An electron-beam dose deposition experiment: TIGER 1-D simulation code versus thermoluminescent dosimetry

NASA Astrophysics Data System (ADS)

Murrill, Steven R.; Tipton, Charles W.; Self, Charles T.

1991-03-01

The dose absorbed in an integrated circuit (IC) die exposed to a pulse of low-energy electrons is a strong function of both electron energy and surrounding packaging materials. This report describes an experiment designed to measure how well the Integrated TIGER Series one-dimensional (1-D) electron transport simulation program predicts dose correction factors for a state-of-the-art IC package and package/printed circuit board (PCB) combination. These derived factors are compared with data obtained experimentally using thermoluminescent dosimeters (TLD's) and the FX-45 flash x-ray machine (operated in electron-beam (e-beam) mode). The results of this experiment show that the TIGER 1-D simulation code can be used to accurately predict FX-45 e-beam dose deposition correction factors for reasonably complex IC packaging configurations.

Chemical effect on diffusion in intermetallic compounds

NASA Astrophysics Data System (ADS)

Chen, Yi-Ting

With the trend of big data and the Internet of things, we live in a world full of personal electronic devices and small electronic devices. In order to make the devices more powerful, advanced electronic packaging such as wafer level packaging or 3D IC packaging play an important role. Furthermore, ?-bumps, which connect silicon dies together with dimension less than 10 ?m, are crucial parts in advanced packaging. Owing to the dimension of ?-bumps, they transform into intermetallic compound from tin based solder after the liquid state bonding process. Moreover, many new reliability issues will occur in electronic packaging when the bonding materials change; in this case, we no longer have tin based solder joint, instead, we have intermetallic compound ?-bumps. Most of the potential reliability issues in intermetallic compounds are caused by the chemical reactions driven by atomic diffusion in the material; thus, to know the diffusivities of atoms inside a material is significant and can help us to further analyze the reliability issues. However, we are lacking these kinds of data in intermetallic compound because there are some problems if used traditional Darken's analysis. Therefore, we considered Wagner diffusivity in our system to solve the problems and applied the concept of chemical effect on diffusion by taking the advantage that large amount of energy will release when compounds formed. Moreover, by inventing the holes markers made by Focus ion beam (FIB), we can conduct the diffusion experiment and obtain the tracer diffusivities of atoms inside the intermetallic compound. We applied the technique on Ni3Sn4 and Cu3Sn, which are two of the most common materials in electronic packaging, and the tracer diffusivities are measured under several different temperatures; moreover, microstructure of the intermetallic compounds are investigated to ensure the diffusion environment. Additionally, the detail diffusion mechanism was also discussed in aspect of diffusion activation enthalpy and diffusion pre-factor by using lattice structure simulation. Last but not the least, X-ray photoelectron spectroscopy and First principal calculation simulation were used to observe the electron binding energies in the intermetallic compound and illustrate the partial covalent bonding behavior in the intermetallic compounds.

Packaging strategies for printed circuit board components. Volume I, materials & thermal stresses.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Neilsen, Michael K.; Austin, Kevin N.; Adolf, Douglas Brian

2011-09-01

Decisions on material selections for electronics packaging can be quite complicated by the need to balance the criteria to withstand severe impacts yet survive deep thermal cycles intact. Many times, material choices are based on historical precedence perhaps ignorant of whether those initial choices were carefully investigated or whether the requirements on the new component match those of previous units. The goal of this program focuses on developing both increased intuition for generic packaging guidelines and computational methodologies for optimizing packaging in specific components. Initial efforts centered on characterization of classes of materials common to packaging strategies and computational analysesmore » of stresses generated during thermal cycling to identify strengths and weaknesses of various material choices. Future studies will analyze the same example problems incorporating the effects of curing stresses as needed and analyzing dynamic loadings to compare trends with the quasi-static conclusions.« less

Microstructure-Evolution and Reliability Assessment Tool for Lead-Free Component Insertion in Army Electronics

DTIC Science & Technology

2008-10-01

provide adequate means for thermal heat dissipation and cooling. Thus electronic packaging has four main functions [1]: • Signal distribution which... dissipation , involving structural and materials consideration. • Mechanical, chemical and electromagnetic protection of components and... nature when compared to phenomenological models. Microelectronic packaging industry spends typically several months building and reliability

Performance and Reliability of Bonded Interfaces for High-Temperature Packaging. Annual Report

DOE Office of Scientific and Technical Information (OSTI.GOV)

DeVoto, Douglas

2016-04-01

Current generation automotive power electronics packages utilize silicon devices and lead-free solder alloys. To meet stringent technical targets for 2020 and beyond (for cost, power density, specific power, efficiency and reliability), wide-bandgap devices are being considered since they offer advantages such as operation at higher frequencies, voltages, and temperatures. Traditional power electronics packages must be redesigned to utilize the full potential of wide-bandgap devices, and the die- and substrate-attach layers are key areas where new material development and validation is required. Present solder alloys do not meet the performance requirements for these new package designs while also meeting cost andmore » hazardous substance restrictions. Sintered silver (Ag) promises to meet the needs for die- and substrate-attach interfaces but synthesis optimization and reliability evaluation must be completed. Sintered Ag material was proposed as an alternative solution in power electronics packages almost 20 years back. However, synthesis pressure requirements up 40 MPa caused a higher complexity in the production process and more stringent flatness specifications for the substrates. Recently, several manufacturers have developed sintered Ag materials that require lower (3-5 MPa) or even no bonding pressures. Degradation mechanisms for these sintered Ag materials are not well known and need to be addressed. We are addressing these aspects to some extent in this project. We are developing generalized (i.e., independent of geometry) stress intensity factor versus cycles-to-failure relations for sintered Ag. Because sintered Ag is a relatively new material for automotive power electronics, the industry currently does not have a good understanding of recommended synthesis parameters or expected reliability under prescribed conditions. It is an important deliverable of this project to transfer findings to industry to eliminate barriers to using sintered Ag as a viable and commercialized die- and substrate-attach material. Only a few manufacturers produce sintered Ag pastes and may consider some processing conditions as proprietary. It is the goal of this project to openly explore and define best practices in order to impact the maximum number of power electronics module manufacturers and suppliers.« less

Japan's technology and manufacturing infrastructure

NASA Astrophysics Data System (ADS)

Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

1995-02-01

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Japan's technology and manufacturing infrastructure

NASA Technical Reports Server (NTRS)

Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

1995-01-01

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Diamond-based heat spreaders for power electronic packaging applications

NASA Astrophysics Data System (ADS)

Guillemet, Thomas

As any semiconductor-based devices, power electronic packages are driven by the constant increase of operating speed (higher frequency), integration level (higher power), and decrease in feature size (higher packing density). Although research and innovation efforts have kept these trends continuous for now more than fifty years, the electronic packaging technology is currently facing a challenge that must be addressed in order to move toward any further improvements in terms of performances or miniaturization: thermal management. Thermal issues in high-power packages strongly affect their reliability and lifetime and have now become one of the major limiting factors of power modules development. Thus, there is a strong need for materials that can sustain higher heat flux levels while safely integrating into the electronic package architecture. In such context, diamond is an attractive candidate because of its outstanding thermal conductivity, low thermal expansion, and high electrical resistivity. Its low heat capacity relative to metals such as aluminum or copper makes it however preferable for heat spreading applications (as a heat-spreader) rather than for dissipating the heat flux itself (as a heat sink). In this study, a dual diamond-based heat-spreading solution is proposed. Polycrystalline diamond films were grown through laser-assisted combustion synthesis on electronic substrates (in the U.S) while, in parallel, diamond-reinforced copper-matrix composite films were fabricated through tape casting and hot pressing (in France). These two types of diamond-based heat-spreading films were characterized and their microstructure and chemical composition were related to their thermal performances. Particular emphasize was put on the influence of interfaces on the thermal properties of the materials, either inside a single material (grain boundaries) or between dissimilar materials (film/substrate interface, matrix/reinforcement interface). Finally, the packaging potential of the two heat-spreading solutions invoked was evaluated. This study was carried out within the framework of a French-American collaboration between the Electrical Engineering department of the University of Nebraska-Lincoln (United States, U.S.) and the Institute of Condensed Matter Chemistry of the University of Bordeaux (France). This study was financed by the Office of Naval Research in the U.S., and by the Region Aquitaine in France.

Advanced Packaging Materials and Techniques for High Power TR Module: Standard Flight vs. Advanced Packaging

NASA Technical Reports Server (NTRS)

Hoffman, James Patrick; Del Castillo, Linda; Miller, Jennifer; Jenabi, Masud; Hunter, Donald; Birur, Gajanana

2011-01-01

The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires advances in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and compared to standard technologies.

Integrated microsystems packaging approach with LCP

NASA Astrophysics Data System (ADS)

Jaynes, Paul; Shacklette, Lawrence W.

2006-05-01

Within the government communication market there is an increasing push to further miniaturize systems with the use of chip-scale packages, flip-chip bonding, and other advances over traditional packaging techniques. Harris' approach to miniaturization includes these traditional packaging advances, but goes beyond this level of miniaturization by combining the functional and structural elements of a system, thus creating a Multi-Functional Structural Circuit (MFSC). An emerging high-frequency, near hermetic, thermoplastic electronic substrate material, Liquid Crystal Polymer (LCP), is the material that will enable the combination of the electronic circuit and the physical structure of the system. The first embodiment of this vision for Harris is the development of a battlefield acoustic sensor module. This paper will introduce LCP and its advantages for MFSC, present an example of the work that Harris has performed, and speak to LCP MFSCs' potential benefits to miniature communications modules and sensor platforms.

75 FR 5375 - Hazardous Material; Miscellaneous Packaging Amendments

Federal Register 2010, 2011, 2012, 2013, 2014

2010-02-02

...In this final rule, PHMSA is amending packaging requirements in the Hazardous Materials Regulations to enhance compliance flexibility, improve clarity, and reduce regulatory burdens. Specifically, we are revising several packaging related definitions; adding provisions to allow more flexibility when preparing and transmitting closure instructions, including conditions under which closure instructions may be transmitted electronically; adding a requirement for shippers to retain packaging closure instructions; incorporating new language that will allow for a practicable means of stenciling the ``UN'' symbol on packagings; and clarifying a requirement to document the methodology used when determining whether a change in packaging configuration requires retesting as a new design or may be considered a variation of a previously tested design. This final rule also incorporates requirements for construction, maintenance, and use of Large Packagings.

Thermal Testing and Quality Assurance of BGA LCC & QFN Electronic Packages

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kuper, Cameron Mathias

The purpose of this project is to experimentally validate the thermal fatigue life of solder interconnects for a variety of surface mount electronic packages. Over the years, there has been a significant amount of research and analysis in the fracture of solder joints on printed circuit boards. Solder is important in the mechanical and electronic functionality of the component. It is important throughout the life of the product that the solder remains crack and fracture free. The specific type of solder used in this experiment is a 63Sn37Pb eutectic alloy. Each package was surrounded conformal coating or underfill material.

Conversion of continuous-direct-current TIG welder to pulse-arc operation

NASA Technical Reports Server (NTRS)

Lien, D. R.

1969-01-01

Electronics package converts a continuous-dc tungsten-inert gas welder for pulse-arc operation. Package allows presetting of the pulse rate, duty cycle, and current value, and enables welding of various alloys and thicknesses of materials.

Determination of microbial contamination of plastic cups for dairy products and utilization of electron beam treatment for sterilization.

PubMed

Tacker, M; Hametner, C; Wepner, B

2002-01-01

Packaging materials are often considered a critical control point in HACCP systems of food companies. Methods for the determination of the microbial contamination rate of plastic cups, especially for dairy products, must reliably detect single moulds, yeasts or coliforms. In this study, a comparison of a specially adapted coating method, impedance method, direct inoculation and membrane filter technique was carried out to determine contamination with yeasts, moulds, coliforms and total bacterial counts using the appropriate agar in each case. The coating method is recommended for determining yeasts, moulds and coliforms as it allows the localization of the microorganisms as well as the determination of single microorganisms. For total bacterial count, a direct inoculation technique is proposed. The employing of simple measures in the production and during transport of packaging materials, such as dust-prevention or tight sealing in polyethylene bags, heavily reduces microbial contamination rates of packaging material. To reduce contamination rates further, electron beam irradiation was applied: plastic cups sealed in polyethylene bags were treated with 4-5 kGy, a dose that already leads to sterile polystyrene and polypropylene cups without influencing mechanical characteristics of the packaging material.

Reliability of high I/O high density CCGA interconnect electronic packages under extreme thermal environments

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2012-03-01

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surfacemount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions.

Electronic packaging: new results in singulation by Laser Microjet

NASA Astrophysics Data System (ADS)

Wagner, Frank; Sibailly, Ochelio; Richerzhagen, Bernold

2004-07-01

Cutting electronic packages that are produced in a matrix array fashion is an important process and deals with the ready-to-use devices. Thus an increase in the singulation yield is directly correlated to an increase in benefit. Due to the usage of different substrate materials, the saws encounter big problems in terms of lifetime and constancy of cut quality in these applications. Today"s equipment manufacturers are not yet in the position to propose an adequate solution for all types of packages. Compared to classical laser cutting, the water-jet guided laser technology minimizes the heat damages in any kind of sample. This new material processing method consists in guiding a laser beam inside a hair thin, lowpressure water-jet by total internal reflection, and is applied to package singulation since two years approximately. Using a frequency doubled Nd:YAG laser guided by a water jet, an LTCC-ceramics based package is singulated according to a scribe and break process. Speeds of 2-10 mm/s are reached in the LTTC and 40 mm/s in the mold compound. The process is wear-free and provides very good edge quality of the LTCC and the mold compound as well as reliable separation of the packages.

Water-soluble nanocrystalline cellulose films with highly transparent and oxygen barrier properties

NASA Astrophysics Data System (ADS)

Cheng, Shaoling; Zhang, Yapei; Cha, Ruitao; Yang, Jinliang; Jiang, Xingyu

2015-12-01

By mixing a guar gum (GG) solution with a nanocrystalline cellulose (NCC) dispersion using a novel circular casting technology, we manufactured biodegradable films as packaging materials with improved optical and mechanical properties. These films could act as barriers for oxygen and could completely dissolve in water within 5 h. We also compared the effect of nanocomposite films and commercial food packaging materials on the preservation of food.By mixing a guar gum (GG) solution with a nanocrystalline cellulose (NCC) dispersion using a novel circular casting technology, we manufactured biodegradable films as packaging materials with improved optical and mechanical properties. These films could act as barriers for oxygen and could completely dissolve in water within 5 h. We also compared the effect of nanocomposite films and commercial food packaging materials on the preservation of food. Electronic supplementary information (ESI) available. See DOI: 10.1039/c5nr07647a

Electronic Principles VI, 7-10. Military Curriculum Materials for Vocational and Technical Education.

ERIC Educational Resources Information Center

Ohio State Univ., Columbus. National Center for Research in Vocational Education.

This sixth of 10 blocks of student and teacher materials for a secondary/postsecondary level course in electronic principles comprises one of a number of military-developed curriculum packages selected for adaptation to vocational instruction and curriculum development in a civilian setting. Prerequisites are the previous blocks. This block on…

Electronic Principles IV, 7-8. Military Curriculum Materials for Vocational and Technical Education.

ERIC Educational Resources Information Center

Ohio State Univ., Columbus. National Center for Research in Vocational Education.

This fourth of 10 blocks of student and teacher materials for a secondary/postsecondary level course in electronic principles comprises one of a number of military-developed curriculum packages selected for adaptation to vocational instruction and curriculum development in a civilian setting. Prerequisites are the previous blocks. This block on…

Electronic Principles VIII, 7-12. Military Curriculum Materials for Vocational and Technical Education.

ERIC Educational Resources Information Center

Ohio State Univ., Columbus. National Center for Research in Vocational Education.

This eighth of 10 blocks of student and teacher materials for a secondary/postsecondary level course in electronic principles comprises one of a number of military-developed curriculum packages selected for adaptation to vocational instruction and curriculum development in a civilian setting. Prerequisites are the previous blocks. This block on…

Electronic Principles III, 7-7. Military Curriculum Materials for Vocational and Technical Education.

ERIC Educational Resources Information Center

Ohio State Univ., Columbus. National Center for Research in Vocational Education.

This third of 10 blocks of student and teacher materials for a secondary/postsecondary level course in electronics principles comprises one of a number of military-developed curriculum packages selected for adaptation to vocational instruction and curriculum development in a civilian setting. Prerequisites are the previous blocks. This block on…

Electronic Principles IX, 7-13. Military Curriculum Materials for Vocational and Technical Education.

ERIC Educational Resources Information Center

Ohio State Univ., Columbus. National Center for Research in Vocational Education.

This ninth of 10 blocks of student and teacher materials for a secondary/postsecondary level course in electronic principles comprises one of a number of military-developed curriculum packages selected for adaptation to vocational instruction and curriculum development in a civilian setting. Prerequisites are the previous blocks. This block on…

Electronic Principles X, 7-14. Military Curriculum Materials for Vocational and Technical Education.

ERIC Educational Resources Information Center

Ohio State Univ., Columbus. National Center for Research in Vocational Education.

This tenth of 10 blocks of student and teacher materials for a secondary/postsecondary level course in electronic principles comprises one of a number of military-developed curriculum packages selected for adaptation to vocational instruction and curriculum development in a civilian setting. Prerequisites are the previous blocks. This block on…

Inhibition of Listeria monocytogenes in Fresh Cheese Using Chitosan-Grafted Lactic Acid Packaging.

PubMed

Sandoval, Laura N; López, Monserrat; Montes-Díaz, Elizabeth; Espadín, Andres; Tecante, Alberto; Gimeno, Miquel; Shirai, Keiko

2016-04-08

A chitosan from biologically obtained chitin was successfully grafted with d,l-lactic acid (LA) in aqueous media using p-toluenesulfonic acid as catalyst to obtain a non-toxic, biodegradable packaging material that was characterized using scanning electron microscopy, water vapor permeability, and relative humidity (RH) losses. Additionally, the grafting in chitosan with LA produced films with improved mechanical properties. This material successfully extended the shelf life of fresh cheese and inhibited the growth of Listeria monocytogenes during 14 days at 4 °C and 22% RH, whereby inoculated samples with chitosan-g-LA packaging presented full bacterial inhibition. The results were compared to control samples and commercial low-density polyethylene packaging.

Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment.

PubMed

Jeong, Seung Hee; Chen, Si; Huo, Jinxing; Gamstedt, Erik Kristofer; Liu, Johan; Zhang, Shi-Li; Zhang, Zhi-Bin; Hjort, Klas; Wu, Zhigang

2015-12-16

Stretchable electronics and soft robotics have shown unsurpassed features, inheriting remarkable functions from stretchable and soft materials. Electrically conductive and mechanically stretchable materials based on composites have been widely studied for stretchable electronics as electrical conductors using various combinations of materials. However, thermally tunable and stretchable materials, which have high potential in soft and stretchable thermal devices as interface or packaging materials, have not been sufficiently studied. Here, a mechanically stretchable and electrically insulating thermal elastomer composite is demonstrated, which can be easily processed for device fabrication. A liquid alloy is embedded as liquid droplet fillers in an elastomer matrix to achieve softness and stretchability. This new elastomer composite is expected useful to enhance thermal response or efficiency of soft and stretchable thermal devices or systems. The thermal elastomer composites demonstrate advantages such as thermal interface and packaging layers with thermal shrink films in transient and steady-state cases and a stretchable temperature sensor.

Superlattice structure modeling and simulation of High Electron Mobility Transistor for improved performance

NASA Astrophysics Data System (ADS)

Munusami, Ravindiran; Yakkala, Bhaskar Rao; Prabhakar, Shankar

2013-12-01

Magnetic tunnel junction were made by inserting the magnetic materials between the source, channel and the drain of the High Electron Mobility Transistor (HEMT) to enhance the performance. Material studio software package was used to design the superlattice layers. Different cases were analyzed to optimize the performance of the device by placing the magnetic material at different positions of the device. Simulation results based on conductivity reveals that the device has a very good electron transport due to the magnetic materials and will amplify very low frequency signals.

Status and Trend of Automotive Power Packaging

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liang, Zhenxian

2012-01-01

Comprehensive requirements in aspects of cost, reliability, efficiency, form factor, weight, and volume for power electronics modules in modern electric drive vehicles have driven the development of automotive power packaging technology intensively. Innovation in materials, interconnections, and processing techniques is leading to enormous improvements in power modules. In this paper, the technical development of and trends in power module packaging are evaluated by examining technical details with examples of industrial products. The issues and development directions for future automotive power module packaging are also discussed.

Electronic Principles V, 7-9. Military Curriculum Materials for Vocational and Technical Education.

ERIC Educational Resources Information Center

Ohio State Univ., Columbus. National Center for Research in Vocational Education.

This fifth of 10 blocks of student and teacher materials for a postsecondary level course in electronic principles comprises one of a number of military-developed curriculum packages selected for adaptation to vocational instruction and curriculum development in a civilian setting. Prerequisites are the previous blocks. This block on solid state…

Advanced Sensor and Packaging Technologies for Intelligent Adaptive Engine Controls (Preprint)

DTIC Science & Technology

2013-05-01

combination of micro-electromechanical systems (MEMS) sensor technology, novel ceramic materials, high - temperature electronics, and advanced harsh...with simultaneous pressure measurements up to 1,000 psi. The combination of a high - temperature , high -pressure-ratio compressor system, and adaptive...combination of micro-electromechanical systems (MEMS) sensor technology, novel ceramic materials, high temperature electronics, and advanced harsh

Electronic Principles II, 7-6. Military Curriculum Materials for Vocational and Technical Education.

ERIC Educational Resources Information Center

Ohio State Univ., Columbus. National Center for Research in Vocational Education.

This second of 10 blocks of student and teacher materials for a secondary/postsecondary level course in electronic principles comprises one of a number of military-developed curriculum packages selected for adaptation to vocational instruction and curriculum development in a civilian setting. A prerequisite is the previous block. This block on AC…

Electronic Principles I, 7-5. Military Curriculum Materials for Vocational and Technical Education.

ERIC Educational Resources Information Center

Ohio State Univ., Columbus. National Center for Research in Vocational Education.

This first of 10 blocks of student and teacher materials for a secondary/postsecondary level course in electronic principles comprises one of a number of military-developed curriculum packages selected for adaptation to vocational instruction and curriculum development in a civilian setting. This block on DC circuits contains nine modules covering…

Characterizing the temperature dependence of electronic packaging-material properties

NASA Astrophysics Data System (ADS)

Fu, Chia-Yu; Ume, Charles

1995-06-01

A computer-controlled, temperature-dependent material characterization system has been developed for thermal deformation analysis in electronic packaging applications, especially for printed wiring assembly warpage study. For fiberglass-reinforced epoxy (FR-4 type) material, the Young's moduli decrease to as low as 20-30% of the room-temperature values, while the shear moduli decrease to as low as 60-70% of the room-temperature values. The electrical resistance strain gage technique was used in this research. The test results produced overestimated values in property measurements, and this was shown in a case study. A noncontact strau]n measurement technique (laser extensometer) is now being used to measure these properties. Discrepancies of finite-element warpage predictions using different property values increase as the temperature increases from the stress-free temperature.

Fully Packaged Carbon Nanotube Supercapacitors by Direct Ink Writing on Flexible Substrates.

PubMed

Chen, Bolin; Jiang, Yizhou; Tang, Xiaohui; Pan, Yayue; Hu, Shan

2017-08-30

The ability to print fully packaged integrated energy storage components (e.g., supercapacitors) is of critical importance for practical applications of printed electronics. Due to the limited variety of printable materials, most studies on printed supercapacitors focus on printing the electrode materials but rarely the full-packaged cell. This work presents for the first time the printing of a fully packaged single-wall carbon nanotube-based supercapacitor with direct ink writing (DIW) technology. Enabled by the developed ink formula, DIW setup, and cell architecture, the whole printing process is mask free, transfer free, and alignment free with precise and repeatable control on the spatial distribution of all constituent materials. Studies on cell design show that a wider electrode pattern and narrower gap distance between electrodes lead to higher specific capacitance. The as-printed fully packaged supercapacitors have energy and power performances that are among the best in recently reported planar carbon-based supercapacitors that are only partially printed or nonprinted.

Study of the Fracture Mechanisms of Electroplated Metallization Systems Using In Situ Microtension Test

NASA Astrophysics Data System (ADS)

Msolli, Sabeur; Kim, Heung Soo

2018-07-01

This framework assesses the mechanical behavior of some potential thin/thick metallization systems in use as either ohmic contacts for diamond semi-conductors or for metallization on copper double bounded ceramic substrates present in the next-generation power electronics packaging. The interesting and unique characteristic of this packaging is the use of diamond as a semi-conductor material instead of silicon to increase the lifetime of embedded power converters for use in aeronautical applications. Theoretically, such packaging is able to withstand temperatures of up to 300 °C without breaking the semi-conductor, provided that the constitutive materials of the packaging are compatible. Metallization is very important to protect the chips and substrates. Therefore, we address this issue in the present work. The tested metallization systems are Ni/Au, Ni/Cr/Au and Ni/Cr. These specific systems were studied since they can be used in conjunction with existing bonding technologies, including AuGe soldering, Ag-In Transient liquid Phase Bonding and silver nanoparticle sintering. The metallization is achieved via electrodeposition, and a mechanical test, consisting of a microtension technique, is carried out at room temperature inside a scanning electron microscopy chamber. The technique permits observations the cracks initiation and growth in the metallization to locate the deformation zones and identify the fracture mechanisms. Different failure mechanisms were shown to occur depending on the metallic layers deposited on top of the copper substrate. The density of these cracks depends on the imposed load and the involved metallization. These observations will help choose the metallization that is compatible with the particular bonding material, and manage mechanical stress due to thermal cycling so that they can be used as a constitutive component for high-temperature power electronics packaging.

Study of the Fracture Mechanisms of Electroplated Metallization Systems Using In Situ Microtension Test

NASA Astrophysics Data System (ADS)

Msolli, Sabeur; Kim, Heung Soo

2018-03-01

This framework assesses the mechanical behavior of some potential thin/thick metallization systems in use as either ohmic contacts for diamond semi-conductors or for metallization on copper double bounded ceramic substrates present in the next-generation power electronics packaging. The interesting and unique characteristic of this packaging is the use of diamond as a semi-conductor material instead of silicon to increase the lifetime of embedded power converters for use in aeronautical applications. Theoretically, such packaging is able to withstand temperatures of up to 300 °C without breaking the semi-conductor, provided that the constitutive materials of the packaging are compatible. Metallization is very important to protect the chips and substrates. Therefore, we address this issue in the present work. The tested metallization systems are Ni/Au, Ni/Cr/Au and Ni/Cr. These specific systems were studied since they can be used in conjunction with existing bonding technologies, including AuGe soldering, Ag-In Transient liquid Phase Bonding and silver nanoparticle sintering. The metallization is achieved via electrodeposition, and a mechanical test, consisting of a microtension technique, is carried out at room temperature inside a scanning electron microscopy chamber. The technique permits observations the cracks initiation and growth in the metallization to locate the deformation zones and identify the fracture mechanisms. Different failure mechanisms were shown to occur depending on the metallic layers deposited on top of the copper substrate. The density of these cracks depends on the imposed load and the involved metallization. These observations will help choose the metallization that is compatible with the particular bonding material, and manage mechanical stress due to thermal cycling so that they can be used as a constitutive component for high-temperature power electronics packaging.

Barrier layers against oxygen transmission on the basis of electron beam cured methacrylated gelatin

NASA Astrophysics Data System (ADS)

Scherzer, Tom

1997-08-01

The development of barrier layers against oxygen transmission on the basis of radiation-curable methacrylated gelatin will be reported. The electron beam cured gelatin coatings show an extremely low oxygen permeability and a high resistance against boiling water. Moreover, the methacrylated gelatins possess good adhesion characteristics. Therefore, they are suited as barrier adhesives in laminates for food packaging applications. If substrate foils from biodegradable polymers are used, the development of completely biodegradable packaging materials seems to be possible.

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Hunter, Gary W.; Neudeck, Philip G.

2001-01-01

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Military Curriculum Materials for Vocational and Technical Education. Miniature/Microminiature Electronics Repair. CNTT W-100-0034B. Classroom Course 7-15.

ERIC Educational Resources Information Center

Ohio State Univ., Columbus. National Center for Research in Vocational Education.

These instructor materials (curriculum outline, lesson plans) and student guide for a high school-postsecondary level course in miniature/microminiature electronic repair are one of a number of military-developed curriculum packages selected for adaptation to vocational instruction and curriculum development in a civilian setting. The course…

FOREWORD: Proceedings of the 39th International Microelectronics and Packaging IMAPS Poland Conference

NASA Astrophysics Data System (ADS)

Jasiński, Piotr; Górecki, Krzysztof; Bogdanowicz, Robert

2016-01-01

These proceedings are a collection of the selected articles presented at the 39th International Microelectronics and Packaging IMAPS Poland Conference, held in Gdansk, Poland on September 20-23, 2015 (IMAPS Poland 2015). The conference has been held under the scientific patronage of the International Microelectronics and Packaging Society Poland Chapter and the Committee of Electronics and Telecommunication, Polish Academy of Science and jointly hosted by the Gdansk University of Technology, Faculty of Electronics, Telecommunication and Informatics (GUT) and the Gdynia Maritime University, Faculty of Electrical Engineering (GMU). The IMAPS Poland conference series aims to advance interdisciplinary scientific information exchange and the discussion of the science and technology of advanced electronics. The IMAPS Poland 2015 conference took place in the heart of Gdansk, two minutes walking distance from the beach. The surroundings and location of the venue guaranteed excellent working and leisure conditions. The three-day conference highlighted invited talks by outstanding scientists working in important areas of electronics and electronic material science. The eight sessions covered areas in the fields of electronics packaging, interconnects on PCB, Low Temperature Co-fired Ceramic (LTCC), MEMS devices, transducers, sensors and modelling of electronic devices. The conference was attended by 99 participants from 11 countries. The conference schedule included 18 invited presentations and 78 poster presentations.

Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2012-01-01

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment

PubMed Central

Jeong, Seung Hee; Chen, Si; Huo, Jinxing; Gamstedt, Erik Kristofer; Liu, Johan; Zhang, Shi-Li; Zhang, Zhi-Bin; Hjort, Klas; Wu, Zhigang

2015-01-01

Stretchable electronics and soft robotics have shown unsurpassed features, inheriting remarkable functions from stretchable and soft materials. Electrically conductive and mechanically stretchable materials based on composites have been widely studied for stretchable electronics as electrical conductors using various combinations of materials. However, thermally tunable and stretchable materials, which have high potential in soft and stretchable thermal devices as interface or packaging materials, have not been sufficiently studied. Here, a mechanically stretchable and electrically insulating thermal elastomer composite is demonstrated, which can be easily processed for device fabrication. A liquid alloy is embedded as liquid droplet fillers in an elastomer matrix to achieve softness and stretchability. This new elastomer composite is expected useful to enhance thermal response or efficiency of soft and stretchable thermal devices or systems. The thermal elastomer composites demonstrate advantages such as thermal interface and packaging layers with thermal shrink films in transient and steady-state cases and a stretchable temperature sensor. PMID:26671673

MOlecular MAterials Property Prediction Package (MOMAP) 1.0: a software package for predicting the luminescent properties and mobility of organic functional materials

NASA Astrophysics Data System (ADS)

Niu, Yingli; Li, Wenqiang; Peng, Qian; Geng, Hua; Yi, Yuanping; Wang, Linjun; Nan, Guangjun; Wang, Dong; Shuai, Zhigang

2018-04-01

MOlecular MAterials Property Prediction Package (MOMAP) is a software toolkit for molecular materials property prediction. It focuses on luminescent properties and charge mobility properties. This article contains a brief descriptive introduction of key features, theoretical models and algorithms of the software, together with examples that illustrate the performance. First, we present the theoretical models and algorithms for molecular luminescent properties calculation, which includes the excited-state radiative/non-radiative decay rate constant and the optical spectra. Then, a multi-scale simulation approach and its algorithm for the molecular charge mobility are described. This approach is based on hopping model and combines with Kinetic Monte Carlo and molecular dynamics simulations, and it is especially applicable for describing a large category of organic semiconductors, whose inter-molecular electronic coupling is much smaller than intra-molecular charge reorganisation energy.

Robust, Rework-able Thermal Electronic Packaging: Applications in High Power TR Modules for Space

NASA Technical Reports Server (NTRS)

Hoffman, James Patrick; Del Castillo, Linda; Hunter, Don; Miller, Jennifer

2012-01-01

The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires improvements in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and are now being implemented side-by-side with more standard technology typically used in flight hardware.

BerkeleyGW: A massively parallel computer package for the calculation of the quasiparticle and optical properties of materials and nanostructures

NASA Astrophysics Data System (ADS)

Deslippe, Jack; Samsonidze, Georgy; Strubbe, David A.; Jain, Manish; Cohen, Marvin L.; Louie, Steven G.

2012-06-01

BerkeleyGW is a massively parallel computational package for electron excited-state properties that is based on the many-body perturbation theory employing the ab initio GW and GW plus Bethe-Salpeter equation methodology. It can be used in conjunction with many density-functional theory codes for ground-state properties, including PARATEC, PARSEC, Quantum ESPRESSO, SIESTA, and Octopus. The package can be used to compute the electronic and optical properties of a wide variety of material systems from bulk semiconductors and metals to nanostructured materials and molecules. The package scales to 10 000s of CPUs and can be used to study systems containing up to 100s of atoms. Program summaryProgram title: BerkeleyGW Catalogue identifier: AELG_v1_0 Program summary URL:http://cpc.cs.qub.ac.uk/summaries/AELG_v1_0.html Program obtainable from: CPC Program Library, Queen's University, Belfast, N. Ireland Licensing provisions: Open source BSD License. See code for licensing details. No. of lines in distributed program, including test data, etc.: 576 540 No. of bytes in distributed program, including test data, etc.: 110 608 809 Distribution format: tar.gz Programming language: Fortran 90, C, C++, Python, Perl, BASH Computer: Linux/UNIX workstations or clusters Operating system: Tested on a variety of Linux distributions in parallel and serial as well as AIX and Mac OSX RAM: (50-2000) MB per CPU (Highly dependent on system size) Classification: 7.2, 7.3, 16.2, 18 External routines: BLAS, LAPACK, FFTW, ScaLAPACK (optional), MPI (optional). All available under open-source licenses. Nature of problem: The excited state properties of materials involve the addition or subtraction of electrons as well as the optical excitations of electron-hole pairs. The excited particles interact strongly with other electrons in a material system. This interaction affects the electronic energies, wavefunctions and lifetimes. It is well known that ground-state theories, such as standard methods based on density-functional theory, fail to correctly capture this physics. Solution method: We construct and solve the Dyson's equation for the quasiparticle energies and wavefunctions within the GW approximation for the electron self-energy. We additionally construct and solve the Bethe-Salpeter equation for the correlated electron-hole (exciton) wavefunctions and excitation energies. Restrictions: The material size is limited in practice by the computational resources available. Materials with up to 500 atoms per periodic cell can be studied on large HPCs. Additional comments: The distribution file for this program is approximately 110 Mbytes and therefore is not delivered directly when download or E-mail is requested. Instead a html file giving details of how the program can be obtained is sent. Running time: 1-1000 minutes (depending greatly on system size and processor number).

Time And Temperature Dependent Micromechanical Properties Of Solder Joints For 3D-Package Integration

NASA Astrophysics Data System (ADS)

Roellig, Mike; Meier, Karsten; Metasch, Rene

2010-11-01

The recent development of 3D-integrated electronic packages is characterized by the need to increase the diversity of functions and to miniaturize. Currently many 3D-integration concepts are being developed and all of them demand new materials, new designs and new processing technologies. The combination of simulation and experimental investigation becomes increasingly accepted since simulations help to shorten the R&D cycle time and reduce costs. Numerical calculations like the Finite-Element-Method are strong tools to calculate stress conditions in electronic packages resulting from thermal strains due to the manufacturing process and environmental loads. It is essential for the application of numerical calculations that the material data is accurate and describes sufficiently the physical behaviour. The developed machine allows the measurement of time and temperature dependent micromechanical properties of solder joints. Solder joints, which are used to mechanically and electrically connect different packages, are physically measured as they leave the process. This allows accounting for process influences, which may change material properties. Additionally, joint sizes and metallurgical interactions between solder and under bump metallization can be respected by this particular measurement. The measurement allows the determination of material properties within a temperature range of 20° C-200° C. Further, the time dependent creep deformation can be measured within a strain-rate range of 10-31/s-10-81/s. Solder alloys based on Sn-Ag/Sn-Ag-Cu with additionally impurities and joint sizes down to O/ 200 μm were investigated. To finish the material characterization process the material model coefficient were extracted by FEM-Simulation to increase the accuracy of data.

76 FR 3584 - Time for Payment of Certain Excise Taxes, and Quarterly Excise Tax Payments for Small Alcohol...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-01-20

... 40 Cigars and cigarettes, Claims, Electronic fund transfers, Excise taxes, Labeling, Packaging and..., Regulations.gov , we will post, and you may view, copies of this notice, any electronic or mailed comments we... material that we consider unsuitable for posting. You also may view copies of this notice, any electronic...

Materials Advances for Next-Generation Ingestible Electronic Medical Devices.

PubMed

Bettinger, Christopher J

2015-10-01

Electronic medical implants have collectively transformed the diagnosis and treatment of many diseases, but have many inherent limitations. Electronic implants require invasive surgeries, operate in challenging microenvironments, and are susceptible to bacterial infection and persistent inflammation. Novel materials and nonconventional device fabrication strategies may revolutionize the way electronic devices are integrated with the body. Ingestible electronic devices offer many advantages compared with implantable counterparts that may improve the diagnosis and treatment of pathologies ranging from gastrointestinal infections to diabetes. This review summarizes current technologies and highlights recent materials advances. Specific focus is dedicated to next-generation materials for packaging, circuit design, and on-board power supplies that are benign, nontoxic, and even biodegradable. Future challenges and opportunities are also highlighted. Copyright © 2015 Elsevier Ltd. All rights reserved.

Survival of Spoilage and Pathogenic Microorganisms on Cardboard and Plastic Packaging Materials

PubMed Central

Siroli, Lorenzo; Patrignani, Francesca; Serrazanetti, Diana I.; Chiavari, Cristiana; Benevelli, Marzia; Grazia, Luigi; Lanciotti, Rosalba

2017-01-01

The aim of this work was to study the interaction of corrugated and plastic materials with pathogenic and spoiling microorganisms frequently associated to fresh produce. The effect of the two packaging materials on the survival during the storage of microorganisms belonging to the species Escherichia coli, Listeria monocytogenes, Salmonella enteritidis, Saccharomyces cerevisiae, Lactobacillus plantarum, Pseudomonas fluorescens, and Aspergillus flavus was studied through traditional plate counting and scanning electron microscopy (SEM). The results obtained showed that cardboard materials, if correctly stored, reduced the potential of packaging to cross-contaminate food due to a faster viability loss by spoilage and pathogenic microorganisms compared to the plastic ones. In fact, the cell loads of the pathogenic species considered decreased over time independently on the inoculation level and packaging material used. However, the superficial viability losses were significantly faster in cardboard compared to plastic materials. The same behavior was observed for the spoilage microorganisms considered. The SEM microphotographs indicate that the reduction of superficial contamination on cardboard surfaces was due to the entrapping of the microbial cells within the fibers and the pores of this material. In addition, SEM data showed that the entrapped cells were subjected to more or less rapid lyses, depending on the species, due to the absence of water and nutrients, with the exception of molds. The latter spoilers were able to proliferate inside the cardboard fibers only when the absorption of water was not prevented during the storage. In conclusion, the findings of this work showed the reduction of cross-contamination potential of corrugated compared to plastic packaging materials used in fruit and vegetable sector. However, the findings outlined the importance of hygiene and low humidity during cardboard storage to prevent the mold growth on packaging. PMID:29312271

Proceedings of the Conference on High-temperature Electronics

NASA Technical Reports Server (NTRS)

1981-01-01

The development of electronic devices for use in high temperature environments is addressed. The instrumentational needs of planetary exploration, fossil and nuclear power reactors, turbine engine monitoring, and well logging are defined. Emphasis is place on the fabrication and performance of materials and semiconductor devices, circuits and systems and packaging.

Raman spectroscopy, electronic microscopy and SPME-GC-MS to elucidate the mode of action of a new antimicrobial food packaging material.

PubMed

Clemente, Isabel; Aznar, Margarita; Salafranca, Jesús; Nerín, Cristina

2017-02-01

One critical challenge when developing a new antimicrobial packaging material is to demonstrate the mode of action of the antimicrobials incorporated into the packaging. For this task, several analytical techniques as well as microbiology are required. In this work, the antimicrobial properties of benzyl isothiocyanate, allyl isothiocyanate and essential oils of cinnamon and oregano against several moulds and bacteria have been evaluated. Benzyl isothiocyanate showed the highest antimicrobial activity and it was selected for developing the new active packaging material. Scanning electron microscopy and Raman spectroscopy were successfully used to demonstrate the mode of action of benzyl isothiocyanate on Escherichia coli. Bacteria exhibited external modifications such as oval shape and the presence of septum surface, but they did not show any disruption or membrane damage. To provide data on the in vitro action of benzyl isothiocyanate and the presence of inhibition halos, the transfer mechanism to the cells was assessed using solid-phase microextraction-gas chromatography-mass spectrometry. Based on the transfer system, action mechanism and its stronger antimicrobial activity, benzyl isothiocyanate was incorporated to two kinds of antimicrobial labels. The labels were stable and active for 140 days against two mould producers of ochratoxin A; Penicillium verrucosum is more sensitive than Aspergillus ochraceus. Details about the analytical techniques and the results obtained are shown and discussed. Graphical Abstract Antimicrobial evaluation of pure compounds, incorporation in the packaging and study for mode of action on S. coli by Raman, SEM and SPME-GC-MS.

Broadband Terahertz Refraction Index Dispersion and Loss of Polymeric Dielectric Substrate and Packaging Materials

NASA Astrophysics Data System (ADS)

Motaharifar, E.; Pierce, R. G.; Islam, R.; Henderson, R.; Hsu, J. W. P.; Lee, Mark

2018-01-01

In the effort to push the high-frequency performance of electronic circuits and signal interconnects from millimeter waves to beyond 1 THz, a quantitative knowledge of complex refraction index values and dispersion in potential dielectric substrate, encapsulation, waveguide, and packaging materials becomes critical. Here we present very broadband measurements of the real and imaginary index spectra of four polymeric dielectric materials considered for use in high-frequency electronics: benzocyclobutene (BCB), polyethylene naphthalate (PEN), the photoresist SU-8, and polydimethylsiloxane (PDMS). Reflectance and transmittance spectra from 3 to 75 THz were made using a Fourier transform spectrometer on freestanding material samples. These data were quantitatively analyzed, taking into account multiple partial reflections from front and back surfaces and molecular bond resonances, where applicable, to generate real and imaginary parts of the refraction index as a function of frequency. All materials showed signatures of infrared active organic molecular bond resonances between 10 and 50 THz. Low-loss transmission windows as well as anti-window bands of high dispersion and loss can be readily identified and incorporated into high-frequency design models.

Electron treatment of wood pulp for the viscose process

NASA Astrophysics Data System (ADS)

Stepanik, T. M.; Ewing, D. E.; Whitehouse, R.

2000-03-01

Electron processing is currently being evaluated by several viscose producers for integration into their process. The viscose industry converts dissolving wood pulp into products such as staple fibre, filament, cord, film, packaging, and non-edible sausage casings. These materials are used in the clothing, drapery, hygiene, automobile, food, and packaging industries. Viscose producers are facing increasingly high production costs and stringent environmental regulations that have forced some plants to close. Electron treatment of wood pulp can significantly reduce the amounts of chemicals used for producing viscose and the production of hazardous pollutants. Acsion Industries has worked with companies worldwide to demonstrate the benefits of using electron treated pulp for producing viscose (rayon). This paper describes the viscose process, the benefits of using electron treatment in the viscose process, and Acsion's efforts in developing this technology.

