation, in selected III-V semiconductor materials.

  13. Gallium nitride junction field-effect transistor

    DOEpatents

    Zolper, J.C.; Shul, R.J.

    1999-02-02

    An ion implanted gallium-nitride (GaN) junction field-effect transistor (JFET) and method of making the same are disclosed. Also disclosed are various ion implants, both n- and p-type, together with or without phosphorus co-implantation, in selected III-V semiconductor materials. 19 figs.

  14. C-V measurements of micron diameter metal-oxide-semiconductor capacitors using a scanning-electron-microscope-based nanoprobe.

    PubMed

    Zheng, T; Jia, H; Wallace, R M; Gnade, B E

    2007-10-01

    The C-V electrical characterization of microstructures on a standard probe station is limited by the magnification of the imaging system and the precision of the probe manipulators. To overcome these limitations, we examine the combination of in situ electrical probing and a dual column scanning electron microscope/focused ion beam system. The imaging parameters and probing procedures are carefully chosen to reduce e-beam damage to the metal oxide semiconductor capacitor device under test. Estimation of shunt capacitance is critical when making femtofarad level measurements. C-V measurements of micron size metal-oxide-silicon capacitors are demonstrated. PMID:17979444

  15. Properties of c-axis-aligned crystalline indium-gallium-zinc oxide field-effect transistors fabricated through a tapered-trench gate process

    NASA Astrophysics Data System (ADS)

    Asami, Yoshinobu; Kurata, Motomu; Okazaki, Yutaka; Higa, Eiji; Matsubayashi, Daisuke; Okamoto, Satoru; Sasagawa, Shinya; Moriwaka, Tomoaki; Kakehata, Tetsuya; Yakubo, Yuto; Kato, Kiyoshi; Hamada, Takashi; Sakakura, Masayuki; Hayakawa, Masahiko; Yamazaki, Shunpei

    2016-04-01

    To achieve both low power consumption and high-speed operation, we fabricated c-axis-aligned crystalline indium-gallium-zinc oxide (CAAC-IGZO) field-effect transistors (FETs) with In-rich IGZO and common IGZO (\\text{In}:\\text{Ga}:\\text{Zn} = 1:1:1 in atomic ratio) active layers through a simple process using trench gates, and evaluated their characteristics. The results confirm that 60-nm-node IGZO FETs fabricated through a 450 °C process show an extremely low off-state current below the detection limit (at most 2 × 10-16 A) even at a measurement temperature of 150 °C. The results also reveal that the FETs with the In-rich IGZO active layer show a higher on-state current than those with the common IGZO active layer and have excellent frequency characteristics with a cutoff frequency and a maximum oscillation frequency of up to 20 and 6 GHz, respectively. Thus, we demonstrated that CAAC-IGZO FETs with trench gates are promising for achieving both low power consumption and high-speed operation.

  16. A silicon doped hafnium oxide ferroelectric p-n-p-n SOI tunneling field-effect transistor with steep subthreshold slope and high switching state current ratio

    NASA Astrophysics Data System (ADS)

    Marjani, Saeid; Hosseini, Seyed Ebrahim; Faez, Rahim

    2016-09-01

    In this paper, a silicon-on-insulator (SOI) p-n-p-n tunneling field-effect transistor (TFET) with a silicon doped hafnium oxide (Si:HfO2) ferroelectric gate stack is proposed and investigated via 2D device simulation with a calibrated nonlocal band-to-band tunneling model. Utilization of Si:HfO2 instead of conventional perovskite ferroelectrics such as lead zirconium titanate (PbZrTiO3) and strontium bismuth tantalate (SrBi2Ta2O9) provides compatibility to the CMOS process as well as improved device scalability. By using Si:HfO2 ferroelectric gate stack, the applied gate voltage is effectively amplified that causes increased electric field at the tunneling junction and reduced tunneling barrier width. Compared with the conventional p-n-p-n SOI TFET, the on-state current and switching state current ratio are appreciably increased; and the average subthreshold slope (SS) is effectively reduced. The simulation results of Si:HfO2 ferroelectric p-n-p-n SOI TFET show significant improvement in transconductance (˜9.8X enhancement) at high overdrive voltage and average subthreshold slope (˜35% enhancement over nine decades of drain current) at room temperature, indicating that this device is a promising candidate to strengthen the performance of p-n-p-n and conventional TFET for a switching performance.

  17. Real-time, selective detection of Pb(2+) in water using a reduced graphene oxide/gold nanoparticle field-effect transistor device.

