Investigation of photolithography process on SPOs for the Athena mission

NASA Astrophysics Data System (ADS)

Massahi, S.; Girou, D. A.; Ferreira, D. D. M.; Christensen, F. E.; Jakobsen, A. C.; Shortt, B.; Collon, M.; Landgraf, B.

2015-09-01

As part of the ongoing effort to optimize the throughput of the Athena optics we have produced mirrors with a state-of-the-art cleaning process. We report on the studies related to the importance of the photolithographic process. Pre-coating characterization of the mirrors has shown and still shows photoresist remnants on the SiO2- rib bonding zones, which influences the quality of the metallic coating and ultimately the mirror performance. The size of the photoresist remnants is on the order of 10 nm which is about half the thickness of final metallic coating. An improved photoresist process has been developed including cleaning with O2 plasma in order to remove the remaining photoresist remnants prior to coating. Surface roughness results indicate that the SiO2-rib bonding zones are as clean as before the photolithography process is performed.

Evaluation of stabilization techniques for ion implant processing

NASA Astrophysics Data System (ADS)

Ross, Matthew F.; Wong, Selmer S.; Minter, Jason P.; Marlowe, Trey; Narcy, Mark E.; Livesay, William R.

1999-06-01

With the integration of high current ion implant processing into volume CMOS manufacturing, the need for photoresist stabilization to achieve a stable ion implant process is critical. This study compares electron beam stabilization, a non-thermal process, with more traditional thermal stabilization techniques such as hot plate baking and vacuum oven processing. The electron beam processing is carried out in a flood exposure system with no active heating of the wafer. These stabilization techniques are applied to typical ion implant processes that might be found in a CMOS production process flow. The stabilization processes are applied to a 1.1 micrometers thick PFI-38A i-line photoresist film prior to ion implant processing. Post stabilization CD variation is detailed with respect to wall slope and feature integrity. SEM photographs detail the effects of the stabilization technique on photoresist features. The thermal stability of the photoresist is shown for different levels of stabilization and post stabilization thermal cycling. Thermal flow stability of the photoresist is detailed via SEM photographs. A significant improvement in thermal stability is achieved with the electron beam process, such that photoresist features are stable to temperatures in excess of 200 degrees C. Ion implant processing parameters are evaluated and compared for the different stabilization methods. Ion implant system end-station chamber pressure is detailed as a function of ion implant process and stabilization condition. The ion implant process conditions are detailed for varying factors such as ion current, energy, and total dose. A reduction in the ion implant systems end-station chamber pressure is achieved with the electron beam stabilization process over the other techniques considered. This reduction in end-station chamber pressure is shown to provide a reduction in total process time for a given ion implant dose. Improvements in the ion implant process are detailed across several combinations of current and energy.

Method for applying a photoresist layer to a substrate having a preexisting topology

DOEpatents

Morales, Alfredo M.; Gonzales, Marcela

2004-01-20

The present invention describes a method for preventing a photoresist layer from delaminating, peeling, away from the surface of a substrate that already contains an etched three dimensional structure such as a hole or a trench. The process comprises establishing a saturated vapor phase of the solvent media used to formulate the photoresist layer, above the surface of the coated substrate as the applied photoresist is heated in order to "cure" or drive off the retained solvent constituent within the layer. By controlling the rate and manner in which solvent is removed from the photoresist layer the layer is stabilized and kept from differentially shrinking and peeling away from the substrate.

Processing of Superconductor-Normal-Superconductor Josephson Edge Junctions

NASA Technical Reports Server (NTRS)

Kleinsasser, A. W.; Barner, J. B.

1997-01-01

The electrical behavior of epitaxial superconductor-normal-superconductor (SNS) Josephson edge junctions is strongly affected by processing conditions. Ex-situ processes, utilizing photoresist and polyimide/photoresist mask layers, are employed for ion milling edges for junctions with Yttrium-Barium-Copper-Oxide (YBCO) electrodes and primarily Co-doped YBCO interlayers.

Investigation of UFO defect on DUV CAR and BARC process

NASA Astrophysics Data System (ADS)

Yet, Siew Ing; Ko, Bong Sang; Lee, Soo Man; May, Mike

2004-05-01

Photo process defect reduction is one of the most important factors to improve the process stability and yield in sub-0.18um DUV process. In this paper, a new approach to minimize the Deep-UV (DUV) Chemically Amplified Resist (CAR) and Bottom Anti-Reflective Coating (BARC) induced defect known as UFO (UnidentiFied Object) defect will be introduced. These defects have mild surface topography difference on BARC; it only exists on the wide exposed area where there is no photoresist pattern. In this test, Nikon KrF Stepper & Scanner and TEL Clean track were used. Investigation was carried out on the defect formulation on both Acetal and ESCAP type of photoresist while elemental analysis was done by Atomic Force Microscope (AFM) & Auger Electron Spectroscopy (AES). Result indicated that both BARC and photoresist induce this UFO defect; total defect quantity is related with Post Exposure Bake (PEB) condition. Based on the elemental analysis and process-split test, we can conclude that this defect is caused by lack of acid amount and low diffusivity which is related to PAG (Photo Acid Generator) and TAG (Thermal Acid Generator) in KrF photoresist and BARC material. By optimizing photoresist bake condition, this UFO defect as well as other related defect such as Satellite defect could be eliminated.

The development of an SC1 removable si-anti-reflective-coating

NASA Astrophysics Data System (ADS)

Yamada, Shintaro; Ke, Iou-Sheng; Cutler, Charlotte; Cui, Li; LaBeaume, Paul; Greene, Daniel; Popere, Bhooshan; Sullivan, Chris; Leonard, JoAnne; Coley, Suzanne; Wong, Sabrina; Ongayi, Owendi; Cameron, Jim; Clark, Michael B.; Fitzgibbons, Thomas C.

2018-03-01

A trilayer stack of spin-on-carbon (SOC), silicon anti-reflective coating (SiARC) and photoresist (PR) is often used to enable high resolution implant layers for integrated circuit manufacturing. Damage to substrates from SiARC removal using dry etching or aqueous hydrogen fluoride has increased the demand for innovative SiARC materials for implant lithography process. Wet strippable SiARCs (WS-SiARCs) capable of stripping under mild conditions such as SC1 (ammonium hydroxide/hydrogen peroxide/water) while maintaining key performance metrics of standard SiARCs is highly desirable. Minimizing the formation of Si-O-Si linkages by introducing organic crosslink sites was effective to impart SC1 solubility particularly after O2 dry etching. Incorporation of acidic groups onto the crosslinking site further improved SC1 solubility. A new siloxane polymer architecture that has SC1 active functionality in the polymer backbone was developed to further enhance SC1 solubility. A new SiARC formulation based on the new siloxane polymer achieved equivalent lithographic performances to a classic SiARC and SC1 strip rate >240Å/min under a relatively low concentration SC1 condition such as ammonium hydroxide/hydrogen peroxide/water=1/1/40.

Method of fabricating a 3-dimensional tool master

DOEpatents

Bonivert, William D.; Hachman, John T.

2002-01-01

The invention is a method for the fabrication of an imprint tool master. The process begins with a metallic substrate. A layer of photoresist is placed onto the metallic substrate and a image pattern mask is then aligned to the mask. The mask pattern has opaque portions that block exposure light and "open" or transparent portions which transmit exposure light. The photoresist layer is then exposed to light transmitted through the "open" portions of the first image pattern mask and the mask is then removed. A second layer of photoresist then can be placed onto the first photoresist layer and a second image pattern mask may be placed on the second layer of photoresist. The second layer of photoresist is exposed to light, as before, and the second mask removed. The photoresist layers are developed simultaneously to produce a multi-level master mandrel upon which a conductive film is formed. A tool master can now be formed onto the conductive film. An imprint tool is then produced from the tool master. In one embodiment, nickel is electroplated onto the tool master to produce a three-dimensional imprint tool.

The Effect of the Elimination of Micromotion and Tissue Strain on Intracortical Device Performance

DTIC Science & Technology

2017-10-01

dry mode and after soaking for 60 min in PBS at 37 °C. 6 3. Connectivity Issue: An additional issue emerged while trying to establish an electrical...patterned to dry etch the Parylene-C film using DMA ribbons photo mask using O2 plasma. The photoresist is then stripped off to get the wafers ready for...investigated visually by the naked eye and with an optical microscope and only those who pass (substrates with very low number of small particles, if

Chemically amplified i-line positive resist for next-generation flat panel display

NASA Astrophysics Data System (ADS)

Lee, Hsing-Chieh; Lu, Ying-Hao; Huang, Shin-Yih; Lan, Wei-Jen; Hanabata, Makoto

2017-03-01

Traditional diazonaphthoquinone (DNQ) positive photoresists are widely used for TFT-LCD array process. Current LTPS technology has more than 600ppi resolution is required for small or middle-sized TFT liquid crystal display panels. One of the ways to enhance resolution is to apply i-line single exposure system instead of traditional g/h/ibroadband exposure system. We have been developing i-line chemically amplified photoresist ECA 200 series for the next generation flat panel display (FPD). ECA 200 consists of three components: a phenol resin, a photo acid generator and dissolution enhancer. We applied two different types of dissolution enhancers with two different kinds of protected groups to our resist materials. As a result, we achieved higher sensitivity, higher resolution, less footing of the resist profile and reduced standing wave effect compared with traditional DNQ photoresists. In addition, we have found further property of photoresist that does not need post exposure bake (PEB) process. This resist has a great advantage at most of current panel plants without PEB process.

High-Si content BARC for dual-BARC systems such as trilayer patterning

NASA Astrophysics Data System (ADS)

Kennedy, Joseph; Xie, Song-Yuan; Wu, Ze-Yu; Katsanes, Ron; Flanigan, Kyle; Lee, Kevin; Slezak, Mark; Liu, Zhi; Lin, Shang-Ho

2009-03-01

This work discusses the requirements and performance of Honeywell's middle layer material, UVAS, for tri-layer patterning. UVAS is a high Si content polymer synthesized directly from Si containing starting monomer components. The monomers are selected to produce a film that meets the requirements as a middle layer for tri-layer patterning (TLP) and gives us a level of flexibility to adjust the properties of the film to meet the customer's specific photoresist and patterning requirements. Results of simulations of the substrate reflectance versus numerical aperture, UVAS thickness, and under layer film are presented. ArF photoresist line profiles and process latitude versus UVAS bake at temperatures as low as 150ºC are presented and discussed. Immersion lithographic patterning of ArF photoresist line space and contact hole features will be presented. A sequence of SEM images detailing the plasma etch transfer of line space photoresist features through the middle and under layer films comprising the TLP film stack will be presented. Excellent etch selectivity between the UVAS and the organic under layer film exists as no edge erosion or faceting is observed as a result of the etch process. A detailed study of the impact of a PGMEA solvent photoresist rework process on the lithographic process window of a TLP film stack was performed with the results indicating that no degradation to the UVAS film occurs.

Micropatterning of poly(dimethylsiloxane) using a photoresist lift-off technique for selective electrical insulation of microelectrode arrays

PubMed Central

Park, Jaewon; Kim, Hyun Soo; Han, Arum

2009-01-01

A poly(dimethylsiloxane) (PDMS) patterning method based on a photoresist lift-off technique to make an electrical insulation layer with selective openings is presented. The method enables creating PDMS patterns with small features and various thicknesses without any limitation in the designs and without the need for complicated processes or expensive equipments. Patterned PDMS layers were created by spin-coating liquid phase PDMS on top of a substrate having sacrificial photoresist patterns, followed by a photoresist lift-off process. The thickness of the patterned PDMS layers could be accurately controlled (6.5–24 µm) by adjusting processing parameters such as PDMS spin-coating speeds, PDMS dilution ratios, and sacrificial photoresist thicknesses. PDMS features as small as 15 µm were successfully patterned and the effects of each processing parameter on the final patterns were investigated. Electrical resistance tests between adjacent electrodes with and without the insulation layer showed that the patterned PDMS layer functions properly as an electrical insulation layer. Biocompatibility of the patterned PDMS layer was confirmed by culturing primary neuron cells on top of the layer for up to two weeks. An extensive neuronal network was successfully formed, showing that this PDMS patterning method can be applied to various biosensing microdevices. The utility of this fabrication method was further demonstrated by successfully creating a patterned electrical insulation layer on flexible substrates containing multi-electrode arrays. PMID:19946385

An improved method for characterizing photoresist lithographic and defectivity performance for sub-20nm node lithography

NASA Astrophysics Data System (ADS)

Amblard, Gilles; Purdy, Sara; Cooper, Ryan; Hockaday, Marjory

2016-03-01

The overall quality and processing capability of lithographic materials are critical for ensuring high device yield and performance at sub-20nm technology nodes in a high volume manufacturing environment. Insufficient process margin and high line width roughness (LWR) cause poor manufacturing control, while high defectivity causes product failures. In this paper, we focus on the most critical layer of a sub-20nm technology node LSI device, and present an improved method for characterizing both lithographic and post-patterning defectivity performance of state-of-the-art immersion photoresists. Multiple formulations from different suppliers were used and compared. Photoresists were tested under various process conditions, and multiple lithographic metrics were investigated (depth of focus, exposure dose latitude, line width roughness, etc.). Results were analyzed and combined using an innovative approach based on advanced software, providing clearer results than previously available. This increased detail enables more accurate performance comparisons among the different photoresists. Post-patterning defectivity was also quantified, with defects reviewed and classified using state-of-the-art inspection tools. Correlations were established between the lithographic and post-patterning defectivity performances for each material, and overall ranking was established among the photoresists, enabling the selection of the best performer for implementation in a high volume manufacturing environment.

Graphitization in Carbon MEMS and Carbon NEMS

NASA Astrophysics Data System (ADS)

Sharma, Swati

Carbon MEMS (CMEMS) and Carbon NEMS (CNEMS) are an emerging class of miniaturized devices. Due to the numerous advantages such as scalable manufacturing processes, inexpensive and readily available precursor polymer materials, tunable surface properties and biocompatibility, carbon has become a preferred material for a wide variety of future sensing applications. Single suspended carbon nanowires (CNWs) integrated on CMEMS structures fabricated by electrospinning of SU8 photoresist on photolithographially patterned SU8 followed by pyrolysis are utilized for understanding the graphitization process in micro and nano carbon materials. These monolithic CNW-CMEMS structures enable the fabrication of very high aspect ratio CNWs of predefined length. The CNWs thus fabricated display core---shell structures having a graphitic shell with a glassy carbon core. The electrical conductivity of these CNWs is increased by about 100% compared to glassy carbon as a result of enhanced graphitization. We explore various tunable fabrication and pyrolysis parameters to improve graphitization in the resulting CNWs. We also suggest gas-sensing application of the thus fabricated single suspended CNW-CMEMS devices by using the CNW as a nano-hotplate for local chemical vapor deposition. In this thesis we also report on results from an optimization study of SU8 photoresist derived carbon electrodes. These electrodes were applied to the simultaneous detection of traces of Cd(II) and Pb(II) through anodic stripping voltammetry and detection limits as low as 0.7 and 0.8 microgL-1 were achieved. To further improve upon the electrochemical behavior of the carbon electrodes we elucidate a modified pyrolysis technique featuring an ultra-fast temperature ramp for obtaining bubbled porous carbon from lithographically patterned SU8. We conclude this dissertation by suggesting the possible future works on enhancing graphitization as well as on electrochemical applications

Method of fabricating a high aspect ratio microstructure

DOEpatents

Warren, John B.

2003-05-06

The present invention is for a method of fabricating a high aspect ratio, freestanding microstructure. The fabrication method modifies the exposure process for SU-8, an negative-acting, ultraviolet-sensitive photoresist used for microfabrication whereby a UV-absorbent glass substrate, chosen for complete absorption of UV radiation at 380 nanometers or less, is coated with a negative photoresist, exposed and developed according to standard practice. This UV absorbent glass enables the fabrication of cylindrical cavities in a negative photoresist microstructures that have aspect ratios of 8:1.

Quantitative approach for optimizing e-beam condition of photoresist inspection and measurement

NASA Astrophysics Data System (ADS)

Lin, Chia-Jen; Teng, Chia-Hao; Cheng, Po-Chung; Sato, Yoshishige; Huang, Shang-Chieh; Chen, Chu-En; Maruyama, Kotaro; Yamazaki, Yuichiro

2018-03-01

Severe process margin in advanced technology node of semiconductor device is controlled by e-beam metrology system and e-beam inspection system with scanning electron microscopy (SEM) image. By using SEM, larger area image with higher image quality is required to collect massive amount of data for metrology and to detect defect in a large area for inspection. Although photoresist is the one of the critical process in semiconductor device manufacturing, observing photoresist pattern by SEM image is crucial and troublesome especially in the case of large image. The charging effect by e-beam irradiation on photoresist pattern causes deterioration of image quality, and it affect CD variation on metrology system and causes difficulties to continue defect inspection in a long time for a large area. In this study, we established a quantitative approach for optimizing e-beam condition with "Die to Database" algorithm of NGR3500 on photoresist pattern to minimize charging effect. And we enhanced the performance of measurement and inspection on photoresist pattern by using optimized e-beam condition. NGR3500 is the geometry verification system based on "Die to Database" algorithm which compares SEM image with design data [1]. By comparing SEM image and design data, key performance indicator (KPI) of SEM image such as "Sharpness", "S/N", "Gray level variation in FOV", "Image shift" can be retrieved. These KPIs were analyzed with different e-beam conditions which consist of "Landing Energy", "Probe Current", "Scanning Speed" and "Scanning Method", and the best e-beam condition could be achieved with maximum image quality, maximum scanning speed and minimum image shift. On this quantitative approach of optimizing e-beam condition, we could observe dependency of SEM condition on photoresist charging. By using optimized e-beam condition, measurement could be continued on photoresist pattern over 24 hours stably. KPIs of SEM image proved image quality during measurement and inspection was stabled enough.

Taguchi Method Applied in Optimization of Shipley SJR 5740 Positive Resist Deposition

NASA Technical Reports Server (NTRS)

Hui, A.; Blosiu, J. O.; Wiberg, D. V.

1998-01-01

Taguchi Methods of Robust Design presents a way to optimize output process performance through an organized set of experiments by using orthogonal arrays. Analysis of variance and signal-to-noise ratio is used to evaluate the contribution of each of the process controllable parameters in the realization of the process optimization. In the photoresist deposition process, there are numerous controllable parameters that can affect the surface quality and thickness of the final photoresist layer.

Defect printability for high-exposure dose advanced packaging applications

NASA Astrophysics Data System (ADS)

Mikles, Max; Flack, Warren; Nguyen, Ha-Ai; Schurz, Dan

2003-12-01

Pellicles are used in semiconductor lithography to minimize printable defects and reduce reticle cleaning frequency. However, there are a growing number of microlithography applications, such as advanced packaging and nanotechnology, where it is not clear that pellicles always offer a significant benefit. These applications have relatively large critical dimensions and require ultra thick photoresists with extremely high exposure doses. Given that the lithography is performed in Class 100 cleanroom conditions, it is possible that the risk of defects from contamination is sufficiently low that pellicles would not be required on certain process layer reticles. The elimination of the pellicle requirement would provide a cost reduction by saving the original pellicle cost and eliminating future pellicle replacement and repair costs. This study examines the imaging potential of defects with reticle patterns and processes typical for gold-bump and solder-bump advanced packaging lithography. The test reticle consists of 30 to 90 μm octagonal contact patterns representative of advanced packaging reticles. Programmed defects are added that represent the range of particle sizes (3 to 30 μm) normally protected by the pellicle and that are typical of advanced packaging lithography cleanrooms. The reticle is exposed using an Ultratech Saturn Spectrum 300e2 1X stepper on wafers coated with a variety of ultra thick (30 to 100 μm) positive and negative-acting photoresists commonly used in advanced packaging. The experimental results show that in many cases smaller particles continue to be yield issues for the feature size and density typical of advanced packaging processes. For the two negative photoresists studied it appears that a pellicle is not required for protection from defects smaller than 10 to 15 μm depending on the photoresist thickness. Thus the decision on pellicle usage for these materials would need to be made based on the device fabrication process and the cleanliness of a fabrication facility. For the two positive photoresists studied it appears that a pellicle is required to protect from defects down to 3 μm defects depending on the photoresist thickness. This suggests that a pellicle should always be used for these materials. Since a typical fabrication facility would use both positive and negative photoresists it may be advantageous to use pellicles on all reticles simply to avoid confusion. The cost savings of not using a pellicle could easily be outweighed by the yield benefits of using one.

Nanoparticle photoresist studies for EUV lithography

NASA Astrophysics Data System (ADS)

Kasahara, Kazuki; Xu, Hong; Kosma, Vasiliki; Odent, Jeremy; Giannelis, Emmanuel P.; Ober, Christopher K.

2017-03-01

EUV (extreme ultraviolet) lithography is one of the most promising candidates for next generation lithography. The main challenge for EUV resists is to simultaneously satisfy resolution, LWR (line-width roughness) and sensitivity requirements according to the ITRS roadmap. Though polymer type CAR (chemically amplified resist) is the currently standard photoresist, entirely new resist platforms are required due to the performance targets of smaller process nodes. In this paper, recent progress in nanoparticle photoresists which Cornell University has intensely studied is discussed. Lithography performance, especially scum elimination, improvement studies with the dissolution rate acceleration concept and new metal core applications are described.

CROSS-DISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY: Bilayer Photoresist Insulator for High Performance Organic Thin-Film Transistors on Plastic Films

NASA Astrophysics Data System (ADS)

Wang, He; Li, Chun-Hong; Pan, Feng; Wang, Hai-Bo; Yan, Dong-Hang

2009-11-01

A novel bilayer photoresist insulator is applied in flexible vanadyl-phthalocyanine (VOPc) organic thin-film transistors (OTFTs). The micron-size patterns of this photoresisit insulator can be directly defined only by photolithography without the etching process. Furthermore, these OTFTs exhibit high field-effect mobility (about 0.8 cm2/Vs) and current on/off ratio (about 106). In particular, they show rather low hysteresis (< 1 V). The results demonstrate that this bilayer photoresist insulator can be applied in large-area electronics and in the facilitation of patterning insulators.

On-line photolithography modeling using spectrophotometry and Prolith/2

NASA Astrophysics Data System (ADS)

Engstrom, Herbert L.; Beacham, Jeanne E.

1994-05-01

Spectrophotometry has been applied to optimizing photolithography processes in semiconductor manufacturing. For many years thin film measurement systems have been used in manufacturing for controlling film deposition processes. The combination of film thickness mapping with photolithography modeling has expanded the applications of this technology. Experimental measurements of dose-to-clear, the minimum light exposure dose required to fully develop a photoresist, are described. It is shown how dose-to-clear and photoresist contrast may be determined rapidly and conveniently from measurements of a dose exposure matrix on a monitor wafer. Such experimental measurements may underestimate the dose-to- clear because of thickness variations of the photoresist and underlying layers on the product wafer. Online modeling of the photolithographic process together with film thickness maps of the entire wafer can overcome this problem. Such modeling also provides maps of dose-to- clear and resist linewidth that can be used to estimate and optimize yield.

Lift-off process with bi-layer photoresist patterns for conformal-coated superhydrophilic pulsed plasma chemical vapor deposition-SiOx on SiCx for lab-on-a-chip applications

NASA Astrophysics Data System (ADS)

Konishi, Satoshi; Nakagami, Chise; Kobayashi, Taizo; Tonomura, Wataru; Kaizuma, Yoshihiro

2015-04-01

In this work, a lift-off process with bi-layer photoresist patterns was applied to the formation of hydrophobic/hydrophilic micropatterns on practical polymer substrates used in healthcare diagnostic commercial products. The bi-layer photoresist patterns with undercut structures made it possible to peel the conformal-coated silicon oxide (SiOx) films from substrates. SiOx and silicon carbide (SiCx) layers were deposited by pulsed plasma chemical vapor deposition (PPCVD) method which can form roughened surfaces to enhance hydrophilicity of SiOx and hydrophobicity of SiCx. Microfluidic applications using hydrophobic/hydrophilic patterns were also demonstrated on low-cost substrates such as poly(ethylene terephthalate) (PET) and paper films.

Silicon Micromachined Microlens Array for THz Antennas

NASA Technical Reports Server (NTRS)

Lee, Choonsup; Chattopadhyay, Goutam; Mehdi, IImran; Gill, John J.; Jung-Kubiak, Cecile D.; Llombart, Nuria

2013-01-01

5 5 silicon microlens array was developed using a silicon micromachining technique for a silicon-based THz antenna array. The feature of the silicon micromachining technique enables one to microfabricate an unlimited number of microlens arrays at one time with good uniformity on a silicon wafer. This technique will resolve one of the key issues in building a THz camera, which is to integrate antennas in a detector array. The conventional approach of building single-pixel receivers and stacking them to form a multi-pixel receiver is not suited at THz because a single-pixel receiver already has difficulty fitting into mass, volume, and power budgets, especially in space applications. In this proposed technique, one has controllability on both diameter and curvature of a silicon microlens. First of all, the diameter of microlens depends on how thick photoresist one could coat and pattern. So far, the diameter of a 6- mm photoresist microlens with 400 m in height has been successfully microfabricated. Based on current researchers experiences, a diameter larger than 1-cm photoresist microlens array would be feasible. In order to control the curvature of the microlens, the following process variables could be used: 1. Amount of photoresist: It determines the curvature of the photoresist microlens. Since the photoresist lens is transferred onto the silicon substrate, it will directly control the curvature of the silicon microlens. 2. Etching selectivity between photoresist and silicon: The photoresist microlens is formed by thermal reflow. In order to transfer the exact photoresist curvature onto silicon, there needs to be etching selectivity of 1:1 between silicon and photoresist. However, by varying the etching selectivity, one could control the curvature of the silicon microlens. The figure shows the microfabricated silicon microlens 5 x5 array. The diameter of the microlens located in the center is about 2.5 mm. The measured 3-D profile of the microlens surface has a smooth curvature. The measured height of the silicon microlens is about 280 microns. In this case, the original height of the photoresist was 210 microns. The change was due to the etching selectivity of 1.33 between photoresist and silicon. The measured surface roughness of the silicon microlens shows the peak-to-peak surface roughness of less than 0.5 microns, which is adequate in THz frequency. For example, the surface roughness should be less than 7 microns at 600 GHz range. The SEM (scanning electron microscope) image of the microlens confirms the smooth surface. The beam pattern at 550 GHz shows good directivity.

Microoptical System And Fabrication Method Therefor

DOEpatents

Sweatt, William C.; Christenson, Todd R.

2005-03-15

Microoptical systems with clear aperture of about one millimeter or less are fabricated from a layer of photoresist using a lithographic process to define the optical elements. A deep X-ray source is typically used to expose the photoresist. Exposure and development of the photoresist layer can produce planar, cylindrical, and radially symmetric micro-scale optical elements, comprising lenses, mirrors, apertures, diffractive elements, and prisms, monolithically formed on a common substrate with the mutual optical alignment required to provide the desired system functionality. Optical alignment can be controlled to better than one micron accuracy. Appropriate combinations of structure and materials enable optical designs that include corrections for chromatic and other optical aberrations. The developed photoresist can be used as the basis for a molding operation to produce microoptical systems made of a range of optical materials. Finally, very complex microoptical systems can be made with as few as three lithographic exposures.

Microoptical system and fabrication method therefor

DOEpatents

Sweatt, William C.; Christenson, Todd R.

2003-07-08

Microoptical systems with clear aperture of about one millimeter or less are fabricated from a layer of photoresist using a lithographic process to define the optical elements. A deep X-ray source is typically used to expose the photoresist. Exposure and development of the photoresist layer can produce planar, cylindrical, and radially symmetric micro-scale optical elements, comprising lenses, mirrors, apertures, diffractive elements, and prisms, monolithically formed on a common substrate with the mutual optical alignment required to provide the desired system functionality. Optical alignment can be controlled to better than one micron accuracy. Appropriate combinations of structure and materials enable optical designs that include corrections for chromatic and other optical aberrations. The developed photoresist can be used as the basis for a molding operation to produce microoptical systems made of a range of optical materials. Finally, very complex microoptical systems can be made with as few as three lithographic exposures.

Precuring implant photoresists for shrink and patterning control

NASA Astrophysics Data System (ADS)

Winroth, Gustaf; Rosseel, Erik; Delvaux, Christie; Sanchez, Efrain Altamirano; Ercken, Monique

2013-10-01

193-nm compatible photoresists are turning out to be the new platform for implant lithography, due to the increasing requirements in both resolution and overlay. Shrinkage of such resists is becoming progressively the most topical issue for aggressive nodes, where conventional pretreatments from older resist platforms, such as ultraviolet flood exposures, are not directly transferable to (meth-)acrylate-type resists. The precuring options available for state-of-the-art implant photoresists for 193-nm lithography is explored, in which we target to reduce the shrinkage during implantation for trenching critical dimensions (CDs) that are relevant for nodes <20 nm. An extensive study comprising different approaches, including laser-, ion-, and electron-based treatments, is presented. Each treatment is individually investigated with the aim to find not only a valid pretreatment for shrinkage control during implantation, but also to understand what effect alternative pretreatments have on the morphology and the CDs of thick photoresists used as implant stopping layers. Viable options for further process optimization in order to integrate them into device process flows are found. To this extent, the shrink behavior after pretreatment is shown, and the additional shrink dynamics after implantation are compared.

Multi-Functional, Micro Electromechanical Silicon Carbide Accelerometer

NASA Technical Reports Server (NTRS)

Okojie, Robert S. (Inventor)

2004-01-01

A method of bulk manufacturing SiC sensors is disclosed and claimed. Materials other than SiC may be used as the substrate material. Sensors requiring that the SiC substrate be pierced are also disclosed and claimed. A process flow reversal is employed whereby the metallization is applied first before the recesses are etched into or through the wafer. Aluminum is deposited on the entire planar surface of the metallization. Photoresist is spun onto the substantially planar surface of the Aluminum which is subsequently masked (and developed and removed). Unwanted Aluminum is etched with aqueous TMAH and subsequently the metallization is dry etched. Photoresist is spun onto the still substantially planar surface of Aluminum and oxide and then masked (and developed and removed) leaving the unimidized photoresist behind. Next, ITO is applied over the still substantially planar surface of Aluminum, oxide and unimidized photoresist. Unimidized and exposed photoresist and ITO directly above it are removed with Acetone. Next, deep reactive ion etching attacks exposed oxide not protected by ITO. Finally, hot phosphoric acid removes the Al and ITO enabling wires to connect with the metallization. The back side of the SiS wafer may be also etched.

Multi-functional micro electromechanical devices and method of bulk manufacturing same

NASA Technical Reports Server (NTRS)

Okojie, Robert S. (Inventor)

2004-01-01

A method of bulk manufacturing SiC sensors is disclosed and claimed. Materials other than SiC may be used as the substrate material. Sensors requiring that the SiC substrate be pierced are also disclosed and claimed. A process flow reversal is employed whereby the metallization is applied first before the recesses are etched into or through the wafer. Aluminum is deposited on the entire planar surface of the metallization. Photoresist is spun onto the substantially planar surface of the Aluminum which is subsequently masked (and developed and removed). Unwanted Aluminum is etched with aqueous TMAH and subsequently the metallization is dry etched. Photoresist is spun onto the still substantially planar surface of Aluminum and oxide and then masked (and developed and removed) leaving the unimidized photoresist behind. Next, ITO is applied over the still substantially planar surface of Aluminum, oxide and unimidized photoresist. Unimidized and exposed photoresist and ITO directly above it are removed with Acetone. Next, deep reactive ion etching attacks exposed oxide not protected by ITO. Finally, hot phosphoric acid removes the Al and ITO enabling wires to connect with the metallization. The back side of the SiC wafer may be also be etched.

Biorecognition by DNA oligonucleotides after Exposure to Photoresists and Resist Removers

PubMed Central

Dean, Stacey L.; Morrow, Thomas J.; Patrick, Sue; Li, Mingwei; Clawson, Gary; Mayer, Theresa S.; Keating, Christine D.

2013-01-01

Combining biological molecules with integrated circuit technology is of considerable interest for next generation sensors and biomedical devices. Current lithographic microfabrication methods, however, were developed for compatibility with silicon technology rather than bioorganic molecules and consequently it cannot be assumed that biomolecules will remain attached and intact during on-chip processing. Here, we evaluate the effects of three common photoresists (Microposit S1800 series, PMGI SF6, and Megaposit SPR 3012) and two photoresist removers (acetone and 1165 remover) on the ability of surface-immobilized DNA oligonucleotides to selectively recognize their reverse-complementary sequence. Two common DNA immobilization methods were compared: adsorption of 5′-thiolated sequences directly to gold nanowires and covalent attachment of 5′-thiolated sequences to surface amines on silica coated nanowires. We found that acetone had deleterious effects on selective hybridization as compared to 1165 remover, presumably due to incomplete resist removal. Use of the PMGI photoresist, which involves a high temperature bake step, was detrimental to the later performance of nanowire-bound DNA in hybridization assays, especially for DNA attached via thiol adsorption. The other three photoresists did not substantially degrade DNA binding capacity or selectivity for complementary DNA sequences. To determine if the lithographic steps caused more subtle damage, we also tested oligonucleotides containing a single base mismatch. Finally, a two-step photolithographic process was developed and used in combination with dielectrophoretic nanowire assembly to produce an array of doubly-contacted, electrically isolated individual nanowire components on a chip. Post-fabrication fluorescence imaging indicated that nanowire-bound DNA was present and able to selectively bind complementary strands. PMID:23952639

Supercritical fluid processing: a new dry technique for photoresist developing

NASA Astrophysics Data System (ADS)

Gallagher-Wetmore, Paula M.; Wallraff, Gregory M.; Allen, Robert D.

1995-06-01

Supercritical fluid (SCF) technology is investigated as a dry technique for photoresist developing. Because of their unique combination of gaseous and liquid-like properties, these fluids offer comparative or improved efficiencies over liquid developers and, particularly carbon dioxide, would have tremendous beneficial impact on the environment and on worker safety. Additionally, SCF technology offers the potential for processing advanced resist systems which are currently under investigation as well as those that may have been abandoned due to problems associated with conventional developers. An investigation of various negative and positive photoresist systems is ongoing. Initially, supercritical carbon dioxide (SC CO2) as a developer for polysilane resists was explored because the exposure products, polysiloxanes, are generally soluble in this fluid. These initial studies demonstrated the viability of the SCF technique with both single layer and bilayer systems. Subsequently, the investigation focused on using SC CO2 to produce negative images with polymers that would typically be considered positive resists. Polymers such as styrenes and methacrylates were chemically modified by fluorination and/or copolymerization to render them soluble in SC CO2. Siloxane copolymers and siloxane-modified methacrylates were examined as well. The preliminary findings reported here indicate the feasibility of using SC CO2 for photoresist developing.

Process for the Production of Star Tracklng [Tracking] Reticles

NASA Technical Reports Server (NTRS)

Smith, Wade O. (Inventor); Toft, Albert R. (Inventor)

1972-01-01

A method for the production of reticles, particularly those for use in outer space, wherein the product is a quartz base coated with highly adherent layers of chromium, chromium-silver, and silver vacuum deposited through a mask, and then coated with an electrodeposit of copper from a copper sulfate solution followed by an electrodeposit of black chromium. The masks are produced by coating a beryllium-copper alloy substrate with a positive working photoresist, developing the photoresist according to a pattern to leave a positive mask, plating uncoated areas with gold, removing the photoresist, coating the substrate with a negative working photoresist, developing the negative working photoresist to expose the base metal of the pattern, and chemically etching the unplated side of the pattern to produce the mask. The mask produced is then used in the vacuum deposition of: (1) chromium metal on the surface of a quartz base to obtain a highly adherent quartz-chromium interface; (2) silver on the chromium deposit, during the final stage of chromium deposit, to produce a silver chromium alloy layer; and (3) silver onto the surface of the alloy layer. The coated quartz base is then coated by electroplating utilizing an acid copper deposit followed by a black chromium electrodeposit to produce the product of the present invention.

Design and fabrication of a diffractive beam splitter for dual-wavelength and concurrent irradiation of process points.

PubMed

Amako, Jun; Shinozaki, Yu

2016-07-11

We report on a dual-wavelength diffractive beam splitter designed for use in parallel laser processing. This novel optical element generates two beam arrays of different wavelengths and allows their overlap at the process points on a workpiece. To design the deep surface-relief profile of a splitter using a simulated annealing algorithm, we introduce a heuristic but practical scheme to determine the maximum depth and the number of quantization levels. The designed corrugations were fabricated in a photoresist by maskless grayscale exposure using a high-resolution spatial light modulator. We characterized the photoresist splitter, thereby validating the proposed beam-splitting concept.

Thick resist for MEMS processing

NASA Astrophysics Data System (ADS)

Brown, Joe; Hamel, Clifford

2001-11-01

The need for technical innovation is always present in today's economy. Microfabrication methods have evolved in support of the demand for smaller and faster integrated circuits with price performance improvements always in the scope of the manufacturing design engineer. The dispersion of processing technology spans well beyond IC fabrication today with batch fabrication and wafer scale processing lending advantages to MEMES applications from biotechnology to consumer electronics from oil exploration to aerospace. Today the demand for innovative processing techniques that enable technology is apparent where only a few years ago appeared too costly or not reliable. In high volume applications where yield and cost improvements are measured in fractions of a percent it is imperative to have process technologies that produce consistent results. Only a few years ago thick resist coatings were limited to thickness less than 20 microns. Factors such as uniformity, edge bead and multiple coatings made high volume production impossible. New developments in photoresist formulation combined with advanced coating equipment techniques that closely controls process parameters have enable thick photoresist coatings of 70 microns with acceptable uniformity and edge bead in one pass. Packaging of microelectronic and micromechanical devices is often a significant cost factor and a reliability issue for high volume low cost production. Technologies such as flip- chip assembly provide a solution for cost and reliability improvements over wire bond techniques. The processing for such technology demands dimensional control and presents a significant cost savings if it were compatible with mainstream technologies. Thick photoresist layers, with good sidewall control would allow wafer-bumping technologies to penetrate the barriers to yield and production where costs for technology are the overriding issue. Single pass processing is paramount to the manufacturability of packaging technology. Uniformity and edge bead control defined the success of process implementation. Today advanced packaging solutions are created with thick photoresist coatings. The techniques and results will be presented.

Use of direct washing of chemical dispense nozzle for defect control

NASA Astrophysics Data System (ADS)

Linnane, Michael; Mack, George; Longstaff, Christopher; Winter, Thomas

2006-03-01

Demands for continued defect reduction in 300mm IC manufacturing are driving process engineers to examine all aspects of the chemical apply process for improvement. Historically, the defect contribution from photoresist apply nozzles has been minimized through a carefully controlled process of "dummy dispenses" to keep the photoresist in the tip "fresh" and remove any solidified material, a preventive maintenance regime involving periodic cleaning or replacing of the nozzles, and reliance on a pool of solvent within the nozzle storage block to keep the photoresist from solidifying at the nozzle tip. The industry standard has worked well for the most part but has limitations in terms of cost effectiveness and absolute defect elimination. In this study, we investigate the direct washing of the chemical apply nozzle to reduce defects seen on the coated wafer. Data is presented on how the direct washing of the chemical dispense nozzle can be used to reduce coating related defects, reduce material costs from the reduction of "dummy dispense", and can reduce equipment downtime related to nozzle cleaning or replacement.

Factors affecting degradation of dimethyl sulfoxide (DMSO) by fluidized-bed Fenton process.

PubMed

Bellotindos, Luzvisminda M; Lu, Meng-Hsuan; Methatham, Thanakorn; Lu, Ming-Chun

2014-12-01

In this study, the target compound is dimethyl sulfoxide (DMSO), which is used as a photoresist stripping solvent in the semiconductor and thin-film transistor liquid crystal display (TFT-LCD) manufacturing processes. The effects of the operating parameters (pH, Fe(2+) and H2O2 concentrations) on the degradation of DMSO in the fluidized-bed Fenton process were examined. This study used the Box-Behnken design (BBD) to investigate the optimum conditions of DMSO degradation. The highest DMSO removal was 98 % for pH 3, when the H2O2 to Fe(2+) molar ratio was 12. At pH 2 and 4, the highest DMSO removal was 82 %, when the H2O2 to Fe(2+) molar ratio was 6.5. The correlation of DMSO removal showed that the effect of the parameters on DMSO removal followed the order Fe(2+) > H2O2 > pH. From the BBD prediction, the optimum conditions were pH 3, 5 mM of Fe(2+), and 60 mM of H2O2. The difference between the experimental value (98 %) and the predicted value (96 %) was not significant. The removal efficiencies of DMSO, chemical oxygen demand (COD), total organic carbon (TOC), and iron in the fluidized-bed Fenton process were higher than those in the traditional Fenton process.

Modeling Thermal Effects for Simulation of Post Exposure Baking (PEB) Process in Positive Photoresist

NASA Astrophysics Data System (ADS)

Asai, Satoru; Hanyu, Isamu; Nunokawa, Mitsuji; Abe, Masayuki

1991-03-01

We studied the thermal effects in a positive photoresist during post exposure baking (PEB). Infrared analysis and the reduced dissolution rate in the exposed resist suggest that the carboxylic acid is decreased and/or that ECA solvent evaporates. In order to simulate the effects, we assume that the concentration of the alkali-soluble material (carboxylic acid) decreases equivalently. Our model explains PEB and enables its effects to be simulated.

Computational approach on PEB process in EUV resist: multi-scale simulation

NASA Astrophysics Data System (ADS)

Kim, Muyoung; Moon, Junghwan; Choi, Joonmyung; Lee, Byunghoon; Jeong, Changyoung; Kim, Heebom; Cho, Maenghyo

2017-03-01

For decades, downsizing has been a key issue for high performance and low cost of semiconductor, and extreme ultraviolet lithography is one of the promising candidates to achieve the goal. As a predominant process in extreme ultraviolet lithography on determining resolution and sensitivity, post exposure bake has been mainly studied by experimental groups, but development of its photoresist is at the breaking point because of the lack of unveiled mechanism during the process. Herein, we provide theoretical approach to investigate underlying mechanism on the post exposure bake process in chemically amplified resist, and it covers three important reactions during the process: acid generation by photo-acid generator dissociation, acid diffusion, and deprotection. Density functional theory calculation (quantum mechanical simulation) was conducted to quantitatively predict activation energy and probability of the chemical reactions, and they were applied to molecular dynamics simulation for constructing reliable computational model. Then, overall chemical reactions were simulated in the molecular dynamics unit cell, and final configuration of the photoresist was used to predict the line edge roughness. The presented multiscale model unifies the phenomena of both quantum and atomic scales during the post exposure bake process, and it will be helpful to understand critical factors affecting the performance of the resulting photoresist and design the next-generation material.

Solubility studies of inorganic-organic hybrid nanoparticle photoresists with different surface functional groups

NASA Astrophysics Data System (ADS)

Li, Li; Chakrabarty, Souvik; Jiang, Jing; Zhang, Ben; Ober, Christopher; Giannelis, Emmanuel P.

2016-01-01

The solubility behavior of Hf and Zr based hybrid nanoparticles with different surface ligands in different concentrations of photoacid generator as potential EUV photoresists was investigated in detail. The nanoparticles regardless of core or ligand chemistry have a hydrodynamic diameter of 2-3 nm and a very narrow size distribution in organic solvents. The Hansen solubility parameters for nanoparticles functionalized with IBA and 2MBA have the highest contribution from the dispersion interaction than those with tDMA and MAA, which show more polar character. The nanoparticles functionalized with unsaturated surface ligands showed more apparent solubility changes after exposure to DUV than those with saturated ones. The solubility differences after exposure are more pronounced for films containing a higher amount of photoacid generator. The work reported here provides material selection criteria and processing strategies for the design of high performance EUV photoresists.The solubility behavior of Hf and Zr based hybrid nanoparticles with different surface ligands in different concentrations of photoacid generator as potential EUV photoresists was investigated in detail. The nanoparticles regardless of core or ligand chemistry have a hydrodynamic diameter of 2-3 nm and a very narrow size distribution in organic solvents. The Hansen solubility parameters for nanoparticles functionalized with IBA and 2MBA have the highest contribution from the dispersion interaction than those with tDMA and MAA, which show more polar character. The nanoparticles functionalized with unsaturated surface ligands showed more apparent solubility changes after exposure to DUV than those with saturated ones. The solubility differences after exposure are more pronounced for films containing a higher amount of photoacid generator. The work reported here provides material selection criteria and processing strategies for the design of high performance EUV photoresists. Electronic supplementary information (ESI) available. See DOI: 10.1039/c5nr07334k

High-volume manufacturing compatible dry development rinse process (DDRP): patterning and defectivity performance for EUVL

NASA Astrophysics Data System (ADS)

Sayan, Safak; Vanelderen, Pieter; Hetel, Iulian; Chan, BT; Raghavan, Praveen; Blanco, Victor; Foubert, Philippe; D'urzo, Lucia; De Simone, Danilo; Vandenberghe, Geert

2017-04-01

There are many knobs available that change the chemical and physical properties of the photoresists to "break" the RLS (Resolution, Sensitivity, Line edge/width roughness) trade-off, however those are not enough today to realize a material to satisfy all requirements at once for 7nm technology and beyond. DDRP improves the ultimate achievable resolution via pattern collapse mitigation, hence the priority of requirements for the EUV photoresist development may be changed with more focus on Sensitivity and LWR. This may potentially provide a new conceptual approach towards EUV PR development for DDRP applications. We have previously demonstrated pattern collapse (PC) mitigation via DDRP on different EUVL photoresists (including different resist platforms), achieving ultimate resolution and exposure latitude improvements [1,2]. In this contribution, we report patterning and material defect performance of HVM compatible (all aqueous) dry development rinse material. We will also report on process window improvement on 2-dimensional metal structures towards standard cell size reduction with elimination of mask layer(s) using single EUV exposure.

Method and apparatus for micromachining using hard X-rays

DOEpatents

Siddons, D.P.; Johnson, E.D.; Guckel, H.; Klein, J.L.

1997-10-21

An X-ray source such as a synchrotron which provides a significant spectral content of hard X-rays is used to expose relatively thick photoresist such that the portions of the photoresist at an exit surface receive at least a threshold dose sufficient to render the photoresist susceptible to a developer, while the entrance surface of the photoresist receives an exposure which does not exceed a power limit at which destructive disruption of the photoresist would occur. The X-ray beam is spectrally shaped to substantially eliminate lower energy photons while allowing a substantial flux of higher energy photons to pass through to the photoresist target. Filters and the substrate of the X-ray mask may be used to spectrally shape the X-ray beam. Machining of photoresists such as polymethylmethacrylate to micron tolerances may be obtained to depths of several centimeters, and multiple targets may be exposed simultaneously. The photoresist target may be rotated and/or translated in the beam to form solids of rotation and other complex three-dimensional structures. 21 figs.

Method and apparatus for micromachining using hard X-rays

DOEpatents

Siddons, David Peter; Johnson, Erik D.; Guckel, Henry; Klein, Jonathan L.

1997-10-21

An X-ray source such as a synchrotron which provides a significant spectral content of hard X-rays is used to expose relatively thick photoresist such that the portions of the photoresist at an exit surface receive at least a threshold dose sufficient to render the photoresist susceptible to a developer, while the entrance surface of the photoresist receives an exposure which does not exceed a power limit at which destructive disruption of the photoresist would occur. The X-ray beam is spectrally shaped to substantially eliminate lower energy photons while allowing a substantial flux of higher energy photons to pass through to the photoresist target. Filters and the substrate of the X-ray mask may be used to spectrally shape the X-ray beam. Machining of photoresists such as polymethylmethacrylate to micron tolerances may be obtained to depths of several centimeters, and multiple targets may be exposed simultaneously. The photoresist target may be rotated and/or translated in the beam to form solids of rotation and other complex three-dimensional structures.

Faster sensitivity and non-antimonite permanent photoresist for MEMS

NASA Astrophysics Data System (ADS)

Misumi, Koichi; Saito, Koji; Yamanouchi, Atsushi; Senzaki, Takahiro; Okui, Toshiki; Honma, Hideo

2006-03-01

Micro Electro Mechanical Systems (MEMS) is a three-dimensional micro-fabrication technology based on photolithography. The fields of application are extensive and wide-ranging. Among the applications, those that have already acquired a large market include acceleration sensors for airbags of automobiles, pressure sensors for engine control, inkjet printer heads and thin film magnetic heads. The market is expected to further expand in the optic and biology-related fields in the future. In the MEMS field, the packaging accounts for the cost, and it is difficult to standardize due to the low production volume of highly specific technology application. A typical application in the MEMS process would be to conduct plating and etching (Deep RIE) through an intermediate layer of photoresist patterns, but there are cases where the photoresist itself is left therein as a permanent film. A photoresist composed of epoxy resin as the main component can form the permanent film through a catalyst of the optical cationic polymerizating initiator. In general, the optical cationic polymerizating initiator is of onium salt with antimonite as the anion group due to the nature of the hardening rate or the exposure energy. This paper presents the development status of a high sensitivity permanent photoresist made of epoxy resin as the main component with non-antimonite optical cationic polymerizating initiator with concerns to the impact to the environment and material for packaging.

Microbolometer SU-8 photoresist microstructure with cytochrome c protein as a sensing pixel for microbolometer

NASA Astrophysics Data System (ADS)

Lai, Jian-Lun; Su, Guo-Dung J.

2012-08-01

There are two important parts in Microbolometer: the high TCR sensing material and low thermal conductance. The high TCR material cytochrome c protein is a good candidate for infrared detection. Our group already demonstrated cytochrome c thin film has high TCR on the top of SU8 surface that has been published in Proc. of SPIE (2011). Because the very low thermal conductivity of SU-8, we proposed a new concept of SU-8 photoresist thermal insulation desk structure, and used the exposure dose method to establish it. Although exposure dose method is very sensitive to exposure time and PEB time, we successfully investigated the right recipe to create new desk insulation structure which with different height. We also explored the relationship between mask II exposure time and desktop thickness, and how the post-exposure baking (PEB) time influenced our structure. Our SU-8 photoresist insulation structure fabrication process is much easier and cheaper than present SiNx fabrication process. The desk shape structure can have low thermal conductance of 6.681*10-6 W/K. The easy-made SU-8 microstructures and cytochrome c thin films that and can reduce the cost of IR microbolometer. We believe that it is possible to fabricate a new generation of microbolometer based on cytochrome c protein and SU-8 photoresist microstructures.

Non-chemically amplified 193-nm top surface imaging photoresist development: polymer substituent and polydispersity effects

NASA Astrophysics Data System (ADS)

Kim, Myoung-Soo; Kim, Hyoung-Gi; Kim, Hyeong-Soo; Baik, Ki-Ho; Johnson, Donald W.; Cernigliaro, George J.; Minsek, David W.

1999-06-01

Thin film imaging processes such as top surface imaging (TSI) are candidates for sub-150 nm lithography using 193 nm lithography. Single component, non-chemically amplified, positive tone TSI photoresists based on phenolic polymers demonstrate good post-etch contrast, resolution, and minimal line edge roughness, in addition to being the most straightforward thin film imaging approach. In this approach, ArF laser exposure results directly in radiation- induced crosslinking of the phenolic polymer, followed by formation of a thin etch mask at the surface of the un- exposed regions by vapor-phase silylation, followed by reactive ion etching of the non-silylated regions. However, single component resists based on poly(para-hydroxystryene) (PHS), such as MicroChem's Nano MX-P7, suffer from slow photospeed as well as low silylation contrast which can cause reproducibility and line-edge-roughness problems. We report that selected aromatic substitution of the poly(para- hydroxystryene) polymer can increase the photospeed by up to a factor of four relative to un-substituted PHS. In this paper we report the synthesis and lithographic evaluations of four experimental TSI photoresists. MX-EX-1, MX-EX-2, MX- EX-3 and MX-EX-4 are non-chemically amplified resists based on aromatic substitutions of chloro- and hydroxymethyl- groups and PHS. We report optimized lithographic processing conditions, line edge roughness, silylation contrast, and compare the results to the parent PHS photoresist.

Non-ARC solution to metal reflective notching: its evaluation and selection

NASA Astrophysics Data System (ADS)

Buffat, Stephen J.

1997-07-01

Patterning photoresists on reflective topography such as aluminum is one of the more difficult problems in device manufacturing. Interference effects caused by reflected light from the substrate/photoresist interface and surface topography result in coupling of additional energy into the film. This leads to linewidth variation known as reflective notching which severely impacts process latitude and increases critical dimension variation. For many years, suppliers approached the problem by adding dyes that absorb in the actinic region to create a larger non-bleachable absorption. In recent years, strongly absorbing intermediate layers or ARC's, both organic and inorganic, have seen widespread implementation to control reflective notching. However, if a fab is not equipped to accommodate the required ARC process, the processing can be very time consuming, cumbersome and costly. This study was undertaken to determine if a non-ARC, i-line photoresist process could be developed to reduce or eliminate aluminum reflective notching and accompanying critical dimension variation. This study was designed to screen, identify, and characterize various resist chemistries. Based on the screening characterization, a final, cost effective resist chemistry without ARC was selected, fully characterized and transferred into production. The selected material is currently being used in a high volume 0.60 micrometers CMOS, 200 mm wafer manufacturing process.

Large-scale fabrication of vertically aligned ZnO nanowire arrays

DOEpatents

Wang, Zhong L; Das, Suman; Xu, Sheng; Yuan, Dajun; Guo, Rui; Wei, Yaguang; Wu, Wenzhuo

2013-02-05

In a method for growing a nanowire array, a photoresist layer is placed onto a nanowire growth layer configured for growing nanowires therefrom. The photoresist layer is exposed to a coherent light interference pattern that includes periodically alternately spaced dark bands and light bands along a first orientation. The photoresist layer exposed to the coherent light interference pattern along a second orientation, transverse to the first orientation. The photoresist layer developed so as to remove photoresist from areas corresponding to areas of intersection of the dark bands of the interference pattern along the first orientation and the dark bands of the interference pattern along the second orientation, thereby leaving an ordered array of holes passing through the photoresist layer. The photoresist layer and the nanowire growth layer are placed into a nanowire growth environment, thereby growing nanowires from the nanowire growth layer through the array of holes.

Photoresist composition for extreme ultraviolet lithography

DOEpatents

Felter, T. E.; Kubiak, G. D.

1999-01-01

A method of producing a patterned array of features, in particular, gate apertures, in the size range 0.4-0.05 .mu.m using projection lithography and extreme ultraviolet (EUV) radiation. A high energy laser beam is used to vaporize a target material in order to produce a plasma which in turn, produces extreme ultraviolet radiation of a characteristic wavelength of about 13 nm for lithographic applications. The radiation is transmitted by a series of reflective mirrors to a mask which bears the pattern to be printed. The demagnified focused mask pattern is, in turn, transmitted by means of appropriate optics and in a single exposure, to a substrate coated with photoresists designed to be transparent to EUV radiation and also satisfy conventional processing methods. A photoresist composition for extreme ultraviolet radiation of boron carbide polymers, hydrochlorocarbons and mixtures thereof.

Method of making low leakage N-channel SOS transistors utilizing positive photoresist masking techniques

NASA Technical Reports Server (NTRS)

Policastro, Steven G. (Inventor); Woo, Dae-Shik (Inventor)

1983-01-01

A self-aligned method of implanting the edges of NMOS/SOS transistors is described. The method entails covering the silicon islands with a thick oxide layer, applying a protective photoresist layer over the thick oxide layer, and exposing the photoresist layer from the underside of the sapphire substrate thereby using the island as an exposure mask. Only the photoresist on the islands' edges will be exposed. The exposed photoresist is then removed and the thick oxide is removed from the islands edges which are then implanted.

Atomic layer deposition on phase-shift lithography generated photoresist patterns for 1D nanochannel fabrication.

PubMed

Güder, Firat; Yang, Yang; Krüger, Michael; Stevens, Gregory B; Zacharias, Margit

2010-12-01

A versatile, low-cost, and flexible approach is presented for the fabrication of millimeter-long, sub-100 nm wide 1D nanochannels with tunable wall properties (wall thickness and material) over wafer-scale areas on glass, alumina, and silicon surfaces. This approach includes three fabrication steps. First, sub-100 nm photoresist line patterns were generated by near-field contact phase-shift lithography (NFC-PSL) using an inexpensive homemade borosilicate mask (NFC-PSM). Second, various metal oxides were directly coated on the resist patterns with low-temperature atomic layer deposition (ALD). Finally, the remaining photoresist was removed via an acetone dip, and then planar nanochannel arrays were formed on the substrate. In contrast to all the previous fabrication routes, the sub-100 nm photoresist line patterns produced by NFC-PSL are directly employed as a sacrificial layer for the creation of nanochannels. Because both the NFC-PSL and the ALD deposition are highly reproducible processes, the strategy proposed here can be regarded as a general route for nanochannel fabrication in a simplified and reliable manner. In addition, the fabricated nanochannels were used as templates to synthesize various organic and inorganic 1D nanostructures on the substrate surface.

A Molecular- and Nano-Electronics Test (MONET) platform fabricated using extreme ultraviolet lithography.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dentinger, Paul M.; Cardinale, Gregory F.; Hunter, Luke L.

2003-12-01

We describe the fabrication and characterization of an electrode array test structure, designed for electrical probing of molecules and nanocrystals. We use Extreme Ultraviolet Lithography (EUVL) to define the electrical test platform features. As fabricated, the platform includes nominal electrode gaps of 0 nm, 40 nm, 60 nm, and 80 nm. Additional variation in electrode gap is achieved by controlling the exposure conditions, such as dose and focus. To enable EUVL based nanofabrication, we develop a novel bi-level photoresist process. The bi-level photoresist consists of a combination of a commercially available polydimethylglutarimide (PMGI) bottom layer and an experimental EUVL photoresistmore » top (imaging) layer. We measure the sensitivity of PMGI to EUV exposure dose as a function of photoresist pre-bake temperature, and using this data, optimize a metal lift-off process. Reliable fabrication of 700 Angstrom thick Au structures with sub-1000 Angstrom critical dimensions is achieved, even without the use of a Au adhesion layer, such as Ti. Several test platforms are used to characterize electrical properties of organic molecules deposited as self assembled monolayers.« less

Phenolic dyes as nonbleachable absorbers compatible with novolac resins for linewidth control in photoresists

DOEpatents

Renschler, C.L.

1986-11-25

Photoresist techniques and compositions are provided employing curcumin as an absorptive dye for the purpose of reducing linewidth non-uniformity caused by scattered and reflective light from the substrate-resist interface. The photoresist compositions containing curcumin as the absorptive dye are used in the production of microelectronic circuitry by both single layer and multilayer photoresist techniques.

Phenolic dyes as nonbleachable absorbers compatible with novolac resins for linewidth control in photoresists

DOE Office of Scientific and Technical Information (OSTI.GOV)

Renschler, C.L.

1988-10-17

Photoresist techniques and compositions are provided employing curcumin as an absorptive dye for the purpose of reducing linewidth non-uniformity caused by scattered and reflective light from the substrate-resist interface. The photoresist compositions containing curcumin as the absorptive dye are used in the production of microelectronic circuitry by both single layer and multilayer photoresist techniques. 2 figs.

Dose Control System in the Optima XE Single Wafer High Energy Ion Implanter

DOE Office of Scientific and Technical Information (OSTI.GOV)

Satoh, Shu; Yoon, Jongyoon; David, Jonathan

2011-01-07

Photoresist outgassing can significantly compromise accurate dosimetry of high energy implants. High energy implant even at a modest beam current produces high beam powers which create significantly worse outgassing than low and medium energy implants and the outgassing continues throughout the implant due to the low dose in typical high energy implant recipes. In the previous generation of high energy implanters, dose correction by monitoring of process chamber pressure during photoresist outgassing has been used. However, as applications diversify and requirements change, the need arises for a more versatile photoresist correction system to match the versatility of a single wafermore » high energy ion implanter. We have successfully developed a new dosimetry system for the Optima XE single wafer high energy ion implanter which does not require any form of compensation due to the implant conditions. This paper describes the principles and performance of this new dose system.« less

Modified polyhydroxystyrenes as matrix resins for dissolution inhibition type photoresists

NASA Astrophysics Data System (ADS)

Pawlowski, Georg; Sauer, Thomas P.; Dammel, Ralph R.; Gordon, Douglas J.; Hinsberg, William D.; McKean, Dennis R.; Lindley, Charlet R.; Merrem, Hans-Joachim; Roeschert, Heinz; Vicari, Richard; Willson, C. Grant

1990-06-01

It is generally accepted that the production of shrink versions of the 16 MB DRAM and the 64 MB DRAM generations will be patterned using deep UV radiation. This provides a new challenge to the photoresist suppliers, as the standard photoresist formulations are not suitable for this technology, mainly because the presently used novolak resins are highly opaque in the 200 - 300 nm region. This is especially true for the 248 nm wavelength of KrF eximer lasers. Poly 4- hydroxystyrene [PHS] has several advantages in transmission and thermal stability; however, its dissolution rate in commercial grade developers is unacceptably high. We report some recent results on modified, alkyl-substituted PHS derivatives. These polymers combine reduced alkaline solubiity with adequate optical and thermal properties, making them acceptable for future deep UV based production processes. Selected data of these new (co)polymers are discussed.

Photoresist: Fabrication, Characterization and Its Sensitivity on the Exposures of X-Ray and Ultraviolet

NASA Astrophysics Data System (ADS)

Sutikno; Susilo; Raharja, H. D.

2018-05-01

The epoxy resin-based photoresist is fabricated by mixing of resin (polymer), sodium acetate trihydrate and ethanol in mass variation using heated magnetic stirrer at 100 rpm speed and temperature of 75 °C. Sodium acetate trihydrate and ethanol each play role as photoactive compound (PAC) and solvent, respectively. Photoresist thin films were grown through spin coating method in voltage 5 V during the 60 s and heating temperature of 150 °C for 15 min. To determine photoresist sensitivity, ultraviolet and X-ray were exposed on the photoresist surfaces. The fabricated photoresist properties are densities of 1 g·mL‑1 to 1.23 g·mL‑1, dynamic viscosities of 7 Cp to 22 Cp and kinematic viscosities of 7 Cst to 18 Cst. The absorbances of thin films are in the wavelength range of 350 nm to 1050 nm at the maximum absorbances of 0.2 to 0.5 in the wavelength g-line, h-line, and i-line. The generated maximum current achieved (1.84 × 10‑8) A. The microstructures of epoxy-based photoresist seem homogeneous. The sensitivities of UV exposures show a photochemistry reaction on photoresist occurred, however for X-ray exposure no reaction found.

Photoresist laminate

DOEpatents

Andrade, A.D.; Galbraith, L.K.

1979-10-01

The disclosure relates to a laminated negative dry-film photoresist for the production of thick, as well as thin, patterns with vertical sidewalls. Uniform depthwise exposure in a photoresist layer is effected by the use of an ultraviolet filtering top layer.

CD uniformity control for thick resist process

NASA Astrophysics Data System (ADS)

Huang, Chi-hao; Liu, Yu-Lin; Wang, Weihung; Yang, Mars; Yang, Elvis; Yang, T. H.; Chen, K. C.

2017-03-01

In order to meet the increasing storage capacity demand and reduce bit cost of NAND flash memories, 3D stacked flash cell array has been proposed. In constructing 3D NAND flash memories, the higher bit number per area is achieved by increasing the number of stacked layers. Thus the so-called "staircase" patterning to form electrical connection between memory cells and word lines has become one of the primarily critical processes in 3D memory manufacture. To provide controllable critical dimension (CD) with good uniformity involving thick photo-resist has also been of particular concern for staircase patterning. The CD uniformity control has been widely investigated with relatively thinner resist associated with resolution limit dimension but thick resist coupling with wider dimension. This study explores CD uniformity control associated with thick photo-resist processing. Several critical parameters including exposure focus, exposure dose, baking condition, pattern size and development recipe, were found to strongly correlate with the thick photo-resist profile accordingly affecting the CD uniformity control. To minimize the within-wafer CD variation, the slightly tapered resist profile is proposed through well tailoring the exposure focus and dose together with optimal development recipe. Great improvements on DCD (ADI CD) and ECD (AEI CD) uniformity as well as line edge roughness were achieved through the optimization of photo resist profile.