Reliability of emerging bonded interface materials for large-area attachments

DOE PAGES

Paret, Paul P.; DeVoto, Douglas J.; Narumanchi, Sreekant

2015-12-30

In this study, conventional thermal interface materials (TIMs), such as greases, gels, and phase change materials, pose bottlenecks to heat removal and have long caused reliability issues in automotive power electronics packages. Bonded interface materials (BIMs) with superior thermal performance have the potential to be a replacement to the conventional TIMs. However, due to coefficient of thermal expansion mismatches between different components in a package and resultant thermomechanical stresses, fractures or delamination could occur, causing serious reliability concerns. These defects manifest themselves in increased thermal resistance in the package. In this paper, the results of reliability evaluation of emerging BIMsmore » for large-area attachments in power electronics packaging are reported. Thermoplastic (polyamide) adhesive with embedded near-vertical-aligned carbon fibers, sintered silver, and conventional lead solder (Sn 63Pb 37) materials were bonded between 50.8 mm x 50.8 mm cross-sectional footprint silicon nitride substrates and copper base plate samples, and were subjected to accelerated thermal cycling until failure or 2500 cycles. Damage in the BIMs was monitored every 100 cycles by scanning acoustic microscopy. Thermoplastic with embedded carbon fibers performed the best with no defects, whereas sintered silver and lead solder failed at 2300 and 1400 thermal cycles, respectively. Besides thermal cycling, additional lead solder samples were subjected to thermal shock and thermal cycling with extended dwell periods. A finite element method (FEM)-based model was developed to simulate the behavior of lead solder under thermomechanical loading. Strain energy density per cycle results were calculated from the FEM simulations. A predictive lifetime model was formulated for lead solder by correlating strain energy density results extracted from modeling with cycles-to-failure obtained from experimental accelerated tests. A power-law-based approach was used to formulate the - redictive lifetime model.« less

Visualization of electronic density

DOE PAGES

Grosso, Bastien; Cooper, Valentino R.; Pine, Polina; ...

2015-04-22

An atom’s volume depends on its electronic density. Although this density can only be evaluated exactly for hydrogen-like atoms, there are many excellent numerical algorithms and packages to calculate it for other materials. 3D visualization of charge density is challenging, especially when several molecular/atomic levels are intertwined in space. We explore several approaches to 3D charge density visualization, including the extension of an anaglyphic stereo visualization application based on the AViz package to larger structures such as nanotubes. We will describe motivations and potential applications of these tools for answering interesting questions about nanotube properties.

Packaging and Embedded Electronics for the Next Generation

NASA Technical Reports Server (NTRS)

Sampson, Michael J.

2010-01-01

This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

Metastable Packaging For Transient Electronics

DTIC Science & Technology

2014-09-01

dated 16 Jan 09. Report contains color. 14. ABSTRACT Metastable polymeric materials were synthesized, formulated with additives and microcapsules ...photoacid generation, thermal activation, and mechanical rupture of acid-filled microcapsules -- were investigated. 15. SUBJECT TERMS transient...carbonate sulfone) (PVBCS)... 11  3.3  Thermal and Mechanical Triggered Transience of Electronic Devices via Embedded Microcapsules

Sensor Amplifier for the Venus Ground Ambient

NASA Technical Reports Server (NTRS)

DelCastillo, Linda Y.; Johnson, Travis W.; Hatake, Toshiro; Mojarradi, Mohammad M.; Kolawa, Elizabeth A.

2006-01-01

Previous Venus Landers employed high temperature pressure vessels, with thermally protected electronics, to achieve successful missions, with a maximum surface lifetime of 127 minutes. Extending the operating range of electronic systems to the temperatures (480 C) and pressures (90 bar) of the Venus ground ambient would significantly increase the science return of future missions. Toward that end, the current work describes the innovative design of a sensor preamplifier, capable of working in the Venus ground ambient and designed using commercial components (thermionic vacuum tubes, wide band gap transistors, thick film resistors, advanced high temperature capacitors, and monometallic interfaces) To identify commercial components and electronic packaging materials that are capable of operation within the specified environment, a series of active devices, passive components, and packaging materials were screened for operability at 500C, assuming a 10x increase in the mission lifetime. In addition. component degradation as a function of time at 500(deg)C was evaluated. Based on the results of these preliminary evaluations, two amplifiers were developed.

Thermo-Mechanical Analysis for John Deere Electronics Solutions | Advanced

Science.gov Websites

impacts of alternative manufacturing processes Die, package, and interface material analysis for power module reliability Manufacturing process impacts versus thermal cycling impacts on power module

Preparation, characterization and antibacterial applications of ZnO-nanoparticles coated polyethylene films for food packaging.

PubMed

Tankhiwale, Rasika; Bajpai, S K

2012-02-01

The present work describes the preparation of ZnO nanoparticles loaded starch-coated polyethylene film. The presence of ZnO nanoparticles was confirmed by surface plasmon resonance (SPR), X-ray diffraction (XRD) studies and transmission electron microscopy (TEM). The ZnO loaded film was tested for its biocidal action against model bacteria Escherichia coli using zone inhibition and killing kinetics of bacterial growth methods. This newly developed material bears potential to be used as food packaging material to prevent food stuff from bacterial contamination. Copyright © 2011 Elsevier B.V. All rights reserved.

193nm high power lasers for the wide bandgap material processing

NASA Astrophysics Data System (ADS)

Fujimoto, Junichi; Kobayashi, Masakazu; Kakizaki, Koji; Oizumi, Hiroaki; Mimura, Toshio; Matsunaga, Takashi; Mizoguchi, Hakaru

2017-02-01

Recently infrared laser has faced resolution limit of finer micromachining requirement on especially semiconductor packaging like Fan-Out Wafer Level Package (FO-WLP) and Through Glass Via hole (TGV) which are hard to process with less defect. In this study, we investigated ablation rate with deep ultra violet excimer laser to explore its possibilities of micromachining on organic and glass interposers. These results were observed with a laser microscopy and Scanning Electron Microscope (SEM). As the ablation rates of both materials were quite affordable value, excimer laser is expected to be put in practical use for mass production.

Steady-state low thermal resistance characterization apparatus: The bulk thermal tester

DOE Office of Scientific and Technical Information (OSTI.GOV)

Burg, Brian R.; Kolly, Manuel; Blasakis, Nicolas

The reliability of microelectronic devices is largely dependent on electronic packaging, which includes heat removal. The appropriate packaging design therefore necessitates precise knowledge of the relevant material properties, including thermal resistance and thermal conductivity. Thin materials and high conductivity layers make their thermal characterization challenging. A steady state measurement technique is presented and evaluated with the purpose to characterize samples with a thermal resistance below 100 mm{sup 2} K/W. It is based on the heat flow meter bar approach made up by two copper blocks and relies exclusively on temperature measurements from thermocouples. The importance of thermocouple calibration is emphasizedmore » in order to obtain accurate temperature readings. An in depth error analysis, based on Gaussian error propagation, is carried out. An error sensitivity analysis highlights the importance of the precise knowledge of the thermal interface materials required for the measurements. Reference measurements on Mo samples reveal a measurement uncertainty in the range of 5% and most accurate measurements are obtained at high heat fluxes. Measurement techniques for homogeneous bulk samples, layered materials, and protruding cavity samples are discussed. Ultimately, a comprehensive overview of a steady state thermal characterization technique is provided, evaluating the accuracy of sample measurements with thermal resistances well below state of the art setups. Accurate characterization of materials used in heat removal applications, such as electronic packaging, will enable more efficient designs and ultimately contribute to energy savings.« less

Stress Intensity of Delamination in a Sintered-Silver Interconnection: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

DeVoto, D. J.; Paret, P. P.; Wereszczak, A. A.

2014-08-01

In automotive power electronics packages, conventional thermal interface materials such as greases, gels, and phase-change materials pose bottlenecks to heat removal and are also associated with reliability concerns. The industry trend is toward high thermal performance bonded interfaces for large-area attachments. However, because of coefficient of thermal expansion mismatches between materials/layers and resultant thermomechanical stresses, adhesive and cohesive fractures could occur, posing a reliability problem. These defects manifest themselves in increased thermal resistance. This research aims to investigate and improve the thermal performance and reliability of sintered-silver for power electronics packaging applications. This has been experimentally accomplished by the synthesismore » of large-area bonded interfaces between metalized substrates and copper base plates that have subsequently been subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. A description of the experiment and the modeling approach are discussed.« less

Halloysite Nanocapsules Containing Thyme Essential Oil: Preparation, Characterization, and Application in Packaging Materials.

PubMed

Jang, Si-Hoon; Jang, So-Ri; Lee, Gyeong-Min; Ryu, Jee-Hoon; Park, Su-Il; Park, No-Hyung

2017-09-01

Halloysite nanotubes (HNTs), which are natural nanomaterials, have a hollow tubular structure with about 15 nm inner and 50 nm outer diameters. Because of their tubular shape, HNTs loaded with various materials have been investigated as functional nanocapsules. In this study, thyme essential oil (TO) was encapsulated successfully in HNTs using vacuum pulling methods, followed by end-capping or a layer-by-layer surface coating process for complete encapsulation. Nanocapsules loaded with TO were mixed with flexographic ink and coated on a paper for applications as food packaging materials. Scanning electron microscopy and transmission electron microscopy were used to characterize the morphology of the nanocapsules and to confirm the TO loading of the nanocapsules. Fourier transform infrared spectroscopy and thermogravimetric analyses analysis were used to complement the structural information. In addition, the controlled release of TO from the nanocapsules showed sustained release properties over a period of many days. The results reveal that the release properties of TO in these nanocapsules could be controlled by surface modifications such as end-capping and/or surface coating of bare nanocapsules. The packaging paper with TO-loaded HNT capsules was effective in eliminating against Escherichia coli during the first 5 d and showed strong antibacterial activity for about 10 d. © 2017 Institute of Food Technologists®.

Ultra-thin layer packaging for implantable electronic devices

NASA Astrophysics Data System (ADS)

Hogg, A.; Aellen, T.; Uhl, S.; Graf, B.; Keppner, H.; Tardy, Y.; Burger, J.

2013-07-01

State of the art packaging for long-term implantable electronic devices generally uses reliable metal and glass housings; however, these are limited in the miniaturization potential and cost reduction. This paper focuses on the development of biocompatible hermetic thin-film packaging based on poly-para-xylylene (Parylene-C) and silicon oxide (SiOx) multilayers for smart implantable microelectromechanical systems (MEMS) devices. For the fabrication, a combined Parylene/SiOx single-chamber deposition system was developed. Topological aspects of multilayers were characterized by atomic force microscopy and scanning electron microscopy. Material compositions and layer interfaces were analyzed by Fourier transform infrared spectrometry and x-ray photoelectron spectroscopy. To evaluate the multilayer corrosion protection, water vapor permeation was investigated using a calcium mirror test. The calcium mirror test shows very low water permeation rates of 2 × 10-3 g m-2 day-1 (23 °C, 45% RH) for a 4.7 µm multilayer, which is equivalent to a 1.9 mm pure Parylene-C coating. According to the packaging standard MIL-STD-883, the helium gas tightness was investigated. These helium permeation measurements predict that a multilayer of 10 µm achieves the hermeticity acceptance criterion required for long-term implantable medical devices.

Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications

PubMed Central

Maxa, Jacob; Novikov, Andrej; Nowottnick, Mathias

2017-01-01

Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce the on-chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic components on printed circuit boards or electronic assemblies that is able to buffer a certain amount of thermal energy, dissipated from a device. The idea is to suppress temperature peaks in electronic components during load peaks or electronic shorts, which otherwise could damage or destroy the device, by using a phase change material to buffer the thermal energy. The phase change material coating could be directly applied on the chip package or the PCB using different mechanical retaining jigs.

Thermal interface material characterization for cryogenic electronic packaging solutions

NASA Astrophysics Data System (ADS)

Dillon, A.; McCusker, K.; Van Dyke, J.; Isler, B.; Christiansen, M.

2017-12-01

As applications of superconducting logic technologies continue to grow, the need for efficient and reliable cryogenic packaging becomes crucial to development and testing. A trade study of materials was done to develop a practical understanding of the properties of interface materials around 4 K. While literature exists for varying interface tests, discrepancies are found in the reported performance of different materials and in the ranges of applied force in which they are optimal. In considering applications extending from top cooling a silicon chip to clamping a heat sink, a range of forces from approximately 44 N to approximately 445 N was chosen for testing different interface materials. For each range of forces a single material was identified to optimize the thermal conductance of the joint. Of the tested interfaces, indium foil clamped at approximately 445 N showed the highest thermal conductance. Results are presented from these characterizations and useful methodologies for efficient testing are defined.

Packaging Technologies for 500C SiC Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2013-01-01

Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

Structural and thermodynamic principles of viral packaging.

PubMed

Petrov, Anton S; Harvey, Stephen C

2007-01-01

Packaging of genetic material inside a capsid is one of the major processes in the lifecycle of bacteriophages. To establish the basic principles of packing double-stranded DNA into a phage, we present a low-resolution model of bacteriophage varphi29 and report simulations of DNA packaging. The simulations show excellent agreement with available experimental data, including the forces of packaging and the average structures seen in cryo-electron microscopy. The conformation of DNA inside the bacteriophage is primarily determined by the shape of the capsid and the elastic properties of DNA, but the energetics of packaging are dominated by electrostatic repulsions and the large entropic penalty associated with DNA confinement. In this slightly elongated capsid, the DNA assumes a folded toroidal conformation, rather than a coaxial spool. The model can be used to study packaging of other bacteriophages with different shapes under a range of environmental conditions.

49 CFR 173.473 - Requirements for foreign-made packages.

Code of Federal Regulations, 2010 CFR

2010-10-01

...-3650, or by electronic mail (e-mail) to “[email protected]” If the offeror is requesting the... Transport of Radioactive Material, No. TS-R-1, ” (IBR, see § 171.7 of this subchapter) shall also comply...) 366-3753 or (202) 366-3650, or by electronic mail to “[email protected]” Each request is considered in...

Shock-isolation material selection for electronic packages in hard-target environment

DOE Office of Scientific and Technical Information (OSTI.GOV)

Stotts, Jarrett Eugene

High velocity munitions and kinetic penetrators experience monumental external forces, impulses, and accelerations. The hard target environment is immensely taxing on sophisticated electronic components and recorders designed to retrieve valuable data related to the systems performance and characteristics in the periods of flight, impact, and post-impact. Such electronic systems have upper limits of overall shock intensity which, if exceeded, will either shorten the operating life of the parts or risk destruction resulting in loss of both the data and the principal value of the recorder. The focus of this project was to refine the categorization of leading material types formore » encapsulation and passive shock isolation and implement them in a method useable for a wide variety of environments. Namely, a design methodology capable of being tailored to the specific impact conditions to maximize the lively hood of sensitive electronics and the information recorded. The results of the study concluded that the materials observed under consistent dynamic high strain rate tests, which include Conathane® EN-4/9, Slygard®-184, and Stycast™-2651, behaved well in certain aspects of energy transmission and shock when considering the frequency environment or package coupled with the isolation material’s application. Key points about the implementation of the materials in extreme shock environments is discussed with the connection to energy analysis, loss attributes, and pulse transmissibility modeling. However, attempts to model the materials solely based on energy transmissibility in the frequency domain using only external experimental data and simplified boundary conditions was not found to be consistent with that acquired from the pressure bar experiments. Further work will include the addition of further material experimentation of the encapsulants in other frequency and temperature states, confined and pre-load boundary states, and composite constructions.« less

77 FR 31815 - Hazardous Materials Regulations: Combustible Liquids

Federal Register 2010, 2011, 2012, 2013, 2014

2012-05-30

... are: Safety (hazard communication and packaging integrity); International commerce (frustration/delay... exempt seasonal workers from the Federal Motor Carrier Safety Administration's Commercial Driver's...: Anyone is able to search the electronic form of any written communications and comments received into any...

Thermal cycling fatigue of organic thermal interface materials using a thermal-displacement measurement technique

NASA Astrophysics Data System (ADS)

Steill, Jason Scott

The long term reliability of polymer-based thermal interface materials (TIM) is essential for modern electronic packages which require robust thermal management. The challenge for today's materials scientists and engineers is to maximize the heat flow from integrated circuits through a TIM and out the heat sink. Thermal cycling of the electronic package and non-uniformity in the heat flux with respect to the plan area can lead to void formation and delamination which re-introduces inefficient heat transfer. Measurement and understanding at the nano-scale is essential for TIM development. Finding and documenting the evolution of the defects is dependent upon a full understanding of the thermal probes response to changing environmental conditions and the effects of probe usage. The response of the thermal-displacement measurement technique was dominated by changes to the environment. Accurate measurement of the thermal performance was hindered by the inability to create a model system and control the operating conditions. This research highlights the need for continued study into the probe's thermal and mechanical response using tightly controlled test conditions.

Advanced CMOS Radiation Effects Testing and Analysis

NASA Technical Reports Server (NTRS)

Pellish, J. A.; Marshall, P. W.; Rodbell, K. P.; Gordon, M. S.; LaBel, K. A.; Schwank, J. R.; Dodds, N. A.; Castaneda, C. M.; Berg, M. D.; Kim, H. S.;

Reusable Rapid Prototyped Blunt Impact Simulator

DTIC Science & Technology

2016-08-01

for a nonclassical gun experimental application. 15. SUBJECT TERMS rapid prototype, additive manufacturing, reusable projectile, 3-axis accelerometer... gun -launched applications.1,2 SLS technology uses a bed of powdered material that is introduced to a laser. The laser is controlled by a computer to...in creating internal gun -hardened electronics for a variety of high-g applications, GTB developed an internal electronics package containing a COTS

Digital Savings: A Study of Academic Libraries Finds that Going from Print to Electronic Journals Can Save Money, if It's Done Right, but Challenges Remain

ERIC Educational Resources Information Center

Schonfeld, Roger C.; Fenton, Eileen Gifford

2005-01-01

Without question, the ongoing transition from print to electronic periodicals has challenged librarians to rethink their strategies. While some effects of this change have been immediately apparent--greater breadth of material, easier access, exposure to new sources, publisher package deals, and open access--the broader outcomes on library…

Cooling system for electronic components

DOEpatents

Anderl, William James; Colgan, Evan George; Gerken, James Dorance; Marroquin, Christopher Michael; Tian, Shurong

2015-12-15

Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

Cooling system for electronic components

DOEpatents

Anderl, William James; Colgan, Evan George; Gerken, James Dorance; Marroquin, Christopher Michael; Tian, Shurong

2016-05-17

Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

49 CFR 173.459 - Mixing of fissile material packages with non-fissile or fissile-excepted material packages.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 49 Transportation 2 2012-10-01 2012-10-01 false Mixing of fissile material packages with non... (Radioactive) Materials § 173.459 Mixing of fissile material packages with non-fissile or fissile-excepted material packages. Mixing of fissile material packages with other types of Class 7 (radioactive) materials...

49 CFR 173.459 - Mixing of fissile material packages with non-fissile or fissile-excepted material packages.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 49 Transportation 2 2013-10-01 2013-10-01 false Mixing of fissile material packages with non... (Radioactive) Materials § 173.459 Mixing of fissile material packages with non-fissile or fissile-excepted material packages. Mixing of fissile material packages with other types of Class 7 (radioactive) materials...

49 CFR 173.459 - Mixing of fissile material packages with non-fissile or fissile-excepted material packages.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 49 Transportation 2 2011-10-01 2011-10-01 false Mixing of fissile material packages with non... (Radioactive) Materials § 173.459 Mixing of fissile material packages with non-fissile or fissile-excepted material packages. Mixing of fissile material packages with other types of Class 7 (radioactive) materials...

49 CFR 173.459 - Mixing of fissile material packages with non-fissile or fissile-excepted material packages.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false Mixing of fissile material packages with non... (Radioactive) Materials § 173.459 Mixing of fissile material packages with non-fissile or fissile-excepted material packages. Mixing of fissile material packages with other types of Class 7 (radioactive) materials...

49 CFR 173.459 - Mixing of fissile material packages with non-fissile or fissile-excepted material packages.

Code of Federal Regulations, 2014 CFR

2014-10-01

... 49 Transportation 2 2014-10-01 2014-10-01 false Mixing of fissile material packages with non... (Radioactive) Materials § 173.459 Mixing of fissile material packages with non-fissile or fissile-excepted material packages. Mixing of fissile material packages with other types of Class 7 (radioactive) materials...

ANITA-2000 activation code package - updating of the decay data libraries and validation on the experimental data of the 14 MeV Frascati Neutron Generator

NASA Astrophysics Data System (ADS)

Frisoni, Manuela

2016-03-01

ANITA-2000 is a code package for the activation characterization of materials exposed to neutron irradiation released by ENEA to OECD-NEADB and ORNL-RSICC. The main component of the package is the activation code ANITA-4M that computes the radioactive inventory of a material exposed to neutron irradiation. The code requires the decay data library (file fl1) containing the quantities describing the decay properties of the unstable nuclides and the library (file fl2) containing the gamma ray spectra emitted by the radioactive nuclei. The fl1 and fl2 files of the ANITA-2000 code package, originally based on the evaluated nuclear data library FENDL/D-2.0, were recently updated on the basis of the JEFF-3.1.1 Radioactive Decay Data Library. This paper presents the results of the validation of the new fl1 decay data library through the comparison of the ANITA-4M calculated values with the measured electron and photon decay heats and activities of fusion material samples irradiated at the 14 MeV Frascati Neutron Generator (FNG) of the NEA-Frascati Research Centre. Twelve material samples were considered, namely: Mo, Cu, Hf, Mg, Ni, Cd, Sn, Re, Ti, W, Ag and Al. The ratios between calculated and experimental values (C/E) are shown and discussed in this paper.

NASA Electronic Parts and Packaging Program

NASA Technical Reports Server (NTRS)

Kayali, Sammy

2000-01-01

NEPP program objectives are to: (1) Access the reliability of newly available electronic parts and packaging technologies for usage on NASA projects through validations, assessments, and characterizations, and the development of test methods/tools; (2)Expedite infusion paths for advanced (emerging) electronic parts and packaging technologies by evaluations of readiness for manufacturability and project usage consideration; (3) Provide NASA projects with technology selection, application, and validation guidelines for electronic parts and packaging hardware and processes; nd (4) Retain and disseminate electronic parts and packaging quality assurance, reliability validations, tools, and availability information to the NASA community.

U.S. Navy Advanced Receiving: A Better Approach to the Basics.

DTIC Science & Technology

1987-04-01

the Navy and DLA should begin now to plan for electronic interchange of data between their inventory management systems. This would eliminate the...labor savings from work simplification, improved material handling, and better work load planning 0 Material savings from reduced packaging and use of... planning purposes, source distribution managers use the following equa- tion to determine maximum consolidation time: Maximum consolidation time = 21

Battery driven 8 channel pulse height analyzer with compact, single gamma-peak display

DOEpatents

Morgan, John P.; Piper, Thomas C.

1991-01-01

The invention comprises a hand-held wand including an l.e.d. display and a aI photomultiplier tube encased in lead or other suitable gamma shielding material, and an electronics and battery back-pack package connected to the wand.

Software Applications on the Peregrine System | High-Performance Computing

Science.gov Websites

programming and optimization. Gaussian Chemistry Program for calculating molecular electronic structure and Materials Science Open-source classical molecular dynamics program designed for massively parallel systems framework Q-Chem Chemistry ab initio quantum chemistry package for predictin molecular structures

On-chip cooling by superlattice-based thin-film thermoelectrics.

PubMed

Chowdhury, Ihtesham; Prasher, Ravi; Lofgreen, Kelly; Chrysler, Gregory; Narasimhan, Sridhar; Mahajan, Ravi; Koester, David; Alley, Randall; Venkatasubramanian, Rama

2009-04-01

There is a significant need for site-specific and on-demand cooling in electronic, optoelectronic and bioanalytical devices, where cooling is currently achieved by the use of bulky and/or over-designed system-level solutions. Thermoelectric devices can address these limitations while also enabling energy-efficient solutions, and significant progress has been made in the development of nanostructured thermoelectric materials with enhanced figures-of-merit. However, fully functional practical thermoelectric coolers have not been made from these nanomaterials due to the enormous difficulties in integrating nanoscale materials into microscale devices and packaged macroscale systems. Here, we show the integration of thermoelectric coolers fabricated from nanostructured Bi2Te3-based thin-film superlattices into state-of-the-art electronic packages. We report cooling of as much as 15 degrees C at the targeted region on a silicon chip with a high ( approximately 1,300 W cm-2) heat flux. This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.

Chitosan nanocomposite films based on Ag-NP and Au-NP biosynthesis by Bacillus Subtilis as packaging materials.

PubMed

Youssef, Ahmed M; Abdel-Aziz, Mohamed S; El-Sayed, Samah M

2014-08-01

Chitosan-silver (CS-Ag) and Chitosan-gold (CS-Au) nanocomposites films were synthesized by a simple chemical method. A local bacterial isolate identified as Bacillus subtilis ss subtilis was found to be capable to synthesize both silver nanoparticles (Ag-NP) and gold nanoparticles (Au-NP) from silver nitrate (AgNO3) and chloroauric acid (AuCl(4-)) solutions, respectively. The biosynthesis of both Ag-NP and Au-NP characterize using UV/vis spectroscopy, scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray diffraction (XRD), and then added to chitosan by different ratios (0.5, 1 and 2%). The prepared chitosan nanocomposites films were characterize using UV, XRD, SEM and TEM. Moreover, the antibacterial activity of the prepared films was evaluated against gram positive (Staphylococcus aureus) and gram negative bacteria (Pseudomonas aerugenosa), fungi (Aspergillus niger) and yeast (Candida albicans). Therefore, these materials can be potential used as antimicrobial agents in packaging applications. Copyright © 2014 Elsevier B.V. All rights reserved.

19 CFR 191.13 - Packaging materials.

Code of Federal Regulations, 2010 CFR

2010-04-01

... 19 Customs Duties 2 2010-04-01 2010-04-01 false Packaging materials. 191.13 Section 191.13 Customs... (CONTINUED) DRAWBACK General Provisions § 191.13 Packaging materials. (a) Imported packaging material... packaging material when used to package or repackage merchandise or articles exported or destroyed pursuant...

77 FR 3386 - Export and Reexport License Requirements for Certain Microwave and Millimeter Wave Electronic...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-01-24

... electronic components. The two components are packaged high electron mobility transistors and packaged..., 2012, FR Doc. 2012- 135). The two components are packaged high electron mobility transistors (HEMT) and...

Paperless Work Package Application

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kilgore, Jr., William R.; Morrell, Jr., Otto K.; Morrison, Dan

2014-07-31

Paperless Work Package (PWP) System is a computer program process that takes information from Asset Suite, provides a platform for other electronic inputs, Processes the inputs into an electronic package that can be downloaded onto an electronic work tablet or laptop computer, provides a platform for electronic inputs into the work tablet, and then transposes those inputs back into Asset Suite and to permanent SRS records. The PWP System will basically eliminate paper requirements from the maintenance work control system. The program electronically relays the instructions given by the planner to work on a piece of equipment which is currentlymore » relayed via a printed work package. The program does not control/approve what is done. The planner will continue to plan the work package, the package will continue to be routed, approved, and scheduled. The supervisor reviews and approves the work to be performed and assigns work to individuals or to a work group. (The supervisor conducts pre job briefings with the workers involved in the job) The Operations Manager (Work Controlling Entity) approves the work package electronically for the work that will be done in his facility prior to work starting. The PWP System will provide the package in an electronic form. All the reviews, approvals, and safety measures taken by people outside the electronic package does not change from the paper driven work packages.« less

Microfluidics on compliant substrates: recent developments in foldable and bendable devices and system packaging

NASA Astrophysics Data System (ADS)

Gray, Bonnie L.

2012-04-01

Microfluidics is revolutionizing laboratory methods and biomedical devices, offering new capabilities and instrumentation in multiple areas such as DNA analysis, proteomics, enzymatic analysis, single cell analysis, immunology, point-of-care medicine, personalized medicine, drug delivery, and environmental toxin and pathogen detection. For many applications (e.g., wearable and implantable health monitors, drug delivery devices, and prosthetics) mechanically flexible polymer devices and systems that can conform to the body offer benefits that cannot be achieved using systems based on conventional rigid substrate materials. However, difficulties in implementing active devices and reliable packaging technologies have limited the success of flexible microfluidics. Employing highly compliant materials such as PDMS that are typically employed for prototyping, we review mechanically flexible polymer microfluidic technologies based on free-standing polymer substrates and novel electronic and microfluidic interconnection schemes. Central to these new technologies are hybrid microfabrication methods employing novel nanocomposite polymer materials and devices. We review microfabrication methods using these materials, along with demonstrations of example devices and packaging schemes that employ them. We review these recent developments and place them in the context of the fields of flexible microfluidics and conformable systems, and discuss cross-over applications to conventional rigid-substrate microfluidics.

Effects of ionizing radiation on properties of monolayer and multilayer flexible food packaging materials

NASA Astrophysics Data System (ADS)

Riganakos, K. A.; Koller, W. D.; Ehlermann, D. A. E.; Bauer, B.; Kontominas, M. G.

1999-05-01

Volatile compounds produced in flexible food packaging materials (LDPE, EVAc, PET/PE/EVOH/PE) during electron beam irradiation were isolated by purge and trap technique and identified by combined gas chromatography-mass spectrometry (GC/MS), after thermal desorption and concentration. For comparison purposes non-irradiated films were also studied. Film samples were irradiated at low (5 kGy, corresponding to cold pasteurization), intermediate (20 kGy, corresponding to cold sterilization) and high (100 kGy) doses. It was observed that a number of volatile compounds are produced after irradiation in all cases. Furthermore the amounts of all volatile compounds increase with increasing irradiation dose. Both primary (methyl-derivatives etc.) as well as secondary i.e. oxidation products (ketones, aldehydes, alcohols, carboxylic acids etc.) are produced upon irradiation. These products may affect organoleptic properties and thus shelf-life of prepackaged irradiated foods. No significant changes were observed in the structure of polymer matrices as exhibited by IR spectra after irradiation of the materials at doses tested. Likewise, no significant changes were observed in O 2, H 2O and CO 2 permeability values of plastic packaging materials after irradiation.

Metastable Polymers for On Demand Transient Electronic Packaging

DTIC Science & Technology

2018-01-17

a triggerable polymer for engineering applications. 25 Approved for public release; distribution is unlimited. 6 REFERENCES (1) Aso, C.; Tagami, S...R. Advanced Materials 2014, 26, 7637. (4) Ito, H.; Willson, C. G. Polymer Engineering & Science 1983, 23, 1012. (5) Ito, H.; England, W. P.; Ueda, M

Beyond flexible batteries: aesthetically versatile, printed rechargeable power sources for smart electronics

NASA Astrophysics Data System (ADS)

Lee, Sang-Young

2017-05-01

Forthcoming wearable/flexible electronics with compelling shape diversity and mobile usability have garnered significant attention as a kind of disruptive technology to drastically change our daily lives. From a power source point of view, conventional rechargeable batteries (represented by lithium-ion batteries) with fixed shapes and dimensions are generally fabricated by winding (or stacking) cell components (such as anodes, cathodes and separator membranes) and then packaging them with (cylindrical-/rectangular-shaped) metallic canisters or pouch films, finally followed by injection of liquid electrolytes. In particular, the use of liquid electrolytes gives rise to serious concerns in cell assembly, because they require strict packaging materials to avoid leakage problems and also separator membranes to prevent electrical contact between electrodes. For these reasons, the conventional cell assembly and materials have pushed the batteries to lack of variety in form factors, thus imposing formidable challenges on their integration into versatile-shaped electronic devices. Here, as a facile and efficient strategy to address the aforementioned longstanding challenge, we demonstrate a new class of printed solid-state Li-ion batteries and also all-inkjet-printed solid-state supercapacitors with exceptional shape conformability and aesthetic versatility which lie far beyond those achievable with conventional battery technologies.

Heterogeneously integrated microsystem-on-a-chip

DOEpatents

Chanchani, Rajen [Albuquerque, NM

2008-02-26

A microsystem-on-a-chip comprises a bottom wafer of normal thickness and a series of thinned wafers can be stacked on the bottom wafer, glued and electrically interconnected. The interconnection layer comprises a compliant dielectric material, an interconnect structure, and can include embedded passives. The stacked wafer technology provides a heterogeneously integrated, ultra-miniaturized, higher performing, robust and cost-effective microsystem package. The highly integrated microsystem package, comprising electronics, sensors, optics, and MEMS, can be miniaturized both in volume and footprint to the size of a bottle-cap or less.

Laser Welding in Electronic Packaging

NASA Technical Reports Server (NTRS)

2000-01-01

The laser has proven its worth in numerous high reliability electronic packaging applications ranging from medical to missile electronics. In particular, the pulsed YAG laser is an extremely flexible and versatile too] capable of hermetically sealing microelectronics packages containing sensitive components without damaging them. This paper presents an overview of details that must be considered for successful use of laser welding when addressing electronic package sealing. These include; metallurgical considerations such as alloy and plating selection, weld joint configuration, design of optics, use of protective gases and control of thermal distortions. The primary limitations on use of laser welding electronic for packaging applications are economic ones. The laser itself is a relatively costly device when compared to competing welding equipment. Further, the cost of consumables and repairs can be significant. These facts have relegated laser welding to use only where it presents a distinct quality or reliability advantages over other techniques of electronic package sealing. Because of the unique noncontact and low heat inputs characteristics of laser welding, it is an ideal candidate for sealing electronic packages containing MEMS devices (microelectromechanical systems). This paper addresses how the unique advantages of the pulsed YAG laser can be used to simplify MEMS packaging and deliver a product of improved quality.

Annual Electronics Manufacturing Seminar Proceedings (15th) Held in Ridgecrest, California on 20-22 February 1991

DTIC Science & Technology

1991-02-01

the POTW. Remember, BOD/COD chemicals are biodegradable materi - als, organic food , that are commonly treated at POTWs. It is also possible to reduce BOD...Volume 1. Packaging , ASM International, Materials Park, OH, 1989, p. 740. 2. Engelmaier, W., in "Round Robin Reliability Evaluation of Small Diameter...adherent layer of a protective material such as tin or gold. Such is not the case for bare nickel. Here, no correlation of the aging to storage has been

Enhancement of efficiency of storage and processing of food raw materials using radiation technologies

DOE Office of Scientific and Technical Information (OSTI.GOV)

Gracheva, A. Yu.; Zav’yalov, M. A.; Ilyukhina, N. V.

The work is dedicated to improvement of efficiency of storage and processing of food raw materials using radiation technologies. International practice of radiation processing of food raw materials is presented and an increase in the consumption of irradiated food products is shown. The prospects of using radiation technologies for the processing of food products in Russia are discussed. The results of studies of radiation effects on various food products and packaging film by γ radiation and accelerated electrons are presented.

Per- and Polyfluoroalkyl Substances (PFAS): Sampling Studies and Methods Development for Water and Other Environmental Media

EPA Science Inventory

Per- and polyfluoroalkyl substances (PFAS) are a large group of manufactured compounds used in a variety of industries, such as aerospace, automotive, textiles, and electronics, and are used in some food packaging and firefighting materials. For example, they may be used to make ...

Green Packaging Management of Logistics Enterprises

NASA Astrophysics Data System (ADS)

Zhang, Guirong; Zhao, Zongjian

From the connotation of green logistics management, we discuss the principles of green packaging, and from the two levels of government and enterprises, we put forward a specific management strategy. The management of green packaging can be directly and indirectly promoted by laws, regulations, taxation, institutional and other measures. The government can also promote new investment to the development of green packaging materials, and establish specialized institutions to identify new packaging materials, standardization of packaging must also be accomplished through the power of the government. Business units of large scale through the packaging and container-based to reduce the use of packaging materials, develop and use green packaging materials and easy recycling packaging materials for proper packaging.

MEMS Applications in Aerodynamic Measurement Technology

NASA Technical Reports Server (NTRS)

Reshotko, E.; Mehregany, M.; Bang, C.

1998-01-01

Microelectromechanical systems (MEMS) embodies the integration of sensors, actuators, and electronics on a single substrate using integrated circuit fabrication techniques and compatible bulk and surface micromachining processes. Silicon and its derivatives form the material base for the MEMS technology. MEMS devices, including microsensors and microactuators, are attractive because they can be made small (characteristic dimension about 100 microns), be produced in large numbers with uniform performance, include electronics for high performance and sophisticated functionality, and be inexpensive. For aerodynamic measurements, it is preferred that sensors be small so as to approximate measurement at a point, and in fact, MEMS pressure sensors, wall shear-stress sensors, heat flux sensors and micromachined hot wires are nearing application. For the envisioned application to wind tunnel models, MEMS sensors can be placed on the surface or in very shallow grooves. MEMS devices have often been fabricated on stiff, flat silicon substrates, about 0.5 mm thick, and therefore were not easily mounted on curved surfaces. However, flexible substrates are now available and heat-flux sensor arrays have been wrapped around a curved turbine blade. Electrical leads can also be built into the flexible substrate. Thus MEMS instrumented wind tunnel models do not require deep spanwise grooves for tubes and leads that compromise the strength of conventionally instrumented models. With MEMS, even the electrical leads can potentially be eliminated if telemetry of the signals to an appropriate receiver can be implemented. While semiconductor silicon is well known for its electronic properties, it is also an excellent mechanical material for MEMS applications. However, silicon electronics are limited to operations below about 200 C, and silicon's mechanical properties start to diminish above 400 C. In recent years, silicon carbide (SiC) has emerged as the leading material candidate for applications in high temperature environments and can be used for high-temperature MEMS applications. With SiC, diodes and more complex electronics have been shown to operate to about 600 C, while the mechanical properties of SiC are maintained to much higher temperatures. Even when MEMS devices show benefits in the laboratory, there are many packaging challenges for any aeronautics application. Incorporating MEMS into these applications requires new approaches to packaging that goes beyond traditional integrated circuit (IC) packaging technologies. MEMS must interact mechanically, as well as electrically with their environment, making most traditional chip packaging and mounting techniques inadequate. Wind tunnels operate over wide temperature ranges in an environment that is far from being a 'clean-room.' In flight, aircraft are exposed to natural elements (e.g. rain, sun, ice, insects and dirt) and operational interferences(e.g. cleaning and deicing fluids, and maintenance crews). In propulsion systems applications, MEMS devices will have to operate in environments containing gases with very high temperatures, abrasive particles and combustion products. Hence deployment and packaging that maintains the integrity of the MEMS system is crucial. This paper presents an overview of MEMS fabrication and materials, descriptions of available sensors with more details on those being developed in our laboratories, and a discussion of sensor deployment options for wind tunnel and flight applications.

Modular electronics packaging system

NASA Technical Reports Server (NTRS)

Hunter, Don J. (Inventor)

2001-01-01

A modular electronics packaging system includes multiple packaging slices that are mounted horizontally to a base structure. The slices interlock to provide added structural support. Each packaging slice includes a rigid and thermally conductive housing having four side walls that together form a cavity to house an electronic circuit. The chamber is enclosed on one end by an end wall, or web, that isolates the electronic circuit from a circuit in an adjacent packaging slice. The web also provides a thermal path between the electronic circuit and the base structure. Each slice also includes a mounting bracket that connects the packaging slice to the base structure. Four guide pins protrude from the slice into four corresponding receptacles in an adjacent slice. A locking element, such as a set screw, protrudes into each receptacle and interlocks with the corresponding guide pin. A conduit is formed in the slice to allow electrical connection to the electronic circuit.

Novel high-density packaging of solid state diode pumped eye-safe laser for LIBS

NASA Astrophysics Data System (ADS)

Bares, Kim; Torgerson, Justin; McNeil, Laine; Maine, Patrick; Patterson, Steve

2018-02-01

Laser-Induced Breakdown Spectroscopy (LIBS) has proven to be a useful research tool for material analysis for decades. However, because of the amount of energy required in a few nanosecond pulse to generate a stable and reliable LIBS signal, the lasers are often large and inefficient, relegating their implementation to research facilities, factory floors, and assembly lines. Small portable LIBS systems are now possible without having to compromise on energy needs by leveraging off of advances in high-density packaging of electronics, opto-mechanics, and highly efficient laser resonator architecture. This paper explores the integration of these techniques to achieve a mJ class eye-safe LIBS laser source, while retaining a small, light-weight package suitable for handheld systems.

Micromolded thick PZT sol gel composite structures for ultrasound transducer devices operating at high frequencies

NASA Astrophysics Data System (ADS)

Pang, Guofeng

The objective of this work has been to design and develop a micromolding technique useful for batch fabrication to microfabricate 3D ceramic structures for device purposes using a sol gel composite processing technique and deep photolithography (UV LIGA). These structures may be the elements of ultrasound transducers, the structures associated with electronic packaging, or microstructures for microfluidic applications. To demonstrate the technique, the project has focused on the design and fabrication of annular and linear arrays for high frequency (>20 MHz) ultrasound imaging applications, particularly where an electronically steered imaging modality is employed. Other typical micromolded structures have been demonstrated to show the potential for micromolding. The transferability of the technique for industrial purposes is proposed. Using a sol gel composite process, the critical components in this technique are mold making, mold filling, material-processing, demolding, top electrode and essential material characterization. Two types of molds have been created using UV LIGA and/or electroplating. A purely organic mold made of Su-8 epoxy based photo-resist has shown tremendous performance for micromolding. The transducer packaging process has also been designed and evaluated at the laboratory level. A Su-8 micro bridge and bond pad has been used for wire bonding purposes. A 5-element annular array transducer has been fabricated by this technique and fully packaged. The micromolded piezoceramic structures have been characterized. The pulse echo performance of each element and the focusing performance of 5 elements of a packaged transducer array have been evaluated using a coaxial cable and a cable delay system.

Atmospheric-Pressure Cold Plasmas Used to Embed Bioactive Compounds in Matrix Material for Active Packaging of Fruits and Vegetables

NASA Astrophysics Data System (ADS)

Fernandez, Sulmer; Pedrow, Patrick; Powers, Joseph; Pitts, Marvin

2009-10-01

Active thin film packaging is a technology with the potential to provide consumers with new fruit and vegetable products-if the film can be applied without deactivating bioactive compounds.Atmospheric pressure cold plasma (APCP) processing can be used to activate monomer with concomitant deposition of an organic plasma polymerized matrix material and to immobilize a bioactive compound all at or below room temperature.Aims of this work include: 1) immobilize an antimicrobial in the matrix; 2) determine if the antimicrobial retains its functionality and 3) optimize the reactor design.The plasma zone will be obtained by increasing the voltage on an electrode structure until the electric field in the feed material (argon + monomer) yields electron avalanches. Results will be described using Red Delicious apples.Prospective matrix precursors are vanillin and cinnamic acid.A prospective bioactive compound is benzoic acid.

Fire Signatures of Materials Used in Spacecraft Construction

NASA Technical Reports Server (NTRS)

Taylor, Christina

2003-01-01

The focus of my work this summer was fire safety, specifically determining fire signatures from the combustion of materials commonly found in the construction of spacecraft. This project was undertaken with the aim of addressing concerns for health and safety onboard spacecraft. Under certain conditions, burning electronics produce surprisingly large amounts of acrid smoke, release fine airborne particles and expel condensable aerosols. Similarly, some wire insulation and packing material evolves smoke when in contact with a hot surface. In the limited, enclosed space available on spacecraft, these combustion products may pose a nuisance at the very least - at worst, a hazard to health or equipment. There is also a concern for fire safety in early detection on spacecraft. Our goal for the summer was to determine the most effective methods to test the materials, develop a protocol for sampling, and generate samples for analysis. We restricted our testing to electronic components, packaging and insulation materials, and wire insulation materials.

Packaging Your Training Materials

ERIC Educational Resources Information Center

Espeland, Pamela

1977-01-01

The types of packaging and packaging materials to use for training materials should be determined during the planning of the training programs, according to the packaging market. Five steps to follow in shopping for packaging are presented, along with a list of packaging manufacturers. (MF)

The NASA Electronic Parts and Packaging (NEPP) Program: Overview and Update FY15 and Beyond

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2016-01-01

The NASA Electronic Parts and Packaging (NEPP) program, and its subset the NASA Electronic Parts Assurance Group (NEPAG), are NASA's point-of-contacts for reliability and radiation tolerance of electrical, electronic, and electromechanical (EEE) parts and their packages. This presentation includes a Fiscal Year 2015 program overview.

77 FR 22504 - Hazardous Materials; Packages Intended for Transport by Aircraft

Federal Register 2010, 2011, 2012, 2013, 2014

2012-04-16

... material to absorb the entire contents of the inner packaging, before being placed in its outer package... combination packaging intended for the air transportation of liquid hazardous materials is capable of..., leakproof receptacle or intermediate packaging containing sufficient absorbent material to absorb the entire...

49 CFR 173.428 - Empty Class 7 (radioactive) materials packaging.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false Empty Class 7 (radioactive) materials packaging... SHIPPERS-GENERAL REQUIREMENTS FOR SHIPMENTS AND PACKAGINGS Class 7 (Radioactive) Materials § 173.428 Empty Class 7 (radioactive) materials packaging. A packaging which previously contained Class 7 (radioactive...

NASA-DoD Lead-Free Electronics Project

NASA Technical Reports Server (NTRS)

Kessel, Kurt

2009-01-01

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with solder interconnects consisting of lead-free alloys (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder

Cigarette package design: opportunities for disease prevention.

