DOE Office of Scientific and Technical Information (OSTI.GOV)

Daugherty, W. L.

Destructive and non-destructive examinations have been performed on the components of shipping package 9975-02019 as part of a comprehensive SRS surveillance program for plutonium material stored in the K-Area Complex (KAC). During the field surveillance inspection of this package in KAC, two non-conforming conditions were noted: the axial gap of 1.577 inch exceeded the 1 inch maximum criterion, and two areas of dried glue residue were noted on the upper fiberboard subassembly. This package was subsequently transferred to SRNL for more detailed inspection and destructive examination. In addition to the conditions noted in KAC, the following conditions were noted: -more » Numerous small spots of corrosion were observed along the bottom edge of the drum. - In addition to the smeared glue residue on the upper fiberboard subassembly, there was also a small dark stain. - Mold was present on the side and bottom of the lower fiberboard subassembly. Dark stains from elevated moisture content were also present in these areas. - A dark spot with possible light corrosion was observed on the primary containment vessel flange, and corresponding rub marks were observed on the secondary containment vessel ID. - The fiberboard thermal conductivity in the radial orientation was above the specified range. When the test was repeated with slightly lower moisture content, the result was acceptable. The moisture content for both tests was within a range typical of other packages in storage. The observed conditions must be fully evaluated by KAC to ensure the safety function of the package is being maintained. Several factors can contribute to the concentration of moisture in the fiberboard, including higher than average initial moisture content, higher internal temperature (due to internal heat load and placement within the array of packages), and the creation of additional moisture as the fiberboard begins to degrade.« less

Status Report - Cane Fiberboard Properties And Degradation Rates For Storage Of The 9975 Shipping Package In KAC

DOE Office of Scientific and Technical Information (OSTI.GOV)

Daugherty, W.

Thermal, mechanical and physical properties have been measured on cane fiberboard samples following accelerated aging for up to approximately 10 years. The aging environments have included elevated temperature < 250 ºF (the maximum allowed service temperature for fiberboard in 9975 packages) and elevated humidity. The results from this testing have been analyzed, and aging models fit to the data. Correlations relating several properties (thermal conductivity, energy absorption, weight, dimensions and density) to their rate of change in potential storage environments have been developed. Combined with an estimate of the actual conditions the fiberboard experiences in KAC, these models allow developmentmore » of service life predictions.« less

Examination of Shipping Packages 9975-02694 and 9975-02729

DOE Office of Scientific and Technical Information (OSTI.GOV)

Daugherty, W.

SRNL has assisted in the examination of two 9975 shipping packages (9975-02694 and 9975-02729) following their use for storage of nuclear material in K-Area Complex (KAC). Both of these were targeted for examination because they were exposed to water from a leaking expansion joint during storage. When first opened in KAC, the axial gap was found to be in excess of the 1 inch maximum criterion, signaling the potential for degradation of the fiberboard overpack and drum. Within each package the highest fiberboard moisture levels were observed in the bottom layers, but no mold was observed in either package. Themore » fiberboard in each package appeared to retain good integrity consistent with non-degraded material. Minor corrosion was also observed on these drums along the lower stitch welds and on several closure bolts.« less

49 CFR 178.516 - Standards for fiberboard boxes.

Code of Federal Regulations, 2011 CFR

2011-10-01

... bending qualities. Fiberboard must be cut, creased without cutting through any thickness of fiberboard, and slotted so as to permit assembly without cracking, surface breaks, or undue bending. The fluting...

Characterization of Emissions from Open Burning of Meals ...

EPA Pesticide Factsheets

Emissions from burning current and candidate Meals Ready-to-Eat (MRE) packaging and shipping containers were characterized in an effort to assuage concerns that combustive disposal of waste at forward operating bases could pose an environmental or inhalation threat. Four types of container materials, both box and liners, including the currently used fiberboard, new corrugated fiberboard with Spektrakote polymer, new fiberboard without Spektrakote polymer, and the current fiberboard without wet strength were burned in an open burn test facility that simulated the burn pit disposal methods in Iraq and Afghanistan. MREs, including both current and proposed packaging materials, were added to a single container type to examine their effect on emissions. One quarter of the food was left in the packaging to represent unused meal components. The proposed packaging, consisting of a nano-composite polymer, was added in 25 % increments compared to traditional MRE packaging to create a range of usage levels. Emission factors, mass of pollutant per mass of burned material, were increased over the emission factors of the package containers themselves by the addition of the multi-component MREs, with the exception of Volatile Organic Compounds (VOCs). In general, little distinction was observed when comparing emission factors from the four container materials and when comparing the four MRE compositions. The majority of Particulate Matter (PM) emissions were of particles that

Destructive examination of shipping package 9975-02644

DOE Office of Scientific and Technical Information (OSTI.GOV)

Daugherty, W. L.

Destructive and non-destructive examinations have been performed on the components of shipping package 9975-02644 as part of a comprehensive SRS surveillance program for plutonium material stored in the K-Area Complex (KAC). During the field surveillance inspection of this package in KAC, three non-conforming conditions were noted: the axial gap of 1.389 inch exceeded the 1 inch maximum criterion, the exposed height of the lead shield was greater than the 4.65 inch maximum criterion, and the difference between the upper assembly inside height and the exposed height of the lead shield was less than the 0.425 inch minimum criterion. All threemore » of these observations relate to axial shrinkage of the lower fiberboard assembly. In addition, liquid water (condensation) was observed on the interior of the drum lid, the thermal blanket and the air shield.« less

WHITE PAPER: DEMONSTRATION OF EQUIVALENCY OF CANE AND SOFTWOOD BASED CELOTEX FOR 9975 PACKAGING

DOE Office of Scientific and Technical Information (OSTI.GOV)

Varble, J

2007-11-20

Cane-based Celotex{trademark} has been used extensively in various DOE packages as a thermal insulator and impact absorber. Cane-based Celotex{trademark} for the 9975 was manufactured by Knight-Celotex Fiberboard at their Marrero Plant in Louisiana. However, Knight-Celotex Fiberboard shut down their Marrero Plant in early 2007 due to impacts from hurricane Katrina and other economic factors. Therefore, cane-based Celotex{trademark} is no longer available for use in the manufacture of new 9975 packages. Knight-Celotex Fiberboard has Celotex{trademark} manufacturing plants in Danville, VA and Sunbury, PA that use softwood and hardwood, respectively, as a raw material in the manufacturing of Celotex{trademark}. The purpose ofmore » this White Paper is to demonstrate that softwood-based Celotex{trademark} from the Knight-Celotex Danville Plant has performance equivalent to cane-based Celotex{trademark} from the Knight-Celotex Marrero Plant for transportation in a 9975 package.« less

9975 Shipping package component long-term degradation rates

DOE Office of Scientific and Technical Information (OSTI.GOV)

Daugherty, W. L.

Special nuclear materials are being stored in the K-Area Complex using 3013 containers that are held within Model 9975 shipping packages. The service life for these packages in storage was recently increased from 15 to 20 years, since some of these packages have been stored for nearly 15 years. A strategy is also being developed whereby such storage might be extended beyond 20 years. This strategy is based on recent calculations that support acceptable 9975 package performance for 20 years with internal heat loads up to 19 watts, and identifies a lower heat load limit for which the package componentsmore » should degrade at half the bounding rate or less, thus doubling the effective storage life for these lower wattage packages. The components of the 9975 package that are sensitive to aging under storage conditions are the fiberboard overpack and the O-ring seals, although some degradation of the lead shield and outer drum are also possible. This report summarizes degradation rates applicable to lower heat load storage conditions. In particular, the O-ring seals should provide leak-tight performance for more than 40 years in packages for which their maximum temperature is ≤135 °F. Similarly, the fiberboard should remain acceptable in performance of its required safety functions for up to 40 years in packages with a maximum fiberboard temperature ≤125 °F.« less

Technique for in-place welding of aluminum backed up by a combustible material

NASA Technical Reports Server (NTRS)

Spagnuolo, A. C.

1971-01-01

Welding external aluminum jacket, tightly wrapped around inner layer of wood composition fiberboard, in oxygen free environment prevents combustion and subsequent damage to underlying fiberboard. Technique also applies to metal cutting in similar assemblies without disassembly to remove combustible materials from welding heat proximity.

49 CFR 178.980 - Stacking test.

Code of Federal Regulations, 2013 CFR

2013-10-01

... for transportation and no loss of contents. (2) For fiberboard or wooden Large Packagings, there may be no loss of contents and no permanent deformation that renders the whole Large Packaging, including... deterioration which renders the Large Packaging unsafe for transportation and no loss of contents. (4) For the...

49 CFR 178.980 - Stacking test.

Code of Federal Regulations, 2014 CFR

2014-10-01

... for transportation and no loss of contents. (2) For fiberboard or wooden Large Packagings, there may be no loss of contents and no permanent deformation that renders the whole Large Packaging, including... deterioration which renders the Large Packaging unsafe for transportation and no loss of contents. (4) For the...

49 CFR 178.609 - Test requirements for packagings for infectious substances.

Code of Federal Regulations, 2010 CFR

2010-10-01

... paragraph (c), which, for test purposes, categorizes packagings according to their material characteristics... performance may be rapidly affected by moisture; plastics that may embrittle at low temperature; and other... the appropriate test. Table I—Tests Required Material of Outer packaging Fiberboard Plastics Other...

49 CFR 173.171 - Smokeless powder for small arms.

Code of Federal Regulations, 2013 CFR

2013-10-01

... any one box (one package) must not exceed 7.3 kg (16 pounds). [Amdt. 173-224, 55 FR 52643, Dec. 21...) net mass in: (1) One rail car, motor vehicle, or cargo-only aircraft; or (2) One freight container on... inner packagings not exceeding 3.6 kg (8 pounds) net mass and outer packaging of UN 4G fiberboard boxes...

49 CFR 173.193 - Bromoacetone, methyl bromide, chloropicrin and methyl bromide or methyl chloride mixtures, etc.

Code of Federal Regulations, 2012 CFR

2012-10-01

... packaged as follows in wooden boxes (4C1, 4C2, 4D or 4F) with inner glass receptacles or tubes in... material. Total amount of liquid in the outer box must not exceed 11 kg (24 pounds). Packagings must... bromide mixtures containing up to 2% chloropicrin must be packaged in 4G fiberboard boxes with inside...

49 CFR 173.193 - Bromoacetone, methyl bromide, chloropicrin and methyl bromide or methyl chloride mixtures, etc.

Code of Federal Regulations, 2011 CFR

2011-10-01

... packaged as follows in wooden boxes (4C1, 4C2, 4D or 4F) with inner glass receptacles or tubes in... material. Total amount of liquid in the outer box must not exceed 11 kg (24 pounds). Packagings must... bromide mixtures containing up to 2% chloropicrin must be packaged in 4G fiberboard boxes with inside...

49 CFR 178.930 - Standards for fiberboard Large Packagings.

Code of Federal Regulations, 2013 CFR

2013-10-01

... puncture resistance of 15 Joules (11 foot-pounds of energy) measured according to ISO 3036 (IBR, see § 171... in handling and transport. Where a detachable pallet is used, its top surface must be free from protrusions that might damage the Large Packaging. (3) Strengthening devices, such as timber supports to...

49 CFR 178.930 - Standards for fiberboard Large Packagings.

Code of Federal Regulations, 2010 CFR

2010-10-01

... puncture resistance of 15 Joules (11 foot-pounds of energy) measured according to ISO 3036 (IBR, see § 171... in handling and transport. Where a detachable pallet is used, its top surface must be free from protrusions that might damage the Large Packaging. (3) Strengthening devices, such as timber supports to...

49 CFR 178.930 - Standards for fiberboard Large Packagings.

Code of Federal Regulations, 2011 CFR

2011-10-01

... puncture resistance of 15 Joules (11 foot-pounds of energy) measured according to ISO 3036 (IBR, see § 171... in handling and transport. Where a detachable pallet is used, its top surface must be free from protrusions that might damage the Large Packaging. (3) Strengthening devices, such as timber supports to...

49 CFR 178.930 - Standards for fiberboard Large Packagings.

Code of Federal Regulations, 2012 CFR

2012-10-01

... puncture resistance of 15 Joules (11 foot-pounds of energy) measured according to ISO 3036 (IBR, see § 171... in handling and transport. Where a detachable pallet is used, its top surface must be free from protrusions that might damage the Large Packaging. (3) Strengthening devices, such as timber supports to...

49 CFR 178.930 - Standards for fiberboard Large Packagings.

Code of Federal Regulations, 2014 CFR

2014-10-01

... puncture resistance of 15 Joules (11 foot-pounds of energy) measured according to ISO 3036 (IBR, see § 171... in handling and transport. Where a detachable pallet is used, its top surface must be free from protrusions that might damage the Large Packaging. (3) Strengthening devices, such as timber supports to...

49 CFR 178.502 - Identification codes for packagings.

Code of Federal Regulations, 2013 CFR

2013-10-01

...” means a jerrican. (iv) “4” means a box. (v) “5” means a bag. (vi) “6” means a composite packaging. (vii... natural wood. (iv) “D” means plywood. (v) “F” means reconstituted wood. (vi) “G” means fiberboard. (vii... (other than steel or aluminum). (xi) “P” means glass, porcelain or stoneware. (3) A numeral indicating...

49 CFR 178.502 - Identification codes for packagings.

Code of Federal Regulations, 2014 CFR

2014-10-01

...” means a jerrican. (iv) “4” means a box. (v) “5” means a bag. (vi) “6” means a composite packaging. (vii... natural wood. (iv) “D” means plywood. (v) “F” means reconstituted wood. (vi) “G” means fiberboard. (vii... (other than steel or aluminum). (xi) “P” means glass, porcelain or stoneware. (3) A numeral indicating...

49 CFR 178.502 - Identification codes for packagings.

Code of Federal Regulations, 2011 CFR

2011-10-01

...” means a jerrican. (iv) “4” means a box. (v) “5” means a bag. (vi) “6” means a composite packaging. (vii... natural wood. (iv) “D” means plywood. (v) “F” means reconstituted wood. (vi) “G” means fiberboard. (vii... (other than steel or aluminum). (xi) “P” means glass, porcelain or stoneware. (3) A numeral indicating...

49 CFR 178.502 - Identification codes for packagings.

Code of Federal Regulations, 2012 CFR

2012-10-01

...” means a jerrican. (iv) “4” means a box. (v) “5” means a bag. (vi) “6” means a composite packaging. (vii... natural wood. (iv) “D” means plywood. (v) “F” means reconstituted wood. (vi) “G” means fiberboard. (vii... (other than steel or aluminum). (xi) “P” means glass, porcelain or stoneware. (3) A numeral indicating...

78 FR 3967 - Notice of Application for Special Permits

Federal Register 2010, 2011, 2012, 2013, 2014

2013-01-17

...). transportation in Branchburg, NJ. commerce of PG II corrosive materials described as Potassium Hydroxide Solution, UN 1814 and Sodium Hydroxide Solution, UN 1824 in a UN 50G Fiberboard Large Packaging. (modes 1, 2, 3...

Lumber and panel products consumption for packaging and shipping in the United States, perspective for the 1980`s

Treesearch

D. B. McKeever; H. E. Dickerhoof

Trends in demand for lumber and panel products in packaging and materials handling are examined both for the past and the future. Effects of recent technological developments and innovations such as molded particleboard pallets, medium-density fiberboard pallets, and plywood pallets, are analyzed. Increased use of pallets is seen as the main reason for the expected...

Analysis to evaluate predictors of fiberboard aging to guide surveillance sampling for the 9975 life extension program

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kelly, Elizabeth J.; Daugherty, William L.; Hackney, Elizabeth R.

During surveillance of the 9975 shipping package at the Savannah River Site K-Area Complex, several package dimensions are recorded. The analysis described in this report shows that, based on the current data analysis, two of these measurements, Upper Assembly Outer Diameter (UAOD) and Upper Assembly Inside Height (UAIH), do not have statistically significant aging trends regardless of wattage levels. In contrast, this analysis indicates that the measurement of Air Shield Gap (ASGap) does show a significant increase with age. It appears that the increase is greater for high wattage containers, but this result is dominated by two measurements from high-wattagemore » containers. For all three indicators, additional high-wattage, older containers need to be examined before any definitive conclusions can be reached. In addition, the current analysis indicates that ASGap measurements for low and medium wattage containers are increasing slowly over time. To reduce uncertainties and better capture the aging trend for these containers, additional low and medium wattage older containers should also be examined. Based on this analysis, surveillance guidance is to augment surveillance containers resulting from 3013 surveillance with 9975-focused sampling that targets older, high wattage containers and also includes some older, low and medium wattage containers. This focused sampling began in 2015 and will continue in 2016. The UAOD, UAIH and ASGap data are highly variable. It is possible that additional factors such as seasonal variation and packaging site location might reduce variability and be useful for focusing surveillance and predicting aging.« less

27 CFR 20.145 - Encased containers.

Code of Federal Regulations, 2010 CFR

2010-04-01

... 27 Alcohol, Tobacco Products and Firearms 1 2010-04-01 2010-04-01 false Encased containers. 20.145... Denatured Alcohol § 20.145 Encased containers. Completely denatured alcohol may be packaged by distributors in unlabeled containers which are completely encased in wood, fiberboard, or similar material so that...

49 CFR 178.603 - Drop test.

Code of Federal Regulations, 2010 CFR

2010-10-01

... drums, Plastic drums and Jerricans, Composite packagings which are in the shape of a drum Six—(three for... of natural wood, Plywood boxes, Reconstituted wood boxes, Fiberboard boxes, Plastic boxes, Steel or... Administrator. (c) Special preparation of test samples for the drop test. (1) Testing of plastic drums, plastic...

49 CFR 173.334 - Organic phosphates mixed with compressed gas.

Code of Federal Regulations, 2014 CFR

2014-10-01

...) Cylinders may be packed in strong wooden boxes with valves or other closing devices protected from damage, with not more than twelve cylinders in one outside wooden box. An outer fiberboard box may be used when... must be overpacked in a box, crate, or other strong outer packaging conforming to the requirements of...

49 CFR 173.334 - Organic phosphates mixed with compressed gas.

Code of Federal Regulations, 2012 CFR

2012-10-01

...) Cylinders may be packed in strong wooden boxes with valves or other closing devices protected from damage, with not more than twelve cylinders in one outside wooden box. An outer fiberboard box may be used when... must be overpacked in a box, crate, or other strong outer packaging conforming to the requirements of...

49 CFR 173.334 - Organic phosphates mixed with compressed gas.

Code of Federal Regulations, 2013 CFR

2013-10-01

...) Cylinders may be packed in strong wooden boxes with valves or other closing devices protected from damage, with not more than twelve cylinders in one outside wooden box. An outer fiberboard box may be used when... must be overpacked in a box, crate, or other strong outer packaging conforming to the requirements of...

49 CFR 173.334 - Organic phosphates mixed with compressed gas.

Code of Federal Regulations, 2011 CFR

2011-10-01

...) Cylinders may be packed in strong wooden boxes with valves or other closing devices protected from damage, with not more than twelve cylinders in one outside wooden box. An outer fiberboard box may be used when... must be overpacked in a box, crate, or other strong outer packaging conforming to the requirements of...

78 FR 2416 - Notice of Issuance of Final Determination Concerning Rybix® (Tramadol Hydrochloride) Tablets

Federal Register 2010, 2011, 2012, 2013, 2014

2013-01-11

... for the management of moderate to moderately severe pain in adults. The active pharmaceutical... fiberboard drums. The fourth stage of French manufacturing is packaging in child- resistant blister packs...) in the case of an article which consists in whole or in part of materials from another country or...

75 FR 10464 - Certain Pasta from Italy: Notice of Partial Rescission of Antidumping Duty Administrative Review...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-03-08

... order are shipments of certain non-egg dry pasta in packages of five pounds four ounces or less, whether... percent egg white. The pasta covered by this scope is typically sold in the retail market, in fiberboard... scope of this order are refrigerated, frozen, or canned pastas, as well as all forms of egg pasta, with...

49 CFR 173.162 - Gallium.

Code of Federal Regulations, 2011 CFR

2011-10-01

... must be packed in wood boxes (4C1, 4C2, 4D, 4F), fiberboard boxes (4G), plastic boxes (4H1, 4H2), fiber... fiber (1G) or steel (1A2) drums, which are lined with leak-tight, puncture-resistant material. Bags and... employed. If dry ice is used, the outer packaging must permit the release of carbon dioxide gas. (c...

49 CFR 173.162 - Gallium.

Code of Federal Regulations, 2010 CFR

2010-10-01

... must be packed in wood boxes (4C1, 4C2, 4D, 4F), fiberboard boxes (4G), plastic boxes (4H1, 4H2), fiber... fiber (1G) or steel (1A2) drums, which are lined with leak-tight, puncture-resistant material. Bags and... employed. If dry ice is used, the outer packaging must permit the release of carbon dioxide gas. (c...

Emergency housing systems from three-dimensional engineered fiberboard : temporary building systems for lightweight, portable, easy-to-assemble, reusable, recyclable, and biodegradable structures

Treesearch

Jerrold E. Winandy; John F. Hunt; Christopher Turk; James R. Anderson

2006-01-01

Following natural disasters (such as hurricanes, tornados, or tsunamis), when civilians become displaced, or when military troops are deployed overseas, temporary housing is often a critical need. The USDA Forest Products Laboratory recently developed a lightweight, transportable, reusable, and recyclable biocomposite building material—threedimensional engineered...

49 CFR 173.193 - Bromoacetone, methyl bromide, chloropicrin and methyl bromide or methyl chloride mixtures, etc.

Code of Federal Regulations, 2014 CFR

2014-10-01

... fiberboard boxes with inside metal cans containing not over one pound each, or inside metal cans with a... packaged as follows in metal boxes (4A, 4B or 4N) or wooden boxes (4C1, 4C2, 4D or 4F) with inner glass... mm (0.5 inch) of absorbent material. Total amount of liquid in the outer box must not exceed 11 kg...

49 CFR 173.193 - Bromoacetone, methyl bromide, chloropicrin and methyl bromide or methyl chloride mixtures, etc.

Code of Federal Regulations, 2013 CFR

2013-10-01

... fiberboard boxes with inside metal cans containing not over one pound each, or inside metal cans with a... packaged as follows in metal boxes (4A, 4B or 4N) or wooden boxes (4C1, 4C2, 4D or 4F) with inner glass... mm (0.5 inch) of absorbent material. Total amount of liquid in the outer box must not exceed 11 kg...

FE analysis of creep and hygroexpansion response of a corrugated fiberboard to a moisture flow : a transient nonlinear analysis

Treesearch

Adeeb A. Rahman; Thomas J. Urbanik; Mustafa Mahamid

2006-01-01

This paper presents a model using finite element method to study the response of a typical commercial corrugated fiberboard due to an induced moisture function at one side of the fiberboard. The model predicts how the moisture diffusion will permeate through the fiberboard’s layers(medium and liners) providing information on moisture content at any given point...

Mechanical properties of wood-based composite materials

Treesearch

Zhiyong Cai; Robert J. Ross

2010-01-01

The term composite is used to describe any wood material bonded together with adhesives. The current product mix ranges from fiberboard to laminated beams and components. In this chapter, wood-based composite materials are classified into the following categories: panel products (plywood, oriented strandboard (OSB), particleboard, fiberboard, medium-density fiberboard...

Modification of wood fiber using steam

Treesearch

Roger Rowell; Sandra Lange; Jim McSweeny; Mark Davis

2002-01-01

High temperature steam treatment of wood fiber in a closed press during fiberboard pressing and then cooling the fiberboard while still under pressure to below the glass transition temperature of lignin, greatly increased the dimensional stability and decreased the hemicellulose content of the fiberboards produced. For example, after pressing aspen fiber four minutes...

Effects of recycled fiber on the properties of fiberboard panels

Treesearch

Chin-yin Hwang; Chung-yun Hse; Todd F. Shupe

2005-01-01

This study examined the effects of recycled and virgin wood fiber on the properties of fiberboard. Replacing virgin fiber with recycled fiber adversely affected physical and mechanical properties of fiberboard. Bending properties and dimensional stability were linearly dependent on virgin fiber ratios. Based on strength properties, panels with 20 and 40 percent...

Smoldering wave-front velocity in fiberboard

Treesearch

John J. Brenden; Erwin L. Schaffer

1980-01-01

In fiberboard, the phenomena of smoldering can be visualized as decomposition resulting from the motion of a thermal wave-front through the material. The tendency to smolder is then directly proportional to the velocity of the front. Velocity measurements were made on four fiberboards and were compared to values given in the literature for several substances....

Density profile and fiber alignment in fiberboard from three southern hardwoods

Treesearch

George E. Woodson

1977-01-01

Density profile and fiber orientation were evaluated for their effects on selected mechanical properties of medium density fiberboard. Bending MOE and modulus of rigidity were predicted from density profiles established by x-ray radiography. Orthotropic ratios ranged from 1.19 to 2.32 for electrically aligned fiberboards from three southern hardwoods. Off-axis tensile...

Dynamic tension testing equipment for paperboard and corrugated fiberboard

Treesearch

W. D. Godshall

1965-01-01

The objective of this work was to develop a method, the testing equipment, and the instrumentation with which dynamic stress-strain information may be obtained for paperboards and built-up corrugated fiberboards as used in corrugated fiberboard containers. Much information is available on the properties of these materials when subjected to static or low rates of...

Production of fiberboard using corn stalk pretreated with white-rot fungus Trametes hirsute by hot pressing without adhesive.

PubMed

Wu, Jianguo; Zhang, Xin; Wan, Jilin; Ma, Fuying; Tang, Yong; Zhang, Xiaoyu

2011-12-01

Corn stalk pretreated with white-rot fungus Trametes hirsute was used to produce fiberboard by hot pressing without adhesive. The moduli of rupture and elasticity of the corn-stalk-based fiberboard were increased 3.40- and 8.87-fold when bio-pretreated rather than untreated corn stalk was used. Fourier transform infra-red spectroscopy, X-ray diffraction, and chemical analysis showed that bio-pretreated corn stalk increased the mechanical properties of the fiberboard because it had more than twice the number of hydroxyl group, an 18% higher crystallinity, and twice the polysaccharide content of untreated corn stalk. Its laccase content was 4.65 ± 0.38 U/g. Corn stalk-based fiberboard production did not require adhesives, thus eliminating a potential source of toxic emissions such as formaldehyde gas. Copyright © 2011 Elsevier Ltd. All rights reserved.

Moisture diffusion through a corrugated fiberboard under compressive loading : its deformation and stiffness response

Treesearch

Adeeb A. Rahman; Thomas J. Urbanik; Mustafa Mahamid

2002-01-01

This research develops a model using finite element to study the response of a panel made of a typical commercial corrugated fireboard due to an induced moisture function at one side of the fiberboard. The model predicts how the moisture diffusion will permeate through the fiberboard's layers (medium and liners) providing information on moisture content at any...

Temperature environment for 9975 packages stored in KAC

DOE Office of Scientific and Technical Information (OSTI.GOV)

Daugherty, W. L.

Plutonium materials are stored in the K Area Complex (KAC) in shipping packages, typically the 9975 shipping package. In order to estimate realistic degradation rates for components within the shipping package (i.e. the fiberboard overpack and O-ring seals), it is necessary to understand actual facility temperatures, which can vary daily and seasonally. Relevant facility temperature data available from several periods throughout its operating history have been reviewed. The annual average temperature within the Crane Maintenance Area has ranged from approximately 70 to 74 °F, although there is significant seasonal variation and lesser variation among different locations within the facility. Themore » long-term average degradation rate for 9975 package components is very close to that expected if the component were to remain continually at the annual average temperature. This result remains valid for a wide range of activation energies (which describes the variation in degradation rate as the temperature changes), if the activation energy remains constant over the seasonal range of component temperatures. It is recommended that component degradation analyses and service life estimates incorporate these results. Specifically, it is proposed that future analyses assume an average facility ambient air temperature of 94 °F. This value is bounding for all packages, and includes margin for several factors such as increased temperatures within the storage arrays, the addition of more packages in the future, and future operational changes.« less

Impact of Thermomechanical Fiber Pre-Treatment Using Twin-Screw Extrusion on the Production and Properties of Renewable Binderless Coriander Fiberboards.

PubMed

Uitterhaegen, Evelien; Labonne, Laurent; Merah, Othmane; Talou, Thierry; Ballas, Stéphane; Véronèse, Thierry; Evon, Philippe

2017-07-17

The aim of this study consisted of manufacturing renewable binderless fiberboards from coriander straw and a deoiled coriander press cake, thus at the same time ensuring the valorization of crop residues and process by-products. The press cake acted as a natural binder inside the boards owing to the thermoplastic behavior of its protein fraction during thermopressing. The influence of different fiber-refining methods was evaluated and it was shown that a twin-screw extrusion treatment effectively improved fiber morphology and resulted in fiberboards with enhanced performance as compared to a conventional grinding process. The best fiberboard was produced with extrusion-refined straw using a 0.4 liquid/solid (L/S) ratio and with 40% press cake addition. The water sensitivity of the boards was effectively reduced by 63% through the addition of an extrusion raw material premixing operation and thermal treatment of the panels at 200 °C, resulting in materials with good performance showing a flexural strength of 29 MPa and a thickness swelling of 24%. Produced without the use of any chemical adhesives, these fiberboards could thus present viable, sustainable alternatives for current commercial wood-based materials such as oriented strand board, particleboard and medium-density fiberboard, with high cost-effectiveness.

Impact of Thermomechanical Fiber Pre-Treatment Using Twin-Screw Extrusion on the Production and Properties of Renewable Binderless Coriander Fiberboards

PubMed Central

Uitterhaegen, Evelien; Labonne, Laurent; Merah, Othmane; Talou, Thierry; Ballas, Stéphane; Véronèse, Thierry

2017-01-01

The aim of this study consisted of manufacturing renewable binderless fiberboards from coriander straw and a deoiled coriander press cake, thus at the same time ensuring the valorization of crop residues and process by-products. The press cake acted as a natural binder inside the boards owing to the thermoplastic behavior of its protein fraction during thermopressing. The influence of different fiber-refining methods was evaluated and it was shown that a twin-screw extrusion treatment effectively improved fiber morphology and resulted in fiberboards with enhanced performance as compared to a conventional grinding process. The best fiberboard was produced with extrusion-refined straw using a 0.4 liquid/solid (L/S) ratio and with 40% press cake addition. The water sensitivity of the boards was effectively reduced by 63% through the addition of an extrusion raw material premixing operation and thermal treatment of the panels at 200 °C, resulting in materials with good performance showing a flexural strength of 29 MPa and a thickness swelling of 24%. Produced without the use of any chemical adhesives, these fiberboards could thus present viable, sustainable alternatives for current commercial wood-based materials such as oriented strand board, particleboard and medium-density fiberboard, with high cost-effectiveness. PMID:28714928

9975 SHIPPING PACKAGE LIFE EXTENSION SURVEILLANCE PROGRAM RESULTS SUMMARY

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dunn, K.; Daugherty, W.; Hackney, B.

2011-05-27

Results from the 9975 shipping package Storage and Surveillance Program at the Savannah River Site (SRS) are summarized for justification to extend the life of the 9975 packages currently stored in the K-Area Complex (KAC). This justification is established with the stipulation that surveillance activities will continue throughout the extended time to ensure the continued integrity of the 9975 materials of construction and to further understand the currently identified degradation mechanisms. The 10 year storage life justification was developed prior to storage. A subsequent report was later used to validate the qualification of the 9975 shipping packages for 10 yearsmore » in storage. However the qualification for the storage period was provided by the monitoring requirements of the 9975 Storage and Surveillance Program. This report summarizes efforts to determine a new safe storage limit for the 9975 shipping package based on the surveillance data collected since 2005 when the 9975 Storage and Surveillance Program began. The Program has demonstrated that the 9975 package has a robust design that can perform under a variety of conditions. The primary emphasis of the on-going 9975 Storage and Surveillance Program is an aging study of the 9975 Viton{reg_sign} containment vessel O-rings and the Celotex{reg_sign} fiberboard thermal insulation at bounding conditions of radiation, elevated temperatures and/or elevated humidity.« less

7 CFR 2902.19 - Composite panels.

Code of Federal Regulations, 2011 CFR

2011-01-01

...; and Signage. USDA is requesting that manufacturers of these qualifying biobased products provide... EPA-designated laminated paperboard, structural fiberboard, shower and restroom dividers, and signage... laminated paperboard and structural fiberboard, shower and restroom dividers, and signage containing...

7 CFR 2902.19 - Composite panels.

Code of Federal Regulations, 2010 CFR

2010-01-01

...; and Signage. USDA is requesting that manufacturers of these qualifying biobased products provide... EPA-designated laminated paperboard, structural fiberboard, shower and restroom dividers, and signage... laminated paperboard and structural fiberboard, shower and restroom dividers, and signage containing...

49 CFR 178.508 - Standards for fiber drums.

Code of Federal Regulations, 2011 CFR

2011-10-01

... be constructed of multiple plies of heavy paper or fiberboard (without corrugations) firmly glued or laminated together and may include one or more protective layers of bitumen, waxed kraft paper, metal foil, plastic material, or similar materials. (2) Heads must be of natural wood, fiberboard, metal, plywood...

49 CFR 178.508 - Standards for fiber drums.

Code of Federal Regulations, 2014 CFR

2014-10-01

... be constructed of multiple plies of heavy paper or fiberboard (without corrugations) firmly glued or laminated together and may include one or more protective layers of bitumen, waxed kraft paper, metal foil, plastic material, or similar materials. (2) Heads must be of natural wood, fiberboard, metal, plywood...

49 CFR 178.508 - Standards for fiber drums.

Code of Federal Regulations, 2013 CFR

2013-10-01

... be constructed of multiple plies of heavy paper or fiberboard (without corrugations) firmly glued or laminated together and may include one or more protective layers of bitumen, waxed kraft paper, metal foil, plastic material, or similar materials. (2) Heads must be of natural wood, fiberboard, metal, plywood...

49 CFR 178.508 - Standards for fiber drums.

Code of Federal Regulations, 2012 CFR

2012-10-01

... be constructed of multiple plies of heavy paper or fiberboard (without corrugations) firmly glued or laminated together and may include one or more protective layers of bitumen, waxed kraft paper, metal foil, plastic material, or similar materials. (2) Heads must be of natural wood, fiberboard, metal, plywood...

JPRS Report, East Europe

DTIC Science & Technology

1990-05-09

agree- The fiberboard factory in Karlin has incredibly upped its ment with a Swedish company, IKEA , for leasing from prices, so we told them "thanks but...other furniture factories and the IKEA off. company, building a fiberboard plant in Czarnkow and [ZYCIE WARSZAWY] What has been this year like, so

49 CFR 178.708 - Standards for fiberboard IBCs.

Code of Federal Regulations, 2013 CFR

2013-10-01

...) Construction requirements for fiberboard IBCs are as follows: (1) Top lifting devices are prohibited in... foot-pounds of energy) measured according to ISO 3036 (IBR, see § 171.7 of this subchapter). (ii.... Where a detachable pallet is used, its top surface must be free from sharp protrusions that might damage...

49 CFR 178.708 - Standards for fiberboard IBCs.

Code of Federal Regulations, 2011 CFR

2011-10-01

...) Construction requirements for fiberboard IBCs are as follows: (1) Top lifting devices are prohibited in... foot-pounds of energy) measured according to ISO 3036 (IBR, see § 171.7 of this subchapter). (ii.... Where a detachable pallet is used, its top surface must be free from sharp protrusions that might damage...

49 CFR 178.708 - Standards for fiberboard IBCs.

Code of Federal Regulations, 2014 CFR

2014-10-01

...) Construction requirements for fiberboard IBCs are as follows: (1) Top lifting devices are prohibited in... foot-pounds of energy) measured according to ISO 3036 (IBR, see § 171.7 of this subchapter). (ii.... Where a detachable pallet is used, its top surface must be free from sharp protrusions that might damage...

49 CFR 178.708 - Standards for fiberboard IBCs.

Code of Federal Regulations, 2012 CFR

2012-10-01

...) Construction requirements for fiberboard IBCs are as follows: (1) Top lifting devices are prohibited in... foot-pounds of energy) measured according to ISO 3036 (IBR, see § 171.7 of this subchapter). (ii.... Where a detachable pallet is used, its top surface must be free from sharp protrusions that might damage...

Bamboo fiberboards and attapulgite : does it lead to an improvement of humidity control in buildings?

NASA Astrophysics Data System (ADS)

Nguyen, D. M.; Grillet, A. C.; Goldin, T.; Hanh Diep, T. M.; Woloszyn, M.

2018-04-01

In order to save energy used to heat or cool buildings and to improve the inhabitants comfort, control of humidity inside buildings must be improved. This can be done by using buffering materials able to absorb and release moisture when necessary. Natural fibers and mineral absorbent are good candidates to manufacture such materials. The aim of this research is to mix bamboo fibers with attapulgite to evaluate the influence of this mineral absorbent on the hygric behavior of the fiberboards. The hygric properties are slightly improved by the attapulgite and thus bamboo fiberboards can be used as building insulation materials able to participate to the indoor moisture control.

49 CFR 178.708 - Standards for fiberboard IBCs.

Code of Federal Regulations, 2010 CFR

2010-10-01

... part of it. (c) Construction requirements for fiberboard IBCs are as follows: (1) Top lifting devices... puncture resistance of 15 Joules (11 foot-pounds of energy) measured according to ISO 3036 (IBR, see § 171... stability in handling and transport. Where a detachable pallet is used, its top surface must be free from...

Properties of medium-density fiberboard produced in an oil-heated laboratory press

Treesearch

O. Suchsland; G.E. Woodson

1976-01-01

Medium-density fiberboards from pressurized double-disk refined fibers have a close correlation between layer density and layer dynamic modulus of elasticity. Density distribution over the thickness was readily controlled by manipulating platen temperature and applied pressure. Thus, overall modulus of elasticity could be adjusted. In contrast to modulus of elasticity...

Optimum fiber distribution in singlewall corrugated fiberboard

Treesearch

Millard W. Johnson; Thomas J. Urbanik; William E. Denniston

1979-01-01

Determining optimum distribution of fiber through rational design of corrugated fiberboard could result in significant reductions in fiber required to meet end-use conditions, with subsequent reductions in price pressure and extension of the softwood timber supply. A theory of thin plates under large deformations is developed that is both kinematically and physically...

Properties of bio-based medium density fiberboard

Treesearch

Sangyeob Lee; Todd F. Shupe; Chung Y. Hse

2006-01-01

In order to utilize agricultural waste fibers as an alternative resource for composites, a number of variables were investigated to determine whether the mechanical and physical properties of agro-based fiberboard could be improved. Fibers were classified into four different mesh sizes and used to evaluated the effect of fiber size on the mechanical and physical...

Utilization of Chinese tallow tree and bagasse for medium density fiberboard

Treesearch

Sangyeob Lee; Todd F. Shupe; Chung Y. Hse

2004-01-01

The objective of this research was to investigate various adhesive systems and determine the best composite formulation for selected mechanical and physical properties of medium density fiberboard (MDF) made from wood and bagasse fibers. This study investigated opportunities ofbiomass utilization for natural fiber-based composites from agricultural (bagasse) and...

Mechanical and physical properties of agro-based fiberboard

Treesearch

S. Lee; T.F. Shupe; C.Y. Hse

2006-01-01

In order to better utilize agricultural fibers as an alternative resource for composite panels, several variables were investigated to improve mechanical and physical properties of agm-based fiberboard. This study focused on the effect of fiber morphology, slenderness ratios (UD), and fiber mixing combinations on panel properties. The panel construction types were also...

Galactoglucomannan Oligosaccharides (GGMO) from a Molasses Byproduct of Pine (Pinus taeda) Fiberboard Production

USDA-ARS?s Scientific Manuscript database

“Temulose” is the trade name for a water-soluble molasses produced on a large scale (300 - 400 tonnes per year) as a byproduct of the fiberboard industry. The feedstock for temulose is predominantly a single species of pine (Pinus taeda) grown and harvested in stands in southeastern Texas. Because...

Aldehyde emissions from particleboard and medium density fiberboard products

Treesearch

Melissa G. D. Baumann; Linda F. Lorenz; Stuart A. Batterman; Guo-Zheng Zhang

2000-01-01

Indoor air quality problems resulting from the emission of volatile organic compounds (VOCs) have become an issue of increasing concern. Emissions from building and furnishing materials, which are frequently constructed from particleboard and medium density fiberboard (MDF), are a potentially important contributor of indoor VOCs. In this research, VOC emissions from...

Localization of adenovirus morphogenesis players, together with visualization of assembly intermediates and failed products, favor a model where assembly and packaging occur concurrently at the periphery of the replication center

PubMed Central

2017-01-01

Adenovirus (AdV) morphogenesis is a complex process, many aspects of which remain unclear. In particular, it is not settled where in the nucleus assembly and packaging occur, and whether these processes occur in a sequential or a concerted manner. Here we use immunofluorescence and immunoelectron microscopy (immunoEM) to trace packaging factors and structural proteins at late times post infection by either wildtype virus or a delayed packaging mutant. We show that representatives of all assembly factors are present in the previously recognized peripheral replicative zone, which therefore is the AdV assembly factory. Assembly intermediates and abortive products observed in this region favor a concurrent assembly and packaging model comprising two pathways, one for capsid proteins and another one for core components. Only when both pathways are coupled by correct interaction between packaging proteins and the genome is the viral particle produced. Decoupling generates accumulation of empty capsids and unpackaged cores. PMID:28448571

Components of Adenovirus Genome Packaging

PubMed Central

Ahi, Yadvinder S.; Mittal, Suresh K.

2016-01-01

Adenoviruses (AdVs) are icosahedral viruses with double-stranded DNA (dsDNA) genomes. Genome packaging in AdV is thought to be similar to that seen in dsDNA containing icosahedral bacteriophages and herpesviruses. Specific recognition of the AdV genome is mediated by a packaging domain located close to the left end of the viral genome and is mediated by the viral packaging machinery. Our understanding of the role of various components of the viral packaging machinery in AdV genome packaging has greatly advanced in recent years. Characterization of empty capsids assembled in the absence of one or more components involved in packaging, identification of the unique vertex, and demonstration of the role of IVa2, the putative packaging ATPase, in genome packaging have provided compelling evidence that AdVs follow a sequential assembly pathway. This review provides a detailed discussion on the functions of the various viral and cellular factors involved in AdV genome packaging. We conclude by briefly discussing the roles of the empty capsids, assembly intermediates, scaffolding proteins, portal vertex and DNA encapsidating enzymes in AdV assembly and packaging. PMID:27721809

Adhesive in the buckling failure of corrugated fiberboard : a finite element investigation

Treesearch

Adeeb A. Rahman; Said M. Abubakr

1998-01-01

This research study proposed to include the glue material in a finite element model that represents the actual geometry and material properties of a corrugated fiberboard. The model is a detailed representation of the different components of the structure (adhesive, linerboard, medium) to perform buckling analysis of corrugated structures under compressive loads. The...

Effects of panel density and mat moisture content on processing medium density fiberboard

Treesearch

Zhiyong Cai; James H. Muehl; Jerrold E. Winandy

2006-01-01

Development of a fundamental understanding of heat transfer and resin curing during hot- pressing will help to optimize the manufacturing process of medium density fiberboard (MDF) allowing increased productivity, improved product quality, and enhanced durability. Effect of mat moisture content (MC) and panel density on performance of MDF panels, heat transfer,...

On the measurement of fiber orientation in fiberboard

Treesearch

Otto Suchsland; Charles W. McMillin

1983-01-01

An attempt to measure the vertical component of fiber orientation in fiberboard is described. The experiment is based on the obvious reduction of the furnish fiber length which occurs by cutting thin microtome sections of the board parallel to the board plane. Only when no vertical fiber orientation component is present will the fibers contained in these sections have...

Lightweight and Compostable Fiberboard for the Military

DTIC Science & Technology

2012-08-01

individual sheets with compression molding methods. The second approach examined different biodegradable coatings for paper formation which enhanced wet...strength properties of paper based products. The third approach identified effective coated corrugated alternatives that exhibited comparable...fiberboard containers to different environmental conditions. Analysis of variance of compression data as a function of moisture, insert design and paper

Decay and termite resistance of medium density fiberboard (MDF) made from different wood species

Treesearch

S. Nami Kartal; Frederick Green

2003-01-01

Medium density fiberboard (MDF) production worldwide is increasing due to the development of new manufacturing technologies. As a result, MDF products are increasingly utilized in traditional wood applications that require fungal and insect resistance. This study evaluated the ability of white and brown rot fungi and termites to decompose MDF consisting of different...

Medium density fiberboard from mixed southern hardwoods

Treesearch

George E. Woodson

1977-01-01

Medium-density fiberboards of acceptable quality were made from a mixture of barky chips from 14 southern hardwoods. Boards made from fiber refined at three different plate clearances did not vary significantly in bending, internal bond (IB), or linear expansion. but, lack of replications and the fact that the refiner was not loaded to capacity caused these results to...