    PubMed

    Zhou, Guihua; Chang, Jingbo; Cui, Shumao; Pu, Haihui; Wen, Zhenhai; Chen, Junhong

    2014-01-01

    A field-effect transistor (FET) device-based sensor is developed to specifically detect Pb(2+) ions in an aqueous environment that is notably toxic. Reduced graphene oxide (rGO), as the semiconducting channel material, was utilized in the FET device through a self-assembly method. An l-glutathione reduced was employed as the capture probe for the label-free detection. By monitoring the electrical characteristics of the FET device, the performance of the sensor was measured and investigated. Compared with conventional detection technologies, this sensor enabled real-time detection with a response time of 1-2 s. A lower detection limit for Pb(2+) ions as low as 10 nM was achieved, which is much lower than the maximum contaminant level for Pb(2+) ions in drinking water recommended by the World Health Organization. Furthermore, the rGO FET sensor was able to distinguish Pb(2+) from other metal ions. Without any sample pretreatment, the platform is user-friendly. PMID:25296985

  18. DNA-base guanine as hydrogen getter and charge-trapping layer embedded in oxide dielectrics for inorganic and organic field-effect transistors.

    PubMed

    Lee, Junyeong; Park, Ji Hoon; Lee, Young Tack; Jeon, Pyo Jin; Lee, Hee Sung; Nam, Seung Hee; Yi, Yeonjin; Lee, Younjoo; Im, Seongil

    2014-04-01

    DNA-base small molecules of guanine, cytosine, adenine, and thymine construct the DNA double helix structure with hydrogen bonding, and they possess such a variety of intrinsic benefits as natural plentitude, biodegradability, biofunctionality, low cost, and low toxicity. On the basis of these advantages, here, we report on unprecedented useful applications of guanine layer as hydrogen getter and charge trapping layer when it is embedded into a dielectric oxide of n-channel inorganic InGaZnO and p-channel organic heptazole field effect transistors (FETs). The embedded guanine layer much improved the gate stability of inorganic FETs gettering many hydrogen atoms in the gate dielectric layer of FET, and it also played as charge trapping layer to which the voltage pulse-driven charges might be injected from channel, resulting in a threshold voltage (Vth) shift of FETs. Such shift state is very ambient-stable and almost irrevocable even under a high electric-field at room temperature. So, Boolean logics are nicely demonstrated by using our FETs with the guanine-embedded dielectric. The original Vth is recovered only under high energy blue photons by opposite voltage pulse (charge-ejection), which indicates that our device is also applicable to nonvolatile photo memory.

  19. Radiation hardening of MOS devices by boron. [for stabilizing gate threshold potential of field effect device

    NASA Technical Reports Server (NTRS)

    Danchenko, V. (Inventor)

    1974-01-01

    A technique is described for radiation hardening of MOS devices and specifically for stabilizing the gate threshold potential at room temperature of a radiation subjected MOS field-effect device with a semiconductor substrate, an insulating layer of oxide on the substrate, and a gate electrode disposed on the insulating layer. The boron is introduced within a layer of the oxide of about 100 A-300 A thickness immediately adjacent the semiconductor-insulator interface. The concentration of boron in the oxide layer is preferably maintained on the order of 10 to the 18th power atoms/cu cm. The technique serves to reduce and substantially annihilate radiation induced positive gate charge accumulations.

  20. Oxidative removal of implanted photoresists and barrier metals in semiconductor processing

    NASA Astrophysics Data System (ADS)

    Govindarajan, Rajkumar

    Chemical systems containing oxidants are widely used at various stages in semiconductor processing, particularly for wet cleaning and polishing applications. This dissertation presents a series of studies related to oxidative removal of materials in the Front-End-Of-Line (FEOL) and Chemical Mechanical Planarization (CMP) processes during IC fabrication. In the first part of this study, stripping of photoresists exposed to high dose of ions (1E16 As/cm2) was investigated in activated hydrogen peroxide systems. Stripping of photoresists (PR) exposed to high dose (>1E15/cm2) ion beams is one of the most challenging steps in FEOL processing. This is due to unreactive crust layer that forms on the resist surface during ion implantation. The use of hydrogen peroxide systems activated by metal ion or UV light, for disrupting crust formed on deep UV resist to enable complete removal of crust as well as underlying photoresist was investigated. A systematic evaluation of variables such as hydrogen peroxide and metal ion concentration, UV intensity, temperature and time was conducted and an optimal formulation capable of attacking the crust was developed. A two step process involving pretreatment with activated hydrogen peroxide solution, followed by treatment with sulfuric acid-hydrogen peroxide mixture (SPM) was developed for complete removal of crusted resist films. In the second part of this study, electrochemically enhanced abrasive removal of Ta/TaN films was investigated in solutions containing 2,5 dihydroxy benzene sulfonic acid (DBSA) and potassium iodate (KIO3). This method known as Electrically-assisted Chemical Mechanical Planarization (ECMP) is generating a lot of interest in IC manufacturing. Ta/TaN films were abraded at low pressures (<0.5 psi) on a polyurethane pad under galvanostatic conditions. The effect of variables including pH, KIO3 concentration, and current density has been explored. In the optimized formulation, tantalum and tantalum nitride removal

  1. Design of nanophotonic, hot-electron solar-blind ultraviolet detectors with a metal-oxide-semiconductor structure

    NASA Astrophysics Data System (ADS)

