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Sample records for passivated aluminum interconnect

  1. Grain orientation mapping of passivated aluminum interconnect wires with X-ray micro-diffraction

    SciTech Connect

    MacDowell, A.A.; Padmore, H.A.; Thompson, A.C.; Chang, C.H.; Patel, J.R. |

    1998-06-01

    A micro x-ray diffraction facility is under development at the Advanced Light source. Spot sizes are typically about 1-{micro}m size generated by means of grazing incidence Kirkpatrick-Baez focusing mirrors. Photon energy is either white of energy range 6--14 keV or monochromatic generated from a pair of channel cut crystals. A Laue diffraction pattern from a single grain in passivated 2-{micro}m wide bamboo structured Aluminum interconnect line has been recorded. Acquisition times are of the order of a few seconds. The Laue pattern has allowed the determination of the crystallographic orientation of individual grains along the line length. The experimental and analysis procedures used are described, as is a grain orientation result. The future direction of this program is discussed in the context of strain measurements in the area of electromigration.

  2. Grain orientation mapping of passivated aluminum interconnect lines by x-ray micro-diffraction

    SciTech Connect

    Chang, C.H.; MacDowell, A.A.; Padmore, H.A.; Patel, J.R.; Patel, J.R. Thompson, A.C.

    1998-11-01

    A micro x-ray diffraction facility is under development at the Advanced Light Source. Spot sizes are typically about 1-{mu}m size generated by means of grazing incidence Kirkpatrick-Baez focusing mirrors. Photon energy is either white of energy range 6{endash}14 keV or monochromatic generated from a pair of channel cut crystals. Laue diffraction pattern from a single grain in a passivated 2-{mu}m wide bamboo structured Aluminum interconnect line has been recorded. Acquisition times are of the order of seconds. The Laue pattern has allowed the determination of the crystallographic orientation of individual grains along the line length. The experimental and analysis procedure used is described, as is the latest grain orientation result. The impact of x-ray micro-diffraction and its possible future direction are discussed in the context of other developments in the area of electromigration, and other technological problems. {copyright} {ital 1998 American Institute of Physics.}

  3. Grain orientation mapping of passivated aluminum interconnect lines with X-ray micro-diffraction

    SciTech Connect

    Chang, C.H.; Patel, J.R. |; MacDowell, A.A.; Padmore, H.A.; Thompson, A.C.

    1998-09-01

    A micro x-ray diffraction facility is under development at the Advanced Light Source. Spot sizes are typically about 1-{micro}m size generated by means of grazing incidence Kirkpatrick-Baez focusing mirrors. Photon energy is either white of energy range 6--14 keV or monochromatic generated from a pair of channel cut crystals. Laue diffraction pattern from a single grain in a passivated 2-{micro}m wide bamboo structured Aluminum interconnect line has been recorded. Acquisition times are of the order of seconds. The Laue pattern has allowed the determination of the crystallographic orientation of individual grains along the line length. The experimental and analysis procedure used is described, as is the latest grain orientation result. The impact of x-ray micro-diffraction and its possible future direction are discussed in the context of other developments in the area of electromigration, and other technological problems.

  4. Grain orientation mapping of passivated aluminum interconnect lines by x-ray micro-diffraction

    SciTech Connect

    Chang, C. H.; Patel, J. R.; Thompson, A. C.

    1998-11-24

    A micro x-ray diffraction facility is under development at the Advanced Light Source. Spot sizes are typically about 1-{mu}m size generated by means of grazing incidence Kirkpatrick-Baez focusing mirrors. Photon energy is either white of energy range 6-14 keV or monochromatic generated from a pair of channel cut crystals. Laue diffraction pattern from a single grain in a passivated 2-{mu}m wide bamboo structured Aluminum interconnect line has been recorded. Acquisition times are of the order of seconds. The Laue pattern has allowed the determination of the crystallographic orientation of individual grains along the line length. The experimental and analysis procedure used is described, as is the latest grain orientation result. The impact of x-ray micro-diffraction and its possible future direction are discussed in the context of other developments in the area of electromigration, and other technological problems.

  5. On interconnected systems, passivity and some generalisations

    NASA Astrophysics Data System (ADS)

    Ordóñez-Hurtado, Rodrigo H.; Griggs, Wynita M.; Shorten, Robert N.

    2013-12-01

    A sufficient condition for the stability of large-scale interconnections of N linear time-variant systems is presented. Such a condition represents important extensions to passivity criteria and ensures stability by means of the existence of a positive definite (full-block) matrix P which is a common solution to Lyapunov equations involving a diagonal stacking of the N systems and the interconnection structure matrix. An experimental methodology for the verification of the sufficient condition also is proposed, based on evolutionary computation techniques. Applications of the new stability results are provided through illustrative examples, which are developed using particle swarm optimisation and genetic algorithms.

  6. Hermetic aluminum radio frequency interconnection and method for making

    DOEpatents

    Kilgo, Riley D.; Kovacic, Larry; Brow, Richard K.

    2000-01-01

    The present invention provides a light-weight, hermetic coaxial radio-frequency (RF) interconnection having an electrically conductive outer housing made of aluminum or an aluminum alloy, a central electrical conductor made of ferrous or non-ferrous material, and a cylinder of dielectric material comprising a low-melting-temperature, high-thermal-expansion aluminophosphate glass composition for hermetically sealing between the aluminum-alloy outer housing and the ferrous or non-ferrous center conductor. The entire RF interconnection assembly is made permanently hermetic by thermally fusing the center conductor, glass, and housing concurrently by bringing the glass to the melt point by way of exposure to an atmospheric temperature sufficient to melt the glass, less than 540.degree. C., but that does not melt the center conductor or the outer aluminum or aluminum alloy housing. The composition of the glass used is controlled to provide a suitable low dielectric constant so that an appropriate electrical characteristic impedance, for example 50 ohms, can be achieved for an electrical interconnection that performs well at high radio frequencies and also provides an interconnection maintaining a relatively small physical size.

  7. Hydrogenation of passivated aluminum with hydrogen fluid

    NASA Astrophysics Data System (ADS)

    Saitoh, H.; Machida, A.; Katayama, Y.; Aoki, K.

    2009-04-01

    Hydrogenation conditions of passivated aluminum were examined in a pressure and temperature range of 6-10 GPa and 300-800 °C, respectively. The relationship between the hydrogenation reaction yields and holding time was analyzed by Johnson-Mehl-Avrami equation. An Avrami exponent n of 0.3 indicated that the reaction decreased with time due to the low diffusivity of hydrogen in AlH3. The oxide layer on passivated aluminum seemed to be partly removed or modified by pressure-temperature treatment above 6 GPa and 600 °C in hydrogen fluid. The hydrogenation pressure of 9 GPa for the passivated aluminum was reduced to 6 GPa.

  8. Asymptotic Stability of Interconnected Passive Non-Linear Systems

    NASA Technical Reports Server (NTRS)

    Isidori, A.; Joshi, S. M.; Kelkar, A. G.

    1999-01-01

    This paper addresses the problem of stabilization of a class of internally passive non-linear time-invariant dynamic systems. A class of non-linear marginally strictly passive (MSP) systems is defined, which is less restrictive than input-strictly passive systems. It is shown that the interconnection of a non-linear passive system and a non-linear MSP system is globally asymptotically stable. The result generalizes and weakens the conditions of the passivity theorem, which requires one of the systems to be input-strictly passive. In the case of linear time-invariant systems, it is shown that the MSP property is equivalent to the marginally strictly positive real (MSPR) property, which is much simpler to check.

  9. Stress-induced voiding in aluminum and copper interconnects

    NASA Astrophysics Data System (ADS)

    Hommel, M.; Fischer, A. H.; Glasow, A. v.; Zitzelsberger, A. E.

    2002-04-01

    Stress-induced voiding (SIV) is a serious reliability problem in metal interconnects. For aluminum a phenomenological model was developed which allows the extrapolation of metallization life times from stress conditions to operation conditions of the integrated circuit. Resistance drift measurements during high-temperature storage (HTS) on wafer-level have been performed and the experimental data could be fitted with that model. The influences of different parameters such as line width, metal level, thermal anneals of certain metal levels during processing and the deposition temperature of the interlevel dielectric material on the SIV behavior are discussed. The SIV behavior of copper dual damascene metallizations has been investigated on via line structures. A linear resistance drift during high-temperature storage has been observed. This is in contrast to aluminum, where a non-linear behavior was found. Failure analysis showed voids inside the via and not in the metal line as it has been observed in aluminum. Stress simulations have been performed in order to explain this behavior. Due to the complex stress state in a copper dual damascene via the temperature dependence of SIV in copper is different from that of aluminum.

  10. Strain measurements in aluminum interconnects by x-ray microdiffraction

    NASA Astrophysics Data System (ADS)

    Hwang, Keith J.

    2000-10-01

    Reliability of metal interconnects in integrated circuits is a major concern to the microelectronics industry. Understanding the impact of stress and strain in metal lines is crucial for improving their reliability. Because of thermal expansion mismatches between the interconnect, substrate, and passivation material, high tensile stresses are developed during processing. In addition, stress gradients develop due to electromigration because of the high current densities passing through the lines. X-ray diffraction is an ideal technique for directly measuring these stresses. However, most of the earlier measurements were performed using millimeter size x-ray beams, allowing only macroscopic determinations of stress. Spatially resolved measurements of stresses in interconnects were not possible. A synchrotron-based white beam x-ray microdiffraction technique was developed and applied for localized strain mapping on polycrystalline thin film interconnects. The system was shown to achieve micron-scale spatial resolution and strain sensitivities on the order of 2 x 10-4. Two methods for performing in-situ calibration of the detector angles utilizing the (001) silicon substrate were presented: the energy method and the interplanar angle method. Various (hkl) reflections were measured from the (001) silicon substrate and the displacement of the x-ray beam was determined. Although discrepancies arose between these methods, both proved satisfactory to correct the Al (hkl) d-spacing measurements. Thermal and electromigration-induced hydrostatic stress distributions in a 2.6 mum wide passivated A1 line were investigated. The Al line exhibited thermal stress behavior consistent with confinement by the silicon/silicon dioxide interface. The electromigration-induced stress evolution indicated the presence of bamboo grains acting as blocking boundaries.

  11. Chemical-mechanical planarization of aluminum and copper interconnects with magnetic liners

    NASA Astrophysics Data System (ADS)

    Wang, Bin

    2000-10-01

    Chemical Mechanical Planarization (CMP) has been employed to achieve Damascene patterning of aluminum and copper interconnects with unique magnetic liners. A one-step process was developed for each interconnect scheme, using a double-layered pad with mesh cells, pores, and perforations on a top hard layer. In a hydrogen peroxide-based slurry, aluminum CMP was a process of periodic removal and formation of a surface oxide layer. Cu CMP in the same slurry, however, was found to be a dissolution dominant process. In a potassium iodate-based slurry, copper removal was the result of two competing reactions: copper dissolution and a non-native surface layer formation. Guided by electrochemistry, slurries were developed to remove nickel in different regimes of the corrosion kinetics diagram. Nickel CMP in a ferric sulfate-based slurry resulted in periodic removal and formation of a passive surface layer. In a potassium permanganate-based slurry, nickel removal is a dissolution dominant process. Visible Al(Cu) surface damages obtained with copper-doped aluminum could be eliminated by understanding the interactions between the substrate, the pad, and the abrasive agglomerate. Increasing substrate hardness by annealing prior to CMP led to a surface finish free of visible scratches. A similar result was also obtained by preventing formation of abrasive agglomerates and minimizing their contact with the substrate.

  12. Electromigration characterization of aluminum-copper alloy interconnects

    NASA Astrophysics Data System (ADS)

    Setlik, Brian Joseph

    Electromigration is the mass transport of atoms in a material due to elevated temperatures and an applied electric field. Electromigration-induced failure has increasingly become a reliability concern in the integrated circuit industry. As this process occurs material can be depleted resulting in void formation and an accumulation can result in hillock formation. When modeling electromigration in interconnects Black's Law is utilized to model a mean time to failure as a function of current density and temperature with additional parameters such as a current exponent, n, and an activation energy, Ea. Using this equation to extrapolate interconnect lifetimes from accelerated testing conditions to normal operating conditions requires the determination of n and Ea. It will be shown that the choice of failure criterion when performing accelerated electrical testing does have an effect on the error associated with the parameters determined for use in Black's Law. In addition, a limit on the applied current density when using Black's Law will be examined. The addition of relatively small amounts of copper (1--2wt%) has repeatedly been shown to improve device lifetimes. Through the use of an SEM with EDS capabilities we have measured the copper concentration as a function of length for interconnects after several accelerated stress time periods. This has shown that a redistribution of copper takes place during the initial incubation stage of electromigration. In addition, the open circuit failure location on the stressed interconnects corresponds to locations of reduced copper concentration. A study of macroscopic, electromigration-induced damage has been performed using a standard optical microscope to measure the relative reflectance of an interconnect as a function of time during an accelerated test. A strong correlation has been observed between relative reflectance and resistance as a function of time.

  13. Enhanced active aluminum content and thermal behaviour of nano-aluminum particles passivated during synthesis using thermal plasma route

    NASA Astrophysics Data System (ADS)

    Mathe, Vikas L.; Varma, Vijay; Raut, Suyog; Nandi, Amiya Kumar; Pant, Arti; Prasanth, Hima; Pandey, R. K.; Bhoraskar, Sudha V.; Das, Asoka K.

    2016-04-01

    Here, we report synthesis and in situ passivation of aluminum nanoparticles using thermal plasma reactor. Both air and palmitc acid passivation was carried out during the synthesis in the thermal plasma reactor. The passivated nanoparticles have been characterized for their structural and morphological properties using X-ray diffraction (XRD) and transmission electron microscopy (TEM) techniques. In order to understand nature of passivation vibrational spectroscopic analysis have been carried out. The enhancement in active aluminum content and shelf life for a palmitic acid passivated nano-aluminum particles in comparison to the air passivated samples and commercially available nano Al powder (ALEX) has been observed. Thermo-gravimetric analysis was used to estimate active aluminum content of all the samples under investigation. In addition cerimetric back titration method was also used to estimate AAC and the shelf life of passivated aluminum particles. Structural, microstructural and thermogravomateric analysis of four year aged passivated sample also depicts effectiveness of palmitic acid passivation.

  14. Application of selective CVD tungsten for low contact resistance via filling to aluminum multilayer interconnection

    NASA Astrophysics Data System (ADS)

    Rang, S.; Chow, R.; Wilson, R. H.; Gorowitz, B.; Williams, A. G.

    1988-05-01

    Process parameters for selective chemical vapor deposition of tungsten to fill vias between aluminum or aluminum alloy multilevel metallization have been identified and demonstrated. By controlling two competing parallel reactions: Aluminum and hydrogen reductions of tungsten hexafluoride in one reduction step process, the specific contact resistivity was found to be in the range of 2.5 to 8.0 x 10-9 ohm-cm2 for 1.8 micron diameter vias. This is at least one order of magnitude lower than the values reported by the previous workers. It was also observed that alloying the aluminum did not appear to affect the contact resistance significantly. In this experiment one cold wall experimental reactor, two cold wall production systems of two different models and one hot wall tube furnace were used to deposit selective CVD tungsten on aluminum or aluminum with 1% silicon first level metal. As a consequence of these findings, problems associated with filling straight wall vias of high aspect ratio in VLSI multilevel interconnection (i.e., high contact resistance, poor step coverage, electromigration, etc.) can now be alleviated or resolved. Therefore, the use of selective CVD tungsten in the existing aluminum IC metallization becomes very attractive and feasible.

  15. Silicon-hybrid wafer-scale integration achieved with multilevel aluminum interconnects

    NASA Astrophysics Data System (ADS)

    Takahashi, Grant L.; Kolesar, Edward S.

    A silicon-hybrid wafer-scale integration (WSI) technique has been developed to interconnect complementary metal-oxide semiconductor (CMOS) circuits. Electrical performance tests and processing diagnostics reveal that the interconnect design is very promising. The wafer-scale integrated circuit was fabricated by mounting two CMOS integrated circuit dies into etched wells and then planarizing the surface of the silicon wafer substrate. Next the wafer's surface was coated with a photosensitive polyimide and patterned with vias to accommodate the interconnecting conductors. The CMOS dies were two-bit shift registers and were electrically interconnected with aluminum conductors using conventional silicon processing techniques. A diagnostic evaluation was accomplished to determine the electrical continuity of the conductors and via contacts. When compared to a complementary wire-bonded interconnect scheme, the silicon WSI technology was found to be the superior performer at 1-MHz operating frequencies. Discontinuous interconnects were evaluated, and the failures were identified to occur at the severe topographical steps encountered on the substrate wafer's surface.

  16. In situ x-ray microscopic observation of the electromigration in passivated Cu interconnects

    NASA Astrophysics Data System (ADS)

    Schneider, G.; Hambach, D.; Niemann, B.; Kaulich, B.; Susini, J.; Hoffmann, N.; Hasse, W.

    2001-03-01

    X-ray imaging of electromigration in a passivated Cu interconnect was performed with 100-nm spatial resolution. A time sequence of 200 images, recorded with the European Synchrotron Radiation Facility x-ray microscope in 2.2 h at 4 keV photon energy, visualizes the mass flow of Cu at current densities up to 2×107 A/cm2. Due to the high penetration power through matter and the element specific image contrast, x-ray microscopy is a unique tool for time-resolved, quantitative mass transport measurements in interconnects. Model calculations predict that failures in operating microprocessors are detectable with 30 nm resolution by nanotomography.

  17. Analysis of local strain in aluminum interconnects by convergent beam electron diffraction

    NASA Astrophysics Data System (ADS)

    Krämer, Stephan; Mayer, Joachim

    1999-11-01

    Energy filtered convergent beam electron diffraction (CBED) was used to investigate localized strain in aluminum interconnects. An analysis of the higher order Laue zone (HOLZ) line positions in CBED patterns makes it possible to measure the lattice strain with high accuracy (˜104) and high spatial resolution (10 to 100 nm). The strain development in a single grain was measured during thermal cycling between -170 °C and +100 °C. The grain showed reversible, elastic behavior over the whole temperature range building up large strains at low temperatures. By comparing with finite element simulations, a detailed understanding of the tri-axial strain state could be achieved.

  18. Planarization of metal films for multilevel interconnects

    SciTech Connect

    Tuckerman, D.B.

    1987-07-21

    This patent describes an electrical interconnection structure comprising aluminum or aluminum-silicon alloy layers separated by dielectric layers. Each aluminum or alloy layer has been planarized to form a flat surface by eliminating any oxide coating of the aluminum or alloy, forming a passivating and antireflection coating of silicon on the aluminum or alloy. Heating is applied to momentarily melt the layer to form a flat surface prior to the formation of an additional dielectric layer. The metal layers have been patterned after planarization according to a preselected pattern and interconnected through the dielectric layers.

  19. Thermal stability of copper silicide passivation layers in copper-based multilevel interconnects

    NASA Astrophysics Data System (ADS)

    Hymes, S.; Kumar, K. S.; Murarka, S. P.; Ding, P. J.; Wang, W.; Lanford, W. A.

    1998-04-01

    Copper thin films were exposed to a dilute silane mixture at temperatures in the range of 190-363 °C. The resulting silicide surface layers were characterized by four-point probe, Rutherford backscattering spectrometry, and x-ray diffraction. A definitive stability regime is observed in which progressively higher copper content phases exist with increasing temperature. Cu3Si, formed in silane, on annealing converts to Cu5Si and eventually to no silicide layer by a silicon diffusion reaction that in an inert ambient drives silicon into underlying copper to form a solid solution. In oxidizing ambients, a similar phenomenon occurs but now silicon also diffuses to surfaces where it oxidizes to form a self-passivating SiO2 layer on surface. These results have important implications governing integration of copper silicide as a passivation layer and silicon hydride based dielectric deposition in copper-based multilevel interconnect in ultralarge scale integration.

  20. CWDM based HDMI interconnect incorporating passively aligned POF linked optical subassembly modules

    NASA Astrophysics Data System (ADS)

    Lee, Hak-Soon; Lee, Sang-Shin; Son, Yung-Sung

    2011-08-01

    A four-channel transmitter OSA (TOSA) and a receiver optical sub-assembly (ROSA) module were presented. They take advantage of a coarse WDM (CWDM) scheme, employing two types of VCSELs at 780 and 850 nm, where no wavelength filters are involved in the TOSA. The ROSA and TOSA were constructed through a fully passive alignment process using components produced by virtue of a cost effective plastic injection molding technique. In order to build a high quality optical HDMI interconnect, four channel optical links between these modules ware established via two graded-index plastic optical fibers (GI-POFs). The HDMI interconnect was thoroughly evaluated in terms of the alignment tolerance, the light beam propagation, and the data transmission capability. For the ROSA, the measured tolerance, as affected by the photodiode alignment, was ~45 μm and over 200 μm for the transverse and longitudinal directions, respectively. For the TOSA, the tolerance, which is mostly dependent upon the VCSEL alignment, was ~20 μm and more than 200 μm for the transverse and longitudinal directions, respectively. The beam profiles for the TOSA and ROSA were monitored to confirm their feasibility from the optical coupling perspective. A digital signal at 2.5 Gb/s was efficiently transmitted through the HDMI interconnect with a bit error ratio of below 10-16. A 1080p HDMI signal from a Blu-ray player was delivered through the interconnect to an LCD monitor and successfully displayed a high quality video.

  1. Hybridization of active and passive elements for planar photonic components and interconnects

    NASA Astrophysics Data System (ADS)

    Pearson, M.; Bidnyk, S.; Balakrishnan, A.

    2007-02-01

    The deployment of Passive Optical Networks (PON) for Fiber-to-the-Home (FTTH) applications currently represents the fastest growing sector of the telecommunication industry. Traditionally, FTTH transceivers have been manufactured using commodity bulk optics subcomponents, such as thin film filters (TFFs), micro-optic collimating lenses, TO-packaged lasers, and photodetectors. Assembling these subcomponents into a single housing requires active alignment and labor-intensive techniques. Today, the majority of cost reducing strategies using bulk subcomponents has been implemented making future reductions in the price of manufacturing FTTH transceivers unlikely. Future success of large scale deployments of FTTH depends on further cost reductions of transceivers. Realizing the necessity of a radically new packaging approach for assembly of photonic components and interconnects, we designed a novel way of hybridizing active and passive elements into a planar lightwave circuit (PLC) platform. In our approach, all the filtering components were monolithically integrated into the chip using advancements in planar reflective gratings. Subsequently, active components were passively hybridized with the chip using fully-automated high-capacity flip-chip bonders. In this approach, the assembly of the transceiver package required no active alignment and was readily suitable for large-scale production. This paper describes the monolithic integration of filters and hybridization of active components in both silica-on-silicon and silicon-on-insulator PLCs.

  2. Influence of Aluminum Passivation on the Reaction Mechanism: Flame Propagation Studies

    DTIC Science & Technology

    2009-01-01

    Combustion, Aluminum Particles, Passivation of Aluminum Particles, AI synthesis techniques 17. SECURITY CLASSIFICATION 118. SECURITY CLASSIFICATION 119...shell. The type of Al without an alumina passivation shell was further prepared using two different synthesis techniques. Physical property information...prepared from catalytic decomposition of AlH3 *N(Me)Pyr and desig- nated as (Al-C13F27)cd; and the second was prepared from triethylaluminum

  3. The parylene-aluminum multilayer interconnection system for wafer scale integration and wafer scale hybrid packaging

    NASA Astrophysics Data System (ADS)

    Majid, N.; Dabral, S.; McDonald, J. F.

    1989-03-01

    Polyimides have been considered as interlayer dielectrics for wafer scale integration (WSI) and wafer scale hybrid packaging (WSHP). However, high temperature curing steps for polyimide lead to large stresses in polyimide films. This is due to differing thermal expansion coefficients of the metal conductor, insulator and substrate materials causing yield and reliability problems. Polyimides also require the use of solvents, and tend to outgas during subsequent processing. They tend to absorb moisture with resulting degradation of dielectric constants. Also, the spin on method used to apply and planarize polyimide layers exhibits nonuniformity of thickness on large wafers. In this paper we examine parylene (Poly-p-xylylene) and some of its derivatives as possible interlayer dielectrics due to some of their attractive features. Parylene has a low dielectric constant. It can be vapor deposited at low temperatures and in vacuum. It is also highly resistant to corrosion and is a clear, transparent material with possible use for optical interconnections. This paper studies the reactive ion etching properties for polyimides and parylenes in an oxygen containing plasma under identical conditions. The etching rates of the parylenes and polyimides have been compared. The surface properties of these polymers are examined. Further, the film growth properties of aluminum deposited on the etched surfaces using the ionized cluster beam are investigated.

  4. Grain orientation measurement of passivated aluminum interconnectsby x-ray micro diffraction

    SciTech Connect

    Chang, Chang-Hwan; Valek, B.C.; Padmore,H.A.; MacDowell, A.A.; Celestre, R.; Marieb, T.; Bravman, J.C.; Koo, Y.M.; Patel, J.R.

    1999-07-01

    The crystallographic orientations of individual grains in apassivated aluminum interconnect line of 0.7-mu m width were investigatedby using an incidentwhite x-ray microbeam at the Advanced Light Source,Berkeley National Laboratory. Intergrain orientation mapping was obtainedwith about 0.05o sensitivity by the micro Laue diffractiontechnique.

  5. Passive hybrid technique for the vibration mitigation of systems of interconnected stays

    NASA Astrophysics Data System (ADS)

    Caracoglia, Luca; Jones, Nicholas P.

    2007-11-01

    The problem of stay oscillation mitigation in cable-stayed bridges, usually induced by wind or wind and rain, may require the introduction of passive devices, such as dampers on individual stays or the use of transverse restrainers (cross-ties). The damper performance is often affected by the geometrical constraints of the bridge deck that limit the installation of such devices to locations very close to the end of the cable. On the other hand, cross-ties are generally incapable of direct energy dissipation. Therefore, the authors have proposed and analyzed a hybrid passive system in which the advantages of both techniques are applied to the oscillation mitigation of complex interconnected systems with multiple external dampers at the deck level, in correspondence with the cross-tie lines. This paper summarizes the relevant findings of a research program involving the authors' efforts focused on the in-plane free-vibration analysis of stay-cable systems. This research is also based upon some recent results associated with the analytical solution of a taut-cable with two attached viscous dampers. These findings are initially extended to a simplified network with reduced number of connectors and one damper, for which the derivation of analytical solution is still possible. Subsequently, an existing multistay multidamped arrangement on a real bridge is considered, in which a fully numerical approach is required. The modal behavior is compared to the simplified examples, also enabling the interpretation of the results in the context of more general guidelines for potential future application.

  6. Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders

    NASA Astrophysics Data System (ADS)

    Ogura, Hiroshi; Maruyama, Minoru; Matsubayashi, Ryo; Ogawa, Tetsuya; Nakamura, Shigeyoshi; Komatsu, Teruo; Nagasawa, Hiroshi; Ichimura, Akio; Isoda, Seiji

    2010-08-01

    Lead-free silver nanoparticle pastes have been tested as a replacement for high temperature lead-rich solders used in electronic manufacturing. The pastes contain a small amount of solvent, and primarily consist of submicron-silver powder and passivated silver nanoparticles. The nanoparticles were synthesized from Ag2CO3 and a long-chain alcohol by a method that produced a passivating layer consisting almost exclusively of the carboxylate of the reactant alcohol. The pastes were used to connect a silicon diode chip to copper bases without applied pressure when sintered at 350°C under nitrogen. Diode packages made with sintered silver interconnects had electrical and thermal properties equal to those with lead-soldered interconnects, even after 3000 thermal cycles between -55°C and +150°C. The mechanical strength was half that of lead-rich solder joints, but still strong enough for practical use.

  7. Silicon diffusion in aluminum for rear passivated solar cells

    SciTech Connect

    Urrejola, Elias; Peter, Kristian; Plagwitz, Heiko; Schubert, Gunnar

    2011-04-11

    We show that the lateral spread of silicon in a screen-printed aluminum layer increases by (1.50{+-}0.06) {mu}m/ deg. C, when increasing the peak firing temperature within an industrially applicable range. In this way, the maximum spread limit of diffused silicon in aluminum is predictable and does not depend on the contact area size but on the firing temperature. Therefore, the geometry of the rear side pattern can influence not only series resistance losses within the solar cell but the process of contact formation itself. In addition, too fast cooling lead to Kirkendall void formations instead of an eutectic layer.

  8. Passivation of SiC device surfaces by aluminum oxide

    NASA Astrophysics Data System (ADS)

    Hallén, A.; Usman, M.; Suvanam, S.; Henkel, C.; Martin, D.; Linnarsson, M. K.

    2014-03-01

    A steady improvement in material quality and process technology has made electronic silicon carbide devices commercially available. Both rectifying and switched devices can today be purchased from several vendors. This successful SiC development over the last 25 years can also be utilized for other types of devices, such as light emitting and photovoltaic devices, however, there are still critical problems related to material properties and reliability that need to be addressed. This contribution will focus on surface passivation of SiC devices. This issue is of utmost importance for further development of SiC MOSFETs, which so far has been limited by reliability and low charge carrier surface mobilities. Also bipolar devices, such as BJTs, LEDs, or PV devices will benefit from more efficient and reliable surface passivation techniques in order to maintain long charge carrier lifetimes. Silicon carbide material enables the devices to operate at higher electric fields, higher temperatures and in more radiation dense applications than silicon devices. To be able to utilize the full potential of the SiC material, it is therefore necessary to develop passivation layers that can sustain these more demanding operation conditions. In this presentation it will also be shown that passivation layers of Al2O3 deposited by atomic layer deposition have shown superior radiation hardness properties compared to traditional SiO2-based passivation layers.

  9. Polymer Gelatin Waveguide In Conjuction With Integrated Holographic Optical Elements On GaAs, LiNb03, Glass, And Aluminum Substrates For Optical Interconnects, Signal Processing, And Computing

    NASA Astrophysics Data System (ADS)

    Chen, Ray T.

    1990-02-01

    We have observed waveguiding in thin films of polymer gelatin on GaAs, LiNb03, glass and aluminum substrates. A graded index profile can be induced in the gelatin layer and tuned by wet processing. This makes it possible to form waveguides on any smooth surface. Locally sensitizing the gelatin waveguide with ammonium dichromate allows us to integrate single and multiplexed gratings on the same substrate to perform various functions for optical interconnects and signal processing. A waveguide grating coupler that converts free space TEM00 laser light to a two dimensional spherical guided wave with 50° angle of divergence has also demonstrated. A passive broadcasting network can be formed using this new technology. Further plausible applications such as WD(D)M local area network, optical interconnection, and optical computing are also presented.

  10. Characterization of laser transferred contact through aluminum oxide passivation layer

    NASA Astrophysics Data System (ADS)

    Urabe, Shunsuke; Irikawa, Junpei; Konagai, Makoto; Miyajima, Shinsuke

    2015-08-01

    The point contact structure of the rear side of crystalline silicon solar cells is used to realize high passivation quality and good electrical contact. A conversion efficiency of 19.8% was achieved on the passivated emitter and rear cell (PERC) structure with a widegap heterojunction emitter. In this solar cell, laser-fired contact (LFC) process is used to make the point contacts. In the LFC process, laser irradiation damage to the surface of crystalline silicon was found to be the big issues for higher passivation quality. We investigated laser-transferred contact (LTC) process as a new contacts formation process. The LTC samples showed higher effective minority carrier lifetime and good contact resistivity compared with the LFC samples.

  11. The use of 1,2-epoxyhexane as a passivating agent for core-shell aluminum nanoparticles with very high active aluminum content

    NASA Astrophysics Data System (ADS)

    Jelliss, Paul A.; Buckner, Steven W.; Chung, Stephen W.; Patel, Ashish; Guliants, Elena A.; Bunker, Christopher E.

    2013-09-01

    Aluminum nanoparticles synthesized by titanium (IV) isopropoxide-initiated decomposition of alane have been passivated and capped using oligomerization of 1,2-epoxyhexane. Preliminary synthetic protocols with this capping agent, where the nanoparticle formation reaction and passivation processes were both conducted at ambient temperatures, had resulted in nanoparticles that were highly unstable and that either oxidized rapidly upon exposure to air or were pyrophoric. Use of 1,2-epoxydodecane, on the other hand, had produced stable nanoparticles that were successfully characterized and reported. A modification of the procedure whereby the epoxyhexane passivation process is carried out at 85 °C for 30 min, has afforded surprisingly stable aluminum nanoparticles. Powder X-ray analysis and transmission electron microscopy reveal nanoparticle diameters on the order of 30 nm with 19 nm crystalline aluminum cores. The passivation process yields an extraordinarily high active aluminum (Al0) content of 83%, with degradation of the core to 52% active aluminum after 9 days exposure in a dry air chamber. Differential scanning calorimetry coupled with thermogravimetric analysis reveals distinct cap combustion and metal ignition exotherms, though they are not as well-defined as those found with their epoxydodecane-capped congener. With the additional observation of a metal melting endotherm, it is suggested that while carrying out the passivation process at an elevated temperature affords a higher degree of kinetic stabilization of the aluminum core, the passivation shell is inhomogeneous, possibly as a result of the polydisperse nature of the oligomerized epoxyhexane.

  12. On the method of interconnection and damping assignment passivity-based control for the stabilization of mechanical systems

    NASA Astrophysics Data System (ADS)

    Chang, Dong Eui

    2014-09-01

    Interconnection and damping assignment passivity-based control (IDA-PBC) is an excellent method to stabilize mechanical systems in the Hamiltonian formalism. In this paper, several improvements are made on the IDA-PBC method. The skew-symmetric interconnection submatrix in the conventional form of IDA-PBC is shown to have some redundancy for systems with the number of degrees of freedom greater than two, containing unnecessary components that do not contribute to the dynamics. To completely remove this redundancy, the use of quadratic gyroscopic forces is proposed in place of the skew-symmetric interconnection submatrix. Reduction of the number of matching partial differential equations in IDA-PBC and simplification of the structure of the matching partial differential equations are achieved by eliminating the gyroscopic force from the matching partial differential equations. In addition, easily verifiable criteria are provided for Lyapunov/exponential stabilizability by IDA-PBC for all linear controlled Hamiltonian systems with arbitrary degrees of underactuation and for all nonlinear controlled Hamiltonian systems with one degree of underactuation. A general design procedure for IDA-PBC is given and illustrated with examples. The duality of the new IDA-PBC method to the method of controlled Lagrangians is discussed. This paper renders the IDA-PBC method as powerful as the controlled Lagrangian method.

  13. Passivation of the surface of aluminum nanopowders by protective coatings of the different chemical origin

    NASA Astrophysics Data System (ADS)

    Kwon, Young-Soon; Gromov, Alexander A.; Strokova, Julia I.

    2007-04-01

    The results of investigation and analysis of electro-exploded aluminum nanopowders, whose surface were passivated with the following substances: liquids - nitrocellulose (NC), oleic acid (C 17H 33COOH) and stearic acid (C 17H 35COOH), suspended in kerosene and ethanol, fluoropolymer; solids - boron and nickel; gases - N 2, CO 2 and air (for a comparison) are discussed. The surface protection for the aluminum nanopowders by coatings of different chemical origins leads to the some advantages of the powders properties for an application in energetic systems, e.g. solid propellants and "green" propellants (Al-H 2O). Aluminum nanopowders with a protected surface showed the increased stability to oxidation in air during the storage period and higher reactivity by heating. The TEM-visual diagram of the formation and stabilization of the coatings on the particles has been proposed on the basis of experimental results. The kinetics of the interaction of aluminum nanopowders with air has been discussed. The recommendations concerning an efficiency of the protective "non-Al 2O 3" layers on aluminum nanoparticles were proposed.

  14. Passivation of aluminum nanoparticles by plasma-enhanced chemical vapor deposition for energetic nanomaterials.

    PubMed

    Shahravan, Anaram; Desai, Tapan; Matsoukas, Themis

    2014-05-28

    We have produced passivating coatings on 80-nm aluminum particles by plasma-enhanced chemical vapor deposition (PECVD). Three organic precursors--isopropyl alcohol, toluene, and perfluorodecalin--were used to fabricate thin films with thicknesses ranging from 5 nm to 30 nm. The coated samples and one untreated sample were exposed to 85% humidity at 25 °C for two months, and the active Al content was determined by thermogravimetric analysis (TGA) in the presence of oxygen. The results were compared with an uncoated sample stored in a glovebox under argon for the same period. We find that all three coatings provide protection against humidity, compared to the control, and their efficacy ranks in the following order: isopropyl alcohol < toluene < perfluorodecalin. This order also correlates with increasing water contact angle of the three solid coatings. The amount of heat released in the oxidation, measured by differential scanning calorimetry (DSC), was found to increase in the same order. Perfluorodecalin resulted in providing the best protection, and it produced the maximum enthalpy of combustion, ΔH = 4.65 kJ/g. This value is higher than that of uncoated aluminum stored in the glovebox, indicating that the coatings promote more complete oxidation of the core. Overall, we conclude that the plasma polymer coatings of this study are suitable passivating thin film for aluminum nanoparticles by providing protection against oxidation while facilitating the complete oxidation of the metallic core at elevated temperature.

  15. Surface passivation of aluminum alloy 6061 with gaseous trichlorosilane: A surface investigation

    NASA Astrophysics Data System (ADS)

    Ngongang, Rickielle; Marceau, Eric; Carrier, Xavier; Pradier, Claire-Marie; Methivier, Christophe; Blanc, Jean-Luc; Carre, Martine

    2014-02-01

    A molecular-scale investigation of the interaction at room temperature between gaseous trichlorosilane (HSiCl3), used as a passivating agent, and surfaces of aluminum alloy AA6061 in a polished or hydroxylated state is conducted. Atomic force microscopy (AFM) and scanning electron microscopy (SEM) provide information on the topography and morphology of AA6061 before and after hydroxylation and surface passivation, while surface chemistry has been investigated by Polarization Modulation Infrared Reflection-Absorption Spectroscopy (PM-IRRAS) and X-ray photoelectron spectroscopy (XPS). Oxidation and hydroxylation of the polished alloy surface in boiling water strongly modifies the roughness of the surface, with formation of platelets and needles of oxyhydroxide AlOOH. PM-IRRAS and XPS reveal that, upon adsorption, HSiCl3 dissociates and mainly forms HSiOHn(OAl)3-n, HSi(OSi)n(OAl)3-n and condensed HSiOx species, by reaction with sbnd OH groups from the AlOOH surface phase. The amount of deposited Si-containing species is larger on the rough surface of the hydroxylated alloy and this deposit is accompanied by a decrease of the amount of free sbnd OH groups evidenced by PM-IRRAS. These results can find applications in the field of functionalization of aluminum alloys. It is suggested that a homogeneous oxidation of the alloy surface prior to exposure to gaseous HSiCl3 may enhance the adsorption of the passivating agent.

  16. X-ray micro-beam study of reliability in aluminum-copper interconnect lines

    NASA Astrophysics Data System (ADS)

    Solak, Harun Hadi

    X-ray photoemission spectroscopy and x-ray diffraction are powerful techniques widely used in materials research. The advent of synchrotron radiation facilities as high brightness x-ray sources and recent advances in x-ray optics have extended these techniques to spatially resolved measurements with sub-micron resolution. We have used two such facilities to study two major reliability problems in integrated circuit interconnect technology: electromigration and mechanical stress induced problems. MAXIMUM at the Advanced Light Source (ALS) is a scanning photoemission microscope based on multilayer coated normal incidence optics. It acquires images of surfaces that map chosen spectral features from photoelectron emission spectra. In situ electromigration experiments were performed in the ultra high vacuum chamber of MAXIMUM on patterned Al-Cu lines. The results demonstrate a Cu rich surface precipitation, changes in Cu distribution as a result of the electromigration process and the detection of shallow voids under the surface oxide layer. The X-ray micro-beam facility at the Advanced Photon Source (APS) uses diffractive Fresnel Zone Plates to focus intense undulator light into a sub-micron size beam. Microdiffraction experiments were performed to map the stress distribution along patterned Al-Cu lines with a ˜1 μm resolution for the first time. Diffraction patterns from single grains were recorded on an x-ray CCD camera and techniques developed to analyze the two dimensional micro-diffraction data for strain-stress analysis. An increase of grain to grain and intra-grain stress variation was found after accelerated electromigration testing. Contrary to predictions, no long range variation of stress due to electromigration was observed. These observations demonstrate the usefulness and potential of x-ray micro-characterization techniques in the electronic materials area.

  17. Optical Interconnect

    NASA Astrophysics Data System (ADS)

    Gaburro, Zeno

    The progress of silicon electronic industry is based on scaling down the minimum feature size of integrated circuits. Speed, density and costs of devices improve with scaling, but unfortunately the performance of interconnect worsens, both in terms of speed and power consumption. This issue -- the ``interconnect bottleneck'' -- is envisioned as a critical showstopper of electronic industry in the near future. The physical reason behind the interconnect bottleneck is the resistive nature of metals. The introduction of copper in place of aluminum has temporarily improved the interconnect performance, but on the other hand in a few years a more disruptive solution will be required in order to keep the current pace of progress. Optical interconnect is an intriguing alternative to metallic wires, because light can travel in dielectrics, and even in vacuum. At present, optical technology in silicon is not mature for industrial implementation. For this very same reason, however, it is also rich of research opportunities with large potential payoff. The rationale of this chapter has been to trace a snapshot of the current interconnect limitations; to point out the basic differences between the electrical and optical interconnect from different perspectives, ranging from basic physics up to system layouts; and to give a flavor of suggested practical realization of optical solutions. Any of these goals would be too ambitious for a book chapter without a hopefully rich and up-to-date bibliography.

  18. Viewing Integrated-Circuit Interconnections By SEM

    NASA Technical Reports Server (NTRS)

    Lawton, Russel A.; Gauldin, Robert E.; Ruiz, Ronald P.

    1990-01-01

    Back-scattering of energetic electrons reveals hidden metal layers. Experiment shows that with suitable operating adjustments, scanning electron microscopy (SEM) used to look for defects in aluminum interconnections in integrated circuits. Enables monitoring, in situ, of changes in defects caused by changes in temperature. Gives truer picture of defects, as etching can change stress field of metal-and-passivation pattern, causing changes in defects.

  19. Viewing Integrated-Circuit Interconnections By SEM

    NASA Technical Reports Server (NTRS)

    Lawton, Russel A.; Gauldin, Robert E.; Ruiz, Ronald P.

    1990-01-01

    Back-scattering of energetic electrons reveals hidden metal layers. Experiment shows that with suitable operating adjustments, scanning electron microscopy (SEM) used to look for defects in aluminum interconnections in integrated circuits. Enables monitoring, in situ, of changes in defects caused by changes in temperature. Gives truer picture of defects, as etching can change stress field of metal-and-passivation pattern, causing changes in defects.

  20. Novel interconnect deposition technology

    NASA Astrophysics Data System (ADS)

    Speckman, D. M.; Wendt, J. P.

    1991-12-01

    A new series of experiments was initiated to improve current interconnect deposition technology for integrated circuits. Preliminary aluminum deposition experiments were carried out using trimethylamine(alane) as the precursor, and some mildly reflective, uniform aluminum films were successfully deposited on glass slides, suggesting that chemical vapor deposition (CVD) will be a practicable deposition technique for advanced integrated circuit interconnect films. CVD studies of aluminum and zirconium- and hafnium-diboride thin films are continuing.

  1. Grain orientation and strain measurements in sub-micron wide passivated individual aluminum test structures

    SciTech Connect

    Tamura, N.; Valek, B.C.; Spolenak, R.; MacDowell, A.A.; Celestre, R.S.; Padmore, H.A.; Brown, W.L.; Marieb, T.; Bravman, J.C.; Batterman, B.W.; Patel, J.R.

    2001-03-01

    An X-ray microdiffraction dedicated beamline, combining white and monochromatic beam capabilities, has been built at the Advanced Light Source. The purpose of this beamline is to address the myriad of problems in Materials Science and Physics that require submicron x-ray beams for structural characterization. Many such problems are found in the general area of thin films and nano-materials. For instance, the ability to characterize the orientation and strain state in individual grains of thin films allows us to measure structural changes at a very local level. These microstructural changes are influenced heavily by such parameters as deposition conditions and subsequent treatment. The accurate measurement of strain gradients at the micron and sub-micron level finds many applications ranging from the strain state under nano-indenters to gradients at crack tips. Undoubtedly many other applications will unfold in the future as we gain experience with the capabilities and limitations of this instrument. We have applied this technique to measure grain orientation and residual stress in single grains of pure Al interconnect lines and preliminary results on post-electromigration test experiments are presented. It is shown that measurements with this instrument can be used to resolve the complete stress tensor (6 components) in a submicron volume inside a single grain of Al under a passivation layer with an overall precision of about 20 MPa. The microstructure of passivated lines appears to be complex, with grains divided into identifiable subgrains and noticeable local variations of both tensile/compressive and shear stresses within single grains.

  2. Physical and electrical characteristics of Si/SiC quantum dot superlattice solar cells with passivation layer of aluminum oxide.

    PubMed

    Tsai, Yi-Chia; Li, Yiming; Samukawa, Seiji

    2017-10-04

    In this work, we numerically simulate the silicon (Si) / silicon carbide (SiC) quantum dot superlattice solar cell (SiC-QDSL) with aluminum oxide (Al2O3-QDSL) passivation. By exploiting the passivation layer of Al2O3, the high photocurrent and the conversion efficiency can be achieved without losing the effective bandgap. Based on the two-photon transition mechanism in an AM1.5 and a one sun illumination, the simulated short-circuit current (Jsc) of 4.77 mA/cm2 is very close to the experimentally measured 4.75 mA/cm2, which is higher than those of conventional SiC-QDSLs. Moreover, the efficiency fluctuation caused by the structural variation is less sensitive by using the passivation layer. A high conversion efficiency of 17.4% is thus estimated by adopting the QD's geometry used in the experiment; and, it can be further boosted by applying a hexagonal QD formation with an inter-dot spacing of 0.3 nm. © 2017 IOP Publishing Ltd.

  3. Excellent c-Si surface passivation by thermal atomic layer deposited aluminum oxide after industrial firing activation

    NASA Astrophysics Data System (ADS)

    Liao, B.; Stangl, R.; Ma, F.; Mueller, T.; Lin, F.; Aberle, A. G.; Bhatia, C. S.; Hoex, B.

    2013-09-01

    We demonstrate that by using a water (H2O)-based thermal atomic layer deposited (ALD) aluminum oxide (Al2O3) film, excellent surface passivation can be attained on planar low-resistivity silicon wafers. Effective carrier lifetime values of up to 12 ms and surface recombination velocities as low as 0.33 cm s-1 are achieved on float-zone wafers after a post-deposition thermal activation of the Al2O3 passivation layer. This post-deposition activation is achieved using an industrial high-temperature firing process which is commonly used for contact formation of standard screen-printed silicon solar cells. Neither a low-temperature post-deposition anneal nor a silicon nitride capping layer is required in this case. Deposition temperatures in the 100-400 °C range and peak firing temperatures of about 800 °C (set temperature) are investigated. Photoluminescence imaging shows that the surface passivation is laterally uniform. Corona charging and capacitance-voltage measurements reveal that the negative fixed charge density near the AlOx/c-Si interface increases from 1.4 × 1012 to 3.3 × 1012 cm-2 due to firing, while the midgap interface defect density reduces from 3.3 × 1011 to 0.8 × 1011 cm-2 eV-1. This work demonstrates that direct firing activation of thermal ALD Al2O3 is feasible, which could be beneficial for solar cell manufacturing.

  4. Aluminum and Other Coatings for the Passivation of Tritium Storage Vessels

    SciTech Connect

    Spencer, W.; Korinko, P.

    2016-11-16

    Using a highly sensitive residual gas analyzer, the off gassing of hydrogen, water, and hydrocarbons from surface treated storage vessels containing deuterium was measured. The experimental storage vessels were compared to a low off-gassing, electro-polished 304L canister. Alternative vessels were made out of aluminum, or were coatings on 304L steel. Coatings included powder pack aluminide, electro-plated aluminum, powder pack chromide, dense electro-plated chromium, copper plated, and copper plated with 25 and 50 percent nano-diamond. Vessels were loaded with low pressure deuterium to observe exchange with protium or hydrogen as observed with formation of HD and HDO. Off gas of D2O or possible CD4 was observed at mass 20. The main off gas in all of the studies was H2. The studies indicated that coatings required significant post coating treatment to reduce off gas and enhance the permeation barrier from gases likely added during the coating process. Dense packed aluminum coatings needed heating to drive off water. Electro-plated aluminum, chromium and copper coatings appeared to trap hydrogen from the plating process. Nano-diamond appeared to enhance the exchange rate with hydrogen off gas and its coating process trapped significant amounts of hydrogen. Aluminum caused more protium exchange than chromium treated surfaces. Aluminum coatings released more water but pure aluminum vessels released small amounts of hydrogen, little water, and generally performed well. Chromium coating had residual hydrogen that was difficult to totally outgas but otherwise gave low residuals for water and hydrocarbons. Our studies indicated that simple coating of as received 304L metal will not adequately block hydrogen. The base vessel needs to be carefully out gassed before applying a coating and the coating process will likely add additional hydrogen that must be removed. Initial simple bake out and leak checks up to 350° C for a few hours was found to be inadequate. All of the

  5. Surface passivation studies of aluminum gallium nitride/gallium nitride high electron mobility transistors

    NASA Astrophysics Data System (ADS)

    Meyer, David J.

    GaN based transistors have recently emerged as contenders for replacing existing Si and GaAs RF power devices. Wide bandgap group III-N materials exhibit the benefits of high electric field breakdown strength and high saturated carrier velocity, which allow for high power and high frequency device operation. While the theoretical advantages of the AlGaN/GaN high electron mobility transistor (HEMT) are beginning to be realized, technological development is still inhibited by critical problems such as RF dispersion and off-state leakage current. Electrical (pulsed and dc I-V, Hall Effect, and small signal RF) and materials (XPS, AES, FTIR, PL, and thin film stress measurements) characterization techniques were used to attain a comprehensive viewpoint of how the HEMT surface treatment and PECVD SiNx passivation procedure affects device characteristics. Based on experimental and modeling results, the potential mechanisms responsible for reducing device virtual gating and increasing isolation current were discussed. In general, the pulsed I-V performance of HEMTs can be improved by using one of several plasma treatments, such as C2F6, Cl 2, NH3, or O2, immediately prior to passivation. Isolation current degradation was found to be relatively independent of pre-passivation surface treatment, but instead showed five orders of magnitude variation when different SiNx passivation film types were used. Organic surface contamination that is present in as-processed, unpassivated devices was found to impede the mechanism by which SiNx deposition reduces virtual gating. XPS results show that surface treatments that reduce carbon concentration also lead to improved pulsed I-V performance after passivation. The passivation mechanism that reduces virtual gating is suspected to be related to chemical modification of the HEMT surface that reduces populations of electron trapping centers, or changes their characteristics. Several arguments support the hypothesis that oxygen could be

  6. Fully passive-alignment pluggable compact parallel optical interconnection modules based on a direct-butt-coupling structure for fiber-optic applications

    NASA Astrophysics Data System (ADS)

    Lim, Kwon-Seob; Park, Hyoung-Jun; Kang, Hyun Seo; Kim, Young Sun; Jang, Jae-Hyung

    2016-02-01

    A low-cost packaging method utilizing a fully passive optical alignment and surface-mounting method is demonstrated for pluggable compact and slim multichannel optical interconnection modules using a VCSEL/PIN-PD chip array. The modules are based on a nonplanar bent right-angle electrical signal path on a silicon platform and direct-butt-optical coupling without a bulky and expensive microlens array. The measured optical direct-butt-coupling efficiencies of each channel without any bulky optics are as high as 33% and 95% for the transmitter and receiver, respectively. Excellent lateral optical alignment tolerance of larger than 60 μm for both the transmitter and receiver module significantly reduces the manufacturing and material costs as well as the packaging time. The clear eye diagrams, extinction ratios higher than 8 dB at 10.3 Gbps for the transmitter module, and receiver sensitivity of better than -13.1 dBm at 10.3 Gbps and a bit error rate of 10-12 for all channels are demonstrated. Considering that the optical output power of the transmitter is greater than 0 dBm, the module has a sufficient power margin of about 13 dB for 10.3 Gbps operations for all channels.