Dry chips versus green chips as furnish for medium-density fiberboard

Treesearch

Paul H. Short; George E. Woodson; Duane E. Lyon

1978-01-01

The fiber characteristics and the physical and mechanical properties of medium-density fiberboard (MDF), manufactured with pressure-refined fiber from green and partially dried raw material, were analyzed to determine if dry wood chips made a better furnish than green wood chips. Pressure-refining dry material produced coarser fiber than those obtained from green...

Dry chips versus green chips as furnish for medium-density fiberboard

Treesearch

P.H. Short; G.E. Woodson; D.E. Lyon

1978-01-01

The fiber characteristics and the physical and mechanical properties of medium-density fiberboard (MDF), manufactured with pressure-refined fiber from green and partially dried raw material, were analyzed to determine if dry wood chips made a better furnish than green wood chips. Pressure-refined dry material produced coarser fiber than those obtained from green...

High-frequency and hot-platen curing of medium-density fiberboards

Treesearch

Robert R. Stevens; George E. Woodson

1977-01-01

The effects of two curing methods-high-frequencey heating and hot-platen heating-on the properties of a ureaformaldehyde-bonded medium-density fiberboard prepared with a southern-hardwoods furnish (50% southern read oak, 25% mockernut hickory, and 25% sweetgum) were studied. Boards of three densities-38, 44, and 50 lb./ft3-were cured by the two...

Effects of post heat-treatment on surface characteristics and adhesive bonding performance of medium density fiberboard

Treesearch

Nadir Ayrilimis; Jerrold E. Winandy

2009-01-01

A series of commercially manufactured medium density fiberboard (MDF) panels were exposed to a post-manufacture heat-treatment at various temperatures and durations using a hot press and just enough pressure to ensure firm contact between the panel and the press platens. Post-manufacture heat-treatment improved surface roughness of the exterior MDF panels. Panels...

Development of a bending stiffness model for wet process fiberboard

Treesearch

Chris Turk; John F. Hunt

2007-01-01

In traditional mechanics of materials, the stiffness of a beam or plate in bending is described by its cross-sectional shape as well as its material properties, primarily the modulus of elasticity. Previous work at the USDA Forest Products Laboratory, Madison, Wisconsin, has shown that modulus of elasticity has a strong correlation to the density of the fiberboard....

Effect of silvicultural practice and wood type on loblolly pine particleboard and medium density fiberboard properties

Treesearch

Todd F. Shupe; Chung Y. Hse; Elvin T. Choong; Leslie H. Groom

1999-01-01

he objective of this study was to determine the effect of five different silvicultural strategies and wood type on mechanical and physical properties of loblolly pine (Pinus taeda L.) particleboard and fiberboard. The furnish was prepared in an unconventional manner from innerwood and outerwood veneer for each stand. Modulus of rupture (MOR)...

New rapid method for determining edgewise compressive strength of corrugated fiberboard

Treesearch

John W. Koning

1986-01-01

The objective of this study was to determine if corrugated fiberboard specimens that had been necked down with a common router would yield acceptable edgewise compressive strength values. Tests were conducted on specimens prepared using a circular saw and router, and the results were compared with those obtained on specimens prepared according to TAPPI Test Method T...

High-frequency and hot-platen curing of medium-density fiberboards

Treesearch

R.R. Stevens; G.E. Woodson

1977-01-01

The effects of two curing methods- high-frequency heating and hot-platen heating- on the properties of a ure-formaldehyd-bonded medium-density fiberboard prepared with a southern-hardwoods furnish (50% southern red oak, 25% mockernut hickory, and 25% sweetgum) were studied. Boards of three densities- 38, 44, and 50 lb./ft.3- were cured by the two...

Three-dimensional engineered fiberboard : opportunities for the use of low valued timber and recycled material

Treesearch

John F. Hunt; David P. Harper; Katherine A. Friedrich

2004-01-01

Fiberboard sandwich panels constructed of a structural core with exterior skins can be produced with high strength and stiffness values that compare to other wood-based panels. At the same time, as much as two-thirds less material is used in the process compared to commercial wood composite products. This offers large savings in raw material and weight. The panel...

Effects of fiber processing on properties of fiber and fiberboard made from lodgepole pine treetops

Treesearch

John F. Hunt; Aziz Ahmed; Katherine Friedrich

2008-01-01

As a part of the National Fire Plan, the USDA Forest Service is conducting research to reduce the severity of forest fires through effective utilization of low-or no-value logging residues and forest thinnings. This report explores the effect of processing on the physical properties of the fibrous material and flat fiberboard panels made from small-diameter lodgepole...

3D engineered fiberboard : finite element analysis of a new building product

Treesearch

John F. Hunt

2004-01-01

This paper presents finite element analyses that are being used to analyze and estimate the structural performance of a new product called 3D engineered fiberboard in bending and flat-wise compression applications. A 3x3x2 split-plot experimental design was used to vary geometry configurations to determine their effect on performance properties. The models are based on...

Analysis of Cantilever-Beam Bending Stress Relaxation Properties of Thin Wood Composites

Treesearch

John F. Hunt; Houjiang Zhang; Yan Huang

2015-01-01

An equivalent strain method was used to analyze and determine material relaxation properties for specimens from particleboard, high density fiberboard, and medium density fiberboard. Cantilever beams were clamped and then deflected to 11 m and held for either 2 h or 3 h, while the load to maintain that deflection was measured vs. time. Plots of load relaxation for each...

Effect of oxalic acid pretreatment of wood chips on manufacturing medium-density fiberboard

Treesearch

Xianjun Li; Zhiyong Cai; Eric Horn; Jerrold E. Winandy

2011-01-01

The main objective of this study was to evaluate the effect of oxalic acid (OA) wood chips pretreatment prior to refining, which is done to reduce energy used during the refining process. Selected mechanical and physical performances of medium-density fiberboard (MDF) – internal bonding (IB), modulus of elasticity (MOE), modulus of rupture (MOR), water absorption (WA)...

Packaging signals in single-stranded RNA viruses: nature's alternative to a purely electrostatic assembly mechanism.

PubMed

Stockley, Peter G; Twarock, Reidun; Bakker, Saskia E; Barker, Amy M; Borodavka, Alexander; Dykeman, Eric; Ford, Robert J; Pearson, Arwen R; Phillips, Simon E V; Ranson, Neil A; Tuma, Roman

2013-03-01

The formation of a protective protein container is an essential step in the life-cycle of most viruses. In the case of single-stranded (ss)RNA viruses, this step occurs in parallel with genome packaging in a co-assembly process. Previously, it had been thought that this process can be explained entirely by electrostatics. Inspired by recent single-molecule fluorescence experiments that recapitulate the RNA packaging specificity seen in vivo for two model viruses, we present an alternative theory, which recognizes the important cooperative roles played by RNA-coat protein interactions, at sites we have termed packaging signals. The hypothesis is that multiple copies of packaging signals, repeated according to capsid symmetry, aid formation of the required capsid protein conformers at defined positions, resulting in significantly enhanced assembly efficiency. The precise mechanistic roles of packaging signal interactions may vary between viruses, as we have demonstrated for MS2 and STNV. We quantify the impact of packaging signals on capsid assembly efficiency using a dodecahedral model system, showing that heterogeneous affinity distributions of packaging signals for capsid protein out-compete those of homogeneous affinities. These insights pave the way to a new anti-viral therapy, reducing capsid assembly efficiency by targeting of the vital roles of the packaging signals, and opens up new avenues for the efficient construction of protein nanocontainers in bionanotechnology.

Effects of bark, density profile, and resin content on medium-density fiberboards from southern hardwoods

Treesearch

G.E. Woodson

1976-01-01

Pressure-regined barky fibers of hickory, sweetgum, and southern red oak had a greater percentage of fines than did refined bark-free fibers of these species. Inclusion of bark decreased tensile and bending strengths of fiberboards by 16 to 18 percent, MOE by 10 to 14 percent, and IB by 8 percent. Density profile of boards strongly influenced their bending properties...

Fiberboards treated with N’-N-(1, 8-Naphthalyl) hydroxylamine (NHA-Na), borax, and boric acid

Treesearch

Turgay Akbulut; S. Nami Kartal; Frederick Green

2004-01-01

This paper reports on the physical and mechanical properties and decay and termite resistance of fiberboard panels made from pine and beech treated with N’-N-(1, 8-Naphthalyl) hydroxylamine sodium salt(NHA-Na), borax, and boric acid at varying loadings. The panels were manufactured using 10 percent urea-formaldehyde resin and 1 percent NH4Cl. Mechanical and physical...

Fiberboard bending properties as a function of density, thickness, resin, and moisture content

Treesearch

John F. Hunt; Jane O' Dell; Chris Turk

2008-01-01

Fibers from treetop residues of lodgepole pine (Pinus contorta) and recycled old corrugated containers were used to fabricate wet-formed fiberboard panels over a range of densities from 300 to 1100 kg m-3, a thickness range from 1.3 to 4.8 mm, and phenolic resin contents from 0% to 4.5%. The panels were then tested after conditioning in 50% and 90% relative humidity (...

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

NASA Technical Reports Server (NTRS)

Ghaffaroam. Reza

2014-01-01

Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

Interactions between HIV-1 Gag and Viral RNA Genome Enhance Virion Assembly.

PubMed

Dilley, Kari A; Nikolaitchik, Olga A; Galli, Andrea; Burdick, Ryan C; Levine, Louis; Li, Kelvin; Rein, Alan; Pathak, Vinay K; Hu, Wei-Shau

2017-08-15

Most HIV-1 virions contain two copies of full-length viral RNA, indicating that genome packaging is efficient and tightly regulated. However, the structural protein Gag is the only component required for the assembly of noninfectious viruslike particles, and the viral RNA is dispensable in this process. The mechanism that allows HIV-1 to achieve such high efficiency of genome packaging when a packageable viral RNA is not required for virus assembly is currently unknown. In this report, we examined the role of HIV-1 RNA in virus assembly and found that packageable HIV-1 RNA enhances particle production when Gag is expressed at levels similar to those in cells containing one provirus. However, such enhancement is diminished when Gag is overexpressed, suggesting that the effects of viral RNA can be replaced by increased Gag concentration in cells. We also showed that the specific interactions between Gag and viral RNA are required for the enhancement of particle production. Taken together, these studies are consistent with our previous hypothesis that specific dimeric viral RNA-Gag interactions are the nucleation event of infectious virion assembly, ensuring that one RNA dimer is packaged into each nascent virion. These studies shed light on the mechanism by which HIV-1 achieves efficient genome packaging during virus assembly. IMPORTANCE Retrovirus assembly is a well-choreographed event, during which many viral and cellular components come together to generate infectious virions. The viral RNA genome carries the genetic information to new host cells, providing instructions to generate new virions, and therefore is essential for virion infectivity. In this report, we show that the specific interaction of the viral RNA genome with the structural protein Gag facilitates virion assembly and particle production. These findings resolve the conundrum that HIV-1 RNA is selectively packaged into virions with high efficiency despite being dispensable for virion assembly. Understanding the mechanism used by HIV-1 to ensure genome packaging provides significant insights into viral assembly and replication. Copyright © 2017 American Society for Microbiology.

9975 SHIPPING PACKAGE LIFE EXTENSION SURVEILLANCE PROGRAM RESULTS SUMMARY

DOE Office of Scientific and Technical Information (OSTI.GOV)

Daugherty, W.; Dunn, K.; Hackney, B.

2011-01-06

Results from the 9975 Surveillance Program at the Savannah River Site (SRS) are summarized for justification to extend the life of the 9975 packages currently stored in the K-Area Materials Storage (KAMS) facility from 10 years to 15 years. This justification is established with the stipulation that surveillance activities will continue throughout this extended time to ensure the continued integrity of the 9975 materials of construction and to further understand the currently identified degradation mechanisms. The current 10 year storage life was developed prior to storage. A subsequent report was later used to extend the qualification of the 9975 shippingmore » packages for 2 years for shipping plus 10 years for storage. However the qualification for the storage period was provided by the monitoring requirements of the Storage and Surveillance Program. This report summarizes efforts to determine a new safe storage limit for the 9975 shipping package based on the surveillance data collected since 2005 when the surveillance program began. KAMS is a zero-release facility that depends upon containment by the 9975 to meet design basis storage requirements. Therefore, to confirm the continued integrity of the 9975 packages while stored in KAMS, a 9975 Storage and Surveillance Program was implemented alongside the DOE required Integrated Surveillance Program (ISP) for 3013 plutonium-bearing containers. The 9975 Storage and Surveillance Program performs field surveillance as well as accelerated aging tests to ensure any degradation due to aging, to the extent that could affect packaging performance, is detected in advance of such degradation occurring in the field. The Program has demonstrated that the 9975 package has a robust design that can perform under a variety of conditions. As such the primary emphasis of the on-going 9975 Surveillance Program is an aging study of the 9975 Viton(reg.sign) GLT containment vessel O-rings and the Celotex(reg.sign) fiberboard thermal insulation at bounding conditions of radiation and elevated temperatures. Other materials of construction, however, are also discussed.« less

NASA DOD Lead Free Electronics Project

NASA Technical Reports Server (NTRS)

Kessel, Kurt R.

2008-01-01

The primary'technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIPD assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.

Changes in the chemical composition and spectroscopy of loblolly pine medium density fiberboard furnish as a function of age and refining pressure

Treesearch

Stephen S. Kelley; Thomas Elder; Leslie H. Groom

2005-01-01

Loblolly pine wood between the ages of 5-35 was refined into medium density fiberboard furnish at steam pressures from 2 to 18 bar, The effect of age and processing conditions on the properties of the fibers was assessed by wet chemical analyses, Near Infared Spectroscopy (NIR) and powder X-ray diffraction (XRD).In general ,the percentages of extractives and glucose...

49 CFR 178.358-6 - Typical assembly detail.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false Typical assembly detail. 178.358-6 Section 178.358-6 Transportation Other Regulations Relating to Transportation PIPELINE AND HAZARDOUS MATERIALS... PACKAGINGS Specifications for Packagings for Class 7 (Radioactive) Materials § 178.358-6 Typical assembly...

49 CFR 178.356-5 - Typical assembly detail.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false Typical assembly detail. 178.356-5 Section 178.356-5 Transportation Other Regulations Relating to Transportation PIPELINE AND HAZARDOUS MATERIALS... PACKAGINGS Specifications for Packagings for Class 7 (Radioactive) Materials § 178.356-5 Typical assembly...

Food System Trade Study for a Near-Term Mars Mission

NASA Technical Reports Server (NTRS)

Levri, Julie; Luna, Bernadette (Technical Monitor)

2000-01-01

This paper evaluates several food system options for a near-term Mars mission, based on plans for the 120-day BIO-Plex test. Food systems considered in the study are based on the International Space Station (ISS) Assembly Phase and Assembly Complete food systems. The four systems considered are: 1) ISS assembly phase food system (US portion) with individual packaging without salad production; 2) ISS assembly phase food system (US portion) with individual packaging, with salad production; 3) ISS assembly phase food system (US portion) with bulk packaging, with salad production; 4) ISS assembly complete food system (US portion) with bulk packaging with salad and refrigeration/freezing. The food system options are assessed using equivalent system mass (ESM), which evaluates each option based upon the mass, volume, power, cooling and crewtime requirements that are associated with each food system option. However, since ESM is unable to elucidate the differences in psychological benefits between the food systems, a qualitative evaluation of each option is also presented.

Depleted uranium as a backfill for nuclear fuel waste package

DOEpatents

Forsberg, Charles W.

1998-01-01

A method for packaging spent nuclear fuel for long-term disposal in a geological repository. At least one spent nuclear fuel assembly is first placed in an unsealed waste package and a depleted uranium fill material is added to the waste package. The depleted uranium fill material comprises flowable particles having a size sufficient to substantially fill any voids in and around the assembly and contains isotopically-depleted uranium in the +4 valence state in an amount sufficient to inhibit dissolution of the spent nuclear fuel from the assembly into a surrounding medium and to lessen the potential for nuclear criticality inside the repository in the event of failure of the waste package. Last, the waste package is sealed, thereby substantially reducing the release of radionuclides into the surrounding medium, while simultaneously providing radiation shielding and increased structural integrity of the waste package.

Modular assembly of chimeric phi29 packaging RNAs that support DNA packaging.

PubMed

Fang, Yun; Shu, Dan; Xiao, Feng; Guo, Peixuan; Qin, Peter Z

2008-08-08

The bacteriophage phi29 DNA packaging motor is a protein/RNA complex that can produce strong force to condense the linear-double-stranded DNA genome into a pre-formed protein capsid. The RNA component, called the packaging RNA (pRNA), utilizes magnesium-dependent inter-molecular base-pairing interactions to form ring-shaped complexes. The pRNA is a class of non-coding RNA, interacting with phi29 motor proteins to enable DNA packaging. Here, we report a two-piece chimeric pRNA construct that is fully competent in interacting with partner pRNA to form ring-shaped complexes, in packaging DNA via the motor, and in assembling infectious phi29 virions in vitro. This is the first example of a fully functional pRNA assembled using two non-covalently interacting fragments. The results support the notion of modular pRNA architecture in the phi29 packaging motor.

Depleted uranium as a backfill for nuclear fuel waste package

DOEpatents

Forsberg, C.W.

1998-11-03

A method is described for packaging spent nuclear fuel for long-term disposal in a geological repository. At least one spent nuclear fuel assembly is first placed in an unsealed waste package and a depleted uranium fill material is added to the waste package. The depleted uranium fill material comprises flowable particles having a size sufficient to substantially fill any voids in and around the assembly and contains isotopically-depleted uranium in the +4 valence state in an amount sufficient to inhibit dissolution of the spent nuclear fuel from the assembly into a surrounding medium and to lessen the potential for nuclear criticality inside the repository in the event of failure of the waste package. Last, the waste package is sealed, thereby substantially reducing the release of radionuclides into the surrounding medium, while simultaneously providing radiation shielding and increased structural integrity of the waste package. 6 figs.

Modular assembly of chimeric phi29 packaging RNAs that support DNA packaging

PubMed Central

Fang, Yun; Shu, Dan; Xiao, Feng; Guo, Peixuan; Qin, Peter Z.

2008-01-01

The bacteriophage phi29 DNA packaging motor is a protein/RNA complex that can produce strong force to condense the linear-double stranded DNA genome into a pre-formed protein capsid. The RNA component, called the packaging RNA (pRNA), utilizes magnesium-dependent intermolecular base-pairing interactions to form ring-shaped complexes. The pRNA is a class of non-coding RNA, interacting with phi29 motor proteins to enable DNA packaging. Here, we report a 2-piece chimeric pRNA construct that is fully competent in interacting with partner pRNA to form ring-shaped complexes, in packaging DNA via the motor, and in assembling infectious phi29 virions in vitro. This is the first example of a fully functional pRNA assembled using two non-covalently interacting fragments. The results support the notion of modular pRNA architecture in the phi29 packaging motor. PMID:18514064

NASA-DoD Lead-Free Electronics Project

NASA Technical Reports Server (NTRS)

Kessel, Kurt R.

2009-01-01

The primary technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with lead-free alloys, (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.

Industrial Base: Contractors Have Ability to Meet Requirements for Rations During Wartime

DTIC Science & Technology

1994-08-01

their pouches. Some assemblers purchase prepackaged items (e.g., crackers or applesauce ) if they lack in-house capacity. Generally, assemblers have...functional staging and packaging areas (e.g., meal pouch staging area, cracker packaging, accessory packaging, and applesauce packaging). Once food and...we requested that they provide us with the current total surge output for I month for each functional area (e.g., crackers, accessories, applesauce

Thermal Cycle Reliability and Failure Mechanisms of CCGA and PBGA Assemblies with and without Corner Staking

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2008-01-01

Area array packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic ball grid array (PBGA) and chip scale package assemblies, because of their wide usage for commercial applications, have been extensively reported on in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.However, very limited data is available for thermal cycling behavior of ceramic packages commonly used for the aerospace applications. For high reliability applications, numerous AAPs are available with an identical design pattern both in ceramic and plastic packages. This paper compares assembly reliability of ceramic and plastic packages with the identical inputs/outputs(I/Os) and pattern. The ceramic package was in the form of ceramic column grid array (CCGA) with 560 I/Os peripheral array with the identical pad design as its plastic counterpart.

Visual and x-ray inspection characteristics of eutectic and lead free assemblies

NASA Technical Reports Server (NTRS)

Ghaffarian, R.

2003-01-01

For high reliability applications, visual inspection has been the key technique for most conventional electronic package assemblies. Now, the use of x-ray technique has become an additional inspection requirement for quality control and detection of unique defects due to manufacturing of advanced electronic array packages such as ball grid array (BGAs) and chip scale packages (CSPs).

Study on basalt fiber parameters affecting fiber-reinforced mortar

NASA Astrophysics Data System (ADS)

Orlov, A. A.; Chernykh, T. N.; Sashina, A. V.; Bogusevich, D. V.

2015-01-01

This article considers the effect of different dosages and diameters of basalt fibers on tensile strength increase during bending of fiberboard-reinforced mortar samples. The optimal dosages of fiber, providing maximum strength in bending are revealed. The durability of basalt fiber in an environment of cement, by means of microscopic analysis of samples of fibers and fiberboard-reinforced mortar long-term tests is examined. The article also compares the behavior of basalt fiber in the cement stone environment to a glass one and reveals that the basalt fiber is not subject to destruction.

Evaluation of standardized sample collection, packaging, and decontamination procedures to assess cross-contamination potential during Bacillus anthracis incident response operations

PubMed Central

Calfee, M. Worth; Tufts, Jenia; Meyer, Kathryn; McConkey, Katrina; Mickelsen, Leroy; Rose, Laura; Dowell, Chad; Delaney, Lisa; Weber, Angela; Morse, Stephen; Chaitram, Jasmine; Gray, Marshall

2016-01-01

Sample collection procedures and primary receptacle (sample container and bag) decontamination methods should prevent contaminant transfer between contaminated and non-contaminated surfaces and areas during bio-incident operations. Cross-contamination of personnel, equipment, or sample containers may result in the exfiltration of biological agent from the exclusion (hot) zone and have unintended negative consequences on response resources, activities and outcomes. The current study was designed to: (1) evaluate currently recommended sample collection and packaging procedures to identify procedural steps that may increase the likelihood of spore exfiltration or contaminant transfer; (2) evaluate the efficacy of currently recommended primary receptacle decontamination procedures; and (3) evaluate the efficacy of outer packaging decontamination methods. Wet- and dry-deposited fluorescent tracer powder was used in contaminant transfer tests to qualitatively evaluate the currently-recommended sample collection procedures. Bacillus atrophaeus spores, a surrogate for Bacillus anthracis, were used to evaluate the efficacy of spray- and wipe-based decontamination procedures. Both decontamination procedures were quantitatively evaluated on three types of sample packaging materials (corrugated fiberboard, polystyrene foam, and polyethylene plastic), and two contamination mechanisms (wet or dry inoculums). Contaminant transfer results suggested that size-appropriate gloves should be worn by personnel, templates should not be taped to or removed from surfaces, and primary receptacles should be selected carefully. The decontamination tests indicated that wipe-based decontamination procedures may be more effective than spray-based procedures; efficacy was not influenced by material type but was affected by the inoculation method. Incomplete surface decontamination was observed in all tests with dry inoculums. This study provides a foundation for optimizing current B. anthracis response procedures to minimize contaminant exfiltration. PMID:27362274

Evaluation of standardized sample collection, packaging, and decontamination procedures to assess cross-contamination potential during Bacillus anthracis incident response operations.

PubMed

Calfee, M Worth; Tufts, Jenia; Meyer, Kathryn; McConkey, Katrina; Mickelsen, Leroy; Rose, Laura; Dowell, Chad; Delaney, Lisa; Weber, Angela; Morse, Stephen; Chaitram, Jasmine; Gray, Marshall

2016-12-01

Sample collection procedures and primary receptacle (sample container and bag) decontamination methods should prevent contaminant transfer between contaminated and non-contaminated surfaces and areas during bio-incident operations. Cross-contamination of personnel, equipment, or sample containers may result in the exfiltration of biological agent from the exclusion (hot) zone and have unintended negative consequences on response resources, activities and outcomes. The current study was designed to: (1) evaluate currently recommended sample collection and packaging procedures to identify procedural steps that may increase the likelihood of spore exfiltration or contaminant transfer; (2) evaluate the efficacy of currently recommended primary receptacle decontamination procedures; and (3) evaluate the efficacy of outer packaging decontamination methods. Wet- and dry-deposited fluorescent tracer powder was used in contaminant transfer tests to qualitatively evaluate the currently-recommended sample collection procedures. Bacillus atrophaeus spores, a surrogate for Bacillus anthracis, were used to evaluate the efficacy of spray- and wipe-based decontamination procedures. Both decontamination procedures were quantitatively evaluated on three types of sample packaging materials (corrugated fiberboard, polystyrene foam, and polyethylene plastic), and two contamination mechanisms (wet or dry inoculums). Contaminant transfer results suggested that size-appropriate gloves should be worn by personnel, templates should not be taped to or removed from surfaces, and primary receptacles should be selected carefully. The decontamination tests indicated that wipe-based decontamination procedures may be more effective than spray-based procedures; efficacy was not influenced by material type but was affected by the inoculation method. Incomplete surface decontamination was observed in all tests with dry inoculums. This study provides a foundation for optimizing current B. anthracis response procedures to minimize contaminant exfiltration.

Container for radioactive materials

DOEpatents

Fields, Stanley R.

1985-01-01

A container for housing a plurality of canister assemblies containing radioactive material and disposed in a longitudinally spaced relation within a carrier to form a payload package concentrically mounted within the container. The payload package includes a spacer for each canister assembly, said spacer comprising a base member longitudinally spacing adjacent canister assemblies from each other and a sleeve surrounding the associated canister assembly for centering the same and conducting heat from the radioactive material in a desired flow path.

Push plate, mounting assembly, circuit board, and method of assembling thereof for ball grid array packages

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vaughn, Mark R.; Montague, Stephen

A push plate that includes springs in the form of cantilever flexures and an inspection window is disclosed. The push plate provides a known, uniform, down force and minimal torque to a package to be tested. The cantilevers have a known, calculable down force producing stiffness. The window provides for viewing of the package during testing.

Retroviral Gag protein-RNA interactions: Implications for specific genomic RNA packaging and virion assembly.

PubMed

Olson, Erik D; Musier-Forsyth, Karin

2018-03-31

Retroviral Gag proteins are responsible for coordinating many aspects of virion assembly. Gag possesses two distinct nucleic acid binding domains, matrix (MA) and nucleocapsid (NC). One of the critical functions of Gag is to specifically recognize, bind, and package the retroviral genomic RNA (gRNA) into assembling virions. Gag interactions with cellular RNAs have also been shown to regulate aspects of assembly. Recent results have shed light on the role of MA and NC domain interactions with nucleic acids, and how they jointly function to ensure packaging of the retroviral gRNA. Here, we will review the literature regarding RNA interactions with NC, MA, as well as overall mechanisms employed by Gag to interact with RNA. The discussion focuses on human immunodeficiency virus type-1, but other retroviruses will also be discussed. A model is presented combining all of the available data summarizing the various factors and layers of selection Gag employs to ensure specific gRNA packaging and correct virion assembly. Copyright © 2018 Elsevier Ltd. All rights reserved.

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/bottom Termination Components (QFN/BTC) Package Trends and Reliability

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2014-01-01

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2014-01-01

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

Effect of thermal cycling ramp rate on CSP assembly reliability

NASA Technical Reports Server (NTRS)

Ghaffarian, R.

2001-01-01

A JPL-led chip scale package consortium of enterprises recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages for a variety of projects. The experience of the consortium in building more than 150 test vehicle assemblies, single and double sided multilayer PWBs, and the environmental test results has now been published as a chip scale package guidelines document.

BWR ASSEMBLY SOURCE TERMS FOR WASTE PACKAGE DESIGN

DOE Office of Scientific and Technical Information (OSTI.GOV)

T.L. Lotz

1997-02-15

This analysis is prepared by the Mined Geologic Disposal System (MGDS) Waste Package Development Department (WPDD) to provide boiling water reactor (BWR) assembly radiation source term data for use during Waste Package (WP) design. The BWR assembly radiation source terms are to be used for evaluation of radiolysis effects at the WP surface, and for personnel shielding requirements during assembly or WP handling operations. The objectives of this evaluation are to generate BWR assembly radiation source terms that bound selected groupings of BWR assemblies, with regard to assembly average burnup and cooling time, which comprise the anticipated MGDS BWR commercialmore » spent nuclear fuel (SNF) waste stream. The source term data is to be provided in a form which can easily be utilized in subsequent shielding/radiation dose calculations. Since these calculations may also be used for Total System Performance Assessment (TSPA), with appropriate justification provided by TSPA, or radionuclide release rate analysis, the grams of each element and additional cooling times out to 25 years will also be calculated and the data included in the output files.« less

Reliability of high I/O high density CCGA interconnect electronic packages under extreme thermal environments

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2012-03-01

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surfacemount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions.

Field testing of a lightweight relocatable structure in a desert environment

NASA Astrophysics Data System (ADS)

Kao, A.; Lane, S.; Carr, J. S.; Wahlgren, L.; Klause, P.

1984-09-01

This report describes the field tests of a commercially available, off-the-shelf lightweight relocatable structure (LRS) systems selected for possible military application in a theater or operations. The structural system selected for the field tests was a panelized system manufactured by Kelly Klosure, Inc. The purpose of the tests was to determine the constructibility and habitability of the building system. The tests are being conducted in two stages: Stage 1 tests were conducted in a desert environment, and Stage 2 tests are being conducted in a temperate environment. This report documents the results of the Stage 1 tests. The test results showed that the 20-ft-wide and 8-ft-high building can be erected manually by unskilled troop labor using only hand tools. However, for a 12-ft-high building assembled using 4- x 8-ft panels, a crane is needed to help lift assembled components for the erection. Based on overall constructibility and environmental performance, the fiberboard panel system is the better choice. Several modifications were made to the system during the field tests. It is recommended that these modifications be incorporated into system design and further field tests conducted before making a final evaluation.

On the Selective Packaging of Genomic RNA by HIV-1.

PubMed

Comas-Garcia, Mauricio; Davis, Sean R; Rein, Alan

2016-09-12

Like other retroviruses, human immunodeficiency virus type 1 (HIV-1) selectively packages genomic RNA (gRNA) during virus assembly. However, in the absence of the gRNA, cellular messenger RNAs (mRNAs) are packaged. While the gRNA is selected because of its cis-acting packaging signal, the mechanism of this selection is not understood. The affinity of Gag (the viral structural protein) for cellular RNAs at physiological ionic strength is not much higher than that for the gRNA. However, binding to the gRNA is more salt-resistant, implying that it has a higher non-electrostatic component. We have previously studied the spacer 1 (SP1) region of Gag and showed that it can undergo a concentration-dependent conformational transition. We proposed that this transition represents the first step in assembly, i.e., the conversion of Gag to an assembly-ready state. To explain selective packaging of gRNA, we suggest here that binding of Gag to gRNA, with its high non-electrostatic component, triggers this conversion more readily than binding to other RNAs; thus we predict that a Gag-gRNA complex will nucleate particle assembly more efficiently than other Gag-RNA complexes. New data shows that among cellular mRNAs, those with long 3'-untranslated regions (UTR) are selectively packaged. It seems plausible that the 3'-UTR, a stretch of RNA not occupied by ribosomes, offers a favorable binding site for Gag.

Utilization of bagasse and coconut fibers waste as fillers of sandwich composite for bridge railway sleepers

NASA Astrophysics Data System (ADS)

Soehardjo, K. A.; Basuki, A.

2017-07-01

The bridge railway sleepers is an essential component in the construction of railways, as the foundation of the rail support in order to withstand the load a train that runs above it. Sleepers used in bridge construction are expected to have a longer service life, lighter weight and durable so that can be used more efficient. This research was carried out to create a model of bridges railway sleepers made of sandwich structured composite from fiber glass, epoxy resin with fillers waste of bagasse (sugar cane pulp mill) or coconut fiberboard (copra industry) that using polyurethane as an adhesive. The process of making was conditioned for small and medium industrial applications. Railway sleepers’ specifications adapted to meet the requirements of end user. The process steps in this research include; lay-up fiberglass combined with bagasse/coconut fiberboard (as fillers), gluing with epoxy resin, molded it with pressure to be solid, curing after solidification process. The specimens of composite, bagasse and coconut fiber board were tested for tensile and compressive strength. The prototype were tested of mechanical test: flexural moment test to the stand rail, flexural moment test to the middle of the sleepers and tensile strength test on one side of the sleepers, in accordance to SNI 11-3388-1994 Method testing of single block concrete sleepers and bearing single rail fastening systems. The results of mechanical testing all variations meet the technical specifications of end user such as test results for flexural moment on all prototypes, after load test, there is no visible crack. While in the tensile strength test, it seem the prototype with coconut fiberboard filler, shows better performance than bagasse fiberboard filler, the decisions is just depended on techno economic and lifetime.

Combining independent de novo assemblies optimizes the coding transcriptome for nonconventional model eukaryotic organisms.

PubMed

Cerveau, Nicolas; Jackson, Daniel J

2016-12-09

Next-generation sequencing (NGS) technologies are arguably the most revolutionary technical development to join the list of tools available to molecular biologists since PCR. For researchers working with nonconventional model organisms one major problem with the currently dominant NGS platform (Illumina) stems from the obligatory fragmentation of nucleic acid material that occurs prior to sequencing during library preparation. This step creates a significant bioinformatic challenge for accurate de novo assembly of novel transcriptome data. This challenge becomes apparent when a variety of modern assembly tools (of which there is no shortage) are applied to the same raw NGS dataset. With the same assembly parameters these tools can generate markedly different assembly outputs. In this study we present an approach that generates an optimized consensus de novo assembly of eukaryotic coding transcriptomes. This approach does not represent a new assembler, rather it combines the outputs of a variety of established assembly packages, and removes redundancy via a series of clustering steps. We test and validate our approach using Illumina datasets from six phylogenetically diverse eukaryotes (three metazoans, two plants and a yeast) and two simulated datasets derived from metazoan reference genome annotations. All of these datasets were assembled using three currently popular assembly packages (CLC, Trinity and IDBA-tran). In addition, we experimentally demonstrate that transcripts unique to one particular assembly package are likely to be bioinformatic artefacts. For all eight datasets our pipeline generates more concise transcriptomes that in fact possess more unique annotatable protein domains than any of the three individual assemblers we employed. Another measure of assembly completeness (using the purpose built BUSCO databases) also confirmed that our approach yields more information. Our approach yields coding transcriptome assemblies that are more likely to be closer to biological reality than any of the three individual assembly packages we investigated. This approach (freely available as a simple perl script) will be of use to researchers working with species for which there is little or no reference data against which the assembly of a transcriptome can be performed.

NASA-DoD Lead-Free Electronics Project

NASA Technical Reports Server (NTRS)

Kessel, Kurt

2007-01-01

The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.

RNA packaging of MRFV virus-like particles: The interplay between RNA pools and capsid coat protein

USDA-ARS?s Scientific Manuscript database

Virus-like particles (VLPs) can be produced through self-assembly of capsid protein (CP) into particles with discrete shapes and sizes and containing different types of RNA molecules. The general principle that governs particle assembly and RNA packaging is determined by unique interactions between ...

21 CFR 111.415 - What requirements apply to filling, assembling, packaging, labeling, and related operations?

Code of Federal Regulations, 2010 CFR

2010-04-01

... 21 Food and Drugs 2 2010-04-01 2010-04-01 false What requirements apply to filling, assembling, packaging, labeling, and related operations? 111.415 Section 111.415 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND HUMAN SERVICES (CONTINUED) FOOD FOR HUMAN CONSUMPTION CURRENT GOOD...

Structure of a headful DNA-packaging bacterial virus at 2.9 Å resolution by electron cryo-microscopy

PubMed Central

Zhao, Haiyan; Li, Kunpeng; Lynn, Anna Y.; Aron, Keith E.; Yu, Guimei; Jiang, Wen; Tang, Liang

2017-01-01

The enormous prevalence of tailed DNA bacteriophages on this planet is enabled by highly efficient self-assembly of hundreds of protein subunits into highly stable capsids. These capsids can stand with an internal pressure as high as ∼50 atmospheres as a result of the phage DNA-packaging process. Here we report the complete atomic model of the headful DNA-packaging bacteriophage Sf6 at 2.9 Å resolution determined by electron cryo-microscopy. The structure reveals the DNA-inflated, tensed state of a robust protein shell assembled via noncovalent interactions. Remarkable global conformational polymorphism of capsid proteins, a network formed by extended N arms, mortise-and-tenon–like intercapsomer joints, and abundant β-sheet–like mainchain:mainchain intermolecular interactions, confers significant strength yet also flexibility required for capsid assembly and DNA packaging. Differential formations of the hexon and penton are mediated by a drastic α–helix-to-β–strand structural transition. The assembly scheme revealed here may be common among tailed DNA phages and herpesviruses. PMID:28320961

Fibre Optic Connections And Method For Using Same

DOEpatents

Chan, Benson; Cohen, Mitchell S.; Fortier, Paul F.; Freitag, Ladd W.; Hall, Richard R.; Johnson, Glen W.; Lin, How Tzu; Sherman, John H.

2004-03-30

A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

CSP Manufacturing Challenges and Assembly Reliability

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2000-01-01

Although the expression of CSP is widely used by industry from suppliers to users, its implied definition had evolved as the technology has matured. There are "expert definition"- package that is up to 1.5 time die- or "interim definition". CSPs are miniature new packages that industry is starting to implement and there are many unresolved technical issues associated with their implementation. For example, in early 1997, packages with 1 mm pitch and lower were the dominant CSPs, whereas in early 1998 packages with 0.8 mm and lower became the norm for CSPs. Other changes included the use of flip chip die rather than wire bond in CSP. Nonetheless the emerging CSPs are competing with bare die assemblies and are becoming the package of choice for size reduction applications. These packages provide the benefits of small size and performance of the bare die or flip chip, with the advantage of standard die packages. The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. This talk will cover specifically the experience of our consortium on technology implementation challenges, including design and build of both standard and microvia boards, assembly of two types of test vehicles, and the most current environmental thermal cycling test results.

A data base processor semantics specification package

NASA Technical Reports Server (NTRS)

Fishwick, P. A.

1983-01-01

A Semantics Specification Package (DBPSSP) for the Intel Data Base Processor (DBP) is defined. DBPSSP serves as a collection of cross assembly tools that allow the analyst to assemble request blocks on the host computer for passage to the DBP. The assembly tools discussed in this report may be effectively used in conjunction with a DBP compatible data communications protocol to form a query processor, precompiler, or file management system for the database processor. The source modules representing the components of DBPSSP are fully commented and included.

DNA packaging and the pathway of bacteriophage T4 head assembly.

PubMed Central

Hsiao, C L; Black, L W

1977-01-01

A cold-sensitive mutation in the structural gene for a minor phage T4 capsid protein (p20) leads to formation of heads containing p20 and cleaved head proteins and empty of DNA. Such heads can be filled with DNA and converted to active phages in vivo uponshift to high temperature. It appears that p20 has two distinct roles in head assembly: first, in construction of the prehead shell (blocked by ts and am mutation) and, second,in DNA packaging (blocked by cs mutation). The latter function is closely associated with gene 17 product, previously known to be required for DNA packagaing. Temperature shift studies of cs-ts double mutants and other observations allow determination of phage function required for DNA packaging. Contrary to previous proposals, we find that T4 DNA packaging is not directly coupled to and can follow DNA synthesis, protein cleavage, prehead core removal, and gene 21-mediated cleavage-induced increase in head volume. Our evidence suggests that an altered head assembly pathway exists and that DNA packaging is probably initiated by DNA-capsid (p20) interaction. Images PMID:269421

Chip Scale Package Integrity Assessment by Isothermal Aging

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

1998-01-01

Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attachment processes. These test vehicles use numerous package types. To understand potential failure mechanisms of the packages, particularly solder ball attachment, the grid CSPs were subjected to environmental exposure. Package I/Os ranged from 40 to nearly 300. This paper presents both as assembled, up to 1, 000 hours of isothermal aging shear test results and photo micrographs, and tensile test results before and after 1,500 cycles in the range of -30/100 C for CSPs. Results will be compared to BGAs with the same the same isothermal aging environmental exposures.

Nucleocapsid protein-dependent assembly of the RNA packaging signal of Middle East respiratory syndrome coronavirus.

PubMed

Hsin, Wei-Chen; Chang, Chan-Hua; Chang, Chi-You; Peng, Wei-Hao; Chien, Chung-Liang; Chang, Ming-Fu; Chang, Shin C

2018-05-24

Middle East respiratory syndrome coronavirus (MERS-CoV) consists of a positive-sense, single-stranded RNA genome and four structural proteins: the spike, envelope, membrane, and nucleocapsid protein. The assembly of the viral genome into virus particles involves viral structural proteins and is believed to be mediated through recognition of specific sequences and RNA structures of the viral genome. A culture system for the production of MERS coronavirus-like particles (MERS VLPs) was determined and established by electron microscopy and the detection of coexpressed viral structural proteins. Using the VLP system, a 258-nucleotide RNA fragment, which spans nucleotides 19,712 to 19,969 of the MERS-CoV genome (designated PS258(19712-19969) ME ), was identified to function as a packaging signal. Assembly of the RNA packaging signal into MERS VLPs is dependent on the viral nucleocapsid protein. In addition, a 45-nucleotide stable stem-loop substructure of the PS258(19712-19969) ME interacted with both the N-terminal domain and the C-terminal domain of the viral nucleocapsid protein. Furthermore, a functional SARS-CoV RNA packaging signal failed to assemble into the MERS VLPs, which indicated virus-specific assembly of the RNA genome. A MERS-oV RNA packaging signal was identified by the detection of GFP expression following an incubation of MERS VLPs carrying the heterologous mRNA GFP-PS258(19712-19969) ME with virus permissive Huh7 cells. The MERS VLP system could help us in understanding virus infection and morphogenesis.

Packaging signals in two single-stranded RNA viruses imply a conserved assembly mechanism and geometry of the packaged genome.

PubMed

Dykeman, Eric C; Stockley, Peter G; Twarock, Reidun

2013-09-09

The current paradigm for assembly of single-stranded RNA viruses is based on a mechanism involving non-sequence-specific packaging of genomic RNA driven by electrostatic interactions. Recent experiments, however, provide compelling evidence for sequence specificity in this process both in vitro and in vivo. The existence of multiple RNA packaging signals (PSs) within viral genomes has been proposed, which facilitates assembly by binding coat proteins in such a way that they promote the protein-protein contacts needed to build the capsid. The binding energy from these interactions enables the confinement or compaction of the genomic RNAs. Identifying the nature of such PSs is crucial for a full understanding of assembly, which is an as yet untapped potential drug target for this important class of pathogens. Here, for two related bacterial viruses, we determine the sequences and locations of their PSs using Hamiltonian paths, a concept from graph theory, in combination with bioinformatics and structural studies. Their PSs have a common secondary structure motif but distinct consensus sequences and positions within the respective genomes. Despite these differences, the distributions of PSs in both viruses imply defined conformations for the packaged RNA genomes in contact with the protein shell in the capsid, consistent with a recent asymmetric structure determination of the MS2 virion. The PS distributions identified moreover imply a preferred, evolutionarily conserved assembly pathway with respect to the RNA sequence with potentially profound implications for other single-stranded RNA viruses known to have RNA PSs, including many animal and human pathogens. Copyright © 2013 Elsevier Ltd. All rights reserved.

Structure and assembly of the essential RNA ring component of a viral DNA packaging motor

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ding, Fang; Lu, Changrui; Zhao, Wei

2011-07-25

Prohead RNA (pRNA) is an essential component in the assembly and operation of the powerful bacteriophage {psi}29 DNA packaging motor. The pRNA forms a multimeric ring via intermolecular base-pairing interactions between protomers that serves to guide the assembly of the ring ATPase that drives DNA packaging. Here we report the quaternary structure of this rare multimeric RNA at 3.5 {angstrom} resolution, crystallized as tetrameric rings. Strong quaternary interactions and the inherent flexibility helped rationalize how free pRNA is able to adopt multiple oligomerization states in solution. These characteristics also allowed excellent fitting of the crystallographic pRNA protomers into previous prohead/pRNAmore » cryo-EM reconstructions, supporting the presence of a pentameric, but not hexameric, pRNA ring in the context of the DNA packaging motor. The pentameric pRNA ring anchors itself directly to the phage prohead by interacting specifically with the fivefold symmetric capsid structures that surround the head-tail connector portal. From these contacts, five RNA superhelices project from the pRNA ring, where they serve as scaffolds for binding and assembly of the ring ATPase, and possibly mediate communication between motor components. Construction of structure-based designer pRNAs with little sequence similarity to the wild-type pRNA were shown to fully support the packaging of {psi}29 DNA.« less

Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2012-01-01

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

Design and fabrication of a foldable 3D silicon based package for solid state lighting applications

NASA Astrophysics Data System (ADS)

Sokolovskij, R.; Liu, P.; van Zeijl, H. W.; Mimoun, B.; Zhang, G. Q.

