An Integrated Research Program for the Modeling, Analysis and Control of Aerospace Systems

DTIC Science & Technology

1992-03-03

Mitchell Feigenbaum - Rockefeller University Elena Fernandez - Institudo de Desarrollo Techologico, para la Industria Quimica Wilfred M. Greenlee...Ultrix; we have installed the GKS graphics system and language compilers (FORTRAN and C). The DELIGHT.MIMO software , which links a sophisticated non...smooth optimization package to some linear system software , is on the system. The package was kindly furnished by Professor E. Polak, Electrical and

Novel Power Electronics Three-Dimensional Heat Exchanger: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bennion, K.; Cousineau, J.; Lustbader, J.

2014-08-01

Electric drive systems for vehicle propulsion enable technologies critical to meeting challenges for energy, environmental, and economic security. Enabling cost-effective electric drive systems requires reductions in inverter power semiconductor area. As critical components of the electric drive system are made smaller, heat removal becomes an increasing challenge. In this paper, we demonstrate an integrated approach to the design of thermal management systems for power semiconductors that matches the passive thermal resistance of the packaging with the active convective cooling performance of the heat exchanger. The heat exchanger concept builds on existing semiconductor thermal management improvements described in literature and patents,more » which include improved bonded interface materials, direct cooling of the semiconductor packages, and double-sided cooling. The key difference in the described concept is the achievement of high heat transfer performance with less aggressive cooling techniques by optimizing the passive and active heat transfer paths. An extruded aluminum design was selected because of its lower tooling cost, higher performance, and scalability in comparison to cast aluminum. Results demonstrated a heat flux improvement of a factor of two, and a package heat density improvement over 30%, which achieved the thermal performance targets.« less

The General-Use Nodal Network Solver (GUNNS) Modeling Package for Space Vehicle Flow System Simulation

NASA Technical Reports Server (NTRS)

Harvey, Jason; Moore, Michael

2013-01-01

The General-Use Nodal Network Solver (GUNNS) is a modeling software package that combines nodal analysis and the hydraulic-electric analogy to simulate fluid, electrical, and thermal flow systems. GUNNS is developed by L-3 Communications under the TS21 (Training Systems for the 21st Century) project for NASA Johnson Space Center (JSC), primarily for use in space vehicle training simulators at JSC. It has sufficient compactness and fidelity to model the fluid, electrical, and thermal aspects of space vehicles in real-time simulations running on commodity workstations, for vehicle crew and flight controller training. It has a reusable and flexible component and system design, and a Graphical User Interface (GUI), providing capability for rapid GUI-based simulator development, ease of maintenance, and associated cost savings. GUNNS is optimized for NASA's Trick simulation environment, but can be run independently of Trick.

System Design Package for SIMS Prototype System 3, Solar Heating and Domestic Hot Water

NASA Technical Reports Server (NTRS)

1978-01-01

A collation of documents and drawings are presented that describe a prototype solar heating and hot water system using liquid flat plate collectors and a gas or electric furnace energy subsystem. The system was designed for installation into a single-family dwelling. The description, performance specification, subsystem drawings, verification plan/procedure, and hazard analysis of the system are packaged for evaluation of the system with information sufficient to assemble a similar system.

Package architecture and component design for an implanted neural stimulator with closed loop control.

PubMed

Bjune, Caroline K; Marinis, Thomas F; Brady, Jeanne M; Moran, James; Wheeler, Jesse; Sriram, Tirunelveli S; Parks, Philip D; Widge, Alik S; Dougherty, Darin D; Eskandar, Emad N

2015-08-01

An implanted neural stimulator with closed loop control requires electrodes for stimulation pulses and recording neuron activity. Our system features arrays of 64 electrodes. Each electrode can be addressed through a cross bar switch, to enable it to be used for stimulation or recording. This electrode switch, a bank of low noise amplifiers with an integrated analog to digital converter, power conditioning electronics, and a communications and control gate array are co-located with the electrode array in a 14 millimeter diameter satellite package that is designed to be flush mounted in a skull burr hole. Our system features five satellite packages connected to a central hub processor-controller via ten conductor cables that terminate in a custom designed, miniaturized connector. The connector incorporates features of high reliability, military grade devices and utilizes three distinct seals to isolate the contacts from fluid permeation. The hub system is comprised of a connector header, hermetic electronics package, and rechargeable battery pack, which are mounted on and electrically interconnected by a flexible circuit board. The assembly is over molded with a compliant silicone rubber. The electronics package contains two antennas, a large coil, used for recharging the battery and a high bandwidth antenna that is used to download data and update software. The package is assembled from two machined alumina pieces, a flat base with brazed in, electrical feed through pins and a rectangular cover with rounded corners. Titanium seal rings are brazed onto these two pieces so that they can be sealed by laser welding. A third system antenna is incorporated in the flexible circuit board. It is used to communicate with an externally worn control package, which monitors the health of the system and allows both the user and clinician to control or modify various system function parameters.

Power Extension Package (PEP) system definition extension, orbital service module systems analysis study. Volume 4: PEP functional specification

NASA Technical Reports Server (NTRS)

1979-01-01

The functional, performance, design, and test requirements for the Orbiter power extension package and its associated ground support equipment are defined. Both government and nongovernment standards and specifications are cited for the following subsystems: electrical power, structural/mechanical, avionics, and thermal control. Quality control assurance provisions and preparation for delivery are also discussed.

PV water pumping: NEOS Corporation recent PV water pumping activities

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lane, C.

1995-11-01

NEOS Corporation has been very active in PV-powered water pumping, particularly with respect to electric utilities. Most of the recent activity has been through the Photovoltaic Services Network (PSN). The PSN is an independent, not-for-profit organization comprised of all types of electric utilities: rural electric coops, public power districts, investor-owned utilities, and power marketing agencies. The PSN`s mission is to work pro-actively to promote utility involvement in PV through education and training. PV information is distributed by the PSN in three primary forms: (1) consultation with PSN technical service representatives: (2) literature generated by the PSN; and (3) literature publishedmore » by other organizations. The PSN can also provide assistance to members in developing PV customer service programs. The PSN`s product support activities include consolidation of information on existing packaged PV systems and facilitation of the development of new PV product packages that meet utility-defined specifications for cost performance, and reliability. The PSN`s initial product support efforts will be focused on commercially available packaged PV systems for a variety of off-grid applications. In parallel with this effort, if no products exist that meet the PSN`s functional specifications, the PSN will initiate the second phase of product development support process by encouraging the development of new packaged systems. Through these services and product support activities, the PSN anticipates engaging all segments for the PV industry, thus providing benefits to PV systems suppliers as well as local PV service contractors.This paper describes field testing of pv power systems for water pumping.« less

Localized heating/bonding techniques in MEMS packaging

NASA Astrophysics Data System (ADS)

Mabesa, J. R., Jr.; Scott, A. J.; Wu, X.; Auner, G. W.

2005-05-01

Packaging is used to protect and enable intelligent sensor systems utilized in manned/unmanned ground vehicle systems/subsystems. Because Micro electro mechanical systems (MEMS) are used often in these sensor or actuation products, it must interact with the surrounding environment, which may be in direct conflict with the desire to isolate the electronics for improved reliability/durability performance. For some very simple devices, performance requirements may allow a high degree of isolation from the environment (e.g., stints and accelerometers). Other more complex devices (i.e. chemical and biological analysis systems, particularly in vivo systems) present extremely complex packaging requirements. Power and communications to MEMS device arrays are also extremely problematic. The following describes the research being performed at the U.S. Army Research, Development, and Engineering Command (RDECOM) Tank and Automotive Research, Development, and Engineering Center (TARDEC), in collaboration with Wayne State University, in Detroit, MI. The focus of the packaging research is limited to six main categories: a) provision for feed-through for electrical, optical, thermal, and fluidic interfaces; b) environmental management including atmosphere, hermiticity, and temperature; c) control of stress and mechanical durability; d) management of thermal properties to minimize absorption and/or emission; e) durability and structural integrity; and f) management of RF/magnetic/electrical and optical interference and/or radiation properties and exposure.

Solar Water Heater Installation Package

NASA Technical Reports Server (NTRS)

1982-01-01

A 48-page report describes water-heating system, installation (covering collector orientation, mounting, plumbing and wiring), operating instructions and maintenance procedures. Commercial solar-powered water heater system consists of a solar collector, solar-heated-water tank, electrically heated water tank and controls. Analysis of possible hazards from pressure, electricity, toxicity, flammability, gas, hot water and steam are also included.

High-Performance Power-Semiconductor Packages

NASA Technical Reports Server (NTRS)

Renz, David; Hansen, Irving; Berman, Albert

1989-01-01

A 600-V, 50-A transistor and 1,200-V, 50-A diode in rugged, compact, lightweight packages intended for use in inverter-type power supplies having switching frequencies up to 20 kHz. Packages provide low-inductance connections, low loss, electrical isolation, and long-life hermetic seal. Low inductance achieved by making all electrical connections to each package on same plane. Also reduces high-frequency losses by reducing coupling into inherent shorted turns in packaging material around conductor axes. Stranded internal power conductors aid conduction at high frequencies, where skin effect predominates. Design of packages solves historical problem of separation of electrical interface from thermal interface of high-power semiconductor device.

Testing methods and techniques: Testing electrical and electronic devices: A compilation

NASA Technical Reports Server (NTRS)

1972-01-01

The methods, techniques, and devices used in testing various electrical and electronic apparatus are presented. The items described range from semiconductor package leak detectors to automatic circuit analyzer and antenna simulators for system checkout. In many cases the approaches can result in considerable cost savings and improved quality control. The testing of various electronic components, assemblies, and systems; the testing of various electrical devices; and the testing of cables and connectors are explained.

Hermetic electronics package with dual-sided electrical feedthrough configuration

DOEpatents

Shah, Kedar G.; Pannu, Satinderpall S.

2016-11-22

A hermetic electronics package includes a metal case with opposing first and second open ends, with each end connected to a first feedthrough construction and a second feedthrough construction. Each feedthrough contruction has an electrically insulating substrate and an array of electrically conductive feedthroughs extending therethrough, with the electrically insulating substrates connected to the opposing first and second open ends, respectively, of the metal case so as to form a hermetically sealed enclosure. A set of electronic components are located within the hermetically sealed enclosure and are operably connected to the feedthroughs of the first and second feedthrough constructions so as to electrically communicate outside the package from opposite sides of the package.

Modular electronics packaging system

NASA Technical Reports Server (NTRS)

Hunter, Don J. (Inventor)

2001-01-01

A modular electronics packaging system includes multiple packaging slices that are mounted horizontally to a base structure. The slices interlock to provide added structural support. Each packaging slice includes a rigid and thermally conductive housing having four side walls that together form a cavity to house an electronic circuit. The chamber is enclosed on one end by an end wall, or web, that isolates the electronic circuit from a circuit in an adjacent packaging slice. The web also provides a thermal path between the electronic circuit and the base structure. Each slice also includes a mounting bracket that connects the packaging slice to the base structure. Four guide pins protrude from the slice into four corresponding receptacles in an adjacent slice. A locking element, such as a set screw, protrudes into each receptacle and interlocks with the corresponding guide pin. A conduit is formed in the slice to allow electrical connection to the electronic circuit.

HALT to qualify electronic packages: a proof of concept

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2014-03-01

A proof of concept of the Highly Accelerated Life Testing (HALT) technique was explored to assess and optimize electronic packaging designs for long duration deep space missions in a wide temperature range (-150°C to +125°C). HALT is a custom hybrid package suite of testing techniques using environments such as extreme temperatures and dynamic shock step processing from 0g up to 50g of acceleration. HALT testing used in this study implemented repetitive shock on the test vehicle components at various temperatures to precipitate workmanship and/or manufacturing defects to show the weak links of the designs. The purpose is to reduce the product development cycle time for improvements to the packaging design qualification. A test article was built using advanced electronic package designs and surface mount technology processes, which are considered useful for a variety of JPL and NASA projects, i.e. (surface mount packages such as ball grid arrays (BGA), plastic ball grid arrays (PBGA), very thin chip array ball grid array (CVBGA), quad flat-pack (QFP), micro-lead-frame (MLF) packages, several passive components, etc.). These packages were daisy-chained and independently monitored during the HALT test. The HALT technique was then implemented to predict reliability and assess survivability of these advanced packaging techniques for long duration deep space missions in much shorter test durations. Test articles were built using advanced electronic package designs that are considered useful in various NASA projects. All the advanced electronic packages were daisychained independently to monitor the continuity of the individual electronic packages. Continuity of the daisy chain packages was monitored during the HALT testing using a data logging system. We were able to test the boards up to 40g to 50g shock levels at temperatures ranging from +125°C to -150°C. The HALT system can deliver 50g shock levels at room temperature. Several tests were performed by subjecting the test boards to various g levels ranging from 5g to 50g, test durations of 10 minutes to 60 minutes, hot temperatures of up to +125°C and cold temperatures down to -150°C. During the HALT test, electrical continuity measurements of the PBGA package showed an open-circuit, whereas the BGA, MLF, and QFPs showed signs of small variations of electrical continuity measurements. The electrical continuity anomaly of the PBGA occurred in the test board within 12 hours of commencing the accelerated test. Similar test boards were assembled, thermal cycled independently from -150°C to +125°C and monitored for electrical continuity through each package design. The PBGA package on the test board showed an anomalous electrical continuity behavior after 959 thermal cycles. Each thermal cycle took around 2.33 hours, so that a total test time to failure of the PBGA was 2,237 hours (or ~3.1 months) due to thermal cycling alone. The accelerated technique (thermal cycling + shock) required only 12 hours to cause a failure in the PBGA electronic package. Compared to the thermal cycle only test, this was an acceleration of ~186 times (more than 2 orders of magnitude). This acceleration process can save significant time and resources for predicting the life of a package component in a given environment, assuming the failure mechanisms are similar in both the tests. Further studies are in progress to make systematic evaluations of the HALT technique on various other advanced electronic packaging components on the test board. With this information one will be able to estimate the number of mission thermal cycles to failure with a much shorter test program. Further studies are in progress to make systematic study of various components, constant temperature range for both the tests. Therefore, one can estimate the number of hours to fail in a given thermal and shock levels for a given test board physical properties.

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Neudeck, Philip G.; Behelm, Glenn M.; Spry, David J.; Meredith, Roger D.; Hunter, Gary W.

2015-01-01

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

An Interactive Computer Aided Electrical Engineering Education Package.

ERIC Educational Resources Information Center

Cavati, Cicero Romao

This paper describes an educational package to help the learning process. A case study is presented of an energy distribution course in the Electrical Engineering Department at the Federal University of Espirito Santo (UFES). The advantages of the developed package are shown by comparing it with the traditional academic book. This package presents…

High-Performance Computing for the Electromagnetic Modeling and Simulation of Interconnects

NASA Technical Reports Server (NTRS)

Schutt-Aine, Jose E.

1996-01-01

The electromagnetic modeling of packages and interconnects plays a very important role in the design of high-speed digital circuits, and is most efficiently performed by using computer-aided design algorithms. In recent years, packaging has become a critical area in the design of high-speed communication systems and fast computers, and the importance of the software support for their development has increased accordingly. Throughout this project, our efforts have focused on the development of modeling and simulation techniques and algorithms that permit the fast computation of the electrical parameters of interconnects and the efficient simulation of their electrical performance.

An application specific integrated circuit based multi-anode microchannel array readout system

NASA Technical Reports Server (NTRS)

Smeins, Larry G.; Stechman, John M.; Cole, Edward H.

1991-01-01

Size reduction of two new multi-anode microchannel array (MAMA) readout systems is described. The systems are based on two analog and one digital application specific integrated circuits (ASICs). The new readout systems reduce volume over previous discrete designs by 80 percent while improving electrical performance on virtually every significant parameter. Emphasis is made on the packaging used to achieve the volume reduction. Surface mount technology (SMT) is combined with modular construction for the analog portion of the readout. SMT reliability concerns and the board area impact of MIL SPEC SMT components is addressed. Package selection for the analog ASIC is discussed. Future sytems will require even denser packaging and the volume reduction progression is shown.

Monolithic microwave integrated circuits: Interconnections and packaging considerations

NASA Astrophysics Data System (ADS)

Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.

Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

Monolithic microwave integrated circuits: Interconnections and packaging considerations

NASA Technical Reports Server (NTRS)

Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.

1984-01-01

Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging

NASA Astrophysics Data System (ADS)

Wang, Qian; Choa, Sung-Hoon; Kim, Woonbae; Hwang, Junsik; Ham, Sukjin; Moon, Changyoul

2006-03-01

Development of packaging is one of the critical issues toward realizing commercialization of radio-frequency-microelectromechanical system (RF-MEMS) devices. The RF-MEMS package should be designed to have small size, hermetic protection, good RF performance, and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low-temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at temperatures below 300°C is used. Au-Sn multilayer metallization with a square loop of 70 µm in width is performed. The electrical feed-through is achieved by the vertical through-hole via filling with electroplated Cu. The size of the MEMS package is 1 mm × 1 mm × 700 µm. The shear strength and hermeticity of the package satisfies the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.

Heating Systems Specialist.

ERIC Educational Resources Information Center

Air Force Training Command, Sheppard AFB, TX.

This instructional package is intended for use in training Air Force personnel enrolled in a program for apprentice heating systems specialists. Training includes instruction in fundamentals and pipefitting; basic electricity; controls, troubleshooting, and oil burners; solid and gas fuel burners and warm air distribution systems; hot water…

OMS engine shutoff valve and actuation system design and evaluation. [for space shuttles

NASA Technical Reports Server (NTRS)

Wichmann, H.

1974-01-01

Shutoff valve and actuation system concepts that are most suitable for the Orbital Maneuvering Systems engine application were determined. Emphasis was placed on the ten year and 100 mission life requirement, propellant and propellant residue compatibility and weight. It was found that poppet or ball valves utilizing electric or electropneumatic actuation were most applicable. Preliminary design layouts of a number of valve and actuation concepts were prepared and analyzed to make the optimum concept selection. Pneumatic actuation systems were required to feature their own pneumatic supply so that for the quad redundant valve, it was necessary to include two pneumatic supply systems, one for each of the series legs of the quad redundant package. The requirement for the pneumatic package placed heavy reliability, weight, and maintenance penalties upon electropneumatic actuation systems. The two valve and actuation systems concepts selected featured electric torque motor operation and a poppet as well as a ball valve concept with a retractable seal.

More Efficient Power Conversion for EVs: Gallium-Nitride Advanced Power Semiconductor and Packaging

DOE Office of Scientific and Technical Information (OSTI.GOV)

None

2010-02-01

Broad Funding Opportunity Announcement Project: Delphi is developing power converters that are smaller and more energy efficient, reliable, and cost-effective than current power converters. Power converters rely on power transistors which act like a very precisely controlled on-off switch, controlling the electrical energy flowing through an electrical circuit. Most power transistors today use silicon (Si) semiconductors. However, Delphi is using semiconductors made with a thin layer of gallium-nitride (GaN) applied on top of the more conventional Si material. The GaN layer increases the energy efficiency of the power transistor and also enables the transistor to operate at much higher temperatures,more » voltages, and power-density levels compared to its Si counterpart. Delphi is packaging these high-performance GaN semiconductors with advanced electrical connections and a cooling system that extracts waste heat from both sides of the device to further increase the device’s efficiency and allow more electrical current to flow through it. When combined with other electronic components on a circuit board, Delphi’s GaN power transistor package will help improve the overall performance and cost-effectiveness of HEVs and EVs.« less

Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment.

PubMed

Jeong, Seung Hee; Chen, Si; Huo, Jinxing; Gamstedt, Erik Kristofer; Liu, Johan; Zhang, Shi-Li; Zhang, Zhi-Bin; Hjort, Klas; Wu, Zhigang

2015-12-16

Stretchable electronics and soft robotics have shown unsurpassed features, inheriting remarkable functions from stretchable and soft materials. Electrically conductive and mechanically stretchable materials based on composites have been widely studied for stretchable electronics as electrical conductors using various combinations of materials. However, thermally tunable and stretchable materials, which have high potential in soft and stretchable thermal devices as interface or packaging materials, have not been sufficiently studied. Here, a mechanically stretchable and electrically insulating thermal elastomer composite is demonstrated, which can be easily processed for device fabrication. A liquid alloy is embedded as liquid droplet fillers in an elastomer matrix to achieve softness and stretchability. This new elastomer composite is expected useful to enhance thermal response or efficiency of soft and stretchable thermal devices or systems. The thermal elastomer composites demonstrate advantages such as thermal interface and packaging layers with thermal shrink films in transient and steady-state cases and a stretchable temperature sensor.

Isotope Brayton electric power system for the 500 to 2500 watt range

NASA Technical Reports Server (NTRS)

Macosko, R. P.; Barna, G. J.; Block, H. B.; Ingle, B. D.

1972-01-01

An extensive study was conducted at the Lewis Research Center to evaluate an isotope Brayton electric power system for use in the 500 to 2500 W power range. Overall system simplicity was emphasized in order to reduce parasitic power losses and improve system reliability. Detailed parametric cycle analysis, conceptual component designs, and evaluation of system packaging were included. A single-loop system (gas) with six major components including one rotating unit was selected. Calculated net system efficiency varies from 23 to 28 percent over the power range.

Enhanced Electric Power Transmission by Hybrid Compensation Technique

NASA Astrophysics Data System (ADS)

Palanichamy, C.; Kiu, G. Q.

2015-04-01

In today's competitive environment, new power system engineers are likely to contribute immediately to the task, without years of seasoning via on-the-job training, mentoring, and rotation assignments. At the same time it is becoming obligatory to train power system engineering graduates for an increasingly quality-minded corporate environment. In order to achieve this, there is a need to make available better-quality tools for educating and training power system engineering students and in-service system engineers too. As a result of the swift advances in computer hardware and software, many windows-based computer software packages were developed for the purpose of educating and training. In line with those packages, a simulation package called Hybrid Series-Shunt Compensators (HSSC) has been developed and presented in this paper for educational purposes.

Thermal management of LEDs: package to system

NASA Astrophysics Data System (ADS)

Arik, Mehmet; Becker, Charles A.; Weaver, Stanton E.; Petroski, James

2004-01-01

Light emitting diodes, LEDs, historically have been used for indicators and produced low amounts of heat. The introduction of high brightness LEDs with white light and monochromatic colors have led to a movement towards general illumination. The increased electrical currents used to drive the LEDs have focused more attention on the thermal paths in the developments of LED power packaging. The luminous efficiency of LEDs is soon expected to reach over 80 lumens/W, this is approximately 6 times the efficiency of a conventional incandescent tungsten bulb. Thermal management for the solid-state lighting applications is a key design parameter for both package and system level. Package and system level thermal management is discussed in separate sections. Effect of chip packages on junction to board thermal resistance was compared for both SiC and Sapphire chips. The higher thermal conductivity of the SiC chip provided about 2 times better thermal performance than the latter, while the under-filled Sapphire chip package can only catch the SiC chip performance. Later, system level thermal management was studied based on established numerical models for a conceptual solid-state lighting system. A conceptual LED illumination system was chosen and CFD models were created to determine the availability and limitations of passive air-cooling.

Novel Techniques for Millimeter-Wave Packages

NASA Technical Reports Server (NTRS)

Herman, Martin I.; Lee, Karen A.; Kolawa, Elzbieta A.; Lowry, Lynn E.; Tulintseff, Ann N.

1995-01-01

A new millimeter-wave package architecture with supporting electrical, mechanical and material science experiment and analysis is presented. This package is well suited for discrete devices, monolithic microwave integrated circuits (MMIC's) and multichip module (MCM) applications. It has low-loss wide-band RF transitions which are necessary to overcome manufacturing tolerances leading to lower per unit cost Potential applications of this new packaging architecture which go beyond the standard requirements of device protection include integration of antennas, compatibility to photonic networks and direct transitions to waveguide systems. Techniques for electromagnetic analysis, thermal control and hermetic sealing were explored. Three dimensional electromagnetic analysis was performed using a finite difference time-domain (FDTD) algorithm and experimentally verified for millimeter-wave package input and output transitions. New multi-material system concepts (AlN, Cu, and diamond thin films) which allow excellent surface finishes to be achieved with enhanced thermal management have been investigated. A new approach utilizing block copolymer coatings was employed to hermetically seal packages which met MIL STD-883.

Electrical Charging Hazards Originating from the Surface (ECHOS): Understanding the Martian Electro-Meteorological Environment

NASA Technical Reports Server (NTRS)

Farrell, W. M.; Desch, M. D.; Marshall, J. R.; Delory, G. T.; Kolecki, J. C.; Hillard, G. B.; Kaiser, M. L.; Haberle, R. M.; Zent, A. P.; Luhmann, J. G.

2000-01-01

In 1999, the NASA/Human Exploration and Development of Space (HEDS) enterprise selected a number of payloads to fly to the Martian surface in an 03 opportunity (prior to the MPL loss). Part of a proposed experiment, ECHOS, was selected to specifically understand the electrical charging hazards from tribocharged dust in the ambient atmosphere, in dust devils, and in larger storms. It is expected that Martian dust storms become tribocharged much like terrestrial dust devils which can possess almost a million elementary charges per cubic centimeter. The ECHOS package features a set of instruments for measuring electric effects: a radio to detect AC electric fields radiating from discharges in the storm,a DC electric field system for sensing electrostatic fields from concentrations of charged dust grains, and a lander electrometer chain for determining the induced potential on its body and MAV (Mars Ascent Vehicle) during the passages of a charged dust storm. Given that electricity is a systemic process originating from wind-blown dust, we also proposed to correlate the electrical measurements with fundamental fluid/meteorological observations, including wind velocity and vorticity, temperature, and pressure. Triboelectricity will also affect local chemistry, and chemical-sensing devices were also considered a feature of the package. The primary HEDS objectives of the ECHOS sensing suite is to discover and monitor the natural electrical hazards associated with dust devils and storms, and determine their enviro-effectiveness on human systems. However, ECHOS also has a strong footprint in the overarching science objectives of the Mars Surveyor Program.

An Inverter Packaging Scheme for an Integrated Segmented Traction Drive System

DOE Office of Scientific and Technical Information (OSTI.GOV)

Su, Gui-Jia; Tang, Lixin; Ayers, Curtis William

The standard voltage source inverter (VSI), widely used in electric vehicle/hybrid electric vehicle (EV/HEV) traction drives, requires a bulky dc bus capacitor to absorb the large switching ripple currents and prevent them from shortening the battery s life. The dc bus capacitor presents a significant barrier to meeting inverter cost, volume, and weight requirements for mass production of affordable EVs/HEVs. The large ripple currents become even more problematic for the film capacitors (the capacitor technology of choice for EVs/HEVs) in high temperature environments as their ripple current handling capability decreases rapidly with rising temperatures. It is shown in previous workmore » that segmenting the VSI based traction drive system can significantly decrease the ripple currents and thus the size of the dc bus capacitor. This paper presents an integrated packaging scheme to reduce the system cost of a segmented traction drive.« less

Secondary-Postsecondary Curriculum Development in Automotive Mechanics. Automotive Electrical Competencies. Final Report.

ERIC Educational Resources Information Center

Hoepner, Ronald

Developed as part of a competency-based curriculum in automotive mechanics which is usable by students at both the secondary and postsecondary levels, this learning package focuses on automotive electrical systems. It is the first unit to be published in a series of eight which will cover the eight subject areas on the national certification…

49.6 Gb/s direct detection DMT transmission over 40 km single mode fibre using an electrically packaged silicon photonic modulator.

PubMed

Lacava, C; Cardea, I; Demirtzioglou, I; Khoja, A E; Ke, Li; Thomson, D J; Ruan, X; Zhang, F; Reed, G T; Richardson, D J; Petropoulos, P

2017-11-27

We present the characterization of a silicon Mach-Zehnder modulator with electrical packaging and show that it exhibits a large third-order intermodulation spurious-free dynamic range (> 100 dB Hz 2/3 ). This characteristic renders the modulator particularly suitable for the generation of high spectral efficiency discrete multi-tone signals and we experimentally demonstrate a single-channel, direct detection transmission system operating at 49.6 Gb/s, exhibiting a baseband spectral efficiency of 5 b/s/Hz. Successful transmission is demonstrated over various lengths of single mode fibre up to 40 km, without the need of any amplification or dispersion compensation.

Optical Design of Plant Canopy Measurement System and Fabrication of Two-Dimensional High-Speed Metal-Semiconductor-Metal Photodetector Arrays

NASA Technical Reports Server (NTRS)

Sarto, Anthony; VanZeghbroeck, Bart; Vanderbilt, Vern C.

1996-01-01

Electrical and optical designs for the prototype plant canopy architecture measurement system, including specified component and parts lists, are presented. Six single Metal-Semiconductor-Metal (MSM) detectors are mounted in high-speed packages.

IEEE Validation of the Continuing Education Achievement of Engineers Registry System. Procedures for Use with a CPT 8000 Word Processor and Communications Package.

ERIC Educational Resources Information Center

Institute of Electrical and Electronics Engineers, Inc., New York, NY.

The Institute of Electrical and Electronics Engineers (IEEE) validation program is designed to motivate persons practicing in electrical and electronics engineering to pursue quality technical continuing education courses offered by any responsible sponsor. The rapid acceptance of the validation program necessitated the additional development of a…

Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment

PubMed Central

Jeong, Seung Hee; Chen, Si; Huo, Jinxing; Gamstedt, Erik Kristofer; Liu, Johan; Zhang, Shi-Li; Zhang, Zhi-Bin; Hjort, Klas; Wu, Zhigang

2015-01-01

Stretchable electronics and soft robotics have shown unsurpassed features, inheriting remarkable functions from stretchable and soft materials. Electrically conductive and mechanically stretchable materials based on composites have been widely studied for stretchable electronics as electrical conductors using various combinations of materials. However, thermally tunable and stretchable materials, which have high potential in soft and stretchable thermal devices as interface or packaging materials, have not been sufficiently studied. Here, a mechanically stretchable and electrically insulating thermal elastomer composite is demonstrated, which can be easily processed for device fabrication. A liquid alloy is embedded as liquid droplet fillers in an elastomer matrix to achieve softness and stretchability. This new elastomer composite is expected useful to enhance thermal response or efficiency of soft and stretchable thermal devices or systems. The thermal elastomer composites demonstrate advantages such as thermal interface and packaging layers with thermal shrink films in transient and steady-state cases and a stretchable temperature sensor. PMID:26671673

Symmetric miniaturized heating system for active microelectronic devices.

PubMed

McCracken, Michael; Mayer, Michael; Jourard, Isaac; Moon, Jeong-Tak; Persic, John

2010-07-01

To qualify interconnect technologies such as microelectronic fine wire bonds for mass production of integrated circuit (IC) packages, it is necessary to perform accelerated aging tests, e.g., to age a device at an elevated temperature or to subject the device to thermal cycling and measure the decrease of interconnect quality. There are downsides to using conventional ovens for this as they are relatively large and have relatively slow temperature change rates, and if electrical connections are required between monitoring equipment and the device being heated, they must be located inside the oven and may be aged by the high temperatures. Addressing these downsides, a miniaturized heating system (minioven) is presented, which can heat individual IC packages containing the interconnects to be tested. The core of this system is a piece of copper cut from a square shaped tube with high resistance heating wire looped around it. Ceramic dual in-line packages are clamped against either open end of the core. One package contains a Pt100 temperature sensor and the other package contains the device to be aged placed in symmetry to the temperature sensor. According to the temperature detected by the Pt100, a proportional-integral-derivative controller adjusts the power supplied to the heating wire. The system maintains a dynamic temperature balance with the core hot and the two symmetric sides with electrical connections to the device under test at a cooler temperature. Only the face of the package containing the device is heated, while the socket holding it remains below 75 degrees C when the oven operates at 200 degrees C. The minioven can heat packages from room temperature up to 200 degrees C in less than 5 min and maintain this temperature at 28 W power. During long term aging, a temperature of 200 degrees C was maintained for 1120 h with negligible resistance change of the heating wires after 900 h (heating wire resistance increased 0.2% over the final 220 h). The device is also subjected to 5700 thermal cycles between 55 and 195 degrees C, demonstrating reliability under thermal cycling.

Power Analysis of an Automated Dynamic Cone Penetrometer

DTIC Science & Technology

2015-09-01

temperature and b) as a function of load current at 21 °C ..3 Fig. 4 K33 stepper motor candidate in the standard NEMA 34 package .........5 Fig. 5 Analytical...will be assessed. Fig. 4 K33 stepper motor candidate in the standard NEMA 34 package 3. Analyses Analysis of the mechanical system begins with the...DCP dynamic cone penetrometer EMF electromotive force NEMA National Electrical Manufacturers Association 20 1 DEFENSE TECH INFO CTR

Advanced packaging for Integrated Micro-Instruments

NASA Technical Reports Server (NTRS)

Lyke, James L.

1995-01-01

The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.

The Effect of Conceptual Diagrams on Aviation Mechanics' Technical Systems Understanding.

ERIC Educational Resources Information Center

Satchwell, Richard E.; Johnson, Scott D.

A quasi-experimental study explored the effect of functional flow diagrams on technical system understanding. An individualized field training package which contained schematic diagrams that illustrated an aircraft's electrical system was complimented with functional flow diagrams. In a 4-week treatment, a control group of 10 students enrolled in…

Nonlinear conductivity in silicon nitride

NASA Astrophysics Data System (ADS)

Tuncer, Enis

2017-08-01

To better comprehend electrical silicon-package interaction in high voltage applications requires full characterization of the electrical properties of dielectric materials employed in wafer and package level design. Not only the packaging but wafer level dielectrics, i.e. passivation layers, would experience high electric fields generated by the voltage applied pads. In addition the interface between the passivation layer and a mold compound might develop space charge because of the mismatch in electrical properties of the materials. In this contribution electrical properties of a thin silicon nitride (Si3N4) dielectric is reported as a function of temperature and electric field. The measured values later analyzed using different temperature dependent exponential expressions and found that the Mott variable range hopping conduction model was successful to express the data. A full temperature/electric field dependency of conductivity is generated. It was found that the conduction in Si3N4 could be expressed like a field ionization or Fowler-Nordheim mechanism.

Long Duration Exposure Facility (LDEF) low-temperature heat pipe experiment package power system results

NASA Technical Reports Server (NTRS)

Tiller, Smith E.; Sullivan, David

1992-01-01

An overview of a self-contained Direct Energy Transfer Power System which was developed to provide power to the Long Duration Exposure Facility (LDEF) Low-Temperature Heat Pipe Experiment Package is presented. The power system operated successfully for the entire mission. Data recorded by the onboard recorder shows that the system operated within design specifications. Other than unanticipated overcharging of the battery, the power system operated as expected for nearly 32,000 low earth orbit cycles, and was still operational when tested after the LDEF recovery. Some physical damage was sustained by the solar array panels due to micrometeoroid hits, but there were not electrical failures.

Bonneville Power Administration Transmission System Vegetation Management Program Draft Environmental Impact Statement

DOE Office of Scientific and Technical Information (OSTI.GOV)

N /A

Bonneville is responsible for maintaining a network of 24,000 kilometers (km) or 15,000 miles (mi.) of electric transmission lines and 350 substations in a region of diverse vegetation. This vegetation can interfere with electric power flow, pose safety problems for us and the public, and interfere with our ability to maintain these facilities. We need to (1) keep vegetation away from the electric facilities; (2) increase the program efficiency and consistency; (3) review herbicide use (under increased public scrutiny); and (4) maximize the range of tools we can use while minimizing environmental impact (Integrated Vegetation Management). This DEIS establishes Planningmore » Steps for managing vegetation for specific projects (to be tiered to this EIS). In addition to No Action (current practice), alternatives are presented for Rights-of-way, Electric Yards, and Non-electric Facilities (landscaping, work yards). Four vegetation control methods are analyzed: manual, mechanical, herbicide, and biological. Also evaluated are 24 herbicide active ingredients and 4 herbicide application techniques (spot, localized, broadcast, and aerial). For rights-of-way, they consider three sets of alternatives: alternative management approaches (time-driven or establishing low-growing plant communities); alternative method packages; and, if herbicides are in a methods package, alternative vegetation selections (noxious weeds, deciduous, or any vegetation). For electric yards, one herbicide-use alternative is considered. For non-electric facilities, two method package alternatives are considered. For rights-of-way, the environmentally preferred alternative(s) would use manual, mechanical, and biological control methods, as well as spot and localized herbicide applications for noxious and deciduous plant species; the BPA-preferred alternative(s) would add broadcast and aerial herbicide applications, and would use herbicides on any vegetation. Both would factor a management approach that fosters low-growing plant communities.« less

Packaging of structural health monitoring components

NASA Astrophysics Data System (ADS)

Kessler, Seth S.; Spearing, S. Mark; Shi, Yong; Dunn, Christopher T.

2004-07-01

Structural Health Monitoring (SHM) technologies have the potential to realize economic benefits in a broad range of commercial and defense markets. Previous research conducted by Metis Design and MIT has demonstrated the ability of Lamb waves methods to provide reliable information regarding the presence, location and type of damage in composite specimens. The present NSF funded program was aimed to study manufacturing, packaging and interface concepts for critical SHM components. The intention is to be able to cheaply manufacture robust actuating/sensing devices, and isolate them from harsh operating environments including natural, mechanical, or electrical extremes. Currently the issues related to SHM system durability have remained undressed. During the course of this research several sets of test devices were fabricated and packaged to protect the piezoelectric component assemblies for robust operation. These assemblies were then tested in hot and wet conditions, as well as in electrically noisy environments. Future work will aim to package the other supporting components such as the battery and wireless chip, as well as integrating all of these components together for operation. SHM technology will enable the reduction or complete elimination of scheduled inspections, and will allow condition-based maintenance for increased reliability and reduced overall life-cycle costs.

Military Curricula for Vocational & Technical Education. Basic Electricity and Electronics Individualized Learning System. CANTRAC A-100-0010. Module Eleven: Capacitance. Study Booklet.

ERIC Educational Resources Information Center

Chief of Naval Education and Training Support, Pensacola, FL.

This individualized learning module on capacitance is one in a series of modules for a course in basic electricity and electronics. The course is one of a number of military-developed curriculum packages selected for adaptation to vocational instructional and curriculum development in a civilian setting. Seven lessons are included in the module:…

Military Curricula for Vocational & Technical Education. Basic Electricity and Electronics Individualized Learning System. CANTRAC A-100-0010. Module Two: Voltage. Study Booklet.

ERIC Educational Resources Information Center

Chief of Naval Education and Training Support, Pensacola, FL.

This individualized learning module on voltage is one in a series of modules for a course in basic electricity and electronics. The course is one of a number of military-developed curriculum packages selected for adaptation to vocational instructional and curriculum development in a civilian setting. Six lessons are included in the module: (1)…

Military Curricula for Vocational & Technical Education. Basic Electricity and Electronics Individualized Learning System. CANTRAC A-100-0010. Module Ten: Transformers. Study Booklet.

ERIC Educational Resources Information Center

Chief of Naval Education and Training Support, Pensacola, FL.

This individualized learning module on transformers is one in a series of modules for a course in basic electricity and electronics. The course is one of a number of military-developed curriculum packages selected for adaptation to vocational instructional and curriculum development in a civilian setting. Six lessons are included in the module:…

Military Curricula for Vocational & Technical Education. Basic Electricity and Electronics Individualized Learning System. CANTRAC A-100-0010. Module Six: Parallel Circuits. Study Booklet.

ERIC Educational Resources Information Center

Chief of Naval Education and Training Support, Pensacola, FL.

This individualized learning module on parallel circuits is one in a series of modules for a course in basic electricity and electronics. The course is one of a number of military-developed curriculum packages selected for adaptation to vocational instructional and curriculum development in a civilian setting. Four lessons are included in the…

The Development of a Small High Speed Steam Microturbine Generator System

NASA Astrophysics Data System (ADS)

Alford, Adrian; Nichol, Philip; Frisby, Ben

2015-08-01

The efficient use of energy is paramount in every kind of business today. Steam is a widely used energy source. In many situations steam is generated at high pressures and then reduced in pressure through control valves before reaching point of use. An opportunity was identified to convert some of the energy at the point of pressure reduction into electricity. This can be accomplished using steam turbines driving alternators on large scale systems. To take advantage of a market identified for small scale systems, a microturbine generator was designed based on a small high speed turbo machine. This gave rise to a number of challenges which are described with the solutions adopted. The challenges included aerodynamic design of high efficiency impellers, sealing of a high speed shaft, thrust control and material selection to avoid steam erosion. The machine was packaged with a sophisticated control system to allow connection to the electricity grid. Some of the challenges in packaging the machine are also described. The Spirax Sarco TurboPower has now concluded performance and initial endurance tests which are described with a summary of the results.

Demonstration of a Packaged Capacitive Pressure Sensor System Suitable for Jet Turbofan Engine Health Monitoring

NASA Technical Reports Server (NTRS)

Scardelletti, Maximilian C.; Jordan, Jennifer L.; Meredith, Roger D.; Harsh, Kevin; Pilant, Evan; Usrey, Michael W.; Beheim, Glenn M.; Hunter, Gary W.; Zorman, Christian A.

2016-01-01

In this paper, the development and characterization of a packaged pressure sensor system suitable for jet engine health monitoring is demonstrated. The sensing system operates from 97 to 117 MHz over a pressure range from 0 to 350 psi and a temperature range from 25 to 500 deg. The sensing system consists of a Clapp-type oscillator that is fabricated on an alumina substrate and is comprised of a Cree SiC MESFET, MIM capacitors, a wire-wound inductor, chip resistors and a SiCN capacitive pressure sensor. The pressure sensor is located in the LC tank circuit of the oscillator so that a change in pressure causes a change in capacitance, thus changing the resonant frequency of the sensing system. The chip resistors, wire-wound inductors and MIM capacitors have all been characterized at temperature and operational frequency, and perform with less than 5% variance in electrical performance. The measured capacitive pressure sensing system agrees very well with simulated results. The packaged pressure sensing system is specifically designed to measure the pressure on a jet turbofan engine. The packaged system can be installed by way of borescope plug adaptor fitted to a borescope port exposed to the gas path of a turbofan engine.

A permanent seismic station beneath the Ocean Bottom

NASA Astrophysics Data System (ADS)

Harris, David; Cessaro, Robert K.; Duennebier, Fred K.; Byrne, David A.

1987-03-01

The Hawaii Institute of Geophysics began development of the Ocean Subbottom Seisometer (OSS) system in 1978, and OSS systems were installed in four locations between 1979 and 1982. The OSS system is a permanent, deep ocean borehole seismic recording system composed of a borehole sensor package (tool), an electromechanical cable, recorder package, and recovery system. Installed near the bottom of a borehole (drilled by the D/V Glomar Challenger), the tool contains three orthogonal, 4.5-Hz geophones, two orthogonal tilt meters; and a temperature sensor. Signals from these sensors are multiplexed, digitized (with a floating point technique), and telemetered through approximately 10 km of electromechanical cable to a recorder package located near the ocean bottom. Electrical power for the tool is supplied from the recorder package. The digital seismic signals are demultiplexed, converted back to analog form, processed through an automatic gain control (AGC) circuit, and recorded along with a time code on magnetic tape cassettes in the recorder package. Data may be recorded continuously for up to two months in the self-contained recorder package. Data may also be recorded in real time (digital formal) during the installation and subsequent recorder package servicing. The recorder package is connected to a submerged recovery buoy by a length of bouyant polypropylene rope. The anchor on the recovery buoy is released by activating either of the acoustical command releases. The polypropylene rope may also be seized with a grappling hook to effect recovery. The recorder package may be repeatedly serviced as long as the tool remains functional A wide range of data has been recovered from the OSS system. Recovered analog records include signals from natural seismic sources such as earthquakes (teleseismic and local), man-made seismic sources such as refraction seismic shooting (explosives and air cannons), and nuclear tests. Lengthy continuous recording has permitted analysis of wideband noise levels, and the slowly varying parameters, temperature and tilt.

Compact gasoline fuel processor for passenger vehicle APU

NASA Astrophysics Data System (ADS)

Severin, Christopher; Pischinger, Stefan; Ogrzewalla, Jürgen

Due to the increasing demand for electrical power in today's passenger vehicles, and with the requirements regarding fuel consumption and environmental sustainability tightening, a fuel cell-based auxiliary power unit (APU) becomes a promising alternative to the conventional generation of electrical energy via internal combustion engine, generator and battery. It is obvious that the on-board stored fuel has to be used for the fuel cell system, thus, gasoline or diesel has to be reformed on board. This makes the auxiliary power unit a complex integrated system of stack, air supply, fuel processor, electrics as well as heat and water management. Aside from proving the technical feasibility of such a system, the development has to address three major barriers:start-up time, costs, and size/weight of the systems. In this paper a packaging concept for an auxiliary power unit is presented. The main emphasis is placed on the fuel processor, as good packaging of this large subsystem has the strongest impact on overall size. The fuel processor system consists of an autothermal reformer in combination with water-gas shift and selective oxidation stages, based on adiabatic reactors with inter-cooling. The configuration was realized in a laboratory set-up and experimentally investigated. The results gained from this confirm a general suitability for mobile applications. A start-up time of 30 min was measured, while a potential reduction to 10 min seems feasible. An overall fuel processor efficiency of about 77% was measured. On the basis of the know-how gained by the experimental investigation of the laboratory set-up a packaging concept was developed. Using state-of-the-art catalyst and heat exchanger technology, the volumes of these components are fixed. However, the overall volume is higher mainly due to mixing zones and flow ducts, which do not contribute to the chemical or thermal function of the system. Thus, the concept developed mainly focuses on minimization of those component volumes. Therefore, the packaging utilizes rectangular catalyst bricks and integrates flow ducts into the heat exchangers. A concept is presented with a 25 l fuel processor volume including thermal isolation for a 3 kW el auxiliary power unit. The overall size of the system, i.e. including stack, air supply and auxiliaries can be estimated to 44 l.

Isotope Brayton electric power system for the 500 to 2500 watt range.

NASA Technical Reports Server (NTRS)

Macosko, R. P.; Barna, G. J.; Block, H. B.; Ingle, B. D.

1972-01-01

An extensive study was conducted at the Lewis Research Center to evaluate an isotope Brayton electric power system for use in the 500 to 2500 W power range. The study emphasized overall system simplicity in order to reduce parasitic power losses and improve system reliability. The study included detailed parametric cycle analysis, conceptual component designs, and evaluation of system packaging. The study has resulted in the selection of a single-loop system (gas) with six major components including one rotating unit. Calculated net system efficiency varies from 23 to 28% over the power range. The use of the Pu-238 heat source being developed for the Multi-Hundred-Watt Radioisotope Thermoelectric Generator program was assumed.

Reliable aluminum contact formation by electrostatic bonding

NASA Astrophysics Data System (ADS)

Kárpáti, T.; Pap, A. E.; Radnóczi, Gy; Beke, B.; Bársony, I.; Fürjes, P.

2015-07-01

The paper presents a detailed study of a reliable method developed for aluminum fusion wafer bonding assisted by the electrostatic force evolving during the anodic bonding process. The IC-compatible procedure described allows the parallel formation of electrical and mechanical contacts, facilitating a reliable packaging of electromechanical systems with backside electrical contacts. This fusion bonding method supports the fabrication of complex microelectromechanical systems (MEMS) and micro-opto-electromechanical systems (MOEMS) structures with enhanced temperature stability, which is crucial in mechanical sensor applications such as pressure or force sensors. Due to the applied electrical potential of  -1000 V the Al metal layers are compressed by electrostatic force, and at the bonding temperature of 450 °C intermetallic diffusion causes aluminum ions to migrate between metal layers.

Space Shuttle Projects

NASA Image and Video Library

2000-11-30

Nearby waters reflect the flames of the Space Shuttle Endeavor as she lifts off November 30, 2000, carrying the STS-97 crew of five. The STS-97 mission's primary objective was the delivery, assembly, and activation of the U.S. electrical power system onboard the International Space Station (ISS). The electrical power system, which is built into a 73-meter (240-foot) long solar array structure, consists of solar arrays, radiators, batteries, and electronics. The entire 15.4-metric ton (17-ton) package is called the P6 Integrated Truss Segment and is the heaviest and largest element yet delivered to the station aboard a space shuttle. The electrical system will eventually provide the power necessary for the first ISS crews to live and work in the U.S. segment.

Space Shuttle Projects

NASA Image and Video Library

2000-11-30

Nearby waters reflect the flames of the Space Shuttle Endeavor as she lifts off November 30, 2000 carrying the STS-97 crew of five. The STS-97 mission's primary objective was the delivery, assembly, and activation of the U.S. electrical power system onboard the International Space Station (ISS). The electrical power system, which is built into a 73-meter (240-foot) long solar array structure, consists of solar arrays, radiators, batteries, and electronics. The entire 15.4-metric ton (17-ton) package is called the P6 Integrated Truss Segment, and is the heaviest and largest element yet delivered to the station aboard a space shuttle. The electrical system will eventually provide the power necessary for the first ISS crews to live and work in the U.S. segment.

Flexible packaging of solid-state integrated circuit chips with elastomeric microfluidics

PubMed Central

Zhang, Bowei; Dong, Quan; Korman, Can E.; Li, Zhenyu; Zaghloul, Mona E.

2013-01-01

A flexible technology is proposed to integrate smart electronics and microfluidics all embedded in an elastomer package. The microfluidic channels are used to deliver both liquid samples and liquid metals to the integrated circuits (ICs). The liquid metals are used to realize electrical interconnects to the IC chip. This avoids the traditional IC packaging challenges, such as wire-bonding and flip-chip bonding, which are not compatible with current microfluidic technologies. As a demonstration we integrated a CMOS magnetic sensor chip and associate microfluidic channels on a polydimethylsiloxane (PDMS) substrate that allows precise delivery of small liquid samples to the sensor. Furthermore, the packaged system is fully functional under bending curvature radius of one centimetre and uniaxial strain of 15%. The flexible integration of solid-state ICs with microfluidics enables compact flexible electronic and lab-on-a-chip systems, which hold great potential for wearable health monitoring, point-of-care diagnostics and environmental sensing among many other applications.

Military Curricula for Vocational & Technical Education. Basic Electricity and Electronics Individualized Learning System. CANTRAC A-100-0010. Module Five: Relationships of Current, Voltage, and Resistance. Study Booklet.

ERIC Educational Resources Information Center

Chief of Naval Education and Training Support, Pensacola, FL.

This individualized learning module on the relationships of current, voltage, and resistance is one in a series of modules for a course in basic electricity and electronics. The course is one of a number of military-developed curriculum packages selected for adaptaticn to vocational instructional and curriculum development in a civilian setting.…

Effect on moisture permeability of typewriting on unit dose package surfaces.

PubMed

Rackson, J T; Zellhofer, M J; Birmingham, P H

1984-10-01

The effects of typewriting on labels of two unit dose packages with respect to moisture permeability were examined. Using an electric typewriter, a standard label format was imprinted on two different types of class A unit dose packages: (1) a heat-sealed paper-backed foil and cellofilm strip pouch, and (2) a copolyester and polyethylene multiple-cup blister with a heat-sealed paper-backed foil and cellofilm cover. The labels were typed at various typing-element impact settings. The official USP test for water permeation was then performed on typed packages and untyped control packages. The original untyped packages were confirmed to be USP class A quality. The packages for which successively harder impact settings were used showed a corresponding increase in moisture permeability. This resulted in a lowering of USP package ratings from class A to class B and D, some of which would be unsuitable for use in any unit dose system under current FDA repackaging standards. Typing directly onto the label of a unit dose package before it is sealed will most likely damage the package and possibly make it unfit for use. Pharmacists who must type labels for the unit dose packages studied should use the lowest possible typewriter impact setting and test for damage using the USP moisture-permeation test.

Silicon-based products and solutions

NASA Astrophysics Data System (ADS)

Painchaud, Y.; Poulin, M.; Pelletier, F.; Latrasse, C.; Gagné, J.-F.; Savard, S.; Robidoux, G.; Picard, M.-.; Paquet, S.; Davidson, C.-.; Pelletier, M.; Cyr, M.; Paquet, C.; Guy, M.; Morsy-Osman, M.; Chagnon, M.; Plant, D. V.

2014-03-01

TeraXion started silicon photonics activities aiming at developing building blocks for new products and customized solutions. Passive and active devices have been developed including MMI couplers, power splitters, Bragg grating filters, high responsivity photodetectors, high speed modulators and variable optical attenuators. Packaging solutions including fiber attachment and hybrid integration using flip-chip were also developed. More specifically, a compact packaged integrated coherent receiver has been realized. Good performances were obtained as demonstrated by our system tests results showing transmission up to 4800 km with BER below hard FEC threshold. The package size is small but still limited by the electrical interface. Migrating to more compact RF interface would allow realizing the full benefit of this technology.

WASTE PACKAGE REMEDIATION SYSTEM DESCRIPTION DOCUMENT

DOE Office of Scientific and Technical Information (OSTI.GOV)

N.D. Sudan

2000-06-22

The Waste Package Remediation System remediates waste packages (WPs) and disposal containers (DCs) in one of two ways: preparation of rejected DC closure welds for repair or opening of the DC/WP. DCs are brought to the Waste Package Remediation System for preparation of rejected closure welds if testing of the closure weld by the Disposal Container Handling System indicates an unacceptable, but repairable, welding flaw. DC preparation of rejected closure welds will require removal of the weld in such a way that the Disposal Container Handling System may resume and complete the closure welding process. DCs/WPs are brought to themore » Waste Package Remediation System for opening if the Disposal Container Handling System testing of the DC closure weld indicates an unrepairable welding flaw, or if a WP is recovered from the subsurface repository because suspected damage to the WP or failure of the WP has occurred. DC/WP opening will require cutting of the DC/WP such that a temporary seal may be installed and the waste inside the DC/WP removed by another system. The system operates in a Waste Package Remediation System hot cell located in the Waste Handling Building that has direct access to the Disposal Container Handling System. One DC/WP at a time can be handled in the hot cell. The DC/WP arrives on a transfer cart, is positioned within the cell for system operations, and exits the cell without being removed from the cart. The system includes a wide variety of remotely operated components including a manipulator with hoist and/or jib crane, viewing systems, machine tools for opening WPs, and equipment used to perform pressure and gas composition sampling. Remotely operated equipment is designed to facilitate DC/WP decontamination and hot cell equipment maintenance, and interchangeable components are provided where appropriate. The Waste Package Remediation System interfaces with the Disposal Container Handling System for the receipt and transport of WPs and DCs. The Waste Handling Building System houses the system, and provides the facility, safety, and auxiliary systems required to support operations. The system receives power from the Waste Handling Building Electrical System. The system also interfaces with the various DC systems.« less

Changes in electrical and thermal parameters of led packages under different current and heating stresses

NASA Astrophysics Data System (ADS)

Jayawardena, Adikaramge Asiri

The goal of this dissertation is to identify electrical and thermal parameters of an LED package that can be used to predict catastrophic failure real-time in an application. Through an experimental study the series electrical resistance and thermal resistance were identified as good indicators of contact failure of LED packages. This study investigated the long-term changes in series electrical resistance and thermal resistance of LED packages at three different current and junction temperature stress conditions. Experiment results showed that the series electrical resistance went through four phases of change; including periods of latency, rapid increase, saturation, and finally a sharp decline just before failure. Formation of voids in the contact metallization was identified as the underlying mechanism for series resistance increase. The rate of series resistance change was linked to void growth using the theory of electromigration. The rate of increase of series resistance is dependent on temperature and current density. The results indicate that void growth occurred in the cap (Au) layer, was constrained by the contact metal (Ni) layer, preventing open circuit failure of contact metal layer. Short circuit failure occurred due to electromigration induced metal diffusion along dislocations in GaN. The increase in ideality factor, and reverse leakage current with time provided further evidence to presence of metal in the semiconductor. An empirical model was derived for estimation of LED package failure time due to metal diffusion. The model is based on the experimental results and theories of electromigration and diffusion. Furthermore, the experimental results showed that the thermal resistance of LED packages increased with aging time. A relationship between thermal resistance change rate, with case temperature and temperature gradient within the LED package was developed. The results showed that dislocation creep is responsible for creep induced plastic deformation in the die-attach solder. The temperatures inside the LED package reached the melting point of die-attach solder due to delamination just before catastrophic open circuit failure. A combined model that could estimate life of LED packages based on catastrophic failure of thermal and electrical contacts is presented for the first time. This model can be used to make a-priori or real-time estimation of LED package life based on catastrophic failure. Finally, to illustrate the usefulness of the findings from this thesis, two different implementations of real-time life prediction using prognostics and health monitoring techniques are discussed.