    Wang, Zhiyuan; Wang, Xiaoxin; Liu, Jifeng

    2014-12-01

    Solar-blind ultraviolet (UV) detection refers to photon detection specifically in the wavelength range of 200 nm-320 nm. Without background noises from solar radiation, it has broad applications from homeland security to environmental monitoring. The most commonly used solid state devices for this application are wide band gap (WBG) semiconductor photodetectors (Eg > 3.5 eV). However, WBG semiconductors are difficult to grow and integrate with Si readout integrated circuits (ROICs). In this paper, we design a nanophotonic metal-oxide-semiconductor structure on Si for solar-blind UV detectors. Instead of using semiconductors as the active absorber, we use Sn nano-grating structures to absorb UV photons and generate hot electrons for internal photoemission across the Sn/SiO2 interfacial barrier, thereby generating photocurrent between the metal and the n-type Si region upon UV excitation. Moreover, the transported hot electron has an excess kinetic energy >3 eV, large enough to induce impact ionization and generate another free electron in the conduction band of n-Si. This process doubles the quantum efficiency. On the other hand, the large metal/oxide interfacial energy barrier (>3.5 eV) also enables solar-blind UV detection by blocking the less energetic electrons excited by visible photons. With optimized design, ˜75% UV absorption and hot electron excitation can be achieved within the mean free path of ˜20 nm from the metal/oxide interface. This feature greatly enhances hot electron transport across the interfacial barrier to generate photocurrent. The simple geometry of the Sn nano-gratings and the MOS structure make it easy to fabricate and integrate with Si ROICs compared to existing solar-blind UV detection schemes. The presented device structure also breaks through the conventional notion that photon absorption by metal is always a loss in solid-state photodetectors, and it can potentially be extended to other active metal photonic devices.

  2. Interfacial Properties of Organic Semiconductor-Inorganic Magnetic Oxide Hybrid Spintronic Systems Fabricated Using Pulsed Laser Deposition.

    PubMed

    Majumdar, Sayani; Grochowska, Katarzyna; Sawczak, Miroslaw; Śliwiński, Gerard; Huhtinen, Hannu; Dahl, Johnny; Tuominen, Marjukka; Laukkanen, Pekka; Majumdar, Himadri S

    2015-10-14

    We report fabrication of a hybrid organic semiconductor-inorganic complex oxide interface of rubrene and La0.67Sr0.33MnO3 (LSMO) for spintronic devices using pulsed laser deposition (PLD) and investigate the interface structure and chemical bonding-dependent magnetic properties. Our results demonstrate that with proper control of growth parameters, thin films of organic semiconductor rubrene can be deposited without any damage to the molecular structure. Rubrene, a widely used organic semiconductor with high charge-carrier mobility and spin diffusion length, when grown as thin films on amorphous and crystalline substrates such as SiO2-glass, indium-tin oxide (ITO), and LSMO by PLD at room temperature and a laser fluence of 0.19 J/cm2, reveals amorphous structure. The Raman spectra verify the signatures of both Ag and Bg Raman active modes of rubrene molecules. X-ray reflectivity measurements indicate a well-defined interface formation between surface-treated LSMO and rubrene, whereas X-ray photoelectron spectra indicate the signature of hybridization of the electronic states at this interface. Magnetic measurements show that the ferromagnetic property of the rubrene-LSMO interface improves by >230% compared to the pristine LSMO surface due to this proposed hybridization. Intentional disruption of the direct contact between LSMO and rubrene by insertion of a dielectric AlOx layer results in an observably decreased ferromagnetism. These experimental results demonstrate that by controlling the interface formation between organic semiconductor and half-metallic oxide thin films, it is possible to engineer the interface spin polarization properties. Results also confirm that by using PLD for consecutive growth of different layers, contamination-free interfaces can be obtained, and this finding is significant for the well-controlled and reproducible design of spin-polarized interfaces for future hybrid spintronics devices.

  3. Interfacial Properties of Organic Semiconductor-Inorganic Magnetic Oxide Hybrid Spintronic Systems Fabricated Using Pulsed Laser Deposition.

    PubMed

    Majumdar, Sayani; Grochowska, Katarzyna; Sawczak, Miroslaw; Śliwiński, Gerard; Huhtinen, Hannu; Dahl, Johnny; Tuominen, Marjukka; Laukkanen, Pekka; Majumdar, Himadri S