PubMed

Difranza, J R; Clark, D M; Pollay, R W

2002-06-15

To learn how cigarette packages are designed and to determine to what extent cigarette packages are designed to target children. A computer search was made of all Internet websites that post tobacco industry documents using the search terms: packaging, package design, package study, box design, logo, trademark and design study. All documents were retrieved electronically and analyzed by the first author for recurrent themes. Cigarette manufacturers devote a great deal of attention and expense to package design because it is central to their efforts to create brand images. Colors, graphic elements, proportioning, texture, materials and typography are tested and used in various combinations to create the desired product and user images. Designs help to create the perceived product attributes and project a personality image of the user with the intent of fulfilling the psychological needs of the targeted type of smoker. The communication of these images and attributes is conducted through conscious and subliminal processes. Extensive testing is conducted using a variety of qualitative and quantitative research techniques. The promotion of tobacco products through appealing imagery cannot be stopped without regulating the package design. The same marketing research techniques used by the tobacco companies can be used to design generic packaging and more effective warning labels targeted at specific consumers.

Cigarette package design: opportunities for disease prevention

PubMed Central

DiFranza, JR; Clark, DM; Pollay, RW

2003-01-01

Objective To learn how cigarette packages are designed and to determine to what extent cigarette packages are designed to target children. Methods A computer search was made of all Internet websites that post tobacco industry documents using the search terms: packaging, package design, package study, box design, logo, trademark and design study. All documents were retrieved electronically and analyzed by the first author for recurrent themes. Data Synthesis Cigarette manufacturers devote a great deal of attention and expense to package design because it is central to their efforts to create brand images. Colors, graphic elements, proportioning, texture, materials and typography are tested and used in various combinations to create the desired product and user images. Designs help to create the perceived product attributes and project a personality image of the user with the intent of fulfilling the psychological needs of the targeted type of smoker. The communication of these images and attributes is conducted through conscious and subliminal processes. Extensive testing is conducted using a variety of qualitative and quantitative research techniques. Conclusion The promotion of tobacco products through appealing imagery cannot be stopped without regulating the package design. The same marketing research techniques used by the tobacco companies can be used to design generic packaging and more effective warning labels targeted at specific consumers. PMID:19570250

Cigarette package design: opportunities for disease prevention

PubMed Central

DiFranza, JR; Clark, DM; Pollay, RW

2003-01-01

Objective To learn how cigarette packages are designed and to determine to what extent cigarette packages are designed to target children. Methods A computer search was made of all Internet websites that post tobacco industry documents using the search terms: packaging, package design, package study, box design, logo, trademark and design study. All documents were retrieved electronically and analyzed by the first author for recurrent themes. Data Synthesis Cigarette manufacturers devote a great deal of attention and expense to package design because it is central to their efforts to create brand images. Colors, graphic elements, proportioning, texture, materials and typography are tested and used in various combinations to create the desired product and user images. Designs help to create the perceived product attributes and project a personality image of the user with the intent of fulfilling the psychological needs of the targeted type of smoker. The communication of these images and attributes is conducted through conscious and subliminal processes. Extensive testing is conducted using a variety of qualitative and quantitative research techniques. Conclusion The promotion of tobacco products through appealing imagery cannot be stopped without regulating the package design. The same marketing research techniques used by the tobacco companies can be used to design generic packaging and more effective warning labels targeted at specific consumers.

19 CFR 10.2022 - Retail packaging materials and containers.

Code of Federal Regulations, 2014 CFR

2014-04-01

... 19 Customs Duties 1 2014-04-01 2014-04-01 false Retail packaging materials and containers. 10.2022... Trade Promotion Agreement Rules of Origin § 10.2022 Retail packaging materials and containers. (a) Effect on tariff shift rule. Packaging materials and containers in which a good is packaged for retail...

19 CFR 10.461 - Retail packaging materials and containers.

Code of Federal Regulations, 2010 CFR

2010-04-01

... 19 Customs Duties 1 2010-04-01 2010-04-01 false Retail packaging materials and containers. 10.461... Free Trade Agreement Rules of Origin § 10.461 Retail packaging materials and containers. Packaging... requirement, the value of such packaging materials and containers will be taken into account as originating or...

NASA EEE Parts and NASA Electronic Parts and Packaging (NEPP) Program Update 2018

NASA Technical Reports Server (NTRS)

Label, Kenneth A.; Sampson, Michael J.; Pellish, Jonathan A.; Majewicz, Peter J.

2018-01-01

NASA Electronic Parts and Packaging (NEPP) Program and NASA Electronic Parts Assurance Group (NEPAG) are NASAs point-of-contacts for reliability and radiation tolerance of EEE parts and their packages. This presentation includes an FY18 program overview.

Communications Technician, 5-3A. Military Curriculum Materials for Vocational and Technical Education.

ERIC Educational Resources Information Center

Naval Education and Training Command, Pensacola, FL.

These assignments and text for a secondary-postsecondary level correspondence course in electronic communications comprise one of a number of military-developed curriculum packages selected for adaptation to vocational instruction and curriculum development in a civilian setting. Purpose of the individualized, self-paced course is to provide…

Moving Toward SCORM Compliant Content Production at Educational Software Company: Technical and Administrative Challenges

ERIC Educational Resources Information Center

Kultur, Can; Oytun, Erden; Cagiltay, Kursat; Ozden, M. Yasar; Kucuk, Mehmet Emin

2004-01-01

The Shareable Content Object Reference Model (SCORM) aims to standardize electronic course content, its packaging and delivery. Instructional designers and e-learning material producer organizations accept SCORM?s significant impact on instructional design/delivery process, however not much known about how such standards will be implemented to…

Applications of high thermal conductivity composites to electronics and spacecraft thermal design

NASA Technical Reports Server (NTRS)

Sharp, G. Richard; Loftin, Timothy A.

1990-01-01

Recently, high thermal conductivity continuous graphite fiber reinforced metal matrix composites (MMC's) have become available that can save much weight over present methods of heat conduction. These materials have two or three times higher thermal conductivity in the fiber direction than the pure metals when compared on a thermal conductivity to weight basis. Use of these materials for heat conduction purposes can result in weight savings of from 50 to 70 percent over structural aluminum. Another significant advantage is that these materials can be used without the plumbing and testing complexities that accompany the use of liquid heat pipes. A spinoff of this research was the development of other MMC's as electronic device heat sinks. These use particulates rather than fibers and are formulated to match the coefficient of thermal expansion of electronic substrates in order to alleviate thermally induced stresses. The development of both types of these materials as viable weight saving substitutes for traditional methods of thermal control for electronics packaging and also for spacecraft thermal control applications are the subject of this report.

Packaging Technology for SiC High Temperature Electronics

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Neudeck, Philip G.; Spry, David J.; Meredith, Roger D.; Nakley, Leah M.; Beheim, Glenn M.; Hunter, Gary W.

2017-01-01

High-temperature environment operable sensors and electronics are required for long-term exploration of Venus and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500 C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors in relevant environments. This talk will discuss a ceramic packaging system developed for high temperature electronics, and related testing results of SiC integrated circuits at 500 C facilitated by this high temperature packaging system, including the most recent progress.

9 CFR 381.144 - Packaging materials.

Code of Federal Regulations, 2011 CFR

2011-01-01

... 9 Animals and Animal Products 2 2011-01-01 2011-01-01 false Packaging materials. 381.144 Section... Packaging materials. (a) Edible products may not be packaged in a container which is composed in whole or in... to health. All packaging materials must be safe for the intended use within the meaning of section...

19 CFR 10.922 - Retail packaging materials and containers.

Code of Federal Regulations, 2014 CFR

2014-04-01

... 19 Customs Duties 1 2014-04-01 2014-04-01 false Retail packaging materials and containers. 10.922... Trade Promotion Agreement Rules of Origin § 10.922 Retail packaging materials and containers. (a) Effect on tariff shift rule. Packaging materials and containers in which a good is packaged for retail sale...

19 CFR 10.922 - Retail packaging materials and containers.

Code of Federal Regulations, 2013 CFR

2013-04-01

... 19 Customs Duties 1 2013-04-01 2013-04-01 false Retail packaging materials and containers. 10.922... Trade Promotion Agreement Rules of Origin § 10.922 Retail packaging materials and containers. (a) Effect on tariff shift rule. Packaging materials and containers in which a good is packaged for retail sale...

19 CFR 10.461 - Retail packaging materials and containers.

Code of Federal Regulations, 2011 CFR

2011-04-01

... 19 Customs Duties 1 2011-04-01 2011-04-01 false Retail packaging materials and containers. 10.461... Free Trade Agreement Rules of Origin § 10.461 Retail packaging materials and containers. Packaging materials and containers in which a good is packaged for retail sale, if classified with the good for which...

19 CFR 10.922 - Retail packaging materials and containers.

Code of Federal Regulations, 2012 CFR

2012-04-01

... 19 Customs Duties 1 2012-04-01 2012-04-01 false Retail packaging materials and containers. 10.922... Trade Promotion Agreement Rules of Origin § 10.922 Retail packaging materials and containers. (a) Effect on tariff shift rule. Packaging materials and containers in which a good is packaged for retail sale...

19 CFR 10.1022 - Retail packaging materials and containers.

Code of Federal Regulations, 2012 CFR

2012-04-01

... 19 Customs Duties 1 2012-04-01 2012-04-01 false Retail packaging materials and containers. 10.1022... Free Trade Agreement Rules of Origin § 10.1022 Retail packaging materials and containers. (a) Effect on tariff shift rule. Packaging materials and containers in which a good is packaged for retail sale, if...

19 CFR 10.3022 - Retail packaging materials and containers.

Code of Federal Regulations, 2013 CFR

2013-04-01

... 19 Customs Duties 1 2013-04-01 2013-04-01 false Retail packaging materials and containers. 10.3022...-Colombia Trade Promotion Agreement Rules of Origin § 10.3022 Retail packaging materials and containers. (a) Effect on tariff shift rule. Packaging materials and containers in which a good is packaged for retail...

19 CFR 10.461 - Retail packaging materials and containers.

Code of Federal Regulations, 2013 CFR

2013-04-01

... 19 Customs Duties 1 2013-04-01 2013-04-01 false Retail packaging materials and containers. 10.461... Free Trade Agreement Rules of Origin § 10.461 Retail packaging materials and containers. Packaging materials and containers in which a good is packaged for retail sale, if classified with the good for which...

19 CFR 10.3022 - Retail packaging materials and containers.

Code of Federal Regulations, 2014 CFR

2014-04-01

... 19 Customs Duties 1 2014-04-01 2014-04-01 false Retail packaging materials and containers. 10.3022...-Colombia Trade Promotion Agreement Rules of Origin § 10.3022 Retail packaging materials and containers. (a) Effect on tariff shift rule. Packaging materials and containers in which a good is packaged for retail...

19 CFR 10.461 - Retail packaging materials and containers.

Code of Federal Regulations, 2014 CFR

2014-04-01

... 19 Customs Duties 1 2014-04-01 2014-04-01 false Retail packaging materials and containers. 10.461... Free Trade Agreement Rules of Origin § 10.461 Retail packaging materials and containers. Packaging materials and containers in which a good is packaged for retail sale, if classified with the good for which...

19 CFR 10.539 - Retail packaging materials and containers.

Code of Federal Regulations, 2013 CFR

2013-04-01

... 19 Customs Duties 1 2013-04-01 2013-04-01 false Retail packaging materials and containers. 10.539...-Singapore Free Trade Agreement Rules of Origin § 10.539 Retail packaging materials and containers. Packaging materials and containers in which a good is packaged for retail sale, if classified with the good for which...

19 CFR 10.1022 - Retail packaging materials and containers.

Code of Federal Regulations, 2014 CFR

2014-04-01

... 19 Customs Duties 1 2014-04-01 2014-04-01 false Retail packaging materials and containers. 10.1022... Free Trade Agreement Rules of Origin § 10.1022 Retail packaging materials and containers. (a) Effect on tariff shift rule. Packaging materials and containers in which a good is packaged for retail sale, if...

19 CFR 10.461 - Retail packaging materials and containers.

Code of Federal Regulations, 2012 CFR

2012-04-01

... 19 Customs Duties 1 2012-04-01 2012-04-01 false Retail packaging materials and containers. 10.461... Free Trade Agreement Rules of Origin § 10.461 Retail packaging materials and containers. Packaging materials and containers in which a good is packaged for retail sale, if classified with the good for which...

19 CFR 10.539 - Retail packaging materials and containers.

Code of Federal Regulations, 2014 CFR

2014-04-01

... 19 Customs Duties 1 2014-04-01 2014-04-01 false Retail packaging materials and containers. 10.539...-Singapore Free Trade Agreement Rules of Origin § 10.539 Retail packaging materials and containers. Packaging materials and containers in which a good is packaged for retail sale, if classified with the good for which...

19 CFR 10.539 - Retail packaging materials and containers.

Code of Federal Regulations, 2011 CFR

2011-04-01

... 19 Customs Duties 1 2011-04-01 2011-04-01 false Retail packaging materials and containers. 10.539...-Singapore Free Trade Agreement Rules of Origin § 10.539 Retail packaging materials and containers. Packaging materials and containers in which a good is packaged for retail sale, if classified with the good for which...

19 CFR 10.539 - Retail packaging materials and containers.

Code of Federal Regulations, 2012 CFR

2012-04-01

... 19 Customs Duties 1 2012-04-01 2012-04-01 false Retail packaging materials and containers. 10.539...-Singapore Free Trade Agreement Rules of Origin § 10.539 Retail packaging materials and containers. Packaging materials and containers in which a good is packaged for retail sale, if classified with the good for which...

19 CFR 10.1022 - Retail packaging materials and containers.

Code of Federal Regulations, 2013 CFR

2013-04-01

... 19 Customs Duties 1 2013-04-01 2013-04-01 false Retail packaging materials and containers. 10.1022... Free Trade Agreement Rules of Origin § 10.1022 Retail packaging materials and containers. (a) Effect on tariff shift rule. Packaging materials and containers in which a good is packaged for retail sale, if...

Sensory impacts of food-packaging interactions.

PubMed

Duncan, Susan E; Webster, Janet B

2009-01-01

Sensory changes in food products result from intentional or unintentional interactions with packaging materials and from failure of materials to protect product integrity or quality. Resolving sensory issues related to plastic food packaging involves knowledge provided by sensory scientists, materials scientists, packaging manufacturers, food processors, and consumers. Effective communication among scientists and engineers from different disciplines and industries can help scientists understand package-product interactions. Very limited published literature describes sensory perceptions associated with food-package interactions. This article discusses sensory impacts, with emphasis on oxidation reactions, associated with the interaction of food and materials, including taints, scalping, changes in food quality as a function of packaging, and examples of material innovations for smart packaging that can improve sensory quality of foods and beverages. Sensory evaluation is an important tool for improved package selection and development of new materials.

PREFACE: MRS International Materials Research Conference (IMRC-2008)

NASA Astrophysics Data System (ADS)

Wang, Zhanguo; Qiu, Yong; Li, Yongxiang

2009-03-01

This volume contains selected papers presented at the MRS International Materials Research Conference (IMRC-2008) held in Chongqing, China, 9-12 June 2008. IMRC-2008 included 9 symposia of A. Eco/Environmental Materials, B. Sustainable Energy Materials, C. Electronic Packaging Materials, D. Electronic Materials, E. Materials and Processes for Flat-panel Displays, F. Functional Ceramics, G. Transportation Materials, H. Magnesium and I. Biomaterials for Medical Applications. Nearly 1200 participants from 33 countries attended the conference, and the conference organizers received more than 700 papers. After the peer review processes, 555 papers were selected to be published in 9 Journals or proceedings, including J. of Materials Research (JMR), Rare Metal Materials and Engineering, J. of Univ. Science and Technology Beijing, Biomedical Materials: Materials for Tissue Engineering and Regenerative Medicine, Chinese Journal of Aeronautics, Materials Science Forum, and Journal of Physics: Conference Series. Among the 555 selected papers, 91 papers are published in this volume, and the topics mainly cover electronic matrials, processes for flat-panel displays and functional ceramics. The editors would like to give special thanks to the graduate students Liwu Jiang, Ming Li and Di He from Beihang University for their hard work compiling and typesetting each paper in this volume. Zhanguo Wang, Yong Qiu and Yongxiang Li Editors

Analysis of Plane-Parallel Electron Beam Propagation in Different Media by Numerical Simulation Methods

NASA Astrophysics Data System (ADS)

Miloichikova, I. A.; Bespalov, V. I.; Krasnykh, A. A.; Stuchebrov, S. G.; Cherepennikov, Yu. M.; Dusaev, R. R.

2018-04-01

Simulation by the Monte Carlo method is widely used to calculate the character of ionizing radiation interaction with substance. A wide variety of programs based on the given method allows users to choose the most suitable package for solving computational problems. In turn, it is important to know exactly restrictions of numerical systems to avoid gross errors. Results of estimation of the feasibility of application of the program PCLab (Computer Laboratory, version 9.9) for numerical simulation of the electron energy distribution absorbed in beryllium, aluminum, gold, and water for industrial, research, and clinical beams are presented. The data obtained using programs ITS and Geant4 being the most popular software packages for solving the given problems and the program PCLab are presented in the graphic form. A comparison and an analysis of the results obtained demonstrate the feasibility of application of the program PCLab for simulation of the absorbed energy distribution and dose of electrons in various materials for energies in the range 1-20 MeV.

Development of a Spacecraft Materials Selector Expert System

NASA Technical Reports Server (NTRS)

Pippin, G.; Kauffman, W. (Technical Monitor)

2002-01-01

This report contains a description of the knowledge base tool and examples of its use. A downloadable version of the Spacecraft Materials Selector (SMS) knowledge base is available through the NASA Space Environments and Effects Program. The "Spacecraft Materials Selector" knowledge base is part of an electronic expert system. The expert system consists of an inference engine that contains the "decision-making" code and the knowledge base that contains the selected body of information. The inference engine is a software package previously developed at Boeing, called the Boeing Expert System Tool (BEST) kit.

Packaging of electronic modules

NASA Technical Reports Server (NTRS)

Katzin, L.

1966-01-01

Study of design approaches that are taken toward optimizing the packaging of electronic modules with respect to size, shape, component orientation, interconnections, and structural support. The study does not present a solution to specific packaging problems, but rather the factors to be considered to achieve optimum packaging designs.

QUANTUM ESPRESSO: a modular and open-source software project for quantum simulations of materials.

PubMed

Giannozzi, Paolo; Baroni, Stefano; Bonini, Nicola; Calandra, Matteo; Car, Roberto; Cavazzoni, Carlo; Ceresoli, Davide; Chiarotti, Guido L; Cococcioni, Matteo; Dabo, Ismaila; Dal Corso, Andrea; de Gironcoli, Stefano; Fabris, Stefano; Fratesi, Guido; Gebauer, Ralph; Gerstmann, Uwe; Gougoussis, Christos; Kokalj, Anton; Lazzeri, Michele; Martin-Samos, Layla; Marzari, Nicola; Mauri, Francesco; Mazzarello, Riccardo; Paolini, Stefano; Pasquarello, Alfredo; Paulatto, Lorenzo; Sbraccia, Carlo; Scandolo, Sandro; Sclauzero, Gabriele; Seitsonen, Ari P; Smogunov, Alexander; Umari, Paolo; Wentzcovitch, Renata M

2009-09-30

QUANTUM ESPRESSO is an integrated suite of computer codes for electronic-structure calculations and materials modeling, based on density-functional theory, plane waves, and pseudopotentials (norm-conserving, ultrasoft, and projector-augmented wave). The acronym ESPRESSO stands for opEn Source Package for Research in Electronic Structure, Simulation, and Optimization. It is freely available to researchers around the world under the terms of the GNU General Public License. QUANTUM ESPRESSO builds upon newly-restructured electronic-structure codes that have been developed and tested by some of the original authors of novel electronic-structure algorithms and applied in the last twenty years by some of the leading materials modeling groups worldwide. Innovation and efficiency are still its main focus, with special attention paid to massively parallel architectures, and a great effort being devoted to user friendliness. QUANTUM ESPRESSO is evolving towards a distribution of independent and interoperable codes in the spirit of an open-source project, where researchers active in the field of electronic-structure calculations are encouraged to participate in the project by contributing their own codes or by implementing their own ideas into existing codes.

Polynomial expressions of electron depth dose as a function of energy in various materials: application to thermoluminescence (TL) dosimetry

NASA Astrophysics Data System (ADS)

Deogracias, E. C.; Wood, J. L.; Wagner, E. C.; Kearfott, K. J.

1999-02-01

The CEPXS/ONEDANT code package was used to produce a library of depth-dose profiles for monoenergetic electrons in various materials for energies ranging from 500 keV to 5 MeV in 10 keV increments. The various materials for which depth-dose functions were derived include: lithium fluoride (LiF), aluminum oxide (Al 2O 3), beryllium oxide (BeO), calcium sulfate (CaSO 4), calcium fluoride (CaF 2), lithium boron oxide (LiBO), soft tissue, lens of the eye, adiopose, muscle, skin, glass and water. All materials data sets were fit to five polynomials, each covering a different range of electron energies, using a least squares method. The resultant three dimensional, fifth-order polynomials give the dose as a function of depth and energy for the monoenergetic electrons in each material. The polynomials can be used to describe an energy spectrum by summing the doses at a given depth for each energy, weighted by the spectral intensity for that energy. An application of the polynomial is demonstrated by explaining the energy dependence of thermoluminescent detectors (TLDs) and illustrating the relationship between TLD signal and actual shallow dose due to beta particles.

Towards roll-to-roll fabrication of electronics, optics, and optoelectronics for smart and intelligent packaging

NASA Astrophysics Data System (ADS)

Kololuoma, Terho K.; Tuomikoski, Markus; Makela, Tapio; Heilmann, Jali; Haring, Tomi; Kallioinen, Jani; Hagberg, Juha; Kettunen, Ilkka; Kopola, Harri K.

2004-06-01

Embedding of optoelectrical, optical, and electrical functionalities into low-cost products like packages and printed matter can be used to increase their information content. These functionalities make also possible the realization of new type of entertaining, impressive or guiding effects on the product packages and printed matter. For these purposes, components like displays, photodetectors, light sources, solar cells, battery elements, diffractive optical elements, lightguides, electrical conductors, resistors, transistors, switching elements etc. and their integration to functional modules are required. Additionally, the price of the components for low-end products has to be in cent scale or preferably below that. Therefore, new, cost-effective, and volume scale capable manufacturing techniques are required. Recent developments of liquid-phase processable electrical and optical polymeric, inorganic, and hybrid materials - inks - have made it possible to fabricate functional electrical, optical and optoelectrical components by conventional roll-to-roll techniques such as gravure printing, embossing, digital printing, offset, and screen printing on flexible paper and plastic like substrates. In this paper, we show our current achievements in the field of roll-to-roll fabricated, optics, electronics and optoelectronics. With few examples, we also demonstrate the printing and hot-embossing capabilities of table scale printing machines and VTT Electronic's 'PICO' roll-to-roll pilot production facility.

Ultra Low Temperature Ultra Low Power Instrument Packages for Planetary Surfaces

NASA Technical Reports Server (NTRS)

Clark, P. E.; Millar, P. S.; Beaman, B.; Yeh, P. S.; Cooper, L.; Feng, S.; Young, E.

2010-01-01

Achievement of solar system exploration roadmap goals will involve robotic or human deployment and longterm operation of surface science packages remote from human presence, thus requiring autonomous, self-powered operation. The major challenge such packages face will be operating during long periods of darkness in extreme cold potentially without the Pu238 based power and thermal systems available to Apollo era packages (ALSEP). Development of such science payloads will thus require considerable optimization of instrument and subsystem design, packaging and integration for a variety of planetary surface environments in order to support solar system exploration fully. Our work supports this process through the incorporation of low temperature operational components and design strategies which radically minimize power, mass, and cost while maximizing the performance under extreme surface conditions that are in many cases more demanding than those routinely experienced by spacecraft in deep space. Chief instruments/instrument package candidates include those which could provide long-term monitoring of the surface and subsurface environments for fundamental science and human crew safety. The initial attempt to design a 10 instrument environmental monitoring package with a solar/battery based power system led to a package with a unacceptably large mass (500 kg) of which over half was battery mass. In phase 1, a factor of 5 reduction in mass was achieved, first through the introduction of high performance electronics capable of operating at far lower temperature and then through the use of innovative thermal balance strategies involving the use of multi-layer thin materials and gravity-assisted heat pipes. In phase 2, reported here, involves strategies such as universal incorporation of ULT/ULP digital and analog electronics, and distributed or non-conventionally packaged power systems. These strategies will be required to meet the far more challenging thermal requirements of operating through a normal 28 day diurnal cycle. The limited temperature range of efficient battery operation remains the largest obstacle.

Investigation of Thermal Interface Materials Using Phase-Sensitive Transient Thermoreflectance Technique: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

Feng, X.; King, C.; DeVoto, D.

2014-08-01

With increasing power density in electronics packages/modules, thermal resistances at multiple interfaces are a bottleneck to efficient heat removal from the package. In this work, the performance of thermal interface materials such as grease, thermoplastic adhesives and diffusion-bonded interfaces are characterized using the phase-sensitive transient thermoreflectance technique. A multi-layer heat conduction model was constructed and theoretical solutions were derived to obtain the relation between phase lag and the thermal/physical properties. This technique enables simultaneous extraction of the contact resistance and bulk thermal conductivity of the TIMs. With the measurements, the bulk thermal conductivity of Dow TC-5022 thermal grease (70 tomore » 75 um bondline thickness) was 3 to 5 W/(m-K) and the contact resistance was 5 to 10 mm2-K/W. For the Btech thermoplastic material (45 to 80 μm bondline thickness), the bulk thermal conductivity was 20 to 50 W/(m-K) and the contact resistance was 2 to 5 mm2-K/W. Measurements were also conducted to quantify the thermal performance of diffusion-bonded interface for power electronics applications. Results with the diffusion-bonded sample showed that the interfacial thermal resistance is more than one order of magnitude lower than those of traditional TIMs, suggesting potential pathways to efficient thermal management.« less

76 FR 82163 - Hazardous Materials: Harmonization With the United Nations Recommendations on the Transport of...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-12-30

... combination packagings prohibit Class 1 (explosive) and Class 7 (radioactive) material to be offered for... transportation, Packaging and containers, Radioactive materials, Reporting and recordkeeping requirements... material, packing group assignments, special provisions, packaging authorizations, packaging sections, air...

Direct Desktop Printed-Circuits-on-Paper Flexible Electronics

PubMed Central

Zheng, Yi; He, Zhizhu; Gao, Yunxia; Liu, Jing

2013-01-01

There currently lacks of a way to directly write out electronics, just like printing pictures on paper by an office printer. Here we show a desktop printing of flexible circuits on paper via developing liquid metal ink and related working mechanisms. Through modifying adhesion of the ink, overcoming its high surface tension by dispensing machine and designing a brush like porous pinhead for printing alloy and identifying matched substrate materials among different papers, the slightly oxidized alloy ink was demonstrated to be flexibly printed on coated paper, which could compose various functional electronics and the concept of Printed-Circuits-on-Paper was thus presented. Further, RTV silicone rubber was adopted as isolating inks and packaging material to guarantee the functional stability of the circuit, which suggests an approach for printing 3D hybrid electro-mechanical device. The present work paved the way for a low cost and easygoing method in directly printing paper electronics.

Chemistry of green encapsulating molding compounds at interfaces with other materials in electronic devices

NASA Astrophysics Data System (ADS)

Scandurra, A.; Zafarana, R.; Tenya, Y.; Pignataro, S.

2004-07-01

The interface chemistry between encapsulating epoxy phenolic molding compound (EMC) containing phosphorous based organic flame retardant (the so called "green materials") and copper oxide-hydroxide and aluminum oxide-hydroxide surfaces have been studied in comparison with "conventional" EMC containing bromine and antimony as flame retardant. These green materials are designed to reduce the presence of toxic elements in the electronic packages and, consequently, in the environment. For the study were used a Scanning Acoustic Microscopy for delamination measurements, a dynamometer for the pull strength measurements and an ESCA spectrometer for chemical analysis of the interface. The general behavior of the green compound in terms of delamination, adhesion, and corrosion is found better or at least comparable than that of the conventional EMC.

Advanced Power Electronics Components

NASA Technical Reports Server (NTRS)

Schwarze, Gene E.

2004-01-01

This paper will give a description and status of the Advanced Power Electronics Materials and Components Technology program being conducted by the NASA Glenn Research Center for future aerospace power applications. The focus of this research program is on the following: 1) New and/or significantly improved dielectric materials for the development of power capacitors with increased volumetric efficiency, energy density, and operating temperature. Materials being investigated include nanocrystalline and composite ceramic dielectrics and diamond-like carbon films; 2) New and/or significantly improved high frequency, high temperature, low loss soft magnetic materials for the development of transformers/inductors with increased power/energy density, electrical efficiency, and operating temperature. Materials being investigated include nanocrystalline and nanocomposite soft magnetic materials; 3) Packaged high temperature, high power density, high voltage, and low loss SiC diodes and switches. Development of high quality 4H- and 6H- SiC atomically smooth substrates to significantly improve device performance is a major emphasis of the SiC materials program; 4) Demonstration of high temperature (> 200 C) circuits using the components developed above.

Printed electronic on flexible and glass substrates

NASA Astrophysics Data System (ADS)

Futera, Konrad; Jakubowska, Małgorzata; Kozioł, Grażyna

2010-09-01

Organic electronics is a platform technology that enables multiple applications based on organic electronics but varied in specifications. Organic electronics is based on the combination of new materials and cost-effective, large area production processes that provide new fields of application. Organic electronic by its size, weight, flexibility and environmental friendliness electronics enables low cost production of numerous electrical components and provides for such promising fields of application as: intelligent packaging, low cost RFID, flexible solar cells, disposable diagnostic devices or games, and printed batteries [1]. The paper presents results of inkjetted electronics elements on flexible and glass substrates. The investigations was target on characterizing shape, surface and geometry of printed structures. Variety of substrates were investigated, within some, low cost, non specialized substrate, design for other purposes than organic electronic.

Types, production and assessment of biobased food packaging materials

USDA-ARS?s Scientific Manuscript database

Food packaging performs an essential function, but packaging materials can have a negative impact on the environment. This book describes the latest advances in bio-based food packaging materials. Book provides a comprehensive review on bio-based, biodegradable and recycled materials and discusses t...

21 CFR 1314.110 - Reports for mail-order sales.

Code of Federal Regulations, 2010 CFR

2010-04-01

... Administration, submit the report in electronic form, either via computer disk or direct electronic data... units (e.g., 100 doses per package); (11) Package type (blister pack, etc.); (12) Number of packages...

21 CFR 1314.110 - Reports for mail-order sales.

Code of Federal Regulations, 2014 CFR

2014-04-01

... Administration, submit the report in electronic form, either via computer disk or direct electronic data... units (e.g., 100 doses per package); (11) Package type (blister pack, etc.); (12) Number of packages...

21 CFR 1314.110 - Reports for mail-order sales.

Code of Federal Regulations, 2013 CFR

2013-04-01

... Administration, submit the report in electronic form, either via computer disk or direct electronic data... units (e.g., 100 doses per package); (11) Package type (blister pack, etc.); (12) Number of packages...

21 CFR 1314.110 - Reports for mail-order sales.

Code of Federal Regulations, 2011 CFR

2011-04-01

... Administration, submit the report in electronic form, either via computer disk or direct electronic data... units (e.g., 100 doses per package); (11) Package type (blister pack, etc.); (12) Number of packages...

21 CFR 1314.110 - Reports for mail-order sales.

Code of Federal Regulations, 2012 CFR

2012-04-01

... Administration, submit the report in electronic form, either via computer disk or direct electronic data... units (e.g., 100 doses per package); (11) Package type (blister pack, etc.); (12) Number of packages...

A pilot training manual for the terminal configured vehicle electronic horizontal situation indicator

NASA Technical Reports Server (NTRS)

Houck, J. A.

1981-01-01

The initial phase of a training program for the Terminal Configured Vehicle Electronic Situation indicator (EHSI) is presented. The EHSI and its symbology is introduced and interpretation of the symbols is explained. Basic symbols shown on the display at all times are first presented. Additional optional symbols to be used as appropriate during different portions of a flight are then introduced and various display configurations interpreted. The upper half of each page is a reproduction of the EHSI display or other pertinent instructional material and the bottom half contains explanatory text, simplifying production of an audiovisual package for use with large training classes. Two quizzes on the course material are included.

Efficacy of Antimicrobial Agents for Food Contact Applications: Biological Activity, Incorporation into Packaging, and Assessment Methods: A Review.

PubMed

Mousavi Khaneghah, Amin; Hashemi, Seyed Mohammad Bagher; Eş, Ismail; Fracassetti, Daniela; Limbo, Sara

2018-07-01

Interest in the utilization of antimicrobial active packaging for food products has increased in recent years. Antimicrobial active packaging involves the incorporation of antimicrobial compounds into packaging materials, with the aim of maintaining or extending food quality and shelf life. Plant extracts, essential oils, organic acids, bacteriocins, inorganic substances, enzymes, and proteins are used as antimicrobial agents in active packaging. Evaluation of the antimicrobial activity of packaging materials using different methods has become a critical issue for both food safety and the commercial utilization of such packaging technology. This article reviews the different types of antimicrobial agents used for active food packaging materials, the main incorporation techniques, and the assessment methods used to examine the antimicrobial activity of packaging materials, taking into account their safety as food contact materials.

NOx Sensor for Direct Injection Emission Control

DOE Office of Scientific and Technical Information (OSTI.GOV)

Betteridge, William J

2006-02-28

The Electricore/Delphi team continues to leverage the electrochemical planar sensor technology that has produced stoichiometric planar and wide range oxygen sensors as the basis for development of a NOx sensor. Zirconia cell technology with an integrated heater will provide the foundation for the sensor structure. Proven materials and packaging technology will help to ensure a cost-effective approach to the manufacture of this sensor. The electronics technique and interface is considered to be an area where new strategies need to be employed to produce higher S/N ratios of the NOx signal with emphasis on signal stability over time for robustness andmore » durability Both continuous mode and pulse mode control techniques are being evaluated. Packaging the electronics requires careful design and circuit partitioning so that only the necessary signal conditioning electronics are coupled directly in the wiring harness, while the remainder is situated within the ECM for durability and costs reasons. This task continues to be on hold due to the limitation that the definition of the interface electronics was unavailable until very late in the project. The sense element is based on the amperometric method utilizing integrated alumina and zirconia ceramics. Precious metal electrodes are used to form the integrated heater, the cell electrodes and leads. Inside the actual sense cell structure, it is first necessary to separate NOx from the remaining oxygen constituents of the exhaust, without reducing the NOx. Once separated, the NOx will be measured using a measurement cell. Development or test coupons have been used to facilitate material selection and refinement, cell, diffusion barrier, and chamber development. The sense element currently requires elaborate interconnections. To facilitate a robust durable connection, mechanical and metallurgical connections are under investigation. Materials and process refinements continue to play an important role in the development of the sensor.« less

Preparation of conductive paper composites based on natural cellulosic fibers for packaging applications.

PubMed

Youssef, Ahmed M; El-Samahy, Magda Ali; Abdel Rehim, Mona H

2012-08-01

Conducting paper based on natural cellulosic fibers and conductive polymers was prepared using unbleached bagasse and/or rice straw fibers (as cellulosic raw materials) and polyaniline (PANi) as conducting polymer. These composites were synthesized by in situ emulsion polymerization using ammonium persulfate (APS) as oxidant in the presence of dodecylbenzene sulfonic acid (DBSA) as emulsifier. The prepared composites were characterized using Fourier transform infrared (FTIR), thermal gravimetric analysis (TGA), differential scanning calorimeter (DSC), and their morphology was investigated using scanning electron microscope (SEM). Electrical conductivity measurements showed that the conductivity of the paper sheets increases by increasing the ratio of PANi in the composite. Mechanical properties of the paper sheets were also investigated, the results revealed that the values of breaking length, burst factor, and tear factor are decreased with increasing ratio of added PANi, and this effect is more pronounced in bagasse-based composites. The new conductive composites can have potential use as anti-static packaging material or anti-bacterial paper for packaging applications. Copyright © 2012 Elsevier Ltd. All rights reserved.

9 CFR 317.24 - Packaging materials.

Code of Federal Regulations, 2011 CFR

2011-01-01

... 9 Animals and Animal Products 2 2011-01-01 2011-01-01 false Packaging materials. 317.24 Section... INSPECTION AND CERTIFICATION LABELING, MARKING DEVICES, AND CONTAINERS General § 317.24 Packaging materials... packaging materials must be safe for their intended use within the meaning of section 409 of the Federal...

Practical fundamentals of glass, rubber, and plastic sterile packaging systems.

PubMed

Sacha, Gregory A; Saffell-Clemmer, Wendy; Abram, Karen; Akers, Michael J

2010-01-01

Sterile product packaging systems consist of glass, rubber, and plastic materials that are in intimate contact with the formulation. These materials can significantly affect the stability of the formulation. The interaction between the packaging materials and the formulation can also affect the appropriate delivery of the product. Therefore, a parenteral formulation actually consists of the packaging system as well as the product that it contains. However, the majority of formulation development time only considers the product that is contained in the packaging system. Little time is spent studying the interaction of the packaging materials with the contents. Interaction between the packaging and the contents only becomes a concern when problems are encountered. For this reason, there are few scientific publications that describe the available packaging materials, their advantages and disadvantages, and their important product attributes. This article was created as a reference for product development and describes some of the packaging materials and systems that are available for parenteral products.

Characterization and antimicrobial properties of food packaging methylcellulose films containing stem extract of Ginja cherry.

PubMed

Campos, Débora; Piccirillo, Clara; Pullar, Robert C; Castro, Paula Ml; Pintado, Maria M E

2014-08-01

Food contamination and spoilage is a problem causing growing concern. To avoid it, the use of food packaging with appropriate characteristics is essential; ideally, the packaging should protect food from external contamination and exhibit antibacterial properties. With this aim, methylcellulose (MC) films containing natural extracts from the stems of Ginja cherry, an agricultural by-product, were developed and characterized. The antibacterial activity of films was screened by the disc diffusion method and quantified using the viable cell count assay. The films inhibited the growth of both Gram-positive and Gram-negative strains (Listeria innocua, methicillin-sensitive Staphylococcus aureus, methicillin-resistant S. aureus, Salmonella Enteritidis, Escherichia coli). For the films with lower extract content, effectiveness against the microorganisms depended on the inoculum concentration. Scanning electron microscope images of the films showed that those containing the extracts had a smooth and continuous structure. UV-visible spectroscopy showed that these materials do not transmit light in the UV. This study shows that MC films containing agricultural by-products, in this case Ginja cherry stem extract, could be used to prevent food contamination by relevant bacterial strains and degradation by UV light. Using such materials in food packaging, the shelf life of food products could be extended while utilizing an otherwise wasted by-product. © 2013 Society of Chemical Industry.

Sensory methods and electronic nose as innovative tools for the evaluation of the aroma transfer properties of food plastic bags.

PubMed

Torri, Luisa; Piochi, Maria

2016-07-01

Despite the key role of the sensory quality for food acceptance, the aroma transfer properties of food packaging materials have not yet been studied using sensory approaches. This research investigated the suitability of sensory and electronic nose methods to evaluate the aroma transfer properties of plastic materials that come in contact with food. Four (W, X, Y, and Z) commercial freezer bags (polyethylene) for domestic uses were compared. The degree of the aroma transfer through the materials was estimated as the sensory contamination of an odor absorber food (bread) by an odor releaser food (onion), separated by the bags and stored under frozen conditions. Bread samples were analyzed by means of an electronic nose, and 42 assessors used three different sensory methods (triangle, scoring, and partial sorted Napping tests). From the triangle test, none of the plastic bags acted as a complete aroma barrier, showing a sensory contamination of bread stored in all four materials. Partial sorting Napping results clearly described the sensory contamination of bread as "onion flavor", due to the aroma transfer from the odor releaser food to the odor absorber food through the plastic bag. Scoring tests showed significant (p<0.0001) differences of aroma transfer properties among the plastic bags, revealing the highest aroma permeation for W (3.1±0.1), the lowest aroma transfer for X and Y (2.0±0.1), and intermediate aroma transfer properties for Z (2.6±0.1). Electronic nose data were in good agreement with the sensory responses, and a high correlation with the scoring data was observed (R 2 =0.988). The presented approaches had suitable results to provide meaningful information on the aroma transfer properties of freezer plastic bags, and could advantageously be applied in the future for analyzing other finished food containers (e.g. plastic trays, boxes, etc.) or packaging materials of a different nature (multilayer plastic films, biodegradable materials, composites, etc.). Copyright © 2016 Elsevier Ltd. All rights reserved.

AIN-Based Packaging for SiC High-Temperature Electronics

NASA Technical Reports Server (NTRS)

Savrun, Ender

2004-01-01

Packaging made primarily of aluminum nitride has been developed to enclose silicon carbide-based integrated circuits (ICs), including circuits containing SiC-based power diodes, that are capable of operation under conditions more severe than can be withstood by silicon-based integrated circuits. A major objective of this development was to enable packaged SiC electronic circuits to operate continuously at temperatures up to 500 C. AlN-packaged SiC electronic circuits have commercial potential for incorporation into high-power electronic equipment and into sensors that must withstand high temperatures and/or high pressures in diverse applications that include exploration in outer space, well logging, and monitoring of nuclear power systems. This packaging embodies concepts drawn from flip-chip packaging of silicon-based integrated circuits. One or more SiC-based circuit chips are mounted on an aluminum nitride package substrate or sandwiched between two such substrates. Intimate electrical connections between metal conductors on the chip(s) and the metal conductors on external circuits are made by direct bonding to interconnections on the package substrate(s) and/or by use of holes through the package substrate(s). This approach eliminates the need for wire bonds, which have been the most vulnerable links in conventional electronic circuitry in hostile environments. Moreover, the elimination of wire bonds makes it possible to pack chips more densely than was previously possible.

Hermetically sealable package for hybrid solid-state electronic devices and the like

NASA Technical Reports Server (NTRS)

Miller, Wilson N. (Inventor); Gray, Ormal E. (Inventor)

1988-01-01

A light-weight, inexpensively fabricated, hermetically sealable, repairable package for small electronic or electromechanical units, having multiple connections, is described. A molded ring frame of polyamide-imide plastic (Torlon) is attached along one edge to a base plate formed of a highly heat conducting material, such as aluminum or copper. Bores are placed through a base plate within the area of the edge surface of ring frame which result in an attachment of the ring frame to the base plate during molding. Electrical leads are molded into the ring frame. The leads are L-shaped gold-plated copper wires imbedded within widened portions of the side wall of the ring frame. Within the plastic ring frame wall the leads are bent (typically, though not necessarily at 90 deg) so that they project into the interior volume of the ring frame for connection to the solid state devices.

Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication.

PubMed

Schuettler, Martin; Kohler, Fabian; Ordonez, Juan S; Stieglitz, Thomas

2012-01-01

Future brain-computer-interfaces (BCIs) for severely impaired patients are implanted to electrically contact the brain tissue. Avoiding percutaneous cables requires amplifier and telemetry electronics to be implanted too. We developed a hermetic package that protects the electronic circuitry of a BCI from body moisture while permitting infrared communication through the package wall made from alumina ceramic. The ceramic package is casted in medical grade silicone adhesive, for which we identified MED2-4013 as a promising candidate.

21 CFR 181.22 - Certain substances employed in the manufacture of food-packaging materials.

Code of Federal Regulations, 2011 CFR

2011-04-01

... food-packaging materials. 181.22 Section 181.22 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT... of food-packaging materials. Prior to the enactment of the food additives amendment to the Federal... manufacturing practice for food-packaging materials includes the restriction that the quantity of any of these...

78 FR 29016 - Establishing Quality Assurance Programs for Packaging Used in Transport of Radioactive Material

Federal Register 2010, 2011, 2012, 2013, 2014

2013-05-16

... Establishing Quality Assurance Programs for Packaging Used in Transport of Radioactive Material AGENCY: Nuclear..., ``Establishing Quality Assurance Programs for Packaging Used in Transport of Radioactive Material.'' This draft... regulations for the packaging and transportation of radioactive material in Part 71 of Title 10 of the Code of...

49 CFR 171.1 - Applicability of Hazardous Materials Regulations (HMR) to persons and functions.

Code of Federal Regulations, 2013 CFR

2013-10-01

... package or container or on a package or container containing a residue of a hazardous material. (5... bracing a hazardous materials package in a freight container or transport vehicle. (13) Segregating a hazardous materials package in a freight container or transport vehicle from incompatible cargo. (14...

49 CFR 171.1 - Applicability of Hazardous Materials Regulations (HMR) to persons and functions.

Code of Federal Regulations, 2011 CFR

2011-10-01

... package or container or on a package or container containing a residue of a hazardous material. (5... bracing a hazardous materials package in a freight container or transport vehicle. (13) Segregating a hazardous materials package in a freight container or transport vehicle from incompatible cargo. (14...

49 CFR 171.1 - Applicability of Hazardous Materials Regulations (HMR) to persons and functions.

Code of Federal Regulations, 2010 CFR

2010-10-01

... package or container or on a package or container containing a residue of a hazardous material. (5... bracing a hazardous materials package in a freight container or transport vehicle. (13) Segregating a hazardous materials package in a freight container or transport vehicle from incompatible cargo. (14...