2015-05-01

Miniaturization of solid state lighting (SSL) luminaires as well as reduction of packaging and assembly costs are of prime interest for the SSL lighting industry. A novel silicon based LED package for lighting applications is presented in this paper. The proposed design consists of 5 rigid Si tiles connected by flexible polyimide hinges with embedded interconnects (ICs). Electrical, optical and thermal characteristics were taken into consideration during design. The fabrication process involved polyimide (PI) application and patterning, aluminium interconnect integration in the flexible hinge, LED reflector cavity formation and metalization followed by through wafer DRIE etching for chip formation and release. A method to connect chip front to backside without TSVs was also integrated into the process. Post-fabrication wafer level assembly included LED mounting and wirebond, phosphor-based colour conversion and silicone encapsulation. The package formation was finalized by vacuum assisted wrapping around an assembly structure to form a 3D geometry, which is beneficial for omnidirectional lighting. Bending tests were performed on the flexible ICs and optical performance at different temperatures was evaluated. It is suggested that 3D packages can be expanded to platforms for miniaturized luminaire applications by combining monolithic silicon integration and system-in-package (SiP) technologies.

Varactor diode assembly with low parasitic reactances

NASA Technical Reports Server (NTRS)

Dickens, L. E.

1975-01-01

Development of varactor diode assembly overcomes parasitic reactances of conventional varactor packages. In specially constructed assembly very high idler-frequency to signal-frequency ratios are used to obtain low-noise operation over maximum bandwidth.

Radiometric packaging of uncooled bolometric infrared focal plane arrays

NASA Astrophysics Data System (ADS)

García-Blanco, Sonia; Pope, Timothy; Côté, Patrice; Leclerc, Mélanie; Ngo Phong, Linh; Châteauneuf, François

2017-11-01

INO has a wide experience in the design and fabrication of different kinds of microbolometer focal plane arrays (FPAs). In particular, a 512x3 pixel microbolometer FPA has been selected as the sensor for the New Infrared Sensor Technology (NIRST) instrument, one of the payloads of the SACD/Aquarius mission. In order to make the absolute temperature measurements necessary for many infrared Earth observation applications, the microbolometer FPA must be integrated into a package offering a very stable thermal environment. The radiometric packaging technology developed at INO presents an innovative approach since it was conceived to be modular and adaptable for the packaging of different microbolometer FPAs and for different sets of assembly requirements without need for requalification of the assembly process. The development of the radiometric packaging technology has broadened the position of INO as a supplier of radiometric detector modules integrating FPAs of microbolometers inside a radiometric package capable of achieving the requirements of different space missions. This paper gives an overview of the design of INO's radiometric package. Key performance parameters are also discussed and the test campaign conducted with the radiometric package is presented.

Reliability of CGA/LGA/HDI Package Board/Assembly (Revision A)

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2013-01-01

This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of 55 C to maximum temperatures of either 100 C or 125 C with slow ramp-up rate (3 C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects' use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2013-01-01

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.

Mobile work station concept for assembly of large space structures (zero gravity simulation tests)

NASA Astrophysics Data System (ADS)

Heard, W. L., Jr.; Bush, H. G.; Wallsom, R. E.; Jensen, J. K.

1982-03-01

The concept presented is intended to enhance astronaut assembly of truss structure that is either too large or complex to fold for efficient Shuttle delivery to orbit. The potential of augmented astronaut assembly is illustrated by applying the result of the tests to a barebones assembly of a truss structure. If this structure were assembled from the same nestable struts that were used in the Mobile Work Station assembly tests, the spacecraft would be 55 meters in diameter and consist of about 500 struts. The struts could be packaged in less than 1/2% of the Shuttle cargo bay volume and would take up approximately 3% of the mass lift capability. They could be assembled in approximately four hours. This assembly concept for erectable structures is not only feasible, but could be used to significant economic advantage by permitting the superior packaging feature of erectable structures to be exploited and thereby reduce expensive Shuttle delivery flights.

Mobile work station concept for assembly of large space structures (zero gravity simulation tests)

NASA Technical Reports Server (NTRS)

Heard, W. L., Jr.; Bush, H. G.; Wallsom, R. E.; Jensen, J. K.

1982-01-01

The concept presented is intended to enhance astronaut assembly of truss structure that is either too large or complex to fold for efficient Shuttle delivery to orbit. The potential of augmented astronaut assembly is illustrated by applying the result of the tests to a barebones assembly of a truss structure. If this structure were assembled from the same nestable struts that were used in the Mobile Work Station assembly tests, the spacecraft would be 55 meters in diameter and consist of about 500 struts. The struts could be packaged in less than 1/2% of the Shuttle cargo bay volume and would take up approximately 3% of the mass lift capability. They could be assembled in approximately four hours. This assembly concept for erectable structures is not only feasible, but could be used to significant economic advantage by permitting the superior packaging feature of erectable structures to be exploited and thereby reduce expensive Shuttle delivery flights.

Automated packaging platform for low-cost high-performance optical components manufacturing

NASA Astrophysics Data System (ADS)

Ku, Robert T.

2004-05-01

Delivering high performance integrated optical components at low cost is critical to the continuing recovery and growth of the optical communications industry. In today's market, network equipment vendors need to provide their customers with new solutions that reduce operating expenses and enable new revenue generating IP services. They must depend on the availability of highly integrated optical modules exhibiting high performance, small package size, low power consumption, and most importantly, low cost. The cost of typical optical system hardware is dominated by linecards that are in turn cost-dominated by transmitters and receivers or transceivers and transponders. Cost effective packaging of optical components in these small size modules is becoming the biggest challenge to be addressed. For many traditional component suppliers in our industry, the combination of small size, high performance, and low cost appears to be in conflict and not feasible with conventional product design concepts and labor intensive manual assembly and test. With the advent of photonic integration, there are a variety of materials, optics, substrates, active/passive devices, and mechanical/RF piece parts to manage in manufacturing to achieve high performance at low cost. The use of automation has been demonstrated to surpass manual operation in cost (even with very low labor cost) as well as product uniformity and quality. In this paper, we will discuss the value of using an automated packaging platform.for the assembly and test of high performance active components, such as 2.5Gb/s and 10 Gb/s sources and receivers. Low cost, high performance manufacturing can best be achieved by leveraging a flexible packaging platform to address a multitude of laser and detector devices, integration of electronics and handle various package bodies and fiber configurations. This paper describes the operation and results of working robotic assemblers in the manufacture of a Laser Optical Subassembly (LOS), its subsequent automated testing and burn/in process; and the placement of the LOS into a package body and hermetically sealing the package. The LOS and Package automated assembler robots have achieved a metrics of less than 1 um accuracy and 0.1 um resolution. The paper also discusses a method for the critical alignment of a single-mode fiber as the last step of the manufacturing process. This approach is in contrast to the conventional manual assembly where sub-micron fiber alignment and fixation steps are performed much earlier during the assembly process. Finally the paper discusses the value of this automated platform manufacturing approach as a key enabler for low cost small form factor optical components for the new XFP MSA class of transceiver modules.

Column Grid Array Rework for High Reliability

NASA Technical Reports Server (NTRS)

Mehta, Atul C.; Bodie, Charles C.

2008-01-01

Due to requirements for reduced size and weight, use of grid array packages in space applications has become common place. To meet the requirement of high reliability and high number of I/Os, ceramic column grid array packages (CCGA) were selected for major electronic components used in next MARS Rover mission (specifically high density Field Programmable Gate Arrays). ABSTRACT The probability of removal and replacement of these devices on the actual flight printed wiring board assemblies is deemed to be very high because of last minute discoveries in final test which will dictate changes in the firmware. The questions and challenges presented to the manufacturing organizations engaged in the production of high reliability electronic assemblies are, Is the reliability of the PWBA adversely affected by rework (removal and replacement) of the CGA package? and How many times can we rework the same board without destroying a pad or degrading the lifetime of the assembly? To answer these questions, the most complex printed wiring board assembly used by the project was chosen to be used as the test vehicle, the PWB was modified to provide a daisy chain pattern, and a number of bare PWB s were acquired to this modified design. Non-functional 624 pin CGA packages with internal daisy chained matching the pattern on the PWB were procured. The combination of the modified PWB and the daisy chained packages enables continuity measurements of every soldered contact during subsequent testing and thermal cycling. Several test vehicles boards were assembled, reworked and then thermal cycled to assess the reliability of the solder joints and board material including pads and traces near the CGA. The details of rework process and results of thermal cycling are presented in this paper.

Herpes Simplex Virus DNA Packaging without Measurable DNA Synthesis

PubMed Central

Church, Geoffrey A.; Dasgupta, Anindya; Wilson, Duncan W.

1998-01-01

Herpes simplex virus (HSV) type 1 DNA synthesis and packaging occur within the nuclei of infected cells; however, the extent to which the two processes are coupled remains unclear. Correct packaging is thought to be dependent upon DNA debranching or other repair processes, and such events commonly involve new DNA synthesis. Furthermore, the HSV UL15 gene product, essential for packaging, nevertheless localizes to sites of active DNA replication and may link the two events. It has previously been difficult to determine whether packaging requires concomitant DNA synthesis due to the complexity of these processes and of the viral life cycle; however, we have recently described a model system which simplifies the study of HSV assembly. Cells infected with HSV strain tsProt.A accumulate unpackaged capsids at the nonpermissive temperature of 39°C. Following release of the temperature block, these capsids proceed to package viral DNA in a single, synchronous wave. Here we report that, when DNA replication was inhibited prior to release of the temperature block, DNA packaging and later events in viral assembly nevertheless occurred at near-normal levels. We conclude that, under our conditions, HSV DNA packaging does not require detectable levels of DNA synthesis. PMID:9525593

Pilot Fullerton prepares meal on middeck

NASA Image and Video Library

1982-03-30

STS003-26-253 (30 March 1982) --- Astronaut Gordon Fullerton, STS-3 pilot, wearing communications kit assembly (assy) mini-headset (HDST), prepares meal on middeck. Fullerton clips corner of rehydratable food (cereal) package with scissors. The opening will allow Fullerton to insert JSC water dispenser kit water gun in order to heat contents with hot water. Meal tray assembly is secured to forward middeck locker and holds additional food packages and beverage containers. Photo credit: NASA

Pilot Fullerton plans menu as packaged food and beverages float around him

NASA Technical Reports Server (NTRS)

1982-01-01

Pilot C. Gordon Fullerton, wearing the communications carrier assembly (ASSY) mini headset (HDST), beings food preparation on the middeck. Canned goods, sealed packages, beverage containers, etc are attached with velcro to meal tray assemblies (secured on middeck forward lockers) and freefloat around Fullerton. JSC water dispenser kit and portrait of G.W.S. Abbey appears behind Fullerton on port side bulkhead and potable water tank appears below him.

3D packaging of a microfluidic system with sensory applications

NASA Astrophysics Data System (ADS)

Morrissey, Anthony; Kelly, Gerard; Alderman, John C.

1997-09-01

Among the main benefits of microsystem technology are its contributions to cost reductio, reliability and improved performance. however, the packaging of microsystems, and particularly microsensor, has proven to be one of the biggest limitations to their commercialization and the packaging of silicon sensor devices can be the most costly part of their fabrication. This paper describes the integration of 3D packaging of a microsystem. Central to the operation of the 3D demonstrator is a micromachined silicon membrane pump to supply fluids to a sensing chamber constructed about the active area of a sensor chip. This chip carries ISFET based chemical sensors, pressure sensors and thermal sensors. The electronics required for controlling and regulating the activity of the various sensors ar also available on this chip and as other chips in the 3D assembly. The demonstrator also contains a power supply module with optical fiber interconnections. All of these modules are integrated into a single plastic- encapsulated 3D vertical multichip module. The reliability of such a structure, initially proposed by Val was demonstrated by Barrett et al. An additional module available for inclusion in some of our assemblies is a test chip capable of measuring the packaging-induced stress experienced during and after assembly. The packaging process described produces a module with very high density and utilizes standard off-the-shelf components to minimize costs. As the sensor chip and micropump include micromachined silicon membranes and microvalves, the packaging of such structures has to allow consideration for the minimization of the packaging-induced stresses. With this in mind, low stress techniques, including the use of soft glob-top materials, were employed.

Vacuum foil insulation system

DOEpatents

Hanson, John P.; Sabolcik, Rudolph E.; Svedberg, Robert C.

1976-11-16

In a multifoil thermal insulation package having a plurality of concentric cylindrical cups, means are provided for reducing heat loss from the penetration region which extends through the cups. At least one cup includes an integral skirt extending from one end of the cup to intersection with the penetration means. Assembly of the insulation package with the skirted cup is facilitated by splitting the cup to allow it to be opened up and fitted around the other cups during assembly.

Reliability of CCGA and PBGA assemblies

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2005-01-01

Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of the choice for commercial applications; they are now started to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic BGA (PBGA) and CSP assemblies, because of their wide usage for commercial applications, have been extensively reported in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.

AE (Acoustic Emission) for Flip-Chip CGA/FCBGA Defect Detection

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2014-01-01

C-mode scanning acoustic microscopy (C-SAM) is a nondestructive inspection technique that uses ultrasound to show the internal feature of a specimen. A very high or ultra-high-frequency ultrasound passes through a specimen to produce a visible acoustic microimage (AMI) of its inner features. As ultrasound travels into a specimen, the wave is absorbed, scattered or reflected. The response is highly sensitive to the elastic properties of the materials and is especially sensitive to air gaps. This specific characteristic makes AMI the preferred method for finding "air gaps" such as delamination, cracks, voids, and porosity. C-SAM analysis, which is a type of AMI, was widely used in the past for evaluation of plastic microelectronic circuits, especially for detecting delamination of direct die bonding. With the introduction of the flip-chip die attachment in a package; its use has been expanded to nondestructive characterization of the flip-chip solder bumps and underfill. Figure 1.1 compares visual and C-SAM inspection approaches for defect detection, especially for solder joint interconnections and hidden defects. C-SAM is specifically useful for package features like internal cracks and delamination. C-SAM not only allows for the visualization of the interior features, it has the ability to produce images on layer-by-layer basis. Visual inspection; however, is only superior to C-SAM for the exposed features including solder dewetting, microcracks, and contamination. Ideally, a combination of various inspection techniques - visual, optical and SEM microscopy, C-SAM, and X-ray - need to be performed in order to assure quality at part, package, and system levels. This reports presents evaluations performed on various advanced packages/assemblies, especially the flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. Both external and internal equipment was used for evaluation. The outside facility provided images of the key features that could be detected using the most advanced C-SAM equipment with a skilled operator. Investigation continued using in-house equipment with its limitations. For comparison, representative X-rays of the assemblies were also gathered to show key defect detection features of these non-destructive techniques. Key images gathered and compared are: Compared the images of 2D X-ray and C-SAM for a plastic LGA assembly showing features that could be detected by either NDE technique. For this specific case, X-ray was a clear winner. Evaluated flip-chip CGA and FCBGA assemblies with and without heat sink by C-SAM. Only the FCCGA package that had no heat sink could be fully analyzed for underfill and bump quality. Cross-sectional microscopy did not revealed peripheral delamination features detected by C-SAM. Analyzed a number of fine pitch PBGA assemblies by C-SAM. Even though the internal features of the package assemblies could be detected, C-SAM was unable to detect solder joint failure at either the package or board level. Twenty times touch ups by solder iron with 700degF tip temperature, each with about 5 second duration, did not induce defects to be detected by C-SAM images. Other techniques need to be considered to induce known defects for characterization. Given NASA's emphasis on the use of microelectronic packages and assemblies and quality assurance on workmanship defect detection, understanding key features of various inspection systems that detect defects in the early stages of package and assembly is critical to developing approaches that will minimize future failures. Additional specific, tailored non-destructive inspection approaches could enable low-risk insertion of these advanced electronic packages having hidden and fine features.

Life testing of reflowed and reworked advanced CCGA surface mount packages in harsh thermal environments

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2013-03-01

Life testing/qualification of reflowed (1st reflow) and reworked (1st reflow, 1st removal, and then 1st rework) advanced ceramic column grid array (CCGA) surface mount interconnect electronic packaging technologies for future flight projects has been studied to enhance the mission assurance of JPL-NASA projects. The reliability of reworked/reflowed surface mount technology (SMT) packages is very important for short-duration and long-duration deep space harsh extreme thermal environmental missions. The life testing of CCGA electronic packages under extreme thermal environments (for example: -185°C to +125°C) has been performed with reference to various JPL/NASA project requirements which encompass the temperature range studied. The test boards of reflowed and reworked CCGA packages (717 Xilinx package, 624, 1152, and 1272 column Actel Packages) were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases or cycles to failure to assess the life of the hardware. Qualification/life testing was performed by subjecting test boards to the environmental harsh temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance solder-joint failures due to either overstress or thermal cycle fatigue. The large, high density, high input/output (I/O) electronic interconnect SMT packages such as CCGA have increased usage in avionics hardware of NASA projects during the last two decades. The test boards built with CCGA packages are expensive and often require a rework to replace a reflowed, reprogrammed, failed, redesigned, etc., CCGA packages. Theoretically speaking, a good rework process should have similar temperature-time profile as that used for the original manufacturing process of solder reflow. A multiple rework processes may be implemented with CCGA packaging technology to understand the effect of number of reworks on the reliability of this technology for harsh thermal environments. In general, reliability of the assembled electronic packages reduces as a function of number of reworks and the extent is not known yet. A CCGA rework process has been tried and implemented to design a daisy-chain test board consists of 624 and 717 packages. Reworked CCGA interconnect electronic packages of printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging and optical microscope techniques. The assembled boards after 1st rework and 1st reflow were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space JPL/NASA for moderate to harsh thermal mission environments. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling to determine intermittent failures. This paper provides the experimental reliability test results to failure of assemblies for the first time of reflowed and reworked CCGA packages under extreme harsh thermal environments.

49 CFR 173.308 - Lighters.

Code of Federal Regulations, 2013 CFR

2013-10-01

..., must be capable of withstanding, without leakage or rupture, an internal pressure of at least two times... plastic tray, a plastic, fiberboard or paperboard partition must be used to prevent friction between the...

49 CFR 173.308 - Lighters.

Code of Federal Regulations, 2012 CFR

2012-10-01

..., must be capable of withstanding, without leakage or rupture, an internal pressure of at least two times... plastic tray, a plastic, fiberboard or paperboard partition must be used to prevent friction between the...

Portal protein functions akin to a DNA-sensor that couples genome-packaging to icosahedral capsid maturation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lokareddy, Ravi K.; Sankhala, Rajeshwer S.; Roy, Ankoor

Tailed bacteriophages and herpesviruses assemble infectious particles via an empty precursor capsid (or ‘procapsid’) built by multiple copies of coat and scaffolding protein and by one dodecameric portal protein. Genome packaging triggers rearrangement of the coat protein and release of scaffolding protein, resulting in dramatic procapsid lattice expansion. Here, we provide structural evidence that the portal protein of the bacteriophage P22 exists in two distinct dodecameric conformations: an asymmetric assembly in the procapsid (PC-portal) that is competent for high affinity binding to the large terminase packaging protein, and a symmetric ring in the mature virion (MV-portal) that has negligible affinitymore » for the packaging motor. Modelling studies indicate the structure of PC-portal is incompatible with DNA coaxially spooled around the portal vertex, suggesting that newly packaged DNA triggers the switch from PC- to MV-conformation. Thus, we propose the signal for termination of ‘Headful Packaging’ is a DNA-dependent symmetrization of portal protein.« less

49 CFR 178.356-5 - Typical assembly detail.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 49 Transportation 3 2013-10-01 2013-10-01 false Typical assembly detail. 178.356-5 Section 178.356-5 Transportation Other Regulations Relating to Transportation (Continued) PIPELINE AND HAZARDOUS... Specifications for Packagings for Class 7 (Radioactive) Materials § 178.356-5 Typical assembly detail. (a...

49 CFR 178.358-6 - Typical assembly detail.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 49 Transportation 3 2012-10-01 2012-10-01 false Typical assembly detail. 178.358-6 Section 178.358-6 Transportation Other Regulations Relating to Transportation (Continued) PIPELINE AND HAZARDOUS... Specifications for Packagings for Class 7 (Radioactive) Materials § 178.358-6 Typical assembly detail. (a...

49 CFR 178.356-5 - Typical assembly detail.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 49 Transportation 3 2012-10-01 2012-10-01 false Typical assembly detail. 178.356-5 Section 178.356-5 Transportation Other Regulations Relating to Transportation (Continued) PIPELINE AND HAZARDOUS... Specifications for Packagings for Class 7 (Radioactive) Materials § 178.356-5 Typical assembly detail. (a...

49 CFR 178.356-5 - Typical assembly detail.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 49 Transportation 3 2011-10-01 2011-10-01 false Typical assembly detail. 178.356-5 Section 178.356-5 Transportation Other Regulations Relating to Transportation (Continued) PIPELINE AND HAZARDOUS... Specifications for Packagings for Class 7 (Radioactive) Materials § 178.356-5 Typical assembly detail. (a...

49 CFR 178.358-6 - Typical assembly detail.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 49 Transportation 3 2013-10-01 2013-10-01 false Typical assembly detail. 178.358-6 Section 178.358-6 Transportation Other Regulations Relating to Transportation (Continued) PIPELINE AND HAZARDOUS... Specifications for Packagings for Class 7 (Radioactive) Materials § 178.358-6 Typical assembly detail. (a...

49 CFR 178.358-6 - Typical assembly detail.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 49 Transportation 3 2011-10-01 2011-10-01 false Typical assembly detail. 178.358-6 Section 178.358-6 Transportation Other Regulations Relating to Transportation (Continued) PIPELINE AND HAZARDOUS... Specifications for Packagings for Class 7 (Radioactive) Materials § 178.358-6 Typical assembly detail. (a...

Industrial Technology Modernization Program. Phase 3 Proposal, Category 1 Project Countermeasures Assembly Improvements

DTIC Science & Technology

1985-05-24

Tracor INDUSTRIAL TECHNOLOGY MODERNIZATION PROGRAM DTICRt .1ECTE CDJUN07 1989 00 PHASE 3 PROPOSAL CATEGORY 1 PROJECT COUNTERMEASURES ASSEMBLY...package in bin C V_ Put-package back in bin C Put part in plastic bag 0CDV _7 _ ] Seal plastic bag with stapler CDDV _ _- 1 Mark paperwork CDV __ I Peel...part in plastic bag CDV7 Seal plastic bag with stapler C>CDV _ Mark paperwork ~CV_ _ Peel preprinted tag from sheet ~ D Put preprinted tag on plastic

Herpesvirus capsid assembly and DNA packaging

PubMed Central

Heming, Jason D.; Conway, James F.; Homa, Fred L.

2017-01-01

Herpes simplex virus type I (HSV-1) is the causative agent of several pathologies ranging in severity from the common cold sore to life-threatening encephalitic infection. During productive lytic infection, over 80 viral proteins are expressed in a highly regulated manner, resulting in the replication of viral genomes and assembly of progeny virions. The virion of all herpesviruses consists of an external membrane envelope, a proteinaceous layer called the tegument, and an icosahedral capsid containing the double-stranded linear DNA genome. The capsid shell of HSV-1 is built from four structural proteins: a major capsid protein, VP5, which forms the capsomers (hexons and pentons), the triplex consisting of VP19C and VP23 found between the capsomers, and VP26 which binds to VP5 on hexons but not pentons. In addition, the dodecameric pUL6 portal complex occupies one of the 12 capsid vertices, and the capsid vertex specific component (CVSC), a heterotrimer complex of pUL17, pUL25 and pUL36 binds specifically to the triplexes adjacent to each penton. The capsid is assembled in the nucleus where the viral genome is packaged into newly assembled closed capsid shells. Cleavage and packaging of replicated, concatemeric viral DNA requires the seven viral proteins encoded by the UL6, UL15, UL17, UL25, UL28, UL32, and UL33 genes. Considerable advances have been made in understanding the structure of the herpesvirus capsid and the function of several of the DNA packaging proteins by applying biochemical, genetic, and structural techniques. This review is a summary of recent advances with respect to the structure of the HSV-1 virion capsid and what is known about the function of the seven packaging proteins and their interactions with each other and with the capsid shell. PMID:28528442

Effect of Thermal Treatment of Fast Growing Wood Fibers on Physical and Mechanical Properties of Light Medium Density Fiberboard

NASA Astrophysics Data System (ADS)

Jarusombuti, Songklod; Ayrilmis, Nadir; Fueangvivat, Vallayuth; Bauchongkol, Piyawade

2011-06-01

This study investigated physical and mechanical properties of the light medium density fiberboard (MDF) panels made from thermally treated wood fibers of eucalyptus camaldulensis at three different temperatures (393 K, 423 K or 453 K) for 30 or 60 min in a laboratory autoclave. The average thickness swelling of the panels decreased by 16-54% depending on the treatment temperature and time. However, the modulus of rupture, modulus of elasticity, and internal bond strength decreased by 16-37%, 9-25% and 10-39%, respectively. Based on the findings obtained from the present study, it may be said that wood fibers of E. camaldulensis treated at 453 K - 30 min can be used in the light MDF manufacture for use in humid conditions, such as kitchen and bathroom furniture requiring improved dimensional stability.

NASA-DoD Lead-Free Electronics Project

NASA Technical Reports Server (NTRS)

Kessel, Kurt

2009-01-01

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with solder interconnects consisting of lead-free alloys (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder

Thematic mapper flight model preshipment review data package. Volume 2, part B: Subsystem data

NASA Technical Reports Server (NTRS)

1982-01-01

Summarized performance data are presented for the following major subsystems of the thematic mapper: the focal plane assembly, the radiative cooler, the radiative cooler door assembly, the top optical assembly, and the telescope assembly. Reference lists of the configurations status and of nonconforming material reports, failure reports, and requests for deviation/waiver are included.

Industrial packaging and assembly infrastructure for MOEMS

NASA Astrophysics Data System (ADS)

van Heeren, Henne

2004-01-01

In a mature industry all elements of the supply chain are available and are more or less in balance. Mainstream technologies are defined and well supported by a chain of specialist companies. Those specialist companies, offering services ranging from consultancy to manufacturing subcontracting, are an essential element in the industrialization. There specialization and dedication to one or a few elements in the technology increases professionalism and efficiency. The MOEMS industry however, is still in its infancy. After the birth and growth of many companies aiming at development of products, the appearance of companies aiming at the production of components and systems, we see know the first companies concentrating on the delivering of services to this industry. We can divide them in the like : * Design and Engineering companies * Foundries * Assembly and Packaging providers * Design and simulation software providers For manufacturing suppliers and customers the lack of industry standards and mainstream technologies is a serious drawback. Insight in availability and trends in technology is important to make the right choices in the field of industrialization and production. This awareness was the reason to perform a detailed study to the companies supplying commercial services in this field. This article focuses on one important part of this study: packaging and assembly. This tends to remain a bottleneck at the end of the design cycle, often delaying and sometimes preventing industrialization and commercialization. For nearly all MEMS/MST products literally everything comes together in the packaging and assembly. This is the area of full integration: electrical, mechanical, optical fluidic, magnetic etc. functionalities come together. The problems associated with the concentration of functionalities forms a big headache for the designer. Conflicting demands, of which functionality versus economics is only one, and technical hurdles have to overcome. Besides that, packaging and assembly is from nature application specific and solutions found are not always transferable from one product to another. But designers can often benefit from experience from other and general available technologies. A number of companies offer packaging and assembly services for MEMS/MST and this report give typical examples of those commercial services. The companies range from small start-ups, offering very specialized services, to large semiconductor packaging companies, having production lines for microsystem based products. Selecting the proper packaging method may tip the scales towards a product success or towards a product failure, while it nearly always present s a substantial part of the cost of the product. This is therefore is not a marginal concern, but a crucial part of the product design. The presentation will also address mayor trends and technologies. Finally, the article provides sufficient levels of classification and categorisation for various aspects for the technologies, in specific, and the industry, in general, to provide particularly useful insights into the activities and the developments in this market. With over 50 companies studied and assessed, it provides an up to date account of the state of this business and its future potential.

Reliability of Ceramic Column Grid Array Interconnect Packages Under Extreme Temperatures

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2011-01-01

A paper describes advanced ceramic column grid array (CCGA) packaging interconnects technology test objects that were subjected to extreme temperature thermal cycles. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide were assembled, inspected nondestructively, and, subsequently, subjected to ex - treme-temperature thermal cycling to assess reliability for future deep-space, short- and long-term, extreme-temperature missions. The test hardware consisted of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The package is 33 33 mm with a 27 27 array of 80%/20% Pb/Sn columns on a 1.27-mm pitch. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of the increasing number of thermal cycles. Several catastrophic failures were observed after 137 extreme-temperature thermal cycles, as per electrical resistance measurements, and then the tests were continued through 1,058 thermal cycles to corroborate and understand the test results. X-ray and optical inspection have been made after thermal cycling. Optical inspections were also conducted on the CCGA vs. thermal cycles. The optical inspections were conclusive; the x-ray images were not. Process qualification and assembly is required to optimize the CCGA assembly, which is very clear from the x-rays. Six daisy chains were open out of seven daisy chains, as per experimental test data reported. The daisy chains are open during the cold cycle, and then recover during the hot cycle, though some of them also opened during the hot thermal cycle..

Structure-function analysis of the DNA translocating portal of the bacteriophage T4 packaging machine.

PubMed

Padilla-Sanchez, Victor; Gao, Song; Kim, Hyung Rae; Kihara, Daisuke; Sun, Lei; Rossmann, Michael G; Rao, Venigalla B

2014-03-06

Tailed bacteriophages and herpesviruses consist of a structurally well conserved dodecameric portal at a special 5-fold vertex of the capsid. The portal plays critical roles in head assembly, genome packaging, neck/tail attachment, and genome ejection. Although the structures of portals from phages φ29, SPP1, and P22 have been determined, their mechanistic roles have not been well understood. Structural analysis of phage T4 portal (gp20) has been hampered because of its unusual interaction with the Escherichia coli inner membrane. Here, we predict atomic models for the T4 portal monomer and dodecamer, and we fit the dodecamer into the cryo-electron microscopy density of the phage portal vertex. The core structure, like that from other phages, is cone shaped with the wider end containing the "wing" and "crown" domains inside the phage head. A long "stem" encloses a central channel, and a narrow "stalk" protrudes outside the capsid. A biochemical approach was developed to analyze portal function by incorporating plasmid-expressed portal protein into phage heads and determining the effect of mutations on head assembly, DNA translocation, and virion production. We found that the protruding loops of the stalk domain are involved in assembling the DNA packaging motor. A loop that connects the stalk to the channel might be required for communication between the motor and the portal. The "tunnel" loops that project into the channel are essential for sealing the packaged head. These studies established that the portal is required throughout the DNA packaging process, with different domains participating at different stages of genome packaging. © 2013.

Technical support package: Large, easily deployable structures. NASA Tech Briefs, Fall 1982, volume 7, no. 1

NASA Technical Reports Server (NTRS)

1982-01-01

Design and test data for packaging, deploying, and assembling structures for near term space platform systems, were provided by testing light type hardware in the Neutral Buoyancy Simulator. An optimum or near optimum structural configuration for varying degrees of deployment utilizing different levels of EVA and RMS was achieved. The design of joints and connectors and their lock/release mechanisms were refined to improve performance and operational convenience. The incorporation of utilities into structural modules to determine their effects on packaging and deployment was evaluated. By simulation tests, data was obtained for stowage, deployment, and assembly of the final structural system design to determine construction timelines, and evaluate system functioning and techniques.

Low-profile fiber connector for co-packaged optics

NASA Astrophysics Data System (ADS)

Brusberg, Lars; DeJong, Michael; Butler, Douglas L.; Clark, Jeffrey S.; Sutton, Clifford G.

2018-02-01

We developed a small form factor connector that can be assembled on all four sides of a high-data switch package for fiber connectivity. This paper discusses a novel connector approach that has the potential to meet all co-packaging requirements including solder-reflow-compatibility, de-mateability, low insertion loss and state-of-the art FAU attach. The connector was attached to the PIC for performance evaluation. The average insertion loss across all eight fibers of the assembly was 1.77 dB, including the three optical interfaces: (1) MT-to-MT between connector and receptacle, (2) receptacle-to-PLC and (3) PIC-to-FAU. Also included is the propagation loss of the PIC waveguide. Optical return loss was measured to be -55 dB or lower.

40 CFR 63.4681 - Am I subject to this subpart?

Code of Federal Regulations, 2011 CFR

2011-07-01

... application of clay slurry, titanium dioxide, or asphalt coatings to fiberboard. (v) Painting of company logo...) Synthetic patches, wood patches, and wood putty applied to plywood. (ix) Application of concrete forming and...

Evidence that viral RNAs have evolved for efficient, two-stage packaging.

PubMed

Borodavka, Alexander; Tuma, Roman; Stockley, Peter G

2012-09-25

Genome packaging is an essential step in virus replication and a potential drug target. Single-stranded RNA viruses have been thought to encapsidate their genomes by gradual co-assembly with capsid subunits. In contrast, using a single molecule fluorescence assay to monitor RNA conformation and virus assembly in real time, with two viruses from differing structural families, we have discovered that packaging is a two-stage process. Initially, the genomic RNAs undergo rapid and dramatic (approximately 20-30%) collapse of their solution conformations upon addition of cognate coat proteins. The collapse occurs with a substoichiometric ratio of coat protein subunits and is followed by a gradual increase in particle size, consistent with the recruitment of additional subunits to complete a growing capsid. Equivalently sized nonviral RNAs, including high copy potential in vivo competitor mRNAs, do not collapse. They do support particle assembly, however, but yield many aberrant structures in contrast to viral RNAs that make only capsids of the correct size. The collapse is specific to viral RNA fragments, implying that it depends on a series of specific RNA-protein interactions. For bacteriophage MS2, we have shown that collapse is driven by subsequent protein-protein interactions, consistent with the RNA-protein contacts occurring in defined spatial locations. Conformational collapse appears to be a distinct feature of viral RNA that has evolved to facilitate assembly. Aspects of this process mimic those seen in ribosome assembly.

From Cells to Virus Particles: Quantitative Methods to Monitor RNA Packaging

PubMed Central

Ferrer, Mireia; Henriet, Simon; Chamontin, Célia; Lainé, Sébastien; Mougel, Marylène

2016-01-01

In cells, positive strand RNA viruses, such as Retroviridae, must selectively recognize their full-length RNA genome among abundant cellular RNAs to assemble and release particles. How viruses coordinate the intracellular trafficking of both RNA and protein components to the assembly sites of infectious particles at the cell surface remains a long-standing question. The mechanisms ensuring packaging of genomic RNA are essential for viral infectivity. Since RNA packaging impacts on several essential functions of retroviral replication such as RNA dimerization, translation and recombination events, there are many studies that require the determination of RNA packaging efficiency and/or RNA packaging ability. Studies of RNA encapsidation rely upon techniques for the identification and quantification of RNA species packaged by the virus. This review focuses on the different approaches available to monitor RNA packaging: Northern blot analysis, ribonuclease protection assay and quantitative reverse transcriptase-coupled polymerase chain reaction as well as the most recent RNA imaging and sequencing technologies. Advantages, disadvantages and limitations of these approaches will be discussed in order to help the investigator to choose the most appropriate technique. Although the review was written with the prototypic simple murine leukemia virus (MLV) and complex human immunodeficiency virus type 1 (HIV-1) in mind, the techniques were described in order to benefit to a larger community. PMID:27556480

Packaging of silicon photonic devices: from prototypes to production

NASA Astrophysics Data System (ADS)

Morrissey, Padraic E.; Gradkowski, Kamil; Carroll, Lee; O'Brien, Peter

2018-02-01

The challenges associated with the photonic packaging of silicon devices is often underestimated and remains technically challenging. In this paper, we review some key enabling technologies that will allow us to overcome the current bottleneck in silicon photonic packaging; while also describing the recent developments in standardisation, including the establishment of PIXAPP as the worlds first open-access PIC packaging and assembly Pilot Line. These developments will allow the community to move from low volume prototype photonic packaged devices to large scale volume manufacturing, where the full commercialisation of PIC technology can be realised.

26 CFR 1.994-1 - Inter-company pricing rules for DISC's.

Code of Federal Regulations, 2010 CFR

2010-04-01

..., freight insurance, State and local income and franchise taxes, the cost of manufacture or assembly... manufacturing (as defined in the regulations under section 993) and assembly. Thus, if a DISC buys and packages...

Ceramic ball grid array package stress analysis

NASA Astrophysics Data System (ADS)

Badri, S. H. B. S.; Aziz, M. H. A.; Ong, N. R.; Sauli, Z.; Alcain, J. B.; Retnasamy, V.

2017-09-01

The ball grid array (BGA), a form of chip scale package (CSP), was developed as one of the most advanced surface mount devices, which may be assembled by an ordinary surface ball bumps are used instead of plated nickel and gold (Ni/Au) bumps. Assembly and reliability of the BGA's printed circuit board (PCB), which is soldered by conventional surface mount technology is considered in this study. The Ceramic Ball Grid Array (CBGA) is a rectangular ceramic package or square-shaped that will use the solder ball for external electrical connections instead of leads or wire for connections. The solder balls will be arranged in an array or grid at the bottom of the ceramic package body. In this study, ANSYS software is used to investigate the stress on the package for 2 balls and 4 balls of the CBGA package with the various force range of 1-3 Newton applied to the top of the die, top of the substrate and side of the substrate. The highest maximum stress was analyzed and the maximum equivalent stress was observed on the solder ball and the die. From the simulation result, the CBGA package with less solder balls experience higher stress compared to the package with many solder balls. Therefore, less number of solder ball on the CBGA package results higher stress and critically affect the reliability of the solder balls itself, substrate and die which can lead to the solder crack and also die crack.

14. LIVING ROOM INTERIOR SHOWING WEST SIDE AND SOUTH END ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

14. LIVING ROOM INTERIOR SHOWING WEST SIDE AND SOUTH END DOUBLE FRENCH DOORS, AND FIBERBOARD WALLS. VIEW TO SOUTHWEST. - Big Creek Hydroelectric System, Powerhouse 8, Operator Cottage, Big Creek, Big Creek, Fresno County, CA

Thermokinetic analysis and product characterization of Medium Density Fiberboard pyrolysis.

PubMed

Aslan, Dilan Irmak; Özoğul, Buğçe; Ceylan, Selim; Geyikçi, Feza

2018-06-01

This study investigates the pyrolysis of Medium Density Fiberboard (MDF) as a potential waste management solution. Thermal behaviour of MDF was analysed via TG/DSC. The primary decomposition step occurred between 190 °C and 425 °C. Evolved gaseous products over this step were evaluated by a FTIR spectrometer coupled with TGA. Peaks for phenolic, alcohols and aldehydes were detected at the maximum decomposition temperature. Py-GC/MS analysis revealed phenols, ketones and cyclic compounds as the primary non-condensable pyrolysis products. The kinetics of pyrolysis were investigated by the widely applied Distributed Activation Energy Model, resulting in an average activation energy and pre-exponential factor of 127.40 kJ mol -1 and 8.4E+11. The results of this study suggest that pyrolyzing MDF could potentially provide renewable fuels and prevent environmental problems related with MDF disposal. Copyright © 2018 Elsevier Ltd. All rights reserved.

SCHEMA computational design of virus capsid chimeras: calibrating how genome packaging, protection, and transduction correlate with calculated structural disruption.

PubMed

Ho, Michelle L; Adler, Benjamin A; Torre, Michael L; Silberg, Jonathan J; Suh, Junghae

2013-12-20

Adeno-associated virus (AAV) recombination can result in chimeric capsid protein subunits whose ability to assemble into an oligomeric capsid, package a genome, and transduce cells depends on the inheritance of sequence from different AAV parents. To develop quantitative design principles for guiding site-directed recombination of AAV capsids, we have examined how capsid structural perturbations predicted by the SCHEMA algorithm correlate with experimental measurements of disruption in seventeen chimeric capsid proteins. In our small chimera population, created by recombining AAV serotypes 2 and 4, we found that protection of viral genomes and cellular transduction were inversely related to calculated disruption of the capsid structure. Interestingly, however, we did not observe a correlation between genome packaging and calculated structural disruption; a majority of the chimeric capsid proteins formed at least partially assembled capsids and more than half packaged genomes, including those with the highest SCHEMA disruption. These results suggest that the sequence space accessed by recombination of divergent AAV serotypes is rich in capsid chimeras that assemble into 60-mer capsids and package viral genomes. Overall, the SCHEMA algorithm may be useful for delineating quantitative design principles to guide the creation of libraries enriched in genome-protecting virus nanoparticles that can effectively transduce cells. Such improvements to the virus design process may help advance not only gene therapy applications but also other bionanotechnologies dependent upon the development of viruses with new sequences and functions.

SCHEMA computational design of virus capsid chimeras: calibrating how genome packaging, protection, and transduction correlate with calculated structural disruption

PubMed Central

Ho, Michelle L.; Adler, Benjamin A.; Torre, Michael L.; Silberg, Jonathan J.; Suh, Junghae

2013-01-01

Adeno-associated virus (AAV) recombination can result in chimeric capsid protein subunits whose ability to assemble into an oligomeric capsid, package a genome, and transduce cells depends on the inheritance of sequence from different AAV parents. To develop quantitative design principles for guiding site-directed recombination of AAV capsids, we have examined how capsid structural perturbations predicted by the SCHEMA algorithm correlate with experimental measurements of disruption in seventeen chimeric capsid proteins. In our small chimera population, created by recombining AAV serotypes 2 and 4, we found that protection of viral genomes and cellular transduction were inversely related to calculated disruption of the capsid structure. Interestingly, however, we did not observe a correlation between genome packaging and calculated structural disruption; a majority of the chimeric capsid proteins formed at least partially assembled capsids and more than half packaged genomes, including those with the highest SCHEMA disruption. These results suggest that the sequence space accessed by recombination of divergent AAV serotypes is rich in capsid chimeras that assemble into 60-mer capsids and package viral genomes. Overall, the SCHEMA algorithm may be useful for delineating quantitative design principles to guide the creation of libraries enriched in genome-protecting virus nanoparticles that can effectively transduce cells. Such improvements to the virus design process may help advance not only gene therapy applications, but also other bionanotechnologies dependent upon the development of viruses with new sequences and functions. PMID:23899192

Thermal cycling test results of CSP and RF assemblies

NASA Technical Reports Server (NTRS)

Ghaffarian, R.; Nelson, G.; Cooper, M.; Lam, D.; Strudler, S.; Umdekar, A.; Selk, K.; Bjorndahl, B.; Duprey, R.

2000-01-01

A JPL-led chip scale package (CSP) Consortium of enterprises, composed of representing agencies and private companies, recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.

Acceptance Data Package: SXI Stepper Motor/Encoder. Aeroflex P/N 16187. A; Engineering Drawings and Associated Lists

NASA Technical Reports Server (NTRS)

1994-01-01

Acceptance data package - engineering drawings and associated lists for fabrication, assembly and maintenance (cleaning, fluidized bed coating, bounding and staking) motor/encoded solar x-ray imager (SXI) (Aeroflex p/n 16187) were given.

Identifying the assembly intermediate in which Gag first associates with unspliced HIV-1 RNA suggests a novel model for HIV-1 RNA packaging.

PubMed

Barajas, Brook C; Tanaka, Motoko; Robinson, Bridget A; Phuong, Daryl J; Chutiraka, Kasana; Reed, Jonathan C; Lingappa, Jaisri R

2018-04-01

During immature capsid assembly, HIV-1 genome packaging is initiated when Gag first associates with unspliced HIV-1 RNA by a poorly understood process. Previously, we defined a pathway of sequential intracellular HIV-1 capsid assembly intermediates; here we sought to identify the intermediate in which HIV-1 Gag first associates with unspliced HIV-1 RNA. In provirus-expressing cells, unspliced HIV-1 RNA was not found in the soluble fraction of the cytosol, but instead was largely in complexes ≥30S. We did not detect unspliced HIV-1 RNA associated with Gag in the first assembly intermediate, which consists of soluble Gag. Instead, the earliest assembly intermediate in which we detected Gag associated with unspliced HIV-1 RNA was the second assembly intermediate (~80S intermediate), which is derived from a host RNA granule containing two cellular facilitators of assembly, ABCE1 and the RNA granule protein DDX6. At steady-state, this RNA-granule-derived ~80S complex was the smallest assembly intermediate that contained Gag associated with unspliced viral RNA, regardless of whether lysates contained intact or disrupted ribosomes, or expressed WT or assembly-defective Gag. A similar complex was identified in HIV-1-infected T cells. RNA-granule-derived assembly intermediates were detected in situ as sites of Gag colocalization with ABCE1 and DDX6; moreover these granules were far more numerous and smaller than well-studied RNA granules termed P bodies. Finally, we identified two steps that lead to association of assembling Gag with unspliced HIV-1 RNA. Independent of viral-RNA-binding, Gag associates with a broad class of RNA granules that largely lacks unspliced viral RNA (step 1). If a viral-RNA-binding domain is present, Gag further localizes to a subset of these granules that contains unspliced viral RNA (step 2). Thus, our data raise the possibility that HIV-1 packaging is initiated not by soluble Gag, but by Gag targeted to a subset of host RNA granules containing unspliced HIV-1 RNA.