    2015-10-14

    We report fabrication of a hybrid organic semiconductor-inorganic complex oxide interface of rubrene and La0.67Sr0.33MnO3 (LSMO) for spintronic devices using pulsed laser deposition (PLD) and investigate the interface structure and chemical bonding-dependent magnetic properties. Our results demonstrate that with proper control of growth parameters, thin films of organic semiconductor rubrene can be deposited without any damage to the molecular structure. Rubrene, a widely used organic semiconductor with high charge-carrier mobility and spin diffusion length, when grown as thin films on amorphous and crystalline substrates such as SiO2-glass, indium-tin oxide (ITO), and LSMO by PLD at room temperature and a laser fluence of 0.19 J/cm2, reveals amorphous structure. The Raman spectra verify the signatures of both Ag and Bg Raman active modes of rubrene molecules. X-ray reflectivity measurements indicate a well-defined interface formation between surface-treated LSMO and rubrene, whereas X-ray photoelectron spectra indicate the signature of hybridization of the electronic states at this interface. Magnetic measurements show that the ferromagnetic property of the rubrene-LSMO interface improves by >230% compared to the pristine LSMO surface due to this proposed hybridization. Intentional disruption of the direct contact between LSMO and rubrene by insertion of a dielectric AlOx layer results in an observably decreased ferromagnetism. These experimental results demonstrate that by controlling the interface formation between organic semiconductor and half-metallic oxide thin films, it is possible to engineer the interface spin polarization properties. Results also confirm that by using PLD for consecutive growth of different layers, contamination-free interfaces can be obtained, and this finding is significant for the well-controlled and reproducible design of spin-polarized interfaces for future hybrid spintronics devices. PMID:26402298

  4. Features of high-frequency measurements of the impedance of metal-insulator-semiconductor structures with an ultrathin oxide

    SciTech Connect

    Goldman, E. I.; Levashova, A. I.; Levashov, S. A.; Chucheva, G. V.

    2015-04-15

    The possibilities of using the data of high-frequency measurements of the impedance of metal-oxide-semiconductor structures with an ultrathin insulating layer for determining the parameters of the semiconductor and the tunneling characteristics of the insulator are considered. If the accuracy of the experiment makes it possible to record both the active and reactive impedance components, the thickness of the surface depletion layer, the resistance of the semiconductor base portion, the differential tunnel conductivity of the insulating layer, and the differential tunneling-stimulated current of the generation of electron-hole pairs are calculated using the values of the capacitance and conduction of the structure measured at two frequencies. In the case, where the values of the active component of the impedance is beyond the accuracy of measurements, analysis of the parameters is possible upon four-frequency organization of the experiment from the values of only the capacitances with an increased accuracy of their measurements. A test for the necessary accuracy of data of such an experiment is formulated. If the test fails, it is possible to determine only the capacitance of the surface depletion layer in the semiconductor and, in this case, it is sufficient to implement only the single-frequency experiment.

  5. Capacitance-voltage studies of InP metal-oxide-semiconductor devices irradiated with 4He + ions

    NASA Astrophysics Data System (ADS)

    Tin, C. C.; Barnes, P. A.; Williams, J. R.; Patuwathavithane, C. S.; Van Staagen, P. K.

    1989-11-01

    Capacitance-voltage (C-V) measurements have been made on n-InP metal-oxide-semiconductor (MOS) devices damaged by 2-MeV 4 He+ ion bombardment. The C-V curves for samples with thin oxide layer (˜100 Å) show the presence of a depletion layer during both forward and reverse bias. This behavior is significantly different from those of normal, undamaged MOS devices. Measurements made on n-InP MOS samples with different oxide thicknesses show that the C-V curves gradually approach that of a MOS device on a p-type substrate. The anomalous behavior of the C-V curves for the irradiated samples can be explained by the presence of an n-p-n structure under the oxide layer.

  6. Rate enhancement of photocatalytic cyanide oxidation by the application of an anodic bias/coupled semiconductor configuration

    SciTech Connect

    Munroe, N.D.H.; Tilleux, R.

    1996-12-31

    In this study, photocatalytic cyanide degradation was investigated utilizing ultraviolet light (UV), an increase in titanium (IV) oxide (TiO{sub 2}) photocatalyst surface area, platinization of the photocatalyst, appropriate adjustment of pH, and the immobilization of TiO{sub 2}/ tin (IV) oxide (SnO{sub 2}) coupled semi-conductor film on an optically transparent electrode. The cyanide concentration was monitored using an ion selective electrode. The focus of this study was to explore the possibility of a viable process for the effective and complete photodegradation of cyanide ion. The long-term goal is the application of this process to industry. Cyanide detoxification has been successfully achieved in recent years. Research has shown that photocatalytic oxidation can completely degrade cyanide to nitrate via nitrite. However, the rate at which this oxidation occurs is not yet suitable for application in industry. Therefore, the need for an effective treatment is most urgent.

  7. Oxide-free InAs(111)A interface in metal-oxide-semiconductor structure with very low density of states prepared by anodic oxidation

    SciTech Connect

    Valisheva, N. A. Aksenov, M. S.; Golyashov, V. A.; Levtsova, T. A.; Kovchavtsev, A. P.; Gutakovskii, A. K.; Tereshchenko, O. E.; Khandarkhaeva, S. E.; Kalinkin, A. V.; Prosvirin, I. P.; Bukhtiyarov, V. I.