49 CFR 171.1 - Applicability of Hazardous Materials Regulations (HMR) to persons and functions.

Code of Federal Regulations, 2012 CFR

2012-10-01

... package or container or on a package or container containing a residue of a hazardous material. (5... bracing a hazardous materials package in a freight container or transport vehicle. (13) Segregating a hazardous materials package in a freight container or transport vehicle from incompatible cargo. (14...

49 CFR 172.316 - Packagings containing materials classed as ORM-D.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false Packagings containing materials classed as ORM-D... INFORMATION, TRAINING REQUIREMENTS, AND SECURITY PLANS Marking § 172.316 Packagings containing materials classed as ORM-D. (a) Each non-bulk packaging containing a material classed as ORM-D must be marked on at...

Book of Knowledge (BOK) for NASA Electronic Packaging Roadmap

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2015-01-01

The objective of this document is to update the NASA roadmap on packaging technologies (initially released in 2007) and to present the current trends toward further reducing size and increasing functionality. Due to the breadth of work being performed in the area of microelectronics packaging, this report presents only a number of key packaging technologies detailed in three industry roadmaps for conventional microelectronics and a more recently introduced roadmap for organic and printed electronics applications. The topics for each category were down-selected by reviewing the 2012 reports of the International Technology Roadmap for Semiconductor (ITRS), the 2013 roadmap reports of the International Electronics Manufacturing Initiative (iNEMI), the 2013 roadmap of association connecting electronics industry (IPC), the Organic Printed Electronics Association (OE-A). The report also summarizes the results of numerous articles and websites specifically discussing the trends in microelectronics packaging technologies.

[The development and operation of a package inserts service system for electronic medical records].

PubMed

Yamada, Hidetoshi; Nishimura, Sachiho; Shimamori, Yoshimitsu; Sato, Seiji; Hayase, Yukitoshi

2003-03-01

To promote the appropriate use of pharmaceuticals and to prevent side effects, physicians need package inserts on medicinal drugs as soon as possible. A medicinal drug information service system was established for electronic medical records to speed up and increase the efficiency of package insert communications within a medical institution. Development of this system facilitates access to package inserts by, for example, physicians. The time required to maintain files of package inserts was shortened, and the efficiency of the drug information service increased. As a source of package inserts for this system, package inserts using a standard generalized markup language (SGML) form were used, which are accessible to the public on the homepage of the Organization for Pharmaceutical Safety and Research (OPSR). This study found that a delay occurred in communicating revised package inserts from pharmaceutical companies to the OPSR. Therefore a pharmaceutical department page was set up as part of the homepage of the medical institution for electronic medical records to shorten the delay in the revision of package inserts posted on the medicinal drug information service homepage of the OPSR. The usefulness of this package insert service system for electronic medical records is clear. For more effective use of this system based on the OPSR homepage pharmaceutical companies have been requested to provide quicker updating of package inserts.

Estimation of water diffusion coefficient into polycarbonate at different temperatures using numerical simulation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nasirabadi, P. Shojaee; Jabbari, M.; Hattel, J. H.

2016-06-08

Nowadays, many electronic systems are exposed to harsh conditions of relative humidity and temperature. Mass transport properties of electronic packaging materials are needed in order to investigate the influence of moisture and temperature on reliability of electronic devices. Polycarbonate (PC) is widely used in the electronics industry. Thus, in this work the water diffusion coefficient into PC is investigated. Furthermore, numerical methods used for estimation of the diffusion coefficient and their assumptions are discussed. 1D and 3D numerical solutions are compared and based on this, it is shown how the estimated value can be different depending on the choice ofmore » dimensionality in the model.« less

JTEC Panel report on electronic manufacturing and packaging in Japan

NASA Technical Reports Server (NTRS)

Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John; Meieran, Gene; Pecht, Michael; Peeples, John; Tummala, Rao; Dehaemer, Michael J.; Holdridge, Geoff (Editor); Gamota, George

1995-01-01

This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies.

9 CFR 317.24 - Packaging materials.

Code of Federal Regulations, 2014 CFR

2014-01-01

... supplier under whose brand name and firm name the material is marketed to the official establishment. The... packaging materials must be traceable to the applicable guaranty. (c) The guaranty by the packaging supplier.... Official establishments and packaging suppliers providing written guaranties to those official...

9 CFR 381.144 - Packaging materials.

Code of Federal Regulations, 2013 CFR

2013-01-01

..., from the packaging supplier under whose brand name and firm name the material is marketed to the... packaging supplier will be accepted by Program inspectors to establish that the use of material complies.... Official establishments and packaging suppliers providing written guaranties to those official...

9 CFR 317.24 - Packaging materials.

Code of Federal Regulations, 2012 CFR

2012-01-01

... supplier under whose brand name and firm name the material is marketed to the official establishment. The... packaging materials must be traceable to the applicable guaranty. (c) The guaranty by the packaging supplier.... Official establishments and packaging suppliers providing written guaranties to those official...

9 CFR 381.144 - Packaging materials.

Code of Federal Regulations, 2012 CFR

2012-01-01

..., from the packaging supplier under whose brand name and firm name the material is marketed to the... packaging supplier will be accepted by Program inspectors to establish that the use of material complies.... Official establishments and packaging suppliers providing written guaranties to those official...

9 CFR 381.144 - Packaging materials.

Code of Federal Regulations, 2014 CFR

2014-01-01

..., from the packaging supplier under whose brand name and firm name the material is marketed to the... packaging supplier will be accepted by Program inspectors to establish that the use of material complies.... Official establishments and packaging suppliers providing written guaranties to those official...

9 CFR 317.24 - Packaging materials.

Code of Federal Regulations, 2013 CFR

2013-01-01

... supplier under whose brand name and firm name the material is marketed to the official establishment. The... packaging materials must be traceable to the applicable guaranty. (c) The guaranty by the packaging supplier.... Official establishments and packaging suppliers providing written guaranties to those official...

Thematic mapper flight model preshipment review data package. Volume 2, part A: Subsystem data

NASA Technical Reports Server (NTRS)

1982-01-01

Performance and acceptance data are presented for the multiplexer, scan mirror, power supply, mainframe/top mechanical and the aft optics, assemblies. Other major subsystems evaluated include the relay optics, the electronic module, the radiative cooler, and the cable harness. Reference lists of nonconforming materials reports, failure reports, and requests for deviation/waiver are also given.

Advanced Interconnect Roadmap for Space Applications

NASA Technical Reports Server (NTRS)

Galbraith, Lissa

1999-01-01

This paper presents the NASA electronic parts and packaging program for space applications. The topics include: 1) Forecasts; 2) Technology Challenges; 3) Research Directions; 4) Research Directions for Chip on Board (COB); 5) Research Directions for HDPs: Multichip Modules (MCMs); 6) Research Directions for Microelectromechanical systems (MEMS); 7) Research Directions for Photonics; and 8) Research Directions for Materials. This paper is presented in viewgraph form.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ma, Ying; Li, Hong; Bridges, Denzel

We report that the continuing miniaturization of microelectronics is pushing advanced manufacturing into nanomanufacturing. Nanojoining is a bottom-up assembly technique that enables functional nanodevice fabrication with dissimilar nanoscopic building blocks and/or molecular components. Various conventional joining techniques have been modified and re-invented for joining nanomaterials. Our review surveys recent progress in nanojoining methods, as compared to conventional joining processes. Examples of nanojoining are given and classified by the dimensionality of the joining materials. At each classification, nanojoining is reviewed and discussed according to materials specialties, low dimensional processing features, energy input mechanisms and potential applications. The preparation of new intermetallicmore » materials by reactive nanoscale multilayer foils based on self-propagating high-temperature synthesis is highlighted. This review will provide insight into nanojoining fundamentals and innovative applications in power electronics packaging, plasmonic devices, nanosoldering for printable electronics, 3D printing and space manufacturing.« less

Packaging Concerns/Techniques for Large Devices

NASA Technical Reports Server (NTRS)

Sampson, Michael J.

2009-01-01

This slide presentation reviews packaging challenges and options for electronic parts. The presentation includes information about non-hermetic packages, space challenges for packaging and complex package variations.

Effectiveness of some recent antimicrobial packaging concepts.

PubMed

Vermeiren, L; Devlieghere, F; Debevere, J

2002-01-01

A new type of active packaging is the combination of food-packaging materials with antimicrobial substances to control microbial surface contamination of foods. For both migrating and non-migrating antimicrobial materials, intensive contact between the food product and packaging material is required and therefore potential food applications include especially vacuum or skin-packaged products, e.g. vacuum-packaged meat, fish, poultry or cheese. Several antimicrobial compounds have been combined with different types of carriers (plastic and rubber articles, paper-based materials, textile fibrils and food-packaging materials). Until now, however, few antimicrobial concepts have found applications as a food-packaging material. Antimicrobial packaging materials cannot legally be used in the EU at the moment. The potential use would require amendments of several different legal texts involving areas such as food additives, food packaging, hygiene, etc. The main objective of this paper is to provide a state of the art about the different types of antimicrobial concepts, their experimental development and commercialization, and to present a case study summarizing the results of investigations on the feasibility of a low-density polyethylene (LDPE)-film containing triclosan to inhibit microbial growth on food surfaces and consequently prolong shelf-life or improve microbial food safety. In contrast with the strong antimicrobial effect in in-vitro simulated vacuum-packaged conditions against the psychrotrophic food pathogen L. monocytogenes, the 1000 mg kg(-1) containing triclosan film did not effectively reduce spoilage bacteria and growth of L. monocytogenes on refrigerated vacuum-packaged chicken breasts stored at 7 degrees C.

77 FR 14445 - Leakage Tests on Packages for Shipment of Radioactive Material

Federal Register 2010, 2011, 2012, 2013, 2014

2012-03-09

... NUCLEAR REGULATORY COMMISSION [NRC-2011-0045] Leakage Tests on Packages for Shipment of..., ``Leakage Tests on Packages for Radioactive Material.'' ADDRESSES: You can access publicly available... Materials--Leakage Tests on Packages for Shipment'' approved February 1998. The NRC staff developed and...

77 FR 18871 - Administrative Guide for Verifying Compliance With Packaging Requirements for Shipment and...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-03-28

... Packaging Requirements for Shipment and Receipt of Radioactive Material AGENCY: Nuclear Regulatory... with Packaging Requirements for Shipment and Receipt of Radioactive Material.'' This regulatory guide... for transporting licensed material under 10 CFR part 71, ``Packaging and Transportation of Radioactive...

Natural biopolymer-based nanocomposite films for packaging applications.

PubMed

Rhim, Jong-Whan; Ng, Perry K W

2007-01-01

Concerns on environmental waste problems caused by non-biodegradable petrochemical-based plastic packaging materials as well as the consumer's demand for high quality food products has caused an increasing interest in developing biodegradable packaging materials using annually renewable natural biopolymers such as polysaccharides and proteins. Inherent shortcomings of natural polymer-based packaging materials such as low mechanical properties and low water resistance can be recovered by applying a nanocomposite technology. Polymer nanocomposites, especially natural biopolymer-layered silicate nanocomposites, exhibit markedly improved packaging properties due to their nanometer size dispersion. These improvements include increased modulus and strength, decreased gas permeability, and increased water resistance. Additionally, biologically active ingredients can be added to impart the desired functional properties to the resulting packaging materials. Consequently, natural biopolymer-based nanocomposite packaging materials with bio-functional properties have a huge potential for application in the active food packaging industry. In this review, recent advances in the preparation of natural biopolymer-based films and their nanocomposites, and their potential use in packaging applications are addressed.

The Model 9977 Radioactive Material Packaging Primer

DOE Office of Scientific and Technical Information (OSTI.GOV)

Abramczyk, G.

2015-10-09

The Model 9977 Packaging is a single containment drum style radioactive material (RAM) shipping container designed, tested and analyzed to meet the performance requirements of Title 10 the Code of Federal Regulations Part 71. A radioactive material shipping package, in combination with its contents, must perform three functions (please note that the performance criteria specified in the Code of Federal Regulations have alternate limits for normal operations and after accident conditions): Containment, the package must “contain” the radioactive material within it; Shielding, the packaging must limit its users and the public to radiation doses within specified limits; and Subcriticality, themore » package must maintain its radioactive material as subcritical« less

Thermal Management and Packaging Reliability (Text Version) |

Science.gov Websites

Transportation Research | NREL Thermal Management and Packaging Reliability (Text Version ) Thermal Management and Packaging Reliability (Text Version) Learn how NREL's thermal management and ;Boosting Thermal Management & Reliability of Vehicle Power Electronics." Better power electronics

Performance and Reliability of Bonded Interfaces for High-Temperature Packaging

DOE Office of Scientific and Technical Information (OSTI.GOV)

Paret, Paul P

2017-08-02

Sintered silver has proven to be a promising candidate for use as a die-attach and substrate-attach material in automotive power electronics components. It holds promise of greater reliability than lead-based and lead-free solders, especially at higher temperatures (>200 degrees C). Accurate predictive lifetime models of sintered silver need to be developed and its failure mechanisms thoroughly characterized before it can be deployed as a die-attach or substrate-attach material in wide-bandgap device-based packages. Mechanical characterization tests that result in stress-strain curves and accelerated tests that produce cycles-to-failure result will be conducted. Also, we present a finite element method (FEM) modeling methodologymore » that can offer greater accuracy in predicting the failure of sintered silver under accelerated thermal cycling. A fracture mechanics-based approach is adopted in the FEM model, and J-integral/thermal cycle values are computed.« less

Band Gap Tuning in 2D Layered Materials by Angular Rotation.

PubMed

Polanco-Gonzalez, Javier; Carranco-Rodríguez, Jesús Alfredo; Enríquez-Carrejo, José L; Mani-Gonzalez, Pierre G; Domínguez-Esquivel, José Manuel; Ramos, Manuel

2017-02-08

We present a series of computer-assisted high-resolution transmission electron (HRTEM) simulations to determine Moiré patters by induced twisting effects between slabs at rotational angles of 3°, 5°, 8°, and 16°, for molybdenum disulfide, graphene, tungsten disulfide, and tungsten selenide layered materials. In order to investigate the electronic structure, a series of numerical simulations using density functional methods (DFT) methods was completed using Cambridge serial total energy package (CASTEP) with a generalized gradient approximation to determine both the band structure and density of states on honeycomb-like new superlattices. Our results indicated metallic transitions when the rotation approached 8° with respect to each other laminates for most of the two-dimensional systems that were analyzed.

Band Gap Tuning in 2D Layered Materials by Angular Rotation

PubMed Central

Polanco-Gonzalez, Javier; Carranco-Rodríguez, Jesús Alfredo; Enríquez-Carrejo, José L.; Mani-Gonzalez, Pierre G.; Domínguez-Esquivel, José Manuel; Ramos, Manuel

2017-01-01

We present a series of computer-assisted high-resolution transmission electron (HRTEM) simulations to determine Moiré patters by induced twisting effects between slabs at rotational angles of 3°, 5°, 8°, and 16°, for molybdenum disulfide, graphene, tungsten disulfide, and tungsten selenide layered materials. In order to investigate the electronic structure, a series of numerical simulations using density functional methods (DFT) methods was completed using Cambridge serial total energy package (CASTEP) with a generalized gradient approximation to determine both the band structure and density of states on honeycomb-like new superlattices. Our results indicated metallic transitions when the rotation approached 8° with respect to each other laminates for most of the two-dimensional systems that were analyzed. PMID:28772507

Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads

NASA Astrophysics Data System (ADS)

Ren, Huai-Hui; Wang, Xi-Shu

2014-04-01

This paper studies and compares the effects of pull-pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package. The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.

77 FR 36017 - Regulatory Guide 7.3, Procedures for Picking Up and Receiving Packages of Radioactive Material

Federal Register 2010, 2011, 2012, 2013, 2014

2012-06-15

... Receiving Packages of Radioactive Material AGENCY: Nuclear Regulatory Commission. ACTION: Notice of... Guide (RG) 7.3, ``Procedures for Picking Up and Receiving Packages of Radioactive Material.'' The guide..., ``Administrative Guide for Verifying Compliance with Packaging Requirements for Shipment and Receipt of Radioactive...

Advanced induction accelerator designs for ground based and space based FELs

NASA Astrophysics Data System (ADS)

Birx, Daniel

1994-04-01

The primary goal of this program was to improve the performance of induction accelerators with particular regards to their being used to drive Free Electron Lasers (FEL's). It is hoped that FEL's operating at visible wavelengths might someday be used to beam power from earth to extraterrestrial locations. One application of this technology might be strategic theater defense, but this power source might be used to propel vehicles or supplement solar energized systems. Our path toward achieving this goal was directed first toward optimization of the nonlinear magnetic material used in induction accelerator construction and secondly at the overall design in terms of cost, size and efficiency. We began this research effort with an in depth study into the properties of various nonlinear magnetic materials. With the data on nonlinear magnetic materials, so important to the optimization of efficiency, in hand, we envisioned a new induction accelerator design where all of the components were packaged together in one container. This induction accelerator module would combine an /ll-solid-state, nonlinear magnetic driver and the induction accelerator cells all in one convenient package. Each accelerator module (denoted SNOMAD-IVB) would produce 1.0 MeV of acceleration with the exception of the SNOMAD-IV injector module which would produce 0.5 MeV of acceleration for an electron beam current up to 1000 amperes.

High resolution X-ray CT for advanced electronics packaging

NASA Astrophysics Data System (ADS)

Oppermann, M.; Zerna, T.

2017-02-01

Advanced electronics packaging is a challenge for non-destructive Testing (NDT). More, smaller and mostly hidden interconnects dominate modern electronics components and systems. To solve the demands of customers to get products with a high functionality by low volume, weight and price (e.g. mobile phones, personal medical monitoring systems) often the designers use System-in-Package solutions (SiP). The non-destructive testing of such devices is a big challenge. So our paper will impart fundamentals and applications for non-destructive evaluation of inner structures of electronics packaging for quality assurance and reliability investigations with a focus on X-ray methods, especially on high resolution X-ray computed tomography (CT).

75 FR 27205 - Hazardous Materials: Incorporation of Special Permits Into Regulations

Federal Register 2010, 2011, 2012, 2013, 2014

2010-05-14

... transportation, Packaging and containers, Radioactive materials, Reporting and recordkeeping requirements... manufacture, marking, sale and use of certain packagings for transportation of hazardous materials. These... packagings prepared in accordance with Sec. 173.13. Authorize, for certain hazardous materials, external...

76 FR 41241 - Proposed Agency Information Collection

Federal Register 2010, 2011, 2012, 2013, 2014

2011-07-13

... Material.'' The CoC defines the packaging, radioactive material content, and transportation restrictions... Radioactive Materials Packages; (3) Type of Request: New; (4) Purpose: This information collection is in... approved a radioactive material package as meeting the applicable safety standards [[Page 41242

49 CFR 173.25 - Authorized packagings and overpacks.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false Authorized packagings and overpacks. 173.25...-GENERAL REQUIREMENTS FOR SHIPMENTS AND PACKAGINGS Preparation of Hazardous Materials for Transportation § 173.25 Authorized packagings and overpacks. (a) Authorized packages containing hazardous materials may...

Enhancement of DFT-calculations at petascale: Nuclear Magnetic Resonance, Hybrid Density Functional Theory and Car-Parrinello calculations

NASA Astrophysics Data System (ADS)

Varini, Nicola; Ceresoli, Davide; Martin-Samos, Layla; Girotto, Ivan; Cavazzoni, Carlo

2013-08-01

One of the most promising techniques used for studying the electronic properties of materials is based on Density Functional Theory (DFT) approach and its extensions. DFT has been widely applied in traditional solid state physics problems where periodicity and symmetry play a crucial role in reducing the computational workload. With growing compute power capability and the development of improved DFT methods, the range of potential applications is now including other scientific areas such as Chemistry and Biology. However, cross disciplinary combinations of traditional Solid-State Physics, Chemistry and Biology drastically improve the system complexity while reducing the degree of periodicity and symmetry. Large simulation cells containing of hundreds or even thousands of atoms are needed to model these kind of physical systems. The treatment of those systems still remains a computational challenge even with modern supercomputers. In this paper we describe our work to improve the scalability of Quantum ESPRESSO (Giannozzi et al., 2009 [3]) for treating very large cells and huge numbers of electrons. To this end we have introduced an extra level of parallelism, over electronic bands, in three kernels for solving computationally expensive problems: the Sternheimer equation solver (Nuclear Magnetic Resonance, package QE-GIPAW), the Fock operator builder (electronic ground-state, package PWscf) and most of the Car-Parrinello routines (Car-Parrinello dynamics, package CP). Final benchmarks show our success in computing the Nuclear Magnetic Response (NMR) chemical shift of a large biological assembly, the electronic structure of defected amorphous silica with hybrid exchange-correlation functionals and the equilibrium atomic structure of height Porphyrins anchored to a Carbon Nanotube, on many thousands of CPU cores.

49 CFR 173.453 - Fissile materials-exceptions.

Code of Federal Regulations, 2014 CFR

2014-10-01

... noted. (a) An individual package containing 2 grams or less of fissile material. (b) An individual or bulk packaging containing 15 grams or less of fissile material provided the package has at least 200 grams of solid nonfissile material for every gram of fissile material. Lead, beryllium, graphite, and...

49 CFR 173.453 - Fissile materials-exceptions.

Code of Federal Regulations, 2010 CFR

2010-10-01

... noted. (a) An individual package containing 2 grams or less of fissile material. (b) An individual or bulk packaging containing 15 grams or less of fissile material provided the package has at least 200 grams of solid nonfissile material for every gram of fissile material. Lead, beryllium, graphite, and...

49 CFR 173.453 - Fissile materials-exceptions.

Code of Federal Regulations, 2012 CFR

2012-10-01

... noted. (a) An individual package containing 2 grams or less of fissile material. (b) An individual or bulk packaging containing 15 grams or less of fissile material provided the package has at least 200 grams of solid nonfissile material for every gram of fissile material. Lead, beryllium, graphite, and...

49 CFR 173.453 - Fissile materials-exceptions.

Code of Federal Regulations, 2013 CFR

2013-10-01

... noted. (a) An individual package containing 2 grams or less of fissile material. (b) An individual or bulk packaging containing 15 grams or less of fissile material provided the package has at least 200 grams of solid nonfissile material for every gram of fissile material. Lead, beryllium, graphite, and...

49 CFR 173.453 - Fissile materials-exceptions.

Code of Federal Regulations, 2011 CFR

2011-10-01

... noted. (a) An individual package containing 2 grams or less of fissile material. (b) An individual or bulk packaging containing 15 grams or less of fissile material provided the package has at least 200 grams of solid nonfissile material for every gram of fissile material. Lead, beryllium, graphite, and...

Hermetic Packages For Millimeter-Wave Circuits

NASA Technical Reports Server (NTRS)

Herman, Martin I.; Lee, Karen A.; Lowry, Lynn E.; Carpenter, Alain; Wamhof, Paul

1994-01-01

Advanced hermetic packages developed to house electronic circuits operating at frequencies from 1 to 100 gigahertz and beyond. Signals coupled into and out of packages electromagnetically. Provides circuit packages small, lightweight, rugged, and inexpensive in mass production. Packages embedded in planar microstrip and coplanar waveguide circuits, in waveguide-to-planar and planar-to-waveguide circuitry, in waveguide-to-waveguide circuitry, between radiating (antenna) elements, and between planar transmission lines and radiating elements. Other applications in automotive, communication, radar, remote sensing, and biomedical electronic systems foreseen.

Savannah River Site Eastern Transportation Hub: A Concept For a DOE Eastern Packaging, Staging and Maintenance Center - 13143

DOE Office of Scientific and Technical Information (OSTI.GOV)

England, Jeffery L.; Adams, Karen; Maxted, Maxcine

2013-07-01

The Department of Energy (DOE) is working to de-inventory sites and consolidate hazardous materials for processing and disposal. The DOE administers a wide range of certified shipping packages for the transport of hazardous materials to include Special Nuclear Material (SNM), radioactive materials, sealed sources and radioactive wastes. A critical element to successful and safe transportation of these materials is the availability of certified shipping packages. There are over seven thousand certified packagings (i.e., Type B/Type AF) utilized within the DOE for current missions. The synergistic effects of consolidated maintenance, refurbishment, testing, certification, and costing of these services would allow formore » efficient management of the packagings inventory and to support anticipated future in-commerce shipping needs. The Savannah River Site (SRS) receives and ships radioactive materials (including SNM) and waste on a regular basis for critical missions such as consolidated storage, stabilization, purification, or disposition using H-Canyon and HB-Line. The Savannah River National Laboratory (SRNL) has the technical capability and equipment for all aspects of packaging management. SRS has the only active material processing facility in the DOE complex and is one of the sites of choice for nuclear material consolidation. SRS is a logical location to perform maintenance and periodic testing of the DOE fleet of certified packagings. This initiative envisions a DOE Eastern Packaging Staging and Maintenance Center (PSMC) at the SRS and a western hub at the Nevada National Security Site (NNSS), an active DOE Regional Disposal Site. The PSMC's would be the first place DOE would go to meet their radioactive packaging needs and the primary locations projects would go to disposition excess packaging for beneficial reuse. These two hubs would provide the centralized management of a packaging fleet rather than the current approach to design, procure, maintain and dispose of packagings on a project-by-project basis. This initiative provides significant savings in packaging costs and acceleration of project schedules. In addition to certified packaging, the PSMC would be well suited for select designs of 7A Type A packaging and Industrial Packaging. (authors)« less

Risk Management of Microelectronics: The NASA Electronic Parts and Packaging (NEPP) Program

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2005-01-01

This viewgraph information provides information on how the NASA Electronic Parts and Packaging (NEPP) Program evaluates the reliability of technologies for Electrical, Electronic, and Electromechanical (EEE) parts, and their suitability for spacecraft applications.

49 CFR 172.312 - Liquid hazardous materials in non-bulk packagings.

Code of Federal Regulations, 2014 CFR

2014-10-01

... offered or intended for transportation by aircraft, packages containing flammable liquids in inner... 49 Transportation 2 2014-10-01 2014-10-01 false Liquid hazardous materials in non-bulk packagings... HAZARDOUS MATERIALS SAFETY ADMINISTRATION, DEPARTMENT OF TRANSPORTATION HAZARDOUS MATERIALS REGULATIONS...

49 CFR 172.312 - Liquid hazardous materials in non-bulk packagings.

Code of Federal Regulations, 2013 CFR

2013-10-01

... offered or intended for transportation by aircraft, packages containing flammable liquids in inner... 49 Transportation 2 2013-10-01 2013-10-01 false Liquid hazardous materials in non-bulk packagings... HAZARDOUS MATERIALS SAFETY ADMINISTRATION, DEPARTMENT OF TRANSPORTATION HAZARDOUS MATERIALS REGULATIONS...

78 FR 1101 - Hazardous Materials: Harmonization With the United Nations Recommendations on the Transport of...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-01-07

... packaging maintains an equivalent level of performance to the originally tested packaging design must be... material, packing group assignments, special provisions, packaging authorizations, packaging sections, air... responsibilities related to packaging design variation, manufacturer notification, and recordkeeping requirements...

78 FR 54775 - Bulk Packaging To Allow for Transfer of Hazardous Liquid Cargoes

Federal Register 2010, 2011, 2012, 2013, 2014

2013-09-06

... the selection and use of packaging in the transportation of hazardous materials. This rule will... Pipeline and Hazardous Materials Safety Administration SBA Small Business Administration U.S.C. United... materials to and from bulk packaging on vessels. The Coast Guard is expanding the list of bulk packaging...

Opportunities for cellulose nanomaterials in packaging films: a review and future trends

Treesearch

Nicole M. Stark

2016-01-01

Performance requirements for packaging films may include barrier properties, transparency, flexibility, and tensile strength. Conventional packaging materials such as plastic films and laminates, are typically made from petroleum-based polymers. Currently, there is a drive to develop sustainable packaging materials. These alternative materials must be able to be...

Antimicrobial activity of biodegradable polysaccharide and protein-based films containing active agents.

PubMed

Kuorwel, Kuorwel K; Cran, Marlene J; Sonneveld, Kees; Miltz, Joseph; Bigger, Stephen W

2011-04-01

Significant interest has emerged in the introduction of food packaging materials manufactured from biodegradable polymers that have the potential to reduce the environmental impacts associated with conventional packaging materials. Current technologies in active packaging enable effective antimicrobial (AM) packaging films to be prepared from biodegradable materials that have been modified and/or blended with different compatible materials and/or plasticisers. A wide range of AM films prepared from modified biodegradable materials have the potential to be used for packaging of various food products. This review examines biodegradable polymers derived from polysaccharides and protein-based materials for their potential use in packaging systems designed for the protection of food products from microbial contamination. A comprehensive table that systematically analyses and categorizes much of the current literature in this area is included in the review.

Leveraging Available Data to Support Extension of Transportation Packages Service Life

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dunn, K.; Abramczyk, G.; Bellamy, S.

Data obtained from testing shipping package materials have been leveraged to support extending the service life of select shipping packages while in nuclear materials transportation. Increasingly, nuclear material inventories are being transferred to an interim storage location where they will reside for extended periods of time. Use of a shipping package to store nuclear materials in an interim storage location has become more attractive for a variety of reasons. Shipping packages are robust and have a qualified pedigree for their performance in normal operation and accident conditions within the approved shipment period and storing nuclear material within a shipping packagemore » results in reduced operations for the storage facility. However, the shipping package materials of construction must maintain a level of integrity as specified by the safety basis of the storage facility through the duration of the storage period, which is typically well beyond the one year transportation window. Test programs have been established to obtain aging data on materials of construction that are the most sensitive/susceptible to aging in certain shipping package designs. The collective data are being used to support extending the service life of shipping packages in both transportation and storage.« less

Design of Amphoteric Refraction Models Using WAVICA and RAYICA

NASA Technical Reports Server (NTRS)

Su, Richard

2004-01-01

The phenomenon of refraction of light is due to refractive index mismatches in two different media. However, to achieve this effect, a finite reflection loss is inevitable. A recent finding presented a unique type of interface, ferroelastic materials, that enables refraction without any reflection for either an electron or a light beam. This property is called total refraction. The same type of interface that yields total refraction can also yield amphoteric refraction, where the index of refraction can be either positive or negative depending on the incident angle. This interface could potentially be used to steer light without reflections which could have major applications in high power optics. My goal this summer is to first familiarize myself with the Mathematica software, especially the Wavica and Rayica packages. I will then model the amphoteric refraction by either modifying the Wavica and Rayica packages or using the built-in functions in these packages.

Applications of multi-walled carbon nanotube in electronic packaging

PubMed Central

2012-01-01

Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip. The use of multi-walled carbon nanotube to enhance the thermal conductivity, and the mechanical strength of die attach epoxy and Pb-free solder is demonstrated in this work. PMID:22405035

Multi-layered Poly-Dimethylsiloxane As A Non-Hermetic Packaging Material For Medical MEMS

PubMed Central

Lachhman, S.; Zorman, C.A.; Ko, W.H.

2012-01-01

Poly-dimethylsiloxane (PDMS) is an attractive material for packaging implantable biomedical microdevices owing to its biocompatibility, ease in application, and bio-friendly mechanical properties. Unfortunately, devices encapsulated by PDMS lack the longevity for use in chronic implant applications due to defect-related moisture penetration through the packaging layer. This paper describes an effort to improve the performance of PDMS as packaging material by constructing the encapsulant from multiple, thin layers of PDMS as a part of a polymeric multi-material package PMID:23366225

The effect of electronic package on satisfaction in multiple sclerosis patients

PubMed Central

Mohamadirizi, Shahla; Shaygannejad, Vahid; Mohamadirizi, Soheila; Khosrawi, Saeid

2016-01-01

Background: Traditional teaching methods used in medical education cannot wholly respond to the rapid changes and growth of information as well as continuous changes in the educational needs of society, especially patients with chronic diseases such as multiple sclerosis (MS). Therefore, this study was designed with the aim of examining the effect of electronic package on satisfaction in MS patients. Materials and Methods: The research was a quasi-experimental study. It was carried out at the MS Kashani Center affiliated to the Isfahan University of Medical Sciences, in 2013. One hundred twenty-eight patients with MS were allocated randomly into two equal groups of 64 each for education by booklet (control) and education by multimedia software (experimental) for 2 weeks. Data were collected by processing questionnaires, which consisted of questions about satisfaction (17 items) and questions about demographic and disease characteristics (9 items), answered by both groups before and 2 weeks after education. SPSS version 14 (DARYA software, Iran) was used to conduct statistical tests such as the independent t-test and the paired t-test for analyzing the data. The statistical significance level was less than 0.05. Results: The results show that there was not any significant difference between the satisfaction scores of the electronic package and control groups before intervention, but that there was a significant difference after 2 weeks’ intervention (P = 0.010). Conclusion: The electronic programs comprised an attractive education method. So this technology can increase motivation in MS patients to study more about the disease process. PMID:27308261

Reliability Factors for Electronic Components in a Storage Environment

DTIC Science & Technology

1977-09-01

Other moisture-induced failure mechanisms include crack propagation in brittle materials such as ceramic seals, glass passivation layers, nitride ...for Aluminum -Gold .... .............. ... 80 4-5 Fatigue S-N Curve Typical for Most Metals and Polymers . 85 4-6 Comparison of Surface Damageý Within...8 Aluminum -Silicon Phase Diagram ...... ............... 96 5-1 Evaluation of Gases from Microcircuit Package .... ....... 121 6-1 Plot of Resistivity

Effect of novel food processing methods on packaging: structure, composition, and migration properties.

PubMed

Guillard, V; Mauricio-Iglesias, M; Gontard, N

2010-11-01

Classical stabilization techniques (thermal treatments) usually involve food to be packed after being processed. On the contrary and increasingly, novel food processing methods, such as high pressure or microwaves, imply that both packaging and foodstuff undergo the stabilization treatment. Moreover, novel treatments (UV light, irradiation, ozone, cold plasma) are specifically used for disinfection and sterilization of the packaging material itself. Therefore, in the last several years a number of papers have focused on the effects of these new treatments on food-packaging interactions with a special emphasis on chemical migration and safety concerns. New packaging materials merged on the market with specific interest regarding the environment (i.e. bio-sourced materials) or mechanical and barrier properties (i.e. nanocomposites packaging materials). It is time to evaluate the knowledge about how these in-package food technologies affect food/packaging interactions, and especially for novel biodegradable and/or active materials. This article presents the effect of high pressure treatment, microwave heating, irradiation, UV-light, ozone and, cold plasma treatment on food/packaging interactions.

Electronics reliability fracture mechanics. Volume 1: Causes of failures of shop replaceable units and hybrid microcircuits

NASA Astrophysics Data System (ADS)

Kallis, J.; Buechler, D.; Erickson, J.; Westerhuyzen, D. V.; Strokes, R.

1992-05-01

This is the first of two volumes. The other volume (WL-TR-91-3119) is 'Fracture Mechanics'. The objective of the Electronics Reliability Fracture Mechanics (ERFM) program was to develop and demonstrate a life prediction technique for electronic assemblies, when subjected to environmental stress of vibration and thermal cycling, based upon the mechanical properties of the materials and packaging configurations which make up an electronic system. A detailed investigation was performed of the following two shop replaceable units (SRUs): Timing and Control Module (P/N 3562102) and Linear Regulator Module (P/N 3569800). The SRUs are in the Programmable Signal Processor (3137042) Line Replaceable Unit (LRU) of the Hughes AN/APG-63 Radar for the F-15 Aircraft.

Zero-dimensional to three-dimensional nanojoining: current status and potential applications

DOE PAGES

Ma, Ying; Li, Hong; Bridges, Denzel; ...

2016-08-01

We report that the continuing miniaturization of microelectronics is pushing advanced manufacturing into nanomanufacturing. Nanojoining is a bottom-up assembly technique that enables functional nanodevice fabrication with dissimilar nanoscopic building blocks and/or molecular components. Various conventional joining techniques have been modified and re-invented for joining nanomaterials. Our review surveys recent progress in nanojoining methods, as compared to conventional joining processes. Examples of nanojoining are given and classified by the dimensionality of the joining materials. At each classification, nanojoining is reviewed and discussed according to materials specialties, low dimensional processing features, energy input mechanisms and potential applications. The preparation of new intermetallicmore » materials by reactive nanoscale multilayer foils based on self-propagating high-temperature synthesis is highlighted. This review will provide insight into nanojoining fundamentals and innovative applications in power electronics packaging, plasmonic devices, nanosoldering for printable electronics, 3D printing and space manufacturing.« less

Human exposure assessment of silver and copper migrating from an antimicrobial nanocoated packaging material into an acidic food simulant.

PubMed

Hannon, Joseph Christopher; Kerry, Joseph P; Cruz-Romero, Malco; Azlin-Hasim, Shafrina; Morris, Michael; Cummins, Enda

2016-09-01

To examine the human exposure to a novel silver and copper nanoparticle (AgNP and CuNP)/polystyrene-polyethylene oxide block copolymer (PS-b-PEO) food packaging coating, the migration of Ag and Cu into 3% acetic acid (3% HAc) food simulant was assessed at 60 °C for 10 days. Significantly lower migration was observed for Ag (0.46 mg/kg food) compared to Cu (0.82 mg/kg food) measured by inductively coupled plasma - atomic emission spectrometry (ICP-AES). In addition, no distinct population of AgNPs or CuNPs were observed in 3% HAc by nanoparticle tracking analysis (NTA) and transmission electron microscopy (TEM). The predicted human exposure to Ag and Cu was used to calculate a margin of exposure (MOE) for ionic species of Ag and Cu, which indicated the safe use of the food packaging in a hypothetical scenario (e.g. as fruit juice packaging). While migration exceeded regulatory limits, the calculated MOE suggests current migration limits may be conservative for specific nano-packaging applications. Copyright © 2016 Elsevier Ltd. All rights reserved.

Edible packaging materials.

PubMed

Janjarasskul, Theeranun; Krochta, John M

2010-01-01

Research groups and the food and pharmaceutical industries recognize edible packaging as a useful alternative or addition to conventional packaging to reduce waste and to create novel applications for improving product stability, quality, safety, variety, and convenience for consumers. Recent studies have explored the ability of biopolymer-based food packaging materials to carry and control-release active compounds. As diverse edible packaging materials derived from various by-products or waste from food industry are being developed, the dry thermoplastic process is advancing rapidly as a feasible commercial edible packaging manufacturing process. The employment of nanocomposite concepts to edible packaging materials promises to improve barrier and mechanical properties and facilitate effective incorporation of bioactive ingredients and other designed functions. In addition to the need for a more fundamental understanding to enable design to desired specifications, edible packaging has to overcome challenges such as regulatory requirements, consumer acceptance, and scaling-up research concepts to commercial applications.

Design and Development of a CPCI-Based Electronics Package for Space Station Experiments

NASA Technical Reports Server (NTRS)

Kolacz, John S.; Clapper, Randy S.; Wade, Raymond P.

2006-01-01

The NASA John H. Glenn Research Center is developing a Compact-PCI (CPCI) based electronics package for controlling space experiment hardware on the International Space Station. Goals of this effort include an easily modified, modular design that allows for changes in experiment requirements. Unique aspects of the experiment package include a flexible circuit used for internal interconnections and a separate enclosure (box in a box) for controlling 1 kW of power for experiment fuel heating requirements. This electronics package was developed as part of the FEANICS (Flow Enclosure Accommodating Novel Investigations in Combustion of Solids) mini-facility which is part of the Fluids and Combustion Facility s Combustion Integrated Rack (CIR). The CIR will be the platform for future microgravity combustion experiments and will reside on the Destiny Module of the International Space Station (ISS). The FEANICS mini-facility will be the primary means for conducting solid fuel combustion experiments in the CIR on ISS. The main focus of many of these solid combustion experiments will be to conduct applied scientific investigations in fire-safety to support NASA s future space missions. A description of the electronics package and the results of functional testing are the subjects of this report. The report concludes that the use of innovative packaging methods combined with readily available COTS hardware can provide a modular electronics package which is easily modified for changing experiment requirements.

75 FR 17111 - Hazardous Materials Regulations: Combustible Liquids

Federal Register 2010, 2011, 2012, 2013, 2014

2010-04-05

... non-bulk packagings in a revised set of requirements for Class 3 materials, thereby eliminating the... material classed as a combustible liquid in a non-bulk packaging unless the combustible liquid is a... package for limited quantities for Class 7 (radioactive materials) could be transported as a combustible...

Effects of packaging materials on storage quality of peanut kernels

PubMed Central

Fu, Xiaoji; Xing, Shengping; Xiong, Huiwei; Min, Hua; Zhu, Xuejing; He, Jialin; Mu, Honglei

2018-01-01

In order to obtain optimum packaging materials for peanut kernels, the effects of four types of packaging materials on peanut storage quality (coat color, acid value, germination rate, relative damage, and prevention of aflatoxin contamination) were examined. The results showed that packaging materials had a major influence on peanut storage quality indexes. The color of the peanut seed coat packaged in the polyester/aluminum/polyamide/polyethylene (PET/AL/PA/PE) composite film bag did not change significantly during the storage period. Color deterioration was slower with polyamide/polyethylene (PA/PE) packaging materials than with polyethylene (PE) film bags and was slower in PE bags than in the woven bags. The use of PET/AL/PA/PE and PA/PE bags maintained peanut quality and freshness for more than one year and both package types resulted in better germination rates. There were significant differences between the four types of packaging materials in terms of controlling insect pests. The peanuts packaged in the highly permeable woven bags suffered serious invasion from insect pests, while both PET/AL/PA/PE and PA/PE bags effectively prevented insect infection. Peanuts stored in PET/AL/PA/PE and PA/PE bags were also better at preventing and controlling aflatoxin contamination. PMID:29518085

Multi-layered poly-dimethylsiloxane as a non-hermetic packaging material for medical MEMS.

PubMed

Lachhman, S; Zorman, C A; Ko, W H

2012-01-01

Poly-dimethylsiloxane (PDMS) is an attractive material for packaging implantable biomedical microdevices owing to its biocompatibility, ease in application, and bio-friendly mechanical properties. Unfortunately, devices encapsulated solely by PDMS lack the longevity for use in chronic implant applications due to defect-related moisture penetration through the packaging layer caused by conventional deposition processes such as spin coating. This paper describes an effort to improve the performance of PDMS as a packaging material by constructing the encapsulant from multiple, thin roller casted layers of PDMS as a part of a polymeric multi-material package.

Maldives. Package on population education for special interest groups developed.

PubMed

1995-01-01

The Population Education Program of the Non-Formal Education Center has developed a package of Population Education for Special Interest Groups comprising a learning package and fieldworker's guide. The learning package is especially developed for teaching population education for out-of-school populations. Special interest groups in Maldives include newly married couples, adolescents, and working youth. Produced under the guidance of UNESCO, Bangkok, the package contains 36 different materials such as posters, charts, leaflets, booklets, stories, and illustrated booklets which may be taught in 36 to 45 periods. The materials deal with eight themes, namely, family size and family welfare, population and resources, delayed marriage and parenthood, responsible parenthood, population-related values and beliefs, women in development, AIDS/STD, and respect for old people. Accompanying the learning package is the fieldworker's guide used to teach the package. It contains individual guides for each of the 36 learning materials. The guide gives the titles of the materials, format, objectives of the materials, messages, target groups, and an overview of the content of each learning materials. The methodologies used for teaching the learning materials include role playing, group discussion, questioning, brainstorming, survey, creative writing, problem-solving and evaluation. The package will be used by fieldworkers to conduct island-based population education courses. full text

Electronic Router

NASA Technical Reports Server (NTRS)

Crusan, Jason

2005-01-01

Electronic Router (E-Router) is an application program for routing documents among the cognizant individuals in a government agency or other organization. E-Router supplants a prior 14 NASA Tech Briefs, May 2005 system in which paper documents were routed physically in packages by use of paper slips, packages could be lost, routing times were unacceptably long, tracking of packages was difficult, and there was a need for much photocopying. E-Router enables a user to create a digital package to be routed. Input accepted by E-Router includes the title of the package, the person(s) to whom the package is to be routed, attached files, and comments to reviewers. Electronic mail is used to notify reviewers of needed actions. The creator of the package can, at any time, see the status of the package in the routing structure. At the end of the routing process, E-Router keeps a record of the package and of approvals and/or concurrences of the reviewers. There are commercial programs that perform the general functions of E-Router, but they are more complicated. E-Router is Web-based, easy to use, and does not require the installation or use of client software.

