21 CFR 1002.20 - Reporting of accidental radiation occurrences.

Code of Federal Regulations, 2012 CFR

2012-04-01

... 21 Food and Drugs 8 2012-04-01 2012-04-01 false Reporting of accidental radiation occurrences... SERVICES (CONTINUED) RADIOLOGICAL HEALTH RECORDS AND REPORTS Manufacturers' Reports on Accidental Radiation Occurrences § 1002.20 Reporting of accidental radiation occurrences. (a) Manufacturers of electronic products...

21 CFR 1002.51 - Exemptions for manufacturers of products intended for the U.S. Government.

Code of Federal Regulations, 2010 CFR

2010-04-01

..., DEPARTMENT OF HEALTH AND HUMAN SERVICES (CONTINUED) RADIOLOGICAL HEALTH RECORDS AND REPORTS Exemptions From Records and Reports Requirements § 1002.51 Exemptions for manufacturers of products intended for the U.S... Health, may exempt from the provisions of this part a manufacturer of any electronic product intended for...

21 CFR 1002.30 - Records to be maintained by manufacturers.

Code of Federal Regulations, 2010 CFR

2010-04-01

... (CONTINUED) RADIOLOGICAL HEALTH RECORDS AND REPORTS Manufacturers' Records § 1002.30 Records to be maintained... procedures with respect to electronic product radiation safety. (2) Records of the results of tests for... increase electronic product radiation emission, records of the results of tests for durability and...

Electronic Systems for Spacecraft Vehicles: Required EDA Tools

NASA Technical Reports Server (NTRS)

Bachnak, Rafic

1999-01-01

The continuous increase in complexity of electronic systems is making the design and manufacturing of such systems more challenging than ever before. As a result, designers are finding it impossible to design efficient systems without the use of sophisticated Electronic Design Automation (EDA) tools. These tools offer integrated simulation of the electrical, mechanical, and manufacturing functions and lead to a correct by design methodology. This report identifies the EDA tools that would be needed to design, analyze, simulate, and evaluate electronic systems for spacecraft vehicles. In addition, the report presents recommendations to enhance the current JSC electronic design capabilities. This includes cost information and a discussion as to the impact, both positive and negative, of implementing the recommendations.

Guide for preparing annual reports on radiation-safety testing of electronic products (general)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Not Available

For manufacturers of electronic products other than those for which a specific guide has been issued, the guide replaces the Guide for the Filing of Annual Reports (21 CFR Subchapter J, Section 1002.11), HHS Publication FDA 82-8127. The electronic product (general) annual reporting guide is applicable to the following products: products intended to produce x radiation (accelerators, analytical devices, therapy x-ray machines); microwave diathermy machines; cold-cathode discharge tubes; and vacuum switches and tubes operating at or above 15,000 volts. To carry out its responsibilities under Public Law 90-602, the Food and Drug Administration's Center for Devices and Radiological Health (CDRH)more » has issued a series of regulations contained in Title 21 of the Code of Federal Regulations (CFR). Part 1002 of 21 CFR deals with records and reports. Section 1002.61 categorizes electronic products into Groups A through C. Section 1002.30 requires manufacturers of products in Groups B and C to establish and maintain certain records, while Section 1002.11 requires such manufacturers to submit an Annual Report summarizing the contents of the required records. Section 1002.7 requires that reports conform to reporting guides issued by CDRH unless an acceptable justification for an alternate format is provided.« less

Verify Module for Reporting A/C and Off-Cycle GHG Credits for Light-Duty Vehicle and Truck Manufacturers

EPA Pesticide Factsheets

This EPA presentation provides information on using the new Verify module, streamlining the process required to electronically submit annual reporting of air conditioning (A/C) and off-cycle GHG credits for light duty manufacturers.

75 FR 74773 - Mandatory Reporting of Greenhouse Gases: Additional Sources of Fluorinated GHGs

Federal Register 2010, 2011, 2012, 2013, 2014

2010-12-01

..., Methods for Estimating Air Emissions from Chemical Manufacturing Facilities; Protocol for Equipment Leak... chemical vapor deposition process (CVD) or other manufacturing processes use N 2 O. Production processes.... N 2 O emissions from chemical vapor deposition and other electronics manufacturing processes...

Best Manufacturing Practices: Report of Survey Conducted at Texas Instruments Defense Systems and Electronics Group, Dallas, Texas

DTIC Science & Technology

1988-06-01

Washington, DC Richard Celin Naval Air Engineering Center (201) 323-2173 Lakehurst, NJ Alice Giampapa TRIAD Engineering Co., Inc. Administrative (609) 939...7 3.1 DESIGN DESIGN PROCESS Producibility Engineering ........................................................ 7 Producibility Advisor... Engineers in Manufacturing Processes ........................... 21 Method Improvement Report Program

21 CFR 803.53 - If I am a manufacturer, in which circumstances must I submit a 5-day report?

Code of Federal Regulations, 2010 CFR

2010-04-01

... must I submit a 5-day report? 803.53 Section 803.53 Food and Drugs FOOD AND DRUG ADMINISTRATION... Reporting Requirements § 803.53 If I am a manufacturer, in which circumstances must I submit a 5-day report? You must submit a 5-day report to us, on Form 3500A or an electronic equivalent approved under § 803...

21 CFR 803.53 - If I am a manufacturer, in which circumstances must I submit a 5-day report?

Code of Federal Regulations, 2012 CFR

2012-04-01

... must I submit a 5-day report? 803.53 Section 803.53 Food and Drugs FOOD AND DRUG ADMINISTRATION... Reporting Requirements § 803.53 If I am a manufacturer, in which circumstances must I submit a 5-day report? You must submit a 5-day report to us, on Form 3500A or an electronic equivalent approved under § 803...

21 CFR 803.53 - If I am a manufacturer, in which circumstances must I submit a 5-day report?

Code of Federal Regulations, 2013 CFR

2013-04-01

... must I submit a 5-day report? 803.53 Section 803.53 Food and Drugs FOOD AND DRUG ADMINISTRATION... Reporting Requirements § 803.53 If I am a manufacturer, in which circumstances must I submit a 5-day report? You must submit a 5-day report to us, on Form 3500A or an electronic equivalent approved under § 803...

21 CFR 803.53 - If I am a manufacturer, in which circumstances must I submit a 5-day report?

Code of Federal Regulations, 2011 CFR

2011-04-01

... must I submit a 5-day report? 803.53 Section 803.53 Food and Drugs FOOD AND DRUG ADMINISTRATION... Reporting Requirements § 803.53 If I am a manufacturer, in which circumstances must I submit a 5-day report? You must submit a 5-day report to us, on Form 3500A or an electronic equivalent approved under § 803...

NASA Tech Briefs, January 1998. Volume 22, No. 1

NASA Technical Reports Server (NTRS)

1998-01-01

Topics: Sensors/Data Acquisition; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Life Sciences; Books and Reports.

NASA Tech Briefs, January 1997. Volume 21, No. 1

NASA Technical Reports Server (NTRS)

1997-01-01

Topics: Sensors; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Books and Reports.

NASA Tech Briefs, May 1998. Volume 22, No. 5

NASA Technical Reports Server (NTRS)

1998-01-01

Topics include: special coverage on advanced composites, plastics and metals, electronic components and circuits, electronic systems, physical sciences, computer software, mechanics, machinery/automation, manufacturing/fabrication book and reports, and a special section of Electronics Tech Briefs.

NASA Tech Briefs, December 1997. Volume 21, No. 12

NASA Technical Reports Server (NTRS)

1997-01-01

Topics: Design and Analysis Software; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Manufacturing/Fabrication; Mathematics and Information Sciences; Books and Reports.

NASA Tech Briefs, June 1996. Volume 20, No. 6

NASA Technical Reports Server (NTRS)

1996-01-01

Topics: New Computer Hardware; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences;Books and Reports.

NASA Tech Briefs, March 1996. Volume 20, No. 3

NASA Technical Reports Server (NTRS)

1996-01-01

Topics: Computer-Aided Design and Engineering; Electronic Components and Cicuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information; Books and Reports.

NASA Tech Briefs, September 1996. Volume 20, No. 9

NASA Technical Reports Server (NTRS)

1996-01-01

Topics: Data Acquisition and Analysis; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Books and Reports.

NASA Tech Briefs, September 1993. Volume 17, No. 9

NASA Technical Reports Server (NTRS)

1993-01-01

Topics include: Microelectronics; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

The AMTEX Partnership{trademark}. First quarter report, Fiscal year 1996

DOE Office of Scientific and Technical Information (OSTI.GOV)

NONE

1995-12-01

The AMTEX Partnership is a collaborative research and development program among the US Integrated Textile Industry, DOE, the National Laboratories, other federal agencies and laboratories, and universities. The goal of AMTEX is to strengthen the competitiveness of this vital industry, thereby preserving and creating US jobs. Topics in this quarters report include: computer-aided fabric evaluation, cotton biotechnology, demand activated manufacturing architecture, electronic embedded fingerprints, on-line process control in flexible fiber manufacturing, rapid cutting, sensors for agile manufacturing, and textile resource conservation.

NASA Tech Briefs, August 1997. Volume 21, No. 8

NASA Technical Reports Server (NTRS)

1997-01-01

Topics:Graphics and Simulation; Mechanical Components; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Books and Reports.

NASA Tech Briefs, June 1994. Volume 18, No. 6

NASA Technical Reports Server (NTRS)

1994-01-01

Topics covered include: Microelectronics; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

NASA Tech Briefs, October 1996. Volume 20, No. 10

NASA Technical Reports Server (NTRS)

1996-01-01

Topics covered include: Sensors; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

NASA Tech Briefs, June 1997. Volume 21, No. 6

NASA Technical Reports Server (NTRS)

1997-01-01

Topics include: Computer Hardware and Peripherals; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Books and Reports.

All-inkjet-printed thin-film transistors: manufacturing process reliability by root cause analysis.

PubMed

Sowade, Enrico; Ramon, Eloi; Mitra, Kalyan Yoti; Martínez-Domingo, Carme; Pedró, Marta; Pallarès, Jofre; Loffredo, Fausta; Villani, Fulvia; Gomes, Henrique L; Terés, Lluís; Baumann, Reinhard R

2016-09-21

We report on the detailed electrical investigation of all-inkjet-printed thin-film transistor (TFT) arrays focusing on TFT failures and their origins. The TFT arrays were manufactured on flexible polymer substrates in ambient condition without the need for cleanroom environment or inert atmosphere and at a maximum temperature of 150 °C. Alternative manufacturing processes for electronic devices such as inkjet printing suffer from lower accuracy compared to traditional microelectronic manufacturing methods. Furthermore, usually printing methods do not allow the manufacturing of electronic devices with high yield (high number of functional devices). In general, the manufacturing yield is much lower compared to the established conventional manufacturing methods based on lithography. Thus, the focus of this contribution is set on a comprehensive analysis of defective TFTs printed by inkjet technology. Based on root cause analysis, we present the defects by developing failure categories and discuss the reasons for the defects. This procedure identifies failure origins and allows the optimization of the manufacturing resulting finally to a yield improvement.

NASA Tech Briefs, February 1997. Volume 2, No. 2

NASA Technical Reports Server (NTRS)

1997-01-01

Topics include: Test and Measurement; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

NASA Tech Briefs, November 1996. Volume 20, No. 11

NASA Technical Reports Server (NTRS)

1996-01-01

Topics covered: Video and Imaging; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

NASA Tech Briefs, December 1996. Volume 20, No. 12

NASA Technical Reports Server (NTRS)

1996-01-01

Topics: Design and Analysis Software; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

NASA Tech Briefs, May 1996. Volume 20, No. 5

NASA Technical Reports Server (NTRS)

1996-01-01

Topics include: Video and Imaging;Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

NASA Tech Briefs, May 1994. Volume 18, No. 5

NASA Technical Reports Server (NTRS)

1994-01-01

Topics covered include: Robotics/Automation; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

NASA Tech Briefs, July 1996. Volume 20, No. 7

NASA Technical Reports Server (NTRS)

1996-01-01

Topics covered include: Mechanical Components; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

NASA Tech Briefs, April 1997. Volume 21, No. 4

NASA Technical Reports Server (NTRS)

1997-01-01

Topics covered include: Video and Imaging; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

NASA Tech Briefs, December 1993. Volume 17, No. 12

NASA Technical Reports Server (NTRS)

1993-01-01

Topics covered include: High-Performance Computing; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

NASA Tech Briefs, October 1997. Volume 21, No. 10

NASA Technical Reports Server (NTRS)

1997-01-01

Topics covered include: Sensors/Imaging; Mechanical Components; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

NASA Tech Briefs, April 1994. Volume 18, No. 4

NASA Technical Reports Server (NTRS)

1994-01-01

Topics covered: Advanced Composites and Plastics; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

NASA Tech Briefs, March 1994. Volume 18, No. 3

NASA Technical Reports Server (NTRS)

1994-01-01

Topics include: Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

NASA Tech Briefs, August 1996. Volume 20, No. 8

NASA Technical Reports Server (NTRS)

1996-01-01

Topics covered include: Graphics and Simulation; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

NASA Tech Briefs, March 2000. Volume 24, No. 3

NASA Technical Reports Server (NTRS)

2000-01-01

Topics include: Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

NASA Tech Briefs, March 1997. Volume 21, No. 3

NASA Technical Reports Server (NTRS)

1997-01-01

Topics: Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

NASA Tech Briefs, July 1994. Volume 18, No. 7

NASA Technical Reports Server (NTRS)

1994-01-01

Topics covered include: Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

NASA Tech Briefs, May 1997. Volume 21, No. 5

NASA Technical Reports Server (NTRS)

1997-01-01

Topics covered include: Advanced Composites, Plastics and Metals; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

NASA Tech Briefs, April 1996. Volume 20, No. 4

NASA Technical Reports Server (NTRS)

1996-01-01

Topics covered include: Advanced Composites and Plastics; Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information; Books and Reports.

"Cut-and-paste" manufacture of multiparametric epidermal electronic systems

NASA Astrophysics Data System (ADS)

Lu, Nanshu; Yang, Shixuan; Wang, Pulin

2016-05-01

Epidermal electronics is a class of noninvasive and unobstructive skin-mounted, tattoo-like sensors and electronics capable of vital sign monitoring and establishing human-machine interface. The high cost of manpower, materials, vacuum equipment, and photolithographic facilities associated with its manufacture greatly hinders the widespread use of disposable epidermal electronics. Here we report a cost and time effective, completely dry, benchtop "cut-and-paste" method for the freeform and portable manufacture of multiparametric epidermal sensor systems (ESS) within minutes. This versatile method works for all types of thin metal and polymeric sheets and is compatible with any tattoo adhesives or medical tapes. The resulting ESS are multimaterial and multifunctional and have been demonstrated to noninvasively but accurately measure electrophysiological signals, skin temperature, skin hydration, as well as respiratory rate. In addition, planar stretchable coils exploiting double-stranded serpentine design have been successfully applied as wireless, passive epidermal strain sensors.

Electronics Worksite Training Project. Final Report.

ERIC Educational Resources Information Center

Hata, David M.; Morris, Richard D.

The Oregon Electronics Worksite Training Program created a system for delivering vocational education and training to individuals employed within the electronics and manufacturing industry in the Portland metropolitan area. The approach selected by Portland Community College was to use interactive video instructional materials in a self-study,…

NASA Tech Briefs, July 1995. Volume 19, No. 7

NASA Technical Reports Server (NTRS)

1995-01-01

Topics include: mechanical components, electronic components and circuits, electronic systems, physical sciences, materials, computer programs, mechanics, machinery, manufacturing/fabrication, mathematics and information sciences, book and reports, and a special section of Federal laboratory computing Tech Briefs.

NASA Tech Briefs, June 1995. Volume 19, No. 6

NASA Technical Reports Server (NTRS)

1995-01-01

Topics include: communications technology, electronic components and circuits, electronic systems, physical sciences, materials, computer programs, mechanics, machinery, manufacturing/fabrication, mathematics and information sciences, life sciences, books and reports, a special section of laser Tech Briefs.

Additive Manufacturing Processes: Selective Laser Melting, Electron Beam Melting and Binder Jetting—Selection Guidelines

PubMed Central

Konda Gokuldoss, Prashanth; Kolla, Sri; Eckert, Jürgen

2017-01-01

Additive manufacturing (AM), also known as 3D printing or rapid prototyping, is gaining increasing attention due to its ability to produce parts with added functionality and increased complexities in geometrical design, on top of the fact that it is theoretically possible to produce any shape without limitations. However, most of the research on additive manufacturing techniques are focused on the development of materials/process parameters/products design with different additive manufacturing processes such as selective laser melting, electron beam melting, or binder jetting. However, we do not have any guidelines that discuss the selection of the most suitable additive manufacturing process, depending on the material to be processed, the complexity of the parts to be produced, or the design considerations. Considering the very fact that no reports deal with this process selection, the present manuscript aims to discuss the different selection criteria that are to be considered, in order to select the best AM process (binder jetting/selective laser melting/electron beam melting) for fabricating a specific component with a defined set of material properties. PMID:28773031

Additive Manufacturing Processes: Selective Laser Melting, Electron Beam Melting and Binder Jetting-Selection Guidelines.

PubMed

Gokuldoss, Prashanth Konda; Kolla, Sri; Eckert, Jürgen

2017-06-19

Additive manufacturing (AM), also known as 3D printing or rapid prototyping, is gaining increasing attention due to its ability to produce parts with added functionality and increased complexities in geometrical design, on top of the fact that it is theoretically possible to produce any shape without limitations. However, most of the research on additive manufacturing techniques are focused on the development of materials/process parameters/products design with different additive manufacturing processes such as selective laser melting, electron beam melting, or binder jetting. However, we do not have any guidelines that discuss the selection of the most suitable additive manufacturing process, depending on the material to be processed, the complexity of the parts to be produced, or the design considerations. Considering the very fact that no reports deal with this process selection, the present manuscript aims to discuss the different selection criteria that are to be considered, in order to select the best AM process (binder jetting/selective laser melting/electron beam melting) for fabricating a specific component with a defined set of material properties.

All-inkjet-printed thin-film transistors: manufacturing process reliability by root cause analysis

PubMed Central

Sowade, Enrico; Ramon, Eloi; Mitra, Kalyan Yoti; Martínez-Domingo, Carme; Pedró, Marta; Pallarès, Jofre; Loffredo, Fausta; Villani, Fulvia; Gomes, Henrique L.; Terés, Lluís; Baumann, Reinhard R.

2016-01-01

We report on the detailed electrical investigation of all-inkjet-printed thin-film transistor (TFT) arrays focusing on TFT failures and their origins. The TFT arrays were manufactured on flexible polymer substrates in ambient condition without the need for cleanroom environment or inert atmosphere and at a maximum temperature of 150 °C. Alternative manufacturing processes for electronic devices such as inkjet printing suffer from lower accuracy compared to traditional microelectronic manufacturing methods. Furthermore, usually printing methods do not allow the manufacturing of electronic devices with high yield (high number of functional devices). In general, the manufacturing yield is much lower compared to the established conventional manufacturing methods based on lithography. Thus, the focus of this contribution is set on a comprehensive analysis of defective TFTs printed by inkjet technology. Based on root cause analysis, we present the defects by developing failure categories and discuss the reasons for the defects. This procedure identifies failure origins and allows the optimization of the manufacturing resulting finally to a yield improvement. PMID:27649784

NASA Tech Briefs, July 2000. Volume 24, No. 7

NASA Technical Reports Server (NTRS)

2000-01-01

Topics covered include: Data Acquisition; Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Test and Measurement; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

21 CFR 1002.13 - Annual reports.

Code of Federal Regulations, 2010 CFR

2010-04-01

... Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND HUMAN SERVICES (CONTINUED) RADIOLOGICAL HEALTH RECORDS AND REPORTS Required Manufacturers' Reports for Listed Electronic Products § 1002.13... § 1002.1 shall submit an annual report summarizing the contents of the records required to be maintained...

NASA Tech Briefs, December 1995. Volume 19, No. 12

NASA Technical Reports Server (NTRS)

1995-01-01

Topics include: a special focus section on Bio/Medical technology, electronic components and circuits, electronic systems, physical sciences, materials, computer programs, mechanics, machinery, manufacturing/fabrication, mathematics and information sciences, book and reports, and a special section on Laser Tech Briefs.

21 CFR 1002.12 - Abbreviated reports.

Code of Federal Regulations, 2010 CFR

2010-04-01

... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Abbreviated reports. 1002.12 Section 1002.12 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND HUMAN SERVICES (CONTINUED) RADIOLOGICAL HEALTH RECORDS AND REPORTS Required Manufacturers' Reports for Listed Electronic Products § 1002...

NASA Tech Briefs, October 1998. Volume 22, No. 10

NASA Technical Reports Server (NTRS)

1998-01-01

Topics include: special coverage sections on sensors/imaging and mechanical technology, and sections on electronic components and circuits, electronic systems, software, materials, machinery/automation, manufacturing/fabrication, physical sciences, information sciences, book and reports, and a special section of Photonics Tech Briefs.

NASA Tech Briefs, August 2010

NASA Technical Reports Server (NTRS)

2010-01-01

Topics covered include: Technology Focus: Mechanical Components; Electronics/Computers; Software; Materials; Mechanics/Machinery; Manufacturing; Bio-Medical; Physical Sciences; Information Sciences; and Books and Reports.

40 CFR 98.91 - Reporting threshold.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 40 Protection of Environment 22 2013-07-01 2013-07-01 false Reporting threshold. 98.91 Section 98.91 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) AIR PROGRAMS (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Electronics Manufacturing § 98.91 Reporting threshold. (a) You must report GHG emissions under this subpart if...

40 CFR 98.91 - Reporting threshold.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 40 Protection of Environment 21 2011-07-01 2011-07-01 false Reporting threshold. 98.91 Section 98.91 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) AIR PROGRAMS (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Electronics Manufacturing § 98.91 Reporting threshold. (a) You must report GHG emissions under this subpart if...

40 CFR 98.91 - Reporting threshold.

Code of Federal Regulations, 2014 CFR

2014-07-01

... 40 Protection of Environment 21 2014-07-01 2014-07-01 false Reporting threshold. 98.91 Section 98.91 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) AIR PROGRAMS (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Electronics Manufacturing § 98.91 Reporting threshold. (a) You must report GHG emissions under this subpart if...

40 CFR Table I-2 to Subpart I - Examples of Fluorinated GHGs and Fluorinated Heat Transfer Fluids Used by the Electronics Industry

Code of Federal Regulations, 2012 CFR

2012-07-01

... Fluorinated Heat Transfer Fluids Used by the Electronics Industry I Table I-2 to Subpart I Protection of... REPORTING Electronics Manufacturing Pt. 98, Subpt. I, Table I-2 Table I-2 to Subpart I—Examples of Fluorinated GHGs and Fluorinated Heat Transfer Fluids Used by the Electronics Industry Product type...

40 CFR 91.805 - In-use test program reporting requirements.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 40 Protection of Environment 21 2012-07-01 2012-07-01 false In-use test program reporting... Regulations § 91.805 In-use test program reporting requirements. (a) The manufacturer shall electronically... generated from the in-use testing program. The following information must be reported for each test engine...

40 CFR 91.805 - In-use test program reporting requirements.

Code of Federal Regulations, 2014 CFR

2014-07-01

... 40 Protection of Environment 20 2014-07-01 2013-07-01 true In-use test program reporting... Regulations § 91.805 In-use test program reporting requirements. (a) The manufacturer shall electronically... generated from the in-use testing program. The following information must be reported for each test engine...

40 CFR 91.805 - In-use test program reporting requirements.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 40 Protection of Environment 20 2011-07-01 2011-07-01 false In-use test program reporting... Regulations § 91.805 In-use test program reporting requirements. (a) The manufacturer shall electronically... generated from the in-use testing program. The following information must be reported for each test engine...

40 CFR 91.805 - In-use test program reporting requirements.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 40 Protection of Environment 21 2013-07-01 2013-07-01 false In-use test program reporting... Regulations § 91.805 In-use test program reporting requirements. (a) The manufacturer shall electronically... generated from the in-use testing program. The following information must be reported for each test engine...

40 CFR 91.805 - In-use test program reporting requirements.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 40 Protection of Environment 20 2010-07-01 2010-07-01 false In-use test program reporting... Regulations § 91.805 In-use test program reporting requirements. (a) The manufacturer shall electronically... generated from the in-use testing program. The following information must be reported for each test engine...

40 CFR 98.91 - Reporting threshold.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 40 Protection of Environment 22 2012-07-01 2012-07-01 false Reporting threshold. 98.91 Section 98...) MANDATORY GREENHOUSE GAS REPORTING Electronics Manufacturing § 98.91 Reporting threshold. (a) You must... year emission threshold in § 98.2(a)(2), follow the requirements of § 98.2(b), with one exception...

NASA Tech Briefs, June 1998. Volume 22, No. 6

NASA Technical Reports Server (NTRS)

1998-01-01

Topics include: special coverage on computer hardware and peripherals, electronic components and circuits, electronic systems, software, materials, mechanics, machinery/automation, manufacturing, physical sciences, information sciences, book and reports, and a special section of Photonics Tech Briefs. and a second special section of Motion Control Tech Briefs

NASA Tech Briefs, October 1999. Volume 23, No. 10

NASA Technical Reports Server (NTRS)

1999-01-01

Topics include: special coverage section on data acquisition and sensors and sections on electronic components and systems, software, materials, mechanics, machinery/automation, manufacturing/fabrication, bio-medical, physical sciences, information sciences, book and reports, and special section of Electronics Tech Briefs and Motion Control Tech briefs

40 CFR Table I-2 to Subpart I of... - Examples of Fluorinated GHGs and Fluorinated Heat Transfer Fluids Used by the Electronics Industry

Code of Federal Regulations, 2013 CFR

2013-07-01

... Fluorinated Heat Transfer Fluids Used by the Electronics Industry I Table I-2 to Subpart I of Part 98... GREENHOUSE GAS REPORTING Electronics Manufacturing Pt. 98, Subpt. I, Table I-2 Table I-2 to Subpart I of Part 98—Examples of Fluorinated GHGs and Fluorinated Heat Transfer Fluids Used by the Electronics Industry...

NASA Tech Briefs, March 1998. Volume 22, No. 3

NASA Technical Reports Server (NTRS)

1998-01-01

Topics include: special coverage of computer aided design and engineering, electronic components and circuits, electronic systems, physical sciences, materials, computer software, special coverage on mechanical technology, machinery/automation, manufacturing/fabrication, mathematics and information sciences, book and reports, and a special section of Electronics Tech Briefs. Profiles of the exhibitors at the National Design Engineering show are also included in this issue.

NASA Tech Briefs, March 1995

NASA Technical Reports Server (NTRS)

1995-01-01

This issue contains articles with a special focus on Computer-Aided design and engineering amd a research report on the Ames Research Center. Other subjects in this issue are: Electronic Components and Circuits, Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Manufacturing/Fabrication, Mathematics and Information Sciences and Life Sciences

NASA Tech Briefs, October 2000. Volume 24, No. 10

NASA Technical Reports Server (NTRS)

2000-01-01

Topics include: special coverage sections on CAD, CAE, and PDM, and, Composites and Plastics, and sections on electronic components and systems, software, test and measurement, mechanics, manufacturing/fabrication, physical sciences, information sciences, book and reports, and special sections of Electronics Tech Briefs and Motion Control Tech Briefs

Measurements of NaI(Tl) Electron Response: Comparison of Different Samples

NASA Astrophysics Data System (ADS)

Hull, Giulia; Choong, Woon-Seng; Moses, William W.; Bizarri, Gregory; Valentine, John D.; Payne, Stephen A.; Cherepy, Nerine J.; Reutter, Bryan W.

2009-02-01

This paper measures the sample to sample variation in the light yield proportionality of NaI(Tl), and so explores whether this is an invariant characteristic of the material or whether it depends on the chemical and physical properties of the tested samples. We report on the electron response of nine crystals of NaI(Tl), differing in shape, volume, age, manufacturer and quality. The proportionality has been measured at the SLYNCI facility in the energy range between 3.5 to 460 keV. We observe that while samples produced by the same manufacturer at approximately the same time have virtually identical electron response curves, there are significant sample to sample variations among crystals produced by different manufacturers or at different times. In an effort to correlate changes in the electron response with details of the scintillation mechanism, we characterized other scintillation properties, including the gamma response and the x-ray excited emission spectra and decay times, for the nine crystals. While sample to sample differences in these crystals were observed, we have been unable to identify the underlying fundamental mechanisms that are responsible for these differences.

08/24/2012 Fact Sheet

EPA Pesticide Factsheets

Fact sheet describing the 2012 corrections and amendments to the Greenhouse Gas Reporting Rule that affect electronics manufacturing, petroleum and natural gas systems, fluorinated gas production, and industrial waste landfills.

21 CFR 1002.11 - Supplemental reports.

Code of Federal Regulations, 2010 CFR

2010-04-01

... model or chassis family of a product listed in table 1 of § 1002.1 for which a report under § 1002.10 is... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Supplemental reports. 1002.11 Section 1002.11 Food...) RADIOLOGICAL HEALTH RECORDS AND REPORTS Required Manufacturers' Reports for Listed Electronic Products § 1002...

In vivo polymerization and manufacturing of wires and supercapacitors in plants

PubMed Central

Stavrinidou, Eleni; Nilsson, K. Peter R.; Singh, Sandeep Kumar; Franco-Gonzalez, Juan Felipe; Volkov, Anton V.; Jonsson, Magnus P.; Grimoldi, Andrea; Elgland, Mathias; Zozoulenko, Igor V.; Berggren, Magnus

2017-01-01

Electronic plants, e-Plants, are an organic bioelectronic platform that allows electronic interfacing with plants. Recently we have demonstrated plants with augmented electronic functionality. Using the vascular system and organs of a plant, we manufactured organic electronic devices and circuits in vivo, leveraging the internal structure and physiology of the plant as the template, and an integral part of the devices. However, this electronic functionality was only achieved in localized regions, whereas new electronic materials that could be distributed to every part of the plant would provide versatility in device and circuit fabrication and create possibilities for new device concepts. Here we report the synthesis of such a conjugated oligomer that can be distributed and form longer oligomers and polymer in every part of the xylem vascular tissue of a Rosa floribunda cutting, forming long-range conducting wires. The plant’s structure acts as a physical template, whereas the plant’s biochemical response mechanism acts as the catalyst for polymerization. In addition, the oligomer can cross through the veins and enter the apoplastic space in the leaves. Finally, using the plant’s natural architecture we manufacture supercapacitors along the stem. Our results are preludes to autonomous energy systems integrated within plants and distribute interconnected sensor–actuator systems for plant control and optimization. PMID:28242683

In vivo polymerization and manufacturing of wires and supercapacitors in plants.

PubMed

Stavrinidou, Eleni; Gabrielsson, Roger; Nilsson, K Peter R; Singh, Sandeep Kumar; Franco-Gonzalez, Juan Felipe; Volkov, Anton V; Jonsson, Magnus P; Grimoldi, Andrea; Elgland, Mathias; Zozoulenko, Igor V; Simon, Daniel T; Berggren, Magnus

2017-03-14

Electronic plants, e -Plants, are an organic bioelectronic platform that allows electronic interfacing with plants. Recently we have demonstrated plants with augmented electronic functionality. Using the vascular system and organs of a plant, we manufactured organic electronic devices and circuits in vivo, leveraging the internal structure and physiology of the plant as the template, and an integral part of the devices. However, this electronic functionality was only achieved in localized regions, whereas new electronic materials that could be distributed to every part of the plant would provide versatility in device and circuit fabrication and create possibilities for new device concepts. Here we report the synthesis of such a conjugated oligomer that can be distributed and form longer oligomers and polymer in every part of the xylem vascular tissue of a Rosa floribunda cutting, forming long-range conducting wires. The plant's structure acts as a physical template, whereas the plant's biochemical response mechanism acts as the catalyst for polymerization. In addition, the oligomer can cross through the veins and enter the apoplastic space in the leaves. Finally, using the plant's natural architecture we manufacture supercapacitors along the stem. Our results are preludes to autonomous energy systems integrated within plants and distribute interconnected sensor-actuator systems for plant control and optimization.

NASA Tech Briefs, August 2002. Volume 26, No. 8

NASA Technical Reports Server (NTRS)

2002-01-01

Topics include: a technology focus on computers, electronic components and systems, software, materials, mechanics, machinery/automation, manufacturing, physical sciences, information sciences, book and reports, and Motion control Tech Briefs.

The AMTEX Partnership{trademark}. Fourth quarter FY95 report

DOE Office of Scientific and Technical Information (OSTI.GOV)

NONE

1995-09-01

The AMTEX Partnership{trademark} is a collaborative research and development program among the US Integrated Textile Industry, the Department of Energy (DOE), the national laboratories, other federal agencies and laboratories, and universities. The goal of AMTEX is to strengthen the competitiveness of this vital industry, thereby preserving and creating US jobs. The operations and program management of the AMTEX Partnership{trademark} is provided by the Program Office. This report is produced by the Program Office on a quarterly basis and provides information on the progress, operations, and project management of the partnership. Progress is reported on the following projects: computer-aided fabric evaluation;more » cotton biotechnology; demand activated manufacturing architecture; electronic embedded fingerprints; on-line process control for flexible fiber manufacturing; rapid cutting; sensors for agile manufacturing; and textile resource conservation.« less

Manufacturing Demonstration Facility: Roll-to-Roll Processing

DOE Office of Scientific and Technical Information (OSTI.GOV)

Datskos, Panos G; Joshi, Pooran C; List III, Frederick Alyious

This Manufacturing Demonstration Facility (MDF)e roll-to-roll processing effort described in this report provided an excellent opportunity to investigate a number of advanced manufacturing approaches to achieve a path for low cost devices and sensors. Critical to this effort is the ability to deposit thin films at low temperatures using nanomaterials derived from nanofermentation. The overarching goal of this project was to develop roll-to-roll manufacturing processes of thin film deposition on low-cost flexible substrates for electronics and sensor applications. This project utilized ORNL s unique Pulse Thermal Processing (PTP) technologies coupled with non-vacuum low temperature deposition techniques, ORNL s clean roommore » facility, slot dye coating, drop casting, spin coating, screen printing and several other equipment including a Dimatix ink jet printer and a large-scale Kyocera ink jet printer. The roll-to-roll processing project had three main tasks: 1) develop and demonstrate zinc-Zn based opto-electronic sensors using low cost nanoparticulate structures manufactured in a related MDF Project using nanofermentation techniques, 2) evaluate the use of silver based conductive inks developed by project partner NovaCentrix for electronic device fabrication, and 3) demonstrate a suite of low cost printed sensors developed using non-vacuum deposition techniques which involved the integration of metal and semiconductor layers to establish a diverse sensor platform technology.« less

NASA Tech Briefs, September 2001. Volume 25, No. 9

NASA Technical Reports Server (NTRS)

2001-01-01

Topics include: special coverage section on sensors, and sections on electronic components systems, software, materials, machinery/automation, manufacturing/fabrication, bio-medical, book and reports, and a special section of Photonics Tech Briefs.

NASA Tech Briefs, May 2002. Volume 26, No. 5

NASA Technical Reports Server (NTRS)

2002-01-01

Topics include: a technology focus on engineering materials, electronic components and circuits, software, mechanics, machinery/automation, manufacturing, physical sciences, information sciences, book and reports, and a special section of Photonics Tech Briefs.

JPRS Report, Science & Technology, Europe & Latin America

DTIC Science & Technology

1987-08-12

there is significant international interest in this today. Going beyond the original applications the thermoluminescent dosimeters ( TLD ) developed...manufacturing; --Applications in the health and teaching sectors; —Correspondence management; -- Electronic mail. The competitive advantages of the multimedia...objective of the MOSES project is to make the multimedia electronic documentation system much more powerful than its paper counterpart. To achieve

NASA Tech Briefs, May 1995. Volume 19, No. 5

NASA Technical Reports Server (NTRS)

1995-01-01

This issue features an resource report on Jet Propulsion Laboratory and a special focus on advanced composites and plastics. It also contains articles on electronic components and circuits, electronic systems, physical sciences, computer programs, mechanics, machinery, manufacturing and fabrication, mathematics and information sciences, and life sciences. This issue also contains a supplement on federal laboratory test and measurements.

Book of Knowledge (BOK) for NASA Electronic Packaging Roadmap

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2015-01-01

The objective of this document is to update the NASA roadmap on packaging technologies (initially released in 2007) and to present the current trends toward further reducing size and increasing functionality. Due to the breadth of work being performed in the area of microelectronics packaging, this report presents only a number of key packaging technologies detailed in three industry roadmaps for conventional microelectronics and a more recently introduced roadmap for organic and printed electronics applications. The topics for each category were down-selected by reviewing the 2012 reports of the International Technology Roadmap for Semiconductor (ITRS), the 2013 roadmap reports of the International Electronics Manufacturing Initiative (iNEMI), the 2013 roadmap of association connecting electronics industry (IPC), the Organic Printed Electronics Association (OE-A). The report also summarizes the results of numerous articles and websites specifically discussing the trends in microelectronics packaging technologies.

78 FR 38992 - Agency Information Collection Activities; Proposed Collection; Comment Request; Reports of...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-06-28

... and Radiological Health (CDRH). The electronic process is expected to both enhance consistency of... medical and radiation emitting products regulated by CDRH under part 806 (21 CFR part 806). For general information and assistance with 806 reports, contact the CDRH Division of Small Manufacturers, International...

5 CFR 532.313 - Private sector industries.

Code of Federal Regulations, 2010 CFR

2010-01-01

... electrical signals. 335311 Power, distribution, and specialty transformer manufacturing. 48531 Taxi service... Electronic coil, transformer, and other inductor manufacturing. 334417 Electronic connector manufacturing...

NASA Tech Briefs, November 2002. Volume 26, No. 11

NASA Technical Reports Server (NTRS)

2002-01-01

Topics include: a technology focus on engineering materials, electronic components and systems, software, mechanics, machinery/automation, manufacturing, bio-medical, physical sciences, information sciences book and reports, and a special section of Photonics Tech Briefs.

NASA Tech Briefs, August 2001. Volume 25, No. 8

NASA Technical Reports Server (NTRS)

2001-01-01

Topics include: special coverage section on computers and peripherals, and sections on electronic components systems, software, materials, mechanics, manufacturing/fabrication, physical sciences, book and reports, and a special section of Motion Control Tech Briefs.

NASA Tech Briefs, October 2002. Volume 26, No. 10

NASA Technical Reports Server (NTRS)

2002-01-01

Topics include: a technology focus on sensors, electronic components and systems, software, materials, materials, mechanics, manufacturing, physical sciences, information sciences, book and reports, motion control and a special section of Photonics Tech Briefs.

NASA Tech Briefs, March 2002. Volume 26, No. 3

NASA Technical Reports Server (NTRS)

2002-01-01

Topics include: a special section on data acquisition, software, electronic components and systems, materials, computer programs, mechanics, machinery/automation, manufacturing, biomedical, physical sciences, book and reports, and a special section of Photonics Tech Briefs.

NASA Tech Briefs, July 2002. Volume 26, No. 7

NASA Technical Reports Server (NTRS)

2002-01-01

Topics include: a technology focus sensors, software, electronic components and systems, materials, mechanics, machinery/automation, manufacturing, bio-medical, physical sciences, information sciences, book and reports, and a special section of Photonics Tech Briefs.

Additive Manufacturing Modeling and Simulation A Literature Review for Electron Beam Free Form Fabrication

NASA Technical Reports Server (NTRS)

Seufzer, William J.