  7. A Study of the Influence of Alloying Additions on the Passivity of Aluminum

    DTIC Science & Technology

    1992-03-01

    LIST OF FIGURES Figure Page No. 1 Pourbaix diagrams for a) Al and b) W (from Reference 32). 4 2 Pourbaix diagrams for a) Al and b) Ta (from Reference...non-neutral pH values is of special interest since the Pourbaix diagrams for W and Ta and th.a literature for stainless steels suggest that 0 it would...be possible to extend the passivity of Al outside the range of 4 to 9 through the nonequilibrium addition to these elements to Al. Pourbaix diagrams

  8. Interconnection Guidelines

    EPA Pesticide Factsheets

    The Interconnection Guidelines provide general guidance on the steps involved with connecting biogas recovery systems to the utility electrical power grid. Interconnection best practices including time and cost estimates are discussed.

  9. Atomic layer deposition of aluminum oxide films for carbon nanotube network transistor passivation.

    PubMed

    Grigoras, Kestutis; Zavodchikova, Marina Y; Nasibulin, Albert G; Kauppinen, Esko I; Ermolov, Vladimir; Franssila, Sami

    2011-10-01

    Ultra-thin (2-5 nm thick) aluminum oxide layers were grown on non-functionalized individual single walled carbon nanotubes (SWCNT) and their bundles by atomic layer deposition (ALD) technique in order to investigate the mechanism of the coating process. Transmission electron microscopy (TEM) was used to examine the uniformity and conformality of the coatings grown at different temperatures (80 degrees C or 220 degrees C) and with different precursors for oxidation (water and ozone). We found that bundles of SWCNTs were coated continuously, but at the same time, bare individual nanotubes remained uncoated. The successful coating of bundles was explained by the formation of interstitial pores between the individual SWCNTs constituting the bundle, where the precursor molecules can adhere, initiating the layer growth. Thicker alumina layers (20-35 nm thick) were used for the coating of bottom-gated SWCNT-network based field effect transistors (FETs). ALD layers, grown at different conditions, were found to influence the performance of the SWCNT-network FETs: low temperature ALD layers caused the ambipolarity of the channel and pronounced n-type conduction, whereas high temperature ALD processes resulted in hysteresis suppression in the transfer characteristics of the SWCNT transistors and preserved p-type conduction. Fixed charges in the ALD layer have been considered as the main factor influencing the conduction change of the SWCNT network based transistors.

  10. Interconnection and electromigration scaling theory

    NASA Astrophysics Data System (ADS)

    Gardner, Donald S.; Meindl, James D.; Saraswat, Krishna

    1986-12-01

    Interconnections will become the limit in performance and reliability at submicron dimensions. Long-distance interconnections are defined by models based on resistivity, and it is found that more than half of the interconnections will become categorized as such at 0.5 micrometers feature sizes. The resistivity of even less resistive materials, therefore, will become important. A model for analyzing the trends of material usage for interconnections and for projecting design rules is presented. Electromigration is the driving force away from the lowest resistivity silicon compatible material, namely aluminum. Replacements such as gold, however, have technological problems and the resistivity of refractory metals will be too high for a large fraction of the interconnections. Layered structures are one possible solution to the problems of electromigration.

  11. Surface passivation investigation on ultra-thin atomic layer deposited aluminum oxide layers for their potential application to form tunnel layer passivated contacts

    NASA Astrophysics Data System (ADS)

    Xin, Zheng; Ling, Zhi Peng; Nandakumar, Naomi; Kaur, Gurleen; Ke, Cangming; Liao, Baochen; Aberle, Armin G.; Stangl, Rolf

    2017-08-01

    The surface passivation performance of atomic layer deposited ultra-thin aluminium oxide layers with different thickness in the tunnel layer regime, i.e., ranging from one atomic cycle (∼0.13 nm) to 11 atomic cycles (∼1.5 nm) on n-type silicon wafers is studied. The effect of thickness and thermal activation on passivation performance is investigated with corona-voltage metrology to measure the interface defect density D it(E) and the total interface charge Q tot. Furthermore, the bonding configuration variation of the AlO x films under various post-deposition thermal activation conditions is analyzed by Fourier transform infrared spectroscopy. Additionally, poly(3,4-ethylenedioxythiophene) poly(styrene sulfonate) is used as capping layer on ultra-thin AlO x tunneling layers to further reduce the surface recombination current density to values as low as 42 fA/cm2. This work is a useful reference for using ultra-thin ALD AlO x layers as tunnel layers in order to form hole selective passivated contacts for silicon solar cells.

  12. Influencing Solvent Miscibility and Aqueous Stability of Oxide Passivated Aluminum Nanoparticles through Surface Functionalization with Acrylic Monomers (Preprint)

    DTIC Science & Technology

    2011-07-01

    coating should enhance the miscibility of the functionalized particles in  nonpolar  media by masking the  highly  polar  hydroxlated oxide surface.  To...XPS suggest that attachment of MPS and PAM monomers occurs through the formation of bonds directly to the passivated oxide surface upon reaction with...suggest that attachment of MPS and PAM  monomers occurs through the formation of  bonds  directly to the passivated oxide surface upon reaction  with

  13. Electrical interconnect

    SciTech Connect

    Frost, John S.; Brandt, Randolph J.; Hebert, Peter; Al Taher, Omar

    2015-10-06

    An interconnect includes a first set of connector pads, a second set of connector pads, and a continuous central portion. A first plurality of legs extends at a first angle from the continuous central portion. Each leg of the first plurality of legs is connected to a connector pad of a first set of connector pads. A second plurality of legs extends at a second angle from the continuous central portion. Each leg of the second plurality of legs is connected to a connector pad of the second set of connector pads. Gaps are defined between legs. The gaps enable movement of the first set of connector pads relative to the second set of connector pads.

  14. Preparation and characterization of aluminum oxide nanoparticles by laser ablation in liquid as passivating and anti-reflection coating for silicon photodiodes

    NASA Astrophysics Data System (ADS)

    Ismail, Raid A.; Zaidan, Shihab A.; Kadhim, Rafal M.

    2017-08-01

    In this study, we have prepared aluminum oxide (Al2O3 nanoparticles) NPs with size ranging from 50 to 90 nm by laser ablation of aluminum target in ethanol. The effect of laser fluence on the structural, morphological and optical properties of Al2O3 was demonstrated and discussed. X-ray diffraction XRD results confirm that the synthesized Al2O3 NPs are crystalline in nature. The sample prepared at 3.5 J/cm2/pulse exhibits single phase of γ-Al2O3, while the XRD patterns of the nanoparticles synthesized at 5.3 and 7.5 J/cm2/pulse show the co-existence of the α-Al2O3 and γ-Al2O3 phases. Nanostructured Al2O3 films have been used as anti-reflecting coating and surface passivation layer to improve the photoresponse characteristics of silicon photodiode. The experimental data showed that the optical energy gap decreases from 5.3 to 5 eV as the laser fluence increases from 3.5 to 7.3 J/cm2. The lowest optical reflectivity was found for silicon photodiode deposited with a single layer of Al2O3 prepared at 3.5 J/cm2/pulse. The effect of laser fluence on the refractive index and extinction coefficient of the nanostructured Al2O3 film was studied. The photosensitivity of the silicon photodiode increased from 0.4 to 1.4 AW-1 at 800 nm after depositing Al2O3 prepared at 3.5 J/cm2/pulse, followed by rapid thermal annealing at 400 °C for 60 s.

  15. Advanced Interconnect Development

    SciTech Connect

    Yang, Z.G.; Maupin, G.; Simner, S.; Singh, P.; Stevenson, J.; Xia, G.

    2005-01-27

    The objectives of this project are to develop cost-effective, optimized materials for intermediate temperature SOFC interconnect and interconnect/electrode interface applications and identify and understand degradation processes in interconnects and at their interfaces with electrodes.

  16. Interconnection networks

    DOEpatents

    Faber, V.; Moore, J.W.

    1988-06-20

    A network of interconnected processors is formed from a vertex symmetric graph selected from graphs GAMMA/sub d/(k) with degree d, diameter k, and (d + 1)exclamation/ (d /minus/ k + 1)exclamation processors for each d greater than or equal to k and GAMMA/sub d/(k, /minus/1) with degree d /minus/ 1, diameter k + 1, and (d + 1)exclamation/(d /minus/ k + 1)exclamation processors for each d greater than or equal to k greater than or equal to 4. Each processor has an address formed by one of the permutations from a predetermined sequence of letters chosen a selected number of letters at a time, and an extended address formed by appending to the address the remaining ones of the predetermined sequence of letters. A plurality of transmission channels is provided from each of the processors, where each processor has one less channel than the selected number of letters forming the sequence. Where a network GAMMA/sub d/(k, /minus/1) is provided, no processor has a channel connected to form an edge in a direction delta/sub 1/. Each of the channels has an identification number selected from the sequence of letters and connected from a first processor having a first extended address to a second processor having a second address formed from a second extended address defined by moving to the front of the first extended address the letter found in the position within the first extended address defined by the channel identification number. The second address is then formed by selecting the first elements of the second extended address corresponding to the selected number used to form the address permutations. 9 figs.

  17. Interconnected semiconductor devices

    DOEpatents

    Grimmer, Derrick P.; Paulson, Kenneth R.; Gilbert, James R.

    1990-10-23

    Semiconductor layer and conductive layer formed on a flexible substrate, divided into individual devices and interconnected with one another in series by interconnection layers and penetrating terminals.

  18. Electric Current Induced Thermomechanical Fatigue Testing of Interconnects

    NASA Astrophysics Data System (ADS)

    Keller, R. R.; Geiss, R. H.; Cheng, Y.-W.; Read, D. T.

    2005-09-01

    We demonstrate the use of electrical methods for evaluating the thermomechanical fatigue properties of patterned aluminum and copper interconnects on silicon-based substrates. Through a careful selection of alternating current frequency and current density, we used controlled Joule heating to simulate in an accelerated manner the type of low frequency thermal stress cycles that an interconnect structure may undergo. Sources of such stressing may include power cycling, energy-saving modes, or application-specific fluctuations, as opposed to stressing at chip operating frequencies. The thermal stresses are caused by differences in thermal expansion properties between the metal and constraining substrate or passivation. Test conditions included a frequency of 100 Hz and current density of 11 - 16 MA/cm2, which led to a cyclic temperature amplitude of approximately 100 K, and corresponding cyclic stress amplitude in excess of 100 MPa for Al-1Si and Cu lines on oxidized silicon. The failure mechanism differs from that observed in direct current electromigration studies, and involves formation of localized plasticity, which causes topography changes on the less-constrained surfaces of the interconnect. Open circuit eventually took place by melting at a region of severely reduced cross-sectional area. In these studies, both Al-1Si and Cu responded to power cycling by deforming in a manner that was highly dependent upon variations in grain size and orientation. Isolated patches of damage appeared early within the confines of individual grains or clusters of grains, as determined by automated electron backscatter diffraction. With increased cycling or with increased current density, the extent of damage became more severe and widespread. We discuss the utility of electrical methods for accelerated testing of mechanical reliability.

  19. Printed Module Interconnects

    SciTech Connect

    Stockert, Talysa R.; Fields, Jeremy D.; Pach, Gregory F.; Mauger, Scott A.; van Hest, Maikel F. A. M.

    2015-06-14

    Monolithic interconnects in photovoltaic modules connect adjacent cells in series, and are typically formed sequentially involving multiple deposition and scribing steps. Interconnect widths of 500 um every 10 mm result in 5% dead area, which does not contribute to power generation in an interconnected solar panel. This work expands on previous work that introduced an alternative interconnection method capable of producing interconnect widths less than 100 um. The interconnect is added to the module in a single step after deposition of the photovoltaic stack, eliminating the need for scribe alignment. This alternative method can be used for all types of thin film photovoltaic modules. Voltage addition with copper-indium-gallium-diselenide (CIGS) solar cells using a 2-scribe printed interconnect approach is demonstrated. Additionally, interconnect widths of 250 um are shown.

  20. Silicon hybrid wafer scale integration interconnect performance evaluation at RF frequencies

    NASA Astrophysics Data System (ADS)

    Lyke, James C., Jr.; Kolesar, Edward S., Jr.

    The RF electrical characteristics of hybrid wafer scale integration (WSI) interconnections on silicon-polyimide-aluminum and silicon-benzocyclobutene-aluminum substrates have been evaluated. The silicon wafer substrates were five in in diameter, and each contained an identical set of 200 photolithographically patterned dielectric and aluminum interconnect test structures. The aluminum conductors were 2.5-microns thick, and half of the test structure conductors were 10-microns wide, while the remainder were 25-microns wide. Measurements between 5 kHz and 220 MHz confirmed the expected transmission line behavior manifested by the longer interconnections. The coupling levels in the 400 line/cm density structures are low, but nevertheless significant, especially when digital logic applications requiring low-noise margins are anticipated. More important were the attenuation effects manifested by the longer aluminum interconnections when they were combined with low-impedence matched terminations.

  1. Design solutions for the solar cell interconnect fatigue fracture problem

    NASA Technical Reports Server (NTRS)

    Mon, G. R.; Ross, R. G., Jr.

    1982-01-01

    Mechanical fatigue of solar cell interconnects is a major failure mechanism in photovoltaic arrays. A comprehensive approach to the reliability design of interconnects, together with extensive design data for the fatigue properties of copper interconnects, has been published. This paper extends the previous work, developing failure prediction (fatigue) data for additional interconnect material choices, including aluminum and a variety of copper-Invar and copper-steel claddings. An improved global fatigue function is used to model the probability-of-failure statistics of each material as a function of level and number of cycles of applied strain. Life-cycle economic analyses are used to evaluate the relative merits of each material choce. The copper-Invar clad composites demonstrate superior performance over pure copper. Aluminum results are disappointing.

  2. Perforation patterned electrical interconnects

    DOEpatents

    Frey, Jonathan

    2014-01-28

    This disclosure describes systems and methods for increasing the usable surface area of electrical contacts within a device, such as a thin film solid state device, through the implementation of electrically conductive interconnects. Embodiments described herein include the use of a plurality of electrically conductive interconnects that penetrate through a top contact layer, through one or more multiple layers, and into a bottom contact layer. The plurality of conductive interconnects may form horizontal and vertical cross-sectional patterns. The use of lasers to form the plurality of electrically conductive interconnects from reflowed layer material further aids in the manufacturing process of a device.

  3. Alignability of Optical Interconnects

    NASA Astrophysics Data System (ADS)

    Beech, Russell Scott

    With the continuing drive towards higher speed, density, and functionality in electronics, electrical interconnects become inadequate. Due to optics' high speed and bandwidth, freedom from capacitive loading effects, and freedom from crosstalk, optical interconnects can meet more stringent interconnect requirements. But, an optical interconnect requires additional components, such as an optical source and detector, lenses, holographic elements, etc. Fabrication and assembly of an optical interconnect requires precise alignment of these components. The successful development and deployment of optical interconnects depend on how easily the interconnect components can be aligned and/or how tolerant the interconnect is to misalignments. In this thesis, a method of quantitatively specifying the relative difficulty of properly aligning an optical interconnect is described. Ways of using this theory of alignment to obtain design and packaging guidelines for optical interconnects are examined. The measure of the ease with which an optical interconnect can be aligned, called the alignability, uses the efficiency of power transfer as a measure of alignment quality. The alignability is related to interconnect package design through the overall cost measure, which depends upon various physical parameters of the interconnect, such as the cost of the components and the time required for fabrication and alignment. Through a mutual dependence on detector size, the relationship between an interconnect's alignability and its bandwidth, signal-to-noise ratio, and bit-error -rate is examined. The results indicate that a range of device sizes exists for which given performance threshold values are satisfied. Next, the alignability of integrated planar-optic backplanes is analyzed in detail. The resulting data show that the alignability can be optimized by varying the substrate thickness or the angle of reflection. By including the effects of crosstalk, in a multi-channel backplane, the

  4. Heterogeneous 3D IC Stacking Using Ultra-Dense Mechanically Flexible Interconnects

    DTIC Science & Technology

    2016-03-31

    presents gold passivated dense NiW mechanically flexible interconnects (MFIs) for advanced 3D heterogeneous IC integration. The MFIs are fabricated...Mechanically flexible interconnect mold patterning G. Mechanically flexible interconnect electroplating and releasing H. Electroless gold plating...sequence leaving free-standing MFIs. Finally, the MFIs on the test chip are passivated by electroless gold plating. Fig. 3 shows SEM images of high

  5. Solar cell array interconnects

    DOEpatents

    Carey, Paul G.; Thompson, Jesse B.; Colella, Nicolas J.; Williams, Kenneth A.

    1995-01-01

    Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.

  6. Solar cell array interconnects

    DOEpatents

    Carey, P.G.; Thompson, J.B.; Colella, N.J.; Williams, K.A.

    1995-11-14

    Electrical interconnects are disclosed for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value. 4 figs.

  7. Electrical and optical interconnects for aeronautical systems

    NASA Astrophysics Data System (ADS)

    Nicole, Pierre

    1990-12-01

    In response to the increasing problems due to the interconnects of electronic systems on different geometrical scales, a study is presented of the possibilities offered by guided or free space optical transmissions. Emphasis is placed upon the consequences of increasing numbers of electronic systems in aeronautical equipment. Several promising solutions are suggested. Finally, a review of the technologies and techniques under study points to the areas where concerted efforts should be made in the field of passive and active components of electrical systems.

  8. Micro-fluidic interconnect

    DOEpatents

    Okandan, Murat; Galambos, Paul C.; Benavides, Gilbert L.; Hetherington, Dale L.

    2006-02-28

    An apparatus for simultaneously aligning and interconnecting microfluidic ports is presented. Such interconnections are required to utilize microfluidic devices fabricated in Micro-Electromechanical-Systems (MEMS) technologies, that have multiple fluidic access ports (e.g. 100 micron diameter) within a small footprint, (e.g. 3 mm.times.6 mm). Fanout of the small ports of a microfluidic device to a larger diameter (e.g. 500 microns) facilitates packaging and interconnection of the microfluidic device to printed wiring boards, electronics packages, fluidic manifolds etc.

  9. Thermal stability of interconnected a-Si:H solar modules

    NASA Astrophysics Data System (ADS)

    Willing, F.; Bennett, M.; Newton, J.

    Interconnected solar modules with cell structures of glass/transparent-conducting-oxide (TCO)/piNa-Si/aluminum were heat-treated at a series of elevated temperatures in order to accelerate two degradation modes: interdiffusion at the aluminum/a-Si back contact, and conductivity loss at the aluminum/TCO contacts which serve as connections between individual cells in a module. Plots of device lifetime vs. 1/T extrapolated to normal operating temperatures showed that neither degradation mode would significantly effect module stability over the projected lifetime of the device.

  10. LTCC interconnects in microsystems

    NASA Astrophysics Data System (ADS)

    Rusu, Cristina; Persson, Katrin; Ottosson, Britta; Billger, Dag

    2006-06-01

    Different microelectromechanical system (MEMS) packaging strategies towards high packaging density of MEMS devices and lower expenditure exist both in the market and in research. For example, electrical interconnections and low stress wafer level packaging are essential for improving device performance. Hybrid integration of low temperature co-fired ceramics (LTCC) with Si can be a way for an easier packaging system with integrated electrical interconnection, and as well towards lower costs. Our research on LTCC-Si integration is reported in this paper.

  11. Zee electrical interconnect

    NASA Technical Reports Server (NTRS)

    Rust, Thomas M. (Inventor); Gaddy, Edward M. (Inventor); Herriage, Michael J. (Inventor); Patterson, Robert E. (Inventor); Partin, Richard D. (Inventor)

    2001-01-01

    An interconnect, having some length, that reliably connects two conductors separated by the length of the interconnect when the connection is made but in which one length if unstressed would change relative to the other in operation. The interconnect comprises a base element an intermediate element and a top element. Each element is rectangular and formed of a conducting material and has opposed ends. The elements are arranged in a generally Z-shape with the base element having one end adapted to be connected to one conductor. The top element has one end adapted to be connected to another conductor and the intermediate element has its ends disposed against the other end of the base and the top element. Brazes mechanically and electrically interconnect the intermediate element to the base and the top elements proximate the corresponding ends of the elements. When the respective ends of the base and the top elements are connected to the conductors, an electrical connection is formed therebetween, and when the conductors are relatively moved or the interconnect elements change length the elements accommodate the changes and the associated compression and tension forces in such a way that the interconnect does not mechanically fatigue.

  12. Large Scale Interconnections Using Dynamic Gratings

    NASA Astrophysics Data System (ADS)

    Pauliat, Gilles; Roosen, Gerald

    1987-01-01

    Optics is attractive for interconnects because the possibility of crossing without any interaction multiple light beams. A crossbar network can be achieved using holographic elements which permit to connect independently all inputs and all outputs. The incorporation of dynamic holographic materials is enticing as this will render the interconnection changeable. However, it is necessary to find first a passive method permitting to achieve beam deflection and secondly a photosensitive material of high optical quality requiring low power levels to optically induce the refractive index changes. We first describe an optical method allowing to produce very large deflections of light beams thus enabling to randomly address any spot on a plane. Such a technique appears applicable to both interconnections of VLSI chips and random access of optical memories. Our scheme for realizing dynamic optical interconnects is based on Bragg diffraction of the beam to steer by a dynamic phase grating which spacing and orientation are changeable in real time. This is achieved in a passive way by acting on the optical frequency of the control beams used to record the dynamic grating. Deflection angles of 15° have been experimentally demonstrated for a 27 nm shift in the control wavelength. For a larger wavelength scanning (50 nm), 28° deflections are anticipated while maintaining the Bragg condition satisfied. We then discuss some issues related to photosensitive materials able to dynamically record the optically induced refractive index change. The specific example of Bi12 Si 020 or Bi12 Ge 020 photorefractive crystals is presented. Indeed these materials are very attractive as they require low driving energy and exhibit a memory effect. This latter property permits to achieve numerous iterations between computing cells before reconfiguration of the interconnect network.

  13. Electromigration of damascene copper of IC interconnect

    NASA Astrophysics Data System (ADS)

    Meyer, William Kevin

    Copper metallization patterned with multi-level damascene process is prone to electromigration failure, which affects the reliability and performance of IC interconnect. In typical products, interconnect that is not already constrained by I·R drop or Joule self-heating operates at 'near threshold' conditions. Measurement of electromigration damage near threshold is very difficult due to slow degradation requiring greatly extended stress times, or high currents that cause thermal anomalies. Software simulations of the electromigration mechanism combined with characterization of temperature profiles allows extracting material parameters and calculation of design rules to ensure reliable interconnect. Test structures capable of demonstrating Blech threshold effects while allowing thermal characterization were designed and processed. Electromigration stress tests at various conditions were performed to extract both shortline (threshold) and long-line (above threshold) performance values. The resistance increase time constant shows immortality below Je·L (product of current density and segment length) of 3200 amp/cm. Statistical analysis of times-to-failure show that long lines last 105 hours at 3.1 mA/mum2 (120°C). While this is more robust than aluminum interconnect, the semiconductor industry will be challenged to improve that performance as future products require.

  14. Release Resistant Electrical Interconnections For Mems Devices

    DOEpatents

    Peterson, Kenneth A.; Garrett, Stephen E.; Reber, Cathleen A.

    2005-02-22

    A release resistant electrical interconnection comprising a gold-based electrical conductor compression bonded directly to a highly-doped polysilicon bonding pad in a MEMS, IMEMS, or MOEMS device, without using any intermediate layers of aluminum, titanium, solder, or conductive adhesive disposed in-between the conductor and polysilicon pad. After the initial compression bond has been formed, subsequent heat treatment of the joint above 363 C creates a liquid eutectic phase at the bondline comprising gold plus approximately 3 wt % silicon, which, upon re-solidification, significantly improves the bond strength by reforming and enhancing the initial bond. This type of electrical interconnection is resistant to chemical attack from acids used for releasing MEMS elements (HF, HCL), thereby enabling the use of a "package-first, release-second" sequence for fabricating MEMS devices. Likewise, the bond strength of an Au--Ge compression bond may be increased by forming a transient liquid eutectic phase comprising Au-12 wt % Ge.

  15. SOFC INTERCONNECT DEVELOPMENT

    SciTech Connect

    Diane M. England

    2004-03-16

    An interconnect for an SOFC stack is used to connect fuel cells into a stack. SOFC stacks are expected to run for 40,000 hours and 10 thermal cycles for the stationary application and 10,000 hours and 7000 thermal cycles for the transportation application. The interconnect of a stack must be economical and robust enough to survive the SOFC stack operation temperature of 750 C and must maintain the electrical connection to the fuel cells throughout the lifetime and under thermal cycling conditions. Ferritic and austenitic stainless steels, and nickel-based superalloys were investigated as possible interconnect materials for solid oxide fuel cell (SOFC) stacks. The alloys were thermally cycled in air and in a wet nitrogen-argon-hydrogen (N2-Ar-H2-H2O) atmosphere. Thermogravimetry was used to determine the parabolic oxidation rate constants of the alloys in both atmospheres. The area-specific resistance of the oxide scale and metal substrates were measured using a two-probe technique with platinum contacts. The study identifies two new interconnect designs which can be used with both bonded and compressive stack sealing mechanisms. The new interconnect designs offer a solution to chromium vaporization, which can lead to degradation of some (chromium-sensitive) SOFC cathodes.

  16. Optically interconnected phased arrays

    NASA Technical Reports Server (NTRS)

    Bhasin, Kul B.; Kunath, Richard R.

    1988-01-01

    Phased-array antennas are required for many future NASA missions. They will provide agile electronic beam forming for communications and tracking in the range of 1 to 100 GHz. Such phased arrays are expected to use several hundred GaAs monolithic integrated circuits (MMICs) as transmitting and receiving elements. However, the interconnections of these elements by conventional coaxial cables and waveguides add weight, reduce flexibility, and increase electrical interference. Alternative interconnections based on optical fibers, optical processing, and holography are under evaluation as possible solutions. In this paper, the current status of these techniques is described. Since high-frequency optical components such as photodetectors, lasers, and modulators are key elements in these interconnections, their performance and limitations are discussed.

  17. Welded solar cell interconnection

    NASA Technical Reports Server (NTRS)

    Stofel, E. J.; Browne, E. R.; Meese, R. A.; Vendura, G. J.

    1982-01-01

    The efficiency of the welding of solar-cell interconnects is compared with the efficiency of soldering such interconnects, and the cases in which welding may be superior are examined. Emphasis is placed on ultrasonic welding; attention is given to the solar-cell welding machine, the application of the welding process to different solar-cell configurations, producibility, and long-life performance of welded interconnects. Much of the present work has been directed toward providing increased confidence in the reliability of welding using conditions approximating those that would occur with large-scale array production. It is concluded that there is as yet insufficient data to determine which of three methods (soldering, parallel gap welding, and ultrasonic welding) provides the longest-duration solar panel life.

  18. SOFC INTERCONNECT DEVELOPMENT

    SciTech Connect

    Diane M. England

    2003-06-06

    This report summarizes the interconnect work being performed at Delphi. Materials were chosen for this interconnect project were chosen from ferritic and austenitic stainless steels, and nickel-based superalloys. The alloys are thermally cycled in air and a wet hydrogen atmosphere. The oxide scale adherence, electrical resistance and oxidation resistance are determined after long-term oxidation of each alloy. The oxide scale adherence will be observed using a scanning electron microscope. The electrical resistance of the oxidized alloys will be determined using an electrical resistance measurement apparatus which has been designed and is currently being built. Data from the electrical resistance measurement is expected to be provided in the second quarter.

  19. Capillary interconnect device

    SciTech Connect

    Renzi, Ronald F

    2013-11-19

    An interconnecting device for connecting a plurality of first fluid-bearing conduits to a corresponding plurality of second fluid-bearing conduits thereby providing fluid communication between the first fluid-bearing conduits and the second fluid-bearing conduits. The device includes a manifold and one or two ferrule plates that are held by compressive axial forces.

  20. Coplanar interconnection module

    NASA Technical Reports Server (NTRS)

    Steward, R. D.; Windsor, H. F.

    1970-01-01

    Module for interconnecting a semiconductor array to external leads or components incorporates a metal external heat sink for cooling the array. Heat sink, extending down from the molded block that supports the array, is immersed in a liquid nitrogen bath which is designed to maintain the desired array temperature.

  1. Interconnecting with VIPs

    ERIC Educational Resources Information Center

    Collins, Robert

    2013-01-01

    Interconnectedness changes lives. It can even save lives. Recently the author got to witness and be part of something in his role as a teacher of primary science that has changed lives: it may even have saved lives. It involved primary science teaching--and the climate. Robert Collins describes how it is all interconnected. The "Toilet…

  2. Open Systems Interconnection.

    ERIC Educational Resources Information Center

    Denenberg, Ray

    1985-01-01

    Discusses the need for standards allowing computer-to-computer communication and gives examples of technical issues. The seven-layer framework of the Open Systems Interconnection (OSI) Reference Model is explained and illustrated. Sidebars feature public data networks and Recommendation X.25, OSI standards, OSI layer functions, and a glossary.…

  3. CAISSON: Interconnect Network Simulator

    NASA Technical Reports Server (NTRS)

    Springer, Paul L.

    2006-01-01

    Cray response to HPCS initiative. Model future petaflop computer interconnect. Parallel discrete event simulation techniques for large scale network simulation. Built on WarpIV engine. Run on laptop and Altix 3000. Can be sized up to 1000 simulated nodes per host node. Good parallel scaling characteristics. Flexible: multiple injectors, arbitration strategies, queue iterators, network topologies.

  4. Optical Interconnections For WSI

    NASA Astrophysics Data System (ADS)

    Friedrich, E.; Valette, S.; Gidon, P.

    1989-02-01

    Optical interconnections may be an alternative to metallic lines in very large and fast circuits. In this field, integrated optics could be very attractive because the basic approach is similar to the one of microelectronics. From this point of view, the silicon based integrated optics technology developed at LETI is described and expected performances are analysed.

  5. Interconnecting with VIPs

    ERIC Educational Resources Information Center

    Collins, Robert

    2013-01-01

    Interconnectedness changes lives. It can even save lives. Recently the author got to witness and be part of something in his role as a teacher of primary science that has changed lives: it may even have saved lives. It involved primary science teaching--and the climate. Robert Collins describes how it is all interconnected. The "Toilet…

  6. Fuel cell system with interconnect

    DOEpatents

    Liu, Zhien; Goettler, Richard; Delaforce, Philip Mark

    2016-03-08

    The present invention includes a fuel cell system having an interconnect that reduces or eliminates diffusion (leakage) of fuel and oxidant by providing an increased densification, by forming the interconnect as a ceramic/metal composite.

  7. Silicon hybrid wafer scale integration interconnect evaluation

    NASA Astrophysics Data System (ADS)

    Lyke, James C.

    1989-12-01

    The electrical characteristics of interconnections that have been proposed for use in silicon hybrid wafer scale integration (WSI) approaches were investigated. The study was based on a set of 5 inch test wafers, containing various interconnection structures previously designed at AFIT. Two test wafers used a special polyimide dielectric, while a third was composed of a benzocyclobutene (BCB). The investigated structures represented 10 cm length aluminum, coupled, stripline-like transmission lines. The metrics used included continuity measurements, ac measurement of the characteristic impedance and coupling levels, and pulsed-signal response measurements. Continuity results indicated transmission and leakage failures in all wafers, although the failure mechanisms were sometimes wafer-specific. The characteristic impedance measurement technique was flawed, but revealed interesting information concerning the driving-point impedances of the structures. Most coupled structures manifested coupling responses which were consistent in shape with theoretical estimates, but higher in magnitude by 10 to 20 dB. All structures revealed coupling levels lower than -25 dB. Despite correlation difficulties, the results implied that transmission line behavior is manifested in WSIC interconnections.

  8. Aluminum Hydroxide

    MedlinePlus

    Aluminum hydroxide is used for the relief of heartburn, sour stomach, and peptic ulcer pain and to ... Aluminum hydroxide comes as a capsule, a tablet, and an oral liquid and suspension. The dose and ...

  9. Photovoltaic sub-cell interconnects

    DOEpatents

    van Hest, Marinus Franciscus Antonius Maria; Swinger Platt, Heather Anne

    2017-05-09

    Photovoltaic sub-cell interconnect systems and methods are provided. In one embodiment, a photovoltaic device comprises a thin film stack of layers deposited upon a substrate, wherein the thin film stack layers are subdivided into a plurality of sub-cells interconnected in series by a plurality of electrical interconnection structures; and wherein the plurality of electrical interconnection structures each comprise no more than two scribes that penetrate into the thin film stack layers.

  10. Interconnected network of cameras

    NASA Astrophysics Data System (ADS)

    Hosseini Kamal, Mahdad; Afshari, Hossein; Leblebici, Yusuf; Schmid, Alexandre; Vandergheynst, Pierre

    2013-02-01

    The real-time development of multi-camera systems is a great challenge. Synchronization and large data rates of the cameras adds to the complexity of these systems as well. The complexity of such system also increases as the number of their incorporating cameras increases. The customary approach to implementation of such system is a central type, where all the raw stream from the camera are first stored then processed for their target application. An alternative approach is to embed smart cameras to these systems instead of ordinary cameras with limited or no processing capability. Smart cameras with intra and inter camera processing capability and programmability at the software and hardware level will offer the right platform for distributed and parallel processing for multi- camera systems real-time application development. Inter camera processing requires the interconnection of smart cameras in a network arrangement. A novel hardware emulating platform is introduced for demonstrating the concept of the interconnected network of cameras. A methodology is demonstrated for the interconnection network of camera construction and analysis. A sample application is developed and demonstrated.

  11. Interconnects, Transmitters, and Receivers

    NASA Astrophysics Data System (ADS)

    Hoefflinger, Bernd

    Interconnects on-chip between transistors and between functions like processors and memories, between chips on carriers or in stacks, and the communication with the outside world have become a highly complex performance, reliability, cost, and energy challenge. Twelve layers of metal interconnects, produced by lithography, require, including the contact vias, 24 mask and process cycles on top of the process front-end. The resulting lines are associated with resistance, capacitance and inductance parasitics as well as with ageing due to high current densities. Large savings in wiring lengths are achieved with 3D integration: transistor stacking, chip stacking and TSV's, a direction, which has exploded since 2005 because of many other benefits and, at the same time, with sensitive reliability and cost issues. On top of this or as an alternative, non-contact interconnects are possible with capacitive or inductive coupling. Inductive in particular has proven to be attractive because its transmission range is large enough for communication in chip stacks and yet not too large to cause interference.Optical transmitters based on integrated III-V compound-semiconductor lasers and THz power amplifiers compete with ascending low-cost, parallel-wire transmitters based on BiCMOS technologies. Parallel mm-wave and THz transceiver arrays enable mm-wave radar for traffic safety and THz computed-tomography. In spite of all these technology advances, the power efficiency of data communication will only improve 100× in a decade. New compression and architectural techniques are in high demand.

  12. Carbon Nanotube Interconnect

    NASA Technical Reports Server (NTRS)

    Li, Jun (Inventor); Meyyappan, Meyya (Inventor)

    2006-01-01

    Method and system for fabricating an electrical interconnect capable of supporting very high current densities ( 10(exp 6)-10(exp 10) Amps/sq cm), using an array of one or more carbon nanotubes (CNTs). The CNT array is grown in a selected spaced apart pattern, preferably with multi-wall CNTs, and a selected insulating material, such as SiOw, or SiuNv is deposited using CVD to encapsulate each CNT in the array. An exposed surface of the insulating material is planarized to provide one or more exposed electrical contacts for one or more CNTs.

  13. Polymeric optoelectronic interconnects

    NASA Astrophysics Data System (ADS)

    Eldada, Louay A.

    2000-04-01

    Electrical interconnects are reaching their fundamental limits and are becoming the speed bottleneck as processor speeds are increasing. A polymer-based interconnect technology was developed for affordable integrated optical circuits that address the optical signal processing needs in the telecom, datacom, and performance computing industries. We engineered organic polymers that can be readily made into single-mode, multimode, and micro-optical waveguide structures of controlled numerical apertures and geometries. These materials are formed from highly-crosslinked acrylate monomers with specific linkages that determine properties such as flexibility, robustness, optical loss, thermal stability, and humidity resistance. These monomers are intermiscible, providing for precise continuous adjustment of the refractive index over a wide range. In polymer form, they exhibit state-of-the-art loss values and exceptional environmental stability, enabling use in a variety of demanding applications. A wide range of rigid and flexible substrates can be used, including glass, quartz, silicon, glass-filled epoxy printed circuit board substrates, and flexible plastic films. The devices we describe include a variety of routing elements that can be sued as part of a massively parallel photonic integrated circuit on the MCM, board, or backplane level.

  14. Hydraulically interconnected vehicle suspension: background and modelling

    NASA Astrophysics Data System (ADS)

    Zhang, Nong; Smith, Wade A.; Jeyakumaran, Jeku

    2010-01-01

    This paper presents a novel approach for the frequency domain analysis of a vehicle fitted with a general hydraulically interconnected suspension (HIS) system. Ideally, interconnected suspensions have the capability, unique among passive systems, to provide stiffness and damping characteristics dependent on the all-wheel suspension mode in operation. A basic, lumped-mass, four-degree-of-freedom half-car model is used to illustrate the proposed methodology. The mechanical-fluid boundary condition in the double-acting cylinders is modelled as an external force on the mechanical system and a moving boundary on the fluid system. The fluid system itself is modelled using the hydraulic impedance method, in which the relationships between the dynamic fluid states, i.e. pressures and flows, at the extremities of a single fluid circuit are determined by the transfer matrix method. A set of coupled, frequency-dependent equations, which govern the dynamics of the integrated half-car system, are then derived and the application of these equations to both free and forced vibration analysis is explained. The fluid system impedance matrix for the two general wheel-pair interconnection types-anti-synchronous and anti-oppositional-is also given. To further outline the application of the proposed methodology, the paper finishes with an example using a typical anti-roll HIS system. The integrated half-car system's free vibration solutions and frequency response functions are then obtained and discussed in some detail. The presented approach provides a scientific basis for investigating the dynamic characteristics of HIS-equipped vehicles, and the results offer further confirmation that interconnected suspension schemes can provide, at least to some extent, individual control of modal stiffness and damping characteristics.

  15. Fuel cell system with interconnect

    DOEpatents

    Liu, Zhien; Goettler, Richard

    2015-09-29

    The present invention includes a fuel cell system having a plurality of adjacent electrochemical cells formed of an anode layer, a cathode layer spaced apart from the anode layer, and an electrolyte layer disposed between the anode layer and the cathode layer. The fuel cell system also includes at least one interconnect, the interconnect being structured to conduct free electrons between adjacent electrochemical cells. Each interconnect includes a primary conductor embedded within the electrolyte layer and structured to conduct the free electrons.

  16. Policy issues in interconnecting networks

    NASA Technical Reports Server (NTRS)

    Leiner, Barry M.

    1989-01-01

    To support the activities of the Federal Research Coordinating Committee (FRICC) in creating an interconnected set of networks to serve the research community, two workshops were held to address the technical support of policy issues that arise when interconnecting such networks. The workshops addressed the required and feasible technologies and architectures that could be used to satisfy the desired policies for interconnection. The results of the workshop are documented.

  17. On the State of the Art of Metal Interconnects for SOFC Application

    SciTech Connect

    Jablonski@netl.doe.gov

    2011-02-27

    One of the recent developments for Solid Oxide Fuel Cells (SOFC) is oxide component materials capable of operating at lower temperatures such as 700-800C. This lower temperature range has provided for the consideration of metallic interconnects which have several advantages over ceramic interconnects: low cost, ease in manufacturing, and high conductivity. Most metals and alloys will oxidize under both the anode and cathode conditions within an SOFC, thus a chief requirement is that the base metal oxide scale must be electrically conductive since this constitutes the majority of the electrical resistance in a metallic interconnect. Common high temperature alloys form scales that contain chrome, silicon and aluminum oxides among others. Under SOFC operating conditions chrome oxide is a semi-conductor while silicon and aluminum oxides are insulators. In this talk we will review the evolution in candidate alloys and surface modifications which constitute an engineered solution for SOFC interconnect applications.

  18. Optical interconnection of optical modules

    NASA Astrophysics Data System (ADS)

    Schamschula, Marius P.; Caulfield, H. J.; Shamir, Joseph

    1990-12-01

    The most plausible possible uses of nonlinear optics as the bases for interconnections among complex optical modules are evaluated, with a view to such applications as neural networks that entail large numbers of interconnections and numerous stages. Optical interconnection allows such a system to be composed of many modules as well as to incorporate switching- and amplification-function optical nonlinearities. While it is possible to achieve a pixel-by-pixel, diffraction-limited flat-field relay with nonlinearity, where the interconnect allows for cascadability, the wave-particle duality is destroyed between stages.

  19. Epidemics on interconnected networks

    NASA Astrophysics Data System (ADS)

    Dickison, Mark; Havlin, S.; Stanley, H. E.

    2012-06-01

    Populations are seldom completely isolated from their environment. Individuals in a particular geographic or social region may be considered a distinct network due to strong local ties but will also interact with individuals in other networks. We study the susceptible-infected-recovered process on interconnected network systems and find two distinct regimes. In strongly coupled network systems, epidemics occur simultaneously across the entire system at a critical infection strength βc, below which the disease does not spread. In contrast, in weakly coupled network systems, a mixed phase exists below βc of the coupled network system, where an epidemic occurs in one network but does not spread to the coupled network. We derive an expression for the network and disease parameters that allow this mixed phase and verify it numerically. Public health implications of communities comprising these two classes of network systems are also mentioned.

  20. Solar cell welded interconnection development program. [parallel gap and ultrasonic metal-metal bonding

    NASA Technical Reports Server (NTRS)

    Katzeff, J. S.

    1974-01-01

    Parallel gap welding and ultrasonic bonding techniques were developed for joining selected interconnect materials (silver, aluminum, copper, silver plated molybdenum and Kovar) to silver-titanium and aluminum contact cells. All process variables have been evaluated leading to establishment of optimum solar cell, interconnect, electrodes and equipment criteria for obtainment of consistent high quality welds. Applicability of nondestructive testing of solar cell welds has been studied. A pre-weld monitoring system is being built and will be utilized in the numerically controlled parallel gap weld station.

  1. Printed interconnects for photovoltaic modules

    SciTech Connect

    Fields, J. D.; Pach, G.; Horowitz, K. A. W.; Stockert, T. R.; Woodhouse, M.; van Hest, M. F. A. M.

    2017-01-01

    Film-based photovoltaic modules employ monolithic interconnects to minimize resistance loss and enhance module voltage via series connection. Conventional interconnect construction occurs sequentially, with a scribing step following deposition of the bottom electrode, a second scribe after deposition of absorber and intermediate layers, and a third following deposition of the top electrode. This method produces interconnect widths of about 300 um, and the area comprised by interconnects within a module (generally about 3%) does not contribute to power generation. The present work reports on an increasingly popular strategy capable of reducing the interconnect width to less than 100 um: printing interconnects. Cost modeling projects a savings of about $0.02/watt for CdTe module production through the use of printed interconnects, with savings coming from both reduced capital expense and increased module power output. Printed interconnect demonstrations with copper-indium-gallium-diselenide and cadmium-telluride solar cells show successful voltage addition and miniaturization down to 250 um. Material selection guidelines and considerations for commercialization are discussed.

  2. Printed interconnects for photovoltaic modules

    DOE PAGES

    Fields, J. D.; Pach, G.; Horowitz, K. A. W.; ...

    2016-10-21

    Film-based photovoltaic modules employ monolithic interconnects to minimize resistance loss and enhance module voltage via series connection. Conventional interconnect construction occurs sequentially, with a scribing step following deposition of the bottom electrode, a second scribe after deposition of absorber and intermediate layers, and a third following deposition of the top electrode. This method produces interconnect widths of about 300 µm, and the area comprised by interconnects within a module (generally about 3%) does not contribute to power generation. The present work reports on an increasingly popular strategy capable of reducing the interconnect width to less than 100 µm: printing interconnects.more » Cost modeling projects a savings of about $0.02/watt for CdTe module production through the use of printed interconnects, with savings coming from both reduced capital expense and increased module power output. Printed interconnect demonstrations with copper-indium-gallium-diselenide and cadmium-telluride solar cells show successful voltage addition and miniaturization down to 250 µm. As a result, material selection guidelines and considerations for commercialization are discussed.« less

  3. Process for electrically interconnecting electrodes

    DOEpatents

    Carey, Paul G.; Thompson, Jesse B.; Colella, Nicolas J.; Williams, Kenneth A.

    2002-01-01

    Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb--Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb--Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.

  4. Aluminum Analysis.

    ERIC Educational Resources Information Center

    Sumrall, William J.

    1998-01-01

    Presents three problems based on the price of aluminum designed to encourage students to be cooperative and to use an investigative approach to learning. Students collect and synthesize information, analyze results, and draw conclusions. (AIM)

  5. Aluminum Analysis.

    ERIC Educational Resources Information Center

    Sumrall, William J.

    1998-01-01

    Presents three problems based on the price of aluminum designed to encourage students to be cooperative and to use an investigative approach to learning. Students collect and synthesize information, analyze results, and draw conclusions. (AIM)

  6. Interconnecting heterogeneous database management systems

    NASA Technical Reports Server (NTRS)

    Gligor, V. D.; Luckenbaugh, G. L.

    1984-01-01

    It is pointed out that there is still a great need for the development of improved communication between remote, heterogeneous database management systems (DBMS). Problems regarding the effective communication between distributed DBMSs are primarily related to significant differences between local data managers, local data models and representations, and local transaction managers. A system of interconnected DBMSs which exhibit such differences is called a network of distributed, heterogeneous DBMSs. In order to achieve effective interconnection of remote, heterogeneous DBMSs, the users must have uniform, integrated access to the different DBMs. The present investigation is mainly concerned with an analysis of the existing approaches to interconnecting heterogeneous DBMSs, taking into account four experimental DBMS projects.

  7. Interconnect resistance of photovoltaic submodules

    NASA Technical Reports Server (NTRS)

    Volltrauer, H.; Eser, E.; Delahoy, A. E.

    1985-01-01

    Small area amorphous silicon solar cells generally have higher efficiencies than large interconnected submodules. Among the reasons for the differences in performance are the lack of large area uniformity, the effect of nonzero tin oxide sheet resistance, and possibly pinholes in the various layers. Another and usually small effect that can contribute to reduced performance of interconnected cells is the resistance of the interconnection i.e., the series resistance introduced by the metal to tin oxide contact through silicon. Proper processing problems to avoid poor contacts are discussed.

  8. Renewable Systems Interconnection: Executive Summary

    SciTech Connect

    Kroposki, B.; Margolis, R.; Kuswa, G.; Torres, J.; Bower, W.; Key, T.; Ton, D.

    2008-02-01

    The U.S. Department of Energy launched the Renewable Systems Interconnection (RSI) study in 2007 to address the challenges to high penetrations of distributed renewable energy technologies. The RSI study consists of 14 additional reports.

  9. Universal Interconnection Technology Workshop Proceedings

    SciTech Connect

    Sheaffer, P.; Lemar, P.; Honton, E. J.; Kime, E.; Friedman, N. R.; Kroposki, B.; Galdo, J.

    2002-10-01

    The Universal Interconnection Technology (UIT) Workshop - sponsored by the U.S. Department of Energy, Distributed Energy and Electric Reliability (DEER) Program, and Distribution and Interconnection R&D - was held July 25-26, 2002, in Chicago, Ill., to: (1) Examine the need for a modular universal interconnection technology; (2) Identify UIT functional and technical requirements; (3) Assess the feasibility of and potential roadblocks to UIT; (4) Create an action plan for UIT development. These proceedings begin with an overview of the workshop. The body of the proceedings provides a series of industry representative-prepared papers on UIT functions and features, present interconnection technology, approaches to modularization and expandability, and technical issues in UIT development as well as detailed summaries of group discussions. Presentations, a list of participants, a copy of the agenda, and contact information are provided in the appendices of this document.

  10. Fuel cell system with interconnect

    DOEpatents

    Liu, Zhien; Goettler, Richard

    2016-12-20

    The present invention includes an integrated planar, series connected fuel cell system having electrochemical cells electrically connected via interconnects, wherein the anodes of the electrochemical cells are protected against Ni loss and migration via an engineered porous anode barrier layer.

  11. Optical subscriber interconnect system

    NASA Astrophysics Data System (ADS)

    Hirn, Richard; Wolfgang, Hans; Strasser, Helmut

    1993-02-01

    To match the inherent needs of data traffic, office communications demand medium-speed connectionless packet transport in addition to circuit-switched voice and data transmission. Optical solutions to this requirement should be low in cost rather than extremely high in performance to be cost competitive with copper systems. A subscriber-premises system will be proposed which combines a digital private automatic branch exchange (PABX) with local area network (LAN) functionality. It is based on a double-star passive optical network, extending to optical wall outlets. The subsets with telephone functionality provide the opto/electrical conversion and give access to the packet channel via Terminal Adaptors (TA). Different types of customer LANs may coexist on the same network, since their data frames are embedded in an intermediate MAC-layer. The feasibility of transmission over multimode fibers at not aggregate bit rate of approx. 140 Mb/s at 1300 nm downstream and 780 nm upstream allowing the use of low-cost components (e.g. 780 nm compact-disc laser diodes) has been experimentally investigated. Calculations predict cost-of-ownership parity with conventional copper-based PABXs without LAN functionality and a cost-advantage over the usual separate LAN+PABX installations. The network topology, protocol and the implications of multimode transmission on the system will be discussed.

  12. Laser ablation analysis of novel perfluoroalkyl-coated aluminum nanocomposites

    SciTech Connect

    Jouet, R. Jason; Carney, Joel R.; Lightstone, James M.; Warren, Andrea D.

    2007-12-12

    The evolution and decay of aluminum and aluminum monoxide emission signatures following a laser ablation event were used to compare the relative reaction rates of three aluminum based materials. Time-resolved emission results of oxide-free, C{sub 13}F{sub 27}CO{sub 2}H-passivated materials were compared with uncoated, oxide passivated aluminum nanoparticles and those coated with the same acid used in for passivation C{sub 13}F{sub 27}CO{sub 2}H. Excited state Al and AlO emission is reduced in time for the oxide free material when compared to coated, 50 nm, oxide passivated particles mixed on an equal active Al: C{sub 13}F{sub 27}CO{sub 2}H ratio. This is interpreted as an increase in the reaction rate afforded by the elimination of the oxide coating and proximity of oxidizing species in the SAM-based nanocomposite.