High thermal conductivity liquid metal pad for heat dissipation in electronic devices

NASA Astrophysics Data System (ADS)

Lin, Zuoye; Liu, Huiqiang; Li, Qiuguo; Liu, Han; Chu, Sheng; Yang, Yuhua; Chu, Guang

2018-05-01

Novel thermal interface materials using Ag-doped Ga-based liquid metal were proposed for heat dissipation of electronic packaging and precision equipment. On one hand, the viscosity and fluidity of liquid metal was controlled to prevent leakage; on the other hand, the thermal conductivity of the Ga-based liquid metal was increased up to 46 W/mK by incorporating Ag nanoparticles. A series of experiments were performed to evaluate the heat dissipation performance on a CPU of smart-phone. The results demonstrated that the Ag-doped Ga-based liquid metal pad can effectively decrease the CPU temperature and change the heat flow path inside the smart-phone. To understand the heat flow path from CPU to screen through the interface material, heat dissipation mechanism was simulated and discussed.

Environmental Assessment of Packaging: The Consumer Point of View

PubMed

Van Dam YK

1996-09-01

When marketing environmentally responsible packaged products, the producer is confronted with consumer beliefs concerning the environmental friendliness of packaging materials. When making environmentally conscious packaging decisions, these consumer beliefs should be taken into account alongside the technical guidelines. Dutch consumer perceptions of the environmental friendliness of packaged products are reported and compared with the results of a life-cycle analysis assessment. It is shown that consumers judge environmental friendliness mainly from material and returnability. Furthermore, the consumer perception of the environmental friendliness of packaging material is based on the postconsumption waste, whereas the environmental effects of production are ignored. From the consumer beliefs concerning environmental friendliness implications are deduced for packaging policy and for environmental policy.KEY WORDS: Consumer behavior; Environment; Food; Packaging; Perception; Waste

Natural biopolimers in organic food packaging

NASA Astrophysics Data System (ADS)

Wieczynska, Justyna; Cavoski, Ivana; Chami, Ziad Al; Mondelli, Donato; Di Donato, Paola; Di Terlizzi, Biagio

2014-05-01

Concerns on environmental and waste problems caused by use of non-biodegradable and non-renewable based plastic packaging have caused an increase interest in developing biodegradable packaging using renewable natural biopolymers. Recently, different types of biopolymers like starch, cellulose, chitosan, casein, whey protein, collagen, egg white, soybean protein, corn zein, gelatin and wheat gluten have attracted considerable attention as potential food packaging materials. Recyclable or biodegradable packaging material in organic processing standards is preferable where possible but specific principles of packaging are not precisely defined and standards have to be assessed. There is evidence that consumers of organic products have specific expectations not only with respect to quality characteristics of processed food but also in social and environmental aspects of food production. Growing consumer sophistication is leading to a proliferation in food eco-label like carbon footprint. Biopolymers based packaging for organic products can help to create a green industry. Moreover, biopolymers can be appropriate materials for the development of an active surfaces designed to deliver incorporated natural antimicrobials into environment surrounding packaged food. Active packaging is an innovative mode of packaging in which the product and the environment interact to prolong shelf life or enhance safety or sensory properties, while maintaining the quality of the product. The work will discuss the various techniques that have been used for development of an active antimicrobial biodegradable packaging materials focusing on a recent findings in research studies. With the current focus on exploring a new generation of biopolymer-based food packaging materials with possible applications in organic food packaging. Keywords: organic food, active packaging, biopolymers , green technology

Preparation and Effect of Gamma Radiation on The Properties and Biodegradability of Poly(Styrene/Starch) Blends

NASA Astrophysics Data System (ADS)

Ali, H. E.; Abdel Ghaffar, A. M.

2017-01-01

Biodegradable blends based on Poly(styrene/starch) Poly(Sty/Starch) were prepared by the casting method using different contents of starch in the range of 0-20 wt% aiming at preparing disposable packaging materials. The prepared bio-blends were Characterized by Fourier transform infrared (FTIR), swelling behavior, mechanical properties, thermogravimetric analysis (TGA), and scanning electron microscopy (SEM). It was found that the swelling behavior slightly increased with increasing starch content and not exceeding 7.5%. The results showed that by increasing irradiation dose up to 5 kGy, the mechanical properties of the prepared PSty/10 wt% Starch blend film modified than other blend films, and hence it is selected. Also the water resistant increased, by irradiation of the selected PSty/10 wt% Starch blend film. The intermolecular hydrogen bonding interaction between Starch and PSty of the PSty/10 wt% Starch blend film promote a more homogenous blend film as shown in scanning electron microscopy (SEM). The prepared Poly(Sty/Starch) blends with different compositions and the selected irradiated PSty/10 wt% Starch blend were subjected to biodegradation in soil burial tests for 6 months using two different types of soils; agricultural and desert soils, then analyzed gravimetrically and by scanning electron microscopy (SEM). The results suggested that there is a possibility of using irradiated PSty/10 wt% Starch at a dose of 5 kGy as a potential candidate for packaging material.

76 FR 5215 - Draft Regulatory Guide: Issuance, Availability

Federal Register 2010, 2011, 2012, 2013, 2014

2011-01-28

... Compliance with Packaging Requirements for Shipment and Receipt of Radioactive Material,'' is temporarily... Code of Federal Regulations, Part 71, ``Packaging and Transportation of Radioactive Material'' (10 CFR... Compliance with Packaging Requirements for Shipments of Radioactive Materials,'' as an acceptable process for...

Trends in Food Packaging.

ERIC Educational Resources Information Center

Ott, Dana B.

1988-01-01

This article discusses developments in food packaging, processing, and preservation techniques in terms of packaging materials, technologies, consumer benefits, and current and potential food product applications. Covers implications due to consumer life-style changes, cost-effectiveness of packaging materials, and the ecological impact of…

10 CFR 71.15 - Exemption from classification as fissile material.

Code of Federal Regulations, 2012 CFR

2012-01-01

... subject to all other requirements of this part, except as noted. (a) Individual package containing 2 grams or less fissile material. (b) Individual or bulk packaging containing 15 grams or less of fissile material provided the package has at least 200 grams of solid nonfissile material for every gram of fissile...

10 CFR 71.15 - Exemption from classification as fissile material.

Code of Federal Regulations, 2010 CFR

2010-01-01

... subject to all other requirements of this part, except as noted. (a) Individual package containing 2 grams or less fissile material. (b) Individual or bulk packaging containing 15 grams or less of fissile material provided the package has at least 200 grams of solid nonfissile material for every gram of fissile...

10 CFR 71.15 - Exemption from classification as fissile material.

Code of Federal Regulations, 2013 CFR

2013-01-01

... subject to all other requirements of this part, except as noted. (a) Individual package containing 2 grams or less fissile material. (b) Individual or bulk packaging containing 15 grams or less of fissile material provided the package has at least 200 grams of solid nonfissile material for every gram of fissile...

10 CFR 71.15 - Exemption from classification as fissile material.

Code of Federal Regulations, 2011 CFR

2011-01-01

... subject to all other requirements of this part, except as noted. (a) Individual package containing 2 grams or less fissile material. (b) Individual or bulk packaging containing 15 grams or less of fissile material provided the package has at least 200 grams of solid nonfissile material for every gram of fissile...

10 CFR 71.15 - Exemption from classification as fissile material.

Code of Federal Regulations, 2014 CFR

2014-01-01

... subject to all other requirements of this part, except as noted. (a) Individual package containing 2 grams or less fissile material. (b) Individual or bulk packaging containing 15 grams or less of fissile material provided the package has at least 200 grams of solid nonfissile material for every gram of fissile...

21 CFR 179.45 - Packaging materials for use during the irradiation of prepackaged foods.

Code of Federal Regulations, 2012 CFR

2012-04-01

... 21 Food and Drugs 3 2012-04-01 2012-04-01 false Packaging materials for use during the irradiation... OF HEALTH AND HUMAN SERVICES (CONTINUED) FOOD FOR HUMAN CONSUMPTION (CONTINUED) IRRADIATION IN THE... materials for use during the irradiation of prepackaged foods. The packaging materials identified in this...

21 CFR 179.45 - Packaging materials for use during the irradiation of prepackaged foods.

Code of Federal Regulations, 2010 CFR

2010-04-01

... 21 Food and Drugs 3 2010-04-01 2009-04-01 true Packaging materials for use during the irradiation... OF HEALTH AND HUMAN SERVICES (CONTINUED) FOOD FOR HUMAN CONSUMPTION (CONTINUED) IRRADIATION IN THE... materials for use during the irradiation of prepackaged foods. The packaging materials identified in this...

21 CFR 179.45 - Packaging materials for use during the irradiation of prepackaged foods.

Code of Federal Regulations, 2011 CFR

2011-04-01

... 21 Food and Drugs 3 2011-04-01 2011-04-01 false Packaging materials for use during the irradiation... OF HEALTH AND HUMAN SERVICES (CONTINUED) FOOD FOR HUMAN CONSUMPTION (CONTINUED) IRRADIATION IN THE... materials for use during the irradiation of prepackaged foods. The packaging materials identified in this...

21 CFR 179.45 - Packaging materials for use during the irradiation of prepackaged foods.

Code of Federal Regulations, 2013 CFR

2013-04-01

... 21 Food and Drugs 3 2013-04-01 2013-04-01 false Packaging materials for use during the irradiation... OF HEALTH AND HUMAN SERVICES (CONTINUED) FOOD FOR HUMAN CONSUMPTION (CONTINUED) IRRADIATION IN THE... materials for use during the irradiation of prepackaged foods. The packaging materials identified in this...

Comparing Safari Tech Books Online and Books24x7 E-Book Collections: A Case Study from the University of British Columbia Library

ERIC Educational Resources Information Center

Barsky, Eugene; Schattman, Lisa; Greenwood, Aleteia

2009-01-01

Most academic libraries are seeking to provide electronic access to the very dynamic and changing field of technology related material. "Safari Tech Books Online" and "Books24x7" are the major e-book collections in this area. We compared the "Safari Tech Books Online" and "Books24x7" e-book packages as to…

1st NASA Electronic Parts Packaging (NEPP) Program Electronic Technology Workshop (ETW)

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2010-01-01

NEPP supports all of NASA for >20 years - 7 NASA Centers and JPL actively participate The NEPP Program focuses on the reliability aspects of electronic devices - Three prime technical areas: Parts (die), Packaging, and Radiation Alternately, reliability may be viewed as: -

Influence of different materials on the thermal behavior of a CDIP-8 ceramic package

NASA Astrophysics Data System (ADS)

Weide, Kirsten; Keck, Christian

1999-08-01

The temperature distribution inside a package is determined by the heat transfer from the package to the ambient, depending on the heat conductivities of the different used materials. With the help of finite element simulations the thermal behavior of the package can be characterized. In precise simulations convection and radiation effects have to be taken into account. In this paper the influence of different materials like the ceramic, the pin and die attach material and adhesive material between the chip and the die attach on the thermal resistance of the ceramic package will be investigated. A finite element model of the ceramic package including a voltage regulator on the chip was created. The simulations were carried out with the finite element program ANSYS. An easy way to take the radiation effect into account, which normally is difficult to handle in the simulation, will be shown. The results of the simulations are verified by infrared measurements. A comparison of the thermal resistance between the best case and worst case for different package materials was done. The thermal conductivity of the ceramic material shows the strongest influence on the thermal resistance.

Electron beam accelerators—trends in radiation processing technology for industrial and environmental applications in Latin America and the Caribbean

NASA Astrophysics Data System (ADS)

Parejo Calvo, Wilson A.; Duarte, Celina L.; Machado, Luci Diva B.; Manzoli, Jose E.; Geraldo, Aurea Beatriz C.; Kodama, Yasko; Silva, Leonardo Gondim A.; Pino, Eddy S.; Somessari, Elizabeth S. R.; Silveira, Carlos G.; Rela, Paulo R.

2012-08-01

The radiation processing technology for industrial and environmental applications has been developed and used worldwide. In Latin America and the Caribbean and particularly in Brazil there are 24 and 16 industrial electron beam accelerators (EBA) respectively with energy from 200 keV to 10 MeV, operating in private companies and governmental institutions to enhance the physical and chemical properties of materials. However, there are more than 1500 high-current electron beam accelerators in commercial use throughout the world. The major needs and end-use markets for these electron beam (EB) units are R and D, wire and electric cables, heat shrinkable tubes and films, PE foams, tires, components, semiconductors and multilayer packaging films. Nowadays, the emerging opportunities in Latin America and the Caribbean are paints, adhesives and coatings cure in order to eliminate VOCs and for less energy use than thermal process; disinfestations of seeds; and films and multilayer packaging irradiation. For low-energy EBA (from 150 keV to 300 keV). For mid-energy EBA (from 300 keV to 5 MeV), they are flue gas treatment (SO2 and NOX removal); composite and nanocomposite materials; biodegradable composites based on biorenewable resources; human tissue sterilization; carbon and silicon carbide fibers irradiation; irradiated grafting ion-exchange membranes for fuel cells application; electrocatalysts nanoparticles production; and natural polymers irradiation and biodegradable blends production. For high-energy EBA (from 5 MeV to 10 MeV), they are sterilization of medical, pharmaceutical and biological products; gemstone enhancement; treatment of industrial and domestic effluents and sludge; preservation and disinfestations of foods and agricultural products; soil disinfestations; lignocellulosic material irradiation as a pretreatment to produce ethanol biofuel; decontamination of pesticide packing; solid residues remediation; organic compounds removal from wastewater; and treatment of effluent from petroleum production units and liquid irradiation process to treat vessel water ballast. On the other hand, there is a growing need of mobile EB facilities for different applications in South America.

Degradation Behavior and Accelerated Weathering of Composite Boards Produced from Waste Tetra Pak® Packaging Materials

Treesearch

Nural Yilgor; Coskun Kose; Evren Terzi; Aysel Kanturk Figen; Rebecca Ibach; S. Nami Kartal; Sabriye Piskin

2014-01-01

Manufacturing panels from Tetra Pak® (TP) packaging material might be an alternative to conventional wood-based panels. This study evaluated some chemical and physical properties as well as biological, weathering, and fire performance of panels with and without zinc borate (ZnB) by using shredded TP packaging cartons. Such packaging material, a worldwide well-known...

9 CFR 381.144 - Packaging materials.

Code of Federal Regulations, 2010 CFR

2010-01-01

..., from the packaging supplier under whose brand name and firm name the material is marketed to the... distinguishing brand name or code designation appearing on the packaging material shipping container; must....13) will be acceptable. The management of the establishment must maintain a file containing...

Teaching Old Packaging New Tricks - 12593

DOE Office of Scientific and Technical Information (OSTI.GOV)

England, Jeffery L.; Shuler, James M.

2012-07-01

Waste disposition campaigns have been an industry and government focus area since the mid- 1970's. With increased focus on this issue, and a lot of hard work, most waste packaging and transportation issues have been addressed. The material has been successfully shipped and dis-positioned. DOE has successfully de-inventoried materials from multiple sites to meet material consolidation, footprint reduction, nonproliferation, and regulatory obligations with cost savings from reduced maintenance and regulatory compliance. There has been a wide range of certified shipping packagings for the transportation of hazardous materials to meet most of the waste needs. The remaining materials are problematic, generallymore » low volume, and do not meet the certified content of the existing inventory of packaging. Designing, testing and certifying new packaging designs can be a long and expensive process and for small volumes of material it is cost prohibitive. One very cost effective option is to lease and use a certified packaging to overpack waste containers. There are many robust certified packagings available with the capability to envelope the waste content. The capability to use inner containers, inside the current fleet of certified casks or packaging, to address specific content problems of additional shielding (e.g., U-233) or containment (e.g., sodium bonded nuclear material) has successfully expanded the capability for timely cost effective shipment of unique contents. This option has been used successfully in the NAC-LWT, T-3 and other packagings. (authors)« less

Column Grid Array Rework for High Reliability

NASA Technical Reports Server (NTRS)

Mehta, Atul C.; Bodie, Charles C.

2008-01-01

Due to requirements for reduced size and weight, use of grid array packages in space applications has become common place. To meet the requirement of high reliability and high number of I/Os, ceramic column grid array packages (CCGA) were selected for major electronic components used in next MARS Rover mission (specifically high density Field Programmable Gate Arrays). ABSTRACT The probability of removal and replacement of these devices on the actual flight printed wiring board assemblies is deemed to be very high because of last minute discoveries in final test which will dictate changes in the firmware. The questions and challenges presented to the manufacturing organizations engaged in the production of high reliability electronic assemblies are, Is the reliability of the PWBA adversely affected by rework (removal and replacement) of the CGA package? and How many times can we rework the same board without destroying a pad or degrading the lifetime of the assembly? To answer these questions, the most complex printed wiring board assembly used by the project was chosen to be used as the test vehicle, the PWB was modified to provide a daisy chain pattern, and a number of bare PWB s were acquired to this modified design. Non-functional 624 pin CGA packages with internal daisy chained matching the pattern on the PWB were procured. The combination of the modified PWB and the daisy chained packages enables continuity measurements of every soldered contact during subsequent testing and thermal cycling. Several test vehicles boards were assembled, reworked and then thermal cycled to assess the reliability of the solder joints and board material including pads and traces near the CGA. The details of rework process and results of thermal cycling are presented in this paper.

Quality and safety aspects of meat products as affected by various physical manipulations of packaging materials.

PubMed

Lee, Keun Taik

2010-09-01

This article explores the effects of physically manipulated packaging materials on the quality and safety of meat products. Recently, innovative measures for improving quality and extending the shelf-life of packaged meat products have been developed, utilizing technologies including barrier film, active packaging, nanotechnology, microperforation, irradiation, plasma and far-infrared ray (FIR) treatments. Despite these developments, each technology has peculiar drawbacks which will need to be addressed by meat scientists in the future. To develop successful meat packaging systems, key product characteristics affecting stability, environmental conditions during storage until consumption, and consumers' packaging expectations must all be taken into consideration. Furthermore, the safety issues related to packaging materials must also be taken into account when processing, packaging and storing meat products.

Life and stability testing of packaged low-cost energy storage materials

NASA Astrophysics Data System (ADS)

Frysinger, G. R.

1980-07-01

A low-cost laminated plastic film which is used to contain a Glauber's salt-based phase change thermal energy storage material in sausage like containers called Chubs was developed. Results of tests performed on the Chub packages themselves and on the thermal energy storage capacity of the packaged phase change material are described. From the test results, a set of specifications was drawn up for a film material which will satisfactorily contain the phase change material under anticipated operating conditions. Calorimetric testing of the phase change material with thermal cycling indicates that a design capacity of 45 to 50 Btu/lb for a delta T of 30 F can be used for the packaged material.

Material flow analysis for an industry - A case study in packaging

USGS Publications Warehouse

Amey, E.B.; Sandgren, K.

1996-01-01

The basic materials used in packaging are glass, metals (primarily aluminum and steel), an ever-growing range of plastics, paper and paperboard, wood, textiles for bags, and miscellaneous other materials (such as glues, inks, and other supplies). They are fabricated into rigid, semi-rigid, or flexible containers. The most common forms of these containers include cans, drums, bottles, cartons, boxes, bags, pouches, and wraps. Packaging products are, for the most part, low cost, bulky products that are manufactured close to their customers. There is virtually no import or export of packaging products. A material flow analysis can be developed that looks at all inputs to an industrial sector, inventories the losses in processing, and tracks the fate of the material after its useful life. An example is presented that identifies the material inputs to the packaging industry, and addresses the ultimate fate of the materials used. ?? 1996 International Association for Mathematical Geology.

Packaging food for radiation processing

NASA Astrophysics Data System (ADS)

Komolprasert, Vanee

2016-12-01

Irradiation can play an important role in reducing pathogens that cause food borne illness. Food processors and food safety experts prefer that food be irradiated after packaging to prevent post-irradiation contamination. Food irradiation has been studied for the last century. However, the implementation of irradiation on prepackaged food still faces challenges on how to assess the suitability and safety of these packaging materials used during irradiation. Irradiation is known to induce chemical changes to the food packaging materials resulting in the formation of breakdown products, so called radiolysis products (RP), which may migrate into foods and affect the safety of the irradiated foods. Therefore, the safety of the food packaging material (both polymers and adjuvants) must be determined to ensure safety of irradiated packaged food. Evaluating the safety of food packaging materials presents technical challenges because of the range of possible chemicals generated by ionizing radiation. These challenges and the U.S. regulations on food irradiation are discussed in this article.

Fungal mycelium and cotton plant materials in the manufacture of biodegradable molded packaging material: Evaluation study of select blends of cotton byproducts

USDA-ARS?s Scientific Manuscript database

The primary material used by the packaging industry is extruded polystyrene foam, which is commonly marketed as Styrofoam™. In its original formulation, Styrofoam™ is resistant to photolysis and effectively does not decompose. The light weight of Styrofoam™ packaging materials reduces the likelihood...

19 CFR 10.878 - Packaging and packing materials and containers for retail sale and for shipment.

Code of Federal Regulations, 2014 CFR

2014-04-01

... retail sale and for shipment. 10.878 Section 10.878 Customs Duties U.S. CUSTOMS AND BORDER PROTECTION... materials and containers for retail sale and for shipment. Packaging materials and containers in which a good is packaged for retail sale and packing materials and containers for shipment are to be...

19 CFR 10.815 - Packaging and packing materials and containers for retail sale and for shipment.

Code of Federal Regulations, 2012 CFR

2012-04-01

... retail sale and for shipment. 10.815 Section 10.815 Customs Duties U.S. CUSTOMS AND BORDER PROTECTION... materials and containers for retail sale and for shipment. Packaging materials and containers in which a good is packaged for retail sale and packing materials and containers for shipment are to be...

19 CFR 10.815 - Packaging and packing materials and containers for retail sale and for shipment.

Code of Federal Regulations, 2010 CFR

2010-04-01

... retail sale and for shipment. 10.815 Section 10.815 Customs Duties U.S. CUSTOMS AND BORDER PROTECTION... materials and containers for retail sale and for shipment. Packaging materials and containers in which a good is packaged for retail sale and packing materials and containers for shipment are to be...

19 CFR 10.815 - Packaging and packing materials and containers for retail sale and for shipment.

Code of Federal Regulations, 2013 CFR

2013-04-01

... retail sale and for shipment. 10.815 Section 10.815 Customs Duties U.S. CUSTOMS AND BORDER PROTECTION... materials and containers for retail sale and for shipment. Packaging materials and containers in which a good is packaged for retail sale and packing materials and containers for shipment are to be...

19 CFR 10.878 - Packaging and packing materials and containers for retail sale and for shipment.

Code of Federal Regulations, 2013 CFR

2013-04-01

... retail sale and for shipment. 10.878 Section 10.878 Customs Duties U.S. CUSTOMS AND BORDER PROTECTION... materials and containers for retail sale and for shipment. Packaging materials and containers in which a good is packaged for retail sale and packing materials and containers for shipment are to be...

19 CFR 10.775 - Packaging and packing materials and containers for retail sale and for shipment.

Code of Federal Regulations, 2010 CFR

2010-04-01

... retail sale and for shipment. 10.775 Section 10.775 Customs Duties U.S. CUSTOMS AND BORDER PROTECTION... materials and containers for retail sale and for shipment. Packaging materials and containers in which a good is packaged for retail sale and packing materials and containers for shipment are to be...

19 CFR 10.815 - Packaging and packing materials and containers for retail sale and for shipment.

Code of Federal Regulations, 2014 CFR

2014-04-01

... retail sale and for shipment. 10.815 Section 10.815 Customs Duties U.S. CUSTOMS AND BORDER PROTECTION... materials and containers for retail sale and for shipment. Packaging materials and containers in which a good is packaged for retail sale and packing materials and containers for shipment are to be...

19 CFR 10.775 - Packaging and packing materials and containers for retail sale and for shipment.

Code of Federal Regulations, 2011 CFR

2011-04-01

... retail sale and for shipment. 10.775 Section 10.775 Customs Duties U.S. CUSTOMS AND BORDER PROTECTION... materials and containers for retail sale and for shipment. Packaging materials and containers in which a good is packaged for retail sale and packing materials and containers for shipment are to be...

19 CFR 10.775 - Packaging and packing materials and containers for retail sale and for shipment.

Code of Federal Regulations, 2013 CFR

2013-04-01

... retail sale and for shipment. 10.775 Section 10.775 Customs Duties U.S. CUSTOMS AND BORDER PROTECTION... materials and containers for retail sale and for shipment. Packaging materials and containers in which a good is packaged for retail sale and packing materials and containers for shipment are to be...

19 CFR 10.878 - Packaging and packing materials and containers for retail sale and for shipment.

Code of Federal Regulations, 2012 CFR

2012-04-01

... retail sale and for shipment. 10.878 Section 10.878 Customs Duties U.S. CUSTOMS AND BORDER PROTECTION... materials and containers for retail sale and for shipment. Packaging materials and containers in which a good is packaged for retail sale and packing materials and containers for shipment are to be...

19 CFR 10.815 - Packaging and packing materials and containers for retail sale and for shipment.

Code of Federal Regulations, 2011 CFR

2011-04-01

... retail sale and for shipment. 10.815 Section 10.815 Customs Duties U.S. CUSTOMS AND BORDER PROTECTION... materials and containers for retail sale and for shipment. Packaging materials and containers in which a good is packaged for retail sale and packing materials and containers for shipment are to be...

19 CFR 10.878 - Packaging and packing materials and containers for retail sale and for shipment.

Code of Federal Regulations, 2011 CFR

2011-04-01

... retail sale and for shipment. 10.878 Section 10.878 Customs Duties U.S. CUSTOMS AND BORDER PROTECTION... materials and containers for retail sale and for shipment. Packaging materials and containers in which a good is packaged for retail sale and packing materials and containers for shipment are to be...

19 CFR 10.775 - Packaging and packing materials and containers for retail sale and for shipment.

Code of Federal Regulations, 2014 CFR

2014-04-01

... retail sale and for shipment. 10.775 Section 10.775 Customs Duties U.S. CUSTOMS AND BORDER PROTECTION... materials and containers for retail sale and for shipment. Packaging materials and containers in which a good is packaged for retail sale and packing materials and containers for shipment are to be...

19 CFR 10.775 - Packaging and packing materials and containers for retail sale and for shipment.

Code of Federal Regulations, 2012 CFR

2012-04-01

... retail sale and for shipment. 10.775 Section 10.775 Customs Duties U.S. CUSTOMS AND BORDER PROTECTION... materials and containers for retail sale and for shipment. Packaging materials and containers in which a good is packaged for retail sale and packing materials and containers for shipment are to be...

The NASA Electronic Parts and Packaging (NEPP) Program: Insertion of New Electronics Technologies

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2007-01-01

This viewgraph presentation gives an overview of NASA Electronic Parts and Packaging (NEPP) Program's new electronics technology trends. The topics include: 1) The Changing World of Radiation Testing of Memories; 2) Even Application-Specific Tests are Costly!; 3) Hypothetical New Technology Part Qualification Cost; 4) Where we are; 5) Approaching FPGAs as a More Than a "Part" for Reliability; 6) FPGAs Beget Novel Radiation Test Setups; 7) Understanding the Complex Radiation Data; 8) Tracking Packaging Complexity and Reliability for FPGAs; 9) Devices Supporting the FPGA Need to be Considered; 10) Summary of the New Electronic Technologies and Insertion into Flight Programs Workshop; and 11) Highlights of Panel Notes and Comments

Packaging - Materials review

NASA Astrophysics Data System (ADS)

Herrmann, Matthias

2014-06-01

Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device, valve, etc.), chemical inertness, cost issues, and others. Finally, proper cell design has to be considered for effective thermal management (i.e. cooling and heating) of battery packs.

Application of Temperature-Controlled Thermal Atomization for Printing Electronics in Space

NASA Technical Reports Server (NTRS)

Wu, Chih-Hao; Thompson, Furman V.

2017-01-01

Additive Manufacturing (AM) is a technology that builds three dimensional objects by adding material layer-upon-layer throughout the fabrication process. The Electrical, Electronic and Electromechanical (EEE) parts packaging group at Marshall Space Flight Center (MSFC) is investigating how various AM and 3D printing processes can be adapted to the microgravity environment of space to enable on demand manufacturing of electronics. The current state-of-the art processes for accomplishing the task of printing electronics through non-contact, direct-write means rely heavily on the process of atomization of liquid inks into fine aerosols to be delivered ultimately to a machine's print head and through its nozzle. As a result of cumulative International Space Station (ISS) research into the behaviors of fluids in zero-gravity, our experience leads us to conclude that the direct adaptation of conventional atomization processes will likely fall short and alternative approaches will need to be explored. In this report, we investigate the development of an alternative approach to atomizing electronic materials by way of thermal atomization, to be used in place of conventional aerosol generation and delivery processes for printing electronics in space.

Development of expert system for biobased polymer material selection: food packaging application.

PubMed

Sanyang, M L; Sapuan, S M

2015-10-01

Biobased food packaging materials are gaining more attention owing to their intrinsic biodegradable nature and renewability. Selection of suitable biobased polymers for food packaging applications could be a tedious task with potential mistakes in choosing the best materials. In this paper, an expert system was developed using Exsys Corvid software to select suitable biobased polymer materials for packaging fruits, dry food and dairy products. If - Then rule based system was utilized to accomplish the material selection process whereas a score system was formulated to facilitate the ranking of selected materials. The expert system selected materials that satisfied all constraints and selection results were presented in suitability sequence depending on their scores. The expert system selected polylactic acid (PLA) as the most suitable material.

Development of active, nanoparticle, antimicrobial technologies for muscle-based packaging applications.

PubMed

Morris, Michael A; Padmanabhan, Sibu C; Cruz-Romero, Malco C; Cummins, Enda; Kerry, Joseph P

2017-10-01

Fresh and processed muscle-based foods are highly perishable food products and packaging plays a crucial role in providing containment so that the full effect of preservation can be achieved through the provision of shelf-life extension. Conventional packaging materials and systems have served the industry well, however, greater demands are being placed upon industrial packaging formats owing to the movement of muscle-based products to increasingly distant markets, as well as increased customer demands for longer product shelf-life and storage capability. Consequently, conventional packaging materials and systems will have to evolve to meet these challenges. This review presents some of the new strategies that have been developed by employing novel nanotechnological concepts which have demonstrated some promise in significantly extending the shelf-life of muscle-based foods by providing commercially-applicable, antimicrobially-active, smart packaging solutions. The primary focus of this paper is applied to subject aspects, such as; material chemistries employed, forming methods utilised, interactions of the packaging functionalities including nanomaterials employed with polymer substrates and how such materials ultimately affect microbes. In order that such materials become industrially feasible, it is important that safe, stable and commercially-viable packaging materials are shown to be producible and effective in order to gain public acceptance, legislative approval and industrial adoption. Copyright © 2017. Published by Elsevier Ltd.

Performance of High Temperature Operational Amplifier, Type LM2904WH, under Extreme Temperatures

NASA Technical Reports Server (NTRS)

Patterson, Richard; Hammoud, Ahmad; Elbuluk, Malik

2008-01-01

Operation of electronic parts and circuits under extreme temperatures is anticipated in NASA space exploration missions as well as terrestrial applications. Exposure of electronics to extreme temperatures and wide-range thermal swings greatly affects their performance via induced changes in the semiconductor material properties, packaging and interconnects, or due to incompatibility issues between interfaces that result from thermal expansion/contraction mismatch. Electronics that are designed to withstand operation and perform efficiently in extreme temperatures would mitigate risks for failure due to thermal stresses and, therefore, improve system reliability. In addition, they contribute to reducing system size and weight, simplifying its design, and reducing development cost through the elimination of otherwise required thermal control elements for proper ambient operation. A large DC voltage gain (100 dB) operational amplifier with a maximum junction temperature of 150 C was recently introduced by STMicroelectronics [1]. This LM2904WH chip comes in a plastic package and is designed specifically for automotive and industrial control systems. It operates from a single power supply over a wide range of voltages, and it consists of two independent, high gain, internally frequency compensated operational amplifiers. Table I shows some of the device manufacturer s specifications.

HALT to qualify electronic packages: a proof of concept

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2014-03-01

A proof of concept of the Highly Accelerated Life Testing (HALT) technique was explored to assess and optimize electronic packaging designs for long duration deep space missions in a wide temperature range (-150°C to +125°C). HALT is a custom hybrid package suite of testing techniques using environments such as extreme temperatures and dynamic shock step processing from 0g up to 50g of acceleration. HALT testing used in this study implemented repetitive shock on the test vehicle components at various temperatures to precipitate workmanship and/or manufacturing defects to show the weak links of the designs. The purpose is to reduce the product development cycle time for improvements to the packaging design qualification. A test article was built using advanced electronic package designs and surface mount technology processes, which are considered useful for a variety of JPL and NASA projects, i.e. (surface mount packages such as ball grid arrays (BGA), plastic ball grid arrays (PBGA), very thin chip array ball grid array (CVBGA), quad flat-pack (QFP), micro-lead-frame (MLF) packages, several passive components, etc.). These packages were daisy-chained and independently monitored during the HALT test. The HALT technique was then implemented to predict reliability and assess survivability of these advanced packaging techniques for long duration deep space missions in much shorter test durations. Test articles were built using advanced electronic package designs that are considered useful in various NASA projects. All the advanced electronic packages were daisychained independently to monitor the continuity of the individual electronic packages. Continuity of the daisy chain packages was monitored during the HALT testing using a data logging system. We were able to test the boards up to 40g to 50g shock levels at temperatures ranging from +125°C to -150°C. The HALT system can deliver 50g shock levels at room temperature. Several tests were performed by subjecting the test boards to various g levels ranging from 5g to 50g, test durations of 10 minutes to 60 minutes, hot temperatures of up to +125°C and cold temperatures down to -150°C. During the HALT test, electrical continuity measurements of the PBGA package showed an open-circuit, whereas the BGA, MLF, and QFPs showed signs of small variations of electrical continuity measurements. The electrical continuity anomaly of the PBGA occurred in the test board within 12 hours of commencing the accelerated test. Similar test boards were assembled, thermal cycled independently from -150°C to +125°C and monitored for electrical continuity through each package design. The PBGA package on the test board showed an anomalous electrical continuity behavior after 959 thermal cycles. Each thermal cycle took around 2.33 hours, so that a total test time to failure of the PBGA was 2,237 hours (or ~3.1 months) due to thermal cycling alone. The accelerated technique (thermal cycling + shock) required only 12 hours to cause a failure in the PBGA electronic package. Compared to the thermal cycle only test, this was an acceleration of ~186 times (more than 2 orders of magnitude). This acceleration process can save significant time and resources for predicting the life of a package component in a given environment, assuming the failure mechanisms are similar in both the tests. Further studies are in progress to make systematic evaluations of the HALT technique on various other advanced electronic packaging components on the test board. With this information one will be able to estimate the number of mission thermal cycles to failure with a much shorter test program. Further studies are in progress to make systematic study of various components, constant temperature range for both the tests. Therefore, one can estimate the number of hours to fail in a given thermal and shock levels for a given test board physical properties.

Ultrathin, transferred layers of thermally grown silicon dioxide as biofluid barriers for biointegrated flexible electronic systems.

PubMed

Fang, Hui; Zhao, Jianing; Yu, Ki Jun; Song, Enming; Farimani, Amir Barati; Chiang, Chia-Han; Jin, Xin; Xue, Yeguang; Xu, Dong; Du, Wenbo; Seo, Kyung Jin; Zhong, Yiding; Yang, Zijian; Won, Sang Min; Fang, Guanhua; Choi, Seo Woo; Chaudhuri, Santanu; Huang, Yonggang; Alam, Muhammad Ashraful; Viventi, Jonathan; Aluru, N R; Rogers, John A

2016-10-18

Materials that can serve as long-lived barriers to biofluids are essential to the development of any type of chronic electronic implant. Devices such as cardiac pacemakers and cochlear implants use bulk metal or ceramic packages as hermetic enclosures for the electronics. Emerging classes of flexible, biointegrated electronic systems demand similar levels of isolation from biofluids but with thin, compliant films that can simultaneously serve as biointerfaces for sensing and/or actuation while in contact with the soft, curved, and moving surfaces of target organs. This paper introduces a solution to this materials challenge that combines (i) ultrathin, pristine layers of silicon dioxide (SiO 2 ) thermally grown on device-grade silicon wafers, and (ii) processing schemes that allow integration of these materials onto flexible electronic platforms. Accelerated lifetime tests suggest robust barrier characteristics on timescales that approach 70 y, in layers that are sufficiently thin (less than 1 μm) to avoid significant compromises in mechanical flexibility or in electrical interface fidelity. Detailed studies of temperature- and thickness-dependent electrical and physical properties reveal the key characteristics. Molecular simulations highlight essential aspects of the chemistry that governs interactions between the SiO 2 and surrounding water. Examples of use with passive and active components in high-performance flexible electronic devices suggest broad utility in advanced chronic implants.

Ultrathin, transferred layers of thermally grown silicon dioxide as biofluid barriers for biointegrated flexible electronic systems

PubMed Central

Fang, Hui; Yu, Ki Jun; Song, Enming; Farimani, Amir Barati; Chiang, Chia-Han; Jin, Xin; Xu, Dong; Du, Wenbo; Seo, Kyung Jin; Zhong, Yiding; Yang, Zijian; Won, Sang Min; Fang, Guanhua; Choi, Seo Woo; Chaudhuri, Santanu; Huang, Yonggang; Alam, Muhammad Ashraful; Viventi, Jonathan; Aluru, N. R.; Rogers, John A.

2016-01-01

Materials that can serve as long-lived barriers to biofluids are essential to the development of any type of chronic electronic implant. Devices such as cardiac pacemakers and cochlear implants use bulk metal or ceramic packages as hermetic enclosures for the electronics. Emerging classes of flexible, biointegrated electronic systems demand similar levels of isolation from biofluids but with thin, compliant films that can simultaneously serve as biointerfaces for sensing and/or actuation while in contact with the soft, curved, and moving surfaces of target organs. This paper introduces a solution to this materials challenge that combines (i) ultrathin, pristine layers of silicon dioxide (SiO2) thermally grown on device-grade silicon wafers, and (ii) processing schemes that allow integration of these materials onto flexible electronic platforms. Accelerated lifetime tests suggest robust barrier characteristics on timescales that approach 70 y, in layers that are sufficiently thin (less than 1 μm) to avoid significant compromises in mechanical flexibility or in electrical interface fidelity. Detailed studies of temperature- and thickness-dependent electrical and physical properties reveal the key characteristics. Molecular simulations highlight essential aspects of the chemistry that governs interactions between the SiO2 and surrounding water. Examples of use with passive and active components in high-performance flexible electronic devices suggest broad utility in advanced chronic implants. PMID:27791052

Hermetic electronics package with dual-sided electrical feedthrough configuration

DOEpatents

Shah, Kedar G.; Pannu, Satinderpall S.

2016-11-22

A hermetic electronics package includes a metal case with opposing first and second open ends, with each end connected to a first feedthrough construction and a second feedthrough construction. Each feedthrough contruction has an electrically insulating substrate and an array of electrically conductive feedthroughs extending therethrough, with the electrically insulating substrates connected to the opposing first and second open ends, respectively, of the metal case so as to form a hermetically sealed enclosure. A set of electronic components are located within the hermetically sealed enclosure and are operably connected to the feedthroughs of the first and second feedthrough constructions so as to electrically communicate outside the package from opposite sides of the package.

49 CFR 172.312 - Liquid hazardous materials in non-bulk packagings.

Code of Federal Regulations, 2011 CFR

2011-10-01

... offered or intended for transportation by aircraft, packages containing flammable liquids in inner... offered or intended for transportation by aircraft, packages containing flammable liquids in inner... 49 Transportation 2 2011-10-01 2011-10-01 false Liquid hazardous materials in non-bulk packagings...

49 CFR 172.312 - Liquid hazardous materials in non-bulk packagings.

Code of Federal Regulations, 2012 CFR

2012-10-01

... offered or intended for transportation by aircraft, packages containing flammable liquids in inner... offered or intended for transportation by aircraft, packages containing flammable liquids in inner... 49 Transportation 2 2012-10-01 2012-10-01 false Liquid hazardous materials in non-bulk packagings...

49 CFR 172.312 - Liquid hazardous materials in non-bulk packagings.

Code of Federal Regulations, 2010 CFR

2010-10-01

... offered or intended for transportation by aircraft, packages containing flammable liquids in inner... offered or intended for transportation by aircraft, packages containing flammable liquids in inner... 49 Transportation 2 2010-10-01 2010-10-01 false Liquid hazardous materials in non-bulk packagings...

Information Business: Applying Infometry (Informational Geometry) in Cognitive Coordination and Genetic Programming for Electronic Information Packaging and Marketing.

ERIC Educational Resources Information Center

Tsai, Bor-sheng

1994-01-01

Describes the use of infometry, or informational geometry, to meet the challenges of information service businesses. Highlights include theoretical models for cognitive coordination and genetic programming; electronic information packaging; marketing electronic information products, including cost-benefit analyses; and recapitalization, including…

21 CFR 1305.21 - Requirements for electronic orders.

Code of Federal Regulations, 2013 CFR

2013-04-01

... 1311 of this chapter. (b) The following data fields must be included on an electronic order for... either the purchaser or the supplier). (8) The quantity in a single package or container. (9) The number of packages or containers of each item ordered. (c) An electronic order may include controlled...

21 CFR 1305.21 - Requirements for electronic orders.

Code of Federal Regulations, 2014 CFR

2014-04-01

... 1311 of this chapter. (b) The following data fields must be included on an electronic order for... either the purchaser or the supplier). (8) The quantity in a single package or container. (9) The number of packages or containers of each item ordered. (c) An electronic order may include controlled...

21 CFR 1305.21 - Requirements for electronic orders.

Code of Federal Regulations, 2012 CFR

2012-04-01

... 1311 of this chapter. (b) The following data fields must be included on an electronic order for... either the purchaser or the supplier). (8) The quantity in a single package or container. (9) The number of packages or containers of each item ordered. (c) An electronic order may include controlled...

Food Packaging Materials

NASA Technical Reports Server (NTRS)

1978-01-01

The photos show a few of the food products packaged in Alure, a metallized plastic material developed and manufactured by St. Regis Paper Company's Flexible Packaging Division, Dallas, Texas. The material incorporates a metallized film originally developed for space applications. Among the suppliers of the film to St. Regis is King-Seeley Thermos Company, Winchester, Ma'ssachusetts. Initially used by NASA as a signal-bouncing reflective coating for the Echo 1 communications satellite, the film was developed by a company later absorbed by King-Seeley. The metallized film was also used as insulating material for components of a number of other spacecraft. St. Regis developed Alure to meet a multiple packaging material need: good eye appeal, product protection for long periods and the ability to be used successfully on a wide variety of food packaging equipment. When the cost of aluminum foil skyrocketed, packagers sought substitute metallized materials but experiments with a number of them uncovered problems; some were too expensive, some did not adequately protect the product, some were difficult for the machinery to handle. Alure offers a solution. St. Regis created Alure by sandwiching the metallized film between layers of plastics. The resulting laminated metallized material has the superior eye appeal of foil but is less expensive and more easily machined. Alure effectively blocks out light, moisture and oxygen and therefore gives the packaged food long shelf life. A major packaging firm conducted its own tests of the material and confirmed the advantages of machinability and shelf life, adding that it runs faster on machines than materials used in the past and it decreases product waste; the net effect is increased productivity.

49 CFR 176.156 - Defective packages.

Code of Federal Regulations, 2010 CFR

2010-10-01

... packages. (a) No leaking, broken, or otherwise defective package containing Class 1 (explosive) materials.... (b) No Class 1 (explosive) material, which for any reason has deteriorated or undergone a change of...

Sustainable polymers from renewable resources

NASA Astrophysics Data System (ADS)

Zhu, Yunqing; Romain, Charles; Williams, Charlotte K.

2016-12-01

Renewable resources are used increasingly in the production of polymers. In particular, monomers such as carbon dioxide, terpenes, vegetable oils and carbohydrates can be used as feedstocks for the manufacture of a variety of sustainable materials and products, including elastomers, plastics, hydrogels, flexible electronics, resins, engineering polymers and composites. Efficient catalysis is required to produce monomers, to facilitate selective polymerizations and to enable recycling or upcycling of waste materials. There are opportunities to use such sustainable polymers in both high-value areas and in basic applications such as packaging. Life-cycle assessment can be used to quantify the environmental benefits of sustainable polymers.

Sustainable polymers from renewable resources.

PubMed

Zhu, Yunqing; Romain, Charles; Williams, Charlotte K

2016-12-14

Renewable resources are used increasingly in the production of polymers. In particular, monomers such as carbon dioxide, terpenes, vegetable oils and carbohydrates can be used as feedstocks for the manufacture of a variety of sustainable materials and products, including elastomers, plastics, hydrogels, flexible electronics, resins, engineering polymers and composites. Efficient catalysis is required to produce monomers, to facilitate selective polymerizations and to enable recycling or upcycling of waste materials. There are opportunities to use such sustainable polymers in both high-value areas and in basic applications such as packaging. Life-cycle assessment can be used to quantify the environmental benefits of sustainable polymers.

Visual and x-ray inspection characteristics of eutectic and lead free assemblies

NASA Technical Reports Server (NTRS)

Ghaffarian, R.