Identifying the assembly intermediate in which Gag first associates with unspliced HIV-1 RNA suggests a novel model for HIV-1 RNA packaging

PubMed Central

Barajas, Brook C.; Tanaka, Motoko; Robinson, Bridget A.; Phuong, Daryl J.; Reed, Jonathan C.

2018-01-01

During immature capsid assembly, HIV-1 genome packaging is initiated when Gag first associates with unspliced HIV-1 RNA by a poorly understood process. Previously, we defined a pathway of sequential intracellular HIV-1 capsid assembly intermediates; here we sought to identify the intermediate in which HIV-1 Gag first associates with unspliced HIV-1 RNA. In provirus-expressing cells, unspliced HIV-1 RNA was not found in the soluble fraction of the cytosol, but instead was largely in complexes ≥30S. We did not detect unspliced HIV-1 RNA associated with Gag in the first assembly intermediate, which consists of soluble Gag. Instead, the earliest assembly intermediate in which we detected Gag associated with unspliced HIV-1 RNA was the second assembly intermediate (~80S intermediate), which is derived from a host RNA granule containing two cellular facilitators of assembly, ABCE1 and the RNA granule protein DDX6. At steady-state, this RNA-granule-derived ~80S complex was the smallest assembly intermediate that contained Gag associated with unspliced viral RNA, regardless of whether lysates contained intact or disrupted ribosomes, or expressed WT or assembly-defective Gag. A similar complex was identified in HIV-1-infected T cells. RNA-granule-derived assembly intermediates were detected in situ as sites of Gag colocalization with ABCE1 and DDX6; moreover these granules were far more numerous and smaller than well-studied RNA granules termed P bodies. Finally, we identified two steps that lead to association of assembling Gag with unspliced HIV-1 RNA. Independent of viral-RNA-binding, Gag associates with a broad class of RNA granules that largely lacks unspliced viral RNA (step 1). If a viral-RNA-binding domain is present, Gag further localizes to a subset of these granules that contains unspliced viral RNA (step 2). Thus, our data raise the possibility that HIV-1 packaging is initiated not by soluble Gag, but by Gag targeted to a subset of host RNA granules containing unspliced HIV-1 RNA. PMID:29664940

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2003-01-01

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

Structure-Function Analysis of the DNA Translocating Portal of the Bacteriophage T4 Packaging Machine

PubMed Central

Padilla-Sanchez, Victor; Gao, Song; Kim, Hyung Rae; Kihara, Daisuke; Sun, Lei; Rossmann, Michael G.; Rao, Venigalla B.

2013-01-01

Tailed bacteriophages and herpesviruses consist of a structurally well conserved dodecameric portal at a special five-fold vertex of the capsid. The portal plays critical roles in head assembly, genome packaging, neck/tail attachment, and genome ejection. Although the structures of portals from phages φ29, SPP1 and P22 have been determined, their mechanistic roles have not been well understood. Structural analysis of phage T4 portal (gp20) has been hampered because of its unusual interaction with the E. coli inner membrane. Here, we predict atomic models for the T4 portal monomer and dodecamer, and fit the dodecamer into the cryoEM density of the phage portal vertex. The core structure, like that from other phages, is cone-shaped with the wider end containing the “wing” and “crown” domains inside the phage head. A long “stem” encloses a central channel, and a narrow “stalk” protrudes outside the capsid. A biochemical approach was developed to analyze portal function by incorporating plasmid-expressed portal protein into phage heads and determining the effect of mutations on head assembly, DNA translocation, and virion production. We found that the protruding loops of the stalk domain are involved in assembling the DNA packaging motor. A loop that connects the stalk to the channel might be required for communication between the motor and portal. The “tunnel” loops that project into the channel are essential for sealing the packaged head. These studies established that the portal is required throughout the DNA packaging process, with different domains participating at different stages of genome packaging. PMID:24126213

Specific features of electrical properties of porous biocarbons prepared from beech wood and wood artificial fiberboards

NASA Astrophysics Data System (ADS)

Popov, V. V.; Orlova, T. S.; Magarino, E. Enrique; Bautista, M. A.; Martínez-Fernández, J.

2011-02-01

This paper reports on comparative investigations of the structural and electrical properties of biomorphic carbons prepared from natural beech wood, as well as medium-density and high-density fiberboards, by means of carbonization at different temperatures T carb in the range 650-1000°C. It has been demonstrated using X-ray diffraction analysis that biocarbons prepared from medium-density and high-density fiberboards at all temperatures T carb contain a nanocrystalline graphite component, namely, three-dimensional crystallites 11-14 Å in size. An increase in the carbonization temperature T carb to 1000°C leads to the appearance of a noticeable fraction of two-dimensional graphene particles with the same sizes. The temperature dependences of the electrical resistivity ρ of the biomorphic carbons have been measured and analyzed in the temperature range 1.8-300 K. For all types of carbons under investigation, an increase in the carbonization temperature T carb from 600 to 900°C leads to a change in the electrical resistivity at T = 300 K by five or six orders of magnitude. The dependences ρ( T) for these materials are adequately described by the Mott law for the variable-range hopping conduction. It has been revealed that the temperature dependence of the electrical resistivity exhibits a hysteresis, which has been attributed to thermomechanical stresses in an inhomogeneous structure of the biocarbon prepared at a low carbonization temperature T carb. The crossover to the conductivity characteristic of disordered metal systems is observed at T carb ≳ 1000°C.

IEEE WMED 2016 Homepage

Science.gov Websites

characterization, design, and new device technologies. This workshop will consist of invited talks, contributed and Reliability Semiconductor package reliability, Design for Manufacturability, Stacked die packaging and Novel assembly processes Microelectronic Circuit Design New product design, high-speed and/or low

49 CFR 173.62 - Specific packaging requirements for explosives.

Code of Federal Regulations, 2011 CFR

2011-10-01

... article or material carried in the vehicle; and (ii) The assembled gun packed on the vehicle may not... HAZARDOUS MATERIALS SAFETY ADMINISTRATION, DEPARTMENT OF TRANSPORTATION HAZARDOUS MATERIALS REGULATIONS... kg in small packages as specified by the Associate Administrator for Hazardous Materials Safety 110(a...

49 CFR 173.62 - Specific packaging requirements for explosives.

Code of Federal Regulations, 2012 CFR

2012-10-01

... article or material carried in the vehicle; and (ii) The assembled gun packed on the vehicle may not... HAZARDOUS MATERIALS SAFETY ADMINISTRATION, DEPARTMENT OF TRANSPORTATION HAZARDOUS MATERIALS REGULATIONS... packages as specified by the Associate Administrator for Hazardous Materials Safety 110(a) Bags Bags Drums...

Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows

NASA Astrophysics Data System (ADS)

Li, Yan; Hatch, Olen; Liu, Pilin; Goyal, Deepak

2017-03-01

Solder joint interconnects in three-dimensional (3D) packages with package stacking configurations typically must undergo multiple reflow cycles during the assembly process. In this work, interfacial open joint failures between the bulk solder and the intermetallic compound (IMC) layer were found in Sn-Ag-Cu (SAC) solder joints connecting a small package to a large package after multiple reflow reliability tests. Systematic progressive 3D x-ray computed tomography experiments were performed on both incoming and assembled parts to reveal the initiation and evolution of the open failures in the same solder joints before and after the reliability tests. Characterization studies, including focused ion beam cross-sections, scanning electron microscopy, and energy-dispersive x-ray spectroscopy, were conducted to determine the correlation between IMC phase transformation and failure initiation in the solder joints. A comprehensive failure mechanism, along with solution paths for the solder joint interfacial failures after multiple reflow cycles, is discussed in detail.

An RNA Domain Imparts Specificity and Selectivity to a Viral DNA Packaging Motor

PubMed Central

Zhao, Wei; Jardine, Paul J.

2015-01-01

ABSTRACT During assembly, double-stranded DNA viruses, including bacteriophages and herpesviruses, utilize a powerful molecular motor to package their genomic DNA into a preformed viral capsid. An integral component of the packaging motor in the Bacillus subtilis bacteriophage ϕ29 is a viral genome-encoded pentameric ring of RNA (prohead RNA [pRNA]). pRNA is a 174-base transcript comprised of two domains, domains I and II. Early studies initially isolated a 120-base form (domain I only) that retains high biological activity in vitro; hence, no function could be assigned to domain II. Here we define a role for this domain in the packaging process. DNA packaging using restriction digests of ϕ29 DNA showed that motors with the 174-base pRNA supported the correct polarity of DNA packaging, selectively packaging the DNA left end. In contrast, motors containing the 120-base pRNA had compromised specificity, packaging both left- and right-end fragments. The presence of domain II also provides selectivity in competition assays with genomes from related phages. Furthermore, motors with the 174-base pRNA were restrictive, in that they packaged only one DNA fragment into the head, whereas motors with the 120-base pRNA packaged several fragments into the head, indicating multiple initiation events. These results show that domain II imparts specificity and stringency to the motor during the packaging initiation events that precede DNA translocation. Heteromeric rings of pRNA demonstrated that one or two copies of domain II were sufficient to impart this selectivity/stringency. Although ϕ29 differs from other double-stranded DNA phages in having an RNA motor component, the function provided by pRNA is carried on the motor protein components in other phages. IMPORTANCE During virus assembly, genome packaging involves the delivery of newly synthesized viral nucleic acid into a protein shell. In the double-stranded DNA phages and herpesviruses, this is accomplished by a powerful molecular motor that translocates the viral DNA into a preformed viral shell. A key event in DNA packaging is recognition of the viral DNA among other nucleic acids in the host cell. Commonly, a DNA-binding protein mediates the interaction of viral DNA with the motor/head shell. Here we show that for the bacteriophage ϕ29, this essential step of genome recognition is mediated by a viral genome-encoded RNA rather than a protein. A domain of the prohead RNA (pRNA) imparts specificity and stringency to the motor by ensuring the correct orientation of DNA packaging and restricting initiation to a single event. Since this assembly step is unique to the virus, DNA packaging is a novel target for the development of antiviral drugs. PMID:26423956

An RNA Domain Imparts Specificity and Selectivity to a Viral DNA Packaging Motor.

PubMed

Zhao, Wei; Jardine, Paul J; Grimes, Shelley

2015-12-01

During assembly, double-stranded DNA viruses, including bacteriophages and herpesviruses, utilize a powerful molecular motor to package their genomic DNA into a preformed viral capsid. An integral component of the packaging motor in the Bacillus subtilis bacteriophage ϕ29 is a viral genome-encoded pentameric ring of RNA (prohead RNA [pRNA]). pRNA is a 174-base transcript comprised of two domains, domains I and II. Early studies initially isolated a 120-base form (domain I only) that retains high biological activity in vitro; hence, no function could be assigned to domain II. Here we define a role for this domain in the packaging process. DNA packaging using restriction digests of ϕ29 DNA showed that motors with the 174-base pRNA supported the correct polarity of DNA packaging, selectively packaging the DNA left end. In contrast, motors containing the 120-base pRNA had compromised specificity, packaging both left- and right-end fragments. The presence of domain II also provides selectivity in competition assays with genomes from related phages. Furthermore, motors with the 174-base pRNA were restrictive, in that they packaged only one DNA fragment into the head, whereas motors with the 120-base pRNA packaged several fragments into the head, indicating multiple initiation events. These results show that domain II imparts specificity and stringency to the motor during the packaging initiation events that precede DNA translocation. Heteromeric rings of pRNA demonstrated that one or two copies of domain II were sufficient to impart this selectivity/stringency. Although ϕ29 differs from other double-stranded DNA phages in having an RNA motor component, the function provided by pRNA is carried on the motor protein components in other phages. During virus assembly, genome packaging involves the delivery of newly synthesized viral nucleic acid into a protein shell. In the double-stranded DNA phages and herpesviruses, this is accomplished by a powerful molecular motor that translocates the viral DNA into a preformed viral shell. A key event in DNA packaging is recognition of the viral DNA among other nucleic acids in the host cell. Commonly, a DNA-binding protein mediates the interaction of viral DNA with the motor/head shell. Here we show that for the bacteriophage ϕ29, this essential step of genome recognition is mediated by a viral genome-encoded RNA rather than a protein. A domain of the prohead RNA (pRNA) imparts specificity and stringency to the motor by ensuring the correct orientation of DNA packaging and restricting initiation to a single event. Since this assembly step is unique to the virus, DNA packaging is a novel target for the development of antiviral drugs. Copyright © 2015, American Society for Microbiology. All Rights Reserved.

Partially integrated exhaust manifold

DOEpatents

Hayman, Alan W; Baker, Rodney E

2015-01-20

A partially integrated manifold assembly is disclosed which improves performance, reduces cost and provides efficient packaging of engine components. The partially integrated manifold assembly includes a first leg extending from a first port and terminating at a mounting flange for an exhaust gas control valve. Multiple additional legs (depending on the total number of cylinders) are integrally formed with the cylinder head assembly and extend from the ports of the associated cylinder and terminate at an exit port flange. These additional legs are longer than the first leg such that the exit port flange is spaced apart from the mounting flange. This configuration provides increased packaging space adjacent the first leg for any valving that may be required to control the direction and destination of exhaust flow in recirculation to an EGR valve or downstream to a catalytic converter.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sanchez, R.O.

Voltage breakdowns become a major concern in reducing the size of high-voltage power converter transformers. Even the smallest of voids can provide a path for corona discharge which can cause a dielectric breakdown leading to a transformer failure. A method of encapsulating small high voltage transformers has been developed. The method virtually eliminates voids in the impregnation material, provides an exceptional dielectric between windings and provides a mechanically rugged package. The encapsulation material is a CTBN modified mica filled epoxy. The method requires heat/vacuum to impregnate the coil and heat/pressure to cure the encapsulant. The transformer package utilizes a Diallylmore » Phthalate (DAP) contact assembly in which a coated core/coil assembly is mounted and soldered. This assembly is then loaded into an RTV mold and the encapsulation process begins.« less

Spacecraft System Integration and Test: SSTI Lewis critical design audit

NASA Technical Reports Server (NTRS)

Brooks, R. P.; Cha, K. K.

1995-01-01

The Critical Design Audit package is the final detailed design package which provides a comprehensive description of the SSTI mission. This package includes the program overview, the system requirements, the science and applications activities, the ground segment development, the assembly, integration and test description, the payload and technology demonstrations, and the spacecraft bus subsystems. Publication and presentation of this document marks the final requirements and design freeze for SSTI.

A minimal kinetic model for a viral DNA packaging machine.

PubMed

Yang, Qin; Catalano, Carlos Enrique

2004-01-20

Terminase enzymes are common to both eukaryotic and prokaryotic double-stranded DNA viruses. These enzymes possess ATPase and nuclease activities that work in concert to "package" a viral genome into an empty procapsid, and it is likely that terminase enzymes from disparate viruses utilize a common packaging mechanism. Bacteriophage lambda terminase possesses a site-specific nuclease activity, a so-called helicase activity, a DNA translocase activity, and multiple ATPase catalytic sites that function to package viral DNA. Allosteric interactions between the multiple catalytic sites have been reported. This study probes these catalytic interactions using enzyme kinetic, photoaffinity labeling, and vanadate inhibition studies. The ensemble of data forms the basis for a minimal kinetic model for lambda terminase. The model incorporates an ADP-driven conformational reorganization of the terminase subunits assembled on viral DNA, which is central to the activation of a catalytically competent packaging machine. The proposed model provides a unifying mechanism for allosteric interaction between the multiple catalytic sites of the holoenzyme and explains much of the kinetic data in the literature. Given that similar packaging mechanisms have been proposed for viruses as dissimilar as lambda and the herpes viruses, the model may find general utility in our global understanding of the enzymology of virus assembly.

Qualification and Reliability for MEMS and IC Packages

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2004-01-01

Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

The Assurance Challenges of Advanced Packaging Technologies for Electronics

NASA Technical Reports Server (NTRS)

Sampson, Michael J.

2010-01-01

Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

Pilot Fullerton uses water dispenser kit gun to rehydrate food package

NASA Image and Video Library

1982-03-30

STS003-26-254 (30 March 1982) --- Astronaut Gordon Fullerton, STS-3 pilot, wearing communications kit assembly (ASSY) mini-headset (HDST), inserts the JSC water dispenser kit water gun in rehydratable plastic food (cereal) package to fill it with hot water. Photo credit: NASA

SYNCSA--R tool for analysis of metacommunities based on functional traits and phylogeny of the community components.

PubMed

Debastiani, Vanderlei J; Pillar, Valério D

2012-08-01

SYNCSA is an R package for the analysis of metacommunities based on functional traits and phylogeny of the community components. It offers tools to calculate several matrix correlations that express trait-convergence assembly patterns, trait-divergence assembly patterns and phylogenetic signal in functional traits at the species pool level and at the metacommunity level. SYNCSA is a package for the R environment, under a GPL-2 open-source license and freely available on CRAN official web server for R (http://cran.r-project.org). vanderleidebastiani@yahoo.com.br.

RNAbrowse: RNA-Seq de novo assembly results browser.

PubMed

Mariette, Jérôme; Noirot, Céline; Nabihoudine, Ibounyamine; Bardou, Philippe; Hoede, Claire; Djari, Anis; Cabau, Cédric; Klopp, Christophe

2014-01-01

Transcriptome analysis based on a de novo assembly of next generation RNA sequences is now performed routinely in many laboratories. The generated results, including contig sequences, quantification figures, functional annotations and variation discovery outputs are usually bulky and quite diverse. This article presents a user oriented storage and visualisation environment permitting to explore the data in a top-down manner, going from general graphical views to all possible details. The software package is based on biomart, easy to install and populate with local data. The software package is available under the GNU General Public License (GPL) at http://bioinfo.genotoul.fr/RNAbrowse.

49 CFR 178.516 - Standards for fiberboard boxes.

Code of Federal Regulations, 2010 CFR

2010-10-01

... minutes by the Cobb method of determining water absorption, is not greater than 155 g per square meter (0...) Maximum net mass: 400 kg (882 pounds). [Amdt. 178-97, 55 FR 52717, Dec. 21, 1990, and amended by Amdt. 178...

49 CFR 173.184 - Highway or rail fusee.

Code of Federal Regulations, 2014 CFR

2014-10-01

...) boxes, wooden (4C1, 4C2), plywood (4D) or reconstituted wood (4F) boxes or in fiberboard boxes (4G... drop test requirements (§ 178.603 of this subchapter), including at least one drop with spike in a...

49 CFR 173.184 - Highway or rail fusee.

Code of Federal Regulations, 2013 CFR

2013-10-01

...) boxes, wooden (4C1, 4C2), plywood (4D) or reconstituted wood (4F) boxes or in fiberboard boxes (4G... drop test requirements (§ 178.603 of this subchapter), including at least one drop with spike in a...

Medium density fiberboard made from Eucalyptus saligna

Treesearch

Andrzej M. Krzysik; James H. Muehl; John A. Youngquist; Fabio Spina Franca

2001-01-01

The production of industrial wood from natural forests is predicted to decline in the future. Factors that will contribute to this decline include changes in land use patterns, depletion of resources in some parts of the world, and the withdrawal of...

Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors

PubMed Central

Hera, Daniel; Berndt, Armin; Günther, Thomas; Schmiel, Stephan; Harendt, Christine; Zimmermann, André

2017-01-01

Packaging represents an important part in the microintegration of sensors based on microelectromechanical system (MEMS). Besides miniaturization and integration density, functionality and reliability in combination with flexibility in packaging design at moderate costs and consequently high-mix, low-volume production are the main requirements for future solutions in packaging. This study investigates possibilities employing printed circuit board (PCB-)based assemblies to provide high flexibility for circuit designs together with film-assisted transfer molding (FAM) to package sensors. The feasibility of FAM in combination with PCB and MEMS as a packaging technology for highly sensitive inertia sensors is being demonstrated. The results prove the technology to be a viable method for damage-free packaging of stress- and pressure-sensitive MEMS. PMID:28653992

Thematic mapper flight model preshipment review data package. Volume 4: Appendix. Part D: Focal plane assembly data

NASA Technical Reports Server (NTRS)

1982-01-01

The data obtained for the Band 1 thematic mapper flight full band assembly (P/N 50797) are summarized. The data were collected from half band, post amplifier, and full band acceptance test data records.

Self-assembling, protein-based intracellular bacterial organelles: emerging vehicles for encapsulating, targeting and delivering therapeutical cargoes

PubMed Central

2011-01-01

Many bacterial species contain intracellular nano- and micro-compartments consisting of self-assembling proteins that form protein-only shells. These structures are built up by combinations of a reduced number of repeated elements, from 60 repeated copies of one unique structural element self-assembled in encapsulins of 24 nm to 10,000-20,000 copies of a few protein species assembled in a organelle of around 100-150 nm in cross-section. However, this apparent simplicity does not correspond to the structural and functional sophistication of some of these organelles. They package, by not yet definitely solved mechanisms, one or more enzymes involved in specific metabolic pathways, confining such reactions and sequestering or increasing the inner concentration of unstable, toxics or volatile intermediate metabolites. From a biotechnological point of view, we can use the self assembling properties of these particles for directing shell assembling and enzyme packaging, mimicking nature to design new applications in biotechnology. Upon appropriate engineering of the building blocks, they could act as a new family of self-assembled, protein-based vehicles in Nanomedicine to encapsulate, target and deliver therapeutic cargoes to specific cell types and/or tissues. This would provide a new, intriguing platform of microbial origin for drug delivery. PMID:22046962

Noncanonical self-assembly of multifunctional DNA nanoflowers for biomedical applications.

PubMed

Zhu, Guizhi; Hu, Rong; Zhao, Zilong; Chen, Zhuo; Zhang, Xiaobing; Tan, Weihong

2013-11-06

DNA nanotechnology has been extensively explored to assemble various functional nanostructures for versatile applications. Mediated by Watson-Crick base-pairing, these DNA nanostructures have been conventionally assembled through hybridization of many short DNA building blocks. Here we report the noncanonical self-assembly of multifunctional DNA nanostructures, termed as nanoflowers (NFs), and the versatile biomedical applications. These NFs were assembled from long DNA building blocks generated via rolling circle replication (RCR) of a designer template. NF assembly was driven by liquid crystallization and dense packaging of building blocks, without relying on Watson-Crick base-pairing between DNA strands, thereby avoiding the otherwise conventional complicated DNA sequence design. NF sizes were readily tunable in a wide range, by simply adjusting such parameters as assembly time and template sequences. NFs were exceptionally resistant to nuclease degradation, denaturation, or dissociation at extremely low concentration, presumably resulting from the dense DNA packaging in NFs. The exceptional biostability is critical for biomedical applications. By rational design, NFs can be readily incorporated with myriad functional moieties. All these properties make NFs promising for versatile applications. As a proof-of-principle demonstration, in this study, NFs were integrated with aptamers, bioimaging agents, and drug loading sites, and the resultant multifunctional NFs were demonstrated for selective cancer cell recognition, bioimaging, and targeted anticancer drug delivery.

Noncanonical self-assembly of multifunctional DNA nanoflowers for biomedical applications

PubMed Central

Zhu, Guizhi; Hu, Rong; Zhao, Zilong; Chen, Zhuo; Zhang, Xiaobing; Tan, Weihong

2013-01-01

DNA nanotechnology has been extensively explored to assemble various functional nanostructures for versatile applications. Mediated by Watson-Crick base-pairing, these DNA nanostructures have been conventionally assembled through hybridization of many short DNA building blocks. Here we report the noncanonical self-assembly of multifunctional DNA nanostructures, termed as nanoflowers (NFs), and the versatile biomedical applications. These NFs were assembled from long DNA building blocks generated via Rolling Circle Replication (RCR) of a designer template. NF assembly was driven by liquid crystallization and dense packaging of building blocks, without relying on Watson-Crick base-pairing between DNA strands, thereby avoiding the otherwise conventional complicated DNA sequence design. NF sizes were readily tunable in a wide range, by simply adjusting such parameters as assembly time and template sequences. NFs were exceptionally resistant to nuclease degradation, denaturation, or dissociation at extremely low concentration, presumably resulting from the dense DNA packaging in NFs. The exceptional biostability is critical for biomedical applications. By rational design, NFs can be readily incorporated with myriad functional moieties. All these properties make NFs promising for versatile applications. As a proof-of-principle demonstration, in this study, NFs were integrated with aptamers, bioimaging agents, and drug loading sites, and the resultant multifunctional NFs were demonstrated for selective cancer cell recognition, bioimaging, and targeted anticancer drug delivery. PMID:24164620

Low-cost and miniaturized 100-Gb/s (2 × 50 Gb/s) PAM-4 TO-packaged ROSA for data center networks.

PubMed

Kang, Sae-Kyoung; Huh, Joon Young; Lee, Jie Hyun; Lee, Joon Ki

2018-03-05

We design and implement a cost-effective and compact 100-Gb/s (2 × 50 Gb/s) PAM-4 receiver optical sub-assembly (ROSA) by using a TO-can package instead of an expensive box-type package. It consists of an optical demultiplexer, two PIN-PDs and a 2-channel linear transimpedance amplifier. The components are passively aligned and assembled using alignment marks engraved on each part. With a real-time PAM-4 DSP chip, we measured the back-to-back receiver sensitivities of the 100-Gb/s ROSA based on TO-56 to be less than -13.2 dBm for both channels at a bit error rate of 2.4e-4. The crosstalk penalty due to the adjacent channel interference was observed around 0.1 dB.

Towards co-packaging of photonics and microelectronics in existing manufacturing facilities

NASA Astrophysics Data System (ADS)

Janta-Polczynski, Alexander; Cyr, Elaine; Bougie, Jerome; Drouin, Alain; Langlois, Richard; Childers, Darrell; Takenobu, Shotaro; Taira, Yoichi; Lichoulas, Ted W.; Kamlapurkar, Swetha; Engelmann, Sebastian; Fortier, Paul; Boyer, Nicolas; Barwicz, Tymon

2018-02-01

The impact of integrated photonics on optical interconnects is currently muted by challenges in photonic packaging and in the dense integration of photonic modules with microelectronic components on printed circuit boards. Single mode optics requires tight alignment tolerance for optical coupling and maintaining this alignment in a cost-efficient package can be challenging during thermal excursions arising from downstream microelectronic assembly processes. In addition, the form factor of typical fiber connectors is incompatible with the dense module integration expected on printed circuit boards. We have implemented novel approaches to interfacing photonic chips to standard optical fibers. These leverage standard high throughput microelectronic assembly tooling and self-alignment techniques resulting in photonic packaging that is scalable in manufacturing volume and in the number of optical IOs per chip. In addition, using dense optical fiber connectors with space-efficient latching of fiber patch cables results in compact module size and efficient board integration, bringing the optics closer to the logic chip to alleviate bandwidth bottlenecks. This packaging direction is also well suited for embedding optics in multi-chip modules, including both photonic and microelectronic chips. We discuss the challenges and rewards in this type of configuration such as thermal management and signal integrity.

Optomechanical Design and Characterization of a Printed-Circuit-Board-Based Free-Space Optical Interconnect Package

NASA Astrophysics Data System (ADS)

Zheng, Xuezhe; Marchand, Philippe J.; Huang, Dawei; Kibar, Osman; Ozkan, Nur S. E.; Esener, Sadik C.

1999-09-01

We present a proof of concept and a feasibility demonstration of a practical packaging approach in which free-space optical interconnects (FSOI s) can be integrated simply on electronic multichip modules (MCM s) for intra-MCM board interconnects. Our system-level packaging architecture is based on a modified folded 4 f imaging system that has been implemented with only off-the-shelf optics, conventional electronic packaging, and passive-assembly techniques to yield a potentially low-cost and manufacturable packaging solution. The prototypical system as built supports 48 independent FSOI channels with 8 separate laser and detector chips, for which each chip consists of a one-dimensional array of 12 devices. All the chips are assembled on a single substrate that consists of a printed circuit board or a ceramic MCM. Optical link channel efficiencies of greater than 90% and interchannel cross talk of less than 20 dB at low frequency have been measured. The system is compact at only 10 in. 3 (25.4 cm 3 ) and is scalable, as it can easily accommodate additional chips as well as two-dimensional optoelectronic device arrays for increased interconnection density.

Cooperative heteroassembly of the adenoviral L4-22K and IVa2 proteins onto the viral packaging sequence DNA.

PubMed

Yang, Teng-Chieh; Maluf, Nasib Karl

2012-02-21

Human adenovirus (Ad) is an icosahedral, double-stranded DNA virus. Viral DNA packaging refers to the process whereby the viral genome becomes encapsulated by the viral particle. In Ad, activation of the DNA packaging reaction requires at least three viral components: the IVa2 and L4-22K proteins and a section of DNA within the viral genome, called the packaging sequence. Previous studies have shown that the IVa2 and L4-22K proteins specifically bind to conserved elements within the packaging sequence and that these interactions are absolutely required for the observation of DNA packaging. However, the equilibrium mechanism for assembly of IVa2 and L4-22K onto the packaging sequence has not been determined. Here we characterize the assembly of the IVa2 and L4-22K proteins onto truncated packaging sequence DNA by analytical sedimentation velocity and equilibrium methods. At limiting concentrations of L4-22K, we observe a species with two IVa2 monomers and one L4-22K monomer bound to the DNA. In this species, the L4-22K monomer is promoting positive cooperative interactions between the two bound IVa2 monomers. As L4-22K levels are increased, we observe a species with one IVa2 monomer and three L4-22K monomers bound to the DNA. To explain this result, we propose a model in which L4-22K self-assembly on the DNA competes with IVa2 for positive heterocooperative interactions, destabilizing binding of the second IVa2 monomer. Thus, we propose that L4-22K levels control the extent of cooperativity observed between adjacently bound IVa2 monomers. We have also determined the hydrodynamic properties of all observed stoichiometric species; we observe that species with three L4-22K monomers bound have more extended conformations than species with a single L4-22K bound. We suggest this might reflect a molecular switch that controls insertion of the viral DNA into the capsid.

Assembly reliability of CSPs with various chiip sizes by accelerated thermal and mechanical cycling test

NASA Technical Reports Server (NTRS)

Ghaffarian, R.

2000-01-01

A JPL-led chip scale package (CSP) Consortium, composed of team members representing government agencies and private companies, recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.

Responding Creatively to Bone and Blaise (2015) through Packaging, Drawing and Assembling

ERIC Educational Resources Information Center

Potts, Miriam

2017-01-01

In this colloquium, the author responds artistically to Bone and Blaise's article "An uneasy assemblage: Prisoners, animals, asylum-seeking children and posthuman packaging," published in "Contemporary Issues in Early Childhood in 2015" (EJ1058615), continuing their trajectory of "different kinds of images than those…

DOE Office of Scientific and Technical Information (OSTI.GOV)

Rodenbeck, Christopher T; Girardi, Michael

Internal nodes of a constituent integrated circuit (IC) package of a multichip module (MCM) are protected from excessive charge during plasma cleaning of the MCM. The protected nodes are coupled to an internal common node of the IC package by respectively associated discharge paths. The common node is connected to a bond pad of the IC package. During MCM assembly, and before plasma cleaning, this bond pad receives a wire bond to a ground bond pad on the MCM substrate.

49 CFR 173.184 - Highway or rail fusee.

Code of Federal Regulations, 2010 CFR

2010-10-01

... (3A2), wooden (4C1, 4C2), plywood (4D) or reconstituted wood (4F) boxes or in fiberboard boxes (4G... drop test requirements (§ 178.603 of this subchapter), including at least one drop with spike in a...

49 CFR 173.184 - Highway or rail fusee.

Code of Federal Regulations, 2011 CFR

2011-10-01

... (3A2), wooden (4C1, 4C2), plywood (4D) or reconstituted wood (4F) boxes or in fiberboard boxes (4G... drop test requirements (§ 178.603 of this subchapter), including at least one drop with spike in a...

49 CFR 173.184 - Highway or rail fusee.

Code of Federal Regulations, 2012 CFR

2012-10-01

... (3A2), wooden (4C1, 4C2), plywood (4D) or reconstituted wood (4F) boxes or in fiberboard boxes (4G... drop test requirements (§ 178.603 of this subchapter), including at least one drop with spike in a...

Environmentally Benign Battlefield Effects Black Smoke Simulator

DTIC Science & Technology

2006-11-01

tested and results Fuel Oxidizer Color of Smoke Density of Smoke Sugar (Sucrose) KNO3 Grey Medium Dextrin KNO3 Grey Thin Microcrystalline...design. 3.5 Initial Prototype Scale Fiberboard Testing Several quality black smoke formulations were identified in the small pellet testing to

7 CFR 3201.19 - Composite panels.

Code of Federal Regulations, 2012 CFR

2012-01-01

... Fiberboard; Shower and Restroom Dividers; and Signage. USDA is requesting that manufacturers of these... dividers, and signage, and which product should be afforded the preference in purchasing. Note to paragraph... signage containing recovered materials as items for which Federal agencies must give preference in their...

7 CFR 3201.19 - Composite panels.

Code of Federal Regulations, 2013 CFR

2013-01-01

... Fiberboard; Shower and Restroom Dividers; and Signage. USDA is requesting that manufacturers of these... dividers, and signage, and which product should be afforded the preference in purchasing. Note to paragraph... signage containing recovered materials as items for which Federal agencies must give preference in their...

7 CFR 3201.19 - Composite panels.

Code of Federal Regulations, 2014 CFR

2014-01-01

... Fiberboard; Shower and Restroom Dividers; and Signage. USDA is requesting that manufacturers of these... dividers, and signage, and which product should be afforded the preference in purchasing. Note to paragraph... signage containing recovered materials as items for which Federal agencies must give preference in their...

Mixed Oxide Fresh Fuel Package Auxiliary Equipment

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yapuncich, F.; Ross, A.; Clark, R.H.

2008-07-01

The United States Department of Energy's National Nuclear Security Administration (NNSA) is overseeing the construction the Mixed Oxide (MOX) Fuel Fabrication Facility (MFFF) on the Savannah River Site. The new facility, being constructed by NNSA's contractor Shaw AREVA MOX Services, will fabricate fuel assemblies utilizing surplus plutonium as feedstock. The fuel will be used in designated commercial nuclear reactors. The MOX Fresh Fuel Package (MFFP), which has recently been licensed by the Nuclear Regulatory Commission (NRC) as a type B package (USA/9295/B(U)F-96), will be utilized to transport the fabricated fuel assemblies from the MFFF to the nuclear reactors. It wasmore » necessary to develop auxiliary equipment that would be able to efficiently handle the high precision fuel assemblies. Also, the physical constraints of the MFFF and the nuclear power plants require that the equipment be capable of loading and unloading the fuel assemblies both vertically and horizontally. The ability to reconfigure the load/unload evolution builds in a large degree of flexibility for the MFFP for the handling of many types of both fuel and non fuel payloads. The design and analysis met various technical specifications including dynamic and static seismic criteria. The fabrication was completed by three major fabrication facilities within the United States. The testing was conducted by Sandia National Laboratories. The unique design specifications and successful testing sequences will be discussed. (authors)« less

A method for encapsulating high voltage power transformers

NASA Astrophysics Data System (ADS)

Sanchez, Robert O.

Voltage breakdowns become a major concern in reducing the size of high-voltage power converter transformers. Even the smallest of voids can provide a path for corona discharge which can cause a dielectric breakdown leading to a transformer failure. A method of encapsulating small high voltage transformers has been developed. The method virtually eliminates voids in the impregnation material, provides an exceptional dielectric between windings and provides a mechanically rugged package. The encapsulation material is a carboxyl terminated butadiene nitril (CTBN) modified mica filled epoxy. The method requires heat/vacuum to impregnate the coil and heat/pressure to cure the encapsulant. The transformer package utilizes a diallyl phthalate (DAP) contact assembly in which a coated core/coil assembly is mounted and soldered. This assembly is then loaded into an RTV mold and the encapsulation process begins.

Nucleic Acid Binding by Mason-Pfizer Monkey Virus CA Promotes Virus Assembly and Genome Packaging

PubMed Central

Füzik, Tibor; Píchalová, Růžena; Schur, Florian K. M.; Strohalmová, Karolína; Křížová, Ivana; Hadravová, Romana; Rumlová, Michaela; Briggs, John A. G.

2016-01-01

ABSTRACT The Gag polyprotein of retroviruses drives immature virus assembly by forming hexameric protein lattices. The assembly is primarily mediated by protein-protein interactions between capsid (CA) domains and by interactions between nucleocapsid (NC) domains and RNA. Specific interactions between NC and the viral RNA are required for genome packaging. Previously reported cryoelectron microscopy analysis of immature Mason-Pfizer monkey virus (M-PMV) particles suggested that a basic region (residues RKK) in CA may serve as an additional binding site for nucleic acids. Here, we have introduced mutations into the RKK region in both bacterial and proviral M-PMV vectors and have assessed their impact on M-PMV assembly, structure, RNA binding, budding/release, nuclear trafficking, and infectivity using in vitro and in vivo systems. Our data indicate that the RKK region binds and structures nucleic acid that serves to promote virus particle assembly in the cytoplasm. Moreover, the RKK region appears to be important for recruitment of viral genomic RNA into Gag particles, and this function could be linked to changes in nuclear trafficking. Together these observations suggest that in M-PMV, direct interactions between CA and nucleic acid play important functions in the late stages of the viral life cycle. IMPORTANCE Assembly of retrovirus particles is driven by the Gag polyprotein, which can self-assemble to form virus particles and interact with RNA to recruit the viral genome into the particles. Generally, the capsid domains of Gag contribute to essential protein-protein interactions during assembly, while the nucleocapsid domain interacts with RNA. The interactions between the nucleocapsid domain and RNA are important both for identifying the genome and for self-assembly of Gag molecules. Here, we show that a region of basic residues in the capsid protein of the betaretrovirus Mason-Pfizer monkey virus (M-PMV) contributes to interaction of Gag with nucleic acid. This interaction appears to provide a critical scaffolding function that promotes assembly of virus particles in the cytoplasm. It is also crucial for packaging the viral genome and thus for infectivity. These data indicate that, surprisingly, interactions between the capsid domain and RNA play an important role in the assembly of M-PMV. PMID:26912613

Deciphering the role of the Gag-Pol ribosomal frameshift signal in HIV-1 RNA genome packaging.

PubMed

Nikolaitchik, Olga A; Hu, Wei-Shau

2014-04-01

A key step of retroviral replication is packaging of the viral RNA genome during virus assembly. Specific packaging is mediated by interactions between the viral protein Gag and elements in the viral RNA genome. In HIV-1, similar to most retroviruses, the packaging signal is located within the 5' untranslated region and extends into the gag-coding region. A recent study reported that a region including the Gag-Pol ribosomal frameshift signal plays an important role in HIV-1 RNA packaging; deletions or mutations that affect the RNA structure of this signal lead to drastic decreases (10- to 50-fold) in viral RNA packaging and virus titer. We examined here the role of the ribosomal frameshift signal in HIV-1 RNA packaging by studying the RNA packaging and virus titer in the context of proviruses. Three mutants with altered ribosomal frameshift signal, either through direct deletion of the signal, mutation of the 6U slippery sequence, or alterations of the secondary structure were examined. We found that RNAs from all three mutants were packaged efficiently, and they generate titers similar to that of a virus containing the wild-type ribosomal frameshift signal. We conclude that although the ribosomal frameshift signal plays an important role in regulating the replication cycle, this RNA element is not directly involved in regulating RNA encapsidation. To generate infectious viruses, HIV-1 must package viral RNA genome during virus assembly. The specific HIV-1 genome packaging is mediated by interactions between the structural protein Gag and elements near the 5' end of the viral RNA known as packaging signal. In this study, we examined whether the Gag-Pol ribosomal frameshift signal is important for HIV-1 RNA packaging as recently reported. Our results demonstrated that when Gag/Gag-Pol is supplied in trans, none of the tested ribosomal frameshift signal mutants has defects in RNA packaging or virus titer. These studies provide important information on how HIV-1 regulates its genome packaging and generate infectious viruses necessary for transmission to new hosts.

Deciphering the Role of the Gag-Pol Ribosomal Frameshift Signal in HIV-1 RNA Genome Packaging

PubMed Central

Nikolaitchik, Olga A.

2014-01-01

ABSTRACT A key step of retroviral replication is packaging of the viral RNA genome during virus assembly. Specific packaging is mediated by interactions between the viral protein Gag and elements in the viral RNA genome. In HIV-1, similar to most retroviruses, the packaging signal is located within the 5′ untranslated region and extends into the gag-coding region. A recent study reported that a region including the Gag-Pol ribosomal frameshift signal plays an important role in HIV-1 RNA packaging; deletions or mutations that affect the RNA structure of this signal lead to drastic decreases (10- to 50-fold) in viral RNA packaging and virus titer. We examined here the role of the ribosomal frameshift signal in HIV-1 RNA packaging by studying the RNA packaging and virus titer in the context of proviruses. Three mutants with altered ribosomal frameshift signal, either through direct deletion of the signal, mutation of the 6U slippery sequence, or alterations of the secondary structure were examined. We found that RNAs from all three mutants were packaged efficiently, and they generate titers similar to that of a virus containing the wild-type ribosomal frameshift signal. We conclude that although the ribosomal frameshift signal plays an important role in regulating the replication cycle, this RNA element is not directly involved in regulating RNA encapsidation. IMPORTANCE To generate infectious viruses, HIV-1 must package viral RNA genome during virus assembly. The specific HIV-1 genome packaging is mediated by interactions between the structural protein Gag and elements near the 5′ end of the viral RNA known as packaging signal. In this study, we examined whether the Gag-Pol ribosomal frameshift signal is important for HIV-1 RNA packaging as recently reported. Our results demonstrated that when Gag/Gag-Pol is supplied in trans, none of the tested ribosomal frameshift signal mutants has defects in RNA packaging or virus titer. These studies provide important information on how HIV-1 regulates its genome packaging and generate infectious viruses necessary for transmission to new hosts. PMID:24453371

Method Of Packaging And Assembling Electro-Microfluidic Devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

2004-11-23

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Comparison of three dielectric barrier discharges regarding their physical characteristics and influence on the adhesion properties on maple, high density fiberboards and wood plastic composite

NASA Astrophysics Data System (ADS)

Peters, F.; Hünnekens, B.; Wieneke, S.; Militz, H.; Ohms, G.; Viöl, W.

2017-11-01

In this study, three different dielectric barrier discharges, based on the same setup and run with the same power supply, are characterized by emission spectroscopy with regards to the reduced electrical field strength, and the rotational, vibrational and electron temperature. To compare discharges common for the treatment on wood, a coplanar surface barrier discharge, a direct dielectric barrier discharge and a jet system/remote plasma are chosen. To minimize influences due to the setups or power, the discharges are realized with the same electrodes and power supply and normalized to the same power. To evaluate the efficiency of the different discharges and the influence on treated materials, the surface free energy is determined on a maple wood, high density fiberboard and wood plastic composite. The influence is measured depending on the treatment time, with the highest impact in the time of 5 s.

Mechanical and water soaking properties of medium density fiberboard with wood fiber and soybean protein adhesive.

PubMed

Li, Xin; Li, Yonghui; Zhong, Zhikai; Wang, Donghai; Ratto, Jo A; Sheng, Kuichuan; Sun, Xiuzhi Susan

2009-07-01

Soybean protein is a renewable and abundant material that offers an alternative to formaldehyde-based resins. In this study, soybean protein was modified with sodium dodecyl sulfate (SDS) as an adhesive for wood fiber medium density fiberboard (MDF) preparation. Second-order response surface regression models were used to study the effects and interactions of initial moisture content (IMC) of coated wood fiber, press time (PT) and temperature on mechanical and water soaking properties of MDF. Results showed that IMC of coated fiber was the dominant influencing factor. Mechanical and soaking properties improved as IMC increased and reached their highest point at an IMC of 35%. Press time and temperature also had a significant effect on mechanical and water soaking properties of MDF. Second-order regression results showed that there were strong relationships between mechanical and soaking properties of MDF and processing parameters. Properties of MDF made using soybean protein adhesive are similar to those of commercial board.

Radiated Sound Power from a Curved Honeycomb Panel

NASA Technical Reports Server (NTRS)

Robinson, Jay H.; Buehrle, Ralph D.; Klos, Jacob; Grosveld, Ferdinand W.