  13. Misalignment corrections in optical interconnects

    NASA Astrophysics Data System (ADS)

    Song, Deqiang

    Optical interconnects are considered a promising solution for long distance and high bitrate data transmissions, outperforming electrical interconnects in terms of loss and dispersion. Due to the bandwidth and distance advantage of optical interconnects, longer links have been implemented with optics. Recent studies show that optical interconnects have clear advantages even at very short distances---intra system interconnects. The biggest challenge for such optical interconnects is the alignment tolerance. Many free space optical components require very precise assembly and installation, and therefore the overall cost could be increased. This thesis studied the misalignment tolerance and possible alignment correction solutions for optical interconnects at backplane or board level. First the alignment tolerance for free space couplers was simulated and the result indicated the most critical alignments occur between the VCSEL, waveguide and microlens arrays. An in-situ microlens array fabrication method was designed and experimentally demonstrated, with no observable misalignment with the waveguide array. At the receiver side, conical lens arrays were proposed to replace simple microlens arrays for a larger angular alignment tolerance. Multilayer simulation models in CodeV were built to optimized the refractive index and shape profiles of the conical lens arrays. Conical lenses fabricated with micro injection molding machine and fiber etching were characterized. Active component VCSOA was used to correct misalignment in optical connectors between the board and backplane. The alignment correction capability were characterized for both DC and AC (1GHz) optical signal. The speed and bandwidth of the VCSOA was measured and compared with a same structure VCSEL. Based on the optical inverter being studied in our lab, an all-optical flip-flop was demonstrated using a pair of VCSOAs. This memory cell with random access ability can store one bit optical signal with set or

  14. Average interconnection length and interconnection distribution for rectangular arrays

    NASA Astrophysics Data System (ADS)

    Gura, Carol; Abraham, Jacob A.

    1989-05-01

    It is shown that it is necessary to utilize different partitioning coefficients in interconnection length analyses which are based on Rent's rule, depending on whether one- or two-dimensional placement strategies are used. Beta is the partitioning coefficient in the power-law relationship Alpha Beta which provides a measure of the number of interconnection that cross a boundary which encloses Beta blocks. The partitioning coefficients are Beta = p/2 and Beta = p for two- and one-dimensional arrays, respectively, where p is the experimental coefficient, of the Rent relationship. Based on these separate partitioning coefficients, an average interconnection length prediction is presented for rectangular arrays that out performs existing predictions. Examples are given to support this theory.

  15. Aluminum alloy

    NASA Technical Reports Server (NTRS)

    Blackburn, Linda B. (Inventor); Starke, Edgar A., Jr. (Inventor)

    1989-01-01

    This invention relates to aluminum alloys, particularly to aluminum-copper-lithium alloys containing at least about 0.1 percent by weight of indium as an essential component, which are suitable for applications in aircraft and aerospace vehicles. At least about 0.1 percent by weight of indium is added as an essential component to an alloy which precipitates a T1 phase (Al2CuLi). This addition enhances the nucleation of the precipitate T1 phase, producing a microstructure which provides excellent strength as indicated by Rockwell hardness values and confirmed by standard tensile tests.

  16. Aluminum alloy

    NASA Technical Reports Server (NTRS)

    Blackburn, Linda B. (Inventor); Starke, Edgar A., Jr. (Inventor)

    1989-01-01

    This invention relates to aluminum alloys, particularly to aluminum-copper-lithium alloys containing at least about 0.1 percent by weight of indium as an essential component, which are suitable for applications in aircraft and aerospace vehicles. At least about 0.1 percent by weight of indium is added as an essential component to an alloy which precipitates a T1 phase (Al2CuLi). This addition enhances the nucleation of the precipitate T1 phase, producing a microstructure which provides excellent strength as indicated by Rockwell hardness values and confirmed by standard tensile tests.

  17. Aluminum phosphide

    Integrated Risk Information System (IRIS)

    Aluminum phosphide ; CASRN 20859 - 73 - 8 Human health assessment information on a chemical substance is included in the IRIS database only after a comprehensive review of toxicity data , as outlined in the IRIS assessment development process . Sections I ( Health Hazard Assessments for Noncarcinoge

  18. Manufacturing of planar ceramic interconnects

    SciTech Connect

    Armstrong, B.L.; Coffey, G.W.; Meinhardt, K.D.; Armstrong, T.R.

    1996-12-31

    The fabrication of ceramic interconnects for solid oxide fuel cells (SOFC) and separator plates for electrochemical separation devices has been a perennial challenge facing developers. Electrochemical vapor deposition (EVD), plasma spraying, pressing, tape casting and tape calendering are processes that are typically utilized to fabricate separator plates or interconnects for the various SOFC designs and electrochemical separation devices. For sake of brevity and the selection of a planar fuel cell or gas separation device design, pressing will be the only fabrication technique discussed here. This paper reports on the effect of the characteristics of two doped lanthanum manganite powders used in the initial studies as a planar porous separator for a fuel cell cathode and as a dense interconnect for an oxygen generator.

  19. Electric currents in networks of interconnected memristors.

    PubMed

    Nedaaee Oskoee, Ehsan; Sahimi, Muhammad

    2011-03-01

    Chua [IEEE Trans. Circuit Theory 1, 507 (1971).] argued that, in addition to the standard resistors, capacitors, and inductors, there must be a fourth fundamental element in electrical circuits, which he called a memory resistor or memristor. Strukov et al. [Nature (London) 453, 80 (2008)] showed how memristive behavior arises in some thin semiconducting films. Unlike other passive elements, however, a memristor with large sizes cannot be fabricated, because scale up of a memristor to dimensions of the order of microns causes loss of the memristive effect by decreasing the width of the doped region relative to the overall size of the memristor. A microscale memristor is, however, essential to most of the potential applications. One way of fabricating such a microscale memristor without losing the memristive effect is to make a network of very small interconnected memristors. We report the results of numerical simulations of electrical currents in such networks of interconnected memristors, as well as memristors and Ohmic conductors. The memristor networks exhibit a rich variety of interesting properties, including weakly and strongly memristive regimes, a possible first-order transition at the connectivity threshold, generation of second harmonics in the strongly memristive regime, and the universal dependence of the network's strength on the frequency. Moreover, we show that the polarity of the memristors can play an important role in the overall properties of the memristor network, in particular its speed of switching, which may have a potentially important application to faster computers. None of these properties are exhibited by linear resistor networks, or even by nonlinear resistor networks without a memory effect.

  20. Electrochemical Processing Tools for Advanced Copper Interconnects: An Introduction

    NASA Astrophysics Data System (ADS)

    Datta, Madhav

    The change from vacuum-deposited aluminum to electroplated copper in 1997 brought about a paradigm shift in interconnect technology and in chip making [1]. Since then, most of the leading chip manufacturers have converted to electroplated Cu technology for chip interconnects. Cu interconnects are fabricated by dual Damascene process which is referred to a metallization patterning process by which two insulator (dielectric) levels are patterned, filled with copper, and planarized to create a metal layer consisting of vias and lines. The process steps consist of laying a sandwich of two levels of insulator and etch stop layers that are patterned as holes for vias and troughs for lines. They are then filled with a single metallization step. Finally, the excess material is removed, and the wafer is planarized by chemical mechanical polishing (CMP). While finer details of exact sequence of fabrication steps vary, the end result of forming a metal layer remains the same in which vias are formed in the lower layer, and trenches are formed in the upper layer. Electroplating enables deposition of Cu in via holes and overlying trenches in a single step thus eliminating a via/line interface and significantly reducing the cycle time. Due to these reasons and due to relatively less expensive tooling, electroplating is a cost-effective and efficient process for Cu interconnects [2, 3]. Compared with vacuum deposition processes, electroplated Cu provides improved super filling capabilities and abnormal grain growth phenomena. These properties contribute significantly to improved reliability of Cu interconnects. With the proper choice of additives and plating conditions, void-free, seam-free Damascene deposits are obtained which eliminates surface-like fast diffusion paths for Cu electromigration.

  1. Passive euthanasia

    PubMed Central

    Garrard, E; Wilkinson, S

    2005-01-01

    The idea of passive euthanasia has recently been attacked in a particularly clear and explicit way by an "Ethics Task Force" established by the European Association of Palliative Care (EAPC) in February 2001. It claims that the expression "passive euthanasia" is a contradiction in terms and hence that there can be no such thing. This paper critically assesses the main arguments for the Task Force's view. Three arguments are considered. Firstly, an argument based on the (supposed) wrongness of euthanasia and the (supposed) permissibility of what is often called passive euthanasia. Secondly, the claim that passive euthanasia (so-called) cannot really be euthanasia because it does not cause death. And finally, a consequence based argument which appeals to the (alleged) bad consequences of accepting the category of passive euthanasia. We conclude that although healthcare professionals' nervousness about the concept of passive euthanasia is understandable, there is really no reason to abandon the category provided that it is properly and narrowly understand and provided that "euthanasia reasons" for withdrawing or withholding life-prolonging treatment are carefully distinguished from other reasons. PMID:15681666

  2. Formation and properties of stabilized aluminum nanoparticles.

    PubMed

    Meziani, Mohammed J; Bunker, Christopher E; Lu, Fushen; Li, Heting; Wang, Wei; Guliants, Elena A; Quinn, Robert A; Sun, Ya-Ping

    2009-03-01

    The wet-chemical synthesis of aluminum nanoparticles was investigated systematically by using dimethylethylamine alane and 1-methylpyrrolidine alane as precursors and molecules with one or a pair of carboxylic acid groups as surface passivation agents. Dimethylethylamine alane was more reactive, capable of yielding well-defined and dispersed aluminum nanoparticles. 1-Methylpyrrolidine alane was less reactive and more complex in the catalytic decomposition reaction, for which various experimental parameters and conditions were used and evaluated. The results suggested that the passivation agent played dual roles of trapping aluminum particles to keep them nanoscale during the alane decomposition and protecting the aluminum nanoparticles postproduction from surface oxidation and that an appropriate balance between the rate of alane decomposition (depending more sensitively on the reaction temperature) and the timing in the introduction of the passivation agent into the reaction mixture was critical to the desired product mixes and/or morphologies. Some fundamental and technical issues on the alane decomposition and the protection of the resulting aluminum nanoparticles are discussed.

  3. Incremental Passivity and Incremental Passivity-Based Output Regulation for Switched Discrete-Time Systems.

    PubMed

    Jiao Li; Jun Zhao

    2017-05-01

    This paper investigates incremental passivity and output regulation for switched discrete-time systems. We develop the results in two parts. First of all, a concept of incremental passivity is proposed to describe the overall incremental passivity property of a switched discrete-time system in the absence of the classic incremental passivity property of the subsystems. A condition for incremental passivity is given. A certain negative output feedback is designed to produce asymptotic stability. Incremental passivity is shown to be preserved under feedback interconnection. The second part of this paper is concerned with an application of the incremental passivity theory to the output regulation problem for switched discrete-time systems. The key idea is to construct a switched internal model with incremental passivity, which closely links the solvability of the output regulation problem. A characteristic of the switched internal model is that it does not necessarily switch synchronously with the controlled plant, which greatly increases the freedom of design. Once such a switched internal model is established, the output regulation problem is then solved by construction of the feedback interconnection between the controlled plant and the switched internal model. The main usefulness of the strategy is to get rid of the solvability of the output regulation problem for the subsystems.

  4. Local Network Wideband Interconnection Alternatives.

    DTIC Science & Technology

    1984-01-01

    greater than 1.5 Mbps and two standard televison channels. 1.1 SCOPE Interconnection of local area networks within the continental United States is...may influence : a. Media selection, b. Interface design, c. The use of the 1.5 Mbps data transmission capacity, and d. Adherence to the full-motion video

  5. Optical interconnection techniques for Hypercube

    NASA Technical Reports Server (NTRS)

    Johnston, A. R.; Bergman, L. A.; Wu, W. H.

    1988-01-01

    Direct free-space optical interconnection techniques are described for the Hypercube concurrent processor machine using a holographic optical element. Computational requirements and optical constraints on implementation are briefly summarized with regard to topology, power consumption, and available technologies. A hybrid lens/HOE approach is described that can support an eight-dimensional cube of 256 nodes.

  6. Stress, texture and electromigration in damascene copper interconnects

    NASA Astrophysics Data System (ADS)

    Mirpuri, Kabir

    energy on formation of energy minimizing textures was established. The mechanism of texture evolution was explained explicitly as function of principal and shear stress, dislocation density, trench aspect ratio and top passivation layer. Thus, from the electromigration studies it was possible to screen out the undesirable grain orientations. The XRD and EBSD investigations revealed the mechanism of texture and microstructure evolution in damascene lines and were used to explain the impact of various factors like stresses, dislocations, line width, line spacing, trench aspect ratio, passivation layer, substrate on texture evolution. The knowledge gained from these two studies opens a new door giving an opportunity to design the texture and microstructure in the damascene interconnect lines so as to eliminate undesirable grain orientations which are vulnerable to electromigration and mechanical failure. Since the mechanism of texture evolution is now known, one could vary the process parameters like say current density, barrier and passivation layer material and thickness, Cu seed and electroplated layer thickness, additive content in electroplating bath, annealing conditions etc. to obtain an optimum texture and microstructure which provides best reliability against electromigration and mechanical failures.

  7. Siderophore-Mediated Aluminum Uptake by Bacillus megaterium ATCC 19213

    PubMed Central

    Hu, X.; Boyer, G. L.

    1996-01-01

    The bacterium Bacillus megaterium ATCC 19213 is known to produce two hydroxamate siderophores, schizokinen and N-deoxyschizokinen, under iron-limited conditions. In addition to their high affinity for ferric ions, these siderophores chelate aluminum. Aluminum was absorbed by B. megaterium ATCC 19213 through the siderophore transport receptor, providing an extra pathway for aluminum accumulation into iron-deficient bacteria. At low concentrations of the metal, siderophore-mediated uptake was the dominant process for aluminum accumulation. At high concentrations of aluminum, passive transport dominated and siderophore production slowed the passive transport of aluminum into the cell. Siderophore production was affected by the aluminum content in the media. High concentrations of aluminum increased production of siderophores in iron-limited cultures, and this production continued into stationary phase. Aluminum did not stimulate siderophore production in iron-replete cultures. The production of siderophores markedly affected aluminum uptake. This has direct implications on the toxicity of heavy metals under iron-deficient conditions. PMID:16535439

  8. Immortality of Cu damascene interconnects

    NASA Astrophysics Data System (ADS)

    Hau-Riege, Stefan P.

    2002-04-01

    We have studied short-line effects in fully-integrated Cu damascene interconnects through electromigration experiments on lines of various lengths and embedded in different dielectric materials. We compare these results with results from analogous experiments on subtractively-etched Al-based interconnects. It is known that Al-based interconnects exhibit three different behaviors, depending on the magnitude of the product of current density, j, and line length, L: For small values of (jL), no void nucleation occurs, and the line is immortal. For intermediate values, voids nucleate, but the line does not fail because the current can flow through the higher-resistivity refractory-metal-based shunt layers. Here, the resistance of the line increases but eventually saturates, and the relative resistance increase is proportional to (jL/B), where B is the effective elastic modulus of the metallization system. For large values of (jL/B), voiding leads to an unacceptably high resistance increase, and the line is considered failed. By contrast, we observed only two regimes for Cu-based interconnects: Either the resistance of the line stays constant during the duration of the experiment, and the line is considered immortal, or the line fails due to an abrupt open-circuit failure. The absence of an intermediate regime in which the resistance saturates is due to the absence of a shunt layer that is able to support a large amount of current once voiding occurs. Since voids nucleate much more easily in Cu- than in Al-based interconnects, a small fraction of short Cu lines fails even at low current densities. It is therefore more appropriate to consider the probability of immortality in the case of Cu rather than assuming a sharp boundary between mortality and immortality. The probability of immortality decreases with increasing amount of material depleted from the cathode, which is proportional to (jL2/B) at steady state. By contrast, the immortality of Al-based interconnects is

  9. 47 CFR 64.1401 - Expanded interconnection.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... such equipment to connect interconnectors' fiber optic systems or microwave radio transmission... interconnectors' fiber optic systems or microwave radio transmission facilities (where reasonably feasible) with... interconnection of fiber optic facilities, local exchange carriers shall provide: (1) An interconnection point or...

  10. 47 CFR 64.1401 - Expanded interconnection.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... such equipment to connect interconnectors' fiber optic systems or microwave radio transmission... interconnectors' fiber optic systems or microwave radio transmission facilities (where reasonably feasible) with... interconnection of fiber optic facilities, local exchange carriers shall provide: (1) An interconnection point or...

  11. 47 CFR 64.1401 - Expanded interconnection.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... such equipment to connect interconnectors' fiber optic systems or microwave radio transmission... interconnectors' fiber optic systems or microwave radio transmission facilities (where reasonably feasible) with... interconnection of fiber optic facilities, local exchange carriers shall provide: (1) An interconnection point or...

  12. Process for making a multilayer interconnect system

    NASA Technical Reports Server (NTRS)

    Zachry, Clyde L. (Inventor); Niedzwiecke, Andrew J. (Inventor)

    1976-01-01

    A process for making an interconnect system for a multilayer circuit pattern. The interconnect system is formed having minimized through-hole space consumption so as to be suitable for high density, closely meshed circuit patterns.

  13. Formation of interconnections to microfluidic devices

    DOEpatents

    Matzke, Carolyn M [Los Lunas, NM; Ashby, Carol I. H. [Edgewood, NM; Griego, Leonardo [Tijeras, NM

    2003-07-29

    A method is disclosed to form external interconnections to a microfluidic device for coupling of a fluid or light or both into a microchannel of the device. This method can be used to form optical or fluidic interconnections to microchannels previously formed on a substrate, or to form both the interconnections and microchannels during the same process steps. The optical and fluidic interconnections are formed parallel to the plane of the substrate, and are fluid tight.

  14. Multimode siloxane polymer components for optical interconnects

    NASA Astrophysics Data System (ADS)

    Bamiedakis, Nikolaos; Beals, Joseph, IV; Penty, Richard V.; White, Ian H.; DeGroot, Jon v., Jr.; Clapp, Terry V.; De Shazer, David

    2009-02-01

    This paper presents an overview of multimode waveguides and waveguide components formed from siloxane polymer materials which are suitable for use in optical interconnection applications. The components can be cost-effectively integrated onto conventional PCBs and offer increased functionality in optical transmission. The multimode waveguides exhibit low loss (0.04 dB/cm at 850 nm) and low crosstalk (< -30 dB) performance, large alignment tolerances and negligible mode mixing for short waveguide lengths. Error-free data transmission at 10 Gb/s over 1.4 m long waveguides has been successfully demonstrated. Waveguide crossings exhibit very low excess losses, below 0.01 dB/crossing, and excellent crosstalk performance. Low loss is obtained for waveguide bends with radii of curvature larger than 8 mm and 6 mm for 90° and S-shaped bends respectively. High-uniformity splitting is achieved with multimode Y-splitters even in the presence of input misalignments. Y-combiners are shown to benefit from the multimode nature of the waveguides allowing low loss combining (4 dB for an 8×1 device). A large range of power splitting ratios between 30% and 75% is achieved with multimode coupler devices. Examples of system applications benefiting from the use of these components are briefly presented including a terabit capacity optical backplane, a radio-over-fibre multicasting system and a SCM passive optical network.

  15. 47 CFR 90.477 - Interconnected systems.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 47 Telecommunication 5 2014-10-01 2014-10-01 false Interconnected systems. 90.477 Section 90.477... MOBILE RADIO SERVICES Transmitter Control Interconnected Systems § 90.477 Interconnected systems. (a... operation. This restriction will not apply to trunked systems or on any channel assigned exclusively to one...

  16. 18 CFR 292.306 - Interconnection costs.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 18 Conservation of Power and Water Resources 1 2010-04-01 2010-04-01 false Interconnection costs... § 292.306 Interconnection costs. (a) Obligation to pay. Each qualifying facility shall be obligated to pay any interconnection costs which the State regulatory authority (with respect to any...

  17. Brazing dissimilar aluminum alloys

    NASA Technical Reports Server (NTRS)

    Dalalian, H.

    1979-01-01

    Dip-brazing process joins aluminum castings to aluminum sheet made from different aluminum alloy. Process includes careful cleaning, surface preparation, and temperature control. It causes minimum distortion of parts.

  18. Avioptic plug-in interconnection

    NASA Astrophysics Data System (ADS)

    Caserta, Anthony L.; Lijoi, Bruno

    1989-05-01

    A secure interconnection is claimed for optical and avioptic cables located in exposed positions, which often occur on aircraft communications circuits, for connecting those cables into equipment such as circuit boards. In this invention the interconnection for optical fiber cables comprises a connector which is engaged in a receptacle in a mother board provided with optical circuitry. The connector comprises a cuplike body or plug containing a metal sleeve which encases the optical fiber cable such that the cable end is exposed. The mating receptacle comprises a cylindrical shell having its lower end embedded in the mother board. A hole in the receptacle shell wall receives the end of an optical fiber on the optical circuitry of the mother board. The end of the sleeve of the connector fits over the end of the receptacle shell protruding from the mother board. Beam deflection means in the receptacle or on the connector directs light between the fiber optic cable and the optical circuit element of the mother board. Electrical coupling can be incorporated into the interconnection such that the termination can accommodate electrical as well as optical functions.

  19. Compact models for nanophotonic structures and on-chip interconnects

    NASA Astrophysics Data System (ADS)

    Alam, Mehboob

    Over the last few years, scaling in deep submicron technologies has shifted the paradigm from device-dominated to interconnect-dominated design methodology. Consequently, there is an increasing interest towards the miniaturization of the guiding medium in nanoscale integrated circuits by exploring plasmon-based waveguides to alleviate the scaling issues associated with today's copper interconnect. In this thesis, we seek short and long-term solutions of on-chip interconnect by developing accurate compact models of on-chip interconnects and impedance characterization of nanophotonic structures. The developed system models are compact and accurate over the operating frequency range and the adopted approach have provided many critical insights and produced many important results. This thesis first presents a new modeling strategy that represents the nanostructure by its equivalent impedance. By applying either quasistatic approximation or separately solving for voltage and current for dominant mode, we reduce the field problem to a circuit problem. The impedance expressed in terms of circuit components is dependent on the material constant as well as the operating frequency. The modeling methodology is successfully applied to nanoparticles and oscillating nanosphere. The proposed model characterizes plasmon resonance in these nanostructures, thereby providing basic building block to develop spice models of complex plasmon-based waveguide for sub-wavelength propagation. We also presented several techniques to develop compact models of on-chip interconnects and passive components for accurate estimation of power, noise and delay of high speed integrated circuits. The automated method generates reduced order models that are accurate across either a narrow or a wide-range of frequencies. The proposed methods are based on Krylov subspace method with interpolation points dynamically selected using either spline based algorithm or discrete wavelet transform. Narrow and

  20. Interconnects for nanoscale MOSFET technology: a review

    NASA Astrophysics Data System (ADS)

    Chaudhry, Amit

    2013-06-01

    In this paper, a review of Cu/low-k, carbon nanotube (CNT), graphene nanoribbon (GNR) and optical based interconnect technologies has been done. Interconnect models, challenges and solutions have also been discussed. Of all the four technologies, CNT interconnects satisfy most of the challenges and they are most suited for nanometer scale technologies, despite some minor drawbacks. It is concluded that beyond 32 nm technology, a paradigm shift in the interconnect material is required as Cu/low-k interconnects are approaching fundamental limits.

  1. Flexible interconnects for fuel cell stacks

    DOEpatents

    Lenz, David J.; Chung, Brandon W.; Pham, Ai Quoc

    2004-11-09

    An interconnect that facilitates electrical connection and mechanical support with minimal mechanical stress for fuel cell stacks. The interconnects are flexible and provide mechanically robust fuel cell stacks with higher stack performance at lower cost. The flexible interconnects replace the prior rigid rib interconnects with flexible "fingers" or contact pads which will accommodate the imperfect flatness of the ceramic fuel cells. Also, the mechanical stress of stacked fuel cells will be smaller due to the flexibility of the fingers. The interconnects can be one-sided or double-sided.

  2. In-memory interconnect protocol configuration registers

    DOEpatents

    Cheng, Kevin Y.; Roberts, David A.

    2017-09-19

    Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

  3. 78 FR 29672 - Small Generator Interconnection Agreements and Procedures

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-05-21

    ... Energy Regulatory Commission 18 CFR Part 35 Small Generator Interconnection Agreements and Procedures... Generator Interconnection Procedures (SGIP) and pro forma Small Generator Interconnection Agreement (SGIA..., 2013, the Commission issued an order in the above- referenced docket. Small Generator Interconnection...

  4. [Effects of aluminum intake on the content of aluminum, iron, zinc and lipid peroxidation in the hippocampus of rats].

    PubMed

    Jia, Y; Zhong, C; Wang, Y; Zhao, R

    2001-05-01

    Effect of long-term exposure to aluminum on the content of aluminum, iron, zinc, copper and the lipid peroxidation in hippocampus was studied. Sprague-Dawley rats were randomly divided into four groups by body weight. Aluminum chloride was added to diet at doses of Al3+ 0, 11.2, 55.9 and 111.9 mg/kg BW for successive 90 days. Neuro-behavioral tests consisted of open field and passive-avoidance conditioning were performed. SOD and GSH-Px activities and MDA levels were detected by spectrophotometry. The values of aluminum, iron, zinc and copper were measured by atomic absorption spectroscopy. The spontaneous motor ability in the open field and the latency of passive avoidance were decreased as compared with the controls. The concentration of aluminum was increased and iron and zinc were decreased copper was not changed significantly; the activities of SOD and GSH-Px were reduced, while the value of MDA was increased in hippocampus. The results suggested that long-term aluminum-exposure could lead to high accumulation of aluminum in hippocampus, which could disturb the normal distribution of iron and zinc, decrease the activities of antioxidase and increase the level of lipid peroxidation. Accumulation of aluminum and accompany with reduction of iron, zinc in hippocampus and oxidative damage to hippocampus might interpret the neurotoxicity of aluminum.

  5. Double interconnection fuel cell array

    DOEpatents

    Draper, Robert; Zymboly, Gregory E.

    1993-01-01

    A fuel cell array (10) is made, containing number of tubular, elongated fuel cells (12) which are placed next to each other in rows (A, B, C, D), where each cell contains inner electrodes (14) and outer electrodes (18 and 18'), with solid electrolyte (16 and 16') between the electrodes, where the electrolyte and outer electrode are discontinuous, having two portions, and providing at least two opposed discontinuities which contain at least two oppositely opposed interconnections (20 and 20') contacting the inner electrode (14), each cell (12) having only three metallic felt electrical connectors (22) which contact surrounding cells, where each row is electrically connected to the other.

  6. Analysis of vertical interconnection measurements

    NASA Astrophysics Data System (ADS)

    Karner, F. A.

    The paper examines the predominance of the effects that measurement points, geometries, and alignment have on the interpretation of measured values of contact resistance of vertical interconnections in multilayer electronic packages. It is concluded that: (1) four-terminal measurements for contact resistance are misleading; (2) measured values are mostly a function of structural geometry; (3) simulation in two dimensions and subsequent synthesis is a good predictor in three-dimensional simulations; (4) the dual-contact site is a good alignment aid and contact-resistance indicator; and (5) the measured resistance value should only be used as a reference, and not as an indicator of good or bad.

  7. Environmental toxicology: Interconnections between human ...

    EPA Pesticide Factsheets

    This presentation will discuss what has made a career in environmental toxicology rewarding, environmental and scientific challenges for the 21st century, paradigm shift in regulatory toxicology, adverse outcome framework, interconnections between human health and ecological integrity, SOT-SETAC Pellston Workshop findings, concepts for systems thinking in environmental toxicology The Eminent Toxicologist Lectures are historically relevant, high-quality presentations appropriate for senior undergraduate students, graduate students, or the scientifically oriented general public. This series of lectures is produced by the SOT Undergraduate Subcommittee of the Education Committee in conjunction with the Eminent Toxicologist Working Group.

  8. Environmental toxicology: Interconnections between human ...

    EPA Pesticide Factsheets

    This presentation will discuss what has made a career in environmental toxicology rewarding, environmental and scientific challenges for the 21st century, paradigm shift in regulatory toxicology, adverse outcome framework, interconnections between human health and ecological integrity, SOT-SETAC Pellston Workshop findings, concepts for systems thinking in environmental toxicology The Eminent Toxicologist Lectures are historically relevant, high-quality presentations appropriate for senior undergraduate students, graduate students, or the scientifically oriented general public. This series of lectures is produced by the SOT Undergraduate Subcommittee of the Education Committee in conjunction with the Eminent Toxicologist Working Group.

  9. Design for aluminum recycling

    SciTech Connect

    Not Available

    1993-10-01

    This article describes the increasing use of aluminum in automobiles and the need to recycle to benefit further growth of aluminum applications by assuring an economical, high-quality source of metal. The article emphasizes that coordination of material specifications among designers can raise aluminum scrap value and facilitate recycling. Applications of aluminum in automobile construction are discussed.

  10. Examination of Critical Length Effect in Copper Interconnects With Oxide and Low-k Dielectrics

    SciTech Connect

    Thrasher, Stacye; Gall, Martin; Justison, Patrick; Hernandez, Richard; Kawasaki, Hisao; Capasso, Cristiano; Nguyen, Timothy

    2004-12-08

    As technology moves toward faster microelectronic devices with smaller feature sizes, copper is replacing aluminum-copper alloy and low-k dielectric is replacing oxide as the materials of choice for advanced interconnect integrations. Copper not only brings to the table the advantage of lower resistivity, but also exhibits better electromigration performance when compared to Al(Cu). Low-k dielectric materials are advantageous because they reduce power consumption and improve signal delay. Due to these advantages, the industry trend is moving towards integrating copper and low-k dielectric for high performance interconnects. The purpose of this study is to evaluate the critical length effect in single-inlaid copper interconnects and determine the critical product (jl)c, for a variety of integrations, examining the effect of ILD (oxide vs. low-k), geometry, and stress temperature.

  11. Interconnect fatigue design for terrestrial photovoltaic modules

    NASA Technical Reports Server (NTRS)

    Mon, G. R.; Moore, D. M.; Ross, R. G., Jr.

    1982-01-01

    The results of comprehensive investigation of interconnect fatigue that has led to the definition of useful reliability-design and life-prediction algorithms are presented. Experimental data indicate that the classical strain-cycle (fatigue) curve for the interconnect material is a good model of mean interconnect fatigue performance, but it fails to account for the broad statistical scatter, which is critical to reliability prediction. To fill this shortcoming the classical fatigue curve is combined with experimental cumulative interconnect failure rate data to yield statistical fatigue curves (having failure probability as a parameter) which enable (1) the prediction of cumulative interconnect failures during the design life of an array field, and (2) the unambiguous--ie., quantitative--interpretation of data from field-service qualification (accelerated thermal cycling) tests. Optimal interconnect cost-reliability design algorithms are derived based on minimizing the cost of energy over the design life of the array field.

  12. Cascade solar cell having conductive interconnects

    DOEpatents

    Borden, Peter G.; Saxena, Ram R.

    1982-10-26

    Direct ohmic contact between the cells in an epitaxially grown cascade solar cell is obtained by means of conductive interconnects formed through grooves etched intermittently in the upper cell. The base of the upper cell is directly connected by the conductive interconnects to the emitter of the bottom cell. The conductive interconnects preferably terminate on a ledge formed in the base of the upper cell.

  13. Gold-based electrical interconnections for microelectronic devices

    DOEpatents

    Peterson, Kenneth A.; Garrett, Stephen E.; Reber, Cathleen A.; Watson, Robert D.

    2002-01-01

    A method of making an electrical interconnection from a microelectronic device to a package, comprising ball or wedge compression bonding a gold-based conductor directly to a silicon surface, such as a polysilicon bonding pad in a MEMS or IMEMS device, without using layers of aluminum or titanium disposed in-between the conductor and the silicon surface. After compression bonding, optional heating of the bond above 363 C. allows formation of a liquid gold-silicon eutectic phase containing approximately 3% (by weight) silicon, which significantly improves the bond strength by reforming and enhancing the initial compression bond. The same process can be used for improving the bond strength of Au--Ge bonds by forming a liquid Au-12Ge eutectic phase.

  14. Visualizing interconnections among climate risks

    NASA Astrophysics Data System (ADS)

    Tanaka, K.; Yokohata, T.; Nishina, K.; Takahashi, K.; Emori, S.; Kiguchi, M.; Iseri, Y.; Honda, Y.; Okada, M.; Masaki, Y.; Yamamoto, A.; Shigemitsu, M.; Yoshimori, M.; Sueyoshi, T.; Hanasaki, N.; Ito, A.; Sakurai, G.; Iizumi, T.; Nishimori, M.; Lim, W. H.; Miyazaki, C.; Kanae, S.; Oki, T.

    2015-12-01

    It is now widely recognized that climate change is affecting various sectors of the world. Climate change impact on one sector may spread out to other sectors including those seemingly remote, which we call "interconnections of climate risks". While a number of climate risks have been identified in the Intergovernmental Panel on Climate Change (IPCC) Fifth Assessment Report (AR5), there has been no attempt to explore their interconnections comprehensively. Here we present a first and most exhaustive visualization of climate risks drawn based on a systematic literature survey. Our risk network diagrams depict that changes in the climate system impact natural capitals (terrestrial water, crop, and agricultural land) as well as social infrastructures, influencing the socio-economic system and ultimately our access to food, water, and energy. Our findings suggest the importance of incorporating climate risk interconnections into impact and vulnerability assessments and call into question the widely used damage function approaches, which address a limited number of climate change impacts in isolation. Furthermore, the diagram is useful to educate decision makers, stakeholders, and general public about cascading risks that can be triggered by the climate change. Socio-economic activities today are becoming increasingly more inter-dependent because of the rapid technological progress, urbanization, and the globalization among others. Equally complex is the ecosystem that is susceptible to climate change, which comprises interwoven processes affecting one another. In the context of climate change, a number of climate risks have been identified and classified according to regions and sectors. These reports, however, did not fully address the inter-relations among risks because of the complexity inherent in this issue. Climate risks may ripple through sectors in the present inter-dependent world, posing a challenge ahead of us to maintain the resilience of the system. It is

  15. Passivity and Dissipativity as Design and Analysis Tools for Networked Control Systems

    ERIC Educational Resources Information Center

    Yu, Han

    2012-01-01

    In this dissertation, several control problems are studied that arise when passive or dissipative systems are interconnected and controlled over a communication network. Since communication networks can impact the systems' stability and performance, there is a need to extend the results on control of passive or dissipative systems to networked…

  16. Passivity and Dissipativity as Design and Analysis Tools for Networked Control Systems

    ERIC Educational Resources Information Center

    Yu, Han

    2012-01-01

    In this dissertation, several control problems are studied that arise when passive or dissipative systems are interconnected and controlled over a communication network. Since communication networks can impact the systems' stability and performance, there is a need to extend the results on control of passive or dissipative systems to networked…

  17. Flexible Chip Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain

    PubMed Central

    Jackson, Nathan; Muthuswamy, Jit

    2009-01-01

    We report here a novel approach called MEMS microflex interconnect (MMFI) technology for packaging a new generation of Bio-MEMS devices that involve movable microelectrodes implanted in brain tissue. MMFI addresses the need for (i) operating space for movable parts and (ii) flexible interconnects for mechanical isolation. We fabricated a thin polyimide substrate with embedded bond-pads, vias, and conducting traces for the interconnect with a backside dry etch, so that the flexible substrate can act as a thin-film cap for the MEMS package. A double gold stud bump rivet bonding mechanism was used to form electrical connections to the chip and also to provide a spacing of approximately 15–20 µm for the movable parts. The MMFI approach achieved a chip scale package (CSP) that is lightweight, biocompatible, having flexible interconnects, without an underfill. Reliability tests demonstrated minimal increases of 0.35 mΩ, 0.23 mΩ and 0.15 mΩ in mean contact resistances under high humidity, thermal cycling, and thermal shock conditions respectively. High temperature tests resulted in an increase in resistance of > 90 mΩ when aluminum bond pads were used, but an increase of ~ 4.2 mΩ with gold bond pads. The mean-time-to-failure (MTTF) was estimated to be at least one year under physiological conditions. We conclude that MMFI technology is a feasible and reliable approach for packaging and interconnecting Bio-MEMS devices. PMID:20160981

  18. 47 CFR 90.477 - Interconnected systems.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ...) Applicants for new land stations to be interconnected with the public switched telephone network must... switched telephone network only after modifying their license. See § 1.929 of this chapter. In all cases a..., 896-901 MHz, and 935-940 MHz, interconnection with the public switched telephone network is...

  19. High density interconnects for aerospace applications

    NASA Astrophysics Data System (ADS)

    Menozzi, Gaetan

    1988-08-01

    The technologies of large scale interconnectors were evaluated for chip and wire or leadless ceramic chip carriers. The packaging and interconnecting structures are either ceramic multilayer with multilayer thick film and cofired multilayer ceramic. Test results are given, technology status and next generation interconnects are described, and aerospace applications are presented.

  20. Interconnections in ULSI: Correlation and Crosstalk

    DTIC Science & Technology

    1992-12-31

    cide interconnects. Finally. in Section V. we present the 2L conclusions. -_-. - ax, II. THEORY + A"- a- ) A. Coupling Between Optical Interconnects - To... TesIs . Note that the circulating urrent pattems hardly carry any net current in the x.direction. Therefore, the conductance of the stmctue will be very

  1. 14 CFR 23.701 - Flap interconnection.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Flap interconnection. 23.701 Section 23.701 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION, DEPARTMENT OF TRANSPORTATION AIRCRAFT AIRWORTHINESS... Systems § 23.701 Flap interconnection. (a) The main wing flaps and related movable surfaces as a...

  2. Government Open Systems Interconnection: Profile in Progress.

    ERIC Educational Resources Information Center

    Mills, Kevin L.

    1990-01-01

    Describes the emergence of Open Systems Interconnection (OSI) as it relates to the U.S. Government Open Systems Interconnection Profile (GOSIP); defines GOSIP; and speculates about its future. Challenges facing GOSIP that are related to test policies and procedures, strategic and tactical planning, additional functionality, and international…

  3. 14 CFR 29.674 - Interconnected controls.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 14 Aeronautics and Space 1 2012-01-01 2012-01-01 false Interconnected controls. 29.674 Section 29... AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Design and Construction Control Systems § 29.674 Interconnected controls. Each primary flight control system must provide for safe flight and landing and operate...

  4. 14 CFR 27.674 - Interconnected controls.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 14 Aeronautics and Space 1 2012-01-01 2012-01-01 false Interconnected controls. 27.674 Section 27... AIRWORTHINESS STANDARDS: NORMAL CATEGORY ROTORCRAFT Design and Construction Control Systems § 27.674 Interconnected controls. Each primary flight control system must provide for safe flight and landing and operate...

  5. 47 CFR 101.519 - Interconnection.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 47 Telecommunication 5 2010-10-01 2010-10-01 false Interconnection. 101.519 Section 101.519 Telecommunication FEDERAL COMMUNICATIONS COMMISSION (CONTINUED) SAFETY AND SPECIAL RADIO SERVICES FIXED MICROWAVE SERVICES 24 GHz Service and Digital Electronic Message Service § 101.519 Interconnection. (a) All...

  6. Durability of Metallic Interconnects and Protective Coatings

    SciTech Connect

    Yang, Zhenguo; Stevenson, Jeffry W.

    2009-12-15

    To build up a useful voltage, a number of solid oxide fuel cells (SOFCs) are electrically connected into series in a stack via interconnects, which are placed between adjacent cells. In addition to functioning as a bi-polar electrical connector, the interconnect also acts as a separator plate that separates the fuel at the anode side of one cell from the air at the cathode side on an adjacent cell. During SOFC operation at the high temperatures, the interconnects are thus simultaneously exposed to the oxidizing air at one side and a reducing fuel that can be either hydrogen or hydrocarbon at the other. Besides, they are in contact with adjacent components, such as electrodes or electrical contacts, seals, etc. With steady reduction in SOFC operating temperatures into the low or intermediate range 600-850oC, oxidation resistant alloys are often used to construct interconnects. However, the metallic interconnects may degrade via interactions at their interfaces with surrounding environments or adjacent components, potentially affecting the stability and performance of interconnects and the SOFC stacks. Thus protection layers are applied to metallic interconnects that also intend to mitigate or prevent chromium migration into cells and the cell poisoning. This chapter provides a comprehensive review of materials for metallic interconnects, their degradation and coating protection.

  7. Updating Technical Screens for PV Interconnection: Preprint

    SciTech Connect

    Coddington, M.; Ellis, A.; Lynn, K.; Razon, A.; Key, T.; Kroposki, B.; Mather, B.; Hill, R.; Nicole, K.; Smith, J.

    2012-08-01

    Solar photovoltaics (PV) is the dominant type of distributed generation (DG) technology interconnected to electric distribution systems in the United States, and deployment of PV systems continues to increase rapidly. Considering the rapid growth and widespread deployment of PV systems in United States electric distribution grids, it is important that interconnection procedures be as streamlined as possible to avoid unnecessary interconnection studies, costs, and delays. Because many PV interconnection applications involve high penetration scenarios, the process needs to allow for a sufficiently rigorous technical evaluation to identify and address possible system impacts. Existing interconnection procedures are designed to balance the need for efficiency and technical rigor for all DG. However, there is an implicit expectation that those procedures will be updated over time in order to remain relevant with respect to evolving standards, technology, and practical experience. Modifications to interconnection screens and procedures must focus on maintaining or improving safety and reliability, as well as accurately allocating costs and improving expediency of the interconnection process. This paper evaluates the origins and usefulness of the capacity penetration screen, offers potential short-term solutions which could effectively allow fast-track interconnection to many PV system applications, and considers longer-term solutions for increasing PV deployment levels in a safe and reliable manner while reducing or eliminating the emphasis on the penetration screen.

  8. Interconnections For Stacked Parallel Computer Modules

    NASA Technical Reports Server (NTRS)

    Johannesson, Richard T.

    1996-01-01

    Concept for interconnecting modules in parallel computers leads to cheaper, smaller, lighter, lower-power computing systems for aerospace, industrial, business, and consumer applications. Computer modules stacked and interconnected in various configurations. Connections among stacks controlled by switching within gateways and/or by addresses on buses.

  9. 47 CFR 101.519 - Interconnection.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 47 Telecommunication 5 2014-10-01 2014-10-01 false Interconnection. 101.519 Section 101.519 Telecommunication FEDERAL COMMUNICATIONS COMMISSION (CONTINUED) SAFETY AND SPECIAL RADIO SERVICES FIXED MICROWAVE SERVICES 24 GHz Service and Digital Electronic Message Service § 101.519 Interconnection. (a) All...

  10. 47 CFR 101.519 - Interconnection.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 47 Telecommunication 5 2011-10-01 2011-10-01 false Interconnection. 101.519 Section 101.519 Telecommunication FEDERAL COMMUNICATIONS COMMISSION (CONTINUED) SAFETY AND SPECIAL RADIO SERVICES FIXED MICROWAVE SERVICES 24 GHz Service and Digital Electronic Message Service § 101.519 Interconnection. (a) All...

  11. 47 CFR 101.519 - Interconnection.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 47 Telecommunication 5 2013-10-01 2013-10-01 false Interconnection. 101.519 Section 101.519 Telecommunication FEDERAL COMMUNICATIONS COMMISSION (CONTINUED) SAFETY AND SPECIAL RADIO SERVICES FIXED MICROWAVE SERVICES 24 GHz Service and Digital Electronic Message Service § 101.519 Interconnection. (a) All...

  12. 47 CFR 101.519 - Interconnection.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 47 Telecommunication 5 2012-10-01 2012-10-01 false Interconnection. 101.519 Section 101.519 Telecommunication FEDERAL COMMUNICATIONS COMMISSION (CONTINUED) SAFETY AND SPECIAL RADIO SERVICES FIXED MICROWAVE SERVICES 24 GHz Service and Digital Electronic Message Service § 101.519 Interconnection. (a) All...

  13. Interconnect fatigue design for terrestrial photovoltaic modules

    SciTech Connect

    Mon, G. R.; Moore, D. M.; Ross, Jr., R. G.

    1982-03-01

    Fatigue of solar cell electrical interconnects due to thermal cycling has historically been a major failure mechanism in photovoltaic arrays; the results of a comprehensive investigation of interconnect fatigue that has led to the definition of useful reliability-design and life-prediction algorithms are presented. Experimental data gathered in this study indicate that the classical strain-cycle (fatigue) curve for the interconnect material is a good model of mean interconnect fatigue performance, but it fails to account for the broad statistical scatter, which is critical to reliability prediction. To fill this shortcoming the classical fatigue curve is combined with experimental cumulative interconnect failure rate data to yield statistical fatigue curves (having failure probability as a parameter) which enable: (1) the prediction of cumulative interconnect failures during the design life of an array field; and (2) the unambiguous - i.e., quantitative - interpretation of data from field-service qualification (accelerated thermal cycling) tests. Optimal interconnect cost-reliability design algorithms are derived based on minimizing the cost of energy over the design life of the array field. This procedure yields not only the minimum break-even cost of delivered energy, but also the required degree of interconnect redundancy and an estimate of array power degradation during the design life of the array field. The usefulness of the design algorithms is demonstrated with realistic examples of design optimization, prediction, and service qualification testing.

  14. Thin-film multilayer interconnect technology for YBa2Cu3O7 - x

    NASA Astrophysics Data System (ADS)

    Wellstood, F. C.; Kingston, J. J.; Clarke, John

    1994-01-01

    The construction of microelectronic circuits from high-transition-temperature (Tc) superconductors requires techniques for producing thin-film wires, insulating crossovers, and vias (window contacts) between wires. Together, these three components form a superconducting interconnect technology. The challenges encountered in developing such a technology for high-Tc superconductors involve factors associated with the materials, the circuits and the fabrication techniques. The use of pulsed laser deposition in conjunction with shadow mask patterning, photolithographic pattern definition, acid etching, ion-beam etching, and surface cleaning to produce multilayer interconnects from YBa2Cu3O7-x (YBCO) is discussed. These processes have been used to construct a variety of passive high-temperature superconducting components and circuits, including crossovers, window contacts, multiturn coils, and flux transformers. Integrated magnetometers incorporating superconducting quantum interference devices, multichip modules with semiconductor die bonded to YBCO interconnect structures, and analog-to-digital converters have also been successfully demonstrated.

  15. Modeling interconnect corners under double patterning misalignment

    NASA Astrophysics Data System (ADS)

    Hyun, Daijoon; Shin, Youngsoo

    2016-03-01

    Publisher's Note: This paper, originally published on March 16th, was replaced with a corrected/revised version on March 28th. If you downloaded the original PDF but are unable to access the revision, please contact SPIE Digital Library Customer Service for assistance. Interconnect corners should accurately reflect the effect of misalingment in LELE double patterning process. Misalignment is usually considered separately from interconnect structure variations; this incurs too much pessimism and fails to reflect a large increase in total capacitance for asymmetric interconnect structure. We model interconnect corners by taking account of misalignment in conjunction with interconnect structure variations; we also characterize misalignment effect more accurately by handling metal pitch at both sides of a target metal independently. Identifying metal space at both sides of a target metal.

  16. Magnesium Rich Primer for Chrome Free Protection of Aluminum Alloys (Preprint)

    DTIC Science & Technology

    2007-12-01

    Pourbaix diagram for aluminum (FIGURE 3), as well as the pH dependence on...passivating layer on the alloy surface. FIGURE 3 – Aluminum Pourbaix diagram from Jones7 (pg. 53), which shows the pH dependence on passivation...76th Ed., CRC Press, 1995 7. Jones, D. A. “Principles and Prevention of Corrosion”, 2nd Ed., Prentice Hall, 1996. 8. Pourbaix , M. “Atlas of Electrochemical Equilibria in Aqueous Solutions”, NACE, 1974. 16

  17. Passive thermosiphon solar collector

    SciTech Connect

    Sullivan, J.W.

    1984-01-01

    A passive thermosiphon solar collector was designed, built, installed and tested under this grant. The basic premise was to design a simple system that was economical to build and easy to install as a retrofit to many similar homes in the local community. The module is comprised of a 2X4 frame with a sandwiched insert consisting of a flat black painted aluminum absorber panel and a fiberglass reinforced plastic glazing. This insert is completely sealed from the environment with neoprene seals and rubber silicone sealant. The modules are enclosed in an overall framework of 2X8 material bolted to a concrete reinforced footing and attached to the residence at the top. This framework results in an air chamber behind the absorber panel where the air from the basement enters the chamber at the bottom and exits at the top of the chamber into the house. The air chamber is completely insulated with 5/8 inch polyisocyanurate foil covered foam board. Fabrication is detailed in the Design and Construction section and supplemented with the photo series submitted with the Second Quarter report. The test results indicate this modular concept is a viable solution to conserving our national resources and reducing heating expenses. In this specific experiment, the use of solar energy provided a thirty-five percent reduction in natural gas consumption for this home.

  18. Corrosion of aluminum and aluminum alloys

    SciTech Connect

    Davis, J.R.

    1999-01-01

    This new handbook presents comprehensive coverage of the corrosion behavior of aluminum and aluminum alloys, with emphasis on practical information about how to select and process these materials in order to prevent corrosion attack. Described are the characteristics of these materials and the influences of composition, mechanical working, heat treatment, joining methods, microstructure, and environmental variables on their corrosion.

  19. Aluminum extraction from aluminum industrial wastes

    NASA Astrophysics Data System (ADS)

    Amer, A. M.

    2010-05-01

    Aluminum dross tailings, an industrial waste from the Egyptian Aluminum Company (Egyptalum), was used to produce two types of alums: aluminum sulfate alum (Al2(SO4)3·12H2O) and ammonium aluminum alum {(NH4)2SO4AL2 (SO4)3·24H2O}. This was carried out in two processes. The first involves leaching the impurities using diluted H2SO4 with different solid/liquid ratios at different temperatures to dissolve the impurities present in the starting material in the form of aluminum sulfates. The second process is the extraction of aluminum (as aluminum sulfate) from the purified aluminum dross tailings thus produced. This was carried out in an autoclave. The effects of temperature, time of reaction, and acid concentration on pressure leaching and extraction processes were studied in order to specify the optimum conditions to be applied in the bench scale production as well as the kinetics of leaching process.

  20. ALUMINUM-CONTAINING POLYMERS

    DTIC Science & Technology

    ALUMINUM COMPOUNDS, *ORGANOMETALLIC COMPOUNDS, *POLYMERIZATION, *POLYMERS, ACRYLIC RESINS, ALKYL RADICALS, CARBOXYLIC ACIDS, COPOLYMERIZATION, LIGHT TRANSMISSION, STABILITY, STYRENES, TRANSPARENT PANELS.

  1. Selective broadcast interconnection - A novel scheme for fiber-optic local-area networks

    NASA Technical Reports Server (NTRS)

    Marhic, M. E.; Birk, Y.; Tobagi, F. A.

    1985-01-01

    A passive, unswitched scheme is introduced for directly interconnecting N stations, each of which has C transmitters and receivers. Implementations using fiber optics with spatial multiplexing and optionally wavelength multiplexing are discussed. This scheme utilizes the same resources as standard topologies with C parallel buses but outperforms them in two respects: (1) the aggregate throughput is proportional to C squared rather than to C; and (2) the power of each transmitter need reach only N/C, instead of N, receivers.

