Evaluation of microfabricated deformable mirror systems

NASA Astrophysics Data System (ADS)

Cowan, William D.; Lee, Max K.; Bright, Victor M.; Welsh, Byron M.

1998-09-01

This paper presents recent result for aberration correction and beam steering experiments using polysilicon surface micromachined piston micromirror arrays. Microfabricated deformable mirrors offer a substantial cost reduction for adaptive optic systems. In addition to the reduced mirror cost, microfabricated mirrors typically require low control voltages, thus eliminating high voltage amplifiers. The greatly reduced cost per channel of adaptive optic systems employing microfabricated deformable mirrors promise high order aberration correction at low cost. Arrays of piston micromirrors with 128 active elements were tested. Mirror elements are on a 203 micrometers 12 by 12 square grid. The overall array size is 2.4 mm square. The arrays were fabricated in the commercially available DARPA supported MUMPs surface micromachining foundry process. The cost per mirror array in this prototyping process is less than 200 dollars. Experimental results are presented for a hybrid correcting element comprised of a lenslet array and piston micromirror array, and for a piston micromirror array only. Also presented is a novel digital deflection micromirror which requires no digital to analog converters, further reducing the cost of adaptive optics system.

Surface Micromachined Silicon Carbide Accelerometers for Gas Turbine Applications

NASA Technical Reports Server (NTRS)

DeAnna, Russell G.

1998-01-01

A finite-element analysis of possible silicon carbide (SIC) folded-beam, lateral-resonating accelerometers is presented. Results include stiffness coefficients, acceleration sensitivities, resonant frequency versus temperature, and proof-mass displacements due to centripetal acceleration of a blade-mounted sensor. The surface micromachined devices, which are similar to the Analog Devices Inc., (Norwood, MA) air-bag crash detector, are etched from 2-pm thick, 3C-SiC films grown at 1600 K using atmospheric pressure chemical vapor deposition (APCVD). The substrate is a 500 gm-thick, (100) silicon wafer. Polysilicon or silicon dioxide is used as a sacrificial layer. The finite element analysis includes temperature-dependent properties, shape change due to volume expansion, and thermal stress caused by differential thermal expansion of the materials. The finite-element results are compared to experimental results for a SiC device of similar, but not identical, geometry. Along with changes in mechanical design, blade-mounted sensors would require on-chip circuitry to cancel displacements due to centripetal acceleration and improve sensitivity and bandwidth. These findings may result in better accelerometer designs for this application.

Surface micromachined MEMS deformable mirror based on hexagonal parallel-plate electrostatic actuator

NASA Astrophysics Data System (ADS)

Ma, Wenying; Ma, Changwei; Wang, Weimin

2018-03-01

Deformable mirrors (DM) based on microelectromechanical system (MEMS) technology are being applied in adaptive optics (AO) system for astronomical telescopes and human eyes more and more. In this paper a MEMS DM with hexagonal actuator is proposed and designed. The relationship between structural design and performance parameters, mainly actuator coupling, is analyzed carefully and calculated. The optimum value of actuator coupling is obtained. A 7-element DM prototype is fabricated using a commercial available standard three-layer polysilicon surface multi-user-MEMS-processes (PolyMUMPs). Some key performances, including surface figure and voltage-displacement curve, are measured through a 3D white light profiler. The measured performances are very consistent with the theoretical values. The proposed DM will benefit the miniaturization of AO systems and lower their cost.

Microfabricated microengine with constant rotation rate

DOEpatents

Romero, Louis A.; Dickey, Fred M.

1999-01-01

A microengine uses two synchronized linear actuators as a power source and converts oscillatory motion from the actuators into constant rotational motion via direct linkage connection to an output gear or wheel. The microengine provides output in the form of a continuously rotating output gear that is capable of delivering drive torque at a constant rotation to a micromechanism. The output gear can have gear teeth on its outer perimeter for directly contacting a micromechanism requiring mechanical power. The gear is retained by a retaining means which allows said gear to rotate freely. The microengine is microfabricated of polysilicon on one wafer using surface micromachining batch fabrication.

Evaluation of Thermo-Mechanical Stability of COTS Dual-Axis MEMS Accelerometers for Space Applications

NASA Technical Reports Server (NTRS)

Sharma, Ashok K.; Teverovksy, Alexander; Day, John H. (Technical Monitor)

2000-01-01

Microelectromechanical systems in MEMS is one of the fastest growing technologies in microelectronics, and is of great interest for military and aerospace applications. Accelerometers are the earliest and most developed representatives of MEMS. First demonstrated in 1979, micromachined accelerometers were used in automobile industry for air bag crash- sensing applications since 1990. In 1999, N4EMS accelerometers were used in NASA-JPL Mars Microprobe. The most developed accelerometers for airbag crash- sensing are rated for a full range of +/- 50 G. The range of sensitivity for accelerometers required for military or aerospace applications is much larger, varying from 20,000 G (to measure acceleration during gun and ballistic munition launches), and to 10(exp -6) G, when used as guidance sensors (to measure attitude and position of a spacecraft). The presence of moving parts on the surface of chip is specific to MEMS, and particularly, to accelerometers. This characteristic brings new reliability issues to micromachined accelerometers, including cyclic fatigue cracking of polysilicon cantilevers and springs, mechanical stresses that are caused by packaging and contamination in the internal cavity of the package. Studies of fatigue cracks initiation and growth in polysilicon showed that the fatigue damage may influence MEMS device performance, and the presence of water vapor significantly enhances crack initiation and growth. Environmentally induced failures, particularly, failures due to thermal cycling and mechanical shock are considered as one of major reliability concerns in MEMS. These environmental conditions are also critical for space applications of the parts. For example, the Mars pathfinder mission had experienced 80 mechanical shock events during the pyrotechnic separation processes.

Operating principles of an electrothermal vibrometer for optical switching applications

NASA Astrophysics Data System (ADS)

Pai, Min-fan; Tien, Norman C.

1999-09-01

A compact polysilicon surface-micromachined microactuator designed for optical switching applications is described. This actuator is fabricated using the foundry MUMPs process provided by Cronos Integrated Microsystems Inc. Actuated electrothermally, the microactuator allows fast switching speeds and can be operated with a low voltage square-wave signal. The design, operation mechanisms for this long-range and high frequency thermal actuation are described. A vertical micromirror integrated with this actuator can be operated with a 10.5 V, 20 kHz 15% duty-cycle pulse signal, achieving a lateral moving speed higher than 15.6 mm/sec. The optical switch has been operated to frequencies as high as 30 kHz.

Microelectromechanical gyroscope

DOEpatents

Garcia, Ernest J.

1999-01-01

A gyroscope powered by an engine, all fabricated on a common substrate in the form of an integrated circuit. Preferably, both the gyroscope and the engine are fabricated in the micrometer domain, although in some embodiments of the present invention, the gyroscope can be fabricated in the millimeter domain. The engine disclosed herein provides torque to the gyroscope rotor for continuous rotation at varying speeds and direction. The present invention is preferably fabricated of polysilicon or other suitable materials on a single wafer using surface micromachining batch fabrication techniques or millimachining techniques that are well known in the art. Fabrication of the present invention is preferably accomplished without the need for assembly of multiple wafers which require alignment and bonding, and without piece-part assembly.

An all-silicon single-wafer micro-g accelerometer with a combined surface and bulk micromachining process

NASA Technical Reports Server (NTRS)

Yazdi, N.; Najafi, K.

2000-01-01

This paper reports an all-silicon fully symmetrical z-axis micro-g accelerometer that is fabricated on a single-silicon wafer using a combined surface and bulk fabrication process. The microaccelerometer has high device sensitivity, low noise, and low/controllable damping that are the key factors for attaining micro g and sub-micro g resolution in capacitive accelerometers. The microfabrication process produces a large proof mass by using the whole wafer thickness and a large sense capacitance by utilizing a thin sacrificial layer. The sense/feedback electrodes are formed by a deposited 2-3 microns polysilicon film with embedded 25-35 microns-thick vertical stiffeners. These electrodes, while thin, are made very stiff by the thick embedded stiffeners so that force rebalancing of the proof mass becomes possible. The polysilicon electrodes are patterned to create damping holes. The microaccelerometers are batch-fabricated, packaged, and tested successfully. A device with a 2-mm x 1-mm proof mass and a full bridge support has a measured sensitivity of 2 pF/g. The measured sensitivity of a 4-mm x 1-mm accelerometer with a cantilever support is 19.4 pF/g. The calculated noise floor of these devices at atmosphere are 0.23 micro g/sqrt(Hz) and 0.16 micro g/sqrt(Hz), respectively.

Design and Characterization of Next-Generation Micromirrors Fabricated in a Four-Level, Planarized Surface-Micromachined Polycrystalline Silicon Process

DOE Office of Scientific and Technical Information (OSTI.GOV)

Michalicek, M.A.; Comtois, J.H.; Barron, C.C.

This paper describes the design and characterization of several types of micromirror devices to include process capabilities, device modeling, and test data resulting in deflection versus applied potential curves. These micromirror devices are the first to be fabricated in the state-of-the-art four-level planarized polysilicon process available at Sandia National Laboratories known as the Sandia Ultra-planar Multi-level MEMS Technology (SUMMiT). This enabling process permits the development of micromirror devices with near-ideal characteristics which have previously been unrealizable in standard three-layer polysilicon processes. This paper describes such characteristics as elevated address electrodes, individual address wiring beneath the device, planarized mirror surfaces usingmore » Chemical Mechanical Polishing (CMP), unique post-process metallization, and the best active surface area to date. This paper presents the design, fabrication, modeling, and characterization of several variations of Flexure-Beam (FBMD) and Axial-Rotation Micromirror Devices (ARMD). The released devices are first metallized using a standard sputtering technique relying on metallization guards and masks that are fabricated next to the devices. Such guards are shown to enable the sharing of bond pads between numerous arrays of micromirrors in order to maximize the number of on-chip test arrays. The devices are modeled and then empirically characterized using a laser interferometer setup located at the Air Force Institute of Technology (AFIT) at Wright-Patterson AFB in Dayton, Ohio. Unique design considerations for these devices and the process are also discussed.« less

An electromechanical material testing system for in situ electron microscopy and applications.

PubMed

Zhu, Yong; Espinosa, Horacio D

2005-10-11

We report the development of a material testing system for in situ electron microscopy (EM) mechanical testing of nanostructures. The testing system consists of an actuator and a load sensor fabricated by means of surface micromachining. This previously undescribed nanoscale material testing system makes possible continuous observation of the specimen deformation and failure with subnanometer resolution, while simultaneously measuring the applied load electronically with nanonewton resolution. This achievement was made possible by the integration of electromechanical and thermomechanical components based on microelectromechanical system technology. The system capabilities are demonstrated by the in situ EM testing of free-standing polysilicon films, metallic nanowires, and carbon nanotubes. In particular, a previously undescribed real-time instrumented in situ transmission EM observation of carbon nanotubes failure under tensile load is presented here.

Doping and structural properties for the phosphorous-doped polysilicon layers used for micromechanical applications

NASA Astrophysics Data System (ADS)

Gaiseanu, Florin; Esteve, Jaume; Cane, Carles; Perez-Rodriguez, Alejandro; Morante, Juan R.; Serre, Christoph

1999-08-01

Our researches were devoted to the micromechanical elements fabricated by the surface micromachining technology, in order to reduce or to eliminate the internal stress or the stress gradients. We used an analysis based on secondary ion mass spectroscopy and the spreading resistance profiling determinations, correlated with cross-section electron transmission spectroscopy. The stress induced in the polysilicon layers by the technological processes depends on: (i) the conditions of the low pressure chemical vapor deposition process; (ii) the phosphorus doping technique; (iii) the subsequent multi-step annealing processes. In our experiments the LP-CVD conditions were maintained the same, but the condition specified previously as items (ii) was varied by using two different doping techniques: thermal- chemical doping consisting in prediffusion from a POCl3 source in an open furnace tube; ionic implantation with an energy E equals 65KeV and a dose N equals 4.5 X 1015 cm-2. The implantation process was followed by an annealing at 900 degrees C in an oxygen ambient for 30 minutes. The thermal budget was varied after the doping in order to reduce the stress gradient in the polysilicon layers. The results of our analysis allow us to show that: (1) the doping gradients are correlated with the slower phosphorus grains forme by an excess of the oxygen atoms; a concurrent process induced by the silicon self-interstitial injection during the diffusion and oxidation, determines the enhancement of the grain growth and therefore the enhancement of the electrical activation especially near the internal polysilicon interface; (2) the post-doping annealing conditions could be varied in a convenient manner, so that the doping induced stress gradients into the polysilicon layers to be reduced or completely eliminated for suitable micromechanical induced stress gradients into the polysilicon layers to be reduced or completely eliminated for suitable micromechanical applications. The results were used for the process optimization of micromechanical elements. The internal stress was determined by using anew, pull-in voltage method, allowing the comparison of the theory with the experimental data. It was deduced a new form of the equations set useful to extract the mechanical parameters like the internal stress and the Young's module. It was also deduced a simplified approximate formula useful to apply the least square fitting method for the extraction of the mechanical parameters. The results confirms the conclusions of the doping and the structural analysis.

Method for selective CMP of polysilicon

NASA Technical Reports Server (NTRS)

Babu, Suryadevara V. (Inventor); Natarajan, Anita (Inventor); Hegde, Sharath (Inventor)

2010-01-01

A method of removing polysilicon in preference to silicon dioxide and/or silicon nitride by chemical mechanical polishing. The method removes polysilicon from a surface at a high removal rate while maintaining a high selectivity of polysilicon to silicon dioxide and/or a polysilicon to silicon nitride. The method is particularly suitable for use in the fabrication of MEMS devices.

Microfabricated microengine for use as a mechanical drive and power source in the microdomain and fabrication process

DOEpatents

Garcia, Ernest J.; Sniegowski, Jeffry J.

1997-01-01

A microengine uses two synchronized linear actuators as a power source and converts oscillatory motion from the actuators into rotational motion via direct linkage connection to an output gear or wheel. The microengine provides output in the form of a continuously rotating output gear that is capable of delivering drive torque to a micromechanism. The microengine can be operated at varying speeds and its motion can be reversed. Linear actuators are synchronized in order to provide linear oscillatory motion to the linkage means in the X and Y directions according to a desired position, rotational direction and speed of said mechanical output means. The output gear has gear teeth on its outer perimeter for directly contacting a micromechanism requiring mechanical power. The gear is retained by a retaining means which allows said gear to rotate freely. The microengine is microfabricated of polysilicon on one wafer using surface micromachining batch fabrication.

Micromachined low frequency rocking accelerometer with capacitive pickoff

DOEpatents

Lee, Abraham P.; Simon, Jonathon N.; McConaghy, Charles F.

2001-01-01

A micro electro mechanical sensor that uses capacitive readout electronics. The sensor involves a micromachined low frequency rocking accelerometer with capacitive pickoff fabricated by deep reactive ion etching. The accelerometer includes a central silicon proof mass, is suspended by a thin polysilicon tether, and has a moving electrode (capacitor plate or interdigitated fingers) located at each end the proof mass. During movement (acceleration), the tethered mass moves relative to the surrounding packaging, for example, and this defection is measured capacitively by a plate capacitor or interdigitated finger capacitor, having the cooperating fixed electrode (capacitor plate or interdigitated fingers) positioned on the packaging, for example. The micromachined rocking accelerometer has a low frequency (<500 Hz), high sensitivity (.mu.G), with minimal power usage. The capacitors are connected to a power supply (battery) and to sensor interface electronics, which may include an analog to digital (A/D) converter, logic, RF communication link, antenna, etc. The sensor (accelerometer) may be, for example, packaged along with the interface electronics and a communication system in a 2".times.2".times.2" cube. The proof mass may be asymmetric or symmetric. Additional actuating capacitive plates may be used for feedback control which gives a greater dynamic range.

Structure disorder degree of polysilicon thin films grown by different processing: Constant C from Raman spectroscopy

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wang, Quan, E-mail: wangq@mail.ujs.edu.cn; State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000; Zhang, Yanmin

2013-11-14

Flat, low-stress, boron-doped polysilicon thin films were prepared on single crystalline silicon substrates by low pressure chemical vapor deposition. It was found that the polysilicon films with different deposition processing have different microstructure properties. The confinement effect, tensile stresses, defects, and the Fano effect all have a great influence on the line shape of Raman scattering peak. But the effect results are different. The microstructure and the surface layer are two important mechanisms dominating the internal stress in three types of polysilicon thin films. For low-stress polysilicon thin film, the tensile stresses are mainly due to the change of microstructuremore » after thermal annealing. But the tensile stresses in flat polysilicon thin film are induced by the silicon carbide layer at surface. After the thin film doped with boron atoms, the phenomenon of the tensile stresses increasing can be explained by the change of microstructure and the increase in the content of silicon carbide. We also investigated the disorder degree states for three polysilicon thin films by analyzing a constant C. It was found that the disorder degree of low-stress polysilicon thin film larger than that of flat and boron-doped polysilicon thin films due to the phase transformation after annealing. After the flat polysilicon thin film doped with boron atoms, there is no obvious change in the disorder degree and the disorder degree in some regions even decreases.« less

Micromachined optical microphone structures with low thermal-mechanical noise levels.

PubMed

Hall, Neal A; Okandan, Murat; Littrell, Robert; Bicen, Baris; Degertekin, F Levent

2007-10-01

Micromachined microphones with diffraction-based optical displacement detection have been introduced previously [Hall et al., J. Acoust. Soc. Am. 118, 3000-3009 (2005)]. The approach has the advantage of providing high displacement detection resolution of the microphone diaphragm independent of device size and capacitance-creating an unconstrained design space for the mechanical structure itself. Micromachined microphone structures with 1.5-mm-diam polysilicon diaphragms and monolithically integrated diffraction grating electrodes are presented in this work with backplate architectures that deviate substantially from traditional perforated plate designs. These structures have been designed for broadband frequency response and low thermal mechanical noise levels. Rigorous experimental characterization indicates a diaphragm displacement detection resolution of 20 fm radicalHz and a thermal mechanical induced diaphragm displacement noise density of 60 fm radicalHz, corresponding to an A-weighted sound pressure level detection limit of 24 dB(A) for these structures. Measured thermal mechanical displacement noise spectra are in excellent agreement with simulations based on system parameters derived from dynamic frequency response characterization measurements, which show a diaphragm resonance limited bandwidth of approximately 20 kHz. These designs are substantial improvements over initial prototypes presented previously. The high performance-to-size ratio achievable with this technology is expected to have an impact on a variety of instrumentation and hearing applications.

Analysis of out-of-plane thermal microactuators

NASA Astrophysics Data System (ADS)

Atre, Amarendra

2006-02-01

Out-of-plane thermal microactuators find applications in optical switches to motivate micromirrors. Accurate analysis of such actuators is beneficial for improving existing designs and constructing more energy efficient actuators. However, the analysis is complicated by the nonlinear deformation of the thermal actuators along with temperature-dependent properties of polysilicon. This paper describes the development, modeling issues and results of a three-dimensional multiphysics nonlinear finite element model of surface micromachined out-of-plane thermal actuators. The model includes conductive and convective cooling effects and takes into account the effect of variable air gap on the response of the actuator. The model is implemented to investigate the characteristics of two diverse MUMPs fabricated out-of-plane thermal actuators. Reasonable agreement is observed between simulated and measured results for the model that considers the influence of air gap on actuator response. The usefulness of the model is demonstrated by implementing it to observe the effect of actuator geometry variation on steady-state deflection response.

Resonant capacitive MEMS acoustic emission transducers

NASA Astrophysics Data System (ADS)

Ozevin, D.; Greve, D. W.; Oppenheim, I. J.; Pessiki, S. P.

2006-12-01

We describe resonant capacitive MEMS transducers developed for use as acoustic emission (AE) detectors, fabricated in the commercial three-layer polysilicon surface micromachining process (MUMPs). The 1 cm square device contains six independent transducers in the frequency range between 100 and 500 kHz, and a seventh transducer at 1 MHz. Each transducer is a parallel plate capacitor with one plate free to vibrate, thereby causing a capacitance change which creates an output signal in the form of a current under a dc bias voltage. With the geometric proportions we employed, each transducer responds with two distinct resonant frequencies. In our design the etch hole spacing was chosen to limit squeeze film damping and thereby produce an underdamped vibration when operated at atmospheric pressure. Characterization experiments obtained by capacitance and admittance measurements are presented, and transducer responses to physically simulated AE source are discussed. Finally, we report our use of the device to detect acoustic emissions associated with crack initiation and growth in weld metal.

Microfabricated microengine for use as a mechanical drive and power source in the microdomain and fabrication process

DOEpatents

Garcia, E.J.; Sniegowski, J.J.

1997-05-20

A microengine uses two synchronized linear actuators as a power source and converts oscillatory motion from the actuators into rotational motion via direct linkage connection to an output gear or wheel. The microengine provides output in the form of a continuously rotating output gear that is capable of delivering drive torque to a micromechanism. The microengine can be operated at varying speeds and its motion can be reversed. Linear actuators are synchronized in order to provide linear oscillatory motion to the linkage means in the X and Y directions according to a desired position, rotational direction and speed of said mechanical output means. The output gear has gear teeth on its outer perimeter for directly contacting a micromechanism requiring mechanical power. The gear is retained by a retaining means which allows said gear to rotate freely. The microengine is microfabricated of polysilicon on one wafer using surface micromachining batch fabrication. 30 figs.

Compliant displacement-multiplying apparatus for microelectromechanical systems

DOEpatents

Kota, Sridhar; Rodgers, M. Steven; Hetrick, Joel A.

2001-01-01

A pivotless compliant structure is disclosed that can be used to increase the geometric advantage or mechanical advantage of a microelectromechanical (MEM) actuator such as an electrostatic comb actuator, a capacitive-plate electrostatic actuator, or a thermal actuator. The compliant structure, based on a combination of interconnected flexible beams and cross-beams formed of one or more layers of polysilicon or silicon nitride, can provide a geometric advantage of from about 5:1 to about 60:1 to multiply a 0.25-3 .mu.m displacement provided by a short-stroke actuator so that such an actuator can be used to generate a displacement stroke of about 10-34 .mu.m to operate a ratchet-driven MEM device or a microengine. The compliant structure has less play than conventional displacement-multiplying devices based on lever arms and pivoting joints, and is expected to be more reliable than such devices. The compliant structure and an associated electrostatic or thermal actuator can be formed on a common substrate (e.g. silicon) using surface micromachining.

Method of drying passivated micromachines by dewetting from a liquid-based process

DOEpatents

Houston, Michael R.; Howe, Roger T.; Maboudian, Roya; Srinivasan, Uthara

2000-01-01

A method of fabricating a micromachine includes the step of constructing a low surface energy film on the micromachine. The micromachine is then rinsed with a rinse liquid that has a high surface energy, relative to the low surface energy film, to produce a contact angle of greater than 90.degree. between the low surface energy film and the rinse liquid. This relatively large contact angle causes any rinse liquid on the micromachine to be displaced from the micromachine when the micromachine is removed from the rinse liquid. In other words, the micromachine is dried by dewetting from a liquid-based process. Thus, a separate evaporative drying step is not required, as the micromachine is removed from the liquid-based process in a dry state. The relatively large contact angle also operates to prevent attractive capillary forces between micromachine components, thereby preventing contact and adhesion between adjacent microstructure surfaces. The low surface energy film may be constructed with a fluorinated self-assembled monolayer film. The processing of the invention avoids the use of environmentally harmful, health-hazardous chemicals.

Optical network of silicon micromachined sensors

NASA Astrophysics Data System (ADS)

Wilson, Mark L.; Burns, David W.; Zook, J. David

1996-03-01

The Honeywell Technology Center, in collaboration with the University of Wisconsin and the Mobil Corporation, and under funding from this ARPA sponsored program, are developing a new type of `hybrid' micromachined silicon/fiber optic sensor that utilizes the best attributes of each technology. Fiber optics provide a noise free method to read out the sensor without electrical power required at the measurement point. Micromachined silicon sensor techniques provide a method to design many different types of sensors such as temperature, pressure, acceleration, or magnetic field strength and report the sensor data using FDM methods. Our polysilicon resonant microbeam structures have a built in Fabry-Perot interferometer that offers significant advantages over other configurations described in the literature. Because the interferometer is an integral part of the structure, the placement of the fiber becomes non- critical, and packaging issues become considerably simpler. The interferometer spacing are determined by the thin-film fabrication processes and therefore can be extremely well controlled. The main advantage, however, is the integral vacuum cavity that ensures high Q values. Testing results have demonstrated relaxed alignment tolerances in packaging these devices, with an excellent Signal to Noise Ratio. Networks of 16 or more sensors are currently being developed. STORM (Strain Transduction by Optomechanical Resonant Microbeams) sensors can also provide functionality and self calibration information which can be used to improve the overall system reliability. Details of the sensor and network design, as well as test results, are presented.

Reconfigurable mask for adaptive coded aperture imaging (ACAI) based on an addressable MOEMS microshutter array

NASA Astrophysics Data System (ADS)

McNie, Mark E.; Combes, David J.; Smith, Gilbert W.; Price, Nicola; Ridley, Kevin D.; Brunson, Kevin M.; Lewis, Keith L.; Slinger, Chris W.; Rogers, Stanley

2007-09-01

Coded aperture imaging has been used for astronomical applications for several years. Typical implementations use a fixed mask pattern and are designed to operate in the X-Ray or gamma ray bands. More recent applications have emerged in the visible and infra red bands for low cost lens-less imaging systems. System studies have shown that considerable advantages in image resolution may accrue from the use of multiple different images of the same scene - requiring a reconfigurable mask. We report on work to develop a novel, reconfigurable mask based on micro-opto-electro-mechanical systems (MOEMS) technology employing interference effects to modulate incident light in the mid-IR band (3-5μm). This is achieved by tuning a large array of asymmetric Fabry-Perot cavities by applying an electrostatic force to adjust the gap between a moveable upper polysilicon mirror plate supported on suspensions and underlying fixed (electrode) layers on a silicon substrate. A key advantage of the modulator technology developed is that it is transmissive and high speed (e.g. 100kHz) - allowing simpler imaging system configurations. It is also realised using a modified standard polysilicon surface micromachining process (i.e. MUMPS-like) that is widely available and hence should have a low production cost in volume. We have developed designs capable of operating across the entire mid-IR band with peak transmissions approaching 100% and high contrast. By using a pixelated array of small mirrors, a large area device comprising individually addressable elements may be realised that allows reconfiguring of the whole mask at speeds in excess of video frame rates.

Enhancement of Electrical Properties of Nanostructured Polysilicon Layers Through Hydrogen Passivation.

PubMed

Zhou, D; Xu, T; Lambert, Y; Cristini-Robbe; Stiévenard, D

2015-12-01

The light absorption of polysilicon planar junctions can be improved using nanostructured top surfaces due to their enhanced light harvesting properties. Nevertheless, associated with the higher surface, the roughness caused by plasma etching and defects located at the grain boundary in polysilicon, the concentration of the recombination centers increases, leading to electrical performance deterioration. In this work, we demonstrate that wet oxidation combined with hydrogen passivation using SiN(x):H are the key technological processes to significantly decrease the surface recombination and improve the electrical properties of nanostructured n(+)-i-p junctions. Nanostructured surface is fabricated by nanosphere lithography in a low-cost and controllable approach. Furthermore, it has been demonstrated that the successive annealing of silicon nitride films has significant effect on the passivation quality, resulting in some improvements on the efficiency of the Si nanostructure-based solar cell device.

Photolithographic surface micromachining of polydimethylsiloxane (PDMS).

PubMed

Chen, Weiqiang; Lam, Raymond H W; Fu, Jianping

2012-01-21

A major technical hurdle in microfluidics is the difficulty in achieving high fidelity lithographic patterning on polydimethylsiloxane (PDMS). Here, we report a simple yet highly precise and repeatable PDMS surface micromachining method using direct photolithography followed by reactive ion etching (RIE). Our method to achieve surface patterning of PDMS applied an O(2) plasma treatment to PDMS to activate its surface to overcome the challenge of poor photoresist adhesion on PDMS for photolithography. Our photolithographic PDMS surface micromachining technique is compatible with conventional soft lithography techniques and other silicon-based surface and bulk micromachining methods. To illustrate the general application of our method, we demonstrated fabrication of large microfiltration membranes and free-standing beam structures in PDMS.

Photolithographic surface micromachining of polydimethylsiloxane (PDMS)

PubMed Central

Chen, Weiqiang; Lam, Raymond H. W.

2014-01-01

A major technical hurdle in microfluidics is the difficulty in achieving high fidelity lithographic patterning on polydimethylsiloxane (PDMS). Here, we report a simple yet highly precise and repeatable PDMS surface micromachining method using direct photolithography followed by reactive ion etching (RIE). Our method to achieve surface patterning of PDMS applied an O2 plasma treatment to PDMS to activate its surface to overcome the challenge of poor photoresist adhesion on PDMS for photolithography. Our photolithographic PDMS surface micromachining technique is compatible with conventional soft lithography techniques and other silicon-based surface and bulk micromachining methods. To illustrate the general application of our method, we demonstrated fabrications of large microfiltration membranes and free-standing beam structures in PDMS. PMID:22089984

Electronic circuitry development in a micropyrotechnic system for micropropulsion applications

NASA Astrophysics Data System (ADS)

Puig-Vidal, Manuel; Lopez, Jaime; Miribel, Pere; Montane, Enric; Lopez-Villegas, Jose M.; Samitier, Josep; Rossi, Carole; Camps, Thierry; Dumonteuil, Maxime

2003-04-01

An electronic circuitry is proposed and implemented to optimize the ignition process and the robustness of a microthruster. The principle is based on the integration of propellant material within a micromachined system. The operational concept is simply based on the combustion of an energetic propellant stored in a micromachined chamber. Each thruster contains three parts (heater, chamber, nozzle). Due to the one shot characteristic, microthrusters are fabricated in 2D array configuration. For the functioning of this kind of system, one critical point is the optimization of the ignition process as a function of the power schedule delivered by electronic devices. One particular attention has been paid on the design and implementation of an electronic chip to control and optimize the system ignition. Ignition process is triggered by electrical power delivered to a polysilicon resistance in contact with the propellant. The resistance is used to sense the temperature on the propellant which is in contact. Temperature of the microthruster node before the ignition is monitored via the electronic circuitry. A pre-heating process before ignition seems to be a good methodology to optimize the ignition process. Pre-heating temperature and pre-heating time are critical parameters to be adjusted. Simulation and experimental results will deeply contribute to improve the micropyrotechnic system. This paper will discuss all these point.

Modeling and measurement of electrostatic micromirror array fabricated with single-layer polysilicon micromachining technology

NASA Astrophysics Data System (ADS)

Min, Young-Hoon; Kim, Yong-Kweon

1998-09-01

A silicon based micro mirror array is a highly efficient component for use in optical applications as adaptive optical systems and optical correlators. Many types of micro mirror or micro mirror array have been studied and proposed in order to obtain the optimal performance according to their own purposes. A micro mirror array designed, fabricated and tested in this paper consists of 5 X 5 single layer polysilicon-based, electrostatically driven actuators. The micro mirror array for the optical phase modulation is made by using only two masks and can be driven independently by 25 channel circuits. About 6 (pi) phase modulation is obtained in He-Ne laser ((lambda) equals 633 nm) with 67% fill-factor. In this paper, the deflection characteristics of the actuators in controllable range were studied. The experimental results show that the deflection characteristics is much dependent upon a residual stress in flexure, the initial curvature of mirror due to stress gradient and an electrostatic force acted on other element except for mirror itself. The modeling results agree well with the experimental results. Also, it is important to fabricate a flat mirror that is not initially curved because the curved mirror brings a bad performance in optical use. Therefore, a new method to obtain the flat mirror by using the gold metallization in spite of the residual stress unbalance is proposed in this paper.

Capacitive micromachined ultrasonic transducers using commercial multi-user MUMPs process: capability and limitations

PubMed Central

Liu, Jessica; Oakley, Clyde; Shandas, Robin

2009-01-01

The objective of this work is to construct capacitive micromachined ultrasouind transducers (cMUTs) using multi-user MEMS (MicroElectroMechanical Systems) process (MUMPs) and to analyze the capability of this process relative to the customized processes commonly in use. The MUMPs process has the advantages of low cost and accessibility to general users since it is not necessary to have access to customized fabrication capability such as wafer-bonding and sacrificial release processes. While other researchers have reported fabricating cMUTs using the MUMPs process none has reported the limitations in the process that arise due to the use of standard design rules that place limitations on the material thicknesses, gap thicknesses, and materials that may be used. In this paper we explain these limitations, and analyze the capabilities using 1D modeling, Finite Element Analysis, and experimental devices. We show that one of the limitations is that collapse voltage and center frequency can not be controlled independently. However, center frequencies up to 9 MHz can be achieved with collapse voltages of less than 200 volts making such devices suitable for medical and non-destructive evaluation imaging applications. Since the membrane and base electrodes are made of polysilicon, there is a larger series resistance than that resulting from processes that use metal electrodes. We show that the series resistance is not a significant problem. The conductive polysilicon can also destroy the cMUT if the top membrane is pulled in the bottom. As a solution we propose the application of an additional dielectric layer. Finally we demonstrate a device built with a novel beam construction that produces transmitted pressure pulse into air with 6% bandwidth and agrees reasonably well with the 1D model. We conclude that cMUTS made with MUMPS process have some limitations that are not present in customized processes. However these limitations may be overcome with the proper design considerations that we have presented putting a low cost, highly accessible means of making cMUT devices into the hands of academic and industrial researchers. PMID:19640557

Wafer scale micromachine assembly method

DOEpatents

Christenson, Todd R.

2001-01-01

A method for fusing together, using diffusion bonding, micromachine subassemblies which are separately fabricated is described. A first and second micromachine subassembly are fabricated on a first and second substrate, respectively. The substrates are positioned so that the upper surfaces of the two micromachine subassemblies face each other and are aligned so that the desired assembly results from their fusion. The upper surfaces are then brought into contact, and the assembly is subjected to conditions suited to the desired diffusion bonding.

Ultrasonic actuation for MEMS dormancy-related stiction reduction

NASA Astrophysics Data System (ADS)

Kaajakari, Ville; Kan, Shyi-Herng; Lin, Li-Jen; Lal, Amit; Rodgers, M. Steven

2000-08-01

The use of ultrasonic pulses incident on surface micromachines has been shown to reduce dormancy-related failure. We applied ultrasonic pulses from the backside of a silicon substrate carrying SUMMiT processed surface micromachined rotors, used earlier as ultrasonic motors. The amplitude of the pulses was less than what is required to actuate the rotor (sub-threshold actuation). By controlling the ultrasonic pulse exposure time it was found that pulsed samples had smaller actuation voltages as compared to non-pulsed samples after twelve-hour dormancy. This result indicates that the micromachine stiction to surfaces during dormant period can be effectively eliminated, resulting in long-term stability of surface micromachines in critical applications.

Optimization of operating parameters in polysilicon chemical vapor deposition reactor with response surface methodology

NASA Astrophysics Data System (ADS)

An, Li-sha; Liu, Chun-jiao; Liu, Ying-wen

2018-05-01

In the polysilicon chemical vapor deposition reactor, the operating parameters are complex to affect the polysilicon's output. Therefore, it is very important to address the coupling problem of multiple parameters and solve the optimization in a computationally efficient manner. Here, we adopted Response Surface Methodology (RSM) to analyze the complex coupling effects of different operating parameters on silicon deposition rate (R) and further achieve effective optimization of the silicon CVD system. Based on finite numerical experiments, an accurate RSM regression model is obtained and applied to predict the R with different operating parameters, including temperature (T), pressure (P), inlet velocity (V), and inlet mole fraction of H2 (M). The analysis of variance is conducted to describe the rationality of regression model and examine the statistical significance of each factor. Consequently, the optimum combination of operating parameters for the silicon CVD reactor is: T = 1400 K, P = 3.82 atm, V = 3.41 m/s, M = 0.91. The validation tests and optimum solution show that the results are in good agreement with those from CFD model and the deviations of the predicted values are less than 4.19%. This work provides a theoretical guidance to operate the polysilicon CVD process.

Surface micromachined microengine as the driver for micromechanical gears

DOE Office of Scientific and Technical Information (OSTI.GOV)

Garcia, E.J.; Sniegowski, J.J.

1995-05-01

The transmission of mechanical power is often accomplished through the use of gearing. The recently developed surface micromachined microengine provides us with an actuator which is suitable for driving surface micromachined geared systems. In this paper we will present aspects of the microengine as they relate to the driving of geared mechanisms, issues relating to the design of micro gear mechanisms, and details of a design of a microengine-driven geared shutter mechanism.

Surface-micromachined chain for use in microelectromechanical structures

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vernon, Sr., George E.

2001-01-01

A surface-micromachined chain and a microelectromechanical (MEM) structure incorporating such a chain are disclosed. The surface-micromachined chain can be fabricated in place on a substrate (e.g. a silicon substrate) by depositing and patterning a plurality of alternating layers of a chain-forming material (e.g. polycrystalline silicon) and a sacrificial material (e.g. silicon dioxide or a silicate glass). The sacrificial material is then removed by etching to release the chain for movement. The chain has applications for forming various types of MEM devices which include a microengine (e.g. an electrostatic motor) connected to rotate a drive sprocket, with the surface-micromachined chain beingmore » connected between the drive sprocket and one or more driven sprockets.« less

Gage for micromachining system

DOEpatents

Miller, Donald M.

1979-02-27

A gage for measuring the contour of the surface of an element of a micromachining tool system and of a work piece machined by the micromachining tool system. The gage comprises a glass plate containing two electrical contacts and supporting a steel ball resting against the contacts. As the element or workpiece is moved against the steel ball, the very slight contact pressure causes an extremely small movement of the steel ball which breaks the electrical circuit between the two contacts. The contour information is supplied to a dedicated computer controlling the micromachining tool so that the computer knows the contour of the element and the work piece to an accuracy of .+-. 25 nm. The micromachining tool system with X- and omega-axes is used to machine spherical, aspherical, and irregular surfaces with a maximum contour error of 100 nanometers (nm) and surface waviness of no more than 0.8 nm RMS.

Resonant-type MEMS transducers excited by two acoustic emission simulation techniques

NASA Astrophysics Data System (ADS)

Ozevin, Didem; Greve, David W.; Oppenheim, Irving J.; Pessiki, Stephen

2004-07-01

Acoustic emission testing is a passive nondestructive testing technique used to identify the onset and characteristics of damage through the detection and analysis of transient stress waves. Successful detection and implementation of acoustic emission requires good coupling, high transducer sensitivity and ability to discriminate noise from real signals. We report here detection of simulated acoustic emission signals using a MEMS chip fabricated in the multi-user polysilicon surface micromachining (MUMPs) process. The chip includes 18 different transducers with 10 different resonant frequencies in the range of 100 kHz to 1 MHz. It was excited by two different source simulation techniques; pencil lead break and impact loading. The former simulation was accomplished by breaking 0.5 mm lead on the ceramic package. Four transducer outputs were collected simultaneously using a multi-channel oscilloscope. The impact loading was repeated for five different diameter ball bearings. Traditional acoustic emission waveform analysis methods were applied to both data sets to illustrate the identification of different source mechanisms. In addition, a sliding window Fourier transform was performed to differentiate frequencies in time-frequency-amplitude domain. The arrival and energy contents of each resonant frequency were investigated in time-magnitude plots. The advantages of the simultaneous excitation of resonant transducers on one chip are discussed and compared with broadband acoustic emission transducers.

Micromachined spinneret

DOEpatents

Okandan, Murat; Galambos, Paul

2007-11-06

A micromachined spinneret is disclosed which has one or more orifices through which a fiber-forming material can be extruded to form a fiber. Each orifice is surrounded by a concentric annular orifice which allows the fiber to be temporarily or permanently coated with a co-extrudable material. The micromachined spinneret can be formed by a combination of surface and bulk micromachining.

Emerging leadership of surface micromachined MEMS for wavelength switching in telecommunications systems

NASA Astrophysics Data System (ADS)

Staple, Bevan D.; Muller, Lilac; Miller, David C.

2003-01-01

We introduce the Network Photonics" CrossWave as the first commercially-available, MEMS-based wavelength selective switch. The CrossWave combines the functionality of signal de-multiplexing, switching and re-multiplexing in a single all-optical operation using a dispersive element and 1-D MEMS. 1-D MEMS, where micromirrors are configured in a single array with a single mirror per wavelength, are fabricated in a standard surface micromachining process. In this paper we present three generations of micromirror designs. With proper design optimization and process improvements we have demonstrated exceptional mirror flatness (<16.2m-1 curvature), surface error (

Micromachined microphone array on a chip for turbulent boundary layer measurements

NASA Astrophysics Data System (ADS)

Krause, Joshua Steven

A surface micromachined microphone array on a single chip has been successfully designed, fabricated, characterized, and tested for aeroacoustic purposes. The microphone was designed to have venting through the diaphragm, 64 elements (8x8) on the chip, and used a capacitive transduction scheme. The microphone was fabricated using the MEMSCAP PolyMUMPs process (a foundry polysilicon surface micromachining process) along with facilities at Tufts Micro and Nano Fabrication Facility (TMNF) where a Parylene-C passivation layer deposition and release of the microstructures were performed. The devices are packaged with low profile interconnects, presenting a maximum of 100 mum of surface topology. The design of an individual microphone was completed through the use of a lumped element model (LEM) to determine the theoretical performance of the microphone. Off-chip electronics were created to allow the microphone array outputs to be redirected to one of two channels, allowing dynamic reconfiguration of the effective transducer shape in software and provide 80 dB off isolation. The characterization was completed through the use of laser Doppler vibrometry (LDV), acoustic plane wave tube and free-field calibration, and electrical noise floor testing in a Faraday cage. Measured microphone sensitivity is 0.15 mV/Pa for an individual microphone and 8.7 mV/Pa for the entire array, in close agreement with model predictions. The microphones and electronics operate over the 200--40 000 Hz band. The dynamic range extends from 60 dB SPL in a 1 Hz band to greater than 150 dB SPL. Element variability was +/-0.05 mV/Pa in sensitivity with an array yield of 95%. Wind tunnel testing at flow rates of up to 205.8 m/s indicates that the devices continue to operate in flow without damage, and can be successfully reconfigured on the fly. Care has been taken to systematically remove contaminating signals (acoustic, vibration, and noise floor) from the wind tunnel data to determine actual turbulent pressure fluctuations beneath the turbulent boundary layer to an uncertainty level of 1 dB. Analysis of measured boundary layer pressure spectra at six flow rates from 34.3 m/s to 205.8 m/s indicate single point wall spectral measurements in close agreement to the empirical models of Goody, Chase-Howe, and Efimtsov above Mach 0.4. The MEMS data more closely resembles the magnitude of the Efimtsov model at higher frequencies (25% higher above 3 kHz for the Mach 0.6 case); however, the shape of the spectral model is closer to the model of Goody (50% lower for the Mach 0.6 case for all frequencies). The Chase-Howe model does fall directly on the MEMS data starting at 6 kHz, but has a sharper slope and does not resemble the data at below 6 kHz.

A microfluidic device integrating dual CMOS polysilicon nanowire sensors for on-chip whole blood processing and simultaneous detection of multiple analytes.

PubMed

Kuan, Da-Han; Wang, I-Shun; Lin, Jiun-Rue; Yang, Chao-Han; Huang, Chi-Hsien; Lin, Yen-Hung; Lin, Chih-Ting; Huang, Nien-Tsu

2016-08-02

The hemoglobin-A1c test, measuring the ratio of glycated hemoglobin (HbA1c) to hemoglobin (Hb) levels, has been a standard assay in diabetes diagnosis that removes the day-to-day glucose level variation. Currently, the HbA1c test is restricted to hospitals and central laboratories due to the laborious, time-consuming whole blood processing and bulky instruments. In this paper, we have developed a microfluidic device integrating dual CMOS polysilicon nanowire sensors (MINS) for on-chip whole blood processing and simultaneous detection of multiple analytes. The micromachined polymethylmethacrylate (PMMA) microfluidic device consisted of a serpentine microchannel with multiple dam structures designed for non-lysed cells or debris trapping, uniform plasma/buffer mixing and dilution. The CMOS-fabricated polysilicon nanowire sensors integrated with the microfluidic device were designed for the simultaneous, label-free electrical detection of multiple analytes. Our study first measured the Hb and HbA1c levels in 11 clinical samples via these nanowire sensors. The results were compared with those of standard Hb and HbA1c measurement methods (Hb: the sodium lauryl sulfate hemoglobin detection method; HbA1c: cation-exchange high-performance liquid chromatography) and showed comparable outcomes. Finally, we successfully demonstrated the efficacy of the MINS device's on-chip whole blood processing followed by simultaneous Hb and HbA1c measurement in a clinical sample. Compared to current Hb and HbA1c sensing instruments, the MINS platform is compact and can simultaneously detect two analytes with only 5 μL of whole blood, which corresponds to a 300-fold blood volume reduction. The total assay time, including the in situ sample processing and analyte detection, was just 30 minutes. Based on its on-chip whole blood processing and simultaneous multiple analyte detection functionalities with a lower sample volume requirement and shorter process time, the MINS device can be effectively applied to real-time diabetes diagnostics and monitoring in point-of-care settings.

The Development of Micromachined Gyroscope Structure and Circuitry Technology

PubMed Central

Xia, Dunzhu; Yu, Cheng; Kong, Lun

2014-01-01

This review surveys micromachined gyroscope structure and circuitry technology. The principle of micromachined gyroscopes is first introduced. Then, different kinds of MEMS gyroscope structures, materials and fabrication technologies are illustrated. Micromachined gyroscopes are mainly categorized into micromachined vibrating gyroscopes (MVGs), piezoelectric vibrating gyroscopes (PVGs), surface acoustic wave (SAW) gyroscopes, bulk acoustic wave (BAW) gyroscopes, micromachined electrostatically suspended gyroscopes (MESGs), magnetically suspended gyroscopes (MSGs), micro fiber optic gyroscopes (MFOGs), micro fluid gyroscopes (MFGs), micro atom gyroscopes (MAGs), and special micromachined gyroscopes. Next, the control electronics of micromachined gyroscopes are analyzed. The control circuits are categorized into typical circuitry and special circuitry technologies. The typical circuitry technologies include typical analog circuitry and digital circuitry, while the special circuitry consists of sigma delta, mode matching, temperature/quadrature compensation and novel special technologies. Finally, the characteristics of various typical gyroscopes and their development tendency are discussed and investigated in detail. PMID:24424468

Automated array assembly task development of low-cost polysilicon solar cells

NASA Technical Reports Server (NTRS)

Jones, G. T.

1980-01-01

Development of low cost, large area polysilicon solar cells was conducted in this program. Three types of polysilicon materialk were investigated. A theoretical and experimenal comparison between single crystal silicon and polysilicon solar cell efficiency was performed. Significant electrical performance differences were observed between types of wafer material, i.e. fine grain and coarse grain polysilicon and single crystal silicon. Efficiency degradation due to grain boundaries in fin grain and coarse grain polysilicon was shown to be small. It was demonstrated that 10 percent efficient polysilicon solar cells can be produced with spray on n+ dopants. This result fulfills an important goal of this project, which is the production of batch quantity of 10 percent efficient polysilicon solar cells.

Computation of Static Shapes and Voltages for Micromachined Deformable Mirrors with Nonlinear Electrostatic Actuators

NASA Technical Reports Server (NTRS)

Wang, P. K. C.; Hadaegh, F. Y.

1996-01-01

In modeling micromachined deformable mirrors with electrostatic actuators whose gap spacings are of the same order of magnitude as those of the surface deformations, it is necessary to use nonlinear models for the actuators. In this paper, we consider micromachined deformable mirrors modeled by a membrane or plate equation with nonlinear electrostatic actuator characteristics. Numerical methods for computing the mirror deformation due to given actuator voltages and the actuator voltages required for producing the desired deformations at the actuator locations are presented. The application of the proposed methods to circular deformable mirrors whose surfaces are modeled by elastic membranes is discussed in detail. Numerical results are obtained for a typical circular micromachined mirror with electrostatic actuators.

Advancing MEMS Technology Usage through the MUMPS (Multi-User MEMS Processes) Program

NASA Technical Reports Server (NTRS)

Koester, D. A.; Markus, K. W.; Dhuler, V.; Mahadevan, R.; Cowen, A.

1995-01-01

In order to help provide access to advanced micro-electro-mechanical systems (MEMS) technologies and lower the barriers for both industry and academia, the Microelectronic Center of North Carolina (MCNC) and ARPA have developed a program which provides users with access to both MEMS processes and advanced electronic integration techniques. The four distinct aspects of this program, the multi-user MEMS processes (MUMP's), the consolidated micro-mechanical element library, smart MEMS, and the MEMS technology network are described in this paper. MUMP's is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. It is both a proof-of-concept and educational tool that aids in the development of MEMS in the domestic community. MUMP's technologies currently include a 3-layer poly-silicon surface micromachining process and LIGA (lithography, electroforming, and injection molding) processes that provide reasonable design flexibility within set guidelines. The consolidated micromechanical element library (CaMEL) is a library of active and passive MEMS structures that can be downloaded by the MEMS community via the internet. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology. The MEMS technology network (TechNet) is a menu of standard substrates and MEMS fabrication processes that can be purchased and combined to create unique process flows. TechNet provides the MEMS community greater flexibility and enhanced technology accessibility.

Development of a MEMS device for acoustic emission testing

NASA Astrophysics Data System (ADS)

Ozevin, Didem; Pessiki, Stephen P.; Jain, Akash; Greve, David W.; Oppenheim, Irving J.

2003-08-01

Acoustic emission testing is an important technology for evaluating structural materials, and especially for detecting damage in structural members. Significant new capabilities may be gained by developing MEMS transducers for acoustic emission testing, including permanent bonding or embedment for superior coupling, greater density of transducer placement, and a bundle of transducers on each device tuned to different frequencies. Additional advantages include capabilities for maintenance of signal histories and coordination between multiple transducers. We designed a MEMS device for acoustic emission testing that features two different mechanical types, a hexagonal plate design and a spring-mass design, with multiple detectors of each type at ten different frequencies in the range of 100 kHz to 1 MHz. The devices were fabricated in the multi-user polysilicon surface micromachining (MUMPs) process and we have conducted electrical characterization experiments and initial experiments on acoustic emission detection. We first report on C(V) measurements and perform a comparison between predicted (design) and measured response. We next report on admittance measurements conducted at pressures varying from vacuum to atmospheric, identifying the resonant frequencies and again providing a comparison with predicted performance. We then describe initial calibration experiments that compare the performance of the detectors to other acoustic emission transducers, and we discuss the overall performance of the device as a sensor suite, as contrasted to the single-channel performance of most commercial transducers.

Modeling of stress-induced curvature in surface-micromachined devices

NASA Astrophysics Data System (ADS)

Cowan, William D.; Bright, Victor M.; Elvin, Alex A.; Koester, David A.

1997-09-01

This paper compares measured to modeled stress-induced curvature of simple piston micromirrors. Two similar flexure-beam micromirror designs were fabricate using the 11th DARPA-supported multi-user MEMS processes (MUMPs) run. The test devices vary only in the MUMPs layers used for fabrication. In one case the mirror plate is the 1.5 micrometers thick Poly2 layer. The other mirror design employs stacked Poly1 and Poly2 layers for a total thickness of 3.5 micrometers . Both mirror structures are covered with the standard MUMPs metallization of approximately 200 angstrom of chromium and 0.5 micrometers of gold. Curvature of these devices was measured to within +/- 5 nm with a computer controlled microscope laser interferometer system. As intended, the increased thickness of the stacked polysilicon layers reduces the mirror curvature by a factor of 4. The two micromirror designs were modeled using IntelliCAD, a commercial CAD system for MEMS. The basis of analysis was the finite element method. Simulated results using MUMPs 11 film parameters showed qualitative agreement with measured data, but obvious quantitative differences. Subsequent remeasurement of the metal stress and use of the new value significantly improved model agreement with the measured data. The paper explores the effect of several film parameters on the modeled structures. Implications for MEMS film metrology, and test structures are considered.

Monolithic composite “pressure + acceleration + temperature + infrared” sensor using a versatile single-sided “SiN/Poly-Si/Al” process-module.

PubMed

Ni, Zao; Yang, Chen; Xu, Dehui; Zhou, Hong; Zhou, Wei; Li, Tie; Xiong, Bin; Li, Xinxin

2013-01-16

We report a newly developed design/fabrication module with low-cost single-sided "low-stress-silicon-nitride (LS-SiN)/polysilicon (poly-Si)/Al" process for monolithic integration of composite sensors for sensing-network-node applications. A front-side surface-/bulk-micromachining process on a conventional Si-substrate is developed, featuring a multifunctional SiN/poly-Si/Al layer design for diverse sensing functions. The first "pressure + acceleration + temperature + infrared" (PATIR) composite sensor with the chip size of 2.5 mm × 2.5 mm is demonstrated. Systematic theoretical design and analysis methods are developed. The diverse sensing components include a piezoresistive absolute-pressure sensor (up to 700 kPa, with a sensitivity of 49 mV/MPa under 3.3 V supplied voltage), a piezoresistive accelerometer (±10 g, with a sensitivity of 66 μV/g under 3.3 V and a -3 dB bandwidth of 780 Hz), a thermoelectric infrared detector (with a responsivity of 45 V/W and detectivity of 3.6 × 107 cm·Hz1/2/W) and a thermistor (-25-120 °C). This design/fabrication module concept enables a low-cost monolithically-integrated "multifunctional-library" technique. It can be utilized as a customizable tool for versatile application-specific requirements, which is very useful for small-size, low-cost, large-scale sensing-network node developments.

Sleeve reaction chamber system

DOEpatents

Northrup, M Allen [Berkeley, CA; Beeman, Barton V [San Mateo, CA; Benett, William J [Livermore, CA; Hadley, Dean R [Manteca, CA; Landre, Phoebe [Livermore, CA; Lehew, Stacy L [Livermore, CA; Krulevitch, Peter A [Pleasanton, CA

2009-08-25

A chemical reaction chamber system that combines devices such as doped polysilicon for heating, bulk silicon for convective cooling, and thermoelectric (TE) coolers to augment the heating and cooling rates of the reaction chamber or chambers. In addition the system includes non-silicon-based reaction chambers such as any high thermal conductivity material used in combination with a thermoelectric cooling mechanism (i.e., Peltier device). The heat contained in the thermally conductive part of the system can be used/reused to heat the device, thereby conserving energy and expediting the heating/cooling rates. The system combines a micromachined silicon reaction chamber, for example, with an additional module/device for augmented heating/cooling using the Peltier effect. This additional module is particularly useful in extreme environments (very hot or extremely cold) where augmented heating/cooling would be useful to speed up the thermal cycling rates. The chemical reaction chamber system has various applications for synthesis or processing of organic, inorganic, or biochemical reactions, including the polymerase chain reaction (PCR) and/or other DNA reactions, such as the ligase chain reaction.

Microfabrication Techniques for Plastic Microelectromechanical Systems (MEMS)

DTIC Science & Technology

2003-07-01

micromachining techniques were investigated. Surface micromachining techniques include deposition of thin and thick polymer films using vacuum and spin ...1 2.0 Introduction ...100 4.3.1 Nozzle-diffuser pumps theory

Economics of polysilicon processes

NASA Technical Reports Server (NTRS)

Yaws, C. L.; Li, K. Y.; Chou, S. M.

1986-01-01

Techniques are being developed to provide lower cost polysilicon material for solar cells. Existing technology which normally provides semiconductor industry polysilicon material is undergoing changes and also being used to provide polysilicon material for solar cells. Economics of new and existing technologies are presented for producing polysilicon. The economics are primarily based on the preliminary process design of a plant producing 1,000 metric tons/year of silicon. The polysilicon processes include: Siemen's process (hydrogen reduction of trichlorosilane); Union Carbide process (silane decomposition); and Hemlock Semiconductor process (hydrogen reduction of dichlorosilane). The economics include cost estimates of capital investment and product cost to produce polysilicon via the technology. Sensitivity analysis results are also presented to disclose the effect of major paramentes such as utilities, labor, raw materials and capital investment.

Micromachined electrical cauterizer

DOEpatents

Lee, Abraham P.; Krulevitch, Peter A.; Northrup, M. Allen

1999-01-01

A micromachined electrical cauterizer. Microstructures are combined with microelectrodes for highly localized electro cauterization. Using boron etch stops and surface micromachining, microneedles with very smooth surfaces are made. Micromachining also allows for precision placement of electrodes by photolithography with micron sized gaps to allow for concentrated electric fields. A microcauterizer is fabricated by bulk etching silicon to form knife edges, then parallelly placed microelectrodes with gaps as small as 5 .mu.m are patterned and aligned adjacent the knife edges to provide homeostasis while cutting tissue. While most of the microelectrode lines are electrically insulated from the atmosphere by depositing and patterning silicon dioxide on the electric feedthrough portions, a window is opened in the silicon dioxide to expose the parallel microelectrode portion. This helps reduce power loss and assist in focusing the power locally for more efficient and safer procedures.

Micromachined electrical cauterizer

DOEpatents

Lee, A.P.; Krulevitch, P.A.; Northrup, M.A.

1999-08-31

A micromachined electrical cauterizer is disclosed. Microstructures are combined with microelectrodes for highly localized electro cauterization. Using boron etch stops and surface micromachining, microneedles with very smooth surfaces are made. Micromachining also allows for precision placement of electrodes by photolithography with micron sized gaps to allow for concentrated electric fields. A microcauterizer is fabricated by bulk etching silicon to form knife edges, then parallelly placed microelectrodes with gaps as small as 5 {mu}m are patterned and aligned adjacent the knife edges to provide homeostasis while cutting tissue. While most of the microelectrode lines are electrically insulated from the atmosphere by depositing and patterning silicon dioxide on the electric feedthrough portions, a window is opened in the silicon dioxide to expose the parallel microelectrode portion. This helps reduce power loss and assist in focusing the power locally for more efficient and safer procedures. 7 figs.

78 FR 21344 - Grant of Authority for Subzone Status, Hemlock Semiconductor Corporation, (Polysilicon), Hemlock...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-04-10

... Status, Hemlock Semiconductor Corporation, (Polysilicon), Hemlock, Michigan Pursuant to its authority... polysilicon manufacturing facility of Hemlock Semiconductor Corporation, located in Hemlock, Michigan (FTZ... manufacturing of polysilicon at the facility of Hemlock Semiconductor Corporation, located in Hemlock, Michigan...

Integration of solid-state nanopores in a 0.5 μm cmos foundry process

PubMed Central

Uddin, A; Yemenicioglu, S; Chen, C-H; Corigliano, E; Milaninia, K; Theogarajan, L

2013-01-01

High-bandwidth and low-noise nanopore sensor and detection electronics are crucial in achieving single-DNA base resolution. A potential way to accomplish this goal is to integrate solid-state nanopores within a CMOS platform, in close proximity to the biasing electrodes and custom-designed amplifier electronics. Here we report the integration of solid-state nanopore devices in a commercial complementary metal-oxide semiconductor (CMOS) potentiostat chip implemented in On-Semiconductor’s 0.5 μm technology. Nanopore membranes incorporating electrodes are fabricated by post-CMOS micromachining utilizing the N+ polysilicon/SiO2/N+ polysilicon capacitor structure available in the aforementioned process. Nanopores are created in the CMOS process by drilling in a transmission electron microscope and shrinking by atomic layer deposition. We also describe a batch fabrication method to process a large of number of electrode-embedded nanopores with sub-10 nm diameter across CMOS-compatible wafers by electron beam lithography and atomic layer deposition. The CMOS-compatibility of our fabrication process is verified by testing the electrical functionality of on-chip circuitry. We observe high current leakage with the CMOS nanopore devices due to the ionic diffusion through the SiO2 membrane. To prevent this leakage, we coat the membrane with Al2O3 which acts as an efficient diffusion barrier against alkali ions. The resulting nanopore devices also exhibit higher robustness and lower 1/f noise as compared to SiO2 and SiNx. Furthermore, we propose a theoretical model for our low-capacitance CMOS nanopore devices, showing good agreement with the experimental value. In addition, experiments and theoretical models of translocation studies are presented using 48.5 kbp λ-DNA in order to prove the functionality of on-chip pores coated with Al2O3. PMID:23519330

A simultaneous deep micromachining and surface passivation method suitable for silicon-based devices

NASA Astrophysics Data System (ADS)

Babaei, E.; Gharooni, M.; Mohajerzadeh, S.; Soleimani, E. A.

2018-07-01

Three novel methods for simultaneous micromachining and surface passivation of silicon are reported. A thin passivation layer is achieved using continuous and sequential plasma processes based on SF6, H2 and O2 gases. Reducing the recombination by surface passivation is crucial for the realization of high-performance nanosized optoelectronic devices. The passivation of the surface as an important step, is feasible by plasma processing based on hydrogen pulses in proper time-slots or using a mixture of H2 and O2, and SF6 gases. The passivation layer which is formed in situ during the micromachining process obviates a separate passivation step needed in conventional methods. By adjusting the plasma parameters such as power, duration, and flows of gases, the process can be controlled for the best results and acceptable under-etching at the same time. Moreover, the pseudo-oxide layer which is formed during the micromachining processes will also improve the electrical characteristics of the surface, which can be used as an add-on for micro and nanowire applications. To quantify the effect of surface passivation in our method, ellipsometry, lifetime measurements, x-ray photoelectron spectroscopy, current–voltage and capacitance–voltage measurements and solar cell testing have been employed.

Fatigue and Fracture of Polycrystalline Silicon and Diamond MEMS at Room and Elevated Temperatures

DTIC Science & Technology

2006-12-01

amorphous diamond-like carbon (ta-C) and polycrystalline silicon ( polysilicon ) for microelectromechanical systems (MEMS). Polysilicon and ta-C test...toughness were obtained, many of them for the first time. Compared to polysilicon , ta-C was found to have superior mechanical properties: Its fracture...toughness and strength were 3.5 times and two times that of polysilicon , respectively. Its elastic modulus was 4.5 times that of polysilicon and its

Design and characterization of MEMS interferometric sensing

NASA Astrophysics Data System (ADS)

Snyder, R.; Siahmakoun, A.

2010-02-01

A MEMS-based interferometric sensor is produced using the multi-user MEMS processing standard (MUMPS) micromirrors, movable by thermal actuation. The interferometer is comprised of gold reflection surfaces, polysilicon thermal actuators, hinges, latches and thin film polarization beam splitters. A polysilicon film of 3.5 microns reflects and transmits incident polarized light from an external laser source coupled to a multi-mode optical fiber. The input beam is shaped to a diameter of 10 to 20 microns for incidence upon the 100 micron mirrors. Losses in the optical path include diffraction effects from etch holes created in the manufacturing process, surface roughness of both gold and polysilicon layers, and misalignment of micro-scale optical components. Numerous optical paths on the chip vary by length, number of reflections, and mirror subsystems employed. Subsystems include thermal actuator batteries producing lateral position displacement, angularly tunable mirrors, double reflection surfaces, and static vertical mirrors. All mirror systems are raised via manual stimulation using two micron, residue-free probe tips and some may be aligned using electrical signals causing resistive heating in thermal actuators. The characterization of thermal actuator batteries includes maximum displacement, deflection, and frequency response that coincides with theoretical thermodynamic simulations using finite-element analysis. Maximum deflection of 35 microns at 400 mW input electrical power is shown for three types of actuator batteries as is deflection dependent frequency response data for electrical input signals up to 10 kHz.

In situ arsenic-doped polycrystalline silicon as a low thermal budget emitter contact for Si/Si1 - xGex heterojunction bipolar transistors

NASA Astrophysics Data System (ADS)

King, C. A.; Johnson, R. W.; Pinto, M. R.; Luftman, H. S.; Munanka, J.