2003-01-01

The validation of finite element and boundary element model for the vibro-acoustic response of a curved honeycomb core composite aircraft panel is completed. The finite element and boundary element models were previously validated separately. This validation process was hampered significantly by the method in which the panel was installed in the test facility. The fixture used was made primarily of fiberboard and the panel was held in a groove in the fiberboard by a compression fitting made of plastic tubing. The validated model is intended to be used to evaluate noise reduction concepts from both an experimental and analytic basis simultaneously. An initial parametric study of the influence of core thickness on the radiated sound power from this panel, using this numerical model was subsequently conducted. This study was significantly influenced by the presence of strong boundary condition effects but indicated that the radiated sound power from this panel was insensitive to core thickness primarily due to the offsetting effects of added mass and added stiffness in the frequency range investigated.

MEMS Direct Chip Attach Packaging Methodologies and Apparatuses for Harsh Environments

NASA Technical Reports Server (NTRS)

Okojie, Robert S. (Inventor)

2005-01-01

Methods of bulk manufacturing high temperature sensor sub-assembly packages are disclosed and claimed. Sensors are sandwiched between a top cover and a bottom cover so as to enable the peripheries of the top covers, sensors and bottom covers to be sealed and bound securely together are disclosed and claimed. Sensors are placed on the bottom covers leaving the periphery of the bottom cover exposed. Likewise, top covers are placed on the sensors leaving the periphery of the sensor exposed. Individual sensor sub- assemblies are inserted into final packaging elements which are also disclosed and claimed. Methods of directly attach- ing wires or pins to contact pads on the sensors are disclosed and claimed. Sensors, such as pressure sensors and accelerometers, and headers made out of silicon carbide and aluminum nitride are disclosed and claimed. Reference cavities are formed in some embodiments disclosed and claimed herein where top covers are not employed.

STS-45 blue shift crewmembers enjoy eating a meal on OV-104's middeck

NASA Technical Reports Server (NTRS)

1992-01-01

STS-45 Commander Charles F. Bolden retrieves a straw from his meal tray assembly secured on the middeck ceiling as other blue shift crewmembers around him enjoy eating their meals. Below Bolden, Pilot Brian Duffy balances a meal tray assembly on his lap as a food package and spoon freefloat between his hands. Payload Specialist Dirk D. Frimout, holding a food package and a spoon, steadies himself while eating by positioning his feet under a forward locker handhold strap. In the background, Mission Specialist (MS) and Payload Commander (PLC) Kathryn D. Sullivan prepares to take a bite of food.

Assembly and testing of microparticle and microcapsule smart tattoo materials

NASA Astrophysics Data System (ADS)

McShane, Michael J.

2007-01-01

Microscale biochemical sensors are attractive for in vitro diagnostics and disease management, as well as medical and biological research applications. Fluorescent sensors, coupling specific glucose-binding proteins with fluorescent readout methods, have been developed for this purpose. Our work has focused on the development of assembly and packaging systems for producing micro- and nanoscale sensing components that can be used as implants, intracellular reporters, or as elements in larger systems. Both hybrid organic/inorganic particles and hollow microshells have been developed to physically couple the sensing materials together in biocompatible, semipermeable packages. Fabrication details and sensor characterization are used to demonstrate the potential of these sensor concepts.

RNAbrowse: RNA-Seq De Novo Assembly Results Browser

PubMed Central

Mariette, Jérôme; Noirot, Céline; Nabihoudine, Ibounyamine; Bardou, Philippe; Hoede, Claire; Djari, Anis; Cabau, Cédric; Klopp, Christophe

2014-01-01

Transcriptome analysis based on a de novo assembly of next generation RNA sequences is now performed routinely in many laboratories. The generated results, including contig sequences, quantification figures, functional annotations and variation discovery outputs are usually bulky and quite diverse. This article presents a user oriented storage and visualisation environment permitting to explore the data in a top-down manner, going from general graphical views to all possible details. The software package is based on biomart, easy to install and populate with local data. The software package is available under the GNU General Public License (GPL) at http://bioinfo.genotoul.fr/RNAbrowse. PMID:24823498

Study of providing omnidirectional vibration isolation to entire space shuttle payload packages

NASA Technical Reports Server (NTRS)

Chang, C. S.; Robinson, G. D.; Weber, D. E.

1974-01-01

Techniques to provide omnidirectional vibration isolation for a space shuttle payload package were investigated via a reduced-scale model. Development, design, fabrication, assembly and test evaluation of a 0.125-scale isolation model are described. Final drawings for fabricated mechanical components are identified, and prints of all drawings are included.

Home page | prc.gatech.edu | Georgia Institute of Technology | Atlanta, GA

Science.gov Websites

Interconnections & Assembly Low Cost Glass Interposers & Packages MEMS and Sensors GRA Opportunities addressing electrical, mechanical and thermal barriers. Low-cost Glass Interposer and Package Panel-based ultra-thin glass as a high performance, high I/O density, and low cost platform. Interconnections and

VIEW OF WEST BANK OF “SAFETY ROD PACKAGE,” INCLUDING SAFETY ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

VIEW OF WEST BANK OF “SAFETY ROD PACKAGE,” INCLUDING SAFETY ROD MOTOR DRIVES (B AND C), DRUMS, AND CLUTCHES, IN A THREE-TIERED RACK IN THE PDP ROOM AT LEVEL +27’, LOOKING SOUTHWEST - Physics Assembly Laboratory, Area A/M, Savannah River Site, Aiken, Aiken County, SC

VIEW OF EAST BANK OF “SAFETY ROD PACKAGE,” INCLUDING SAFETY ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

VIEW OF EAST BANK OF “SAFETY ROD PACKAGE,” INCLUDING SAFETY ROD MOTOR DRIVES (B AND C), DRUMS, AND CLUTCHES, IN A THREE-TIERED RACK IN THE PDP ROOM AT LEVEL +27’, LOOKING SOUTHEAST - Physics Assembly Laboratory, Area A/M, Savannah River Site, Aiken, Aiken County, SC

Accelerated thermal and mechanical testing of CSP assemblies

NASA Technical Reports Server (NTRS)

Ghaffarian, R.

2000-01-01

Chip Scale Packages (CSP) are now widely used for many electronic applications including portable and telecommunication products. A test vehicle (TV-1) with eleven package types and pitches was built and tested by the JPL MicrotypeBGA Consortium during 1997 to 1999. Lessons learned by the team were published as a guidelines document for industry use. The finer pitch CSP packages which recently became available were indluded in the next test vehicle of the JPL CSP Consortium.

Fine Structure Genetic and Physical Map of the Gene 3 to 10 Region of the Bacteriophage P22 Chromosome

PubMed Central

Casjens, S.; Eppler, K.; Sampson, L.; Parr, R.; Wyckoff, E.

1991-01-01

The mechanism by which dsDNA is packaged by viruses is not yet understood in any system. Bacteriophage P22 has been a productive system in which to study the molecular genetics of virus particle assembly and DNA packaging. Only five phage encoded proteins, the products of genes 3, 2, 1, 8 and 5, are required for packaging the virus chromosome inside the coat protein shell. We report here the construction of a detailed genetic and physical map of these genes, the neighboring gene 4 and a portion of gene 10, in which 289 conditional lethal amber, opal, temperature sensitive and cold sensitive mutations are mapped into 44 small (several hundred base pair) intervals of known sequence. Knowledge of missense mutant phenotypes and information on the location of these mutations allows us to begin the assignment of partial protein functions to portions of these genes. The map and mapping strains will be of use in the further genetic dissection of the P22 DNA packaging and prohead assembly processes. PMID:2029965

The adenovirus major core protein VII is dispensable for virion assembly but is essential for lytic infection

PubMed Central

Suomalainen, Maarit; Zheng, Yueting; Boucke, Karin

2017-01-01

The Adenovirus (Ad) genome within the capsid is tightly associated with a virus-encoded, histone-like core protein—protein VII. Two other Ad core proteins, V and X/μ, also are located within the virion and are loosely associated with viral DNA. Core protein VII remains associated with the Ad genome during the early phase of infection. It is not known if naked Ad DNA is packaged into the capsid, as with dsDNA bacteriophage and herpesviruses, followed by the encapsidation of viral core proteins, or if a unique packaging mechanism exists with Ad where a DNA-protein complex is simultaneously packaged into the virion. The latter model would require an entirely new molecular mechanism for packaging compared to known viral packaging motors. We characterized a virus with a conditional knockout of core protein VII. Remarkably, virus particles were assembled efficiently in the absence of protein VII. No changes in protein composition were evident with VII−virus particles, including the abundance of core protein V, but changes in the proteolytic processing of some capsid proteins were evident. Virus particles that lack protein VII enter the cell, but incoming virions did not escape efficiently from endosomes. This greatly diminished all subsequent aspects of the infectious cycle. These results reveal that the Ad major core protein VII is not required to condense viral DNA within the capsid, but rather plays an unexpected role during virus maturation and the early stages of infection. These results establish a new paradigm pertaining to the Ad assembly mechanism and reveal a new and important role of protein VII in early stages of infection. PMID:28628648

78 FR 79391 - Foreign-Trade Zone (FTZ) 22-Chicago, Illinois, Notification of Proposed Production Activity...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-12-30

...; cable clamps; locks; belts; O-rings; sealing gaskets; support packages; filter bags; disposable bags; assembly bags; dust bags; maintenance packs; paper bags; dirt tube kits; paper adaptor bags; filters...; wire racks; bake pans; pizza pans; coffee water filters; water filters; base assemblies; dust cup...

Packaging of solid state devices

DOEpatents

Glidden, Steven C.; Sanders, Howard D.

2006-01-03

A package for one or more solid state devices in a single module that allows for operation at high voltage, high current, or both high voltage and high current. Low thermal resistance between the solid state devices and an exterior of the package and matched coefficient of thermal expansion between the solid state devices and the materials used in packaging enables high power operation. The solid state devices are soldered between two layers of ceramic with metal traces that interconnect the devices and external contacts. This approach provides a simple method for assembling and encapsulating high power solid state devices.

A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications

PubMed Central

Shao, Shuai; Liu, Dapeng; Niu, Yuling; O’Donnell, Kathy; Sengupta, Dipak; Park, Seungbae

2017-01-01

Reliability risks for two different types of through-silicon-vias (TSVs) are discussed in this paper. The first is a partially-filled copper TSV, if which the copper layer covers the side walls and bottom. A polymer is used to fill the rest of the cavity. Stresses in risk sites are studied and ranked for this TSV structure by FEA modeling. Parametric studies for material properties (modulus and thermal expansion) of TSV polymer are performed. The second type is a high aspect ratio TSV filled by polycrystalline silicon (poly Si). Potential risks of the voids in the poly Si due to filling defects are studied. Fracture mechanics methods are utilized to evaluate the risk for two different assembly conditions: package assembled to printed circuit board (PCB) and package assembled to flexible substrate. The effect of board/substrate/die thickness and the size and location of the void are discussed. PMID:28208758

Deep sequencing of foot-and-mouth disease virus reveals RNA sequences involved in genome packaging.

PubMed

Logan, Grace; Newman, Joseph; Wright, Caroline F; Lasecka-Dykes, Lidia; Haydon, Daniel T; Cottam, Eleanor M; Tuthill, Tobias J

2017-10-18

Non-enveloped viruses protect their genomes by packaging them into an outer shell or capsid of virus-encoded proteins. Packaging and capsid assembly in RNA viruses can involve interactions between capsid proteins and secondary structures in the viral genome as exemplified by the RNA bacteriophage MS2 and as proposed for other RNA viruses of plants, animals and human. In the picornavirus family of non-enveloped RNA viruses, the requirements for genome packaging remain poorly understood. Here we show a novel and simple approach to identify predicted RNA secondary structures involved in genome packaging in the picornavirus foot-and-mouth disease virus (FMDV). By interrogating deep sequencing data generated from both packaged and unpackaged populations of RNA we have determined multiple regions of the genome with constrained variation in the packaged population. Predicted secondary structures of these regions revealed stem loops with conservation of structure and a common motif at the loop. Disruption of these features resulted in attenuation of virus growth in cell culture due to a reduction in assembly of mature virions. This study provides evidence for the involvement of predicted RNA structures in picornavirus packaging and offers a readily transferable methodology for identifying packaging requirements in many other viruses. Importance In order to transmit their genetic material to a new host, non-enveloped viruses must protect their genomes by packaging them into an outer shell or capsid of virus-encoded proteins. For many non-enveloped RNA viruses the requirements for this critical part of the viral life cycle remain poorly understood. We have identified RNA sequences involved in genome packaging of the picornavirus foot-and-mouth disease virus. This virus causes an economically devastating disease of livestock affecting both the developed and developing world. The experimental methods developed to carry out this work are novel, simple and transferable to the study of packaging signals in other RNA viruses. Improved understanding of RNA packaging may lead to novel vaccine approaches or targets for antiviral drugs with broad spectrum activity. Copyright © 2017 Logan et al.

Invitro Digestion and Fermentation Characteristics of Temulose Molasses, a Co-Product of Fiberboard Production, and Select Temulose Fractions

USDA-ARS?s Scientific Manuscript database

It is of interest to discover new fermentable carbohydrates sources that function as prebiotics. This study evaluated the hydrolytic digestibility, fermentative capacity, and microbiota modulating properties of temulose molasses, four hydrolyzed fractions of temulose molasses, short-chain fructooli...

40 CFR 429.11 - General definitions.

Code of Federal Regulations, 2013 CFR

2013-07-01

... of fiberboard products” means the air dry weight of hardboard or insulation board following formation... manufactured from interfelted ligno-cellulosic fibers consolidated under heat and pressure to a density of 0.5 g/cu cm (31 lb/cu ft) or greater. (f) The term “insulation board” means a panel manufactured from...

40 CFR 429.11 - General definitions.

Code of Federal Regulations, 2014 CFR

2014-07-01

... of fiberboard products” means the air dry weight of hardboard or insulation board following formation... manufactured from interfelted ligno-cellulosic fibers consolidated under heat and pressure to a density of 0.5 g/cu cm (31 lb/cu ft) or greater. (f) The term “insulation board” means a panel manufactured from...

40 CFR 429.11 - General definitions.

Code of Federal Regulations, 2012 CFR

2012-07-01

... of fiberboard products” means the air dry weight of hardboard or insulation board following formation... manufactured from interfelted ligno-cellulosic fibers consolidated under heat and pressure to a density of 0.5 g/cu cm (31 lb/cu ft) or greater. (f) The term “insulation board” means a panel manufactured from...

49 CFR 178.815 - Stacking test.

Code of Federal Regulations, 2013 CFR

2013-10-01

... deformation, which renders the IBC unsafe for transportation, and no loss of contents. (2) For fiberboard and wooden IBCs, there may be no loss of contents and no permanent deformation, which renders the whole IBC..., which renders the IBC unsafe for transportation, and no loss of contents. (4) For the dynamic...

49 CFR 178.815 - Stacking test.

Code of Federal Regulations, 2011 CFR

2011-10-01

... deformation, which renders the IBC unsafe for transportation, and no loss of contents. (2) For fiberboard and wooden IBCs, there may be no loss of contents and no permanent deformation, which renders the whole IBC..., which renders the IBC unsafe for transportation, and no loss of contents. (4) For the dynamic...

49 CFR 178.815 - Stacking test.

Code of Federal Regulations, 2012 CFR

2012-10-01

... deformation, which renders the IBC unsafe for transportation, and no loss of contents. (2) For fiberboard and wooden IBCs, there may be no loss of contents and no permanent deformation, which renders the whole IBC..., which renders the IBC unsafe for transportation, and no loss of contents. (4) For the dynamic...

49 CFR 178.815 - Stacking test.

Code of Federal Regulations, 2010 CFR

2010-10-01

... for transportation, and no loss of contents. (2) For fiberboard and wooden IBCs, there may be no loss... unsafe for transportation, and no loss of contents. (4) For the dynamic compression test, a container passes the test if, after application of the required load, there is no permanent deformation to the IBC...

49 CFR 178.815 - Stacking test.

Code of Federal Regulations, 2014 CFR

2014-10-01

... deformation, which renders the IBC unsafe for transportation, and no loss of contents. (2) For fiberboard and wooden IBCs, there may be no loss of contents and no permanent deformation, which renders the whole IBC..., which renders the IBC unsafe for transportation, and no loss of contents. (4) For the dynamic...

Construction of Experimental Polyvinyl Chloride (PVC) Roofing.

DTIC Science & Technology

1984-04-01

in. War II vintage; squash and handball courts were (13-mm) fiberboard, to comply with Sarnafil re- added in 1966. The entire structure is of wood con...squash and handball courts had a gravel surface. pendently, avoiding difficulties of trying to handle Figure 23 shows the building arrangements. two

75 FR 39871 - Manufactured Home Construction and Safety Standards

Federal Register 2010, 2011, 2012, 2013, 2014

2010-07-13

...) submitted by the MHCC. The MHCC has prepared and submitted to HUD its second group of recommendations to... modify the existing requirements for control of formaldehyde emissions in Sec. 3280.308, by lowering the... emission controls for medium density fiberboard materials (MDF) of 0.3 ppm. These changes recommended by...

Lead-Free vs Tin-Lead Reliability of Advanced Electronic Assemblies

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2005-01-01

This presentation will provide the technical background and specific information published in literature related to reliability test, analyses, modeling, and associated issues for lead-free solder package assemblies in comparison to their tin-lead solder alloys. It also presents current understanding of lead-free thermal cycle test performance in support.

Transfer orbit stage mechanisms thermal vacuum test

NASA Technical Reports Server (NTRS)

Oleary, Scott T.

1990-01-01

A systems level mechanisms test was conducted on the Orbital Sciences Corp.'s Transfer Orbit Stage (TOS). The TOS is a unique partially reusable transfer vehicle which will boost a satellite into its operational orbit from the Space Shuttle's cargo bay. The mechanical cradle and tilt assemblies will return to earth with the Space Shuttle while the Solid Rocket Motor (SRM) and avionics package are expended. A mechanisms test was performed on the forward cradle and aft tilting assemblies of the TOS under thermal vacuum conditions. Actuating these assemblies under a 1 g environment and thermal vacuum conditions proved to be a complex task. Pneumatic test fixturing was used to lift the forward cradle, and tilt the SRM, and avionics package. Clinometers, linear voltage displacement transducers, and load cells were used in the thermal vacuum chamber to measure the performance and characteristics of the TOS mechanism assembly. Incorporation of the instrumentation and pneumatic system into the test setup was not routine since pneumatic actuation of flight hardware had not been previously performed in the facility. The methods used are presented along with the problems experienced during the design, setup and test phases.

Mutations in the Basic Region of the Mason-Pfizer Monkey Virus Nucleocapsid Protein Affect Reverse Transcription, Genomic RNA Packaging, and the Virus Assembly Site.

PubMed

Dostálková, Alžběta; Kaufman, Filip; Křížová, Ivana; Kultová, Anna; Strohalmová, Karolína; Hadravová, Romana; Ruml, Tomáš; Rumlová, Michaela

2018-05-15

In addition to specific RNA-binding zinc finger domains, the retroviral Gag polyprotein contains clusters of basic amino acid residues that are thought to support Gag-viral genomic RNA (gRNA) interactions. One of these clusters is the basic K 16 NK 18 EK 20 region, located upstream of the first zinc finger of the Mason-Pfizer monkey virus (M-PMV) nucleocapsid (NC) protein. To investigate the role of this basic region in the M-PMV life cycle, we used a combination of in vivo and in vitro methods to study a series of mutants in which the overall charge of this region was more positive (RNRER), more negative (AEAEA), or neutral (AAAAA). The mutations markedly affected gRNA incorporation and the onset of reverse transcription. The introduction of a more negative charge (AEAEA) significantly reduced the incorporation of M-PMV gRNA into nascent particles. Moreover, the assembly of immature particles of the AEAEA Gag mutant was relocated from the perinuclear region to the plasma membrane. In contrast, an enhancement of the basicity of this region of M-PMV NC (RNRER) caused a substantially more efficient incorporation of gRNA, subsequently resulting in an increase in M-PMV RNRER infectivity. Nevertheless, despite the larger amount of gRNA packaged by the RNRER mutant, the onset of reverse transcription was delayed in comparison to that of the wild type. Our data clearly show the requirement for certain positively charged amino acid residues upstream of the first zinc finger for proper gRNA incorporation, assembly of immature particles, and proceeding of reverse transcription. IMPORTANCE We identified a short sequence within the Gag polyprotein that, together with the zinc finger domains and the previously identified RKK motif, contributes to the packaging of genomic RNA (gRNA) of Mason-Pfizer monkey virus (M-PMV). Importantly, in addition to gRNA incorporation, this basic region (KNKEK) at the N terminus of the nucleocapsid protein is crucial for the onset of reverse transcription. Mutations that change the positive charge of the region to a negative one significantly reduced specific gRNA packaging. The assembly of immature particles of this mutant was reoriented from the perinuclear region to the plasma membrane. On the contrary, an enhancement of the basic character of this region increased both the efficiency of gRNA packaging and the infectivity of the virus. However, the onset of reverse transcription was delayed even in this mutant. In summary, the basic region in M-PMV Gag plays a key role in the packaging of genomic RNA and, consequently, in assembly and reverse transcription. Copyright © 2018 American Society for Microbiology.

Pilot Overmyer looks over food selections and experiments with beverage

NASA Image and Video Library

1982-11-16

STS005-07-255 (19 Nov. 1982) --- Astronaut Robert F. Overmyer, STS-5 pilot, using beverage container and drinking straw secured in meal tray assembly (ASSY), experiments with microgravity characteristics of liquid on middeck in front of forward lockers. Overmyer also looks over packages of food attached to middeck lockers in meal tray assemblies. Carry-on food warmer appears overhead and other meal tray assemblies, personal hygiene mirror assembly, personal hygiene kit, and portrait of G.W.S. Abbey, Johnson Space Center's (JSC) Director of Flight Operations, appear on lockers. Photo credit: NASA

Laser diode package with enhanced cooling

DOEpatents

Deri, Robert J [Pleasanton, CA; Kotovsky, Jack [Oakland, CA; Spadaccini, Christopher M [Oakland, CA

2011-09-13

A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.

Laser diode package with enhanced cooling

DOEpatents

Deri, Robert J [Pleasanton, CA; Kotovsky, Jack [Oakland, CA; Spadaccini, Christopher M [Oakland, CA

2012-06-12

A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.

Laser diode package with enhanced cooling

DOEpatents

Deri, Robert J; Kotovsky, Jack; Spadaccini, Christopher M

2012-06-26

A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.

Direct interaction of the bacteriophage SPP1 packaging ATPase with the portal protein.

PubMed

Oliveira, Leonor; Cuervo, Ana; Tavares, Paulo

2010-03-05

DNA packaging in tailed bacteriophages and other viruses requires assembly of a complex molecular machine at a specific vertex of the procapsid. This machine is composed of the portal protein that provides a tunnel for DNA entry, an ATPase that fuels DNA translocation (large terminase subunit), and most frequently, a small terminase subunit. Here we characterized the interaction between the terminase ATPase subunit of bacteriophage SPP1 (gp2) and the procapsid portal vertex. We found, by affinity pulldown assays with purified proteins, that gp2 interacts with the portal protein, gp6, independently of the terminase small subunit gp1, DNA, or ATP. The gp2-procapsid interaction via the portal protein depends on gp2 concentration and requires the presence of divalent cations. Competition experiments showed that isolated gp6 can only inhibit gp2-procapsid interactions and DNA packaging at gp6:procapsid molar ratios above 10-fold. Assays with gp6 carrying mutations in distinct regions of its structure that affect the portal-induced stimulation of ATPase and DNA packaging revealed that none of these mutations impedes gp2-gp6 binding. Our results demonstrate that the SPP1 packaging ATPase binds directly to the portal and that the interaction is stronger with the portal embedded in procapsids. Identification of mutations in gp6 that allow for assembly of the ATPase-portal complex but impair DNA packaging support an intricate cross-talk between the two proteins for activity of the DNA translocation motor.

preAssemble: a tool for automatic sequencer trace data processing.

PubMed

Adzhubei, Alexei A; Laerdahl, Jon K; Vlasova, Anna V

2006-01-17

Trace or chromatogram files (raw data) are produced by automatic nucleic acid sequencing equipment or sequencers. Each file contains information which can be interpreted by specialised software to reveal the sequence (base calling). This is done by the sequencer proprietary software or publicly available programs. Depending on the size of a sequencing project the number of trace files can vary from just a few to thousands of files. Sequencing quality assessment on various criteria is important at the stage preceding clustering and contig assembly. Two major publicly available packages--Phred and Staden are used by preAssemble to perform sequence quality processing. The preAssemble pre-assembly sequence processing pipeline has been developed for small to large scale automatic processing of DNA sequencer chromatogram (trace) data. The Staden Package Pregap4 module and base-calling program Phred are utilized in the pipeline, which produces detailed and self-explanatory output that can be displayed with a web browser. preAssemble can be used successfully with very little previous experience, however options for parameter tuning are provided for advanced users. preAssemble runs under UNIX and LINUX operating systems. It is available for downloading and will run as stand-alone software. It can also be accessed on the Norwegian Salmon Genome Project web site where preAssemble jobs can be run on the project server. preAssemble is a tool allowing to perform quality assessment of sequences generated by automatic sequencing equipment. preAssemble is flexible since both interactive jobs on the preAssemble server and the stand alone downloadable version are available. Virtually no previous experience is necessary to run a default preAssemble job, on the other hand options for parameter tuning are provided. Consequently preAssemble can be used as efficiently for just several trace files as for large scale sequence processing.

Hybridization of active and passive elements for planar photonic components and interconnects

NASA Astrophysics Data System (ADS)

Pearson, M.; Bidnyk, S.; Balakrishnan, A.

2007-02-01

The deployment of Passive Optical Networks (PON) for Fiber-to-the-Home (FTTH) applications currently represents the fastest growing sector of the telecommunication industry. Traditionally, FTTH transceivers have been manufactured using commodity bulk optics subcomponents, such as thin film filters (TFFs), micro-optic collimating lenses, TO-packaged lasers, and photodetectors. Assembling these subcomponents into a single housing requires active alignment and labor-intensive techniques. Today, the majority of cost reducing strategies using bulk subcomponents has been implemented making future reductions in the price of manufacturing FTTH transceivers unlikely. Future success of large scale deployments of FTTH depends on further cost reductions of transceivers. Realizing the necessity of a radically new packaging approach for assembly of photonic components and interconnects, we designed a novel way of hybridizing active and passive elements into a planar lightwave circuit (PLC) platform. In our approach, all the filtering components were monolithically integrated into the chip using advancements in planar reflective gratings. Subsequently, active components were passively hybridized with the chip using fully-automated high-capacity flip-chip bonders. In this approach, the assembly of the transceiver package required no active alignment and was readily suitable for large-scale production. This paper describes the monolithic integration of filters and hybridization of active components in both silica-on-silicon and silicon-on-insulator PLCs.

disLocate: tools to rapidly quantify local intermolecular structure to assess two-dimensional order in self-assembled systems.

PubMed

Bumstead, Matt; Liang, Kunyu; Hanta, Gregory; Hui, Lok Shu; Turak, Ayse

2018-01-24

Order classification is particularly important in photonics, optoelectronics, nanotechnology, biology, and biomedicine, as self-assembled and living systems tend to be ordered well but not perfectly. Engineering sets of experimental protocols that can accurately reproduce specific desired patterns can be a challenge when (dis)ordered outcomes look visually similar. Robust comparisons between similar samples, especially with limited data sets, need a finely tuned ensemble of accurate analysis tools. Here we introduce our numerical Mathematica package disLocate, a suite of tools to rapidly quantify the spatial structure of a two-dimensional dispersion of objects. The full range of tools available in disLocate give different insights into the quality and type of order present in a given dispersion, accessing the translational, orientational and entropic order. The utility of this package allows for researchers to extract the variation and confidence range within finite sets of data (single images) using different structure metrics to quantify local variation in disorder. Containing all metrics within one package allows for researchers to easily and rapidly extract many different parameters simultaneously, allowing robust conclusions to be drawn on the order of a given system. Quantifying the experimental trends which produce desired morphologies enables engineering of novel methods to direct self-assembly.

Three-dimensional fit-to-flow microfluidic assembly.

PubMed

Chen, Arnold; Pan, Tingrui

2011-12-01

Three-dimensional microfluidics holds great promise for large-scale integration of versatile, digitalized, and multitasking fluidic manipulations for biological and clinical applications. Successful translation of microfluidic toolsets to these purposes faces persistent technical challenges, such as reliable system-level packaging, device assembly and alignment, and world-to-chip interface. In this paper, we extended our previously established fit-to-flow (F2F) world-to-chip interconnection scheme to a complete system-level assembly strategy that addresses the three-dimensional microfluidic integration on demand. The modular F2F assembly consists of an interfacial chip, pluggable alignment modules, and multiple monolithic layers of microfluidic channels, through which convoluted three-dimensional microfluidic networks can be easily assembled and readily sealed with the capability of reconfigurable fluid flow. The monolithic laser-micromachining process simplifies and standardizes the fabrication of single-layer pluggable polymeric modules, which can be mass-produced as the renowned Lego(®) building blocks. In addition, interlocking features are implemented between the plug-and-play microfluidic chips and the complementary alignment modules through the F2F assembly, resulting in facile and secure alignment with average misalignment of 45 μm. Importantly, the 3D multilayer microfluidic assembly has a comparable sealing performance as the conventional single-layer devices, providing an average leakage pressure of 38.47 kPa. The modular reconfigurability of the system-level reversible packaging concept has been demonstrated by re-routing microfluidic flows through interchangeable modular microchannel layers.

The icosahedral RNA virus as a grotto: organizing the genome into stalagmites and stalactites.

PubMed

Harvey, Stephen C; Zeng, Yingying; Heitsch, Christine E

2013-03-01

There are two important problems in the assembly of small, icosahedral RNA viruses. First, how does the capsid protein select the viral RNA for packaging, when there are so many other candidate RNA molecules available? Second, what is the mechanism of assembly? With regard to the first question, there are a number of cases where a particular RNA sequence or structure--often one or more stem-loops--either promotes assembly or is required for assembly, but there are others where specific packaging signals are apparently not required. With regard to the assembly pathway, in those cases where stem-loops are involved, the first step is generally believed to be binding of the capsid proteins to these "fingers" of the RNA secondary structure. In the mature virus, the core of the RNA would then occupy the center of the viral particle, and the stem-loops would reach outward, towards the capsid, like stalagmites reaching up from the floor of a grotto towards the ceiling. Those viruses whose assembly does not depend on protein binding to stem-loops could have a different structure, with the core of the RNA lying just under the capsid, and the fingers reaching down into the interior of the virus, like stalactites. We review the literature on these alternative structures, focusing on RNA selectivity and the assembly mechanism, and we propose experiments aimed at determining, in a given virus, which of the two structures actually occurs.

Jig Aligns Shadow Mask On CCD

NASA Technical Reports Server (NTRS)

Matus, Carlos V.

1989-01-01

Alignment viewed through microscope. Alignment jig positions shadow mask on charge-coupled device (CCD) so metal film deposited on it precisely. Allows CCD package to be inserted and removed without disturbing alignment of mask. Holds CCD packages securely and isolates it electrostatically while providing electrical contact to each of its pins. When alignment jig assembled with CCD, used to move mask under micrometer control.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Rakowski, Cynthia L.; Guensch, Gregory R.; Patton, Gregory W.

Beginning in fiscal year 2003, the DOE Richland Operations Office initiated activities, including the development of data packages, to support the 2004 Composite Analysis. The river data package provides calculations of flow and transport in the Columbia River system. This document presents the data assembled to run the river module components for the section of the Columbia River from Vernita Bridge to the confluence with the Yakima River.

Packaging of structural health monitoring components

NASA Astrophysics Data System (ADS)

Kessler, Seth S.; Spearing, S. Mark; Shi, Yong; Dunn, Christopher T.

2004-07-01

Structural Health Monitoring (SHM) technologies have the potential to realize economic benefits in a broad range of commercial and defense markets. Previous research conducted by Metis Design and MIT has demonstrated the ability of Lamb waves methods to provide reliable information regarding the presence, location and type of damage in composite specimens. The present NSF funded program was aimed to study manufacturing, packaging and interface concepts for critical SHM components. The intention is to be able to cheaply manufacture robust actuating/sensing devices, and isolate them from harsh operating environments including natural, mechanical, or electrical extremes. Currently the issues related to SHM system durability have remained undressed. During the course of this research several sets of test devices were fabricated and packaged to protect the piezoelectric component assemblies for robust operation. These assemblies were then tested in hot and wet conditions, as well as in electrically noisy environments. Future work will aim to package the other supporting components such as the battery and wireless chip, as well as integrating all of these components together for operation. SHM technology will enable the reduction or complete elimination of scheduled inspections, and will allow condition-based maintenance for increased reliability and reduced overall life-cycle costs.

Pilot Overmyer looks over food selections and experiments with beverage

NASA Technical Reports Server (NTRS)

1982-01-01

Pilot Overmyer, using beverage container and drinking straw secured in meal tray assembly (ASSY), experiments with microgravity chararcteristics of liquid on middeck in front of forward lockers. Overmyer also looks over packages of food attached to middeck lockers in meal tray assemblies. Carry-on food warmer appears overhead and other meal tray assemblies, personal hygiene mirror assy, personal hygiene kit, and portrait of G.W.S. Abbey, JSC's Director of Flight Operations, appear on lockers.

Flip Chip on Organic Substrates: A Feasibility Study for Space Applications

DTIC Science & Technology

2017-03-01

scheme, a 1752 I/O land grid array (LGA) package with decoupling capacitors, heat sink and optional column attach [1] as shown in Figure 1...investigated the effect of moisture and current loading on the Class Y flip chip on ceramic reliability [ 2 ]. The UT1752FC Class Y technology has...chip assembly to ceramic test substrates, the FA10 die are assembled to build-up organic test substrates as shown in Figure 2 . These assemblies

Microwave power transmission system studies. Volume 3, section 8: Mechanical systems and flight operations

NASA Technical Reports Server (NTRS)

Maynard, O. E.; Brown, W. C.; Edwards, A.; Haley, J. T.; Meltz, G.; Howell, J. M.; Nathan, A.

1975-01-01

The efforts and recommendations associated with preliminary design and concept definition for mechanical systems and flight operations are presented. Technical discussion in the areas of mission analysis, antenna structural concept, configuration analysis, assembly and packaging with associated costs are presented. Technology issues for the control system, structural system, thermal system and assembly including cost and man's role in assembly and maintenance are identified. Background and desired outputs for future efforts are discussed.

Reliability and Qualification of Hardware to Enhance the Mission Assurance of JPL/NASA Projects

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2010-01-01

Packaging Qualification and Verification (PQV) and life testing of advanced electronic packaging, mechanical assemblies (motors/actuators), and interconnect technologies (flip-chip), platinum temperature thermometer attachment processes, and various other types of hardware for Mars Exploration Rover (MER)/Mars Science Laboratory (MSL), and JUNO flight projects was performed to enhance the mission assurance. The qualification of hardware under extreme cold to hot temperatures was performed with reference to various project requirements. The flight like packages, assemblies, test coupons, and subassemblies were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases. Qualification/life testing was performed by subjecting flight-like qualification hardware to the environmental temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Experimental flight qualification test results will be described in this presentation.

Disruption of Specific RNA-RNA Interactions in a Double-Stranded RNA Virus Inhibits Genome Packaging and Virus Infectivity

PubMed Central

Fajardo, Teodoro; Sung, Po-Yu; Roy, Polly

2015-01-01

Bluetongue virus (BTV) causes hemorrhagic disease in economically important livestock. The BTV genome is organized into ten discrete double-stranded RNA molecules (S1-S10) which have been suggested to follow a sequential packaging pathway from smallest to largest segment during virus capsid assembly. To substantiate and extend these studies, we have investigated the RNA sorting and packaging mechanisms with a new experimental approach using inhibitory oligonucleotides. Putative packaging signals present in the 3’untranslated regions of BTV segments were targeted by a number of nuclease resistant oligoribonucleotides (ORNs) and their effects on virus replication in cell culture were assessed. ORNs complementary to the 3’ UTR of BTV RNAs significantly inhibited virus replication without affecting protein synthesis. Same ORNs were found to inhibit complex formation when added to a novel RNA-RNA interaction assay which measured the formation of supramolecular complexes between and among different RNA segments. ORNs targeting the 3’UTR of BTV segment 10, the smallest RNA segment, were shown to be the most potent and deletions or substitution mutations of the targeted sequences diminished the RNA complexes and abolished the recovery of viable viruses using reverse genetics. Cell-free capsid assembly/RNA packaging assay also confirmed that the inhibitory ORNs could interfere with RNA packaging and further substitution mutations within the putative RNA packaging sequence have identified the recognition sequence concerned. Exchange of 3’UTR between segments have further demonstrated that RNA recognition was segment specific, most likely acting as part of the secondary structure of the entire genomic segment. Our data confirm that genome packaging in this segmented dsRNA virus occurs via the formation of supramolecular complexes formed by the interaction of specific sequences located in the 3’ UTRs. Additionally, the inhibition of packaging in-trans with inhibitory ORNs suggests this that interaction is a bona fide target for the design of compounds with antiviral activity. PMID:26646790

Disruption of Specific RNA-RNA Interactions in a Double-Stranded RNA Virus Inhibits Genome Packaging and Virus Infectivity.

PubMed

Fajardo, Teodoro; Sung, Po-Yu; Roy, Polly

2015-12-01

Bluetongue virus (BTV) causes hemorrhagic disease in economically important livestock. The BTV genome is organized into ten discrete double-stranded RNA molecules (S1-S10) which have been suggested to follow a sequential packaging pathway from smallest to largest segment during virus capsid assembly. To substantiate and extend these studies, we have investigated the RNA sorting and packaging mechanisms with a new experimental approach using inhibitory oligonucleotides. Putative packaging signals present in the 3'untranslated regions of BTV segments were targeted by a number of nuclease resistant oligoribonucleotides (ORNs) and their effects on virus replication in cell culture were assessed. ORNs complementary to the 3' UTR of BTV RNAs significantly inhibited virus replication without affecting protein synthesis. Same ORNs were found to inhibit complex formation when added to a novel RNA-RNA interaction assay which measured the formation of supramolecular complexes between and among different RNA segments. ORNs targeting the 3'UTR of BTV segment 10, the smallest RNA segment, were shown to be the most potent and deletions or substitution mutations of the targeted sequences diminished the RNA complexes and abolished the recovery of viable viruses using reverse genetics. Cell-free capsid assembly/RNA packaging assay also confirmed that the inhibitory ORNs could interfere with RNA packaging and further substitution mutations within the putative RNA packaging sequence have identified the recognition sequence concerned. Exchange of 3'UTR between segments have further demonstrated that RNA recognition was segment specific, most likely acting as part of the secondary structure of the entire genomic segment. Our data confirm that genome packaging in this segmented dsRNA virus occurs via the formation of supramolecular complexes formed by the interaction of specific sequences located in the 3' UTRs. Additionally, the inhibition of packaging in-trans with inhibitory ORNs suggests this that interaction is a bona fide target for the design of compounds with antiviral activity.

Basic linear algebra subprograms for FORTRAN usage

NASA Technical Reports Server (NTRS)

Lawson, C. L.; Hanson, R. J.; Kincaid, D. R.; Krogh, F. T.

1977-01-01

A package of 38 low level subprograms for many of the basic operations of numerical linear algebra is presented. The package is intended to be used with FORTRAN. The operations in the package are dot products, elementary vector operations, Givens transformations, vector copy and swap, vector norms, vector scaling, and the indices of components of largest magnitude. The subprograms and a test driver are available in portable FORTRAN. Versions of the subprograms are also provided in assembly language for the IBM 360/67, the CDC 6600 and CDC 7600, and the Univac 1108.

R package CityWaterBalance | Science Inventory | US EPA

EPA Pesticide Factsheets

CityWaterBalance provides a reproducible workflow for studying an urban water system. The network of urban water flows and storages can be modeled and visualized. Any city may be modeled with preassembled data, but data for US cities can be gathered via web services using this package and dependencies, geoknife and dataRetrieval. Urban water flows are difficult to comprehensively quantify. Although many important data sources are openly available, they are published by a variety of agencies in different formats, units, spatial and temporal resolutions. Increasingly, open data are made available via web services, which allow for automated, current retrievals. Integrating data streams and estimating the values of unmeasured urban water flows, however, remains needlessly time-consuming. In order to streamline a reproducible analysis, we have developed the CityWaterBalance package for the open source R language. The CityWaterBalance package for R is based on a simple model of the network of urban water flows and storages. The model may be run with data that has been pre-assembled by the user, or data can be retrieved by functions in CityWaterBalance and dependencies. CityWaterBalance can be used to quickly assemble a quantitative portrait of any urban water system. The systemic effects of water management decisions can be readily explored. Much of the data acquisition process for US cities can already be automated, while the package serves as a place-hold

Heat Transmission Properties of Insulating and Building Materials

National Institute of Standards and Technology Data Gateway

SRD 81 NIST Heat Transmission Properties of Insulating and Building Materials (Web, free access)   NIST has accumulated a valuable and comprehensive collection of thermal conductivity data. Version 1.0 of the database includes data for over 2000 measurements, covering several categories of materials including concrete, fiberboard, plastics, thermal insulation, and rubber.

Effects of pressing schedule on formation of vertical density profile for MDF panels

Treesearch

Zhiyong Cai; James H. Muehl; Jerrold E. Winandy

2006-01-01

A fundamental understanding of mat consolidation during hot pressing will help to optimize the medium-density fiberboard (MDF) manufacturing process by increasing productivity, improving product quality, and enhancing durability. Effects of panel density, fiber moisture content (MC), and pressing schedule on formation of vertical density profile (VDP) during hot...

49 CFR 173.156 - Exceptions for limited quantity and ORM.

Code of Federal Regulations, 2014 CFR

2014-10-01

..., carts, boxes or similar overpacks; (ii) Offered for transportation or transported by: (A) Rail; (B... transported to a disposal facility from one offeror. (2) The 30 kg (66 pounds) gross weight limitation does... a fiberboard box which is banded and secured to a wooden pallet by metal, fabric, or plastic straps...

Fiberboards from loblolly pine refiner groundwood: aspects of fiber morphology

Treesearch

Charles W. McMillin

1969-01-01

In tests with Pinus taeda L., most properties of wet formed hardboard were improved by using fiber refined from wood having short, slender tracheids with thin walls. A theoretical analysis suggested that the fibers fail in bending while under stress induced by the pressing operation. Sush bending failures improve conditions from hydrogen bonding,...

Properties of medium-density fiberboard related to hardwood specific gravity

Treesearch

George E. Woodson

1976-01-01

Boards of acceptable quality were made from barky material, pressure-refined from 14 species of southern hardwoods. Static bending and tensile properties (parallel to surface) of specimens were negatively correlated to stem specific gravity (wood plus bark), chip bulk density, and fiber bulk density. Bending and tensile properties increased with increasing...

40 CFR 63.2292 - What definitions apply to this subpart?

Code of Federal Regulations, 2013 CFR

2013-07-01

..., board coolers, and other process units associated with the manufacturing of plywood and composite wood... are not part of the dryer heated zones. Dry forming means the process of making a mat of resinated..., medium density fiberboard, or hardboard. Dry rotary dryer means a rotary dryer that dries wood particles...

40 CFR 63.2292 - What definitions apply to this subpart?

Code of Federal Regulations, 2012 CFR

2012-07-01

..., board coolers, and other process units associated with the manufacturing of plywood and composite wood... are not part of the dryer heated zones. Dry forming means the process of making a mat of resinated..., medium density fiberboard, or hardboard. Dry rotary dryer means a rotary dryer that dries wood particles...

More rapid edgewise crush test methods

Treesearch

Thomas J. Urbanik; Arthur H. Catlin; Davide R. Friedman; Richard C. Lund

1993-01-01

The use of paraffin wax to reinforce the loading edges of corrugated fiberboard edge-crush specimens requires that the specimens be reconditioned after waxing. The traditional practice employing a 24-h reconditioning period is a conservative approach based on the moisture response rate of corrugated containers. An interlaboratory study was conducted to determine the...

Moisture sorption properties of composite boards from esterified aspen fiber

Treesearch

C. Clemons; R. A. Young; R. M. Rowell

1992-01-01

One barrier to producing wood-plastic composites with wood fiber is the poor thermoplasticity of wood fiber. The objective of our study was to determine the plasticization of chemically modified wood fiber through tests on unmodified and esterified fiberboards. Attrition-milled aspen fiber was esterified with neat acetic, maleic, or succinic anhydride. Fourier...

Relationship between Fiber Furnish and the Structural Performance of MDF

Treesearch

Leslie H. Groom; Laurence Mott; Stephen Shaler

1999-01-01

The structural performance of medium density fiberboard (MDF) is attributable to three primary variables which are: physical and mechanical properties of individual wood fibers; fiber-to-fiber stress transfer; and fiber orientation. These origins of fiber properties and stress transfer can be traced to the fiber generation method wherein fiber orientation is associated...