2014-01-01

Additive manufacturing is coming into industrial use and has several desirable attributes. Control of the deposition remains a complex challenge, and so this literature review was initiated to capture current modeling efforts in the field of additive manufacturing. This paper summarizes about 10 years of modeling and simulation related to both welding and additive manufacturing. The goals were to learn who is doing what in modeling and simulation, to summarize various approaches taken to create models, and to identify research gaps. Later sections in the report summarize implications for closed-loop-control of the process, implications for local research efforts, and implications for local modeling efforts.

NASA Tech Briefs, February 2002. Volume 26, No. 2

NASA Technical Reports Server (NTRS)

2002-01-01

Topics include:a technology focus on computers, electronic components and systems, software, materials, mechanics,physical sciences machinery, manufacturing/fabrication, mathematics, book and reports, motion control tech briefs and a special section on Photonics Tech Briefs.

Electronic Hand Calculators: The Implications for Pre-College Education. Final Report. Abbreviated Version.

ERIC Educational Resources Information Center

Suydam, Marilyn, Comp.

This volume reports research conducted to provide the National Science Foundation (NSF) with information concerning the existing range of beliefs and opinions about the impact of the hand-held calculator on pre-college educational practice. A literature search and several surveys of groups of individuals involved in calculator manufacture and…

76 FR 56009 - Mandatory Reporting of Greenhouse Gases: Technical Revisions to the Electronics Manufacturing and...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-09-09

... Pipeline transportation of natural gas. 221210 Natural gas distribution facilities. 211 Extractors of crude... natural gas processing facilities in transmission pipelines or into storage. 40 CFR Sec. 98.230(a)(4). A... and inaccuracies in reporting''. Pipeline Quality Yes. Natural Gas. CEC/ AXPC asserted that ``[t]here...

76 FR 50815 - TSCA Inventory Update Reporting Modifications; Chemical Data Reporting

Federal Register 2010, 2011, 2012, 2013, 2014

2011-08-16

... longer accept paper submissions or electronic media (i.e., as a file on a CD- ROM) for any CDR submission...-mail address: [email protected] . SUPPLEMENTARY INFORMATION: I. Does this action apply to me? You... byproduct chemical substance (NAICS codes 22, 322, 331, and 3344; e.g., utilities, paper manufacturing...

75 FR 13484 - Foreign-Trade Zone 22; Temporary/Interim Manufacturing Authority; LG Electronics Mobilecomm USA...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-03-22

... DEPARTMENT OF COMMERCE [Docket T-1-2010] Foreign-Trade Zones Board Foreign-Trade Zone 22; Temporary/Interim Manufacturing Authority; LG Electronics Mobilecomm USA, Inc. (Cell Phones); Notice of.../ interim manufacturing (T/IM) authority, on behalf of LG Electronics Mobilecomm USA, Inc. (LGEMU), to...

Integrated control system for electron beam processes

NASA Astrophysics Data System (ADS)

Koleva, L.; Koleva, E.; Batchkova, I.; Mladenov, G.

2018-03-01

The ISO/IEC 62264 standard is widely used for integration of the business systems of a manufacturer with the corresponding manufacturing control systems based on hierarchical equipment models, functional data and manufacturing operations activity models. In order to achieve the integration of control systems, formal object communication models must be developed, together with manufacturing operations activity models, which coordinate the integration between different levels of control. In this article, the development of integrated control system for electron beam welding process is presented as part of a fully integrated control system of an electron beam plant, including also other additional processes: surface modification, electron beam evaporation, selective melting and electron beam diagnostics.

NextFlex Flexible Hybrid Electronics Manufacturing

DTIC Science & Technology

2016-10-01

Defense AT&L: September-October 2016 32 ADVANCED MANUFACTURING N NextFlex Flexible Hybrid Electronics Manufacturing Eric Forsythe, Ph.D.  Benjamin...New York, in both Physics and Chemistry, where he worked on electronic interfaces and carrier transport in organic light-emitting devices in...Ohio. extFlex, America’s Flexible Hybrid Electronics Manu- facturing Innovation Institute, is a program formed out of a cooperative agreement awarded

Electron Beam Melting Manufacturing Technology for Individually Manufactured Jaw Prosthesis: A Case Report.

PubMed

Suska, Felicia; Kjeller, Göran; Tarnow, Peter; Hryha, Eduard; Nyborg, Lars; Snis, Anders; Palmquist, Anders

2016-08-01

In the field of maxillofacial reconstruction, additive manufacturing technologies, specifically electron beam melting (EBM), offer clinicians the potential for patient-customized design of jaw prostheses, which match both load-bearing and esthetic demands. The technique allows an innovative, functional design, combining integrated porous regions for bone ingrowth and secondary biological fixation with solid load-bearing regions ensuring the biomechanical performance. A patient-specific mandibular prosthesis manufactured using EBM was successfully used to reconstruct a patient's mandibular defect after en bloc resection. Over a 9-month follow-up period, the patient had no complications. A short operating time, good esthetic outcome, and high level of patient satisfaction as measured by quality-of-life questionnaires-the European Organisation for Research and Treatment of Cancer QLQ-C30 (30-item quality-of-life core questionnaire) and H&N35 (head and neck cancer module)-were reported for this case. Individually planned and designed EBM-produced prostheses may be suggested as a possible future alternative to fibular grafts or other reconstructive methods. However, the role of porosity, the role of geometry, and the optimal combination of solid and porous parts, as well as surface properties in relation to soft tissues, should be carefully evaluated in long-term clinical trials. Copyright © 2016 American Association of Oral and Maxillofacial Surgeons. Published by Elsevier Inc. All rights reserved.

1986 Bibliography of Information on Engineering Technology Education.

ERIC Educational Resources Information Center

Gourley, Frank A., Jr.

1987-01-01

Lists articles, papers, and reports on engineering technology education that were published in 1986. Categorizes the citations under headings of administration, computers, curriculum, electronics, industry/government/employers, instructional technology, laboratories, liberal studies, manufacturing, mechanical, minorities, research, robotics, and…

78 FR 58153 - Prevailing Rate Systems; North American Industry Classification System Based Federal Wage System...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-09-23

... engine and engine parts manufacturing,'' ``Motor vehicle electrical and electronic equipment... manufacturing,'' ``Other motor vehicle electrical and electronic equipment manufacturing,'' and ``All other motor vehicle parts manufacturing'' in the second column from the list of required NAICS codes for the...

Proliferation of mouse fibroblast-like and osteoblast-like cells on pure titanium films manufactured by electron beam melting.

PubMed

Kawase, Mayu; Hayashi, Tatsuhide; Asakura, Masaki; Tomino, Masafumi; Mieki, Akimichi; Kawai, Tatsushi

2016-10-01

The physical characteristics and biological compatibility of surfaces produced by electron beam melting (EBM) are not well known. In particular, there are not many reports on biocompatibility qualities. In this study, pure Ti films were manufactured using EBM. While it is reported that moderately hydrophilic biomaterial surfaces display improved cell growth and biocompatibility, contact angle measurements on the EBM-produced pure Ti films showed slight hydrophobicity. Nonetheless, we found the cell count of both fibroblast-like cells (L929) and osteoblast-like cells (MC3T3-E1) increased on pure Ti films, especially the MC3T3-E1, which increased more than that of the control. In addition, the morphology of L929 and MC3T3-E1 was polygonal and spindle-shaped and the cytoskeleton was well developed in the pure Ti surface groups. Upon staining with Alizarin red S, a slight calcium deposition was observed and this level gradually rose to a remarkable level. These results indicate that pure Ti films manufactured by EBM have good biocompatibility and could be widely applied as biomedical materials in the near future. © 2016 International Federation for Cell Biology.

21 CFR 803.53 - If I am a manufacturer, in which circumstances must I submit a 5-day report?

Code of Federal Regulations, 2014 CFR

2014-04-01

..., including any trend analysis; or (b) We have made a written request for the submission of a 5-day report. If... must I submit a 5-day report? 803.53 Section 803.53 Food and Drugs FOOD AND DRUG ADMINISTRATION... must I submit a 5-day report? You must submit a 5-day report to us, on Form 3500A or an electronic...

The AMTEX Partnership. Third quarterly report, FY 1995

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lemon, D.K.; Quisenberry, R.K.

1995-06-01

Key activities for the quarter were the initiation of tactical work on the OPCon Project, development of a draft of the AMTEX Policies and Procedures document, and a meeting of the Industry Technical Advisory Committee. A significant milestone was reached when a memorandum of understanding was signed between the DOE and The Department of Commerce. The agreement signified the official participation of the National Institute of Standards and Technology on the Demand Activated Manufacturing Architecture (DAMA) project in AMTEX. Project accomplishments are given for: computer-aided manufacturing, cotton biotechnology, DAMA, electronic embedded fingerprints, rapid cutting, sensors for agile manufacturing, and textilemore » resource conservation.« less

Electronics Manufacturer Provided With Testing and Evaluation Data Necessary to Obtain Additional Orders

NASA Technical Reports Server (NTRS)

1998-01-01

A local electronics manufacturer, the Sterling Manufacturing Company, was presented with the opportunity to supply 30,000 automotive cellular antennas to a European subsidiary of a large U.S. auto manufacturer. Although the company built an antenna that they believed would meet the auto manufacturer's specifications, they were unable to conduct the necessary validation tests in-house. They decided to work with NASA Lewis Research Center's Space Electronics Division, which, as part of its technology development program, evaluates the performance of antennas in its Microwave Systems Lab to assess their capabilities for space communications applications. Data measured in Lewis' Microwave Systems Lab proved that Sterling's antenna performed better than specified by the auto manufacturer.

78 FR 18234 - Service of Process on Manufacturers; Manufacturers Importing Electronic Products Into the United...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-03-26

... DEPARTMENT OF HEALTH AND HUMAN SERVICES Food and Drug Administration 21 CFR Part 1005 [Docket No. FDA-2007-N-0091; (formerly 2007N-0104)] Service of Process on Manufacturers; Manufacturers Importing Electronic Products Into the United States; Agent Designation; Change of Address AGENCY: Food and Drug...

Surface texture measurement for additive manufacturing

NASA Astrophysics Data System (ADS)

Triantaphyllou, Andrew; Giusca, Claudiu L.; Macaulay, Gavin D.; Roerig, Felix; Hoebel, Matthias; Leach, Richard K.; Tomita, Ben; Milne, Katherine A.

2015-06-01

The surface texture of additively manufactured metallic surfaces made by powder bed methods is affected by a number of factors, including the powder’s particle size distribution, the effect of the heat source, the thickness of the printed layers, the angle of the surface relative to the horizontal build bed and the effect of any post processing/finishing. The aim of the research reported here is to understand the way these surfaces should be measured in order to characterise them. In published research to date, the surface texture is generally reported as an Ra value, measured across the lay. The appropriateness of this method for such surfaces is investigated here. A preliminary investigation was carried out on two additive manufacturing processes—selective laser melting (SLM) and electron beam melting (EBM)—focusing on the effect of build angle and post processing. The surfaces were measured using both tactile and optical methods and a range of profile and areal parameters were reported. Test coupons were manufactured at four angles relative to the horizontal plane of the powder bed using both SLM and EBM. The effect of lay—caused by the layered nature of the manufacturing process—was investigated, as was the required sample area for optical measurements. The surfaces were also measured before and after grit blasting.

Materials, Processes, and Facile Manufacturing for Bioresorbable Electronics: A Review.

PubMed

Yu, Xiaowei; Shou, Wan; Mahajan, Bikram K; Huang, Xian; Pan, Heng

2018-05-07

Bioresorbable electronics refer to a new class of advanced electronics that can completely dissolve or disintegrate with environmentally and biologically benign byproducts in water and biofluids. They have provided a solution to the growing electronic waste problem with applications in temporary usage of electronics such as implantable devices and environmental sensors. Bioresorbable materials such as biodegradable polymers, dissolvable conductors, semiconductors, and dielectrics are extensively studied, enabling massive progress of bioresorbable electronic devices. Processing and patterning of these materials are predominantly relying on vacuum-based fabrication methods so far. However, for the purpose of commercialization, nonvacuum, low-cost, and facile manufacturing/printing approaches are the need of the hour. Bioresorbable electronic materials are generally more chemically reactive than conventional electronic materials, which require particular attention in developing the low-cost manufacturing processes in ambient environment. This review focuses on material reactivity, ink availability, printability, and process compatibility for facile manufacturing of bioresorbable electronics. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Japan's technology and manufacturing infrastructure

NASA Astrophysics Data System (ADS)

Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

1995-02-01

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Japan's technology and manufacturing infrastructure

NASA Technical Reports Server (NTRS)

Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

1995-01-01

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

78 FR 72750 - Reports, Forms, and Record Keeping Requirements

Federal Register 2010, 2011, 2012, 2013, 2014

2013-12-03

... Vehicle Safety Compliance (NVS-223), National Highway Traffic Safety Administration, West Building--4th... automated, electronic, mechanical, or other technological collection techniques or other forms of.... OMB Control Number: 2127-0043. Affected Public: New manufacturers of motor vehicles and motor vehicle...

49 CFR 535.8 - Reporting requirements.

Code of Federal Regulations, 2014 CFR

2014-10-01

... must submit information electronically through the EPA database system as the single point of entry for... agencies are not prepared to receive information through the EPA database system, manufacturers are... applications for certificates of conformity in accordance through the EPA database including both GHG emissions...

49 CFR 535.8 - Reporting requirements.

Code of Federal Regulations, 2011 CFR

2011-10-01

... information. (2) Manufacturers must submit information electronically through the EPA database system as the... year 2012 the agencies are not prepared to receive information through the EPA database system... applications for certificates of conformity in accordance through the EPA database including both GHG emissions...

49 CFR 535.8 - Reporting requirements.

Code of Federal Regulations, 2013 CFR

2013-10-01

... must submit information electronically through the EPA database system as the single point of entry for... agencies are not prepared to receive information through the EPA database system, manufacturers are... applications for certificates of conformity in accordance through the EPA database including both GHG emissions...

49 CFR 535.8 - Reporting requirements.

Code of Federal Regulations, 2012 CFR

2012-10-01

... must submit information electronically through the EPA database system as the single point of entry for... agencies are not prepared to receive information through the EPA database system, manufacturers are... applications for certificates of conformity in accordance through the EPA database including both GHG emissions...

Low-Cost Manufacturing of Bioresorbable Conductors by Evaporation-Condensation-Mediated Laser Printing and Sintering of Zn Nanoparticles.

PubMed

Shou, Wan; Mahajan, Bikram K; Ludwig, Brandon; Yu, Xiaowei; Staggs, Joshua; Huang, Xian; Pan, Heng

2017-07-01

Currently, bioresorbable electronic devices are predominantly fabricated by complex and expensive vacuum-based integrated circuit (IC) processes. Here, a low-cost manufacturing approach for bioresorbable conductors on bioresorbable polymer substrates by evaporation-condensation-mediated laser printing and sintering of Zn nanoparticle is reported. Laser sintering of Zn nanoparticles has been technically difficult due to the surface oxide on nanoparticles. To circumvent the surface oxide, a novel approach is discovered to print and sinter Zn nanoparticle facilitated by evaporation-condensation in confined domains. The printing process can be performed on low-temperature substrates in ambient environment allowing easy integration on a roll-to-roll platform for economical manufacturing of bioresorbable electronics. The fabricated Zn conductors show excellent electrical conductivity (≈1.124 × 10 6 S m -1 ), mechanical durability, and water dissolvability. Successful demonstration of strain gauges confirms the potential application in various environmentally friendly sensors and circuits. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Application of Temperature-Controlled Thermal Atomization for Printing Electronics in Space

NASA Technical Reports Server (NTRS)

Wu, Chih-Hao; Thompson, Furman V.

2017-01-01

Additive Manufacturing (AM) is a technology that builds three dimensional objects by adding material layer-upon-layer throughout the fabrication process. The Electrical, Electronic and Electromechanical (EEE) parts packaging group at Marshall Space Flight Center (MSFC) is investigating how various AM and 3D printing processes can be adapted to the microgravity environment of space to enable on demand manufacturing of electronics. The current state-of-the art processes for accomplishing the task of printing electronics through non-contact, direct-write means rely heavily on the process of atomization of liquid inks into fine aerosols to be delivered ultimately to a machine's print head and through its nozzle. As a result of cumulative International Space Station (ISS) research into the behaviors of fluids in zero-gravity, our experience leads us to conclude that the direct adaptation of conventional atomization processes will likely fall short and alternative approaches will need to be explored. In this report, we investigate the development of an alternative approach to atomizing electronic materials by way of thermal atomization, to be used in place of conventional aerosol generation and delivery processes for printing electronics in space.

Parabolic crossed planar polymeric x-ray lenses

NASA Astrophysics Data System (ADS)

Nazmov, V.; Reznikova, E.; Mohr, J.; Saile, V.; Vincze, L.; Vekemans, B.; Bohic, S.; Somogyi, A.

2011-01-01

The principles of design and manufacturing of the polymer planar x-ray lenses focusing in one and two directions, as well as the peculiarities of optical behaviors and the results of the lens test are reported in this paper. The methods of electron and deep x-ray lithography used in lens manufacturing allow the manufacture of ten or more x-ray lenses on one substrate; the lenses show focal lengths down to several centimeters for photon energies between 5 and 40 keV. The measured focus size was 105 nm for a linear lens with an intensity gain of about 407, and 300 × 770 nm for a crossed lens with an intensity gain of 6470.

Occupational health profile of workers employed in the manufacturing sector of India.

PubMed

Suri, Shivali; Das, Ranjan

2016-01-01

The occupational health scenario of workers engaged in the manufacturing sector in India deserves attention for their safety and increasing productivity. We reviewed the status of the manufacturing sector, identified hazards faced by workers, and assessed the existing legislations and healthcare delivery mechanisms. From October 2014 to March 2015, we did a literature review by manual search of pre-identified journals, general electronic search, electronic search of dedicated websites/databases and personal communication with experts of occupational health. An estimated 115 million workers are engaged in the manufacturing sector, though the Labour Bureau takes into account only one-tenth of them who work in factories registered with the government. Most reports do not mention the human capital employed neither their quality of life, nor occupational health services available. The incidence of accidents were documented till 2011, and industry-wise break up of data is not available. Occupational hazards reported include hypertension, stress, liver disease, diabetes, tuberculosis, eye/ hearing problems, cancers, etc. We found no studies for manufacturing industries in glass, tobacco, computer and allied products, etc. The incidence of accidents is decreasing but the proportion of fatalities is increasing. Multiple legislations exist which cover occupational health, but most of these are old and have not been amended adequately to reflect the present situation. There is a shortage of manpower and occupational health statistics for dealing with surveillance, prevention and regulation in this sector. There is an urgent need of a modern occupational health legislation and an effective machinery to enforce it, preferably through intersectoral coordination between the Employees' State Insurance Corporation, factories and state governments. Occupational health should be integrated with the general health services.

75 FR 63810 - Grant of Authority for Subzone Status; SICK, Inc. (Photo-Electronic Industrial Sensors...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-10-18

... Status; SICK, Inc. (Photo- Electronic Industrial Sensors); Bloomington, MN Pursuant to its authority... to establish a special- purpose subzone at the photo-electronic industrial sensor manufacturing and... manufacturing and distribution of photo-electronic industrial sensors at the SICK, Inc., facility located in...

40 CFR 98.97 - Records that must be retained.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 40 Protection of Environment 22 2013-07-01 2013-07-01 false Records that must be retained. 98.97 Section 98.97 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) AIR PROGRAMS (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Electronics Manufacturing § 98.97 Records that must be...

40 CFR 98.97 - Records that must be retained.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 40 Protection of Environment 21 2011-07-01 2011-07-01 false Records that must be retained. 98.97 Section 98.97 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) AIR PROGRAMS (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Electronics Manufacturing § 98.97 Records that must be...

40 CFR 98.97 - Records that must be retained.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 40 Protection of Environment 22 2012-07-01 2012-07-01 false Records that must be retained. 98.97 Section 98.97 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) AIR PROGRAMS (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Electronics Manufacturing § 98.97 Records that must be...

NASA Tech Briefs, March 1999. Volume 23, No. 3

NASA Technical Reports Server (NTRS)

1999-01-01

Topics include: special coverage sections on CAD/CAE/PDM, industrial controls and sections on electronic components systems, materials, software, mechanics, machinery/automation, manufacturing/fabrication, physical sciences, book and reports, and a special section of Photonics Tech Briefs and a seconds special section of Rapid Product Development.

3D Metal Printing - Additive Manufacturing Technologies for Frameworks of Implant-Borne Fixed Dental Prosthesis.

PubMed

Revilla León, M; Klemm, I M; García-Arranz, J; Özcan, M

2017-09-01

An edentulous patient was rehabilitated with maxillary metal-ceramic and mandibular metal-resin implant-supported fixed dental prosthesis (FDP). Metal frameworks of the FDPs were fabricated using 3D additive manufacturing technologies utilizing selective laser melting (SLM) and electron beam melting (EBM) processes. Both SLM and EBM technologies were employed in combination with computer numerical control (CNC) post-machining at the implant interface. This report highlights the technical and clinical protocol for fabrication of FDPs using SLM and EBM additive technologies. Copyright© 2017 Dennis Barber Ltd.

75 FR 53638 - Approval for Manufacturing Authority; Foreign-Trade Zone 22; LG Electronics Mobilecomm USA, Inc...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-09-01

... Authority; Foreign-Trade Zone 22; LG Electronics Mobilecomm USA, Inc. (Cell Phone Kitting and Distribution... authority on behalf of LG Electronics Mobilecomm USA, Inc. (LGEMU), within FTZ 22 in Bolingbrook, Illinois... application for manufacturing authority under zone procedures within FTZ 22 on behalf of LG Electronics...

A Secondary-Level Curriculum in Industrial Electronics and Robotics. Final Report.

ERIC Educational Resources Information Center

Besancon, Francis E.

A curriculum was developed to provide the electromechanical skills necessary to operate and repair industrial robots to students at the secondary and adult vocational levels. To determine requirements for entry-level positions in the robotics industry, manufacturers and employers of industrial robots were contacted. No particular entry-level…

INDUSTRIAL PROCESS PROFILES FOR ENVIRONMENTAL USE: CHAPTER 30. THE ELECTRONIC COMPONENT MANUFACTURING INDUSTRY

EPA Science Inventory

This report is one of a series constituting the catalog of Industrial Process Profiles for Environmental Use. Each industry sector is addressed as a separate chapter of the study. The catalog was developed for the purpose of compiling relevant information concerning air, water, a...

40 CFR 98.94 - Monitoring and QA/QC requirements.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 40 Protection of Environment 21 2011-07-01 2011-07-01 false Monitoring and QA/QC requirements. 98... (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Electronics Manufacturing § 98.94 Monitoring and QA/QC requirements. (a) For calendar year 2011 monitoring, you may follow the provisions in paragraphs (a)(1) through...

40 CFR 98.94 - Monitoring and QA/QC requirements.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 40 Protection of Environment 22 2013-07-01 2013-07-01 false Monitoring and QA/QC requirements. 98... (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Electronics Manufacturing § 98.94 Monitoring and QA/QC requirements. (a) For calendar year 2011 monitoring, you may follow the provisions in paragraphs (a)(1) through...

40 CFR 98.94 - Monitoring and QA/QC requirements.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 40 Protection of Environment 22 2012-07-01 2012-07-01 false Monitoring and QA/QC requirements. 98... (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Electronics Manufacturing § 98.94 Monitoring and QA/QC requirements. (a) For calendar year 2011 monitoring, you may follow the provisions in paragraphs (a)(1) through...

40 CFR 98.94 - Monitoring and QA/QC requirements.

Code of Federal Regulations, 2014 CFR

2014-07-01

... 40 Protection of Environment 21 2014-07-01 2014-07-01 false Monitoring and QA/QC requirements. 98... (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Electronics Manufacturing § 98.94 Monitoring and QA/QC...-specific heel factors for each container type for each gas used, according to the procedures in paragraphs...

WASTE MINIMIZATION AUDIT REPORT: CASE STUDIES OF MINIMIZATION OF SOLVENT WASTE FROM PARTS CLEANING AND FROM ELECTRONIC CAPACITOR MANUFACTURING OPERATIONS

EPA Science Inventory

To promote waste minimization activities in accordance with the national policy objectives established under the 1984 Hazardous and Solid Waste Amendments to the Resource Conservation and Recovery Act of 1976 (RCRA), the Hazardous Waste Engineering Research Laboratory (HWERL) of ...

Water soluble nano-scale transient material germanium oxide for zero toxic waste based environmentally benign nano-manufacturing

NASA Astrophysics Data System (ADS)

Almuslem, A. S.; Hanna, A. N.; Yapici, T.; Wehbe, N.; Diallo, E. M.; Kutbee, A. T.; Bahabry, R. R.; Hussain, M. M.

2017-02-01

In the recent past, with the advent of transient electronics for mostly implantable and secured electronic applications, the whole field effect transistor structure has been dissolved in a variety of chemicals. Here, we show simple water soluble nano-scale (sub-10 nm) germanium oxide (GeO2) as the dissolvable component to remove the functional structures of metal oxide semiconductor devices and then reuse the expensive germanium substrate again for functional device fabrication. This way, in addition to transiency, we also show an environmentally friendly manufacturing process for a complementary metal oxide semiconductor (CMOS) technology. Every year, trillions of complementary metal oxide semiconductor (CMOS) electronics are manufactured and billions are disposed, which extend the harmful impact to our environment. Therefore, this is a key study to show a pragmatic approach for water soluble high performance electronics for environmentally friendly manufacturing and bioresorbable electronic applications.

Evaluating the Impact of Electronic Training on Organizational Performance in an SME Food Manufacturing Environment

ERIC Educational Resources Information Center

Fry, Richard C.

2011-01-01

Many small to medium sized manufacturing organizations do not have adequate resources to conduct formalized workplace training or properly evaluate its results. The purpose of this study was to examine the effectiveness of electronic training on workplace behavior and small business organizational performance in the manufacturing environment using…

Biopolymer Green Lubricant for Sustainable Manufacturing

PubMed Central

Shi, Shih-Chen; Lu, Fu-I

2016-01-01

We report on the preparation of a biopolymer thin film by hydroxypropyl methylcellulose (HPMC), which can be used as a dry green lubricant in sustainable manufacturing. The thin films were characterized through scanning electron microscopy, energy-dispersive spectroscopy, and Raman spectroscopy; the films showed desirable levels of thickness, controllability, and uniformity. Tribology tests also showed desirable tribological and antiwear behaviors, caused by the formation of transfer layers. Zebrafish embryo toxicity studies showed that HPMC has excellent solubility and biocompatibility, which may show outstanding potential for applications as a green lubricant. The results of the present study show that these techniques for biopolymer HPMC provide an ecologically responsible and convenient method for preparing functional thin films, which is particularly applicable to sustainable manufacturing. PMID:28773462

Microwave Ovens

MedlinePlus

... Commission (CPSC) Website Laws, Regulations & Standards Manufacturers of electronic radiation emitting products sold in the United States ... and Cosmetic Act (FFDCA), Chapter V, Subchapter C - Electronic Product Radiation Control . Manufacturers of microwave ovens are ...

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ma, Ying; Li, Hong; Bridges, Denzel

We report that the continuing miniaturization of microelectronics is pushing advanced manufacturing into nanomanufacturing. Nanojoining is a bottom-up assembly technique that enables functional nanodevice fabrication with dissimilar nanoscopic building blocks and/or molecular components. Various conventional joining techniques have been modified and re-invented for joining nanomaterials. Our review surveys recent progress in nanojoining methods, as compared to conventional joining processes. Examples of nanojoining are given and classified by the dimensionality of the joining materials. At each classification, nanojoining is reviewed and discussed according to materials specialties, low dimensional processing features, energy input mechanisms and potential applications. The preparation of new intermetallicmore » materials by reactive nanoscale multilayer foils based on self-propagating high-temperature synthesis is highlighted. This review will provide insight into nanojoining fundamentals and innovative applications in power electronics packaging, plasmonic devices, nanosoldering for printable electronics, 3D printing and space manufacturing.« less

Study of flow stress and spall strength of additively manufactured Ti-6-4 alloy

NASA Astrophysics Data System (ADS)

Cohen, Amitay; Paris, Vitaly; Yosef-Hai, Arnon; Gudinetsky, Eli; Tiferet, Eitan

2017-06-01

The use of additive manufacturing (AM) by Electron Beam Melting (EBM) or Selective Laser Melting (SLM) has extensively grown in the past few years. A major goal in AM is to manufacture materials with mechanical properties at least as good as traditionally manufactured materials. In this work we present results of planar impact tests and Split Hopkinson Pressure Bar tests (SHPB) on Ti-6-4 manufactured by EBM and SLM processes. Results of planar impact tests on SLM samples display slightly higher spall strength compared to EBM while the stress at Hugoniot elastic limit (HEL) is practically the same. Stress strain curves based on SHPB measurements at two different strain rates present similar plastic flow stresses for SLM and EBM processed Ti-6-4 alloy, while the flow stress is about 20% higher than reported for commercial reference material. The strain to failure of both materials shows considerable strain rate sensitivity. The results of post-mortem analysis of spall fracture will also be presented.

75 FR 13486 - Application(s) for Duty-Free Entry of Scientific Instruments

Federal Register 2010, 2011, 2012, 2013, 2014

2010-03-22

... University, One Waterfront Place, PO Box 6024, Morgantown, WV 26506. Instrument: Electron Microscope.... Justification for Duty-Free Entry: There are no domestic manufacturers of this type of electron microscope.... Lawrence University, 23 Romoda Drive, Canton, NY 13617. Instrument: Electron Microscope. Manufacturer: FEI...

Air Force Manufacturing Technology. Year 2000 Project Book

DTIC Science & Technology

2000-01-01

Electronic Warfare Component Manufacturing 13 National Center for Manufacturing Science 14 Product Research Market Analysis System 15 Electronics Acoustic...other agile organizations that can respond to rapidly changing market demands. Approach This program demonstrated and evaluated the advanced design...production worker contact with customers and suppliers; shopfloor identification of new technologies, markets , and products; and strategic planning to assure

75 FR 30372 - Foreign-Trade Zone 196 Temporary/Interim Manufacturing Authority ATC Logistics & Electronics...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-06-01

... DEPARTMENT OF COMMERCE Foreign-Trade Zones Board [Docket T-2-2010] Foreign-Trade Zone 196 Temporary/Interim Manufacturing Authority ATC Logistics & Electronics (Cell Phone Kitting and Distribution... filed an application submitted by the ATC Logistics & Electronics, operator of Site 2, FTZ 196...

78 FR 42976 - Notice Pursuant to the National Cooperative Research and Production Act of 1993-International...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-07-18

... Production Act of 1993--International Electronics Manufacturing Initiative Notice is hereby given that, on..., 15 U.S.C. 4301 et seq. (``the Act''), International Electronics Manufacturing Initiative (``iNEMI... changed its name to TE Connectivity, Kawasaki, Kanagawa, JAPAN. Cookson Electronics, South Plainfield, NJ...

75 FR 20982 - West Virginia University, et al., Notice of Consolidated Decision on Applications for Duty-Free...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-04-22

... of Consolidated Decision on Applications for Duty-Free Entry of Electron Microscopes This is a..., Morgantown, WV 26506. Instrument: Electron Microscope. Manufacturer: JEOL, Japan. Intended Use: See notice at... Agency, Cincinnati, OH 45268. Instrument: Electron Microscope. Manufacturer: JEOL, Japan. Intended Use...

76 FR 17381 - Battelle Memorial Institute, et al.; Notice of Consolidated Decision on Applications for Duty...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-03-29

....; Notice of Consolidated Decision on Applications for Duty-Free Entry of Electron Microscopes This is a..., Richland, WA 99354. Instrument: Electron Microscope. Manufacturer: FEI Company, the Netherlands. Intended... Rico, San Juan, PR 00936-5067. Instrument: Electron Microscope. Manufacturer: JEOL, Ltd., Japan...

75 FR 32901 - Colorado State University, et al.; Notice of Consolidated Decision on Applications for Duty-Free...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-06-10

....; Notice of Consolidated Decision on Applications for Duty-Free Entry of Electron Microscopes This is a... Collins, CO 80523. Instrument: Electron Microscope. Manufacturer: JEOL Ltd., Japan. Intended Use: See... 97401-3753. Instrument: Electron Microscope. Manufacturer: FEI Company, Czech Republic. Intended Use...

76 FR 58245 - Ohio State University, et al.; Notice of Consolidated Decision on Applications for Duty-Free...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-09-20

... Consolidated Decision on Applications for Duty-Free Entry of Electron Microscope This is a decision... 43210. Instrument: Electron Microscope. Manufacturer: FEI Company, Czech Republic. Intended Use: See..., San Antonio, TX 78239-5166. Instrument: Electron Microscope. Manufacturer: FEI Company, Czech Republic...

78 FR 20296 - Purdue University et al.; Notice of Consolidated Decision on Applications for Duty-Free Entry of...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-04-04

... Consolidated Decision on Applications for Duty-Free Entry of Electron Microscope This is a decision... 37235. Instrument: Electron Microscope. Manufacturer: FEI Company, the Netherlands. Intended Use: See... Lafayette, IN 47907-2024. Instrument: Electron Microscope. Manufacturer: FEI Company, the Netherlands...

76 FR 68717 - University of Arkansas, et al.; Notice of Consolidated Decision on Applications for Duty-Free...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-11-07

... of Consolidated Decision on Applications for Duty-Free Entry of Electron Microscope This is a... Business Affairs, Fayetteville, AR 72701-1201. Instrument: Electron Microscope. Manufacturer: JEOL Ltd...: Brookhaven National Laboratory, Upton, NY 11973. Instrument: Electron Microscope. Manufacturer: JEOL, Ltd...

A high-compression electron gun for C6+ production: concept, simulations and mechanical design

NASA Astrophysics Data System (ADS)

Mertzig, Robert; Breitenfeldt, M.; Mathot, S.; Pitters, J.; Shornikov, A.; Wenander, F.

2017-07-01

In this paper we report on simulations and the mechanical design of a high-compression electron gun for an Electron Beam Ion Source (EBIS) dedicated for production of high intensity and high repetition rate pulses of bare carbon ions for injection into linac-based hadron therapy facilities. The gun is presently under construction at CERN to be retrofitted into the TwinEBIS test bench for experimental studies. We describe the design constraints, show results of numeric simulations and report on the mechanical design featuring several novel ideas. The reported design makes use of combined-function units with reduced number of mechanical joints that were carefully controlled and tuned during the manufacturing phase. The simulations addressed a wide range of topics including the influence of thermal effects, focusing optics, symmetry-breaking misalignments and injection into a full 5 T field.

JPRS Report, Science & Technology, Europe & Latin America

DTIC Science & Technology

1988-04-06

courses and in polytechnics a growing number of undergraduate research theses [ tesi di laurea] are increasingly coming to resemble authentic feasibility...Information Science Eleven Priorities Research Priority Actions — Microbiological engineering —Enzyme engineering —Biotechnological engineering —Food...Foodstuffs Medicine Human and social sciences Technology, computer-integrated manufacturing Electronics, data processing Microbiological

Innovation: Key to the future

NASA Technical Reports Server (NTRS)

1992-01-01

The NASA Marshall Space Flight Center Annual Report is presented. A description of research and development projects is included. Topics covered include: space science; space systems; transportation systems; astronomy and astrophysics; earth sciences; solar terrestrial physics; microgravity science; diagnostic and inspection system; information, electronic, and optical systems; materials and manufacturing; propulsion; and structures and dynamics.

21 CFR 606.171 - Reporting of product deviations by licensed manufacturers, unlicensed registered blood...

Code of Federal Regulations, 2010 CFR

2010-04-01

... components, including Source Plasma; an unlicensed registered blood establishment; or a transfusion service... unlicensed blood or blood components, including Source Plasma, if that event meets all the following criteria... chapter) by either a paper or electronic filing: (1) If you make a paper filing, you should identify on...

75 FR 4343 - Foreign-Trade Zone 22-Chicago, IL; Application for Manufacturing Authority; LG Electronics...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-01-27

... DEPARTMENT OF COMMERCE Foreign-Trade Zones Board [Docket 3-2010] Foreign-Trade Zone 22--Chicago, IL; Application for Manufacturing Authority; LG Electronics MobileComm USA, Inc. (Cell Phone Kitting... authority on behalf of LG Electronics MobileComm USA, Inc. (LGEMU), located in Bolingbrook, Illinois. The...

ELECTRONIC TECHNICIAN PERSONNEL AND TRAINING NEEDS OF IOWA INDUSTRIES.

ERIC Educational Resources Information Center

WEEDE, GARY DEAN

THE PURPOSE OF THIS STUDY WAS TO PROVIDE DATA FOR USE IN DEVELOPING OR IMPROVING ELECTRONIC TECHNOLOGY PROGRAMS. A POSTAL CARD QUESTIONNAIRE WAS SENT TO 678 MANUFACTURING AND PROCESSING INDUSTRIES IN IOWA EMPLOYING MORE THAN 50 PERSONS AND ALL ELECTRICAL, ELECTRONIC, AND PRECISION INSTRUMENT MANUFACTURERS EMPLOYING FEWER THAN 50 PERSONS. DATA WERE…

75 FR 52928 - Emory University, et al., Notice of Consolidated Decision on Applications for Duty-Free Entry of...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-08-30

... Consolidated Decision on Applications for Duty-Free Entry of Electron Microscopes This is a decision... 30322. Instrument: Electron Microscope. Manufacturer: JEOL, Ltd., Japan. Intended Use: See notice at 75... Department of Health, Menands, NY 12204-2719. Instrument: Electron Microscope. Manufacturer: JEOL Ltd., Japan...

1996 Laboratory directed research and development annual report

DOE Office of Scientific and Technical Information (OSTI.GOV)

Meyers, C.E.; Harvey, C.L.; Lopez-Andreas, L.M.

This report summarizes progress from the Laboratory Directed Research and Development (LDRD) program during fiscal year 1996. In addition to a programmatic and financial overview, the report includes progress reports from 259 individual R&D projects in seventeen categories. The general areas of research include: engineered processes and materials; computational and information sciences; microelectronics and photonics; engineering sciences; pulsed power; advanced manufacturing technologies; biomedical engineering; energy and environmental science and technology; advanced information technologies; counterproliferation; advanced transportation; national security technology; electronics technologies; idea exploration and exploitation; production; and science at the interfaces - engineering with atoms.

Microstructural Analysis of Ti-6Al-4V Components Made by Electron Beam Additive Manufacturing

NASA Astrophysics Data System (ADS)

Coleman, Rashadd L.

Electron Beam Additive Manufacturing (EBAM) is a relatively new additive manufacturing (AM) technology that uses a high-energy electron beam to melt and fuse powders to build full-density parts in a layer by layer fashion. EBAM can fabricate metallic components, particularly, of complex shapes, in an efficient and cost-effective manner compared to conventional manufacturing means. EBAM is an enabling technology for rapid manufacturing (RM) of metallic components, and thus, can efficiently integrate the design and manufacturing of aerospace components. However, EBAM for aerospace-related applications remain limited because the effect of the EBAM process on part characteristics is not fully understood. In this study, various techniques including microhardness, optical microscopy (OM), X-ray diffraction (XRD), Scanning Electron Microscopy (SEM), and electron backscatter diffraction (EBSD) were used to characterize Ti-6Al-4V components processed using EBAM. The results were compared to Ti-6Al-4V components processed using conventional techniques. In this study it is shown that EBAM built Ti-64 components have increased hardness, elastic modulus, and yield strength compared to wrought Ti-6Al-4V. Further, it is also shown in this study that the horizontal build EBAM Ti-6Al-4V has increased hardness, elastic modulus, and yield strength compared to vertical build EBAM due to a preferential growth of the beta phase.

Zero-dimensional to three-dimensional nanojoining: current status and potential applications

DOE PAGES

Ma, Ying; Li, Hong; Bridges, Denzel; ...