2003-01-01

For high reliability applications, visual inspection has been the key technique for most conventional electronic package assemblies. Now, the use of x-ray technique has become an additional inspection requirement for quality control and detection of unique defects due to manufacturing of advanced electronic array packages such as ball grid array (BGAs) and chip scale packages (CSPs).

Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices

NASA Astrophysics Data System (ADS)

Michaelides, Stylianos

Flip Chip on Board (FCOB) and Chip-Scale Packages (CSPs) are relatively new technologies that are being increasingly used in the electronic packaging industry. Compared to the more widely used face-up wirebonding and TAB technologies, flip-chips and most CSPs provide the shortest possible leads, lower inductance, higher frequency, better noise control, higher density, greater input/output (I/O), smaller device footprint and lower profile. However, due to the short history and due to the introduction of several new electronic materials, designs, and processing conditions, very limited work has been done to understand the role of material, geometry, and processing parameters on the reliability of flip-chip devices. Also, with the ever-increasing complexity of semiconductor packages and with the continued reduction in time to market, it is too costly to wait until the later stages of design and testing to discover that the reliability is not satisfactory. The objective of the research is to develop integrated process-reliability models that will take into consideration the mechanics of assembly processes to be able to determine the reliability of face-down devices under thermal cycling and long-term temperature dwelling. The models incorporate the time and temperature-dependent constitutive behavior of various materials in the assembly to be able to predict failure modes such as die cracking and solder cracking. In addition, the models account for process-induced defects and macro-micro features of the assembly. Creep-fatigue and continuum-damage mechanics models for the solder interconnects and fracture-mechanics models for the die have been used to determine the reliability of the devices. The results predicted by the models have been successfully validated against experimental data. The validated models have been used to develop qualification and test procedures for implantable medical devices. In addition, the research has helped develop innovative face-down devices without the underfill, based on the thorough understanding of the failure modes. Also, practical design guidelines for material, geometry and process parameters for reliable flip-chip devices have been developed.

49 CFR 173.212 - Non-bulk packagings for solid hazardous materials in Packing Group II.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 49 Transportation 2 2011-10-01 2011-10-01 false Non-bulk packagings for solid hazardous materials... Hazardous Materials Other Than Class 1 and Class 7 § 173.212 Non-bulk packagings for solid hazardous materials in Packing Group II. (a) When § 172.101 of this subchapter specifies that a solid hazardous...

49 CFR 173.212 - Non-bulk packagings for solid hazardous materials in Packing Group II.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false Non-bulk packagings for solid hazardous materials... Hazardous Materials Other Than Class 1 and Class 7 § 173.212 Non-bulk packagings for solid hazardous materials in Packing Group II. (a) When § 172.101 of this subchapter specifies that a solid hazardous...

49 CFR 173.213 - Non-bulk packagings for solid hazardous materials in Packing Group III.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false Non-bulk packagings for solid hazardous materials... Hazardous Materials Other Than Class 1 and Class 7 § 173.213 Non-bulk packagings for solid hazardous materials in Packing Group III. (a) When § 172.101 of this subchapter specifies that a solid hazardous...

49 CFR 173.211 - Non-bulk packagings for solid hazardous materials in Packing Group I.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 49 Transportation 2 2011-10-01 2011-10-01 false Non-bulk packagings for solid hazardous materials... Hazardous Materials Other Than Class 1 and Class 7 § 173.211 Non-bulk packagings for solid hazardous materials in Packing Group I. (a) When § 172.101 of this subchapter specifies that a solid hazardous...

49 CFR 173.213 - Non-bulk packagings for solid hazardous materials in Packing Group III.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 49 Transportation 2 2011-10-01 2011-10-01 false Non-bulk packagings for solid hazardous materials... Hazardous Materials Other Than Class 1 and Class 7 § 173.213 Non-bulk packagings for solid hazardous materials in Packing Group III. (a) When § 172.101 of this subchapter specifies that a solid hazardous...

49 CFR 173.211 - Non-bulk packagings for solid hazardous materials in Packing Group I.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false Non-bulk packagings for solid hazardous materials... Hazardous Materials Other Than Class 1 and Class 7 § 173.211 Non-bulk packagings for solid hazardous materials in Packing Group I. (a) When § 172.101 of this subchapter specifies that a solid hazardous...

49 CFR 173.4a - Excepted quantities.

Code of Federal Regulations, 2014 CFR

2014-10-01

... this section; and (3) For gases a water capacity of 30 mL (1.8 cubic inches) or less. (d) Outer... outer packaging must not exceed the limits provided in the following paragraphs. For outer packagings..., rigid outer packaging. (5) Placement of the material in the package or packing different materials in...

49 CFR 173.4a - Excepted quantities.

Code of Federal Regulations, 2013 CFR

2013-10-01

... this section; and (3) For gases a water capacity of 30 mL (1.8 cubic inches) or less. (d) Outer... outer packaging must not exceed the limits provided in the following paragraphs. For outer packagings..., rigid outer packaging. (5) Placement of the material in the package or packing different materials in...

19 CFR 10.539 - Retail packaging materials and containers.

Code of Federal Regulations, 2010 CFR

2010-04-01

...-Singapore Free Trade Agreement Rules of Origin § 10.539 Retail packaging materials and containers. Packaging... requirement. The United States importer of good C decides to use the build-down method, RVC=((AV−VNM)/AV... content requirement. In applying this method, the non-originating blister packages are taken into account...

49 CFR 173.6 - Materials of trade exceptions.

Code of Federal Regulations, 2011 CFR

2011-10-01

... SHIPMENTS AND PACKAGINGS General § 173.6 Materials of trade exceptions. When transported by motor vehicle in... solids, liquids, and sharps, the outer packaging must be a strong, tight packaging securely closed and...) Packagings must be leak tight for liquids and gases, sift proof for solids, and be securely closed, secured...

49 CFR 173.6 - Materials of trade exceptions.

Code of Federal Regulations, 2010 CFR

2010-10-01

... SHIPMENTS AND PACKAGINGS General § 173.6 Materials of trade exceptions. When transported by motor vehicle in... solids, liquids, and sharps, the outer packaging must be a strong, tight packaging securely closed and...) Packagings must be leak tight for liquids and gases, sift proof for solids, and be securely closed, secured...

49 CFR 173.6 - Materials of trade exceptions.

Code of Federal Regulations, 2013 CFR

2013-10-01

... SHIPMENTS AND PACKAGINGS General § 173.6 Materials of trade exceptions. When transported by motor vehicle in... outer packaging must be securely closed to prevent leaks or punctures. For solids, liquids, and sharps...) Packaging. (1) Packagings must be leak tight for liquids and gases, sift proof for solids, and be securely...

49 CFR 173.6 - Materials of trade exceptions.

Code of Federal Regulations, 2012 CFR

2012-10-01

... SHIPMENTS AND PACKAGINGS General § 173.6 Materials of trade exceptions. When transported by motor vehicle in... solids, liquids, and sharps, the outer packaging must be a strong, tight packaging securely closed and...) Packagings must be leak tight for liquids and gases, sift proof for solids, and be securely closed, secured...

A Thermodynamics Course Package in Onenote

ERIC Educational Resources Information Center

Falconer, John L.; Nicodemus, Garret D.; Medlin, J. Will; deGrazia, Janet; McDanel, Katherine P.

2014-01-01

A ready-to-use package of active-learning materials for a semester-long chemical engineering thermodynamics course was prepared for instructors, and similar materials are being prepared for a material and energy balance course. The course package includes ConcepTests, explanations of the ConcepTests for instructors, links to screencasts, chapter…

21 CFR 109.15 - Use of polychlorinated biphenyls (PCB's) in establishments manufacturing food-packaging materials.

Code of Federal Regulations, 2010 CFR

2010-04-01

... establishments manufacturing food-packaging materials. 109.15 Section 109.15 Food and Drugs FOOD AND DRUG... polychlorinated biphenyls (PCB's) in establishments manufacturing food-packaging materials. (a) Polychlorinated...). These accidents in turn caused the contamination of food products intended for human consumption (meat...

21 CFR 509.15 - Use of polychlorinated biphenyls (PCB's) in establishments manufacturing food-packaging materials.

Code of Federal Regulations, 2010 CFR

2010-04-01

... establishments manufacturing food-packaging materials. 509.15 Section 509.15 Food and Drugs FOOD AND DRUG... polychlorinated biphenyls (PCB's) in establishments manufacturing food-packaging materials. (a) Polychlorinated...). These accidents in turn caused the contamination of food products intended for human consumption (meat...

14 CFR 135.23 - Manual contents.

Code of Federal Regulations, 2011 CFR

2011-01-01

... packages that are marked or labeled as containing hazardous materials or that show signs of containing... packages that do not conform to the Hazardous Materials Regulations in 49 CFR parts 171 through 180 or that... information to ensure the following: (A) That packages containing hazardous materials are properly offered and...

Green and biodegradable composite films with novel antimicrobial performance based on cellulose.

PubMed

Wu, Yuehan; Luo, Xiaogang; Li, Wei; Song, Rong; Li, Jing; Li, Yan; Li, Bin; Liu, Shilin

2016-04-15

In order to obtain a safe and biodegradable material with antimicrobial properties from cellulose for food packaging, we presented a facile way to graft chitosan onto the oxidized cellulose films. The obtained films had a high transparent property of above 80% transmittance, excellent barrier properties against oxygen and antimicrobial properties against Escherichia coli and Staphylococcus aureus. The antimicrobial properties, mechanical properties, and water vapor permeability of composites are essential characteristics in determining their applicability as food-packaging materials. Moreover, using a sausage model, it was shown that the composites exhibited better performance than traditional polyethylene packaging material and demonstrated good potential as food packaging materials. The results presented a new insight into the development of green materials for food packaging. Copyright © 2015 Elsevier Ltd. All rights reserved.

Profiling of metal ions leached from pharmaceutical packaging materials.

PubMed

Fliszar, Kyle A; Walker, David; Allain, Leonardo

2006-01-01

Metal leachables from packaging components can affect the safety and efficacy of a pharmaceutical formulation. As liquid formulations continue to contain surfactants, salts, and chelating agents coupled with lower drug levels, the interaction between the formulation and the packaging material becomes more important. This study examines the interaction of commonly used packaging materials with extraction solvents representative of liquid formulations found in the pharmaceutical industry stressed under conditions encountered during accelerated stability studies.

Influence of factors on release of antimicrobials from antimicrobial packaging materials.

PubMed

Wu, Yu-Mei; Wang, Zhi-Wei; Hu, Chang-Ying; Nerín, Cristina

2018-05-03

Antimicrobial packaging materials (films or coatings) (APMs) have aroused great interest among the scientists or the experts specialized in material science, food science, packaging engineering, biology and chemistry. APMs have been used to package the food, such as dairy products, poultry, meat (e.g., beef), salmon muscle, pastry dough, fresh pasta, bakery products, fruits, vegetables and beverages. Some materials have been already commercialized. The ability of APMs to extend the shelf-life of the food depends on the release rate of the antimicrobials (AMs) from the materials to the food. The optimum rate is defined as target release rate (TRR). To achieve TRR, the influencing factors of the release rate should be considered. Herein we reviewed for the first time these factors and their influence on the release. These factors mainly include the AMs, food (or food simulant), packaging materials, the interactions among them, the temperature and environmental relative humidity (RH).

Antimicrobial agent-free hybrid cationic starch/sodium alginate polyelectrolyte films for food packaging materials.

PubMed

Şen, Ferhat; Uzunsoy, İrem; Baştürk, Emre; Kahraman, Memet Vezir

2017-08-15

This study aimed to develop polyelectrolyte structured antimicrobial food packaging materials that do not contain any antimicrobial agents. Cationic starch was synthesized and characterized by FT-IR spectroscopy and 1 H NMR spectroscopy. Its nitrogen content was determined by Kjeldahl method. Polyelectrolyte structured antimicrobial food packaging materials were prepared using starch, cationic starch and sodium alginate. Antimicrobial activity of materials was defined by inhibition zone method (disc diffusion method). Thermal stability of samples was evaluated by TGA and DSC. Hydrophobicity of samples was determined by contact angle measurements. Surface morphology of samples was investigated by SEM. Moreover, gel contents of samples were determined. The obtained results prove that produced food packaging materials have good thermal, antimicrobial and surface properties, and they can be used as food packaging material in many industries. Copyright © 2017 Elsevier Ltd. All rights reserved.

The Conference on High Temperature Electronics

NASA Technical Reports Server (NTRS)

Hamilton, D. J.; Mccormick, J. B.; Kerwin, W. J.; Narud, J. A.

1981-01-01

The status of and directions for high temperature electronics research and development were evaluated. Major objectives were to (1) identify common user needs; (2) put into perspective the directions for future work; and (3) address the problem of bringing to practical fruition the results of these efforts. More than half of the presentations dealt with materials and devices, rather than circuits and systems. Conference session titles and an example of a paper presented in each session are (1) User requirements: High temperature electronics applications in space explorations; (2) Devices: Passive components for high temperature operation; (3) Circuits and systems: Process characteristics and design methods for a 300 degree QUAD or AMP; and (4) Packaging: Presently available energy supply for high temperature environment.

The Conference on High Temperature Electronics

NASA Astrophysics Data System (ADS)

Hamilton, D. J.; McCormick, J. B.; Kerwin, W. J.; Narud, J. A.

The status of and directions for high temperature electronics research and development were evaluated. Major objectives were to (1) identify common user needs; (2) put into perspective the directions for future work; and (3) address the problem of bringing to practical fruition the results of these efforts. More than half of the presentations dealt with materials and devices, rather than circuits and systems. Conference session titles and an example of a paper presented in each session are (1) User requirements: High temperature electronics applications in space explorations; (2) Devices: Passive components for high temperature operation; (3) Circuits and systems: Process characteristics and design methods for a 300 degree QUAD or AMP; and (4) Packaging: Presently available energy supply for high temperature environment.

Electronic structure, chemical bonding, and geometry of pure and Sr-doped CaCO3.

PubMed

Stashans, Arvids; Chamba, Gaston; Pinto, Henry

2008-02-01

The electronic structure, chemical bonding, geometry, and effects produced by Sr-doping in CaCO(3) have been studied on the basis of density-functional theory using the VASP simulation package and molecular-orbital theory utilizing the CLUSTERD computer code. Two calcium carbonate structures which occur naturally in anhydrous crystalline forms, calcite and aragonite, were considered in the present investigation. The obtained diagrams of density of states show similar patterns for both materials. The spatial structures are computed and analyzed in comparison to the available experimental data. The electronic properties and atomic displacements because of the trace element Sr-incorporation are discussed in a comparative manner for the two crystalline structures. (c) 2007 Wiley Periodicals, Inc.

The Demonstration and Science Experiments (DSX) Mission

NASA Astrophysics Data System (ADS)

McCollough, J. P., II; Johnston, W. R.; Starks, M. J.; Albert, J.

2015-12-01

In 2016, the Air Force Research Laboratory will launch its Demonstration and Science Experiments mission to investigate wave-particle interactions and the particle and space environment in medium Earth orbit (MEO). The DSX spacecraft includes three experiment packages. The Wave Particle Interaction Experiment (WPIx) will perform active and passive investigations involving VLF waves and their interaction with plasma and energetic electrons in MEO. The Space Weather Experiment (SWx) includes five particle instruments to survey the MEO electron and proton environment. The Space Environmental Effects Experiment (SFx) will investigate effects of the MEO environment on electronics and materials. We will describe the capabilities of the DSX science payloads, science plans, and opportunities for collaborative studies such as conjunction observations and far-field measurements.

MORPH-I (Ver 1.0) a software package for the analysis of scanning electron micrograph (binary formatted) images for the assessment of the fractal dimension of enclosed pore surfaces

USGS Publications Warehouse

Mossotti, Victor G.; Eldeeb, A. Raouf; Oscarson, Robert

1998-01-01

MORPH-I is a set of C-language computer programs for the IBM PC and compatible minicomputers. The programs in MORPH-I are used for the fractal analysis of scanning electron microscope and electron microprobe images of pore profiles exposed in cross-section. The program isolates and traces the cross-sectional profiles of exposed pores and computes the Richardson fractal dimension for each pore. Other programs in the set provide for image calibration, display, and statistical analysis of the computed dimensions for highly complex porous materials. Requirements: IBM PC or compatible; minimum 640 K RAM; mathcoprocessor; SVGA graphics board providing mode 103 display.

Examination of SR101 shipping packages

DOE Office of Scientific and Technical Information (OSTI.GOV)

Daugherty, W. L.

Four SR101 shipping packages were removed from service and provided for disassembly and examination of the internal fiberboard assemblies. These packages were 20 years old, and had experienced varying levels of degradation. Two of the packages were successfully disassembled and fiberboard samples were removed from these packages and tested. Mechanical and thermal property values are generally comparable to or higher than baseline values measured on fiberboard from 9975 packages, which differs primarily in the specified density range. While baseline data for the SR101 material is not available, this comparison with 9975 material suggests that the material properties of the SR101more » fiberboard have not significantly degraded.« less

The NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond and Recent Radiation Highlights

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2015-01-01

This presentation is a NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond. This roadmap provides a snapshot for current plans and collaborations on testing and evaluation of electronics as well as a discussion of the technology selection approach.

76 FR 52862 - Time for Payment of Certain Excise Taxes, and Quarterly Excise Tax Payments for Small Alcohol...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-08-24

... 40 Cigars and cigarettes, Claims, Electronic fund transfers, Excise taxes, Labeling, Packaging and... that are not required to pay taxes through electronic funds transfer (EFT), this first payment period..., Electronic funds transfers, Excise taxes, Exports, Food additives, Fruit juices, Labeling, Liquors, Packaging...

Thermoelectric Outer Planets Spacecraft (TOPS) electronic packaging and cabling development summary report

NASA Technical Reports Server (NTRS)

Dawe, R. H.; Arnett, J. C.

1974-01-01

Electronic packaging and cabling activities performed in support of the Thermoelectric Outer Planets Spacecraft (TOPS) Advanced Systems Technology (AST) project are detailed. It describes new electronic compartment, electronic assembly, and module concepts, and a new high-density, planar interconnection technique called discrete multilayer (DML). Development and qualification of high density cabling techniques, using small gage wire and microminiature connectors, are also reported.

77 FR 40385 - Withdrawal of Regulatory Guide 7.3; Procedures for Picking Up and Receiving Packages of...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-07-09

... Picking Up and Receiving Packages of Radioactive Material AGENCY: Nuclear Regulatory Commission. ACTION... Receiving Packages of Radioactive Material.'' The RG is being withdrawn because it is outdated and the..., ``Administrative Guide for Verifying Compliance with Packaging Requirements for Shipment and Receipt of Radioactive...

49 CFR 171.1 - Applicability of Hazardous Materials Regulations (HMR) to persons and functions.

Code of Federal Regulations, 2014 CFR

2014-10-01

... transportation of hazardous materials in commerce and to pre-transportation and transportation functions. (a..., reconditions, repairs, or tests a packaging or a component of a packaging that is represented, marked..., reconditions, repairs, or tests a packaging or a component of a packaging that is represented, marked...

48 CFR 552.211-89 - Non-manufactured wood packaging material for export.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 48 Federal Acquisition Regulations System 4 2012-10-01 2012-10-01 false Non-manufactured wood... and Clauses 552.211-89 Non-manufactured wood packaging material for export. As prescribed in 511.204(b)(4), insert the following clause: Non-Manufactured Wood Packaging Material for Export (JAN 2010) (a...

48 CFR 552.211-89 - Non-manufactured wood packaging material for export.

Code of Federal Regulations, 2014 CFR

2014-10-01

... 48 Federal Acquisition Regulations System 4 2014-10-01 2014-10-01 false Non-manufactured wood... and Clauses 552.211-89 Non-manufactured wood packaging material for export. As prescribed in 511.204(b)(4), insert the following clause: Non-Manufactured Wood Packaging Material for Export (JAN 2010) (a...

48 CFR 552.211-89 - Non-manufactured wood packaging material for export.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 48 Federal Acquisition Regulations System 4 2013-10-01 2013-10-01 false Non-manufactured wood... and Clauses 552.211-89 Non-manufactured wood packaging material for export. As prescribed in 511.204(b)(4), insert the following clause: Non-Manufactured Wood Packaging Material for Export (JAN 2010) (a...

19 CFR 10.601 - Retail packaging materials and containers.

Code of Federal Regulations, 2012 CFR

2012-04-01

... 19 Customs Duties 1 2012-04-01 2012-04-01 false Retail packaging materials and containers. 10.601...-Central America-United States Free Trade Agreement Rules of Origin § 10.601 Retail packaging materials and... for retail sale, if classified with the good for which preferential tariff treatment under the CAFTA...

19 CFR 10.601 - Retail packaging materials and containers.

Code of Federal Regulations, 2014 CFR

2014-04-01

... 19 Customs Duties 1 2014-04-01 2014-04-01 false Retail packaging materials and containers. 10.601...-Central America-United States Free Trade Agreement Rules of Origin § 10.601 Retail packaging materials and... for retail sale, if classified with the good for which preferential tariff treatment under the CAFTA...

19 CFR 10.601 - Retail packaging materials and containers.

Code of Federal Regulations, 2011 CFR

2011-04-01

... 19 Customs Duties 1 2011-04-01 2011-04-01 false Retail packaging materials and containers. 10.601...-Central America-United States Free Trade Agreement Rules of Origin § 10.601 Retail packaging materials and... for retail sale, if classified with the good for which preferential tariff treatment under the CAFTA...

19 CFR 10.601 - Retail packaging materials and containers.

Code of Federal Regulations, 2013 CFR

2013-04-01

... 19 Customs Duties 1 2013-04-01 2013-04-01 false Retail packaging materials and containers. 10.601...-Central America-United States Free Trade Agreement Rules of Origin § 10.601 Retail packaging materials and... for retail sale, if classified with the good for which preferential tariff treatment under the CAFTA...

48 CFR 552.211-89 - Non-manufactured wood packaging material for export.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 48 Federal Acquisition Regulations System 4 2011-10-01 2011-10-01 false Non-manufactured wood... and Clauses 552.211-89 Non-manufactured wood packaging material for export. As prescribed in 511.204(b)(4), insert the following clause: Non-Manufactured Wood Packaging Material for Export (JAN 2010) (a...

48 CFR 552.211-89 - Non-manufactured wood packaging material for export.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 48 Federal Acquisition Regulations System 4 2010-10-01 2010-10-01 false Non-manufactured wood... and Clauses 552.211-89 Non-manufactured wood packaging material for export. As prescribed in 511.204(b)(4), insert the following clause: Non-Manufactured Wood Packaging Material for Export (JAN 2010) (a...

21 CFR 179.45 - Packaging materials for use during the irradiation of prepackaged foods.

Code of Federal Regulations, 2014 CFR

2014-04-01

... 21 Food and Drugs 3 2014-04-01 2014-04-01 false Packaging materials for use during the irradiation... OF HEALTH AND HUMAN SERVICES (CONTINUED) IRRADIATION IN THE PRODUCTION, PROCESSING AND HANDLING OF... irradiation of prepackaged foods. The packaging materials identified in this section may be safely subjected...

49 CFR 173.224 - Packaging and control and emergency temperatures for self-reactive materials.

Code of Federal Regulations, 2014 CFR

2014-10-01

... 49 Transportation 2 2014-10-01 2014-10-01 false Packaging and control and emergency temperatures... temperatures for self-reactive materials. (a) General. When the § 172.101 table of this subchapter specifies... packagings meeting Packing Group I are not authorized. Self-reactive materials which require temperature...

49 CFR 173.224 - Packaging and control and emergency temperatures for self-reactive materials.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false Packaging and control and emergency temperatures... temperatures for self-reactive materials. (a) General. When the § 172.101 table of this subchapter specifies... packagings meeting Packing Group I are not authorized. Self-reactive materials which require temperature...

49 CFR 173.224 - Packaging and control and emergency temperatures for self-reactive materials.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 49 Transportation 2 2011-10-01 2011-10-01 false Packaging and control and emergency temperatures... temperatures for self-reactive materials. (a) General. When the § 172.101 table of this subchapter specifies... packagings meeting Packing Group I are not authorized. Self-reactive materials which require temperature...

49 CFR 173.224 - Packaging and control and emergency temperatures for self-reactive materials.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 49 Transportation 2 2012-10-01 2012-10-01 false Packaging and control and emergency temperatures... temperatures for self-reactive materials. (a) General. When the § 172.101 table of this subchapter specifies... packagings meeting Packing Group I are not authorized. Self-reactive materials which require temperature...

49 CFR 173.224 - Packaging and control and emergency temperatures for self-reactive materials.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 49 Transportation 2 2013-10-01 2013-10-01 false Packaging and control and emergency temperatures... temperatures for self-reactive materials. (a) General. When the § 172.101 table of this subchapter specifies... packagings meeting Packing Group I are not authorized. Self-reactive materials which require temperature...

Stability of flavoured phytosterol-enriched drinking yogurts during storage as affected by different packaging materials.

PubMed

Semeniuc, Cristina Anamaria; Cardenia, Vladimiro; Mandrioli, Mara; Muste, Sevastiţa; Borsari, Andrea; Rodriguez-Estrada, Maria Teresa

2016-06-01

The aim of this study was to investigate the influence of different packaging materials on storage stability of flavoured phytosterol-enriched drinking yogurts. White vanilla (WV) and blood orange (BO) phytosterol-enriched drinking yogurts conditioned in mono-layer and triple-layer co-extruded plastic bottles were stored at +6 ± 1 °C for 35 days (under alternating 12 h light and 12 h darkness) to simulate shelf-life conditions. Samples were collected at three different storage times and subjected to determination of total sterol content (TSC), peroxide value (PV) and thiobarbituric acid reactive substances (TBARs). TSC was not significantly affected by packaging material or storage time and met the quantity declared on the label. PV was significantly influenced by yogurt type × packaging material × storage time interaction and TBARs by packaging material × storage time interaction. Between the two packaging materials, the triple-layer plastic mini bottle with black coloured and completely opaque intermediate layer offered the best protection against lipid oxidation. © 2015 Society of Chemical Industry. © 2015 Society of Chemical Industry.

Packaging and Transportation Safety

DOT National Transportation Integrated Search

1997-01-31

This Guide supplements the Department of Energy (DOE) Order, DOE O 460.1A, PACKAGING AND TRANSPORTATION SAFETY, 10-2-96, by providing clarifying material for the implementation of packaging and transportation safety of hazardous materials. DOE O 460....

Advanced Materials for High Temperature, High Performance, Wide Bandgap Power Modules

NASA Astrophysics Data System (ADS)

O'Neal, Chad B.; McGee, Brad; McPherson, Brice; Stabach, Jennifer; Lollar, Richard; Liederbach, Ross; Passmore, Brandon

2016-01-01

Advanced packaging materials must be utilized to take full advantage of the benefits of the superior electrical and thermal properties of wide bandgap power devices in the development of next generation power electronics systems. In this manuscript, the use of advanced materials for key packaging processes and components in multi-chip power modules will be discussed. For example, to date, there has been significant development in silver sintering paste as a high temperature die attach material replacement for conventional solder-based attach due to the improved thermal and mechanical characteristics as well as lower processing temperatures. In order to evaluate the bond quality and performance of this material, shear strength, thermal characteristics, and void quality for a number of silver sintering paste materials were analyzed as a die attach alternative to solder. In addition, as high voltage wide bandgap devices shift from engineering samples to commercial components, passivation materials become key in preventing premature breakdown in power modules. High temperature, high dielectric strength potting materials were investigated to be used to encapsulate and passivate components internal to a power module. The breakdown voltage up to 30 kV and corresponding leakage current for these materials as a function of temperature is also presented. Lastly, high temperature plastic housing materials are important for not only discrete devices but also for power modules. As the operational temperature of the device and/or ambient temperature increases, the mechanical strength and dielectric properties are dramatically reduced. Therefore, the electrical characteristics such as breakdown voltage and leakage current as a function of temperature for housing materials are presented.

High Frequency Electronic Packaging Technology

NASA Technical Reports Server (NTRS)

Herman, M.; Lowry, L.; Lee, K.; Kolawa, E.; Tulintseff, A.; Shalkhauser, K.; Whitaker, J.; Piket-May, M.

1994-01-01

Commercial and government communication, radar, and information systems face the challenge of cost and mass reduction via the application of advanced packaging technology. A majority of both government and industry support has been focused on low frequency digital electronics.

Recent advances in biopolymers and biopolymer-based nanocomposites for food packaging materials.

PubMed

Tang, X Z; Kumar, P; Alavi, S; Sandeep, K P

2012-01-01

Plastic packaging for food and non-food applications is non-biodegradable, and also uses up valuable and scarce non-renewable resources like petroleum. With the current focus on exploring alternatives to petroleum and emphasis on reduced environmental impact, research is increasingly being directed at development of biodegradable food packaging from biopolymer-based materials. The proposed paper will present a review of recent developments in biopolymer-based food packaging materials including natural biopolymers (such as starches and proteins), synthetic biopolymers (such as poly lactic acid), biopolymer blends, and nanocomposites based on natural and synthetic biopolymers. The paper will discuss the various techniques that have been used for developing cost-effective biodegradable packaging materials with optimum mechanical strength and oxygen and moisture barrier properties. This is a timely review as there has been a recent renewed interest in research studies, both in the industry and academia, towards development of a new generation of biopolymer-based food packaging materials with possible applications in other areas.

Polyethylene glycol grafted polyethylene: a versatile platform for nonmigratory active packaging applications.

PubMed

Barish, Jeffrey A; Goddard, Julie M

2011-01-01

Nonmigratory active packaging, in which bioactive components are tethered to the package, offers the potential to reduce the need for additives in food products while maintaining safety and quality. A challenge in developing nonmigratory active packaging materials is the loss of biomolecular activity that can occur when biomolecules are immobilized. In this work, we describe a method in which a biocompatible polymer (polyethylene glycol, PEG) is grafted from the surface of ozone-treated low-density polyethylene (LDPE) resulting in a surface functionalized polyethylene to which a range of amine-terminated bioactive molecules can be immobilized. Free radical graft polymerization is used to graft PEG onto the LDPE surface, followed by immobilization of ethylenediamine onto the PEG tether. Ethylenediamine was used to demonstrate that amine-terminated molecules could be covalently attached to the PEG-grafted film. Changes in surface chemistry and topography were measured by attenuated total reflectance Fourier transform infrared spectroscopy, contact angle, atomic force microscopy, scanning electron microscopy, and X-ray photoelectron spectroscopy. We demonstrate the ability to graft PEG onto the surface of polymer packaging films by free radical graft polymerization, and to covalently link an amine-terminated molecule to the PEG tether, demonstrating that amine-terminated bioactive compounds (such as peptides, enzymes, and some antimicrobials) can be immobilized onto PEG-grafted LDPE in the development of nonmigratory active packaging.   Nonmigratory active packaging offers the potential for improving food safety and quality while minimizing the migration of the active agent into food. In this paper, we describe a technique to modify polyethylene packaging films such that active agents can be covalently immobilized by a biocompatible tether. Such a technique can be adapted to a number of applications such as antimicrobial, antioxidant, or immobilized enzyme active packaging. © 2011 Institute of Food Technologists®

Safety analysis report for packaging (onsite) steel drum

DOE Office of Scientific and Technical Information (OSTI.GOV)

McCormick, W.A.

This Safety Analysis Report for Packaging (SARP) provides the analyses and evaluations necessary to demonstrate that the steel drum packaging system meets the transportation safety requirements of HNF-PRO-154, Responsibilities and Procedures for all Hazardous Material Shipments, for an onsite packaging containing Type B quantities of solid and liquid radioactive materials. The basic component of the steel drum packaging system is the 208 L (55-gal) steel drum.

Overview of the application of nanosecond electron beams for radiochemical sterilization

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kotov, Y.A.; Sokovnin, S.Y.

Problems concerning the use of nanosecond electron beams for sterilization of hermetically packed objects, and powdered or granulated materials, are discussed. The advantages and disadvantages of this type of radiation sterilization are demonstrated. The results are of interest to researchers who study the mechanism by which nanosecond electron beams act on microorganisms. It is worth considering repetitively pulsed electron accelerators as highly promising systems for use in commercial sterilization applications. Technologies and setups for the radiochemical sterilization (RCS) of medical glassware for blood products, beer bottles, bone meal used in food industry, medical instruments (surgical needles, systems for human kidneys),more » and of the external packaging for some biological materials used in ophthalmology are discussed. Such applications have been developed based on the use of the URT-0.2 and URT-0.5 repetitively nanosecond-pulsed electron accelerators. The observed sterilization of areas shaded from line-of-site irradiation and of the bottoms of, for example, glassware cannot be attributed to radiation sterilization alone, since the glass thickness was much larger than the range of electrons. Therefore, it can be conjectured that the demonstrated sterilization effect is due both to the electron beam and to the ozone and chemical radicals produced by the beam. Thus, one may introduce the notion of RCS.« less

LEVERAGING AGING MATERIALS DATA TO SUPPORT EXTENSION OF TRANSPORTATION SHIPPING PACKAGES SERVICE LIFE

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dunn, K.; Bellamy, S.; Daugherty, W.

Nuclear material inventories are increasingly being transferred to interim storage locations where they may reside for extended periods of time. Use of a shipping package to store nuclear materials after the transfer has become more common for a variety of reasons. Shipping packages are robust and have a qualified pedigree for performance in normal operation and accident conditions but are only certified over an approved transportation window. The continued use of shipping packages to contain nuclear material during interim storage will result in reduced overall costs and reduced exposure to workers. However, the shipping package materials of construction must maintainmore » integrity as specified by the safety basis of the storage facility throughout the storage period, which is typically well beyond the certified transportation window. In many ways, the certification processes required for interim storage of nuclear materials in shipping packages is similar to life extension programs required for dry cask storage systems for commercial nuclear fuels. The storage of spent nuclear fuel in dry cask storage systems is federally-regulated, and over 1500 individual dry casks have been in successful service up to 20 years in the US. The uncertainty in final disposition will likely require extended storage of this fuel well beyond initial license periods and perhaps multiple re-licenses may be needed. Thus, both the shipping packages and the dry cask storage systems require materials integrity assessments and assurance of continued satisfactory materials performance over times not considered in the original evaluation processes. Test programs for the shipping packages have been established to obtain aging data on materials of construction to demonstrate continued system integrity. The collective data may be coupled with similar data for the dry cask storage systems and used to support extending the service life of shipping packages in both transportation and storage.« less

A Study of the Surface Structure of Polymorphic Graphene and Other Two-Dimensional Materials for Use in Novel Electronics and Organic Photovoltaics

NASA Astrophysics Data System (ADS)

Grady, Maxwell

For some time there has been interest in the fundamental physical properties of low- dimensional material systems. The discovery of graphene as a stable two-dimensional form of solid carbon lead to an exponential increase in research in two-dimensional and other re- duced dimensional systems. It is now known that there is a wide range of materials which are stable in two-dimensional form. These materials span a large configuration space of struc- tural, mechanical, and electronic properties, which results in the potential to create novel electronic devices from nano-scale heterostructures with exactly tailored device properties. Understanding the material properties at the nanoscale level requires specialized tools to probe materials with atomic precision. Here I present the growth and analysis of a novel graphene-ruthenium system which exhibits unique polymorphism in its surface structure, hereby referred to as polymorphic graphene. Scanning Tunneling Microscopy (STM) investigations of the polymorphic graphene surface reveal a periodically rippled structure with a vast array of domains, each exhibiting xvia unique moire period. The majority of moire domains found in this polymorphic graphene system are previously unreported in past studies of the structure of graphene on ruthenium. To better understand many of the structural properties of this system, characterization methods beyond those available at the UNH surface science lab are employed. Further investigation using Low Energy Electron Microscopy (LEEM) has been carried out at Sandia National Laboratory's Center for Integrated Nanotechnology and the Brookhaven National Laboratory Center for Functional Nanomaterials. To aid in analysis of the LEEM data, I have developed an open source software package to automate extraction of electron reflectivity curves from real space and reciprocal space data sets. This software has been used in the study of numerous other two-dimensional materials beyond graphene. When combined with computational modeling, the analysis of electron I(V) curves presents a method to quantify structural parameters in a material with angstrom level precision. While many materials studied in this thesis offer unique electronic properties, my work focuses primarily on their structural aspects, as well as the instrumentation required to characterize the structure with ultra high resolution.

75 FR 27273 - Hazardous Materials; Packages Intended for Transport by Aircraft

Federal Register 2010, 2011, 2012, 2013, 2014

2010-05-14

...PHMSA proposes to amend requirements in the Hazardous Materials Regulations to enhance the integrity of inner packagings or receptacles of combination packagings containing liquid hazardous material by ensuring they remain intact when subjected to the reduced pressure and other forces encountered in air transportation. In order to substantially decrease the likelihood of a hazardous materials release, the proposed amendments: prescribe specific test protocols and standards for determining whether an inner packaging or receptacle is capable of meeting the pressure differential requirements specified in the regulations and, consistent with the 2011-2012 edition of the International Civil Aviation Organization Technical Instructions for the Safe Transport of Dangerous Goods by Aircraft (ICAO Technical Instructions), require the closures on all inner packagings containing liquids within a combination packaging to be secured by a secondary means or, under certain circumstances, permit the use of a liner.

MsSpec-1.0: A multiple scattering package for electron spectroscopies in material science

NASA Astrophysics Data System (ADS)

Sébilleau, Didier; Natoli, Calogero; Gavaza, George M.; Zhao, Haifeng; Da Pieve, Fabiana; Hatada, Keisuke

2011-12-01

We present a multiple scattering package to calculate the cross-section of various spectroscopies namely photoelectron diffraction (PED), Auger electron diffraction (AED), X-ray absorption (XAS), low-energy electron diffraction (LEED) and Auger photoelectron coincidence spectroscopy (APECS). This package is composed of three main codes, computing respectively the cluster, the potential and the cross-section. In the latter case, in order to cover a range of energies as wide as possible, three different algorithms are provided to perform the multiple scattering calculation: full matrix inversion, series expansion or correlation expansion of the multiple scattering matrix. Numerous other small Fortran codes or bash/csh shell scripts are also provided to perform specific tasks. The cross-section code is built by the user from a library of subroutines using a makefile. Program summaryProgram title: MsSpec-1.0 Catalogue identifier: AEJT_v1_0 Program summary URL:http://cpc.cs.qub.ac.uk/summaries/AEJT_v1_0.html Program obtainable from: CPC Program Library, Queen's University, Belfast, N. Ireland Licensing provisions: Standard CPC licence, http://cpc.cs.qub.ac.uk/licence/licence.html No. of lines in distributed program, including test data, etc.: 504 438 No. of bytes in distributed program, including test data, etc.: 14 448 180 Distribution format: tar.gz Programming language: Fortran 77 Computer: Any Operating system: Linux, MacOs RAM: Bytes Classification: 7.2 External routines: Lapack ( http://www.netlib.org/lapack/) Nature of problem: Calculation of the cross-section of various spectroscopies. Solution method: Multiple scattering. Running time: The test runs provided only take a few seconds to run.

Hydrothermal carbonization of food waste and associated packaging materials for energy source generation.

PubMed

Li, Liang; Diederick, Ryan; Flora, Joseph R V; Berge, Nicole D

2013-11-01

Hydrothermal carbonization (HTC) is a thermal conversion technique that converts food wastes and associated packaging materials to a valuable, energy-rich resource. Food waste collected from local restaurants was carbonized over time at different temperatures (225, 250 and 275°C) and solids concentrations to determine how process conditions influence carbonization product properties and composition. Experiments were also conducted to determine the influence of packaging material on food waste carbonization. Results indicate the majority of initial carbon remains integrated within the solid-phase at the solids concentrations and reaction temperatures evaluated. Initial solids concentration influences carbon distribution because of increased compound solubilization, while changes in reaction temperature imparted little change on carbon distribution. The presence of packaging materials significantly influences the energy content of the recovered solids. As the proportion of packaging materials increase, the energy content of recovered solids decreases because of the low energetic retention associated with the packaging materials. HTC results in net positive energy balances at all conditions, except at a 5% (dry wt.) solids concentration. Carbonization of food waste and associated packaging materials also results in net positive balances, but energy needs for solids post-processing are significant. Advantages associated with carbonization are not fully realized when only evaluating process energetics. A more detailed life cycle assessment is needed for a more complete comparison of processes. Copyright © 2013 Elsevier Ltd. All rights reserved.

21 CFR 181.22 - Certain substances employed in the manufacture of food-packaging materials.

Code of Federal Regulations, 2014 CFR

2014-04-01

... 21 Food and Drugs 3 2014-04-01 2014-04-01 false Certain substances employed in the manufacture of food-packaging materials. 181.22 Section 181.22 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT... Food Ingredients § 181.22 Certain substances employed in the manufacture of food-packaging materials...

Roles of chemical metrology in electronics industry and associated environment in Korea: a tutorial.

PubMed

Kang, Namgoo; Joong Kim, Kyung; Seog Kim, Jin; Hae Lee, Joung

2015-03-01

Chemical metrology is gaining importance in electronics industry that manufactures semiconductors, electronic displays, and microelectronics. Extensive and growing needs from this industry have raised the significance of accurate measurements of the amount of substances and material properties. For the first time, this paper presents information on how chemical metrology is being applied to meet a variety of needs in the aspects of quality control of electronics products and environmental regulations closely associated with electronics industry. For a better understanding of the roles of the chemical metrology within electronics industry, the recent research activities and results in chemical metrology are presented using typical examples in Korea where electronic industry is leading a national economy. Particular attention is paid to the applications of chemical metrology for advancing emerging electronics technology developments. Such examples are a novel technique for the accurate quantification of gas composition at nano-liter levels within a MEMS package, the surface chemical analysis of a semiconductor device. Typical metrological tools are also presented for the development of certified reference materials for fluorinated greenhouse gases and proficiency testing schemes for heavy metals and chlorinated toxic gas in order to cope properly with environmental issues within electronics industry. In addition, a recent technique is presented for the accurate measurement of the destruction and removal efficiency of a typical greenhouse gas scrubber. Copyright © 2014 Elsevier B.V. All rights reserved.

PENGEOM-A general-purpose geometry package for Monte Carlo simulation of radiation transport in material systems defined by quadric surfaces

NASA Astrophysics Data System (ADS)

Almansa, Julio; Salvat-Pujol, Francesc; Díaz-Londoño, Gloria; Carnicer, Artur; Lallena, Antonio M.; Salvat, Francesc

2016-02-01

The Fortran subroutine package PENGEOM provides a complete set of tools to handle quadric geometries in Monte Carlo simulations of radiation transport. The material structure where radiation propagates is assumed to consist of homogeneous bodies limited by quadric surfaces. The PENGEOM subroutines (a subset of the PENELOPE code) track particles through the material structure, independently of the details of the physics models adopted to describe the interactions. Although these subroutines are designed for detailed simulations of photon and electron transport, where all individual interactions are simulated sequentially, they can also be used in mixed (class II) schemes for simulating the transport of high-energy charged particles, where the effect of soft interactions is described by the random-hinge method. The definition of the geometry and the details of the tracking algorithm are tailored to optimize simulation speed. The use of fuzzy quadric surfaces minimizes the impact of round-off errors. The provided software includes a Java graphical user interface for editing and debugging the geometry definition file and for visualizing the material structure. Images of the structure are generated by using the tracking subroutines and, hence, they describe the geometry actually passed to the simulation code.

78 FR 60726 - Hazardous Materials Regulations: Penalty Guidelines

Federal Register 2010, 2011, 2012, 2013, 2014

2013-10-02

..., Radioactive Materials, Compressed Gases in cylinders; Packaging Manufacturers, Drum Manufacturers and... Administrative practices and procedure, Hazardous materials transportation, Packaging and containers, Penalties... DEPARTMENT OF TRANSPORTATION Pipeline and Hazardous Materials Safety Administration 49 CFR Part...

7 CFR 58.211 - Packaging room for bulk products.

Code of Federal Regulations, 2013 CFR

2013-01-01

... maintained to keep roofs and outside areas free of dry product. Only packaging materials that are used within a day's operation may be kept in the packaging area. These materials shall be kept on metal racks or...

7 CFR 58.211 - Packaging room for bulk products.

Code of Federal Regulations, 2014 CFR

2014-01-01

... maintained to keep roofs and outside areas free of dry product. Only packaging materials that are used within a day's operation may be kept in the packaging area. These materials shall be kept on metal racks or...

7 CFR 58.211 - Packaging room for bulk products.

Code of Federal Regulations, 2011 CFR

2011-01-01

... maintained to keep roofs and outside areas free of dry product. Only packaging materials that are used within a day's operation may be kept in the packaging area. These materials shall be kept on metal racks or...

7 CFR 58.211 - Packaging room for bulk products.

Code of Federal Regulations, 2012 CFR

2012-01-01

... maintained to keep roofs and outside areas free of dry product. Only packaging materials that are used within a day's operation may be kept in the packaging area. These materials shall be kept on metal racks or...