1996-01-01

A low thermal budget emitter contact with low specific contact resistivity (ρc) with the absence of transient enhanced diffusion (TED) effects is essential to fabricate integratable high performance Si/SiGe heterojunction bipolar transistors (HBTs). We report the use of in situ As-doped polycrystalline silicon (polysilicon) from a low base pressure rapid thermal episystem for this purpose and find that it meets all the requirements. We used secondary ion mass spectrometry to find that 18 nm, heavily B-doped layers remain intact after implantation into the surface polysilicon and annealing at 800 °C for 40 s. Similar samples without the surface polylayer displayed extreme broadening of B profile. Kelvin crossbridge resistors together with 2D device simulations revealed that ρc is an extremely low value of 1.2×10-8 Ω cm2 in as-deposited material. Fabrication of simple 30×30 μm2 mesa isolated HBT devices showed IC to be more than two decades higher in devices with only an in situ As-doped polyemitter compared with devices that incorporated a surface implant into the single crystal portion of the emitter before polysilicon deposition. These results demonstrate that this doped polycrystalline silicon material is an excellent choice for emitter contacts to HBT devices.

Heavy doping effects in high efficiency silicon solar cells

NASA Technical Reports Server (NTRS)

Lindholm, F. A.; Neugroschel, A.

1985-01-01

The use of a (silicon)/(heavily doped polysilicon)/(metal) structure to replace the conventional high-low junction (or back-surface-field, BSF) structure of silicon solar cells was examined. The results of an experimental study designed to explore both qualitatively and quantitatively the mechanism of the improved current gain in bipolar transistors with polysilicon emitter contact are presented. A reciprocity theorem is presented that relates the short circuit current of a device, induced by a carrier generation source, to the minority carrier Fermi level in the dark. A method for accurate measurement of minority-carrier diffusion coefficients in silicon is described.

Role of microstructure and doping on the mechanical strength and toughness of polysilicon thin films

DOE PAGES

Yagnamurthy, Sivakumar; Boyce, Brad L.; Chasiotis, Ioannis

2015-03-24

We investigated the role of microstructure and doping on the mechanical strength of microscale tension specimens of columnar grain and laminated polysilicon doped with different concentrations of phosphorus. The average tensile strengths of undoped columnar and laminated polysilicon specimens were 1.3 ± 0.1 and 2.45 ± 0.3 GPa, respectively. Heavy doping reduced the strength of columnar polysilicon specimens to 0.9 ± 0.1 GPa. On grounds of Weibull statistics, the experimental results from specimens with gauge sections of 1000 μm × 100 μm × 1 μm predicted quite well the tensile strength of specimens with gauge sections of 150 μm ×more » 3.75 μm × 1 μm, and vice versa. The large difference in the mechanical strength between columnar and laminated polysilicon specimens was due to sidewall flaws in columnar polysilicon, which were introduced during reactive ion etching (RIE) and were further exacerbated by phosphorus doping. Moreover, the removal of the large defect regions at the sidewalls of columnar polysilicon specimens via ion milling increased their tensile strength by 70%-100%, approaching the strength of laminated polysilicon, which implies that the two types of polysilicon films have comparable tensile strength. Measurements of the effective mode I critical stress intensity factor, KIC,eff, also showed that all types of polysilicon films had comparable resistance to fracture. Therefore, additional processing steps to eliminate the edge flaws in RIE patterned devices could result in significantly stronger microelectromechanical system components fabricated by conventional columnar polysilicon films.« less

CMOS-compatible method for doping of buried vertical polysilicon structures by solid phase diffusion

DOE Office of Scientific and Technical Information (OSTI.GOV)

Turkulets, Yury; Department of Electrical and Computer Engineering, Ben Gurion University of the Negev, Beer-Sheva 8410501; Silber, Amir

2016-03-28

Polysilicon receives attention nowadays as a means to incorporate 3D-structured photonic devices into silicon processes. However, doping of buried layers of a typical 3D structure has been a challenge. We present a method for doping of buried polysilicon layers by solid phase diffusion. Using an underlying silicon oxide layer as a dopant source facilitates diffusion of dopants into the bottom side of the polysilicon layer. The polysilicon is grown on top of the oxide layer, after the latter has been doped by ion implantation. Post-growth heat treatment drives in the dopant from the oxide into the polysilicon. To model themore » process, we studied the diffusion of the two most common silicon dopants, boron (B) and phosphorus (P), using secondary ion mass spectroscopy profiles. Our results show that shallow concentration profiles can be achieved in a buried polysilicon layer using the proposed technique. We present a quantitative 3D model for the diffusion of B and P in polysilicon, which turns the proposed method into an engineerable technique.« less

Correction of large amplitude wavefront aberrations

NASA Astrophysics Data System (ADS)

Cornelissen, S. A.; Bierden, P. A.; Bifano, T. G.; Webb, R. H.; Burns, S.; Pappas, S.

2005-12-01

Recently, a number of research groups around the world have developed ophthalmic instruments capable of in vivo diffraction limited imaging of the human retina. Adaptive optics was used in these systems to compensate for the optical aberrations of the eye and provide high contrast, high resolution images. Such compensation uses a wavefront sensor and a wavefront corrector (usually a deformable mirror) coordinated in a closed- loop control system that continuously works to counteract aberrations. While those experiments produced promising results, the deformable mirrors have had insufficient range of motion to permit full correction of the large amplitude aberrations of the eye expected in a normal population of human subjects. Other retinal imaging systems developed to date with MEMS (micro-electromechanical systems) DMs suffer similar limitations. This paper describes the design, manufacture and testing of a 6um stroke polysilicon surface micromachined deformable mirror that, coupled with an new optical method to double the effective stroke of the MEMS-DM, will permit diffraction-limited retinal imaging through dilated pupils in at least 90% of the human population. A novel optical design using spherical mirrors provides a double pass of the wavefront over the deformable mirror such that a 6um mirror displacement results in 12um of wavefront compensation which could correct for 24um of wavefront error. Details of this design are discussed. Testing of the effective wavefront modification was performed using a commercial wavefront sensor. Results are presented demonstrating improvement in the amplitude of wavefront control using an existing high degree of freedom MEMS deformable mirror.

Monolithic Composite “Pressure + Acceleration + Temperature + Infrared” Sensor Using a Versatile Single-Sided “SiN/Poly-Si/Al” Process-Module

PubMed Central

Ni, Zao; Yang, Chen; Xu, Dehui; Zhou, Hong; Zhou, Wei; Li, Tie; Xiong, Bin; Li, Xinxin

2013-01-01

We report a newly developed design/fabrication module with low-cost single-sided “low-stress-silicon-nitride (LS-SiN)/polysilicon (poly-Si)/Al” process for monolithic integration of composite sensors for sensing-network-node applications. A front-side surface-/bulk-micromachining process on a conventional Si-substrate is developed, featuring a multifunctional SiN/poly-Si/Al layer design for diverse sensing functions. The first “pressure + acceleration + temperature + infrared” (PATIR) composite sensor with the chip size of 2.5 mm × 2.5 mm is demonstrated. Systematic theoretical design and analysis methods are developed. The diverse sensing components include a piezoresistive absolute-pressure sensor (up to 700 kPa, with a sensitivity of 49 mV/MPa under 3.3 V supplied voltage), a piezoresistive accelerometer (±10 g, with a sensitivity of 66 μV/g under 3.3 V and a −3 dB bandwidth of 780 Hz), a thermoelectric infrared detector (with a responsivity of 45 V/W and detectivity of 3.6 × 107 cm·Hz1/2/W) and a thermistor (−25–120 °C). This design/fabrication module concept enables a low-cost monolithically-integrated “multifunctional-library” technique. It can be utilized as a customizable tool for versatile application-specific requirements, which is very useful for small-size, low-cost, large-scale sensing-network node developments. PMID:23325169

Method of forming contacts for a back-contact solar cell

DOEpatents

Manning, Jane

2013-07-23

Methods of forming contacts for back-contact solar cells are described. In one embodiment, a method includes forming a thin dielectric layer on a substrate, forming a polysilicon layer on the thin dielectric layer, forming and patterning a solid-state p-type dopant source on the polysilicon layer, forming an n-type dopant source layer over exposed regions of the polysilicon layer and over a plurality of regions of the solid-state p-type dopant source, and heating the substrate to provide a plurality of n-type doped polysilicon regions among a plurality of p-type doped polysilicon regions.

Integrating carbon nanotube forests into polysilicon MEMS: Growth kinetics, mechanisms, and adhesion

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ubnoske, Stephen M.; Radauscher, Erich J.; Meshot, Eric R.

The growth of carbon nanotubes (CNTs) on polycrystalline silicon substrates was studied to improve the design of CNT field emission sources for microelectromechanical systems (MEMS) applications and vacuum microelectronic devices (VMDs). Microwave plasma-enhanced chemical vapor deposition (PECVD) was used for CNT growth, resulting in CNTs that incorporate the catalyst particle at their base. The kinetics of CNT growth on polysilicon were compared to growth on Si (100) using the model of Deal and Grove, finding activation energies of 1.61 and 1.54 eV for the nucleation phase of growth and 1.90 and 3.69 eV for the diffusion-limited phase on Si (100)more » and polysilicon, respectively. Diffusivity values for growth on polysilicon were notably lower than the corresponding values on Si (100) and the growth process became diffusion-limited earlier. Evidence favors a surface diffusion growth mechanism involving diffusion of carbon precursor species along the length of the CNT forest to the catalyst at the base. Explanations for the differences in activation energies and diffusivities were elucidated by SEM analysis of the catalyst nanoparticle arrays and through wide-angle X-ray scattering (WAXS) of CNT forests. As a result, methods are presented to improve adhesion of CNT films during operation as field emitters, resulting in a 2.5× improvement.« less

Novel vertical silicon photodiodes based on salicided polysilicon trenched contacts

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kaminski, Yelena; TowerJazz Ltd. Migdal Haemek; Shauly, Eitan

2015-12-07

The classical concept of silicon photodiodes comprises of a planar design characterized by heavily doped emitters. Such geometry has low collection efficiency of the photons absorbed close to the surface. An alternative, promising, approach is to use a vertical design. Nevertheless, realization of such design is technologically challenged, hence hardly explored. Herein, a novel type of silicon photodiodes, based on salicided polysilicon trenched contacts, is presented. These contacts can be prepared up to 10 μm in depth, without showing any leakage current associated with the increase in the contact area. Consequently, the trenched photodiodes revealed better performance than no-trench photodiodes. Amore » simple two dimensional model was developed, allowing to estimate the conditions under which a vertical design has the potential to have better performance than that of a planar design. At large, the deeper the trench is, the better is the vertical design relative to the planar (up to 10 μm for silicon). The vertical design is more advantageous for materials characterized by short diffusion lengths of the carriers. Salicided polysilicon trenched contacts open new opportunities for the design of solar cells and image sensors. For example, these contacts may passivate high contact area buried contacts, by virtue of the conformity of polysilicon interlayer, thus lowering the via resistance induced recombination enhancement effect.« less

Integrating carbon nanotube forests into polysilicon MEMS: Growth kinetics, mechanisms, and adhesion

DOE PAGES

Ubnoske, Stephen M.; Radauscher, Erich J.; Meshot, Eric R.; ...

2016-11-19

The growth of carbon nanotubes (CNTs) on polycrystalline silicon substrates was studied to improve the design of CNT field emission sources for microelectromechanical systems (MEMS) applications and vacuum microelectronic devices (VMDs). Microwave plasma-enhanced chemical vapor deposition (PECVD) was used for CNT growth, resulting in CNTs that incorporate the catalyst particle at their base. The kinetics of CNT growth on polysilicon were compared to growth on Si (100) using the model of Deal and Grove, finding activation energies of 1.61 and 1.54 eV for the nucleation phase of growth and 1.90 and 3.69 eV for the diffusion-limited phase on Si (100)more » and polysilicon, respectively. Diffusivity values for growth on polysilicon were notably lower than the corresponding values on Si (100) and the growth process became diffusion-limited earlier. Evidence favors a surface diffusion growth mechanism involving diffusion of carbon precursor species along the length of the CNT forest to the catalyst at the base. Explanations for the differences in activation energies and diffusivities were elucidated by SEM analysis of the catalyst nanoparticle arrays and through wide-angle X-ray scattering (WAXS) of CNT forests. As a result, methods are presented to improve adhesion of CNT films during operation as field emitters, resulting in a 2.5× improvement.« less

Characterization and optimization of polycrystalline Si70%Ge30% for surface micromachined thermopiles in human body applications

NASA Astrophysics Data System (ADS)

Wang, Ziyang; Fiorini, Paolo; Leonov, Vladimir; Van Hoof, Chris

2009-09-01

This paper presents the material characterization methods, characterization results and the optimization scheme for polycrystalline Si70%Ge30% (poly-SiGe) from the perspective of its application in a surface micromachined thermopile. Due to its comparative advantages, such as lower thermal conductivity and ease of processing, over other materials, poly-SiGe is chosen to fabricate a surface micromachined thermopile and eventually a wearable thermoelectric generator (TEG) to be used on a human body. To enable optimal design of advanced thermocouple microstructures, poly-SiGe sample materials prepared by two different techniques, namely low-pressure chemical vapor deposition (LPCVD) with in situ doping and rapid thermal chemical vapor deposition (RTCVD) with ion implantation, have been characterized. Relevant material properties, including electrical resistivity, Seebeck coefficient, thermal conductivity and specific contact resistance, have been reported. For the determination of thermal conductivity, a novel surface-micromachined test structure based on the Seebeck effect is designed, fabricated and measured. Compared to the traditional test structures, it is more advantageous for sample materials with a relatively large Seebeck coefficient, such as poly-SiGe. Based on the characterization results, a further optimization scheme is suggested to allow independent respective optimization of the figure of merit and the specific contact resistance.

Fabrication of directional sound sensor by silicon micromachining

NASA Astrophysics Data System (ADS)

Touse, Michael; Catterlin, Jeffrey; Sinibaldi, Jose; Karunasiri, Gamani

2009-03-01

A directional sound sensor based on the operational principle of the Ormia ochracea fly's hearing organism [1] was fabricated using micro-electromechanical system (MEMS) technology. The fly uses coupled bars hinged at the center to achieve directional sound sensing by monitoring the difference in their vibration amplitudes. The MEMS design employed in this work consisted of a 1x2 square millimeter polysilicon membrane hinged at the center and positioned about 1 micrometer above the substrate using a sacrificial silicon dioxide layer. Finite element analysis of the device shows two primary vibrational mode frequencies, one corresponding to a rocking mode which is highly dependent on angle of incidence, and the other to a bending motion which remains constant through all angles. Using a laser vibrometer to measure response, rocking and bending modes were observed at driving frequencies of 3.0 and 11.4 kHz, respectively, and angular dependence was in close agreement with modeling. [1] R.N. Miles, R. Robert, and R. R. Hoy, ``Mechanically coupled ears for directional hearing in the parasitoid fly Ormia ochracea,'' J. Acoust. Soc. Am., 98 (6), Dec. 1995

Surface-Micromachined Planar Arrays of Thermopiles

NASA Technical Reports Server (NTRS)

Foote, Marc C.

2003-01-01

Planar two-dimensional arrays of thermopiles intended for use as thermal-imaging detectors are to be fabricated by a process that includes surface micromachining. These thermopile arrays are designed to perform better than do prior two-dimensional thermopile arrays. The lower performance of prior two-dimensional thermopile arrays is attributed to the following causes: The thermopiles are made from low-performance thermoelectric materials. The devices contain dielectric supporting structures, the thermal conductances of which give rise to parasitic losses of heat from detectors to substrates. The bulk-micromachining processes sometimes used to remove substrate material under the pixels, making it difficult to incorporate low-noise readout electronic circuitry. The thermoelectric lines are on the same level as the infrared absorbers, thereby reducing fill factor. The improved pixel design of a thermopile array of the type under development is expected to afford enhanced performance by virtue of the following combination of features: Surface-micromachined detectors are thermally isolated through suspension above readout circuitry. The thermopiles are made of such high-performance thermoelectric materials as Bi-Te and Bi-Sb-Te alloys. Pixel structures are supported only by the thermoelectric materials: there are no supporting dielectric structures that could leak heat by conduction to the substrate.

Modelling of micromachining of human tooth enamel by erbium laser radiation

NASA Astrophysics Data System (ADS)

Belikov, A. V.; Skrypnik, A. V.; Shatilova, K. V.

2014-08-01

We consider a 3D cellular model of human tooth enamel and a photomechanical cellular model of enamel ablation by erbium laser radiation, taking into account the structural peculiarities of enamel, energy distribution in the laser beam cross section and attenuation of laser energy in biological tissue. The surface area of the texture in enamel is calculated after its micromachining by erbium laser radiation. The influence of the surface area on the bond strength of enamel with dental filling materials is discussed. A good correlation between the computer simulation of the total work of adhesion and experimentally measured bond strength between the dental filling material and the tooth enamel after its micromachining by means of YAG : Er laser radiation is attained.

Proceedings of the Flat-Plate Solar Array Project Workshop on Low-Cost Polysilicon for Terrestrial Photovoltaic Solar-Cell Applications

NASA Technical Reports Server (NTRS)

1986-01-01

Sessions conducted included: polysilicon material requirements; economics; process development in the U.S.; international process development; and polysilicon market and forecasts. Twenty-one papers were presented and discussed.

Improvement in performance and reliability with CF4 plasma pretreatment on the buffer oxide layer for low-temperature polysilicon thin-film transistor

NASA Astrophysics Data System (ADS)

Fan, Ching-Lin; Lin, Yi-Yan; Yang, Chun-Chieh

2012-03-01

This study applies CF4 plasma pretreatment to a buffer oxide layer to improve the performance of low-temperature polysilicon thin-film transistors (LTPS TFTs). Results show that the fluorine atoms piled up at the interface between the bulk channel and buffer oxide layer and accumulated in the bulk channel. The reduction of the trap states density by fluorine passivation can improve the electrical characteristics of the LTPS TFTs. It is found that the threshold voltage reduced from 4.32 to 3.03 V and the field-effect mobility increased from 29.71 to 45.65 cm2 V-1 S-1. In addition, the on current degradation and threshold voltage shift after stressing were significantly improved about 31% and 70%, respectively. We believe that the proposed CF4 plasma pretreatment on the buffer oxide layer can passivate the trap states and avoid the plasma induced damage on the polysilicon channel surface, resulting in the improvement in performance and reliability for LTPS-TFT mass production application on AMOLED displays with critical reliability requirement.

Modelling of micromachining of human tooth enamel by erbium laser radiation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Belikov, A V; Skrypnik, A V; Shatilova, K V

We consider a 3D cellular model of human tooth enamel and a photomechanical cellular model of enamel ablation by erbium laser radiation, taking into account the structural peculiarities of enamel, energy distribution in the laser beam cross section and attenuation of laser energy in biological tissue. The surface area of the texture in enamel is calculated after its micromachining by erbium laser radiation. The influence of the surface area on the bond strength of enamel with dental filling materials is discussed. A good correlation between the computer simulation of the total work of adhesion and experimentally measured bond strength betweenmore » the dental filling material and the tooth enamel after its micromachining by means of YAG : Er laser radiation is attained. (laser biophotonics)« less

Polysilicon for everything?

NASA Astrophysics Data System (ADS)

Ward, M. C. L.; McNie, Mark E.; Bunyan, Robert J.; King, David O.; Carline, Roger T.; Wilson, Rebecca; Gillham, J. P.

1998-09-01

We review some of the attractive attributes of microengineering and relate them to features of the highly successful silicon microelectronics industry. We highlight the need for cost effective functionality rather than ultimate performance as a driver for success and review key examples of polysilicon devices from this point of view. The effective exploitation of the data generated by the cost effective polysilicon sensors is also considered and we conclude that `non traditional' data analysis will need to be exploited if full use is to be made of polysilicon devices.

Polysilicon Prepared from SiCl4 by Atmospheric-Pressure Non-Thermal Plasma

NASA Astrophysics Data System (ADS)

Li, Xiaosong; Wang, Nan; Yang, Jinhua; Wang, Younian; Zhu, Aimin

2011-10-01

Non-thermal plasma at atmospheric pressure was explored for the preparation of polysilicon from SiCl4. The power supply sources of positive pulse and alternating current (8 kHz and 100 kHz) were compared for polysilicon preparation. The samples prepared by using the 100 kHz power source were crystalline silicon. The effects of H2 and SiCl4 volume fractions were investigated. The optical emission spectra showed that silicon species played an important role in polysilicon deposition

Fast-response variable focusing micromirror array lens

NASA Astrophysics Data System (ADS)

Boyd, James G., IV; Cho, Gyoungil

2003-07-01

A reflective type Fresnel lens using an array of micromirrors is designed and fabricated using the MUMPs® surface micromachining process. The focal length of the lens can be rapidly changed by controlling both the rotation and translation of electrostatically actuated micromirrors. The rotation converges rays and the translation adjusts the optical path length difference of the rays to be integer multiples of the wavelength. The suspension spring, pedestal and electrodes are located under the mirror to maximize the optical efficiency. Relations are provided for the fill-factor and the numerical aperture as functions of the lens diameter, the mirror size, and the tolerances specified by the MUMPs® design rules. The fabricated lens is 1.8mm in diameter, and each micromirror is approximately 100mm x 100mm. The lens fill-factor is 83.7%, the numerical aperture is 0.018 for a wavelength of 632.8nm, and the resolution is approximately 22mm, whereas the resolution of a perfect aberration-free lens is 21.4μm for a NA of 0.018. The focal length ranges from 11.3mm to infinity. The simulated Strehl ratio, which is the ratio of the point spread function maximum intensity to the theoretical diffraction-limited PSF maximum intensity, is 31.2%. A mechanical analysis was performed using the finite element code IDEAS. The combined maximum rotation and translation produces a maximum stress of 301MPa, below the yield strength of polysilicon, 1.21 to 1.65GPa. Potential applications include adaptive microscope lenses for scanning particle imaging velocimetry and a visually aided micro-assembly.

Use of chemical mechanical polishing in micromachining

DOEpatents

Nasby, Robert D.; Hetherington, Dale L.; Sniegowski, Jeffry J.; McWhorter, Paul J.; Apblett, Christopher A.

1998-01-01

A process for removing topography effects during fabrication of micromachines. A sacrificial oxide layer is deposited over a level containing functional elements with etched valleys between the elements such that the sacrificial layer has sufficient thickness to fill the valleys and extend in thickness upwards to the extent that the lowest point on the upper surface of the oxide layer is at least as high as the top surface of the functional elements in the covered level. The sacrificial oxide layer is then polished down and planarized by chemical-mechanical polishing. Another layer of functional elements is then formed upon this new planarized surface.

Wafer-Level Membrane-Transfer Process for Fabricating MEMS

NASA Technical Reports Server (NTRS)

Yang, Eui-Hyeok; Wiberg, Dean

2003-01-01

A process for transferring an entire wafer-level micromachined silicon structure for mating with and bonding to another such structure has been devised. This process is intended especially for use in wafer-level integration of microelectromechanical systems (MEMS) that have been fabricated on dissimilar substrates. Unlike in some older membrane-transfer processes, there is no use of wax or epoxy during transfer. In this process, the substrate of a wafer-level structure to be transferred serves as a carrier, and is etched away once the transfer has been completed. Another important feature of this process is that two electrodes constitutes an electrostatic actuator array. An SOI wafer and a silicon wafer (see Figure 1) are used as the carrier and electrode wafers, respectively. After oxidation, both wafers are patterned and etched to define a corrugation profile and electrode array, respectively. The polysilicon layer is deposited on the SOI wafer. The carrier wafer is bonded to the electrode wafer by using evaporated indium bumps. The piston pressure of 4 kPa is applied at 156 C in a vacuum chamber to provide hermetic sealing. The substrate of the SOI wafer is etched in a 25 weight percent TMAH bath at 80 C. The exposed buried oxide is then removed by using 49 percent HF droplets after an oxygen plasma ashing. The SOI top silicon layer is etched away by using an SF6 plasma to define the corrugation profile, followed by the HF droplet etching of the remaining oxide. The SF6 plasma with a shadow mask selectively etches the polysilicon membrane, if the transferred membrane structure needs to be patterned. Electrostatic actuators with various electrode gaps have been fabricated by this transfer technique. The gap between the transferred membrane and electrode substrate is very uniform ( 0.1 m across a wafer diameter of 100 mm, provided by optimizing the bonding control). Figure 2 depicts the finished product.

Integration of solid-state nanopores in a 0.5 μm CMOS foundry process.

PubMed

Uddin, A; Yemenicioglu, S; Chen, C-H; Corigliano, E; Milaninia, K; Theogarajan, L

2013-04-19

High-bandwidth and low-noise nanopore sensor and detection electronics are crucial in achieving single-DNA-base resolution. A potential way to accomplish this goal is to integrate solid-state nanopores within a CMOS platform, in close proximity to the biasing electrodes and custom-designed amplifier electronics. Here we report the integration of solid-state nanopore devices in a commercial complementary metal-oxide-semiconductor (CMOS) potentiostat chip implemented in On-Semiconductor's 0.5 μm technology. Nanopore membranes incorporating electrodes are fabricated by post-CMOS micromachining utilizing the n+ polysilicon/SiO2/n+ polysilicon capacitor structure available in the aforementioned process. Nanopores are created in the CMOS process by drilling in a transmission electron microscope and shrinking by atomic layer deposition. We also describe a batch fabrication method to process a large of number of electrode-embedded nanopores with sub-10 nm diameter across CMOS-compatible wafers by electron beam lithography and atomic layer deposition. The CMOS-compatibility of our fabrication process is verified by testing the electrical functionality of on-chip circuitry. We observe high current leakage with the CMOS nanopore devices due to the ionic diffusion through the SiO2 membrane. To prevent this leakage, we coat the membrane with Al2O3, which acts as an efficient diffusion barrier against alkali ions. The resulting nanopore devices also exhibit higher robustness and lower 1/f noise as compared to SiO2 and SiNx. Furthermore, we propose a theoretical model for our low-capacitance CMOS nanopore devices, showing good agreement with the experimental value. In addition, experiments and theoretical models of translocation studies are presented using 48.5 kbp λ-DNA in order to prove the functionality of on-chip pores coated with Al2O3.

Vibration measurement by atomic force microscopy with laser readout

NASA Astrophysics Data System (ADS)

Snitka, Valentinas J.; Mizariene, Vida; Kalinauskas, Margiris; Lucinskas, Paulius

1998-06-01

Micromachined cantilever beams are widely used for different microengineering and nanotechnology actuators and sensors applications. The micromechanical cantilever tip-based data storage devices with reading real data at the rates exceeding 1Mbit/s have been demonstrated. The vibrational noise spectrum of a cantilever limits the data storage resolution. Therefore the possibility to measure the microvibrations and acoustic fields in different micromachined devices are of great interest. We describe a method to study a micromechanical cantilever and surface vibrations based on laser beam deflection measurements. The influence of piezoelectric plate vibrations and the tip- surface contact condition on the cantilever vibrations were investigated in the frequency range of 1-200 kHz. The experiments were performed using the measurement results. The V-shaped cantilevers exited by the normal vibrations due to the non-linearity at the tip-surface contact vibrates with a complex motion and has a lateral vibration mode coupled with normal vibration mode. The possibility to use laser deflection technique for the vibration measurements in micromachined structures with nano resolution is shown.

Microtensile Test of AN Ordered-Reinforced Electrophoretic Polymer Matrix Composite Fabricated by Surface Micromachining

NASA Astrophysics Data System (ADS)

Yang, Zhuoqing; Wang, Hong; Zhang, Zhenjie; Ding, Guifu; Zhao, Xiaolin

A novel ordered-reinforced microscale polymer matrix composite based on electrophoresis and surface micromachining technologies has been proposed in the present work. The braid angle, volume content and width of the reinforcement in the composite has been designed and simulated by ANSYS finite element software. Based on the simulation and optimization, the Ni fibers reinforced polymer matrix composite sample (3 mm length × 0.6 mm width × 0.04 mm thickness) was successfully fabricated utilizing the surface micromachining process. The fabricated samples were characterized by microtensile test on the dynamic mechanical analysis (DMA) equipment. It is indicated that the tested tensile strength and Young's modulus are 285 MPa and 6.8 GPa, respectively. In addition, the fracture section of the composite sample has been observed by scanning electron microscope (SEM) and the corresponding fracture process was also explained and analyzed in detail. The new presented composite is promising for hot embossing mold in microfluidic chip and several transducers used in accurately controlled biomedical systems.

Method for passivating crystal silicon surfaces

DOEpatents

Wang, Qi [Littleton, CO; Wang, Tihu [Littleton, CO; Page, Matthew R [Littleton, CO; Yan, Yanfa [Littleton, CO

2009-12-08

In a method of making a c-Si-based cell or a .mu.c-Si-based cell, the improvement of increasing the minority charge carrier's lifetime, comprising: a) placing a c-Si or polysilicon wafer into CVD reaction chamber under a low vacuum condition and subjecting the substrate of the wafer to heating; and b) passing mixing gases comprising NH.sub.3/H.sub.2 through the reaction chamber at a low vacuum pressure for a sufficient time and at a sufficient flow rate to enable growth of an a-Si:H layer sufficient to increase the lifetime of the c-Si or polysilicon cell beyond that of the growth of an a-Si:H layer without treatment of the wafer with NH.sub.3/H.sub.2.

Front contact solar cell with formed emitter

DOEpatents

Cousins, Peter John

2014-11-04

A bipolar solar cell includes a backside junction formed by an N-type silicon substrate and a P-type polysilicon emitter formed on the backside of the solar cell. An antireflection layer may be formed on a textured front surface of the silicon substrate. A negative polarity metal contact on the front side of the solar cell makes an electrical connection to the substrate, while a positive polarity metal contact on the backside of the solar cell makes an electrical connection to the polysilicon emitter. An external electrical circuit may be connected to the negative and positive metal contacts to be powered by the solar cell. The positive polarity metal contact may form an infrared reflecting layer with an underlying dielectric layer for increased solar radiation collection.

Front contact solar cell with formed emitter

DOEpatents

Cousins, Peter John [Menlo Park, CA

2012-07-17

A bipolar solar cell includes a backside junction formed by an N-type silicon substrate and a P-type polysilicon emitter formed on the backside of the solar cell. An antireflection layer may be formed on a textured front surface of the silicon substrate. A negative polarity metal contact on the front side of the solar cell makes an electrical connection to the substrate, while a positive polarity metal contact on the backside of the solar cell makes an electrical connection to the polysilicon emitter. An external electrical circuit may be connected to the negative and positive metal contacts to be powered by the solar cell. The positive polarity metal contact may form an infrared reflecting layer with an underlying dielectric layer for increased solar radiation collection.

Catalytic hydrogen sensing using microheated platinum nanoparticle-loaded graphene aerogel

DOE PAGES

Harley-Trochimczyk, Anna; Chang, Jiyoung; Zhou, Qin; ...

2014-10-02

We present that low power catalytic hydrogen sensors are fabricated by functionalizing low power polysilicon microheaters with platinum nanoparticle catalyst loaded in a high surface area graphene aerogel support. Fabrication and characterization of the polysilicon microheaters are described. The platinum nanoparticle-loaded graphene aerogel is characterized by transmission electron microscopy, scanning electron microscopy, and energy dispersive X-ray spectroscopy. Finally, the catalytic hydrogen sensors consume as little as 2.2 mW of power, have sensitivity of 1.6%/10,000 ppm hydrogen, a t90 response and recovery time of 0.97 s and 0.72 s, respectively, a lower detection limit of approximately 65 ppm, and negligible crossmore » sensitivity to methane, n-pentane, and diethylether.« less

Micromachined peristaltic pumps

NASA Technical Reports Server (NTRS)

Hartley, Frank T. (Inventor)

1999-01-01

Micromachined pumps including a channel formed between a first membrane and a substrate or between first and second flexible membranes. A series of electrically conductive strips is applied to a surface of the substrate or one of the membranes. Application of a sequential voltage to the series of strips causes a region of closure to progress down the channel to achieve a pumping action.

Structure-property relationships in the optimization of polysilicon thin films for electrical recording/stimulation of single neurons.

PubMed

Saha, Rajarshi; Muthuswamy, Jit

2007-06-01

We had earlier demonstrated the use of polysilicon microelectrodes for recording electrical activity from single neurons in vivo. Good machinability and compatibility with CMOS processing further make polysilicon an attractive interface material between biological environments on one hand and MEMS technology and digital circuits on the other hand. In this study, we focus on optimizing the polysilicon thin films for (a) electrical recording and (b) stimulation of single neurons by minimizing its electrochemical impedance spectra and maximizing its charge storage/injection capacity respectively. The structure-property relationships in ion-implanted (phosphorus) LPCVD polysilicon thin films under different annealing and doping conditions were carefully assessed during this optimization process. A 2D model of the polysilicon thin film consisting of 4 grains and 3 grain boundaries was constructed and the effect of grain size and grain boundaries on dc resistivity was simulated using device simulator ATLAS. Optimal processing conditions and doping concentrations resulted in a 10-fold decrease in electrochemical impedance from 1.1 kOmega to 0.1 kOmega at 1 kHz (area of polysilicon interface = 4.8 mm(2)). Subsequent characterizations showed that evolution of secondary grains within the polysilicon thin films at optimal doping and annealing conditions (10(21)/cm(3) of phosphorus and annealed at 1200 degrees C) was responsible for decreasing the impedance. Cyclic voltammetry studies demonstrated that charge storage properties of low doped (10(15)/cm(3)) thin films was 111.4 microC/cm(2) in phosphate buffered saline which compares well with platinum wires (approximately 50 microC/cm(2)) and the double-layered capacitance (C(dl)) could be sustained between -1 to 1 V before breakdown and hydrolysis. We conclude that polysilicon can be optimized for recording and stimulating single neurons and can be a valuable interface material between neurons and CMOS or MEMS devices.

Tool calibration system for micromachining system

DOEpatents

Miller, Donald M.

1979-03-06

A tool calibration system including a tool calibration fixture and a tool height and offset calibration insert for calibrating the position of a tool bit in a micromachining tool system. The tool calibration fixture comprises a yokelike structure having a triangular head, a cavity in the triangular head, and a port which communicates a side of the triangular head with the cavity. Yoke arms integral with the triangular head extend along each side of a tool bar and a tool head of the micromachining tool system. The yoke arms are secured to the tool bar to place the cavity around a tool bit which may be mounted to the end of the tool head. Three linear variable differential transformer's (LVDT) are adjustably mounted in the triangular head along an X axis, a Y axis, and a Z axis. The calibration insert comprises a main base which can be mounted in the tool head of the micromachining tool system in place of a tool holder and a reference projection extending from a front surface of the main base. Reference surfaces of the calibration insert and a reference surface on a tool bar standard length are used to set the three LVDT's of the calibration fixture to the tool reference position. These positions are transferred permanently to a mastering station. The tool calibration fixture is then used to transfer the tool reference position of the mastering station to the tool bit.

Method for producing silicon thin-film transistors with enhanced forward current drive

DOEpatents

Weiner, K.H.

1998-06-30

A method is disclosed for fabricating amorphous silicon thin film transistors (TFTs) with a polycrystalline silicon surface channel region for enhanced forward current drive. The method is particularly adapted for producing top-gate silicon TFTs which have the advantages of both amorphous and polycrystalline silicon TFTs, but without problem of leakage current of polycrystalline silicon TFTs. This is accomplished by selectively crystallizing a selected region of the amorphous silicon, using a pulsed excimer laser, to create a thin polycrystalline silicon layer at the silicon/gate-insulator surface. The thus created polysilicon layer has an increased mobility compared to the amorphous silicon during forward device operation so that increased drive currents are achieved. In reverse operation the polysilicon layer is relatively thin compared to the amorphous silicon, so that the transistor exhibits the low leakage currents inherent to amorphous silicon. A device made by this method can be used, for example, as a pixel switch in an active-matrix liquid crystal display to improve display refresh rates. 1 fig.

Method for producing silicon thin-film transistors with enhanced forward current drive

DOEpatents

Weiner, Kurt H.

1998-01-01

A method for fabricating amorphous silicon thin film transistors (TFTs) with a polycrystalline silicon surface channel region for enhanced forward current drive. The method is particularly adapted for producing top-gate silicon TFTs which have the advantages of both amorphous and polycrystalline silicon TFTs, but without problem of leakage current of polycrystalline silicon TFTs. This is accomplished by selectively crystallizing a selected region of the amorphous silicon, using a pulsed excimer laser, to create a thin polycrystalline silicon layer at the silicon/gate-insulator surface. The thus created polysilicon layer has an increased mobility compared to the amorphous silicon during forward device operation so that increased drive currents are achieved. In reverse operation the polysilicon layer is relatively thin compared to the amorphous silicon, so that the transistor exhibits the low leakage currents inherent to amorphous silicon. A device made by this method can be used, for example, as a pixel switch in an active-matrix liquid crystal display to improve display refresh rates.

Use of chemical mechanical polishing in micromachining

DOEpatents

Nasby, R.D.; Hetherington, D.L.; Sniegowski, J.J.; McWhorter, P.J.; Apblett, C.A.

1998-09-08

A process for removing topography effects during fabrication of micromachines. A sacrificial oxide layer is deposited over a level containing functional elements with etched valleys between the elements such that the sacrificial layer has sufficient thickness to fill the valleys and extend in thickness upwards to the extent that the lowest point on the upper surface of the oxide layer is at least as high as the top surface of the functional elements in the covered level. The sacrificial oxide layer is then polished down and planarized by chemical-mechanical polishing. Another layer of functional elements is then formed upon this new planarized surface. 4 figs.

The influences of fluorine and process variations on polysilicon film stress and MOSFET hot carrier effects

NASA Technical Reports Server (NTRS)

Lowry, Lynn E.; Macwilliams, Kenneth P.; Isaac, Mary

1991-01-01

The use of fluorinated gate oxides may provide an improvement in nMOSFET reliability by enhancing hot carrier resistance. In order to clarify the mechanisms by which polysilicon processing and fluorination influence the oxide behavior, a matrix of nMOSFET structures was prepared using various processing, doping, and implantation strategies. These structures were evaluated for crystalline morphology and chemical element distribution. Mechanical stress measurements were taken on the polysilicon films from room temperature to cryogenic temperature. These examinations showed that fluorination of a structure with randomly oriented polysilicon can reduce residual mechanical stress and improve hot carrier resistance at room temperature.

Characterization and modeling of electrostatically actuated polysilicon micromechanical devices

NASA Astrophysics Data System (ADS)

Chan, Edward Keat Leem

Sensors, actuators, transducers, microsystems and MEMS (MicroElertroMechanical Systems) are some of the terms describing technologies that interface information processing systems with the physical world. Electrostatically actuated micromechanical devices are important building blocks in many of these technologies. Arrays of these devices are used in video projection displays, fluid pumping systems, optical communications systems, tunable lasers and microwave circuits. Well-calibrated simulation tools are essential for propelling ideas from the drawing board into production. This work characterizes a fabrication process---the widely-used polysilicon MUMPs process---to facilitate the design of electrostatically actuated micromechanical devices. The operating principles of a representative device---a capacitive microwave switch---are characterized using a wide range of electrical and optical measurements of test structures along with detailed electromechanical simulations. Consistency in the extraction of material properties from measurements of both pull-in voltage and buckling amplitude is demonstrated. Gold is identified as an area-dependent source of nonuniformity in polysilicon thicknesses and stress. Effects of stress gradients, substrate curvature, and film coverage are examined quantitatively. Using well-characterized beams as in-situ surface probes, capacitance-voltage and surface profile measurements reveal that compressible surface residue modifies the effective electrical gap when the movable electrode contacts an underlying silicon nitride layer. A compressible contact surface model used in simulations improves the fit to measurements. In addition, the electric field across the nitride causes charge to build up in the nitride, increasing the measured capacitance over time. The rate of charging corresponds to charge injection through direct tunneling. A novel actuator that can travel stably beyond one-third of the initial gap (a trademark limitation of conventional actuators) is demonstrated. A "folded capacitor" design, requiring only minimal modifications to the layout of conventional devices, reduces the parasitic capacitances and modes of deformation that limit performance. This device, useful for optical applications, can travel almost twice the conventional range before succumbing to a tilting instability.

Micro-machined resonator

DOEpatents

Godshall, N.A.; Koehler, D.R.; Liang, A.Y.; Smith, B.K.

1993-03-30

A micro-machined resonator, typically quartz, with upper and lower micro-machinable support members, or covers, having etched wells which may be lined with conductive electrode material, between the support members is a quartz resonator having an energy trapping quartz mesa capacitively coupled to the electrode through a diaphragm; the quartz resonator is supported by either micro-machined cantilever springs or by thin layers extending over the surfaces of the support. If the diaphragm is rigid, clock applications are available, and if the diaphragm is resilient, then transducer applications can be achieved. Either the thin support layers or the conductive electrode material can be integral with the diaphragm. In any event, the covers are bonded to form a hermetic seal and the interior volume may be filled with a gas or may be evacuated. In addition, one or both of the covers may include oscillator and interface circuitry for the resonator.

Micro-machined resonator

DOEpatents

Godshall, Ned A.; Koehler, Dale R.; Liang, Alan Y.; Smith, Bradley K.

1993-01-01

A micro-machined resonator, typically quartz, with upper and lower micro-machinable support members, or covers, having etched wells which may be lined with conductive electrode material, between the support members is a quartz resonator having an energy trapping quartz mesa capacitively coupled to the electrode through a diaphragm; the quartz resonator is supported by either micro-machined cantilever springs or by thin layers extending over the surfaces of the support. If the diaphragm is rigid, clock applications are available, and if the diaphragm is resilient, then transducer applications can be achieved. Either the thin support layers or the conductive electrode material can be integral with the diaphragm. In any event, the covers are bonded to form a hermetic seal and the interior volume may be filled with a gas or may be evacuated. In addition, one or both of the covers may include oscillator and interface circuitry for the resonator.

Micromachined pressure sensors: Review and recent developments

DOE Office of Scientific and Technical Information (OSTI.GOV)

Eaton, W.P.; Smith, J.H.

1997-03-01

Since the discovery of piezoresistivity in silicon in the mid 1950s, silicon-based pressure sensors have been widely produced. Micromachining technology has greatly benefited from the success of the integrated circuits industry, burrowing materials, processes, and toolsets. Because of this, microelectromechanical systems (MEMS) are now poised to capture large segments of existing sensor markets and to catalyze the development of new markets. Given the emerging importance of MEMS, it is instructive to review the history of micromachined pressure sensors, and to examine new developments in the field. Pressure sensors will be the focus of this paper, starting from metal diaphragm sensorsmore » with bonded silicon strain gauges, and moving to present developments of surface-micromachined, optical, resonant, and smart pressure sensors. Considerations for diaphragm design will be discussed in detail, as well as additional considerations for capacitive and piezoresistive devices.« less

Influence of the initial surface texture on the resulting surface roughness and waviness for micro-machining with ultra-short laser pulses (Conference Presentation)

NASA Astrophysics Data System (ADS)

Remund, Stefan M.; Jaeggi, Beat; Kramer, Thorsten; Neuenschwander, Beat

2017-03-01

The resulting surface roughness and waviness after processing with ultra-short pulsed laser radiation depend on the laser parameters as well as on the machining strategy and the scanning system. However the results depend on the material and its initial surface quality and finishing as well. The improvement of surface finishing represents effort and produces additional costs. For industrial applications it is important to reduce the preparation of a workpiece for laser micro-machining to optimize quality and reduce costs. The effects of the ablation process and the influence of the machining strategy and scanning system onto the surface roughness and waviness can be differenced due to their separate manner. By using the optimal laser parameters on an initially perfect surface, the ablation process mainly increases the roughness to a certain value for most metallic materials. However, imperfections in the scanning system causing a slight variation in the scanning speed lead to a raise of the waviness on the sample surface. For a basic understanding of the influence of grinding marks, the sample surfaces were initially furnished with regular grooves of different depths and spatial frequencies to gain a homogenous and well-defined original surface. On these surfaces the effect of different beam waists and machining strategy are investigated and the results are compared with a simulation of the process. Furthermore the behaviors of common surface finishes used in industrial applications for laser micro-machining are studied and the relation onto the resulting surface roughness and waviness is presented.

Computer Aided Design of Integrated Circuit Fabrication Processes for VLSI Devices

DTIC Science & Technology

1980-01-01

diffusion coefficient and surface conc,,tration of the chlorine as well as any field present; X is related to the ratio ol the diffusion coefficient to...with polysilicon gat(. .ed contacts, the interaction of oxidation, segregation and diffusion in all regions of the simulation space is a critical

Design, characterization, and experimental use of the second generation MEMS acoustic emission device

NASA Astrophysics Data System (ADS)

Ozevin, Didem; Greve, David W.; Oppenheim, Irving J.; Pessiki, Stephen

2005-05-01

We describe the design, fabrication, testing and application (in structural experiments) of our 2004 (second generation) MEMS device, designed for acoustic emission sensing based upon experiments with our 2002 (first generation) device. Both devices feature a suite of resonant-type transducers in the frequency range between 100 kHz and 1 MHz. The 2002 device was designed to operate in an evacuated housing because of high squeeze film damping, as confirmed in our earlier experiments. In additional studies involving the 2002 device, experimental simulation of acoustic emissions in a steel plate, using pencil lead break or ball impact loading, showed that the transducers in the frequency range of 100 kHz-500 kHz presented clearer output signals than the transducers with frequencies higher than 500 kHz. Using the knowledge gained from the 2002 device, we designed and fabricated our second generation device in 2004 using the multi-user polysilicon surface micromachining (MUMPs) process. The 2004 device has 7 independent capacitive type transducers, compared to 18 independent transducers in the 2002 device, including 6 piston type transducers in the frequency range of 100 kHz to 500 kHz and 1 piston type transducer at 1 MHz to capture high frequency information. Piston type transducers developed in our research have two uncoupled modes so that twofold information can be acquired from a single transducer. In addition, the piston shape helps to reduce residual stress effect of surface micromachining process. The center to center distance between etch holes in the vibrating plate was reduced from 30 μm to 13 μm, in order to reduce squeeze film damping. As a result, the Q factor under atmospheric pressure for the 100 kHz transducer was increased to 2.37 from 0.18, and therefore the vacuum housing has been eliminated from the 2004 device. Sensitivities of transducers were also increased, by enlarging transducer area, in order to capture significant small amplitude acoustic emission events. The average individual transducer area in the 2004 device was increased to 6.97 mm2 as compared to 2.51 mm2 in the 2002 device. In this paper, we report the new experimental results on the characterization of the 2004 device and compare them with analytical results. We show improvements in sensitivity as measured by capacitance and as measured by pencil lead break experiments. Improvement in damping is also evaluated by admittance measurement in atmosphere. Pencil lead break experiments also show that transducers can operate in atmospheric pressure. Finally, we apply the device to acoustic emission experiments on crack propagation in a steel beam specimen, precracked in fatigue, in a four-point bending test.

Continuous Czochralski growth: Silicon sheet growth development of the large area sheet task of the low cost silicon solar array project

NASA Technical Reports Server (NTRS)

Johnson, C. M.

1980-01-01

The growth of 100 kg of silicon single crystal material, ten cm in diameter or greater, and 150 kg of silicon single crystal material 15 cm or greater utilizing one common silicon container material (one crucible) is investigated. A crystal grower that is recharged with a new supply of polysilicon material while still under vacuum and at temperatures above the melting point of silicon is developed. It accepts large polysilicon charges up to 30 kg, grows large crystal ingots (to 15 cm diameter and 25 kg in weight), and holds polysilicon material for recharging (rod or lump) while, at the same time, growing crystal ingots. Special equipment is designed to recharge polysilicon rods, recharge polysilicon lumps, and handle and store large, hot silicon crystal ingots. Many continuous crystal growth runs were performed lasting as long as 109 hours and producing as many as ten crystal ingots, 15 cm with weights progressing to 27 kg.

Improved yields for MOST’s using ion implantation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Brockman, H. E.

1976-04-01

Conventionally diffused source and drain polysilicon gate MOST's commonly exhibit one type of fault, namely, that of polysilicon-to-diffusion short circuits. Investigations into the yields of large-area devices fabricated using ion-implanted sources and drains are compared with those of diffused structures. An improved technology for the chemical shaping of the polysilicon gates, which improves the yields for both types of devices, is also described. (AIP)

Design of a Novel MEMS Microgripper with Rotatory Electrostatic Comb-Drive Actuators for Biomedical Applications.

PubMed

Velosa-Moncada, Luis A; Aguilera-Cortés, Luz Antonio; González-Palacios, Max A; Raskin, Jean-Pierre; Herrera-May, Agustin L

2018-05-22

Primary tumors of patients can release circulating tumor cells (CTCs) to flow inside of their blood. The CTCs have different mechanical properties in comparison with red and white blood cells, and their detection may be employed to study the efficiency of medical treatments against cancer. We present the design of a novel MEMS microgripper with rotatory electrostatic comb-drive actuators for mechanical properties characterization of cells. The microgripper has a compact structural configuration of four polysilicon layers and a simple performance that control the opening and closing displacements of the microgripper tips. The microgripper has a mobile arm, a fixed arm, two different actuators and two serpentine springs, which are designed based on the SUMMiT V surface micromachining process from Sandia National Laboratories. The proposed microgripper operates at its first rotational resonant frequency and its mobile arm has a controlled displacement of 40 µm at both opening and closing directions using dc and ac bias voltages. Analytical models are developed to predict the stiffness, damping forces and first torsional resonant frequency of the microgripper. In addition, finite element method (FEM) models are obtained to estimate the mechanical behavior of the microgripper. The results of the analytical models agree very well respect to FEM simulations. The microgripper has a first rotational resonant frequency of 463.8 Hz without gripped cell and it can operate up to with maximum dc and ac voltages of 23.4 V and 129.2 V, respectively. Based on the results of the analytical and FEM models about the performance of the proposed microgripper, it could be used as a dispositive for mechanical properties characterization of circulating tumor cells (CTCs).

Design of a Novel MEMS Microgripper with Rotatory Electrostatic Comb-Drive Actuators for Biomedical Applications

PubMed Central

Velosa-Moncada, Luis A.; Aguilera-Cortés, Luz Antonio; Raskin, Jean-Pierre

2018-01-01

Primary tumors of patients can release circulating tumor cells (CTCs) to flow inside of their blood. The CTCs have different mechanical properties in comparison with red and white blood cells, and their detection may be employed to study the efficiency of medical treatments against cancer. We present the design of a novel MEMS microgripper with rotatory electrostatic comb-drive actuators for mechanical properties characterization of cells. The microgripper has a compact structural configuration of four polysilicon layers and a simple performance that control the opening and closing displacements of the microgripper tips. The microgripper has a mobile arm, a fixed arm, two different actuators and two serpentine springs, which are designed based on the SUMMiT V surface micromachining process from Sandia National Laboratories. The proposed microgripper operates at its first rotational resonant frequency and its mobile arm has a controlled displacement of 40 µm at both opening and closing directions using dc and ac bias voltages. Analytical models are developed to predict the stiffness, damping forces and first torsional resonant frequency of the microgripper. In addition, finite element method (FEM) models are obtained to estimate the mechanical behavior of the microgripper. The results of the analytical models agree very well respect to FEM simulations. The microgripper has a first rotational resonant frequency of 463.8 Hz without gripped cell and it can operate up to with maximum dc and ac voltages of 23.4 V and 129.2 V, respectively. Based on the results of the analytical and FEM models about the performance of the proposed microgripper, it could be used as a dispositive for mechanical properties characterization of circulating tumor cells (CTCs). PMID:29789474

Parylene supported 20um*20um uncooled thermoelectric infrared detector with high fill factor

NASA Astrophysics Data System (ADS)

Modarres-Zadeh, Mohammad J.; Carpenter, Zachary S.; Rockley, Mark G.; Abdolvand, Reza

2012-06-01

Presented is a novel design for an uncooled surface-micromachined thermoelectric (TE) infrared (IR) detector. The detector features a P-doped polysilicon/Nichrome (Cr20-Ni80) thermocouple, which is embedded into a thin layer of Parylene-N to provide structural support. The low thermal conductivity (~0.1W/m.K), chemical resistance, and ease of deposition/patterning of Parylene-N make it an excellent choice of material for use in MEMS thermal detectors. This detector also features an umbrella-like IR absorber composed of a three layer stack of NiCr/SiN/NiCr to optimize IR absorption. The total device area is 20 um * 20 um per pixel with an absorber area of ~19 um * 19 um resulting in a fill factor of 90%. At room temperature, a DC responsivity of ~170V/W with a rise time of less than 8 ms is measured from the fabricated devices in vacuum when viewing a 500K blackbody without any concentrating optics. The dominant source of noise in thermoelectric IR detectors is typically Johnson noise when the detectors are operating in an open circuit condition. The fabricated detectors have resistances about 85KOhm which results in Johnson noise of about 38nV/Hz^0.5. The D* is calculated to be 9 * 106 cm*Hz0.5/ W. Preliminary finite element analysis indicates that the thermal conduction from the hot junction to the substrate through the TE wires is dominant ( GTE >> Gparylene) considering the fabricated dimensions of the parylene film and the TE wires. Thus, by further reducing the size of the TE wires, GTE can be decreased and hence, responsivity can be improved while the parylene film sustains the structural integrity of the cell.

Area-variable capacitive microaccelerometer with force-balancing electrodes

NASA Astrophysics Data System (ADS)

Ha, Byeoungju; Lee, Byeungleul; Sung, Sangkyung; Choi, Sangon; Shinn, Meenam; Oh, Yong-Soo; Song, Ci M.

1997-11-01

A surface micromachined accelerometer which senses an inertial motion with an area variation and a force balancing electrodes is developed. The grid-type planar mass of a 7 micrometers thick polysilicon is supported by four thin beams and suspended above a silicon substrate with a 1.5 micrometers air gap. The motion sensing electrodes are formed on the substrate. The sensor is designed as an interdigital rib structure that has a differential capacitor arrangement. The moveable electrodes are mounted on the mass and the pairs of the stationary electrodes are patterned on the substrate. In the accelerometer that has comb-type movable electrodes, the mechanical stress and the electrical pulling effects between a moveable electrodes and the fixed electrodes occur. However this grid-type structure can have a large area variation in a small area relatively without stress and pulling, high sensitivity can be achieved. In order to improve the dynamic rang and a linearity, a pair of comb shape force-balancing electrodes are implemented on both sides of the mass. The force-balancing electrodes are made of the same layer as the mass and anchored on a silicon substrate. When acceleration is applied in the lateral direction, the difference of capacitance results from the area variation between the two capacitors and is measured using a charge amplifier. As AC coupled complimentary pick- off signals are applied in paris of stationary electrodes, the undesirable effects due to temperature and electrical noise are reduced effectively. The accelerometer has a sensitivity of 28mV/g and a bandwidth of DC-120Hz. A resolution of 3mg and a non-linearity of 1.3 percent is achieved for a measurement range of +/- 9 g.

Monolithic Micromachined Quartz Resonator based Infrared Focal Plane Arrays

DTIC Science & Technology

2012-05-05

following categories: PaperReceived Ping Kao, Srinivas Tadigadapa. Micromachined quartz resonator based infrared detector array, Sensors and...0. doi: 10.1088/0957-0233/20/12/124007 2012/05/08 19:47:37 6 S Tadigadapa, K Mateti. Piezoelectric MEMS sensors : state-of-the-art and perspectives...Ping Kao, David L. Allara, Srinivas Tadigadapa. Study of Adsorption of Globular Proteins on Hydrophobic Surfaces, IEEE Sensors Journal, (11 2011): 0

Nanosecond pulsed laser micromachining for experimental fatigue life study of Ti-3Al-2.5V tubes

NASA Astrophysics Data System (ADS)

Lin, Yaomin; Gupta, Mool C.; Taylor, Robert E.; Lei, Charles; Stone, William; Spidel, Tom; Yu, Michael; Williams, Reanne

2009-01-01

Defects on external surface of in-service hydraulic tubes can reduce total life cycles for operation. Evaluation of fatigue life of the tubes with damage is thus critical for safety reasons. A methodology of generating defects in the Ti-3Al-2.5V tube—a widely used pipeline in hydraulic systems of aircrafts—using nanosecond pulsed laser for experimental fatigue life study is described in this paper. Straight tubes of five different sizes were laser micromachined to generate notches of given length and depths on the outside surface. Approaches were developed to precisely control the notch dimensions. The laser-notched tubes were tested with cyclic internal impulse pressure and fatigue life was measured. The laser notches and fatigue cracks were characterized after the test. It is concluded that laser micromachining generated consistent notches, and the influence of notch depth on fatigue life of the tube is significant. Based on the experimental test results, the relationship between the fatigue life of the Ti-3Al-2.5V tube and the notch depth was revealed. The research demonstrated that laser micromachining is applicable for experimental fatigue life study of titanium tubes. The presented test data are useful for estimating the damage limits of the titanium tubes in service environment and for further theoretical studies.

Two-Scale Simulation of Drop-Induced Failure of Polysilicon MEMS Sensors

PubMed Central

Mariani, Stefano; Ghisi, Aldo; Corigliano, Alberto; Martini, Roberto; Simoni, Barbara

2011-01-01

In this paper, an industrially-oriented two-scale approach is provided to model the drop-induced brittle failure of polysilicon MEMS sensors. The two length-scales here investigated are the package (macroscopic) and the sensor (mesoscopic) ones. Issues related to the polysilicon morphology at the micro-scale are disregarded; an upscaled homogenized constitutive law, able to describe the brittle cracking of silicon, is instead adopted at the meso-scale. The two-scale approach is validated against full three-scale Monte-Carlo simulations, which allow for stochastic effects linked to the microstructural properties of polysilicon. Focusing on inertial MEMS sensors exposed to drops, it is shown that the offered approach matches well the experimentally observed failure mechanisms. PMID:22163885

A molded surface-micromachining and bulk etching release (MOSBE) fabrication platform on (1 1 1) Si for MOEMS

NASA Astrophysics Data System (ADS)

Wu, Mingching; Fang, Weileun

2006-02-01

This work attempts to integrate poly-Si thin film and single-crystal-silicon (SCS) structures in a monolithic process. The process integrated multi-depth DRIE (deep reactive ion etching), trench-refilled molding, a two poly-Si MUMPs process and (1 1 1) Si bulk micromachining to accomplish multi-thickness and multi-depth structures for superior micro-optical devices. In application, a SCS scanning mirror driven by self-aligned vertical comb-drive actuators was demonstrated. The stiffness of the mirror was significantly increased by thick SCS structures. The thin poly-Si film served as flexible torsional springs and electrical routings. The depth difference of the vertical comb electrodes was tuned by DRIE to increase the devices' stroke. Finally, a large moving space was available after the bulk Si etching. In summary, the present fabrication process, named (1 1 1) MOSBE (molded surface-micromachining and bulk etching release on (1 1 1) Si substrate), can further integrate with the MUMPs devices to establish a more powerful platform.

Design principles for high efficiency small-grain polysilicon solar cells, with supporting experimental studies

NASA Technical Reports Server (NTRS)

Lindholm, F. A.; Neugroschel, A.; Sah, C. T.

1982-01-01

Design principles suggested here aim toward high conversion efficiency (greater than 15 percent) in polysilicon cells. The principles seek to decrease the liabilities of both intragranular and grain-boundary-surface defects. The advantages of a phosphorus atom concentration gradient in a thin (less than 50 microns) base of a p(+)/n(x)/n(+) drift-field solar cell, which produces favorable gradients in chemical potential, minority-carrier mobility and diffusivity, and recombination lifetime (via phosphorus gettering) are suggested. The degrading effects of grain boundaries are reduced by these three gradients and by substituting atoms (P, H, F or Li) for vacancies on the grain-boundary surface. From recent experiments comes support for the benefits of P diffusion down grain boundaries and, for quasi-grain-boundary-free and related structures. New analytic solutions for the n(x)-base include the effect of a power-law dependence between P concentration and lifetime. These provide an upper-bound estimate on the open circuit voltage. Finite-difference numerical solutions of the six Shockley equations furnish complete information about all solar-cell parameters and add insight concerning design.

Electrically Erasable Programmable Integrated Circuits for Replacement of Obsolete TTL Logic

DTIC Science & Technology

1991-12-01

different discrete devices" [7]. Fowler-Nordheim Tunneling Simplified Theory. Electrons in polysilicon are usually prevented from entering SiO 2 by an...overcomes the energy barrier, the tunneling electrons will not return to the polysilicon but will be carried by the electric field, causing a current to flow...Floating Gate Transistors A floating gate transistor is an insulated-gate field effect transistor (FET) that has a gate, usually made of polysilicon , which

Advanced Electrical Test Techniques for LSI Microcircuits.

DTIC Science & Technology

1982-03-01

high resistance polysilicon load resistors stacked in the "Z" direction for higher packing density. Featuring resistors typically in the gigaohm range...are made up of "N" diffusions, metal and/or polysilicon lines, and transistors, they are subject to leakage defects. If the leakage of the nonconducting...reference 7) show- ing a poor connection from the FF lead resistor ( Polysilicon ) to the Vcc or the transistor. The FF layout of Figure 1B shows that

Theoretical-Experimental Analysis of the Effects of Grain Boundaries on the Electrical Properties of SOI (Silicon-on-Insulator) MOSFETS.

DTIC Science & Technology

1983-11-01

work on recrystallization of polycrystalline silicon ( polysilicon ) films deposited on silicon-dioxide has demonstrated remarkable improvement in film...quality, and thus has identified another possibly viable 1SO technology for ICs. The polysilicon -on-S10 2 technology not only has the advantages alluded...and consequently higher areal device densities. Virtually all the research to date on polysilicon -on-SiO 2 has concentrated on the

Experimental study of the minority-carrier transport at the polysilicon-monosilicon interface

NASA Astrophysics Data System (ADS)

Neugroschel, A.; Arienzo, M.; Isaac, R. D.; Komem, Y.

1985-04-01

This paper presents the results of an experimental study designed to explore both qualitatively and quantitatively the mechanism of the improved current gain in bipolar transistors with polysilicon emitter contacts. Polysilicon contacts were deposited and heat treated at different conditions. The electrical properties were measured using p-n junction test structures that are much more sensitive to the contact properties than are bipolar transistors. A simple phenomenological model was used to correlate the structural properties with electrical measurements. Possible transport mechanisms are examined and estimates are made about upper bounds on transport parameters in the principal regions of the devices. The main conclusion of this study is that the minority-carrier transport in the polycrystalline silicon is dominated by a highly disordered layer at the polysilicon-monosilicon interface characterized by very low minority-carrier mobility. The effective recombination velocity at the n(+) polysilicon-n(+) monosilicon interface was found to be a strong function of fabrication conditions. The results indicate that the recombination velocity can be much smaller than 10,000 cm/s.

Experimental Study of Heat Transfer Performance of Polysilicon Slurry Drying Process

NASA Astrophysics Data System (ADS)

Wang, Xiaojing; Ma, Dongyun; Liu, Yaqian; Wang, Zhimin; Yan, Yangyang; Li, Yuankui

2016-12-01

In recent years, the growth of the solar energy photovoltaic industry has greatly promoted the development of polysilicon. However, there has been little research into the slurry by-products of polysilicon production. In this paper the thermal performance of polysilicon slurry was studied in an industrial drying process with a twin-screw horizontal intermittent dryer. By dividing the drying process into several subunits, the parameters of each unit could be regarded as constant in that period. The time-dependent changes in parameters including temperature, specific heat and evaporation enthalpy were plotted. An equation for the change in the heat transfer coefficient over time was calculated based on heat transfer equations. The concept of a distribution coefficient was introduced to reflect the influence of stirring on the heat transfer area. The distribution coefficient ranged from 1.2 to 1.7 and was obtained with the fluid simulation software FLUENT, which simplified the calculation of heat transfer area during the drying process. These experimental data can be used to guide the study of polysilicon slurry drying and optimize the design of dryers for industrial processes.

Surface-micromachined microfluidic devices

DOEpatents

Galambos, Paul C.; Okandan, Murat; Montague, Stephen; Smith, James H.; Paul, Phillip H.; Krygowski, Thomas W.; Allen, James J.; Nichols, Christopher A.; Jakubczak, II, Jerome F.

2003-01-01

Microfluidic devices are disclosed which can be manufactured using surface-micromachining. These devices utilize an electroosmotic force or an electromagnetic field to generate a flow of a fluid in a microchannel that is lined, at least in part, with silicon nitride. Additional electrodes can be provided within or about the microchannel for separating particular constituents in the fluid during the flow based on charge state or magnetic moment. The fluid can also be pressurized in the channel. The present invention has many different applications including electrokinetic pumping, chemical and biochemical analysis (e.g. based on electrophoresis or chromatography), conducting chemical reactions on a microscopic scale, and forming hydraulic actuators.