2016-08-01

We report that the continuing miniaturization of microelectronics is pushing advanced manufacturing into nanomanufacturing. Nanojoining is a bottom-up assembly technique that enables functional nanodevice fabrication with dissimilar nanoscopic building blocks and/or molecular components. Various conventional joining techniques have been modified and re-invented for joining nanomaterials. Our review surveys recent progress in nanojoining methods, as compared to conventional joining processes. Examples of nanojoining are given and classified by the dimensionality of the joining materials. At each classification, nanojoining is reviewed and discussed according to materials specialties, low dimensional processing features, energy input mechanisms and potential applications. The preparation of new intermetallicmore » materials by reactive nanoscale multilayer foils based on self-propagating high-temperature synthesis is highlighted. This review will provide insight into nanojoining fundamentals and innovative applications in power electronics packaging, plasmonic devices, nanosoldering for printable electronics, 3D printing and space manufacturing.« less

78 FR 5776 - Columbia University, et al.; Notice of Consolidated Decision on Applications for Duty-Free Entry...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-01-28

... 94305. Instrument: Titan 80-300 Environmental Transmission Electron Microscope. Manufacturer: FEI Co.../Scanning Electron Microscope. Manufacturer: FEI Co., the Netherlands. Intended Use: See notice at 77 FR...

The National Si-Soft Project

NASA Astrophysics Data System (ADS)

Chang, Chun-Yen; Trappey, Charles V.

2003-06-01

Taiwan's electronics industry emerged in the 1960s with the creation of a small but well planned integrated circuit (IC) packaging industry. This industry investment led to bolder investments in research, laboratories, and the island's first semiconductor foundries in the 1980s. Following the success of the emerging IC manufacturers and design houses, hundreds of service firms and related industries (software, legal services, substrate, chemical, and test firms among others) opened for business and completed Taiwan's IC manufacturing supply chain. The challenge for Taiwan's electronics industry is to take the lead in the design, manufacture, and marketing of name brand electronic products. This paper introduces the Si-Soft (silicon software) Project, a national initiative that builds on Taiwan's achievements in manufacturing (referred to as Si-Hard or silicon hardware) to launch a new wave of companies. These firms will contribute to the core underlying technology (intellectual property) used in the creation of electronic products.

48 CFR 1819.1005 - Applicability.

Code of Federal Regulations, 2013 CFR

2013-10-01

... System (NAICS) codes are: NAICS code Industry category 334111 Electronic Computer Manufacturing. 334418... Manufacturing. 334119 Other Computer Peripheral Equipment Manufacturing. 33422 Radio and Television Broadcasting and Wireless Communication Equipment Manufacturing. 336415 Guided Missile and Space Vehicle Propulsion...

48 CFR 1819.1005 - Applicability.

Code of Federal Regulations, 2014 CFR

2014-10-01

... System (NAICS) codes are: NAICS code Industry category 334111 Electronic Computer Manufacturing. 334418... Manufacturing. 334119 Other Computer Peripheral Equipment Manufacturing. 33422 Radio and Television Broadcasting and Wireless Communication Equipment Manufacturing. 336415 Guided Missile and Space Vehicle Propulsion...

48 CFR 1819.1005 - Applicability.

Code of Federal Regulations, 2012 CFR

2012-10-01

... System (NAICS) codes are: NAICS code Industry category 334111 Electronic Computer Manufacturing. 334418... Manufacturing. 334119 Other Computer Peripheral Equipment Manufacturing. 33422 Radio and Television Broadcasting and Wireless Communication Equipment Manufacturing. 336415 Guided Missile and Space Vehicle Propulsion...

Multilayer electronic component systems and methods of manufacture

NASA Technical Reports Server (NTRS)

Thompson, Dane (Inventor); Wang, Guoan (Inventor); Kingsley, Nickolas D. (Inventor); Papapolymerou, Ioannis (Inventor); Tentzeris, Emmanouil M. (Inventor); Bairavasubramanian, Ramanan (Inventor); DeJean, Gerald (Inventor); Li, RongLin (Inventor)

2010-01-01

Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.

5 CFR 532.267 - Special wage schedules for aircraft, electronic, and optical instrument overhaul and repair...

Code of Federal Regulations, 2014 CFR

2014-01-01

... Photographic and photocopying equipment manufacturing. 3341 Computer and peripheral equipment manufacturing. 33422 Radio and television broadcasting and wireless communications equipment manufacturing. 33429 Other communications equipment manufacturing. 3343 Audio and video equipment manufacturing. 334412 Bare printed circuit...

Research and Assessment of Learning Environments through Photoelicitation: Graduate Student Perceptions of Electronics Manufacturing in India

ERIC Educational Resources Information Center

Berdanier, Catherine G. P.; Cox, Monica F.

2015-01-01

This research studies the positive and negative perceptions of graduate students from the United States studying issues of sustainable electronics and electronics manufacturing in India as part of a National Science Foundation Integrative Graduate Education and Research Traineeship (IGERT) curriculum. The purpose of this paper is to discuss the…

Highly Manufacturable Deep (Sub-Millimeter) Etching Enabled High Aspect Ratio Complex Geometry Lego-Like Silicon Electronics.

PubMed

Ghoneim, Mohamed Tarek; Hussain, Muhammad Mustafa

2017-04-01

A highly manufacturable deep reactive ion etching based process involving a hybrid soft/hard mask process technology shows high aspect ratio complex geometry Lego-like silicon electronics formation enabling free-form (physically flexible, stretchable, and reconfigurable) electronic systems. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

The unacknowledged incidence of laparoscopic stapler malfunction.

PubMed

Kwazneski, Douglas; Six, Cheryl; Stahlfeld, Kurt

2013-01-01

Laparoscopic instruments are being used with increasing frequency. Our surgeons recently experienced several independent adverse events involving the laparoscopic linear stapler. Although the Food and Drug Administration maintains a Manufacturer and User Facility Device Experience (MAUDE) database to track such voluntary reports, many events are not reported and the true incidence of adverse events is unknown. We attempted to determine how frequently minimally invasive surgeons have experienced technical problems with a laparoscopic stapler. Following IRB approval, we electronically distributed an anonymous 10-question survey to the 124 minimally invasive program directors listed in the Fellowship Council database. The questions focused on personal or peer experience with laparoscopic stapler malfunction, frequency and type of malfunction, device manufacturer, whether the operation was altered, and root cause analysis of the event. Forty-four of the 124 program directors (35%) completed the survey. The majority reported personal or peer experience (86%) with a linear stapler not releasing (66%) or not firing (73%) after application, with 27% of the respondents noting that this occurred three or more times. The malfunction was not related to type of load, straight (23%) or reticulating (32%) model, or manufacturer (Ethicon 30%, Covidien 36%). One quarter of the respondents noted that the malfunction caused them to significantly alter their operative procedure, and 30% reported that they received no helpful feedback from the manufacturer despite contacting it. Most minimally invasive surgeons have experienced laparoscopic linear stapler malfunction and 25% have had to significantly alter the planned operative procedure due to the malfunction.

78 FR 19801 - 2013 Revisions to the Greenhouse Gas Reporting Rule and Proposed Confidentiality Determinations...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-04-02

.... Electronic files should avoid the use of special characters, any form of encryption, and be free of any... Production 327310 Portland cement manufacturing plants. CO2 Enhanced Oil and Gas Recovery 211 Oil and gas... steel mills, steel companies, sinter plants, blast furnaces, basic oxygen process furnace shops. Lead...

Quartz Crystal Fabrication Facility.

DTIC Science & Technology

1980-05-01

controllers, cryopump compressors , and mass spectrometer indicator/controller were placed in cabinets. The frequency plating control equipment was designed ...contributions of J. F. Howell , GEND Manufacturing Engineering Operation, for his design of the electrical and electronics system and for his tireless...report describes the design and operation of a five chamber, interconnected vacuum system, which is capable of cleaning, plating, and sealing

Computer Technology for Industry

NASA Technical Reports Server (NTRS)

1982-01-01

Shell Oil Company used a COSMIC program, called VISCEL to insure the accuracy of the company's new computer code for analyzing polymers, and chemical compounds. Shell reported that there were no other programs available that could provide the necessary calculations. Shell produces chemicals for plastic products used in the manufacture of automobiles, housewares, appliances, film, textiles, electronic equipment and furniture.

Electronics manufacturing and assembly in Japan

NASA Technical Reports Server (NTRS)

Kukowski, John A.; Boulton, William R.

1995-01-01

In the consumer electronics industry, precision processing technology is the basis for enhancing product functions and for minimizing components and end products. Throughout Japan, manufacturing technology is seen as critical to the production and assembly of advanced products. While its population has increased less than 30 percent over twenty-five years, Japan's gross national product has increase thirtyfold; this growth has resulted in large part from rapid replacement of manual operations with innovative, high-speed, large-scale, continuously running, complex machines that process a growing number of miniaturized components. The JTEC panel found that introduction of next-generation electronics products in Japan goes hand-in-hand with introduction of new and improved production equipment. In the panel's judgment, Japan's advanced process technologies and equipment development and its highly automated factories are crucial elements of its domination of the consumer electronics marketplace - and Japan's expertise in manufacturing consumer electronics products gives it potentially unapproachable process expertise in all electronics markets.

Development strategy and process models for phased automation of design and digital manufacturing electronics

NASA Astrophysics Data System (ADS)

Korshunov, G. I.; Petrushevskaya, A. A.; Lipatnikov, V. A.; Smirnova, M. S.

2018-03-01

The strategy of quality of electronics insurance is represented as most important. To provide quality, the processes sequence is considered and modeled by Markov chain. The improvement is distinguished by simple database means of design for manufacturing for future step-by-step development. Phased automation of design and digital manufacturing electronics is supposed. The MatLab modelling results showed effectiveness increase. New tools and software should be more effective. The primary digital model is proposed to represent product in the processes sequence from several processes till the whole life circle.

Highly-stretchable 3D-architected Mechanical Metamaterials

NASA Astrophysics Data System (ADS)

Jiang, Yanhui; Wang, Qiming

2016-09-01

Soft materials featuring both 3D free-form architectures and high stretchability are highly desirable for a number of engineering applications ranging from cushion modulators, soft robots to stretchable electronics; however, both the manufacturing and fundamental mechanics are largely elusive. Here, we overcome the manufacturing difficulties and report a class of mechanical metamaterials that not only features 3D free-form lattice architectures but also poses ultrahigh reversible stretchability (strain > 414%), 4 times higher than that of the existing counterparts with the similar complexity of 3D architectures. The microarchitected metamaterials, made of highly stretchable elastomers, are realized through an additive manufacturing technique, projection microstereolithography, and its postprocessing. With the fabricated metamaterials, we reveal their exotic mechanical behaviors: Under large-strain tension, their moduli follow a linear scaling relationship with their densities regardless of architecture types, in sharp contrast to the architecture-dependent modulus power-law of the existing engineering materials; under large-strain compression, they present tunable negative-stiffness that enables ultrahigh energy absorption efficiencies. To harness their extraordinary stretchability and microstructures, we demonstrate that the metamaterials open a number of application avenues in lightweight and flexible structure connectors, ultraefficient dampers, 3D meshed rehabilitation structures and stretchable electronics with designed 3D anisotropic conductivity.

Highly-stretchable 3D-architected Mechanical Metamaterials.

PubMed

Jiang, Yanhui; Wang, Qiming

2016-09-26

Soft materials featuring both 3D free-form architectures and high stretchability are highly desirable for a number of engineering applications ranging from cushion modulators, soft robots to stretchable electronics; however, both the manufacturing and fundamental mechanics are largely elusive. Here, we overcome the manufacturing difficulties and report a class of mechanical metamaterials that not only features 3D free-form lattice architectures but also poses ultrahigh reversible stretchability (strain > 414%), 4 times higher than that of the existing counterparts with the similar complexity of 3D architectures. The microarchitected metamaterials, made of highly stretchable elastomers, are realized through an additive manufacturing technique, projection microstereolithography, and its postprocessing. With the fabricated metamaterials, we reveal their exotic mechanical behaviors: Under large-strain tension, their moduli follow a linear scaling relationship with their densities regardless of architecture types, in sharp contrast to the architecture-dependent modulus power-law of the existing engineering materials; under large-strain compression, they present tunable negative-stiffness that enables ultrahigh energy absorption efficiencies. To harness their extraordinary stretchability and microstructures, we demonstrate that the metamaterials open a number of application avenues in lightweight and flexible structure connectors, ultraefficient dampers, 3D meshed rehabilitation structures and stretchable electronics with designed 3D anisotropic conductivity.

A lithium niobate electro-optic tunable Bragg filter fabricated by electron beam lithography

NASA Astrophysics Data System (ADS)

Pierno, L.; Dispenza, M.; Secchi, A.; Fiorello, A.; Foglietti, V.

2008-06-01

We have designed and fabricated a lithium niobate tunable Bragg filter patterned by electron beam lithography and etched by reactive ion etching. Devices with 1 mm, 2 mm and 4 mm length and 360 and 1080 nm Bragg period, with 5 pm V-1 tuning efficiency, have been characterized. Some applications were identified. Optical simulation based on finite element model (FEM) software showing the optical filtering curve and the coupling factor dependence on the manufacturing parameter is reported. The tuning of the filter window position is electro-optically controlled.

Electron tubes for industrial applications

NASA Astrophysics Data System (ADS)

Gellert, Bernd

1994-05-01

This report reviews research and development efforts within the last years for vacuum electron tubes, in particular power grid tubes for industrial applications. Physical and chemical effects are discussed that determine the performance of todays devices. Due to the progress made in the fundamental understanding of materials and newly developed processes the reliability and reproducibility of power grid tubes could be improved considerably. Modern computer controlled manufacturing methods ensure a high reproducibility of production and continuous quality certification according to ISO 9001 guarantees future high quality standards. Some typical applications of these tubes are given as an example.

21 CFR 1005.25 - Service of process on manufacturers.

Code of Federal Regulations, 2010 CFR

2010-04-01

... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Service of process on manufacturers. 1005.25....25 Service of process on manufacturers. (a) Every manufacturer of electronic products, prior to... United States as the manufacturer's agent upon whom service of all processes, notices, orders, decisions...

Simulations of Field-Emission Electron Beams from CNT Cathodes in RF Photoinjectors

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mihalcea, Daniel; Faillace, Luigi; Panuganti, Harsha

2015-06-01

Average field emission currents of up to 700 mA were produced by Carbon Nano Tube (CNT) cathodes in a 1.3 GHz RF gun at Fermilab High Brightness Electron Source Lab. (HBESL). The CNT cathodes were manufactured at Xintek and tested under DC conditions at RadiaBeam. The electron beam intensity as well as the other beam properties are directly related to the time-dependent electric field at the cathode and the geometry of the RF gun. This report focuses on simulations of the electron beam generated through field-emission and the results are compared with experimental measurements. These simulations were performed with themore » time-dependent Particle In Cell (PIC) code WARP.« less

78 FR 2659 - Application(s) for Duty-Free Entry of Scientific Instruments

Federal Register 2010, 2011, 2012, 2013, 2014

2013-01-14

..., 2201 West End Ave., Nashville, TN 37235. Instrument: Electron Microscope. Manufacturer: FEI Company... St., West Lafayette, IN 47907-2024. Instrument: Electron Microscope. Manufacturer: FEI Company, the..., microorganisms, nanomaterials, and chemical compounds. Justification for Duty-Free Entry: There are no...

Agent-based services for B2B electronic commerce

NASA Astrophysics Data System (ADS)

Fong, Elizabeth; Ivezic, Nenad; Rhodes, Tom; Peng, Yun

2000-12-01

The potential of agent-based systems has not been realized yet, in part, because of the lack of understanding of how the agent technology supports industrial needs and emerging standards. The area of business-to-business electronic commerce (b2b e-commerce) is one of the most rapidly developing sectors of industry with huge impact on manufacturing practices. In this paper, we investigate the current state of agent technology and the feasibility of applying agent-based computing to b2b e-commerce in the circuit board manufacturing sector. We identify critical tasks and opportunities in the b2b e-commerce area where agent-based services can best be deployed. We describe an implemented agent-based prototype system to facilitate the bidding process for printed circuit board manufacturing and assembly. These activities are taking place within the Internet Commerce for Manufacturing (ICM) project, the NIST- sponsored project working with industry to create an environment where small manufacturers of mechanical and electronic components may participate competitively in virtual enterprises that manufacture printed circuit assemblies.

Galvanic Manufacturing in the Cities of Russia: Potential Source of Ambient Nanoparticles

PubMed Central

Golokhvast, Kirill S.; Shvedova, Anna A.

2014-01-01

Galvanic manufacturing is widely employed and can be found in nearly every average city in Russia. The release and accumulation of different metals (Me), depending on the technology used can be found in the vicinities of galvanic plants. Under the environmental protection act in Russia, the regulations for galvanic manufacturing do not include the regulations and safety standards for ambient ultrafine and nanosized particulate matter (PM). To assess whether Me nanoparticles (NP) are among environmental pollutants caused by galvanic manufacturing, the level of Me NP were tested in urban snow samples collected around galvanic enterprises in two cities. Employing transmission electronic microscopy, energy-dispersive X-ray spectroscopy, and a laser diffraction particle size analyzer, we found that the size distribution of tested Me NP was within 10–120 nm range. This is the first study to report that Me NP of Fe, Cr, Pb, Al, Ni, Cu, and Zn were detected around galvanic shop settings. PMID:25329582

FY 2016 Research Highlights

DOE Office of Scientific and Technical Information (OSTI.GOV)

This fact sheet summarizes the research highlights for the Clean Energy Manufacturing Analysis Center (CEMAC) for Fiscal Year 2106. Topics covered include additive manufacturing for the wind industry, biomass-based chemicals substitutions, carbon fiber manufacturing facility siting, geothermal power plant turbines, hydrogen refueling stations, hydropower turbines, LEDs and lighting, light-duty automotive lithium-ion cells, magnetocaloric refrigeration, silicon carbide power electronics for variable frequency motor drives, solar photovoltaics, and wide bandgap semiconductor opportunities in power electronics.

Models for formation and choice of variants for organizing digital electronics manufacturing

NASA Astrophysics Data System (ADS)

Korshunov, G. I.; Lapkova, M. Y.; Polyakov, S. L.; Frolova, E. A.

2018-03-01

The directions of organizing digital electronics manufacturing are considered by the example of surface mount technology. The basic equipment choice has to include not only individual characteristics, but also mutual influence of individual machines and the results of design for manufacturing. Application of special cases of the Utility function which are complicated in the general representation of polynomial functions are proposed for estimation of product quality in a staged automation.

Investigating catalyst coated membrane equilibration time for polymer electrolyte membrane fuel cell manufacturing

NASA Astrophysics Data System (ADS)

Cote, Philippe

Mercedes-Benz Canada Inc., Fuel Cell Division, manufactures polymer electrolyte membrane fuel cell stacks for use in vehicles. The manufacturing line is being optimized for efficiency and quality control, in order to uphold the high standards of Mercedes-Benz Inc. vehicles. In an operating polymer electrolyte membrane fuel cell, the catalyst coated membrane facilitates the electrochemical reaction that generates electricity. This research examines the equilibration of catalyst coated membrane rolls to controlled temperature and humidity conditions, before they are used in the manufacturing of polymer electrolyte membrane fuel cells. Equilibration involves allowing the water content in the catalyst coated membrane to stabilize at the controlled conditions, in order to reduce mechanical stress in the material for better manufacturability. Initial equilibration measurements were conducted on discrete catalyst coated membrane samples using novel electronic conductivity measurements of the catalyst layer, and compared to ionic conductivity measurements of the membrane. Electronic conductivity measurements are easier to implement in the manufacturing environment than the more complex ionic conductivity measurements. When testing discrete catalyst coated membrane samples in an environmental chamber, the equilibration trends for the measured ionic and electronic conductivity signals were similar enough to permit us to adapt the electronic conductivity measurements for catalyst coated membrane in roll form. Equilibration measurements of catalyst coated membrane rolls were optimized to achieve a robust and repeatable procedure which could be used in the manufacturing environment at Mercedes-Benz Canada Inc., Fuel Cell Division.

An Electronic Indicator for Angular Velocity and Acceleration

DTIC Science & Technology

1944-08-01

n’cl | hce (f -l) r>iitlil rl Id, ~3/.ui., , JO. f NACÄ •ft! to AUG8 1947 WASHINGTON riACA WART1MK REPORTS are reprints of papere -r’./inally...ar top suggested tijo aeed for a stapler ml quicker method of obtaining data fron the machine than that provided by the manufacturer, tu the four

JPRS Report, Science & Technology, Japan

DTIC Science & Technology

1991-01-31

final test. Keywords: Spherical Pressure Hull, Titanium Alloy , Three-Dimensional Machining, Electron Beam Welding . 1. Introduction In bodies like... processed (the heat treatment involving high-temperature heating and rapid quenching in order to obtain finer grains of the titanium alloy ) and...given m Table 3. The test results were all satisfactory. Forged material of titanium alloy , manufactured by forging, beta processing , and billet

40 CFR Table I-1 to Subpart I of... - Default Emission Factors for Threshold Applicability Determination

Code of Federal Regulations, 2013 CFR

2013-07-01

... 40 Protection of Environment 22 2013-07-01 2013-07-01 false Default Emission Factors for Threshold Applicability Determination I Table I-1 to Subpart I of Part 98 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) AIR PROGRAMS (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Electronics Manufacturing Pt. 98, Subpt. I, Table I-1...

40 CFR Table I-1 to Subpart I of... - Default Emission Factors for Threshold Applicability Determination

Code of Federal Regulations, 2014 CFR

2014-07-01

... 40 Protection of Environment 21 2014-07-01 2014-07-01 false Default Emission Factors for Threshold Applicability Determination I Table I-1 to Subpart I of Part 98 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) AIR PROGRAMS (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Electronics Manufacturing Pt. 98, Subpt. I, Table I-1...

Novel Materials for 3D Printing by Photopolymerization.

PubMed

Layani, Michael; Wang, Xiaofeng; Magdassi, Shlomo

2018-05-13

The field of 3D printing, also known as additive manufacturing (AM), is developing rapidly in both academic and industrial research environments. New materials and printing technologies, which enable rapid and multimaterial printing, have given rise to new applications and utilizations. However, the main bottleneck for achieving many more applications is the lack of materials with new physical properties. Here, some of the recent reports on novel materials in this field, such as ceramics, glass, shape-memory polymers, and electronics, are reviewed. Although new materials have been reported for all three main printing approaches-fused deposition modeling, binder jetting or laser sintering/melting, and photopolymerization-based approaches, apparently, most of the novel physicochemical properties are associated with materials printed by photopolymerization approaches. Furthermore, the high resolution that can be achieved using this type of 3D printing, together with the new properties, has resulted in new implementations such as microfluidic, biomedical devices, and soft robotics. Therefore, the focus here is on photopolymerization-based additive manufacturing including the recent development of new methods, novel monomers, and photoinitiators, which result in previously inaccessible applications such as complex ceramic structures, embedded electronics, and responsive 3D objects. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Direct-Write Printing on Three-Dimensional Geometries for Miniaturized Detector and Electronic Assemblies

NASA Technical Reports Server (NTRS)

Paquette, Beth; Samuels, Margaret; Chen, Peng

2017-01-01

Direct-write printing techniques will enable new detector assemblies that were not previously possible with traditional assembly processes. Detector concepts were manufactured using this technology to validate repeatability. Additional detector applications and printed wires on a 3-dimensional magnetometer bobbin will be designed for print. This effort focuses on evaluating performance for direct-write manufacturing techniques on 3-dimensional surfaces. Direct-write manufacturing has the potential to reduce mass and volume for fabrication and assembly of advanced detector concepts by reducing trace widths down to 10 microns, printing on complex geometries, allowing new electronic concept production, and reduced production times of complex those electronics.

Prosperity game for the national electronics manufacturing initiative

DOE Office of Scientific and Technical Information (OSTI.GOV)

Berman, M.; VanDevender, J.P.; Berry, I.

1995-05-01

Prosperity Games are an outgrowth and adaptation of move/countermove and seminar War Games. Prosperity Games are simulations that explore complex issues in a variety of areas including economics, politics, sociology, environment, education and research. These issues can be examined from a variety of perspectives ranging from a global, macroeconomic and geopolitical viewpoint down to the details of customer/supplier/market interactions in specific industries. All Prosperity Games are unique in that both the game format and the player contributions vary from game to game. This report documents the Prosperity Game conducted under the sponsorship of the Electronics Subcommittee of the Civilian Industrialmore » Technology Committee (under the National Science and Technology Council), and the Electronics Partnership Project. Players were drawn from the electronics industry, from government, national laboratories, and universities, and from Japan and Austria. The primary objectives of this game were: To connect the technical and non-technical (i.e., policy) issues that were developed in the roadmap-making endeavor of the National Electronics Manufacturing Initiative (NENI);to provide energy, enthusiasm and people to help the roadmap succeed; and to provide insight into high-leverage public and private investments. The deliberations and recommendations of these teams provide valuable insights as to the views of this diverse group of decision makers concerning policy changes, foreign competition, the robustness of strategic thinking and planning, and the development, delivery and commercialization of new technologies.« less

Analysis of phthalate esters in soils near an electronics manufacturing facility and from a non-industrialized area by gas purge microsyringe extraction and gas chromatography.

PubMed

Wu, Wei; Hu, Jia; Wang, Jinqi; Chen, Xuerong; Yao, Na; Tao, Jing; Zhou, Yi-Kai

2015-03-01

Here, a novel technique is described for the extraction and quantitative determination of six phthalate esters (PAEs) from soils by gas purge microsyringe extraction and gas chromatography. Recovery of PAEs ranged from 81.4% to 120.3%, and the relative standard deviation (n=6) ranged from 5.3% to 10.5%. Soil samples were collected from roadsides, farmlands, residential areas, and non-cultivated areas in a non-industrialized region, and from the same land-use types within 1 km of an electronics manufacturing facility (n=142). Total PAEs varied from 2.21 to 157.62 mg kg(-1) in non-industrialized areas and from 8.63 to 171.64 mg kg(-1) in the electronics manufacturing area. PAE concentrations in the non-industrialized area were highest in farmland, followed (in decreasing order) by roadsides, residential areas, and non-cultivated soil. In the electronics manufacturing area, PAE concentrations were highest in roadside soils, followed by residential areas, farmland, and non-cultivated soils. Concentrations of dimethyl phthalate (DMP), diethyl phthalate (DEP), and di-n-butyl phthalate (DnBP) differed significantly (P<0.01) between the industrial and non-industrialized areas. Principal component analysis indicated that the strongest explanatory factor was related to DMP and DnBP in non-industrialized soils and to butyl benzyl phthalate (BBP) and DMP in soils near the electronics manufacturing facility. Congener-specific analysis confirmed that diethylhexyl phthalate (DEHP) was a predictive indication both in the non-industrialized area (r(2)=0.944, P<0.01) and the industrialized area (r(2)=0.860, P<0.01). The higher PAE contents in soils near the electronics manufacturing facility are of concern, considering the large quantities of electronic wastes generated with ongoing industrialization. Copyright © 2014 Elsevier B.V. All rights reserved.

Materials Characterization of Additively Manufactured Components for Rocket Propulsion

NASA Technical Reports Server (NTRS)

Carter, Robert; Draper, Susan; Locci, Ivan; Lerch, Bradley; Ellis, David; Senick, Paul; Meyer, Michael; Free, James; Cooper, Ken; Jones, Zachary

2015-01-01

To advance Additive Manufacturing (AM) technologies for production of rocket propulsion components the NASA Glenn Research Center (GRC) is applying state of the art characterization techniques to interrogate microstructure and mechanical properties of AM materials and components at various steps in their processing. The materials being investigated for upper stage rocket engines include titanium, copper, and nickel alloys. Additive manufacturing processes include laser powder bed, electron beam powder bed, and electron beam wire fed processes. Various post build thermal treatments, including Hot Isostatic Pressure (HIP), have been studied to understand their influence on microstructure, mechanical properties, and build density. Micro-computed tomography, electron microscopy, and mechanical testing in relevant temperature environments has been performed to develop relationships between build quality, microstructure, and mechanical performance at temperature. A summary of GRC's Additive Manufacturing roles and experimental findings will be presented.

Material Characterization of Additively Manufactured Components for Rocket Propulsion

NASA Technical Reports Server (NTRS)

Carter, Robert; Draper, Susan; Locci, Ivan; Lerch, Bradley; Ellis, David; Senick, Paul; Meyer, Michael; Free, James; Cooper, Ken; Jones, Zachary

2015-01-01

To advance Additive Manufacturing (AM) technologies for production of rocket propulsion components the NASA Glenn Research Center (GRC) is applying state of the art characterization techniques to interrogate microstructure and mechanical properties of AM materials and components at various steps in their processing. The materials being investigated for upper stage rocket engines include titanium, copper, and nickel alloys. Additive manufacturing processes include laser powder bed, electron beam powder bed, and electron beam wire fed processes. Various post build thermal treatments, including Hot Isostatic Pressure (HIP), have been studied to understand their influence on microstructure, mechanical properties, and build density. Micro-computed tomography, electron microscopy, and mechanical testing in relevant temperature environments has been performed to develop relationships between build quality, microstructure, and mechanical performance at temperature. A summary of GRCs Additive Manufacturing roles and experimental findings will be presented.

Materials and Manufacturing, Drafting 3: 9257.03.

ERIC Educational Resources Information Center

Dade County Public Schools, Miami, FL.

Designed for students interested in engineering fields pertaining to mechanical and electronic drafting, the course covers several types of drawings in the mechanical and electronic drafting field and many types of machine shop operations. The student will become familiar with stress, loading, safety factors, and manufacturing processes. The…

Josephson junction

DOEpatents

Wendt, J.R.; Plut, T.A.; Martens, J.S.

1995-05-02

A novel method for fabricating nanometer geometry electronic devices is described. Such Josephson junctions can be accurately and reproducibly manufactured employing photolithographic and direct write electron beam lithography techniques in combination with aqueous etchants. In particular, a method is described for manufacturing planar Josephson junctions from high temperature superconducting material. 10 figs.

Electronic plants

PubMed Central

Stavrinidou, Eleni; Gabrielsson, Roger; Gomez, Eliot; Crispin, Xavier; Nilsson, Ove; Simon, Daniel T.; Berggren, Magnus

2015-01-01

The roots, stems, leaves, and vascular circuitry of higher plants are responsible for conveying the chemical signals that regulate growth and functions. From a certain perspective, these features are analogous to the contacts, interconnections, devices, and wires of discrete and integrated electronic circuits. Although many attempts have been made to augment plant function with electroactive materials, plants’ “circuitry” has never been directly merged with electronics. We report analog and digital organic electronic circuits and devices manufactured in living plants. The four key components of a circuit have been achieved using the xylem, leaves, veins, and signals of the plant as the template and integral part of the circuit elements and functions. With integrated and distributed electronics in plants, one can envisage a range of applications including precision recording and regulation of physiology, energy harvesting from photosynthesis, and alternatives to genetic modification for plant optimization. PMID:26702448

Using electronic data interchange to report product quality

NASA Astrophysics Data System (ADS)

Egan, Donald F.; Frank, Donald T.

1993-03-01

The Product Quality Deficiency Report (PQDR) is a Department of Defense form that identifies deficiencies in the manufacture, repair, or procurement of materiel. It may be used by DoD employees or contractors to identify defects at any point in the item's life. DoD generates nearly 75,000 such deficiency reports each year. In most cases, when a defect is identified, Standard Form (SF) 368 is completed and sent to the activity managing the contract under which the materiel was procured. That activity, usually in conjunction with the contractor, investigates the complaint, attempts to determine a cause and a corrective action, and must make some disposition of the defective materiel. The process is labor- and paper-intensive and time-consuming. Technology can reduce the costs of the process and at the same time improve timeliness by electronically exchanging discrepancy data between activities. Electronic data interchange (EDI) is one technology for electronically passing PQDR data. It is widely used in industry and increasingly within DoD. DMRD 941 defines DoD's commitment to use EDI and cites the PQDR and other discrepancy reports as early candidates for EDI. In this report, we describe how EDI can be linked to changes in PQDR processing practices to provide further improvements.

48 CFR 252.246-7007 - Contractor Counterfeit Electronic Part Detection and Avoidance System.

Code of Federal Regulations, 2014 CFR

2014-10-01

... chain back to the original manufacturer, whether the electronic parts are supplied as discrete...; clear identification of the name and location of supply chain intermediaries from the manufacturer to... the supply chain until such time that the parts are determined to be authentic. (7) Methodologies to...

75 FR 2889 - Notice Pursuant to the National Cooperative Research and Production Act of 1993-International...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-01-19

... DEPARTMENT OF JUSTICE Antitrust Division Notice Pursuant to the National Cooperative Research and Production Act of 1993--International Electronics Manufacturing Initiative Notice is hereby given that, on..., 15 U.S.C. 4301 et seq. (``the Act''), International Electronics Manufacturing Initiative (``iNEMI...

75 FR 17691 - Foreign-Trade Zone 196 - Fort Worth, Texas, Application for Manufacturing Authority, ATC...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-04-07

... DEPARTMENT OF COMMERCE Foreign-Trade Zones Board [Docket 19-2010] Foreign-Trade Zone 196 - Fort Worth, Texas, Application for Manufacturing Authority, ATC Logistics & Electronics (Cell Phone Kitting... Board (the Board) by ATC Logistics & Electronics (ATCLE), operator of Site 2, FTZ 196, Fort Worth, Texas...

75 FR 17691 - Foreign-Trade Zone 196 - Fort Worth, Texas, Application for Temporary/Interim Manufacturing...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-04-07

... DEPARTMENT OF COMMERCE Foreign-Trade Zones Board [Docket T-2-2010] Foreign-Trade Zone 196 - Fort Worth, Texas, Application for Temporary/Interim Manufacturing Authority, ATC Logistics & Electronics... Executive Secretary of the Foreign-Trade Zones Board (the Board) by ATC Logistics & Electronics, operator of...

Body of Knowledge for Silicon Carbide Power Electronics

NASA Technical Reports Server (NTRS)

Boomer, Kristen; Lauenstein, Jean-Marie; Hammoud, Ahmad

2016-01-01

Wide band gap semiconductors, such as silicon carbide (SiC), have emerged as very promising materials for future electronic components due to the tremendous advantages they offer in terms of power capability, extreme temperature tolerance, and high frequency operation. This report documents some issues pertaining to SiC technology and its application in the area of power electronics, in particular those geared for space missions. It also serves as a body of knowledge (BOK) in reference to the development and status of this technology obtained via literature and industry survey as well as providing a listing of the major manufacturers and their capabilities. Finally, issues relevant to the reliability of SiC-based electronic parts are addressed and limitations affecting the full utilization of this technology are identified.

Nucleation and growth of chimney pores during electron-beam additive manufacturing

DOE PAGES

Cordero, Zachary C.; Dinwiddie, Ralph B.; Immel, David; ...

2016-12-05

The nucleation and growth of chimney pores during powder-bed, electron-beam additive manufacturing is investigated using in-situ infrared thermography as well as microcomputed tomography of as-printed parts. The pores are found to nucleate at dimples on the part s surface, clearly demonstrating how process parameters can affect surface roughness, which can in turn affect the internal defect structure in an additive manufactured part. Based on the results of this study, several strategies for suppressing the formation of chimney pores are discussed.

Single-chip microprocessor that communicates directly using light

NASA Astrophysics Data System (ADS)

Sun, Chen; Wade, Mark T.; Lee, Yunsup; Orcutt, Jason S.; Alloatti, Luca; Georgas, Michael S.; Waterman, Andrew S.; Shainline, Jeffrey M.; Avizienis, Rimas R.; Lin, Sen; Moss, Benjamin R.; Kumar, Rajesh; Pavanello, Fabio; Atabaki, Amir H.; Cook, Henry M.; Ou, Albert J.; Leu, Jonathan C.; Chen, Yu-Hsin; Asanović, Krste; Ram, Rajeev J.; Popović, Miloš A.; Stojanović, Vladimir M.

2015-12-01

Data transport across short electrical wires is limited by both bandwidth and power density, which creates a performance bottleneck for semiconductor microchips in modern computer systems—from mobile phones to large-scale data centres. These limitations can be overcome by using optical communications based on chip-scale electronic-photonic systems enabled by silicon-based nanophotonic devices8. However, combining electronics and photonics on the same chip has proved challenging, owing to microchip manufacturing conflicts between electronics and photonics. Consequently, current electronic-photonic chips are limited to niche manufacturing processes and include only a few optical devices alongside simple circuits. Here we report an electronic-photonic system on a single chip integrating over 70 million transistors and 850 photonic components that work together to provide logic, memory, and interconnect functions. This system is a realization of a microprocessor that uses on-chip photonic devices to directly communicate with other chips using light. To integrate electronics and photonics at the scale of a microprocessor chip, we adopt a ‘zero-change’ approach to the integration of photonics. Instead of developing a custom process to enable the fabrication of photonics, which would complicate or eliminate the possibility of integration with state-of-the-art transistors at large scale and at high yield, we design optical devices using a standard microelectronics foundry process that is used for modern microprocessors. This demonstration could represent the beginning of an era of chip-scale electronic-photonic systems with the potential to transform computing system architectures, enabling more powerful computers, from network infrastructure to data centres and supercomputers.

Single-chip microprocessor that communicates directly using light.

PubMed

Sun, Chen; Wade, Mark T; Lee, Yunsup; Orcutt, Jason S; Alloatti, Luca; Georgas, Michael S; Waterman, Andrew S; Shainline, Jeffrey M; Avizienis, Rimas R; Lin, Sen; Moss, Benjamin R; Kumar, Rajesh; Pavanello, Fabio; Atabaki, Amir H; Cook, Henry M; Ou, Albert J; Leu, Jonathan C; Chen, Yu-Hsin; Asanović, Krste; Ram, Rajeev J; Popović, Miloš A; Stojanović, Vladimir M

2015-12-24

Data transport across short electrical wires is limited by both bandwidth and power density, which creates a performance bottleneck for semiconductor microchips in modern computer systems--from mobile phones to large-scale data centres. These limitations can be overcome by using optical communications based on chip-scale electronic-photonic systems enabled by silicon-based nanophotonic devices. However, combining electronics and photonics on the same chip has proved challenging, owing to microchip manufacturing conflicts between electronics and photonics. Consequently, current electronic-photonic chips are limited to niche manufacturing processes and include only a few optical devices alongside simple circuits. Here we report an electronic-photonic system on a single chip integrating over 70 million transistors and 850 photonic components that work together to provide logic, memory, and interconnect functions. This system is a realization of a microprocessor that uses on-chip photonic devices to directly communicate with other chips using light. To integrate electronics and photonics at the scale of a microprocessor chip, we adopt a 'zero-change' approach to the integration of photonics. Instead of developing a custom process to enable the fabrication of photonics, which would complicate or eliminate the possibility of integration with state-of-the-art transistors at large scale and at high yield, we design optical devices using a standard microelectronics foundry process that is used for modern microprocessors. This demonstration could represent the beginning of an era of chip-scale electronic-photonic systems with the potential to transform computing system architectures, enabling more powerful computers, from network infrastructure to data centres and supercomputers.

Curved diamond-crystal spectrographs for x-ray free-electron laser noninvasive diagnostics.

