n⁺ GaAs/AuGeNi-Au Thermocouple-Type RF MEMS Power Sensors Based on Dual Thermal Flow Paths in GaAs MMIC.

PubMed

Zhang, Zhiqiang; Liao, Xiaoping

2017-06-17

To achieve radio frequency (RF) power detection, gain control, and circuit protection, this paper presents n⁺ GaAs/AuGeNi-Au thermocouple-type RF microelectromechanical system (MEMS) power sensors based on dual thermal flow paths. The sensors utilize a conversion principle of RF power-heat-voltage, where a thermovoltage is obtained as the RF power changes. To improve the heat transfer efficiency and the sensitivity, structures of two heat conduction paths are designed: one in which a thermal slug of Au is placed between two load resistors and hot junctions of the thermocouples, and one in which a back cavity is fabricated by the MEMS technology to form a substrate membrane underneath the resistors and the hot junctions. The improved sensors were fabricated by a GaAs monolithic microwave integrated circuit (MMIC) process. Experiments show that these sensors have reflection losses of less than -17 dB up to 12 GHz. At 1, 5, and 10 GHz, measured sensitivities are about 63.45, 53.97, and 44.14 µ V/mW for the sensor with the thermal slug, and about 111.03, 94.79, and 79.04 µ V/mW for the sensor with the thermal slug and the back cavity, respectively.

Enabling MEMS technologies for communications systems

NASA Astrophysics Data System (ADS)

Lubecke, Victor M.; Barber, Bradley P.; Arney, Susanne

2001-11-01

Modern communications demands have been steadily growing not only in size, but sophistication. Phone calls over copper wires have evolved into high definition video conferencing over optical fibers, and wireless internet browsing. The technology used to meet these demands is under constant pressure to provide increased capacity, speed, and efficiency, all with reduced size and cost. Various MEMS technologies have shown great promise for meeting these challenges by extending the performance of conventional circuitry and introducing radical new systems approaches. A variety of strategic MEMS structures including various cost-effective free-space optics and high-Q RF components are described, along with related practical implementation issues. These components are rapidly becoming essential for enabling the development of progressive new communications systems technologies including all-optical networks, and low cost multi-system wireless terminals and basestations.

Novel Low Loss Wide-Band Multi-Port Integrated Circuit Technology for RF/Microwave Applications

NASA Technical Reports Server (NTRS)

Simons, Rainee N.; Goverdhanam, Kavita; Katehi, Linda P. B.; Burke, Thomas P. (Technical Monitor)

2001-01-01

In this paper, novel low loss, wide-band coplanar stripline technology for radio frequency (RF)/microwave integrated circuits is demonstrated on high resistivity silicon wafer. In particular, the fabrication process for the deposition of spin-on-glass (SOG) as a dielectric layer, the etching of microvias for the vertical interconnects, the design methodology for the multiport circuits and their measured/simulated characteristics are graphically illustrated. The study shows that circuits with very low loss, large bandwidth, and compact size are feasible using this technology. This multilayer planar technology has potential to significantly enhance RF/microwave IC performance when combined with semi-conductor devices and microelectromechanical systems (MEMS).

Ultrananocrystalline diamond films with optimized dielectric properties for advanced RF MEMS capacitive switches

DOEpatents

Sumant, Anirudha V.; Auciello, Orlando H.; Mancini, Derrick C.

2013-01-15

An efficient deposition process is provided for fabricating reliable RF MEMS capacitive switches with multilayer ultrananocrystalline (UNCD) films for more rapid recovery, charging and discharging that is effective for more than a billion cycles of operation. Significantly, the deposition process is compatible for integration with CMOS electronics and thereby can provide monolithically integrated RF MEMS capacitive switches for use with CMOS electronic devices, such as for insertion into phase array antennas for radars and other RF communication systems.

Concepts, characterization, and modeling of MEMS microswitches with gold contacts in MUMPs

NASA Astrophysics Data System (ADS)

Lafontan, Xavier; Dufaza, Christian; Robert, Michel; Pressecq, Francis; Perez, Guy

2001-04-01

This paper demonstrates that RF MEMS micro-switches can be realized with a low cost MEMS technology such as MUMPs. Two different switches are proposed, namely the hinged beam switch and the gold overflowing switch. Their concepts, design and characterization are described in details. On-resistance as low as 5 - 6 (Omega) for the gold overflowing switch and 2 - 3 (Omega) for the hinged beam switch have been measured. Finally, experimental measurements showed that force and electrical current had strong influences on the overall electrical contact.

Numerical Simulation of Liquid Metal RF MEMS Switch Based on EWOD

NASA Astrophysics Data System (ADS)

Liu, Tingting; Gao, Yang; Yang, Tao; Guo, Huihui

2018-03-01

Conventional RF MEMS switches rely on metal-to-dielectric or metal-to-metal contacts. Some problems in the “solid-solid” contact, such as contact degradation, signal bounce and poor reliability, can be solved by using “liquid-solid” contact. The RF MEMS switch based on liquid metal is characterized by small contact resistance, no moving parts, high reliability and long life. Using electrowetting-on-dielectric (EWOD) way to control the movement of liquid metal in the RF MEMS switch, to achieve the “on” and “off” of the switch. In this paper, the electrical characteristics and RF characteristics of RF MEMS switches are simulated by fluid mechanics software FLUENT and electromagnetic simulation software HFSS. The effects of driving voltage, switching time, dielectric layer, hydrophobic layer material and thickness, switching channel height on the RF characteristics are studied. The results show that to increase the external voltage to the threshold voltage of 58V, the liquid metal began to move, and the switching time from “off” state to “on” state is 16ms. In the 0~20GHz frequency range, the switch insertion loss is less than 0.28dB, isolation is better than 23.32dB.

Arrays of Carbon Nanotubes as RF Filters in Waveguides

NASA Technical Reports Server (NTRS)

Hoppe, Daniel; Hunt, Brian; Hoenk, Michael; Noca, Flavio; Xu, Jimmy

2003-01-01

Brushlike arrays of carbon nanotubes embedded in microstrip waveguides provide highly efficient (high-Q) mechanical resonators that will enable ultraminiature radio-frequency (RF) integrated circuits. In its basic form, this invention is an RF filter based on a carbon nanotube array embedded in a microstrip (or coplanar) waveguide, as shown in Figure 1. In addition, arrays of these nanotube-based RF filters can be used as an RF filter bank. Applications of this new nanotube array device include a variety of communications and signal-processing technologies. High-Q resonators are essential for stable, low-noise communications, and radar applications. Mechanical oscillators can exhibit orders of magnitude higher Qs than electronic resonant circuits, which are limited by resistive losses. This has motivated the development of a variety of mechanical resonators, including bulk acoustic wave (BAW) resonators, surface acoustic wave (SAW) resonators, and Si and SiC micromachined resonators (known as microelectromechanical systems or MEMS). There is also a strong push to extend the resonant frequencies of these oscillators into the GHz regime of state-of-the-art electronics. Unfortunately, the BAW and SAW devices tend to be large and are not easily integrated into electronic circuits. MEMS structures have been integrated into circuits, but efforts to extend MEMS resonant frequencies into the GHz regime have been difficult because of scaling problems with the capacitively-coupled drive and readout. In contrast, the proposed devices would be much smaller and hence could be more readily incorporated into advanced RF (more specifically, microwave) integrated circuits.

Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems

PubMed Central

Kim, Jong-Wan; Takao, Hidekuni; Sawada, Kazuaki; Ishida, Makoto

2007-01-01

This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensor systems that have been developed to monitor the motion and vital signs of humans in various environments. Integration of radio frequency transmitter (RF) technology with complementary metal-oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) microsensors is required to realize the wireless smart microsensors system. The essential RF components such as a voltage controlled RF-CMOS oscillator (VCO), spiral inductors for an LC resonator and an integrated antenna have been fabricated and evaluated experimentally. The fabricated RF transmitter and integrated antenna were packaged with subminiature series A (SMA) connectors, respectively. For the impedance (50 Ω) matching, a bonding wire type inductor was developed. In this paper, the design and fabrication of the bonding wire inductor for impedance matching is described. Integrated techniques for the RF transmitter by CMOS compatible processes have been successfully developed. After matching by inserting the bonding wire inductor between the on-chip integrated antenna and the VCO output, the measured emission power at distance of 5 m from RF transmitter was -37 dBm (0.2 μW).

Sources of stress gradients in electrodeposited Ni MEMS.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hearne, Sean Joseph; Floro, Jerrold Anthony; Dyck, Christopher William

2004-06-01

The ability of future integrated metal-semiconductor micro-systems such as RF MEMS to perform highly complex functions will depend on developing freestanding metal structures that offer improved conductivity and reflectivity over polysilicon structures. For example, metal-based RF MEMS technology could replace the bulky RF system presently used in communications, navigation, and avionics systems. However, stress gradients that induce warpage of active components have prevented the implementation of this technology. Figure 1, is an interference micrograph image of a series of cantilever beams fabricated from electrodeposited Ni. The curvature in the beams was the result of stress gradients intrinsic to the electrodepositionmore » process. To study the sources of the stress in electrodeposition of Ni we have incorporated a wafer curvature based stress sensor, the multibeam optical stress sensor, into an electrodeposition cell. We have determined that there are two regions of stress induced by electrodepositing Ni from a sulfamate-based bath (Fig 2). The stress evolution during the first region, 0-1000{angstrom}, was determined to be dependent only on the substrate material (Au vs. Cu), whereas the stress evolution during the second region, >1000{angstrom}, was highly dependent on the deposition conditions. In this region, the stress varied from +0.5 GPa to -0.5GPa, depending solely on the deposition rate. We examined four likely sources for the compressive intrinsic stress, i.e. reduction in tensile stress, and determined that only the adatom diffusion into grain boundaries model of Sheldon, et al. could account for the observed compressive stress. In the presentation, we shall discuss the compressive stress generation mechanisms considered and the ramifications of these results on fabrication of electrodeposited Ni for MEMS applications.« less

Infrastructure for the design and fabrication of MEMS for RF/microwave and millimeter wave applications

NASA Astrophysics Data System (ADS)

Nerguizian, Vahe; Rafaf, Mustapha

2004-08-01

This article describes and provides valuable information for companies and universities with strategies to start fabricating MEMS for RF/Microwave and millimeter wave applications. The present work shows the infrastructure developed for RF/Microwave and millimeter wave MEMS platforms, which helps the identification, evaluation and selection of design tools and fabrication foundries taking into account packaging and testing. The selected and implemented simple infrastructure models, based on surface and bulk micromachining, yield inexpensive and innovative approaches for distributed choices of MEMS operating tools. With different educational or industrial institution needs, these models may be modified for specific resource changes using a careful analyzed iteration process. The inputs of the project are evaluation selection criteria and information sources such as financial, technical, availability, accessibility, simplicity, versatility and practical considerations. The outputs of the project are the selection of different MEMS design tools or software (solid modeling, electrostatic/electromagnetic and others, compatible with existing standard RF/Microwave design tools) and different MEMS manufacturing foundries. Typical RF/Microwave and millimeter wave MEMS solutions are introduced on the platform during the evaluation and development phases of the project for the validation of realistic results and operational decision making choices. The encountered challenges during the investigation and the development steps are identified and the dynamic behavior of the infrastructure is emphasized. The inputs (resources) and the outputs (demonstrated solutions) are presented in tables and flow chart mode diagrams.

Beyond CMOS: heterogeneous integration of III–V devices, RF MEMS and other dissimilar materials/devices with Si CMOS to create intelligent microsystems

PubMed Central

Kazior, Thomas E.

2014-01-01

Advances in silicon technology continue to revolutionize micro-/nano-electronics. However, Si cannot do everything, and devices/components based on other materials systems are required. What is the best way to integrate these dissimilar materials and to enhance the capabilities of Si, thereby continuing the micro-/nano-electronics revolution? In this paper, I review different approaches to heterogeneously integrate dissimilar materials with Si complementary metal oxide semiconductor (CMOS) technology. In particular, I summarize results on the successful integration of III–V electronic devices (InP heterojunction bipolar transistors (HBTs) and GaN high-electron-mobility transistors (HEMTs)) with Si CMOS on a common silicon-based wafer using an integration/fabrication process similar to a SiGe BiCMOS process (BiCMOS integrates bipolar junction and CMOS transistors). Our III–V BiCMOS process has been scaled to 200 mm diameter wafers for integration with scaled CMOS and used to fabricate radio-frequency (RF) and mixed signals circuits with on-chip digital control/calibration. I also show that RF microelectromechanical systems (MEMS) can be integrated onto this platform to create tunable or reconfigurable circuits. Thus, heterogeneous integration of III–V devices, MEMS and other dissimilar materials with Si CMOS enables a new class of high-performance integrated circuits that enhance the capabilities of existing systems, enable new circuit architectures and facilitate the continued proliferation of low-cost micro-/nano-electronics for a wide range of applications. PMID:24567473

Beyond CMOS: heterogeneous integration of III-V devices, RF MEMS and other dissimilar materials/devices with Si CMOS to create intelligent microsystems.

PubMed

Kazior, Thomas E

2014-03-28

Advances in silicon technology continue to revolutionize micro-/nano-electronics. However, Si cannot do everything, and devices/components based on other materials systems are required. What is the best way to integrate these dissimilar materials and to enhance the capabilities of Si, thereby continuing the micro-/nano-electronics revolution? In this paper, I review different approaches to heterogeneously integrate dissimilar materials with Si complementary metal oxide semiconductor (CMOS) technology. In particular, I summarize results on the successful integration of III-V electronic devices (InP heterojunction bipolar transistors (HBTs) and GaN high-electron-mobility transistors (HEMTs)) with Si CMOS on a common silicon-based wafer using an integration/fabrication process similar to a SiGe BiCMOS process (BiCMOS integrates bipolar junction and CMOS transistors). Our III-V BiCMOS process has been scaled to 200 mm diameter wafers for integration with scaled CMOS and used to fabricate radio-frequency (RF) and mixed signals circuits with on-chip digital control/calibration. I also show that RF microelectromechanical systems (MEMS) can be integrated onto this platform to create tunable or reconfigurable circuits. Thus, heterogeneous integration of III-V devices, MEMS and other dissimilar materials with Si CMOS enables a new class of high-performance integrated circuits that enhance the capabilities of existing systems, enable new circuit architectures and facilitate the continued proliferation of low-cost micro-/nano-electronics for a wide range of applications.

Radio Frequency (RF) Micro-Electromechanical Systems (MEMS) Switches for Space Communications

NASA Technical Reports Server (NTRS)

Simons, Rainee N.; Ponchak, George E.; Scardelletti, Maximillian C.; Varaljay, Nicholas C.