Shock Prevention

NASA Technical Reports Server (NTRS)

1978-01-01

The electrician pictured is installing a General Electric Ground Fault Interrupter (GFI), a device which provides protection against electrical shock in the home or in industrial facilities. Shocks due to defective wiring in home appliances or other electrical equipment can cause severe burns, even death. As a result, the National Electrical Code now requires GFIs in all new homes constructed. This particular type of GFI employs a sensing element which derives from technology acquired in space projects by SCI Systems, Inc., Huntsville, Alabama, producer of sensors for GE and other manufacturers of GFI equipment. The sensor is based on the company's experience in developing miniaturized circuitry for space telemetry and other spacecraft electrical systems; this experience enabled SCI to package interruptor circuitry in the extremely limited space available and to produce sensory devices at practicable cost. The tiny sensor measures the strength of the electrical current and detects current differentials that indicate a fault in the functioning of an electrical system. The sensing element then triggers a signal to a disconnect mechanism in the GFI, which cuts off the current in the faulty circuit.

Novel Micro ElectroMechanical Systems (MEMS) Packaging for the Skin of the Satellite

NASA Technical Reports Server (NTRS)

Darrin, M. Ann; Osiander, Robert; Lehtonen, John; Farrar, Dawnielle; Douglas, Donya; Swanson, Ted

2004-01-01

This paper includes a discussion of the novel packaging techniques that are needed to place MEMS based thermal control devices on the skin of various satellites, eliminating the concern associated with potential particulates &om integration and test or the launch environment. Protection of this MEMS based thermal device is achieved using a novel polymer that is both IR transmissive and electrically conductive. This polymer was originally developed and qualified for space flight application by NASA at the Langley Research Center. The polymer material, commercially known as CPI, is coated with a thin layer of ITO and sandwiched between two window-like frames. The packaging of the MEMS based radiator assembly offers the benefits of micro-scale devices in a chip on board fashion, with the level of protection generally found in packaged parts.

Overview of NASA Langley's Piezoelectric Ceramic Packaging Technology and Applications

NASA Technical Reports Server (NTRS)

Bryant, Robert G.

2007-01-01

Over the past decade, NASA Langley Research Center (LaRC) has developed several actuator packaging concepts designed to enhance the performance of commercial electroactive ceramics. NASA LaRC focused on properly designed actuator and sensor packaging for the following reasons, increased durability, protect the working material from the environment, allow for proper mechanical and electrical contact, afford "ready to use" mechanisms that are scalable, and develop fabrication methodology applicable to any active material of the same physical class. It is more cost effective to enhance or tailor the performance of existing systems, through innovative packaging, than to develop, test and manufacture new materials. This approach led to the development of several solid state actuators that include THUNDER, the Macrofiber Composite or (MFC) and the Radial Field Diaphragm or (RFD). All these actuators are fabricated using standard materials and processes derived from earlier concepts. NASA s fabrication and packaging technology as yielded, piezoelectric actuators and sensors that are easy to implement, reliable, consistent in properties, and of lower cost to manufacture in quantity, than their predecessors (as evidenced by their continued commercial availability.) These piezoelectric actuators have helped foster new research and development in areas involving computational modeling, actuator specific refinements, and engineering system redesign which led to new applications for piezo-based devices that replace traditional systems currently in use.

Examples of finite element mesh generation using SDRC IDEAS

NASA Technical Reports Server (NTRS)

Zapp, John; Volakis, John L.

1990-01-01

IDEAS (Integrated Design Engineering Analysis Software) offers a comprehensive package for mechanical design engineers. Due to its multifaceted capabilities, however, it can be manipulated to serve the needs of electrical engineers, also. IDEAS can be used to perform the following tasks: system modeling, system assembly, kinematics, finite element pre/post processing, finite element solution, system dynamics, drafting, test data analysis, and project relational database.

Preliminary design data package, appendix C. [hybrid electric vehicles

NASA Technical Reports Server (NTRS)

1979-01-01

The data and documentation required to define the preliminary design of a near term hybrid vehicle and to quantify its operational characteristics are presented together with the assumptions and rationale behind the design decisions. Aspects discussed include development requirements for the propulsion system, the chassis system, the body, and the vehicle systems. Particular emphasis is given to the controls, the heat engine, and the batteries.

Assessment of alternative power sources for mobile mining machinery

NASA Technical Reports Server (NTRS)

Cairelli, J. E.; Tomazic, W. A.; Evans, D. G.; Klann, J. L.

1981-01-01

Alternative mobile power sources for mining applications were assessed. A wide variety of heat engines and energy systems was examined as potential alternatives to presently used power systems. The present mobile power systems are electrical trailing cable, electrical battery, and diesel - with diesel being largely limited in the United States to noncoal mines. Each candidate power source was evaluated for the following requirements: (1) ability to achieve the duty cycle; (2) ability to meet Government regulations; (3) availability (production readiness); (4) market availability; and (5) packaging capability. Screening reduced the list of candidates to the following power sources: diesel, stirling, gas turbine, rankine (steam), advanced electric (batteries), mechanical energy storage (flywheel), and use of hydrogen evolved from metal hydrides. This list of candidates is divided into two classes of alternative power sources for mining applications, heat engines and energy storage systems.

Assessment of alternative power sources for mobile mining machinery

NASA Astrophysics Data System (ADS)

Cairelli, J. E.; Tomazic, W. A.; Evans, D. G.; Klann, J. L.

1981-12-01

Alternative mobile power sources for mining applications were assessed. A wide variety of heat engines and energy systems was examined as potential alternatives to presently used power systems. The present mobile power systems are electrical trailing cable, electrical battery, and diesel - with diesel being largely limited in the United States to noncoal mines. Each candidate power source was evaluated for the following requirements: (1) ability to achieve the duty cycle; (2) ability to meet Government regulations; (3) availability (production readiness); (4) market availability; and (5) packaging capability. Screening reduced the list of candidates to the following power sources: diesel, stirling, gas turbine, rankine (steam), advanced electric (batteries), mechanical energy storage (flywheel), and use of hydrogen evolved from metal hydrides. This list of candidates is divided into two classes of alternative power sources for mining applications, heat engines and energy storage systems.

Device and Container for Reheating and Sterilization

NASA Technical Reports Server (NTRS)

Sastry, Sudhir K.; Heskitt, Brian F.; Jun, Soojin; Marcy, Joseph E.; Mahna, Ritesh

2012-01-01

Long-duration space missions require the development of improved foods and novel packages that do not represent a significant disposal issue. In addition, it would also be desirable if rapid heating technologies could be used on Earth as well, to improve food quality during a sterilization process. For this purpose, a package equipped with electrodes was developed that will enable rapid reheating of contents via ohmic heating to serving temperature during space vehicle transit. Further, the package is designed with a resealing feature, which enables the package, once used, to contain and sterilize waste, including human waste for storage prior to jettison during a long-duration mission. Ohmic heating is a technology that has been investigated on and off for over a century. Literature indicates that foods processed by ohmic heating are of superior quality to their conventionally processed counterparts. This is due to the speed and uniformity of ohmic heating, which minimizes exposure of sensitive materials to high temperatures. In principle, the material may be heated rapidly to sterilization conditions, cooled rapidly, and stored. The ohmic heating device herein is incorporated within a package. While this by itself is not novel, a reusable feature also was developed with the intent that waste may be stored and re-sterilized within the packages. These would then serve a useful function after their use in food processing and storage. The enclosure should be designed to minimize mass (and for NASA's purposes, Equivalent System Mass, or ESM), while enabling the sterilization function. It should also be electrically insulating. For this reason, Ultem high-strength, machinable electrical insulator was used.

Bonneville Power Administration Transmission System Vegetation Management Program - Final Environmental Impact Statement

DOE Office of Scientific and Technical Information (OSTI.GOV)

N /A

Bonneville is responsible for maintaining a network of 24,000 kilometers (km) or 15,000 miles (mi.) of electric transmission lines and 350 substations in a region of diverse vegetation. This vegetation can interfere with electric power flow, pose safety problems for us and the public, and interfere with our ability to maintain these facilities. We need to (1) keep vegetation away from our electric facilities; (2) increase our program efficiency and consistency; (3) review herbicide use (under increased public scrutiny); and (4) maximize the range of tools we can use while minimizing environmental impact (Integrated Vegetation Management). This Final Environmental Impactmore » Statement (FEIS) establishes Planning Steps for managing vegetation for specific projects (to be tiered to this Environmental Impact Statement (EIS)). In addition to No Action (current practice), alternatives are presented for Rights-of-way, Electric Yards, and Non-electric Facilities (landscaping, work yards). Four vegetation control methods are analyzed manual, mechanical, herbicide, and biological. Also evaluated are 23 herbicide active ingredients and 4 herbicide application techniques (spot, localized, broadcast, and aerial). For rights-of-way, we consider three sets of alternatives: alternative management approaches (time-driven or establishing low-growing plant communities); alternative method packages; and, if herbicides are in a methods package, alternative vegetation selections (noxious weeds, deciduous, or any vegetation). For electric yards, one herbicide-use alternative is considered. For non-electric facilities, two method package alternatives are considered. For rights-of-way, the environmentally preferred alternative(s) would use manual, mechanical, and biological control methods, as well as spot and localized herbicide applications for noxious and deciduous plant species; the BPA-preferred alternative(s) would add broadcast and aerial herbicide applications, and would use herbicides on any vegetation. Both would favor a management approach that fosters low-growing plant communities.« less

Torsional Vibration Analysis of Reciprocating Compressor Trains driven by Induction Motors

NASA Astrophysics Data System (ADS)

Brunelli, M.; Fusi, A.; Grasso, F.; Pasteur, F.; Ussi, A.

2015-08-01

The dynamic study of electric motor driven compressors, for Oil&Gas (O&G) applications, are traditionally performed in two steps separating the mechanical and the electrical systems. The packager conducts a Torsional Vibration Analysis (TVA) modeling the mechanical system with a lumped parameter scheme, without taking into account the electrical part. The electric motor supplier later performs a source current pulsation analysis on the electric motor system, based on the TVA results. The mechanical and the electrical systems are actually linked by the electromagnetic effect. The effect of the motor air-gap on TVA has only recently been taken into account by adding a spring and a damper between motor and ground in the model. This model is more accurate than the traditional one, but is applicable only to the steady-state condition and still fails to consider the reciprocal effects between the two parts of the system. In this paper the torsional natural frequencies calculated using both the traditional and the new model have been compared. Furthermore, simulation of the complete system has been achieved through the use of LMS AMESim, multi-physics, one-dimensional simulation software that simultaneously solves the shafts rotation and electric motor voltage equation. Finally, the transient phenomena that occur during start-up have been studied.

Rugged microelectronic module package supports circuitry on heat sink

NASA Technical Reports Server (NTRS)

Johnson, A. L.

1966-01-01

Rugged module package for thin film hybrid microcircuits incorporated a rigid, thermally conductive support structure, which serves as a heat sink, and a lead wire block in which T-shaped electrical connectors are potted. It protects the circuitry from shock and vibration loads, dissipates internal heat, and simplifies electrical connections between adjacent modules.

Wave Making Resistance Characteristics of Trimaran Hulls

DTIC Science & Technology

2003-12-01

to increased emphasis on warships that can neutralize anti-access measures such as minefields, quiet diesel- electric submarines and swarms of small...package licensed by AMTEC Engineering. The reference coordinate system illustrated in Figure 3 and used by SWAN-2 must be selected such that the 0z

Space station WP-04 power system preliminary analysis and design document, volume 3

NASA Technical Reports Server (NTRS)

1986-01-01

Rocketdyne plans to generate a system level specification for the Space Station Electric Power System (EPS) in order to facilitate the usage, accountability, and tracking of overall system level requirements. The origins and status of the verification planning effort are traced and an overview of the Space Station program interactions are provided. The work package level interfaces between the EPS and the other Space Station work packages are outlined. A trade study was performed to determine the peaking split between PV and SD, and specifically to compare the inherent total peaking capability with proportionally shared peaking. In order to determine EPS cost drivers for the previous submittal of DRO2, the life cycle cost (LCC) model was run to identify the more significant costs and the factors contributing to them.

Thermal Performance Benchmarking: Annual Report

DOE Office of Scientific and Technical Information (OSTI.GOV)

Moreno, Gilbert

2016-04-08

The goal for this project is to thoroughly characterize the performance of state-of-the-art (SOA) automotive power electronics and electric motor thermal management systems. Information obtained from these studies will be used to: Evaluate advantages and disadvantages of different thermal management strategies; establish baseline metrics for the thermal management systems; identify methods of improvement to advance the SOA; increase the publicly available information related to automotive traction-drive thermal management systems; help guide future electric drive technologies (EDT) research and development (R&D) efforts. The performance results combined with component efficiency and heat generation information obtained by Oak Ridge National Laboratory (ORNL) maymore » then be used to determine the operating temperatures for the EDT components under drive-cycle conditions. In FY15, the 2012 Nissan LEAF power electronics and electric motor thermal management systems were benchmarked. Testing of the 2014 Honda Accord Hybrid power electronics thermal management system started in FY15; however, due to time constraints it was not possible to include results for this system in this report. The focus of this project is to benchmark the thermal aspects of the systems. ORNL's benchmarking of electric and hybrid electric vehicle technology reports provide detailed descriptions of the electrical and packaging aspects of these automotive systems.« less

Nuclear Electric Propulsion Application: RASC Mission Robotic Exploration of Venus

NASA Technical Reports Server (NTRS)

McGuire, Melissa L.; Borowski, Stanley K.; Packard, Thomas W.

2004-01-01

The following paper documents the mission and systems analysis portion of a study in which Nuclear Electric Propulsion (NEP) is used as the in-space transportation system to send a series of robotic rovers and atmospheric science airplanes to Venus in the 2020 to 2030 timeframe. As part of the NASA RASC (Revolutionary Aerospace Systems Concepts) program, this mission analysis is meant to identify future technologies and their application to far reaching NASA missions. The NEP systems and mission analysis is based largely on current technology state of the art assumptions. This study looks specifically at the performance of the NEP transfer stage when sending a series of different payload package point design options to Venus orbit.

Humidity-Induced Charge Leakage and Field Attenuation in Electric Field Microsensors

PubMed Central

Zhang, Haiyan; Fang, Dongming; Yang, Pengfei; Peng, Chunrong; Wen, Xiaolong; Xia, Shanhong

2012-01-01

The steady-state zero output of static electric field measuring systems often fluctuates, which is caused mainly by the finite leakage resistance of the water film on the surface of the electric field microsensor package. The water adsorption has been calculated using the Boltzmann distribution equation at various relative humidities for borosilicate glass and polytetrafluoroethylene surfaces. At various humidities, water film thickness has been calculated, and the induced charge leakage and field attenuation have been theoretically investigated. Experiments have been performed with microsensors to verify the theoretical predictions and the results are in good agreement. PMID:22666077

Systems analysis of Mars solar electric propulsion vehicles

NASA Technical Reports Server (NTRS)

Hickman, J. M.; Curtis, H. B.; Kenny, B. H.; Sefcik, R. J.

1990-01-01

Mission performance, mass, initial power, and cost are determined for solar electric propulsion vehicles across a range of payload masses, reference powers, and mission trajectories. Thick radiation shielding is added to arrays using indium phosphide or III-V multijunction solar cells to reduce the damage incurred through the radiation belts. Special assessments of power management and distribution systems, atmospheric drag, and energy storage are made. It is determined that atmospheric drag is of no great concern and that the energy storage used in countering drag is unnecessary. A scheme to package the arrays, masts, and ion thrusters into a single fairing is presented.

Advanced systems demonstration for utilization of biomass as an energy source. Volume 3: Equipment specifications

NASA Astrophysics Data System (ADS)

1980-10-01

Specifications are given for the shipping, marking, inspection, testing, and start up of equipment to be used in a proposed wood fuel cogeneration system in Maine. Couplings, mechanical drives, electric motors, spare parts, coatings, assembling, and materials handling and packaging are covered. Both OSHA and noise control regulations are included along with the ASME code.

PICSiP: new system-in-package technology using a high bandwidth photonic interconnection layer for converged microsystems

NASA Astrophysics Data System (ADS)

Tekin, Tolga; Töpper, Michael; Reichl, Herbert

2009-05-01

Technological frontiers between semiconductor technology, packaging, and system design are disappearing. Scaling down geometries [1] alone does not provide improvement of performance, less power, smaller size, and lower cost. It will require "More than Moore" [2] through the tighter integration of system level components at the package level. System-in-Package (SiP) will deliver the efficient use of three dimensions (3D) through innovation in packaging and interconnect technology. A key bottleneck to the implementation of high-performance microelectronic systems, including SiP, is the lack of lowlatency, high-bandwidth, and high density off-chip interconnects. Some of the challenges in achieving high-bandwidth chip-to-chip communication using electrical interconnects include the high losses in the substrate dielectric, reflections and impedance discontinuities, and susceptibility to crosstalk [3]. Obviously, the incentive for the use of photonics to overcome the challenges and leverage low-latency and highbandwidth communication will enable the vision of optical computing within next generation architectures. Supercomputers of today offer sustained performance of more than petaflops, which can be increased by utilizing optical interconnects. Next generation computing architectures are needed with ultra low power consumption; ultra high performance with novel interconnection technologies. In this paper we will discuss a CMOS compatible underlying technology to enable next generation optical computing architectures. By introducing a new optical layer within the 3D SiP, the development of converged microsystems, deployment for next generation optical computing architecture will be leveraged.

30-kW class Arcjet Advanced Technology Transition Demonstration (ATTD) flight experiment diagnostic package

NASA Astrophysics Data System (ADS)

Kriebel, M. M.; Stevens, N. J.

1992-07-01

TRW, Rocket Research Co and Defense Systems Inc are developing a space qualified 30-kW class arcjet flight unit as a part of the Arcjet ATTD program. During space operation the package will measure plume deposition and contamination, electromagnetic interference, thermal radiation, arcjet thruster performance, and plume heating in order to quantify arcjet operational interactions. The Electric Propulsion Space Experiment (ESEX) diagnostic package is described. The goals of ESEX are the demonstration of a high powered arcjet performance and the measurement of potential arcjet-spacecraft interactions which cannot be determined in ground facilities. Arcjet performance, plume characterization, thermal radiation flux and the electromagnetic interference (EMI) experiment as well as experiment operations with a preliminary operations plan are presented.

Author Correction: Energy use and life cycle greenhouse gas emissions of drones for commercial package delivery.

PubMed

Stolaroff, Joshuah K; Samaras, Constantine; O'Neill, Emma R; Lubers, Alia; Mitchell, Alexandra S; Ceperley, Daniel

2018-03-08

In the original version of this Article, the first sentence of the sixth paragraph of the "Comparing emissions" section, the Results originally incorrectly read as 'In the base case, delivery of a small (0.5 kg) package with the small quadrotor drone has lower impacts than delivery by diesel truck, ranging from a 59% reduction in GHGs in California, to a 17% reduction in Missouri'. The correct version states '54%' instead of '59%' and '23%' instead of '17%'.The fourth sentence of the same paragraph originally incorrectly read as 'In the base case, delivery of a medium-sized (8 kg) package has 17% lower GHGs than delivery by truck in California, is about equivalent to delivery trucks for the U.S. average electricity mix, but has 77% higher GHGs than truck delivery in Missouri, which has a carbon-intensive electricity grid'. The correct version states 'In the base case, delivery of a medium-sized (8 kg) package has 9% lower GHGs than delivery by truck in California, is about 24% higher than delivery trucks for the U.S. average electricity mix, and has 50% higher GHGs than truck delivery in Missouri, which has a carbon-intensive electricity grid.The last sentence of the seventh paragraph of the same section originally incorrectly read as 'Because of the importance of electricity used to power the octocopter, charging with low-carbon electricity of 200 g GHG/kWh can reduce delivered package GHGs by 34% compared to diesel trucks'. The correct version states '37%' instead of '34%'.These errors have been corrected in both the PDF and HTML versions of the Article.

Compact electro-optical module with polymer waveguides on a flexible substrate for high-density board-level communication

NASA Astrophysics Data System (ADS)

Weiss, J. R. M.; Lamprecht, T.; Meier, N.; Dangel, R.; Horst, F.; Jubin, D.; Beyeler, R.; Offrein, B. J.

2010-02-01

We report on the co-packaging of electrical CMOS transceiver and VCSEL chip arrays on a flexible electrical substrate with optical polymer waveguides. The electro-optical components are attached to the substrate edge and butt-coupled to the waveguides. Electrically conductive silver-ink connects them to the substrate at an angle of 90°. The final assembly contacts the surface of a package laminate with an integrated compressible connector. The module can be folded to save space, requires only a small footprint on the package laminate and provides short electrical high-speed signal paths. With our approach, the electro-optical package becomes a compact electro-optical module with integrated polymer waveguides terminated with either optical connectors (e.g., at the card edge) or with an identical assembly for a second processor on the board. Consequently, no costly subassemblies and connectors are needed, and a very high integration density and scalability to virtually arbitrary channel counts and towards very high data rates (20+ Gbps) become possible. Future cost targets of much less than US$1 per Gbps will be reached by employing standard PCB materials and technologies that are well established in the industry. Moreover, our technology platform has both electrical and optical connectivity and functionality.

Reparable, high-density microelectronic module provides effective heat sink

NASA Technical Reports Server (NTRS)

Carlson, K. J.; Maytone, F. F.

1967-01-01

Reparable modular system is used for packaging microelectronic flat packs and miniature discrete components. This three-dimensional compartmented structure incorporates etched phosphor bronze sheets and frames with etched wire conductors. It provides an effective heat sink for electric power dissipation in the absence of convective cooling means.

Improvement of calculation method for electrical parameters of short network of ore-thermal furnaces

NASA Astrophysics Data System (ADS)

Aliferov, A. I.; Bikeev, R. A.; Goreva, L. P.

2017-10-01

The paper describes a new calculation method for active and inductive resistance of split interleaved current leads packages in ore-thermal electric furnaces. The method is developed on basis of regression analysis of dependencies of active and inductive resistances of the packages on their geometrical parameters, mutual disposition and interleaving pattern. These multi-parametric calculations have been performed with ANSYS software. The proposed method allows solving split current lead electrical parameters minimization and balancing problems for ore-thermal furnaces.

A Variational Approach to the Analysis of Dissipative Electromechanical Systems

PubMed Central

Allison, Andrew; Pearce, Charles E. M.; Abbott, Derek

2014-01-01

We develop a method for systematically constructing Lagrangian functions for dissipative mechanical, electrical, and electromechanical systems. We derive the equations of motion for some typical electromechanical systems using deterministic principles that are strictly variational. We do not use any ad hoc features that are added on after the analysis has been completed, such as the Rayleigh dissipation function. We generalise the concept of potential, and define generalised potentials for dissipative lumped system elements. Our innovation offers a unified approach to the analysis of electromechanical systems where there are energy and power terms in both the mechanical and electrical parts of the system. Using our novel technique, we can take advantage of the analytic approach from mechanics, and we can apply these powerful analytical methods to electrical and to electromechanical systems. We can analyse systems that include non-conservative forces. Our methodology is deterministic, and does does require any special intuition, and is thus suitable for automation via a computer-based algebra package. PMID:24586221

International Space Station (ISS)

NASA Image and Video Library

2000-12-07

In this image, STS-97 astronaut and mission specialist Carlos I. Noriega waves at a crew member inside Endeavor's cabin during the mission's final session of Extravehicular Activity (EVA). Launched aboard the Space Shuttle Orbiter Endeavor on November 30, 2000, the STS-97 mission's primary objective was the delivery, assembly, and activation of the U.S. electrical power system onboard the International Space Station (ISS). The electrical power system, which is built into a 73-meter (240-foot) long solar array structure consists of solar arrays, radiators, batteries, and electronics. The entire 15.4-metric ton (17-ton) package is called the P6 Integrated Truss Segment, and is the heaviest and largest element yet delivered to the station aboard a space shuttle. The electrical system will eventually provide the power necessary for the first ISS crews to live and work in the U.S. segment.

Space Shuttle Projects

NASA Image and Video Library

2000-11-30

Back dropped by a cloudless blue sky, Space Shuttle Endeavor stands ready for launch after the rollback of the Rotating Service Structure, at left. The orbiter launched that night carrying the STS-97 crew of five. The STS-97 mission's primary objective was the delivery, assembly, and activation of the U.S. electrical power system onboard the International Space Station (ISS). The electrical power system, which is built into a 73-meter (240-foot) long solar array structure, consists of solar arrays, radiators, batteries, and electronics. The entire 15.4-metric ton (17-ton) package is called the P6 Integrated Truss Segment, and is the heaviest and largest element yet delivered to the station aboard a space shuttle. The electric system will eventually provide the power necessary for the first ISS crews to live and work in the U.S. segment.

Development of a Novel Wireless Electric Power Transfer System for Space Applications

NASA Technical Reports Server (NTRS)

VazquezRamos, Gabriel; Yuan, Jiann-Shiun

2011-01-01

This paper will introduce a new implementation for wireless electric power transfer systems: space applications. Due to the risks that constitute the use of electrical connector for some space missions/applications, a simple wireless power system design approach will be evaluated as an alternative for the use of electrical connectors. This approach takes into consideration the overall system performance by designing the magnetic resonance elements and by verifying the overall system electrical behavior. System characterization is accomplished by executing circuit and analytical simulations using Matlab(TradeMark) and LTSpiceIV(TradeMark) software packages. The design methodology was validated by two different experiments: frequency consideration (design of three magnetic elements) and a small scale proof-ofconcept prototype. Experiment results shows successful wireless power transfer for all the cases studied. The proof-of-concept prototype provided approx.4 W of wireless power to the load (light bulb) at a separation of 3 cm from the source. In addition. a resonant circuit was designed and installed to the battery terminals of a handheld radio without batteries, making it tum on at a separation of approx.5 cm or less from the source. It was also demonstrated by prototype experimentation that multiple loads can be powered wirelessly at the same time with a single electric power source.

Simultaneous measurements of auroral particles and electric currents by a rocket-borne instrument system - Introductory remarks

NASA Technical Reports Server (NTRS)

Anderson, H. R.; Cloutier, P. A.

1975-01-01

A rocket-borne experiment package has been designed to obtain simultaneous in situ measurements of the pitch angle distributions and energy spectra of primary auroral particles, the flux of neutral hydrogen at auroral energies, the electric currents flowing in the vicinity of the auroral arc as determined from vector magnetic data, and the modulation of precipitating electrons in the frequency range 0.5-10 MHz. The experiment package was launched by a Nike-Tomahawk rocket from Poker Flat, Alaska, at 0722 UT on Feb. 25, 1972, over a bright auroral band. This paper is intended to serve as an introduction to the detailed discussion of results given in the companion papers. As such it includes a brief review of the general problem, a discussion of the rocket instrumentation, a delineation of the auroral and geomagnetic conditions at the time of launch, and comments on the overall payload performance.

Ultra Clean 1.1MW High Efficiency Natural Gas Engine Powered System

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zurlo, James; Lueck, Steve

Dresser, Inc. (GE Energy, Waukesha gas engines) will develop, test, demonstrate, and commercialize a 1.1 Megawatt (MW) natural gas fueled combined heat and power reciprocating engine powered package. This package will feature a total efficiency > 75% and ultra low CARB permitting emissions. Our modular design will cover the 1 – 6 MW size range, and this scalable technology can be used in both smaller and larger engine powered CHP packages. To further advance one of the key advantages of reciprocating engines, the engine, generator and CHP package will be optimized for low initial and operating costs. Dresser, Inc. willmore » leverage the knowledge gained in the DOE - ARES program. Dresser, Inc. will work with commercial, regulatory, and government entities to help break down barriers to wider deployment of CHP. The outcome of this project will be a commercially successful 1.1 MW CHP package with high electrical and total efficiency that will significantly reduce emissions compared to the current central power plant paradigm. Principal objectives by phases for Budget Period 1 include: • Phase 1 – market study to determine optimum system performance, target first cost, lifecycle cost, and creation of a detailed product specification. • Phase 2 – Refinement of the Waukesha CHP system design concepts, identification of critical characteristics, initial evaluation of technical solutions, and risk mitigation plans. Background« less

Phase 1 of the First Solar Small Power System Experiment (experimental System No. 1). Volume 1: Technical Studies for Solar Point-focusing, Distributed Collector System, with Energy Conversion at the Collector, Category C

NASA Technical Reports Server (NTRS)

Clark, T. B. (Editor)

1979-01-01

The technical and economic feasibility of a solar electric power plant for a small community is evaluated and specific system designs for development and demonstration are selected. All systems investigated are defined as point focusing, distributed receiver concepts, with energy conversion at the collector. The preferred system is comprised of multiple parabolic dish concentrators employing Stirling cycle engines for power conversion. The engine, AC generator, cavity receiver, and integral sodium pool boiler/heat transport system are combined in a single package and mounted at the focus of each concentrator. The output of each concentrator is collected by a conventional electrical distribution system which permits grid-connected or stand-alone operation, depending on the storage system selected.

Construction Electrician 3 & 2. Rate Training Manual and Nonresident Career Course.

ERIC Educational Resources Information Center

Naval Education and Training Command, Pensacola, FL.

One of a series of training manuals prepared for enlisted personnel in the Navy and Naval Reserve, this self-study package provides subject matter that relates directly to the tasks required of the Construction Electrician, which include abilities to install, operate, service, and overhaul electric generating and distribution systems and wire…

Robust optical sensors for safety critical automotive applications

NASA Astrophysics Data System (ADS)

De Locht, Cliff; De Knibber, Sven; Maddalena, Sam

2008-02-01

Optical sensors for the automotive industry need to be robust, high performing and low cost. This paper focuses on the impact of automotive requirements on optical sensor design and packaging. Main strategies to lower optical sensor entry barriers in the automotive market include: Perform sensor calibration and tuning by the sensor manufacturer, sensor test modes on chip to guarantee functional integrity at operation, and package technology is key. As a conclusion, optical sensor applications are growing in automotive. Optical sensor robustness matured to the level of safety critical applications like Electrical Power Assisted Steering (EPAS) and Drive-by-Wire by optical linear arrays based systems and Automated Cruise Control (ACC), Lane Change Assist and Driver Classification/Smart Airbag Deployment by camera imagers based systems.

AIN-Based Packaging for SiC High-Temperature Electronics

NASA Technical Reports Server (NTRS)

Savrun, Ender

2004-01-01

Packaging made primarily of aluminum nitride has been developed to enclose silicon carbide-based integrated circuits (ICs), including circuits containing SiC-based power diodes, that are capable of operation under conditions more severe than can be withstood by silicon-based integrated circuits. A major objective of this development was to enable packaged SiC electronic circuits to operate continuously at temperatures up to 500 C. AlN-packaged SiC electronic circuits have commercial potential for incorporation into high-power electronic equipment and into sensors that must withstand high temperatures and/or high pressures in diverse applications that include exploration in outer space, well logging, and monitoring of nuclear power systems. This packaging embodies concepts drawn from flip-chip packaging of silicon-based integrated circuits. One or more SiC-based circuit chips are mounted on an aluminum nitride package substrate or sandwiched between two such substrates. Intimate electrical connections between metal conductors on the chip(s) and the metal conductors on external circuits are made by direct bonding to interconnections on the package substrate(s) and/or by use of holes through the package substrate(s). This approach eliminates the need for wire bonds, which have been the most vulnerable links in conventional electronic circuitry in hostile environments. Moreover, the elimination of wire bonds makes it possible to pack chips more densely than was previously possible.

A mechanical, thermal and electrical packaging design for a prototype power management and control system for the 30 cm mercury ion thruster

NASA Technical Reports Server (NTRS)

Sharp, G. R.; Gedeon, L.; Oglebay, J. C.; Shaker, F. S.; Siegert, C. E.

1978-01-01

A prototype electric power management and thruster control system for a 30 cm ion thruster is described. The system meets all of the requirements necessary to operate a thruster in a fully automatic mode. Power input to the system can vary over a full two to one dynamic range (200 to 400 V) for the solar array or other power source. The power management and control system is designed to protect the thruster, the flight system and itself from arcs and is fully compatible with standard spacecraft electronics. The system is easily integrated into flight systems which can operate over a thermal environment ranging from 0.3 to 5 AU. The complete power management and control system measures 45.7 cm (18 in.) x 15.2 cm (6 in.) x 114.8 cm (45.2 in.) and weighs 36.2 kg (79.7 lb). At full power the overall efficiency of the system is estimated to be 87.4 percent. Three systems are currently being built and a full schedule of environmental and electrical testing is planned.

International Space Station (ISS)

NASA Image and Video Library

2000-12-07

In this image, planet Earth, some 235 statute miles away, forms the back drop for this photo of STS-97 astronaut and mission specialist Joseph R. Tanner, taken during the third of three space walks. The mission's goal was to perform the delivery, assembly, and activation of the U.S. electrical power system onboard the International Space Station (ISS). The electrical power system, which is built into a 73-meter (240-foot) long solar array structure consists of solar arrays, radiators, batteries, and electronics. The entire 15.4-metric ton (17-ton) package is called the P6 Integrated Truss Segment, and is the heaviest and largest element yet delivered to the station aboard a space shuttle. The electrical system will eventually provide the power necessary for the first ISS crews to live and work in the U.S. segment. The STS-97 crew of five launched aboard the Space Shuttle Orbiter Endeavor on November 30, 2000 for an 11 day mission.

Calculation Software

NASA Technical Reports Server (NTRS)

1994-01-01

MathSoft Plus 5.0 is a calculation software package for electrical engineers and computer scientists who need advanced math functionality. It incorporates SmartMath, an expert system that determines a strategy for solving difficult mathematical problems. SmartMath was the result of the integration into Mathcad of CLIPS, a NASA-developed shell for creating expert systems. By using CLIPS, MathSoft, Inc. was able to save the time and money involved in writing the original program.

Non-electrical-power temperature-time integrating sensor for RFID based on microfluidics

NASA Astrophysics Data System (ADS)

Schneider, Mike; Hoffmann, Martin

2011-06-01

The integration of RFID tags into packages offers the opportunity to combine logistic advantages of the technology with monitoring different parameters from inside the package at the same time. An essential demand for enhanced product safety especially in pharmacy or food industry is the monitoring of the time-temperature-integral. Thus, completely passive time-temperature-integrators (TTI) requiring no battery, microprocessor nor data logging devices are developed. TTI representing the sterilization process inside an autoclave system is a demanding challenge: a temperature of at least 120 °C have to be maintained over 45 minutes to assure that no unwanted organism remains. Due to increased temperature, the viscosity of a fluid changes and thus the speed of the fluid inside the channel increases. The filled length of the channel represents the time temperature integral affecting the system. Measurements as well as simulations allow drawing conclusions about the influence of the geometrical parameters of the system and provide the possibility of adaptation. Thus a completely passive sensor element for monitoring an integral parameter with waiving of external electrical power supply and data processing technology is demonstrated. Furthermore, it is shown how to adjust the specific TTI parameters of the sensor to different applications and needs by modifying the geometrical parameters of the system.

Low cost solar aray project: Experimental process system development unit for producing semiconductor-grade silicon using the silane-to-silicon process

NASA Technical Reports Server (NTRS)

1981-01-01

This phase consists of the engineering design, fabrication, assembly, operation, economic analysis, and process support R&D for an Experimental Process System Development Unit (EPSDU). The mechanical bid package was issued and the bid responses are under evaluation. Similarly, the electrical bid package was issued, however, responses are not yet due. The majority of all equipment is on order or has been received at the EPSDU site. The pyrolysis/consolidation process design package was issued. Preparation of process and instrumentation diagram for the free-space reactor was started. In the area of melting/consolidation, Kayex successfully melted chunk silicon and have produced silicon shot. The free-space reactor powder was successfully transported pneumatically from a storage bin to the auger feeder twenty-five feet up and was melted. The fluid-bed PDU has successfully operated at silane feed concentrations up to 21%. The writing of the operating manual has started. Overall, the design phase is nearing completion.

Plastic-Sealed Hybrid Power Circuit Package

NASA Technical Reports Server (NTRS)

Miller, W. N.; Gray, O. E.

1983-01-01

Proposed design for hybrid high-voltage power-circuit package uses molded plastic for hermetic sealing instead of glass-to-metal seal. New package used to house high-voltage regulators and solid-state switches for applications in aircraft, electric automobiles, industrial equipment, satellites, solarcell arrays, and other equipment in extreme environments.

WASTE HANDLING BUILDING ELECTRICAL SYSTEM DESCRIPTION DOCUMENT

DOE Office of Scientific and Technical Information (OSTI.GOV)

S.C. Khamamkar

2000-06-23

The Waste Handling Building Electrical System performs the function of receiving, distributing, transforming, monitoring, and controlling AC and DC power to all waste handling building electrical loads. The system distributes normal electrical power to support all loads that are within the Waste Handling Building (WHB). The system also generates and distributes emergency power to support designated emergency loads within the WHB within specified time limits. The system provides the capability to transfer between normal and emergency power. The system provides emergency power via independent and physically separated distribution feeds from the normal supply. The designated emergency electrical equipment will bemore » designed to operate during and after design basis events (DBEs). The system also provides lighting, grounding, and lightning protection for the Waste Handling Building. The system is located in the Waste Handling Building System. The system consists of a diesel generator, power distribution cables, transformers, switch gear, motor controllers, power panel boards, lighting panel boards, lighting equipment, lightning protection equipment, control cabling, and grounding system. Emergency power is generated with a diesel generator located in a QL-2 structure and connected to the QL-2 bus. The Waste Handling Building Electrical System distributes and controls primary power to acceptable industry standards, and with a dependability compatible with waste handling building reliability objectives for non-safety electrical loads. It also generates and distributes emergency power to the designated emergency loads. The Waste Handling Building Electrical System receives power from the Site Electrical Power System. The primary material handling power interfaces include the Carrier/Cask Handling System, Canister Transfer System, Assembly Transfer System, Waste Package Remediation System, and Disposal Container Handling Systems. The system interfaces with the MGR Operations Monitoring and Control System for supervisory monitoring and control signals. The system interfaces with all facility support loads such as heating, ventilation, and air conditioning, office, fire protection, monitoring and control, safeguards and security, and communications subsystems.« less

Power Extension Package (PEP) system definition extension, orbital service module systems analysis study. Volume 1: Executive summary

NASA Technical Reports Server (NTRS)

1979-01-01

An array deployment assembly, power regulation and control assembly, the necessary interface, and display and control equipment comprise the power extension package (PEP) which is designed to provide increased power and duration, as well as reduce fuel cell cryogen consumption during Spacelab missions. Compatible with all currently defined missions and payloads, PEP imposes minimal weight and volume penalties on sortie missions, and can be installed and removed as needed at the launch site within the normal Orbiter turnaround cycle. The technology on which it is based consists of a modified solar electric propulsion array, standard design regulator and control equipment, and a minimally modified Orbiter design. The requirements from which PEP was derived, and the system and its performance capabilities are described. Features of the recommended project are presented.

Linear Test Bed. Volume 2: Test Bed No. 2. [linear aerospike test bed for thrust vector control

NASA Technical Reports Server (NTRS)

1974-01-01

Test bed No. 2 consists of 10 combustors welded in banks of 5 to 2 symmetrical tubular nozzle assemblies, an upper stationary thrust frame, a lower thrust frame which can be hinged, a power package, a triaxial combustion wave ignition system, a pneumatic control system, pneumatically actuated propellant valves, a purge and drain system, and an electrical control system. The power package consists of the Mark 29-F fuel turbopump, the Mark 29-0 oxidizer turbopump, a gas generator assembly, and propellant ducting. The system, designated as a linear aerospike system, was designed to demonstrate the feasibility of the concept and to explore technology related to thrust vector control, thrust vector optimization, improved sequencing and control, and advanced ignition systems. The propellants are liquid oxygen/liquid hydrogen. The system was designed to operate at 1200-psia chamber pressure at an engine mixture ratio of 5.5. With 10 combustors, the sea level thrust is 95,000 pounds.

Modular thrust subsystem approaches to solar electric propulsion module design

NASA Technical Reports Server (NTRS)

Cake, J. E.; Sharp, G. R.; Oglebay, J. C.; Shaker, F. J.; Zavesky, R. J.

1976-01-01

Three approaches are presented for packaging the elements of a 30 cm ion thruster subsystem into a modular thrust subsystem. The individual modules, when integrated into a conceptual solar electric propulsion module are applicable to a multimission set of interplanetary flights with the space shuttle interim upper stage as the launch vehicle. The emphasis is on the structural and thermal integration of the components into the modular thrust subsystems. Thermal control for the power processing units is either by direct radiation through louvers in combination with heat pipes or an all heat pipe system. The propellant storage and feed system and thruster gimbal system concepts are presented. The three approaches are compared on the basis of mass, cost, testing, interfaces, simplicity, reliability, and maintainability.

Modular thrust subsystem approaches to solar electric propulsion module design

NASA Technical Reports Server (NTRS)

Cake, J. E.; Sharp, G. R.; Oglebay, J. C.; Shaker, F. J.; Zevesky, R. J.

1976-01-01

Three approaches are presented for packaging the elements of a 30 cm ion thrustor subsystem into a modular thrust subsystem. The individual modules, when integrated into a conceptual solar electric propulsion module are applicable to a multimission set of interplanetary flights with the Space Shuttle/Interim Upper Stage as the launch vehicle. The emphasis is on the structural and thermal integration of the components into the modular thrust subsystems. Thermal control for the power processing units is either by direct radiation through louvers in combination with heat pipes of an all heat pipe system. The propellant storage and feed system and thrustor gimbal system concepts are presented. The three approaches are compared on the basis of mass, cost, testing, interfaces, simplicity, reliability, and maintainability.

MEMSlab: A Practical MEMS Course for the Fabrication, Packaging, and Testing of a Single-Axis Accelerometer

ERIC Educational Resources Information Center

Grundbacher, R.; Hoetzel, J. E.; Hierold, C.

2009-01-01

A microelectro-mechanical systems (MEMS) laboratory course (MEMSlab) in the Mechanical and Process Engineering Department at the Swiss Federal Institute of Technology (ETH Zurich), is presented. The course has been taught for four years and has been attended primarily by Master's students from mechanical and electrical engineering; since fall…

Multiple Learning Strategies Project. Small Engine Repair Service. Regular Vocational. [Vol. 1.

ERIC Educational Resources Information Center

Pitts, Jim; And Others

This instructional package is one of two designed for use by regular vocational students in the vocational area of small engine repair service. Contained in this document are forty-four learning modules organized into ten units: engine block; air cleaner; starters; fuel tanks; lines, filters, and pumps; carburetors; electrical; magneto systems;…

Cryo-delivery Systems for the Co-transmission of Chemical and Electrical Power

NASA Astrophysics Data System (ADS)

Grant, Paul M.

2006-04-01

We present a novel concept for the simultaneous transport of chemical power in the form of natural gas or hydrogen in a cryogenic state along with the simultaneous transmission of electrical power over via superconductivity. This concept could impact future efforts to tap and deliver methane from distant geographic resources over conventional pipelines with part of the chemical potential energy converted directly to electricity at the wellhead and the remaining gas cooled cryogenically to increase volumetric density and provide the necessary support of a superconducting cable housed within the same packaging. As the fossil reserve becomes depleted, nuclear power plants would be constructed at the former remote wellhead sites to co-generate electricity and cryocooled hydrogen, the latter replacing natural gas and also serving to operate the already installed superconducting electrical service line.

Practical application of power conditioning to electric propulsion for passenger vehicles

NASA Technical Reports Server (NTRS)

Demerdash, N. A.; Lee, F. C.; Nehl, T. W.; Overton, B. P.

1980-01-01

A functional model 15 HP, 120 volt, 4-pole, 7600 r.p.m. samarium-cobalt permanent magnet type brushless dc motor-transistorized power conditioner unit was designed, fabricated and tested for specific use in propulsion of electric passenger vehicles. This new brushless motor system, including its power conditioner package, has a number of important advantages over existing systems such as reduced weight and volume, higher reliability, and potential for improvements in efficiencies. These advantages are discussed in this paper in light of the substantial test data collected during experimentation with the newly developed conditioner motor propulsion system. Details of the power conditioner design philosophy and particulars are given in the paper. Also, described here are the low level electronic design and operation in relation to the remainder of the system.

Modelling of optoelectronic circuits based on resonant tunneling diodes

NASA Astrophysics Data System (ADS)

Rei, João. F. M.; Foot, James A.; Rodrigues, Gil C.; Figueiredo, José M. L.

2017-08-01

Resonant tunneling diodes (RTDs) are the fastest pure electronic semiconductor devices at room temperature. When integrated with optoelectronic devices they can give rise to new devices with novel functionalities due to their highly nonlinear properties and electrical gain, with potential applications in future ultra-wide-band communication systems (see e.g. EU H2020 iBROW Project). The recent coverage on these devices led to the need to have appropriated simulation tools. In this work, we present RTD based optoelectronic circuits simulation packages to provide circuit signal level analysis such as transient and frequency responses. We will present and discuss the models, and evaluate the simulation packages.

The NASA Electronic Parts and Packaging (NEPP) Program: Overview and Update FY15 and Beyond

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2016-01-01

The NASA Electronic Parts and Packaging (NEPP) program, and its subset the NASA Electronic Parts Assurance Group (NEPAG), are NASA's point-of-contacts for reliability and radiation tolerance of electrical, electronic, and electromechanical (EEE) parts and their packages. This presentation includes a Fiscal Year 2015 program overview.

Extreme temperature packaging: challenges and opportunities

NASA Astrophysics Data System (ADS)

Johnson, R. Wayne

2016-05-01

Consumer electronics account for the majority of electronics manufactured today. Given the temperature limits of humans, consumer electronics are typically rated for operation from -40°C to +85°C. Military applications extend the range to -65°C to +125°C while underhood automotive electronics may see +150°C. With the proliferation of the Internet of Things (IoT), the goal of instrumenting (sensing, computation, transmission) to improve safety and performance in high temperature environments such as geothermal wells, nuclear reactors, combustion chambers, industrial processes, etc. requires sensors, electronics and packaging compatible with these environments. Advances in wide bandgap semiconductors (SiC and GaN) allow the fabrication of high temperature compatible sensors and electronics. Integration and packaging of these devices is required for implementation into actual applications. The basic elements of packaging are die attach, electrical interconnection and the package or housing. Consumer electronics typically use conductive adhesives or low melting point solders for die attach, wire bonds or low melting solder for electrical interconnection and epoxy for the package. These materials melt or decompose in high temperature environments. This paper examines materials and processes for high temperature packaging including liquid transient phase and sintered nanoparticle die attach, high melting point wires for wire bonding and metal and ceramic packages. The limitations of currently available solutions will also be discussed.

Multilayered microelectronic device package with an integral window

DOEpatents

Peterson, Kenneth A.; Watson, Robert D.

2003-01-01

An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can comprise, for example, a cofired ceramic frame or body. The package has an internal stepped structure made of a plurality of plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package, according to some embodiments. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination. The integral window can further include a lens for optically transforming light passing through the window. The package can include an array of binary optic lenslets made integral with the window. The package can include an electrically-switched optical modulator, such as a lithium niobate window attached to the package, for providing a very fast electrically-operated shutter.

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2005-01-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2004-12-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

International Space Station (ISS)

NASA Image and Video Library

2000-12-05

Astronaut Joseph R. Tanner, STS-97 mission specialist, is seen during a session of Extravehicular Activity (EVA), performing work on the International Space Station (ISS). Part of the Remote Manipulator System (RMS) arm and a section of the newly deployed solar array panel are in the background. The primary objective of the STS-97 mission was the delivery, assembly, and activation of the U.S. electrical power system on board the ISS. The electrical power system, which is built into a 73-meter (240-foot) long solar array structure consists of solar arrays, radiators, batteries, and electronics. The entire 15.4-metric ton (17-ton) package is called the P6 Integrated Truss Segment and is the heaviest and largest element yet delivered to the station aboard a space shuttle. The electrical system will eventually provide the power necessary for the first ISS crews to live and work in the U.S. segment. The STS-97 crew of five launched aboard the Space Shuttle Orbiter Endeavor on November 30, 2000 for an 11 day mission.

High-voltage leak detection of a parenteral proteinaceous solution product packaged in form-fill-seal plastic laminate bags. Part 1. Method development and validation.

PubMed

Damgaard, Rasmus; Rasmussen, Mats; Buus, Peter; Mulhall, Brian; Guazzo, Dana Morton

2013-01-01

In Part 1 of this three-part research series, a leak test performed using high-voltage leak detection (HVLD) technology, also referred to as an electrical conductivity and capacitance leak test, was developed and validated for container-closure integrity verification of a small-volume laminate plastic bag containing an aqueous solution for injection. The sterile parenteral product is the rapid-acting insulin analogue, insulin aspart (NovoRapid®/NovoLog®, by Novo Nordisk A/S, Bagsværd, Denmark). The aseptically filled and sealed package is designed to preserve product sterility through expiry. Method development and validation work incorporated positive control packages with a single hole laser-drilled through the laminate film of each bag. A unique HVLD method characterized by specific high-voltage and potentiometer set points was established for testing bags positioned in each of three possible orientations as they are conveyed through the instrument's test zone in each of two possible directions-resulting in a total of six different test method options. Validation study results successfully demonstrated the ability of all six methods to accurately and reliably detect those packages with laser-drilled holes from 2.5-11.2 μm in nominal diameter. Part 2 of this series will further explore HVLD test results as a function of package seal and product storage variables. The final Part 3 will report the impact of HVLD exposure on product physico-chemical stability. In this Part 1 of a three-part research series, a leak test method based on electrical conductivity and capacitance, called high voltage leak detection (HVLD), was used to find leaks in small plastic bags filled with an insulin pharmaceutical solution for human injection by Novo Nordisk A/S (Bagsværd, Denmark). To perform the test, the package is electrically grounded while being conveyed past an electrode linked to a high-voltage, low-amperage transformer. The instrument measures the current that passes from the transformer to the electrode, through the packaged product and along the package walls, to the ground. Plastic packages without defect are relatively nonconductive and yield a low voltage reading; a leaking package with electrically conductive solution located in or near the leak triggers a spike in voltage reading. Test methods were optimized and validated, enabling the detection of leaking packages with holes as small as 2.5 μm in diameter. Part 2 of this series will further explore HVLD test results as a function of package seal and product storage variables. The final Part 3 will report the impact of HVLD exposure on product stability.

Integrated Vehicle Thermal Management for Advanced Vehicle Propulsion Technologies

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bennion, K.; Thornton, M.

A critical element to the success of new propulsion technologies that enable reductions in fuel use is the integration of component thermal management technologies within a viable vehicle package. Vehicle operation requires vehicle thermal management systems capable of balancing the needs of multiple vehicle systems that may require heat for operation, require cooling to reject heat, or require operation within specified temperature ranges. As vehicle propulsion transitions away from a single form of vehicle propulsion based solely on conventional internal combustion engines (ICEs) toward a wider array of choices including more electrically dominant systems such as plug-in hybrid electric vehiclesmore » (PHEVs), new challenges arise associated with vehicle thermal management. As the number of components that require active thermal management increase, so do the costs in terms of dollars, weight, and size. Integrated vehicle thermal management is one pathway to address the cost, weight, and size challenges. The integration of the power electronics and electric machine (PEEM) thermal management with other existing vehicle systems is one path for reducing the cost of electric drive systems. This work demonstrates techniques for evaluating and quantifying the integrated transient and continuous heat loads of combined systems incorporating electric drive systems that operate primarily under transient duty cycles, but the approach can be extended to include additional steady-state duty cycles typical for designing vehicle thermal management systems of conventional vehicles. The work compares opportunities to create an integrated low temperature coolant loop combining the power electronics and electric machine with the air conditioning system in contrast to a high temperature system integrated with the ICE cooling system.« less

Independent Orbiter Assessment (IOA): Analysis of the electrical power generation/power reactant storage and distribution subsystem

NASA Technical Reports Server (NTRS)

Gotch, S. M.

1986-01-01

The results of the Independent Orbiter Assessment (IOA) of the Failure Modes and Effects Analysis (FMEA) and Critical Items List (CIL) are presented. The IOA approach features a top-down analysis of the hardware to determine failure modes, criticality, and potential critical items. To preserve independence, this analysis was accomplished without reliance upon the results contained within the NAA FMEA/CIL documentation. The independent analysis results corresponding to the Orbiter Electrical Power Generation (EPG)/Power Reactants Storage and Distribution (PRSD) System Hardware is documented. The EPG/PRSD hardware is required for performing critical functions of cryogenic hydrogen and oxygen storage and distribution to the Fuel Cell Powerplants (FCP) and Atmospheric Revitalization Pressure Control Subsystem (ARPCS). Specifically, the EPG/PRSD hardware consists of the following: Hydryogen (H2) tanks; Oxygen (O2) tanks; H2 Relief Valve/Filter Packages (HRVFP); O2 Relief Valve/Filter Packages (ORVFP); H2 Valve Modules (HVM); O2 Valve Modules (OVM); and O2 and H2 lines, components, and fittings.

New exact solutions for a discrete electrical lattice using the analytical methods

NASA Astrophysics Data System (ADS)

Manafian, Jalil; Lakestani, Mehrdad

2018-03-01

This paper retrieves soliton solutions to an equation in nonlinear electrical transmission lines using the semi-inverse variational principle method (SIVPM), the \\exp(-Ω(ξ)) -expansion method (EEM) and the improved tan(φ/2) -expansion method (ITEM), with the aid of the symbolic computation package Maple. As a result, the SIVPM, EEM and ITEM methods are successfully employed and some new exact solitary wave solutions are acquired in terms of kink-singular soliton solution, hyperbolic solution, trigonometric solution, dark and bright soliton solutions. All solutions have been verified back into their corresponding equations with the aid of the Maple package program. We depicted the physical explanation of the extracted solutions with the choice of different parameters by plotting some 2D and 3D illustrations. Finally, we show that the used methods are robust and more efficient than other methods. More importantly, the solutions found in this work can have significant applications in telecommunication systems where solitons are used to codify data.

Thunderstorm Hypothesis Reasoner

NASA Technical Reports Server (NTRS)

Mulvehill, Alice M.

1994-01-01

THOR is a knowledge-based system which incorporates techniques from signal processing, pattern recognition, and artificial intelligence (AI) in order to determine the boundary of small thunderstorms which develop and dissipate over the area encompassed by KSC and the Cape Canaveral Air Force Station. THOR interprets electric field mill data (derived from a network of electric field mills) by using heuristics and algorithms about thunderstorms that have been obtained from several domain specialists. THOR generates two forms of output: contour plots which visually describe the electric field activity over the network and a verbal interpretation of the activity. THOR uses signal processing and pattern recognition to detect signatures associated with noise or thunderstorm behavior in a near real time fashion from over 31 electrical field mills. THOR's AI component generates hypotheses identifying areas which are under a threat from storm activity, such as lightning. THOR runs on a VAX/VMS at the Kennedy Space Center. Its software is a coupling of C and FORTRAN programs, several signal processing packages, and an expert system development shell.