PubMed

Terentyev, Sergey; Blank, Vladimir; Kolodziej, Tomasz; Shvyd'ko, Yuri

2016-12-01

We report on the manufacturing and X-ray tests of bent diamond-crystal X-ray spectrographs, designed for noninvasive diagnostics of the X-ray free-electron laser (XFEL) spectra in the spectral range from 5 to 15 keV. The key component is a curved, 20-μm thin, single crystalline diamond triangular plate in the (110) orientation. The radius of curvature can be varied between R = 0.6 m and R = 0.1 m in a controlled fashion, ensuring imaging in a spectral window of up to 60 eV for ≃8 keV X-rays. All of the components of the bending mechanism (about 10 parts) are manufactured from diamond, thus ensuring safe operations in intense XFEL beams. The spectrograph is transparent to 88% for 5-keV photons and to 98% for 15-keV photons. Therefore, it can be used for noninvasive diagnostics of the X-ray spectra during XFEL operations.

Curved diamond-crystal spectrographs for x-ray free-electron laser noninvasive diagnostics

DOE PAGES

Terentyev, Sergey; Blank, Vladimir; Kolodziej, Tomasz; ...

2016-12-29

Here, we report on the manufacturing and X-ray tests of bent diamond-crystal X-ray spectrographs, designed for noninvasive diagnostics of the X-ray free-electron laser (XFEL) spectra in the spectral range from 5 to 15 keV. The key component is a curved, 20-µm thin, single crystalline diamond triangular plate in the (110) orientation. The radius of curvature can be varied between R = 0.6 m and R = 0.1 m in a controlled fashion, ensuring imaging in a spectral window of up to 60 eV for ' 8 keV X-rays. All of the components of the bending mechanism (about 10 parts) aremore » manufactured from diamond, thus ensuring safe operations in intense XFEL beams. The spectrograph is transparent to 88% for 5-keV photons, and to 98% for 15-keV photons. Therefore, it can be used for noninvasive diagnostics of the X-ray spectra during XFEL operations.« less

Curved diamond-crystal spectrographs for x-ray free-electron laser noninvasive diagnostics

DOE Office of Scientific and Technical Information (OSTI.GOV)

Terentyev, Sergey; Blank, Vladimir; Kolodziej, Tomasz

Here, we report on the manufacturing and X-ray tests of bent diamond-crystal X-ray spectrographs, designed for noninvasive diagnostics of the X-ray free-electron laser (XFEL) spectra in the spectral range from 5 to 15 keV. The key component is a curved, 20-µm thin, single crystalline diamond triangular plate in the (110) orientation. The radius of curvature can be varied between R = 0.6 m and R = 0.1 m in a controlled fashion, ensuring imaging in a spectral window of up to 60 eV for ' 8 keV X-rays. All of the components of the bending mechanism (about 10 parts) aremore » manufactured from diamond, thus ensuring safe operations in intense XFEL beams. The spectrograph is transparent to 88% for 5-keV photons, and to 98% for 15-keV photons. Therefore, it can be used for noninvasive diagnostics of the X-ray spectra during XFEL operations.« less

Helicon wave excitation to produce energetic electrons for manufacturing semiconductors

DOEpatents

Molvik, Arthur W.; Ellingboe, Albert R.

1998-01-01

A helicon plasma source is controlled by varying the axial magnetic field or rf power controlling the formation of the helicon wave. An energetic electron current is carried on the wave when the magnetic field is 90 G; but there is minimal energetic electron current when the magnetic field is 100 G in one particular plasma source. Similar performance can be expected from other helicon sources by properly adjusting the magnetic field and power to the particular geometry. This control for adjusting the production of energetic electrons can be used in the semiconductor and thin-film manufacture process. By applying energetic electrons to the insulator layer, such as silicon oxide, etching ions are attracted to the insulator layer and bombard the insulator layer at higher energy than areas that have not accumulated the energetic electrons. Thus, silicon and metal layers, which can neutralize the energetic electron currents will etch at a slower or non-existent rate. This procedure is especially advantageous in the multilayer semiconductor manufacturing because trenches can be formed that are in the range of 0.18-0.35 mm or less.

Helicon wave excitation to produce energetic electrons for manufacturing semiconductors

DOEpatents

Molvik, A.W.; Ellingboe, A.R.

1998-10-20

A helicon plasma source is controlled by varying the axial magnetic field or rf power controlling the formation of the helicon wave. An energetic electron current is carried on the wave when the magnetic field is 90 G; but there is minimal energetic electron current when the magnetic field is 100 G in one particular plasma source. Similar performance can be expected from other helicon sources by properly adjusting the magnetic field and power to the particular geometry. This control for adjusting the production of energetic electrons can be used in the semiconductor and thin-film manufacture process. By applying energetic electrons to the insulator layer, such as silicon oxide, etching ions are attracted to the insulator layer and bombard the insulator layer at higher energy than areas that have not accumulated the energetic electrons. Thus, silicon and metal layers, which can neutralize the energetic electron currents will etch at a slower or non-existent rate. This procedure is especially advantageous in the multilayer semiconductor manufacturing because trenches can be formed that are in the range of 0.18--0.35 mm or less. 16 figs.

Evaluation of Fast Switching Diode 1N4448 Over a Wide Temperature Range

NASA Technical Reports Server (NTRS)

Boomer, Kristen; Damron, James; Gray, Josh; Hammoud, Ahmad

2017-01-01

Electronic parts used in the design of power systems geared for space applications are often exposed to extreme temperatures and thermal cycling. Limited data exist on the performance and reliability of commercial-off-the-shelf (COTS) electronic parts at temperatures beyond the manufacturers specified operating temperature range. This report summarizes preliminary results obtained on the evaluation of automotive-grade, fast switching diodes over a wide temperature range and thermal cycling. The investigations were carried out to establish a baseline on functionality of these diodes and to determine suitability for use outside their recommended temperature limits.

NASA Tech Briefs, April 1995. Volume 19, No. 4

NASA Technical Reports Server (NTRS)

1995-01-01

This issue of the NASA Tech Briefs has a special focus section on video and imaging, a feature on the NASA invention of the year, and a resource report on the Dryden Flight Research Center. The issue also contains articles on electronic components and circuits, electronic systems, physical sciences, materials, computer programs, mechanics, machinery, manufacturing/fabrication, mathematics and information sciences and life sciences. In addition to the standard articles in the NASA Tech brief, this contains a supplement entitled "Laser Tech Briefs" which features an article on the National Ignition Facility, and other articles on the use of Lasers.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zhang, T.; Hu, M.; Guo, Q.

Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexiblemore » electronics manufacturing.« less

Technology Transfer Demonstration Project. Progress report, December 1993--January 1994

DOE Office of Scientific and Technical Information (OSTI.GOV)

Not Available

1994-06-01

The Rural Enterprises Industrial Incubator program offers beginning business a stable foundation on which to build long-term profitable concerns. These incubator facilities consist of buildings for the specific purpose of starting a new manufacturing business and are designed to accommodate a variety of manufacturing firms. Incubators are located on the Kiamichi Area Vocational Technical School system (KAVTS) campuses in Durant, Atoka, Hugo, McAlester, Stigler, Poteau, Idabel, at the REI headquarters and one in Bennington, OK. These facilities range in size from 4,800 sq.ft. to 14,000 sq.ft. and have housed businesses such as machine shops, metal fabrication companies, electronic assembly andmore » biomedical engineering firms.« less

USSR Report, Electronics and Electrical Engineering, No. 104

DTIC Science & Technology

1983-06-13

shaping of silicon crystals during their growth is a modification of inductive contactless forming of rods and tubes directly from the melt on a...MANUFACTURING TECHNOLOGY Induction Systems for Electromagnetic Shaping of Silicon Crystal During.Growth (L. R. Lev; ELEKTROTEKHNIKA, Feb 83) • • • x...et al.; IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENIY: ELEKTROMEKHANIKA, Dec 82) 18 Basic Design of Linear- Induction Traction Motors for High-Speed

Manufacturing Methods and Technology Project Summary Reports

DTIC Science & Technology

1981-06-01

a tough urethane film. The basic principle is to pump two components to a spinning disc, mixing the components just prior to depositing in a well...and check out an electronic target scoring device using developed scientific principles without drastically modifying existing commercial...equipment. The scoring device selected and installed was an Accubar Model ATS-16D using the underlying physics principle of acoustic shock wave propagation

Current status of free radicals and electronically excited metastable species as high energy propellants

NASA Technical Reports Server (NTRS)

Rosen, G.

1973-01-01

A survey is presented of free radicals and electronically excited metastable species as high energy propellants for rocket engines. Nascent or atomic forms of diatomic gases are considered free radicals as well as the highly reactive diatomic triatomic molecules that posess unpaired electrons. Manufacturing and storage problems are described, and a review of current experimental work related to the manufacture of atomic hydrogen propellants is presented.

48 CFR 1819.1005 - Applicability.

Code of Federal Regulations, 2011 CFR

2011-10-01

... Printed Circuit Assembly (Electronic Assembly) Manufacturing. 334613 Magnetic and Optical Recording Media... and Wireless Communication Equipment Manufacturing. 336415 Guided Missile and Space Vehicle Propulsion Unit and Propulsion Unit Parts Manufacturing. 336419 Other Guided Missile and Space Vehicle Parts and...

48 CFR 1819.1005 - Applicability.

Code of Federal Regulations, 2010 CFR

2010-10-01

... Printed Circuit Assembly (Electronic Assembly) Manufacturing. 334613 Magnetic and Optical Recording Media... and Wireless Communication Equipment Manufacturing. 336415 Guided Missile and Space Vehicle Propulsion Unit and Propulsion Unit Parts Manufacturing. 336419 Other Guided Missile and Space Vehicle Parts and...

Inspection of additive manufactured parts using laser ultrasonics

NASA Astrophysics Data System (ADS)

Lévesque, D.; Bescond, C.; Lord, M.; Cao, X.; Wanjara, P.; Monchalin, J.-P.

2016-02-01

Additive manufacturing is a novel technology of high importance for global sustainability of resources. As additive manufacturing involves typically layer-by-layer fusion of the feedstock (wire or powder), an important characteristic of the fabricated metallic structural parts, such as those used in aero-engines, is the performance, which is highly related to the presence of defects, such as cracks, lack of fusion or bonding between layers, and porosity. For this purpose, laser ultrasonics is very attractive due to its non-contact nature and is especially suited for the analysis of parts of complex geometries. In addition, the technique is well adapted to online implementation and real-time measurement during the manufacturing process. The inspection can be performed from either the top deposited layer or the underside of the substrate and the defects can be visualized using laser ultrasonics combined with the synthetic aperture focusing technique (SAFT). In this work, a variety of results obtained off-line on INCONEL® 718 and Ti-6Al-4V coupons that were manufactured using laser powder, laser wire, or electron beam wire deposition are reported and most defects detected were further confirmed by X-ray micro-computed tomography.

Sustainable Materials Management (SMM) Electronics Challenge

EPA Pesticide Factsheets

Learn how the SMM Electronics Challenge encourage electronic manufacturers to strive to send 100 percent of the used electronics they collect from the public and retailers to certified electronics refurbishers and recyclers.

75 FR 4344 - Foreign-Trade Zone 22-Chicago, IL Application for Temporary/Interim Manufacturing Authority LG...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-01-27

... DEPARTMENT OF COMMERCE Foreign-Trade Zones Board [Docket T-1-2010] Foreign-Trade Zone 22--Chicago, IL Application for Temporary/ Interim Manufacturing Authority LG Electronics MobileComm USA, Inc... Electronics MobileComm USA, Inc. (LGEMU) facility, located in Bolingbrook, Illinois. The application was filed...

77 FR 16158 - Current Good Manufacturing Practice in Manufacturing, Processing, Packing, or Holding of Drugs...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-03-20

... ``cut'' from a sheet or roll of labels--is used. Persistent problems with drug product mislabeling and... believe that development and use of advanced code scanning equipment has made many current electronic... and other advanced scanning techniques have made current electronic systems reliable to the 100...

Highly-stretchable 3D-architected Mechanical Metamaterials

PubMed Central

Jiang, Yanhui; Wang, Qiming

2016-01-01

Soft materials featuring both 3D free-form architectures and high stretchability are highly desirable for a number of engineering applications ranging from cushion modulators, soft robots to stretchable electronics; however, both the manufacturing and fundamental mechanics are largely elusive. Here, we overcome the manufacturing difficulties and report a class of mechanical metamaterials that not only features 3D free-form lattice architectures but also poses ultrahigh reversible stretchability (strain > 414%), 4 times higher than that of the existing counterparts with the similar complexity of 3D architectures. The microarchitected metamaterials, made of highly stretchable elastomers, are realized through an additive manufacturing technique, projection microstereolithography, and its postprocessing. With the fabricated metamaterials, we reveal their exotic mechanical behaviors: Under large-strain tension, their moduli follow a linear scaling relationship with their densities regardless of architecture types, in sharp contrast to the architecture-dependent modulus power-law of the existing engineering materials; under large-strain compression, they present tunable negative-stiffness that enables ultrahigh energy absorption efficiencies. To harness their extraordinary stretchability and microstructures, we demonstrate that the metamaterials open a number of application avenues in lightweight and flexible structure connectors, ultraefficient dampers, 3D meshed rehabilitation structures and stretchable electronics with designed 3D anisotropic conductivity. PMID:27667638

TiN coated aluminum electrodes for DC high voltage electron guns

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mamun, Md Abdullah A.; Elmustafa, Abdelmageed A.; Taus, Rhys

Preparing electrodes made of metals like stainless steel, for use inside DC high voltage electron guns, is a labor-intensive and time-consuming process. In this paper, the authors report the exceptional high voltage performance of aluminum electrodes coated with hard titanium nitride (TiN). The aluminum electrodes were comparatively easy to manufacture and required only hours of mechanical polishing using silicon carbide paper, prior to coating with TiN by a commercial vendor. The high voltage performance of three TiN-coated aluminum electrodes, before and after gas conditioning with helium, was compared to that of bare aluminum electrodes, and electrodes manufactured from titanium alloymore » (Ti-6AI-4V). Following gas conditioning, each TiN-coated aluminum electrode reached -225 kV bias voltage while generating less than 100 pA of field emission (<10 pA) using a 40 mm cathode/anode gap, corresponding to field strength of 13.7 MV/m. Smaller gaps were studied to evaluate electrode performance at higher field strength with the best performing TiN-coated aluminum electrode reaching ~22.5 MV/m with field emission less than 100 pA. These results were comparable to those obtained from our best-performing electrodes manufactured from stainless steel, titanium alloy and niobium, as reported in references cited below. The TiN coating provided a very smooth surface and with mechanical properties of the coating (hardness and modulus) superior to those of stainless steel, titanium-alloy, and niobium electrodes. These features likely contributed to the improved high voltage performance of the TiN-coated aluminum electrodes.« less

TiN coated aluminum electrodes for DC high voltage electron guns

DOE PAGES

Mamun, Md Abdullah A.; Elmustafa, Abdelmageed A.; Taus, Rhys; ...

2015-05-01

Preparing electrodes made of metals like stainless steel, for use inside DC high voltage electron guns, is a labor-intensive and time-consuming process. In this paper, the authors report the exceptional high voltage performance of aluminum electrodes coated with hard titanium nitride (TiN). The aluminum electrodes were comparatively easy to manufacture and required only hours of mechanical polishing using silicon carbide paper, prior to coating with TiN by a commercial vendor. The high voltage performance of three TiN-coated aluminum electrodes, before and after gas conditioning with helium, was compared to that of bare aluminum electrodes, and electrodes manufactured from titanium alloymore » (Ti-6AI-4V). Following gas conditioning, each TiN-coated aluminum electrode reached -225 kV bias voltage while generating less than 100 pA of field emission (<10 pA) using a 40 mm cathode/anode gap, corresponding to field strength of 13.7 MV/m. Smaller gaps were studied to evaluate electrode performance at higher field strength with the best performing TiN-coated aluminum electrode reaching ~22.5 MV/m with field emission less than 100 pA. These results were comparable to those obtained from our best-performing electrodes manufactured from stainless steel, titanium alloy and niobium, as reported in references cited below. The TiN coating provided a very smooth surface and with mechanical properties of the coating (hardness and modulus) superior to those of stainless steel, titanium-alloy, and niobium electrodes. These features likely contributed to the improved high voltage performance of the TiN-coated aluminum electrodes.« less

Logistics for the implementation of lead-free solders on electronic assemblies

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vianco, P.T.; Artaki, I.

1993-12-31

The prospects of legislative and regulatory action aimed at taxing, restricting or banning lead-bearing materials from manufactured products has prompted the electronics community to examine the implementation of lead-free solders to replace currently used lead-containing alloys in the manufacture of electronic devices and assemblies. The logistics for changing the well established ``tin-lead solder technology`` require not only the selection of new compositions but also the qualification of different surface finishes and manufacturing processes. The meniscometer/wetting balance technique was used to evaluate the wettability of several candidate lead-free solders as well as to establish windows on processing parameters so as tomore » facilitate prototype manufacturing. Electroplated and electroless 100Sn coatings, as well as organic preservatives, were also examined as potential alternative finishes for device leads and terminations as well as circuit board conductor surfaces to replace traditional tin-lead layers. Sandia National Laboratories and AT&T have implemented a program to qualify the manufacturing feasibility of surface mount prototype circuit boards using several commercial lead-free solders by infrared reflow technology.« less

Laboratory directed research and development annual report 2004.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Not Available

This report summarizes progress from the Laboratory Directed Research and Development (LDRD) program during fiscal year 2004. In addition to a programmatic and financial overview, the report includes progress reports from 352 individual R and D projects in 15 categories. The 15 categories are: (1) Advanced Concepts; (2) Advanced Manufacturing; (3) Biotechnology; (4) Chemical and Earth Sciences; (5) Computational and Information Sciences; (6) Differentiating Technologies; (7) Electronics and Photonics; (8) Emerging Threats; (9) Energy and Critical Infrastructures; (10) Engineering Sciences; (11) Grand Challenges; (12) Materials Science and Technology; (13) Nonproliferation and Materials Control; (14) Pulsed Power and High Energy Densitymore » Sciences; and (15) Corporate Objectives.« less

76 FR 60124 - Tesla Motors, Inc.; Grant of Petition for Temporary Exemption From the Electronic Stability...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-09-28

... intended its manufacturing and production line workers to complete manufacture of the remaining Roadsters... many Roadster manufacturing employees to the production operations for the Model S, and that it... additional 80 vehicles covered by its exemption request, Tesla's production and manufacturing would have a...

75 FR 76011 - Annual Guidance Agenda

Federal Register 2010, 2011, 2012, 2013, 2014

2010-12-07

... Section 522 of the Federal Food, Drug, and Cosmetic Act Electronic Registration and Listing Manufacturing..., CFSAN (HFS- Manufacturing Process Changes, 205), Food and Drug Including Emerging Technologies, on... Chemistry, Manufacturing, Veterinary Medicine (HFV-140), and Controls Information. Food and Drug...

Warning Statements and Safety Practices among Manufacturers and Distributors of Electronic Cigarette Liquids in the United States.

PubMed

Fagan, Pebbles; Pokhrel, Pallav; Herzog, Thaddeus A; Guy, Mignonne C; Sakuma, Kari-Lyn K; Trinidad, Dennis R; Cassel, Kevin; Jorgensen, Dorothy; Lynch, Tania; Felicitas-Perkins, Jamie Q; Palafox, Sherilyn; Hamamura, Faith; Maloney, Sarah; Degree, Kaylah; Sterling, Kymberle; Moolchan, Eric; Clanton, Mark S; Eissenberg, Thomas

2017-05-18

Prior to the Food and Drug Administration's (FDA) regulation of electronic cigarettes and warning statements related to nicotine addiction, there was no critical examination of manufacturer/distributor voluntary practices that could potentially inform FDA actions aimed to protect consumers. This study examined the content of warning statements and safety characteristics of electronic cigarette liquid bottles using a national sample. Research staff randomly selected four electronic cigarette liquid manufacturers/distributors from four U.S. geographic regions. Staff documented the characteristics of product packaging and content of warning statements on 147 electronic cigarette liquids (0-30 mg/ml of nicotine) purchased online from 16 manufacturers/distributors in April of 2016. Data showed that 97.9% of the electronic cigarette liquid bottles included a warning statement, most of which focused on nicotine exposure rather than health. Only 22.4% of bottles used a warning statement that indicated the product "contained nicotine". Of bottles that advertised a nicotine-based concentration of 12 mg/ml, 26% had a warning statements stated that the product "contains nicotine". None of the statements that indicated that the product "contained nicotine" stated that nicotine was "addictive". All bottles had a safety cap and 12% were in plastic shrink-wrap. Fifty-six percent of the websites had a minimum age requirement barrier that prevented under-aged persons from entering. Most manufacturers/distributors printed a warning statement on electronic cigarette liquid bottles, but avoided warning consumers about the presence and the addictiveness of nicotine. Studies are needed to examine manufacturer/distributor modifications to product packaging and how packaging affects consumer behaviors. These data can inform future FDA requirements related to the packaging and advertising of e-cigarette liquids; regulation related to the content of warning statements, including exposure warning statements, which are not currently mandated; and requirements on websites or language on packaging to help manufacturers adhere to the minimum age of purchase regulation. The data can also be used to help FDA develop additional guidance on the framing of statements on packaging that helps consumers make informed decisions about purchasing the product or protecting young people from use or unintentional exposure to the product. © The Author 2017. Published by Oxford University Press on behalf of the Society for Research on Nicotine and Tobacco. All rights reserved. For permissions, please e-mail: journals.permissions@oup.com.

Carbon footprint of electronic devices

NASA Astrophysics Data System (ADS)

Sloma, Marcin

2013-07-01

Paper assesses the greenhouse gas emissions related to the electronic sectors including information and communication technology and media sectors. While media often presents the carbon emission problem of other industries like petroleum industry, the airlines and automobile sectors, plastics and steel manufacturers, the electronics industry must include the increasing carbon footprints caused from their applications like media and entertainment, computers and cooling devices, complex telecommunications networks, cloud computing and powerful mobile phones. In that sense greenhouse gas emission of electronics should be studied in a life cycle perspective, including regular operational electricity use. Paper presents which product groups or processes are major contributors in emission. From available data and extrapolation of existing information we know that the information and communication technology sector produced 1.3% and media sector 1.7% of global gas emissions within production cycle, using the data from 2007.In the same time global electricity use of that sectors was 3.9% and 3.2% respectively. The results indicate that for both sectors operation leads to more gas emissions than manufacture, although impacts from the manufacture is significant, especially in the supply chain. Media electronics led to more emissions than PCs (manufacture and operation). Examining the role of electronics in climate change, including disposal of its waste, will enable the industry to take internal actions, leading to lowering the impact on the climate change within the sector itself.

Additive manufacturing method for SRF components of various geometries

DOEpatents

Rimmer, Robert; Frigola, Pedro E; Murokh, Alex Y

2015-05-05

An additive manufacturing method for forming nearly monolithic SRF niobium cavities and end group components of arbitrary shape with features such as optimized wall thickness and integral stiffeners, greatly reducing the cost and technical variability of conventional cavity construction. The additive manufacturing method for forming an SRF cavity, includes atomizing niobium to form a niobium powder, feeding the niobium powder into an electron beam melter under a vacuum, melting the niobium powder under a vacuum in the electron beam melter to form an SRF cavity; and polishing the inside surface of the SRF cavity.

Final Technical Report - 300°C Capable Electronics Platform and Temperature Sensor System For Enhanced Geothermal Systems

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chen, Cheng-Po; Shaddock, David; Sandvik, Peter

2012-11-30

A silicon carbide (SiC) based electronic temperature sensor prototype has been demonstrated to operate at 300°C. We showed continuous operation of 1,000 hours with SiC operational amplifier and surface mounted discreet resistors and capacitors on a ceramic circuit board. This feasibility demonstration is a major milestone in the development of high temperature electronics in general and high temperature geothermal exploration and well management tools in particular. SiC technology offers technical advantages that are not found in competing technologies such as silicon-on-insulator (SOI) at high temperatures of 200°C to 300°C and beyond. The SiC integrated circuits and packaging methods can bemore » used in new product introduction by GE Oil and Gas for high temperature down-hole tools. The existing SiC fabrication facility at GE is sufficient to support the quantities currently demanded by the marketplace, and there are other entities in the United States and other countries capable of ramping up SiC technology manufacturing. The ceramic circuit boards are different from traditional organic-based electronics circuit boards, but the fabrication process is compatible with existing ceramic substrate manufacturing. This project has brought high temperature electronics forward, and brings us closer to commercializing tools that will enable and reduce the cost of enhanced geothermal technology to benefit the public in terms of providing clean renewable energy at lower costs.« less

Assembling surface mounted components on ink-jet printed double sided paper circuit board.

PubMed

Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

2014-03-07

Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

21 CFR 1304.31 - Reports from manufacturers importing narcotic raw material.

Code of Federal Regulations, 2010 CFR

2010-04-01

... 21 Food and Drugs 9 2010-04-01 2010-04-01 false Reports from manufacturers importing narcotic raw... RECORDS AND REPORTS OF REGISTRANTS Reports § 1304.31 Reports from manufacturers importing narcotic raw material. (a) Every manufacturer which imports or manufactures from narcotic raw material (opium, poppy...

21 CFR 1304.31 - Reports from manufacturers importing narcotic raw material.

Code of Federal Regulations, 2011 CFR

2011-04-01

... 21 Food and Drugs 9 2011-04-01 2011-04-01 false Reports from manufacturers importing narcotic raw... RECORDS AND REPORTS OF REGISTRANTS Reports § 1304.31 Reports from manufacturers importing narcotic raw material. (a) Every manufacturer which imports or manufactures from narcotic raw material (opium, poppy...

21 CFR 1304.32 - Reports of manufacturers importing coca leaves.

Code of Federal Regulations, 2011 CFR

2011-04-01

... 21 Food and Drugs 9 2011-04-01 2011-04-01 false Reports of manufacturers importing coca leaves... AND REPORTS OF REGISTRANTS Reports § 1304.32 Reports of manufacturers importing coca leaves. (a) Every manufacturer importing or manufacturing from raw coca leaves shall submit information accounting for the...

21 CFR 1304.32 - Reports of manufacturers importing coca leaves.

Code of Federal Regulations, 2013 CFR

2013-04-01

... 21 Food and Drugs 9 2013-04-01 2013-04-01 false Reports of manufacturers importing coca leaves... AND REPORTS OF REGISTRANTS Reports § 1304.32 Reports of manufacturers importing coca leaves. (a) Every manufacturer importing or manufacturing from raw coca leaves shall submit information accounting for the...

21 CFR 1304.32 - Reports of manufacturers importing coca leaves.

Code of Federal Regulations, 2012 CFR

2012-04-01

... 21 Food and Drugs 9 2012-04-01 2012-04-01 false Reports of manufacturers importing coca leaves... AND REPORTS OF REGISTRANTS Reports § 1304.32 Reports of manufacturers importing coca leaves. (a) Every manufacturer importing or manufacturing from raw coca leaves shall submit information accounting for the...

21 CFR 1304.32 - Reports of manufacturers importing coca leaves.

Code of Federal Regulations, 2014 CFR

2014-04-01

... 21 Food and Drugs 9 2014-04-01 2014-04-01 false Reports of manufacturers importing coca leaves... AND REPORTS OF REGISTRANTS Reports § 1304.32 Reports of manufacturers importing coca leaves. (a) Every manufacturer importing or manufacturing from raw coca leaves shall submit information accounting for the...

Global industry status report and roadmap for high performance displays

NASA Astrophysics Data System (ADS)

Bardsley, J. Norman; Pinnel, M. Robert

2003-09-01

A summary is provided of a comprehensive industry status report and roadmap available from www.usdc.org. Continued improvements in LCD technology are being driven by home entertainment applications, leading to better color and video response. Competing technologies, such as PDP and OLED and electronic paper must either exploit inherent advantages for such applications or focus on other market niches that are not being addressed well by mainline LCD technology. Flexible displays provide an opportunity for innovative technologies and manufacturing methods, but appear to bring no killer applications.

Thermal imaging for assessment of electron-beam freeform fabrication (EBF3) additive manufacturing deposits

NASA Astrophysics Data System (ADS)

Zalameda, Joseph N.; Burke, Eric R.; Hafley, Robert A.; Taminger, Karen M.; Domack, Christopher S.; Brewer, Amy; Martin, Richard E.

2013-05-01

Additive manufacturing is a rapidly growing field where 3-dimensional parts can be produced layer by layer. NASA's electron beam freeform fabrication (EBF3) technology is being evaluated to manufacture metallic parts in a space environment. The benefits of EBF3 technology are weight savings to support space missions, rapid prototyping in a zero gravity environment, and improved vehicle readiness. The EBF3 system is composed of 3 main components: electron beam gun, multi-axis position system, and metallic wire feeder. The electron beam is used to melt the wire and the multi-axis positioning system is used to build the part layer by layer. To insure a quality deposit, a near infrared (NIR) camera is used to image the melt pool and solidification areas. This paper describes the calibration and application of a NIR camera for temperature measurement. In addition, image processing techniques are presented for deposit assessment metrics.

Initiatives and outcomes of green supply chain management implementation by Chinese manufacturers.

PubMed

Zhu, Qinghua; Sarkis, Joseph; Lai, Kee-hung

2007-10-01

This paper aims to explore the green supply chain management (GSCM) initiatives (implementation) of various manufacturing industrial sectors in China and examine the links between GSCM initiatives and performance outcomes. We conducted a survey to collect data from four typical manufacturing industrial sectors in China, namely, power generating, chemical/petroleum, electrical/electronic and automobile, and received 171 valid organizational responses for data analysis. Analysis of variance (ANOVA) was used to analyze the data. The results are consistent with our prediction that the different manufacturing industry types display different levels of GSCM implementation and outcomes. We specifically found that the electrical/electronic industry has relatively higher levels of GSCM implementation and achieves better performance outcomes than the other three manufacturer types. Implications of the results are discussed and suggestions for further research on the implementation of GSCM are offered.

JPRS Report Science & Technology Japan

DTIC Science & Technology

1989-10-20

plant callus o Adaptation of protozoans to microgravity o Fertilization and embryogeny of newt in space o Fertilization and embryogeny of sea urchin ...for by the mining and manufacturing branch. Moreover, about 50 percent of the energy consumed is exhausted to air, river, sea , etc., as waste heat...Cross section of substrate Figure 6. Photo of Cross Section of Coating Film Taken by Scanning Electron Microscope ( SEM ) It was heated for 60 hours

Public-private partnerships in the Canadian environment: options for hospital pharmacies.

PubMed

Uddin, Z; Bear, R A

1997-01-01

This brief report explores the direction being pursued by hospitals interested in outsourcing non-core activities within the pharmacy department. Private sector logistics companies are looking to position themselves in the drug product supply chain to facilitate seamless transfers of drug products, ordering information and payments between drug manufacturers and hospitals. Opportunities for implementing consolidated purchasing, unit dosing, just-in-time inventory and electronic commerce systems are discussed.

An Assessment of the Science and Technology Predictions in the Army’s STAR21 Report

DTIC Science & Technology

2008-07-01

electronics, optics, and photonics; aeromechanics; molecular genetics ; clinical medicine ; atmospheric sciences; and terrain sciences. Both the Navy and the...for medical diagnostics, functional materials, and manufacturing at the nano-scale. There were a few serious misses, such as significant developments...overstatement. The predictions for vaccines and medicines are right. The study did not mention the key interactions between biomolecules and their

Recent progress in printed 2/3D electronic devices

NASA Astrophysics Data System (ADS)

Klug, Andreas; Patter, Paul; Popovic, Karl; Blümel, Alexander; Sax, Stefan; Lenz, Martin; Glushko, Oleksandr; Cordill, Megan J.; List-Kratochvil, Emil J. W.

2015-09-01

New, energy-saving, efficient and cost-effective processing technologies such as 2D and 3D inkjet printing (IJP) for the production and integration of intelligent components will be opening up very interesting possibilities for industrial applications of molecular materials in the near future. Beyond the use of home and office based printers, "inkjet printing technology" allows for the additive structured deposition of photonic and electronic materials on a wide variety of substrates such as textiles, plastics, wood, stone, tiles or cardboard. Great interest also exists in applying IJP in industrial manufacturing such as the manufacturing of PCBs, of solar cells, printed organic electronics and medical products. In all these cases inkjet printing is a flexible (digital), additive, selective and cost-efficient material deposition method. Due to these advantages, there is the prospect that currently used standard patterning processes can be replaced through this innovative material deposition technique. A main issue in this research area is the formulation of novel functional inks or the adaptation of commercially available inks for specific industrial applications and/or processes. In this contribution we report on the design, realization and characterization of novel active and passive inkjet printed electronic devices including circuitry and sensors based on metal nanoparticle ink formulations and the heterogeneous integration into 2/3D printed demonstrators. The main emphasis of this paper will be on how to convert scientific inkjet knowledge into industrially relevant processes and applications.

Study of metal whiskers growth and mitigation technique using additive manufacturing

NASA Astrophysics Data System (ADS)

Gullapalli, Vikranth

For years, the alloy of choice for electroplating electronic components has been tin-lead (Sn-Pb) alloy. However, the legislation established in Europe on July 1, 2006, required significant lead (Pb) content reductions from electronic hardware due to its toxic nature. A popular alternative for coating electronic components is pure tin (Sn). However, pure tin has the tendency to spontaneously grow electrically conductive Sn whisker during storage. Sn whisker is usually a pure single crystal tin with filament or hair-like structures grown directly from the electroplated surfaces. Sn whisker is highly conductive, and can cause short circuits in electronic components, which is a very significant reliability problem. The damages caused by Sn whisker growth are reported in very critical applications such as aircraft, spacecraft, satellites, and military weapons systems. They are also naturally very strong and are believed to grow from compressive stresses developed in the Sn coating during deposition or over time. The new directive, even though environmentally friendly, has placed all lead-free electronic devices at risk because of whisker growth in pure tin. Additionally, interest has occurred about studying the nature of other metal whiskers such as zinc (Zn) whiskers and comparing their behavior to that of Sn whiskers. Zn whiskers can be found in flooring of data centers which can get inside electronic systems during equipment reorganization and movement and can also cause systems failure. Even though the topic of metal whiskers as reliability failure has been around for several decades to date, there is no successful method that can eliminate their growth. This thesis will give further insights towards the nature and behavior of Sn and Zn whiskers growth, and recommend a novel manufacturing technique that has potential to mitigate metal whiskers growth and extend life of many electronic devices.

All-printed smart structures: a viable option?

NASA Astrophysics Data System (ADS)

O'Donnell, John; Ahmadkhanlou, Farzad; Yoon, Hwan-Sik; Washington, Gregory

2014-03-01

The last two decades have seen evolution of smart materials and structures technologies from theoretical concepts to physical realization in many engineering fields. These include smart sensors and actuators, active damping and vibration control, biomimetics, and structural health monitoring. Recently, additive manufacturing technologies such as 3D printing and printed electronics have received attention as methods to produce 3D objects or electronic components for prototyping or distributed manufacturing purposes. In this paper, the viability of manufacturing all-printed smart structures, with embedded sensors and actuators, will be investigated. To this end, the current 3D printing and printed electronics technologies will be reviewed first. Then, the plausibility of combining these two different additive manufacturing technologies to create all-printed smart structures will be discussed. Potential applications for this type of all-printed smart structures include most of the traditional smart structures where sensors and actuators are embedded or bonded to the structures to measure structural response and cause desired static and dynamic changes in the structure.

Evaluation of adverse drug event information in US manufacturer labels.

PubMed

Harrington, Catherine A; Garcia, Angela S; Sircar-Ramsewak, Feroza

2011-02-01

Pharmaceutical manufacturer labels are an important source of adverse drug event (ADE) information. The study objective was to determine the sufficiency of ADE reporting in US drug labels. A sample of 50 labels was evaluated from the top 200 drugs dispensed in the US. Electronic copies of labels were obtained and reviewed by 2 pharmacists for ADE incidence and discontinuation data. ADE incidence data were provided in 86% of labels. However, discontinuation rates due to ADEs and ADE incidence by dose were only reported in 60%. ADE incidence reporting by age (46%) or gender (18%) was also low. ADEs that occurred in less than 2% of the population were rarely reported. Incidence rates were based on small populations (median of 794) and short term studies (median of 84 days for chronic conditions). Labels for 19 drugs used chronically had no long term study data. Methods for collecting ADE data were stated in only 12% of labels. Adverse drug event and drug discontinuation data is under-reported in US labels. More information on adverse events causing discontinuation (especially serious events) and those related to dose, age, and gender is needed in labels to ensure safe prescribing and dispensing of drugs.

75 FR 20837 - Agency Information Collection Activities; Submission to OMB for Review and Approval; Comment...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-04-21

... Approval; Comment Request; NESHAP for Magnetic Tape Manufacturing Operations AGENCY: Environmental... electronic docket, go to http://www.regulations.gov . Title: NESHAP for Magnetic Tape Manufacturing.../Affected Entities: Magnetic tape manufacturing operations. Estimated Number of Respondents: 6. Frequency of...

2001 Industry Studies: Electronics

DTIC Science & Technology

2001-01-01

Center, Dallas, TX Northrop Grumman Corp, Electronic Sensors & Systems, Baltimore, MD International Acer Incorporated, Hsin Chu, Taiwan Aerospace...manufacturing. Many of the large-scale fabrication foundries are offshore in such countries as Taiwan, Singapore and Malaysia .5 - 5 - The largest market for...done in the US. However, more of the actual mass manufacturing of the chips are done in Taiwan, Singapore, and Malaysia . A new semiconductor facility

A Manufacturing Cost and Supply Chain Analysis of SiC Power Electronics Applicable to Medium-Voltage Motor Drives

DOE Office of Scientific and Technical Information (OSTI.GOV)

Horowitz, Kelsey; Remo, Timothy; Reese, Samantha

Wide bandgap (WBG) semiconductor devices are increasingly being considered for use in certain power electronics applications, where they can improve efficiency, performance, footprint, and, potentially, total system cost compared to systems using traditional silicon (Si) devices. Silicon carbide (SiC) devices in particular -- which are currently more mature than other WBG devices -- are poised for growth in the coming years. Today, the manufacturing of SiC wafers is concentrated in the United States, and chip production is split roughly equally between the United States, Japan, and Europe. Established contract manufacturers located throughout Asia typically carry out manufacturing of WBG powermore » modules. We seek to understand how global manufacturing of SiC components may evolve over time by illustrating the regional cost drivers along the supply chain and providing an overview of other factors that influence where manufacturing is sited. We conduct this analysis for a particular case study where SiC devices are used in a medium-voltage motor drive.« less

40 CFR Appendix A to Part 122 - NPDES Primary Industry Categories

Code of Federal Regulations, 2013 CFR

2013-07-01

... coating Copper forming Electrical and electronic components Electroplating Explosives manufacturing... chemicals manufacturing Paint and ink formulation Pesticides Petroleum refining Pharmaceutical preparations...

40 CFR Appendix A to Part 122 - NPDES Primary Industry Categories

Code of Federal Regulations, 2012 CFR

2012-07-01

... coating Copper forming Electrical and electronic components Electroplating Explosives manufacturing... chemicals manufacturing Paint and ink formulation Pesticides Petroleum refining Pharmaceutical preparations...

40 CFR Appendix A to Part 122 - NPDES Primary Industry Categories

Code of Federal Regulations, 2014 CFR

2014-07-01

... coating Copper forming Electrical and electronic components Electroplating Explosives manufacturing... chemicals manufacturing Paint and ink formulation Pesticides Petroleum refining Pharmaceutical preparations...

40 CFR Appendix A to Part 122 - NPDES Primary Industry Categories

Code of Federal Regulations, 2011 CFR

2011-07-01

... coating Copper forming Electrical and electronic components Electroplating Explosives manufacturing... chemicals manufacturing Paint and ink formulation Pesticides Petroleum refining Pharmaceutical preparations...

Measurements of material properties for solar cells. [aluminum film and KAPTON

NASA Technical Reports Server (NTRS)

Castle, J. G., Jr.