2000-01-01

Micro-electromechanical systems (MEMS) is an emerging technology for radio frequency (RF) systems because it has the potential to dramatically decrease loss and improve efficiency. In this paper, we address the design and fabrication of novel MEMS switches being developed at NASA Glenn Research Center. Two types of switches are being developed: a microstrip series single pole single throw (SPST) switch and a coplanar waveguide (CPW) series SPST and single pole double throw (SPDT) switches. These are being fabricated as an integral part of 50 Ohm microstrip and CPW RF integrated circuits using microfabrication techniques. The construction of the switch relies on a cantilever beam that is partially supported by a dielectric post. The cantilever beam is electro-magnetically actuated. To decrease stiction, a Si3N4 thin film is deposited over the contact area. Thus, when the switch is closed, the ON-state insertion loss is governed by the parallel plate capacitance formed by the two contacts. The isolation in the OFF-state is governed by the parasitic capacitance when the cantilever is in the up position. RF MEMS switches have been demonstrated with 80% lower insertion loss than conventional solid state devices (GaAs Metal Semiconductor Field Effect Transistors (MESFETs) and Silicon PIN diodes) based switches. For example, a conventional GaAs five-bit phase shifter which is required for beam steering in a phased array antenna has approximately 7 dB of insertion loss at 26.5 GHz where as a comparable MEMS based phase shifter is expected to have only 2 dB of insertion loss. This translates into 56% lower power dissipation and therefore decreases the thermal load on the spacecraft and also reduces the power amplifier requirements. These benefits will enable NASA to build the next generation of deep space science crafts and micro/nano satellites.

Design of RF MEMS switches without pull-in instability

NASA Astrophysics Data System (ADS)

Proctor, W. Cyrus; Richards, Gregory P.; Shen, Chongyi; Skorczewski, Tyler; Wang, Min; Zhang, Jingyan; Zhong, Peng; Massad, Jordan E.; Smith, Ralph

2010-04-01

Micro-electro-mechanical systems (MEMS) switches for radio-frequency (RF) signals have certain advantages over solid-state switches, such as lower insertion loss, higher isolation, and lower static power dissipation. Mechanical dynamics can be a determining factor for the reliability of RF MEMS. The RF MEMS ohmic switch discussed in this paper consists of a plate suspended over an actuation pad by four double-cantilever springs. Closing the switch with a simple step actuation voltage typically causes the plate to rebound from its electrical contacts. The rebound interrupts the signal continuity and degrades the performance, reliability and durability of the switch. The switching dynamics are complicated by a nonlinear, electrostatic pull-in instability that causes high accelerations. Slow actuation and tailored voltage control signals can mitigate switch bouncing and effects of the pull-in instability; however, slow switching speed and overly-complex input signals can significantly penalize overall system-level performance. Examination of a balanced and optimized alternative switching solution is sought. A step toward one solution is to consider a pull-in-free switch design. In this paper, determine how simple RC-circuit drive signals and particular structural properties influence the mechanical dynamics of an RF MEMS switch designed without a pull-in instability. The approach is to develop a validated modeling capability and subsequently study switch behavior for variable drive signals and switch design parameters. In support of project development, specifiable design parameters and constraints will be provided. Moreover, transient data of RF MEMS switches from laser Doppler velocimetry will be provided for model validation tasks. Analysis showed that a RF MEMS switch could feasibly be designed with a single pulse waveform and no pull-in instability and achieve comparable results to previous waveform designs. The switch design could reliably close in a timely manner, with small contact velocity, usually with little to no rebound even when considering manufacturing variability.

A novel multi-actuation CMOS RF MEMS switch

NASA Astrophysics Data System (ADS)

Lee, Chiung-I.; Ko, Chih-Hsiang; Huang, Tsun-Che

2008-12-01

This paper demonstrates a capacitive shunt type RF MEMS switch, which is actuated by electro-thermal actuator and electrostatic actuator at the same time, and than latching the switching status by electrostatic force only. Since thermal actuators need relative low voltage compare to electrostatic actuators, and electrostatic force needs almost no power to maintain the switching status, the benefits of the mechanism are very low actuation voltage and low power consumption. Moreover, the RF MEMS switch has considered issues for integrated circuit compatible in design phase. So the switch is fabricated by a standard 0.35um 2P4M CMOS process and uses wet etching and dry etching technologies for postprocess. This compatible ability is important because the RF characteristics are not only related to the device itself. If a packaged RF switch and a packaged IC wired together, the parasitic capacitance will cause the problem for optimization. The structure of the switch consists of a set of CPW transmission lines and a suspended membrane. The CPW lines and the membrane are in metal layers of CMOS process. Besides, the electro-thermal actuators are designed by polysilicon layer of the CMOS process. So the RF switch is only CMOS process layers needed for both electro-thermal and electrostatic actuations in switch. The thermal actuator is composed of a three-dimensional membrane and two heaters. The membrane is a stacked step structure including two metal layers in CMOS process, and heat is generated by poly silicon resistors near the anchors of membrane. Measured results show that the actuation voltage of the switch is under 7V for electro-thermal added electrostatic actuation.

RF MEMS Switches with SiC Microbridges for Improved Reliability

NASA Technical Reports Server (NTRS)

Scardelletti, Maximilian C.; Zorman, Christian A.; Oldham, Daniel R.

2008-01-01

Radio frequency (RF) microelectromechanical (MEMS) switches offer superior performance when compared to the traditional semiconductor devices such as PIN diodes or GaAs transistors. MEMS switches have a return loss (RL) better than -25 dB, negligible insertion loss (IL), isolation better than -30 dB, and near zero power consumption. However, RF MEMS switches have several drawbacks the most serious being long-term reliability. The ability for the switch to operate for millions or even billions of cycles is a major concern and must be addressed. MEMS switches are basically grouped in two categories, capacitive and metal-to-metal contact. The capacitive type switch consists of a movable metal bridge spanning a fixed electrode and separated by a narrow air gap and thin insulating material. The metal-to-metal contact type utilizes the same basic design but without the insulating material. After prolonged operation the metal bridges, in most of these switches, begin to sag and eventually fail to actuate. For the metal-to-metal type, the two metal layers may actually fuse together. Also if the switches are not packaged properly or protected from the environment moisture may build up and cause stiction between the top and bottom electrodes rendering them useless. Many MEMS switch designs have been developed and most illustrate fairly good RF characteristics. Nevertheless very few have demonstrated both great RF performance and ability to perform millions/billions of switching cycles. Of these, nearly all are of metal-to-metal type so as the frequency increases RF performance decreases.

Novel Vertical Interconnects With 180 Degree Phase Shift for Amplifiers, Filters, and Integrated Antennas

NASA Technical Reports Server (NTRS)

Goverdhanam, Kavita; Simons, Rainee N.; Katehi, Linda P. B.; Burke, Thomas P. (Technical Monitor)

2001-01-01

In this paper, novel low loss, wide-band coplanar stripline technology for RF/microwave integrated circuits is demonstrated on high resistivity silicon wafer. In particular, the fabrication process for the deposition of spin-on-glass (SOG) as a dielectric layer, the etching of microvias for the vertical interconnects, the design methodology for the multiport circuits and their measured/simulated characteristics are graphically illustrated. The study shows that circuits with very low loss, large bandwidth and compact size are feasible using this technology. This multilayer planar technology has potential to significantly enhance RF/microwave IC performance when combined with semiconductor devices and microelectromechanical systems (MEMS).

A flexible telecom satellite repeater based on microwave photonic technologies

NASA Astrophysics Data System (ADS)

Sotom, Michel; Benazet, Benoît; Maignan, Michel

2017-11-01

Future telecom satellite based on geo-stationary Earth orbit (GEO) will require advanced payloads in Kaband so as to receive, route and re-transmit hundreds of microwave channels over multiple antenna beams. We report on the proof-of-concept demonstration of a analogue repeater making use of microwave photonic technologies for supporting broadband, transparent, and flexible cross-connectivity. It has microwave input and output sections, and features a photonic core for LO distribution, frequency down-conversion, and cross-connection of RF channels. With benefits such as transparency to RF frequency, infinite RF isolation, mass and volume savings, such a microwave photonic cross-connect would compare favourably with microwave implementations, and based on optical MEMS switches could grow up to large port counts.

Low-voltage high-reliability MEMS switch for millimeter wave 5G applications

NASA Astrophysics Data System (ADS)

Shekhar, Sudhanshu; Vinoy, K. J.; Ananthasuresh, G. K.

2018-07-01

Lack of reliability of radio-frequency microelectromechanical systems (RF MEMS) switches has inhibited their commercial success. Dielectric stiction/breakdown and mechanical shock due to high actuation voltage are common impediments in capacitive MEMS switches. In this work, we report low-actuation voltage RF MEMS switch and its reliability test. Experimental characterization of fabricated devices demonstrate that proposed MEMS switch topology needs very low voltage (4.8 V) for actuation. The mechanical resonant frequency, f 0, quality factor, Q, and switching time are measured to be 8.35 kHz, 1.2, and 33 microsecond, respectively. These MEMS switches have high reliability in terms of switching cycles. Measurements are performed using pulse waveform of magnitude of 6 V under hot-switching condition. Temperature measurement results confirm that the reported switch topology has good thermal stability. The robustness in terms of the measured pull-in voltage shows a variation of 0.08 V °C‑1. Lifetime measurement results after 10 million switching cycles demonstrate insignificant change in the RF performance without any failure. Experimental results show that low voltage improves the lifetime. Low insertion loss (less than 0.6 dB) and improved isolation (above 40 dB) in the frequency range up to 60 GHz have been reported. Measured RF characteristics in the frequency range from 10 MHz to 60 GHz support that these MEMS switches are favorable choice for mm-wave 5G applications.

Ka-Band, RF MEMS Switches on CMOS Grade Silicon with a Polyimide Interface Layer

NASA Technical Reports Server (NTRS)

Ponchak, George E.; Varaljay, Nicholas C.; Papapolymerou, John

2003-01-01

For the first time, RF MEMS switcbes on CMOS grade Si witb a polyimide interface layer are fabricated and characterized. At Ka-Band (36.6 GHz), an insertion loss of 0.52 dB and an isolation of 20 dB is obtained.

Preface

NASA Astrophysics Data System (ADS)

Dascalu, Dan; Muller, Alexandru

2003-07-01

It is a great pleasure for us to introduce this special issue featuring selected papers from the 13th European Micromechanics Workshop, MME'02, organized by the National Institute for R&D in Microtechnologies (IMT Bucharest). The conference was held in the beautiful mountain resort Sinaia, a former Romanian royal residence, 120 km north of Bucharest. In 1989 the first MME workshop was held in Twente, since then it has traveled from one Western European country to another. MME'02 is the first workshop to have been held in Eastern Europe. MEMS consolidated as an exciting field for research and development over the past decade and the MEMS industry is now a substantial presence. Commercial applications of MEMS technology now include pressure, chemical, acceleration, rotation rate sensors, microphones, microdevices in microfluidic systems for bio-engineering, RF switches and fiber optic networks (optical switches), etc. Microtechnology is one of the major growth markets of the 21st century. Microsystems are now key products in information and communication technology, automotive engineering and are also increasing in the fields of chemistry and life sciences. The 6th Framework Programme, already underway, promotes long-term initiatives in this area of research. After reviewing 72 high-quality abstracts submitted for the conference, the programme organizers selected 68 for presentation during the one and half days of the workshop. There were 62 papers from Europe and six papers from outside Europe (USA, Canada and Singapore). The papers covered materials, processing, modeling and applications of micromachining and micromachined devices. Following the tradition of the MME workshops, non-invited papers were discussed at poster sessions after a short oral presentation. This formula was again highly appreciated and stimulated much discussion between scientists. Five invited papers were also presented orally. These invited talks reviewed the latest technological developments in MEMS topics. This year special attention was devoted to the emerging RF MEMS technology. In addition, a presentation of `Microsystems in FP6' was held as a special invited talk at the end of the conference. The selection of papers for inclusion in this issue was difficult, due to the high quality of the papers of the workshop. The final content is a result of the collaboration of the programme committee and Institute of Physics Publishing staff. We wish to thank our colleagues from the MME'02 programme committee: A G R Evans (Southampton University), M Hill (Cork Institute of Technology) and R Wolffenbuttel (Delft University of Technology). We are grateful to all participants for making the workshop a very stimulating meeting place for the MEMS community in Europe.

MEMS based ion beams for fusion

NASA Astrophysics Data System (ADS)

Persaud, A.; Seidl, P. A.; Ji, Q.; Waldron, W. L.; Schenkel, T.; Ardanuc, S.; Vinayakumar, K. B.; Schaffer, Z. A.; Lal, A.

2016-10-01

Micro-Electro-Mechanical Systems (MEMS) fabrication provides an exciting opportunity to shrink existing accelerator concepts to smaller sizes and to reduce cost by orders of magnitude. We revisit the concept of a Multiple Electrostatic Quadrupole Array Linear Accelerator (MEQALAC) and show how, with current technologies, the concept can be downsized from gap distances of several cm to distances in the sub-mm regime. The basic concept implements acceleration gaps using radio frequency (RF) fields and electrostatic quadrupoles (ESQ) on silicon wafers. First results from proof-of-concept experiments using printed circuit boards to realize the MEQALAC structures are presented. We show results from accelerating structures that were used in an array of nine (3x3) parallel beamlets with He ions at 15 keV. We will also present results from an ESQ focusing lattice using the same beamlet layout showing beam transport and matching. We also will discuss our progress in fabricating MEMS devices in silicon wafers for both the RF and ESQ structures and integration of necessary RF-circuits on-chip. The concept can be scaled up to thousands of beamlets providing high power beams at low cost and can be used to form and compress a plasma for the development of magnetized target fusion approaches. This work was supported by the Office of Science of the US Department of Energy through the ARPA-e ALPHA program under contracts DE-AC0205CH11231 (LBNL).

RF Telemetry System for an Implantable Bio-MEMS Sensor

NASA Technical Reports Server (NTRS)

Simons, Rainee N.; Hall, David G.; Miranda, Felix A.

2004-01-01

In this paper, a novel miniature inductor and a pick-up antenna for contact less powering and RF telemetry from implantable bio-MEMS sensors are presented. The design of the inductor and the pick-up antenna are discussed. In addition, the measured characteristics at the design frequency of 330 MHz have been shown.

Gamma-ray irradiation of ohmic MEMS switches

NASA Astrophysics Data System (ADS)

Maciel, John J.; Lampen, James L.; Taylor, Edward W.