Grayscale lithography-automated mask generation for complex three-dimensional topography

NASA Astrophysics Data System (ADS)

Loomis, James; Ratnayake, Dilan; McKenna, Curtis; Walsh, Kevin M.

2016-01-01

Grayscale lithography is a relatively underutilized technique that enables fabrication of three-dimensional (3-D) microstructures in photosensitive polymers (photoresists). By spatially modulating ultraviolet (UV) dosage during the writing process, one can vary the depth at which photoresist is developed. This means complex structures and bioinspired designs can readily be produced that would otherwise be cost prohibitive or too time intensive to fabricate. The main barrier to widespread grayscale implementation, however, stems from the laborious generation of mask files required to create complex surface topography. We present a process and associated software utility for automatically generating grayscale mask files from 3-D models created within industry-standard computer-aided design (CAD) suites. By shifting the microelectromechanical systems (MEMS) design onus to commonly used CAD programs ideal for complex surfacing, engineering professionals already familiar with traditional 3-D CAD software can readily utilize their pre-existing skills to make valuable contributions to the MEMS community. Our conversion process is demonstrated by prototyping several samples on a laser pattern generator-capital equipment already in use in many foundries. Finally, an empirical calibration technique is shown that compensates for nonlinear relationships between UV exposure intensity and photoresist development depth as well as a thermal reflow technique to help smooth microstructure surfaces.

TiO2 micro-flowers composed of nanotubes and their application to dye-sensitized solar cells.

PubMed

Kim, Woong-Rae; Park, Hun; Choi, Won-Youl

2014-02-24

TiO2 micro-flowers were made to bloom on Ti foil by the anodic oxidation of Ti-protruding dots with a cylindrical shape. Arrays of the Ti-protruding dots were prepared by photolithography, which consisted of coating the photoresists, attaching a patterned mask, illuminating with UV light, etching the Ti surface by reactive ion etching (RIE), and stripping the photoresist on the Ti foil. The procedure for the blooming of the TiO2 micro-flowers was analyzed by field emission scanning electron microscopy (FESEM) as the anodizing time was increased. Photoelectrodes of dye-sensitized solar cells (DSCs) were fabricated using TiO2 micro-flowers. Bare TiO2 nanotube arrays were used for reference samples. The short-circuit current (Jsc) and the power conversion efficiency of the DSCs based on the TiO2 micro-flowers were 4.340 mA/cm2 and 1.517%, respectively. These values of DSCs based on TiO2 micro-flowers were higher than those of bare samples. The TiO2 micro-flowers had a larger surface area for dye adsorption compared to bare TiO2 nanotube arrays, resulting in improved Jsc characteristics. The structure of the TiO2 micro-flowers allowed it to adsorb dyes very effectively, also demonstrating the potential to achieve higher power conversion efficiency levels for DSCs compared to a bare TiO2 nanotube array structure and the conventional TiO2 nanoparticle structure.

TiO2 micro-flowers composed of nanotubes and their application to dye-sensitized solar cells

PubMed Central

2014-01-01

TiO2 micro-flowers were made to bloom on Ti foil by the anodic oxidation of Ti-protruding dots with a cylindrical shape. Arrays of the Ti-protruding dots were prepared by photolithography, which consisted of coating the photoresists, attaching a patterned mask, illuminating with UV light, etching the Ti surface by reactive ion etching (RIE), and stripping the photoresist on the Ti foil. The procedure for the blooming of the TiO2 micro-flowers was analyzed by field emission scanning electron microscopy (FESEM) as the anodizing time was increased. Photoelectrodes of dye-sensitized solar cells (DSCs) were fabricated using TiO2 micro-flowers. Bare TiO2 nanotube arrays were used for reference samples. The short-circuit current (Jsc) and the power conversion efficiency of the DSCs based on the TiO2 micro-flowers were 4.340 mA/cm2 and 1.517%, respectively. These values of DSCs based on TiO2 micro-flowers were higher than those of bare samples. The TiO2 micro-flowers had a larger surface area for dye adsorption compared to bare TiO2 nanotube arrays, resulting in improved Jsc characteristics. The structure of the TiO2 micro-flowers allowed it to adsorb dyes very effectively, also demonstrating the potential to achieve higher power conversion efficiency levels for DSCs compared to a bare TiO2 nanotube array structure and the conventional TiO2 nanoparticle structure. PMID:24565201

TiO2 micro-flowers composed of nanotubes and their application to dye-sensitized solar cells

NASA Astrophysics Data System (ADS)

Kim, Woong-Rae; Park, Hun; Choi, Won-Youl

2014-02-01

TiO2 micro-flowers were made to bloom on Ti foil by the anodic oxidation of Ti-protruding dots with a cylindrical shape. Arrays of the Ti-protruding dots were prepared by photolithography, which consisted of coating the photoresists, attaching a patterned mask, illuminating with UV light, etching the Ti surface by reactive ion etching (RIE), and stripping the photoresist on the Ti foil. The procedure for the blooming of the TiO2 micro-flowers was analyzed by field emission scanning electron microscopy (FESEM) as the anodizing time was increased. Photoelectrodes of dye-sensitized solar cells (DSCs) were fabricated using TiO2 micro-flowers. Bare TiO2 nanotube arrays were used for reference samples. The short-circuit current ( J sc) and the power conversion efficiency of the DSCs based on the TiO2 micro-flowers were 4.340 mA/cm2 and 1.517%, respectively. These values of DSCs based on TiO2 micro-flowers were higher than those of bare samples. The TiO2 micro-flowers had a larger surface area for dye adsorption compared to bare TiO2 nanotube arrays, resulting in improved J sc characteristics. The structure of the TiO2 micro-flowers allowed it to adsorb dyes very effectively, also demonstrating the potential to achieve higher power conversion efficiency levels for DSCs compared to a bare TiO2 nanotube array structure and the conventional TiO2 nanoparticle structure.

Fabrication of a high aspect ratio thick silicon wafer mold and electroplating using flipchip bonding for MEMS applications

NASA Astrophysics Data System (ADS)

Kim, Bong-Hwan; Kim, Jong-Bok

2009-06-01

We have developed a microfabrication process for high aspect ratio thick silicon wafer molds and electroplating using flipchip bonding with THB 151N negative photoresist (JSR micro). This fabrication technique includes large area and high thickness silicon wafer mold electroplating. The process consists of silicon deep reactive ion etching (RIE) of the silicon wafer mold, photoresist bonding between the silicon mold and the substrate, nickel electroplating and a silicon removal process. High thickness silicon wafer molds were made by deep RIE and flipchip bonding. In addition, nickel electroplating was developed. Dry film resist (ORDYL MP112, TOK) and thick negative-tone photoresist (THB 151N, JSR micro) were used as bonding materials. In order to measure the bonding strength, the surface energy was calculated using a blade test. The surface energy of the bonding wafers was found to be 0.36-25.49 J m-2 at 60-180 °C for the dry film resist and 0.4-1.9 J m-2 for THB 151N in the same temperature range. Even though ORDYL MP112 has a better value of surface energy than THB 151N, it has a critical disadvantage when it comes to removing residue after electroplating. The proposed process can be applied to high aspect ratio MEMS structures, such as air gap inductors or vertical MEMS probe tips.

Comparison of different photoresist buffer layers in SPR sensors based on D-shaped POF and gold film

NASA Astrophysics Data System (ADS)

Cennamo, Nunzio; Pesavento, Maria; De Maria, Letizia; Galatus, Ramona; Mattiello, Francesco; Zeni, Luigi

2017-04-01

A comparative analysis of two optical fiber sensing platforms is presented. The sensors are based on surface plasmon resonance (SPR) in a D-shaped plastic optical fiber (POF) with a photoresist buffer layer between the exposed POF core and the thin gold film. We show how the sensor's performances change when the photoresist layer changes. The photoresist layers proposed in this analysis are SU-8 3005 and S1813. The experimental results are congruent with the numerical studies and it is instrumental for chemical and bio-chemical applications. Usually, the photoresist layer is required in order to increase the performance of the SPR-POF sensor.

Using a micro-molding process to fabricate polymeric wavelength filters

NASA Astrophysics Data System (ADS)

Chuang, Wei-Ching; Lee, An-Chen; Ho, Chi-Ting

2008-08-01

A procedure for fabricating a high aspect ratio periodic structure on a UV polymer at submicron order using holographic interferometry and molding processes is described. First, holographic interferometry using a He-Cd (325 nm) laser was used to create the master of the periodic line structure on an i-line sub-micron positive photoresist film. A 20 nm nickel thin film was then sputtered on the photoresist. The final line pattern on a UV polymer was obtained from casting against the master mold. Finally, a SU8 polymer was spun on the polymer grating to form a planar waveguide or a channel waveguide. The measurement results show that the waveguide length could be reduced for the waveguide having gratings with a high aspect ratio.

Star tracking reticles

NASA Technical Reports Server (NTRS)

Smith, W. O.; Toft, A. R. (Inventor)

1973-01-01

A method for the production of reticles, particularly those for use in outer space, where the product is a quartz base coated with highly adherent layers of chromium, chromium-silver, and silver vacuum deposited through a mask, and then coated with an electrodeposit of copper from a copper sulfate solution followed by an electrodeposit of black chromium is described. The masks are produced by coating a beryllium-copper alloy substrate with a positive working photoresist, developing the photoresist, according to a pattern to leave a positive mask, plating uncoated areas with gold, removing the photoresist, coating the substrate with a negative working photoresist, developing the negative working photoresist to expose the base metal of the pattern, and chemically etching the unplated side of the pattern to produce the mask.

High Precision Metal Thin Film Liftoff Technique

NASA Technical Reports Server (NTRS)

Brown, Ari D. (Inventor); Patel, Amil A. (Inventor)

2015-01-01

A metal film liftoff process includes applying a polymer layer onto a silicon substrate, applying a germanium layer over the polymer layer to create a bilayer lift off mask, applying a patterned photoresist layer over the germanium layer, removing an exposed portion of the germanium layer, removing the photoresist layer and a portion of the polymer layer to expose a portion of the substrate and create an overhanging structure of the germanium layer, depositing a metal film over the exposed portion of the substrate and the germanium layer, and removing the polymer and germanium layers along with the overlaying metal film.

Fabrication of tunable diffraction grating by imprint lithography with photoresist mold

NASA Astrophysics Data System (ADS)

Yamada, Itsunari; Ikeda, Yusuke; Higuchi, Tetsuya

2018-05-01

We fabricated a deformable transmission silicone [poly(dimethylsiloxane)] grating using a two-beam interference method and imprint lithography and evaluated its optical characteristics during a compression process. The grating pattern with 0.43 μm depth and 1.0 μm pitch was created on a silicone surface by an imprinting process with a photoresist mold to realize a simple, low-cost fabrication process. The first-order diffraction transmittance of this grating reached 10.3% at 632.8 nm wavelength. We also measured the relationship between the grating period and compressive stress to the fabricated elements. The grating period changed from 1.0 μm to 0.84 μm by 16.6% compression of the fabricated element in one direction, perpendicular to the grooves, and the first-order diffraction transmittance was 8.6%.

A Novel, Aqueous Surface Treatment To Thermally Stabilize High Resolution Positive Photoresist Images*

NASA Astrophysics Data System (ADS)

Grunwald, John J.; Spencer, Allen C.

1986-07-01

The paper describes a new approach to thermally stabilize the already imaged profile of high resolution positive photoresists such as ULTRAMAC" PR-914. ***XD-4000, an aqueous emulsion of a blend of fluorine-bearing compounds is spun on top of the developed, positive photoresist-imaged wafer, and baked. This allows the photoresist to withstand temperatures up to at least 175 deg. C. while essentially maintaining vertical edge profiles. Also, adverse effects of "outgassing" in harsh environments, ie., plasma and ion implant are greatly minimized by allowing the high resolution imaged photoresist to be post-baked at "elevated" temperatures. Another type of product that accomplishes the same effect is ***XD-4005, an aqueous emulsion of a high temperature-resistant polymer. While the exact mechanism is yet to be identified, it is postulated that absorption of the "polymeric" species into the "skin" of the imaged resist forms a temperature resistant "envelope", thereby allowing high resolution photoresists to also serve in a "high temperature" mode, without reticulation, or other adverse effects due to thermal degradation. SEM's are presented showing imaged ULTRAMAC" PR-914 and ULTRAMAC" **EPA-914 geometries coated with XD-4000 or XD-4005 and followed by plasma etched oxide,polysilicon and aluminum. Selectivity ratios are compared with and without the novel treatment and are shown to be significantly better with the treatment. The surface-treated photoresist for thermal resistance remains easily strippable in solvent-based or plasma media, unlike photoresists that have undergone "PRIST" or other gaseous thermal stabilization methods.

Poly(silyl silane) homo and copolymers

DOEpatents

Zeigler, J.K.

1991-08-13

Poly(silyl silanes) have been prepared. They have high photosensitivity and excellent resistance to oxygen-reactive ion etching processes. They are useful as photodepolymerizable photoresists, barrier layers, etc.

High resolution, low cost solar cell contact development. Quarterly technical progress and schedule report, September 28, 1980

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mardesich, N.

The scope of the contract covers the development and evaluation of forming solar cell collector grid contacts by the MIDFILM process. This is a proprietary process developed by the Ferro Corporation which is a subcontractor for the program. The MIDFILM process attains line resolution characteristics of photoresist methods with processing related to screen printing. The surface to be processed is first coated with a thin layer of photoresist material. Upon exposure to ultraviolet light through a suitable mask, the resist in the non-pattern area cross-links and becomes hard. The unexposed pattern areas remain tacky. The conductor material is applied inmore » the form of a dry mixture of metal and frit particles which adhere to the tacky pattern area. The assemblage is then fired to ash the photopolymer and sinter the fritted conductor powder. Effort was concentrated during this period on the establishment, optimization and identification of problem areas of the MIDFILM process. Progress is reported. (WHK)« less

Fabrication of submicron metallic grids with interference and phase-mask holography

DOE Office of Scientific and Technical Information (OSTI.GOV)

Park, Joong-Mok; Kim, Tae-Geun; Constant, Kristen

2011-01-25

Complex, submicron Cu metallic mesh nanostructures are made by electrochemical deposition using polymer templates made from photoresist. The polymer templates are fabricated with photoresist using two-beam interference holography and phase mask holography with three diffracted beams. Freestanding metallic mesh structures are made in two separate electrodepositions with perpendicular photoresist grating templates. Cu mesh square nanostructures having large (52.6%) open areas are also made by single electrodeposition with a photoresist template made with a phase mask. These structures have potential as electrodes in photonic devices.

Direct laser writing of polymeric nanostructures via optically induced local thermal effect

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tong, Quang Cong; Institute of Materials Science, Vietnam Academy of Science and Technology, 18 Hoang Quoc Viet, Cau Giay, 10000 Hanoi; Nguyen, Dam Thuy Trang

We demonstrate the fabrication of desired structures with feature size below the diffraction limit by use of a positive photoresist. The direct laser writing technique employing a continuous-wave laser was used to optically induce a local thermal effect in a positive photoresist, which then allowed the formation of solid nanostructures. This technique enabled us to realize multi-dimensional sub-microstructures by use of a positive photoresist, with a feature size down to 57 nm. This mechanism acting on positive photoresists opens a simple and low-cost way for nanofabrication.

Design and study of advanced photoresist materials: Positive tone photoresists with reduced environmental impact and materials for 157 nm lithography

NASA Astrophysics Data System (ADS)

Yamada, Shintaro

Concern about using organic solvents in semiconductor manufacturing led us to consider a photoresist system that can be fully processed with aqueous media. A series of new polymers were designed and prepared that demonstrate fully aqueous processable positive tone imaging. Positive tone imaging requires two solubility switches, and this has been accomplished by two different methods. In both cases, a post application baking step was utilized to render the water soluble polymer insoluble in water, and photo-induced acid catalyzed reactions regenerated aqueous solubility only in the exposed areas. The first system is based on the reaction of vinyl ethers. When the film is baked after casting from water, the vinyl ethers incorporated into the photoresist react with acidic hydroxyl groups on the matrix polymer to form acetal cross-linkages. The acetal linkages of the exposed areas are hydrolyzed by photo-acids to create positive tone imaging with pure water development. Although these systems provided positive tone imaging and were successfully cast from and developed with pure water, there are some shortcomings to this design approach such as poor dry etch resistance and short shelf life. The second system was designed to address these shortcomings. Various polystyrene-based polymers bearing ammonium salts of malonic acid monoesters were prepared and studied. The ammonium salts render the styrenic polymers soluble in water. Upon baking, ammonia is volatilized, and the resulting malonic acid monoester undergoes decarboxylation that results in formation of a base insoluble polymer. Studies on the selection of acid labile ester protecting groups, kinetics of decarboxylation and imaging are presented. Lithography with 157 nm exposure is the most promising candidate for post-193 nm lithography, and this technology is expected to provide the resolution required for the next generation of microelectronic devices. Designing photoresists for 157 nm imaging is a challenge because air, water and even the simplest hydrocarbon polymers such as polyethylene absorb strongly at this wavelength. Incorporation of fluorine atoms into matrix polymers is the key to reducing their absorbance at 157 nm. Studies on the metal-catalyzed polymerization of fluorine-containing norbornene derivatives for this application are also presented.

Poly(silyl silane)homo and copolymers

DOEpatents

Zeigler, J.M.

1989-04-11

Poly(silyl silanes) have been prepared. They have high photosensitivity and show excellent resistance to oxygen-reactive ion etching processes. They are useful as photodepolymerizable photoresists, barrier layers, etc.

Glove permeation by semiconductor processing mixtures containing glycol-ether derivatives.

PubMed

Zellers, E T; Ke, H Q; Smigiel, D; Sulewski, R; Patrash, S J; Han, M W; Zhang, G Z

1992-02-01

Results of permeation tests of several glove materials challenged with semiconductor processing formulations containing glycolether derivatives are described. Commercial glove samples of nitrile rubber (Edmont), natural rubber (Edmont and Baxter), butyl rubber (North), PVC Baxter), a natural rubber/neoprene/nitrile blend (Pioneer), and a natural rubber/neoprene blend (Playtex) were tested according to the ASTM F739-85 permeation test method (open-loop configuration). The liquid formulations examined included a positive photoresist thinner containing 2-ethoxyethyl acetate (2-EEA), n-butyl acetate, and xylene; a positive photoresist containing 2-EEA, n-butyl acetate, xylene, polymer resins, and photoactive compounds; a negative photoresist containing 2-methoxyethanol (2-ME), xylene, and cyclized poly(isoprene); and pure 2-methoxyethyl acetate (2-MEA), which is the solvent used in a commercial electron-beam resist. With the exception of the negative photoresist, butyl rubber provided the highest level of protection against the solvent mixtures tested, with no breakthrough observed after 4 hr of continuous exposure at 25 degrees C. Nitrile rubber provided the highest level of protection against the negative photoresist and reasonably good protection against initial exposure to the other solvent mixtures. Gloves consisting of natural rubber or natural rubber blends provided less protection against the mixtures than either nitrile or butyl rubber. For most of the glove samples, permeation of the glycol-ether derivatives contained in the mixtures was faster than that predicted from the permeation of the pure solvents. Increasing the exposure temperature from 25 to 37 degrees C did not significantly affect the performance of the butyl rubber glove. For the other gloves, however, exposures at 37 degrees C resulted in decreases in breakthrough times of 25-75% and increases in steady-state permeation rates of 80-457% relative to values obtained at 25 degrees C. Repeated exposure of nitrile rubber samples resulted in shorter breakthrough times for all mixture components. In fact, exposure for as little as one-half of the nominal breakthrough time followed by air drying overnight resulted in measurable quantities of one or more of the component solvents at the inner surface of the gloves at the beginning of the next exposure. This effect was not observed with the butyl rubber samples. With the exception of the negative photoresist, heating previously exposed nitrile rubber samples at 70 degrees C for 20 hr prior to retesting reduced or eliminated the effects of residual solvents, permitting reuse of the gloves. The use of thin PVC or natural rubber gloves adjacent to the nitrile gloves provided moderate increases in permeation resistance.(ABSTRACT TRUNCATED AT 400 WORDS)

Gap Fill Materials Using Cyclodextrin Derivatives in ArF Lithography

NASA Astrophysics Data System (ADS)

Takei, Satoshi; Shinjo, Tetsuya; Sakaida, Yasushi; Hashimoto, Keisuke

2007-11-01

High planarizing gap fill materials based on β-cyclodextrin in ArF photoresist under-layer materials have been developed for fast etching in CF4 gas. Gap fill materials used in the via-first dual damascene process need to have high etch rates to prevent crowning or fencing on top of the trench after etching and a small thickness bias between the dense and blanket areas to minimize issues observed during trench lithography by narrowing the process latitude. Cyclodextrin is a circular oligomer with a nanoscale porous structure that has a high number of oxygen atoms, as calculated using the Ohnishi parameter, providing high etch rates. Additionally, since gap fill materials using cyclodextrin derivatives have low viscosities and molecular weights, they are expected to exhibit excellent flow properties and minimal thermal shrinkage during baking. In this paper, we describe the composition and basic film properties of gap fill materials; planarization in the via-first dual damascene process and etch rates in CF4 gas compared with dextrin with α-glycoside bonds in polysaccharide, poly(2-hydroxypropyl methacrylate) and poly(4-hydroxystyrene). The β-cyclodextrin used in this study was obtained by esterifying the hydroxyl groups of dextrin resulting in improved wettability on via substrates and solubility in photoresist solvents such as propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate and ethyl lactate. Gap fill materials using cyclodextrin derivatives showed good planarization and via filling performance without observing voids in via holes. In addition to superior via filling performance, the etch rate of gap fill materials using β-cyclodextrin derivatives was 2.8-2.9 times higher than that of an ArF photoresist, evaluated under CF4 gas conditions by reactive ion etching. These results were attributed to the combination of both nanoscale porous structures and a high density of oxygen atoms in our gap fill materials using cyclodextrin derivatives. The cyclodextrin derivatives may be applicable as a new type of sacrificial material under the photoresist in ArF lithography.

Rigorous ILT optimization for advanced patterning and design-process co-optimization

NASA Astrophysics Data System (ADS)

Selinidis, Kosta; Kuechler, Bernd; Cai, Howard; Braam, Kyle; Hoppe, Wolfgang; Domnenko, Vitaly; Poonawala, Amyn; Xiao, Guangming

2018-03-01

Despite the large difficulties involved in extending 193i multiple patterning and the slow ramp of EUV lithography to full manufacturing readiness, the pace of development for new technology node variations has been accelerating. Multiple new variations of new and existing technology nodes have been introduced for a range of device applications; each variation with at least a few new process integration methods, layout constructs and/or design rules. This had led to a strong increase in the demand for predictive technology tools which can be used to quickly guide important patterning and design co-optimization decisions. In this paper, we introduce a novel hybrid predictive patterning method combining two patterning technologies which have each individually been widely used for process tuning, mask correction and process-design cooptimization. These technologies are rigorous lithography simulation and inverse lithography technology (ILT). Rigorous lithography simulation has been extensively used for process development/tuning, lithography tool user setup, photoresist hot-spot detection, photoresist-etch interaction analysis, lithography-TCAD interactions/sensitivities, source optimization and basic lithography design rule exploration. ILT has been extensively used in a range of lithographic areas including logic hot-spot fixing, memory layout correction, dense memory cell optimization, assist feature (AF) optimization, source optimization, complex patterning design rules and design-technology co-optimization (DTCO). The combined optimization capability of these two technologies will therefore have a wide range of useful applications. We investigate the benefits of the new functionality for a few of these advanced applications including correction for photoresist top loss and resist scumming hotspots.

A Module Experimental Process System Development Unit (MEPSDU)

NASA Technical Reports Server (NTRS)

1981-01-01

Design work for a photovoltaic module, fabricated using single crystal silicon dendritic web sheet material, resulted in the identification of surface treatment to the module glass superstrate which improved module efficiencies. A final solar module environmental test, a simulated hailstone impact test, was conducted on full size module superstrates to verify that the module's tempered glass superstrate can withstand specified hailstone impacts near the corners and edges of the module. Process sequence design work on the metallization process selective, liquid dopant investigation, dry processing, and antireflective/photoresist application technique tasks, and optimum thickness for Ti/Pd are discussed. A noncontact cleaning method for raw web cleaning was identified and antireflective and photoresist coatings for the dendritic webs were selected. The design of a cell string conveyor, an interconnect feed system, rolling ultrasonic spot bonding heat, and the identification of the optimal commercially available programmable control system are also discussed. An economic analysis to assess cost goals of the process sequence is also given.

Sequential shrink photolithography for plastic microlens arrays

NASA Astrophysics Data System (ADS)

Dyer, David; Shreim, Samir; Jayadev, Shreshta; Lew, Valerie; Botvinick, Elliot; Khine, Michelle

2011-07-01

Endeavoring to push the boundaries of microfabrication with shrinkable polymers, we have developed a sequential shrink photolithography process. We demonstrate the utility of this approach by rapidly fabricating plastic microlens arrays. First, we create a mask out of the children's toy Shrinky Dinks by simply printing dots using a standard desktop printer. Upon retraction of this pre-stressed thermoplastic sheet, the dots shrink to a fraction of their original size, which we then lithographically transfer onto photoresist-coated commodity shrink wrap film. This shrink film reduces in area by 95% when briefly heated, creating smooth convex photoresist bumps down to 30 µm. Taken together, this sequential shrink process provides a complete process to create microlenses, with an almost 99% reduction in area from the original pattern size. Finally, with a lithography molding step, we emboss these bumps into optical grade plastics such as cyclic olefin copolymer for functional microlens arrays.

Sequential shrink photolithography for plastic microlens arrays.

PubMed

Dyer, David; Shreim, Samir; Jayadev, Shreshta; Lew, Valerie; Botvinick, Elliot; Khine, Michelle

2011-07-18

Endeavoring to push the boundaries of microfabrication with shrinkable polymers, we have developed a sequential shrink photolithography process. We demonstrate the utility of this approach by rapidly fabricating plastic microlens arrays. First, we create a mask out of the children's toy Shrinky Dinks by simply printing dots using a standard desktop printer. Upon retraction of this pre-stressed thermoplastic sheet, the dots shrink to a fraction of their original size, which we then lithographically transfer onto photoresist-coated commodity shrink wrap film. This shrink film reduces in area by 95% when briefly heated, creating smooth convex photoresist bumps down to 30 µm. Taken together, this sequential shrink process provides a complete process to create microlenses, with an almost 99% reduction in area from the original pattern size. Finally, with a lithography molding step, we emboss these bumps into optical grade plastics such as cyclic olefin copolymer for functional microlens arrays.

Sequential shrink photolithography for plastic microlens arrays

PubMed Central

Dyer, David; Shreim, Samir; Jayadev, Shreshta; Lew, Valerie; Botvinick, Elliot; Khine, Michelle

2011-01-01

Endeavoring to push the boundaries of microfabrication with shrinkable polymers, we have developed a sequential shrink photolithography process. We demonstrate the utility of this approach by rapidly fabricating plastic microlens arrays. First, we create a mask out of the children’s toy Shrinky Dinks by simply printing dots using a standard desktop printer. Upon retraction of this pre-stressed thermoplastic sheet, the dots shrink to a fraction of their original size, which we then lithographically transfer onto photoresist-coated commodity shrink wrap film. This shrink film reduces in area by 95% when briefly heated, creating smooth convex photoresist bumps down to 30 µm. Taken together, this sequential shrink process provides a complete process to create microlenses, with an almost 99% reduction in area from the original pattern size. Finally, with a lithography molding step, we emboss these bumps into optical grade plastics such as cyclic olefin copolymer for functional microlens arrays. PMID:21863126

Presidential Green Chemistry Challenge: 1997 Small Business Award

EPA Pesticide Factsheets

Presidential Green Chemistry Challenge 1997 award winner, Legacy Systems, developed the Coldstrip process, which uses only water and oxygen to remove photoresist from silicon semiconductors. It replaces corrosive acids.

Photoresist substrate having robust adhesion

DOEpatents

Dentinger, Paul M [Sunol, CA

2005-07-26

A substrate material for LIGA applications w hose general composition is Ti/Cu/Ti/SiO.sub.2. The SiO.sub.2 is preferably applied to the Ti/Cu/Ti wafer as a sputtered coating, typically about 100 nm thick. This substrate composition provides improved adhesion for epoxy-based photoresist materials, and particularly the photoresist material SU-8.

Composition and method for removing photoresist materials from electronic components

DOEpatents

Davenhall, Leisa B [Santa Fe, NM; Rubin, James B [Los Alamos, NM; Taylor, Craig M. V. [Jemez Springs, NM

2008-06-03

Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.

Composition and method for removing photoresist materials from electronic components

DOEpatents

Davenhall, Leisa B.; Rubin, James B.; Taylor, Craig M.

2005-01-25

Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.

Fluorine and oxygen plasma influence on nanoparticle formation and aggregation in metal oxide thin film transistors

NASA Astrophysics Data System (ADS)

MÄ dzik, Mateusz; Elamurugu, Elangovan; Viegas, Jaime

2017-03-01

Despite recent advances in metal oxide thin-film transistor technology, there are no foundry processes available yet for large-scale deployment of metal oxide electronics and photonics, in a similar way as found for silicon based electronics and photonics. One of the biggest challenges of the metal oxide platform is the stability of the fabricated devices. Also, there is wide dispersion on the measured specifications of fabricated TFT, from lot-to-lot and from different research groups. This can be partially explained by the importance of the deposition method and its parameters, which determine thin film microstructure and thus its electrical properties. Furthermore, substrate pretreatment is an important factor, as it may act as a template for material growth. Not so often mentioned, plasma processes can also affect the morphology of deposited films on further deposition steps, such as inducing nanoparticle formation, which strongly impact the conduction mechanism in the channel layer of the TFT. In this study, molybdenum doped indium oxide is sputtered onto ALD deposited HfO2 with or without pattering, and etched by RIE chlorine based processing. Nanoparticle formation is observed when photoresist is removed by oxygen plasma ashing. HfO2 etching in CF4/Ar plasma prior to resist stripping in oxygen plasma promotes the aggregation of nanoparticles into nanosized branched structures. Such nanostructuring is absent when oxygen plasma steps are replaced by chemical wet processing with acetone. Finally, in order to understand the electronic transport effect of the nanoparticles on metal oxide thin film transistors, TFT have been fabricated and electrically characterized.

Specific features of single-pulse femtosecond laser micron and submicron ablation of a thin silver film coated with a micron-thick photoresist layer

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zayarnyi, D A; Ionin, A A; Kudryashov, S I

Specific features of ablation of a thin silver film with a 1-μm-thick layer of a highly transparent photoresist and the same film without a photoresist layer under single tightly focused femtosecond laser pulses in the visible range (515 nm) are experimentally investigated. Interference effects of internal modification of the photoresist layer, its spallation ablation from the film surface and formation of through hollow submicron channels in the resist without its spallation but with ablation of the silver film lying under the resist are found and discussed. (extreme light fields and their applications)

Microwave performance of photoresist-alumina microcomposites for batch fabrication of thick polymer-based dielectric structures

NASA Astrophysics Data System (ADS)

Rashidian, Atabak; Klymyshyn, David M.; Tayfeh Aligodarz, Mohammadreza; Boerner, Martin; Mohr, Jürgen

2012-10-01

The goal of this paper is to investigate the electrical properties of photoresist-alumina microcomposites with different portions of ceramic content. Substrates of photoresist-alumina microcomposites are fabricated and a comprehensive analysis is performed to characterize their dielectric constant and dielectric loss tangent at microwave frequencies up to 40 GHz. To evaluate the performance of these materials for microwave applications, the properties of various lithographically fabricated antenna elements are examined and analysed based on the measured electrical properties. The experimental results show that the electrical properties of the photoresist composite are nonlinearly affected by ceramic content and also a minimum percentage of ceramic portion is required to improve the electrical properties of the photoresist composite. For instance, comparison of 0 wt% with 23 wt% SU8-alumina shows that no reduction is achieved for the dielectric loss tangent. Comparison of 38 wt% with 48 wt% SU8-alumina microcomposite shows that the dielectric loss tangent is improved from 0.03 to 0.01 and the dielectric constant is increased from 3.8 to 5.0 at 25 GHz. These improvements can result in superior performance for the photoresist-based microwave components.

Design, fabrication, and evaluation of charge-coupled devices with aluminum-anodized-aluminum gates

NASA Technical Reports Server (NTRS)

Gassaway, J. D.; Causey, W. H., Jr.

1977-01-01

A 4-phase, 49 1/2 bit CCD shift register was designed and fabricated using two levels of aluminum metallization with anodic Al2O3 insulation separating the layers. Test circuitry was also designed and constructed. A numerical analysis of an MOS-RC transmission line was made and results are given to characterize performance for various conductivities. The electrical design of the CCD included a low-noise dual-gate input and a balanced floating diffusion output circuit. Metallization was accomplished both by low voltage DC sputtering and thermal evaporation. The audization was according to published procedures using a buffered tartaric acid bath. Approximately 20 wafers were processed with 50 complete chips per wafer. All devices failed by shorting between the metal levels at some point. Experimental procedures eliminated temperature effects from sintering and drying, anodic oxide thickness, edge effects, photoresist stripping procedures, and metallization techniques as the primary causes of failure. It was believed from a study of SEM images that protuberances (hillocks) grow up from the first level metal through the oxide either causing a direct short or producing a weak, highly stressed insulation point which fails at low voltage. The cause of these hillocks is unknown; however, they have been observed to grow during temperature excursions to 470 C.

Fabrication of 3D gold/polymer conductive microstructures via direct laser writing (Conference Presentation)

NASA Astrophysics Data System (ADS)

Blasco, Eva; Müller, Jonathan B.; Müller, Patrick; Fischer, Andreas C.; Barner-Kowollik, Christopher; Wegener, Martin

2017-02-01

During the last years there has been significant interest in the fabrication of conductive three-dimensional (3D) structures on the micrometer scale due to their potential applications in microelectronics or emerging fields such as flexible electronics, nanophotonics, and plasmonics. Two-photon direct laser writing (DLW) has been proposed as a potential tool for the fabrication of 3D microstructures in various contexts. The majority of these two-photon processes involve the preparation of insoluble polymeric networks using photopolymerizable photoresins based on acrylate or epoxy groups. Nevertheless, the preparation of conductive 3D microstructures is still very challenging. The aim of the current work has been the preparation of conductive 3D microstructures via DLW by employing a newly developed photoresist. The photoresist consists of acrylate-functionalized poly(ethylene glycol) derivates and HAuCl4 as the gold precursor. By varying the gold content of the photoresist, different structures have been prepared and characterized by SEM and XPS. Conductivity of individual wires between prefabricated macroelectrodes has been measured too. Subsequently, the material has been employed to demonstrate the possibility of true 3D microscale connections.

Microstructure fabrication process induced modulations in CVD graphene

NASA Astrophysics Data System (ADS)

Matsubayashi, Akitomo; Zhang, Zhenjun; Lee, Ji Ung; LaBella, Vincent P.

2014-12-01

The systematic Raman spectroscopic study of a "mimicked" graphene device fabrication is presented. Upon photoresist baking, compressive stress is induced in the graphene which disappears after it is removed. The indirect irradiation from the electron beam (through the photoresist) does not significantly alter graphene characteristic Raman peaks indicating that graphene quality is preserved upon the exposure. The 2D peak shifts and the intensity ratio of 2D and G band, I(2D)/I(G), decreases upon direct metal deposition (Co and Py) suggesting that the electronic modulation occurs due to sp2 C-C bond weakening. In contrast, a thin metal oxide film deposited graphene does not show either the significant 2D and G peaks shift or I(2D)/I(G) decrease upon the metal deposition suggesting the oxide protect the graphene quality in the fabrication process.

Photoresist Design for Elastomeric Light Tunable Photonic Devices

PubMed Central

Nocentini, Sara; Martella, Daniele; Parmeggiani, Camilla; Wiersma, Diederik S.

2016-01-01

An increasing interest in tunable photonic structures is growing within the photonic community. The usage of Liquid Crystalline Elastomer (LCE) structures in the micro-scale has been motivated by the potential to remotely control their properties. In order to design elastic photonic structures with a three-dimensional lithographic technique, an analysis of the different mixtures used in the micro-printing process is required. Previously reported LCE microstructures suffer damage and strong swelling as a limiting factor of resolution. In this article, we reported a detailed study on the writing process with four liquid crystalline photoresists, in which the percentage of crosslinker is gradually increased. The experiments reveal that exploiting the crosslinking degree is a possible means in which to obtain suspended lines with good resolution, quite good rigidity, and good elasticity, thereby preserving the possibility of deformation by light irradiation. PMID:28773646

Photoresist Design for Elastomeric Light Tunable Photonic Devices.

PubMed

Nocentini, Sara; Martella, Daniele; Parmeggiani, Camilla; Wiersma, Diederik S

2016-06-29

An increasing interest in tunable photonic structures is growing within the photonic community. The usage of Liquid Crystalline Elastomer (LCE) structures in the micro-scale has been motivated by the potential to remotely control their properties. In order to design elastic photonic structures with a three-dimensional lithographic technique, an analysis of the different mixtures used in the micro-printing process is required. Previously reported LCE microstructures suffer damage and strong swelling as a limiting factor of resolution. In this article, we reported a detailed study on the writing process with four liquid crystalline photoresists, in which the percentage of crosslinker is gradually increased. The experiments reveal that exploiting the crosslinking degree is a possible means in which to obtain suspended lines with good resolution, quite good rigidity, and good elasticity, thereby preserving the possibility of deformation by light irradiation.

Photosensitive dissolution inhibitors and resists based on onium salt carboxylates

DOEpatents

Dentinger, Paul M.; Simison, Kelby L.

2005-11-29

A photoresist composition that employs onium salt carboxylates as thermally stable dissolution inhibitors. The photoresist composition can be either an onium carboxylate salt with a phenolic photoresist, such as novolac, or an onium cation protected carboxylate-containing resin such as an acrylic/acrylic acid copolymer. The onium carboxylate can be an onium cholate, wherein the onium cholate is an iodonium cholate. Particularly preferred iodonium cholates are alkyloxyphenylphenyl iodonium cholates and most particularly preferred is octyloxyphenyphenyl iodonium cholate. The photoresist composition will not create nitrogen or other gaseous byproducts upon exposure to radiation, does not require water for photoactivation, has acceptable UV radiation transmission characteristics, and is thermally stable at temperatures required for solvent removal.

Analytical techniques for mechanistic characterization of EUV photoresists

NASA Astrophysics Data System (ADS)

Grzeskowiak, Steven; Narasimhan, Amrit; Murphy, Michael; Ackerman, Christian; Kaminsky, Jake; Brainard, Robert L.; Denbeaux, Greg

2017-03-01

Extreme ultraviolet (EUV, 13.5 nm) lithography is the prospective technology for high volume manufacturing by the microelectronics industry. Significant strides towards achieving adequate EUV source power and availability have been made recently, but a limited rate of improvement in photoresist performance still delays the implementation of EUV. Many fundamental questions remain to be answered about the exposure mechanisms of even the relatively well understood chemically amplified EUV photoresists. Moreover, several groups around the world are developing revolutionary metal-based resists whose EUV exposure mechanisms are even less understood. Here, we describe several evaluation techniques to help elucidate mechanistic details of EUV exposure mechanisms of chemically amplified and metal-based resists. EUV absorption coefficients are determined experimentally by measuring the transmission through a resist coated on a silicon nitride membrane. Photochemistry can be evaluated by monitoring small outgassing reaction products to provide insight into photoacid generator or metal-based resist reactivity. Spectroscopic techniques such as thin-film Fourier transform infrared (FTIR) spectroscopy can measure the chemical state of a photoresist system pre- and post-EUV exposure. Additionally, electrolysis can be used to study the interaction between photoresist components and low energy electrons. Collectively, these techniques improve our current understanding of photomechanisms for several EUV photoresist systems, which is needed to develop new, better performing materials needed for high volume manufacturing.

Process effects resulting from an increased BARC thickness

NASA Astrophysics Data System (ADS)

Eakin, Ronald J.; Detweiler, Shangting F.; Stagaman, Gregory J.; Tesauro, Mark R.; Spak, Mark A.; Dammel, Ralph R.

1997-07-01

Process improvements attributed to the use of bottom anti- reflective coatings (B.A.R.C.s) are well documented. As our experience with these materials improves, so does our understanding of additional optimization. Recent supplier experiments suggest an increase in the thickness of AZR BARLiTM (bottom anti-reflective layer i-line) solution to reduce photoresist swing curve ratios. Also, changes in thin film stack on common substrates can adversely affect the degree of photoresist reflective notching. It is therefore of extreme importance to determine optimum thickness(es) of a B.A.R.C. material to ensure maximum process potential. We document several process effects in the conversion of a SRAM test device (0.38 - 0.45 micrometers) from a 650 angstrom to a 2000 angstrom BARLiTM film thickness using conventional i-line photolithography. Critical dimension (CD) uniformity and depth of focus (DOF) are evaluated. Defect density between the two processes are compared before and after etch employing optical metrology and electrical test structures. Sensitivity of overlay as a function of BARLiTM film thickness is investigated as well.

Successful photoresist removal: incorporating chemistry, conditions, and equipment

NASA Astrophysics Data System (ADS)

Moore, John C.

2002-07-01

The material make-up of photoresists span a wide polarity range and chemistry. Resists contain reactive components which are photochemically triggered to convert and condense to forms that result in a solubility change. When designing a cleaning process, a knowledge of the resist chemistry is fundamental. A DNQ/novolak system may follow a simple dissolution model under normal conditions. However, when the same resist is sent through a dry etch process, crosslinking and metallic impregnation occurs to form a residue that is insoluble by simple dissolution. The same applies for negative-tone resists, where bonds must be broken and a high chemical interaction is needed to facilitate solvent penetration. Negative resists of different chemistry, such as the benzoin/acrylic, trazine/novolak, and azide/isoprene, must be addressed separately for specific polarity and reactant requirements. When dissolving and removing these crosslinked systems, benefits in formulated chemistries such as GenSolveTM and GenCleanTM are immediately observed. Once the chemistry is identified, conditions can be optimized with process design using temperature, agitation, and rinsing to achieve a robust process with a wide process latitude.

The fabrication of diversiform nanostructure forests based on residue nanomasks synthesized by oxygen plasma removal of photoresist

NASA Astrophysics Data System (ADS)

Mao, Haiyang; Wu, Di; Wu, Wengang; Xu, Jun; Hao, Yilong

2009-11-01

A simple lithography-free approach for fabricating diversiform nanostructure forests is presented. The key technique of the approach is that randomly distributed nanoscale residues can be synthesized on substrates simply by removing photoresist with oxygen plasma bombardment. These nanoresidues can function as masks in the subsequent etching process for nanopillars. By further spacer and then deep etching processes, a variety of forests composed of regular, tulip-like or hollow-head nanopillars as well as nanoneedles are successfully achieved in different etching conditions. The pillars have diameters of 30-200 nm and heights of 400 nm-3 µm. The needles reach several microns in height, with their tips less than 10 nm in diameter. Moreover, microstructures containing these nanostructure forests, such as surface microchannels, have also been fabricated. This approach is compatible with conventional micro/nano-electromechanical system (MEMS/NEMS) fabrication.

Distributed Feedback Laser Based on Single Crystal Perovskite

NASA Astrophysics Data System (ADS)

Sun, Shang; Xiao, Shumin; Song, Qinghai

2017-06-01

We demonstrate a single crystal perovskite based, with grating-structured photoresist on top, highly polarized distributed feedback laser. A lower laser threshold than the Fabry-Perot mode lasers from the same single crystal CH3NH3PbBr3 microplate was obtained. Single crystal CH3NH3PbBr3 microplates was synthesized with one-step solution processed precipitation method. Once the photoresist on top of the microplate was patterned with electron beam, the device was realized. This one-step fabrication process utilized the advantage of single crystal to the greatest extend. The ultra-low defect density in single crystalline microplate offer an opportunity for lower threshold lasing action compare with poly-crystal perovskite films. In the experiment, the lasing action based on the distributed feedback grating design was found with lower threshold and higher intensity than the Fabry-Perot mode lasers supported by the flat facets of the same microplate.

Microstructure fabrication process induced modulations in CVD graphene

DOE Office of Scientific and Technical Information (OSTI.GOV)

Matsubayashi, Akitomo, E-mail: amatsubayashi@albany.edu; Zhang, Zhenjun; Lee, Ji Ung

The systematic Raman spectroscopic study of a “mimicked” graphene device fabrication is presented. Upon photoresist baking, compressive stress is induced in the graphene which disappears after it is removed. The indirect irradiation from the electron beam (through the photoresist) does not significantly alter graphene characteristic Raman peaks indicating that graphene quality is preserved upon the exposure. The 2D peak shifts and the intensity ratio of 2D and G band, I(2D)/I(G), decreases upon direct metal deposition (Co and Py) suggesting that the electronic modulation occurs due to sp{sup 2} C-C bond weakening. In contrast, a thin metal oxide film deposited graphenemore » does not show either the significant 2D and G peaks shift or I(2D)/I(G) decrease upon the metal deposition suggesting the oxide protect the graphene quality in the fabrication process.« less

Parylene C as a Sacrificial Material for Microfabrication

NASA Technical Reports Server (NTRS)

Beamesderfer, Michael

2005-01-01

Parylene C has been investigated for use as a sacrificial material in microfabrication. Although Parylene C cannot be patterned lithographically like photoresists, it nevertheless extends the range of processing options by offering a set of properties that are suitable for microfabrication and are complementary to those of photoresists. The compatibility of Parylene C with several microfabrication processes was demonstrated in experiments in which a thin film of Parylene C was deposited on a silicon wafer, then several thin metal films were deposited and successfully patterned, utilizing the Parylene C pads as a sacrificial layer. The term "parylene" -- a contraction of "poly(para-xylene)" -- denotes a family of vapor-deposited polymers. In Parylene C (the most common form of parylene), a chlorine atom is substituted for one of the hydrogen atoms on the benzene ring of each para-xylene moiety. Heretofore, parylenes have been used as conformal coating materials in diverse applications.

Radiopaque Resists for Two-Photon Lithography To Enable Submicron 3D Imaging of Polymer Parts via X-ray Computed Tomography

DOE Office of Scientific and Technical Information (OSTI.GOV)

Saha, Sourabh K.; Oakdale, James S.; Cuadra, Jefferson A.

Two-photon lithography (TPL) is a high-resolution additive manufacturing (AM) technique capable of producing arbitrarily complex three-dimensional (3D) microstructures with features 2–3 orders of magnitude finer than human hair. This process finds numerous applications as a direct route toward the fabrication of novel optical and mechanical metamaterials, miniaturized optics, microfluidics, biological scaffolds, and various other intricate 3D parts. As TPL matures, metrology and inspection become a crucial step in the manufacturing process to ensure that the geometric form of the end product meets design specifications. X-ray-based computed tomography (CT) is a nondestructive technique that can provide this inspection capability for themore » evaluation of complex internal 3D structure. However, polymeric photoresists commonly used for TPL, as well as other forms of stereolithography, poorly attenuate X-rays due to the low atomic number (Z) of their constituent elements and therefore appear relatively transparent during imaging. We present the development of optically clear yet radiopaque photoresists for enhanced contrast under X-ray CT. We have synthesized iodinated acrylate monomers to formulate high-Z photoresist materials that are capable of forming 3D microstructures with sub-150 nm features. In addition, we have developed a formulation protocol to match the refractive index of the photoresists to the immersion medium of the objective lens so as to enable dip-in laser lithography, a direct laser writing technique for producing millimeter-tall structures. Our radiopaque photopolymer then resists increase X-ray attenuation by a factor of more than 10 times without sacrificing the sub-150 nm feature resolution or the millimeter-scale part height. Thus, our resists can successfully replace existing photopolymers to generate AM parts that are suitable for inspection via X-ray CT. By providing the “feedstock” for radiopaque AM parts, our resist formulation is expected to play a critical role in enabling fabrication of functional polymer parts to tight design tolerances.« less

Radiopaque Resists for Two-Photon Lithography To Enable Submicron 3D Imaging of Polymer Parts via X-ray Computed Tomography

DOE PAGES

Saha, Sourabh K.; Oakdale, James S.; Cuadra, Jefferson A.; ...

2017-11-24

Two-photon lithography (TPL) is a high-resolution additive manufacturing (AM) technique capable of producing arbitrarily complex three-dimensional (3D) microstructures with features 2–3 orders of magnitude finer than human hair. This process finds numerous applications as a direct route toward the fabrication of novel optical and mechanical metamaterials, miniaturized optics, microfluidics, biological scaffolds, and various other intricate 3D parts. As TPL matures, metrology and inspection become a crucial step in the manufacturing process to ensure that the geometric form of the end product meets design specifications. X-ray-based computed tomography (CT) is a nondestructive technique that can provide this inspection capability for themore » evaluation of complex internal 3D structure. However, polymeric photoresists commonly used for TPL, as well as other forms of stereolithography, poorly attenuate X-rays due to the low atomic number (Z) of their constituent elements and therefore appear relatively transparent during imaging. We present the development of optically clear yet radiopaque photoresists for enhanced contrast under X-ray CT. We have synthesized iodinated acrylate monomers to formulate high-Z photoresist materials that are capable of forming 3D microstructures with sub-150 nm features. In addition, we have developed a formulation protocol to match the refractive index of the photoresists to the immersion medium of the objective lens so as to enable dip-in laser lithography, a direct laser writing technique for producing millimeter-tall structures. Our radiopaque photopolymer then resists increase X-ray attenuation by a factor of more than 10 times without sacrificing the sub-150 nm feature resolution or the millimeter-scale part height. Thus, our resists can successfully replace existing photopolymers to generate AM parts that are suitable for inspection via X-ray CT. By providing the “feedstock” for radiopaque AM parts, our resist formulation is expected to play a critical role in enabling fabrication of functional polymer parts to tight design tolerances.« less

Negative-tone development of photoresists in environmentally friendly silicone fluids

NASA Astrophysics Data System (ADS)

Ouyang, Christine Y.; Lee, Jin-Kyun; Ober, Christopher K.

2012-03-01

The large amount of organic solvents and chemicals that are used in today's microelectronic fabrication process can lead to environmental, health and safety hazards. It is therefore necessary to design new materials and new processes to reduce the environmental impact of the lithographic process. In addition, as the feature sizes decrease, other issues such as pattern collapse, which is related to the undesirable high surface tension of the developers and rinse liquids, can occur and limit the resolution. In order to solve these issues, silicone fluids are chosen as alternative developing solvents in this paper. Silicone fluids, also known as linear methyl siloxanes, are a class of mild, non-polar solvents that are non-toxic, not ozone-depleting, and contribute little to global warming. They are considered as promising developers because of their environmental-friendliness and their unique physical properties such as low viscosity and low surface tension. Recently, there have been emerging interests in negative-tone development (NTD) due to its better ability in printing contact holes and trenches. It is also found that the performance of negative-tone development is closely related to the developing solvents. Silicone fluids are thus promising developers for NTD because of their non-polar nature and high contrast negative-tone images are expected with chemical amplification photoresists due to the high chemical contrast of chemical amplification. We have previously shown some successful NTD with conventional photoresists such as ESCAP in silicone fluids. In this paper, another commercially available TOK resist was utilized to study the NTD process in silicone fluids. Because small and non-polar molecules are intrinsically soluble in silicone fluids, we have designed a molecular glass resist for silicone fluids. Due to the low surface tension of silicone fluids, we are able achieve high aspect-ratio, high-resolution patterns without pattern collapse.

Lithographically patterned electrodeposition of gold, silver, and nickel nanoring arrays with widely tunable near-infrared plasmonic resonances.

PubMed

Halpern, Aaron R; Corn, Robert M

2013-02-26

A novel low-cost nanoring array fabrication method that combines the process of lithographically patterned nanoscale electrodeposition (LPNE) with colloidal lithography is described. Nanoring array fabrication was accomplished in three steps: (i) a thin (70 nm) sacrificial nickel or silver film was first vapor-deposited onto a plasma-etched packed colloidal monolayer; (ii) the polymer colloids were removed from the surface, a thin film of positive photoresist was applied, and a backside exposure of the photoresist was used to create a nanohole electrode array; (iii) this array of nanoscale cylindrical electrodes was then used for the electrodeposition of gold, silver, or nickel nanorings. Removal of the photoresist and sacrificial metal film yielded a nanoring array in which all of the nanoring dimensions were set independently: the inter-ring spacing was fixed by the colloidal radius, the radius of the nanorings was controlled by the plasma etching process, and the width of the nanorings was controlled by the electrodeposition process. A combination of scanning electron microscopy (SEM) measurements and Fourier transform near-infrared (FT-NIR) absorption spectroscopy were used to characterize the nanoring arrays. Nanoring arrays with radii from 200 to 400 nm exhibited a single strong NIR plasmonic resonance with an absorption maximum wavelength that varied linearly from 1.25 to 3.33 μm as predicted by a simple standing wave model linear antenna theory. This simple yet versatile nanoring array fabrication method was also used to electrodeposit concentric double gold nanoring arrays that exhibited multiple NIR plasmonic resonances.

Design and fabrication of directional diffractive device on glass substrate for multiview holographic 3D display

NASA Astrophysics Data System (ADS)

Su, Yanfeng; Cai, Zhijian; Liu, Quan; Zou, Wenlong; Guo, Peiliang; Wu, Jianhong

2018-01-01

Multiview holographic 3D display based on the nano-grating patterned directional diffractive device can provide 3D images with high resolution and wide viewing angle, which has attracted considerable attention. However, the current directional diffractive device fabricated on the photoresist is vulnerable to damage, which will lead to the short service life of the device. In this paper, we propose a directional diffractive device on glass substrate to increase its service life. In the design process, the period and the orientation of the nano-grating at each pixel are carefully calculated accordingly by the predefined position of the viewing zone, and the groove parameters are designed by analyzing the diffraction efficiency of the nano-grating pixel on glass substrate. In the experiment, a 4-view photoresist directional diffractive device with a full coverage of pixelated nano-grating arrays is efficiently fabricated by using an ultraviolet continuously variable spatial frequency lithography system, and then the nano-grating patterns on the photoresist are transferred to the glass substrate by combining the ion beam etching and the reactive ion beam etching for controlling the groove parameters precisely. The properties of the etched glass device are measured under the illumination of a collimated laser beam with a wavelength of 532nm. The experimental results demonstrate that the light utilization efficiency is improved and optimized in comparison with the photoresist device. Furthermore, the fabricated device on glass substrate is easier to be replicated and of better durability and practicability, which shows great potential in the commercial applications of 3D display terminal.

Controlling the Electrochemically Active Area of Carbon Fiber Microelectrodes by the Electrodeposition and Selective Removal of an Insulating Photoresist

PubMed Central

Lambie, Bradley A.; Orwar, Owe; Weber, Stephen G.

2008-01-01

A new and simple method permits control of the electrochemically active area of a carbon fiber microelectrode. An electrophoretic photoresist insulates the 10 μm diameter carbon fiber microelectrodes. Photolysis of the photoresist followed by immersion of the exposed area into a developing solution reveals electroactive carbon fiber surface. The electroactive surface area exposed can be controlled with a good degree of reproducibility. PMID:16841943

Using an SU-8 photoresist structure and cytochrome C thin film sensing material for a microbolometer.

PubMed

Lai, Jian-Lun; Liao, Chien-Jen; Su, Guo-Dung John

2012-11-27

There are two critical parameters for microbolometers: the temperature coefficient of resistance (TCR) of the sensing material, and the thermal conductance of the insulation structure. Cytochrome c protein, having a high TCR, is a good candidate for infrared detection. We can use SU-8 photoresist for the thermal insulation structure, given its low thermal conductance. In this study, we designed a platform structure based on a SU-8 photoresist. We fabricated an infrared sensing pixel and recorded a high TCR for this new structure. The SU-8 photoresist insulation structure was fabricated using the exposure dose method. We experimentally demonstrated high values of TCR from 22%/K to 25.7%/K, and the measured noise was 1.2 × 10(-8) V2/Hz at 60 Hz. When the bias current was 2 μA, the calculated voltage responsivity was 1.16 × 10(5) V/W. This study presents a new kind of microbolometer based on cytochrome c protein on top of an SU-8 photoresist platform that does not require expensive vacuum deposition equipment.

Using an SU-8 Photoresist Structure and Cytochrome C Thin Film Sensing Material for a Microbolometer

PubMed Central

Lai, Jian-Lun; Liao, Chien-Jen; Su, Guo-Dung John

2012-01-01

There are two critical parameters for microbolometers: the temperature coefficient of resistance (TCR) of the sensing material, and the thermal conductance of the insulation structure. Cytochrome c protein, having a high TCR, is a good candidate for infrared detection. We can use SU-8 photoresist for the thermal insulation structure, given its low thermal conductance. In this study, we designed a platform structure based on a SU-8 photoresist. We fabricated an infrared sensing pixel and recorded a high TCR for this new structure. The SU-8 photoresist insulation structure was fabricated using the exposure dose method. We experimentally demonstrated high values of TCR from 22%/K to 25.7%/K, and the measured noise was 1.2 × 10−8 V2/Hz at 60 Hz. When the bias current was 2 μA, the calculated voltage responsivity was 1.16 × 105 V/W. This study presents a new kind of microbolometer based on cytochrome c protein on top of an SU-8 photoresist platform that does not require expensive vacuum deposition equipment. PMID:23443384

Introduction to Photolithography: Preparation of Microscale Polymer Silhouettes

ERIC Educational Resources Information Center

Berkowski, Kimberly L.; Plunkett, Kyle N.; Moore, Jeffrey S.

2005-01-01

A study describes an easy procedure based on a negative photoresist process designed for junior high or high school students, which will introduce them to the key terms and concepts of photolithography. The experiment allows students to visualize the fundamental process behind microchip fabrication, observe the rapid prototyping enabled by such a…

100-nm gate lithography for double-gate transistors

NASA Astrophysics Data System (ADS)

Krasnoperova, Azalia A.; Zhang, Ying; Babich, Inna V.; Treichler, John; Yoon, Jung H.; Guarini, Kathryn; Solomon, Paul M.

2001-09-01

The double gate field effect transistor (FET) is an exploratory device that promises certain performance advantages compared to traditional CMOS FETs. It can be scaled down further than the traditional devices because of the greater electrostatic control by the gates on the channel (about twice as short a channel length for the same gate oxide thickness), has steeper sub-threshold slope and about double the current for the same width. This paper presents lithographic results for double gate FET's developed at IBM's T. J. Watson Research Center. The device is built on bonded wafers with top and bottom gates self-aligned to each other. The channel is sandwiched between the top and bottom polysilicon gates and the gate length is defined using DUV lithography. An alternating phase shift mask was used to pattern gates with critical dimensions of 75 nm, 100 nm and 125 nm in photoresist. 50 nm gates in photoresist have also been patterned by 20% over-exposure of nominal 100 nm lines. No trim mask was needed because of a specific way the device was laid out. UV110 photoresist from Shipley on AR-3 antireflective layer were used. Process windows, developed and etched patterns are presented.

EUV patterning using CAR or MOX photoresist at low dose exposure for sub 36nm pitch

NASA Astrophysics Data System (ADS)

Thibaut, Sophie; Raley, Angélique; Lazarrino, Frederic; Mao, Ming; De Simone, Danilo; Piumi, Daniele; Barla, Kathy; Ko, Akiteru; Metz, Andrew; Kumar, Kaushik; Biolsi, Peter

2018-04-01

The semiconductor industry has been pushing the limits of scalability by combining 193nm immersion lithography with multi-patterning techniques for several years. Those integrations have been declined in a wide variety of options to lower their cost but retain their inherent variability and process complexity. EUV lithography offers a much desired path that allows for direct print of line and space at 36nm pitch and below and effectively addresses issues like cycle time, intra-level overlay and mask count costs associated with multi-patterning. However it also brings its own sets of challenges. One of the major barrier to high volume manufacturing implementation has been hitting the 250W power exposure required for adequate throughput [1]. Enabling patterning using a lower dose resist could help move us closer to the HVM throughput targets assuming required performance for roughness and pattern transfer can be met. As plasma etching is known to reduce line edge roughness on 193nm lithography printed features [2], we investigate in this paper the level of roughness that can be achieved on EUV photoresist exposed at a lower dose through etch process optimization into a typical back end of line film stack. We will study 16nm lines printed at 32 and 34nm pitch. MOX and CAR photoresist performance will be compared. We will review step by step etch chemistry development to reach adequate selectivity and roughness reduction to successfully pattern the target layer.

Etching method for photoresists or polymers

NASA Technical Reports Server (NTRS)

Lerner, Narcinda R. (Inventor); Wydeven, Theodore J., Jr. (Inventor)

1991-01-01

A method for etching or removing polymers, photoresists, and organic contaminants from a substrate is disclosed. The method includes creating a more reactive gas species by producing a plasma discharge in a reactive gas such as oxygen and contacting the resulting gas species with a sacrificial solid organic material such as polyethylene or polyvinyl fluoride, reproducing a highly reactive gas species, which in turn etches the starting polymer, organic contaminant, or photoresist. The sample to be etched is located away from the plasma glow discharge region so as to avoid damaging the substrate by exposure to high energy particles and electric fields encountered in that region. Greatly increased etching rates are obtained. This method is highly effective for etching polymers such as polyimides and photoresists that are otherwise difficult or slow to etch downstream from an electric discharge in a reactive gas.

Photochemical conversion of tin-oxo cage compounds studied using hard x-ray photoelectron spectroscopy

NASA Astrophysics Data System (ADS)

Zhang, Yu; Haitjema, Jarich; Liu, Xiaomeng; Johansson, Fredrik; Lindblad, Andreas; Castellanos, Sonia; Ottosson, Niklas; Brouwer, Albert M.

2017-03-01

Several metal-containing molecular inorganic materials are currently considered as photoresists for extreme ultraviolet lithography (EUVL). This is primarily due to their high EUV absorption cross section and small building block size, properties which potentially allow both high sensitivity and resolution as well as low line-edge roughness. The photochemical reaction mechanisms that allow these kinds of materials to function as photoresists, however, are still poorly understood. As a step in this direction, we here discuss photochemical reactions upon deep UV (DUV) irradiation of a model negative-tone EUV photoresist material, namely the well-defined molecular tin-oxo cage compound [(SnR)12O14(OH)6]X2 (R = organic group; X = anion) which is spin coated to thin layers of 20 nm. The core electronic structure (Sn 3d, O 1s and C 1s) of fresh and DUV exposed films were then investigated using synchrotron radiationbased hard X-ray photoelectron spectroscopy (HAXPES). This method provides information about the structure and chemical state of the respective atoms in the material. We performed a comparative HAXPES study of the composition of the tin-oxo cage compound [(SnR)12O14(OH)6](OH)2, either fresh directly after spin-coated vs. DUV-exposed materials under either ambient condition or under a dry N2 atmosphere. Different chemical oxidation states and concentrations of atoms and atom types in the fresh and exposed films were found. We further found that the chemistry resulting from exposure in air and N2 is strikingly different, clearly illustrating the influence of film-gas interactions on the (photo)chemical processes that eventually determine the photoresist. Finally, a mechanistic hypothesis for the basic DUV photoreactions in molecular tin-oxo cages is proposed.

Dyed positive photoresist employing curcumin for notching control

DOE Office of Scientific and Technical Information (OSTI.GOV)

Renschler, C.L.; Lemen, E.K.; Rodriquez, J.L.