    2014-10-20

    In this letter, we present structural, compositional, and electrical characteristics of anodic oxide layer-based metal-oxide-semiconductor (MOS) capacitors on n-type InAs(111)A, along with the effect of a thin fluorinated interfacial passivation layer. Electrochemical oxidation in acid electrolyte with addition of fluorine (NH{sub 4}F) led to the formation of oxygen free well-ordered wide gap fluorinated interfacial layer at InAs(111)A with the fixed charge (Q{sub fix}) and density of interface states (D{sub it}) in the range of (4–6) × 10{sup 10 }cm{sup −2} and (2–12) × 10{sup 10 }eV{sup −1 }cm{sup −2}, respectively. We found that MOS capacitors showed excellent capacitance-voltage characteristics with very small frequency dispersion (<1% and <15 mV). Fluorinated interfacial layer consists of crystalline isostructural compound with the InAs substrate, which remains intact with the atomic smoothness and sharpness that explain unpinned behavior of the Fermi level.

  8. Organic Gate Silicon Field Effect Transistors with Poly Methylmethacrylate Films for Science Education

    NASA Astrophysics Data System (ADS)

    Hirose, Fumihiko; Miyagi, Tatsuro; Narita, Yuzuru

    We have developed an easy fabrication method of Si field effect transistors (FETs) with poly (methyl methacrylate) (PMMA) gate films for science education. In this process, we can easily fabricate the silicon FETs only by means of metal deposition and thermal diffusion without any lithography processes. The organic isolation films of PMMA can be deposited by casting or painting at room temperature in air. The metal-organic-semiconductor FETs with PMMA exhibited almost the same drain current — gate voltage characteristics as those of conventional Si metal-oxide-semiconductor FETs, which are suitable for the education material of semiconductor engineering. The organic gate Si FETs can be used not only for education but also as thin film transistors for active matrix displays.

  9. All oxide semiconductor-based bidirectional vertical p-n-p selectors for 3D stackable crossbar-array electronics

    PubMed Central

    Bae, Yoon Cheol; Lee, Ah Rahm; Baek, Gwang Ho; Chung, Je Bock; Kim, Tae Yoon; Park, Jea Gun; Hong, Jin Pyo

    2015-01-01

    Three-dimensional (3D) stackable memory devices including nano-scaled crossbar array are central for the realization of high-density non-volatile memory electronics. However, an essential sneak path issue affecting device performance in crossbar array remains a bottleneck and a grand challenge. Therefore, a suitable bidirectional selector as a two-way switch is required to facilitate a major breakthrough in the 3D crossbar array memory devices. Here, we show the excellent selectivity of all oxide p-/n-type semiconductor-based p-n-p open-based bipolar junction transistors as selectors in crossbar memory array. We report that bidirectional nonlinear characteristics of oxide p-n-p junctions can be highly enhanced by manipulating p-/n-type oxide semiconductor characteristics. We also propose an associated Zener tunneling mechanism that explains the unique features of our p-n-p selector. Our experimental findings are further extended to confirm the profound functionality of oxide p-n-p selectors integrated with several bipolar resistive switching memory elements working as storage nodes. PMID:26289565

  10. Thermo-electrical properties of composite semiconductor thin films composed of nanocrystalline graphene-vanadium oxides.

    PubMed

    Jung, Hye-Mi; Um, Sukkee

    2014-12-01

    This paper presents an experimental comparative study involving the characterization of the thermo-electrical and structural properties of graphene-based vanadium oxide (graphene-VOx) composite thin films on insulating and conducting surfaces (i.e., fused quartz and acrylic resin-impregnated graphite) produced by a sol-gel process via dipping-pyrolysis. A combination of FE-SEM and XPS analyses revealed that the graphene-VOx composite thin films (coated onto fused quartz) exhibiting the microstructure of 2-graded nanowire arrays with a diameter of 40-80 nm were composed of graphene, a few residual oxygen-containing functional groups (i.e., C-O and C=O), and the VO2 Magnéli phase. The temperature-dependent electrical resistance measured on the as-deposited thin films clearly demonstrated that the graphene-VOx composite nanowire arrays thermally grown on fused quartz act as a semiconductor switch, with a transition temperature of 64.7 degrees C in the temperature range of -20 degrees C to 140 degrees C, resulting from the contributions of graphene and graphene oxides. In contrast, the graphene-VOx composite thin films deposited onto acrylic resin-impregnated graphite exhibit a superlinear semiconducting property of extremely low electrical resistance with negative temperature coefficients (i.e., approximately four orders of magnitude lower than that of the fused quartz), despite the similar microstructural and morphological characteristics. This difference is attributed to the synergistic effects of the paramagnetic metal feature of the tightly stacked nanowire arrays consisting of hexagonal V2O3 on the intrinsic electrical properties of the acrylic resin-impregnated graphite substrate, as revealed by FE-SEM, EDX, AFM, and XRD measurements. Although the thermo-sensitive electrical properties of the graphene-VOx composite thin films are very substrate specific, the applicability of graphene sheets can be considerably effective in the formation of highly planar arrays