2012-10-01

Radio Frequency (RF) Microelectromechanical System (MEMS) switches are becoming important building blocks for a variety of military and commercial applications including switch matrices, phase shifters, electronically scanned antennas, switched filters, Automatic Test Equipment, instrumentation, cell phones and smart antennas. Low power consumption, large ratio of off-impedance to on-impedance, extreme linearity, low mass, small volume and the ability to be integrated with other electronics makes MEMS switches an attractive alternative to other mechanical and solid-state switches for a variety of space applications. Radant MEMS, Inc. has developed an electrostatically actuated broadband ohmic microswitch that has applications from DC through the microwave region. Despite the extensive earth based testing, little is known about the performance and reliability of these devices in space environments. To help fill this void, we have irradiated our commercial-off-the-shelf SPST, DC to 40 GHz MEMS switches with gamma-rays as an initial step to assessing static impact on RF performance. Results of Co-60 gamma-ray irradiation of the MEMS switches at photon energies ≥ 1.0 MeV to a total dose of ~ 118 krad(Si) did not show a statistically significant post-irradiation change in measured broadband, RF insertion loss, insertion phase, return loss and isolation.

RF-MEMS tunable interdigitated capacitor and fixed spiral inductor for band pass filter applications

NASA Astrophysics Data System (ADS)

Bade, Ladon Ahmed; Dennis, John Ojur; Khir, M. Haris Md; Wen, Wong Peng

2016-11-01

This research presents the tunable Radio Frequency Micro Electromechanical Systems (RF-MEMS) coupled band-pass filter (BPF), which possess a wide tuning range and constructed by using the Chebyshev fourth degree equivalent circuit consisting of fixed inductors and interdigitated tunable capacitors. The suggested method was authenticated by designing a new tunable BPF with a 100% tuning range from 3.1 GHz to 4.9 GHz. The Metal Multi-User MEMS Process (Metal MUMPs) was involved in the process of design of this band-pass filter. It aimed to achieve the reconfiguration of frequencies and show high efficiency of RF in the applications that using Ultra Wide Band (UWB) such as wireless sensor networks. The RF performance of this filter was found to be very satisfactory due to its simple fabrication. Moreover, it showed less insertion loss of around 4 dB and high return loss of around 20 dB.

Microtechnology management considering test and cost aspects for stacked 3D ICs with MEMS

NASA Astrophysics Data System (ADS)

Hahn, K.; Wahl, M.; Busch, R.; Grünewald, A.; Brück, R.

2018-01-01

Innovative automotive systems require complex semiconductor devices currently only available in consumer grade quality. The European project TRACE will develop and demonstrate methods, processes, and tools to facilitate usage of Consumer Electronics (CE) components to be deployable more rapidly in the life-critical automotive domain. Consumer electronics increasingly use heterogeneous system integration methods and "More than Moore" technologies, which are capable to combine different circuit domains (Analog, Digital, RF, MEMS) and which are integrated within SiP or 3D stacks. Making these technologies or at least some of the process steps available under automotive electronics requirements is an important goal to keep pace with the growing demand for information processing within cars. The approach presented in this paper aims at a technology management and recommendation system that covers technology data, functional and non-functional constraints, and application scenarios, and that will comprehend test planning and cost consideration capabilities.

Miniaturization of components and systems for space using MEMS-technology

NASA Astrophysics Data System (ADS)

Grönland, Tor-Arne; Rangsten, Pelle; Nese, Martin; Lang, Martin

2007-06-01

Development of MEMS-based (micro electro mechanical system) components and subsystems for space applications has been pursued by various research groups and organizations around the world for at least two decades. The main driver for developing MEMS-based components for space is the miniaturization that can be achieved. Miniaturization can not only save orders of magnitude in mass and volume of individual components, but it can also allow increased redundancy, and enable novel spacecraft designs and mission scenarios. However, the commercial breakthrough of MEMS has not occurred within the space business as it has within other branches such as the IT/telecom or automotive industries, or as it has in biotech or life science applications. A main explanation to this is the highly conservative attitude to new technology within the space community. This conservatism is in many senses motivated by a very low risk acceptance in the few and costly space projects that actually ends with a space flight. To overcome this threshold there is a strong need for flight opportunities where reasonable risks can be accepted. Currently there are a few flight opportunities allowing extensive use of new technology in space, but one of the exceptions is the PRISMA program. PRISMA is an international (Sweden, Germany, France, Denmark, Norway, Greece) technology demonstration program with focus on rendezvous and formation flying. It is a two satellite LEO mission with a launch scheduled for the first half of 2009. On PRISMA, a number of novel technologies e.g. RF metrology sensor for Darwin, autonomous formation flying based on GPS and vision-based sensors, ADN-based "green propulsion" will be demonstrated in space for the first time. One of the satellites will also have a miniaturized propulsion system onboard based on MEMS-technology. This novel propulsion system includes two microthruster modules, each including four thrusters with micro- to milli-Newton thrust capability. The novelty of this micropropulsion system is that all critical components such as thrust chamber/nozzle assembly including internal heaters, valves and filters are manufactured using MEMS technology. Moreover, miniaturized pressure sensors, relying on MEMS technology, is also part of the system as a self-standing component. The flight opportunity on PRISMA represents one of the few and thus important opportunities to demonstrate MEMS technology in space. The present paper aims at describing this development effort and highlights the benefits of miniaturized components and systems for space using MEMS technology.

Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

NASA Astrophysics Data System (ADS)

Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter

2011-02-01

The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

Strategies for dynamic soft-landing in capacitive microelectromechanical switches

NASA Astrophysics Data System (ADS)

Jain, Ankit; Nair, Pradeep R.; Alam, Muhammad A.

2011-06-01

Electromechanical dielectric degradation associated with the hard landing of movable electrode is a technology-inhibiting reliability concern for capacitive RF-MEMS switches. In this letter, we propose two schemes for dynamic soft-landing that obviate the need for external feedback circuitry. Instead, the proposed resistive and capacitive braking schemes can reduce impact velocity significantly without compromising other performance characteristics like pull-in voltage and pull-in time. Resistive braking is achieved by inserting a resistance in series with the voltage source whereas capacitive braking requires patterning of the electrode or the dielectric. Our results have important implications to the design and optimization of reliability aware electrostatically actuated MEMS switches.

Amorphous SiC as a structural layer in microbridge-based RF MEMS switches for use in software-defined radio

NASA Astrophysics Data System (ADS)

Parro, Rocco J.; Scardelletti, Maximilian C.; Varaljay, Nicholas C.; Zimmerman, Sloan; Zorman, Christian A.

2008-10-01

This paper reports an effort to develop amorphous silicon carbide (a-SiC) films for use in shunt capacitor RF MEMS microbridge-based switches. The films were deposited using methane and silane as the precursor gases. Switches were fabricated using 500 nm and 300 nm-thick a-SiC films to form the microbridges. Switches made from metallized 500 nm-thick SiC films exhibited favorable mechanical performance but poor RF performance. In contrast, switches made from metallized 300 nm-thick SiC films exhibited excellent RF performance but poor mechanical performance. Load-deflection testing of unmetallized and metallized bulk micromachined SiC membranes indicates that the metal layers have a small effect on the Young's modulus of the 500 nm and 300 nm-thick SiC MEMS. As for residual stress, the metal layers have a modest effect on the 500 nm-thick structures, but a significant affect on the residual stress in the 300 nm-thick structures.

Uncertainty quantification in capacitive RF MEMS switches

NASA Astrophysics Data System (ADS)

Pax, Benjamin J.

Development of radio frequency micro electrical-mechanical systems (RF MEMS) has led to novel approaches to implement electrical circuitry. The introduction of capacitive MEMS switches, in particular, has shown promise in low-loss, low-power devices. However, the promise of MEMS switches has not yet been completely realized. RF-MEMS switches are known to fail after only a few months of operation, and nominally similar designs show wide variability in lifetime. Modeling switch operation using nominal or as-designed parameters cannot predict the statistical spread in the number of cycles to failure, and probabilistic methods are necessary. A Bayesian framework for calibration, validation and prediction offers an integrated approach to quantifying the uncertainty in predictions of MEMS switch performance. The objective of this thesis is to use the Bayesian framework to predict the creep-related deflection of the PRISM RF-MEMS switch over several thousand hours of operation. The PRISM switch used in this thesis is the focus of research at Purdue's PRISM center, and is a capacitive contacting RF-MEMS switch. It employs a fixed-fixed nickel membrane which is electrostatically actuated by applying voltage between the membrane and a pull-down electrode. Creep plays a central role in the reliability of this switch. The focus of this thesis is on the creep model, which is calibrated against experimental data measured for a frog-leg varactor fabricated and characterized at Purdue University. Creep plasticity is modeled using plate element theory with electrostatic forces being generated using either parallel plate approximations where appropriate, or solving for the full 3D potential field. For the latter, structure-electrostatics interaction is determined through immersed boundary method. A probabilistic framework using generalized polynomial chaos (gPC) is used to create surrogate models to mitigate the costly full physics simulations, and Bayesian calibration and forward propagation of uncertainty are performed using this surrogate model. The first step in the analysis is Bayesian calibration of the creep related parameters. A computational model of the frog-leg varactor is created, and the computed creep deflection of the device over 800 hours is used to generate a surrogate model using a polynomial chaos expansion in Hermite polynomials. Parameters related to the creep phenomenon are calibrated using Bayesian calibration with experimental deflection data from the frog-leg device. The calibrated input distributions are subsequently propagated through a surrogate gPC model for the PRISM MEMS switch to produce probability density functions of the maximum membrane deflection of the membrane over several thousand hours. The assumptions related to the Bayesian calibration and forward propagation are analyzed to determine the sensitivity to these assumptions of the calibrated input distributions and propagated output distributions of the PRISM device. The work is an early step in understanding the role of geometric variability, model uncertainty, numerical errors and experimental uncertainties in the long-term performance of RF-MEMS.

Insulator Charging in RF MEMS Capacitive Switches

DTIC Science & Technology

2005-06-01

and Simulations,” Journal of Microelectromechanical Systems, 8: 208-217 (June 1999). 5. Neaman , Donald. Semiconductor Physics & Devices. Boston...227-230 (2001). 5. Sze, S.M. Semiconductor Devices: Physics and Technology. New York: Wiley, 1985. 6. Neaman , Donald A. Semiconductor Physics...Radiation Response of Hafnium-Silicate Capacitors,” IEEE Transactions on Nuclear Science, 49: 3191-3196 (December 2002). 3. Neaman , D.A

Nanoionics-Based Switches for Radio-Frequency Applications

NASA Technical Reports Server (NTRS)

Nessel, James; Lee, Richard

2010-01-01

Nanoionics-based devices have shown promise as alternatives to microelectromechanical systems (MEMS) and semiconductor diode devices for switching radio-frequency (RF) signals in diverse systems. Examples of systems that utilize RF switches include phase shifters for electronically steerable phased-array antennas, multiplexers, cellular telephones and other radio transceivers, and other portable electronic devices. Semiconductor diode switches can operate at low potentials (about 1 to 3 V) and high speeds (switching times of the order of nanoseconds) but are characterized by significant insertion loss, high DC power consumption, low isolation, and generation of third-order harmonics and intermodulation distortion (IMD). MEMS-based switches feature low insertion loss (of the order of 0.2 dB), low DC power consumption (picowatts), high isolation (>30 dB), and low IMD, but contain moving parts, are not highly reliable, and must be operated at high actuation potentials (20 to 60 V) generated and applied by use of complex circuitry. In addition, fabrication of MEMS is complex, involving many processing steps. Nanoionics-based switches offer the superior RF performance and low power consumption of MEMS switches, without need for the high potentials and complex circuitry necessary for operation of MEMS switches. At the same time, nanoionics-based switches offer the high switching speed of semiconductor devices. Also, like semiconductor devices, nanoionics-based switches can be fabricated relatively inexpensively by use of conventional integrated-circuit fabrication techniques. More over, nanoionics-based switches have simple planar structures that can easily be integrated into RF power-distribution circuits.

The Impact of Emerging MEMS-Based Microsystems on US Defense Applications

DOE Office of Scientific and Technical Information (OSTI.GOV)

STAPLE,BEVAN D.; JAKUBCZAK II,JEROME F.

2000-01-20

This paper examines the impact of inserting Micro-Electro-Mechanical Systems (MEMS) into US defense applications. As specific examples, the impacts of micro Inertial Measurement Units (IMUs), radio frequency MEMS (RF MEMS), and Micro-Opto-Electro-Mechanical Systems (MOEMS) to provide integrated intelligence, communication, and control to the defense infrastructure with increased affordability, functionality, and performance are highlighted.

RF MEMS microswitches design and characterization

NASA Astrophysics Data System (ADS)

Lafontan, Xavier; Dufaza, Christian; Robert, Michel; Perez, Guy; Pressecq, Francis

2000-08-01

This paper presents the work performed in MUMPs on RF MEMS micro-switch. Concepts, design and characterization of switches are studied. The study particularly focuses on the electrical resistance characterization and modelization. The switches developed uses two different principle: overflowed gold and hinged beam. The realized contacts exhibited high on resistance (~20(Omega) ) due to nanoscopics asperities of contacts and insulating interfacial films. Results of a typical contact cleaning method are also presented.

Finite element based contact analysis of radio frequency MEMs switch membrane surfaces

NASA Astrophysics Data System (ADS)

Liu, Jin-Ya; Chalivendra, Vijaya; Huang, Wenzhen

2017-10-01

Finite element simulations were performed to determine the contact behavior of radio frequency (RF) micro-electro-mechanical (MEM) switch contact surfaces under monotonic and cyclic loading conditions. Atomic force microscopy (AFM) was used to capture the topography of RF-MEM switch membranes and later they were analyzed for multi-scale regular as well as fractal structures. Frictionless, non-adhesive contact 3D finite element analysis was carried out at different length scales to investigate the contact behavior of the regular-fractal surface using an elasto-plastic material model. Dominant micro-scale regular patterns were found to significantly change the contact behavior. Contact areas mainly cluster around the regular pattern. The contribution from the fractal structure is not significant. Under cyclic loading conditions, plastic deformation in the 1st loading/unloading cycle smooth the surface. The subsequent repetitive loading/unloading cycles undergo elastic contact without changing the morphology of the contacting surfaces. The work is expected to shed light on the quality of the switch surface contact as well as the optimum design of RF MEM switch surfaces.