Thermoelectric-Driven Sustainable Sensing and Actuation Systems for Fault-Tolerant Nuclear Incidents

DOE Office of Scientific and Technical Information (OSTI.GOV)

Longtin, Jon

2016-02-08

The Fukushima Daiichi nuclear incident in March 2011 represented an unprecedented stress test on the safety and backup systems of a nuclear power plant. The lack of reliable information from key components due to station blackout was a serious setback, leaving sensing, actuation, and reporting systems unable to communicate, and safety was compromised. Although there were several independent backup power sources for required safety function on site, ultimately the batteries were drained and the systems stopped working. If, however, key system components were instrumented with self-powered sensing and actuation packages that could report indefinitely on the status of the system,more » then critical system information could be obtained while providing core actuation and control during off-normal status for as long as needed. This research project focused on the development of such a self-powered sensing and actuation system. The electrical power is derived from intrinsic heat in the reactor components, which is both reliable and plentiful. The key concept was based around using thermoelectric generators that can be integrated directly onto key nuclear components, including pipes, pump housings, heat exchangers, reactor vessels, and shielding structures, as well as secondary-side components. Thermoelectric generators are solid-state devices capable of converting heat directly into electricity. They are commercially available technology. They are compact, have no moving parts, are silent, and have excellent reliability. The key components to the sensor package include a thermoelectric generator (TEG), microcontroller, signal processing, and a wireless radio package, environmental hardening to survive radiation, flooding, vibration, mechanical shock (explosions), corrosion, and excessive temperature. The energy harvested from the intrinsic heat of reactor components can be then made available to power sensors, provide bi-directional communication, recharge batteries for other safety systems, etc. Such an approach is intrinsically fault tolerant: in the event that system temperatures increase, the amount of available energy will increase, which will make more power available for applications. The system can also be used during normal conditions to provide enhanced monitoring of key system components.« less

Fluidic emergency roll control system. [for emergency aircraft control following failure of primary roll control system

NASA Technical Reports Server (NTRS)

Haefner, K. B.; Honda, T. S.

1973-01-01

A fluidic emergency roll control system for aircraft stabilization in the event of primary flight control failure was evaluated. The fluidic roll control units were designed to provide roll torque proportional to an electrical command as operated by two diametrically opposed thrust nozzles located in the wing tips. The control package consists of a solid propellant gas generator, two diametrically opposed vortex valve modulated thrust nozzles, and an electromagnetic torque motor. The procedures for the design, development, and performance testing of the system are described.

Integrated Assessment of Palm Oil Mill Residues to Sustainable Electricity System (POMR-SES): A Case Study from Peninsular Malaysia

NASA Astrophysics Data System (ADS)

Jaye, I. F. Md; Sadhukhan, J.; Murphy, R. J.

2018-05-01

Generating electricity from biomass are undeniably gives huge advantages to the energy security, environmental protection and the social development. Nevertheless, it always been negatively claimed as not economically competitive as compared to the conventional electricity generation system using fossil fuel. Due to the unfair subsidies given to renewable energy based fuel and the maturity of conventional electricity generation system, the commercialization of this system is rather discouraging. The uniqueness of the chemical and physical properties of the biomass and the functionality of the system are fully depending on the availability of the biomass resources, the capital expenditure of the system is relatively expensive. To remain competitive, biomass based system must be developed in their most economical form. Therefore the justification of the economies of scale of such system is become essential. This study will provide a comprehensive review of process to select an appropriate size for electricity generation plant from palm oil mill (POM) residues through the combustion of an empty fruit bunch (EFB) and biogas from the anaerobic digestion of palm oil mill effluent (POME) in Peninsular Malaysia using a mathematical model and simulation using ASPEN Plus software package. The system operated at 4 MW capacity is expected to provide a return on investment (ROI) of 20% with a payback period of 6.5 years. It is notably agreed that the correct selection of generation plant size will have a significant impact on overall economic and environmental feasibility of the system.

Commander Mattingly prepares meal on middeck

NASA Image and Video Library

1982-07-04

STS004-28-312 (27 June-4 July 1982) --- Astronaut Thomas K. Mattingly II, STS-4 crew commander, prepares a meal in the middeck area of space shuttle Columbia. He uses scissors to open a drink container. Various packages of food and meal accessories are attached to locker doors. At far left edge of the frame is the tall payload called continuous flow electrophoresis experiment (CFES) system-designed to separate biological materials according to their surface electrical charges as they pass through an electrical field. Astronaut Henry W. Hartsfield Jr. exposed this frame with a 35mm camera. Photo credit: NASA

Mini-Brayton heat source assembly design study. Volume 1: Space shuttle mission. [feasibility of Brayton isotope power system design

NASA Technical Reports Server (NTRS)

1973-01-01

Conceptual design definitions of a heat source assembly for use in nominal 500 watt electrical (W(e)) 1200 W(e)and 2000 W(e) mini-Brayton isotope power systems are reported. The HSA is an independent package which maintains thermal and nuclear control of an isotope fueled heat source and transfers the thermal energy to a Brayton rotating unit turbine-alternator-compressor power conversion unit.

Design and fabrication of a foldable 3D silicon based package for solid state lighting applications

NASA Astrophysics Data System (ADS)

Sokolovskij, R.; Liu, P.; van Zeijl, H. W.; Mimoun, B.; Zhang, G. Q.

2015-05-01

Miniaturization of solid state lighting (SSL) luminaires as well as reduction of packaging and assembly costs are of prime interest for the SSL lighting industry. A novel silicon based LED package for lighting applications is presented in this paper. The proposed design consists of 5 rigid Si tiles connected by flexible polyimide hinges with embedded interconnects (ICs). Electrical, optical and thermal characteristics were taken into consideration during design. The fabrication process involved polyimide (PI) application and patterning, aluminium interconnect integration in the flexible hinge, LED reflector cavity formation and metalization followed by through wafer DRIE etching for chip formation and release. A method to connect chip front to backside without TSVs was also integrated into the process. Post-fabrication wafer level assembly included LED mounting and wirebond, phosphor-based colour conversion and silicone encapsulation. The package formation was finalized by vacuum assisted wrapping around an assembly structure to form a 3D geometry, which is beneficial for omnidirectional lighting. Bending tests were performed on the flexible ICs and optical performance at different temperatures was evaluated. It is suggested that 3D packages can be expanded to platforms for miniaturized luminaire applications by combining monolithic silicon integration and system-in-package (SiP) technologies.

Risk Management of Microelectronics: The NASA Electronic Parts and Packaging (NEPP) Program

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2005-01-01

This viewgraph information provides information on how the NASA Electronic Parts and Packaging (NEPP) Program evaluates the reliability of technologies for Electrical, Electronic, and Electromechanical (EEE) parts, and their suitability for spacecraft applications.

Software package for modeling spin-orbit motion in storage rings

NASA Astrophysics Data System (ADS)

Zyuzin, D. V.

2015-12-01

A software package providing a graphical user interface for computer experiments on the motion of charged particle beams in accelerators, as well as analysis of obtained data, is presented. The software package was tested in the framework of the international project on electric dipole moment measurement JEDI (Jülich Electric Dipole moment Investigations). The specific features of particle spin motion imply the requirement to use a cyclic accelerator (storage ring) consisting of electrostatic elements, which makes it possible to preserve horizontal polarization for a long time. Computer experiments study the dynamics of 106-109 particles in a beam during 109 turns in an accelerator (about 1012-1015 integration steps for the equations of motion). For designing an optimal accelerator structure, a large number of computer experiments on polarized beam dynamics are required. The numerical core of the package is COSY Infinity, a program for modeling spin-orbit dynamics.

1.65 mm diameter forward-viewing confocal endomicroscopic catheter using a flip-chip bonded electrothermal MEMS fiber scanner.

PubMed

Seo, Yeong-Hyeon; Hwang, Kyungmin; Jeong, Ki-Hun

2018-02-19

We report a 1.65 mm diameter forward-viewing confocal endomicroscopic catheter using a flip-chip bonded electrothermal MEMS fiber scanner. Lissajous scanning was implemented by the electrothermal MEMS fiber scanner. The Lissajous scanned MEMS fiber scanner was precisely fabricated to facilitate flip-chip connection, and bonded with a printed circuit board. The scanner was successfully combined with a fiber-based confocal imaging system. A two-dimensional reflectance image of the metal pattern 'OPTICS' was successfully obtained with the scanner. The flip-chip bonded scanner minimizes electrical packaging dimensions. The inner diameter of the flip-chip bonded MEMS fiber scanner is 1.3 mm. The flip-chip bonded MEMS fiber scanner is fully packaged with a 1.65 mm diameter housing tube, 1 mm diameter GRIN lens, and a single mode optical fiber. The packaged confocal endomicroscopic catheter can provide a new breakthrough for diverse in-vivo endomicroscopic applications.

Active cooling of microvascular composites for battery packaging

NASA Astrophysics Data System (ADS)

Pety, Stephen J.; Chia, Patrick X. L.; Carrington, Stephen M.; White, Scott R.

2017-10-01

Batteries in electric vehicles (EVs) require a packaging system that provides both thermal regulation and crash protection. A novel packaging scheme is presented that uses active cooling of microvascular carbon fiber reinforced composites to accomplish this multifunctional objective. Microvascular carbon fiber/epoxy composite panels were fabricated and their cooling performance assessed over a range of thermal loads and experimental conditions. Tests were performed for different values of coolant flow rate, channel spacing, panel thermal conductivity, and applied heat flux. More efficient cooling occurs when the coolant flow rate is increased, channel spacing is reduced, and thermal conductivity of the host composite is increased. Computational fluid dynamics (CFD) simulations were also performed and correlate well with the experimental data. CFD simulations of a typical EV battery pack confirm that microvascular composite panels can adequately cool battery cells generating 500 W m-2 heat flux below 40 °C.

Utilization of Pb-free solders in MEMS packaging

NASA Astrophysics Data System (ADS)

Selvaduray, Guna S.

2003-01-01

Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

Preliminary design package for solar heating and cooling systems

NASA Technical Reports Server (NTRS)

1978-01-01

Summarized preliminary design information on activities associated with the development, delivery and support of solar heating and cooling systems is given. These systems are for single family dwellings and commercial applications. The heating/cooling system use a reversible vapor compression heat pump that is driven in the cooling mode by a Rankine power loop, and in the heating mode by a variable speed electric motor. The heating/cooling systems differ from the heating-only systems in the arrangement of the heat pump subsystem and the addition of a cooling tower to provide the heat sink for cooling mode operation.

High-authority smart material integrated electric actuator

NASA Astrophysics Data System (ADS)

Weisensel, G. N.; Pierce, Thomas D.; Zunkel, Gary

1997-05-01

For many current applications, hydraulic power is still the preferred method of gaining mechanical advantage. However, in many of these applications, this power comes with the penalties of high weight, size, cost, and maintenance due to the system's distributed nature and redundancy requirements. A high authority smart material Integrated Electric Actuator (IEA) is a modular, self-contained linear motion device that is capable of producing dynamic output strokes similar to those of hydraulic actuators yet at significantly reduced weight and volume. It provides system simplification and miniaturization. This actuator concept has many innovative features, including a TERFENOL-D-based pump, TERFENOL-D- based active valves, control algorithms, a displacement amplification unit and integrated, unitized packaging. The IEA needs only electrical power and a control command signal as inputs to provide high authority, high response rate actuation. This approach is directly compatible with distributed control strategies. Aircraft control, automotive brakes and fuel injection, and fluid power delivery are just some examples of the IEA's pervasive applications in aerospace, defense and commercial systems.

Antioxidant Extracts from Acorns (Quercus ilex L.) Effectively Protect Ready-to-Eat (RTE) Chicken Patties Irrespective of Packaging Atmosphere.

PubMed

Ferreira, Valquíria C S; Morcuende, David; Hérnandez-López, Silvia H; Madruga, Marta S; Silva, Fábio A P; Estévez, Mario

2017-03-01

This study evaluated the impact of a phenolic-rich acorn extract (200 ppm gallic acid equivalents) and the concentration of oxygen in the packaging system (low-oxygen modified atmosphere; 5% vs. normal-oxygen; 21%) on lipid and protein oxidation and consumers acceptance of the ready-to-eat chicken patties. Samples were subjected to cooking (electric oven, 170 °C/16 min), cold storage (14 d at 4 °C), and reheating (microwave, 600 mW/1 min). Samples treated with acorn extract kept thiobarbituric acid-reactive substances numbers and lipid-derived volatiles at basal levels throughout the whole processing irrespective of the oxygen concentration in the packaging atmosphere. Consistently, treated patties had lower protein carbonyls than control ones. The acorn extract also controlled color and texture deterioration during chilled storage and reheating and improved the color and odor acceptance of the products. Formulating with acorn extract is a feasible strategy to inhibit the oxidation-driven changes and preserve the quality of reheated samples as if there were freshly cooked. Compared to the effect of the antioxidant extract, the concentration of oxygen in the packaging system was negligible in terms of quality preservation. © 2017 Institute of Food Technologists®.

Regional demand forecasting and simulation model: user's manual. Task 4, final report

DOE Office of Scientific and Technical Information (OSTI.GOV)

Parhizgari, A M

1978-09-25

The Department of Energy's Regional Demand Forecasting Model (RDFOR) is an econometric and simulation system designed to estimate annual fuel-sector-region specific consumption of energy for the US. Its purposes are to (1) provide the demand side of the Project Independence Evaluation System (PIES), (2) enhance our empirical insights into the structure of US energy demand, and (3) assist policymakers in their decisions on and formulations of various energy policies and/or scenarios. This report provides a self-contained user's manual for interpreting, utilizing, and implementing RDFOR simulation software packages. Chapters I and II present the theoretical structure and the simulation of RDFOR,more » respectively. Chapter III describes several potential scenarios which are (or have been) utilized in the RDFOR simulations. Chapter IV presents an overview of the complete software package utilized in simulation. Chapter V provides the detailed explanation and documentation of this package. The last chapter describes step-by-step implementation of the simulation package using the two scenarios detailed in Chapter III. The RDFOR model contains 14 fuels: gasoline, electricity, natural gas, distillate and residual fuels, liquid gases, jet fuel, coal, oil, petroleum products, asphalt, petroleum coke, metallurgical coal, and total fuels, spread over residential, commercial, industrial, and transportation sectors.« less

Package Holds Five Monolithic Microwave Integrated Circuits

NASA Technical Reports Server (NTRS)

Mysoor, Narayan R.; Decker, D. Richard; Olson, Hilding M.

1996-01-01

Packages protect and hold monolithic microwave integrated circuit (MMIC) chips while providing dc and radio-frequency (RF) electrical connections for chips undergoing development. Required to be compact, lightweight, and rugged. Designed to minimize undesired resonances, reflections, losses, and impedance mismatches.

Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication.

PubMed

Schuettler, Martin; Kohler, Fabian; Ordonez, Juan S; Stieglitz, Thomas

2012-01-01

Future brain-computer-interfaces (BCIs) for severely impaired patients are implanted to electrically contact the brain tissue. Avoiding percutaneous cables requires amplifier and telemetry electronics to be implanted too. We developed a hermetic package that protects the electronic circuitry of a BCI from body moisture while permitting infrared communication through the package wall made from alumina ceramic. The ceramic package is casted in medical grade silicone adhesive, for which we identified MED2-4013 as a promising candidate.

Status and Trend of Automotive Power Packaging

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liang, Zhenxian

2012-01-01

Comprehensive requirements in aspects of cost, reliability, efficiency, form factor, weight, and volume for power electronics modules in modern electric drive vehicles have driven the development of automotive power packaging technology intensively. Innovation in materials, interconnections, and processing techniques is leading to enormous improvements in power modules. In this paper, the technical development of and trends in power module packaging are evaluated by examining technical details with examples of industrial products. The issues and development directions for future automotive power module packaging are also discussed.

A Model-Based Expert System for Space Power Distribution Diagnostics

NASA Technical Reports Server (NTRS)

Quinn, Todd M.; Schlegelmilch, Richard F.

1994-01-01

When engineers diagnose system failures, they often use models to confirm system operation. This concept has produced a class of advanced expert systems that perform model-based diagnosis. A model-based diagnostic expert system for the Space Station Freedom electrical power distribution test bed is currently being developed at the NASA Lewis Research Center. The objective of this expert system is to autonomously detect and isolate electrical fault conditions. Marple, a software package developed at TRW, provides a model-based environment utilizing constraint suspension. Originally, constraint suspension techniques were developed for digital systems. However, Marple provides the mechanisms for applying this approach to analog systems such as the test bed, as well. The expert system was developed using Marple and Lucid Common Lisp running on a Sun Sparc-2 workstation. The Marple modeling environment has proved to be a useful tool for investigating the various aspects of model-based diagnostics. This report describes work completed to date and lessons learned while employing model-based diagnostics using constraint suspension within an analog system.

Practical application of HgI2 detectors to a space-flight scanning electron microscope

NASA Technical Reports Server (NTRS)

Bradley, J. G.; Conley, J. M.; Albee, A. L.; Iwanczyk, J. S.; Dabrowski, A. J.

1989-01-01

Mercuric iodide X-ray detectors have been undergoing tests in a prototype scanning electron microscope system being developed for unmanned space flight. The detector program addresses the issues of geometric configuration in the SEM, compact packaging that includes separate thermoelectric coolers for the detector and FET, X-ray transparent hermetic encapsulation and electrical contacts, and a clean vacuum environment.

Micro/nano electro mechanical systems for practical applications

NASA Astrophysics Data System (ADS)

Esashi, Masayoshi

2009-09-01

Silicon MEMS as electrostatically levitated rotational gyroscope, 2D optical scanner and wafer level packaged devices as integrated capacitive pressure sensor and MEMS switch are described. MEMS which use non-silicon materials as diamond, PZT, conductive polymer, CNT (carbon nano tube), LTCC with electrical feedthrough, SiC (silicon carbide) and LiNbO3 for multi-probe data storage, multi-column electron beam lithography system, probe card for wafer-level burn-in test, mould for glass press moulding and SAW wireless passive sensor respectively are also described.

Diagnostic system design for the Ion Auxiliary Propulsion System (IAPS). Flight tests of two 8 cm mercury ion

NASA Technical Reports Server (NTRS)

Hurst, E. B.; Thomas, G. Z.

1981-01-01

The mechanical, thermal, electrical design and the ground test results of four types of detectors are explained. The DSS is designed to measure the thruster efflux material deposition and S/C potential relative to the local plasma in the vicinity of two 8 cm mercury ion thrusters. The DSS consists of two quartz crystal microbalance (QCM) detectors, one potential probe, nine solar cell arrays, seven ion collectors and two electronic packages.

Evaluation and Selection of a Telecommunication System at the Naval Postgraduate School BOQ

DTIC Science & Technology

1991-03-01

software, and operating system software as a part of a complete package. An internal modem must be included for remote diagnostic and programming...2 service delivery will follow the CCITT V.35 recommendation for physical, functional and electrical interfaces. Type 1 & 2 will transfer data at 56K ...by a dedicated access line at 4.8 kbs and 9.6 Kbps and 56k /64Kbps. PSS will follow the CCITT X.25 recommendations. E-mail service may be provided on

Spaceborne synthetic aperture radar pilot study

NASA Technical Reports Server (NTRS)

1974-01-01

A pilot study of a spaceborne sidelooking radar is summarized. The results of the system trade studies are given along with the electrical parameters for the proposed subsystems. The mechanical aspects, packaging, thermal control and dynamics of the proposed design are presented. Details of the data processor are given. A system is described that allows the data from a pass over the U. S. to be in hard copy form within two hours. Also included are the proposed schedule, work breakdown structure, and cost estimate.

Experimental comparison of direct detection Nyquist SSB transmission based on silicon dual-drive and IQ Mach-Zehnder modulators with electrical packaging.

PubMed

Ruan, Xiaoke; Li, Ke; Thomson, David J; Lacava, Cosimo; Meng, Fanfan; Demirtzioglou, Iosif; Petropoulos, Periklis; Zhu, Yixiao; Reed, Graham T; Zhang, Fan

2017-08-07

We have designed and fabricated a silicon photonic in-phase-quadrature (IQ) modulator based on a nested dual-drive Mach-Zehnder structure incorporating electrical packaging. We have assessed its use for generating Nyquist-shaped single sideband (SSB) signals by operating it either as an IQ Mach-Zehnder modulator (IQ-MZM) or using just a single branch of the dual-drive Mach-Zehnder modulator (DD-MZM). The impact of electrical packaging on the modulator bandwidth is also analyzed. We demonstrate 40 Gb/s (10Gbaud) 16-ary quadrature amplitude modulation (16-QAM) Nyquist-shaped SSB transmission over 160 km standard single mode fiber (SSMF). Without using any chromatic dispersion compensation, the bit error rates (BERs) of 5.4 × 10 -4 and 9.0 × 10 -5 were measured for the DD-MZM and IQ-MZM, respectively, far below the 7% hard-decision forward error correction threshold. The performance difference between IQ-MZM and DD-MZM is most likely due to the non-ideal electrical packaging. Our work is the first experimental comparison between silicon IQ-MZM and silicon DD-MZM in generating SSB signals. We also demonstrate 50 Gb/s (12.5Gbaud) 16-QAM Nyquist-shaped SSB transmission over 320 km SSMF with a BER of 2.7 × 10 -3 . Both the silicon IQ-MZM and the DD-MZM show potential for optical transmission at metro scale and for data center interconnection.

Fiber optic interconnect and optoelectronic packaging challenges for future generation avionics

NASA Astrophysics Data System (ADS)

Beranek, Mark W.

2007-02-01

Forecasting avionics industry fiber optic interconnect and optoelectronic packaging challenges that lie ahead first requires an assumption that military avionics architectures will evolve from today's centralized/unified concept based on gigabit laser, optical-to-electrical-to-optical switching and optical backplane technology, to a future federated/distributed or centralized/unified concept based on gigabit tunable laser, electro-optical switch and add-drop wavelength division multiplexing (WDM) technology. The requirement to incorporate avionics optical built-in test (BIT) in military avionics fiber optic systems is also assumed to be correct. Taking these assumptions further indicates that future avionics systems engineering will use WDM technology combined with photonic circuit integration and advanced packaging to form the technical basis of the next generation military avionics onboard local area network (LAN). Following this theme, fiber optic cable plants will evolve from today's multimode interconnect solution to a single mode interconnect solution that is highly installable, maintainable, reliable and supportable. Ultimately optical BIT for fiber optic fault detection and isolation will be incorporated as an integral part of a total WDM-based avionics LAN solution. Cost-efficient single mode active and passive photonic component integration and packaging integration is needed to enable reliable operation in the harsh military avionics application environment. Rugged multimode fiber-based transmitters and receivers (transceivers) with in-package optical BIT capability are also needed to enable fully BIT capable single-wavelength fiber optic links on both legacy and future aerospace platforms.

Packaging of electro-microfluidic devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

2003-04-15

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Packaging of electro-microfluidic devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Watson, Robert D.

2002-01-01

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Electrical Experiments. VT-214-12-1. Part I. Electric Motor Control.

ERIC Educational Resources Information Center

Connecticut State Dept. of Education, Hartford. Div. of Vocational Education.

Designed for high school electronics students, this first document in a series of six electrical learning activity packages focuses on electric motor control. An introductory section gives the objective for the activities, an introduction, and an outline of the content. The remainder of the activity book is comprised of information sheets and job…

Systems special investigation group overview

NASA Technical Reports Server (NTRS)

Mason, James B.; Dursch, Harry; Edelman, Joel

1992-01-01

The Systems Special Investigation Group (SIG) has undertaken investigations in the four major engineering disciplines represented by LDEF hardware: electrical, mechanical, thermal, and optical systems. Testing was planned for the highest possible level of assembly, and top level system tests for nearly all systems were performed at this time. Testing to date was performed on a mix of LDEF and individual experimenter systems. No electrical or mechanical system level failures attributed to the spaceflight environment were detected by the Systems SIG. Some low cost electrical components were used successfully, although relays were a continuing problem. Extensive mechanical galling was observed, but no evidence of coldwelding was identified. A working index of observed systems anomalies was created and will be used to support the tracking and resolution of these effects. LDEF hardware currently available to the Systems SIG includes most of the LDEF facility systems hardware, and some significant experimenter hardware as well. A series of work packages was developed for each of several subsystem types where further testing is of critical interest. The Systems SIG is distributing a regular newsletter to the greater LDEF community in order to maintain coherence in an investigation which is widely scattered both in subject matter and in geography. Circulation of this informal document has quadrupled in its first year.

Novel First-Level Interconnect Techniques for Flip Chip on MEMS Devices

PubMed Central

Sutanto, Jemmy; Anand, Sindhu; Patel, Chetan; Muthuswamy, Jit

2013-01-01

Flip-chip packaging is desirable for microelectro-mechanical systems (MEMS) devices because it reduces the overall package size and allows scaling up the number of MEMS chips through 3-D stacks. In this report, we demonstrate three novel techniques to create first-level interconnect (FLI) on MEMS: 1) Dip and attach technology for Ag epoxy; 2) Dispense technology for solder paste; 3) Dispense, pull, and attach technology (DPAT) for solder paste. The above techniques required no additional microfabrication steps, produced no visible surface contamination on the MEMS active structures, and generated high-aspect-ratio interconnects. The developed FLIs were successfully tested on MEMS moveable microelectrodes microfabricated by SUMMiTVTM process producing no apparent detrimental effect due to outgassing. The bumping processes were successfully applied on Al-deposited bond pads of 100 μm × 100 μm with an average bump height of 101.3 μm for Ag and 184.8 μm for solder (63Sn, 37Pb). DPAT for solder paste produced bumps with the aspect ratio of 1.8 or more. The average shear strengths of Ag and solder bumps were 78 MPa and 689 kPa, respectively. The electrical test on Ag bumps at 794 A/cm2 demonstrated reliable electrical interconnects with negligible resistance. These scalable FLI technologies are potentially useful for MEMS flip-chip packaging and 3-D stacking. PMID:24504168

Intelligent sensor and controller framework for the power grid

DOEpatents

Akyol, Bora A.; Haack, Jereme Nathan; Craig, Jr., Philip Allen; Tews, Cody William; Kulkarni, Anand V.; Carpenter, Brandon J.; Maiden, Wendy M.; Ciraci, Selim

2015-07-28

Disclosed below are representative embodiments of methods, apparatus, and systems for monitoring and using data in an electric power grid. For example, one disclosed embodiment comprises a sensor for measuring an electrical characteristic of a power line, electrical generator, or electrical device; a network interface; a processor; and one or more computer-readable storage media storing computer-executable instructions. In this embodiment, the computer-executable instructions include instructions for implementing an authorization and authentication module for validating a software agent received at the network interface; instructions for implementing one or more agent execution environments for executing agent code that is included with the software agent and that causes data from the sensor to be collected; and instructions for implementing an agent packaging and instantiation module for storing the collected data in a data container of the software agent and for transmitting the software agent, along with the stored data, to a next destination.

Intelligent sensor and controller framework for the power grid

DOE Office of Scientific and Technical Information (OSTI.GOV)

Akyol, Bora A.; Haack, Jereme Nathan; Craig, Jr., Philip Allen

Disclosed below are representative embodiments of methods, apparatus, and systems for monitoring and using data in an electric power grid. For example, one disclosed embodiment comprises a sensor for measuring an electrical characteristic of a power line, electrical generator, or electrical device; a network interface; a processor; and one or more computer-readable storage media storing computer-executable instructions. In this embodiment, the computer-executable instructions include instructions for implementing an authorization and authentication module for validating a software agent received at the network interface; instructions for implementing one or more agent execution environments for executing agent code that is included with themore » software agent and that causes data from the sensor to be collected; and instructions for implementing an agent packaging and instantiation module for storing the collected data in a data container of the software agent and for transmitting the software agent, along with the stored data, to a next destination.« less

Systems special investigation group overview

NASA Technical Reports Server (NTRS)

Mason, James B.; Dursch, Harry; Edelman, Joel

1991-01-01

The Systems Special Investigation Group (SIG) has undertaken investigations in the four major engineering disciplines represented in the Long Duration Exposure Facility (LDEF) hardware: electrical, mechanical, thermal, and optical systems. Testing was planned for the highest possible level of assembly, and top level system tests for nearly all systems were performed at this time. To date, testing was performed on a mix of LDEF and individual experimenter systems. No electrical or mechanical system level failures attributed to the spaceflight environment have yet been detected. Some low cost electrical components were used successfully, although relays were a continuing problem. Mechanical galling was observed unexpectedly, but no evidence of cold welding was identified yet. A working index of observed systems anomalies was created and will be used to support the tracking and resolution of these effects. The LDEF hardware currently available to the Systems SIG includes most of the LDEF systems hardware, and some significant experimenter hardware as well. A series of work packages was developed for each of several subsystem types where further testing is of critical interest. The System SIG is distributing a regular newsletter to the greater LDEF community in order to maintain coherence in an investigation which is widely scattered both in subject matter and in geography. Circulation of this informal document has quadrupled in its first year.

Software package for modeling spin–orbit motion in storage rings

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zyuzin, D. V., E-mail: d.zyuzin@fz-juelich.de

2015-12-15

A software package providing a graphical user interface for computer experiments on the motion of charged particle beams in accelerators, as well as analysis of obtained data, is presented. The software package was tested in the framework of the international project on electric dipole moment measurement JEDI (Jülich Electric Dipole moment Investigations). The specific features of particle spin motion imply the requirement to use a cyclic accelerator (storage ring) consisting of electrostatic elements, which makes it possible to preserve horizontal polarization for a long time. Computer experiments study the dynamics of 10{sup 6}–10{sup 9} particles in a beam during 10{supmore » 9} turns in an accelerator (about 10{sup 12}–10{sup 15} integration steps for the equations of motion). For designing an optimal accelerator structure, a large number of computer experiments on polarized beam dynamics are required. The numerical core of the package is COSY Infinity, a program for modeling spin–orbit dynamics.« less

Preliminary design package for maxi-therm heat exchanger module

NASA Technical Reports Server (NTRS)

1978-01-01

Heat exchangers were developed for use in a solar heating and cooling system installed in a single family dwelling. Each of the three exchangers consisted of a heating and cooling module and a submersed electric water heating element. Information necessary to evaluate the preliminary design of the heat exchanger is presented in terms of the development and verification plans, performance specifications, installation and maintenance, and hazard analysis.

A graph-based computational framework for simulation and optimisation of coupled infrastructure networks

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jalving, Jordan; Abhyankar, Shrirang; Kim, Kibaek

Here, we present a computational framework that facilitates the construction, instantiation, and analysis of large-scale optimization and simulation applications of coupled energy networks. The framework integrates the optimization modeling package PLASMO and the simulation package DMNetwork (built around PETSc). These tools use a common graphbased abstraction that enables us to achieve compatibility between data structures and to build applications that use network models of different physical fidelity. We also describe how to embed these tools within complex computational workflows using SWIFT, which is a tool that facilitates parallel execution of multiple simulation runs and management of input and output data.more » We discuss how to use these capabilities to target coupled natural gas and electricity systems.« less

A graph-based computational framework for simulation and optimisation of coupled infrastructure networks

DOE PAGES

Jalving, Jordan; Abhyankar, Shrirang; Kim, Kibaek; ...

2017-04-24

Here, we present a computational framework that facilitates the construction, instantiation, and analysis of large-scale optimization and simulation applications of coupled energy networks. The framework integrates the optimization modeling package PLASMO and the simulation package DMNetwork (built around PETSc). These tools use a common graphbased abstraction that enables us to achieve compatibility between data structures and to build applications that use network models of different physical fidelity. We also describe how to embed these tools within complex computational workflows using SWIFT, which is a tool that facilitates parallel execution of multiple simulation runs and management of input and output data.more » We discuss how to use these capabilities to target coupled natural gas and electricity systems.« less

Truck circuits diagnosis for railway lines equipped with an automatic block signalling system

NASA Astrophysics Data System (ADS)

Spunei, E.; Piroi, I.; Muscai, C.; Răduca, E.; Piroi, F.

2018-01-01

This work presents a diagnosis method for detecting track circuits failures on a railway traffic line equipped with an Automatic Block Signalling installation. The diagnosis method uses the installation’s electrical schemas, based on which a series of diagnosis charts have been created. Further, the diagnosis charts were used to develop a software package, CDCBla, which substantially contributes to reducing the diagnosis time and human error during failure remedies. The proposed method can also be used as a training package for the maintenance staff. Since the diagnosis method here does not need signal or measurement inputs, using it does not necessitate additional IT knowledge and can be deployed on a mobile computing device (tablet, smart phone).

STS-3/OSS-1 Plasma Diagnostics Package (PDP) measurements of Orbiter transmitter and subsystem electromagnetic interference

NASA Technical Reports Server (NTRS)

Shawhan, S. D.; Murphy, G.

1983-01-01

The plasma diagnostics package receiver system is described to identify the various antennas and to characterize the complement of receivers which cover the frequency range of 30 Hz to 800 Hz and S-band at 2200 + or - 300 MHz. Sample results are presented to show the variability of electromagnetic effects associated with the orbiter and the time variability of these effects. The electric field and magnetic field maximum and minimum field strength spectra observed during the mission at the pallet location are plotted. Values are also derived for the maximum UHF transmitter and S-band transmitter field strengths. Calibration data to convert from the survey plots to actual narrowband and broadband field strengths are listed.

Bi-level microelectronic device package with an integral window

DOEpatents

Peterson, Kenneth A.; Watson, Robert D.

2004-01-06

A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The multilayered package can be formed of a LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded so that the light-sensitive side is optically accessible through the window. The package has at least two levels of circuits for making electrical interconnections to a pair of microelectronic devices. The result is a compact, low-profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device(s).

NASA Electrical, Electronic and Electromechanical (EEE) Parts Assurance, An Overview

NASA Technical Reports Server (NTRS)

Label, Kenneth A.; Sampson, Michael J.

2017-01-01

This presentation will cover NASA Electrical, Electronic and Electromechanical (EEE) Parts Assurance Structure, NASA Electronic Parts and Packaging (NEPP) Program, NASA Electronic Parts Assurance Group (NEPAG), examples of assurance challenges, and future challenges.

Preliminary Results from the First Deployment of a Tethered-Balloon Cloud Particle Imager Instrument Package in Arctic Stratus Clouds at Ny-Alesund

NASA Astrophysics Data System (ADS)

Lawson, P.; Stamnes, K.; Stamnes, J.; Zmarzly, P.; O'Connor, D.; Koskulics, J.; Hamre, B.

2008-12-01

A tethered balloon system specifically designed to collect microphysical data in mixed-phase clouds was deployed in Arctic stratus clouds during May 2008 near Ny-Alesund, Svalbard, at 79 degrees North Latitude. This is the first time a tethered balloon system with a cloud particle imager (CPI) that records high-resolution digital images of cloud drops and ice particles has been operated in cloud. The custom tether supplies electrical power to the instrument package, which in addition to the CPI houses a 4-pi short-wavelength radiometer and a met package that measures temperature, humidity, pressure, GPS position, wind speed and direction. The instrument package was profiled vertically through cloud up to altitudes of 1.6 km. Since power was supplied to the instrument package from the ground, it was possible to keep the balloon package aloft for extended periods of time, up to 9 hours at Ny- Ålesund, which was limited only by crew fatigue. CPI images of cloud drops and the sizes, shapes and degree of riming of ice particles are shown throughout vertical profiles of Arctic stratus clouds. The images show large regions of mixed-phase cloud from -8 to -2 C. The predominant ice crystal habits in these regions are needles and aggregates of needles. The amount of ice in the mixed-phase clouds varied considerably and did not appear to be a function of temperature. On some occasions, ice was observed near cloud base at -2 C with supercooled cloud above to - 8 C that was devoid of ice. Measurements of shortwave radiation are also presented. Correlations between particle distributions and radiative measurements will be analyzed to determine the effect of these Arctic stratus clouds on radiative forcing.

Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2013-01-01

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.

An analytical study of electric vehicle handling dynamics

NASA Technical Reports Server (NTRS)

Greene, J. E.; Segal, D. J.

1979-01-01

Hypothetical electric vehicle configurations were studied by applying available analytical methods. Elementary linearized models were used in addition to a highly sophisticated vehicle dynamics computer simulation technique. Physical properties of specific EV's were defined for various battery and powertrain packaging approaches applied to a range of weight distribution and inertial properties which characterize a generic class of EV's. Computer simulations of structured maneuvers were performed for predicting handling qualities in the normal driving range and during various extreme conditions related to accident avoidance. Results indicate that an EV with forward weight bias will possess handling qualities superior to a comparable EV that is rear-heavy or equally balanced. The importance of properly matching tires, suspension systems, and brake system front/rear torque proportioning to a given EV configuration during the design stage is demonstrated.

Method Of Packaging And Assembling Electro-Microfluidic Devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

2004-11-23

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Multilead, Vaporization-Cooled Soldering Heat Sink

NASA Technical Reports Server (NTRS)

Rice, John

1995-01-01

Vaporization-cooled heat sink proposed for use during soldering of multiple electrical leads of packaged electronic devices to circuit boards. Heat sink includes compliant wicks held in grooves on edges of metal fixture. Wicks saturated with water. Prevents excessive increases in temperature at entrances of leads into package.

Using the TSAR electromagnetic modeling system

NASA Astrophysics Data System (ADS)

Pennock, S. T.; Laguna, G. W.

1993-09-01

A new user, upon receipt of the TSAR EM modeling system, may be overwhelmed by the number of software packages to learn and the number of manuals associated with those packages. This is a document to describe the creation of a simple TSAR model, beginning with an MGED solid and continuing the process through final results from TSAR. It is not intended to be a complete description of all the parts of the TSAR package. Rather, it is intended simply to touch on all the steps in the modeling process and to take a new user through the system from start to finish. There are six basic parts to the TSAR package. The first, MGED, is part of the BRL-CAD package and is used to create a solid model. The second part, ANASTASIA, is the program used to sample the solid model and create a finite-difference mesh. The third program, IMAGE, lets the user view the mesh itself and verify its accuracy. If everything about the mesh is correct, the process continues to the fourth step, SETUP-TSAR, which creates the parameter files for compiling TSAR and the input file for running a particular simulation. The fifth step is actually running TSAR, the field modeling program. Finally, the output from TSAR is placed into SIG, B2RAS or another program for post-processing and plotting. Each of these steps will be described below. The best way to learn to use the TSAR software is to actually create and run a simple test problem. As an example of how to use the TSAR package, let's create a sphere with a rectangular internal cavity, with conical and cylindrical penetrations connecting the outside to the inside, and find the electric field inside the cavity when the object is exposed to a Gaussian plane wave. We will begin with the solid modeling software, MGED, a part of the BRL-CAD modeling release.

Using the TSAR Electromagnetic modeling system

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pennock, S.T.; Laguna, G.W.

1993-09-01

A new user, upon receipt of the TSAR EM modeling system, may be overwhelmed by the number of software packages to learn and the number of manuals associated with those packages. This is a document to describe the creation of a simple TSAR model, beginning with an MGED solid and continuing the process through final results from TSAR. It is not intended to be a complete description of all the parts of the TSAR package. Rather, it is intended simply to touch on all the steps in the modeling process and to take a new user through the system frommore » start to finish. There are six basic parts to the TSAR package. The first, MGED, is part of the BRL-CAD package and is used to create a solid model. The second part, ANASTASIA, is the program used to sample the solid model and create a finite -- difference mesh. The third program, IMAGE, lets the user view the mesh itself and verify its accuracy. If everything about the mesh is correct, the process continues to the fourth step, SETUP-TSAR, which creates the parameter files for compiling TSAR and the input file for running a particular simulation. The fifth step is actually running TSAR, the field modeling program. Finally, the output from TSAR is placed into SIG, B2RAS or another program for post-processing and plotting. Each of these steps will be described below. The best way to learn to use the TSAR software is to actually create and run a simple test problem. As an example of how to use the TSAR package, let`s create a sphere with a rectangular internal cavity, with conical and cylindrical penetrations connecting the outside to the inside, and find the electric field inside the cavity when the object is exposed to a Gaussian plane wave. We will begin with the solid modeling software, MGED, a part of the BRL-CAD modeling release.« less

A fiber optic multi-stress monitoring system for power transformer

NASA Astrophysics Data System (ADS)

Kim, Dae-gil; Sampath, Umesh; Kim, Hyunjin; Song, Minho

2017-04-01

A fiber-optic multi-stress monitoring system which uses 4 FBG sensors and a fiber-optic mandrel acoustic emission sensor is proposed. FBG sensors and a mandrel sensor measure different types of stresses occurring in electrical power transformer, such as temperature and acoustic signals. The sensor system uses single broadband light source to address the outputs of both sensors using single fiber-optic circuitry. An athermal-packaged FBG is used to supply quasi-coherent light for the Sagnac interferometer demodulation which processes the mandrel sensor output. The proposed sensor system could simplify the optical circuit for the multi-stress measurements and enhance the cost-effectiveness of the sensor system.

Characterizing root system characteristics with Electrical resistivity Tomography: a virtual rhizotron simulation

NASA Astrophysics Data System (ADS)

Rao, Sathyanarayan; Ehosioke, Solomon; Lesparre, Nolwenn; Nguyen, Frédéric; Javaux, Mathieu

2017-04-01

Electrical Resistivity Tomography (ERT) is more and more used for monitoring soil water content in a cropped soil. Yet, the impact of roots on the signal is often neglected and a topic of controversy. In several studies related to soil-root system, it has been showed that the measured root mass density statistically correlates with the electrical conductivity (EC) data obtained from ERT. In addition, some studies suggest that some roots are more electrically conductive than soil for most water content. Thus, higher EC of roots suggest that it might have a measurable impact on ERT signals. In this work, virtual rhizotrons are simulated using the software package called R-SWMS that solves water and solute transport in plant root-soil system, including root growth. The distribution of water content obtained from R-SWMS simulation is converted into EC data using pedo-physical models. The electrical properties of roots and rhizosphere are explicitly included in the EC data to form a conductivity map (CM) with a very detailed spatial resolution. Forward ERT simulations is then carried out for CM generated for various root architectures and soil conditions to study the impact of roots on ERT forward (current and voltage patterns) and inverse solutions. It is demonstrated that under typical injection schemes with lateral electrodes, root system is hardly measurable. However, it is showed that adding electrodes and constraints on the ERT inversion based on root architecture help quantifying root system mass and extent.

STS-3/OSS-1 Plasma Diagnostics Package (PDP) measurements of the temperature pressure and plasma

NASA Technical Reports Server (NTRS)

Shawhan, S. D.; Murphy, G.

1983-01-01

Designed to withstand the thermal extremes of the STS-3 mission through the use of heaters and thermal blankets, the plasma diagnostics package sat on the release/engagement mechanism on the OSS-1 payload pallet without a coldplate and was attached to the RMS for two extended periods. Plots show temperature versus mission elapsed time for two temperature sensors. Pressure in the range of 10 to the -3 power torr and 10 to the -7 power torr, measured 3 inches from the skin of the package is plotted against GMT during the mission. The most distinctive feature of the pressure profile is the modulation at the obit period. It was found that pressure peaks when the atmospheric gas is rammed into the cargo bay. Electric and magnetic noise spectra and time variability due to orbiter systems, UHF and S-band transmitter field strengths, and measurements of the ion spectra obtained both in the cargo bay and during experiments are plotted.

Special Section on InterPACK 2017—Part 1

DOE PAGES

Mysore, Kaushik; Narumanchi, Sreekant; Dede, Ercan; ...

2018-03-02

InterPACK is a premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of micro-electronics packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD) founded in 1992 as an ASME-JSME joint biannual conference. Rapid changes in the semiconductor landscape together with findings from InterPACK Pathfinding workshop (IPW) in 2016 led to a significant reset of InterPACK conference priorities and focus to comprehensively address needs of the InterPACK community. As a result, starting in 2017, InterPACK has become an annual conference and the scope of the conference has increased significantly togethermore » with a systems-focus to include some of the most cutting-edge topics in electronics packaging, device integration, and reliability. These topics are organized across five different tracks: (1) heterogeneous integration: microsystems with diverse functionality, (2) servers of the future, (3) structural and physical health monitoring, (4) energy conversion and storage, and (5) transportation: autonomous and electric vehicles.« less

Special Section on InterPACK 2017—Part 1

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mysore, Kaushik; Narumanchi, Sreekant; Dede, Ercan

InterPACK is a premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of micro-electronics packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD) founded in 1992 as an ASME-JSME joint biannual conference. Rapid changes in the semiconductor landscape together with findings from InterPACK Pathfinding workshop (IPW) in 2016 led to a significant reset of InterPACK conference priorities and focus to comprehensively address needs of the InterPACK community. As a result, starting in 2017, InterPACK has become an annual conference and the scope of the conference has increased significantly togethermore » with a systems-focus to include some of the most cutting-edge topics in electronics packaging, device integration, and reliability. These topics are organized across five different tracks: (1) heterogeneous integration: microsystems with diverse functionality, (2) servers of the future, (3) structural and physical health monitoring, (4) energy conversion and storage, and (5) transportation: autonomous and electric vehicles.« less

Guest Editorial: Special Section on InterPACK 2017 - Part 2

DOE Office of Scientific and Technical Information (OSTI.GOV)

Narumanchi, Sreekant V; Mysore, Kaushik; Dede, Ercan

InterPACK is a premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of micro-electronics packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD) founded in 1992 as an ASME-JSME joint biannual conference. Rapid changes in the semiconductor landscape together with findings from InterPACK Pathfinding workshop (IPW) in 2016 led to a significant reset of InterPACK conference priorities and focus to comprehensively address needs of the InterPACK community. As a result, starting in 2017, InterPACK has become an annual conference and the scope of the conference has increased significantly togethermore » with a systems-focus to include some of the most cutting-edge topics in electronics packaging, device integration, and reliability. These topics are organized across five different tracks: (1) heterogeneous integration: microsystems with diverse functionality, (2) servers of the future, (3) structural and physical health monitoring, (4) energy conversion and storage, and (5) transportation: autonomous and electric vehicles.« less

An ultra-compact processor module based on the R3000

NASA Astrophysics Data System (ADS)

Mullenhoff, D. J.; Kaschmitter, J. L.; Lyke, J. C.; Forman, G. A.

1992-08-01

Viable high density packaging is of critical importance for future military systems, particularly space borne systems which require minimum weight and size and high mechanical integrity. A leading, emerging technology for high density packaging is multi-chip modules (MCM). During the 1980's, a number of different MCM technologies have emerged. In support of Strategic Defense Initiative Organization (SDIO) programs, Lawrence Livermore National Laboratory (LLNL) has developed, utilized, and evaluated several different MCM technologies. Prior LLNL efforts include modules developed in 1986, using hybrid wafer scale packaging, which are still operational in an Air Force satellite mission. More recent efforts have included very high density cache memory modules, developed using laser pantography. As part of the demonstration effort, LLNL and Phillips Laboratory began collaborating in 1990 in the Phase 3 Multi-Chip Module (MCM) technology demonstration project. The goal of this program was to demonstrate the feasibility of General Electric's (GE) High Density Interconnect (HDI) MCM technology. The design chosen for this demonstration was the processor core for a MIPS R3000 based reduced instruction set computer (RISC), which has been described previously. It consists of the R3000 microprocessor, R3010 floating point coprocessor and 128 Kbytes of cache memory.

Towards roll-to-roll fabrication of electronics, optics, and optoelectronics for smart and intelligent packaging

NASA Astrophysics Data System (ADS)

Kololuoma, Terho K.; Tuomikoski, Markus; Makela, Tapio; Heilmann, Jali; Haring, Tomi; Kallioinen, Jani; Hagberg, Juha; Kettunen, Ilkka; Kopola, Harri K.

2004-06-01

Embedding of optoelectrical, optical, and electrical functionalities into low-cost products like packages and printed matter can be used to increase their information content. These functionalities make also possible the realization of new type of entertaining, impressive or guiding effects on the product packages and printed matter. For these purposes, components like displays, photodetectors, light sources, solar cells, battery elements, diffractive optical elements, lightguides, electrical conductors, resistors, transistors, switching elements etc. and their integration to functional modules are required. Additionally, the price of the components for low-end products has to be in cent scale or preferably below that. Therefore, new, cost-effective, and volume scale capable manufacturing techniques are required. Recent developments of liquid-phase processable electrical and optical polymeric, inorganic, and hybrid materials - inks - have made it possible to fabricate functional electrical, optical and optoelectrical components by conventional roll-to-roll techniques such as gravure printing, embossing, digital printing, offset, and screen printing on flexible paper and plastic like substrates. In this paper, we show our current achievements in the field of roll-to-roll fabricated, optics, electronics and optoelectronics. With few examples, we also demonstrate the printing and hot-embossing capabilities of table scale printing machines and VTT Electronic's 'PICO' roll-to-roll pilot production facility.

Design consideration for a nuclear electric propulsion system

NASA Technical Reports Server (NTRS)

Phillips, W. M.; Pawlik, E. V.

1978-01-01

A study is currently underway to design a nuclear electric propulsion vehicle capable of performing detailed exploration of the outer-planets. Primary emphasis is on the power subsystem. Secondary emphasis includes integration into a spacecraft, and integration with the thrust subsystem and science package or payload. The results of several design iterations indicate an all-heat-pipe system offers greater reliability, elimination of many technology development areas and a specific weight of under 20 kg/kWe at the 400 kWe power level. The system is compatible with a single Shuttle launch and provides greater safety than could be obtained with designs using pumped liquid metal cooling. Two configurations, one with the reactor and power conversion forward on the spacecraft with the ion engines aft and the other with reactor, power conversion and ion engines aft were selected as dual baseline designs based on minimum weight, minimum required technology development and maximum growth potential and flexibility.

Learning Activity Package, Physical Science. LAP Numbers 8, 9, 10, and 11.

ERIC Educational Resources Information Center

Williams, G. J.

These four units of the Learning Activity Packages (LAPs) for individualized instruction in physical science cover nuclear reactions, alpha and beta particles, atomic radiation, medical use of nuclear energy, fission, fusion, simple machines, Newton's laws of motion, electricity, currents, electromagnetism, Oersted's experiment, sound, light,…

Multiple Learning Strategies Project. Graphics. EMI.

ERIC Educational Resources Information Center

Steinberg, Alan; And Others

This instructional package, designed for educable mentally impaired students, focuses on the vocational area of graphics. Contained in this document are nine learning modules organized into a finishing and bindery unit. Maintenance of a Challenge power cutter, operation of a hand electric stapler, and packaging with kraft paper are examples of…

75 FR 62122 - Energy Conservation Program for Certain Industrial Equipment: Publication of the Petition for...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-10-07

... rating the Altherma products in Europe. The test procedures are EN 14511 ``Air conditioners, liquid chilling packages and heat pumps with electrically driven compressors for space heating and cooling'' and... rated according to European Standard EN 14511, ``Air conditioners, liquid chilling packages and heat...

Satellite Power Systems (SPS) concept definition study. Volume 5: Transportation and operations analysis. [heavy lift launch and orbit transfer vehicles for orbital assembly

NASA Technical Reports Server (NTRS)

Hanley, G.

1978-01-01

The development of transportation systems to support the operations required for the orbital assembly of a 5-gigawatt satellite is discussed as well as the construction of a ground receiving antenna (rectenna). Topics covered include heavy lift launch vehicle configurations for Earth-to LEO transport; the use of chemical, nuclear, and electric orbit transfer vehicles for LEO to GEO operations; personnel transport systems; ground operations; end-to-end analysis of the construction, operation, and maintenance of the satellite and rectenna; propellant production and storage; and payload packaging.

Evaluation of FNS control systems: software development and sensor characterization.

PubMed

Riess, J; Abbas, J J

1997-01-01

Functional Neuromuscular Stimulation (FNS) systems activate paralyzed limbs by electrically stimulating motor neurons. These systems have been used to restore functions such as standing and stepping in people with thoracic level spinal cord injury. Research in our laboratory is directed at the design and evaluation of the control algorithms for generating posture and movement. This paper describes software developed for implementing FNS control systems and the characterization of a sensor system used to implement and evaluate controllers in the laboratory. In order to assess FNS control algorithms, we have developed a versatile software package using Lab VIEW (National Instruments, Corp). This package provides the ability to interface with sensor systems via serial port or A/D board, implement data processing and real-time control algorithms, and interface with neuromuscular stimulation devices. In our laboratory, we use the Flock of Birds (Ascension Technology Corp.) motion tracking sensor system to monitor limb segment position and orientation (6 degrees of freedom). Errors in the sensor system have been characterized and nonlinear polynomial models have been developed to account for these errors. With this compensation, the error in the distance measurement is reduced by 90 % so that the maximum error is less than 1 cm.

Single level microelectronic device package with an integral window

DOEpatents

Peterson, Kenneth A.; Watson, Robert D.

2003-12-09

A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The package can be formed of a multilayered LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during cofiring. The microelectronic device can be flip-chip interconnected so that the light-sensitive side is optically accessible through the window. A glob-top encapsulant or protective cover can be used to protect the microelectronic device and electrical interconnections. The result is a compact, low profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device.

21 CFR 509.15 - Use of polychlorinated biphenyls (PCB's) in establishments manufacturing food-packaging materials.

Code of Federal Regulations, 2014 CFR

2014-04-01

... include, or did include in the past, their use as electrical transformer and capacitor fluids, heat... operation basis. (c) The provisions of this section do not apply to electrical transformers and condensers...

21 CFR 109.15 - Use of polychlorinated biphenyls (PCB's) in establishments manufacturing food-packaging materials.

Code of Federal Regulations, 2013 CFR

2013-04-01

... include, or did include in the past, their use as electrical transformer and capacitor fluids, heat... operation basis. (c) The provisions of this section do not apply to electrical transformers and condensers...

Silicon photonics integrated circuits: a manufacturing platform for high density, low power optical I/O's.

PubMed

Absil, Philippe P; Verheyen, Peter; De Heyn, Peter; Pantouvaki, Marianna; Lepage, Guy; De Coster, Jeroen; Van Campenhout, Joris

2015-04-06

Silicon photonics integrated circuits are considered to enable future computing systems with optical input-outputs co-packaged with CMOS chips to circumvent the limitations of electrical interfaces. In this paper we present the recent progress made to enable dense multiplexing by exploiting the integration advantage of silicon photonics integrated circuits. We also discuss the manufacturability of such circuits, a key factor for a wide adoption of this technology.

Space station power semiconductor package

NASA Technical Reports Server (NTRS)

Balodis, Vilnis; Berman, Albert; Devance, Darrell; Ludlow, Gerry; Wagner, Lee

1987-01-01

A package of high-power switching semiconductors for the space station have been designed and fabricated. The package includes a high-voltage (600 volts) high current (50 amps) NPN Fast Switching Power Transistor and a high-voltage (1200 volts), high-current (50 amps) Fast Recovery Diode. The package features an isolated collector for the transistors and an isolated anode for the diode. Beryllia is used as the isolation material resulting in a thermal resistance for both devices of .2 degrees per watt. Additional features include a hermetical seal for long life -- greater than 10 years in a space environment. Also, the package design resulted in a low electrical energy loss with the reduction of eddy currents, stray inductances, circuit inductance, and capacitance. The required package design and device parameters have been achieved. Test results for the transistor and diode utilizing the space station package is given.