Principles of minimum cost refining for optimum linerboard strength

Treesearch

Thomas J. Urbanik; Jong Myoung Won

2006-01-01

The mechanical properties of paper at a single basis weight and a single targeted refining freeness level have traditionally been used to compare papers. Understanding the economics of corrugated fiberboard requires a more global characterization of the variation of mechanical properties and refining energy consumption with freeness. The cost of refining energy to...

3D engineered fiberboard : a new structural building product

Treesearch

John F. Hunt; Jerrold E. Winandy

2002-01-01

To help meet the need for sustainable forest management tools, the USDA Forest Products Laboratory is developing an economically viable process to produce three-dimensional structural fibreboard products that can utilize a wide range of lignocellulosic fibres contained in the forest undergrowth and in underutilized timber. This will encourage the public and private...

Cradle to Gate Life Cycle Assessment of North American Cellulosic Fiberboard Production

Treesearch

Maureen Puettmann; Richard Bergman; Elaine Oneil

2016-01-01

All consumer products have an environmental footprint. Quantifying that footprint has become more common with the advent of Environmental Preferential Purchasing (EPP), an emergent world-wide phenomenon. The forest products industry in particular has been challenged regarding its environmental sustainability. The greatest challenges with respect to practices center on...

Finite element corroboration of buckling phenomena observed in corrugated boxes

Treesearch

Thomas J. Urbanik; Edmond P. Saliklis

2003-01-01

Conventional compression strength formulas for corrugated fiberboard boxes are limited to geometry and material that produce an elastic postbuckling failure. Inelastic postbuckling can occur in squatty boxes and trays, but a mechanistic rationale for unifying observed strength data is lacking. This study combines a finite element model with a parametric design of the...

Fiberboard created using the natural adhesive properties of distillers dried grains with solubles

USDA-ARS?s Scientific Manuscript database

Distillers dried grains with solubles (DDGS) were employed as a bio-based resin/adhesive. DDGS were defatted with hexane, ball ground and screened prior to use. DDGS flour was mixed dry with Paulownia wood (PW) to make composites using the following conditions: temperature of 150-195 oC, PW particle...

Capacity, production, and manufacturing of woodbased panels in North America

Treesearch

Henry Spelter

1994-01-01

This report is an informational report about four wood-based panel industries: particleboard, oriented strandboard, medium density fiberboard, and Southern Pine plywood. Items highlighted are trends in manufacturing and new plant costs, industry manufacturing capacity, and location. Recent data show the greatest amount of growth taking place in the oriented strandboard...

Adhesives with wood materials : bond formation and performance

Treesearch

Charles R. Frihart; Christopher G. Hunt

2010-01-01

Adhesive bonding of wood plays an increasing role in the forest products industry and is a key factor for efficiently utilizing our timber resource. The main use of adhesives is in the manufacture of building materials, including plywood, oriented strandboard, particleboard, fiberboard, structural composite lumber, doors, windows and frames, and factory-laminated wood...

Life-Cycle Inventory Analysis of Cellulosic Fiberboard Production in North America

Treesearch

Richard D. Bergman

2014-01-01

Documenting the environmental performance of building products is becoming widespread because of many green-marketing claims made without scientific merit (i.e., green-washing). Developing environmental product declarations (EPDs) for building products is one way to accomplish this objective for scientific documentation and to counter green-washing. EPDs are based on...

Steam-assisted hot-pressing of construction plywood

Treesearch

Ronald W. Jokerst; Robert L. Geimer

1994-01-01

This study was designed to determine if steam injection pressing used for fiberboard, particleboard, and flakeboard could be adapted to the pressing of plywood. Plywood panels were fabricated with and without adhesive and then pressed to determine the effects of steam injection Lime, steam injection pressure, and press pressure on heat transfer rate, moisture...

Selected properties of MDF and flakeboard overlaid with fiberglass mats

Treesearch

Zhiyong Cai

2006-01-01

Nonwoven fiberglass face laminates have long been applied to consolidated wood- based composites to improve their performance and serviceability. In this study, fiberglass mats with 50 percent resin binder were applied as face laminates to unconsolidated wood fiber or flake mats, then hot-pressed to make overlaid medium density fiberboard and flakeboard. Fiberglass...

Composites from southern pine juvenile wood. Part 2. Durability and dimensional stability

Treesearch

Anton D. Pugel; Eddie W. Price; Chung-Yun Hse

1990-01-01

Southern pine juvenile and mature wood were processed into three composites: flakeboard, particleboard, and fiberboard. The durability of these composites was assessed by subjecting specimens to an ovendry-vacuumpressure-soak (ODVPS) treatment, and then evaluated for modulus of elasticity, modulus of rupture, and internal bond. Overall, juvenile wood composites had...

Ozone reactions with indoor materials during building disinfection

NASA Astrophysics Data System (ADS)

Poppendieck, D.; Hubbard, H.; Ward, M.; Weschler, C.; Corsi, R. L.

There is scant information related to heterogeneous indoor chemistry at ozone concentrations necessary for the effective disinfection of buildings, i.e., hundreds to thousands of ppm. In the present study, 24 materials were exposed for 16 h to ozone concentrations of 1000-1200 ppm in the inlet streams of test chambers. Initial ozone deposition velocities were similar to those reported in the published literature for much lower ozone concentrations, but decayed rapidly as reaction sites on material surfaces were consumed. For every material, deposition velocities converged to a relatively constant, and typically low, value after approximately 11 h. The four materials with the highest sustained deposition velocities were ceiling tile, office partition, medium density fiberboard and gypsum wallboard backing. Analysis of ozone reaction probabilities indicated that throughout each experiment, and particularly after several hours of disinfection, surface reaction resistance dominated the overall resistance to ozone deposition for nearly all materials. Total building disinfection by-products (all carbonyls) were quantified per unit area of each material for the experimental period. Paper, office partition, and medium density fiberboard each released greater than 38 mg m -2 of by-products.

Package architecture and component design for an implanted neural stimulator with closed loop control.

PubMed

Bjune, Caroline K; Marinis, Thomas F; Brady, Jeanne M; Moran, James; Wheeler, Jesse; Sriram, Tirunelveli S; Parks, Philip D; Widge, Alik S; Dougherty, Darin D; Eskandar, Emad N

2015-08-01

An implanted neural stimulator with closed loop control requires electrodes for stimulation pulses and recording neuron activity. Our system features arrays of 64 electrodes. Each electrode can be addressed through a cross bar switch, to enable it to be used for stimulation or recording. This electrode switch, a bank of low noise amplifiers with an integrated analog to digital converter, power conditioning electronics, and a communications and control gate array are co-located with the electrode array in a 14 millimeter diameter satellite package that is designed to be flush mounted in a skull burr hole. Our system features five satellite packages connected to a central hub processor-controller via ten conductor cables that terminate in a custom designed, miniaturized connector. The connector incorporates features of high reliability, military grade devices and utilizes three distinct seals to isolate the contacts from fluid permeation. The hub system is comprised of a connector header, hermetic electronics package, and rechargeable battery pack, which are mounted on and electrically interconnected by a flexible circuit board. The assembly is over molded with a compliant silicone rubber. The electronics package contains two antennas, a large coil, used for recharging the battery and a high bandwidth antenna that is used to download data and update software. The package is assembled from two machined alumina pieces, a flat base with brazed in, electrical feed through pins and a rectangular cover with rounded corners. Titanium seal rings are brazed onto these two pieces so that they can be sealed by laser welding. A third system antenna is incorporated in the flexible circuit board. It is used to communicate with an externally worn control package, which monitors the health of the system and allows both the user and clinician to control or modify various system function parameters.

Construction of RNA nanocages by re-engineering the packaging RNA of Phi29 bacteriophage

NASA Astrophysics Data System (ADS)

Hao, Chenhui; Li, Xiang; Tian, Cheng; Jiang, Wen; Wang, Guansong; Mao, Chengde

2014-05-01

RNA nanotechnology promises rational design of RNA nanostructures with wide array of structural diversities and functionalities. Such nanostructures could be used in applications such as small interfering RNA delivery and organization of in vivo chemical reactions. Though having impressive development in recent years, RNA nanotechnology is still quite limited and its programmability and complexity could not rival the degree of its closely related cousin: DNA nanotechnology. Novel strategies are needed for programmed RNA self-assembly. Here, we have assembled RNA nanocages by re-engineering a natural, biological RNA motif: the packaging RNA of phi29 bacteriophage. The resulting RNA nanostructures have been thoroughly characterized by gel electrophoresis, cryogenic electron microscopy imaging and dynamic light scattering.

Automation Study for Longhorn Army Ammunition Plant Hand Held Signal Flight Assembly, Rocket Barrel Assembly, 40 MM Signal, Final Packaging/Pack-Out, and Star Finishing

DTIC Science & Technology

1990-03-01

J.B. Webb Jonesboro , AR Farmington, MI Crimping Press Joraco Drake Corp. Smithfield, RI Phoenix, AZ Die Cutter Roll Cut Peerless Machinery Co. Harbour...be taken are detailed for each assembly procedure. The report provides overall system integration requirements. The layouts of the two manufacturing...buildings are detailed. Several component changes to the Hand Held Signals are proposed. None of these will affect the operation of the-final product

Lightweight IMM PV Flexible Blanket Assembly

NASA Technical Reports Server (NTRS)

Spence, Brian

2015-01-01

Deployable Space Systems (DSS) has developed an inverted metamorphic multijunction (IMM) photovoltaic (PV) integrated modular blanket assembly (IMBA) that can be rolled or z-folded. This IMM PV IMBA technology enables a revolutionary flexible PV blanket assembly that provides high specific power, exceptional stowed packaging efficiency, and high-voltage operation capability. DSS's technology also accommodates standard third-generation triple junction (ZTJ) PV device technologies to provide significantly improved performance over the current state of the art. This SBIR project demonstrated prototype, flight-like IMM PV IMBA panel assemblies specifically developed, designed, and optimized for NASA's high-voltage solar array missions.

Thermoelectric Outer Planets Spacecraft (TOPS) electronic packaging and cabling development summary report

NASA Technical Reports Server (NTRS)

Dawe, R. H.; Arnett, J. C.

1974-01-01

Electronic packaging and cabling activities performed in support of the Thermoelectric Outer Planets Spacecraft (TOPS) Advanced Systems Technology (AST) project are detailed. It describes new electronic compartment, electronic assembly, and module concepts, and a new high-density, planar interconnection technique called discrete multilayer (DML). Development and qualification of high density cabling techniques, using small gage wire and microminiature connectors, are also reported.

Low-cost CWDM transmitter package

NASA Astrophysics Data System (ADS)

Bhandarkar, Navin; Castillega, Jaime

2005-03-01

A low-cost coarse-wavelength-division multiplexer (CWDM) transmitter that combines four channels (wavelengths) in the infrared spectrum (~1310 nm) in a small form-factor un-cooled package is demonstrated. The package utilizes precision molded optics to multiplex beams from four grating-outcoupled surface-emitting (GSE) lasers into a single beam suitable for coupling into multimode fiber. This paper summarizes the optical and opto-mechanical design, fabrication and assembly of prototypes, and optical, thermal and electrical measurement results of the prototypes. This unique design enables multiplexing of wavelengths without the use of filters, waveguides, couplers and fiber splicing. Commercial fabrication and alignment technology is used to manufacture the package, resulting in a more robust, reliable and low-cost transmitter. The transmitter package is enabled by the unique characteristics of the long-wavelength GSE laser.

Investigation on the hermeticity of an implantable package with 32 feedthroughs for neural prosthetic applications.

PubMed

Bisoni, Lorenzo; Mueller, Matthias; Cvancara, Paul; Carboni, Caterina; Puddu, Roberto; Raffo, Luigi; Barbaro, Massimo; Stieglitz, Thomas

2016-08-01

This paper presents an implantable package aimed at hosting a bidirectional neural interface for neural prosthetic applications. The package has been conceived to minimize the invasivity for the patient, for this reason a cylindrical container with an outer diameter of 7 mm and a length of 21 mm has been designed. The package, realized in alumina (Al2O3), presents 32 hermetic feedthroughs located at the top and bottom base of the cylinder. The hermetic housing has been assembled using a low-temperature soldering method based on a previous platinum/gold (Pt/Au) metallization of the ceramic parts. The package's hermeticity has been successfully proved by means of in-vitro tests, exhibiting an increase in the inner relative humidity of 20 %RH over 75 days of observation.

Dosimetric results on EURECA

NASA Technical Reports Server (NTRS)

Reitz, G.

1995-01-01

Detector packages were exposed on the European Retrievable Carrier (EURECA) as part of the Biostack experiment inside the Exobiology and Radiation Assembly (ERA) and at several locations around EURECA. The packages consist of different plastic nuclear track detectors, nuclear emulsions and thermoluminescence dosimeters (TLD's). Evaluation of these detectors yields data on absorbed dose and particle and LET spectra. Preliminary results of absorbed dose measurements in the EURECA dosimeter packages are reported and compared to results of the LDEF experiments. The highest dose rate measured on EURECA is 63.3 plus or minus 0.4 mGy d(exp -1) behind a shielding thickness of 0.09 g cm(exp -2) in front of the detector package.

Gap Resolution

DOE Office of Scientific and Technical Information (OSTI.GOV)

Labutti, Kurt; Foster, Brian; Lapidus, Alla

Gap Resolution is a software package that was developed to improve Newbler genome assemblies by automating the closure of sequence gaps caused by repetitive regions in the DNA. This is done by performing the follow steps:1) Identify and distribute the data for each gap in sub-projects. 2) Assemble the data associated with each sub-project using a secondary assembler, such as Newbler or PGA. 3) Determine if any gaps are closed after reassembly, and either design fakes (consensus of closed gap) for those that closed or lab experiments for those that require additional data. The software requires as input a genomemore » assembly produce by the Newbler assembler provided by Roche and 454 data containing paired-end reads.« less

Dynamics of HIV-1 RNA Near the Plasma Membrane during Virus Assembly.

PubMed

Sardo, Luca; Hatch, Steven C; Chen, Jianbo; Nikolaitchik, Olga; Burdick, Ryan C; Chen, De; Westlake, Christopher J; Lockett, Stephen; Pathak, Vinay K; Hu, Wei-Shau

2015-11-01

To increase our understanding of the events that lead to HIV-1 genome packaging, we examined the dynamics of viral RNA and Gag-RNA interactions near the plasma membrane by using total internal reflection fluorescence microscopy. We labeled HIV-1 RNA with a photoconvertible Eos protein via an RNA-binding protein that recognizes stem-loop sequences engineered into the viral genome. Near-UV light exposure causes an irreversible structural change in Eos and alters its emitted fluorescence from green to red. We studied the dynamics of HIV-1 RNA by photoconverting Eos near the plasma membrane, and we monitored the population of photoconverted red-Eos-labeled RNA signals over time. We found that in the absence of Gag, most of the HIV-1 RNAs stayed near the plasma membrane transiently, for a few minutes. The presence of Gag significantly increased the time that RNAs stayed near the plasma membrane: most of the RNAs were still detected after 30 min. We then quantified the proportion of HIV-1 RNAs near the plasma membrane that were packaged into assembling viral complexes. By tagging Gag with blue fluorescent protein, we observed that only a portion, ∼13 to 34%, of the HIV-1 RNAs that reached the membrane were recruited into assembling particles in an hour, and the frequency of HIV-1 RNA packaging varied with the Gag expression level. Our studies reveal the HIV-1 RNA dynamics on the plasma membrane and the efficiency of RNA recruitment and provide insights into the events leading to the generation of infectious HIV-1 virions. Nascent HIV-1 particles assemble on plasma membranes. During the assembly process, HIV-1 RNA genomes must be encapsidated into viral complexes to generate infectious particles. To gain insights into the RNA packaging and virus assembly mechanisms, we labeled and monitored the HIV-1 RNA signals near the plasma membrane. Our results showed that most of the HIV-1 RNAs stayed near the plasma membrane for only a few minutes in the absence of Gag, whereas most HIV-1 RNAs stayed at the plasma membrane for 15 to 60 min in the presence of Gag. Our results also demonstrated that only a small proportion of the HIV-1 RNAs, approximately 1/10 to 1/3 of the RNAs that reached the plasma membrane, was incorporated into viral protein complexes. These studies determined the dynamics of HIV-1 RNA on the plasma membrane and obtained temporal information on RNA-Gag interactions that lead to RNA encapsidation. Copyright © 2015, American Society for Microbiology. All Rights Reserved.

Emerging Chitosan-Based Films for Food Packaging Applications.

PubMed

Wang, Hongxia; Qian, Jun; Ding, Fuyuan

2018-01-17

Recent years have witnessed great developments in biobased polymer packaging films for the serious environmental problems caused by the petroleum-based nonbiodegradable packaging materials. Chitosan is one of the most abundant biopolymers after cellulose. Chitosan-based materials have been widely applied in various fields for their biological and physical properties of biocompatibility, biodegradability, antimicrobial ability, and easy film forming ability. Different chitosan-based films have been fabricated and applied in the field of food packaging. Most of the review papers related to chitosan-based films are focusing on antibacterial food packaging films. Along with the advances in the nanotechnology and polymer science, numerous strategies, for instance direct casting, coating, dipping, layer-by-layer assembly, and extrusion, have been employed to prepare chitosan-based films with multiple functionalities. The emerging food packaging applications of chitosan-based films as antibacterial films, barrier films, and sensing films have achieved great developments. This article comprehensively reviews recent advances in the preparation and application of engineered chitosan-based films in food packaging fields.

A highly miniaturized vacuum package for a trapped ion atomic clock

DOE PAGES

Schwindt, Peter D. D.; Jau, Yuan-Yu; Partner, Heather; ...

2016-05-12

We report on the development of a highly miniaturized vacuum package for use in an atomic clock utilizing trapped ytterbium-171 ions. The vacuum package is approximately 1 cm 3 in size and contains a linear quadrupole RF Paul ion trap, miniature neutral Yb sources, and a non-evaporable getter pump. We describe the fabrication process for making the Yb sources and assembling the vacuum package. To prepare the vacuum package for ion trapping, it was evacuated, baked at a high temperature, and then back filled with a helium buffer gas. Once appropriate vacuum conditions were achieved in the package, the packagemore » was sealed with a copper pinch-off and was then pumped only by the non-evaporable getter. We demonstrated ion trapping in this vacuum package and the operation of an atomic clock, stabilizing a local oscillator to the 12.6 GHz hyperfine transition of 171Yb +. The fractional frequency stability of the clock was measured to be 2 × 10 -11 / τ 1/2.« less

Protection of microelectronic devices during packaging

DOEpatents

Peterson, Kenneth A.; Conley, William R.

2002-01-01

The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.

Temporary coatings for protection of microelectronic devices during packaging

DOEpatents

Peterson, Kenneth A.; Conley, William R.

2005-01-18

The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, temporary protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.

Cradle-to-Gate Life-Cycle Inventory of Cellulosic Fiberboard Produced in North America

Treesearch

Richard D. Bergman

2015-01-01

Documenting the environmental performance of building products is becoming widespread because of many green marketing claims made without scientific merit (i.e., green-washing). Developing environmental product declarations (EPDs) for building products is one way to accomplish this objective for scientific documentation and to counter green-washing (ISO 2006a; Bergman...

Fiberboards from loblolly pine refiner groundwood: effects of gross wood characteristics and board density

Treesearch

Charles W. McMillin

1968-01-01

Boards for insulation and and structural uses are being manufactured in increasing quantities. The coarse fiber required for these products can be disk-refined from untreated wood chips. Since such fiber is produced in essentially one mechanical operation, continuous control is required of the raw material as well as the refining process.

Use of Advanced Spectroscopic Techniques for Predicting the Mechanical Properties of Wood Composites

Treesearch

Timothy G. Rials; Stephen S. Kelley; Chi-Leung So

2002-01-01

Near infrared (NIR) spectroscopy was used to characterize a set of medium-density fiberboard (MDF) samples. This spectroscopic technique, in combination with projection to latent structures (PLS) modeling, effectively predicted the mechanical strength of MDF samples with a wide range of physical properties. The stiffness, strength, and internal bond properties of the...

Surface modification of lignocellulosic fibers using high-frequency ultrasound

Treesearch

Jayant B. Gadhe; Ram B. Gupta; Thomas Elder

2005-01-01

Enzymatic and chemical oxidation of fiber surfaces has been reported in the literature as a method for producing medium density fiberboards without using synthetic adhesives. This work focuses on modifying the surface properties of wood fibers by the generation of free radicals using high-frequency ultrasound. A sonochemical reactor operating at 610 kHz is used to...

49 CFR 173.171 - Smokeless powder for small arms.

Code of Federal Regulations, 2014 CFR

2014-10-01

... fiberboard boxes meeting the Packing Group I performance level, provided all inside containers are packed to prevent shifting and the net weight of smokeless powder in any one box does not exceed 7.3 kg (16 pounds... 45.4 kg (100 pounds) net mass in: (1) One rail car, motor vehicle, or cargo-only aircraft; or (2) One...

Medium density fiberboards from plantation grown Eucalyptus saligna

Treesearch

Andrzej Krzysik; John A. Youngquist; James H. Muehl; Fabio Spina Franca

1999-01-01

The production of industrial wood from natural forests is predicted to decline in the future. Factors that will contribute to this decline include changes in land use patterns, depletion of resources in some parts of the world, and the withdrawal of forest areas from industrial production in order to provide for environmental, recreational, and other social needs....

Insulating board, hardboard, and other structural fiberboards

Treesearch

W. C. Lewis; S. L. Schwartz

1965-01-01

The wood-base fiber panel materials are a part of the rapidly evolving technology based on converting lignocellulose to fiber and reconstituting the fiber into large sheets and panels. While some equipment and techniques used are the same as for producing paper, there are enough differences in techniques used and other requirements for manufacture that a separate...

49 CFR 173.187 - Pyrophoric solids, metals or alloys, n.o.s.

Code of Federal Regulations, 2013 CFR

2013-10-01

... positive (not friction) means of closure and contain not more than 15 kg (33 pounds) each. (c) In fiberboard boxes (4G) with inner metal receptacles which have a positive (not friction) means of closure and... (1D) with inner metal receptacles which have a positive (not friction) means of closure and contain...

49 CFR 173.187 - Pyrophoric solids, metals or alloys, n.o.s.

Code of Federal Regulations, 2014 CFR

2014-10-01

... positive (not friction) means of closure and contain not more than 15 kg (33 pounds) each. (c) In fiberboard boxes (4G) with inner metal receptacles which have a positive (not friction) means of closure and... (1D) with inner metal receptacles which have a positive (not friction) means of closure and contain...

Fire performance of fiber board coated with nano kaolin-clay film

Treesearch

Zhijia Liu; John F. Hunt; Zhiyong Cai

2013-01-01

Fiberboard is a common interior material used both in China and the United States of America. The increase in demand for interior materials has raised concerns regarding combustibility of the materials. The pyrolysis characteristics of fiber, phenolic resin (PF), and nano kaolin-clay (NK) were investigated using thermogravimetry. The fire performances of samples coated...

Comparison of postbuckling model and finite element model with compression strength of corrugated boxes

Treesearch

Thomas J. Urbanik; Edmond P. Saliklis

2002-01-01

Conventional compression strength formulas for corrugated fiberboard boxes are limited to geometry and material that produce an elastic postbuckling failure. Inelastic postbuckling can occur in squatty boxes and trays, but a mechanistic rationale for unifying observed strength data is lacking. This study employs a finite element model, instead of actual experiments, to...

Wood-based panel plant locations and timber availability in selected U.S. states

Treesearch

T. McKeever; H. N. Spelter

1998-01-01

This report lists wood-based panel industry plant locations, production capacities, timber inventories, and wood costs for 24 U.S. states. Industry sectors covered include medium-density fiberboard, particleboard, softwood plywood, and oriented strandboard. Maps of major forest producing states show plant locations and the underlying density of timber stocking by...

49 CFR 173.229 - Chloric acid solution or chlorine dioxide hydrate, frozen.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 49 Transportation 2 2012-10-01 2012-10-01 false Chloric acid solution or chlorine dioxide hydrate... Than Class 1 and Class 7 § 173.229 Chloric acid solution or chlorine dioxide hydrate, frozen. When the.... Fiberboard boxes must be reinforced and insulated and sufficient dry ice must be used to maintain the hydrate...

49 CFR 173.229 - Chloric acid solution or chlorine dioxide hydrate, frozen.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 49 Transportation 2 2013-10-01 2013-10-01 false Chloric acid solution or chlorine dioxide hydrate... Than Class 1 and Class 7 § 173.229 Chloric acid solution or chlorine dioxide hydrate, frozen. When the.... Fiberboard boxes must be reinforced and insulated and sufficient dry ice must be used to maintain the hydrate...

49 CFR 173.229 - Chloric acid solution or chlorine dioxide hydrate, frozen.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false Chloric acid solution or chlorine dioxide hydrate... Than Class 1 and Class 7 § 173.229 Chloric acid solution or chlorine dioxide hydrate, frozen. When the.... Fiberboard boxes must be reinforced and insulated and sufficient dry ice must be used to maintain the hydrate...

49 CFR 173.229 - Chloric acid solution or chlorine dioxide hydrate, frozen.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 49 Transportation 2 2011-10-01 2011-10-01 false Chloric acid solution or chlorine dioxide hydrate... Than Class 1 and Class 7 § 173.229 Chloric acid solution or chlorine dioxide hydrate, frozen. When the.... Fiberboard boxes must be reinforced and insulated and sufficient dry ice must be used to maintain the hydrate...

49 CFR 173.229 - Chloric acid solution or chlorine dioxide hydrate, frozen.

Code of Federal Regulations, 2014 CFR

2014-10-01

... 49 Transportation 2 2014-10-01 2014-10-01 false Chloric acid solution or chlorine dioxide hydrate... Than Class 1 and Class 7 § 173.229 Chloric acid solution or chlorine dioxide hydrate, frozen. When the.... Fiberboard boxes must be reinforced and insulated and sufficient dry ice must be used to maintain the hydrate...

Binderless fiberboard : comparison of fiber from recycled corrugated containers and refined small-diameter whole treetops

Treesearch

John F. Hunt; Karen Supan

2006-01-01

Whereas many research activities focus on developing value-added processes that use forest residues, scientists must also investigate the mechanical properties of products made from recycled fiber resources. This study compared the tensile and bending properties of binderless panels made from recycled corrugated containers with properties of panels made from lodgepole...

Production of ethanol from xylose by Candida shehatae grown under continuous or fed-batch conditions

Treesearch

T. W. Jeffries; M. A. Alexander

1990-01-01

Xylose is a major component of angiosperm lignocellulosic residues. It is available from a number of different sources in the forest products industry, including fiberboard manufacture, sulfite waste liquors, production of dissolving pulp, and the hydrolysis of hardwood residues. Hydrolysis of wood for the production of liquid fuels, particularly ethanol, has been...

Fiberboard and hardboard research at the Forest Products Laboratory : a 50-year summary

Treesearch

Gary C. Myers; J. Dobbin McNatt

1985-01-01

Many changes have occurred in the fiber-based panel products industries during the past 50 years. During this timespan the Forest Products Laboratory has conducted a considerable amount of research on processing and product evaluation of fiber-based panel product materials. Unfortunately about 26 percent of this information was never published. completed during this...

Evaluation of Type II Fast Packs for Electrostatic Discharge Properties.

DTIC Science & Technology

1983-08-01

34 x 8" x 1 3/4") consisting of a reclosable cushioned carrier which mates into an outer fiberboard sleeve. A cushioning insert is used consisting of a... RECLOSABLE CUSHIONED CARRIER TEST LOAD FIGURE 1: Cancel Caddy Pack * CONVOLUTED 4* CUSHIONED I FIGURE 2: Type II Fast Pack (PPP-B-1672) TYPE II FAST PACK

How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

NASA Astrophysics Data System (ADS)

Suhir, E.; Yi, S.; Ghaffarian, R.

2017-03-01

It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

Reliability of Sn/Pb and Lead-Free (SnAgCu) Solders of Surface Mounted Miniaturized Passive Components for Extreme Temperature (-185 C to +125 C) Space Missions

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2011-01-01

Surface mount electronic package test boards have been assembled using tin/lead (Sn/Pb) and lead-free (Pb-free or SnAgCu or SAC305) solders. The soldered surface mount packages include ball grid arrays (BGA), flat packs, various sizes of passive chip components, etc. They have been optically inspected after assembly and subsequently subjected to extreme temperature thermal cycling to assess their reliability or future deep space, long-term, extreme temperature environmental missions. In this study, the employed temperature range (-185oC to +125oC) covers military specifications (-55oC to +100oC), extreme old Martian (-120oC to +115oC), asteroid Nereus (-180oC to +25oC) and JUNO (-150oC to +120oC) environments. The boards were inspected at room temperature and at various intervals as a function of extreme temperature thermal cycling and bake duration. Electrical resistance measurements made at room temperature are reported and the tests to date have shown some change in resistance as a function of extreme temperature thermal cycling and some showed increase in resistance. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work will be carried out to understand the reliability of packages under extreme temperature applications (-185oC to +125oC) via continuously monitoring the daisy chain resistance for BGA, Flat-packs, lead less chip packages, etc. This paper will describe the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead and lead-free solder alloys under extreme temperature environments.

Reliability of Sn/Pb and lead-free (SnAgCu) solders of surface mounted miniaturized passive components for extreme temperature (-185°C to +125°C) space missions

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2011-02-01

Surface mount electronic package test boards have been assembled using tin/lead (Sn/Pb) and lead-free (Pb-free or SnAgCu or SAC305) solders. The soldered surface mount packages include ball grid arrays (BGA), flat packs, various sizes of passive chip components, etc. They have been optically inspected after assembly and subsequently subjected to extreme temperature thermal cycling to assess their reliability for future deep space, long-term, extreme temperature environmental missions. In this study, the employed temperature range (-185°C to +125°C) covers military specifications (-55°C to +100°C), extreme cold Martian (-120°C to +115°C), asteroid Nereus (-180°C to +25°C) and JUNO (-150°C to +120°C) environments. The boards were inspected at room temperature and at various intervals as a function of extreme temperature thermal cycling and bake duration. Electrical resistance measurements made at room temperature are reported and the tests to date have shown some change in resistance as a function of extreme temperature thermal cycling and some showed increase in resistance. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work will be carried out to understand the reliability of packages under extreme temperature applications (-185°C to +125°C) via continuously monitoring the daisy chain resistance for BGA, Flat-packs, lead less chip packages, etc. This paper will describe the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead and lead-free solder alloys under extreme temperature environments.

Copper vapor laser modular packaging assembly

DOEpatents

Alger, Terry W.; Ault, Earl R.; Moses, Edward I.

1992-01-01

A modularized packaging arrangement for one or more copper vapor lasers and associated equipment is disclosed herein. This arrangement includes a single housing which contains the laser or lasers and all their associated equipment except power, water and neon, and means for bringing power, water, and neon which are necessary to the operation of the lasers into the container for use by the laser or lasers and their associated equipment.

Copper vapor laser modular packaging assembly

DOEpatents

Alger, T.W.; Ault, E.R.; Moses, E.I.

1992-12-01

A modularized packaging arrangement for one or more copper vapor lasers and associated equipment is disclosed herein. This arrangement includes a single housing which contains the laser or lasers and all their associated equipment except power, water and neon, and means for bringing power, water, and neon which are necessary to the operation of the lasers into the container for use by the laser or lasers and their associated equipment. 2 figs.

Reliability Assessment of Advanced Flip-clip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120 C)

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni; Ghaffarian, Reza; Shapiro, Andrew; Napala, Phil A.; Martin, Patrick A.

2005-01-01

Flip-chip interconnect electronic package boards have been assembled, underfilled, non-destructively evaluated and subsequently subjected to extreme temperature thermal cycling to assess the reliability of this advanced packaging interconnect technology for future deep space, long-term, extreme temperature missions. In this very preliminary study, the employed temperature range covers military specifications (-55 C to 100 C), extreme cold Martian (-120 C to 115 C) and asteroid Nereus (-180 C to 25 C) environments. The resistance of daisy-chained, flip-chip interconnects were measured at room temperature and at various intervals as a function of extreme temperature thermal cycling. Electrical resistance measurements are reported and the tests to date have not shown significant change in resistance as a function of extreme temperature thermal cycling. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work has been carried out to understand the reliability of flip-chip interconnect packages under extreme temperature applications (-190 C to 85 C) via continuously monitoring the daisy chain resistance. Adaptation of suitable diagnostic techniques to identify the failure mechanisms is in progress. This presentation will describe the experimental test results of flip-chip testing under extreme temperatures.

Identification of novel RNA secondary structures within the hepatitis C virus genome reveals a cooperative involvement in genome packaging

PubMed Central

Stewart, H.; Bingham, R.J.; White, S. J.; Dykeman, E. C.; Zothner, C.; Tuplin, A. K.; Stockley, P. G.; Twarock, R.; Harris, M.

2016-01-01

The specific packaging of the hepatitis C virus (HCV) genome is hypothesised to be driven by Core-RNA interactions. To identify the regions of the viral genome involved in this process, we used SELEX (systematic evolution of ligands by exponential enrichment) to identify RNA aptamers which bind specifically to Core in vitro. Comparison of these aptamers to multiple HCV genomes revealed the presence of a conserved terminal loop motif within short RNA stem-loop structures. We postulated that interactions of these motifs, as well as sub-motifs which were present in HCV genomes at statistically significant levels, with the Core protein may drive virion assembly. We mutated 8 of these predicted motifs within the HCV infectious molecular clone JFH-1, thereby producing a range of mutant viruses predicted to possess altered RNA secondary structures. RNA replication and viral titre were unaltered in viruses possessing only one mutated structure. However, infectivity titres were decreased in viruses possessing a higher number of mutated regions. This work thus identified multiple novel RNA motifs which appear to contribute to genome packaging. We suggest that these structures act as cooperative packaging signals to drive specific RNA encapsidation during HCV assembly. PMID:26972799

Compact electro-optical module with polymer waveguides on a flexible substrate for high-density board-level communication

NASA Astrophysics Data System (ADS)

Weiss, J. R. M.; Lamprecht, T.; Meier, N.; Dangel, R.; Horst, F.; Jubin, D.; Beyeler, R.; Offrein, B. J.

2010-02-01

We report on the co-packaging of electrical CMOS transceiver and VCSEL chip arrays on a flexible electrical substrate with optical polymer waveguides. The electro-optical components are attached to the substrate edge and butt-coupled to the waveguides. Electrically conductive silver-ink connects them to the substrate at an angle of 90°. The final assembly contacts the surface of a package laminate with an integrated compressible connector. The module can be folded to save space, requires only a small footprint on the package laminate and provides short electrical high-speed signal paths. With our approach, the electro-optical package becomes a compact electro-optical module with integrated polymer waveguides terminated with either optical connectors (e.g., at the card edge) or with an identical assembly for a second processor on the board. Consequently, no costly subassemblies and connectors are needed, and a very high integration density and scalability to virtually arbitrary channel counts and towards very high data rates (20+ Gbps) become possible. Future cost targets of much less than US$1 per Gbps will be reached by employing standard PCB materials and technologies that are well established in the industry. Moreover, our technology platform has both electrical and optical connectivity and functionality.

30 CFR 7.99 - Critical characteristics.

Code of Federal Regulations, 2010 CFR

2010-07-01

... proper adjustments. (h) Material and dimensions of gaskets that are essential in maintaining the explosion-proof integrity of the diesel power package. (i) Dimensions and assembly of flame arresters. (j...

30 CFR 7.99 - Critical characteristics.

Code of Federal Regulations, 2011 CFR

2011-07-01

... proper adjustments. (h) Material and dimensions of gaskets that are essential in maintaining the explosion-proof integrity of the diesel power package. (i) Dimensions and assembly of flame arresters. (j...

30 CFR 7.99 - Critical characteristics.

Code of Federal Regulations, 2013 CFR

2013-07-01

... proper adjustments. (h) Material and dimensions of gaskets that are essential in maintaining the explosion-proof integrity of the diesel power package. (i) Dimensions and assembly of flame arresters. (j...

KENNEDY SPACE CENTER, FLA. - During a media tour of the Columbia Debris Hangar, photographers look at pieces of tile collected during search and recovery efforts in East Texas. About 83,000 pieces of debris from Columbia were shipped to KSC, which represents about 38 percent of the dry weight of Columbia, equaling almost 85,000 pounds. The debris is being packaged for storage in an area of the Vehicle Assembly Building.

NASA Image and Video Library

2003-09-11

KENNEDY SPACE CENTER, FLA. - During a media tour of the Columbia Debris Hangar, photographers look at pieces of tile collected during search and recovery efforts in East Texas. About 83,000 pieces of debris from Columbia were shipped to KSC, which represents about 38 percent of the dry weight of Columbia, equaling almost 85,000 pounds. The debris is being packaged for storage in an area of the Vehicle Assembly Building.

Tritium waste package

DOEpatents

Rossmassler, Rich; Ciebiera, Lloyd; Tulipano, Francis J.; Vinson, Sylvester; Walters, R. Thomas

1995-01-01

A containment and waste package system for processing and shipping tritium xide waste received from a process gas includes an outer drum and an inner drum containing a disposable molecular sieve bed (DMSB) seated within outer drum. The DMSB includes an inlet diffuser assembly, an outlet diffuser assembly, and a hydrogen catalytic recombiner. The DMSB absorbs tritium oxide from the process gas and converts it to a solid form so that the tritium is contained during shipment to a disposal site. The DMSB is filled with type 4A molecular sieve pellets capable of adsorbing up to 1000 curies of tritium. The recombiner contains a sufficient amount of catalyst to cause any hydrogen add oxygen present in the process gas to recombine to form water vapor, which is then adsorbed onto the DMSB.

Tritium waste package

DOEpatents

Rossmassler, R.; Ciebiera, L.; Tulipano, F.J.; Vinson, S.; Walters, R.T.

1995-11-07

A containment and waste package system for processing and shipping tritium oxide waste received from a process gas includes an outer drum and an inner drum containing a disposable molecular sieve bed (DMSB) seated within the outer drum. The DMSB includes an inlet diffuser assembly, an outlet diffuser assembly, and a hydrogen catalytic recombiner. The DMSB absorbs tritium oxide from the process gas and converts it to a solid form so that the tritium is contained during shipment to a disposal site. The DMSB is filled with type 4A molecular sieve pellets capable of adsorbing up to 1000 curies of tritium. The recombiner contains a sufficient amount of catalyst to cause any hydrogen and oxygen present in the process gas to recombine to form water vapor, which is then adsorbed onto the DMSB. 1 fig.

Developing targets for radiation transport experiments at the Omega laser facility

DOE PAGES

Capelli, Deanna; Charsley-Groffman, C. A.; Randolph, Randall Blaine; ...

2017-07-13

Targets have been developed to measure supersonic radiation transport in aerogel foams using absorption spectroscopy. The target consists of an aerogel foam uniformly doped with either titanium or scandium inserted into an undoped aerogel foam package. This creates a localized doped foam region to provide spatial resolution for the measurement. Development and characterization of the foams is a key challenge in addition to machining and assembling the two foams so they mate without gaps. The foam package is inserted into a beryllium sleeve and mounted on a gold hohlraum. The target is mounted to a holder created using additive manufacturingmore » and mounted on a stalk. As a result, the manufacturing of the components, along with assembly and metrology of the target are described here.« less

Developing targets for radiation transport experiments at the Omega laser facility

DOE Office of Scientific and Technical Information (OSTI.GOV)

Capelli, Deanna; Charsley-Groffman, C. A.; Randolph, Randall Blaine

Targets have been developed to measure supersonic radiation transport in aerogel foams using absorption spectroscopy. The target consists of an aerogel foam uniformly doped with either titanium or scandium inserted into an undoped aerogel foam package. This creates a localized doped foam region to provide spatial resolution for the measurement. Development and characterization of the foams is a key challenge in addition to machining and assembling the two foams so they mate without gaps. The foam package is inserted into a beryllium sleeve and mounted on a gold hohlraum. The target is mounted to a holder created using additive manufacturingmore » and mounted on a stalk. As a result, the manufacturing of the components, along with assembly and metrology of the target are described here.« less

NASA-DoD Lead-Free Electronics Project

NASA Technical Reports Server (NTRS)

Kessel, Kurt R.

2009-01-01

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BOA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BOA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

NASA-DoD Lead-Free Electronics Project

NASA Technical Reports Server (NTRS)

Kessel, Kurt R.

2009-01-01

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

Assembly of optical fibers for the connection of polymer-based waveguide

NASA Astrophysics Data System (ADS)

Ansel, Yannick; Grau, Daniel; Holzki, Markus; Kraus, Silvio; Neumann, Frank; Reinhard, Carsten; Schmitz, Felix

2003-03-01

This paper describes the realization of polymer-based optical structures and the assembly and packaging strategy to connect optical fiber ribbons to the waveguides. For that a low cost fabrication process using the SU-8TM thick photo-resist is presented. This process consists in the deposition of two photo-structurized resist layers filled up with epoxy glue realising the core waveguide. For the assembly, a new modular vacuum gripper was realised and installed on an automatic pick and place assembly robot to mount precisely and efficiently the optical fibers in the optical structures. First results have shown acceptable optical propagation loss for the complete test structure.

Modeling the Structure of Helical Assemblies with Experimental Constraints in Rosetta.

PubMed

André, Ingemar

2018-01-01

Determining high-resolution structures of proteins with helical symmetry can be challenging due to limitations in experimental data. In such instances, structure-based protein simulations driven by experimental data can provide a valuable approach for building models of helical assemblies. This chapter describes how the Rosetta macromolecular package can be used to model homomeric protein assemblies with helical symmetry in a range of modeling scenarios including energy refinement, symmetrical docking, comparative modeling, and de novo structure prediction. Data-guided structure modeling of helical assemblies with experimental information from electron density, X-ray fiber diffraction, solid-state NMR, and chemical cross-linking mass spectrometry is also described.

Orbital assembly and maintenance study

NASA Technical Reports Server (NTRS)

Gorman, D.; Grant, C.; Kyrias, G.; Lord, C.; Rombach, J.; Salis, M.; Skidmore, R.; Thomas, R.

1975-01-01

The requirements, conceptual design, tradeoffs, procedures, and techniques for orbital assembly of the support structure of the microwave power transmission system and the radio astronomy telescope are described. Thermal and stress analyses, packaging, alignment, and subsystems requirements are included along with manned vs. automated and transportation tradeoffs. Technical and operational concepts for the manned and automated maintenance of satellites were investigated and further developed results are presented.

Quality assurance plan for Solar Maximum Mission (SSM) Instruments electronic assembly - HRUV spectrometer/polarimeter

NASA Technical Reports Server (NTRS)

1976-01-01

The quality assurance program demonstrates recognition of the quality aspects and an organized approach to achieve them. It ensures that quality requirements are determined and satisfied throughout all phases of contract performance, including preliminary and engineering design, development, fabrication, processing, assembly, inspection, test, checkout, packaging, shipping, storage, maintenance field use, flight preparations, flight operations and post-flight analysis, as applicable.

Advanced Sensors for TBI

DTIC Science & Technology

2016-12-01

SMD-VAC- GP, Virtual Industries) with plastic tip. Then the chip was covered with silicone open-cell foam (0.062” thick, HT -870, Stockwell...the build. 26 We discussed with a sub- contractor in Livermore who might be able to perform the packaging assembly work. Dr. Kotovsky...worked with the sub- contractor on practice assemblies anticipating the new upcoming build. Working through an outside contractor represents an enormous

Dimpled ball grid array process development for space flight applications

NASA Technical Reports Server (NTRS)

Barr, S. L.; Mehta, A.

2000-01-01

A 472 dimpled ball grid array (D-BGA) package has not been used in past space flight environments, therefore it was necessary to develop a process that would yield robust and reliable solder joints. The process developing assembly, inspection and rework techniques, were verified by conducting environmental tests. Since the 472 D-BGA packages passed the above environmental tests within the specifications, the process was successfully developed for space flight electronics.

Dimensional stability and decay resistance of composite fiberboard made from plantation-grown southern yellow pine

Treesearch

Poo Chow; Timothy Harp; John A. Youngquist; Jim H. Muehl; Andrzej M. Krzysik

1999-01-01

The objective of this study was to investigate the influence of the phenol-formaldehyde resin content level (3 percent and 7 percent), and three fungi species (Poria placenta, Gleophyllum trabeum, and Polyporus versicolor) on the dimensional stability and decay resistance of high density composition boards made from plantation-grown southern pine chips. A standard ASTM...

Composites from southern pine juvenile wood. Part 1. Panel fabrication and initial properties

Treesearch

Anton D. Pugel; Eddie W. Price; Chung-Yun Hse

1990-01-01

Flakeboard, particleboard, and fiberboard panels were manufactured from four different sources of southern pine (Pinus taeda L.) juvenile wood. The sources were: 1) fastgrown trees; 2) the inner core of older trees; 3) branches; and 4) tops. The juvenile wood particle sizes and panel densities were similar to those used for control panels made from...