THz semiconductor-based front-end receiver technology for space applications

NASA Technical Reports Server (NTRS)

Mehdi, Imran; Siegel, Peter

2004-01-01

Advances in the design and fabrication of very low capacitance planar Schottky diodes and millimeter-wave power amplifiers, more accurate device and circuit models for commercial 3-D electromagnetic simulators, and the availability of both MEMS and high precision metal machining, have enabled RF engineers to extend traditional waveguide-based sensor and source technologies well into the TI-Iz frequency regime. This short paper will highlight recent progress in realizing THz space-qualified receiver front-ends based on room temperature semiconductor devices.

The Responsivity of a Miniaturized Passive Implantable Wireless Pressure Sensor.

PubMed

Jiang, Hao; Lan, Di; Goldman, Ken; Etemadi, Mozziyar; Shahnasser, Hamid; Roy, Shuvo

2011-01-01

A miniature batteryless implantable wireless pressure sensor that can be used deep inside the body is desired by the medical community. MEMS technology makes it possible to achieve high responsivity that directly determines the operating distance between a miniature implanted sensor and the external RF probe, while providing the read-out. In this paper, for the first time, an analytical expression of the system responsivity versus the sensor design is derived using an equivalent circuit model. Also, the integration of micro-coil inductors and pressure sensitive capacitors on a single silicon chip using MEMS fabrication techniques is demonstrated. Further, the derived analytical design theory is validated by the measured responsivity of these sensors.

MEMS-based, RF-driven, compact accelerators

NASA Astrophysics Data System (ADS)

Persaud, A.; Seidl, P. A.; Ji, Q.; Breinyn, I.; Waldron, W. L.; Schenkel, T.; Vinayakumar, K. B.; Ni, D.; Lal, A.

2017-10-01

Shrinking existing accelerators in size can reduce their cost by orders of magnitude. Furthermore, by using radio frequency (RF) technology and accelerating ions in several stages, the applied voltages can be kept low paving the way to new ion beam applications. We make use of the concept of a Multiple Electrostatic Quadrupole Array Linear Accelerator (MEQALAC) and have previously shown the implementation of its basic components using printed circuit boards, thereby reducing the size of earlier MEQALACs by an order of magnitude. We now demonstrate the combined integration of these components to form a basic accelerator structure, including an initial beam-matching section. In this presentation, we will discuss the results from the integrated multi-beam ion accelerator and also ion acceleration using RF voltages generated on-board. Furthermore, we will show results from Micro-Electro-Mechanical Systems (MEMS) fabricated focusing wafers, which can shrink the dimension of the system to the sub-mm regime and lead to cheaper fabrication. Based on these proof-of-concept results we outline a scaling path to high beam power for applications in plasma heating in magnetized target fusion and in neutral beam injectors for future Tokamaks. This work was supported by the Office of Science of the US Department of Energy through the ARPA-e ALPHA program under contracts DE-AC02-05CH11231.

Staging of RF-accelerating Units in a MEMS-based Ion Accelerator

NASA Astrophysics Data System (ADS)

Persaud, A.; Seidl, P. A.; Ji, Q.; Feinberg, E.; Waldron, W. L.; Schenkel, T.; Ardanuc, S.; Vinayakumar, K. B.; Lal, A.

Multiple Electrostatic Quadrupole Array Linear Accelerators (MEQALACs) provide an opportunity to realize compact radio- frequency (RF) accelerator structures that can deliver very high beam currents. MEQALACs have been previously realized with acceleration gap distances and beam aperture sizes of the order of centimeters. Through advances in Micro-Electro-Mechanical Systems (MEMS) fabrication, MEQALACs can now be scaled down to the sub-millimeter regime and batch processed on wafer substrates. In this paper we show first results from using three RF stages in a compact MEMS-based ion accelerator. The results presented show proof-of-concept with accelerator structures formed from printed circuit boards using a 3 × 3 beamlet arrangement and noble gas ions at 10 keV. We present a simple model to describe the measured results. We also discuss some of the scaling behaviour of a compact MEQALAC. The MEMS-based approach enables a low-cost, highly versatile accelerator covering a wide range of currents (10 μA to 100 mA) and beam energies (100 keV to several MeV). Applications include ion-beam analysis, mass spectrometry, materials processing, and at very high beam powers, plasma heating.

Staging of RF-accelerating Units in a MEMS-based Ion Accelerator

DOE PAGES

Persaud, A.; Seidl, P. A.; Ji, Q.; ...

2017-10-26

Multiple Electrostatic Quadrupole Array Linear Accelerators (MEQALACs) provide an opportunity to realize compact radio- frequency (RF) accelerator structures that can deliver very high beam currents. MEQALACs have been previously realized with acceleration gap distances and beam aperture sizes of the order of centimeters. Through advances in Micro-Electro-Mechanical Systems (MEMS) fabrication, MEQALACs can now be scaled down to the sub-millimeter regime and batch processed on wafer substrates. In this paper we show first results from using three RF stages in a compact MEMS-based ion accelerator. The results presented show proof-of-concept with accelerator structures formed from printed circuit boards using a 3more » × 3 beamlet arrangement and noble gas ions at 10 keV. We present a simple model to describe the measured results. We also discuss some of the scaling behaviour of a compact MEQALAC. The MEMS-based approach enables a low-cost, highly versatile accelerator covering a wide range of currents (10 μA to 100 mA) and beam energies (100 keV to several MeV). Applications include ion-beam analysis, mass spectrometry, materials processing, and at very high beam powers, plasma heating.« less

Staging of RF-accelerating Units in a MEMS-based Ion Accelerator

DOE Office of Scientific and Technical Information (OSTI.GOV)

Persaud, A.; Seidl, P. A.; Ji, Q.

Multiple Electrostatic Quadrupole Array Linear Accelerators (MEQALACs) provide an opportunity to realize compact radio- frequency (RF) accelerator structures that can deliver very high beam currents. MEQALACs have been previously realized with acceleration gap distances and beam aperture sizes of the order of centimeters. Through advances in Micro-Electro-Mechanical Systems (MEMS) fabrication, MEQALACs can now be scaled down to the sub-millimeter regime and batch processed on wafer substrates. In this paper we show first results from using three RF stages in a compact MEMS-based ion accelerator. The results presented show proof-of-concept with accelerator structures formed from printed circuit boards using a 3more » × 3 beamlet arrangement and noble gas ions at 10 keV. We present a simple model to describe the measured results. We also discuss some of the scaling behaviour of a compact MEQALAC. The MEMS-based approach enables a low-cost, highly versatile accelerator covering a wide range of currents (10 μA to 100 mA) and beam energies (100 keV to several MeV). Applications include ion-beam analysis, mass spectrometry, materials processing, and at very high beam powers, plasma heating.« less

MEMS high-speed angular-position sensing system with rf wireless transmission

NASA Astrophysics Data System (ADS)

Sun, Winston; Li, Wen J.

2001-08-01

A novel surface-micromachined non-contact high-speed angular-position sensor with total surface area under 4mm2 was developed using the Multi-User MEMS Processes (MUMPs) and integrated with a commercial RF transmitter at 433MHz carrier frequency for wireless signal detection. Currently, a 2.3 MHz internal clock of our data acquisition system and a sensor design with a 13mg seismic mass is sufficient to provide visual observation of a clear sinusoidal response wirelessly generated by the piezoresistive angular-position sensing system within speed range of 180 rpm to around 1000 rpm. Experimental results showed that the oscillation frequency and amplitude are related to the input angular frequency of the rotation disk and the tilt angle of the rotation axis, respectively. These important results could provide groundwork for MEMS researchers to estimate how gravity influences structural properties of MEMS devices under different circumstances.

Design and analysis of a high Q MEMS passive RF filter

NASA Astrophysics Data System (ADS)

Rathee, Vishal; Pande, Rajesh

2016-04-01

Over the past few years, significant growth has been observed in using MEMS based passive components in the RF microelectronics domain, especially in transceiver system. This is due to some excellent properties of the MEMS devices like low loss, low cost and excellent isolation. This paper presents a design of high performance MEMS passive band pass filter, consisting of L and C with improved quality factor and insertion loss less than the reported filters. In this paper we have presented a design of 2nd order band pass filter with 2.4GHz centre frequency and 83MHz bandwidth for Bluetooth application. The simulation results showed improved Q-factor of 34 and Insertion loss of 1.7dB to 1.9dB. The simulation results needs to be validated by fabricating the device, fabrication flow of which is also presented in the paper.

Modeling of an 8-12 GHz receiver front-end based on an in-line MEMS frequency discriminator

NASA Astrophysics Data System (ADS)

Chu, Chenlei; Liao, Xiaoping

2018-06-01

This paper focuses on the modeling of an 8-12 GHz RF (radio frequency) receiver front-end based on an in-line MEMS (microelectromechanical systems) frequency discriminator. Actually, the frequency detection is realized by measuring the output dc thermal voltage generated by the MEMS thermoelectric power sensor. Based on this thermal voltage, it has a great potential to tune the resonant frequency of the VCO (voltage controlled oscillator) in the RF receiver front-end application. The equivalent circuit model of the in-line frequency discriminator is established and the measurement verification is also implemented. Measurement and simulation results show that the output dc thermal voltage has a nearly linear relation with frequency. A new construction of RF receiver front-end is then obtained by connecting the in-line frequency discriminator with the voltage controlling port of VCO. Lastly, a systemic simulation is processed by computer-aided software and the real-time simulation waveform at each key point is observed clearly.

Technical Digest of the 1998 Summer Topical Meeting on Organic Optics and Optoelectronics

DTIC Science & Technology

1998-07-01

substantially larger voltages (~2x), however, signal distortion and inter- symbol interference due to multiple RF reflections limit their...technology as data page composers. Texas Instrument’s DMD 0-7803-4953-9/98$10.00©1998 IEEE system has already been used in this capacity in several... lithography for fabricating and integrating the heads and sliders. The application of MEMS components and micromachined optical bench packaging techniques

Micromachined sensor for stress measurement and micromechanical study of free-standing thin films for MEMS applications

NASA Astrophysics Data System (ADS)

Zhang, Ping

Microelectromechanical systems (MEMS) have a wide range of applications. In the field of wireless and microwave technology, considerable attention has been given to the development and integration of MEMS-based RF (radio frequency) components. An RF MEMS switch requires low insertion loss, high isolation, and low actuation voltage - electrical aspects that have been extensively studied. The mechanical requirements of the switch, such as low sensitivity to built-in stress and high reliability, greatly depend on the micromechanical properties of the switch materials, and have not been thoroughly explored. RF MEMS switches are typically in the form of a free-standing thin film structure. Large stress gradients and across-wafer stress variations developed during fabrication severely degrade their electrical performance. A micromachined stress measurement sensor has been developed that can potentially be employed for in-situ monitoring of stress evolution and stress variation. The sensors were micromachined using five masks on two wafer levels, each measuring 5x3x1 mm. They function by means of an electron tunneling mechanism, where a 2x2 mm silicon nitride membrane elastically deflects under an applied deflection voltage via an external feedback circuitry. For the current design, the sensors are capable of measuring tensile stresses up to the GPa range under deflection voltages of 50--100 V. Sensor functionality was studied by finite element modeling and a theoretical analysis of square membrane deflection. While the mechanical properties of thin films on substrates have been extensively studied, studies of free-standing thin films have been limited due to the practical difficulties in sample handling and testing. Free-standing Al and Al-Ti thin films specimens have been successfully fabricated and microtensile and stress relaxation tests have been performed using a custom-designed micromechanical testing apparatus. A dedicated TEM (transmission electron microscopy) sample preparation technique allows the investigation of the microstructures of these thin films both before and after mechanical testing to correlate the microstructural findings with the mechanical behavior. Major studies include grain boundary strengthening in pure Al, plastic deformation in pure Al by inhomogeneous deformation and localized grain thinning, solid solution and precipitate strengthening in Al-Ti alloys, and stress relaxation of Al and Al-Ti.

Analysis of dual-frequency MEMS antenna using H-MRTD method

NASA Astrophysics Data System (ADS)

Yu, Wenge; Zhong, Xianxin; Chen, Yu; Wu, Zhengzhong

2004-10-01

For applying micro/nano technologies and Micro-Electro-Mechanical System (MEMS) technologies in the Radio Frequency (RF) field to manufacture miniature microstrip antennas. A novel MEMS dual-band patch antenna designed using slot-loaded and short-circuited size-reduction techniques is presented in this paper. By controlling the short-plane width, the two resonant frequencies, f10 and f30, can be significantly reduced and the frequency ratio (f30/f10) is tunable in the range 1.7~2.3. The Haar-Wavelet-Based multiresolution time domain (H-MRTD) with compactly supported scaling function for a full three-dimensional (3-D) wave to Yee's staggered cell is used for modeling and analyzing the antenna for the first time. Associated with practical model, an uniaxial perfectly matched layer (UPML) absorbing boundary conditions was developed, In addition , extending the mathematical formulae to an inhomogenous media. Numerical simulation results are compared with those using the conventional 3-D finite-difference time-domain (FDTD) method and measured. It has been demonstrated that, with this technique, space discretization with only a few cells per wavelength gives accurate results, leading to a reduction of both memory requirement and computation time.