1989-01-01

A variety of dyes have been proposed as absorbers for photoresists. The nonbleachable absorbance incorporated in this way can result in a reduction in standing waves and/or reflective notching (nonuniform linewidths due to reflections off the substrate). In addition, it can provide increased visual contrast at the patterned resist inspection stage. A variation on the visual contrast improvement involves the use of a dye which fluoresces, allowing for more precise resist metrology. The deposition and growth processes used here result in large oxide and polycrystalline silicon steps with high aspect ratios. Processes such as LOCOS which allow less severe topography,more » are inherently radiation soft and cannot be used on our fabrication process. The resulting steep sidewalls make metal coverage and etch significantly more difficult. Thus, the glass layer which isolates metal conductors from oxide steps is smoothed with either a thermal reflow or a plasma etch of a partially planarized coating to reduce the aspect ratio of the step. This results in metal coverage with a 45{degrees} angle at each step, which causes severe notching. This paper reports on an attempt to develop a resist which would eliminate this notching problem. Although the addition of unbleachable dye to photoresist for the control of notching is well established, most of the dyes used have one or more serious shortcomings, such as a poor match of the absorption spectrum with the exposure spectrum or low solubility in resist. Severe notching requires the use of a resist dye with optimized physical and spectroscopic properties to allow high optical absorbance to be achieved without the onset of other problems such as particulate formation or changes in thermal properties.« less

Study on thick film spin-on carbon hardmask

NASA Astrophysics Data System (ADS)

Kim, Taeho; Kim, Youngmin; Hwang, Sunmin; Lee, Hyunsoo; Han, Miyeon; Lim, Sanghak

2017-03-01

A thick spin-on carbon hardmask (SOH) material is designed to overcome inherent problems of amorphous deposited carbon layer (ACL) and thick photoresist. For ACL in use of semiconductor production process, especially when film thickness from sub-micrometer up to few micrometers is required, not only its inherent low transparency at long wavelength light often causes alignment problems with under layers, but also considerable variation of film thickness within a wafer can also cause patterning problems. To avoid these issues, a thick SOH is designed with monomers of high transparency and good solubility at the same time. In comparison with photoresist, the SOH has good etch resistance and high thermal stability, and it provides wide process window of decreased film thickness and increased thermal budget up to 400°C after processes such as high temperature deposition of SiON. In order to achieve high thickness along with uniform film, many solvent factors was considered such as solubility parameter, surface tension, vapor pressure, and others. By optimizing many solvent factors, we were able to develop a product with a good coating performance

The effect of materials selection on metals reduction in propylene glycol methyl ether acetate, PGMEA

NASA Astrophysics Data System (ADS)

Entezarian, Majid; Geiger, Bob

2016-03-01

The trend in microelectronics fabrication is to produce nano-features measuring down to 10 nm and finer. The PPT levels of organic and inorganic contaminants in the photoresist, solvent and cleaning solutions are becoming a major processing variable affecting the process capability and defectivity. The photoresist usually contains gels, metals, and particulates that could interfere with the lithography process and cause microbridging defects. Nano filters of 5 nm polypropylene, 5 nm polyethylene, and 10 nm natural nylon were used to filter propylene glycol methyl ether acetate PGMEA containing 50 ppb of Na, Mg, Al, Ca, Cr, Mn, Fe, Cu, Zn, and Pb. All filters were effective in removing trivalent Al, Cr, and Fe metals indicating the mechanism for their removal as mechanical sieving. However, the nylon was also very effective in removing the divalent metals showing adsorptive properties. Furthermore, the metal removal of the nylon membrane was studied as a function of surface chemistry. Natural and charged 40 nm nylon membranes were tested and found that charged nylon is more effective for metal removal.

Extreme ultraviolet patterning of tin-oxo cages

NASA Astrophysics Data System (ADS)

Haitjema, Jarich; Zhang, Yu; Vockenhuber, Michaela; Kazazis, Dimitrios; Ekinci, Yasin; Brouwer, Albert M.

2017-07-01

We report on the extreme ultraviolet (EUV) patterning performance of tin-oxo cages. These cage molecules were already known to function as a negative tone photoresist for EUV radiation, but in this work, we significantly optimized their performance. Our results show that sensitivity and resolution are only meaningful photoresist parameters if the process conditions are optimized. We focus on contrast curves of the materials using large area EUV exposures and patterning of the cages using EUV interference lithography. It is shown that baking steps, such as postexposure baking, can significantly affect both the sensitivity and contrast in the open-frame experiments as well as the patterning experiments. A layer thickness increase reduced the necessary dose to induce a solubility change but decreased the patterning quality. The patterning experiments were affected by minor changes in processing conditions such as an increased rinsing time. In addition, we show that the anions of the cage can influence the sensitivity and quality of the patterning, probably through their effect on physical properties of the materials.

Method of Preparation AZP4330 PR Pattern with Edge Slope 40°

NASA Astrophysics Data System (ADS)

Wu, Jie; Zhao, Hongyuan; Yu, Yuanwei; Zhu, Jian

2018-03-01

When the edge which is under the multi-film is more steep or angular, the stress in the multilayer film near the edge is concentrated, this situation will greatly reduce the reliability of electronic components. And sometimes, we need some special structure such as a slope with a specific angle in the MEMS, so that the metal line can take the signal to the output pad through the slope instead of deep step. To cover these problems, the lithography method of preparing the structure with edge slope is studied. In this paper, based on the Kirchhoff scalar diffraction theory we try to change the contact exposure gap and the post-baking time at the specific temperature to find out the effect about the edge angle of the photoresist. After test by SEM, the results were presented by using AZP4330 photoresist, we can get the PR Pattern with edge slope 40° of the process and the specific process parameters.

Experimental determination of the impact of polysilicon LER on sub-100-nm transistor performance

NASA Astrophysics Data System (ADS)

Patterson, Kyle; Sturtevant, John L.; Alvis, John R.; Benavides, Nancy; Bonser, Douglas; Cave, Nigel; Nelson-Thomas, Carla; Taylor, William D.; Turnquest, Karen L.

2001-08-01

Photoresist line edge roughness (LER) has long been feared as a potential limitation to the application of various patterning technologies to actual devices. While this concern seems reasonable, experimental verification has proved elusive and thus LER specifications are typically without solid parametric rationale. We report here the transistor device performance impact of deliberate variations of polysilicon gate LER. LER magnitude was attenuated by more than a factor of 5 by altering the photoresist type and thickness, substrate reflectivity, masking approach, and etch process. The polysilicon gate LER for nominally 70 - 150 nm devices was quantified using digital image processing of SEM images, and compared to gate leakage and drive current for variable length and width transistors. With such comparisons, realistic LER specifications can be made for a given transistor. It was found that subtle cosmetic LER differences are often not discernable electrically, thus providing hope that LER will not limit transistor performance as the industry migrates to sub-100 nm patterning.

Adaptive wettability-enhanced surfaces ordered on molded etched substrates using shrink film

NASA Astrophysics Data System (ADS)

Jayadev, Shreshta; Pegan, Jonathan; Dyer, David; McLane, Jolie; Lim, Jessica; Khine, Michelle

2013-01-01

Superhydrophobic surfaces in nature exhibit desirable properties including self-cleaning, bacterial resistance, and flight efficiency. However, creating such intricate multi-scale features with conventional fabrication approaches is difficult, expensive, and not scalable. By patterning photoresist on pre-stressed shrink-wrap film, which contracts by 95% in surface area when heated, such features over large areas can be obtained easily. Photoresist serves as a dry etch mask to create complex and high-aspect ratio microstructures in the film. Using a double-shrink process, we introduce adaptive wettability-enhanced surfaces ordered on molded etched (AWESOME) substrates. We first create a mask out of the children’s toy ‘Shrinky-Dinks’ by printing dots using a laserjet printer. Heating this thermoplastic sheet causes the printed dots to shrink to a fraction of their original size. We then lithographically transfer the inverse pattern onto photoresist-coated shrink-wrap polyolefin film. The film is then plasma etched. After shrinking, the film serves as a high-aspect ratio mold for polydimethylsiloxane, creating a superhydrophobic surface with water contact angles >150° and sliding angles <10°. We pattern a microarray of ‘sticky’ spots with a dramatically different sliding angle compared to that of the superhydrophobic region, enabling microtiter-plate type assays without the need for a well plate.

Fabrication of an artificial nanosucker device with a large area nanotube array of metallic glass.

PubMed

Chen, Wei-Ting; Manivannan, Karthikeyan; Yu, Chia-Chi; Chu, Jinn P; Chen, Jem-Kun

2018-01-18

The concurrent attachment and detachment movements of geckos on virtually any type of surface via their foot pads have inspired us to develop a thermal device with numerous arrangements of a multi-layer thin film together with electrodes that can help modify the temperature of the surface via application of a voltage. A sequential fabrication process was employed on a large-scale integration to generate well-defined contact hole arrays of photoresist for use as templates on the electrode-based device. The photoresist templates were then subjected to sputter deposition of the metallic glass Zr 55 Cu 30 Al 10 Ni 5 . Consequently, a metallic glass nanotube (MGNT) array having a nominal wall thickness of 100 nm was obtained after removal of the photoresist template. When a water droplet was placed on the MGNT array, close nanochambers of metallic glass were formed. By applying voltage, the surface was heated to increase the pressure inside the nanochambers; this generated an expanding force that raised the droplet; thus, the static water contact angle (SWCA) was increased. In contrast, a sucking force was generated during surface cooling, which decreased the SWCA. Our fabrication strategy exploits the MGNT array surface as nanosuckers, which can mimic the climbing aptitude of geckos as they attach to (>10 N m -2 ) and detach from (0.26 N m -2 ) surfaces at 0.5 and 3 V of applied voltage, respectively. Thus, the climbing aptitude of geckos can be mimicked by employing the processing strategy presented herein for the development of artificial foot pads.

Reductive stripping process for the recovery of uranium from wet-process phosphoric acid

DOEpatents

Hurst, Fred J.; Crouse, David J.

1984-01-01

A reductive stripping flow sheet for recovery of uranium from wet-process phosphoric acid is described. Uranium is stripped from a uranium-loaded organic phase by a redox reaction converting the uranyl to uranous ion. The uranous ion is reoxidized to the uranyl oxidation state to form an aqueous feed solution highly concentrated in uranium. Processing of this feed through a second solvent extraction cycle requires far less stripping reagent as compared to a flow sheet which does not include the reductive stripping reaction.

Sequential infiltration synthesis for enhancing multiple-patterning lithography

DOE Office of Scientific and Technical Information (OSTI.GOV)

Darling, Seth B.; Elam, Jeffrey W.; Tseng, Yu-Chih

Simplified methods of multiple-patterning photolithography using sequential infiltration synthesis to modify the photoresist such that it withstands plasma etching better than unmodified resist and replaces one or more hard masks and/or a freezing step in MPL processes including litho-etch-litho-etch photolithography or litho-freeze-litho-etch photolithography.

Thermodynamic Behavior Research Analysis of Twin-roll Casting Lead Alloy Strip Process

NASA Astrophysics Data System (ADS)

Jiang, Chengcan; Rui, Yannian

2017-03-01

The thermodynamic behavior of twin-roll casting (TRC) lead alloy strip process directly affects the forming of the lead strip, the quality of the lead strip and the production efficiency. However, there is little research on the thermodynamics of lead alloy strip at home and abroad. The TRC lead process is studied in four parameters: the pouring temperature of molten lead, the depth of molten pool, the roll casting speed, and the rolling thickness of continuous casting. Firstly, the thermodynamic model for TRC lead process is built. Secondly, the thermodynamic behavior of the TRC process is simulated with the use of Fluent. Through the thermodynamics research and analysis, the process parameters of cast rolling lead strip can be obtained: the pouring temperature of molten lead: 360-400 °C, the depth of molten pool: 250-300 mm, the roll casting speed: 2.5-3 m/min, the rolling thickness: 8-9 mm. Based on the above process parameters, the optimal parameters(the pouring temperature of molten lead: 375-390 °C, the depth of molten pool: 285-300 mm, the roll casting speed: 2.75-3 m/min, the rolling thickness: 8.5-9 mm) can be gained with the use of the orthogonal experiment. Finally, the engineering test of TRC lead alloy strip is carried out and the test proves the thermodynamic model is scientific, necessary and correct. In this paper, a detailed study on the thermodynamic behavior of lead alloy strip is carried out and the process parameters of lead strip forming are obtained through the research, which provide an effective theoretical guide for TRC lead alloy strip process.

Advanced lithographic filtration and contamination control for 14nm node and beyond semiconductor processes

NASA Astrophysics Data System (ADS)

Varanasi, Rao; Mesawich, Michael; Connor, Patrick; Johnson, Lawrence

2017-03-01

Two versions of a specific 2nm rated filter containing filtration medium and all other components produced from high density polyethylene (HDPE), one subjected to standard cleaning, the other to specialized ultra-cleaning, were evaluated in terms of their cleanliness characteristics, and also defectivity of wafers processed with photoresist filtered through each. With respect to inherent cleanliness, the ultraclean version exhibited a 70% reduction in total metal extractables and 90% reduction in organics extractables compared to the standard clean version. In terms of particulate cleanliness, the ultraclean version achieved stability of effluent particles 30nm and larger in about half the time required by the standard clean version, also exhibiting effluent levels at stability almost 90% lower. In evaluating defectivity of blanket wafers processed with photoresist filtered through either version, initial defect density while using the ultraclean version was about half that observed when the standard clean version was in service, with defectivity also falling more rapidly during subsequent usage of the ultraclean version compared to the standard clean version. Similar behavior was observed for patterned wafers, where the enhanced defect reduction was primarily of bridging defects. The filter evaluation and actual process-oriented results demonstrate the extreme value in using filtration designed possessing the optimal intrinsic characteristics, but with further improvements possible through enhanced cleaning processes

Superconducting microcircuitry by the microlithographic patterning of superconducting compounds and related materials

DOEpatents

Coppa, N.V.

1993-08-24

A method is described of producing superconducting microcircuits comprising the steps of: depositing a thin film of Ba[sub 2]Cu[sub 3]O[sub 5+x](O < x < 1) onto a substrate; depositing a thin film of a dopant onto said thin film of Ba[sub 2]Cu[sub 3]O[sub 5+x]; depositing a photoresist onto said thin film of a dopant; shining light through a mask containing a pattern for a desired circuit configuration and onto said photoresist; developing said photoresist to remove portions of said photoresist shined by the light and to selectively expose said dopant film; etching said selectively exposed dopant film from said thin film of Ba[sub 2]Cu[sub 3]O[sub 5+x] to form a pattern of dopant; and heating said substrate at a temperature and for a period of time sufficient to diffuse and react said pattern of dopant with said thin film of Ba[sub 2]Cu[sub 3]O[sub 5+x].

Integration of stripping of fines slurry in a coking and gasification process

DOEpatents

DeGeorge, Charles W.

1980-01-01

In an integrated fluid coking and gasification process wherein a stream of fluidized solids is passed from a fluidized bed coking zone to a second fluidized bed and wherein entrained solid fines are recovered by a wet scrubbing process and wherein the resulting solids-liquid slurry is stripped to remove acidic gases, the stripped vapors of the stripping zone are sent to the gas cleanup stage of the gasification product gas. The improved stripping integration is particularly useful in the combination coal liquefaction process, fluid coking of bottoms of the coal liquefaction zone and gasification of the product coke.

Greyscale Photolithography for Multilayer PZT Microelectromechanical Systems (MEMS) Device Applications

DTIC Science & Technology

We present development of a process to perform greyscale photolithography on a 2.55-m thick photoresist in order to transfer tiered and sloped...platinum or iridium oxide (IrO2) electrodes above and below each layer. Process variables including resist rehydration , focus of the exposure, and UV cure...bake temperature were optimized to produce the best greyscale profile through the thickness of the resist.

Experimental, theoretical, and device application development of nanoscale focused electron-beam-induced deposition

NASA Astrophysics Data System (ADS)

Randolph, Steven Jeffrey

Electron-beam-induced deposition (EBID) is a highly versatile nanofabrication technique that allows for growth of a variety of materials with nanoscale precision and resolution. While several applications and studies of EBID have been reported and published, there is still a significant lack of understanding of the complex mechanisms involved in the process. Consequently, EBID process control is, in general, limited and certain common experimental results regarding nanofiber growth have yet to be fully explained. Such anomalous results have been addressed in this work both experimentally and by computer simulation. Specifically, a correlation between SiOx nanofiber deposition observations and the phenomenon of electron beam heating (EBH) was shown by comparison of thermal computer models and experimental results. Depending on the beam energy, beam current, and nanostructure geometry, the heat generated can be substantial and may influence the deposition rate. Temperature dependent EBID growth experiments qualitatively verified the results of the EBH model. Additionally, EBID was used to produce surface image layers for maskless, direct-write lithography (MDL). A single layer process used directly written SiOx features as a masking layer for amorphous silicon thin films. A bilayer process implemented a secondary masking layer consisting of standard photoresist into which a pattern---directly written by EBID tungsten---was transferred. The single layer process was found to be extremely sensitive to the etch selectivity of the plasma etch. In the bilayer process, EBID tungsten was written onto photoresist and the pattern transferred by means of oxygen plasma dry development following a brief refractory descum. Conditions were developed to reduce the spatial spread of electrons in the photoresist layer and obtain ˜ 35 nm lines. Finally, an EBID-based technique for field emitter repair was applied to the Digital Electrostatically focused e-beam Array Lithography (DEAL) parallel electron beam lithography configuration to repair damaged or missing carbon nanofiber cathodes. The I-V response and lithography results from EBID tungsten-based devices were comparable to CNF-based DEAL devices indicating a successful repair technique.

Process for removing an organic compound from water

DOEpatents

Baker, Richard W.; Kaschemekat, Jurgen; Wijmans, Johannes G.; Kamaruddin, Henky D.

1993-12-28

A process for removing organic compounds from water is disclosed. The process involves gas stripping followed by membrane separation treatment of the stripping gas. The stripping step can be carried out using one or multiple gas strippers and using air or any other gas as stripping gas. The membrane separation step can be carried out using a single-stage membrane unit or a multistage unit. Apparatus for carrying out the process is also disclosed. The process is particularly suited for treatment of contaminated groundwater or industrial wastewater.

Double-deprotected chemically amplified photoresists (DD-CAMP): higher-order lithography

NASA Astrophysics Data System (ADS)

Earley, William; Soucie, Deanna; Hosoi, Kenji; Takahashi, Arata; Aoki, Takashi; Cardineau, Brian; Miyauchi, Koichi; Chun, Jay; O'Sullivan, Michael; Brainard, Robert

2017-03-01

The synthesis and lithographic evaluation of 193-nm and EUV photoresists that utilize a higher-order reaction mechanism of deprotection is presented. Unique polymers utilize novel blocking groups that require two acid-catalyzed steps to be removed. When these steps occur with comparable reaction rates, the overall reaction can be higher order (<= 1.85). The LWR of these resists is plotted against PEB time for a variety of compounds to acquire insight into the effectiveness of the proposed higher-order mechanisms. Evidence acquired during testing of these novel photoresist materials supports the conclusion that higher-order reaction kinetics leads to improved LWR vs. control resists.

Quadrilateral Micro-Hole Array Machining on Invar Thin Film: Wet Etching and Electrochemical Fusion Machining

PubMed Central

Choi, Woong-Kirl; Kim, Seong-Hyun; Choi, Seung-Geon; Lee, Eun-Sang

2018-01-01

Ultra-precision products which contain a micro-hole array have recently shown remarkable demand growth in many fields, especially in the semiconductor and display industries. Photoresist etching and electrochemical machining are widely known as precision methods for machining micro-holes with no residual stress and lower surface roughness on the fabricated products. The Invar shadow masks used for organic light-emitting diodes (OLEDs) contain numerous micro-holes and are currently machined by a photoresist etching method. However, this method has several problems, such as uncontrollable hole machining accuracy, non-etched areas, and overcutting. To solve these problems, a machining method that combines photoresist etching and electrochemical machining can be applied. In this study, negative photoresist with a quadrilateral hole array pattern was dry coated onto 30-µm-thick Invar thin film, and then exposure and development were carried out. After that, photoresist single-side wet etching and a fusion method of wet etching-electrochemical machining were used to machine micro-holes on the Invar. The hole machining geometry, surface quality, and overcutting characteristics of the methods were studied. Wet etching and electrochemical fusion machining can improve the accuracy and surface quality. The overcutting phenomenon can also be controlled by the fusion machining. Experimental results show that the proposed method is promising for the fabrication of Invar film shadow masks. PMID:29351235

A simplified method for generating periodic nanostructures by interference lithography without the use of an anti-reflection coating

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kapon, Omree; Muallem, Merav; Palatnik, Alex

Interference lithography has proven to be a useful technique for generating periodic sub-diffraction limited nanostructures. Interference lithography can be implemented by exposing a photoresist polymer to laser light using a two-beam arrangement or more simply a one beam configuration based on a Lloyd's Mirror Interferometer. For typical photoresist layers, an anti-reflection coating must be deposited on the substrate to prevent adverse reflections from cancelling the holographic pattern of the interfering beams. For silicon substrates, such coatings are typically multilayered and complex in composition. By thinning the photoresist layer to a thickness well below the quarter wavelength of the exposing beam,more » we demonstrate that interference gratings can be generated without an anti-reflection coating on the substrate. We used ammonium dichromate doped polyvinyl alcohol as the positive photoresist because it provides excellent pinhole free layers down to thicknesses of 40 nm, and can be cross-linked by a low-cost single mode 457 nm laser, and can be etched in water. Gratings with a period of 320 nm and depth of 4 nm were realized, as well as a variety of morphologies depending on the photoresist thickness. This simplified interference lithography technique promises to be useful for generating periodic nanostructures with high fidelity and minimal substrate treatments.« less

Multiphysical FE-analysis of a front-end bending phenomenon in a hot strip mill

NASA Astrophysics Data System (ADS)

Ilmola, Joonas; Seppälä, Oskari; Leinonen, Olli; Pohjonen, Aarne; Larkiola, Jari; Jokisaari, Juha; Putaansuu, Eero

2018-05-01

In hot steel rolling processes, a slab is generally rolled to a transfer bar in a roughing process and to a strip in a hot strip rolling process. Over several rolling passes the front-end may bend upward or downward due to asymmetrical rolling conditions causing entry problems in the next rolling pass. Many different factors may affect the front-end bending phenomenon and are very challenging to measure. Thus, a customized finite element model is designed and built to simulate the front-end bending phenomenon in a hot strip rolling process. To simulate the functioning of the hot strip mill precisely, automated controlling logic of the mill must be considered. In this paper we studied the effect of roll bite friction conditions and amount of reduction on the front-end bending phenomenon in a hot strip rolling process.

Coating and Patterning Functional Materials for Large Area Electrofluidic Arrays

PubMed Central

Wu, Hao; Tang, Biao; Hayes, Robert A.; Dou, Yingying; Guo, Yuanyuan; Jiang, Hongwei; Zhou, Guofu

2016-01-01

Industrialization of electrofluidic devices requires both high performance coating laminates and efficient material utilization on large area substrates. Here we show that screen printing can be effectively used to provide homogeneous pin-hole free patterned amorphous fluoropolymer dielectric layers to provide both the insulating and fluidic reversibility required for devices. Subsequently, we over-coat photoresist using slit coating on this normally extremely hydrophobic layer. In this way, we are able to pattern the photoresist by conventional lithography to provide the chemical contrast required for liquids dosing by self-assembly and highly-reversible electrofluidic switching. Materials, interfacial chemistry, and processing all contribute to the provision of the required engineered substrate properties. Coating homogeneity as characterized by metrology and device performance data are used to validate the methodology, which is well-suited for transfer to high volume production in existing LCD cell-making facilities. PMID:28773826

Coating and Patterning Functional Materials for Large Area Electrofluidic Arrays.

PubMed

Wu, Hao; Tang, Biao; Hayes, Robert A; Dou, Yingying; Guo, Yuanyuan; Jiang, Hongwei; Zhou, Guofu

2016-08-19

Industrialization of electrofluidic devices requires both high performance coating laminates and efficient material utilization on large area substrates. Here we show that screen printing can be effectively used to provide homogeneous pin-hole free patterned amorphous fluoropolymer dielectric layers to provide both the insulating and fluidic reversibility required for devices. Subsequently, we over-coat photoresist using slit coating on this normally extremely hydrophobic layer. In this way, we are able to pattern the photoresist by conventional lithography to provide the chemical contrast required for liquids dosing by self-assembly and highly-reversible electrofluidic switching. Materials, interfacial chemistry, and processing all contribute to the provision of the required engineered substrate properties. Coating homogeneity as characterized by metrology and device performance data are used to validate the methodology, which is well-suited for transfer to high volume production in existing LCD cell-making facilities.

New dual-curvature microlens array with a high fill-factor for organic light emitting diode modules

NASA Astrophysics Data System (ADS)

Lin, Tsung-Hung; Yang, Hsiharng; Chao, Ching-Kong; Shui, Hung-Chi

2013-09-01

A new method for fabricating a novel dual-curvature microlens array with a high fill-factor using proximity printing in a lithography process is reported. The lens shapes include dual-curvature, which is a novel shape composed of triangles and hexagons. We utilized UV proximity printing by controlling a printing gap between the mask and substrate. The designed high density microlens array pattern can fabricate a dual-curvature microlens array with a high fill-factor in a photoresist material. It is due to the UV light diffraction which deflects away from the aperture edges and produces a certain exposure in the photoresist material outside the aperture edges. A dual-curvature microlens array with a height ratio of 0.48 can boost axial luminance up to 22%. Therefore, the novel dual-curvature microlens array offers an economical solution for increasing the luminance of organic light emitting diodes.

Process for protecting bonded components from plating shorts

DOEpatents

Tarte, Lisa A.; Bonde, Wayne L.; Carey, Paul G.; Contolini, Robert J.; McCarthy, Anthony M.

2000-01-01

A method which protects the region between a component and the substrate onto which the components is bonded using an electrically insulating fillet of photoresist. The fillet protects the regions from subsequent plating with metal and therefore shorting the plated conductors which run down the sides of the component and onto the substrate.

Print-to-pattern dry film photoresist lithography

NASA Astrophysics Data System (ADS)

Garland, Shaun P.; Murphy, Terrence M., Jr.; Pan, Tingrui

2014-05-01

Here we present facile microfabrication processes, referred to as print-to-pattern dry film photoresist (DFP) lithography, that utilize the combined advantages of wax printing and DFP to produce micropatterned substrates with high resolution over a large surface area in a non-cleanroom setting. The print-to-pattern methods can be performed in an out-of-cleanroom environment making microfabrication much more accessible to minimally equipped laboratories. Two different approaches employing either wax photomasks or wax etchmasks from a solid ink desktop printer have been demonstrated that allow the DFP to be processed in a negative tone or positive tone fashion, respectively, with resolutions of 100 µm. The effect of wax melting on resolution and as a bonding material was also characterized. In addition, solid ink printers have the capacity to pattern large areas with high resolution, which was demonstrated by stacking DFP layers in a 50 mm × 50 mm woven pattern with 1 mm features. By using an office printer to generate the masking patterns, the mask designs can be easily altered in a graphic user interface to enable rapid prototyping.

Low-temperature technique for thick film resist stabilization and curing

NASA Astrophysics Data System (ADS)

Minter, Jason P.; Wong, Selmer S.; Marlowe, Trey; Ross, Matthew F.; Narcy, Mark E.; Livesay, William R.

1999-06-01

For a range of thick film photoresist applications, including MeV ion implant processing, thin film head manufacturing, and microelectromechanical systems processing, there is a need for a low-temperature method for resist stabilization and curing. Traditional methods of stabilizing or curing resist films have relied on thermal cycling, which may not be desirable due to device temperature limitations or thermally-induced distortion of the resist features.

Use of Sacrificial Nanoparticles to Remove the Effects of Shot-noise in Contact Holes Fabricated by E-beam Lithography.

PubMed

Rananavare, Shankar B; Morakinyo, Moshood K

2017-02-12

Nano-patterns fabricated with extreme ultraviolet (EUV) or electron-beam (E-beam) lithography exhibit unexpected variations in size. This variation has been attributed to statistical fluctuations in the number of photons/electrons arriving at a given nano-region arising from shot-noise (SN). The SN varies inversely to the square root of a number of photons/electrons. For a fixed dosage, the SN is larger in EUV and E-beam lithographies than for traditional (193 nm) optical lithography. Bottom-up and top-down patterning approaches are combined to minimize the effects of shot noise in nano-hole patterning. Specifically, an amino-silane surfactant self-assembles on a silicon wafer that is subsequently spin-coated with a 100 nm film of a PMMA-based E-beam photoresist. Exposure to the E-beam and the subsequent development uncover the underlying surfactant film at the bottoms of the holes. Dipping the wafer in a suspension of negatively charged, citrate-capped, 20 nm gold nanoparticles (GNP) deposits one particle per hole. The exposed positively charged surfactant film in the hole electrostatically funnels the negatively charged nanoparticle to the center of an exposed hole, which permanently fixes the positional registry. Next, by heating near the glass transition temperature of the photoresist polymer, the photoresist film reflows and engulfs the nanoparticles. This process erases the holes affected by SN but leaves the deposited GNPs locked in place by strong electrostatic binding. Treatment with oxygen plasma exposes the GNPs by etching a thin layer of the photoresist. Wet-etching the exposed GNPs with a solution of I2/KI yields uniform holes located at the center of indentations patterned by E-beam lithography. The experiments presented show that the approach reduces the variation in the size of the holes caused by SN from 35% to below 10%. The method extends the patterning limits of transistor contact holes to below 20 nm.

Reconditioning of semiconductor substrates to remove photoresist during semiconductor device fabrication

DOEpatents

Farino, Anthony J.

2004-01-27

A method for reconditioning the surface of a semiconductor substrate to remove an unwanted (i.e. defective) layer of photoresist is disclosed. The method adapts a conventional automated spinner which is used to rotate the substrate at high speed while a stream of a first solvent (e.g. acetone) is used to dissolve the photoresist. A stream of a second solvent (e.g. methanol) is then used to clean the substrate at a lower speed, with the substrate being allowed to dry with continued rotation. The method of the present invention can be used within a photolithography track so that the substrates need never leave the track for reconditioning.

Inductively coupled plasma etching of GaAs low loss waveguides for a traveling waveguide polarization converter, using chlorine chemistry

NASA Astrophysics Data System (ADS)

Lu, J.; Meng, X.; Springthorpe, A. J.; Shepherd, F. R.; Poirier, M.

2004-05-01

A traveling waveguide polarization converter [M. Poirier et al.] has been developed, which involves long, low loss, weakly confined waveguides etched in GaAs (epitaxially grown by molecular beam epitaxy), with electroplated ``T electrodes'' distributed along the etched floor adjacent to the ridge walls, and airbridge interconnect metallization. This article describes the development of the waveguide fabrication, based on inductively coupled plasma (ICP) etching of GaAs using Cl2 chemistry; the special processes required to fabricate the electrodes and metallization [X. Meng et al.], and the device characteristics [M. Poirier et al.], are described elsewhere. The required waveguide has dimensions nominally 4 μm wide and 2.1 μm deep, with dimensional tolerances ~0.1 μm across the wafer and wafer to wafer. A vertical etch profile with very smooth sidewalls and floors is required to enable the plated metal electrodes to be fabricated within 0.1 μm of the ridge. The ridges were fabricated using Cl2 ICP etching and a photoresist mask patterned with an I-line stepper; He backside cooling, combined with an electrostatic chuck, was employed to ensure good heat transfer to prevent resist reticulation. The experimental results showed that the ridge profile is very sensitive to ICP power and platen rf power. High ICP power and low platen power tend to result in more isotropic etching, whereas increasing platen power increases the photoresist etch rate, which causes rougher ridge sidewalls. No strong dependence of GaAs etch rate and ridge profile were observed with small changes in process temperature (chuck temperature). However, when the chuck temperature was decreased from 25 to 0 °C, etch uniformity across a 3 in. wafer improved from 6% to 3%. Photoresist and polymer residues present after the ICP etch were removed using a combination of wet and dry processes. .

Lithographically defined microporous carbon-composite structures

DOEpatents

Burckel, David Bruce; Washburn, Cody M.; Lambert, Timothy N.; Finnegan, Patrick Sean; Wheeler, David R.

2016-12-06

A microporous carbon scaffold is produced by lithographically patterning a carbon-containing photoresist, followed by pyrolysis of the developed resist structure. Prior to exposure, the photoresist is loaded with a nanoparticulate material. After pyrolysis, the nanonparticulate material is dispersed in, and intimately mixed with, the carbonaceous material of the scaffold, thereby yielding a carbon composite structure.

Reductive stripping process for uranium recovery from organic extracts

DOEpatents

Hurst, F.J. Jr.

1983-06-16

In the reductive stripping of uranium from an organic extractant in a uranium recovery process, the use of phosphoric acid having a molarity in the range of 8 to 10 increases the efficiency of the reductive stripping and allows the strip step to operate with lower aqueous to organic recycle ratios and shorter retention time in the mixer stages. Under these operating conditions, less solvent is required in the process, and smaller, less expensive process equipment can be utilized. The high strength H/sub 3/PO/sub 4/ is available from the evaporator stage of the process.

Reductive stripping process for uranium recovery from organic extracts

DOEpatents

Hurst, Jr., Fred J.

1985-01-01

In the reductive stripping of uranium from an organic extractant in a uranium recovery process, the use of phosphoric acid having a molarity in the range of 8 to 10 increases the efficiency of the reductive stripping and allows the strip step to operate with lower aqueous to organic recycle ratios and shorter retention time in the mixer stages. Under these operating conditions, less solvent is required in the process, and smaller, less expensive process equipment can be utilized. The high strength H.sub.3 PO.sub.4 is available from the evaporator stage of the process.

Efficient hybrid evolutionary algorithm for optimization of a strip coiling process

NASA Astrophysics Data System (ADS)

Pholdee, Nantiwat; Park, Won-Woong; Kim, Dong-Kyu; Im, Yong-Taek; Bureerat, Sujin; Kwon, Hyuck-Cheol; Chun, Myung-Sik

2015-04-01

This article proposes an efficient metaheuristic based on hybridization of teaching-learning-based optimization and differential evolution for optimization to improve the flatness of a strip during a strip coiling process. Differential evolution operators were integrated into the teaching-learning-based optimization with a Latin hypercube sampling technique for generation of an initial population. The objective function was introduced to reduce axial inhomogeneity of the stress distribution and the maximum compressive stress calculated by Love's elastic solution within the thin strip, which may cause an irregular surface profile of the strip during the strip coiling process. The hybrid optimizer and several well-established evolutionary algorithms (EAs) were used to solve the optimization problem. The comparative studies show that the proposed hybrid algorithm outperformed other EAs in terms of convergence rate and consistency. It was found that the proposed hybrid approach was powerful for process optimization, especially with a large-scale design problem.

Integrated Optical Information Processing

DTIC Science & Technology

1988-08-01

applications in optical disk memory systems [91. This device is constructed in a glass /SiO2/Si waveguide. The choice of a Si substrate allows for the...contact mask) were formed in the photoresist deposited on all of the samples, we covered the unwanted gratings on each sample with cover glass slides...processing, let us consider TeO2 (v, = 620 m/s) as a potential substrate for applications requiring large time delays. This con- sideration is despite

Cryogenic fractionator gas as stripping gas of fines slurry in a coking and gasification process

DOEpatents

DeGeorge, Charles W.

1981-01-01

In an integrated coking and gasification process wherein a stream of fluidized solids is passed from a fluidized bed coking zone to a second fluidized bed and wherein entrained solid fines are recovered by a scrubbing process and wherein the resulting solids-liquid slurry is stripped with a stripping gas to remove acidic gases, at least a portion of the stripping gas comprises a gas comprising hydrogen, nitrogen and methane separated from the coker products.

Assessing the quality of radiographic processing in general dental practice.

PubMed

Thornley, P H; Stewardson, D A; Rout, P G J; Burke, F J T

2006-05-13

To determine if a commercial device (Vischeck) for monitoring film processing quality was a practical option in general dental practice, and to assess processing quality among a group of GDPs in the West Midlands with this device. Clinical evaluation. General dental practice, UK, 2004. Ten GDP volunteers from a practice based research group processed Vischeck strips (a) when chemicals were changed, (b) one week later, and (c) immediately before the next change of chemicals. These were compared with strips processed under ideal conditions. Additionally, a series of duplicate radiographs were produced and processed together with Vischeck strips in progressively more dilute developer solutions to compare the change in radiograph quality assessed clinically with that derived from the Vischeck. The Vischeck strips suggested that at the time chosen for change of processing chemicals, eight dentists had been processing films well beyond the point indicated for replacement. Solutions were changed after a wide range of time periods and number of films processed. The calibration of the Vischeck strip correlated closely to a clinical assessment of acceptable film quality. Vischeck strips are a useful aid to monitoring processing quality in automatic developers in general dental practice. Most of this group of GDPs were using chemicals beyond the point at which diagnostic yield would be affected.

Within-wafer CD variation induced by wafer shape

NASA Astrophysics Data System (ADS)

Huang, Chi-hao; Yang, Mars; Yang, Elvis; Yang, T. H.; Chen, K. C.

2016-03-01

In order to meet the increasing storage capacity demand and reduce bit cost of NAND flash memories, 3D stacked vertical flash cell array has been proposed. In constructing 3D NAND flash memories, the bit number per unit area is increased as increasing the number of stacked layers. However, the increased number of stacked layers has made the film stress control extremely important for maintaining good process quality. The residual film stress alters the wafer shape accordingly several process impacts have been readily observed across wafer, such as film deposition non-uniformity, etch rate non-uniformity, wafer chucking error on scanner, materials coating/baking defects, overlay degradation and critical dimension (CD) non-uniformity. The residual tensile and compressive stresses on wafers will result in concave and convex wafer shapes, respectively. This study investigates within-wafer CD uniformity (CDU) associated with wafer shape change induced by the 3D NAND flash memory processes. Within-wafer CDU was correlated with several critical parameters including different wafer bow heights of concave and convex wafer shapes, photo resists with different post exposure baking (PEB) temperature sensitivities, and DoseMapper compensation. The results indicated the trend of within-wafer CDU maintains flat for convex wafer shapes with bow height up to +230um and concave wafer shapes with bow height ranging from 0 ~ -70um, while the within-wafer CDU trends up from -70um to -246um wafer bow heights. To minimize the within-wafer CD distribution induced by wafer warpage, carefully tailoring the film stack and thermal budget in the process flow for maintaining the wafer shape at CDU friendly range is indispensable and using photo-resist materials with lower PEB temperature sensitivity is also suggested. In addition, DoseMapper compensation is also an alternative to greatly suppress the within-wafer CD non-uniformity but the photo-resist profile variation induced by across-wafer PEB temperature non-uniformity attributed to wafer warpage is uncorrectable, and the photo-resist profile variation is believed to affect across-wafer etch bias uniformity to some degree.

An Experimental Characterization System for Deep Ultra-Violet (UV) Photoresists

NASA Astrophysics Data System (ADS)

Drako, Dean M.; Partlo, William N.; Oldham, William G.; Neureuther, Andrew R.

1989-08-01

A versatile system designed specifically for experimental automated photoresist characterization has been constructed utilizing an excimer laser source for exposure at 248nm. The system was assembled, as much as possible, from commercially available components in order to facilitate its replication. The software and hardware are completely documented in a University of California-Berkeley Engineering Research Lab Memo. An IBM PC-AT compatible computer controls an excimer laser, operates a Fourier Transform Infrared (FTIR) Spectrometer, measures and records the energy of each laser pulse (incident, reflected, and transmitted), opens and closes shutters, and operates two linear stages for sample movement. All operations (except FTIR data reduction) are managed by a control program written in the "C" language. The system is capable of measuring total exposure dose, performing bleaching measurements, creating and recording exposure pulse sequences, and generating exposure patterns suitable for multiple channel monitoring of the development. The total exposure energy, energy per pulse, and pulse rate are selectable over a wide range. The system contains an in-situ Fourier Transform Infrared Spectrometer for qualitative and quantitative analysis of the photoresist baking and exposure processes (baking is not done in-situ). FIIR may be performed in transmission or reflection. The FTIR data will form the basis of comprehensive multi-state resist models. The system's versatility facilitates the development of new automated and repeatable experiments. Simple controlling software, utilizing the provided interface sub-routines, can be written to control new experiments and collect data.

Choosing order of operations to accelerate strip structure analysis in parameter range

NASA Astrophysics Data System (ADS)

Kuksenko, S. P.; Akhunov, R. R.; Gazizov, T. R.

2018-05-01

The paper considers the issue of using iteration methods in solving the sequence of linear algebraic systems obtained in quasistatic analysis of strip structures with the method of moments. Using the analysis of 4 strip structures, the authors have proved that additional acceleration (up to 2.21 times) of the iterative process can be obtained during the process of solving linear systems repeatedly by means of choosing a proper order of operations and a preconditioner. The obtained results can be used to accelerate the process of computer-aided design of various strip structures. The choice of the order of operations to accelerate the process is quite simple, universal and could be used not only for strip structure analysis but also for a wide range of computational problems.

Simple Multi-level Microchannel Fabrication by Pseudo-Grayscale Backside Diffused Light Lithography.

PubMed

Lai, David; Labuz, Joseph M; Kim, Jiwon; Luker, Gary D; Shikanov, Ariella; Takayama, Shuichi

2013-11-14

Photolithography of multi-level channel features in microfluidics is laborious and/or costly. Grayscale photolithography is mostly used with positive photoresists and conventional front side exposure, but the grayscale masks needed are generally costly and positive photoresists are not commonly used in microfluidic rapid prototyping. Here we introduce a simple and inexpensive alternative that uses pseudo-grayscale (pGS) photomasks in combination with backside diffused light lithography (BDLL) and the commonly used negative photoresist, SU-8. BDLL can produce smooth multi-level channels of gradually changing heights without use of true grayscale masks because of the use of diffused light. Since the exposure is done through a glass slide, the photoresist is cross-linked from the substrate side up enabling well-defined and stable structures to be fabricated from even unspun photoresist layers. In addition to providing unique structures and capabilities, the method is compatible with the "garage microfluidics" concept of creating useful tools at low cost since pGS BDLL can be performed with the use of only hot plates and a UV transilluminator: equipment commonly found in biology labs. Expensive spin coaters or collimated UV aligners are not needed. To demonstrate the applicability of pGS BDLL, a variety of weir-type cell traps were constructed with a single UV exposure to separate cancer cells (MDA-MB-231, 10-15 μm in size) from red blood cells (RBCs, 2-8 μm in size) as well as follicle clusters (40-50 μm in size) from cancer cells (MDA-MB-231, 10-15 μm in size).

Composition and method for removing photoresist materials from electronic components

DOEpatents

Davenhall, Leisa B.; Rubin, James B.

2002-01-01

The invention is a combination of at least one dense phase fluid and at least one dense phase fluid modifier which can be used to contact substrates for electronic parts such as semiconductor wafers or chips to remove photoresist materials which are applied to the substrates during manufacture of the electronic parts. The dense phase fluid modifier is one selected from the group of cyclic, aliphatic or alicyclic compounds having the functional group: ##STR1## wherein Y is a carbon, oxygen, nitrogen, phosphorus or sulfur atom or a hydrocarbon group having from 1 to 10 carbon atoms, a halogen or halogenated hydrocarbon group having from 1 to 10 carbon atoms, silicon or a fluorinated silicon group; and wherein R.sub.1 and R.sub.2 can be the same or different substituents; and wherein, as in the case where X is nitrogen, R.sub.1 or R.sub.2 may not be present. The invention compositions generally are applied to the substrates in a pulsed fashion in order to remove the hard baked photoresist material remaining on the surface of the substrate after removal of soft baked photoresist material and etching of the barrier layer.

Rapid fabrication of a micro-ball lens array by extrusion for optical fiber applications.

PubMed

Shen, S C; Huang, J C

2009-07-20

Batch-fabrication of a micro-ball lens array (MBA) could not only reduce micro assembly costs but also replace conventional ball lenses or costly GRINs (Gradient Refractive Index) without compromising performance. Compared with conventional half-spherical micro-lenses, the MBA is a spherical micro-lens that can focus light in all directions, thus providing the flexibility required for optical applications. Current MBAs are made of SU-8 photoresist by an extrusion process rather than the traditional thermal reflow process. The aim of this study was to develop a new process for MBA batch-fabrication, performed at ambient temperature, by spin-coating SU-8 onto a silicon-wafer surface, which serves as an extrusion plate, and extruding it through a nozzle to form an MBA. The nozzle consists of a nozzle orifice and nozzle cavity, the former being defined and made from SU-8 photoresist using ultra-violet (UV) lithography, which results in good mechanical properties. In this paper, the fabrication of 4 x 4 MBAs with diameters ranging from 60 to 550 um is described. Optical measurements indicated a diameter variance within 3% and a maximum coupling efficiency of approximately 62% when the single mode fiber (SMF) was placed at a distance of 10 um from the MBA. The results of this study proved that MBA fabrication by the extrusion process can enhance the coupling efficiency.

Walk-through survey report: Control of methylene chloride in furniture stripping at jet strip, Boulder, Colorado, August 1, 1991

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hall, R.M.; Sheehy, J.W.

1992-12-01

A walk through survey was made of the furniture stripping process at Jet Strip (SIC-7641), Boulder, Colorado to examine the effectiveness of a unique, enclosed, automated furniture stripping spray system which featured a gasket sealed lid which was in place while furniture was being stripped. Stripping was performed continuously throughout the workday. The enclosed spray system tank was 6 feet wide, 10 feet long and 4.5 feet deep. Furniture to be stripped was placed on a metal grid hung from the top of the enclosed spray system. The rack was lowered into the tank and the lip dropped to formmore » the cover of the enclosed system. A hole in the lid was connected to a water bed mattress which lays on top of the lip. During the stripping process, vapors were emitted through the hole, causing the mattress to expand. At the completion of the stripping process the vapors slowly dissipated into the tank, leaving the mattress in its original form. A single personal sample collected during the stripping and rinsing operations showed a methylene-chloride concentration of 68 parts per million (ppm). If the rinse area were also controlled, the enclosed system could keep the concentration below the 25ppm level. The system was homemade and not commercially available. The authors conclude that the system, while apparently effective, was also expensive. It is not recommended for further study at this time.« less

Laser direct writing and inkjet printing for a sub-2 μm channel length MoS2 transistor with high-resolution electrodes

NASA Astrophysics Data System (ADS)

Kwon, Hyuk-Jun; Chung, Seungjun; Jang, Jaewon; Grigoropoulos, Costas P.

2016-10-01

Patterns formed by the laser direct writing (LDW) lithography process are used either as channels or barriers for MoS2 transistors fabricated via inkjet printing. Silver (Ag) nanoparticle ink is printed over patterns formed on top of the MoS2 flakes in order to construct high-resolution source/drain (S/D) electrodes. When positive photoresist is used, the produced grooves are filled with inkjetted Ag ink by capillary forces. On the other hand, in the case of negative photoresist, convex barrier-like patterns are written on the MoS2 flakes and patterns, dividing the printed Ag ink into the S/D electrodes by self-alignment. LDW lithography combined with inkjet printing is applied to MoS2 thin-film transistors that exhibit moderate electrical performance such as mobility and subthreshold swing. However, especially in the linear operation regime, their features are limited by the contact effect. The Y-function method can exclude the contact effect and allow proper evaluation of the maximum available mobility and contact resistance. The presented fabrication methods may facilitate the development of cost-effective fabrication processes.

Fabrication of a 3D micro/nano dual-scale carbon array and its demonstration as the microelectrodes for supercapacitors

NASA Astrophysics Data System (ADS)

Jiang, Shulan; Shi, Tielin; Gao, Yang; Long, Hu; Xi, Shuang; Tang, Zirong

2014-04-01

An easily accessible method is proposed for the fabrication of a 3D micro/nano dual-scale carbon array with a large surface area. The process mainly consists of three critical steps. Firstly, a hemispherical photoresist micro-array was obtained by the cost-effective nanoimprint lithography process. Then the micro-array was transformed into hierarchical structures with longitudinal nanowires on the microstructure surface by oxygen plasma etching. Finally, the micro/nano dual-scale carbon array was fabricated by carbonizing these hierarchical photoresist structures. It has also been demonstrated that the micro/nano dual-scale carbon array can be used as the microelectrodes for supercapacitors by the electrodeposition of a manganese dioxide (MnO2) film onto the hierarchical carbon structures with greatly enhanced electrochemical performance. The specific gravimetric capacitance of the deposited micro/nano dual-scale microelectrodes is estimated to be 337 F g-1 at the scan rate of 5 mV s-1. This proposed approach of fabricating a micro/nano dual-scale carbon array provides a facile way in large-scale microstructures’ manufacturing for a wide variety of applications, including sensors and on-chip energy storage devices.

Acetone-butanol-ethanol from sweet sorghum juice by an immobilized fermentation-gas stripping integration process.

PubMed

Cai, Di; Wang, Yong; Chen, Changjing; Qin, Peiyong; Miao, Qi; Zhang, Changwei; Li, Ping; Tan, Tianwei

2016-07-01

In this study, sweet sorghum juice (SSJ) was used as the substrate in a simplified ABE fermentation-gas stripping integration process without nutrients supplementation. The sweet sorghum bagasse (SSB) after squeezing the fermentable juice was used as the immobilized carrier. The results indicated that the productivity of ABE fermentation process was improved by gas stripping integration. A total 24g/L of ABE solvents was obtained from 59.6g/L of initial sugar after 80h of fermentation with gas stripping. Then, long-term of fed-batch fermentation with continuous gas stripping was further performed. 112.9g/L of butanol, 44.1g/L of acetone, 9.5g/L of ethanol (total 166.5g/L of ABE) was produced in overall 312h of fermentation. At the same time, concentrated ABE product was obtained in the condensate of gas stripping. Copyright © 2016 Elsevier Ltd. All rights reserved.

An extraction process to recover vanadium from low-grade vanadium-bearing titanomagnetite.

PubMed

Chen, Desheng; Zhao, Hongxin; Hu, Guoping; Qi, Tao; Yu, Hongdong; Zhang, Guozhi; Wang, Lina; Wang, Weijing

2015-08-30

An extraction process to recover vanadium from low-grade vanadium-bearing titanomagnetite was developed. In this study, a mixed solvent system of di(2-ethylhexyl) phosphate (D2EHPA) and tri-n-butyl phosphate (TBP) diluted with kerosene was used for the selective extraction of vanadium from a hydrochloric acid leaching solution that contained low vanadium concentration with high concentrations of iron and impurities of Ca, Mg, and Al. In the extraction process, the initial solution pH and the phase ratio had considerable functions in the extraction of vanadium from the hydrochloric acid leaching solution. Under optimal extraction conditions (i.e., 30-40°C for 10min, 1:3 phase ratio (O/A), 20% D2EHPA concentration (v/v), and 0-0.8 initial solution pH), 99.4% vanadium and only 4.2% iron were extracted by the three-stage counter-current extraction process. In the stripping process with H2SO4 as the stripping agent and under optimal stripping conditions (i.e., 20% H2SO4 concentration, 5:1 phase ratio (O/A), 20min stripping time, and 40°C stripping temperature), 99.6% vanadium and only 5.4% iron were stripped by the three-stage counter-current stripping process. The stripping solution contained 40.16g/LV2O5,0.691g/L Fe, 0.007g/L TiO2, 0.006g/L SiO2 and 0.247g/L CaO. A V2O5 product with a purity of 99.12% V2O5 and only 0.026% Fe was obtained after the oxidation, precipitation, and calcination processes. The total vanadium recovered from the hydrochloric acid leaching solution was 85.5%. Copyright © 2015 Elsevier B.V. All rights reserved.

Recent advances in 193-nm single-layer photoresists based on alternating copolymers of cycloolefins

NASA Astrophysics Data System (ADS)

Houlihan, Francis M.; Wallow, Thomas I.; Timko, Allen G.; Neria, E.; Hutton, Richard S.; Cirelli, Raymond A.; Nalamasu, Omkaram; Reichmanis, Elsa

1997-07-01

We report on our recent investigations on the formulation and processing of 193 nm single layer photoresists based on alternating copolymers of cycloolefins with maleic anhydride. Resists formulated with cycloolefin copolymers are compatible with 0.262 N tetramethylammonium developers, have excellent adhesion, sensitivity, etch resistance and thermal flow properties. The effect of polymer structure and composition, dissolution inhibitor structure and loading as well as the effect of the photoacid generator on the resist dissolution properties was investigated. Based on the results high contrast formulations were evaluated on a GCA XLS (NA equals 0.53, 4X reduction optics) deep-UV stepper to exhibit 0.27 micrometer L/S pair resolution with excellent photosensitivity. Based on the dissolution properties and a spectroscopic examination of the resist, we have designed materials that show less than 0.17 micrometer L/S pair resolution with 193 nm exposures. In this paper, the formulation methodology is detailed and the most recent results upon both with 248 and 193 nm irradiation are described.

Resistance of dichromated gelatin as photoresist

NASA Astrophysics Data System (ADS)

Lin, Pang; Yan, Yingbai; Jin, Guofan; Wu, Minxian

1999-09-01

Based on the photographic chemistry, chemically hardening method was selected to enhance the anti-etch capability of gelatin. With the consideration of hardener and permeating processing, formaldehyde is the most ideal option due to the smallest molecule size and covalent cross-link with gelatin. After hardened in formaldehyde, the resistance of the gelatin was obtained by etched in 1% HF solution. The result showed that anti-etch capability of the gelatin layer increased with tanning time, but the increasing rate reduced gradually and tended to saturation. Based on the experimental results, dissolving-flaking hypothesis for chemically hardening gelatin was presented. Sol-gel coatings were etched with 1% HF solution. Compared with the etching rate of gelatin layer, it showed that gelatin could be used as resist to fabricate optical elements in sol-gel coating. With the cleaving-etch method and hardening of dichromated gelatin (DCG), DCG was used as a photoresist for fabricating sol-gel optical elements. As an application, a sol-gel random phase plate was fabricated.

Characterization of sub-0.18-μm critical dimension pattern collapse for yield improvement

NASA Astrophysics Data System (ADS)

Zhong, Tom X.; Gurer, Emir; Lee, Ed C.; Bai, Hong; Gendron, Bill; Krishna, Murthy S.; Reynolds, Reese M.

1999-09-01

In this study, we demonstrate that surface-resist interface interactions are becoming more crucial in DUV lithography as we enter deep into the sub-wavelength era of smaller critical dimension (CD) size and high aspect ratio. This interaction reveals itself as an adhesion reduction of the resist film due to the smaller contact area between the feature and the substrate. Considerable yield improvements in a manufacturing environment can be realized if pattern collapsing of smaller features is prevented by means of proper priming. In addition, next generation photoresist processing equipments must be able to deliver excellent on-wafer results with minimum chemical consumption as environmental health and safety (EHS) requirements are better appreciated in the marketplace. HMDS is not only highly toxic but it is also a prime threat to CD control of most deep ultra violet (DUV) photoresists used for sub-0.18 micrometer design rules. The by-product NH3 created during priming process with HMDS can neutralize the photo-acid created during the exposure step. There are many technical opportunities in this usually neglected priming process step. In this study, we characterized sub-0.18 micrometer isolated line pattern collapse for UV5 resist on bare Si wafers by using a scanning electron microscope (SEM). The smallest line width printability on wafers primed with different contact angles was analyzed by using both top down and cross section SEM images. Our results show that there is a strong effect of substrate surface and film interface interaction on device yields. More specifically, there is a strong correlation between pattern integrity of features down to 115 nm and vapor prime process conditions. In general, wafers with higher contact angle can support smaller line widths. These results suggest that higher contact angle than the current specification will be required for sub-0.1 micrometer design rule for improved yield. An alternative material to HMDS will probably be needed due to more stringent future requirements and weak bonding characteristics of HMDS. Based on the result of this study, we propose an HMDS consumption reduction scheme for line-widths above 0.2 micrometer. There are many priming-related modular and system level technical enhancements that can be designed in the next generation photoresist processing tools in order to extend 248 nm lithography towards smaller feature sizes.

Cantilevered multilevel LIGA devices and methods

DOEpatents

Morales, Alfredo Martin; Domeier, Linda A.

2002-01-01

In the formation of multilevel LIGA microstructures, a preformed sheet of photoresist material, such as polymethylmethacrylate (PMMA) is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the exposed photoresist material. A first microstructure is then formed by electroplating metal into the areas from which the photoresist has been removed. Additional levels of microstructure are added to the initial microstructure by covering the first microstructure with a conductive polymer, machining the conductive polymer layer to reveal the surface of the first microstructure, sealing the conductive polymer and surface of the first microstructure with a metal layer, and then forming the second level of structure on top of the first level structure. In such a manner, multiple layers of microstructure can be built up to allow complex cantilevered microstructures to be formed.

Fluorine-containing composition for forming anti-reflection film on resist surface and pattern formation method

DOEpatents

Nishi, Mineo; Makishima, Hideo

1996-01-01

A composition for forming anti-reflection film on resist surface which comprises an aqueous solution of a water soluble fluorine compound, and a pattern formation method which comprises the steps of coating a photoresist composition on a substrate; coating the above-mentioned composition for forming anti-reflection film; exposing the coated film to form a specific pattern; and developing the photoresist, are provided. Since the composition for forming anti-reflection film can be coated on the photoresist in the form of an aqueous solution, not only the anti-reflection film can be formed easily, but also, the film can be removed easily by rinsing with water or alkali development. Therefore, by the pattern formation method according to the present invention, it is possible to form a pattern easily with a high dimensional accuracy.

Process For Patterning Dispenser-Cathode Surfaces

NASA Technical Reports Server (NTRS)

Garner, Charles E.; Deininger, William D.

1989-01-01

Several microfabrication techniques combined into process cutting slots 100 micrometer long and 1 to 5 micrometer wide into tungsten dispenser cathodes for traveling-wave tubes. Patterned photoresist serves as mask for etching underlying aluminum. Chemically-assisted ion-beam etching with chlorine removes exposed parts of aluminum layer. Etching with fluorine or chlorine trifluoride removes tungsten not masked by aluminum layer. Slots enable more-uniform low-work function coating dispensed to electron-emitting surface. Emission of electrons therefore becomes more uniform over cathode surface.

Double exposure using 193nm negative tone photoresist

NASA Astrophysics Data System (ADS)

Kim, Ryoung-han; Wallow, Tom; Kye, Jongwook; Levinson, Harry J.; White, Dave

2007-03-01

Double exposure is one of the promising methods for extending lithographic patterning into the low k I regime. In this paper, we demonstrate double patterning of k 1-effective=0.25 with improved process window using a negative resist. Negative resist (TOK N- series) in combination with a bright field mask is proven to provide a large process window in generating 1:3 = trench:line resist features. By incorporating two etch transfer steps into the hard mask material, frequency doubled patterns could be obtained.

Fabrication of polydimethylsiloxane (PDMS) - based multielectrode array for neural interface.

PubMed

Kim, Jun-Min; Oh, Da-Rong; Sanchez, Joaquin; Kim, Shang-Hyub; Seo, Jong-Mo

2013-01-01

Flexible multielectrode arrays (MEAs) are being developed with various materials, and polyimide has been widely used due to the conveniece of process. Polyimide is developed in the form of photoresist. And this enable precise and reproducible fabrication. PDMS is another good candidate for MEA base material, but it has poor surface energy and etching property. In this paper, we proposed a better fabrication process that could modify PDMS surface for a long time and open the site of electrode and pad efficiently without PDMS etching.

Evaluating the energy performance of a hybrid membrane-solvent process for flue gas carbon dioxide capture

DOE PAGES

Kusuma, Victor A.; Li, Zhiwei; Hopkinson, David; ...

2016-10-13

In this study, a particularly energy intensive step in the conventional amine absorption process to remove carbon dioxide is solvent regeneration using a steam stripping column. An attractive alternative to reduce the energy requirement is gas pressurized stripping, in which a high pressure noncondensable gas is used to strip CO 2 off the rich solvent stream. The gas pressurized stripping column product, having CO 2 at high concentration and high partial pressure, can then be regenerated readily using membrane separation. In this study, we performed an energetic analysis in the form of total equivalent work and found that, for capturingmore » CO 2 from flue gas, this hybrid stripping process consumes 49% less energy compared to the base case conventional MEA absorption/steam stripping process. We also found the amount of membrane required in this process is much less than required for direct CO 2 capture from the flue gas: approximately 100-fold less than a previously published two-stage cross-flow scheme, mostly due to the more favorable pressure ratio and CO 2 concentration. There does exist a trade-off between energy consumption and required membrane area that is most strongly affected by the gas pressurized stripper operating pressure. While initial analysis looks promising from both an energy requirement and membrane unit capital cost, the viability of this hybrid process depends on the availability of advanced, next generation gas separation membranes to perform the stripping gas regeneration.« less

Evaluating the energy performance of a hybrid membrane-solvent process for flue gas carbon dioxide capture

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kusuma, Victor A.; Li, Zhiwei; Hopkinson, David

In this study, a particularly energy intensive step in the conventional amine absorption process to remove carbon dioxide is solvent regeneration using a steam stripping column. An attractive alternative to reduce the energy requirement is gas pressurized stripping, in which a high pressure noncondensable gas is used to strip CO 2 off the rich solvent stream. The gas pressurized stripping column product, having CO 2 at high concentration and high partial pressure, can then be regenerated readily using membrane separation. In this study, we performed an energetic analysis in the form of total equivalent work and found that, for capturingmore » CO 2 from flue gas, this hybrid stripping process consumes 49% less energy compared to the base case conventional MEA absorption/steam stripping process. We also found the amount of membrane required in this process is much less than required for direct CO 2 capture from the flue gas: approximately 100-fold less than a previously published two-stage cross-flow scheme, mostly due to the more favorable pressure ratio and CO 2 concentration. There does exist a trade-off between energy consumption and required membrane area that is most strongly affected by the gas pressurized stripper operating pressure. While initial analysis looks promising from both an energy requirement and membrane unit capital cost, the viability of this hybrid process depends on the availability of advanced, next generation gas separation membranes to perform the stripping gas regeneration.« less

Thin film type 248-nm bottom antireflective coatings

NASA Astrophysics Data System (ADS)

Enomoto, Tomoyuki; Nakayama, Keisuke; Mizusawa, Kenichi; Nakajima, Yasuyuki; Yoon, Sangwoong; Kim, Yong-Hoon; Kim, Young-Ho; Chung, Hoesik; Chon, Sang Mun

2003-06-01

A frequent problem encountered by photoresists during the manufacturing of semiconductor device is that activating radiation is reflected back into the photoresist by the substrate. So, it is necessary that the light reflection is reduced from the substrate. One approach to reduce the light reflection is the use of bottom anti-reflective coating (BARC) applied to the substrate beneath the photoresist layer. The BARC technology has been utilized for a few years to minimize the reflectivity. As the chip size is reduced to sub 0.13-micron, the photoresist thickness has to decrease with the aspect ratio being less than 3.0. Therefore, new Organic BARC is strongly required which has the minimum reflectivity with thinner BARC thickness and higher etch selectivity towards resist. SAMSUNG Electronics has developed the advanced Organic BARC with Nissan Chemical Industries, Ltd. and Brewer Science, Inc. for achieving the above purpose. As a result, the suitable high performance SNAC2002 series KrF Organic BARCs were developed. Using CF4 gas as etchant, the plasma etch rate of SNAC2002 series is about 1.4 times higher than that of conventional KrF resists and 1.25 times higher than the existing product. The SNAC2002 series can minimize the substrate reflectivity at below 40nm BARC thickness, shows excellent litho performance and coating properties.

Optimization of 248nm bottom anti-reflective coatings with thin film and high etch rate on real device

NASA Astrophysics Data System (ADS)

Kim, MyoungSoo; Kim, HakJoon; Shim, KewChan; Jeon, JeHa; Gil, MyungGoon; Song, YongWook; Enomoto, Tomoyuki; Sakaguchi, Takahiro; Nakajima, Yasuyuki

2005-05-01

A frequent problem encountered by photoresists during the manufacturing of semiconductor device is that activating radiation is reflected back into the photoresist by the substrate. So, it is necessary that the light reflection is reduced from the substrate. One approach to reduce the light reflection is the use of bottom anti-reflective coating (BARC) applied to the substrate beneath the photoresist layer. The BARC technology has been utilized for a few years to minimize the reflectivity. As the chip size is reduced to sub 100nm, the photoresist thickness has to decrease with the aspect ratio being less than 3.0. Therefore, new Organic BARC is strongly required which has the minimum reflectivity with thinner BARC thickness and higher etch selectivity toward resists. Hynix Semiconductor Inc., Nissan Chemical Industries, Ltd., and Brewer Science, Inc. have developed the advanced Organic BARC for achieving the above purpose. As a result, the suitable high performance 248nm Organic BARCs, NCA series, were achieved. Using CF4 gas as etchant, the plasma etch rate of NCA series is about 1.4 times higher than that of conventional 248nm resists. NCA series can be minimizing the substrate reflectivity at below 45nm BARC thickness. NCA series show the excellent litho performance and coating property on real device.