  11. Physics and chemistry on well-defined semiconductor and oxide surfaces

    SciTech Connect

    Chen, Peijun

    1992-12-31

    High resolution electron energy loss spectroscopy (HREELS) and other surface spectroscopic techniques have been employed to investigate the following two classes of surface/interface phenomena on well-defined semiconductor and oxide surfaces: (i) the fundamental physical and chemical processes involved in gas-solid interaction on silicon single crystal surfaces, and (ii) the physical and chemical properties of metal-oxide interfaces. The particular systems reported in this dissertation are: NH{sub 3}, PH{sub 3} and B{sub 10}H{sub 14} on Si(111)-(7 x 7); NH{sub 3} on Si(100)-(2 x 1); atomic H on Si(111)-(7 x 7) and boron-modified Si(111); Al on Al{sub 2}O{sub 3} and Sn on SiO{sub 2}. On silicon surfaces, the surface dangling bonds function as the primary adsorption sites where surface chemical processes take place. The unambiguous identification of surface species by vibrational spectroscopy allow the elementary steps involved in these surface chemical processes to be followed on a molecular level. For adsorbate such as NH{sub 3} and PH{sub 3}, the nature of the initial low temperature (100-300 K) adsorption is found to be dissociative, while that for B{sub 10}H{sub 14} is non-dissociative. This has been deduced based upon the presence (or absence) of specific characteristic vibrational mode(s) on surface. By following the evolution of surface species as a function of temperature, the elementary steps leading to silicon nitride thin film growth and doping of silicon are elucidated. In the case of NH{sub 3} on Si(111)-(7 x7) and Si(100)-(2 x 1), a detailed understanding on the role of substrate surface structure is controlling the surface reactivity has been gained on the basis of a Si adatom backbond-strain relief mechanism on the Si(111)-(7 x 7). The electronic modification to Si(111) surface by subsurface boron doping has been shown to quench its surface chemistry, even for the most aggressive atomic H.

  12. Total Body Irradiation, Toward Optimal Individual Delivery: Dose Evaluation With Metal Oxide Field Effect Transistors, Thermoluminescence Detectors, and a Treatment Planning System

    SciTech Connect

    Bloemen-van Gurp, Esther J. Mijnheer, Ben J.; Verschueren, Tom A.M.; Lambin, Philippe

    2007-11-15

    Purpose: To predict the three-dimensional dose distribution of our total body irradiation technique, using a commercial treatment planning system (TPS). In vivo dosimetry, using metal oxide field effect transistors (MOSFETs) and thermoluminescence detectors (TLDs), was used to verify the calculated dose distributions. Methods and Materials: A total body computed tomography scan was performed and loaded into our TPS, and a three-dimensional-dose distribution was generated. In vivo dosimetry was performed at five locations on the patient. Entrance and exit dose values were converted to midline doses using conversion factors, previously determined with phantom measurements. The TPS-predicted dose values were compared with the MOSFET and TLD in vivo dose values. Results: The MOSFET and TLD dose values agreed within 3.0% and the MOSFET and TPS data within 0.5%. The convolution algorithm of the TPS, which is routinely applied in the clinic, overestimated the dose in the lung region. Using a superposition algorithm reduced the calculated lung dose by approximately 3%. The dose inhomogeneity, as predicted by the TPS, can be reduced using a simple intensity-modulated radiotherapy technique. Conclusions: The use of a TPS to calculate the dose distributions in individual patients during total body irradiation is strongly recommended. Using a TPS gives good insight of the over- and underdosage in a patient and the influence of patient positioning on dose homogeneity. MOSFETs are suitable for in vivo dosimetry purposes during total body irradiation, when using appropriate conversion factors. The MOSFET, TLD, and TPS results agreed within acceptable margins.

  13. Effect of NO annealing on charge traps in oxide insulator and transition layer for 4H-SiC metal-oxide-semiconductor devices

    NASA Astrophysics Data System (ADS)

    Jia, Yifan; Lv, Hongliang; Niu, Yingxi; Li, Ling; Song, Qingwen; Tang, Xiaoyan; Li, Chengzhan; Zhao, Yanli; Xiao, Li; Wang, Liangyong; Tang, Guangming; Zhang, Yimen; Zhang, Yuming