78 FR 60766 - Clarification on Fireworks Policy Regarding Approvals or Certifications for Specialty Fireworks...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-10-02

... fireworks device is a fire truck with 10 tubes, 2 grams per tube, for a total pyrotechnic weight of 20 grams... fusing; 3. May not exceed 10 fiberboard or plastic tubes per device; 4. May not contain more than 2 grams of pyrotechnic composition per tube, and not more than 20 grams pyrotechnic composition in the...

Measurement of Dynamic Viscoelasticity of Full-Size Wood Composite Panels Using a Vibration Testing Method

Treesearch

Cheng Guan; Houjiang Zhang; John F. Hunt; Lujing Zhou; Dan Feng

2016-01-01

The dynamic viscoelasticity of full-size wood composite panels (WCPs) under the free-free vibrational state were determined by a vibration testing method. Vibration detection tests were performed on 194 pieces of three types of full-size WCPs (particleboard, medium density fiberboard, and plywood (PW)). The dynamic viscoelasticity from smaller specimens cut from the...

Binderless fiberboard from two different types of fiber furnishes

Treesearch

Otto Suchsland; George Woodson; Charles W. McMillin

1985-01-01

Fiber furnishes from two commercial processes were used to make experimental hardboards by all four possible methods: wet formed (pressed dry and wet), and dry formed (pressed dry and wet). Since no adhesives were added, all bonding was due to natural agents. Results of mechanical and physical testing of the hardboards indicated that high quality hardboard can be made...

3D engineered fiberboard : engineering analysis of a new building product

Treesearch

John F. Hunt; Jerrold E. Winandy

2003-01-01

In many forests across the United States, the high forest fuel loadings are contributing to our recent forest fire problems. Many fire-prone timber stands are generally far from traditional timber markets or the timber is not economically valuable enough to cover the costs of removal. To help address this problem, the USDA Forest Products Laboratory has developed a...

Strength and life criteria for corrugated fiberboard by three methods

Treesearch

Thomas J. Urbanik

1997-01-01

The conventional test method for determining the stacking life of corrugated containers at a fixed load level does not adequately predict a safe load when storage time is fixed. This study introduced multiple load levels and related the probability of time at failure to load. A statistical analysis of logarithm-of-time failure data varying with load level predicts the...

Pressing of three-layer, dry-formed MDF with binderless hardboard faces

Treesearch

Otto Suchsland; George E. Woodson; Charles W. McMillin

1986-01-01

Severely cooked Masonite pulp was used as face material in three-layer experimental medium-density fiberboard (MDF). The core layer consisted of conventional MDF furnish with resin binder added. The faces were formed absolutely dry without additives of any kind. The three-layer mat was hot-pressed to overall densities ranging from 44 to 56 pcf. The faces had hardboard-...

Chicken feather fiber as an additive in MDF composites

Treesearch

Jerrold E. Winandy; James H. Muehl; Jessie A. Glaeser; Walter Schmidt

2007-01-01

Medium density fiberboard (MDF) panels were made with aspen fiber and 0-95% chicken feather fiber (CFF) in 2.5%, 5%, or 25% increments, using 5% phenol formaldehyde resin as the adhesive. Panels were tested for mechanical and physical properties as well as decay. The addition of CFF decreased strength and stiffness of MDF-CFF composites compared with that of all-wood...

Mechanical and physical properties of composite panels manufactured from Chinese tallow tree furnish

Treesearch

Todd F. Shupe; Leslie H. Groom; Thomas L. Eberhardt; Timothy G. Rials; Chung Y. Hse; Thomas Pesacreta

2006-01-01

Chinese tallow tree is a noxious, invasive plant in the southeastern United States. It is generally considered a nuisance and has no current commercial use. The objective of this research was to determine the technical feasibility of using the stem wood of this species for particleboard, fiberboard, and structural flakeboard. Due to its rapid growth, Chinese tallow...

Integrated Study of the Potential Application of Remediated CCA Treated Spruce Wood in MDF Production

Treesearch

Ronald Sabo; Altaf H. Basta; Jerrold E. Winandy

2013-01-01

Public health awareness has increased in the past few years regarding the disposal of chromated copper arsenate (CCA) preservative-treated wood wastes. This study demonstrates the potential for using remediated CCA lumber and alternative fiber sources, such as sugar cane bagasse, to produce medium density fiberboard (MDF). The role of both remediated CCA loaded spruce...

Self-Assembly of Measles Virus Nucleocapsid-like Particles: Kinetics and RNA Sequence Dependence.

PubMed

Milles, Sigrid; Jensen, Malene Ringkjøbing; Communie, Guillaume; Maurin, Damien; Schoehn, Guy; Ruigrok, Rob W H; Blackledge, Martin

2016-08-01

Measles virus RNA genomes are packaged into helical nucleocapsids (NCs), comprising thousands of nucleo-proteins (N) that bind the entire genome. N-RNA provides the template for replication and transcription by the viral polymerase and is a promising target for viral inhibition. Elucidation of mechanisms regulating this process has been severely hampered by the inability to controllably assemble NCs. Here, we demonstrate self-organization of N into NC-like particles in vitro upon addition of RNA, providing a simple and versatile tool for investigating assembly. Real-time NMR and fluorescence spectroscopy reveals biphasic assembly kinetics. Remarkably, assembly depends strongly on the RNA-sequence, with the genomic 5' end and poly-Adenine sequences assembling efficiently, while sequences such as poly-Uracil are incompetent for NC formation. This observation has important consequences for understanding the assembly process. © 2016 The Authors. Published by Wiley-VCH Verlag GmbH & Co. KGaA.

Electro-Microfluidic Packaging

NASA Astrophysics Data System (ADS)

Benavides, G. L.; Galambos, P. C.

2002-06-01

There are many examples of electro-microfluidic products that require cost effective packaging solutions. Industry has responded to a demand for products such as drop ejectors, chemical sensors, and biological sensors. Drop ejectors have consumer applications such as ink jet printing and scientific applications such as patterning self-assembled monolayers or ejecting picoliters of expensive analytes/reagents for chemical analysis. Drop ejectors can be used to perform chemical analysis, combinatorial chemistry, drug manufacture, drug discovery, drug delivery, and DNA sequencing. Chemical and biological micro-sensors can sniff the ambient environment for traces of dangerous materials such as explosives, toxins, or pathogens. Other biological sensors can be used to improve world health by providing timely diagnostics and applying corrective measures to the human body. Electro-microfluidic packaging can easily represent over fifty percent of the product cost and, as with Integrated Circuits (IC), the industry should evolve to standard packaging solutions. Standard packaging schemes will minimize cost and bring products to market sooner.

DNA packaging in viral capsids with peptide arms.

PubMed

Cao, Qianqian; Bachmann, Michael

2017-01-18

Strong chain rigidity and electrostatic self-repulsion of packed double-stranded DNA in viruses require a molecular motor to pull the DNA into the capsid. However, what is the role of electrostatic interactions between different charged components in the packaging process? Though various theories and computer simulation models were developed for the understanding of viral assembly and packaging dynamics of the genome, long-range electrostatic interactions and capsid structure have typically been neglected or oversimplified. By means of molecular dynamics simulations, we explore the effects of electrostatic interactions on the packaging dynamics of DNA based on a coarse-grained DNA and capsid model by explicitly including peptide arms (PAs), linked to the inner surface of the capsid, and counterions. Our results indicate that the electrostatic interactions between PAs, DNA, and counterions have a significant influence on the packaging dynamics. We also find that the packed DNA conformations are largely affected by the structure of the PA layer, but the packaging rate is insensitive to the layer structure.

Small terminase couples viral DNA-binding to genome-packaging ATPase activity

PubMed Central

Roy, Ankoor; Bhardwaj, Anshul; Datta, Pinaki; Lander, Gabriel C.; Cingolani, Gino

2012-01-01

SUMMARY Packaging of viral genomes into empty procapsids is powered by a large DNA-packaging motor. In most viruses, this machine is composed of a large (L) and a small (S) terminase subunit complexed with a dodecamer of portal protein. Here, we describe the 1.75 Å crystal structure of the bacteriophage P22 S-terminase in a nonameric conformation. The structure presents a central channel ~23 Å in diameter, sufficiently large to accommodate hydrated B-DNA. The last 23 residues of S-terminase are essential for binding to DNA and assembly to L-terminase. Upon binding to its own DNA, S-terminase functions as a specific activator of L-terminase ATPase activity. The DNA-dependent stimulation of ATPase activity thus rationalizes the exclusive specificity of genome-packaging motors for viral DNA in the crowd of host DNA, ensuring fidelity of packaging and avoiding wasteful ATP hydrolysis. This posits a model for DNA-dependent activation of genome-packaging motors of general interest in virology. PMID:22771211

Fully Roll-to-Roll Gravure Printable Wireless (13.56 MHz) Sensor-Signage Tags for Smart Packaging

NASA Astrophysics Data System (ADS)

Kang, Hwiwon; Park, Hyejin; Park, Yongsu; Jung, Minhoon; Kim, Byung Chul; Wallace, Gordon; Cho, Gyoujin

2014-06-01

Integration of sensing capabilities with an interactive signage through wireless communication is enabling the development of smart packaging wherein wireless (13.56 MHz) power transmission is used to interlock the smart packaging with a wireless (13.56 MHz) reader or a smart phone. Assembly of the necessary componentry for smart packaging on plastic or paper foils is limited by the manufacturing costs involved with Si based technologies. Here, the issue of manufacturing cost for smart packaging has been obviated by materials that allow R2R (roll-to-roll) gravure in combination with R2R coating processes to be employed. R2R gravure was used to print the wireless power transmission device, called rectenna (antenna, diode and capacitor), and humidity sensor on poly(ethylene terephtalate) (PET) films while electrochromic signage units were fabricated by R2R coating. The signage units were laminated with the R2R gravure printed rectenna and sensor to complete the prototype smart packaging.

Fully Roll-to-Roll Gravure Printable Wireless (13.56 MHz) Sensor-Signage Tags for Smart Packaging

PubMed Central

Kang, Hwiwon; Park, Hyejin; Park, Yongsu; Jung, Minhoon; Kim, Byung Chul; Wallace, Gordon; Cho, Gyoujin

2014-01-01

Integration of sensing capabilities with an interactive signage through wireless communication is enabling the development of smart packaging wherein wireless (13.56 MHz) power transmission is used to interlock the smart packaging with a wireless (13.56 MHz) reader or a smart phone. Assembly of the necessary componentry for smart packaging on plastic or paper foils is limited by the manufacturing costs involved with Si based technologies. Here, the issue of manufacturing cost for smart packaging has been obviated by materials that allow R2R (roll-to-roll) gravure in combination with R2R coating processes to be employed. R2R gravure was used to print the wireless power transmission device, called rectenna (antenna, diode and capacitor), and humidity sensor on poly(ethylene terephtalate) (PET) films while electrochromic signage units were fabricated by R2R coating. The signage units were laminated with the R2R gravure printed rectenna and sensor to complete the prototype smart packaging. PMID:24953037

Fully roll-to-roll gravure printable wireless (13.56 MHz) sensor-signage tags for smart packaging.

PubMed

Kang, Hwiwon; Park, Hyejin; Park, Yongsu; Jung, Minhoon; Kim, Byung Chul; Wallace, Gordon; Cho, Gyoujin

2014-06-23

Integration of sensing capabilities with an interactive signage through wireless communication is enabling the development of smart packaging wherein wireless (13.56 MHz) power transmission is used to interlock the smart packaging with a wireless (13.56 MHz) reader or a smart phone. Assembly of the necessary componentry for smart packaging on plastic or paper foils is limited by the manufacturing costs involved with Si based technologies. Here, the issue of manufacturing cost for smart packaging has been obviated by materials that allow R2R (roll-to-roll) gravure in combination with R2R coating processes to be employed. R2R gravure was used to print the wireless power transmission device, called rectenna (antenna, diode and capacitor), and humidity sensor on poly(ethylene terephtalate) (PET) films while electrochromic signage units were fabricated by R2R coating. The signage units were laminated with the R2R gravure printed rectenna and sensor to complete the prototype smart packaging.

OptoZIF Drive: a 3D printed implant and assembly tool package for neural recording and optical stimulation in freely moving mice

NASA Astrophysics Data System (ADS)

Freedman, David S.; Schroeder, Joseph B.; Telian, Gregory I.; Zhang, Zhengyang; Sunil, Smrithi; Ritt, Jason T.

2016-12-01

Objective. Behavioral neuroscience studies in freely moving rodents require small, light-weight implants to facilitate neural recording and stimulation. Our goal was to develop an integrated package of 3D printed parts and assembly aids for labs to rapidly fabricate, with minimal training, an implant that combines individually positionable microelectrodes, an optical fiber, zero insertion force (ZIF-clip) headstage connection, and secondary recording electrodes, e.g. for electromyography (EMG). Approach. Starting from previous implant designs that position recording electrodes using a control screw, we developed an implant where the main drive body, protective shell, and non-metal components of the microdrives are 3D printed in parallel. We compared alternative shapes and orientations of circuit boards for electrode connection to the headstage, in terms of their size, weight, and ease of wire insertion. We iteratively refined assembly methods, and integrated additional assembly aids into the 3D printed casing. Main results. We demonstrate the effectiveness of the OptoZIF Drive by performing real time optogenetic feedback in behaving mice. A novel feature of the OptoZIF Drive is its vertical circuit board, which facilities direct ZIF-clip connection. This feature requires angled insertion of an optical fiber that still can exit the drive from the center of a ring of recording electrodes. We designed an innovative 2-part protective shell that can be installed during the implant surgery to facilitate making additional connections to the circuit board. We use this feature to show that facial EMG in mice can be used as a control signal to lock stimulation to the animal’s motion, with stable EMG signal over several months. To decrease assembly time, reduce assembly errors, and improve repeatability, we fabricate assembly aids including a drive holder, a drill guide, an implant fixture for microelectode ‘pinning’, and a gold plating fixture. Significance. The expanding capability of optogenetic tools motivates continuing development of small optoelectric devices for stimulation and recording in freely moving mice. The OptoZIF Drive is the first to natively support ZIF-clip connection to recording hardware, which further supports a decrease in implant cross-section. The integrated 3D printed package of drive components and assembly tools facilities implant construction. The easy interfacing and installation of auxiliary electrodes makes the OptoZIF Drive especially attractive for real time feedback stimulation experiments.

KENNEDY SPACE CENTER, FLA. - During a media tour of the Columbia Debris Hangar, photographers focus on part of the cockpit collected from search and recovery efforts in East Texas. About 83,000 pieces of debris from Columbia were shipped to KSC, which represents about 38 percent of the dry weight of Columbia, equaling almost 85,000 pounds. The debris is being packaged for storage in an area of the Vehicle Assembly Building.

NASA Image and Video Library

2003-09-11

KENNEDY SPACE CENTER, FLA. - During a media tour of the Columbia Debris Hangar, photographers focus on part of the cockpit collected from search and recovery efforts in East Texas. About 83,000 pieces of debris from Columbia were shipped to KSC, which represents about 38 percent of the dry weight of Columbia, equaling almost 85,000 pounds. The debris is being packaged for storage in an area of the Vehicle Assembly Building.

KENNEDY SPACE CENTER, FLA. - During a media tour of the Columbia Debris Hangar, a video cameraman records some of the debris collected from search and recovery efforts in East Texas. About 83,000 pieces of debris from Columbia were shipped to KSC, which represents about 38 percent of the dry weight of Columbia, equaling almost 85,000 pounds. The debris is being packaged for storage in an area of the Vehicle Assembly Building.

NASA Image and Video Library

2003-09-11

KENNEDY SPACE CENTER, FLA. - During a media tour of the Columbia Debris Hangar, a video cameraman records some of the debris collected from search and recovery efforts in East Texas. About 83,000 pieces of debris from Columbia were shipped to KSC, which represents about 38 percent of the dry weight of Columbia, equaling almost 85,000 pounds. The debris is being packaged for storage in an area of the Vehicle Assembly Building.

KENNEDY SPACE CENTER, FLA. - During a media tour of the Columbia Debris Hangar, photographers focus on a piece of the debris collected from search and recovery efforts in East Texas. About 83,000 pieces of debris from Columbia were shipped to KSC, which represents about 38 percent of the dry weight of Columbia, equaling almost 85,000 pounds. The debris is being packaged for storage in an area of the Vehicle Assembly Building.

NASA Image and Video Library

2003-09-11

KENNEDY SPACE CENTER, FLA. - During a media tour of the Columbia Debris Hangar, photographers focus on a piece of the debris collected from search and recovery efforts in East Texas. About 83,000 pieces of debris from Columbia were shipped to KSC, which represents about 38 percent of the dry weight of Columbia, equaling almost 85,000 pounds. The debris is being packaged for storage in an area of the Vehicle Assembly Building.

KENNEDY SPACE CENTER, FLA. - During a media tour of the Columbia Debris Hangar, a photographer examines some of the debris collected from search and recovery efforts in East Texas. About 83,000 pieces of debris from Columbia were shipped to KSC, which represents about 38 percent of the dry weight of Columbia, equaling almost 85,000 pounds. The debris is being packaged for storage in an area of the Vehicle Assembly Building.

NASA Image and Video Library

2003-09-11

KENNEDY SPACE CENTER, FLA. - During a media tour of the Columbia Debris Hangar, a photographer examines some of the debris collected from search and recovery efforts in East Texas. About 83,000 pieces of debris from Columbia were shipped to KSC, which represents about 38 percent of the dry weight of Columbia, equaling almost 85,000 pounds. The debris is being packaged for storage in an area of the Vehicle Assembly Building.

Power Extension Package (PEP) system definition extension, orbital service module systems analysis study. Volume 1: Executive summary

NASA Technical Reports Server (NTRS)

1979-01-01

An array deployment assembly, power regulation and control assembly, the necessary interface, and display and control equipment comprise the power extension package (PEP) which is designed to provide increased power and duration, as well as reduce fuel cell cryogen consumption during Spacelab missions. Compatible with all currently defined missions and payloads, PEP imposes minimal weight and volume penalties on sortie missions, and can be installed and removed as needed at the launch site within the normal Orbiter turnaround cycle. The technology on which it is based consists of a modified solar electric propulsion array, standard design regulator and control equipment, and a minimally modified Orbiter design. The requirements from which PEP was derived, and the system and its performance capabilities are described. Features of the recommended project are presented.

A highly miniaturized vacuum package for a trapped ion atomic clock

DOE Office of Scientific and Technical Information (OSTI.GOV)

Schwindt, Peter D. D., E-mail: pschwin@sandia.gov; Jau, Yuan-Yu; Partner, Heather

2016-05-15

We report on the development of a highly miniaturized vacuum package for use in an atomic clock utilizing trapped ytterbium-171 ions. The vacuum package is approximately 1 cm{sup 3} in size and contains a linear quadrupole RF Paul ion trap, miniature neutral Yb sources, and a non-evaporable getter pump. We describe the fabrication process for making the Yb sources and assembling the vacuum package. To prepare the vacuum package for ion trapping, it was evacuated, baked at a high temperature, and then back filled with a helium buffer gas. Once appropriate vacuum conditions were achieved in the package, it wasmore » sealed with a copper pinch-off and was subsequently pumped only by the non-evaporable getter. We demonstrated ion trapping in this vacuum package and the operation of an atomic clock, stabilizing a local oscillator to the 12.6 GHz hyperfine transition of {sup 171}Y b{sup +}. The fractional frequency stability of the clock was measured to be 2 × 10{sup −11}/τ{sup 1/2}.« less

System design package for IBM system one: solar heating and domestic hot water

NASA Technical Reports Server (NTRS)

1977-01-01

This report is a collation of documents and drawings that describe a prototype solar heating and hot water system using air as the collector fluid and a pebble bed for heat storage. The system was designed for installation into a single family dwelling. The description, performance specification, subsystem drawings, verification plan/procedure, and hazard analysis of the system was packaged for evaluation of the system with information sufficient to assemble a similar system.

System Design Package for SIMS Prototype System 3, Solar Heating and Domestic Hot Water

NASA Technical Reports Server (NTRS)

1978-01-01

A collation of documents and drawings are presented that describe a prototype solar heating and hot water system using liquid flat plate collectors and a gas or electric furnace energy subsystem. The system was designed for installation into a single-family dwelling. The description, performance specification, subsystem drawings, verification plan/procedure, and hazard analysis of the system are packaged for evaluation of the system with information sufficient to assemble a similar system.

Heat transfer enhancement for spent nuclear fuel assembly disposal packages using metallic void fillers: A prevention technique for solidification shrinkage-induced interfacial gaps

NASA Astrophysics Data System (ADS)

Park, Yongsoo; McKrell, Thomas J.; Driscoll, Michael J.

2017-06-01

This study considers replacing the externally accessible void spaces inside a disposal package containing a spent nuclear fuel assembly (SNFA) with high heat conducting metal to increase the effective thermal conductivity of the package and simplify the heat transfer mechanism inside the package by reducing it to a conduction dominant problem. The focus of the study is on preventing the gaps adjacent to the walls of the package components, produced by solidification shrinkage of poured liquid metal. We approached the problem by providing a temporary coating layer on the components to avoid direct build-up of thick metal oxides on their surface to promote metallic bonding at the interfaces under a non-inert environment. Laboratory scale experiments without SNFA were performed with Zn coated low carbon steel canisters and Zamak-3 void filler under two different filling temperature conditions - below and above the melting point of Zn (designated BMP and AMP respectively). Gap formation was successfully prevented in both cases while we confirmed an open gap in a control experiment, which used an uncoated canister. Minor growth of Al-Fe intermetallic phases was observed at the canister/filler interface of the sample produced under the BMP condition while their growth was significant and showed irregularly distributed morphology in the sample produced under the AMP condition, which has a potential to mitigate excessive residual stresses caused by shrinkage prevention. A procedure for the full-scale application was specified based on the results.

Insights into Bacteriophage T5 Structure from Analysis of Its Morphogenesis Genes and Protein Components

PubMed Central

Zivanovic, Yvan; Confalonieri, Fabrice; Ponchon, Luc; Lurz, Rudi; Chami, Mohamed; Flayhan, Ali; Renouard, Madalena; Huet, Alexis; Decottignies, Paulette; Davidson, Alan R.; Breyton, Cécile

2014-01-01

Bacteriophage T5 represents a large family of lytic Siphoviridae infecting Gram-negative bacteria. The low-resolution structure of T5 showed the T=13 geometry of the capsid and the unusual trimeric organization of the tail tube, and the assembly pathway of the capsid was established. Although major structural proteins of T5 have been identified in these studies, most of the genes encoding the morphogenesis proteins remained to be identified. Here, we combine a proteomic analysis of T5 particles with a bioinformatic study and electron microscopic immunolocalization to assign function to the genes encoding the structural proteins, the packaging proteins, and other nonstructural components required for T5 assembly. A head maturation protease that likely accounts for the cleavage of the different capsid proteins is identified. Two other proteins involved in capsid maturation add originality to the T5 capsid assembly mechanism: the single head-to-tail joining protein, which closes the T5 capsid after DNA packaging, and the nicking endonuclease responsible for the single-strand interruptions in the T5 genome. We localize most of the tail proteins that were hitherto uncharacterized and provide a detailed description of the tail tip composition. Our findings highlight novel variations of viral assembly strategies and of virion particle architecture. They further recommend T5 for exploring phage structure and assembly and for deciphering conformational rearrangements that accompany DNA transfer from the capsid to the host cytoplasm. PMID:24198424

Accelerated Thermal Cycling and Failure Mechanisms

NASA Technical Reports Server (NTRS)

Ghaffarian, R.

1999-01-01

This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies.

Integrating genome assemblies with MAIA

PubMed Central

Nijkamp, Jurgen; Winterbach, Wynand; van den Broek, Marcel; Daran, Jean-Marc; Reinders, Marcel; de Ridder, Dick

2010-01-01

Motivation: De novo assembly of a eukaryotic genome with next-generation sequencing data is still a challenging task. Over the past few years several assemblers have been developed, often suitable for one specific type of sequencing data. The number of known genomes is expanding rapidly, therefore it becomes possible to use multiple reference genomes for assembly projects. We introduce an assembly integrator that makes use of all available data, i.e. multiple de novo assemblies and mappings against multiple related genomes, by optimizing a weighted combination of criteria. Results: The developed algorithm was applied on the de novo sequencing of the Saccharomyces cerevisiae CEN.PK 113-7D strain. Using Solexa and 454 read data, two de novo and three comparative assemblies were constructed and subsequently integrated, yielding 29 contigs, covering more than 12 Mbp; a drastic improvement compared with the single assemblies. Availability: MAIA is available as a Matlab package and can be downloaded from http://bioinformatics.tudelft.nl Contact: j.f.nijkamp@tudelft.nl PMID:20823304

Assembling Components with Aspect-Oriented Modeling/Specification

DTIC Science & Technology

2003-10-01

2 COM: Component Object Mod 3 EJB: Enterprise Java Beans, h 4 CCM: CORBA® Component M 5 http...nt (GM of the co mbly of ct weav el, http: ttp:// java odel, htFigure 2: Connector as a Containertructure in the form of framework, which...assembles components in EJB3 , CCM4; or a package, using such way as manifest file to JavaBeans5. Also such connector in some cases plays the role as

Thematic mapper flight model preshipment review data package. Volume 4: Appendix. Part B: Scan mirror assembly data

NASA Technical Reports Server (NTRS)

1982-01-01

Data from the thematic mapper scan mirror assembly (SMA) acceptance test are presented. Documentation includes: (1) a list of the acceptance test discrepancies; (2) flight 1 SMA test data book; (3) flight 1 SMA environmental report; (4) the configuration verification index; (5) the flight 1 SMA test failure reports; (6) the flight 1 data tapes log; and (7) the requests for deviation/waivers.

An Investigation of Crystalline Intensity of the Wood of Poplar Clones Grown in Jiangsu Province, China

Treesearch

Bernard R. Parresol; Fuliang Cao

1998-01-01

To establish manmade poplar (Populus spp.) clonal forests for industrial uses, two requirements must be met. First, forests must have high yield;and second, wood fibers must have specific mechanical properties. For example, both fiberboard and plywood require fibers with a certain stiffness and strength. In fact, fiber characteristics are closely related to the fiber?s...

Electrostatic Discharge Training Manual

DTIC Science & Technology

1980-09-01

CAN BE MOLDED INTO FORMED SHAPES. FIBERBOARD, MELAMINE LAMINATES AND OTHER MATERIALS (LAMINATED OR HOMOGENEOUS) CAN BE CONSTRUCTED INTO BOXES AND...COVERED WITH, ESD PROTECTIVE MATERIALS SUCH AS METAL, MIL-B-81705 TYPE II, MIL-P- 82646 (REFERENCES 17, 16), MELAMINE LAMINATES OR OTHER ESD PROTECTIVE...CONDUCTANCE IN AVALANCHE MICROWAVE OSCILLATORS", IEEE TRANSACTIONS ON ELECTRON DEVICES, ED-i5, JUNE 1968. 32. HOLM, R., ELECTRIC CONTACTS HANDBOOK, BERLIN

Effect of fiber surface and mechanical properties on the stiffness and strength of medium-density fiberboard

Treesearch

Leslie H. Groom; Laurence Mott; Stephen M. Shaler; Tom Pesacreta

1999-01-01

The mechanical properties of wood-based composites are dependent upon the properties of the wood components (e.g., wood fibers, wood strands) and the manner in which they are combined. The relationship between fiber mechanical properties and fiber-based composites has been discussed in several publications. This paper will focus primarily on the influence of fiber...

Mechanical properties for a wet-processed fiberboard made from small-diameter lodgepole pine treetop material

Treesearch

John F. Hunt; Karen Supan

2005-01-01

Many federal, state, and private forests, especially in thewestern part of the United States, have an overabundance of fire-prone small-diameter trees, forest thinnings, and residual material. These materials are not being fully utilized as a fiber resource because there are few economical options for their use. This report looks at using treetop material to produce a...

Test report dot 7A type a liquid packaging

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ketusky, E. T.; Brandjes, C.; Benoit, T. J.

This test report documents the performance of Savannah River National Laboratory’s (SRNL’s) U.S. Department of Transportation (DOT) Specification 7A; General Packaging, Type A shielded liquid shipping packaging and compliance with the regulatory requirements of Title 49 of the Code of Federal Regulations (CFR). The primary use of this packaging design is for the transport of radioactive liquids of up to 1.3 liters in an unshielded configuration and up to 113 mL of radioactive liquids in a shielded configuration, with no more than an A2 quantity in either configuration, over public highways and/or commercial aircraft. The contents are liquid radioactive materialsmore » sufficiently shielded and within the activity limits specified in173.435 or 173.433 for A2 (normal form) materials, as well as within the analyzed thermal heat limits. Any contents must be compatibly packaged and must be compatible with the packaging. The basic packaging design is based on the U.S. Department of Energy’s (DOE’s) Model 9979 Type A fissile shipping packaging designed and tested by SRNL. The shielded liquid configuration consists of the outer and inner drums of the 9979 package with additional low density polyethylene (LDPE) dunnage nesting a tungsten shielded cask assembly (WSCA) within the 30-gallon inner drum. The packaging model for the DOT Specification 7A, Type A liquids packaging is HVYTAL.« less

Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages

DOEpatents

Cipolla, Thomas M [Katonah, NY; Colgan, Evan George [Chestnut Ridge, NY; Coteus, Paul W [Yorktown Heights, NY; Hall, Shawn Anthony [Pleasantville, NY; Tian, Shurong [Mount Kisco, NY

2011-12-20

A cooling apparatus, system and like method for an electronic device includes a plurality of heat producing electronic devices affixed to a wiring substrate. A plurality of heat transfer assemblies each include heat spreaders and thermally communicate with the heat producing electronic devices for transferring heat from the heat producing electronic devices to the heat transfer assemblies. The plurality of heat producing electronic devices and respective heat transfer assemblies are positioned on the wiring substrate having the regions overlapping. A heat conduit thermally communicates with the heat transfer assemblies. The heat conduit circulates thermally conductive fluid therethrough in a closed loop for transferring heat to the fluid from the heat transfer assemblies via the heat spreader. A thermally conductive support structure supports the heat conduit and thermally communicates with the heat transfer assemblies via the heat spreader transferring heat to the fluid of the heat conduit from the support structure.

Development of assembly and joint concepts for erectable space structures

NASA Technical Reports Server (NTRS)

Jacquemin, G. G.; Bluck, R. M.; Grotbeck, G. H.; Johnson, R. R.

1980-01-01

The technology associated with the on-orbit assembly of tetrahedral truss platforms erected of graphite epoxy tapered columns is examined. Associated with the assembly process is the design and fabrication of nine member node joints. Two such joints demonstrating somewhat different technology were designed and fabricated. Two methods of automatic assembly using the node designs were investigated, and the time of assembly of tetrahedral truss structures up to 1 square km in size was estimated. The effect of column and node joint packaging on the Space Shuttle cargo bay is examined. A brief discussion is included of operating cost considerations and the selection of energy sources. Consideration was given to the design assembly machines from 5 m to 20 m. The smaller machines, mounted on the Space Shuttle, are deployable and restowable. They provide a means of demonstrating the capabilities of the concept and of erecting small specialized platforms on relatively short notice.

Reflective Packaging

NASA Technical Reports Server (NTRS)

1994-01-01

The aluminized polymer film used in spacecraft as a radiation barrier to protect both astronauts and delicate instruments has led to a number of spinoff applications. Among them are aluminized shipping bags, food cart covers and medical bags. Radiant Technologies purchases component materials and assembles a barrier made of layers of aluminized foil. The packaging reflects outside heat away from the product inside the container. The company is developing new aluminized lines, express mailers, large shipping bags, gel packs and insulated panels for the building industry.

Cryo-Electron Tomography of Marburg Virus Particles and Their Morphogenesis within Infected Cells

PubMed Central

Kolesnikova, Larissa; Welsch, Sonja; Krähling, Verena; Davey, Norman; Parsy, Marie-Laure; Becker, Stephan; Briggs, John A. G.

2011-01-01

Several major human pathogens, including the filoviruses, paramyxoviruses, and rhabdoviruses, package their single-stranded RNA genomes within helical nucleocapsids, which bud through the plasma membrane of the infected cell to release enveloped virions. The virions are often heterogeneous in shape, which makes it difficult to study their structure and assembly mechanisms. We have applied cryo-electron tomography and sub-tomogram averaging methods to derive structures of Marburg virus, a highly pathogenic filovirus, both after release and during assembly within infected cells. The data demonstrate the potential of cryo-electron tomography methods to derive detailed structural information for intermediate steps in biological pathways within intact cells. We describe the location and arrangement of the viral proteins within the virion. We show that the N-terminal domain of the nucleoprotein contains the minimal assembly determinants for a helical nucleocapsid with variable number of proteins per turn. Lobes protruding from alternate interfaces between each nucleoprotein are formed by the C-terminal domain of the nucleoprotein, together with viral proteins VP24 and VP35. Each nucleoprotein packages six RNA bases. The nucleocapsid interacts in an unusual, flexible “Velcro-like” manner with the viral matrix protein VP40. Determination of the structures of assembly intermediates showed that the nucleocapsid has a defined orientation during transport and budding. Together the data show striking architectural homology between the nucleocapsid helix of rhabdoviruses and filoviruses, but unexpected, fundamental differences in the mechanisms by which the nucleocapsids are then assembled together with matrix proteins and initiate membrane envelopment to release infectious virions, suggesting that the viruses have evolved different solutions to these conserved assembly steps. PMID:22110401

76 FR 37887 - Office of Hazardous Materials Safety; Notice of Application for Special Permits

Federal Register 2010, 2011, 2012, 2013, 2014

2011-06-28

... number and be submitted in triplicate. If confirmation of receipt of comments is desired, include a self... specification packaging (cryoengines and assemblies of Maverick Missiles, Gudance Control Sections and Training...

Surface cleanliness of fluid systems, specification for

NASA Technical Reports Server (NTRS)

1995-01-01

This specification establishes surface cleanliness levels, test methods, cleaning and packaging requirements, and protection and inspection procedures for determining surface cleanliness. These surfaces pertain to aerospace parts, components, assemblies, subsystems, and systems in contact with any fluid medium.

49 CFR 572.121 - General description.

Code of Federal Regulations, 2010 CFR

2010-10-01

... Dummy, Beta Version § 572.121 General description. (a) The Hybrid III type 6-year-old dummy is defined... specifications package P/N 127-0000, the titles of which are listed in Table A; (2) Procedures for Assembly...

Ebola virus VP24 interacts with NP to facilitate nucleocapsid assembly and genome packaging.

PubMed

Banadyga, Logan; Hoenen, Thomas; Ambroggio, Xavier; Dunham, Eric; Groseth, Allison; Ebihara, Hideki

2017-08-09

Ebola virus causes devastating hemorrhagic fever outbreaks for which no approved therapeutic exists. The viral nucleocapsid, which is minimally composed of the proteins NP, VP35, and VP24, represents an attractive target for drug development; however, the molecular determinants that govern the interactions and functions of these three proteins are still unknown. Through a series of mutational analyses, in combination with biochemical and bioinformatics approaches, we identified a region on VP24 that was critical for its interaction with NP. Importantly, we demonstrated that the interaction between VP24 and NP was required for both nucleocapsid assembly and genome packaging. Not only does this study underscore the critical role that these proteins play in the viral replication cycle, but it also identifies a key interaction interface on VP24 that may serve as a novel target for antiviral therapeutic intervention.

Preparation and biomedical applications of programmable and multifunctional DNA nanoflowers

PubMed Central

Lv, Yifan; Hu, Rong; Zhu, Guizhi; Zhang, Xiaobing; Mei, Lei; Liu, Qiaoling; Qiu, Liping; Wu, Cuichen; Tan, Weihong

2016-01-01

We describe a comprehensive protocol for the preparation of multifunctional DNA nanostructures termed nanoflowers (NFs), which are self-assembled from long DNA building blocks generated via rolling-circle replication (RCR) of a designed template. NF assembly is driven by liquid crystallization and dense packaging of building blocks, which eliminates the need for conventional Watson-Crick base pairing. As a result of dense DNA packaging, NFs are resistant to nuclease degradation, denaturation or dissociation at extremely low concentrations. By manually changing the template sequence, many different functional moieties including aptamers, bioimaging agents and drug-loading sites could be easily integrated into NF particles, making NFs ideal candidates for a variety of applications in biomedicine. In this protocol, the preparation of multifunctional DNA NFs with highly tunable sizes is described for applications in cell targeting, intracellular imaging and drug delivery. Preparation and characterization of functional DNA NFs takes ~5 d; the following biomedical applications take ~10 d. PMID:26357007

Novel Micro ElectroMechanical Systems (MEMS) Packaging for the Skin of the Satellite

NASA Technical Reports Server (NTRS)

Darrin, M. Ann; Osiander, Robert; Lehtonen, John; Farrar, Dawnielle; Douglas, Donya; Swanson, Ted

2004-01-01

This paper includes a discussion of the novel packaging techniques that are needed to place MEMS based thermal control devices on the skin of various satellites, eliminating the concern associated with potential particulates &om integration and test or the launch environment. Protection of this MEMS based thermal device is achieved using a novel polymer that is both IR transmissive and electrically conductive. This polymer was originally developed and qualified for space flight application by NASA at the Langley Research Center. The polymer material, commercially known as CPI, is coated with a thin layer of ITO and sandwiched between two window-like frames. The packaging of the MEMS based radiator assembly offers the benefits of micro-scale devices in a chip on board fashion, with the level of protection generally found in packaged parts.

Integrated circuit package with lead structure and method of preparing the same

NASA Technical Reports Server (NTRS)

Kennedy, B. W. (Inventor)

1973-01-01

A beam-lead integrated circuit package assembly including a beam-lead integrated circuit chip, a lead frame array bonded to projecting fingers of the chip, a rubber potting compound disposed around the chip, and an encapsulating molded plastic is described. The lead frame array is prepared by photographically printing a lead pattern on a base metal sheet, selectively etching to remove metal between leads, and plating with gold. Joining of the chip to the lead frame array is carried out by thermocompression bonding of mating goldplated surfaces. A small amount of silicone rubber is then applied to cover the chip and bonded joints, and the package is encapsulated with epoxy resin, applied by molding.

JTEC Panel report on electronic manufacturing and packaging in Japan

NASA Technical Reports Server (NTRS)

Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John; Meieran, Gene; Pecht, Michael; Peeples, John; Tummala, Rao; Dehaemer, Michael J.; Holdridge, Geoff (Editor); Gamota, George

1995-01-01

This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies.

Stresses in Solder Joints of Electronic Packages

DTIC Science & Technology

1991-12-31

soldering process. The device is soldered to the circuit board at a temperature of +185zc and this tempature is assumed to propagate only to the lead wire...tri-material assembly, showing the notation used hereafter, is shown in Figure 7. The Suhir model is applicable to assemblies with continuous...therefore the radii of curvature of layers are all equal. Using equilibrium equation (7) and moment-curvature equation (9) yields ()D D Xp (x) D T() -m 3 x

Mini-Brayton heat source assembly design study. Volume 1: Space shuttle mission. [feasibility of Brayton isotope power system design

NASA Technical Reports Server (NTRS)

1973-01-01

Conceptual design definitions of a heat source assembly for use in nominal 500 watt electrical (W(e)) 1200 W(e)and 2000 W(e) mini-Brayton isotope power systems are reported. The HSA is an independent package which maintains thermal and nuclear control of an isotope fueled heat source and transfers the thermal energy to a Brayton rotating unit turbine-alternator-compressor power conversion unit.

Genome puzzle master (GPM): an integrated pipeline for building and editing pseudomolecules from fragmented sequences.

PubMed

Zhang, Jianwei; Kudrna, Dave; Mu, Ting; Li, Weiming; Copetti, Dario; Yu, Yeisoo; Goicoechea, Jose Luis; Lei, Yang; Wing, Rod A

2016-10-15

Next generation sequencing technologies have revolutionized our ability to rapidly and affordably generate vast quantities of sequence data. Once generated, raw sequences are assembled into contigs or scaffolds. However, these assemblies are mostly fragmented and inaccurate at the whole genome scale, largely due to the inability to integrate additional informative datasets (e.g. physical, optical and genetic maps). To address this problem, we developed a semi-automated software tool-Genome Puzzle Master (GPM)-that enables the integration of additional genomic signposts to edit and build 'new-gen-assemblies' that result in high-quality 'annotation-ready' pseudomolecules. With GPM, loaded datasets can be connected to each other via their logical relationships which accomplishes tasks to 'group,' 'merge,' 'order and orient' sequences in a draft assembly. Manual editing can also be performed with a user-friendly graphical interface. Final pseudomolecules reflect a user's total data package and are available for long-term project management. GPM is a web-based pipeline and an important part of a Laboratory Information Management System (LIMS) which can be easily deployed on local servers for any genome research laboratory. The GPM (with LIMS) package is available at https://github.com/Jianwei-Zhang/LIMS CONTACTS: jzhang@mail.hzau.edu.cn or rwing@mail.arizona.eduSupplementary information: Supplementary data are available at Bioinformatics online. © The Author 2016. Published by Oxford University Press.

Primary properties of MDF using thermomechanical pulp made from oxalic acid pretreated rice straw particles

Treesearch

Xianjun Li; Yiqiang Wu; Zhiyong Cai; Jerrold E. Winandy

2013-01-01

The main objective of this study is to evaluate the effect the oxalic acid (OA) and steam pretreatment on the primary properties of rice straw medium-density fiberboard (MDF). The results show the IB strength increased about 9.6% and 13.4% for steam-treated MDF (PC) and OA-treated MDF compared with raw control panels, while OA pretreatment has a slight negative effect...

49 CFR 173.194 - Gas identification sets.

Code of Federal Regulations, 2014 CFR

2014-10-01

... 4A, 4B or 4N metal boxes or 4C1, 4C2, 4D or 4F wooden boxes. Not more than 100 mL (3.4 fluid ounces) or 100 g (3.5 ounces) of poisonous materials may be packed in one outer box. (2) If the poisonous... fiberboard box. No more than four boxes, well-cushioned, may in turn be placed in a steel cylinder. The...

49 CFR 173.194 - Gas identification sets.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 4A, 4B or 4N metal boxes or 4C1, 4C2, 4D or 4F wooden boxes. Not more than 100 mL (3.4 fluid ounces) or 100 g (3.5 ounces) of poisonous materials may be packed in one outer box. (2) If the poisonous... fiberboard box. No more than four boxes, well-cushioned, may in turn be placed in a steel cylinder. The...

49 CFR 173.194 - Gas identification sets.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 4C1, 4C2, 4D or 4F wooden boxes. Not more than 100 mL (3.4 fluid ounces) or 100 g (3.5 ounces) of poisonous materials may be packed in one outer wooden box. (2) If the poisonous material does not exceed 5 m... fiberboard box. No more than four boxes, well-cushioned, may in turn be placed in a steel cylinder. The...

49 CFR 173.194 - Gas identification sets.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 4C1, 4C2, 4D or 4F wooden boxes. Not more than 100 mL (3.4 fluid ounces) or 100 g (3.5 ounces) of poisonous materials may be packed in one outer wooden box. (2) If the poisonous material does not exceed 5 m... fiberboard box. No more than four boxes, well-cushioned, may in turn be placed in a steel cylinder. The...

49 CFR 173.194 - Gas identification sets.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 4C1, 4C2, 4D or 4F wooden boxes. Not more than 100 mL (3.4 fluid ounces) or 100 g (3.5 ounces) of poisonous materials may be packed in one outer wooden box. (2) If the poisonous material does not exceed 5 m... fiberboard box. No more than four boxes, well-cushioned, may in turn be placed in a steel cylinder. The...

 Thermal Insulation System Made of Wood and Paper for Use in Residential Construction

Treesearch

Zoltán Pásztory; Tibor Horváth; Samuel V. Glass; Samuel L. Zelinka

2015-01-01

This article introduces an insulation system that takes advantage of the low thermal conductivity of still air and is made of wood and paper. The insulation, called the Mirrorpanel, is constructed as a panel of closely spaced layers of coated paper and held together in a frame of wood or fiberboard. Panels have been fabricated and tested at the laboratory scale, whole...

Effect of refining pressure and resin viscosity and resin flow, distribution, and penetration of MDF fibers

Treesearch

Leslie Groom; Chi-Leung So; Thomas Elder; Thomas Pesacreta; Tim Rials

2004-01-01

The growth of medium density fiberboard (MDF) in North America has experienced robust growth over the past 20 years and is projected to increase by another 60 percent in the next 8 years. compounding this increase in demand for MDF is a raw material that is ever-increasingly lower in density and higher in juvenility. the dichotomous concept of increased demand witha...