Applications of Non-linearities in RF MEMS Switches and Resonators

NASA Astrophysics Data System (ADS)

Vummidi Murali, Krishna Prasad

The 21st century is emerging into an era of wireless ubiquity. To support this trend, the RF (Radio Frequency) front end must be capable of processing a range of wireless signals (cellular phone, data connectivity, broadcast TV, GPS positioning, etc.) spanning a total bandwidth of nearly 6 GHz. This warrants the need for multi-band/multi-mode radio architectures. For such architectures to satisfy the constraints on size, battery life, functionality and cost, the radio front-end must be made reconfigurable. RF-MEMS (RF Micro-Electro-Mechanical Systems) are seen as an enabling technology for such reconfigurable radios. RF-MEMS mainly include micromechanical switches (used in phase shifters, switched capacitor banks, impedance tuners etc.) and micromechanical resonators (used in tunable filters, oscillators, reference clocks etc.). MEMS technology also has the potential to be directly integrated into CMOS (Complementary metal-oxide semiconductor) ICs (Integrated Circuits) leading to further potential reductions of cost and size. However, RF-MEMS face challenges that must be addressed before they can gain widespread commercial acceptance. Relatively low switching speed, power handling, and high-voltage drive are some of the key issues in MEMS switches. Phase noise influenced by non-linearities, need for temperature compensation (especially Si based resonators), large start-up times, and aging are the key issues in Si MEMS Resonators. In this work potential solutions are proposed to address some of these key issues, specifically the reduction of high voltage drives in switches and the reduction of phase noise in MEMS resonators for timing applications. MEMS devices that are electrostatically actuated exhibit significant non-linearities. The origins of the non-linearities are both electrical (electrostatic actuation) and mechanical (dimensions and material properties). The influence of spring non-linearities (cubic and quadratic) on the performance of switches and resonators are studied. Gold electroplated fixed-fixed beams were fabricated to test the phenomenon of dynamic (or resonant) pull-in in shunt switches. The dynamic pull-in phenomenon was also tested on commercially fabricated lateral switches. It is shown that the resonant pull-in technique reduces the overall voltage required to actuate the switch. There is an additional reduction of total actuation voltage possible via applying an AC actuation signal at the correct non-linear resonant frequency. The demonstrated best case savings from operating at the non-linear resonance is 50% (for the lateral switch) and 60% (for the vertical switch) as compared to 25% and 40% respectively using a fixed frequency approach. However, the timing response for resonant pull-in has been experimentally shown to be slower than the static actuation. To reduce the switching time, a shifted-frequency method is proposed where the excitation frequency is shifted up or down by a discrete amount deltaO after a brief hold time. It was theoretically shown that the shifted-frequency method enables a minimum realizable switching time comparable to the static switching time for a given set of actuation frequencies. The influence of VDC on the effective non-linearities of a fixed-fixed beam is also studied. Based on the dimensions of the resonator and the type of resonance there is a certain VDC,Lin where the response is near linear (S ≈ 0). In the near-linear domain, the dynamic pull-in is the only upper bound to the amplitude of vibrations, and hence the amplitude of output current, thereby maximizing the power handling capacity of the resonator. Apart from maximizing the output current, it is essential to reduce the amplitude and phase variations of the displacement response which are due to noise mixing into frequency of interest, and are eventually manifested as output phase noise due to capacitive current nonlinearity. Two major aliasing schemes were analyzed and it was shown that the capacitive force non-linearity is the major source of mixing that causes the up-conversion of 1/f frequency into signal sidebands. The resonator's periodic response (displacement) is defined by a set of two first-order nonlinear ordinary differential equations that describe the modulation of amplitude and phase of the response. Frequency response curves of amplitude and frequency are determined from these modulation equations. The zero slope point on the amplitude resonance curve is the peak of the resonance curve where the phase (gammadc) of the response is +/-pi/2. For a strongly non-linear system, the resonance curves are skewed based on the amount of total non-linearity S. For systems that are strongly non-linear, the best region to operate the resonator is the fixed point that correspond to infinite slope (gammadc = +/-2pi/3) in the frequency response of the system. The best case phase noise response was analytically developed for such a fixed point. Theoretically at this fixed point, phase noise will have contributions only from 1/ fnoise and not from 1/f2 and 1/ f3. The resonators phase can be set by controlling the rest of the phase in the loop such that the total phase around the loop is zero or 2pi. In addition, this work has also developed an analytical model for a lateral MEMS switch fabricated in a commercial foundry that has the potential to be processed as MEMS on CMOS. This model accounts for trapezoidal cross sections of the electrodes and springs and also models electrostatic fringing as a function of the moving gap. The analytical model matches closely with the Finite Element (FEA) model.

A fully wafer-level packaged RF MEMS switch with low actuation voltage using a piezoelectric actuator

NASA Astrophysics Data System (ADS)

Park, Jae-Hyoung; Lee, Hee-Chul; Park, Yong-Hee; Kim, Yong-Dae; Ji, Chang-Hyeon; Bu, Jonguk; Nam, Hyo-Jin

2006-11-01

In this paper, a fully wafer-level packaged RF MEMS switch has been demonstrated, which has low operation voltage, using a piezoelectric actuator. The piezoelectric actuator was designed to operate at low actuation voltage for application to advanced mobile handsets. The dc contact type RF switch was packaged using the wafer-level bonding process. The CPW transmission lines and piezoelectric actuators have been fabricated on separate wafers and assembled together by the wafer-level eutectic bonding process. A gold and tin composite was used for eutectic bonding at a low temperature of 300 °C. Via holes interconnecting the electrical contact pads through the wafer were filled completely with electroplated copper. The fully wafer-level packaged RF MEMS switch showed an insertion loss of 0.63 dB and an isolation of 26.4 dB at 5 GHz. The actuation voltage of the switch was 5 V. The resonant frequency of the piezoelectric actuator was 38.4 kHz and the spring constant of the actuator was calculated to be 9.6 N m-1. The size of the packaged SPST (single-pole single-through) switch was 1.2 mm × 1.2 mm including the packaging sealing rim. The effect of the proposed package structure on the RF performance was characterized with a device having CPW through lines and vertical feed lines excluding the RF switches. The measured packaging loss was 0.2 dB and the return loss was 33.6 dB at 5 GHz.

A flexible Li-ion battery with design towards electrodes electrical insulation

NASA Astrophysics Data System (ADS)

Vieira, E. M. F.; Ribeiro, J. F.; Sousa, R.; Correia, J. H.; Goncalves, L. M.

2016-08-01

The application of micro electromechanical systems (MEMS) technology in several consumer electronics leads to the development of micro/nano power sources with high power and MEMS integration possibility. This work presents the fabrication of a flexible solid-state Li-ion battery (LIB) (~2.1 μm thick) with a design towards electrodes electrical insulation, using conventional, low cost and compatible MEMS fabrication processes. Kapton® substrate provides flexibility to the battery. E-beam deposited 300 nm thick Ge anode was coupled with LiCoO2/LiPON (cathode/solid-state electrolyte) in a battery system. LiCoO2 and LiPON films were deposited by RF-sputtering with a power source of 120 W and 100 W, respectively. LiCoO2 film was annealed at 400 °C after deposition. The new design includes Si3N4 and LiPO thin-films, providing electrode electrical insulation and a battery chemical stability safeguard, respectively. Microstructure and battery performance were investigated by scanning electron microscopy, electric resistivity and electrochemical measurements (open circuit potential, charge/discharge cycles and electrochemical impedance spectroscopy). A rechargeable thin-film and lightweight flexible LIB using MEMS processing compatible materials and techniques is reported.

Integrated Multiple Device CMOS-MEMS IMU Systems and RF MEMS Applications

DTIC Science & Technology

2002-12-17

microstructures [7]~[9]. The success of the surface-micromachined electrostatic micromotor in the late 80’s [10] stimulated the industry and government...processed electrostatic synchronous micromotors ,” Sensors Actuators, vol. 20, pp. 48-56, 1989. [11] “ADXL05-monolithic accelerometer with signal

Charging and breakdown in amorphous dielectrics: Phenomenological modeling approach and applications

NASA Astrophysics Data System (ADS)

Palit, Sambit

Amorphous dielectrics of different thicknesses (nm to mm) are used in various applications. Low temperature processing/deposition of amorphous thin-film dielectrics often result in defect-states or electronic traps. These traps are responsible for increased leakage currents and bulk charge trapping in many associated applications. Additional defects may be generated during regular usage, leading to electrical breakdown. Increased leakage currents, charge trapping and defect generation/breakdown are important and pervasive reliability concerns in amorphous dielectrics. We first explore the issue of charge accumulation and leakage in amorphous dielectrics. Historically, charge transport in amorphous dielectrics has been presumed, depending on the dielectric thickness, to be either bulk dominated (Frenkel-Poole (FP) emission) or contact dominated (Fowler-Nordheim tunneling). We develop a comprehensive dielectric charging modeling framework which solves for the transient and steady state charge accumulation and leakage currents in an amorphous dielectric, and show that for intermediate thickness dielectrics, the conventional assumption of FP dominated current transport is incorrect, and may lead to false extraction of dielectric parameters. We propose an improved dielectric characterization methodology based on an analytical approximation of our model. Coupled with ab-initio computed defect levels, the dielectric charging model explains measured leakage currents more accurately with lesser empiricism. We study RF-MEMS capacitive switches as one of the target applications of intermediate thickness amorphous dielectrics. To achieve faster analysis and design of RF-MEMS switches in particular, and electro-mechanical actuators in general, we propose a set of fundamental scaling relationships which are independent of specific physical dimensions and material properties; the scaling relationships provide an intrinsic classification of all electro-mechanical actuators. However, RF-MEMS capacitive switches are plagued by the reliability issue of temporal shifts of actuation voltages due to dielectric charge accumulation, often resulting in failure due to membrane stiction. Using the dielectric charging model, we show that in spite of unpredictable roughness of deposited dielectrics, there are predictable shifts in actuation voltages due to dielectric charging in RF-MEMS switches. We also propose a novel non-obtrusive, non-contact, fully electronic resonance based technique to characterize charging driven actuation shifts in RF-MEMS switches which overcomes limitations in conventionally used methods. Finally, we look into the issue of defect generation and breakdown in thick polymer dielectrics. Polymer materials often face premature electrical breakdown due to high electric fields and frequencies, and exposure to ambient humidity conditions. Using a field-driven correlated defect generation model, coupled with a model for temperature rise due to dielectric heating at AC stresses, we explain measured trends in time-to-breakdown and breakdown electric fields in polymer materials. Using dielectric heating we are able to explain the observed lifetime and dielectric strength reduction with increasing dielectric thicknesses. Performing lifetime measurements after exposure to controlled humidity conditions, we find that moisture ingress into a polymer material reduces activation barriers for chain breakage and increases dielectric heating. Overall, this thesis develops a comprehensive framework of dielectric charging, leakage and degradation of insulators of different thicknesses that have broad applications in multiple technologies.

Electrostatic Radio Frequency (RF) Microelectromechanical Systems (MEMS) Switches With Metal Alloy Electric Contacts

DTIC Science & Technology

2004-09-01

Serway , Raymond A. Physics for Scientists and Engineers . New York: Saunders College Publishing, 1986. 141. Sharvin, Y.V. Sov. Phys. JETP , 21 :655 (1965...III. Theory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.1 Micro-Switch Physical Description . . . . . . . . . . . 17 3.2 MEMS...Insertion Loss . . . . . . . . . . . . . . . . . . . . . . . . 56 IMD Intermodulation Distortion . . . . . . . . . . . . . . . . 56 PVD Physical Vapor

A High Isolation Series-Shunt RF MEMS Switch

PubMed Central

Yu, Yuan-Wei; Zhu, Jian; Jia, Shi-Xing; Shi, Yi

2009-01-01

This paper presents a wide band compact high isolation microelectromechanical systems (MEMS) switch implemented on a coplanar waveguide (CPW) with three ohmic switch cells, which is based on the series-shunt switch design. The ohmic switch shows a low intrinsic loss of 0.1 dB and an isolation of 24.8 dB at 6 GHz. The measured average pull-in voltage is 28 V and switching time is 47 μs. In order to shorten design period of the high isolation switch, a structure-based small-signal model for the 3-port ohmic MEMS switch is developed and parameters are extracted from the measured results. Then a high isolation switch has been developed where each 3-port ohmic MEMS switch is closely located. The agreement of the measured and modeled radio frequency (RF) performance demonstrates the validity of the electrical equivalent model. Measurements of the series-shunt switch indicate an outstanding isolation of more than 40 dB and a low insertion loss of 0.35 dB from DC to 12 GHz with total chip size of 1 mm × 1.2 mm. PMID:22408535

Gold-based thin multilayers for ohmic contacts in RF-MEMS switches

NASA Astrophysics Data System (ADS)

Mulloni, V.; Iannacci, J.; Bartali, R.; Micheli, V.; Colpo, S.; Laidani, N.; Margesin, B.

2011-06-01

In RF-MEMS switches many reliability issues are related to the metal contacts in the switching area. The characteristics of this contact influence not only contact resistance and insertion loss, but also the most relevant switch failure mechanisms that are wear of ohmic contact, adhesion and stiction. Gold is widely used for this purpose because of its good conductivity and chemical inertness, but is a soft metal, and the development of hard contact materials with low resistivity is of great interest for RF-MEMS switch reliability. It is possible to increase the contact hardness preserving the convenient gold properties alternating gold layers with thin layers of different metals. The material becomes harder not only by simple alloying but also by the presence of interfaces which act as barriers for mechanical dislocation migration. A detailed study of mechanical, electrical and morphological properties of gold-chromium, gold-platinum and gold-palladium multilayers is presented and discussed. It is found that the annealing treatments are important for tuning hardness values, and a careful choice of the alloying metal is essential when the material is inserted in a real switch fabrication cycle, because hardness improvements can vanish during oxygen plasma treatments usually involved in RF-switches fabrication. Platinum is the only metal tested that is unaffected by oxidation, and also modifies the chromium adhesion layer diffusion on the contact surface.

High Isolation Single-Pole Four-Throw RF MEMS Switch Based on Series-Shunt Configuration

PubMed Central

Khaira, Navjot

2014-01-01

This paper presents a novel design of single-pole four-throw (SP4T) RF-MEMS switch employing both capacitive and ohmic switches. It is designed on high-resistivity silicon substrate and has a compact area of 1.06 mm2. The series or ohmic switches have been designed to provide low insertion loss with good ohmic contact. The pull-in voltage for ohmic switches is calculated to be 7.19 V. Shunt or capacitive switches have been used in each port to improve the isolation for higher frequencies. The proposed SP4T switch provides excellent RF performances with isolation better than 70.64 dB and insertion loss less than 0.72 dB for X-band between the input port and each output port. PMID:24711730

Design of DC-contact RF MEMS switch with temperature stability

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sun, Junfeng; Nanjing Electronic Devices Institute, Nanjing, 210016; Li, Zhiqun, E-mail: zhiqunli@seu.edu.cn

In order to improve the temperature stability of DC-contact RF MEMS switch, a thermal buckle-beam structure is implemented. The stability of the switch pull-in voltage versus temperature is not only improved, but also the impact of stress and stress gradient on the drive voltage is suppressed. Test results show that the switch pull-in voltage is less sensitive to temperature between -20 °C and 100 °C. The variable rate of pull-in voltage to temperature is about -120 mV/°C. The RF performance of the switch is stable, and the isolation is almost independent of temperature. After being annealed at 280 °C formore » 12 hours, our switch samples, which are suitable for packaging, have less than 1.5% change in the rate of pull-in voltage.« less

Design and simulation of RF MEMS SPST shunt and SPDT shunt-shunt switches for X-band and Ku-band applications

NASA Astrophysics Data System (ADS)

Lenka, Manas K.; Sharma, Amit; Sharma, Jaibir; DasGupta, Amitava

2012-10-01

This paper describes the design and simulation of RF MEMS SPST shunt and SPDT shunt-shunt switches with modified coplanar waveguide (CPW) configuration for X-band and Ku-band applications exhibiting high isolation and low insertion loss. By modifying the basic CPW structure for a six-strip membrane having length 720 μm, the resonant frequency can be reduced from 33.5 GHz to 13.5 GHz with isolation as high as -30 dB(-63 dB at resonant frequency) in Ku-band. Similar results are also found in case SPST and SPDT switches with other membrane types.