1978-01-01

Measurements on two candidate materials for space flight are reported. The observed optical transmittance of aluminum films vapor deposited on fused quartz showed anomalously high transmittance thru 400 A and 600 A and showed an effective skin depth of 110 A in the latter part of the 1000 A thickness. KAPTON films are shown by their optical transmission spectra to have an energy gap for electron excitation of approximately 2.5 eV, which value depends on the thickness as manufactured. The resistance of KAPTON film to ionizing radiation is described by their optical spectra and their electron spin resonance spectra.

The gallium melting-point standard: its role in manufacture and quality control of electronic thermometers for the clinical laboratory.

PubMed

Sostman, H E

1977-01-01

I discuss the traceability of calibration of electronic thermometers to thermometric constants of nature or to the National Bureau of Standards, form a manufacturer's basic standards through the manufacturing process to the user's laboratory. Useful electrical temperature sensors, their advantages, and means for resolving their disadvantages are described. I summarize our development of a cell for realizing the melting phase equilibrium of pure gallium (at 29.770 degrees C) as a thermometer calibration fixed point, and enumerate its advantages in the routine calibration verification of electrical thermometers in the clinical chemistry laboratory.

Electron beam curing — taking good ideas to the manufacturing floor

NASA Astrophysics Data System (ADS)

Saunders, C.; Lopata, V.; Barnard, J.; Stepanik, T.

2000-03-01

Acsion is exploiting several emerging electron beam EB applications ranging from composite curing and repair to viscose manufacturing. EB curing of composite structures offers several advantages: significantly reduced curing times; improvements in part quality and performance; reduced environmental and health concerns; improvements in material handling; and reduced overall manufacturing costs compared to thermal curing. The aerospace industry is developing EB technology in all of their market sectors, including military aviation and space products. Some specific products include cryogenic fuel tanks, improved canopy frames for jet aircraft, and the all-composite military aircraft. This paper discusses each of these opportunities.

5 CFR 532.267 - Special wage schedules for aircraft, electronic, and optical instrument overhaul and repair...

Code of Federal Regulations, 2011 CFR

2011-01-01

... Industry Classification System (NAICS) codes: 2007 NAICS codes 2007 NAICS industry titles 3341 Computer and peripheral equipment manufacturing. 33422 Radio and television broadcasting and wireless communications equipment manufacturing. 33429 Other communications equipment manufacturing. 3343 Audio and video equipment...

5 CFR 532.267 - Special wage schedules for aircraft, electronic, and optical instrument overhaul and repair...

Code of Federal Regulations, 2012 CFR

2012-01-01

... Industry Classification System (NAICS) codes: 2007 NAICS codes 2007 NAICS industry titles 3341 Computer and peripheral equipment manufacturing. 33422 Radio and television broadcasting and wireless communications equipment manufacturing. 33429 Other communications equipment manufacturing. 3343 Audio and video equipment...

5 CFR 532.267 - Special wage schedules for aircraft, electronic, and optical instrument overhaul and repair...

Code of Federal Regulations, 2013 CFR

2013-01-01

... Industry Classification System (NAICS) codes: 2007 NAICS codes 2007 NAICS industry titles 3341 Computer and peripheral equipment manufacturing. 33422 Radio and television broadcasting and wireless communications equipment manufacturing. 33429 Other communications equipment manufacturing. 3343 Audio and video equipment...

75 FR 59710 - Agency Information Collection Activities; Submission to OMB for Review and Approval; Comment...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-09-28

... Approval; Comment Request; Aerospace Manufacturing and Rework Industry Information Collection AGENCY... electronic docket, go to http://www.regulations.gov . Title: Aerospace Manufacturing and Rework Industry... manufacturing and rework facilities and has been tailored to the processes at aerospace facilities. Respondents...

Greening up Auto Part Manufacturing: A Collaboration between Academia and Industry

ERIC Educational Resources Information Center

Kneas, Kristi A.; Armstrong, Drew L.; Brank, Alice R.; Johnson, Amanda L.; Kissinger, Chelsea A.; Mabe, Adam R.; Sezer, Ozge; Fontinell, Mike

2009-01-01

Historically, manufacture of automotive electronic components and screen-printing of automotive instrument clusters at DENSO Manufacturing Tennessee, Inc. required washing of equipment such as screens, stencils, and jigs with sizable quantities of volatile organic compounds and hazardous air pollutants. Collaborative efforts between the Maryville…

TiN coated aluminum electrodes for DC high voltage electron guns

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mamun, Md Abdullah A.; Elmustafa, Abdelmageed A., E-mail: aelmusta@odu.edu; Taus, Rhys

Preparing electrodes made of metals like stainless steel, for use inside DC high voltage electron guns, is a labor-intensive and time-consuming process. In this paper, the authors report the exceptional high voltage performance of aluminum electrodes coated with hard titanium nitride (TiN). The aluminum electrodes were comparatively easy to manufacture and required only hours of mechanical polishing using silicon carbide paper, prior to coating with TiN by a commercial vendor. The high voltage performance of three TiN-coated aluminum electrodes, before and after gas conditioning with helium, was compared to that of bare aluminum electrodes, and electrodes manufactured from titanium alloymore » (Ti-6Al-4V). Following gas conditioning, each TiN-coated aluminum electrode reached −225 kV bias voltage while generating less than 100 pA of field emission (<10 pA) using a 40 mm cathode/anode gap, corresponding to field strength of 13.7 MV/m. Smaller gaps were studied to evaluate electrode performance at higher field strength with the best performing TiN-coated aluminum electrode reaching ∼22.5 MV/m with field emission less than 100 pA. These results were comparable to those obtained from our best-performing electrodes manufactured from stainless steel, titanium alloy and niobium, as reported in references cited below. The TiN coating provided a very smooth surface and with mechanical properties of the coating (hardness and modulus) superior to those of stainless steel, titanium-alloy, and niobium electrodes. These features likely contributed to the improved high voltage performance of the TiN-coated aluminum electrodes.« less

InP Transferred Electron Cathodes: Basic to Manufacturing Methods

DTIC Science & Technology

2007-08-29

Source: Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films ; January/February 2003; v.21, no.1, p.219-225 Optimization and...Vacuum, Surfaces and Films ; Sept/Oct 2007 V. 25, No. 5 List of papers submitted or published that acknowledge ARO support during this reporting period...technologies. Night vision devices gather existing ambient light (starlight, moonlight or infra-red light) through a front lens. This light goes into a

FY 1999 Laboratory Directed Research and Development annual report

DOE Office of Scientific and Technical Information (OSTI.GOV)

PJ Hughes

2000-06-13

A short synopsis of each project is given covering the following main areas of research and development: Atmospheric sciences; Biotechnology; Chemical and instrumentation analysis; Computer and information science; Design and manufacture engineering; Ecological science; Electronics and sensors; Experimental technology; Health protection and dosimetry; Hydrologic and geologic science; Marine sciences; Materials science; Nuclear science and engineering; Process science and engineering; Sociotechnical systems analysis; Statistics and applied mathematics; and Thermal and energy systems.

Lithography-based fabrication of nanopore arrays in freestanding SiN and graphene membranes

NASA Astrophysics Data System (ADS)

Verschueren, Daniel V.; Yang, Wayne; Dekker, Cees

2018-04-01

We report a simple and scalable technique for the fabrication of nanopore arrays on freestanding SiN and graphene membranes based on electron-beam lithography and reactive ion etching. By controlling the dose of the single-shot electron-beam exposure, circular nanopores of any size down to 16 nm in diameter can be fabricated in both materials at high accuracy and precision. We demonstrate the sensing capabilities of these nanopores by translocating dsDNA through pores fabricated using this method, and find signal-to-noise characteristics on par with transmission-electron-microscope-drilled nanopores. This versatile lithography-based approach allows for the high-throughput manufacturing of nanopores and can in principle be used on any substrate, in particular membranes made out of transferable two-dimensional materials.

Materials Frontiers to Empower Quantum Computing

DOE Office of Scientific and Technical Information (OSTI.GOV)

Taylor, Antoinette Jane; Sarrao, John Louis; Richardson, Christopher

This is an exciting time at the nexus of quantum computing and materials research. The materials frontiers described in this report represent a significant advance in electronic materials and our understanding of the interactions between the local material and a manufactured quantum state. Simultaneously, directed efforts to solve materials issues related to quantum computing provide an opportunity to control and probe the fundamental arrangement of matter that will impact all electronic materials. An opportunity exists to extend our understanding of materials functionality from electronic-grade to quantum-grade by achieving a predictive understanding of noise and decoherence in qubits and their originsmore » in materials defects and environmental coupling. Realizing this vision systematically and predictively will be transformative for quantum computing and will represent a qualitative step forward in materials prediction and control.« less

3D printing of highly elastic strain sensors using polyurethane/multiwall carbon nanotube composites

NASA Astrophysics Data System (ADS)

Christ, Josef F.; Hohimer, Cameron J.; Aliheidari, Nahal; Ameli, Amir; Mo, Changki; Pötschke, Petra

2017-04-01

As the desire for wearable electronics increases and the soft robotics industry advances, the need for novel sensing materials has also increased. Recently, there have been many attempts at producing novel materials, which exhibit piezoresistive behavior. However, one of the major shortcomings in strain sensing technologies is in the fabrication of such sensors. While there is significant research and literature covering the various methods for developing piezoresistive materials, fabricating complex sensor platforms is still a manufacturing challenge. Here, we report a facile method to fabricate multidirectional embedded strain sensors using additive manufacturing technology. Pure thermoplastic polyurethane (TPU) and TPU/multiwall carbon nanotubes (MWCNT) nanocomposites were 3D printed in tandem using a low-cost multi-material FDM printer to fabricate uniaxial and biaxial strain sensors with conductive paths embedded within the insulative TPU platform. The sensors were then subjected to a series of cyclic strain loads. The results revealed excellent piezoresistive responses of the sensors with cyclic repeatability in both the axial and transverse directions and in response to strains as high as 50%. Further, while strain-softening did occur in the embedded printed strain sensors, it was predictable and similar to the results found in the literature for bulk polymer nanocomposites. This works demonstrates the possibility of manufacturing embedded and multidirectional flexible strain sensors using an inexpensive and versatile method, with potential applications in soft robotics and flexible electronics and health monitoring.

A fully roll-to-roll gravure-printed carbon nanotube-based active matrix for multi-touch sensors

PubMed Central

Lee, Wookyu; Koo, Hyunmo; Sun, Junfeng; Noh, Jinsoo; Kwon, Kye-Si; Yeom, Chiseon; Choi, Younchang; Chen, Kevin; Javey, Ali; Cho, Gyoujin

2015-01-01

Roll-to-roll (R2R) printing has been pursued as a commercially viable high-throughput technology to manufacture flexible, disposable, and inexpensive printed electronic devices. However, in recent years, pessimism has prevailed because of the barriers faced when attempting to fabricate and integrate thin film transistors (TFTs) using an R2R printing method. In this paper, we report 20 × 20 active matrices (AMs) based on single-walled carbon nanotubes (SWCNTs) with a resolution of 9.3 points per inch (ppi) resolution, obtained using a fully R2R gravure printing process. By using SWCNTs as the semiconducting layer and poly(ethylene terephthalate) (PET) as the substrate, we have obtained a device yield above 98%, and extracted the key scalability factors required for a feasible R2R gravure manufacturing process. Multi-touch sensor arrays were achieved by laminating a pressure sensitive rubber onto the SWCNT-TFT AM. This R2R gravure printing system overcomes the barriers associated with the registration accuracy of printing each layer and the variation of the threshold voltage (Vth). By overcoming these barriers, the R2R gravure printing method can be viable as an advanced manufacturing technology, thus enabling the high-throughput production of flexible, disposable, and human-interactive cutting-edge electronic devices based on SWCNT-TFT AMs. PMID:26635237

Export of electronics equipment waste.

PubMed

LaDou, Joseph; Lovegrove, Sandra

2008-01-01

Electronics equipment waste ("e-waste") includes discarded computers, computer monitors, television sets, and cell phones. Less than 10% of e-waste is currently recycled. The United States and other developed countries export e-waste primarily to Asia, knowing it carries a real harm to the poor communities where it will be discarded. A 2006 directive bans the use of lead, mercury, cadmium, hexavalent chromium, and certain brominated flame retardants in most electronics products sold in the EU. A similar directive facilitates the development and design of clean electronics products with longer lifespans that are safe and easy to repair, upgrade, and recycle, and will not expose workers and the environment to hazardous chemicals. These useful approaches apply only regionally and cover only a fraction of the hazardous substances used in electronics manufacture, however. There is an urgent need for manufacturers of electronics products to take responsibility for their products from production to end-of-life, and for much tighter controls both on the transboundary movement of e-waste and on the manner in which it is recycled. Manufacturers must develop clean products with longer lifespans that are safe and easy to repair, upgrade, and recycle and will not expose workers and the environment to hazardous chemicals.

Practical 3D Printing of Antennas and RF Electronics

DTIC Science & Technology

2017-03-01

Passive RF; Combiners Introduction Additive manufacturing can reduce the time and material costs in a design cycle and enable the on-demand printing of...performance, and create Computer Assisted Manufacturing (CAM) files. By intelligently leveraging this process, the design can be readily updated or...advances in 3D printing technology now enable antennas and RF electronics to be designed and prototyped significantly faster than conventional

75 FR 23263 - Agency Information Collection Activities; Submission to OMB for Review and Approval; Comment...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-05-03

... Approval; Comment Request; NSPS for Lead Acid Battery Manufacturing (Renewal) AGENCY: Environmental... electronic docket, go to http://www.regulations.gov . Title: NSPS for Lead Acid Battery Manufacturing... Battery Manufacturing (40 CFR part 60, subpart KK) were proposed on January 14, 1980, and promulgated on...

49 CFR 577.7 - Time and manner of notification.

Code of Federal Regulations, 2010 CFR

2010-10-01

... by a motor vehicle manufacturer, by certified mail, verifiable electronic means such as receipts or... motor vehicle safety or a noncompliance exists. The Administrator may order a manufacturer to send the... notification required to be sent by a motor vehicle manufacturer, by first class mail to each person who is...

The Influence of As-Built Surface Conditions on Mechanical Properties of Ti-6Al-4V Additively Manufactured by Selective Electron Beam Melting

NASA Astrophysics Data System (ADS)

Sun, Y. Y.; Gulizia, S.; Oh, C. H.; Fraser, D.; Leary, M.; Yang, Y. F.; Qian, M.

2016-03-01

Achieving a high surface finish is a major challenge for most current metal additive manufacturing processes. We report the first quantitative study of the influence of as-built surface conditions on the tensile properties of Ti-6Al-4V produced by selective electron beam melting (SEBM) in order to better understand the SEBM process. Tensile ductility was doubled along with noticeable improvements in tensile strengths after surface modification of the SEBM-fabricated Ti-6Al-4V by chemical etching. The fracture surfaces of tensile specimens with different surface conditions were characterised and correlated with the tensile properties obtained. The removal of a 650- μm-thick surface layer by chemical etching was shown to be necessary to eliminate the detrimental influence of surface defects on mechanical properties. The experimental results and analyses underline the necessity to modify the surfaces of SEBM-fabricated components for structural applications, particularly for those components which contain complex internal concave and convex surfaces and channels.

Flexible strain sensors with high performance based on metallic glass thin film

NASA Astrophysics Data System (ADS)

Xian, H. J.; Cao, C. R.; Shi, J. A.; Zhu, X. S.; Hu, Y. C.; Huang, Y. F.; Meng, S.; Gu, L.; Liu, Y. H.; Bai, H. Y.; Wang, W. H.

2017-09-01

Searching strain sensitive materials for electronic skin is of crucial significance because of the restrictions of current materials such as poor electrical conductivity, large energy consumption, complex manufacturing process, and high cost. Here, we report a flexible strain sensor based on the Zr55Cu30Ni5Al10 metallic glass thin film which we name metallic glass skin. The metallic glass skin, synthesized by ion beam deposition, exhibits piezoresistance effects with a gauge factor of around 2.86, a large detectable strain range (˜1% or 180° bending angle), and good conductivity. Compared to other e-skin materials, the temperature coefficient of resistance of the metallic glass skin is extremely low (9.04 × 10-6 K-1), which is essential for the reduction in thermal drift. In addition, the metallic glass skin exhibits distinct antibacterial behavior desired for medical applications, also excellent reproducibility and repeatability (over 1000 times), nearly perfect linearity, low manufacturing cost, and negligible energy consumption, all of which are required for electronic skin for practical applications.

Design And Implementation Of Integrated Vision-Based Robotic Workcells

NASA Astrophysics Data System (ADS)

Chen, Michael J.

1985-01-01

Reports have been sparse on large-scale, intelligent integration of complete robotic systems for automating the microelectronics industry. This paper describes the application of state-of-the-art computer-vision technology for manufacturing of miniaturized electronic components. The concepts of FMS - Flexible Manufacturing Systems, work cells, and work stations and their control hierarchy are illustrated in this paper. Several computer-controlled work cells used in the production of thin-film magnetic heads are described. These cells use vision for in-process control of head-fixture alignment and real-time inspection of production parameters. The vision sensor and other optoelectronic sensors, coupled with transport mechanisms such as steppers, x-y-z tables, and robots, have created complete sensorimotor systems. These systems greatly increase the manufacturing throughput as well as the quality of the final product. This paper uses these automated work cells as examples to exemplify the underlying design philosophy and principles in the fabrication of vision-based robotic systems.

EUV patterning improvement toward high-volume manufacturing

NASA Astrophysics Data System (ADS)

Kuwahara, Yuhei; Matsunaga, Koichi; Kawakami, Shinichiro; Nafus, Kathleen; Foubert, Philippe; Goethals, Anne-Marie

2015-03-01

Extreme ultraviolet lithography (EUVL) technology is a promising candidate for a semiconductor process for 18nm half pitch and beyond. So far, the studies of EUV for manufacturability have been focused on particular aspects. It still requires fine resolution, uniform and smooth patterns, and low defectivity, not only after lithography but also after the etch process. Tokyo Electron Limited and imec are continuously collaborating to improve manufacturing quality of the process of record (POR) on a CLEAN TRACKTM LITHIUS ProTMZ-EUV. This next generation coating/developing system has been upgraded with defectivity reduction enhancements which are applied along with TELTM best known methods. We have evaluated process defectivity post lithography and post etch. Apart from defectivity, FIRMTM rinse material and application compatibility with sub 18nm patterning is improved to prevent line pattern collapse and increase process window on next generation resist materials. This paper reports on the progress of defectivity and patterning performance optimization towards the NXE:3300 POR.

Design and research on the platform of network manufacture product electronic trading

NASA Astrophysics Data System (ADS)

Zhou, Zude; Liu, Quan; Jiang, Xuemei

2003-09-01

With the rapid globalization of market and business, E-trading affects every manufacture enterprise. However, the security of network manufacturing products of transmission on Internet is very important. In this paper we discussed the protocol of fair exchange and platform for network manufacture products E-trading based on fair exchange protocol and digital watermarking techniques. The platform realized reliable and copyright protection.

Structure and properties of parts produced by electron-beam additive manufacturing

NASA Astrophysics Data System (ADS)

Klimenov, Vasilii; Klopotov, Anatolii; Fedorov, Vasilii; Abzaev, Yurii; Batranin, Andrey; Kurgan, Kirill; Kairalapov, Daniyar

2017-12-01

The paper deals with the study of structure, microstructure, composition and microhardness of a tube processed by electron-beam additive manufacturing using optical and scanning electron microscopy. The structure and macrodefects of a tube made of Grade2 titanium alloy is studied using the X-ray computed tomography. The principles of layer-by-layer assembly and boundaries after powder sintering are set out in this paper. It is found that the titanium alloy has two phases. Future work will involve methods to improve properties of created parts.

Low Voltage Electron Beam Processing Final Report CRADA No. TC-645-93-A

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chen, H.; Wakalopulos, G.

This CRADA project was established to develop a small, inexpensive sealed-tube electron beam processing system having immediate applications in industrial, high speed manufacturing processes, and in the Department of Energy (DOE) waste treatment/cleanup operations. The technical work involved the development and demonstration of a compact, sealed, 50-75 kilovolt (kV) EB generator prototype, including controls and power supply. The specific goals of this project were to develop a low cost vacuum tube capable of shooting an electron beam several inches into the air, and to demonstrate that wide area materials processing is feasible by stacking the tubes to produce continuous beams.more » During the project, we successfully demonstrated the producibility of a low cost electron beam system and several material processing operations of interest to US industry, DOE and, since September 11, 2001, the Homeland Security.« less

Electronics Curriculum.

ERIC Educational Resources Information Center

Prickett, Charlotte

This document presents results of research conducted by industry representatives regarding tasks performed by electronic technicians and line manufacturing electro-mechanical technicians in Arizona electronics industries. Based on this research, a competency-based curriculum was developed for training entry-level electronics technicians. Twelve…

76 FR 65696 - Battelle Energy Alliance, et al.;

Federal Register 2010, 2011, 2012, 2013, 2014

2011-10-24

... of Texas at Austin, Austin, TX 78712. Instrument: Electron Microscope. Manufacturer: FEI Company, the... research or scientific educational uses requiring an electron microscope. We know of no electron microscope...

Thermal Imaging for Assessment of Electron-Beam Free Form Fabrication (EBF(sup 3)) Additive Manufacturing Welds

NASA Technical Reports Server (NTRS)

Zalameda, Joseph N.; Burke, Eric R.; Hafley, Robert A.; Taminger, Karen M.; Domack, Christopher S.; Brewer, Amy R.; Martin, Richard E.

2013-01-01

Additive manufacturing is a rapidly growing field where 3-dimensional parts can be produced layer by layer. NASA s electron beam free-form fabrication (EBF(sup 3)) technology is being evaluated to manufacture metallic parts in a space environment. The benefits of EBF(sup 3) technology are weight savings to support space missions, rapid prototyping in a zero gravity environment, and improved vehicle readiness. The EBF(sup 3) system is composed of 3 main components: electron beam gun, multi-axis position system, and metallic wire feeder. The electron beam is used to melt the wire and the multi-axis positioning system is used to build the part layer by layer. To insure a quality weld, a near infrared (NIR) camera is used to image the melt pool and solidification areas. This paper describes the calibration and application of a NIR camera for temperature measurement. In addition, image processing techniques are presented for weld assessment metrics.

Polyimide-Epoxy Composites with Superior Bendable Properties for Application in Flexible Electronics

NASA Astrophysics Data System (ADS)

Lee, Sangyoup; Yoo, Taewon; Han, Youngyu; Kim, Hanglim; Han, Haksoo

2017-08-01

The need for flexible electronics with outstanding bending properties is increasing due to the demand for wearable devices and next-generation flexible or rollable smartphones. In addition, the requirements for flexible or rigid-flexible electronics are sharply increasing to achieve the design of space-saving electronic devices. In this regard, coverlay (CL) film is a key material used in the bending area of flexible electronics, albeit infrequently. Because flexible electronics undergo folding and unfolding numerous times, CL films with superior mechanical and bending properties are required so that the bending area can endure such severe stress. However, because current CL films are only used for a designated bending area in the flexible electronics panel, their highly complicated and expensive manufacturing procedure is a disadvantage. In addition, the thickness of CL films must be decreased to satisfy the ongoing requirement for increasingly thin products. However, due to the limitations of the two-layer structure of existing CL films, the manufacturing process cannot be made more cost effective by simply applying more thin film onto the board. To address this problem, we have developed liquid coverlay inks (LCIs) with superior bendable properties, in comparison with CL films, when applied onto flexible electronics using a screen-printing method. The results show that LCIs have the potential to become one of the leading candidates to replace existing CL films because of their lower cost and faster manufacturing process.

46 CFR 53.10-15 - Manufacturers' data report forms.

Code of Federal Regulations, 2014 CFR

2014-10-01

... 46 Shipping 2 2014-10-01 2014-10-01 false Manufacturers' data report forms. 53.10-15 Section 53.10-15 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) MARINE ENGINEERING HEATING BOILERS Tests, Inspection, Stamping, and Reporting (Article 5) § 53.10-15 Manufacturers' data report forms. The manufacturers' data report forms require...

46 CFR 53.10-15 - Manufacturers' data report forms.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 46 Shipping 2 2010-10-01 2010-10-01 false Manufacturers' data report forms. 53.10-15 Section 53.10-15 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) MARINE ENGINEERING HEATING BOILERS Tests, Inspection, Stamping, and Reporting (Article 5) § 53.10-15 Manufacturers' data report forms. The manufacturers' data report forms require...

46 CFR 53.10-15 - Manufacturers' data report forms.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 46 Shipping 2 2012-10-01 2012-10-01 false Manufacturers' data report forms. 53.10-15 Section 53.10-15 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) MARINE ENGINEERING HEATING BOILERS Tests, Inspection, Stamping, and Reporting (Article 5) § 53.10-15 Manufacturers' data report forms. The manufacturers' data report forms require...

46 CFR 53.10-15 - Manufacturers' data report forms.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 46 Shipping 2 2013-10-01 2013-10-01 false Manufacturers' data report forms. 53.10-15 Section 53.10-15 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) MARINE ENGINEERING HEATING BOILERS Tests, Inspection, Stamping, and Reporting (Article 5) § 53.10-15 Manufacturers' data report forms. The manufacturers' data report forms require...

46 CFR 53.10-15 - Manufacturers' data report forms.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 46 Shipping 2 2011-10-01 2011-10-01 false Manufacturers' data report forms. 53.10-15 Section 53.10-15 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) MARINE ENGINEERING HEATING BOILERS Tests, Inspection, Stamping, and Reporting (Article 5) § 53.10-15 Manufacturers' data report forms. The manufacturers' data report forms require...

Microstructure and Corrosion Resistance of Laser Additively Manufactured 316L Stainless Steel

NASA Astrophysics Data System (ADS)

Trelewicz, Jason R.; Halada, Gary P.; Donaldson, Olivia K.; Manogharan, Guha

2016-03-01

Additive manufacturing (AM) of metal alloys to produce complex part designs via powder bed fusion methods such as laser melting promises to be a transformative technology for advanced materials processing. However, effective implementation of AM processes requires a clear understanding of the processing-structure-properties-performance relationships in fabricated components. In this study, we report on the formation of micro and nanoscale structures in 316L stainless steel samples printed by laser AM and their implications for general corrosion resistance. A variety of techniques including x-ray diffraction, optical, scanning and transmission electron microscopy, x-ray fluorescence, and energy dispersive x-ray spectroscopy were employed to characterize the microstructure and chemistry of the laser additively manufactured 316L stainless steel, which are compared with wrought 316L coupons via electrochemical polarization. Apparent segregation of Mo has been found to contribute to a loss of passivity and an increased anodic current density. While porosity will also likely impact the environmental performance (e.g., facilitating crevice corrosion) of AM alloys, this work demonstrates the critical influence of microstructure and heterogeneous solute distributions on the corrosion resistance of laser additively manufactured 316L stainless steel.

The search for CFC alternatives is over?

NASA Technical Reports Server (NTRS)

Crawford, Tim

1995-01-01

The Electronics Manufacturing Productivity Facility (EMPF) is a U.S. Navy Center of Excellence tasked to do research in electronics manufacturing. For the past seven years, the EMPF has performed extensive research in various cleaning materials and processes that have recently been made available to printed circuit board assemblers. This paper outlines our research and points out the positive and negative aspects that need to be considered when choosing an alternative process.

Soft electron processor for surface sterilization of food material

NASA Astrophysics Data System (ADS)

Baba, Takashi; Kaneko, Hiromi; Taniguchi, Shuichi

2004-09-01

As frozen or chilled foods have become popular nowadays, it has become very important to provide raw materials with lower level microbial contamination to food processing companies. Consequently, the sterilization of food material is one of the major topics for food processing. Dried materials like grains, beans and spices, etc., are not typically deeply contaminated by microorganisms, which reside on the surfaces of materials, so it is very useful to take low energetic, lower than 300 keV, electrons with small penetration power (Soft-Electrons), as a sterilization method for such materials. Soft-Electrons is researched and named by Dr. Hayashi et al. This is a non-thermal method, so one can keep foods hygienic without serious deterioration. It is also a physical method, so is free from residues of chemicals in foods. Recently, Nissin-High Voltage Co., Ltd. have developed and manufactured equipment for commercial use of Soft-Electrons (Soft Electron Processor), which can process 500 kg/h of grains. This report introduces the Soft Electron Processor and shows the results of sterilization of wheat and brown rice by the equipment.

Screen printing as a scalable and low-cost approach for rigid and flexible thin-film transistors using separated carbon nanotubes.

PubMed

Cao, Xuan; Chen, Haitian; Gu, Xiaofei; Liu, Bilu; Wang, Wenli; Cao, Yu; Wu, Fanqi; Zhou, Chongwu

2014-12-23

Semiconducting single-wall carbon nanotubes are very promising materials in printed electronics due to their excellent mechanical and electrical property, outstanding printability, and great potential for flexible electronics. Nonetheless, developing scalable and low-cost approaches for manufacturing fully printed high-performance single-wall carbon nanotube thin-film transistors remains a major challenge. Here we report that screen printing, which is a simple, scalable, and cost-effective technique, can be used to produce both rigid and flexible thin-film transistors using separated single-wall carbon nanotubes. Our fully printed top-gated nanotube thin-film transistors on rigid and flexible substrates exhibit decent performance, with mobility up to 7.67 cm2 V(-1) s(-1), on/off ratio of 10(4)∼10(5), minimal hysteresis, and low operation voltage (<10 V). In addition, outstanding mechanical flexibility of printed nanotube thin-film transistors (bent with radius of curvature down to 3 mm) and driving capability for organic light-emitting diode have been demonstrated. Given the high performance of the fully screen-printed single-wall carbon nanotube thin-film transistors, we believe screen printing stands as a low-cost, scalable, and reliable approach to manufacture high-performance nanotube thin-film transistors for application in display electronics. Moreover, this technique may be used to fabricate thin-film transistors based on other materials for large-area flexible macroelectronics, and low-cost display electronics.

Manufacturing Methods for the Production of Field Effect Electron Emitters from Oxide-Metal Composites.

DTIC Science & Technology

1977-12-01

Internal Zone Melting, Oxide-Metal Eutectic Structures ABSTRACT (Continue X reverae elde II neceaetrry end Identity by block nwbor* -^>This report...To- Uranium (0/U) Ratio B. Storage of "As-Received" Powders C. Moisture Content D. Oxidation Properties E. Sintering Properties F. Particle Size... Nickel - Vanadium 3.3 Nickel -Al203 3.4 Nickel -Tungsten 3.5 Copper-410 Stainless Steel C. Etching 1. Chemical Etching 2. Thermal Annealing 3. Ion

Performance and Reliability of Bonded Interfaces for High-Temperature Packaging. Annual Report

DOE Office of Scientific and Technical Information (OSTI.GOV)

DeVoto, Douglas

2016-04-01

Current generation automotive power electronics packages utilize silicon devices and lead-free solder alloys. To meet stringent technical targets for 2020 and beyond (for cost, power density, specific power, efficiency and reliability), wide-bandgap devices are being considered since they offer advantages such as operation at higher frequencies, voltages, and temperatures. Traditional power electronics packages must be redesigned to utilize the full potential of wide-bandgap devices, and the die- and substrate-attach layers are key areas where new material development and validation is required. Present solder alloys do not meet the performance requirements for these new package designs while also meeting cost andmore » hazardous substance restrictions. Sintered silver (Ag) promises to meet the needs for die- and substrate-attach interfaces but synthesis optimization and reliability evaluation must be completed. Sintered Ag material was proposed as an alternative solution in power electronics packages almost 20 years back. However, synthesis pressure requirements up 40 MPa caused a higher complexity in the production process and more stringent flatness specifications for the substrates. Recently, several manufacturers have developed sintered Ag materials that require lower (3-5 MPa) or even no bonding pressures. Degradation mechanisms for these sintered Ag materials are not well known and need to be addressed. We are addressing these aspects to some extent in this project. We are developing generalized (i.e., independent of geometry) stress intensity factor versus cycles-to-failure relations for sintered Ag. Because sintered Ag is a relatively new material for automotive power electronics, the industry currently does not have a good understanding of recommended synthesis parameters or expected reliability under prescribed conditions. It is an important deliverable of this project to transfer findings to industry to eliminate barriers to using sintered Ag as a viable and commercialized die- and substrate-attach material. Only a few manufacturers produce sintered Ag pastes and may consider some processing conditions as proprietary. It is the goal of this project to openly explore and define best practices in order to impact the maximum number of power electronics module manufacturers and suppliers.« less

Thermo-Mechanical Analysis for John Deere Electronics Solutions | Advanced

Science.gov Websites

impacts of alternative manufacturing processes Die, package, and interface material analysis for power module reliability Manufacturing process impacts versus thermal cycling impacts on power module

3D Printing Multi-Functionality: Embedded RF Antennas and Components

NASA Technical Reports Server (NTRS)

Shemelya, C. M.; Zemba, M.; Liang, M.; Espalin, D.; Kief, C.; Xin, H.; Wicker, R. B.; MacDonald, E. W.

2015-01-01

Significant research and press has recently focused on the fabrication freedom of Additive Manufacturing (AM) to create both conceptual models and final end-use products. This flexibility allows design modifications to be immediately reflected in 3D printed structures, creating new paradigms within the manufacturing process. 3D printed products will inevitably be fabricated locally, with unit-level customization, optimized to unique mission requirements. However, for the technology to be universally adopted, the processes must be enhanced to incorporate additional technologies; such as electronics, actuation, and electromagnetics. Recently, a novel 3D printing platform, Multi3D manufacturing, was funded by the presidential initiative for revitalizing manufacturing in the USA using 3D printing (America Makes - also known as the National Additive Manufacturing Innovation Institute). The Multi3D system specifically targets 3D printed electronics in arbitrary form; and building upon the potential of this system, this paper describes RF antennas and components fabricated through the integration of material extrusion 3D printing with embedded wire, mesh, and RF elements.

Powder bed charging during electron-beam additive manufacturing

DOE PAGES

Cordero, Zachary C.; Meyer, Harry M.; Nandwana, Peeyush; ...

2016-11-18

Electrons injected into the build envelope during powder-bed electron-beam additive manufacturing can accumulate on the irradiated particles and cause them to repel each other. Furthermore, these electrostatic forces can grow so large that they drive the particles out of the build envelope in a process known as smoking. Here, a model of powder bed charging is formulated and used to develop criteria that predict the conditions under which the powder bed will smoke. These criteria suggest dependences on particle size, pre-heat temperature, and process parameters that align closely with those observed in practice.

Electronic labelling in recycling of manufactured articles.

PubMed

Olejnik, Lech; Krammer, Alfred

2002-12-01

The concept of a recycling system aiming at the recovery of resources from manufactured articles is proposed. The system integrates electronic labels for product identification and internet for global data exchange. A prototype for the recycling of electric motors has been developed, which implements a condition-based recycling decision system to automatically select the environmentally and economically appropriate recycling strategy, thereby opening a potential market for second-hand motors and creating a profitable recycling process itself. The project has been designed to evaluate the feasibility of electronic identification applied on a large number of motors and to validate the system in real field conditions.

Characterization of Thermoplastic Polyurethane (TPU) and Ag Carbon Black TPU Nanocomposite for Potential Application in Additive Manufacturing (Postprint)

DTIC Science & Technology

2016-12-29

APPLICATION IN ADDITIVE MANUFACTURING (POSTPRINT) Steven T. Patton, Chenggang Chen, Jianjun Hu, and Lawrence Grazulis University of Dayton Research...CARBON BLACK TPU NANOCOMPOSITE FOR POTENTIAL APPLICATION IN ADDITIVE MANUFACTURING (POSTPRINT) 5a. CONTRACT NUMBER FA8650-11-D-5401-0008 5b...and polymer nanocomposites (PNCs) are of interest for additive manufacturing (AM) and flexible electronics. Development/optimization of inks for AM

Exploding the Black Box: Personal Computing, the Notebook Battery Crisis, and Postindustrial Systems Thinking.

PubMed

Eisler, Matthew N

Historians of science and technology have generally ignored the role of power sources in the development of consumer electronics. In this they have followed the predilections of historical actors. Research, development, and manufacturing of batteries has historically occurred at a social and intellectual distance from the research, development, and manufacturing of the devices they power. Nevertheless, power source technoscience should properly be understood as an allied yet estranged field of electronics. The separation between the fields has had important consequences for the design and manufacturing of mobile consumer electronics. This paper explores these dynamics in the co-construction of notebook batteries and computers. In so doing, it challenges assumptions of historians and industrial engineers and planners about the nature of computer systems in particular and the development of technological systems. The co-construction of notebook computers and batteries, and the occasional catastrophic failure of their compatibility, challenges systems thinking more generally.

Numerical modeling of heat-transfer and the influence of process parameters on tailoring the grain morphology of IN718 in electron beam additive manufacturing

DOE PAGES

Raghavan, Narendran; Dehoff, Ryan; Pannala, Sreekanth; ...

2016-04-26

The fabrication of 3-D parts from CAD models by additive manufacturing (AM) is a disruptive technology that is transforming the metal manufacturing industry. The correlation between solidification microstructure and mechanical properties has been well understood in the casting and welding processes over the years. This paper focuses on extending these principles to additive manufacturing to understand the transient phenomena of repeated melting and solidification during electron beam powder melting process to achieve site-specific microstructure control within a fabricated component. In this paper, we have developed a novel melt scan strategy for electron beam melting of nickel-base superalloy (Inconel 718) andmore » also analyzed 3-D heat transfer conditions using a parallel numerical solidification code (Truchas) developed at Los Alamos National Laboratory. The spatial and temporal variations of temperature gradient (G) and growth velocity (R) at the liquid-solid interface of the melt pool were calculated as a function of electron beam parameters. By manipulating the relative number of voxels that lie in the columnar or equiaxed region, the crystallographic texture of the components can be controlled to an extent. The analysis of the parameters provided optimum processing conditions that will result in columnar to equiaxed transition (CET) during the solidification. Furthermore, the results from the numerical simulations were validated by experimental processing and characterization thereby proving the potential of additive manufacturing process to achieve site-specific crystallographic texture control within a fabricated component.« less

Direct Laser Writing-Based Programmable Transfer Printing via Bioinspired Shape Memory Reversible Adhesive.

PubMed

Huang, Yin; Zheng, Ning; Cheng, Zhiqiang; Chen, Ying; Lu, Bingwei; Xie, Tao; Feng, Xue

2016-12-28

Flexible and stretchable electronics offer a wide range of unprecedented opportunities beyond conventional rigid electronics. Despite their vast promise, a significant bottleneck lies in the availability of a transfer printing technique to manufacture such devices in a highly controllable and scalable manner. Current technologies usually rely on manual stick-and-place and do not offer feasible mechanisms for precise and quantitative process control, especially when scalability is taken into account. Here, we demonstrate a spatioselective and programmable transfer strategy to print electronic microelements onto a soft substrate. The method takes advantage of automated direct laser writing to trigger localized heating of a micropatterned shape memory polymer adhesive stamp, allowing highly controlled and spatioselective switching of the interfacial adhesion. This, coupled to the proper tuning of the stamp properties, enables printing with perfect yield. The wide range adhesion switchability further allows printing of hybrid electronic elements, which is otherwise challenging given the complex interfacial manipulation involved. Our temperature-controlled transfer printing technique shows its critical importance and obvious advantages in the potential scale-up of device manufacturing. Our strategy opens a route to manufacturing flexible electronics with exceptional versatility and potential scalability.

49 CFR 576.6 - Records.

Code of Federal Regulations, 2013 CFR

2013-10-01

... communicated by computer, telefax or other electronic means, that are related to work performed under... or external correspondence of the manufacturer, including communications transmitted electronically...