Applications of picosecond lasers and pulse-bursts in precision manufacturing

NASA Astrophysics Data System (ADS)

Knappe, Ralf

2012-03-01

Just as CW and quasi-CW lasers have revolutionized the materials processing world, picosecond lasers are poised to change the world of micromachining, where lasers outperform mechanical tools due to their flexibility, reliability, reproducibility, ease of programming, and lack of mechanical force or contamination to the part. Picosecond lasers are established as powerful tools for micromachining. Industrial processes like micro drilling, surface structuring and thin film ablation benefit from a process, which provides highest precision and minimal thermal impact for all materials. Applications such as microelectronics, semiconductor, and photovoltaic industries use picosecond lasers for maximum quality, flexibility, and cost efficiency. The range of parts, manufactured with ps lasers spans from microscopic diamond tools over large printing cylinders with square feet of structured surface. Cutting glass for display and PV is a large application, as well. With a smart distribution of energy into groups of ps-pulses at ns-scale separation (known as burst mode) ablation rates can be increased by one order of magnitude or more for some materials, also providing a better surface quality under certain conditions. The paper reports on the latest results of the laser technology, scaling of ablation rates, and various applications in ps-laser micromachining.

High definition surface micromachining of LiNbO 3 by ion implantation

NASA Astrophysics Data System (ADS)

Chiarini, M.; Bentini, G. G.; Bianconi, M.; De Nicola, P.

2010-10-01

High Energy Ion Implantation (HEII) of both medium and light mass ions has been successfully applied for the surface micromachining of single crystal LiNbO 3 (LN) substrates. It has been demonstrated that the ion implantation process generates high differential etch rates in the LN implanted areas, when suitable implantation parameters, such as ion species, fluence and energy, are chosen. In particular, when traditional LN etching solutions are applied to suitably ion implanted regions, etch rates values up to three orders of magnitude higher than the typical etching rates of the virgin material, are registered. Further, the enhancement in the etching rate has been observed on x, y and z-cut single crystalline material, and, due to the physical nature of the implantation process, it is expected that it can be equivalently applied also to substrates with different crystallographic orientations. This technique, associated with standard photolithographic technologies, allows to generate in a fast and accurate way very high aspect ratio relief micrometric structures on LN single crystal surface. In this work a description of the developed technology is reported together with some examples of produced micromachined structures: in particular very precisely defined self sustaining suspended structures, such as beams and membranes, generated on LN substrates, are presented. The developed technology opens the way to actual three dimensional micromachining of LN single crystals substrates and, due to the peculiar properties characterising this material, (pyroelectric, electro-optic, acousto-optic, etc.), it allows the design and the production of complex integrated elements, characterised by micrometric features and suitable for the generation of advanced Micro Electro Optical Systems (MEOS).

Guiding gate-etch process development using 3D surface reaction modeling for 7nm and beyond

NASA Astrophysics Data System (ADS)

Dunn, Derren; Sporre, John R.; Deshpande, Vaibhav; Oulmane, Mohamed; Gull, Ronald; Ventzek, Peter; Ranjan, Alok

2017-03-01

Increasingly, advanced process nodes such as 7nm (N7) are fundamentally 3D and require stringent control of critical dimensions over high aspect ratio features. Process integration in these nodes requires a deep understanding of complex physical mechanisms to control critical dimensions from lithography through final etch. Polysilicon gate etch processes are critical steps in several device architectures for advanced nodes that rely on self-aligned patterning approaches to gate definition. These processes are required to meet several key metrics: (a) vertical etch profiles over high aspect ratios; (b) clean gate sidewalls free of etch process residue; (c) minimal erosion of liner oxide films protecting key architectural elements such as fins; and (e) residue free corners at gate interfaces with critical device elements. In this study, we explore how hybrid modeling approaches can be used to model a multi-step finFET polysilicon gate etch process. Initial parts of the patterning process through hardmask assembly are modeled using process emulation. Important aspects of gate definition are then modeled using a particle Monte Carlo (PMC) feature scale model that incorporates surface chemical reactions.1 When necessary, species and energy flux inputs to the PMC model are derived from simulations of the etch chamber. The modeled polysilicon gate etch process consists of several steps including a hard mask breakthrough step (BT), main feature etch steps (ME), and over-etch steps (OE) that control gate profiles at the gate fin interface. An additional constraint on this etch flow is that fin spacer oxides are left intact after final profile tuning steps. A natural optimization required from these processes is to maximize vertical gate profiles while minimizing erosion of fin spacer films.2

ISITE: Automatic Circuit Synthesis for Double-Metal CMOS VLSI (Very Large Scale Integrated) Circuits

DTIC Science & Technology

1989-12-01

rows and columns should be minimized. There are two methodologies for achieving this objective, namely, logic minimization to I I I 15 I A B C D E T...type and N-type polysilicon (Figure 2.5( b )) and interconnecting the gates with metal at a later I processing step. The two layers of aluminum available...polysiliconI ...... .. ... .. .. . .. ... .. ... .. I N polysilicon Iii~~iiiiiiii~~iiiiii (a) ( b ) 3 Figure 2.5. Controlling the Threshold Voltage in

Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach.

PubMed

Mariani, Stefano; Ghisi, Aldo; Corigliano, Alberto; Zerbini, Sarah

2009-01-01

Failure of packaged polysilicon micro-electro-mechanical systems (MEMS) subjected to impacts involves phenomena occurring at several length-scales. In this paper we present a multi-scale finite element approach to properly allow for: (i) the propagation of stress waves inside the package; (ii) the dynamics of the whole MEMS; (iii) the spreading of micro-cracking in the failing part(s) of the sensor. Through Monte Carlo simulations, some effects of polysilicon micro-structure on the failure mode are elucidated.

SCMOS (Scalable Complementary Metal Oxide Silicon) Silicon Compiler Organelle Design and Insertion.

DTIC Science & Technology

1987-12-01

polysilicon running horizontally), with the p-type toward Vdd and the n-type toward GND. * Substrate contacts are connected by metal to supply rails...IN’) + (CIN’) Note: The single quote (’) represents the ’not’ of the variable. Figure 2.3 Logic Expressions.. * First metal and polysilicon are... polysilicon . *All external connections to 1,10, CLOCK, Vdd and G.ND end at least 2 units past first metal that is not an 1,0 point. *All external

Omega-X micromachining system

DOEpatents

Miller, Donald M.

1978-01-01

A micromachining tool system with X- and omega-axes is used to machine spherical, aspherical, and irregular surfaces with a maximum contour error of 100 nonometers (nm) and surface waviness of no more than 0.8 nm RMS. The omega axis, named for the angular measurement of the rotation of an eccentric mechanism supporting one end of a tool bar, enables the pulse increments of the tool toward the workpiece to be as little as 0 to 4.4 nm. A dedicated computer coordinates motion in the two axes to produce the workpiece contour. Inertia is reduced by reducing the mass pulsed toward the workpiece to about one-fifth of its former value. The tool system includes calibration instruments to calibrate the micromachining tool system. Backlash is reduced and flexing decreased by using a rotary table and servomotor to pulse the tool in the omega-axis instead of a ball screw mechanism. A thermally-stabilized spindle rotates the workpiece and is driven by a motor not mounted on the micromachining tool base through a torque-smoothing pulley and vibrationless rotary coupling. Abbe offset errors are almost eliminated by tool setting and calibration at spindle center height. Tool contour and workpiece contour are gaged on the machine; this enables the source of machining errors to be determined more readily, because the workpiece is gaged before its shape can be changed by removal from the machine.

Influence of high energy electron irradiation on the characteristics of polysilicon thin film transistors

NASA Astrophysics Data System (ADS)

Aleksandrova, P. V.; Gueorguiev, V. K.; Ivanov, Tz. E.; Kaschieva, S.

2006-08-01

The influence of high energy electron (23 MeV) irradiation on the electrical characteristics of p-channel polysilicon thin film transistors (PSTFTs) was studied. The channel 220 nm thick LPCVD (low pressure chemical vapor deposition) deposited polysilicon layer was phosphorus doped by ion implantation. A 45 nm thick, thermally grown, SiO2 layer served as gate dielectric. A self-alignment technology for boron doping of the source and drain regions was used. 200 nm thick polysilicon film was deposited as a gate electrode. The obtained p-channel PSTFTs were irradiated with different high energy electron doses. Leakage currents through the gate oxide and transfer characteristics of the transistors were measured. A software model describing the field enhancement and the non-uniform current distribution at textured polysilicon/oxide interface was developed. In order to assess the irradiation-stimulated changes of gate oxide parameters the gate oxide tunneling conduction and transistor characteristics were studied. At MeV dose of 6×1013 el/cm2, a negligible degradation of the transistor properties was found. A significant deterioration of the electrical properties of PSTFTs at MeV irradiation dose of 3×1014 el/cm2 was observed.

Review of the workshop on low-cost polysilicon for terrestrial photovoltaic solar cell applications

NASA Technical Reports Server (NTRS)

Lutwack, R.

1986-01-01

Topics reviewed include: polysilicon material requirements; effects of impurities; requirements for high-efficiency solar cells; economics; development of silane processes; fluidized-bed processor development; silicon purification; and marketing.

Direct embryo tagging and identification system by attachment of biofunctionalized polysilicon barcodes to the zona pellucida of mouse embryos.

PubMed

Novo, Sergi; Penon, Oriol; Barrios, Leonardo; Nogués, Carme; Santaló, Josep; Durán, Sara; Gómez-Matínez, Rodrigo; Samitier, Josep; Plaza, José Antonio; Pérez-García, Luisa; Ibáñez, Elena

2013-06-01

Is the attachment of biofunctionalized polysilicon barcodes to the outer surface of the zona pellucida an effective approach for the direct tagging and identification of cultured embryos? The results achieved provide a proof of concept for a direct embryo tagging system using biofunctionalized polysilicon barcodes, which could help to minimize the risk of mismatching errors (mix-ups) in human assisted reproduction technologies. Even though the occurrence of mix-ups is rare, several cases have been reported in fertility clinics around the world. Measures to prevent the risk of mix-ups in human assisted reproduction technologies are therefore required. Mouse embryos were tagged with 10 barcodes and the effectiveness of the tagging system was tested during fresh in vitro culture (n=140) and after embryo cryopreservation (n = 84). Finally, the full-term development of tagged embryos was evaluated (n =105). Mouse pronuclear embryos were individually rolled over wheat germ agglutinin-biofunctionalized polysilicon barcodes to distribute them uniformly around the ZONA PELLUCIDA surface. Embryo viability and retention of barcodes were determined during 96 h of culture. The identification of tagged embryos was performed every 24 h in an inverted microscope and without embryo manipulation to simulate an automatic reading procedure. Full-term development of the tagged embryos was assessed after their transfer to pseudo-pregnant females. To test the validity of the embryo tagging system after a cryopreservation process, tagged embryos were frozen at the 2-cell stage using a slow freezing protocol, and followed in culture for 72 h after thawing. Neither the in vitro or in vivo development of tagged embryos was adversely affected. The tagging system also proved effective during an embryo cryopreservation process. Global identification rates higher than 96 and 92% in fresh and frozen-thawed tagged embryos, respectively, were obtained when simulating an automatic barcode reading system, although these rates could be increased to 100% by simply rotating the embryos during the reading process. The direct embryo tagging developed here has exclusively been tested in mouse embryos. Its effectiveness in other species, such as the human, is currently being tested. The direct embryo tagging system developed here, once tested in human embryos, could provide fertility clinics with a novel tool to reduce the risk of mix-ups in human assisted reproduction technologies.

Low stress polysilicon film and method for producing same

NASA Technical Reports Server (NTRS)

Heuer, Arthur H. (Inventor); Kahn, Harold (Inventor); Yang, Jie (Inventor)

2001-01-01

Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin film may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films.

Low stress polysilicon film and method for producing same

NASA Technical Reports Server (NTRS)

Heuer, Arthur H. (Inventor); Kahn, Harold (Inventor); Yang, Jie (Inventor)

2002-01-01

Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin film may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films.

The Mathematical Modeling and Computer Simulation of Electrochemical Micromachining Using Ultrashort Pulses

NASA Astrophysics Data System (ADS)

Kozak, J.; Gulbinowicz, D.; Gulbinowicz, Z.

2009-05-01

The need for complex and accurate three dimensional (3-D) microcomponents is increasing rapidly for many industrial and consumer products. Electrochemical machining process (ECM) has the potential of generating desired crack-free and stress-free surfaces of microcomponents. This paper reports a study of pulse electrochemical micromachining (PECMM) using ultrashort (nanoseconds) pulses for generating complex 3-D microstructures of high accuracy. A mathematical model of the microshaping process with taking into consideration unsteady phenomena in electrical double layer has been developed. The software for computer simulation of PECM has been developed and the effects of machining parameters on anodic localization and final shape of machined surface are presented.

The influence of ArF excimer laser micromachining on physicochemical properties of bioresorbable poly(L-lactide)

NASA Astrophysics Data System (ADS)

Stepak, Bogusz D.; Antończak, Arkadiusz J.; Szustakiewicz, Konrad; Pezowicz, Celina; Abramski, Krzysztof M.

2016-03-01

The main advantage of laser processing is a non-contact character of material removal and high precision attainable thanks to low laser beam dimensions. This technique enables forming a complex, submillimeter geometrical shapes such as vascular stents which cannot be manufactured using traditional techniques e.g. injection moulding or mechanical treatment. In the domain of nanosecond laser sources, an ArF excimer laser appears as a good candidate for laser micromachining of bioresorbable polymers such as poly(L-lactide). Due to long pulse duration, however, there is a risk of heat diffusion and accumulation in the material. In addition, due to short wavelength (193 nm) photochemical process can modify the chemical composition of ablated surfaces. The motivation for this research was to evaluate the influence of laser micromachining on physicochemical properties of poly(L-lactide). We performed calorimetric analysis of laser machined samples by using differential scanning calorimetry (DSC). It allowed us to find the optimal process parameters for heat affected zone (HAZ) reduction. The chemical composition of the ablated surface was investigated by FTIR in attenuated total reflectance (ATR) mode.

Process for laser machining and surface treatment

DOEpatents

Neil, George R.; Shinn, Michelle D.

2004-10-26

An improved method and apparatus increasing the accuracy and reducing the time required to machine materials, surface treat materials, and allow better control of defects such as particulates in pulsed laser deposition. The speed and quality of machining is improved by combining an ultrashort pulsed laser at high average power with a continuous wave laser. The ultrashort pulsed laser provides an initial ultrashort pulse, on the order of several hundred femtoseconds, to stimulate an electron avalanche in the target material. Coincident with the ultrashort pulse or shortly after it, a pulse from a continuous wave laser is applied to the target. The micromachining method and apparatus creates an initial ultrashort laser pulse to ignite the ablation followed by a longer laser pulse to sustain and enlarge on the ablation effect launched in the initial pulse. The pulse pairs are repeated at a high pulse repetition frequency and as often as desired to produce the desired micromachining effect. The micromachining method enables a lower threshold for ablation, provides more deterministic damage, minimizes the heat affected zone, minimizes cracking or melting, and reduces the time involved to create the desired machining effect.

Method for fabricating five-level microelectromechanical structures and microelectromechanical transmission formed

DOEpatents

Rodgers, M. Steven; Sniegowski, Jeffry J.; Miller, Samuel L.; McWhorter, Paul J.

2000-01-01

A process for forming complex microelectromechanical (MEM) devices having five layers or levels of polysilicon, including four structural polysilicon layers wherein mechanical elements can be formed, and an underlying polysilicon layer forming a voltage reference plane. A particular type of MEM device that can be formed with the five-level polysilicon process is a MEM transmission for controlling or interlocking mechanical power transfer between an electrostatic motor and a self-assembling structure (e.g. a hinged pop-up mirror for use with an incident laser beam). The MEM transmission is based on an incomplete gear train and a bridging set of gears that can be moved into place to complete the gear train to enable power transfer. The MEM transmission has particular applications as a safety component for surety, and for this purpose can incorporate a pin-in-maze discriminator responsive to a coded input signal.

Vascular tissue engineering by computer-aided laser micromachining.

PubMed

Doraiswamy, Anand; Narayan, Roger J

2010-04-28

Many conventional technologies for fabricating tissue engineering scaffolds are not suitable for fabricating scaffolds with patient-specific attributes. For example, many conventional technologies for fabricating tissue engineering scaffolds do not provide control over overall scaffold geometry or over cell position within the scaffold. In this study, the use of computer-aided laser micromachining to create scaffolds for vascular tissue networks was investigated. Computer-aided laser micromachining was used to construct patterned surfaces in agarose or in silicon, which were used for differential adherence and growth of cells into vascular tissue networks. Concentric three-ring structures were fabricated on agarose hydrogel substrates, in which the inner ring contained human aortic endothelial cells, the middle ring contained HA587 human elastin and the outer ring contained human aortic vascular smooth muscle cells. Basement membrane matrix containing vascular endothelial growth factor and heparin was to promote proliferation of human aortic endothelial cells within the vascular tissue networks. Computer-aided laser micromachining provides a unique approach to fabricate small-diameter blood vessels for bypass surgery as well as other artificial tissues with complex geometries.

Surface-Micromachined Microfluidic Devices

DOEpatents

Galambos, Paul C.; Okandan, Murat; Montague, Stephen; Smith, James H.; Paul, Phillip H.; Krygowski, Thomas W.; Allen, James J.; Nichols, Christopher A.; Jakubczak, II, Jerome F.

2004-09-28

Microfluidic devices are disclosed which can be manufactured using surface-micromachining. These devices utilize an electroosmotic force or an electromagnetic field to generate a flow of a fluid in a microchannel that is lined, at least in part, with silicon nitride. Additional electrodes can be provided within or about the microchannel for separating particular constituents in the fluid during the flow based on charge state or magnetic moment. The fluid can also be pressurized in the channel. The present invention has many different applications including electrokinetic pumping, chemical and biochemical analysis (e.g. based on electrophoresis or chromatography), conducting chemical reactions on a microscopic scale, and forming hydraulic actuators. Microfluidic devices are disclosed which can be manufactured using surface-micromachining. These devices utilize an electroosmotic force or an electromagnetic field to generate a flow of a fluid in a microchannel that is lined, at least in part, with silicon nitride. Additional electrodes can be provided within or about the microchannel for separating particular constituents in the fluid during the flow based on charge state or magnetic moment. The fluid can also be pressurized in the channel. The present invention has many different applications including electrokinetic pumping, chemical and biochemical analysis (e.g. based on electrophoresis or chromatography), conducting chemical reactions on a microscopic scale, and forming hydraulic actuators.

Nanoscale deformation and fracture mechanics of polycrystalline silicon and diamond-like carbon for MEMS by the AFM/DIC method

NASA Astrophysics Data System (ADS)

Cho, Sung Woo

A method for nanoscale experimental mechanics was developed to address problems in deformation and fracture of micron-scale components in Microelectromechanical Systems (MEMS). Specifically, the effective and local, elastic and fracture behavior of polycrystalline silicon (polysilicon) and tetrahedral amorphous diamond-like carbon (ta-C) were studied using freestanding thin films subject to uniaxial tension. In this method, direct measurements of local deformations were derived from Atomic Force Microscopy (AFM) images in specimen areas varying between 1x2 mum2 and 15x15 mum2 using Digital Image Correlation (DIC) to extract displacements and strains with spatial resolution of 1-2 nm. The effective elastic modulus and Poisson's ratio of polysilicon and ta-C from the Sandia National Laboratories (SUMMiT) were 155 +/- 6 GPa and 0.22 +/- 0.02, and 759 +/- 22 GPa and 0.17 +/- 0.03, respectively. Similarly, the elastic modulus and Poisson's ratio of polysilicon fabricated at MCNC via the Multi-User MEMS Processes (MUMPs) with <110> texture were 164 +/- 7 GPa and 0.22 +/- 0.02, respectively. A second problem studied using the AFM/DIC method was the fracture of polysilicon in the presence of atomically sharp cracks. The effective (macroscopic) Mode-I critical stress intensity factor for polysilicon from different MUMPs runs was 1.00 +/- 0.1 MPa√m, where 0.1 MPa√m was the standard deviation, attributed to local cleavage anisotropy and grain boundary toughening. The variation in the effective critical stress intensity factor and the subcritical crack growth of polysilicon that was spatially recorded and quantified for the first time were the result of the spatial variation of the 4 local stress intensity factor at the crack tip that controlled crack initiation and thus, the overall fracture process. The AFM/DIC method was also applied to determine the minimum size of a polysilicon domain whose effective mechanical behavior could be described by the isotropic elastic constants. The isotropic material constants are applicable to MEMS components comprised of at least 15x15 grains, which correspond to a specimen area of 10x10-mum2 for SUMMiT and of 5x5-mum2 for MUMPs polysilicon, respectively.

A broad-band microseismometer for planetary operations

NASA Technical Reports Server (NTRS)

Banerdt, W. B.; Vanzandt, T.; Kaiser, W. J.; Kenny, T. W.

1993-01-01

There has recently been renewed interest in the development of instrumentation for making measurements on the surface of Mars. This is due to the Mars Environmental Survey (MESUR) Mission, for which approximately 16 small, long-lived (2-10 years), relatively inexpensive surface stations will be deployed in a planet-wide network. This will allow the investigation of processes (such as seismology and meteorology) which require the simultaneous measurement of phenomena at many widely spaced locations on the surface over a considerable length of time. Due to the large number of vehicles involved, the mass, power, and cost of the payload will be severely constrained. A seismometer has been identified as one of the highest priority instruments in the MESUR straw-man payload. The requirements for an effective seismic experiment on Mars place a number of constraints on any viable sensor design. First, a large number of sensors must be deployed in a long-lived global network in order to be able to locate many events reliably, provide good spatial sampling of the interior, and increase the probability of seismic detection in the event of localized seismicity and/or high attenuation. From a practical standpoint, this means that individual surface stations will necessarily be constrained in terms of cost, mass, and power. Landing and thermal control systems will probably be simple, in order to minimize cost, resulting in large impact accelerations and wide daily and seasonal thermal swings. The level of seismic noise will determine the maximum usable sensitivity for seismometer. Unfortunately, the ambient seismic noise level for Mars is not well known. However lunar seismic noise levels are several orders of magnitude below that of the Earth. Sensitivities on the order of 10(exp -11)g over a bandwidth of .04 to 20 Hz are thought to be necessary to fulfill the science objectives for a seimometer placed on the Martian surface. Silicon micromachined sensor technology offers techniques for the fabrication of monolithic, robust, compact, lower power and mass accelerometers. Conventional micro-machined accelerometers have been developed and are commercially available for high frequency and large acceleration measurements. The new seismometer we are developing incorporates certain principles of conventional silicon micromachined accelerometer technology. However, currently available silicon micromachined sensors offer inadequate sensitivity and bandwidth for the Mars seismometer application. Our implementation of an advanced silicon micromachined seismometer is based on principles recently developed at JPL for high-sensitivity position sensor technology.

Air Bearings Machined On Ultra Precision, Hydrostatic CNC-Lathe

NASA Astrophysics Data System (ADS)

Knol, Pierre H.; Szepesi, Denis; Deurwaarder, Jan M.

1987-01-01

Micromachining of precision elements requires an adequate machine concept to meet the high demand of surface finish, dimensional and shape accuracy. The Hembrug ultra precision lathes have been exclusively designed with hydrostatic principles for main spindle and guideways. This concept is to be explained with some major advantages of hydrostatics compared with aerostatics at universal micromachining applications. Hembrug has originally developed the conventional Mikroturn ultra precision facing lathes, for diamond turning of computer memory discs. This first generation of machines was followed by the advanced computer numerically controlled types for machining of complex precision workpieces. One of these parts, an aerostatic bearing component has been succesfully machined on the Super-Mikroturn CNC. A case study of airbearing machining confirms the statement that a good result of the micromachining does not depend on machine performance alone, but also on the technology applied.

Micromachined patch-clamp apparatus

DOEpatents

Okandan, Murat

2012-12-04

A micromachined patch-clamp apparatus is disclosed for holding one or more cells and providing electrical, chemical, or mechanical stimulation to the cells during analysis with the patch-clamp technique for studying ion channels in cell membranes. The apparatus formed on a silicon substrate utilizes a lower chamber formed from silicon nitride using surface micromachining and an upper chamber formed from a molded polymer material. An opening in a common wall between the chambers is used to trap and hold a cell for analysis using the patch-clamp technique with sensing electrodes on each side of the cell. Some embodiments of the present invention utilize one or more electrostatic actuators formed on the substrate to provide mechanical stimulation to the cell being analyzed, or to provide information about mechanical movement of the cell in response to electrical or chemical stimulation.

Design and simulation of betavoltaic battery using large-grain polysilicon.

PubMed

Yao, Shulin; Song, Zijun; Wang, Xiang; San, Haisheng; Yu, Yuxi

2012-10-01

In this paper, we present the design and simulation of a p-n junction betavoltaic battery based on large-grain polysilicon. By the Monte Carlo simulation, the average penetration depth were obtained, according to which the optimal depletion region width was designed. The carriers transport model of large-grain polysilicon is used to determine the diffusion length of minority carrier. By optimizing the doping concentration, the maximum power conversion efficiency can be achieved to be 0.90% with a 10 mCi/cm(2) Ni-63 source radiation. Copyright © 2012 Elsevier Ltd. All rights reserved.

Top-Down CMOS-NEMS Polysilicon Nanowire with Piezoresistive Transduction

PubMed Central

Marigó, Eloi; Sansa, Marc; Pérez-Murano, Francesc; Uranga, Arantxa; Barniol, Núria

2015-01-01

A top-down clamped-clamped beam integrated in a CMOS technology with a cross section of 500 nm × 280 nm has been electrostatic actuated and sensed using two different transduction methods: capacitive and piezoresistive. The resonator made from a single polysilicon layer has a fundamental in-plane resonance at 27 MHz. Piezoresistive transduction avoids the effect of the parasitic capacitance assessing the capability to use it and enhance the CMOS-NEMS resonators towards more efficient oscillator. The displacement derived from the capacitive transduction allows to compute the gauge factor for the polysilicon material available in the CMOS technology. PMID:26184222

Top-Down CMOS-NEMS Polysilicon Nanowire with Piezoresistive Transduction.

PubMed

Marigó, Eloi; Sansa, Marc; Pérez-Murano, Francesc; Uranga, Arantxa; Barniol, Núria

2015-07-14

A top-down clamped-clamped beam integrated in a CMOS technology with a cross section of 500 nm × 280 nm has been electrostatic actuated and sensed using two different transduction methods: capacitive and piezoresistive. The resonator made from a single polysilicon layer has a fundamental in-plane resonance at 27 MHz. Piezoresistive transduction avoids the effect of the parasitic capacitance assessing the capability to use it and enhance the CMOS-NEMS resonators towards more efficient oscillator. The displacement derived from the capacitive transduction allows to compute the gauge factor for the polysilicon material available in the CMOS technology.

Numerical Simulations of a 96-rod Polysilicon CVD Reactor

NASA Astrophysics Data System (ADS)

Guoqiang, Tang; Cong, Chen; Yifang, Cai; Bing, Zong; Yanguo, Cai; Tihu, Wang

2018-05-01

With the rapid development of the photovoltaic industry, pressurized Siemens belljar-type polysilicon CVD reactors have been enlarged from 24 rods to 96 rods in less than 10 years aimed at much greater single-reactor productivity. A CFD model of an industry-scale 96-rod CVD reactor was established to study the internal temperature distribution and the flow field of the reactor. Numerical simulations were carried out and compared with actual growth results from a real CVD reactor. Factors affecting polysilicon depositions such as inlet gas injections, flow field, and temperature distribution in the CVD reactor are studied.

Packaging of electro-microfluidic devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

2003-04-15

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Packaging of electro-microfluidic devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Watson, Robert D.

2002-01-01

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

76 FR 63281 - Foreign-Trade Zone 78-Nashville, TN, Application for Subzone, Hemlock Semiconductor, L.L.C...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-10-12

... DEPARTMENT OF COMMERCE Foreign-Trade Zones Board [Docket 62-2011] Foreign-Trade Zone 78--Nashville, TN, Application for Subzone, Hemlock Semiconductor, L.L.C. (Polysilicon); Clarksville, TN An... polysilicon manufacturing facility of [[Page 63282

Micromachine friction test apparatus

DOEpatents

deBoer, Maarten P.; Redmond, James M.; Michalske, Terry A.

2002-01-01

A microelectromechanical (MEM) friction test apparatus is disclosed for determining static or dynamic friction in MEM devices. The friction test apparatus, formed by surface micromachining, is based on a friction pad supported at one end of a cantilevered beam, with the friction pad overlying a contact pad formed on the substrate. A first electrostatic actuator can be used to bring a lower surface of the friction pad into contact with an upper surface of the contact pad with a controlled and adjustable force of contact. A second electrostatic actuator can then be used to bend the cantilevered beam, thereby shortening its length and generating a relative motion between the two contacting surfaces. The displacement of the cantilevered beam can be measured optically and used to determine the static or dynamic friction, including frictional losses and the coefficient of friction between the surfaces. The test apparatus can also be used to assess the reliability of rubbing surfaces in MEM devices by producing and measuring wear of those surfaces. Finally, the friction test apparatus, which is small in size, can be used as an in situ process quality tool for improving the fabrication of MEM devices.

Polysilicon planarization and plug recess etching in a decoupled plasma source chamber using two endpoint techniques

NASA Astrophysics Data System (ADS)

Kaplita, George A.; Schmitz, Stefan; Ranade, Rajiv; Mathad, Gangadhara S.

1999-09-01

The planarization and recessing of polysilicon to form a plug are processes of increasing importance in silicon IC fabrication. While this technology has been developed and applied to DRAM technology using Trench Storage Capacitors, the need for such processes in other IC applications (i.e. polysilicon studs) has increased. Both planarization and recess processes usually have stringent requirements on etch rate, recess uniformity, and selectivity to underlying films. Additionally, both processes generally must be isotropic, yet must not expand any seams that might be present in the polysilicon fill. These processes should also be insensitive to changes in exposed silicon area (pattern factor) on the wafer. A SF6 plasma process in a polysilicon DPS (Decoupled Plasma Source) reactor has demonstrated the capability of achieving the above process requirements for both planarization and recess etch. The SF6 process in the decoupled plasma source reactor exhibited less sensitivity to pattern factor than in other types of reactors. Control of these planarization and recess processes requires two endpoint systems to work sequentially in the same recipe: one for monitoring the endpoint when blanket polysilicon (100% Si loading) is being planarized and one for monitoring the recess depth while the plug is being recessed (less than 10% Si loading). The planarization process employs an optical emission endpoint system (OES). An interferometric endpoint system (IEP), capable of monitoring lateral interference, is used for determining the recess depth. The ability of using either or both systems is required to make these plug processes manufacturable. Measuring the recess depth resulting from the recess process can be difficult, costly and time- consuming. An Atomic Force Microscope (AFM) can greatly alleviate these problems and can serve as a critical tool in the development of recess processes.

Surface Engineering of Polycrystalline Silicon for Long-Term Mechanical Stress Endurance Enhancement in Flexible Low-Temperature Poly-Si Thin-Film Transistors.

PubMed

Chen, Bo-Wei; Chang, Ting-Chang; Chang, Kuan-Chang; Hung, Yu-Ju; Huang, Shin-Ping; Chen, Hua-Mao; Liao, Po-Yung; Lin, Yu-Ho; Huang, Hui-Chun; Chiang, Hsiao-Cheng; Yang, Chung-I; Zheng, Yu-Zhe; Chu, Ann-Kuo; Li, Hung-Wei; Tsai, Chih-Hung; Lu, Hsueh-Hsing; Wang, Terry Tai-Jui; Chang, Tsu-Chiang

2017-04-05

The surface morphology in polycrystalline silicon (poly-Si) film is an issue regardless of whether conventional excimer laser annealing (ELA) or the newer metal-induced lateral crystallization (MILC) process is used. This paper investigates the stress distribution while undergoing long-term mechanical stress and the influence of stress on electrical characteristics. Our simulated results show that the nonuniform stress in the gate insulator is more pronounced near the polysilicon/gate insulator edge and at the two sides of the polysilicon protrusion. This stress results in defects in the gate insulator and leads to a nonuniform degradation phenomenon, which affects both the performance and the reliability in thin-film transistors (TFTs). The degree of degradation is similar regardless of bending axis (channel-length axis, channel-width axis) or bending type (compression, tension), which means that the degradation is dominated by the protrusion effects. Furthermore, by utilizing long-term electrical bias stresses after undergoing long-tern bending stress, it is apparent that the carrier injection is severe in the subchannel region, which confirms that the influence of protrusions is crucial. To eliminate the influence of surface morphology in poly-Si, three kinds of laser energy density were used during crystallization to control the protrusion height. The device with the lowest protrusions demonstrates the smallest degradation after undergoing long-term bending.

A micromachined calorimetric gas sensor: an application of electrodeposited nanostructured palladium for the detection of combustible gases.

PubMed

Bartlett, Philip N; Guerin, Samuel

2003-01-01

Palladium films with regular nanoarchitectures were electrochemically deposited from the hexagonal (H1) lyotropic liquid crystalline phase of the nonionic surfactant octaethyleneglycol monohexadecyl ether (C16EO8) onto micromachined silicon hotplate structures. The H1-e Pd films were shown to have high surface areas (approximately 28 m2 g(-1)) and to act as effective and stable catalysts for the detection of methane in air on heating to 500 degrees C. The response of the H1-e Pd-coated planar pellistors was found to be linearly proportional to the concentration of methane between 0 and 2.5% in air with a detection limit below 0.125%. Our results show that the electrochemical deposition of nanostructured metal films offers a promising approach to the fabrication of micromachined calorimetric gas sensors for combustible gases.

High peak power solid-state laser for micromachining of hard materials

NASA Astrophysics Data System (ADS)

Herbst, Ludolf; Quitter, John P.; Ray, Gregory M.; Kuntze, Thomas; Wiessner, Alexander O.; Govorkov, Sergei V.; Heglin, Mike

2003-06-01

Laser micromachining has become a key enabling technology in the ever-continuing trend of miniaturization in microelectronics, micro-optics, and micromechanics. New applications have become commercially viable due to the emergence of innovative laser sources, such as diode pumped solid-state lasers (DPSSL), and the progress in processing technology. Examples of industrial applications are laser-drilled micro-injection nozzles for highly efficient automobile engines, or manufacturing of complex spinnerets for production of synthetic fibers. The unique advantages of laser-based techniques stem from their ability to produce high aspect ratio holes, while yielding low heat affected zones with exceptional surface quality, roundness and taper tolerances. Additionally, the ability to drill blind holes and slots in very hard materials such as diamond, silicon, sapphire, ceramics and steel is of great interest for many applications in microelectronics, semiconductor and automotive industry. This kind of high quality, high aspect ratio micromachining requires high peak power and short pulse durations.

Design, Fabrication and Levitation Experiments of a Micromachined Electrostatically Suspended Six-Axis Accelerometer

PubMed Central

Cui, Feng; Liu, Wu; Chen, Wenyuan; Zhang, Weiping; Wu, Xiaosheng

2011-01-01

A micromachined electrostatically suspended six-axis accelerometer, with a square plate as proof mass housed by a top stator and bottom stator, is presented. The device structure and related techniques concerning its operating principles, such as calculation of capacitances and electrostatic forces/moments, detection and levitation control of the proof mass, acceleration measurement, and structural parameters design, are described. Hybrid MEMS manufacturing techniques, including surface micromachining fabrication of thin film electrodes and interconnections, integration fabrication of thick nickel structures about 500 μm using UV-LIGA by successful removal of SU-8 photoresist mold, DRIE of silicon proof mass in thickness of 450 μm, microassembly and solder bonding, were employed to fabricate this prototype microdevice. A levitation experiment system for the fabricated microaccelerometer chip is introduced, and levitation results show that fast initial levitation within 10 ms and stable full suspension of the proof mass have been successfully demonstrated. PMID:22247662

Utilization of the UV laser with picosecond pulses for the formation of surface microstructures on elastomeric plastics

NASA Astrophysics Data System (ADS)

Antoszewski, B.; Tofil, S.; Scendo, M.; Tarelnik, W.

2017-08-01

Elastomeric plastics belong to a wide range of polymeric materials with special properties. They are used as construction material for seals and other components in many branches of industry and, in particular, in the biomedical industry, mechatronics, electronics and chemical equipment. The micromachining of surfaces of these materials can be used to build micro-flow, insulating, dispensing systems and chemical and biological reactors. The paper presents results of research on the effects of micro-machining of selected elastomeric plastics using a UV laser emitting picosecond pulses. The authors see the prospective application of the developed technology in the sealing technique in particular to shaping the sealing pieces co-operating with the surface of the element. The result of the study is meant to show parameters of the UV laser’s performance when producing typical components such as grooves, recesses for optimum ablation in terms of quality and productivity.

Ultrasonic Microtransport

NASA Astrophysics Data System (ADS)

Moroney, Richard Morgan, III

We have observed numerous kinetic effects using ultrasonic flexural plate waves (FPWs) in 4mu -thick composite plates of low-stress silicon nitride, piezoelectric zinc oxide and aluminum. The wavelength is typically 100 mum, and the area 3 x 8 mm^2. A successful new surface micromachining fabrication process is presented here for the first time. FPWs have been used to move liquids and gasses with motion typically indicated by polysilicon blocks in air and polystyrene spheres in water; the velocity in air is 4.5 mm/s (with a zero-to-peak input of 3 V), and in water it is 100 mum/s (with an input of 7.8 V). Other observations include pumping of a liquid dye, and mixing near the FPW surface. All quantitative observations demonstrate that the kinetic effects of FPWs are proportional to the square of the wave amplitude. The amplitude for a typical device is 250 A at 9 V input; the power in a typical FPW is about 2 mW. The amplitude can be accurately measured using a laser diffraction technique. Experimental error is about +/-10%, and many of the results agree well with a simple theory to predict the FPW amplitude; extensions of the theory model the fluid loading of FPW devices, but experiment and theory disagree by about 15%. Pumping by flexural plate waves is an example of the phenomenon known as acoustic streaming. A common solution approach is the method of successive approximations, where the nonlinear equations are first linearized and solved. This "first-order" solution is then used to determine the inhomogeneous source terms in the linearized, "second -order" equations of motion. Theoretical predictions of streaming theory are in excellent agreement with experiment in the case where the FPW device contacts a half-space of fluid; predictions for flow in small channels encourage the development of integrated micropumps. Applications for microflow include thermal redistribution in integrated circuits and liquid movement in analytical instruments--particularly where a small dead volume is required. Capabilities of this technology and further applications are discussed. Microflow systems that integrate transport of fluids and solids with sensing, mixing and other useful tasks may become a new market-leading application for the sensor and actuator field.

An investigation of vibration-induced protein desorption mechanism using a micromachined membrane and PZT plate.

PubMed

Yeh, Po Ying; Le, Yevgeniya; Kizhakkedathu, Jayachandran N; Chiao, Mu

2008-10-01

A micromachined vibrating membrane is used to remove adsorbed proteins on a surface. A lead zirconate titanate (PZT) composite (3 x 1 x 0.5 mm) is attached to a silicon membrane (2,000 x 500 x 3 microm) and vibrates in a flexural plate wave (FPW) mode with wavelength of 4,000/3 microm at a resonant frequency of 308 kHz. The surface charge on the membrane and fluid shear stress contribute in minimizing the protein adsorption on the SiO(2) surface. In vitro characterization shows that 57 +/- 10% of the adsorbed bovine serum albumin (BSA), 47 +/- 13% of the immunoglobulin G (IgG), and 55.3~59.2 +/- 8% of the proteins from blood plasma are effectively removed from the vibrating surface. A simulation study of the vibration-frequency spectrum and vibrating amplitude distribution matches well with the experimental data. Potentially, a microelectromechanical system (MEMS)-based vibrating membrane could be the tool to minimize biofouling of in vivo MEMS devices.

Union Carbide Corp. polysilicon status and plans

NASA Technical Reports Server (NTRS)

Leipold, M. H.

1982-01-01

The status of polysilicon activities is summarized highlighted by moving the silane portion of the experimental process system development unit (EPSDU) to Washougal, Washington. The completion and operation of the silane EPSDU, is discussed along with research on the silane-to-silicon deposition process. Progress on the dichlorosilane process is also reported.

Method Of Packaging And Assembling Electro-Microfluidic Devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

2004-11-23

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Passive tire pressure sensor and method

DOEpatents

Pfeifer, Kent Bryant; Williams, Robert Leslie; Waldschmidt, Robert Lee; Morgan, Catherine Hook

2006-08-29

A surface acoustic wave device includes a micro-machined pressure transducer for monitoring tire pressure. The device is configured having a micro-machined cavity that is sealed with a flexible conductive membrane. When an external tire pressure equivalent to the cavity pressure is detected, the membrane makes contact with ridges on the backside of the surface acoustic wave device. The ridges are electrically connected to conductive fingers of the device. When the detected pressure is correct, selected fingers on the device will be grounded producing patterned acoustic reflections to an impulse RF signal. When the external tire pressure is less than the cavity reference pressure, a reduced reflected signal to the receiver results. The sensor may further be constructed so as to identify itself by a unique reflected identification pulse series.

Passive tire pressure sensor and method

DOEpatents

Pfeifer, Kent Bryant; Williams, Robert Leslie; Waldschmidt, Robert Lee; Morgan, Catherine Hook

2007-09-04

A surface acoustic wave device includes a micro-machined pressure transducer for monitoring tire pressure. The device is configured having a micro-machined cavity that is sealed with a flexible conductive membrane. When an external tire pressure equivalent to the cavity pressure is detected, the membrane makes contact with ridges on the backside of the surface acoustic wave device. The ridges are electrically connected to conductive fingers of the device. When the detected pressure is correct, selected fingers on the device will be grounded producing patterned acoustic reflections to an impulse RF signal. When the external tire pressure is less than the cavity reference pressure, a reduced reflected signal to the receiver results. The sensor may further be constructed so as to identify itself by a unique reflected identification pulse series.

Electrostatic Microactuators for Precise Positioning of Neural Microelectrodes

PubMed Central

Muthuswamy, Jit; Okandan, Murat; Jain, Tilak; Gilletti, Aaron

2006-01-01

Microelectrode arrays used for monitoring single and multineuronal action potentials often fail to record from the same population of neurons over a period of time likely due to micromotion of neurons away from the microelectrode, gliosis around the recording site and also brain movement due to behavior. We report here novel electrostatic microactuated microelectrodes that will enable precise repositioning of the microelectrodes within the brain tissue. Electrostatic comb-drive microactuators and associated microelectrodes are fabricated using the SUMMiT V™ (Sandia's Ultraplanar Multilevel MEMS Technology) process, a five-layer polysilicon micromachining technology of the Sandia National labs, NM. The microfabricated microactuators enable precise bidirectional positioning of the microelectrodes in the brain with accuracy in the order of 1 μm. The microactuators allow for a linear translation of the microelectrodes of up to 5 mm in either direction making it suitable for positioning microelectrodes in deep structures of a rodent brain. The overall translation was reduced to approximately 2 mm after insulation of the microelectrodes with epoxy for monitoring multiunit activity. The microactuators are capable of driving the microelectrodes in the brain tissue with forces in the order of several micro-Newtons. Single unit recordings were obtained from the somatosensory cortex of adult rats in acute experiments demonstrating the feasibility of this technology. Further optimization of the insulation, packaging and interconnect issues will be necessary before this technology can be validated in long-term experiments. PMID:16235660

Thermal ink-jet device using single-chip silicon microchannels

NASA Astrophysics Data System (ADS)

Wuu, DongSing; Cheng, Chen-Yue; Horng, RayHua; Chan, G. C.; Chiu, Sao-Ling; Wu, Yi-Yung

1998-06-01

We present a new method to fabricate silicon microfluidic channels by through-hole etching with subsequent planarization. The method is based on etching out the deep grooves through a perforated silicon carbide membrane, followed by sealing the membrane with plasma-enhanced chemical vapor deposition (PECVD). Low-pressure-chemical-vapor- deposited (LPCVD) polysilicon was used as a sacrificial layer to define the channel structure and only one etching step is required. This permits the realization of planarization after a very deep etching step in silicon and offers the possibility for film deposition, resist spinning and film patterning across deep grooves. The process technology was demonstrated on the fabrication of a monolithic silicon microchannel structure for thermal inkjet printing. The Ta-Al heater arrays are integrated on the top of each microchannel, which connect to a common on-chip front-end ink reservoir. The fabrication of this device requires six masks and no active nozzle-to-chip alignment. Moreover, the present micromachining process is compatible with the addition of on-chip circuitry for multiplexing the heater control signals. Heat transfer efficiency to the ink is enhanced by the high thermal conductivity of the silicon carbide in the channel ceiling, while the bulk silicon maintains high interchannel isolation. The fabricated inkjet devices show the droplet sizes of 20 - 50 micrometer in diameter with various channel dimensions and stable ejection of ink droplets more than 1 million.

Development of a novel configuration for a MEMS transducer for low bias and high resolution imaging applications

NASA Astrophysics Data System (ADS)

Emadi, Tahereh Arezoo; Buchanan, Douglas A.

2014-03-01

A robust capacitive micromachined ultrasonic transducer has been developed. In this novel configuration, a stack of two deflectable membranes are suspended over a fixed bottom electrode. Similar to conventional capacitive ultrasonic transducers, a generated electrostatic force between the electrodes causes the membranes to deflect and vibrate. However, in this new configuration the transducer effective cavity height is reduced due to the deflection of two membranes. Therefore, the transducer spring constant is more susceptible to bias voltage, which in return reduces the required bias voltage. The transducers have been produced employing a MEMS sacrificial technique where two different membrane anchoring (curved- and flat- anchors) structures, with similar membrane radii were fabricated. Highly doped polysilicon was used as the membrane material. The resonant frequencies of the two transducers have been investigated. It was found that the transducers with curved membrane anchors exhibits a larger resonant frequency shift compared to the transducers with flat membranes for a given bias voltage. Comparison has been made between the spring constant of the flat membrane transducer and that of a conventional single membrane transducer. It is shown that the multiple moving membrane transducer exhibits a larger reduction in the spring constant compared to the conventional transducer, when driven with the same bias voltage. This results in a transducer with a higher power generation capability and sensitivity.

Laser-induced patterns on metals and polymers for biomimetic surface engineering

NASA Astrophysics Data System (ADS)

Kietzig, Anne-Marie; Lehr, Jorge; Matus, Luke; Liang, Fang

2014-03-01

One common feature of many functional surfaces found in nature is their modular composition often exhibiting several length scales. Prominent natural examples for extreme behaviors can be named in various plant leaf (rose, peanut, lotus) or animal toe surfaces (Gecko, tree frog). Influence factors of interest are the surface's chemical composition, its microstructure, its organized or random roughness and hence the resulting surface wetting and adhesion character. Femtosecond (fs) laser micromachining offers a possibility to render all these factors in one single processing step on metallic and polymeric surfaces. Exemplarily, studies on Titanium and PTFE are shown, where the dependence of the resulting feature sizes on lasing intensity is investigated. While Ti surfaces show rigid surface patterns of micrometer scaled features with superimposed nanostructures, PTFE exhibits elastic hairy structures of nanometric diameter, which upon a certain threshold tend to bundle to larger features. Both surface patterns can be adjusted to mimic specific wetting and flow behaviour as seen on natural examples. Therefore, fs-laser micromachining is suggested as an interesting industrially scalable technique to pattern and fine-tune the surface wettability of a surface to the desired extends in one process step. Possible applications can be seen with surfaces, which require specific wetting, fouling, icing, friction or cell adhesion behaviour.

Dynamically tuned vibratory micromechanical gyroscope accelerometer

NASA Astrophysics Data System (ADS)

Lee, Byeungleul; Oh, Yong-Soo; Park, Kyu-Yeon; Ha, Byeoungju; Ko, Younil; Kim, Jeong-gon; Kang, Seokjin; Choi, Sangon; Song, Ci M.

1997-11-01

A comb driving vibratory micro-gyroscope, which utilizes the dynamically tunable resonant modes for a higher rate- sensitivity without an accelerational error, has been developed and analyzed. The surface micromachining technology is used to fabricate the gyroscope having a vibrating part of 400 X 600 micrometers with 6 mask process, and the poly-silicon structural layer is deposited by LPCVD at 625 degrees C. The gyroscope and the interface electronics housed in a hermetically sealed vacuum package for low vibrational damping condition. This gyroscope is designed to be driven in parallel to the substrate by electrostatic forces and subject to coriolis forces along vertically, with a folded beam structure. In this scheme, the resonant frequency of the driving mode is located below than that of the sensing mode, so it is possible to adjust the sensing mode with a negative stiffness effect by applying inter-plate voltage to tune the vibration modes for a higher rate-sensitivity. Unfortunately, this micromechanical vibratory gyroscope is also sensitive to vertical acceleration force, especially in the case of a low stiffness of the vibrating structure for detecting a very small coriolis force. In this study, we distinguished the rate output and the accelerational error by phase sensitivity synchronous demodulator and devised a feedback loop to maintain resonant frequency of the vertical sensing mode by varying the inter-plate tuning voltage according to the accelerational output. Therefore, this gyroscope has a high rate-sensitivity without an acceleration error, and also can be used for a resonant accelerometer. This gyroscope was tested on the rotational rate table at the separation of 50(Hz) resonant frequencies by dynamically tuning feedback loop. Also self-sustained oscillating loop is used to apply dc 2(V) + ac 30(mVpk) driving voltage to the drive electrodes. The characteristics of the gyroscope at 0.1 (deg/sec) resolution, 50 (Hz) bandwidth, and 1.3 (mV/deg/sec) sensitivity.

Investigation of optical information for a single micro grating device combined with MATA by SMart process

NASA Astrophysics Data System (ADS)

Tsai, Chien-Chung; Huang, Yi-Chao; Yang, Tsa-Hsien; Chen, Jen-Chieh

2006-01-01

The concentric circles type and saw-tooth type of micro grating device based upon the diffraction theory are proposed in this study. The geometry dimension of micro optical device is 200 × 200 μm2, the interval of grating is 4 μm, and the depth is 0.75 μm. The Micro Array Thermal Actuator, MATA, is applied to drive the micro grating device, and the pre-elevating structure is designed to lift the micro grating device by the residual stress of polysilicon combined with metal. The micro grating device is fabricated by Surface Micromachining for applications and research technology platform, SMart, common process. The incident ray of He-Ne laser focused by a lens which focal length is 250 mm is applied to be the light source for the experiment, and then analyzes the optical information of the outgoing ray. From the experimental results, the basic optical features are examined based upon the concentric circles type and saw-tooth type of micro grating device, respectively. The outgoing ray angle of central spot is 60° in theory. The measurements are 59.475° for the concentric circles type and 59.88° for the saw-tooth type. The outgoing ray angle of the first stripe is 46.9° in theory, and 46.81° for the concentric circles type and 46.67° for the saw-tooth type are measured from the experiment. The variation of outgoing ray angle is smaller than 1% compared the measurement results with theory of diffraction on the central spot and first stripe characteristics. The work successfully demonstrates the micro grating device with highly accurate performance by the verification of optical information. All of the efforts will be contributed to Controlled Blazed Diffraction micro grating device, CBDMG, and that will be the main device of Integrate Opto-Electronics applied on display to develop in the future.

Mechanical Characterization of Polysilicon MEMS: A Hybrid TMCMC/POD-Kriging Approach.

PubMed

Mirzazadeh, Ramin; Eftekhar Azam, Saeed; Mariani, Stefano

2018-04-17

Microscale uncertainties related to the geometry and morphology of polycrystalline silicon films, constituting the movable structures of micro electro-mechanical systems (MEMS), were investigated through a joint numerical/experimental approach. An on-chip testing device was designed and fabricated to deform a compliant polysilicon beam. In previous studies, we showed that the scattering in the input–output characteristics of the device can be properly described only if statistical features related to the morphology of the columnar polysilicon film and to the etching process adopted to release the movable structure are taken into account. In this work, a high fidelity finite element model of the device was used to feed a transitional Markov chain Monte Carlo (TMCMC) algorithm for the estimation of the unknown parameters governing the aforementioned statistical features. To reduce the computational cost of the stochastic analysis, a synergy of proper orthogonal decomposition (POD) and kriging interpolation was adopted. Results are reported for a batch of nominally identical tested devices, in terms of measurement error-affected probability distributions of the overall Young’s modulus of the polysilicon film and of the overetch depth.

Material removal effect of microchannel processing by femtosecond laser

NASA Astrophysics Data System (ADS)

Zhang, Pan; Chen, Lei; Chen, Jianxiong; Tu, Yiliu

2017-11-01

Material processing using ultra-short-pulse laser is widely used in the field of micromachining, especially for the precision processing of hard and brittle materials. This paper reports a theoretical and experimental study of the ablation characteristics of a silicon wafer under micromachining using a femtosecond laser. The ablation morphology of the silicon wafer surface is surveyed by a detection test with an optical microscope. First, according to the relationship between the diameter of the ablation holes and the incident laser power, the ablation threshold of the silicon wafer is found to be 0.227 J/cm2. Second, the influence of various laser parameters on the size of the ablation microstructure is studied and the ablation morphology is analyzed. Furthermore, a mathematical model is proposed that can calculate the ablation depth per time for a given laser fluence and scanning velocity. Finally, a microchannel milling test is carried out on the micromachining center. The effectiveness and accuracy of the proposed models are verified by comparing the estimated depth to the actual measured results.

Far-field emission characteristics and linewidth measurements of surface micro-machined MEMS tunable VCSELs

NASA Astrophysics Data System (ADS)

Paul, Sujoy; Gierl, Christian; Gründl, Tobias; Zogal, Karolina; Meissner, Peter; Amann, Markus-Christian; Küppers, Franko

2013-03-01

In this paper, we demonstrate for the first time the far-field experimental results and the linewidth characteris- tics for widely tunable surface-micromachined micro-electro-mechanical system (MEMS) vertical-cavity surface- emitting lasers (VCSELs) operating at 1550 nm. The fundamental Gaussian mode emission is confirmed by optimizing the radius of curvature of top distributed Bragg reflector (DBR) membrane and by choosing an ap- propriate diameter of circular buried tunnel junctions (BTJs) so that only the fundamental Gaussian mode can sustain. For these VCSELs, a mode-hop free continuous tuning over 100 nm has already been demonstrated, which is achieved by electro-thermal tuning of the MEMS mirror. The fiber-coupled optical power of 2mW over the entire tuning range has been reported. The singlemode laser emission has more than 40 dB of side-mode suppression ratio (SMSR). The smallest linewidth achieved with these of MEMS tunable VCSELs is 98MHz which is one order of magnitude higher than that of fixed-wavelength VCSELs.

Acceleration sensitivity of micromachined pressure sensors

NASA Astrophysics Data System (ADS)

August, Richard; Maudie, Theresa; Miller, Todd F.; Thompson, Erik

1999-08-01

Pressure sensors serve a variety of automotive applications, some which may experience high levels of acceleration such as tire pressure monitoring. To design pressure sensors for high acceleration environments it is important to understand their sensitivity to acceleration especially if thick encapsulation layers are used to isolate the device from the hostile environment in which they reside. This paper describes a modeling approach to determine their sensitivity to acceleration that is very general and is applicable to different device designs and configurations. It also describes the results of device testing of a capacitive surface micromachined pressure sensor at constant acceleration levels from 500 to 2000 g's.

Step-gate polysilicon nanowires field effect transistor compatible with CMOS technology for label-free DNA biosensor.

PubMed

Wenga, G; Jacques, E; Salaün, A-C; Rogel, R; Pichon, L; Geneste, F

2013-02-15

Currently, detection of DNA hybridization using fluorescence-based detection technique requires expensive optical systems and complex bioinformatics tools. Hence, the development of new low cost devices that enable direct and highly sensitive detection stimulates a lot of research efforts. Particularly, devices based on silicon nanowires are emerging as ultrasensitive electrical sensors for the direct detection of biological species thanks to their high surface to volume ratio. In this study, we propose innovative devices using step-gate polycrystalline silicon nanowire FET (poly-Si NW FETs), achieved with simple and low cost fabrication process, and used as ultrasensitive electronic sensor for DNA hybridization. The poly-SiNWs are synthesized using the sidewall spacer formation technique. The detailed fabrication procedure for a step-gate NWFET sensor is described in this paper. No-complementary and complementary DNA sequences were clearly discriminated and detection limit to 1 fM range is observed. This first result using this nano-device is promising for the development of low cost and ultrasensitive polysilicon nanowires based DNA sensors compatible with the CMOS technology. Copyright © 2012 Elsevier B.V. All rights reserved.

Formaldehyde gas sensor based on TiO2 thin membrane integrated with nano silicon structure

NASA Astrophysics Data System (ADS)

Zheng, Xuan; Ming, An-jie; Ye, Li; Chen, Feng-hua; Sun, Xi-long; Liu, Wei-bing; Li, Chao-bo; Ou, Wen; Wang, Wei-bing; Chen, Da-peng

2016-07-01

An innovative formaldehyde gas sensor based on thin membrane type metal oxide of TiO2 layer was designed and fabricated. This sensor under ultraviolet (UV) light emitting diode (LED) illumination exhibits a higher response to formaldehyde than that without UV illumination at low temperature. The sensitivities of the sensor under steady working condition were calculated for different gas concentrations. The sensitivity to formaldehyde of 7.14 mg/m3 is about 15.91 under UV illumination with response time of 580 s and recovery time of 500 s. The device was fabricated through micro-electro-mechanical system (MEMS) processing technology. First, plasma immersion ion implantation (PIII) was adopted to form black polysilicon, then a nanoscale TiO2 membrane with thickness of 53 nm was deposited by DC reactive magnetron sputtering to obtain the sensing layer. By such fabrication approaches, the nanoscale polysilicon presents continuous rough surface with thickness of 50 nm, which could improve the porosity of the sensing membrane. The fabrication process can be mass-produced for the MEMS process compatibility.

Large area polysilicon films with predetermined stress characteristics and method for producing same

NASA Technical Reports Server (NTRS)

Heuer, Arthur H. (Inventor); Kahn, Harold (Inventor); Yang, Jie (Inventor); Phillips, Stephen M. (Inventor)

2002-01-01

Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin films may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films. Multi-layer assemblies exhibiting selectively determinable overall bending moments are also disclosed. Selective production of overall bending moments in microstructures enables manufacture of such structures with a wide array of geometrical configurations.

Dual-beam focused ion beam/electron microscopy processing and metrology of redeposition during ion-surface 3D interactions, from micromachining to self-organized picostructures.

PubMed

Moberlychan, Warren J

2009-06-03

Focused ion beam (FIB) tools have become a mainstay for processing and metrology of small structures. In order to expand the understanding of an ion impinging a surface (Sigmund sputtering theory) to our processing of small structures, the significance of 3D boundary conditions must be realized. We consider ion erosion for patterning/lithography, and optimize yields using the angle of incidence and chemical enhancement, but we find that the critical 3D parameters are aspect ratio and redeposition. We consider focused ion beam sputtering for micromachining small holes through membranes, but we find that the critical 3D considerations are implantation and redeposition. We consider ion beam self-assembly of nanostructures, but we find that control of the redeposition by ion and/or electron beams enables the growth of nanostructures and picostructures.

Surface micromachined counter-meshing gears discrimination device

DOEpatents

Polosky, Marc A.; Garcia, Ernest J.; Allen, James J.

2000-12-12

A surface micromachined Counter-Meshing Gears (CMG) discrimination device which functions as a mechanically coded lock. Each of two CMG has a first portion of its perimeter devoted to continuous driving teeth that mesh with respective pinion gears. Each EMG also has a second portion of its perimeter devoted to regularly spaced discrimination gear teeth that extend outwardly on at least one of three levels of the CMG. The discrimination gear teeth are designed so as to pass each other without interference only if the correct sequence of partial rotations of the CMG occurs in response to a coded series of rotations from the pinion gears. A 24 bit code is normally input to unlock the device. Once unlocked, the device provides a path for an energy or information signal to pass through the device. The device is designed to immediately lock up if any portion of the 24 bit code is incorrect.

Fabrication of micromachined focusing mirrors with seamless reflective surface

NASA Astrophysics Data System (ADS)

Hou, Max Ti-Kuang; Liao, Ke-Min; Yeh, Hong-Zhen; Cheng, Bo-Wen; Hong, Pei-Yuan; Chen, Rongshun

2003-01-01

A surface-micromachined focusing mirror with variable focal length, which is controlled by adjusting the mirror"s curvature, is fabricated and characterized. The bowl-shaped micromirror, which is fabricated from the micro bilayer circular plate, focuses light beam through thermal actuation of the external heat source. Both the initial and operational curvatures are manipulated by the residual stresses in two layers of the mirror. Improper stresses would lead to the failure of the bowl-shaped structure. We analyze and design geometrical dimensions for simultaneously avoiding the structure failure and increasing the tuning range of the focal length. The interferometer has been used to measure the focal length and the focusing ability. Mirrors with nominal focal lengths approximately 730 μm, and tuning ranges of about 50 microns were demonstrated. The measurement directly through optical approach has also been tried, but requires further investigation, because the laser beam affects the focusing of the micromirror seriously.

Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes

PubMed Central

Schiavone, Giuseppe; Murray, Jeremy; Perry, Richard; Mount, Andrew R.; Desmulliez, Marc P. Y.; Walton, Anthony J.

2017-01-01

This article presents a set of low-temperature deposition and etching processes for the integration of electrochemically deposited Ni-Fe alloys in complex magnetic microelectromechanical systems, as Ni-Fe is known to suffer from detrimental stress development when subjected to excessive thermal loads. A selective etch process is reported which enables the copper seed layer used for electrodeposition to be removed while preserving the integrity of Ni-Fe. In addition, a low temperature deposition and surface micromachining process is presented in which silicon dioxide and silicon nitride are used, respectively, as sacrificial material and structural dielectric. The sacrificial layer can be patterned and removed by wet buffered oxide etch or vapour HF etching. The reported methods limit the thermal budget and minimise the stress development in Ni-Fe. This combination of techniques represents an advance towards the reliable integration of Ni-Fe components in complex surface micromachined magnetic MEMS. PMID:28772683

Laser-assisted electrochemical micromachining of mould cavity on the stainless steel surface

NASA Astrophysics Data System (ADS)

Li, Xiaohai; Wang, Shuming; Wang, Dong; Tong, Han

2018-02-01

In order to fabricate the micro mould cavities with complex structures on 304 stainless steel, laser-assisted electrochemical micromachining (EMM) based on surface modification by fiber laser masking was studied,and a new device of laser-assisted EMM was developed. Laser marking on the surface of 304 stainless steel can first be realized by fiber laser heating scanning. Through analysis of X ray diffraction analysis (XRD), metal oxide layer with predefined pattern can be formed by laser marking, and phase transformation can also occur on the 304 stainless steel surface, which produce the laser masking layer with corrosion resistance. The stainless steel surface with laser masking layer is subsequently etched by EMM, the laser masking layer severs as the temporary protective layer without relying on lithography mask, the fabrication of formed electrodes is also avoided, so micro pattern cavities can fast be fabricated. The impacts on machining accuracy during EMM with laser masking were discussed to optimize machining parameters, such as machining voltage, electrolyte concentration, duty cycle of pulse power supply and electrode gap size, the typical mould cavities 23μm deep were fabricated under the optimized parameters.

Integration of Detectors with Optical Waveguide Structures.

DTIC Science & Technology

1983-05-15

OECLASSIFICATION/DOWNGRADING SCHEDULE ____ ___ ___ ___ __ ___ ____ ___ ___ ___ ___ ___ ___ None If. DISTRIBUTION STATEMNT (of Ole RepOr) Approved for public...The polysilicon gate of the depletion mode MOSFET is boron doped and it is covered by a thermally grown silicon dioxide layer on the top. of the... polysilicon electrode. The wafer then undergoes hydrogen annealing with 24 1/min. hydrogen at 10000C for 30 minutes. The boron impurities which are already

Electronic Subsystem Analysis (ESA)

DTIC Science & Technology

1977-01-01

than aluminum for the gate material, 0 Ion implanted source and draia regions, 0 Dielectrically isolated transistors. The use of a doped polysilicon gate...second level of interconnect ( polysilicon ). Ion implantation is essentially a precisely controllable pre-deposition of the required dopants. It’s use...discussed below). Radiation effects on MOS devices include the following: 0 Total Dose ol Dose Rate o Neutrons Because MOS technology is based on

Control of polysilicon on-film particulates with on-product measurements

NASA Astrophysics Data System (ADS)

Barker, Judith B.; Chain, Elizabeth E.; Plachecki, Vincent E.