Packaging Technology for Dielectric-Coating-Less Heavy Ion Radiation Testing of High-Voltage (HV) Electronic Parts

NASA Technical Reports Server (NTRS)

Woodworth, Andrew; Chen, Liangyu

2017-01-01

Testing high voltage (HV) electronic parts (greater than 300 V) for sudden event effects (SEE) caused by cosmic rays in the space environment, consisting of energetic heavy-ions, and neutron radiation in the upper atmosphere is a crucial step towards using these parts in spacecraft and aircraft. Due to the nature of cosmic radiation and neutrons, electronic parts are tested for SEE without any packaging and/or shielding over the top of the device. In the case of commercial HV parts, the top of the packaging is etched off and then a thin dielectric coating is placed over the part in order to avoid electrical arcing between the device surface and wire bonds and other components. Even though the effects of the thin dielectric layer on SEE testing can be accounted for, the dielectric layer significantly hinders post testing failure analysis. Replicating the test capability of state-of-the-art packaging while eliminating the need for post radiation test processing of the die surface (that obscures failure analysis) is the goal. To that end, a new packaging concept for HV parts has been developed that requires no dielectric coating over the part. Testing of prototype packages used with Schottky diodes (rated at 1200V) has shown no electrical arcing during testing and leakage currents during reverse bias testing are within the manufactures specifications.

Encapsulants for protecting MEMS devices during post-packaging release etch

DOEpatents

Peterson, Kenneth A.

2005-10-18

The present invention relates to methods to protect a MEMS or microsensor device through one or more release or activation steps in a "package first, release later" manufacturing scheme: This method of fabrication permits wirebonds, other interconnects, packaging materials, lines, bond pads, and other structures on the die to be protected from physical, chemical, or electrical damage during the release etch(es) or other packaging steps. Metallic structures (e.g., gold, aluminum, copper) on the device are also protected from galvanic attack because they are protected from contact with HF or HCL-bearing solutions.

System analyses on advanced nuclear fuel cycle and waste management

NASA Astrophysics Data System (ADS)

Cheon, Myeongguk

To evaluate the impacts of accelerator-driven transmutation of waste (ATW) fuel cycle on a geological repository, two mathematical models are developed: a reactor system analysis model and a high-level waste (HLW) conditioning model. With the former, fission products and residual trans-uranium (TRU) contained in HLW generated from a reference ATW plant operations are quantified and the reduction of TRU inventory included in commercial spent-nuclear fuel (CSNF) is evaluated. With the latter, an optimized waste loading and composition in solidification of HLW are determined and the volume reduction of waste packages associated with CSNF is evaluated. WACOM, a reactor system analysis code developed in this study for burnup calculation, is validated by ORIGEN2.1 and MCNP. WACOM is used to perform multicycle analysis for the reference lead-bismuth eutectic (LBE) cooled transmuter. By applying the results of this analysis to the reference ATW deployment scenario considered in the ATW roadmap, the HLW generated from the ATW fuel cycle is quantified and the reduction of TRU inventory contained in CSNF is evaluated. A linear programming (LP) model has been developed for determination of an optimized waste loading and composition in solidification of HLW. The model has been applied to a US-defense HLW. The optimum waste loading evaluated by the LP model was compared with that estimated by the Defense Waste Processing Facility (DWPF) in the US and a good agreement was observed. The LP model was then applied to the volume reduction of waste packages associated with CSNF. Based on the obtained reduction factors, the expansion of Yucca Mountain Repository (YMR) capacity is evaluated. It is found that with the reference ATW system, the TRU contained in CSNF could be reduced by a factor of ˜170 in terms of inventory and by a factor of ˜40 in terms of toxicity under the assumed scenario. The number of waste packages related to CSNF could be reduced by a factor of ˜8 in terms of volume and by factor of ˜10 on the basis of electricity generation when a sufficient cooling time for discharged spent fuel and zero process chemicals in HLW are assumed. The expansion factor of Yucca Mountain Repository capacity is estimated to be a factor of 2.4, much smaller than the reduction factor of CSNF waste packages, due to the existence of DOE-owned spent fuel and HLW. The YMR, however, could support 10 times greater electricity generation as long as the statutory capacity of DOE-owned SNF and HLW remains unchanged. This study also showed that the reduction of the number of waste packages could strongly be subject to the heat generation rate of HLW and the amount of process chemicals contained in HLW. For a greater reduction of the number of waste packages, a sufficient cooling time for discharged fuel and efforts to minimize the amount of process chemicals contained in HLW are crucial.

Electrical Aspects of Flames in Microgravity Combustion

NASA Technical Reports Server (NTRS)

Dunn-Rankin, D.; Strayer, B.; Weinberg, F.; Carleton, F.

1999-01-01

A principal characteristic of combustion in microgravity is the absence of buoyancy driven flows. In some cases, such as for spherically symmetrical droplet burning, the absence of buoyancy is desirable for matching analytical treatments with experiments. In other cases, however, it can be more valuable to arbitrarily control the flame's convective environment independent of the environmental gravitational condition. To accomplish this, we propose the use of ion generated winds driven by electric fields to control local convection of flames. Such control can produce reduced buoyancy (effectively zero buoyancy) conditions in the laboratory in 1-g facilitating a wide range of laser diagnostics that can probe the system without special packaging required for drop tower or flight tests. In addition, the electric field generated ionic winds allow varying gravitational convection equivalents even if the test occurs in reduced gravity environments.

Three-dimensional direct laser written graphitic electrical contacts to randomly distributed components

NASA Astrophysics Data System (ADS)

Dorin, Bryce; Parkinson, Patrick; Scully, Patricia

2018-04-01

The development of cost-effective electrical packaging for randomly distributed micro/nano-scale devices is a widely recognized challenge for fabrication technologies. Three-dimensional direct laser writing (DLW) has been proposed as a solution to this challenge, and has enabled the creation of rapid and low resistance graphitic wires within commercial polyimide substrates. In this work, we utilize the DLW technique to electrically contact three fully encapsulated and randomly positioned light-emitting diodes (LEDs) in a one-step process. The resolution of the contacts is in the order of 20 μ m, with an average circuit resistance of 29 ± 18 kΩ per LED contacted. The speed and simplicity of this technique is promising to meet the needs of future microelectronics and device packaging.

Design and Operation of an Electrochemical Methanol Concentration Sensor for Direct Methanol Fuel Cell Systems

NASA Technical Reports Server (NTRS)

Narayanan, S. R.; Valdez, T. I.; Chun, W.

2000-01-01

The development of a 150-Watt packaged power source based on liquid feed direct methanol fuel cells is being pursued currently at the Jet propulsion Laboratory for defense applications. In our studies we find that the concentration of methanol in the fuel circulation loop affects the electrical performance and efficiency the direct methanol fuel cell systems significantly. The practical operation of direct methanol fuel cell systems, therefore, requires accurate monitoring and control of methanol concentration. The present paper reports on the principle and demonstration of an in-house developed electrochemical sensor suitable for direct methanol fuel cell systems.

Visual Aspects of the Electric Environment. NECA Electrical Design Guidelines.

ERIC Educational Resources Information Center

National Electrical Contractors Association, Washington, DC.

New design opportunities afforded by modern high-intensity light sources, and the many ways of integrating package air-conditioners with the design of buildings, are discussed. A guide to unitary air-conditioners and heat pumps is included. (RK)

Characterizing the temperature dependence of electronic packaging-material properties

NASA Astrophysics Data System (ADS)

Fu, Chia-Yu; Ume, Charles

1995-06-01

A computer-controlled, temperature-dependent material characterization system has been developed for thermal deformation analysis in electronic packaging applications, especially for printed wiring assembly warpage study. For fiberglass-reinforced epoxy (FR-4 type) material, the Young's moduli decrease to as low as 20-30% of the room-temperature values, while the shear moduli decrease to as low as 60-70% of the room-temperature values. The electrical resistance strain gage technique was used in this research. The test results produced overestimated values in property measurements, and this was shown in a case study. A noncontact strau]n measurement technique (laser extensometer) is now being used to measure these properties. Discrepancies of finite-element warpage predictions using different property values increase as the temperature increases from the stress-free temperature.

Measurements by the plasma diagnostics package on STS-3

NASA Technical Reports Server (NTRS)

Shawhan, S. D.; Murphy, G. B.

1982-01-01

A comprehensive set of measurements about the orbiter environment are provided by the plasma diagnostics package (PDP). Ion and electron particle densities, energies, and spatial distribution functions; ion mass for identification of particular molecular ion species; and magnetic fields, electric fields and electromagnetic waves over a broad frequency range are studied. Shuttle environmental measurements will be made both on the pallet and, by use of the remote manipulator system (RMS), the PDP will be maneuvered in and external to the bay area to continue environmental measurements and to carry on a joint plasma experiment with the Utah State University fast-pulsed electron generator. Results of orbiter environment EMI measurements and S-band field strengths as well as preliminary results from wake search operations indicating wake boundary identifiers are reported.

MIC: Magnetically Deployable Structures for Power, Propulsion, Processing, Habitats and Energy Storage at Manned Lunar Bases

NASA Astrophysics Data System (ADS)

Powell, James; Maise, George; Paniagua, John; Rather, John

2007-01-01

MIC (Magnetically Inflated Cables) is a new approach for robotically erecting very large, strong, rigid, and ultra-lightweight structures in space. MIC structures use a network of high current (SC) cables with attached high tensile strength Kevlar or Spectra tethers. MIC is launched as a compact package of coiled SC cables and tethers on a conventional launch vehicle. Once in space the SC cables are electrically energized. The resultant strong outwards magnetic forces expand them and the restraining tethers into a large structure, which can be 100's of meters in size. MIC structures can be configured for many different applications, including solar electric generation, solar thermal propulsion, energy storage, large space telescopes, magnetic shielding for astronauts, etc. The MIC technology components, including high temperature superconductors (HTS), thermal insulation, high strength tethers, and cryogenic refrigerators all exist commercially. Refrigeration requirements are very modest, on the order of 100 watts thermal per kilometer of MIC cable, with an input electric power to the refrigeration system of ~5 kW(e) per km. baseline MIC designs are described for a manned lunar base, including: 1) a 1 MW(e) solar electric system, 2) a high Isp (~900 seconds) solar thermal tug to transport 30 ton payloads between the Earth and the Moon, 3) a 2000 Megajoule electric energy storage system for peaking and emergency power, and 4) a large (~1 km) space telescope.

Evaluation of High-Power Solar Electric Propulsion using Advanced Ion, Hall, MPD, and PIT Thrusters for Lunar and Mars Cargo Missions

NASA Technical Reports Server (NTRS)

Frisbee, Robert H.

2006-01-01

This paper presents the results of mission analyses that expose the advantages and disadvantages of high-power (MWe-class) Solar Electric Propulsion (SEP) for Lunar and Mars Cargo missions that would support human exploration of the Moon and Mars. In these analyses, we consider SEP systems using advanced Ion thrusters (the Xenon [Xe] propellant Herakles), Hall thrusters (the Bismuth [Bi] propellant Very High Isp Thruster with Anode Layer [VHITAL], magnetoplasmadynamic (MPD) thrusters (the Lithium [Li] propellant Advanced Lithium-Fed, Applied-field Lorentz Force Accelerator (ALFA2), and pulsed inductive thruster (PIT) (the Ammonia [NH3] propellant Nuclear-PIT [NuPIT]). The analyses include comparison of the advanced-technology propulsion systems (VHITAL, ALFA2, and NuPIT) relative to state-of-theart Ion (Herakles) propulsion systems and quantify the unique benefits of the various technology options such as high power-per-thruster (and/or high power-per-thruster packaging volume), high specific impulse (Isp), high-efficiency, and tankage mass (e.g., low tankage mass due to the high density of bismuth propellant). This work is based on similar analyses for Nuclear Electric Propulsion (NEP) systems.

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Interconnections & Assembly Low Cost Glass Interposers & Packages MEMS and Sensors GRA Opportunities addressing electrical, mechanical and thermal barriers. Low-cost Glass Interposer and Package Panel-based ultra-thin glass as a high performance, high I/O density, and low cost platform. Interconnections and

A Suprachoroidal Electrical Retinal Stimulator Design for Long-Term Animal Experiments and In Vivo Assessment of Its Feasibility and Biocompatibility in Rabbits

PubMed Central

Zhou, J. A.; Woo, S. J.; Park, S. I.; Kim, E. T.; Seo, J. M.; Chung, H.; Kim, S. J.

2008-01-01

This article reports on a retinal stimulation system for long-term use in animal electrical stimulation experiments. The presented system consisted of an implantable stimulator which provided continuous electrical stimulation, and an external component which provided preset stimulation patterns and power to the implanted stimulator via a paired radio frequency (RF) coil. A rechargeable internal battery and a parameter memory component were introduced to the implanted retinal stimulator. As a result, the external component was not necessary during the stimulation mode. The inductive coil pair was used to pass the parameter data and to recharge the battery. A switch circuit was used to separate the stimulation mode from the battery recharging mode. The implantable stimulator was implemented with IC chips and the electronics, except for the stimulation electrodes, were hermetically packaged in a biocompatible metal case. A polyimide-based gold electrode array was used. Surgical implantation into rabbits was performed to verify the functionality and safety of this newly designed system. The electrodes were implanted in the suprachoroidal space. Evoked cortical potentials were recorded during electrical stimulation of the retina. Long-term follow-up using OCT showed no chorioretinal abnormality after implantation of the electrodes. PMID:18317521

Energy Savings Measure Packages. Existing Homes

DOE Office of Scientific and Technical Information (OSTI.GOV)

Casey, Sean; Booten, Chuck

2011-11-01

This document presents the most cost effective Energy Savings Measure Packages (ESMP) for existing mixed-fuel and all electric homes to achieve 15% and 30% savings for each BetterBuildings grantee location across the United States. These packages are optimized for minimum cost to homeowners for source energy savings given the local climate and prevalent building characteristics (i.e. foundation types). Maximum cost savings are typically found between 30% and 50% energy savings over the reference home; this typically amounts to $300 - $700/year.

Design and evaluation of brushless electrical generators

NASA Technical Reports Server (NTRS)

Collins, F. A.; Ellis, J. N.

1970-01-01

Ten design manuals assembled and nine computer programs are developed for evaluation of proposed designs of brushless rotating electrical generators. Design manual package provides all information required for generator design, and computer programs permit calculation of performance of specific designs including effects of materials.

Biomedical Interdisciplinary Curriculum Project: BIP (Biomedical Instrumentation Package) User's Manual.

ERIC Educational Resources Information Center

Biomedical Interdisciplinary Curriculum Project, Berkeley, CA.

Described is the Biomedical Instrument Package (BIP) and its use. The BIP was developed for use in understanding colorimetry, sound, electricity, and bioelectric phenomena. It can also be used in a wide range of measurements such as current, voltage, resistance, temperature, and pH. Though it was developed primarily for use in biomedical science…

A flexible CPW package for a 30 GHz MMIC amplifier. [coplanar waveguide

NASA Technical Reports Server (NTRS)

Simons, Rainee N.; Taub, Susan R.

1992-01-01

A novel package, which consists of a carrier housing, has been developed for monolithic-millimeter wave Integrated Circuit amplifiers which operate at 30 giga-Hz. The carrier has coplanar waveguide (CPW) interconnects and provides heat-sinking, tuning, and cascading capabilities. The housing provides electrical isolation, mechanical protection and a feed-thru for biasing.

MEMS Applications in Aerodynamic Measurement Technology

NASA Technical Reports Server (NTRS)

Reshotko, E.; Mehregany, M.; Bang, C.

1998-01-01

Microelectromechanical systems (MEMS) embodies the integration of sensors, actuators, and electronics on a single substrate using integrated circuit fabrication techniques and compatible bulk and surface micromachining processes. Silicon and its derivatives form the material base for the MEMS technology. MEMS devices, including microsensors and microactuators, are attractive because they can be made small (characteristic dimension about 100 microns), be produced in large numbers with uniform performance, include electronics for high performance and sophisticated functionality, and be inexpensive. For aerodynamic measurements, it is preferred that sensors be small so as to approximate measurement at a point, and in fact, MEMS pressure sensors, wall shear-stress sensors, heat flux sensors and micromachined hot wires are nearing application. For the envisioned application to wind tunnel models, MEMS sensors can be placed on the surface or in very shallow grooves. MEMS devices have often been fabricated on stiff, flat silicon substrates, about 0.5 mm thick, and therefore were not easily mounted on curved surfaces. However, flexible substrates are now available and heat-flux sensor arrays have been wrapped around a curved turbine blade. Electrical leads can also be built into the flexible substrate. Thus MEMS instrumented wind tunnel models do not require deep spanwise grooves for tubes and leads that compromise the strength of conventionally instrumented models. With MEMS, even the electrical leads can potentially be eliminated if telemetry of the signals to an appropriate receiver can be implemented. While semiconductor silicon is well known for its electronic properties, it is also an excellent mechanical material for MEMS applications. However, silicon electronics are limited to operations below about 200 C, and silicon's mechanical properties start to diminish above 400 C. In recent years, silicon carbide (SiC) has emerged as the leading material candidate for applications in high temperature environments and can be used for high-temperature MEMS applications. With SiC, diodes and more complex electronics have been shown to operate to about 600 C, while the mechanical properties of SiC are maintained to much higher temperatures. Even when MEMS devices show benefits in the laboratory, there are many packaging challenges for any aeronautics application. Incorporating MEMS into these applications requires new approaches to packaging that goes beyond traditional integrated circuit (IC) packaging technologies. MEMS must interact mechanically, as well as electrically with their environment, making most traditional chip packaging and mounting techniques inadequate. Wind tunnels operate over wide temperature ranges in an environment that is far from being a 'clean-room.' In flight, aircraft are exposed to natural elements (e.g. rain, sun, ice, insects and dirt) and operational interferences(e.g. cleaning and deicing fluids, and maintenance crews). In propulsion systems applications, MEMS devices will have to operate in environments containing gases with very high temperatures, abrasive particles and combustion products. Hence deployment and packaging that maintains the integrity of the MEMS system is crucial. This paper presents an overview of MEMS fabrication and materials, descriptions of available sensors with more details on those being developed in our laboratories, and a discussion of sensor deployment options for wind tunnel and flight applications.

Experimental Measurements of the Dynamic Electric Field Topology Associated with Magnetized RF Sheaths

NASA Astrophysics Data System (ADS)

Martin, E. H.; Caughman, J. B. O.; Shannon, S. C.; Klepper, C. C.; Isler, R. C.

2013-10-01

A major challenge facing magnetic fusion devices and the success of ITER is the design and implementation of reliable ICRH systems. The primary issue facing ICRH is the parasitic near-field which leads to an increased heat flux, sputtering, and arcing of the antenna/faraday screen. In order to aid the theoretical development of near-field physics and thus propel the design process experimental measurements are highly desired. In this work we have developed a diagnostic based on passive emission spectroscopy capable of measuring time periodic electric fields utilizing a generalized dynamic Stark effect model and a novel spectral line profile fitting package. The diagnostic was implemented on a small scale laboratory experiment designed to simulate the edge environment associated with ICRF antenna/faraday screen. The spatially and temporally resolved electric field associated with magnetized RF sheaths will be presented for two field configurations: magnetic field parallel to electric field and magnetic field perpendicular to electric field, both hydrogen and helium discharges where investigated. ORNL is managed by UT-Battelle, LCC, for the US DOE under Contract No. DE-AC05-00OR22725.

Space Construction System Analysis. Special Emphasis Studies

NASA Technical Reports Server (NTRS)

1979-01-01

Generic concepts were analyzed to determine: (1) the maximum size of a deployable solar array which might be packaged into a single orbit payload bay; (2) the optimal overall shape of a large erectable structure for large satellite projects; (3) the optimization of electronic communication with emphasis on the number of antennas and their diameters; and (4) the number of beams, traffic growth, and projections and frequencies were found feasible to package a deployable solar array which could generate over 250 kilowatts of electrical power. Also, it was found that the linear-shaped erectable structure is better for ease of construction and installation of systems, and compares favorably on several other counts. The study of electronic communication technology indicated that proliferation of individual satellites will crowd the spectrum by the early 1990's, so that there will be a strong tendency toward a small number of communications platforms over the continental U.S.A. with many antennas and multiple spot beams.

Nuclear electric propulsion: A better, safer, cheaper transportation system for human exploration of Mars

NASA Technical Reports Server (NTRS)

Clark, John S.; George, Jeffrey A.; Gefert, Leon P.; Doherty, Michael P.; Sefcik, Robert J.

1994-01-01

NASA has completed a preliminary mission and systems study of nuclear electric propulsion (NEP) systems for 'split-sprint' human exploration and related robotic cargo missions to Mars. This paper describes the study, the mission architecture selected, the NEP system and technology development needs, proposed development schedules, and estimated development costs. Since current administration policy makers have delayed funding for key technology development activities that could make Mars exploration missions a reality in the near future, NASA will have time to evaluate various alternate mission options, and it appears prudent to ensure that Mars mission plans focus on astronaut and mission safety, while reducing costs to acceptable levels. The split-sprint nuclear electric propulsion system offers trip times comparable to nuclear thermal propulsion (NTP) systems, while providing mission abort opportunities that are not possible with 'reference' mission architectures. Thus, NEP systems offer short transit times for the astronauts, reducing the exposure of the crew to intergalactic cosmic radiation. The high specific impulse of the NEP system, which leads to very low propellant requirements, results in significantly lower 'initial mass in low earth orbit' (IMLEO). Launch vehicle packaging studies show that the NEP system can be launched, assembled, and deployed, with about one less 240-metric-ton heavy lift launch vehicle (HLLV) per mission opportunity - a very Technology development cost of the nuclear reactor for an NEP system would be shared with the proposed nuclear surface power systems, since nuclear systems will be required to provide substantial electrical power on the surface of Mars. The NEP development project plan proposed includes evolutionary technology development for nuclear electric propulsion systems that expands upon SP-100 (Space Power - 100 kw(e)) technology that has been developed for lunar and Mars surface nuclear power, and small NEP systems for interplanetary probes. System upgrades are expected to evolve that will result in even shorter trip times, improved payload capabilities, and enhanced safety and reliability.

Modular packaging concept for MEMS and MOEMS

NASA Astrophysics Data System (ADS)

Stenchly, Vanessa; Reinert, Wolfgang; Quenzer, Hans-Joachim

2017-11-01

Wherever technical systems detect objects in their environment or interact with people, optical devices may play an important role. Light can be relatively easily produced and spatially and temporally modulated. Laser can project sharp images over long distances or cut materials in short distances. Depending on the wavelength an invisible scanning in near infrared for gesture recognition is possible as well as a projection of brilliant colour images. For several years, the Fraunhofer ISIT develops Opto-Packaging processes based on the viscous reshaping of glass wafers: First, hermetically sealed laser micro-mirror scanners WLP with inclined windows deflect in the central light reflex of the window out of the image area. Second, housing with lateral light exit permits hermetic sealing of edge-emitting lasers for highest reliability and durability. Such systems are currently experiencing an extremely high interest of the industry in all segments, from consumer to automotive through to materials processing. Our modular Opto-Packaging platform enables fast product developments. Housing for opto mechanical MEMS devices are equipped with inclined windows to minimize distortion, stray light and reflection losses. The hot viscous glass forming technology is also applied to functionalized substrate wafers which possess areas with high heat dissipation in addition to thermally insulating areas. Electrical contacts may be realized with metal filled vias or TGV (Through Glass Vias). The modular system reduces the development times for new, miniaturized optical systems so that manufacturers can focus on the essentials in their development, namely their product functionalities.

Processing of thermionic power on an electrically propelled spacecraft

NASA Technical Reports Server (NTRS)

Macie, T. W.

1973-01-01

A study to define the power processing equipment required between a thermionic reactor and an array of mercury-ion thrusters for a nuclear electric propulsion system is reported. Observations and recommendations that resulted from this study were: (1) the preferred thermionic-fuel-element source voltages are 23 V or higher; (2) transistor characteristics exert a strong effect on power processor mass; (3) the power processor mass could be considerably reduced should the magnetic materials that exhibit low losses at high frequencies, that have a high Curie point, and that can operate at 15 to 20 kG become avaliable; (4) electrical component packaging on the radiator could reduce the area that is sensitive to meteoroid penetration, thereby reducing the meteoroid shielding mass requirement; (5) an experimental model of the power processor design should be built and tested to verify the efficiencies, masses, and all the automatic operational aspects of the design.

Fabrication and electrical characterization of partially metallized vias fabricated by inkjet

NASA Astrophysics Data System (ADS)

Khorramdel, B.; Mäntysalo, M.

2016-04-01

Through silicon vias (TSVs), acting as vertical interconnections, play an important role in micro-electro-mechanical systems (MEMS) 3D wafer level packaging. Today, taking advantage of nanoparticle inks, inkjet technologies as local filling methods could be used to plate the inside the vias with a conductive material, rather than using a current method, such as chemical vapor deposition or electrolytic growth. This could decrease the processing time, cost and waste material produced. In this work, we have fabricated and demonstrated electrical characterization of TSVs with a top diameter of 85 μm, and partially metallized on their inside walls using silver nanoparticle ink and drop-on-demand inkjet printing. Electrical measurement showed that the resistance of a single via with a void free coverage from top to bottom could be less than 4 Ω, which is still acceptable for MEMS applications.

Transient response measurements on a satellite system

NASA Technical Reports Server (NTRS)

Nanevicz, J. E.; Adamo, R. C.

1977-01-01

A set of instruments designed to detect the occurance of electrical breakdown was flown on a synchronous-orbit satellite. The LeRC sensors were installed on cables inside the vehicle. Accordingly, they respond to signals coupled into the satellite wiring system. The SRI sensors were located on the exterior of the vehicle and detected the RF noise pulses associated with surface breakdowns. The results of the earlier SRI program are being used to design and develop a set of intrumentation suitable for inclusion as a general piggy-back package for the detection of the onset of satellite charging and breakdowns on synchronous orbit satellites.

Miniature low-power inertial sensors: promising technology for implantable motion capture systems.

PubMed

Lambrecht, Joris M; Kirsch, Robert F

2014-11-01

Inertial and magnetic sensors are valuable for untethered, self-contained human movement analysis. Very recently, complete integration of inertial sensors, magnetic sensors, and processing into single packages, has resulted in miniature, low power devices that could feasibly be employed in an implantable motion capture system. We developed a wearable sensor system based on a commercially available system-in-package inertial and magnetic sensor. We characterized the accuracy of the system in measuring 3-D orientation-with and without magnetometer-based heading compensation-relative to a research grade optical motion capture system. The root mean square error was less than 4° in dynamic and static conditions about all axes. Using four sensors, recording from seven degrees-of-freedom of the upper limb (shoulder, elbow, wrist) was demonstrated in one subject during reaching motions. Very high correlation and low error was found across all joints relative to the optical motion capture system. Findings were similar to previous publications using inertial sensors, but at a fraction of the power consumption and size of the sensors. Such ultra-small, low power sensors provide exciting new avenues for movement monitoring for various movement disorders, movement-based command interfaces for assistive devices, and implementation of kinematic feedback systems for assistive interventions like functional electrical stimulation.

Multisensor system for tunnel inspection

NASA Astrophysics Data System (ADS)

Idoux, Maurice

2005-01-01

The system is aimed at assisting inspection and monitoring of the degradation of tunnels in order to minimize maintenance and repair time. ATLAS 70 is a complete sensors/software package which enables thorough diagnosis of tunnel wall conditions. The data collected locally are stored on a computer hard disk for subsequent analysis in a remote location via elaborate dedicated software. The sensors and local computer are loaded onto a rail and/or road vehicle of specific design, i.e. with even travelling speed of 2 to 5 km/h. Originally, the system has been developed for the Paris Underground Company and has since been applied to rail and road tunnels, large town sewage systems, clean water underground aqueducts and electric cable tunnels.

WASTE TREATMENT BUILDING SYSTEM DESCRIPTION DOCUMENT

DOE Office of Scientific and Technical Information (OSTI.GOV)

F. Habashi

2000-06-22

The Waste Treatment Building System provides the space, layout, structures, and embedded subsystems that support the processing of low-level liquid and solid radioactive waste generated within the Monitored Geologic Repository (MGR). The activities conducted in the Waste Treatment Building include sorting, volume reduction, and packaging of dry waste, and collecting, processing, solidification, and packaging of liquid waste. The Waste Treatment Building System is located on the surface within the protected area of the MGR. The Waste Treatment Building System helps maintain a suitable environment for the waste processing and protects the systems within the Waste Treatment Building (WTB) from mostmore » of the natural and induced environments. The WTB also confines contaminants and provides radiological protection to personnel. In addition to the waste processing operations, the Waste Treatment Building System provides space and layout for staging of packaged waste for shipment, industrial and radiological safety systems, control and monitoring of operations, safeguards and security systems, and fire protection, ventilation and utilities systems. The Waste Treatment Building System also provides the required space and layout for maintenance activities, tool storage, and administrative facilities. The Waste Treatment Building System integrates waste processing systems within its protective structure to support the throughput rates established for the MGR. The Waste Treatment Building System also provides shielding, layout, and other design features to help limit personnel radiation exposures to levels which are as low as is reasonably achievable (ALARA). The Waste Treatment Building System interfaces with the Site Generated Radiological Waste Handling System, and with other MGR systems that support the waste processing operations. The Waste Treatment Building System interfaces with the General Site Transportation System, Site Communications System, Site Water System, MGR Site Layout, Safeguards and Security System, Site Radiological Monitoring System, Site Electrical Power System, Site Compressed Air System, and Waste Treatment Building Ventilation System.« less

Characterization of a High-SpeedHigh-Power Semiconductor Master-Oscillator Power-Amplifier (MOPA) Laser as a Free-Space Transmitter

NASA Astrophysics Data System (ADS)

Wright, M. W.

2000-04-01

Semiconductor lasers offer promise as high-speed transmitters for free-space optical communication systems. This article examines the performance of a semiconductor laser system in a master-oscillator power-amplifier (MOPA) geometry developed through a Small Business Innovation Research (SBIR) contract with SDL, Inc. The compact thermo-electric cooler (TEC) packaged device is capable of 1-W output optical power at greater than 2-Gb/s data rates and a wavelength of 960 nm. In particular, we have investigated the effects of amplified spontaneous emission on the modulation extinction ratio and bit-error rate (BER) performance. BERs of up to 10^(-9) were possible at 1.4 Gb/s; however, the modulation extinction ratio was limited to 6 dB. Other key parameters for a free-space optical transmitter, such as the electrical-optical efficiency (24 percent) and beam quality, also were measured.

Computerized power supply analysis: State equation generation and terminal models

NASA Technical Reports Server (NTRS)

Garrett, S. J.

1978-01-01

To aid engineers that design power supply systems two analysis tools that can be used with the state equation analysis package were developed. These tools include integration routines that start with the description of a power supply in state equation form and yield analytical results. The first tool uses a computer program that works with the SUPER SCEPTRE circuit analysis program and prints the state equation for an electrical network. The state equations developed automatically by the computer program are used to develop an algorithm for reducing the number of state variables required to describe an electrical network. In this way a second tool is obtained in which the order of the network is reduced and a simpler terminal model is obtained.

Integrated Electrode Arrays for Neuro-Prosthetic Implants

NASA Technical Reports Server (NTRS)

Brandon, Erik; Mojarradi, Mohammede

2003-01-01

Arrays of electrodes integrated with chip-scale packages and silicon-based integrated circuits have been proposed for use as medical electronic implants, including neuro-prosthetic devices that might be implanted in brains of patients who suffer from strokes, spinal-cord injuries, or amyotrophic lateral sclerosis. The electrodes of such a device would pick up signals from neurons in the cerebral cortex, and the integrated circuit would perform acquisition and preprocessing of signal data. The output of the integrated circuit could be used to generate, for example, commands for a robotic arm. Electrode arrays capable of acquiring electrical signals from neurons already exist, but heretofore, there has been no convenient means to integrate these arrays with integrated-circuit chips. Such integration is needed in order to eliminate the need for the extensive cabling now used to pass neural signals to data-acquisition and -processing equipment outside the body. The proposed integration would enable progress toward neuro-prostheses that would be less restrictive of patients mobility. An array of electrodes would comprise a set of thin wires of suitable length and composition protruding from and supported by a fine-pitch micro-ball grid array or chip-scale package (see figure). The associated integrated circuit would be mounted on the package face opposite the probe face, using the solder bumps (the balls of the ball grid array) to make the electrical connections between the probes and the input terminals of the integrated circuit. The key innovation is the insertion of probe wires of the appropriate length and material into the solder bumps through a reflow process, thereby fixing the probes in place and electrically connecting them with the integrated circuit. The probes could be tailored to any distribution of lengths and made of any suitable metal that could be drawn into fine wires. Furthermore, the wires could be coated with an insulating layer using anodization or other processes, to achieve the correct electrical impedance. The probe wires and the packaging materials must be biocompatible using such materials as lead-free solders. For protection, the chip and package can be coated with parylene.

Nonlinearity-aware 200  Gbit/s DMT transmission for C-band short-reach optical interconnects with a single packaged electro-absorption modulated laser.

PubMed

Zhang, Lu; Hong, Xuezhi; Pang, Xiaodan; Ozolins, Oskars; Udalcovs, Aleksejs; Schatz, Richard; Guo, Changjian; Zhang, Junwei; Nordwall, Fredrik; Engenhardt, Klaus M; Westergren, Urban; Popov, Sergei; Jacobsen, Gunnar; Xiao, Shilin; Hu, Weisheng; Chen, Jiajia

2018-01-15

We experimentally demonstrate the transmission of a 200 Gbit/s discrete multitone (DMT) at the soft forward error correction limit in an intensity-modulation direct-detection system with a single C-band packaged distributed feedback laser and traveling-wave electro absorption modulator (DFB-TWEAM), digital-to-analog converter and photodiode. The bit-power loaded DMT signal is transmitted over 1.6 km standard single-mode fiber with a net rate of 166.7 Gbit/s, achieving an effective electrical spectrum efficiency of 4.93 bit/s/Hz. Meanwhile, net rates of 174.2 Gbit/s and 179.5 Gbit/s are also demonstrated over 0.8 km SSMF and in an optical back-to-back case, respectively. The feature of the packaged DFB-TWEAM is presented. The nonlinearity-aware digital signal processing algorithm for channel equalization is mathematically described, which improves the signal-to-noise ratio up to 3.5 dB.

Space Shuttle Projects

NASA Image and Video Library

1999-11-30

These five STS-97 crew members posed for a traditional portrait during training. On the front row, left to right, are astronauts Michael J. Bloomfield, pilot; Marc Garneau, mission specialist representing the Canadian Space Agency (CSA); and Brent W. Jett, Jr., commander. In the rear, wearing training versions of the extravehicular mobility unit (EMU) space suits, (left to right) are astronauts Carlos I. Noriega, and Joseph R. Tarner, both mission specialists. The primary objective of the STS-97 mission was the delivery, assembly, and activation of the U.S. electrical power system onboard the International Space Station (ISS). The electrical power system, which is built into a 73-meter (240-foot) long solar array structure consists of solar arrays, radiators, batteries, and electronics. The entire 15.4-metric ton (17-ton) package is called the P6 Integrated Truss Segment and is the heaviest and largest element yet delivered to the station aboard a space shuttle. The electrical system will eventually provide the power necessary for the first ISS crews to live and work in the U.S. segment. The STS-97 crew of five launched aboard the Space Shuttle Orbiter Endeavor on November 30, 2000 for an 11 day mission.

NASA Electronic Parts and Packaging (NEPP): Space Qualification Guidelines of Optoelectronic and Photonic Devices for Optical Communication Systems

NASA Technical Reports Server (NTRS)

Kim, Quiesup

2001-01-01

Key elements of space qualification of opto-electric and photonic optical devices were overviewed. Efforts were concentrated on the reliability concerns of the devices needed for potential applications in space environments. The ultimate goal for this effort is to gradually establish enough data to develop a space qualification plan of newly developed specific photonic parts using empirical and numerical models to assess the life-time and degradation of the devices for potential long term space missions.

The SYSGEN user package

NASA Technical Reports Server (NTRS)

Carlson, C. R.

1981-01-01

The user documentation of the SYSGEN model and its links with other simulations is described. The SYSGEN is a production costing and reliability model of electric utility systems. Hydroelectric, storage, and time dependent generating units are modeled in addition to conventional generating plants. Input variables, modeling options, output variables, and reports formats are explained. SYSGEN also can be run interactively by using a program called FEPS (Front End Program for SYSGEN). A format for SYSGEN input variables which is designed for use with FEPS is presented.

Low-cost CWDM transmitter package

NASA Astrophysics Data System (ADS)

Bhandarkar, Navin; Castillega, Jaime

2005-03-01

A low-cost coarse-wavelength-division multiplexer (CWDM) transmitter that combines four channels (wavelengths) in the infrared spectrum (~1310 nm) in a small form-factor un-cooled package is demonstrated. The package utilizes precision molded optics to multiplex beams from four grating-outcoupled surface-emitting (GSE) lasers into a single beam suitable for coupling into multimode fiber. This paper summarizes the optical and opto-mechanical design, fabrication and assembly of prototypes, and optical, thermal and electrical measurement results of the prototypes. This unique design enables multiplexing of wavelengths without the use of filters, waveguides, couplers and fiber splicing. Commercial fabrication and alignment technology is used to manufacture the package, resulting in a more robust, reliable and low-cost transmitter. The transmitter package is enabled by the unique characteristics of the long-wavelength GSE laser.

Jig Aligns Shadow Mask On CCD

NASA Technical Reports Server (NTRS)

Matus, Carlos V.

1989-01-01

Alignment viewed through microscope. Alignment jig positions shadow mask on charge-coupled device (CCD) so metal film deposited on it precisely. Allows CCD package to be inserted and removed without disturbing alignment of mask. Holds CCD packages securely and isolates it electrostatically while providing electrical contact to each of its pins. When alignment jig assembled with CCD, used to move mask under micrometer control.

Electricity. Electrical Appliance Serviceman (Major Resistive Type).

ERIC Educational Resources Information Center

Moughan, John P.; And Others

Two types of materials comprise the curriculum guide: descriptive information about student, job and individualized instruction techniques for use by the instructor and a set of 10 learning activity packages for the student. Together, these form a work unit which, when successfully completed by the student, provides the necessary skills for an…

Science Activities in Energy: Electrical Energy.

ERIC Educational Resources Information Center

Oak Ridge Associated Universities, TN.

Presented is a science activities in energy package which includes 16 activities relating to electrical energy. Activities are simple, concrete experiments for fourth, fifth and sixth grades which illustrate principles and problems relating to energy. Each activity is outlined in a single card which is introduced by a question. A teacher's…

Basic Electricity. Training Module 3.325.1.77.

ERIC Educational Resources Information Center

Kirkwood Community Coll., Cedar Rapids, IA.

This document is an instructional module package prepared in objective form for use by an instructor familiar with the basic concepts of electricity as applied to water and wastewater treatment. Included are objectives, instructor guides, student handouts, and transparency masters. This module considers definition of terms, voltage, current…

High Performance Hermetic Package For LiNbO3 Electro-Optic Waveguide Devices

NASA Astrophysics Data System (ADS)

Preston, K. R.; Macdonald, B. M.; Harmon, R. A.; Ford, C. W.; Shaw, R. N.; Reid, I.; Davidson, J. H.; Beaumont, A. R.; Booth, R. C.

1989-02-01

A high performance fibre-tailed package for LiNbO3 electro-optic waveguide devices is described. The package is based around a hermetic metal submodule which contains no epoxy or other organic materials. The LiNbO3 chip is mounted using a soldering technique, and laser welding is used for fibre fixing to give stable, low loss optical coupling to single mode fibres. Optical reflections are minimised by the use of antireflective coatings on the fibre ends and waveguide facets. High speed electrical connections are made via coplanar glass-sealed leadthroughs to LiNb03 travelling wave devices, and packaged device operation to frequencies in excess of 4GHz is demonstrated.

WDM package enabling high-bandwidth optical intrasystem interconnects for high-performance computer systems

NASA Astrophysics Data System (ADS)

Schrage, J.; Soenmez, Y.; Happel, T.; Gubler, U.; Lukowicz, P.; Mrozynski, G.

2006-02-01

From long haul, metro access and intersystem links the trend goes to applying optical interconnection technology at increasingly shorter distances. Intrasystem interconnects such as data busses between microprocessors and memory blocks are still based on copper interconnects today. This causes a bottleneck in computer systems since the achievable bandwidth of electrical interconnects is limited through the underlying physical properties. Approaches to solve this problem by embedding optical multimode polymer waveguides into the board (electro-optical circuit board technology, EOCB) have been reported earlier. The principle feasibility of optical interconnection technology in chip-to-chip applications has been validated in a number of projects. For reasons of cost considerations waveguides with large cross sections are used in order to relax alignment requirements and to allow automatic placement and assembly without any active alignment of components necessary. On the other hand the bandwidth of these highly multimodal waveguides is restricted due to mode dispersion. The advance of WDM technology towards intrasystem applications will provide sufficiently high bandwidth which is required for future high-performance computer systems: Assuming that, for example, 8 wavelength-channels with 12Gbps (SDR1) each are given, then optical on-board interconnects with data rates a magnitude higher than the data rates of electrical interconnects for distances typically found at today's computer boards and backplanes can be realized. The data rate will be twice as much, if DDR2 technology is considered towards the optical signals as well. In this paper we discuss an approach for a hybrid integrated optoelectronic WDM package which might enable the application of WDM technology to EOCB.

Protection of microelectronic devices during packaging

DOEpatents

Peterson, Kenneth A.; Conley, William R.

2002-01-01

The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.

Temporary coatings for protection of microelectronic devices during packaging

DOEpatents

Peterson, Kenneth A.; Conley, William R.

2005-01-18

The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, temporary protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.

In-ground operation of Geothermic Fuel Cells for unconventional oil and gas recovery

NASA Astrophysics Data System (ADS)

Sullivan, Neal; Anyenya, Gladys; Haun, Buddy; Daubenspeck, Mark; Bonadies, Joseph; Kerr, Rick; Fischer, Bernhard; Wright, Adam; Jones, Gerald; Li, Robert; Wall, Mark; Forbes, Alan; Savage, Marshall

2016-01-01

This paper presents operating and performance characteristics of a nine-stack solid-oxide fuel cell combined-heat-and-power system. Integrated with a natural-gas fuel processor, air compressor, reactant-gas preheater, and diagnostics and control equipment, the system is designed for use in unconventional oil-and-gas processing. Termed a ;Geothermic Fuel Cell; (GFC), the heat liberated by the fuel cell during electricity generation is harnessed to process oil shale into high-quality crude oil and natural gas. The 1.5-kWe SOFC stacks are packaged within three-stack GFC modules. Three GFC modules are mechanically and electrically coupled to a reactant-gas preheater and installed within the earth. During operation, significant heat is conducted from the Geothermic Fuel Cell to the surrounding geology. The complete system was continuously operated on hydrogen and natural-gas fuels for ∼600 h. A quasi-steady operating point was established to favor heat generation (29.1 kWth) over electricity production (4.4 kWe). Thermodynamic analysis reveals a combined-heat-and-power efficiency of 55% at this condition. Heat flux to the geology averaged 3.2 kW m-1 across the 9-m length of the Geothermic Fuel Cell-preheater assembly. System performance is reviewed; some suggestions for improvement are proposed.

Effects Of Environmental And Operational Stresses On RF MEMS Switch Technologies For Space Applications

NASA Technical Reports Server (NTRS)

Jah, Muzar; Simon, Eric; Sharma, Ashok

2003-01-01

Micro Electro Mechanical Systems (MEMS) have been heralded for their ability to provide tremendous advantages in electronic systems through increased electrical performance, reduced power consumption, and higher levels of device integration with a reduction of board real estate. RF MEMS switch technology offers advantages such as low insertion loss (0.1- 0.5 dB), wide bandwidth (1 GHz-100 GHz), and compatibility with many different process technologies (quartz, high resistivity Si, GaAs) which can replace the use of traditional electronic switches, such as GaAs FETS and PIN Diodes, in microwave systems for low signal power (x < 500 mW) applications. Although the electrical characteristics of RF MEMS switches far surpass any existing technologies, the unknown reliability, due to the lack of information concerning failure modes and mechanisms inherent to MEMS devices, create an obstacle to insertion of MEMS technology into high reliability applications. All MEMS devices are sensitive to moisture and contaminants, issues easily resolved by hermetic or near-hermetic packaging. Two well-known failure modes of RF MEMS switches are charging in the dielectric layer of capacitive membrane switches and contact interface stiction of metal-metal switches. Determining the integrity of MEMS devices when subjected to the shock, vibration, temperature extremes, and radiation of the space environment is necessary to facilitate integration into space systems. This paper will explore the effects of different environmental stresses, operational life cycling, temperature, mechanical shock, and vibration on the first commercially available RF MEMS switches to identify relevant failure modes and mechanisms inherent to these device and packaging schemes for space applications. This paper will also describe RF MEMS Switch technology under development at NASA GSFC.

Insulation Requirements of High-Voltage Power Systems in Future Spacecraft

NASA Technical Reports Server (NTRS)

Qureshi, A. Haq; Dayton, James A., Jr.

1995-01-01

The scope, size, and capability of the nation's space-based activities are limited by the level of electrical power available. Long-term projections show that there will be an increasing demand for electrical power in future spacecraft programs. The level of power that can be generated, conditioned, transmitted, and used will have to be considerably increased to satisfy these needs, and increased power levels will require that transmission voltages also be increased to minimize weight and resistive losses. At these projected voltages, power systems will not operate satisfactorily without the proper electrical insulation. Open or encapsulated power supplies are currently used to keep the volume and weight of space power systems low and to protect them from natural and induced environmental hazards. Circuits with open packaging are free to attain the pressure of the outer environment, whereas encapsulated circuits are imbedded in insulating materials, which are usually solids, but could be liquids or gases. Up to now, solid insulation has usually been chosen for space power systems. If the use of solid insulation is continued, when voltages increase, the amount of insulation for encapsulation also will have to increase. This increased insulation will increase weight and reduce system reliability. Therefore, non-solid insulation media must be examined to satisfy future spacecraft power and voltage demands. In this report, we assess the suitability of liquid, space vacuum, and gas insulation for space power systems.

Digital model of a vacuum circuit breaker for the analysis of switching waveforms in electrical circuits

NASA Astrophysics Data System (ADS)

Budzisz, Joanna; Wróblewski, Zbigniew

2016-03-01

The article presents a method of modelling a vaccum circuit breaker in the ATP/EMTP package, the results of the verification of the correctness of the developed digital circuit breaker model operation and its practical usefulness for analysis of overvoltages and overcurrents occurring in commutated capacitive electrical circuits and also examples of digital simulations of overvoltages and overcurrents in selected electrical circuits.

ETX-I: First-generation single-shaft electric propulsion system program. Volume 2: Battery

NASA Astrophysics Data System (ADS)

1988-06-01

The overall objective of this research and development program was to advance ac powertrain technology for electric vehicles (EV). The program focused on the design, build, test, and refinement of an experimental advanced electric vehicle powertrain suitable for packaging in a Ford Escort or equivalent-size vehicle. A Mercury LN7 was subsequently selected for the test bed vehicle. Although not part of the initial contract, the scope of the ETX-I Program was expanded in 1983 to encompass the development of advanced electric vehicle batteries compatible with the ETX-I powertrain and vehicle test bed. The intent of the battery portion of the ETX-I Program was to apply the best available battery technology based on existing battery developments. The battery effort was expected to result in a practical scale-up of base battery technologies to the vehicle battery subsystem level. With the addition of the battery activity, the ETX-I Program became a complete proof-of-concept ac propulsion system technology development program. In this context, the term propulsion system is defined as all components and subsystems (from the driver input to the vehicle wheels) that are required to store energy on board the vehicle and, using that energy, to provide controlled motive power to the vehicle. This report, Volume 2, describes the battery portion of the ETX-I Program. The powertrain effort is reported in Volume 1.

Accelerated Aging System for Prognostics of Power Semiconductor Devices

NASA Technical Reports Server (NTRS)

Celaya, Jose R.; Vashchenko, Vladislav; Wysocki, Philip; Saha, Sankalita

2010-01-01

Prognostics is an engineering discipline that focuses on estimation of the health state of a component and the prediction of its remaining useful life (RUL) before failure. Health state estimation is based on actual conditions and it is fundamental for the prediction of RUL under anticipated future usage. Failure of electronic devices is of great concern as future aircraft will see an increase of electronics to drive and control safety-critical equipment throughout the aircraft. Therefore, development of prognostics solutions for electronics is of key importance. This paper presents an accelerated aging system for gate-controlled power transistors. This system allows for the understanding of the effects of failure mechanisms, and the identification of leading indicators of failure which are essential in the development of physics-based degradation models and RUL prediction. In particular, this system isolates electrical overstress from thermal overstress. Also, this system allows for a precise control of internal temperatures, enabling the exploration of intrinsic failure mechanisms not related to the device packaging. By controlling the temperature within safe operation levels of the device, accelerated aging is induced by electrical overstress only, avoiding the generation of thermal cycles. The temperature is controlled by active thermal-electric units. Several electrical and thermal signals are measured in-situ and recorded for further analysis in the identification of leading indicators of failures. This system, therefore, provides a unique capability in the exploration of different failure mechanisms and the identification of precursors of failure that can be used to provide a health management solution for electronic devices.

AC propulsion system for an electric vehicle, phase 2

NASA Astrophysics Data System (ADS)

Slicker, J. M.

1983-06-01

A second-generation prototype ac propulsion system for a passenger electric vehicle was designed, fabricated, tested, installed in a modified Mercury Lynx vehicle and track tested at the Contractor's site. The system consisted of a Phase 2, 18.7 kw rated ac induction traction motor, a 192-volt, battery powered, pulse-width-modulated, transistorized inverter packaged for under rear seat installation, a 2-axis, 2-speed, automatically-shifted mechanical transaxle and a microprocessor-based powertrain/vehicle controller. A diagnostics computer to assist tuning and fault finding was fabricated. Dc-to-mechanical-system efficiency varied from 78% to 82% as axle speed/torque ranged from 159 rpm/788 nm to 65 rpm/328 nm. Track test efficiency results suggest that the ac system will be equal or superior to dc systems when driving urban cycles. Additional short-term work is being performed under a third contract phase (AC-3) to raise transaxle efficiency to predicted levels, and to improve starting and shifting characteristics. However, the long-term challenge to the system's viability remains inverter cost. A final report on the Phase 2 system, describing Phase 3 modifications, will be issued at the conclusion of AC-3.

AC propulsion system for an electric vehicle, phase 2

NASA Technical Reports Server (NTRS)

Slicker, J. M.

1983-01-01

A second-generation prototype ac propulsion system for a passenger electric vehicle was designed, fabricated, tested, installed in a modified Mercury Lynx vehicle and track tested at the Contractor's site. The system consisted of a Phase 2, 18.7 kw rated ac induction traction motor, a 192-volt, battery powered, pulse-width-modulated, transistorized inverter packaged for under rear seat installation, a 2-axis, 2-speed, automatically-shifted mechanical transaxle and a microprocessor-based powertrain/vehicle controller. A diagnostics computer to assist tuning and fault finding was fabricated. Dc-to-mechanical-system efficiency varied from 78% to 82% as axle speed/torque ranged from 159 rpm/788 nm to 65 rpm/328 nm. Track test efficiency results suggest that the ac system will be equal or superior to dc systems when driving urban cycles. Additional short-term work is being performed under a third contract phase (AC-3) to raise transaxle efficiency to predicted levels, and to improve starting and shifting characteristics. However, the long-term challenge to the system's viability remains inverter cost. A final report on the Phase 2 system, describing Phase 3 modifications, will be issued at the conclusion of AC-3.

Smart packaging systems for food applications: a review.

PubMed

Biji, K B; Ravishankar, C N; Mohan, C O; Srinivasa Gopal, T K

2015-10-01

Changes in consumer preference for safe food have led to innovations in packaging technologies. This article reviews about different smart packaging systems and their applications in food packaging, packaging research with latest innovations. Active and intelligent packing are such packaging technologies which offer to deliver safer and quality products. Active packaging refers to the incorporation of additives into the package with the aim of maintaining or extending the product quality and shelf life. The intelligent systems are those that monitor the condition of packaged food to give information regarding the quality of the packaged food during transportation and storage. These technologies are designed to the increasing demand for safer foods with better shelf life. The market for active and intelligent packaging systems is expected to have a promising future by their integration into packaging materials or systems.

Modular, Reconfigurable, High-Energy Systems Stepping Stones

NASA Technical Reports Server (NTRS)

Howell, Joe T.; Carrington, Connie K.; Mankins, John C.

2005-01-01

Modular, Reconfigurable, High-Energy Systems are Stepping Stones to provide capabilities for energy-rich infrastructure strategically located in space to support a variety of exploration scenarios. Abundant renewable energy at lunar or L1 locations could support propellant production and storage in refueling scenarios that enable affordable exploration. Renewable energy platforms in geosynchronous Earth orbits can collect and transmit power to satellites, or to Earth-surface locations. Energy-rich space technologies also enable the use of electric-powered propulsion systems that could efficiently deliver cargo and exploration facilities to remote locations. A first step to an energy-rich space infrastructure is a 100-kWe class solar-powered platform in Earth orbit. The platform would utilize advanced technologies in solar power collection and generation, power management and distribution, thermal management, and electric propulsion. It would also provide a power-rich free-flying platform to demonstrate in space a portfolio of technology flight experiments. This paper presents a preliminary design concept for a 100-kWe solar-powered satellite with the capability to flight-demonstrate a variety of payload experiments and to utilize electric propulsion. State-of-the-art solar concentrators, highly efficient multi-junction solar cells, integrated thermal management on the arrays, and innovative deployable structure design and packaging make the 100-kW satellite feasible for launch on one existing launch vehicle. Higher voltage arrays and power management and distribution (PMAD) systems reduce or eliminate the need for massive power converters, and could enable direct- drive of high-voltage solar electric thrusters.

Aircraft Electrical Repairman, 2-1. Military Curriculum Materials for Vocational and Technical Education.

ERIC Educational Resources Information Center

Ohio State Univ., Columbus. National Center for Research in Vocational Education.

This three-volume textbook and three student workbooks for a secondary-postsecondary level course in aircraft electrical repair comprise one of a number of military-developed curriculum packages selected for adaptation to vocational instruction and curriculum development in a civilian setting. The purpose stated for the individualized, self-paced…

Small, Optically-Driven Power Source

NASA Technical Reports Server (NTRS)

Cockrum, Richard H.; Wang, Ke-Li J.

1988-01-01

Power transmitted along fiber-optic cables. Transmitted as infrared light along fiber-optic cable, converted to electricity to supply small electronic circuit. Power source and circuit remains electrically isolated from each other for safety or reduces electromagnetic interference. Array of diodes made by standard integrated-circuit techniques and packaged for mounting at end of fiber-optic cable.

Electrical Experiments. VT-214-12-5. Part V. Transformers.

ERIC Educational Resources Information Center

Connecticut State Dept. of Education, Hartford. Div. of Vocational Education.

Designed for high school electronics students, this fifth document in a series of six electrical learning activity packages focuses on transformers. An introductory section gives the objective for the activities, an introduction, and an outline of the content. The remainder of the activity book is comprised of information sheets and job sheets on…

Electrical Experiments. VT-214-12-3. Part III. Basic Electronics.

ERIC Educational Resources Information Center

Connecticut State Dept. of Education, Hartford. Div. of Vocational Education.

Designed for high school electronics students, this third document in a series of six electrical learning activity packages focuses on basic electronics. An introductory section gives the objective for the activities, an introduction, and an outline of the content. The remainder of the activity book is comprised of information sheets and job…

A Curriculum Package for Implementing Instruction in Electricity Fundamentals/House Wiring.

ERIC Educational Resources Information Center

Murphy, Brian P.

This curriculum guide is designed for instructors of secondary industrial arts, vocational, and apprenticeship programs. The material is presented in two sections. Section I provides step-by-step instructions on how to present basic electrical circuit concepts with the use of a simply-made breadboard. Included in this section is the following…

Modeling of a Thermoelectric Generator for Thermal Energy Regeneration in Automobiles

NASA Astrophysics Data System (ADS)

Tatarinov, Dimitri; Koppers, M.; Bastian, G.; Schramm, D.