The effect of radiation on a variety of pharmaceuticals and materials containing polymers.

PubMed

Silindir, Mine; Ozer, Yekta

2012-01-01

The interaction of radiation, whether it has natural or artificial, electromagnetic or particle-type characterizations, with materials causes different effects depending on the dose and type of radiation and physicochemical properties of the material. In the medical field, understanding the effect of radiation on a variety of materials including pharmaceuticals, medical devices, polymers as biomaterials, and packaging is crucial. Although there are many kinds of sterilization methods, the use of radiation in sterilization has many advantages such as being a substantially less toxic, safer terminal sterilization method. Radiosterilization is sterilization with an ionizing radiation such as gamma rays or electron beam (e-beam), the latter being a newer but less-frequently used technique. However, the need for large facilities with proper radiation protections for personnel and the environment from the effects of radiation and radioactive wastes makes this procedure highly costly. The effects of radiation on materials, especially pharmaceuticals and polymer-containing medical devices, cause degradation or chemical changes. The effects of radiation on a variety of different materials is a growing research area that can create safer techniques that reduce radiation damage and increase cost-effectiveness in the future. Radiation can be used for positive purposes such as medical applications and the sterilization of pharmaceutical products, medical devices, and food and agricultural products as well as clinical applications such as diagnosis and/or therapy of a variety of diseases. The dose rate, time, type and emitted energy of the radiation are critical issues for determining its benefit/damage ratio. The sterilization of pharmaceuticals and medical devices that contain polymers can be achieved safely and effectively by irradiation. The sterilization of materials at the terminal phase-that is, in its final packaging materials-and its suitability to a variety of different kinds of packaging materials have brought additional value to radiosterilization. However, radiation sterilization is more expensive than the other sterilization methods that require large facilities. Although this method is safe in application, the effects of radiation on drugs and polymers must be evaluated by various analytical methods. In the nuclear chemistry and radiochemistry field, more effective and novel methods are being developed to decrease the harmful effects of radiation on materials.

Smart and functional polymer materials for smart and functional microfluidic instruments

NASA Astrophysics Data System (ADS)

Gray, Bonnie L.

2014-04-01

As microfluidic systems evolve from "chip-in-the-lab" to true portable lab-on-a-chip (LoC) or lab-in-a-package (LiP) microinstrumentation, there is a need for increasingly miniaturized sensors, actuators, and integration/interconnect technologies with high levels of functionality and self-direction. Furthermore, as microfluidic instruments are increasingly realized in polymer-based rather than glass- or silicon- based platforms, there is a need to realize these highly functional components in materials that are polymer-compatible. Polymers that are altered to possess basic functionality, and even higher-functioning "smart" polymer materials, may help to realize high-functioning and selfdirecting portable microinstrumentation. Stimuli-responsive hydrogels have been recognized for over a decade as beneficial to the development of smart microfluidics systems and instrumentation. In addition, functional materials such as conductive and magnetic composite polymers are being increasingly employed to push microfluidics systems to greater degrees of functionality, portability, and/or flexibility for wearable/implantable systems. Functional and smart polymer materials can be employed to realize electrodes, electronic routing, heaters, mixers, valves, pumps, sensors, and interconnect structures in polymer-based microfluidic systems. Stimuli for such materials can be located on-chip or in a small package, thus greatly increasing the degree of portability and the potential for mechanical flexibility of such systems. This paper will examine the application of functional polymer materials to the development of high-functioning microfluidics instruments with a goal towards self-direction.

REMOVAL OF LEGACY PLUTONIUM MATERIALS FROM SWEDEN

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dunn, Kerry A.; Bellamy, J. Steve; Chandler, Greg T.

2013-08-18

U.S. Department of Energy’s National Nuclear Security Administration (NNSA) Office of Global Threat Reduction (GTRI) recently removed legacy plutonium materials from Sweden in collaboration with AB SVAFO, Sweden. This paper details the activities undertaken through the U.S. receiving site (Savannah River Site (SRS)) to support the characterization, stabilization, packaging and removal of legacy plutonium materials from Sweden in 2012. This effort was undertaken as part of GTRI’s Gap Materials Program and culminated with the successful removal of plutonium from Sweden as announced at the 2012 Nuclear Security Summit. The removal and shipment of plutonium materials to the United States wasmore » the first of its kind under NNSA’s Global Threat Reduction Initiative. The Environmental Assessment for the U.S. receipt of gap plutonium material was approved in May 2010. Since then, the multi-year process yielded many first time accomplishments associated with plutonium packaging and transport activities including the application of the of DOE-STD-3013 stabilization requirements to treat plutonium materials outside the U.S., the development of an acceptance criteria for receipt of plutonium from a foreign country, the development and application of a versatile process flow sheet for the packaging of legacy plutonium materials, the identification of a plutonium container configuration, the first international certificate validation of the 9975 shipping package and the first intercontinental shipment using the 9975 shipping package. This paper will detail the technical considerations in developing the packaging process flow sheet, defining the key elements of the flow sheet and its implementation, determining the criteria used in the selection of the transport package, developing the technical basis for the package certificate amendment and the reviews with multiple licensing authorities and most importantly integrating the technical activities with the Swedish partners.« less

Multi-dimensional simulation package for ultrashort pulse laser-matter interactions

NASA Astrophysics Data System (ADS)

Suslova, Anastassiya; Hassanein, Ahmed

2017-10-01

Advanced simulation models recently became a popular tool of investigation of ultrashort pulse lasers (USPLs) to enhance understanding of the physics and allow minimizing the experimental costs for optimization of laser and target parameters for various applications. Our research interest is focused on developing multi-dimensional simulation package FEMTO-2D to investigate the USPL-matter interactions and laser induced effects. The package is based on solution of two heat conduction equations for electron and lattice sub-systems - enhanced two temperature model (TTM). We have implemented theoretical approach based on the collision theory to define the thermal dependence of target material optical properties and thermodynamic parameters. Our approach allowed elimination of fitted parameters commonly used in TTM based simulations. FEMTO-2D is used to simulated the light absorption and interactions for several metallic targets as a function of wavelength and pulse duration for wide range of laser intensity. The package has capability to consider different angles of incidence and polarization. It has also been used to investigate the damage threshold of the gold coated optical components with the focus on the role of the film thickness and substrate heat sink effect. This work was supported by the NSF, PIRE project.

NASA-DoD Lead-Free Electronics Project

NASA Technical Reports Server (NTRS)

Kessel, Kurt R.

2009-01-01

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BOA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BOA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

NASA-DoD Lead-Free Electronics Project

NASA Technical Reports Server (NTRS)

Kessel, Kurt R.

2009-01-01

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

The Potential Role of Polymethyl Methacrylate as a New Packaging Material for the Implantable Medical Device in the Bladder

PubMed Central

Kim, Su Jin; Choi, Bumkyoo; Kim, Kang Sup; Bae, Woong Jin; Hong, Sung Hoo; Lee, Ji Youl; Hwang, Tae-Kon; Kim, Sae Woong

2015-01-01

Polydimethylsiloxane (PDMS) is used in implantable medical devices; however, PDMS is not a completely biocompatible material for electronic medical devices in the bladder. To identify novel biocompatible materials for intravesical implanted medical devices, we evaluated the biocompatibility of polymethyl methacrylate (PMMA) by analyzing changes in the levels of macrophages, macrophage migratory inhibitory factor (MIF), and inflammatory cytokines in the bladder. A ball-shaped metal coated with PMMA or PDMS was implanted into the bladders of rats, and after intravesical implantation, the inflammatory changes induced by the foreign body reaction were evaluated. In the early period after implantation, increased macrophage activity and MIF in the urothelium of the bladder were observed. However, significantly decreased macrophage activity and MIF in the bladder were observed after implantation with PMMA- or PDMS-coated metal in the later period. In addition, significantly decreased inflammatory cytokines such as IL-1β, IL-6, and TNF-α were observed with time. Based on these results, we suggest that MIF plays a role in the foreign body reaction and in the biocompatible packaging with PMMA for the implanted medical devices in the bladder. PMID:25705692

PLA/PBAT Bionanocomposites with Antimicrobial Natural Rosin for Green Packaging.

PubMed

Moustafa, Hesham; El Kissi, Nadia; Abou-Kandil, Ahmed I; Abdel-Aziz, Mohamed S; Dufresne, Alain

2017-06-14

The use of biodegradable polymers is of great importance nowadays in many applications. Some of the most commonly used biopolymers are polylactic acid (PLA) and poly(butylene adipate-co-terephthalate) (PBAT) due to their superior properties and availability. In this manuscript, we use a facile and green modification method of organoclay (OC) by antimicrobial natural rosin which is considered as a toxicity-free reinforcing material, thus keeping the green character of the material. It increases the interlayer spacing between the clay platelets. This was proven by X-ray diffraction (XRD) and Fourier transform infrared spectroscopy (FTIR) and found to impart antimicrobial properties to PLA/PBAT blends. The morphology of the resulting blends was conducted using scanning and transmission electron microscopies (SEM and TEM), and evidence of exfoliation and intercalation was observed. The thermal properties of the blends were studied using differential scanning calorimetry (DSC), and a detailed study of the crystallization of both PLA and PBAT was reported showing cold crystallization behavior of PLA. The final effect on mechanical and antimicrobial properties was also investigated. The obtained results reveal excellent possibility of using expanded OC modified PLA/PBAT polymer blends by adding a green material, antimicrobial natural rosin, for food packaging and biomembranes applications.

Contamination in food from packaging material.

PubMed

Lau, O W; Wong, S K

2000-06-16

Packaging has become an indispensible element in the food manufacturing process, and different types of additives, such as antioxidants, stabilizers, lubricants, anti-static and anti-blocking agents, have also been developed to improve the performance of polymeric packaging materials. Recently the packaging has been found to represent a source of contamination itself through the migration of substances from the packaging into food. Various analytical methods have been developed to analyze the migrants in the foodstuff, and migration evaluation procedures based on theoretical prediction of migration from plastic food contact material were also introduced recently. In this paper, the regulatory control, analytical methodology, factors affecting the migration and migration evaluation are reviewed.

High-Throughput Printing Process for Flexible Electronics

NASA Astrophysics Data System (ADS)

Hyun, Woo Jin

Printed electronics is an emerging field for manufacturing electronic devices with low cost and minimal material waste for a variety of applications including displays, distributed sensing, smart packaging, and energy management. Moreover, its compatibility with roll-to-roll production formats and flexible substrates is desirable for continuous, high-throughput production of flexible electronics. Despite the promise, however, the roll-to-roll production of printed electronics is quite challenging due to web movement hindering accurate ink registration and high-fidelity printing. In this talk, I will present a promising strategy for roll-to-roll production using a novel printing process that we term SCALE (Self-aligned Capillarity-Assisted Lithography for Electronics). By utilizing capillarity of liquid inks on nano/micro-structured substrates, the SCALE process facilitates high-resolution and self-aligned patterning of electrically functional inks with greatly improved printing tolerance. I will show the fabrication of key building blocks (e.g. transistor, resistor, capacitor) for electronic circuits using the SCALE process on plastics.

MO-H-19A-03: Patient Specific Bolus with 3D Printing Technology for Electron Radiotherapy

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zou, W; Swann, B; Siderits, R

2014-06-15

Purpose: Bolus is widely used in electron radiotherapy to achieve desired dose distribution. 3D printing technologies provide clinicians with easy access to fabricate patient specific bolus accommodating patient body surface irregularities and tissue inhomogeneity. This study presents the design and the clinical workflow of 3D printed bolus for patient electron therapy in our clinic. Methods: Patient simulation CT images free of bolus were exported from treatment planning system (TPS) to an in-house developed software package. Bolus with known material properties was designed in the software package and then exported back to the TPS as a structure. Dose calculation was carriedmore » out to examine the coverage of the target. After satisfying dose distribution was achieved, the bolus structure was transferred in Standard Tessellation Language (STL) file format for the 3D printer to generate the machine codes for printing. Upon receiving printed bolus, a quick quality assurance was performed with patient resimulated with bolus in place to verify the bolus dosimetric property before treatment started. Results: A patient specific bolus for electron radiotherapy was designed and fabricated in Form 1 3D printer with methacrylate photopolymer resin. Satisfying dose distribution was achieved in patient with bolus setup. Treatment was successfully finished for one patient with the 3D printed bolus. Conclusion: The electron bolus fabrication with 3D printing technology was successfully implemented in clinic practice.« less

7 CFR 319.40-1 - Definitions.

Code of Federal Regulations, 2012 CFR

2012-01-01

... issued a specific permit. Humus, compost, and litter. Partially or wholly decayed plant matter. Import... materials; humus; compost; and litter. Regulated wood packaging material. Wood packaging material other than...

7 CFR 319.40-1 - Definitions.

Code of Federal Regulations, 2011 CFR

2011-01-01

... issued a specific permit. Humus, compost, and litter. Partially or wholly decayed plant matter. Import... materials; humus; compost; and litter. Regulated wood packaging material. Wood packaging material other than...

7 CFR 319.40-1 - Definitions.

Code of Federal Regulations, 2010 CFR

2010-01-01

... issued a specific permit. Humus, compost, and litter. Partially or wholly decayed plant matter. Import... materials; humus; compost; and litter. Regulated wood packaging material. Wood packaging material other than...

Stresses in Solder Joints of Electronic Packages

DTIC Science & Technology

1991-12-31

soldering process. The device is soldered to the circuit board at a temperature of +185zc and this tempature is assumed to propagate only to the lead wire...tri-material assembly, showing the notation used hereafter, is shown in Figure 7. The Suhir model is applicable to assemblies with continuous...therefore the radii of curvature of layers are all equal. Using equilibrium equation (7) and moment-curvature equation (9) yields ()D D Xp (x) D T() -m 3 x

Department of Defense Advisory Group on Electron Devices. Special Technology Area Review on Microwave Packaging Technology. Appendix

DTIC Science & Technology

1993-02-01

sintered in hydrogen furnace at very high temperatures . Multiple furnace firing occurs until the binders are removed and part density is achieved "* Process...and base Low temperature co-fired ceramic - Metallized for shielding and grounding - Low resistance thick-film metallization - High thermal resistance...ESPECIALLY LOW TEMPERATURE COFIRED CERAMIC CERAMICS HIGH THERMAL CONDUCTIVITY,MATCHED GaAS AND SILICON SUBSTRATE MATERIALS I I,1Z#A,17Mr1 J, TI

Basic Mechanisms of Radiation Effects on Electronic Materials, Devices, and Integrated Circuits

DTIC Science & Technology

1982-08-01

recovery time versus reciprocal tempera- ture derived from data of the type shown in Figure 18. . . .31 20 Several ways to alter the charje state of...and long-term recovery processes that occUr in neutron-irradiated silicon ........ 40 29 Annealing factor versus time for 11 ohm-cm p-type bulk silicon...radioactive ele- ments (such as uranium and thorium) which, when incorporated in packaged integrated circuits, can cause occasional transient upsets

Assessment of Quality Assurance Measures for Radioactive Material Transport Packages not Requiring Competent Authority Design Approval - 13282

DOE Office of Scientific and Technical Information (OSTI.GOV)

Komann, Steffen; Groeke, Carsten; Droste, Bernhard

The majority of transports of radioactive materials are carried out in packages which don't need a package design approval by a competent authority. Low-active radioactive materials are transported in such packages e.g. in the medical and pharmaceutical industry and in the nuclear industry as well. Decommissioning of NPP's leads to a strong demand for packages to transport low and middle active radioactive waste. According to IAEA regulations the 'non-competent authority approved package types' are the Excepted Packages and the Industrial Packages of Type IP-1, IP-2 and IP-3 and packages of Type A. For these types of packages an assessment bymore » the competent authority is required for the quality assurance measures for the design, manufacture, testing, documentation, use, maintenance and inspection (IAEA SSR 6, Chap. 306). In general a compliance audit of the manufacturer of the packaging is required during this assessment procedure. Their regulatory level in the IAEA regulations is not comparable with the 'regulatory density' for packages requiring competent authority package design approval. Practices in different countries lead to different approaches within the assessment of the quality assurance measures in the management system as well as in the quality assurance program of a special package design. To use the package or packaging in a safe manner and in compliance with the regulations a management system for each phase of the life of the package or packaging is necessary. The relevant IAEA-SSR6 chap. 801 requires documentary verification by the consignor concerning package compliance with the requirements. (authors)« less

An Investigation of Nonuniform Dose Deposition From an Electron Beam

DTIC Science & Technology

1994-08-01

to electron - beam pulse. Ceramic package HIPEC Lid Electron beam Die Bond wires TLD TLD Silver epoxy 6 package cavity die TLD’s 21 3 4 5 Figure 2...these apertures was documented in a previous experiment relating to HIFX electron -beam dosimetry .2 The hardware required for this setup was a 60-cm...impurity serves 2Gregory K. Ovrebo, Steven M. Blomquist, and Steven R. Murrill, A HIFX Electron -Beam Dosimetry System, Army Research Laboratory, ARL-TR

Definition of Small Gram Quantity Contents for Type B Radioactive Material Transportation Packages: Activity-Based Content Limitations

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sitaraman, S; Kim, S; Biswas, D

2010-10-27

Since the 1960's, the Department of Transportation Specification (DOT Spec) 6M packages have been used extensively for transportation of Type B quantities of radioactive materials between Department of Energy (DOE) facilities, laboratories, and productions sites. However, due to the advancement of packaging technology, the aging of the 6M packages, and variability in the quality of the packages, the DOT implemented a phased elimination of the 6M specification packages (and other DOT Spec packages) in favor of packages certified to meet federal performance requirements. DOT issued the final rule in the Federal Register on October 1, 2004 requiring that use ofmore » the DOT Specification 6M be discontinued as of October 1, 2008. A main driver for the change was the fact that the 6M specification packagings were not supported by a Safety Analysis Report for Packaging (SARP) that was compliant with Title 10 of the Code of Federal Regulations part 71 (10 CFR 71). Therefore, materials that would have historically been shipped in 6M packages are being identified as contents in Type B (and sometimes Type A fissile) package applications and addenda that are to be certified under the requirements of 10 CFR 71. The requirements in 10 CFR 71 include that the Safety Analysis Report for Packaging (SARP) must identify the maximum radioactivity of radioactive constituents and maximum quantities of fissile constituents (10 CFR 71.33(b)(1) and 10 CFR 71.33(b)(2)), and that the application (i.e., SARP submittal or SARP addendum) demonstrates that the external dose rate (due to the maximum radioactivity of radioactive constituents and maximum quantities of fissile constituents) on the surface of the packaging (i.e., package and contents) not exceed 200 mrem/hr (10 CFR 71.35(a), 10 CFR 71.47(a)). It has been proposed that a 'Small Gram Quantity' of radioactive material be defined, such that, when loaded in a transportation package, the dose rates at external points of an unshielded packaging not exceed the regulatory limits prescribed by 10 CFR 71 for non-exclusive shipments. The mass of each radioisotope presented in this paper is limited by the radiation dose rate on the external surface of the package, which per the regulatory limit should not exceed 200 mrem/hr. The results presented are a compendium of allowable masses of a variety of different isotopes (with varying impurity levels of beryllium in some of the actinide isotopes) that, when loaded in an unshielded packaging, do not result in an external dose rate on the surface of the package that exceeds 190 mrem/hr (190 mrem/hr was chosen to provide 5% conservatism relative to the regulatory limit). These mass limits define the term 'Small Gram Quantity' (SGQ) contents in the context of radioactive material transportation packages. The term SGQ is isotope-specific and pertains to contents in radioactive material transportation packages that do not require shielding and still satisfy the external dose rate requirements. Since these calculated mass limits are for contents without shielding, they are conservative for packaging materials that provide some limited shielding or if the contents are placed into a shielded package. The isotopes presented in this paper were chosen as the isotopes that Department of Energy (DOE) sites most likely need to ship. Other more rarely shipped isotopes, along with industrial and medical isotopes, are planned to be included in subsequent extensions of this work.« less

21 CFR 570.13 - Indirect food additives resulting from packaging materials prior sanctioned for animal feed and...

Code of Federal Regulations, 2011 CFR

2011-04-01

... 21 Food and Drugs 6 2011-04-01 2011-04-01 false Indirect food additives resulting from packaging materials prior sanctioned for animal feed and pet food. 570.13 Section 570.13 Food and Drugs FOOD AND DRUG... FOOD ADDITIVES General Provisions § 570.13 Indirect food additives resulting from packaging materials...

21 CFR 570.13 - Indirect food additives resulting from packaging materials prior sanctioned for animal feed and...

Code of Federal Regulations, 2010 CFR

2010-04-01

... 21 Food and Drugs 6 2010-04-01 2010-04-01 false Indirect food additives resulting from packaging materials prior sanctioned for animal feed and pet food. 570.13 Section 570.13 Food and Drugs FOOD AND DRUG... FOOD ADDITIVES General Provisions § 570.13 Indirect food additives resulting from packaging materials...

21 CFR 570.13 - Indirect food additives resulting from packaging materials prior sanctioned for animal feed and...

Code of Federal Regulations, 2014 CFR

2014-04-01

... 21 Food and Drugs 6 2014-04-01 2014-04-01 false Indirect food additives resulting from packaging materials prior sanctioned for animal feed and pet food. 570.13 Section 570.13 Food and Drugs FOOD AND DRUG... FOOD ADDITIVES General Provisions § 570.13 Indirect food additives resulting from packaging materials...

21 CFR 570.13 - Indirect food additives resulting from packaging materials prior sanctioned for animal feed and...

Code of Federal Regulations, 2012 CFR

2012-04-01

... 21 Food and Drugs 6 2012-04-01 2012-04-01 false Indirect food additives resulting from packaging materials prior sanctioned for animal feed and pet food. 570.13 Section 570.13 Food and Drugs FOOD AND DRUG... FOOD ADDITIVES General Provisions § 570.13 Indirect food additives resulting from packaging materials...

21 CFR 570.13 - Indirect food additives resulting from packaging materials prior sanctioned for animal feed and...

Code of Federal Regulations, 2013 CFR

2013-04-01

... 21 Food and Drugs 6 2013-04-01 2013-04-01 false Indirect food additives resulting from packaging materials prior sanctioned for animal feed and pet food. 570.13 Section 570.13 Food and Drugs FOOD AND DRUG... FOOD ADDITIVES General Provisions § 570.13 Indirect food additives resulting from packaging materials...

Nanocellulose in green food packaging.

PubMed

Vilarinho, Fernanda; Sanches Silva, Ana; Vaz, M Fátima; Farinha, José Paulo

2018-06-13

The development of packaging materials with new functionalities and lower environmental impact is now an urgent need of our society. On one hand, the shelf-life extension of packaged products can be an answer to the exponential increase of worldwide demand for food. On the other hand, uncertainty of crude oil prices and reserves has imposed the necessity to find raw materials to replace oil-derived polymers. Additionally, consumers' awareness toward environmental issues increasingly pushes industries to look with renewed interest to "green" solutions. In response to these issues, numerous polymers have been exploited to develop biodegradable food packaging materials. Although the use of biopolymers has been limited due to their poor mechanical and barrier properties, these can be enhanced by adding reinforcing nanosized components to form nanocomposites. Cellulose is probably the most used and well-known renewable and sustainable raw material. The mechanical properties, reinforcing capabilities, abundance, low density, and biodegradability of nanosized cellulose make it an ideal candidate for polymer nanocomposites processing. Here we review the potential applications of cellulose based nanocomposites in food packaging materials, highlighting the several types of biopolymers with nanocellulose fillers that have been used to form bio-nanocomposite materials. The trends in nanocellulose packaging applications are also addressed.

Data acquisition and experiment control system of the project Maus (materials science experiments under weightlessness)

NASA Astrophysics Data System (ADS)

Lensch, D.

In the context of Spacelab and Shuttle utilization, it is possible to conduct experiments in 'Small Self Contained Packages' (SSCP). This possibility exists primarily for experiments related to materials research/industrial processing engineering. The program involved is called 'get away special' (GAS). The project Maus was established in West Germany with the aim to participate in the program GAS. The autonomous design of the considered experiments made it necessary to develop an electronic unit for the control and the automatic conduction of the experiment. In addition, the process of the acquisition and the recording of the experimental data is also controlled.

Diode laser soldering using a lead-free filler material for electronic packaging structures

NASA Astrophysics Data System (ADS)

Chaminade, C.; Fogarassy, E.; Boisselier, D.

2006-04-01

As of today, several lead-free soldering pastes have been qualified for currently used soldering process. Regarding the new potential of laser-assisted soldering processes, the behaviour of the SnAgCu soldering paste requires, however, new investigations. In the first part of this study, the specific temperature profile of a laser soldering process is investigated using a high power diode laser (HPDL). These experimental results are compared to a thermal simulation developed for this specific application. The second part of this work deals with the diffusion of the tin-based filler material through the nickel barrier using the information extracted from the temperature simulations.

Biosynthesis and Characterization of AgNPs–Silk/PVA Film for Potential Packaging Application

PubMed Central

Tao, Gang; Cai, Rui; Wang, Yejing; Song, Kai; Guo, Pengchao; Zhao, Ping; Zuo, Hua; He, Huawei

2017-01-01

Bionanocomposite packaging materials have a bright future for a broad range of applications in the food and biomedical industries. Antimicrobial packaging is one of the bionanocomposite packaging materials. Silver nanoparticle (AgNP) is one of the most attractive antimicrobial agents for its broad spectrum of antimicrobial activity against microorganisms. However, the traditional method of preparing AgNPs-functionalized packaging material is cumbersome and not environmentally friendly. To develop an efficient and convenient biosynthesis method to prepare AgNPs-modified bionanocomposite material for packaging applications, we synthesized AgNPs in situ in a silk fibroin solution via the reduction of Ag+ by the tyrosine residue of fibroin, and then prepared AgNPs–silk/poly(vinyl alcohol) (PVA) composite film by blending with PVA. AgNPs were synthesized evenly on the surface or embedded in the interior of silk/PVA film. The prepared AgNPs–silk/PVA film exhibited excellent mechanical performance and stability, as well as good antibacterial activity against both Gram-negative and Gram-positive bacteria. AgNPs–silk/PVA film offers more choices to be potentially applied in the active packaging field. PMID:28773026

Biosynthesis and Characterization of AgNPs-Silk/PVA Film for Potential Packaging Application.

PubMed

Tao, Gang; Cai, Rui; Wang, Yejing; Song, Kai; Guo, Pengchao; Zhao, Ping; Zuo, Hua; He, Huawei

2017-06-17

Bionanocomposite packaging materials have a bright future for a broad range of applications in the food and biomedical industries. Antimicrobial packaging is one of the bionanocomposite packaging materials. Silver nanoparticle (AgNP) is one of the most attractive antimicrobial agents for its broad spectrum of antimicrobial activity against microorganisms. However, the traditional method of preparing AgNPs-functionalized packaging material is cumbersome and not environmentally friendly. To develop an efficient and convenient biosynthesis method to prepare AgNPs-modified bionanocomposite material for packaging applications, we synthesized AgNPs in situ in a silk fibroin solution via the reduction of Ag⁺ by the tyrosine residue of fibroin, and then prepared AgNPs-silk/poly(vinyl alcohol) (PVA) composite film by blending with PVA. AgNPs were synthesized evenly on the surface or embedded in the interior of silk/PVA film. The prepared AgNPs-silk/PVA film exhibited excellent mechanical performance and stability, as well as good antibacterial activity against both Gram-negative and Gram-positive bacteria. AgNPs-silk/PVA film offers more choices to be potentially applied in the active packaging field.

75 FR 53593 - Hazardous Materials: Minor Editorial Corrections and Clarifications

Federal Register 2010, 2011, 2012, 2013, 2014

2010-09-01

... transportation, Packaging and containers, Radioactive materials, Reporting and recordkeeping requirements... section specifies general requirements for packaging hazardous materials for transportation by aircraft... contamination on motor vehicles used to transport Class 7 radioactive materials under exclusive use conditions...

Numeric analysis of terahertz wave propagation in familiar packaging materials

NASA Astrophysics Data System (ADS)

Zhang, Lihong; Yang, Guang

2015-10-01

To assess the potential application of terahertz waves in security examination, the transmission characteristics of terahertz waves in packaging materials should be studied. This paper simulates the propagation of terahertz waves in cloth and paper, studies the changes of shape and position of crest of terahertz waves before and after these materials, and gets the law of these changes, which has potential applications in thickness measurement for the thin insulated materials; gives reflected and transmitted wave of terahertz waves, and computes reflected and transmitted coefficient, indicates the good transmission properties of these materials for terahertz waves, which provides the theoretical basis for the realization of contactless security examination of packaged post, package and people pass the important passageway (such as airport and station).

HRTEM Analysis of Crystallographic Defects in CdZnTe Single Crystal

NASA Astrophysics Data System (ADS)

Yasar, Bengisu; Ergunt, Yasin; Kabukcuoglu, Merve Pinar; Parlak, Mehmet; Turan, Rasit; Kalay, Yunus Eren

2018-01-01

In recent years, CdZnTe has attracted much attention due to its superior electrical and structural properties for room-temperature operable gamma and x-ray detectors. However, CdZnTe (CZT) material has often suffered from crystallographic defects encountered during the growth and post-growth processes. The identification and structural characterization of these defects is crucial to synthesize defect-free CdZnTe single crystals. In this study, Cd0.95 Zn0.05 Te single crystals were grown using a three-zone vertical Bridgman system. The single crystallinity of the material was ensured by using x-ray diffraction measurements. High-resolution electron microscopy (HRTEM) was used to characterize the nano-scale defects on the CdZnTe matrix. The linear defects oriented along the ⟨211⟩ direction were examined by transmission electron microscopy (TEM) and the corresponding HRTEM image simulations were performed by using a quantitative scanning TEM simulation package.

"Genetically Engineered" Nanoelectronics

NASA Technical Reports Server (NTRS)

Klimeck, Gerhard; Salazar-Lazaro, Carlos H.; Stoica, Adrian; Cwik, Thomas

2000-01-01

The quantum mechanical functionality of nanoelectronic devices such as resonant tunneling diodes (RTDs), quantum well infrared-photodetectors (QWIPs), quantum well lasers, and heterostructure field effect transistors (HFETs) is enabled by material variations on an atomic scale. The design and optimization of such devices requires a fundamental understanding of electron transport in such dimensions. The Nanoelectronic Modeling Tool (NEMO) is a general-purpose quantum device design and analysis tool based on a fundamental non-equilibrium electron transport theory. NEW was combined with a parallelized genetic algorithm package (PGAPACK) to evolve structural and material parameters to match a desired set of experimental data. A numerical experiment that evolves structural variations such as layer widths and doping concentrations is performed to analyze an experimental current voltage characteristic. The genetic algorithm is found to drive the NEMO simulation parameters close to the experimentally prescribed layer thicknesses and doping profiles. With such a quantitative agreement between theory and experiment design synthesis can be performed.

3D packaging of a microfluidic system with sensory applications

NASA Astrophysics Data System (ADS)

Morrissey, Anthony; Kelly, Gerard; Alderman, John C.

1997-09-01

Among the main benefits of microsystem technology are its contributions to cost reductio, reliability and improved performance. however, the packaging of microsystems, and particularly microsensor, has proven to be one of the biggest limitations to their commercialization and the packaging of silicon sensor devices can be the most costly part of their fabrication. This paper describes the integration of 3D packaging of a microsystem. Central to the operation of the 3D demonstrator is a micromachined silicon membrane pump to supply fluids to a sensing chamber constructed about the active area of a sensor chip. This chip carries ISFET based chemical sensors, pressure sensors and thermal sensors. The electronics required for controlling and regulating the activity of the various sensors ar also available on this chip and as other chips in the 3D assembly. The demonstrator also contains a power supply module with optical fiber interconnections. All of these modules are integrated into a single plastic- encapsulated 3D vertical multichip module. The reliability of such a structure, initially proposed by Val was demonstrated by Barrett et al. An additional module available for inclusion in some of our assemblies is a test chip capable of measuring the packaging-induced stress experienced during and after assembly. The packaging process described produces a module with very high density and utilizes standard off-the-shelf components to minimize costs. As the sensor chip and micropump include micromachined silicon membranes and microvalves, the packaging of such structures has to allow consideration for the minimization of the packaging-induced stresses. With this in mind, low stress techniques, including the use of soft glob-top materials, were employed.

Hazardous Material Packaging and Transportation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hypes, Philip A.

2016-02-04

This is a student training course. Some course objectives are to: recognize and use standard international and US customary units to describe activities and exposure rates associated with radioactive material; determine whether a quantity of a single radionuclide meets the definition of a class 7 (radioactive) material; determine, for a given single radionuclide, the shipping quantity activity limits per 49 Code of Federal Regulations (CFR) 173.435; determine the appropriate radioactive material hazard class proper shipping name for a given material; determine when a single radionuclide meets the DOT definition of a hazardous substance; determine the appropriate packaging required for amore » given radioactive material; identify the markings to be placed on a package of radioactive material; determine the label(s) to apply to a given radioactive material package; identify the entry requirements for radioactive material labels; determine the proper placement for radioactive material label(s); identify the shipping paper entry requirements for radioactive material; select the appropriate placards for a given radioactive material shipment or vehicle load; and identify allowable transport limits and unacceptable transport conditions for radioactive material.« less

Transformation of food packaging from passive to innovative via nanotechnology: concepts and critiques.

PubMed

Mlalila, Nichrous; Kadam, Dattatreya M; Swai, Hulda; Hilonga, Askwar

2016-09-01

In recent decades, there is a global advancement in manufacturing industry due to increased applications of nanotechnology. Food industry also has been tremendously changing from passive packaging to innovative packaging, to cope with global trends, technological advancements, and consumer preferences. Active research is taking place in food industry and other scientific fields to develop innovative packages including smart, intelligent and active food packaging for more effective and efficient packaging materials with balanced environmental issues. However, in food industry the features behind smart packaging are narrowly defined to be distinguished from intelligent packaging as in other scientific fields, where smart materials are under critical investigations. This review presents some scientific concepts and features pertaining innovative food packaging. The review opens new research window in innovative food packaging to cover the existing disparities for further precise research and development of food packaging industry.

Flexible Foam Protection Materials for Constellation Space Suit Element Portable Life Support Subsystem Packaging Study

NASA Technical Reports Server (NTRS)

Tang, Henry H.; Orndoff, Evelyne S.; Thomas, Gretchen A.

2009-01-01

This paper discusses the effort in evaluating and selecting a light weight impact protection material for the Constellation Space Suit Element (CSSE) Portable Life Support Subsystem (PLSS) conceptual packaging study. A light weight material capable of holding and protecting the components inside the PLSS is required to demonstrate the viability of the flexible PLSS packaging concept. The material needs to distribute, dissipate, and absorb the impact energy of the PLSS falling on the lunar surface. It must also be very robust and function in the extreme lunar thermal vacuum environment for up to one hundred Extravehicular Activity (EVA) missions. This paper documents the performance requirements for selecting a foam protection material, and the methodologies for evaluating commercial off-the-shelf (COTS) foam protection materials. It also presents the materials properties test results and impact drop test results of the various foam materials evaluated in the study. The findings from this study suggest that a foam based flexible protection system is a viable solution for PLSS packaging. However, additional works are needed to optimize COTS foam properties or to develop a composite foam system that will meet all the performance requirements for the CSSE PLSS flexible packaging.

Active and intelligent packaging systems for a modern society.

PubMed

Realini, Carolina E; Marcos, Begonya

2014-11-01

Active and intelligent packaging systems are continuously evolving in response to growing challenges from a modern society. This article reviews: (1) the different categories of active and intelligent packaging concepts and currently available commercial applications, (2) latest packaging research trends and innovations, and (3) the growth perspectives of the active and intelligent packaging market. Active packaging aiming at extending shelf life or improving safety while maintaining quality is progressing towards the incorporation of natural active agents into more sustainable packaging materials. Intelligent packaging systems which monitor the condition of the packed food or its environment are progressing towards more cost-effective, convenient and integrated systems to provide innovative packaging solutions. Market growth is expected for active packaging with leading shares for moisture absorbers, oxygen scavengers, microwave susceptors and antimicrobial packaging. The market for intelligent packaging is also promising with strong gains for time-temperature indicator labels and advancements in the integration of intelligent concepts into packaging materials. Copyright © 2014 Elsevier Ltd. All rights reserved.

19 CFR 102.15 - Disregarded materials.

Code of Federal Regulations, 2011 CFR

2011-04-01

... 19 Customs Duties 1 2011-04-01 2011-04-01 false Disregarded materials. 102.15 Section 102.15... TREASURY RULES OF ORIGIN Rules of Origin § 102.15 Disregarded materials. (a) The following materials shall...: (1) Packaging materials and containers in which a good is packaged for retail sale that are...

19 CFR 102.15 - Disregarded materials.

Code of Federal Regulations, 2014 CFR

2014-04-01

... 19 Customs Duties 1 2014-04-01 2014-04-01 false Disregarded materials. 102.15 Section 102.15... TREASURY RULES OF ORIGIN Rules of Origin § 102.15 Disregarded materials. (a) The following materials shall...: (1) Packaging materials and containers in which a good is packaged for retail sale that are...

Processing of NiTi Reinforced Adaptive Solder for Electronic Packaging

DTIC Science & Technology

2004-03-01

NAVAL POSTGRADUATE SCHOOL MONTEREY, CALIFORNIA THESIS PROCESSING OF NITI REINFORCED ADAPTIVE SOLDER FOR ELECTRONIC PACKAGING...March 2004 3. REPORT TYPE AND DATES COVERED Master’s Thesis 4. TITLE AND SUBTITLE: Processing of NiTi Reinforced Adaptive Solder for Electronic...reports in the development a process to fabricate solder joints with a fine distribution of shape memory alloys (SMA) NiTi particulates. The

Nanogranular soft magnetic material and on-package integrated inductors

NASA Astrophysics Data System (ADS)

Li, Liangliang

2007-12-01

Integrated inductors used in electronic circuits are mainly spiral-shaped aluminum devices fabricated on Si chip. They have several disadvantages---large silicon area consumption, high DC resistance and high cost. An attractive approach to address these issues is directly integrating inductors into package substrates, which provide plenty of usage area, low resistance and low cost. The goals of this dissertation are designing and fabricating magnetic and air-core inductors with characteristic low resistance and high quality factor on package substrates. The research work includes three parts which are summarized below. First, the CoFeHfO nanogranular magnetic material developed on Si wafers and package substrates by pulsed DC reactive sputtering were investigated. On Si wafers, the optimized CoFeHfO film has soft magnetic properties. On printed circuit board (PCB) substrates, these magnetic properties degrade due to the rough surface. Surface planarization such as chemical-mechanical polishing can be applied on PCB substrates to reduce the surface roughness and hence improve these properties. Second, on-package inductors with small resistances and high quality factors were designed, fabricated, measured and analyzed. Air-core and magnetic inductors (20 design variations) were built on 8-inch PCB substrates. The DC resistances of these inductors are less than 12 mO, one of the lowest values ever reported. The maximum quality factors can be as large as ˜80 at around 1 GHz for the air-core inductors and ˜25 at 200 MHz for the magnetic inductors. Third, inductor simulation was carried out to study the effects of magnetic materials on the properties of inductors using the Ansoft HFSS software package. The measurement data for the permeability spectra of the CoFeHfO film and the tensor nature of the permeability were taken into account in the simulation. The simulation results matched the experimental data for the inductances, resistances and quality factors. This established an accurate method for modeling high-frequency magnetic devices. Using this method, an inductor with a closed magnetic core was studied by varying the geometry of the core and copper coil. It has been found that the inductance of this inductor depends strongly on whether the permeability of the magnetic core is isotropic or anisotropic.

Integrated Electrode Arrays for Neuro-Prosthetic Implants

NASA Technical Reports Server (NTRS)

Brandon, Erik; Mojarradi, Mohammede

2003-01-01

Arrays of electrodes integrated with chip-scale packages and silicon-based integrated circuits have been proposed for use as medical electronic implants, including neuro-prosthetic devices that might be implanted in brains of patients who suffer from strokes, spinal-cord injuries, or amyotrophic lateral sclerosis. The electrodes of such a device would pick up signals from neurons in the cerebral cortex, and the integrated circuit would perform acquisition and preprocessing of signal data. The output of the integrated circuit could be used to generate, for example, commands for a robotic arm. Electrode arrays capable of acquiring electrical signals from neurons already exist, but heretofore, there has been no convenient means to integrate these arrays with integrated-circuit chips. Such integration is needed in order to eliminate the need for the extensive cabling now used to pass neural signals to data-acquisition and -processing equipment outside the body. The proposed integration would enable progress toward neuro-prostheses that would be less restrictive of patients mobility. An array of electrodes would comprise a set of thin wires of suitable length and composition protruding from and supported by a fine-pitch micro-ball grid array or chip-scale package (see figure). The associated integrated circuit would be mounted on the package face opposite the probe face, using the solder bumps (the balls of the ball grid array) to make the electrical connections between the probes and the input terminals of the integrated circuit. The key innovation is the insertion of probe wires of the appropriate length and material into the solder bumps through a reflow process, thereby fixing the probes in place and electrically connecting them with the integrated circuit. The probes could be tailored to any distribution of lengths and made of any suitable metal that could be drawn into fine wires. Furthermore, the wires could be coated with an insulating layer using anodization or other processes, to achieve the correct electrical impedance. The probe wires and the packaging materials must be biocompatible using such materials as lead-free solders. For protection, the chip and package can be coated with parylene.

49 CFR 173.4a - Excepted quantities.

Code of Federal Regulations, 2011 CFR

2011-10-01

... of withstanding without leakage the pressure differential specified in § 173.27(c) of this part. (b... ice), and lithium batteries and cells. (c) Inner packaging limits. The maximum quantity of hazardous..., rigid outer packaging. (5) Placement of the material in the package or packing different materials in...

Optimizing biomass blends for manufacturing molded packaging materials using mycelium

USDA-ARS?s Scientific Manuscript database

Polystyrene is one of the most widely used plastics and is commonly produced in three forms: 1) Extruded polystyrene – disposable utensils, CD/DVD cases, yogurt containers, smoke alarm housing, etc.; 2) Expanded polystyrene foam – molded packaging materials and packaging "peanuts"; 3) Extruded polys...

Mass Transfer Study of Chlorine Dioxide Gas Through Polymeric Packaging Materials

USDA-ARS?s Scientific Manuscript database

A continuous system for measuring the mass transfer of gaseous chlorine dioxide (ClO2), a strong oxidizing agent and used in food and pharmaceutical packaging, through 10 different types of polymeric packaging material was developed utilizing electrochemical sensor as a detector. Permeability, diff...

49 CFR 178.609 - Test requirements for packagings for infectious substances.

Code of Federal Regulations, 2010 CFR

2010-10-01

... paragraph (c), which, for test purposes, categorizes packagings according to their material characteristics... performance may be rapidly affected by moisture; plastics that may embrittle at low temperature; and other... the appropriate test. Table I—Tests Required Material of Outer packaging Fiberboard Plastics Other...

Photo-Curable Metal-Chelating Coatings Offer a Scalable Approach to Production of Antioxidant Active Packaging.

PubMed

Lin, Zhuangsheng; Goddard, Julie

2018-02-01

Synthetic metal chelators (for example, ethylenediaminetetraacetic acid, EDTA) are widely used as additives to control trace transition metal induced oxidation in consumer products. To enable removal of synthetic chelators in response to increasing consumer demand for clean label products, metal-chelating active food packaging technologies have been developed with demonstrated antioxidant efficacy in simulated food systems. However, prior work in fabrication of metal-chelating materials leveraged batch chemical reactions to tether metal-chelating ligands, a process with limited industrial translatability for large-scale fabrication. To improve the industrial translatability, we have designed a 2-step laminated photo-grafting process to introduce metal chelating functionality onto common polymeric packaging materials. Iminodiacetic acid (IDA) functionalized materials were fabricated by photo-grafting poly(acrylic acid) onto polypropylene (PP) films, followed by a second photo-grafting process to graft-polymerize an IDA functionalized vinyl monomer (GMA-IDA). The photo-grafting was conducted under atmospheric conditions and was completed in 2 min. The resulting IDA functionalized metal-chelating material was able to chelate iron and copper, and showed antioxidant efficacy against ascorbic acid degradation, supporting its potential to be used synergistically with natural antioxidants for preservation of food and beverage products. The 2-step photo-grafting process improves the throughput of active packaging coatings, enabling potential roll-to-roll fabrication of metal-chelating active packaging materials for antioxidant food packaging applications. To address consumer and retail demands for "clean label" foods and beverages without a corresponding loss in product quality and shelf life, producers are seeking next generation technologies such as active packaging. In this work, we will report the synthesis of metal-chelating active packaging films, which enable removal of the synthetic additive, ethylenediamine tetraacetic acid. The new synthesis technique improves the throughput of metal-chelating active packaging coatings, enabling potential roll-to-roll fabrication of the materials for antioxidant food packaging applications. © 2018 Institute of Food Technologists®.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Loftin, B.; Abramczyk, G.; Koenig, R.