1997-08-01

Historically, a number of in-line particle measurements have been performed on separate test wafers included with product wafers during polysilicon processes. By performing film thickness and particulate measurements directly on product wafers, instead, a number of benefits accrue: (1) reduced test wafer usage, (2) reduced test wafer storage requirements, (3) reduced need for equipment to reclaim test wafers, (4) reduced need for direct labor to reclaim test wafers, and (5) reduced engineering 'false alarms' due to incorrectly processed test wafers. Implementation of on-product measurements for the polysilicon diffusion process required a number of changes in both philosophy and methodology. We show the necessary steps to implementation of on-product particle measurements with concern for overall manufacturing efficiency and the need to maintain appropriate control. Particle results from the Tencor 7600 Surfscan are presented.

Formation of a Polycrystalline Silicon Thin Film by Using Blue Laser Diode Annealing

NASA Astrophysics Data System (ADS)

Choi, Young-Hwan; Ryu, Han-Youl

2018-04-01

We report the crystallization of an amorphous silicon thin film deposited on a SiO2/Si wafer using an annealing process with a high-power blue laser diode (LD). The laser annealing process was performed using a continuous-wave blue LD of 450 nm in wavelength with varying laser output power in a nitrogen atmosphere. The crystallinity of the annealed poly-silicon films was investigated using ellipsometry, electron microscope observation, X-ray diffraction, and Raman spectroscopy. Polysilicon grains with > 100-nm diameter were observed to be formed after the blue LD annealing. The crystal quality was found to be improved as the laser power was increased up to 4 W. The demonstrated blue LD annealing is expected to provide a low-cost and versatile solution for lowtemperature poly-silicon processes.

Physics-based signal processing algorithms for micromachined cantilever arrays

DOEpatents

Candy, James V; Clague, David S; Lee, Christopher L; Rudd, Robert E; Burnham, Alan K; Tringe, Joseph W

2013-11-19

A method of using physics-based signal processing algorithms for micromachined cantilever arrays. The methods utilize deflection of a micromachined cantilever that represents the chemical, biological, or physical element being detected. One embodiment of the method comprises the steps of modeling the deflection of the micromachined cantilever producing a deflection model, sensing the deflection of the micromachined cantilever and producing a signal representing the deflection, and comparing the signal representing the deflection with the deflection model.

Microelectromechanical reciprocating-tooth indexing apparatus

DOEpatents

Allen, James J.

1999-01-01

An indexing apparatus is disclosed that can be used to rotate a gear or move a rack in a precise, controllable manner. The indexing apparatus, based on a reciprocating shuttle driven by one or more actuators, can be formed either as a micromachine, or as a millimachine. The reciprocating shuttle of the indexing apparatus can be driven by a thermal, electrostatic or electromagnetic actuator, with one or more wedge-shaped drive teeth of the shuttle being moveable to engage and slide against indexing teeth on the gear or rack, thereby moving the gear or rack. The indexing apparatus can be formed by either surface micromachining processes or LIGA processes, depending on the size of the apparatus that is to be formed.

Silicon microfabricated beam expander

NASA Astrophysics Data System (ADS)

Othman, A.; Ibrahim, M. N.; Hamzah, I. H.; Sulaiman, A. A.; Ain, M. F.

2015-03-01

The feasibility design and development methods of silicon microfabricated beam expander are described. Silicon bulk micromachining fabrication technology is used in producing features of the structure. A high-precision complex 3-D shape of the expander can be formed by exploiting the predictable anisotropic wet etching characteristics of single-crystal silicon in aqueous Potassium-Hydroxide (KOH) solution. The beam-expander consist of two elements, a micromachined silicon reflector chamber and micro-Fresnel zone plate. The micro-Fresnel element is patterned using lithographic methods. The reflector chamber element has a depth of 40 µm, a diameter of 15 mm and gold-coated surfaces. The impact on the depth, diameter of the chamber and absorption for improved performance are discussed.

Mechanisms for fatigue and wear of polysilicon structural thinfilms

DOE Office of Scientific and Technical Information (OSTI.GOV)

Alsem, Daniel Henricus

2006-01-01

Fatigue and wear in micron-scale polysilicon structural films can severely impact the reliability of microelectromechanical systems (MEMS). Despite studies on fatigue and wear behavior of these films, there is still an on-going debate regarding the precise physical mechanisms for these two important failure modes. Although macro-scale silicon does not fatigue, this phenomenon is observed in micron-scale silicon. It is shown that for polysilicon devices fabricated in the MUMPs foundry and SUMMiT process stress-lifetime data exhibits similar trends in ambient air, shorter lifetimes in higher relative humidity environments and no fatigue failure at all in high vacuum. Transmission electron microscopy ofmore » the surface oxides of the samples show an approximate four-fold thickening of the oxide at stress concentrations after fatigue failure, but no thickening after fracture in air or after fatigue cycling in vacuo. It is found that such oxide thickening and fatigue failure (in air) occurs in devices with initial oxide thicknesses of ~4-20 nm. Such results are interpreted and explained by a reaction layer fatigue mechanism; specifically, moisture-assisted subcritical cracking within a cyclic stress-assisted thickened oxide layer occurs until the crack reaches a critical size to cause catastrophic failure. Polysilicon specimens from the SUMMiT process are used to study wear mechanisms in micron-scale silicon in ambient air. Worn parts are examined by analytical scanning and transmission electron microscopy, while temperature changes are monitored using infrared microscopy. These results are compared with the development of values of static coefficients of friction (COF) with number of wear cycles. Observations show amorphous debris particles (~50-100 nm) created by fracture through the silicon grains (~500 nm), which subsequently oxidize, agglomerate into clusters and create plowing tracks. A nano-crystalline layer (~20-200 nm) forms at worn regions. No dislocations or extreme temperature increases are found, ruling out plasticity and temperature-assisted mechanisms. The COF reaches a steady-state value of ~0.20±0.05 after a short time at an initial value of ~0.11±0.01. Plowing tracks are found before the steady-state value of the COF is reached, suggesting only a short adhesive wear regime. This suggests a predominantly abrasive wear mechanism, controlled by fracture, which commences by the first particles created by adhesive wear.« less

Mechanisms for fatigue and wear of polysilicon structural thin films

NASA Astrophysics Data System (ADS)

Alsem, Daniel Henricus

Fatigue and wear in micron-scale polysilicon structural films can severely impact the reliability of microelectromechanical systems (MEMS). Despite studies on fatigue and wear behavior of these films, there is still an on-going debate regarding the precise physical mechanisms for these two important failure modes. Although macro-scale silicon does not fatigue, this phenomenon is observed in micron-scale silicon. It is shown that for polysilicon devices fabricated in the MUMPs foundry and SUMMiT(TM) process stress-lifetime data exhibits similar trends in ambient air, shorter lifetimes in higher relative humidity environments and no fatigue failure at all in high vacuum. Transmission electron microscopy of the surface oxides of the samples show an approximate four-fold thickening of the oxide at stress concentrations after fatigue failure, but no thickening after fracture in air or after fatigue cycling in vacuo . It is found that such oxide thickening and fatigue failure (in air) occurs in devices with initial oxide thicknesses of ˜4-20 nm. Such results are interpreted and explained by a reaction-layer fatigue mechanism; specifically, moisture-assisted subcritical cracking within a cyclic stress-assisted thickened oxide layer occurs until the crack reaches a critical size to cause catastrophic failure. Polysilicon specimens from the SUMMiT(TM) process are used to study wear mechanisms in micron-scale silicon in ambient air. Worn parts are examined by analytical scanning and transmission electron microscopy, while temperature changes are monitored using infrared microscopy. These results are compared with the development of values of static coefficients of friction (COF) with number of wear cycles. Observations show amorphous debris particles (˜50-100 nm) created by fracture through the silicon grains (˜500 nm), which subsequently oxidize, agglomerate into clusters and create plowing tracks. A nano-crystalline layer (˜20-200 nm) forms at worn regions. No dislocations or extreme temperature increases are found, ruling out plasticity and temperature-assisted mechanisms. The COF reaches a steady-state value of ˜0.20+/-0.05 after a short time at an initial value of ˜0.11+/-0.01. Plowing tracks are found before the steady-state value of the COF is reached, suggesting only a short adhesive wear regime. This suggests a predominantly abrasive wear mechanism, controlled by fracture, which commences by the first particles created by adhesive wear.

Photoacoustic Imaging.

DTIC Science & Technology

1983-12-01

recrystallization is currently an active area of research. Much effort has been made to grow large grain polysilicon with grain sizes of 100 microns from fine grain... polysilicon using laser recrystallization. The recrystallization process is inherently traumatic, producing large changes in temperature in short...temperature distribution above as the source term in the acoustic field equation, we ol fain r where B1)jwP) The general solution to this equation is given by

Dynamic MEMS devices for multi-axial fatigue and elastic modulus measurement

NASA Astrophysics Data System (ADS)

White, Carolyn D.; Xu, Rui; Sun, Xiaotian; Komvopoulos, Kyriakos

2003-01-01

For reliable MEMS device fabrication and operation, there is a continued demand for precise characterization of materials at the micron scale. This paper presents a novel material characterization device for fatigue lifetime testing. The fatigue specimen is subjected to multi-axial loading, which is typical of most MEMS devices. Polycrystalline silicon (polysilicon) fatigue devices were fabricated using the MUMPS process with a three layer mask process ground plane, anchor, and structural layer of polysilicon. A fatigue device consists of two or three beams, attached to a rotating ring and anchored to the substrate on each end. In order to generate a sufficiently large stress, the fatigue devices were tested in resonance to produce a von Mises equivalent stress as high as 1 GPa, which is in the fracture strength range reported for polysilicon. A further increase of the stress in the beam specimens was obtained by introducing a notch with a focused ion beam. The notch resulted into a stress concentration factor of about 3.8, thereby producing maximum von Mises equivalent stress in the range of 1 through 4 GPa. This study provides insight into multi-axial fatigue testing under typical MEMS conditions and additional information about micron-scale polysilicon mechanical behavior, which is the current basic building material for MEMS devices.

Review on the importance of measurement technique in micromachine technology

NASA Astrophysics Data System (ADS)

Umeda, Akira

1996-09-01

In the beginning stage of MITI micromachine project, the committee on the standardization established in Micromachine Center recognized the importance of measurement technique for the promotion and the systemization of the micromachine technology. Micromachine Center is the organizing body for private sectors working in the MITI micromachine project which started in 1991. MITI stands for Ministry of International Trade and Industry in Japan. In order to known the requirements on the measurement technologies, the questionnaire was organized by the measurement working group in the committee. This talk covers the questionnaire and its results, and some research results obtained at National Research Laboratory of Metrology working as a member in the project.

Improved Design of Optical MEMS Using the SUMMiT Fabrication Process

DOE Office of Scientific and Technical Information (OSTI.GOV)

Michalicek, M.A.; Comtois, J.H.; Barron, C.C.

This paper describes the design and fabrication of optical Microelectromechanical Systems (MEMS) devices using the Sandia Ultra planar Multilevel MEMS Technology (SUMMiT) fabrication process. This state of the art process, offered by Sandia National Laboratories, provides unique and very advantageous features which make it ideal for optical devices. This enabling process permits the development of micromirror devices with near ideal characteristics which have previously been unrealizable in standard polysilicon processes. This paper describes such characteristics as elevated address electrodes, individual address wiring beneath the device, planarized mirror surfaces, unique post-process metallization, and the best active surface area to date.

Repulsive force actuated rotary micromirror

NASA Astrophysics Data System (ADS)

He, Siyuan; Ben Mrad, Ridha

2004-09-01

In this paper, a novel repulsive force based rotary micromirror is proposed. A repulsive force is produced in the rotary micromirror and the mirror plate is pushed up and away from the substrate. Therefore the rotation angle of the micromirror is not limited to the space underneath the mirror plate and thus the "pull-in" effect is completely circumvented. The novel rotary micromirror can achieve a large rotation angle with a large mirror plate. In addition the novel micromirror has a very simple structure and can be fabricated by standard surface micromachining technology. Numerical simulation is used to verify the working principle of the novel micromirror. A prototype of the novel rotary micromirror is fabricated by a commercially available surface microfabrication process called MUMPs. The prototype has a mirror size of 300μm x 300μm. The experimental measurements show that the prototype can achieve a mechanical rotation of 2.25 degrees (an optical angle of 4.5 degrees) at a driving voltage of 170 volts. A conventional surface micromachined attractive force based rotary micromirror of the same size can only achieve an angle of 0.1~0.2 degree.

A cochlear implant fabricated using a bulk silicon-surface micromachining process

NASA Astrophysics Data System (ADS)

Bell, Tracy Elizabeth

1999-11-01

This dissertation presents the design and fabrication of two generations of a silicon microelectrode array for use in a cochlear implant. A cochlear implant is a device that is inserted into the inner ear and uses electrical stimulation to provide sound sensations to the profoundly deaf. The first-generation silicon cochlear implant is a passive device fabricated using silicon microprobe technology developed at the University of Michigan. It contains twenty-two iridium oxide (IrO) stimulating sites that are 250 mum in diameter and spaced at 750 mum intervals. In-vivo recordings were made in guinea pig auditory cortex in response to electrical stimulation with this device, verifying its ability to electrically evoke an auditory response. Auditory thresholds as low as 78 muA were recorded. The second-generation implant is a thirty-two site, four-channel device with on-chip CMOS site-selection circuitry and integrated position sensing. It was fabricated using a novel bulk silicon surface micromachining process which was developed as a part of this dissertation work. While the use of semiconductor technology offers many advantages in fabricating cochlear implants over the methods currently used, it was felt that even further advantages could be gained by developing a new micromachining process which would allow circuitry to be distributed along the full length of the cochlear implant substrate. The new process uses electropolishing of an n+ bulk silicon sacrificial layer to undercut and release n- epitaxial silicon structures from the wafer. An extremely abrupt etch-stop between the n+ and n- silicon is obtained, with no electropolishing taking place in the n-type silicon that is doped lower than 1 x 1017 cm-3 in concentration. Lateral electropolishing rates of up to 50 mum/min were measured using this technique, allowing one millimeter-wide structures to be fully undercut in as little as 10 minutes. The new micromachining process was integrated with a standard p-well CMOS integrated circuit process to fabricate the second-generation active silicon cochlear implants.

Princeton VLSI Project.

DTIC Science & Technology

1983-01-01

polysilicon wires in gateleft and laterighi, which will be connected together if both exist. The dimensions of the transistor are determined by the maximum...be implanted. Any wire parameters having layers other than polysilicon or diffusion will be electrically connected to one another over the transistor...Jan 19 ś a’:’> ., , fcr example PLA s and precharged 2-1, (do- : CV O. lHop The implementtional d( :a., of the mod;,ied gates and circuitrv for OL 5

Numerical Simulation of Polysilicon Solid-liquid Interface Transmogrification in Heat Transfer Process

NASA Astrophysics Data System (ADS)

Yang, Xi; Ma, Wenhui; Lv, Guoqiang; Zhang, Mingyu

2018-01-01

The shape of solid-liquid interface during the directional solidification process, which is difficult to be observed and measured in actual processes, controls the grain orientation and grain size of polysilicon ingot. We carried out numerical calculations of the directional solidification progress of polycrystalline silicon and invested the means to deal with the latent heat of solidification in numerical simulation. The distributions of the temperature field of the melt for the crystallization progress as well as the transformation of the solid-liquid interface were obtained. The simulation results are consistent with the experimental outcomes. The results show that the curvature of solid-liquid interface is small and stability, larger grain sized columnar crystal can be grown in the laboratory-scale furnace at a solidification rate of 10 μm•s-1. It shall provide important theoretical basis for metallurgical process and polysilicon production technology.

Development of AC-coupled, poly-silicon biased, p-on-n silicon strip detectors in India for HEP experiments

NASA Astrophysics Data System (ADS)

Jain, Geetika; Dalal, Ranjeet; Bhardwaj, Ashutosh; Ranjan, Kirti; Dierlamm, Alexander; Hartmann, Frank; Eber, Robert; Demarteau, Marcel

2018-02-01

P-on-n silicon strip sensors having multiple guard-ring structures have been developed for High Energy Physics applications. The study constitutes the optimization of the sensor design, and fabrication of AC-coupled, poly-silicon biased sensors of strip width of 30 μm and strip pitch of 55 μm. The silicon wafers used for the fabrication are of 4 inch n-type, having an average resistivity of 2-5 k Ω cm, with a thickness of 300 μm. The electrical characterization of these detectors comprises of: (a) global measurements of total leakage current, and backplane capacitance; (b) strip and voltage scans of strip leakage current, poly-silicon resistance, interstrip capacitance, interstrip resistance, coupling capacitance, and dielectric current; and (c) charge collection measurements using ALiBaVa setup. The results of the same are reported here.

Research on the Electro-explosive Behaviors and the Ignition Performances of Energetic Igniters

NASA Astrophysics Data System (ADS)

Li, Yong; Jia, Xin; Wang, Liu; Zhou, Bin; Shen, Ruiqi

2018-01-01

This article describes the electro-explosive behaviors and the ignition performances of energetic igniters based on the combination of polysilicon film with Al/CuO nanoenergetic multilayer films (nEMFs).The ultra-high-speed framing camera images show that melting first occurs at the V-type angles and then expands to the entire bridge. The Al/CuO nEMF is heated and fired from below, forced to form lots of flyers with different sizes, ejected with the expansion of polysilicon plasma, and reacts exothermically to release a large quantity of energy. Furthermore, temperature diagnosis results demonstrate higher temperature products of energetic igniters. Ignition experiment at a standoff of 1.5 mm results show that the average firing voltage and the variance of energetic igniters are 28.50 V and 0.96, whereas those of polysilicon igniters are 32.05 V and 1.94.

Fiber laser micromachining of magnesium alloy tubes for biocompatible and biodegradable cardiovascular stents

NASA Astrophysics Data System (ADS)

Demir, Ali Gökhan; Previtali, Barbara; Colombo, Daniele; Ge, Qiang; Vedani, Maurizio; Petrini, Lorenza; Wu, Wei; Biffi, Carlo Alberto

2012-02-01

Magnesium alloys constitute an attractive solution for cardiovascular stent applications due to their intrinsic properties of biocompatibility and relatively low corrosion resistance in human-body fluids, which results in as a less intrusive treatment. Laser micromachining is the conventional process used to cut the stent mesh, which plays the key role for the accurate reproduction of the mesh design and the surface quality of the produced stent that are important factors in ensuring the mechanical and corrosion resistance properties of such a kind of devices. Traditionally continuous or pulsed laser systems working in microsecond pulse regime are employed for stent manufacturing. Pulsed fiber lasers on the other hand, are a relatively new solution which could balance productivity and quality aspects with shorter ns pulse durations and pulse energies in the order of mJ. This work reports the study of laser micromachining and of AZ31 magnesium alloy for the manufacturing of cardiovascular stents with a novel mesh design. A pulsed active fiber laser system operating in nanosecond pulse regime was employed for the micromachining. Laser parameters were studied for tubular cutting on a common stent material, AISI 316L tubes with 2 mm in diameter and 0.2 mm in thickness and on AZ31 tubes with 2.5 mm in diameter and 0.2 in thickness. In both cases process parameters conditions were examined for reactive and inert gas cutting solutions and the final stent quality is compared.

System Dynamics of Polysilicon for Solar Photovoltaics: A Framework for Investigating the Energy Security of Renewable Energy Supply Chains

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sandor, Debra; Fulton, Sadie; Engel-Cox, Jill

Renewable energy, produced with widely available low-cost energy resources, is often included as a component of national strategies to address energy security and sustainability. Market and political forces cannot disrupt the sun or wind, unlike oil and gas supplies. However, the cost of renewable energy is highly dependent on technologies manufactured through global supply chains in leading manufacturing countries. The countries that contribute to the global supply chains may take actions that, directly or indirectly, influence global access to materials and components. For example, high-purity polysilicon, a key material in solar photovoltaics, has experienced significant price fluctuations, affecting the manufacturingmore » capacity and cost of both polysilicon and solar panels. This study has developed and validated an initial system dynamics framework to gain insights into global trade in polysilicon. The model represents an initial framework for exploration. Three regions were modeled-China, the United States, and the rest of the world - for a range of trade scenarios to understand the impacts of import duties and non-price drivers on the relative volumes of imports and domestic supply. The model was validated with the historical case of China imposing an import duty on polysilicon from the United States, the European Union, and South Korea, which altered the regional flows of polysilicon - in terms of imports, exports, and domestic production-to varying degrees. As expected, the model tracked how regional demand shares and influx volumes decrease as a duty on a region increases. Using 2016 as a reference point, in the scenarios examined for U.S. exports to China, each 10% increase in the import duty results in a 40% decrease in import volume. The model also indicates that, under the scenarios investigated, once a duty has been imposed on a region, the demand share from that region declines and does not achieve pre-duty levels, even as global demand increases. Adding additional countries and other components in the photovoltaic supply chain (panels, cells, wafers) to this model could enable policymakers to better understand the relative impact of trade measures across the entire photovoltaic module manufacturing supply chain and the conditions that encourage industry evolution and competitiveness.« less

System Dynamics of Polysilicon for Solar Photovoltaics: A Framework for Investigating the Energy Security of Renewable Energy Supply Chains

DOE PAGES

Sandor, Debra; Fulton, Sadie; Engel-Cox, Jill; ...

2018-01-11

Renewable energy, produced with widely available low-cost energy resources, is often included as a component of national strategies to address energy security and sustainability. Market and political forces cannot disrupt the sun or wind, unlike oil and gas supplies. However, the cost of renewable energy is highly dependent on technologies manufactured through global supply chains in leading manufacturing countries. The countries that contribute to the global supply chains may take actions that, directly or indirectly, influence global access to materials and components. For example, high-purity polysilicon, a key material in solar photovoltaics, has experienced significant price fluctuations, affecting the manufacturingmore » capacity and cost of both polysilicon and solar panels. This study has developed and validated an initial system dynamics framework to gain insights into global trade in polysilicon. The model represents an initial framework for exploration. Three regions were modeled-China, the United States, and the rest of the world - for a range of trade scenarios to understand the impacts of import duties and non-price drivers on the relative volumes of imports and domestic supply. The model was validated with the historical case of China imposing an import duty on polysilicon from the United States, the European Union, and South Korea, which altered the regional flows of polysilicon - in terms of imports, exports, and domestic production-to varying degrees. As expected, the model tracked how regional demand shares and influx volumes decrease as a duty on a region increases. Using 2016 as a reference point, in the scenarios examined for U.S. exports to China, each 10% increase in the import duty results in a 40% decrease in import volume. The model also indicates that, under the scenarios investigated, once a duty has been imposed on a region, the demand share from that region declines and does not achieve pre-duty levels, even as global demand increases. Adding additional countries and other components in the photovoltaic supply chain (panels, cells, wafers) to this model could enable policymakers to better understand the relative impact of trade measures across the entire photovoltaic module manufacturing supply chain and the conditions that encourage industry evolution and competitiveness.« less

Non-contact thermoacoustic detection of embedded targets using airborne-capacitive micromachined ultrasonic transducers

NASA Astrophysics Data System (ADS)

Nan, Hao; Boyle, Kevin C.; Apte, Nikhil; Aliroteh, Miaad S.; Bhuyan, Anshuman; Nikoozadeh, Amin; Khuri-Yakub, Butrus T.; Arbabian, Amin

2015-02-01

A radio frequency (RF)/ultrasound hybrid imaging system using airborne capacitive micromachined ultrasonic transducers (CMUTs) is proposed for the remote detection of embedded objects in highly dispersive media (e.g., water, soil, and tissue). RF excitation provides permittivity contrast, and ultra-sensitive airborne-ultrasound detection measures thermoacoustic-generated acoustic waves that initiate at the boundaries of the embedded target, go through the medium-air interface, and finally reach the transducer. Vented wideband CMUTs interface to 0.18 μm CMOS low-noise amplifiers to provide displacement detection sensitivity of 1.3 pm at the transducer surface. The carefully designed vented CMUT structure provides a fractional bandwidth of 3.5% utilizing the squeeze-film damping of the air in the cavity.

Micromachined single-level nonplanar polycrystalline SiGe thermal microemitters for infrared dynamic scene projection

NASA Astrophysics Data System (ADS)

Malyutenko, V. K.; Malyutenko, O. Yu.; Leonov, V.; Van Hoof, C.

2009-05-01

The technology for self-supported membraneless polycrystalline SiGe thermal microemitters, their design, and performance are presented. The 128-element arrays with a fill factor of 88% and a 2.5-μm-thick resonant cavity have been grown by low-pressure chemical vapor deposition and fabricated using surface micromachining technology. The 200-nm-thick 60×60 μm2 emitting pixels enforced with a U-shape profile pattern demonstrate a thermal time constant of 2-7 ms and an apparent temperature of 700 K in the 3-5 and 8-12 μm atmospheric transparency windows. The application of the devices to the infrared dynamic scene simulation and their benefit over conventional planar membrane-supported emitters are discussed.

Micromachined electrode array

DOEpatents

Okandan, Murat; Wessendorf, Kurt O.

2007-12-11

An electrode array is disclosed which has applications for neural stimulation and sensing. The electrode array, in certain embodiments, can include a plurality of electrodes each of which is flexibly attached to a common substrate using a plurality of springs to allow the electrodes to move independently. In other embodiments of the electrode array, the electrodes can be fixed to the substrate. The electrode array can be formed from a combination of bulk and surface micromachining, and can include electrode tips having an electroplated metal (e.g. platinum, iridium, gold or titanium) or a metal oxide (e.g. iridium oxide) for biocompatibility. The electrode array can be used to form a part of a neural prosthesis, and is particularly well adapted for use in an implantable retinal prosthesis.

The application of micromachined sensors to manned space systems

NASA Technical Reports Server (NTRS)

Bordano, Aldo; Havey, Gary; Wald, Jerry; Nasr, Hatem

1993-01-01

Micromachined sensors promise significant system advantages to manned space vehicles. Vehicle Health Monitoring (VHM) is a critical need for most future space systems. Micromachined sensors play a significant role in advancing the application of VHM in future space vehicles. This paper addresses the requirements that future VHM systems place on micromachined sensors such as: system integration, performance, size, weight, power, redundancy, reliability and fault tolerance. Current uses of micromachined sensors in commercial, military and space systems are used to document advantages that are gained and lessons learned. Based on these successes, the future use of micromachined sensors in space programs is discussed in terms of future directions and issues that need to be addressed such as how commercial and military sensors can meet future space system requirements.

Field dependence of interface-trap buildup in polysilicon and metal gate MOS devices

NASA Astrophysics Data System (ADS)

Shaneyfelt, M. R.; Schwank, J. R.; Fleetwood, D. M.; Winokur, P. S.; Hughes, K. L.

1990-12-01

The electric field dependence of radiation-induced oxide- and interface-trap charge (Delta Vot and Delta Vit) generation for polysilicon- and metal-gate MOS transistors is investigated at electric fields (Eox) from -4.2 MV/cm to +4.7 MV/cm. If electron-hole recombination effects are taken into account, the absolute value of Delta Vot and the saturated value of Delta Vit for both polysilicon- and metal-gate transistors are shown to follow an approximate E exp -1/2 field dependence for Eox = 0.4 MV/cm or greater. An E exp -1/2 dependence for the saturated value of Delta Vit was also observed for negative-bias irradiation followed by a constant positive-bias anneal. The E exp -1/2 field dependence observed suggests that the total number of interface traps created in these devices may be determined by hole trapping near the Si/SiO2 interface for positive-bias irradiation or near the gate/SiO2 interface for negative bias irradiation, though H+ drift remains the likely rate-limiting step in the process. Based on these results, a hole-trapping/hydrogen transport model-involving hole trapping and subsequent near-interfacial H+ release, transport, and reaction at the interface-is proposed as a possible explanation of Delta Vit buildup in these polysilicon- and metal-gate transistors.

Surface-micromachined magnetic undulator with period length between 10μm and 1 mm for advanced light sources

NASA Astrophysics Data System (ADS)

Harrison, Jere; Joshi, Abhijeet; Lake, Jonathan; Candler, Rob; Musumeci, Pietro

2012-07-01

A technological gap exists between the μm-scale wiggling periods achieved using electromagnetic waves of high intensity laser pulses and the mm scale of permanent-magnet and superconducting undulators. In the sub-mm range, surface-micromachined soft-magnetic micro-electro-mechanical system inductors with integrated solenoidal coils have already experimentally demonstrated 100 to 500 mT field amplitude across air gaps as large as 15μm. Simulations indicate that magnetic fields as large as 1.5 T across 50μm inductor gaps are feasible. A simple rearranging of the yoke and pole geometry allows for fabrication of 10+ cm long undulator structures with period lengths between 12.5μm and 1 mm. Such undulators find application both in high average power spontaneous emission sources and, if used in combination with ultrahigh-brightness electron beams, could lead to the realization of low energy compact free-electron lasers. Challenges include electron energy broadening due to wakefields and Joule heating in the electromagnet.

Multiple Optical Traps with a Single-Beam Optical Tweezer Utilizing Surface Micromachined Planar Curved Grating

NASA Astrophysics Data System (ADS)

Kuo, Ju-Nan; Chen, Kuan-Yu

2010-11-01

In this paper, we present a single-beam optical tweezer integrated with a planar curved diffraction grating for microbead manipulation. Various curvatures of the surface micromachined planar curved grating are systematically investigated. The planar curved grating was fabricated using multiuser micro-electro-mechanical-system (MEMS) processes (MUMPs). The angular separation and the number of diffracted orders were determined. Experimental results indicate that the diffraction patterns and curvature of the planar curved grating are closely related. As the curvature of the planar curved grating increases, the vertical diffraction angle increases, resulting in the strip patterns of the planar curved grating. A single-beam optical tweezer integrated with a planar curved diffraction grating was developed. We demonstrate a technique for creating multiple optical traps from a single laser beam using the developed planar curved grating. The strip patterns of the planar curved grating that resulted from diffraction were used to trap one row of polystyrene beads.

Micromachined electron tunneling infrared sensors

NASA Technical Reports Server (NTRS)

Kenny, T. W.; Kaiser, W. J.; Podosek, J. A.; Rockstad, H. K.; Reynolds, J. K.

1993-01-01

The development of an improved Golay cell is reported. This new sensor is constructed entirely from micromachined silicon components. A silicon oxynitride (SiO(x)N(y)) membrane is deflected by the thermal expansion of a small volume of trapped gas. To detect the motion of the membrane, an electron tunneling transducer is used. This sensor detects electrons which tunnel through the classically forbidden barrier between a tip and a surface; the electron current is exponentially dependent on the separation between the tip and the surface. The sensitivity of tunneling transducers constructed was typically better than 10(exp -3) A/square root of Hz. Through use of the electron tunneling transducer, the scaling laws which have prevented the miniaturization of the Golay cell are avoided. This detector potentially offers low cost fabrication, compatibility with silicon readout electronics, and operation without cooling. Most importantly, this detector may offer better sensitivity than any other uncooled infrared sensor, with the exception of the original Golay cell.

Electrical characterization of single cells using polysilicon wire ion sensor in an isolation window.

PubMed

Wu, You-Lin; Hsu, Po-Yen; Hsu, Chung-Ping; Wang, Chih-Cheng; Lee, Li-Wen; Lin, Jing-Jenn

2011-10-01

A polysilicon wire (PSW) sensor can detect the H(+) ion density (pH value) of the medium coated on its surface, and different cells produce different extracellular acidification and hence different H(+) ion densities. Based on this, we used a PSW sensor in combination with a mold-cast polydimethylsiloxane (PDMS) isolation window to detect the adhesion, apoptosis and extracellular acidification of single normal cells and single cancer cells. Single living human normal cells WI38, MRC5, and BEAS-2B as well as non-small-cell lung cancer (NSCLC) cells A549, H1299, and CH27 were cultivated separately inside the isolation window. The current flowing through the PSW channel was measured. From the PSW channel current change as a function of time, we determined the cell adhesion time by observing the time required for the current change to saturate, since a stable extracellular ion density was established after the cells were completely adhered to the PSW surface. The apoptosis of cells can also be determined when the channel current change drops to zero. We found that all the NSCLC cells had a higher channel current change and hence a lower pH value than the normal cells anytime after they were seeded. The corresponding average pH values were 5.86 for A549, 6.00 for H1299, 6.20 for CH27, 6.90 for BEAS-2B, 6.96for MRC5, and 7.02 for WI38, respectively, after the cells were completely adhered to the PSW surface. Our results show that NSCLC cells have a stronger cell-substrate adhesion and a higher extracellular acidification rate than normal cells.

Sorting Rotating Micromachines by Variations in Their Magnetic Properties

NASA Astrophysics Data System (ADS)

Howell, Taylor A.; Osting, Braxton; Abbott, Jake J.

2018-05-01

We consider sorting for the broad class of micromachines (also known as microswimmers, microrobots, micropropellers, etc.) propelled by rotating magnetic fields. We present a control policy that capitalizes on the variation in magnetic properties between otherwise-homogeneous micromachines to enable the sorting of a select fraction of a group from the remainder and prescribe its net relative movement, using a uniform magnetic field that is applied equally to all micromachines. The method enables us to accomplish this sorting task using open-loop control, without relying on a structured environment or localization information of individual micromachines. With our method, the control time to perform the sort is invariant to the number of micromachines. The method is verified through simulations and scaled experiments. Finally, we include an extended discussion about the limitations of the method and address open questions related to its practical application.

Optimization of Neutral Atom Imagers

NASA Technical Reports Server (NTRS)

Shappirio, M.; Coplan, M.; Balsamo, E.; Chornay, D.; Collier, M.; Hughes, P.; Keller, J.; Ogilvie, K.; Williams, E.

2008-01-01

The interactions between plasma structures and neutral atom populations in interplanetary space can be effectively studied with energetic neutral atom imagers. For neutral atoms with energies less than 1 keV, the most efficient detection method that preserves direction and energy information is conversion to negative ions on surfaces. We have examined a variety of surface materials and conversion geometries in order to identify the factors that determine conversion efficiency. For chemically and physically stable surfaces smoothness is of primary importance while properties such as work function have no obvious correlation to conversion efficiency. For the noble metals, tungsten, silicon, and graphite with comparable smoothness, conversion efficiency varies by a factor of two to three. We have also examined the way in which surface conversion efficiency varies with the angle of incidence of the neutral atom and have found that the highest efficiencies are obtained at angles of incidence greater then 80deg. The conversion efficiency of silicon, tungsten and graphite were examined most closely and the energy dependent variation of conversion efficiency measured over a range of incident angles. We have also developed methods for micromachining silicon in order to reduce the volume to surface area over that of a single flat surface and have been able to reduce volume to surface area ratios by up to a factor of 60. With smooth micro-machined surfaces of the optimum geometry, conversion efficiencies can be increased by an order of magnitude over instruments like LENA on the IMAGE spacecraft without increase the instruments mass or volume.

Process for fabricating a microelectromechanical structure

DOEpatents

Sniegowski, Jeffry J.; Krygowski, Thomas W.; Mani, Seethambal S.; Habermehl, Scott D.; Hetherington, Dale L.; Stevens, James E.; Resnick, Paul J.; Volk, Steven R.

2004-10-26

A process is disclosed for forming a microelectromechanical (MEM) structure on a substrate having from 5 to 6 or more layers of deposited and patterned polysilicon. The process is based on determining a radius of curvature of the substrate which is bowed due to accumulated stress in the layers of polysilicon and a sacrificial material used to buildup the MEM structure, and then providing one or more stress-compensation layers on a backside of the substrate to flatten the substrate and allow further processing.

High Efficiency Large Area Polysilicon Solar Cells

NASA Technical Reports Server (NTRS)

Johnson, S. M.; Winter, C.

1985-01-01

Large area (100 sq cm) polysilicon solar cells having efficiencies of up to 14.1% (100 mW/sq cm, 25 C) were fabricated and a detailed analysis was performed to identify the efficiency loss mechanisms. The 1-5 characteristics of the best cell were dominated by recombination in the quasi-neutral base due to the combination of minority carrier diffusion length and base resistivity. An analysis of the microstructural defects present in the material and their effect on the electrical properties is presented.

Uncovering the Fundamental Nature of Tribological Interfaces: High Resolution Tribology and Spectroscopy of Ultrahard Nanostructured Diamond Films for MEMS and Beyond

DTIC Science & Technology

2007-12-31

Wisconsin-Madison) for 2? ol !> o "S \\ % M 31 Statement of Objectives The original objectives of the proposal were as follows: 1. Obtain high-quality...performed multiple PEEM experiments on wear tracks on carbon-based films and polysilicon micro-electro mechanical systems (MEMS) devices, a comprehensive... polysilicon MEMS device known as the "nanotractor", and studies of the structure and composition of UNCD, ta-C, and nanocrystalline diamond (NCD) films. They

Integrated Multiple Device CMOS-MEMS IMU Systems and RF MEMS Applications

DTIC Science & Technology

2002-12-17

microstructures [7]~[9]. The success of the surface-micromachined electrostatic micromotor in the late 80’s [10] stimulated the industry and government...processed electrostatic synchronous micromotors ,” Sensors Actuators, vol. 20, pp. 48-56, 1989. [11] “ADXL05-monolithic accelerometer with signal

Development of amorphous SiC for MEMS-based microbridges

NASA Astrophysics Data System (ADS)

Summers, James B.; Scardelletti, Maximilian; Parro, Rocco; Zorman, Christian A.

2007-02-01

This paper reports our effort to develop amorphous hydrogenated silicon carbide (a-SiC:H) films specifically designed for MEMS-based microbridges using methane and silane as the precursor gases. In our work, the a-SiC:H films were deposited in a simple, commercial PECVD system at a fixed temperature of 300°C. Films with thicknesses from 100 nm to 1000 nm, a typical range for many MEMS applications, were deposited. Deposition parameters such as deposition pressure and methane-to-silane ratio were varied in order to obtain films with suitable residual stresses. Average residual stress in the as-deposited films selected for device fabrication was found by wafer curvature measurements to be -658 +/- 22 MPa, which could be converted to 177 +/- 40 MPa after thermal annealing at 450°C, making them suitable for micromachined bridges, membranes and other anchored structures. Bulk micromachined membranes were constructed to determine the Young's modulus of the annealed films, which was found to be 205 +/- 6 GPa. Chemical inertness was tested in aggressive solutions such as KOH and HF. Prototype microbridge actuators were fabricated using a simple surface micromachining process to assess the potential of the a-SiC:H films as structural layers for MEMS applications.

Influence of micromachined targets on laser accelerated proton beam profiles

NASA Astrophysics Data System (ADS)

Dalui, Malay; Permogorov, Alexander; Pahl, Hannes; Persson, Anders; Wahlström, Claes-Göran

2018-03-01

High intensity laser-driven proton acceleration from micromachined targets is studied experimentally in the target-normal-sheath-acceleration regime. Conical pits are created on the front surface of flat aluminium foils of initial thickness 12.5 and 3 μm using series of low energy pulses (0.5-2.5 μJ). Proton acceleration from such micromachined targets is compared with flat foils of equivalent thickness at a laser intensity of 7 × 1019 W cm-2. The maximum proton energy obtained from targets machined from 12.5 μm thick foils is found to be slightly lower than that of flat foils of equivalent remaining thickness, and the angular divergence of the proton beam is observed to increase as the depth of the pit approaches the foil thickness. Targets machined from 3 μm thick foils, on the other hand, show evidence of increasing the maximum proton energy when the depths of the structures are small. Furthermore, shallow pits on 3 μm thick foils are found to be efficient in reducing the proton beam divergence by a factor of up to three compared to that obtained from flat foils, while maintaining the maximum proton energy.

Experimental determination of the impact of polysilicon LER on sub-100-nm transistor performance

NASA Astrophysics Data System (ADS)

Patterson, Kyle; Sturtevant, John L.; Alvis, John R.; Benavides, Nancy; Bonser, Douglas; Cave, Nigel; Nelson-Thomas, Carla; Taylor, William D.; Turnquest, Karen L.

2001-08-01

Photoresist line edge roughness (LER) has long been feared as a potential limitation to the application of various patterning technologies to actual devices. While this concern seems reasonable, experimental verification has proved elusive and thus LER specifications are typically without solid parametric rationale. We report here the transistor device performance impact of deliberate variations of polysilicon gate LER. LER magnitude was attenuated by more than a factor of 5 by altering the photoresist type and thickness, substrate reflectivity, masking approach, and etch process. The polysilicon gate LER for nominally 70 - 150 nm devices was quantified using digital image processing of SEM images, and compared to gate leakage and drive current for variable length and width transistors. With such comparisons, realistic LER specifications can be made for a given transistor. It was found that subtle cosmetic LER differences are often not discernable electrically, thus providing hope that LER will not limit transistor performance as the industry migrates to sub-100 nm patterning.

A CMOS-Compatible Poly-Si Nanowire Device with Hybrid Sensor/Memory Characteristics for System-on-Chip Applications

PubMed Central

Chen, Min-Cheng; Chen, Hao-Yu; Lin, Chia-Yi; Chien, Chao-Hsin; Hsieh, Tsung-Fan; Horng, Jim-Tong; Qiu, Jian-Tai; Huang, Chien-Chao; Ho, Chia-Hua; Yang, Fu-Liang

2012-01-01

This paper reports a versatile nano-sensor technology using “top-down” poly-silicon nanowire field-effect transistors (FETs) in the conventional Complementary Metal-Oxide Semiconductor (CMOS)-compatible semiconductor process. The nanowire manufacturing technique reduced nanowire width scaling to 50 nm without use of extra lithography equipment, and exhibited superior device uniformity. These n type polysilicon nanowire FETs have positive pH sensitivity (100 mV/pH) and sensitive deoxyribonucleic acid (DNA) detection ability (100 pM) at normal system operation voltages. Specially designed oxide-nitride-oxide buried oxide nanowire realizes an electrically Vth-adjustable sensor to compensate device variation. These nanowire FETs also enable non-volatile memory application for a large and steady Vth adjustment window (>2 V Programming/Erasing window). The CMOS-compatible manufacturing technique of polysilicon nanowire FETs offers a possible solution for commercial System-on-Chip biosensor application, which enables portable physiology monitoring and in situ recording. PMID:22666012

Fabrication and characterization of a micromachined swirl-shaped ionic polymer metal composite actuator with electrodes exhibiting asymmetric resistance.

PubMed

Feng, Guo-Hua; Liu, Kim-Min

2014-05-12

This paper presents a swirl-shaped microfeatured ionic polymer-metal composite (IPMC) actuator. A novel micromachining process was developed to fabricate an array of IPMC actuators on a glass substrate and to ensure that no shortcircuits occur between the electrodes of the actuator. We demonstrated a microfluidic scheme in which surface tension was used to construct swirl-shaped planar IPMC devices of microfeature size and investigated the flow velocity of Nafion solutions, which formed the backbone polymer of the actuator, within the microchannel. The unique fabrication process yielded top and bottom electrodes that exhibited asymmetric surface resistance. A tool for measuring surface resistance was developed and used to characterize the resistances of the electrodes for the fabricated IPMC device. The actuator, which featured asymmetric electrode resistance, caused a nonzero-bias current when the device was driven using a zero-bias square wave, and we propose a circuit model to describe this phenomenon. Moreover, we discovered and characterized a bending and rotating motion when the IPMC actuator was driven using a square wave. We observed a strain rate of 14.6% and a displacement of 700 μm in the direction perpendicular to the electrode surfaces during 4.5-V actuation.

Fabrication and Characterization of a Micromachined Swirl-Shaped Ionic Polymer Metal Composite Actuator with Electrodes Exhibiting Asymmetric Resistance

PubMed Central

Feng, Guo-Hua; Liu, Kim-Min

2014-01-01

This paper presents a swirl-shaped microfeatured ionic polymer-metal composite (IPMC) actuator. A novel micromachining process was developed to fabricate an array of IPMC actuators on a glass substrate and to ensure that no shortcircuits occur between the electrodes of the actuator. We demonstrated a microfluidic scheme in which surface tension was used to construct swirl-shaped planar IPMC devices of microfeature size and investigated the flow velocity of Nafion solutions, which formed the backbone polymer of the actuator, within the microchannel. The unique fabrication process yielded top and bottom electrodes that exhibited asymmetric surface resistance. A tool for measuring surface resistance was developed and used to characterize the resistances of the electrodes for the fabricated IPMC device. The actuator, which featured asymmetric electrode resistance, caused a nonzero-bias current when the device was driven using a zero-bias square wave, and we propose a circuit model to describe this phenomenon. Moreover, we discovered and characterized a bending and rotating motion when the IPMC actuator was driven using a square wave. We observed a strain rate of 14.6% and a displacement of 700 μm in the direction perpendicular to the electrode surfaces during 4.5-V actuation. PMID:24824370

Method for forming precision clockplate with pivot pins

DOEpatents

Wild, Ronald L [Albuquerque, NM

2010-06-01

Methods are disclosed for producing a precision clockplate with rotational bearing surfaces (e.g. pivot pins). The methods comprise providing an electrically conductive blank, conventionally machining oversize features comprising bearing surfaces into the blank, optionally machining of a relief on non-bearing surfaces, providing wire accesses adjacent to bearing surfaces, threading the wire of an electrical discharge machine through the accesses and finishing the bearing surfaces by wire electrical discharge machining. The methods have been shown to produce bearing surfaces of comparable dimension and tolerances as those produced by micro-machining methods such as LIGA, at reduced cost and complexity.

Formation of porous networks on polymeric surfaces by femtosecond laser micromachining

NASA Astrophysics Data System (ADS)

Assaf, Youssef; Kietzig, Anne-Marie

2017-02-01

In this study, porous network structures were successfully created on various polymer surfaces by femtosecond laser micromachining. Six different polymers (poly(tetrafluoroethylene) (PTFE), poly(methyl methacrylate) (PMMA), high density poly(ethylene) (HDPE), poly(lactic acid) (PLA), poly(carbonate) (PC), and poly(ethylene terephthalate) (PET)) were machined at different fluences and pulse numbers, and the resulting structures were identified and compared by lacunarity analysis. At low fluence and pulse numbers, porous networks were confirmed to form on all materials except PLA. Furthermore, all networks except for PMMA were shown to bundle up at high fluence and pulse numbers. In the case of PC, a complete breakdown of the structure at such conditions was observed. Operation slightly above threshold fluence and at low pulse numbers is therefore recommended for porous network formation. Finally, the thickness over which these structures formed was measured and compared to two intrinsic material dependent parameters: the single pulse threshold fluence and the incubation coefficient. Results indicate that a lower threshold fluence at operating conditions favors material removal over structure formation and is hence detrimental to porous network formation. Favorable machining conditions and material-dependent parameters for the formation of porous networks on polymer surfaces have thus been identified.

A mechanical analysis of woodpecker drumming and its application to shock-absorbing systems.

PubMed

Yoon, Sang-Hee; Park, Sungmin

2011-03-01

A woodpecker is known to drum the hard woody surface of a tree at a rate of 18 to 22 times per second with a deceleration of 1200 g, yet with no sign of blackout or brain damage. As a model in nature, a woodpecker is studied to find clues to develop a shock-absorbing system for micromachined devices. Its advanced shock-absorbing mechanism, which cannot be explained merely by allometric scaling, is analyzed in terms of endoskeletal structures. In this analysis, the head structures (beak, hyoid, spongy bone, and skull bone with cerebrospinal fluid) of the golden-fronted woodpecker, Melanerpes aurifrons, are explored with x-ray computed tomography images, and their shock-absorbing mechanism is analyzed with a mechanical vibration model and an empirical method. Based on these analyses, a new shock-absorbing system is designed to protect commercial micromachined devices from unwanted high-g and high-frequency mechanical excitations. The new shock-absorbing system consists of close-packed microglasses within two metal enclosures and a viscoelastic layer fastened by steel bolts, which are biologically inspired from a spongy bone contained within a skull bone encompassed with the hyoid of a woodpecker. In the experimental characterizations using a 60 mm smoothbore air-gun, this bio-inspired shock-absorbing system shows a failure rate of 0.7% for the commercial micromachined devices at 60 000 g, whereas a conventional hard-resin method yields a failure rate of 26.4%, thus verifying remarkable improvement in the g-force tolerance of the commercial micromachined devices.

Post-CMOS Micromachining of Surface and Bulk Structures

DTIC Science & Technology

2002-05-06

Structures iii Acknowledgements I would like to thank my advisors, Professor Gary K. Fedder and Professor Dave W. Greve, for their continuing support...Donnelly, Plasma Chem. Plasma Process, vol. 1, pp. 37, 1981. [54] J. L. Mauer, J. S. Logan, L. B. Zielinski , and G. S. Schwartz, J. Vac. Sci. Technol

Microfabricated ion trap array

DOEpatents

Blain, Matthew G [Albuquerque, NM; Fleming, James G [Albuquerque, NM

2006-12-26

A microfabricated ion trap array, comprising a plurality of ion traps having an inner radius of order one micron, can be fabricated using surface micromachining techniques and materials known to the integrated circuits manufacturing and microelectromechanical systems industries. Micromachining methods enable batch fabrication, reduced manufacturing costs, dimensional and positional precision, and monolithic integration of massive arrays of ion traps with microscale ion generation and detection devices. Massive arraying enables the microscale ion traps to retain the resolution, sensitivity, and mass range advantages necessary for high chemical selectivity. The reduced electrode voltage enables integration of the microfabricated ion trap array with on-chip circuit-based rf operation and detection electronics (i.e., cell phone electronics). Therefore, the full performance advantages of the microfabricated ion trap array can be realized in truly field portable, handheld microanalysis systems.

A flexible ultrasound transducer array with micro-machined bulk PZT.

PubMed

Wang, Zhe; Xue, Qing-Tang; Chen, Yuan-Quan; Shu, Yi; Tian, He; Yang, Yi; Xie, Dan; Luo, Jian-Wen; Ren, Tian-Ling

2015-01-23

This paper proposes a novel flexible piezoelectric micro-machined ultrasound transducer, which is based on PZT and a polyimide substrate. The transducer is made on the polyimide substrate and packaged with medical polydimethylsiloxane. Instead of etching the PZT ceramic, this paper proposes a method of putting diced PZT blocks into holes on the polyimide which are pre-etched. The device works in d31 mode and the electromechanical coupling factor is 22.25%. Its flexibility, good conformal contacting with skin surfaces and proper resonant frequency make the device suitable for heart imaging. The flexible packaging ultrasound transducer also has a good waterproof performance after hundreds of ultrasonic electric tests in water. It is a promising ultrasound transducer and will be an effective supplementary ultrasound imaging method in the practical applications.

The Cooling and Lubrication Performance of Graphene Platelets in Micro-Machining Environments

NASA Astrophysics Data System (ADS)

Chu, Bryan

The research presented in this thesis is aimed at investigating the use of graphene platelets (GPL) to address the challenges of excessive tool wear, reduced part quality, and high specific power consumption encountered in micro-machining processes. There are two viable methods of introducing GPL into micro-machining environments, viz., the embedded delivery method, where the platelets are embedded into the part being machined, and the external delivery method, where graphene is carried into the cutting zone by jetting or atomizing a carrier fluid. The study involving the embedded delivery method is focused on the micro-machining performance of hierarchical graphene composites. The results of this study show that the presence of graphene in the epoxy matrix improves the machinability of the composite. In general, the tool wear, cutting forces, surface roughness, and extent of delamination are all seen to be lower for the hierarchical composite when compared to the conventional two-phase glass fiber composite. These improvements are attributed to the fact that graphene platelets improve the thermal conductivity of the matrix, provide lubrication at the tool-chip interface and also improve the interface strength between the glass fibers and the matrix. The benefits of graphene are seen to also carry over to the external delivery method. The platelets provide improved cooling and lubrication performance to both environmentally-benign cutting fluids as well as to semi-synthetic cutting fluids used in micro-machining. The cutting performance is seen to be a function of the geometry (i.e., lateral size and thickness) and extent of oxygen-functionalization of the platelet. Ultrasonically exfoliated platelets (with 2--3 graphene layers and lowest in-solution characteristic lateral length of 120 nm) appear to be the most favorable for micro-machining applications. Even at the lowest concentration of 0.1 wt%, they are capable of providing a 51% reduction in the cutting temperature and a 25% reduction in the surface roughness value over that of the baseline semi-synthetic cutting fluid. For the thermally-reduced platelets (with 4--8 graphene layers and in-solution characteristic lateral length of 562--2780 nm), a concentration of 0.2 wt% appears to be optimal. An investigation into the impingement dynamics of the graphene-laden colloidal solutions on a heated substrate reveals that the most important criterion dictating their machining performance is their ability to form uniform, submicron thick films of the platelets upon evaporation of the carrier fluid. As such, the characterization of the residual platelet film left behind on a heated substrate may be an effective technique for evaluating different graphene colloidal solutions for cutting fluids applications in micromachining. Graphene platelets have also recently been shown to reduce the aggressive chemical wear of diamond tools during the machining of transition metal alloys. However, the specific mechanisms responsible for this improvement are currently unknown. The modeling work presented in this thesis uses molecular dynamics techniques to shed light on the wear mitigation mechanisms that are active during the diamond cutting of steel when in the presence of graphene platelets. The dual mechanisms responsible for graphene-induced chemical wear mitigation are: 1) The formation of a physical barrier between the metal and tool atoms, preventing graphitization; and 2) The preferential transfer of carbon from the graphene platelet rather than from the diamond tool. The results of the simulations also provide new insight into the behavior of the 2D graphene platelets in the cutting zone, specifically illustrating the mechanisms of cleaving and interlayer sliding in graphene platelets under the high pressures in cutting zones.

High-power visible laser effect on a Boston Micromachines' MEMS deformable mirror

NASA Astrophysics Data System (ADS)

Norton, Andrew; Gavel, Donald; Dillon, Daren; Cornelissen, Steven

2010-07-01

Continuous-facesheet and segmented Boston Micromachines Corporations' (BMC) Micro-Electrical Mechanical Systems (MEMS) Deformable Mirrors (DM) have been tested for their response to high-power visible-wavelength laser light. The deformable mirrors, coated with either protected silver or bare aluminum, were subjected to a maximum of 2 Watt laser-light at a wavelength of 532 nanometers. The laser light was incident on a ~ 3.5×3.5 cm area for time periods from minutes to 7 continuous hours. Spot heating from the laser-light is measured to induce a local bulge in the surface of each DM. For the aluminum-coated continuous facesheet DM, the induced spot heating changes the surface figure by 16 nm rms. The silver-coated continuous-facesheet and segmented (spatial light modulator) DMs experience a 6 and 8 nm surface rms change in surface quality with the laser at 2 Watts. For spatial frequencies less than the actuator spacing (300 mm), the laser induced surface bulge is shown to be removable, as the DMs continued to be fully functional during and after their exposure. Over the full 10 mm aperture one could expect the same results with a 15 Watt laser guide star (LGS). These results are very promising for use of the MEMS DM to pre-correct the outgoing laser light in the Laboratory for Adaptive Optics' (LAO) laser uplink application.

Design of electrostatically levitated micromachined rotational gyroscope based on UV-LIGA technology

NASA Astrophysics Data System (ADS)

Cui, Feng; Chen, Wenyuan; Su, Yufeng; Zhang, Weiping; Zhao, Xiaolin

2004-12-01

The prevailing micromachined vibratory gyroscope typically has a proof mass connected to the substrate by a mechanical suspension system, which makes it face a tough challenge to achieve tactical or inertial grade performance levels. With a levitated rotor as the proof mass, a micromachined rotational gyroscope will potentially have higher performance than vibratory gyroscope. Besides working as a moment rebalance dual-axis gyroscope, the micromachined rotational gyroscope based on a levitated rotor can simultaneously work as a force balance tri-axis accelerometer. Micromachined rotational gyroscope based on an electrostatically levitated silicon micromachined rotor has been notably developed. In this paper, factors in designing a rotational gyro/accelerometer based on an electrostatically levitated disc-like rotor, including gyroscopic action of micro rotor, methods of stable levitation, micro displacement detection and control, rotation drive and speed control, vacuum packaging and microfabrication, are comprehensively considered. Hence a design of rotational gyro/accelerometer with an electroforming nickel rotor employing low cost UV-LIGA technology is presented. In this design, a wheel-like flat rotor is proposed and its basic dimensions, diameter and thickness, are estimated according to the required loading capability. Finally, its micromachining methods based on UV-LIGA technology and assembly technology are discussed.

A Distance Detector with a Strip Magnetic MOSFET and Readout Circuit.

PubMed

Sung, Guo-Ming; Lin, Wen-Sheng; Wang, Hsing-Kuang

2017-01-10

This paper presents a distance detector composed of two separated metal-oxide semiconductor field-effect transistors (MOSFETs), a differential polysilicon cross-shaped Hall plate (CSHP), and a readout circuit. The distance detector was fabricated using 0.18 μm 1P6M Complementary Metal-Oxide Semiconductor (CMOS) technology to sense the magnetic induction perpendicular to the chip surface. The differential polysilicon CSHP enabled the magnetic device to not only increase the magnetosensitivity but also eliminate the offset voltage generated because of device mismatch and Lorentz force. Two MOSFETs generated two drain currents with a quadratic function of the differential Hall voltages at CSHP. A readout circuit-composed of a current-to-voltage converter, a low-pass filter, and a difference amplifier-was designed to amplify the current difference between two drains of MOSFETs. Measurements revealed that the electrostatic discharge (ESD) could be eliminated from the distance sensor by grounding it to earth; however, the sensor could be desensitized by ESD in the absence of grounding. The magnetic influence can be ignored if the magnetic body (human) stays far from the magnetic sensor, and the measuring system is grounded to earth by using the ESD wrist strap (Strap E-GND). Both 'no grounding' and 'grounding to power supply' conditions were unsuitable for measuring the induced Hall voltage.

Laser and Electron Beam Processing of Semiconductors: CW Beam- Recrystallized Polysilicon as a Device-Worthy Material

DTIC Science & Technology

1980-12-31

boundary is given by the thermionic emission current, kT 1 /2 qVB qVa Jth = qn (m) exp (- [exp (Kn)- 1 ] ( 1 ) where Va is the applied voltage, q is the...small applied voltage, qVa << kT, Eq. ( 1 ) reduces to Jth = LVa (2) where = q n exp - -T- q.na (3) which gives the effective grain boundary resistance...POLYSILICON AS A DEVICE-WORTHY MATERIAL BY STANFORD UNIVERSITY STANFORD, CALIFORNIA 94305 FOR THE PERIOD JANUARY 1 , 1978 THROUGH DECEMBER 31, 1980 Dr

Development of the silane process for the production of low-cost polysilicon

NASA Technical Reports Server (NTRS)

Iya, S. K.

1986-01-01

It was recognized that the traditional hot rod type deposition process for decomposing silane is energy intensive, and a different approach for converting silane to silicon was chosen. A 1200 metric tons/year capacity commercial plant was constructed in Moses Lake, Washington. A fluidized bed processor was chosen as the most promising technology and several encouraging test runs were conducted. This technology continues to be very promising in producing low cost polysilicon. The Union Carbide silane process and the research development on the fluidized bed silane decomposition are discussed.

Permanent and Transient Radiation Effects on Thin-Oxide (200-A) MOS Transistors

DTIC Science & Technology

1976-06-01

n-channel technology using a SiO, gate-oxide thickness ol ’ 200 A and a %hallow phiosphorus diffusion of 0.5 pin on a 0.7-ohm)-cmn 8-doped > Si...substrate. The thickness of the sell-aligned it polysilicon gate was kept at 3500 A. The oxide was grown in dry 0, at a temperature ot 1000C, followed...semiconductor work function difference (equal to 0 V for the polysilicon gates’ studied here). The effect of the ionizing radiation is to introduce

Non-Invasive Monitoring for Optimization of Therapeutic Drug Delivery by Biodegradable Fiber to Prostate Tumor

DTIC Science & Technology

2008-02-01

v ol um e (c m ^3 ) Injection Internal pump External Pump Treatment starts Rat’s condition before treatment 0 0.2 0.4 0.6 0.8 1 550 650...of polysilicon thermal flexure actuator,” J. of Micromechanics and Microengineering.9, 2005. [36] A. Grayson, et.al., “Electronic MEMS for...36. [59] Q-H. Huang and N. K. S. Lee, “Analysis and design of polysilicon thermal flexure actuator,” J. Micromech. Microeng. 9 (1) pp. 64–70 (1999

Nonlinear dynamic modeling of a V-shaped metal based thermally driven MEMS actuator for RF switches

NASA Astrophysics Data System (ADS)

Bakri-Kassem, Maher; Dhaouadi, Rached; Arabi, Mohamed; Estahbanati, Shahabeddin V.; Abdel-Rahman, Eihab

2018-05-01

In this paper, we propose a new dynamic model to describe the nonlinear characteristics of a V-shaped (chevron) metallic-based thermally driven MEMS actuator. We developed two models for the thermal actuator with two configurations. The first MEMS configuration has a small tip connected to the shuttle, while the second configuration has a folded spring and a wide beam attached to the shuttle. A detailed finite element model (FEM) and a lumped element model (LEM) are proposed for each configuration to completely characterize the electro-thermal and thermo-mechanical behaviors. The nonlinear resistivity of the polysilicon layer is extracted from the measured current-voltage (I-V) characteristics of the actuator and the simulated corresponding temperatures in the FEM model, knowing the resistivity of the polysilicon at room temperature from the manufacture’s handbook. Both developed models include the nonlinear temperature-dependent material properties. Numerical simulations in comparison with experimental data using a dedicated MEMS test apparatus verify the accuracy of the proposed LEM model to represent the complex dynamics of the thermal MEMS actuator. The LEM and FEM simulation results show an accuracy ranging from a maximum of 13% error down to a minimum of 1.4% error. The actuator with the lower thermal load to air that includes a folded spring (FS), also known as high surface area actuator is compared to the actuator without FS, also known as low surface area actuator, in terms of the I-V characteristics, power consumption, and experimental static and dynamic responses of the tip displacement.

Effect of CO2 laser micromachining on physicochemical properties of poly(L-lactide)

NASA Astrophysics Data System (ADS)

Antończak, Arkadiusz J.; Stepak, Bogusz; Szustakiewicz, Konrad; Wójcik, Michał; Kozioł, Paweł E.; Łazarek, Łukasz; Abramski, Krzysztof M.

2014-08-01

In this paper, we present some examples of micromachining of poly(L-lactide) with a CO2 laser and an analysis of changes in material properties in the heat affected HAZ induced by the fluence well above the ablation threshold. The complexity of the processes of decomposition implies the need for simultaneous use of many selective analytical techniques which complement each other to give a full image of the changes. Introduced changes were characterized using Differential Scanning Calorimetry (DSC), Gel Permeation Chromatography (GPC), X-ray Photoelectron Spectroscopy (XPS) and Attenuated Total Reflectance Fourier Transform Infrared spectroscopy (ATR-FTIR). It turns out that CO2 laser processing of poly(L-lactide) mainly induces surface changes. However, oxidation of the surface was not observed. We recorded a bimodal distribution and some reduction in the molecular weight. Infrared spectroscopy in turn revealed the existence of absorption bands, characteristic for the vinyl groups (RCH=CH2). The appearance of these bands indicates that the decomposition of the polymer occurred, among others, by means of the cis-elimination reaction.