  2. Large data centers interconnect bottlenecks.

    PubMed

    Ghiasi, Ali

    2015-02-09

    Large data centers interconnect bottlenecks are dominated by the switch I/O BW and the front panel BW as a result of pluggable modules. To overcome the front panel BW and the switch ASIC BW limitation one approach is to either move the optics onto the mid-plan or integrate the optics into the switch ASIC. Over the last 4 years, VCSEL based optical engines have been integrated into the packages of large-scale HPC routers, moderate size Ethernet switches, and even FPGA's. Competing solutions based on Silicon Photonics (SiP) have also been proposed for integration into HPC and Ethernet switch packages but with better integration path through the use of TSV (Through Silicon Via) stack dies. Integrating either VCSEL or SiP based optical engines into complex ASIC package that operates at high temperatures, where the required reliability is not trivial, one should ask what is the technical or the economic advantage before embarking on such a complex integration. High density Ethernet switches addressing data centers currently in development are based on 25G NRZ signaling and QSFP28 optical module that can support up to 3.6 Tb of front panel bandwidth.

  3. Aluminum and Young Artists.

    ERIC Educational Resources Information Center

    Anderson, Thomas

    1980-01-01

    The author suggests a variety of ways in which aluminum and aluminum foil can be used in elementary and junior high art classes: relief drawing and rubbing; printing; repousse; sculpture; mobiles; foil sculpture; and three dimensional design. Sources of aluminum supplies are suggested. (SJL)

  4. Aluminum and Young Artists.

    ERIC Educational Resources Information Center

    Anderson, Thomas

    1980-01-01

    The author suggests a variety of ways in which aluminum and aluminum foil can be used in elementary and junior high art classes: relief drawing and rubbing; printing; repousse; sculpture; mobiles; foil sculpture; and three dimensional design. Sources of aluminum supplies are suggested. (SJL)

  5. [Passive euthanasia].

    PubMed

    Trube-Becker, E

    1977-01-01

    After having been acquainted with the historical development of euthanasia, the following steps for assitance in dying, called passive euthanasia are being discussed. a) Assistance during dying without speeding up death is the self-evident duty of a doctor. b) Assistance during death and speeding up the same as an unavoidable result of therapeutical treatment, more or less desired or more or less unavoidable. c) Assistance through letting the patient die by abandoning all therapeutical means, when these would only lead to a short extension of life time. No doctor is compelled to take measures to extend life if it is against the will of the patient. He is not even entitled to do so. A special problem is the abandoning of extended operative treatment, this borders on the so called active enthanasia. The dying patient always has the same right of treatment by a docter as well as nursing like all other suffering human beings. The decision to let a patient die should not result in leaving him by himself and to abandon all nursing as well. Such steps would include letting him lie in dirty linen, not sucking off the mucous secretion from the trachea, refusal to assist during mealtimes, non-assistance during cathetering, and the removal of the dying person to the bathroom, or any other remote orner of the hospital. No dying person should stay without help Loneliness especially is the greatest pain of a dying patient.

  6. EPRI PEAC Corp.: Certification Model Program and Interconnection Agreement Tools

    SciTech Connect

    Not Available

    2003-10-01

    Summarizes the work of EPRI PEAC Corp., under contract to DOE's Distribution and Interconnection R&D, to develop a certification model program and interconnection agreement tools to support the interconnection of distributed energy resources.

  7. Aluminum reference electrode

    DOEpatents

    Sadoway, D.R.

    1988-08-16

    A stable reference electrode is described for use in monitoring and controlling the process of electrolytic reduction of a metal. In the case of Hall cell reduction of aluminum, the reference electrode comprises a pool of molten aluminum and a solution of molten cryolite, Na[sub 3]AlF[sub 6], wherein the electrical connection to the molten aluminum does not contact the highly corrosive molten salt solution. This is accomplished by altering the density of either the aluminum (decreasing the density) or the electrolyte (increasing the density) so that the aluminum floats on top of the molten salt solution. 1 fig.

  8. Aluminum reference electrode

    DOEpatents

    Sadoway, Donald R.

    1988-01-01

    A stable reference electrode for use in monitoring and controlling the process of electrolytic reduction of a metal. In the case of Hall cell reduction of aluminum, the reference electrode comprises a pool of molten aluminum and a solution of molten cryolite, Na.sub.3 AlF.sub.6, wherein the electrical connection to the molten aluminum does not contact the highly corrosive molten salt solution. This is accomplished by altering the density of either the aluminum (decreasing the density) or the electrolyte (increasing the density) so that the aluminum floats on top of the molten salt solution.

  9. Partial Synchronization of Interconnected Boolean Networks.

    PubMed

    Chen, Hongwei; Liang, Jinling; Lu, Jianquan

    2017-01-01

    This paper addresses the partial synchronization problem for the interconnected Boolean networks (BNs) via the semi-tensor product (STP) of matrices. First, based on an algebraic state space representation of BNs, a necessary and sufficient criterion is presented to ensure the partial synchronization of the interconnected BNs. Second, by defining an induced digraph of the partial synchronized states set, an equivalent graphical description for the partial synchronization of the interconnected BNs is established. Consequently, the second partial synchronization criterion is derived in terms of adjacency matrix of the induced digraph. Finally, two examples (including an epigenetic model) are provided to illustrate the efficiency of the obtained results.

  10. Optical Backplane Interconnect Technology (OBIT)

    NASA Technical Reports Server (NTRS)

    Hammer, J. M.

    1988-01-01

    We describe and analyze a novel approach to implementing an Optical Backplane Interconnect Technology (OBIT) that is capable of optically connecting any row of a 32x32 backplane array to any row of a second 32x32 array. Each backplane array is formed monolithically on a wafer. The technology is based on the use of Grating Surface Emitting (GSE) waveguides formed on a wafer containing quantum-well and separate confinement waveguide layers. These layers are used for transverse guiding, gain, modulation, detection, and for the formation of wavelength tunable distributed-Bragg reflector lasers. The required surface structures are formed photolithographically. The GSE waveguides act as efficient antennae that radiate light at angles selected by tuning the wavelength of the lasers. The same waveguides may be used as the receiving antennae when the array is used in the receiving mode. Thus, wavelength tuning is used to direct each row of the transmitting array to the desired row of the receiving array. In summary: The optical backplane array will have the following characteristics: Any row of a 32x32 GSE array may be optically connected to any row of a second 32x32 array. Only one switch decision is required to switch 32 parallel connections to any one of 32 positions. Each monolithic array can be used as both transmitter and receiver by switching the bias on the quantum-well switch-detectors. Separate transmitting and receiving structures could be provided for duplex operation. For a bit error rate of 10 sup 9 at 100-MHz data rate, a required laser power of 12 mW is calculated based on an estimated total optical loss of 40 dB.

  11. Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

    SciTech Connect

    Tamura, Nobumichi; Chen, Kai; Kunz, Martin

    2009-05-01

    Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature. This paper presents an overview of the principal results obtained from X-ray microdiffraction studies of electromigration effects on aluminum and copper interconnects at the ALS throughout continuous efforts that spanned over a decade (1998-2008) from approximately 40 weeks of combined beamtime.

  12. Method for fabricating an interconnected array of semiconductor devices

    DOEpatents

    Grimmer, Derrick P.; Paulson, Kenneth R.; Gilbert, James R.

    1989-10-10

    Semiconductor layer and conductive layer formed on a flexible substrate, divided into individual devices and interconnected with one another in series by interconnection layers and penetrating terminals.

  13. Epidemics in Interconnected Small-World Networks

    PubMed Central

    Liu, Meng; Li, Daqing; Qin, Pengju; Liu, Chaoran; Wang, Huijuan; Wang, Feilong

    2015-01-01

    Networks can be used to describe the interconnections among individuals, which play an important role in the spread of disease. Although the small-world effect has been found to have a significant impact on epidemics in single networks, the small-world effect on epidemics in interconnected networks has rarely been considered. Here, we study the susceptible-infected-susceptible (SIS) model of epidemic spreading in a system comprising two interconnected small-world networks. We find that the epidemic threshold in such networks decreases when the rewiring probability of the component small-world networks increases. When the infection rate is low, the rewiring probability affects the global steady-state infection density, whereas when the infection rate is high, the infection density is insensitive to the rewiring probability. Moreover, epidemics in interconnected small-world networks are found to spread at different velocities that depend on the rewiring probability. PMID:25799143

  14. Recent Development of SOFC Metallic Interconnect

    SciTech Connect

    Wu JW, Liu XB

    2010-04-01

    Interest in solid oxide fuel cells (SOFC) stems from their higher e±ciencies and lower levels of emitted pollu- tants, compared to traditional power production methods. Interconnects are a critical part in SOFC stacks, which connect cells in series electrically, and also separate air or oxygen at the cathode side from fuel at the anode side. Therefore, the requirements of interconnects are the most demanding, i:e:, to maintain high elec- trical conductivity, good stability in both reducing and oxidizing atmospheres, and close coe±cient of thermal expansion (CTE) match and good compatibility with other SOFC ceramic components. The paper reviewed the interconnect materials, and coatings for metallic interconnect materials.

  15. INTERCONNECTIONS BETWEEN HUMAN HEALTH AND ECOLOGICAL INTEGRITY

    EPA Science Inventory

    Interconnections between Human Health and Ecological Integrity emanates from a June 2000 Pellston Workshop in Snowbird, Utah, USA. Jointly sponsored by the Society of Environmental Toxicology and Chemistry (SETAC) and the Society of Toxicology (SOT), the workshop was motivated by...

  16. Implementation of optical interconnections for VLSI

    NASA Technical Reports Server (NTRS)

    Wu, Wennie H.; Bergman, Larry A.; Johnston, Alan R.; Guest, Clark C.; Esener, Sadik C.

    1987-01-01

    This paper reports on the progress in implementing optical interconnections for VLSI. Four areas are covered: (1) the holographic optical element (HOE), (2) the laser sources, (3) the detectors and associated circuits forming an optically addressed gate, and (4) interconnection experiments in which five gates are actuated from one source. A laser scanner system with a resolution of 12 x 20 microns has been utilized to generate the HOEs. Diffraction efficiency of the HOE and diffracted spot size have been measured. Stock lasers have been modified with a high-frequency package for interconnect experiments, and buried heterostructure fabrication techniques have been pursued. Measurements have been made on the fabricated photodetectors to determine dark current, responsivity, and response time. The optical gates and the overall chip have been driven successfully with an input light beam, as well as with the optical signal interconnected through the one to five holograms.

  17. INTERCONNECTIONS BETWEEN HUMAN HEALTH AND ECOLOGICAL INTEGRITY

    EPA Science Inventory

    Interconnections between Human Health and Ecological Integrity emanates from a June 2000 Pellston Workshop in Snowbird, Utah, USA. Jointly sponsored by the Society of Environmental Toxicology and Chemistry (SETAC) and the Society of Toxicology (SOT), the workshop was motivated by...

  18. Computational continuum modeling of solder interconnects: Applications

    SciTech Connect

    Burchett, S.N.; Neilsen, M.K.; Frear, D.R.

    1997-04-01

    The most commonly used solder for electrical interconnections in electronic packages is the near eutectic 60Sn-40Fb alloy. This alloy has a number of processing advantages (suitable melting point of 183C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue), the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes the prediction of solder joint lifetime complex. A viscoplastic, microstructure dependent, constitutive model for solder, which is currently under development, was implemented into a finite element code. With this computational capability, the thermomechanical response of solder interconnects, including microstructural evolution, can be predicted. This capability was applied to predict the thermomechanical response of a mini ball grid array solder interconnect. In this paper, the constitutive model will first be briefly discussed. The results of computational studies to determine the thermomechanical response of a mini ball grid array solder interconnects then will be presented.

  19. Traffic congestion in interconnected complex networks

    NASA Astrophysics Data System (ADS)

    Tan, Fei; Wu, Jiajing; Xia, Yongxiang; Tse, Chi K.

    2014-06-01

    Traffic congestion in isolated complex networks has been investigated extensively over the last decade. Coupled network models have recently been developed to facilitate further understanding of real complex systems. Analysis of traffic congestion in coupled complex networks, however, is still relatively unexplored. In this paper, we try to explore the effect of interconnections on traffic congestion in interconnected Barabási-Albert scale-free networks. We find that assortative coupling can alleviate traffic congestion more readily than disassortative and random coupling when the node processing capacity is allocated based on node usage probability. Furthermore, the optimal coupling probability can be found for assortative coupling. However, three types of coupling preferences achieve similar traffic performance if all nodes share the same processing capacity. We analyze interconnected Internet autonomous-system-level graphs of South Korea and Japan and obtain similar results. Some practical suggestions are presented to optimize such real-world interconnected networks accordingly.

  20. Traffic congestion in interconnected complex networks.

    PubMed

    Tan, Fei; Wu, Jiajing; Xia, Yongxiang; Tse, Chi K

    2014-06-01

    Traffic congestion in isolated complex networks has been investigated extensively over the last decade. Coupled network models have recently been developed to facilitate further understanding of real complex systems. Analysis of traffic congestion in coupled complex networks, however, is still relatively unexplored. In this paper, we try to explore the effect of interconnections on traffic congestion in interconnected Barabási-Albert scale-free networks. We find that assortative coupling can alleviate traffic congestion more readily than disassortative and random coupling when the node processing capacity is allocated based on node usage probability. Furthermore, the optimal coupling probability can be found for assortative coupling. However, three types of coupling preferences achieve similar traffic performance if all nodes share the same processing capacity. We analyze interconnected Internet autonomous-system-level graphs of South Korea and Japan and obtain similar results. Some practical suggestions are presented to optimize such real-world interconnected networks accordingly.

  1. Silicon Hybrid Wafer Scale Integration Interconnect Evaluation

    DTIC Science & Technology

    1989-12-01

    the assessment of the current state -of-the-art in electromagnetic analyses to determine its applicability to NVSI interconnections. Weak links or... states that transmission line effects are clearly exhibited when the physical length of any component of an electrical system (include interconnections...assumedl for coniduc- tois and dielectrics. Furthermore, all geometric distances arc assuimedl to bie uniform. unless otherwise stated . This assertion

  2. Chemical Dynamics in Energetic Materials Incorporating Aluminum Nanoparticles

    NASA Astrophysics Data System (ADS)

    Lewis, William K.; Harruff, Barbara A.; Fernando, K. A. Shiral; Smith, Marcus J.; Guliants, Elena A.; Bunker, Christopher E.

    2010-06-01

    Aluminum nanoparticles are widely considered attractive as fuels due to the high heat of reaction associated with their oxidation, and the potential for fast reaction due to their small size. However, the reaction dynamics can also be strongly influenced by the passivation layer that coats the reactive metal surface. Typically, this takes the form of a naturally-occurring oxide shell on the nanoparticle, but other passivation schemes are now available. We have recently developed a sonochemical synthesis procedure to produce aluminum nanoparticles capped with oleic acid. These nanoparticles have an aluminum metal core, some organic-provided oxide, and an organic shell. To investigate the effect of the passivation method on the chemical dynamics in energetic materials, we have studied samples consisting of a mixture of a metal nanoparticle fuel and an ammonium nitrate or ammonium perchlorate oxidizer. The metal fuel is either commercially available oxide-coated aluminum nanoparticles, or the oleic acid-capped nanoparticles. The energetic samples are ignited with an IR laser pulse. Following ignition, the chemical dynamics are studied using visible emission spectroscopy and mass spectrometry. Preliminary results suggest that our Al-oleic acid nanoparticles are able to react more rapidly than those that are conventionally passivated with a naturally-occurring oxide shell. K. A. S. Fernando, M. J. Smith, B. A. Harruff, W. K. Lewis, E. A. Guliants and C. E. Bunker J. Phys. Chem. C, 113, 500 (2009).

  3. Navigability of interconnected networks under random failures

    PubMed Central

    De Domenico, Manlio; Solé-Ribalta, Albert; Gómez, Sergio; Arenas, Alex

    2014-01-01

    Assessing the navigability of interconnected networks (transporting information, people, or goods) under eventual random failures is of utmost importance to design and protect critical infrastructures. Random walks are a good proxy to determine this navigability, specifically the coverage time of random walks, which is a measure of the dynamical functionality of the network. Here, we introduce the theoretical tools required to describe random walks in interconnected networks accounting for structure and dynamics inherent to real systems. We develop an analytical approach for the covering time of random walks in interconnected networks and compare it with extensive Monte Carlo simulations. Generally speaking, interconnected networks are more resilient to random failures than their individual layers per se, and we are able to quantify this effect. As an application––which we illustrate by considering the public transport of London––we show how the efficiency in exploring the multiplex critically depends on layers’ topology, interconnection strengths, and walk strategy. Our findings are corroborated by data-driven simulations, where the empirical distribution of check-ins and checks-out is considered and passengers travel along fastest paths in a network affected by real disruptions. These findings are fundamental for further development of searching and navigability strategies in real interconnected systems. PMID:24912174

  4. Navigability of interconnected networks under random failures.

    PubMed

    De Domenico, Manlio; Solé-Ribalta, Albert; Gómez, Sergio; Arenas, Alex

    2014-06-10

    Assessing the navigability of interconnected networks (transporting information, people, or goods) under eventual random failures is of utmost importance to design and protect critical infrastructures. Random walks are a good proxy to determine this navigability, specifically the coverage time of random walks, which is a measure of the dynamical functionality of the network. Here, we introduce the theoretical tools required to describe random walks in interconnected networks accounting for structure and dynamics inherent to real systems. We develop an analytical approach for the covering time of random walks in interconnected networks and compare it with extensive Monte Carlo simulations. Generally speaking, interconnected networks are more resilient to random failures than their individual layers per se, and we are able to quantify this effect. As an application--which we illustrate by considering the public transport of London--we show how the efficiency in exploring the multiplex critically depends on layers' topology, interconnection strengths, and walk strategy. Our findings are corroborated by data-driven simulations, where the empirical distribution of check-ins and checks-out is considered and passengers travel along fastest paths in a network affected by real disruptions. These findings are fundamental for further development of searching and navigability strategies in real interconnected systems.

  5. Scalable IP switching based on optical interconnect

    NASA Astrophysics Data System (ADS)

    Luo, Zhixiang; Cao, Mingcui; Liu, Erwu

    2000-10-01

    IP traffic on the Internet and enterprise networks has been growing exponentially in the last several years, and much attention is being focused on the use of IP multicast for real-time multimedia applications. The current soft and general-purpose CPU-based routers face great stress since they have great latency and low forwarding speeds. Based on the ASICs, layer 2 switching provides high-speed packet forwarding. Integrating high-speed of Layer 2 switching with the flexibility of Layer 3 routing, Layer 3 switching (IP switching) has been put forward in order to avoid the performance bottleneck associated with Layer 3 forwarding. In this paper, we present a prototype system of a scalable IP switching based on scalable ATM switching fabric and optical interconnect. The IP switching system mainly consists of the input/output interface unit, scalable ATM switching fabric and IP control component. Optical interconnects between the input fan-out stage and the interconnect stage, also the interconnect stage and the output concentration stage provide high-speed data paths. And the interconnect stage is composed of 16 X 16 CMOS-SEED ATM switching modules. With 64 ports of OC-12 interface, the maximum throughput of the prototype system is about 20 million packets per second (MPPS) for 256 bytes average packet length, and the packet loss ratio is less than 10e-9. Benefiting from the scalable architecture and the optical interconnect, this IP switching system can easily scale to very large network size.

  6. Passive solar technology

    SciTech Connect

    Watson, D

    1981-04-01

    The present status of passive solar technology is summarized, including passive solar heating, cooling and daylighting. The key roles of the passive solar system designer and of innovation in the building industry are described. After definitions of passive design and a summary of passive design principles are given, performance and costs of passive solar technology are discussed. Passive energy design concepts or methods are then considered in the context of the overall process by which building decisions are made to achieve the integration of new techniques into conventional design. (LEW).

  7. Aluminum: Recycling of Aluminum Dross/Saltcake

    SciTech Connect

    Blazek, S.

    1999-01-29

    As this NICE3 publication details, the objective of this project is to commercialize the process technology to eliminate all landfill waste associated with black dross and saltcake generated from aluminum recycling in the United States.

  8. Laser Dispersion and Ignition of Functionalized Aluminum Particles

    NASA Astrophysics Data System (ADS)

    Horn, Jillian; Lightstone, James; Carney, Joel; Jouet, Jason

    2011-06-01

    Aluminum nanoparticles prepared in solution by decomposition of an organometallic precursor and functionalized with long-chain perfluorinated carboxylic acids have demonstrated increased performance over H5 Al (8 μm) in small scale shock reactivity testspresumably because the oxide coating has been eliminated. Solution phase preparation for this material, however, is unsuitable for large scale production. This talk will highlight a method for large scale production of air-stable passivated aluminum nanoparticles. Aluminum nanocomposite materials with size ranges less than 500 nm have been prepared with various surface passivation/functionalization schemes that eliminate aluminum oxide and reduce the fuel-oxidizer distance to the molecular level. These materials have been characterized to understand the changes in particle size and morphology that occur with different preparation schemes. TGA, DSC, XRD, and IR spectroscopy results will be presented. Additionally, the combustion characteristics of these air stable fluorinated aluminum nanoparticles are studied and compared to untreated aluminum particles using a laser-dispersion and laser-ignition method developed at the Naval Surface Warfare Center, Indian Head Division.

  9. High reliability optical interconnections for short range applications in high performance optical communication systems

    NASA Astrophysics Data System (ADS)

    Rashed, Ahmed Nabih Zaki

    2013-06-01

    This paper has proposed a new progress of optical interconnections, taking into account the following items such as its ultimate device bandwidth, its available transmission bit rates based on soliton transmission technique, its ultimate transmission link bandwidth, and the product of the link bandwidth and its transmission length. Two items of special emphasis in the basic design of optical interconnection are polymethyl metha acrylate (PMMA) and barium fluoride (BaF2) waveguides, and the optical source cast as vertical cavity surface emitting laser diode (VCSELD), made of either AlGaAs at operating wavelength of 1.3 μm or aluminum gallium indium phosphors (AlGaInP) at operating wavelength of 1.55 μm; special emphasis is focused on both the above two items under different operating conditions including both thermal and electrical effects. The optical interconnect is built up on the bases of two VCSELD and one optical link where thermal effects of both diodes and links are included. The good performance of the optical interconnect is deeply and parametrically investigated under wide ranges of the affecting parameters. The high speed performance is processed through three different effects, namely the device 3-dB bandwidth, and the link dispersion characteristics.

  10. Aspects of aluminum toxicity

    SciTech Connect

    Hewitt, C.D.; Savory, J.; Wills, M.R. )

    1990-06-01

    Aluminum is the most abundant metal in the earth's crust. The widespread occurrence of aluminum, both in the environment and in foodstuffs, makes it virtually impossible for man to avoid exposure to this metal ion. Attention was first drawn to the potential role of aluminum as a toxic metal over 50 years ago, but was dismissed as a toxic agent as recently as 15 years ago. The accumulation of aluminum, in some patients with chronic renal failure, is associated with the development of toxic phenomena; dialysis encephalopathy, osteomalacic dialysis osteodystrophy, and an anemia. Aluminum accumulation also occurs in patients who are not on dialysis, predominantly infants and children with immature or impaired renal function. Aluminum has also been implicated as a toxic agent in the etiology of Alzheimer's disease, Guamiam amyotrophic lateral sclerosis, and parkinsonism-dementia. 119 references.

  11. Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

    SciTech Connect

    Tamura, Nobumichi; Chen, Kai; Kunz, Martin

    2009-12-01

    Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature.

  12. Interconnect mechanisms in microelectronic packaging

    NASA Astrophysics Data System (ADS)

    Roma, Maria Penafrancia C.

    alloy showed differences in adhesion strength and IMC formation. Bond strength by wire pull testing showed the 95Ag alloy with higher values while shear bond testing showed the 88Ag higher bond strength. Use of Cu pillars in flip chips and eutectic bonding in wafer level chip scale packages are direct consequences of diminishing interconnect dimension as a result of the drive for miniaturization. The combination of Cu-Sn interdiffusion, Kirkendall mechanism and heterogeneous vacancy precipitation are the main causes of IMC and void formation in Cu pillar - Sn solder - Cu lead frame sandwich structure. However, adding a Ni barrier agent showed less porous IMC layer as well as void formation as a result of the modified Cu and Sn movement well as the void formation. Direct die to die bonding using Al-Ge eutectic bonds is necessary when 3D integration is needed to reduce the footprint of a package. Hermeticity and adhesion strength are a function of the Al/Ge thickness ratio, bonding pressure, temperature and time. Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) allowed imaging of interfacial microstructures, porosity, grain morphology while Scanning Transmission Electron microscope (STEM) provided diffusion profile and confirmed interdiffusion. Ion polishing technique provided information on porosity and when imaged using backscattered mode, grain structure confirmed mechanical deformation of the bonds. Measurements of the interfacial bond strength are made by wire pull tests and ball shear tests based on existing industry standard tests. However, for the Al-Ge eutectic bonds, no standard strength is available so a test is developed using the stud pull test method using the Dage 4000 Plus to yield consistent results. Adhesion strengths of 30-40 MPa are found for eutectic bonded packages however, as low as 20MPa was measured in low temperature bonded areas.

  13. Anodization control for barrier-oxide thinning and 3D interconnected pores and direct electrodeposition of nanowire networks on native aluminium substrates.

    PubMed

    Gillette, Eleanor; Wittenberg, Stefanie; Graham, Lauren; Lee, Kwijong; Rubloff, Gary; Banerjee, Parag; Lee, Sang Bok

    2015-02-07

    Here we report a strategy for combining techniques for pore branching and barrier layer thinning to produce 3D porous anodized aluminum oxide films with direct ohmic contact to the native aluminum. This method provides an example of a rationally designed template which need not be removed from the aluminum, but which is also not constrained to traditional 2D pore geometry. We first demonstrate the barrier layer removal and pore branching techniques independently, and then combine them to produce free standing arrays of interconnected Ni nanostructures. Nickel nanostructures are deposited directly onto the aluminum to demonstrate the success of the structural modification, and showcase the potential for these films to be used as templates. This approach is the first to demonstrate the design and execution of multiple pore modification techniques in the same membrane, and demonstrates the first directly deposited 3D structures on aluminum substrates.

  14. BONDING ALUMINUM METALS

    DOEpatents

    Noland, R.A.; Walker, D.E.

    1961-06-13

    A process is given for bonding aluminum to aluminum. Silicon powder is applied to at least one of the two surfaces of the two elements to be bonded, the two elements are assembled and rubbed against each other at room temperature whereby any oxide film is ruptured by the silicon crystals in the interface; thereafter heat and pressure are applied whereby an aluminum-silicon alloy is formed, squeezed out from the interface together with any oxide film, and the elements are bonded.

  15. Aluminum powder metallurgy processing

    SciTech Connect

    Flumerfelt, J.F.

    1999-02-12

    The objective of this dissertation is to explore the hypothesis that there is a strong linkage between gas atomization processing conditions, as-atomized aluminum powder characteristics, and the consolidation methodology required to make components from aluminum powder. The hypothesis was tested with pure aluminum powders produced by commercial air atomization, commercial inert gas atomization, and gas atomization reaction synthesis (GARS). A comparison of the GARS aluminum powders with the commercial aluminum powders showed the former to exhibit superior powder characteristics. The powders were compared in terms of size and shape, bulk chemistry, surface oxide chemistry and structure, and oxide film thickness. Minimum explosive concentration measurements assessed the dependence of explosibility hazard on surface area, oxide film thickness, and gas atomization processing conditions. The GARS aluminum powders were exposed to different relative humidity levels, demonstrating the effect of atmospheric conditions on post-atomization processing conditions. The GARS aluminum powders were exposed to different relative humidity levels, demonstrating the effect of atmospheric conditions on post-atomization oxidation of aluminum powder. An Al-Ti-Y GARS alloy exposed in ambient air at different temperatures revealed the effect of reactive alloy elements on post-atomization powder oxidation. The pure aluminum powders were consolidated by two different routes, a conventional consolidation process for fabricating aerospace components with aluminum powder and a proposed alternative. The consolidation procedures were compared by evaluating the consolidated microstructures and the corresponding mechanical properties. A low temperature solid state sintering experiment demonstrated that tap densified GARS aluminum powders can form sintering necks between contacting powder particles, unlike the total resistance to sintering of commercial air atomization aluminum powder.

  16. Aluminum Cartridge Case Concept

    DTIC Science & Technology

    2005-05-01

    carried by the soldier, a lightweight alternative to the brass cartridge case is an aluminum cartridge case. This comprehensive detailed report describes...AD AD-E403 044 Technical Report ARAEW-TR-05003 ALUMINUM CARTRIDGE CASE CONCEPT Brian Tasson ATK Ordnance and Ground Systems LLC 4700 Nathan Lane...TITLE AND SUBTITLE 5a. CONTRACT NUMBER DAAE30-03-C-1 128 ALUMINUM CARTRIDGE CASE CONCEPT 5b. GRANT NUMBER 5c. PROGRAM ELEMENT NUMBER 6. AUTHORS 5d

  17. Committed regional electrical interconnection projects in the Middle East

    SciTech Connect

    Azzam, M.; Al-Said, A.

    1994-12-01

    Due to the well-known advantages of electrical interconnections and their consequent benefits, Jordan considers the interconnection of its electrical network with the neighboring electrical networks as one of its main corporate strategies. At present the electrical interconnection project of the networks of Egypt, Iraq, Jordan, Syria, and Turkey is progressing. To achieve this interconnection project, two feasibility studies were conducted: interconnection of the Egyptian and Jordanian electrical power systems; interconnection of the electrical networks of Egypt, Iraq, Jordan, Syria, and Turkey (EIJST interconnection). This presentation reviews these studies and their results.

  18. Carbothermic Aluminum Production Using Scrap Aluminum As A Coolant

    DOEpatents

    LaCamera, Alfred F.

    2002-11-05

    A process for producing aluminum metal by carbothermic reduction of alumina ore. Alumina ore is heated in the presence of carbon at an elevated temperature to produce an aluminum metal body contaminated with about 10-30% by wt. aluminum carbide. Aluminum metal or aluminum alloy scrap then is added to bring the temperature to about 900-1000.degree. C. and precipitate out aluminum carbide. The precipitated aluminum carbide is filtered, decanted, or fluxed with salt to form a molten body having reduced aluminum carbide content.

  19. Metastable nanosized aluminum powder as a reactant in energetic formulations

    SciTech Connect

    Katz, J.; Tepper, F.; Ivanov, G.V.; Lerner, M.I.; Davidovich, V.

    1998-12-01

    Aluminum powder is an important ingredient in many propellant, explosives and pyrotechnic applications. The production of nanosized aluminum powder by the electroexplosion of metal wire has been practices in the former USSR since the mid 1970`s. Differential scanning calorimetry, differential thermal analysis and x-ray phase analysis was performed on aluminum powder both before and after air passivation, as well as aluminum that was protected under kerosene, pentane, toluene and hexane. Earlier Soviet reports of unexplained thermal releases and metastable behavior have been investigated. Anomalous behavior previously reported included phase transformations at temperatures far below melting with the release of heat and chemoluminescence and self sintering of particles with a heat release large enough to melt the powders.

  20. High energy density aluminum battery

    DOEpatents

    Brown, Gilbert M.; Paranthaman, Mariappan Parans; Dai, Sheng; Dudney, Nancy J.; Manthiram, Arumugan; McIntyre, Timothy J.; Sun, Xiao-Guang; Liu, Hansan

    2016-10-11

    Compositions and methods of making are provided for a high energy density aluminum battery. The battery comprises an anode comprising aluminum metal. The battery further comprises a cathode comprising a material capable of intercalating aluminum or lithium ions during a discharge cycle and deintercalating the aluminum or lithium ions during a charge cycle. The battery further comprises an electrolyte capable of supporting reversible deposition and stripping of aluminum at the anode, and reversible intercalation and deintercalation of aluminum or lithium at the cathode.

  1. Fundamental studies on passivity and passivity breakdown

    SciTech Connect

    Macdonald, D.D.; Urquidi-Macdonald, M.

    1993-06-01

    Using photoelectrochemical impedance and admittance spectroscopies, a fundamental and quantitative understanding of the mechanisms for the growth and breakdown of passive films on metal and alloy surfaces in contact with aqueous environments is being developed. A point defect model has been extended to explain the breakdown of passive films, leading to pitting and crack growth and thus development of damage due to localized corrosion.

  2. Design of reconfigurable GRIN planar optical interconnects

    NASA Astrophysics Data System (ADS)

    Gomez-Reino, C.; Flores-Arias, M. T.; Perez, M. V.; Bao, C.; Castelo, A.; Nieto, D.

    2008-04-01

    Design of all-optics reconfigurable GRIN (Gradient-Index) planar structure for crossover and parallel interconnects will be presented. Design represents a unique combination of GRIN materials, simple geometry optics and waveguide technology for both parallel and distributed processing and communication networks. The optical analysis is based on-axis and off-axis multiple imaging property of GRIN components. The analysis includes the study of the Point Spread Function (PSF) for describing the performance of the GRIN planar structure and the evaluation of the Space Bandwidth Product (SBP) for estimating the number of channels which can be handled. The dependence of the number of channels on the wavelength of the light and the aperture of the planar interconnect is shown. The results are given for five working wavelengths of Laser Diode (LD) and for four transverse aperture of reconfigurable optical interconnect.

  3. Random walk centrality in interconnected multilayer networks

    NASA Astrophysics Data System (ADS)

    Solé-Ribalta, Albert; De Domenico, Manlio; Gómez, Sergio; Arenas, Alex

    2016-06-01

    Real-world complex systems exhibit multiple levels of relationships. In many cases they require to be modeled as interconnected multilayer networks, characterizing interactions of several types simultaneously. It is of crucial importance in many fields, from economics to biology and from urban planning to social sciences, to identify the most (or the less) influent nodes in a network using centrality measures. However, defining the centrality of actors in interconnected complex networks is not trivial. In this paper, we rely on the tensorial formalism recently proposed to characterize and investigate this kind of complex topologies, and extend two well known random walk centrality measures, the random walk betweenness and closeness centrality, to interconnected multilayer networks. For each of the measures we provide analytical expressions that completely agree with numerically results.

  4. Optical transceivers for interconnections in satellite payloads

    NASA Astrophysics Data System (ADS)

    Karppinen, Mikko; Heikkinen, Veli; Juntunen, Eveliina; Kautio, Kari; Ollila, Jyrki; Sitomaniemi, Aila; Tanskanen, Antti

    2013-02-01

    The increasing data rates and processing on board satellites call for the use of photonic interconnects providing high-bitrate performance as well as valuable savings in mass and volume. Therefore, optical transmitter and receiver technology is developed for aerospace applications. The metal-ceramic-packaging with hermetic fiber pigtails enables robustness for the harsh spacecraft environment, while the 850-nm VCSEL-based transceiver technology meets the high bit-rate and low power requirements. The developed components include 6 Gbps SpaceFibre duplex transceivers for intra-satellite data links and 40 Gbps parallel optical transceivers for board-to-board interconnects. Also, integration concept of interchip optical interconnects for onboard processor ICs is presented.

  5. The motion of interconnected flexible bodies

    NASA Technical Reports Server (NTRS)

    Hopkins, A. S.

    1975-01-01

    The equations of motion for an arbitrarily interconnected collection of substructures are derived. The substructures are elastic bodies which may be idealized as finite element assemblies and are subject to small deformations relative to a nominal state. Interconnections between the elastic substructures permit large relative translations and rotations between substructures, governed by Pfaffian constraints describing the connections. Screw connections (permitting rotation about and translation along a single axis) eliminate constraint forces and incorporate modal coupling. The problem of flexible spacecraft simulation is discussed. Hurty's component mode approach is extended by permitting interconnected elastic substructures large motions relative to each other and relative to inertial space. The hybrid coordinate methods are generalized by permitting all substructures to be flexible (rather than only the terminal members of a topological tree of substructures). The basic relationships of continuum mechanics are developed.

  6. Interconnection Testing of Distributed Resources: Preprint

    SciTech Connect

    Kroposki, B.; Basso, T.; DeBlasio, R.

    2004-02-01

    With the publication of IEEE 1547-2003(TM) Standard for Interconnecting Distributed Resources With Electric Power Systems, the electric power industry has a need to develop tests and procedures to verify that interconnection equipment meets 1547 technical requirements. A new standard, IEEE P1547.1(TM), is being written to give detailed tests and procedures for confirming that equipment meets the interconnection requirements. The National Renewable Energy Laboratory has been validating test procedures being developed as part of IEEE P1547.1. As work progresses on the validation of those procedures, information and test reports are passed on to the working group of IEEE P1547.1 for future revisions.

  7. Automotion of domain walls for spintronic interconnects

    SciTech Connect

    Nikonov, Dmitri E.; Manipatruni, Sasikanth; Young, Ian A.

    2014-06-07

    We simulate “automotion,” the transport of a magnetic domain wall under the influence of demagnetization and magnetic anisotropy, in nanoscale spintronic interconnects. In contrast to spin transfer driven magnetic domain wall motion, the proposed interconnects operate without longitudinal charge current transfer, with only a transient current pulse at domain wall creation and have favorable scaling down to the 20 nm dimension. Cases of both in-plane and out-of-plane magnetization are considered. Analytical dependence of the velocity of domain walls on the angle of magnetization are compared with full micromagnetic simulations. Deceleration, attenuation and disappearance, and reflection of domain walls are demonstrated through simulation. Dependences of the magnetization angle on the current pulse parameters are studied. The energy and delay analysis suggests that automotion is an attractive option for spintronic logic interconnects.

  8. Is the Aluminum Hypothesis Dead?

    PubMed Central

    2014-01-01

    The Aluminum Hypothesis, the idea that aluminum exposure is involved in the etiology of Alzheimer disease, dates back to a 1965 demonstration that aluminum causes neurofibrillary tangles in the brains of rabbits. Initially the focus of intensive research, the Aluminum Hypothesis has gradually been abandoned by most researchers. Yet, despite this current indifference, the Aluminum Hypothesis continues to attract the attention of a small group of scientists and aluminum continues to be viewed with concern by some of the public. This review article discusses reasons that mainstream science has largely abandoned the Aluminum Hypothesis and explores a possible reason for some in the general public continuing to view aluminum with mistrust. PMID:24806729

  9. Is the Aluminum Hypothesis dead?

    PubMed

    Lidsky, Theodore I

    2014-05-01

    The Aluminum Hypothesis, the idea that aluminum exposure is involved in the etiology of Alzheimer disease, dates back to a 1965 demonstration that aluminum causes neurofibrillary tangles in the brains of rabbits. Initially the focus of intensive research, the Aluminum Hypothesis has gradually been abandoned by most researchers. Yet, despite this current indifference, the Aluminum Hypothesis continues to attract the attention of a small group of scientists and aluminum continues to be viewed with concern by some of the public. This review article discusses reasons that mainstream science has largely abandoned the Aluminum Hypothesis and explores a possible reason for some in the general public continuing to view aluminum with mistrust.

  10. Aluminum: Reducing chloride emissions from aluminum production

    SciTech Connect

    Simon, P.

    1999-09-29

    Reynolds Metals Company (RMC), with assistance from a NICE{sup 3} grant, is developing for commercialization a closed-loop control process that greatly reduces chlorine emissions and increases plant efficiency while maintaining metal quality. The process still utilizes chlorine to remove impurities during aluminum processing, but is more effective than current methods. With the new technology chlorine in the stack is monitored and input chlorine is adjusted continuously. This optimization of chlorine use results in substantially less waste because less chlorine has to be bought or produced by aluminum manufacturers. This innovation is a significant improvement over conventional aluminum treatments, in which chlorine is injected in a more costly and wasteful manner. By the year 2010, the new technology has the potential to reduce the energy it takes to create chlorine by 8.4 billion Btu per year and to cut greenhouse gas emissions by 1,377 tons per year.

  11. Laser printing of 3D metallic interconnects

    NASA Astrophysics Data System (ADS)

    Beniam, Iyoel; Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Raymond C. Y.; Piqué, Alberto

    2016-04-01

    The use of laser-induced forward transfer (LIFT) techniques for the printing of functional materials has been demonstrated for numerous applications. The printing gives rise to patterns, which can be used to fabricate planar interconnects. More recently, various groups have demonstrated electrical interconnects from laser-printed 3D structures. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or of pastes containing dispersed metallic particles. However, the generated 3D structures do not posses the same metallic conductivity as a bulk metal interconnect of the same cross-section and length as those formed by wire bonding or tab welding. An alternative is to laser transfer entire 3D structures using a technique known as lase-and-place. Lase-and-place is a LIFT process whereby whole components and parts can be transferred from a donor substrate onto a desired location with one single laser pulse. This paper will describe the use of LIFT to laser print freestanding, solid metal foils or beams precisely over the contact pads of discrete devices to interconnect them into fully functional circuits. Furthermore, this paper will also show how the same laser can be used to bend or fold the bulk metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief for the circuits under flexing or during motion from thermal mismatch. These interconnect "ridges" can span wide gaps (on the order of a millimeter) and accommodate height differences of tens of microns between adjacent devices. Examples of these laser printed 3D metallic bridges and their role in the development of next generation electronics by additive manufacturing will be presented.

  12. Anodizing Aluminum with Frills.

    ERIC Educational Resources Information Center

    Doeltz, Anne E.; And Others

    1983-01-01

    "Anodizing Aluminum" (previously reported in this journal) describes a vivid/relevant laboratory experience for general chemistry students explaining the anodizing of aluminum in sulfuric acid and constrasting it to electroplating. Additions to this procedure and the experiment in which they are used are discussed. Reactions involved are…

  13. Aluminum space frame technology

    SciTech Connect

    Birch, S.

    1994-01-01

    This article examines the increased application of aluminum to the construction of automobile frames. The topics of the article include a joint venture between Audi and Alcoa, forms in which aluminum is used, new alloys and construction methods, meeting rigidity and safety levels, manufacturing techniques, the use of extrusions, die casting, joining techniques, and pollution control during manufacturing.

  14. Anodizing Aluminum with Frills.

    ERIC Educational Resources Information Center

    Doeltz, Anne E.; And Others

    1983-01-01

    "Anodizing Aluminum" (previously reported in this journal) describes a vivid/relevant laboratory experience for general chemistry students explaining the anodizing of aluminum in sulfuric acid and constrasting it to electroplating. Additions to this procedure and the experiment in which they are used are discussed. Reactions involved are…

  15. Passive storage technologies

    NASA Technical Reports Server (NTRS)

    Kittel, P.

    1984-01-01

    Advances in storage technology and how passive techniques could be applied to the storage of propellants at the space station are described. The devices considered are passive orbital disconnect struts, cooled shield optimization, liftweight shields and catalytic converters.

  16. Tropospheric Passive Remote Sensing

    NASA Technical Reports Server (NTRS)

    Keafer, L. S., Jr. (Editor)

    1982-01-01

    The long term role of airborne/spaceborne passive remote sensing systems for tropospheric air quality research and the identification of technology advances required to improve the performance of passive remote sensing systems were discussed.

  17. Graphene Nanoribbons (GNRs) for Future Interconnect

    NASA Astrophysics Data System (ADS)

    Saptono Duryat, Rahmat

    2016-05-01

    Selecting and developing materials for the future devices require a sound understanding of design requirements. Miniaturization of electronic devices, as commonly expressed by Moore Law, has involved the integration level. Increase of the level has caused some consequences in the design and selection of materials for interconnection. The present paper deals with the challenge of materials design and selection beyond the nanoscale limit and the ability of traditional materials to cope with. One of the emerging materials, i.e. Graphene, will be reviewed with particular reference to its characteristics and potentials for future interconnection.

  18. Planarization of metal films for multilevel interconnects

    DOEpatents

    Tuckerman, D.B.

    1985-08-23

    In the fabrication of multilevel integrated circuits, each metal layer is planarized by heating to momentarily melt the layer. The layer is melted by sweeping laser pulses of suitable width, typically about 1 microsecond duration, over the layer in small increments. The planarization of each metal layer eliminates irregular and discontinuous conditions between successive layers. The planarization method is particularly applicable to circuits having ground or power planes and allows for multilevel interconnects. Dielectric layers can also be planarized to produce a fully planar multilevel interconnect structure. The method is useful for the fabrication of VLSI circuits, particularly for wafer-scale integration.

  19. Planarization of metal films for multilevel interconnects

    SciTech Connect

    Tuckerman, David B.

    1987-01-01

    In the fabrication of multilevel integrated circuits, each metal layer is anarized by heating to momentarily melt the layer. The layer is melted by sweeping laser pulses of suitable width, typically about 1 microsecond duration, over the layer in small increments. The planarization of each metal layer eliminates irregular and discontinuous conditions between successive layers. The planarization method is particularly applicable to circuits having ground or power planes and allows for multilevel interconnects. Dielectric layers can also be planarized to produce a fully planar multilevel interconnect structure. The method is useful for the fabrication of VLSI circuits, particularly for wafer-scale integration.

  20. Planarization of metal films for multilevel interconnects

    DOEpatents

    Tuckerman, David B.

    1989-01-01

    In the fabrication of multilevel integrated circuits, each metal layer is anarized by heating to momentarily melt the layer. The layer is melted by sweeping laser pulses of suitable width, typically about 1 microsecond duration, over the layer in small increments. The planarization of each metal layer eliminates irregular and discontinuous conditions between successive layers. The planarization method is particularly applicable to circuits having ground or power planes and allows for multilevel interconnects. Dielectric layers can also be planarized to produce a fully planar multilevel interconnect structure. The method is useful for the fabrication of VLSI circuits, particularly for wafer-scale integration.

  1. Planarization of metal films for multilevel interconnects

    DOEpatents

    Tuckerman, D.B.

    1985-06-24

    In the fabrication of multilevel integrated circuits, each metal layer is planarized by heating to momentarily melt the layer. The layer is melted by sweeping lase pulses of suitable width, typically about 1 microsecond duration, over the layer in small increments. The planarization of each metal layer eliminates irregular and discontinuous conditions between successive layers. The planarization method is particularly applicable to circuits having ground or power planes and allows for multilevel interconnects. Dielectric layers can also be planarized to produce a fully planar multilevel interconnect structure. The method is useful for the fabrication of VLSI circuits, particularly for wafer-scale integration.

  2. Planarization of metal films for multilevel interconnects

    SciTech Connect

    Tuckerman, D.B.

    1989-03-21

    In the fabrication of multilevel integrated circuits, each metal layer is planarized by heating to momentarily melt the layer. The layer is melted by sweeping laser pulses of suitable width, typically about 1 microsecond duration, over the layer in small increments. The planarization of each metal layer eliminates irregular and discontinuous conditions between successive layers. The planarization method is particularly applicable to circuits having ground or power planes and allows for multilevel interconnects. Dielectric layers can also be planarized to produce a fully planar multilevel interconnect structure. The method is useful for the fabrication of VLSI circuits, particularly for wafer-scale integration. 6 figs.

  3. Planarization of metal films for multilevel interconnects

    DOEpatents

    Tuckerman, D.B.

    1989-03-21

    In the fabrication of multilevel integrated circuits, each metal layer is planarized by heating to momentarily melt the layer. The layer is melted by sweeping laser pulses of suitable width, typically about 1 microsecond duration, over the layer in small increments. The planarization of each metal layer eliminates irregular and discontinuous conditions between successive layers. The planarization method is particularly applicable to circuits having ground or power planes and allows for multilevel interconnects. Dielectric layers can also be planarized to produce a fully planar multilevel interconnect structure. The method is useful for the fabrication of VLSI circuits, particularly for wafer-scale integration. 6 figs.

  4. Packaging considerations for planar optical interconnection systems.

    PubMed

    Acklin, B; Jahns, J

    1994-03-10

    We discuss various aspects of building an integrated optoelectronic system that is based on the concept of planar optics. A particular optical interconnection system has been fabricated and demonstrated. It provides parallel interconnections with 1024 optical channels that could be useful as an optical backplane in an optoelectronic multichip module. We consider the design and the fabrication of the optical system, schemes for the hybrid integration with optoelectronic device arrays, and the thermal management of an integrated system. The proposed hybrid integration scheme is based on mature technologies such as thermal anodic bonding and flip-chip bonding. Possibilities for efficient heat sinking are described.

  5. Aluminum structural applications

    SciTech Connect

    Lucas, G.

    1996-05-01

    Extensive research by aluminum producers and automakers in the 1980s resulted in the development of technologies that enable building of aluminum cars that meet and exceed all the expectations of today`s drivers and passengers, yet weigh several hundred pounds less than their steel counterparts. The Acura NSX sports car, the Audi A8, and the Jaguar XJ220 have all been introduced. Ford has built 40 aluminum-intensive automobiles based on the Taurus/Sable for test purposes, and General Motors recently announced an aluminum-structured electric vehicle. The design flexibility that aluminum allows is shown by these examples. Each uses a somewhat different technology that is particularly suited to the vehicle and its market.

  6. The Aluminum Smelting Process

    PubMed Central

    2014-01-01

    This introduction to the industrial primary aluminum production process presents a short description of the electrolytic reduction technology, the history of aluminum, and the importance of this metal and its production process to modern society. Aluminum's special qualities have enabled advances in technologies coupled with energy and cost savings. Aircraft capabilities have been greatly enhanced, and increases in size and capacity are made possible by advances in aluminum technology. The metal's flexibility for shaping and extruding has led to architectural advances in energy-saving building construction. The high strength-to-weight ratio has meant a substantial reduction in energy consumption for trucks and other vehicles. The aluminum industry is therefore a pivotal one for ecological sustainability and strategic for technological development. PMID:24806722

  7. Roll and pitch independently tuned interconnected suspension: modelling and dynamic analysis

    NASA Astrophysics Data System (ADS)

    Xu, Guangzhong; Zhang, Nong; Roser, Holger M.

    2015-12-01

    In this paper, a roll and pitch independently tuned hydraulically interconnected passive suspension is presented. Due to decoupling of vibration modes and the improved lateral and longitudinal stability, the stiffness of individual suspension spring can be reduced for improving ride comfort and road grip. A generalised 14 degree-of-freedom nonlinear vehicle model with anti-roll bars is established to investigate the vehicle ride and handling dynamic responses. The nonlinear fluidic model of the hydraulically interconnected suspension is developed and integrated with the full vehicle model to investigate the anti-roll and anti-pitch characteristics. Time domain analysis of the vehicle model with the proposed suspension is conducted under different road excitations and steering/braking manoeuvres. The dynamic responses are compared with conventional suspensions to demonstrate the potential of enhanced ride and handling performance. The results illustrate the model-decoupling property of the hydraulically interconnected system. The anti-roll and anti-pitch performance could be tuned independently by the interconnected systems. With the improved anti-roll and anti-pitch characteristics, the bounce stiffness and ride damping can be optimised for better ride comfort and tyre grip.