Alternative Dielectric Films for rf MEMS Capacitive Switches Deposited using Atomic Layer Deposited Al2O3/ZnO Alloys

DTIC Science & Technology

2006-07-02

A s c c s r t h s l © K 1 b c A a e t s C t o 0 d Sensors and Actuators A 135 (2007) 262–272 Alternative dielectric films for rf MEMS capacitive...Zn concentrations in the alloy films , which was lower than expected. Atomic force microscopy images evealed an average surface roughness of 0.27 nm...that was independent of deposition temperature and film composition. The dielectric constants of he Al2O3/ZnO ALD alloys films were calculated to be

The rectenna design on contact lens for wireless powering of the active intraocular pressure monitoring system.

PubMed

Cheng, H W; Jeng, B M; Chen, C Y; Huang, H Y; Chiou, J C; Luo, C H

2013-01-01

This paper proposed a wireless power harvesting system with micro-electro-mechanical-systems (MEMS) fabrication for noninvasive intraocular pressure (IOP) measurement on soft contact lens substructure. The power harvesting IC consists of a loop antenna, an impedance matching network and a rectifier. The proposed IC has been designed and fabricated by CMOS 0.18 um process that operates at the ISM band of 5.8 GHz. The antenna and the power harvesting IC would be bonded together by using flip chip bonding technologies without extra wire interference. The circuit utilized an impedance transformation circuit to boost the input RF signal that improves the circuit performance. The proposed design achieves an RF-to-DC conversion efficiency of 35% at 5.8 GHz.

Effectiveness of BaTiO 3 dielectric patches on YBa 2Cu 3O 7 thin films for MEM switches

DOE PAGES

Vargas, J.; Hijazi, Y.; Noel, J.; ...

2014-05-12

A micro-electro-mechanical (MEM) switch built on a superconducting microstrip filter will be utilized to investigate BaTiO 3 dielectric patches for functional switching points of contact. Actuation voltage resulting from the MEM switch provokes static friction between the bridge membrane and BaTiO 3 insulation layer. Furthermore, the dielectric patch crystal structure and roughness affect the ability of repetitively switching cycles and lifetime. We performed a series of experiments using different deposition methods and RF magnetron sputtering was found to be the best deposition process for the BaTiO 3 layer. The effect examination of surface morphology will be presented using characterization techniquesmore » as x-ray diffraction, SEM and AFM for an optimum switching device. The thin film is made of YBa 2Cu 3O 7 deposited on LaAlO 3 substrate by pulsed laser deposition. In our work, the dielectric material sputtering pressure is set at 9.5x10 -6 Torr. The argon gas is released through a mass-flow controller to purge the system prior to deposition. RF power is 85 W at a distance of 9 cm. The behavior of Au membranes built on ultimate BaTiO 3 patches will be shown as part of the results. These novel surface patterns will in turn be used in modelling other RF MEM switch devices such as distributed-satellite communication system operating at cryogenic temperatures.« less

NANOSPACE-1: the Impacts of the First Swedish Nanosatellite on Spacecraft Architecture and Design

NASA Astrophysics Data System (ADS)

Bruhn, F.; Köhler, J.; Stenmark, L.

2002-01-01

NanoSpace-1 (NS-1), due to be launched in late 2003 or early 2004 will test highly advanced Micro Systems Technology (MST) for space applications. These devices are highly miniaturized and optimized complete systems in the sense that all parts of the system are processed with MST and integrated as Multifunctional Microsystems (MMS). The very high level of miniaturization and multifunctionallity in the MMS, will enable easier access to space for nanosatellites to perform better scientific research. This new class of high performing small satellites will open areas for research that before only could be done with much larger and costly satellites. Many institutions, universities, and small countries will benefit greatly as that nanosatellites become more capable per mass unit and volume unit than other spacecraft. These new MMS/MST satellites will provide the ground for a better and less expensive exploration of space. NS-1 will be the first high-performing nanosatellite by using MST/MMS to many subsystems and modules. The whole spacecraft will be built around MMS and will include multifunctional 3D-Multi Chip Modules (3D-MCM), a 3D thin film solar sensor, thin film coating for passive thermal control, variable emittance panels, microwave MEMS patch antennas, micromechanical thermal switches, thin film solar cells with record high efficiency and finally silicon as multifunctional active structure elements. The complete spacecraft will weigh about 7 kg and have dimensions of 32x32x15 cm. The overall mission for NS-1 is to test the new technologies mentioned above, and to collect experiences in the field of MMS architecture. However, new technologies in itself will not take us to a new generation spacecraft. Deeply integrated within the structure of the NanoSpace program are new system designs and multifunctional systems thinking. Distributed and autonomous subsystems are very important when incorporating new technologies with high redundancy. Autonomous systems also reduce the complexity of the overall spacecraft design since many functions can be placed in multifunctional multichip modules. This implies an increase of the complexity at the spacecraft subsystem level. NanoSpace-1 will test several new autonomous, distributed, and miniaturized multifunctional systems, including large memories modules, house keeping modules, RF- MEMS, and power conditioning modules. The MMS concept comprises several features, for instance, all 3D-multi chip modules are part of the spacecraft structure itself. The use of 3D-MCM modules as a large part of the spacecraft hull is a direct application of MMS thinking; the modules are load taking structure elements, and also contain many subsystems of the spacecraft. The MMS thinking is illustrated by the RF-MEMS 3D-MCM module. All other modules will be further presented in the paper. The RF-MEMS module comprises micro strips, patch-antennas, solid state power amplifiers, thermal control, micromechanical switches, power conditioning, radiation shields, and command interfaces. The size of the RF-module is 68x68x5 mm and has a weight of less than 70g. The module is designed to handle different frequencies, only by changing the top wafers and the mixer chip. MST and MMS integrated modules pose at least two major challenges compared to conventional technology. First, the processes cannot be changed half way to the product. Any substantial change in the process will almost certainly require a complete redesign of the whole system. Secondly, qualification and product assurance becomes more important since the processes in MMS tend to be long and complicated. The Ångström Space Technology Centre (ÅSTC) is a center for development of Micro Systems Technologies (MST) for Space Applications at the department of Materials Science at Uppsala University in Sweden. The center is now taking the next step in the ongoing Nanosatellite program, called the NanoSpace program. Backed by funding from the Swedish National Space Board (SNSB), the European Space Agency (ESA), and the European Commission (EC), the ÅSTC will begin developing nanosatellites to demonstrate the next generation spacecraft. The Nanosatellite program is built around a launch every 2nd year to test, verify and qualify new MST technologies for space. The Nanosatellite effort is a solid and well founded program with a backbone of technology research and Multifunctional Microsystems (MMS) thinking.

A capacitive power sensor based on the MEMS cantilever beam fabricated by GaAs MMIC technology

NASA Astrophysics Data System (ADS)

Yi, Zhenxiang; Liao, Xiaoping

2013-03-01

In this paper, a novel capacitive power sensor based on the microelectromechanical systems (MEMS) cantilever beam at 8-12 GHz is proposed, fabricated and tested. The presented design can not only realize a cantilever beam instead of the conventional fixed-fixed beam, but also provide fine compatibility with the GaAs monolithic microwave integrated circuit (MMIC) process. When the displacement of the cantilever beam is very small compared with the initial height of the air gap, the capacitance change between the measuring electrode and the cantilever beam has an approximately linear dependence on the incident radio frequency (RF) power. Impedance compensating technology, by modifying the slot width of the coplanar waveguide transmission line, is adopted to minimize the effect of the cantilever beam on the power sensor; its validity is verified by the simulation of high frequency structure simulator software. The power sensor has been fabricated successfully by Au surface micromachining using polyimide as the sacrificial layer on the GaAs substrate. Optimization of the design with impedance compensating technology has resulted in a measured return loss of less than -25 dB and an insertion loss of around 0.1 dB at 8-12 GHz, which shows the slight effect of the cantilever beam on the microwave performance of this power sensor. The measured capacitance change starts from 0.7 fF to 1.3 fF when the incident RF power increases from 100 to 200 mW and an approximate linear dependence has been obtained. The measured sensitivities of the sensor are about 6.16, 6.27 and 6.03 aF mW-1 at 8, 10 and 12 GHz, respectively.

Some metal oxides and their applications for creation of Microsystems (MEMS) and Energy Harvesting Devices (EHD)

NASA Astrophysics Data System (ADS)

Denishev, K.

2016-10-01

This is a review of a part of the work of the Technological Design Group at Technical University of Sofia, Faculty of Electronic Engineering and Technologies, Department of Microelectronics. It is dealing with piezoelectric polymer materials and their application in different microsystems (MEMS) and Energy Harvesting Devices (EHD), some organic materials and their applications in organic (OLED) displays, some transparent conductive materials etc. The metal oxides Lead Zirconium Titanate (PZT) and Zinc Oxide (ZnO) are used as piezoelectric layers - driving part of different sensors, actuators and EHD. These materials are studied in term of their performance in dependence on the deposition conditions and parameters. They were deposited as thin films by using RF Sputtering System. As technological substrates, glass plates and Polyethylenetherephtalate (PET) foils were used. For characterization of the materials, a test structure, based on Surface Acoustic Waves (SAW), was designed and prepared. The layers were characterized by Fourier Transform Infrared spectroscopy (FTIR). The piezoelectric response was tested at variety of mechanical loads (tensile strain, stress) in static and dynamic (multiple bending) mode. The single-layered and double-layered structures were prepared for piezoelectric efficiency increase. A structure of piezoelectric energy transformer is proposed and investigated.

Demonstration of a wireless driven MEMS pond skater that uses EWOD technology

NASA Astrophysics Data System (ADS)

Mita, Y.; Li, Y.; Kubota, M.; Morishita, S.; Parkes, W.; Haworth, L. I.; Flynn, B. W.; Terry, J. G.; Tang, T.-B.; Ruthven, A. D.; Smith, S.; Walton, A. J.

2009-07-01

A silicon swimming robot or pond skating device has been demonstrated. It floats on liquid surfaces using surface tension and is capable of movement using electrowetting on dielectric (EWOD) based propulsion. Its dimensions are 6 × 9 mm and the driving mechanism involves first trapping air bubbles within the liquid onto the hydrophobic surface of the device. The air bubbles are then moved using EWOD, which provides the propulsion. The device employs a recently reported TaO EWOD technology enabling a driving voltage of ≈15 V, which is low enough for RF power transmission, thus facilitating wire-free movement. A wired version has been measured to move 1.35 mm in 168 ms (a speed of 8 mm s -1). This low voltage-EWOD (<15 V) device, fabricated using a CMOS compatible process, is believed to be the world's smallest swimming MEMS device that has no mechanical moving parts. The paper also reports results of EWOD droplet operation driven by wireless power transmission and demonstrates that such a wireless design can be successfully mounted on a floating EWOD device to produce movement.

Characterization of a piezoelectric MEMS actuator surface toward motion-enabled reconfigurable RF circuits

NASA Astrophysics Data System (ADS)

Tellers, M. C.; Pulskamp, J. S.; Bedair, S. S.; Rudy, R. Q.; Kierzewski, I. M.; Polcawich, R. G.; Bergbreiter, S. E.

2018-03-01

As an alternative to highly constrained hard-wired reconfigurable RF circuits, a motion-enabled reconfigurable circuit (MERC) offers freedom from transmission line losses and homogeneous materials selection. The creation of a successful MERC requires a precise mechanical mechanism for relocating components. In this work, a piezoelectric MEMS actuator array is modeled and experimentally characterized to assess its viability as a solution to the MERC concept. Actuation and design parameters are evaluated, and the repeatability of high quality on-axis motion at greater than 1 mm s-1 is demonstrated with little positional error. Finally, an initial proof-of-concept circuit reconfiguration has been demonstrated using off-the-shelf RF filter components. Although initial feasibility tests show filter performance degradation with an additional insertion loss of 0.3 dB per contact, out-of-band rejection degradation as high as 10 dB, and ripple performance reduction from 0.25 dB to 1.5 dB, MERC is proven here as an alternative to traditional approaches used in reconfigurable RF circuit applications.

Advancing MEMS Technology Usage through the MUMPS (Multi-User MEMS Processes) Program

NASA Technical Reports Server (NTRS)

Koester, D. A.; Markus, K. W.; Dhuler, V.; Mahadevan, R.; Cowen, A.

1995-01-01

In order to help provide access to advanced micro-electro-mechanical systems (MEMS) technologies and lower the barriers for both industry and academia, the Microelectronic Center of North Carolina (MCNC) and ARPA have developed a program which provides users with access to both MEMS processes and advanced electronic integration techniques. The four distinct aspects of this program, the multi-user MEMS processes (MUMP's), the consolidated micro-mechanical element library, smart MEMS, and the MEMS technology network are described in this paper. MUMP's is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. It is both a proof-of-concept and educational tool that aids in the development of MEMS in the domestic community. MUMP's technologies currently include a 3-layer poly-silicon surface micromachining process and LIGA (lithography, electroforming, and injection molding) processes that provide reasonable design flexibility within set guidelines. The consolidated micromechanical element library (CaMEL) is a library of active and passive MEMS structures that can be downloaded by the MEMS community via the internet. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology. The MEMS technology network (TechNet) is a menu of standard substrates and MEMS fabrication processes that can be purchased and combined to create unique process flows. TechNet provides the MEMS community greater flexibility and enhanced technology accessibility.

A low feed-through 3D vacuum packaging technique with silicon vias for RF MEMS resonators

NASA Astrophysics Data System (ADS)

Zhao, Jicong; Yuan, Quan; Kan, Xiao; Yang, Jinling; Yang, Fuhua

2017-01-01

This paper presents a wafer-level three-dimensional (3D) vacuum packaging technique for radio frequency microelectromechanical systems (RF MEMS) resonators. A Sn-rich Au-Sn solder bonding is employed to provide a vacuum encapsulation as well as electrical conductions. Vertical silicon vias are micro-fabricated by glass reflow process. The optimized grounding, via pitch, and all-round shielding effectively reduce feed-through capacitance. Thus the signal-to-background ratios (SBRs) of the transmission signals increase from 17 dB to 20 dB, and the quality factor (Q) values of the packaged resonators go from around 8000 up to more than 9500. The measured average leak rate and shear strength are (2.55  ±  0.9)  ×  10-8 atm-cc s-1 and 42.53  ±  4.19 MPa, respectively. Furthermore, thermal cycling test between  -40 °C and 100 °C and high temperature storage test at 150 °C show that the resonant-frequency drifts are less than  ±7 ppm. In addition, the SBRs and the Q values have no obvious change after the tests. The experimental results demonstrated that the proposed encapsulation technique is well suited for the applications of RF MEMS devices.