2013-07-01

In the field of passenger transportation a reduction of the consumption of fossil fuels has to be achieved by any measures. Advanced designs of internal combustion engine have the potential to reduce CO2 emissions, but still suffer from low efficiencies in the range from 33% to 44%. Recuperation of waste heat can be achieved with thermoelectric generators (TEGs) that convert heat directly into electric energy, thus offering a less complicated setup as compared with thermodynamic cycle processes. During a specific driving cycle of a car, the heat currents and temperature levels of the exhaust gas are dynamic quantities. To optimize a thermoelectric recuperation system fully, various parameters have to be tested, for example, the electric and thermal conductivities of the TEG and consequently the heat absorbed and rejected from the system, the generated electrical power, and the system efficiency. A Simulink model consisting of a package for dynamic calculation of energy management in a vehicle, coupled with a model of the thermoelectric generator system placed on the exhaust system, determines the drive-cycle-dependent efficiency of the heat recovery system, thus calculating the efficiency gain of the vehicle. The simulation also shows the temperature drop at the heat exchanger along the direction of the exhaust flow and hence the variation of the voltage drop of consecutively arranged TEG modules. The connection between the temperature distribution and the optimal electrical circuitry of the TEG modules constituting the entire thermoelectric recuperation system can then be examined. The simulation results are compared with data obtained from laboratory experiments. We discuss error bars and the accuracy of the simulation results for practical thermoelectric systems embedded in cars.

Electric power industry restructuring in Australia: Lessons from down-under. Occasional paper No. 20

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ray, D.

1997-01-01

Australia`s electric power industry (EPI) is undergoing major restructuring. This restructuring includes commercialization of state-owned electric organization through privatization and through corporatization into separate governmental business units; structural unbundling of generation, transmission, retailing, and distribution; and creation of a National Electricity Market (NEM) organized as a centralized, market-based trading pool for buying and selling electricity. The principal rationales for change in the EPI were the related needs of enhancing international competitiveness, improving productivity, and lowering electric rates. Reducing public debt through privatization also played an important role. Reforms in the EPI are part of the overall economic reform package thatmore » is being implemented in Australia. Enhancing efficiency in the economy through competition is a key objective of the reforms. As the need for reform was being discussed in the early 1990s, Australia`s previous prime minister, Paul Keating, observed that {open_quotes}the engine which drives efficiency is free and open competition.{close_quotes} The optimism about the economic benefits of the full package of reforms across the different sectors of the economy, including the electricity industry, is reflected in estimated benefits of a 5.5 percent annual increase in real gross domestic product and the creation of 30,000 more jobs. The largest source of the benefits (estimated at 25 percent of total benefits) was projected to come from reform of the electricity and gas sectors.« less

Method of forming a package for MEMS-based fuel cell

DOEpatents

Morse, Jeffrey D; Jankowski, Alan F

2013-05-21

A MEMS-based fuel cell package and method thereof is disclosed. The fuel cell package comprises seven layers: (1) a sub-package fuel reservoir interface layer, (2) an anode manifold support layer, (3) a fuel/anode manifold and resistive heater layer, (4) a Thick Film Microporous Flow Host Structure layer containing a fuel cell, (5) an air manifold layer, (6) a cathode manifold support structure layer, and (7) a cap. Fuel cell packages with more than one fuel cell are formed by positioning stacks of these layers in series and/or parallel. The fuel cell package materials such as a molded plastic or a ceramic green tape material can be patterned, aligned and stacked to form three dimensional microfluidic channels that provide electrical feedthroughs from various layers which are bonded together and mechanically support a MEMS-based miniature fuel cell. The package incorporates resistive heating elements to control the temperature of the fuel cell stack. The package is fired to form a bond between the layers and one or more microporous flow host structures containing fuel cells are inserted within the Thick Film Microporous Flow Host Structure layer of the package.

Method of forming a package for mems-based fuel cell

DOEpatents

Morse, Jeffrey D.; Jankowski, Alan F.

2004-11-23

A MEMS-based fuel cell package and method thereof is disclosed. The fuel cell package comprises seven layers: (1) a sub-package fuel reservoir interface layer, (2) an anode manifold support layer, (3) a fuel/anode manifold and resistive heater layer, (4) a Thick Film Microporous Flow Host Structure layer containing a fuel cell, (5) an air manifold layer, (6) a cathode manifold support structure layer, and (7) a cap. Fuel cell packages with more than one fuel cell are formed by positioning stacks of these layers in series and/or parallel. The fuel cell package materials such as a molded plastic or a ceramic green tape material can be patterned, aligned and stacked to form three dimensional microfluidic channels that provide electrical feedthroughs from various layers which are bonded together and mechanically support a MEMOS-based miniature fuel cell. The package incorporates resistive heating elements to control the temperature of the fuel cell stack. The package is fired to form a bond between the layers and one or more microporous flow host structures containing fuel cells are inserted within the Thick Film Microporous Flow Host Structure layer of the package.

A Power Conversion Concept for the Jupiter Icy Moons Orbiter

NASA Technical Reports Server (NTRS)

Mason, Lee S.

2003-01-01

The Jupiter Icy Moons Orbiter (JIMO) mission is currently under study by the Office of Space Science under the Project Prometheus Program. JIMO is examining the use of Nuclear Electric Propulsion (NEP) to carry scientific payloads to three Jovian moons. A potential power system concept includes dual 100 kWe Brayton converters, a deployable pumped loop heat rejection subsystem, and a 400 Vac Power Management and Distribution (PMAD) bus. Many trades were performed in aniving at this candidate power system concept. System-level studies examined design and off-design operating modes, determined startup requirements, evaluated subsystem redundancy options, and quantified the mass and radiator area of reactor power systems from 20 to 200 kWe. In the Brayton converter subsystem, studies were performed to investigate converter packaging options, and assess the induced torque effects on spacecraft dynamics due to rotating machinery. In the heat rejection subsystem, design trades were conducted on heat transport approaches, material and fluid options, and deployed radiator geometries. In the PMAD subsystem, the overall electrical architecture was defined and trade studies examined distribution approaches, voltage levels, and cabling options.

Inactivation of possible microorganism food contaminants on packaging foils using nonthermal plasma and hydrogen peroxide

NASA Astrophysics Data System (ADS)

Scholtz, V.; Khun, J.; Soušková, H.; Čeřovský, M.

2015-07-01

The inactivation effect of nonthermal plasma generated in electric discharge burning in air atmosphere with water or hydrogen peroxide aerosol for the application to the microbial decontamination of packaging foils is studied. The microbial inactivation is studied on two bacterial, two yeasts, and two filamentous micromycete species. The inactivation of all contaminating microorganisms becomes on the area of full 8.5 cm in diameter circular sample after short times of several tens of seconds. Described apparatus may present a possible alternative method of microbial decontamination of food packaging material or other thermolabile materials.

Inactivation of possible microorganism food contaminants on packaging foils using nonthermal plasma and hydrogen peroxide

DOE Office of Scientific and Technical Information (OSTI.GOV)

Scholtz, V., E-mail: Vladimir.Scholtz@vscht.cz; Khun, J.; Soušková, H.

The inactivation effect of nonthermal plasma generated in electric discharge burning in air atmosphere with water or hydrogen peroxide aerosol for the application to the microbial decontamination of packaging foils is studied. The microbial inactivation is studied on two bacterial, two yeasts, and two filamentous micromycete species. The inactivation of all contaminating microorganisms becomes on the area of full 8.5 cm in diameter circular sample after short times of several tens of seconds. Described apparatus may present a possible alternative method of microbial decontamination of food packaging material or other thermolabile materials.

Closed Brayton Cycle Power Conversion Unit for Fission Surface Power Phase I Final Report

NASA Technical Reports Server (NTRS)

Fuller, Robert L.

2010-01-01

A Closed Brayton cycle power conversion system has been developed to support the NASA fission surface power program. The goal is to provide electricity from a small nuclear reactor heat source for surface power production for lunar and Mars environments. The selected media for a heat source is NaK 78 with water as a cooling source. The closed Brayton cycle power was selected to be 12 kWe output from the generator terminals. A heat source NaK temperature of 850 K plus or minus 25 K was selected. The cold source water was selected at 375 K plus or minus 25 K. A vacuum radiation environment of 200 K is specified for environmental operation. The major components of the system are the power converter, the power controller, and the top level data acquisition and control unit. The power converter with associated sensors resides in the vacuum radiation environment. The power controller and data acquisition system reside in an ambient laboratory environment. Signals and power are supplied across the pressure boundary electrically with hermetic connectors installed on the vacuum vessel. System level analyses were performed on working fluids, cycle design parameters, heater and cooling temperatures, and heat exchanger options that best meet the needs of the power converter specification. The goal is to provide a cost effective system that has high thermal-to-electric efficiency in a compact, lightweight package.

Electromechanical actuation for cryogenic valve control

NASA Technical Reports Server (NTRS)

Lister, M. J.; Reichmuth, D. M.

1993-01-01

The design and analysis of the electromechanical actuator (EMA) being developed for the NASA/Marshall Space Flight Center as part of the National Launch System (NLS) Propellant Control Effector Advanced Development Program (ADP) are addressed. The EMA design uses several proven technologies combined into a single modular package which includes single stage high ratio gear reduction, redundant electric motors mounted on a common drive shaft, redundant drive and control electronics, and digital technology for performing the closed loop position feedback, communication, and health monitoring functions. Results of tests aimed at evaluating both component characteristics and overall system performance demonstrated that the goal of low cost, reliable control in a cryogenic environment is feasible.

Feasibility of Space Disposal of Radioactive Nuclear Waste. 1: Executive Summary

NASA Technical Reports Server (NTRS)

1973-01-01

This NASA study, performed at the request of the AEC, concludes that transporting radioactive waste (primarily long-lived isotopes) into space is feasible. Tentative solutions are presented for technical problems involving safe packaging. Launch systems (existing and planned), trajectories, potential hazards, and various destinations were evaluated. Solar system escape is possible and would have the advantage of ultimate removal of the radioactive waste from man's environment. Transportation costs would be low (comparable to less than a 5 percent increase in the cost of electricity) even though more than 100 space shuttle launches per year would be required by the year 2000.

Non-Flow Through Fuel Cell Power Module Demonstration on the SCARAB Rover

NASA Technical Reports Server (NTRS)

Jakupca, Ian; Guzik, Monica; Bennett, William R.; Edwards, Lawrence

2017-01-01

NASA demonstrated the Advanced Product Water Removal (APWR) Non-Flow-Through (NFT) PEM fuel cell technology by powering the Scarab rover over three-(3) days of field operations. The latest generation APWR NFT fuel cell stackwas packaged by the Advanced Exploration Systems (AES) Modular Power Systems (AMPS) team into a nominallyrated 1-kW fuel cell power module. This power module was functionally verified in a laboratory prior to field operations on the Scarab rover, which concluded on 2 September 2015. During this demonstration, the power module satisfied all required success criteria by supporting all electrical loads as the Scarab navigated the NASA Glenn Research Center.

A Soft-Switching Inverter for High-Temperature Advanced Hybrid Electric Vehicle Traction Motor Drives

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lai, Jason; Yu, Wensong; Sun, Pengwei

2012-03-31

The state-of-the-art hybrid electric vehicles (HEVs) require the inverter cooling system to have a separate loop to avoid power semiconductor junction over temperatures because the engine coolant temperature of 105°C does not allow for much temperature rise in silicon devices. The proposed work is to develop an advanced soft-switching inverter that will eliminate the device switching loss and cut down the power loss so that the inverter can operate at high-temperature conditions while operating at high switching frequencies with small current ripple in low inductance based permanent magnet motors. The proposed tasks also include high-temperature packaging and thermal modeling andmore » simulation to ensure the packaged module can operate at the desired temperature. The developed module will be integrated with the motor and vehicle controller for dynamometer and in-vehicle testing to prove its superiority. This report will describe the detailed technical design of the soft-switching inverters and their test results. The experiments were conducted both in module level for the module conduction and switching characteristics and in inverter level for its efficiency under inductive and dynamometer load conditions. The performance will be compared with the DOE original specification.« less

30-kW SEP Spacecraft as Secondary Payloads for Low-Cost Deep Space Science Missions

NASA Technical Reports Server (NTRS)

Brophy, John R.; Larson, Tim

2013-01-01

The Solar Array System contracts awarded by NASA's Space Technology Mission Directorate are developing solar arrays in the 30 kW to 50 kW power range (beginning of life at 1 AU) that have significantly higher specific powers (W/kg) and much smaller stowed volumes than conventional rigid-panel arrays. The successful development of these solar array technologies has the potential to enable new types of solar electric propulsion (SEP) vehicles and missions. This paper describes a 30-kW electric propulsion vehicle built into an EELV Secondary Payload Adapter (ESPA) ring. The system uses an ESPA ring as the primary structure and packages two 15-kW Megaflex solar array wings, two 14-kW Hall thrusters, a hydrazine Reaction Control Subsystem (RCS), 220 kg of xenon, 26 kg of hydrazine, and an avionics module that contains all of the rest of the spacecraft bus functions and the instrument suite. Direct-drive is used to maximize the propulsion subsystem efficiency and minimize the resulting waste heat and required radiator area. This is critical for packaging a high-power spacecraft into a very small volume. The fully-margined system dry mass would be approximately 1120 kg. This is not a small dry mass for a Discovery-class spacecraft, for example, the Dawn spacecraft dry mass was only about 750 kg. But the Dawn electric propulsion subsystem could process a maximum input power of 2.5 kW, and this spacecraft would process 28 kW, an increase of more than a factor of ten. With direct-drive the specific impulse would be limited to about 2,000 s assuming a nominal solar array output voltage of 300 V. The resulting spacecraft would have a beginning of life acceleration that is more than an order of magnitude greater than the Dawn spacecraft. Since the spacecraft would be built into an ESPA ring it could be launched as a secondary payload to a geosynchronous transfer orbit significantly reducing the launch costs for a planetary spacecraft. The SEP system would perform the escape from Earth and then the heliocentric transfer to the science target.

Packaging of wavelength stabilized 976nm 100W 105µm 0.15 NA fiber coupled diode lasers

NASA Astrophysics Data System (ADS)

Jiang, Xiaochen; Liu, Rui; Gao, Yanyan; Zhang, Tujia; He, Xiaoguang; Zhu, Jing; Zhang, Qiang; Yang, Thomas; Zhang, Cuipeng

2016-03-01

Fiber coupled diode lasers are widely used in many fields now especially as pumps in fiber laser systems. In many fiber laser applications, high brightness pumps are essential to achieve high brightness fiber lasers. Furthermore, 976nm wavelength absorption band is narrow with Yb3+ doped fiber lasers which is more challenging for controlling wavelength stabilized in diode laser modules. This study designed and implemented commercial available high brightness and narrow wavelength width lasers to be able to use in previous mentioned applications. Base on multiple single emitters using spatial and polarization beam combining as well as fiber coupling techniques, we report a wavelength stabilized, 105μm NA 0.15 fiber coupled diode laser package with 100W of optical output power at 976 nm, which are 14 emitters inside each multiple single emitter module. The emitting aperture of the combined lasers output are designed and optimized for coupling light into a 105μm core NA 0.15 fiber. Volume Bragg grating technology has been used to improve spectral characteristics of high-power diode lasers. Mechanical modular design and thermal simulation are carried out to optimize the package. The spectral width is roughly 0.5 nm (FWHM) and the wavelength shift per °C < 0.02nm. The output spectrum is narrowed and wavelength is stabilized using Volume Bragg gratings (VBGs). The high brightness package has an electrical to optical efficiency better than 45% and power enclosure more than 90% within NA 0.12. Qualification tests have been included on this kind of package. Mechanical shock, vibration and accelerated aging tests show that the package is reliability and the MTTF is calculated to be more than 100k hours at 25°C.

A High-Density, High-Efficiency, Isolated On-Board Vehicle Battery Charger Utilizing Silicon Carbide Power Devices

DOE Office of Scientific and Technical Information (OSTI.GOV)

Whitaker, B; Barkley, A; Cole, Z

2014-05-01

This paper presents an isolated on-board vehicular battery charger that utilizes silicon carbide (SiC) power devices to achieve high density and high efficiency for application in electric vehicles (EVs) and plug-in hybrid EVs (PHEVs). The proposed level 2 charger has a two-stage architecture where the first stage is a bridgeless boost ac-dc converter and the second stage is a phase-shifted full-bridge isolated dc-dc converter. The operation of both topologies is presented and the specific advantages gained through the use of SiC power devices are discussed. The design of power stage components, the packaging of the multichip power module, and themore » system-level packaging is presented with a primary focus on system density and a secondary focus on system efficiency. In this work, a hardware prototype is developed and a peak system efficiency of 95% is measured while operating both power stages with a switching frequency of 200 kHz. A maximum output power of 6.1 kW results in a volumetric power density of 5.0 kW/L and a gravimetric power density of 3.8 kW/kg when considering the volume and mass of the system including a case.« less

Advanced end-to-end fiber optic sensing systems for demanding environments

NASA Astrophysics Data System (ADS)

Black, Richard J.; Moslehi, Behzad

2010-09-01

Optical fibers are small-in-diameter, light-in-weight, electromagnetic-interference immune, electrically passive, chemically inert, flexible, embeddable into different materials, and distributed-sensing enabling, and can be temperature and radiation tolerant. With appropriate processing and/or packaging, they can be very robust and well suited to demanding environments. In this paper, we review a range of complete end-to-end fiber optic sensor systems that IFOS has developed comprising not only (1) packaged sensors and mechanisms for integration with demanding environments, but (2) ruggedized sensor interrogators, and (3) intelligent decision aid algorithms software systems. We examine the following examples: " Fiber Bragg Grating (FBG) optical sensors systems supporting arrays of environmentally conditioned multiplexed FBG point sensors on single or multiple optical fibers: In conjunction with advanced signal processing, decision aid algorithms and reasoners, FBG sensor based structural health monitoring (SHM) systems are expected to play an increasing role in extending the life and reducing costs of new generations of aerospace systems. Further, FBG based structural state sensing systems have the potential to considerably enhance the performance of dynamic structures interacting with their environment (including jet aircraft, unmanned aerial vehicles (UAVs), and medical or extravehicular space robots). " Raman based distributed temperature sensing systems: The complete length of optical fiber acts as a very long distributed sensor which may be placed down an oil well or wrapped around a cryogenic tank.

Design and performance of an arcjet nuclear electric propulsion system for a mid-1990's reference mission

NASA Technical Reports Server (NTRS)

Deininger, William D.; Vondra, Robert J.

1987-01-01

The design and performance of an arcjet nuclear-electric-propulsion spacecraft, suitable for use in the Space Nuclear Power System (SNPS) reference mission, are outlined. The vehicle design was based on a 30-kW ammonia arcjet system operating at an Isp of 1050 s and an efficiency of 45 percent. The arcjet/gimbal system, power-processing unit, and propellant-feed system are described. A 100-kWe SNPS was assumed, and the spacecraft mass was baselined at 5250 kg (excluding the propellant-feed system). A radiation/arcjet efflux diagnostics package was included in the performance analysis. This spacecraft, assuming a Shuttle launch from KSC, can perform a 50-deg inclination change and reach a final orbit of 35,860 km with a 120-d trip time providing a 4-mo active load for the SNPS. Alternatively, a Titan IV launch would provide a mass margin of 120 kg to a 10,000-km, 58-deg final orbit in 74 d. This spacecraft meets the reference-mission constraint of low developmental risk, and is scalable to power levels projected for future space platforms.

Electrically Conductive Polyimide Films Containing Gold Surface

NASA Technical Reports Server (NTRS)

Caplan, Maggie L.; Stoakley, Diane M.; St. Clair, Anne K.

1994-01-01

Polyimide films exhibiting high thermo-oxidative stability and including electrically conductive surface layers containing gold made by casting process. Many variations of basic process conditions, ingredients, and sequence of operations possible, and not all resulting versions of process yield electrically conductive films. Gold-containing layer formed on film surface during cure. These metallic gold-containing polyimides used in film and coating applications requiring electrical conductivity, high reflectivity, exceptional thermal stability, and/or mechanical integrity. They also find commercial potential in areas ranging from thin films for satellite antennas to decorative coatings and packaging.

Testing methodologies and systems for semiconductor optical amplifiers

NASA Astrophysics Data System (ADS)

Wieckowski, Michael

Semiconductor optical amplifiers (SOA's) are gaining increased prominence in both optical communication systems and high-speed optical processing systems, due primarily to their unique nonlinear characteristics. This in turn, has raised questions regarding their lifetime performance reliability and has generated a demand for effective testing techniques. This is especially critical for industries utilizing SOA's as components for system-in-package products. It is important to note that very little research to date has been conducted in this area, even though production volume and market demand has continued to increase. In this thesis, the reliability of dilute-mode InP semiconductor optical amplifiers is studied experimentally and theoretically. The aging characteristics of the production level devices are demonstrated and the necessary techniques to accurately characterize them are presented. In addition, this work proposes a new methodology for characterizing the optical performance of these devices using measurements in the electrical domain. It is shown that optical performance degradation, specifically with respect to gain, can be directly qualified through measurements of electrical subthreshold differential resistance. This metric exhibits a linear proportionality to the defect concentration in the active region, and as such, can be used for prescreening devices before employing traditional optical testing methods. A complete theoretical analysis is developed in this work to explain this relationship based upon the device's current-voltage curve and its associated leakage and recombination currents. These results are then extended to realize new techniques for testing semiconductor optical amplifiers and other similarly structured devices. These techniques can be employed after fabrication and during packaged operation through the use of a proposed stand-alone testing system, or using a proposed integrated CMOS self-testing circuit. Both methods are capable of ascertaining SOA performance based solely on the subthreshold differential resistance signature, and are a first step toward the inevitable integration of self-testing circuits into complex optoelectronic systems.

Electrical Experiments. VT-214-12-2. Part II. A-C Across the Line Control.

ERIC Educational Resources Information Center

Connecticut State Dept. of Education, Hartford. Div. of Vocational Education.

Designed for high school electronics students, this second document in a series of six electrical learning activity packages focuses on alternating current across-the-line control. An introductory section gives the objective for the activities, an introduction, and an outline of the content. The remainder of the activity book is comprised of…

Active and intelligent packaging systems for a modern society.

PubMed

Realini, Carolina E; Marcos, Begonya

2014-11-01

Active and intelligent packaging systems are continuously evolving in response to growing challenges from a modern society. This article reviews: (1) the different categories of active and intelligent packaging concepts and currently available commercial applications, (2) latest packaging research trends and innovations, and (3) the growth perspectives of the active and intelligent packaging market. Active packaging aiming at extending shelf life or improving safety while maintaining quality is progressing towards the incorporation of natural active agents into more sustainable packaging materials. Intelligent packaging systems which monitor the condition of the packed food or its environment are progressing towards more cost-effective, convenient and integrated systems to provide innovative packaging solutions. Market growth is expected for active packaging with leading shares for moisture absorbers, oxygen scavengers, microwave susceptors and antimicrobial packaging. The market for intelligent packaging is also promising with strong gains for time-temperature indicator labels and advancements in the integration of intelligent concepts into packaging materials. Copyright © 2014 Elsevier Ltd. All rights reserved.

Space Electric Research Test in the Electric Propulsion Laboratory

NASA Image and Video Library

1964-06-21

Technicians prepare the Space Electric Research Test (SERT-I) payload for a test in Tank Number 5 of the Electric Propulsion Laboratory at the National Aeronautics and Space Administration (NASA) Lewis Research Center. Lewis researchers had been studying different methods of electric rocket propulsion since the mid-1950s. Harold Kaufman created the first successful engine, the electron bombardment ion engine, in the early 1960s. These electric engines created and accelerated small particles of propellant material to high exhaust velocities. Electric engines have a very small amount of thrust, but once lofted into orbit by workhorse chemical rockets, they are capable of small, continuous thrust for periods up to several years. The electron bombardment thruster operated at a 90-percent efficiency during testing in the Electric Propulsion Laboratory. The package was rapidly rotated in a vacuum to simulate its behavior in space. The SERT-I mission, launched from Wallops Island, Virginia, was the first flight test of Kaufman’s ion engine. SERT-I had one cesium engine and one mercury engine. The suborbital flight was only 50 minutes in duration but proved that the ion engine could operate in space. The Electric Propulsion Laboratory included two large space simulation chambers, one of which is seen here. Each uses twenty 2.6-foot diameter diffusion pumps, blowers, and roughing pumps to remove the air inside the tank to create the thin atmosphere. A helium refrigeration system simulates the cold temperatures of space.

NASA EEE Parts 2014 Year in Review

NASA Technical Reports Server (NTRS)

Lee, Sara-Anne

2015-01-01

The NASA Electronic Parts and Packaging Program continue to support Electrical, Electronic and Electromagnetic Parts for the agency with an eventful year of workshops, innovations, testing and challenges.

Design and characterization of a novel power over fiber system integrating a high power diode laser

NASA Astrophysics Data System (ADS)

Perales, Mico; Yang, Mei-huan; Wu, Cheng-liang; Hsu, Chin-wei; Chao, Wei-sheng; Chen, Kun-hsein; Zahuranec, Terry

2017-02-01

High power 9xx nm diode lasers along with MH GoPower's (MHGP's) flexible line of Photovoltaic Power Converters (PPCs) are spurring high power applications for power over fiber (PoF), including applications for powering remote sensors and sensors monitoring high voltage equipment, powering high voltage IGBT gate drivers, converters used in RF over Fiber (RFoF) systems, and system power applications, including powering UAVs. In PoF, laser power is transmitted over fiber, and is converted to electricity by photovoltaic cells (packaged into Photovoltaic Power Converters, or PPCs) which efficiently convert the laser light. In this research, we design a high power multi-channel PoF system, incorporating a high power 976 nm diode laser, a cabling system with fiber break detection, and a multichannel PPC-module. We then characterizes system features such as its response time to system commands, the PPC module's electrical output stability, the PPC-module's thermal response, the fiber break detection system response, and the diode laser optical output stability. The high power PoF system and this research will serve as a scalable model for those interested in researching, developing, or deploying a high power, voltage isolated, and optically driven power source for high reliability utility, communications, defense, and scientific applications.

Update on International Space Station Nickel-Hydrogen Battery On-Orbit Performance

NASA Technical Reports Server (NTRS)

Dalton, Penni; Cohen, Fred

2003-01-01

International Space Station (ISS) Electric Power System (EPS) utilizes Nickel-Hydrogen (Ni-H2) batteries as part of its power system to store electrical energy. The batteries are charged during insolation and discharged during eclipse. The batteries are designed to operate at a 35% depth of discharge (DOD) maximum during normal operation. Thirty-eight individual pressure vessel (IPV) Ni-H2 battery cells are series-connected and packaged in an Orbital Replacement Unit (ORU). Two ORUs are series-connected utilizing a total of 76 cells, to form one battery. The ISS is the first application for low earth orbit (LEO) cycling of this quantity of series-connected cells. The P6 (Port) Integrated Equipment Assembly (IEA) containing the initial ISS high-power components was successfully launched on November 30, 2000. The IEA contains 12 Battery Subassembly ORUs (6 batteries) that provide station power during eclipse periods. This paper will discuss the battery performance data after two and a half years of cycling.

Applications of Emerging Parallel Optical Link Technology to High Energy Physics Experiments

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chramowicz, J.; Kwan, S.; Prosser, A.

2011-09-01

Modern particle detectors depend upon optical fiber links to deliver event data to upstream trigger and data processing systems. Future detector systems can benefit from the development of dense arrangements of high speed optical links emerging from the telecommunications and storage area network market segments. These links support data transfers in each direction at rates up to 120 Gbps in packages that minimize or even eliminate edge connector requirements. Emerging products include a class of devices known as optical engines which permit assembly of the optical transceivers in close proximity to the electrical interfaces of ASICs and FPGAs which handlemore » the data in parallel electrical format. Such assemblies will reduce required printed circuit board area and minimize electromagnetic interference and susceptibility. We will present test results of some of these parallel components and report on the development of pluggable FPGA Mezzanine Cards equipped with optical engines to provide to collaborators on the Versatile Link Common Project for the HI-LHC at CERN.« less

International Space Station Nickel-Hydrogen Battery On-Orbit Performance

NASA Technical Reports Server (NTRS)

Dalton, Penni; Cohen, Fred

2002-01-01

International Space Station (ISS) Electric Power System (EPS) utilizes Nickel-Hydrogen (Ni-H2) batteries as part of its power system to store electrical energy. The batteries are charged during insolation and discharged during eclipse. The batteries are designed to operate at a 35 percent depth of discharge (DOD) maximum during normal operation. Thirty-eight individual pressure vessel (IPV) Ni-H2 battery cells are series-connected and packaged in an Orbital Replacement Unit (ORU). Two ORUs are series-connected utilizing a total of 76 cells to form one battery. The ISS is the first application for low earth orbit (LEO) cycling of this quantity of series-connected cells. The P6 (Port) Integrated Equipment Assembly (IEA) containing the initial ISS high-power components was successfully launched on November 30, 2000. The IEA contains 12 Battery Subassembly ORUs (6 batteries) that provide station power during eclipse periods. This paper will discuss the battery performance data after eighteen months of cycling.

A Design of a Modular GPHS-Stirling Power System for a Lunar Habitation Module

NASA Technical Reports Server (NTRS)

Schmitz, Paul C.; Penswick, L. Barry; Shaltens, Richard K.

2005-01-01

Lunar habitation modules need electricity and potentially heat to operate. Because of the low amounts of radiation emitted by General Purpose Heat Source (GPHS) modules, power plants incorporating these as heat sources could be placed in close proximity to habitation modules. A design concept is discussed for a high efficiency power plant based on a GPHS assembly integrated with a Stirling convertor. This system could provide both electrical power and heat, if required, for a lunar habitation module. The conceptual GPHS/Stirling system is modular in nature and made up of a basic 5.5 KWe Stirling convertor/GPHS module assembly, convertor controller/PMAD electronics, waste heat radiators, and associated thermal insulation. For the specific lunar application under investigation eight modules are employed to deliver 40 KWe to the habitation module. This design looks at three levels of Stirling convertor technology and addresses the issues of integrating the Stirling convertors with the GPHS heat sources assembly using proven technology whenever possible. In addition, issues related to the high-temperature heat transport system, power management, convertor control, vibration isolation, and potential system packaging configurations to ensure safe operation during all phases of deployment will be discussed.

Theoretical and Experimental Beam Plasma Physics (TEBPP)

NASA Technical Reports Server (NTRS)

Roberts, W. T.

1985-01-01

The theoretical and experimental beam plasma physics (TEBPP) consists of a package of five instruments to measure electric and magnetic fields, plasma density and temperature, neutral density, photometric emissions, and energetic particle spectra during firings of the particle injector (SEPAC) electron beam. The package is deployed on a maneuverable boom (or RMS) and is used to measure beam characteristics and induced perturbations in the near field ( 10 m) and mid field (10 m to 100 m) along the electron beam. The TEBPP package will be designed to investigate induced oscillations and induced electromagnetic mode waves, neutral and ion density and temperature effects, and beam characteristics as a function of axial distance.

Theoretical and Experimental Beam Plasma Physics (TEBPP)

NASA Technical Reports Server (NTRS)

Roberts, B.

1986-01-01

The theoretical and experimental beam plasma physics (TEBPP) consists of a package of five instruments to measure electric and magnetic fields, plasma density and temperature, neutral density, photometric emissions, and energetic particle spectra during firings of the particle injector (SEPAC) electron beam. The package is developed on a maneuverable boom (or RMS) and is used to measure beam characteristics and induced perturbations field ( 10 m) and mid field ( 10 m to 100 m) along the electron beam. The TEBPP package will be designed to investigate induced oscillations and induced electromagnetic mode waves, neutral and ion density and temperature effects, and beam characteristics as a function of axial distance.

Diagnosis diagrams for passing signals on an automatic block signaling railway section

NASA Astrophysics Data System (ADS)

Spunei, E.; Piroi, I.; Chioncel, C. P.; Piroi, F.

2018-01-01

This work presents a diagnosis method for railway traffic security installations. More specifically, the authors present a series of diagnosis charts for passing signals on a railway block equipped with an automatic block signaling installation. These charts are based on the exploitation electric schemes, and are subsequently used to develop a diagnosis software package. The thus developed software package contributes substantially to a reduction of failure detection and remedy for these types of installation faults. The use of the software package eliminates making wrong decisions in the fault detection process, decisions that may result in longer remedy times and, sometimes, to railway traffic events.

An ocean bottom seismic observatory with near real-time telemetry

NASA Astrophysics Data System (ADS)

Berger, J.; Laske, G.; Babcock, J.; Orcutt, J.

2016-02-01

We describe a new technology that can provide near real-time telemetry of sensor data from the ocean bottom without a moored buoy or a cable to shore. The breakthrough technology that makes this system possible is an autonomous surface vehicle called a Wave Glider developed by Liquid Robotics, Inc. of Sunnyvale, CA, which harvests wave and solar energy for motive and electrical power. We present results from several deployments of a prototype system that demonstrate the feasibility of this concept. We also demonstrated that a wave glider could tow a suitably designed ocean bottom package with acceptable loss of speed. With further development such a system could be deployed autonomously and provide real-time telemetry of data from seafloor sensors.

Electrical Prototype Power Processor for the 30-cm Mercury electric propulsion engine

NASA Technical Reports Server (NTRS)

Biess, J. J.; Frye, R. J.

1978-01-01

An Electrical Prototpye Power Processor has been designed to the latest electrical and performance requirements for a flight-type 30-cm ion engine and includes all the necessary power, command, telemetry and control interfaces for a typical electric propulsion subsystem. The power processor was configured into seven separate mechanical modules that would allow subassembly fabrication, test and integration into a complete power processor unit assembly. The conceptual mechanical packaging of the electrical prototype power processor unit demonstrated the relative location of power, high voltage and control electronic components to minimize electrical interactions and to provide adequate thermal control in a vacuum environment. Thermal control was accomplished with a heat pipe simulator attached to the base of the modules.

High-Temperature High-Power Packaging Techniques for HEV Traction Applications

DOE Office of Scientific and Technical Information (OSTI.GOV)

Barlow, F.D.; Elshabini, A.

A key issue associated with the wider adoption of hybrid-electric vehicles (HEV) and plug in hybrid-electric vehicles (PHEV) is the implementation of the power electronic systems that are required in these products [1]. To date, many consumers find the adoption of these technologies problematic based on a financial analysis of the initial cost versus the savings available from reduced fuel consumption. Therefore, one of the primary industry goals is the reduction in the price of these vehicles relative to the cost of traditional gasoline powered vehicles. Part of this cost reduction must come through optimization of the power electronics requiredmore » by these vehicles. In addition, the efficiency of the systems must be optimized in order to provide the greatest range possible. For some drivers, any reduction in the range associated with a potential HEV or PHEV solution in comparison to a gasoline powered vehicle represents a significant barrier to adoption and the efficiency of the power electronics plays an important role in this range. Likewise, high efficiencies are also important since lost power further complicates the thermal management of these systems. Reliability is also an important concern since most drivers have a high level of comfort with gasoline powered vehicles and are somewhat reluctant to switch to a less proven technology. Reliability problems in the power electronics or associated components could not only cause a high warranty cost to the manufacturer, but may also taint these technologies in the consumer's eyes. A larger vehicle offering in HEVs is another important consideration from a power electronics point of view. A larger vehicle will need more horsepower, or a larger rated drive. In some ways this will be more difficult to implement from a cost and size point of view. Both the packaging of these modules and the thermal management of these systems at competitive price points create significant challenges. One way in which significant cost reduction of these systems could be achieved is through the use of a single coolant loop for both the power electronics as well as the internal combustion engine (ICE) [2]. This change would reduce the complexity of the cooling system which currently relies on two loops to a single loop [3]. However, the current nominal coolant temperature entering these inverters is 65 C [3], whereas a normal ICE coolant temperature would be much higher at approximately 100 C. This change in coolant temperature significantly increases the junction temperatures of the devices and creates a number of challenges for both device fabrication and the assembly of these devices into inverters and converters for HEV and PHEV applications. With this change in mind, significant progress has been made on the use of SiC devices for inverters that can withstand much higher junction temperatures than traditional Si based inverters [4,5,6]. However, a key problem which the single coolant loop and high temperature devices is the effective packaging of these devices and related components into a high temperature inverter. The elevated junction temperatures that exist in these modules are not compatible with reliable inverters based on existing packaging technology. This report seeks to provide a literature survey of high temperature packaging and to highlight the issues related to the implementation of high temperature power electronic modules for HEV and PHEV applications. For purposes of discussion, it will be assumed in this report that 200 C is the targeted maximum junction temperature.« less

Military Curricula for Vocational & Technical Education. Basic Electricity and Electronics. CANTRAC A-100-0010. Module 23: Multivibrators. Study Booklet.

ERIC Educational Resources Information Center

Chief of Naval Education and Training Support, Pensacola, FL.

This individualized learning module on multivibrators is one in a series of modules for a course in basic electricity and electronics. The course is one of a number of military-developed curriculum packages selected for adaptation to vocational instructional and curriculum development in a civilian setting. Three lessons are included in the…

Skylab electronic technological advancements

NASA Technical Reports Server (NTRS)

Hornback, G. L.

1974-01-01

The present work describes three electronic devices designed for use in the Skylab airlock module: the teleprinter system, the quartz crystal microbalance contamination monitor (QCM), and the speaker. Design considerations, operation, characteristics, and system development are described for these systems, with accompanying diagrams, graphs, and photographs. The teleprinter is a thermal dot printer used to produce hard copy messages by electrically heating print elements in contact with heat-sensitive paper. The QCM was designed to estimate contamination buildup on optical surfaces of the earth resources experiment package. A vibrating quartz crystal is used as a microbalance relating deposited mass to shifts in the crystal's resonant frequency. Audio devices provide communication between crew members and between crew and STDN, and also provide audible alarms, via the caution and warning system, of out-of-limit-conditions.

FY95 limited energy study for the area `a` package boiler. Holston Army Ammunition Plant, Kingsport, Tennessee. Final report

DOE Office of Scientific and Technical Information (OSTI.GOV)

NONE

1995-11-03

Holston Army Ammunition Plant (HSAAP) in Holston, Tennessee, manufactures explosives from raw materials. The facility comprises two separate areas designated Area `A11 and Area 11B`. Each area is served by a steam plant which produces steam for production processes, equipment operation, space heating, domestic water heating, steam tracing, and product storage heating requirements. The purpose of this study is to identify and evaluate the technical and economic feasibility of alternative methods of meeting the steam requirements of the Area 11A11 industrial complex. The following items were specifically requested to be evaluated. Evaluate the use of two new gas-fired packaged boilersmore » sized to meet the requirements of the industrial complex. The new boilers would be installed adjacent to the existing steam plant and would utilize the existing smokestacks and steam distribution system. Evaluate using the existing steam distribution system rather than locating multiple boilers at various sites. Existing steam driven chillers will be replaced with electric driven equipment. Evaluate this impact on the steam system requirements. Field survey and test two existing gas-fired packaged boilers located at the Volunteer Army Ammunition Plant in Chattanooga, Tennessee. The two boilers were last used about 1980 and are presently laid away. The boilers are approximately the same capacity and operating characteristics as the ones at HSAAP. Relocation of the existing boilers and ancillary equipment (feedwater pumps, generators, fans, etc.) would be required as well as repairs or modifications necessary to meet current operating conditions and standards.« less

Resistance heating releases structural adhesive

NASA Technical Reports Server (NTRS)

Glemser, N. N.

1967-01-01

Composite adhesive package bonds components together for testing and enables separation when testing is completed. The composite of adhesives, insulation and a heating element separate easily when an electrical current is applied.

Reliability of high I/O high density CCGA interconnect electronic packages under extreme thermal environments

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2012-03-01

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surfacemount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions.

Flight experiment of thermal energy storage

NASA Technical Reports Server (NTRS)

Namkoong, David

1989-01-01

Thermal energy storage (TES) enables a solar dynamic system to deliver constant electric power through periods of sun and shade. Brayton and Stirling power systems under current considerations for missions in the near future require working fluid temperatures in the 1100 to 1300+ K range. TES materials that meet these requirements fall into the fluoride family of salts. These salts store energy as a heat of fusion, thereby transferring heat to the fluid at constant temperature during shade. The principal feature of fluorides that must be taken into account is the change in volume that occurs with melting and freezing. Salts shrink as they solidify, a change reaching 30 percent for some salts. The location of voids that form as result of the shrinkage is critical when the solar dynamic system reemerges into the sun. Hot spots can develop in the TES container or the container can become distorted if the melting salt cannot expand elsewhere. Analysis of the transient, two-phase phenomenon is being incorporated into a three-dimensional computer code. The code is capable of analysis under microgravity as well as 1 g. The objective of the flight program is to verify the predictions of the code, particularly of the void location and its effect on containment temperature. The four experimental packages comprising the program will be the first tests of melting and freezing conducted under microgravity. Each test package will be installed in a Getaway Special container to be carried by the shuttle. The package will be self-contained and independent of shuttle operations other than the initial opening of the container lid and the final closing of the lid. Upon the return of the test package from flight, the TES container will be radiographed and finally partitioned to examine the exact location and shape of the void. Visual inspection of the void and the temperature data during flight will constitute the bases for code verification.

Aerospace Power Systems Design and Analysis (APSDA) Tool

NASA Technical Reports Server (NTRS)

Truong, Long V.

1998-01-01

The conceptual design of space and/or planetary electrical power systems has required considerable effort. Traditionally, in the early stages of the design cycle (conceptual design), the researchers have had to thoroughly study and analyze tradeoffs between system components, hardware architectures, and operating parameters (such as frequencies) to optimize system mass, efficiency, reliability, and cost. This process could take anywhere from several months to several years (as for the former Space Station Freedom), depending on the scale of the system. Although there are many sophisticated commercial software design tools for personal computers (PC's), none of them can support or provide total system design. To meet this need, researchers at the NASA Lewis Research Center cooperated with Professor George Kusic from the University of Pittsburgh to develop a new tool to help project managers and design engineers choose the best system parameters as quickly as possible in the early design stages (in days instead of months). It is called the Aerospace Power Systems Design and Analysis (APSDA) Tool. By using this tool, users can obtain desirable system design and operating parameters such as system weight, electrical distribution efficiency, bus power, and electrical load schedule. With APSDA, a large-scale specific power system was designed in a matter of days. It is an excellent tool to help designers make tradeoffs between system components, hardware architectures, and operation parameters in the early stages of the design cycle. user interface. It operates on any PC running the MS-DOS (Microsoft Corp.) operating system, version 5.0 or later. A color monitor (EGA or VGA) and two-button mouse are required. The APSDA tool was presented at the 30th Intersociety Energy Conversion Engineering Conference (IECEC) and is being beta tested at several NASA centers. Beta test packages are available for evaluation by contacting the author.

A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging

PubMed Central

Luo, Zhenyu; Chen, Deyong; Wang, Junbo; Li, Yinan; Chen, Jian

2014-01-01

This paper presents a high-Q resonant pressure microsensor with through-glass electrical interconnections based on wafer-level MEMS vacuum packaging. An approach to maintaining high-vacuum conditions by integrating the MEMS fabrication process with getter material preparation is presented in this paper. In this device, the pressure under measurement causes a deflection of a pressure-sensitive silicon square diaphragm, which is further translated to stress build up in “H” type doubly-clamped micro resonant beams, leading to a resonance frequency shift. The device geometries were optimized using FEM simulation and a 4-inch SOI wafer was used for device fabrication, which required only three photolithographic steps. In the device fabrication, a non-evaporable metal thin film as the getter material was sputtered on a Pyrex 7740 glass wafer, which was then anodically bonded to the patterned SOI wafer for vacuum packaging. Through-glass via holes predefined in the glass wafer functioned as the electrical interconnections between the patterned SOI wafer and the surrounding electrical components. Experimental results recorded that the Q-factor of the resonant beam was beyond 22,000, with a differential sensitivity of 89.86 Hz/kPa, a device resolution of 10 Pa and a nonlinearity of 0.02% F.S with the pressure varying from 50 kPa to 100 kPa. In addition, the temperature drift coefficient was less than −0.01% F.S/°C in the range of −40 °C to 70 °C, the long-term stability error was quantified as 0.01% F.S over a 5-month period and the accuracy of the microsensor was better than 0.01% F.S. PMID:25521385

A high-Q resonant pressure microsensor with through-glass electrical interconnections based on wafer-level MEMS vacuum packaging.

PubMed

Luo, Zhenyu; Chen, Deyong; Wang, Junbo; Li, Yinan; Chen, Jian

2014-12-16

This paper presents a high-Q resonant pressure microsensor with through-glass electrical interconnections based on wafer-level MEMS vacuum packaging. An approach to maintaining high-vacuum conditions by integrating the MEMS fabrication process with getter material preparation is presented in this paper. In this device, the pressure under measurement causes a deflection of a pressure-sensitive silicon square diaphragm, which is further translated to stress build up in "H" type doubly-clamped micro resonant beams, leading to a resonance frequency shift. The device geometries were optimized using FEM simulation and a 4-inch SOI wafer was used for device fabrication, which required only three photolithographic steps. In the device fabrication, a non-evaporable metal thin film as the getter material was sputtered on a Pyrex 7740 glass wafer, which was then anodically bonded to the patterned SOI wafer for vacuum packaging. Through-glass via holes predefined in the glass wafer functioned as the electrical interconnections between the patterned SOI wafer and the surrounding electrical components. Experimental results recorded that the Q-factor of the resonant beam was beyond 22,000, with a differential sensitivity of 89.86 Hz/kPa, a device resolution of 10 Pa and a nonlinearity of 0.02% F.S with the pressure varying from 50 kPa to 100 kPa. In addition, the temperature drift coefficient was less than -0.01% F.S/°C in the range of -40 °C to 70 °C, the long-term stability error was quantified as 0.01% F.S over a 5-month period and the accuracy of the microsensor was better than 0.01% F.S.

High Temperature Pt/Alumina Co-Fired System for 500 C Electronic Packaging Applications

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Neudeck, Philip G.; Spry, David J.; Beheim, Glenn M.; Hunter, Gary W.

2015-01-01

Gold thick-film metallization and 96 alumina substrate based prototype packaging system developed for 500C SiC electronics and sensors is briefly reviewed, the needs of improvement are discussed. A high temperature co-fired alumina material system based packaging system composed of 32-pin chip-level package and printed circuit board is discussed for packaging 500C SiC electronics and sensors.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kreutzer, Cory J.; Rugh, John; Tomerlin, Jeff

Increased market penetration of electric drive vehicles (EDVs) requires overcoming a number of hurdles, including limited vehicle range and the elevated cost in comparison to conventional vehicles. Climate control loads have a significant impact on range, cutting it by over 50% in both cooling and heating conditions. To minimize the impact of climate control on EDV range, the National Renewable Energy Laboratory has partnered with Hyundai America and key industry partners to quantify the performance of thermal load reduction technologies on a Hyundai Sonata plug-in hybrid electric vehicle. Technologies that impact vehicle cabin heating in cold weather conditions and cabinmore » cooling in warm weather conditions were evaluated. Tests included thermal transient and steady-state periods for all technologies, including the development of a new test methodology to evaluate the performance of occupant thermal conditioning. Heated surfaces demonstrated significant reductions in energy use from steady-state heating, including a 29%-59% reduction from heated surfaces. Solar control glass packages demonstrated significant reductions in energy use for both transient and steady-state cooling, with up to a 42% reduction in transient and 12.8% reduction in steady-state energy use for the packages evaluated. Technologies that demonstrated significant climate control load reduction were selected for incorporation into a complete thermal load reduction package. The complete package is set to be evaluated in the second phase of the ongoing project.« less

Merging parallel optics packaging and surface mount technologies

NASA Astrophysics Data System (ADS)

Kopp, Christophe; Volpert, Marion; Routin, Julien; Bernabé, Stéphane; Rossat, Cyrille; Tournaire, Myriam; Hamelin, Régis

2008-02-01

Optical links are well known to present significant advantages over electrical links for very high-speed data rate at 10Gpbs and above per channel. However, the transition towards optical interconnects solutions for short and very short reach applications requires the development of innovative packaging solutions that would deal with very high volume production capability and very low cost per unit. Moreover, the optoelectronic transceiver components must be able to move from the edge to anywhere on the printed circuit board, for instance close to integrated circuits with high speed IO. In this paper, we present an original packaging design to manufacture parallel optic transceivers that are surface mount devices. The package combines highly integrated Multi-Chip-Module on glass and usual IC ceramics packaging. The use of ceramic and the development of sealing technologies achieve hermetic requirements. Moreover, thanks to a chip scale package approach the final device exhibits a much minimized footprint. One of the main advantages of the package is its flexibility to be soldered or plugged anywhere on the printed circuit board as any other electronic device. As a demonstrator we present a 2 by 4 10Gbps transceiver operating at 850nm.

Study of a heat rejection system using capillary pumping

NASA Technical Reports Server (NTRS)

Neal, L. G.; Wanous, D. J.; Clausen, O. W.

1971-01-01

Results of an analytical study investigating the application of capillary pumping to the heat rejection loop of an advanced Rankine cycle power conversion system are presented. The feasibility of the concept of capillary pumping as an alternate to electromagnetic pumping is analytically demonstrated. Capillary pumping is shown to provide a potential for weight and electrical power saving and reliability through the use of redundant systems. A screen wick pump design with arterial feed lines was analytically developed. Advantages of this design are high thermodynamic and hydrodynamic efficiency, which provide a lightweight easily packaged system. Operational problems were identified which must be solved for successful application of capillary pumping. The most important are the development of start up and shutdown procedures, and development of a means of keeping noncondensibles from the system and of earth-bound testing procedures.

Military Curricula for Vocational & Technical Education. Basic Electricity and Electronics. CANTRAC A-100-0010. Module 34: Linear Integrated Circuits. Study Booklet.

ERIC Educational Resources Information Center

Chief of Naval Education and Training Support, Pensacola, FL.

This individualized learning module on linear integrated circuits is one in a series of modules for a course in basic electricity and electronics. The course is one of a number of military-developed curriculum packages selected for adaptation to vocational instructional and curriculum development in a civilian setting. Two lessons are included in…

Military Curricula for Vocational & Technical Education. Basic Electricity and Electronics. CANTRAC A-100-0010. Module 33: Special Devices. Study Booklet.

ERIC Educational Resources Information Center

Chief of Naval Education and Training Support, Pensacola, FL.

This individualized learning module on special devices is one in a series of modules for a course in basic electricity and electronics. The course is one of a number of military-developed curriculum packages selected for adaptation to vocational instructional and curriculum development in a civilian setting. Four lessons are included in the…

Military Curricula for Vocational & Technical Education. Basic Electricity and Electronics. CANTRAC A-100-0010. Module 25: Special Devices. Study Booklet.

ERIC Educational Resources Information Center

Chief of Naval Education and Training Support, Pensacola, FL.

This individualized learning module on special devices is one in a series of modules for a course in basic electricity and electronics. The course is one of a number of military-developed curriculum packages selected for adaptation to vocational instructional and curriculum development in a civilian setting. Two lessons are included in the module:…

Military Curricula for Vocational & Technical Education. Basic Electricity and Electronics. CANTRAC A-100-0010. Module 30: Intermediate Power Supplies. Study Booklet.

ERIC Educational Resources Information Center

Chief of Naval Education and Training Support, Pensacola, FL.

This individualized learning module on intermediate power supplies is one in a series of modules for a course in basic electricity and electronics. The course is one of a number of military-developed curriculum packages selected for adaptation to vocational instructional and curriculum development in a civilian setting. Four lessons are included…

Telescience Testbed Program: A study of software for SIRTF instrument control

NASA Technical Reports Server (NTRS)

Young, Erick T.

1992-01-01

As a continued element in the Telescience Testbed Program (TTP), the University of Arizona Steward Observatory and the Electrical and Computer Engineering Department (ECE) jointly developed a testbed to evaluate the Operations and Science Instrument System (OASIS) software package for remote control of an instrument for the Space Infrared Telescope Facility (SIRTF). SIRTF is a cryogenically-cooled telescope with three focal plane instruments that will be the infrared element of NASA's Great Observatory series. The anticipated launch date for SIRTF is currently 2001. Because of the complexity of the SIRTF mission, it was not expected that the OASIS package would be suitable for instrument control in the flight situation, however, its possible use as a common interface during the early development and ground test phases of the project was considered. The OASIS package, developed at the University of Colorado for control of the Solar Mesosphere Explorer (SME) satellite, serves as an interface between the operator and the remote instrument which is connected via a network. OASIS provides a rudimentary windowing system as well as support for standard spacecraft communications protocols. The experiment performed all of the functions required of the MIPS simulation program. Remote control of the instrument was demonstrated but found to be inappropriate for SIRTF at this time for the following reasons: (1) programming interface is too difficult; (2) significant computer resources were required to run OASIS; (3) the communications interface is too complicated; (4) response time was slow; and (5) quicklook of image data was not possible.

A Combined Solar Electric and Storable Chemical Propulsion Vehicle for Piloted Mars Missions

NASA Technical Reports Server (NTRS)

Mercer, Carolyn R.; Oleson, Steven R.; Drake, Bret G.

2014-01-01

The Mars Design Reference Architecture (DRA) 5.0 explored a piloted Mars mission in the 2030 timeframe, focusing on architecture and technology choices. The DRA 5.0 focused on nuclear thermal and cryogenic chemical propulsion system options for the mission. Follow-on work explored both nuclear and solar electric options. One enticing option that was found in a NASA Collaborative Modeling for Parametric Assessment of Space Systems (COMPASS) design study used a combination of a 1-MW-class solar electric propulsion (SEP) system combined with storable chemical systems derived from the planned Orion crew vehicle. It was found that by using each propulsion system at the appropriate phase of the mission, the entire SEP stage and habitat could be placed into orbit with just two planned Space Launch System (SLS) heavy lift launch vehicles assuming the crew would meet up at the Earth-Moon (E-M) L2 point on a separate heavy-lift launch. These appropriate phases use high-thrust chemical propulsion only in gravity wells when the vehicle is piloted and solar electric propulsion for every other phase. Thus the SEP system performs the spiral of the unmanned vehicle from low Earth orbit (LEO) to E-M L2 where the vehicle meets up with the multi-purpose crew vehicle. From here SEP is used to place the vehicle on a trajectory to Mars. With SEP providing a large portion of the required capture and departure changes in velocity (delta V) at Mars, the delta V provided by the chemical propulsion is reduced by a factor of five from what would be needed with chemical propulsion alone at Mars. This trajectory also allows the SEP and habitat vehicle to arrive in the highly elliptic 1-sol parking orbit compatible with envisioned Mars landing concepts. This paper explores mission options using between SEP and chemical propulsion, the design of the SEP system including the solar array and electric propulsion systems, and packaging in the SLS shroud. Design trades of stay time, power level, specific impulse and propellant type are discussed.