  8. Communication Requirements and Interconnect Optimization forHigh-End Scientific Applications

    SciTech Connect

    Kamil, Shoaib; Oliker, Leonid; Pinar, Ali; Shalf, John

    2007-11-12

    The path towards realizing peta-scale computing isincreasingly dependent on building supercomputers with unprecedentednumbers of processors. To prevent the interconnect from dominating theoverall cost of these ultra-scale systems, there is a critical need forhigh-performance network solutions whose costs scale linearly with systemsize. This work makes several unique contributions towards attaining thatgoal. First, we conduct one of the broadest studies to date of high-endapplication communication requirements, whose computational methodsinclude: finite-difference, lattice-bolzmann, particle in cell, sparselinear algebra, particle mesh ewald, and FFT-based solvers. Toefficiently collect this data, we use the IPM (Integrated PerformanceMonitoring) profiling layer to gather detailed messaging statistics withminimal impact to code performance. Using the derived communicationcharacterizations, we next present fit-trees interconnects, a novelapproach for designing network infrastructure at a fraction of thecomponent cost of traditional fat-tree solutions. Finally, we propose theHybrid Flexibly Assignable Switch Topology (HFAST) infrastructure, whichuses both passive (circuit) and active (packet) commodity switchcomponents to dynamically reconfigure interconnects to suit thetopological requirements of scientific applications. Overall ourexploration leads to a promising directions for practically addressingthe interconnect requirements of future peta-scale systems.

  9. Extended Range Passive Wireless Tag System and Method

    NASA Technical Reports Server (NTRS)

    Fink, Patrick W. (Inventor); Kennedy, Timothy F. (Inventor); Lin, Gregory Y. (Inventor)

    2013-01-01

    A passive wireless tag assembly comprises a plurality of antennas and transmission lines interconnected with circuitry and constructed and arranged in a Van Atta array or configuration to reflect an interrogator signal in the direction from where it came. The circuitry may comprise at least one surface acoustic wave (SAW)-based circuit that functions as a signal reflector and is operatively connected with an information circuit. In another embodiment, at least one delay circuit and/or at least one passive modulation circuit(s) are utilized. In yet another embodiment, antennas connected to SAW-based devices are mounted to at least one of the orthogonal surfaces of a corner reflector.

  10. Optical Filters, Modulators and Interconnects for Optical Communication Systems

    NASA Astrophysics Data System (ADS)

    Han, Sang-Kook

    This dissertation describes the theoretical and experimental studies on the guided wave optical devices in the InGaAlAs/InP material system and the integration of the optical devices which utilize single quantum well (SQW) as well as multi-quantum well (MQW) structures. This study encompasses the fabrication and characterization of passive ridge waveguides, efficient phase modulators using the quadratic electro-optic effect, as well as efficient, narrow bandwidth wavelength filters. For the purpose of the monolithic integration of an SQW laser diode with an MQW modulator in GaAs/AlGaAs without a complex regrowth process, an impurity-induced layer disordering (IILD) technique is used to facilitate a novel tapered waveguide interconnect structure. The narrow bandwidth and widely tunable wavelength filters are essential for the implementation of highly dense wavelength-division-multiplexers/demultiplexers (WDM) in multi-wavelength optical networks and systems. The vertically stacked directional coupler structure wavelength filter device operating at 1.55 μm which permits the maximum asymmetry possible in directional coupler devices to achieve a narrow bandwidth is presented. The quaternary InGaAlAs layers grown on InP substrate are used and it facilitates larger tunability due to material dispersion. The spectral index method and coupled mode theory are used for theoretical calculations of the filter response. The characteristics of the filter are measured and the tunability of the device is discussed. An array of many filters with different center wavelength in a single chip is studied and a relatively broad range of center wavelength is easily obtained by a small variation in the design of the structure. To achieve an integration of a high gain SQW laser diode and an MQW electroabsorption intensity modulator with a high on/off ratio, we utilize a tapered waveguide interconnect using an IILD technique which permits transfer of the energy generated in an SQW laser

  11. Exabits/s integrated photonic interconnection technology for flexible data-centric optical networks

    NASA Astrophysics Data System (ADS)

    Binh, Le N.; Tao, Thomas W.; Ning, Gordon L.

    2016-03-01

    Optical networking is evolving from classical service-provider base data-center centric (DCC) internetworking environment with massive capacity, hence demanding novel optical switching and interconnecting technologies. The traditional telecom networks are under a flattening transformation to meet challenges from DCC networks for massive capacity serving in order of multi-Pb/s. We present proposed distributed and concentric data center based networks and the essential optical interconnection technologies, from the photonic kernels to electronic and optoelectronic server clusters, in both passive and active structures. Optical switching devices and integrated matrices are proposed composing of tunable (bandwidth and center wavelength) optical filters and switches as well as resonant microring modulators (μRM)(switching and spectral demux/mux) for multi-wavelength flexible-bandwidth optical channels of aggregate capacity reaching Ebps. The design principles and some experimental results are also reported.

  12. Demonstration of heterogeneous III-V/Si integration with a compact optical vertical interconnect access.

    PubMed

    Ng, Doris Keh Ting; Wang, Qian; Pu, Jing; Lim, Kim Peng; Wei, Yongqiang; Wang, Yadong; Lai, Yicheng; Ho, Seng Tiong

    2013-12-15

    Heterogeneous III-V/Si integration with a compact optical vertical interconnect access is fabricated and the light coupling efficiency between the III-V/Si waveguide and the silicon nanophotonic waveguide is characterized. The III-V semiconductor material is directly bonded to the silicon-on-insulator (SOI) substrate and etched to form the III-V/Si waveguide for a higher light confinement in the active region. The compact optical vertical interconnect access is formed through tapering a III-V and an SOI layer in the same direction. The measured III-V/Si waveguide has a light coupling efficiency above ~90% to the silicon photonic layer with the tapering structure. This heterogeneous and light coupling structure can provide an efficient platform for photonic systems on chip, including passive and active devices.

  13. Silicon microring-based signal modulation for chip-scale optical interconnection

    NASA Astrophysics Data System (ADS)

    Zhang, Lin; Li, Yunchu; Song, Muping; Yang, Jeng-Yuan; Beausoleil, Raymond G.; Willner, Alan E.

    2009-06-01

    Electro-optic modulation plays a critical role in implementing space-, power- and spectrally efficient optical interconnection for high-capacity computing systems. Microring resonators exhibit a great potential to achieve compact, low power-consumption and high-speed modulators. In this paper, we briefly review our efforts on designing and analyzing the microring modulators. Three types of single-ring modulators are discussed, from device behavior to possible system impact. We then present two novel double-ring modulators in which a passive ring resonator is added, enabling higher operation speed and lower power consumption. We also describe an opportunity of introducing phase modulation data formats into the on-chip communication environment. In this paper, our emphasis is placed on linking the devices’ physics to their system performance and providing potential technical solutions to physical-layer challenges of optical interconnection.

  14. 47 CFR 51.305 - Interconnection.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... service quality as perceived by end users, and includes, but is not limited to, service quality as... Telecommunication FEDERAL COMMUNICATIONS COMMISSION (CONTINUED) COMMON CARRIER SERVICES (CONTINUED) INTERCONNECTION... described in § 51.319; (3) That is at a level of quality that is equal to that which the incumbent LEC...

  15. Vector Lyapunov Functions for Stochastic Interconnected Systems

    NASA Technical Reports Server (NTRS)

    Boussalis, D.

    1985-01-01

    Theoretical paper presents set of sufficient conditions for asymptotic and exponential stability with probability 1 for class of stochastic interconnected systems. Theory applicable to complicated, large-scale mechanical or electrical systems, and, for several design problems, it reduces computational difficulty by relating stability criteria to fundamental structural features of system.

  16. A continuum model for interconnected lattice trusses

    NASA Technical Reports Server (NTRS)

    Balakrishnan, A. V.

    1992-01-01

    A continuum model for interconnected lattice trusses based on the 1D Timoshenko beam approximation is developed using the NASA-LRC Phase Zero Evolutionary Model. The continuum model dynamics is presented in the canonical wave-equation form in a Hilbert space.

  17. Organization of Systems with Bussed Interconnections

    DTIC Science & Technology

    1992-03-01

    arrangement of modules. For general arrangements, arbitration time grows linearly with number of busses, while for linear arrangements, *1.4 .,-B2’ZT TE•.1...for linear arrangements, arbitration time is constant. Keywords: arbitration with busses, binomial arbitration, bussed interconnections, busses...demonstrating the superiority of binomial arbitration for general arrangements of modules under the digital transmission line model. For linear

  18. 14 CFR 27.674 - Interconnected controls.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Interconnected controls. 27.674 Section 27.674 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION, DEPARTMENT OF TRANSPORTATION AIRCRAFT AIRWORTHINESS STANDARDS: NORMAL CATEGORY ROTORCRAFT Design and Construction Control Systems §...

  19. 14 CFR 29.674 - Interconnected controls.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 14 Aeronautics and Space 1 2011-01-01 2011-01-01 false Interconnected controls. 29.674 Section 29.674 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION, DEPARTMENT OF TRANSPORTATION AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Design and Construction Control Systems §...

  20. 14 CFR 27.674 - Interconnected controls.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 14 Aeronautics and Space 1 2011-01-01 2011-01-01 false Interconnected controls. 27.674 Section 27.674 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION, DEPARTMENT OF TRANSPORTATION AIRCRAFT AIRWORTHINESS STANDARDS: NORMAL CATEGORY ROTORCRAFT Design and Construction Control Systems §...

  1. 14 CFR 29.674 - Interconnected controls.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Interconnected controls. 29.674 Section 29.674 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION, DEPARTMENT OF TRANSPORTATION AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Design and Construction Control Systems §...

  2. 14 CFR 23.701 - Flap interconnection.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... STANDARDS: NORMAL, UTILITY, ACROBATIC, AND COMMUTER CATEGORY AIRPLANES Design and Construction Control Systems § 23.701 Flap interconnection. (a) The main wing flaps and related movable surfaces as a system... independent of the flap drive system; or by an approved equivalent means; or (2) Be designed so that...

  3. 14 CFR 23.701 - Flap interconnection.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... STANDARDS: NORMAL, UTILITY, ACROBATIC, AND COMMUTER CATEGORY AIRPLANES Design and Construction Control Systems § 23.701 Flap interconnection. (a) The main wing flaps and related movable surfaces as a system... independent of the flap drive system; or by an approved equivalent means; or (2) Be designed so that...

  4. 14 CFR 23.701 - Flap interconnection.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... STANDARDS: NORMAL, UTILITY, ACROBATIC, AND COMMUTER CATEGORY AIRPLANES Design and Construction Control Systems § 23.701 Flap interconnection. (a) The main wing flaps and related movable surfaces as a system... independent of the flap drive system; or by an approved equivalent means; or (2) Be designed so that...

  5. 14 CFR 23.701 - Flap interconnection.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... STANDARDS: NORMAL, UTILITY, ACROBATIC, AND COMMUTER CATEGORY AIRPLANES Design and Construction Control Systems § 23.701 Flap interconnection. (a) The main wing flaps and related movable surfaces as a system... independent of the flap drive system; or by an approved equivalent means; or (2) Be designed so that...

  6. Laser printed interconnects for flexible electronics

    NASA Astrophysics Data System (ADS)

    Pique, Alberto; Beniam, Iyoel; Mathews, Scott; Charipar, Nicholas

    Laser-induced forward transfer (LIFT) can be used to generate microscale 3D structures for interconnect applications non-lithographically. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or dispersed metallic nanoparticles. However, the resulting 3D structures do not achieve the bulk conductivity of metal interconnects of the same cross-section and length as those formed by wire bonding or tab welding. It is possible, however, to laser transfer entire structures using a LIFT technique known as lase-and-place. Lase-and-place allows whole components and parts to be transferred from a donor substrate onto a desired location with one single laser pulse. This talk will present the use of LIFT to laser print freestanding solid metal interconnects to connect individual devices into functional circuits. Furthermore, the same laser can bend or fold the thin metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief due to flexing or thermal mismatch. Examples of these laser printed 3D metallic bridges and their role in the development of next generation flexible electronics by additive manufacturing will be presented. This work was funded by the Office of Naval Research (ONR) through the Naval Research Laboratory Basic Research Program.

  7. Computational continuum modeling of solder interconnects

    SciTech Connect

    Burchett, S.N.; Neilsen, M.K.; Frear, D.R.; Stephens, J.J.

    1997-03-01

    The most commonly used solder for electrical interconnections in electronic packages is the near eutectic 60Sn-40Pb alloy. This alloy has a number of processing advantages (suitable melting point of 183 C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue), the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes prediction of solder joint lifetime complex. A viscoplastic, microstructure dependent, constitutive model for solder which is currently in development was implemented into a finite element code. With this computational capability, the thermomechanical response of solder interconnects, including microstructural evolution, can be predicted. This capability was applied to predict the thermomechanical response of various leadless chip carrier solder interconnects to determine the effects of variations in geometry and loading. In this paper, the constitutive model will first be briefly discussed. The results of computational studies to determine the effect of geometry and loading variations on leadless chip carrier solder interconnects then will be presented.

  8. Electric network interconnection of Mashreq Arab Countries

    SciTech Connect

    El-Amin, I.M.; Al-Shehri, A.M.; Opoku, G.; Al-Baiyat, S.A.; Zedan, F.M.

    1994-12-01

    Power system interconnection is a well established practice for a variety of technical and economical reasons. Several interconnected networks exist worldwide for a number of factors. Some of these networks cross international boundaries. This presentation discusses the future developments of the power systems of Mashreq Arab Countries (MAC). MAC consists of Bahrain, Egypt, Iraq, Jordan, Kuwait, Lebanon, Oman, Qatar, Saudi Arabia, United Arab Emirates (UAE), and Yemen. Mac power systems are operated by government or semigovernment bodies. Many of these countries have national or regional electric grids but are generally isolated from each other. With the exception of Saudi Arabia power systems, which employ 60 Hz, all other MAC utilities use 50 Hz frequency. Each country is served by one utility, except Saudi Arabia, which is served by four major utilities and some smaller utilities serving remote towns and small load centers. The major utilities are the Saudi Consolidated electric Company in the Eastern Province (SCECO East), SCECO Center, SCECO West, and SCECO South. These are the ones considered in this study. The energy resources in MAC are varied. Countries such as Egypt, Iraq, and Syria have significant hydro resources.The gulf countries and Iraq have abundant fossil fuel, The variation in energy resources as well as the characteristics of the electric load make it essential to look into interconnections beyond the national boundaries. Most of the existing or planned interconnections involve few power systems. A study involving 12 countries and over 20 utilities with different characteristics represents a very large scale undertaking.

  9. 47 CFR 95.1313 - Interconnection prohibited.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... circuits) or as an integral part of an authorized, private, internal system of communication or as an integral part of dispatch point circuits in a multi-use radio station are not considered to be interconnection for purposes of this rule part. ...

  10. Optical interconnections to focal plane arrays

    SciTech Connect

    Rienstra, J.L.; Hinckley, M.K.

    2000-11-01

    The authors have successfully demonstrated an optical data interconnection from the output of a focal plane array to the downstream data acquisition electronics. The demonstrated approach included a continuous wave laser beam directed at a multiple quantum well reflectance modulator connected to the focal plane array analog output. The output waveform from the optical interconnect was observed on an oscilloscope to be a replica of the input signal. They fed the output of the optical data link to the same data acquisition system used to characterize focal plane array performance. Measurements of the signal to noise ratio at the input and output of the optical interconnection showed that the signal to noise ratio was reduced by a factor of 10 or more. Analysis of the noise and link gain showed that the primary contributors to the additional noise were laser intensity noise and photodetector receiver noise. Subsequent efforts should be able to reduce these noise sources considerably and should result in substantially improved signal to noise performance. They also observed significant photocurrent generation in the reflectance modulator that imposes a current load on the focal plane array output amplifier. This current loading is an issue with the demonstrated approach because it tends to negate the power saving feature of the reflectance modulator interconnection concept.

  11. 47 CFR 90.477 - Interconnected systems.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... where the base station site or sites proposed stations are located 120 km (75 mi.) or more from the... mi.) of the 25 cities, they must obtain the consent of all co-channel licensees located both within 120 km (75 mi.) of the center of the city; and within 120 km (75 mi.) of the interconnected...

  12. 47 CFR 90.477 - Interconnected systems.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... where the base station site or sites proposed stations are located 120 km (75 mi.) or more from the... mi.) of the 25 cities, they must obtain the consent of all co-channel licensees located both within 120 km (75 mi.) of the center of the city; and within 120 km (75 mi.) of the interconnected...

  13. 47 CFR 90.477 - Interconnected systems.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... where the base station site or sites proposed stations are located 120 km (75 mi.) or more from the... mi.) of the 25 cities, they must obtain the consent of all co-channel licensees located both within 120 km (75 mi.) of the center of the city; and within 120 km (75 mi.) of the interconnected...

  14. Susceptibility of Aluminum Alloys to Corrosion in Simulated Fuel Blends Containing Ethanol

    SciTech Connect

    Thomson, Jeffery K; Pawel, Steven J; Wilson, Dane F

    2013-01-01

    The compatibility of aluminum and aluminum alloys with synthetic fuel blends comprised of ethanol and reference fuel C (a 50/50 mix of toluene and iso-octane) was examined as a function of water content and temperature. Commercially pure wrought aluminum and several cast aluminum alloys were observed to be similarly susceptible to substantial corrosion in dry (< 50 ppm water) ethanol. Corrosion rates of all the aluminum materials examined was accelerated by increased temperature and ethanol content in the fuel mixture, but inhibited by increased water content. Pretreatments designed to stabilize passive films on aluminum increased the incubation time for onset of corrosion, suggesting film stability is a significant factor in the mechanism of corrosion.

  15. Clinical biochemistry of aluminum

    SciTech Connect

    King, S.W.; Savory, J.; Wills, M.R.

    1981-05-01

    Aluminum toxicity has been implicated in the pathogenesis of a number of clinical disorders in patients with chronic renal failure on long-term intermittent hemodialysis treatment. The predominant disorders have been those involving either bone (osteomalacic dialysis osteodystrophy) or brain (dialysis encephalopathy). In nonuremic patients, an increased brain aluminum concentration has been implicated as a neurotoxic agent in the pathogenesis of Alzheimer's disease and was associated with experimental neurofibrillary degeneration in animals. The brain aluminum concentrations of patients dying with the syndrome of dialysis encephalopathy (dialysis dementia) are significantly higher than in dialyzed patients without the syndrome and in nondialyzed patients. Two potential sources for the increased tissue content of aluminum in patients on hemodialysis have been proposed: (1) intestinal absorption from aluminum containing phosphate-binding gels, and (2) transfer across the dialysis membrane from aluminum in the water used to prepare the dialysate. These findings, coupled with our everyday exposure to the ubiquitous occurrence of aluminum in nature, have created concerns over the potential toxicity of this metal.

  16. Towards energy-efficient photonic interconnects

    NASA Astrophysics Data System (ADS)

    Demir, Yigit; Hardavellas, Nikos

    2015-03-01

    Silicon photonics have emerged as a promising solution to meet the growing demand for high-bandwidth, low-latency, and energy-efficient on-chip and off-chip communication in many-core processors. However, current silicon-photonic interconnect designs for many-core processors waste a significant amount of power because (a) lasers are always on, even during periods of interconnect inactivity, and (b) microring resonators employ heaters which consume a significant amount of power just to overcome thermal variations and maintain communication on the photonic links, especially in a 3D-stacked design. The problem of high laser power consumption is particularly important as lasers typically have very low energy efficiency, and photonic interconnects often remain underutilized both in scientific computing (compute-intensive execution phases underutilize the interconnect), and in server computing (servers in Google-scale datacenters have a typical utilization of less than 30%). We address the high laser power consumption by proposing EcoLaser+, which is a laser control scheme that saves energy by predicting the interconnect activity and opportunistically turning the on-chip laser off when possible, and also by scaling the width of the communication link based on a runtime prediction of the expected message length. Our laser control scheme can save up to 62 - 92% of the laser energy, and improve the energy efficiency of a manycore processor with negligible performance penalty. We address the high trimming (heating) power consumption of the microrings by proposing insulation methods that reduce the impact of localized heating induced by highly-active components on the 3D-stacked logic die.

  17. Probabilistic immortality of Cu damascene interconnects

    NASA Astrophysics Data System (ADS)

    Hau-Riege, Stefan P.

    2002-02-01

    We have studied electromigration short-line effects in Cu damascene interconnects through experiments on lines of various lengths L, stressed at a variety of current densities j, and embedded in different dielectric materials. We observed two modes of resistance evolution: Either the resistance of the lines remains constant for the duration of the test, so that the lines are considered immortal, or the lines fail due to abrupt open-circuit failure. The resistance was not observed to gradually increase and then saturate, as commonly observed in Al-based interconnects, because the barrier is too thin and resistive to serve as a redundant current path should voiding occur. The critical stress for void nucleation was found to be smaller than 41 MPa, since voiding occurred even under the mildest test conditions of j=2 MA/cm2 and L=10.5 μm at 300 °C. A small fraction of short Cu lines failed even at low current densities, which deems necessary a concept of probabilistic immortality rather than deterministic immortality. Experiments and modeling suggest that the probability of immortality is described by (jL2/B), where B is the effective elastic modulus of the metallization scheme. By contrast, the immortality of Al-based interconnects with shunt layers is described by (jL) if no voids nucleate, and (jL/B) if voids do nucleate. Even though the phenomenology of short-line effects differs for Al- and Cu-based interconnects, the immortality of interconnects of either materials system can be explained by the phenomena of nucleation barriers for void formation and void-growth saturation. The differences are due solely to the absence of a shunt layer and the low critical stress for void nucleation in the case of Cu.

  18. Wavelength-addressed intra-board optical interconnection by plug-in alignment with a micro hole array

    NASA Astrophysics Data System (ADS)

    Nakama, Kenichi; Tokiwa, Yuu; Mikami, Osamu

    2010-09-01

    Intra-board interconnection between optical waveguide channels is suitable for assembling high-speed optoelectronic printed wiring boards (OE-PWB). Here, we propose a novel optical interconnection method combining techniques for both wavelength-based optical waveguide addressing and plug-in optical waveguide alignment with a micro-hole array (MHA). This array was fabricated by the mask transfer method. For waveguide addressing, we used a micro passive wavelength selector (MPWS) module, which is a type of Littrow mount monochromator consisting of an optical diffraction grating, a focusing lens, and the MHA. From the experimental results, we found that the wavelength addressing operation of the MPWS module was effective for intra-board optical interconnection.

  19. Purifying Aluminum by Vacuum Distillation

    NASA Technical Reports Server (NTRS)

    Du Fresne, E. R.

    1985-01-01

    Proposed method for purifying aluminum employs one-step vacuum distillation. Raw material for process impure aluminum produced in electrolysis of aluminum ore. Impure metal melted in vacuum. Since aluminum has much higher vapor pressure than other constituents, boils off and condenses on nearby cold surfaces in proportions much greater than those of other constituents.

  20. Purifying Aluminum by Vacuum Distillation

    NASA Technical Reports Server (NTRS)

    Du Fresne, E. R.

    1985-01-01

    Proposed method for purifying aluminum employs one-step vacuum distillation. Raw material for process impure aluminum produced in electrolysis of aluminum ore. Impure metal melted in vacuum. Since aluminum has much higher vapor pressure than other constituents, boils off and condenses on nearby cold surfaces in proportions much greater than those of other constituents.

  1. Cast Aluminum Bonding Study

    DTIC Science & Technology

    1988-05-01

    fabricated using P?-’r;est11 bur)ld II19 te(hnll I Oly with 6 cIsL nqs. The cast a lumi num alloy used was A357 . The sur- face preparation was phosphoric acid...from a cast aluminum alloy designated A357 . The bonding surfaces of the adherends were prepared using PAA. One primer and two adhesives considered...System, Cast Aluminum Lap Shear 18 11 Bond Area of 350°F Adhesive System, Cast Aluminum Lap Shear 19 vi LIST OF TABLES TABLE PAGE 1 A357 Chemical

  2. Aluminum Nitride Crystal Growth

    DTIC Science & Technology

    1979-12-01

    UOSR-TR- 80 - 04 2 4EL4- G LEYEL ALUMINUM NITRIDE CRYSTAL GROWTH G.A. Slack FINAL REPORT Contract F49620-78-C-0021 DTIC Period Covered ELECTE I...Laboratory personnel worked on the problem of Aluminum Nitride Heat Sink Crystal Growth for the U.S. Air Force Office of Scientific Research under Contract...Number F44620-76-C-0039. From November 1, 1977 to the present we have worked on Aluminum Nitride and Boron Phosphide Crystal Growth under Contract NUmber

  3. Interconnect assembly for an electronic assembly and assembly method therefor

    DOEpatents

    Gerbsch, Erich William

    2003-06-10

    An interconnect assembly and method for a semiconductor device, in which the interconnect assembly can be used in lieu of wirebond connections to form an electronic assembly. The interconnect assembly includes first and second interconnect members. The first interconnect member has a first surface with a first contact and a second surface with a second contact electrically connected to the first contact, while the second interconnect member has a flexible finger contacting the second contact of the first interconnect member. The first interconnect member is adapted to be aligned and registered with a semiconductor device having a contact on a first surface thereof, so that the first contact of the first interconnect member electrically contacts the contact of the semiconductor device. Consequently, the assembly method does not require any wirebonds, but instead merely entails aligning and registering the first interconnect member with the semiconductor device so that the contacts of the first interconnect member and the semiconductor device make electrically contact, and then contacting the second contact of the first interconnect member with the flexible finger of the second interconnect member.

  4. Heterogeneously integrated microdisk lasers for optical interconnects and optical logic

    NASA Astrophysics Data System (ADS)

    Mechet, Pauline; Liu, Liu; Kumar, Rajesh; Huybrechts, Koen; Spuesens, Thijs; Roelkens, Günther; Geluk, Erik-Jan; de Vries, Tjibbe; Regreny, Philippe; Van Thourhout, Dries; Baets, Roel; Morthier, Geert

    2011-03-01

    Optical interconnect and optical packet switching systems could take advantage of small footprint, low power lasers and optical logic elements. Microdisk lasers, with a diameter below 10μm and fabricated in InP membranes with a high index contrast, offer this possibility at the telecom wavelengths. The lasers are fabricated using heterogeneous integration of InP membranes on silicon-on-insulator (SOI) passive waveguide circuits, which allows to combine the active elements with compact, high-index contrast passive elements. The lasing mode in such microdisk lasers is a whispering gallery mode, which can be either in the clockwise (CW) or counter clockwise direction (CCW) or in both. The coupling to the SOI wire waveguides is through evanescent coupling. Predefined, unidirectional operation can be achieved by terminating the SOI wires at one end with Bragg gratings. For all-optical flip-flops, the laser operation must be switchable between CW and CCW, using short optical pulses. Unidirectional operation in either direction is only possible if the coupling between CW and CCW direction is very small, requiring small sidewall surface roughness, and if the gain suppression is sufficiently large, requiring large internal power levels. All-optical flip-flops based on microdisk lasers with diameter of 7.5μm have been demonstrated. They operate with a CW power consumption of a few mW and switch in 60ps with switching energies as low as 1.8fJ. Operation as all-optical gate has also been demonstrated. The surface roughness is limited through optimized etching of the disks and the large internal power is obtained through good heat sink.

  5. Walnut Hulls Clean Aluminum

    NASA Technical Reports Server (NTRS)

    Colberg, W. R.; Gordon, G. H.; Jackson, C. H.

    1984-01-01

    Hulls inflict minimal substrate damage. Walnut hulls found to be best abrasive for cleaning aluminum surfaces prior to painting. Samples blasted with walnut hulls showed no compressive stress of surface.

  6. Corrosion Inhibitors for Aluminum.

    ERIC Educational Resources Information Center

    Muller, Bodo

    1995-01-01

    Describes a simple and reliable test method used to investigate the corrosion-inhibiting effects of various chelating agents on aluminum pigments in aqueous alkaline media. The experiments that are presented require no complicated or expensive electronic equipment. (DDR)

  7. Corrosion Inhibitors for Aluminum.

    ERIC Educational Resources Information Center

    Muller, Bodo

    1995-01-01

    Describes a simple and reliable test method used to investigate the corrosion-inhibiting effects of various chelating agents on aluminum pigments in aqueous alkaline media. The experiments that are presented require no complicated or expensive electronic equipment. (DDR)

  8. Low latency, area, and energy efficient Hybrid Photonic Plasmonic on-chip Interconnects (HyPPI)

    NASA Astrophysics Data System (ADS)

    Sun, Shuai; Badaway, Abdel-Hameed A.; Narayana, Vikram; El-Ghazawi, Tarek; Sorger, Volker J.

    2016-03-01

    In this paper we benchmark various interconnect technologies including electrical, photonic, and plasmonic options. We contrast them with hybridizations where we consider plasmonics for active manipulation devices, and photonics for passive propagation integrated circuit elements, and further propose another novel hybrid link that utilizes an on chip laser for intrinsic modulation thus bypassing electro-optic modulation. Link benchmarking proves that hybridization can overcome the shortcomings of both pure photonic and plasmonic links. We show superiority in a variety of performance parameters such as point-to-point latency, energy efficiency, capacity, ability to support wavelength division multiplexing, crosstalk coupling length, bit flow density and Capability-to-Latency-Energy-Area Ratio.

  9. National Offshore Wind Energy Grid Interconnection Study Full Report

    SciTech Connect

    Daniel, John P.; Liu, Shu; Ibanez, Eduardo; Pennock, Ken; Reed, Gregory; Hanes, Spencer

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States.

  10. High temperature solid electrolyte fuel cell configurations and interconnections

    DOEpatents

    Isenberg, Arnold O.

    1984-01-01

    High temperature fuel cell configurations and interconnections are made including annular cells having a solid electrolyte sandwiched between thin film electrodes. The cells are electrically interconnected along an elongated axial outer surface.

  11. National Offshore Wind Energy Grid Interconnection Study Executive Summary

    SciTech Connect

    Daniel, John P.; Liu, Shu; Ibanez, Eduardo; Pennock, Ken; Reed, Gregory; Hanes, Spencer

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States.

  12. CORROSION PROTECTION OF ALUMINUM

    DOEpatents

    Dalrymple, R.S.; Nelson, W.B.

    1963-07-01

    Treatment of aluminum-base metal surfaces in an autoclave with an aqueous chromic acid solution of 0.5 to 3% by weight and of pH below 2 for 20 to 50 hrs at 160 to 180 deg C produces an extremely corrosion-resistant aluminum oxidechromium film on the surface. A chromic acid concentration of 1 to 2% and a pH of about 1 are preferred. (D.C.W.)

  13. Corrosion Protection of Aluminum

    DOEpatents

    Dalrymple, R. S.; Nelson, W. B.

    1963-07-01

    Treatment of aluminum-base metal surfaces in an autoclave with an aqueous chromic acid solution of 0.5 to 3% by weight and of pH below 2 for 20 to 50 hrs at 160 to 180 deg C produces an extremely corrosion-resistant aluminum oxidechromium film on the surface. A chromic acid concentration of 1 to 2% and a pH of about 1 are preferred.

  14. Aluminum powder applications

    SciTech Connect

    Gurganus, T.B.

    1995-08-01

    Aluminum powders have physical and metallurgical characteristics related to their method of manufacture that make them extremely important in a variety of applications. They can propel rockets, improve personal hygiene, increase computer reliability, refine exotic alloys, and reduce weight in the family sedan or the newest Air Force fighter. Powders formed into parts for structural and non-structural applications hold the key to some of the most exciting new developments in the aluminum future.

  15. Protective effect of citicoline against aluminum-induced cognitive impairments in rats.

    PubMed

    Abdel-Zaher, Ahmed O; Hamdy, Mostafa M; Abdel-Rahman, Mahran S; Abd El-Hamid, Doaa H

    2017-04-01

    The potential protective effect of citicoline on aluminum chloride-induced cognitive deficits was investigated in rats. In a Morris water maze, administration of aluminum chloride to rats for 90 days resulted in increased escape latency to reach the platform and decreased swimming speed in acquisition trials. Similarly, in probe trials, the time required to reach the hidden platform was increased and the time spent in the target quadrant was reduced. Also, administration of aluminum chloride to rats for 90 days increased the reference and working memory errors and time required to end the task in the radial arm maze. In addition, this treatment decreased the step-through latency in the passive avoidance test. Concurrently, treatment of rats with aluminum chloride for 90 days increased hippocampal glutamate, malondialdehyde, and nitrite levels and decreased intracellular reduced glutathione level. In the citicoline-treated group, aluminum chloride-induced learning and memory impairments as assessed by the Morris water maze, radial arm maze, and passive avoidance tests were inhibited. At the same time, treatment of rats with citicoline prevented the biochemical alterations induced by aluminum chloride in the hippocampus. It can be concluded that elevation of hippocampal glutamate level with consequent oxidative stress and nitric oxide (NO) overproduction may play an important role in aluminum-induced cognitive impairments. Also, our results suggest, for the first time, that citicoline can protect against the development of these cognitive deficits through inhibition of aluminum-induced elevation of glutamate level, oxidative stress, and NO overproduction in the hippocampus.

  16. Tuning of the droplet motion in interconnected microfluidic devices

    NASA Astrophysics Data System (ADS)

    Hu, Guoqing; Song, Kui; Zhang, Li

    2010-11-01

    The problem of controlling the droplet motions in multiphase flows on the microscale has gained increasing attention because the droplet-based microfluidic devices provide great potentials for chemical/biological applications such as drug discovery, chemical kinetics study, material synthesis, and DNA/cell assays. It is critical to understand the relevant physics on droplet hydrodynamics and thus control the generation, motion, splitting, and coalescence of droplets in complex microfluidic networks. The operation of those applications sometimes requires the arrival of droplets from different branch microchannels at a designated location within a transit time. We propose a simple design for interconnected microfluidic devices that implement the feedback mechanism to synchronize the droplet motion via a passive way. Numerical simulations using the Volume of Fluid (VOF) algorithm are conducted to investigate the time-dependent dynamics of droplets in both gas-liquid and liquid-liquid systems. An analytical mode based on the electronic-hydraulic analogy is also developed to describe the transit behavior of the droplet traffic. Both the numerical and theoretical results agree well with the corresponding experimental results. Furthermore, we optimize the microfluidic networks to control the motion of a series of droplets.

  17. On the Passivity of Hysteretic Systems with Double Hysteretic Loops

    PubMed Central

    Pozo, Francesc; Zapateiro, Mauricio

    2015-01-01

    The Bouc–Wen hysteresis model is widely employed to mathematically represent the dynamical behavior of several physical devices, materials and systems such as magnetorheological dampers, lanthanide zirconium or aluminum oxides, mechanical structures or biomedical systems. However, these mathematical models must account for different properties such as the bounded-input bounded-output stability, asymptotic motion, thermodynamic admissibility or passivity in order to be physically consistent with the systems they represent. The passivity of a system is related to energy dissipation. More precisely, a system is passive if it does not generate energy but only dissipates it. The objective of this paper is to prove that two different double-loop Bouc–Wen models are passive under a particular set of model parameters. PMID:28793719

  18. Advanced silicon device technologies for optical interconnects

    NASA Astrophysics Data System (ADS)

    Wosinski, Lech; Wang, Zhechao; Lou, Fei; Dai, Daoxin; Lourdudoss, Sebastian; Thylen, Lars

    2012-01-01

    Silicon photonics is an emerging technology offering novel solutions in different areas requiring highly integrated communication systems for optical networking, sensing, bio-applications and computer interconnects. Silicon photonicsbased communication has many advantages over electric wires for multiprocessor and multicore macro-chip architectures including high bandwidth data transmission, high speed and low power consumption. Following the INTEL's concept to "siliconize" photonics, silicon device technologies should be able to solve the fabrication problems for six main building blocks for realization of optical interconnects: light generation, guiding of light including wavelength selectivity, light modulation for signal encoding, detection, low cost assembly including optical connecting of the devices to the real world and finally the electronic control systems.

  19. Architecture for on-die interconnect

    SciTech Connect

    Khare, Surhud; More, Ankit; Somasekhar, Dinesh; Dunning, David S.

    2016-03-15

    In an embodiment, an apparatus includes: a plurality of islands configured on a semiconductor die, each of the plurality of islands having a plurality of cores; and a plurality of network switches configured on the semiconductor die and each associated with one of the plurality of islands, where each network switch includes a plurality of output ports, a first set of the output ports are each to couple to the associated network switch of an island via a point-to-point interconnect and a second set of the output ports are each to couple to the associated network switches of a plurality of islands via a point-to-multipoint interconnect. Other embodiments are described and claimed.

  20. A Thermal Model for Carbon Nanotube Interconnects

    PubMed Central

    Mohsin, Kaji Muhammad; Srivastava, Ashok; Sharma, Ashwani K.; Mayberry, Clay

    2013-01-01

    In this work, we have studied Joule heating in carbon nanotube based very large scale integration (VLSI) interconnects and incorporated Joule heating influenced scattering in our previously developed current transport model. The theoretical model explains breakdown in carbon nanotube resistance which limits the current density. We have also studied scattering parameters of carbon nanotube (CNT) interconnects and compared with the earlier work. For 1 µm length single-wall carbon nanotube, 3 dB frequency in S12 parameter reduces to ~120 GHz from 1 THz considering Joule heating. It has been found that bias voltage has little effect on scattering parameters, while length has very strong effect on scattering parameters. PMID:28348333

  1. An Interconnect Bus Power Optimization Method

    NASA Astrophysics Data System (ADS)

    En, Yun-Fei; Zhu, Zhang-Ming; Hao, Yue

    2010-07-01

    A simple yet accurate interconnect parasitical capacitance model is presented. Based on this model a novel interconnect bus optimization methodology is proposed. Combining wire spacing with wire ordering, this methodology focuses on bus dynamic power optimization with consideration of bus performance requirements. The optimization methodology is verified under a 65 nm technology node and it shows that with 50% slack in the routing space, a 33.03% power saving can be provided by the proposed optimization methodology for an intermediate video bus compared to the 27.68% power saving provided by uniform spacing technology. The proposed methodology is especially suitable for computer-aided design of nanometer scale on-chip buses.

  2. Copper Nanowire Production for Interconnect Applications

    NASA Technical Reports Server (NTRS)

    Han, Jin-Woo (Inventor); Meyyappan, Meyya (Inventor)

    2014-01-01

    A method of fabricating metallic Cu nanowires with lengths up to about 25 micrometers and diameters in a range 20-100 nanometers, or greater if desired. Vertically oriented or laterally oriented copper oxide structures (CuO and/or Cu2O) are grown on a Cu substrate. The copper oxide structures are reduced with 99+ percent H or H2, and in this reduction process the lengths decrease (to no more than about 25 micrometers), the density of surviving nanostructures on a substrate decreases, and the diameters of the surviving nanostructures have a range, of about 20-100 nanometers. The resulting nanowires are substantially pure Cu and can be oriented laterally (for local or global interconnects) or can be oriented vertically (for standard vertical interconnects).

  3. Interconnection of bundled solid oxide fuel cells

    DOEpatents

    Brown, Michael; Bessette, II, Norman F; Litka, Anthony F; Schmidt, Douglas S

    2014-01-14

    A system and method for electrically interconnecting a plurality of fuel cells to provide dense packing of the fuel cells. Each one of the plurality of fuel cells has a plurality of discrete electrical connection points along an outer surface. Electrical connections are made directly between the discrete electrical connection points of adjacent fuel cells so that the fuel cells can be packed more densely. Fuel cells have at least one outer electrode and at least one discrete interconnection to an inner electrode, wherein the outer electrode is one of a cathode and and anode and wherein the inner electrode is the other of the cathode and the anode. In tubular solid oxide fuel cells the discrete electrical connection points are spaced along the length of the fuel cell.

  4. Development of Interconnect Technologies for Particle Detectors

    SciTech Connect

    Tripathi, Mani

    2015-01-29

    This final report covers the three years of this grant, for the funding period 9/1/2010 - 8/31/2013. The project consisted of generic detector R&D work at UC Davis, with an emphasis on developing interconnect technologies for applications in HEP. Much of the work is done at our Facility for Interconnect Technologies (FIT) at UC Davis. FIT was established using ARRA funds, with further studies supported by this grant. Besides generic R&D work at UC Davis, FIT is engaged in providing bump bonding help to several DOE supported detector R&D efforts. Some of the developmental work was also supported by funding from other sources: continuing CMS project funds and the Linear Collider R&D funds. The latter program is now terminated. The three year program saw a good deal of progress on several fronts, which are reported here.

  5. 14 CFR 29.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Flow between interconnected tanks. 29.957... AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Powerplant Fuel System § 29.957 Flow between interconnected tanks. (a) Where tank outlets are interconnected and allow fuel to flow...

  6. 78 FR 7523 - Small Generator Interconnection Agreements and Procedures

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-02-01

    ... Generator Interconnection Agreements and Procedures; Proposed Rule #0;#0;Federal Register / Vol. 78 , No. 22... Commission 18 CFR Part 35 Small Generator Interconnection Agreements and Procedures AGENCY: Federal Energy... Commission (Commission) is proposing to revise the pro forma Small Generator Interconnection Procedures (SGIP...

  7. 14 CFR 23.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 14 Aeronautics and Space 1 2011-01-01 2011-01-01 false Flow between interconnected tanks. 23.957... Fuel System § 23.957 Flow between interconnected tanks. (a) It must be impossible, in a gravity feed system with interconnected tank outlets, for enough fuel to flow between the tanks to cause an overflow...

  8. 14 CFR 23.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Flow between interconnected tanks. 23.957... Fuel System § 23.957 Flow between interconnected tanks. (a) It must be impossible, in a gravity feed system with interconnected tank outlets, for enough fuel to flow between the tanks to cause an...

  9. Printed Wiring Assembly and Interconnection Reliability.

    DTIC Science & Technology

    1981-11-01

    2.2.1 Plated Through Holes (PTH). The PTH multilayer printed wiring board consists of a number of layers of thin circuit boards which ara stacked...interconnection on discrete wiring w/PTH assemblies. The discrete wiring boards are plated in an electroless copper bath where copper is deposited to... board failures is the mismatch of thermal coefficients of expansion in the plated through hole. The thermal coefficients of expansion for the copper

  10. Bioactive macroporous titanium implants highly interconnected.

    PubMed

    Caparrós, Cristina; Ortiz-Hernandez, Mónica; Molmeneu, Meritxell; Punset, Miguel; Calero, José Antonio; Aparicio, Conrado; Fernández-Fairén, Mariano; Perez, Román; Gil, Francisco Javier

    2016-10-01

    Intervertebral implants should be designed with low load requirements, high friction coefficient and low elastic modulus in order to avoid the stress shielding effect on bone. Furthermore, the presence of a highly interconnected porous structure allows stimulating bone in-growth and enhancing implant-bone fixation. The aim of this study was to obtain bioactive porous titanium implants with highly interconnected pores with a total porosity of approximately 57 %. Porous Titanium implants were produced by powder sintering route using the space holder technique with a binder phase and were then evaluated in an in vivo study. The size of the interconnection diameter between the macropores was about 210 μm in order to guarantee bone in-growth through osteblastic cell penetration. Surface roughness and mechanical properties were analyzed. Stiffness was reduced as a result of the powder sintering technique which allowed the formation of a porous network. Compression and fatigue tests exhibited suitable properties in order to guarantee a proper compromise between mechanical properties and pore interconnectivity. Bioactivity treatment effect in novel sintered porous titanium materials was studied by thermo-chemical treatments and were compared with the same material that had undergone different bioactive treatments. Bioactive thermo-chemical treatment was confirmed by the presence of sodium titanates on the surface of the implants as well as inside the porous network. Raman spectroscopy results suggested that the identified titanate structures would enhance in vivo apatite formation by promoting ion exchange for the apatite formation process. In vivo results demonstrated that the bioactive titanium achieved over 75 % tissue colonization compared to the 40 % value for the untreated titanium.

  11. Market Based Analysis of Power System Interconnections

    NASA Astrophysics Data System (ADS)

    Obushevs, Artjoms; Turcik, Mario; Oleinikova, Irina; Junghans, Gatis

    2011-01-01

    Analysis in this Article is focused on usage of transmission grid under liberalized market with implicit transmission capacity allocation method, e.g. Nordic market. Attention is paid on fundamental changes in transmission utilization and its economical effective operation. For interconnection and power flow analysis and losses calculation model of Nordic grid was developed and transmission losses calculation method was created. Given approach will improve economical efficiency of system operation in electricity market conditions.

  12. Implementation of interconnect simulation tools in spice

    NASA Technical Reports Server (NTRS)

    Satsangi, H.; Schutt-Aine, J. E.

    1993-01-01

    Accurate computer simulation of high speed digital computer circuits and communication circuits requires a multimode approach to simulate both the devices and the interconnects between devices. Classical circuit analysis algorithms (lumped parameter) are needed for circuit devices and the network formed by the interconnected devices. The interconnects, however, have to be modeled as transmission lines which incorporate electromagnetic field analysis. An approach to writing a multimode simulator is to take an existing software package which performs either lumped parameter analysis or field analysis and add the missing type of analysis routines to the package. In this work a traditionally lumped parameter simulator, SPICE, is modified so that it will perform lossy transmission line analysis using a different model approach. Modifying SPICE3E2 or any other large software package is not a trivial task. An understanding of the programming conventions used, simulation software, and simulation algorithms is required. This thesis was written to clarify the procedure for installing a device into SPICE3E2. The installation of three devices is documented and the installations of the first two provide a foundation for installation of the lossy line which is the third device. The details of discussions are specific to SPICE, but the concepts will be helpful when performing installations into other circuit analysis packages.

  13. Modeling and synthesis of multicomputer interconnection networks

    NASA Technical Reports Server (NTRS)

    Standley, Hilda M.; Auxter, D. Steve

    1990-01-01

    The type of interconnection network employed has a profound effect on the performance of a multicomputer and multiprocessor design. Adequate models are needed to aid in the design and development of interconnection networks. A novel modeling approach using statistical and optimization techniques is described. This method represents an attempt to compare diverse interconnection network designs in a way that allows not only the best of existing designs to be identified but to suggest other, perhaps hybrid, networks that may offer better performance. Stepwise linear regression is used to develop a polynomial surface representation of performance in a (k+1) space with a total of k quantitative and qualitative independent variables describing graph-theoretic characteristics such as size, average degree, diameter, radius, girth, node-connectivity, edge-connectivity, minimum dominating set size, and maximum number of prime node and edge cutsets. Dependent variables used to measure performance are average message delay and the ratio of message completion rate to network connection cost. Response Surface Methodology (RSM) optimizes a response variable from a polynomial function of several independent variables. Steepest ascent path may also be used to approach optimum points.

  14. Optimizing Baseload Power of Interconnected Wind Farms

    NASA Astrophysics Data System (ADS)

    Kobrin, B. H.

    2010-12-01

    Interconnecting wind farms has been proposed as a way to reduce the natural unreliability of wind power caused by the intermittency of winds. In a previous study, the benefits of interconnecting up to 19 sites in the Midwestern United States were evaluated with the assumption that the same number of turbines would be installed at each site. The goal of this study was to avoid this assumption and examine the advantages of optimizing the ratio of turbines at each site. An optimization algorithm based on the gradient method was used to maximize the baseload power, or guaranteed power 87.5% of the year, using hourly wind speed data for the same 19 sites. The result was a significant improvement in the reliability of the array, increasing the baseload power by 38% compared to the array with equally-weighted sites. Further analysis showed that the turbines were generally distributed according to the average wind power at each site and the wind correlation among sites. In addition to optimizing the average baseload of the array, this study examined the benefits of optimizing the baseload for peak usage time (between noon and 7 p.m), and thus a simplified model was created to analyze how interconnecting wind farms could increase correlation with energy consumption. Optimization for peak usage hours, however, provided no additional benefit over the original optimized array because the variation of average hourly wind speeds was well-correlated among the sites.

  15. Integrated nanophotonic devices for optical interconnections

    NASA Astrophysics Data System (ADS)

    Huang, Yidong; Feng, Xue; Cui, Kaiyu; Li, Yongzhuo; Wang, Yu

    2016-03-01

    Nanostructure is an effective solution for realizing optoelectronic devices with compact size and high performances simultaneously. This paper reports our research progress on integrated nanophotonic devices for optical interconnections. We proposed a parent-sub micro ring structure for optical add-drop multiplexer (OADM) with compact footprint, large free spectral range, and uniform channel spacing. All eight channels can be multiplexed and de-multiplexed with 2.6 dB drop loss, 0.36 nm bandwidth (>40 GHz), -20 dB channel crosstalk, and high thermal tuning efficiency of 0.15 nm/mW. A novel principle of optical switch was proposed and demonstrated based on the coupling of the defect modes in photonic crystal waveguide. Switching functionality with bandwidth up to 24 nm and extinction ratio in excess of 15 dB over the entire bandwidth was achieved, while the footprint was only 8 μm×17.6 μm. We proposed an optical orbital angular momentum (OAM) coding and decoding method to increase the data-carrying capacity of wireless optical interconnect. An integrated OAM emitter, where the topological charge can be continuously varied from -4 to 4 was realized. Also we studied ultrafast modulated nLED as the integrated light source for optical interconnections using a nanobeam cavity with stagger holes.

  16. Stretchable interconnections for flexible electronic systems.

    PubMed

    Jianhui, Lin; Bing, Yan; Xiaoming, Wu; Tianling, Ren; Litian, Liu

    2009-01-01

    Sensors, actuators and integrated circuits (IC) can be encapsulated together on an elastic substrate, which makes a flexible electronic system. In this system, electrical interconnections that can sustain large and reversible stretching are in great need. This paper is devoted to the fabrication of highly stretchable metal interconnections. Transfer printing technology is utilized, which mainly involves the transfer of 100-nm-thick gold ribbons from silicon wafers to pre-stretched elastic substrates. After the elastic substrates relax from the pre-strain, the gold ribbons buckle and form wavy geometries. These wavy geometries change in shapes to accommodate the applied strain and can be reversely stretched without cracks or fractures occurring, which will greatly raise the stretchability of the gold ribbons. As an application example, some of these wavy ribbons can accommodate high levels of stretching (up to 100%) and bending (with curvature radius down to 1.20 mm). Moreover, the efficiency and reliability of the transfer, especially for slender ribbons, have been increased due to the improvement of the technology. All the characteristics above will permit making stretchable gold conductors as interconnections for flexible electronic systems such as implantable medical systems and smart clothes.

  17. Aluminum induced encephalopathy in the rat

    SciTech Connect

    Lipman, J.J.; Colowick, S.P.; Lawrence, P.P.; Abumrad, N.N.

    1988-01-01

    Aluminum tartrate (AlT) but not sodium tartrate (NaT) produces a progressive encephalopathy when injected intracerebroventricularly in the rat. This syndrome, lethal within 30-35 days, is characterized by progressively deranged behavior. An early startle reaction, later joined by locomotor discoordination is followed by locomotor and electrocorticographic (ECoG) seizures in chronically instrumented AlT rats. There is early dissociation between ECoG and locomotor aspects. When tested in the shuttlebox for estimation of learning and memory function 7-8 days after AlT injection, marked impairment of both active and passive avoidance was observed. Glucose uptake capacity of synaptosomes from brain areas of AlT and NaT animals was indexed by the 2-deoxy-D-glucose method. Striatal and cortical synaptosomes showed reduced uptake activity 7 days following Alt injection. By day 14, hypothalamic areas also became affected, striatal uptake was further inhibited, and cortical uptake was reduced to 57% of control. The ECoG background rhythm remained unchanged until days 20-23, when the mean peak frequency was reduced. The model may be useful in the study of central aluminum toxicity and may have predictive validity in the testing of procedures to counter aluminum-associated encephalopathies in man. 44 references, 4 figures, 1 table.

  18. Chromate-free talc chemical conversion coatings for aluminum alloys

    SciTech Connect

    Buchheit, R.G.; Drewien, C.A.; Stoner, G.E.