49 CFR 576.6 - Records.

Code of Federal Regulations, 2011 CFR

2011-10-01

... communicated by computer, telefax or other electronic means, that are related to work performed under... or external correspondence of the manufacturer, including communications transmitted electronically...

49 CFR 576.6 - Records.

Code of Federal Regulations, 2010 CFR

2010-10-01

... communicated by computer, telefax or other electronic means, that are related to work performed under... or external correspondence of the manufacturer, including communications transmitted electronically...

49 CFR 576.6 - Records.

Code of Federal Regulations, 2014 CFR

2014-10-01

... communicated by computer, telefax or other electronic means, that are related to work performed under... or external correspondence of the manufacturer, including communications transmitted electronically...

49 CFR 576.6 - Records.

Code of Federal Regulations, 2012 CFR

2012-10-01

... communicated by computer, telefax or other electronic means, that are related to work performed under... or external correspondence of the manufacturer, including communications transmitted electronically...

NASA Tech Briefs, July 1997. Volume 21, No. 7

NASA Technical Reports Server (NTRS)

1997-01-01

Topics: Mechanical Components; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Life Sciences.

NASA-DoD Lead-Free Electronics Project. DRAFT Joint Test Report

NASA Technical Reports Server (NTRS)

Kessel, Kurt

2011-01-01

The use of conventional tin-lead (SnPb) in circuit board manufacturing is under ever-increasing political scrutiny due to increasing regulations concerning lead. The "Restriction of Hazardous Substances" (RoHS) directive enacted by the European Union (EU) and a pact between the United States National Electronics Manufacturing Initiative (NEMI), Europe's Soldertec at Tin Technology Ltd. and the Japan Electronics and Information Technology Industries Association (JEITA) are just two examples where worldwide legislative actions and partnerships/agreements are affecting the electronics industry. As a result, many global commercial-grade electronic component suppliers are initiating efforts to transition to lead-free (Pb-free) in order to retain their worldwide market. Pb-free components are likely to find their way into the inventory of aerospace or military assembly processes under current government acquisition reform initiatives. Inventories "contaminated" by Pb-free will result in increased risks associated with the manufacturing, product reliability, and subsequent repair of aerospace and military electronic systems. Although electronics for military and aerospace applications are not included in the RoHS legislation, engineers are beginning to find that the commercial industry's move towards RoHS compliance has affected their supply chain and changed their parts. Most parts suppliers plan to phase out their non-compliant, leaded production and many have already done so. As a result, the ability to find leaded components is getting harder and harder. Some buyers are now attempting to acquire the remaining SnPb inventory, if it's not already obsolete. Original Equipment Manufacturers (OEMs), depots, and support contractors have to be prepared to deal with an electronics supply chain that increasingly provides more and more parts with Pb-free finishes-some labeled no differently than their Pb counterparts-while at the same time providing the traditional Pb parts. The longer the transition period, the greater the likelihood of Pb-free parts inadvertently being mixed with Pb parts and ending up on what are supposed to be Pb systems. As a result, OEMs, depots, and support contractors need to take action now to either abate the influx of Pb-free parts, or accept it and deal with the likely interim consequences of reduced reliability due to a wide variety of matters, such as Pb contamination, high temperature incompatibility, and tin whiskering. Allowance of Pb-free components produces one of the greatest risks to the reliability of a weapon system. This is due to new and poorly understood failure mechanisms, as well as unknown long-term reliability. If the decision is made to consciously allow Pb-free solder and component finishes into SnPb electronics, additional effort (and cost) will be required to make the significant number of changes to drawings and task order procedures. This project is a follow-on effort to the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) Pb-free Solder Project which was the first group to test the reliability of Pb-free solder joints against the requirements of the aerospace and military community.

Constructing the informatics and information technology foundations of a medical device evaluation system: a report from the FDA unique device identifier demonstration.

PubMed

Drozda, Joseph P; Roach, James; Forsyth, Thomas; Helmering, Paul; Dummitt, Benjamin; Tcheng, James E

2018-02-01

The US Food and Drug Administration (FDA) has recognized the need to improve the tracking of medical device safety and performance, with implementation of Unique Device Identifiers (UDIs) in electronic health information as a key strategy. The FDA funded a demonstration by Mercy Health wherein prototype UDIs were incorporated into its electronic information systems. This report describes the demonstration's informatics architecture. Prototype UDIs for coronary stents were created and implemented across a series of information systems, resulting in UDI-associated data flow from manufacture through point of use to long-term follow-up, with barcode scanning linking clinical data with UDI-associated device attributes. A reference database containing device attributes and the UDI Research and Surveillance Database (UDIR) containing the linked clinical and device information were created, enabling longitudinal assessment of device performance. The demonstration included many stakeholders: multiple Mercy departments, manufacturers, health system partners, the FDA, professional societies, the National Cardiovascular Data Registry, and information system vendors. The resulting system of systems is described in detail, including entities, functions, linkage between the UDIR and proprietary systems using UDIs as the index key, data flow, roles and responsibilities of actors, and the UDIR data model. The demonstration provided proof of concept that UDIs can be incorporated into provider and enterprise electronic information systems and used as the index key to combine device and clinical data in a database useful for device evaluation. Keys to success and challenges to achieving this goal were identified. Fundamental informatics principles were central to accomplishing the system of systems model. © The Author 2017. Published by Oxford University Press on behalf of the American Medical Informatics Association. All rights reserved. For Permissions, please email: journals.permissions@oup.com

JPRS Report, Science & Technology, Japan, SOR Technology Update

DTIC Science & Technology

1990-12-18

GUN Electron gun c3 GV Gate valve R- ± HL Helmholtz coil IG Ion vacuum gauge IP Ion pump KFC Klystron focusing coil KLY Klystron PB Pre-buncher Q...Therefore, we started studying the manufacture of this kind of film. Recently, such films have been placed on the market as test samples by some foreign... Mixing of sputtered particles from the two targets can also be prevented by making the structure of the bulkhead in the sputtering chamber most

Integrated Information Support System (IISS). Volume 8. User Interface Subsystem. Part 39. Electronic Documentation System (EDS) User’s Manual

DTIC Science & Technology

1990-09-30

conveying any rights or permission to manufacture, use, or market any patented invention that may in any way be related thereto. This technical report...Definition - Select .... 7-9 7-6 Character Class Definition - Other Options 7-10 7-7 Pattern/Action/State Defintion -Select 7-11 7-8 Pattern/Action/State...representation. Compound Document: A document which may contain mixed content i.e. text, graphics, etc. Conforming SGML Application: An SGML application that

Reductive dechlorination of the nitrogen heterocyclic herbicide picloram

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ramanand, K.; Nagarajan, A.; Suflita, J.M.

Halogenated heterocyclic chemicals are widely used for manufacture of pesticides, pharmaceuticals, dyes, and explosives. Often they are environmentally mobile and can contaminate ground water reserves. Picloram, a broad spectrum herbicide, has a half life in the soil of as long as 1 year. This paper reports on the reductive dehalogenation of picloram in anoxic freshwater sediments, though not when sulfate or nitrate was available as a terminal electron acceptor, and its subsequent conversion to an unidentified product. 25 refs., 4 figs, 1 tab.

21 CFR 606.171 - Reporting of product deviations by licensed manufacturers, unlicensed registered blood...

Code of Federal Regulations, 2011 CFR

2011-04-01

... manufacturers, unlicensed registered blood establishments, and transfusion services. 606.171 Section 606.171...) BIOLOGICS CURRENT GOOD MANUFACTURING PRACTICE FOR BLOOD AND BLOOD COMPONENTS Records and Reports § 606.171 Reporting of product deviations by licensed manufacturers, unlicensed registered blood establishments, and...

21 CFR 606.171 - Reporting of product deviations by licensed manufacturers, unlicensed registered blood...

Code of Federal Regulations, 2012 CFR

2012-04-01

... manufacturers, unlicensed registered blood establishments, and transfusion services. 606.171 Section 606.171...) BIOLOGICS CURRENT GOOD MANUFACTURING PRACTICE FOR BLOOD AND BLOOD COMPONENTS Records and Reports § 606.171 Reporting of product deviations by licensed manufacturers, unlicensed registered blood establishments, and...

21 CFR 606.171 - Reporting of product deviations by licensed manufacturers, unlicensed registered blood...

Code of Federal Regulations, 2014 CFR

2014-04-01

... manufacturers, unlicensed registered blood establishments, and transfusion services. 606.171 Section 606.171...) BIOLOGICS CURRENT GOOD MANUFACTURING PRACTICE FOR BLOOD AND BLOOD COMPONENTS Records and Reports § 606.171 Reporting of product deviations by licensed manufacturers, unlicensed registered blood establishments, and...

21 CFR 606.171 - Reporting of product deviations by licensed manufacturers, unlicensed registered blood...

Code of Federal Regulations, 2013 CFR

2013-04-01

... manufacturers, unlicensed registered blood establishments, and transfusion services. 606.171 Section 606.171...) BIOLOGICS CURRENT GOOD MANUFACTURING PRACTICE FOR BLOOD AND BLOOD COMPONENTS Records and Reports § 606.171 Reporting of product deviations by licensed manufacturers, unlicensed registered blood establishments, and...

An analysis of preferences for hazardous substances free products: manufacturing, use and end of life of mobile phones.

PubMed

Kaushal, Rajendra Kumar; Nema, Arvind K

2012-11-01

Electronic communication devices such as mobile phones pose significant environmental risks when disposed of after the end of their useful life. Mobile communication devices are one of the fastest growing contributors to the electronic waste (e-waste) stream. Recent legislative pressure and increasing awareness about the environmental risk associated with the hazardous components of the electronic products warrants the manufacturers to reduce or replace the hazardous materials with alternatives. The present study analyses the economic consequences of reducing or replacing these hazardous materials and the possible response of the consumers. A strategic game theory model has been applied in this paper for manufacturer and consumers considering the cost difference between hazardous substances free (HSF) and hazardous substance (HS) mobile. Results suggest that the HSF mobiles can be a preferred choice of the manufacturers as well as consumers if the cost of disposal of HS mobiles can be internalized and a marginal incentive (e.g. 0.9% for a cost difference to 5%, and 5.3% for a cost difference to 10%) is given. The study further highlights the need for realizing the fact that passing on the incentives to the consumers in order to promote schemes for return back to manufacturer at its end of life for effective reuse and recycling gives higher returns.

Intelligent Processing Equipment Developments Within the Navy's Manufacturing Technology Centers of Excellence

NASA Technical Reports Server (NTRS)

Nanzetta, Philip

1992-01-01

The U.S. Navy has had an active Manufacturing Technology (MANTECH) Program aimed at developing advanced production processes and equipment since the late-1960's. During the past decade, however, the resources of the MANTECH program were concentrated in Centers of Excellence. Today, the Navy sponsors four manufacturing technology Centers of Excellence: the Automated Manufacturing Research Facility (AMRF); the Electronics Manufacturing Productivity Facility (EMPF); the National Center for Excellence in Metalworking Technology (NCEMT); and the Center of Excellence for Composites Manufacturing Technology (CECMT). This paper briefly describes each of the centers and summarizes typical Intelligent Equipment Processing (IEP) projects that were undertaken.

Progress Toward an Integration of Process-Structure-Property-Performance Models for "Three-Dimensional (3-D) Printing" of Titanium Alloys

NASA Astrophysics Data System (ADS)

Collins, P. C.; Haden, C. V.; Ghamarian, I.; Hayes, B. J.; Ales, T.; Penso, G.; Dixit, V.; Harlow, G.

2014-07-01

Electron beam direct manufacturing, synonymously known as electron beam additive manufacturing, along with other additive "3-D printing" manufacturing processes, are receiving widespread attention as a means of producing net-shape (or near-net-shape) components, owing to potential manufacturing benefits. Yet, materials scientists know that differences in manufacturing processes often significantly influence the microstructure of even widely accepted materials and, thus, impact the properties and performance of a material in service. It is important to accelerate the understanding of the processing-structure-property relationship of materials being produced via these novel approaches in a framework that considers the performance in a statistically rigorous way. This article describes the development of a process model, the assessment of key microstructural features to be incorporated into a microstructure simulation model, a novel approach to extract a constitutive equation to predict tensile properties in Ti-6Al-4V (Ti-64), and a probabilistic approach to measure the fidelity of the property model against real data. This integrated approach will provide designers a tool to vary process parameters and understand the influence on performance, enabling design and optimization for these highly visible manufacturing approaches.

Electronic medical devices: a primer for pathologists.

PubMed

Weitzman, James B

2003-07-01

Electronic medical devices (EMDs) with downloadable memories, such as implantable cardiac pacemakers, defibrillators, drug pumps, insulin pumps, and glucose monitors, are now an integral part of routine medical practice in the United States, and functional organ replacements, such as the artificial heart, pancreas, and retina, will most likely become commonplace in the near future. Often, EMDs end up in the hands of the pathologist as a surgical specimen or at autopsy. No established guidelines for systematic examination and reporting or comprehensive reviews of EMDs currently exist for the pathologist. To provide pathologists with a general overview of EMDs, including a brief history; epidemiology; essential technical aspects, indications, contraindications, and complications of selected devices; potential applications in pathology; relevant government regulations; and suggested examination and reporting guidelines. Articles indexed on PubMed of the National Library of Medicine, various medical and history of medicine textbooks, US Food and Drug Administration publications and product information, and specifications provided by device manufacturers. Studies were selected on the basis of relevance to the study objectives. Descriptive data were selected by the author. Suggested examination and reporting guidelines for EMDs received as surgical specimens and retrieved at autopsy. Electronic medical devices received as surgical specimens and retrieved at autopsy are increasing in number and level of sophistication. They should be systematically examined and reported, should have electronic memories downloaded when indicated, will help pathologists answer more questions with greater certainty, and should become an integral part of the formal knowledge base, research focus, training, and practice of pathology.

Electron beam additive manufacturing with wire - Analysis of the process

NASA Astrophysics Data System (ADS)

Weglowski, Marek St.; Błacha, Sylwester; Pilarczyk, Jan; Dutkiewicz, Jan; Rogal, Łukasz

2018-05-01

The electron beam additive manufacturing process with wire is a part of global trend to find fast and efficient methods for producing complex shapes elements from costly metal alloys such as stainless steels, nickel alloys, titanium alloys etc. whose production by other conventional technologies is unprofitable or technically impossible. Demand for additive manufacturing is linked to the development of new technologies in the automotive, aerospace and machinery industries. The aim of the presented work was to carried out research on electron beam additive manufacturing with a wire as a deposited (filler) material. The scope of the work was to investigate the influence of selected technological parameters such as: wire feed rate, beam current, travelling speed, acceleration voltage on stability of the deposition process and geometric dimensions of the padding welds. The research revealed that, at low beam currents, the deposition process is unstable. The padding weld reinforcement is non-uniform. Irregularity of the width, height and straightness of the padding welds can be observed. At too high acceleration voltage and beam current, burn-through of plate and excess penetration weld can be revealed. The achieved results and gained knowledge allowed to produce, based on EBAM with wire process, whole structure from stainless steel.

A taxonomy of green supply chain management capability among electronics-related manufacturing firms in Taiwan.

PubMed

Shang, Kuo-Chung; Lu, Chin-Shan; Li, Shaorui

2010-05-01

This study investigated crucial green supply chain management (GSCM) capability dimensions and firm performance based on electronics-related manufacturing firms in Taiwan. On the basis of a factor analysis, six green supply chain management dimensions were identified: green manufacturing and packaging, environmental participation, green marketing, green suppliers, green stock, and green eco-design. According to their factor scores in the GSCM dimensions, a cluster analysis subsequently assigned responding firms into four groups, namely, the weak GSCM oriented group, the green marketing oriented group, the green supplier oriented group, and the green stock oriented group. Differences in firm performance and GSCM dimensions among groups were examined. Results indicated that the green marketing oriented group performed best. Based on the resource-based view (RBV), the capability of the green marketing oriented group was considered to be the deployment of a collection of resources that enables it to successfully compete against rivals. The importance of green marketing as a GSCM capability and strategic asset/critical resources for electronics-related manufacturing firms to obtain a competitive edge is therefore highlighted in this study. Copyright 2010 Elsevier Ltd. All rights reserved.

Status report of the GERDA experiment phase I

NASA Astrophysics Data System (ADS)

Riboldi, Stefano; Gerda Collaboration

2013-08-01

Phase I of GERDA, aimed at investigating neutrino-less double beta decay of 76Ge is in the active phase since November 2011 at the Gran Sasso National Laboratory of INFN-Italy. GERDA Ge detectors are non-encapsulated and operate immersed in liquid argon, equipped with a front-end readout electronics consisting of cryogenic charge sensitive preamplifiers designed and manufactured to cope with the characteristics of the GERDA experiment (radio-purity, long and resistive cables, etc.). The presentation will report on the current status of the GERDA experiment phase I, focusing on Ge detectors performance in terms of energy resolution, stability over time, counting rate and related issues.

[Electromagnetic interference in the current era of cardiac implantable electronic devices designed for magnetic resonance environment].

PubMed

Ribatti, Valentina; Santini, Luca; Forleo, Giovanni B; Della Rocca, Domenico; Panattoni, Germana; Scali, Marta; Schirripa, Valentina; Danisi, Nicola; Ammirati, Fabrizio; Santini, Massimo

2017-04-01

In the last decades we are observing a continuous increase in the number of patients wearing cardiac implantable electronic devices (CIEDs). At the same time, we face daily with a domestic and public environment featured more and more by the presence and the utilization of new emitters and finally, more medical procedures are based on electromagnetic fields as well. Therefore, the topic of the interaction of devices with electromagnetic interference (EMI) is increasingly a real and actual problem.In the medical environment most attention is paid to magnetic resonance, nevertheless the risk of interaction is present also with ionizing radiation, electrical nerve stimulation and electrosurgery. In the non-medical environment, most studies reported in the literature focused on mobile phones, metal detectors, as well as on headphones or digital players as potential EMI sources, but many other instruments and tools may be intentional or non-intentional sources of electromagnetic fields.CIED manufacturers are more and more focusing on new technological features in order to make implantable devices less susceptible to EMI. However, patients and emitter manufacturers should be aware that limitations exist and that there is not complete immunity to EMI.

MANUFACTURE OF PHOTOVOLTAIC SOLAR CELL USING PLANT CHLOROPHYLL

EPA Science Inventory

To date, we have successfully manufactured working chlorophyll sensitized solar cells using chlorophyll (and b mixture) from spinach leaves. We have evaluated the electronic characteristics (voltage, current, and power outputs using different loading resistors) of this solar c...

The Impact of Intrapreneurial Programs on Fortune 500 Manufacturing Firms.

ERIC Educational Resources Information Center

Marcus, Melissa H.; Tesolowski, Dennis G.; Isbell, Clinton H.

2000-01-01

A survey of 100 manufacturing firms in 10 Standard Industrial Classification areas found that intrapreneurial programs did not significantly affect sales, profits, or returns to investors. Electronics and computer companies and the most dominant intrapreneurial programs. (SK)

75 FR 64248 - Approval for Manufacturing Authority Foreign-Trade Zone 196 ATC Logistics & Electronics (Cell...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-10-19

... Authority Foreign-Trade Zone 196 ATC Logistics & Electronics (Cell Phone Kitting) Fort Worth, TX Pursuant to... Foreign-Trade Zones Board (the Board) adopts the following Order: Whereas, ATC Logistics & Electronics... Logistics & Electronics, as described in the application and Federal Register notice, is approved, subject...

NASA Tech Briefs, November 1993. Volume 17, No. 11

NASA Technical Reports Server (NTRS)

1993-01-01

Topics covered: Advanced Manufacturing; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

40 CFR 469.20 - Applicability.

Code of Federal Regulations, 2010 CFR

2010-07-01

... ELECTRICAL AND ELECTRONIC COMPONENTS POINT SOURCE CATEGORY Electronic Crystals Subcategory § 469.20 Applicability. (a) The provisions of this subpart are applicable to discharges resulting from the manufacture of...

Electronic health records and cardiac implantable electronic devices: new paradigms and efficiencies.

PubMed

Slotwiner, David J

2016-10-01

The anticipated advantages of electronic health records (EHRs)-improved efficiency and the ability to share information across the healthcare enterprise-have so far failed to materialize. There is growing recognition that interoperability holds the key to unlocking the greatest value of EHRs. Health information technology (HIT) systems including EHRs must be able to share data and be able to interpret the shared data. This requires a controlled vocabulary with explicit definitions (data elements) as well as protocols to communicate the context in which each data element is being used (syntactic structure). Cardiac implantable electronic devices (CIEDs) provide a clear example of the challenges faced by clinicians when data is not interoperable. The proprietary data formats created by each CIED manufacturer, as well as the multiple sources of data generated by CIEDs (hospital, office, remote monitoring, acute care setting), make it challenging to aggregate even a single patient's data into an EHR. The Heart Rhythm Society and CIED manufacturers have collaborated to develop and implement international standard-based specifications for interoperability that provide an end-to-end solution, enabling structured data to be communicated from CIED to a report generation system, EHR, research database, referring physician, registry, patient portal, and beyond. EHR and other health information technology vendors have been slow to implement these tools, in large part, because there have been no financial incentives for them to do so. It is incumbent upon us, as clinicians, to insist that the tools of interoperability be a prerequisite for the purchase of any and all health information technology systems.

24 CFR 3282.552 - Manufacturer reports for joint monitoring fees.

Code of Federal Regulations, 2011 CFR

2011-04-01

..., and the State of first location, after leaving the manufacturing plant, of such manufactured homes. The State of first location for the purpose of this report is the State of the premises of the distributor, dealer or purchaser to whom the manufactured home is first shipped. The report for each month...

24 CFR 3282.552 - Manufacturer reports for joint monitoring fees.

Code of Federal Regulations, 2012 CFR

2012-04-01

..., and the State of first location, after leaving the manufacturing plant, of such manufactured homes. The State of first location for the purpose of this report is the State of the premises of the distributor, dealer or purchaser to whom the manufactured home is first shipped. The report for each month...

Annual Electronics Manufacturing Seminar Processings (18th) Held in Ridgecrest, California on 23-24 February 1994

DTIC Science & Technology

1994-02-01

rework, repair, and maintenance of electronic hardware as well as the initial manufacture. Chemically, HF1 189 is simply citric acid (derived from citrus...fruit) in water. Citric acid is highly soluble in water which allows simple water washing of hardware after soldering totally eliminating the need for...of citric acid in water. PCA’s soldered with either wave or hand techniques presented no cleaning problems if they were cleaned within one-half hour of

A physically transient form of silicon electronics.

PubMed

Hwang, Suk-Won; Tao, Hu; Kim, Dae-Hyeong; Cheng, Huanyu; Song, Jun-Kyul; Rill, Elliott; Brenckle, Mark A; Panilaitis, Bruce; Won, Sang Min; Kim, Yun-Soung; Song, Young Min; Yu, Ki Jun; Ameen, Abid; Li, Rui; Su, Yewang; Yang, Miaomiao; Kaplan, David L; Zakin, Mitchell R; Slepian, Marvin J; Huang, Yonggang; Omenetto, Fiorenzo G; Rogers, John A

2012-09-28

A remarkable feature of modern silicon electronics is its ability to remain physically invariant, almost indefinitely for practical purposes. Although this characteristic is a hallmark of applications of integrated circuits that exist today, there might be opportunities for systems that offer the opposite behavior, such as implantable devices that function for medically useful time frames but then completely disappear via resorption by the body. We report a set of materials, manufacturing schemes, device components, and theoretical design tools for a silicon-based complementary metal oxide semiconductor (CMOS) technology that has this type of transient behavior, together with integrated sensors, actuators, power supply systems, and wireless control strategies. An implantable transient device that acts as a programmable nonantibiotic bacteriocide provides a system-level example.

A Physically Transient Form of Silicon Electronics, With Integrated Sensors, Actuators and Power Supply

PubMed Central

Hwang, Suk-Won; Tao, Hu; Kim, Dae-Hyeong; Cheng, Huanyu; Song, Jun-Kyul; Rill, Elliott; Brenckle, Mark A.; Panilaitis, Bruce; Won, Sang Min; Kim, Yun-Soung; Yu, Ki Jun; Ameen, Abid; Li, Rui; Su, Yewang; Yang, Miaomiao; Kaplan, David L.; Zakin, Mitchell R.; Slepian, Marvin J.; Huang, Yonggang; Omenetto, Fiorenzo G.; Rogers, John A.

2013-01-01

A remarkable feature of modern silicon electronics is its ability to remain functionally and physically invariant, almost indefinitely for many practical purposes. Here, we introduce a silicon-based technology that offers the opposite behavior: it gradually vanishes over time, in a well-controlled, programmed manner. Devices that are ‘transient’ in this sense create application possibilities that cannot be addressed with conventional electronics, such as active implants that exist for medically useful timeframes, but then completely dissolve and disappear via resorption by the body. We report a comprehensive set of materials, manufacturing schemes, device components and theoretical design tools for a complementary metal oxide semiconductor (CMOS) electronics of this type, together with four different classes of sensors and actuators in addressable arrays, two options for power supply and a wireless control strategy. A transient silicon device capable of delivering thermal therapy in an implantable mode and its demonstration in animal models illustrate a system-level example of this technology. PMID:23019646

NASA Tech Briefs, September 1997. Volume 21, No. 9

NASA Technical Reports Server (NTRS)

1997-01-01

Topics include: Data Acquisition and Analysis; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences.

40 CFR 98.72 - GHGs to report.

Code of Federal Regulations, 2011 CFR

2011-07-01

... GREENHOUSE GAS REPORTING Ammonia Manufacturing § 98.72 GHGs to report. You must report: (a) CO2 process..., reported for each ammonia manufacturing process unit following the requirements of this subpart (CO2... production, and therefore is not released to the ambient air from the ammonia manufacturing process unit). (b...

40 CFR 98.72 - GHGs to report.

Code of Federal Regulations, 2014 CFR

2014-07-01

... GREENHOUSE GAS REPORTING Ammonia Manufacturing § 98.72 GHGs to report. You must report: (a) CO2 process..., reported for each ammonia manufacturing process unit following the requirements of this subpart (CO2... production, and therefore is not released to the ambient air from the ammonia manufacturing process unit). (b...

40 CFR 98.72 - GHGs to report.

Code of Federal Regulations, 2013 CFR

2013-07-01

... GREENHOUSE GAS REPORTING Ammonia Manufacturing § 98.72 GHGs to report. You must report: (a) CO2 process..., reported for each ammonia manufacturing process unit following the requirements of this subpart (CO2... production, and therefore is not released to the ambient air from the ammonia manufacturing process unit). (b...

40 CFR 98.72 - GHGs to report.

Code of Federal Regulations, 2012 CFR

2012-07-01

... GREENHOUSE GAS REPORTING Ammonia Manufacturing § 98.72 GHGs to report. You must report: (a) CO2 process..., reported for each ammonia manufacturing process unit following the requirements of this subpart (CO2... production, and therefore is not released to the ambient air from the ammonia manufacturing process unit). (b...

Technology transfer from NASA to targeted industries, volume 2

NASA Technical Reports Server (NTRS)

Mccain, Wayne; Schroer, Bernard J.; Souder, William E.; Spann, Mary S.; Watters, Harry; Ziemke, M. Carl

1993-01-01

This volume contains the following materials to support Volume 1: (1) Survey of Metal Fabrication Industry in Alabama; (2) Survey of Electronics Manufacturing/Assembly Industry in Alabama; (3) Apparel Modular Manufacturing Simulators; (4) Synopsis of a Stereolithography Project; (5) Transferring Modular Manufacturing Technology to an Apparel Firm; (6) Letters of Support; (7) Fact Sheets; (8) Publications; and (9) One Stop Access to NASA Technology Brochure.

Near Net Shape Rapid Manufacture & Repair by LENS(registered trademark)

DTIC Science & Technology

2006-05-01

J. Vlcek, “Property Investigation of Laser Cladded , Laser Sintered and Electron Beam Sintered Ti 6Al 4V”, AVT-139 Specialists Meeting on Cost...manufactured from advanced materials such as titanium alloys, superalloys or special steels are critical to the performance of the armed forces...10 years, CAD driven, additive manufacturing technologies have been developed. The leading technology for defence applications is Laser Engineered

Job Prospects for Industrial Engineers.

ERIC Educational Resources Information Center

Basta, Nicholas

1985-01-01

Recent economic growth and improved manufacturing profitability are supporting increased employment for industrial engineers. Promising areas include modernizing manufacturing technology and productivity with large amounts of hiring in aerospace, electronics, and instrumentation. Percentages of women employed in these fields for 1982 and 1983 are…

Dynamometer Facilities | Water Power | NREL

Science.gov Websites

, mechanical or electro-dynamic brakes, power electronics, control systems, and software. Manufacturers and power electronics with the electric grid, to perform accelerated lifetime certification, and to develop

76 FR 58245 - Application(s) for Duty-Free Entry of Scientific Instruments

Federal Register 2010, 2011, 2012, 2013, 2014

2011-09-20

... Laboratory, 480 Cornell Avenue, Upton, New York 11973. Instrument: Electron Microscope. Manufacturer: JEOL... of energy-related matter including superconductors and thermoelectric materials, using electron...

Low cost method for manufacturing a data acquisition system with USB connectivity

NASA Astrophysics Data System (ADS)

Niculescu, V.; Dobre, R. A.; Popovici, E.

2016-06-01

In the process of designing and manufacturing an electronic system the digital oscilloscope plays an essential role but it also represents one of the most expensive equipment present on the typical workbench. In order to make electronic design more accessible to students and hobbyists, an affordable data acquisition system was imagined. The paper extensively presents the development and testing of a low cost, medium speed, data acquisition system which can be used in a wide range of electronic measurement and debugging applications, assuring also great portability due to the small physical dimensions. Each hardware functional block and is thoroughly described, highlighting the challenges that occurred as well as the solutions to overcome them. The entire system was successfully manufactured using high quality components to assure increased reliability, and high frequency PCB materials and techniques were preferred. The measured values determined based on test signals were compared to the ones obtained using a digital oscilloscope available on the market and differences less than 1% were observed.

Additive manufacturing of hybrid circuits

DOE PAGES

Bell, Nelson S.; Sarobol, Pylin; Cook, Adam; ...

2016-03-26

There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enable integration; and must complement the complex shape, low cost, high volume, and high functionality of structural but generally electronically passive additively manufactured components. This article reviews several emerging technologies being used in industry and research/development to provide integration advantages of fabricating multilayer hybrid circuits or devices. First, we review a maskless, noncontact, direct write (DW) technology that excels in the deposition of metallic colloid inks for electrical interconnects.more » Second, we review a complementary technology, aerosol deposition (AD), which excels in the deposition of metallic and ceramic powder as consolidated, thick conformal coatings and is additionally patternable through masking. As a result, we show examples of hybrid circuits/devices integrated beyond 2-D planes, using combinations of DW or AD processes and conventional, established processes.« less

NREL in the News | Transportation Research | NREL

Science.gov Websites

Promises Power Electronics Innovation Wide bandgap (WBG) technology promises to dramatically increase performance, reduce cost, and improve reliability of electronics packaging in electric-drive vehicles and Department's new Manufacturing Innovation Institute for Next Generation Power Electronics to accelerate

Optical power of VCSELs stabilized to 35 ppm/°C without a TEC

NASA Astrophysics Data System (ADS)

Downing, John

2015-03-01

This paper reports a method and system comprising a light source, an electronic method, and a calibration procedure for stabilizing the optical power of vertical-cavity surface-emitting lasers (VCSELs) and laser diodes (LDs) without the use thermoelectric coolers (TECs). The system eliminates the needs for custom interference coatings, polarization adjustments, and the exact alignment required by the optical method reported in 2013 [1]. It can precisely compensate for the effects of temperature and wavelength drift on photodiode responsivity as well as changes in VCSEL beam quality and polarization angle over a 50°C temperature range. Data obtained from light sources built with single-mode polarization-locked VCSELs demonstrate that 30 ppm/°C stability can be readily obtained. The system has advantages over TECstabilized laser modules that include: 1) 90% lower relative RMS optical power and temperature sensitivity, 2) a five-fold enhancement of wall-plug efficiency, 3) less component testing and sorting, 4) lower manufacturing costs, and 5) automated calibration in batches at time of manufacture is practical. The system is ideally suited for battery-powered environmental and in-home medical monitoring applications.

NASA Tech Briefs, September 1999. Volume 23, No. 9

NASA Technical Reports Server (NTRS)

1999-01-01

Topics discussed include: Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences;

Completeness of serious adverse drug event reports received by the US Food and Drug Administration in 2014.

PubMed

Moore, Thomas J; Furberg, Curt D; Mattison, Donald R; Cohen, Michael R

2016-06-01

Adverse drug event reports to the US Food and Drug Administration (FDA) remain the primary tool for identifying serious drug adverse effects without adequate existing warnings. We assessed the completeness of reports the FDA received in 2014. Serious adverse drug event reports were evaluated for whether they included age, gender, event date, and at least one medical term describing the event in computer excerpts. Report sources were direct reports to the FDA, manufacturer expedited reports about events without adequate warnings, and manufacturer periodic reports about events with existing warnings. In 2014, the FDA received 528,192 new case reports indicating a serious or fatal outcome, 25,038 (4.7%) directly from health professionals and consumers, and 503,154 (95.3%) from drug manufacturers. Overall, 21,595 (86.2%) of serious reports submitted directly to the FDA provided data for all four completeness variables, compared with 271,022 (40.4%) of manufacturer expedited reports and 24,988 (51.3%) of periodic reports. Among manufacturer serious reports, 37.9% lacked age and 46.9% had no event date. Performance by 25 manufacturers submitting 5000 or more reports varied from 24.4% complete on all variables to 67% complete. Patient death cases had the lowest completeness scores in all categories. By these measures, report completeness from drug manufacturers was poor compared with direct submissions to the agency. The FDA needs to update reporting requirements and compliance policies to help industry capture better adverse event information from new forms of manufacturer interactions with health professionals and consumers. Copyright © 2016 John Wiley & Sons, Ltd. Copyright © 2016 John Wiley & Sons, Ltd.

Silicon nanowire device and method for its manufacture

DOEpatents

Okandan, Murat; Draper, Bruce L.; Resnick, Paul J.

2017-01-03

There is provided an electronic device and a method for its manufacture. The device comprises an elongate silicon nanowire less than 0.5 .mu.m in cross-sectional dimensions and having a hexagonal cross-sectional shape due to annealing-induced energy relaxation.

75 FR 54232 - Proposed Collection; Comment Request for Report of Covered Pharmaceutical Manufacturers and...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-09-03

... Report of Covered Pharmaceutical Manufacturers and Importers (Form-8947) AGENCY: Internal Revenue Service...)). Currently, the IRS is soliciting comments concerning Form-8947, Report of Covered Pharmaceutical...: Title: Report of Covered Pharmaceutical Manufacturers and Importers. OMB Number: 1545-XXXX. Form Number...

Designing of a Digital Behind-the-Ear Hearing Aid to Meet the World Health Organization Requirements

PubMed Central

Bento, Ricardo Ferreira; Penteado, Silvio Pires

2010-01-01

Hearing loss is a common health issue that affects nearly 10% of the world population as indicated by many international studies. The hearing impaired typically experience more frustration, anxiety, irritability, depression, and disorientation than those with normal hearing levels. The standard rehabilitation tool for hearing impairment is an electronic hearing aid whose main components are transducers (microphone and receiver) and a digital signal processor. These electronic components are manufactured by supply chain rather than by hearing aid manufacturers. Manufacturers can use custom-designed components or generic off-the-shelf components. These electronic components are available as application-specific or off-the-shelf products, with the former designed for a specific manufacturer and the latter for a generic approach. The choice of custom or generic components will affect the product specifications, pricing, manufacturing, life cycle, and marketing strategies of the product. The World Health Organization is interested in making available to developing countries hearing aids that are inexpensive to purchase and maintain. The hearing aid presented in this article was developed with these specifications in mind together with additional contemporary features such as four channels with wide dynamic range compression, an adjustable compression rate for each channel, four comfort programs, an adaptive feedback manager, and full volume control. This digital hearing aid is fitted using a personal computer with minimal hardware requirements in intuitive three-step fitting software. A trimmer-adjusted version can be developed where human and material resources are scarce. PMID:20724354

Designing of a digital behind-the-ear hearing aid to meet the World Health Organization requirements.

PubMed

Bento, Ricardo Ferreira; Penteado, Silvio Pires

2010-06-01

Hearing loss is a common health issue that affects nearly 10% of the world population as indicated by many international studies. The hearing impaired typically experience more frustration, anxiety, irritability, depression, and disorientation than those with normal hearing levels. The standard rehabilitation tool for hearing impairment is an electronic hearing aid whose main components are transducers (microphone and receiver) and a digital signal processor. These electronic components are manufactured by supply chain rather than by hearing aid manufacturers. Manufacturers can use custom-designed components or generic off-the-shelf components. These electronic components are available as application-specific or off-the-shelf products, with the former designed for a specific manufacturer and the latter for a generic approach. The choice of custom or generic components will affect the product specifications, pricing, manufacturing, life cycle, and marketing strategies of the product. The World Health Organization is interested in making available to developing countries hearing aids that are inexpensive to purchase and maintain. The hearing aid presented in this article was developed with these specifications in mind together with additional contemporary features such as four channels with wide dynamic range compression, an adjustable compression rate for each channel, four comfort programs, an adaptive feedback manager, and full volume control. This digital hearing aid is fitted using a personal computer with minimal hardware requirements in intuitive three-step fitting software. A trimmer-adjusted version can be developed where human and material resources are scarce.

Method of forming crystalline silicon devices on glass

DOEpatents

McCarthy, Anthony M.

1995-01-01

A method for fabricating single-crystal silicon microelectronic components on a silicon substrate and transferring same to a glass substrate. This is achieved by utilizing conventional silicon processing techniques for fabricating components of electronic circuits and devices on bulk silicon, wherein a bulk silicon surface is prepared with epitaxial layers prior to the conventional processing. The silicon substrate is bonded to a glass substrate and the bulk silicon is removed leaving the components intact on the glass substrate surface. Subsequent standard processing completes the device and circuit manufacturing. This invention is useful in applications requiring a transparent or insulating substrate, particularly for display manufacturing. Other applications include sensors, actuators, optoelectronics, radiation hard electronics, and high temperature electronics.

In-Process Thermal Imaging of the Electron Beam Freeform Fabrication Process

NASA Technical Reports Server (NTRS)

Taminger, Karen M.; Domack, Christopher S.; Zalameda, Joseph N.; Taminger, Brian L.; Hafley, Robert A.; Burke, Eric R.

2016-01-01

Researchers at NASA Langley Research Center have been developing the Electron Beam Freeform Fabrication (EBF3) metal additive manufacturing process for the past 15 years. In this process, an electron beam is used as a heat source to create a small molten pool on a substrate into which wire is fed. The electron beam and wire feed assembly are translated with respect to the substrate to follow a predetermined tool path. This process is repeated in a layer-wise fashion to fabricate metal structural components. In-process imaging has been integrated into the EBF3 system using a near-infrared (NIR) camera. The images are processed to provide thermal and spatial measurements that have been incorporated into a closed-loop control system to maintain consistent thermal conditions throughout the build. Other information in the thermal images is being used to assess quality in real time by detecting flaws in prior layers of the deposit. NIR camera incorporation into the system has improved the consistency of the deposited material and provides the potential for real-time flaw detection which, ultimately, could lead to the manufacture of better, more reliable components using this additive manufacturing process.

A content analysis of electronic cigarette manufacturer websites in China.