Characterization of a New Organosilicon Photoresist

NASA Astrophysics Data System (ADS)

Cunningham, Wells C.

1987-08-01

For a number of years, there has lo'ep. great interest in organometallic based photoresists for use as the top layer in multilevel resist schemes.-' In general, bilevel approaches to lithography are forced upon the industry as a means of planarizing topography for a subsequent patterning step. This pattern is initially defined by exposure and development of a thin top layer (0.3 to 0.5μm) over the thicker bottom layer (1.0 to 2.0μm). (See Figure 1). In a conventional bilevel approach, the chosen bottom layer is photoactive at a wavelength for which the top is relatively opaque. The top level acts as a portable conformable mask (PCM) for image transfer through the bottom layer after its exposure and wet development. By using a silicon containing photoresist on the top image transfer may be accomplished using an oxygen plasma instead of a second exposure and development. The PCM in this case acts as an etch mask by forming a silicon dioxide crust in the plasma which slows the etch rate of the top versus the bottom layer. A generic curve of etch rate of a photoresist versus percent silicon by weight is shown in Figure 2. The shape is similar over a wide range of organosilicon polymers.5,6

Reverse-absorbance-modulation-optical lithography for optical nanopatterning at low light levels

DOE Office of Scientific and Technical Information (OSTI.GOV)

Majumder, Apratim, E-mail: apratim.majumder@utah.edu; Wan, Xiaowen; Masid, Farhana

2016-06-15

Absorbance-Modulation-Optical Lithography (AMOL) has been previously demonstrated to be able to confine light to deep sub-wavelength dimensions and thereby, enable patterning of features beyond the diffraction limit. In AMOL, a thin photochromic layer that converts between two states via light exposure is placed on top of the photoresist layer. The long wavelength photons render the photochromic layer opaque, while the short-wavelength photons render it transparent. By simultaneously illuminating a ring-shaped spot at the long wavelength and a round spot at the short wavelength, the photochromic layer transmits only a highly confined beam at the short wavelength, which then exposes themore » underlying photoresist. Many photochromic molecules suffer from a giant mismatch in quantum yields for the opposing reactions such that the reaction initiated by the absorption of the short-wavelength photon is orders of magnitude more efficient than that initiated by the absorption of the long-wavelength photon. As a result, large intensities in the ring-shaped spot are required for deep sub-wavelength nanopatterning. In this article, we overcome this problem by using the long-wavelength photons to expose the photoresist, and the short-wavelength photons to confine the “exposing” beam. Thereby, we demonstrate the patterning of features as thin as λ/4.7 (137 nm for λ = 647 nm) using extremely low intensities (4-30 W/m{sup 2}, which is 34 times lower than that required in conventional AMOL). We further apply a rigorous model to explain our experiments and discuss the scope of the reverse-AMOL process.« less

Fabrication of a Silicon MOSFET Device with Bipolar Transistor Source,

DTIC Science & Technology

1980-07-01

NEGATIVE PHOTORESIST PROCEDURE ’•J n •:• fi >. 3 u i fc- Process Coat wafer Air dry Pre bake the resist coating Expose Develop Method Time...Orange (rather broad for orange) 0.82 Salmon 0.85 Dull, light red-violet 0.86 Violet £ 0.87 Blue-violet 0.89 Blue ::’ 0.92 V Blue-green •I 0.95

Development of Rust Stripping System using High Power Laser

NASA Astrophysics Data System (ADS)

Shirakawa, Kazuomi; Ohashi, Katsuaki; Ashidate, Shuichi; Kurosawa, Kiyoshi; Nakayama, Michio; Uchida, Yutaka; Nobusada, Yuuji

The repainting cycle depends on removal of rust in maintenance of outdoor steel-frame structural facilities. However existing stripping process, which is usually made by hands with brushes, cannot strip the rust completely in maintenance of power transmission towers, for example. To solve this problem, we investigated laser fluence and pulse width for removal of rust using DPSSL (Diode Pumped Solid State Laser), and selected optimum laser supply. Then we checked the effect of laser stripping on prolongation of the repainting cycle compared with the conventional stripping process. Utilizing results of the research, we developed rust stripping system using DPSSL. From the results of field trial of rust removal operation using this system at high places of a power transmission tower, possibility of practical use of the system for the maintenance was confirmed.

Process for removal of ammonia and acid gases from contaminated waters

DOEpatents

King, C. Judson; MacKenzie, Patricia D.

1985-01-01

Contaminating basic gases, i.e., ammonia, and acid gases, e.g., carbon dioxide, are removed from process waters or waste waters in a combined extraction and stripping process. Ammonia in the form of ammonium ion is extracted by an immiscible organic phase comprising a liquid cation exchange component, especially an organic phosphoric acid derivative, and preferably di-2-ethyl hexyl phosphoric acid, dissolved in an alkyl hydrocarbon, aryl hydrocarbon, higher alcohol, oxygenated hydrocarbon, halogenated hydrocarbon, and mixtures thereof. Concurrently, the acidic gaseous contaminants are stripped from the process or waste waters by stripping with steam, air, nitrogen, or the like. The liquid cation exchange component has the ammonia stripped therefrom by heating, and the component may be recycled to extract additional amounts of ammonia.

Process for removal of ammonia and acid gases from contaminated waters

DOEpatents

King, C.J.; Mackenzie, P.D.

1982-09-03

Contaminating basic gases, i.e., ammonia and acid gases, e.g., carbon dioxide, are removed from process waters or waste waters in a combined extraction and stripping process. Ammonia in the form of ammonium ion is extracted by an immiscible organic phase comprising a liquid cation exchange component, especially an organic phosphoric acid derivative, and preferably di-2-ethyl hexyl phosphoric acid, dissolved in an alkyl hydrocarbon, aryl hydrocarbon, higher alcohol, oxygenated hydrocarbon, halogenated hydrocarbon, and mixtures thereof. Concurrently, the acidic gaseous contaminants are stripped from the process or waste waters by stripping with stream, air, nitrogen, or the like. The liquid cation exchange component has the ammonia stripped therefrom by heating, and the component may be recycled to extract additional amounts of ammonia.

Ultraviolet-Ozone Cleaning of Semiconductor Surfaces

DTIC Science & Technology

1992-01-01

Bolon and Kunz (1) reported that UV light had the capability to depolymerize a variety of photoresist polymers. The polymer films were enclosed in a...placed between the UV light and the films, or when a nitrogen atmosphere was used instead of oxygen, the depolymerization was hindered. Thus, Bolon and...ozone cleaning rates. Bolon and Kunz (1), on the other hand, found that the rate of ozone depolymerization of photoresists did not change significantly

A model for prediction of profile and flatness of hot and cold rolled flat products in four-high mills

NASA Astrophysics Data System (ADS)

Overhagen, Christian; Mauk, Paul Josef

2018-05-01

For flat rolled products, the thickness profile in the transversal direction is one of the most important product properties. For further processing, a defined crown of the product is necessary. In the rolling process, several mechanical and thermal influences interact with each other to form the strip shape at the roll gap exit. In the present analysis, a process model for rolling of strip and sheet is presented. The core feature of the process model is a two-dimensional stress distribution model based on von Karman's differential equation. Sub models for the mechanical influences of work roll flattening as well as work and backup roll deflection and the thermal influence of work roll expansion have been developed or extended. The two-dimensional stress distribution serves as an input parameter for the roll deformation models. For work roll flattening, a three-dimensional model based on the Boussinesq problem is adopted, while the work and backup roll deflection, including contact flattening is calculated by means of finite beam elements. The thermal work roll crown is calculated with help of an axisymmetric numerical solution of the heat equation for the work roll, considering azimuthal averaging for the boundary conditions at the work roll surface. Results are presented for hot rolling of a strip in a seven-stand finishing train of a hot strip mill, showing the calculated evolution of the strip profile. A variation of the strip profile from the first to the 20th rolled strip is shown. This variation is addressed to the progressive increase of work roll temperature during the first 20 strips. It is shown that a CVC® system can lead to improvements in strip profile and therefore flatness.

AIS/DOE Technology Roadmap Program: Strip Casting: Anticipating New Routes To Steel Sheet

DOE Office of Scientific and Technical Information (OSTI.GOV)

Prof. Alan W. Camb; Prof. Anthony Rollett

2001-08-31

To determine the potential for strip casting in the steel industry and to develop the fundamental knowledge necessary to allow the role of strip casting in the modern steel industry to be understood. Based upon a study of carbon steel strip castings that were either produced for the program at British Steel or were received from a pre-commercial production machine, the following conclusions were made. Strip casting of carbon steels is technically feasible for sheet material from slightly less than 1 mm thick to 3 mm thick, and, assuming that it is economically viable, it will be first applied inmore » carbon steel markets that do not require stringent surface quality or extensive forming. The potential of strip casting as a casting process to be developed for steel castings is very high as the cast strip has some very novel characteristics. Direct cast carbon strip has better surface quality, shape and profile than any other casting process currently available. The more rapidly solidified structure of direct cast strip tends to be strong with low ductility; however, with adequate thermal treatment, it is possible to develop a variety of properties from the same grade. The process is more amenable at this time to production tonnages per year of the order of 500,000 tons and as such will first find niche type applications. This technology is an additional technology for steel production and will be in addition to, rather than a replacement for, current casting machines.« less

Hybrid Vapor Stripping-Vapor Permeation Process for Recovery and Dehydration of 1-Butanol and Acetone/Butanol/Ethanol from Dilute Aqueous Solutions. Part 2. Experimental Validation with Simple Mixtures and Actual Fermentation Broth

EPA Science Inventory

BACKGROUND: In Part1 of this work, a process integrating vapor stripping, vapor compression, and a vapor permeation membrane separation step, Membrane Assisted Vapor Stripping (MAVS), was predicted to produce energy savings compared to traditional distillation systems for separat...

Lost Mold Rapid Infiltration Forming of Mesoscale Ceramics: Part 1, Fabrication

PubMed Central

Antolino, Nicholas E.; Hayes, Gregory; Kirkpatrick, Rebecca; Muhlstein, Christopher L.; Frecker, Mary I.; Mockensturm, Eric M.; Adair, James H.

2009-01-01

Free-standing mesoscale (340 μm × 30 μm × 20 μm) bend bars with an aspect ratio over 15:1 and an edge resolution as fine as a single grain diameter (∼400 nm) have been fabricated in large numbers on refractory ceramic substrates by combining a novel powder processing approach with photoresist molds and an innovative lost-mold thermal process. The colloid and interfacial chemistry of the nanoscale zirconia particulates has been modeled and used to prepare highly concentrated suspensions. Engineering solutions to challenges in mold fabrication and casting have yielded free-standing, crack-free parts. Molds are fabricated using high-aspect-ratio photoresist on ceramic substrates. Green parts are formed using a rapid infiltration method that exploits the shear thinning behavior of the highly concentrated ceramic suspension in combination with gelcasting. The mold is thermally decomposed and the parts are sintered in place on the ceramic substrate. Chemically aided attrition milling disperses and concentrates the as-received 3Y-TZP powder to produce a dense, fine-grained sintered microstructure. Initial three-point bend strength data are comparable to that of conventional zirconia; however, geometric irregularities (e.g., trapezoidal cross sections) are present in this first generation and are discussed with respect to the distribution of bend strength. PMID:19809595

Application of ultrasound and air stripping for the removal of aromatic hydrocarbons from spent sulfidic caustic for use in autotrophic denitrification as an electron donor.

PubMed

Lee, Jae-Ho; Park, Jeung-Jin; Choi, Gi-Choong; Byun, Im-Gyu; Park, Tae-Joo; Lee, Tae-Ho

2013-01-01

Spent sulfidic caustic (SSC) produced from petroleum industry can be reused to denitrify nitrate-nitrogen via a biological nitrogen removal process as an electron donor for sulfur-based autotrophic denitrification, because it has a large amount of dissolved sulfur. However, SSC has to be refined because it also contains some aromatic hydrocarbons, typically benzene, toluene, ethylbenzene, xylene (BTEX) and phenol that are recalcitrant organic compounds. In this study, laboratory-scale ultrasound irradiation and air stripping treatment were applied in order to remove these aromatic hydrocarbons. In the ultrasound system, both BTEX and phenol were exponentially removed by ultrasound irradiation during 60 min of reaction time to give the greatest removal efficiency of about 80%. Whereas, about 95% removal efficiency of BTEX was achieved, but not any significant phenol removal, within 30 min in the air stripping system, indicating that air stripping was a more efficient method than ultrasound irradiation. However, since air stripping did not remove any significant phenol, an additional process for degrading phenol was required. Accordingly, we applied a combined ultrasound and air stripping process. In these experiments, the removal efficiencies of BTEX and phenol were improved compared to the application of ultrasound and air stripping alone. Thus, the combined ultrasound and air stripping treatment is appropriate for refining SSC.

M3: Microscope-based maskless micropatterning with dry film photoresist

PubMed Central

Leigh, Steven Y.; Tattu, Aashay; Mitchell, Joseph S. B.

2011-01-01

We present a maskless micropatterning system that utilizes a fluorescence microscope with programmable X-Y stage and dry film photoresist to realize feature sizes in the sub-millimeter range (40–700 μm). The method allows for flexible in-house maskless photolithography without a dedicated microfabrication facility and is well-suited for rapid prototyping of microfluidic channels, scaffold templates for protein/cell patterning or optically-guided cell encapsulation for biomedical applications. PMID:21190086

Thin film and high-etch-rate type 248-nm bottom antireflective coatings

NASA Astrophysics Data System (ADS)

Enomoto, Tomoyuki; Takei, Satoshi; Kishioka, Takahiro; Hatanaka, Tadashi; Sakamoto, Rikimaru; Nakajima, Yasuyuki

2004-05-01

A frequent problem encountered by photoresists during the manufacturing of semiconductor device is that activating radiation is reflected back into the photoresist by the substrate. So, it is necessary that the light reflection is reduced from the substrate. One approach to reduce the light reflection is the use of bottom anti-reflective coating (BARC) applied to the substrate beneath the photoresist layer. The BARC technology has been utilized for a few years to minimize the reflectivity. As the chip size is reduced to sub 0.13 micron, the photoresist thickness has to decrease with the aspect ratio being less than 3.0. Therefore, new Organic BARC is strongly required which has the minimum reflectivity with thinner BARC thickness and higher etch selectivity toward resists. Nissan Chemical Industries, Ltd. and Brewer Science, Inc. have developed the advanced Organic BARC for achieving the above purpose. As a result, the suitable high performance NCA3000 series 248nm Organic BARCs were developed. Using CF4 gas as etchant, the plasma etch rate of NCA3000 series is about 1.4-1.6 times higher than that of conventional 248nm resists and 1.1-1.2 times higher than that of the existing product. The NCA3000 series can minimize the substrate reflectivity at below 45nm BARC thickness, shows excellent litho performance and coating properties.

Fabrication of High-Resolution Gamma-Ray Metallic Magnetic Calorimeters with Ag:Er Sensor and Thick Electroplated Absorbers

NASA Astrophysics Data System (ADS)

Hummatov, Ruslan; Hall, John A.; Kim, Geon-Bo; Friedrich, Stephan; Cantor, Robin; Boyd, S. T. P.

2018-05-01

We are developing metallic magnetic calorimeters for high-resolution gamma-ray spectroscopy for non-destructive assay of nuclear materials. Absorbers for these higher-energy photons can require substantial thickness to achieve adequate stopping power. We developed a new absorber fabrication process using dry-film photoresists to electroform cantilevered, thick absorbers. Gamma detectors with these absorbers have an energy resolution of 38 eV FWHM at 60 keV. In this report, we summarize modifications to STARCryo's "Delta 1000" process for our devices and describe the new absorber fabrication process.

A design aid for determining width of filter strips

Treesearch

M.G. Dosskey; M.J. Helmers; D.E. Eisenhauer

2008-01-01

watershed planners need a tool for determining width of filter strips that is accurate enough for developing cost-effective site designs and easy enough to use for making quick determinations on a large number and variety of sites.This study employed the process-based Vegetative Filter Strip Model to evaluate the relationship between filter strip width and trapping...

Feasibility and energetic evaluation of air stripping for bioethanol production.

PubMed

Schläfle, Sandra; Senn, Thomas; Gschwind, Peter; Kohlus, Reinhard

2017-05-01

Stripping of mashes with air as stripping gas and low ethanol contents between 3 and 5wt% was investigated in terms of its suitability for continuous bioethanol production. Experiments in a Blenke cascade system were carried out and the results were compared with values obtained from theoretical vapour-liquid-equilibrium calculations. The whole stripping process was energetically evaluated by a simulation in ChemCAD and compared to conventional distillation. Therefore several parameters such as temperature, air volume flow and initial ethanol load of the mash were varied. Air stripping was found to be a suitable separation method for bioethanol from mashes with low concentrations. However, energetic aspects have to be considered, when developing a new process. Copyright © 2017 Elsevier Ltd. All rights reserved.

Measurement of the residual stress in hot rolled strip using strain gauge method

NASA Astrophysics Data System (ADS)

Kumar, Lokendra; Majumdar, Shrabani; Sahu, Raj Kumar

2017-07-01

Measurement of the surface residual stress in a flat hot rolled steel strip using strain gauge method is considered in this paper. Residual stresses arise in the flat strips when the shear cut and laser cut is applied. Bending, twisting, central buckled and edge waviness is the common defects occur during the cutting and uncoiling process. These defects arise due to the non-uniform elastic-plastic deformation, phase transformation occurring during cooling and coiling-uncoiling process. The residual stress analysis is very important because with early detection it is possible to prevent an object from failure. The goal of this paper is to measure the surface residual stress in flat hot rolled strip using strain gauge method. The residual stress was measured in the head and tail end of hot rolled strip considering as a critical part of the strip.

Semiconductor technology program. Progress briefs

NASA Technical Reports Server (NTRS)

Bullis, W. M. (Editor)

1979-01-01

The current status of NBS work on measurement technology for semiconductor materials, process control, and devices is reported. Results of both in-house and contract research are covered. Highlighted activities include modeling of diffusion processes, analysis of model spreading resistance data, and studies of resonance ionization spectroscopy, resistivity-dopant density relationships in p-type silicon, deep level measurements, photoresist sensitometry, random fault measurements, power MOSFET thermal characteristics, power transistor switching characteristics, and gross leak testing. New and selected on-going projects are described. Compilations of recent publications and publications in press are included.

193-nm multilayer imaging systems

NASA Astrophysics Data System (ADS)

Meador, James D.; Holmes, Doug; DiMenna, William; Nagatkina, Mariya I.; Rich, Michael D.; Flaim, Tony D.; Bennett, Randy; Kobayashi, Ichiro

2003-06-01

This paper highlights the performance of new materials that have been developed for use in 193-nm trilayer microlithography. The products are embedded etch masking layers (EMLs) and bottom antireflective coatings (BARCs). Both coatings are spin applied from organic solvent(s) and then thermoset during a hot plate bake. The EMLs (middle layers) are imaging compatible with JSR, Sumitomo, and TOK 193-nm photoresists. Best-case trilayer film stacks have given 100-nm dense and semi-dense L/S. Plasma etching, selectivities and solution compatibility performance of the EMLs meet or exceed proposed product targets. In addition, the EMLs exhibit both solution and plasma etching properties that should lead to successful rework processes for photoresists. The multiplayer BARCs offer good thick film coating quality and contribute to excellent images when used in trilayer applications. Combining the EMLs, which are nearly optically transparent (k=0.04) at 193-nm, with the new trilayer BARCs results in outstanding Prolith simulated reflectance control. In one modeling example, reflectance is a flat line at 0.5% on five different substrates for BARC thicknesses between 300 and 700-nm.

Theoretical modeling of PEB procedure on EUV resist using FDM formulation

NASA Astrophysics Data System (ADS)

Kim, Muyoung; Moon, Junghwan; Choi, Joonmyung; Lee, Byunghoon; Jeong, Changyoung; Kim, Heebom; Cho, Maenghyo

2018-03-01

Semiconductor manufacturing industry has reduced the size of wafer for enhanced productivity and performance, and Extreme Ultraviolet (EUV) light source is considered as a promising solution for downsizing. A series of EUV lithography procedures contain complex photo-chemical reaction on photoresist, and it causes technical difficulties on constructing theoretical framework which facilitates rigorous investigation of underlying mechanism. Thus, we formulated finite difference method (FDM) model of post exposure bake (PEB) process on positive chemically amplified resist (CAR), and it involved acid diffusion coupled-deprotection reaction. The model is based on Fick's second law and first-order chemical reaction rate law for diffusion and deprotection, respectively. Two kinetic parameters, diffusion coefficient of acid and rate constant of deprotection, which were obtained by experiment and atomic scale simulation were applied to the model. As a result, we obtained time evolutional protecting ratio of each functional group in resist monomer which can be used to predict resulting polymer morphology after overall chemical reactions. This achievement will be the cornerstone of multiscale modeling which provides fundamental understanding on important factors for EUV performance and rational design of the next-generation photoresist.

Evaluation of electron beam stabilization for ion implant processing

NASA Astrophysics Data System (ADS)

Buffat, Stephen J.; Kickel, Bee; Philipps, B.; Adams, J.; Ross, Matthew F.; Minter, Jason P.; Marlowe, Trey; Wong, Selmer S.

1999-06-01

With the integration of high energy ion implant processes into volume CMOS manufacturing, the need for thick resist stabilization to achieve a stable ion implant process is critical. With new photoresist characteristics, new implant end station characteristics arise. The resist outgassing needs to be addressed as well as the implant profile to ensure that the dosage is correct and the implant angle does not interfere with other underlying features. This study compares conventional deep-UV/thermal with electron beam stabilization. The electron beam system used in this study utilizes a flood electron source and is a non-thermal process. These stabilization techniques are applied to a MeV ion implant process in a CMOS production process flow.

Silicon/SU8 multi-electrode micro-needle for in vivo neurochemical monitoring.

PubMed

Vasylieva, Natalia; Marinesco, Stéphane; Barbier, Daniel; Sabac, Andrei

2015-10-15

Simultaneous monitoring of glucose and lactate is an important challenge for understanding brain energetics in physiological or pathological states. We demonstrate here a versatile method based on a minimally invasive single implantation in the rat brain. A silicon/SU8-polymer multi-sensing needle-shaped biosensor, was fabricated and tested. The multi-electrode array design comprises three platinum planar microelectrodes with a surface area of 40 × 200 µm(2) and a spacing of 200 µm, which were micromachined on a single 3mm long micro-needle having a 100 × 50 µm(2) cross-section for reduced tissue damage during implantation. Platinum micro-electrodes were aligned at the bottom of micro-wells obtained by photolithography on a SU8 photoresist layer. After clean room processing, each micro-electrode was functionalized inside the micro-wells by means of a micro-dispensing device, either with glucose oxidase or with lactate oxidase, which were cross-linked on the platinum electrodes. The third electrode covered with Bovine Serum Albumin (BSA) was used for the control of non-specific currents. The thick SU8 photoresist layer has revealed excellent electrical insulation of the micro-electrodes and between interconnection lines, and ensured a precise localization and packaging of the sensing enzymes on platinum micro-electrodes. During in vitro calibration with concentrations of analytes in the mM range, the micro-wells patterned in the SU8 photoresist proved to be highly effective in eliminating cross-talk signals, caused by H2O2 diffusion from closely spaced micro-electrodes. Moreover, our biosensor was successfully assayed in the rat cortex for simultaneous monitoring of both glucose and lactate during insulin and glucose administration. Copyright © 2015 Elsevier B.V. All rights reserved.

An Interagency Study of Depainting Techniques

NASA Technical Reports Server (NTRS)

Cook, B.

1997-01-01

Many popular and widely used paint stripping products now contain methylene chloride as their active ingredient. However, the Environmental Protection Agency (EPA) will critically curb the use of methylene chloride under an aerospace national emission standard for hazardous air pollutants (NESHAP) within the next 2-1/2 years. An effort is underway to identify and evaluate alternative depainting technologies emphasizing those believed to be both effective and environmentally benign. On behalf of the EPA and in cooperation with the U. S. Air Force (USAF), the National Aeronautics and Space Administration (NASA) is conducting a technical assessment of nine alternative technologies (i.e.: chemical stripping, two CO2 blasting processes, FLASHJET(TM) coating removal, laser stripping, plastic media blasting, sodium bicarbonate wet stripping, high-pressure water stripping, and wheat starch blasting). These depainting processes represent five removal method categories, namely abrasive, impact, cryogenic, thermal, and/or molecular bonding dissociation. This paper discusses the test plan and parameters for this interagency study. Several thicknesses of clad and non-clad aluminum substrates were used to prepare test specimens, which have been cut, cleaned, painted, and environmentally aged. Each depainting process has been assigned a specimen lot, which is now undergoing an initial strip cycle. Metallurgical impacts will be determined after these specimens complete five cycles of preparation and stripping.

Stripping and splicing polyimide-coated fibers

NASA Astrophysics Data System (ADS)

Duke, Douglas; Kanda, Yoshiharu; Tobita, Kenyo; Yamauchi, Ryozo

2011-05-01

Polyimide is often used as a coating material for optical fibers used in high temperature environments such as aerospace or oil and gas sensor applications. Unfortunately, polyimide coating is very difficult to strip by conventional mechanical stripping methods. The glass fiber is easily damaged if the stripping process is not extremely well controlled. Stripping the polyimide coating by heating with a flame or arc typically results in a significant reduction in fiber strength. Strength may be maintained by using hot acid stripping, however the use of the strong hot acid presents safety hazards and also requires controlled and safe waste disposal. Another issue with polyimide coating is variability of the coating diameter from various manufacturers or due to different polyimide coating processes. This not only complicates the polyimide stripping issue, but also presents problems with precise clamping and alignment during splicing, especially when it is necessary to splice with a short cleave length. In this paper, we present new polyimide coating stripping technology. The significant feature of this stripping technology is achievement of good strength while avoiding the use of hot acid or heating. We also developed a new specialty fiber fusion splicer that enables precise alignment and splicing regardless of the variability of polyimide coating diameter, even when clamping on the coating.

Air Force Sustainment Center Logistics and Sustainment Enterprise 2040. Version 2.0

DTIC Science & Technology

2016-04-15

that was usable on composite structures. The engineer had witnessed paint stripping utilizing commercial handheld lasers leading him to envision a...handheld laser being transformed into a robotically controlled whole aircraft de- paint stripping process removing the operator from the hazardous...indicative of the LSE 2040 funding, development and implementation process. 14 Figure 4 – C-130 Robotic Laser De- Paint Stripping From 2004

Investigation of Mercury Reduction in Gold Stripping Process at Elevated Temperature

NASA Astrophysics Data System (ADS)

Pramudya, Irawan

Mercury is present in many gold ores. By processing these ores, there is a potential of emitting mercury to the environment. Carbon regeneration kiln stacks have been observed as one of the primary source of mercury emission into the atmosphere. Before it is recycled back into the carbon in leach (CIL) or carbon in columns (CIC), carbon used in the gold extraction process needs to be reactivated thermally. Emission of mercury can be minimized by keeping the mercury left in the carbon low before it goes to the carbon regeneration kiln stacks. The objective of this study is establishing the optimum elution conditions of mercury cyanide from loaded carbon (which includes the eluent, concentration, temperature and elution time) with respect to gold stripping. Several methods such as acid washing (UNR-100, HCl or ethanol/UNR-100) were investigated prior to the stripping process. Furthermore, conventional pressurized Zadra and modified Zadra were also studied with regards to mercury concentration in the solution and vapor state as well as maximizing the gold stripping from industrial loaded carbon. 7% UNR-100 acid washing of loaded carbon at 80°C was able to wash out approximately 90% of mercury while maintaining the gold adsorption on the carbon (selective washing). The addition of alcohol in the UNR-100 acid washing solution was able to enhance mercury washing from 90% to 97%. Furthermore, mercury stripping using conventional pressurized (cyanide-alkaline) Zadra was best performed at 80°C (minimal amount of mercury reduced and volatilized) whereas using the same process only 40% of gold was stripped, which makes this process not viable. When alcohol was added to the stripping solution, at 80°C, 95% of gold was detected in the solution while keeping the reduction and volatilization of mercury low. The outcome of this study provides a better understanding of mercury behavior during the acid washing and stripping processes so that the risk of mercury exposure and contamination can be minimized while maximizing the gold overall recovery.

Regeneration of an aqueous solution from an acid gas absorption process by matrix stripping

DOEpatents

Rochelle, Gary T [Austin, TX; Oyenekan, Babatunde A [Katy, TX

2011-03-08

Carbon dioxide and other acid gases are removed from gaseous streams using aqueous absorption and stripping processes. By replacing the conventional stripper used to regenerate the aqueous solvent and capture the acid gas with a matrix stripping configuration, less energy is consumed. The matrix stripping configuration uses two or more reboiled strippers at different pressures. The rich feed from the absorption equipment is split among the strippers, and partially regenerated solvent from the highest pressure stripper flows to the middle of sequentially lower pressure strippers in a "matrix" pattern. By selecting certain parameters of the matrix stripping configuration such that the total energy required by the strippers to achieve a desired percentage of acid gas removal from the gaseous stream is minimized, further energy savings can be realized.

Manufacturing Methods and Technology Project Summary Reports.

DTIC Science & Technology

1980-12-01

deposition of chrome-copper (Cr- Cu ), dry-film photoresist application, photolithographic masking, spray etching, die bonding, ultrasonic...4) cold roll forging. Of these, the cold roll forging process is the most widely used for the pro- duction of steel and low alloy blades. It provides... sprayed Mo- Al -Ni both provide relatively good wear resistance, see Figure 1. The powder -flame sprayed aluminum bronze did not perform as well. 147 -S t. I

Solid State Research.

DTIC Science & Technology

1995-05-15

cooled to room temperature. Titanium isopropoxide and zirconium n-propoxide were then added (inside a glove box) to levels that correspond to the...ously patterned with a 200-nm-thick evaporated platinum film. In addition to the platinum there was a 40-nm titanium adhesion layer between the...an etch composed of buffered HF, HC1 and H20 [6]. By using a photoresist lift-off process, the top titanium -gold layer is formed, which provides the

Optical monitor for real time thickness change measurements via lateral-translation induced phase-stepping interferometry

DOEpatents

Rushford, Michael C.

2002-01-01

An optical monitoring instrument monitors etch depth and etch rate for controlling a wet-etching process. The instrument provides means for viewing through the back side of a thick optic onto a nearly index-matched interface. Optical baffling and the application of a photoresist mask minimize spurious reflections to allow for monitoring with extremely weak signals. A Wollaston prism enables linear translation for phase stepping.

Tissue Photolithography

NASA Technical Reports Server (NTRS)

Wade, Lawrence A.; Kartalov, Emil; Shibata, Darryl; Taylor, Clive

2011-01-01

Tissue lithography will enable physicians and researchers to obtain macromolecules with high purity (greater than 90 percent) from desired cells in conventionally processed, clinical tissues by simply annotating the desired cells on a computer screen. After identifying the desired cells, a suitable lithography mask will be generated to protect the contents of the desired cells while allowing destruction of all undesired cells by irradiation with ultraviolet light. The DNA from the protected cells can be used in a number of downstream applications including DNA sequencing. The purity (i.e., macromolecules isolated form specific cell types) of such specimens will greatly enhance the value and information of downstream applications. In this method, the specific cells are isolated on a microscope slide using photolithography, which will be faster, more specific, and less expensive than current methods. It relies on the fact that many biological molecules such as DNA are photosensitive and can be destroyed by ultraviolet irradiation. Therefore, it is possible to protect the contents of desired cells, yet destroy undesired cells. This approach leverages the technologies of the microelectronics industry, which can make features smaller than 1 micrometer with photolithography. A variety of ways has been created to achieve identification of the desired cell, and also to designate the other cells for destruction. This can be accomplished through chrome masks, direct laser writing, and also active masking using dynamic arrays. Image recognition is envisioned as one method for identifying cell nuclei and cell membranes. The pathologist can identify the cells of interest using a microscopic computerized image of the slide, and appropriate custom software. In one of the approaches described in this work, the software converts the selection into a digital mask that can be fed into a direct laser writer, e.g. the Heidelberg DWL66. Such a machine uses a metalized glass plate (with chrome metallization) on which there is a thin layer of photoresist. The laser transfers the digital mask onto the photoresist by direct writing, with typical best resolution of 2 micrometers. The plate is then developed to remove the exposed photoresist, which leaves the exposed areas susceptible to chemical chrome etch. The etch removes the unprotected chrome. The rest of the photoresist is then removed, by either ultraviolet organic solvent or over-development. The remaining chrome pattern is quickly oxidized by atmospheric exposure (typically within 30 seconds). The ready chrome mask is now applied to the tissue slide and aligned manually, or using automatic software and pre-designed alignment marks. The slide plate sandwich is then exposed to UV to destroy the DNA of the unwanted cells. The slide and plate are separated and the slide is processed in a standard way to prepare for polymerase chain reaction (PCR) and potential identification of cancer sequences.

Mechanisms of EUV exposure: electrons and holes

NASA Astrophysics Data System (ADS)

Narasimhan, Amrit; Grzeskowiak, Steven; Ackerman, Christian; Flynn, Tracy; Denbeaux, Greg; Brainard, Robert L.

2017-03-01

In extreme ultraviolet (EUV) lithography, 92 eV photons are used to expose photoresists. Current EUV photoresists are composed of photoacid generators (PAGs) in polymer matrices. Secondary electrons (2 - 80 eV) created in resists during EUV exposure play large role in acid-production. There are several proposed mechanisms for electron-resist interactions: internal excitation, electron trapping, and hole-initiated chemistry. Here, we will address two central questions in EUV resist research: (1) How many electrons are generated per EUV photon absorption? (2) By which mechanisms do these electrons interact and react with molecules in the resist? We will use this framework to evaluate the contributions of electron trapping and hole initiated chemistry to acid production in chemically amplified photoresists, with specific emphasis on the interdependence of these mechanisms. We will show measurements of acid yield from direct bulk electrolysis of PAGs and EUV exposures of PAGs in phenolic and nonphenolic polymers to narrow down the mechanistic possibilities in chemically amplified resists.

Dependence of absolute photon flux on infrared absorbance alteration and surface roughness on photoresist polymers irradiated with vacuum ultraviolet photons emitted from HBr plasma

NASA Astrophysics Data System (ADS)

Zhang, Yan; Takeuchi, Takuya; Ishikawa, Kenji; Hayashi, Toshio; Takeda, Keigo; Sekine, Makoto; Hori, Masaru

2017-12-01

The absolute fluxes of vacuum ultraviolet (VUV) photons emitted from HBr plasma were analyzed and the effects of VUV photons on a photoresist polymer in ArF-excimer-laser (193 nm) lithography were quantitatively investigated on the basis of the infrared spectra attributed to the C=O region. The spectral peak intensity assigned to the methacrylic acid (MAA) in the photoresist drastically decreased owing to the loss of this monomer caused by the irradiation of VUV photons at dosages below 16 × 1016 photons/cm2. X-ray photoelectron spectroscopy observation showed that the removed monomer moved to the surface and generated volatile products that induced a decrease in film thickness. As a consequence, the surface became rough during the early-stage irradiation at dosages lower than 16 × 1016 photons/cm2 owing to the monomer loss of MAA with volatile product formation and subsequent cross-linking reactions.

Mechanisms involved in HBr and Ar cure plasma treatments applied to 193 nm photoresists

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pargon, E.; Menguelti, K.; Martin, M.

2009-05-01

In this article, we have performed detailed investigations of the 193 nm photoresist transformations after exposure to the so-called HBr and Ar plasma cure treatments using various characterization techniques (x-ray photoelectron spectroscopy, Fourier transformed infrared, Raman analyses, and ellipsometry). By using windows with different cutoff wavelengths patched on the photoresist film, the role of the plasma vacuum ultraviolet (VUV) light on the resist modifications is clearly outlined and distinguished from the role of radicals and ions from the plasma. The analyses reveal that both plasma cure treatments induce severe surface and bulk chemical modifications of the resist films. The synergisticmore » effects of low energetic ion bombardment and VUV plasma light lead to surface graphitization or cross-linking (on the order of 10 nm), while the plasma VUV light (110-210 nm) is clearly identified as being responsible for ester and lactone group removal from the resist bulk. As the resist modification depth depends strongly on the wavelength penetration into the material, it is found that HBr plasma cure that emits near 160-170 nm can chemically modify the photoresist through its entire thickness (240 nm), while the impact of Ar plasmas emitting near 100 nm is more limited. In the case of HBr cure treatment, Raman and ellipsometry analyses reveal the formation of sp{sup 2} carbon atoms in the resist bulk, certainly thanks to hydrogen diffusion through the resist film assisted by the VUV plasma light.« less

Assessment of practicality of remote sensing techniques for a study of the effects of strip mining in Alabama

NASA Technical Reports Server (NTRS)

Hughes, T. H.; Dillion, A. C., III; White, J. R., Jr.; Drummond, S. E., Jr.; Hooks, W. G.

1975-01-01

Because of the volume of coal produced by strip mining, the proximity of mining operations, and the diversity of mining methods (e.g. contour stripping, area stripping, multiple seam stripping, and augering, as well as underground mining), the Warrior Coal Basin seemed best suited for initial studies on the physical impact of strip mining in Alabama. Two test sites, (Cordova and Searles) representative of the various strip mining techniques and environmental problems, were chosen for intensive studies of the correlation between remote sensing and ground truth data. Efforts were eventually concentrated in the Searles Area, since it is more accessible and offers a better opportunity for study of erosional and depositional processes than the Cordova Area.

Extraction, scrub, and strip test results for the salt waste processing facility caustic side solvent extraction solvent example

DOE Office of Scientific and Technical Information (OSTI.GOV)

Peters, T. B.

An Extraction, Scrub, and Strip (ESS) test was performed on a sample of Salt Waste Processing Facility (SWPF) Caustic-Side Solvent Extraction (CSSX) solvent and salt simulant to determine cesium distribution ratios (D(Cs)), and cesium concentration in the strip effluent (SE) and decontaminated salt solution (DSS) streams; this data will be used by Parsons to help determine if the solvent is qualified for use at the SWPF. The ESS test showed acceptable performance of the solvent for extraction, scrub, and strip operations. The extraction D(Cs) measured 12.9, exceeding the required value of 8. This value is consistent with results from previousmore » ESS tests using similar solvent formulations. Similarly, scrub and strip cesium distribution ratios fell within acceptable ranges.« less

Data-based hybrid tension estimation and fault diagnosis of cold rolling continuous annealing processes.

PubMed

Liu, Qiang; Chai, Tianyou; Wang, Hong; Qin, Si-Zhao Joe

2011-12-01

The continuous annealing process line (CAPL) of cold rolling is an important unit to improve the mechanical properties of steel strips in steel making. In continuous annealing processes, strip tension is an important factor, which indicates whether the line operates steadily. Abnormal tension profile distribution along the production line can lead to strip break and roll slippage. Therefore, it is essential to estimate the whole tension profile in order to prevent the occurrence of faults. However, in real annealing processes, only a limited number of strip tension sensors are installed along the machine direction. Since the effects of strip temperature, gas flow, bearing friction, strip inertia, and roll eccentricity can lead to nonlinear tension dynamics, it is difficult to apply the first-principles induced model to estimate the tension profile distribution. In this paper, a novel data-based hybrid tension estimation and fault diagnosis method is proposed to estimate the unmeasured tension between two neighboring rolls. The main model is established by an observer-based method using a limited number of measured tensions, speeds, and currents of each roll, where the tension error compensation model is designed by applying neural networks principal component regression. The corresponding tension fault diagnosis method is designed using the estimated tensions. Finally, the proposed tension estimation and fault diagnosis method was applied to a real CAPL in a steel-making company, demonstrating the effectiveness of the proposed method.

NASA/Air Force/Environmental Protection Agency Interagency Depainting Study

NASA Technical Reports Server (NTRS)

Clark-Ingram, Marceia

1998-01-01

Many popular and widely used paint stripping products have traditionally contained methylene chloride as their main active ingredient. However, the Environmental Protection Agency (EPA) has critically curved the allowable use of methylene chloride under the National Emission Standard for Hazardous Air Pollutants regulating Aerospace Manufacturing and Rework Facilities . Compliance with this rule was mandatory by September 1998 for affected facilities. An effort is underway to identify and evaluate alternative depainting technologies emphasizing those believed both effective and environmentally benign. On behalf of the EPA and in cooperation with the United States Air Force, the National Aeronautics and Space Administration is conducting a technical assessment of several alternative technologies ( i.e. : chemical stripping, two CO2 blasting processes, CO2 xenon lamp coating removal, CO2 Laser stripping, plastic media blasting, sodium bicarbonate wet stripping, high pressure water stripping, and wheat starch blasting). These depainting processes represent five removal method categories, namely abrasive, impact, cryogenic, thermal, and/or molecular bonding dissociation. This paper discusses the test plan and parameters for this interagency study. Several thicknesses of clad and non-clad aluminum substrates were used to prepare test specimens. Each depainting process has been assigned a specimen lot, all of which have completed three to five stripping cycles. Numerous metallurgical evaluations are underway to assess the impact of these alternative depainting processes upon the structural integrity of the substrate.

40 CFR Table 9 to Subpart Hhhhhhh... - Procedures for Conducting Sampling of Stripped Resin and Process Wastewater

Code of Federal Regulations, 2014 CFR

2014-07-01

... Stripped Resin and Process Wastewater 9 Table 9 to Subpart HHHHHHH of Part 63 Protection of Environment... Wastewater For demonstrating . . . For the following emission points and types of processes . . . Collect.... Each process wastewater stream 3. Initial compliance N/A 1 grab sample 1 grab sample. 4. Continuous...

40 CFR Table 9 to Subpart Hhhhhhh... - Procedures for Conducting Sampling of Stripped Resin and Process Wastewater

Code of Federal Regulations, 2013 CFR

2013-07-01

... Stripped Resin and Process Wastewater 9 Table 9 to Subpart HHHHHHH of Part 63 Protection of Environment... Wastewater For demonstrating . . . For the following emission points and types of processes . . . Collect.... Each process wastewater stream 3. Initial compliance N/A 1 grab sample 1 grab sample. 4. Continuous...

The Physics of Ultracold Sr2 Molecules: Optical Production and Precision Measurement

NASA Astrophysics Data System (ADS)

Osborn, Christopher Butler

Colloidal quantum dots have desirable optical properties which can be exploited to realize a variety of photonic devices and functionalities. However, colloidal dots have not had a pervasive utility in photonic devices because of the absence of patterning methods. The electronic chip industry is highly successful due to the well-established lithographic procedures. In this thesis we borrow ideas from the semiconductor industry to develop lithographic techniques that can be used to pattern colloidal quantum dots while ensuring that the optical properties of the quantum dots are not affected by the process. In this thesis we have developed colloidal quantum dot based waveguide structures for amplification and switching applications for all-optical signal processing. We have also developed colloidal quantum dot based light emitting diodes. We successfully introduced CdSe/ZnS quantum dots into a UV curable photo-resist, which was then patterned to realize active devices. In addition, "passive" devices (devices without quantum dots) were integrated to "active" devices via waveguide couplers. Use of photo-resist devices offers two distinct advantages. First, they have low scattering loss and secondly, they allow good fiber to waveguide coupling efficiency due to the low refractive index which allows for large waveguide cross-sections while supporting single mode operation. Practical planar photonic devices and circuits incorporating both active and passive structures can now be realized, now that we have patterning capabilities of quantum dots while maintaining the original optical attributes of the system. In addition to the photo-resist host, we also explored the incorporation of colloidal quantum dots into a dielectric silicon dioxide and silicon nitride one-dimensional microcavity structures using low temperature plasma enhanced chemical vapor deposition. This material system can be used to realize microcavity light emitting diodes that can be realized on any substrate. As a proof of concept demonstration we show a 1550 nm emitting all-dielectric vertical cavity structure embedded with PbS quantum dots. Enhancement in spontaneous emission from the dots embedded in the microcavity is also demonstrated.

Tastier and healthier alternatives to French fries.

PubMed

Rommens, Caius M; Shakya, Roshani; Heap, Mark; Fessenden, Kristi

2010-05-01

The effect of both the origin and shape of potato cuts on fry quality was investigated in this study. Linear strips from the inner core of tubers were compared to those from outer tissues, both before and after processing, and strips from either specific tissues or whole peeled tubers were also evaluated against ring-shaped cuts. Both strips and rings had 0.7 cm sides and, in most cases, a volume of 4.9 cm(3). They were analyzed for moisture content, antioxidants, asparagine, and reducing sugars. The material was then blanched, dipped in 0.5% disodium acid pyrophosphate and 0.3% glucose, dried at 77 degrees C, par-fried in soybean oil at 191 degrees C, and finish-fried at 168 degrees C. The fried product was analyzed for sensory characteristics and oil, salt, and acrylamide content. Our results showed that strips from the inner core absorbed 28% more oil and exhibited inferior sensory characteristics compared to strips from the outer parts. The extended drying and frying times needed to match the crispness and flavor of inner strips to those of regularly fried outer strips resulted in a further increased absorption of oil and, importantly, triggered a 163% increase in levels of the toxic Maillard reaction product acrylamide. Potato rings consisted of higher dry matter material, contained more antioxidants, and had a lower surface-to-volume ratio than the conventional linear strips. Upon processing, they also absorbed 22% less oil, contained 26% less salt, and displayed superior sensory properties. Thus, ring fries may represent an attractive alternative to French fries as processed staple food.

UV-LIGA microfabrication process for sub-terahertz waveguides utilizing multiple layered SU-8 photoresist

NASA Astrophysics Data System (ADS)

Malekabadi, Ali; Paoloni, Claudio

2016-09-01

A microfabrication process based on UV LIGA (German acronym of lithography, electroplating and molding) is proposed for the fabrication of relatively high aspect ratio sub-terahertz (100-1000 GHz) metal waveguides, to be used as a slow wave structure in sub-THz vacuum electron devices. The high accuracy and tight tolerances required to properly support frequencies in the sub-THz range can be only achieved by a stable process with full parameter control. The proposed process, based on SU-8 photoresist, has been developed to satisfy high planar surface requirements for metal sub-THz waveguides. It will be demonstrated that, for a given thickness, it is more effective to stack a number of layers of SU-8 with lower thickness rather than using a single thick layer obtained at lower spin rate. The multiple layer approach provides the planarity and the surface quality required for electroforming of ground planes or assembly surfaces and for assuring low ohmic losses of waveguides. A systematic procedure is provided to calculate soft and post-bake times to produce high homogeneity SU-8 multiple layer coating as a mold for very high quality metal waveguides. A double corrugated waveguide designed for 0.3 THz operating frequency, to be used in vacuum electronic devices, was fabricated as test structure. The proposed process based on UV LIGA will enable low cost production of high accuracy sub-THz 3D waveguides. This is fundamental for producing a new generation of affordable sub-THz vacuum electron devices, to fill the technological gap that still prevents a wide diffusion of numerous applications based on THz radiation.

Integrating nanosphere lithography in device fabrication

NASA Astrophysics Data System (ADS)

Laurvick, Tod V.; Coutu, Ronald A.; Lake, Robert A.

2016-03-01

This paper discusses the integration of nanosphere lithography (NSL) with other fabrication techniques, allowing for nano-scaled features to be realized within larger microelectromechanical system (MEMS) based devices. Nanosphere self-patterning methods have been researched for over three decades, but typically not for use as a lithography process. Only recently has progress been made towards integrating many of the best practices from these publications and determining a process that yields large areas of coverage, with repeatability and enabled a process for precise placement of nanospheres relative to other features. Discussed are two of the more common self-patterning methods used in NSL (i.e. spin-coating and dip coating) as well as a more recently conceived variation of dip coating. Recent work has suggested the repeatability of any method depends on a number of variables, so to better understand how these variables affect the process a series of test vessels were developed and fabricated. Commercially available 3-D printing technology was used to incrementally alter the test vessels allowing for each variable to be investigated individually. With these deposition vessels, NSL can now be used in conjunction with other fabrication steps to integrate features otherwise unattainable through current methods, within the overall fabrication process of larger MEMS devices. Patterned regions in 1800 series photoresist with a thickness of ~700nm are used to capture regions of self-assembled nanospheres. These regions are roughly 2-5 microns in width, and are able to control the placement of 500nm polystyrene spheres by controlling where monolayer self-assembly occurs. The resulting combination of photoresist and nanospheres can then be used with traditional deposition or etch methods to utilize these fine scale features in the overall design.

Distillation and Air Stripping Designs for the Lunar Surface

NASA Technical Reports Server (NTRS)

Boul, Peter J.; Lange, Kevin E.; Conger, Bruce; Anderson, Molly

2009-01-01

Air stripping and distillation are two different gravity-based methods, which may be applied to the purification of wastewater on the lunar base. These gravity-based solutions to water processing are robust physical separation techniques, which may be advantageous to many other techniques for their simplicity in design and operation. The two techniques can be used in conjunction with each other to obtain high purity water. The components and feed compositions for modeling waste water streams are presented in conjunction with the Aspen property system for traditional stage distillation models and air stripping models. While the individual components for each of the waste streams will vary naturally within certain bounds, an analog model for waste water processing is suggested based on typical concentration ranges for these components. Target purity levels for the for recycled water are determined for each individual component based on NASA s required maximum contaminant levels for potable water Distillation processes are modeled separately and in tandem with air stripping to demonstrate the potential effectiveness and utility of these methods in recycling wastewater on the Moon. Optimum parameters such as reflux ratio, feed stage location, and processing rates are determined with respect to the power consumption of the process. Multistage distillation is evaluated for components in wastewater to determine the minimum number of stages necessary for each of 65 components in humidity condensate and urine wastewater mixed streams. Components of the wastewater streams are ranked by Henry s Law Constant and the suitability of air stripping in the purification of wastewater in terms of component removal is evaluated. Scaling factors for distillation and air stripping columns are presented to account for the difference in the lunar gravitation environment. Commercially available distillation and air stripping units which are considered suitable for Exploration Life Support are presented. The advantages to the various designs are summarized with respect to water purity levels, power consumption, and processing rates.

Efficient ethanol recovery from yeast fermentation broth with integrated distillation-membrane process

EPA Science Inventory

A hybrid process integrating vapor stripping with vapor compression and vapor permeation membrane separation, termed Membrane Assisted Vapor Stripping (MAVS), was evaluated for recovery and dehydration of ethanol from aqueous solution as an alternative to conventional distillatio...

Optimization of plasma etching of SiO2 as hard mask for HgCdTe dry etching

NASA Astrophysics Data System (ADS)

Chen, Yiyu; Ye, Zhenhua; Sun, Changhong; Zhang, Shan; Xin, Wen; Hu, Xiaoning; Ding, Ruijun; He, Li

2016-10-01

HgCdTe is one of the dominating materials for infrared detection. To pattern this material, our group has proven the feasibility of SiO2 as a hard mask in dry etching process. In recent years, the SiO2 mask patterned by plasma with an auto-stopping layer of ZnS sandwiched between HgCdTe and SiO2 has been developed by our group. In this article, we will report the optimization of SiO2 etching on HgCdTe. The etching of SiO2 is very mature nowadays. Multiple etching recipes with deferent gas mixtures can be used. We utilized a recipe containing Ar and CHF3. With strictly controlled photolithography, the high aspect-ratio profile of SiO2 was firstly achieved on GaAs substrate. However, the same recipe could not work well on MCT because of the low thermal conductivity of HgCdTe and CdTe, resulting in overheated and deteriorated photoresist. By decreasing the temperature, the photoresist maintained its good profile. A starting table temperature around -5°C worked well enough. And a steep profile was achieved as checked by the SEM. Further decreasing of temperature introduced profile with beveled corner. The process window of the temperature is around 10°C. Reproducibility and uniformity were also confirmed for this recipe.

Fabrication of three-dimensional millimeter-height structures using direct ultraviolet lithography on liquid-state photoresist for simple and fast manufacturing

NASA Astrophysics Data System (ADS)

Kim, Jungkwun; Yoon, Yong-Kyu

2015-07-01

A rapid three-dimensional (3-D) ultraviolet (UV) lithography process for the fabrication of millimeter-tall high aspect ratio complex structures is presented. The liquid-state negative-tone photosensitive polyurethane, LF55GN, has been directly photopatterned using multidirectionally projected UV light for 3-D micropattern formation. The proposed lithographic scheme enabled us to overcome the maximum height obtained with a photopatternable epoxy, SU8, which has been conventionally most commonly used for the fabrication of tall and high aspect ratio microstructures. Also, the fabrication process time has been significantly reduced by eliminating photoresist-baking steps. Computer-controlled multidirectional UV lithography has been employed to fabricate 3-D structures, where the UV-exposure substrate is dynamically tilt-rotating during UV exposure to create various 3-D ray traces in the polyurethane layer. LF55GN has been characterized to provide feasible fabrication conditions for the multidirectional UV lithography. Very tall structures including a 6-mm tall triangular slab and a 5-mm tall hexablaze have been successfully fabricated. A 4.5-mm tall air-lifted polymer-core bowtie monopole antenna, which is the tallest monopole structure fabricated by photolithography and subsequent metallization, has been successfully demonstrated. The antenna shows a resonant radiation frequency of 12.34 GHz, a return loss of 36 dB, and a 10 dB bandwidth of 7%.

Graphic Arts: Book Two. Process Camera, Stripping, and Platemaking.

ERIC Educational Resources Information Center

Farajollahi, Karim; And Others

The second of a three-volume set of instructional materials for a course in graphic arts, this manual consists of 10 instructional units dealing with the process camera, stripping, and platemaking. Covered in the individual units are the process camera and darkroom photography, line photography, half-tone photography, other darkroom techniques,…

Graphic Arts: Process Camera, Stripping, and Platemaking. Third Edition.

ERIC Educational Resources Information Center

Crummett, Dan

This document contains teacher and student materials for a course in graphic arts concentrating on camera work, stripping, and plate making in the printing process. Eight units of instruction cover the following topics: (1) the process camera and darkroom equipment; (2) line photography; (3) halftone photography; (4) other darkroom techniques; (5)…

Brightness field distributions of microlens arrays using micro molding.

PubMed

Cheng, Hsin-Chung; Huang, Chiung-Fang; Lin, Yi; Shen, Yung-Kang

2010-12-20

This study describes the brightness field distributions of microlens arrays fabricated by micro injection molding (μIM) and micro injection-compression molding (μICM). The process for fabricating microlens arrays used room-temperature imprint lithography, photoresist reflow, electroforming, μIM, μICM, and optical properties measurement. Analytical results indicate that the brightness field distribution of the molded microlens arrays generated by μICM is better than those made using μIM. Our results further demonstrate that mold temperature is the most important processing parameter for brightness field distribution of molded microlens arrays made by μIM or μICM.

AISI/DOE Advanced Process Control Program Vol. 3 of 6 Microstructure Engineering in Hot Strip Mills, Part 1 of 2: Integrated Mathematical Model

DOE Office of Scientific and Technical Information (OSTI.GOV)

J.K. Brimacombe; I.V. Samarasekera; E.B. Hawbolt

1999-07-31

This report describes the work of developing an integrated model used to predict the thermal history, deformation, roll forces, microstructural evolution and mechanical properties of steel strip in a hot-strip mill. This achievement results from a joint research effort that is part of the American Iron and Steel Institute's (AIS) Advanced Process Control Program, a collaboration between the U.S. DOE and fifteen North American Steelmakers.

Studies on the stripping of cerium from the loaded tbp-kerosene solution

DOE Office of Scientific and Technical Information (OSTI.GOV)

Rizk, S.E.; Abdel Rahman, N.; Daoud, J.A.

2008-07-01

The reductive stripping of Ce(IV) from the loaded organic phase (30% TBP in kerosene) was investigated, using two stripping agents, EDTA and H{sub 2}O{sub 2}, in nitric acid. The results are compared to determine the optimum conditions for the reduction of Ce(IV) in the organic phase to Ce(III) in the aqueous phase. For each of the two stripping agents, the effect of different parameters affecting the reduction process was investigated: stripping-agent concentration, nitric acid concentration, phase ratio, shaking time, and temperature. The results are compared and discussed in terms of the conditions required for maximum reductive stripping of Ce(IV). (authors)

Extraction, scrub, and strip test results for the solvent transfer to salt waste processing facility

DOE Office of Scientific and Technical Information (OSTI.GOV)

Peters, T.

The Savannah River National Laboratory (SRNL) prepared approximately 240 gallons of Caustic-Side Solvent Extraction (CSSX) solvent for use at the Salt Waste Processing Facility (SWPF). An Extraction, Scrub, and Strip (ESS) test was performed on a sample of the prepared solvent using a salt solution prepared by Parsons to determine cesium distribution ratios (D(Cs)), and cesium concentration in the strip effluent (SE) and decontaminated salt solution (DSS) streams. This data will be used by Parsons to help qualify the solvent for use at the SWPF. The ESS test showed acceptable performance of the solvent for extraction, scrub, and strip operations.more » The extraction D(Cs) measured 15.5, exceeding the required value of 8. This value is consistent with results from previous ESS tests using similar solvent formulations. Similarly, scrub and strip cesium distribution ratios fell within acceptable ranges.« less

Online aptitude automatic surface quality inspection system for hot rolled strips steel

NASA Astrophysics Data System (ADS)

Lin, Jin; Xie, Zhi-jiang; Wang, Xue; Sun, Nan-Nan

2005-12-01

Defects on the surface of hot rolled steel strips are main factors to evaluate quality of steel strips, an improved image recognition algorithm are used to extract the feature of Defects on the surface of steel strips. Base on the Machine vision and Artificial Neural Networks, establish a defect recognition method to select defect on the surface of steel strips. Base on these research. A surface inspection system and advanced algorithms for image processing to hot rolled strips is developed. Preparing two different fashion to lighting, adopting line blast vidicon of CCD on the surface steel strips on-line. Opening up capacity-diagnose-system with level the surface of steel strips on line, toward the above and undersurface of steel strips with ferric oxide, injure, stamp etc of defects on the surface to analyze and estimate. Miscarriage of justice and alternate of justice rate not preponderate over 5%.Geting hold of applications on some big enterprises of steel at home. Experiment proved that this measure is feasible and effective.

Air Stripping Designs and Reactive Water Purification Processes for the Lunar Surface

NASA Technical Reports Server (NTRS)

Boul, Peter J.; Lange, Kevin; Conger, Bruce; Anderson, Molly

2010-01-01

Air stripping designs are considered to reduce the presence of volatile organic compounds in the purified water. Components of the wastewater streams are ranked by Henry's Law Constant and the suitability of air stripping in the purification of wastewater in terms of component removal is evaluated. Distillation processes are modeled in tandem with air stripping to demonstrate the potential effectiveness and utility of these methods in recycling wastewater on the Moon. Scaling factors for distillation and air stripping columns are presented to account for the difference in the lunar gravitation environment. Commercially available distillation and air stripping units which are considered suitable for Exploration Life Support are presented. The advantages to the various designs are summarized with respect to water purity levels, power consumption, and processing rates. An evaluation of reactive distillation and air stripping is presented with regards to the reduction of volatile organic compounds in the contaminated water and air. Among the methods presented, an architecture is presented for the evaluation of the simultaneous oxidation of organics in air and water. These and other designs are presented in light of potential improvements in power consumptions and air and water purities for architectures which include catalytic activity integrated into the water processor. In particular, catalytic oxidation of organics may be useful as a tool to remove contaminants that more traditional distillation and/or air stripping columns may not remove. A review of the current leading edge at the commercial level and at the research frontier in catalytically active materials is presented. Themes and directions from the engineering developments in catalyst design are presented conceptually in light of developments in the nanoscale chemistry of a variety of catalyst materials.

Cathodic Stripping Analysis Complicated by Adsorption Processes: Determination of 2-Thiouracil at a Rotating Silver Disk Electrode,

DTIC Science & Technology

1983-01-01

concentration, poten- tial sweep rate, rotation speed, deposition potential and other parameters -on the shape and height of the stripping peaks have...concentration, potential sweep rate, rotation speed, deposition potential and other parameters on the shape and height of the stripping peaks have been...of the greater surface area of a solid electrode compared to a dropping mercury electrode. Cathodic stripping voltametry at a rotating silver disk

Membrane-assisted vapor stripping: energy efficient hybrid distillation-vapor permeation process for alcohol-water separation

EPA Science Inventory

BACKGROUND: Energy efficient alternatives to distillation for alcohol recovery from dilute solution are needed to improve biofuel sustainability. A process integrating steam stripping with a vapor compression step and a vapor permeation membrane separation step is proposed. The...

Thermal stability study of a new guanidine suppressor for the next-generation caustic-side solvent extraction process

DOE PAGES

Hill, Talon G.; Ensor, Dale D.; Delmau, Lætitia Helene; ...

2016-02-06

Cesium stripping performance of thermally stressed solvent degrades slowly over time in batch tests of the Next Generation Caustic-Side Solvent Extraction (NGS) process. NGS is currently used at pilot scale at the Savannah River Site for the selective removal of cesium from high-level salt waste. Recently a new guanidine, N,N',N" -tris(3,7-dimethyloctyl)guanidine (TiDG), was chosen for use as the suppressor, a lipophilic organic base needed for stripping, and the present study was undertaken to address the question of its stability. The NGS process solvent was evaluated for a period of three months under a variety of temperature and storage conditions. Themore » performance of the solvent was tested at 30-day increments using a standard extraction, scrub, strip, and extraction (ES 2S 3E) sequence. Lastly, the results provide insight on the effects of storage and process conditions, the stripping behavior of TiDG, and the stability of the new solvent composition.« less

Thermal stability study of a new guanidine suppressor for the next-generation caustic-side solvent extraction process

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hill, Talon G.; Ensor, Dale D.; Delmau, Lætitia Helene

Cesium stripping performance of thermally stressed solvent degrades slowly over time in batch tests of the Next Generation Caustic-Side Solvent Extraction (NGS) process. NGS is currently used at pilot scale at the Savannah River Site for the selective removal of cesium from high-level salt waste. Recently a new guanidine, N,N',N" -tris(3,7-dimethyloctyl)guanidine (TiDG), was chosen for use as the suppressor, a lipophilic organic base needed for stripping, and the present study was undertaken to address the question of its stability. The NGS process solvent was evaluated for a period of three months under a variety of temperature and storage conditions. Themore » performance of the solvent was tested at 30-day increments using a standard extraction, scrub, strip, and extraction (ES 2S 3E) sequence. Lastly, the results provide insight on the effects of storage and process conditions, the stripping behavior of TiDG, and the stability of the new solvent composition.« less

Mechanistic simulation of batch acetone-butanol-ethanol (ABE) fermentation with in situ gas stripping using Aspen Plus™.

PubMed

Darkwah, Kwabena; Nokes, Sue E; Seay, Jeffrey R; Knutson, Barbara L

2018-05-22

Process simulations of batch fermentations with in situ product separation traditionally decouple these interdependent steps by simulating a separate "steady state" continuous fermentation and separation units. In this study, an integrated batch fermentation and separation process was simulated for a model system of acetone-butanol-ethanol (ABE) fermentation with in situ gas stripping, such that the fermentation kinetics are linked in real-time to the gas stripping process. A time-dependent cell growth, substrate utilization, and product production is translated to an Aspen Plus batch reactor. This approach capitalizes on the phase equilibria calculations of Aspen Plus to predict the effect of stripping on the ABE fermentation kinetics. The product profiles of the integrated fermentation and separation are shown to be sensitive to gas flow rate, unlike separate steady state fermentation and separation simulations. This study demonstrates the importance of coupled fermentation and separation simulation approaches for the systematic analyses of unsteady state processes.

Capabilities of ICP-RIE cryogenic dry etching of silicon: review of exemplary microstructures

NASA Astrophysics Data System (ADS)

Sökmen, Ü.; Stranz, A.; Fündling, S.; Wehmann, H.-H.; Bandalo, V.; Bora, A.; Tornow, M.; Waag, A.; Peiner, E.