Radioactive materials are stored in a variety of locations throughout the DOE complex. At the Savannah River Site (SRS), materials are stored within dedicated facilities. Each of those facilities has a documented safety analysis (DSA) that describes accidents that the facility and the materials within it may encounter. Facilities at the SRS are planning on utilizing the certified Model 9977 Shipping Package as a long term storage package and one of these facilities required ballistics testing. Specifically, in order to meet the facility DSA, the radioactive materials (RAM) must be contained within the storage package after impact by a .223more » caliber round. In order to qualify the Model 9977 Shipping Package for storage in this location, the package had to be tested under these conditions. Over the past two years, the Model 9977 Shipping Package has been subjected to a series of ballistics tests. The purpose of the testing was to determine if the 9977 would be suitable for use as a storage package at a Savannah River Site facility. The facility requirements are that the package must not release any of its contents following the impact in its most vulnerable location by a .223 caliber round. A package, assembled to meet all of the design requirements for a certified 9977 shipping configuration and using simulated contents, was tested at the Savannah River Site in March of 2011. The testing was completed and the package was examined. The results of the testing and examination are presented in this paper.« less

Injectable 3-D Fabrication of Medical Electronics at the Target Biological Tissues

NASA Astrophysics Data System (ADS)

Jin, Chao; Zhang, Jie; Li, Xiaokang; Yang, Xueyao; Li, Jingjing; Liu, Jing

2013-12-01

Conventional transplantable biomedical devices generally request sophisticated surgery which however often causes big trauma and serious pain to the patients. Here, we show an alternative way of directly making three-dimensional (3-D) medical electronics inside the biological body through sequential injections of biocompatible packaging material and liquid metal ink. As the most typical electronics, a variety of medical electrodes with different embedded structures were demonstrated to be easily formed at the target tissues. Conceptual in vitro experiments provide strong evidences for the excellent performances of the injectable electrodes. Further in vivo animal experiments disclosed that the formed electrode could serve as both highly efficient ECG (Electrocardiograph) electrode and stimulator electrode. These findings clarified the unique features and practicability of the liquid metal based injectable 3-D fabrication of medical electronics. The present strategy opens the way for directly manufacturing electrophysiological sensors or therapeutic devices in situ via a truly minimally invasive approach.

Food safety concerns deriving from the use of silver based food packaging materials.

PubMed

Pezzuto, Alessandra; Losasso, Carmen; Mancin, Marzia; Gallocchio, Federica; Piovesana, Alessia; Binato, Giovanni; Gallina, Albino; Marangon, Alberto; Mioni, Renzo; Favretti, Michela; Ricci, Antonia

2015-01-01

The formulation of innovative packaging solutions, exerting a functional antimicrobial role in slowing down food spoilage, is expected to have a significant impact on the food industry, allowing both the maintenance of food safety criteria for longer periods and the reduction of food waste. Different materials are considered able to exert the required antimicrobial activity, among which are materials containing silver. However, challenges exist in the application of silver to food contact materials due to knowledge gaps in the production of ingredients, stability of delivery systems in food matrices and health risks caused by the same properties which also offer the benefits. Aims of the present study were to test the effectiveness and suitability of two packaging systems, one of which contained silver, for packaging and storing Stracchino cheese, a typical Italian fresh cheese, and to investigate if there was any potential for consumers to be exposed to silver, via migration from the packaging to the cheese. Results did not show any significant difference in the effectiveness of the packaging systems on packaged Stracchino cheese, excluding that the active packaging systems exerted an inhibitory effect on the growth of spoilage microorganisms. Moreover, silver migrated into the cheese matrix throughout the storage time (24 days). Silver levels in cheese finally exceeded the maximum established level for the migration of a non-authorised substance through a functional barrier (Commission of the European Communities, 2009). This result poses safety concerns and strongly suggests the need for more research aimed at better characterizing the new packaging materials in terms of their potential impacts on human health and the environment.

Micro/nano electro mechanical systems for practical applications

NASA Astrophysics Data System (ADS)

Esashi, Masayoshi

2009-09-01

Silicon MEMS as electrostatically levitated rotational gyroscope, 2D optical scanner and wafer level packaged devices as integrated capacitive pressure sensor and MEMS switch are described. MEMS which use non-silicon materials as diamond, PZT, conductive polymer, CNT (carbon nano tube), LTCC with electrical feedthrough, SiC (silicon carbide) and LiNbO3 for multi-probe data storage, multi-column electron beam lithography system, probe card for wafer-level burn-in test, mould for glass press moulding and SAW wireless passive sensor respectively are also described.

Design technique for all-dielectric non-polarizing beam splitter plate

NASA Astrophysics Data System (ADS)

Rizea, A.

2012-03-01

There are many situations when, for the proper working, an opto-electronic device requiring optical components does not change the polarization state of light after a reflection, splitting or filtering. In this paper, a design for a non-polarizing beam splitter plate is proposed. Based on certain optical properties of homogeneous dielectric materials we will establish a reliable thin film package formula, excellent for the start of optimization to obtain a 20-nm bandwidth non-polarizing beam splitter.

Diagnostic system design for the Ion Auxiliary Propulsion System (IAPS). Flight tests of two 8 cm mercury ion

NASA Technical Reports Server (NTRS)

Hurst, E. B.; Thomas, G. Z.

1981-01-01

The mechanical, thermal, electrical design and the ground test results of four types of detectors are explained. The DSS is designed to measure the thruster efflux material deposition and S/C potential relative to the local plasma in the vicinity of two 8 cm mercury ion thrusters. The DSS consists of two quartz crystal microbalance (QCM) detectors, one potential probe, nine solar cell arrays, seven ion collectors and two electronic packages.

Romanian experience on packaging testing

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vieru, G.

2007-07-01

With more than twenty years ago, the Institute for Nuclear Research Pitesti (INR), through its Reliability and Testing Laboratory, was licensed by the Romanian Nuclear Regulatory Body- CNCAN and to carry out qualification tests [1] for packages intended to be used for the transport and storage of radioactive materials. Radioactive materials, generated by Romanian nuclear facilities [2] are packaged in accordance with national [3] and the IAEA's Regulations [1,6] for a safe transport to the disposal center. Subjecting these packages to the normal and simulating test conditions accomplish the evaluation and certification in order to prove the package technical performances.more » The paper describes the qualification tests for type A and B packages used for transport and storage of radioactive materials, during a period of 20 years of experience. Testing is used to substantiate assumption in analytical models and to demonstrate package structural response. The Romanian test facilities [1,3,6] are used to simulate the required qualification tests and have been developed at INR Pitesti, the main supplier of type A packages used for transport and storage of low radioactive wastes in Romania. The testing programme will continue to be a strong option to support future package development, to perform a broad range of verification and certification tests on radioactive material packages or component sections, such as packages used for transport of radioactive sources to be used for industrial or medical purposes [2,8]. The paper describes and contain illustrations showing some of the various tests packages which have been performed during certain periods and how they relate to normal conditions and minor mishaps during transport. Quality assurance and quality controls measures taken in order to meet technical specification provided by the design there are also presented and commented. (authors)« less

Natural additives and agricultural wastes in biopolymer formulations for food packaging.

PubMed

Valdés, Arantzazu; Mellinas, Ana Cristina; Ramos, Marina; Garrigós, María Carmen; Jiménez, Alfonso

2014-01-01

The main directions in food packaging research are targeted toward improvements in food quality and food safety. For this purpose, food packaging providing longer product shelf-life, as well as the monitoring of safety and quality based upon international standards, is desirable. New active packaging strategies represent a key area of development in new multifunctional materials where the use of natural additives and/or agricultural wastes is getting increasing interest. The development of new materials, and particularly innovative biopolymer formulations, can help to address these requirements and also with other packaging functions such as: food protection and preservation, marketing and smart communication to consumers. The use of biocomposites for active food packaging is one of the most studied approaches in the last years on materials in contact with food. Applications of these innovative biocomposites could help to provide new food packaging materials with improved mechanical, barrier, antioxidant, and antimicrobial properties. From the food industry standpoint, concerns such as the safety and risk associated with these new additives, migration properties and possible human ingestion and regulations need to be considered. The latest innovations in the use of these innovative formulations to obtain biocomposites are reported in this review. Legislative issues related to the use of natural additives and agricultural wastes in food packaging systems are also discussed.

Natural additives and agricultural wastes in biopolymer formulations for food packaging

NASA Astrophysics Data System (ADS)

Valdés, Arantzazu; Mellinas, Ana Cristina; Ramos, Marina; Garrigós, María Carmen; Jiménez, Alfonso

2014-02-01

The main directions in food packaging research are targeted towards improvements in food quality and food safety. For this purpose, food packaging providing longer product shelf-life, as well as the monitoring of safety and quality based upon international standards, is desirable. New active packaging strategies represent a key area of development in new multifunctional materials where the use of natural additives and/or agricultural wastes is getting increasing interest. The development of new materials, and particularly innovative biopolymer formulations, can help to address these requirements and also with other packaging functions such as: food protection and preservation, marketing and smart communication to consumers. The use of biocomposites for active food packaging is one of the most studied approaches in the last years on materials in contact with food. Applications of these innovative biocomposites could help to provide new food packaging materials with improved mechanical, barrier, antioxidant and antimicrobial properties. From the food industry standpoint, concerns such as the safety and risk associated with these new additives, migration properties and possible human ingestion and regulations need to be considered. The latest innovations in the use of these innovative formulations to obtain biocomposites are reported in this review. Legislative issues related to the use of natural additives and agricultural wastes in food packaging systems are also discussed.

Natural additives and agricultural wastes in biopolymer formulations for food packaging

PubMed Central

Valdés, Arantzazu; Mellinas, Ana Cristina; Ramos, Marina; Garrigós, María Carmen; Jiménez, Alfonso

2014-01-01

The main directions in food packaging research are targeted toward improvements in food quality and food safety. For this purpose, food packaging providing longer product shelf-life, as well as the monitoring of safety and quality based upon international standards, is desirable. New active packaging strategies represent a key area of development in new multifunctional materials where the use of natural additives and/or agricultural wastes is getting increasing interest. The development of new materials, and particularly innovative biopolymer formulations, can help to address these requirements and also with other packaging functions such as: food protection and preservation, marketing and smart communication to consumers. The use of biocomposites for active food packaging is one of the most studied approaches in the last years on materials in contact with food. Applications of these innovative biocomposites could help to provide new food packaging materials with improved mechanical, barrier, antioxidant, and antimicrobial properties. From the food industry standpoint, concerns such as the safety and risk associated with these new additives, migration properties and possible human ingestion and regulations need to be considered. The latest innovations in the use of these innovative formulations to obtain biocomposites are reported in this review. Legislative issues related to the use of natural additives and agricultural wastes in food packaging systems are also discussed. PMID:24790975

Life testing of reflowed and reworked advanced CCGA surface mount packages in harsh thermal environments

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2013-03-01

Life testing/qualification of reflowed (1st reflow) and reworked (1st reflow, 1st removal, and then 1st rework) advanced ceramic column grid array (CCGA) surface mount interconnect electronic packaging technologies for future flight projects has been studied to enhance the mission assurance of JPL-NASA projects. The reliability of reworked/reflowed surface mount technology (SMT) packages is very important for short-duration and long-duration deep space harsh extreme thermal environmental missions. The life testing of CCGA electronic packages under extreme thermal environments (for example: -185°C to +125°C) has been performed with reference to various JPL/NASA project requirements which encompass the temperature range studied. The test boards of reflowed and reworked CCGA packages (717 Xilinx package, 624, 1152, and 1272 column Actel Packages) were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases or cycles to failure to assess the life of the hardware. Qualification/life testing was performed by subjecting test boards to the environmental harsh temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance solder-joint failures due to either overstress or thermal cycle fatigue. The large, high density, high input/output (I/O) electronic interconnect SMT packages such as CCGA have increased usage in avionics hardware of NASA projects during the last two decades. The test boards built with CCGA packages are expensive and often require a rework to replace a reflowed, reprogrammed, failed, redesigned, etc., CCGA packages. Theoretically speaking, a good rework process should have similar temperature-time profile as that used for the original manufacturing process of solder reflow. A multiple rework processes may be implemented with CCGA packaging technology to understand the effect of number of reworks on the reliability of this technology for harsh thermal environments. In general, reliability of the assembled electronic packages reduces as a function of number of reworks and the extent is not known yet. A CCGA rework process has been tried and implemented to design a daisy-chain test board consists of 624 and 717 packages. Reworked CCGA interconnect electronic packages of printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging and optical microscope techniques. The assembled boards after 1st rework and 1st reflow were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space JPL/NASA for moderate to harsh thermal mission environments. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling to determine intermittent failures. This paper provides the experimental reliability test results to failure of assemblies for the first time of reflowed and reworked CCGA packages under extreme harsh thermal environments.

Cellulose-glycerol-polyvinyl alcohol composite films for food packaging: Evaluation of water adsorption, mechanical properties, light-barrier properties and transparency.

PubMed

Cazón, Patricia; Vázquez, Manuel; Velazquez, Gonzalo

2018-09-01

Nowadays consumers are aware of environmental problems. As an alternative to petrochemical polymers for food packaging, researchers have been focused on biopolymeric materials as raw material. The aim of this study was to evaluate mechanical properties (toughness, burst strength and distance to burst), water adsorption, light-barrier properties and transparency of composite films based on cellulose, glycerol and polyvinyl alcohol. Scanning electron microscopy, spectral analysis (FT-IR and UV-VIS-NIR) and differential scanning calorimetry were performed to explain the morphology, structural and thermal properties of the films. Results showed that polyvinyl alcohol enhances the toughness of films up to 44.30 MJ/m 3 . However, toughness decreases when glycerol concentration is increased (from 23.41 to 10.55 MJ/m 3 ). Water adsorption increased with increasing polyvinyl alcohol concentration up to 222%. Polyvinyl alcohol increased the film thickness. The films showed higher burst strength (up to 12014 g) than other biodegradable films. The films obtained have optimal values of transparency like those values of synthetic polymers. Glycerol produced a UV protective effect in the films, an important effect for food packaging to prevent lipid oxidative deterioration. Results showed that it is feasible to obtain cellulose-glycerol-polyvinyl alcohol composite films with improved properties. Copyright © 2018 Elsevier Ltd. All rights reserved.

Challenges and opportunities of biodegradable plastics: A mini review.

PubMed

Rujnić-Sokele, Maja; Pilipović, Ana

2017-02-01

The concept of materials coming from nature with environmental advantages of being biodegradable and/or biobased (often referred to as bioplastics) is very attractive to the industry and to the consumers. Bioplastics already play an important role in the fields of packaging, agriculture, gastronomy, consumer electronics and automotive, but still they have a very low share in the total production of plastics (currently about 1% of the about 300 million tonnes of plastic produced annually). Biodegradable plastics are often perceived as the possible solution for the waste problem, but biodegradability is just an additional feature of the material to be exploited at the end of its life in specific terms, in the specific disposal environment and in a specific time, which is often forgotten. They should be used as a favoured choice for the applications that demand a cheap way to dispose of the item after it has fulfilled its job (e.g. for food packaging, agriculture or medical products). The mini-review presents the opportunities and future challenges of biodegradable plastics, regarding processing, properties and waste management options.

Preparation of ecofriendly UV-protective food packaging material by starch/TiO2 bio-nanocomposite: Characterization.

PubMed

Goudarzi, Vahid; Shahabi-Ghahfarrokhi, Iman; Babaei-Ghazvini, Amin

2017-02-01

In this study, ecofriendly starch/TiO 2 bio-nanocomposites were produced using with different nano-TiO 2 (TiO 2 ) content (1, 3, and 5 (wt%)). Physical, mechanical, thermal, water-vapor permeability (WVP) properties and UV transmittance were investigated. Our results showed that the increasing TiO 2 content increased the hydrophobicity of starch/TiO 2 films. WVP of the bio-nanocomposites was reduced, simultaneously. With increasing TiO 2 content, tensile strength and Young's modulus of the film specimens were reduced while elongation at break and tensile energy to break were increased. The thermal properties of specimens showed that glass transition temperature of the films increased but melting point of the specimen films was decreased by increasing TiO 2 content. Scanning electron microscopy observations demonstrated, the most of films' physical properties were in relation to their microstructures. The starch/TiO 2 nanocomposites effectively protect goods against UV light, and could potentially be applied as UV-shielding packaging materials. Copyright © 2016 Elsevier B.V. All rights reserved.

Advancements in meat packaging.

PubMed

McMillin, Kenneth W

2017-10-01

Packaging of meat provides the same or similar benefits for raw chilled and processed meats as other types of food packaging. Although air-permeable packaging is most prevalent for raw chilled red meat, vacuum and modified atmosphere packaging offer longer shelf life. The major advancements in meat packaging have been in the widely used plastic polymers while biobased materials and their integration into composite packaging are receiving much attention for functionality and sustainability. At this time, active and intelligent packaging are not widely used for antioxidant, antimicrobial, and other functions to stabilize and enhance meat properties although many options are being developed and investigated. The advances being made in nanotechnology will be incorporated into food packaging and presumably into meat packaging when appropriate and useful. Intelligent packaging using sensors for transmission of desired information and prompting of subsequent changes in packaging materials, environments or the products to maintain safety and quality are still in developmental stages. Copyright © 2017 Elsevier Ltd. All rights reserved.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Anderson, James; Goins, Monty; Paul, Pran

This safety analysis report for packaging (SARP) presents the results of the safety analysis prepared in support of the Consolidated Nuclear Security, LLC (CNS) request for licensing of the Model ES-3100 package with bulk highly enriched uranium (HEU) contents and issuance of a Type B(U) Fissile Material Certificate of Compliance. This SARP, published in the format specified in the Nuclear Regulatory Commission (NRC) Regulatory Guide 7.9 and using information provided in UCID-21218 and NRC Regulatory Guide 7.10, demonstrates that the Y-12 National Security Complex (Y-12) ES-3100 package with bulk HEU contents meets the established NRC regulations for packaging, preparation formore » shipment, and transportation of radioactive materials given in Title 10, Part 71, of the Code of Federal Regulations (CFR) [10 CFR 71] as well as U.S. Department of Transportation (DOT) regulations for packaging and shipment of hazardous materials given in Title 49 CFR. To protect the health and safety of the public, shipments of adioactive materials are made in packaging that is designed, fabricated, assembled, tested, procured, used, maintained, and repaired in accordance with the provisions cited above. Safety requirements addressed by the regulations that must be met when transporting radioactive materials are containment of radioactive materials, radiation shielding, and assurance of nuclear subcriticality.« less

Nutrition. Learning Activity Package.

ERIC Educational Resources Information Center

Lee, Carolyn

This learning activity package on nutrition is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, a list of definitions, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics are…

Shock & Anaphylactic Shock. Learning Activity Package.

ERIC Educational Resources Information Center

Hime, Kirsten

This learning activity package on shock and anaphylactic shock is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics are…

Evaluation of select blends of cotton byproducts in the manufacture of biodegradable packaging material

USDA-ARS?s Scientific Manuscript database

Polystyrene is one of the most widely used plastics in the manufacture of packaging materials. Extruded polystyrene foam is commonly sold under the trademark name of StyrofoamTM. Polystyrene packaging is a multibillion dollar a year industry. Since polystyrene is non-biodegradable, a biodegradable m...

Oral Hygiene. Learning Activity Package.

ERIC Educational Resources Information Center

Hime, Kirsten

This learning activity package on oral hygiene is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, a list of definitions, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics…

Grooming. Learning Activity Package.

ERIC Educational Resources Information Center

Stark, Pamela

This learning activity package on grooming for health workers is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics are…

49 CFR 173.154 - Exceptions for Class 8 (corrosive materials).

Code of Federal Regulations, 2012 CFR

2012-10-01

... solids, packed in a strong outer packaging. (2) For corrosive materials in Packing Group III, inner... capacity each for solids, packed in a strong outer packaging. (c) Consumer commodities. Until December 31... other requirements of this subchapter when transported by motor vehicle or rail car in a packaging...

49 CFR 173.62 - Specific packaging requirements for explosives.

Code of Federal Regulations, 2011 CFR

2011-10-01

... article or material carried in the vehicle; and (ii) The assembled gun packed on the vehicle may not... HAZARDOUS MATERIALS SAFETY ADMINISTRATION, DEPARTMENT OF TRANSPORTATION HAZARDOUS MATERIALS REGULATIONS... kg in small packages as specified by the Associate Administrator for Hazardous Materials Safety 110(a...

49 CFR 173.62 - Specific packaging requirements for explosives.

Code of Federal Regulations, 2012 CFR

2012-10-01

... article or material carried in the vehicle; and (ii) The assembled gun packed on the vehicle may not... HAZARDOUS MATERIALS SAFETY ADMINISTRATION, DEPARTMENT OF TRANSPORTATION HAZARDOUS MATERIALS REGULATIONS... packages as specified by the Associate Administrator for Hazardous Materials Safety 110(a) Bags Bags Drums...

49 CFR 173.424 - Excepted packages for radioactive instruments and articles.

Code of Federal Regulations, 2011 CFR

2011-10-01

... HAZARDOUS MATERIALS SAFETY ADMINISTRATION, DEPARTMENT OF TRANSPORTATION HAZARDOUS MATERIALS REGULATIONS SHIPPERS-GENERAL REQUIREMENTS FOR SHIPMENTS AND PACKAGINGS Class 7 (Radioactive) Materials § 173.424....1 mSv/hour (10 mrem/hour); (e) The active material is completely enclosed by non-active components...

49 CFR 173.424 - Excepted packages for radioactive instruments and articles.

Code of Federal Regulations, 2010 CFR

2010-10-01

... HAZARDOUS MATERIALS SAFETY ADMINISTRATION, DEPARTMENT OF TRANSPORTATION HAZARDOUS MATERIALS REGULATIONS SHIPPERS-GENERAL REQUIREMENTS FOR SHIPMENTS AND PACKAGINGS Class 7 (Radioactive) Materials § 173.424....1 mSv/hour (10 mrem/hour); (e) The active material is completely enclosed by non-active components...

Measurements of True Leak Rates of MEMS Packages

PubMed Central

Han, Bongtae

2012-01-01

Gas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages. In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion). In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing. PMID:22736994

Prediction of drug-packaging interactions via molecular dynamics (MD) simulations.

PubMed

Feenstra, Peter; Brunsteiner, Michael; Khinast, Johannes

2012-07-15

The interaction between packaging materials and drug products is an important issue for the pharmaceutical industry, since during manufacturing, processing and storage a drug product is continuously exposed to various packaging materials. The experimental investigation of a great variety of different packaging material-drug product combinations in terms of efficacy and safety can be a costly and time-consuming task. In our work we used molecular dynamics (MD) simulations in order to evaluate the applicability of such methods to pre-screening of the packaging material-solute compatibility. The solvation free energy and the free energy of adsorption of diverse solute/solvent/solid systems were estimated. The results of our simulations agree with experimental values previously published in the literature, which indicates that the methods in question can be used to semi-quantitatively reproduce the solid-liquid interactions of the investigated systems. Copyright © 2012 Elsevier B.V. All rights reserved.

Electronic structure and linear optical properties of ZnSe and ZnSe:Mn.

PubMed

Su, Kang; Wang, Yuhua

2010-03-01

As an important wide band-gap II-VI semiconductor, ZnSe has attracted much attention for its various applications in photo-electronic devices such as blue light-emitting diodes and blue-green diode lasers. Mn-doped ZnSe is an excellent quantum dot material. The electronic structures of the sphalerite ZnSe and ZnSe:Mn were calculated using the Vienna ab initio Simulation Package with ultra-soft pseudo potentials and Material Studio. The calculated equilibrium lattice constants agree well with the experimental values. Using the optimized equilibrium lattice constants, the densities of states and energy band structures were further calculated. By analyzing the partial densities of states, the contributions of different electron states in different atoms were estimated. The p states of Zn mostly contribute to the top of the valence band, and the s states of Zn and the s states of Se have major effects on the bottom of the conduction band. The calculated results of ZnSe:Mn show the band gap was changed from 2.48 to 1.1 eV. The calculated linear optical properties, such as refractive index and absorption spectrum, are in good agreement with experimental values.

Application of GA package in functional packaging

NASA Astrophysics Data System (ADS)

Belousova, D. A.; Noskova, E. E.; Kapulin, D. V.

2018-05-01

The approach to application program for the task of configuration of the elements of the commutation circuit for design of the radio-electronic equipment on the basis of the genetic algorithm is offered. The efficiency of the used approach for commutation circuits with different characteristics for computer-aided design on radio-electronic manufacturing is shown. The prototype of the computer-aided design subsystem on the basis of a package GA for R with a set of the general functions for optimization of multivariate models is programmed.

Development and testing of the Junkeeper Control Corporation integrated programmable electronic controller and hydronics package

NASA Technical Reports Server (NTRS)

Hankins, J. D.

1979-01-01

Additional developmental work on the existing programmable electronic controller and hydronic package for use with solar heating and cooling systems is summarized. The controller/hydronics subsystems passed all acceptance tests and performance criteria. The subsystems were shown marketable for public use.

Japan's electronic packaging technologies

NASA Technical Reports Server (NTRS)

Tummala, Rao R.; Pecht, Michael

1995-01-01

The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

Flexible Foam Protection Materials for Portable Life Support System Packaging Study

NASA Technical Reports Server (NTRS)

Tang,Henry H.; Dillon, Paul A.; Thomas, Gretchen A.

2009-01-01

This paper discusses the phase I effort in evaluating and selecting a light weight impact protection material for the Constellation Space Suit Element (CSSE) Portable Life Support System (PLSS) conceptual packaging study. A light weight material capable of holding and protecting the components inside the PLSS is required to demonstrate the viability of the flexible PLSS packaging concept. The material needs to distribute, dissipate, and absorb the impact energy of the PLSS falling on the lunar surface. It must also be robust to consistently perform over several Extravehicular Activity (EVA) missions in the extreme lunar thermal vacuum environment. This paper documents the performance requirements for selecting a foam protection material, and the methodologies for evaluating some commercial off-the-shelf (COTS) foam material candidates. It also presents the mechanical properties and impact drop tests results of the foam material candidates. The results of this study suggest that a foam based flexible protection system is a viable solution for PLSS packaging. However, additional works are needed to optimize COTS foam or to develop a composite foam system that will meet all the performance requirements for the CSSE PLSS flexible packaging.

Response of CO2 laser written long period fiber gratings packaged by polymer materials

NASA Astrophysics Data System (ADS)

Wu, Zhaodi; Liu, Yunqi; Zou, Jian; Chen, Na; Pang, Fufei; Wang, Tingyun

2011-12-01

We demonstrate the packaging of CO2 laser written long-period fiber gratings (LPFGs) using different polymer materials. We use three different silicone rubber polymers to package the LPFGs by simply coating it outside the grating. After the polymer coating, the resonance wavelength of LPFG was found to shift towards shorter wavelength by about 6 nm, and the temperature sensitivity of the packaged gratings was studied experimentally. Experiments showed that the gratings packaged by different polymers have different temperature characteristics and all of them have good thermal stability.

Packaging - Materials review

DOE Office of Scientific and Technical Information (OSTI.GOV)

Herrmann, Matthias

2014-06-16

Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in manymore » shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device, valve, etc.), chemical inertness, cost issues, and others. Finally, proper cell design has to be considered for effective thermal management (i.e. cooling and heating) of battery packs.« less

Identification of suspected hazardous chemical contaminants in recycled pastry packaging.

PubMed

Ahmadkhaniha, Reza; Rastkari, Noushin

2017-01-01

The safe use of recycled paper and cardboard material for food packaging applications is     an important area of investigation. Therefore, the aim of this study was to determine which hazardous chemi- cal pollutants were found in paper and cardboard samples used for pastry packaging, and to measure the migration of pollutants over time into the pastries. In this study, the presence of some organic pollutants in common confectionery packaging, and the effects of storage time and type of pastry on pollutant migration, were investigated. The results of the study indicate that harmful compounds such as benzophenone, pentachlorophenol, bis(2-ethylhexyl) phthalate and dibutyl phthalate are present at high concentrations in most recycled boxes used for pastry packaging. Since the migration of some of the hazardous compounds from the packaging materials into the pastries under normal conditions was indicated, it is recommended that the procedure for preparing pastry packaging materials should be reconsidered and improved.

Assessment of Proper Bonding Methods and Mechanical Characterization FPGA CQFPs

NASA Technical Reports Server (NTRS)

Davis, Milton C.

2008-01-01

This presentation discusses fractured leads on field-programmable gate array (FPGA) during flight vibration. Actions taken to determine root cause and resolution of the failure include finite element analysis (FEA) and vibration testing and scanning electron microscopy (with X-ray microanalysis) and energy dispersive spectrometry (SEM/EDS) failure assessment. Bonding methods for surface mount parts is assessed, including critical analysis and assessment of random fatigue damage. Regarding ceramic quad flat pack (CQFP) lead fracture, after disassembling the attitude control electronics (ACE) configuration, photographs showed six leads cracked on FPGA RTSX72SU-1 CQ208B package located on the RWIC card. An identical package (FPGA RTSX32SU-1 CQ208B) mounted on the RWIC did not results in cracked pins due to vibration. FPGA lead failure theories include workmanship issues in the lead-forming, material defect in the leads of the FPGA packages, and the insecure mounting of the board in the card guides, among other theories. Studies were conducted using simple calculations to determine the response and fatigue life of the package. Shorter packages exhibited more response when loaded by out-of-plane displacement of PCB while taller packages exhibit more response when loaded by in-plane acceleration of PCB. Additionally, under-fill did not contribute to reducing stress in leads due to out-of-plane PCB loading or from component twisting, as much as corner bonding. The combination of corner bond and under-fill is best to address mechanical and thermal S/C environment. Test results of bonded parts showed reduced (dampened) amplitude and slightly shifted peaks at the un-bonded natural frequency and an additional response at the bonded frequency. Stress due to PCBB out-of-plane loading was decreased on in the corners when only a corner bond was used. Future work may address CQFP fatigue assessment, including the investigation of discrepancy in predicted fatigue damage, as well as comparing fatigue life and fatigue damage cycle ration computed using FEA and Miner's rule to results from a fatigue assessment software program.

Safety analysis report -- Packages LP-50 tritium package (Packaging of fissile and other radioactive materials)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Gates, A.A.; McCarthy, P.G.; Edl, J.W.

1975-05-01

Elemental tritium is shipped at low pressure in a stainless steel container (LP-50) surrounded by an aluminum vessel and Celotex insulation at least 4 in. thick in a steel drum. Each package contains a large quantity (greater than a Type A quantity) of nonfissile material, as defined in AECM 0529. This report provides the details of the safety analysis performed for this type container.

Green Composites Made of Bamboo Fabric and Poly (Lactic) Acid for Packaging Applications—A Review

PubMed Central

Nurul Fazita, M.R.; Jayaraman, Krishnan; Bhattacharyya, Debes; Mohamad Haafiz, M.K.; Saurabh, Chaturbhuj K.; Hussin, M. Hazwan; H.P.S., Abdul Khalil

2016-01-01

Petroleum based thermoplastics are widely used in a range of applications, particularly in packaging. However, their usage has resulted in soaring pollutant emissions. Thus, researchers have been driven to seek environmentally friendly alternative packaging materials which are recyclable as well as biodegradable. Due to the excellent mechanical properties of natural fibres, they have been extensively used to reinforce biopolymers to produce biodegradable composites. A detailed understanding of the properties of such composite materials is vital for assessing their applicability to various products. The present review discusses several functional properties related to packaging applications in order to explore the potential of bamboo fibre fabric-poly (lactic) acid composites for packaging applications. Physical properties, heat deflection temperature, impact resistance, recyclability and biodegradability are important functional properties of packaging materials. In this review, we will also comprehensively discuss the chronological events and applications of natural fibre biopolymer composites. PMID:28773558

Assembling surface mounted components on ink-jet printed double sided paper circuit board.

PubMed

Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

2014-03-07

Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

The R package 'RLumModel': Simulating charge transfer in quartz

NASA Astrophysics Data System (ADS)

Friedrich, Johannes; Kreutzer, Sebastian; Schmidt, Christoph

2017-04-01

Kinetic models of quartz luminescence have gained an important role for predicting experimental results and for understanding charge transfers in (natural) quartz as well as for other dosimetric materials, e.g., Al2O3:C. We present the R package 'RLumModel', offering an easy-to-use tool for simulating quartz luminescence signals (TL, OSL, LM-OSL and RF) based on five integrated and published parameter sets as well as the possibility to use own parameters. Simulation commands can be created (a) using the Risø Sequence Editor, (b) a built-in SAR sequence generator or (c) self-explanatory keywords for customised sequences. Results can be analysed seamlessly using the R package 'Luminescence' along with a visualisation of concentrations of electrons and holes in every trap/centre as well as in the valence and conduction band during all stages of the simulation. Modelling luminescence signals can help understanding charge transfer processes occurring in nature or during measurements in the laboratory. This will lead to a better understanding of several processes concerning geoscientific questions, because quartz is the second most abundant mineral in the Earth's continental crust.

Dielectric Performance of a High Purity HTCC Alumina at High Temperatures - a Comparison Study with Other Polycrystalline Alumina

NASA Technical Reports Server (NTRS)

Chen, Liangyu

2014-01-01

A very high purity (99.99+%) high temperature co-fired ceramic (HTCC) alumina has recently become commercially available. The raw material of this HTCC alumina is very different from conventional HTCC alumina, and more importantly there is no glass additive in this alumina material for co-firing processing. Previously, selected HTCC and LTCC (low temperature co-fired ceramic) alumina materials were evaluated at high temperatures as dielectric and compared to a regularly sintered 96% polycrystalline alumina (96% Al2O3), where 96% alumina was used as the benchmark. A prototype packaging system based on regular 96% alumina with Au thickfilm metallization successfully facilitated long term testing of high temperature silicon carbide (SiC) electronic devices for over 10,000 hours at 500 C. In order to evaluate this new high purity HTCC alumina for possible high temperature packaging applications, the dielectric properties of this HTCC alumina substrate were measured and compared with those of 96% alumina and a previously tested LTCC alumina from room temperature to 550 C at frequencies of 120 Hz, 1 KHz, 10 KHz, 100 KHz, and 1 MHz. A parallel-plate capacitive device with dielectric of the HTCC alumina and precious metal electrodes were used for measurements of the dielectric constant and dielectric loss of the co-fired alumina material in the temperature and frequency ranges. The capacitance and AC parallel conductance of the capacitive device were directly measured by an AC impedance meter, and the dielectric constant and parallel AC conductivity of the dielectric were calculated from the capacitance and conductance measurement results. The temperature and frequency dependent dielectric constant, AC conductivity, and dissipation factor of the HTCC alumina substrate are presented and compared to those of 96% alumina and a selected LTCC alumina. Other technical advantages of this new co-fired material for possible high packaging applications are also discussed.

The LARSYS Educational Package: Instructor's Notes for Use with the Data 100

NASA Technical Reports Server (NTRS)

Lindenlaub, J. C.; Russell, J. D.

1977-01-01

The LARSYS Educational Package is a set of instructional materials developed to train people to analyze remotely sensed multispectral data using LARSYS, a computer software system. The materials included in this volume have been designed to assist LARSYS instructors as they guide students through the LARSYS Educational Package. All of the materials have been updated from the previous version to reflect the use of a Data 100 Remote Terminal.

SHIPMENT OF TWO DOE-STD-3013 CONTAINERS IN A 9977 TYPE B PACKAGE

DOE Office of Scientific and Technical Information (OSTI.GOV)

Abramczyk, G.; Bellamy, S.; Loftin, B.

2011-06-06

The 9977 is a certified Type B Packaging authorized to ship uranium and plutonium in metal and oxide forms. Historically, the standard container for these materials has been the DOE-STD-3013 which was specifically designed for the long term storage of plutonium bearing materials. The Department of Energy has used the 9975 Packaging containing a single 3013 container for the transportation and storage of these materials. In order to reduce container, shipping, and storage costs, the 9977 Packaging is being certified for transportation and storage of two 3013 containers. The challenges and risks of this content and the 9977s ability tomore » meet the Code of Federal Regulations for the transport of these materials are presented.« less

Silk-based resorbable electronic devices for remotely controlled therapy and in vivo infection abatement

PubMed Central

Tao, Hu; Hwang, Suk-Won; Marelli, Benedetto; An, Bo; Moreau, Jodie E.; Yang, Miaomiao; Brenckle, Mark A.; Kim, Stanley; Kaplan, David L.; Rogers, John A.; Omenetto, Fiorenzo G.

2014-01-01

A paradigm shift for implantable medical devices lies at the confluence between regenerative medicine, where materials remodel and integrate in the biological milieu, and technology, through the use of recently developed material platforms based on biomaterials and bioresorbable technologies such as optics and electronics. The union of materials and technology in this context enables a class of biomedical devices that can be optically or electronically functional and yet harmlessly degrade once their use is complete. We present here a fully degradable, remotely controlled, implantable therapeutic device operating in vivo to counter a Staphylococcus aureus infection that disappears once its function is complete. This class of device provides fully resorbable packaging and electronics that can be turned on remotely, after implantation, to provide the necessary thermal therapy or trigger drug delivery. Such externally controllable, resorbable devices not only obviate the need for secondary surgeries and retrieval, but also have extended utility as therapeutic devices that can be left behind at a surgical or suturing site, following intervention, and can be externally controlled to allow for infection management by either thermal treatment or by remote triggering of drug release when there is retardation of antibiotic diffusion, deep infections are present, or when systemic antibiotic treatment alone is insufficient due to the emergence of antibiotic-resistant strains. After completion of function, the device is safely resorbed into the body, within a programmable period. PMID:25422476

Silk-based resorbable electronic devices for remotely controlled therapy and in vivo infection abatement.

PubMed

Tao, Hu; Hwang, Suk-Won; Marelli, Benedetto; An, Bo; Moreau, Jodie E; Yang, Miaomiao; Brenckle, Mark A; Kim, Stanley; Kaplan, David L; Rogers, John A; Omenetto, Fiorenzo G

2014-12-09

A paradigm shift for implantable medical devices lies at the confluence between regenerative medicine, where materials remodel and integrate in the biological milieu, and technology, through the use of recently developed material platforms based on biomaterials and bioresorbable technologies such as optics and electronics. The union of materials and technology in this context enables a class of biomedical devices that can be optically or electronically functional and yet harmlessly degrade once their use is complete. We present here a fully degradable, remotely controlled, implantable therapeutic device operating in vivo to counter a Staphylococcus aureus infection that disappears once its function is complete. This class of device provides fully resorbable packaging and electronics that can be turned on remotely, after implantation, to provide the necessary thermal therapy or trigger drug delivery. Such externally controllable, resorbable devices not only obviate the need for secondary surgeries and retrieval, but also have extended utility as therapeutic devices that can be left behind at a surgical or suturing site, following intervention, and can be externally controlled to allow for infection management by either thermal treatment or by remote triggering of drug release when there is retardation of antibiotic diffusion, deep infections are present, or when systemic antibiotic treatment alone is insufficient due to the emergence of antibiotic-resistant strains. After completion of function, the device is safely resorbed into the body, within a programmable period.

49 CFR 178.350 - Specification 7A; general packaging, Type A.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false Specification 7A; general packaging, Type A. 178... FOR PACKAGINGS Specifications for Packagings for Class 7 (Radioactive) Materials § 178.350 Specification 7A; general packaging, Type A. (a) Each packaging must meet all applicable requirements of subpart...

Comparative Packaging Study

NASA Technical Reports Server (NTRS)

Perchonok, Michele H.; Oziomek, Thomas V.

2009-01-01

Future long duration manned space flights beyond low earth orbit will require the food system to remain safe, acceptable and nutritious. Development of high barrier food packaging will enable this requirement by preventing the ingress and egress of gases and moisture. New high barrier food packaging materials have been identified through a trade study. Practical application of this packaging material within a shelf life test will allow for better determination of whether this material will allow the food system to meet given requirements after the package has undergone processing. The reason to conduct shelf life testing, using a variety of packaging materials, stems from the need to preserve food used for mission durations of several years. Chemical reactions that take place during longer durations may decrease food quality to a point where crew physical or psychological well-being is compromised. This can result in a reduction or loss of mission success. The rate of chemical reactions, including oxidative rancidity and staling, can be controlled by limiting the reactants, reducing the amount of energy available to drive the reaction, and minimizing the amount of water available. Water not only acts as a media for microbial growth, but also as a reactant and means by which two reactants may come into contact with each other. The objective of this study is to evaluate three packaging materials for potential use in long duration space exploration missions.

Optimization of biomass blends in the manufacture of molded packaging materials produced using fungal mycelium

USDA-ARS?s Scientific Manuscript database

Polystyrene is one of the most widely used plastics and is commonly produced in three forms: 1) Extruded polystyrene – disposable utensils, CD/DVD cases, yogurt containers, smoke alarm housing, etc.; 2) Expanded polystyrene foam – molded packaging materials and packaging "peanuts"; 3) Extruded polys...

10 CFR 835.405 - Receipt of packages containing radioactive material.

Code of Federal Regulations, 2010 CFR

2010-01-01

... 10 Energy 4 2010-01-01 2010-01-01 false Receipt of packages containing radioactive material. 835.405 Section 835.405 Energy DEPARTMENT OF ENERGY OCCUPATIONAL RADIATION PROTECTION Monitoring of...) Measurements of the radiation levels, if the package contains a Type B quantity (as defined at 10 CFR 71.4) of...

10 CFR 835.405 - Receipt of packages containing radioactive material.

Code of Federal Regulations, 2011 CFR

2011-01-01

... 10 Energy 4 2011-01-01 2011-01-01 false Receipt of packages containing radioactive material. 835.405 Section 835.405 Energy DEPARTMENT OF ENERGY OCCUPATIONAL RADIATION PROTECTION Monitoring of...) Measurements of the radiation levels, if the package contains a Type B quantity (as defined at 10 CFR 71.4) of...

10 CFR 835.405 - Receipt of packages containing radioactive material.

Code of Federal Regulations, 2012 CFR

2012-01-01

... 10 Energy 4 2012-01-01 2012-01-01 false Receipt of packages containing radioactive material. 835.405 Section 835.405 Energy DEPARTMENT OF ENERGY OCCUPATIONAL RADIATION PROTECTION Monitoring of...) Measurements of the radiation levels, if the package contains a Type B quantity (as defined at 10 CFR 71.4) of...

10 CFR 835.405 - Receipt of packages containing radioactive material.

Code of Federal Regulations, 2013 CFR

2013-01-01

... 10 Energy 4 2013-01-01 2013-01-01 false Receipt of packages containing radioactive material. 835.405 Section 835.405 Energy DEPARTMENT OF ENERGY OCCUPATIONAL RADIATION PROTECTION Monitoring of...) Measurements of the radiation levels, if the package contains a Type B quantity (as defined at 10 CFR 71.4) of...

10 CFR 835.405 - Receipt of packages containing radioactive material.

Code of Federal Regulations, 2014 CFR

2014-01-01

... 10 Energy 4 2014-01-01 2014-01-01 false Receipt of packages containing radioactive material. 835.405 Section 835.405 Energy DEPARTMENT OF ENERGY OCCUPATIONAL RADIATION PROTECTION Monitoring of...) Measurements of the radiation levels, if the package contains a Type B quantity (as defined at 10 CFR 71.4) of...

The Surgical Scrub. Learning Activity Package.

ERIC Educational Resources Information Center

Runge, Lillian

This learning activity package on the surgical scrub is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, a list of definitions, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These…

Tool for use in lifting pin supported objects

NASA Technical Reports Server (NTRS)

Marzek, R. A.; Read, W. S. (Inventor)

1974-01-01

A tool for use in lifting a pin-supported, electronic package mounted in juxtaposition with the surface of an electronic circuit board is described. The tool is configured to be received beneath a pin-supported package and is characterized by a manually operable linkage, including an elongated, rigid link is supported for axial reciprocation and a pivotal link pinned to the body and supported for oscillation induced in response to axial motion imparted to the rigid link. A lifting plate is pivotally coupled to the distal end of the pivotal link so that oscillatory motion imparted to the pivotal link serves to move the plate vertically for elevating the plate into lifting engagement with the electronic package positioned thereabove.

(abstract) Electronic Packaging for Microspacecraft Applications

NASA Technical Reports Server (NTRS)

Wasler, David

1993-01-01

The intent of this presentation is to give a brief look into the future of electronic packaging for microspacecraft applications. Advancements in electronic packaging technology areas have developed to the point where a system engineer's visions, concepts, and requirements for a microspacecraft can now be a reality. These new developments are ideal candidates for microspacecraft applications. These technologies are capable of bringing about major changes in how we design future spacecraft while taking advantage of the benefits due to size, weight, power, performance, reliability , and cost. This presentation will also cover some advantages and limitations of surface mount technology (SMT), multichip modules (MCM), and wafer scale integration (WSI), and what is needed to implement these technologies into microspacecraft.