    2016-09-01

    The effect of nitric oxide (NO) annealing on charge traps in the oxide insulator and transition layer in n-type 4H-SiC metal-oxide-semiconductor (MOS) devices has been investigated using the time-dependent bias stress (TDBS), capacitance-voltage (C-V), and secondary ion mass spectroscopy (SIMS). It is revealed that two main categories of charge traps, near interface oxide traps (Nniot) and oxide traps (Not), have different responses to the TDBS and C-V characteristics in NO-annealed and Ar-annealed samples. The Nniot are mainly responsible for the hysteresis occurring in the bidirectional C-V characteristics, which are very close to the semiconductor interface and can readily exchange charges with the inner semiconductor. However, Not is mainly responsible for the TDBS induced C-V shifts. Electrons tunneling into the Not are hardly released quickly when suffering TDBS, resulting in the problem of the threshold voltage stability. Compared with the Ar-annealed sample, Nniot can be significantly suppressed by the NO annealing, but there is little improvement of Not. SIMS results demonstrate that the Nniot are distributed within the transition layer, which correlated with the existence of the excess silicon. During the NO annealing process, the excess Si atoms incorporate into nitrogen in the transition layer, allowing better relaxation of the interface strain and effectively reducing the width of the transition layer and the density of Nniot. Project supported by the National Natural Science Foundation of China (Grant Nos. 61404098 and 61274079), the Doctoral Fund of Ministry of Education of China (Grant No. 20130203120017), the National Key Basic Research Program of China (Grant No. 2015CB759600), the National Grid Science & Technology Project, China (Grant No. SGRI-WD-71-14-018), and the Key Specific Project in the National Science & Technology Program, China (Grant Nos. 2013ZX02305002-002 and 2015CB759600).

  14. Interface states and internal photoemission in p-type GaAs metal-oxide-semiconductor surfaces

    NASA Technical Reports Server (NTRS)

    Kashkarov, P. K.; Kazior, T. E.; Lagowski, J.; Gatos, H. C.

    1983-01-01

    An interface photodischarge study of p-type GaAs metal-oxide-semiconductor (MOS) structures revealed the presence of deep interface states and shallow donors and acceptors which were previously observed in n-type GaAs MOS through sub-band-gap photoionization transitions. For higher photon energies, internal photoemission was observed, i.e., injection of electrons to the conduction band of the oxide from either the metal (Au) or from the GaAs valence band; the threshold energies were found to be 3.25 and 3.7 + or - 0.1 eV, respectively. The measured photoemission current exhibited a thermal activation energy of about 0.06 eV, which is consistent with a hopping mechanism of electron transport in the oxide.

  15. Solar hydrogen production by tandem cell system composed of metal oxide semiconductor film photoelectrode and dye-sensitized solar cell

    NASA Astrophysics Data System (ADS)

    Arakawa, H.; Shiraishi, C.; Tatemoto, M.; Kishida, H.; Usui, D.; Suma, A.; Takamisawa, A.; Yamaguchi, T.

    2007-09-01

    Photocatalytic and photoelectrochemical approaches to solar hydrogen production in our group were introduced. In photocatalytic water splitting system using NiO x/ TiO II powder photocatalyst with concentrated Na IICO 3 aqueous solution, solar energy conversion efficiency to H II and O II production (STH efficiency) was 0.016%. In addition, STH efficiency of visible light responding photocatalyst, NiOx/ promoted In 0.9Ni 0.1TaO 4, was estimated at 0.03%. In photoelectrochemical system using an oxide semiconductor film phptoelectrode, STH efficiencies of meosporous TiO II (Anatase) , mesoporous visible light responding S-doped TiO II (Anatase) and WO 3 film were 0.32-0.44% at applied potential of 0.35 V vs NHE, 0.14% at 0.55 V and 0.44% at 0.9 V, respectively. Finally, solar hydrogen production by tandem cell system composed of an oxide semiconductor photoelectrode, a Pt wire counter electrode and a dye-sensitized solar cell (DSC) was investigated. As photoelectrodes, meosporous TiO II (Anatase), mesoporous S-doped TiO II (Anatase), WO 3, BiVO 4 and Fe IIO 3 film were tested. STH efficiency of tandem cell system composed of a WO 3 film photoelectrode, and a two-series-connected DSC (Voc = 1.4 V) was 2.5-2.8%. In conclusion, it is speculated that more than 5% STH efficiency will be obtained by tandem cell system composed of an oxide semiconductor photoelectrode and a two-series-connected DSC in near future. This suggests a cost-effective and practical application of this system for solar hydrogen production.

  16. Metal-induced crystallization of amorphous zinc tin oxide semiconductors for high mobility thin-film transistors

    NASA Astrophysics Data System (ADS)

    Hwang, Ah Young; Kim, Sang Tae; Ji, Hyuk; Shin, Yeonwoo; Jeong, Jae Kyeong

    2016-04-01

    Transition tantalum induced crystallization of amorphous zinc tin oxide (a-ZTO) was observed at low temperature annealing of 300 °C. Thin-film transistors (TFTs) with an a-ZTO channel layer exhibited a reasonable field-effect mobility of 12.4 cm2/V s, subthreshold swing (SS) of 0.39 V/decade, threshold voltage (VTH) of 1.5 V, and ION/OFF ratio of ˜107. A significant improvement in the field-effect mobility (up to ˜33.5 cm2/V s) was achieved for crystallized ZTO TFTs: this improvement was accomplished without compromising the SS, VTH, or ION/OFF ratio due to the presence of a highly ordered microstructure.