2009-10-01

Inductively coupled plasma (ICP) cryogenic dry etching was used to etch submicron pores, nano contact lines, submicron diameter pillars, thin and thick cantilevers, membrane structures and anisotropic deep structures with high aspect ratios in silicon for bio-nanoelectronics, optoelectronics and nano-micro electromechanical systems (NMEMS). The ICP cryogenic dry etching gives us the advantage of switching plasmas between etch rates of 13 nm min-1 and 4 µm min-1 for submicron pores and for membrane structures, respectively. A very thin photoresist mask can endure at -75 °C even during etching 70 µm deep for cantilevers and 300 µm deep for membrane structures. Coating the backsides of silicon membrane substrates with a thin photoresist film inhibited the lateral etching of cantilevers during their front release. Between -95 °C and -140 °C, we realized crystallographic-plane-dependent etching that creates facets only at the etch profile bottom. By varying the oxygen content and the process temperature, we achieved good control over the shape of the etched structures. The formation of black silicon during membrane etching down to 300 µm was delayed by reducing the oxygen content.

Photoresist and stochastic modeling

NASA Astrophysics Data System (ADS)

Hansen, Steven G.

2018-01-01

Analysis of physical modeling results can provide unique insights into extreme ultraviolet stochastic variation, which augment, and sometimes refute, conclusions based on physical intuition and even wafer experiments. Simulations verify the primacy of "imaging critical" counting statistics (photons, electrons, and net acids) and the image/blur-dependent dose sensitivity in describing the local edge or critical dimension variation. But the failure of simple counting when resist thickness is varied highlights a limitation of this exact analytical approach, so a calibratable empirical model offers useful simplicity and convenience. Results presented here show that a wide range of physical simulation results can be well matched by an empirical two-parameter model based on blurred image log-slope (ILS) for lines/spaces and normalized ILS for holes. These results are largely consistent with a wide range of published experimental results; however, there is some disagreement with the recently published dataset of De Bisschop. The present analysis suggests that the origin of this model failure is an unexpected blurred ILS:dose-sensitivity relationship failure in that resist process. It is shown that a photoresist mechanism based on high photodecomposable quencher loading and high quencher diffusivity can give rise to pitch-dependent blur, which may explain the discrepancy.

Electroless-plated Ni pattern with catalyst printing on indium-gallium-zinc oxide surface

NASA Astrophysics Data System (ADS)

Onoue, Miki; Ogura, Shintaro; Kusaka, Yasuyuki; Fukuda, Nobuko; Yamamoto, Noritaka; Kojima, Keisuke; Chikama, Katsumi; Ushijima, Hirobumi

2017-05-01

Electroless plated metals have been used for wiring and electrodes in the manufacture of electronic devices. To obtain plated patterns, etching and photoresist are generally used. However, through catalyst patterning by printing, we can obtain metal patterns without etching and photoresists by electroless plating. Solution-processed indium-gallium-zinc oxide (IGZO) has received significant attention for showing high performance and ease of preparation in air atmosphere. In this study, we prepared an electroless plated pattern by catalyst printing as electrodes of IGZO TFT. There are few reports on the application of plated metal electrodes prepared by catalyst printing to the source and drain electrodes of IGZO TFT. The prepared IGZO TFT exhibits a typical current-voltage (I-V) curve. The plated electrodes caused many problems such as performance degradation. However, our result showed that the plated metal electrodes can drive IGZO TFT. In addition, we confirm plated metal growth into the catalyst layer by cross sectional scanning electron microscopy and energy-dispersive X-ray spectroscopy (SEM/EDS) of the plated Ni. We discuss the relevance of the measured work function (WF) of the electrode materials and the performance of IGZO TFT.

A novel method to fabricate silicon tubular gratings with broadband antireflection and super-hydrophobicity.

PubMed

Gao, Yang; Shi, Tielin; Tan, Xianhua; Liao, Guanglan

2014-06-01

We have developed a novel method to fabricate micro/nano structure based on the coherent diffraction lithography, and acquired periodic silicon tubular gratings with deep nano-scale tapered profiles at the top part. The optical properties of these tubular gratings were similar to an effective gradient-index antireflective surface, resulting in a broadband antireflective combining super-hydrophobic behavior. The mechanism of the method was simulated by rigorous coupled wave analysis algorithms. Then coherent diffraction lithography by use of suitable mask, in which periodic micro-scale circular opaque patters were distributed, was realized on the traditional aligner. Due to coherent diffraction, we obtained enough light intensity for photoresist exposure under the center of the opaque area in the mask together with transparent areas. The tapered line profiles and hollow photoresist gratings over large areas could be fabricated on the silicon wafer after development. The dry etching process was carried out, and high aspect ratio silicon tubular gratings with deep tapered profiles at the top were fabricated. The optical property and wettability of the structure were verified, proving that the proposed method and obtained micro/nano structure provide application potential in the future.

Silver nanowires as the current collector for a flexible in-plane micro-supercapacitor via a one-step, mask-free patterning strategy

NASA Astrophysics Data System (ADS)

Liu, Lang; Li, Han-Yu; Yu, Yao; Liu, Lin; Wu, Yue

2018-02-01

The fabrication of a current collector-contained in-plane micro-supercapacitor (MSC) usually requires the patterning of the current collector first and then subsequent patterning of the active material with the assistance of a photoresist and mask. However, this two-step patterning process is too complicated and the photoresist used is harmful to the properties of nanomaterials. Here, we demonstrate a one-step, mask-free strategy to pattern the current collector and the active material at the same time, for the fabrication of an all-solid-state flexible in-plane MSC. Silver nanowires (AgNWs) are used as the current collector. An atmospheric pressure pulsed cold micro-plasma-jet is used to realize the one-step, mask-free production of interdigitated multi-walled carbon nanotube (MWCNT)/AgNW electrodes. Remarkably, the fabricated MWCNT/AgNW-based MSC shows good flexibility and excellent rate capability. Moreover, the performance of properties including cyclic stability, equivalent series resistance, relaxation time and energy/power densities of the MWCNT/AgNW-based MSC are significantly enhanced by the presence of the AgNW current collector.

Hierarchical Micro/Nano Structures by Combined Self-Organized Dewetting and Photopatterning of Photoresist Thin Films.

PubMed

Sachan, Priyanka; Kulkarni, Manish; Sharma, Ashutosh

2015-11-17

Photoresists are the materials of choice for micro/nanopatterning and device fabrication but are rarely used as a self-assembly material. We report for the first time a novel interplay of self-assembly and photolithography for fabrication of hierarchical and ordered micro/nano structures. We create self-organized structures by the intensified dewetting of unstable thin (∼10 nm to 1 μm) photoresist films by annealing them in an optimal solvent and nonsolvent liquid mixture that allows spontaneous dewetting to form micro/nano smooth dome-like structures. The density, size (∼100 nm to millimeters), and curvature/contact angle of the dome/droplet structures are controlled by the film thickness, composition of the dewetting liquid, and time of annealing. Ordered dewetted structures are obtained simply by creating spatial variation of viscosity by ultraviolet exposure or by photopatterning before dewetting. Further, the structures thus fabricated are readily photopatterned again on the finer length scales after dewetting. We illustrate the approach by fabricating several three-dimensional structures of varying complexity with secondary and tertiary features.

Differences in multiplication of virulent and vaccine strains of poliovirus type I, II, and III in laboratory animals.

PubMed

Koroleva, G A; Lashkevich, V A; Voroshilova, M K

1977-01-01

Multiplication of virulent and vaccine strains of poliovirus type I, II and III in laboratory animals of different species was studied comparatively. The main criterion of virus reproduction was the production of the photoresistant virus progeny after inoculation of the animals with proflavin-photosensitized virus strains. On the whole, virulent poliovirus strains were characterized by replication in a wide range of hosts (monkeys, cotton rats, white mice, guinea pigs, rabbits, chickens, chick embryos), a low infective dose, production of the photoresistant progeny to a high titre, clinically overt disease in some animal species. The vaccine strains multiplied in a norrower range of hosts, had a high infective dose, a low titre of virus progeny, and caused no clinical symptoms of infection. These differences may serve as a marker for differentiation between virulent and attenuated strains in vivo. Administration of guanidine before inoculation of newborn cotton rats completely prevented or delayed by several days the production of photoresistant virus progeny. This fact confirms the stability of the proflavin-poliovirus complex under conditions ruling out virus replication.

Organic-inorganic hybrid resists for EUVL

NASA Astrophysics Data System (ADS)

Singh, Vikram; Kalyani, Vishwanath; Satyanarayana, V. S. V.; Pradeep, Chullikkattil P.; Ghosh, Subrata; Sharma, Satinder; Gonsalves, Kenneth E.

2014-03-01

Herein, we describe preliminary results on organic-inorganic hybrid photoresists, capable of showing line patterns up to 16 nm under e-beam exposure studies, prepared by incorporating polyoxometalates (POMs) clusters into organic photoresist materials. Various Mo and W based clusters such as (TBA)2[Mo6O19], (TBA)5(H)[P2V3W15O62] and (TBA)4[P2Mo18O61] (where TBA = tetrabutyl ammonium counter ion) have been incorporated into PMMA matrix by mixing POM solutions and standard PMMA polymer in anisole (MW ~ 95000, MicroChem) in 1:33 w/v ratio. E-beam exposure followed by development with MIBK solutions showed that these new organic-inorganic hybrid photoresists show good line patterns upto 16 nm, which were not observed in the case of control experiments done on pure PMMA polymer resist. The observed enhancement of resist properties in the case of hybrid resists could possibly be due to a combination of features imparted to the resist by the POM clusters such as increased sensitivity, etch resistance and thermal stability.

Correlation of experimentally measured atomic scale properties of EUV photoresist to modeling performance: an exploration

NASA Astrophysics Data System (ADS)

Kandel, Yudhishthir; Chandonait, Jonathan; Melvin, Lawrence S.; Marokkey, Sajan; Yan, Qiliang; Grzeskowiak, Steven; Painter, Benjamin; Denbeaux, Gregory

2017-03-01

Extreme ultraviolet (EUV) lithography at 13.5 nm stands at the crossroads of next generation patterning technology for high volume manufacturing of integrated circuits. Photo resist models that form the part of overall pattern transform model for lithography play a vital role in supporting this effort. The physics and chemistry of these resists must be understood to enable the construction of accurate models for EUV Optical Proximity Correction (OPC). In this study, we explore the possibility of improving EUV photo-resist models by directly correlating the parameters obtained from experimentally measured atomic scale physical properties; namely, the effect of interaction of EUV photons with photo acid generators in standard chemically amplified EUV photoresist, and associated electron energy loss events. Atomic scale physical properties will be inferred from the measurements carried out in Electron Resist Interaction Chamber (ERIC). This study will use measured physical parameters to establish a relationship with lithographically important properties, such as line edge roughness and CD variation. The data gathered from these measurements is used to construct OPC models of the resist.

Qualification of submerged-arc narrow strip cladding process

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ayres, P.S.; Gottschling, J.D.; Jeffers, G.K.

1975-08-01

An unique narrow strip cladding process for use on both plate and forging material for nuclear components was developed. The qualification testing of this low-heat input process for cladding nuclear components, including those of SA508 Class 2 material is described. The theory that explains the acceptable results of these tests is also given. (auth)

Qualification of submerged-arc narrow strip cladding process

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ayres, P.S.; Gottschling, J.D.; Jeffers, G.K.

1976-03-01

Babcock and Wilcox has developed an unique narrow strip cladding process for use on both plate and forging material for nuclear components. The qualification testing of this low-heat input process for cladding nuclear components is described, including those of SA508 Class 2 material. The theory that explains the acceptable results of these tests is also given.

Optimization Recovery of Yttrium Oxide in Precipitation, Extraction, and Stripping Process

NASA Astrophysics Data System (ADS)

Perwira, N. I.; Basuki, K. T.; Biyantoro, D.; Effendy, N.

2018-04-01

Yttrium oxide can be used as a dopant control rod of nuclear reactors in YSH material and superconductors. Yttrium oxide is obtained in the Xenotime mineral derived from byproduct of tin mining PT Timah Bangka which contain rare earth elements (REE) dominant Y, Dy, and Gd whose content respectively about 29.53%, 7.76%, and 2.58%. Both usage in the field of nuclear and non-nuclear science and technology is need to pure from the impurities. The presence of impurities in the yttrium oxide may affect the characteristic of the material and the efficiency of its use. Thus it needs to be separated by precipitation and extraction-stripping and calcination in the making of the oxide. However, to obtain higher levels of Yttrium oxide, it is necessary to determine the optimum conditions for its separation. The purpose of this research was to determine the optimum pH of precipitation, determine acid media and concentration optimum in extraction and stripping process and determine the efficiency of the separation of Y from REE concentrate. This research was conducted with pH variation in the precipitation process that pHs were 4 - 8, the difference of acid media for the extraction process, i.e., HNO3, HCl and H2SO4 with each concentration of 0,5 M; 1 M; 1,5 M; and 2 M and for stripping process were HNO3, HCl, and H2SO4 with each concentration of 1 M; 2M; and 3 M. Based on the result, the optimum pH of precipitation process was 6,5, the optimumacid media was HNO3 0,5 M, and for stripping process media was HNO3 3 M. The efficiency of precipitation process at pH 6,5 was 69,53 %, extraction process was 96.39% and stripping process was 4,50%. The separation process from precipitation to extraction had increased the purity and the highest efficiency recovery of Y was in the extraction process and obtained Y2O3 purer compared to the feed with the Y2O3 content of 92.87%.

Potential Industrial Applications of the One Atmosphere Uniform Glow Discharge Plasma (OAUGDP) Operating in Ambient Air

NASA Astrophysics Data System (ADS)

Reece Roth, J.

2004-11-01

The majority of industrial plasma processing with glow discharges has been conducted at pressures below 10 torr. This tends to limit applications to high value workpieces as a result of the high capital cost of vacuum systems and the production constraints of batch processing. It has long been recognized that glow discharge plasmas would play a much larger industrial role if they could be generated at one atmosphere. The One Atmosphere Uniform Glow Discharge Plasma (OAUGDP), developed at the University of Tennessee's Plasma Sciences Laboratory, is a non-thermal RF plasma operating on displacement currents with the time-resolved characteristics of a classical low pressure DC normal glow discharge. As a glow discharge, the OAUGDP operates with maximum electrical efficiency at the Stoletow point, where the energy input per ion-electron pair is a minimum [1, 2]. Several interdisciplinary teams have investigated potential applications of the OAUGDP. These teams included collaborators from the UTK Textiles and Nonwovens Development Center (TANDEC), and the Departments of Electrical and Computer Engineering, Microbiology, and Food Science and Technology, as well as the NASA Langley Research Center. The potential applications of the OAUGDP have all been at one atmosphere and room temperature, using air as the working gas. These applications include sterilizing medical and dental equipment; sterilizable air filters to deal with the "sick building syndrome"; removal of soot from Diesel engine exhaust; subsonic plasma aerodynamic effects, including flow re-attachment to airfoils and boundary layer modification; electrohydrodynamic (EDH) flow control of working gases; increasing the surface energy of materials; improving the adhesion of paints and electroplated layers: improving the wettability and wickability of fabrics; stripping of photoresist; and plasma deposition and directional etching of potential microelectronic relevance. [1] J. R. Roth, Industrial Plasma Engineering: Volume I, Principles. Institute of Physics Publishing, Bristol and Philadelphia 1995, ISBN 0-7503-0318-2. [2] Roth, J. R. Industrial Plasma Engineering: Volume II Applications to Nonthermal Plasma Processing Institute of Physics Publishing, Bristol and Philadelphia. 2001, ISBN 0-7503-0545-2.

With simple gasoline stripping devices, a problem of gas transportation by pipeline is resolved (in Spanish)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Couto, J.A.

1975-06-01

Liquid hydrocarbons contained in Argentina's Pico Truncade natural gas caused a number of serious pipeline transmission and gas processing problems. Gas del Estado has installed a series of efficient liquid removal devices at the producing fields. A flow chart of the gasoline stripping process is illustrated, as are 2 types of heat exchangers. This process of gasoline stripping (gas condensate recovery) integrates various operations which normally are performed independently: separation of the poor condensate in the gas, stabilization of the same, and incorporation of the light components (products of the stabilization) in the main gas flow.

Metallurgical Evaluations of Depainting Processes on Aluminum Substrate

NASA Technical Reports Server (NTRS)

McGill, Preston

1999-01-01

In December 1993, the Environmental Protection Agency (EPA) Emission Standards Division and the National Aeronautics and Space Administration's (NASA's) Marshall Space Flight Center (MSFC) signed an Interagency Agreement (IA) initiating a task force for the technical assessment of alternative technologies for aerospace depainting operations. The United States Air Force (USAF) joined the task force in 1994. The mandates of the task force were: (1) To identify available alternative depainting systems that do not rely on methylene chloride or other ozone-depleting, chlorinated, and volatile organic carbon solvents. (2) To determine the viability, applicability, and pollution prevention potential of each identified alternative. (3) To address issues of safety, environmental impact, reliability, and maintainability. Through a Technical Implementation Committee (TIC), the task force selected and evaluated eight alternative paint stripping technologies: chemical stripping, carbon dioxide (CO2) blasting, xenon flashlamp and CO2 coatings removal (FLASHJET(R)), CO2 laser stripping, plastic media blasting (PMB), sodium bicarbonate wet stripping, high-pressure water blasting (WaterJet), and wheat starch abrasive blasting (Enviro-Strip(R)). (The CO2 blasting study was discontinued after the first depainting sequence.) This final report presents the results of the Joint EPA/NASA/USAF Interagency Depainting Study. Significant topics include: (1) Final depainting sequence data for the chemical stripping, PMB, sodium bicarbonate wet stripping, and WaterJet processes. (2) Strip rates for all eight technologies. (3) Sequential comparisons of surface roughness measurements for the seven viable depainting technologies. (4) Chronological reviews of and lessons learned in the conduct of all eight technologies. (5) An analysis of the surface roughness trends for each of the seven technologies. (6) Metallurgic evaluations of panels Summaries of corrosion and hydrogen embrittlement evaluations of chemical stripping panels, detailed descriptions of which appear in previous reports. Because the requirements for alternative systems are diverse, as are initial setup, training, and on-going operational considerations, this study does not recommend a particular product or process. Users of this study will draw their own conclusions from the data presented herein.

40 CFR 52.254 - Organic solvent usage.

Code of Federal Regulations, 2012 CFR

2012-07-01

... Air Quality Control Regions (the “Regions”), as described in 40 CFR part 81, dated July 1, 1979... contrivances designed for processing continuous web, strip, or wire that emit organic materials in the course... articles, machines, equipment, or other contrivances designed for processing a continuous web, strip, or...

40 CFR 52.254 - Organic solvent usage.

Code of Federal Regulations, 2010 CFR

2010-07-01

... Air Quality Control Regions (the “Regions”), as described in 40 CFR part 81, dated July 1, 1979... contrivances designed for processing continuous web, strip, or wire that emit organic materials in the course... articles, machines, equipment, or other contrivances designed for processing a continuous web, strip, or...

40 CFR 52.254 - Organic solvent usage.

Code of Federal Regulations, 2014 CFR

2014-07-01

... Air Quality Control Regions (the “Regions”), as described in 40 CFR part 81, dated July 1, 1979... contrivances designed for processing continuous web, strip, or wire that emit organic materials in the course... articles, machines, equipment, or other contrivances designed for processing a continuous web, strip, or...

40 CFR 52.254 - Organic solvent usage.

Code of Federal Regulations, 2013 CFR

2013-07-01

... Air Quality Control Regions (the “Regions”), as described in 40 CFR part 81, dated July 1, 1979... contrivances designed for processing continuous web, strip, or wire that emit organic materials in the course... articles, machines, equipment, or other contrivances designed for processing a continuous web, strip, or...

Exploring the readiness of EUV photo materials for patterning advanced technology nodes

NASA Astrophysics Data System (ADS)

De Simone, Danilo; Vesters, Yannick; Shehzad, Atif; Vandenberghe, Geert; Foubert, Philippe; Beral, Christophe; Van Den Heuvel, Dieter; Mao, Ming; Lazzarino, Fred

2017-03-01

Imec is currently driving the extreme ultraviolet (EUV) photo material development within the imec material and equipment supplier hub. EUV baseline processes using the ASML NXE3300 full field scanner have been setup for the critical layers of the imec N7 (iN7) BEOL process modules with a resist sensitivity of 35mJ/cm2, 40mJ/cm2 and 60mJ/cm2 for metal, block and vias layer, respectively. A feasibility study on higher sensitivity resists for HVM has been recently conducted looking at 16nm dense line-space at a targeted exposure dose of 20mJ/cm2. Such a study reveals that photoresist formulations with a cost-effective resist sensitivity are feasible today. Moreover, recent advances in enhanced underlayers are further offering novel development opportunities to increase the resist sensitivity. However, line width roughness (LWR) and pattern defectivity at nano scale are the major limiting factors of the lithographic process window and further efforts are needed to reach a HVM maturity level. We will present the results of the photo material screening and we examine in detail the lithography patterning results for the best performing photoresists. We further discuss the fundamental aspects of photo materials from a light-matter interaction standpoint looking at the photo emission yield at the EUV light for different photo materials towards a better understanding of the relation between photon efficiency and patterning performance. Finally, as metal containing resists are becoming part of the EUV material landscape, we also review the manufacturing aspects of a such class of resists looking at metal cross contamination pattern and defectivity on the process equipment.

Maskless lithography using off-the-shelf inkjet printer

NASA Astrophysics Data System (ADS)

Seng, Leo Cheng; Chollet, Franck

2006-12-01

Photolithography is the most important process used to pattern the surface of silicon wafers in IC fabrication. It has shown high performance but its use is not cost-effective for small series or prototyping as it necessitates a costly infrastructure (mask aligner) and requires the fabrication of masks which can be expensive and timeconsuming. Recently, the high resolution achieved by ink-jet printer (> 1200 DPI) starts to make an interesting alternative to obtain a patterned protective layer instead of using photolithography. This is particularly true for MEMS which often need a resolution of only 10 to 20 μm. After studying the different architecture of inkjet printer available in the market, a commercial S$100-printer was selected and modified to allow printing on a rigid silicon wafer. We then developed three different patterning processes using the printer. In a first process the ink was directly used as a protective layer for patterning. A second process modified the photolithography by using the printed ink as a photo-mask on a spun layer of photoresist. In each case we had to modify the surface energy of the wafer by surface treatment to improve the resolution. Finally we replaced the ink with a modified photoresist solution and directly printed a protective mask onto the wafer. Design of Experiment (DOE) methods were systematically employed to study the main and interaction effects of the parameters on the lithography and on the pattern transfer. The series of experiment showed that off-the-shelf ink-jet printer could be used easily for pattern with a resolution below 50 μm, but could not yet reach the 20 μm range.

Formation of nanotunnels inside a resist film in laser interference lithography.

PubMed

Wei, Qi; Hu, Fanhua; Wang, Liyuan

2015-05-19

A few kinds of 2-diazo-1-naphthoquinone-4-sulfonates of poly(4-hydroxylstyrene) were prepared to form one-component i-line photoresists. In the laser interference lithography experiments of some of the photoresists, nanotunnels were observed to be aligned in the interior of the resist film. The shape and size of the nanotunnels remain virtually unchanged even under an increased exposure dose, indicating that the exposure energy is confined within the tunnel space. The formation of the nanotunnels results from the effect of standing waves and the permeation of developer from the surface deep into the resist films.

Technology for fabrication of a micromagnet on a tip of a MFM/MRFM probe

DOEpatents

Pelekhov, Denis V.; Hammel, P. Chris; Nunes, Jr., Geoffrey; Midzor, Melissa M.; Roukes, Michael

2004-01-13

A method for coating the tip of a mechanical resonator for use in magnetic force microscopy and magnetic resonance force microscopy in which the tip is coated with a ferromagnetic material and the cantilever is not, and the product resulting from the method. A cantilever and incorporated tip are coated with a photoresist, except that surface tension keeps photoresist off the tip. The cantilever and tip are then coated with a magnetic material. Next, acetone is used to lift off the magnetic material from the cantilever but not from the tip.

Rapidly solidified titanium alloys by melt overflow

NASA Technical Reports Server (NTRS)

Gaspar, Thomas A.; Bruce, Thomas J., Jr.; Hackman, Lloyd E.; Brasmer, Susan E.; Dantzig, Jonathan A.; Baeslack, William A., III

1989-01-01

A pilot plant scale furnace was designed and constructed for casting titanium alloy strips. The furnace combines plasma arc skull melting techniques with melt overflow rapid solidification technology. A mathematical model of the melting and casting process was developed. The furnace cast strip of a suitable length and width for use with honeycomb structures. Titanium alloys Ti-6Al-4V and Ti-14Al-21 Nb were successfully cast into strips. The strips were evaluated by optical metallography, microhardness measurements, chemical analysis, and cold rolling.

Fabrication of a micromold using negative PMER

NASA Astrophysics Data System (ADS)

Kwon, Young A.; Chae, Kyoung-Soo; Jeoung, Dae S.; Kim, Jong Y.; Moon, Sung

2001-10-01

We fabricated a micro mold using UV-lithography process with a novel mold material, negative PMER. Negative PMER(TOK, PMER N-CA3000) is a chemically amplified negative tone photoresist on a novolak resin base. It can be processed using standard equipment such as standard spin coater, baking with ovens or hotplates, and immersion development tools. Good quality resist patterns of up to 36μm thickness were achieved by means of this equipment in a short time. The conditions of this process were pre-exposure bake of 110 degree(s)C/12min, exposure dose of 675mJ/cm2 post-exposure bake of 100 degree(s)C/9min, and development for 10min.

[Evaluation of preexposed step wedges in acceptance tests of film processing in mammography].

PubMed

Blendl, C

2003-03-01

It was tested with 5 different types of mammography films in which manner the values of "Lightspeed" (LS) and "Lightcontrast" (LC), according DIN V 6868-55 will be changed, when preexposed film strips are used, stored at different climates and spaces of time in comparison to strips, which are exposed immediately before processing. It was proved, that the value LS of preexposed film strips in general will be lowered with increasing storage time compared to freshly exposed film strips, when both strips are processed simultaneously. This drift will be enhanced with increasing rel.humidity levels during storage. The value of LC increases in general with longer storage time and higher rel.humidity levels. The tested film types have all individual drifts in LS and LC. The precision of a single measurement using preexposed film strips was established over all different types of films at in about: Delta LS=0.06 and Delta LC (%)=16% [in the borders of 2 sigma (sigma)]. This uncertainty includes solely the precision of sensitometer, densitometer, the method to establish sensitometric values and unavoidable statistical fluctuations. Even when the systematic drift of the used film type is well established, the required precision, restricted to the listed items and prescribed in DIN V 6868-55, table D.1 to determine the values of LS with Delta LS=0.039 and the values of LC with Delta LC=7.2% is overstepped in so far, that it is impossible to draw a precise conclusion from the measured values to the performance of the subsystem film and processing. If any exceeding of the dose in image receptor plane is monitored, there is no tracking possible to a misadjustment of the subsystem film and processing.

Study on the wiping gas jet in continuous galvanizing line

NASA Astrophysics Data System (ADS)

Kweon, Yong-Hun; Kim, Heuy-Dong

2011-09-01

In the continuous hot-dip galvanizing process, the gas-jet wiping is used to control the coating thickness of moving steel strip. The high speed gas-jet discharged from the nozzle slot impinges on the strip, and at this moment, wipes the liquid coating layer dragged by a moving strip. The coating thickness is generally influenced on the flow characteristics of wiping gas-jet such as the impinging pressure distribution, pressure gradient and shear stress distribution on the surface of strip. The flow characteristics of wiping gas-jet mentioned above depends upon considerably both the process operating conditions such as the nozzle pressure, nozzle-to-strip distance and line speed, and the geometry of gas-jet wiping apparatus such as the height of nozzle slot. In the present study, the effect of the geometry of nozzle on the coating thickness is investigated with the help of a computational fluid dynamics method. The height of nozzle slot is varied in the range of 0.6mm to 1.7mm. A finite volume method (FVM) is employed to solve two-dimensional, steady, compressible Navier-Stokes equations. Based upon the results obtained, the effect of the height of nozzle slot in the gas-jet wiping process is discussed in detail. The computational results show that for a given standoff distance between the nozzle to the strip, the effective height of nozzle slot exists in achieving thinner coating thickness.

UV/H2O2 process stability and pilot-scale validation for trace organic chemical removal from wastewater treatment plant effluents.

PubMed

Miklos, David B; Hartl, Rebecca; Michel, Philipp; Linden, Karl G; Drewes, Jörg E; Hübner, Uwe

2018-06-01

This study investigated the removal of 15 trace organic chemicals (TOrCs) occurring at ambient concentrations from municipal wastewater treatment plant effluent by advanced oxidation using UV/H 2 O 2 at pilot-scale. Pseudo first-order rate constants (k obs ) for photolytic as well as combined oxidative and photolytic degradation observed at pilot-scale were validated with results from a bench-scale collimated beam device. No significant difference was determined between pilot- and lab-scale performance. During continuous pilot-scale operation at constant UV fluence of 800 mJ/cm 2 and H 2 O 2 dosage of 10 mg/L, the removal of various TOrCs was investigated. The average observed removal for photo-susceptible (k UV >10 -3  cm 2 /mJ; like diclofenac, iopromide and sulfamethoxazole), moderately photo-susceptible (10 -4

Extraction, Scrub, and Strip Test Results for the Salt Waste Processing Facility Caustic Side Solvent Extraction Solvent Sample

DOE Office of Scientific and Technical Information (OSTI.GOV)

Peters, T. B.

An Extraction, Scrub, and Strip (ESS) test was performed on a sample of Salt Waste Processing Facility (SWPF) Caustic-Side Solvent Extraction (CSSX) solvent and salt simulant to determine cesium distribution ratios (D( Cs)), and cesium concentration in the strip effluent (SE) and decontaminated salt solution (DSS) streams; this data will be used by Parsons to help determine if the solvent is qualified for use at the SWPF. The ESS test showed acceptable performance of the solvent for extraction, scrub, and strip operations. The extraction D( Cs) measured 12.5, exceeding the required value of 8. This value is consistent with resultsmore » from previous ESS tests using similar solvent formulations. Similarly, scrub and strip cesium distribution ratios fell within acceptable ranges. This revision was created to correct an error. The previous revision used an incorrect set of temperature correction coefficients which resulted in slight deviations from the correct D( Cs) results.« less

A CCD-based reader combined with CdS quantum dot-labeled lateral flow strips for ultrasensitive quantitative detection of CagA

NASA Astrophysics Data System (ADS)

Gui, Chen; Wang, Kan; Li, Chao; Dai, Xuan; Cui, Daxiang

2014-02-01

Immunochromatographic assays are widely used to detect many analytes. CagA is proved to be associated closely with initiation of gastric carcinoma. Here, we reported that a charge-coupled device (CCD)-based test strip reader combined with CdS quantum dot-labeled lateral flow strips for quantitative detection of CagA was developed, which used 365-nm ultraviolet LED as the excitation light source, and captured the test strip images through an acquisition module. Then, the captured image was transferred to the computer and was processed by a software system. A revised weighted threshold histogram equalization (WTHE) image processing algorithm was applied to analyze the result. CdS quantum dot-labeled lateral flow strips for detection of CagA were prepared. One hundred sera samples from clinical patients with gastric cancer and healthy people were prepared for detection, which demonstrated that the device could realize rapid, stable, and point-of-care detection, with a sensitivity of 20 pg/mL.

Ammonia removal in food waste anaerobic digestion using a side-stream stripping process.

PubMed

Serna-Maza, A; Heaven, S; Banks, C J

2014-01-01

Three 35-L anaerobic digesters fed on source segregated food waste were coupled to side-stream ammonia stripping columns and operated semi-continuously over 300 days, with results in terms of performance and stability compared to those of a control digester without stripping. Biogas was used as the stripping medium, and the columns were operated under different conditions of temperature (55, 70, 85 °C), pH (unadjusted and pH 10), and RT (2-5 days). To reduce digester TAN concentrations to a useful level a high temperature (≥70 °C) and a pH of 10 were needed; under these conditions 48% of the TAN was removed over a 138-day period without any detrimental effects on digester performance. Other effects of the stripping process were an overall reduction in digestate organic nitrogen-containing fraction compared to the control and a recovery in the acetoclastic pathway when TAN concentration was 1770±20 mg kg(-1). Copyright © 2013 Elsevier Ltd. All rights reserved.

Lithographic performance and dissolution behavior of novolac resins for various developer surfactant systems

NASA Astrophysics Data System (ADS)

Flores, Gary E.; Loftus, James E.

1992-06-01

The use of surfactants in today's society ranges over a wide variety of technologies, from soaps and detergents to house paints and electronic materials. In the semiconductor industry, surfactants are commonly used as coating additives in photoresists, as additives in wet chemical etchants, as additives in developer solutions, and in other areas where surface activity is desirable. In most applications, the mechanisms of surfactant chemistry are well established, yet there has been only a limited amount of published literature pertaining to characterizing the behavior of surfactants in developer systems for photoresists. This project explores the application of surfactants in an aqueous tetramethyl ammonium hydroxide (TMAH) based developer for two optical resists, one incorporating a 2,1,4- diazonaphthoquinone (DNQ) sensitizer, while the other incorporates a 2,1,5-DNQ sensitizer. In addition, each optical resist is based on different positive novolac resins with distinct structural properties. This feature aids in illustrating the improtance of matching the developer surfactant with the photoresist resin structure. Four distinct non-ionic surfactants with well published physical and chemical properties are examined. Properties of the surfactants explored include differences in structure, surfactant concentration, various degrees of hydrophilic versus lipophilic content (known as the HLB, or hydrophilic - lipophilic balance), and the differences in reported critical micelle concentration (CMC). Previous research investigated the performance characteristics of the 2,1,5-DNQ for these four surfactants. This investigation is an extension of the previous project by next considering a significantly different photoresist. A discussion of potential mechanisms of the solubilization and wetting effects is utilized to promote an understanding of surfactant effects in resist/developer systems. Also, because of the extensive characterization involved in screening surfactants, a recommended selection and screening scheme is proposed.

Assembly of optical fibers for the connection of polymer-based waveguide

NASA Astrophysics Data System (ADS)

Ansel, Yannick; Grau, Daniel; Holzki, Markus; Kraus, Silvio; Neumann, Frank; Reinhard, Carsten; Schmitz, Felix

2003-03-01

This paper describes the realization of polymer-based optical structures and the assembly and packaging strategy to connect optical fiber ribbons to the waveguides. For that a low cost fabrication process using the SU-8TM thick photo-resist is presented. This process consists in the deposition of two photo-structurized resist layers filled up with epoxy glue realising the core waveguide. For the assembly, a new modular vacuum gripper was realised and installed on an automatic pick and place assembly robot to mount precisely and efficiently the optical fibers in the optical structures. First results have shown acceptable optical propagation loss for the complete test structure.

Scalable fabrication of carbon-based MEMS/NEMS and their applications: a review

NASA Astrophysics Data System (ADS)

Jiang, Shulan; Shi, Tielin; Zhan, Xiaobin; Xi, Shuang; Long, Hu; Gong, Bo; Li, Junjie; Cheng, Siyi; Huang, Yuanyuan; Tang, Zirong

2015-11-01

The carbon-based micro/nano electromechanical system (MEMS/NEMS) technique provides a powerful approach to large-scale manufacture of high-aspect-ratio carbon structures for wafer-level processing. The fabricated three-dimensional (3D) carbon structures have the advantages of excellent electrical and electrochemical properties, and superior biocompatibility. In order to improve their performance for applications in micro energy storage devices and microsensors, an increase in the footprint surface area is of great importance. Various approaches have been proposed for fabricating large surface area carbon-based structures, including the integration of nanostructures such as carbon nanotubes (CNTs), graphene, nanowires, nanofilms and nanowrinkles onto 3D structures, which has been proved to be effective and productive. Moreover, by etching the 3D photoresist microstructures through oxygen plasma or modifying the photoresist with specific materials which can be etched in the following pyrolysis process, micro/nano hierarchical carbon structures have been fabricated. These improved structures show excellent performance in various applications, especially in the fields of biological sensors, surface-enhanced Raman scattering, and energy storage devices such as micro-supercapacitors and fuel cells. With the rapid development of microelectronic devices, the carbon-based MEMS/NEMS technique could make more aggressive moves into microelectronics, sensors, miniaturized power systems, etc. In this review, the recent advances in the fabrication of micro/nano hierarchical carbon-based structures are introduced and the technical challenges and future outlook of the carbon-based MEMS/NEMS techniques are also analyzed.

Estimation of line dimensions in 3D direct laser writing lithography

NASA Astrophysics Data System (ADS)

Guney, M. G.; Fedder, G. K.

2016-10-01

Two photon polymerization (TPP) based 3D direct laser writing (3D-DLW) finds application in a wide range of research areas ranging from photonic and mechanical metamaterials to micro-devices. Most common structures are either single lines or formed by a set of interconnected lines as in the case of crystals. In order to increase the fidelity of these structures and reach the ultimate resolution, the laser power and scan speed used in the writing process should be chosen carefully. However, the optimization of these writing parameters is an iterative and time consuming process in the absence of a model for the estimation of line dimensions. To this end, we report a semi-empirical analytic model through simulations and fitting, and demonstrate that it can be used for estimating the line dimensions mostly within one standard deviation of the average values over a wide range of laser power and scan speed combinations. The model delimits the trend in onset of micro-explosions in the photoresist due to over-exposure and of low degree of conversion due to under-exposure. The model guides setting of high-fidelity and robust writing parameters of a photonic crystal structure without iteration and in close agreement with the estimated line dimensions. The proposed methodology is generalizable by adapting the model coefficients to any 3D-DLW setup and corresponding photoresist as a means to estimate the line dimensions for tuning the writing parameters.

Energy-Efficient Bioalcohol Recovery by Gel Stripping

NASA Astrophysics Data System (ADS)

Godbole, Rutvik; Ma, Lan; Hedden, Ronald

2014-03-01

Design of energy-efficient processes for recovering butanol and ethanol from dilute fermentations is a key challenge facing the biofuels industry due to the high energy consumption of traditional multi-stage distillation processes. Gel stripping is an alternative purification process by which a dilute alcohol is stripped from the fermentation product by passing it through a packed bed containing particles of a selectively absorbent polymeric gel material. The gel must be selective for the alcohol, while swelling to a reasonable degree in dilute alcohol-water mixtures. To accelerate materials optimization, a combinatorial approach is taken to screen a matrix of copolymer gels having orthogonal gradients in crosslinker concentration and hydrophilicity. Using a combination of swelling in pure solvents, the selectivity and distribution coefficients of alcohols in the gels can be predicted based upon multi-component extensions of Flory-Rehner theory. Predictions can be validated by measuring swelling in water/alcohol mixtures and conducting h HPLC analysis of the external liquid. 95% + removal of butanol from dilute aqueous solutions has been demonstrated, and a mathematical model of the unsteady-state gel stripping process has been developed. NSF CMMI Award 1335082.

Micromachined peristaltic pump

NASA Technical Reports Server (NTRS)

Hartley, Frank T. (Inventor)

1998-01-01

A micromachined pump including a channel formed in a semiconductor substrate by conventional processes such as chemical etching. A number of insulating barriers are established in the substrate parallel to one another and transverse to the channel. The barriers separate a series of electrically conductive strips. An overlying flexible conductive membrane is applied over the channel and conductive strips with an insulating layer separating the conductive strips from the conductive membrane. Application of a sequential voltage to the series of strips pulls the membrane into the channel portion of each successive strip to achieve a pumping action. A particularly desirable arrangement employs a micromachined push-pull dual channel cavity employing two substrates with a single membrane sandwiched between them.

Patterned forests of vertically-aligned multiwalled carbon nanotubes using metal salt catalyst solutions.

PubMed

Garrett, David J; Flavel, Benjamin S; Baronian, Keith H R; Downard, Alison J

2013-01-01

A simple method for producing patterned forests of multiwalled carbon nanotubes (MWCNTs) is described. An aqueous metal salt solution is spin-coated onto a substrate patterned with photoresist by standard methods. The photoresist is removed by acetone washing leaving the acetone-insoluble catalyst pattern on the substrate. Dense forests of vertically aligned (VA) MWCNTs are grown on the patterned catalyst layers by chemical vapour deposition. The procedures have been demonstrated by growing MWCNT forests on two substrates: silicon and conducting graphitic carbon films. The forests adhere strongly to the substrates and when grown directly on carbon film, offer a simple method of preparing MWCNT electrodes.

Directed Self-Assembly of Poly(2-vinylpyridine)-b-polystyrene-b-poly(2-vinylpyridine) Triblock Copolymer with Sub-15 nm Spacing Line Patterns Using a Nanoimprinted Photoresist Template.

PubMed

Sun, Zhiwei; Chen, Zhenbin; Zhang, Wenxu; Choi, Jaewon; Huang, Caili; Jeong, Gajin; Coughlin, E Bryan; Hsu, Yautzong; Yang, XiaoMin; Lee, Kim Y; Kuo, David S; Xiao, Shuaigang; Russell, Thomas P

2015-08-05

Low molecular weight P2VP-b-PS-b-P2VP triblock copolymer (poly(2-vinlypyridine)-block-polystyrene-block-poly(2-vinylpyridine)] is doped with copper chloride and microphase separated into lamellar line patterns with ultrahigh area density. Salt-doped P2VP-b-PS-b-P2VP triblock copolymer is self-assembled on the top of the nanoimprinted photoresist template, and metallic nanowires with long-range ordering are prepared with platinum-salt infiltration and plasma etching. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Far-infrared-induced magnetoresistance oscillations in GaAs/AlxGa1-xAs -based two-dimensional electron systems

NASA Astrophysics Data System (ADS)

Wirthmann, André; McCombe, Bruce D.; Heitmann, Detlef; Holland, Steffen; Friedland, Klaus-Jürgen; Hu, Can-Ming

2007-11-01

We report on photoresistance and magnetotransport measurements in a moderate mobility two-dimensional electron system subject to far-infrared (terahertz) radiation. The photoresistance shows radiation induced 1/B -periodic oscillations, which we identify as the terahertz analog of microwave-induced resistance oscillations (MIROs). The MIRO-analog oscillations show a sign reversal in the low-field, high current regime. We simultaneously observe magnetoplasmons and MIRO-analog oscillations with no apparent coupling between them. Using a meandering Hall-bar geometry allows us to greatly enhance sensitivity and detect these oscillations even at elevated temperatures and moderate mobilities.

Topography printing to locally control wettability.

PubMed

Zheng, Zijian; Azzaroni, Omar; Zhou, Feng; Huck, Wilhelm T S

2006-06-21

This paper reports a new patterning method, which utilizes NaOH to facilitate the irreversible binding between the PDMS stamp and substrates and subsequent cohesive mechanical failure to transfer the PDMS patterns. Our method shows high substrate tolerance and can be used to "print" various PDMS geometries on a wide range of surfaces, including Si100, glass, gold, polymers, and patterned SU8 photoresist. Using this technique, we are able to locally change the wettability of substrate surfaces by printing well-defined PDMS architectures on the patterned SU8 photoresist. It is possible to generate differential wetting and dewetting properties in microchannels and in the PDMS printed area, respectively.

Simultaneous effects of photo- and radio- darkening in ytterbium-doped aluminosilicate fibers

DOE Office of Scientific and Technical Information (OSTI.GOV)

Duchez, Jean-Bernard, E-mail: jbduchez@unice.fr; Mady, Franck, E-mail: jbduchez@unice.fr; Mebrouk, Yasmine, E-mail: jbduchez@unice.fr

2014-10-21

We present original characterizations of photo-radio-darkening in ytterbium-doped silica optical fibers submitted to the simultaneous action of the pump and of an ionizing radiation. We present the interplay between both radiations, showing e.g. that the pump is able to darken or bleach the fiber depending on the ionizing dose. The photo-resistance of the fiber is shown to play a crucial role on its radio-resistance, and that photo-resistant fibers should be also radio-resistant in low dose rate conditions. All the results are thoroughly explained by a physical model presented in a separate article by Mady et al. (this conference proceeding)

Design, synthesis, and characterization of fluorine-free PAGs for 193-nm lithography

NASA Astrophysics Data System (ADS)

Liu, Sen; Glodde, Martin; Varanasi, Pushkara R.

2010-04-01

Photoacid generators (PAGs) are a key component in chemically amplified resists used in photolithography. Perfluorooctanesulfonates (PFOS) and other perfluoroalkylsulfonates (PFAS) have been well adopted as PAGs in 193 nm photoresist. Recently, concerns have been raised about their environmental impact due to their chemical persistency, bioaccumulation and toxicity. It is a general interest to find environmentally benign PAGs that are free of fluorine atoms. Here we describe the design, synthesis and characterization of a series of novel fluorine-free onium salts as PAGs for 193 nm photoresists. These PAGs demonstrated desirable physical and lithography properties when compared with PFAS-based PAGs for both dry and immersion exposures.

Fabrication of nanostructured transmissive optical devices on ITO-glass with UV1116 photoresist using high-energy electron beam lithography.

PubMed

Williams, Calum; Bartholomew, Richard; Rughoobur, Girish; Gordon, George S D; Flewitt, Andrew J; Wilkinson, Timothy D

2016-12-02

High-energy electron beam lithography for patterning nanostructures on insulating substrates can be challenging. For high resolution, conventional resists require large exposure doses and for reasonable throughput, using typical beam currents leads to charge dissipation problems. Here, we use UV1116 photoresist (Dow Chemical Company), designed for photolithographic technologies, with a relatively low area dose at a standard operating current (80 kV, 40-50 μC cm -2 , 1 nAs -1 ) to pattern over large areas on commercially coated ITO-glass cover slips. The minimum linewidth fabricated was ∼33 nm with 80 nm spacing; for isolated structures, ∼45 nm structural width with 50 nm separation. Due to the low beam dose, and nA current, throughput is high. This work highlights the use of UV1116 photoresist as an alternative to conventional e-beam resists on insulating substrates. To evaluate suitability, we fabricate a range of transmissive optical devices, that could find application for customized wire-grid polarisers and spectral filters for imaging, which operate based on the excitation of surface plasmon polaritons in nanosized geometries, with arrays encompassing areas ∼0.25 cm 2 .

Centimeter-scale subwavelength photolithography using metal-coated elastomeric photomasks with modulated light intensity at the oblique sidewalls.

PubMed

Wu, Jin; Liu, Yayuan; Guo, Yuanyuan; Feng, Shuanglong; Zou, Binghua; Mao, Hui; Yu, Cheng-han; Tian, Danbi; Huang, Wei; Huo, Fengwei

2015-05-05

By coating polydimethylsiloxane (PDMS) relief structures with a layer of opaque metal such as gold, the incident light is strictly allowed to pass through the nanoscopic apertures at the sidewalls of PDMS reliefs to expose underlying photoresist at nanoscale regions, thus producing subwavelength nanopatterns covering centimeter-scale areas. It was found that the sidewalls were a little oblique, which was the key to form the nanoscale apertures. Two-sided and one-sided subwavelength apertures can be constructed by employing vertical and oblique metal evaporation directions, respectively. Consequently, two-line and one-line subwavelength nanopatterns with programmable feature shapes, sizes, and periodicities could be produced using the obtained photomasks. The smallest aperture size and line width of 80 nm were achieved. In contrast to the generation of raised positive photoresist nanopatterns in phase shifting photolithography, the recessed positive photoresist nanopatterns produced in this study provide a convenient route to transfer the resist nanopatterns to metal nanopatterns. This nanolithography methodology possesses the distinctive advantages of simplicity, low cost, high throughput, and nanoscale feature size and shape controllability, making it a potent nanofabrication technique to enable functional nanostructures for various potential applications.

Fabrication of nanostructured transmissive optical devices on ITO-glass with UV1116 photoresist using high-energy electron beam lithography

NASA Astrophysics Data System (ADS)

Williams, Calum; Bartholomew, Richard; Rughoobur, Girish; Gordon, George S. D.; Flewitt, Andrew J.; Wilkinson, Timothy D.

2016-12-01

High-energy electron beam lithography for patterning nanostructures on insulating substrates can be challenging. For high resolution, conventional resists require large exposure doses and for reasonable throughput, using typical beam currents leads to charge dissipation problems. Here, we use UV1116 photoresist (Dow Chemical Company), designed for photolithographic technologies, with a relatively low area dose at a standard operating current (80 kV, 40-50 μC cm-2, 1 nAs-1) to pattern over large areas on commercially coated ITO-glass cover slips. The minimum linewidth fabricated was ˜33 nm with 80 nm spacing; for isolated structures, ˜45 nm structural width with 50 nm separation. Due to the low beam dose, and nA current, throughput is high. This work highlights the use of UV1116 photoresist as an alternative to conventional e-beam resists on insulating substrates. To evaluate suitability, we fabricate a range of transmissive optical devices, that could find application for customized wire-grid polarisers and spectral filters for imaging, which operate based on the excitation of surface plasmon polaritons in nanosized geometries, with arrays encompassing areas ˜0.25 cm2.

Patterning highly ordered arrays of complex nanofeatures through EUV directed polarity switching of non chemically amplified photoresist

PubMed Central

Ghosh, Subrata; Satyanarayana, V. S. V.; Pramanick, Bulti; Sharma, Satinder K.; Pradeep, Chullikkattil P.; Morales-Reyes, Israel; Batina, Nikola; Gonsalves, Kenneth E.

2016-01-01

Given the importance of complex nanofeatures in the filed of micro-/nanoelectronics particularly in the area of high-density magnetic recording, photonic crystals, information storage, micro-lens arrays, tissue engineering and catalysis, the present work demonstrates the development of new methodology for patterning complex nanofeatures using a recently developed non-chemically amplified photoresist (n-CARs) poly(4-(methacryloyloxy)phenyl)dimethylsulfoniumtriflate) (polyMAPDST) with the help of extreme ultraviolet lithography (EUVL) as patterning tool. The photosensitivity of polyMAPDST is mainly due to the presence of radiation sensitive trifluoromethanesulfonate unit (triflate group) which undergoes photodegradation upon exposure with EUV photons, and thus brings in polarity change in the polymer structure. Integration of such radiation sensitive unit into polymer network avoids the need of chemical amplification which is otherwise needed for polarity switching in the case of chemically amplified photoresists (CARs). Indeed, we successfully patterned highly ordered wide-raging dense nanofeatures that include nanodots, nanowaves, nanoboats, star-elbow etc. All these developed nanopatterns have been well characterized by FESEM and AFM techniques. Finally, the potential of polyMAPDST has been established by successful transfer of patterns into silicon substrate through adaptation of compatible etch recipes. PMID:26975782

Evolution of microstructure, texture and inhibitor along the processing route for grain-oriented electrical steels using strip casting

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liu, Hai-Tao, E-mail: liuht@ral.neu.edu.cn; Institute of Research of Iron and Steel, Shasteel, Zhangjiagang 215625, Jiangsu; Yao, Sheng-Jie

2015-08-15

In the present work, a regular grade GO sheet was produced successively by strip casting, hot rolling, normalizing annealing, two-stage cold rolling with intermediate annealing, primary recrystallization annealing, secondary recrystallization annealing and purification. The aim of this paper was to characterize the evolution of microstructure, texture and inhibitor along the new processing route by comprehensive utilization of optical microscopy, X-ray diffraction and transmission electron microscopy. It was found that a fine microstructure with the ferrite grain size range of 7–12 μm could be obtained in the primary recrystallization annealed sheet though a very coarse microstructure was produced in the initialmore » as-cast strip. The main finding was that the “texture memory” effect on Goss texture started on the through-thickness intermediate annealed strip after first cold rolling, which was not similar to the “texture memory” effect on Goss texture starting on the surface layers of the hot rolled strip in the conventional production route. As a result, the origin of Goss nuclei capable of secondary recrystallization lied in the grains already presented in Goss orientation in the intermediate annealed strip after first cold rolling. Another finding was that fine and dispersive inhibitors (mainly AlN) were easy to be produced in the primary recrystallization microstructure due to the initial rapid solidification during strip casting and the subsequent rapid cooling, and the very high temperature reheating usually used before hot rolling in the conventional production route could be avoided. - Highlights: • A regular grade grain-oriented electrical steel was produced. • Evolution of microstructure, texture and inhibitor was characterized. • Origin of Goss nuclei lied in the intermediate annealed strip. • A fine primary recrystallization microstructure could be produced. • Effective inhibitors were easy to be obtained in the new processing route.« less

Reinforced Masks for Ion Plating of Solar Cells

NASA Technical Reports Server (NTRS)

Conley, W. R.; Swick, E. G.; Volkers, J. C.

1987-01-01

Proposed mask for ion plating of surface electrodes on silicon solar cells reinforced to hold shape better during handling. Fabrication process for improved mask similar to conventional mask. Additional cuts and bends made in wide diametral strip to form bridges between pairs of mask fingers facing each other across this strip. Bridges high enough not to act as masks so entire strip area plated.

Graphic Arts: Process Camera, Stripping, and Platemaking. Fourth Edition. Teacher Edition [and] Student Edition.

ERIC Educational Resources Information Center

Multistate Academic and Vocational Curriculum Consortium, Stillwater, OK.

This publication contains both a teacher edition and a student edition of materials for a course in graphic arts that covers the process camera, stripping, and platemaking. The course introduces basic concepts and skills necessary for entry-level employment in a graphic communication occupation. The contents of the materials are tied to measurable…

Integrated distillation-membrane process for bio-ethanol and bio-butanol recovery from actual fermentation broths: Separation energy efficiency and fate of secondary fermentation products

EPA Science Inventory

A hybrid process integrating vapor stripping with vapor compression and vapor permeation membrane separation, termed Membrane Assisted Vapor Stripping (MAVS), was evaluated for recovery and dehydration of ethanol and/or 1-butanol from aqueous solution as an alternative to convent...

Chemical Strips Anodic Film From Aluminum

NASA Technical Reports Server (NTRS)

Eichinger, Eric C.

1993-01-01

Phosphoric acid solution offers advantages over other stripping solutions. More effective than other strippers and safer to use. Relatively environmentally benign, phosphoric acid stripper ceases its chemical attack so less process control is needed in its use.

SU-8 negative photoresist for optical mask manufacturing

NASA Astrophysics Data System (ADS)

Bogdanov, Alexei L.

2000-06-01

The requirements for better control, linearity, and uniformity of critical dimension (CD) on photomasks in fabrication of 180 and 150 nm generation devices result in increasing demand for thinner, more etching durable, and more sensitive e-beam resists. Novolac based resists with chemical amplification have been a choice for their sensitivity and stability during etching. However, difficult CD control due to the acid catalyzer diffusion and quite narrow post exposure bake (PEB) process window are some of the major drawbacks of these resists. SU-8 is recently introduced to the market negative photoresist. High sensitivity, fairly good adhesion properties, and relatively simple processing of SU-8 make it a good substitution for novolac based chemically amplified negative e-beam resists in optical mask manufacturing. The replacement of traditional chemically amplified resists by SU- 8 can increase the process latitude and reduce resist costs. Among the obvious drawbacks of SU-8 are the use of solvent- based developer and demand of oxygen plasma for resist removal. In this paper the use of SU-8 for optical mask manufacturing is reported. All steps of resist film preparation, exposure and development are paid a share of attention. Possibilities to use reactive ion etching (RIE) with oxygen in order to increase resist mask contrast are discussed. Special exposure strategy (pattern outlining) was employed to further improve the edge definition. The resist PEB temperature and time were studied to estimate their weight in overall CD control performance. Specially designed test patterns with 0.25 micrometer design rule could be firmly transferred into a chromium layer both by wet etching and ion milling. Influence of exposure dose variation on the pattern CD change was studied.

Infrared image construction with computer-generated reflection holograms. [using carbon dioxide laser

NASA Technical Reports Server (NTRS)

Angus, J. C.; Coffield, F. E.; Edwards, R. V.; Mann, J. A., Jr.; Rugh, R. W.; Gallagher, N. C.

1977-01-01

Computer-generated reflection holograms hold substantial promise as a means of carrying out complex machining, marking, scribing, welding, soldering, heat treating, and similar processing operations simultaneously and without moving the work piece or laser beam. In the study described, a photographically reduced transparency of a 64 x 64 element Lohmann hologram was used to make a mask which, in turn, was used (with conventional photoresist techniques) to produce a holographic reflector. Images from a commercial CO2 laser (150W TEM(00)) and the holographic reflector are illustrated and discussed.

Development of novel purifiers with appropriate functional groups based on solvent polarities at bulk filtration

NASA Astrophysics Data System (ADS)

Kohyama, Tetsu; Kaneko, Fumiya; Ly, Saksatha; Hamzik, James; Jaber, Jad; Yamada, Yoshiaki

2017-03-01

Weak-polar solvents like PGMEA (Propylene Glycol Monomethyl Ether Acetate) or CHN (Cyclohexanone) are used to dissolve hydrophobic photo-resist polymers, which are challenging for traditional cleaning methods such as distillation, ion-exchange resins service or water-washing processes. This paper investigated two novel surface modifications to see their effectiveness at metal removal and to understand the mechanism. The experiments yielded effective purification methods for metal reduction, focusing on solvent polarities based on HSP (Hansen Solubility Parameters), and developing optimal purification strategies.

Non-noble metal based metallization systems

NASA Technical Reports Server (NTRS)

Garcia, A., III

1983-01-01

The results of efforts to produce a nonsilver metallization system for silicon photovoltaic cells are given. The system uses a metallization system based on molybdenum, tin, and titanium hydride. The initial work in this system was done using the MIDFILM process. The MIDFILM process attains a line resolution comparable to photoresist methods with a process related to screen printing. The surface to be processed is first coated with a thin layer of photopolymer material. Upon exposure to ultraviolet light through a suitable mask, the polymer in the non-pattern area crosslinks and becomes hard. The unexposed pattern areas remain tacky. The conductor material is then applied in the form of a dry mixture of metal which adheres to the tacky pattern area. The assemblage is then fired to ash the photopolymer and sinter the conductor powder.

Fabrication of smooth patterned structures of refractory metals, semiconductors, and oxides via template stripping.

PubMed

Park, Jong Hyuk; Nagpal, Prashant; McPeak, Kevin M; Lindquist, Nathan C; Oh, Sang-Hyun; Norris, David J

2013-10-09

The template-stripping method can yield smooth patterned films without surface contamination. However, the process is typically limited to coinage metals such as silver and gold because other materials cannot be readily stripped from silicon templates due to strong adhesion. Herein, we report a more general template-stripping method that is applicable to a larger variety of materials, including refractory metals, semiconductors, and oxides. To address the adhesion issue, we introduce a thin gold layer between the template and the deposited materials. After peeling off the combined film from the template, the gold layer can be selectively removed via wet etching to reveal a smooth patterned structure of the desired material. Further, we demonstrate template-stripped multilayer structures that have potential applications for photovoltaics and solar absorbers. An entire patterned device, which can include a transparent conductor, semiconductor absorber, and back contact, can be fabricated. Since our approach can also produce many copies of the patterned structure with high fidelity by reusing the template, a low-cost and high-throughput process in micro- and nanofabrication is provided that is useful for electronics, plasmonics, and nanophotonics.

Numerical and experimental investigation of strip deformation in cage roll forming process for pipes with low ratio of thickness/diameter

NASA Astrophysics Data System (ADS)

Kasaei, M. M.; Naeini, H. Moslemi; Tehrani, M. Salmani; Tafti, R. Azizi

2011-01-01

Cage roll forming is one of the advanced methods of cold roll forming process which is used widely for producing ERW pipes. In addition to decreasing the production cost and time, using cage roll forming provides smooth deformation on the strip. Few studies can be found about cage roll forming because of its complexity, and the available knowledge is experience-based more than science-based. In this paper, deformation of pipes with low ratio of thickness/diameter is investigated by 3D finite element simulation in Marc-Mentat software. Edge buckling defect in cage roll forming of low ratio of thickness/diameter pipes is very important. Due to direct influence of longitudinal strain on the edge buckling phenomenon, longitudinal strains at the edge and center line of the strip are investigated and high risk stands are introduced. The deformed strip is predicted using the simulation results and effects of each cage forming stage on the deformed strip profile are specified. In order to verify the simulation results, strip width and opening distance of the two edges in different forming stages are obtained from the simulations and compared with the experimental data which were measured from the production line. A good agreement between the experimental and simulated results is observed.

Integrated in situ gas stripping-salting-out process for high-titer acetone-butanol-ethanol production from sweet sorghum bagasse.

PubMed

Wen, Hao; Chen, Huidong; Cai, Di; Gong, Peiwen; Zhang, Tao; Wu, Zhichao; Gao, Heting; Li, Zhuangzhuang; Qin, Peiyong; Tan, Tianwei

2018-01-01

The production of biobutanol from renewable biomass resources is attractive. The energy-intensive separation process and low-titer solvents production are the key constraints on the economy-feasible acetone-butanol-ethanol (ABE) production by fermentation. To decrease energy consumption and increase the solvents concentration, a novel two-stage gas stripping-salting-out system was established for effective ABE separation from the fermentation broth using sweet sorghum bagasse as feedstock. The ABE condensate (143.6 g/L) after gas stripping, the first-stage separation, was recovered and introduced to salting-out process as the second-stage. K 4 P 2 O 7 and K 2 HPO 4 were used, respectively. The effect of saturated salt solution temperature on final ABE concentration was also investigated. The results showed high ABE recovery (99.32%) and ABE concentration (747.58 g/L) when adding saturated K 4 P 2 O 7 solution at 323.15 K and 3.0 of salting-out factor. On this condition, the energy requirement of the downstream distillation process was 3.72 MJ/kg of ABE. High-titer cellulosic ABE production was separated from the fermentation broth by the novel two-stage gas stripping-salting-out process. The process was effective, which reduced the downstream process energy requirement significantly.

Study of the technics of coating stripping and FBG writing on polyimide fiber

NASA Astrophysics Data System (ADS)

Song, ZhiQiang; Qi, HaiFeng; Ni, JiaSheng; Wang, Chang

2017-10-01

Compared with ordinary optical fiber, polyimide fiber has the characteristics of high temperature resistance and high strength, which has important application in the field of optical fiber sensing. The common methods of polyimide coating stripping were introduced in this paper, including high temperature stripping, chemical stripping and arc ablation. In order to meet the requirements of FBG writing technology, a method using argon ion laser ablation coating was proposed. The method can precisely control the stripping length of the coating and completely does not affect the tensile strength of the optical fiber. According to the experiment, the fabrication process of polyimide FBG is stripping-hydrogen loadingwriting. Under the same conditions, 10 FBG samples were fabricated with good uniformity of wavelength bandwidth and reflectivity. UV laser ablation of polyimide coating has been proved to be a safe, reliable and efficient method.

Frictional interactions in forming processes: New studies with transparent sapphire strip-drawing dies

NASA Astrophysics Data System (ADS)

Rao, R. S.; Lu, C. Y.; Wright, P. K.; Devenpeck, M. L.; Richmond, O.; Appleby, E. J.

1982-05-01

This research is concerned with the frictional interactions at the toolwork interfaces in the machining and strip-drawing processes. A novel feature is that transparent sapphire (single crystal Al2O3) is being used as the tool and die material. This allows the tribological features of the interface to be directly observed and recorded on movie-film. These qualitative studies provide information on the role of lubricants. In addition, techniques are being developed to quantify the velocity gradient along the interface. For example, in the drawing work it has been found that tracer markings (e.g. dye-spots), applied to the undrawn strip, remain intact during drawing and can be tracked along the sapphire/strip interface. Such data will be used as input to a finite-element, elasto-plastic-workhardening model of the deformation process. The latter can compute strip deformation characteristics, drawing forces and local coefficients of friction at the interface. Introductory results will be presented in this paper, obtained from drawing tin-plated mild steel with sapphire and cemented carbide dies. Drawing loads and die-separating forces will be presented and movie-films of the action of tracer markings at the interface shown. In order to demonstrate how this data can be used in an analysis of a large strain deformation process with friction, initial results from running the FIPDEF elasto-plastic code will be discussed. From a commercial viewpoint research on strip-drawing is of special interest to the can-making industry. From a physical viewpoint stripdrawing is of particular interest because it is a symmetrical, plane strain deformation and, in comparison with other metal processing operations, it is more readily modeled. However, until now the elasto-plastic codes that have been developed to predictively model drawing have had limitations: the most notable being that of quantifying the friction conditions at the die-work interface. Hence the specification of the latter is the ultimate goal of this research program.