    1993-10-01

    We have found that aluminum alloys exhibit unusual passivity when exposed to alkaline Li-salt solutions. Observed passivity is due to the formation of a polycrystalline Li{sub 2}[Al{sub 2}(OH){sub 6}]{sub 2}{center_dot}CO{sub 3}{center_dot}3H{sub 2}O film on the aluminum surface. This film is persistent in aggressive environments and provides a significant degree of corrosion protection. On this basis, we have developed a simple non-electrolytic method of forming corrosion resistant coatings in alkaline Li-salt solution. This process is procedurally similar to traditional conversion coating methods, offers desirable properties, and has a low toxic hazard. In this paper, coating methods, coating characterization, and coating properties are presented. Results from parallel test performed with a commercial chromate conversion coatings are presented for comparison.

  19. The Role of Stress in the Corrosion Cracking of Aluminum Alloys

    DTIC Science & Technology

    2013-03-01

    general corrosion resistance. The general corrosion properties of 5000 series aluminum are good because of the passivating oxide film that forms on...in the solution causes a pH increase that in turn causes the dissolution of the oxide layer around the intermetallic particles and the matrix...ions exchange anions with hydroxide ions, the aluminum oxide layer, Al2O3, is broken down. The β-phase then begins to dissolve, forming crack-like

  20. Wireless Interconnects for Intra-chip & Inter-chip Transmission

    NASA Astrophysics Data System (ADS)

    Narde, Rounak Singh

    With the emergence of Internet of Things and information revolution, the demand of high performance computing systems is increasing. The copper interconnects inside the computing chips have evolved into a sophisticated network of interconnects known as Network on Chip (NoC) comprising of routers, switches, repeaters, just like computer networks. When network on chip is implemented on a large scale like in Multicore Multichip (MCMC) systems for High Performance Computing (HPC) systems, length of interconnects increases and so are the problems like power dissipation, interconnect delays, clock synchronization and electrical noise. In this thesis, wireless interconnects are chosen as the substitute for wired copper interconnects. Wireless interconnects offer easy integration with CMOS fabrication and chip packaging. Using wireless interconnects working at unlicensed mm-wave band (57-64GHz), high data rate of Gbps can be achieved. This thesis presents study of transmission between zigzag antennas as wireless interconnects for Multichip multicores (MCMC) systems and 3D IC. For MCMC systems, a four-chips 16-cores model is analyzed with only four wireless interconnects in three configurations with different antenna orientations and locations. Return loss and transmission coefficients are simulated in ANSYS HFSS. Moreover, wireless interconnects are designed, fabricated and tested on a 6'' silicon wafer with resistivity of 55O-cm using a basic standard CMOS process. Wireless interconnect are designed to work at 30GHz using ANSYS HFSS. The fabricated antennas are resonating around 20GHz with a return loss of less than -10dB. The transmission coefficients between antenna pair within a 20mm x 20mm silicon die is found to be varying between -45dB to -55dB. Furthermore, wireless interconnect approach is extended for 3D IC. Wireless interconnects are implemented as zigzag antenna. This thesis extends the work of analyzing the wireless interconnects in 3D IC with different

  1. Aluminum, parathyroid hormone, and osteomalacia

    SciTech Connect

    Burnatowska-Hledin, M.A.; Kaiser, L.; Mayor, G.H.

    1983-01-01

    Aluminum exposure in man is unavoidable. The occurrence of dialysis dementia, vitamin D-resistant osteomalacia, and hypochromic microcytic anemia in dialysis patients underscores the potential for aluminum toxicity. Although exposure via dialysate and hyperalimentation leads to significant tissue aluminum accumulation, the ubiquitous occurrence of aluminum and the severe pathology associated with large aluminum burdens suggest that smaller exposures via the gastrointestinal tract and lungs could represent an important, though largely unrecognized, public health problem. It is clear that some aluminum absorption occurs with the ingestion of small amounts of aluminum in the diet and medicines, and even greater aluminum absorption is seen in individuals consuming large amounts of aluminum present in antacids. Aluminum absorption is enhanced in the presence of elevated circulating parathyroid hormone. In addition, elevated PTH leads to the preferential deposition of aluminum in brain and bone. Consequently, PTH is likely to be involved in the pathogenesis of toxicities in those organs. PTH excess also seems to lead to the deposition of aluminum in the parathyroid gland. The in vitro demonstration that aluminum inhibits parathyroid hormone release is consistent with the findings of a euparathyroid state in dialysis patients with aluminum related vitamin D-resistant osteomalacia. Nevertheless, it seems likely that hyperparathyroidism is at least initially involved in the pathogenesis of aluminum neurotoxicity and osteomalacia; the increases in tissue aluminum stores are followed by suppression of parathyroid hormone release, which is required for the evolution of osteomalacia. Impaired renal function is not a prerequisite for increased tissue aluminum burdens, nor for aluminum-related organ toxicity. Consequently, it is likely that these diseases will be observed in populations other than those with chronic renal disease.

  2. Parallel Interconnection of Broadcast Systems with Multiple FIFO Channels

    NASA Astrophysics Data System (ADS)

    de Juan Marín, Ruben; Cholvi, Vicent; Jiménez, Ernesto; Muñoz-Escoí, Francesc D.

    This paper proposes new protocols for the interconnection of FIFO- and causal-ordered broadcast systems, thus increasing their scalability. They use several interconnection links between systems, which avoids bottleneck problems due to the network traffic, since messages are not forced to go throughout a single link but instead through the several links we establish. General architectures to interconnect FIFO- and causal-ordered systems are proposed. Failure management is also discussed and a performance analysis is given, detailing the benefits introduced by these interconnection approaches that are able to easily increase the resulting interconnection bandwidth.

  3. Reactive ion beam deposition of aluminum nitride thin films

    NASA Astrophysics Data System (ADS)

    Bhat, S.; Ashok, S.; Fonash, S. J.; Tongson}, L.

    1985-07-01

    Aluminum nitride thin films have been prepared at room temperature by reactive ion beam sputtering for potential use as a passivant and diffusion/anneal cap in compound semiconductor technology. The electrical and optical pro-perties of these films have been studied along with the in-fluence of thermal annealing on the material characteristics. The quality of the films has also been found to improve in the presence of atomic hydrogen during the deposition.

  4. Quasi-1D van der Waals materials as high current-density local interconnects (Conference Presentation)

    NASA Astrophysics Data System (ADS)

    Stolyarov, Maxim; Aytan, Ece; Bloodgood, Matthew; Salguero, Tina T.; Balandin, Alexander A.

    2016-09-01

    The continuous downscaling of interconnect dimensions in combination with the introduction of low-k dielectrics has increased the number of heat dissipation, integration and reliability challenges in modern electronics. As a result, there is a strong need for new materials that have high current-carrying capacity for applications as nanoscale interconnects. In this presentation, we show that quasi-one-dimensional (1D) van der Waals metals such as TaSe3 have excellent breakdown current density exceeding that of 5 MA/cm2. This value is above that currently achievable in conventional copper or aluminum wires. The quasi-1D van der Waals materials are characterized by strong bonds along one dimension and weak van der Waals bonds along two other dimensions. The material for this study was grown by the chemical vapor transport (CVT) method. Both mechanical and chemical exfoliation methods were used to fabricate nanowires with lateral dimensions below 100 nm. The dimensions of the quasi-1D nanowires were verified with scanning electron microscopy (SEM) and atomic force microscopy (AFM). The metal (Ti/Au) contacts for the electrical characterization were deposited using electron beam evaporation (EBE). The measurements were conducted on a number of prototype interconnects with multiple electric contacts to ensure reproducibility. The obtained results suggest that quasi-1D van der Waals metals present a feasible alternative to conventional copper interconnects in terms of the current-carrying capacity and the breakdown current-density. This work was supported, in part, by the SRC and DARPA through STARnet Center for Function Accelerated nanoMaterial Engineering (FAME).

  5. Characterization of aluminum nanopowders after long-term storage

    NASA Astrophysics Data System (ADS)

    Nazarenko, O. B.; Amelkovich, Yu. A.; Sechin, A. I.

    2014-12-01

    The characteristics of aluminum nanopowders obtained by electrical explosion of wires, passivated by air and stored for a long time under natural conditions are analyzed. The aluminum nanopowder produced in hydrogen had been stored for 27 years; the nanopowders produced in argon and nitrogen had been stored for 10 years. The powders were studied using X-ray diffraction analysis (XRD), scanning electron microscopy (SEM), differential scanning calorimetry (DSC), thermogravimetry (TG) and Fourier transform infrared spectrometry (FTIR). The influence of the obtaining conditions and storage period of nanopowders on their thermal stability under heating in air is shown. The aluminum nanopowders after long-term storage in air under ambient conditions are found to be extremely active.

  6. Fatal aluminum phosphide poisoning.

    PubMed

    Anger, F; Paysant, F; Brousse, F; Le Normand, I; Develay, P; Gaillard, Y; Baert, A; Le Gueut, M A; Pepin, G; Anger, J P

    2000-03-01

    A 39-year-old man committed suicide by ingestion of aluminum phosphide, a potent mole pesticide, which was available at the victim's workplace. The judicial authority ordered an autopsy, which ruled out any other cause of death. The victim was discovered 10 days after the ingestion of the pesticide. When aluminum phosphide comes into contact with humidity, it releases large quantities of hydrogen phosphine (PH3), a very toxic gas. Macroscopic examination during the autopsy revealed a very important asphyxia syndrome with major visceral congestion. Blood, urine, liver, kidney, adrenal, and heart samples were analyzed. Phosphine gas was absent in the blood and urine but present in the brain (94 mL/g), the liver (24 mL/g), and the kidneys (41 mL/g). High levels of phosphorus were found in the blood (76.3 mg/L) and liver (8.22 mg/g). Aluminum concentrations were very high in the blood (1.54 mg/L), brain (36 microg/g), and liver (75 microg/g) compared to the usual published values. Microscopic examination revealed congestion of all the organs studied and obvious asphyxia lesions in the pulmonary parenchyma. All these results confirmed a diagnosis of poisoning by aluminum phosphide. This report points out that this type of poisoning is rare and that hydrogen phosphine is very toxic. The phosphorus and aluminum concentrations observed and their distribution in the different viscera are discussed in relation to data in the literature.

  7. Passive magnetic bearing configurations

    DOEpatents

    Post, Richard F [Walnut Creek, CA

    2011-01-25

    A journal bearing provides vertical and radial stability to a rotor of a passive magnetic bearing system when the rotor is not rotating and when it is rotating. In the passive magnetic bearing system, the rotor has a vertical axis of rotation. Without the journal bearing, the rotor is vertically and radially unstable when stationary, and is vertically stable and radially unstable when rotating.

  8. LASL passive program

    SciTech Connect

    Neeper, D.A.

    1980-01-01

    Recent accomplishments are outlined on the following tasks: (1) solar load ratio for sunspaces; (2) thermal performance of components and buildings; (3) convective loop test; (4) similarity study of interzone convection; (5) evaluation of phase-change thermal storage; (6) off-peak electrical auxiliary heating; (7) passive solar design handbook; (8) program support to DOE; and (9) passive cooling for residences. (WHK)

  9. Upgrade of the LHC magnet interconnections thermal shielding

    SciTech Connect

    Musso, Andrea; Barlow, Graeme; Bastard, Alain; Charrondiere, Maryline; Deferne, Guy; Dib, Gaëlle; Duret, Max; Guinchard, Michael; Prin, Hervé; Craen, Arnaud Vande; Villiger, Gilles; Chrul, Anna; Damianoglou, Dimitrios; Strychalski, Michał; Wright, Loren

    2014-01-29

    The about 1700 interconnections (ICs) between the Large Hadron Collider (LHC) superconducting magnets include thermal shielding at 50-75 K, providing continuity to the thermal shielding of the magnet cryostats to reduce the overall radiation heat loads to the 1.9 K helium bath of the magnets. The IC shield, made of aluminum, is conduction-cooled via a welded bridge to the thermal shield of the adjacent magnets which is actively cooled. TIG welding of these bridges made in the LHC tunnel at installation of the magnets induced a considerable risk of fire hazard due to the proximity of the multi-layer insulation of the magnet shields. A fire incident occurred in one of the machine sectors during machine installation, but fortunately with limited consequences thanks to prompt intervention of the operators. LHC is now undergoing a 2 years technical stop during which all magnet's ICs will have to be opened to consolidate the magnet electrical connections. The IC thermal shields will therefore have to be removed and re-installed after the work is completed. In order to eliminate the risk of fire hazard when re-welding, it has been decided to review the design of the IC shields, by replacing the welded bridges with a mechanical clamping which also preserves its thermal function. An additional advantage of this new solution is the ease in dismantling for maintenance, and eliminating weld-grinding operations at removal needing radioprotection measures because of material activation after long-term operation of the LHC. This paper describes the new design of the IC shields and in particular the theoretical and experimental validation of its thermal performance. Furthermore a status report of the on-going upgrade work in the LHC is given.

  10. Upgrade of the LHC magnet interconnections thermal shielding

    NASA Astrophysics Data System (ADS)

    Musso, Andrea; Barlow, Graeme; Bastard, Alain; Charrondiere, Maryline; Chrul, Anna; Damianoglou, Dimitrios; Deferne, Guy; Dib, Gaëlle; Duret, Max; Guinchard, Michael; Prin, Hervé; Strychalski, Michał; Craen, Arnaud Vande; Villiger, Gilles; Wright, Loren

    2014-01-01

    The about 1700 interconnections (ICs) between the Large Hadron Collider (LHC) superconducting magnets include thermal shielding at 50-75 K, providing continuity to the thermal shielding of the magnet cryostats to reduce the overall radiation heat loads to the 1.9 K helium bath of the magnets. The IC shield, made of aluminum, is conduction-cooled via a welded bridge to the thermal shield of the adjacent magnets which is actively cooled. TIG welding of these bridges made in the LHC tunnel at installation of the magnets induced a considerable risk of fire hazard due to the proximity of the multi-layer insulation of the magnet shields. A fire incident occurred in one of the machine sectors during machine installation, but fortunately with limited consequences thanks to prompt intervention of the operators. LHC is now undergoing a 2 years technical stop during which all magnet's ICs will have to be opened to consolidate the magnet electrical connections. The IC thermal shields will therefore have to be removed and re-installed after the work is completed. In order to eliminate the risk of fire hazard when re-welding, it has been decided to review the design of the IC shields, by replacing the welded bridges with a mechanical clamping which also preserves its thermal function. An additional advantage of this new solution is the ease in dismantling for maintenance, and eliminating weld-grinding operations at removal needing radioprotection measures because of material activation after long-term operation of the LHC. This paper describes the new design of the IC shields and in particular the theoretical and experimental validation of its thermal performance. Furthermore a status report of the on-going upgrade work in the LHC is given.

  11. Passive solar construction handbook

    SciTech Connect

    Levy, E.; Evans, D.; Gardstein, C.

    1981-08-01

    Many of the basic elements of passive solar design are reviewed. The unique design constraints presented in passive homes are introduced and many of the salient issues influencing design decisions are described briefly. Passive solar construction is described for each passive system type: direct gain, thermal storage wall, attached sunspace, thermal storage roof, and convective loop. For each system type, important design and construction issues are discussed and case studies illustrating designed and built examples of the system type are presented. Construction details are given and construction and thermal performance information is given for the materials used in collector components, storage components, and control components. Included are glazing materials, framing systems, caulking and sealants, concrete masonry, concrete, brick, shading, reflectors, and insulators. The Load Collector Ratio method for estimating passive system performance is appended, and other analysis methods are briefly summarized. (LEW)

  12. Aluminum anode for aluminum-air battery - Part II: Influence of In addition on the electrochemical characteristics of Al-Zn alloy in alkaline solution

    NASA Astrophysics Data System (ADS)

    Park, In-Jun; Choi, Seok-Ryul; Kim, Jung-Gu

    2017-07-01

    Effects of Zn and In additions on the aluminum anode for Al-air battery in alkaline solution are examined by the self-corrosion rate, cell voltage, current-voltage characteristics, anodic polarization, discharge performance and AC impedance measurements. The passivation behavior of Zn-added anode during anodic polarization decreases the discharge performance of Al-air battery. The addition of In to Al-Zn anode reduces the formation of Zn passivation film by repeated adsorption and desorption behavior of In ion onto anode surface. The attenuated Zn passive layer by In ion attack leads to the improvement of discharge performance of Al-air battery.

  13. Energy, Power & Interconnect Technologies Division Overview

    DTIC Science & Technology

    2010-02-26

    Battery Expertise Alkaline (Sealed/Vented) Lithium (Reserve/Active) Thermal Aluminum-Oxygen (Air) Cadmium-Oxygen (Air) Carbon-Zinc Mercury-Cadmium M Zi...Iron Nickel-Cadmium Nickel-Hydrogen Oxyhalide Polymer Sulfur Dioxide Sulfuryl Chloride Thionyl Chloride V di P t id um con o a su e Magnesium/Vanadium...T h i l W ki G– Troubleshoot, assess root cause, corrective actions • Test & Evaluation – Lithium battery safety testing – Design Verification

  14. Digital Logic and Reconfigurable Interconnects Using Aluminum Gallium Arsenide Electro-Optic Fredkin Gates

    DTIC Science & Technology

    1994-06-01

    the experimental data. rT4, for GaAs, measured by Faist and Reinhart,116 and rT4, for Alo.17GaowAs, measured by Glick, Reinhart and Martin , 14 were the...Kim and F. R. EI-Akkari, "Optical Channel Wavoguide Switch and Coupler Using Total Internal Reflection," IEEE Journal of Quantum Electronics, Vol. QE...Schienle, L. Stoll, G. Schulte-Roth, R. Muller-Nawrath, H. F. Mahlein, R. Marz and C. Cremer , ’GalnAsP/InP Zero- Gap Directional Couplers as Compact

  15. Development of Ceramic Interconnect Materials for SOFC

    SciTech Connect

    Yoon, Kyung J.; Stevenson, Jeffry W.; Marina, Olga A.

    2010-08-05

    Currently, acceptor-doped lanthanum chromite is the state-of-the-art ceramic interconnect material for high temperature solid oxide fuel cells (SOFCs) due to its fairly good electronic conductivity and chemical stability in both oxidizing and reducing atmospheres, and thermal compatibility with other cell components. The major challenge for acceptor-doped lanthanum chromite for SOFC interconnect applications is its inferior sintering behavior in air, which has been attributed to the development of a thin layer of Cr2O3 at the interparticle necks during the initial stages of sintering. In addition, lanthanum chromite is reactive with YSZ electrolyte at high temperatures, forming a highly resistive lanthanum zirconate phase (La2Zr2O7), which further complicates co-firing processes. Acceptor-doped yttrium chromite is considered to be one of the promising alternatives to acceptor-doped lanthanum chromite because it is more stable with respect to the formation of hydroxides in SOFC operating conditions, and the formation of impurity phases can be effectively avoided at co-firing temperatures. In addition, calcium-doped yttrium chromite exhibits higher mechanical strength than lanthanum chromite-based materials. The major drawback of yttrium chromite is considered to be its lower electrical conductivity than lanthanum chromite. The properties of yttrium chromites could possibly be improved and optimized by partial substitution of chromium with various transition metals. During FY10, PNNL investigated the effect of various transition metal doping on chemical stability, sintering and thermal expansion behavior, microstructure, electronic and ionic conductivity, and chemical compatibility with other cell components to develop the optimized ceramic interconnect material.

  16. Anti-amnestic properties of Ginkgo biloba extract on impaired memory function induced by aluminum in rats.

    PubMed

    Abd-Elhady, Rasha M; Elsheikh, Amira M; Khalifa, Amani E

    2013-11-01

    Aluminum is the most widely used non-ferrous metal. However, recently it is reported to be a neurotoxic agent that could induce biochemical defects in brain by affecting levels of neurotransmitters and generating reactive oxygen species resulting in oxidative stress. This study aimed at evaluating neuroprotective effect of Ginkgo biloba extract(2) (GBE) (200 mg/kg for 28 days) in antagonizing aluminum-induced neurotoxicity through investigating certain parameters such as serum aluminum level, brain aluminum content, brain regional distribution of aluminum, brain oxidative stress biomarkers' content, and brain acetylcholinesterase(3) (AChE) activity. Passive avoidance paradigm was used to assess memory retrieval of rats. Rats' activities were studied using open field test. Results showed that administration of aluminum (10 mg/kg for 28 days) impaired rats' memory retrieval associated with marked elevation of aluminum brain content, serum aluminum level and AChE activity. In addition, aluminum treatment induced significant elevation in its brain content in all tested regions. GBE treatment attenuated neurotoxic effects of aluminum as evidenced by improving rats' performance in passive avoidance and lowering brain AChE activity. Moreover, marked elevation in brain content of oxidized glutathione(4) (GSSG) and malonedialdehyde(5) (MDA) as well as depletion of reduced glutathione(6) (GSH) demonstrated following aluminum administration were reversed reaching normal levels after GBE treatment. Open field test, demonstrated no changes in latency period, number of ambulation, rearing, and grooming following aluminum or other treatments. Therefore, GBE may be a promising therapy ameliorating neurotoxicity of aluminum as an environmental toxic agent. Copyright © 2013 ISDN. Published by Elsevier Ltd. All rights reserved.

  17. Regeneration of aluminum hydride

    DOEpatents

    Graetz, Jason Allan; Reilly, James J.

    2009-04-21

    The present invention provides methods and materials for the formation of hydrogen storage alanes, AlH.sub.x, where x is greater than 0 and less than or equal to 6 at reduced H.sub.2 pressures and temperatures. The methods rely upon reduction of the change in free energy of the reaction between aluminum and molecular H.sub.2. The change in free energy is reduced by lowering the entropy change during the reaction by providing aluminum in a state of high entropy, by increasing the magnitude of the change in enthalpy of the reaction or combinations thereof.

  18. Regeneration of aluminum hydride

    DOEpatents

    Graetz, Jason Allan; Reilly, James J; Wegrzyn, James E

    2012-09-18

    The present invention provides methods and materials for the formation of hydrogen storage alanes, AlH.sub.x, where x is greater than 0 and less than or equal to 6 at reduced H.sub.2 pressures and temperatures. The methods rely upon reduction of the change in free energy of the reaction between aluminum and molecular H.sub.2. The change in free energy is reduced by lowering the entropy change during the reaction by providing aluminum in a state of high entropy, and by increasing the magnitude of the change in enthalpy of the reaction or combinations thereof.

  19. Elevated temperature aluminum alloys

    NASA Technical Reports Server (NTRS)

    Meschter, Peter (Inventor); Lederich, Richard J. (Inventor); O'Neal, James E. (Inventor)

    1989-01-01

    Three aluminum-lithium alloys are provided for high performance aircraft structures and engines. All three alloys contain 3 wt % copper, 2 wt % lithium, 1 wt % magnesium, and 0.2 wt % zirconium. Alloy 1 has no further alloying elements. Alloy 2 has the addition of 1 wt % iron and 1 wt % nickel. Alloy 3 has the addition of 1.6 wt % chromium to the shared alloy composition of the three alloys. The balance of the three alloys, except for incidentql impurities, is aluminum. These alloys have low densities and improved strengths at temperatures up to 260.degree. C. for long periods of time.

  20. Metallic Nanowire Interconnections for Integrated Circuit Fabrication

    NASA Technical Reports Server (NTRS)

    Ng, Hou Tee (Inventor); Li, Jun (Inventor); Meyyappan, Meyya (Inventor)

    2007-01-01

    A method for fabricating an electrical interconnect between two or more electrical components. A conductive layer is provided on a substarte and a thin, patterned catalyst array is deposited on an exposed surface of the conductive layer. A gas or vapor of a metallic precursor of a metal nanowire (MeNW) is provided around the catalyst array, and MeNWs grow between the conductive layer and the catalyst array. The catalyst array and a portion of each of the MeNWs are removed to provide exposed ends of the MeNWs.

  1. Environmental Regulation Impacts on Eastern Interconnection Performance

    SciTech Connect

    Markham, Penn N; Liu, Yilu; Young II, Marcus Aaron

    2013-07-01

    In the United States, recent environmental regulations will likely result in the removal of nearly 30 GW of oil and coal-fired generation from the power grid, mostly in the Eastern Interconnection (EI). The effects of this transition on voltage stability and transmission line flows have previously not been studied from a system-wide perspective. This report discusses the results of power flow studies designed to simulate the evolution of the EI over the next few years as traditional generation sources are replaced with environmentally friendlier ones such as natural gas and wind.

  2. Interconnection of Europe`s power systems

    SciTech Connect

    Manos, P.

    1996-03-01

    More than six years have passed since the Berlin Wall fell during Christmas of 1989, and a unified pan-European electricity-supply system is still not a reality. Progress toward that goal has been certain but slow. Technical and political differences still block the final step in the integration process: a full hookup between the grids of western and northern Europe and the transmission networks of the former Warsaw Pact nations. It has fallen to unified Germany, as the bridge between East and West, to serve as the catalyst of Europe`s electrical congress. This paper discusses the existing and planned interconnection along with a historical perspective.

  3. NITINOL Interconnect Device for Optical Fiber Waveguides

    DTIC Science & Technology

    1981-07-01

    LE EL,~NAVSEA REPORT NO. S27L~kV-NL 4P fNSWNC TR 81-129 1 JULY 1981 0 NITINOL INTERC&INECT DEVICE FOR OPTICAL FIBER WAVEGUIDES FINAL REPORT A...ACCESSION NO. 3. RECIPIENT’S CATALOG NUMBER NSWC TR 81-129I 1-19 -A )ci , ’ 4 TI TL E (and Sbtitle) S. TYPE OF REPORT & PERIOD COVERED NITINOL ... NITINOL Optical Fibers 20. ABSTRACT (Continue on reverse side if neceeewy and identify by block number) Two different interconnect devices for optical

  4. High density interconnection technology - Surface mount technology

    NASA Astrophysics Data System (ADS)

    Menozzi, G.

    The design features of surface mount technology (SMT) circuits for data transmission, engineering and aerospace applications are examined. Details of pin out, dual face, and interconnection techniques employed for SMT circuits mounted on plastic or ceramic leadless chip carriers are explored. The industrial processes applied to obtain the SMT boards are discussed, along with methods for quality assurance, especially for the soldered connections. SMT installations in the form of 4 Mbit multilayer circuits for an ESA project and a 32-bit mainframe computer are described.

  5. Repairable chip bonding/interconnect process

    DOEpatents

    Bernhardt, Anthony F.; Contolini, Robert J.; Malba, Vincent; Riddle, Robert A.

    1997-01-01

    A repairable, chip-to-board interconnect process which addresses cost and testability issues in the multi-chip modules. This process can be carried out using a chip-on-sacrificial-substrate technique, involving laser processing. This process avoids the curing/solvent evolution problems encountered in prior approaches, as well is resolving prior plating problems and the requirements for fillets. For repairable high speed chip-to-board connection, transmission lines can be formed on the sides of the chip from chip bond pads, ending in a gull wing at the bottom of the chip for subsequent solder.

  6. Repairable chip bonding/interconnect process

    DOEpatents

    Bernhardt, A.F.; Contolini, R.J.; Malba, V.; Riddle, R.A.

    1997-08-05

    A repairable, chip-to-board interconnect process which addresses cost and testability issues in the multi-chip modules is disclosed. This process can be carried out using a chip-on-sacrificial-substrate technique, involving laser processing. This process avoids the curing/solvent evolution problems encountered in prior approaches, as well is resolving prior plating problems and the requirements for fillets. For repairable high speed chip-to-board connection, transmission lines can be formed on the sides of the chip from chip bond pads, ending in a gull wing at the bottom of the chip for subsequent solder. 10 figs.

  7. Optically Tunable Gratings for Optical Interconnects

    DTIC Science & Technology

    1989-10-30

    OPTICALLY TUNABLE GRATINGS FOR OPTICAL INTERCONNECTS Final Report SELECTED JAN 2 31990 D ~ Submitted...such as acousto - optic or electro- optic deflectors . Using the strengths of our research program, we investigated optically tuneable gratings in...are those ~!,f~~ a~Sh~;~~L~~ d ~~9~H ~~t.:~~!-r~~~’~IU! 2 ~’h!~ ~H~~!~g:rtment of the Army position, 17. COSATI CODES 1 I. SUBJECT TERMS (Continut on

  8. The Upsides and Downsides of Organelle Interconnectivity.

    PubMed

    Gottschling, Daniel E; Nyström, Thomas

    2017-03-23

    Interconnectivity and feedback control are hallmarks of biological systems. This includes communication between organelles, which allows them to function and adapt to changing cellular environments. While the specific mechanisms for all communications remain opaque, unraveling the wiring of organelle networks is critical to understand how biological systems are built and why they might collapse, as occurs in aging. A comprehensive understanding of all the routes involved in inter-organelle communication is still lacking, but important themes are beginning to emerge, primarily in budding yeast. These routes are reviewed here in the context of sub-system proteostasis and complex adaptive systems theory. Copyright © 2017 Elsevier Inc. All rights reserved.

  9. Updating Interconnection Screens for PV System Integration

    SciTech Connect

    Coddington, M.; Mather, B.; Kroposki, B.; Lynn, K.; Razon, A.; Ellis, A.; Hill, R.; Key, T.; Nicole, K.; Smith, J.

    2012-02-01

    This white paper evaluates the origins and usefulness of the capacity penetration screen, offer short-term solutions which could effectively allow fast-track interconnection to many PV system applications, and considers longer-term solutions for increasing PV deployment levels in a safe and reliable manner while reducing or eliminating the emphasis on the penetration screen. Short-term and longer-term alternatives approaches are offered as examples; however, specific modifications to screening procedures should be discussed with stakeholders and must ultimately be adopted by state and federal regulatory bodies.

  10. Integrated interconnection systems for aerospace applications

    NASA Astrophysics Data System (ADS)

    Kerfoot, Keith; Gohman, Richard

    1988-05-01

    The application of an integrated interconnection system (IIS), which utilizes flat conductor cables and conventional round wire, to electrical system wiring in aircraft is examined. The advantages of the IIS to present wiring techniques are studied. The implementation of an IIS wiring network on the AH-64A Advanced Attack Helicopter is simulated. The system's weight, reliability, maintainability, performance, and production costs are analyzed. It is noted that the potential production cost savings make the IIS an applicable system for a new electrical wiring design.

  11. Optical Interconnection Via Computer-Generated Holograms

    NASA Technical Reports Server (NTRS)

    Liu, Hua-Kuang; Zhou, Shaomin

    1995-01-01

    Method of free-space optical interconnection developed for data-processing applications like parallel optical computing, neural-network computing, and switching in optical communication networks. In method, multiple optical connections between multiple sources of light in one array and multiple photodetectors in another array made via computer-generated holograms in electrically addressed spatial light modulators (ESLMs). Offers potential advantages of massive parallelism, high space-bandwidth product, high time-bandwidth product, low power consumption, low cross talk, and low time skew. Also offers advantage of programmability with flexibility of reconfiguration, including variation of strengths of optical connections in real time.

  12. PROCESS FOR REMOVING ALUMINUM COATINGS

    DOEpatents

    Flox, J.

    1959-07-01

    A process is presented for removing aluminum jackets or cans from uranium slugs. This is accomplished by immersing the aluminum coated uranium slugs in an aqueous solution of 9 to 20% sodium hydroxide and 35 to 12% sodium nitrate to selectively dissolve the aluminum coating, the amount of solution being such as to obtain a molar ratio of sodium hydroxide to aluminum of at least

  13. Aluminum Alloy 7068 Mechanical Characterization

    DTIC Science & Technology

    2009-08-01

    strength of 99 ksi (2). The commonly specified material properties for extruded 7068 aluminum are shown in table 1, along with 7050 and 7075 aluminum ...alloys for comparison (3). Table 1. Mechanical property comparison of high-strength aluminum alloys. Property Alloy 7068 7075 7050 Elastic... Aluminum Alloy 7068 Mechanical Characterization by Michael Minnicino, David Gray, and Paul Moy ARL-TR-4913 August 2009

  14. Mapping the global journey of anthropogenic aluminum: a trade-linked multilevel material flow analysis.

    PubMed

    Liu, Gang; Müller, Daniel B

    2013-10-15

    Material cycles have become increasingly coupled and interconnected in a globalizing era. While material flow analysis (MFA) has been widely used to characterize stocks and flows along technological life cycle within a specific geographical area, trade networks among individual cycles have remained largely unexplored. Here we developed a trade-linked multilevel MFA model to map the contemporary global journey of anthropogenic aluminum. We demonstrate that the anthropogenic aluminum cycle depends substantially on international trade of aluminum in all forms and becomes highly interconnected in nature. While the Southern hemisphere is the main primary resource supplier, aluminum production and consumption concentrate in the Northern hemisphere, where we also find the largest potential for recycling. The more developed countries tend to have a substantial and increasing presence throughout the stages after bauxite refining and possess highly consumption-based cycles, thus maintaining advantages both economically and environmentally. A small group of countries plays a key role in the global redistribution of aluminum and in the connectivity of the network, which may render some countries vulnerable to supply disruption. The model provides potential insights to inform government and industry policies in resource criticality, supply chain security, value chain management, and cross-boundary environmental impacts mitigation.

  15. Electrically conductive anodized aluminum coatings

    NASA Technical Reports Server (NTRS)

    Alwitt, Robert S. (Inventor); Liu, Yanming (Inventor)

    2001-01-01

    A process for producing anodized aluminum with enhanced electrical conductivity, comprising anodic oxidation of aluminum alloy substrate, electrolytic deposition of a small amount of metal into the pores of the anodized aluminum, and electrolytic anodic deposition of an electrically conductive oxide, including manganese dioxide, into the pores containing the metal deposit; and the product produced by the process.

  16. An interconnecting bus power optimization method combining interconnect wire spacing with wire ordering

    NASA Astrophysics Data System (ADS)

    Zhu, Zhang-Ming; Hao, Bao-Tian; En, Yun-Fei; Yang, Yin-Tang; Li, Yue-Jin

    2011-06-01

    On-chip interconnect buses consume tens of percents of dynamic power in a nanometer scale integrated circuit and they will consume more power with the rapid scaling down of technology size and continuously rising clock frequency, therefore it is meaningful to lower the interconnecting bus power in design. In this paper, a simple yet accurate interconnect parasitic capacitance model is presented first and then, based on this model, a novel interconnecting bus optimization method is proposed. Wire spacing is a process for spacing wires for minimum dynamic power, while wire ordering is a process that searches for wire orders that maximally enhance it. The method, i.e., combining wire spacing with wire ordering, focuses on bus dynamic power optimization with a consideration of bus performance requirements. The optimization method is verified based on various nanometer technology parameters, showing that with 50% slack of routing space, 25.71% and 32.65% of power can be saved on average by the proposed optimization method for a global bus and an intermediate bus, respectively, under a 65-nm technology node, compared with 21.78% and 27.68% of power saved on average by uniform spacing technology. The proposed method is especially suitable for computer-aided design of nanometer scale on-chip buses.

  17. National Offshore Wind Energy Grid Interconnection Study

    SciTech Connect

    Daniel, John P.; Liu, Shu; Ibanez, Eduardo; Pennock, Ken; Reed, Greg; Hanes, Spencer

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States. A total of 54GW of offshore wind was assumed to be the target for the analyses conducted. A variety of issues are considered including: the anticipated staging of offshore wind; the offshore wind resource availability; offshore wind energy power production profiles; offshore wind variability; present and potential technologies for collection and delivery of offshore wind energy to the onshore grid; potential impacts to existing utility systems most likely to receive large amounts of offshore wind; and regulatory influences on offshore wind development. The technologies considered the reliability of various high-voltage ac (HVAC) and high-voltage dc (HVDC) technology options and configurations. The utility system impacts of GW-scale integration of offshore wind are considered from an operational steady-state perspective and from a regional and national production cost perspective.

  18. Message Passing Framework for Globally Interconnected Clusters

    NASA Astrophysics Data System (ADS)

    Hafeez, M.; Asghar, S.; Malik, U. A.; Rehman, A.; Riaz, N.

    2011-12-01

    In prevailing technology trends it is apparent that the network requirements and technologies will advance in future. Therefore the need of High Performance Computing (HPC) based implementation for interconnecting clusters is comprehensible for scalability of clusters. Grid computing provides global infrastructure of interconnecting clusters consisting of dispersed computing resources over Internet. On the other hand the leading model for HPC programming is Message Passing Interface (MPI). As compared to Grid computing, MPI is better suited for solving most of the complex computational problems. MPI itself is restricted to a single cluster. It does not support message passing over the internet to use the computing resources of different clusters in an optimal way. We propose a model that provides message passing capabilities between parallel applications over the internet. The proposed model is based on Architecture for Java Universal Message Passing (A-JUMP) framework and Enterprise Service Bus (ESB) named as High Performance Computing Bus. The HPC Bus is built using ActiveMQ. HPC Bus is responsible for communication and message passing in an asynchronous manner. Asynchronous mode of communication offers an assurance for message delivery as well as a fault tolerance mechanism for message passing. The idea presented in this paper effectively utilizes wide-area intercluster networks. It also provides scheduling, dynamic resource discovery and allocation, and sub-clustering of resources for different jobs. Performance analysis and comparison study of the proposed framework with P2P-MPI are also presented in this paper.

  19. IETI – Isogeometric Tearing and Interconnecting

    PubMed Central

    Kleiss, Stefan K.; Pechstein, Clemens; Jüttler, Bert; Tomar, Satyendra

    2012-01-01

    Finite Element Tearing and Interconnecting (FETI) methods are a powerful approach to designing solvers for large-scale problems in computational mechanics. The numerical simulation problem is subdivided into a number of independent sub-problems, which are then coupled in appropriate ways. NURBS- (Non-Uniform Rational B-spline) based isogeometric analysis (IGA) applied to complex geometries requires to represent the computational domain as a collection of several NURBS geometries. Since there is a natural decomposition of the computational domain into several subdomains, NURBS-based IGA is particularly well suited for using FETI methods. This paper proposes the new IsogEometric Tearing and Interconnecting (IETI) method, which combines the advanced solver design of FETI with the exact geometry representation of IGA. We describe the IETI framework for two classes of simple model problems (Poisson and linearized elasticity) and discuss the coupling of the subdomains along interfaces (both for matching interfaces and for interfaces with T-joints, i.e. hanging nodes). Special attention is paid to the construction of a suitable preconditioner for the iterative linear solver used for the interface problem. We report several computational experiments to demonstrate the performance of the proposed IETI method. PMID:24511167

  20. Aspects of short-range interconnect packaging

    NASA Astrophysics Data System (ADS)

    Wohlfeld, Denis; Brenner, Karl-Heinz

    2012-01-01

    In short-range interconnect applications, one question arises frequently: When should optical solutions be chosen over electrical wiring? The answer to this question of course depends on several factors like costs, performance, reliability, availability of testing equipment and knowledge about optical technologies, and last but not least, it strongly depends on the application itself. Networking in high performance computing (HPC) is one such example. With bit rates around 10 Gbit/s per channel and cable length above 2 m, the high attenuation of electrical cables leads to a clear preference of optical or active optical cables (AOC) for most planned HPC systems. For AOCs, the electro-optical conversion is realized inside the connector housing, while for purely optical cables, the conversion is done at the edge of the board. Proceeding to 25 Gbit/s and higher, attenuation and loss of signal quality become critical. Therefore, either significantly more effort has to be spent on the electrical side, or the package for conversion has to be integrated closer to the chip, thus requiring new packaging technologies. The paper provides a state of the art overview of packaging concepts for short range interconnects, it describes the main challenges of optical package integration and illustrates new concepts and trends in this research area.

  1. Interconnected ponds operation for flood hazard distribution

    NASA Astrophysics Data System (ADS)

    Putra, S. S.; Ridwan, B. W.

    2016-05-01

    The climatic anomaly, which comes with extreme rainfall, will increase the flood hazard in an area within a short period of time. The river capacity in discharging the flood is not continuous along the river stretch and sensitive to the flood peak. This paper contains the alternatives on how to locate the flood retention pond that are physically feasible to reduce the flood peak. The flood ponds were designed based on flood curve number criteria (TR-55, USDA) with the aim of rapid flood peak capturing and gradual flood retuning back to the river. As a case study, the hydrologic condition of upper Ciliwung river basin with several presumed flood pond locations was conceptually designed. A fundamental tank model that reproducing the operation of interconnected ponds was elaborated to achieve the designed flood discharge that will flows to the downstream area. The flood hazard distribution status, as the model performance criteria, will be computed within Ciliwung river reach in Manggarai Sluice Gate spot. The predicted hazard reduction with the operation of the interconnected retention area result had been bench marked with the normal flow condition.

  2. Si photonics technology for future optical interconnection

    NASA Astrophysics Data System (ADS)

    Zheng, Xuezhe; Krishnamoorthy, Ashok V.

    2011-12-01

    Scaling of computing systems require ultra-efficient interconnects with large bandwidth density. Silicon photonics offers a disruptive solution with advantages in reach, energy efficiency and bandwidth density. We review our progress in developing building blocks for ultra-efficient WDM silicon photonic links. Employing microsolder based hybrid integration with low parasitics and high density, we optimize photonic devices on SOI platforms and VLSI circuits on more advanced bulk CMOS technology nodes independently. Progressively, we successfully demonstrated single channel hybrid silicon photonic transceivers at 5 Gbps and 10 Gbps, and 80 Gbps arrayed WDM silicon photonic transceiver using reverse biased depletion ring modulators and Ge waveguide photo detectors. Record-high energy efficiency of less than 100fJ/bit and 385 fJ/bit were achieved for the hybrid integrated transmitter and receiver, respectively. Waveguide grating based optical proximity couplers were developed with low loss and large optical bandwidth to enable multi-layer intra/inter-chip optical interconnects. Thermal engineering of WDM devices by selective substrate removal, together with WDM link using synthetic wavelength comb, we significantly improved the device tuning efficiency and reduced the tuning range. Using these innovative techniques, two orders of magnitude tuning power reduction was achieved. And tuning cost of only a few 10s of fJ/bit is expected for high data rate WDM silicon photonic links.

  3. Method of doping interconnections for electrochemical cells

    DOEpatents

    Pal, Uday B.; Singhal, Subhash C.; Moon, David M.; Folser, George R.

    1990-01-01

    A dense, electronically conductive interconnection layer 26 is bonded on a porous, tubular, electronically conductive air electrode structure 16, optionally supported by a ceramic support 22, by (A) forming a layer of oxide particles of at least one of the metals Ca, Sr, Co, Ba or Mg on a part 24 of a first surface of the air electrode 16, (B) heating the electrode structure, (C) applying a halide vapor containing at least lanthanum halide and chromium halide to the first surface and applying a source of oxygen to a second opposite surface of the air electrode so that they contact at said first surface, to cause a reaction of the oxygen and halide and cause a dense lanthanum-chromium oxide structure to grow, from the first electrode surface, between and around the oxide particles, where the metal oxide particles get incoporated into the lanthanum-chromium oxide structure as it grows thicker with time, and the metal ions in the oxide particles diffuse into the bulk of the lanthamum-chromium oxide structure, to provide a dense, top, interconnection layer 26 on top of the air electrode 16. A solid electrolyte layer 18 can be applied to the uncovered portion of the air electrode, and a fuel electrode 20 can be applied to the solid electrolyte, to provide an electrochemical cell 10.

  4. European Transmission Interconnection; Eurasian power grid

    SciTech Connect

    Posch, J. )

    1991-09-01

    Systems and philosophies perceived on a grand scale, encompassing new ideas, are often characterized as a dream. But in fact, such dreams often lead to the first step to fruitful development. This article is based on a preliminary study of the existing electrical high-tension networks of Western Europe, Eastern Europe and the Soviet Union - which, as explained herein, may be merged into a multinational energy supply system. Such a system would constitute a completely interconnected Eurasian Power Grid. The idea of a Eurasian super grid, spanning from the Atlantic to the Ural and Siberia, is not new. Various studies have been conducted by both western Europe and the Soviet Union on this topic. Our world is currently in an era of extra high voltage (EHV) and ultra high voltage (UHV) electrical systems. This translates into existing UHV lines of 1150 kV which have already been proven in successful operation. Such UHV systems are capable of transmitting thousands of megawatts over a distance of a 1000 miles. Furthermore, national boundaries are not more a hindrance than the challenge of interconnecting complete networks into an overall synchronized working system with load exchange capabilities in all directions.

  5. Aluminum Sulfate 18 Hydrate

    ERIC Educational Resources Information Center

    Young, Jay A.

    2004-01-01

    A chemical laboratory information profile (CLIP) of the chemical, aluminum sulfate 18 hydrate, is presented. The profile lists physical and harmful properties, exposure limits, reactivity risks, and symptoms of major exposure for the benefit of teachers and students using the chemical in the laboratory.

  6. Mechanisms of aluminum tolerance

    USDA-ARS?s Scientific Manuscript database

    Aluminum (Al) toxicity limits agricultural productivity over much of the world’s arable land by inhibiting root growth and development. Affected plants have difficulty in acquiring adequate water and nutrition from their soil environments and thus have stunted shoot development and diminished yield....

  7. Maize aluminum tolerance

    USDA-ARS?s Scientific Manuscript database

    Maize is one of the most economically important food crops grown on acid soils, where aluminum (Al) toxicity greatly limits crop yields. Considerable variation for Al tolerance exists in maize, and this variation has been exploited for many years by plant breeders to enhance maize Al tolerance. Curr...

  8. Markets for recovered aluminum

    SciTech Connect

    Not Available

    1993-04-01

    The study describes the operation of the markets for scrap aluminum as an example of how recycling markets are structured, what factors influence the supply of and demand for materials, what projections can be made about recycling markets, and how government policies to increase recycling may affect these markets.

  9. Building an aluminum car

    SciTech Connect

    Ashley, S.

    1994-05-01

    This article examines the increasing use of aluminum in automobiles to decrease weight and consequently increase fuel economy. The topics of the article include federal fuel economy goals, the development of optimum body structure and manufacturing techniques, comparison with steel, cost of materials, weight reduction and recycling of materials.

  10. Fluxless aluminum brazing

    DOEpatents

    Werner, W.J.

    1974-01-01

    This invention relates to a fluxless brazing alloy for use in forming brazed composites made from members of aluminum and its alloys. The brazing alloy consists of 35-55% Al, 10--20% Si, 25-60% Ge; 65-88% Al, 2-20% Si, 2--18% In; 65--80% Al, 15-- 25% Si, 5- 15% Y. (0fficial Gazette)

  11. Aluminum battery alloys

    DOEpatents

    Thompson, D.S.; Scott, D.H.

    1984-09-28

    Aluminum alloys suitable for use as anode structures in electrochemical cells are disclosed. These alloys include iron levels higher than previously felt possible, due to the presence of controlled amounts of manganese, with possible additions of magnesium and controlled amounts of gallium.

  12. Aluminum battery alloys

    DOEpatents

    Thompson, David S.; Scott, Darwin H.

    1985-01-01

    Aluminum alloys suitable for use as anode structures in electrochemical cs are disclosed. These alloys include iron levels higher than previously felt possible, due to the presence of controlled amounts of manganese, with possible additions of magnesium and controlled amounts of gallium.

  13. Aluminum Sulfate 18 Hydrate

    ERIC Educational Resources Information Center

    Young, Jay A.

    2004-01-01

    A chemical laboratory information profile (CLIP) of the chemical, aluminum sulfate 18 hydrate, is presented. The profile lists physical and harmful properties, exposure limits, reactivity risks, and symptoms of major exposure for the benefit of teachers and students using the chemical in the laboratory.

  14. REMOVAL OF ALUMINUM COATINGS

    DOEpatents

    Peterson, J.H.

    1959-08-25

    A process is presented for dissolving aluminum jackets from uranium fuel elements without attack of the uranium in a boiling nitric acid-mercuric nitrate solution containing up to 50% by weight of nitrtc acid and mercuric nitrate in a concentration of between 0.05 and 1% by weight.

  15. Bonding aluminum beam leads

    NASA Technical Reports Server (NTRS)

    Burkett, F. S.

    1978-01-01

    Report makes it relatively easy for hybrid-circuit manufacturers to convert integrated circuit chips with aluminum bead leads. Report covers: techniques for handling tiny chips; proper geometries for ultrasonic bonding tips; best combinations of pressure, pulse time, and ultrasonic energy for bonding; and best thickness for metal films to which beam leads are bonded.

  16. Passive Resonant Bidirectional Converter with Galvanic Barrier

    NASA Technical Reports Server (NTRS)

    Rosenblad, Nathan S. (Inventor)

    2014-01-01

    A passive resonant bidirectional converter system that transports energy across a galvanic barrier includes a converter using at least first and second converter sections, each section including a pair of transfer terminals, a center tapped winding; a chopper circuit interconnected between the center tapped winding and one of the transfer terminals; an inductance feed winding interconnected between the other of the transfer terminals and the center tap and a resonant tank circuit including at least the inductance of the center tap winding and the parasitic capacitance of the chopper circuit for operating the converter section at resonance; the center tapped windings of the first and second converter sections being disposed on a first common winding core and the inductance feed windings of the first and second converter sections being disposed on a second common winding core for automatically synchronizing the resonant oscillation of the first and second converter sections and transferring energy between the converter sections until the voltage across the pairs of transfer terminals achieves the turns ratio of the center tapped windings.

  17. SOLDERING OF ALUMINUM BASE METALS

    DOEpatents

    Erickson, G.F.

    1958-02-25

    This patent deals with the soldering of aluminum to metals of different types, such as copper, brass, and iron. This is accomplished by heating the aluminum metal to be soldered to slightly above 30 deg C, rubbing a small amount of metallic gallium into the part of the surface to be soldered, whereby an aluminum--gallium alloy forms on the surface, and then heating the aluminum piece to the melting point of lead--tin soft solder, applying lead--tin soft solder to this alloyed surface, and combining the aluminum with the other metal to which it is to be soldered.

  18. Rapid manufacturing of aluminum components.

    PubMed

    Sercombe, T B; Schaffer, G B

    2003-08-29

    A manufacturing technique for the production of aluminum components is described. A resin-bonded part is formed by a rapid prototyping technique and then debound and infiltrated by a second aluminum alloy under a nitrogen atmosphere. During thermal processing, the aluminum reacts with the nitrogen and is partially transformed into a rigid aluminum nitride skeleton, which provides the structural rigidity during infiltration. The simplicity and rapidity of this process in comparison to conventional production routes, combined with the ability to fabricate complicated parts of almost any geometry and with high dimensional precision, provide an additional means to manufacture aluminum components.

  19. Reconfigurable Optical Interconnections Via Dynamic Computer-Generated Holograms

    NASA Technical Reports Server (NTRS)

    Liu, Hua-Kuang (Inventor); Zhou, Shao-Min (Inventor)

    1996-01-01

    A system is presented for optically providing one-to-many irregular interconnections, and strength-adjustable many-to-many irregular interconnections which may be provided with strengths (weights) w(sub ij) using multiple laser beams which address multiple holograms and means for combining the beams modified by the holograms to form multiple interconnections, such as a cross-bar switching network. The optical means for interconnection is based on entering a series of complex computer-generated holograms on an electrically addressed spatial light modulator for real-time reconfigurations, thus providing flexibility for interconnection networks for large-scale practical use. By employing multiple sources and holograms, the number of interconnection patterns achieved is increased greatly.