Development of a Novel Transparent Flexible Capacitive Micromachined Ultrasonic Transducer

PubMed Central

Pang, Da-Chen; Chang, Cheng-Min

2017-01-01

This paper presents the world’s first transparent flexible capacitive micromachined ultrasonic transducer (CMUT) that was fabricated through a roll-lamination technique. This polymer-based CMUT has advantages of transparency, flexibility, and non-contacting detection which provide unique functions in display panel applications. Comprising an indium tin oxide-polyethylene terephthalate (ITO-PET) substrate, SU-8 sidewall and vibrating membranes, and silver nanowire transparent electrode, the transducer has visible-light transmittance exceeding 80% and can operate on curved surfaces with a 40 mm radius of curvature. Unlike the traditional silicon-based high temperature process, the CMUT can be fabricated on a flexible substrate at a temperature below 100 °C to reduce residual stress introduced at high temperature. The CMUT on the curved surfaces can detect a flat target and finger at distances up to 50 mm and 40 mm, respectively. The transparent flexible CMUT provides a better human-machine interface than existing touch panels because it can be integrated with a display panel for non-contacting control in a health conscious environment and the flexible feature is critical for curved display and wearable electronics. PMID:28632157

Gold-based electrical interconnections for microelectronic devices

DOEpatents

Peterson, Kenneth A.; Garrett, Stephen E.; Reber, Cathleen A.; Watson, Robert D.

2002-01-01

A method of making an electrical interconnection from a microelectronic device to a package, comprising ball or wedge compression bonding a gold-based conductor directly to a silicon surface, such as a polysilicon bonding pad in a MEMS or IMEMS device, without using layers of aluminum or titanium disposed in-between the conductor and the silicon surface. After compression bonding, optional heating of the bond above 363 C. allows formation of a liquid gold-silicon eutectic phase containing approximately 3% (by weight) silicon, which significantly improves the bond strength by reforming and enhancing the initial compression bond. The same process can be used for improving the bond strength of Au--Ge bonds by forming a liquid Au-12Ge eutectic phase.

NASA Tech Briefs, May 2003

NASA Technical Reports Server (NTRS)

2003-01-01

Topics covered include: Using Diffusion Bonding in Making Piezoelectric Actuators; Wireless Temperature-Monitoring System; Analog Binaural Circuits for Detecting and Locating Leaks; Mirrors Containing Biomimetic Shape-Control Actuators; Surface-Micromachined Planar Arrays of Thermopiles; Cascade Back-Propagation Learning in Neural Networks; Perovskite Superlattices as Tunable Microwave Devices; Rollable Thin-Shell Nanolaminate Mirrors; Flight Tests of a Ministick Controller in an F/A-18 Airplane; Piezoelectrically Actuated Shutter for High Vacuum; Bio-Inspired Engineering of Exploration Systems; Microscope Cells Containing Multiple Micromachined Wells; Electrophoretic Deposition for Fabricating Microbatteries; Integrated Arrays of Ion-Sensitive Electrodes; Model of Fluidized Bed Containing Reacting Solids and Gases; Membrane Mirrors With Bimorph Shape Actuators; Using Fractional Clock-Period Delays in Telemetry Arraying; Developing Generic Software for Spacecraft Avionics; Numerical Study of Pyrolysis of Biomass in Fluidized Beds; and Assessment of Models of Chemically Reacting Granular Flows.

Fabrication of low-loss ridge waveguides in z-cut lithium niobate by combination of ion implantation and UV picosecond laser micromachining

NASA Astrophysics Data System (ADS)

Stolze, M.; Herrmann, T.; L'huillier, J. A.

2016-03-01

Ridge waveguides in ferroelectric materials like LiNbO3 attended great interest for highly efficient integrated optical devices, for instance, electro-optic modulators, frequency converters and ring resonators. The main challenges are the realization of high index barrier towards the substrate and the processing of smooth ridges for minimized scattering losses. For fabricating ridges a variety of techniques, like chemical and wet etching as well as optical grade dicing, have been investigated in detail. Among them, laser micromachining offers a versatile and flexible processing technology, but up to now only a limited side wall roughness has been achieved by this technique. Here we report on laser micromachining of smooth ridges for low-loss optical waveguides in LiNbO3. The ridges with a top width of 7 µm were fabricated in z-cut LiNbO3 by a combination of UV picosecond micromachining and thermal annealing. The laser processing parameters show a strong influence on the achievable sidewall roughness of the ridges and were systematically investigated and optimized. Finally, the surface quality is further improved by an optimized thermal post-processing. The roughness of the ridges were analysed with confocal microscopy and the scattering losses were measured at an optical characterization wavelength of 632.8 nm by using the end-fire coupling method. In these investigations the index barrier was formed by multi-energy low dose oxygen ion implantation technology in a depth of 2.7 μm. With optimized laser processing parameters and thermal post-processing a scattering loss as low as 0.1 dB/cm has been demonstrated.

Microsacle PolySilicon Hemispherical Shell Resonating Gyroscopes with Integrated Three-dimensional Curved Electrodes

NASA Astrophysics Data System (ADS)

Zhuang, Xuye; Chen, Binggen; Wang, Xinlong; Yu, Lei; Wang, Fan; Guo, Shuwen

2018-03-01

A novel approach for fabrication of polysilicon hemispherical resonator gyroscopes with integrated 3-D curved electrodes is developed and experimentally demonstrated. The 3-D polysilicon electrodes are integrated as a part of the hemispherical shell resonator’s fabrication process, and no extra assembly process are needed, ensuring the symmetry of the shell resonator. The fabrication process and materials used are compatible with the traditional semiconductor process, indicating the gyroscope has a high potential for mass production and commercial development. Without any trimming or tuning of the n=2 wineglass frequencies, a 28 kHz shell resonator demonstrates a 0.009% frequency mismatch between two degenerate wineglass modes, and a 13.6 kHz resonator shows a frequency split of 0.03%. The ring-down time of a fabricated resonator is 0.51 s, corresponding to a Q of 22000, at 0.01 Pa vacuum and room temperature. The prototype of the gyroscope is experimentally analyzed, and the scale factor of the gyro is 1.15 mV/°/s, the bias instability is 80 °/h.

A micro-machined source transducer for a parametric array in air.

PubMed

Lee, Haksue; Kang, Daesil; Moon, Wonkyu

2009-04-01

Parametric array applications in air, such as highly directional parametric loudspeaker systems, usually rely on large radiators to generate the high-intensity primary beams required for nonlinear interactions. However, a conventional transducer, as a primary wave projector, requires a great deal of electrical power because its electroacoustic efficiency is very low due to the large characteristic mechanical impedance in air. The feasibility of a micro-machined ultrasonic transducer as an efficient finite-amplitude wave projector was studied. A piezoelectric micro-machined ultrasonic transducer array consisting of lead zirconate titanate uni-morph elements was designed and fabricated for this purpose. Theoretical and experimental evaluations showed that a micro-machined ultrasonic transducer array can be used as an efficient source transducer for a parametric array in air. The beam patterns and propagation curves of the difference frequency wave and the primary wave generated by the micro-machined ultrasonic transducer array were measured. Although the theoretical results were based on ideal parametric array models, the theoretical data explained the experimental results reasonably well. These experiments demonstrated the potential of micro-machined primary wave projector.

Soft micromachines with programmable motility and morphology

PubMed Central

Huang, Hen-Wei; Sakar, Mahmut Selman; Petruska, Andrew J.; Pané, Salvador; Nelson, Bradley J.

2016-01-01

Nature provides a wide range of inspiration for building mobile micromachines that can navigate through confined heterogenous environments and perform minimally invasive environmental and biomedical operations. For example, microstructures fabricated in the form of bacterial or eukaryotic flagella can act as artificial microswimmers. Due to limitations in their design and material properties, these simple micromachines lack multifunctionality, effective addressability and manoeuvrability in complex environments. Here we develop an origami-inspired rapid prototyping process for building self-folding, magnetically powered micromachines with complex body plans, reconfigurable shape and controllable motility. Selective reprogramming of the mechanical design and magnetic anisotropy of body parts dynamically modulates the swimming characteristics of the micromachines. We find that tail and body morphologies together determine swimming efficiency and, unlike for rigid swimmers, the choice of magnetic field can subtly change the motility of soft microswimmers. PMID:27447088

Soft micromachines with programmable motility and morphology.

PubMed

Huang, Hen-Wei; Sakar, Mahmut Selman; Petruska, Andrew J; Pané, Salvador; Nelson, Bradley J

2016-07-22

Nature provides a wide range of inspiration for building mobile micromachines that can navigate through confined heterogenous environments and perform minimally invasive environmental and biomedical operations. For example, microstructures fabricated in the form of bacterial or eukaryotic flagella can act as artificial microswimmers. Due to limitations in their design and material properties, these simple micromachines lack multifunctionality, effective addressability and manoeuvrability in complex environments. Here we develop an origami-inspired rapid prototyping process for building self-folding, magnetically powered micromachines with complex body plans, reconfigurable shape and controllable motility. Selective reprogramming of the mechanical design and magnetic anisotropy of body parts dynamically modulates the swimming characteristics of the micromachines. We find that tail and body morphologies together determine swimming efficiency and, unlike for rigid swimmers, the choice of magnetic field can subtly change the motility of soft microswimmers.

Low loss poly-silicon for high performance capacitive silicon modulators.

PubMed

Douix, Maurin; Baudot, Charles; Marris-Morini, Delphine; Valéry, Alexia; Fowler, Daivid; Acosta-Alba, Pablo; Kerdilès, Sébastien; Euvrard, Catherine; Blanc, Romuald; Beneyton, Rémi; Souhaité, Aurélie; Crémer, Sébastien; Vulliet, Nathalie; Vivien, Laurent; Boeuf, Frédéric

2018-03-05

Optical properties of poly-silicon material are investigated to be integrated in new silicon photonics devices, such as capacitive modulators. Test structure fabrication is done on 300 mm wafer using LPCVD deposition: 300 nm thick amorphous silicon layers are deposited on thermal oxide, followed by solid phase crystallization anneal. Rib waveguides are fabricated and optical propagation losses measured at 1.31 µm. Physical analysis (TEM ASTAR, AFM and SIMS) are used to assess the origin of losses. Optimal deposition and annealing conditions have been defined, resulting in 400 nm-wide rib waveguides with only 9.2-10 dB/cm losses.

Trench process and structure for backside contact solar cells with polysilicon doped regions

DOEpatents

De Ceuster, Denis; Cousins, Peter John; Smith, David D

2014-03-18

A solar cell includes polysilicon P-type and N-type doped regions on a backside of a substrate, such as a silicon wafer. An interrupted trench structure separates the P-type doped region from the N-type doped region in some locations but allows the P-type doped region and the N-type doped region to touch in other locations. Each of the P-type and N-type doped regions may be formed over a thin dielectric layer. Among other advantages, the resulting solar cell structure allows for increased efficiency while having a relatively low reverse breakdown voltage.

Trench process and structure for backside contact solar cells with polysilicon doped regions

DOEpatents

De Ceuster, Denis; Cousins, Peter John; Smith, David D

2013-05-28

A solar cell includes polysilicon P-type and N-type doped regions on a backside of a substrate, such as a silicon wafer. An interrupted trench structure separates the P-type doped region from the N-type doped region in some locations but allows the P-type doped region and the N-type doped region to touch in other locations. Each of the P-type and N-type doped regions may be formed over a thin dielectric layer. Among other advantages, the resulting solar cell structure allows for increased efficiency while having a relatively low reverse breakdown voltage.

Trench process and structure for backside contact solar cells with polysilicon doped regions

DOEpatents

De Ceuster, Denis; Cousins, Peter John; Smith, David D.

2010-12-14

A solar cell includes polysilicon P-type and N-type doped regions on a backside of a substrate, such as a silicon wafer. An interrupted trench structure separates the P-type doped region from the N-type doped region in some locations but allows the P-type doped region and the N-type doped region to touch in other locations. Each of the P-type and N-type doped regions may be formed over a thin dielectric layer. Among other advantages, the resulting solar cell structure allows for increased efficiency while having a relatively low reverse breakdown voltage.

Surface-Micromachined Microfiltration Membranes for Efficient Isolation and Functional Immunophenotyping of Subpopulations of Immune Cells

PubMed Central

Oh, Boram; Lam, Raymond H. W.; Fan, Rong; Cornell, Timothy T.; Shanley, Thomas P.; Kurabayashi, Katsuo; Fu, Jianping

2015-01-01

An accurate measurement of the immune status in patients with immune system disorders is critical in evaluating the stage of diseases and tailoring drug treatments. The functional cellular immunity test is a promising method to establish the diagnosis of immune dysfunctions. The conventional functional cellular immunity test involves measurements of the capacity of peripheral blood mononuclear cells to produce pro-inflammatory cytokines when stimulated ex vivo. However, this “bulk” assay measures the overall reactivity of a population of lymphocytes and monocytes, making it difficult to pinpoint the phenotype or real identity of the reactive immune cells involved. In this research, we develop a large surface micromachined polydimethylsiloxane (PDMS) microfiltration membrane (PMM) with high porosity, which is integrated in a microfluidic microfiltration platform. Using the PMM with functionalized microbeads conjugated with antibodies against specific cell surface proteins, we demonstrated rapid, efficient and high-throughput on-chip isolation, enrichment, and stimulation of subpopulations of immune cells from blood specimens. Furthermore, the PMM-integrated microfiltration platform, coupled with a no-wash homogeneous chemiluminescence assay (“AlphaLISA”), enables us to demonstrate rapid and sensitive on-chip immunophenotyping assays for subpopulations of immune cells isolated directly from minute quantities of blood samples. PMID:23335389

Improved Electromechanical Infrared Sensor

NASA Technical Reports Server (NTRS)

Kenny, Thomas W.; Kaiser, William J.

1994-01-01

Proposed electromechanical infrared detector improved version of device described in "Micromachined Electron-Tunneling Infrared Detectors" (NPO-18413). Fabrication easier, and undesired sensitivity to acceleration reduced. In devices, diaphragms and other components made of micromachined silicon, and displacements of diaphragms measured by electron tunneling displacement transducer {see "Micromachined Tunneling Accelerometer" (NPO-18513)}. Improved version offers enhanced frequency response and less spurious response to acceleration.

Wideband Feedback Circuit For Tunneling Sensor

NASA Technical Reports Server (NTRS)

Kaiser, William J.; Kenny, Thomas W.; Rockstad, Howard K.; Reynolds, Joseph K.

1994-01-01

Improved feedback circuit designed for use in controlling tunneling displacement transducer. Features include stability and nearly flat frequency response up to 50 kHz. Transducer could be that in scanning tunneling microscope, or any of micromachined electromechanical transducers described in "Micromachined Electron-Tunneling Infrared Detectors" (NPO-18413), "Micromachined Tunneling Accelerometer" (NPO-18513), and "Improved Electromechanical Infrared Sensor" (NPO-18560).

Microscale out-of-plane anemometer

NASA Technical Reports Server (NTRS)

Liu, Chang (Inventor); Chen, Jack (Inventor)

2005-01-01

A microscale out-of-plane thermal sensor. A resistive heater is suspended over a substrate by supports raised with respect to the substrate to provide a clearance underneath the resistive heater for fluid flow. A preferred fabrication process for the thermal sensor uses surface micromachining and a three-dimensional assembly to raise the supports and lift the resistive heater over the substrate.

Laser Micromachining Fabrication of THz Components

NASA Technical Reports Server (NTRS)

DrouetdAubigny, C.; Walker, C.; Jones, B.; Groppi, C.; Papapolymerou, J.; Tavenier, C.

2001-01-01

Laser micromachining techniques can be used to fabricate high-quality waveguide structures and quasi-optical components to micrometer accuracies. Successful GHz designs can be directly scaled to THz frequencies. We expect this promising technology to allow the construction of the first fully integrated THz heterodyne imaging arrays. At the University of Arizona, construction of the first laser micromachining system designed for THz waveguide components fabrication has been completed. Once tested and characterized our system will be used to construct prototype THz lx4 focal plane mixer arrays, magic tees, AR coated silicon lenses, local oscillator source phase gratings, filters and more. Our system can micro-machine structures down to a few microns accuracy and up to 6 inches across in a short time. This paper discusses the design and performance of our micromachining system, and illustrates the type, range and performance of components this exciting new technology will make accessible to the THz community.

Development of a wavelength tunable filter using MEMS technology

NASA Astrophysics Data System (ADS)

Liu, Junting

Microelectromechanical systems (MEMS) for optical applications have received intensive attention in recent years because of their potential applications in optical telecommunication. Traditional wavelength division multiplexing (WDM) offers high capacity but requires the fabrication of selective add-drop filters. MEMS technology offers an effective way to fabricate these components at low cost. This thesis presents the development of a device that tunes the Bragg wavelength by coupling into the evanescent field of the grating. A Bragg grating is a periodic perturbation of the refractive index along a fiber or a periodic perturbation of the structure of a planar waveguide. The Bragg wavelength can be tuned by changing the degree to which a dielectric slab couples into the evanescent field. The result is a change in the effective index of the grating, and thus a change in the wavelength that which it reflects. In this thesis Bragg gratings were successfully written into an optical fiber using phase mask technique. Mechanical polishing was used to side-polish the fiber and remove cladding to expose the core. Grating structures were also fabricated in planar waveguide using E-beam writing and dry etching. In order to achieve the smoothest possible morphology of the waveguide, plasma dry etching of transparent substrates was studied in great detail. It is found that the pre-etch cleaning procedure greatly influences the ability to obtain a smooth etched surface. Upper limits of evanescent field tuning were investigated by applying different index liquids such as D. I. water and index matching oils or by positioning different dielectric materials such as glass and silicon close to the grating. Planar waveguides were found to be more sensitive to effective index change. Two kinds of computer simulation were carried out to understand the mode profile and to estimate the value of effective index of planar waveguide under "dry" and "wet" conditions. The first one used an average depth of grating approximation. The second explicitly considered the corrugated structure of the waveguide. Results of both simulations were compared with the experimental results in order to find the proper simulation approach. The fiber or planar waveguide gratings were "device" integrated and their pro and cons were compared. Devices using an optical fiber employed a microactuator driven by electrothermal vibromotor to change the degree of coupling between fiber and "tuning block". Device using planar waveguides used an electrostatic force actuated membrane, flip-chip mounted atop the waveguide. All devices were fabricated using polysilicon surface micromachining processes. I concluded that devices driven by electrostatic force were easier to actuate and their integration with waveguide less challenging.

Caracterisation electrique et vieillissement de resistances de silicium polycristallin modifiees par laser

NASA Astrophysics Data System (ADS)

Fantoni, Julie

2011-12-01

Several classes of integrated microelectronic circuits require highly precise and stable analog components that cannot be obtained directly through standard CMOS fabrication processes. Those components must thus be calibrated either by a modification of the fabrication process or by the application of a post-fabrication tuning procedure. Many successful post-fabrication tuning processes have been introduced in the field of resistor calibration, including resistor laser trimming which is the core subject of this thesis. In this thesis, trimmed components are standard CMOS 180nm technology polysilicon resistors, integrated in circuits specially designed to allow laser intervention on their surface. The laser used is a nanosecond pulsed laser for which the fluence is set below the melting threshold of polysilicon in order to prevent damage to the material structure. This novel low-power highly localized procedure reduces the risk of damaging sensitive surrounding circuits and requires no additional fabrication step, allowing smaller dies areas and reduced costs. Precise, reliable and reproducible devices have been tuned using this technique with a precision below 500 ppm. The main objective of this research is to study and analyze the effect of the laser parameters variation on the trimmed component properties and to optimize those parameters in regard of the desired precision and stability of the final product. Raman spectroscopic measurements are performed to observe and characterize structural modifications of the polysilicon material following laser irradiation as precise resistance measurements and standardized in-oven aging tests allow the complete characterization of the device in regard of precision and stability. It is shown that for a given precision, this novel low-power trimming technique produces devices with a stability comparable to those obtained with another trimming technology such as the pulsed current method. An electrical model is also developed to predict the resistance modification with the laser fluence, the number of pulses as well as the duration of those pulses. The model is shown to be 1 500 ppm accurate when laser fluence is set accordingly to the melting threshold of polysilicon. Concerning stability, results show that, following a 300 h, 150 °C aging procedure, laser trimmed components present a 1.2% resistance drift from their initial resistance value whereas a 0.7% drift is observed on untrimmed samples. Those results are comparable to those obtained with the pulsed current trimming technique which produces trimmed component with a 1% resistance drift following a 200 h 162 °C aging procedure. Recommendations are given in the conclusion as to which laser parameters to modify and how to modify them in order to produce the desired trimmed devices with the best performance possible.

Micromachined fragment capturer for biomedical applications.

PubMed

Choi, Young-Soo; Lee, Dong-Weon

2011-11-01

Due to changes in modern diet, a form of heart disease called chronic total occlusion has become a serious disease to be treated as an emergency. In this study, we propose a micromachined capturer that is designed and fabricated to collect plaque fragments generated during surgery to remove the thrombus. The fragment capturer consists of a plastic body made by rapid prototyping, SU-8 mesh structures using MEMS techniques, and ionic polymer metal composite (IPMC) actuators. An array of IPMC actuators combined with the SU-8 net structure was optimized to effectively collect plaque fragments. The evaporation of solvent through the actuator's surface was prevented using a coating of SU-8 and polydimethylsiloxane thin film on the actuator. This approach improved the available operating time of the IPMC, which primarily depends on solvent loss. Our preliminary results demonstrate the possibility of using the capturer for biomedical applications. © 2011 American Institute of Physics

Fabrication of a novel quartz micromachined gyroscope

NASA Astrophysics Data System (ADS)

Xie, Liqiang; Xing, Jianchun; Wang, Haoxu; Wu, Xuezhong

2015-04-01

A novel quartz micromachined gyroscope is proposed in this paper. The novel gyroscope is realized by quartz anisotropic wet etching and 3-dimensional electrodes deposition. In the quartz wet etching process, the quality of Cr/Au mask films affecting the process are studied by experiment. An excellent mask film with 100 Å Cr and 2000 Å Au is achieved by optimization of experimental parameters. Crystal facets after etching seriously affect the following sidewall electrodes deposition process and the structure's mechanical behaviours. Removal of crystal facets is successfully implemented by increasing etching time based on etching rate ratios between facets and crystal planes. In the electrodes deposition process, an aperture mask evaporation method is employed to prepare electrodes on 3-dimensional surfaces of the gyroscope structure. The alignments among the aperture masks are realized by the ABM™ Mask Aligner System. Based on the processes described above, a z-axis quartz gyroscope is fabricated successfully.

Surface-micromachined and high-aspect ratio electrostatic actuators for aeronautic and space applications: design and lifetime considerations

NASA Astrophysics Data System (ADS)

Vescovo, P.; Joseph, E.; Bourbon, G.; Le Moal, P.; Minotti, P.; Hibert, C.; Pont, G.

2003-09-01

This paper focuses on recent advances in the field of MEMS-based actuators and distributed microelectromechanical systems (MEMS). IC-processed actuators (e.g. actuators that are machined using integrated circuit batch processes) are expected to open a wide range of industrial applications on the near term. The most promising investigations deal with high-aspect ratio electric field driven microactuators suitable for use in numerous technical fields such as aeronautics and space industry. Because the silicon micromachining technology have the potential to integrate both mechanical components and control circuits within a single process, MEMS-based active control of microscopic and macroscopic structures appears to be one of the most promising challenges for the next decade. As a first step towards new generations of MEMS-based smart structures, recent investigations dealing with silicon mechanisms involving MEMS-based actuators are briefly discussed in this paper.

Micromachined ultrasonic transducers: 11.4 MHz transmission in air and more

NASA Astrophysics Data System (ADS)

Ladabaum, Igal; Khuri-Yakub, B. T.; Spoliansky, Dimitri

1996-01-01

The fabrication and modeling of novel, capacitive, ultrasonic air transducers is reported. Transmission experiments in air at 11.4, 9.2, and 3.1 MHz are shown to correspond with theory. The transducers are made using surface micromachining techniques, which enable the realization of center frequencies ranging from 1.8 to 11.6 MHz. The bandwidth of the transducers ranges from 5% to 20%, depending on processing parameters. Custom circuitry is able to detect 10 MHz capacitance fluctuations as small as 10-18 F, which correspond to displacements on the order of 10-3 Å, in a bandwidth of 2 MHz with a signal to noise ratio of 20 dB. Such detection sensitivity is shown to yield air transducer systems capable of withstanding over 100 dB of signal attenuation, a figure of merit that has significant implications for ultrasonic imaging, nondestructive evaluation, gas flow and composition measurements, and range sensing.

A 5 meter range non-planar CMUT array for Automotive Collision Avoidance

NASA Astrophysics Data System (ADS)

Hernandez Aguirre, Jonathan

A discretized hyperbolic paraboloid geometry capacitive micromachined ultrasonic transducer (CMUT) array has been designed and fabricated for automotive collision avoidance. The array is designed to operate at 40 kHz, beamwidth of 40° with a maximum sidelobe intensity of -10dB. An SOI based fabrication technology has been used for the 5x5 array with 5 sensing surfaces along each x and y axis and 7 elevation levels. An assembly and packaging technique has been developed to realize the non-planar geometry in a PGA-68 package. A highly accurate mathematical method has been presented for analytical characterization of capacitive micromachined ultrasonic transducers (CMUTs) built with square diaphragms. The method uses a new two-dimensional polynomial function to more accurately predict the deflection curve of a multilayer square diaphragm subject to both mechanical and electrostatic pressure and a new capacitance model that takes into account the contribution of the fringing field capacitances.

Silicon based multilayer photoelectrodes for photoelectrolysis of water to produce hydrogen from the sun

NASA Astrophysics Data System (ADS)

Faruque, Faisal

The main objective of this work is to study different materials for the direct photosynthesis of hydrogen from water. A variety of photocatalysts such as titanium dioxide, titanium oxy-nitride, silicon carbide, and gallium nitride are being investigated by others for the clean production of hydrogen for fuel cells and hydrogen economy. Our approach was to deposit suitable metallic regions on photocatalyst nanoparticles to direct the efficient synthesis of hydrogen to a particular site for convenient collection. We studied different electrode metals such as gold, platinum, titanium, palladium, and tungsten. We also studied different solar cell materials such as silicon (p- and n-types), silicon carbide and titanium dioxide semiconductors in order to efficiently generate electrons under illumination. We introduced a novel silicon-based multilayer photosynthesis device to take advantage of suitable properties of silicon and tungsten to efficiently produce hydrogen. The device consisted of a silicon (0.5mm) substrate, a deposited atomic layer of Al2O 3 (1nm), a doped polysilicon (0.1microm), and finally a tungsten nanoporous (5-10nm) layer acting as an interface electrode with water. The Al2O 3 layer was introduced to reduce leakage current and to prevent the spreading of the diffused p-n junction layer between the silicon and doped polysilicon layers. The surface of the photoelectrode was coated with nanotextured tungsten nanopores (TNP), which increased the surface area of the electrodes to the electrolyte, assisting in electron-hole mobility, and acting as a photocatalyst. The reported device exhibited a fill factor (%FF) of 27.22% and solar-to-hydrogen conversion efficiency of 0.03174%. This thesis describes the structures of the device, and offers a characterization and comparison between different photoelectrodes.

Low-loss LIGA-micromachined conductor-backed coplanar waveguide.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Forman, Michael A.

2004-12-01

A mesoscale low-loss LIGA-micromachined conductor-backed coplanar waveguide is presented. The 517 {micro}m lines are the tallest uniplanar LIGA-fabricated microwave transmission lines to date, as well as the first to be constructed of copper rather than nickel. The conductor-backed micromachined CPW on quartz achieves a measured attenuation of 0.064 dB/cm at 15.5 GHz.

Micro-machined thermo-conductivity detector

DOEpatents

Yu, Conrad

2003-01-01

A micro-machined thermal conductivity detector for a portable gas chromatograph. The detector is highly sensitive and has fast response time to enable detection of the small size gas samples in a portable gas chromatograph which are in the order of nanoliters. The high sensitivity and fast response time are achieved through micro-machined devices composed of a nickel wire, for example, on a silicon nitride window formed in a silicon member and about a millimeter square in size. In addition to operating as a thermal conductivity detector, the silicon nitride window with a micro-machined wire therein of the device can be utilized for a fast response heater for PCR applications.

Rough surface adhesion in the presence of capillary condensation

DOE PAGES

DelRio, Frank W.; Dunn, Martin L.; Phinney, Leslie M.; ...

2007-04-17

Capillary condensation of water can have a significant effect on rough surface adhesion. Here, to explore this phenomenon between micromachined surfaces, the authors perform microcantilever experiments as a function of surface roughness and relative humidity (RH). Below a threshold RH, the adhesion is mainly due to van der Waals forces across extensive noncontacting areas. Above the threshold RH, the adhesion jumps due to capillary condensation and increases towards the upper limit of Γ=144mJ/m 2. Lastly, a detailed model based on the measured surface topography qualitatively agrees with the experimental data only when the topographic correlations between the upper and lowermore » surfaces are considered.« less

Residual strain effects on large aspect ratio micro-diaphragms

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hijab, R.S.; Muller, R.S.

1988-09-30

Highly compliant, large aspect ratio diaphragms for use in low-pressure, capacitive-readout sensors, have been investigated. In such structures, unrelaxed strain in the diaphragms can radically alter mechanical behavior. Although strain can be reduced by thermal annealing, it usually reaches a remnant irreducible minimum. The purpose of this paper is to describe techniques that result in low-strain materials and that reduce the effects of residual strain in micro-diaphragms. Square polysilicon grilles and perforated diaphragms made from both single and double polysilicon layers and from single-crystal silicon, with aspect ratios (side/thickness) of up to 1000 and very low compressive strain ({approx}6 {times}more » 10{sup {minus}5}), have been fabricated. Strain reduction is achieved by combining thermal annealing with one of two mechanical design techniques. The first technique makes use of a series of cantilever beams to support the diaphragms. In a second procedure, corrugated surfaces in thinned membranes of single-crystal silicon are formed. The corrugations result from the use of boron doping and anisotropic silicon etching. In both of these techniques to produce low-strain diaphragms, an etched cavity is purposely formed in the substrate crystal below them. Only one-sided processing of wafers is employed, thus aiding reproducibility and providing ease of compatibility with an MOS process. A fast-etching sacrificial-support layer (phosphorus-doped CVD oxide) is used. 4 refs., 10 figs.« less

Synthesis of Poly-Silicon Thin Films on Glass Substrate Using Laser Initiated Metal Induced Crystallization of Amorphous Silicon for Space Power Application

NASA Technical Reports Server (NTRS)

Abu-Safe, Husam H.; Naseem, Hameed A.; Brown, William D.

2007-01-01

Poly-silicon thin films on glass substrates are synthesized using laser initiated metal induced crystallization of hydrogenated amorphous silicon films. These films can be used to fabricate solar cells on low cost glass and flexible substrates. The process starts by depositing 200 nm amorphous silicon films on the glass substrates. Following this, 200 nm of sputtered aluminum films were deposited on top of the silicon layers. The samples are irradiated with an argon ion cw laser beam for annealing. Laser power densities ranging from 4 to 9 W/cm2 were used in the annealing process. Each area on the sample is irradiated for a different exposure time. Optical microscopy was used to examine any cracks in the films and loss of adhesion to the substrates. X-Ray diffraction patterns from the initial results indicated the crystallization in the films. Scanning electron microscopy shows dendritic growth. The composition analysis of the crystallized films was conducted using Energy Dispersive x-ray Spectroscopy. The results of poly-silicon films synthesis on space qualified flexible substrates such as Kapton are also presented.

Evolution of titanium residue on the walls of a plasma-etching reactor and its effect on the polysilicon etching rate

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hirota, Kosa, E-mail: hirota-kousa@sme.hitachi-hitec.com; Itabashi, Naoshi; Tanaka, Junichi

2014-11-01

The variation in polysilicon plasma etching rates caused by Ti residue on the reactor walls was investigated. The amount of Ti residue was measured using attenuated total reflection Fourier transform infrared spectroscopy with the HgCdTe (MCT) detector installed on the side of the reactor. As the amount of Ti residue increased, the number of fluorine radicals and the polysilicon etching rate increased. However, a maximum limit in the etching rate was observed. A mechanism of rate variation was proposed, whereby F radical consumption on the quartz reactor wall is suppressed by the Ti residue. The authors also investigated a plasma-cleaningmore » method for the removal of Ti residue without using a BCl{sub 3} gas, because the reaction products (e.g., boron oxide) on the reactor walls frequently cause contamination of the product wafers during etching. CH-assisted chlorine cleaning, which is a combination of CHF{sub 3} and Cl{sub 2} plasma treatment, was found to effectively remove Ti residue from the reactor walls. This result shows that CH radicals play an important role in deoxidizing and/or defluorinating Ti residue on the reactor walls.« less

Hybrid Micro-Electro-Mechanical Tunable Filter

DTIC Science & Technology

2007-09-01

Figure 2.10), one can see the developers have used surface micromachining techniques to build the micromirror structure over the CMOS addressing...DBRs, microcavity composition, initial air gap, contact layers, substrate Dispersion Data Curve -fit dispersion data or generate dispersion function...measurements • Curve -fit the dispersion data or generate a continuous, wavelength-dependent, representation of material dispersion • Manually design the

Design and simulation of a tactile display based on a CMUT array

NASA Astrophysics Data System (ADS)

Chouvardas, Vasilios G.; Hatalis, Miltiadis K.; Miliou, Amalia N.

2012-10-01

In this article, we present the design of a tactile display based on a CMUT-phased array. The array implements a 'pixel' of the display and is used to focus airborne ultrasound energy on the skin surface. The pressure field, generated by the focused ultrasound waves, is used to excite the mechanoreceptors under the skin and transmit tactile information. The results of Finite Element Analysis (FEA) of the Capacitive Micromachined Ultrasonic Transducer (CMUT) and the CMUT-phased array for ultrasound emission are presented. The 3D models of the device and the array were developed using a commercial FEA package. Modelling and simulations were performed using the parameters from the POLYMUMPS surface micromachining technology from MEMSCAP. During the analysis of the phased array, several parameters were studied in order to determine their importance in the design of the tactile display. The output of the array is compared with the acoustic intensity thresholds in order to prove the feasibility of the design. Taking into account the density of the mechanoreceptors in the skin, we conclude that there should be at least one receptor under the excitation area formed on the skin.

Freeze-tolerant condenser for a closed-loop heat-transfer system

NASA Technical Reports Server (NTRS)

Crowley, Christopher J. (Inventor); Elkouh, Nabil A. (Inventor)

2002-01-01

A freeze tolerant condenser (106) for a two-phase heat transfer system is disclosed. The condenser includes an enclosure (110) and a porous artery (112) located within and extending along the length of the enclosure. A vapor space (116) is defined between the enclosure and the artery, and a liquid space (114) is defined by a central passageway within the artery. The artery includes a plurality of laser-micromachined capillaries (130) extending from the outer surface of the artery to its inner surface such that the vapor space is in fluid communication with the liquid space. In one embodiment of the invention, the capillaries (130) are cylindrical holes having a diameter of no greater than 50 microns. In another embodiment, the capillaries (130') are slots having widths of no greater than 50 microns. A method of making an artery in accordance with the present invention is also disclosed. The method includes providing a solid-walled tube and laser-micromachining a plurality of capillaries into the tube along a longitudinal axis, wherein each capillary has at least one cross-sectional dimension transverse to the longitudinal axis of less than 50 microns.

Linkage design effect on the reliability of surface-micromachined microengines driving a load

NASA Astrophysics Data System (ADS)

Tanner, Danelle M.; Peterson, Kenneth A.; Irwin, Lloyd W.; Tangyunyong, Paiboon; Miller, William M.; Eaton, William P.; Smith, Norman F.; Rodgers, M. Steven

1998-09-01

The reliability of microengines is a function of the design of the mechanical linkage used to connect the electrostatic actuator to the drive. We have completed a series of reliability stress tests on surface micromachined microengines driving an inertial load. In these experiments, we used microengines that had pin mechanisms with guides connecting the drive arms to the electrostatic actuators. Comparing this data to previous results using flexure linkages revealed that the pin linkage design was less reliable. The devices were stressed to failure at eight frequencies, both above and below the measured resonance frequency of the microengine. Significant amounts of wear debris were observed both around the hub and pin joint of the drive gear. Additionally, wear tracks were observed in the area where the moving shuttle rubbed against the guides of the pin linkage. At each frequency, we analyzed the statistical data yielding a lifetime (t50) for median cycles to failure and (sigma) , the shape parameter of the distribution. A model was developed to describe the failure data based on fundamental wear mechanisms and forces exhibited in mechanical resonant systems. The comparison to the model will be discussed.

A micro-machined piezoelectric flexural-mode hydrophone with air backing: a hydrostatic pressure-balancing mechanism for integrity preservation.

PubMed

Choi, Sungjoon; Lee, Haksue; Moon, Wonkyu

2010-09-01

Although an air-backed thin plate is an effective sound receiver structure, it is easily damaged via pressure unbalance caused by external hydrostatic pressure. To overcome this difficulty, a simple pressure-balancing module is proposed. Despite its small size and relative simplicity, with proper design and operation, micro-channel structure provides a solution to the pressure-balancing problem. If the channel size is sufficiently small, the gas-liquid interface may move back and forth without breach by the hydrostatic pressure since the surface tension can retain the interface surface continuously. One input port of the device is opened to an intermediate liquid, while the other port is connected to the air-backing chamber. As the hydrostatic pressure increases, the liquid in the micro-channel compresses the air, and the pressure in the backing chamber is then equalized to match the external hydrostatic pressure. To validate the performance of the proposed mechanism, a micro-channel prototype is designed and integrated with the piezoelectric micro-machined flexural sensor developed in our previous work. The working principle of the mechanism is experimentally verified. In addition, the effect of hydrostatic pressure on receiving sensitivity is evaluated and compared with predicted behavior.

Differential surface stress sensor for detection of chemical and biological species

NASA Astrophysics Data System (ADS)

Kang, K.; Nilsen-Hamilton, M.; Shrotriya, P.

2008-10-01

We report a sensor consisting of two micromachined cantilevers (a sensing/reference pair) that is suitable for detection of chemical and biological species. The sensing strategy involves coating the sensing cantilever with receptors that have high affinities for the analyte. The presence of analyte is detected by determining the differential surface stress associated with its adsorption/absorption to the sensing cantilever. An interferometric technique is utilized to measure the differential bending of the sensing cantilever with respect to reference. Surface stress associated with hybridization of single stranded DNA is measured to demonstrate the unique advantages of the sensor.

Etching characteristics of Si{110} in 20 wt% KOH with addition of hydroxylamine for the fabrication of bulk micromachined MEMS

NASA Astrophysics Data System (ADS)

Rao, A. V. Narasimha; Swarnalatha, V.; Pal, P.

2017-12-01

Anisotropic wet etching is a most widely employed for the fabrication of MEMS/NEMS structures using silicon bulk micromachining. The use of Si{110} in MEMS is inevitable when a microstructure with vertical sidewall is to be fabricated using wet anisotropic etching. In most commonly employed etchants (i.e. TMAH and KOH), potassium hydroxide (KOH) exhibits higher etch rate and provides improved anisotropy between Si{111} and Si{110} planes. In the manufacturing company, high etch rate is demanded to increase the productivity that eventually reduces the cost of end product. In order to modify the etching characteristics of KOH for the micromachining of Si{110}, we have investigated the effect of hydroxylamine (NH2OH) in 20 wt% KOH solution. The concentration of NH2OH is varied from 0 to 20% and the etching is carried out at 75 °C. The etching characteristics which are studied in this work includes the etch rates of Si{110} and silicon dioxide, etched surface morphology, and undercutting at convex corners. The etch rate of Si{110} in 20 wt% KOH + 15% NH2OH solution is measured to be four times more than that of pure 20 wt% KOH. Moreover, the addition of NH2OH increases the undercutting at convex corners and enhances the etch selectivity between Si and SiO2.

Silicon Micromachining for Terahertz Component Development

NASA Technical Reports Server (NTRS)

Chattopadhyay, Goutam; Reck, Theodore J.; Jung-Kubiak, Cecile; Siles, Jose V.; Lee, Choonsup; Lin, Robert; Mehdi, Imran

2013-01-01

Waveguide component technology at terahertz frequencies has come of age in recent years. Essential components such as ortho-mode transducers (OMT), quadrature hybrids, filters, and others for high performance system development were either impossible to build or too difficult to fabricate with traditional machining techniques. With micromachining of silicon wafers coated with sputtered gold it is now possible to fabricate and test these waveguide components. Using a highly optimized Deep Reactive Ion Etching (DRIE) process, we are now able to fabricate silicon micromachined waveguide structures working beyond 1 THz. In this paper, we describe in detail our approach of design, fabrication, and measurement of silicon micromachined waveguide components and report the results of a 1 THz canonical E-plane filter.

Micromachined evaporators for AMTEC cells

DOE Office of Scientific and Technical Information (OSTI.GOV)

Izenson, M.G.; Crowley, C.J.

1996-12-31

To achieve high cell efficiency and reliability, the capillary pumping system for Alkali Metal Thermal to Electric Conversion (AMTEC) must have three key characteristics: (1) very small pores to achieve a high capillary pumping head, (2) high permeability for the flow of liquid sodium to minimize internal losses, and (3) be made from a material that is exceptionally stable at high temperatures in a sodium environment. The authors have developed micromachining techniques to manufacture high performance evaporators for AMTEC cells. The evaporators have been fabricated from stainless steel, molybdenum, and a niobium alloy (Nb-1Zr). The regular, micromachined structure leads tomore » very high capillary pumping head with high permeability for liquid flow. Data from tests performed with common fluids at room temperature characterize the capillary pumping head and permeability of these structures. Three micromachined evaporators have been built into AMTEC cells and operated at temperatures up to 1,100 K. Results from these tests confirm the excellent pumping capabilities of the micromachined evaporators.« less

Method and apparatus for precision laser micromachining

DOEpatents

Chang, Jim; Warner, Bruce E.; Dragon, Ernest P.

2000-05-02

A method and apparatus for micromachining and microdrilling which results in a machined part of superior surface quality is provided. The system uses a near diffraction limited, high repetition rate, short pulse length, visible wavelength laser. The laser is combined with a high speed precision tilting mirror and suitable beam shaping optics, thus allowing a large amount of energy to be accurately positioned and scanned on the workpiece. As a result of this system, complicated, high resolution machining patterns can be achieved. A cover plate may be temporarily attached to the workpiece. Then as the workpiece material is vaporized during the machining process, the vapors condense on the cover plate rather than the surface of the workpiece. In order to eliminate cutting rate variations as the cutting direction is varied, a randomly polarized laser beam is utilized. A rotating half-wave plate is used to achieve the random polarization. In order to correctly locate the focus at the desired location within the workpiece, the position of the focus is first determined by monitoring the speckle size while varying the distance between the workpiece and the focussing optics. When the speckle size reaches a maximum, the focus is located at the first surface of the workpiece. After the location of the focus has been determined, it is repositioned to the desired location within the workpiece, thus optimizing the quality of the machined area.

Dual axis operation of a micromachined rate gyroscope

DOE Office of Scientific and Technical Information (OSTI.GOV)

Juneau, T.; Pisano, A.P.; Smith, J.

Since micromachining technology has raised the prospect of fabricating high performance sensors without the associated high cost and large size, many researchers have investigated micromachined rate gyroscopes. The vast majority of research has focused on single input axis rate gyroscopes, but this paper presents work on a dual input axis micromachined rate gyroscope. The key to successful simultaneous dual axis operation is the quad symmetry of the circular oscillating rotor design. Untuned gyroscopes with mismatched modes yielded random walk as low as 10{degrees}/{radical}hour with cross sensitivity ranging from 6% to 16%. Mode frequency matching via electrostatic tuning allowed performance bettermore » than 2{degrees}/{radical}hour, but at the expense of excessive cross sensitivity.« less

Surface and allied studies in silicon solar cells

NASA Technical Reports Server (NTRS)

Lindholm, F. A.

1984-01-01

Significant improvements were made in the short-circuit current-decay method of measuring the recombination lifetime tau and the back surface recombination velocity S of the quasineutral base of silicon solar cells. The improvements include a circuit implementation that increases the speed of switching from the forward-voltage to the short-circuit conditions. They also include a supplementation of this method by some newly developed techniques employing small-signal admittance as a function of frequency omega. This supplementation is highly effective for determining tau for cases in which the diffusion length L greatly exceeds the base thickness W. Representative results on different solar cells are reported. Some advances made in the understanding of passivation provided by the polysilicon/silicon heterojunction are outlined. Recent measurements demonstrate that S 10,000 cm/s derive from this method of passivation.

The Research about Preparation of High Purity Hexachlorodisilane

NASA Astrophysics Data System (ADS)

Wan, Ye; Zhao, Xiong; Yan, Dazhou; Zhao, Yu; Guo, Shuhu; Wang, Lei; Yang, Dian

2017-12-01

This article demonstrated a technology for producing high purity hexachlorodisilane what is one raw material of Semiconductor industry, which using the method of combination adsorption with rectification, whose material was from polysilicon residues of polysilicon company. This technology could remove most high boiling points chloro-silicane impurities and metal impurities effectively. The purity of Si2Cl6 produced by this technology can be up to 99.9%, the content of metal impurities can be low at 4ppb, which can meet the requirement of industy using completely. The technology extends the routes of Si2Cl6 in localization, having the advantages of simple process, continuous operation, and large capacity and so on.

Growth of carbon nanotubes by Fe-catalyzed chemical vapor processes on silicon-based substrates

NASA Astrophysics Data System (ADS)

Angelucci, Renato; Rizzoli, Rita; Vinciguerra, Vincenzo; Fortuna Bevilacqua, Maria; Guerri, Sergio; Corticelli, Franco; Passini, Mara

2007-03-01

In this paper, a site-selective catalytic chemical vapor deposition synthesis of carbon nanotubes on silicon-based substrates has been developed in order to get horizontally oriented nanotubes for field effect transistors and other electronic devices. Properly micro-fabricated silicon oxide and polysilicon structures have been used as substrates. Iron nanoparticles have been obtained both from a thin Fe film evaporated by e-gun and from iron nitrate solutions accurately dispersed on the substrates. Single-walled nanotubes with diameters as small as 1 nm, bridging polysilicon and silicon dioxide “pillars”, have been grown. The morphology and structure of CNTs have been characterized by SEM, AFM and Raman spectroscopy.

The laser micro-machining system for diamond anvil cell experiments and general precision machining applications at the High Pressure Collaborative Access Team

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hrubiak, Rostislav; Sinogeikin, Stanislav; Rod, Eric

We have designed and constructed a new system for micro-machining parts and sample assemblies used for diamond anvil cells and general user operations at the High Pressure Collaborative Access Team, sector 16 of the Advanced Photon Source. The new micro-machining system uses a pulsed laser of 400 ps pulse duration, ablating various materials without thermal melting, thus leaving a clean edge. With optics designed for a tight focus, the system can machine holes any size larger than 3 μm in diameter. Unlike a standard electrical discharge machining drill, the new laser system allows micro-machining of non-conductive materials such as: amorphousmore » boron and silicon carbide gaskets, diamond, oxides, and other materials including organic materials such as polyimide films (i.e., Kapton). An important feature of the new system is the use of gas-tight or gas-flow environmental chambers which allow the laser micro-machining to be done in a controlled (e.g., inert gas) atmosphere to prevent oxidation and other chemical reactions in air sensitive materials. The gas-tight workpiece enclosure is also useful for machining materials with known health risks (e.g., beryllium). Specialized control software with a graphical interface enables micro-machining of custom 2D and 3D shapes. The laser-machining system was designed in a Class 1 laser enclosure, i.e., it includes laser safety interlocks and computer controls and allows for routine operation. Though initially designed mainly for machining of the diamond anvil cell gaskets, the laser-machining system has since found many other micro-machining applications, several of which are presented here.« less

A batch process micromachined thermoelectric energy harvester: fabrication and characterization

NASA Astrophysics Data System (ADS)

Su, J.; Leonov, V.; Goedbloed, M.; van Andel, Y.; de Nooijer, M. C.; Elfrink, R.; Wang, Z.; Vullers, R. J. M.

2010-10-01

Micromachined thermopiles are considered as a cost-effective solution for energy harvesters working at a small temperature difference and weak heat flows typical for, e.g., the human body. They can be used for powering autonomous wireless sensor nodes in a body area network. In this paper, a micromachined thermoelectric energy harvester with 6 µm high polycrystalline silicon germanium (poly-SiGe) thermocouples fabricated on a 6 inch wafer is presented. An open circuit voltage of 1.49 V and an output power of 0.4 µW can be generated with 3.5 K temperature difference in a model of a wearable micromachined energy harvester of the discussed design, which has a die size of 1.0 mm × 2.5 mm inside a watch-size generator.

Micromachined Millimeter- and Submillimeter-Wave SIS Heterodyne Receivers for Remote Sensing

NASA Technical Reports Server (NTRS)

Hu, Qing

1998-01-01

A heterodyne mixer with a micromachined horn antenna and a superconductor -insulator-superconductor (SIS) tunnel junction as mixing element is tested in the W-band (75-115 GHz) frequency range. Micromachined integrated horn antennas consist of a dipole antenna suspended on a thin Si3N4 dielectric membrane inside a pyramidal cavity etched in silicon. The mixer performance is optimized by using a backing plane behind the dipole antenna to tune out the capacitance of the tunnel junction. The lowest receiver noise temperature of 30+/-3 K without any correction) is measured at 106 GHz with a 3-dB bandwidth of 8 GHz. This sensitivity is comparable to the state-of-the-art waveguide and quasi-optical SIS receivers, showing the potential use of micromachined horn antennas in imaging arrays.

Optical wireless communications for micromachines

NASA Astrophysics Data System (ADS)

O'Brien, Dominic C.; Yuan, Wei Wen; Liu, Jing Jing; Faulkner, Grahame E.; Elston, Steve J.; Collins, Steve; Parry-Jones, Lesley A.

2006-08-01

A key challenge for wireless sensor networks is minimizing the energy required for network nodes to communicate with each other, and this becomes acute for self-powered devices such as 'smart dust'. Optical communications is a potentially attractive solution for such devices. The University of Oxford is currently involved in a project to build optical wireless links to smart dust. Retro-reflectors combined with liquid crystal modulators can be integrated with the micro-machine to create a low power transceiver. When illuminated from a base station a modulated beam is returned, transmitting data. Data from the base station can be transmitted using modulation of the illuminating beam and a receiver at the micro-machine. In this paper we outline the energy consumption and link budget considerations in the design of such micro-machines, and report preliminary experimental results.

New methodology to baseline and match AME polysilicon etcher using advanced diagnostic tools

NASA Astrophysics Data System (ADS)

Poppe, James; Shipman, John; Reinhardt, Barbara E.; Roussel, Myriam; Hedgecock, Raymond; Fonda, Arturo

1999-09-01

As process controls tighten in the semiconductor industry, the need to understand the variables that determine system performance become more important. For plasma etch systems, process success depends on the control of key parameters such as: vacuum integrity, pressure, gas flows, and RF power. It is imperative to baseline, monitor, and control these variables. This paper presents an overview of the methods and tools used by Motorola BMC fabrication facility to characterize an Applied Materials polysilicon etcher. Tool performance data obtained from our traditional measurement techniques are limited in their scope and do not provide a complete picture of the ultimate tool performance. Presently the BMC traditional characterization tools provide a snapshot of the static operation of the equipment under test (EUT); however, complete evaluation of the dynamic performance cannot be monitored without the aid of specialized diagnostic equipment. To provide us with a complete system baseline evaluation of the polysilicon etcher, three diagnostic tools were utilized: Lucas Labs Vacuum Diagnostic System, Residual Gas Analyzer, and the ENI Voltage/Impedance Probe. The diagnostic methodology used to baseline and match key parameters of qualified production equipment has had an immense impact on other equipment characterization in the facility. It has resulted in reduced cycle time for new equipment introduction as well.

Polysilicon Gate Enhancement of the Random Dopant Induced Threshold Voltage Fluctuations in Sub-100 nm MOSFET's with Ultrathin Gate Oxide

NASA Technical Reports Server (NTRS)

Asenov, Asen; Saini, Subhash

2000-01-01

In this paper, we investigate various aspects of the polysilicon gate influence on the random dopant induced threshold voltage fluctuations in sub-100 nm MOSFET's with ultrathin gate oxides. The study is done by using an efficient statistical three-dimensional (3-D) "atomistic" simulation technique described else-where. MOSFET's with uniform channel doping and with low doped epitaxial channels have been investigated. The simulations reveal that even in devices with a single crystal gate the gate depletion and the random dopants in it are responsible for a substantial fraction of the threshold voltage fluctuations when the gate oxide is scaled-in the range of 1-2 nm. Simulation experiments have been used in order to separate the enhancement in the threshold voltage fluctuations due to an effective increase in the oxide thickness associated with the gate depletion from the direct influence of the random dopants in the gate depletion layer. The results of the experiments show that the both factors contribute to the enhancement of the threshold voltage fluctuations, but the effective increase in the oxide-thickness has a dominant effect in the investigated range of devices. Simulations illustrating the effect or the polysilicon grain boundaries on the threshold voltage variation are also presented.

Silicon micromachined vibrating gyroscopes

NASA Astrophysics Data System (ADS)

Voss, Ralf

1997-09-01

This work gives an overview of silicon micromachined vibrating gyroscopes. Market perspectives and fields of application are pointed out. The advantage of using silicon micromachining is discussed and estimations of the desired performance, especially for automobiles are given. The general principle of vibrating gyroscopes is explained. Vibrating silicon gyroscopes can be divided into seven classes. for each class the characteristic principle is presented and examples are given. Finally a specific sensor, based on a tuning fork for automotive applications with a sensitivity of 250(mu) V/degrees is described in detail.

Microfabricated cylindrical ion trap

DOEpatents

Blain, Matthew G.

2005-03-22

A microscale cylindrical ion trap, having an inner radius of order one micron, can be fabricated using surface micromachining techniques and materials known to the integrated circuits manufacturing and microelectromechanical systems industries. Micromachining methods enable batch fabrication, reduced manufacturing costs, dimensional and positional precision, and monolithic integration of massive arrays of ion traps with microscale ion generation and detection devices. Massive arraying enables the microscale cylindrical ion trap to retain the resolution, sensitivity, and mass range advantages necessary for high chemical selectivity. The microscale CIT has a reduced ion mean free path, allowing operation at higher pressures with less expensive and less bulky vacuum pumping system, and with lower battery power than conventional- and miniature-sized ion traps. The reduced electrode voltage enables integration of the microscale cylindrical ion trap with on-chip integrated circuit-based rf operation and detection electronics (i.e., cell phone electronics). Therefore, the full performance advantages of microscale cylindrical ion traps can be realized in truly field portable, handheld microanalysis systems.

Solid polymer electrolyte composite membrane comprising laser micromachined porous support

DOEpatents

Liu, Han [Waltham, MA; LaConti, Anthony B [Lynnfield, MA; Mittelsteadt, Cortney K [Natick, MA; McCallum, Thomas J [Ashland, MA

2011-01-11

A solid polymer electrolyte composite membrane and method of manufacturing the same. According to one embodiment, the composite membrane comprises a rigid, non-electrically-conducting support, the support preferably being a sheet of polyimide having a thickness of about 7.5 to 15 microns. The support has a plurality of cylindrical pores extending perpendicularly between opposing top and bottom surfaces of the support. The pores, which preferably have a diameter of about 5 microns, are made by laser micromachining and preferably are arranged in a defined pattern, for example, with fewer pores located in areas of high membrane stress and more pores located in areas of low membrane stress. The pores are filled with a first solid polymer electrolyte, such as a perfluorosulfonic acid (PFSA) polymer. A second solid polymer electrolyte, which may be the same as or different than the first solid polymer electrolyte, may be deposited over the top and/or bottom of the first solid polymer electrolyte.

Frontside-micromachined planar piezoresistive vibration sensor: Evaluating performance in the low frequency test range

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zhang, Lan; Lu, Jian, E-mail: jian-lu@aist.go.jp; Takagi, Hideki

2014-01-15

Using a surface piezoresistor diffusion method and front-side only micromachining process, a planar piezoresistive vibration sensor was successfully developed with a simple structure, lower processing cost and fewer packaging difficulties. The vibration sensor had a large sector proof mass attached to a narrow flexure. Optimization of the boron diffusion piezoresistor placed on the edge of the narrow flexure greatly improved the sensitivity. Planar vibration sensors were fabricated and measured in order to analyze the effects of the sensor dimensions on performance, including the values of flexure width and the included angle of the sector. Sensitivities of fabricated planar sensors ofmore » 0.09–0.46 mV/V/g were measured up to a test frequency of 60 Hz. The sensor functioned at low voltages (<3 V) and currents (<1 mA) with a high sensitivity and low drift. At low background noise levels, the sensor had performance comparable to a commercial device.« less

Advanced RF Front End Technology

NASA Technical Reports Server (NTRS)

Herman, M. I.; Valas, S.; Katehi, L. P. B.

2001-01-01

The ability to achieve low-mass low-cost micro/nanospacecraft for Deep Space exploration requires extensive miniaturization of all subsystems. The front end of the Telecommunication subsystem is an area in which major mass (factor of 10) and volume (factor of 100) reduction can be achieved via the development of new silicon based micromachined technology and devices. Major components that make up the front end include single-pole and double-throw switches, diplexer, and solid state power amplifier. JPL's Center For Space Microsystems - System On A Chip (SOAC) Program has addressed the challenges of front end miniaturization (switches and diplexers). Our objectives were to develop the main components that comprise a communication front end and enable integration in a single module that we refer to as a 'cube'. In this paper we will provide the latest status of our Microelectromechanical System (MEMS) switches and surface micromachined filter development. Based on the significant progress achieved we can begin to provide guidelines of the proper system insertion for these emerging technologies. Additional information is contained in the original extended abstract.

Some aspects of precise laser machining - Part 2: Experimental

NASA Astrophysics Data System (ADS)

Grabowski, Marcin; Wyszynski, Dominik; Ostrowski, Robert

2018-05-01

The paper describes the role of laser beam polarization on quality of laser beam machined cutting tool edge. In micromachining the preparation of the cutting tools in play a key role on dimensional accuracy, sharpness and the quality of the cutting edges. In order to assure quality and dimensional accuracy of the cutting tool edge it is necessary to apply laser polarization control. In the research diode pumped Nd:YAG 532nm pulse laser was applied. Laser beam polarization used in the research was linear (horizontal, vertical). The goal of the carried out research was to describe impact of laser beam polarization on efficiency of the cutting process and quality of machined parts (edge, surface) made of polycrystalline diamond (PCD) and cubic boron nitride (cBN). Application of precise cutting tool in micromachining has significant impact on the minimum uncut chip thickness and quality of the parts. The research was carried within the INNOLOT program funded by the National Centre for Research and Development.

Three-dimensional polymer MEMS with functionalized carbon nanotubes by microstereolithography

NASA Astrophysics Data System (ADS)

Varadan, Vijay K.; Xie, Jining

2003-04-01

Microfabrication techniques such as bulk micromachining and surface micromachining currently employed to conceive MEMS are largely derived from the standard IC and microelectronics technology. Even though many MEMS devices with integrated electronics have been achieved by using the traditional micromachining techniques, some limitations have nevertheless to be underlined: 1) these techniques are very expensive and need specific installations as well as a cleanroom environment, 2) the materials that can be used up to now are restricted to silicon and metals, 3) the manufacture of 3D parts having curved surfaces or an important number of layers is not possible. Moreover, for some biological applications, the materials used for sensors must be compatible with human body and the actuators need to have high strain and displacement which the current silicon based MEMS do not provide. It is thus natural for the researchers to look for alternative methods such as Microstereolithography (MSL) to make 3D sensors and actuators using polymeric based materials. For MSL techniques to be successful as their silicon counterparts, one has to come up with multifunctional polymers with electrical properties comparable to silicon. These multifunctional polymers should not only have a high sensing capability but also a high strain and actuation performance. A novel UV-curable polymer uniformly bonded with functionalised nanotubes was synthesized via a modified three-step in-situ polymerization. Purified multi-walled nanotubes, gained from the microwave chemical vapor deposition method, were functionalised by oxidation. The UV curable polymer was prepared from toluene diisocyantae (TDI), functionalised nanotubes, and 2-hydroxyethyl methacrylate (HEMA). The chemical bonds between -NCO groups of TDI and -OH, -COOH groups of functionalised nanotubes help for conceiving polymeric based MEMS devices. A cost effective fabrication techniques was presented using Micro Stereo Lithography and an example of a micropump was also described. The wireless concept of the device has many applications including implanted medical delivery systems, chemical and biological instruments, fluid delivery in engines, pump coolants and refrigerants for local cooling of electronic components.

Three-dimensional polymer MEMS with functionalized carbon nanotubes by microstereolithography

NASA Astrophysics Data System (ADS)

Varadan, Vijay K.; Xie, Jining

2002-11-01

Microfabrication techniques such as bulk micromachining and surface micromachining currently employed to conceive MEMS are largely derived from the standard IC and microelectronics technology. Even though many MEMS devices with integrated electronics have been achieved by using the traditional micromachining techniques, some limitations have nevertheless to be underlined: 1) these techniques are very expensive and need specific installations as well as a cleanroom environment, 2) the materials that can be used up to now are restricted to silicon and metals, 3) the manufacture of 3D parts having curved surfaces or an important numberof layers is not possible. Moreover, for some biological applications, the materials used for sensors must be compatible with human body and the actuators need to have high strain and displacement which the current silicon based MEMS do not provide. It is thus natural for the researchers to 'look' for alternative methods such as Microstereolithography (MSL) to make 3D sensors and actuators using polymeric based materials. For MSL techniques to be successful as their silicon counterparts, one has to come up with multifunctional polyers with electrical properties comparable to silicon. These multifunctional polymers should not only have a high sensing capability but also a high strain and actuation performance. A novel UV-curable polymer uniformly bonded with functionalized nanotubes was synthesized via a modified three-step in-sity polumerization. Purified multi-walled nanotubes, gained from the microwave chemical vapor deposition method, were functionalized by oxidation. The UV curable polymer was prepared from toluene diisocyanate (TDI), functionalized nanotubes, and 2-hydroxyethyl methacrylate (HEMA). The chemical bonds between -NCO groups of TDI and -OH, -COOH groups of functionalized nanotubes help for conceiving polymeric based MEMS devices. A cost effective fabrication techniques was presented using Micro Stereo Lithography and an example of a micropump was also described. The wireless concept of the device has many applications including implanted medical delivery systems, chemical and biological instruments, fluid delivery engines, pump coolants and refrigerants for local cooling of electronic components.

Three-dimensional polymer MEMS with functionalized carbon nanotubes by microstereolithography

NASA Astrophysics Data System (ADS)

Varadan, Vijay K.; Xie, Jining

2003-01-01

Microfabrication techniques such as bulk micromachining and surface micromachining currently employed to conceive MEMS are largely derived from the standard IC and microelectronics technology. Even though many MEMS devices with integrated electronics have been achieved by using the traditional micromachining techniques, some limitations have nevertheless to be underlined: 1) these techniques are very expensive and need specific installations as well as a cleanroom environment, 2) the materials that can be used up to now are restricted to silicon and metals, 3) the manufacture of 3D parts having curved surfaces or an important number of layers is not possible. Moreover, for some biological applications, the materials used for sensors must be compatible with human body and the actuators need to have high strain and displacement which the current silicon based MEMS do not provide. It is thus natural for the researchers to look for alternative methods such as Microstereolithography (MSL) to make 3D sensors and actuators using polymeric based materials. For MSL techniques to be successful as their silicon counterparts, one has to come up with multifunctional polymers with electrical properties comparable to silicon. These multifunctional polymers should not only have a high sensing capability but also a high strain and actuation performance. A novel UV-curable polymer uniformly bonded with functionalized nanotubes was synthesized via a modified three-step in-situ polymerization. Purified multi-walled nanotubes, gained from the microwave chemical vapor deposition method, were functionalized by oxidation. The UV curable polymer was prepared from toluene diisocyanate (TDI), functionalized nanotubes, and 2 hydroxyethyl methacrylate (HEMA). The chemical bonds between NCO groups of TDI and OH, COOH groups of functionalized nanotubes help for conceiving polymeric based MEMS devices. A cost effective fabrication techniques was presented using Micro Stereo Lithography and an example of a micropump was also described. The wireless concept of the device has many applications including implanted medical delivery systems, chemical and biological instruments, fluid delivery in engines, pump coolants and refrigerants for local cooling of electronic components.