Assessment of stripped asphalt pavement.

DOT National Transportation Integrated Search

1989-01-01

Many miles of stripped pavement need to be restored to a serviceable condition, but there is no accepted procedure to determine whether the pavement should remain in place or be removed during the rehabilitation process. This report describes the att...

Studies of the phytoplankton and soil algae of two strip-mine impoundments in Tuscarawas County, Ohio

DOE Office of Scientific and Technical Information (OSTI.GOV)

Richards, J.N.

1973-01-01

The process of strip-mining leaves vast areas that are denuded of vegetation and are open to primary succession by organisms such as algae. Acid strip-mine impoundments are either formed by man-made or natural processes. These impoundments are remnants of old strip-mine pits that have been filled with runoff water. The water chemistry of these ponds reflects the chemistry of the earth strata above the coal seam that was mined. These young impoundments or ponds are extremely low in pH and quite acidic due to the presence of great amounts of sulfuric acid. Algae that are found in these types ofmore » habitats exhibit a tolerance to acid conditions and are considered to be acidophilic. Few species of algae are known to be common componenets of these habitats.« less

Next Generation Solvent Performance in the Modular Caustic Side Solvent Extraction Process - 15495

DOE Office of Scientific and Technical Information (OSTI.GOV)

Smith, Tara E.; Scherman, Carl; Martin, David

Changes to the Modular Caustic Side Solvent Extraction Unit (MCU) flow-sheet were implemented in the facility. Implementation included changing the scrub and strip chemicals and concentrations, modifying the O/A ratios for the strip, scrub, and extraction contactor banks, and blending the current BoBCalixC6 extractant-based solvent in MCU with clean MaxCalix extractant-based solvent. During the successful demonstration period, the MCU process was subject to rigorous oversight to ensure hydraulic stability and chemical/radionuclide analysis of the key process tanks (caustic wash tank, solvent hold tank, strip effluent hold tank, and decontaminated salt solution hold tank) to evaluate solvent carryover to downstream facilitiesmore » and the effectiveness of cesium removal from the liquid salt waste. Results indicated the extraction of cesium was significantly more effective with an average Decontamination Factor (DF) of 1,129 (range was 107 to 1,824) and that stripping was effective. The contactor hydraulic performance was stable and satisfactory, as indicated by contactor vibration, contactor rotational speed, and flow stability; all of which remained at or near target values. Furthermore, the Solvent Hold Tank (SHT) level and specific gravity was as expected, indicating that solvent integrity and organic hydraulic stability were maintained. The coalescer performances were in the range of processing results under the BOBCalixC6 flow sheet, indicating negligible adverse impact of NGS deployment. After the Demonstration period, MCU began processing via routine operations. Results to date reiterate the enhanced cesium extraction and stripping capability of the Next Generation Solvent (NGS) flow sheet. This paper presents process performance results of the NGS Demonstration and continued operations of MCU utilizing the blended BobCalixC6-MaxCalix solvent under the NGS flowsheet.« less

Selectively strippable paint schemes

NASA Astrophysics Data System (ADS)

Stein, R.; Thumm, D.; Blackford, Roger W.

1993-03-01

In order to meet the requirements of more environmentally acceptable paint stripping processes many different removal methods are under evaluation. These new processes can be divided into mechanical and chemical methods. ICI has developed a paint scheme with intermediate coat and fluid resistant polyurethane topcoat which can be stripped chemically in a short period of time with methylene chloride free and phenol free paint strippers.

Producing thin strips by twin-roll casting—part I: Process aspects and quality issues

NASA Astrophysics Data System (ADS)

Li, Ben Q.

1995-05-01

This two-part paper discusses recent advances in research and development for the direct production of coilable thin strips by twin-roll casting in both the aluminum and steel industries. While the former is empowering the casters to approach the theoretical productivity limit, the latter is striving to put pilot casters into commercial operation. These intensive R&D efforts are derived from the advantages, both economic and metallurgical, offered by the process. As twin-roll casting combines solidification and hot rolling into a single operation, the process requires low capital investment and low operational cost. Also, because of the high solidification rate attained in the process, the thin strips produced have a refined metallurgical structure, characterized by columnar and equiaxed zones with fine intermetallic particles. The enthusiasm about twin-roll casting is now being spread worldwide. This paper focuses on the process aspects and quality control of twin-roll casting. Part II, which will appear in the August issue, will review process modeling and pilot-plant development activities.

Mechanically metastable structures generated by single pulse laser-induced periodic surface structures (LIPSS) in the photoresist SU8.

PubMed

Reinhardt, Hendrik; Peschke, Patrick; Riedel, René; Hampp, Norbert

2018-07-27

Laser-induced periodic surface structures (LIPSS) with a periodicity of 351 nm are generated in the negative photoresist SU8 by single nanosecond laser pulse impact. Friction scans indicate the periodic pattern to comprise alternating regions of crosslinked and non-crosslinked SU8. Intriguingly, even minor mechanical stimuli in the order of nanonewtons cause the unfolding or rather the deletion of the characteristic periodic pattern similarly to the release of a pre-loaded spring. This feature combined with high resilience to heat and photon irradiation makes SU8-LIPSS attractive for applications such as mechanical stress monitors, self-destructing memory and passive micro actuators.

Microwave-Assisted Syntheses in Recyclable Ionic Liquids: Photoresists Based on Renewable Resources

PubMed Central

Petit, Charlotte; Luef, Klaus P; Edler, Matthias; Griesser, Thomas; Kremsner, Jennifer M; Stadler, Alexander; Grassl, Bruno; Reynaud, Stéphanie; Wiesbrock, Frank

2015-01-01

The copoly(2-oxazoline) pNonOx80-stat-pDc=Ox20 can be synthesized from the cationic ring-opening copolymerization of 2-nonyl-2-oxazoline NonOx and 2-dec-9′-enyl-2-oxazoline Dc=Ox in the ionic liquid n-hexyl methylimidazolium tetrafluoroborate under microwave irradiation in 250 g/batch quantities. The polymer precipitates upon cooling, enabling easy recovery of the polymer and the ionic liquid. Both monomers can be obtained from fatty acids from renewable resources. pNonOx80-stat-pDc=Ox20 can be used as polymer in a photoresist (resolution of 1 μm) based on UV-induced thiol–ene reactions. PMID:26354027

Mechanically metastable structures generated by single pulse laser-induced periodic surface structures (LIPSS) in the photoresist SU8

NASA Astrophysics Data System (ADS)

Reinhardt, Hendrik; Peschke, Patrick; Riedel, René; Hampp, Norbert

2018-07-01

Laser-induced periodic surface structures (LIPSS) with a periodicity of 351 nm are generated in the negative photoresist SU8 by single nanosecond laser pulse impact. Friction scans indicate the periodic pattern to comprise alternating regions of crosslinked and non-crosslinked SU8. Intriguingly, even minor mechanical stimuli in the order of nanonewtons cause the unfolding or rather the deletion of the characteristic periodic pattern similarly to the release of a pre-loaded spring. This feature combined with high resilience to heat and photon irradiation makes SU8-LIPSS attractive for applications such as mechanical stress monitors, self-destructing memory and passive micro actuators.

Invisible Security Printing on Photoresist Polymer Readable by Terahertz Spectroscopy.

PubMed

Shin, Hee Jun; Lim, Min-Cheol; Park, Kisang; Kim, Sae-Hyung; Choi, Sung-Wook; Ok, Gyeongsik

2017-12-06

We experimentally modulate the refractive index and the absorption coefficient of an SU-8 dry film in the terahertz region by UV light (362 nm) exposure with time dependency. Consequently, the refractive index of SU-8 film is increased by approximately 6% after UV light exposure. Moreover, the absorption coefficient also changes significantly. Using the reflective terahertz imaging technique, in addition, we can read security information printed by UV treatment on an SU-8 film that is transparent in the visible spectrum. From these results, we successfully demonstrate security printing and reading by using photoresist materials and the terahertz technique. This investigation would provide a new insight into anti-counterfeiting applications in fields that need security.

Ultrastructural imaging and molecular modeling of live bacteria using soft x-ray contact microscopy with nanoseconds laser-plasma radiation

NASA Astrophysics Data System (ADS)

Kado, Masataka; Richardson, Martin C.; Gaebel, Kai; Torres, David S.; Rajyaguru, Jayshree; Muszynski, Michael J.

1995-09-01

X-ray images of the various live bacteria, such as Staphylococcus and Streptococcus, and micromolecule such as chromosomal DNA from Escherichis coli, and Lipopolysacchride from Burkholderia cepacia, are obtained with soft x-ray contact microscopy. A compact tabletop type glass laser system is used to produce x-rays from Al, Si, and Au targets. The PMMA photoresists are used to record x-ray images. An AFM (atomic force microscope) is used to reproduce the x-ray images from the developed photoresists. The performance of the 50nm spatial resolutions are achieved and images are able to be discussed on the biological view.

Microstructure Engineering in Hot Strip Mills, Part 1 of 2: Integrated mathematical Model

DOE Office of Scientific and Technical Information (OSTI.GOV)

J.K. Brimacombe; I.V. Samaraseker; E.B. Hawbolt

1998-09-30

This report describes the work of developing an integrated model used to predict the thermal history, deformation, roll forces, microstructural evaluation and mechanical properties of steel strip in a hot-strip mill. This achievement results from a join research effort that is part of the American Iron and Steel Institute's (AISI) Advanced Process Control Program, a collaboration between the U.S. DOE and fifteen North American steel makers.

The automated counting of beating rates in individual cultured heart cells.

PubMed

Collins, G A; Dower, R; Walker, M J

1981-12-01

The effect of drugs on the beating rate of cultured heart cells can be monitored in a number of ways. The simultaneous automated measurement of beating rates of a number of cells allows drug effects to be rapidly quantified. A photoresistive detector placed on a television image of a cell, when coupled to operational amplifiers, gives binary signals that can be processed by a microprocessor. On this basis, we have devised a system that is capable of simultaneously monitoring the individual beating of six single cultured heart cells. A microprocessor automatically processes data obtained under different experimental conditions and records it in suitable descriptive formats such as dose-response curves and double reciprocal plots.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Smith, D.J.; Warner, J.A.; LeBarron, N.

Processes that use energetic ions for large substrates require that the time-averaged erosion effects from the ion flux be uniform across the surface. A numerical model has been developed to determine this flux and its effects on surface etching of a silica/photoresist combination. The geometry of the source and substrate is very similar to a typical deposition geometry with single or planetary substrate rotation. The model was used to tune an inert ion-etching process that used single or multiple Kaufman sources to less than 3% uniformity over a 30-cm aperture after etching 8 {micro}m of material. The same model canmore » be used to predict uniformity for ion-assisted deposition (IAD).« less

Innovative ammonia stripping with an electrolyzed water system as pretreatment of thermally hydrolyzed wasted sludge for anaerobic digestion.

PubMed

Park, Seyong; Kim, Moonil

2015-01-01

In this study, the anaerobic digestion of thermally hydrolyzed wasted sludge (THWS) with a high concentration of ammonia was carried out through combining with an ammonia stripping and an electrolyzed water system (EWS). The EWS produced acidic water (pH 2-3) at the anode and alkaline water (pH 11-12) at the cathode with an electro-diaphragm between the electrodes that could be applied to ammonia stripping. The ammonia stripping efficiency was strongly dependent on the pH and aeration rate, and the ammonium ion removal rate followed pseudo-first-order kinetics. From the BMP test, the methane yield of THWS after ammonia stripping using the EWS was 2.8 times higher than that of the control process (raw THWS without ammonia stripping). Furthermore, both methane yield and ammonium removal efficiency were higher in this study than in previous studies. Since ammonia stripping with the EWS does not require any chemicals for pH control, no precipitated sludge is produced and anaerobic microorganisms are not inhibited by cations. Therefore, ammonia stripping using the EWS could be an effective method for digestion of wastewater with a high concentration of ammonium nitrogen.

Theoretical Investigation of the Interfacial Reactions during Hot-Dip Galvanizing of Steel

NASA Astrophysics Data System (ADS)

Mandal, G. K.; Balasubramaniam, R.; Mehrotra, S. P.

2009-03-01

In the modern galvanizing line, as soon as the steel strip enters the aluminum-containing zinc bath, two reactions occur at the strip and the liquid-zinc alloy interface: (1) iron rapidly dissolves from the strip surface, raising the iron concentration in the liquid phase at the strip-liquid interface; and (2) aluminum forms a stable aluminum-iron intermetallic compound layer at the strip-coating interface due to its greater affinity toward iron. The main objective of this study is to develop a simple and realistic mathematical model for better understanding of the kinetics of galvanizing reactions at the strip and the liquid-zinc alloy interface. In the present study, a model is proposed to simulate the effect of various process parameters on iron dissolution in the bath, as well as, aluminum-rich inhibition layer formation at the substrate-coating interface. The transient-temperature profile of the immersed strip is predicted based on conductive and convective heat-transfer mechanisms. The inhibition-layer thickness at the substrate-coating interface is predicted by assuming the cooling path of the immersed strip consists of a series of isothermal holds of infinitesimal time-step. The influence of galvanizing reaction is assessed by considering nucleation and growth mechanisms at each hold time, which is used to estimate the total effect of the immersion time on the formation mechanism of the inhibition layer. The iron- dissolution model is developed based on well established principles of diffusion taking into consideration the area fraction covered by the intermetallic on the strip surface during formation of the inhibition layer. The model can be effectively used to monitor the dross formation in the bath by optimizing the process parameters. Theoretical predictions are compared with the findings of other researchers. Simulated results are in good agreement with the theoretical and experimental observation carried out by other investigators.

Large Aircraft Robotic Paint Stripping (LARPS) system and the high pressure water process

NASA Astrophysics Data System (ADS)

See, David W.; Hofacker, Scott A.; Stone, M. Anthony; Harbaugh, Darcy

1993-03-01

The aircraft maintenance industry is beset by new Environmental Protection Agency (EPA) guidelines on air emissions, Occupational Safety and Health Administration (OSHA) standards, dwindling labor markets, Federal Aviation Administration (FAA) safety guidelines, and increased operating costs. In light of these factors, the USAF's Wright Laboratory Manufacturing Technology Directorate and the Aircraft Division of the Oklahoma City Air Logistics Center initiated a MANTECH/REPTECH effort to automate an alternate paint removal method and eliminate the current manual methylene chloride chemical stripping methods. This paper presents some of the background and history of the LARPS program, describes the LARPS system, documents the projected operational flow, quantifies some of the projected system benefits and describes the High Pressure Water Stripping Process. Certification of an alternative paint removal method to replace the current chemical process is being performed in two phases: Process Optimization and Process Validation. This paper also presents the results of the Process Optimization for metal substrates. Data on the coating removal rate, residual stresses, surface roughness, preliminary process envelopes, and technical plans for process Validation Testing will be discussed.

Direct Laser Writing of Magneto-Photonic Sub-Microstructures for Prospective Applications in Biomedical Engineering

DOE Office of Scientific and Technical Information (OSTI.GOV)

Au, Thi Huong; Trinh, Duc Thien; Tong, Quang Cong

Here, we report on the fabrication of desired magneto-photonic devices by a low one-photon absorption (LOPA) direct laser writing (DLW) technique on a photocurable nanocomposite consisting of magnetite ( Fe 3O 4) nanoparticles and a commercial SU-8 photoresist. The magnetic nanocomposite was synthesized by mixing Fe 3O 4 nanoparticles with different kinds of SU-8 photoresists. We demonstrated that the degree of dispersion of Fe 3O 4 nanoparticles in the nanocomposite depended on the concentration of Fe 3O 4 nanoparticles, the viscosity of SU-8 resist, and the mixing time. By tuning these parameters, the most homogeneous magnetic nanocomposite was obtained withmore » a concentration of about 2 wt % of Fe 3O 4 nanoparticles in SU-8 2005 photoresist for the mixing time of 20 days. The LOPA-based DLW technique was employed to fabricate on demand various magneto-photonic submicrometer structures, which are similar to those obtained without Fe 3O 4 nanoparticles. The magneto-photonic 2D and 3D structures with sizes as small as 150 nm were created. Finally, we demonstrated the strong magnetic field responses of the magneto-photonic nanostructures and their use as micro-actuators when immersed in a liquid solution. View Full-Text« less

Direct Laser Writing of Magneto-Photonic Sub-Microstructures for Prospective Applications in Biomedical Engineering

PubMed Central

Au, Thi Huong; Trinh, Duc Thien; Tong, Quang Cong; Do, Danh Bich; Nguyen, Dang Phu; Phan, Manh-Huong; Lai, Ngoc Diep

2017-01-01

We report on the fabrication of desired magneto-photonic devices by a low one-photon absorption (LOPA) direct laser writing (DLW) technique on a photocurable nanocomposite consisting of magnetite (Fe3O4) nanoparticles and a commercial SU-8 photoresist. The magnetic nanocomposite was synthesized by mixing Fe3O4 nanoparticles with different kinds of SU-8 photoresists. We demonstrated that the degree of dispersion of Fe3O4 nanoparticles in the nanocomposite depended on the concentration of Fe3O4 nanoparticles, the viscosity of SU-8 resist, and the mixing time. By tuning these parameters, the most homogeneous magnetic nanocomposite was obtained with a concentration of about 2 wt % of Fe3O4 nanoparticles in SU-8 2005 photoresist for the mixing time of 20 days. The LOPA-based DLW technique was employed to fabricate on demand various magneto-photonic submicrometer structures, which are similar to those obtained without Fe3O4 nanoparticles. The magneto-photonic 2D and 3D structures with sizes as small as 150 nm were created. We demonstrated the strong magnetic field responses of the magneto-photonic nanostructures and their use as micro-actuators when immersed in a liquid solution. PMID:28486409

Direct Laser Writing of Magneto-Photonic Sub-Microstructures for Prospective Applications in Biomedical Engineering

DOE PAGES

Au, Thi Huong; Trinh, Duc Thien; Tong, Quang Cong; ...

2017-05-09

Here, we report on the fabrication of desired magneto-photonic devices by a low one-photon absorption (LOPA) direct laser writing (DLW) technique on a photocurable nanocomposite consisting of magnetite ( Fe 3O 4) nanoparticles and a commercial SU-8 photoresist. The magnetic nanocomposite was synthesized by mixing Fe 3O 4 nanoparticles with different kinds of SU-8 photoresists. We demonstrated that the degree of dispersion of Fe 3O 4 nanoparticles in the nanocomposite depended on the concentration of Fe 3O 4 nanoparticles, the viscosity of SU-8 resist, and the mixing time. By tuning these parameters, the most homogeneous magnetic nanocomposite was obtained withmore » a concentration of about 2 wt % of Fe 3O 4 nanoparticles in SU-8 2005 photoresist for the mixing time of 20 days. The LOPA-based DLW technique was employed to fabricate on demand various magneto-photonic submicrometer structures, which are similar to those obtained without Fe 3O 4 nanoparticles. The magneto-photonic 2D and 3D structures with sizes as small as 150 nm were created. Finally, we demonstrated the strong magnetic field responses of the magneto-photonic nanostructures and their use as micro-actuators when immersed in a liquid solution. View Full-Text« less

Numerical Analysis of Edge Over Coating and Baffle Effect on Hot-Dip Galvanizing

NASA Astrophysics Data System (ADS)

Bao, Chengren; Kang, Yonglin; Li, Yan

2017-06-01

In hot-dip galvanizing process, air jet wiping control is so crucial to determine the coating thickness and uniformity of the zinc layer on the steel strip. A numerical simulation of gas-jet wiping in hot-dip galvanizing was conducted to minimize the occurrence of edge over coating (EOC). The causes of EOC were identified by contrasting and analyzing the airflow fields on the strip edge with and without a baffle. The factors influencing the airflow field on the strip edge during the change in the gap between the baffle and the strip edge were also analyzed. The effect of the distance between the air knife and the strip was evaluated. Technological parameters with on-site guidance role were obtained by combining them with the actual production to elucidate the role of the baffle in restraining the occurrence of EOC. The uniform distribution of pressure and coating thickness on the strip is achieved when the distance of the baffle from the strip edge is about 0.3 times of the jetting distance.

Developing a vacuum thermal stripping - acid absorption process for ammonia recovery from anaerobic digester effluent.

PubMed

Ukwuani, Anayo T; Tao, Wendong

2016-12-01

To prevent acetoclastic methanogens from ammonia inhibition in anaerobic digestion of protein-rich substrates, ammonia needs to be removed or recovered from digestate. This paper presents an innovative ammonia recovery process that couples vacuum thermal stripping with acid absorption. Ammonia is stripped out of digestate boiling at a temperature below the normal boiling point due to vacuum. Stripped ammonia is absorbed to a sulfuric acid solution, forming ammonium sulfate crystals as a marketable product. Three common types of digestate were found to have boiling point temperature-vacuum curves similar to water. Seven combinations of boiling temperature and vacuum (50 °C 16.6 kPa, 58 °C 20.0 kPa, 65 °C 25.1 kPa, 70 °C 33.6 kPa, 80 °C 54.0 kPa, 90 °C 74.2 kPa, and 100 °C 101.3 kPa) were tested for batch stripping of ammonia in dairy manure digestate. 93.3-99.9% of ammonia was stripped in 3 h. The Lewis-Whitman model fitted ammonia stripping process well. Ammonia mass transfer coefficient was significantly higher at boiling temperature 65-100 °C and vacuum pressure 25.1-101.3 kPa than 50-58 °C and 16.6-20.0 kPa. The low ammonia saturation concentrations (0-24 mg N/L) suggested a large driving force to strip ammonia. The optimum boiling point temperature - vacuum pressure for ammonia recovery in a recirculation line of a mesophilic digester was 65 °C and 25.1 kPa, at which the ammonia mass transfer coefficient was as high as 37.3 mm/h. Installation of a demister and liquid trap could avoid negative effects of higher stripping temperature and stronger vacuum on formation of ammonium sulfate crystals. Pilot tests demonstrated that high-purity ammonium sulfate crystals could be produced by controlling sulfuric acid content and maintaining acid solution saturated with ammonium sulfate. Although volatile organic compounds such as cyclohexene were found in the final acid solutions, no volatile organic compounds were found in the recovered crystals. Copyright © 2016 Elsevier Ltd. All rights reserved.

Physical distribution of oak strip flooring 1969

Treesearch

William C. Miller; William C. Miller

1971-01-01

As an aid to the marketing of oak strip flooring, a study was made of the distribution process for this product, from manufacture to consumer-where the flooring came from, where it went, how much was shipped, and who handled it.

Order of multiphoton excitation of sulfonium photo-acid generators used in photoresists based on SU-8

NASA Astrophysics Data System (ADS)

Williams, Henry E.; Diaz, Carlos; Padilla, Gabriel; Hernandez, Florencio E.; Kuebler, Stephen M.

2017-06-01

Multiphoton lithography (MPL), Z-scan spectroscopy, and quantum chemical calculations were employed to investigate the order of multiphoton excitation that occurs when femtosecond laser pulses are used to excite two sulfonium photo-acid generators (PAGs) commonly used in photoresists based on the cross-linkable epoxide SU-8. The mole-fractions of the mono- and bis-sulfonium forms of these PAGs were determined for the commercially available photoresist SU-8 2075 and for the PAGs alone from a separate source. Both were found to contain similar fractions of the mono- and bis-forms, with the mono form present in the majority. Reichert's method was used to determine the solvatochromic strength of the SU-8 matrix, so that results obtained for the PAGs in SU-8 and in solution could be reliably compared. The PAGs were found to exhibit a minimal solvatochromic shift for a series of solvents that span across the solvatochromic strength of SU-8 itself. Sub-micron-sized features were fabricated in SU-8 2075 by MPL using amplified and continuous-wave mode-locked laser pulses. Analysis of the features as a function of average laser power, scan speed, and excitation wavelength shows that the PAGs can be activated by both two- and three-photon absorption (2PA and 3PA). Which activation mode dominates depends principally upon the excitation wavelength because the average laser powers that can be used with the photoresist are limited by practical considerations. The power must be high enough to effect sufficient cross-linking, yet not so high as to exceed the damage threshold of the material. When the laser pulses have a duration on the order of 100 fs, 3PA dominates at wavelengths near 800 nm, whereas 2PA becomes dominant at wavelengths below 700 nm. These findings are corroborated by open-aperture Z-scan measurements and quantum chemical calculations of the cross-sections for 2PA and 3PA as a function of wavelength.

Fabricating Blazed Diffraction Gratings by X-Ray Lithography

NASA Technical Reports Server (NTRS)

Mouroulis, Pantazis; Hartley, Frank; Wilson, Daniel

2004-01-01

Gray-scale x-ray lithography is undergoing development as a technique for fabricating blazed diffraction gratings. As such, gray-scale x-ray lithography now complements such other grating-fabrication techniques as mechanical ruling, holography, ion etching, laser ablation, laser writing, and electron-beam lithography. Each of these techniques offers advantages and disadvantages for implementing specific grating designs; no single one of these techniques can satisfy the design requirements for all applications. Gray-scale x-ray lithography is expected to be advantageous for making gratings on steeper substrates than those that can be made by electron-beam lithography. This technique is not limited to sawtooth groove profiles and flat substrates: various groove profiles can be generated on arbitrarily shaped (including highly curved) substrates with the same ease as sawtooth profiles can be generated on flat substrates. Moreover, the gratings fabricated by this technique can be made free of ghosts (spurious diffraction components attributable to small spurious periodicities in the locations of grooves). The first step in gray-scale x-ray lithography is to conformally coat a substrate with a suitable photoresist. An x-ray mask (see Figure 1) is generated, placed between the substrate and a source of collimated x-rays, and scanned over the substrate so as to create a spatial modulation in the exposure of the photoresist. Development of the exposed photoresist results in a surface corrugation that corresponds to the spatial modulation and that defines the grating surface. The grating pattern is generated by scanning an appropriately shaped x-ray area mask along the substrate. The mask example of Figure 1 would generate a blazed grating profile when scanned in the perpendicular direction at constant speed, assuming the photoresist responds linearly to incident radiation. If the resist response is nonlinear, then the mask shape can be modified to account for the nonlinearity and produce a desired groove profile. An example of grating grooves generated by this technique is shown in Figure 2. A maximum relative efficiency of 88 percent has been demonstrated.

Investigation of HV/HR-CMOS technology for the ATLAS Phase-II Strip Tracker Upgrade

NASA Astrophysics Data System (ADS)

Fadeyev, V.; Galloway, Z.; Grabas, H.; Grillo, A. A.; Liang, Z.; Martinez-Mckinney, F.; Seiden, A.; Volk, J.; Affolder, A.; Buckland, M.; Meng, L.; Arndt, K.; Bortoletto, D.; Huffman, T.; John, J.; McMahon, S.; Nickerson, R.; Phillips, P.; Plackett, R.; Shipsey, I.; Vigani, L.; Bates, R.; Blue, A.; Buttar, C.; Kanisauskas, K.; Maneuski, D.; Benoit, M.; Di Bello, F.; Caragiulo, P.; Dragone, A.; Grenier, P.; Kenney, C.; Rubbo, F.; Segal, J.; Su, D.; Tamma, C.; Das, D.; Dopke, J.; Turchetta, R.; Wilson, F.; Worm, S.; Ehrler, F.; Peric, I.; Gregor, I. M.; Stanitzki, M.; Hoeferkamp, M.; Seidel, S.; Hommels, L. B. A.; Kramberger, G.; Mandić, I.; Mikuž, M.; Muenstermann, D.; Wang, R.; Zhang, J.; Warren, M.; Song, W.; Xiu, Q.; Zhu, H.

2016-09-01

ATLAS has formed strip CMOS project to study the use of CMOS MAPS devices as silicon strip sensors for the Phase-II Strip Tracker Upgrade. This choice of sensors promises several advantages over the conventional baseline design, such as better resolution, less material in the tracking volume, and faster construction speed. At the same time, many design features of the sensors are driven by the requirement of minimizing the impact on the rest of the detector. Hence the target devices feature long pixels which are grouped to form a virtual strip with binary-encoded z position. The key performance aspects are radiation hardness compatibility with HL-LHC environment, as well as extraction of the full hit position with full-reticle readout architecture. To date, several test chips have been submitted using two different CMOS technologies. The AMS 350 nm is a high voltage CMOS process (HV-CMOS), that features the sensor bias of up to 120 V. The TowerJazz 180 nm high resistivity CMOS process (HR-CMOS) uses a high resistivity epitaxial layer to provide the depletion region on top of the substrate. We have evaluated passive pixel performance, and charge collection projections. The results strongly support the radiation tolerance of these devices to radiation dose of the HL-LHC in the strip tracker region. We also describe design features for the next chip submission that are motivated by our technology evaluation.

A novel in situ gas stripping-pervaporation process integrated with acetone-butanol-ethanol fermentation for hyper n-butanol production.

PubMed

Xue, Chuang; Liu, Fangfang; Xu, Mengmeng; Zhao, Jingbo; Chen, Lijie; Ren, Jiangang; Bai, Fengwu; Yang, Shang-Tian

2016-01-01

Butanol is considered as an advanced biofuel, the development of which is restricted by the intensive energy consumption of product recovery. A novel two-stage gas stripping-pervaporation process integrated with acetone-butanol-ethanol (ABE) fermentation was developed for butanol recovery, with gas stripping as the first-stage and pervaporation as the second-stage using the carbon nanotubes (CNTs) filled polydimethylsiloxane (PDMS) mixed matrix membrane (MMM). Compared to batch fermentation without butanol recovery, more ABE (27.5 g/L acetone, 75.5 g/L butanol, 7.0 g/L ethanol vs. 7.9 g/L acetone, 16.2 g/L butanol, 1.4 g/L ethanol) were produced in the fed-batch fermentation, with a higher butanol productivity (0.34 g/L · h vs. 0.30 g/L · h) due to reduced butanol inhibition by butanol recovery. The first-stage gas stripping produced a condensate containing 155.6 g/L butanol (199.9 g/L ABE), which after phase separation formed an organic phase containing 610.8 g/L butanol (656.1 g/L ABE) and an aqueous phase containing 85.6 g/L butanol (129.7 g/L ABE). Fed with the aqueous phase of the condensate from first-stage gas stripping, the second-stage pervaporation using the CNTs-PDMS MMM produced a condensate containing 441.7 g/L butanol (593.2 g/L ABE), which after mixing with the organic phase from gas stripping gave a highly concentrated product containing 521.3 g/L butanol (622.9 g/L ABE). The outstanding performance of CNTs-PDMS MMM can be attributed to the hydrophobic CNTs giving an alternative route for mass transport through the inner tubes or along the smooth surface of CNTs. This gas stripping-pervaporation process with less contaminated risk is thus effective in increasing butanol production and reducing energy consumption. © 2015 Wiley Periodicals, Inc.

A novel solid state fermentation coupled with gas stripping enhancing the sweet sorghum stalk conversion performance for bioethanol

PubMed Central

2014-01-01

Background Bioethanol production from biomass is becoming a hot topic internationally. Traditional static solid state fermentation (TS-SSF) for bioethanol production is similar to the traditional method of intermittent operation. The main problems of its large-scale intensive production are the low efficiency of mass and heat transfer and the high ethanol inhibition effect. In order to achieve continuous production and high conversion efficiency, gas stripping solid state fermentation (GS-SSF) for bioethanol production from sweet sorghum stalk (SSS) was systematically investigated in the present study. Results TS-SSF and GS-SSF were conducted and evaluated based on different SSS particle thicknesses under identical conditions. The ethanol yield reached 22.7 g/100 g dry SSS during GS-SSF, which was obviously higher than that during TS-SSF. The optimal initial gas stripping time, gas stripping temperature, fermentation time, and particle thickness of GS-SSF were 10 h, 35°C, 28 h, and 0.15 cm, respectively, and the corresponding ethanol stripping efficiency was 77.5%. The ethanol yield apparently increased by 30% with the particle thickness decreasing from 0.4 cm to 0.05 cm during GS-SSF. Meanwhile, the ethanol yield increased by 6% to 10% during GS-SSF compared with that during TS-SSF under the same particle thickness. The results revealed that gas stripping removed the ethanol inhibition effect and improved the mass and heat transfer efficiency, and hence strongly enhanced the solid state fermentation (SSF) performance of SSS. GS-SSF also eliminated the need for separate reactors and further simplified the bioethanol production process from SSS. As a result, a continuous conversion process of SSS and online separation of bioethanol were achieved by GS-SSF. Conclusions SSF coupled with gas stripping meet the requirements of high yield and efficient industrial bioethanol production. It should be a novel bioconversion process for bioethanol production from SSS biomass. PMID:24713041

Fabrication of Smooth Patterned Structures of Refractory Metals, Semiconductors, and Oxides via Template Stripping

PubMed Central

2013-01-01

The template-stripping method can yield smooth patterned films without surface contamination. However, the process is typically limited to coinage metals such as silver and gold because other materials cannot be readily stripped from silicon templates due to strong adhesion. Herein, we report a more general template-stripping method that is applicable to a larger variety of materials, including refractory metals, semiconductors, and oxides. To address the adhesion issue, we introduce a thin gold layer between the template and the deposited materials. After peeling off the combined film from the template, the gold layer can be selectively removed via wet etching to reveal a smooth patterned structure of the desired material. Further, we demonstrate template-stripped multilayer structures that have potential applications for photovoltaics and solar absorbers. An entire patterned device, which can include a transparent conductor, semiconductor absorber, and back contact, can be fabricated. Since our approach can also produce many copies of the patterned structure with high fidelity by reusing the template, a low-cost and high-throughput process in micro- and nanofabrication is provided that is useful for electronics, plasmonics, and nanophotonics. PMID:24001174

Enhancement of n-butanol production by in situ butanol removal using permeating-heating-gas stripping in acetone-butanol-ethanol fermentation.

PubMed

Chen, Yong; Ren, Hengfei; Liu, Dong; Zhao, Ting; Shi, Xinchi; Cheng, Hao; Zhao, Nan; Li, Zhenjian; Li, Bingbing; Niu, Huanqing; Zhuang, Wei; Xie, Jingjing; Chen, Xiaochun; Wu, Jinglan; Ying, Hanjie

2014-07-01

Butanol recovery from acetone-butanol-ethanol (ABE) fed-batch fermentation using permeating-heating-gas was determined in this study. Fermentation was performed with Clostridium acetobutylicum B3 in a fibrous bed bioreactor and permeating-heating-gas stripping was used to eliminate substrate and product inhibition, which normally restrict ABE production and sugar utilization to below 20 g/L and 60 g/L, respectively. In batch fermentation (without permeating-heating-gas stripping), C. acetobutylicum B3 utilized 60 g/L glucose and produced 19.9 g/L ABE and 12 g/L butanol, while in the integrated process 290 g/L glucose was utilized and 106.27 g/L ABE and 66.09 g/L butanol were produced. The intermittent gas stripping process generated a highly concentrated condensate containing approximately 15% (w/v) butanol, 4% (w/v) acetone, a small amount of ethanol (<1%), and almost no acids, resulting in a highly concentrated butanol solution [∼ 70% (w/v)] after phase separation. Butanol removal by permeating-heating-gas stripping has potential for commercial ABE production. Copyright © 2014 The Authors. Published by Elsevier Ltd.. All rights reserved.

Thermally assisted peeling of an elastic strip in adhesion with a substrate via molecular bonds

NASA Astrophysics Data System (ADS)

Qian, Jin; Lin, Ji; Xu, Guang-Kui; Lin, Yuan; Gao, Huajian

A statistical model is proposed to describe the peeling of an elastic strip in adhesion with a flat substrate via an array of non-covalent molecular bonds. Under an imposed tensile peeling force, the interfacial bonds undergo diffusion-type transition in their bonding state, a process governed by a set of probabilistic equations coupled to the stretching, bending and shearing of the elastic strip. Because of the low characteristic energy scale associated with molecular bonding, thermal excitations are found to play an important role in assisting the escape of individual molecular bonds from their bonding energy well, leading to propagation of the peeling front well below the threshold peel-off force predicted by the classical theories. Our study establishes a link between the deformation of the strip and the spatiotemporal evolution of interfacial bonds, and delineates how factors like the peeling force, bending rigidity of the strip and binding energy of bonds influence the resultant peeling velocity and dimensions of the process zone. In terms of the apparent adhesion strength and dissipated energy, the bond-mediated interface is found to resist peeling in a strongly rate-dependent manner.

DEMONSTRATION OF THE NEXT-GENERATION CAUSTIC-SIDE SOLVENT EXTRACTION SOLVENT WITH 2-CM CENTRIFUGAL CONTRACTORS USING TANK 49H WASTE AND WASTE SIMULANT

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pierce, R.; Peters, T.; Crowder, M.

2011-09-27

Researchers successfully demonstrated the chemistry and process equipment of the Caustic-Side Solvent Extraction (CSSX) flowsheet using MaxCalix for the decontamination of high level waste (HLW). The demonstration was completed using a 12-stage, 2-cm centrifugal contactor apparatus at the Savannah River National Laboratory (SRNL). This represents the first CSSX process demonstration of the MaxCalix solvent system with Savannah River Site (SRS) HLW. Two tests lasting 24 and 27 hours processed non-radioactive simulated Tank 49H waste and actual Tank 49H HLW, respectively. Conclusions from this work include the following. The CSSX process is capable of reducing {sup 137}Cs in high level radioactivemore » waste by a factor of more than 40,000 using five extraction, two scrub, and five strip stages. Tests demonstrated extraction and strip section stage efficiencies of greater than 93% for the Tank 49H waste test and greater than 88% for the simulant waste test. During a test with HLW, researchers processed 39 liters of Tank 49H solution and the waste raffinate had an average decontamination factor (DF) of 6.78E+04, with a maximum of 1.08E+05. A simulant waste solution ({approx}34.5 liters) with an initial Cs concentration of 83.1 mg/L was processed and had an average DF greater than 5.9E+03, with a maximum DF of greater than 6.6E+03. The difference may be attributable to differences in contactor stage efficiencies. Test results showed the solvent can be stripped of cesium and recycled for {approx}25 solvent turnovers without the occurrence of any measurable solvent degradation or negative effects from minor components. Based on the performance of the 12-stage 2-cm apparatus with the Tank 49H HLW, the projected DF for MCU with seven extraction, two scrub, and seven strip stages operating at a nominal efficiency of 90% is {approx}388,000. At 95% stage efficiency, the DF in MCU would be {approx}3.2 million. Carryover of organic solvent in aqueous streams (and aqueous in organic streams) was less than 0.1% when processing Tank 49H HLW. The entrained solvent concentration measured in the decontaminated salt solution (DSS) was as much as {approx}140 mg/L, although that value may be overstated by as much as 50% due to modifier solubility in the DSS. The entrained solvent concentration was measured in the strip effluent (SE) and the results are pending. A steady-state concentration factor (CF) of 15.9 was achieved with Tank 49H HLW. Cesium distribution ratios [D(Cs)] were measured with non-radioactive Tank 49H waste simulant and actual Tank 49H waste. Below is a comparison of D(Cs) values of ESS and 2-cm tests. Batch Extraction-Strip-Scrub (ESS) tests yielded D(Cs) values for extraction of {approx}81-88 for tests with Tank 49H waste and waste simulant. The results from the 2-cm contactor tests were in agreement with values of 58-92 for the Tank 49H HLW test and 54-83 for the simulant waste test. These values are consistent with the reference D(Cs) for extraction of {approx}60. In tests with Tank 49H waste and waste simulant, batch ESS tests measured D(Cs) values for the two scrub stages as {approx}3.5-5.0 for the first scrub stage and {approx}1.0-3.0 for the second scrub stage. In the Tank 49H test, the D(Cs) values for the 2-cm test were far from the ESS values. A D(Cs) value of 161 was measured for the first scrub stage and 10.8 for the second scrub stage. The data suggest that the scrub stage is not operating as effectively as intended. For the simulant test, a D(Cs) value of 1.9 was measured for the first scrub stage; the sample from the second scrub stage was compromised. Measurements of the pH of all stage samples for the Tank 49H test showed that the pH for extraction and scrub stages was 14 and the pH for the strip stages was {approx}7. It is expected that the pH of the second scrub stage would be {approx}12-13. Batch ESS tests measured D(Cs) values for the strip stages to be {approx}0.002-0.010. A high value in Strip No.3 of a test with simulant solution has been attributed to issues associated with the limits of detection for the analytical method. In the 2-cm contactor tests, the first four strip stages of the Tank 49H waste test and all five strip stages in the simulant waste test had higher values than the ESS tests. Only the fifth strip stage D(Cs) value of the Tank 49H waste test matched that of the ESS tests. It is speculated that the less-than-optimal performance of the strip section is caused by inefficiencies in the scrub section. Because strip is sensitive to pH, the elevated pH value in the second scrub stage may be the cause of strip performance. In spite of the D(Cs) values obtained in the scrub and strip sections, testing showed that the solvent system is robust. Average DFs for the process far exceeded targets even though the scrub and strip stages did not function optimally. Correction of the issue in the scrub and strip stages is expected to yield even higher waste DFs.« less

[Air stripping-UASB process for the treatment of evaporator condensate from a Kraft pulp mill].

PubMed

Zhou, Wei-li; Qin, Xiao-peng; Yu, Jun; Imai, Tsuyoshi; Ukita, Masao

2006-04-01

Evaporator condensate from a kraft pulp mill is characterized by high temperature, high strength, poor nutrition, and some odor and inhibitive materials. In this study, air stripping-UASB process was developed to treat the wastewater from a kraft pulp mill. The lab scale study demonstrated that air stripping process removed 70%-80% of the volatile organic sulfur compounds. After that, the UASB reactor showed high efficiency, at the organic loading rate (COD) of 30 kg x (m3 x d)(-1), COD removal was retained about 95%. On the other hand, the inoculated granules were broken in the new surroundings and were replaced with the newly formed granules The scanning electronic microscope (SEM) observation showed wide difference of the predominant anaerobic microorganisms in the seed and newly formed granules.

Microactuator production via high aspect ratio, high edge acuity metal fabrication technology

NASA Technical Reports Server (NTRS)

Guckel, H.; Christenson, T. R.

1993-01-01

LIGA is a procession sequence which uses x-ray lithography on photoresist layers of several hundred micrometers to produce very high edge acuity photopolymer molds. These plastic molds can be converted to metal molds via electroplating of many different metals and alloys. The end results are high edge acuity metal parts with large structural heights. The LIGA process as originally described by W. Ehrfeld can be extended by adding a surface micromachining phase to produce precision metal parts which can be assembled to form three-dimensional micromechanisms. This process, SLIGA, has been used to fabricate a dynamometer on a chip. The instrument has been fully implemented and will be applied to tribology issues, speed-torque characterization of planar magnetic micromotors and a new family of sensors.

Integration of multiple theories for the simulation of laser interference lithography processes

NASA Astrophysics Data System (ADS)

Lin, Te-Hsun; Yang, Yin-Kuang; Fu, Chien-Chung

2017-11-01

The periodic structure of laser interference lithography (LIL) fabrication is superior to other lithography technologies. In contrast to traditional lithography, LIL has the advantages of being a simple optical system with no mask requirements, low cost, high depth of focus, and large patterning area in a single exposure. Generally, a simulation pattern for the periodic structure is obtained through optical interference prior to its fabrication through LIL. However, the LIL process is complex and combines the fields of optical and polymer materials; thus, a single simulation theory cannot reflect the real situation. Therefore, this research integrates multiple theories, including those of optical interference, standing waves, and photoresist characteristics, to create a mathematical model for the LIL process. The mathematical model can accurately estimate the exposure time and reduce the LIL process duration through trial and error.

Integration of multiple theories for the simulation of laser interference lithography processes.

PubMed

Lin, Te-Hsun; Yang, Yin-Kuang; Fu, Chien-Chung

2017-11-24

The periodic structure of laser interference lithography (LIL) fabrication is superior to other lithography technologies. In contrast to traditional lithography, LIL has the advantages of being a simple optical system with no mask requirements, low cost, high depth of focus, and large patterning area in a single exposure. Generally, a simulation pattern for the periodic structure is obtained through optical interference prior to its fabrication through LIL. However, the LIL process is complex and combines the fields of optical and polymer materials; thus, a single simulation theory cannot reflect the real situation. Therefore, this research integrates multiple theories, including those of optical interference, standing waves, and photoresist characteristics, to create a mathematical model for the LIL process. The mathematical model can accurately estimate the exposure time and reduce the LIL process duration through trial and error.

ERTS-1 data applied to strip mining

NASA Technical Reports Server (NTRS)

Anderson, A. T.; Schubert, J.

1976-01-01

Two coal basins within the western region of the Potomac River Basin contain the largest strip-mining operations in western Maryland and West Virginia. The disturbed strip-mine areas were delineated along with the surrounding geological and vegetation features by using ERTS-1 data in both analog and digital form. The two digital systems employed were (1) the ERTS analysis system, a point-by-point digital analysis of spectral signatures based on known spectral values and (2) the LARS automatic data processing system. These two systems aided in efforts to determine the extent and state of strip mining in this region. Aircraft data, ground-verification information, and geological field studies also aided in the application of ERTS-1 imagery to perform an integrated analysis that assessed the adverse effects of strip mining. The results indicated that ERTS can both monitor and map the extent of strip mining to determine immediately the acreage affected and to indicate where future reclamation and revegetation may be necessary.

Gas Loss by Ram Pressure Stripping and Internal Feedback from Low-mass Milky Way Satellites

NASA Astrophysics Data System (ADS)

Emerick, Andrew; Mac Low, Mordecai-Mark; Grcevich, Jana; Gatto, Andrea

2016-08-01

The evolution of dwarf satellites in the Milky Way (MW) is affected by a combination of ram pressure stripping (RPS), tidal stripping, and internal feedback from massive stars. We investigate gas loss processes in the smallest satellites of the MW using three-dimensional, high-resolution, idealized wind tunnel simulations, accounting for gas loss through both ram pressure stripping and expulsion by supernova feedback. Using initial conditions appropriate for a dwarf galaxy like Leo T, we investigate whether or not environmental gas stripping and internal feedback can quench these low-mass galaxies on the expected timescales, shorter than 2 Gyr. We find that supernova feedback contributes negligibly to the stripping rate for these low star formation rate galaxies. However, we also find that RPS is less efficient than expected in the stripping scenarios we consider. Our work suggests that although RPS can eventually completely strip these galaxies, other physics is likely at play to reconcile our computed stripping times with the rapid quenching timescales deduced from observations of low-mass MW dwarf galaxies. We discuss the roles additional physics may play in this scenario, including host-satellite tidal interactions, cored versus cuspy dark matter profiles, reionization, and satellite preprocessing. We conclude that a proper accounting of these physics together is necessary to understand the quenching of low-mass MW satellites.

GAS LOSS BY RAM PRESSURE STRIPPING AND INTERNAL FEEDBACK FROM LOW-MASS MILKY WAY SATELLITES

DOE Office of Scientific and Technical Information (OSTI.GOV)

Emerick, Andrew; Low, Mordecai-Mark Mac; Grcevich, Jana

The evolution of dwarf satellites in the Milky Way (MW) is affected by a combination of ram pressure stripping (RPS), tidal stripping, and internal feedback from massive stars. We investigate gas loss processes in the smallest satellites of the MW using three-dimensional, high-resolution, idealized wind tunnel simulations, accounting for gas loss through both ram pressure stripping and expulsion by supernova feedback. Using initial conditions appropriate for a dwarf galaxy like Leo T, we investigate whether or not environmental gas stripping and internal feedback can quench these low-mass galaxies on the expected timescales, shorter than 2 Gyr. We find that supernovamore » feedback contributes negligibly to the stripping rate for these low star formation rate galaxies. However, we also find that RPS is less efficient than expected in the stripping scenarios we consider. Our work suggests that although RPS can eventually completely strip these galaxies, other physics is likely at play to reconcile our computed stripping times with the rapid quenching timescales deduced from observations of low-mass MW dwarf galaxies. We discuss the roles additional physics may play in this scenario, including host-satellite tidal interactions, cored versus cuspy dark matter profiles, reionization, and satellite preprocessing. We conclude that a proper accounting of these physics together is necessary to understand the quenching of low-mass MW satellites.« less

Distributed pressure sensors for a urethral catheter.

PubMed

Ahmadi, Mahdi; Rajamani, Rajesh; Timm, Gerald; Sezen, A S

2015-01-01

A flexible strip that incorporates multiple pressure sensors and is capable of being fixed to a urethral catheter is developed. The urethral catheter thus instrumented will be useful for measurement of pressure in a human urethra during urodynamic testing in a clinic. This would help diagnose the causes of urinary incontinence in patients. Capacitive pressure sensors are fabricated on a flexible polyimide-copper substrate using surface micromachining processes and alignment/assembly of the top and bottom portions of the sensor strip. The developed sensor strip is experimentally evaluated in an in vitro test rig using a pressure chamber. The sensor strip is shown to have adequate sensitivity and repeatability. While the calibration factors for the sensors on the strip vary from one sensor to another, even the least sensitive sensor has a resolution better than 0.1 psi.

Herpin effective media resonant underlayers and resonant overlayer designs for ultra-high NA interference lithography.

PubMed

Bourke, Levi; Blaikie, Richard J

2017-12-01

Dielectric waveguide resonant underlayers are employed in ultra-high NA interference photolithography to effectively double the depth of field. Generally a single high refractive index waveguiding layer is employed. Here multilayer Herpin effective medium methods are explored to develop equivalent multilayer waveguiding layers. Herpin equivalent resonant underlayers are shown to be suitable replacements provided at least one layer within the Herpin trilayer supports propagating fields. In addition, a method of increasing the intensity incident upon the photoresist using resonant overlayers is also developed. This method is shown to greatly enhance the intensity within the photoresist making the use of thicker, safer, non-absorbing, low refractive index matching liquids potentially suitable for large-scale applications.

Patterning of oxide-hardened gold black by photolithography and metal lift-off

NASA Astrophysics Data System (ADS)

Panjwani, Deep; Yesiltas, Mehmet; Nath, Janardan; Maukonen, D. E.; Rezadad, Imen; Smith, Evan M.; Peale, R. E.; Hirschmugl, Carol; Sedlmair, Julia; Wehlitz, Ralf; Unger, Miriam; Boreman, Glenn

2014-01-01

A method to pattern infrared-absorbing gold black by conventional photolithography and lift-off is described. A photo-resist pattern is developed on a substrate by standard photolithography. Gold black is deposited over the whole by thermal evaporation in an inert gas at ˜1 Torr. SiO2 is then deposited as a protection layer by electron beam evaporation. Lift-off proceeds by dissolving the photoresist in acetone. The resulting sub-millimeter size gold black patterns that remain on the substrate retain high infrared absorption out to ˜5 μm wavelength and exhibit good mechanical stability. This technique allows selective application of gold black coatings to the pixels of thermal infrared imaging array detectors.

Nanostructures and functional materials fabricated by interferometric lithography.

PubMed

Xia, Deying; Ku, Zahyun; Lee, S C; Brueck, S R J

2011-01-11

Interferometric lithography (IL) is a powerful technique for the definition of large-area, nanometer-scale, periodically patterned structures. Patterns are recorded in a light-sensitive medium, such as a photoresist, that responds nonlinearly to the intensity distribution associated with the interference of two or more coherent beams of light. The photoresist patterns produced with IL are a platform for further fabrication of nanostructures and growth of functional materials and are building blocks for devices. This article provides a brief review of IL technologies and focuses on various applications for nanostructures and functional materials based on IL including directed self-assembly of colloidal nanoparticles, nanophotonics, semiconductor materials growth, and nanofluidic devices. Perspectives on future directions for IL and emerging applications in other fields are presented.

Embedded top-coat for reducing the effect out of band radiation in EUV lithography

NASA Astrophysics Data System (ADS)

Du, Ke; Siauw, Meiliana; Valade, David; Jasieniak, Marek; Voelcker, Nico; Trefonas, Peter; Thackeray, Jim; Blakey, Idriss; Whittaker, Andrew

2017-03-01

Out of band (OOB) radiation from the EUV source has significant implications for the performance of EUVL photoresists. Here we introduce a surface-active polymer additive, capable of partitioning to the top of the resist film during casting and annealing, to protect the underlying photoresist from OOB radiation. Copolymers were prepared using reversible addition-fragmentation chain transfer (RAFT) polymerization, and rendered surface active by chain extension with a block of fluoro-monomer. Films were prepared from the EUV resist with added surface-active Embedded Barrier Layer (EBL), and characterized using measurements of contact angles and spectroscopic ellipsometry. Finally, the lithographic performance of the resist containing the EBL was evaluated using Electron Beam Lithography exposure

Numerical and experimental study on multi-pass laser bending of AH36 steel strips

NASA Astrophysics Data System (ADS)

Fetene, Besufekad N.; Kumar, Vikash; Dixit, Uday S.; Echempati, Raghu

2018-02-01

Laser bending is a process of bending of plates, small sized sheets, strips and tubes, in which a moving or stationary laser beam heats the workpiece to achieve the desired curvature due to thermal stresses. Researchers studied the effects of different process parameters related to the laser source, material and workpiece geometry on laser bending of metal sheets. The studies are focused on large sized sheets. The workpiece geometry parameters like sheet thickness, length and width also affect the bend angle considerably. In this work, the effects of width and thickness on multi-pass laser bending of AH36 steel strips were studied experimentally and numerically. Finite element model using ABAQUS® was developed to investigate the size effect on the prediction of the bend angle. Microhardness and flexure tests showed an increase in the flexural strength as well as microhardness in the scanned zone. The microstructures of the bent strips also supported the physical observations.

Heat pipe with improved wick structures

DOEpatents

Benson, David A.; Robino, Charles V.; Palmer, David W.; Kravitz, Stanley H.

2000-01-01

An improved planar heat pipe wick structure having projections formed by micromachining processes. The projections form arrays of interlocking, semi-closed structures with multiple flow paths on the substrate. The projections also include overhanging caps at their tops to increase the capillary pumping action of the wick structure. The capped projections can be formed in stacked layers. Another layer of smaller, more closely spaced projections without caps can also be formed on the substrate in between the capped projections. Inexpensive materials such as Kovar can be used as substrates, and the projections can be formed by electrodepositing nickel through photoresist masks.

Low-Dielectric Polyimides

NASA Technical Reports Server (NTRS)

St. Clair, Anne K.; St. Clair, Terry L.; Winfree, William P.; Emerson, Bert R., Jr.

1989-01-01

New process developed to produce aromatic condensation polyimide films and coatings having dielectric constants in range of 2.4 to 3.2. Materials better electrical insulators than state-of-the-art commercial polyimides. Several low-dielectric-constant polyimides have excellent resistance to moisture. Useful as film and coating materials for both industrial and aerospace applications where high electrical insulation, resistance to moisture, mechanical strength, and thermal stability required. Applicable to production of high-temperature and moisture-resistance adhesives, films, photoresists, and coatings. Electronic applications include printed-circuit boards, both of composite and flexible-film types and potential use in automotive, aerospace, and electronic industries.

Fabrication of amorphous silica nanowires via oxygen plasma treatment of polymers on silicon

NASA Astrophysics Data System (ADS)

Chen, Zhuojie; She, Didi; Chen, Qinghua; Li, Yanmei; Wu, Wengang

2018-02-01

We demonstrate a facile non-catalytic method of fabricating silica nanowires at room temperature. Different polymers including photoresists, parylene C and polystyrene are patterned into pedestals on the silicon substrates. The silica nanowires are obtained via the oxygen plasma treatment on those pedestals. Compared to traditional strategies of silica nanowire fabrication, this method is much simpler and low-cost. Through designing the proper initial patterns and plasma process parameters, the method can be used to fabricate various regiment nano-scale silica structure arrays in any laboratory with a regular oxygen-plasma-based cleaner or reactive-ion-etching equipment.

Building the Hot Intra-Group Medium in Spiral-Rich Compact Groups

NASA Astrophysics Data System (ADS)

O'Sullivan, Ewan

2014-11-01

Galaxy groups provide a natural laboratory for investigating the formation of the hot intergalactic medium (IGM). While galaxy clusters gain most of their hot gas through accretion and gravitational shocks, in groups the processes of galaxy evolution (stripping, collisions, star formation) play an important role in the initial build up of the hot halo. We present Chandra and XMM-Newton observations of groups still in the process of forming their IGM, including the well known compact groups HCG 16 and Stephan's Quintet (HCG 92). We show that starburst winds and shock-heating of stripped HI provide important contributions of gas and metals to the IGM, and discuss the impact of gas stripping, enhanced star formation and nuclear activity in the group member galaxies.

Application of statistical methods to reveal and remove the causes of welding of coil laps upon annealing of cold-rolled steel strips

NASA Astrophysics Data System (ADS)

Garber, E. A.; Diligenskii, E. V.; Antonov, P. V.; Shalaevskii, D. L.; Dyatlov, I. A.

2017-09-01

The factors of the process of production of cold-rolled steel strips that promote and hinder the appearance of a coil lap welding defect upon annealing in bell-type furnaces are analyzed using statistical methods. The works dealing with this problem are analytically reviewed to reveal the problems to be studied and refined. The ranking of the technological factors according to the significance of their influence on the probability of appearance of this defect is determined and supported by industrial data, and a regression equation is derived to calculate this probability. The process of production is improved to minimize the rejection of strips caused by the welding of coil laps.

Performance evaluation of nonchemically amplified negative tone photoresists for e-beam and EUV lithography

NASA Astrophysics Data System (ADS)

Singh, Vikram; Satyanarayana, Vardhineedi Sri Venkata; Batina, Nikola; Reyes, Israel Morales; Sharma, Satinder K.; Kessler, Felipe; Scheffer, Francine R.; Weibel, Daniel E.; Ghosh, Subrata; Gonsalves, Kenneth E.

2014-10-01

Although extreme ultraviolet (EUV) lithography is being considered as one of the most promising next-generation lithography techniques for patterning sub-20 nm features, the development of suitable EUV resists remains one of the main challenges confronting the semiconductor industry. The goal is to achieve sub-20 nm line patterns having low line edge roughness (LER) of <1.8 nm and a sensitivity of 5 to 20 mJ/cm2. The present work demonstrates the lithographic performance of two nonchemically amplified (n-CARs) negative photoresists, MAPDST homopolymer and MAPDST-MMA copolymer, prepared from suitable monomers containing the radiation sensitive sulfonium functionality. Investigations into the effect of several process parameters are reported. These include spinning conditions to obtain film thicknesses <50 nm, baking regimes, exposure conditions, and the resulting surface topographies. The effect of these protocols on sensitivity, contrast, and resolution has been assessed for the optimization of 20 nm features and the corresponding LER/line width roughness. These n-CARs have also been found to possess high etch resistance. The etch durability of MAPDST homopolymer and MAPDST-MMA copolymer (under SF6 plasma chemistry) with respect to the silicon substrate are 7.2∶1 and 8.3∶1, respectively. This methodical investigation will provide guidance in designing new resist materials with improved efficiency for EUVL through polymer microstructure engineering.

High-Q and highly reproducible microdisks and microlasers.

PubMed

Zhang, Nan; Wang, Yujie; Sun, Wenzhao; Liu, Shuai; Huang, Can; Jiang, Xiaoshun; Xiao, Min; Xiao, Shumin; Song, Qinghai

2018-01-25

High quality (Q) factor microdisks are fundamental building blocks of on-chip integrated photonic circuits and biological sensors. The resonant modes in microdisks circulate near their boundaries, making their performances strongly dependent upon surface roughness. Surface-tension-induced microspheres and microtoroids are superior to other dielectric microdisks when comparing Q factors. However, most photonic materials such as silicon and negative photoresists are hard to be reflowed and thus the realizations of high-Q microdisks are strongly dependent on electron-beam lithography. Herein, we demonstrate a robust, cost-effective, and highly reproducible technique to fabricate ultrahigh-Q microdisks. By using silica microtoroids as masks, we have successfully replicated their ultrasmooth boundaries in a photoresist via anisotropic dry etching. The experimentally recorded Q factors of passive microdisks can be as large as 1.5 × 10 6 . Similarly, ultrahigh Q microdisk lasers have also been replicated in dye-doped polymeric films. The laser linewidth is only 8 pm, which is limited by the spectrometer and is much narrower than that in previous reports. Meanwhile, high-Q deformed microdisks have also been fabricated by controlling the shape of microtoroids, making the internal ray dynamics and external directional laser emissions controllable. Interestingly, this technique also applies to other materials. Silicon microdisks with Q > 10 6 have been experimentally demonstrated with a similar process. We believe this research will be important for the advances of high-Q micro-resonators and their applications.

Surface mining

Treesearch

Robert Leopold; Bruce Rowland; Reed Stalder

1979-01-01

The surface mining process consists of four phases: (1) exploration; (2) development; (3) production; and (4) reclamation. A variety of surface mining methods has been developed, including strip mining, auger, area strip, open pit, dredging, and hydraulic. Sound planning and design techniques are essential to implement alternatives to meet the myriad of laws,...

Dominant root locus in state estimator design for material flow processes: A case study of hot strip rolling.

PubMed

Fišer, Jaromír; Zítek, Pavel; Skopec, Pavel; Knobloch, Jan; Vyhlídal, Tomáš

2017-05-01

The purpose of the paper is to achieve a constrained estimation of process state variables using the anisochronic state observer tuned by the dominant root locus technique. The anisochronic state observer is based on the state-space time delay model of the process. Moreover the process model is identified not only as delayed but also as non-linear. This model is developed to describe a material flow process. The root locus technique combined with the magnitude optimum method is utilized to investigate the estimation process. Resulting dominant roots location serves as a measure of estimation process performance. The higher the dominant (natural) frequency in the leftmost position of the complex plane the more enhanced performance with good robustness is achieved. Also the model based observer control methodology for material flow processes is provided by means of the separation principle. For demonstration purposes, the computer-based anisochronic state observer is applied to the strip temperatures estimation in the hot strip finishing mill composed of seven stands. This application was the original motivation to the presented research. Copyright © 2017 ISA. Published by Elsevier Ltd. All rights reserved.

Efficient content-based low-altitude images correlated network and strips reconstruction

NASA Astrophysics Data System (ADS)

He, Haiqing; You, Qi; Chen, Xiaoyong

2017-01-01

The manual intervention method is widely used to reconstruct strips for further aerial triangulation in low-altitude photogrammetry. Clearly the method for fully automatic photogrammetric data processing is not an expected way. In this paper, we explore a content-based approach without manual intervention or external information for strips reconstruction. Feature descriptors in the local spatial patterns are extracted by SIFT to construct vocabulary tree, in which these features are encoded in terms of TF-IDF numerical statistical algorithm to generate new representation for each low-altitude image. Then images correlated network is reconstructed by similarity measure, image matching and geometric graph theory. Finally, strips are reconstructed automatically by tracing straight lines and growing adjacent images gradually. Experimental results show that the proposed approach is highly effective in automatically rearranging strips of lowaltitude images and can provide rough relative orientation for further aerial triangulation.

A peptide hormone required for Casparian strip diffusion barrier formation in Arabidopsis roots.

PubMed

Nakayama, Takuya; Shinohara, Hidefumi; Tanaka, Mina; Baba, Koki; Ogawa-Ohnishi, Mari; Matsubayashi, Yoshikatsu

2017-01-20

Plants achieve mineral ion homeostasis by means of a hydrophobic barrier on endodermal cells called the Casparian strip, which restricts lateral diffusion of ions between the root vascular bundles and the soil. We identified a family of sulfated peptides required for contiguous Casparian strip formation in Arabidopsis roots. These peptide hormones, which we named Casparian strip integrity factor 1 (CIF1) and CIF2, are expressed in the root stele and specifically bind the endodermis-expressed leucine-rich repeat receptor kinase GASSHO1 (GSO1)/SCHENGEN3 and its homolog, GSO2. A mutant devoid of CIF peptides is defective in ion homeostasis in the xylem. CIF genes are environmentally responsive. Casparian strip regulation is not merely a passive process driven by root developmental cues; it also serves as an active strategy to cope with adverse soil conditions. Copyright © 2017, American Association for the Advancement of Science.

Epoxy-paint stripping using TEA CO2 laser: Determination of threshold fluence and the process parameters

NASA Astrophysics Data System (ADS)

Kumar, Manoj; Bhargava, P.; Biswas, A. K.; Sahu, Shasikiran; Mandloi, V.; Ittoop, M. O.; Khattak, B. Q.; Tiwari, M. K.; Kukreja, L. M.