PubMed

Yao, Tingting; Jiang, Nan; Grana, Rachel; Ling, Pamela M; Glantz, Stanton A

2016-03-01

The goal of this study was to summarise the websites of electronic cigarette (e-cigarette) manufacturers in China and describe how they market their products. From March to April 2013, we used two search keywords 'electronic cigarette' (Dian Zi Xiang Yan in Chinese) and 'manufacturer' (Sheng Chan Chang Jia in Chinese) to search e-cigarette manufacturers in China on Alibaba, an internet-based e-commerce business that covers business-to-business online marketplaces, retail and payment platforms, shopping search engine and data-centric cloud computing services. A total of 18 websites of 12 e-cigarette manufacturers in China were analysed by using a coding guide which includes 14 marketing claims. Health-related benefits were claimed most frequently (89%), followed by the claims of no secondhand smoke (SHS) exposure (78%), and utility for smoking cessation (67%). A wide variety of flavours, celebrity endorsements and e-cigarettes specifically for women were presented. None of the websites had any age restriction on access, references to government regulation or lawsuits. Instruction on how to use e-cigarettes was on 17% of the websites. Better regulation of e-cigarette marketing messages on manufacturers' websites is needed in China. The frequent claims of health benefits, smoking cessation, strategies appealing to youth and women are concerning, especially targeting women. Regulators should prohibit marketing claims of health benefits, no SHS exposure and value for smoking cessation in China until health-related, quality and safety issues have been adequately addressed. To avoid e-cigarette use for initiation to nicotine addiction, messages targeting youth and women should be prohibited. Published by the BMJ Publishing Group Limited. For permission to use (where not already granted under a licence) please go to http://www.bmj.com/company/products-services/rights-and-licensing/

Atomic layer deposition on polymer fibers and fabrics for multifunctional and electronic textiles

DOE Office of Scientific and Technical Information (OSTI.GOV)

Brozena, Alexandra H.; Oldham, Christopher J.; Parsons, Gregory N., E-mail: gnp@ncsu.edu

Textile materials, including woven cotton, polymer knit fabrics, and synthetic nonwoven fiber mats, are being explored as low-cost, flexible, and light-weight platforms for wearable electronic sensing, communication, energy generation, and storage. The natural porosity and high surface area in textiles is also useful for new applications in environmental protection, chemical decontamination, pharmaceutical and chemical manufacturing, catalytic support, tissue regeneration, and others. These applications raise opportunities for new chemistries, chemical processes, biological coupling, and nanodevice systems that can readily combine with textile manufacturing to create new “multifunctional” fabrics. Atomic layer deposition (ALD) has a unique ability to form highly uniform andmore » conformal thin films at low processing temperature on nonuniform high aspect ratio surfaces. Recent research shows how ALD can coat, modify, and otherwise improve polymer fibers and textiles by incorporating new materials for viable electronic and other multifunctional capabilities. This article provides a current overview of the understanding of ALD coating and modification of textiles, including current capabilities and outstanding problems, with the goal of providing a starting point for further research and advances in this field. After a brief introduction to textile materials and current textile treatment methods, the authors discuss unique properties of ALD-coated textiles, followed by a review of recent electronic and multifunctional textiles that use ALD coatings either as direct functional components or as critical nucleation layers for active materials integration. The article concludes with possible future directions for ALD on textiles, including the challenges in materials, manufacturing, and manufacturing integration that must be overcome for ALD to reach its full potential in electronic and other emerging multifunctional textile systems.« less

75 FR 43918 - National Center for Toxicological Research, et al.; Notice of Consolidated Decision on...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-07-27

... Research, et al.; Notice of Consolidated Decision on Applications for Duty-Free Entry of Electron...: National Center for Toxicological Research, (USFDA), Jefferson, AK 72079. Instrument: Electron Microscope.... Applicant: University of Virginia, Charlottesville, VA 22903. Instrument: Electron Microscope. Manufacturer...

The Chemical Modeling of Electronic Materials and Interconnections

NASA Astrophysics Data System (ADS)

Kivilahti, J. K.

2002-12-01

Thermodynamic and kinetic modeling, together with careful experimental work, is of great help for developing new electronic materials such as lead-free solders, their compatible metallizations and diffusion-barrier layers, as well as joining and bonding processes for advanced electronics manufacturing. When combined, these modeling techniques lead to a rationalization of the trial-and-error methods employed in the electronics industry, limiting experimentation and, thus, reducing significantly time-to-market of new products. This modeling provides useful information on the stabilities of phases (microstructures), driving forces for chemical reactions, and growth rates of reaction products occurring in interconnections or thin-film structures during processing, testing, and in longterm use of electronic devices. This is especially important when manufacturing advanced lead-free electronics where solder joint volumes are decreasing while the number of dissimilar reactive materials is increasing markedly. Therefore, a new concept of local nominal composition was introduced and applied together with the relevant ternary and multicomponent phase diagrams to some solder/conductor systems.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Horowitz, Kelsey A; Bench Reese, Samantha R; Remo, Timothy W

This brochure, published as an annual research highlight of the Clean Energy Manufacturing Analysis Center (CEMAC), summarizes CEMAC analysis of silicon carbide (SiC) power electronics for variable frequency motor drives. The key finding presented is that variations in manufacturing expertise, yields, and access to existing facilities impact regional costs and manufacturing location decisions for SiC ingots, wafers, chips, and power modules more than do core country-specific factors such as labor and electricity costs.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sandor, Debra; Chung, Donald; Keyser, David

This report documents the CEMAC methodologies for developing and reporting annual global clean energy manufacturing benchmarks. The report reviews previously published manufacturing benchmark reports and foundational data, establishes a framework for benchmarking clean energy technologies, describes the CEMAC benchmark analysis methodologies, and describes the application of the methodologies to the manufacturing of four specific clean energy technologies.

27 CFR 40.522 - Reports.

Code of Federal Regulations, 2012 CFR

2012-04-01

... 27 Alcohol, Tobacco Products and Firearms 2 2012-04-01 2011-04-01 true Reports. 40.522 Section 40... TOBACCO Manufacture of Processed Tobacco Operations by Manufacturers of Processed Tobacco § 40.522 Reports. (a) General. Every manufacturer of processed tobacco must prepare a monthly report on TTB F 5250.1 in...

27 CFR 40.522 - Reports.

Code of Federal Regulations, 2011 CFR

2011-04-01

... 27 Alcohol, Tobacco Products and Firearms 2 2011-04-01 2011-04-01 false Reports. 40.522 Section 40... TOBACCO Manufacture of Processed Tobacco Operations by Manufacturers of Processed Tobacco § 40.522 Reports. (a) General. Every manufacturer of processed tobacco must prepare a monthly report on TTB F 5250.1 in...

27 CFR 40.522 - Reports.

Code of Federal Regulations, 2013 CFR

2013-04-01

... 27 Alcohol, Tobacco Products and Firearms 2 2013-04-01 2013-04-01 false Reports. 40.522 Section 40... TOBACCO Manufacture of Processed Tobacco Operations by Manufacturers of Processed Tobacco § 40.522 Reports. (a) General. Every manufacturer of processed tobacco must prepare a monthly report on TTB F 5250.1 in...

EUV process establishment through litho and etch for N7 node

NASA Astrophysics Data System (ADS)

Kuwahara, Yuhei; Kawakami, Shinichiro; Kubota, Minoru; Matsunaga, Koichi; Nafus, Kathleen; Foubert, Philippe; Mao, Ming

2016-03-01

Extreme ultraviolet lithography (EUVL) technology is steadily reaching high volume manufacturing for 16nm half pitch node and beyond. However, some challenges, for example scanner availability and resist performance (resolution, CD uniformity (CDU), LWR, etch behavior and so on) are remaining. Advance EUV patterning on the ASML NXE:3300/ CLEAN TRACK LITHIUS Pro Z- EUV litho cluster is launched at imec, allowing for finer pitch patterns for L/S and CH. Tokyo Electron Ltd. and imec are continuously collabo rating to develop manufacturing quality POR processes for NXE:3300. TEL's technologies to enhance CDU, defectivity and LWR/LER can improve patterning performance. The patterning is characterized and optimized in both litho and etch for a more complete understanding of the final patterning performance. This paper reports on post-litho CDU improvement by litho process optimization and also post-etch LWR reduction by litho and etch process optimization.

QRev—Software for computation and quality assurance of acoustic doppler current profiler moving-boat streamflow measurements—Technical manual for version 2.8

USGS Publications Warehouse

Mueller, David S.

2016-06-21

The software program, QRev applies common and consistent computational algorithms combined with automated filtering and quality assessment of the data to improve the quality and efficiency of streamflow measurements and helps ensure that U.S. Geological Survey streamflow measurements are consistent, accurate, and independent of the manufacturer of the instrument used to make the measurement. Software from different manufacturers uses different algorithms for various aspects of the data processing and discharge computation. The algorithms used by QRev to filter data, interpolate data, and compute discharge are documented and compared to the algorithms used in the manufacturers’ software. QRev applies consistent algorithms and creates a data structure that is independent of the data source. QRev saves an extensible markup language (XML) file that can be imported into databases or electronic field notes software. This report is the technical manual for version 2.8 of QRev.

Piezoresistive Sensor with High Elasticity Based on 3D Hybrid Network of Sponge@CNTs@Ag NPs.

PubMed

Zhang, Hui; Liu, Nishuang; Shi, Yuling; Liu, Weijie; Yue, Yang; Wang, Siliang; Ma, Yanan; Wen, Li; Li, Luying; Long, Fei; Zou, Zhengguang; Gao, Yihua

2016-08-31

Pressure sensors with high elasticity are in great demand for the realization of intelligent sensing, but there is a need to develope a simple, inexpensive, and scalable method for the manufacture of the sensors. Here, we reported an efficient, simple, facile, and repeatable "dipping and coating" process to manufacture a piezoresistive sensor with high elasticity, based on homogeneous 3D hybrid network of carbon nanotubes@silver nanoparticles (CNTs@Ag NPs) anchored on a skeleton sponge. Highly elastic, sensitive, and wearable sensors are obtained using the porous structure of sponge and the synergy effect of CNTs/Ag NPs. Our sensor was also tested for over 2000 compression-release cycles, exhibiting excellent elasticity and cycling stability. Sensors with high performance and a simple fabrication process are promising devices for commercial production in various electronic devices, for example, sport performance monitoring and man-machine interfaces.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Afanas'ev, Yurii V; Zavestovskaya, I N; Zvorykin, V D

A review of reports made on the International Forum on Advanced High-Power Lasers and Applications, which was held at the beginning of November 1999 in Osaka (Japan), is presented. Five conferences were held during the forum on High-Power Laser Ablation, High-Power Lasers in Energy Engineering, High-Power Lasers in Civil Engineering and Architecture, High-Power Lasers in Manufacturing, and Advanced High-Power Lasers. The following trends in the field of high-power lasers and their applications were presented: laser fusion, laser applications in space, laser-triggered lightning, laser ablation of materials by short and ultrashort pulses, application of high-power lasers in manufacturing, application of high-powermore » lasers in mining, laser decommissioning and decontamination of nuclear reactors, high-power solid-state and gas lasers, x-ray and free-electron lasers. One can find complete information on the forum in SPIE, vols. 3885-3889. (chronicle)« less

21 CFR 211.68 - Automatic, mechanical, and electronic equipment.

Code of Federal Regulations, 2010 CFR

2010-04-01

... SERVICES (CONTINUED) DRUGS: GENERAL CURRENT GOOD MANUFACTURING PRACTICE FOR FINISHED PHARMACEUTICALS... satisfactorily, may be used in the manufacture, processing, packing, and holding of a drug product. If such... designed to assure proper performance. Written records of those calibration checks and inspections shall be...

Manufacture and quality control of interconnecting wire harnesses

NASA Technical Reports Server (NTRS)

1973-01-01

Four-volume series of documents has been prepared as standard reference. Each volume may be used separately and covers wire and cable preparation as well as harness fabrication and installation. Series should be useful addition to libraries of manufactures of electrical and electronic equipment.

A hybrid life cycle inventory of nano-scale semiconductor manufacturing.

PubMed

Krishnan, Nikhil; Boyd, Sarah; Somani, Ajay; Raoux, Sebastien; Clark, Daniel; Dornfeld, David

2008-04-15

The manufacturing of modern semiconductor devices involves a complex set of nanoscale fabrication processes that are energy and resource intensive, and generate significant waste. It is important to understand and reduce the environmental impacts of semiconductor manufacturing because these devices are ubiquitous components in electronics. Furthermore, the fabrication processes used in the semiconductor industry are finding increasing application in other products, such as microelectromechanical systems (MEMS), flat panel displays, and photovoltaics. In this work we develop a library of typical gate-to-gate materials and energy requirements, as well as emissions associated with a complete set of fabrication process models used in manufacturing a modern microprocessor. In addition, we evaluate upstream energy requirements associated with chemicals and materials using both existing process life cycle assessment (LCA) databases and an economic input-output (EIO) model. The result is a comprehensive data set and methodology that may be used to estimate and improve the environmental performance of a broad range of electronics and other emerging applications that involve nano and micro fabrication.

40 CFR 712.28 - Form and instructions.

Code of Federal Regulations, 2014 CFR

2014-07-01

... submitted for each plant site manufacturing the chemical substance. (c) Persons authorized to report... plant site reported. (5) The plant site activities, such as the manufacturing of a chemical substance... ACT CHEMICAL INFORMATION RULES Manufacturers Reporting-Preliminary Assessment Information § 712.28...

Approaches to eliminating chlorofluorocarbon use in manufacturing.

PubMed Central

Boyhan, W S

1992-01-01

Until quite recently, chlorofluorocarbons (CFCs) had been considered the safest and most benign of industrial chemicals. Their physical and chemical properties made them an integral part of manufacturing processes for electronics products. The recognition that CFCs destroy the stratospheric ozone layer, with consequent enormous consequences to all forms of life on earth, has led to international agreements which will end virtually all possibly before. This impending phaseout of CFCs has caused electronics manufacturers to examine alternative chemicals and processing methods. This manuscript documents the steps AT&T has taken to reach its goal of 100% phaseout of CFCs by years-end 1994. These actions include top-down management support with combined bottom-up thrusts, an internal information gathering and dissemination center, internal technology transfer, and external corporate activism. Images PMID:11607258

Development and study of the displaced foam dispersion methodology for the manufacture of multiscale/hybrid composites

NASA Astrophysics Data System (ADS)

McCrary-Dennis, Micah C. L.

Incorporating nanostructured functional constituents within polymers has become extensive in processes and products for manufacturing composites. The conception of carbon nanotubes (CNTs) and their heralded attributes yielding property enhancements to the carrier system is leading many industries and research endeavors. Displaced Foam Dispersion (DFD) methodology is a novel and effective approach to facilitating the incorporation of CNTs within fiber reinforced polymer composites (FRPC). The methodology consists of six separate solubility phases that lead to the manufacture of CNT-FRPCs (also termed hybrid/multiscale composites). This study was primarily initiated to characterize the interaction parameters of nanomaterials (multiwall carbon nanotubes), polymers (polystyrene), and solvents (dimethyl formamide (DMF) and acetone) in the current paradigm of the DFD materials manufacture. Secondly, we sought to illustrate the theoretical potential for the methodology to be used in conjunction with other nanomaterial-polymer-solvent systems. Herein, the theory of Hansen's solubility parameters (HSP) is employed to explain the DFD constituents manufacturing combination parameters and aid in the explanation of the experimental results. The results illustrate quantitative values for the relative energy differences between each polymer-solvent system. Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) were used to characterize the multiwalled carbon nanotubes (MWCNTs) in each of the solubility stages and culminates with an indication of good dispersion potential in the final multiscale composite. Additionally, acetone absorption, evaporation mass loss and retention are reported for the sorbed plasticized PS-CNT (CNTaffy) nanocomposites that has successfully achieved up through approximately 60 weight percent loading. The findings indicate that as CNT loading percentage increases the acetone absorbency also increases, but the materials retention of acetone over time decreases. This directly influences the manufacturability of the porous polymer nanocomposite (P-PNC) in the DFD methodology. Localized interlaminar CNT enrichment was achieved through 60 wt. % loading within the P-PNC and verified under two-electrode electrical conductivity testing of the final multiscale composite. The electrical properties of low weight percent (approximately 0.15 - 2.5 wt. %) nanomaterials show a decreasing trend in the materials' resistivity that indicates the ability to become increasingly conductive with increasing CNT loadings. Finally, the mechanical properties will show evidence of toughness, increased strain to failure, and the potential for greater energy absorption.

46 CFR 52.01-145 - Manufacturers' data report forms (modifies PG-112 and PG-113).

Code of Federal Regulations, 2012 CFR

2012-10-01

... 46 Shipping 2 2012-10-01 2012-10-01 false Manufacturers' data report forms (modifies PG-112 and PG-113). 52.01-145 Section 52.01-145 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) MARINE ENGINEERING POWER BOILERS General Requirements § 52.01-145 Manufacturers' data report forms (modifies PG-112 and PG-113). The manufacturers'...

46 CFR 52.01-145 - Manufacturers' data report forms (modifies PG-112 and PG-113).

Code of Federal Regulations, 2010 CFR

2010-10-01

... 46 Shipping 2 2010-10-01 2010-10-01 false Manufacturers' data report forms (modifies PG-112 and PG-113). 52.01-145 Section 52.01-145 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) MARINE ENGINEERING POWER BOILERS General Requirements § 52.01-145 Manufacturers' data report forms (modifies PG-112 and PG-113). The manufacturers'...

46 CFR 52.01-145 - Manufacturers' data report forms (modifies PG-112 and PG-113).

Code of Federal Regulations, 2011 CFR

2011-10-01

... 46 Shipping 2 2011-10-01 2011-10-01 false Manufacturers' data report forms (modifies PG-112 and PG-113). 52.01-145 Section 52.01-145 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) MARINE ENGINEERING POWER BOILERS General Requirements § 52.01-145 Manufacturers' data report forms (modifies PG-112 and PG-113). The manufacturers'...

46 CFR 52.01-145 - Manufacturers' data report forms (modifies PG-112 and PG-113).

Code of Federal Regulations, 2013 CFR

2013-10-01

... 46 Shipping 2 2013-10-01 2013-10-01 false Manufacturers' data report forms (modifies PG-112 and PG-113). 52.01-145 Section 52.01-145 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) MARINE ENGINEERING POWER BOILERS General Requirements § 52.01-145 Manufacturers' data report forms (modifies PG-112 and PG-113). The manufacturers'...

46 CFR 52.01-145 - Manufacturers' data report forms (modifies PG-112 and PG-113).

Code of Federal Regulations, 2014 CFR

2014-10-01

... 46 Shipping 2 2014-10-01 2014-10-01 false Manufacturers' data report forms (modifies PG-112 and PG-113). 52.01-145 Section 52.01-145 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) MARINE ENGINEERING POWER BOILERS General Requirements § 52.01-145 Manufacturers' data report forms (modifies PG-112 and PG-113). The manufacturers'...

40 CFR 712.25 - Exempt manufacturers and importers.

Code of Federal Regulations, 2012 CFR

2012-07-01

... (1100 pounds) of the chemical substance at a single plant site are not subject to reporting for that... SUBSTANCES CONTROL ACT CHEMICAL INFORMATION RULES Manufacturers Reporting-Preliminary Assessment Information § 712.25 Exempt manufacturers and importers. (a) Persons who manufactured or imported the chemical...

40 CFR 712.25 - Exempt manufacturers and importers.

Code of Federal Regulations, 2013 CFR

2013-07-01

... (1100 pounds) of the chemical substance at a single plant site are not subject to reporting for that... SUBSTANCES CONTROL ACT CHEMICAL INFORMATION RULES Manufacturers Reporting-Preliminary Assessment Information § 712.25 Exempt manufacturers and importers. (a) Persons who manufactured or imported the chemical...

40 CFR 712.25 - Exempt manufacturers and importers.

Code of Federal Regulations, 2011 CFR

2011-07-01

... (1100 pounds) of the chemical substance at a single plant site are not subject to reporting for that... SUBSTANCES CONTROL ACT CHEMICAL INFORMATION RULES Manufacturers Reporting-Preliminary Assessment Information § 712.25 Exempt manufacturers and importers. (a) Persons who manufactured or imported the chemical...

40 CFR 712.25 - Exempt manufacturers and importers.

Code of Federal Regulations, 2014 CFR

2014-07-01

... (1100 pounds) of the chemical substance at a single plant site are not subject to reporting for that... SUBSTANCES CONTROL ACT CHEMICAL INFORMATION RULES Manufacturers Reporting-Preliminary Assessment Information § 712.25 Exempt manufacturers and importers. (a) Persons who manufactured or imported the chemical...

NanoElectronics and BioElectronics

NASA Technical Reports Server (NTRS)

Srivastava, Deepak

2001-01-01

This viewgraph presentation reviews the use of Carbon Nanotube electronics in the bioelectronics. Included is a brief review of the carbon nanotube manufacturing, the use of carbon nanotubes in Atomic Force Microscopy (AFM), and Computational Nanotechnology, that allows designers to understand nanotube characteristics and serves as a design tool.

Microcircuit testing and fabrication, using scanning electron microscopes

NASA Technical Reports Server (NTRS)

Nicolas, D. P.

1975-01-01

Scanning electron microscopes are used to determine both user-induced damages and manufacturing defects subtle enough to be missed by conventional light microscopy. Method offers greater depth of field and increased working distances.

77 FR 55185 - Application(s) for Duty-Free Entry of Scientific Instruments

Federal Register 2010, 2011, 2012, 2013, 2014

2012-09-07

..., 100 Nicolls Rd., Stony Brook, NY 11794. Instrument: Electron Microscope. Manufacturer: JEOL Ltd... of the Dean of Science, Marshak 1320 160 Convent Ave., New York, NY 10031. Instrument: Electron...

77 FR 55185 - Application(s) for Duty-Free Entry of Scientific Instruments

Federal Register 2010, 2011, 2012, 2013, 2014

2012-09-07

..., 100 Nicolls Rd., Stony Brook, NY 11794. Instrument: Electron Microscope. Manufacturer: JEOL Ltd... of the Dean of Science, Marshak 1320, 160 Convent Ave., New York, NY 10031. Instrument: Electron...

Epidermal electronic systems for sensing and therapy

NASA Astrophysics Data System (ADS)

Lu, Nanshu; Ameri, Shideh K.; Ha, Taewoo; Nicolini, Luke; Stier, Andrew; Wang, Pulin

2017-04-01

Epidermal electronic system is a class of hair thin, skin soft, stretchable sensors and electronics capable of continuous and long-term physiological sensing and clinical therapy when applied on human skin. The high cost of manpower, materials, and photolithographic facilities associated with its manufacture limit the availability of disposable epidermal electronics. We have invented a cost and time effective, completely dry, benchtop "cut-and-paste" method for the green, freeform and portable manufacture of epidermal electronics within minutes. We have applied the "cut-and-paste" method to manufacture epidermal electrodes, hydration and temperature sensors, conformable power-efficient heaters, as well as cuffless continuous blood pressure monitors out of metal thin films, two-dimensional (2D) materials, and piezoelectric polymer sheets. For demonstration purpose, we will discuss three examples of "cut-and-pasted" epidermal electronic systems in this paper. The first will be submicron thick, transparent epidermal graphene electrodes that can be directly transferred to human skin like a temporary transfer tattoo and can measure electrocardiogram (ECG) with signal-to-noise ratio and motion artifacts on par with conventional gel electrodes. The second will be a chest patch which houses both electrodes and pressure sensors for the synchronous measurements of ECG and seismocardiogram (SCG) such that beat-to-beat blood pressure can be inferred from the time interval between the R peak of the ECG and the AC peak of the SCG. The last example will be a highly conformable, low power consumption epidermal heater for thermal therapy.

49 CFR 579.27 - Reporting requirements for manufacturers of fewer than 100 buses annually, for manufacturers of...

Code of Federal Regulations, 2013 CFR

2013-10-01

... 49 Transportation 7 2013-10-01 2013-10-01 false Reporting requirements for manufacturers of fewer than 100 buses annually, for manufacturers of fewer than 500 emergency vehicles annually, for manufacturers of fewer than 5,000 light vehicles, medium-heavy vehicles (other than buses and emergency vehicles), motorcycles or trailers annually, for...

49 CFR 579.27 - Reporting requirements for manufacturers of fewer than 100 buses annually, for manufacturers of...

Code of Federal Regulations, 2011 CFR

2011-10-01

... 49 Transportation 7 2011-10-01 2011-10-01 false Reporting requirements for manufacturers of fewer than 100 buses annually, for manufacturers of fewer than 500 emergency vehicles annually, for manufacturers of fewer than 5,000 light vehicles, medium-heavy vehicles (other than buses and emergency vehicles), motorcycles or trailers annually, for...

49 CFR 579.27 - Reporting requirements for manufacturers of fewer than 100 buses annually, for manufacturers of...

Code of Federal Regulations, 2014 CFR

2014-10-01

... 49 Transportation 7 2014-10-01 2014-10-01 false Reporting requirements for manufacturers of fewer than 100 buses annually, for manufacturers of fewer than 500 emergency vehicles annually, for manufacturers of fewer than 5,000 light vehicles, medium-heavy vehicles (other than buses and emergency vehicles), motorcycles or trailers annually, for...

49 CFR 579.27 - Reporting requirements for manufacturers of fewer than 100 buses annually, for manufacturers of...

Code of Federal Regulations, 2012 CFR

2012-10-01

... 49 Transportation 7 2012-10-01 2012-10-01 false Reporting requirements for manufacturers of fewer than 100 buses annually, for manufacturers of fewer than 500 emergency vehicles annually, for manufacturers of fewer than 5,000 light vehicles, medium-heavy vehicles (other than buses and emergency vehicles), motorcycles or trailers annually, for...

Small Aircraft RF Interference Path Loss

NASA Technical Reports Server (NTRS)

Nguyen, Truong X.; Koppen, Sandra V.; Ely, Jay J.; Szatkowski, George N.; Mielnik, John J.; Salud, Maria Theresa P.

2007-01-01

Interference to aircraft radio receivers is an increasing concern as more portable electronic devices are allowed onboard. Interference signals are attenuated as they propagate from inside the cabin to aircraft radio antennas mounted on the outside of the aircraft. The attenuation level is referred to as the interference path loss (IPL) value. Significant published IPL data exists for transport and regional category airplanes. This report fills a void by providing data for small business/corporate and general aviation aircraft. In this effort, IPL measurements are performed on ten small aircraft of different designs and manufacturers. Multiple radio systems are addressed. Along with the typical worst-case coupling values, statistical distributions are also reported that could lead to better interference risk assessment.

Hybrid stretchable circuits on silicone substrate

DOE Office of Scientific and Technical Information (OSTI.GOV)

Robinson, A., E-mail: adam.1.robinson@nokia.com; Aziz, A., E-mail: a.aziz1@lancaster.ac.uk; Liu, Q.

When rigid and stretchable components are integrated onto a single elastic carrier substrate, large strain heterogeneities appear in the vicinity of the deformable-non-deformable interfaces. In this paper, we report on a generic approach to manufacture hybrid stretchable circuits where commercial electronic components can be mounted on a stretchable circuit board. Similar to printed circuit board development, the components are electrically bonded on the elastic substrate and interconnected with stretchable electrical traces. The substrate—a silicone matrix carrying concentric rigid disks—ensures both the circuit elasticity and the mechanical integrity of the most fragile materials.

Tantalum recycling in the United States in 1998

USGS Publications Warehouse

Cunningham, Larry D.

2001-01-01

This report describes the flow of tantalum in the United States in 1998 with emphasis on the extent to which tantalum was recycled/reused. Tantalum was mostly recycled from new scrap that was generated during the manufacture of tantalum-related electronic components and new and old scrap products of tantalum-containing cemented carbides and superalloys. In 1998, about 210 metric tons of tantalum was recycled/reused, with about 43% derived from old scrap. The tantalum recycling rate was calculated to be 21%, and tantalum scrap recycling efficiency, 35%.

Application of ICME Methods for the Development of Rapid Manufacturing Technologies

NASA Astrophysics Data System (ADS)

Maiwald-Immer, T.; Göhler, T.; Fischersworring-Bunk, A.; Körner, C.; Osmanlic, F.; Bauereiß, A.

Rapid manufacturing technologies are lately gaining interest as alternative manufacturing method. Due to the large parameter sets applicable in these manufacturing methods and their impact on achievable material properties and quality, support of the manufacturing process development by the use of simulation is highly attractive. This is especially true for aerospace applications with their high quality demands and controlled scatter in the resulting material properties. The applicable simulation techniques to these manufacturing methods are manifold. The paper will focus on the melt pool simulation for a SLM (selective laser melting) process which was originally developed for EBM (electron beam melting). It will be discussed in the overall context of a multi-scale simulation within a virtual process chain.

49 CFR 585.76 - Reporting requirements.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 31, 2014, each manufacturer choosing to certify vehicles manufactured during any of those production... August 31, 2014, each manufacturer shall submit a report to the National Highway Traffic Safety...

40 CFR 712.20 - Manufacturers and importers who must report.

Code of Federal Regulations, 2010 CFR

2010-07-01

... SUBSTANCES CONTROL ACT CHEMICAL INFORMATION RULES Manufacturers Reporting-Preliminary Assessment Information... chemical substance is listed in § 712.3, the following persons must submit the “Manufacturer's Report—Preliminary Assessment Information” (as described in § 712.28) for each plant site at which they manufactured...

40 CFR 712.20 - Manufacturers and importers who must report.

Code of Federal Regulations, 2011 CFR

2011-07-01

... SUBSTANCES CONTROL ACT CHEMICAL INFORMATION RULES Manufacturers Reporting-Preliminary Assessment Information... chemical substance is listed in § 712.3, the following persons must submit the “Manufacturer's Report—Preliminary Assessment Information” (as described in § 712.28) for each plant site at which they manufactured...

40 CFR 712.20 - Manufacturers and importers who must report.

Code of Federal Regulations, 2014 CFR

2014-07-01

... SUBSTANCES CONTROL ACT CHEMICAL INFORMATION RULES Manufacturers Reporting-Preliminary Assessment Information... chemical substance is listed in § 712.3, the following persons must submit the “Manufacturer's Report—Preliminary Assessment Information” (as described in § 712.28) for each plant site at which they manufactured...

40 CFR 712.20 - Manufacturers and importers who must report.

Code of Federal Regulations, 2012 CFR

2012-07-01

... SUBSTANCES CONTROL ACT CHEMICAL INFORMATION RULES Manufacturers Reporting-Preliminary Assessment Information... chemical substance is listed in § 712.3, the following persons must submit the “Manufacturer's Report—Preliminary Assessment Information” (as described in § 712.28) for each plant site at which they manufactured...

40 CFR 712.20 - Manufacturers and importers who must report.

Code of Federal Regulations, 2013 CFR

2013-07-01

... SUBSTANCES CONTROL ACT CHEMICAL INFORMATION RULES Manufacturers Reporting-Preliminary Assessment Information... chemical substance is listed in § 712.3, the following persons must submit the “Manufacturer's Report—Preliminary Assessment Information” (as described in § 712.28) for each plant site at which they manufactured...

21 CFR 111.25 - What are the requirements under this subpart D for written procedures?

Code of Federal Regulations, 2012 CFR

2012-04-01

... MANUFACTURING, PACKAGING, LABELING, OR HOLDING OPERATIONS FOR DIETARY SUPPLEMENTS Equipment and Utensils § 111... dietary supplement; (b) Calibrating, inspecting, and checking automated, mechanical, and electronic... other contact surfaces that are used to manufacture, package, label, or hold components or dietary...

21 CFR 111.25 - What are the requirements under this subpart D for written procedures?

Code of Federal Regulations, 2014 CFR

2014-04-01

... MANUFACTURING, PACKAGING, LABELING, OR HOLDING OPERATIONS FOR DIETARY SUPPLEMENTS Equipment and Utensils § 111... dietary supplement; (b) Calibrating, inspecting, and checking automated, mechanical, and electronic... other contact surfaces that are used to manufacture, package, label, or hold components or dietary...

ENABLING COMMERCIALIZATION OF A LEAD-FREE COATING MANUFACTURING PROCESS - PHASE I

EPA Science Inventory

This Phase I SBIR program addresses the need for a manufacturing process that enables high reliability Pb-free tin coatings. Pb-free tin solders used in electronics applications have demonstrated whisker growth, due in part to compressive stresses within the deposit, causing ...

The Plight of Manufacturing: What Can Be Done?

ERIC Educational Resources Information Center

Cyert, Richard M.

1985-01-01

Proposes that full automation is the best current option for the United States' manufacturing industries. Advocates increased use of electronics, robotics, and computers in the establishment of unmanned factories. Implications of this movement are examined in terms of labor, management, and the structure of the economy. (ML)

78 FR 67048 - Prothioconazole; Pesticide Tolerances

Federal Register 2010, 2011, 2012, 2013, 2014

2013-11-08

... code 111). Animal production (NAICS code 112). Food manufacturing (NAICS code 311). Pesticide manufacturing (NAICS code 32532). B. How can I get electronic access to other related information? You may... Assessment and Determination of Safety Section 408(b)(2)(A)(i) of FFDCA allows EPA to establish a tolerance...

Manufacturing Advantage: Why High-Performance Work Systems Pay Off.

ERIC Educational Resources Information Center

Appelbaum, Eileen; Bailey, Thomas; Berg, Peter; Kalleberg, Arne L.

A study examined the relationship between high-performance workplace practices and the performance of plants in the following manufacturing industries: steel, apparel, and medical electronic instruments and imaging. The multilevel research methodology combined the following data collection activities: (1) site visits; (2) collection of plant…

An assessment technique for computer-socket manufacturing

PubMed Central

Sanders, Joan; Severance, Michael

2015-01-01

An assessment strategy is presented for testing the quality of carving and forming of individual computer aided manufacturing facilities. The strategy is potentially useful to facilities making sockets and companies marketing manufacturing equipment. To execute the strategy, an evaluator fabricates a collection of test models and sockets using the manufacturing suite under evaluation, and then measures their shapes using scanning equipment. Overall socket quality is assessed by comparing socket shapes with electronic file shapes. Then model shapes are compared with electronic file shapes to characterize carving performance. Socket shapes are compared with model shapes to characterize forming performance. The mean radial error (MRE), which is the average difference in radii between the two shapes being compared, provides insight into sizing quality. Inter-quartile range (IQR), the range of radial error for the best matched half of the points on the surfaces being compared, provides insight into shape quality. By determining MRE and IQR for carving and forming separately, the source(s) of socket shape error may be pinpointed. The developed strategy may provide a useful tool to the prosthetics community and industry to help identify problems and limitations in computer aided manufacturing and insight into appropriate modifications to overcome them. PMID:21938663

Polymer multimode waveguide optical and electronic PCB manufacturing

NASA Astrophysics Data System (ADS)

Selviah, David R.

2009-02-01

The paper describes the research in the Â#1.3 million IeMRC Integrated Optical and Electronic Interconnect PCB Manufacturing (OPCB) Flagship Project in which 8 companies and 3 universities carry out collaborative research and which was formed and is technically led by the author. The consortium's research is aimed at investigating a range of fabrication techniques, some established and some novel, for fabricating polymer multimode waveguides from several polymers, some formulations of which are being developed within the project. The challenge is to develop low cost waveguide manufacturing techniques compatible with commercial PCB manufacturing and to reduce their alignment cost. The project aims to take the first steps in making this hybrid optical waveguide and electrical copper track printed circuit board disruptive technology widely available by establishing and incorporating waveguide design rules into commercial PCB layout software and transferring the technology for fabricating such boards to a commercial PCB manufacturer. To focus the research the project is designing an optical waveguide backplane to tight realistic constraints, using commercial layout software with the new optical design rules, for a demonstrator into which 4 daughter cards are plugged, each carrying an aggregate of 80 Gb/s data so that each waveguide carries 10 Gb/s.

Fabricating specialised orthopaedic implants using additive manufacturing

NASA Astrophysics Data System (ADS)

Unwin, Paul

2014-03-01

It has been hypothesised that AM is ideal for patient specific orthopaedic implants such as those used in bone cancer treatment, that can rapidly build structures such as lattices for bone and tissues to in-grow, that would be impossible using current conventional subtractive manufacturing techniques. The aim of this study was to describe the adoption of AM (direct metal laser sintering and electron beam melting) into the design manufacturing and post-manufacturing processes and the early clinical use. Prior to the clinical use of AM implants, extensive metallurgical and mechanical testing of both laser and electron beam fabrications were undertaken. Concurrently, post-manufacturing processes evaluated included hipping, cleaning and coating treatments. The first clinical application of a titanium alloy mega-implant was undertaken in November 2010. A 3D model of the pelvic wing implant was designed from CT scans. Novel key features included extensive lattice structures at the bone interfaces and integral flanges to fix the implant to the bone. The pelvic device was implanted with the aid of navigation and to date the patient remains active. A further 18 patient specific mega-implants have now been implanted. The early use of this advanced manufacturing route for patient specific implants has been very encouraging enabling the engineer to produce more advanced and anatomical conforming implants. However, there are a new set of design, manufacturing and regulatory challenges that require addressing to permit this technique to be used more widely. This technology is changing the design and manufacturing paradigm for the fabrication of specialised orthopaedic implants.

40 CFR 98.76 - Data reporting requirements.

Code of Federal Regulations, 2012 CFR

2012-07-01

... (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Ammonia Manufacturing § 98.76 Data reporting requirements. In... specified in paragraphs (a) and (b) of this section, as applicable for each ammonia manufacturing process... paragraph (a): (1) Annual quantity of each type of feedstock consumed for ammonia manufacturing (scf of...

40 CFR 98.76 - Data reporting requirements.

Code of Federal Regulations, 2013 CFR

2013-07-01

... (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Ammonia Manufacturing § 98.76 Data reporting requirements. In... specified in paragraphs (a) and (b) of this section, as applicable for each ammonia manufacturing process... paragraph (a): (1) Annual quantity of each type of feedstock consumed for ammonia manufacturing (scf of...

40 CFR 98.76 - Data reporting requirements.

Code of Federal Regulations, 2014 CFR

2014-07-01

... (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Ammonia Manufacturing § 98.76 Data reporting requirements. In... specified in paragraphs (a) and (b) of this section, as applicable for each ammonia manufacturing process... (2) of this section: (1) Annual quantity of each type of feedstock consumed for ammonia manufacturing...

40 CFR 98.76 - Data reporting requirements.

Code of Federal Regulations, 2010 CFR

2010-07-01

... (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Ammonia Manufacturing § 98.76 Data reporting requirements. In... specified in paragraphs (a) and (b) of this section, as applicable for each ammonia manufacturing process... this paragraph (a): (1) Annual quantity of each type of feedstock consumed for ammonia manufacturing...

40 CFR 98.76 - Data reporting requirements.

Code of Federal Regulations, 2011 CFR

2011-07-01

... (CONTINUED) MANDATORY GREENHOUSE GAS REPORTING Ammonia Manufacturing § 98.76 Data reporting requirements. In... specified in paragraphs (a) and (b) of this section, as applicable for each ammonia manufacturing process... paragraph (a): (1) Annual quantity of each type of feedstock consumed for ammonia manufacturing (scf of...

The Future of Product Design Utilising Printed Electronics

ERIC Educational Resources Information Center

York, Nicola; Southee, Darren; Evans, Mark

2017-01-01

This paper addresses the teaching of emerging technologies to design students, using "printed electronics" as an example as it recently became viable to mass manufacture and is ready for use in designs. Printed electronics is introduced as a disruptive technology, and approaches employed in knowledge transfer to industrial/product…

77 FR 20009 - Howard Hughes Medical Institute, et al.; Notice of Consolidated Decision on Applications for Duty...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-04-03

... decision consolidated pursuant to Section 6(c) of the Educational, Scientific, and Cultural Materials... 07470. Instrument: Electron Microscope. Manufacturer: Hitachi High Technologies America, Inc., Japan... educational uses requiring an electron microscope. We know of no electron microscope, or any other instrument...