18. BATHROOM INTERIOR SHOWING OPEN DOOR TO SOUTH BEDROOM AT ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

18. BATHROOM INTERIOR SHOWING OPEN DOOR TO SOUTH BEDROOM AT PHOTO CENTER, TOILET AT EXTREME PHOTO RIGHT BOTTOM, OPEN DOOR TO MEDICINE CABINET AT PHOTO RIGHT. A WALLPAPER WAINSCOT COVERS THE LOWER PORTION OF THE ORIGINAL FIBERBOARD WALL COVERING. THE FLOOR IS LINOLEUM. VIEW TO SOUTHEAST. - Big Creek Hydroelectric System, Big Creek Town, Operator House, Orchard Avenue south of Huntington Lake Road, Big Creek, Fresno County, CA

Accidental mold/termite testing of high density fiberboard (HDF) treated with borates and N’N-naphthaloylhydroxylamine (NHA)

Treesearch

S. Nami Kartal; Harold H. Burdsall; Frederick Green

2003-01-01

High density fibreboard (HDF) was made from beech and pine furnish (50:50) and treated with boric acid (0.1-3%), borax (0.1-3%) or N'-N-(1,8- naphthalyl) hydroxylamine (NHA) (0.1-1%) prior to gluing with urea formaldehyde (UF) resin in order to determine resistance to Eastern subterranean termites ( Reticulitermes flavipes Kollar), the most economically important...

Structure and function of the small terminase component of the DNA packaging machine in T4-like bacteriophages

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sun, Siyang; Gao, Song; Kondabagil, Kiran

2012-04-04

Tailed DNA bacteriophages assemble empty procapsids that are subsequently filled with the viral genome by means of a DNA packaging machine situated at a special fivefold vertex. The packaging machine consists of a 'small terminase' and a 'large terminase' component. One of the functions of the small terminase is to initiate packaging of the viral genome, whereas the large terminase is responsible for the ATP-powered translocation of DNA. The small terminase subunit has three domains, an N-terminal DNA-binding domain, a central oligomerization domain, and a C-terminal domain for interacting with the large terminase. Here we report structures of the centralmore » domain in two different oligomerization states for a small terminase from the T4 family of phages. In addition, we report biochemical studies that establish the function for each of the small terminase domains. On the basis of the structural and biochemical information, we propose a model for DNA packaging initiation.« less

Experimental Approaches to Study Genome Packaging of Influenza A Viruses.

PubMed

Isel, Catherine; Munier, Sandie; Naffakh, Nadia

2016-08-09

The genome of influenza A viruses (IAV) consists of eight single-stranded negative sense viral RNAs (vRNAs) encapsidated into viral ribonucleoproteins (vRNPs). It is now well established that genome packaging (i.e., the incorporation of a set of eight distinct vRNPs into budding viral particles), follows a specific pathway guided by segment-specific cis-acting packaging signals on each vRNA. However, the precise nature and function of the packaging signals, and the mechanisms underlying the assembly of vRNPs into sub-bundles in the cytoplasm and their selective packaging at the viral budding site, remain largely unknown. Here, we review the diverse and complementary methods currently being used to elucidate these aspects of the viral cycle. They range from conventional and competitive reverse genetics, single molecule imaging of vRNPs by fluorescence in situ hybridization (FISH) and high-resolution electron microscopy and tomography of budding viral particles, to solely in vitro approaches to investigate vRNA-vRNA interactions at the molecular level.

Dissection of specific binding of HIV-1 Gag to the 'packaging signal' in viral RNA.

PubMed

Comas-Garcia, Mauricio; Datta, Siddhartha Ak; Baker, Laura; Varma, Rajat; Gudla, Prabhakar R; Rein, Alan

2017-07-20

Selective packaging of HIV-1 genomic RNA (gRNA) requires the presence of a cis -acting RNA element called the 'packaging signal' (Ψ). However, the mechanism by which Ψ promotes selective packaging of the gRNA is not well understood. We used fluorescence correlation spectroscopy and quenching data to monitor the binding of recombinant HIV-1 Gag protein to Cy5-tagged 190-base RNAs. At physiological ionic strength, Gag binds with very similar, nanomolar affinities to both Ψ-containing and control RNAs. We challenged these interactions by adding excess competing tRNA; introducing mutations in Gag; or raising the ionic strength. These modifications all revealed high specificity for Ψ. This specificity is evidently obscured in physiological salt by non-specific, predominantly electrostatic interactions. This nonspecific activity was attenuated by mutations in the MA, CA, and NC domains, including CA mutations disrupting Gag-Gag interaction. We propose that gRNA is selectively packaged because binding to Ψ nucleates virion assembly with particular efficiency.

Proposed Ancestors of Phage Nucleic Acid Packaging Motors (and Cells)

PubMed Central

Serwer, Philip

2011-01-01

I present a hypothesis that begins with the proposal that abiotic ancestors of phage RNA and DNA packaging systems (and cells) include mobile shells with an internal, molecule-transporting cavity. The foundations of this hypothesis include the conjecture that current nucleic acid packaging systems have imprints from abiotic ancestors. The abiotic shells (1) initially imbibe and later also bind and transport organic molecules, thereby providing a means for producing molecular interactions that are links in the chain of events that produces ancestors to the first molecules that are both information carrying and enzymatically active, and (2) are subsequently scaffolds on which proteins assemble to form ancestors common to both shells of viral capsids and cell membranes. Emergence of cells occurs via aggregation and merger of shells and internal contents. The hypothesis continues by using proposed imprints of abiotic and biotic ancestors to deduce an ancestral thermal ratchet-based DNA packaging motor that subsequently evolves to integrate a DNA packaging ATPase that provides a power stroke. PMID:21994778

ATP Depletion Blocks Herpes Simplex Virus DNA Packaging and Capsid Maturation

PubMed Central

Dasgupta, Anindya; Wilson, Duncan W.

1999-01-01

During herpes simplex virus (HSV) assembly, immature procapsids must expel their internal scaffold proteins, transform their outer shell to form mature polyhedrons, and become packaged with the viral double-stranded (ds) DNA genome. A large number of virally encoded proteins are required for successful completion of these events, but their molecular roles are poorly understood. By analogy with the dsDNA bacteriophage we reasoned that HSV DNA packaging might be an ATP-requiring process and tested this hypothesis by adding an ATP depletion cocktail to cells accumulating unpackaged procapsids due to the presence of a temperature-sensitive lesion in the HSV maturational protease UL26. Following return to permissive temperature, HSV capsids were found to be unable to package DNA, suggesting that this process is indeed ATP dependent. Surprisingly, however, the display of epitopes indicative of capsid maturation was also inhibited. We conclude that either formation of these epitopes directly requires ATP or capsid maturation is normally arrested by a proofreading mechanism until DNA packaging has been successfully completed. PMID:9971781

Strain Measurements within Fibreboard. Part III: Analyzing the Process Zone at the Crack Tip of Medium Density Fiberboards (MDF) Double Cantilever I-Beam Specimens

PubMed Central

Rathke, Jörn; Müller, Ulrich; Konnerth, Johannes; Sinn, Gerhard

2012-01-01

This paper is the third part of a study dealing with the mechanical and fracture mechanical characterization of Medium Density Fiberboards (MDF). In the first part, an analysis of internal bond strength testing was performed and in the second part MDF was analyzed by means of the wedge splitting experiment; this part deals with the double cantilever I beam test, which is designed for measuring the fracture energy as well as stress intensity factor in Mode I. For a comparison of isotropic and orthotropic material behavior, finite element modeling was performed. In addition to the calculation of fracture energy the stress intensity factor was analyzed by means of finite elements simulation and calculation. In order to analyze strain deformations and the process zone, electronic speckle pattern interferometry measurements were performed. The results revealed an elongated process zone and lower results for KIC if compared to the wedge splitting experiment. The Gf numbers are higher compared to the wedge splitting results and can be explained by the thicker process zone formed during the crack propagation. The process zone width on its part is influenced by the stiff reinforcements and yields a similar crack surface as with the internal bond test.

Concept report: Experimental vector magnetograph (EXVM) operational configuration balloon flight assembly

NASA Technical Reports Server (NTRS)

1993-01-01

The observational limitations of earth bound solar studies has prompted a great deal of interest in recent months in being able to gain new scientific perspectives through, what should prove to be, relatively low cost flight of the magnetograph system. The ground work done by TBE for the solar balloon missions (originally planned for SOUP and GRID) as well as the rather advanced state of assembly of the EXVM has allowed the quick formulation of a mission concept for the 30 cm system currently being assembled. The flight system operational configuration will be discussed as it is proposed for short duration flight (on the order of one day) over the continental United States. Balloon hardware design requirements used in formulation of the concept are those set by the National Science Balloon Facility (NSBF), the support agency under NASA contract for flight services. The concept assumes that the flight hardware assembly would come together from three development sources: the scientific investigator package, the integration contractor package, and the NSBF support system. The majority of these three separate packages can be independently developed; however, the computer control interfaces and telemetry links would require extensive preplanning and coordination. A special section of this study deals with definition of a dedicated telemetry link to be provided by the integration contractor for video image data for pointing system performance verification. In this study the approach has been to capitalize to the maximum extent possible on existing hardware and system design. This is the most prudent step that can be taken to reduce eventual program cost for long duration flights. By fielding the existing EXVM as quickly as possible, experience could be gained from several short duration flight tests before it became necessary to commit to major upgrades for long duration flights of this system or of the larger 60 cm version being considered for eventual development.

DNA Packaging Specificity of Bacteriophage N15 with an Excursion into the Genetics of a Cohesive End Mismatch

PubMed Central

Feiss, Michael; Young Min, Jea; Sultana, Sawsan; Patel, Priyal; Sippy, Jean

2015-01-01

During DNA replication by the λ-like bacteriophages, immature concatemeric DNA is produced by rolling circle replication. The concatemers are processed into mature chromosomes with cohesive ends, and packaged into prohead shells, during virion assembly. Cohesive ends are generated by the viral enzyme terminase, which introduces staggered nicks at cos, an approx. 200 bp-long sequence containing subsites cosQ, cosN and cosB. Interactions of cos subsites of immature concatemeric DNA with terminase orchestrate DNA processing and packaging. To initiate DNA packaging, terminase interacts with cosB and nicks cosN. The cohesive ends of N15 DNA differ from those of λ at 2/12 positions. Genetic experiments show that phages with chromosomes containing mismatched cohesive ends are functional. In at least some infections, the cohesive end mismatch persists through cyclization and replication, so that progeny phages of both allelic types are produced in the infected cell. N15 possesses an asymmetric packaging specificity: N15 DNA is not packaged by phages λ or 21, but surprisingly, N15-specific terminase packages λ DNA. Implications for genetic interactions among λ-like bacteriophages are discussed. PMID:26633301

Rapid qualification of CSP assemblies by increase of ramp rates and cycling temperature ranges

NASA Technical Reports Server (NTRS)

Ghaffarian, R.; Kim, N.; Rose, D.; Hunter, B.; Devitt, K.; Long, T.

2001-01-01

Team members representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.

Chromatin assembly: Journey to the CENter of the chromosome

PubMed Central

Chen, Chin-Chi

2016-01-01

All eukaryotic genomes are packaged into basic units of DNA wrapped around histone proteins called nucleosomes. The ability of histones to specify a variety of epigenetic states at defined chromatin domains is essential for cell survival. The most distinctive type of chromatin is found at centromeres, which are marked by the centromere-specific histone H3 variant CENP-A. Many of the factors that regulate CENP-A chromatin have been identified; however, our understanding of the mechanisms of centromeric nucleosome assembly, maintenance, and reorganization remains limited. This review discusses recent insights into these processes and draws parallels between centromeric and noncentromeric chromatin assembly mechanisms. PMID:27377247

Recognition of the murine coronavirus genomic RNA packaging signal depends on the second RNA-binding domain of the nucleocapsid protein.

PubMed

Kuo, Lili; Koetzner, Cheri A; Hurst, Kelley R; Masters, Paul S

2014-04-01

The coronavirus nucleocapsid (N) protein forms a helical ribonucleoprotein with the viral positive-strand RNA genome and binds to the principal constituent of the virion envelope, the membrane (M) protein, to facilitate assembly and budding. Besides these structural roles, N protein associates with a component of the replicase-transcriptase complex, nonstructural protein 3, at a critical early stage of infection. N protein has also been proposed to participate in the replication and selective packaging of genomic RNA and the transcription and translation of subgenomic mRNA. Coronavirus N proteins contain two structurally distinct RNA-binding domains, an unusual characteristic among RNA viruses. To probe the functions of these domains in the N protein of the model coronavirus mouse hepatitis virus (MHV), we constructed mutants in which each RNA-binding domain was replaced by its counterpart from the N protein of severe acute respiratory syndrome coronavirus (SARS-CoV). Mapping of revertants of the resulting chimeric viruses provided evidence for extensive intramolecular interactions between the two RNA-binding domains. Through analysis of viral RNA that was packaged into virions we identified the second of the two RNA-binding domains as a principal determinant of MHV packaging signal recognition. As expected, the interaction of N protein with M protein was not affected in either of the chimeric viruses. Moreover, the SARS-CoV N substitutions did not alter the fidelity of leader-body junction formation during subgenomic mRNA synthesis. These results more clearly delineate the functions of N protein and establish a basis for further exploration of the mechanism of genomic RNA packaging. This work describes the interactions of the two RNA-binding domains of the nucleocapsid protein of a model coronavirus, mouse hepatitis virus. The main finding is that the second of the two domains plays an essential role in recognizing the RNA structure that allows the selective packaging of genomic RNA into assembled virions.

MOEMS industrial infrastructure

NASA Astrophysics Data System (ADS)

van Heeren, Henne; Paschalidou, Lia

2004-08-01

Forecasters and analysts predict the market size for microsystems and microtechnologies to be in the order of 68 billion by the year 2005 (NEXUS Market Study 2002). In essence, the market potential is likely to double in size from its 38 billion status in 2002. According to InStat/MDR the market for MOEMS (Micro Optical Electro Mechanical Systems) in optical communication will be over $1.8 billion in 2006 and WTC states that the market for non telecom MOEMS will be even larger. Underpinning this staggering growth will be an infrastructure of design houses, foundries, package/assembly providers and equipment suppliers to cater for the demand in design, prototyping, and (mass-) production. This infrastructure is needed to provide an efficient route to commercialisation. Foundries, which provide the infrastructure to prototype, fabricate and mass-produce the designs emanating from the design houses and other companies. The reason for the customers to rely on foundries can be diverse: ranging from pure economical reasons (investments, cost-price) to technical (availability of required technology). The desire to have a second source of supply can also be a reason for outsourcing. Foundries aim to achieve economies of scale by combining several customer orders into volume production. Volumes are necessary, not only to achieve the required competitive cost prices, but also to attain the necessary technical competence level. Some products that serve very large markets can reach such high production volumes that they are able to sustain dedicated factories. In such cases, captive supply is possible, although outsourcing is still an option, as can be seen in the magnetic head markets, where captive and non-captive suppliers operate alongside each other. The most striking examples are: inkjet heads (>435 million heads per year) and magnetic heads (>1.5 billion heads per year). Also pressure sensor and accelerometer producers can afford their own facilities to produce the numbers they want (several millions per year). The crossover point where building a dedicated facility becomes a realistic option, can differ very much depending on technology complexity, numbers and market value. Also history plays a role, companies with past experience in the production of a product and the necessary facilities and equipment will tend to achieve captive production. Companies not having a microtechnology history will tend to outsource, offering business opportunities for foundries. The number of foundries shows a steady growth over the years. The total availability of foundries, however, and their flexibility will, undoubtedly, rely on market potential and its size. Unlike design houses, foundries need to realise a substantial return on the "large" investments they make in terms of capital and infrastructure. These returns will be maximised through mass-produced products aimed at "killer" applications (accelerometers are only one example). The existence of professional suppliers of MOEMS packaging and assembly is an essential element in the supply chain and critical for the manufacturing and commercialisation of MOEMS products. In addition, the incorporation of packaging and assembly techniques at the front-end of the engineering cycle will pay back in terms of financial savings and shorter timescales to market. Packaging and assembly for MOEMS are, in general, more costly than their equivalents for standard integrated circuits. This is, primarily, due to the diversity of the interconnections (which are multi-functional and may incorporate: electrical, optical, fluidic etc). In addition, the high levels of accuracy and the potential sensitivity of the devices to mechanical and external influences play a major role in the cost aspects of the final MNT product. This article will give an overview of the package/assembly providers and foundry business models and analyse their contribution to the MOEMS supply chain illustrated with some typical examples. As we believe that commercial services are the main basis for the breakthrough of MOEMS technology, we only cover commercial package/assembly and foundry services and not the ones offered by universities and research labs.

Cryo-electron Microscopy Reconstruction and Stability Studies of the Wild Type and the R432A Variant of Adeno-associated Virus Type 2 Reveal that Capsid Structural Stability Is a Major Factor in Genome Packaging

PubMed Central

Drouin, Lauren M.; Lins, Bridget; Janssen, Maria; Bennett, Antonette; Chipman, Paul; McKenna, Robert; Chen, Weijun; Muzyczka, Nicholas; Cardone, Giovanni

2016-01-01

ABSTRACT The adeno-associated viruses (AAV) are promising therapeutic gene delivery vectors and better understanding of their capsid assembly and genome packaging mechanism is needed for improved vector production. Empty AAV capsids assemble in the nucleus prior to genome packaging by virally encoded Rep proteins. To elucidate the capsid determinants of this process, structural differences between wild-type (wt) AAV2 and a packaging deficient variant, AAV2-R432A, were examined using cryo-electron microscopy and three-dimensional image reconstruction both at an ∼5.0-Å resolution (medium) and also at 3.8- and 3.7-Å resolutions (high), respectively. The high resolution structures showed that removal of the arginine side chain in AAV2-R432A eliminated hydrogen bonding interactions, resulting in altered intramolecular and intermolecular interactions propagated from under the 3-fold axis toward the 5-fold channel. Consistent with these observations, differential scanning calorimetry showed an ∼10°C decrease in thermal stability for AAV2-R432A compared to wt-AAV2. In addition, the medium resolution structures revealed differences in the juxtaposition of the less ordered, N-terminal region of their capsid proteins, VP1/2/3. A structural rearrangement in AAV2-R432A repositioned the βA strand region under the icosahedral 2-fold axis rather than antiparallel to the βB strand, eliminating many intramolecular interactions. Thus, a single amino acid substitution can significantly alter the AAV capsid integrity to the extent of reducing its stability and possibly rendering it unable to tolerate the stress of genome packaging. Furthermore, the data show that the 2-, 3-, and 5-fold regions of the capsid contributed to producing the packaging defect and highlight a tight connection between the entire capsid in maintaining packaging efficiency. IMPORTANCE The mechanism of AAV genome packaging is still poorly understood, particularly with respect to the capsid determinants of the required capsid-Rep interaction. Understanding this mechanism may aid in the improvement of AAV packaging efficiency, which is currently ∼1:10 (10%) genome packaged to empty capsid in vector preparations. This report identifies regions of the AAV capsid that play roles in genome packaging and that may be important for Rep recognition. It also demonstrates the need to maintain capsid stability for the success of this process. This information is important for efforts to improve AAV genome packaging and will also inform the engineering of AAV capsid variants for improved tropism, specific tissue targeting, and host antibody escape by defining amino acids that cannot be altered without detriment to infectious vector production. PMID:27440903

Reliability assessment of ceramic column grid array (CCGA717) interconnect packages under extreme temperatures for space applications (-185°C to +125°C)

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2010-02-01

Ceramic Column Grid Array packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performance, compatibility with standard surface-mount packaging assembly processes, etc. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, payload electronics, etc. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short and long-term space missions. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide have been assembled, inspected non-destructively and subsequently subjected to extreme temperature thermal cycling to assess the reliability for future deep space, short and long-term, extreme temperature missions. In this investigation, the employed temperature range covers from -185°C to +125°C extreme thermal environments. The test hardware consists of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The CCGA717 package is 33 mm × 33 mm with a 27×27 array of 80%/20% Pb/Sn columns on a 1.27 mm pitch. The resistance of daisy-chained, CCGA interconnects were continuously monitored as a function of thermal cycling. Electrical resistance measurements as a function of thermal cycling are reported and the tests to date have shown significant change in daisy chain resistance as a function of thermal cycling. The change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. This paper will describe the experimental test results of CCGA testing under wide extreme temperatures. Standard Weibull analysis tools were used to extract the Weibull parameters to understand the CCGA failures. Optical inspection results clearly indicate that the solder joints of columns with the board and the ceramic package have failed as a function of thermal cycling. The first failure was observed at 137th thermal cycle and 63.2% failures of daisy chains have occurred at about 664 thermal cycles. The shape parameter extracted from Weibull plot was about 1.47 which indicates the failures were related to failures occurred during the flat region or useful life region of standard bath tub curve. Based on this experimental test data one can use the CCGAs for the temperature range studied for ~100 thermal cycles (ΔT = 310°C, 5oC/minute, and 15 minutes dwell) with high degree of confidence for high reliability space and other applications.

Structure, Assembly, and DNA Packaging of the Bacteriophage T4 Head

PubMed Central

Black, Lindsay W.; Rao, Venigalla B.

2014-01-01

The bacteriophage T4 head is an elongated icosahedron packed with 172 kb of linear double-stranded DNA and numerous proteins. The capsid is built from three essential proteins: gp23*, which forms the hexagonal capsid lattice; gp24*, which forms pentamers at 11 of the 12 vertices; and gp20, which forms the unique dodecameric portal vertex through which DNA enters during packaging and exits during infection. Intensive work over more than half a century has led to a deep understanding of the phage T4 head. The atomic structure of gp24 has been determined. A structural model built for gp23 using its similarity to gp24 showed that the phage T4 major capsid protein has the same fold as numerous other icosahedral bacteriophages. However, phage T4 displays an unusual membrane and portal initiated assembly of a shape determining self-sufficient scaffolding core. Folding of gp23 requires the assistance of two chaperones, the Escherichia coli chaperone GroEL acting with the phage-coded gp23-specific cochaperone, gp31. The capsid also contains two nonessential outer capsid proteins, Hoc and Soc, which decorate the capsid surface. Through binding to adjacent gp23 subunits, Soc reinforces the capsid structure. Hoc and Soc have been used extensively in bipartite peptide display libraries and to display pathogen antigens, including those from human immunodeficiency virus (HIV), Neisseria meningitides, Bacillus anthracis, and foot and mouth disease virus. The structure of Ip1*, one of a number of multiple (>100) copy proteins packed and injected with DNA from the full head, shows it to be an inhibitor of one specific restriction endonuclease specifically targeting glycosylated hydroxymethyl cytosine DNA. Extensive mutagenesis, combined with atomic structures of the DNA packaging/terminase proteins gp16 and gp17, elucidated the ATPase and nuclease functional motifs involved in DNA translocation and headful DNA cutting. The cryoelectron microscopy structure of the T4 packaging machine showed a pentameric motor assembled with gp17 subunits on the portal vertex. Single molecule optical tweezers and fluorescence studies showed that the T4 motor packages DNA at the highest rate known and can package multiple segments. Förster resonance energy transfer–fluorescence correlation spectroscopy studies indicate that DNA gets compressed in the stalled motor and that the terminase-to-portal distance changes during translocation. Current evidence suggests a linear two-component (large terminase plus portal) translocation motor in which electrostatic forces generated by ATP hydrolysis drive DNA translocation by alternating the motor between tensed and relaxed states. PMID:22420853

Packaging printed circuit boards: A production application of interactive graphics

NASA Technical Reports Server (NTRS)

Perrill, W. A.

1975-01-01

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

Packaging Technology for SiC High Temperature Circuits Operable up to 500 Degrees Centigrade

NASA Technical Reports Server (NTRS)

Chen, Lian-Yu

2002-01-01

New high temperature low power 8-pin packages have been fabricated using commercial fabrication service. These packages are made of aluminum nitride and 96 percent alumina with Au metallization. The new design of these packages provides the chips inside with EM shielding. Wirebond geometry control has been achieved for precise mechanical tests. Au wirebond samples with 45 degree heel-angle have been tested using wireloop test module. The geometry control improves the consistency of measurement of the wireloop breaking point.Also reported on is a parametric study of the thermomechanical reliability of a Au thick-film based SiC die-attach assembly using nonlinear finite element analysis (FEA) was conducted to optimize the die-attach thermo-mechanical performance for operation at temperatures from room temperature to 500 degrees Centigrade. This parametric study centered on material selection, structure design and process control.

Clonality: an R package for testing clonal relatedness of two tumors from the same patient based on their genomic profiles.

PubMed

Ostrovnaya, Irina; Seshan, Venkatraman E; Olshen, Adam B; Begg, Colin B

2011-06-15

If a cancer patient develops multiple tumors, it is sometimes impossible to determine whether these tumors are independent or clonal based solely on pathological characteristics. Investigators have studied how to improve this diagnostic challenge by comparing the presence of loss of heterozygosity (LOH) at selected genetic locations of tumor samples, or by comparing genomewide copy number array profiles. We have previously developed statistical methodology to compare such genomic profiles for an evidence of clonality. We assembled the software for these tests in a new R package called 'Clonality'. For LOH profiles, the package contains significance tests. The analysis of copy number profiles includes a likelihood ratio statistic and reference distribution, as well as an option to produce various plots that summarize the results. Bioconductor (http://bioconductor.org/packages/release/bioc/html/Clonality.html) and http://www.mskcc.org/mskcc/html/13287.cfm.

Bacterial contamination monitor

NASA Technical Reports Server (NTRS)

Rich, E.; Macleod, N. H.

1973-01-01

Economical, simple, and fast method uses apparatus which detects bacteria by photography. Apparatus contains camera, film assembly, calibrated light bulb, opaque plastic plate with built-in reflecting surface and transparent window section, opaque slide, plate with chemical packages, and cover containing roller attached to handle.

Use of tear ring permits repair of sealed module circuitry

NASA Technical Reports Server (NTRS)

1965-01-01

Improved packaging technique for modular electronic circuitry utilizes a tear ring which may be removed for repair and resealed. The tear ring is put over the container and header to which the electronic circuit assembly has been attached.

Novel high-density packaging of solid state diode pumped eye-safe laser for LIBS

NASA Astrophysics Data System (ADS)

Bares, Kim; Torgerson, Justin; McNeil, Laine; Maine, Patrick; Patterson, Steve

2018-02-01

Laser-Induced Breakdown Spectroscopy (LIBS) has proven to be a useful research tool for material analysis for decades. However, because of the amount of energy required in a few nanosecond pulse to generate a stable and reliable LIBS signal, the lasers are often large and inefficient, relegating their implementation to research facilities, factory floors, and assembly lines. Small portable LIBS systems are now possible without having to compromise on energy needs by leveraging off of advances in high-density packaging of electronics, opto-mechanics, and highly efficient laser resonator architecture. This paper explores the integration of these techniques to achieve a mJ class eye-safe LIBS laser source, while retaining a small, light-weight package suitable for handheld systems.

BACCardI--a tool for the validation of genomic assemblies, assisting genome finishing and intergenome comparison.

PubMed

Bartels, Daniela; Kespohl, Sebastian; Albaum, Stefan; Drüke, Tanja; Goesmann, Alexander; Herold, Julia; Kaiser, Olaf; Pühler, Alfred; Pfeiffer, Friedhelm; Raddatz, Günter; Stoye, Jens; Meyer, Folker; Schuster, Stephan C

2005-04-01

We provide the graphical tool BACCardI for the construction of virtual clone maps from standard assembler output files or BLAST based sequence comparisons. This new tool has been applied to numerous genome projects to solve various problems including (a) validation of whole genome shotgun assemblies, (b) support for contig ordering in the finishing phase of a genome project, and (c) intergenome comparison between related strains when only one of the strains has been sequenced and a large insert library is available for the other. The BACCardI software can seamlessly interact with various sequence assembly packages. Genomic assemblies generated from sequence information need to be validated by independent methods such as physical maps. The time-consuming task of building physical maps can be circumvented by virtual clone maps derived from read pair information of large insert libraries.

Analysis of the type II robotic mixed-model assembly line balancing problem

NASA Astrophysics Data System (ADS)

Çil, Zeynel Abidin; Mete, Süleyman; Ağpak, Kürşad

2017-06-01

In recent years, there has been an increasing trend towards using robots in production systems. Robots are used in different areas such as packaging, transportation, loading/unloading and especially assembly lines. One important step in taking advantage of robots on the assembly line is considering them while balancing the line. On the other hand, market conditions have increased the importance of mixed-model assembly lines. Therefore, in this article, the robotic mixed-model assembly line balancing problem is studied. The aim of this study is to develop a new efficient heuristic algorithm based on beam search in order to minimize the sum of cycle times over all models. In addition, mathematical models of the problem are presented for comparison. The proposed heuristic is tested on benchmark problems and compared with the optimal solutions. The results show that the algorithm is very competitive and is a promising tool for further research.

Japan's technology and manufacturing infrastructure

NASA Astrophysics Data System (ADS)

Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

1995-02-01

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Japan's technology and manufacturing infrastructure

NASA Technical Reports Server (NTRS)

Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

1995-01-01

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Components of the ALSEP deployed during Apollo 14 first EVA

NASA Image and Video Library

1971-02-05

AS14-67-9376 (5 Feb. 1971) --- Several components of the Apollo lunar surface experiments package (ASLEP) are deployed in this photograph taken during the first Apollo 14 extravehicular activity (EVA). The larger object with antenna is the ALSEP central station (CS). The active seismic experiment (ASE) mortar package assembly is to the rear left of the CS. The charged particle lunar environment experiment (CPLEE) is to the right rear of the CS. A portion of the modularized equipment transporter (MET) can be seen in the left foreground.

Attitude sensor package

NASA Technical Reports Server (NTRS)

Aceti, R.; Trischberger, M.; Underwood, P. J.; Pomilia, A.; Cosi, M.; Boldrini, F.

1993-01-01

This paper describes the design, construction, testing, and successful flight of the Attitude Sensor Package. The payload was assembled on a standard HITCHHIKER experiment mounting plate, and made extensive use of the carrier's power and data handling capabilities. The side mounted HITCHHIKER version was chosen, since this configuration provided the best viewing conditions for the instruments. The combustion was successfully flown on board Space Shuttle Columbia (STS-52), in October 1992. The payload was one of the 14 experiments of the In-Orbit Technology Demonstration Program (Phase 1) of the European Space Agency.

Power Extension Package (PEP) system definition extension, orbital service module systems analysis study. Volume 3: PEP analysis and tradeoffs

NASA Technical Reports Server (NTRS)

1979-01-01

The objectives, conclusions, and approaches for accomplishing 19 specific design and analysis activities related to the installation of the power extension package (PEP) into the Orbiter cargo bay are described as well as those related to its deployment, extension, and retraction. The proposed cable handling system designed to transmit power from PEP to the Orbiter by way of the shuttle remote manipulator system is described and a preliminary specification for the gimbal assembly, solar array drive is included.

Comparison of Wood Preservatives in Stake Tests (1981 Progress Report).

DTIC Science & Technology

1981-12-01

infected with Trichoderma mold, plus other selected species such as oak, Douglas-fir, and Engelmann spruce. Southern pine untreated control stakes...acetylated wood, cyanoethylated wood, that with thiamine destroyed, chemically modified wood, wood infected with Trichoderma mold, embedded fiberboard (western...14 toA4 41U(4 a ...- 44- Table 31.--Condition of southern pine stakes (2 x 4 in. nominal x 18 in.) of uninfected and Trichoderma mcid-infected wood

DOE Office of Scientific and Technical Information (OSTI.GOV)

Loftin, B.; Abramczyk, G.; Koenig, R.

Radioactive materials are stored in a variety of locations throughout the DOE complex. At the Savannah River Site (SRS), materials are stored within dedicated facilities. Each of those facilities has a documented safety analysis (DSA) that describes accidents that the facility and the materials within it may encounter. Facilities at the SRS are planning on utilizing the certified Model 9977 Shipping Package as a long term storage package and one of these facilities required ballistics testing. Specifically, in order to meet the facility DSA, the radioactive materials (RAM) must be contained within the storage package after impact by a .223more » caliber round. In order to qualify the Model 9977 Shipping Package for storage in this location, the package had to be tested under these conditions. Over the past two years, the Model 9977 Shipping Package has been subjected to a series of ballistics tests. The purpose of the testing was to determine if the 9977 would be suitable for use as a storage package at a Savannah River Site facility. The facility requirements are that the package must not release any of its contents following the impact in its most vulnerable location by a .223 caliber round. A package, assembled to meet all of the design requirements for a certified 9977 shipping configuration and using simulated contents, was tested at the Savannah River Site in March of 2011. The testing was completed and the package was examined. The results of the testing and examination are presented in this paper.« less

Packaging optical sensors for the real world

NASA Astrophysics Data System (ADS)

Kachmar, Wayne; Nardone, Kenneth C.

2007-09-01

Optical fiber based sensing has now moved from laboratory demonstrations to actual applications in the real world. This has necessitated an entirely new area of extrusion - the packaging (cabling) of optical fibers and sensor arrays to protect them from the intended environment and installation handling while not masking or attenuating the phenomenon that is being sensed. Although each application presents new and unique challenges, the goal is to create a packaging concept for fiber sensors. Fiber sensing applications can be narrowed down to the five items below: 1. Conventional cable packages 2. Assembled (typically by hand) discrete sensor packages 3. Package enhanced sensors (where the packaging improves the effect of the sensor) 4. Linear sensor installation packaging 5. Scalar packaging (where the cabling adds to the range of the sensor) The above applications can be accomplished in a number of ways, and methods are still being developed in this relatively new science. Some of the new technology methods being explored include: UV cured liquids; Voided space cores; Conventional cable extrusion & its determination of mechanical characteristics. This paper reviews the pluses and minuses of the above methods and how their combination ultimately determines how the fiber or sensor array is to be jacketed in order to meet the specific application requirements. This paper will also review non-standard material characteristics, strength members and their role in measuring strain and stress values along with the overall influence of packaging on optical fibers and sensor arrays.

The NOAA Scientific Computing System Data Assembly Center

NASA Astrophysics Data System (ADS)

Suchdeve, K. L.; Smith, S. R.; Van Waes, M.

2016-02-01

The Scientific Computing System (SCS) Data Assembly Center (DAC) was established in 2014 by the Office of Marine and Aviation Operations (OMAO) to evaluate the quality of full-resolution (sampling on the order of once per second) data collected by SCS onboard NOAA-operated research vessels. The SCS data are nominally transferred from the vessel to the National Centers for Environmental Information (NCEI) soon after the completion of each cruise and are complimented with detailed cruise metadata from OMAO. The authors will describe tools developed by the SCS DAC to monitor the timeliness of SCS data delivery to NCEI and the completeness of the SCS packages received by NCEI (ensuring the package contains data for all enabled sensors on a given cruise). Feedback to OMAO and NCEI regarding the timeliness and data completeness will be outlined along with challenges encountered by the DAC as it works to develop automated quality assessment of the SCS data packages.Data collected by SCS on NOAA vessels represent a significant investment by the American taxpayer. The mission of the SCS DAC is to ensure that archived SCS data at NCEI are a complete record of the observations made on NOAA research cruises. Archival of complete SCS datasets at NCEI ensures these data are preserved for future generations of scientists, policy makers, and the public.

Improving Energy Efficiency for the Vehicle Assembly Industry: A Discrete Event Simulation Approach

NASA Astrophysics Data System (ADS)

Oumer, Abduaziz; Mekbib Atnaw, Samson; Kie Cheng, Jack; Singh, Lakveer

2016-11-01

This paper presented a Discrete Event Simulation (DES) model for investigating and improving energy efficiency in vehicle assembly line. The car manufacturing industry is one of the highest energy consuming industries. Using Rockwell Arena DES package; a detailed model was constructed for an actual vehicle assembly plant. The sources of energy considered in this research are electricity and fuel; which are the two main types of energy sources used in a typical vehicle assembly plant. The model depicts the performance measurement for process- specific energy measures of painting, welding, and assembling processes. Sound energy efficiency model within this industry has two-fold advantage: reducing CO2 emission and cost reduction associated with fuel and electricity consumption. The paper starts with an overview of challenges in energy consumption within the facilities of automotive assembly line and highlights the parameters for energy efficiency. The results of the simulation model indicated improvements for energy saving objectives and reduced costs.

21 CFR 820.3 - Definitions.

Code of Federal Regulations, 2010 CFR

2010-04-01

... designs, manufactures, fabricates, assembles, or processes a finished device. Manufacturer includes but is... numbers, or both, from which the history of the manufacturing, packaging, labeling, and distribution of a unit, lot, or batch of finished devices can be determined. (e) Design history file (DHF) means a...

Design and evaluation of brushless electrical generators

NASA Technical Reports Server (NTRS)

Collins, F. A.; Ellis, J. N.

1970-01-01

Ten design manuals assembled and nine computer programs are developed for evaluation of proposed designs of brushless rotating electrical generators. Design manual package provides all information required for generator design, and computer programs permit calculation of performance of specific designs including effects of materials.

Case Studies in Continuous Process Improvement

NASA Technical Reports Server (NTRS)

Mehta, A.

1997-01-01

This study focuses on improving the SMT assembly process in a low-volume, high-reliability environment with emphasis on fine pitch and BGA packages. Before a process improvement is carried out, it is important to evaluate where the process stands in terms of process capability.

Preliminary design approach for large high precision segmented reflectors

NASA Technical Reports Server (NTRS)

Mikulas, Martin M., Jr.; Collins, Timothy J.; Hedgepeth, John M.

1990-01-01

A simplified preliminary design capability for erectable precision segmented reflectors is presented. This design capability permits a rapid assessment of a wide range of reflector parameters as well as new structural concepts and materials. The preliminary design approach was applied to a range of precision reflectors from 10 meters to 100 meters in diameter while considering standard design drivers. The design drivers considered were: weight, fundamental frequency, launch packaging volume, part count, and on-orbit assembly time. For the range of parameters considered, on-orbit assembly time was identified as the major design driver. A family of modular panels is introduced which can significantly reduce the number of reflector parts and the on-orbit assembly time.

Wafer-level vacuum/hermetic packaging technologies for MEMS

NASA Astrophysics Data System (ADS)

Lee, Sang-Hyun; Mitchell, Jay; Welch, Warren; Lee, Sangwoo; Najafi, Khalil

2010-02-01

An overview of wafer-level packaging technologies developed at the University of Michigan is presented. Two sets of packaging technologies are discussed: (i) a low temperature wafer-level packaging processes for vacuum/hermeticity sealing, and (ii) an environmentally resistant packaging (ERP) technology for thermal and mechanical control as well as vacuum packaging. The low temperature wafer-level encapsulation processes are implemented using solder bond rings which are first patterned on a cap wafer and then mated with a device wafer in order to encircle and encapsulate the device at temperatures ranging from 200 to 390 °C. Vacuum levels below 10 mTorr were achieved with yields in an optimized process of better than 90%. Pressures were monitored for more than 4 years yielding important information on reliability and process control. The ERP adopts an environment isolation platform in the packaging substrate. The isolation platform is designed to provide low power oven-control, vibration isolation and shock protection. It involves batch flip-chip assembly of a MEMS device onto the isolation platform wafer. The MEMS device and isolation structure are encapsulated at the wafer-level by another substrate with vertical feedthroughs for vacuum/hermetic sealing and electrical signal connections. This technology was developed for high performance gyroscopes, but can be applied to any type of MEMS device.

Integrated Avionics System (IAS), Integrating 3-D Technology On A Spacecraft Panel

NASA Technical Reports Server (NTRS)

Hunter, Don J.; Halpert, Gerald

1999-01-01

As spacecraft designs converge toward miniaturization, and with the volumetric and mass challenges placed on avionics, programs will continue to advance the "state of the art" in spacecraft system development with new challenges to reduce power, mass and volume. Traditionally, the trend is to focus on high-density 3-D packaging technologies. Industry has made significant progress in 3-D technologies, and other related internal and external interconnection schemes. Although new technologies have improved packaging densities, a system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increase integration efficiencies, provide modularity and flexibility to accommodate multiple missions while maintaining a low recurring cost. With these challenges in mind, a novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. The Integrated Avionics System (IAS) provides for a low-mass, modular distributed or centralized packaging architecture which combines ridged-flex technologies, high-density COTS hardware and a new 3-D mechanical packaging approach, Horizontal Mounted Cube (HMC). This paper will describe the fundamental elements of the IAS, HMC hardware design, system integration and environmental test results.

Dismantlement of the TSF-SNAP Reactor Assembly

DOE Office of Scientific and Technical Information (OSTI.GOV)

Peretz, Fred J

2009-01-01

This paper describes the dismantlement of the Tower Shielding Facility (TSF)?Systems for Nuclear Auxiliary Power (SNAP) reactor, a SNAP-10A reactor used to validate radiation source terms and shield performance models at Oak Ridge National Laboratory (ORNL) from 1967 through 1973. After shutdown, it was placed in storage at the Y-12 National Security Complex (Y-12), eventually falling under the auspices of the Highly Enriched Uranium (HEU) Disposition Program. To facilitate downblending of the HEU present in the fuel elements, the TSF-SNAP was moved to ORNL on June 24, 2006. The reactor assembly was removed from its packaging, inspected, and the sodium-potassiummore » (NaK) coolant was drained. A superheated steam process was used to chemically react the residual NaK inside the reactor assembly. The heat exchanger assembly was removed from the top of the reactor vessel, and the criticality safety sleeve was exchanged for a new safety sleeve that allowed for the removal of the vessel lid. A chain-mounted tubing cutter was used to separate the lid from the vessel, and the 36 fuel elements were removed and packaged in four U.S. Department of Transportation 2R/6M containers. The fuel elements were returned to Y-12 on July 13, 2006. The return of the fuel elements and disposal of all other reactor materials accomplished the formal objectives of the dismantlement project. In addition, a project model was established for the handling of a fully fueled liquid-metal?cooled reactor assembly. Current criticality safety codes have been benchmarked against experiments performed by Atomics International in the 1950s and 1960s. Execution of this project provides valuable experience applicable to future projects addressing space and liquid-metal-cooled reactors.« less

System design package for SIMS prototype system 2, solar hot water

NASA Technical Reports Server (NTRS)

1977-01-01

Information necessary to evaluate the design and assembly of a solar hot water system is presented. A prototype system designed for use in a single family dwelling is investigated in terms of the following subsystems: collector, storage, energy transport, and control.

KENNEDY SPACE CENTER, FLA. - During a media tour of the Columbia Debris Hangar, photographers pause at the mockup of the leading edge of Columbia’s left wing. About 83,000 pieces of debris from Columbia were shipped to KSC from search and recovery efforts in East Texas. About 83,000 pieces of debris were shipped to KSC, which represents about 38 percent of the dry weight of Columbia, equaling almost 85,000 pounds. The debris is being packaged for storage in an area of the Vehicle Assembly Building.

NASA Image and Video Library

2003-09-11

KENNEDY SPACE CENTER, FLA. - During a media tour of the Columbia Debris Hangar, photographers pause at the mockup of the leading edge of Columbia’s left wing. About 83,000 pieces of debris from Columbia were shipped to KSC from search and recovery efforts in East Texas. About 83,000 pieces of debris were shipped to KSC, which represents about 38 percent of the dry weight of Columbia, equaling almost 85,000 pounds. The debris is being packaged for storage in an area of the Vehicle Assembly Building.

Merging photonics with nanoelectronics (Conference Presentation)

NASA Astrophysics Data System (ADS)

Liehr, Michael

2016-02-01

The recently established American Institute for Manufacturing Photonics (AIM Photonics) is a manufacturing consortium headquartered in New York, with funding from the US Department of Defense (DoD), New York State, and industrial partners to advance the state of the art in the design, manufacture, testing, assembly, and packaging of integrated photonic devices. Dr. Michael Liehr, CEO of AIM Photonics, will describe the technical goals, operational framework, near-term milestones, and opportunities for the broader photonics community. The Institute intends to organize a currently fragmented domestic capability in integrated photonics. AIM Photonics will develop and demonstrate innovative manufacturing technologies for a number of key application sectors for integrated photonics devices. The Institute will furthermore specifically focus on establishing and building out an infrastructure in key areas required to accelerate the further adoption of integrated photonics. Specifically, we will enhance the available hardware development capability to include Si-based Multi-Project Wafer runs, InP-based Photonic Integrated Circuits, first and second level packaging, test and assembly.

Metavisitor, a Suite of Galaxy Tools for Simple and Rapid Detection and Discovery of Viruses in Deep Sequence Data

PubMed Central

Vernick, Kenneth D.

2017-01-01

Metavisitor is a software package that allows biologists and clinicians without specialized bioinformatics expertise to detect and assemble viral genomes from deep sequence datasets. The package is composed of a set of modular bioinformatic tools and workflows that are implemented in the Galaxy framework. Using the graphical Galaxy workflow editor, users with minimal computational skills can use existing Metavisitor workflows or adapt them to suit specific needs by adding or modifying analysis modules. Metavisitor works with DNA, RNA or small RNA sequencing data over a range of read lengths and can use a combination of de novo and guided approaches to assemble genomes from sequencing reads. We show that the software has the potential for quick diagnosis as well as discovery of viruses from a vast array of organisms. Importantly, we provide here executable Metavisitor use cases, which increase the accessibility and transparency of the software, ultimately enabling biologists or clinicians to focus on biological or medical questions. PMID:28045932