  17. The photophysics of ionic semiconductors at low temperatures: Silver bromide, silver iodide, and cuprous oxide

    NASA Astrophysics Data System (ADS)

    Rodney, Paul James

    Three ionic semiconductors that differ in the character of their lowest energy transitions were examined. Silver bromide (AgBr) has an indirect gap, silver iodide (AgI) a direct gap, and cuprous oxide (Cu2O) a direct but parity forbidden lowest energy transition. Donor-acceptor (D-A) pair recombination was identified in the three materials using time-resolved spectroscopy and the decay dynamics were compared to a previously developed theoretical model. Nanocrystals of each material were synthesized and the effects of quantum confinement on the low temperature recombination dynamics were studied. The dynamics of the emission from aqueous prepared nanocrystals of AgBr was compared to that of larger crystals. The observed lifetime of the free exciton increased from ~20 μs to ~600 μs as the size of the crystallite decreased from 41 to 8 nm. The D- A pair recombination kinetics were bulk-like in 41 nm AgBr while in the 8 nm samples the decay lasted longer. Factorial experiments led to methods of synthesis of nanocrystals in aqueous solvents allowing the dying of the nanocrystals. Preliminary spectroscopic evidence indicated J-aggregates of pseudoisocyanine (PIC) dye were adsorbed to the nanocrystal surface. Tabular AgI nanocrystals exhibiting one dimensional confinement were synthesized. The D-A nature of the broad luminescence observed in emission from AgI has been confirmed. The D-A emission decay rates for 0.5 μm and 52 nm crystals were indistinguishable. Quantum confinement effects are manifest in a blue shift of the emission and a loss of the longer lived decay components in ~5 nm thick tabular AgI nanocrystals. Measurements of the rise time and decay time of exciton luminescence using photoluminescence upconversion were attempted. Microcrystals and nanocrystals of Cu2O were synthesized via aqueous methods with the intention of completing previous quantum confinement studies where severely heat treated purchased Cu2O was compared to aqueous prepared poly

  18. Complementary metal oxide semiconductor compatible fabrication and characterization of parylene-C covered nanofluidic channels with integrated nanoelectrodes.

    PubMed

    Tung, Chih-Kuan; Riehn, Robert; Austin, Robert H

    2009-01-01

    Nanochannels offer a way to align and analyze long biopolymer molecules such as DNA with high precision at potentially single basepair resolution, especially if a means to detect biomolecules in nanochannels electronically can be developed. Integration of nanochannels with electronics will require the development of nanochannel fabrication procedures that will not damage sensitive electronics previously constructed on the device. We present here a near-room-temperature fabrication technology involving parylene-C conformal deposition that is compatible with complementary metal oxide semiconductor electronic devices and present an analysis of the initial impedance measurements of conformally parylene-C coated nanochannels with integrated gold nanoelectrodes.

  19. Disorder induced semiconductor to metal transition and modifications of grain boundaries in nanocrystalline zinc oxide thin film

    SciTech Connect

    Singh, Fouran; Kumar, Vinod; Chaudhary, Babloo; Singh, R. G.; Kumar, Sanjeev; Kapoor, A.

    2012-10-01

    This paper report on the disorder induced semiconductor to metal transition (SMT) and modifications of grain boundaries in nanocrystalline zinc oxide thin film. Disorder is induced using energetic ion irradiation. It eliminates the possibility of impurities induced transition. However, it is revealed that some critical concentration of defects is needed for inducing such kind of SMT at certain critical temperature. Above room temperature, the current-voltage characteristics in reverse bias attributes some interesting phenomenon, such as electric field induced charge transfer, charge trapping, and diffusion of defects. The transition is explained by the defects induced disorder and strain in ZnO crystallites created by high density of electronic excitations.

  20. Multichannel, time-resolved picosecond laser ultrasound imaging and spectroscopy with custom complementary metal-oxide-semiconductor detector

    SciTech Connect

    Smith, Richard J.; Light, Roger A.; Johnston, Nicholas S.; Pitter, Mark C.; Somekh, Mike G.; Sharples, Steve D.

    2010-02-15

    This paper presents a multichannel, time-resolved picosecond laser ultrasound system that uses a custom complementary metal-oxide-semiconductor linear array detector. This novel sensor allows parallel phase-sensitive detection of very low contrast modulated signals with performance in each channel comparable to that of a discrete photodiode and a lock-in amplifier. Application of the instrument is demonstrated by parallelizing spatial measurements to produce two-dimensional thickness maps on a layered sample, and spectroscopic parallelization is demonstrated by presenting the measured Brillouin oscillations from a gallium arsenide wafer. This paper demonstrates the significant advantages of our approach to pump probe systems, especially picosecond ultrasonics.