A Combined Solar Electric and Storable Chemical Propulsion Vehicle for Piloted Mars Missions

NASA Technical Reports Server (NTRS)

Mercer, Carolyn R.; Oleson, Steven R.; Drake, Bret

2013-01-01

The Mars Design Reference Architecture (DRA) 5.0 explored a piloted Mars mission in the 2030 timeframe, focusing on architecture and technology choices. The DRA 5.0 focused on nuclear thermal and cryogenic chemical propulsion system options for the mission. Follow-on work explored both nuclear and solar electric options. One enticing option that was found in a NASA Collaborative Modeling for Parametric Assessment of Space Systems (COMPASS) design study used a combination of a 1-MW-class solar electric propulsion (SEP) system combined with storable chemical systems derived from the planned Orion crew vehicle. It was found that by using each propulsion system at the appropriate phase of the mission, the entire SEP stage and habitat could be placed into orbit with just two planned Space Launch System (SLS) heavy lift launch vehicles assuming the crew would meet up at the Earth-Moon (E-M) L2 point on a separate heavy-lift launch. These appropriate phases use high-thrust chemical propulsion only in gravity wells when the vehicle is piloted and solar electric propulsion for every other phase. Thus the SEP system performs the spiral of the unmanned vehicle from low Earth orbit (LEO) to E-M L2 where the vehicle meets up with the multi-purpose crew vehicle. From here SEP is used to place the vehicle on a trajectory to Mars. With SEP providing a large portion of the required capture and departure changes in velocity (delta V) at Mars, the delta V provided by the chemical propulsion is reduced by a factor of five from what would be needed with chemical propulsion alone at Mars. This trajectory also allows the SEP and habitat vehicle to arrive in the highly elliptic 1-sol parking orbit compatible with envisioned Mars landing concepts. This paper explores mission options using between SEP and chemical propulsion, the design of the SEP system including the solar array and electric propulsion systems, and packaging in the SLS shroud. Design trades of stay time, power level, specific impulse and propellant type are discussed.

Practical fundamentals of glass, rubber, and plastic sterile packaging systems.

PubMed

Sacha, Gregory A; Saffell-Clemmer, Wendy; Abram, Karen; Akers, Michael J

2010-01-01

Sterile product packaging systems consist of glass, rubber, and plastic materials that are in intimate contact with the formulation. These materials can significantly affect the stability of the formulation. The interaction between the packaging materials and the formulation can also affect the appropriate delivery of the product. Therefore, a parenteral formulation actually consists of the packaging system as well as the product that it contains. However, the majority of formulation development time only considers the product that is contained in the packaging system. Little time is spent studying the interaction of the packaging materials with the contents. Interaction between the packaging and the contents only becomes a concern when problems are encountered. For this reason, there are few scientific publications that describe the available packaging materials, their advantages and disadvantages, and their important product attributes. This article was created as a reference for product development and describes some of the packaging materials and systems that are available for parenteral products.

Design and Implementation of a Thermal Load Reduction System in a Hyundai PHEV

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kreutzer, Cory J; Rugh, John P

Increased market penetration of electric drive vehicles (EDVs) requires overcoming a number of hurdles including limited vehicle range and the elevated cost of EDVs as compared to conventional vehicles. Climate control loads have a significant impact on range, cutting it by over 50% in both cooling and heating conditions. In order to minimize the impact of climate control on EDV range, the National Renewable Energy Laboratory has partnered with Hyundai America and key industry partners to quantify the performance of thermal load reduction technologies on a Hyundai Sonata PHEV. Technologies that impact vehicle cabin heating in cold weather conditions andmore » cabin cooling in warm weather conditions were evaluated. Tests included thermal transient and steady-state periods for all technologies, including the development of a new test methodology to evaluate the performance of occupant thermal conditioning. Heated surfaces and increased insulation demonstrated significant reductions in energy use from steady-state heating, including a 29% - 59% reduction from heated surfaces. Solar control glass packages demonstrated significant reductions in energy use for both transient and steady-state cooling, with up to a 42% reduction in transient and 12.8% reduction in steady-state energy use for the packages evaluated. Technologies that demonstrated significant climate control load reduction were selected for incorporation into a complete thermal load reduction package. The complete package is set to be evaluated in the second phase of the ongoing project.« less

Reliability assessment of ceramic column grid array (CCGA717) interconnect packages under extreme temperatures for space applications (-185°C to +125°C)

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2010-02-01

Ceramic Column Grid Array packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performance, compatibility with standard surface-mount packaging assembly processes, etc. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, payload electronics, etc. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short and long-term space missions. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide have been assembled, inspected non-destructively and subsequently subjected to extreme temperature thermal cycling to assess the reliability for future deep space, short and long-term, extreme temperature missions. In this investigation, the employed temperature range covers from -185°C to +125°C extreme thermal environments. The test hardware consists of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The CCGA717 package is 33 mm × 33 mm with a 27×27 array of 80%/20% Pb/Sn columns on a 1.27 mm pitch. The resistance of daisy-chained, CCGA interconnects were continuously monitored as a function of thermal cycling. Electrical resistance measurements as a function of thermal cycling are reported and the tests to date have shown significant change in daisy chain resistance as a function of thermal cycling. The change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. This paper will describe the experimental test results of CCGA testing under wide extreme temperatures. Standard Weibull analysis tools were used to extract the Weibull parameters to understand the CCGA failures. Optical inspection results clearly indicate that the solder joints of columns with the board and the ceramic package have failed as a function of thermal cycling. The first failure was observed at 137th thermal cycle and 63.2% failures of daisy chains have occurred at about 664 thermal cycles. The shape parameter extracted from Weibull plot was about 1.47 which indicates the failures were related to failures occurred during the flat region or useful life region of standard bath tub curve. Based on this experimental test data one can use the CCGAs for the temperature range studied for ~100 thermal cycles (ΔT = 310°C, 5oC/minute, and 15 minutes dwell) with high degree of confidence for high reliability space and other applications.

Transistor screening evaluation SJ6708H

NASA Technical Reports Server (NTRS)

Barton, J. L.

1978-01-01

A manufacturer was contracted to screen 125 transistors capable of withstanding the high level inductive voltages obtained when switching inductive loads. Planned differences included a change in die bonding to comply with NASA's desire for hard solder die attachment which further necessitated a change in package to conform to the required die mounting system. Evaluation of the electrical performance and recommended changes were made during the preliminary build phase of the program. The following sections are outlined: (1) narrative outline; (2) customer data summary and X-ray reports; (3) device specification; (4) failure analysis reports; (5) test facilities list; and (6) test measurement data.

Managing Critical Infrastructures C.I.M. Suite

ScienceCinema

Dudenhoeffer, Donald

2018-05-23

See how a new software package developed by INL researchers could help protect infrastructure during natural disasters, terrorist attacks and electrical outages. For more information about INL research, visit http://www.facebook.com/idahonationallaboratory.

Cochlear Implants (For Parents)

MedlinePlus

... nerve, and send it to the brain. The cochlear implant package is made up of: a receiver-stimulator that contains all of the electronic circuits that control the flow of electrical pulses into the ear an antenna ...

High-power UV-LED degradation: Continuous and cycled working condition influence

NASA Astrophysics Data System (ADS)

Arques-Orobon, F. J.; Nuñez, N.; Vazquez, M.; Segura-Antunez, C.; González-Posadas, V.

2015-09-01

High-power (HP) UV-LEDs can replace UV lamps for real-time fluoro-sensing applications by allowing portable and autonomous systems. However, HP UV-LEDs are not a mature technology, and there are still open issues regarding their performance evolution over time. This paper presents a reliability study of 3 W UV-LEDs, with special focus on LED degradation for two working conditions: continuous and cycled (30 s ON and 30 s OFF). Accelerated life tests are developed to evaluate the influence of temperature and electrical working conditions in high-power LEDs degradation, being the predominant failure mechanism the degradation of the package. An analysis that includes dynamic thermal and optical HP UV-LED measurements has been performed. Static thermal and stress simulation analysis with the finite element method (FEM) identifies the causes of package degradation. Accelerated life test results prove that HP UV-LEDs working in cycled condition have a better performance than those working in continuous condition.

100-W 105-μm 0.15NA fiber coupled laser diode module

NASA Astrophysics Data System (ADS)

Karlsen, Scott R.; Price, R. Kirk; Reynolds, Mitch; Brown, Aaron; Mehl, Ron; Patterson, Steve; Martinsen, Robert J.

2009-02-01

We report on the development of a high brightness laser diode module capable of coupling over 100W of optical power into a 105 μm 0.15 NA fiber at 976 nm. This module, based on nLIGHT's Pearl product architecture, utilizes hard soldered single emitters packaged into a compact and passively-cooled package. In this system each diode is individually collimated in the fast and slow axes and free-space coupled into a single fiber. The high brightness module has an optical excitation under 0.13 NA, is virtually free of cladding modes, and has an electrical to optical efficiency greater than 40%. Additionally, this module is compatible with high power 7:1 fused fiber combiners, and initial experiments demonstrated 500W coupled into a 220 μm, 0.22 NA fiber. These modules address the need in the market for higher brightness diode lasers for pumping fiber lasers and direct material processing.

Wood-fired fuel cells in selected buildings

NASA Astrophysics Data System (ADS)

McIlveen-Wright, D. R.; McMullan, J. T.; Guiney, D. J.

The positive attributes of fuel cells for high efficiency power generation at any scale and of biomass as a renewable energy source which is not intermittent, location-dependent or very difficult to store, suggest that a combined heat and power (CHP) system consisting of a fuel cell integrated with a wood gasifier (FCIWG) may offer a combination for delivering heat and electricity cleanly and efficiently. Phosphoric acid fuel cell (PAFC) systems, fuelled by natural gas, have already been used in a range of CHP applications in urban settings. Some of these applications are examined here using integrated biomass gasification/fuel cell systems in CHP configurations. Five building systems, which have different energy demand profiles, are assessed. These are a hospital, a hotel, a leisure centre, a multi-residential community and a university hall of residence. Heat and electricity use profiles for typical examples of these buildings were obtained and the FCIWG system was scaled to the power demand. The FCIWG system was modelled for two different types of fuel cell, the molten carbonate and the phosphoric acid. In each case an oxygen-fired gasification system is proposed, in order to eliminate the need for a methane reformer. Technical, environmental and economic analyses of each version were made, using the ECLIPSE process simulation package. Since fuel cell lifetimes are not yet precisely known, economics for a range of fuel cell lifetimes have been produced. The wood-fired PAFC system was found to have low electrical efficiency (13-16%), but much of the heat could be recovered, so that the overall efficiency was 64-67%, suitable where high heat/electricity values are required. The wood-fired molten carbonate fuel cell (MCFC) system was found to be quite efficient for electricity generation (24-27%), with an overall energy efficiency of 60-63%. The expected capital costs of both systems would currently make them uncompetitive for general use, but the specific features of selected buildings in rural areas, with regard to the high cost of importing other fuel, and/or lack of grid electricity, could still make these systems attractive options. Any economic analysis of these systems is beset with severe difficulties. Capital costs of the major system components are not known with any great precision. However, a guideline assessment of the payback period for such CHP systems was made. When the best available capital costs for system components were used, most of these systems were found to have unacceptably long payback periods, particularly where the fuel cell lifetimes are short, but the larger systems show the potential for a reasonable economic return.

Reliability Evaluation of Next Generation Inverter: Cooperative Research and Development Final Report, CRADA Number CRD-12-478

DOE Office of Scientific and Technical Information (OSTI.GOV)

Paret, Paul

The National Renewable Energy Laboratory (NREL) will conduct thermal and reliability modeling on three sets of power modules for the development of a next generation inverter for electric traction drive vehicles. These modules will be chosen by General Motors (GM) to represent three distinct technological approaches to inverter power module packaging. Likely failure mechanisms will be identified in each package and a physics-of-failure-based reliability assessment will be conducted.

Motor/Generator and Inverter Characterization for Flywheel System Applications

NASA Technical Reports Server (NTRS)

Tamarcus, Jeffries L.

2004-01-01

The Advanced Electrical Systems Development Branch at NASA Glenn Research Center (GRC) has been involved in the research and development of high speed flywheels systems for satellite energy storage and attitude applications. These flywheels will serve as replacement for chemical nickel hydrogen, nickel cadmium batteries and gyroscopic wheels. The advantages of using flywheel systems for energy storage on satellites are high energy density, high power density, long life, deep depth of discharge, and broad operating temperature ranges. A flywheel system for space applications consist of a number of flywheel modules, the motor/generator and magnetic bearing, and an electronics package. The motor/generator electronics package includes a pulse-width modulated inverter that drives the flywheel permanent magnet motor/generator located at one end of the shaft. This summer, I worked under the direct supervision of my mentor, Walter Santiago, and the goal for this summer was to characterize motor generator and inverter attributes in order to increase their viability as a more efficient energy storage source for space applications. To achieve this goal, magnetic field measurements around the motor/generator permanent magnet and the impedance of the motor/generator three phase windings were characterized, and a recreation of the inverter pulse width modulated control system was constructed. The Flywheel modules for space use are designed to maximize energy density and minimize loss, and attaining these values will aid in locating and reducing losses within the flywheel system as a whole, making flywheel technology more attractive for use as energy storage in future space applications.

Advanced Electrical Materials and Components Being Developed

NASA Technical Reports Server (NTRS)

Schwarze, Gene E.

2004-01-01

All aerospace systems require power management and distribution (PMAD) between the energy and power source and the loads. The PMAD subsystem can be broadly described as the conditioning and control of unregulated power from the energy source and its transmission to a power bus for distribution to the intended loads. All power and control circuits for PMAD require electrical components for switching, energy storage, voltage-to-current transformation, filtering, regulation, protection, and isolation. Advanced electrical materials and component development technology is a key technology to increasing the power density, efficiency, reliability, and operating temperature of the PMAD. The primary means to develop advanced electrical components is to develop new and/or significantly improved electronic materials for capacitors, magnetic components, and semiconductor switches and diodes. The next important step is to develop the processing techniques to fabricate electrical and electronic components that exceed the specifications of presently available state-of-the-art components. The NASA Glenn Research Center's advanced electrical materials and component development technology task is focused on the following three areas: 1) New and/or improved dielectric materials for the development of power capacitors with increased capacitance volumetric efficiency, energy density, and operating temperature; 2) New and/or improved high-frequency, high-temperature soft magnetic materials for the development of transformers and inductors with increased power density, energy density, electrical efficiency, and operating temperature; 3) Packaged high-temperature, high-power density, high-voltage, and low-loss SiC diodes and switches.

Advanced Electric Distribution, Switching, and Conversion Technology for Power Control

NASA Technical Reports Server (NTRS)

Soltis, James V.

1998-01-01

The Electrical Power Control Unit currently under development by Sundstrand Aerospace for use on the Fluids Combustion Facility of the International Space Station is the precursor of modular power distribution and conversion concepts for future spacecraft and aircraft applications. This unit combines modular current-limiting flexible remote power controllers and paralleled power converters into one package. Each unit includes three 1-kW, current-limiting power converter modules designed for a variable-ratio load sharing capability. The flexible remote power controllers can be used in parallel to match load requirements and can be programmed for an initial ON or OFF state on powerup. The unit contains an integral cold plate. The modularity and hybridization of the Electrical Power Control Unit sets the course for future spacecraft electrical power systems, both large and small. In such systems, the basic hybridized converter and flexible remote power controller building blocks could be configured to match power distribution and conversion capabilities to load requirements. In addition, the flexible remote power controllers could be configured in assemblies to feed multiple individual loads and could be used in parallel to meet the specific current requirements of each of those loads. Ultimately, the Electrical Power Control Unit design concept could evolve to a common switch module hybrid, or family of hybrids, for both converter and switchgear applications. By assembling hybrids of a common current rating and voltage class in parallel, researchers could readily adapt these units for multiple applications. The Electrical Power Control Unit concept has the potential to be scaled to larger and smaller ratings for both small and large spacecraft and for aircraft where high-power density, remote power controllers or power converters are required and a common replacement part is desired for multiples of a base current rating.

[The development and operation of a package inserts service system for electronic medical records].

PubMed

Yamada, Hidetoshi; Nishimura, Sachiho; Shimamori, Yoshimitsu; Sato, Seiji; Hayase, Yukitoshi

2003-03-01

To promote the appropriate use of pharmaceuticals and to prevent side effects, physicians need package inserts on medicinal drugs as soon as possible. A medicinal drug information service system was established for electronic medical records to speed up and increase the efficiency of package insert communications within a medical institution. Development of this system facilitates access to package inserts by, for example, physicians. The time required to maintain files of package inserts was shortened, and the efficiency of the drug information service increased. As a source of package inserts for this system, package inserts using a standard generalized markup language (SGML) form were used, which are accessible to the public on the homepage of the Organization for Pharmaceutical Safety and Research (OPSR). This study found that a delay occurred in communicating revised package inserts from pharmaceutical companies to the OPSR. Therefore a pharmaceutical department page was set up as part of the homepage of the medical institution for electronic medical records to shorten the delay in the revision of package inserts posted on the medicinal drug information service homepage of the OPSR. The usefulness of this package insert service system for electronic medical records is clear. For more effective use of this system based on the OPSR homepage pharmaceutical companies have been requested to provide quicker updating of package inserts.

A low feed-through 3D vacuum packaging technique with silicon vias for RF MEMS resonators

NASA Astrophysics Data System (ADS)

Zhao, Jicong; Yuan, Quan; Kan, Xiao; Yang, Jinling; Yang, Fuhua

2017-01-01

This paper presents a wafer-level three-dimensional (3D) vacuum packaging technique for radio frequency microelectromechanical systems (RF MEMS) resonators. A Sn-rich Au-Sn solder bonding is employed to provide a vacuum encapsulation as well as electrical conductions. Vertical silicon vias are micro-fabricated by glass reflow process. The optimized grounding, via pitch, and all-round shielding effectively reduce feed-through capacitance. Thus the signal-to-background ratios (SBRs) of the transmission signals increase from 17 dB to 20 dB, and the quality factor (Q) values of the packaged resonators go from around 8000 up to more than 9500. The measured average leak rate and shear strength are (2.55  ±  0.9)  ×  10-8 atm-cc s-1 and 42.53  ±  4.19 MPa, respectively. Furthermore, thermal cycling test between  -40 °C and 100 °C and high temperature storage test at 150 °C show that the resonant-frequency drifts are less than  ±7 ppm. In addition, the SBRs and the Q values have no obvious change after the tests. The experimental results demonstrated that the proposed encapsulation technique is well suited for the applications of RF MEMS devices.

Direct launch using the electric rail gun

NASA Technical Reports Server (NTRS)

Barber, J. P.

1983-01-01

The concept explored involves using a large single stage electric rail gun to achieve orbital velocities. Exit aerodynamics, launch package design and size, interior ballistics, system and component sizing and design concepts are treated. Technology development status and development requirements are identified and described. The expense of placing payloads in Earth orbit using conventional chemical rockets is considerable. Chemical rockets are very inefficient in converting chemical energy into payload kinetic energy. A rocket motor is relatively expensive and is usually expended on each launch. In addition specialized and expensive forms of fuel are required. Gun launching payloads directly to orbit from the Earth's surface is a possible alternative. Guns are much more energy efficient than rockets. The high capital cost of the gun installation can be recovered by reusing it over and over again. Finally, relatively inexpensive fuel and large quantities of energy are readily available to a fixed installation on the Earth's surface.

Transport model of controlled molecular rectifier showing unusual negative differential resistance effect.

PubMed

Granhen, Ewerton Ramos; Reis, Marcos Allan Leite; Souza, Fabrício M; Del Nero, Jordan

2010-12-01

We investigate theoretically the charge accumulated Q in a three-terminal molecular device in the presence of an external electric field. Our approach is based on ab initio Hartree-Fock and density functional theory methodology contained in Gaussian package. Our main finding is a negative differential resistance (NDR) in the charge Q as a function of an external electric field. To explain this NDR effect we apply a phenomenological capacitive model based on a quite general system composed of many localized levels (that can be LUMOs of a molecule) coupled to source and drain. The capacitance accounts for charging effects that can result in Coulomb blockade (CB) in the transport. We show that this CB effect gives rise to a NDR for a suitable set of phenomenological parameters, like tunneling rates and charging energies. The NDR profile obtained in both ab initio and phenomenological methodologies are in close agreement.

Self-assembled fibre optoelectronics with discrete translational symmetry

PubMed Central

Rein, Michael; Levy, Etgar; Gumennik, Alexander; Abouraddy, Ayman F.; Joannopoulos, John; Fink, Yoel

2016-01-01

Fibres with electronic and photonic properties are essential building blocks for functional fabrics with system level attributes. The scalability of thermal fibre drawing approach offers access to large device quantities, while constraining the devices to be translational symmetric. Lifting this symmetry to create discrete devices in fibres will increase their utility. Here, we draw, from a macroscopic preform, fibres that have three parallel internal non-contacting continuous domains; a semiconducting glass between two conductors. We then heat the fibre and generate a capillary fluid instability, resulting in the selective transformation of the cylindrical semiconducting domain into discrete spheres while keeping the conductive domains unchanged. The cylindrical-to-spherical expansion bridges the continuous conducting domains to create ∼104 self-assembled, electrically contacted and entirely packaged discrete spherical devices per metre of fibre. The photodetection and Mie resonance dependent response are measured by illuminating the fibre while connecting its ends to an electrical readout. PMID:27698454

Self-assembled fibre optoelectronics with discrete translational symmetry.

PubMed

Rein, Michael; Levy, Etgar; Gumennik, Alexander; Abouraddy, Ayman F; Joannopoulos, John; Fink, Yoel

2016-10-04

Fibres with electronic and photonic properties are essential building blocks for functional fabrics with system level attributes. The scalability of thermal fibre drawing approach offers access to large device quantities, while constraining the devices to be translational symmetric. Lifting this symmetry to create discrete devices in fibres will increase their utility. Here, we draw, from a macroscopic preform, fibres that have three parallel internal non-contacting continuous domains; a semiconducting glass between two conductors. We then heat the fibre and generate a capillary fluid instability, resulting in the selective transformation of the cylindrical semiconducting domain into discrete spheres while keeping the conductive domains unchanged. The cylindrical-to-spherical expansion bridges the continuous conducting domains to create ∼10 4 self-assembled, electrically contacted and entirely packaged discrete spherical devices per metre of fibre. The photodetection and Mie resonance dependent response are measured by illuminating the fibre while connecting its ends to an electrical readout.

Fluid cooled electrical assembly

DOEpatents

Rinehart, Lawrence E.; Romero, Guillermo L.

2007-02-06

A heat producing, fluid cooled assembly that includes a housing made of liquid-impermeable material, which defines a fluid inlet and a fluid outlet and an opening. Also included is an electrical package having a set of semiconductor electrical devices supported on a substrate and the second major surface is a heat sink adapted to express heat generated from the electrical apparatus and wherein the second major surface defines a rim that is fit to the opening. Further, the housing is constructed so that as fluid travels from the fluid inlet to the fluid outlet it is constrained to flow past the opening thereby placing the fluid in contact with the heat sink.

Power Electronics Thermal Management Research: Annual Progress Report

DOE Office of Scientific and Technical Information (OSTI.GOV)

Moreno, Gilberto

The objective for this project is to develop thermal management strategies to enable efficient and high-temperature wide-bandgap (WBG)-based power electronic systems (e.g., emerging inverter and DC-DC converter). Reliable WBG devices are capable of operating at elevated temperatures (≥ 175 °Celsius). However, packaging WBG devices within an automotive inverter and operating them at higher junction temperatures will expose other system components (e.g., capacitors and electrical boards) to temperatures that may exceed their safe operating limits. This creates challenges for thermal management and reliability. In this project, system-level thermal analyses are conducted to determine the effect of elevated device temperatures on invertermore » components. Thermal modeling work is then conducted to evaluate various thermal management strategies that will enable the use of highly efficient WBG devices with automotive power electronic systems.« less

A Compact, Soft-Switching DC-DC Converter for Electric Propulsion

NASA Technical Reports Server (NTRS)

Button, Robert; Redilla, Jack; Ayyanar, Raja

2003-01-01

A hybrid, soft-switching, DC-DC converter has been developed with superior soft switching characteristics, high efficiency, and low electro-magnetic interference. This hybrid topology is comprised of an uncontrolled bridge operating at full pulse-width, and a controlled section operating as a conventional phase modulated converter. The unique topology is able to maintain zero voltage switching down to no load operating conditions. A breadboard prototype was developed and tested to demonstrate the benefits of the topology. Improvements were then made to reduce the size of passive components and increase efficiency in preparation for packaging. A packaged prototype was then designed and built, and several innovative packaging techniques are presented. Performance test data is presented that reveals deficiencies in the design of the power transformer. A simple redesign of the transformer windings eliminated the deficiency. Future plans to improve the converter and packaging design are presented along with several conclusions.

SiC Field Effect Transistor Technology Demonstrating Prolonged Stable Operation at 500 C

NASA Technical Reports Server (NTRS)

Neudeck, Philip G.; Spry, David J.; Chen, Liang-Yu; Okojie, Robert S.; Beheim, Glenn M.; Meredith, Roger; Ferrier, Terry

2006-01-01

While there have been numerous reports of short-term transistor operation at 500 degree C or above, these devices have previously not demonstrated sufficient long-term operational durability at 500 degree C to be considered viable for most envisioned applications. This paper reports the development of Silicone Carbi field effect transistors capable of long-term electrical operation at 500 degree C. A 6H-SiC MESFET was packaged and subjected to continuous electrical operation while residing in a 500 degree C oven in oxidizing air atmosphere for over 2400 hours. The transistor gain, saturation current (IDSS), and on-resistance (RDS) changed by less than 20% from initial values throughout the duration of the biased 500 degree C test. Another high-temperature packaged 6H-SiC MESFET was employed to form a simple one-stage high-temperature low-frequency voltage amplifier. This single-stage common-source amplifier demonstrated stable continuous electrical operation (negligible changes to gain and operating biases) for over 600 hours while residing in a 500 degree C air ambient oven. In both cases, increased leakage from annealing of the Schottky gate-to-channel diode was the dominant transistor degradation mechanism that limited the duration of 500 degree C electrical operation.

Bioelectric analyses of an osseointegrated intelligent implant design system for amputees.

PubMed

Isaacson, Brad M; Stinstra, Jeroen G; MacLeod, Rob S; Webster, Joseph B; Beck, James P; Bloebaum, Roy D

2009-07-15

The projected number of American amputees is expected to rise to 3.6 million by 2050. Many of these individuals depend on artificial limbs to perform routine activities, but prosthetic suspensions using traditional socket technology can prove to be cumbersome and uncomfortable for a person with limb loss. Moreover, for those with high proximal amputations, limited residual limb length may prevent exoprosthesis attachment all together. Osseointegrated implant technology is a novel operative procedure which allows firm skeletal attachment between the host bone and an implant. Preliminary results in European amputees with osseointegrated implants have shown improved clinical outcomes by allowing direct transfer of loads to the bone-implant interface. Despite the apparent advantages of osseointegration over socket technology, the current rehabilitation procedures require long periods of restrictive load bearing prior which may be reduced with expedited skeletal attachment via electrical stimulation. The goal of the osseointegrated intelligent implant design (OIID) system is to make the implant part of an electrical system to accelerate skeletal attachment and help prevent periprosthetic infection. To determine optimal electrode size and placement, we initiated proof of concept with computational modeling of the electric fields and current densities that arise during electrical stimulation of amputee residual limbs. In order to provide insure patient safety, subjects with retrospective computed tomography scans were selected and three dimensional reconstructions were created using customized software programs to ensure anatomical accuracy (Seg3D and SCIRun) in an IRB and HIPAA approved study. These software packages supported the development of patient specific models and allowed for interactive manipulation of electrode position and size. Preliminary results indicate that electric fields and current densities can be generated at the implant interface to achieve the homogenous electric field distributions required to induce osteoblast migration, enhance skeletal fixation and may help prevent periprosthetic infections. Based on the electrode configurations experimented with in the model, an external two band configuration will be advocated in the future.

Lightweight Inflatable Solar Array: Providing a Flexible, Efficient Solution to Space Power Systems for Small Spacecraft

NASA Technical Reports Server (NTRS)

Johnson, Les; Fabisinski, Leo; Justice, Stefanie

2014-01-01

Affordable and convenient access to electrical power is critical to consumers, spacecraft, military and other applications alike. In the aerospace industry, an increased emphasis on small satellite flights and a move toward CubeSat and NanoSat technologies, the need for systems that could package into a small stowage volume while still being able to power robust space missions has become more critical. As a result, the Marshall Space Flight Center's Advanced Concepts Office identified a need for more efficient, affordable, and smaller space power systems to trade in performing design and feasibility studies. The Lightweight Inflatable Solar Array (LISA), a concept designed, prototyped, and tested at the NASA Marshall Space Flight Center (MSFC) in Huntsville, Alabama provides an affordable, lightweight, scalable, and easily manufactured approach for power generation in space or on Earth. This flexible technology has many wide-ranging applications from serving small satellites to soldiers in the field. By using very thin, ultraflexible solar arrays adhered to an inflatable structure, a large area (and thus large amount of power) can be folded and packaged into a relatively small volume (shown in artist rendering in Figure 1 below). The proposed presentation will provide an overview of the progress to date on the LISA project as well as a look at its potential, with continued development, to revolutionize small spacecraft and portable terrestrial power systems.

Current topics in active and intelligent food packaging for preservation of fresh foods.

PubMed

Lee, Seung Yuan; Lee, Seung Jae; Choi, Dong Soo; Hur, Sun Jin

2015-11-01

The purpose of this review is to provide an overview of current packaging systems, e.g. active packaging and intelligent packaging, for various foods. Active packaging, such as modified atmosphere packaging (MAP), extends the shelf life of fresh produce, provides a high-quality product, reduces economic losses, including those caused by delay of ripening, and improves appearance. However, in active packaging, several variables must be considered, such as temperature control and different gas formulations with different product types and microorganisms. Active packaging refers to the incorporation of additive agents into packaging materials with the purpose of maintaining or extending food product quality and shelf life. Intelligent packaging is emerging as a potential advantage in food processing and is an especially useful tool for tracking product information and monitoring product conditions. Moreover, intelligent packaging facilitates data access and information exchange by altering conditions inside or outside the packaging and product. In spite of these advantages, few of these packaging systems are commercialized because of high cost, strict safety and hygiene regulations or limited consumer acceptance. Therefore more research is needed to develop cheaper, more easily applicable and effective packaging systems for various foods. © 2015 Society of Chemical Industry.

The solar dynamic radiator with a historical perspective

NASA Technical Reports Server (NTRS)

Mclallin, K. L.; Fleming, M. L.; Hoehn, F. W.; Howerton, R. L.

1988-01-01

A historical perspective on pumped-fluid loop space radiators provides a basis for the design of the Space Station Solar Dynamic (SD) power module radiator. SD power modules, capable of generating 25 kW (electrical) each, are planned for growth in Station power requirements. The Brayton cycle SD module configuration incorporates a pumped-fluid loop radiator that must reject up to 99 kW (thermal). The thermal/hydraulic design conditions in combination with required radiator orientation and packaging envelope form a unique set of constraints as compared to previous pumped-fluid loop radiator systems. Nevertheless, past program successes have demonstrated a technology base that can be applied to the SD radiator development program to ensure a low risk, low cost system.

Wafer-level vacuum/hermetic packaging technologies for MEMS

NASA Astrophysics Data System (ADS)

Lee, Sang-Hyun; Mitchell, Jay; Welch, Warren; Lee, Sangwoo; Najafi, Khalil

2010-02-01

An overview of wafer-level packaging technologies developed at the University of Michigan is presented. Two sets of packaging technologies are discussed: (i) a low temperature wafer-level packaging processes for vacuum/hermeticity sealing, and (ii) an environmentally resistant packaging (ERP) technology for thermal and mechanical control as well as vacuum packaging. The low temperature wafer-level encapsulation processes are implemented using solder bond rings which are first patterned on a cap wafer and then mated with a device wafer in order to encircle and encapsulate the device at temperatures ranging from 200 to 390 °C. Vacuum levels below 10 mTorr were achieved with yields in an optimized process of better than 90%. Pressures were monitored for more than 4 years yielding important information on reliability and process control. The ERP adopts an environment isolation platform in the packaging substrate. The isolation platform is designed to provide low power oven-control, vibration isolation and shock protection. It involves batch flip-chip assembly of a MEMS device onto the isolation platform wafer. The MEMS device and isolation structure are encapsulated at the wafer-level by another substrate with vertical feedthroughs for vacuum/hermetic sealing and electrical signal connections. This technology was developed for high performance gyroscopes, but can be applied to any type of MEMS device.

Production patterns of packaging waste categories generated at typical Mediterranean residential building worksites.

PubMed

González Pericot, N; Villoria Sáez, P; Del Río Merino, M; Liébana Carrasco, O

2014-11-01

The construction sector is responsible for around 28% of the total waste volume generated in Europe, which exceeds the amount of household waste. This has led to an increase of different research studies focusing on construction waste quantification. However, within the research studies made, packaging waste has been analyzed to a limited extent. This article focuses on the packaging waste stream generated in the construction sector. To this purpose current on-site waste packaging management has been assessed by monitoring ten Mediterranean residential building works. The findings of the experimental data collection revealed that the incentive measures implemented by the construction company to improve on-site waste sorting failed to achieve the intended purpose, showing low segregation ratios. Subsequently, through an analytical study the generation patterns for packaging waste are established, leading to the identification of the prevailing kinds of packaging and the products responsible for their generation. Results indicate that plastic waste generation maintains a constant trend throughout the whole construction process, while cardboard becomes predominant towards the end of the construction works with switches and sockets from the electricity stage. Understanding the production patterns of packaging waste will be beneficial for adapting waste management strategies to the identified patterns for the specific nature of packaging waste within the context of construction worksites. Copyright © 2014 Elsevier Ltd. All rights reserved.

Solar powered hybrid sensor module program

NASA Technical Reports Server (NTRS)

Johnson, J. M.; Holmes, H. K.

1985-01-01

Geo-orbital systems of the near future will require more sophisticated electronic and electromechanical monitoring and control systems than current satellite systems with an emphasis in the design on the electronic density and autonomy of the subsystem components. Results of a project to develop, design, and implement a proof-of-concept sensor system for space applications, with hybrids forming the active subsystem components are described. The design of the solar power hybrid sensor modules is discussed. Module construction and function are described. These modules combined low power CMOS electronics, GaAs solar cells, a crystal oscillatory standard UART data formatting, and a bidirectional optical data link into a single 1.25 x 1.25 x 0.25 inch hybrid package which has no need for electrical input or output. Several modules were built and tested. Applications of such a system for future space missions are also discussed.

Thermal energy storage for the Stirling engine powered automobile

NASA Technical Reports Server (NTRS)

Morgan, D. T. (Editor)

1979-01-01

A thermal energy storage (TES) system developed for use with the Stirling engine as an automotive power system has gravimetric and volumetric storage densities which are competitive with electric battery storage systems, meets all operational requirements for a practical vehicle, and can be packaged in compact sized automobiles with minimum impact on passenger and freight volume. The TES/Stirling system is the only storage approach for direct use of combustion heat from fuel sources not suitable for direct transport and use on the vehicle. The particular concept described is also useful for a dual mode TES/liquid fuel system in which the TES (recharged from an external energy source) is used for short duration trips (approximately 10 miles or less) and liquid fuel carried on board the vehicle used for long duration trips. The dual mode approach offers the potential of 50 percent savings in the consumption of premium liquid fuels for automotive propulsion in the United States.

Development of Sic Gas Sensor Systems

NASA Technical Reports Server (NTRS)

Hunter, G. W.; Neudeck, P. G.; Okojie, R. S.; Beheim, G. M.; Thomas, V.; Chen, L.; Lukco, D.; Liu, C. C.; Ward, B.; Makel, D.

2002-01-01

Silicon carbide (SiC) based gas sensors have significant potential to address the gas sensing needs of aerospace applications such as emission monitoring, fuel leak detection, and fire detection. However, in order to reach that potential, a range of technical challenges must be overcome. These challenges go beyond the development of the basic sensor itself and include the need for viable enabling technologies to make a complete gas sensor system: electrical contacts, packaging, and transfer of information from the sensor to the outside world. This paper reviews the status at NASA Glenn Research Center of SiC Schottky diode gas sensor development as well as that of enabling technologies supporting SiC gas sensor system implementation. A vision of a complete high temperature microfabricated SiC gas sensor system is proposed. In the long-term, it is believed that improvements in the SiC semiconductor material itself could have a dramatic effect on the performance of SiC gas sensor systems.

Ceramic ball grid array package stress analysis

NASA Astrophysics Data System (ADS)

Badri, S. H. B. S.; Aziz, M. H. A.; Ong, N. R.; Sauli, Z.; Alcain, J. B.; Retnasamy, V.

2017-09-01

The ball grid array (BGA), a form of chip scale package (CSP), was developed as one of the most advanced surface mount devices, which may be assembled by an ordinary surface ball bumps are used instead of plated nickel and gold (Ni/Au) bumps. Assembly and reliability of the BGA's printed circuit board (PCB), which is soldered by conventional surface mount technology is considered in this study. The Ceramic Ball Grid Array (CBGA) is a rectangular ceramic package or square-shaped that will use the solder ball for external electrical connections instead of leads or wire for connections. The solder balls will be arranged in an array or grid at the bottom of the ceramic package body. In this study, ANSYS software is used to investigate the stress on the package for 2 balls and 4 balls of the CBGA package with the various force range of 1-3 Newton applied to the top of the die, top of the substrate and side of the substrate. The highest maximum stress was analyzed and the maximum equivalent stress was observed on the solder ball and the die. From the simulation result, the CBGA package with less solder balls experience higher stress compared to the package with many solder balls. Therefore, less number of solder ball on the CBGA package results higher stress and critically affect the reliability of the solder balls itself, substrate and die which can lead to the solder crack and also die crack.

Quartz/fused silica chip carriers

NASA Technical Reports Server (NTRS)

1992-01-01

The primary objective of this research and development effort was to develop monolithic microwave integrated circuit (MMIC) packaging which will operate efficiently at millimeter-wave frequencies. The packages incorporated fused silica as the substrate material which was selected due to its favorable electrical properties and potential performance improvement over more conventional materials for Ka-band operation. The first step towards meeting this objective is to develop a package that meets standard mechanical and thermal requirements using fused silica and to be compatible with semiconductor devices operating up to at least 44 GHz. The second step is to modify the package design and add multilayer and multicavity capacity to allow for application specific integrated circuits (ASIC's) to control multiple phase shifters. The final step is to adapt the package design to a phased array module with integral radiating elements. The first task was a continuation of the SBIR Phase 1 work. Phase 1 identified fused silica as a viable substrate material by demonstrating various plating, machining, and adhesion properties. In Phase 2 Task 1, a package was designed and fabricated to validate these findings. Task 2 was to take the next step in packaging and fabricate a multilayer, multichip module (MCM). This package is the predecessor to the phased array module and demonstrates the ability to via fill, circuit print, laminate, and to form vertical interconnects. The final task was to build a phased array module. The radiating elements were to be incorporated into the package instead of connecting to it with wire or ribbon bonds.

Optical waveguide circuit board with a surface-mounted optical receiver array

NASA Astrophysics Data System (ADS)

Thomson, J. E.; Levesque, Harold; Savov, Emil; Horwitz, Fred; Booth, Bruce L.; Marchegiano, Joseph E.

1994-03-01

A photonic circuit board is fabricated for potential application to interchip and interboard parallel optical links. The board comprises photolithographically patterned polymer optical waveguides on a conventional glass-epoxy electrical circuit board and a surface-mounted integrated circuit (IC) package that optically and electrically couples to an optoelectronic IC. The waveguide circuits include eight-channel arrays of straights, cross-throughs, curves, self- aligning interconnects to multi-fiber ribbon, and out-of-plane turning mirrors. A coherent, fused bundle of optical fibers couples light between 45-deg waveguide mirrors and a GaAs receiver array in the IC package. The fiber bundle is easily aligned to the mirrors and the receivers and is amenable to surface mounting and hermetic sealing. The waveguide-receiver- array board achieved error-free data rates up to 1.25 Gbits/s per channel, and modal noise was shown to be negligible.

Research and Development of Fully Automatic Alien Smoke Stack and Packaging System

NASA Astrophysics Data System (ADS)

Yang, Xudong; Ge, Qingkuan; Peng, Tao; Zuo, Ping; Dong, Weifu

2017-12-01

The problem of low efficiency of manual sorting packaging for the current tobacco distribution center, which developed a set of safe efficient and automatic type of alien smoke stack and packaging system. The functions of fully automatic alien smoke stack and packaging system adopt PLC control technology, servo control technology, robot technology, image recognition technology and human-computer interaction technology. The characteristics, principles, control process and key technology of the system are discussed in detail. Through the installation and commissioning fully automatic alien smoke stack and packaging system has a good performance and has completed the requirements for shaped cigarette.

Military Curricula for Vocational & Technical Education. Basic Electricity and Electronics. CANTRAC A-100-0010. Module 32: Intermediate Oscillators; Module 33: Special Devices; Module 34: Linear Integrated Circuits. Students Guide.

ERIC Educational Resources Information Center

Chief of Naval Education and Training Support, Pensacola, FL.

This student guidebook is designed for use with the study booklets in modules 32 through 34 included in the military-developed course on basic electricity and electronics. The course is one of a number of military-developed curriculum packages selected for adaptation to vocational instructional and curriculum development in a civilian setting. An…

Military Curricula for Vocational & Technical Education. Basic Electricity and Electronics. CANTRAC A-100-0010. Module 30: Intermediate Power Supplies; Module 31: RF, IF, and Video Amplifiers. Students Guide.

ERIC Educational Resources Information Center

Chief of Naval Education and Training Support, Pensacola, FL.

This student guidebook is designed for use with the study booklets in modules 30-31 included in the military-developed course on basic electricity and electronics. The course is one of a number of military-developed curriculum packages selected for adaptation to vocational instructional and curriculum development in a civilian setting. An…

Indoor unit for electric heat pump

DOEpatents

Draper, R.; Lackey, R.S.; Fagan, T.J. Jr.; Veyo, S.E.; Humphrey, J.R.

1984-05-22

An indoor unit for an electric heat pump is provided in modular form including a refrigeration module, an air mover module, and a resistance heat package module, the refrigeration module including all of the indoor refrigerant circuit components including the compressor in a space adjacent the heat exchanger, the modules being adapted to be connected to air flow communication in several different ways as shown to accommodate placement of the unit in various orientations. 9 figs.

Military Curricula for Vocational & Technical Education. Basic Electricity and Electronics. CANTRAC A-100-0010. Module 20: Solid State Power Supplies; 20T: Electron Tube Power Supplies. Study Booklet.

ERIC Educational Resources Information Center

Chief of Naval Education and Training Support, Pensacola, FL.

This set of individualized learning modules on power supplies is one in a series of modules for a course in basic electricity and electronics. The course is one of a number of military-developed curriculum packages selected for adaptation to vocational instructional and curriculum development in a civilian setting. Two modules are included in the…

Military Curricula for Vocational & Technical Education. Basic Electricity and Electronics. CANTRAC A-100-0010. Module 21: Basic Transistor Theory; Module 21T: Multi-Element Vacuum Tubes. Study Booklet.

ERIC Educational Resources Information Center

Chief of Naval Education and Training Support, Pensacola, FL.

This set of individualized learning modules on transistor theory is one in a series of modules for a course in basic electricity and electronics. The course is one of a number of military-developed curriculum packages selected for adaptation to vocational instructional and curriculum development in a civilian setting. Two modules are included in…

Empirical Investigation of Electricity Self-Generation in a Lubricated Sliding–Rolling Contact

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ščepanskis, Mihails; Gould, Benjamin; Greco, Aaron

The paper reports the empirical observations of voltage generation in a lubricated tribocontact with different oils altering load, sliding and temperature. The investigation is done in the context of research of the root cause of white etching cracks (WEC) failure in bearings. Tested oils of different additive packages found completely different electrical behavior. The oil, which is known to produce WECs in laboratory tests, demonstrated non-zero voltage generation

Research on multi - channel interactive virtual assembly system for power equipment under the “VR+” era

NASA Astrophysics Data System (ADS)

Ren, Yilong; Duan, Xitong; Wu, Lei; He, Jin; Xu, Wu

2017-06-01

With the development of the “VR+” era, the traditional virtual assembly system of power equipment has been unable to satisfy our growing needs. In this paper, based on the analysis of the traditional virtual assembly system of electric power equipment and the application of VR technology in the virtual assembly system of electric power equipment in our country, this paper puts forward the scheme of establishing the virtual assembly system of power equipment: At first, we should obtain the information of power equipment, then we should using OpenGL and multi texture technology to build 3D solid graphics library. After the completion of three-dimensional modeling, we can use the dynamic link library DLL package three-dimensional solid graphics generation program to realize the modularization of power equipment model library and power equipment model library generated hidden algorithm. After the establishment of 3D power equipment model database, we set up the virtual assembly system of 3D power equipment to separate the assembly operation of the power equipment from the space. At the same time, aiming at the deficiency of the traditional gesture recognition algorithm, we propose a gesture recognition algorithm based on improved PSO algorithm for BP neural network data glove. Finally, the virtual assembly system of power equipment can really achieve multi-channel interaction function.

Deployment of FlexCHP System

DOE Office of Scientific and Technical Information (OSTI.GOV)

Cygan, David

The Gas Technology Institute (GTI), along with its partner Integrated CHP Systems Corporation, has developed and demonstrated an Ultra-Low-Nitrogen Oxide (ULN) Flexible Combined Heat and Power (FlexCHP) system that packages a state-of-the-art Capstone C65 gas microturbine and Johnston PFXX100 boiler with an innovative natural gas-fired supplemental burner. Supplemental burners add heat as needed in response to facility demand, which increases energy efficiency, but typically raises exhaust NOx levels, degrading local air quality unless a costly and complicated catalytic treatment system is added. The FlexCHP system increases energy efficiency and achieves the 2007 California Air Resource Board (CARB) distributed generation emissionsmore » standards for Nitrogen oxides (NOx), Carbon Monoxide (CO), and Total Hydrocarbons (THC) without catalytic exhaust gas treatment. The key to this breakthrough performance is a simple and reliable burner design which utilizes staged combustion with engineered internal recirculation. This ULN burner system successfully uses turbine exhaust as an oxidizer, while achieving high efficiencies and low emissions. In tests at its laboratory facilities in Des Plaines, Illinois, GTI validated the ability of the system to achieve emissions of NOx, CO, and THC below the CARB criteria of 0.07, 0.10, and 0.02 lb/MW-h respectively. The FlexCHP system was installed at the field demonstration site, Inland Empire Foods, in Riverside, California to verify performance of the technology in an applied environment. The resulting Combined Heat and Power (CHP) package promises to make CHP implementation more attractive, mitigate greenhouse gas emissions, and improve the reliability of electricity supply.« less

Telescoping Solar Array Concept for Achieving High Packaging Efficiency

NASA Technical Reports Server (NTRS)

Mikulas, Martin; Pappa, Richard; Warren, Jay; Rose, Geoff

2015-01-01

Lightweight, high-efficiency solar arrays are required for future deep space missions using high-power Solar Electric Propulsion (SEP). Structural performance metrics for state-of-the art 30-50 kW flexible blanket arrays recently demonstrated in ground tests are approximately 40 kW/cu m packaging efficiency, 150 W/kg specific power, 0.1 Hz deployed stiffness, and 0.2 g deployed strength. Much larger arrays with up to a megawatt or more of power and improved packaging and specific power are of interest to mission planners for minimizing launch and life cycle costs of Mars exploration. A new concept referred to as the Compact Telescoping Array (CTA) with 60 kW/cu m packaging efficiency at 1 MW of power is described herein. Performance metrics as a function of array size and corresponding power level are derived analytically and validated by finite element analysis. Feasible CTA packaging and deployment approaches are also described. The CTA was developed, in part, to serve as a NASA reference solar array concept against which other proposed designs of 50-1000 kW arrays for future high-power SEP missions could be compared.

Electric propulsion using the permanent magnet synchronous motor without rotor position transducers

NASA Astrophysics Data System (ADS)

Batzel, Todd Douglas

The permanent magnet synchronous motor (PMSM) is increasingly playing an important role in electric propulsion systems due to its many advantages over competing technologies. For successful operation of the PMSM, rotor position and speed information is required. A resolver or encoder attached to the shaft of the machine usually provides this information. Many applications, however, cannot tolerate the use of the position sensor because of space and weight limitations, reliability concerns, or packaging issues. Thus, there has been an intense interest in the development of a so-called position sensorless drive, where the PMSM stator itself is used as the rotor position sensor. In this work, a sensorless electric drive is developed for various undersea propulsion applications, where the rotor position sensor is often undesirable due to the harsh operating environment as well as space and weight limitations. In this work, an observer is developed which enables sensorless operation of the PMSM over a wide speed range. In addition, a method is presented for estimating the standstill rotor angle, an operating condition at which the rotor position observers are typically ill conditioned. In this work two design methodologies are applied to the sensorless electric drive application, including a model-based and a neural network-based approach. Implementation issues for the sensorless electric drive are discussed, and experimental results are presented in order to demonstrate the effectiveness of the proposed techniques to the sensorless PMSM.

Heterogeneously integrated microsystem-on-a-chip

DOEpatents

Chanchani, Rajen [Albuquerque, NM

2008-02-26

A microsystem-on-a-chip comprises a bottom wafer of normal thickness and a series of thinned wafers can be stacked on the bottom wafer, glued and electrically interconnected. The interconnection layer comprises a compliant dielectric material, an interconnect structure, and can include embedded passives. The stacked wafer technology provides a heterogeneously integrated, ultra-miniaturized, higher performing, robust and cost-effective microsystem package. The highly integrated microsystem package, comprising electronics, sensors, optics, and MEMS, can be miniaturized both in volume and footprint to the size of a bottle-cap or less.

Addressable test matrix for measuring analog transfer characteristics of test elements used for integrated process control and device evaluation

NASA Technical Reports Server (NTRS)

Buehler, Martin G. (Inventor)

1988-01-01

A set of addressable test structures, each of which uses addressing schemes to access individual elements of the structure in a matrix, is used to test the quality of a wafer before integrated circuits produced thereon are diced, packaged and subjected to final testing. The electrical characteristic of each element is checked and compared to the electrical characteristic of all other like elements in the matrix. The effectiveness of the addressable test matrix is in readily analyzing the electrical characteristics of the test elements and in providing diagnostic information.

Environmental life cycle assessment of Italian mozzarella cheese: Hotspots and improvement opportunities.

PubMed

Dalla Riva, A; Burek, J; Kim, D; Thoma, G; Cassandro, M; De Marchi, M

2017-10-01

The present study investigated a cradle-to-grave life cycle assessment to estimate the environmental impacts associated with Italian mozzarella cheese consumption. The differences between mozzarella produced from raw milk and mozzarella produced from curd were studied, and differences in manufacturing processes have been emphasized in order to provide guidance for targeted improvements at this phase. Specifically, the third-largest Italian mozzarella producer was surveyed to collect site-specific manufacturing data. The Ecoinvent v3.2 database was used for secondary data, whereas SimaPro 8.1 was the modeling software. The inventory included inputs from farm activities to end of life disposal of wasted mozzarella and packaging. Additionally, plant-specific information was used to assign major inputs, such as electricity, natural gas, packaging, and chemicals to specific products; however, where disaggregated information was not provided, milk solids allocation was applied. Notably, loss of milk solids was accounted during the manufacture, moreover mozzarella waste and transport were considered during distribution, retail, and consumption phases. Feed production and animal emissions were the main drivers of raw milk production. Electricity and natural gas usage, packaging (cardboard and plastic), transport, wastewater treatment, and refrigerant loss affected the emissions from a farm gate-to-dairy plant gate perspective. Post-dairy plant gate effects were mainly determined by electricity usage for storage of mozzarella, transport of mozzarella, and waste treatment. The average emissions were 6.66 kg of CO 2 equivalents and 45.1 MJ of cumulative energy demand/kg of consumed mozzarella produced directly from raw milk, whereas mozzarella from purchased curd had larger emissions than mozzarella from raw milk due to added transport of curd from specialty manufacturing plants, as well as electricity usage from additional processes at the mozzarella plant that are required to process the curd into mozzarella. Normalization points to ecotoxicity as the impact category most significantly influenced by mozzarella consumption. From a farm gate-to-grave perspective, ecotoxicity and freshwater and marine eutrophication are the first and second largest contributors of mozzarella consumption to average European effects, respectively. To increase environmental sustainability, an improvement of efficiency for energy and packaging usage and transport activities is recommended in the post-farm gate mozzarella supply chain. Copyright © 2017 American Dairy Science Association. Published by Elsevier Inc. All rights reserved.

Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2012-01-01

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

RHETT/EPDM Performance Characterization

NASA Technical Reports Server (NTRS)

Haag, T.; Osborn, M.

1998-01-01

The 0.6 kW Electric Propulsion Demonstration Module (EPDM) flight thruster system was tested in a large vacuum facility for performance measurements and functional checkout. The thruster was operated at a xenon flow rate of 3.01 mg/s, which was supplied through a self-contained propellant system. All power was provided through a flight-packaged power processing unit, which was mounted in vacuum on a cold plate. The thruster was cycled through 34 individual startup and shutdown sequences. Operating periods ranged from 3 to 3600 seconds. The system responded promptly to each command sequence and there were no involuntary shutdowns. Direct thrust measurements indicated that steady state thrust was temperature sensitive, and varied from a high of 41.7 mN at 16 C, to a low of 34.8 mN at 110 C. Short duration thruster firings showed rapid response and good repeatability.

Electrical power converter method and system employing multiple output converters

DOEpatents

Beihoff, Bruce C [Wauwatosa, WI; Radosevich, Lawrence D [Muskego, WI; Meyer, Andreas A [Richmond Heights, OH; Gollhardt, Neil [Fox Point, WI; Kannenberg, Daniel G [Waukesha, WI

2007-05-01

A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Electrical power converter method and system employing multiple-output converters

DOEpatents

Beihoff, Bruce C.; Radosevich, Lawrence D.; Meyer, Andreas A.; Gollhardt, Neil; Kannenberg, Daniel G.

2006-03-21

A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

48 CFR 908.7109 - Fuels and packaged petroleum products.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 48 Federal Acquisition Regulations System 5 2011-10-01 2011-10-01 false Fuels and packaged petroleum products. 908.7109 Section 908.7109 Federal Acquisition Regulations System DEPARTMENT OF ENERGY....7109 Fuels and packaged petroleum products. Acquisitions of fuel and packaged petroleum products by DOE...

Influence of interconnection on the long-term reliability of UV LED packages

NASA Astrophysics Data System (ADS)

Nieland, S.; Mitrenga, D.; Karolewski, D.; Brodersen, O.; Ortlepp, T.

2017-02-01

High power LEDs have conquered the mass market in recent years. Besides the main development focus to achieve higher productivity in the field of visible semiconductor LED processing, the wavelength range is further enhanced by active research and development in the direction of UVA / UVB / UVC. UVB and UVC LEDs are new and promising due to their numerous advantages. UV LEDs emit in a near range of one single emission peak with a width (FWHM) below 15 nm compared to conventional mercury discharge lamps and xenon sources, which show broad spectrums with many emission peaks over a wide range of wavelengths. Furthermore, the UV LED size is in the range of a few hundred microns and offers a high potential of significant system miniaturization. Of course, LED efficiency, lifetime and output power have to be increased [1]. Lifetime limiting issues of UVB/UVC-LED are the very high thermal stress in the chip resulting from the higher forward voltages (6-10 V @ 350 mA), the lower external quantum efficiency, below 10 % (most of the power disappears as heat), and the thermal resistance Rth of conventional LED packages being not able to dissipate these large amounts of heat for spreading. Beside the circuit boards and submounts which should have maximum thermal conductivity, the dimension of contacts as well as the interconnection of UV LED to the submount/package determinates the resolvable amount of heat [2]. In the paper different innovative interconnection techniques for UVC-LED systems will be discussed focused on the optimization of thermal conductivity in consideration of the assembly costs. Results on thermal simulation for the optimal contact dimensions and interconnections will be given. In addition, these theoretical results will be compared with results on electrical characterization as well as IR investigations on real UV LED packages in order to give recommendations for optimal UV LED assembly.

Modular High-Energy Systems for Solar Power Satellites

NASA Technical Reports Server (NTRS)

Howell, Joe T.; Carrington, Connie K.; Marzwell, Neville I.; Mankins, John C.