2013-03-01

It is shown that the threshold fluence for laser paint stripping can be accurately estimated from the heat of gasification and the absorption coefficient of the epoxy-paint. The threshold fluence determined experimentally by stripping of the epoxy-paint on a substrate using a TEA CO2 laser matches closely with the calculated value. The calculated threshold fluence and the measured absorption coefficient of the paint allowed us to determine the epoxy paint thickness that would be removed per pulse at a given laser fluence even without experimental trials. This was used to predict the optimum scan speed required to strip the epoxy-paint of a given thickness using a high average power TEA CO2 laser. Energy Dispersive X-Ray Fluorescence (EDXRF) studies were also carried out on laser paint-stripped concrete substrate to show high efficacy of this modality.

Effective cleaning of hexagonal boron nitride for graphene devices.

PubMed

Garcia, Andrei G F; Neumann, Michael; Amet, François; Williams, James R; Watanabe, Kenji; Taniguchi, Takashi; Goldhaber-Gordon, David

2012-09-12

Hexagonal boron nitride (h-BN) films have attracted considerable interest as substrates for graphene. ( Dean, C. R. et al. Nat. Nanotechnol. 2010 , 5 , 722 - 6 ; Wang, H. et al. Electron Device Lett. 2011 , 32 , 1209 - 1211 ; Sanchez-Yamagishi, J. et al. Phys. Rev. Lett. 2012 , 108 , 1 - 5 .) We study the presence of organic contaminants introduced by standard lithography and substrate transfer processing on h-BN films exfoliated on silicon oxide substrates. Exposure to photoresist processing adds a large broad luminescence peak to the Raman spectrum of the h-BN flake. This signal persists through typical furnace annealing recipes (Ar/H(2)). A recipe that successfully removes organic contaminants and results in clean h-BN flakes involves treatment in Ar/O(2) at 500 °C.

Plasma generating apparatus for large area plasma processing

DOEpatents

Tsai, C.C.; Gorbatkin, S.M.; Berry, L.A.

1991-07-16

A plasma generating apparatus for plasma processing applications is based on a permanent magnet line-cusp plasma confinement chamber coupled to a compact single-coil microwave waveguide launcher. The device creates an electron cyclotron resonance (ECR) plasma in the launcher and a second ECR plasma is created in the line cusps due to a 0.0875 tesla magnetic field in that region. Additional special magnetic field configuring reduces the magnetic field at the substrate to below 0.001 tesla. The resulting plasma source is capable of producing large-area (20-cm diam), highly uniform (.+-.5%) ion beams with current densities above 5 mA/cm[sup 2]. The source has been used to etch photoresist on 5-inch diam silicon wafers with good uniformity. 3 figures.

Plasma generating apparatus for large area plasma processing

DOEpatents

Tsai, Chin-Chi; Gorbatkin, Steven M.; Berry, Lee A.

1991-01-01

A plasma generating apparatus for plasma processing applications is based on a permanent magnet line-cusp plasma confinement chamber coupled to a compact single-coil microwave waveguide launcher. The device creates an electron cyclotron resonance (ECR) plasma in the launcher and a second ECR plasma is created in the line cusps due to a 0.0875 tesla magnetic field in that region. Additional special magnetic field configuring reduces the magnetic field at the substrate to below 0.001 tesla. The resulting plasma source is capable of producing large-area (20-cm diam), highly uniform (.+-.5%) ion beams with current densities above 5 mA/cm.sup.2. The source has been used to etch photoresist on 5-inch diam silicon wafers with good uniformity.

SOLVENT EXTRACTION PROCESS

DOEpatents

Jonke, A.A.

1957-10-01

In improved solvent extraction process is described for the extraction of metal values from highly dilute aqueous solutions. The process comprises contacting an aqueous solution with an organic substantially water-immiscible solvent, whereby metal values are taken up by a solvent extract phase; scrubbing the solvent extract phase with an aqueous scrubbing solution; separating an aqueous solution from the scrubbed solvent extract phase; and contacting the scrubbed solvent phase with an aqueous medium whereby the extracted metal values are removed from the solvent phase and taken up by said medium to form a strip solution containing said metal values, the aqueous scrubbing solution being a mixture of strip solution and an aqueous solution which contains mineral acids anions and is free of the metal values. The process is particularly effective for purifying uranium, where one starts with impure aqueous uranyl nitrate, extracts with tributyl phosphate dissolved in carbon tetrachloride, scrubs with aqueous nitric acid and employs water to strip the uranium from the scrubbed organic phase.

Production of furfural from pentosan-rich biomass: analysis of process parameters during simultaneous furfural stripping.

PubMed

Agirrezabal-Telleria, I; Gandarias, I; Arias, P L

2013-09-01

Among the furan-based compounds, furfural (FUR) shows interesting properties as building-block or industrial solvent. It is produced from pentosan-rich biomass via xylose cyclodehydration. The current FUR production makes use of homogeneous catalysts and excessive amounts of steam. The development of greener furfural production and separation techniques implies the use of heterogeneous catalysts and innovative separation processes. This work deals with the conversion of corncobs as xylose source to be dehydrated to furfural. The results reveal differences between the use of direct corncob hydrolysis and dehydration to furfural and the prehydrolysis and dehydration procedures. Moreover, this work focuses on an economical analysis of the main process parameters during N2-stripping and its economical comparison to the current steam-stripping process. The results show a considerable reduction of the annual utility costs due to use of recyclable nitrogen and the reduction of the furfural purification stages. Copyright © 2013 Elsevier Ltd. All rights reserved.

Friction stir welding process to repair voids in aluminum alloys

NASA Technical Reports Server (NTRS)

Rosen, Charles D. (Inventor); Litwinski, Edward (Inventor); Valdez, Juan M. (Inventor)

1999-01-01

The present invention provides an in-process method to repair voids in an aluminum alloy, particularly a friction stir weld in an aluminum alloy. For repairing a circular void or an in-process exit hole in a weld, the method includes the steps of fabricating filler material of the same composition or compatible with the parent material into a plug form to be fitted into the void, positioning the plug in the void, and friction stir welding over and through the plug. For repairing a longitudinal void (30), the method includes machining the void area to provide a trough (34) that subsumes the void, fabricating filler metal into a strip form (36) to be fitted into the trough, positioning the strip in the trough, and rewelding the void area by traversing a friction stir welding tool longitudinally through the strip. The method is also applicable for repairing welds made by a fusing welding process or voids in aluminum alloy workpieces themselves.

A novel approach: high resolution inspection with wafer plane defect detection

NASA Astrophysics Data System (ADS)

Hess, Carl; Wihl, Mark; Shi, Rui-fang; Xiong, Yalin; Pang, Song

2008-05-01

High Resolution reticle inspection is well-established as a proven, effective, and efficient means of detecting yield-limiting mask defects as well as defects which are not immediately yield-limiting yet can enable manufacturing process improvements. Historically, RAPID products have enabled detection of both classes of these defects. The newly-developed Wafer Plane Inspection (WPI) detector technology meets the needs of some advanced mask manufacturers to identify the lithographically-significant defects while ignoring the other non-lithographically-significant defects. Wafer Plane Inspection accomplishes this goal by performing defect detection based on a modeled image of how the mask features would actually print in the photoresist. This has the effect of reducing sensitivity to non-printing defects while enabling higher sensitivity focused in high MEEF areas where small reticle defects still yield significant printing defects on wafers. WPI is a new inspection mode that has been developed by KLA-Tencor and is currently under test with multiple customers. It employs the same transmitted and reflected-light high-resolution images as the industry-standard high-resolution inspections, but with much more sophisticated processing involved. A rigorous mask pattern recovery algorithm is used to convert the transmitted and reflected light images into a modeled representation of the reticle. Lithographic modeling of the scanner is then used to generate an aerial image of the mask. This is followed by resist modeling to determine the exposure of the photoresist. The defect detectors are then applied on this photoresist plane so that only printing defects are detected. Note that no hardware modifications to the inspection system are required to enable this detector. The same tool will be able to perform both our standard High Resolution inspections and the Wafer Plane Inspection detector. This approach has several important features. The ability to ignore non-printing defects and to apply additional effective sensitivity in high MEEF areas enables advanced node development. In addition, the modeling allows the inclusion of important polarization effects that occur in the resist for high NA operation. This allows for the results to better match wafer print results compared to alternate approaches. Finally, the simulation easily allows for the application of arbitrary illumination profiles. With this approach, users of WPI can make use of unique or custom scanner illumination profiles. This allows the more precise modeling of profiles without inspection system hardware modification or loss of company intellectual property. This paper examines WPI in Die:Die mode. Future work includes a review of Die:Database WPI capability.

Woven graphite epoxy composite test specimens with glass buffer strips

NASA Technical Reports Server (NTRS)

Bonnar, G. R.; Palmer, R. J.

1982-01-01

Woven unidirectional graphite cloth with bands of fiberglass replacing the graphite in discrete lengthwise locations was impregnated with epoxy resin and used to fabricate a series of composite tensile and shear specimens. The finished panels, with the fiberglass buffer strips, were tested. Details of the fabrication process are reported.

Effect of intermediate annealing on the microstructure and mechanical property of ZK60 magnesium alloy produced by twin roll casting and hot rolling

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chen, Hongmei, E-mail: hmchen@just.edu.cn; Zang, Qianhao; Yu, Hui

2015-08-15

Twin roll cast (designated as TRC in short) ZK60 magnesium alloy strip with 3.5 mm thickness was used in this paper. The TRC ZK60 strip was multi-pass rolled at different temperatures, intermediate annealing heat treatment was performed when the thickness of the strip changed from 3.5 mm to 1 mm, and then continued to be rolled until the thickness reached to 0.5 mm. The effect of intermediate annealing during rolling process on microstructure, texture and room temperature mechanical properties of TRC ZK60 strip was studied by using OM, TEM, XRD and electronic universal testing machine. The introduction of intermediate annealingmore » can contribute to recrystallization in the ZK60 sheet which was greatly deformed, and help to reduce the stress concentration generated in the rolling process. Microstructure uniformity and mechanical properties of the ZK60 alloy sheet were also improved; in particular, the room temperature elongation was greatly improved. When the TRC ZK60 strip was rolled at 300 °C and 350 °C, the room temperature elongation of the rolled sheet with 0.5 mm thickness which was intermediate annealed during the rolling process was increased by 95% and 72% than that of no intermediate annealing, respectively. - Highlights: • Intermediate annealing was introduced during hot rolling process of twin roll cast ZK60 alloy. • Intermediate annealing can contribute to recrystallization and reduce the stress concentration in the deformed ZK60 sheet. • Microstructure uniformity and mechanical properties of the ZK60 sheet were improved, in particular, the room temperature elongation. • The elongation of the rolled ZK60 sheet after intermediate annealed was increased by 95% and 72% than that of no intermediate annealing.« less

Stripping methods studies for HVOF WC-10Co-4Cr coating removal

NASA Astrophysics Data System (ADS)

Menini, Richard; Salah, Nihad Ben; Nciri, Rachid

2004-04-01

The use of high-velocity oxyfuel (HVOF) cermet coatings is considered to be a valuable and innovative alternative technology to replace Cr(VI) electroplating. Among others, a WC-10Co-4Cr coating is one of the best choices for landing gear components due to its excellent tribology and corrosion properties. The stripping process of such a cermet coating was studied due to its importance for the repair and overhaul of landing gear components. Stripping solutions fulfill the following criteria: keep substrate integrity; exhibit a high strip rate (SR); lead to uniform dissolution; show no galvanic corrosion; and be environmentally friendly. Three different high-strength steel substrates (4340, 300M, and Aermet100) were studied. Five different stripping solutions were selected for the electrochemical study. Only three met the targeted criteria: the meta-nitrobenzane sulfonate-sodium cyanide solution; the Rochelle salt; and a commercial nickel stripper. It was found that the process must be electrolytic, and that ultrasonic agitation is needed to enhance the overall mass transport and removal of WC particles and metallic matrix residues. When choosing the most efficient solution and conditions, the SR was found to be as high as 162 µm h-1, which is a very acceptable SR for productivity sake.

Effect of polymer concentration on the structure and performance of PEI hollow fiber membrane contactor for CO2 stripping.

PubMed

Naim, R; Ismail, A F

2013-04-15

A series of polyetherimide (PEI) hollow fiber membranes with various polymer concentrations (13-16 wt.%) for CO2 stripping process in membrane contactor application was fabricated via wet phase inversion method. The PEI membranes were characterized in terms of liquid entry pressure, contact angle, gas permeation and morphology analysis. CO2 stripping performance was investigated via membrane contactor system in a stainless steel module with aqueous diethanolamine as liquid absorbent. The hollow fiber membranes showed decreasing patterns in gas permeation, contact angle, mean pore size and effective surface porosity with increasing polymer concentration. On the contrary, wetting pressure of PEI membranes has enhanced significantly with polymer concentration. Various polymer concentrations have different effects on the CO2 stripping flux in which membrane with 14 wt.% polymer concentration showed the highest stripping flux of 2.7 × 10(-2)mol/m(2)s. From the performance comparison with other commercial membrane, it is anticipated that the PEI membrane has a good prospect in CO2 stripping via membrane contactor. Copyright © 2013 Elsevier B.V. All rights reserved.

Comparison of 3 Methods to Assess Urine Specific Gravity in Collegiate Wrestlers.

PubMed

Stuempfle, Kristin J.; Drury, Daniel G.

2003-12-01

OBJECTIVE: To investigate the reliability and validity of refractometry, hydrometry, and reagent strips in assessing urine specific gravity in collegiate wrestlers. DESIGN AND SETTING: We assessed the reliability of refractometry, hydrometry, and reagent strips between 2 trials and among 4 testers. The validity of hydrometry and reagent strips was assessed by comparison with refractometry, the criterion measure for urine specific gravity. SUBJECTS: Twenty-one National Collegiate Athletic Association Division III collegiate wrestlers provided fresh urine samples. MEASUREMENTS: Four testers measured the specific gravity of each urine sample 6 times: twice by refractometry, twice by hydrometry, and twice by reagent strips. RESULTS: Refractometer measurements were consistent between trials (R =.998) and among testers; hydrometer measurements were consistent between trials (R =.987) but not among testers; and reagent-strip measurements were not consistent between trials or among testers. Hydrometer (1.018 +/- 0.006) and reagent-strip (1.017 +/- 0.007) measurements were significantly higher than refractometer (1.015 +/- 0.006) measurements. Intraclass correlation coefficients were moderate between refractometry and hydrometry (R =.869) and low between refractometry and reagent strips (R =.573). The hydrometer produced 28% false positives and 2% false negatives, and reagent strips produced 15% false positives and 9% false negatives. CONCLUSIONS: Only the refractometer should be used to determine urine specific gravity in collegiate wrestlers during the weight-certification process.

Comparison of 3 Methods to Assess Urine Specific Gravity in Collegiate Wrestlers

PubMed Central

Drury, Daniel G.

2003-01-01

Objective: To investigate the reliability and validity of refractometry, hydrometry, and reagent strips in assessing urine specific gravity in collegiate wrestlers. Design and Setting: We assessed the reliability of refractometry, hydrometry, and reagent strips between 2 trials and among 4 testers. The validity of hydrometry and reagent strips was assessed by comparison with refractometry, the criterion measure for urine specific gravity. Subjects: Twenty-one National Collegiate Athletic Association Division III collegiate wrestlers provided fresh urine samples. Measurements: Four testers measured the specific gravity of each urine sample 6 times: twice by refractometry, twice by hydrometry, and twice by reagent strips. Results: Refractometer measurements were consistent between trials (R = .998) and among testers; hydrometer measurements were consistent between trials (R = .987) but not among testers; and reagent-strip measurements were not consistent between trials or among testers. Hydrometer (1.018 ± 0.006) and reagent-strip (1.017 ± 0.007) measurements were significantly higher than refractometer (1.015 ± 0.006) measurements. Intraclass correlation coefficients were moderate between refractometry and hydrometry (R = .869) and low between refractometry and reagent strips (R = .573). The hydrometer produced 28% false positives and 2% false negatives, and reagent strips produced 15% false positives and 9% false negatives. Conclusions: Only the refractometer should be used to determine urine specific gravity in collegiate wrestlers during the weight-certification process. PMID:14737213

Luminal surface fabrication for cardiovascular prostheses

NASA Technical Reports Server (NTRS)

Deininger, William D. (Inventor); Gabriel, Stephen B. (Inventor)

1988-01-01

A method is provided for forming a mold surface with microscopic upstanding pillars for molding the inside surface of a vascular prostheses (synthetic blood vessel). The mold article is formed from a quantity of Teflon (polytetrafluoroethylene) which has a polished, flat surface on which a gold film has been sputter deposited. A photoresist layer, which cannot adhere directly to Teflon, adheres to the gold. The photoresist is exposed and developed leaving a sputter resistant mask defining the desired pillar locations, and the resulting workpiece is ion etched to form the pillars in the Teflon. A synthetic blood vessel material is cast against the Teflon mold to form blind recesses on the inside of the synthetic blood vessel, with the recesses being of predetermined uniform cross section and present in a predetermined uniform pattern.

Performance impact of novel polymeric dyes in photoresist applications

NASA Astrophysics Data System (ADS)

Lu, Ping-Hung; Mehtsun, Salem; Sagan, John P.; Shan, Jianhui; Gonzalez, Eleazar; Ding, Shuji; Khanna, Dinesh N.

1999-06-01

Dye compounds are commonly used in photoresists as a low cost and effective way to control swing and/or standing wave effect caused by thin film interference as well as reflective notching by reflective light from highly reflective substrate and topography. Convention dyes are typically a monomeric compound with high absorptivity at the wavelength of exposure light and compatible with the resist system selected. Because of the monomeric nature, conventional dyes are relatively low in molecular weight hence their thermal stability and sublimination propensity has always been an issue of concern. We recently synthesize several highly thermal stable diazotized polymeric dyes. Their thermal properties as well as compatibility with resist system were investigated. The impact of polymeric dyes on the resists lithographic performance, swing reduction and reflective notching control are discussed.

Three Dimensional Microfabrication On Thick Film Photoresist Mandrels

NASA Astrophysics Data System (ADS)

Salmre, William

1984-05-01

Small, three-dimensional structures are fabricated by the use of thick film photoresist mandrels as substrates for electoforming or other deposition techniques. Novel methods have been developed for the sculpting of the resist to desired shapes. These techniques rely heavily on the use of glass or other substrates coated with layers of metal. The metal serves both as a photomask and as a conductor of electricity. Commercially available chrome-on-glass photomasks are convenient for this purpose although other substrates have also been used. By controlling the thickness and light transmission of the metal layer, the amount of exposure of the resist can also be controlled to produce the desired shapes in the resist. For even more complex mandrels the resist can be exposed from both sides using self-aligned photomasks.

Integrated structure vacuum tube

NASA Technical Reports Server (NTRS)

Dimeff, J.; Kerwin, W. J. (Inventor)

1976-01-01

High efficiency, multi-dimensional thin film vacuum tubes suitable for use in high temperature, high radiation environments are described. The tubes are fabricated by placing thin film electrode members in selected arrays on facing interior wall surfaces of an alumina substrate envelope. Cathode members are formed using thin films of triple carbonate. The photoresist used in photolithography aids in activation of the cathodes by carbonizing and reacting with the reduced carbonates when heated in vacuum during forming. The finely powdered triple carbonate is mixed with the photoresist used to delineate the cathode locations in the conventional solid state photolithographic manner. Anode and grid members are formed using thin films of refractory metal. Electron flow in the tubes is between grid elements from cathode to anode as in a conventional three-dimensional tube.

Fabricating microfluidic valve master molds in SU-8 photoresist

NASA Astrophysics Data System (ADS)

Dy, Aaron J.; Cosmanescu, Alin; Sluka, James; Glazier, James A.; Stupack, Dwayne; Amarie, Dragos

2014-05-01

Multilayer soft lithography has become a powerful tool in analytical chemistry, biochemistry, material and life sciences, and medical research. Complex fluidic micro-circuits require reliable components that integrate easily into microchips. We introduce two novel approaches to master mold fabrication for constructing in-line micro-valves using SU-8. Our fabrication techniques enable robust and versatile integration of many lab-on-a-chip functions including filters, mixers, pumps, stream focusing and cell-culture chambers, with in-line valves. SU-8 created more robust valve master molds than the conventional positive photoresists used in multilayer soft lithography, but maintained the advantages of biocompatibility and rapid prototyping. As an example, we used valve master molds made of SU-8 to fabricate PDMS chips capable of precisely controlling beads or cells in solution.

Method for etching thin films of niboium and niobium-containing compounds for preparing superconductive circuits

DOEpatents

Kampwirth, R.T.; Schuller, I.K.; Falco, C.M.

1979-11-23

An improved method of preparing thin film superconducting electrical circuits of niobium or niobium compounds is provided in which a thin film of the niobium or niobium compound is applied to a nonconductive substrate and covered with a layer of photosensitive material. The sensitive material is in turn covered with a circuit pattern exposed and developed to form a mask of the circuit in photoresistive material on the surface of the film. The unmasked excess niobium film is removed by contacting the substrate with an aqueous etching solution of nitric acid, sulfuric acid, and hydrogen fluoride, which will rapidly etch the niobium compound without undercutting the photoresist. A modification of the etching solution will permit thin films to be lifted from the substrate without further etching.

Dichromated polyvinyl alcohol (DC-PVA) wet processed for high index modulation

NASA Astrophysics Data System (ADS)

Rallison, Richard D.

1997-04-01

PVA films have been used as mold releases, strippable coatings, binders for photopolymers and when sensitized with metals and/or dyes they have been used as photoresists, volume HOEs, multiplexed holographic optical memory and real time non destructive holographic testing. The list goes on and includes Slime and birth control. In holography, DC-PVA is a real time photoanisotropic recording material useful for phase conjugation experiments and also a stable long term storage medium needing no processing other than heat. Now we add the capability of greatly increasing the versatility of PVA by boosting the index modulation by almost two orders of magnitude. We can add broadband display and HOE applications that were not possible before. Simple two or three step liquid processing is all that is required to make the index modulation grow.

Vectorization and parallelization of the finite strip method for dynamic Mindlin plate problems

NASA Technical Reports Server (NTRS)

Chen, Hsin-Chu; He, Ai-Fang

1993-01-01

The finite strip method is a semi-analytical finite element process which allows for a discrete analysis of certain types of physical problems by discretizing the domain of the problem into finite strips. This method decomposes a single large problem into m smaller independent subproblems when m harmonic functions are employed, thus yielding natural parallelism at a very high level. In this paper we address vectorization and parallelization strategies for the dynamic analysis of simply-supported Mindlin plate bending problems and show how to prevent potential conflicts in memory access during the assemblage process. The vector and parallel implementations of this method and the performance results of a test problem under scalar, vector, and vector-concurrent execution modes on the Alliant FX/80 are also presented.

A 3D CZT high resolution detector for x- and gamma-ray astronomy

NASA Astrophysics Data System (ADS)

Kuvvetli, I.; Budtz-Jørgensen, C.; Zappettini, A.; Zambelli, N.; Benassi, G.; Kalemci, E.; Caroli, E.; Stephen, J. B.; Auricchio, N.

2014-07-01

At DTU Space we have developed a high resolution three dimensional (3D) position sensitive CZT detector for high energy astronomy. The design of the 3D CZT detector is based on the CZT Drift Strip detector principle. The position determination perpendicular to the anode strips is performed using a novel interpolating technique based on the drift strip signals. The position determination in the detector depth direction, is made using the DOI technique based the detector cathode and anode signals. The position determination along the anode strips is made with the help of 10 cathode strips orthogonal to the anode strips. The position resolutions are at low energies dominated by the electronic noise and improve therefore with increased signal to noise ratio as the energy increases. The achievable position resolution at higher energies will however be dominated by the extended spatial distribution of the photon produced ionization charge. The main sources of noise contribution of the drift signals are the leakage current between the strips and the strip capacitance. For the leakage current, we used a metallization process that reduces the leakage current by means of a high resistive thin layer between the drift strip electrodes and CZT detector material. This method was applied to all the proto type detectors and was a very effective method to reduce the surface leakage current between the strips. The proto type detector was recently investigated at the European Synchrotron Radiation Facility, Grenoble which provided a fine 50 × 50 μm2 collimated X-ray beam covering an energy band up to 600 keV. The Beam positions are resolved very well with a ~ 0.2 mm position resolution (FWHM ) at 400 keV in all directions.

Performance improvements of binary diffractive structures via optimization of the photolithography and dry etch processes

NASA Astrophysics Data System (ADS)

Welch, Kevin; Leonard, Jerry; Jones, Richard D.

2010-08-01

Increasingly stringent requirements on the performance of diffractive optical elements (DOEs) used in wafer scanner illumination systems are driving continuous improvements in their associated manufacturing processes. Specifically, these processes are designed to improve the output pattern uniformity of off-axis illumination systems to minimize degradation in the ultimate imaging performance of a lithographic tool. In this paper, we discuss performance improvements in both photolithographic patterning and RIE etching of fused silica diffractive optical structures. In summary, optimized photolithographic processes were developed to increase critical dimension uniformity and featuresize linearity across the substrate. The photoresist film thickness was also optimized for integration with an improved etch process. This etch process was itself optimized for pattern transfer fidelity, sidewall profile (wall angle, trench bottom flatness), and across-wafer etch depth uniformity. Improvements observed with these processes on idealized test structures (for ease of analysis) led to their implementation in product flows, with comparable increases in performance and yield on customer designs.

Composite lamination method

NASA Technical Reports Server (NTRS)

Dickerson, G. E. (Inventor)

1977-01-01

A process was developed for preparing relatively thick composite laminate structure wherein thin layers of prepreg tapes are assembled, these thin layers are cut into strips that are partially cured, and stacked into the desired thickness with uncured prepreg disposed between each layer of strips. The formed laminate is finally cured and thereafter machined to the desired final dimensions.

A carbon dioxide stripping model for mammalian cell culture in manufacturing scale bioreactors.

PubMed

Xing, Zizhuo; Lewis, Amanda M; Borys, Michael C; Li, Zheng Jian

2017-06-01

Control of carbon dioxide within the optimum range is important in mammalian bioprocesses at the manufacturing scale in order to ensure robust cell growth, high protein yields, and consistent quality attributes. The majority of bioprocess development work is done in laboratory bioreactors, in which carbon dioxide levels are more easily controlled. Some challenges in carbon dioxide control can present themselves when cell culture processes are scaled up, because carbon dioxide accumulation is a common feature due to longer gas-residence time of mammalian cell culture in large scale bioreactors. A carbon dioxide stripping model can be used to better understand and optimize parameters that are critical to cell culture processes at the manufacturing scale. The prevailing carbon dioxide stripping models in literature depend on mass transfer coefficients and were applicable to cell culture processes with low cell density or at stationary/cell death phase. However, it was reported that gas bubbles are saturated with carbon dioxide before leaving the culture, which makes carbon dioxide stripping no longer depend on a mass transfer coefficient in the new generation cell culture processes characterized by longer exponential growth phase, higher peak viable cell densities, and higher specific production rate. Here, we present a new carbon dioxide stripping model for manufacturing scale bioreactors, which is independent of carbon dioxide mass transfer coefficient, but takes into account the gas-residence time and gas CO 2 saturation time. The model was verified by CHO cell culture processes with different peak viable cell densities (7 to 12 × 10 6  cells mL -1 ) for two products in 5,000-L and 25,000-L bioreactors. The model was also applied to a next generation cell culture process to optimize cell culture conditions and reduce carbon dioxide levels at manufacturing scale. The model provides a useful tool to understand and better control cell culture carbon dioxide profiles for process development, scale up, and characterization. Biotechnol. Bioeng. 2017;114: 1184-1194. © 2016 Wiley Periodicals, Inc. © 2016 Wiley Periodicals, Inc.

Biodegradation of paint stripper solvents in a modified gas lift loop bioreactor.

PubMed

Vanderberg-Twary, L; Steenhoudt, K; Travis, B J; Hanners, J L; Foreman, T M; Brainard, J R

1997-07-05

Paint stripping wastes generated during the decontamination and decommissioning of former nuclear facilities contain paint stripping organics (dichloromethane, 2-propanol, and methanol) and bulk materials containing paint pigments. It is desirable to degrade the organic residues as part of an integrated chemical-biological treatment system. We have developed a modified gas lift loop bioreactor employing a defined consortium of Rhodococcus rhodochrous strain OFS and Hyphomicrobium sp. DM-2 that degrades paint stripper organics. Mass transfer coefficients and kinetic constants for biodegradation in the system were determined. It was found that transfer of organic substrates from surrogate waste into the air and further into the liquid medium in the bioreactor were rapid processes, occurring within minutes. Monod kinetics was employed to model the biodegradation of paint stripping organics. Analysis of the bioreactor process was accomplished with BIOLAB, a mathematical code that simulates coupled mass transfer and biodegradation processes. This code was used to fit experimental data to Monod kinetics and to determine kinetic parameters. The BIOLAB code was also employed to compare activities in the bioreactor of individual microbial cultures to the activities of combined cultures in the bioreactor. This code is of benefit for further optimization and scale-up of the bioreactor for treatment of paint stripping and other volatile organic wastes in bulk materials.

The preprocessed connectomes project repository of manually corrected skull-stripped T1-weighted anatomical MRI data.

PubMed

Puccio, Benjamin; Pooley, James P; Pellman, John S; Taverna, Elise C; Craddock, R Cameron

2016-10-25

Skull-stripping is the procedure of removing non-brain tissue from anatomical MRI data. This procedure can be useful for calculating brain volume and for improving the quality of other image processing steps. Developing new skull-stripping algorithms and evaluating their performance requires gold standard data from a variety of different scanners and acquisition methods. We complement existing repositories with manually corrected brain masks for 125 T1-weighted anatomical scans from the Nathan Kline Institute Enhanced Rockland Sample Neurofeedback Study. Skull-stripped images were obtained using a semi-automated procedure that involved skull-stripping the data using the brain extraction based on nonlocal segmentation technique (BEaST) software, and manually correcting the worst results. Corrected brain masks were added into the BEaST library and the procedure was repeated until acceptable brain masks were available for all images. In total, 85 of the skull-stripped images were hand-edited and 40 were deemed to not need editing. The results are brain masks for the 125 images along with a BEaST library for automatically skull-stripping other data. Skull-stripped anatomical images from the Neurofeedback sample are available for download from the Preprocessed Connectomes Project. The resulting brain masks can be used by researchers to improve preprocessing of the Neurofeedback data, as training and testing data for developing new skull-stripping algorithms, and for evaluating the impact on other aspects of MRI preprocessing. We have illustrated the utility of these data as a reference for comparing various automatic methods and evaluated the performance of the newly created library on independent data.

(NH4)2SO4 recovery from liquid side streams.

PubMed

Boehler, Marc Anton; Heisele, Alexander; Seyfried, Alexander; Grömping, Markus; Siegrist, Hansruedi

2015-05-01

Two methods of recovering nitrogen from liquid side streams are presented in this paper. The first method was demonstrated at an ammonia stripping plant treating 5-7 m(3)/h sludge water at the wastewater treatment plant (WWTP) Kloten-Opfikon (CH). In addition to the usual stripping and scrubbing columns, a third column had been added in order strip CO₂, thus reducing the NaOH-demand of the subsequent ammonia stripping. At first, just the stripping plant was put into operation and optimized without any pre-treatment of the supernatant. Next, the CO₂-stripper column was activated and optimized by gas measurements to minimize free ammonia losses, heat losses, and energy consumption. Key operational aspects of the plant were evaluated. Finally, up to 1.4 m(3)/h source-separated urine was successfully fed into the stripping facility. The second ammonia removal method using hydrophobic hollow fiber membranes was tested in two small pilot systems by different manufacturers in 2012 and 2013 at WWTP Neugut. In this technology, free ammonia gas in the sludge liquid diffuses at pH >9.3 from the sludge liquid through the air-filled pores of the microporous hydrophobic membrane into concentrated sulfuric acid flowing through the hollow fibers, forming ammonium sulfate. The small pore size and the hydrophobic nature of the membrane prevent the liquid phase from entering into the pores due to the surface tension effect. Practical experience regarding operational parameters like wastewater flow rate, pH, temperature, ammonia concentration, fouling and precipitations processes, optimal flow schemes, and process configurations was collected.

Low surface energy polymeric release coating for improved contact print lithography

NASA Astrophysics Data System (ADS)

Mancini, David P.; Resnick, Douglas J.; Gehoski, Kathleen A.; Popovich, Laura L.; Chang, Daniel

2002-03-01

Contact printing has been used for decades in many various lithography applications in the microelectronic industry. While vacuum contact printing processes offer sub-micron resolution and high throughput, they often suffer from some important drawbacks. One of the most common problems is degradation in both resolution and defect density which occurs when the same mask si used for multiple exposures without frequent mask cleans. This is largely due to the relatively high surface energy of both quartz and chrome and the tendency of most photoresists to adhere to these surfaces. As a result, when a mask and wafer are pressed into intimate contact, resist will tend to stick to the mask creating a defect on the wafer, effectively propagating defects to subsequent wafers. In this study, DuPont Teflon AF 1601S is used as a photomask coating and evaluated for its ability to act as a release agent and reduce defects while maintaining resolution for multiple exposures. Teflon AF is an amorphous, transparent, low surface energy, polymeric material that can be spin coated into a thin conformal film. Tests have shown that when using an uncoated mask in vacuum contact, resolution of 0.75 micrometers dense lines is severely degraded after less than 10 consecutive exposures. However, when the mask is coated, 0.75 micrometers dense lines were successfully resolved using vacuum contact for over 200 exposures without cleaning. In addition, it has been demonstrated that Teflon AF coatings impart to a mask a self-cleaning capability, since particles tend to stick to the photoresist rather than the mask. A coated mask, which was purposefully contaminated with particulates, resolved 0.75 micrometers dense lines on all but the first wafer of a series of 25 consecutive exposures. The patented mask releases layer process has successfully been demonstrated with a positive novolak resist. Additional data which describes the system chemistry, dilution and coating process, and film morphology are also presented.

NASADEM Initial Production Processing Results: Shuttle Radar Topography Mission (SRTM) Reprocessing with Improvements

NASA Astrophysics Data System (ADS)

Buckley, S.; Agram, P. S.; Belz, J. E.; Crippen, R. E.; Gurrola, E. M.; Hensley, S.; Kobrick, M.; Lavalle, M.; Martin, J. M.; Neumann, M.; Nguyen, Q.; Rosen, P. A.; Shimada, J.; Simard, M.; Tung, W.

2016-12-01

NASADEM is a significant modernization of SRTM digital elevation model (DEM) data supported by the NASA MEaSUREs program. We are reprocessing the raw radar signal data using improved algorithms and incorporating ICESat and DEM data unavailable during the original processing. The NASADEM products will be freely-available through the Land Processes Distributed Active Archive Center (LPDAAC) at one-arcsecond spacing and delivered by continent: North America, South America, Australia, Eurasia, Africa, and Island Groups. We are in the production phase of the project. This involves radar interferometry (InSAR) processing on thousands of radar datatakes. New phase unwrapping and height ripple error correction (HREC) procedures are applied to the data. The resulting strip DEMs and ancillary information are passed to a back-end processor to create DEM mosaics and new geocoded single-swath products. Manual data quality assessment (QA) and fixes are performed at several steps in the processing chain. Post-production DEM void-filling is described in a companion AGU Fall Meeting presentation. The team completed the InSAR processing for all continents and the manual QA of the strip DEMs for more than half the world. North America strip DEM void areas are reduced by more than 50%. The ICESat data is used for height ripple error correction and as control for continent-scale adjustment of the strip DEMs. These ripples are due to uncompensated mast motion most pronounced after Shuttle roll angle adjustment maneuvers. After an initial assessment of the NASADEM production processing for the Americas, we further refined the selection of ICESat data for control by excluded data over glaciers, snow cover, forest clear cuts, and sloped areas. The HREC algorithm reduces the North America ICESat-SRTM bias from 80 cm to 3 cm and the RMS from 5m to 4m.

Process and apparatus for solvent extraction of oil from oil-containing diatomite ore

DOE Office of Scientific and Technical Information (OSTI.GOV)

Karnofsky, G. B.

1980-12-16

A process for solvent extraction of oil from oil bearing diatomite ore and an apparatus for use therewith, wherein the ore is extracted by countercurrent decantation with a hydrocarbon solvent, solvent is recovered from the extract by multiple effect evaporation followed by stripping, and the spent diatomite is contacted with water to displace a major portion of the solvent therefrom, and solvent is recovered from the aqueous slurry of the spent diatomite by stripping with steam at superatmospheric pressure.

Development of a direct patterning method for functional oxide thin films using ultraviolet irradiation and hybrid-cluster gels and its application to thin-film transistor fabrication

NASA Astrophysics Data System (ADS)

Yoshimoto, Yuuki; Li, Jinwang; Shimoda, Tatsuya

2018-04-01

A gel state exists in the solution-solid conversion process. We found that solidification can be promoted by irradiating the gel with ultraviolet (UV) light. In this study, a patterning method without using a vacuum system or employing photoresist materials has been proposed wherein solidification was applied to a gel by UV irradiation. Indium oxide gel, indium gallium oxide gel, lanthanum zirconium oxide gel, and lanthanum ruthenium oxide gels were successfully patterned by using our technique. Moreover, an oxide thin-film transistor was fabricated by our novel patterning method and was successfully operated.

Micromachined microwave signal control device and method for making same

DOEpatents

Forman, Michael A [San Francisco, CA

2008-09-02

A method for fabricating a signal controller, e.g., a filter or a switch, for a coplanar waveguide during the LIGA fabrication process of the waveguide. Both patterns for the waveguide and patterns for the signal controllers are created on a mask. Radiation travels through the mask and reaches a photoresist layer on a substrate. The irradiated portions are removed and channels are formed on the substrate. A metal is filled into the channels to form the conductors of the waveguide and the signal controllers. Micromachined quasi-lumped elements are used alone or together as filters. The switch includes a comb drive, a spring, a metal plunger, and anchors.

Anisotropic Etching Using Reactive Cluster Beams

NASA Astrophysics Data System (ADS)

Koike, Kunihiko; Yoshino, Yu; Senoo, Takehiko; Seki, Toshio; Ninomiya, Satoshi; Aoki, Takaaki; Matsuo, Jiro

2010-12-01

The characteristics of Si etching using nonionic cluster beams with highly reactive chlorine-trifluoride (ClF3) gas were examined. An etching rate of 40 µm/min or higher was obtained even at room temperature when a ClF3 molecular cluster was formed and irradiated on a single-crystal Si substrate in high vacuum. The etching selectivity of Si with respect to a photoresist and SiO2 was at least 1:1000. We also succeeded in highly anisotropic etching with an aspect ratio of 10 or higher. Moreover, this etching method has a great advantage of low damage, compared with the conventional plasma process.

Method for making a micromachined microwave signal control device

DOEpatents

Forman, Michael A [Mountain House, CA

2011-02-15

A method for fabricating a signal controller, e.g., a filter or a switch, for a coplanar waveguide during the LIGA fabrication process of the waveguide. Both patterns for the waveguide and patterns for the signal controllers are created on a mask. Radiation travels through the mask and reaches a photoresist layer on a substrate. The irradiated portions are removed and channels are formed on the substrate. A metal is filled into the channels to form the conductors of the waveguide and the signal controllers. Micromachined quasi-lumped elements are used alone or together as filters. The switch includes a comb drive, a spring, a metal plunger, and anchors.

PRELIMINARY EVALUATION OF DWPF IMPACTS OF BORIC ACID USE IN CESIUM STRIP FOR SWPF AND MCU

DOE Office of Scientific and Technical Information (OSTI.GOV)

Stone, M.

2010-09-28

A new solvent system is being evaluated for use in the Modular Caustic-Side Solvent Extraction Unit (MCU) and in the Salt Waste Processing Facility (SWPF). The new system includes the option to replace the current dilute nitric acid strip solution with boric acid. To support this effort, the impact of using 0.01M, 0.1M, 0.25M and 0.5M boric acid in place of 0.001M nitric acid was evaluated for impacts on the DWPF facility. The evaluation only covered the impacts of boric acid in the strip effluent and does not address the other changes in solvents (i.e., the new extractant, called MaxCalix,more » or the new suppressor, guanidine). Boric acid additions may lead to increased hydrogen generation during the SRAT and SME cycles as well as change the rheological properties of the feed. The boron in the strip effluent will impact glass composition and could require each SME batch to be trimmed with boric acid to account for any changes in the boron from strip effluent additions. Addition of boron with the strip effluent will require changes in the frit composition and could lead to changes in melt behavior. The severity of the impacts from the boric acid additions is dependent on the amount of boric acid added by the strip effluent. The use of 0.1M or higher concentrations of boric acid in the strip effluent was found to significantly impact DWPF operations while the impact of 0.01M boric acid is expected to be relatively minor. Experimental testing is required to resolve the issues identified during the preliminary evaluation. The issues to be addressed by the testing are: (1) Impact on SRAT acid addition and hydrogen generation; (2) Impact on melter feed rheology; (3) Impact on glass composition control; (4) Impact on frit production; and (5) Impact on melter offgas. A new solvent system is being evaluated for use in the Modular Caustic-Side Solvent Extraction Unit (MCU) and in the Salt Waste Processing Facility (SWPF). The new system includes the option to replace the current dilute nitric acid strip solution with boric acid. To support this effort, the impact of using 0.01M, 0.1M, 0.25M and 0.5M boric acid in place of 0.001M nitric acid was evaluated for impacts on the DWPF facility. The evaluation only covered the impacts of boric acid in the strip effluent and does not address the other changes in solvents (i.e., the new extractant, called MaxCalix, or the new suppressor, guanidine). Experimental testing with the improved solvent is required to determine the impact of any changes in the entrained solvent on DWPF processing.« less

Processing treatments for mitigating acrylamide formation in sweetpotato French fries.

PubMed

Truong, Van-Den; Pascua, Yvette T; Reynolds, Rong; Thompson, Roger L; Palazoğlu, T Koray; Mogol, Burce Atac; Gökmen, Vural

2014-01-08

Acrylamide formation in sweetpotato French fries (SPFF) is likely a potential health concern as there is an increasing demand for good-quality fries from carotene-rich sweetpotatoes (SP). This is the first report on acrylamide formation in SPFF as affected by processing methods. Acrylamide levels in SPFF from untreated SP strips fried at 165 °C for 2, 3, and 5 min were 124.9, 255.5, and 452.0 ng/g fresh weight, which were reduced by about 7 times to 16.3, 36.9, and 58.3 ng/g, respectively, when the strips were subjected to processing that included water blanching and soaking in 0.5% sodium acid pyrophosphate before frying. An additional step of strip soaking in 0.4% calcium chloride solution before par-frying increased the calcium content from 0.2 to 0.8 mg/g and decreased the acrylamide levels to 6.3, 17.6, and 35.4 ng/g, respectively. SPFF with acrylamide level of <100 ng/g or several times lower than that of white potato French fries can be obtained by integrating processing treatments commonly used in the food industry.

Manufacture of thin-walled clad tubes by pressure welding of roll bonded sheets

NASA Astrophysics Data System (ADS)

Schmidt, Hans Christian; Grydin, Olexandr; Stolbchenko, Mykhailo; Homberg, Werner; Schaper, Mirko

2017-10-01

Clad tubes are commonly manufactured by fusion welding of roll bonded metal sheets or, mechanically, by hydroforming. In this work, a new approach towards the manufacture of thin-walled tubes with an outer diameter to wall thickness ratio of about 12 is investigated, involving the pressure welding of hot roll bonded aluminium-steel strips. By preparing non-welded edges during the roll bonding process, the strips can be zip-folded and (cold) pressure welded together. This process routine could be used to manufacture clad tubes in a continuous process. In order to investigate the process, sample tube sections with a wall thickness of 2.1 mm were manufactured by U-and O-bending from hot roll bonded aluminium-stainless steel strips. The forming and welding were carried out in a temperature range between RT and 400°C. It was found that, with the given geometry, a pressure weld is established at temperatures starting above 100°C. The tensile tests yield a maximum bond strength at 340°C. Micrograph images show a consistent weld of the aluminium layer over the whole tube section.

The Influence of Vanadium Microalloying on the Production of Thin Slab Casting and Direct Rolled Steel Strip

NASA Astrophysics Data System (ADS)

Li, Yu; Milbourn, David

Vanadium microalloying is highly effective in high strength strip steels produced by thin slab casting and direct rolled process. Because of the high solubility of V(C,N) in austenite, vanadium is likely to remain in solution during casting, equalisation and rolling. Vanadium microalloyed steels have better hot ductility and are less prone to transverse cracking than niobium containing steels. Despite a coarse as-cast austenite grain size before rolling, significant grain refinement can be achieved in vanadium microalloyed steels by repeated recrystallization during rolling, resulting in a fine uniform ferrite microstructure in final strip. Almost all vanadium present in microalloyed steels is available to precipitate in ferrite as very fine particles, contributing to precipitation strengthening. Vanadium microalloyed steels show less sensitivity to rolling process variables and exhibit excellent combination of strength and toughness.

Gold-coated polydimethylsiloxane microwells for high-throughput electrochemiluminescence analysis of intracellular glucose at single cells.

PubMed

Xia, Juan; Zhou, Junyu; Zhang, Ronggui; Jiang, Dechen; Jiang, Depeng

2018-06-04

In this communication, a gold-coated polydimethylsiloxane (PDMS) chip with cell-sized microwells was prepared through a stamping and spraying process that was applied directly for high-throughput electrochemiluminescence (ECL) analysis of intracellular glucose at single cells. As compared with the previous multiple-step fabrication of photoresist-based microwells on the electrode, the preparation process is simple and offers fresh electrode surface for higher luminescence intensity. More luminescence intensity was recorded from cell-retained microwells than that at the planar region among the microwells that was correlated with the content of intracellular glucose. The successful monitoring of intracellular glucose at single cells using this PDMS chip will provide an alternative strategy for high-throughput single-cell analysis. Graphical abstract ᅟ.

Practical holography III; Proceedings of the Meeting, Los Angeles, CA, Jan. 17, 18, 1989

NASA Astrophysics Data System (ADS)

Benton, Stephen A.

Various papers on practical holography are presented. Individual topics addressed include: design of large format commercial display holograms, design of a one-step full-color holographic recording system, color reflection holography, full color rainbow hologram using a photoresist plate, secondary effects in processing holograms, archival properties of holograms, survey of properties of volume holographic materials, image stability of DMP-128 holograms, activation monitor for DMP-128, microwave drying effects on dichromated gelatin holograms, sensitization process of dichromated gelatin, holographic optics for vision systems, holographic fingerprint sensor, cross-talk and cross-coupling in multiplexed holographic gratings, compact illuminators for transmission holograms, solar holoconcentrators in dichromated grains, three-dimensional display of scientific data, holographic liquid crystal displays, in situ swelling for hologaphic color control.

Dynamic underground stripping: steam and electric heating for in situ decontamination of soils and groundwater

DOEpatents

Daily, W.D.; Ramirez, A.L.; Newmark, R.L.; Udell, K.; Buetnner, H.M.; Aines, R.D.

1995-09-12

A dynamic underground stripping process removes localized underground volatile organic compounds from heterogeneous soils and rock in a relatively short time. This method uses steam injection and electrical resistance heating to heat the contaminated underground area to increase the vapor pressure of the contaminants, thus speeding the process of contaminant removal and making the removal more complete. The injected steam passes through the more permeable sediments, distilling the organic contaminants, which are pumped to the surface. Large electrical currents are also applied to the contaminated area, which heat the impermeable subsurface layers that the steam has not penetrated. The condensed and vaporized contaminants are withdrawn by liquid pumping and vacuum extraction. The steam injection and electrical heating steps are repeated as necessary. Geophysical imaging methods can be used to map the boundary between the hot, dry, contamination-free underground zone and the cool, damp surrounding areas to help monitor the dynamic stripping process. 4 figs.

Dynamic underground stripping: steam and electric heating for in situ decontamination of soils and groundwater

DOEpatents

Daily, William D.; Ramirez, Abelardo L.; Newmark, Robin L.; Udell, Kent; Buetnner, Harley M.; Aines, Roger D.

1995-01-01

A dynamic underground stripping process removes localized underground volatile organic compounds from heterogeneous soils and rock in a relatively short time. This method uses steam injection and electrical resistance heating to heat the contaminated underground area to increase the vapor pressure of the contaminants, thus speeding the process of contaminant removal and making the removal more complete. The injected steam passes through the more permeable sediments, distilling the organic contaminants, which are pumped to the surface. Large electrical currents are also applied to the contaminated area, which heat the impermeable subsurface layers that the steam has not penetrated. The condensed and vaporized contaminants are withdrawn by liquid pumping and vacuum extraction. The steam injection and electrical heating steps are repeated as necessary. Geophysical imaging methods can be used to map the boundary between the hot, dry, contamination-free underground zone and the cool, damp surrounding areas to help monitor the dynamic stripping process.

Six Sigma Approach to Improve Stripping Quality of Automotive Electronics Component – a case study

NASA Astrophysics Data System (ADS)

Razali, Noraini Mohd; Murni Mohamad Kadri, Siti; Con Ee, Toh

2018-03-01

Lacking of problem solving skill techniques and cooperation between support groups are the two obstacles that always been faced in actual production line. Inadequate detail analysis and inappropriate technique in solving the problem may cause the repeating issues which may give impact to the organization performance. This study utilizes a well-structured six sigma DMAIC with combination of other problem solving tools to solve product quality problem in manufacturing of automotive electronics component. The study is concentrated at the stripping process, a critical process steps with highest rejection rate that contribute to the scrap and rework performance. The detail analysis is conducted in the analysis phase to identify the actual root cause of the problem. Then several improvement activities are implemented and the results show that the rejection rate due to stripping defect decrease tremendously and the process capability index improved from 0.75 to 1.67. This results prove that the six sigma approach used to tackle the quality problem is substantially effective.

Application of the Finite Element Method to Reveal the Causes of Loss of Planeness of Hot-Rolled Steel Sheets during Laser Cutting

NASA Astrophysics Data System (ADS)

Garber, E. A.; Bolobanova, N. L.; Trusov, K. A.

2018-01-01

A finite element technique is developed to simulate the stresses and the strains during strip flattening to reveal the causes of the cutting-assisted loss of planeness of hot-rolled steel sheets processed in roller levelers. The loss of planeness is found to be caused by a nonuniform distribution of the flattening-induced longitudinal tensile stresses over the strip thickness and width. The application of tensile forces to a strip in a roller leveler decreases this nonuniformity and prevents loss of planeness in cutting.

Curvature Control of Silicon Microlens for THz Dielectric Antenna

NASA Technical Reports Server (NTRS)

Lee, Choonsup; Chattopadhyay, Goutam; Cooper, Ken; Mehdi, Imran

2012-01-01

We have controlled the curvature of silicon microlens by changing the amount of photoresist in order to microfabricate hemispherical silicon microlens which can improve the directivity and reduce substrate mode losses.

Improving lumber yield using a dual system

Treesearch

R. Edward Thomas; Omar Espinoza; Urs Buehlmann

2015-01-01

Rough mills embody the process of cutting up kiln-dried lumber to components used by discrete wood products manufacturers to manufacture products like furniture, kitchen cabinets, flooring, or other items. Rough mills traditionally have either ripped the lumber first (e.g., the lumber is first cut into strips lengthwise) then cut the strips to the required part lengths...

Capillary-Driven Microfluidic Chips for Miniaturized Immunoassays: Patterning Capture Antibodies Using Microcontact Printing and Dry-Film Resists.

PubMed

Temiz, Yuksel; Lovchik, Robert D; Delamarche, Emmanuel

2017-01-01

The miniaturization of immunoassays using microfluidic devices is attractive for many applications, but an important challenge remains the patterning of capture antibodies (cAbs) on the surface of microfluidic structures. Here, we describe how to pattern cAbs on planar poly(dimethylsiloxane) (PDMS) stamps and how to microcontact print the cAbs on a dry-film resist (DFR). DFRs are new types of photoresists having excellent chemical resistance and good mechanical, adhesive, and optical properties. Instead of being liquid photoresists, DFRs are thin layers that are easy to handle, cut, photo-pattern, and laminate over surfaces. We show how to perform a simple fluorescence immunoassay using anti-biotin cAbs patterned on a 50-μm-thick DF-1050 DFR, Atto 647N-biotin analytes, and capillary-driven chips fabricated in silicon.

FABRICATION OF A RETINAL PROSTHETIC TEST DEVICE USING ELECTRODEPOSITED SILICON OVER POLYPYRROLE PATTERNED WITH SU-8 PHOTORESIST

PubMed Central

Miller, Eric; Ellis, Daniel; Charles, Duran; McKenzie, Jason

2016-01-01

A materials fabrication study of a photodiode array for possible application of retina prosthesis was undertaken. A test device was fabricated using a glassy carbon electrode patterned with SU-8 photoresist. In the openings, p-type polypyrrole was first electrodeposited using 1-butyl-1-methylpyridinium bis(trifluoromethylsulfonyl)imide ionic liquid. The polypyrrole was self-doped with imide ion at ~1.5 mole %, was verified as p-type, and had a resistivity of ~20 Ωcm. N-type Silicon was then electrodeposited over this layer using silicon tetrachloride / phosphorus trichloride in acetonitrile and passivated in a second electrodeposition using trimethylchlorosilane. Electron microscopy revealed the successful electrodeposition of silicon over patterned polypyrrole. Rudimentary photodiode behavior was observed. The passivation improved but did not completely protect the electrodeposited silicon from oxidation by air. PMID:27616940

Method of constructing dished ion thruster grids to provide hole array spacing compensation

NASA Technical Reports Server (NTRS)

Banks, B. A. (Inventor)

1976-01-01

The center-to-center spacings of a photoresist pattern for an array of holes applied to a thin metal sheet are increased by uniformly stretching the thin metal sheet in all directions along the plane of the sheet. The uniform stretching is provided by securely clamping the periphery of the sheet and applying an annular force against the face of the sheet, within the periphery of the sheet and around the photoresist pattern. The technique is used in the construction of ion thruster grid units where the outer or downstream grid is subjected to uniform stretching prior to convex molding. The technique provides alignment of the holes of grid pairs so as to direct the ion beamlets in a direction parallel to the axis of the grid unit and thereby provide optimization of the available thrust.

Huge photoresistance in transparent and conductive indium titanium oxide films prepared by electron beam-physical vapor deposition.

PubMed

Martínez-Morillas, Rocío; Ramírez, Rafael; Sánchez-Marcos, Jorge; Fonda, Emiliano; de Andrés, Alicia; Prieto, Carlos

2014-02-12

Transparent and conductive indium titanium oxide (ITiO) films have been obtained by electron beam physical vapour deposition with Ti content from 5 at % up to 28 at %. X-ray absorption spectroscopy techniques have been used to identify the local environment of Ti ions. Even at the lowest concentrations Ti is not incorporated into the In2O3 structure but forms clusters of a Ti-In mixed oxide that present a distorted rutile TiO2 short-range order. The optical transmittance of the annealed samples reaches 95 % and no significant variation of the gap energy (around 3.7 eV) is observed with Ti content. The electronic conductivity under light irradiation is studied evidencing a huge photo-resistance in the samples with Ti content above 22 at % reaching more than two orders of magnitude for the 26 at % Ti under illumination with few μW/cm(2) at 365 nm. Hall and conductivity results are analyzed using a model that takes into account both electron and hole carriers as well as the conductivity enhancement by carrier photogeneration. The electron carrier density decreases with Ti content while its mobility increases up to values of 1000 cm(2)/(V s). Oxygen annealed ITiO films obtained by this technique with Ti content below 10 at % have properties adequate as transparent semiconductors and those with Ti content higher than 22 at % have exceptional photoresistive properties relevant for numerous applications.

A demonstration of ERTS-1 analog and digital techniques applied to strip mining in Maryland and West Virginia

NASA Technical Reports Server (NTRS)

Anderson, A. T.; Schubert, J.

1974-01-01

The largest contour strip mining operations in western Maryland and West Virginia are located within the Georges Creek and the Upper Potomac Basins. These two coal basins lie within the Georges Creek (Wellersburg) syncline. The disturbed strip mine areas were delineated with the surrounding geological and vegetation features using ERTS-1 data in both analog (imagery) and digital form. The two digital systems used were: (1) the ERTS-Analysis system, a point-by-point digital analysis of spectral signatures based on known spectral values, and (2) the LARS Automatic Data Processing System. The digital techniques being developed will later be incorporated into a data base for land use planning. These two systems aided in efforts to determine the extent and state of strip mining in this region. Aircraft data, ground verification information, and geological field studies also aided in the application of ERTS-1 imagery to perform an integrated analysis that assessed the adverse effects of strip mining. The results indicated that ERTS can both monitor and map the extent of strip mining to determine immediately the acreage affected and indicate where future reclamation and revegetation may be necessary.

Optimizing the Distribution of Tie Points for the Bundle Adjustment of HRSC Image Mosaics

NASA Astrophysics Data System (ADS)

Bostelmann, J.; Breitkopf, U.; Heipke, C.

2017-07-01

For a systematic mapping of the Martian surface, the Mars Express orbiter is equipped with a multi-line scanner: Since the beginning of 2004 the High Resolution Stereo Camera (HRSC) regularly acquires long image strips. By now more than 4,000 strips covering nearly the whole planet are available. Due to the nine channels, each with different viewing direction, and partly with different optical filters, each strip provides 3D and color information and allows the generation of digital terrain models (DTMs) and orthophotos. To map larger regions, neighboring HRSC strips can be combined to build DTM and orthophoto mosaics. The global mapping scheme Mars Chart 30 is used to define the extent of these mosaics. In order to avoid unreasonably large data volumes, each MC-30 tile is divided into two parts, combining about 90 strips each. To ensure a seamless fit of these strips, several radiometric and geometric corrections are applied in the photogrammetric process. A simultaneous bundle adjustment of all strips as a block is carried out to estimate their precise exterior orientation. Because size, position, resolution and image quality of the strips in these blocks are heterogeneous, also the quality and distribution of the tie points vary. In absence of ground control points, heights of a global terrain model are used as reference information, and for this task a regular distribution of these tie points is preferable. Besides, their total number should be limited because of computational reasons. In this paper, we present an algorithm, which optimizes the distribution of tie points under these constraints. A large number of tie points used as input is reduced without affecting the geometric stability of the block by preserving connections between strips. This stability is achieved by using a regular grid in object space and discarding, for each grid cell, points which are redundant for the block adjustment. The set of tie points, filtered by the algorithm, shows a more homogenous distribution and is considerably smaller. Used for the block adjustment, it yields results of equal quality, with significantly shorter computation time. In this work, we present experiments with MC-30 half-tile blocks, which confirm our idea for reaching a stable and faster bundle adjustment. The described method is used for the systematic processing of HRSC data.

Robust skull stripping using multiple MR image contrasts insensitive to pathology.

PubMed

Roy, Snehashis; Butman, John A; Pham, Dzung L

2017-02-01

Automatic skull-stripping or brain extraction of magnetic resonance (MR) images is often a fundamental step in many neuroimage processing pipelines. The accuracy of subsequent image processing relies on the accuracy of the skull-stripping. Although many automated stripping methods have been proposed in the past, it is still an active area of research particularly in the context of brain pathology. Most stripping methods are validated on T 1 -w MR images of normal brains, especially because high resolution T 1 -w sequences are widely acquired and ground truth manual brain mask segmentations are publicly available for normal brains. However, different MR acquisition protocols can provide complementary information about the brain tissues, which can be exploited for better distinction between brain, cerebrospinal fluid, and unwanted tissues such as skull, dura, marrow, or fat. This is especially true in the presence of pathology, where hemorrhages or other types of lesions can have similar intensities as skull in a T 1 -w image. In this paper, we propose a sparse patch based Multi-cONtrast brain STRipping method (MONSTR), 2 where non-local patch information from one or more atlases, which contain multiple MR sequences and reference delineations of brain masks, are combined to generate a target brain mask. We compared MONSTR with four state-of-the-art, publicly available methods: BEaST, SPECTRE, ROBEX, and OptiBET. We evaluated the performance of these methods on 6 datasets consisting of both healthy subjects and patients with various pathologies. Three datasets (ADNI, MRBrainS, NAMIC) are publicly available, consisting of 44 healthy volunteers and 10 patients with schizophrenia. Other three in-house datasets, comprising 87 subjects in total, consisted of patients with mild to severe traumatic brain injury, brain tumors, and various movement disorders. A combination of T 1 -w, T 2 -w were used to skull-strip these datasets. We show significant improvement in stripping over the competing methods on both healthy and pathological brains. We also show that our multi-contrast framework is robust and maintains accurate performance across different types of acquisitions and scanners, even when using normal brains as atlases to strip pathological brains, demonstrating that our algorithm is applicable even when reference segmentations of pathological brains are not available to be used as atlases. Copyright © 2016 Elsevier Inc. All rights reserved.

Joint EPA/NASA/USAF Interagency Depainting Study

NASA Technical Reports Server (NTRS)

Clark-Ingram, M.

2001-01-01

Environmental regulations such as National Emission Standards for Hazardous Air Pollutants (NESHAPs) are drivers for the implementation of environmentally compliant methodologies in the manufacture of aerospace hardware. In 1995, the Environmental Protection Agency (EPA) promulgated the NESHAP for the Aerospace Manufacture and Rework (Aerospace NESHAP) industry. Affected facilities were to be in compliance by September 1998. Several aerospace manufacturing operations are regulated within the Aerospace NESHAP including Depainting operations. The National Aeronautics and Space Administration (NASA), EPA, and United States Air Force (USAF) combined resources to evaluate the performance of nine alternative depainting processes. The seven alternative depainting processes were: (1) Chemical stripping (non-methylene chloride); (2) Carbon Dioxide Blasting; (3) Xenon Flashlamp; (4) Carbon Dioxide Laser Stripping; (5) Plastic Media Blasting; (6) Sodium Bicarbonate Wet Stripping; and (7) Waterjet Blasting and Wheat Starch Blasting. All epoxy primer and polyurethane top coat system was applied to 2024-T3 clad and non-clad aluminum test specimens. Approximately 200 test specimens were evaluated in this study. Each coupon was subjected to three, four, or five complete depainting cycles. This paper discusses the conclusions from the study including the test protocol, test parameters, and achievable strip rates for the alternative depainting processes. Test data includes immersion corrosion testing, sandwich corrosion testing and hydrogen embrittlement testing for the non-methylene chloride chemical strippers. Additionally, the cumulative effect of the alternative depainting processes on the metallurgical integrity of the test substrate is addressed with the results from tensile and fatigue evaluations.

Occurrence of Antimicrobial-Resistant Escherichia coli and Salmonella enterica in the Beef Cattle Production and Processing Continuum

PubMed Central

Agga, Getahun E.; Bosilevac, Joseph M.; Brichta-Harhay, Dayna M.; Shackelford, Steven D.; Wang, Rong; Wheeler, Tommy L.; Arthur, Terrance M.

2014-01-01

Specific concerns have been raised that third-generation cephalosporin-resistant (3GCr) Escherichia coli, trimethoprim-sulfamethoxazole-resistant (COTr) E. coli, 3GCr Salmonella enterica, and nalidixic acid-resistant (NALr) S. enterica may be present in cattle production environments, persist through beef processing, and contaminate final products. The prevalences and concentrations of these organisms were determined in feces and hides (at feedlot and processing plant), pre-evisceration carcasses, and final carcasses from three lots of fed cattle (n = 184). The prevalences and concentrations were further determined for strip loins from 103 of the carcasses. 3GCr Salmonella was detected on 7.6% of hides during processing and was not detected on the final carcasses or strip loins. NALr S. enterica was detected on only one hide. 3GCr E. coli and COTr E. coli were detected on 100.0% of hides during processing. Concentrations of 3GCr E. coli and COTr E. coli on hides were correlated with pre-evisceration carcass contamination. 3GCr E. coli and COTr E. coli were each detected on only 0.5% of final carcasses and were not detected on strip loins. Five hundred and 42 isolates were screened for extraintestinal pathogenic E. coli (ExPEC) virulence-associated markers. Only two COTr E. coli isolates from hides were ExPEC, indicating that fed cattle products are not a significant source of ExPEC causing human urinary tract infections. The very low prevalences of these organisms on final carcasses and their absence on strip loins demonstrate that current sanitary dressing procedures and processing interventions are effective against antimicrobial-resistant bacteria. PMID:25398858

Occurrence of Antimicrobial-Resistant Escherichia coli and Salmonella enterica in the Beef Cattle Production and Processing Continuum.