MEMS switches having non-metallic crossbeams

NASA Technical Reports Server (NTRS)

Scardelletti, Maximillian C (Inventor)

2009-01-01

A RF MEMS switch comprising a crossbeam of SiC, supported by at least one leg above a substrate and above a plurality of transmission lines forming a CPW. Bias is provided by at least one layer of metal disposed on a top surface of the SiC crossbeam, such as a layer of chromium followed by a layer of gold, and extending beyond the switch to a biasing pad on the substrate. The switch utilizes stress and conductivity-controlled non-metallic thin cantilevers or bridges, thereby improving the RF characteristics and operational reliability of the switch. The switch can be fabricated with conventional silicon integrated circuit (IC) processing techniques. The design of the switch is very versatile and can be implemented in many transmission line mediums.

Spiral Chip Implantable Radiator and Printed Loop External Receptor for RF Telemetry in Bio-Sensor Systems

NASA Technical Reports Server (NTRS)

Simons, Rainee N.; Hall, David G.; Miranda, Felix A.

2004-01-01

The paper describes the operation of a patented wireless RF telemetry system, consisting of a bio-MEMS implantable sensor and an external hand held unit, operating over the frequency range of few hundreds of MHz. A MEMS capacitive pressure sensor integrated with a miniature inductor/antenna together constitute the implantable sensor. Signal processing circuits collocated with a printed loop antenna together form the hand held unit, capable of inductively powering and also receiving the telemetry signals from the sensor. The paper in addition, demonstrates a technique to enhance the quality factor and inductance of the inductor in the presence of a lower ground plane and also presents the radiation characteristics of the loop antenna.

PREFACE: 14th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2014)

NASA Astrophysics Data System (ADS)

2014-11-01

It is our great pleasure to welcome you to the 14th International Conference on Micro- and Nano-Technology for Power Generation and Energy Conversion Applications, or PowerMEMS 2014, in Awaji Island, Japan. The aim of PowerMEM is to present the latest research results in the field of miniature, micro- and nano-scale technologies for power generation and energy conversion. The conference will also- give us the opportunity to exchange informations and new ideas in the field of Power MEMS/NEMS. The current status of the field of PowerMEMS spans the full spectrum from basic research to practical applications. We will enjoy valuable discussions not only from the viewpoint of academia but from commercial and industrial perspectives. In the conference, three invited speakers lead the technical program. We received 172 abstracts and after a careful reviewing process by the Technical Program Committee a total of 133 papers were selected for presentation. These have been organized into 16 Oral sessions in two parallel streams and two poster sessions including some late-news papers. The oral and regular poster papers are published by the Institute of Physics (IOP). We have also organized a PowerMEMS School in Kobe-Sannomiya contiguous to the main conference. This two-day school will cover various topics of energy harvesting. World leading experts will give invited lectures on their main topics. This is a new experiment to broaden the technology remit of our conference by organizing mini symposiums that aim to gather the latest research on the following topics by the organizers: Microscale Combustion, Wideband Vibration Energy Harvesting, RF Energy Transfer and Industrial Application. We hope this, and other activities will make PowerMEMS2014 a memorable success. One of the important programs in an international conference is the social program, and we prepare the PowerMEMS2014 banquet in the banquet room at the Westin Awaji Island Hotel. This will provide an opportunity to create strong networks between researchers. We also provide nice opportunities to experience Japanese nature and culture. The special cruise to see the magnificent whirlpool up close will definitely be one of the highlights. Additionally, we will serve Awaji's traditional performing art, Awaji Ningyo Joruri, which has a history of over 500 years and has been inherited through the generations. There are many individuals we would like to thank for their support in organizing PowerMEMS2014. The TPC, chaired by Takayuki Fujita, have given us their valuable time and best effort in reviewing abstracts. The PowerMEMS School chair Yuji Suzuki and the expert speakers made the School possible. The local organizing committee, led by Kensuke Kanda has provided us with invaluable assistance in preparing the PowerMEMS2014 venue. The financial support from both the Tsutomu Nakauchi Foundation, the Hyogo International Association and the conference sponsors have also been gratefully appreciated. Finally, we would like to thank each of you for attending the conference and bringing your expertise. We wish you all a successful conference and an exciting and relaxing stay in Awaji Island.

Contact material optimization and contact physics in metal-contact microelectromechanical systems (MEMS) switches

NASA Astrophysics Data System (ADS)

Yang, Zhenyin

Metal-contact MEMS switches hold great promise for implementing agile radio frequency (RF) systems because of their small size, low fabrication cost, low power consumption, wide operational band, excellent isolation and exceptionally low signal insertion loss. Gold is often utilized as a contact material for metal-contact MEMS switches due to its excellent electrical conductivity and corrosion resistance. However contact wear and stiction are the two major failure modes for these switches due to its material softness and high surface adhesion energy. To strengthen the contact material, pure gold was alloyed with other metal elements. We designed and constructed a new micro-contacting test facility that closely mimic the typical MEMS operation and utilized this facility to efficiently evaluate optimized contact materials. Au-Ni binary alloy system as the candidate contact material for MEMS switches was systematically investigated. A correlation between contact material properties (etc. microstructure, micro-hardness, electrical resistivity, topology, surface structures and composition) and micro-contacting performance was established. It was demonstrated nano-scale graded two-phase Au-Ni film could possibly yield an improved device performance. Gold micro-contact degradation mechanisms were also systematically investigated by running the MEMS switching tests under a wide range of test conditions. According to our quantitative failure analysis, field evaporation could be the dominant failure mode for highfield (> critical threshold field) hot switching; transient thermal-assisted wear could be the dominant failure mode for low-field hot switching; on the other hand, pure mechanical wear and steady current heating (1 mA) caused much less contact degradation in cold switching tests. Results from low-force (50 muN/micro-contact), low current (0.1 mA) tests on real MEMS switches indicated that continuous adsorbed films from ambient air could degrade the switch contact resistance. Our work also contributes to the field of general nano-science and technology by resolving the transfer directionality of field evaporation of gold in atomic force microscope (AFM)/scanning tunneling microscope (STM).

Micro-electro-mechanical systems (MEMS) and agile lensing-based modules for communications, sensing and signal processing

NASA Astrophysics Data System (ADS)

Reza, Syed Azer

This dissertation proposes the use of the emerging Micro-Electro-Mechanical Systems (MEMS) and agile lensing optical device technologies to design novel and powerful signal conditioning and sensing modules for advanced applications in optical communications, physical parameter sensing and RF/optical signal processing. For example, these new module designs have experimentally demonstrated exceptional features such as stable loss broadband operations and high > 60 dB optical dynamic range signal filtering capabilities. The first part of the dissertation describes the design and demonstration of digital MEMS-based signal processing modules for communication systems and sensor networks using the TI DLP (Digital Light Processing) technology. Examples of such modules include optical power splitters, narrowband and broadband variable fiber optical attenuators, spectral shapers and filters. Compared to prior works, these all-digital designs have advantages of repeatability, accuracy, and reliability that are essential for advanced communications and sensor applications. The next part of the dissertation proposes, analyzes and demonstrates the use of analog opto-fluidic agile lensing technology for sensor networks and test and measurement systems. Novel optical module designs for distance sensing, liquid level sensing, three-dimensional object shape sensing and variable photonic delay lines are presented and experimentally demonstrated. Compared to prior art module designs, the proposed analog-mode modules have exceptional performances, particularly for extreme environments (e.g., caustic liquids) where the free-space agile beam-based sensor provide remote non-contact access for physical sensing operations. The dissertation also presents novel modules involving hybrid analog-digital photonic designs that make use of the different optical device technologies to deliver the best features of both analog and digital optical device operations and controls. Digital controls are achieved through the use of the digital MEMS technology and analog controls are realized by employing opto-fluidic agile lensing technology and acousto-optic technology. For example, variable fiber-optic attenuators and spectral filters are proposed using the hybrid design. Compared to prior art module designs, these hybrid designs provide a higher module dynamic range and increased resolution that are critical in various advanced system applications. In summary, the dissertation shows the added power of hybrid optical designs using both the digital and analog photonic signal processing versus just all-digital or all-analog module designs.

MEMS Gate Structures for Electric Propulsion Applications

DTIC Science & Technology

2006-07-12

distance between gates of dual gate system V = grid voltage Dsheath = sheath thickness Va = anode voltage E = electric field Vemitter = emitter voltage Es...minutes. A hot pressed boron nitride target (4N) in the hexagonal phase (h- BN) was sputtered in a RF magnetron sputtering gun. To promote the nucleation...and nanoFETs. This paper concludes with a discussion on using MEMS gates for dual -grid electron field emission applications. II. Gate Design I I

Critical issues for the application of integrated MEMS/CMOS technologies to inertial measurement units

DOE Office of Scientific and Technical Information (OSTI.GOV)

Smith, J.H.; Ellis, J.R.; Montague, S.

1997-03-01

One of the principal applications of monolithically integrated micromechanical/microelectronic systems has been accelerometers for automotive applications. As integrated MEMS/CMOS technologies such as those developed by U.C. Berkeley, Analog Devices, and Sandia National Laboratories mature, additional systems for more sensitive inertial measurements will enter the commercial marketplace. In this paper, the authors will examine key technology design rules which impact the performance and cost of inertial measurement devices manufactured in integrated MEMS/CMOS technologies. These design parameters include: (1) minimum MEMS feature size, (2) minimum CMOS feature size, (3) maximum MEMS linear dimension, (4) number of mechanical MEMS layers, (5) MEMS/CMOS spacing.more » In particular, the embedded approach to integration developed at Sandia will be examined in the context of these technology features. Presently, this technology offers MEMS feature sizes as small as 1 {micro}m, CMOS critical dimensions of 1.25 {micro}m, MEMS linear dimensions of 1,000 {micro}m, a single mechanical level of polysilicon, and a 100 {micro}m space between MEMS and CMOS. This is applicable to modern precision guided munitions.« less

Mechanical characterization of thin TiO2 films by means of microelectromechanical systems-based cantilevers

NASA Astrophysics Data System (ADS)

Adami, A.; Decarli, M.; Bartali, R.; Micheli, V.; Laidani, N.; Lorenzelli, L.

2010-01-01

The measurement of mechanical parameters by means of microcantilever structures offers a reliable and accurate alternative to traditional methods, especially when dealing with thin films, which are extensively used in microfabrication technology and nanotechnology. In this work, microelectromechanical systems (MEMS)-based piezoresistive cantilevers were realized and used for the determination of Young's modulus and residual stress of thin titanium dioxide (TiO2) deposited by sputtering from a TiO2 target using a rf plasma discharge. Films were deposited at different thicknesses, ranging from a few to a hundred nanometers. Dedicated silicon microcantilevers were designed through an optimization of geometrical parameters with the development of analytical as well as numerical models. Young's modulus and residual stress of sputtered TiO2 films were assessed by using both mechanical characterization based on scanning profilometers and piezoresistive sensing elements integrated in the silicon cantilevers. Results of MEMS-based characterization were combined with the tribological and morphological properties measured by microscratch test and x-ray diffraction analysis.

Design and Analysis of a Micromachined LC Low Pass Filter For 2.4GHz Application

NASA Astrophysics Data System (ADS)

Saroj, Samruddhi R.; Rathee, Vishal R.; Pande, Rajesh S.

2018-02-01

This paper reports design and analysis of a passive low pass filter with cut-off frequency of 2.4 GHz using MEMS (Micro Electro-Mechanical Systems) technology. The passive components such as suspended spiral inductors and metal-insulator-metal (MIM) capacitor are arranged in T network form to implement LC low pass filter design. This design employs a simple approach of suspension thereby reducing parasitic losses to eliminate the performance degrading effects caused by integrating an off-chip inductor in the filter circuit proposed to be developed on a low cost silicon substrate using RF-MEMS components. The filter occupies only 2.1 mm x 0.66 mm die area and is designed using micro-strip transmission line placed on a silicon substrate. The design is implemented in High Frequency Structural Simulator (HFSS) software and fabrication flow is proposed for its implementation. The simulated results show that the design has an insertion loss of -4.98 dB and return loss of -2.60dB.

Overview of MEMS/NEMS technology development for space applications at NASA/JPL

NASA Astrophysics Data System (ADS)

George, Thomas

2003-04-01

This paper highlights the current technology development activities of the MEMS Technology Group at JPL. A diverse range of MEMS/NEMS technologies are under development, that are primarily applicable to NASA"s needs in the area of robotic planetary exploration. MEMS/NEMS technologies have obvious advantages for space applications, since they offer the promise of highly capable devices with ultra low mass, size and power consumption. However, the key challenge appears to be in finding efficient means to transition these technologies into "customer" applications. A brief description of this problem is presented along with the Group"s innovative approach to rapidly advance the maturity of technologies via insertion into space missions. Also described are some of the major capabilities of the MEMS Technology Group. A few important examples from among the broad classes of technologies being developed are discussed, these include the "Spider Web Bolometer", High-Performance Miniature Gyroscopes, an Electron Luminescence X-ray Spectrometer, a MEMS-based "Knudsen" Thermal Transpiration pump, MEMS Inchworm Actuators, and Nanowire-based Biological/Chemical Sensors.

ZnO on nickel RF micromechanical resonators for monolithic wireless communication applications

NASA Astrophysics Data System (ADS)

Wei, Mian; Avila, Adrian; Rivera, Ivan; Baghelani, Masoud; Wang, Jing

2017-05-01

On-chip integrability of high-Q RF passives alongside CMOS transistors is crucial for the implementation of monolithic radio transceivers. One of the most significant bottlenecks in back-end-of-line (BEoL) integration of MEMS devices on CMOS processed wafers is their relatively low thermal budget, which is less than that required for typical MEMS material deposition processes. This paper investigates electroplated nickel as a structural material for piezoelectrically-transduced resonators to demonstrate ZnO-on-nickel resonators with a CMOS-compatible low temperature process for the first time. Aside from the obvious manufacturing cost benefit, electroplated nickel is a reasonable substitute for polycrystalline or single crystal silicon and thin-film microcrystalline diamond device layers, while realizing decent acoustic velocity and moderate Q. Electroplated nickel has been already adopted by MEMSCAP, a multi-user MEMS process foundry, in its MetalMUMPs process. Furthermore, it is observed that a localized annealing process through Joule heating can be exploited to significantly improve the effective mechanical quality factor for the ZnO-on-nickel resonators, which is still lower than the reported AlN resonators. This work demonstrates ZnO-on-nickel piezoelectrically-actuated MEMS resonators and resonator arrays by using an IC compatible low temperature process. There is room for performance improvement by lowering the acoustic energy losses in the ZnO and nickel layers.