  20. Reconfigurable optical interconnections via dynamic computer-generated holograms

    NASA Technical Reports Server (NTRS)

    Liu, Hua-Kuang (Inventor); Zhou, Shaomin (Inventor)

    1994-01-01

    A system is proposed for optically providing one-to-many irregular interconnections, and strength-adjustable many-to-many irregular interconnections which may be provided with strengths (weights) w(sub ij) using multiple laser beams which address multiple holograms and means for combining the beams modified by the holograms to form multiple interconnections, such as a cross-bar switching network. The optical means for interconnection is based on entering a series of complex computer-generated holograms on an electrically addressed spatial light modulator for real-time reconfigurations, thus providing flexibility for interconnection networks for largescale practical use. By employing multiple sources and holograms, the number of interconnection patterns achieved is increased greatly.

  1. Variational Integrators for Interconnected Lagrange-Dirac Systems

    NASA Astrophysics Data System (ADS)

    Parks, Helen; Leok, Melvin

    2017-02-01

    Interconnected systems are an important class of mathematical models, as they allow for the construction of complex, hierarchical, multiphysics, and multiscale models by the interconnection of simpler subsystems. Lagrange-Dirac mechanical systems provide a broad category of mathematical models that are closed under interconnection, and in this paper, we develop a framework for the interconnection of discrete Lagrange-Dirac mechanical systems, with a view toward constructing geometric structure-preserving discretizations of interconnected systems. This work builds on previous work on the interconnection of continuous Lagrange-Dirac systems (Jacobs and Yoshimura in J Geom Mech 6(1):67-98, 2014) and discrete Dirac variational integrators (Leok and Ohsawa in Found Comput Math 11(5), 529-562, 2011). We test our results by simulating some of the continuous examples given in Jacobs and Yoshimura (2014).

  2. Techniques for active passivation

    SciTech Connect

    Roscioli, Joseph R.; Herndon, Scott C.; Nelson, Jr., David D.

    2016-12-20

    In one embodiment, active (continuous or intermittent) passivation may be employed to prevent interaction of sticky molecules with interfaces inside of an instrument (e.g., an infrared absorption spectrometer) and thereby improve response time. A passivation species may be continuously or intermittently applied to an inlet of the instrument while a sample gas stream is being applied. The passivation species may have a highly polar functional group that strongly binds to either water or polar groups of the interfaces, and once bound presents a non-polar group to the gas phase in order to prevent further binding of polar molecules. The instrument may be actively used to detect the sticky molecules while the passivation species is being applied.

  3. Hood River Passive House

    SciTech Connect

    Hales, D.

    2013-03-01

    The Hood River Passive Project was developed by Root Design Build of Hood River Oregon using the Passive House Planning Package (PHPP) to meet all of the requirements for certification under the European Passive House standards. The Passive House design approach has been gaining momentum among residential designers for custom homes and BEopt modeling indicates that these designs may actually exceed the goal of the U.S. Department of Energy's (DOE) Building America program to reduce home energy use by 30%-50% (compared to 2009 energy codes for new homes). This report documents the short term test results of the Shift House and compares the results of PHPP and BEopt modeling of the project.

  4. Application of optical interconnect technology at Lawrence Livermore National Laboratory

    SciTech Connect

    Haigh, R.E.; Lowry, M.E.; McCammon, K.; Hills, R.; Mitchell, R.; Sweider, D.

    1995-08-10

    Optical interconnects will be required to meet the information bandwidth requirements of future communication and computing applications. At Lawrence Livermore National Laboratory, the authors are involved in applying optical interconnect technologies in two distinct application areas: Multi-Gigabit/sec Computer Backplanes and Gigabit/sec Wide Area Networking using Wavelength Division Multiplexing. In this paper, the authors discuss their efforts to integrate optical interconnect technologies into prototype computing and communication systems.

  5. Identification of Functionally Interconnected Neurons Using Factor Analysis

    PubMed Central

    Farfán, Fernando D.; Albarracín, Ana L.; Pizá, Alvaro G.; Lucianna, Facundo A.; Felice, Carmelo J.

    2017-01-01

    The advances in electrophysiological methods have allowed registering the joint activity of single neurons. Thus, studies on functional dynamics of complex-valued neural networks and its information processing mechanism have been conducted. Particularly, the methods for identifying neuronal interconnections are in increasing demand in the area of neurosciences. Here, we proposed a factor analysis to identify functional interconnections among neurons via spike trains. This method was evaluated using simulations of neural discharges from different interconnections schemes. The results have revealed that the proposed method not only allows detecting neural interconnections but will also allow detecting the presence of presynaptic neurons without the need of the recording of them. PMID:28491091

  6. Identification of Functionally Interconnected Neurons Using Factor Analysis.

    PubMed

    Soletta, Jorge H; Farfán, Fernando D; Albarracín, Ana L; Pizá, Alvaro G; Lucianna, Facundo A; Felice, Carmelo J

    2017-01-01

    The advances in electrophysiological methods have allowed registering the joint activity of single neurons. Thus, studies on functional dynamics of complex-valued neural networks and its information processing mechanism have been conducted. Particularly, the methods for identifying neuronal interconnections are in increasing demand in the area of neurosciences. Here, we proposed a factor analysis to identify functional interconnections among neurons via spike trains. This method was evaluated using simulations of neural discharges from different interconnections schemes. The results have revealed that the proposed method not only allows detecting neural interconnections but will also allow detecting the presence of presynaptic neurons without the need of the recording of them.

  7. Oscillations in interconnected complex networks under intentional attack

    NASA Astrophysics Data System (ADS)

    Zhang, Wen-Ping; Xia, Yongxiang; Tan, Fei

    2016-01-01

    Many real-world networks are interconnected with each other. In this paper, we study the traffic dynamics in interconnected complex networks under an intentional attack. We find that with the shortest time delay routing strategy, the traffic dynamics can show the stable state, periodic, quasi-periodic and chaotic oscillations, when the capacity redundancy parameter changes. Moreover, compared with isolated complex networks, oscillations always take place in interconnected networks more easily. Thirdly, in interconnected networks, oscillations are affected strongly by the coupling probability and coupling preference.

  8. Compact Interconnection Networks Based on Quantum Dots

    NASA Technical Reports Server (NTRS)

    Fijany, Amir; Toomarian, Nikzad; Modarress, Katayoon; Spotnitz, Matthew

    2003-01-01

    Architectures that would exploit the distinct characteristics of quantum-dot cellular automata (QCA) have been proposed for digital communication networks that connect advanced digital computing circuits. In comparison with networks of wires in conventional very-large-scale integrated (VLSI) circuitry, the networks according to the proposed architectures would be more compact. The proposed architectures would make it possible to implement complex interconnection schemes that are required for some advanced parallel-computing algorithms and that are difficult (and in many cases impractical) to implement in VLSI circuitry. The difficulty of implementation in VLSI and the major potential advantage afforded by QCA were described previously in Implementing Permutation Matrices by Use of Quantum Dots (NPO-20801), NASA Tech Briefs, Vol. 25, No. 10 (October 2001), page 42. To recapitulate: Wherever two wires in a conventional VLSI circuit cross each other and are required not to be in electrical contact with each other, there must be a layer of electrical insulation between them. This, in turn, makes it necessary to resort to a noncoplanar and possibly a multilayer design, which can be complex, expensive, and even impractical. As a result, much of the cost of designing VLSI circuits is associated with minimization of data routing and assignment of layers to minimize crossing of wires. Heretofore, these considerations have impeded the development of VLSI circuitry to implement complex, advanced interconnection schemes. On the other hand, with suitable design and under suitable operating conditions, QCA-based signal paths can be allowed to cross each other in the same plane without adverse effect. In principle, this characteristic could be exploited to design compact, coplanar, simple (relative to VLSI) QCA-based networks to implement complex, advanced interconnection schemes. The proposed architectures require two advances in QCA-based circuitry beyond basic QCA-based binary

  9. Behavior of aluminum in aluminum welders and manufacturers of aluminum sulfate--impact on biological monitoring.

    PubMed

    Riihimäki, Vesa; Valkonen, Sinikka; Engström, Bernt; Tossavainen, Antti; Mutanen, Pertti; Aitio, Antero

    2008-12-01

    The suitability of determining aluminum in serum or urine as a form of biological monitoring was critically assessed. Airborne and internal aluminum exposure was assessed for 12 aluminum welders in a shipyard and 5 manufacturers of aluminum sulfate. Particles were characterized with X-ray diffraction and scanning electron microscopy. Aluminum in air and biological samples was analyzed using electrothermal atomic absorption spectrometry. Basic toxicokinetic features were inferred from the data. The mean 8-hour time-weighted average concentration of aluminum was 1.1 (range 0.008-6.1) mg/m(3) for the shipyard and 0.13 (range 0.02-0.5) mg/m(3) for the aluminum sulfate plant. Welding fume contained aluminum oxide particles <0.1 microm in diameter and their agglomerates, whereas bauxite and aluminum sulfate particles ranged from 1 to 10 microm in diameter. The shipyard welders' mean postshift serum and urinary concentrations of aluminum (S-Al and U-Al, respectively) were 0.22 and 3.4 micromol/l, respectively, and the aluminum sulfate workers' corresponding values were 0.13 and 0.58 micromol/l. Between two shifts, the welders' S-Al concentration decreased by about 50% (P<0.01), but their U-Al concentration did not change (P=0.64). No corresponding temporal changes occurred among the aluminum sulfate workers. After aluminum welding at the shipyard had ceased, the median S-Al concentration decreased by about 50% (P=0.007) within a year, but there was no change (P=0.75) in the corresponding U-Al concentration. About 1% of aluminum in welding fume appears to be rapidly absorbed from the lungs, whereas an undetermined fraction is retained and forms a lung burden. A higher fractional absorption of aluminum seems possible for aluminum sulfate workers without evidence of a lung burden. After rapid absorption, aluminum is slowly mobilized from the lung burden and dominates the S-Al and U-Al concentrations of aluminum welders. For kinetic reasons, S-Al or U-Al concentrations cannot

  10. Passivation layer on polyimide deposited by combined plasma immersion ion implantation and deposition and cathodic vacuum arc technique

    SciTech Connect

    Han, Z. J.; Tay, B. K.; Sze, J. Y.; Ha, P. C. T.

    2007-05-15

    A thin passivation layer of aluminum oxide was deposited on polyimide by using the combined plasma immersion ion implantation and deposition (PIII and D) and cathodic vacuum arc technique. X-ray photoelectron spectroscopy C 1s spectra showed that the carbonyl bond (C=O) and ether group (C-O-C and C-N-C) presented in pristine polyimide were damaged by implantation of aluminum ions and deposition of an aluminum oxide passivation layer. O 1s and Al 2p spectra confirmed the formation of a thin aluminum oxide passivation layer. This passivation layer can be implemented in aerospace engineering where polyimide may suffer degradation from fast atomic oxygen in the low-earth-orbit environment. To test the protection of this passivation layer to energetic oxygen ions, a plasma-enhanced chemical vapor deposition system was used to simulate the oxygen-ion irradiation, and the results showed that a higher weight occurred for passivated samples compared to pristine ones. X-ray diffraction showed that Al peaks were presented on the surface region, but no aluminum oxide peak was detected. The authors then concluded that Al clusters were formed in polyimide besides aluminum oxide, which was in an x-ray amorphous state. Furthermore, contact-angle measurements showed a reduced contact angle for passivated polyimide from a pristine value of 78 deg. to 20 deg. by using deionized water. Several discussions have been made on the surface chemical and structural property changes by using the combined PIII and D and cathodic vacuum arc technique.

  11. Interconnection capacitance models for VLSI circuits

    NASA Astrophysics Data System (ADS)

    Wong, Shyh-Chyi; Liu, Patrick S.; Ru, Jien-Wen; Lin, Shi-Tron

    1998-06-01

    A new set of capacitance models is developed for delay estimation of VLSI interconnections. The set of models is derived for five representative wiring structures, with their combinations covering arbitrary VLSI layouts. A semi-empirical approach is adopted to deal with complicated geometry nature in VLSI and to allow for closed-form capacitance formulas to be developed to provide direct observation of capacitance variation vs process parameters as well as computational efficiency for circuit simulation. The formulas are given explicitly in terms of wire width, wire thickness, dielectric thickness and inter-wire spacing. The models show good agreement with numerical solutions from RAPHAEL and measurement data of fabricated capacitance test structures. The models are further applied and validated on a ring oscillator. It is shown that the frequency of the ring oscillator obtained from HSPICE simulation with our models agrees well with the bench measurement.

  12. Virtual interconnection platform initiative scoping study

    SciTech Connect

    Liu, Yong; Kou, Gefei; Pan, Zuohong; Liu, Yilu; King Jr., Thomas J.

    2016-01-01

    Due to security and liability concerns, the research community has limited access to realistic large-scale power grid models to test and validate new operation and control methodologies. It is also difficult for industry to evaluate the relative value of competing new tools without a common platform for comparison. This report proposes to develop a large-scale virtual power grid model that retains basic features and represents future trends of major U.S. electric interconnections. This model will include realistic power flow and dynamics information as well as a relevant geospatial distribution of assets. This model will be made widely available to the research community for various power system stability and control studies and can be used as a common platform for comparing the efficacies of various new technologies.

  13. Forming electrical interconnections through semiconductor wafers

    NASA Technical Reports Server (NTRS)

    Anthony, T. R.

    1981-01-01

    An information processing system based on CMOS/SOS technology is being developed by NASA to process digital image data collected by satellites. An array of holes is laser drilled in a semiconductor wafer, and a conductor is formed in the holes to fabricate electrical interconnections through the wafers. Six techniques are used to form conductors in the silicon-on-sapphire (SOS) wafers, including capillary wetting, wedge extrusion, wire intersection, electroless plating, electroforming, double-sided sputtering and through-hole electroplating. The respective strengths and weaknesses of these techniques are discussed and compared, with double-sided sputtering and the through-hole plating method achieving best results. In addition, hollow conductors provided by the technique are available for solder refill, providing a natural way of forming an electrically connected stack of SOS wafers.

  14. Microfabricated structures with electrical isolation and interconnections

    NASA Technical Reports Server (NTRS)

    Clark, William A. (Inventor); Juneau, Thor N. (Inventor); Roessig, Allen W. (Inventor); Lemkin, Mark A. (Inventor)

    2001-01-01

    The invention is directed to a microfabricated device. The device includes a substrate that is etched to define mechanical structures at least some of which are anchored laterally to the remainder of the substrate. Electrical isolation at points where mechanical structures are attached to the substrate is provided by filled isolation trenches. Filled trenches may also be used to electrically isolate structure elements from each other at points where mechanical attachment of structure elements is desired. The performance of microelectromechanical devices is improved by 1) having a high-aspect-ratio between vertical and lateral dimensions of the mechanical elements, 2) integrating electronics on the same substrate as the mechanical elements, 3) good electrical isolation among mechanical elements and circuits except where electrical interconnection is desired.

  15. Aluminum toxicity and albumin.

    PubMed

    Kelly, A T; Short, B L; Rains, T C; May, J C; Progar, J J

    1989-01-01

    During a study of priming solutions for extracorporeal membrane oxygenation (ECMO) in the intensive care nursery, it was discovered that those solutions using certain brands of 25% albumin contained aluminum levels within the toxic range. When the brand was changed to a brand known to have a lower aluminum (Al) content, a marked drop in priming solution Al levels was measured. The heat exchanger was examined as a possible source of soluble Al. No evidence of elevated Al levels was found in fluids perfusing this heat exchanger when compared with a stainless steel heat exchanger. The Al content of various blood products was evaluated along with various brands of 5% albumin and 25% albumin.

  16. Producing thin film photovoltaic modules with high integrity interconnects and dual layer contacts

    DOEpatents

    Jansen, Kai W.; Maley, Nagi

    2000-01-01

    High performance photovoltaic modules are produced with improved interconnects by a special process. Advantageously, the photovoltaic modules have a dual layer back (rear) contact and a front contact with at least one layer. The front contact and the inner layer of the back contact can comprise a transparent conductive oxide. The outer layer of the back contact can comprise a metal or metal oxide. The front contact can also have a dielectric layer. In one form, the dual layer back contact comprises a zinc oxide inner layer and an aluminum outer layer and the front contact comprises a tin oxide inner layer and a silicon dioxide dielectric outer layer. One or more amorphous silicon-containing thin film semiconductors can be deposited between the front and back contacts. The contacts can be positioned between a substrate and an optional superstrate. During production, the transparent conductive oxide layer of the front contact is scribed by a laser, then the amorphous silicon-containing semiconductors and inner layer of the dual layer back contact are simultaneously scribed and trenched (drilled) by the laser and the trench is subsequently filled with the same metal as the outer layer of the dual layer back contact to provide a superb mechanical and electrical interconnect between the front contact and the outer layer of the dual layer back contact. The outer layer of the dual layer back contact can then be scribed by the laser. For enhanced environmental protection, the photovoltaic modules can be encapsulated.

  17. Producing thin film photovoltaic modules with high integrity interconnects and dual layer contacts

    DOEpatents

    Jansen, Kai W.; Maley, Nagi

    2001-01-01

    High performance photovoltaic modules are produced with improved interconnects by a special process. Advantageously, the photovoltaic modules have a dual layer back (rear) contact and a front contact with at least one layer. The front contact and the inner layer of the back contact can comprise a transparent conductive oxide. The outer layer of the back contact can comprise a metal or metal oxide. The front contact can also have a dielectric layer. In one form, the dual layer back contact comprises a zinc oxide inner layer and an aluminum outer layer and the front contact comprises a tin oxide inner layer and a silicon dioxide dielectric outer layer. One or more amorphous silicon-containing thin film semiconductors can be deposited between the front and back contacts. The contacts can be positioned between a substrate and an optional superstrate. During production, the transparent conductive oxide layer of the front contact is scribed by a laser, then the amorphous silicon-containing semiconductors and inner layer of the dual layer back contact are simultaneously scribed and trenched (drilled) by the laser and the trench is subsequently filled with the same metal as the outer layer of the dual layer back contact to provide a superb mechanical and electrical interconnect between the front contact and the outer layer of the dual layer back contact. The outer layer of the dual layer back contact can then be scribed by the laser. For enhanced environmental protection, the photovoltaic modules can be encapsulated.

  18. Aluminum Alloy 7050 Extrusions.

    DTIC Science & Technology

    1977-03-01

    Artificial Aging Conditions 250 A-l Fatigue Crack Growth Data for C5A Extruded Panel, 7050-T7351X, L-T Orientation, R=0.1 254 A-2 Fatigue...cooldd aluminum and steel bottom blocks (Figure 2) were fabricated for use with this tooling. Metal was melted in a 10,000-lb capacity open- hearth ...time factor, effects of heating through this temperature range to the maximum artificial agirg temperature are additive. The solution of the

  19. FT-IR standoff detection of thermally excited emissions of trinitrotoluene (TNT) deposited on aluminum substrates.

    PubMed

    Castro-Suarez, John R; Pacheco-Londoño, Leonardo C; Vélez-Reyes, Miguel; Diem, Max; Tague, Thomas J; Hernandez-Rivera, Samuel P

    2013-02-01

    A standoff detection system was assembled by coupling a reflecting telescope to a Fourier transform infrared spectrometer equipped with a cryo-cooled mercury cadmium telluride detector and used for detection of solid-phase samples deposited on substrates. Samples of highly energetic materials were deposited on aluminum substrates and detected at several collector-target distances by performing passive-mode, remote, infrared detection measurements on the heated analytes. Aluminum plates were used as support material, and 2,4,6-Trinitrotoluene (TNT) was used as the target. For standoff detection experiments, the samples were placed at different distances (4 to 55 m). Several target surface temperatures were investigated. Partial least squares regression analysis was applied to the analysis of the intensities of the spectra obtained. Overall, standoff detection in passive mode was useful for quantifying TNT deposited on the aluminum plates with high confidence up to target-collector distances of 55 m.

  20. Passivity analysis for flexible multilink space manipulators

    NASA Astrophysics Data System (ADS)

    Damaren, Christopher J.

    1995-03-01

    The important input-output property of passivity is explored for a general flexible space manipulator with chain topology. The manipulator is assumed to consist of rigid and/or flexible links interconnected via revolute joints, and a free rigid spacecraft and cantilevered payload are modeled at the base and tip, respectively. Actuation on the spacecraft and torques at the joints serve as control inputs and a suitably modified input variable is constructed. The notion of reflected tip position introduced by Wang and Vidyasagar for a single flexible link is extended to the multilink case and used to define a corresponding modified output variable. The dynamics governing the system are developed using a Lagrangian approach and both linearized and nonlinear forms of the mapping relating modified inputs to modified outputs are examined. Our major result shows that the transfer function in the linear case is positive real when the spacecraft and payload are much more massive than the manipulator links. The corresponding nonlinear analysis shows that the mapping is, in fact, passive and uncovers an approximate static relationship between the elastic coordinates and applied torques. A numerical example employing the Space Shuttle, remote manipulator system, and payload is used to demonstrate the validity of the theoretical results. Applications to control system design are indicated.

  1. EVALUATION OF A TWO-STAGE PASSIVE TREATMENT APPROACH FOR MINING INFLUENCE WATERS

    EPA Science Inventory

    A two-stage passive treatment approach was assessed at bench-scale using two Colorado Mining Influenced Waters (MIWs). The first-stage was a limestone drain with the purpose of removing iron and aluminum and mitigating the potential effects of mineral acidity. The second stage w...

  2. EVALUATION OF A TWO-STAGE PASSIVE TREATMENT APPROACH FOR MINING INFLUENCE WATERS

    EPA Science Inventory

    A two-stage passive treatment approach was assessed at bench-scale using two Colorado Mining Influenced Waters (MIWs). The first-stage was a limestone drain with the purpose of removing iron and aluminum and mitigating the potential effects of mineral acidity. The second stage w...

  3. Measure Guideline: Passive Vents

    SciTech Connect

    Berger, David; Neri, Robin

    2016-02-05

    This document addresses the use of passive vents as a source of outdoor air in multifamily buildings. The challenges associated with implementing passive vents and the factors affecting performance are outlined. A comprehensive design methodology and quantified performance metrics are provided. Two hypothetical design examples are provided to illustrate the process. This document is intended to be useful to designers, decision-makers, and contractors implementing passive ventilation strategies. It is also intended to be a resource for those responsible for setting high-performance building program requirements, especially pertaining to ventilation and outdoor air. To ensure good indoor air quality, a dedicated source of outdoor air is an integral part of high-performance buildings. Presently, there is a lack of guidance pertaining to the design and installation of passive vents, resulting in poor system performance. This report details the criteria necessary for designing, constructing, and testing passive vent systems to enable them to provide consistent and reliable levels of ventilation air from outdoors.

  4. 14 CFR 29.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... Section 29.957 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION, DEPARTMENT OF TRANSPORTATION AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Powerplant Fuel System § 29.957 Flow between interconnected tanks. (a) Where tank outlets are interconnected and allow fuel to flow...

  5. 14 CFR 29.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... Section 29.957 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION, DEPARTMENT OF TRANSPORTATION AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Powerplant Fuel System § 29.957 Flow between interconnected tanks. (a) Where tank outlets are interconnected and allow fuel to flow...

  6. 14 CFR 29.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... Section 29.957 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION, DEPARTMENT OF TRANSPORTATION AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Powerplant Fuel System § 29.957 Flow between interconnected tanks. (a) Where tank outlets are interconnected and allow fuel to flow...

  7. 14 CFR 29.957 - Flow between interconnected tanks.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... Section 29.957 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION, DEPARTMENT OF TRANSPORTATION AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Powerplant Fuel System § 29.957 Flow between interconnected tanks. (a) Where tank outlets are interconnected and allow fuel to flow...

  8. 14 CFR 25.701 - Flap and slat interconnection.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... sides of the plane of symmetry must be synchronized by a mechanical interconnection or approved... engines on one side of the plane of symmetry inoperative and the remaining engines at takeoff power. (c... resulting when interconnected flap or slat surfaces on one side of the plane of symmetry are jammed...

  9. 14 CFR 25.701 - Flap and slat interconnection.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... sides of the plane of symmetry must be synchronized by a mechanical interconnection or approved... engines on one side of the plane of symmetry inoperative and the remaining engines at takeoff power. (c... resulting when interconnected flap or slat surfaces on one side of the plane of symmetry are jammed...

  10. 14 CFR 25.701 - Flap and slat interconnection.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... sides of the plane of symmetry must be synchronized by a mechanical interconnection or approved... engines on one side of the plane of symmetry inoperative and the remaining engines at takeoff power. (c... resulting when interconnected flap or slat surfaces on one side of the plane of symmetry are jammed...

  11. 14 CFR 25.701 - Flap and slat interconnection.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... sides of the plane of symmetry must be synchronized by a mechanical interconnection or approved... engines on one side of the plane of symmetry inoperative and the remaining engines at takeoff power. (c... resulting when interconnected flap or slat surfaces on one side of the plane of symmetry are jammed...

  12. 14 CFR 25.701 - Flap and slat interconnection.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... sides of the plane of symmetry must be synchronized by a mechanical interconnection or approved... engines on one side of the plane of symmetry inoperative and the remaining engines at takeoff power. (c... resulting when interconnected flap or slat surfaces on one side of the plane of symmetry are jammed...

  13. Perspectives on the metallic interconnects for solid oxide fuel cells.

    PubMed

    Zhu, Wei-Zhong; Yan, Mi

    2004-12-01

    The various stages and progress in the development of interconnect materials for solid oxide fuel cells (SOFCs) over the last two decades are reviewed. The criteria for the application of materials as interconnects are highlighted. In-terconnects based on lanthanum chromite ceramics demonstrate many inherent drawbacks and therefore are only useful for SOFCs operating around 1000 degrees C. The advance in the research of anode-supported flat SOFCs facilitates the replacement of ceramic interconnects with metallic ones due to their significantly lowered working temperature. Besides, interconnects made of metals or alloys offer many advantages as compared to their ceramic counterpart. The oxidation response and thermal expansion behaviors of various prospective metallic interconnects are examined and evaluated. The minimization of contact resistance to achieve desired and reliable stack performance during their projected lifetime still remains a highly challenging issue with metallic interconnects. Inexpensive coating materials and techniques may play a key role in pro-moting the commercialization of SOFC stack whose interconnects are constructed of some current commercially available alloys. Alternatively, development of new metallic materials that are capable of forming stable oxide scales with sluggish growth rate and sufficient electrical conductivity is called for.

  14. 78 FR 14532 - Small Generator Interconnection Agreements and Procedures; Workshop

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-03-06

    ... Energy Regulatory Commission Small Generator Interconnection Agreements and Procedures; Workshop Take...: https://www.ferc.gov/whats-new/registration/small-generator-03-27-13-form.asp . The purpose of this workshop is to discuss certain topics related to the proposals in the Small Generator Interconnection...

  15. Updating Small Generator Interconnection Procedures for New Market Conditions

    SciTech Connect

    Coddington, M.; Fox, K.; Stanfield, S.; Varnado, L.; Culley, T.; Sheehan, M.

    2012-12-01

    Federal and state regulators are faced with the challenge of keeping interconnection procedures updated against a backdrop of evolving technology, new codes and standards, and considerably transformed market conditions. This report is intended to educate policymakers and stakeholders on beneficial reforms that will keep interconnection processes efficient and cost-effective while maintaining a safe and reliable power system.

  16. ENVIRONMENTAL-HUMAN HEALTH INTERCONNECTIONS: A WORKSHOP REPORT

    EPA Science Inventory

    A Pellston Workshop jointly sponsored by SETAC and SOT to discuss this topic of "Interconnections" was held in June, 2000 in Snowbird, Utah. This workshop was motivated by a deep concern shared by many human health, environmental, and social scientists for the interconnections, ...

  17. 76 FR 35210 - Peetz Logan Interconnect, LLC; Notice of Filing

    Federal Register 2010, 2011, 2012, 2013, 2014

    2011-06-16

    ... From the Federal Register Online via the Government Publishing Office ] DEPARTMENT OF ENERGY Federal Energy Regulatory Commission Peetz Logan Interconnect, LLC; Notice of Filing Take notice that on June 3, 2011, Peetz Logan Interconnect, LLC (PLI) filed a response to a staff deficiency letter...

  18. Determining the Utility Value of Water-Supply Interconnections.

    ERIC Educational Resources Information Center

    Hardman, James L.; Cheremisinoff, Paul N.

    1979-01-01

    This article is the third in a series which discusses a mathematical methodology for evaluating interconnections of water supply systems. The model can be used to analyze the carrying capacity of proposed links or predict the impact of abandoning interconnections. (AS)

  19. ENVIRONMENTAL-HUMAN HEALTH INTERCONNECTIONS: A WORKSHOP REPORT

    EPA Science Inventory

    A Pellston Workshop jointly sponsored by SETAC and SOT to discuss this topic of "Interconnections" was held in June, 2000 in Snowbird, Utah. This workshop was motivated by a deep concern shared by many human health, environmental, and social scientists for the interconnections, ...

  20. Determining the Utility Value of Water-Supply Interconnections.

    ERIC Educational Resources Information Center

    Hardman, James L.; Cheremisinoff, Paul N.

    1979-01-01

    This article is the third in a series which discusses a mathematical methodology for evaluating interconnections of water supply systems. The model can be used to analyze the carrying capacity of proposed links or predict the impact of abandoning interconnections. (AS)

  1. 21 CFR 73.1645 - Aluminum powder.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 21 Food and Drugs 1 2010-04-01 2010-04-01 false Aluminum powder. 73.1645 Section 73.1645 Food and... ADDITIVES EXEMPT FROM CERTIFICATION Drugs § 73.1645 Aluminum powder. (a) Identity. (1) The color additive aluminum powder shall be composed of finely divided particles of aluminum prepared from virgin aluminum. It...

  2. 21 CFR 73.1645 - Aluminum powder.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 21 Food and Drugs 1 2014-04-01 2014-04-01 false Aluminum powder. 73.1645 Section 73.1645 Food and... ADDITIVES EXEMPT FROM CERTIFICATION Drugs § 73.1645 Aluminum powder. (a) Identity. (1) The color additive aluminum powder shall be composed of finely divided particles of aluminum prepared from virgin aluminum. It...

  3. 21 CFR 73.1645 - Aluminum powder.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 21 Food and Drugs 1 2013-04-01 2013-04-01 false Aluminum powder. 73.1645 Section 73.1645 Food and... ADDITIVES EXEMPT FROM CERTIFICATION Drugs § 73.1645 Aluminum powder. (a) Identity. (1) The color additive aluminum powder shall be composed of finely divided particles of aluminum prepared from virgin aluminum. It...

  4. 21 CFR 73.1645 - Aluminum powder.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 21 Food and Drugs 1 2011-04-01 2011-04-01 false Aluminum powder. 73.1645 Section 73.1645 Food and... ADDITIVES EXEMPT FROM CERTIFICATION Drugs § 73.1645 Aluminum powder. (a) Identity. (1) The color additive aluminum powder shall be composed of finely divided particles of aluminum prepared from virgin aluminum. It...

  5. 21 CFR 73.1645 - Aluminum powder.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 21 Food and Drugs 1 2012-04-01 2012-04-01 false Aluminum powder. 73.1645 Section 73.1645 Food and... ADDITIVES EXEMPT FROM CERTIFICATION Drugs § 73.1645 Aluminum powder. (a) Identity. (1) The color additive aluminum powder shall be composed of finely divided particles of aluminum prepared from virgin aluminum. It...

  6. Aluminum Carbothermic Technology

    SciTech Connect

    Bruno, Marshall J.

    2005-03-31

    This report documents the non-proprietary research and development conducted on the Aluminum Carbothermic Technology (ACT) project from contract inception on July 01, 2000 to termination on December 31, 2004. The objectives of the program were to demonstrate the technical and economic feasibility of a new carbothermic process for producing commercial grade aluminum, designated as the ''Advanced Reactor Process'' (ARP). The scope of the program ranged from fundamental research through small scale laboratory experiments (65 kW power input) to larger scale test modules at up to 1600 kW power input. The tasks included work on four components of the process, Stages 1 and 2 of the reactor, vapor recovery and metal alloy decarbonization; development of computer models; and economic analyses of capital and operating costs. Justification for developing a new, carbothermic route to aluminum production is defined by the potential benefits in reduced energy, lower costs and more favorable environmental characteristics than the conventional Hall-Heroult process presently used by the industry. The estimated metrics for these advantages include energy rates at approximately 10 kWh/kg Al (versus over 13 kWh/kg Al for Hall-Heroult), capital costs as low as $1250 per MTY (versus 4,000 per MTY for Hall-Heroult), operating cost reductions of over 10%, and up to 37% reduction in CO2 emissions for fossil-fuel power plants. Realization of these benefits would be critical to sustaining the US aluminum industries position as a global leader in primary aluminum production. One very attractive incentive for ARP is its perceived ability to cost effectively produce metal over a range of smelter sizes, not feasible for Hall-Heroult plants which must be large, 240,000 TPY or more, to be economical. Lower capacity stand alone carbothermic smelters could be utilized to supply molten metal at fabrication facilities similar to the mini-mill concept employed by the steel industry. Major

  7. Extracting aluminum from dross tailings

    NASA Astrophysics Data System (ADS)

    Amer, A. M.

    2002-11-01

    Aluminum dross tailings, an industrial waste, from the Egyptian Aluminium Company (Egyptalum) was used to produce two types of alums: aluminum-sulfate alum [itAl2(SO4)3.12H2O] and ammonium-aluminum alum [ (NH 4)2SO4AL2(SO4)3.24H2O]. This was carried out in two processes. The first process is leaching the impurities using diluted H2SO4 with different solid/liquid ratios at different temperatures to dissolve the impurities present in the starting material in the form of solute sulfates. The second process is the extraction of aluminum (as aluminum sulfate) from the purifi ed aluminum dross tailings thus produced. The effects of temperature, time of reaction, and acid concentration on leaching and extraction processes were studied. The product alums were analyzed using x-ray diffraction and thermal analysis techniques.

  8. Optical backplane interconnect switch for data processors and computers

    NASA Technical Reports Server (NTRS)

    Hendricks, Herbert D.; Benz, Harry F.; Hammer, Jacob M.

    1989-01-01

    An optoelectronic integrated device design is reported which can be used to implement an all-optical backplane interconnect switch. The switch is sized to accommodate an array of processors and memories suitable for direct replacement into the basic avionic multiprocessor backplane. The optical backplane interconnect switch is also suitable for direct replacement of the PI bus traffic switch and at the same time, suitable for supporting pipelining of the processor and memory. The 32 bidirectional switchable interconnects are configured with broadcast capability for controls, reconfiguration, and messages. The approach described here can handle a serial interconnection of data processors or a line-to-link interconnection of data processors. An optical fiber demonstration of this approach is presented.

  9. Optical backplane interconnect switch for data processors and computers

    NASA Technical Reports Server (NTRS)

    Hendricks, Herbert D.; Benz, Harry F.; Hammer, Jacob M.

    1989-01-01

    An optoelectronic integrated device design is reported which can be used to implement an all-optical backplane interconnect switch. The switch is sized to accommodate an array of processors and memories suitable for direct replacement into the basic avionic multiprocessor backplane. The optical backplane interconnect switch is also suitable for direct replacement of the PI bus traffic switch and at the same time, suitable for supporting pipelining of the processor and memory. The 32 bidirectional switchable interconnects are configured with broadcast capability for controls, reconfiguration, and messages. The approach described here can handle a serial interconnection of data processors or a line-to-link interconnection of data processors. An optical fiber demonstration of this approach is presented.

  10. Solid-state energy storage module employing integrated interconnect board

    DOEpatents

    Rouillard, Jean; Comte, Christophe; Daigle, Dominik; Hagen, Ronald A.; Knudson, Orlin B.; Morin, Andre; Ranger, Michel; Ross, Guy; Rouillard, Roger; St-Germain, Philippe; Sudano, Anthony; Turgeon, Thomas A.

    2003-11-04

    The present invention is directed to an improved electrochemical energy storage device. The electrochemical energy storage device includes a number of solid-state, thin-film electrochemical cells which are selectively interconnected in series or parallel through use of an integrated interconnect board. The interconnect board is typically disposed within a sealed housing which also houses the electrochemical cells, and includes a first contact and a second contact respectively coupled to first and second power terminals of the energy storage device. The interconnect board advantageously provides for selective series or parallel connectivity with the electrochemical cells, irrespective of electrochemical cell position within the housing. Fuses and various electrical and electromechanical devices, such as bypass, equalization, and communication devices for example, may also be mounted to the interconnect board and selectively connected to the electrochemical cells.

  11. Solid-state energy storage module employing integrated interconnect board

    DOEpatents

    Rouillard, Jean; Comte, Christophe; Daigle, Dominik; Hagen, Ronald A.; Knudson, Orlin B.; Morin, Andre; Ranger, Michel; Ross, Guy; Rouillard, Roger; St-Germain, Philippe; Sudano, Anthony; Turgeon, Thomas A.

    2004-09-28

    An electrochemical energy storage device includes a number of solid-state thin-film electrochemical cells which are selectively interconnected in series or parallel through use of an integrated interconnect board. The interconnect board is typically disposed within a sealed housing which also houses the electrochemical cells, and includes a first contact and a second contact respectively coupled to first and second power terminals of the energy storage device. The interconnect board advantageously provides for selective series or parallel connectivity with the electrochemical cells, irrespective of electrochemical cell position within the housing. Fuses and various electrical and electro-mechanical devices, such as bypass, equalization, and communication devices for example, may also be mounted to the interconnect board and selectively connected to the electrochemical cells.

  12. Fuel cell electrode interconnect contact material encapsulation and method

    DOEpatents

    Derose, Anthony J.; Haltiner, Jr., Karl J.; Gudyka, Russell A.; Bonadies, Joseph V.; Silvis, Thomas W.

    2016-05-31

    A fuel cell stack includes a plurality of fuel cell cassettes each including a fuel cell with an anode and a cathode. Each fuel cell cassette also includes an electrode interconnect adjacent to the anode or the cathode for providing electrical communication between an adjacent fuel cell cassette and the anode or the cathode. The interconnect includes a plurality of electrode interconnect protrusions defining a flow passage along the anode or the cathode for communicating oxidant or fuel to the anode or the cathode. An electrically conductive material is disposed between at least one of the electrode interconnect protrusions and the anode or the cathode in order to provide a stable electrical contact between the electrode interconnect and the anode or cathode. An encapsulating arrangement segregates the electrically conductive material from the flow passage thereby, preventing volatilization of the electrically conductive material in use of the fuel cell stack.

  13. Carbon Nanotube Aluminum Matrix Composites

    DTIC Science & Technology

    2010-08-01

    replacement of air space with the polymer matrix. A similar affinity is not known to exist between CNTs and aluminum , where the wetting angle between...Carbon Nanotube Aluminum Matrix Composites by Brent J. Carey, Jerome T. Tzeng, and Shashi Karna ARL-TR-5252 August 2010...Nanotube Aluminum Matrix Composites Brent J. Carey, Jerome T. Tzeng, and Shashi Karna Weapons and Materials Research Directorate, ARL

  14. A proposed holistic approach to on-chip, off-chip, test, and package interconnections

    NASA Astrophysics Data System (ADS)

    Bartelink, Dirk J.

    1998-11-01

    recognize—test is also performed using IC's. A system interconnection is proposed using multiple chips fabricated with conventional silicon processes, including MEMS technology. The system resembles an MCM that can be joined without committing to final assembly to perform at-speed testing. 50-Ohm test probes never load the circuit; only intended neighboring chips are ever connected. A `back-plane' chip provides the connection layers for both inter- and intra-chip signals and also serves as the probe card, in analogy with membrane probes now used for single-chip testing. Intra-chip connections, which require complicated connections during test that exactly match the product, are then properly made and all waveforms and loading conditions under test will be identical to those of the product. The major benefit is that all front-end chip technologies can be merged—logic, memory, RF, even passives. ESD protection is required only on external system connections. Manufacturing test information will accurately characterize process faults and thus avoid the Known-Good-Die problem that has slowed the arrival of conventional MCM's.

  15. Wireless passive radiation sensor

    DOEpatents

    Pfeifer, Kent B; Rumpf, Arthur N; Yelton, William G; Limmer, Steven J

    2013-12-03

    A novel measurement technique is employed using surface acoustic wave (SAW) devices, passive RF, and radiation-sensitive films to provide a wireless passive radiation sensor that requires no batteries, outside wiring, or regular maintenance. The sensor is small (<1 cm.sup.2), physically robust, and will operate unattended for decades. In addition, the sensor can be insensitive to measurement position and read distance due to a novel self-referencing technique eliminating the need to measure absolute responses that are dependent on RF transmitter location and power.

  16. Laser Direct Routing for High Density Interconnects

    NASA Astrophysics Data System (ADS)

    Moreno, Wilfrido Alejandro

    The laser restructuring of electronic circuits fabricated using standard Very Large Scale Integration (VLSI) process techniques, is an excellent alternative that allows low-cost quick turnaround production with full circuit similarity between the Laser Restructured prototype and the customized product for mass production. Laser Restructurable VLSI (LRVLSI) would allow design engineers the capability to interconnect cells that implement generic logic functions and signal processing schemes to achieve a higher level of design complexity. LRVLSI of a particular circuit at the wafer or packaged chip level is accomplished using an integrated computer controlled laser system to create low electrical resistance links between conductors and to cut conductor lines. An infrastructure for rapid prototyping and quick turnaround using Laser Restructuring of VLSI circuits was developed to meet three main parallel objectives: to pursue research on novel interconnect technologies using LRVLSI, to develop the capability of operating in a quick turnaround mode, and to maintain standardization and compatibility with commercially available equipment for feasible technology transfer. The system is to possess a high degree of flexibility, high data quality, total controllability, full documentation, short downtime, a user-friendly operator interface, automation, historical record keeping, and error indication and logging. A specially designed chip "SLINKY" was used as the test vehicle for the complete characterization of the Laser Restructuring system. With the use of Design of Experiment techniques the Lateral Diffused Link (LDL), developed originally at MIT Lincoln Laboratories, was completely characterized and for the first time a set of optimum process parameters was obtained. With the designed infrastructure fully operational, the priority objective was the search for a substitute for the high resistance, high current leakage to substrate, and relatively low density Lateral

  17. Mapping of interconnection of climate risks

    NASA Astrophysics Data System (ADS)

    Yokohata, Tokuta; Tanaka, Katsumasa; Nishina, Kazuya; Takanashi, Kiyoshi; Emori, Seita; Kiguchi, Masashi; Iseri, Yoshihiko; Honda, Yasushi; Okada, Masashi; Masaki, Yoshimitsu; Yamamoto, Akitomo; Shigemitsu, Masahito; Yoshimori, Masakazu; Sueyoshi, Tetsuo; Iwase, Kenta; Hanasaki, Naota; Ito, Akihiko; Sakurai, Gen; Iizumi, Toshichika; Oki, Taikan

    2015-04-01

    Anthropogenic climate change possibly causes various impacts on human society and ecosystem. Here, we call possible damages or benefits caused by the future climate change as "climate risks". Many climate risks are closely interconnected with each other by direct cause-effect relationship. In this study, the major climate risks are comprehensively summarized based on the survey of studies in the literature using IPCC AR5 etc, and their cause-effect relationship are visualized by a "network diagram". This research is conducted by the collaboration between the experts of various fields, such as water, energy, agriculture, health, society, and eco-system under the project called ICA-RUS (Integrated Climate Assessment - Risks, Uncertainties and Society). First, the climate risks are classified into 9 categories (water, energy, food, health, disaster, industry, society, ecosystem, and tipping elements). Second, researchers of these fields in our project survey the research articles, and pick up items of climate risks, and possible cause-effect relationship between the risk items. A long list of the climate risks is summarized into ~130, and that of possible cause-effect relationship between the risk items is summarized into ~300, because the network diagram would be illegible if the number of the risk items and cause-effect relationship is too large. Here, we only consider the risks that could occur if climate mitigation policies are not conducted. Finally, the chain of climate risks is visualized by creating a "network diagram" based on a network graph theory (Fruchtman & Reingold algorithm). Through the analysis of network diagram, we find that climate risks at various sectors are closely related. For example, the decrease in the precipitation under the global climate change possibly causes the decrease in river runoff and the decrease in soil moisture, which causes the changes in crop production. The changes in crop production can have an impact on society by

  18. Aluminum heat exchanger

    SciTech Connect

    Koisuka, M.; Aoki, H.

    1986-11-04

    This patent describes a heat exchanger comprising a flat metal tube for conducting fluid having opposite first and second ends, of metal fins fixed onto outer surfaces of the flat metal tube, first and second header pipes fixedly mounted on the opposite ends of the flat metal tube, respectively, so that the flat metal tube communicates with the interior of the header pipes. Each of the header pipes has a first end that is open and a second end that is closed. An inlet tube is connected to the first end of the first header pipe, and an outlet tube is connected to the first end of the second header pipe. The improvement described here comprises one of the inlet and outlet tubes having an end portion inserted into the first end of the corresponding interconnected header pipe. The end portion has a cut-away portion in the form of a first axial slit extending axially inwardly from an open end at the adjacent end of the one tube. The first axial slit has an axial intermediate portion slightly smaller than the thickness of the flat metal tube, and a tapered portion diverging towards the open end of the first axial slit, and the first end of the flat metal tube extends into the corresponding interconnected header pipe and is closely fitted into the first axial slit.

  19. Laser welding of aluminum alloys

    SciTech Connect

    Leong, K.H.; Sabo, K.R.; Sanders, P.G.; Spawr, W.J.

    1997-03-01

    Recent interest in reducing the weight of automobiles to increase fuel mileage has focused attention on the use of aluminum and associated joining technologies. Laser beam welding is one of the more promising methods for high speed welding of aluminum. Consequently, substantial effort has been expended in attempting to develop a robust laser beam welding process. Early results have not been very consistent in the process requirements but more definitive data has been produced recently. This paper reviews the process parameters needed to obtain consistent laser welds on 5,000 series aluminum alloys and discusses the research necessary to make laser processing of aluminum a reality for automotive applications.

  20. Mineral of the month: aluminum

    USGS Publications Warehouse

    Plunkert, Patricia A.

    2005-01-01

    Aluminum is the second most abundant metallic element in Earth’s crust after silicon. Even so, it is a comparatively new industrial metal that has been produced in commercial quantities for little more than 100 years. Aluminum is lightweight, ductile, malleable and corrosion resistant, and is a good conductor of heat and electricity. Weighing about one-third as much as steel or copper per unit of volume, aluminum is used more than any other metal except iron. Aluminum can be fabricated into desired forms and shapes by every major metalworking technique to add to its versatility.

  1. Method of passivating semiconductor surfaces

    DOEpatents

    Wanlass, Mark W.

    1990-01-01

    A method of passivating Group III-V or II-VI semiconductor compound surfaces. The method includes selecting a passivating material having a lattice constant substantially mismatched to the lattice constant of the semiconductor compound. The passivating material is then grown as an ultrathin layer of passivating material on the surface of the Group III-V or II-VI semiconductor compound. The passivating material is grown to a thickness sufficient to maintain a coherent interface between the ultrathin passivating material and the semiconductor compound. In addition, a device formed from such method is also disclosed.

  2. Method of passivating semiconductor surfaces

    DOEpatents

    Wanlass, M.W.

    1990-06-19

    A method is described for passivating Group III-V or II-VI semiconductor compound surfaces. The method includes selecting a passivating material having a lattice constant substantially mismatched to the lattice constant of the semiconductor compound. The passivating material is then grown as an ultrathin layer of passivating material on the surface of the Group III-V or II-VI semiconductor compound. The passivating material is grown to a thickness sufficient to maintain a coherent interface between the ultrathin passivating material and the semiconductor compound. In addition, a device formed from such method is also disclosed.

  3. Applications of high-power diode lasers for aluminum welding

    NASA Astrophysics Data System (ADS)

    Huber, Sonja; Merzkirch, Matthias; Zaeh, Michael F.; Schulze, Volker

    2009-02-01

    Industries worldwide are confronted with the need for an increased use of aluminum alloys in various applications. Therefore the requirements result in the necessity for a multitude of joining and welding innovations. Applications of modern aluminum alloys are not constricted to common components anymore. In fact, they are used in ever more complex lightweight structures. However, this complexity has to be fulfilled by a higher geometric flexibility in laser welding and represents a major challenge for new approaches in working lightweight structures. The present work includes the welding of aluminum utilizing Bifocal Hybrid Laser Welding (BHLW) and a 6 kW high power diode laser (HPDL) for welding. The welding setups allow for welded butt- and fillet-welds of tubes under consideration of the hardly fusion weldable alloy AA6060. Welded joints of AA6060 are investigated metallographically in regard to the influence of process parameters like intensity and the interconnected penetration. The weldability is characterized by qualitative investigations of the microstructure as well as the mechanical behavior under quasistatic loading. The investigations result in an adequate welding process for AA6060.

  4. Interconnection and Simulation Issues in Haptics.

    PubMed

    Borghesan, Gianni; Macchelli, Alessandro; Melchiorri, Claudio

    2010-01-01

    In this paper, three results are presented concerning certain computational/control aspects, crucial for the proper behavior of haptic devices. The first one is a novel technique for a real-time simulation of virtual environments, which is able to preserve the energetic behavior of the simulated physical system and to avoid undesired effects related to unstable behaviors of the haptic device. The proposed real-time integration method is simpler, in terms of computational complexity, than similar solutions known in the literature, and provides an additional insight when "faulty conditions" are met. Second, a new method for the energy-consistent interconnection of discrete-time physical systems, implemented by algorithms running at different frequencies (i.e., multirate systems), is illustrated. Multirate systems are very common in haptics, since the frequency, at which the control law of the haptic interface is executed, is usually higher than the frequency of the simulation of the virtual environment. Finally, the third result presented in this paper concerns the problem of energy generation due to the time discretization in the acquisition of the haptic interface position. Similarly, to the previous case, a technique for an energy-consistent analog/digital conversion is proposed. All these methodologies have been validated, both by simulations and experiments.

  5. Design of free space interconnected signal processor

    NASA Astrophysics Data System (ADS)

    Murdocca, Miles; Stone, Thomas

    1993-12-01

    Progress is described on a collaborative effort between the Photonics Center at Rome Laboratory (RL), Griffiss AFB and Rutgers University, through the RL Expert Science and Engineering (ES&E) program. The goal of the effort is to develop a prototype random access memory (RAM) that can be used in a signal processor for a computing model that consists of cascaded arrays of optical logic gates interconnected in free space with regular patterns. The effort involved the optical and architectural development of a cascadable optical logic system in which microlaser pumped S-SEED devices serve as logic gates. At the completion of the contract, two gate-level layouts of the module were completed which were created in collaboration with RL personnel. The basic layout of the optical system has been developed, and key components have been tested. The delayed delivery of microlaser arrays precluded completion of the processor during the contract period, but preliminary testing was made possible through the use of other microlaser devices.

  6. Interconnected Cavernous Structure of Bacterial Fruiting Bodies

    DOE PAGES

    Harvey, Cameron W.; Du, Huijing; Xu, Zhiliang; ...