2006-01-01

Modular High-Energy Systems are Stepping Stones to provide capabilities for energy-rich infrastructure located in space to support a variety of exploration scenarios as well as provide a supplemental source of energy during peak demands to ground grid systems. Abundant renewable energy at lunar or other locations could support propellant production and storage in refueling scenarios that enable affordable exploration. Renewable energy platforms in geosynchronous Earth orbits can collect and transmit power to satellites, or to Earth-surface locations. Energy-rich space technologies also enable the use of electric-powered propulsion systems that could efficiently deliver cargo and exploration facilities to remote locations. A first step to an energy-rich space infrastructure is a 100-kWe class solar-powered platform in Earth orbit. The platform would utilize advanced technologies in solar power collection and generation, power management and distribution, thermal management, electric propulsion, wireless avionics, autonomous in space rendezvous and docking, servicing, and robotic assembly. It would also provide an energy-rich free-flying platform to demonstrate in space a portfolio of technology flight experiments. This paper summary a preliminary design concept for a 100-kWe solar-powered satellite system to demonstrate in-flight a variety of advanced technologies, each as a separate payload. These technologies include, but are not limited to state-of-the-art solar concentrators, highly efficient multi-junction solar cells, integrated thermal management on the arrays, and innovative deployable structure design and packaging to enable the 100-kW satellite feasible to launch on one existing launch vehicle. Higher voltage arrays and power distribution systems (PDS) reduce or eliminate the need for massive power converters, and could enable direct-drive of high-voltage solar electric thrusters.

Model of Heat Exchangers for Waste Heat Recovery from Diesel Engine Exhaust for Thermoelectric Power Generation

NASA Astrophysics Data System (ADS)

Baker, Chad; Vuppuluri, Prem; Shi, Li; Hall, Matthew

2012-06-01

The performance and operating characteristics of a hypothetical thermoelectric generator system designed to extract waste heat from the exhaust of a medium-duty turbocharged diesel engine were modeled. The finite-difference model consisted of two integrated submodels: a heat exchanger model and a thermoelectric device model. The heat exchanger model specified a rectangular cross-sectional geometry with liquid coolant on the cold side, and accounted for the difference between the heat transfer rate from the exhaust and that to the coolant. With the spatial variation of the thermoelectric properties accounted for, the thermoelectric device model calculated the hot-side and cold-side heat flux for the temperature boundary conditions given for the thermoelectric elements, iterating until temperature and heat flux boundary conditions satisfied the convection conditions for both exhaust and coolant, and heat transfer in the thermoelectric device. A downhill simplex method was used to optimize the parameters that affected the electrical power output, including the thermoelectric leg height, thermoelectric n-type to p-type leg area ratio, thermoelectric leg area to void area ratio, load electrical resistance, exhaust duct height, coolant duct height, fin spacing in the exhaust duct, location in the engine exhaust system, and number of flow paths within the constrained package volume. The calculation results showed that the configuration with 32 straight fins was optimal across the 30-cm-wide duct for the case of a single duct with total height of 5.5 cm. In addition, three counterflow parallel ducts or flow paths were found to be an optimum number for the given size constraint of 5.5 cm total height, and parallel ducts with counterflow were a better configuration than serpentine flow. Based on the reported thermoelectric properties of MnSi1.75 and Mg2Si0.5Sn0.5, the maximum net electrical power achieved for the three parallel flow paths in a counterflow arrangement was 1.06 kW for package volume of 16.5 L and exhaust flow enthalpy flux of 122 kW.

Wafer-level radiometric performance testing of uncooled microbolometer arrays

NASA Astrophysics Data System (ADS)

Dufour, Denis G.; Topart, Patrice; Tremblay, Bruno; Julien, Christian; Martin, Louis; Vachon, Carl

2014-03-01

A turn-key semi-automated test system was constructed to perform on-wafer testing of microbolometer arrays. The system allows for testing of several performance characteristics of ROIC-fabricated microbolometer arrays including NETD, SiTF, ROIC functionality, noise and matrix operability, both before and after microbolometer fabrication. The system accepts wafers up to 8 inches in diameter and performs automated wafer die mapping using a microscope camera. Once wafer mapping is completed, a custom-designed quick insertion 8-12 μm AR-coated Germanium viewport is placed and the chamber is pumped down to below 10-5 Torr, allowing for the evaluation of package-level focal plane array (FPA) performance. The probe card is electrically connected to an INO IRXCAM camera core, a versatile system that can be adapted to many types of ROICs using custom-built interface printed circuit boards (PCBs). We currently have the capability for testing 384x288, 35 μm pixel size and 160x120, 52 μm pixel size FPAs. For accurate NETD measurements, the system is designed to provide an F/1 view of two rail-mounted blackbodies seen through the Germanium window by the die under test. A master control computer automates the alignment of the probe card to the dies, the positioning of the blackbodies, FPA image frame acquisition using IRXCAM, as well as data analysis and storage. Radiometric measurement precision has been validated by packaging dies measured by the automated probing system and re-measuring the SiTF and Noise using INO's pre-existing benchtop system.

Cooling system for electronic components

DOEpatents

Anderl, William James; Colgan, Evan George; Gerken, James Dorance; Marroquin, Christopher Michael; Tian, Shurong

2015-12-15

Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

Cooling system for electronic components

DOEpatents

Anderl, William James; Colgan, Evan George; Gerken, James Dorance; Marroquin, Christopher Michael; Tian, Shurong

2016-05-17

Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

International Space Station (ISS)

NASA Image and Video Library

2000-12-07

In this image, the five STS-97 crew members pose with the 3 members of the Expedition One crew onboard the International Space Station (ISS) for the first ever traditional onboard portrait taken in the Zvezda Service Module. On the front row, left to right, are astronauts Brent W. Jett, Jr., STS-97 commander; William M. Shepherd, Expedition One mission commander; and Joseph R. Tarner, STS-97 mission specialist. On the second row, from the left are Cosmonaut Sergei K. Krikalev, Expedition One flight engineer; astronaut Carlos I. Noriega, STS-97 mission specialist; cosmonaut Yuri P. Gidzenko, Expedition One Soyuz commander; and Michael J. Bloomfield, STS-97 pilot. Behind them is astronaut Marc Garneau, STS-97 mission specialist representing the Canadian Space Agency (CSA). The primary objective of the STS-97 mission was the delivery, assembly, and activation of the U.S. electrical power system onboard the International Space Station (ISS). The electrical power system, which is built into a 73-meter (240-foot) long solar array structure consists of solar arrays, radiators, batteries, and electronics. The entire 15.4-metric ton (17-ton) package is called the P6 Integrated Truss Segment, and is the heaviest and largest element yet delivered to the station aboard a space shuttle. The electrical system will eventually provide the power necessary for the first ISS crews to live and work in the U.S. segment. The STS-97 crew of five launched aboard the Space Shuttle Orbiter Endeavor on November 30, 2000 for an 11 day mission.

Measurements of Ozone, Lightning, and Electric Fields within Thunderstorms over Langmuir Laboratory, New Mexico

NASA Astrophysics Data System (ADS)

Eack, K. B.; Winn, W. P.; Rust, W. D.; Minschwaner, K.; Fredrickson, S.; Kennedy, D.; Edens, H. E.; Kalnajs, L. E.; Rabin, R. M.; Lu, G. P.; Bonin, D.

2008-12-01

A field project was conducted at the Langmuir Laboratory for Atmospheric Research during the summer of 2008 in an effort to better understand the direct production of ozone within electrically active storms. Five balloon flights were successfully launched into thunderstorms during this project. In situ measurements from the balloon instrument package included ozone mixing ratio, electric field strength, meteorological variables, and GPS location and timing. Lightning discharges were identified within each storm using a ground based lightning mapping array. The data show that the instruments ascended through regions of high electric fields within the sampled storms, and in some cases the balloon was in very close proximity to lightning. Relationships between electric field, lightning, and ozone observed during these flights will be discussed.

Packaging for Food Service

NASA Technical Reports Server (NTRS)

Stilwell, E. J.

1985-01-01

Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

Novel food packaging systems with natural antimicrobial agents.

PubMed

Irkin, Reyhan; Esmer, Ozlem Kizilirmak

2015-10-01

A new type of packaging that combines food packaging materials with antimicrobial substances to control microbial surface contamination of foods to enhance product microbial safety and to extend shelf-life is attracting interest in the packaging industry. Several antimicrobial compounds can be combined with different types of packaging materials. But in recent years, since consumer demand for natural food ingredients has increased because of safety and availability, these natural compounds are beginning to replace the chemical additives in foods and are perceived to be safer and claimed to alleviate safety concerns. Recent research studies are mainly focused on the application of natural antimicrobials in food packaging system. Biologically derived compounds like bacteriocins, phytochemicals, enzymes can be used in antimicrobial food packaging. The aim of this review is to give an overview of most important knowledge about application of natural antimicrobial packagings with model food systems and their antimicrobial effects on food products.

INNOVATIVE HYBRID GAS/ELECTRIC CHILLER COGENERATION

DOE Office of Scientific and Technical Information (OSTI.GOV)

Todd Kollross; Mike Connolly

2004-06-30

Engine-driven chillers are quickly gaining popularity in the market place (increased from 7,000 tons in 1994 to greater than 50,000 tons in 1998) due to their high efficiency, electric peak shaving capability, and overall low operating cost. The product offers attractive economics (5 year pay back or less) in many applications, based on areas cooling requirements and electric pricing structure. When heat is recovered and utilized from the engine, the energy resource efficiency of a natural gas engine-driven chiller is higher than all competing products. As deregulation proceeds, real time pricing rate structures promise high peak demand electric rates, butmore » low off-peak electric rates. An emerging trend with commercial building owners and managers who require air conditioning today is to reduce their operating costs by installing hybrid chiller systems that combine gas and electric units. Hybrid systems not only reduce peak electric demand charges, but also allow customers to level their energy load profiles and select the most economical energy source, gas or electricity, from hour to hour. Until recently, however, all hybrid systems incorporated one or more gas-powered chillers (engine driven and/or absorption) and one or more conventional electric units. Typically, the cooling capacity of hybrid chiller plants ranges from the hundreds to thousands of refrigeration tons, with multiple chillers affording the user a choice of cooling systems. But this flexibility is less of an option for building operators who have limited room for equipment. To address this technology gap, a hybrid chiller was developed by Alturdyne that combines a gas engine, an electric motor and a refrigeration compressor within a single package. However, this product had not been designed to realize the full features and benefits possible by combining an engine, motor/generator and compressor. The purpose of this project is to develop a new hybrid chiller that can (1) reduce end-user energy costs, (2) lower building peak electric load, (3) increase energy efficiency, and (4) provide standby power. This new hybrid product is designed to allow the engine to generate electricity or drive the chiller's compressor, based on the market price and conditions of the available energy sources. Building owners can minimize cooling costs by operating with natural gas or electricity, depending on time of day energy rates. In the event of a backout, the building owner could either operate the product as a synchronous generator set, thus providing standby power, or continue to operate a chiller to provide air conditioning with support of a small generator set to cover the chiller's electric auxiliary requirements. The ability to utilize the same piece of equipment as a hybrid gas/electric chiller or a standby generator greatly enhances its economic attractiveness and would substantially expand the opportunities for high efficiency cooling products.« less

Safety analysis report for packaging (onsite) steel drum

DOE Office of Scientific and Technical Information (OSTI.GOV)

McCormick, W.A.

This Safety Analysis Report for Packaging (SARP) provides the analyses and evaluations necessary to demonstrate that the steel drum packaging system meets the transportation safety requirements of HNF-PRO-154, Responsibilities and Procedures for all Hazardous Material Shipments, for an onsite packaging containing Type B quantities of solid and liquid radioactive materials. The basic component of the steel drum packaging system is the 208 L (55-gal) steel drum.

NASA, We Have a Challenge and It's Food Packaging

NASA Technical Reports Server (NTRS)

Perchonok, Michele

2014-01-01

Current Packaging: Freeze Dried Foods Packaging ? The thermoformed base is fabricated from Combitherm PAXX230 [a coextrusion of nylon/medium-density polyethylene (MDPE)/nylon/ethylene-vinyl alcohol (EVOH)/nylon/MDPE/linear low-density polyethylene (LLDPE)]. ? The lid is fabricated from Combitherm PAXX115 (a coextrusion of nylon/EVOH/nylon/LF adhesive/HV polyethylene/LLDPE) ? Natural form (Bite size) foods ? The bite-size food package is fabricated from Combitherm PAXX115, a coextrusion of nylon/EVOH/nylon/LF adhesive/HV polyethylene/LLDPE. ? Overwrap ? Packages are wrapped in a white pouch,.003-mm thick, fabricated from a laminate of polyester/polyethylene/aluminum foil/Surlyn®. This overwrap is removed before the food is prepared and heated. Requirements ? High barrier packaging - low oxygen and water vapor transmission rates ? No aluminum layer ? Mass - <145 grams per m2 ? Flexible ? Puncture resistant ? Approved for food use ? Amenable to sterilization ? Able to be heat sealed ? Preferred (not required) ? Transparent ? Retortable, microwavable, high pressure use. Small Business Innovative Research Program - 7 years ? 8 Phase I contracts ? 4 Phase II contracts ? Two workshops to bring together food packaging experts ? Three internal research tasks ? Public Outreach - average of 3 presentations/yr. for 8 years describing NASA's challenges ? Department of Defense Collaboration - Combat Feeding Program No significant improvement in food packaging capabilities after these efforts. It was unlikely that a food packaging solution could be found within the food science community ? There was a need to go outside to other industries such as pharmaceutical or electrical ? Although a positive result was preferred, a negative result would also be useful ? Two Innovation Techniques were used as a comparison ? InnoCentive - Theoretical Challenge to identify new technologies ? Yet2.com - A matchmaker between NASA and commercial packaging manufacturers

PACKAGE PLANTS FOR SMALL SYSTEMS: A FIELD STUDY

EPA Science Inventory

A joint field study was conducted by AWWA and the Drinking Water Research Division of USEPA to evaluate existing small community systems that use package plant technology. Forty-eight package plant systems representing a geographic and technological cross section were evaluated t...

Advanced Manufacturing Systems in Food Processing and Packaging Industry

NASA Astrophysics Data System (ADS)

Shafie Sani, Mohd; Aziz, Faieza Abdul

2013-06-01

In this paper, several advanced manufacturing systems in food processing and packaging industry are reviewed, including: biodegradable smart packaging and Nano composites, advanced automation control system consists of fieldbus technology, distributed control system and food safety inspection features. The main purpose of current technology in food processing and packaging industry is discussed due to major concern on efficiency of the plant process, productivity, quality, as well as safety. These application were chosen because they are robust, flexible, reconfigurable, preserve the quality of the food, and efficient.

Colour stability of bovine Longissimus and Psoas major muscle as affected by electrical stimulation and hot boning.

PubMed

van Laack, R L; Smulders, F J

1990-01-01

From eight electrically stimulated and eight non-stimulated cows the righthand-side longissimus and psoas major muscles were hot boned within 1 1 2 h post mortem, vacuum packaged and chilled and storred at 1±1°C. Immediately after slaughter, the lefthand carcass-sides were blast-chilled for 1 1 2 h and subsequently chilled at 1±1°C until the following day. After cold boning, the longissimus and psoas major muscle were packaged, chilled and stored as the hot boned muscles. After 12 days of storage, steaks, cut from the primals, were displayed at 1±1°C under continuous illumination (300-400 lx). Colour measurements after 0, 2 and 4 days of display revealed a significant (p<0·10) effect of time of boning on non-stimulated psoas major muscle (lower values for a (∗), b (∗) values, chroma and %R630-%R580). Significant effects of electrical stimulation were not observed. Changes in hue tended to be more pronounced when the meat had been stimulated. Changes in chroma were largest (p<0·10) is non-stimulated, hot boned psoas muscle. Analysis of variances showed that in the longissimus muscle significant effects (p<0·10) of time boning and electrical stimulation were present. The effect of time of boning was often influenced by the use of electrical stimulation. Changes in hue and chroma indicated that hot boned samples had a higher colour stability than cold boned controls, especially when the carcasses had not been stimulated electrically. The observed differences in colour stability were rather small in all treatment groups and are not expected to present any practical merchandising problem. Copyright © 1990. Published by Elsevier Ltd.

Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications

NASA Astrophysics Data System (ADS)

Jiang, Hongjin

SnPb solders have long been used as interconnect materials in microelectronic packaging. Due to the health threat of lead to human beings, the use of lead-free interconnect materials is imperative. Three kinds of lead-free interconnect materials are being investigated, namely lead-free metal solders (SnAg, SnAgCu, etc.), electrically conductive adhesives (ECAs) and carbon nanotubes (CNTs). However, there are still limitations for the full utilization of these lead-free interconnect materials in the microelectronic packaging, such as higher melting point of lead-free metal solders, lower electrical conductivity of the ECAs and poor adhesion of CNTs to substrates. This thesis is devoted to the research and development of low processing temperature lead-free interconnect materials for microelectronic packaging applications with an emphasis on fundamental studies of nanoparticles synthesis, dispersion and oxidation prevention, and nanocomposites fabrication. Oxide-free tin (Sn), tin/silver (96.5Sn3.5Ag) and tin/silver/copper (96.5Sn3.0Ag0.5Cu) alloy nanoparticles with different sizes were synthesized by a low temperature chemical reduction method. Both size dependent melting point and latent heat of fusion of the synthesized nanoparticles were obtained. The nano lead-free solder pastes/composites created by dispersing the SnAg or SnAgCu alloy nanoparticles into an acidic type flux spread and wet on the cleaned copper surface at 220 to 230°C. This study demonstrated the feasibility of nano sized SnAg or SnAgCu alloy particle pastes for low processing temperature lead-free interconnect applications in microelectronic packaging.

Low-Temperature Power Electronics Program

NASA Technical Reports Server (NTRS)

Patterson, Richard L.; Dickman, John E.; Hammoud, Ahmad; Gerber, Scott

1997-01-01

Many space and some terrestrial applications would benefit from the availability of low-temperature electronics. Exploration missions to the outer planets, Earth-orbiting and deep-space probes, and communications satellites are examples of space applications which operate in low-temperature environments. Space probes deployed near Pluto must operate in temperatures as low as -229 C. Figure 1 depicts the average temperature of a space probe warmed by the sun for various locations throughout the solar system. Terrestrial applications where components and systems must operate in low-temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation system, and arctic exploration. The development of electrical power systems capable of extremely low-temperature operation represents a key element of some advanced space power systems. The Low-Temperature Power Electronics Program at NASA Lewis Research Center focuses on the design, fabrication, and characterization of low-temperature power systems and the development of supporting technologies for low-temperature operations such as dielectric and insulating materials, power components, optoelectronic components, and packaging and integration of devices, components, and systems.

Feedstock recycling program gets go ahead

DOE Office of Scientific and Technical Information (OSTI.GOV)

Layman, P.

1994-03-28

Feedstock recycling--recycling mixed plastics wastes back into chemical feedstocks such as olefins and naphtha--has received a commercial go ahead in Germany. DKR--Deutsche Kunstsoff recycling, a subsidiary of a commercial company, Duales System Deutschland, responsible for recycling packaging wastes in Germany--has issued three contracts to companies with feedstock recycling technology to convert to liquid feedstocks a total of some 500,000 metric tons per year of mixed plastics packaging wastes by 1996. DKR has also pledged to discontinue exports of used plastics packaging to foreign countries by that date. The three contracts go to a consortium between BASF and OTTO Kunststoff service,more » of Dossenheim; the oil and chemical producer Veba; and the electric power utilities company RWE. DKR's current processing costs are about $1,765 per ton of wastes. That total includes all costs for collecting, sorting, cleaning, and transporting the wastes. In its bid, the BASF-OTTO consortium envisioned a fee of about $190 per ton. That fee, says Niess, was determined by looking at BASF's and OTTO's costs, offset by the savings in raw materials BASF would be making as its technology converts mixed plastics wastes to a mixture of naphtha, aromatics, and oils, all of which can be used in BASF's processes in Ludwigshafen. And because BASF's technology requires no presorting or cleaning before it gets the wastes, the process will trim DKR's costs significantly.« less

High Precision Piezoelectric Linear Motors for Operations at Cryogenic Temperatures and Vacuum

NASA Technical Reports Server (NTRS)

Wong, D.; Carman, G.; Stam, M.; Bar-Cohen, Y.; Sen, A.; Henry, P.; Bearman, G.; Moacanin, J.

1995-01-01

The Jet Propulsion Laboratory evaluated the use of an electromechanical device for optically positioning a mirror system during the pre-project phase of the Pluto-Fast-Flyby (PFF) mission. The device under consideration was a piezoelectric driven linear motor functionally dependent upon a time varying electric field which induces displacements ranging from submicrons to millimeters with positioning accuracy within nanometers. Using a control package, the mirror system provides image motion compensation and mosaicking capabilities. While this device offers unique advantages, there were concerns pertaining to its operational capabilities for the PFF mission. The issues include irradiation effects and thermal concerns. A literature study indicated that irradiation effects will not significantly impact the linear motor's operational characteristics. On the other hand, thermal concerns necessitated an in depth study.

Design and fabrication of the Brayton rotating unit

NASA Technical Reports Server (NTRS)

Davis, J. E.

1972-01-01

The Brayton rotating unit (BRU), operating on a gas bearing system, has been designed, fabricated, and demonstrated for use in a closed Brayton cycle space power conversion system. The BRU uses a binary mixture of xenon and helium (molecular weight, 83.8) as the cycle working fluid and bearing lubricating medium and was designed to produce from 2.25 to 10.5 kw sub e of 1200 Hz three-phase electrical power. The single-shaft rotating assembly operates at a design speed of 36,000 rpm and comprises a radial single-stage compressor, a four-pole Rice alternator rotor, and a radial inflow turbine. Four units, a dynamic simulator and three component research packages, were supplied to the NASA Lewis Research Center for performance testing and further development.

Electronic scanning pressure measuring system and transducer package

NASA Technical Reports Server (NTRS)

Coe, C. F. (Inventor); Parra, G. T.

1984-01-01

An electronic scanning pressure system that includes a plurality of pressure transducers is examined. A means obtains an electrical signal indicative of a pressure measurement from each of the plurality of pressure transducers. A multiplexing means is connected for selectivity supplying inputs from the plurality of pressure transducers to the signal obtaining means. A data bus connects the plurality of pressure transducers to the multiplexing means. A latch circuit is connected to supply control inputs to the multiplexing means. An address bus is connected to supply an address signal of a selected one of the plurality of pressure transducers to the latch circuit. In operation, each of the pressure transducers is successively scanned by the multiplexing means in response to address signals supplied on the address bus to the latch circuit.

System for NIS Forecasting Based on Ensembles Analysis

DOE Office of Scientific and Technical Information (OSTI.GOV)

2014-01-02

BMA-NIS is a package/library designed to be called by a script (e.g. Perl or Python). The software itself is written in the language of R. The software assists electric power delivery systems in planning resource availability and demand, based on historical data and current data variables. Net Interchange Schedule (NIS) is the algebraic sum of all energy scheduled to flow into or out of a balancing area during any interval. Accurate forecasts for NIS are important so that the Area Control Error (ACE) stays within an acceptable limit. To date, there are many approaches for forecasting NIS but all nonemore » of these are based on single models that can be sensitive to time of day and day of week effects.« less

Stirling Radioisotope Power System as an Alternative for NASAs Deep Space Missions

NASA Astrophysics Data System (ADS)

Shaltens, R. K.; Mason, L. S.; Schreiber, J. G.

2001-01-01

The NASA Glenn Research Center (GRC) and the Department of Energy (DOE) are developing a free-piston Stirling convertor for a Stirling Radioisotope Power System (SRPS) to provide on-board electric power for future NASA deep space missions. The SRPS currently being developed provides about 100 watts and reduces the amount of radioisotope fuel by a factor of four over conventional Radioisotope Thermoelectric Generators (RTG). The present SRPS design has a specific power of approximately 4 W/kg which is comparable to an RTG. GRC estimates for advanced versions of the SRPS with improved heat source integration, lightweight Stirling convertors, composite radiators, and chip-packaged controllers improves the specific mass to about 8 W/kg. Additional information is contained in the original extended abstract.

A new controller for battery-powered electric vehicles

NASA Technical Reports Server (NTRS)

Belsterling, C. A.; Stone, J.

1980-01-01

This paper describes the development, under a NASA/DOE contract, of a new concept for efficient and reliable control of battery-powered vehicles. It avoids the detrimental effects of pulsed-power controllers like the SCR 'chopper' by using rotating machines to meter continuous currents to the traction motor. The concept is validated in a proof-of-principle demonstration system and a complete vehicle is simulated on an analog computer. Test results show exceptional promise for a full-scale system. Optimum control strategies to minimize controller weight are developed by means of the simulated vehicle. The design for an Engineering Model is then prepared in the form of a practical, compact two-bearing package with forced air cooling. Predicted performance is outstanding, with controller efficiency of over 90% at high speed.

Performance of High-Speed PWM Control Chips at Cryogenic Temperatures

NASA Technical Reports Server (NTRS)

Elbuluk, Malik E.; Gerber, Scott; Hammoud, Ahmad; Patterson, Richard; Overton, Eric

2001-01-01

The operation of power electronic systems at cryogenic temperatures is anticipated in many NASA space missions such as planetary exploration and deep space probes. In addition to surviving the space hostile environment, electronics capable of low temperature operation would contribute to improving circuit performance, increasing system efficiency, and reducing development and launch costs. As part of the NASA Glenn Low Temperature Electronics Program, several commercial high-speed Pulse Width Modulation (PWM) chips have been characterized in terms of their performance as a function of temperature in the range of 25 to -196 C (liquid nitrogen). These chips ranged in their electrical characteristics, modes of control, packaging options, and applications. The experimental procedures along with the experimental data obtained on the investigated chips are presented and discussed.

Alumina Based 500 C Electronic Packaging Systems and Future Development

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2012-01-01

NASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.

Tractor Mechanics: Maintaining and Servicing the Fuel System. Learning Activity Packages 20-33.

ERIC Educational Resources Information Center

Clemson Univ., SC. Vocational Education Media Center.

Learning activity packages are presented for instruction in tractor mechanics. The packages deal with the duties involved in maintaining the fuel system. The following fourteen learning activity packages are included: servicing fuel and air filters, servicing fuel tanks and lines, adjusting a carburetor, servicing a carburetor, servicing the…

General specifications for the development of a USL NASA PC R and D statistical analysis support package

NASA Technical Reports Server (NTRS)

Dominick, Wayne D. (Editor); Bassari, Jinous; Triantafyllopoulos, Spiros

1984-01-01

The University of Southwestern Louisiana (USL) NASA PC R and D statistical analysis support package is designed to be a three-level package to allow statistical analysis for a variety of applications within the USL Data Base Management System (DBMS) contract work. The design addresses usage of the statistical facilities as a library package, as an interactive statistical analysis system, and as a batch processing package.

System-level integration of active silicon photonic biosensors

NASA Astrophysics Data System (ADS)

Laplatine, L.; Al'Mrayat, O.; Luan, E.; Fang, C.; Rezaiezadeh, S.; Ratner, D. M.; Cheung, K.; Dattner, Y.; Chrostowski, L.

2017-02-01

Biosensors based on silicon photonic integrated circuits have attracted a growing interest in recent years. The use of sub-micron silicon waveguides to propagate near-infrared light allows for the drastic reduction of the optical system size, while increasing its complexity and sensitivity. Using silicon as the propagating medium also leverages the fabrication capabilities of CMOS foundries, which offer low-cost mass production. Researchers have deeply investigated photonic sensor devices, such as ring resonators, interferometers and photonic crystals, but the practical integration of silicon photonic biochips as part of a complete system has received less attention. Herein, we present a practical system-level architecture which can be employed to integrate the aforementioned photonic biosensors. We describe a system based on 1 mm2 dies that integrate germanium photodetectors and a single light coupling device. The die are embedded into a 16x16 mm2 epoxy package to enable microfluidic and electrical integration. First, we demonstrate a simple process to mimic Fan-Out Wafer-level-Packaging, which enables low-cost mass production. We then characterize the photodetectors in the photovoltaic mode, which exhibit high sensitivity at low optical power. Finally, we present a new grating coupler concept to relax the lateral alignment tolerance down to +/- 50 μm at 1-dB (80%) power penalty, which should permit non-experts to use the biochips in a"plug-and-play" style. The system-level integration demonstrated in this study paves the way towards the mass production of low-cost and highly sensitive biosensors, and can facilitate their wide adoption for biomedical and agro-environmental applications.

The electrical ground support equipment for the ExoMars 2016 DREAMS scientific instrument

NASA Astrophysics Data System (ADS)

Molfese, C.; Schipani, P.; Marty, L.; Esposito, F.; D'Orsi, S.; Mannetta, M.; Debei, S.; Bettanini, C.; Aboudan, A.; Colombatti, G.; Mugnuolo, R.; Marchetti, E.; Pirrotta, S.

2014-08-01

This paper describes the Electrical Ground Support Equipment (EGSE) of the Dust characterization, Risk assessment, and Environment Analyser on the Martian Surface (DREAMS) scientific instrument, an autonomous surface payload package to be accommodated on the Entry, Descendent and landing Module (EDM) of the ExoMars 2016 European Space Agency (ESA) mission. DREAMS will perform several kinds of measurements, such as the solar irradiance with different optical detectors in the UVA band (315-400nm), NIR band (700-1100nm) and in "total luminosity" (200 -1100 nm). It will also measure environmental parameters such as the intensity of the electric field, temperature, pressure, humidity, speed and direction of the wind. The EGSE is built to control the instrument and manage the data acquisition before the integration of DREAMS within the Entry, Descendent and landing Module (EDM) and then to retrieve data from the EDM Central Checkout System (CCS), after the integration. Finally it will support also the data management during mission operations. The EGSE is based on commercial off-the-shelf components and runs custom software. It provides power supply and simulates the spacecraft, allowing the exchange of commands and telemetry according to the protocol defined by the spacecraft prime contractor. This paper describes the architecture of the system, as well as its functionalities to test the DREAMS instrument during all development activities before the ExoMars 2016 launch.

A Year in the Life of the NASA Electronic Parts and Packaging (NEPP) Program

NASA Technical Reports Server (NTRS)

Label, Kenneth A.

2017-01-01

NEPP Mission Statement: Provide NASAs leadership for developing and maintaining guidance for the screening, qualification, test, and reliable usage of electrical, electronic, and electromechanical (EEE) parts by NASA, in collaboration with other government Agencies and industry.

NREL in the News | Transportation Research | NREL

Science.gov Websites

Promises Power Electronics Innovation Wide bandgap (WBG) technology promises to dramatically increase performance, reduce cost, and improve reliability of electronics packaging in electric-drive vehicles and Department's new Manufacturing Innovation Institute for Next Generation Power Electronics to accelerate

Intelligent structures technology

NASA Astrophysics Data System (ADS)

Crawley, Edward F.

1991-07-01

Viewgraphs on intelligent structures technology are presented. Topics covered include: embedding electronics; electrical and mechanical compatibility; integrated circuit chip packaged for embedding; embedding devices within composite structures; test of embedded circuit in G/E coupon; temperature/humidity/bias test; single-chip microcomputer control experiment; and structural shape determination.

Intelligent structures technology

NASA Technical Reports Server (NTRS)

Crawley, Edward F.

1991-01-01

Viewgraphs on intelligent structures technology are presented. Topics covered include: embedding electronics; electrical and mechanical compatibility; integrated circuit chip packaged for embedding; embedding devices within composite structures; test of embedded circuit in G/E coupon; temperature/humidity/bias test; single-chip microcomputer control experiment; and structural shape determination.

Diamond-based heat spreaders for power electronic packaging applications

NASA Astrophysics Data System (ADS)

Guillemet, Thomas

As any semiconductor-based devices, power electronic packages are driven by the constant increase of operating speed (higher frequency), integration level (higher power), and decrease in feature size (higher packing density). Although research and innovation efforts have kept these trends continuous for now more than fifty years, the electronic packaging technology is currently facing a challenge that must be addressed in order to move toward any further improvements in terms of performances or miniaturization: thermal management. Thermal issues in high-power packages strongly affect their reliability and lifetime and have now become one of the major limiting factors of power modules development. Thus, there is a strong need for materials that can sustain higher heat flux levels while safely integrating into the electronic package architecture. In such context, diamond is an attractive candidate because of its outstanding thermal conductivity, low thermal expansion, and high electrical resistivity. Its low heat capacity relative to metals such as aluminum or copper makes it however preferable for heat spreading applications (as a heat-spreader) rather than for dissipating the heat flux itself (as a heat sink). In this study, a dual diamond-based heat-spreading solution is proposed. Polycrystalline diamond films were grown through laser-assisted combustion synthesis on electronic substrates (in the U.S) while, in parallel, diamond-reinforced copper-matrix composite films were fabricated through tape casting and hot pressing (in France). These two types of diamond-based heat-spreading films were characterized and their microstructure and chemical composition were related to their thermal performances. Particular emphasize was put on the influence of interfaces on the thermal properties of the materials, either inside a single material (grain boundaries) or between dissimilar materials (film/substrate interface, matrix/reinforcement interface). Finally, the packaging potential of the two heat-spreading solutions invoked was evaluated. This study was carried out within the framework of a French-American collaboration between the Electrical Engineering department of the University of Nebraska-Lincoln (United States, U.S.) and the Institute of Condensed Matter Chemistry of the University of Bordeaux (France). This study was financed by the Office of Naval Research in the U.S., and by the Region Aquitaine in France.

Indoor unit for electric heat pump

DOEpatents

Draper, Robert; Lackey, Robert S.; Fagan, Jr., Thomas J.; Veyo, Stephen E.; Humphrey, Joseph R.

1984-01-01

An indoor unit for an electric heat pump is provided in modular form including a refrigeration module 10, an air mover module 12, and a resistance heat package module 14, the refrigeration module including all of the indoor refrigerant circuit components including the compressor 36 in a space adjacent the heat exchanger 28, the modules being adapted to be connected to air flow communication in several different ways as shown in FIGS. 4-7 to accommodate placement of the unit in various orientations.

Development of a qualification standard for adhesives used in hybrid microcircuits

NASA Technical Reports Server (NTRS)

Licari, J. J.; Weigand, B. L.; Soykin, C. A.

1981-01-01

Improved qualification standards and test procedures for adhesives used in microelectronic packaging are developed. The test methods in specification for the Selection and Use of Organic Adhesives in Hybrid Microcircuits are reevaluated versus industry and government requirements. Four electrically insulative and four electrically conductive adhesives used in the assembly of hybrid microcircuits are selected to evaluate the proposed revised test methods. An estimate of the cost to perform qualification testing of an adhesive to the requirements of the revised specification is also prepared.

User's manual for the coupled rotor/airframe vibration analysis graphic package

NASA Technical Reports Server (NTRS)

Studwell, R. E.

1982-01-01

User instructions for a graphics package for coupled rotor/airframe vibration analysis are presented. Responses to plot package messages which the user must make to activate plot package operations and options are described. Installation instructions required to set up the program on the CDC system are included. The plot package overlay structure and subroutines which have to be modified for the CDC system are also described. Operating instructions for CDC applications are included.

Depolarization current relaxation process of insulating dielectrics after corona poling under different charging conditions

NASA Astrophysics Data System (ADS)

Zhang, J. W.; Zhou, T. C.; Wang, J. X.; Yang, X. F.; Zhu, F.; Tian, L. M.; Liu, R. T.

2017-10-01

As an insulating dielectric, polyimide is favorable for the application of optoelectronics, electrical insulation system in electric power industry, insulating, and packaging materials in space aircraft, due to its excellent thermal, mechanical and electrical insulating stability. The charge storage profile of such insulating dielectric is utmost important to its application, when it is exposed to electron irradiation, high voltage corona discharge or other treatments. These treatments could induce changes in physical and chemical properties of treated samples. To investigate the charge storage mechanism of the insulating dielectrics after high-voltage corona discharge, the relaxation processes responsible for corona charged polyimide films under different poling conditions were analyzed by the Thermally Stimulated Discharge Currents method (TSDC). In the results of thermal relaxation process, the appearance of various peaks in TSDC spectra provided a deep insight into the molecular status in the dielectric material and reflected stored space charge relaxation process in the insulating polymers after corona discharge treatments. Furthermore, the different space charge distribution status under various poling temperature and different discharge voltage level were also investigated, which could partly reflect the influence of the ambiance condition on the functional dielectrics after corona poling.

Paperless Work Package Application

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kilgore, Jr., William R.; Morrell, Jr., Otto K.; Morrison, Dan

2014-07-31

Paperless Work Package (PWP) System is a computer program process that takes information from Asset Suite, provides a platform for other electronic inputs, Processes the inputs into an electronic package that can be downloaded onto an electronic work tablet or laptop computer, provides a platform for electronic inputs into the work tablet, and then transposes those inputs back into Asset Suite and to permanent SRS records. The PWP System will basically eliminate paper requirements from the maintenance work control system. The program electronically relays the instructions given by the planner to work on a piece of equipment which is currentlymore » relayed via a printed work package. The program does not control/approve what is done. The planner will continue to plan the work package, the package will continue to be routed, approved, and scheduled. The supervisor reviews and approves the work to be performed and assigns work to individuals or to a work group. (The supervisor conducts pre job briefings with the workers involved in the job) The Operations Manager (Work Controlling Entity) approves the work package electronically for the work that will be done in his facility prior to work starting. The PWP System will provide the package in an electronic form. All the reviews, approvals, and safety measures taken by people outside the electronic package does not change from the paper driven work packages.« less

Management of packaging waste in Poland--development agenda and accession to the EU.

PubMed

Grodzińska-Jurczak, Małgorzata; Zakowska, Hanna; Read, Adam

2004-06-01

In recent years the issue of the municipal waste in Poland has become increasingly topical, with a considerable rise in the waste generation, much of which can be attributed to a boom in product packaging (mainly plastic). The annual production of plastics packaging has been constantly increasing over the last 20 to 30 years, and now exceeds 3.7 million tons. Due to a lack of processing technologies and poorly developed selective segregation system, packaging waste is still treated as a part of the municipal solid waste (MSW) stream, most of which is landfilled. As a result of Poland's access to the European Union, previous legal regulations governing municipal waste management have been harmonized with those binding on the member countries. One of the main changes, the most revolutionary one, is to make entrepreneurs liable for environmental risks resulting from the introduction of packaging to the market, and for its recycling. In practice, all entrepreneurs are to ensure recovery, and recycling, of used packaging from products introduced to the market at the required level. In recent year, the required recycling levels were fulfilled for all types of materials but mainly by large institutions using grouped and transport packaging waste for that matter. Household packaging gathered in the selective segregation system at the municipalities was practically left alone. This paper is an attempt to describe the system and assess the first year of functioning of the new, revamped system of packaging waste management in Poland. Recommendations are made relating to those features that need to be included in packaging waste management systems in order to maximize their sustainability and harmonization with the EU legal system.

The Primordial Inflation Polarization ExploreR Continuous Adiabatic Demagnetization Refrigerator

NASA Astrophysics Data System (ADS)

Pawlyk, Samuel; Ade, Peter; Benford, Dominic; Bennett, Charles; Chuss, David; Datta, Rahul; Dotson, Jessie; Essinger-Hileman, Thomas; Fixsen, Dale; Halpern, Mark; Hilton, Gene; Hinshaw, Gary; Irwin, Kent; Jhabvala, Christine; Kimball, Mark; Kogut, Al; Lowe, Luke; McMahon, Jeff; Miller, Timothy; Mirel, Paul; Moseley, Samuel Harvey; Rodriguez, Samelys; Sharp, Elmer; Shirron, Peter; Staguhn, Johannes G.; Sullivan, Dan; Switzer, Eric; Taraschi, Peter; Tucker, Carole; Wollack, Edward; Walts, Alexander

2018-01-01

The Primordial Inflation Polarization ExploreR (PIPER) uses a Continuous Adiabatic Demagnetization Refrigerator (CADR) to cool its detectors. The CADR consists of four independent stages with adjacent stages connected by gas gap (GG) or superconducting (SC) heat switches. The three warm stages cycle to transfer heat from the 100 mK detector package to the 1.5 K liquid helium bath. The coldest stage maintains a continuous temperature of 100 mK for the detector package with 10 uW cooling power. We describe the mechanical, electrical, and software design of the CADR and present recent results.

Scalable, Economical Fabrication Processes for Ultra-Compact Warm-White LEDs

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lowes, Ted

Conventional warm-white LED component fabrication consists of a large number of sequential steps which are required to incorporate electrical, mechanical, and optical functionality into the component. Each of these steps presents cost and yield challenges which multiply throughout the entire process. Although there has been significant progress in LED fabrication over the last decade, significant advances are needed to enable further reductions in cost per lumen while not sacrificing efficacy or color quality. Cree conducted a focused 18-month program to develop a new low-cost, high-efficiency light emitting diode (LED) architecture enabled by novel large-area parallel processing technologies, reduced number ofmore » fabrication steps, and minimized raw materials use. This new scheme is expected to enable ultra-compact LED components exhibiting simultaneously high efficacy and high color quality. By the end of the program, Cree fabricated warm-white LEDs with a room-temperature “instant on” efficacy of >135 lm/W at ~3500K and 90 CRI (when driven at the DOE baseline current density of 35 A/cm2). Cree modified the conventional LED fabrication process flow in a manner that is expected to translate into simultaneously high throughput and yield for ultra-compact packages. Building on its deep expertise in LED wafer fabrication, Cree developed these ultra-compact LEDs to have no compromises in color quality or efficacy compared to their conventional counterparts. Despite their very small size, the LEDs will also be robustly electrically integrated into luminaire systems with the same attach yield as conventional packages. The versatility of the prototype high-efficacy LED architecture will likely benefit solid-state lighting (SSL) luminaire platforms ranging from bulbs to troffers. We anticipate that the prototype LEDs will particularly benefit luminaires with large numbers of distributed compact packages, such as linear and area luminaires (e.g. troffers). The fraction of total SSL luminaire cost made up by the LEDs themselves has steadily fallen over the past several years, but can still make up 30% or more of the bill of materials; the new LED design will radically lower this proportion. Ultra-compact, highly efficient LEDs with optimal distribution in the system will further benefit luminaire materials and assembly costs by reducing the complexity and volume of thermal management and optical subsystems.« less

Sterilization of medical equipment and contaminated articles by making use of a resistive barrier discharge

NASA Astrophysics Data System (ADS)

Uhm, Han S.; Kang, Jung G.; Choi, Eun H.; Cho, Guang S.

2012-08-01

Presented here is an apparatus consisting of an atmospheric resistive-barrier discharge for the sterilization of medical tools wrapped in typical hospital cloths, for the sterilization of manufactured drugs in typical packaging materials, and for the sterilization of biologically-contaminated articles. The sterilization apparatus consists of layers of the resistive-barrier discharge device operating at room temperature, a sterilization chamber, and an ozone destruction device. An electrical discharge in the resistive-barrier discharge system generates an atmospheric plasma in oxygen gas, generating ozone, which in turn efficiently sterilizes medical tools and biologically contaminated articles at room temperature. A sterilization experiment was carried out at an apparatus volume of 100 liters, with a sterilization chamber volume of 60 liters, and a discharge device volume of 40 liters. The sterilization in this experiment required 60 W of power for 5 hours of residence time. For a given sterilization time, the required electrical power was proportional to the apparatus volume. Ozone in the sterilization chamber was destroyed safely after sterilization.

Inactivation of Aspergillus flavus spores in a sealed package by cold plasma streamers

NASA Astrophysics Data System (ADS)

Sohbatzadeh, F.; Mirzanejhad, S.; Shokri, H.; Nikpour, M.

2016-06-01

The main objective of this study is to investigate the inactivation efficacy of cold streamers in a sealed package on pathogenic fungi Aspergillus flavus ( A. flavus) spores that artificially contaminated pistachio surface. To produce penetrating cold streamers, electric power supply was adapted to deposit adequate power into the package. The plasma streamers were generated by an alternating high voltage with carrier frequency of 12.5 kHz which was suppressed by a modulated pulsed signal at frequency of 110 Hz. The plasma exposition time was varied from 8 to 18 min to show the effect of the plasma treatment on fungal clearance while the electrode and sample remained at room temperature. This proved a positive effect of the cold streamers treatment on fungal clearance. Benefits of deactivation of fungal spores by streamers inside the package include no heating, short treatment time and adaptability to existing processes. Given its ability to ensure the safety and longevity of food products, this technology has great potential for utilization in food packaging and processing industry. In this study, moisture and pH changes of pistachio samples after plasma streamers treatment were also investigated.

Chip-scale thermal management of high-brightness LED packages

NASA Astrophysics Data System (ADS)

Arik, Mehmet; Weaver, Stanton

2004-10-01

The efficiency and reliability of the solid-state lighting devices strongly depend on successful thermal management. Light emitting diodes, LEDs, are a strong candidate for the next generation, general illumination applications. LEDs are making great strides in terms of lumen performance and reliability, however the barrier to widespread use in general illumination still remains the cost or $/Lumen. LED packaging designers are pushing the LED performance to its limits. This is resulting in increased drive currents, and thus the need for lower thermal resistance packaging designs. As the power density continues to rise, the integrity of the package electrical and thermal interconnect becomes extremely important. Experimental results with high brightness LED packages show that chip attachment defects can cause significant thermal gradients across the LED chips leading to premature failures. A numerical study was also carried out with parametric models to understand the chip active layer temperature profile variation due to the bump defects. Finite element techniques were utilized to evaluate the effects of localized hot spots at the chip active layer. The importance of "zero defects" in one of the more popular interconnect schemes; the "epi down" soldered flip chip configuration is investigated and demonstrated.

Public policy for solar heating and cooling

NASA Technical Reports Server (NTRS)

Hirshberg, A. S.

1976-01-01

Recent analyses indicated that solar heating and cooling systems for residential buildings are nearly economically competitive with conventional fossil fuel or electric systems, the former having higher initial cost but a lower operating cost than the latter. The paper examines obstacles to the widespread acceptance and use of solar space conditioning systems and explores some general policies which could help to overcome them. The discussion covers such institutional barriers limiting the adoption of solar technologies as existing building codes, financing constraints, and organizational structure of the building industry. The potential impact of financial incentives is analyzed. It is noted that a tax incentive of 25% could speed the use of solar energy by 7 to 8 years and produce an 8% reduction in fossil fuel use by 1990. A preliminary incentive package which could be helpful in promoting solar energy both at federal and state levels is proposed, and the necessary incentive level is analysed.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Paget, Maria L.; McCullough, Jeffrey J.; Steward, Heidi E.

Solid-state lighting products for general lighting applications are now gaining a market presence, and more and more people are asking, “Which of these are ‘good’ products? Do they perform as claimed? How do they compare? Light Emitting Diodes (LEDs) differ from other light sources enough to require new procedures for measuring their performance and comparing to other lighting options, so both manufacturers and buyers are facing a learning curve. The energy-efficiency community has traditionally compared light sources based on system efficacy: rated lamp lumens divided by power into the system. This doesn’t work for LEDs because there are no standardmore » LED “lamp” packages and no lamp ratings, and because LED performance depends heavily on thermal, electrical, and optical design of complete lighting unit or ‘luminaire’. Luminaire efficacy is the preferred metric for LEDs because it measures the net light output from the luminaire divided by power into the system.« less

Flight experiment of thermal energy storage. [for spacecraft power systems

NASA Technical Reports Server (NTRS)

Namkoong, David

1989-01-01

Thermal energy storage (TES) enables a solar dynamic system to deliver constant electric power through periods of sun and shade. Brayton and Stirling power systems under current considerations for missions in the near future require working fluid temperatures in the 1100 to 1300+ K range. TES materials that meet these requirements fall into the fluoride family of salts. Salts shrink as they solidify, a change reaching 30 percent for some salts. Hot spots can develop in the TES container or the container can become distorted if the melting salt cannot expand elsewhere. Analysis of the transient, two-phase phenomenon is being incorporated into a three-dimensional computer code. The objective of the flight program is to verify the predictions of the code, particularly of the void location and its effect on containment temperature. The four experimental packages comprising the program will be the first tests of melting and freezing conducted under microgravity.

Engineering of the LISA Pathfinder mission—making the experiment a practical reality

NASA Astrophysics Data System (ADS)

Warren, Carl; Dunbar, Neil; Backler, Mike

2009-05-01

LISA Pathfinder represents a unique challenge in the development of scientific spacecraft—not only is the LISA Test Package (LTP) payload a complex integrated development, placing stringent requirements on its developers and the spacecraft, but the payload also acts as the core sensor and actuator for the spacecraft, making the tasks of control design, software development and system verification unusually difficult. The micro-propulsion system which provides the remaining actuation also presents substantial development and verification challenges. As the mission approaches the system critical design review, flight hardware is completing verification and the process of verification using software and hardware simulators and test benches is underway. Preparation for operations has started, but critical milestones for LTP and field effect electric propulsion (FEEP) lie ahead. This paper summarizes the status of the present development and outlines the key challenges that must be overcome on the way to launch.

Evaluation of 2004 Toyota Prius Hybrid Electric Drive System

DOE Office of Scientific and Technical Information (OSTI.GOV)

Staunton, R. H.; Ayers, C. W.; Marlino, L. D.

2006-05-01

The 2004 Toyota Prius is a hybrid automobile equipped with a gasoline engine and a battery- and generator-powered electric motor. Both of these motive-power sources are capable of providing mechanical-drive power for the vehicle. The engine can deliver a peak-power output of 57 kilowatts (kW) at 5000 revolutions per minute (rpm) while the motor can deliver a peak-power output of 50 kW over the speed range of 1200–1540 rpm. Together, this engine-motor combination has a specified peak-power output of 82 kW at a vehicle speed of 85 kilometers per hour (km/h). In operation, the 2004 Prius exhibits superior fuel economymore » compared to conventionally powered automobiles. To acquire knowledge and thereby improve understanding of the propulsion technology used in the 2004 Prius, a full range of design characterization studies were conducted to evaluate the electrical and mechanical characteristics of the 2004 Prius and its hybrid electric drive system. These characterization studies included (1) a design review, (2) a packaging and fabrication assessment, (3) bench-top electrical tests, (4) back-electromotive force (emf) and locked rotor tests, (5) loss tests, (6) thermal tests at elevated temperatures, and most recently (7) full-design-range performance testing in a controlled laboratory environment. This final test effectively mapped the electrical and thermal results for motor/inverter operation over the full range of speeds and shaft loads that these assemblies are designed for in the Prius vehicle operations. This testing was undertaken by the Oak Ridge National Laboratory (ORNL) as part of the U.S. Department of Energy (DOE) – Energy Efficiency and Renewable Energy (EERE) FreedomCAR and Vehicle Technologies (FCVT) program through its vehicle systems technologies subprogram. The thermal tests at elevated temperatures were conducted late in 2004, and this report does not discuss this testing in detail. The thermal tests explored the derating of the Prius motor design if operated at temperatures as high as is normally encountered in a vehicle engine. The continuous ratings at base speed (1200 rpm) with different coolant temperatures are projected from test data at 900 rpm. A separate, comprehensive report on this thermal control study is available. This report summarizes vehicle-level and subsystem-level test results obtained for the 2004 Prius and various electrical and mechanical subassemblies of its hybrid electric drive system. The primary objective of these tests was to (1) characterize the electrical and mechanical performance of the 2004 Prius, and (2) map the performance of the inverter/motor system over the full design speed and load ranges.« less

Wearable and flexible thermoelectric generator with enhanced package

NASA Astrophysics Data System (ADS)

Francioso, L.; De Pascali, C.; Taurino, A.; Siciliano, P.; De Risi, A.

2013-05-01

Present work shows recent progresses in thin film-based flexible and wearable thermoelectric generator (TEG), finalized to support energy scavenging and local storage for low consumption electronics in Ambient Assisted Living (AAL) applications and buildings integration. The proposed TEG is able to recover energy from heat dispersed into the environment converting a thermal gradient to an effective electrical energy available to power ultra-low consumption devices. A low cost fabrication process based on planar thin-film technology was optimized to scale down the TEG dimensions to micrometer range. The prototype integrates 2778 thermocouples of sputtered Sb2Te3 and Bi2Te3 thin films (1 μm thick) on an area of 25 cm2. The electrical properties of thermoelectric materials were investigated by Van der Pauw measurements. Transfer Length Method (TLM) analysis was performed on three different multi-layer contact schemes in order to select the best solution to use for the definition of the contact pads realized on each section of the thermoelectric array configuration to allow electrical testing of single production areas. Kapton polyimide film was used as flexible substrate in order to add comfortable lightweight and better wearability to the device. The realized TEG is able to autonomously recover the thermal gradient useful to thermoelectric generation thanks to an appropriate package designed and optimized by a thermal analysis based on finite element method (FEM). The proposed package solution consists in coupling the module realized onto Kapton foil to a PDMS layer opportunely molded to thermally insulate TEG cold junctions and enhance the thermal gradient useful for the energy scavenging. Simulations results were compared to experimental tests performed by a thermal infrared camera, in order to evaluate the real performance of the designed package. First tests conducted on the realized TEG indicate that the prototype is able to recover about 5°C between hot and cold thermocouples junctions with a thermal difference of 17°C initially available between body skin and environment, generating about 2 V of open circuit output voltage.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bradbury, Andrew M.

The invention relates to a novel phagemid display system for packaging phagemid DNA into phagemid particles which completely avoids the use of helper phage. The system of the invention incorporates the use of bacterial packaging cell lines which have been transformed with helper plasmids containing all required phage proteins but not the packaging signals. The absence of packaging signals in these helper plasmids prevents their DNA from being packaged in the bacterial cell, which provides a number of significant advantages over the use of both standard and modified helper phage. Packaged phagemids expressing a protein or peptide of interest, inmore » fusion with a phage coat protein such as g3p, are generated simply by transfecting phagemid into the packaging cell line.« less

Performance Stability of Silicone Oxide-Coated Plastic Parenteral Vials.

PubMed

Weikart, Christopher M; Pantano, Carlo G; Shallenberger, Jeff R

2017-01-01

A new packaging system was developed for parenteral pharmaceuticals that combines the best attributes of plastic and glass without their respective drawbacks. This technological advancement is based on the synergy between high-precision injection-molded plastics and plasma coating technology. The result is a shatter-resistant, optically clear, low-particulate, and chemically durable packaging system. The demand for this product is driven by the expanding market, regulatory constraints, and product recalls for injectable drugs and biologics packaged in traditional glass materials. It is shown that this new packaging system meets or exceeds the important performance characteristics of glass, especially in eliminating the glass delamination and breakage that has been observed in many products. The new packaging system is an engineered, multilayer, glass-coated plastic composite that provides a chemically stable contact surface and oxygen barrier performance that exceeds a 2 year shelf life requirement. Evaluation of the coating system characteristics and performance stability to chemical, temperature, and mechanical extremes are reported herein. LAY ABSTRACT: A new packaging system for parenteral pharmaceuticals was developed that combines the best attributes of plastic and glass without their respective drawbacks. This technological advancement is based on the synergy between high-precision injection-molded plastics and plasma coating technology. The result is a shatter-resistant, optically clear, low-particulate, and chemically durable packaging system. It is shown that this new packaging system meets or exceeds the important performance characteristics of glass, especially in eliminating the glass delamination and breakage that has been observed in many products. The new packaging system is an engineered, multilayer, glass-coated plastic composite that provides a chemically stable contact surface and oxygen barrier performance that exceeds a 2 year shelf life requirement. Evaluation of the coating system characteristics and performance stability to chemical, temperature, and mechanical extremes are reported herein. © PDA, Inc. 2017.

NASA Electronic Parts and Packaging (NEPP) - A NASA Office of Safety and Mission Assurance (OSMA) Program

NASA Technical Reports Server (NTRS)

Label, Kenneth A.