Microstereolithography for polymer-based based MEMS

NASA Astrophysics Data System (ADS)

Varadan, Vijay K.; Xie, Jining

2003-07-01

Microfabrication techniques such as bulk micromachining and surface micromachining currently employed to conceive MEMS are largely derived from the standard IC and microelectronics technology. Even though many MEMS devices with integrated electronics have been achieved by using the traditional micromachining techniques, some limitations have nevertheless to be underlined: 1) these techniques are very expensive and need specific installations as well as a cleanroom environment, 2) the materials that can be used up to now are restricted to silicon and metals, 3) the manufacture of 3D parts having curved surfaces or an important number of layers is not possible. Moreover, for some biological applications, the materials used for sensors must be compatible with human body and the actuators need to have high strain and displacement which the current silicon based MEMS do not provide. It is thus natural for the researchers to 'look' for alternative methods such as Microstereolithography (MSL) to make 3D sensors and actuators using polymeric based materials. For MSL techniques to be successful as their silicon counterparts, one has to come up with multifunctional polymers with electrical properties comparable to silicon. These multifunctional polymers should not only have a high sensing capability but also a high strain and actuation performance. A novel UV-curable polymer uniformly bonded with functionalized nanotubes was synthesized via a modified three-step in-situ polymerization. Purified multi-walled nanotubes, gained from the microwave chemical vapor deposition method, were functionalized by oxidation. The UV curable polymer was prepared from toluene diisocyanate (TDI), functionalized nanotubes, and 2-hydroxyethyl methacrylate (HEMA). The chemical bonds between -NCO groups of TDI and -OH, -COOH groups of functionalized nanotubes help for conceiving polymeric based MEMS devices. A cost effective fabrication techniques was presented using Micro Stereo Lithography and an example of a micropump was also described. The wireless concept of the device has many applications including implanted medical delivery systems, chemical and biological instruments, fluid delivery in engines, pump coolants and refrigerants for local cooling of electronic components.

Silicon Micromachined Microlens Array for THz Antennas

NASA Technical Reports Server (NTRS)

Lee, Choonsup; Chattopadhyay, Goutam; Mehdi, IImran; Gill, John J.; Jung-Kubiak, Cecile D.; Llombart, Nuria

2013-01-01

5 5 silicon microlens array was developed using a silicon micromachining technique for a silicon-based THz antenna array. The feature of the silicon micromachining technique enables one to microfabricate an unlimited number of microlens arrays at one time with good uniformity on a silicon wafer. This technique will resolve one of the key issues in building a THz camera, which is to integrate antennas in a detector array. The conventional approach of building single-pixel receivers and stacking them to form a multi-pixel receiver is not suited at THz because a single-pixel receiver already has difficulty fitting into mass, volume, and power budgets, especially in space applications. In this proposed technique, one has controllability on both diameter and curvature of a silicon microlens. First of all, the diameter of microlens depends on how thick photoresist one could coat and pattern. So far, the diameter of a 6- mm photoresist microlens with 400 m in height has been successfully microfabricated. Based on current researchers experiences, a diameter larger than 1-cm photoresist microlens array would be feasible. In order to control the curvature of the microlens, the following process variables could be used: 1. Amount of photoresist: It determines the curvature of the photoresist microlens. Since the photoresist lens is transferred onto the silicon substrate, it will directly control the curvature of the silicon microlens. 2. Etching selectivity between photoresist and silicon: The photoresist microlens is formed by thermal reflow. In order to transfer the exact photoresist curvature onto silicon, there needs to be etching selectivity of 1:1 between silicon and photoresist. However, by varying the etching selectivity, one could control the curvature of the silicon microlens. The figure shows the microfabricated silicon microlens 5 x5 array. The diameter of the microlens located in the center is about 2.5 mm. The measured 3-D profile of the microlens surface has a smooth curvature. The measured height of the silicon microlens is about 280 microns. In this case, the original height of the photoresist was 210 microns. The change was due to the etching selectivity of 1.33 between photoresist and silicon. The measured surface roughness of the silicon microlens shows the peak-to-peak surface roughness of less than 0.5 microns, which is adequate in THz frequency. For example, the surface roughness should be less than 7 microns at 600 GHz range. The SEM (scanning electron microscope) image of the microlens confirms the smooth surface. The beam pattern at 550 GHz shows good directivity.

Micromachined silicon electrostatic chuck

DOEpatents

Anderson, R.A.; Seager, C.H.

1996-12-10

An electrostatic chuck is faced with a patterned silicon plate, created by micromachining a silicon wafer, which is attached to a metallic base plate. Direct electrical contact between the chuck face (patterned silicon plate`s surface) and the silicon wafer it is intended to hold is prevented by a pattern of flat-topped silicon dioxide islands that protrude less than 5 micrometers from the otherwise flat surface of the chuck face. The islands may be formed in any shape. Islands may be about 10 micrometers in diameter or width and spaced about 100 micrometers apart. One or more concentric rings formed around the periphery of the area between the chuck face and wafer contain a low-pressure helium thermal-contact gas used to assist heat removal during plasma etching of a silicon wafer held by the chuck. The islands are tall enough and close enough together to prevent silicon-to-silicon electrical contact in the space between the islands, and the islands occupy only a small fraction of the total area of the chuck face, typically 0.5 to 5 percent. The pattern of the islands, together with at least one hole bored through the silicon veneer into the base plate, will provide sufficient gas-flow space to allow the distribution of the helium thermal-contact gas. 6 figs.

Polyimide as a versatile enabling material for microsystems fabrication: surface micromachining and electrodeposited nanowires integration

NASA Astrophysics Data System (ADS)

Walewyns, Thomas; Reckinger, Nicolas; Ryelandt, Sophie; Pardoen, Thomas; Raskin, Jean-Pierre; Francis, Laurent A.

2013-09-01

The interest of using polyimide as a sacrificial and anchoring layer is demonstrated for post-processing surface micromachining and for the incorporation of metallic nanowires into microsystems. In addition to properties like a high planarization factor, a good resistance to most non-oxidizing acids and bases, and CMOS compatibility, polyimide can also be used as a mold for nanostructures after ion track-etching. Moreover, specific polyimide grades, such as PI-2611 from HD Microsystems™, involve a thermal expansion coefficient similar to silicon and low internal stress. The process developed in this study permits higher gaps compared to the state-of-the-art, limits stiction problems with the substrate and is adapted to various top-layer materials. Most metals, semiconductors or ceramics will not be affected by the oxygen plasma required for polyimide etching. Released structures with vertical gaps from one to several tens of μm have been obtained, possibly using multiple layers of polyimide. Furthermore, patterned freestanding nanowires have been synthesized with diameters from 20 to 60 nm and up to 3 μm in length. These results have been applied to the fabrication of two specific devices: a generic nanomechanical testing lab-on-chip platform and a miniaturized ionization sensor.

Method for forming suspended micromechanical structures

DOEpatents

Fleming, James G.

2000-01-01

A micromachining method is disclosed for forming a suspended micromechanical structure from {111} crystalline silicon. The micromachining method is based on the use of anisotropic dry etching to define lateral features of the structure which are etched down into a {111}-silicon substrate to a first etch depth, thereby forming sidewalls of the structure. The sidewalls are then coated with a protection layer, and the substrate is dry etched to a second etch depth to define a spacing of the structure from the substrate. A selective anisotropic wet etchant (e.g. KOH, EDP, TMAH, NaOH or CsOH) is used to laterally undercut the structure between the first and second etch depths, thereby forming a substantially planar lower surface of the structure along a {111} crystal plane that is parallel to an upper surface of the structure. The lateral extent of undercutting by the wet etchant is controlled and effectively terminated by either timing the etching, by the location of angled {111}-silicon planes or by the locations of preformed etch-stops. This present method allows the formation of suspended micromechanical structures having large vertical dimensions and large masses while allowing for detailed lateral features which can be provided by dry etch definition. Additionally, the method of the present invention is compatible with the formation of electronic circuitry on the substrate.

A Low-noise Micromachined Millimeter-Wave Heterodyne Mixer using Nb Superconducting Tunnel Junctions

NASA Technical Reports Server (NTRS)

DeLange, Gert; Jacobson, Brian R.; Hu, Qing

1996-01-01

A heterodyne mixer with a micromachined horn antenna and a superconductor-insulator-superconductor (SIS) tunnel junction as mixing element is tested in the W-band (75-115 GHz) frequency range. Micromachined integrated horn antennas consist of a dipole antenna suspended on a thin Si3N4 dielectric membrane inside a pyramidal cavity etched in silicon. The mixer performance is optimized by using a backing plane behind the dipole antenna to tune out the capacitance of the tunnel junction. The lowest receiver noise temperature of 30 +/- 3 K (without any correction) is measured at 106 GHz with a 3-dB bandwidth of 8 GHz. This sensitivity is comparable to the state-of-the-art waveguide and quasi-optical SIS receivers, showing the potential use of micromachined horn antennas in imaging arrays.

Micromachined cutting blade formed from {211}-oriented silicon

DOEpatents

Fleming, James G.; Sniegowski, Jeffry J.; Montague, Stephen

2003-09-09

A cutting blade is disclosed fabricated of micromachined silicon. The cutting blade utilizes a monocrystalline silicon substrate having a {211} crystalline orientation to form one or more cutting edges that are defined by the intersection of {211} crystalline planes of silicon with {111} crystalline planes of silicon. This results in a cutting blade which has a shallow cutting-edge angle .theta. of 19.5.degree.. The micromachined cutting blade can be formed using an anisotropic wet etching process which substantially terminates etching upon reaching the {111} crystalline planes of silicon. This allows multiple blades to be batch fabricated on a common substrate and separated for packaging and use. The micromachined cutting blade, which can be mounted to a handle in tension and optionally coated for increased wear resistance and biocompatibility, has multiple applications including eye surgery (LASIK procedure).

Micromachined cutting blade formed from {211}-oriented silicon

DOEpatents

Fleming, James G [Albuquerque, NM; Fleming, legal representative, Carol; Sniegowski, Jeffry J [Tijeras, NM; Montague, Stephen [Albuquerque, NM

2011-08-09

A cutting blade is disclosed fabricated of micromachined silicon. The cutting blade utilizes a monocrystalline silicon substrate having a {211} crystalline orientation to form one or more cutting edges that are defined by the intersection of {211} crystalline planes of silicon with {111} crystalline planes of silicon. This results in a cutting blade which has a shallow cutting-edge angle .theta. of 19.5.degree.. The micromachined cutting blade can be formed using an anisotropic wet etching process which substantially terminates etching upon reaching the {111} crystalline planes of silicon. This allows multiple blades to be batch fabricated on a common substrate and separated for packaging and use. The micromachined cutting blade, which can be mounted to a handle in tension and optionally coated for increased wear resistance and biocompatibility, has multiple applications including eye surgery (LASIK procedure).

A Micromachined Capacitive Pressure Sensor Using a Cavity-Less Structure with Bulk-Metal/Elastomer Layers and Its Wireless Telemetry Application

PubMed Central

Takahata, Kenichi; Gianchandani, Yogesh B.

2008-01-01

This paper reports a micromachined capacitive pressure sensor intended for applications that require mechanical robustness. The device is constructed with two micromachined metal plates and an intermediate polymer layer that is soft enough to deform in a target pressure range. The plates are formed of micromachined stainless steel fabricated by batch-compatible micro-electro-discharge machining. A polyurethane room-temperature-vulcanizing liquid rubber of 38-μm thickness is used as the deformable material. This structure eliminates both the vacuum cavity and the associated lead transfer challenges common to micromachined capacitive pressure sensors. For frequency-based interrogation of the capacitance, passive inductor-capacitor tanks are fabricated by combining the capacitive sensor with an inductive coil. The coil has 40 turns of a 127-μm-diameter copper wire. Wireless sensing is demonstrated in liquid by monitoring the variation in the resonant frequency of the tank via an external coil that is magnetically coupled with the tank. The sensitivity at room temperature is measured to be 23-33 ppm/KPa over a dynamic range of 340 KPa, which is shown to match a theoretical estimation. Temperature dependence of the tank is experimentally evaluated. PMID:27879824

Micromachined Fluid Inertial Sensors

PubMed Central

Liu, Shiqiang; Zhu, Rong

2017-01-01

Micromachined fluid inertial sensors are an important class of inertial sensors, which mainly includes thermal accelerometers and fluid gyroscopes, which have now been developed since the end of the last century for about 20 years. Compared with conventional silicon or quartz inertial sensors, the fluid inertial sensors use a fluid instead of a solid proof mass as the moving and sensitive element, and thus offer advantages of simple structures, low cost, high shock resistance, and large measurement ranges while the sensitivity and bandwidth are not competitive. Many studies and various designs have been reported in the past two decades. This review firstly introduces the working principles of fluid inertial sensors, followed by the relevant research developments. The micromachined thermal accelerometers based on thermal convection have developed maturely and become commercialized. However, the micromachined fluid gyroscopes, which are based on jet flow or thermal flow, are less mature. The key issues and technologies of the thermal accelerometers, mainly including bandwidth, temperature compensation, monolithic integration of tri-axis accelerometers and strategies for high production yields are also summarized and discussed. For the micromachined fluid gyroscopes, improving integration and sensitivity, reducing thermal errors and cross coupling errors are the issues of most concern. PMID:28216569

Modelling of gecko foot for future robot application

NASA Astrophysics Data System (ADS)

Kamaruddin, A.; Ong, N. R.; Aziz, M. H. A.; Alcain, J. B.; Haimi, W. M. W. N.; Sauli, Z.

2017-09-01

Every gecko has an approximately million microscale hairs called setae which made it easy for them to cling from different surfaces at any orientation with the aid of Van der Waals force as the primary mechanism used to adhere to any contact surfaces. In this paper, a strain simulation using Comsol Multiphysic Software was conducted on a 3D MEMS model of an actuated gecko foot with the aim of achieving optimal sticking with various polymetric materials for future robots application. Based on the stress and strain analyses done on the seven different polymers, it was found that polysilicon had the best result which was nearest to 0%, indicating the strongest elasticity among the others. PDMS on the hand, failed in the simulation due to its bulk-like nature. Thus, PDMS was not suitable to be used for further study on gecko foot robot.

Fabrication of microfluidic integrated biosensor

NASA Astrophysics Data System (ADS)

Adam, Tijjani; Dhahi, Th S.; Mohammed, Mohammed; Hashim, U.; Noriman, N. Z.; Dahham, Omar S.

2017-09-01

An event of miniaturizing for sensor systems to carry out biological diagnostics are gaining wade spread acceptance. The system may contain several different sensor units for the detection of specific analyte, the analyte to be detected might be any kind of biological molecules (DNA, mRNA or proteins) or chemical substances. In most cases, the detection is based on receptor-ligand binding like DNA hybridization or antibody-antigen interaction, achieving this on a nanostructure. DNA or protein must be attached to certain locations within the structure. Critical for this is to have a robust binding chemistry to the surface in the microstructure. Here we successfully designed and fabricated microfluidics element for passive fluid delivery into polysilicon Nanowire sensing domain, we further demonstrated a very simple and effective way of integrating the two devices to give full functionalities of laboratory on a single chip. The sensing element was successfully surface modified and tested on real biomedical clinical sample for evaluation and validation.

Thermal Switch for Satellite Temperature Control

NASA Technical Reports Server (NTRS)

Ziad, H.; Slater, T.; vanGerwen, P.; Masure, E.; Preudhomme, F.; Baert, K.

1995-01-01

An active radiator tile (ART) thermal valve has been fabricated using silicon micromachining. Intended for orbital satellite heat control applications, the operational principal of the ART is to control heat flow between two thermally isolated surfaces by bring the surfaces into intimate mechanical contact using electrostatic actuation. Prototype devices have been tested in a vacuum and demonstrate thermal actuation voltages as low as 40 volts, very good thermal insulation in the OFF state, and a large increase in radiative heat flow in the ON state. Thin, anodized aluminum was developed as a coating for high infrared emissivity and high solar reflectance.

Micromachined electrostatic vertical actuator

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lee, Abraham P.; Sommargren, Gary E.; McConaghy, Charles F.

A micromachined vertical actuator utilizing a levitational force, such as in electrostatic comb drives, provides vertical actuation that is relatively linear in actuation for control, and can be readily combined with parallel plate capacitive position sensing for position control. The micromachined electrostatic vertical actuator provides accurate movement in the sub-micron to micron ranges which is desirable in the phase modulation instrument, such as optical phase shifting. For example, compact, inexpensive, and position controllable micromirrors utilizing an electrostatic vertical actuator can replace the large, expensive, and difficult-to-maintain piezoelectric actuators. A thirty pound piezoelectric actuator with corner cube reflectors, as utilized inmore » a phase shifting diffraction interferometer can be replaced with a micromirror and a lens. For any very precise and small amplitudes of motion` micromachined electrostatic actuation may be used because it is the most compact in size, with low power consumption and has more straightforward sensing and control options.« less

Micromachined electrostatic vertical actuator

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lee, A.P.; Sommargren, G.E.; McConaghy, C.F.

A micromachined vertical actuator utilizing a levitational force, such as in electrostatic comb drives, provides vertical actuation that is relatively linear in actuation for control, and can be readily combined with parallel plate capacitive position sensing for position control. The micromachined electrostatic vertical actuator provides accurate movement in the sub-micron to micron ranges which is desirable in the phase modulation instrument, such as optical phase shifting. For example, compact, inexpensive, and position controllable micromirrors utilizing an electrostatic vertical actuator can replace the large, expensive, and difficult-to-maintain piezoelectric actuators. A thirty pound piezoelectric actuator with corner cube reflectors, as utilized inmore » a phase shifting diffraction interferometer can be replaced with a micromirror and a lens. For any very precise and small amplitudes of motion, micromachined electrostatic actuation may be used because it is the most compact in size, with low power consumption and has more straightforward sensing and control options.« less

Estimation of tool wear compensation during micro-electro-discharge machining of silicon using process simulation

NASA Astrophysics Data System (ADS)

Muralidhara, .; Vasa, Nilesh J.; Singaperumal, M.

2010-02-01

A micro-electro-discharge machine (Micro EDM) was developed incorporating a piezoactuated direct drive tool feed mechanism for micromachining of Silicon using a copper tool. Tool and workpiece materials are removed during Micro EDM process which demand for a tool wear compensation technique to reach the specified depth of machining on the workpiece. An in-situ axial tool wear and machining depth measurement system is developed to investigate axial wear ratio variations with machining depth. Stepwise micromachining experiments on silicon wafer were performed to investigate the variations in the silicon removal and tool wear depths with increase in tool feed. Based on these experimental data, a tool wear compensation method is proposed to reach the desired depth of micromachining on silicon using copper tool. Micromachining experiments are performed with the proposed tool wear compensation method and a maximum workpiece machining depth variation of 6% was observed.

Contact-lens type of micromachined hydrogenated amorphous Si fluorescence detector coupled with microfluidic electrophoresis devices

NASA Astrophysics Data System (ADS)

Kamei, Toshihiro; Wada, Takehito

2006-09-01

A 5.8-μm-thick SiO2/Ta2O5 multilayer optical interference filter was monolithically integrated and micromachined on a hydrogenated amorphous Si (a-Si :H) pin photodiode to form a fluorescence detector. A microfluidic electrophoresis device was mounted on a detection platform comprising a fluorescence-collecting half-ball lens and the micromachined fluorescence detector. The central aperture of the fluorescence detector allows semiconductor laser light to pass up through the detector and to irradiate an electrophoretic separation channel. The limit of detection is as low as 7nM of the fluorescein solution, and high-speed DNA fragment sizing can be achieved with high separation efficiency. The micromachined a-Si :H fluorescence detector exhibits high sensitivity for practical fluorescent labeling dyes as well as integration flexibility on various substances, making it ideal for application to portable microfluidic bioanalysis devices.

The Laser MicroJet (LMJ): a multi-solution technology for high quality micro-machining

NASA Astrophysics Data System (ADS)

Mai, Tuan Anh; Richerzhagen, Bernold; Snowdon, Paul C.; Wood, David; Maropoulos, Paul G.

2007-02-01

The field of laser micromachining is highly diverse. There are many different types of lasers available in the market. Due to their differences in irradiating wavelength, output power and pulse characteristic they can be selected for different applications depending on material and feature size [1]. The main issues by using these lasers are heat damages, contamination and low ablation rates. This report examines on the application of the Laser MicroJet(R) (LMJ), a unique combination of a laser beam with a hair-thin water jet as a universal tool for micro-machining of MEMS substrates, as well as ferrous and non-ferrous materials. The materials include gallium arsenide (GaAs) & silicon wafers, steel, tantalum and alumina ceramic. A Nd:YAG laser operating at 1064 nm (infra red) and frequency doubled 532 nm (green) were employed for the micro-machining of these materials.

Oxide driven strength evolution of silicon surfaces

DOE PAGES

Grutzik, Scott J.; Milosevic, Erik; Boyce, Brad L.; ...

2015-11-19

Previous experiments have shown a link between oxidation and strength changes in single crystal silicon nanostructures but provided no clues as to the mechanisms leading to this relationship. Using atomic force microscope-based fracture strength experiments, molecular dynamics modeling, and measurement of oxide development with angle resolved x-ray spectroscopy we study the evolution of strength of silicon (111) surfaces as they oxidize and with fully developed oxide layers. We find that strength drops with partial oxidation but recovers when a fully developed oxide is formed and that surfaces intentionally oxidized from the start maintain their high initial strengths. MD simulations showmore » that strength decreases with the height of atomic layer steps on the surface. These results are corroborated by a completely separate line of testing using micro-scale, polysilicon devices, and the slack chain method in which strength recovers over a long period of exposure to the atmosphere. Lastly, combining our results with insights from prior experiments we conclude that previously described strength decrease is a result of oxidation induced roughening of an initially flat silicon (1 1 1) surface and that this effect is transient, a result consistent with the observation that surfaces flatten upon full oxidation.« less

Enhanced phonon scattering by nanovoids in high thermoelectric power factor polysilicon thin films

NASA Astrophysics Data System (ADS)

Dunham, Marc T.; Lorenzi, Bruno; Andrews, Sean C.; Sood, Aditya; Asheghi, Mehdi; Narducci, Dario; Goodson, Kenneth E.

2016-12-01

The ability to tune the thermal conductivity of semiconductor materials is of interest for thermoelectric applications, in particular, for doped silicon, which can be readily integrated in electronic microstructures and have a high thermoelectric power factor. Here, we examine the impact of nanovoids on the thermal conductivity of highly doped, high-power factor polysilicon thin films using time-domain thermoreflectance. Voids are formed through ion implantation and annealing, evolving from many small (˜4 nm mean diameter) voids after 500 °C anneal to fewer, larger (˜29 nm mean diameter) voids with a constant total volume fraction after staged thermal annealing to 1000 °C. The thermal conductivity is reduced to 65% of the non-implanted reference film conductivity after implantation and 500 °C anneal, increasing with anneal temperature until fully restored after 800 °C anneal. The void size distributions are determined experimentally using small-angle and wide-angle X-ray scattering. While we believe multiple physical mechanisms are at play, we are able to corroborate the positive correlation between measurements of thermal conductivity and void size with Monte Carlo calculations and a scattering probability based on Matthiessen's rule. The data suggest an opportunity for thermal conductivity suppression combined with the high power factor for increased material zT and efficiency of nanostructured polysilicon as a thermoelectric material.

Effect of Axial Force on the Performance of Micromachined Vibratory Rate Gyroscopes

PubMed Central

Hou, Zhanqiang; Xiao, Dingbang; Wu, Xuezhong; Dong, Peitao; Chen, Zhihua; Niu, Zhengyi; Zhang, Xu

2011-01-01

It is reported in the published literature that the resonant frequency of a silicon micromachined gyroscope decreases linearly with increasing temperature. However, when the axial force is considerable, the resonant frequency might increase as the temperature increases. The axial force is mainly induced by thermal stress due to the mismatch between the thermal expansion coefficients of the structure and substrate. In this paper, two types of micromachined suspended vibratory gyroscopes with slanted beams were proposed to evaluate the effect of the axial force. One type was suspended with a clamped-free (C-F) beam and the other one was suspended with a clamped-clamped (C-C) beam. Their drive modes are the bending of the slanted beam, and their sense modes are the torsion of the slanted beam. The relationships between the resonant frequencies of the two types were developed. The prototypes were packaged by vacuum under 0.1 mbar and an analytical solution for the axial force effect on the resonant frequency was obtained. The temperature dependent performances of the operated mode responses of the micromachined gyroscopes were measured. The experimental values of the temperature coefficients of resonant frequencies (TCF) due to axial force were 101.5 ppm/°C for the drive mode and 21.6 ppm/°C for the sense mode. The axial force has a great influence on the modal frequency of the micromachined gyroscopes suspended with a C-C beam, especially for the flexure mode. The quality factors of the operated modes decreased with increasing temperature, and changed drastically when the micromachined gyroscopes worked at higher temperatures. PMID:22346578

Damping control of micromachined lowpass mechanical vibration isolation filters using electrostatic actuation with electronic signal processing

NASA Astrophysics Data System (ADS)

Dean, Robert; Flowers, George; Sanders, Nicole; MacAllister, Ken; Horvath, Roland; Hodel, A. S.; Johnson, Wayne; Kranz, Michael; Whitley, Michael

2005-05-01

Some harsh environments, such as those encountered by aerospace vehicles and various types of industrial machinery, contain high frequency/amplitude mechanical vibrations. Unfortunately, some very useful components are sensitive to these high frequency mechanical vibrations. Examples include MEMS gyroscopes and resonators, oscillators and some micro optics. Exposure of these components to high frequency mechanical vibrations present in the operating environment can result in problems ranging from an increased noise floor to component failure. Passive micromachined silicon lowpass filter structures (spring-mass-damper) have been demonstrated in recent years. However, the performance of these filter structures is typically limited by low damping (especially if operated in near-vacuum environments) and a lack of tunability after fabrication. Active filter topologies, such as piezoelectric, electrostrictive-polymer-film and SMA have also been investigated in recent years. Electrostatic actuators, however, are utilized in many micromachined silicon devices to generate mechanical motion. They offer a number of advantages, including low power, fast response time, compatibility with silicon micromachining, capacitive position measurement and relative simplicity of fabrication. This paper presents an approach for realizing active micromachined mechanical lowpass vibration isolation filters by integrating an electrostatic actuator with the micromachined passive filter structure to realize an active mechanical lowpass filter. Although the electrostatic actuator can be used to adjust the filter resonant frequency, the primary application is for increasing the damping to an acceptable level. The physical size of these active filters is suitable for use in or as packaging for sensitive electronic and MEMS devices, such as MEMS vibratory gyroscope chips.

Design and Analysis of a Micromechanical Three-Component Force Sensor for Characterizing and Quantifying Surface Roughness

NASA Astrophysics Data System (ADS)

Liang, Q.; Wu, W.; Zhang, D.; Wei, B.; Sun, W.; Wang, Y.; Ge, Y.

2015-10-01

Roughness, which can represent the trade-off between manufacturing cost and performance of mechanical components, is a critical predictor of cracks, corrosion and fatigue damage. In order to measure polished or super-finished surfaces, a novel touch probe based on three-component force sensor for characterizing and quantifying surface roughness is proposed by using silicon micromachining technology. The sensor design is based on a cross-beam structure, which ensures that the system possesses high sensitivity and low coupling. The results show that the proposed sensor possesses high sensitivity, low coupling error, and temperature compensation function. The proposed system can be used to investigate micromechanical structures with nanometer accuracy.

Multi-layer assemblies with predetermined stress profile and method for producing same

NASA Technical Reports Server (NTRS)

Heuer, Arthur H. (Inventor); Kahn, Harold (Inventor); Yang, Jie (Inventor); Phillips, Stephen M. (Inventor)

2003-01-01

Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin films may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films. Multi-layer assemblies exhibiting selectively determinable overall bending moments are also disclosed. Selective production of overall bending moments in microstructures enables manufacture of such structures with a wide array of geometrical configurations.

A zinc oxide nanorod ammonia microsensor integrated with a readout circuit on-a-chip.

PubMed

Yang, Ming-Zhi; Dai, Ching-Liang; Wu, Chyan-Chyi

2011-01-01

A zinc oxide nanorod ammonia microsensor integrated with a readout circuit on-a-chip fabricated using the commercial 0.35 μm complementary metal oxide semiconductor (CMOS) process was investigated. The structure of the ammonia sensor is composed of a sensitive film and polysilicon electrodes. The ammonia sensor requires a post-process to etch the sacrificial layer, and to coat the sensitive film on the polysilicon electrodes. The sensitive film that is prepared by a hydrothermal method is made of zinc oxide. The sensor resistance changes when the sensitive film adsorbs or desorbs ammonia gas. The readout circuit is used to convert the sensor resistance into the voltage output. Experiments show that the ammonia sensor has a sensitivity of about 1.5 mV/ppm at room temperature.

Physically-Based Reduced Order Modelling of a Uni-Axial Polysilicon MEMS Accelerometer

PubMed Central

Ghisi, Aldo; Mariani, Stefano; Corigliano, Alberto; Zerbini, Sarah

2012-01-01

In this paper, the mechanical response of a commercial off-the-shelf, uni-axial polysilicon MEMS accelerometer subject to drops is numerically investigated. To speed up the calculations, a simplified physically-based (beams and plate), two degrees of freedom model of the movable parts of the sensor is adopted. The capability and the accuracy of the model are assessed against three-dimensional finite element simulations, and against outcomes of experiments on instrumented samples. It is shown that the reduced order model provides accurate outcomes as for the system dynamics. To also get rather accurate results in terms of stress fields within regions that are prone to fail upon high-g shocks, a correction factor is proposed by accounting for the local stress amplification induced by re-entrant corners. PMID:23202031

An Analysis of Hole Trapping at Grain Boundary or Poly-Si Floating-Body MOSFET.

PubMed

Jang, Taejin; Baek, Myung-Hyun; Kim, Hyungjin; Park, Byung-Gook

2018-09-01

In this paper, we demonstrate the characteristics of the floating body effect of poly-silicon with grain boundary by SENTAURUS™ TCAD simulation. As drain voltage increases, impact ionization occurs at the drain-channel junction. And these holes created by impact ionization are deposited on the bottom of the body to change the threshold voltage. This feature, the kink effect, is also observed in fully depleted silicon on insulator because grain boundary of the poly-silicon serve as a storage to trap the holes. We simulate the transfer curve depending on the density and position of the grain boundary. The trap density of the grain boundary affects the device characteristics significantly. However similar properties appear except where the grain boundary is located on the drain side.

Silicon sample holder for molecular beam epitaxy on pre-fabricated integrated circuits

NASA Technical Reports Server (NTRS)

Hoenk, Michael E. (Inventor); Grunthaner, Paula J. (Inventor); Grunthaner, Frank J. (Inventor)

1994-01-01

The sample holder of the invention is formed of the same semiconductor crystal as the integrated circuit on which the molecular beam expitaxial process is to be performed. In the preferred embodiment, the sample holder comprises three stacked micro-machined silicon wafers: a silicon base wafer having a square micro-machined center opening corresponding in size and shape to the active area of a CCD imager chip, a silicon center wafer micro-machined as an annulus having radially inwardly pointing fingers whose ends abut the edges of and center the CCD imager chip within the annulus, and a silicon top wafer micro-machined as an annulus having cantilevered membranes which extend over the top of the CCD imager chip. The micro-machined silicon wafers are stacked in the order given above with the CCD imager chip centered in the center wafer and sandwiched between the base and top wafers. The thickness of the center wafer is about 20% less than the thickness of the CCD imager chip. Preferably, four titanium wires, each grasping the edges of the top and base wafers, compress all three wafers together, flexing the cantilever fingers of the top wafer to accommodate the thickness of the CCD imager chip, acting as a spring holding the CCD imager chip in place.

Analytical Performance of a Venturi-assisted Array of Micromachined UltraSonic Electrosprays (AMUSE) Coupled to Ion Trap Mass Spectrometry for the Analysis of Peptides and Proteins

PubMed Central

Hampton, Christina Y.; Forbes, Thomas P.; Varady, Mark J.; Meacham, J. Mark; Fedorov, Andrei G.; Degertekin, F. Levent; Fernández, Facundo M.

2008-01-01

The analytical characterization of a novel ion source for mass spectrometry named Array of Micromachined UltraSonic Electrosprays (AMUSE) is presented here. This is a fundamentally different type of ion generation device, consisting of three major components: 1) a piezoelectric transducer that creates ultrasonic waves at one of the resonant frequencies of the sample-filled device, 2) an array of pyramidally-shaped nozzles micromachined on a silicon wafer, and 3) a spacer which prevents contact between the array and transducer ensuring the transfer of acoustic energy to the sample. A high pressure gradient generated at the apices of the nozzle pyramids forces the periodic ejection of multiple droplet streams from the device. With this device, the processes of droplet formation and droplet charging are separated, hence, the limitations of conventional electrospray-type ion sources, including the need for high charging potentials and the addition of organic solvent to decrease surface tension can be avoided. In this work, a Venturi device is coupled with AMUSE in order to increase desolvation, droplet focusing, and signal stability. Results show that ionization of model peptides and small tuning molecules is possible with DC charging potentials of 100 VDC or less. Ionization in RF-only mode (without DC biasing) was also possible. It was observed that, when combined with AMUSE, the Venturi device provides a 10-fold gain in signal-to-noise ratio for 90% aqueous sample solutions. Further reduction in the diameter of the orifices of the micromachined arrays, led to an additional signal gain of at least 3 orders of magnitude, a 2- to 10-fold gain in the signal-to-noise ratio, and an improvement in signal stability from 47% to 8.5% RSD. The effectiveness of this device for the soft ionization of model proteins in aqueous media, such as cytochrome C was also examined, yielding spectra with an average charge state of 8.8 when analyzed with a 100 VDC charging potential. Ionization of model proteins was also possible in RF-only mode. PMID:17914864

Microfluidic systems with embedded materials and structures and method thereof

DOEpatents

Morse, Jeffrey D [Martinez, CA; Rose, Klint A [Boston, MA; Maghribi, Mariam [Livermore, CA; Benett, William [Livermore, CA; Krulevitch, Peter [Pleasanton, CA; Hamilton, Julie [Tracy, CA; Graff, Robert T [Modesto, CA; Jankowski, Alan [Livermore, CA

2007-03-06

Described herein is a process for fabricating microfluidic systems with embedded components in which micron-scale features are molded into the polymeric material polydimethylsiloxane (PDMS). Micromachining is used to create a mold master and the liquid precursors for PDMS are poured over the mold and allowed to cure. The PDMS is then removed form the mold and bonded to another material such as PDMS, glass, or silicon after a simple surface preparation step to form sealed microchannels.

Development of a novel translation micromirror for adaptive optics

NASA Astrophysics Data System (ADS)

He, Siyuan; Ben Mrad, Ridha

2003-10-01

Conventional translation micromirrors for adaptive optics use attractive electrostatic force and therefore have two limitations: 1) the stroke is limited to less than one third of the initial gap distance between the mirror plate and the substrate. Normally the stroke is in the range of submicrometers; 2) stiction happens during operation. A novel translation micromirror, which uses a repulsive electrostatic force, is presented in this paper. This novel translation micromirror completely overcomes the limitations associated with conventional translation micromirrors and its stroke is not limited by the initial gap distance between the mirror plate and the substrate and therefore is able to achieve a much larger vertical stroke to modulate lights over a wider spectrum than that achieved by conventional translation micromirrors. The novel translation micromirror has no stiction problem and is highly compatible with mature surface micromachining technology. An analytical model is derived for the novel translation micromirror and prototypes are fabricated. The prototype of the novel translation micromirror, which is deliberately not optimized so it could be fabricated using MUMPS, achieved a vertical stroke of 1.75μm using a driving voltage of 50 volts, which is three times the stroke of conventional MUMPS translation micromirrors. It is expected that if standard surface micromachining is used instead of MUMPs, the design of the novel translation micromirror can be optimized and a much larger vertical stroke can be achieved.

Functionalised polyurethane for efficient laser micromachining

NASA Astrophysics Data System (ADS)

Brodie, G. W. J.; Kang, H.; MacMillan, F. J.; Jin, J.; Simpson, M. C.

2017-02-01

Pulsed laser ablation is a valuable tool that offers a much cleaner and more flexible etching process than conventional lithographic techniques. Although much research has been undertaken on commercially available polymers, many challenges still remain, including contamination by debris on the surface, a rough etched appearance and high ablation thresholds. Functionalizing polymers with a photosensitive group is a novel way and effective way to improve the efficiency of laser micromachining. In this study, several polyurethane films grafted with different concentrations of the chromophore anthracene have been synthesized which are specifically designed for 248 nm KrF excimer laser ablation. A series of lines etched with a changing number of pulses and fluences by the nanosecond laser were applied to each polyurethane film. The resultant ablation behaviours were studied through optical interference tomography and Scanning Electron Microscopy. The anthracene grafted polyurethanes showed a vast improvement in both edge quality and the presence of debris compared with the unmodified polyurethane. Under the same laser fluence and number of pulses the spots etched in the anthracene contained polyurethane show sharp depth profiles and smooth surfaces, whereas the spots etched in polyurethane without anthracene group grafted present rough cavities with debris according to the SEM images. The addition of a small amount of anthracene (1.47%) shows a reduction in ablation threshold from unmodified polyurethane showing that the desired effect can be achieved with very little modification to the polymer.

Underwater femtosecond laser micromachining of thin nitinol tubes for medical coronary stent manufacture

NASA Astrophysics Data System (ADS)

Muhammad, Noorhafiza; Li, Lin

2012-06-01

Microprofiling of medical coronary stents has been dominated by the use of Nd:YAG lasers with pulse lengths in the range of a few milliseconds, and material removal is based on the melt ejection with a high-pressure gas. As a result, recast and heat-affected zones are produced, and various post-processing procedures are required to remove these defects. This paper reports a new approach of machining stents in submerged conditions using a 100-fs pulsed laser. A comparison is given of dry and underwater femtosecond laser micromachining techniques of nickel-titanium alloy (nitinol) typically used as the material for coronary stents. The characteristics of laser interactions with the material have been studied. A femtosecond Ti:sapphire laser system (wavelength of 800 nm, pulse duration of 100 fs, repetition rate of 1 kHz) was used to perform the cutting process. It is observed that machining under a thin water film resulted in no presence of heat-affected zone, debris, spatter or recast with fine-cut surface quality. At the optimum parameters, the results obtained with dry cutting showed nearly the same cut surface quality as with cutting under water. However, debris and recast formation still appeared on the dry cut, which is based on material vaporization. Physical processes involved during the cutting process in a thin water film, i.e. bubble formation and shock waves, are discussed.

Micromachined silicon electrostatic chuck

DOEpatents

Anderson, Robert A.; Seager, Carleton H.

1996-01-01

An electrostatic chuck is faced with a patterned silicon plate 11, created y micromachining a silicon wafer, which is attached to a metallic base plate 13. Direct electrical contact between the chuck face 15 (patterned silicon plate's surface) and the silicon wafer 17 it is intended to hold is prevented by a pattern of flat-topped silicon dioxide islands 19 that protrude less than 5 micrometers from the otherwise flat surface of the chuck face 15. The islands 19 may be formed in any shape. Islands may be about 10 micrometers in diameter or width and spaced about 100 micrometers apart. One or more concentric rings formed around the periphery of the area between the chuck face 15 and wafer 17 contain a low-pressure helium thermal-contact gas used to assist heat removal during plasma etching of a silicon wafer held by the chuck. The islands 19 are tall enough and close enough together to prevent silicon-to-silicon electrical contact in the space between the islands, and the islands occupy only a small fraction of the total area of the chuck face 15, typically 0.5 to 5 percent. The pattern of the islands 19, together with at least one hole 12 bored through the silicon veneer into the base plate, will provide sufficient gas-flow space to allow the distribution of the helium thermal-contact gas.

Curve micromachining on the edges of nitinol biliary stent by ultrashort pulses laser

NASA Astrophysics Data System (ADS)

Hung, Chia-Hung; Chang, Fuh-Yu

2017-05-01

In this study, a curve micromaching process on the edges of nitinol biliary stent was proposed by a femtosecond laser system with a galvano-mirror scanner. Furthermore, the outer diameter of nitinol tube was 5.116 mm, its inner diameter was 4.648 mm, and its length was 100 mm. The initial fabricated results of nitinol biliary stent represented that the edges of nitinol biliary stent were steep and squared by femtosecond laser. However, the results also indicated that if the laser movement path was precisely programmed by utilizing the unique characteristic of Gaussian beam of femtosecond laser with aligning the edges of stent, the radius of edges enhanced significantly from 9 μm to 42.5 μm. As a result, the edges of nitinol biliary stent can be successfully fabricated from squared edges to rounded-shaped edges with precise dimension, clean surface morphology, and minimal heat-affected zone remained. Hence, the nitinol biliary stent, after femtosecond laser micromachining, would not need any further post-process to remove heat-affected zone and the squared edges.

Plastic Deformation of Micromachined Silicon Diaphragms with a Sealed Cavity at High Temperatures

PubMed Central

Ren, Juan; Ward, Michael; Kinnell, Peter; Craddock, Russell; Wei, Xueyong

2016-01-01

Single crystal silicon (SCS) diaphragms are widely used as pressure sensitive elements in micromachined pressure sensors. However, for harsh environments applications, pure silicon diaphragms are hardly used because of the deterioration of SCS in both electrical and mechanical properties. To survive at the elevated temperature, the silicon structures must work in combination with other advanced materials, such as silicon carbide (SiC) or silicon on insulator (SOI), for improved performance and reduced cost. Hence, in order to extend the operating temperatures of existing SCS microstructures, this work investigates the mechanical behavior of pressurized SCS diaphragms at high temperatures. A model was developed to predict the plastic deformation of SCS diaphragms and was verified by the experiments. The evolution of the deformation was obtained by studying the surface profiles at different anneal stages. The slow continuous deformation was considered as creep for the diaphragms with a radius of 2.5 mm at 600 °C. The occurrence of plastic deformation was successfully predicted by the model and was observed at the operating temperature of 800 °C and 900 °C, respectively. PMID:26861332

Parallel-plate submicron gap formed by micromachined low-density pillars for near-field radiative heat transfer

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ito, Kota, E-mail: kotaito@mosk.tytlabs.co.jp; Research Center for Advanced Science and Technology; Miura, Atsushi

Near-field radiative heat transfer has been a subject of great interest due to the applicability to thermal management and energy conversion. In this letter, a submicron gap between a pair of diced fused quartz substrates is formed by using micromachined low-density pillars to obtain both the parallelism and small parasitic heat conduction. The gap uniformity is validated by the optical interferometry at four corners of the substrates. The heat flux across the gap is measured in a steady-state and is no greater than twice of theoretically predicted radiative heat flux, which indicates that the parasitic heat conduction is suppressed tomore » the level of the radiative heat transfer or less. The heat conduction through the pillars is modeled, and it is found to be limited by the thermal contact resistance between the pillar top and the opposing substrate surface. The methodology to form and evaluate the gap promotes the near-field radiative heat transfer to various applications such as thermal rectification, thermal modulation, and thermophotovoltaics.« less

Hypersonic force measurements using internal balance based on optical micromachined Fabry-Perot interferometry.

PubMed

Qiu, Huacheng; Min, Fu; Zhong, Shaolong; Song, Xin; Yang, Yanguang

2018-03-01

Force measurements using wind tunnel balance are necessary for determining a variety of aerodynamic performance parameters, while the harsh environment in hypersonic flows requires that the measurement instrument should be reliable and robust, in against strong electromagnetic interference, high vacuum, or metal (oxide) dusts. In this paper, we demonstrated a three-component internal balance for hypersonic aerodynamic force measurements, using novel optical micromachined Fabry-Perot interferometric (FPI) strain gauges as sensing elements. The FPI gauges were fabricated using Micro-Opto-Electro-Mechanical Systems (MOEMS) surface and bulk fabrication techniques. High-reflectivity coatings are used to form a high-finesse Fabry-Perot cavity, which benefits a high resolution. Antireflective and passivation coatings are used to reduce unwanted interferences. The FPI strain gauge based balance has been calibrated and evaluated in a Mach 5 hypersonic flow. The results are compared with the traditional technique using the foil resistive strain gauge balance, indicating that the proposed balance based on the MOEMS FPI strain gauge is reliable and robust and is potentially suitable for the hypersonic wind tunnel harsh environment.

Apparatus for precision micromachining with lasers

DOEpatents

Chang, J.J.; Dragon, E.P.; Warner, B.E.

1998-04-28

A new material processing apparatus using a short-pulsed, high-repetition-rate visible laser for precision micromachining utilizes a near diffraction limited laser, a high-speed precision two-axis tilt-mirror for steering the laser beam, an optical system for either focusing or imaging the laser beam on the part, and a part holder that may consist of a cover plate and a back plate. The system is generally useful for precision drilling, cutting, milling and polishing of metals and ceramics, and has broad application in manufacturing precision components. Precision machining has been demonstrated through percussion drilling and trepanning using this system. With a 30 W copper vapor laser running at multi-kHz pulse repetition frequency, straight parallel holes with size varying from 500 microns to less than 25 microns and with aspect ratios up to 1:40 have been consistently drilled with good surface finish on a variety of metals. Micromilling and microdrilling on ceramics using a 250 W copper vapor laser have also been demonstrated with good results. Materialographic sections of machined parts show little (submicron scale) recast layer and heat affected zone. 1 fig.

Hypersonic force measurements using internal balance based on optical micromachined Fabry-Perot interferometry

NASA Astrophysics Data System (ADS)

Qiu, Huacheng; Min, Fu; Zhong, Shaolong; Song, Xin; Yang, Yanguang

2018-03-01

Force measurements using wind tunnel balance are necessary for determining a variety of aerodynamic performance parameters, while the harsh environment in hypersonic flows requires that the measurement instrument should be reliable and robust, in against strong electromagnetic interference, high vacuum, or metal (oxide) dusts. In this paper, we demonstrated a three-component internal balance for hypersonic aerodynamic force measurements, using novel optical micromachined Fabry-Perot interferometric (FPI) strain gauges as sensing elements. The FPI gauges were fabricated using Micro-Opto-Electro-Mechanical Systems (MOEMS) surface and bulk fabrication techniques. High-reflectivity coatings are used to form a high-finesse Fabry-Perot cavity, which benefits a high resolution. Antireflective and passivation coatings are used to reduce unwanted interferences. The FPI strain gauge based balance has been calibrated and evaluated in a Mach 5 hypersonic flow. The results are compared with the traditional technique using the foil resistive strain gauge balance, indicating that the proposed balance based on the MOEMS FPI strain gauge is reliable and robust and is potentially suitable for the hypersonic wind tunnel harsh environment.

Apparatus for precision micromachining with lasers

DOEpatents

Chang, Jim J.; Dragon, Ernest P.; Warner, Bruce E.

1998-01-01

A new material processing apparatus using a short-pulsed, high-repetition-rate visible laser for precision micromachining utilizes a near diffraction limited laser, a high-speed precision two-axis tilt-mirror for steering the laser beam, an optical system for either focusing or imaging the laser beam on the part, and a part holder that may consist of a cover plate and a back plate. The system is generally useful for precision drilling, cutting, milling and polishing of metals and ceramics, and has broad application in manufacturing precision components. Precision machining has been demonstrated through percussion drilling and trepanning using this system. With a 30 W copper vapor laser running at multi-kHz pulse repetition frequency, straight parallel holes with size varying from 500 microns to less than 25 microns and with aspect ratios up to 1:40 have been consistently drilled with good surface finish on a variety of metals. Micromilling and microdrilling on ceramics using a 250 W copper vapor laser have also been demonstrated with good results. Materialogroaphic sections of machined parts show little (submicron scale) recast layer and heat affected zone.

Modeling and experimental study on characterization of micromachined thermal gas inertial sensors.

PubMed

Zhu, Rong; Ding, Henggao; Su, Yan; Yang, Yongjun

2010-01-01

Micromachined thermal gas inertial sensors based on heat convection are novel devices that compared with conventional micromachined inertial sensors offer the advantages of simple structures, easy fabrication, high shock resistance and good reliability by virtue of using a gaseous medium instead of a mechanical proof mass as key moving and sensing elements. This paper presents an analytical modeling for a micromachined thermal gas gyroscope integrated with signal conditioning. A simplified spring-damping model is utilized to characterize the behavior of the sensor. The model relies on the use of the fluid mechanics and heat transfer fundamentals and is validated using experimental data obtained from a test-device and simulation. Furthermore, the nonideal issues of the sensor are addressed from both the theoretical and experimental points of view. The nonlinear behavior demonstrated in experimental measurements is analyzed based on the model. It is concluded that the sources of nonlinearity are mainly attributable to the variable stiffness of the sensor system and the structural asymmetry due to nonideal fabrication.

Zero dead volume tube to surface seal

DOEpatents

Benett, William J.; Folta, James A.

2000-01-01

A method and apparatus for connecting a tube to a surface that creates a dead volume seal. The apparatus is composed of three components, a body, a ferrule, and a threaded fitting. The ferrule is compressed onto a tube and a seal is formed between the tube and a device retained in the body by threading the fitting into the body which provides pressure that seals the face of the ferrule to a mating surface on the device. This seal can be used at elevated temperatures depending on the materials used. While the invention has been developed for use with micro-machined silicon wafers used in Capillary Gas Chromatograph (GC), it can be utilized anywhere for making a gas or fluid face seal to the surface of a device that has near zero dead volume.

Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration

NASA Astrophysics Data System (ADS)

Laconte, Jean; Flandre, D.; Raskin, Jean-Pierre

Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost. Micromachined Thin-Film Sensors for SOI-CMOS Co-integration covers the challenges and interests and demonstrates the successful co-integration of gas flow sensors on dielectric membrane, with their associated electronics, in CMOS-SOI technology. We firstly investigate the extraction of residual stress in thin layers and in their stacking and the release, in post-processing, of a 1 μm-thick robust and flat dielectric multilayered membrane using Tetramethyl Ammonium Hydroxide (TMAH) silicon micromachining solution.

Construction and evaluation of a capillary array DNA sequencer based on a micromachined sheath-flow cuvette.

PubMed

Crabtree, H J; Bay, S J; Lewis, D F; Zhang, J; Coulson, L D; Fitzpatrick, G A; Delinger, S L; Harrison, D J; Dovichi, N J

2000-04-01

A capillary array electrophoresis DNA sequencer is reported based on a micromachined sheath-flow cuvette as the detection chamber. This cuvette is equipped with a set of micromachined features that hold the capillaries in precise registration to ensure uniform spacing between the capillaries, in order to generate uniform hydrodynamic flow in the cuvette. A laser beam excites all of the samples simultaneously, and a microscope objective images fluorescence onto a set of avalanche photodiodes, which operate in the analog mode. A high-gain transimpedance amplifier is used for each photodiode, providing high duty-cycle detection of fluorescence.

A silicon micromachined resonant pressure sensor

NASA Astrophysics Data System (ADS)

Tang, Zhangyang; Fan, Shangchun; Cai, Chenguang

2009-09-01

This paper describes the design, fabrication and test of a silicon micromachined resonant pressure sensor. A square membrane and a doubly clamped resonant beam constitute a compound structure. The former senses the pressure directly, while the latter changes its resonant frequency according to deformation of the membrane. The final output relation between the resonant frequency and the applied pressure is deducted according to the structure mechanical properties. Sensors are fabricated by micromachining technology, and then sealed in vaccum. These sensors are tested by open-loop and close-loop system designed on purpose. The experiment results demonstrate that the sensor has a sensitivity of 49.8Hz/kPa and repeatability of 0.08%.

Modeling topology formation during laser ablation

NASA Astrophysics Data System (ADS)

Hodapp, T. W.; Fleming, P. R.

1998-07-01

Micromachining high aspect-ratio structures can be accomplished through ablation of surfaces with high-powered lasers. Industrial manufacturers now use these methods to form complex and regular surfaces at the 10-1000 μm feature size range. Despite its increasingly wide acceptance on the manufacturing floor, the underlying photochemistry of the ablation mechanism, and hence the dynamics of the machining process, is still a question of considerable debate. We have constructed a computer model to investigate and predict the topological formation of ablated structures. Qualitative as well as quantitative agreement with excimer-laser machined polyimide substrates has been demonstrated. This model provides insights into the drilling process for high-aspect-ratio holes.

Micromachined Artificial Haircell

NASA Technical Reports Server (NTRS)

Liu, Chang (Inventor); Engel, Jonathan (Inventor); Chen, Nannan (Inventor); Chen, Jack (Inventor)

2010-01-01

A micromachined artificial sensor comprises a support coupled to and movable with respect to a substrate. A polymer, high-aspect ratio cilia-like structure is disposed on and extends out-of-plane from the support. A strain detector is disposed with respect to the support to detect movement of the support.

Tapered polysilicon core fibers for nonlinear photonics.

PubMed

Suhailin, Fariza H; Shen, Li; Healy, Noel; Xiao, Limin; Jones, Maxwell; Hawkins, Thomas; Ballato, John; Gibson, Ursula J; Peacock, Anna C

2016-04-01

We propose and demonstrate a novel approach to obtaining small-core polysilicon waveguides from the silicon fiber platform. The fibers were fabricated via a conventional drawing tower method and, subsequently, tapered down to achieve silicon core diameters of ∼1  μm, the smallest optical cores for this class of fiber to date. Characterization of the material properties have shown that the taper process helps to improve the local crystallinity of the silicon core, resulting in a significant reduction in the material loss. By exploiting the combination of small cores and low losses, these tapered fibers have enabled the first observation of nonlinear transmission within a polycrystalline silicon waveguide of any type. As the fiber drawing method is highly scalable, it opens a route for the development of low-cost and flexible nonlinear silicon photonic systems.

Separation and Detection of Toxic Gases with a Silicon Micromachined Gas Chromatography System

NASA Technical Reports Server (NTRS)

Kolesar, Edward S.; Reston, Rocky R.

1995-01-01

A miniature gas chromatography (GC) system was designed and fabricated using silicon micromachining and integrated circuit (IC) processing techniques. The silicon micromachined gas chromatography system (SMGCS) is composed of a miniature sample injector that incorporates a 10 microliter sample loop; a 0.9 meter long, rectangular shaped (300 micrometer width and 10 micrometer height) capillary column coated with a 0.2 micrometer thick copper phthalocyanine (CuPc) stationary phase; and a dual detector scheme based upon a CuPc-coated chemiresistor and a commercially available 125 micrometer diameter thermal conductivity detector (TCD) bead. Silicon micromachining was employed to fabricate the interface between the sample injector and the GC column, the column itself, and the dual detector cavity. A novel IC thin-film processing technique was developed to sublime the CuPc stationary phase coating on the column walls that were micromachined in the host silicon wafer substrate and Pyrex (r) cover plate, which were then electrostatically bonded together. The SMGCS can separate binary gas mixtures composed of parts-per-million (ppm) concentrations of ammonia (NH3) and nitrogen dioxide (NO2) when isothermally operated (55-80 degrees C). With a helium carrier gas and nitrogen diluent, a 10 microliter sample volume containing ammonia and nitrogen dioxide injected at 40 psi ((2.8 x 10(exp 5)Pa)) can be separated in less than 30 minutes.

New Effective Material Couple--Oxide Ceramic and Carbon Nanotube-- Developed for Aerospace Microsystem and Micromachine Technologies

NASA Technical Reports Server (NTRS)

Miyoshi, Kazuhisa; VanderWal, Randall L.; Tomasek, Aaron J.; Sayir, Ali; Farmer, Serene C.

2004-01-01

The prime driving force for using microsystem and micromachine technologies in transport vehicles, such as spacecraft, aircraft, and automobiles, is to reduce the weight, power consumption, and volume of components and systems to lower costs and increase affordability and reliability. However, a number of specific issues need to be addressed with respect to using microsystems and micromachines in aerospace applications--such as the lack of understanding of material characteristics; methods for producing and testing the materials in small batches; the limited proven durability and lifetime of current microcomponents, packaging, and interconnections; a cultural change with respect to system designs; and the use of embedded software, which will require new product assurance guidelines. In regards to material characteristics, there are significant adhesion, friction, and wear issues in using microdevices. Because these issues are directly related to surface phenomena, they cannot be scaled down linearly and they become increasingly important as the devices become smaller. When microsystems have contacting surfaces in relative motion, the adhesion and friction affect performance, energy consumption, wear damage, maintenance, lifetime and catastrophic failure, and reliability. Ceramics, for the most part, do not have inherently good friction and wear properties. For example, coefficients of friction in excess of 0.7 have been reported for ceramics and ceramic composite materials. Under Alternate Fuels Foundation Technologies funding, two-phase oxide ceramics developed for superior high-temperature wear resistance in NASA's High Operating Temperature Propulsion Components (HOTPC) project and new two-layered carbon nanotube (CNT) coatings (CNT topcoat/iron bondcoat/quartz substrate) developed in NASA's Revolutionary Aeropropulsion Concepts (RAC) project have been chosen as a materials couple for aerospace applications, including micromachines, in the nanotechnology lubrication task because of their potential for superior friction and wearf properties in air and in an ultrahigh vacuum, spacelike environment. At the NASA Glenn Research Center, two-phase oxide ceramic eutectics, Al2O3/ZrO2(Y2O3), were directionally solidified using the laser-float-zone process, and carbon nanotubes were synthesized within a high-temperature tube furnace at 800 C. Physical vapor deposition was used to coat all quartz substrates with 5-nm-thick iron as catalyst and bondcoat, which formed iron islands resembling droplets and serving as catalyst particles on the quartz. A series of scanning electron micrographs showing multiwalled carbon nanotubes directionally grown as aligned "nanograss" on quartz is presented. Unidirectional sliding friction eperiments were conducted at Glenn with the two-layered CNT coatings in contact with the two-phase Al2O3/ZrO2(Y2O3) eutectics in air and in ultrachigh vacuum. The main criteria for judging the performance of the materials couple for solid lubrication and antistick applications in a space environment were the coefficient of friction and the wear resistance (reciprocal of wear rate), which had to be less than 0.2 and greater than 10(exp 5) N(raised dot)/cubic millimetes, respectively, in ultrahigh vacuum. In air, the coefficient of friction for the CNT coatings in contact with Al2O3/ZrO2 (Y2O3) eutectics was 0.04, one-fourth of that for quartz. In an ultrahigh vacuum, the coefficient of friction for CNT coatings in contact with Al2O3/ZrO2 (Y2O3) was one-third of that for quartz. The two-phase Al2O3/ZrO2 (Y2O3) eutectic coupled with the two-layered CNT coating met the coefficient of friction and wear resistance criteria both in air and in an ultrahigh vacuum, spacelike environment. This material's couple can dramatically improve the stiction (or adhesion), friction, and wear resistance of the contacting surfaces, which are major issues for microdevices and micromachines.

Analysis of the surface effects on adhesion in MEMS structures

NASA Astrophysics Data System (ADS)

Rusu, F.; Pustan, M.; Bîrleanu, C.; Müller, R.; Voicu, R.; Baracu, A.

2015-12-01

One of the main failure causes in microelectromechanical systems (MEMS) is stiction. Stiction is the adhesion of contacting surfaces due to surface forces. Adhesion force depends on the operating conditions and is influenced by the contact area. In this study, the adhesion force between MEMS materials and the AFM tips is analyzed using the spectroscopy in point mode of the AFM. The aim is to predict the stiction failure mode in MEMS. The investigated MEMS materials are silicon, polysilicon, platinum, aluminum, and gold. Three types of investigations were conducted. The first one aimed to determine the variation of the adhesion force with respect to the variation of the roughness. The roughness has a strong influence on the adhesion because the contact area between components increases if the roughness decreases. The second type of investigation aimed to determine the adhesion force in multiple points of each considered sample. The values obtained experimentally for the adhesion force were also validated using the JKR and DMT models. The third type of investigation was conducted with the purpose of determining the influence of the temperature on the adhesion force.

Microfluidic fuel cell systems with embedded materials and structures and method thereof

DOEpatents

Morse, Jeffrey D.; Rose, Klint A; Maghribi, Mariam; Benett, William; Krulevitch, Peter; Hamilton, Julie; Graff, Robert T.; Jankowski, Alan

2005-07-26

Described herein is a process for fabricating microfluidic systems with embedded components in which micron-scale features are molded into the polymeric material polydimethylsiloxane (PDMS). Micromachining is used to create a mold master and the liquid precursors for PDMS are poured over the mold and allowed to cure. The PDMS is then removed form the mold and bonded to another material such as PDMS, glass, or silicon after a simple surface preparation step to form sealed microchannels.

Micromachined TWTs for THz Radiation Sources

NASA Technical Reports Server (NTRS)

Booske, John H.; vanderWeide, Daniel W.; Kory, Carol L.; Limbach, S.; Downey, Alan (Technical Monitor)

2001-01-01

The Terahertz (THz) region of the electromagnetic spectrum (about 300 - 3000 GHz in frequency or about 0.1 - 1 mm free space wavelength) has enormous potential for high-data-rate communications, spectroscopy, astronomy, space research, medicine, biology, surveillance, remote sensing, industrial process control, etc. It has been characterized as the most scientifically rich, yet under-utilized, region of the electromagnetic spectrum. The most critical roadblock to full exploitation of the THz band is lack of coherent radiation sources that are powerful (0.001 - 1.0 W continuous wave), efficient (> 1%), frequency agile (instantaneously tunable over 1% bandwidths or more), reliable, and comparatively inexpensive. To develop vacuum electron device (VED) radiation sources satisfying these requirements, fabrication and packaging approaches must be heavily considered to minimize costs, in addition to the basic interaction physics and circuit design. To minimize size of the prime power supply, beam voltage must be minimized, preferably 10 kV. Solid state sources satisfy the low voltage requirement, but are many orders of magnitude below power, efficiency, and bandwidth requirements. On the other hand, typical fast-wave VED sources in this regime (e.g., gyrotrons, FELs) tend to be large, expensive, high voltage and very high power devices unsuitable for most of the applications cited above. VEDs based on grating or inter-digital (ID) circuits have been researched and developed. However, achieving forward-wave amplifier operation with instantaneous fractional bandwidths > 1% is problematic for these devices with low-energy (< 15 kV) electron beams. Moreover, the interaction impedance is quite low unless the beam-circuit spacing is kept particularly narrow, often leading to significant beam interception. One solution to satisfy the THz source requirements mentioned above is to develop micromachined VEDs, or "micro-VEDs". Among other benefits, micro-machining technologies provide superior high frequency wall conductivity as a result of superior surface smoothness compared with conventional mechanical or electric discharge machining approaches. Micro-VED technologies are already being applied to the development of millimeter-wave klystrons at Stanford Linear Accelerator Center and submillimeter-wave klystrons at the University of Leeds. We are investigating the use of micro-machining technologies to develop THz regime TWTs, with emphasis on folded-waveguide TWTs. The folded-waveguide TWT (FW-TWT) has several features that make it attractive for THz-regime micro-VED applications. It is a relatively simple circuit to design and fabricate, it is amenable to precision pattern replication by micro-machining, and it is has been demonstrated capable of forward-wave amplification with appreciable bandwidth. We are conducting experimental and computational studies of micro-VED FW-TWTs to examine their feasibility for applications at frequencies from 200 - 1000 GHz.

Understanding the electrical characteristics of micromotors

NASA Astrophysics Data System (ADS)

Emadi, Ali; Irudayaraj, Sujay S.

2005-06-01

This paper presents a comprehensive list of issues related to the electrical characteristics of both electrostatic and electromagnetic micromotors and aims at understanding the behavior of the micromotor from the electrical standpoint. The paper takes the step-by-step approach by first presenting an overview of the laws of electrostatics and electromagnetism for micromachines, their applicability, features and limitations, and then progresses to independently analyze some of the important machine related quantities like electromotive torque, force-output, angular frequencies, supply conditions and requirements, for different types of electrostatic and electromagnetic micromotor constructions. A thorough study on the electric machine parameters that affect the performance of the micromotor need to be performed, since it would serve as a useful link in integrating the micromachine output performance with the fabrication process and challenges associated with it. Achieving such integration would then determine the optimized working condition for the micromotor. The main reason for this study is that although significant advancements have fostered the growth of micromotors in the recent past which has led to the establishment of the micromotor as quite a remarkable machine for powering micromechanical devices, and also as an industrial requirement for various applications, there has always been a concern about the optimal performance of the micromotor, since there is more than just one technology that is being incorporated to realize the micromotor. With fields ranging from surface engineering and chemistry to material science engineering exerting influence on the micromotor design, it becomes very important to completely comprehend the electrophysics of the micromachine that would in turn interact with the science of fabrication to result in the development of better micromotors with considerably less functional complexity.