PubMed

Schmidt, John W; Agga, Getahun E; Bosilevac, Joseph M; Brichta-Harhay, Dayna M; Shackelford, Steven D; Wang, Rong; Wheeler, Tommy L; Arthur, Terrance M

2015-01-01

Specific concerns have been raised that third-generation cephalosporin-resistant (3GC(r)) Escherichia coli, trimethoprim-sulfamethoxazole-resistant (COT(r)) E. coli, 3GC(r) Salmonella enterica, and nalidixic acid-resistant (NAL(r)) S. enterica may be present in cattle production environments, persist through beef processing, and contaminate final products. The prevalences and concentrations of these organisms were determined in feces and hides (at feedlot and processing plant), pre-evisceration carcasses, and final carcasses from three lots of fed cattle (n = 184). The prevalences and concentrations were further determined for strip loins from 103 of the carcasses. 3GC(r) Salmonella was detected on 7.6% of hides during processing and was not detected on the final carcasses or strip loins. NAL(r) S. enterica was detected on only one hide. 3GC(r) E. coli and COT(r) E. coli were detected on 100.0% of hides during processing. Concentrations of 3GC(r) E. coli and COT(r) E. coli on hides were correlated with pre-evisceration carcass contamination. 3GC(r) E. coli and COT(r) E. coli were each detected on only 0.5% of final carcasses and were not detected on strip loins. Five hundred and 42 isolates were screened for extraintestinal pathogenic E. coli (ExPEC) virulence-associated markers. Only two COT(r) E. coli isolates from hides were ExPEC, indicating that fed cattle products are not a significant source of ExPEC causing human urinary tract infections. The very low prevalences of these organisms on final carcasses and their absence on strip loins demonstrate that current sanitary dressing procedures and processing interventions are effective against antimicrobial-resistant bacteria. Copyright © 2015, American Society for Microbiology. All Rights Reserved.

BUDHIES II: a phase-space view of H I gas stripping and star formation quenching in cluster galaxies

NASA Astrophysics Data System (ADS)

Jaffé, Yara L.; Smith, Rory; Candlish, Graeme N.; Poggianti, Bianca M.; Sheen, Yun-Kyeong; Verheijen, Marc A. W.

2015-04-01

We investigate the effect of ram-pressure from the intracluster medium on the stripping of H I gas in galaxies in a massive, relaxed, X-ray bright, galaxy cluster at z = 0.2 from the Blind Ultra Deep H I Environmental Survey (BUDHIES). We use cosmological simulations, and velocity versus position phase-space diagrams to infer the orbital histories of the cluster galaxies. In particular, we embed a simple analytical description of ram-pressure stripping in the simulations to identify the regions in phase-space where galaxies are more likely to have been sufficiently stripped of their H I gas to fall below the detection limit of our survey. We find a striking agreement between the model predictions and the observed location of H I-detected and non-detected blue (late-type) galaxies in phase-space, strongly implying that ram-pressure plays a key role in the gas removal from galaxies, and that this can happen during their first infall into the cluster. However, we also find a significant number of gas-poor, red (early-type) galaxies in the infall region of the cluster that cannot easily be explained with our model of ram-pressure stripping alone. We discuss different possible additional mechanisms that could be at play, including the pre-processing of galaxies in their previous environment. Our results are strengthened by the distribution of galaxy colours (optical and UV) in phase-space, that suggests that after a (gas-rich) field galaxy falls into the cluster, it will lose its gas via ram-pressure stripping, and as it settles into the cluster, its star formation will decay until it is completely quenched. Finally, this work demonstrates the utility of phase-space diagrams to analyse the physical processes driving the evolution of cluster galaxies, in particular H I gas stripping.

Occurrence and characterization of Salmonella from chicken nuggets, strips, and pelleted broiler feed.

PubMed

Bucher, O; Holley, R A; Ahmed, R; Tabor, H; Nadon, C; Ng, L K; D'Aoust, J Y

2007-10-01

Raw, frozen chicken nuggets and strips have been identified as a significant risk factor in contracting foodborne salmonellosis. Cases of salmonellosis as a result of consuming partly cooked chicken nuggets may be due in part to Salmonella strains originating in broiler feed. This study was undertaken to determine the occurrence and characterize the strains of Salmonella contaminating chicken nuggets, strips, and pelleted feeds, in an attempt to demonstrate whether the same Salmonella strains present in broiler feed could be isolated from raw, frozen chicken nuggets and strips available for human consumption. Salmonellae were recovered using the Health Canada MFHPB-20 method for the isolation and identification of Salmonella from foods. Strains were characterized by serotyping, phage typing, antimicrobial resistance typing (R-typing), and by pulsed-field gel electrophoresis (PFGE). Salmonellae were isolated from 25-g samples in 27% (n=92) of nugget and strip samples, 95% (n=20) of chicken nugget meat samples, and from 9% (n=111) of pelleted feed samples. Salmonella Heidelberg, Salmonella Enteritidis, and Salmonella Orion were the most commonly isolated serovars from chicken nuggets and strips, nugget and strip meat, and pelleted broiler feeds, respectively. Salmonella Enteritidis phage type (PT) 13a with PFGE pattern SENXAI.0006 and R-type sensitive as well as Salmonella Enteritidis PT13a with PFGE pattern SENXAI.0068 and R-type sensitive were isolated from pelleted feed, and chicken nugget and strip meat in two separate instances. Data showed that Salmonella strains isolated from broiler feed were indistinguishable from strains isolated from packaged raw, frozen chicken nuggets and strips. However, results did not rule out the possibility that breeding stock or contamination during processing may have contributed to chicken meat contamination by Salmonella.

Residue detection for real-time removal of paint from metallic surfaces

NASA Technical Reports Server (NTRS)

Bar-Cohen, Yoseph; Bao, Xiaoqi; Dolgin, Benjamin; Marzwell, Neville

2001-01-01

Paint stripping from large steel ships and other metallic surfaces is a major issue in the maintenance and refurbishing of structures, and environmental concerns are greatly limiting the possible options. As a result, waterjet with water recycling has become the leading form of paint stripping and robotic manipulators with scanning bridges were constructed by various manufacturers to address this need. The application of such scanning bridges is slow and their access is constrained by the complex shape of the ship hull and various features on the surface. To overcome these limitations, a robotic system that is called Ultrastrip (UltraStrip Systems, Inc., Stuart, FL) is developed. This system uses magnetic wheels to attach the stripper to the structure and travel on it while performing paint stripping. To assure efficient paint stripping feedback data is required to control the travel speed by monitoring the paint thickness before and during the stripping process. Efforts at JPL are currently underway to develop the required feedback capability to assure effective paint stripping. Various possible sensors were considered and issues that can affect the sensitivity, reliability and applicability of the sensors are being investigated with emphasis on measuring the initial conditions of the paint. Issues that affect the sensory data in dynamic conditions are addressed while providing real-time real feedback for the control of the paint stripper speed of travel.

GASP. V. Ram-pressure stripping of a ring Hoag's-like galaxy in a massive cluster

NASA Astrophysics Data System (ADS)

Moretti, A.; Poggianti, B. M.; Gullieuszik, M.; Mapelli, M.; Jaffé, Y. L.; Fritz, J.; Biviano, A.; Fasano, G.; Bettoni, D.; Vulcani, B.; D'Onofrio, M.

2018-04-01

Through an ongoing MUSE program dedicated to study gas removal processes in galaxies (GAs Stripping Phenomena in galaxies with MUSE, GASP), we have obtained deep and wide integral field spectroscopy of the galaxy JO171. This galaxy resembles the Hoag's galaxy, one of the most spectacular examples of ring galaxies, characterized by a completely detached ring of young stars surrounding a central old spheroid. At odds with the isolated Hoag's galaxy, JO171 is part of a dense environment, the cluster Abell 3667, which is causing gas stripping along tentacles. Moreover, its ring counter-rotates with respect to the central spheroid. The joint analysis of the stellar populations and the gas/stellar kinematics shows that the origin of the ring was not due to an internal mechanism, but was related to a gas accretion event that happened in the distant past, prior to accretion on to Abell 3667, most probably within a filament. More recently, since infall in the cluster, the gas in the ring has been stripped by ram pressure, causing the quenching of star formation in the stripped half of the ring. This is the first observed case of ram-pressure stripping in action in a ring galaxy, and MUSE observations are able to reveal both of the events (accretion and stripping) that caused dramatic transformations in this galaxy.

Fabrication of amorphous IGZO thin film transistor using self-aligned imprint lithography with a sacrificial layer

NASA Astrophysics Data System (ADS)

Kim, Sung Jin; Kim, Hyung Tae; Choi, Jong Hoon; Chung, Ho Kyoon; Cho, Sung Min

2018-04-01

An amorphous indium-gallium-zinc-oxide (a-IGZO) thin film transistor (TFT) was fabricated by a self-aligned imprint lithography (SAIL) method with a sacrificial photoresist layer. The SAIL is a top-down method to fabricate a TFT using a three-dimensional multilayer etch mask having all pattern information for the TFT. The sacrificial layer was applied in the SAIL process for the purpose of removing the resin residues that were inevitably left when the etch mask was thinned by plasma etching. This work demonstrated that the a-IGZO TFT could be fabricated by the SAIL process with the sacrificial layer. Specifically, the simple fabrication process utilized in this study can be utilized for the TFT with a plasma-sensitive semiconductor such as the a-IGZO and further extended for the roll-to-roll TFT fabrication.

The use of ERTS-1 MSS data for mapping strip mines and acid mine drainage in Pennsyvania

NASA Technical Reports Server (NTRS)

Alexander, S. S.; Dein, J. L.; Gold, D. P.

1973-01-01

Digital processing of ERTS-I MSS data for areas around the west branch of the Susquehanna River permits identification of stripped areas including ones that are not discernible from visual analysis of ERTS imagery. Underflight data and ground-based observations are used for ground-truth and as a basis for designing more refined operators to make sub-classifications of stripped areas, particularly with regard to manifestations of acid mine drainage; because of associated diagnostic effects on vegetation, seasonal changes in classifiction criteria are being documented as repeated, cloud-free ERTS-I coverage of the same area becomes available. Preliminary results indicate that ERTS data can be used to moniter not only the total extent of stripping in given areas but also the effectiveness of reclamation and pollution abatement procedures.

Laser Structuring of Thin Layers for Flexible Electronics by a Shock Wave-induced Delamination Process

NASA Astrophysics Data System (ADS)

Lorenz, Pierre; Ehrhardt, Martin; Zimmer, Klaus

The defect-free laser-assisted structuring of thin films on flexible substrates is a challenge for laser methods. However, solving this problem exhibits an outstanding potential for a pioneering development of flexible electronics. Thereby, the laser-assisted delamination method has a great application potential. At the delamination process: the localized removal of the layer is induced by a shock wave which is produced by a laser ablation process on the rear side of the substrate. In this study, the thin-film patterning process is investigated for different polymer substrates dependent on the material and laser parameters using a KrF excimer laser. The resultant structures were studied by optical microscopy and white light interferometry (WLI). The delamination process was tested at different samples (indium tin oxide (ITO) on polyethylene terephthalate (PET), epoxy-based negative photoresist (SU8) on polyimide (PI) and indium tin oxide/copper indium gallium selenide/molybdenum (ITO/CIGS/Mo) on PI.

Wide-band doubler and sine wave quadrature generator

NASA Technical Reports Server (NTRS)

Crow, R. B.

1969-01-01

Phase-locked loop with photoresistive control, which provides both sine and cosine outputs for subcarrier demodulation, serves as a telemetry demodulator signal conditioner with a second harmonic signal for synchronization with the locally generated code.

The Co-Evolution of Galaxies, their ISM, and the ICM: The Hydrodynamics of Galaxy Transformation

NASA Astrophysics Data System (ADS)

Vijayaraghavan, Rukmani; Sarazin, Craig L.; Ricker, Paul M.

2017-01-01

Cluster of galaxies are hostile environments. Infalling cluster galaxies are stripped of their dark matter, stars, and hot and cold interstellar medium gas. The ISM, in addition to tidal and ram pressure stripping, can evaporate due to thermal conduction. Gas loss and the subsequent suppression of star formation is not straightforward: magnetic fields in the ISM and ICM shield galaxies and their stripped tails from shear instabilities and conduction, radiative cooling can inhibit gas loss, and feedback from stars and AGN can replenish the ISM. While there is observational evidence that these processes operate, a theoretical understanding of the physics controlling the energy cycle in cluster galaxies remains elusive. Additionally, galaxies have a significant impact on ICM evolution: orbiting galaxies stir up and stretch ICM magnetic field lines, inject turbulence into the ICM via their wakes and g-waves, and infuse metals into the ICM. Quantifying the balance between processes that remove, retain, and replenish the ISM, and the impact of galaxies on the ICM require specialized hydrodynamic simulations of the cluster environment and its galaxies. I will present results from some of these simulations that include ram pressure stripping of galaxies' hot ISM, the effect of magnetic fields on this process, and the effectiveness of isotropic and anisotropic thermal conduction in removing and retaining the ISM.

Process and apparatus for solvent extraction of oil from oil-containing diatomite ore

DOE Office of Scientific and Technical Information (OSTI.GOV)

Karnofsky, G.B.

1979-09-11

A process is described for solvent extraction of oil-bearing diatomite ore. An apparatus is provided for use therewith, wherein the ore is extracted by countercurrent decantation with a hydrocarbon solvent. The solvent is recovered from the extract by multiple effect evaporation followed by stripping, and the spent diatomite is contacted with water to displace a major portion of the solvent therefrom. The solvent is recovered from the aqueous slurry of the spent diatomite by stripping with steam at superatmospheric pressure. 17 claims.

Rugometric and microtopographic inspection of teeth enamel

NASA Astrophysics Data System (ADS)

Costa, Manuel F.; Pereira, Pedro B.

2013-06-01

The roughness of teeth' enamel is an important parameter in orthodontics. One example is the application in the process of decreasing tooth-size by reducing the interproximal enamel surfaces (stripping) of teeth. In order to achieve smooth surfaces clinicians have been testing various methods and progressively improved this therapeutic technique. The evaluation the surface roughness following teeth interproximal reduction is fundamental in the process. In general tooth' surface is not flat presenting a variety of complex geometries. In this communication we will report on the metrological procedure employed on the rugometric and microtopographic inspection by optical active triangulation of raw and processed (interproximal stripping) tooth surfaces.

Potential for yield improvement in combined rip-first and crosscut-first rough mill processing

Treesearch

Ed Thomas; Urs Buehlmann

2016-01-01

Traditionally, lumber cutting systems in rough mills have either first ripped lumber into wide strips and then crosscut the resulting strips into component lengths (rip-first), or first crosscut the lumber into component lengths, then ripped the segments to the required widths (crosscut-first). Each method has its advantages and disadvantages. Crosscut-first typically...

Analytic description of the frictionally engaged in-plane bending process incremental swivel bending (ISB)

NASA Astrophysics Data System (ADS)

Frohn, Peter; Engel, Bernd; Groth, Sebastian

2018-05-01

Kinematic forming processes shape geometries by the process parameters to achieve a more universal process utilizations regarding geometric configurations. The kinematic forming process Incremental Swivel Bending (ISB) bends sheet metal strips or profiles in plane. The sequence for bending an arc increment is composed of the steps clamping, bending, force release and feed. The bending moment is frictionally engaged by two clamping units in a laterally adjustable bending pivot. A minimum clamping force hindering the material from slipping through the clamping units is a crucial criterion to achieve a well-defined incremental arc. Therefore, an analytic description of a singular bent increment is developed in this paper. The bending moment is calculated by the uniaxial stress distribution over the profiles' width depending on the bending pivot's position. By a Coulomb' based friction model, necessary clamping force is described in dependence of friction, offset, dimensions of the clamping tools and strip thickness as well as material parameters. Boundaries for the uniaxial stress calculation are given in dependence of friction, tools' dimensions and strip thickness. The results indicate that changing the bending pivot to an eccentric position significantly affects the process' bending moment and, hence, clamping force, which is given in dependence of yield stress and hardening exponent. FE simulations validate the model with satisfactory accordance.

Method and apparatus for improved melt flow during continuous strip casting

DOEpatents

Follstaedt, Donald W.; King, Edward L.; Schneider, Ken C.

1991-11-12

The continuous casting of metal strip using the melt overflow process is improved by controlling the weir conditions in the nozzle to provide a more uniform flow of molten metal across the width of the nozzle and reducing the tendency for freezing of metal along the interface with refractory surfaces. A weir design having a sloped rear wall and tapered sidewalls and critical gap controls beneath the weir has resulted in the drastic reduction in edge tearing and a significant improvement in strip uniformity. The floor of the container vessel is preferably sloped and the gap between the nozzle and the rotating substrate is critically controlled. The resulting flow patterns observed with the improved casting process have reduced thermal gradients in the bath, contained surface slag and eliminated undesirable solidification near the discharge area by increasing the flow rates at those points.

Method and apparatus for improved melt flow during continuous strip casting

DOEpatents

Follstaedt, D.W.; King, E.L.; Schneider, K.C.

1991-11-12

The continuous casting of metal strip using the melt overflow process is improved by controlling the weir conditions in the nozzle to provide a more uniform flow of molten metal across the width of the nozzle and reducing the tendency for freezing of metal along the interface with refractory surfaces. A weir design having a sloped rear wall and tapered sidewalls and critical gap controls beneath the weir has resulted in the drastic reduction in edge tearing and a significant improvement in strip uniformity. The floor of the container vessel is preferably sloped and the gap between the nozzle and the rotating substrate is critically controlled. The resulting flow patterns observed with the improved casting process have reduced thermal gradients in the bath, contained surface slag and eliminated undesirable solidification near the discharge area by increasing the flow rates at those points. 8 figures.

Alkaline-side extraction of technetium from tank waste using crown ethers and other extractants

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bonnesen, P.V.; Moyer, B.A.; Presley, D.J.

The chemical development of a new crown-ether-based solvent-extraction process for the separation of (Tc) from alkaline tank-waste supernate is ready for counter-current testing. The process addresses a priority need in the proposed cleanup of Hanford and other tank wastes. This need has arisen from concerns due to the volatility of Tc during vitrification, as well as {sup 99}Tc`s long half-life and environmental mobility. The new process offers several key advantages that direct treatability--no adjustment of the waste composition is needed; economical stripping with water; high efficiency--few stages needed; non-RCRA chemicals--no generation of hazardous or mixed wastes; co-extraction of {sup 90}Sr;more » and optional concentration on a resin. A key concept advanced in this work entails the use of tandem techniques: solvent extraction offers high selectivity, while a subsequent column sorption process on the aqueous stripping solution serves to greatly concentrate the Tc. Optionally, the stripping solution can be evaporated to a small volume. Batch tests of the solvent-extraction and stripping components of the process have been conducted on actual melton Valley Storage Tank (MVST) waste as well as simulants of MVST and Hanford waste. The tandem process was demonstrated on MVST waste simulants using the three solvents that were selected the final candidates for the process. The solvents are 0.04 M bis-4,4{prime}(5{prime})[(tert-butyl)cyclohexano]-18-crown-6 (abbreviated di-t-BuCH18C6) in a 1:1 vol/vol blend of tributyl phosphate and Isopar{reg_sign} M (an isoparaffinic kerosene); 0.02 M di-t-BuCH18C6 in 2:1 vol/vol TBP/Isopar M and pure TBP. The process is now ready for counter-current testing on actual Hanford tank supernates.« less

Nuclear reactor fuel rod attachment system

DOEpatents

Not Available

1980-09-17

A reusable system is described for removably attaching a nuclear reactor fuel rod to a support member. A locking cap is secured to the fuel rod and a locking strip is fastened to the support member. The locking cap has two opposing fingers shaped to form a socket having a body portion. The locking strip has an extension shaped to rigidly attach to the socket's body portion. The locking cap's fingers are resiliently deflectable. For attachment, the locking cap is longitudinally pushed onto the locking strip causing the extension to temporarily deflect open the fingers to engage the socket's body portion. For removal, the process is reversed.

Method for separating actinides. [Patent application; stripping of Np from organic extractant

DOEpatents

Friedman, H.A.; Toth, L.M.

1980-11-10

An organic solution used for processing spent nuclear reactor fuels is contacted with an aqueous nitric acid solution to strip Np(VI), U(VI), and Pu(IV) from the organic solution into the acid solution. The acid solution is exposed to ultraviolet light, which reduces Np(VI) to Np(V) without reducing U(VI) and Pu(IV). Since the solubility of Np(V) in the organic solution is much lower than that of Np(VI), U(VI), and Pu(IV), a major part of the Np is stripped from the organic solution while leaving most of the U and Pu therein.

Determine utility of ERTS-1 to detect and monitor area strip mining and reclamation. [southeastern Ohio

NASA Technical Reports Server (NTRS)

Rogers, R. H. (Principal Investigator); Pettyjohn, W. A.

1975-01-01

The author has identified the following significant results. Computer techniques were applied to process ERTS tapes acquired over coal mining operations in southeastern Ohio on 21 August 1972 and 3 September 1973. ERTS products obtained included geometrically correct map overlays showing stripped earth, partially reclaimed earth, water, and natural vegetation. Computer-generated tables listing the area covered by each land-water category in square kilometers and acres were produced. By comparing these mapping products, the study demonstrates the capability of ERTS to monitor changes in the extent of stripping, success of reclamation, and the secondary effects of mining on the environment.

Experience of Application of Liquid Lubricating Materials during Wide Strip Hot Rolling

NASA Astrophysics Data System (ADS)

Platov, S. I.; Dema, R. R.; Kharchenko, M. V.; Amirov, R. N.

2017-12-01

The paper presents the results of the scientific and practical research of roller systems operation at feed of liquid lubricating materials through the example of the wide strip hot rolling Mill-2000 at PAO MMK. The experiments proved that application of lubricating materials leads to decrease of energy-power parameters of the process by 12 to 15 %, and reduction of work roll wear by 10 to 12%. The practical results of the study are developed recommendations on determination of consumption-volumetric parameters of the supplied lubricating material depending on rheological and geometrical parameters of the rolled strip and current wear of work rolls.

From macroplastic to microplastic: Degradation of high-density polyethylene, polypropylene, and polystyrene in a salt marsh habitat.

PubMed

Weinstein, John E; Crocker, Brittany K; Gray, Austin D

2016-07-01

As part of the degradation process, it is believed that most plastic debris becomes brittle over time, fragmenting into progressively smaller particles. The smallest of these particles, known as microplastics, have been receiving increased attention because of the hazards they present to wildlife. To understand the process of plastic degradation in an intertidal salt marsh habitat, strips (15.2 cm × 2.5 cm) of high-density polyethylene, polypropylene, and extruded polystyrene were field-deployed in June 2014 and monitored for biological succession, weight, surface area, ultraviolet (UV) transmittance, and fragmentation. Subsets of strips were collected after 4 wk, 8 wk, 16 wk, and 32 wk. After 4 wk, biofilm had developed on all 3 polymers with evidence of grazing periwinkles (Littoraria irrorata). The accreting biofilm resulted in an increased weight of the polypropylene and polystyrene strips at 32 wk by 33.5% and 167.0%, respectively, with a concomitant decrease in UV transmittance by approximately 99%. Beginning at 8 wk, microplastic fragments and fibers were produced from strips of all 3 polymers, and scanning electron microscopy revealed surface erosion of the strips characterized by extensive cracking and pitting. The results suggest that the degradation of plastic debris proceeds relatively quickly in salt marshes and that surface delamination is the primary mechanism by which microplastic particles are produced in the early stages of degradation. Environ Toxicol Chem 2016;35:1632-1640. © 2016 SETAC. © 2016 SETAC.

Maskless Lithography Using Negative Photoresist Material: Impact of UV Laser Intensity on the Cured Line Width

NASA Astrophysics Data System (ADS)

Mohammed, Mohammed Ziauddin; Mourad, Abdel-Hamid I.; Khashan, Saud A.

2018-06-01

The application of maskless lithography technique on negative photoresist material is investigated in this study. The equipment used in this work is designed and built especially for maskless lithography applications. The UV laser of 405 nm wavelength with 0.85 Numerical Aperture is selected for direct laser writing. All the samples are prepared on a glass substrate. Samples are tested at different UV laser intensities and different stage velocities in order to study the impact on patterned line width. Three cases of spin coated layers of thickness 90 μm, 40 μm, and 28 μm on the substrate are studied. The experimental results show that line width has a generally increasing trend with intensity. However, a decreasing trend was observed for increasing velocity. The overall performance shows that the mr-DWL material is suitable for direct laser writing systems.

Free-floating magnetic microstructures by mask photolithography

NASA Astrophysics Data System (ADS)

Huong Au, Thi; Thien Trinh, Duc; Bich Do, Danh; Phu Nguyen, Dang; Cong Tong, Quang; Diep Lai, Ngoc

2018-03-01

This work explores the fabrication of free-floating magnetic structures on a photocurable nanocomposite consisting of superparamagnetic magnetite nanoparticles (Fe3O4) and a commercial SU-8 negative tone photoresist. The nanocomposite was synthesized by mixing magnetic nanoparticles with different kinds of SU-8 resin. We demonstrated that the dispersion of Fe3O4 nanoparticles in nanocomposite solution strongly depended on the particles concentration, the viscosity of SU-8 polymer, and the mixing time. The influence of these factors was demonstrated by examining the structures fabricated by mask photolithography technique. We obtained the best quality of structures at a low concentration, below 5 wt%, of Fe3O4 nanoparticles in SU-8 2005 photoresist for a mixing time of about 20 days. The manipulation of free-floating magnetic microstructures by an external magnetic field was also demonstrated showing promising applications of this magnetic nanocomposite.

Concentration gradient induced morphology evolution of silica nanostructure growth on photoresist-derived carbon micropatterns

NASA Astrophysics Data System (ADS)

Liu, Dan; Shi, Tielin; Xi, Shuang; Lai, Wuxing; Liu, Shiyuan; Li, Xiaoping; Tang, Zirong

2012-09-01

The evolution of silica nanostructure morphology induced by local Si vapor source concentration gradient has been investigated by a smart design of experiments. Silica nanostructure or their assemblies with different morphologies are obtained on photoresist-derived three-dimensional carbon microelectrode array. At a temperature of 1,000°C, rope-, feather-, and octopus-like nanowire assemblies can be obtained along with the Si vapor source concentration gradient flow. While at 950°C, stringlike assemblies, bamboo-like nanostructures with large joints, and hollow structures with smaller sizes can be obtained along with the Si vapor source concentration gradient flow. Both vapor-liquid-solid and vapor-quasiliquid-solid growth mechanisms have been applied to explain the diverse morphologies involving branching, connecting, and batch growth behaviors. The present approach offers a potential method for precise design and controlled synthesis of nanostructures with different features.

Fabrication of hexagonal star-shaped and ring-shaped patterns arrays by Mie resonance sphere-lens-lithography

NASA Astrophysics Data System (ADS)

Liu, Xianchao; Wang, Jun; Li, Ling; Gou, Jun; Zheng, Jie; Huang, Zehua; Pan, Rui

2018-05-01

Mie resonance sphere-lens-lithography has proved to be a good candidate for fabrication of large-area tunable surface nanopattern arrays. Different patterns on photoresist surface are obtained theoretically by adjusting optical coupling among neighboring spheres with different gap sizes. The effect of light reflection from the substrate on the pattern produced on the photoresist with a thin thickness is also discussed. Sub-micron hexagonal star-shaped and ring-shaped patterns arrays are achieved with close-packed spheres arrays and spheres arrays with big gaps, respectively. Changing of star-shaped vertices is induced by different polarization of illumination. Experimental results agree well with the simulation. By using smaller resonance spheres, sub-400 nm star-shaped and ring-shaped patterns can be realized. These tunable patterns are different from results of previous reports and have enriched pattern morphology fabricated by sphere-lens-lithography, which can find application in biosensor and optic devices.

[Development of poliovirus infection in laboratory animals of different species].

PubMed

Koroleva, G A; Lashkevich, V A; Voroshilova, M K

1975-01-01

The capacity of vaccine and virulent strains of poliomyelitis virus to multiply in laboratory animals of different species was studied. Virus reproduction was judged by formation of photoresistant virus progeny in response to inoculation of the animals with photosensitized virus. Multiplication of virulent poliomyelitis virus strains observed in the majority of animal species examined (monkeys, newborn and adult cotton rats, newborn and adult white mice, chickens, chick embryos) resulted in active formation of photoresistant virus population and in some cases was accompanied by clinical symptoms of the disease. Multiplication of vaccine strains was observed in a smaller number of animal species and was limited, as a rule. Among non-primate animals, newborn cotton rats were most susceptible to poliovirus infection. Newborn guinea pigs were the only species of laboratory animals in which no multiplication of any of the six strains under study could be detected.

Maskless Lithography Using Negative Photoresist Material: Impact of UV Laser Intensity on the Cured Line Width

NASA Astrophysics Data System (ADS)

Mohammed, Mohammed Ziauddin; Mourad, Abdel-Hamid I.; Khashan, Saud A.

2018-04-01

The application of maskless lithography technique on negative photoresist material is investigated in this study. The equipment used in this work is designed and built especially for maskless lithography applications. The UV laser of 405 nm wavelength with 0.85 Numerical Aperture is selected for direct laser writing. All the samples are prepared on a glass substrate. Samples are tested at different UV laser intensities and different stage velocities in order to study the impact on patterned line width. Three cases of spin coated layers of thickness 90 μm, 40 μm, and 28 μm on the substrate are studied. The experimental results show that line width has a generally increasing trend with intensity. However, a decreasing trend was observed for increasing velocity. The overall performance shows that the mr-DWL material is suitable for direct laser writing systems.

Method for making circular tubular channels with two silicon wafers

DOEpatents

Yu, Conrad M.; Hui, Wing C.

1996-01-01

A two-wafer microcapillary structure is fabricated by depositing boron nitride (BN) or silicon nitride (Si.sub.3 N.sub.4) on two separate silicon wafers (e.g., crystal-plane silicon with [100] or [110] crystal orientation). Photolithography is used with a photoresist to create exposed areas in the deposition for plasma etching. A slit entry through to the silicon is created along the path desired for the ultimate microcapillary. Acetone is used to remove the photoresist. An isotropic etch, e.g., such as HF/HNO.sub.3 /CH.sub.3 COOH, then erodes away the silicon through the trench opening in the deposition layer. A channel with a half-circular cross section is then formed in the silicon along the line of the trench in the deposition layer. Wet etching is then used to remove the deposition layer. The two silicon wafers are aligned and then bonded together face-to-face to complete the microcapillary.

Enhanced wettability of SU-8 photoresist through a photografting procedure for bioanalytical device applications

PubMed Central

Gao, Zhan; Henthorn, David B.; Kim, Chang-Soo

2009-01-01

In this work, we detail a method whereby a polymeric hydrogel layer is grafted to the negative tone photoresist SU-8 in order to improve its wettability. A photoinitiator is first immobilized on freshly prepared SU-8 samples, acting as the starting point for various surface modifications strategies. Grafting of a 2-hydroxyethylmethacrylate-based hydrogel from the SU-8 surface resulted in the reduction of the static contact angle of a water droplet from 79 ± 1° to 36 ± 1°, while addition of a poly(ethylene glycol)-rich hydrogel layer resulted in further improvement (8 ± 1°). Wettability is greatly enhanced after 30 minutes of polymerization, with a continued but more gradual decrease in contact angle up to approximately 50 minutes. Hydrogel formation is triggered by exposure to UV irradiation, allowing for the formation of photopatterned structures using existing photolithographic techniques. PMID:19756177

Molecular glass positive i-line photoresist materials containing 2,1,4-DNQ and acid labile group

NASA Astrophysics Data System (ADS)

Wang, Liyuan; Yu, Jinxing; Xu, Na

2010-04-01

Recent years increasing attention has been given to molecular glass resist materials. In this paper, maleopimaric acid, cycloaddition reaction product of rosin with maleic anhydride, was reacted with hydroxylamine and then further esterified with 2-diazo-1-naphthoquinone-4-sulfonyl chloride to give N-hydroxy maleopimarimide sulfonate. The carboxylic acid group of the compound was then protected by the reaction of this compound with vinyl ethyl ether or dihydropyran. Thus obtained compounds were amorphous. When irradiated with i-line light, the 2,1,4-DNQ group undergo photolysis not only to give off nitrogen gas but also generate sulfonic acid which can result in the decomposition of the acid labile group. So, a novel chemically amplified positive i-line molecular glass photoresists can be formed by the compound and other acidolytic molecular glass compounds. The lithographic performance of the resist materials is evaluated.

Universal control and measuring system for modern classic and amorphous magnetic materials single/on-line strip testers

NASA Astrophysics Data System (ADS)

Zemánek, Ivan; Havlíček, Václav

2006-09-01

A new universal control and measuring system for classic and amorphous soft magnetic materials single/on-line strip testing has been developed at the Czech Technical University in Prague. The measuring system allows to measure magnetization characteristic and specific power losses of different tested materials (strips) at AC magnetization of arbitrary magnetic flux density waveform at wide range of frequencies 20 Hz-20 kHz. The measuring system can be used for both single strip testing in laboratories and on-line strip testing during the production process. The measuring system is controlled by two-stage master-slave control system consisting of the external PC (master) completed by three special A/D measuring plug-in boards, and local executing control unit (slave) with one-chip microprocessor 8051, connected with PC by the RS232 serial line. The "user friendly" powerful control software implemented on the PC and the effective program code for the microprocessor give possibility for full automatic measurement with high measuring power and high measuring accuracy.

A study of electromigration behaviors of Ge2Sb2Te5 chalcogenide nano-strips subjected to pulse bias

NASA Astrophysics Data System (ADS)

Huang, Yin-Hsien; Hsieh, Tsung-Eong

2017-07-01

Electromigration (EM) behaviors of pristine Ge2Sb2Te5 (GST) and cerium-doped GST (Ce-GST) nano-strips were investigated by the mean-time-to-failure (MTTF) tests under the pulse bias at the conditions of pulse frequency (f) ranging from 1 to 25 MHz and duty cycle ranging from 50% to 80%. Analytical results indicated that, at f greater than 10 MHz, the EM failure of GST nano-strips in pulse bias environment could be depicted by the ‘average current model’. With the aid of Black’s theory, the activation energies (E a) of EM process under pulse bias were found to be 0.63 and 0.56 eV for GST and Ce-GST nano-strips, respectively. The E a values were comparatively smaller than those observed in direct-current MTTF test of GST thin-film samples, implying the enhancement of surface diffusion and skin effect in GST nano-strips. The morphology and composition analyses indicated that the electrostatic and the electron-wind forces might simultaneously involve in the mass transport in GST nano-strips under the test conditions of this study. The composition analysis also revealed that doping could not effectively alleviate the element segregation in GST subjected to electrical bias.

The role of microglia in synaptic stripping and synaptic degeneration: a revised perspective

PubMed Central

Hugh Perry, V; O'Connor, Vincent

2010-01-01

Chronic neurodegenerative diseases of the CNS (central nervous system) are characterized by the loss of neurons. There is, however, growing evidence to show that an early stage of this process involves degeneration of presynaptic terminals prior to the loss of the cell body. Synaptic plasticity in CNS pathology has been associated with microglia and the phenomenon of synaptic stripping. We review here the evidence for the involvement of microglia in synaptic stripping and synapse degeneration and we conclude that this is a case of guilt by association. In disease models of chronic neurodegeneration, there is no evidence that microglia play an active role in either synaptic stripping or synapse degeneration, but the degeneration of the synapse and the envelopment of a degenerating terminal appears to be a neuron autonomous event. We highlight here some of the gaps in our understanding of synapse degeneration in chronic neurodegenerative disease. PMID:20967131

Using pad‐stripped acausally filtered strong‐motion data

USGS Publications Warehouse

Boore, David; Sisi, Aida Azari; Akkar, Sinan

2012-01-01

Most strong‐motion data processing involves acausal low‐cut filtering, which requires the addition of sometimes lengthy zero pads to the data. These padded sections are commonly removed by organizations supplying data, but this can lead to incompatibilities in measures of ground motion derived in the usual way from the padded and the pad‐stripped data. One way around this is to use the correct initial conditions in the pad‐stripped time series when computing displacements, velocities, and linear oscillator response. Another way of ensuring compatibility is to use postprocessing of the pad‐stripped acceleration time series. Using 4071 horizontal and vertical acceleration time series from the Turkish strong‐motion database, we show that the procedures used by two organizations—ITACA (ITalian ACcelerometric Archive) and PEER NGA (Pacific Earthquake Engineering Research Center–Next Generation Attenuation)—lead to little bias and distortion of derived seismic‐intensity measures.

Automatic mapping of strip mine operations from spacecraft data. [Ohio

NASA Technical Reports Server (NTRS)

Rogers, R. H. (Principal Investigator); Reed, L. E.; Pettyjohn, W. A.

1974-01-01

The author has identified the following significant results. Computer techniques were applied to process ERTS tapes acquired over coal mining operations in southeastern Ohio on 21 August 1972 and 3 September 1973. ERTS products obtained included geometrically-correct map overlays, at scales from 1:24,000 to 1:250,000, showing stripped earth, partially reclaimed earth, water, and natural vegetation. Computer-generated tables listing the area covered by each land-water category in square kilometers were also produced. By comparing these mapping products, the study demonstrates the capability of ERTS to monitor changes in the extent of stripping and reclamation. NASA C-130 photography acquired on 7 September 1973 when compared with the ERTS products generated from the 3 September 1973 tape established the categorization accuracy to be better than 90%. It is estimated that the stripping and reclamation maps and data were produced from the ERTS CCTs at a tenth of the cost of conventional techniques.

Reactive extraction of lactic acid with trioctylamine/methylene chloride/n-hexane

DOE Office of Scientific and Technical Information (OSTI.GOV)

Han, D.H.; Hong, W.H.

The trioctylamine (TOA)/methylene chloride (MC)/n-hexane system was used as the extraction agent for the extraction of lactic acid. Curves of equilibrium and hydration were obtained at various temperatures and concentrations of TOA. A modified mass action model was proposed to interpret the equilibrium and the hydration curves. The reaction mechanism and the corresponding parameters which best represent the equilibrium data were estimated, and the concentration of water in the organic phase was predicted by inserting the parameters into the simple mathematical equation of the modified model. The concentration of MC and the change of temperature were important factors for themore » extraction and the stripping process. The stripping was performed by a simple distillation which was a combination of temperature-swing regeneration and diluent-swing regeneration. The type of inactive diluent has no influence on the stripping. The stripping efficiencies were about 70%.« less

Thermal degradation of the solvent employed in the next-generation caustic-side solvent extraction process and its effect on the extraction, scrubbing, and stripping of cesium

DOE Office of Scientific and Technical Information (OSTI.GOV)

Roach, Benjamin D.; Williams, Neil J.; Moyer, Bruce A.

As part of the ongoing development of the Next-Generation Caustic-Side Solvent Extraction (NGS) process, the thermal stability of the process solvent was investigated and shown to be adequate for industrial application. The solvent was thermally treated at 35 C over a period of 13 months whilst in dynamic contact with each of the aqueous phases of the current NGS process, namely SRS 15 (a highly caustic waste simulant), sodium hydroxide scrub solution (0.025 M), and boric acid strip solution (0.01 M). The effect of thermal treatment was evaluated by assessing batch extract/scrub/strip performance as a function of time, by monitoringmore » the sodium extraction capacity of the solvent, and by analysis of the solvent using electrospray mass spectrometry. Current studies indicate that the NGS solvent should be thermally robust for a period of XXX months at the Modular Caustic-Side Solvent Extraction Unit (MCU) pilot plant located at Savannah River Site. Furthermore, the guanidine suppressor appears to be the solvent component most significantly impacted by thermal treatment of the solvent, showing significant degradation over time.« less

Thermal degradation of the solvent employed in the next-generation caustic-side solvent extraction process and its effect on the extraction, scrubbing, and stripping of cesium

DOE PAGES

Roach, Benjamin D.; Williams, Neil J.; Moyer, Bruce A.

2015-09-02

As part of the ongoing development of the Next-Generation Caustic-Side Solvent Extraction (NGS) process, the thermal stability of the process solvent was investigated and shown to be adequate for industrial application. The solvent was thermally treated at 35 C over a period of 13 months whilst in dynamic contact with each of the aqueous phases of the current NGS process, namely SRS 15 (a highly caustic waste simulant), sodium hydroxide scrub solution (0.025 M), and boric acid strip solution (0.01 M). The effect of thermal treatment was evaluated by assessing batch extract/scrub/strip performance as a function of time, by monitoringmore » the sodium extraction capacity of the solvent, and by analysis of the solvent using electrospray mass spectrometry. Current studies indicate that the NGS solvent should be thermally robust for a period of XXX months at the Modular Caustic-Side Solvent Extraction Unit (MCU) pilot plant located at Savannah River Site. Furthermore, the guanidine suppressor appears to be the solvent component most significantly impacted by thermal treatment of the solvent, showing significant degradation over time.« less

Applied in situ product recovery in ABE fermentation

PubMed Central

Lalander, Carl‐Axel; Lee, Jonathan G. M.; Davies, E. Timothy; Harvey, Adam P.

2017-01-01

The production of biobutanol is hindered by the product's toxicity to the bacteria, which limits the productivity of the process. In situ product recovery of butanol can improve the productivity by removing the source of inhibition. This paper reviews in situ product recovery techniques applied to the acetone butanol ethanol fermentation in a stirred tank reactor. Methods of in situ recovery include gas stripping, vacuum fermentation, pervaporation, liquid–liquid extraction, perstraction, and adsorption, all of which have been investigated for the acetone, butanol, and ethanol fermentation. All techniques have shown an improvement in substrate utilization, yield, productivity or both. Different fermentation modes favored different techniques. For batch processing gas stripping and pervaporation were most favorable, but in fed‐batch fermentations gas stripping and adsorption were most promising. During continuous processing perstraction appeared to offer the best improvement. The use of hybrid techniques can increase the final product concentration beyond that of single‐stage techniques. Therefore, the selection of an in situ product recovery technique would require comparable information on the energy demand and economics of the process. © 2017 American Institute of Chemical Engineers Biotechnol. Prog., 33:563–579, 2017 PMID:28188696

DOE Office of Scientific and Technical Information (OSTI.GOV)

Blystone, P.G.; Goltz, H.R.; Springer, J. Jr.

The reduction of volatile organic compound (VOC) emissions is a significant goal of the 1990 Clean Air Act. Industrial operations relating to surface preparation, surface coating and paint striping operations constitute one of the largest industrial sources of VOC emissions. This paper describes a new emission control system offered by Purus, Inc. which captures and recovers VOCs from paint stripping operations. The system is based on an on-site adsorption-desorption process which utilizes a specialized polymeric resin adsorbent. Adsorbent beds are regenerated through a computer controlled pressure-temperature swing process (PTSA). The adsorbent resin offers significant operational advantages over conventional activated carbonmore » adsorbents with respect to treating air laden with methyl ethyl ketone (MEK) vapors. Treatment of MEK with activated carbon can be problematic due to reactivity (degradation) and high heats of adsorption of ketones with carbon. The Purus process was successfully demonstrated at Tinker Air Force Base in or under the EPA`s Waste Reduction Evaluation at Federal Sites program. MEK emissions from a paint stripping booth vent were controlled at greater than 95% reduction levels. The recovered solvent was returned to depainting process and reused with no loss in paint stripping efficiency.« less

Mathematical Modeling of the Effect of Roll Diameter on the Thermo-Mechanical Behavior of Twin Roll Cast AZ31 Magnesium Alloy Strips

NASA Astrophysics Data System (ADS)

Hadadzadeh, Amir; Wells, Mary

Although the Twin Roll Casting (TRC) process has been used in the aluminum sheet production industry for more than 60 years, the usage of this process to fabricate magnesium sheets is still at its early stages. Similar to other manufacturing processes, the development of the TRC process for magnesium alloys has followed a typical route of preliminary studies using a laboratory-scale facility, followed by pilot-scale testing and most recently attempting to use an industrial-scale twin roll caster. A powerful tool to understand and quantify the trends of the processing conditions and effects of scaling up from a laboratory size TRC machine to an industrial scale one is develop a mathematical model of the process. This can elucidate the coupled fluid-thermo-mechanical behavior of the cast strip during the solidification and then deformation stages of the process. In the present study a Thermal-Fluid-Stress model has been developed for TRC of AZ31 magnesium alloy for three roll diameters by employing the FEM commercial package ALSIM. The roll diameters were chosen as 355mm, 600mm and 1150mm. The effect of casting speed for each diameter was studied in terms of fluid flow, thermal history and stress-strain evolution in the cast strip in the roll bite region.

Bi cluster-assembled interconnects produced using SU8 templates

NASA Astrophysics Data System (ADS)

Partridge, J. G.; Matthewson, T.; Brown, S. A.

2007-04-01

Bi clusters with an average diameter of 25 nm have been deposited from an inert gas aggregation source and assembled into thin-film interconnects which are formed between planar electrical contacts and supported on Si substrates passivated with Si3N4 or thermally grown oxide. A layer of SU8 (a negative photoresist based on EPON SU-8 epoxy resin) is patterned using optical or electron-beam lithography, and it defines the position and dimensions of the cluster film. The conduction between the contacts is monitored throughout the deposition/assembly process, and subsequent I(V) characterization is performed in situ. Bi cluster-assembled interconnects have been fabricated with nanoscale widths and with up to 1:1 thickness:width aspect ratios. The conductivity of these interconnects has been increased, post-deposition, using a simple thermal annealing process.

Continuous improvements of defectivity rates in immersion photolithography via functionalized membranes in point-of-use photochemical filtration

NASA Astrophysics Data System (ADS)

D'Urzo, Lucia; Bayana, Hareen; Vandereyken, Jelle; Foubert, Philippe; Wu, Aiwen; Jaber, Jad; Hamzik, James

2017-03-01

Specific "killer-defects", such as micro-line-bridges are one of the key challenges in photolithography's advanced applications, such as multi-pattern. These defects generate from several sources and are very difficult to eliminate. Pointof-use filtration (POU) plays a crucial role on the mitigation, or elimination, of such defects. Previous studies have demonstrated how the contribution of POU filtration could not be studied independently from photoresists design and track hardware settings. Specifically, we investigated how an effective combination of optimized photoresist, filtration rate, filtration pressure, membrane and device cleaning, and single and multilayer filter membranes at optimized pore size could modulate the occurrence of such defects [1, 2, 3 and 4]. However, the ultimate desired behavior for POU filtration is the selective retention of defect precursor molecules contained in commercially available photoresist. This optimal behavior can be achieved via customized membrane functionalization. Membrane functionalization provides additional non-sieving interactions which combined with efficient size exclusion can selectively capture certain defect precursors. The goal of this study is to provide a comprehensive assessment of membrane functionalization applied on an asymmetric ultra-high molecular weight polyethylene (UPE) membrane at different pore size. Defectivity transferred in a 45 nm line 55 nm space (45L/55S) pattern, created through 193 nm immersion (193i) lithography with a positive tone chemically amplified resist (PT-CAR), has been evaluated on organic under-layer coated wafers. Lithography performance, such as critical dimensions (CD), line width roughness (LWR) and focus energy matrix (FEM) is also assessed.

Optimizing the recovery of copper from electroplating rinse bath solution by hollow fiber membrane.

PubMed

Oskay, Kürşad Oğuz; Kul, Mehmet

2015-01-01

This study aimed to recover and remove copper from industrial model wastewater solution by non-dispersive solvent extraction (NDSX). Two mathematical models were developed to simulate the performance of an integrated extraction-stripping process, based on the use of hollow fiber contactors using the response surface method. The models allow one to predict the time dependent efficiencies of the two phases involved in individual extraction or stripping processes. The optimal recovery efficiency parameters were determined as 227 g/L of H2SO4 concentration, 1.22 feed/strip ratio, 450 mL/min flow rate (115.9 cm/min. flow velocity) and 15 volume % LIX 84-I concentration in 270 min by central composite design (CCD). At these optimum conditions, the experimental value of recovery efficiency was 95.88%, which was in close agreement with the 97.75% efficiency value predicted by the model. At the end of the process, almost all the copper in the model wastewater solution was removed and recovered as CuSO4.5H2O salt, which can be reused in the copper electroplating industry.

Investigation of gas stripping and pervaporation for improved feasibility of two-stage butanol production process.

PubMed

Setlhaku, Mpho; Heitmann, Sebastian; Górak, Andrzej; Wichmann, Rolf

2013-05-01

Gas stripping and pervaporation are investigated for butanol recovery in a two-stage acetone-butanol-ethanol (ABE) fermentation process. The first stage is operated in a continuous mode and the second stage as a fed-batch. Gas stripping coupled to the second stage and operated intermittently enabled additional glucose feeding in the second stage and up to 59 g/L butanol and 73 g/L total ABE solvents in the condensate. Concentration of 167 g/L butanol and 269 g/L ABE in the permeate was measured in ex situ pervaporation experiments using a PDMS membrane at temperature of 37 °C and pressure of 10mbars. The "operating window" tool is introduced to evaluate the feasibility of the existing ABE fermentations operated as continuous with cell recycle, as two-stages, with biomass immobilization or with integrated product removal. This tool enables the identification of the most favorable process configuration, which is the combination of cell immobilization and integrated product removal. Copyright © 2013 Elsevier Ltd. All rights reserved.

Gray scale x-ray mask

DOEpatents

Morales, Alfredo M [Livermore, CA; Gonzales, Marcela [Seattle, WA

2006-03-07

The present invention describes a method for fabricating an embossing tool or an x-ray mask tool, providing microstructures that smoothly vary in height from point-to-point in etched substrates, i.e., structure which can vary in all three dimensions. The process uses a lithographic technique to transfer an image pattern in the surface of a silicon wafer by exposing and developing the resist and then etching the silicon substrate. Importantly, the photoresist is variably exposed so that when developed some of the resist layer remains. The remaining undeveloped resist acts as an etchant barrier to the reactive plasma used to etch the silicon substrate and therefore provides the ability etch structures of variable depths.

Novel fluoro copolymers for 157-nm photoresists: a progress report

NASA Astrophysics Data System (ADS)

Hohle, Christoph; Hien, Stefan; Eschbaumer, Christian; Rottstegge, Joerg; Sebald, Michael

2002-07-01

Several fluoro-substituted polymers consisting of acid cleavable methacryoic or cinnamic acid tert.-butyl ester compounds copolymerized with maleic acid anhydride derivatives were synthesized by radical copolymerization. Vacuum ultraviolet transmission measurements of the samples reveal absorbances down to 5micrometers -1 despite of the strongly absorbing anhydride moiety which serves as silylation anchor for the application of the Chemical Amplification of Resist Lines (CARL) process, one of the promising approaches for sub-90nm pattern fabrication. Some of the samples exhibit resolutions down to 110nm dense at 157nm exposure using an alternating phase shift mask. The feasibility of the CARL principle including the silylation reaction after development has been demonstrated with selected fluorinated polymer samples.

Large-core single-mode rib SU8 waveguide using solvent-assisted microcontact molding.

PubMed

Huang, Cheng-Sheng; Wang, Wei-Chih

2008-09-01

This paper describes a novel fabrication technique for constructing a polymer-based large-core single-mode rib waveguide. A negative tone SU8 photoresist with a high optical transmission over a large wavelength range and stable mechanical properties was used as a waveguide material. A waveguide was constructed by using a polydimethylsiloxane stamp combined with a solvent-assisted microcontact molding technique. The effects on the final pattern's geometry of four different process conditions were investigated. Optical simulations were performed using beam propagation method software. Single-mode beam propagation was observed at the output of the simulated waveguide as well as the actual waveguide through the microscope image.

Trends in Dielectric Etch for Microelectronics Processing

NASA Astrophysics Data System (ADS)

Hudson, Eric A.

2003-10-01

Dielectric etch technology faces many challenges to meet the requirements for leading-edge microelectronics processing. The move to sub 100-nm device design rules increases the aspect ratios of certain features, imposes tighter restrictions on etched features' critical dimensions, and increases the density of closely packed arrays of features. Changes in photolithography are driving transitions to new photoresist materials and novel multilayer resist methods. The increasing use of copper metallization and low-k interlayer dielectric materials has introduced dual-damascene integration methods, with specialized dielectric etch applications. A common need is the selective removal of multiple layers which have very different compositions, while maintaining close control of the etched features' profiles. To increase productivity, there is a growing trend toward in-situ processing, which allows several films to be successively etched during a single pass through the process module. Dielectric etch systems mainly utilize capacitively coupled etch reactors, operating with medium-density plasmas and low gas residence time. Commercial technology development increasingly relies upon plasma diagnostics and modeling to reduce development cycle time and maximize performance.

Fabrication of high quality aspheric microlens array by dose-modulated lithography and surface thermal reflow

NASA Astrophysics Data System (ADS)

Huang, Shengzhou; Li, Mujun; Shen, Lianguan; Qiu, Jinfeng; Zhou, Youquan

2018-03-01

A novel fabrication method for high quality aspheric microlens array (MLA) was developed by combining the dose-modulated DMD-based lithography and surface thermal reflow process. In this method, the complex shape of aspheric microlens is pre-modeled via dose modulation in a digital micromirror device (DMD) based maskless projection lithography. And the dose modulation mainly depends on the distribution of exposure dose of photoresist. Then the pre-shaped aspheric microlens is polished by a following non-contact thermal reflow (NCTR) process. Different from the normal process, the reflow process here is investigated to improve the surface quality while keeping the pre-modeled shape unchanged, and thus will avoid the difficulties in generating the aspheric surface during reflow. Fabrication of a designed aspheric MLA with this method was demonstrated in experiments. Results showed that the obtained aspheric MLA was good in both shape accuracy and surface quality. The presented method may be a promising approach in rapidly fabricating high quality aspheric microlens with complex surface.

Application of Motion Induced Remote-Field Eddy-Current effect to online inspection and quality examination of rolling metallic strips

NASA Astrophysics Data System (ADS)

Sun, Yushi; Udpa, Satish; Lord, William; Udpa, Lalita; Ouyang, Tianhe

2001-04-01

The Motion Induced Remote-Field Eddy-Current (MIRFEC) effect was first observed in 1994. The effect was first exploited for detecting pipeline stress corrosion cracks as a part of a research project sponsored by the U.S. Department of Transportation. This paper presents a new application of the MIRFEC effect for online inspection of rolling metallic strips. Currently, rolled metallic strips and sheets are inspected off-line, which is costly, time consuming and not ideal for quality control. A well-designed online diagnostic and control system for metal rolling process may be able to reduce cost, improve quality, and hence enhance competitiveness of the product. The overall objective of this paper is to demonstrate the feasibility of a new nondestructive measurement system for on-line diagnostics and control of metallic rolling process using the MIRFEC effect. The system can be used to monitor, in real time, metallic strips/sheets for possible anomalies, inclusions, voids, bubbles, lamination, as well as variations in its magnetic and other properties. The potential advantages of the MIRFEC system include simplicity, robustness, low cost, high reliability, quick and accurate signal classification and characterization. Such systems can be used for real-time process control, or off-line data analysis. The technique also allows operation at high temperatures, tolerates large lift-off and vibration, and high rolling speed. Results of finite element modeling of the MIRFEC effect and experimental measurement data obtained from a prototype system are presented.

The Hydrodynamics of Galaxy Transformation in Extreme Cluster Environments

NASA Astrophysics Data System (ADS)

Vijayaraghavan, Rukmani

2017-08-01

Cluster of galaxies are hostile environments. Infalling cluster galaxies are stripped of their dark matter, stars, and hot and cold interstellar medium gas. The ISM, in addition to tidal and ram pressure stripping, can evaporate due to thermal conduction. Gas loss and the subsequent suppression of star formation is not straightforward: magnetic fields in the ISM and ICM shield galaxies and their stripped tails from shear instabilities and conduction, radiative cooling can inhibit gas loss, and feedback from stars and AGN can replenish the ISM. While there is observational evidence that these processes operate, a theoretical understanding of the physics controlling the energy cycle in cluster galaxies remains elusive. Additionally, galaxies have a significant impact on ICM evolution: orbiting galaxies stir up and stretch ICM magnetic field lines, inject turbulence into the ICM via their wakes and g-waves, and infuse metals into the ICM. Quantifying the balance between processes that remove, retain, and replenish the ISM, and the impact of galaxies on the ICM require specialized hydrodynamic simulations of the cluster environment and its galaxies. I will present results from some of these simulations that include ram pressure stripping of galaxies' hot ISM, the effect of magnetic fields on this process, and the effectiveness of isotropic and anisotropic thermal conduction in removing and retaining the ISM. I will also quantify magnetic field amplification and turbulence injection due to orbiting galaxies, and implications for X-ray and radio observations and measurements of galactic coronae, tails, magnetic fields, and turbulence.

NASADEM Overview and First Results: Shuttle Radar Topography Mission (SRTM) Reprocessing and Improvements

NASA Astrophysics Data System (ADS)

Buckley, S.; Agram, P. S.; Belz, J. E.; Crippen, R. E.; Gurrola, E. M.; Hensley, S.; Kobrick, M.; Lavalle, M.; Martin, J. M.; Neumann, M.; Nguyen, Q.; Rosen, P. A.; Shimada, J.; Simard, M.; Tung, W.

2015-12-01

NASADEM is a significant modernization of SRTM digital elevation model (DEM) data supported by the NASA MEaSUREs program. We are reprocessing the raw radar signal data using improved algorithms and incorporating ICESat and ASTER-derived DEM data unavailable during the original processing. The NASADEM products will be freely-available through the Land Processes Distributed Active Archive Center (LPDAAC) at 1-arcsecond spacing. The most significant processing improvements involve void reduction through improved phase unwrapping and using ICESat data for control. The updated unwrapping strategy now includes the use of SNAPHU for data processing patches where the unwrapped coverage from the original residue-based unwrapper falls below a coverage threshold. In North America continental processing, first experiments show the strip void area is reduced by more than 50% and the number of strip void patches is reduced by 40%. Patch boundary voids are mitigated by reprocessing with a different starting burst and merging the unwrapping results. We also updated a low-resolution elevation database to aid with unwrapping bootstrapping, retaining isolated component of unwrapped phase, and assessing the quality of the strip DEMs. We introduce a height ripple error correction to reduce artifacts in the strip elevation data. These ripples are a few meters in size with along-track spatial scales of tens of kilometers and are due to uncompensated mast motion most pronounced after Shuttle roll angle adjustment maneuvers. We developed an along-track filter utilizing differences between the SRTM heights and ICESat lidar elevation data. For a test using all data over North America, the algorithm reduced the ICESat-SRTM bias from 80 cm to 3 cm and the RMS from 5m to 4m. After merging and regridding the SRTM strip DEMs into 1x1-degree tiles, remaining voids are primarily filled with the ASTER-derived Global DEM. We use a Delta Surface Fill method to rubbersheet fill data across the void for a seamless merger. We find this to provide a more accurate fill than cut-and-paste patching. A new post-processing module creates DEM-derived layers from the void-free elevation data. The slope/aspect & plan/profile curvatures are found by fitting a local quadratic surface to each DEM post and computing metrics from the fit coefficients.

Fabrication of ordered metallic glass nanotube arrays for label-free biosensing with diffractive reflectance.

PubMed

Chen, Wei-Ting; Li, Shao-Sian; Chu, Jinn P; Feng, Kuei Chih; Chen, Jem-Kun

2018-04-15

In this study, a photoresist template with well-defined contact hole array was fabricated, to which radio frequency magnetron sputtering process was then applied to deposit an alloyed Zr 55 Cu 30 Al 10 Ni 5 target, and finally resulted in ordered metallic glass nanotube (MGNT) arrays after removal of the photoresist template. The thickness of the MGNT walls increased from 98 to 126nm upon increasing the deposition time from 225 to 675s. The wall thickness of the MGNT arrays also increased while the dimensions of MGNT reduced under the same deposition condition. The MGNT could be filled with biomacromolecules to change the effective refractive index. The air fraction of the medium layer were evaluated through static water contact angle measurements and, thereby, the effective refractive indices the transverse magnetic (TM) and transverse electric (TE) polarized modes were calculated. A standard biotin-streptavidin affinity model was tested using the MGNT arrays and the fundamental response of the system was investigated. Results show that filling the MGNT with streptavidin altered the effective refractive index of the layer, the angle of reflectance and color changes identified by an L*a*b* color space and color circle on an a*b* chromaticity diagram. The limit of detection (LOD) of the MGNT arrays for detection of streptavidin was estimated as 25nM, with a detection time of 10min. Thus, the MGNT arrays may be used as a versatile platform for high-sensitive label-free optical biosensing. Copyright © 2017 Elsevier B.V. All rights reserved.

Freestanding membrane composed of micro-ring array with ultrahigh sidewall aspect ratio for application in lightweight cathode arrays

NASA Astrophysics Data System (ADS)

Wang, Lanlan; Liu, Hongzhong; Jiang, Weitao; Gao, Wei; Chen, Bangdao; Li, Xin; Ding, Yucheng; An, Ningli

2014-12-01

A freestanding multilayer ultrathin nano-membrane (FUN-membrane) with a micro-ring array (MRA) is successfully fabricated through the controllable film deposition. Each micro-ring of FUN-membrane is 3 μm in diameter, 2 μm in height and sub-100 nm in sidewall thickness, demonstrating an ultrahigh sidewall aspect ratio of 20:1. In our strategy, a silica layer (200 nm in thickness), a chromium transition layer (5 nm-thick) and a gold layer (40 nm-thick), were in sequence deposited on patterned photoresist. After removal of the photoresist by lift-off process, a FUN-membrane with MRA was peeled off from the substrate, where the gold layer acted as a protecting layer to prevent the MRA from fracture. The FUN-membrane was then transferred to a flexible polycarbonate (PC) sheet coated with indium tin oxide (ITO) layer, which was then used as a flexible and lightweight cathode. Remarkably, the field emission effect of the fabricated FUN-membrane cathode performs a high field-enhancement factor of 1.2 × 104 and a low turn-on voltage of 2 V/μm, indicating the advantages of the sharp metal edge of MRA. Due to the rational design and material versatility, the FUN-membrane thus could be transferred to either rigid or flexible substrate, even curved surface, such as the skin of bio-robot's arm or leg. Additionally, the FUN-membrane composed of MRA with extremely high aspect ratio of insulator-metal sidewall, also provides potential applications in optical devices, lightweight and flexible display devices, and electronic eye imagers.

Effect of asymmetric hot rolling on texture, microstructure and magnetic properties in a non-grain oriented electrical steel

NASA Astrophysics Data System (ADS)

Chen, S.; Butler, J.; Melzer, S.

2014-11-01

In this study, both asymmetric hot rolling (AHR) and conventional hot rolling (CHR) were carried out to study the effect of the hot rolling conditions on the evolution of the texture and microstructure in a non-grain oriented (NGO) steel. The microstructure and texture in the subsequent processing stages were characterised and related to the final magnetic properties. The results show that AHR, compared with CHR, tends to homogenise texture through thickness of the hot band strips. AHR results in a higher fraction of the θ-fibre ({0 0 1}) and a lower fraction of the γ-fibre ({1 1 1}) in the hot band strips, which are favourable features in relation to the magnetic properties of the strip. However, the favourable features observed in hot rolled AHR strips are eliminated after cold rolling and annealing. Contrarily, the required θ-fibre is decreased and the unwanted γ-fibre is intensified in the AHR sheet after cold rolling and their strength is maintained in the subsequent process steps. On the other hand, AHR does not produce a discernible change in the grain size in the hot band annealed strip and in the final annealed sheet, except that the magnetic anisotropy in the AHR is improved after skin pass and extra annealing as the result of the redistribution of the texture components within the θ-fibre, no significant improvement of the magnetic properties as a direct consequence of the application of asymmetric hot rolling has been observed under the current AHR experimental conditions.