77 FR 71776 - Ohio University, et al.; Notice of Consolidated Decision on Applications for Duty-Free Entry of...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-12-04

... Consolidated Decision on Applications for Duty-Free Entry of Electron Microscope This is a decision... Stocker Center, Athens, OH 45701. Instrument: Electron Microscope. Manufacturer: JEOL Ltd., Japan... North Carolina Wilmington, 601 South College Road, Wilmington, NC 28403-5915. Instrument: Electron...

78 FR 4418 - Electronic Submission Process for Requesting Export Certificates From the Center for Devices and...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-01-22

... (CDRH). The electronic process will help fulfill both the legislative and application time processing... Devices and Radiological Health (CDRH), Division of Small Manufacturers, International and Consumer... regulated by CDRH as a voluntary alternative to paper submissions. With electronic submissions, CDRH can...

Workforce Development for Manufacturing

ERIC Educational Resources Information Center

Bernard, Rosalie

2007-01-01

In a recent skills gap report, the National Association of Manufacturers (NAM) noted some disturbing trends in the gap between the demand for highly skilled manufacturing workers and the potential supply. The NAM report notes that smaller manufacturers rank finding qualified workers ahead of energy costs, taxes and government regulations on the…

Technology review for electronically controlled braking systems

DOT National Transportation Integrated Search

1998-09-22

Electronically Controlled Braking Systems (ECBS) offer many potential benefits to the trucking industry in the areas of safety, reliability, enhanced driver feedback, and maintainability. ECBS are being tested by a number of manufacturers. These syst...

32 CFR Appendix to Part 173 - List of Contractors for Whom Certification Is Required

Code of Federal Regulations, 2010 CFR

2010-07-01

... Electronics, 649 Lawrence Drive, Newbury Park, CA 91320 Unisys Corporation, One Unisys Place, Detroit, MI...: *Continental Electronics Manufacturing Company, Dallas, TX *Firm suspended as of July 6, 1988. Whittaker...

75 FR 27264 - Video Device Competition; Implementation of Section 304 of the Telecommunications Act of 1996...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-05-14

... and Consumer Electronics Equipment AGENCY: Federal Communications Commission. ACTION: Notice of... explore the potential for allowing any electronics manufacturer to offer smart video devices at retail...

NASA Tech Briefs, January 1996. Volume 20, No. 1

NASA Technical Reports Server (NTRS)

1996-01-01

This issue has a special focus on sensors, and include articles on Electronic Components and Circuits, Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery/Automation, Manufacturing/Fabrication, and Mathematics and Information Sciences

NASA Tech Briefs, November 2000. Volume 24, No. 11

NASA Technical Reports Server (NTRS)

2000-01-01

Topics covered include: Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Test and Measurement; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Data Acquisition.

Method of forming crystalline silicon devices on glass

DOEpatents

McCarthy, A.M.

1995-03-21

A method is disclosed for fabricating single-crystal silicon microelectronic components on a silicon substrate and transferring same to a glass substrate. This is achieved by utilizing conventional silicon processing techniques for fabricating components of electronic circuits and devices on bulk silicon, wherein a bulk silicon surface is prepared with epitaxial layers prior to the conventional processing. The silicon substrate is bonded to a glass substrate and the bulk silicon is removed leaving the components intact on the glass substrate surface. Subsequent standard processing completes the device and circuit manufacturing. This invention is useful in applications requiring a transparent or insulating substrate, particularly for display manufacturing. Other applications include sensors, actuators, optoelectronics, radiation hard electronics, and high temperature electronics. 7 figures.

Comparison Study on Additive Manufacturing (AM) and Powder Metallurgy (PM) AlSi10Mg Alloys

NASA Astrophysics Data System (ADS)

Chen, B.; Moon, S. K.; Yao, X.; Bi, G.; Shen, J.; Umeda, J.; Kondoh, K.

2018-02-01

The microstructural and mechanical properties of AlSi10Mg alloys fabricated by additive manufacturing (AM) and powder metallurgy (PM) routes were investigated and compared. The microstructures were examined by scanning electron microscopy assisted with electron-dispersive spectroscopy. The crystalline features were studied by x-ray diffraction and electron backscatter diffraction. Room-temperature tensile tests and Vickers hardness measurements were performed to characterize the mechanical properties. It was found that the AM alloy had coarser Al grains but much finer Si precipitates compared with the PM alloy. Consequently, the AM alloy showed more than 100% increment in strength and hardness compared with the PM alloy due to the presence of ultrafine forms of Si, while exhibiting moderate ductility.

75 FR 17711 - Agency Information Collection Activities; Submission to OMB for Review and Approval; Comment...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-04-07

... Approval; Comment Request; NSPS for Ammonium Sulfate Manufacturing Plants (Renewal) AGENCY: Environmental... information about the electronic docket, go to http://www.regulations.gov . Title: NSPS for Ammonium Sulfate... (NSPS) for Ammonium Sulfate Manufacturing Plants (40 CFR part 60, subpart PP), were proposed on February...

78 FR 21389 - Notice of Issuance of Final Determination Concerning Certain Ultrasound Systems

Federal Register 2010, 2011, 2012, 2013, 2014

2013-04-10

... ultrasound units, known as the S2000 and Antares ultrasound systems, engineered, designed, and subject to... healthcare professionals. One of the most critical elements required for the manufacture of a functional... use of licensing keys. Manufacturing Process Electronics Module Assembly: You state that the...

77 FR 20383 - Agency Information Collection Activities; Submission to OMB for Review and Approval; Comment...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-04-04

... Emissions From Glass Manufacturing Plants AGENCY: Environmental Protection Agency (EPA). ACTION: Notice... electronic docket, go to www.regulations.gov . Title: NESHAP for Inorganic Arsenic Emissions from Glass... Glass Manufacturing Plants were proposed on July 20, 1983, and promulgated on August 4, 1986. The...

78 FR 36772 - Agency Information Collection Activities; Submission to OMB for Review and Approval; Comment...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-06-19

... Activities; Submission to OMB for Review and Approval; Comment Request; NSPS for Lead-Acid Battery... the electronic docket, go to www.regulations.gov . Title: NSPS for Lead-Acid Battery Manufacturing...: Owners or operators of lead-acid battery manufacturing facilities. Estimated Number of Respondents: 52...

Multimedia Tutors for Science and Engineering.

ERIC Educational Resources Information Center

Woolf, Beverly Park; Poli, Corrado; Grosse, Ian; Day, Roberta

We have built several multimedia tutors for science and engineering education. This paper discusses Design for Manufacturing tutors and an electronic homework systems used by over 2000 students daily. The engineering tutors instruct students on efficient procedures for designing parts for manufacture. The goal is to support a deeper understanding…

Information Loss: Exploring the Information Systems Management's Neglect Affecting Softcopy Reproduction of Heritage-Data

ERIC Educational Resources Information Center

Oskooie, Kamran Rezai

2012-01-01

This exploratory mixed methods study quantified and explored leadership interest in legacy-data conversion and information processing. Questionnaires were administered electronically to 92 individuals in design, manufacturing, and other professions from the manufacturing, processing, Internet, computing, software and technology divisions. Research…

78 FR 36776 - Proposed Information Collection Request; Comment Request; Emission Control System Performance...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-06-19

... respond, including through the use of appropriate automated electronic, mechanical, or other technological... and vehicle manufacturers may not legally introduce their products into U.S. commerce unless EPA has... vehicle manufacturers must warrant that vehicles are free from defects in materials and workmanship that...

75 FR 20838 - Agency Information Collection Activities; Submission to OMB for Review and Approval; Comment...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-04-21

... Collection Activities; Submission to OMB for Review and Approval; Comment Request; NESHAP for Wood Furniture... electronic docket, go to http://www.regulations.gov . Title: NESHAP for Wood Furniture Manufacturing.... Respondents/Affected Entities: Wood furniture manufacturing operations. Estimated Number of Respondents: 750...

A cloud on the horizon-a survey into the use of electronic vaping devices for recreational drug and new psychoactive substance (NPS) administration.

PubMed

Blundell, M; Dargan, P; Wood, D

2018-01-01

There is limited published scientific data on vaping recreational drugs other than cannabis. A recent review suggested that 15% of people vaping cannabis have also vaped a synthetic cannabinoid receptor agonist (SCRA) and identified over 300 Internet reports of e-liquid manufacture of recreational drugs and/or new psychoactive substances (NPS). To determine the prevalence of use of electronic vaping devices for recreational drug and NPS delivery in the UK. A voluntary online survey using a convenience sample of UK adult participants (aged 16 years old and over) identified by a market research company. Data was collected regarding demographics, smoking history, electronic vaping device history and recreational drug/NPS use and route of administration. There were 2501 respondents. The mean (±SD) age was 46.2 ± 16.8 years old. The commonest lifetime recreational drug used was Cannabis (818, 32.7%). The majority of respondents had smoked (1545, 61.8%) with 731 (29.2%) being current smokers. The most commonly used SCRA product was 'Spice Gold' (173, 6.9%) and SCRA compound was ADB-CHMICA (48, 1.9%). 861 (34.4%) had used an electronic vaping device; 340 (13.6%) having used them for recreational drug administration; 236 (9.4%) reporting current use. The commonest lifetime recreational drug to be vaped was cannabis (155, 65.7%), with electronic cigarettes (230, 48.2%) being the commonest reported route of SCRA compound administration. 9.4% of respondents currently use electronic vaping devices for recreational drug administration with 6.2% reporting lifetime cannabis vaping use. Further larger scale studies are required to help inform the appropriate treatment and primary prevention strategies. © The Author 2017. Published by Oxford University Press on behalf of the Association of Physicians. All rights reserved. For Permissions, please email: journals.permissions@oup.com

Big Area Additive Manufacturing of High Performance Bonded NdFeB Magnets

NASA Astrophysics Data System (ADS)

Li, Ling; Tirado, Angelica; Nlebedim, I. C.; Rios, Orlando; Post, Brian; Kunc, Vlastimil; Lowden, R. R.; Lara-Curzio, Edgar; Fredette, Robert; Ormerod, John; Lograsso, Thomas A.; Paranthaman, M. Parans

2016-10-01

Additive manufacturing allows for the production of complex parts with minimum material waste, offering an effective technique for fabricating permanent magnets which frequently involve critical rare earth elements. In this report, we demonstrate a novel method - Big Area Additive Manufacturing (BAAM) - to fabricate isotropic near-net-shape NdFeB bonded magnets with magnetic and mechanical properties comparable or better than those of traditional injection molded magnets. The starting polymer magnet composite pellets consist of 65 vol% isotropic NdFeB powder and 35 vol% polyamide (Nylon-12). The density of the final BAAM magnet product reached 4.8 g/cm3, and the room temperature magnetic properties are: intrinsic coercivity Hci = 688.4 kA/m, remanence Br = 0.51 T, and energy product (BH)max = 43.49 kJ/m3 (5.47 MGOe). In addition, tensile tests performed on four dog-bone shaped specimens yielded an average ultimate tensile strength of 6.60 MPa and an average failure strain of 4.18%. Scanning electron microscopy images of the fracture surfaces indicate that the failure is primarily related to the debonding of the magnetic particles from the polymer binder. The present method significantly simplifies manufacturing of near-net-shape bonded magnets, enables efficient use of rare earth elements thus contributing towards enriching the supply of critical materials.

A Fully Nonmetallic Gas Turbine Engine Enabled by Additive Manufacturing, Part II: Additive Manufacturing and Characterization of Polymer Composites

NASA Technical Reports Server (NTRS)

Chuang, Kathy C.; Grady, Joseph E.; Arnold, Steven M.; Draper, Robert D.; Shin, Eugene; Patterson, Clark; Santelle, Tom; Lao, Chao; Rhein, Morgan; Mehl, Jeremy

2015-01-01

This publication is the second part of the three part report of the project entitled "A Fully Nonmetallic Gas Turbine Engine Enabled by Additive Manufacturing" funded by NASA Aeronautics Research Institute (NARI). The objective of this project was to conduct additive manufacturing to produce aircraft engine components by Fused Deposition Modeling (FDM), using commercially available polyetherimides-Ultem 9085 and experimental Ultem 1000 mixed with 10% chopped carbon fiber. A property comparison between FDM-printed and injection molded coupons for Ultem 9085, Ultem 1000 resin and the fiber-filled composite Ultem 1000 was carried out. Furthermore, an acoustic liner was printed from Ultem 9085 simulating conventional honeycomb structured liners and tested in a wind tunnel. Composite compressor inlet guide vanes were also printed using fiber-filled Ultem 1000 filaments and tested in a cascade rig. The fiber-filled Ultem 1000 filaments and composite vanes were characterized by scanning electron microscope (SEM) and acid digestion to determine the porosity of FDM-printed articles which ranged from 25 to 31%. Coupons of Ultem 9085, experimental Ultem 1000 composites and XH6050 resin were tested at room temperature and 400F to evaluate their corresponding mechanical properties. A preliminary modeling was also initiated to predict the mechanical properties of FDM-printed Ultem 9085 coupons in relation to varied raster angles and void contents, using the GRC-developed MAC/GMC program.

Big Area Additive Manufacturing of High Performance Bonded NdFeB Magnets

PubMed Central

Li, Ling; Tirado, Angelica; Nlebedim, I. C.; Rios, Orlando; Post, Brian; Kunc, Vlastimil; Lowden, R. R.; Lara-Curzio, Edgar; Fredette, Robert; Ormerod, John; Lograsso, Thomas A.; Paranthaman, M. Parans

2016-01-01

Additive manufacturing allows for the production of complex parts with minimum material waste, offering an effective technique for fabricating permanent magnets which frequently involve critical rare earth elements. In this report, we demonstrate a novel method - Big Area Additive Manufacturing (BAAM) - to fabricate isotropic near-net-shape NdFeB bonded magnets with magnetic and mechanical properties comparable or better than those of traditional injection molded magnets. The starting polymer magnet composite pellets consist of 65 vol% isotropic NdFeB powder and 35 vol% polyamide (Nylon-12). The density of the final BAAM magnet product reached 4.8 g/cm3, and the room temperature magnetic properties are: intrinsic coercivity Hci = 688.4 kA/m, remanence Br = 0.51 T, and energy product (BH)max = 43.49 kJ/m3 (5.47 MGOe). In addition, tensile tests performed on four dog-bone shaped specimens yielded an average ultimate tensile strength of 6.60 MPa and an average failure strain of 4.18%. Scanning electron microscopy images of the fracture surfaces indicate that the failure is primarily related to the debonding of the magnetic particles from the polymer binder. The present method significantly simplifies manufacturing of near-net-shape bonded magnets, enables efficient use of rare earth elements thus contributing towards enriching the supply of critical materials. PMID:27796339

Big Area Additive Manufacturing of High Performance Bonded NdFeB Magnets.

PubMed

Li, Ling; Tirado, Angelica; Nlebedim, I C; Rios, Orlando; Post, Brian; Kunc, Vlastimil; Lowden, R R; Lara-Curzio, Edgar; Fredette, Robert; Ormerod, John; Lograsso, Thomas A; Paranthaman, M Parans

2016-10-31

Additive manufacturing allows for the production of complex parts with minimum material waste, offering an effective technique for fabricating permanent magnets which frequently involve critical rare earth elements. In this report, we demonstrate a novel method - Big Area Additive Manufacturing (BAAM) - to fabricate isotropic near-net-shape NdFeB bonded magnets with magnetic and mechanical properties comparable or better than those of traditional injection molded magnets. The starting polymer magnet composite pellets consist of 65 vol% isotropic NdFeB powder and 35 vol% polyamide (Nylon-12). The density of the final BAAM magnet product reached 4.8 g/cm 3 , and the room temperature magnetic properties are: intrinsic coercivity H ci  = 688.4 kA/m, remanence B r  = 0.51 T, and energy product (BH) max  = 43.49 kJ/m 3 (5.47 MGOe). In addition, tensile tests performed on four dog-bone shaped specimens yielded an average ultimate tensile strength of 6.60 MPa and an average failure strain of 4.18%. Scanning electron microscopy images of the fracture surfaces indicate that the failure is primarily related to the debonding of the magnetic particles from the polymer binder. The present method significantly simplifies manufacturing of near-net-shape bonded magnets, enables efficient use of rare earth elements thus contributing towards enriching the supply of critical materials.

Big area additive manufacturing of high performance bonded NdFeB magnets

DOE PAGES

Li, Ling; Tirado, Angelica; Nlebedim, I. C.; ...

2016-10-31

Additive manufacturing allows for the production of complex parts with minimum material waste, offering an effective technique for fabricating permanent magnets which frequently involve critical rare earth elements. In this report, we demonstrate a novel method - Big Area Additive Manufacturing (BAAM) - to fabricate isotropic near-net-shape NdFeB bonded magnets with magnetic and mechanical properties comparable or better than those of traditional injection molded magnets. The starting polymer magnet composite pellets consist of 65 vol% isotropic NdFeB powder and 35 vol% polyamide (Nylon-12). The density of the final BAAM magnet product reached 4.8 g/cm3, and the room temperature magnetic propertiesmore » are: intrinsic coercivity Hci = 688.4 kA/m, remanence B r = 0.51 T, and energy product (BH) max = 43.49 kJ/m 3 (5.47 MGOe). In addition, tensile tests performed on four dog-bone shaped specimens yielded an average ultimate tensile strength of 6.60 MPa and an average failure strain of 4.18%. Scanning electron microscopy images of the fracture surfaces indicate that the failure is primarily related to the debonding of the magnetic particles from the polymer binder. As a result, the present method significantly simplifies manufacturing of near-net-shape bonded magnets, enables efficient use of rare earth elements thus contributing towards enriching the supply of critical materials.« less

Big area additive manufacturing of high performance bonded NdFeB magnets

DOE Office of Scientific and Technical Information (OSTI.GOV)

Li, Ling; Tirado, Angelica; Nlebedim, I. C.

Additive manufacturing allows for the production of complex parts with minimum material waste, offering an effective technique for fabricating permanent magnets which frequently involve critical rare earth elements. In this report, we demonstrate a novel method - Big Area Additive Manufacturing (BAAM) - to fabricate isotropic near-net-shape NdFeB bonded magnets with magnetic and mechanical properties comparable or better than those of traditional injection molded magnets. The starting polymer magnet composite pellets consist of 65 vol% isotropic NdFeB powder and 35 vol% polyamide (Nylon-12). The density of the final BAAM magnet product reached 4.8 g/cm3, and the room temperature magnetic propertiesmore » are: intrinsic coercivity Hci = 688.4 kA/m, remanence B r = 0.51 T, and energy product (BH) max = 43.49 kJ/m 3 (5.47 MGOe). In addition, tensile tests performed on four dog-bone shaped specimens yielded an average ultimate tensile strength of 6.60 MPa and an average failure strain of 4.18%. Scanning electron microscopy images of the fracture surfaces indicate that the failure is primarily related to the debonding of the magnetic particles from the polymer binder. As a result, the present method significantly simplifies manufacturing of near-net-shape bonded magnets, enables efficient use of rare earth elements thus contributing towards enriching the supply of critical materials.« less

76 FR 53889 - Publication of the Petition for Waiver From LG Electronics, Inc. and Granting of the Interim...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-08-30

...] Publication of the Petition for Waiver From LG Electronics, Inc. and Granting of the Interim Waiver From the... receipt of and publishes a petition for waiver from LG Electronics, Inc. (LG). The petition for waiver... & Electronics USA, Inc. (Mitsubishi) and other manufacturers for similar lines of commercial multi-split air...

High speed direct imaging of thin metal film ablation by movie-mode dynamic transmission electron microscopy

PubMed Central

Hihath, Sahar; Santala, Melissa K.; Cen, Xi; Campbell, Geoffrey; van Benthem, Klaus

2016-01-01

Obliteration of matter by pulsed laser beams is not only prevalent in science fiction movies, but finds numerous technological applications ranging from additive manufacturing over machining of micro- and nanostructured features to health care. Pulse lengths ranging from femtoseconds to nanoseconds are utilized at varying laser beam energies and pulse lengths, and enable the removal of nanometric volumes of material. While the mechanisms for removal of material by laser irradiation, i.e., laser ablation, are well understood on the micrometer length scale, it was previously impossible to directly observe obliteration processes on smaller scales due to experimental limitations for the combination of nanometer spatial and nanosecond temporal resolution. Here, we report the direct observation of metal thin film ablation from a solid substrate through dynamic transmission electron microscopy. Quantitative analysis reveals liquid-phase dewetting of the thin-film, followed by hydrodynamic sputtering of nano- to submicron sized metal droplets. We discovered unexpected fracturing of the substrate due to evolving thermal stresses. This study confirms that hydrodynamic sputtering remains a valid mechanism for droplet expulsion on the nanoscale, while irradiation induced stress fields represent limit laser processing of nanostructured materials. Our results allow for improved safety during laser ablation in manufacturing and medical applications. PMID:26965073

High speed direct imaging of thin metal film ablation by movie-mode dynamic transmission electron microscopy

DOE PAGES

Hihath, Sahar; Santala, Melissa K.; Cen, Xi; ...

2016-03-11

Obliteration of matter by pulsed laser beams is not only prevalent in science fiction movies, but finds numerous technological applications ranging from additive manufacturing over machining of micro- and nanostructured features to health care. Pulse lengths ranging from femtoseconds to nanoseconds are utilized at varying laser beam energies and pulse lengths, and enable the removal of nanometric volumes of material. While the mechanisms for removal of material by laser irradiation, i.e., laser ablation, are well understood on the micrometer length scale, it was previously impossible to directly observe obliteration processes on smaller scales due to experimental limitations for the combinationmore » of nanometer spatial and nanosecond temporal resolution. Here, we report the direct observation of metal thin film ablation from a solid substrate through dynamic transmission electron microscopy. Quantitative analysis reveals liquid-phase dewetting of the thin-film, followed by hydrodynamic sputtering of nano- to submicron sized metal droplets. We discovered unexpected fracturing of the substrate due to evolving thermal stresses. This study confirms that hydrodynamic sputtering remains a valid mechanism for droplet expulsion on the nanoscale, while irradiation induced stress fields represent limit laser processing of nanostructured materials. Ultimately, our results allow for improved safety during laser ablation in manufacturing and medical applications.« less

High speed direct imaging of thin metal film ablation by movie-mode dynamic transmission electron microscopy

NASA Astrophysics Data System (ADS)

Hihath, Sahar; Santala, Melissa K.; Cen, Xi; Campbell, Geoffrey; van Benthem, Klaus

2016-03-01

Obliteration of matter by pulsed laser beams is not only prevalent in science fiction movies, but finds numerous technological applications ranging from additive manufacturing over machining of micro- and nanostructured features to health care. Pulse lengths ranging from femtoseconds to nanoseconds are utilized at varying laser beam energies and pulse lengths, and enable the removal of nanometric volumes of material. While the mechanisms for removal of material by laser irradiation, i.e., laser ablation, are well understood on the micrometer length scale, it was previously impossible to directly observe obliteration processes on smaller scales due to experimental limitations for the combination of nanometer spatial and nanosecond temporal resolution. Here, we report the direct observation of metal thin film ablation from a solid substrate through dynamic transmission electron microscopy. Quantitative analysis reveals liquid-phase dewetting of the thin-film, followed by hydrodynamic sputtering of nano- to submicron sized metal droplets. We discovered unexpected fracturing of the substrate due to evolving thermal stresses. This study confirms that hydrodynamic sputtering remains a valid mechanism for droplet expulsion on the nanoscale, while irradiation induced stress fields represent limit laser processing of nanostructured materials. Our results allow for improved safety during laser ablation in manufacturing and medical applications.

High speed direct imaging of thin metal film ablation by movie-mode dynamic transmission electron microscopy.

PubMed

Hihath, Sahar; Santala, Melissa K; Cen, Xi; Campbell, Geoffrey; van Benthem, Klaus

2016-03-11

Obliteration of matter by pulsed laser beams is not only prevalent in science fiction movies, but finds numerous technological applications ranging from additive manufacturing over machining of micro- and nanostructured features to health care. Pulse lengths ranging from femtoseconds to nanoseconds are utilized at varying laser beam energies and pulse lengths, and enable the removal of nanometric volumes of material. While the mechanisms for removal of material by laser irradiation, i.e., laser ablation, are well understood on the micrometer length scale, it was previously impossible to directly observe obliteration processes on smaller scales due to experimental limitations for the combination of nanometer spatial and nanosecond temporal resolution. Here, we report the direct observation of metal thin film ablation from a solid substrate through dynamic transmission electron microscopy. Quantitative analysis reveals liquid-phase dewetting of the thin-film, followed by hydrodynamic sputtering of nano- to submicron sized metal droplets. We discovered unexpected fracturing of the substrate due to evolving thermal stresses. This study confirms that hydrodynamic sputtering remains a valid mechanism for droplet expulsion on the nanoscale, while irradiation induced stress fields represent limit laser processing of nanostructured materials. Our results allow for improved safety during laser ablation in manufacturing and medical applications.

Capacity of dental equipment to interfere with cardiac implantable electrical devices.

PubMed

Lahor-Soler, Eduard; Miranda-Rius, Jaume; Brunet-Llobet, Lluís; Sabaté de la Cruz, Xavier

2015-06-01

Patients with cardiac implantable electrical devices should take precautions when exposed to electromagnetic fields. Possible interference as a result of proximity to electromagnets or electricity flow from electronic tools employed in clinical odontology remains controversial. The objective of this study was to examine in vitro the capacity of dental equipment to provoke electromagnetic interference in pacemakers and implantable cardioverter defibrillators. Six electronic dental instruments were tested on three implantable cardioverter defibrillators and three pacemakers from different manufacturers. A simulator model, submerged in physiological saline, with elements that reproduced life-size anatomic structures was used. The instruments were analyzed at differing distances and for different time periods of application. The dental instruments studied displayed significant differences in their capacity to trigger electromagnetic interference. Significant differences in the quantity of registered interference were observed with respect to the variables manufacturer, type of cardiac implant, and application distance but not with the variable time of application. The electronic dental equipment tested at a clinical application distance (20 cm) provoked only slight interference in the pacemakers and implantable cardioverter defibrillators employed, irrespective of manufacturer. © 2015 Eur J Oral Sci.

Work-related musculoskeletal disorders (WMDs) risk assessment at core assembly production of electronic components manufacturing company

NASA Astrophysics Data System (ADS)

Yahya, N. M.; Zahid, M. N. O.

2018-03-01

This study conducted to assess the work-related musculoskeletal disorders (WMDs) among the workers at core assembly production in an electronic components manufacturing company located in Pekan, Pahang, Malaysia. The study is to identify the WMDs risk factor and risk level. A set of questionnaires survey based on modified Nordic Musculoskeletal Disorder Questionnaires have been distributed to respective workers to acquire the WMDs risk factor identification. Then, postural analysis was conducted in order to measure the respective WMDs risk level. The analysis were based on two ergonomics assessment tools; Rapid Upper Limb Assessment (RULA) and Rapid Entire Body Assessment (REBA). The study found that 30 respondents out of 36 respondents suffered from WMDs especially at shoulder, wrists and lower back. The WMDs risk have been identified from unloading process, pressing process and winding process. In term of the WMDs risk level, REBA and RULA assessment tools have indicated high risk level to unloading and pressing process. Thus, this study had established the WMDs risk factor and risk level of core assembly production in an electronic components manufacturing company at Malaysia environment.

High strength fused silica flexures manufactured by femtosecond laser

NASA Astrophysics Data System (ADS)

Bellouard, Yves; Said, Ali A.; Dugan, Mark; Bado, Philippe

2009-02-01

Flexures are mechanical elements used in micro- and precision-engineering to precisely guide the motion of micro-parts. They consist of slender bodies that deform elastically upon the application of a force. Although counter-intuitive at first, fused silica is an attractive material for flexure. Pending that the machining process does not introduce surface flaws that would lead to catastrophic failure, the material has a theoretically high ultimate tensile strength of several GPa. We report on high-aspect ratio fused silica flexures manufactured by femtosecond laser combined with chemical etching. Notch-hinges with thickness as small as twenty microns and aspect ratios comparable to aspect ratios obtained by Deep- Reactive-Ion-Etching (DRIE) were fabricated and tested under different loading conditions. Multiple fracture tests were performed for various loading conditions and the cracks morphologies were analyzed using Scanning Electron Microscopy. The manufactured elements show outstanding mechanical properties with flexural strengths largely exceeding those obtained with other technologies and materials. Fused silica flexures offer a mean to combine integrated optics with micro-mechanics in a single monolithic substrate. Waveguides and mechanical elements can be combined in a monolithic devices opening new opportunities for integrated opto-mechatronics devices.

76 FR 76403 - Agency Information Collection Activities; Submission to OMB for Review and Approval; Comment...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-12-07

... Activities; Submission to OMB for Review and Approval; Comment Request; Pre-Manufacture Review Reporting and... review and approval: Pre-Manufacture Review Reporting and Exemption Requirements for New Chemical....regulations.gov . Title: Pre-Manufacture Review Reporting and Exemption Requirements for New Chemical...

19 CFR 115.15 - Reports by road vehicle or container manufacturer.

Code of Federal Regulations, 2011 CFR

2011-04-01

... SECURITY; DEPARTMENT OF THE TREASURY CARGO CONTAINER AND ROAD VEHICLE CERTIFICATION PURSUANT TO INTERNATIONAL CUSTOMS CONVENTIONS Administration § 115.15 Reports by road vehicle or container manufacturer... 19 Customs Duties 1 2011-04-01 2011-04-01 false Reports by road vehicle or container manufacturer...

19 CFR 115.15 - Reports by road vehicle or container manufacturer.

Code of Federal Regulations, 2012 CFR

2012-04-01

... SECURITY; DEPARTMENT OF THE TREASURY CARGO CONTAINER AND ROAD VEHICLE CERTIFICATION PURSUANT TO INTERNATIONAL CUSTOMS CONVENTIONS Administration § 115.15 Reports by road vehicle or container manufacturer... 19 Customs Duties 1 2012-04-01 2012-04-01 false Reports by road vehicle or container manufacturer...

19 CFR 115.15 - Reports by road vehicle or container manufacturer.

Code of Federal Regulations, 2013 CFR

2013-04-01

... SECURITY; DEPARTMENT OF THE TREASURY CARGO CONTAINER AND ROAD VEHICLE CERTIFICATION PURSUANT TO INTERNATIONAL CUSTOMS CONVENTIONS Administration § 115.15 Reports by road vehicle or container manufacturer... 19 Customs Duties 1 2013-04-01 2013-04-01 false Reports by road vehicle or container manufacturer...

19 CFR 115.15 - Reports by road vehicle or container manufacturer.

Code of Federal Regulations, 2014 CFR

2014-04-01

... SECURITY; DEPARTMENT OF THE TREASURY CARGO CONTAINER AND ROAD VEHICLE CERTIFICATION PURSUANT TO INTERNATIONAL CUSTOMS CONVENTIONS Administration § 115.15 Reports by road vehicle or container manufacturer... 19 Customs Duties 1 2014-04-01 2014-04-01 false Reports by road vehicle or container manufacturer...

19 CFR 115.15 - Reports by road vehicle or container manufacturer.

Code of Federal Regulations, 2010 CFR

2010-04-01

... SECURITY; DEPARTMENT OF THE TREASURY CARGO CONTAINER AND ROAD VEHICLE CERTIFICATION PURSUANT TO INTERNATIONAL CUSTOMS CONVENTIONS Administration § 115.15 Reports by road vehicle or container manufacturer... 19 Customs Duties 1 2010-04-01 2010-04-01 false Reports by road vehicle or container manufacturer...

49 CFR 665.13 - Test report and manufacturer certification.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 7 2010-10-01 2010-10-01 false Test report and manufacturer certification. 665.13 Section 665.13 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL TRANSIT ADMINISTRATION, DEPARTMENT OF TRANSPORTATION BUS TESTING Bus Testing Procedures § 665.13 Test report and manufacturer certification. (a) Upon...

Next Generation Orthopaedic Implants by Additive Manufacturing Using Electron Beam Melting

PubMed Central

Murr, Lawrence E.; Gaytan, Sara M.; Martinez, Edwin; Medina, Frank; Wicker, Ryan B.

2012-01-01

This paper presents some examples of knee and hip implant components containing porous structures and fabricated in monolithic forms utilizing electron beam melting (EBM). In addition, utilizing stiffness or relative stiffness versus relative density design plots for open-cellular structures (mesh and foam components) of Ti-6Al-4V and Co-29Cr-6Mo alloy fabricated by EBM, it is demonstrated that stiffness-compatible implants can be fabricated for optimal stress shielding for bone regimes as well as bone cell ingrowth. Implications for the fabrication of patient-specific, monolithic, multifunctional orthopaedic implants using EBM are described along with microstructures and mechanical properties characteristic of both Ti-6Al-4V and Co-29Cr-6Mo alloy prototypes, including both solid and open-cellular prototypes manufactured by additive manufacturing (AM) using EBM. PMID:22956957

Preliminary fabrication and characterization of electron beam melted Ti-6Al-4V customized dental implant.

PubMed

Ramakrishnaiah, Ravikumar; Al Kheraif, Abdulaziz Abdullah; Mohammad, Ashfaq; Divakar, Darshan Devang; Kotha, Sunil Babu; Celur, Sree Lalita; Hashem, Mohamed I; Vallittu, Pekka K; Rehman, Ihtesham Ur

2017-05-01

The current study was aimed to fabricate customized root form dental implant using additive manufacturing technique for the replacement of missing teeth. The root form dental implant was designed using Geomagic™ and Magics™, the designed implant was directly manufactured by layering technique using ARCAM A2™ electron beam melting system by employing medical grade Ti-6Al-4V alloy powder. Furthermore, the fabricated implant was characterized in terms of certain clinically important parameters such as surface microstructure, surface topography, chemical purity and internal porosity. Results confirmed that, fabrication of customized dental implants using additive rapid manufacturing technology offers an attractive method to produce extremely pure form of customized titanium dental implants, the rough and porous surface texture obtained is expected to provide better initial implant stabilization and superior osseointegration.

CAD/CAM transtibial prosthetic sockets from central fabrication facilities: How accurate are they?

PubMed Central

Sanders, Joan E.; Rogers, Ellen L.; Sorenson, Elizabeth A.; Lee, Gregory S.; Abrahamson, Daniel C.

2014-01-01

This research compares transtibial prosthetic sockets made by central fabrication facilities with their corresponding American Academy of Orthotists and Prosthetists (AAOP) electronic shape files and assesses the central fabrication process. We ordered three different socket shapes from each of 10 manufacturers. Then we digitized the sockets using a very accurate custom mechanical digitizer. Results showed that quality varied considerably among the different manufacturers. Four of the companies consistently made sockets within +/−1.1% volume (approximately 1 sock ply) of the AAOP electronic shape file, while six other companies did not. Six of the companies showed consistent undersizing or oversizing in their sockets, which suggests a consistent calibration or manufacturing error. Other companies showed inconsistent sizing or shape distortion, a difficult problem that represents a most challenging limitation for central fabrication facilities. PMID:18247236

The use of Tecnomatix software to simulate the manufacturing flows in an industrial enterprise producing hydrostatic components

NASA Astrophysics Data System (ADS)

Petrila, S.; Brabie, G.; Chirita, B.

2016-08-01

The analysis performed on manufacturing flows within industrial enterprises producing hydrostatic components twos made on a number of factors that influence smooth running of production such: distance between pieces, waiting time from one surgery to another; time achievement of setups on CNC machines; tool changing in case of a large number of operators and manufacturing complexity of large files [2]. To optimize the manufacturing flow it was used the software Tecnomatix. This software represents a complete portfolio of manufacturing solutions digital manufactured by Siemens. It provides innovation by linking all production methods of a product from process design, process simulation, validation and ending the manufacturing process. Among its many capabilities to create a wide range of simulations, the program offers various demonstrations regarding the behavior manufacturing cycles. This program allows the simulation and optimization of production systems and processes in several areas such as: car suppliers, production of industrial equipment; electronics manufacturing, design and production of aerospace and defense parts.

Replacing ODCs in a Critical Hand Cleaning Manual Electronics Assembly Operation

NASA Technical Reports Server (NTRS)

Bonner, J. K.; Walton, Sharon

1997-01-01

The manufacture of high reliability electronics assemblies for spacecraft and ground support equipment still often involves manual assembly processes. In addition, rework and repair of critical assemblies aslo often entails manual assembly processes.

NASA Tech Briefs, August 2000. Volume 24, No. 8

NASA Technical Reports Server (NTRS)

2000-01-01

Topics include: Simulation/Virtual Reality; Test and Measurement; Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Medical Design.

Accelerated testing of module-level power electronics for long-term reliability

DOE Office of Scientific and Technical Information (OSTI.GOV)

Flicker, Jack David; Tamizhmani, Govindasamy; Moorthy, Mathan Kumar

This work has applied a suite of long-term-reliability accelerated tests to a variety of module-level power electronics (MLPE) devices (such as microinverters and optimizers) from five different manufacturers. This dataset is one of the first (only the paper by Parker et al. entitled “Dominant factors affecting reliability of alternating current photovoltaic modules,” in Proc. 42nd IEEE Photovoltaic Spec. Conf., 2015, is reported for reliability testing in the literature), as well as the largest, experimental sets in public literature, both in the sample size (five manufacturers including both dc/dc and dc/ac units and 20 units for each test) and the numbermore » of experiments (six different experimental test conditions) for MLPE devices. The accelerated stress tests (thermal cycling test per IEC 61215 profile, damp heat test per IEC 61215 profile, and static temperature tests at 100 and 125 °C) were performed under powered and unpowered conditions. The first independent long-term experimental data regarding damp heat and grid transient testing, as well as the longest term (>9 month) testing of MLPE units reported in the literature for thermal cycling and high-temperature operating life, are included in these experiments. Additionally, this work is the first to show in situ power measurements, as well as periodic efficiency measurements over a series of experimental tests, demonstrating whether certain tests result in long-term degradation or immediate catastrophic failures. Lastly, the result of this testing highlights the performance of MLPE units under the application of several accelerated environmental stressors.« less

Accelerated testing of module-level power electronics for long-term reliability

DOE PAGES

Flicker, Jack David; Tamizhmani, Govindasamy; Moorthy, Mathan Kumar; ...

2016-11-10

This work has applied a suite of long-term-reliability accelerated tests to a variety of module-level power electronics (MLPE) devices (such as microinverters and optimizers) from five different manufacturers. This dataset is one of the first (only the paper by Parker et al. entitled “Dominant factors affecting reliability of alternating current photovoltaic modules,” in Proc. 42nd IEEE Photovoltaic Spec. Conf., 2015, is reported for reliability testing in the literature), as well as the largest, experimental sets in public literature, both in the sample size (five manufacturers including both dc/dc and dc/ac units and 20 units for each test) and the numbermore » of experiments (six different experimental test conditions) for MLPE devices. The accelerated stress tests (thermal cycling test per IEC 61215 profile, damp heat test per IEC 61215 profile, and static temperature tests at 100 and 125 °C) were performed under powered and unpowered conditions. The first independent long-term experimental data regarding damp heat and grid transient testing, as well as the longest term (>9 month) testing of MLPE units reported in the literature for thermal cycling and high-temperature operating life, are included in these experiments. Additionally, this work is the first to show in situ power measurements, as well as periodic efficiency measurements over a series of experimental tests, demonstrating whether certain tests result in long-term degradation or immediate catastrophic failures. Lastly, the result of this testing highlights the performance of MLPE units under the application of several accelerated environmental stressors.« less

Energy Use in Manufacturing

EIA Publications

2006-01-01

This report addresses both manufacturing energy consumption and characteristics of the manufacturing economy related to energy consumption. In addition, special sections on fuel switching capacity and energy-management activities between 1998 and 2002 are also featured in this report.