Low cost, patterning of human hNT brain cells on parylene-C with UV & IR laser machining.

PubMed

Raos, Brad J; Unsworth, C P; Costa, J L; Rohde, C A; Doyle, C S; Delivopoulos, E; Murray, A F; Dickinson, M E; Simpson, M C; Graham, E S; Bunting, A S

2013-01-01

This paper describes the use of 800nm femtosecond infrared (IR) and 248nm nanosecond ultraviolet (UV) laser radiation in performing ablative micromachining of parylene-C on SiO2 substrates for the patterning of human hNT astrocytes. Results are presented that support the validity of using IR laser ablative micromachining for patterning human hNT astrocytes cells while UV laser radiation produces photo-oxidation of the parylene-C and destroys cell patterning. The findings demonstrate how IR laser ablative micromachining of parylene-C on SiO2 substrates can offer a low cost, accessible alternative for rapid prototyping, high yield cell patterning.

Micromachined peristaltic pump

NASA Technical Reports Server (NTRS)

Hartley, Frank T. (Inventor)

1998-01-01

A micromachined pump including a channel formed in a semiconductor substrate by conventional processes such as chemical etching. A number of insulating barriers are established in the substrate parallel to one another and transverse to the channel. The barriers separate a series of electrically conductive strips. An overlying flexible conductive membrane is applied over the channel and conductive strips with an insulating layer separating the conductive strips from the conductive membrane. Application of a sequential voltage to the series of strips pulls the membrane into the channel portion of each successive strip to achieve a pumping action. A particularly desirable arrangement employs a micromachined push-pull dual channel cavity employing two substrates with a single membrane sandwiched between them.

Optimization of design parameters for bulk micromachined silicon membranes for piezoresistive pressure sensing application

NASA Astrophysics Data System (ADS)

Belwanshi, Vinod; Topkar, Anita

2016-05-01

Finite element analysis study has been carried out to optimize the design parameters for bulk micro-machined silicon membranes for piezoresistive pressure sensing applications. The design is targeted for measurement of pressure up to 200 bar for nuclear reactor applications. The mechanical behavior of bulk micro-machined silicon membranes in terms of deflection and stress generation has been simulated. Based on the simulation results, optimization of the membrane design parameters in terms of length, width and thickness has been carried out. Subsequent to optimization of membrane geometrical parameters, the dimensions and location of the high stress concentration region for implantation of piezoresistors have been obtained for sensing of pressure using piezoresistive sensing technique.

VIEW OF MICROMACHINING, HIGH PRECISION EQUIPMENT USED TO CUSTOM MAKE ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

VIEW OF MICRO-MACHINING, HIGH PRECISION EQUIPMENT USED TO CUSTOM MAKE SMALL PARTS. LUMPS OF CLAY; SHOWN IN THE PHOTOGRAPH, WERE USED TO STABILIZE PARTS BEING MACHINED. (11/1/87) - Rocky Flats Plant, Stainless Steel & Non-Nuclear Components Manufacturing, Southeast corner of intersection of Cottonwood & Third Avenues, Golden, Jefferson County, CO

Flat-plate solar array project. Volume 4: High-efficiency solar cells

NASA Technical Reports Server (NTRS)

Leipold, M.; Cheng, L.; Daud, T.; Mokashi, A.; Burger, D.; Christensen, E. (Editor); Murry, J. (Editor); Bengelsdorf, I. (Editor)

1986-01-01

The High Efficiency Solar Cell Task was assigned the objective of understanding and developing high efficiency solar cell devices that would meet the cost and performance goals of the Flat Plate Solar Array (FSA) Project. The need for research dealing with high efficiency devices was considered important because of the role efficiency plays in reducing price per watt of generated energy. The R&D efforts conducted during the 1982 to 1986 period are summarized to provide understanding and control of energy conversion losses associated with crystalline silicon solar cells. New levels of conversion efficiency were demonstrated. Major contributions were made both to the understanding and reduction of bulk and surface losses in solar cells. For example, oxides, nitrides, and polysilicon were all shown to be potentially useful surface passivants. Improvements in measurement techniques were made and Auger coefficients and spectral absorption data were obtained for unique types of silicon sheets. New modelling software was developed including a program to optimize a device design based on input characteristics of a cell.

Femtosecond laser micromachining of polylactic acid/graphene composites for designing interdigitated microelectrodes for sensor applications

NASA Astrophysics Data System (ADS)

Paula, Kelly T.; Gaál, Gabriel; Almeida, G. F. B.; Andrade, M. B.; Facure, Murilo H. M.; Correa, Daniel S.; Riul, Antonio; Rodrigues, Varlei; Mendonça, Cleber R.

2018-05-01

There is an increasing interest in the last years towards electronic applications of graphene-based materials and devices fabricated from patterning techniques, with the ultimate goal of high performance and temporal resolution. Laser micromachining using femtosecond pulses is an attractive methodology to integrate graphene-based materials into functional devices as it allows changes to the focal volume with a submicrometer spatial resolution due to the efficient nonlinear nature of the absorption, yielding rapid prototyping for innovative applications. We present here the patterning of PLA-graphene films spin-coated on a glass substrate using a fs-laser at moderate pulse energies to fabricate interdigitated electrodes having a minimum spatial resolution of 5 μm. Raman spectroscopy of the PLA-graphene films indicated the presence of multilayered graphene fibers. Subsequently, the PLA-graphene films were micromachined using a femtosecond laser oscillator delivering 50-fs pulses and 800 nm, where the pulse energy and scanning speed was varied in order to determine the optimum irradiation parameters (16 nJ and 100 μm/s) to the fabrication of microstructures. The micromachined patterns were characterized by optical microscopy and submitted to electrical measurements in liquid samples, clearly distinguishing all tastes tested. Our results confirm the femtosecond laser micromachining technique as an interesting approach to efficiently pattern PLA-graphene filaments with high precision and minimal mechanical defects, allowing the easy fabrication of interdigitated structures and an alternative method to those produced by conventional photolithography.

Release Resistant Electrical Interconnections For Mems Devices

DOEpatents

Peterson, Kenneth A.; Garrett, Stephen E.; Reber, Cathleen A.

2005-02-22

A release resistant electrical interconnection comprising a gold-based electrical conductor compression bonded directly to a highly-doped polysilicon bonding pad in a MEMS, IMEMS, or MOEMS device, without using any intermediate layers of aluminum, titanium, solder, or conductive adhesive disposed in-between the conductor and polysilicon pad. After the initial compression bond has been formed, subsequent heat treatment of the joint above 363 C creates a liquid eutectic phase at the bondline comprising gold plus approximately 3 wt % silicon, which, upon re-solidification, significantly improves the bond strength by reforming and enhancing the initial bond. This type of electrical interconnection is resistant to chemical attack from acids used for releasing MEMS elements (HF, HCL), thereby enabling the use of a "package-first, release-second" sequence for fabricating MEMS devices. Likewise, the bond strength of an Au--Ge compression bond may be increased by forming a transient liquid eutectic phase comprising Au-12 wt % Ge.

High voltage MOSFET devices and methods of making the devices

DOE Office of Scientific and Technical Information (OSTI.GOV)

Banerjee, Sujit; Matocha, Kevin; Chatty, Kiran

A SiC MOSFET device having low specific on resistance is described. The device has N+, P-well and JFET regions extended in one direction (Y-direction) and P+ and source contacts extended in an orthogonal direction (X-direction). The polysilicon gate of the device covers the JFET region and is terminated over the P-well region to minimize electric field at the polysilicon gate edge. In use, current flows vertically from the drain contact at the bottom of the structure into the JFET region and then laterally in the X direction through the accumulation region and through the MOSFET channels into the adjacent N+more » region. The current flowing out of the channel then flows along the N+ region in the Y-direction and is collected by the source contacts and the final metal. Methods of making the device are also described.« less

Design, Simulation and Characteristics Research of the Interface Circuit based on nano-polysilicon thin films pressure sensor

NASA Astrophysics Data System (ADS)

Zhao, Xiaosong; Zhao, Xiaofeng; Yin, Liang

2018-03-01

This paper presents a interface circuit for nano-polysilicon thin films pressure sensor. The interface circuit includes consist of instrument amplifier and Analog-to-Digital converter (ADC). The instrumentation amplifier with a high common mode rejection ratio (CMRR) is implemented by three stages current feedback structure. At the same time, in order to satisfy the high precision requirements of pressure sensor measure system, the 1/f noise corner of 26.5 mHz can be achieved through chopping technology at a noise density of 38.2 nV/sqrt(Hz).Ripple introduced by chopping technology adopt continuous ripple reduce circuit (RRL), which achieves the output ripple level is lower than noise. The ADC achieves 16 bits significant digit by adopting sigma-delta modulator with fourth-order single-bit structure and digital decimation filter, and finally achieves high precision integrated pressure sensor interface circuit.

High voltage MOSFET devices and methods of making the devices

DOEpatents

Banerjee, Sujit; Matocha, Kevin; Chatty, Kiran

2015-12-15

A SiC MOSFET device having low specific on resistance is described. The device has N+, P-well and JFET regions extended in one direction (Y-direction) and P+ and source contacts extended in an orthogonal direction (X-direction). The polysilicon gate of the device covers the JFET region and is terminated over the P-well region to minimize electric field at the polysilicon gate edge. In use, current flows vertically from the drain contact at the bottom of the structure into the JFET region and then laterally in the X direction through the accumulation region and through the MOSFET channels into the adjacent N+ region. The current flowing out of the channel then flows along the N+ region in the Y-direction and is collected by the source contacts and the final metal. Methods of making the device are also described.

A Step Made Toward Designing Microelectromechanical System (MEMS) Structures With High Reliability

NASA Technical Reports Server (NTRS)

Nemeth, Noel N.

2003-01-01

The mechanical design of microelectromechanical systems-particularly for micropower generation applications-requires the ability to predict the strength capacity of load-carrying components over the service life of the device. These microdevices, which typically are made of brittle materials such as polysilicon, show wide scatter (stochastic behavior) in strength as well as a different average strength for different sized structures (size effect). These behaviors necessitate either costly and time-consuming trial-and-error designs or, more efficiently, the development of a probabilistic design methodology for MEMS. Over the years, the NASA Glenn Research Center s Life Prediction Branch has developed the CARES/Life probabilistic design methodology to predict the reliability of advanced ceramic components. In this study, done in collaboration with Johns Hopkins University, the ability of the CARES/Life code to predict the reliability of polysilicon microsized structures with stress concentrations is successfully demonstrated.

Focused ion beam-assisted technology in sub-picolitre micro-dispenser fabrication

NASA Astrophysics Data System (ADS)

Lopez, M. J.; Caballero, D.; Campo, E. M.; Perez-Castillejos, R.; Errachid, A.; Esteve, J.; Plaza, J. A.

2008-07-01

Novel medical and biological applications are driving increased interest in the fabrication of micropipette or micro-dispensers. Reduced volume samples and drug dosages are prime motivators in this effort. We have combined microfabrication technology with ion beam milling techniques to successfully produce cantilever-type polysilicon micro-dispensers with 3D enclosed microchannels. The microfabrication technology described here allows for the designing of nozzles with multiple shapes. The contribution of ion beam milling has had a large impact on the fabrication process and on further customizing shapes of nozzles and inlet ports. Functionalization tests were conducted to prove the viability of ion beam-fabricated micro-dispensers. Self-assembled monolayers were successfully formed when a gold surface was patterned with a thiol solution dispensed by the fabricated micro-dispensers.

Etude de la texture des rubans EPR de silicium polycristallin photovoltaïque

NASA Astrophysics Data System (ADS)

Chibani, A.; Gauthier, R.; Pinard, P.; Andonov, P.

1991-09-01

EPR polysilicon ribbons are obtained from a 5N-6N purity grade silicon powder melting followed by a recrystallization step. Being assigned to the photocell manufacture, we study the texture by X-ray diffraction method to reveal the majority of the crystal orientations and prove the eventual existence of specific orientations adapted to the best photovoltaic conversion efficiencies such as (100), (110) or (111). Moreover, we tested the possibility to induce the (111) orientation with a monocrystalline seed having this orientation. It appears that the crystal growth is essentially anisotropic and that only the orientation of the grains with their (331) planes parallel to the ribbon surface may be considered as dominant after the recrystallization step; finally, the (111) starting seed has an effect only at the recrystallization onset.

A dual-reflective electrothermal MEMS micromirror for full circumferential scanning endoscopic imaging

NASA Astrophysics Data System (ADS)

Wu, Lei; Xie, Huikai

2008-02-01

This paper reports the design, fabrication and measurements of a dual-reflective, single-crystal silicon based micromirror that can perform full circumferential scanning (FCS) for endoscopic optical coherence tomography (EOCT). In the proposed FCS-EOCT probe, two optical fibers are used to deliver light beams to either surface of the micromirror, which can rotate +/-45° (or 90°) and thus a 180° optical scanning is obtained from each mirror surface, resulting in full circumferential scans. A novel surface- and bulk-combined micromachining process based on SOI wafers is developed for fabricating the dual reflective micromirror. The single-crystal-silicon device layer of SOI wafers is used for mirror flatness, and Al is coated on both sides for high reflectivity. With one light beam delivered to each mirror surface, full 360° scans have been observed. Other measured data include the resonant frequency: 328Hz, radius of curvatures: - 124 mm (front surface) and 127 mm (back surface), and the reflectances: 81.3% (front surface) and 79.0% (back surface).

Underwater superoleophobicity, anti-oil and ultra-broadband enhanced absorption of metallic surfaces produced by a femtosecond laser inspired by fish and chameleons

NASA Astrophysics Data System (ADS)

Yin, K.; Song, Y. X.; Dong, X. R.; Wang, C.; Duan, J. A.

2016-11-01

Reported here is the bio-inspired and robust function of underwater superoleophobic, anti-oil metallic surfaces with ultra-broadband enhanced optical absorption obtained through femtosecond laser micromachining. Three distinct surface structures are fabricated using a wide variety of processing parameters. Underwater superoleophobic and anti-oil surfaces containing coral-like microstructures with nanoparticles and mount-like microstructures are achieved. These properties of the as-prepared surfaces exhibit good chemical stability when exposed to various types of oils and when immersed in water with a wide range of pH values. Moreover, coral-like microstructures with nanoparticle surfaces show strongly enhanced optical absorption over a broadband wavelength range from 0.2-25 μm. The potential mechanism for the excellent performance of the coral-like microstructures with a nanoparticle surface is also discussed. This multifunctional surface has potential applications in military submarines, amphibious military aircraft and tanks, and underwater anti-oil optical counter-reconnaissance devices.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Galambos, Paul C.

This is the latest in a series of LDRD's that we have been conducting with Florida State University/Florida A&M University (FSU/FAMU) under the campus executive program. This research builds on the earlier projects; ''Development of Highly Integrated Magnetically and Electrostatically Actuated Micropumps'' (SAND2003-4674) and ''Development of Magnetically and Electrostatically Driven Surface Micromachined Pumps'' (SAND2002-0704P). In this year's LDRD we designed 2nd generation of surface micromachined (SMM) gear and viscous pumps. Two SUMMiT{trademark} modules full of design variations of these pumps were fabricated and one SwIFT{trademark} module is still in fabrication. The SwIFT{trademark} fabrication process results in a transparent pump housingmore » cover that will enable visualization inside the pumps. Since the SwIFT{trademark} pumps have not been tested as they are still in fabrication, this report will focus on the 2nd generation SUMMiT{trademark} designs. Pump testing (pressure vs. flow) was conducted on several of the SUMMiT{trademark} designs resulting in the first pump curve for this class of SMM pumps. A pump curve was generated for the higher torque 2nd generation gear pump designed by Jason Hendrix of FSU. The pump maximum flow rate at zero head was 6.5 nl/s for a 30V, 30 Hz square wave signal. This level of flow rate would be more than adequate for our typical SMM SUMMiT{trademark} or SwIFT{trademark} channels which have typical volumes on the order of 50 pl.« less

Micromachined force-balance feedback accelerometer with optical displacement detection

DOEpatents

Nielson, Gregory N.; Langlois, Eric; Baker, Michael; Okandan, Murat; Anderson, Robert

2014-07-22

An accelerometer includes a proof mass and a frame that are formed in a handle layer of a silicon-on-an-insulator (SOI). The proof mass is separated from the frame by a back-side trench that defines a boundary of the proof mass. The accelerometer also includes a reflector coupled to a top surface of the proof mass. An optical detector is located above the reflector at the device side. The accelerometer further includes at least one suspension spring. The suspension spring has a handle anchor that extends downwards from the device side to the handle layer to mechanically support upward and downward movement of the proof mass relative to a top surface of the proof mass.

Micromachined magnetohydrodynamic actuators and sensors

DOEpatents

Lee, Abraham P.; Lemoff, Asuncion V.

2000-01-01

A magnetohydrodynamic (MHD) micropump and microsensor which utilizes micromachining to integrate the electrodes with microchannels and includes a magnet for producing magnetic fields perpendicular to both the electrical current direction and the fluid flow direction. The magnet can also be micromachined and integrated with the micropump using existing technology. The MHD micropump, for example, can generate continuous, reversible flow, with readily controllable flow rates. The flow can be reversed by either reversing the electrical current flow or reversing the magnetic field. By mismatching the electrodes, a swirling vortex flow can be generated for potential mixing applications. No moving parts are necessary and the dead volume is minimal. The micropumps can be placed at any position in a fluidic circuit and a combination of micropumps can generate fluidic plugs and valves.

Micro benchtop optics by bulk silicon micromachining

DOEpatents

Lee, Abraham P.; Pocha, Michael D.; McConaghy, Charles F.; Deri, Robert J.

2000-01-01

Micromachining of bulk silicon utilizing the parallel etching characteristics of bulk silicon and integrating the parallel etch planes of silicon with silicon wafer bonding and impurity doping, enables the fabrication of on-chip optics with in situ aligned etched grooves for optical fibers, micro-lenses, photodiodes, and laser diodes. Other optical components that can be microfabricated and integrated include semi-transparent beam splitters, micro-optical scanners, pinholes, optical gratings, micro-optical filters, etc. Micromachining of bulk silicon utilizing the parallel etching characteristics thereof can be utilized to develop miniaturization of bio-instrumentation such as wavelength monitoring by fluorescence spectrometers, and other miniaturized optical systems such as Fabry-Perot interferometry for filtering of wavelengths, tunable cavity lasers, micro-holography modules, and wavelength splitters for optical communication systems.

Experimental Performance of a Micromachined Heat Flux Sensor

NASA Technical Reports Server (NTRS)

Stefanescu, S.; DeAnna, R. G.; Mehregany, M.

1998-01-01

Steady-state and frequency response calibration of a microfabricated heat-flux sensor have been completed. This sensor is batch fabricated using standard, micromachining techniques, allowing both miniaturization and the ability to create arrays of sensors and their corresponding interconnects. Both high-frequency and spatial response is desired, so the sensors are both thin and of small cross-sectional area. Thin-film, temperature-sensitive resistors are used as the active gauge elements. Two sensor configurations are investigated: (1) a Wheatstone-bridge using four resistors; and (2) a simple, two-resistor design. In each design, one resistor (or pair) is covered by a thin layer (5000 A) thermal barrier; the other resistor (or pair) is covered by a thick (5 microns) thermal barrier. The active area of a single resistor is 360 microns by 360 microns; the total gauge area is 1.5 mm square. The resistors are made of 2000 A-thick metal; and the entire gauge is fabricated on a 25 microns-thick flexible, polyimide substrate. Heat flux through the surface changes the temperature of the resistors and produces a corresponding change in resistance. Sensors were calibrated using two radiation heat sources: (1) a furnace for steady-state, and (2) a light and chopper for frequency response.

Development of a femtosecond micromachining workstation by use of spectral interferometry.

PubMed

Bera, Sudipta; Sabbah, A J; Durfee, Charles G; Squier, Jeff A

2005-02-15

A workstation that permits real-time measurement of ablation depth while micromachining with femtosecond laser pulses is demonstrated. This method incorporates the unamplified pulse train that is available in a chirped-pulse amplification system as the probe in an arrangement that uses spectral interferometry to measure the ablation depth while cutting with the amplified pulse in thin metal films.

High speed micromachining with high power UV laser

NASA Astrophysics Data System (ADS)

Patel, Rajesh S.; Bovatsek, James M.

2013-03-01

Increasing demand for creating fine features with high accuracy in manufacturing of electronic mobile devices has fueled growth for lasers in manufacturing. High power, high repetition rate ultraviolet (UV) lasers provide an opportunity to implement a cost effective high quality, high throughput micromachining process in a 24/7 manufacturing environment. The energy available per pulse and the pulse repetition frequency (PRF) of diode pumped solid state (DPSS) nanosecond UV lasers have increased steadily over the years. Efficient use of the available energy from a laser is important to generate accurate fine features at a high speed with high quality. To achieve maximum material removal and minimal thermal damage for any laser micromachining application, use of the optimal process parameters including energy density or fluence (J/cm2), pulse width, and repetition rate is important. In this study we present a new high power, high PRF QuasarR 355-40 laser from Spectra-Physics with TimeShiftTM technology for unique software adjustable pulse width, pulse splitting, and pulse shaping capabilities. The benefits of these features for micromachining include improved throughput and quality. Specific example and results of silicon scribing are described to demonstrate the processing benefits of the Quasar's available power, PRF, and TimeShift technology.

Nanoelectrospray ion generation for high-throughput mass spectrometry using a micromachined ultrasonic ejector array

DOE Office of Scientific and Technical Information (OSTI.GOV)

Aderogba, S.; Meacham, J.M.; Degertekin, F.L.

2005-05-16

Ultrasonic electrospray ionization (ESI) for high-throughput mass spectrometry is demonstrated using a silicon micromachined microarray. The device uses a micromachined ultrasonic atomizer operating in the 900 kHz-2.5 MHz range for droplet generation and a metal electrode in the fluid cavity for ionization. Since the atomization and ionization processes are separated, the ultrasonic ESI source shows the potential for operation at low voltages with a wide range of solvents in contrast with conventional capillary ESI technology. This is demonstrated using the ultrasonic ESI microarray to obtain the mass spectrum of a 10 {mu}M reserpine sample on a time of flight massmore » spectrometer with 197:1 signal-to-noise ratio at an ionization potential of 200 V.« less

UV laser-assisted wire stripping and micro-machining

NASA Astrophysics Data System (ADS)

Martyniuk, Jerry

1994-02-01

Results are reported for the use of a 266 nm frequency quadrupled Nd:YAG ultraviolet laser in the areas of wire stripping of small coaxial type transmission lines and for micro-machining of various materials including copper, glass, polyimide and DuPont TEFLONTM. This new laser is typically run with a 2 KHz repetition rate, 40 ns FWHM pulse and a fluence of about 50 joules/cm2 which makes it possible to micro-machine metals, polymers, glasses and ceramics. The high fluence of this laser allows shielding structures such as Al-MylarTM, Al-KaptonTM or the plated copper used in small coaxial cables to be precisely cut. Cut rates are reported for the above materials as well as results and photos of wire stripping and micro- machining.

Cost-effective MEMS piezoresistive cantilever-based sensor fabrication for gait movement analysis

NASA Astrophysics Data System (ADS)

Saadon, Salem; Anuar, A. F. M.; Wahab, Yufridin

2017-03-01

The conventional photolithography of crystalline silicon technique is limited to two-dimensional and structure scaling. It's also requiring a lot of time and chemical involves for the whole process. These problems can be overcome by using laser micromachining technique, that capable to produce three-dimensional structure and simultaneously avoiding the photo mask needs. In this paper, we reported on the RapidX-250 Excimer laser micromachining with 248 nm KrF to create in-time mask design and assisting in the fabrication process of piezo-resistive micro cantilever structures. Firstly, laser micromachining parameters have been investigated in order to fabricate the acceleration sensor to analyzing human gait movement. Preliminary result shows that the fabricated sensor able to define the movement difference of human motion regarding the electrical characteristic of piezo-resistor.

Optical micromachined ultrasound transducers (OMUT)--a new approach for high-frequency transducers.

PubMed

Tadayon, Mohammad Amin; Ashkenazi, Shai

2013-09-01

The sensitivity and reliability of piezoelectric ultrasound transducers severely degrade in applications requiring high frequency and small element size. Alternative technologies such as capacitive micromachined ultrasound transducers (CMUT) and optical sensing and generation of ultrasound have been proposed and studied for several decades. In this paper, we present a new type of device based on optical micromachined ultrasound transducer (OMUT) technology. OMUTs rely on microfabrication techniques to construct micrometerscale air cavities capped by an elastic membrane. A modified photoresist bonding process has been developed to facilitate the fabrication of these devices. We will describe the design, fabrication, and testing of prototype OMUT devices which implement a receive-only function. Future design modifications are proposed for incorporating complete transmit¿receive functionality in a single element.

A Micromachined Geometric Moire Interferometric Floating-Element Shear Stress Sensor

NASA Technical Reports Server (NTRS)

Horowitz, S.; Chen, T.; Chandrasekaran, V.; Tedjojuwono, K.; Nishida, T.; Cattafesta, L.; Sheplak, M.

2004-01-01

This paper presents the development of a floating-element shear stress sensor that permits the direct measurement of skin friction based on geometric Moir interferometry. The sensor was fabricated using an aligned wafer-bond/thin-back process producing optical gratings on the backside of a floating element and on the top surface of the support wafer. Experimental characterization indicates a static sensitivity of 0.26 microns/Pa, a resonant frequency of 1.7 kHz, and a noise floor of 6.2 mPa/(square root)Hz.

Research on the effect of coverage rate on the surface quality in laser direct writing process

NASA Astrophysics Data System (ADS)

Pan, Xuetao; Tu, Dawei

2017-07-01

Direct writing technique is usually used in femtosecond laser two-photon micromachining. The size of the scanning step is an important factor affecting the surface quality and machining efficiency of micro devices. According to the mechanism of two-photon polymerization, combining the distribution function of light intensity and the free radical concentration theory, we establish the mathematical model of coverage of solidification unit, then analyze the effect of coverage on the machining quality and efficiency. Using the principle of exposure equivalence, we also obtained the analytic expressions of the relationship among the surface quality characteristic parameters of microdevices and the scanning step, and carried out the numerical simulation and experiment. The results show that the scanning step has little influence on the surface quality of the line when it is much smaller than the size of the solidification unit. However, with increasing scanning step, the smoothness of line surface is reduced rapidly, and the surface quality becomes much worse.

Instability in radiatively melted silicon films

NASA Astrophysics Data System (ADS)

Jackson, K. A.; Kurtze, Douglas A.

1985-04-01

Bosch and Lemons [Phys. Rev. Letters 47 (1981) 1151] were first to report that on heating of silicon with a laser, the heated area can break up into small regions of solid and liquid. Thus phenomenon produces undesirable surface roughness on silicon which has been melted using irradiation from a laser or heat lamps. It is due to the higher reflectivity of liquid silicon so that radiative heating produces small regions of superheated solid in contact with small regions of supercooled liquid. In this paper, the instabilities resulting from this unusual thermal situation have been analyzed. It is shown that a stable pattern can develop provided that the spacing between the solid and liquid is small enough. For a 1/2 μm thick layer of polysilicon on silica, the calculated stable spacing is less than about 10 μm, in accord with experiment.

DNA Electrical Overstress - Hardness Assurance Data Volume.

DTIC Science & Technology

1980-07-28

boundaries due to its somewhat polysilicon nature. The grain boundaries and surface states increase the resistance measured for a particular structure and...1.3e0e0IE+ .go 9. 4Li,.4fE+43 1 . 𔃻L0 E - ,I E -. L , * I’ LI0O IVIE-.L"-’ j . OL )0 E It .=.. flOO ’II I . 00LIL-EI00 51 .I0.’LE*.1 I.04h.IC E’".L141...8217 .Ti0E+ :.’ 1 " aOE.C𔃻 0.00000 0 0 E ,. . Ol J.AE*0 - ?.,E-0 5 -1-6100000E-0j .- o Ei1 a.. 000e0E-00a .. ,C v3E-; Q ._*, - -4E-0N 1 4 .000E001 1.1 0aOE+OI

Optimization of micromachined membrane switches

NASA Astrophysics Data System (ADS)

Hiltmann, Kai; Lang, Walter

1997-09-01

We have determined the minimum dimensions for micromachined membrane switches in several experiments, both regarding the strength of the membranes themselves and the elongations required for safe switching performance. Based on these data, pressure switches for voltages of 10 - 100 V were made as single and multiple elements and tested. Test results, with scatter of pressure threshold data in the ten per cent range, prove very encouraging for further development.

Micromachined Parts Advance Medicine, Astrophysics, and More

NASA Technical Reports Server (NTRS)

2015-01-01

In the mid-1990s, Marshall Space Flight Center awarded two SBIR contracts to Potomac Photonics, now based in Baltimore, for the development of computerized workstations capable of mass-producing tiny, intricate, diffractive optical elements. While the company has since discontinued the workstations, those contracts set the stage for Potomac Photonics to be a leader in the micromachining industry, where NASA remains one of its clients.

3-D laser patterning process utilizing horizontal and vertical patterning

DOEpatents

Malba, Vincent; Bernhardt, Anthony F.

2000-01-01

A process which vastly improves the 3-D patterning capability of laser pantography (computer controlled laser direct-write patterning). The process uses commercially available electrodeposited photoresist (EDPR) to pattern 3-D surfaces. The EDPR covers the surface of a metal layer conformally, coating the vertical as well as horizontal surfaces. A laser pantograph then patterns the EDPR, which is subsequently developed in a standard, commercially available developer, leaving patterned trench areas in the EDPR. The metal layer thereunder is now exposed in the trench areas and masked in others, and thereafter can be etched to form the desired pattern (subtractive process), or can be plated with metal (additive process), followed by a resist stripping, and removal of the remaining field metal (additive process). This improved laser pantograph process is simpler, faster, move manufacturable, and requires no micro-machining.

Recent advances in particle and droplet manipulation for lab-on-a-chip devices based on surface acoustic waves.

PubMed

Wang, Zhuochen; Zhe, Jiang

2011-04-07

Manipulation of microscale particles and fluid liquid droplets is an important task for lab-on-a-chip devices for numerous biological researches and applications, such as cell detection and tissue engineering. Particle manipulation techniques based on surface acoustic waves (SAWs) appear effective for lab-on-a-chip devices because they are non-invasive, compatible with soft lithography micromachining, have high energy density, and work for nearly any type of microscale particles. Here we review the most recent research and development of the past two years in SAW based particle and liquid droplet manipulation for lab-on-a-chip devices including particle focusing and separation, particle alignment and patterning, particle directing, and liquid droplet delivery.

Weaves as an Interconnection Fabric for ASIM's and Nanosatellites

NASA Technical Reports Server (NTRS)

Gorlick, Michael M.

1995-01-01

Many of the micromachines under consideration require computer support, indeed, one of the appeals of this technology is the ability to intermix mechanical, optical, analog, and digital devices on the same substrate. The amount of computer power is rarely an issue, the sticking point is the complexity of the software required to make effective use of these devices. Micromachines are the nano-technologist's equivalent of 'golden screws'. In other words, they will be piece parts in larger assemblages. For example, a nano-satellite may be composed of stacked silicon wafers where each wafer contains hundreds to thousands of micromachines, digital controllers, general purpose computers, memories, and high-speed bus interconnects. Comparatively few of these devices will be custom designed, most will be stock parts selected from libraries and catalogs. The novelty will lie in the interconnections. For example, a digital accelerometer may be a component part in an adaptive suspension, a monitoring element embedded in the wrapper of a package, or a portion of the smart skin of a launch vehicle. In each case, this device must inter-operate with other devices and probes for the purposes of command, control, and communication. We propose a software technology called 'weaves' that will permit large collections of micromachines and their attendant computers to freely intercommunicate while preserving modularity, transparency, and flexibility. Weaves are composed of networks of communicating software components. The network, and the components comprising it, may be changed even while the software, and the devices it controls, are executing. This unusual degree of software plasticity permits micromachines to dynamically adapt the software to changing conditions and allows system engineers to rapidly and inexpensively develop special purpose software by assembling stock software components in custom configurations.

Systematic analysis of CMOS-micromachined inductors with application to mixer matching circuits

NASA Astrophysics Data System (ADS)

Wu, Jerry Chun-Li

The growing demand for consumer voice and data communication systems and military communication applications has created a need for low-power, low-cost, high-performance radio-frequency (RF) front-end. To achieve this goal, bringing passive components, especially inductors, to silicon is imperative. On-chip passive components such as inductors and capacitors generally enhance the reliability and efficiency of silicon-integrated RF cells. They can provide circuit solutions with superior performance and contribute to a higher level of integration. With passive components on chip, there is a great opportunity to have transformers, filters, and matching networks on chip. However, inductors on silicon have a low quality factor (Q) due to both substrate and metal loss. This dissertation demonstrates the systematic analysis of inductors fabricated using standard complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) system technologies. We report system-on-chip inductor modeling, simulation, and measurements of effective inductance and quality factors. In this analysis methodology, a number of systematic simulations are performed on regular and micromachined inductors with different parameters such as spiral topology, number of turns, outer diameter, thickness, and percentage of substrate removed by using micromachining technologies. Three different novel support structures of the micromachined spiral inductor are proposed, analyzed, and implemented for larger size suspended inductors. The sensitivity of the structure support and different degree of substrate etching by post-processing is illustrated. The results provide guidelines for the selection of inductor parameters, post-processing methodologies, and its spiral supports to meet the RF design specifications and the stability requirements for mobile communication. The proposed CMOS-micromachined inductor is used in a low cost-effective double-balanced Gilbert mixer with on-chip matching network. The integrated mixer inductor was implemented and tested to prove the concept.

Micromachined ultrasonic droplet generator based on a liquid horn structure

NASA Astrophysics Data System (ADS)

Meacham, J. M.; Ejimofor, C.; Kumar, S.; Degertekin, F. L.; Fedorov, A. G.

2004-05-01

A micromachined ultrasonic droplet generator is developed and demonstrated for drop-on-demand fluid atomization. The droplet generator comprises a bulk ceramic piezoelectric transducer for ultrasound generation, a reservoir for the ejection fluid, and a silicon micromachined liquid horn structure as the nozzle. The nozzles are formed using a simple batch microfabrication process that involves wet etching of (100) silicon in potassium hydroxide solution. Device operation is demonstrated by droplet ejection of water through 30 μm orifices at 1.49 and 2.30 MHz. The finite-element simulations of the acoustic fields in the cavity and electrical impedance of the device are in agreement with the measurements and indicate that the device utilizes cavity resonances in the 1-5 MHz range in conjunction with acoustic wave focusing by the pyramidally shaped nozzles to achieve low power operation.

76 FR 63282 - Foreign-Trade Zone 140-Flint, Michigan; Application for Subzone; Hemlock Semiconductor...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-10-12

... DEPARTMENT OF COMMERCE Foreign-Trade Zones Board [Docket 61-2011] Foreign-Trade Zone 140--Flint, Michigan; Application for Subzone; Hemlock Semiconductor Corporation (Polysilicon); Hemlock, MI An... Hemlock Semiconductor Corporation (HSC), located in Hemlock, Michigan. The application was submitted...

Economics of polysilicon process: A view from Japan

NASA Technical Reports Server (NTRS)

Shimizu, Y.

1986-01-01

The production process of solar grade silicon (SOG-Si) through trichlorosilane (TCS) was researched in a program sponsored by New Energy Development Organization (NEDO). The NEDO process consists of the following two steps: TCS production from by-product silicon tetrachloride (STC) and SOG-Si formation from TCS using a fluidized bed reactor. Based on the data obtained during the research program, the manufacturing cost of the NEDO process and other polysilicon manufacturing processes were compared. The manufacturing cost was calculated on the basis of 1000 tons/year production. The cost estimate showed that the cost of producing silicon by all of the new processes is less than the cost by the conventional Siemens process. Using a new process, the cost of producing semiconductor grade silicon was found to be virtually the same with any to the TCS, diclorosilane, and monosilane processes when by-products were recycled. The SOG-Si manufacturing processes using the fluidized bed reactor, which needs further development, shows a greater probablility of cost reduction than the filament processes.

A low-cost CMOS-MEMS piezoresistive accelerometer with large proof mass.

PubMed

Khir, Mohd Haris Md; Qu, Peng; Qu, Hongwei

2011-01-01

This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive sensing material. A full Wheatstone bridge was constructed through easy wiring allowed by the three metal layers in the 0.5 μm CMOS technology. The device fabrication process consisted of a standard CMOS process for sensor configuration, and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. A bulk single-crystal silicon (SCS) substrate is included in the proof mass to increase sensor sensitivity. In device design and analysis, the self heating of the polysilicon piezoresistors and its effect to the sensor performance is also discussed. With a low operating power of 1.5 mW, the accelerometer demonstrates a sensitivity of 0.077 mV/g prior to any amplification. Dynamic tests have been conducted with a high-end commercial calibrating accelerometer as reference.

Self-Heating Effects In Polysilicon Source Gated Transistors

PubMed Central

Sporea, R. A.; Burridge, T.; Silva, S. R. P.

2015-01-01

Source-gated transistors (SGTs) are thin-film devices which rely on a potential barrier at the source to achieve high gain, tolerance to fabrication variability, and low series voltage drop, relevant to a multitude of energy-efficient, large-area, cost effective applications. The current through the reverse-biased source barrier has a potentially high positive temperature coefficient, which may lead to undesirable thermal runaway effects and even device failure through self-heating. Using numerical simulations we show that, even in highly thermally-confined scenarios and at high current levels, self-heating is insufficient to compromise device integrity. Performance is minimally affected through a modest increase in output conductance, which may limit the maximum attainable gain. Measurements on polysilicon devices confirm the simulated results, with even smaller penalties in performance, largely due to improved heat dissipation through metal contacts. We conclude that SGTs can be reliably used for high gain, power efficient analog and digital circuits without significant performance impact due to self-heating. This further demonstrates the robustness of SGTs. PMID:26351099

Metal-ferroelectric-metal capacitor based persistent memory for electronic product code class-1 generation-2 uhf passive radio-frequency identification tag

NASA Astrophysics Data System (ADS)

Yoon, Bongno; Sung, Man Young; Yeon, Sujin; Oh, Hyun S.; Kwon, Yoonjoo; Kim, Chuljin; Kim, Kyung-Ho

2009-03-01

With the circuits using metal-ferroelectric-metal (MFM) capacitor, rf operational signal properties are almost the same or superior to those of polysilicon-insulator-polysilicon, metal-insulator-metal, and metal-oxide-semiconductor (MOS) capacitors. In electronic product code global class-1 generation-2 uhf radio-frequency identification (RFID) protocols, the MFM can play a crucial role in satisfying the specifications of the inventoried flag's persistence times (Tpt) for each session (S0-S3, SL). In this paper, we propose and design a new MFM capacitor based memory scheme of which persistence time for S1 flag is measured at 2.2 s as well as indefinite for S2, S3, and SL flags during the period of power-on. A ferroelectric random access memory embedded RFID tag chip is fabricated with an industry-standard complementary MOS process. The chip size is around 500×500 μm2 and the measured power consumption is about 10 μW.

Three-Dimensional Printing Based Hybrid Manufacturing of Microfluidic Devices.

PubMed

Alapan, Yunus; Hasan, Muhammad Noman; Shen, Richang; Gurkan, Umut A

2015-05-01

Microfluidic platforms offer revolutionary and practical solutions to challenging problems in biology and medicine. Even though traditional micro/nanofabrication technologies expedited the emergence of the microfluidics field, recent advances in advanced additive manufacturing hold significant potential for single-step, stand-alone microfluidic device fabrication. One such technology, which holds a significant promise for next generation microsystem fabrication is three-dimensional (3D) printing. Presently, building 3D printed stand-alone microfluidic devices with fully embedded microchannels for applications in biology and medicine has the following challenges: (i) limitations in achievable design complexity, (ii) need for a wider variety of transparent materials, (iii) limited z-resolution, (iv) absence of extremely smooth surface finish, and (v) limitations in precision fabrication of hollow and void sections with extremely high surface area to volume ratio. We developed a new way to fabricate stand-alone microfluidic devices with integrated manifolds and embedded microchannels by utilizing a 3D printing and laser micromachined lamination based hybrid manufacturing approach. In this new fabrication method, we exploit the minimized fabrication steps enabled by 3D printing, and reduced assembly complexities facilitated by laser micromachined lamination method. The new hybrid fabrication method enables key features for advanced microfluidic system architecture: (i) increased design complexity in 3D, (ii) improved control over microflow behavior in all three directions and in multiple layers, (iii) transverse multilayer flow and precisely integrated flow distribution, and (iv) enhanced transparency for high resolution imaging and analysis. Hybrid manufacturing approaches hold great potential in advancing microfluidic device fabrication in terms of standardization, fast production, and user-independent manufacturing.

Three-Dimensional Printing Based Hybrid Manufacturing of Microfluidic Devices

PubMed Central

Shen, Richang; Gurkan, Umut A.

2016-01-01

Microfluidic platforms offer revolutionary and practical solutions to challenging problems in biology and medicine. Even though traditional micro/nanofabrication technologies expedited the emergence of the microfluidics field, recent advances in advanced additive manufacturing hold significant potential for single-step, stand-alone microfluidic device fabrication. One such technology, which holds a significant promise for next generation microsystem fabrication is three-dimensional (3D) printing. Presently, building 3D printed stand-alone microfluidic devices with fully embedded microchannels for applications in biology and medicine has the following challenges: (i) limitations in achievable design complexity, (ii) need for a wider variety of transparent materials, (iii) limited z-resolution, (iv) absence of extremely smooth surface finish, and (v) limitations in precision fabrication of hollow and void sections with extremely high surface area to volume ratio. We developed a new way to fabricate stand-alone microfluidic devices with integrated manifolds and embedded microchannels by utilizing a 3D printing and laser micromachined lamination based hybrid manufacturing approach. In this new fabrication method, we exploit the minimized fabrication steps enabled by 3D printing, and reduced assembly complexities facilitated by laser micromachined lamination method. The new hybrid fabrication method enables key features for advanced microfluidic system architecture: (i) increased design complexity in 3D, (ii) improved control over microflow behavior in all three directions and in multiple layers, (iii) transverse multilayer flow and precisely integrated flow distribution, and (iv) enhanced transparency for high resolution imaging and analysis. Hybrid manufacturing approaches hold great potential in advancing microfluidic device fabrication in terms of standardization, fast production, and user-independent manufacturing. PMID:27512530

3D Printed Microtransporters: Compound Micromachines for Spatiotemporally Controlled Delivery of Therapeutic Agents.

PubMed

Huang, Tian-Yun; Sakar, Mahmut Selman; Mao, Angelo; Petruska, Andrew J; Qiu, Famin; Chen, Xue-Bo; Kennedy, Stephen; Mooney, David; Nelson, Bradley J

2015-11-01

Functional compound micromachines are fabricated by a design methodology using 3D direct laser writing and selective physical vapor deposition of magnetic materials. Microtransporters with a wirelessly controlled Archimedes screw pumping mechanism are engineered. Spatiotemporally controlled collection, transport, and delivery of micro particles, as well as magnetic nanohelices inside microfluidic channels are demonstrated. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

OSA Trends in Optics and Photonics Series, Volume 14 Spatial Light Modulators

DTIC Science & Technology

1998-05-26

Extreme Ultraviolet Lithography Glenn D. Kubiak andDon R. Kania, eds. Vol. 5 Optical Amplifiers and Their Applications (1996) Edited by...micromirror device ( DMD ), and photorefractive crystal. Note that other devices not discussed in this article have been developed, such as the charge...earlier. DMDs are fabricated by micromachining a silicon wafer.7 Tiny (16 um X 16 um) suspended mirrors are micromachined on cantilevers. The

Micromachined capacitive ultrasonic immersion transducer array

NASA Astrophysics Data System (ADS)

Jin, Xuecheng

Capacitive micromachined ultrasonic transducers (cMUTs) have emerged as an attractive alternative to conventional piezoelectric ultrasonic transducers. They offer performance advantages of wide bandwidth and sensitivity that have heretofore been attainable. In addition, micromachining technology, which has benefited from the fast-growing microelectronics industry, enables cMUT array fabrication and electronics integration. This thesis describes the design and fabrication of micromachined capacitive ultrasonic immersion transducer arrays. The basic transducer electrical equivalent circuit is derived from Mason's theory. The effects of Lamb waves and Stoneley waves on cross coupling and acoustic losses are discussed. Electrical parasitics such as series resistance and shunt capacitance are also included in the model of the transducer. Transducer fabrication technology is systematically studied. Device dimension control in both vertical and horizontal directions, process alternatives and variations in membrane formation, via etch and cavity sealing, and metalization as well as their impact on transducer performance are summarized. Both 64 and 128 element 1-D array transducers are fabricated. Transducers are characterized in terms of electrical input impedance, bandwidth, sensitivity, dynamic range, impulse response and angular response, and their performance is compared with theoretical simulation. Various schemes for cross coupling reduction is analyzed, implemented, and verified with both experiments and theory. Preliminary results of immersion imaging are presented using 64 elements 1-D array transducers for active source imaging.

Measurement of phase difference for micromachined gyros driven by rotating aircraft.

PubMed

Zhang, Zengping; Zhang, Fuxue; Zhang, Wei

2013-08-21

This paper presents an approach for realizing a phase difference measurement of a new gyro. A silicon micromachined gyro was mounted on rotating aircraft for aircraft attitude control. Aircraft spin drives the silicon pendulum of a gyro rotating at a high speed so that it can sense the transverse angular velocity of the rotating aircraft based on the gyroscopic precession principle when the aircraft has transverse rotation. In applications of the rotating aircraft single channel control system, such as damping in the attitude stabilization loop, the gyro signal must be kept in sync with the control signal. Therefore, the phase difference between both signals needs to be measured accurately. Considering that phase difference is mainly produced by both the micromachined part and the signal conditioning circuit, a mathematical model has been established and analyzed to determine the gyro's phase frequency characteristics. On the basis of theoretical analysis, a dynamic simulation has been done for a case where the spin frequency is 15 Hz. Experimental results with the proposed measurement method applied to a silicon micromachined gyro driven by a rotating aircraft demonstrate that it is effective in practical applications. Measured curve and numerical analysis of phase frequency characteristic are in accordance, and the error between measurement and simulation is only 5.3%.

Fabrication and characterization of piezoelectric micromachined ultrasonic transducers with thick composite PZT films.

PubMed

Wang, Zhihong; Zhu, Weiguang; Zhu, Hong; Miao, Jianmin; Chao, Chen; Zhao, Changlei; Tan, Ooi Kiang

2005-12-01

Ferroelectric microelectromechanical systems (MEMS) has been a growing area of research in past decades, in which ferroelectric films are combined with silicon technology for a variety of applications, such as piezo-electric micromachined ultrasonic transducers (pMUTs), which represent a new approach to ultrasound detection and generation. For ultrasound-radiating applications, thicker PZT films are preferred because generative force and response speed of the diaphragm-type transducers increase with increasing film thickness. However, integration of 4- to 20-microm thick PZT films on silicon wafer, either the deposition or the patterning, is still a bottleneck in the micromachining process. This paper reports on a diaphragm-type pMUT. A composite coating technique based on chemical solution deposition and high-energy ball milled powder has been used to fabricate thick PZT films. Micromachining of the pMUTs using such thick films has been investigated. The fabricated pMUT with crack-free PZT films up to 7-microm thick was evaluated as an ultrasonic transmitter. The generated sound pressure level of up to 120 dB indicates that the fabricated pMUT has very good ultrasound-radiating performance and, therefore, can be used to compose pMUT arrays for generating ultrasound beam with high directivity in numerous applications. The pMUT arrays also have been demonstrated.

Micromachined microfluidic chemiluminescent system for explosives detection

NASA Astrophysics Data System (ADS)

Park, Yoon; Neikirk, Dean P.; Anslyn, Eric V.

2007-04-01

Results will be reported from efforts to develop a self-contained micromachined microfluidic detection system for the presence of specific target analytes under the US Office of Naval Research Counter IED Basic Research Program. Our efforts include improving/optimizing a dedicated micromachined sensor array with integrated photodetectors and the synthesis of chemiluminescent receptors for nitramine residues. Our strategy for developing chemiluminescent synthetic receptors is to use quenched peroxyoxalate chemiluminescence; the presence of the target analyte would then trigger chemiluminescence. Preliminary results are encouraging as we have been able to measure large photo-currents from the reaction. We have also fabricated and demonstrated the feasibility of integrating photodiodes within an array of micromachined silicon pyramidal cavities. One particular advantage of such approach over a conventional planar photodiode would be its collection efficiency without the use of external optical components. Unlike the case of a normal photodetector coupled to a focused or collimated light source, the photodetector for such a purpose must couple to an emitting source that is approximately hemispherical; hence, using the full sidewalls of the bead's confining cavity as the detector allows the entire structure to act as its own integrating sphere. At the present time, our efforts are concentrating on improving the signal-to-noise ratio by reducing the leakage current by optimizing the fabrication sequence and the design.

Thermoelectric Device Fabrication Using Thermal Spray and Laser Micromachining

NASA Astrophysics Data System (ADS)

Tewolde, Mahder; Fu, Gaosheng; Hwang, David J.; Zuo, Lei; Sampath, Sanjay; Longtin, Jon P.

2016-02-01

Thermoelectric generators (TEGs) are solid-state devices that convert heat directly into electricity. They are used in many engineering applications such as vehicle and industrial waste-heat recovery systems to provide electrical power, improve operating efficiency and reduce costs. State-of-art TEG manufacturing is based on prefabricated materials and a labor-intensive process involving soldering, epoxy bonding, and mechanical clamping for assembly. This reduces their durability and raises costs. Additive manufacturing technologies, such as thermal spray, present opportunities to overcome these challenges. In this work, TEGs have been fabricated for the first time using thermal spray technology and laser micromachining. The TEGs are fabricated directly onto engineering component surfaces. First, current fabrication techniques of TEGs are presented. Next, the steps required to fabricate a thermal spray-based TEG module, including the formation of the metallic interconnect layers and the thermoelectric legs are presented. A technique for bridging the air gap between two adjacent thermoelectric elements for the top layer using a sacrificial filler material is also demonstrated. A flat 50.8 mm × 50.8 mm TEG module is fabricated using this method and its performance is experimentally characterized and found to be in agreement with expected values of open-circuit voltage based on the materials used.

Metal Alloy ICF Capsules Created by Electrodeposition

DOE Office of Scientific and Technical Information (OSTI.GOV)

Horwood, Corie; Stadermann, Michael; Bunn, Thomas L.

Electrochemical deposition is an attractive alternative to physical vapor deposition and micromachining to produce metal capsules for inertial confinement fusion (ICF). Electrochemical deposition (also referred to as electrodeposition or plating) is expected to produce full-density metal capsules without seams or inclusions of unwanted atomic constituents, the current shortcomings of micromachine and physical vapor deposition, respectively. In this paper, we discuss new cathode designs that allow for the rapid electrodeposition of gold and copper alloys on spherical mandrels by making transient contact with the constantly moving spheres. Electrodeposition of pure gold, copper, platinum, and alloys of gold-copper and gold-silver are demonstrated,more » with nonporous coatings of >40 µm achieved in only a few hours of plating. The surface roughness of the spheres after electrodeposition is comparable to the starting mandrel, and the coatings appear to be fully dense with no inclusions. A detailed understanding of the electrodeposition conditions that result in different alloy compositions and plating rates will allow for the electrodeposition of graded alloys on spheres in the near future. Finally, this report on the electrodeposition of metals on spherical mandrels is an important first step toward the fabrication of graded-density metal capsules for ICF experiments at the National Ignition Facility.« less

Picosecond laser micromachining prior to FIB milling for electronic microscopy sample preparation

NASA Astrophysics Data System (ADS)

Sikora, Aurélien; Fares, Lahouari; Adrian, Jérôme; Goubier, Vincent; Delobbe, Anne; Corbin, Antoine; Sentis, Marc; Sarnet, Thierry

2017-10-01

In order to check the manufacturing quality of electronic components using electron microscopy, the area of interest must be exposed. This requires the removal of a large quantity of matter without damaging the surrounding area. This step can be accomplished using ion milling but the processing can last a few hours. In order to accelerate the preparation of the samples, picosecond laser micromachining prior to Focused Ion Beam polishing is envisioned. Laser ablation allows the fast removal of matter but induces damages around the ablated area. Therefore the process has to be optimized in order to limit the size of both the heat affected zone and induced dislocation zone. For this purpose, cavities have been engraved in silicon and in electronic components, using a linearly polarized picosecond laser (∼50 ps) at three different wavelengths (343, 515 and 1030 nm). Results showed that the cross sectional shapes and the surface topologies can be tuned by the laser fluence and the number of pulses. Clear cross sections of bumps and cavity openings, exposing multilayer interfaces, are demonstrated. The silicon removal rates, tuned by the applied energy density, have been measured. Removal rates achieved at 200 kHz were typically hundred times higher than those achieved by ion milling and the best efficiency was obtained at 343 nm.

MEMS deformable mirror embedded wavefront sensing and control system

NASA Astrophysics Data System (ADS)

Owens, Donald; Schoen, Michael; Bush, Keith

2006-01-01

Electrostatic Membrane Deformable Mirror (MDM) technology developed using silicon bulk micro-machining techniques offers the potential of providing low-cost, compact wavefront control systems for diverse optical system applications. Electrostatic mirror construction using bulk micro-machining allows for custom designs to satisfy wavefront control requirements for most optical systems. An electrostatic MDM consists of a thin membrane, generally with a thin metal or multi-layer high-reflectivity coating, suspended over an actuator pad array that is connected to a high-voltage driver. Voltages applied to the array elements deflect the membrane to provide an optical surface capable of correcting for measured optical aberrations in a given system. Electrostatic membrane DM designs are derived from well-known principles of membrane mechanics and electrostatics, the desired optical wavefront control requirements, and the current limitations of mirror fabrication and actuator drive electronics. MDM performance is strongly dependent on mirror diameter and air damping in meeting desired spatial and temporal frequency requirements. In this paper, we present wavefront control results from an embedded wavefront control system developed around a commercially available high-speed camera and an AgilOptics Unifi MDM driver using USB 2.0 communications and the Linux development environment. This new product, ClariFast TM, combines our previous Clarifi TM product offering into a faster more streamlined version dedicated strictly to Hartmann Wavefront sensing.

Metal Alloy ICF Capsules Created by Electrodeposition

DOE PAGES

Horwood, Corie; Stadermann, Michael; Bunn, Thomas L.

2017-12-04

Electrochemical deposition is an attractive alternative to physical vapor deposition and micromachining to produce metal capsules for inertial confinement fusion (ICF). Electrochemical deposition (also referred to as electrodeposition or plating) is expected to produce full-density metal capsules without seams or inclusions of unwanted atomic constituents, the current shortcomings of micromachine and physical vapor deposition, respectively. In this paper, we discuss new cathode designs that allow for the rapid electrodeposition of gold and copper alloys on spherical mandrels by making transient contact with the constantly moving spheres. Electrodeposition of pure gold, copper, platinum, and alloys of gold-copper and gold-silver are demonstrated,more » with nonporous coatings of >40 µm achieved in only a few hours of plating. The surface roughness of the spheres after electrodeposition is comparable to the starting mandrel, and the coatings appear to be fully dense with no inclusions. A detailed understanding of the electrodeposition conditions that result in different alloy compositions and plating rates will allow for the electrodeposition of graded alloys on spheres in the near future. Finally, this report on the electrodeposition of metals on spherical mandrels is an important first step toward the fabrication of graded-density metal capsules for ICF experiments at the National Ignition Facility.« less

Micromachining of silicon carbide on silicon fabricated by low-pressure chemical vapour deposition

NASA Astrophysics Data System (ADS)

Behrens, Ingo; Peiner, Erwin; Bakin, Andrey S.; Schlachetzki, Andreas

2002-07-01

We describe the fabrication of silicon carbide layers for micromechanical applications using low-pressure metal-organic chemical vapour deposition at temperatures below 1000 °C. The layers can be structured by lift-off using silicon dioxide as a sacrificial layer. A large selectivity with respect to silicon can be exploited for bulk micromachining. Thin membranes are fabricated which exhibit high mechanical quality, as necessary for applications in harsh environments.

Micromachined Tunable Fabry-Perot Filters for Infrared Astronomy

NASA Technical Reports Server (NTRS)

Barclay, Richard; Bier, Alexander; Chen, Tina; DiCamillo, Barbara; Deming, Drake; Greenhouse, Matthew; Henry, Ross; Hewagama, Tilak; Jacobson, Mindy; Loughlin, James;

Experimental determination of micromachined discrete and continuous device spring constants using nanoindentation method

NASA Astrophysics Data System (ADS)

Chan, M. L.; Tay, Francis E.; Logeeswaran, V. J.; Zeng, Kaiyang; Shen, Lu; Chau, Fook S.

2002-04-01

A rapid and accurate static and quasi-static method for determining the out-of-plane spring constraints of cantilevers and a micromachined vibratory sensor is presented. In the past, much of the effort in nanoindentation application was to investigate the thin-film mechanical properties. In this paper, we have utilized the nanoindentation method to measure directly some micromachined device (e.g. microgyroscope) spring constants. The cantilevers and devices tested were fabricated using the MUMPS process and an SOI process (patent pending). Spring constants are determined using a commercial nanoindentation apparatus UMIS-2000 configured with both Berkovich and spherical indenter tip that can be placed onto the device with high accuracy. Typical load resolution is 20micrometers N to 0.5N and a displacement resolution of 0.05nm. Information was deduced from the penetration depth versus load curves during both loading and unloading.

Femtosecond laser micromachining of compound parabolic concentrator fiber tipped glucose sensors.

PubMed

Hassan, Hafeez Ul; Lacraz, Amédée; Kalli, Kyriacos; Bang, Ole

2017-03-01

We report on highly accurate femtosecond (fs) laser micromachining of a compound parabolic concentrator (CPC) fiber tip on a polymer optical fiber (POF). The accuracy is reflected in an unprecedented correspondence between the numerically predicted and experimentally found improvement in fluorescence pickup efficiency of a Förster resonance energy transfer-based POF glucose sensor. A Zemax model of the CPC-tipped sensor predicts an optimal improvement of a factor of 3.96 compared to the sensor with a plane-cut fiber tip. The fs laser micromachined CPC tip showed an increase of a factor of 3.5, which is only 11.6% from the predicted value. Earlier state-of-the-art fabrication of the CPC-shaped tip by fiber tapering was of so poor quality that the actual improvement was 43% lower than the predicted improvement of the ideal CPC shape.

Femtosecond laser micromachining of compound parabolic concentrator fiber tipped glucose sensors

NASA Astrophysics Data System (ADS)

Hassan, Hafeez Ul; Lacraz, Amédée; Kalli, Kyriacos; Bang, Ole

2017-03-01

We report on highly accurate femtosecond (fs) laser micromachining of a compound parabolic concentrator (CPC) fiber tip on a polymer optical fiber (POF). The accuracy is reflected in an unprecedented correspondence between the numerically predicted and experimentally found improvement in fluorescence pickup efficiency of a Förster resonance energy transfer-based POF glucose sensor. A Zemax model of the CPC-tipped sensor predicts an optimal improvement of a factor of 3.96 compared to the sensor with a plane-cut fiber tip. The fs laser micromachined CPC tip showed an increase of a factor of 3.5, which is only 11.6% from the predicted value. Earlier state-of-the-art fabrication of the CPC-shaped tip by fiber tapering was of so poor quality that the actual improvement was 43% lower than the predicted improvement of the ideal CPC shape.

Biomimetic wall-shaped hierarchical microstructure for gecko-like attachment.

PubMed

Kasem, Haytam; Tsipenyuk, Alexey; Varenberg, Michael

2015-04-21

Most biological hairy adhesive systems involved in locomotion rely on spatula-shaped terminal elements, whose operation has been actively studied during the last decade. However, though functional principles underlying their amazing performance are now well understood, due to technical difficulties in manufacturing the complex structure of hierarchical spatulate systems, a biomimetic surface structure featuring true shear-induced dynamic attachment still remains elusive. To try bridging this gap, a novel method of manufacturing gecko-like attachment surfaces is devised based on a laser-micromachining technology. This method overcomes the inherent disadvantages of photolithography techniques and opens wide perspectives for future production of gecko-like attachment systems. Advanced smart-performance surfaces featuring thin-film-based hierarchical shear-activated elements are fabricated and found capable of generating friction force of several tens of times the contact load, which makes a significant step forward towards a true gecko-like adhesive.

Modeling of solid-state and excimer laser processes for 3D micromachining

NASA Astrophysics Data System (ADS)

Holmes, Andrew S.; Onischenko, Alexander I.; George, David S.; Pedder, James E.

2005-04-01

An efficient simulation method has recently been developed for multi-pulse ablation processes. This is based on pulse-by-pulse propagation of the machined surface according to one of several phenomenological models for the laser-material interaction. The technique allows quantitative predictions to be made about the surface shapes of complex machined parts, given only a minimal set of input data for parameter calibration. In the case of direct-write machining of polymers or glasses with ns-duration pulses, this data set can typically be limited to the surface profiles of a small number of standard test patterns. The use of phenomenological models for the laser-material interaction, calibrated by experimental feedback, allows fast simulation, and can achieve a high degree of accuracy for certain combinations of material, laser and geometry. In this paper, the capabilities and limitations of the approach are discussed, and recent results are presented for structures machined in SU8 photoresist.

Mechanical memory

DOEpatents

Gilkey, Jeffrey C [Albuquerque, NM; Duesterhaus, Michelle A [Albuquerque, NM; Peter, Frank J [Albuquerque, NM; Renn, Rosemarie A [Alburquerque, NM; Baker, Michael S [Albuquerque, NM

2006-08-15

A first-in-first-out (FIFO) microelectromechanical memory apparatus (also termed a mechanical memory) is disclosed. The mechanical memory utilizes a plurality of memory cells, with each memory cell having a beam which can be bowed in either of two directions of curvature to indicate two different logic states for that memory cell. The memory cells can be arranged around a wheel which operates as a clocking actuator to serially shift data from one memory cell to the next. The mechanical memory can be formed using conventional surface micromachining, and can be formed as either a nonvolatile memory or as a volatile memory.

Mechanical memory

DOEpatents

Gilkey, Jeffrey C [Albuquerque, NM; Duesterhaus, Michelle A [Albuquerque, NM; Peter, Frank J [Albuquerque, NM; Renn, Rosemarie A [Albuquerque, NM; Baker, Michael S [Albuquerque, NM

2006-05-16

A first-in-first-out (FIFO) microelectromechanical memory apparatus (also termed a mechanical memory) is disclosed. The mechanical memory utilizes a plurality of memory cells, with each memory cell having a beam which can be bowed in either of two directions of curvature to indicate two different logic states for that memory cell. The memory cells can be arranged around a wheel which operates as a clocking actuator to serially shift data from one memory cell to the next. The mechanical memory can be formed using conventional surface micromachining, and can be formed as either a nonvolatile memory or as a volatile memory.

Fiber-optical switch using cam-micromotor driven by scratch drive actuators

NASA Astrophysics Data System (ADS)

Kanamori, Y.; Aoki, Y.; Sasaki, M.; Hosoya, H.; Wada, A.; Hane, K.

2005-01-01

We fabricated a 1 × 1 fiber-optic switch using a cam-micromotor driven by scratch drive actuators (SDAs). Using the cam-micromotor, mechanical translation and precise positioning of an optical fiber were performed. An optical fiber of diameter 50 µm was bent and pushed out with a cam-mechanism driven by the SDAs fabricated by surface micromachining. The maximum rotation speed of the cam-micromotor was 7.5 rpm at a driving frequency of 1.5 kHz. The transient time of the switch to attenuate coupling efficiency less than -40 dB was around 10 ms.

Electrically-programmable diffraction grating

DOEpatents

Ricco, Antonio J.; Butler, Michael A.; Sinclair, Michael B.; Senturia, Stephen D.