2017-01-01

NEPP Mission Statement: Provide NASA's leadership for developing and maintaining guidance for the screening, qualification, test, and reliable usage of electrical, electronic, and electromechanical (EEE) parts by NASA, in collaboration with other government Agencies and industry.

GRAPHIC INPUT TABLETS FOR PROGRAMMED INSTRUCTION.

ERIC Educational Resources Information Center

BOOKER, C.A., JR.; AND OTHERS

TO FACILITATE STUDENT-COMPUTER COMMUNICATION IN PROGRAMED INSTRUCTION, A MODIFICATION OF THE RAND TABLET, WHICH CONVERTS POSITION INFORMATION INTO ELECTRICAL SIGNALS, IS PROPOSED. MANUFACTURE OF THE DEVICE WOULD BE MORE ECONOMICAL, AND THE ELECTRONICS PACKAGE, REDESIGNED WITH INTEGRATED CIRCUITS, WOULD BE SMALLER AND MORE FLEXIBLE. MODIFICATION OF…

Forging Ahead

ERIC Educational Resources Information Center

Finkel, Ed

2017-01-01

Community colleges always have played an integral role in training workers for infrastructure- and transportation-related fields like truck driving, construction, welding and electrical work. If the $1 trillion infrastructure package proposed by President Donald Trump comes to pass, these fields will grow significantly, at least for a while, which…

47. VIEW TO WEST; SOUTH END OF MBE BUILDING, FIRST ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

47. VIEW TO WEST; SOUTH END OF MBE BUILDING, FIRST FLOOR; FORMER PACKAGE HANDLING AREA ADJACENT TO FORMER PACIFIC ELECTRIC RAILWAY TERMINAL (Andersen) - Los Angeles Union Passenger Terminal, Mail, Baggage, & Express Building, 800 North Alameda Street, Los Angeles, Los Angeles County, CA

Parallel interconnect for a novel system approach to short distance high information transfer data links

NASA Astrophysics Data System (ADS)

Raskin, Glenn; Lebby, Michael S.; Carney, F.; Kazakia, M.; Schwartz, Daniel B.; Gaw, Craig A.

1997-04-01

The OPTOBUSTM family of products provides for high performance parallel interconnection utilizing optical links in a 10-bit wide bi-directional configuration. The link is architected to be 'transparent' in that it is totally asynchronous and dc coupled so that it can be treated as a perfect cable with extremely low skew and no losses. An optical link consists of two identical transceiver modules and a pair of connectorized 62.5 micrometer multi mode fiber ribbon cables. The OPTOBUSTM I link provides bi- directional functionality at 4 Gbps (400 Mbps per channel), while the OPTOBUSTM II link will offer the same capability at 8 Gbps (800 Mbps per channel). The transparent structure of the OPTOBUSTM links allow for an arbitrary data stream regardless of its structure. Both the OPTOBUSTM I and OPTOBUSTM II transceiver modules are packaged as partially populated 14 by 14 pin grid arrays (PGA) with optical receptacles on one side of the module. The modules themselves are composed of several elements; including passives, integrated circuits optoelectronic devices and optical interface units (OIUs) (which consist of polymer waveguides and a specially designed lead frame). The initial offering of the modules electrical interface utilizes differential CML. The CML line driver sinks 5 mA of current into one of two pins. When terminated with 50 ohm pull-up resistors tied to a voltage between VCC and VCC-2, the result is a differential swing of plus or minus 250 mV, capable of driving standard PECL I/Os. Future offerings of the OPTOBUSTM links will incorporate LVDS and PECL interfaces as well as CML. The integrated circuits are silicon based. For OPTOBUSTM I links, a 1.5 micrometer drawn emitter NPN bipolar process is used for the receiver and an enhanced 0.8 micrometer CMOS process for the laser driver. For OPTOBUSTM II links, a 0.8 micrometer drawn emitter NPN bipolar process is used for the receiver and the driver IC utilizes 0.8 micrometer BiCMOS technology. The OPTOBUSTM architecture uses AlGaAs vertical cavity surface emitting lasers (VCSELs) at 850 nm in conjunction with unique opto-electronic packaging concepts. Most laser based transmitter subsystems are incapable of carrying an arbitrary NRZ data stream at high data rates. The receiver subsystem utilizes a conventional GaAs PIN photo-detector. In parallel interconnect systems. The design must take into account the simultaneous switching noise from the neighboring systems. If not well controlled, the high density of the multiple interconnects can limit the sensitivity and therefore the performance of the system. The packaging approach of the VCSEL and PIN arrays allow for high bandwidths and provide the coupling mechanisms necessary to interface to the 62.5 micrometer multi mode fiber. To allow for extremely high electrical signals the OPTOBUSTM package utilizes a multilayer tape automated bonded (TAB) lead frame. The lead frame contains separate signal and ground layers. The ground layer successfully provides for a pseudo-coaxial environment (low inductance and effective signal coupling to the ground plane).

Development of tube-packaged FBG strain sensor and application in the vibration experiment of submarine pipeline model

NASA Astrophysics Data System (ADS)

Ren, Liang; Li, Hong-Nan; Sun, Li; Li, Dong-Sheng

2005-05-01

Optical fiber sensors have received increasing attention in the fields of aeronautic and civil engineering for their superior ability of explosion proof, immunity to electromagnetic interference and high accuracy, especially fitting for measurement applications in harsh environment. In this paper, a novel FBG (fiber Bragg grating) strain sensor, which was packaged in a 1.2mm stainless steel tube by epoxy resin, was developed. Experiments were conducted on the universal material testing machine to calibrate its strain transferring characteristics. The sensor has the advantages of small size, high precision and flexible use, and demonstrates promising potentials. Ten of tube-packaged strain FBG sensors were applied in the vibration experiment of submarine pipeline model. The strain measured by FBG sensor agrees well with the electric resistance strain sensor.

Development of tube-packaged FBG strain sensor and application in the vibration experiment of submarine pipeline model

NASA Astrophysics Data System (ADS)

Ren, Liang; Li, Hong-Nan; Sun, Li; Li, Dong-Sheng

2005-02-01

Optical fiber sensors have received increasing attention in the fields of aeronautic and civil engineering for their superior ability of explosion proof, immunity to electromagnetic interference and high accuracy, especially fitting for measurement applications in harsh environment. In this paper, a novel FBG (fiber Bragg grating) strain sensor, which was packaged in a 1.2mm stainless steel tube by epoxy resin, was developed. Experiments were conducted on the universal material testing machine to calibrate its strain transferring characteristics. The sensor has the advantages of small size, high precision and flexible use, and demonstrates promising potentials. Ten of tube-packaged strain FBG sensors were applied in the vibration experiment of submarine pipeline model. The strain measured by FBG sensor agrees well with the electric resistance strain sensor.

Production patterns of packaging waste categories generated at typical Mediterranean residential building worksites

DOE Office of Scientific and Technical Information (OSTI.GOV)

González Pericot, N., E-mail: natalia.gpericot@upm.es; Villoria Sáez, P., E-mail: paola.villoria@upm.es; Del Río Merino, M., E-mail: mercedes.delrio@upm.es

2014-11-15

Highlights: • On-site segregation level: 1.80%; training and motivation strategies were not effective. • 70% Cardboard waste: from switches and sockets during the building services stage. • 40% Plastic waste: generated during structures and partition works due to palletizing. • >50% Wood packaging waste, basically pallets, generated during the envelope works. - Abstract: The construction sector is responsible for around 28% of the total waste volume generated in Europe, which exceeds the amount of household waste. This has led to an increase of different research studies focusing on construction waste quantification. However, within the research studies made, packaging waste hasmore » been analyzed to a limited extent. This article focuses on the packaging waste stream generated in the construction sector. To this purpose current on-site waste packaging management has been assessed by monitoring ten Mediterranean residential building works. The findings of the experimental data collection revealed that the incentive measures implemented by the construction company to improve on-site waste sorting failed to achieve the intended purpose, showing low segregation ratios. Subsequently, through an analytical study the generation patterns for packaging waste are established, leading to the identification of the prevailing kinds of packaging and the products responsible for their generation. Results indicate that plastic waste generation maintains a constant trend throughout the whole construction process, while cardboard becomes predominant towards the end of the construction works with switches and sockets from the electricity stage. Understanding the production patterns of packaging waste will be beneficial for adapting waste management strategies to the identified patterns for the specific nature of packaging waste within the context of construction worksites.« less

A fully wafer-level packaged RF MEMS switch with low actuation voltage using a piezoelectric actuator

NASA Astrophysics Data System (ADS)

Park, Jae-Hyoung; Lee, Hee-Chul; Park, Yong-Hee; Kim, Yong-Dae; Ji, Chang-Hyeon; Bu, Jonguk; Nam, Hyo-Jin

2006-11-01

In this paper, a fully wafer-level packaged RF MEMS switch has been demonstrated, which has low operation voltage, using a piezoelectric actuator. The piezoelectric actuator was designed to operate at low actuation voltage for application to advanced mobile handsets. The dc contact type RF switch was packaged using the wafer-level bonding process. The CPW transmission lines and piezoelectric actuators have been fabricated on separate wafers and assembled together by the wafer-level eutectic bonding process. A gold and tin composite was used for eutectic bonding at a low temperature of 300 °C. Via holes interconnecting the electrical contact pads through the wafer were filled completely with electroplated copper. The fully wafer-level packaged RF MEMS switch showed an insertion loss of 0.63 dB and an isolation of 26.4 dB at 5 GHz. The actuation voltage of the switch was 5 V. The resonant frequency of the piezoelectric actuator was 38.4 kHz and the spring constant of the actuator was calculated to be 9.6 N m-1. The size of the packaged SPST (single-pole single-through) switch was 1.2 mm × 1.2 mm including the packaging sealing rim. The effect of the proposed package structure on the RF performance was characterized with a device having CPW through lines and vertical feed lines excluding the RF switches. The measured packaging loss was 0.2 dB and the return loss was 33.6 dB at 5 GHz.

49 CFR 173.412 - Additional design requirements for Type A packages.

Code of Federal Regulations, 2010 CFR

2010-10-01

... materials within the temperature range. (d) The packaging must include a containment system securely closed... in accordance with § 173.469, may be considered as a component of the containment system. If the containment system forms a separate unit of the package, it must be securely closed by a positive fastening...

Methodolgy For Evaluation Of Technology Impacts In Space Electric Power Systems

NASA Technical Reports Server (NTRS)

Holda, Julie

2004-01-01

The Analysis and Management branch of the Power and Propulsion Office at NASA Glenn Research Center is responsible for performing complex analyses of the space power and In-Space propulsion products developed by GRC. This work quantifies the benefits of the advanced technologies to support on-going advocacy efforts. The Power and Propulsion Office is committed to understanding how the advancement in space technologies could benefit future NASA missions. They support many diverse projects and missions throughout NASA as well as industry and academia. The area of work that we are concentrating on is space technology investment strategies. Our goal is to develop a Monte-Carlo based tool to investigate technology impacts in space electric power systems. The framework is being developed at this stage, which will be used to set up a computer simulation of a space electric power system (EPS). The outcome is expected to be a probabilistic assessment of critical technologies and potential development issues. We are developing methods for integrating existing spreadsheet-based tools into the simulation tool. Also, work is being done on defining interface protocols to enable rapid integration of future tools. Monte Carlo-based simulation programs for statistical modeling of the EPS Model. I decided to learn and evaluate Palisade's @Risk and Risk Optimizer software, and utilize it's capabilities for the Electric Power System (EPS) model. I also looked at similar software packages (JMP, SPSS, Crystal Ball, VenSim, Analytica) available from other suppliers and evaluated them. The second task was to develop the framework for the tool, in which we had to define technology characteristics using weighing factors and probability distributions. Also we had to define the simulation space and add hard and soft constraints to the model. The third task is to incorporate (preliminary) cost factors into the model. A final task is developing a cross-platform solution of this framework.

NASA/ASEE Summer Faculty Fellowship Program. 1991 Research Reports

NASA Technical Reports Server (NTRS)

Hosler, E. Ramon (Editor); Beymer, Mark A. (Editor); Armstrong, Dennis W. (Editor)

1991-01-01

Reports from the NASA/ASEE Summer Faculty Fellowship Program are presented. The editors are responsible for selecting appropriately qualified faculty to address some of the many problems of current interest to NASA Kennedy. Some representative titles are as follows: Development of an Accelerated Test Method for the Determination of Susceptibility to Atmospheric Corrosion; Hazardous Gas Leak Analysis in the Space Shuttle; Modeling and Control of the Automated Radiator Inspection Device; Study of the Finite Element Software Packages at KSC; Multispectral Image Processing for Plants; Algorithms for Contours Depicting Static Electric Fields during Adverse Weather Conditions; Transient Study of a Cryogenic Hydrogen Filling System; and Precision Cleaning Verification of Nonvolatile Residues by using Water, Ultrasonics, and Turbidity Analyses.

Advanced Materials for High Temperature, High Performance, Wide Bandgap Power Modules

NASA Astrophysics Data System (ADS)

O'Neal, Chad B.; McGee, Brad; McPherson, Brice; Stabach, Jennifer; Lollar, Richard; Liederbach, Ross; Passmore, Brandon

2016-01-01

Advanced packaging materials must be utilized to take full advantage of the benefits of the superior electrical and thermal properties of wide bandgap power devices in the development of next generation power electronics systems. In this manuscript, the use of advanced materials for key packaging processes and components in multi-chip power modules will be discussed. For example, to date, there has been significant development in silver sintering paste as a high temperature die attach material replacement for conventional solder-based attach due to the improved thermal and mechanical characteristics as well as lower processing temperatures. In order to evaluate the bond quality and performance of this material, shear strength, thermal characteristics, and void quality for a number of silver sintering paste materials were analyzed as a die attach alternative to solder. In addition, as high voltage wide bandgap devices shift from engineering samples to commercial components, passivation materials become key in preventing premature breakdown in power modules. High temperature, high dielectric strength potting materials were investigated to be used to encapsulate and passivate components internal to a power module. The breakdown voltage up to 30 kV and corresponding leakage current for these materials as a function of temperature is also presented. Lastly, high temperature plastic housing materials are important for not only discrete devices but also for power modules. As the operational temperature of the device and/or ambient temperature increases, the mechanical strength and dielectric properties are dramatically reduced. Therefore, the electrical characteristics such as breakdown voltage and leakage current as a function of temperature for housing materials are presented.

A Fruit of Yucca Mountain: The Remote Waste Package Closure System

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kevin Skinner; Greg Housley; Colleen Shelton-Davis

2011-11-01

Was the death of the Yucca Mountain repository the fate of a technical lemon or a political lemon? Without caution, this debate could lure us away from capitalizing on the fruits of the project. In March 2009, Idaho National Laboratory (INL) successfully demonstrated the Waste Package Closure System, a full-scale prototype system for closing waste packages that were to be entombed in the now abandoned Yucca Mountain repository. This article describes the system, which INL designed and built, to weld the closure lids on the waste packages, nondestructively examine the welds using four different techniques, repair the welds if necessary,more » mitigate crack initiating stresses in the surfaces of the welds, evacuate and backfill the packages with an inert gas, and perform all of these tasks remotely. As a nation, we now have a proven method for securely sealing nuclear waste packages for long term storage—regardless of whether or not the future destination for these packages will be an underground repository. Additionally, many of the system’s features and concepts may benefit other remote nuclear applications.« less

A QR code identification technology in package auto-sorting system

NASA Astrophysics Data System (ADS)

di, Yi-Juan; Shi, Jian-Ping; Mao, Guo-Yong

2017-07-01

Traditional manual sorting operation is not suitable for the development of Chinese logistics. For better sorting packages, a QR code recognition technology is proposed to identify the QR code label on the packages in package auto-sorting system. The experimental results compared with other algorithms in literatures demonstrate that the proposed method is valid and its performance is superior to other algorithms.

Application of Quality by Design (QbD) Principles to Extractables/Leachables Assessment. Establishing a Design Space for Terminally Sterilized Aqueous Drug Products Stored in a Plastic Packaging System.

PubMed

Jenke, Dennis

2010-01-01

The concept of quality by design (QbD) reflects the current global regulatory thinking related to pharmaceutical products. A cornerstone of the QbD paradigm is the concept of a design space, where the design space is a multidimensional combination of input variables and process parameters that have been demonstrated to provide the assurance of product quality. If a design space can be established for a pharmaceutical process or product, then operation within the design space confirms that the product or process output possesses the required quality attributes. This concept of design space can be applied to the safety (leachables) assessment of drug products manufactured and stored in packaging systems. Critical variables in such a design space would include those variables that affect the interaction of the drug product and its packaging, including (a) composition of the drug product, (b) composition of the packaging system, (c) configuration of the packaging system, and (d) the conditions of contact. This paper proposes and justifies such a leachables design space for aqueous drug products packaged in a specific plastic packaging system. Such a design space has the following boundaries:Aqueous drug products with a pH in the range of 2 to 8 and that contain no polarity-impacting agents such as organic solubilizers and stabilizers (addressing variable a). Packaging systems manufactured from materials that meet the system's existing material specifications (addressing variable b). Nominal fill volumes from 50 to 1000 mL (addressing variable c). Products subjected to terminal sterilization and then stored at room temperature for a period of up to 24 months (addressing variable d). The ramification of such a design space is that any drug product that falls within these boundaries is deemed to be compatible with the packaging system, from the perspective of safety, without the requirement of supporting drug product testing. When drug products are packaged in plastic container systems, substances may leach from the container and accumulate in the product. It is necessary that the drug product's vendor demonstrate that any such leaching does not occur to the extent that the leached substances adversely affect the product's safety and/or efficacy. One method for accomplishing this objective is via analysis of the drug product to identify and quantify the leached substances. When a particular packaging system is utilized for multiple drug products, one reaches the point, after testing numerous drug products, where the leaching properties of the packaging system are well known and readily predictable. In such a case, testing of additional products in the same packaging system produces no new information and thus becomes redundant and unnecessary. The quality by design (QbD) principle can be simply stated as follows: once a system has been tested to the extent that the test results are predictable, further testing can be replaced by establishing that the system was operating within a defined design space. The purpose of this paper is to demonstrate the application of QbD principles to a packaging system that has been utilized with over 12 parenteral drug products. The paper concludes that the leachables profile of all drug products that fit a certain description (the design space) is known and predicable.

Information-Theoretical Analysis of EEG Microstate Sequences in Python.

PubMed

von Wegner, Frederic; Laufs, Helmut

2018-01-01

We present an open-source Python package to compute information-theoretical quantities for electroencephalographic data. Electroencephalography (EEG) measures the electrical potential generated by the cerebral cortex and the set of spatial patterns projected by the brain's electrical potential on the scalp surface can be clustered into a set of representative maps called EEG microstates. Microstate time series are obtained by competitively fitting the microstate maps back into the EEG data set, i.e., by substituting the EEG data at a given time with the label of the microstate that has the highest similarity with the actual EEG topography. As microstate sequences consist of non-metric random variables, e.g., the letters A-D, we recently introduced information-theoretical measures to quantify these time series. In wakeful resting state EEG recordings, we found new characteristics of microstate sequences such as periodicities related to EEG frequency bands. The algorithms used are here provided as an open-source package and their use is explained in a tutorial style. The package is self-contained and the programming style is procedural, focusing on code intelligibility and easy portability. Using a sample EEG file, we demonstrate how to perform EEG microstate segmentation using the modified K-means approach, and how to compute and visualize the recently introduced information-theoretical tests and quantities. The time-lagged mutual information function is derived as a discrete symbolic alternative to the autocorrelation function for metric time series and confidence intervals are computed from Markov chain surrogate data. The software package provides an open-source extension to the existing implementations of the microstate transform and is specifically designed to analyze resting state EEG recordings.

Word Processors: A Look at Four Popular Programs.

ERIC Educational Resources Information Center

Press, Larry

1980-01-01

Described are types of programs used for processing text (editors, print formatters, and word processors), followed by the comparison of four word-processing packages: Auto Scribe, Electric Pencil, Magic Want and Word Star. With the exception of Auto Scribe, all programs reviewed are CP/M versions. (KC)

Tomorrow's Plastic World

ERIC Educational Resources Information Center

Macdonald, Averil

2005-01-01

Far from being just cheap packaging materials, plastics may be the materials of tomorrow. Plastic can conduct electricity, and this opens up a host of high-tech possibilities in the home and in energy generation. These possibilities are discussed here along with how plastic can be recycled and perhaps even grown.

Integrated Avionics System (IAS), Integrating 3-D Technology On A Spacecraft Panel

NASA Technical Reports Server (NTRS)

Hunter, Don J.; Halpert, Gerald

1999-01-01

As spacecraft designs converge toward miniaturization, and with the volumetric and mass challenges placed on avionics, programs will continue to advance the "state of the art" in spacecraft system development with new challenges to reduce power, mass and volume. Traditionally, the trend is to focus on high-density 3-D packaging technologies. Industry has made significant progress in 3-D technologies, and other related internal and external interconnection schemes. Although new technologies have improved packaging densities, a system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increase integration efficiencies, provide modularity and flexibility to accommodate multiple missions while maintaining a low recurring cost. With these challenges in mind, a novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. The Integrated Avionics System (IAS) provides for a low-mass, modular distributed or centralized packaging architecture which combines ridged-flex technologies, high-density COTS hardware and a new 3-D mechanical packaging approach, Horizontal Mounted Cube (HMC). This paper will describe the fundamental elements of the IAS, HMC hardware design, system integration and environmental test results.

14 CFR 417.1 - General information.

Code of Federal Regulations, 2014 CFR

2014-01-01

... package, (3) Preliminary and final flight data packages, (4) A tailored version of EWR 127-1, (5) Range...) Missile system pre-launch safety package, (3) Preliminary and final flight data packages, (4) A tailored...

14 CFR 417.1 - General information.

Code of Federal Regulations, 2013 CFR

2013-01-01

... package, (3) Preliminary and final flight data packages, (4) A tailored version of EWR 127-1, (5) Range...) Missile system pre-launch safety package, (3) Preliminary and final flight data packages, (4) A tailored...

14 CFR 417.1 - General information.

Code of Federal Regulations, 2011 CFR

2011-01-01

... package, (3) Preliminary and final flight data packages, (4) A tailored version of EWR 127-1, (5) Range...) Missile system pre-launch safety package, (3) Preliminary and final flight data packages, (4) A tailored...

14 CFR 417.1 - General information.

Code of Federal Regulations, 2012 CFR

2012-01-01

... package, (3) Preliminary and final flight data packages, (4) A tailored version of EWR 127-1, (5) Range...) Missile system pre-launch safety package, (3) Preliminary and final flight data packages, (4) A tailored...

Cryogenic Cooling for Myriad Applications-A STAR Is Born

NASA Technical Reports Server (NTRS)

2006-01-01

Cryogenics, the science of generating extremely low temperatures, has wide applicability throughout NASA. The Agency employs cryogenics for rocket propulsion, high-pressure gas supply, breathable air in space, life support equipment, electricity, water, food preservation and packaging, medicine, imaging devices, and electronics. Cryogenic liquid oxygen and liquid hydrogen systems are also replacing solid rocket motor propulsion systems in most of the proposed launch systems, a reversion to old-style liquid propellants. In the late 1980s, NASA wanted a compact linear alternator/motor with reduced size and mass, as well as high efficiency, that had unlimited service life for use in a thermally driven power generator for space power applications. Prior development work with free-piston Stirling converters (a Stirling engine integrated with a linear actuator that produces electrical power output) had shown the promise of that technology for high-power space applications. A dual use for terrestrial applications exists for compact Stirling converters for onsite combined heat and power units. The Stirling cycle is also usable in reverse as a refrigeration cycle suitable for cryogenic cooling, so this Stirling converter work promised double benefits as well as dual uses. The uses for cryogenic coolers within NASA abound; commercial applications are similarly wide-ranging, from cooling liquid oxygen and nitrogen, to cryobiology and bio-storage, cryosurgery, instrument and detector cooling, semiconductor manufacturing, and support service for cooled superconducting power systems.

System design of a large fuel cell hybrid locomotive

NASA Astrophysics Data System (ADS)

Miller, A. R.; Hess, K. S.; Barnes, D. L.; Erickson, T. L.

Fuel cell power for locomotives combines the environmental benefits of a catenary-electric locomotive with the higher overall energy efficiency and lower infrastructure costs of a diesel-electric. A North American consortium, a public-private partnership, is developing a prototype hydrogen-fueled fuel cell-battery hybrid switcher locomotive for urban and military-base rail applications. Switcher locomotives are used in rail yards for assembling and disassembling trains and moving trains from one point to another. At 127 tonnes (280,000 lb), continuous power of 250 kW from its (proton exchange membrane) PEM fuel cell prime mover, and transient power well in excess of 1 MW, the hybrid locomotive will be the heaviest and most powerful fuel cell land vehicle yet. This fast-paced project calls for completion of the vehicle itself near the end of 2007. Several technical challenges not found in the development of smaller vehicles arise when designing and developing such a large fuel cell vehicle. Weight, center of gravity, packaging, and safety were design factors leading to, among other features, the roof location of the lightweight 350 bar compressed hydrogen storage system. Harsh operating conditions, especially shock loads during coupling to railcars, require component mounting systems capable of absorbing high energy. Vehicle scale-up by increasing mass, density, or power presents new challenges primarily related to issues of system layout, hydrogen storage, heat transfer, and shock loads.

STS-97 and Expedition One Crews Pose for Onboard Photo

NASA Technical Reports Server (NTRS)

2000-01-01

In this image, the five STS-97 crew members pose with the 3 members of the Expedition One crew onboard the International Space Station (ISS) for the first ever traditional onboard portrait taken in the Zvezda Service Module. On the front row, left to right, are astronauts Brent W. Jett, Jr., STS-97 commander; William M. Shepherd, Expedition One mission commander; and Joseph R. Tarner, STS-97 mission specialist. On the second row, from the left are Cosmonaut Sergei K. Krikalev, Expedition One flight engineer; astronaut Carlos I. Noriega, STS-97 mission specialist; cosmonaut Yuri P. Gidzenko, Expedition One Soyuz commander; and Michael J. Bloomfield, STS-97 pilot. Behind them is astronaut Marc Garneau, STS-97 mission specialist representing the Canadian Space Agency (CSA). The primary objective of the STS-97 mission was the delivery, assembly, and activation of the U.S. electrical power system onboard the International Space Station (ISS). The electrical power system, which is built into a 73-meter (240-foot) long solar array structure consists of solar arrays, radiators, batteries, and electronics. The entire 15.4-metric ton (17-ton) package is called the P6 Integrated Truss Segment, and is the heaviest and largest element yet delivered to the station aboard a space shuttle. The electrical system will eventually provide the power necessary for the first ISS crews to live and work in the U.S. segment. The STS-97 crew of five launched aboard the Space Shuttle Orbiter Endeavor on November 30, 2000 for an 11 day mission.

Space shuttle/food system study. Package feasibility study, modifications 3S, 4C and 5S

NASA Technical Reports Server (NTRS)

1974-01-01

An optimum feeding system for the space shuttle was presented. This system consisted of all rehydratable type foods which were enclosed in a 4 in. x 4 in. x 1 in. flexible package. A feasibility follow-on study was conducted, and two acceptable, feasible prototypes for this package are described.

The State System Exercise. Learning Packages in International Relations. Learning Package One.

ERIC Educational Resources Information Center

Coplin, William D.

Learning package 1, the first in a series of four, incorporates a simulation exercise designed to help students in higher education understand factors that affect the stability of the international relations system. Focus is on a "system" perspective in order to show the historical development and to point up the operation of various…

Implementing AORN recommended practices for selection and use of packaging systems for sterilization.

PubMed

Morton, Paula J; Conner, Ramona

2014-04-01

The delivery of sterile products to the sterile field is essential to perioperative practice. The use of protective packaging for sterilized items is crucial to helping ensure that patients receive sterile items for surgical procedures. AORN's "Recommended practices for selection and use of packaging systems for sterilization" offers guidance to perioperative team members in evaluating, selecting, and using packaging systems that permit sterilization of the contents, prevent contamination of sterilized items until the package is opened for use, protect the items from damage during transport and storage, and permit aseptic delivery of the items to the sterile field. Copyright © 2014 AORN, Inc. Published by Elsevier Inc. All rights reserved.

A power pack based on organometallic perovskite solar cell and supercapacitor.

PubMed

Xu, Xiaobao; Li, Shaohui; Zhang, Hua; Shen, Yan; Zakeeruddin, Shaik M; Graetzel, Michael; Cheng, Yi-Bing; Wang, Mingkui

2015-02-24

We present an investigation on a power pack combining a CH3NH3PbI3-based solar cell with a polypyrrole-based supercapacitor and evaluate its performance as an energy pack. The package achieved an energy storage efficiency of 10%, which is much higher than that of other systems combining a PV cell with a supercapacitor. We find a high output voltage of 1.45 V for the device under AM 1.5G illumination when the CH3NH3PbI3-based solar cell is connected in series with a polypyrrole-based supercapacitor. This system affords continuous output of electric power by using CH3NH3PbI3-based solar cell as an energy source mitigating transients caused by light intensity fluctuations or the diurnal cycle.

Multiphysics Modeling of an Annular Linear Induction Pump With Applications to Space Nuclear Power Systems

NASA Technical Reports Server (NTRS)

Kilbane, J.; Polzin, K. A.

2014-01-01

An annular linear induction pump (ALIP) that could be used for circulating liquid-metal coolant in a fission surface power reactor system is modeled in the present work using the computational COMSOL Multiphysics package. The pump is modeled using a two-dimensional, axisymmetric geometry and solved under conditions similar to those used during experimental pump testing. Real, nonlinear, temperature-dependent material properties can be incorporated into the model for both the electrically-conducting working fluid in the pump (NaK-78) and structural components of the pump. The intricate three-phase coil configuration of the pump is implemented in the model to produce an axially-traveling magnetic wave that is qualitatively similar to the measured magnetic wave. The model qualitatively captures the expected feature of a peak in efficiency as a function of flow rate.

Revisiting the genome packaging in viruses with lessons from the "Giants".

PubMed

Chelikani, Venkata; Ranjan, Tushar; Kondabagil, Kiran

2014-10-01

Genome encapsidation is an essential step in the life cycle of viruses. Viruses either use some of the most powerful ATP-dependent motors to compel the genetic material into the preformed capsid or make use of the positively charged proteins to bind and condense the negatively charged genome in an energy-independent manner. While the former is a hallmark of large DNA viruses, the latter is commonly seen in small DNA and RNA viruses. Discoveries of many complex giant viruses such as mimivirus, megavirus, pandoravirus, etc., belonging to the nucleo-cytoplasmic large DNA virus (NCLDV) superfamily have changed the perception of genome packaging in viruses. From what little we have understood so far, it seems that the genome packaging mechanism in NCLDVs has nothing in common with other well-characterized viral packaging systems such as the portal-terminase system or the energy-independent system. Recent findings suggest that in giant viruses, the genome segregation and packaging processes are more intricately coupled than those of other viral systems. Interestingly, giant viral packaging systems also seem to possess features that are analogous to bacterial and archaeal chromosome segregation. Although there is a lot of diversity in terms of host range, type of genome, and genome size among viruses, they all seem to use three major types of independent innovations to accomplish genome encapsidation. Here, we have made an attempt to comprehensively review all the known viral genome packaging systems, including the one that is operative in giant viruses, by proposing a simple and expanded classification system that divides the viral packaging systems into three large groups (types I-III) on the basis of the mechanism employed and the relatedness of the major packaging proteins. Known variants within each group have been further classified into subgroups to reflect their unique adaptations. Copyright © 2014 Elsevier Inc. All rights reserved.

Microelectromechanical Systems (MEMS) Broadband Light Source Developed

NASA Technical Reports Server (NTRS)

Tuma, Margaret L.

2003-01-01

A miniature, low-power broadband light source has been developed for aerospace applications, including calibrating spectrometers and powering miniature optical sensors. The initial motivation for this research was based on flight tests of a Fabry-Perot fiberoptic temperature sensor system used to detect aircraft engine exhaust gas temperature. Although the feasibility of the sensor system was proven, the commercial light source optically powering the device was identified as a critical component requiring improvement. Problems with the light source included a long stabilization time (approximately 1 hr), a large amount of heat generation, and a large input electrical power (6.5 W). Thus, we developed a new light source to enable the use of broadband optical sensors in aerospace applications. Semiconductor chip-based light sources, such as lasers and light-emitting diodes, have a relatively narrow range of emission wavelengths in comparison to incandescent sources. Incandescent light sources emit broadband radiation from visible to infrared wavelengths; the intensity at each wavelength is determined by the filament temperature and the materials chosen for the filament and the lamp window. However, present commercial incandescent light sources are large in size and inefficient, requiring several watts of electrical power to obtain the desired optical power, and they emit a large percentage of the input power as heat that must be dissipated. The miniature light source, developed jointly by the NASA Glenn Research Center, the Jet Propulsion Laboratory, and the Lighting Innovations Institute, requires one-fifth the electrical input power of some commercial light sources, while providing similar output light power that is easily coupled to an optical fiber. Furthermore, it is small, rugged, and lightweight. Microfabrication technology was used to reduce the size, weight, power consumption, and potential cost-parameters critical to future aerospace applications. This chip-based light source has the potential for monolithic fabrication with on-chip drive electronics. Other uses for these light sources are in systems for vehicle navigation, remote sensing applications such as monitoring bridges for stress, calibration sources for spectrometers, light sources for space sensors, display lighting, addressable arrays, and industrial plant monitoring. Two methods for filament fabrication are being developed: wet-chemical etching and laser ablation. Both yield a 25-mm-thick tungsten spiral filament. The proof-of-concept filament shown was fabricated with the wet etch method. Then it was tested by heating it in a vacuum chamber using about 1.25 W of electrical power; it generated bright, blackbody radiation at approximately 2650 K. The filament was packaged in Glenn's clean-room facilities. This design uses three chips vacuum-sealed with glass tape. The bottom chip consists of a reflective film deposited on silicon, the middle chip contains a tungsten filament bonded to silicon, and the top layer is a transparent window. Lifetime testing on the package will begin shortly. The emitted optical power is expected to be approximately 1.0 W with the spectral peak at 1.1 mm.

Investigating social cognition in infants and adults using dense array electroencephalography ((d)EEG).

PubMed

Akano, Adekemi J; Haley, David W; Dudek, Joanna

2011-06-27

Dense array electroencephalography ((d)EEG), which provides a non-invasive window for measuring brain activity and a temporal resolution unsurpassed by any other current brain imaging technology¹, ² is being used increasingly in the study of social cognitive functioning in infants and adults. While (d)EEG is enabling researchers to examine brain activity patterns with unprecedented levels of sensitivity, conventional EEG recording systems continue to face certain limitations, including 1) poor spatial resolution and source localization³,⁴2) the physical discomfort for test subjects of enduring the individual application of numerous electrodes to the surface of the scalp, and 3) the complexity for researchers of learning to use multiple software packages to collect and process data. Here we present an overview of an established methodology that represents a significant improvement on conventional methodologies for studying EEG in infants and adults. Although several analytical software techniques can be used to establish indirect indices of source localization to improve the spatial resolution of (d)EEG, the HydroCel Geodesic Sensor Net (HCGSN) by Electrical Geodesics, Inc. (EGI), a dense sensory array that maintains equal distances among adjacent recording electrodes on all surfaces of the scalp, further enhances spatial resolution⁴,⁵(,)⁶ compared to standard (d)EEG systems. The sponge-based HCGSN can be applied rapidly and without scalp abrasion, making it ideal for use with adults⁷,⁸ children⁹,¹⁰, ¹¹,¹² and infants¹², in both research and clinical ⁴,⁵,⁶,¹³,¹⁴,¹⁵settings. This feature allows for considerable cost and time savings by decreasing the average net application time compared to other (d)EEG systems. Moreover, the HCGSN includes unified, seamless software applications for all phases of data, greatly simplifying the collection, processing, and analysis of (d)EEG data. The HCGSN features a low-profile electrode pedestal, which, when filled with electrolyte solution, creates a sealed microenvironment and an electrode-scalp interface. In all Geodesic (d;)EEG systems, EEG sensors detect changes in voltage originating from the participant's scalp, along with a small amount of electrical noise originating from the room environment. Electrical signals from all sensors of the Geodesic sensor net are received simultaneously by the amplifier, where they are automatically processed, packaged, and sent to the data-acquisition computer (DAC). Once received by the DAC, scalp electrical activity can be isolated from artifacts for analysis using the filtering and artifact detection tools included in the EGI software. Typically, the HCGSN can be used continuously for only up to two hours because the electrolyte solution dries out over time, gradually decreasing the quality of the scalp-electrode interface. In the Parent-Infant Research Lab at the University of Toronto, we are using (d)EEG to study social cognitive processes including memory, emotion, goals, intentionality, anticipation, and executive functioning in both adult and infant participants.

21 CFR 801.437 - User labeling for devices that contain natural rubber.

Code of Federal Regulations, 2014 CFR

2014-04-01

... User labeling for devices that contain natural rubber. (a) Data in the Medical Device Reporting System... of the device packaging, the outside package, container or wrapper, and the immediate device package... panel of the device packaging, the outside package, container or wrapper, and the immediate device...

21 CFR 801.437 - User labeling for devices that contain natural rubber.

Code of Federal Regulations, 2011 CFR

2011-04-01

... User labeling for devices that contain natural rubber. (a) Data in the Medical Device Reporting System... of the device packaging, the outside package, container or wrapper, and the immediate device package... panel of the device packaging, the outside package, container or wrapper, and the immediate device...

21 CFR 801.437 - User labeling for devices that contain natural rubber.

Code of Federal Regulations, 2013 CFR

2013-04-01

... User labeling for devices that contain natural rubber. (a) Data in the Medical Device Reporting System... of the device packaging, the outside package, container or wrapper, and the immediate device package... panel of the device packaging, the outside package, container or wrapper, and the immediate device...

21 CFR 801.437 - User labeling for devices that contain natural rubber.

Code of Federal Regulations, 2012 CFR

2012-04-01

... User labeling for devices that contain natural rubber. (a) Data in the Medical Device Reporting System... of the device packaging, the outside package, container or wrapper, and the immediate device package... panel of the device packaging, the outside package, container or wrapper, and the immediate device...

21 CFR 801.437 - User labeling for devices that contain natural rubber.

Code of Federal Regulations, 2010 CFR

2010-04-01

... User labeling for devices that contain natural rubber. (a) Data in the Medical Device Reporting System... of the device packaging, the outside package, container or wrapper, and the immediate device package... panel of the device packaging, the outside package, container or wrapper, and the immediate device...

21 CFR 820.130 - Device packaging.

Code of Federal Regulations, 2010 CFR

2010-04-01

... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Device packaging. 820.130 Section 820.130 Food and... QUALITY SYSTEM REGULATION Labeling and Packaging Control § 820.130 Device packaging. Each manufacturer shall ensure that device packaging and shipping containers are designed and constructed to protect the...

Space shuttle galley water system test program

NASA Technical Reports Server (NTRS)

1975-01-01

A water system for food rehydration was tested to determine the requirements for a space shuttle gallery flight system. A new food package concept had been previously developed in which water was introduced into the sealed package by means of a needle and septum. The needle configuration was developed and the flow characteristics measured. The interface between the food package and the water system, oven, and food tray was determined.

Assessment of Quality Assurance Measures for Radioactive Material Transport Packages not Requiring Competent Authority Design Approval - 13282

DOE Office of Scientific and Technical Information (OSTI.GOV)

Komann, Steffen; Groeke, Carsten; Droste, Bernhard

The majority of transports of radioactive materials are carried out in packages which don't need a package design approval by a competent authority. Low-active radioactive materials are transported in such packages e.g. in the medical and pharmaceutical industry and in the nuclear industry as well. Decommissioning of NPP's leads to a strong demand for packages to transport low and middle active radioactive waste. According to IAEA regulations the 'non-competent authority approved package types' are the Excepted Packages and the Industrial Packages of Type IP-1, IP-2 and IP-3 and packages of Type A. For these types of packages an assessment bymore » the competent authority is required for the quality assurance measures for the design, manufacture, testing, documentation, use, maintenance and inspection (IAEA SSR 6, Chap. 306). In general a compliance audit of the manufacturer of the packaging is required during this assessment procedure. Their regulatory level in the IAEA regulations is not comparable with the 'regulatory density' for packages requiring competent authority package design approval. Practices in different countries lead to different approaches within the assessment of the quality assurance measures in the management system as well as in the quality assurance program of a special package design. To use the package or packaging in a safe manner and in compliance with the regulations a management system for each phase of the life of the package or packaging is necessary. The relevant IAEA-SSR6 chap. 801 requires documentary verification by the consignor concerning package compliance with the requirements. (authors)« less

Development of expert system for biobased polymer material selection: food packaging application.

PubMed

Sanyang, M L; Sapuan, S M

2015-10-01

Biobased food packaging materials are gaining more attention owing to their intrinsic biodegradable nature and renewability. Selection of suitable biobased polymers for food packaging applications could be a tedious task with potential mistakes in choosing the best materials. In this paper, an expert system was developed using Exsys Corvid software to select suitable biobased polymer materials for packaging fruits, dry food and dairy products. If - Then rule based system was utilized to accomplish the material selection process whereas a score system was formulated to facilitate the ranking of selected materials. The expert system selected materials that satisfied all constraints and selection results were presented in suitability sequence depending on their scores. The expert system selected polylactic acid (PLA) as the most suitable material.

30 CFR 7.100 - Explosion tests.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Explosion tests. 7.100 Section 7.100 Mineral... Underground Coal Mines Where Permissible Electric Equipment is Required § 7.100 Explosion tests. (a) Test procedures. (1) Prepare to test the diesel power package as follows: (i) Perform a detailed check of parts...

30 CFR 7.100 - Explosion tests.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Explosion tests. 7.100 Section 7.100 Mineral... Underground Coal Mines Where Permissible Electric Equipment is Required § 7.100 Explosion tests. (a) Test procedures. (1) Prepare to test the diesel power package as follows: (i) Perform a detailed check of parts...

30 CFR 7.100 - Explosion tests.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Explosion tests. 7.100 Section 7.100 Mineral... Underground Coal Mines Where Permissible Electric Equipment is Required § 7.100 Explosion tests. (a) Test procedures. (1) Prepare to test the diesel power package as follows: (i) Perform a detailed check of parts...

Refrigeration and Cryogenics Specialist. J3ABR54530

ERIC Educational Resources Information Center

Air Force Training Command, Sheppard AFB, TX.

This document package contains an Air Force course used to train refrigeration and cryogenics specialists. The course is organized in six blocks designed for group instruction. The blocks cover the following topics: electrical principles; fundamentals of tubing and piping; metering devices, motor controls, domestic and commercial refrigeration;…

The Three R's of Utility Savings: Rate Reduction, Rebates and Retrofit.

ERIC Educational Resources Information Center

Petiunas, Raymond V.

1993-01-01

An effective way to increase electricity energy savings for school districts is to integrate rate case participation (rate reduction) with conservation and load-management efforts (rebates) and retrofit operations, to obtain a total energy cost reduction package. Describes how a Pennsylvania consortium of school districts saved its member…

30 CFR 7.107 - New technology.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false New technology. 7.107 Section 7.107 Mineral... Underground Coal Mines Where Permissible Electric Equipment is Required § 7.107 New technology. MSHA may approve a diesel power package that incorporates technology for which the requirements of this subpart are...

30 CFR 7.107 - New technology.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 30 Mineral Resources 1 2012-07-01 2012-07-01 false New technology. 7.107 Section 7.107 Mineral... Underground Coal Mines Where Permissible Electric Equipment is Required § 7.107 New technology. MSHA may approve a diesel power package that incorporates technology for which the requirements of this subpart are...

30 CFR 7.107 - New technology.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 30 Mineral Resources 1 2013-07-01 2013-07-01 false New technology. 7.107 Section 7.107 Mineral... Underground Coal Mines Where Permissible Electric Equipment is Required § 7.107 New technology. MSHA may approve a diesel power package that incorporates technology for which the requirements of this subpart are...

30 CFR 7.107 - New technology.

Code of Federal Regulations, 2014 CFR

2014-07-01

... 30 Mineral Resources 1 2014-07-01 2014-07-01 false New technology. 7.107 Section 7.107 Mineral... Underground Coal Mines Where Permissible Electric Equipment is Required § 7.107 New technology. MSHA may approve a diesel power package that incorporates technology for which the requirements of this subpart are...

Performance Analysis of Saturated Induction Motors by Virtual Tests

ERIC Educational Resources Information Center

Ojaghi, M.; Faiz, J.; Kazemi, M.; Rezaei, M.

2012-01-01

Many undergraduate-level electrical machines textbooks give detailed treatments of the performance of induction motors. Students can deepen this understanding of motor performance by performing the appropriate practical work in laboratories or in simulation using proper software packages. This paper considers various common and less-common tests…

21 CFR 109.15 - Use of polychlorinated biphenyls (PCB's) in establishments manufacturing food-packaging materials.

Code of Federal Regulations, 2011 CFR

2011-04-01

... (Japan). PCB's are highly stable, heat resistant, and nonflammable chemicals. Industrial uses of PCB's include, or did include in the past, their use as electrical transformer and capacitor fluids, heat transfer fluids, hydraulic fluids, and plasticizers, and in formulations of lubricants, coatings, and inks...

21 CFR 509.15 - Use of polychlorinated biphenyls (PCB's) in establishments manufacturing food-packaging materials.

Code of Federal Regulations, 2011 CFR

2011-04-01

... (Japan). PCB's are highly stable, heat resistant, and nonflammable chemicals. Industrial uses of PCB's include, or did include in the past, their use as electrical transformer and capacitor fluids, heat transfer fluids, hydraulic fluids, and plasticizers, and in formulations of lubricants, coatings, and inks...

Multiple Learning Strategies Project. Small Engine Repair. Visually Impaired.

ERIC Educational Resources Information Center

Foster, Don; And Others

This instructional package designed for visually impaired students, focuses on the vocational area of small engine repair. Contained in this document are forty learning modules organized into fourteen units: engine block; starters; fuel tank, lines, filters and pumps; carburetors; electrical; test equipment; motorcycle; machining; tune-ups; short…

30 CFR 7.107 - New technology.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false New technology. 7.107 Section 7.107 Mineral... Underground Coal Mines Where Permissible Electric Equipment is Required § 7.107 New technology. MSHA may approve a diesel power package that incorporates technology for which the requirements of this subpart are...

An integrated modeling method for wind turbines

NASA Astrophysics Data System (ADS)

Fadaeinedjad, Roohollah

To study the interaction of the electrical, mechanical, and aerodynamic aspects of a wind turbine, a detailed model that considers all these aspects must be used. A drawback of many studies in the area of wind turbine simulation is that either a very simple mechanical model is used with a detailed electrical model, or vice versa. Hence the interactions between electrical and mechanical aspects of wind turbine operation are not accurately taken into account. In this research, it will be shown that a combination of different simulation packages, namely TurbSim, FAST, and Simulink can be used to model the aerodynamic, mechanical, and electrical aspects of a wind turbine in detail. In this thesis, after a review of some wind turbine concepts and software tools, a simulation structure is proposed for studying wind turbines that integrates the mechanical and electrical components of a wind energy conversion device. Based on the simulation structure, a comprehensive model for a three-bladed variable speed wind turbine with doubly-fed induction generator is developed. Using the model, the impact of a voltage sag on the wind turbine tower vibration is investigated under various operating conditions such as power system short circuit level, mechanical parameters, and wind turbine operating conditions. It is shown how an electrical disturbance can cause more sustainable tower vibrations under high speed and turbulent wind conditions, which may disrupt the operation of pitch control system. A similar simulation structure is used to model a two-bladed fixed speed wind turbine with an induction generator. An extension of the concept is introduced by adding a diesel generator system. The model is utilized to study the impact of the aeroelastic aspects of wind turbine (i.e. tower shadow, wind shears, yaw error, turbulence, and mechanical vibrations) on the power quality of a stand-alone wind-diesel system. Furthermore, an IEEE standard flickermeter model is implemented in a Simulink environment to study the flicker contribution of the wind turbine in the wind-diesel system. By using a new wind power plant representation method, a large wind farm (consisting of 96 fixed speed wind turbines) is modelled to study the power quality of wind power system. The flicker contribution of wind farm is also studied with different wind turbine numbers, using the flickermeter model. Keywords. Simulink, FAST, TurbSim, AreoDyn, wind energy, doubly-fed induction generator, variable speed wind turbine, voltage sag, tower vibration, power quality, flicker, fixed speed wind turbine, wind shear, tower shadow, and yaw error.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dana L. Kelly

Typical engineering systems in applications with high failure consequences such as nuclear reactor plants often employ redundancy and diversity of equipment in an effort to lower the probability of failure and therefore risk. However, it has long been recognized that dependencies exist in these redundant and diverse systems. Some dependencies, such as common sources of electrical power, are typically captured in the logic structure of the risk model. Others, usually referred to as intercomponent dependencies, are treated implicitly by introducing one or more statistical parameters into the model. Such common-cause failure models have limitations in a simulation environment. In addition,more » substantial subjectivity is associated with parameter estimation for these models. This paper describes an approach in which system performance is simulated by drawing samples from the joint distributions of dependent variables. The approach relies on the notion of a copula distribution, a notion which has been employed by the actuarial community for ten years or more, but which has seen only limited application in technological risk assessment. The paper also illustrates how equipment failure data can be used in a Bayesian framework to estimate the parameter values in the copula model. This approach avoids much of the subjectivity required to estimate parameters in traditional common-cause failure models. Simulation examples are presented for failures in time. The open-source software package R is used to perform the simulations. The open-source software package WinBUGS is used to perform the Bayesian inference via Markov chain Monte Carlo sampling.« less

WavePacket: A Matlab package for numerical quantum dynamics. I: Closed quantum systems and discrete variable representations

NASA Astrophysics Data System (ADS)

Schmidt, Burkhard; Lorenz, Ulf

2017-04-01

WavePacket is an open-source program package for the numerical simulation of quantum-mechanical dynamics. It can be used to solve time-independent or time-dependent linear Schrödinger and Liouville-von Neumann-equations in one or more dimensions. Also coupled equations can be treated, which allows to simulate molecular quantum dynamics beyond the Born-Oppenheimer approximation. Optionally accounting for the interaction with external electric fields within the semiclassical dipole approximation, WavePacket can be used to simulate experiments involving tailored light pulses in photo-induced physics or chemistry. The graphical capabilities allow visualization of quantum dynamics 'on the fly', including Wigner phase space representations. Being easy to use and highly versatile, WavePacket is well suited for the teaching of quantum mechanics as well as for research projects in atomic, molecular and optical physics or in physical or theoretical chemistry. The present Part I deals with the description of closed quantum systems in terms of Schrödinger equations. The emphasis is on discrete variable representations for spatial discretization as well as various techniques for temporal discretization. The upcoming Part II will focus on open quantum systems and dimension reduction; it also describes the codes for optimal control of quantum dynamics. The present work introduces the MATLAB version of WavePacket 5.2.1 which is hosted at the Sourceforge platform, where extensive Wiki-documentation as well as worked-out demonstration examples can be found.

Apparatus and method for skin packaging articles

NASA Technical Reports Server (NTRS)

Madsen, B.; Pozsony, E. R.; Collin, E. E. (Inventor)

1973-01-01

A system for skin packaging articles including a loading zone for positioning articles to be packaged upon a substrate, a thermoplastic film heating and vacuum operated skin packaging zone for covering the articles with film laminated to the substrate and a slitting zone for separating and trimming the individual skin packaged articles. The articles are passed to the successive zones. The loading zone may be adapted for conveyorized instead of hand loading. In some cases, where only transverse cutting of the film web is necessary, it may be desirable to eliminate the slitting zone and remove the skin packaged article or articles directly from the packaging zone. A conveniently located operating panel contains controls for effecting automatic, semiautomatic or manual operation of the entire system of any portions in any manner desired.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ferrell, P.C.

This SARP describes the RTG Transportation System Package, a Type B(U) packaging system that is used to transport an RTG or similar payload. The payload, which is included in this SARP, is a generic, enveloping payload that specifically encompasses the General Purpose Heat Source (GPHS) RTG payload. The package consists of two independent containment systems mounted on a shock isolation transport skid and transported within an exclusive-use trailer.

White House Communications Agency (WHCA) Presidential Voice Communications Rack Mount System Mechanical Drawing Package

DTIC Science & Technology

2015-12-01

Rack Mount System Mechanical Drawing Package by Steven P Callaway Approved for public release; distribution unlimited...Laboratory White House Communications Agency (WHCA) Presidential Voice Communications Rack Mount System Mechanical Drawing Package by Steven P...Note 3. DATES COVERED (From - To) 04/2013 4. TITLE AND SUBTITLE White House Communications Agency (WHCA) Presidential Voice Communications Rack

ALMDS laser system

NASA Astrophysics Data System (ADS)

Kushina, Mark E.; Heberle, Geoff; Hope, Michael; Hall, David; Bethel, Michael; Calmes, Lonnie K.

2003-06-01

The ALMDS (Airborne Laser Mine Detection System) has been developed utilizing a solid-state laser operating at 532nm for naval mine detection. The laser system is integrated into a pod that mounts externally on a helicopter. This laser, along with other receiver systems, enables detailed underwater bathymetry. CEO designs and manufactures the laser portion of this system. Arete Associates integrates the laser system into the complete LIDAR package that utilizes sophisticated streak tube detection technology. Northrop Grumman is responsible for final pod integration. The laser sub-system is comprised of two separate parts: the LTU (Laser Transmitter Unit) and the LEU (Laser Electronics Unit). The LTU and LEU are undergoing MIL-STD-810 testing for vibration, shock, temperature storage and operation extremes, as well as MIL-STD-704E electrical power testing and MIL-STD-461E EMI testing. The Nd:YAG MOPA laser operates at 350 Hz pulse repetition frequency at 45 Watts average 532nm power and is controlled at the system level from within the helicopter. Power monitor circuits allow real time laser health monitoring, which enables input parameter adjustments for consistent laser behavior.

Optimal design of solid oxide fuel cell, ammonia-water single effect absorption cycle and Rankine steam cycle hybrid system

NASA Astrophysics Data System (ADS)

Mehrpooya, Mehdi; Dehghani, Hossein; Ali Moosavian, S. M.

2016-02-01

A combined system containing solid oxide fuel cell-gas turbine power plant, Rankine steam cycle and ammonia-water absorption refrigeration system is introduced and analyzed. In this process, power, heat and cooling are produced. Energy and exergy analyses along with the economic factors are used to distinguish optimum operating point of the system. The developed electrochemical model of the fuel cell is validated with experimental results. Thermodynamic package and main parameters of the absorption refrigeration system are validated. The power output of the system is 500 kW. An optimization problem is defined in order to finding the optimal operating point. Decision variables are current density, temperature of the exhaust gases from the boiler, steam turbine pressure (high and medium), generator temperature and consumed cooling water. Results indicate that electrical efficiency of the combined system is 62.4% (LHV). Produced refrigeration (at -10 °C) and heat recovery are 101 kW and 22.1 kW respectively. Investment cost for the combined system (without absorption cycle) is about 2917 kW-1.

How to successfully implement extended producer responsibility: considerations from an economic point of view.

PubMed

Wiesmeth, Hans; Häckl, Dennis

2011-09-01

This paper investigates the concept of extended producer responsibility (EPR) from an economic point of view. Particular importance will be placed on the concept of 'economic feasibility' of an EPR policy, which should guide decision-making in this context. Moreover, the importance of the core EPR principle of 'integrating signals throughout the product chain' into the incentive structure will be demonstrated with experiences from Germany. These examples refer to sales packaging consumption, refillable drinks packages and waste electrical and electronic equipment collection. As a general conclusion, the interaction between economic principles and technological development needs to be observed carefully when designing incentive-compatible EPR policies.