    2012-12-27

    The formation of spore-filled fruiting bodies by myxobacteria is a fascinating case of multicelular self-organization by bacteria. The organization of Myxococcus xanthus into fruiting bodies has long been studied not only as an important example of collective motion of bacteria, but also as a simplified model for developmental morphogenesis. Sporulation within the nascent fruiting body requires signaling between moving cells in order that the rod-shaped self-propelled cells differentiate into spores at the appropriate time. Probing the three-dimensional structure of myxobacteria fruiting bodies has previously presented a challenge due to Imitations at different imaging methods. A new technique using Infrared Opticalmore » Coherence Tomography (OCT) revealed previously unknown details of the Internal structure of M. xanthus fruiting bodies consisting of interconnected pockets of relative nigh and low spore density regions. Here, to make sense of the experimentally observed structure, modeling and computer simulations were used to test a hypothesized mechanism that could produce high density pockets of spores. The mechanism consists of self-propelled cells aligning with each other and signaling by end-to-end contact to coordinate the process of differentiation resulting in a pattern of clusters observed in the experiment. The Integration of novel OCT experimental techniques with computational simulations can provide new insight Into the mechanisms that can give rise to the pattern formation seen In other biological systems such as dlctyostelids, social amoeba known to form multicellular aggregates observed as slugs under starvation conditions.« less

  7. Manipulator interactive design with interconnected flexible elements

    NASA Technical Reports Server (NTRS)

    Singh, R. P.; Likins, P. W.

    1983-01-01

    This paper describes the development of an analysis tool for the interactive design of control systems for manipulators and similar electro-mechanical systems amenable to representation as structures in a topological chain. The chain consists of a series of elastic bodies subject to small deformations and arbitrary displacements. The bodies are connected by hinges which permit kinematic constraints, control, or relative motion with six degrees of freedom. The equations of motion for the chain configuration are derived via Kane's method, extended for application to interconnected flexible bodies with time-varying boundary conditions. A corresponding set of modal coordinates has been selected. The motion equations are imbedded within a simulation that transforms the vector-dyadic equations into scalar form for numerical integration. The simulation also includes a linear, time-invariant controler specified in transfer function format and a set of sensors and actuators that interface between the structure and controller. The simulation is driven by an interactive set-up program resulting in an easy-to-use analysis tool.

  8. Backplane photonic interconnect modules with optical jumpers

    NASA Astrophysics Data System (ADS)

    Glebov, Alexei L.; Lee, Michael G.; Yokouchi, Kishio

    2005-03-01

    Prototypes of optical interconnect (OI) modules for backplane applications are presented. The transceivers attached to the linecards E/O convert the signals that are passed to and from the backplane by optical jumpers terminated with MTP-type connectors. The connectors plug into adaptors attached to the backplane and the microlens arrays mounted in the adaptors couple the light between the fibers and waveguides. Planar polymer channel waveguides with 30-50 μm cross-sections route the optical signals across the board with propagation losses as low as 0.05 dB/cm @ 850 nm. The 45¦-tapered integrated micromirrors reflect the light in and out of the waveguide plane with the loss of 0.8 dB per mirror. The connector displacement measurements indicate that the adaptor lateral assembly accuracy can be at least +/-10 μm for the excess loss not exceeding 1 dB. Insertion losses of the test modules with integrated waveguides, 45¦ mirrors, and pluggable optical jumper connectors are about 5 dB. Eye diagrams at 10.7 Gb/s have typical width and height of 70 ps and 400 mV, respectively, and jitter of about 20 ps.

  9. Ceramic Interconnects with Low Sintering Temperature

    NASA Technical Reports Server (NTRS)

    Zhong, Zhi-Min; Goldsby, Jon C.

    2004-01-01

    Ceramic interconnects for use in solid oxide he1 cells are expected to operate between 900 to approximately 1000 C, sinter below 1400 C to allow co-firing and meet a number thermal mechanical requirements. The pervoskite type (ABO3) lanthanum chromite based materials have emerged as a leading candidate that will meet these criteria by varying the composition on the A and B sites. A need therefore exists to determine this material's temperature dependent electrical and mechanical properties with respect to these site substitutions. In this investigation oxide powders were prepared by the glycine-nitrate process. Ionic substitutions were carried out on A sites with Ca or Sr, and B sites with Co and Al, respectively. Only stoichiometric compositions were considered for the sake of stability. The powders and their ability to sinter were investigated by XRD, SEM, dilatometry and density measurements. The sintered materials were further examined by SEM, thermal expansion and electric conductivity measurements in order to elucidate the resulting microstructure, electrical and mechanical properties. In addition quantum mechanical calculations were performed to obtain insight into the effects of these dopants on the materials electronic band structure and lattice parameter.

  10. Microtexture of Strain in electroplated copper interconnects

    SciTech Connect

    Spolenak, R.; Barr, D.L.; Gross, M.E.; Evans-Lutterodt, K.; Brown, W.L.; Tamura, N.; MacDowell, A.A.; Celestre, R.S.; Padmore, H.A.; Valek, B.C.; Bravman, J.C.; Flinn, P.; Marieb, T.; Keller, R.R.; Batterman, B.W.; Patel, J.R.

    2001-04-01

    The microstructure of narrow metal conductors in the electrical interconnections on IC chips has often been identified as of major importance in the reliability of these devices. The stresses and stress gradients that develop in the conductors as a result of thermal expansion differences in the materials and of electromigration at high current densities are believed to be strongly dependent on the details of the grain structure. The present work discusses new techniques based on microbeam x-ray diffraction (MBXRD) that have enabled measurement not only of the microstructure of totally encapsulated conductors but also of the local stresses in them on a micron and submicron scale. White x-rays from the Advanced Light Source were focused to a micron spot size by Kirkpatrick-Baez mirrors. The sample was stepped under the micro-beam and Laue images obtained at each sample location using a CCD area detector. Microstructure and local strain were deduced from these images. Cu lines with widths ranging from 0.8 mm to 5 mm and thickness of 1 mm were investigated. Comparisons are made between the capabilities of MBXRD and the well established techniques of broad beam XRD, electron back scatter diffraction (EBSD) and focused ion beam imagining (FIB).

  11. Adaptive optical interconnects: the ADDAPT project

    NASA Astrophysics Data System (ADS)

    Henker, Ronny; Pliva, Jan; Khafaji, Mahdi; Ellinger, Frank; Toifl, Thomas; Offrein, Bert; Cevrero, Alessandro; Oezkaya, Ilter; Seifried, Marc; Ledentsov, Nikolay; Kropp, Joerg-R.; Shchukin, Vitaly; Zoldak, Martin; Halmo, Leos; Turkiewicz, Jaroslaw; Meredith, Wyn; Eddie, Iain; Georgiades, Michael; Charalambides, Savvas; Duis, Jeroen; van Leeuwen, Pieter

    2015-09-01

    Existing optical networks are driven by dynamic user and application demands but operate statically at their maximum performance. Thus, optical links do not offer much adaptability and are not very energy-efficient. In this paper a novel approach of implementing performance and power adaptivity from system down to optical device, electrical circuit and transistor level is proposed. Depending on the actual data load, the number of activated link paths and individual device parameters like bandwidth, clock rate, modulation format and gain are adapted to enable lowering the components supply power. This enables flexible energy-efficient optical transmission links which pave the way for massive reductions of CO2 emission and operating costs in data center and high performance computing applications. Within the FP7 research project Adaptive Data and Power Aware Transceivers for Optical Communications (ADDAPT) dynamic high-speed energy-efficient transceiver subsystems are developed for short-range optical interconnects taking up new adaptive technologies and methods. The research of eight partners from industry, research and education spanning seven European countries includes the investigation of several adaptive control types and algorithms, the development of a full transceiver system, the design and fabrication of optical components and integrated circuits as well as the development of high-speed, low loss packaging solutions. This paper describes and discusses the idea of ADDAPT and provides an overview about the latest research results in this field.

  12. A stochastic model for interconnected neurons.

    PubMed

    Cottrell, M; Piat, F; Rospars, J P

    1997-01-01

    A model is proposed to describe the collective behavior of a biologically plausible neural network, composed of interconnected spiking neurons which separately receive external stationary stimulations. The spiking dynamics of each neuron is represented by an hourglass metaphor. This network model was first studied in a special case where the connections are only inhibitory (Cottrell, 1988, 1992). We study the network dynamics as a function of the parameters which quantify the strengths of both inhibitory and excitatory connections. We show that the model exhibits two kinds of limit states. In the first states (convergent case), the system is ergodic and all neurons have a positive mean firing rate. In the other states (divergent case), some neurons become definitively inactive while the sub-network of the active neurons is ergodic. The patterns which result from these divergent states can be seen as a neural coding of the external stimulation by the network. This property is applied to the olfactory system to produce a code for an odor. The role of inhibitory connections in odor discrimination is studied.

  13. Interconnected Cavernous Structure of Bacterial Fruiting Bodies

    PubMed Central

    Harvey, Cameron W.; Du, Huijing; Xu, Zhiliang; Kaiser, Dale; Aranson, Igor; Alber, Mark

    2012-01-01

    The formation of spore-filled fruiting bodies by myxobacteria is a fascinating case of multicellular self-organization by bacteria. The organization of Myxococcus xanthus into fruiting bodies has long been studied not only as an important example of collective motion of bacteria, but also as a simplified model for developmental morphogenesis. Sporulation within the nascent fruiting body requires signaling between moving cells in order that the rod-shaped self-propelled cells differentiate into spores at the appropriate time. Probing the three-dimensional structure of myxobacteria fruiting bodies has previously presented a challenge due to limitations of different imaging methods. A new technique using Infrared Optical Coherence Tomography (OCT) revealed previously unknown details of the internal structure of M. xanthus fruiting bodies consisting of interconnected pockets of relative high and low spore density regions. To make sense of the experimentally observed structure, modeling and computer simulations were used to test a hypothesized mechanism that could produce high-density pockets of spores. The mechanism consists of self-propelled cells aligning with each other and signaling by end-to-end contact to coordinate the process of differentiation resulting in a pattern of clusters observed in the experiment. The integration of novel OCT experimental techniques with computational simulations can provide new insight into the mechanisms that can give rise to the pattern formation seen in other biological systems such as dictyostelids, social amoeba known to form multicellular aggregates observed as slugs under starvation conditions. PMID:23300427

  14. Fundamental studies on electrochemical production of dendrite-free aluminum and titanium-aluminum alloys

    NASA Astrophysics Data System (ADS)

    Pradhan, Debabrata

    -Al alloys were determined. The Ti-Al alloys containing about 13-27 atom % Ti were produced using both electrolytes. The current efficiency of AlCl3-BMIC was varies between 79-87%. But lower current efficiency (25-38%) was obtained for AlCl3-BMIC-TiCl4 electrolytes due to the formation of TiCl3 passive layer on the electrodes. To increase the productivity, constant current method (160-210 A/m2) was implemented. This fundamental study on low temperature production of dendrite-free aluminum and Al-Ti alloys is not only efficient but also opens a novel route in aluminum and titanium process metallurgy.

  15. Protective Coatings for Aluminum Alloy Based on Hyperbranched 1,4-Polytriazoles.

    PubMed

    Armelin, Elaine; Whelan, Rory; Martínez-Triana, Yeimy Mabel; Alemán, Carlos; Finn, M G; Díaz, David Díaz

    2017-02-01

    Organic polymers are widely used as coatings and adhesives to metal surfaces, but aluminum is among the most difficult substrates because of rapid oxidative passivation of its surface. Poly(1,4-disubstituted 1,2,3-triazoles) made by copper-catalyzed azide-alkyne cycloaddition form strongly bonded interfaces with several metal substrates. In this work, a variety of alkyne and azide monomers were explored as precursors to anticorrosion coatings for a standard high-strength aluminum-copper alloy. Monomers of comparatively low valency (diazide and trialkyne) were found to act as superior barriers for electrolyte transfer to the aluminum surface. These materials showed excellent resistance to corrosive pitting due to the combination of three complementary properties: good formation of highly cross-linked films, as observed by Fourier transform infrared spectroscopy and differential scanning calorimetry; good adhesion to the aluminum alloy substrate, as shown by pull-off testing; and excellent impermeability, as demonstrated by electrochemical impedance spectroscopy.

  16. Production of aluminum metal by electrolysis of aluminum sulfide

    DOEpatents

    Minh, Nguyen Q.; Loutfy, Raouf O.; Yao, Neng-Ping

    1984-01-01

    Production of metallic aluminum by the electrolysis of Al.sub.2 S.sub.3 at 700.degree.-800.degree. C. in a chloride melt composed of one or more alkali metal chlorides, and one or more alkaline earth metal chlorides and/or aluminum chloride to provide improved operating characteristics of the process.

  17. Production of aluminum metal by electrolysis of aluminum sulfide

    DOEpatents

    Minh, N.Q.; Loutfy, R.O.; Yao, N.P.

    1982-04-01

    Metallic aluminum may be produced by the electrolysis of Al/sub 2/S/sub 3/ at 700 to 800/sup 0/C in a chloride melt composed of one or more alkali metal chlorides, and one or more alkaline earth metal chlorides and/or aluminum chloride to provide improved operating characteristics of the process.

  18. Production of aluminum metal by electrolysis of aluminum sulfide

    SciTech Connect

    Minh, N.Q.; Loutfy, R.O.; Yao, N.P.

    1984-08-07

    A method is disclosed for production of metallic aluminum by the electrolysis of A1/sub 2/S/sub 3/ at 700/sup 0/-800/sup 0/ C. in a chloride melt composed of one or more alkali metal chlorides, and one or more alkaline earth metal chlorides and/or aluminum chloride to provide improved operating characteristics of the process.

  19. A charge transport study in diamond, surface passivated by high-k dielectric oxides

    SciTech Connect

    Kovi, Kiran Kumar Majdi, Saman; Gabrysch, Markus; Isberg, Jan

    2014-11-17

    The recent progress in the growth of high-quality single-crystalline diamond films has sparked interest in the realization of efficient diamond power electronic devices. However, finding a suitable passivation is essential to improve the reliability and electrical performance of devices. In the current work, high-k dielectric materials such as aluminum oxide and hafnium oxide were deposited by atomic layer deposition on intrinsic diamond as a surface passivation layer. The hole transport properties in the diamond films were evaluated and compared to unpassivated films using the lateral time-of-flight technique. An enhancement of the near surface hole mobility in diamond films of up to 27% is observed when using aluminum oxide passivation.

  20. Hood River Passive House

    SciTech Connect

    Hales, David

    2014-01-01

    The Hood River Passive Project was developed by Root Design Build of Hood River Oregon using the Passive House Planning Package (PHPP) to meet all of the requirements for certification under the European Passive House standards. The Passive House design approach has been gaining momentum among residential designers for custom homes and BEopt modeling indicates that these designs may actually exceed the goal of the U.S. Department of Energy's (DOE) Building America program to "reduce home energy use by 30%-50% (compared to 2009 energy codes for new homes). This report documents the short term test results of the Shift House and compares the results of PHPP and BEopt modeling of the project. The design includes high R-Value assemblies, extremely tight construction, high performance doors and windows, solar thermal DHW, heat recovery ventilation, moveable external shutters and a high performance ductless mini-split heat pump. Cost analysis indicates that many of the measures implemented in this project did not meet the BA standard for cost neutrality. The ductless mini-split heat pump, lighting and advanced air leakage control were the most cost effective measures. The future challenge will be to value engineer the performance levels indicated here in modeling using production based practices at a significantly lower cost.

  1. Hood River Passive House

    SciTech Connect

    Hales, D.

    2014-01-01

    The Hood River Passive Project was developed by Root Design Build of Hood River Oregon using the Passive House Planning Package (PHPP) to meet all of the requirements for certification under the European Passive House standards. The Passive House design approach has been gaining momentum among residential designers for custom homes and BEopt modeling indicates that these designs may actually exceed the goal of the U.S. Department of Energy's (DOE) Building America program to reduce home energy use by 30%-50% (compared to 2009 energy codes for new homes). This report documents the short term test results of the Shift House and compares the results of PHPP and BEopt modeling of the project. The design includes high R-Value assemblies, extremely tight construction, high performance doors and windows, solar thermal DHW, heat recovery ventilation, moveable external shutters and a high performance ductless mini-split heat pump. Cost analysis indicates that many of the measures implemented in this project did not meet the BA standard for cost neutrality. The ductless mini-split heat pump, lighting and advanced air leakage control were the most cost effective measures. The future challenge will be to value engineer the performance levels indicated here in modeling using production based practices at a significantly lower cost.

  2. Passives and Their Meaning

    ERIC Educational Resources Information Center

    Langacker, Ronald W.; Munro, Pamela

    1975-01-01

    An underlying representation for passive sentences in Mojave and Uto-Aztecan is proposed, and the broader issues that arise in extending the analysis to other languages and incorporating it in linguistic theory as a substantive language universal are explored. (Author/RM)

  3. Passive hydrogel fuel generator

    SciTech Connect

    Neefe, Ch. W.

    1985-04-16

    A passive hydrogen oxygen generator in which the long wavelength infrared portion of the sun's spectrum heats water to provide circulation of the water within the generator. The shorter wavelength portion of the spectrum to which water is transparent is used in splitting water into hydrogen and oxygen by photoelectrolysis.

  4. Passive Magnetic Bearing

    NASA Technical Reports Server (NTRS)

    Studer, P. A.

    1983-01-01

    Magnetic bearing for limited rotation devices requires no feedback control system to sense and correct shaft position. Passive Magnetic Torsion Bearing requires no power supply and has no rubbing parts. Torsion wire restrains against axial instability. Magnetic flux geometry chosen to assure lateral stability with radial restoring force that maintains alignment.

  5. Photoemission study of tris(8-hydroxyquinoline) aluminum/aluminum oxide/tris(8-hydroxyquinoline) aluminum interface

    SciTech Connect

    Ding Huanjun; Zorba, Serkan; Gao Yongli; Ma Liping; Yang Yang

    2006-12-01

    The evolution of the interface electronic structure of a sandwich structure involving aluminum oxide and tris(8-hydroxyquinoline) aluminum (Alq), i.e. (Alq/AlO{sub x}/Alq), has been investigated with photoemission spectroscopy. Strong chemical reactions have been observed due to aluminum deposition onto the Alq substrate. The subsequent oxygen exposure releases some of the Alq molecules from the interaction with aluminum. Finally, the deposition of the top Alq layer leads to an asymmetry in the electronic energy level alignment with respect to the AlO{sub x} interlayer.

  6. Critical properties of aluminum.

    PubMed

    Bhatt, Divesh; Jasper, Ahren W; Schultz, Nathan E; Siepmann, J Ilja; Truhlar, Donald G

    2006-04-05

    Gibbs ensemble Monte Carlo calculations are performed using a validated embedded-atom potential to obtain the vapor-liquid coexistence curve for elemental aluminum in good agreement with available experimental data up to the boiling point. These calculations are then extended to make a reliable prediction of the critical temperature, pressure, and density of Al, which have previously been known only with very large uncertainties. This demonstrates the ability of modern simulations to predict fundamental physical properties that are extremely difficult to measure directly.

  7. Characterization of ultradispersed aluminum

    SciTech Connect

    Simpson, R.L.; Maienschein, J.L.; Swansiger, R.W.; Garcia, F.; Darling, D.H.

    1994-12-08

    Samples of ultradispersed Al were received, which were produced by electrically exploding Al wires in argon. These samples comprised very small particles that were not significantly oxidized and that were stable in air. Particle morphology were studied with SE, micropycnometry, and gas adsorption surface area. Composition were determined using various techniques, as were thermal stability and reaction exotherms. The inexplicable reports of an Al-Ar compound and of an exothermic reaction were not confirmed. The material is a stable, nonoxidized, small-particle, highly reactive form of aluminum that is of interest in energetic materials formulations.

  8. Aluminum nitride grating couplers.

    PubMed

    Ghosh, Siddhartha; Doerr, Christopher R; Piazza, Gianluca

    2012-06-10

    Grating couplers in sputtered aluminum nitride, a piezoelectric material with low loss in the C band, are demonstrated. Gratings and a waveguide micromachined on a silicon wafer with 600 nm minimum feature size were defined in a single lithography step without partial etching. Silicon dioxide (SiO(2)) was used for cladding layers. Peak coupling efficiency of -6.6 dB and a 1 dB bandwidth of 60 nm have been measured. This demonstration of wire waveguides and wideband grating couplers in a material that also has piezoelectric and elasto-optic properties will enable new functions for integrated photonics and optomechanics.

  9. Enhanced integrability of porous low-permittivity dielectrics for improved reliability in copper-based interconnects

    NASA Astrophysics Data System (ADS)

    Luo, Fu

    Achieving the aggressive device performance metrics demanded by the microelectronics industry dictates the use of low dielectric constant ('low-k') insulating materials to reduce the capacitive component of the interconnect-related RC signal propagation delay. In particular, to meet interconnect performance requirements for the 65 nm node and beyond, one approach is to introduce significant levels of porosity into the interlayer dielectric (ILD) films. However, the incorporation of porosity leads to a number of integration challenges, including increased reliability issues due to the open pores distributed on the sidewalls of vias/trenches. The research discussed in this paper demonstrates that it is possible to 'seal' the sidewalls of patterned porous dielectric layers using a specially designed deposition-etch passivation process. The concept of the process is to employ selected organosilcon precursors to deposit fully dense carbon-doped oxide (CDO) type films using plasma enhanced chemical vapor deposition (PECVD) on patterned porous dielectric structures, and then to preferentially plasma etch the material built up on the via floor. In order to ensure sufficient sealing results, several deposition-etch cycles are required. Based on this concept, a systematic process development project was carried out. The properties of the resulting CDO films are discussed. The integration characteristics of the CDO film with candidate porous low-k material and with a subsequently deposited TaN barrier layer were also investigated. In addition, two unique approaches have been developed for the characterization of the sealing effectiveness of the cycled passivation process. These two approaches are based on spectroscopic ellipsometry and capacitance-voltage techniques. Both use the exposure of the passivated porous material to the vapor of an organic solvent to evaluate the responses of samples to the presence of the solvent vapor. Results from these experiments confirmed that

  10. Selective Adsorption of Sodium Aluminum Fluoride Salts from Molten Aluminum

    SciTech Connect

    Leonard S. Aubrey; Christine A. Boyle; Eddie M. Williams; David H. DeYoung; Dawid D. Smith; Feng Chi

    2007-08-16

    Aluminum is produced in electrolytic reduction cells where alumina feedstock is dissolved in molten cryolite (sodium aluminum fluoride) along with aluminum and calcium fluorides. The dissolved alumina is then reduced by electrolysis and the molten aluminum separates to the bottom of the cell. The reduction cell is periodically tapped to remove the molten aluminum. During the tapping process, some of the molten electrolyte (commonly referred as “bath” in the aluminum industry) is carried over with the molten aluminum and into the transfer crucible. The carryover of molten bath into the holding furnace can create significant operational problems in aluminum cast houses. Bath carryover can result in several problems. The most troublesome problem is sodium and calcium pickup in magnesium-bearing alloys. Magnesium alloying additions can result in Mg-Na and Mg-Ca exchange reactions with the molten bath, which results in the undesirable pickup of elemental sodium and calcium. This final report presents the findings of a project to evaluate removal of molten bath using a new and novel micro-porous filter media. The theory of selective adsorption or removal is based on interfacial surface energy differences of molten aluminum and bath on the micro-porous filter structure. This report describes the theory of the selective adsorption-filtration process, the development of suitable micro-porous filter media, and the operational results obtained with a micro-porous bed filtration system. The micro-porous filter media was found to very effectively remove molten sodium aluminum fluoride bath by the selective adsorption-filtration mechanism.

  11. Optical passive athermalization for infrared zoom system

    NASA Astrophysics Data System (ADS)

    Li, Shenghui; Yang, Changcheng; Zheng, Jia; Lan, Ning; Xiong, Tao; Li, Yong

    2007-12-01

    In an infrared zoom system, it is difficult to obtain the best thermal compensation for all effective focal length (EFL) simultaneously by moving a single lens group. According to the principle of optical passive athermalization, the equations of focal length, achromatization and athermalization of both long and short EFL are established respectively. By analyzing the thermal aberration value relations between long EFL and short EFL, the thermal aberration values of the switching groups for short EFL athermalization are calculated. Firstly, the athermalization of long EFL is designed. Then through reasonable optical materials matching of the switching groups, the short EFL achieves athermalization as well. In this paper, a re-imaging switching zoom system is designed. It has a relative aperture of f/4.0, 100% cold shield efficiency, the EFL of 180mm/30mm at 3.7-4.8μm. The long EFL includes four refractive elements and one hybrid refractive/diffractive element. The switching groups of short EFL have two types, one is composed of four refractive elements, and the other is composed of two refractive elements and one hybrid refractive/diffractive element. Both of the short EFL achieve athermalization. With the aluminum materials of system structures, the zoom system achieves optical passive athermalization. It has the diffraction limited image quality and stable image plane from -30°C to 70°C.

  12. [The testing and verification for interconnect faults based on cluster FPGA configuration].

    PubMed

    Duan, Cheng-Hu; Jia, Jian-Ge

    2005-05-01

    We have developed a hierarchical approach to define a set of FPGA configurations to solve the interconnect testing problem. This technique enables the detection, testing and verification of bridging faults involving intracluster interconnect and extracluster interconnect to be done easily.

  13. 10+ Gb/s board-level optical interconnects: fabrication, assembly, and testing

    NASA Astrophysics Data System (ADS)

    Glebov, Alexei L.; Lee, Michael G.; Yokouchi, Kishio

    2006-04-01

    Fabrication and assembly technologies for high-speed board-to-board optical interconnect (B2OI) systems are presented. In the system architecture, the transmitters and receivers are placed on the linecards and the optical signals are routed to the optically passive backplane through the optical jumpers with MTP connectors. The backplane contains an optical layer with embedded polymer waveguides and 45° reflector micromirrors. The waveguides are fabricated by direct lithographic patterning and have propagation losses as low as 0.05 dB/cm at 850 nm. Hot-embossing is also evaluated for the waveguide fabrication demonstrating the waveguide propagation losses in the range of 0.06-0.1 dB/cm but rather poor channel-to-channel uniformity. The wedge dicing technology is developed for fabrication of the 45° reflector micromirrors with 0.5 dB losses. The pluggable optical connectors with microlens adaptors are used to couple the light from the optical jumpers into the backplane waveguides. The fabricated prototype optical interconnect modules with integrated channel waveguides, mirrors, and assembled connectors demonstrate insertion losses of 5-6 dB. The modules successfully pass high-speed transmission tests at data rates up to 11 Gb/s.

  14. Process Developed for Generating Ceramic Interconnects With Low Sintering Temperatures for Solid Oxide Fuel Cells

    NASA Technical Reports Server (NTRS)

    Zhong, Zhi-Min; Goldsby, Jon C.

    2005-01-01

    Solid oxide fuel cells (SOFCs) have been considered as premium future power generation devices because they have demonstrated high energy-conversion efficiency, high power density, and extremely low pollution, and have the flexibility of using hydrocarbon fuel. The Solid-State Energy Conversion Alliance (SECA) initiative, supported by the U.S. Department of Energy and private industries, is leading the development and commercialization of SOFCs for low-cost stationary and automotive markets. The targeted power density for the initiative is rather low, so that the SECA SOFC can be operated at a relatively low temperature (approx. 700 C) and inexpensive metallic interconnects can be utilized in the SOFC stack. As only NASA can, the agency is investigating SOFCs for aerospace applications. Considerable high power density is required for the applications. As a result, the NASA SOFC will be operated at a high temperature (approx. 900 C) and ceramic interconnects will be employed. Lanthanum chromite-based materials have emerged as a leading candidate for the ceramic interconnects. The interconnects are expected to co-sinter with zirconia electrolyte to mitigate the interface electric resistance and to simplify the processing procedure. Lanthanum chromites made by the traditional method are sintered at 1500 C or above. They react with zirconia electrolytes (which typically sinter between 1300 and 1400 C) at the sintering temperature of lanthanum chromites. It has been envisioned that lanthanum chromites with lower sintering temperatures can be co-fired with zirconia electrolyte. Nonstoichiometric lanthanum chromites can be sintered at lower temperatures, but they are unstable and react with zirconia electrolyte during co-sintering. NASA Glenn Research Center s Ceramics Branch investigated a glycine nitrate process to generate fine powder of the lanthanum-chromite-based materials. By simultaneously doping calcium on the lanthanum site, and cobalt and aluminum on the

  15. Aluminum Nanoholes for Optical Biosensing.

    PubMed

    Barrios, Carlos Angulo; Canalejas-Tejero, Víctor; Herranz, Sonia; Urraca, Javier; Moreno-Bondi, María Cruz; Avella-Oliver, Miquel; Maquieira, Ángel; Puchades, Rosa

    2015-07-09

    Sub-wavelength diameter holes in thin metal layers can exhibit remarkable optical features that make them highly suitable for (bio)sensing applications. Either as efficient light scattering centers for surface plasmon excitation or metal-clad optical waveguides, they are able to form strongly localized optical fields that can effectively interact with biomolecules and/or nanoparticles on the nanoscale. As the metal of choice, aluminum exhibits good optical and electrical properties, is easy to manufacture and process and, unlike gold and silver, its low cost makes it very promising for commercial applications. However, aluminum has been scarcely used for biosensing purposes due to corrosion and pitting issues. In this short review, we show our recent achievements on aluminum nanohole platforms for (bio)sensing. These include a method to circumvent aluminum degradation--which has been successfully applied to the demonstration of aluminum nanohole array (NHA) immunosensors based on both, glass and polycarbonate compact discs supports--the use of aluminum nanoholes operating as optical waveguides for synthesizing submicron-sized molecularly imprinted polymers by local photopolymerization, and a technique for fabricating transferable aluminum NHAs onto flexible pressure-sensitive adhesive tapes, which could facilitate the development of a wearable technology based on aluminum NHAs.

  16. Aluminum Nanoholes for Optical Biosensing

    PubMed Central

    Barrios, Carlos Angulo; Canalejas-Tejero, Víctor; Herranz, Sonia; Urraca, Javier; Moreno-Bondi, María Cruz; Avella-Oliver, Miquel; Maquieira, Ángel; Puchades, Rosa

    2015-01-01

    Sub-wavelength diameter holes in thin metal layers can exhibit remarkable optical features that make them highly suitable for (bio)sensing applications. Either as efficient light scattering centers for surface plasmon excitation or metal-clad optical waveguides, they are able to form strongly localized optical fields that can effectively interact with biomolecules and/or nanoparticles on the nanoscale. As the metal of choice, aluminum exhibits good optical and electrical properties, is easy to manufacture and process and, unlike gold and silver, its low cost makes it very promising for commercial applications. However, aluminum has been scarcely used for biosensing purposes due to corrosion and pitting issues. In this short review, we show our recent achievements on aluminum nanohole platforms for (bio)sensing. These include a method to circumvent aluminum degradation—which has been successfully applied to the demonstration of aluminum nanohole array (NHA) immunosensors based on both, glass and polycarbonate compact discs supports—the use of aluminum nanoholes operating as optical waveguides for synthesizing submicron-sized molecularly imprinted polymers by local photopolymerization, and a technique for fabricating transferable aluminum NHAs onto flexible pressure-sensitive adhesive tapes, which could facilitate the development of a wearable technology based on aluminum NHAs. PMID:26184330

  17. Aluminum-Lead Composite Materials

    NASA Astrophysics Data System (ADS)

    Kovtunov, A. I.; Khokhlov, Yu. Yu.; Myamin, S. V.

    2017-05-01

    A process of fabrication of aluminum-lead sliding bearings is suggested on the basis of impregnation of foam aluminum with lead or lead-base alloys. The results of tests of physical, mechanical and operating properties of the composite materials are presented.

  18. The Benefits of Aluminum Windows.

    ERIC Educational Resources Information Center

    Goyal, R. C.

    2002-01-01

    Discusses benefits of aluminum windows for college construction and renovation projects, including that aluminum is the most successfully recycled material, that it meets architectural glass deflection standards, that it has positive thermal energy performance, and that it is a preferred exterior surface. (EV)

  19. Lost-Soap Aluminum Casting.

    ERIC Educational Resources Information Center

    Mihalow, Paula

    1980-01-01

    Lost-wax casting in sterling silver is a costly experience for the average high school student. However, this jewelry process can be learned at no cost if scrap aluminum is used instead of silver, and soap bars are used instead of wax. This lost-soap aluminum casting process is described. (Author/KC)

  20. Measuring Hydrogen Properties in Aluminum

    NASA Technical Reports Server (NTRS)

    Outlaw, R. A.

    1982-01-01

    System in use at Langley Research Center measures concentration and diffusion coefficient of hydrogen in pure aluminum. Principal components are high-temperature ultra-high-vacuum furnace and quadrupole mass spectrometer. Quantities of hydrogen and other gases that evolve from heated metal are measured in real time and correlated with data on aluminum porosity.

  1. The Benefits of Aluminum Windows.

    ERIC Educational Resources Information Center

    Goyal, R. C.

    2002-01-01

    Discusses benefits of aluminum windows for college construction and renovation projects, including that aluminum is the most successfully recycled material, that it meets architectural glass deflection standards, that it has positive thermal energy performance, and that it is a preferred exterior surface. (EV)

  2. Lost-Soap Aluminum Casting.

    ERIC Educational Resources Information Center

    Mihalow, Paula

    1980-01-01

    Lost-wax casting in sterling silver is a costly experience for the average high school student. However, this jewelry process can be learned at no cost if scrap aluminum is used instead of silver, and soap bars are used instead of wax. This lost-soap aluminum casting process is described. (Author/KC)

  3. Primary Aluminum Plants Worldwide - 1998

    USGS Publications Warehouse

    1999-01-01

    The 1990 U.S. Bureau of Mines publication, Primary Aluminum Plants Worldwide, has been updated and is now available. The 1998 USGS edition of Primary Aluminum Plants Worldwide is published in two parts. Part I—Detail contains information on individual primary smelter capacity, location, ownership, sources of energy, and other miscellaneous information. Part II—Summary summarizes the capacity data by country

  4. Interconnectivity analysis of supercritical CO₂-foamed scaffolds.

    PubMed

    Lemon, Greg; Reinwald, Yvonne; White, Lisa J; Howdle, Steven M; Shakesheff, Kevin M; King, John R

    2012-06-01

    This paper describes a computer algorithm for the determination of the interconnectivity of the pore space inside scaffolds used for tissue engineering. To validate the algorithm and its computer implementation, the algorithm was applied to a computer-generated scaffold consisting of a set of overlapping spherical pores, for which the interconnectivity was calculated exactly. The algorithm was then applied to micro-computed X-ray tomography images of supercritical CO(2)-foamed scaffolds made from poly(lactic-co-glycolic acid) (PLGA), whereby the effect of using different weight average molecular weight polymer on the interconnectivity was investigated.

  5. Aluminum alloys for aerostructures

    SciTech Connect

    Staley, J.T.; Liu, J.; Hunt, W.H. Jr.

    1997-10-01

    Demands on the airframe industry have shifted over the years, but they have always moved in the direction of lower weight, higher damage tolerance, and longer-term durability. Up to the 1960s, the greatest need was for high strength to reduce weight. In the 1970s, higher fracture toughness and corrosion resistance were sought for enhanced damage tolerance and durability. In the early 1980s, the requirement for reduced weight was renewed, but by the late 1980s and early 1990s, durability became a concern again. Today`s focus is on materials that can help achieve low-cost manufacturing without sacrificing performance; future needs are likely to include both affordability and higher performance. This article describes the development of high-strength aluminum alloy materials that have satisfied past and current requirements, and identifies possible aluminum-intensive approaches that combine alternate design concepts and emerging materials technologies for low-cost, low-weight, damage-tolerant, and durable airframe structures of the future.

  6. Hot Extrusion of Aluminum Chips

    NASA Astrophysics Data System (ADS)

    Tekkaya, A. Erman; Güley, Volkan; Haase, Matthias; Jäger, Andreas

    The process of hot extrusion is a promising approach for the direct recycling of aluminum machining chips to aluminum profiles. The presented technology is capable of saving energy, as remelting of aluminum chips can be avoided. Depending on the deformation route and process parameters, the chip-based aluminum extradates showed mechanical properties comparable or superior to cast aluminum billets extruded under the same conditions. Using different metal flow schemes utilizing different extrusion dies the mechanical properties of the profiles extruded from chips can be improved. The energy absorption capacity of the profiles the rectangular hollow profiles extruded from chips and as-cast billets were analyzed using the drop hammer test set-up. The formability of the profiles extruded from chips and as-cast material were compared using tube bending tests in a three-roller-bending machine.

  7. Wettability of Aluminum on Alumina

    NASA Astrophysics Data System (ADS)

    Bao, Sarina; Tang, Kai; Kvithyld, Anne; Tangstad, Merete; Engh, Thorvald Abel

    2011-12-01

    The wettability of molten aluminum on solid alumina substrate has been investigated by the sessile drop technique in a 10-8 bar vacuum or under argon atmosphere in the temperature range from 1273 K to 1673 K (1000 °C to 1400 °C). It is shown that the reduction of oxide skin on molten aluminum is slow under normal pressures even with ultralow oxygen potential, but it is enhanced in high vacuum. To describe the wetting behavior of the Al-Al2O3 system at lower temperatures, a semiempirical calculation was employed. The calculated contact angle at 973 K (700 °C) is approximately 97 deg, which indicates that aluminum does not wet alumina at aluminum casting temperatures. Thus, a priming height is required for aluminum to infiltrate a filter. Wetting in the Al-Al2O3 system increases with temperature.

  8. Hybrid silicon evanescent approach to optical interconnects

    NASA Astrophysics Data System (ADS)

    Liang, Di; Fang, Alexander W.; Chen, Hui-Wen; Sysak, Matthew N.; Koch, Brian R.; Lively, Erica; Raday, Omri; Kuo, Ying-Hao; Jones, Richard; Bowers, John E.

    2009-06-01

    We discuss the recently developed hybrid silicon evanescent platform (HSEP), and its application as a promising candidate for optical interconnects in silicon. A number of key discrete components and a wafer-scale integration process are reviewed. The motivation behind this work is to realize silicon-based photonic integrated circuits possessing unique advantages of III-V materials and silicon-on-insulator waveguides simultaneously through a complementary metal-oxide semiconductor fabrication process. Electrically pumped hybrid silicon distributed feedback and distributed Bragg reflector lasers with integrated hybrid silicon photodetectors are demonstrated coupled to SOI waveguides, serving as the reliable on-chip single-frequency light sources. For the external signal processing, Mach-Zehnder interferometer modulators are demonstrated, showing a resistance-capacitance-limited, 3 dB electrical bandwidth up to 8 GHz and a modulation efficiency of 1.5 V mm. The successful implementation of quantum well intermixing technique opens up the possibility to realize multiple III-V bandgaps in this platform. Sampled grating DBR devices integrated with electroabsorption modulators (EAM) are fabricated, where the bandgaps in gain, mirror, and EAM regions are 1520, 1440 and 1480 nm, respectively. The high-temperature operation characteristics of the HSEP are studied experimentally and theoretically. An overall characteristic temperature ( T 0) of 51°C, an above threshold characteristic temperature ( T 1) of 100°C, and a thermal impedance ( Z T ) of 41.8°C/W, which agrees with the theoretical prediction of 43.5°C/W, are extracted from the Fabry-Perot devices. Scaling this platform to larger dimensions is demonstrated up to 150 mm wafer diameter. A vertical outgassing channel design is developed to accomplish high-quality III-V epitaxial transfer to silicon in a timely and dimension-independent fashion.

  9. Genomic Predictability of Interconnected Biparental Maize Populations

    PubMed Central

    Riedelsheimer, Christian; Endelman, Jeffrey B.; Stange, Michael; Sorrells, Mark E.; Jannink, Jean-Luc; Melchinger, Albrecht E.

    2013-01-01

    Intense structuring of plant breeding populations challenges the design of the training set (TS) in genomic selection (GS). An important open question is how the TS should be constructed from multiple related or unrelated small biparental families to predict progeny from individual crosses. Here, we used a set of five interconnected maize (Zea mays L.) populations of doubled-haploid (DH) lines derived from four parents to systematically investigate how the composition of the TS affects the prediction accuracy for lines from individual crosses. A total of 635 DH lines genotyped with 16,741 polymorphic SNPs were evaluated for five traits including Gibberella ear rot severity and three kernel yield component traits. The populations showed a genomic similarity pattern, which reflects the crossing scheme with a clear separation of full sibs, half sibs, and unrelated groups. Prediction accuracies within full-sib families of DH lines followed closely theoretical expectations, accounting for the influence of sample size and heritability of the trait. Prediction accuracies declined by 42% if full-sib DH lines were replaced by half-sib DH lines, but statistically significantly better results could be achieved if half-sib DH lines were available from both instead of only one parent of the validation population. Once both parents of the validation population were represented in the TS, including more crosses with a constant TS size did not increase accuracies. Unrelated crosses showing opposite linkage phases with the validation population resulted in negative or reduced prediction accuracies, if used alone or in combination with related families, respectively. We suggest identifying and excluding such crosses from the TS. Moreover, the observed variability among populations and traits suggests that these uncertainties must be taken into account in models optimizing the allocation of resources in GS. PMID:23535384

  10. Interacting Social Processes on Interconnected Networks

    PubMed Central

    Alvarez-Zuzek, Lucila G.; La Rocca, Cristian E.; Vazquez, Federico; Braunstein, Lidia A.

    2016-01-01

    We propose and study a model for the interplay between two different dynamical processes –one for opinion formation and the other for decision making– on two interconnected networks A and B. The opinion dynamics on network A corresponds to that of the M-model, where the state of each agent can take one of four possible values (S = −2,−1, 1, 2), describing its level of agreement on a given issue. The likelihood to become an extremist (S = ±2) or a moderate (S = ±1) is controlled by a reinforcement parameter r ≥ 0. The decision making dynamics on network B is akin to that of the Abrams-Strogatz model, where agents can be either in favor (S = +1) or against (S = −1) the issue. The probability that an agent changes its state is proportional to the fraction of neighbors that hold the opposite state raised to a power β. Starting from a polarized case scenario in which all agents of network A hold positive orientations while all agents of network B have a negative orientation, we explore the conditions under which one of the dynamics prevails over the other, imposing its initial orientation. We find that, for a given value of β, the two-network system reaches a consensus in the positive state (initial state of network A) when the reinforcement overcomes a crossover value r*(β), while a negative consensus happens for r < r*(β). In the r − β phase space, the system displays a transition at a critical threshold βc, from a coexistence of both orientations for β < βc to a dominance of one orientation for β > βc. We develop an analytical mean-field approach that gives an insight into these regimes and shows that both dynamics are equivalent along the crossover line (r*, β*). PMID:27689698

  11. Hydraulically interconnected vehicle suspension: handling performance

    NASA Astrophysics Data System (ADS)

    Smith, Wade A.; Zhang, Nong; Hu, William

    2011-02-01

    This paper extends recent research on vehicles with hydraulically interconnected suspension (HIS) systems. Such suspension schemes have received considerable attention in the research community over the last few years. This is due, in part, to their reported ability to provide stiffness and damping rates dependent on the suspension mode of operation (i.e. the bounce, roll, pitch or articulation of the unsprung masses relative to the sprung mass), rather than relying on the stiffness and damping characteristics of the single wheel stations. The paper uses a nine-degrees-of-freedom (DOF) vehicle model and simulations of a fishhook manoeuvre to assess the handling performance of a vehicle when it is fitted with: (a) a conventional independent suspension, and (b) an HIS. In the case of the latter, the fluid subsystem is modelled using a nonlinear finite-element approach, resulting in a set of coupled, first-order nonlinear differential equations, which describe the dynamics of the integrated mechanical-hydraulic vehicle system. The simulation results indicate that, in general, the HIS-equipped vehicle possesses superior handling, as measured by the sprung mass roll angle, roll rate, roll acceleration, lateral acceleration and the vehicle's Rollover Critical Factor. The potential effects of the suspension set-up on ride performance are also considered by studying the transient response when one side of the vehicle traverses a half-sine bump. The obtained results are then discussed, and it is shown that they are consistent with previous findings, both by the authors and other researchers. The presented work outlines an alternative approach for studying the dynamics of HIS-equipped vehicles, particularly suited to analyses in the time domain.

  12. Interacting Social Processes on Interconnected Networks.

    PubMed

    Alvarez-Zuzek, Lucila G; La Rocca, Cristian E; Vazquez, Federico; Braunstein, Lidia A

    We propose and study a model for the interplay between two different dynamical processes -one for opinion formation and the other for decision making- on two interconnected networks A and B. The opinion dynamics on network A corresponds to that of the M-model, where the state of each agent can take one of four possible values (S = -2,-1, 1, 2), describing its level of agreement on a given issue. The likelihood to become an extremist (S = ±2) or a moderate (S = ±1) is controlled by a reinforcement parameter r ≥ 0. The decision making dynamics on network B is akin to that of the Abrams-Strogatz model, where agents can be either in favor (S = +1) or against (S = -1) the issue. The probability that an agent changes its state is proportional to the fraction of neighbors that hold the opposite state raised to a power β. Starting from a polarized case scenario in which all agents of network A hold positive orientations while all agents of network B have a negative orientation, we explore the conditions under which one of the dynamics prevails over the other, imposing its initial orientation. We find that, for a given value of β, the two-network system reaches a consensus in the positive state (initial state of network A) when the reinforcement overcomes a crossover value r*(β), while a negative consensus happens for r < r*(β). In the r - β phase space, the system displays a transition at a critical threshold βc, from a coexistence of both orientations for β < βc to a dominance of one orientation for β > βc. We develop an analytical mean-field approach that gives an insight into these regimes and shows that both dynamics are equivalent along the crossover line (r*, β*).

  13. "Get"-Passives in English.

    ERIC Educational Resources Information Center

    Collins, Peter C.

    1996-01-01

    Tests claims regarding "get"-passives in English via interrogation of a set of written and spoken corpora. The data suggest that "get"-passives are often associated with two types of pragmatic implicature. Finally, the corpus provides evidence of three types of variation with 'get'-passives: regional, stylistic, and diachronic.…

  14. Fabrication of superhydrophobic surface with improved corrosion inhibition on 6061 aluminum alloy substrate

    NASA Astrophysics Data System (ADS)

    Li, Xuewu; Zhang, Qiaoxin; Guo, Zheng; Shi, Tian; Yu, Jingui; Tang, Mingkai; Huang, Xingjiu

    2015-07-01

    This work has developed a simple and low-cost method to render 6061 aluminum alloy surface superhydrophobicity and excellent corrosion inhibition. The superhydrophobic aluminum alloy surface has been fabricated by hydrochloric acid etching, potassium permanganate passivation and fluoroalkyl-silane modification. Meanwhile, the effect of the etching and passivation time on the wettability and corrosion inhibition of the fabricated surface has also been investigated. Results show that with the etching time of 6 min and passivation time of 180 min the fabricated micro/nano-scale terrace-like hierarchical structures accompanying with the nanoscale coral-like network bulge structures after being modified can result in superhydrophobicity with a water contact angle (CA) of 155.7°. Moreover, an extremely weak adhesive force to droplets as well as an outstanding self-cleaning behavior of the superhydrophobic surface has also been proved. Finally, corrosion inhibition in seawater of the as-prepared aluminum alloy surface is characterized by potentiodynamic polarization curves and electrochemical impedance spectroscopy. Evidently, the fabricated superhydrophobic surface attained an improved corrosion inhibition efficiency of 83.37% compared with the traditional two-step processing consisting of etching and modification, which will extend the further applications of aluminum alloy especially in marine engineering fields.

  15. Passive broadband acoustic thermometry

    NASA Astrophysics Data System (ADS)

    Anosov, A. A.; Belyaev, R. V.; Klin'shov, V. V.; Mansfel'd, A. D.; Subochev, P. V.

    2016-04-01

    The 1D internal (core) temperature profiles for the model object (plasticine) and the human hand are reconstructed using the passive acoustothermometric broadband probing data. Thermal acoustic radiation is detected by a broadband (0.8-3.5 MHz) acoustic radiometer. The temperature distribution is reconstructed using a priori information corresponding to the experimental conditions. The temperature distribution for the heated model object is assumed to be monotonic. For the hand, we assume that the temperature distribution satisfies the heat-conduction equation taking into account the blood flow. The average error of reconstruction determined for plasticine from the results of independent temperature measurements is 0.6 K for a measuring time of 25 s. The reconstructed value of the core temperature of the hand (36°C) generally corresponds to physiological data. The obtained results make it possible to use passive broadband acoustic probing for measuring the core temperatures in medical procedures associated with heating of human organism tissues.

  16. Active and passive euthanasia.

    PubMed

    Rachels, J

    1975-01-09

    The traditional distinction between active and passive euthanasia requires critical analysis. The conventional doctrine is that there is such an important moral difference between the two that, although the latter is sometimes permissible, the former is always forbidden. This doctrine may be challenged for several reasons. First of all, active euthanasia is in many cases more humane than passive euthanasia, Secondly, the conventional doctrine leads to decisions concerning life and death on irrelevant grounds. Thirdly, the doctrine rests on a distinction between killing and letting die that itself has no moral importance. Fourthly, the most common arguments in favor of the doctrine are invalid. I therefore suggest that the American Medical Association policy statement that endorses this doctrine is unsound.

  17. Passivated niobium cavities

    DOEpatents

    Myneni, Ganapati Rao [Yorktown, VA; Hjorvarsson, Bjorgvin [Lagga Arby, SE; Ciovati, Gianluigi [Newport News, VA

    2006-12-19

    A niobium cavity exhibiting high quality factors at high gradients is provided by treating a niobium cavity through a process comprising: 1) removing surface oxides by plasma etching or a similar process; 2) removing hydrogen or other gases absorbed in the bulk niobium by high temperature treatment of the cavity under ultra high vacuum to achieve hydrogen outgassing; and 3) assuring the long term chemical stability of the niobium cavity by applying a passivating layer of a superconducting material having a superconducting transition temperature higher than niobium thereby reducing losses from electron (cooper pair) scattering in the near surface region of the interior of the niobium cavity. According to a preferred embodiment, the passivating layer comprises niobium nitride (NbN) applied by reactive sputtering.

  18. On the Equilibrium States of Interconnected Bubbles or Balloons.

    ERIC Educational Resources Information Center

    Weinhaus, F.; Barker, W.

    1978-01-01

    Describes the equilibrium states of a system composed of two interconnected, air-filled spherical membranes of different sizes. The equilibrium configurations are determined by the method of minimization of the availability of the system at constant temperature. (GA)

  19. Free-Space Optical Interconnect Employing VCSEL Diodes

    NASA Technical Reports Server (NTRS)

    Simons, Rainee N.; Savich, Gregory R.; Torres, Heidi

    2009-01-01

    Sensor signal processing is widely used on aircraft and spacecraft. The scheme employs multiple input/output nodes for data acquisition and CPU (central processing unit) nodes for data processing. To connect 110 nodes and CPU nodes, scalable interconnections such as backplanes are desired because the number of nodes depends on requirements of each mission. An optical backplane consisting of vertical-cavity surface-emitting lasers (VCSELs), VCSEL drivers, photodetectors, and transimpedance amplifiers is the preferred approach since it can handle several hundred megabits per second data throughput.The next generation of satellite-borne systems will require transceivers and processors that can handle several Gb/s of data. Optical interconnects have been praised for both their speed and functionality with hopes that light can relieve the electrical bottleneck predicted for the near future. Optoelectronic interconnects provide a factor of ten improvement over electrical interconnects.

  20. Environmental toxicology: Interconnections between human health and ecological integrity

    EPA Science Inventory

    This presentation will discuss what has made a career in environmental toxicology rewarding, environmental and scientific challenges for the 21st century, paradigm shift in regulatory toxicology, adverse outcome framework, interconnections between human health and ecological inte...