1998-01-01

An electrically-programmable diffraction grating. The programmable grating includes a substrate having a plurality of electrodes formed thereon and a moveable grating element above each of the electrodes. The grating elements are electrostatically programmable to form a diffraction grating for diffracting an incident beam of light as it is reflected from the upper surfaces of the grating elements. The programmable diffraction grating, formed by a micromachining process, has applications for optical information processing (e.g. optical correlators and computers), for multiplexing and demultiplexing a plurality of light beams of different wavelengths (e.g. for optical fiber communications), and for forming spectrometers (e.g. correlation and scanning spectrometers).

Femtosecond laser micromachining of waveguides in silicone-based hydrogel polymers.

PubMed

Ding, Li; Blackwell, Richard I; Künzler, Jay F; Knox, Wayne H

2008-06-10

By tightly focusing 27 fs laser pulses from a Ti:sapphire oscillator with 1.3 nJ pulse energy at 93 MHz repetition rate, we are able to fabricate optical waveguides inside hydrogel polymers containing approximately 36% water by weight. A tapered lensed fiber is used to couple laser light at a wavelength of 632.8 nm into these waveguides within a water environment. Strong waveguiding is observed due to large refractive index changes. A large waveguide propagation loss is found, and we show that this is caused by surface roughness which can be reduced by optimizing the waveguides.

Cleaning up Silicon

NASA Technical Reports Server (NTRS)

2000-01-01

A development program that started in 1975 between Union Carbide and JPL, led to Advanced Silicon Materials LLC's, formerly ASiMI, commercial process for producing silane in viable quantities. The process was expanded to include the production of high-purity polysilicon for electronic devices. The technology came out of JPL's Low Cost Silicon Array Project.

Solid State Research.

DTIC Science & Technology

1996-02-15

photoconductor is no longer voltage biased—it is biased through a load impedance Z0 and responds nonlinearly in 1(f) when LTG GaAs ’pc Vo i G(t) = ol ... polysilicon ). This energy deposition contributes no signal charge, but it manifests itself as an intercept of ~ 0.5 MeV when extrapolating the CCD

Electrothermal actuators fabricated in four-level planarized surface-miromachined polycrystalline silicon

DOE Office of Scientific and Technical Information (OSTI.GOV)

Comtois, J.H.; Michalicek, A.; Barron, C.C.

1997-11-01

This paper presents the results of tests performed on a variety of electrochemical microactuators and arrays of these actuators fabricated in the SUMMiT process at the U.S. Department of Energy`s Sandia National Laboratories. These results are intended to aid designers of thermally actuated mechanisms, and they apply to similar actuators made in other polysilicon MEMS processes such as the MUMPS process. Measurements include force and deflection versus input power, maximum operating frequency, effects of long term operation, and ideal actuator and array geometries for different applications` force requirements. Also, different methods of arraying these actuators together are compared. It ismore » found that a method using rotary joints, enabled by the advanced features of the SUMMiT fabrication process, is the most efficient array design. The design and operation of a thermally actuated stepper motor is explained to illustrate a useful application of these arrays.« less

Enhancing Modulation of Thermal Conduction in Vanadium Dioxide Thin Film by Nanostructured Nanogaps

DOE PAGES

Choe, Hwan Sung; Suh, Joonki; Ko, Changhyun; ...

2017-08-02

Efficient thermal management at the nanoscale is important for reducing energy consumption and dissipation in electronic devices, lab-on-a-chip platforms and energy harvest/conversion systems. For many of these applications, it is much desired to have a solid-state structure that reversibly switches thermal conduction with high ON/OFF ratios and at high speed. We describe design and implementation of a novel, all-solid-state thermal switching device by nanostructured phase transformation, i.e., modulation of contact pressure an d area between two poly-silicon surfaces activated by microstructural change of a vanadium dioxide (VO 2 ) thin film. Our solid-state devices demonstrate large and reversible alteration ofmore » cross-plane thermal conductance as a function of temperature, achieving a conductance ratio of at least 2.5. This new approach using nanostructured phase transformation provides new opportunities for applications that require advanced temperature and heat regulations.« less

Enhancing Modulation of Thermal Conduction in Vanadium Dioxide Thin Film by Nanostructured Nanogaps

DOE Office of Scientific and Technical Information (OSTI.GOV)

Choe, Hwan Sung; Suh, Joonki; Ko, Changhyun

Efficient thermal management at the nanoscale is important for reducing energy consumption and dissipation in electronic devices, lab-on-a-chip platforms and energy harvest/conversion systems. For many of these applications, it is much desired to have a solid-state structure that reversibly switches thermal conduction with high ON/OFF ratios and at high speed. We describe design and implementation of a novel, all-solid-state thermal switching device by nanostructured phase transformation, i.e., modulation of contact pressure an d area between two poly-silicon surfaces activated by microstructural change of a vanadium dioxide (VO 2 ) thin film. Our solid-state devices demonstrate large and reversible alteration ofmore » cross-plane thermal conductance as a function of temperature, achieving a conductance ratio of at least 2.5. This new approach using nanostructured phase transformation provides new opportunities for applications that require advanced temperature and heat regulations.« less

Micromachined devices: the impact of controlled geometry from cell-targeting to bioavailability.

PubMed

Tao, Sarah L; Desai, Tejal A

2005-12-05

Advances in microelectomechanical systems (MEMS) have allowed the microfabrication of polymeric substrates and the development of a novel class of controlled delivery devices. These vehicles have specifically tailored three-dimensional physical and chemical features which, together, provide the capacity to target cells, promote unidirectional controlled release, and enhance permeation across the intestinal epithelial barrier. Examining the biological response at the microdevice biointerface may provide insight into the benefits of customized surface chemistry and structure in terms of complex drug delivery vehicle design. Therefore, the aim of this work was to determine the interfacial effects of selective surface chemistry and architecture of tomato lectin (TL)-modified poly(methyl methacrylate) (PMMA) drug delivery microdevices on the Caco-2 cell line, a model of the gastrointestinal tract.

A high-average-power FEL for industrial applications

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dylla, H.F.; Benson, S.; Bisognano, J.

1995-12-31

CEBAF has developed a comprehensive conceptual design of an industrial user facility based on a kilowatt UV (150-1000 nm) and IR (2-25 micron) FEL driven by a recirculating, energy-recovering 200 MeV superconducting radio-frequency (SRF) accelerator. FEL users{endash}CEBAF`s partners in the Laser Processing Consortium, including AT&T, DuPont, IBM, Northrop-Grumman, 3M, and Xerox{endash}plan to develop applications such as polymer surface processing, metals and ceramics micromachining, and metal surface processing, with the overall effort leading to later scale-up to industrial systems at 50-100 kW. Representative applications are described. The proposed high-average-power FEL overcomes limitations of conventional laser sources in available power, cost-effectiveness, tunabilitymore » and pulse structure. 4 refs., 3 figs., 2 tabs.« less

Terahertz-Regime, Micro-VEDs: Evaluation of Micromachined TWT Conceptual Designs

NASA Technical Reports Server (NTRS)

Booske, John H.; Kory, Carol L.; Gallagher, D.; van der Weide, Daniel W.; Limbach, S; Gustafson, P; Lee, W.-J.; Gallagher, S.; Jain, K.

2001-01-01

Summary form only given. The Terahertz (THz) region of the electromagnetic spectrum (approx.300-3000 GHz) has enormous potential for high-data-rate communications, spectroscopy, astronomy, space research, medicine, biology, surveillance, remote sensing, industrial process control, etc. The most critical roadblock to full exploitation of the THz band is lack of coherent radiation sources that are powerful (0.01-10.0 W continuous wave), efficient (>1 %), frequency agile (instantaneously tunable over 1% bandwidths or more), reliable, and relatively inexpensive. Micro-machined Vacuum Electron Devices (micro-VEDs) represent a promising solution. We describe prospects for miniature, THz-regime TWTs fabricated using micromachining techniques. Several approx.600 GHz conceptual designs are compared. Their expected performance has been analyzed using SD, 2.51), and 3D TWT codes. A folded waveguide (FWG) TWT forward-wave amplifier design is presented based on a Northrop Grumman (NGC) optimized design procedure. This conceptual device is compared to the simulated performance of a novel, micro-VED helix TWT. Conceptual FWG TWT backward-wave amplifiers and oscillators are also discussed. A scaled (100 GHz) FWG TWT operating at a relatively low voltage (-12 kV) is under development at NGC. Also, actual-size micromachining experiments are planned to evaluate the feasibility of arrays of micro-VED TWTs. Progress and results of these efforts are described. This work was supported, in part by AFOSR, ONR, and NSF.

Micromachined High Frequency PMN-PT/Epoxy 1-3 Composite Ultrasonic Annular Array

PubMed Central

Liu, Changgeng; Djuth, Frank; Li, Xiang; Chen, Ruimin; Zhou, Qifa; Shung, K. Kirk

2013-01-01

This paper reports the design, fabrication, and performance of miniature micromachined high frequency PMN-PT/epoxy 1-3 composite ultrasonic annular arrays. The PMN-PT single crystal 1-3 composites were made with micromachining techniques. The area of a single crystal pillar was 9 μm × 9 μm. The width of the kerf among pillars was ~ 5 μm and the kerfs were filled with a polymer. The composite thickness was 25 μm. A six-element annular transducer of equal element area of 0.2 mm2 with 16 μm kerf widths between annuli was produced. The aperture size the array transducer is about 1.5 mm in diameter. A novel electrical interconnection strategy for high density array elements was implemented. After the transducer was attached to the electric connection board and packaged, the array transducer was tested in a pulse/echo arrangement, whereby the center frequency, bandwidth, two-way insertion loss (IL), and cross talk between adjacent elements were measured for each annulus. The center frequency was 50 MHz and -6 dB bandwidth was 90%. The average insertion loss was 19.5 dB at 50 MHz and the crosstalk between adjacent elements was about -35 dB. The micromachining techniques described in this paper are promising for the fabrication of other types of high frequency transducers e.g. 1D and 2D arrays. PMID:22119324

Fabrication of multi-scale periodic surface structures on Ti-6Al-4V by direct laser writing and direct laser interference patterning for modified wettability applications

NASA Astrophysics Data System (ADS)

Huerta-Murillo, D.; Aguilar-Morales, A. I.; Alamri, S.; Cardoso, J. T.; Jagdheesh, R.; Lasagni, A. F.; Ocaña, J. L.

2017-11-01

In this work, hierarchical surface patterns fabricated on Ti-6Al-4V alloy combining two laser micro-machining techniques are presented. The used technologies are based on nanosecond Direct Laser Writing and picosecond Direct Laser Interference Patterning. Squared shape micro-cells with different hatch distances were produced by Direct Laser Writing with depths values in the micro-scale, forming a well-defined closed packet. Subsequently, cross-like periodic patterns were fabricated by means of Direct Laser Interference Patterning using a two-beam configuration, generating a dual-scale periodic surface structure in both micro- and nano-scale due to the formation of Laser-Induced Periodic Surface Structure after the picosecond process. As a result a triple hierarchical periodic surface structure was generated. The surface morphology of the irradiated area was characterized with scanning electron microscopy and confocal microscopy. Additionally, static contact angle measurements were made to analyze the wettability behavior of the structures, showing a hydrophobic behavior for the hierarchical structures.

Development of micromachined preconcentrators and gas chromatographic separation columns by an electroless gold plating technology

NASA Astrophysics Data System (ADS)

Kuo, C.-Y.; Chen, P.-S.; Chen, H.-T.; Lu, C.-J.; Tian, W.-C.

2017-03-01

In this study, a simple process for fabricating a novel micromachined preconcentrator (μPCT) and a gas chromatographic separation column (μSC) for use in a micro gas chromatograph (μGC) using one photomask is described. By electroless gold plating, a high-surface-area gold layer was deposited on the surface of channels inside the μPCT and μSC. For this process, (3-aminopropyl) trimethoxysilane (APTMS) was used as a promoter for attaching gold nanoparticles on a silicon substrate to create a seed layer. For this purpose, a gold sodium sulfite solution was used as reagent for depositing gold to form heating structures. The microchannels of the μPCT and μSC were coated with the adsorbent and stationary phase, Tenax-TA and polydimethylsiloxane (DB-1), respectively. μPCTs were heated at temperatures greater than 280 °C under an applied electrical power of 24 W and a heating rate of 75 °C s-1. Repeatable thermal heating responses for μPCTs were achieved; good linearity (R 2  >  0.9997) was attained at three heating rates for the temperature programme for the μSC (0.2, 0.5 and 1 °C s-1). The volatile organic compounds (VOCs) toluene and m-xylene were concentrated over the μPCT by rapid thermal desorption (peak width of half height (PWHH)  <1.5 s) preconcentration factors for both VOCs are  >7900. The VOCs acetone, benzene, toluene, m-xylene and 1,3,5-trimethylbenzene were also separated on the μSC as evidenced by their different retention times (47-184 s).

Development of Silicon Micromirrors for the Next Generation Space Telescope

NASA Astrophysics Data System (ADS)

Garcia, E. J.; Polosky, M. A.; Sleefe, G. E.; Habbit, R.; Zamora, J. C.; Greenhouse, M. A.

2001-12-01

This paper describes how advanced surface micromachining (SMM) technology is being used to develop prototype cryogenic micromirror arrays for evaluation as an instrument optical component for the NGST. When used as a spectrograph reflective slit mask, these arrays can yield a factor of 1000 reduction in mass and power over, traditional motor-driven slit wheels used on HST instruments. The advantage of micromirrors as a new approach to instrument aperture control is particularly apparent when it is coupled with new large format focal plane arrays to enable multi-object spectroscopy. In this application, the micromirror-enabled capability goes beyond mass and power reduction to offer increased observing efficiency (targets/hour). In the case of NGST, a factor of 100 improvement in efficiency relative to traditional instrument designs has been estimated. Surface micromachining uses fabrication processes adapted from integrated circuit manufacturing to build microscopic-sized electromechanical devices from polycrystalline silicon. Because these devices can be batch fabricated thousands or even millions of devices can be constructed on a single wafer at costs several orders of magnitude less than conventionally fabricated devices. This paper will describe the design and operation of prototype mirror devices that are currently under development. We have recently demonstrated the feasibility of operating micromirrors at cryogenic temperatures. A packaged unit with its associated interconnects has been successfully operated at temperatures less than 30 K. The ability to function at the cryogenic temperatures encountered in certain space applications is a major milestone for microsystems. This work is funded by NASA Goddard Space Flight Center. Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Dept. of Energy under Contract DE-AC04-94AL85000.

Micromachined modulator arrays for use in free-space optical communication systems

NASA Astrophysics Data System (ADS)

Lewis, Keith L.; Ridley, Kevin D.; McNie, Mark E.; Smith, Gilbert W.; Scott, Andrew M.

2004-12-01

A summary is presented of some of the design criteria relevant to the realisation of silicon micromachined modulator arrays for use in free-space optical communication systems. Theoretical performance levels achievable are compared with values measured on experimental devices produced using a modified Multi-User MEMS Process (MUMPS). Devices capable of realising modulation rates in excess of 300 kHz are described and their optical characteristics compared with published data on devices based on multiple quantum well technology.

Sensors and Micromachined Devices for the Automotive and New Markets: The Delphi Delco Electronics MEMS Story.

NASA Astrophysics Data System (ADS)

Logsdon, James

2002-03-01

This presentation will provide a brief history of the development of MEMS products and technology, beginning with the manifold absolute pressure sensor in the late seventies through the current variety of Delphi Delco Electronics sensors available today. The technology development of micromachining from uncompensated P plus etch stops to deep reactive ion etching and the technology development of wafer level packaging from electrostatic bonding to glass frit sealing and silicon to silicon direct bonding will be reviewed.

MEMS testing and applications in automotive and aerospace industries

NASA Astrophysics Data System (ADS)

Ma, Zhichun; Chen, Xuyuan

2009-05-01

MEMS technology combines micromachining and integrated circuit fabrication technologies to produce highly reliable MEMS transducers. This paper presents an overview of MEMS transducers applications, particularly in automotive and aerospace industries, which includes inertia sensors for safety, navigation, and guidance control, thermal anemometer for temperature and heat-flux sensors in engine applications, MEMS atomizers for fuel injection, and micromachined actuators for flow control applications. Design examples for the devices in above mentioned applications are also presented and test results are given.

A Broadband Micro-Machined Far-Infrared Absorber

NASA Technical Reports Server (NTRS)

Wollack, E. J.; Datesman, A. M.; Jhabvala, C. A.; Miller, K. H.; Quijada, M. A.

2016-01-01

The experimental investigation of a broadband far-infrared meta-material absorber is described. The observed absorptance is greater than 0.95 from 1 to 20 terahertz (300-15 microns) over a temperature range spanning 5-300 degrees Kelvin. The meta-material, realized from an array of tapers approximately 100 microns in length, is largely insensitive to the detailed geometry of these elements and is cryogenically compatible with silicon-based micro-machined technologies. The electromagnetic response is in general agreement with a physically motivated transmission line model.

Project: Micromachined High-Frequency Circuits For Sub-mm-wave Sensors

NASA Technical Reports Server (NTRS)

Papapolymerou, Ioannis John

2004-01-01

A novel micromachined resonator at 45 GHz based on a defect in a periodic electromagnetic bandgap structure (EBG) and a two-pole Tchebysbev filter with 1.4% 0.15 dB equiripple bandwidth and 2.3 dB loss employing this resonator are presented in this letter. The periodic bandgap structure is realized on a 400 micron thick high-resistivity silicon wafer using deep reactive ion etching techniques. The resonator and filter can be accessed via coplanar waveguide feeds.

A Low-Cost CMOS-MEMS Piezoresistive Accelerometer with Large Proof Mass

PubMed Central

Khir, Mohd Haris Md; Qu, Peng; Qu, Hongwei

2011-01-01

This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive sensing material. A full Wheatstone bridge was constructed through easy wiring allowed by the three metal layers in the 0.5 μm CMOS technology. The device fabrication process consisted of a standard CMOS process for sensor configuration, and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. A bulk single-crystal silicon (SCS) substrate is included in the proof mass to increase sensor sensitivity. In device design and analysis, the self heating of the polysilicon piezoresistors and its effect to the sensor performance is also discussed. With a low operating power of 1.5 mW, the accelerometer demonstrates a sensitivity of 0.077 mV/g prior to any amplification. Dynamic tests have been conducted with a high-end commercial calibrating accelerometer as reference. PMID:22164052

DOE Office of Scientific and Technical Information (OSTI.GOV)

Gray, D.C.; Tepermeister, I.; Sawin, H.H.

A multiple beam apparatus has been constructed to facilitate the study of ion-enhanced fluorine chemistry on undoped polysilicon and silicon dioxide surfaces by allowing the fluxes of fluorine (F) atoms and argon (Ar{sup +}) ions to be independently varied over several orders of magnitude. The chemical nature of the etching surfaces has been investigated following the vacuum transfer of the sample dies to an adjoining x-ray photoelectron spectroscopy facility. The etching {open_quotes}enhancement{close_quotes} effect of normally incident Ar{sup +} ions has been quantified over a wide range of ion energy through the use of Kaufman and electron cyclotron resonance-type ion sources.more » The increase in per ion etching yield of fluorine saturated silicon and silicon dioxide surfaces with increasing ion energy (E{sub ion}) was found to scale as (E{sub ion}{sup 1/2}-E{sub th}{sup 1/2}), where E{sub th} is the etching threshold energy for the process. Simple near-surface site occupation models have been proposed for the quantification of the ion-enhanced etching kinetics in these systems. Acceptable agreement has been found in comparison of these Ar{sup +}/F etching model predictions with similar Ar{sup +}/XeF{sub 2} studies reported in the literature, as well as with etching rate measurements made in F-based plasmas of gases such as SF{sub 6} and NF{sub 3}. 69 refs., 12 figs., 6 tabs.« less

Mitigating intrinsic defects and laser damage using pulsetrain-burst (>100 MHz) ultrafast laser processing

NASA Astrophysics Data System (ADS)

McKinney, Luke; Frank, Felix; Graper, David; Dean, Jesse; Forrester, Paul; Rioblanc, Maxence; Nantel, Marc; Marjoribanks, Robin

2005-09-01

Ultrafast-laser micromachining has promise as an approach to trimming and 'healing' small laser-produced damage sites in laser-system optics--a common experience in state-of-the-art high-power laser systems. More-conventional approaches currently include mechanical micromachining, chemical modification, and treatment using cw and long-pulse lasers. Laser-optics materials of interest include fused silica, multilayer dielectric stacks for anti-reflection coatings or high-reflectivity mirrors, and inorganic crystals such as KD*P, used for Pockels cells and frequency-doubling. We report on novel efforts using ultrafast-laser pulsetrain-burst processing (microsecond bursts at 133 MHz) to mitigate damage in fused silica, dielectric coatings, and KD*P crystals. We have established the characteristics of pulsetrain-burst micromachining in fused silica, multilayer mirrors, and KD*P, and determined the etch rates and morphology under different conditions of fluence-delivery. From all of these, we have begun to identify new means to optimize the laser-repair of optics defects and damage.

A micromachined device describing over a hundred orders of parametric resonance

NASA Astrophysics Data System (ADS)

Jia, Yu; Du, Sijun; Arroyo, Emmanuelle; Seshia, Ashwin A.

2018-04-01

Parametric resonance in mechanical oscillators can onset from the periodic modulation of at least one of the system parameters, and the behaviour of the principal (1st order) parametric resonance has long been well established. However, the theoretically predicted higher orders of parametric resonance, in excess of the first few orders, have mostly been experimentally elusive due to the fast diminishing instability intervals. A recent paper experimentally reported up to 28 orders in a micromachined membrane oscillator. This paper reports the design and characterisation of a micromachined membrane oscillator with a segmented proof mass topology, in an attempt to amplify the inherent nonlinearities within the membrane layer. The resultant oscillator device exhibited up to over a hundred orders of parametric resonance, thus experimentally validating these ultra-high orders as well as overlapping instability transitions between these higher orders. This research introduces design possibilities for the transducer and dynamic communities, by exploiting the behaviour of these previously elusive higher order resonant regimes.

GaAs micromachining in the 1 H2SO4:1 H2O2:8 H2O system. From anisotropy to simulation

NASA Astrophysics Data System (ADS)

Tellier, C. R.

2011-02-01

The bulk micromachining on (010), (110) and (111)A GaAs substrates in the 1 H2SO4:1 H2O2:8 H2O system is investigated. Focus is placed on anisotropy of 3D etching shapes with a special emphasis on convex and concave undercuts which are of prime importance in the wet micromachining of mechanical structures. Etched structures exhibit curved contours and more and less rounded sidewalls showing that the anisotropy is of type 2. This anisotropy can be conveniently described by a kinematic and tensorial model. Hence, a database composed of dissolution constants is further determined from experiments. A self-elaborated simulator which works with the proposed database is used to derive theoretical 3D shapes. Simulated shapes agree well with observed shapes of microstructures. The successful simulations open up two important applications for MEMS: CAD of mask patterns and meshing of simulated shapes for FEM simulation tools.

Micromachined Thermoelectric Sensors and Arrays and Process for Producing

NASA Technical Reports Server (NTRS)

Foote, Marc C. (Inventor); Jones, Eric W. (Inventor); Caillat, Thierry (Inventor)

2000-01-01

Linear arrays with up to 63 micromachined thermopile infrared detectors on silicon substrates have been constructed and tested. Each detector consists of a suspended silicon nitride membrane with 11 thermocouples of sputtered Bi-Te and Bi-Sb-Te thermoelectric elements films. At room temperature and under vacuum these detectors exhibit response times of 99 ms, zero frequency D* values of 1.4 x 10(exp 9) cmHz(exp 1/2)/W and responsivity values of 1100 V/W when viewing a 1000 K blackbody source. The only measured source of noise above 20 mHz is Johnson noise from the detector resistance. These results represent the best performance reported to date for an array of thermopile detectors. The arrays are well suited for uncooled dispersive point spectrometers. In another embodiment, also with Bi-Te and Bi-Sb-Te thermoelectric materials on micromachined silicon nitride membranes, detector arrays have been produced with D* values as high as 2.2 x 10(exp 9) cm Hz(exp 1/2)/W for 83 ms response times.

Micro-machined resonator oscillator

DOEpatents

Koehler, Dale R.; Sniegowski, Jeffry J.; Bivens, Hugh M.; Wessendorf, Kurt O.

1994-01-01

A micro-miniature resonator-oscillator is disclosed. Due to the miniaturization of the resonator-oscillator, oscillation frequencies of one MHz and higher are utilized. A thickness-mode quartz resonator housed in a micro-machined silicon package and operated as a "telemetered sensor beacon" that is, a digital, self-powered, remote, parameter measuring-transmitter in the FM-band. The resonator design uses trapped energy principles and temperature dependence methodology through crystal orientation control, with operation in the 20-100 MHz range. High volume batch-processing manufacturing is utilized, with package and resonator assembly at the wafer level. Unique design features include squeeze-film damping for robust vibration and shock performance, capacitive coupling through micro-machined diaphragms allowing resonator excitation at the package exterior, circuit integration and extremely small (0.1 in. square) dimensioning. A family of micro-miniature sensor beacons is also disclosed with widespread applications as bio-medical sensors, vehicle status monitors and high-volume animal identification and health sensors. The sensor family allows measurement of temperatures, chemicals, acceleration and pressure. A microphone and clock realization is also available.

Micromachined Millimeter- and Submillimeter-wave SIS Heterodyne Receivers for Remote Sensing

NASA Technical Reports Server (NTRS)

Hu, Qing

1997-01-01

This is a progress report for the second year of a NASA-sponsored project. The report discusses the design and fabrication of micromachined Superconductor Insulator Superconductor (SIS) heterodyne receivers with integrated tuning elements. These receivers tune out the functional capacitance at desired frequencies, resulting in less noise, lower temperatures and broader bandwidths. The report also discusses the design and fabrication of the first monolithic 3x3 focal-plane arrays for a frequency range of 170-210 GHz. Also addressed is the construction of a 9-channel bias and read-out system, as well as the redesign of the IF connections to reduce cross talk between SIS junctions, which become significant a frequency of 1.5 GHz IF. Uniformity of the junction arrays were measured and antenna beam patterns of several array elements under operating conditions also were measured. Finally, video and heterodyne responses of our focal-plane arrays were measured as well. Attached is a paper on: 'Development of a 170-210 GHz 3x3 micromachined SIS imaging array'.

Precision Control Module For UV Laser 3D Micromachining

NASA Astrophysics Data System (ADS)

Wu, Wen-Hong; Hung, Min-Wei; Chang, Chun-Li

2011-01-01

UV laser has been widely used in various micromachining such as micro-scribing or patterning processing. At present, most of the semiconductors, LEDs, photovoltaic solar panels and touch panels industries need the UV laser processing system. However, most of the UV laser processing applications in the industries utilize two dimensional (2D) plane processing. And there are tremendous business opportunities that can be developed, such as three dimensional (3D) structures of micro-electromechanical (MEMS) sensor or the precision depth control of indium tin oxide (ITO) thin films edge insulation in touch panels. This research aims to develop a UV laser 3D micromachining module that can create the novel applications for industries. By special designed beam expender in optical system, the focal point of UV laser can be adjusted quickly and accurately through the optical path control lens of laser beam expender optical system. Furthermore, the integrated software for galvanometric scanner and focal point adjustment mechanism is developed as well, so as to carry out the precise 3D microstructure machining.

Simple and inexpensive micromachined aluminum microfluidic devices for acoustic focusing of particles and cells.

PubMed

Gautam, Gayatri P; Burger, Tobias; Wilcox, Andrew; Cumbo, Michael J; Graves, Steven W; Piyasena, Menake E

2018-05-01

We introduce a new method to construct microfluidic devices especially useful for bulk acoustic wave (BAW)-based manipulation of cells and microparticles. To obtain efficient acoustic focusing, BAW devices require materials that have high acoustic impedance mismatch relative to the medium in which the cells/microparticles are suspended and materials with a high-quality factor. To date, silicon and glass have been the materials of choice for BAW-based acoustofluidic channel fabrication. Silicon- and glass-based fabrication is typically performed in clean room facilities, generates hazardous waste, and can take several hours to complete the microfabrication. To address some of the drawbacks in fabricating conventional BAW devices, we explored a new approach by micromachining microfluidic channels in aluminum substrates. Additionally, we demonstrate plasma bonding of poly(dimethylsiloxane) (PDMS) onto micromachined aluminum substrates. Our goal was to achieve an approach that is both low cost and effective in BAW applications. To this end, we micromachined aluminum 6061 plates and enclosed the systems with a thin PDMS cover layer. These aluminum/PDMS hybrid microfluidic devices use inexpensive materials and are simply constructed outside a clean room environment. Moreover, these devices demonstrate effectiveness in BAW applications as demonstrated by efficient acoustic focusing of polystyrene microspheres, bovine red blood cells, and Jurkat cells and the generation of multiple focused streams in flow-through systems. Graphical abstract The aluminum acoustofluidic device and the generation of multinode focusing of particles.

Magnetohydrodynamic pump with a system for promoting flow of fluid in one direction

DOEpatents

Lemoff, Asuncion V [Union City, CA; Lee, Abraham P [Irvine, CA

2010-07-13

A magnetohydrodynamic pump for pumping a fluid. The pump includes a microfluidic channel for channeling the fluid, a MHD electrode/magnet system operatively connected to the microfluidic channel, and a system for promoting flow of the fluid in one direction in the microfluidic channel. The pump has uses in the medical and biotechnology industries for blood-cell-separation equipment, biochemical assays, chemical synthesis, genetic analysis, drug screening, an array of antigen-antibody reactions, combinatorial chemistry, drug testing, medical and biological diagnostics, and combinatorial chemistry. The pump also has uses in electrochromatography, surface micromachining, laser ablation, inkjet printers, and mechanical micromilling.

Microelectromechanical ratcheting apparatus

DOEpatents

Barnes, Stephen M.; Miller, Samuel L.; Jensen, Brian D.; Rodgers, M. Steven; Burg, Michael S.

2001-01-01

A microelectromechanical (MEM) ratcheting apparatus is disclosed which includes an electrostatic or thermal actuator that drives a moveable member in the form of a ring gear, stage, or rack. Motion is effected by one or more reciprocating pawls driven by the actuator in a direction that is parallel to, in line with, or tangential to the path. The reciprocating pawls engage indexing elements (e.g. teeth or pins) on the moveable member to incrementally move the member along a curved or straight path with the ability to precisely control and determine the position of the moveable member. The MEM apparatus can be formed on a silicon substrate by conventional surface micromachining methods.

Electrically-programmable diffraction grating

DOEpatents

Ricco, A.J.; Butler, M.A.; Sinclair, M.B.; Senturia, S.D.

1998-05-26

An electrically-programmable diffraction grating is disclosed. The programmable grating includes a substrate having a plurality of electrodes formed thereon and a moveable grating element above each of the electrodes. The grating elements are electrostatically programmable to form a diffraction grating for diffracting an incident beam of light as it is reflected from the upper surfaces of the grating elements. The programmable diffraction grating, formed by a micromachining process, has applications for optical information processing (e.g. optical correlators and computers), for multiplexing and demultiplexing a plurality of light beams of different wavelengths (e.g. for optical fiber communications), and for forming spectrometers (e.g. correlation and scanning spectrometers). 14 figs.

78 FR 21099 - Grant of Authority for Subzone Status, Hemlock Semiconductor, L.L.C., (Polysilicon), Clarksville, TN

Federal Register 2010, 2011, 2012, 2013, 2014

2013-04-09

... DEPARTMENT OF COMMERCE Foreign-Trade Zones Board [Order No. 1895] Grant of Authority for Subzone... foreign commerce, and for other purposes,'' and authorizes the Foreign-Trade Zones Board to grant to..., and when the activity results in a significant public benefit and is in the public interest; Whereas...

Nanolaminates with Novel Properties Fabricated Using Atomic Layer Deposition Techniques

DTIC Science & Technology

2006-07-01

Enhance X-Ray Reflectivity of Polysilicon Micro-Mirrors at 1.54 A Wavelength", Proceedings of SPIE 5720, 241-251 (2005). 20. D.C. Miller, C.F...diodes ( OLEDs ). This project has demonstrated that the A120 3 ALD gas diffusion barrier helps to prevent H20 and 02 gases from diffusing through the

A Circuit Extraction System and Graphical Display for VLSI (Very Large Scale Integrated) Design.

DTIC Science & Technology

1989-12-01

understandable as a net-list. The file contains information on the different physical layers of a polysilicon chip, not how these layers combine to form...yperc; struct vwsurf vsurf =DEFAULT_VWSURF(pixwt-ndd); stt-uct vwsurf vsurf2 DEFAULT-VWSURF(pixwfLndd); ma in) another[ Ol =IV while (anothler[0O = ’y

Micro-machined calorimetric biosensors

DOEpatents

Doktycz, Mitchel J.; Britton, Jr., Charles L.; Smith, Stephen F.; Oden, Patrick I.; Bryan, William L.; Moore, James A.; Thundat, Thomas G.; Warmack, Robert J.

2002-01-01

A method and apparatus are provided for detecting and monitoring micro-volumetric enthalpic changes caused by molecular reactions. Micro-machining techniques are used to create very small thermally isolated masses incorporating temperature-sensitive circuitry. The thermally isolated masses are provided with a molecular layer or coating, and the temperature-sensitive circuitry provides an indication when the molecules of the coating are involved in an enthalpic reaction. The thermally isolated masses may be provided singly or in arrays and, in the latter case, the molecular coatings may differ to provide qualitative and/or quantitative assays of a substance.

Fabricating and using a micromachined magnetostatic relay or switch

NASA Technical Reports Server (NTRS)

Tai, Yu-Chong (Inventor); Wright, John A. (Inventor)

2001-01-01

A micromachined magnetostatic relay or switch includes a springing beam on which a magnetic actuation plate is formed. The springing beam also includes an electrically conductive contact. In the presence of a magnetic field, the magnetic material causes the springing beam to bend, moving the electrically conductive contact either toward or away from another contact, and thus creating either an electrical short-circuit or an electrical open-circuit. The switch is fabricated from silicon substrates and is particularly useful in forming a MEMs commutation and control circuit for a miniaturized DC motor.

Optical Micromachining

NASA Technical Reports Server (NTRS)

1998-01-01

Under an SBIR (Small Business Innovative Research) with Marshall Space Flight Center, Potomac Photonics, Inc., constructed and demonstrated a unique tool that fills a need in the area of diffractive and refractive micro-optics. It is an integrated computer-aided design and computer-aided micro-machining workstation that will extend the benefits of diffractive and micro-optic technology to optical designers. Applications of diffractive optics include sensors and monitoring equipment, analytical instruments, and fiber optic distribution and communication. The company has been making diffractive elements with the system as a commercial service for the last year.

Passive front-ends for wideband millimeter wave electronic warfare

NASA Astrophysics Data System (ADS)

Jastram, Nathan Joseph

This thesis presents the analysis, design and measurements of novel passive front ends of interest to millimeter wave electronic warfare systems. However, emerging threats in the millimeter waves (18 GHz and above) has led to a push for new systems capable of addressing these threats. At these frequencies, traditional techniques of design and fabrication are challenging due to small size, limited bandwidth and losses. The use of surface micromachining technology for wideband direction finding with multiple element antenna arrays for electronic support is demonstrated. A wideband tapered slot antenna is first designed and measured as an array element for the subsequent arrays. Both 18--36 GHz and 75--110 GHz amplitude only and amplitude/phase two element direction finding front ends are designed and measured. The design of arrays using Butler matrix and Rotman lens beamformers for greater than two element direction finding over W band and beyond using is also presented. The design of a dual polarized high power capable front end for electronic attack over an 18--45 GHz band is presented. To combine two polarizations into the same radiating aperture, an orthomode transducer (OMT) based upon a new double ridge waveguide cross section is developed. To provide greater flexibility in needed performance characteristics, several different turnstile junction matching sections are tested. A modular horn section is proposed to address flexible and ever changing operational requirements, and is designed for performance criteria such as constant gain, beamwidth, etc. A multi-section branch guide coupler and low loss Rotman lens based upon the proposed cross section are also developed. Prototyping methods for the herein designed millimeter wave electronic warfare front ends are investigated. Specifically, both printed circuit board (PCB) prototyping of micromachined systems and 3D printing of conventionally machined horns are presented. A 4--8 GHz two element array with integrated beamformer fabricated using the stacking of PCB boards is shown, and measured results compare favorably with the micromachined front ends. A 3D printed small aperture horn is compared with a conventionally machined horn, and measured results show similar performance with a ten-fold reduction in cost and weight.

Modifying Surface Chemistry of Metal Oxides for Boosting Dissolution Kinetics in Water by Liquid Cell Electron Microscopy.

PubMed

Lu, Yue; Geng, Jiguo; Wang, Kuan; Zhang, Wei; Ding, Wenqiang; Zhang, Zhenhua; Xie, Shaohua; Dai, Hongxing; Chen, Fu-Rong; Sui, Manling

2017-08-22

Dissolution of metal oxides is fundamentally important for understanding mineral evolution and micromachining oxide functional materials. In general, dissolution of metal oxides is a slow and inefficient chemical reaction. Here, by introducing oxygen deficiencies to modify the surface chemistry of oxides, we can boost the dissolution kinetics of metal oxides in water, as in situ demonstrated in a liquid environmental transmission electron microscope (LETEM). The dissolution rate constant significantly increases by 16-19 orders of magnitude, equivalent to a reduction of 0.97-1.11 eV in activation energy, as compared with the normal dissolution in acid. It is evidenced from the high-resolution TEM imaging, electron energy loss spectra, and first-principle calculations where the dissolution route of metal oxides is dynamically changed by local interoperability between altered water chemistry and surface oxygen deficiencies via electron radiolysis. This discovery inspires the development of a highly efficient electron lithography method for metal oxide films in ecofriendly water, which offers an advanced technique for nanodevice fabrication.

Lab-on-CMOS Integration of Microfluidics and Electrochemical Sensors

PubMed Central

Huang, Yue; Mason, Andrew J.

2013-01-01

This paper introduces a CMOS-microfluidics integration scheme for electrochemical microsystems. A CMOS chip was embedded into a micro-machined silicon carrier. By leveling the CMOS chip and carrier surface to within 100 nm, an expanded obstacle-free surface suitable for photolithography was achieved. Thin film metal planar interconnects were microfabricated to bridge CMOS pads to the perimeter of the carrier, leaving a flat and smooth surface for integrating microfluidic structures. A model device containing SU-8 microfluidic mixers and detection channels crossing over microelectrodes on a CMOS integrated circuit was constructed using the chip-carrier assembly scheme. Functional integrity of microfluidic structures and on-CMOS electrodes was verified by a simultaneous sample dilution and electrochemical detection experiment within multi-channel microfluidics. This lab-on-CMOS integration process is capable of high packing density, is suitable for wafer-level batch production, and opens new opportunities to combine the performance benefits of on-CMOS sensors with lab-on-chip platforms. PMID:23939616

Lab-on-CMOS integration of microfluidics and electrochemical sensors.

PubMed

Huang, Yue; Mason, Andrew J

2013-10-07

This paper introduces a CMOS-microfluidics integration scheme for electrochemical microsystems. A CMOS chip was embedded into a micro-machined silicon carrier. By leveling the CMOS chip and carrier surface to within 100 nm, an expanded obstacle-free surface suitable for photolithography was achieved. Thin film metal planar interconnects were microfabricated to bridge CMOS pads to the perimeter of the carrier, leaving a flat and smooth surface for integrating microfluidic structures. A model device containing SU-8 microfluidic mixers and detection channels crossing over microelectrodes on a CMOS integrated circuit was constructed using the chip-carrier assembly scheme. Functional integrity of microfluidic structures and on-CMOS electrodes was verified by a simultaneous sample dilution and electrochemical detection experiment within multi-channel microfluidics. This lab-on-CMOS integration process is capable of high packing density, is suitable for wafer-level batch production, and opens new opportunities to combine the performance benefits of on-CMOS sensors with lab-on-chip platforms.

Laser induced periodic surface structuring on Si by temporal shaped femtosecond pulses.

PubMed

Almeida, G F B; Martins, R J; Otuka, A J G; Siqueira, J P; Mendonca, C R

2015-10-19

We investigated the effect of temporal shaped femtosecond pulses on silicon laser micromachining. By using sinusoidal spectral phases, pulse trains composed of sub-pulses with distinct temporal separations were generated and applied to the silicon surface to produce Laser Induced Periodic Surface Structures (LIPSS). The LIPSS obtained with different sub-pulse separation were analyzed by comparing the intensity of the two-dimensional fast Fourier Transform (2D-FFT) of the AFM images of the ripples (LIPSS). It was observed that LIPSS amplitude is more emphasized for the pulse train with sub-pulses separation of 128 fs, even when compared with the Fourier transform limited pulse. By estimating the carrier density achieved at the end of each pulse train, we have been able to interpret our results with the Sipe-Drude model, that predicts that LIPSS efficacy is higher for a specific induced carrier density. Hence, our results indicate that temporal shaping of the excitation pulse, performed by spectral phase modulation, can be explored in fs-laser microstructuring.

Effect of sandblasting intensity on microstructures and properties of pure titanium micro-arc oxidation coatings in an optimized composite technique

NASA Astrophysics Data System (ADS)

Wang, Hong-Yuan; Zhu, Rui-Fu; Lu, Yu-Peng; Xiao, Gui-Yong; He, Kun; Yuan, Y. F.; Ma, Xiao-Ni; Li, Ying

2014-02-01

Sandblasting is one of the most effective methods to modify a metal surface and improve its properties for application. Micro-arc oxidation (MAO) could produce a ceramic coating on a dental implant, facilitating cellular differentiation and osseocomposite on it. This study aims to deposit bioceramic Ca- and P-containing coatings on sandblasted commercially pure titanium by an optimum composite technique to improve the bioactive performance. The effect of sandblasting intensity on microstructures and properties of the implant coatings is examined, and the modified surfaces are characterized in terms of their topography, phase, chemical composition, mechanical properties and hydroxyapatite (HA)-inducing ability. The results show that a moderate sandblasting micromachines the substrate in favorable combination of rough and residual stresses; its MAO coating deposits nano-hydroxyapatite after immersion in simulated body fluid (SBF) for 5 days exhibiting better bioactivity. The further improvement of the implant surface performance is attributed to an optimized composite technique.

Advanced deposition model for thermal activated chemical vapor deposition

NASA Astrophysics Data System (ADS)

Cai, Dang

Thermal Activated Chemical Vapor Deposition (TACVD) is defined as the formation of a stable solid product on a heated substrate surface from chemical reactions and/or dissociation of gaseous reactants in an activated environment. It has become an essential process for producing solid film, bulk material, coating, fibers, powders and monolithic components. Global market of CVD products has reached multi billions dollars for each year. In the recent years CVD process has been extensively used to manufacture semiconductors and other electronic components such as polysilicon, AlN and GaN. Extensive research effort has been directed to improve deposition quality and throughput. To obtain fast and high quality deposition, operational conditions such as temperature, pressure, fluid velocity and species concentration and geometry conditions such as source-substrate distance need to be well controlled in a CVD system. This thesis will focus on design of CVD processes through understanding the transport and reaction phenomena in the growth reactor. Since the in situ monitor is almost impossible for CVD reactor, many industrial resources have been expended to determine the optimum design by semi-empirical methods and trial-and-error procedures. This approach has allowed the achievement of improvements in the deposition sequence, but begins to show its limitations, as this method cannot always fulfill the more and more stringent specifications of the industry. To resolve this problem, numerical simulation is widely used in studying the growth techniques. The difficulty of numerical simulation of TACVD crystal growth process lies in the simulation of gas phase and surface reactions, especially the latter one, due to the fact that very limited kinetic information is available in the open literature. In this thesis, an advanced deposition model was developed to study the multi-component fluid flow, homogeneous gas phase reactions inside the reactor chamber, heterogeneous surface reactions on the substrate surface, conductive, convective, inductive and radiative heat transfer, species transport and thereto-elastic stress distributions. Gas phase and surface reactions are studied thermodynamically and kinetically. Based on experimental results, detailed reaction mechanisms are proposed and the deposition rates are predicted. The deposition model proposed could be used for other experiments with similar operating conditions. Four different growth systems are presented in this thesis to discuss comprehensive transport phenomena in crystal growth from vapor. The first is the polysilicon bulk growth by modified Siemens technique in which a silicon tube is used as the starting material. The research effort has been focused on system design, geometric and operating parameters optimization, and heterogeneous and homogeneous silane pyrolysis analysis. The second is the GaN thin film growth by iodine vapor phase epitaxy technique. Heat and mass transport is studied analytically and numerically. Gas phase and surface reactions are analyzed thermodynamically and kinetically. Quasi-equilibrium and kinetic deposition models are developed to predict the growth rate. The third one is the AlN thin film growth by halide vapor phase epitaxy technique. The effects of gas phase and surface reactions on the crystal growth rate and deposition uniformity are studied. The last one is the AlN sublimation growth system. The research effort has been focused on the effect of thermal environment evolution on the crystal growth process. The thermoelastic stress formed in the as-grown AlN crystal is also calculated.

Micro Dot Patterning on the Light Guide Panel Using Powder Blasting.

PubMed

Jang, Ho Su; Cho, Myeong Woo; Park, Dong Sam

2008-02-08

This study is to develop a micromachining technology for a light guidepanel(LGP) mold, whereby micro dot patterns are formed on a LGP surface by a singleinjection process instead of existing screen printing processes. The micro powder blastingtechnique is applied to form micro dot patterns on the LGP mold surface. The optimalconditions for masking, laminating, exposure, and developing processes to form the microdot patterns are first experimentally investigated. A LGP mold with masked micro patternsis then machined using the micro powder blasting method and the machinability of themicro dot patterns is verified. A prototype LGP is test- injected using the developed LGPmold and a shape analysis of the patterns and performance testing of the injected LGP arecarried out. As an additional approach, matte finishing, a special surface treatment method,is applied to the mold surface to improve the light diffusion characteristics, uniformity andbrightness of the LGP. The results of this study show that the applied powder blastingmethod can be successfully used to manufacture LGPs with micro patterns by just singleinjection using the developed mold and thereby replace existing screen printing methods.

Fabrication of an integrated high-quality-factor (high-Q) optofluidic sensor by femtosecond laser micromachining.

PubMed

Song, Jiangxin; Lin, Jintian; Tang, Jialei; Liao, Yang; He, Fei; Wang, Zhaohui; Qiao, Lingling; Sugioka, Koji; Cheng, Ya

2014-06-16

We report on fabrication of a microtoroid resonator of a high-quality factor (i.e., Q-factor of ~3.24 × 10(6) measured under the critical coupling condition) integrated in a microfluidic channel using femtosecond laser three-dimensional (3D) micromachining. Coupling of light into and out of the microresonator has been realized with a fiber taper that is reliably assembled with the microtoroid. The assembly of the fiber to the microtoroid is achieved by welding the fiber taper onto the sidewall of the microtoroid using CO2 laser irradiation. The integrated microresonator maintains a high Q-factor of 3.21 × 10(5) as measured in air, which should still be sufficient for many sensing applications. We test the functionality of the integrated optofluidic sensor by performing bulk refractive index sensing of purified water doped with tiny amount of salt. It is shown that a detection limit of ~1.2 × 10(-4) refractive index unit can be achieved. Our result showcases the capability of integration of high-Q microresonators with complex microfluidic systems using femtosecond laser 3D micromachining.

Integrated Arrays on Silicon at Terahertz Frequencies

NASA Technical Reports Server (NTRS)

Chattopadhayay, Goutam; Lee, Choonsup; Jung, Cecil; Lin, Robert; Peralta, Alessandro; Mehdi, Imran; Llombert, Nuria; Thomas, Bertrand

2011-01-01

In this paper we explore various receiver font-end and antenna architecture for use in integrated arrays at terahertz frequencies. Development of wafer-level integrated terahertz receiver front-end by using advanced semiconductor fabrication technologies and use of novel integrated antennas with silicon micromachining are reported. We report novel stacking of micromachined silicon wafers which allows for the 3-dimensional integration of various terahertz receiver components in extremely small packages which easily leads to the development of 2- dimensioanl multi-pixel receiver front-ends in the terahertz frequency range. We also report an integrated micro-lens antenna that goes with the silicon micro-machined front-end. The micro-lens antenna is fed by a waveguide that excites a silicon lens antenna through a leaky-wave or electromagnetic band gap (EBG) resonant cavity. We utilized advanced semiconductor nanofabrication techniques to design, fabricate, and demonstrate a super-compact, low-mass submillimeter-wave heterodyne frontend. When the micro-lens antenna is integrated with the receiver front-end we will be able to assemble integrated heterodyne array receivers for various applications such as multi-pixel high resolution spectrometer and imaging radar at terahertz frequencies.

Long-Term Outdoor Reliability Assessment of a Wireless Unit for Air-Quality Monitoring Based on Nanostructured Films Integrated on Micromachined Platforms

PubMed Central

Leccardi, Matteo; Decarli, Massimiliano; Lorenzelli, Leandro; Milani, Paolo; Mettala, Petteri; Orava, Risto; Barborini, Emanuele

2012-01-01

We have fabricated and tested in long-term field operating conditions a wireless unit for outdoor air quality monitoring. The unit is equipped with two multiparametric sensors, one miniaturized thermo-hygrometer, front-end analogical and digital electronics, and an IEEE 802.15.4 based module for wireless data transmission. Micromachined platforms were functionalized with nanoporous metal-oxides to obtain multiparametric sensors, hosting gas-sensitive, anemometric and temperature transducers. Nanoporous metal-oxide layer was directly deposited on gas sensing regions of micromachined platform batches by hard-mask patterned supersonic cluster beam deposition. An outdoor, roadside experiment was arranged in downtown Milan (Italy), where one wireless sensing unit was continuously operated side by side with standard gas chromatographic instrumentation for air quality measurements. By means of a router PC, data from sensing unit and other instrumentation were collected, merged, and sent to a remote data storage server, through an UMTS device. The whole-system robustness as well as sensor dataset characteristics were continuously characterized over a run-time period of 18 months. PMID:22969394

Micro-machined resonator oscillator

DOEpatents

Koehler, D.R.; Sniegowski, J.J.; Bivens, H.M.; Wessendorf, K.O.

1994-08-16

A micro-miniature resonator-oscillator is disclosed. Due to the miniaturization of the resonator-oscillator, oscillation frequencies of one MHz and higher are utilized. A thickness-mode quartz resonator housed in a micro-machined silicon package and operated as a telemetered sensor beacon'' that is, a digital, self-powered, remote, parameter measuring-transmitter in the FM-band. The resonator design uses trapped energy principles and temperature dependence methodology through crystal orientation control, with operation in the 20--100 MHz range. High volume batch-processing manufacturing is utilized, with package and resonator assembly at the wafer level. Unique design features include squeeze-film damping for robust vibration and shock performance, capacitive coupling through micro-machined diaphragms allowing resonator excitation at the package exterior, circuit integration and extremely small (0.1 in. square) dimensioning. A family of micro-miniature sensor beacons is also disclosed with widespread applications as bio-medical sensors, vehicle status monitors and high-volume animal identification and health sensors. The sensor family allows measurement of temperatures, chemicals, acceleration and pressure. A microphone and clock realization is also available. 21 figs.

Laser micromachining of biofactory-on-a-chip devices

NASA Astrophysics Data System (ADS)

Burt, Julian P.; Goater, Andrew D.; Hayden, Christopher J.; Tame, John A.

2002-06-01

Excimer laser micromachining provides a flexible means for the manufacture and rapid prototyping of miniaturized systems such as Biofactory-on-a-Chip devices. Biofactories are miniaturized diagnostic devices capable of characterizing, manipulating, separating and sorting suspension of particles such as biological cells. Such systems operate by exploiting the electrical properties of microparticles and controlling particle movement in AC non- uniform stationary and moving electric fields. Applications of Biofactory devices are diverse and include, among others, the healthcare, pharmaceutical, chemical processing, environmental monitoring and food diagnostic markets. To achieve such characterization and separation, Biofactory devices employ laboratory-on-a-chip type components such as complex multilayer microelectrode arrays, microfluidic channels, manifold systems and on-chip detection systems. Here we discuss the manufacturing requirements of Biofactory devices and describe the use of different excimer laser micromachined methods both in stand-alone processes and also in conjunction with conventional fabrication processes such as photolithography and thermal molding. Particular attention is given to the production of large area multilayer microelectrode arrays and the manufacture of complex cross-section microfluidic channel systems for use in simple distribution and device interfacing.

ZnO thin film piezoelectric micromachined microphone with symmetric composite vibrating diaphragm

NASA Astrophysics Data System (ADS)

Li, Junhong; Wang, Chenghao; Ren, Wei; Ma, Jun

2017-05-01

Residual stress is an important factor affecting the sensitivity of piezoelectric micromachined microphone. A symmetric composite vibrating diaphragm was adopted in the micro electro mechanical systems piezoelectric microphone to decrease the residual stress and improve the sensitivity of microphone in this paper. The ZnO film was selected as piezoelectric materials of microphone for its higher piezoelectric coefficient d 31 and lower relative dielectric constant. The thickness optimization of piezoelectric film on square diaphragm is difficult to be fulfilled by analytic method. To optimize the thickness of ZnO films, the stress distribution in ZnO film was analyzed by finite element method and the average stress in different thickness of ZnO films was given. The ZnO films deposited using dc magnetron sputtering exhibits a densely packed structure with columnar crystallites preferentially oriented along (002) plane. The diaphragm of microphone fabricated by micromachining techniques is flat and no wrinkling at corners, and the sensitivity of microphone is higher than 1 mV Pa-1. These results indicate the diaphragm has lower residual stress.

Charge-Coupled Scanned IR Imaging Sensors

DTIC Science & Technology

1974-07-15

DATE 15 July 1974 O NUMBER OF PAGES 37 IS SECURITY CLASS, ( ol Ihi3 teporl) Unclassified 15a DECLASSIFICATION DOWNGRATING...SCHEDULE N/A 16 DISTRIBUTION STATEMENT’oMhi» Htpu.- A - Approved for public release; distribution unlimited. 17 DISTRIBUTION STATEMENT ( ol ...overlapping layers of polysilicon and metal for improved shift-register performance and stability. This linear array should provide the information

Synthetic Lubricating Oil Greases Containing Metal Chelates of Schiff Bases

DTIC Science & Technology

1992-09-15

bearing tester. The data generated from the test is pres- . ol Oil/10rs•al~s okfa, otl/ i.03 - ented in Table il1. cloy Thicsed Grews TABLE MI +3% aeys...groups having I to 6 hydrocarbons. the polysilicones . the siloxanes e.g. sili- carbon atoms and X is a number rankbing from I to 12. cone esters, the

Synthesis of Mismatched Heterojunction/Substrate Interfaces

DTIC Science & Technology

1991-10-11

and advantages of strained layers. DD IZ JAN7 1473 EDITION OF INOV 65 IS OBSOLETE *’~~s.*. ~ ~.-A ~’ SECURITY CLASSIFICATIO14 Ol THIS PAGE (When Dsea...cross-section is shown ini 1-ig. 1.14(a), is analogous to the polysilicon -gate FET in Si-MOS devices. From the band diagam in Fig 1.14(b), it can be seen

Micromechanical Characterization of Polysilicon Films through On-Chip Tests

PubMed Central

Mirzazadeh, Ramin; Eftekhar Azam, Saeed; Mariani, Stefano

2016-01-01

When the dimensions of polycrystalline structures become comparable to the average grain size, some reliability issues can be reported for the moving parts of inertial microelectromechanical systems (MEMS). Not only the overall behavior of the device turns out to be affected by a large scattering, but also the sensitivity to imperfections gets enhanced. In this work, through on-chip tests, we experimentally investigate the behavior of thin polysilicon samples using standard electrostatic actuation/sensing. The discrepancy between the target and actual responses of each sample has then been exploited to identify: (i) the overall stiffness of the film and, according to standard continuum elasticity, a morphology-based value of its Young’s modulus; (ii) the relevant over-etch induced by the fabrication process. To properly account for the aforementioned stochastic features at the micro-scale, the identification procedure has been based on particle filtering. A simple analytical reduced-order model of the moving structure has been also developed to account for the nonlinearities in the electrical field, up to pull-in. Results are reported for a set of ten film samples of constant slenderness, and the effects of different actuation mechanisms on the identified micromechanical features are thoroughly discussed. PMID:27483268

Micromechanical Characterization of Polysilicon Films through On-Chip Tests.

PubMed

Mirzazadeh, Ramin; Eftekhar Azam, Saeed; Mariani, Stefano

2016-07-28

When the dimensions of polycrystalline structures become comparable to the average grain size, some reliability issues can be reported for the moving parts of inertial microelectromechanical systems (MEMS). Not only the overall behavior of the device turns out to be affected by a large scattering, but also the sensitivity to imperfections gets enhanced. In this work, through on-chip tests, we experimentally investigate the behavior of thin polysilicon samples using standard electrostatic actuation/sensing. The discrepancy between the target and actual responses of each sample has then been exploited to identify: (i) the overall stiffness of the film and, according to standard continuum elasticity, a morphology-based value of its Young's modulus; (ii) the relevant over-etch induced by the fabrication process. To properly account for the aforementioned stochastic features at the micro-scale, the identification procedure has been based on particle filtering. A simple analytical reduced-order model of the moving structure has been also developed to account for the nonlinearities in the electrical field, up to pull-in. Results are reported for a set of ten film samples of constant slenderness, and the effects of different actuation mechanisms on the identified micromechanical features are thoroughly discussed.

The challenge of screen printed Ag metallization on nano-scale poly-silicon passivated contacts for silicon solar cells

NASA Astrophysics Data System (ADS)

Jiang, Lin; Song, Lixin; Yan, Li; Becht, Gregory; Zhang, Yi; Hoerteis, Matthias

2017-08-01

Passivated contacts can be used to reduce metal-induced recombination for higher energy conversion efficiency for silicon solar cells, and are obtained increasing attentions by PV industries in recent years. The reported thicknesses of passivated contact layers are mostly within tens of nanometer range, and the corresponding metallization methods are realized mainly by plating/evaporation technology. This high cost metallization cannot compete with the screen printing technology, and may affect its market potential comparing with the presently dominant solar cell technology. Very few works have been reported on screen printing metallization on passivated contact solar cells. Hence, there is a rising demand to realize screen printing metallization technology on this topic. In this work, we investigate applying screen printing metallization pastes on poly-silicon passivated contacts. The critical challenge for us is to build low contact resistance that can be competitive to standard technology while restricting the paste penetrations within the thin nano-scale passivated contact layers. The contact resistivity of 1.1mohm-cm2 and the open circuit voltages > 660mV are achieved, and the most appropriate thickness range is estimated to be around 80 150nm.

Study on the failure temperature of Ti/Pt/Au and Pt5Si2-Ti/Pt/Au metallization systems

NASA Astrophysics Data System (ADS)

Zhang, Jie; Han, Jianqiang; Yin, Yijun; Dong, Lizhen; Niu, Wenju

2017-09-01

The Ti/Pt/Au metallization system has an advantage of resisting KOH or TMAH solution etching. To form a good ohmic contact, the Ti/Pt/Au metallization system must be alloyed at 400 °C. However, the process temperatures of typical MEMS packaging technologies, such as anodic bonding, glass solder bonding and eutectic bonding, generally exceed 400 °C. It is puzzling if the Ti/Pt/Au system is destroyed during the subsequent packaging process. In the present work, the resistance of doped polysilicon resistors contacted by the Ti/Pt/Au metallization system that have undergone different temperatures and time are measured. The experimental results show that the ohmic contacts will be destroyed if heated to 500 °C. But if a 20 nm Pt film is sputtered on heavily doped polysilicon and alloyed at 700 °C before sputtering Ti/Pt/Au films, the Pt5Si2-Ti/Pt/Au metallization system has a higher service temperature of 500 °C, which exceeds process temperatures of most typical MEMS packaging technologies. Project supported by the National Natural Science Foundation of China (No. 61376114).

MEMS high-speed angular-position sensing system with rf wireless transmission

NASA Astrophysics Data System (ADS)

Sun, Winston; Li, Wen J.

2001-08-01

A novel surface-micromachined non-contact high-speed angular-position sensor with total surface area under 4mm2 was developed using the Multi-User MEMS Processes (MUMPs) and integrated with a commercial RF transmitter at 433MHz carrier frequency for wireless signal detection. Currently, a 2.3 MHz internal clock of our data acquisition system and a sensor design with a 13mg seismic mass is sufficient to provide visual observation of a clear sinusoidal response wirelessly generated by the piezoresistive angular-position sensing system within speed range of 180 rpm to around 1000 rpm. Experimental results showed that the oscillation frequency and amplitude are related to the input angular frequency of the rotation disk and the tilt angle of the rotation axis, respectively. These important results could provide groundwork for MEMS researchers to estimate how gravity influences structural properties of MEMS devices under different circumstances.

Multifunctional-layered materials for creating membrane-restricted nanodomains and nanoscale imaging

NASA Astrophysics Data System (ADS)

Srinivasan, P.

2016-01-01

Experimental platform that allows precise spatial positioning of biomolecules with an exquisite control at nanometer length scales is a valuable tool to study the molecular mechanisms of membrane bound signaling. Using micromachined thin film gold (Au) in layered architecture, it is possible to add both optical and biochemical functionalities in in vitro. Towards this goal, here, I show that docking of complementary DNA tethered giant phospholiposomes on Au surface can create membrane-restricted nanodomains. These nanodomains are critical features to dissect molecular choreography of membrane signaling complexes. The excited surface plasmon resonance modes of Au allow label-free imaging at diffraction-limited resolution of stably docked DNA tethered phospholiposomes, and lipid-detergent bicelle structures. Such multifunctional building block enables realizing rigorously controlled in vitro set-up to model membrane anchored biological signaling, besides serving as an optical tool for nanoscale imaging.

Apparatus and method for sensing motion in a microelectro-mechanical system

DOEpatents

Dickey, Fred M.; Holswade, Scott C.

1999-01-01

An apparatus and method are disclosed for optically sensing motion in a microelectromechanical system (also termed a MEMS device) formed by surface micromachining or LIGA. The apparatus operates by reflecting or scattering a light beam off a corrugated surface (e.g. gear teeth or a reference feature) of a moveable member (e.g. a gear, rack or linkage) within the MEMS device and detecting the reflected or scattered light. The apparatus can be used to characterize a MEMS device, measuring one or more performance characteristic such as spring and damping coefficients, torque and friction, or uniformity of motion of the moveable member. The apparatus can also be used to determine the direction and extent of motion of the moveable member; or to determine a particular mechanical state that a MEMS device is in. Finally, the apparatus and method can be used for providing feedback to the MEMS device to improve performance and reliability.

An experimental analysis of process parameters to manufacture micro-channels in AISI H13 tempered steel by laser micro-milling

NASA Astrophysics Data System (ADS)

Teixidor, D.; Ferrer, I.; Ciurana, J.

2012-04-01

This paper reports the characterization of laser machining (milling) process to manufacture micro-channels in order to understand the incidence of process parameters on the final features. Selection of process operational parameters is highly critical for successful laser micromachining. A set of designed experiments is carried out in a pulsed Nd:YAG laser system using AISI H13 hardened tool steel as work material. Several micro-channels have been manufactured as micro-mold cavities varying parameters such as scanning speed (SS), pulse intensity (PI) and pulse frequency (PF). Results are obtained by evaluating the dimensions and the surface finish of the micro-channel. The dimensions and shape of the micro-channels produced with laser-micro-milling process exhibit variations. In general the use of low scanning speeds increases the quality of the feature in both surface finishing and dimensional.

Micromachined piconewton force sensor for biophysics investigations

DOE Office of Scientific and Technical Information (OSTI.GOV)

Koch, Steven J.; Thayer, Gayle E.; Corwin, Alex D.

2006-10-23

We describe a micromachined force sensor that is able to measure forces as small as 1 pN in both air and water. First, we measured the force field produced by an electromagnet on individual 2.8 {mu}m magnetic beads glued to the sensor. By repeating with 11 different beads, we measured a 9% standard deviation in saturation magnetization. We next demonstrated that the sensor was fully functional when immersed in physiological buffer. These results show that the force sensors can be useful for magnetic force calibration and also for measurement of biophysical forces on chip.