RF-Trapped Chip Scale Helium Ion Pump (RFT-CHIP)

DTIC Science & Technology

2016-04-06

14. ABSTRACT A miniaturized (~1 cc) magnet -less RF electron trap for a helium ion pump is studied, addressing challenges associated with active...pump, ion pump, electron trap, magnet -less, MEMS, radiofrequency 16. SECURITY CLASSIFICATION OF: 17. LIMITATION OF ABSTRACT 18. NUMBER OF PAGES 19a...scale ion pumps. The Penning cell structure consists of three electrodes (an anode and two cathodes) and a magnet . Planar titanium cathodes are

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2005-01-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2004-12-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Vision for Micro Technology Space Missions. Chapter 2

NASA Technical Reports Server (NTRS)

Dennehy, Neil

2005-01-01

It is exciting to contemplate the various space mission applications that Micro Electro Mechanical Systems (MEMS) technology could enable in the next 10-20 years. The primary objective of this chapter is to both stimulate ideas for MEMS technology infusion on future NASA space missions and to spur adoption of the MEMS technology in the minds of mission designers. This chapter is also intended to inform non-space oriented MEMS technologists, researchers and decision makers about the rich potential application set that future NASA Science and Exploration missions will provide. The motivation for this chapter is therefore to lead the reader down a path to identify and it is exciting to contemplate the various space mission applications that Micro Electro Mechanical Systems (MEMS) technology could enable in the next 10-20 years. The primary objective of this chapter is to both stimulate ideas for MEMS technology infusion on future NASA space missions and to spur adoption of the MEMS technology in the minds of mission designers. This chapter is also intended to inform non-space oriented MEMS technologists, researchers and decision makers about the rich potential application set that future NASA Science and Exploration missions will provide. The motivation for this chapter is therefore to lead the reader down a path to identify and consider potential long-term, perhaps disruptive or revolutionary, impacts that MEMS technology may have for future civilian space applications. A general discussion of the potential for MEMS in space applications is followed by a brief showcasing of a few selected examples of recent MEMS technology developments for future space missions. Using these recent developments as a point of departure, a vision is then presented of several areas where MEMS technology might eventually be exploited in future Science and Exploration mission applications. Lastly, as a stimulus for future research and development, this chapter summarizes a set of barriers to progress, design challenges and key issues that must be overcome in order for the community to move on, from the current nascent phase of developing and infusing MEMS technology into space missions, in order to achieve its full future potential.

Converting MEMS technology into profits

NASA Astrophysics Data System (ADS)

Bryzek, Janusz

1998-08-01

This paper discusses issues related to transitioning a company from the advanced technology development phase (with a particular focus on MEMS) to a profitable business, with emphasis on start-up companies. It includes several case studies from (primarily) NovaSensor MEMS development history. These case studies illustrate strategic problems with which advanced MEMS technology developers have to be concerned. Conclusions from these case studies could be used as checkpoints for future MEMS developers to increase probability of profitable operations. The objective for this paper is to share the author's experience from multiple MEMS start-ups to accelerate development of the MEMS market by focusing state- of-the-art technologists on marketing issues.

A MEMS-based, wireless, biometric-like security system

NASA Astrophysics Data System (ADS)

Cross, Joshua D.; Schneiter, John L.; Leiby, Grant A.; McCarter, Steven; Smith, Jeremiah; Budka, Thomas P.

2010-04-01

We present a system for secure identification applications that is based upon biometric-like MEMS chips. The MEMS chips have unique frequency signatures resulting from fabrication process variations. The MEMS chips possess something analogous to a "voiceprint". The chips are vacuum encapsulated, rugged, and suitable for low-cost, highvolume mass production. Furthermore, the fabrication process is fully integrated with standard CMOS fabrication methods. One is able to operate the MEMS-based identification system similarly to a conventional RFID system: the reader (essentially a custom network analyzer) detects the power reflected across a frequency spectrum from a MEMS chip in its vicinity. We demonstrate prototype "tags" - MEMS chips placed on a credit card-like substrate - to show how the system could be used in standard identification or authentication applications. We have integrated power scavenging to provide DC bias for the MEMS chips through the use of a 915 MHz source in the reader and a RF-DC conversion circuit on the tag. The system enables a high level of protection against typical RFID hacking attacks. There is no need for signal encryption, so back-end infrastructure is minimal. We believe this system would make a viable low-cost, high-security system for a variety of identification and authentication applications.

The Impact of Dielectric Material and Temperature on Dielectric Charging in RF MEMS Capacitive Switches

NASA Astrophysics Data System (ADS)

Papaioannou, George

The present work attempts to provide a better insight on the dielectric charging in RF-MEMS capacitive switches that constitutes a key issue limiting parameter of their commercialization. The dependence of the charging process on the nature of dielectric materials widely used in these devices, such as SiO2, Si3N4, AlN, Al2O3, Ta2O5, HfO2, which consist of covalent or ionic bonds and may exhibit piezoelectric properties is discussed taking into account the effect of deposition conditions and resulting material stoichiometry. Another key issue parameter that accelerates the charging and discharging processes by providing enough energy to trapped charges to be released and to dipoles to overcome potential barriers and randomize their orientation is the temperature will be investigated too. Finally, the effect of device structure will be also taken into account.

Titanium dioxide thin films deposited by pulsed laser deposition and integration in radio frequency devices: Study of structure, optical and dielectric properties

NASA Astrophysics Data System (ADS)

Orlianges, Jean-Christophe; Crunteanu, Aurelian; Pothier, Arnaud; Merle-Mejean, Therese; Blondy, Pierre; Champeaux, Corinne

2012-12-01

Titanium dioxide presents a wide range of technological application possibilities due to its dielectric, electrochemical, photocatalytic and optical properties. The three TiO2 allotropic forms: anatase, rutile and brookite are also interesting, since they exhibit different properties, stabilities and growth modes. For instance, rutile has a high dielectric permittivity, of particular interest for the integration as dielectric in components such as microelectromechanical systems (MEMS) for radio frequency (RF) devices. In this study, titanium dioxide thin films are deposited by pulsed laser deposition. Characterizations by Raman spectroscopy and X-ray diffraction show the evolution of the structural properties. Thin films optical properties are investigated using spectroscopic ellipsometry and transmission measurements from UV to IR range. Co-planar waveguide (CPW) devices are fabricated based on these films. Their performances are measured in the RF domain and compared to simulation, leading to relative permittivity values in the range 30-120, showing the potentialities of the deposited material for capacitive switches applications.

Free-space high data rate communications technologies for near terrestrial space

NASA Astrophysics Data System (ADS)

Edwards, C. L.; Bruzzi, J. R.; Boone, B. G.

2008-08-01

Recent progress at the Applied Physics Laboratory in high data rate communications technology development is described in this paper. System issues for developing and implementing high data rate downlinks from geosynchronous earth orbit to the ground, either for CONUS or in-theater users is considered. Technology is described that supports a viable dual-band multi-channel system concept. Modeling and simulation of micro-electro-mechanical systems (MEMS) beamsteering mirrors has been accomplished to evaluate the potential for this technology to support multi-channel optical links with pointing accuracies approaching 10 microradians. These models were validated experimentally down to levels in which Brownian motion was detected and characterized for single mirror devices only 500 microns across. This multi-channel beamsteering technology can be designed to address environmental compromises to free-space optical links, which derive from turbulence, clouds, as well as spacecraft vibration. Another technology concept is being pursued that is designed to mitigate the adverse effects of weather. It consists of a dual-band (RF/optical) antenna that is optimally designed in both bands simultaneously (e.g., Ku-band and near infrared). This technology would enable optical communications hardware to be seamlessly integrated with existing RF communications hardware on spacecraft platforms, while saving on mass and power, and improving overall system performance. These technology initiatives have been pursued principally because of potential sponsor interest in upgrading existing systems to accommodate quick data recovery and decision support, particularly for the warfighter in future conflicts where the exchange of large data sets such as high resolution imagery would have significant tactical benefits.

Microelectromechanical Systems and Nephrology: The Next Frontier in Renal Replacement Technology

PubMed Central

Kim, Steven; Roy, Shuvo

2013-01-01

Microelectromechanical systems (MEMS) is playing a prominent role in the development of many new and innovative biomedical devices, but remains a relatively underutilized technology in nephrology. The future landscape of clinical medicine and research will only see further expansion of MEMS based technologies in device designs and applications. The enthusiasm stems from the ability to create small-scale device features with high precision in a cost effective manner. MEMS also offers the possibility to integrate multiple components into a single device. The adoption of MEMS has the potential to revolutionize how nephrologists manage kidney disease by improving the delivery of renal replacement therapies and enhancing the monitoring of physiologic parameters. To introduce nephrologists to MEMS, this review will first define relevant terms and describe the basic processes used to fabricate MEMS devices. Next, a survey of MEMS devices being developed for various biomedical applications will be illustrated with current examples. Finally, MEMS technology specific to nephrology will be highlighted and future applications will be examined. The adoption of MEMS offers novel avenues to improve the care of kidney disease patients and assist nephrologists in clinical practice. This review will serve as an introduction for nephrologists to the exciting world of MEMS. PMID:24206604

Hybrid photonic signal processing

NASA Astrophysics Data System (ADS)

Ghauri, Farzan Naseer

This thesis proposes research of novel hybrid photonic signal processing systems in the areas of optical communications, test and measurement, RF signal processing and extreme environment optical sensors. It will be shown that use of innovative hybrid techniques allows design of photonic signal processing systems with superior performance parameters and enhanced capabilities. These applications can be divided into domains of analog-digital hybrid signal processing applications and free-space---fiber-coupled hybrid optical sensors. The analog-digital hybrid signal processing applications include a high-performance analog-digital hybrid MEMS variable optical attenuator that can simultaneously provide high dynamic range as well as high resolution attenuation controls; an analog-digital hybrid MEMS beam profiler that allows high-power watt-level laser beam profiling and also provides both submicron-level high resolution and wide area profiling coverage; and all optical transversal RF filters that operate on the principle of broadband optical spectral control using MEMS and/or Acousto-Optic tunable Filters (AOTF) devices which can provide continuous, digital or hybrid signal time delay and weight selection. The hybrid optical sensors presented in the thesis are extreme environment pressure sensors and dual temperature-pressure sensors. The sensors employ hybrid free-space and fiber-coupled techniques for remotely monitoring a system under simultaneous extremely high temperatures and pressures.

Printed Multi-Turn Loop Antenna for RF Bio-Telemetry

NASA Technical Reports Server (NTRS)

Simons, Rainee N.; Hall, David G.; Miranda, Felix A.

2004-01-01

In this paper, a novel printed multi-turn loop antenna for contact-less powering and RF telemetry from implantable bio- MEMS sensors at a design frequency of 300 MHz is demonstrated. In addition, computed values of input reactance, radiation resistance, skin effect resistance, and radiation efficiency for the printed multi-turn loop antenna are presented. The computed input reactance is compared with the measured values and shown to be in fair agreement. The computed radiation efficiency at the design frequency is about 24 percent.

Microstructure factor and mechanical and electronic properties of hydrogenated amorphous and nanocrystalline silicon thin-films for microelectromechanical systems applications

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mouro, J.; Gualdino, A.; Chu, V.

2013-11-14

Thin-film silicon allows the fabrication of MEMS devices at low processing temperatures, compatible with monolithic integration in advanced electronic circuits, on large-area, low-cost, and flexible substrates. The most relevant thin-film properties for applications as MEMS structural layers are the deposition rate, electrical conductivity, and mechanical stress. In this work, n{sup +}-type doped hydrogenated amorphous and nanocrystalline silicon thin-films were deposited by RF-PECVD, and the influence of the hydrogen dilution in the reactive mixture, the RF-power coupled to the plasma, the substrate temperature, and the deposition pressure on the structural, electrical, and mechanical properties of the films was studied. Three differentmore » types of silicon films were identified, corresponding to three internal structures: (i) porous amorphous silicon, deposited at high rates and presenting tensile mechanical stress and low electrical conductivity, (ii) dense amorphous silicon, deposited at intermediate rates and presenting compressive mechanical stress and higher values of electrical conductivity, and (iii) nanocrystalline silicon, deposited at very low rates and presenting the highest compressive mechanical stress and electrical conductivity. These results show the combinations of electromechanical material properties available in silicon thin-films and thus allow the optimized selection of a thin silicon film for a given MEMS application. Four representative silicon thin-films were chosen to be used as structural material of electrostatically actuated MEMS microresonators fabricated by surface micromachining. The effect of the mechanical stress of the structural layer was observed to have a great impact on the device resonance frequency, quality factor, and actuation force.« less

The 13th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2013)

NASA Astrophysics Data System (ADS)

Mitcheson, Paul; Beeby, Steve

2013-12-01

It is a pleasure to welcome you to The Royal Society in London and the 13th International Conference on Micro- and Nano-Technology for Power Generation and Energy Conversion Applications, or PowerMEMS 2013. The objective of PowerMEMS 2013 is to catalyse innovation in miniature, micro- and nano-scale technologies for power generation and energy conversion. The conference aims to stimulate the exchange of insights and information, and the development of new ideas in the Power MEMS/NEMS field as well as at the meso-scale. It will allow the attendees to interact and network within our multidisciplinary community that includes professionals from many branches of science and engineering. The technical program is led by four invited speakers covering inductive power transfer, chip scale power sources, thermal energy harvesting and implantable biofuel cells. We received 177 abstracts and following a careful reviewing process by the Technical Program Committee a total of 137 papers were selected for presentation. These have been organised into 16 oral sessions in two parallel streams and two poster sessions that have been augmented by 10 late news papers. The oral and regular poster papers are, for the first time, being published by the Institute of Physics. We have made every effort to make PowerMEMS 2013 the busiest yet and have included for the first time the PowerMEMS School. This two-day school held at Imperial College London covered a wide range of power-MEMS topics including technologies for power generation, power transmission, energy storage, power electronics interfaces and metrology. Registrations for the School exceeded our expectations and it was full by early November. We hope this, and other activities such as the Discussion Panel and the inclusion of late news papers, will make PowerMEMS 2013 a memorable success. We have also reached out to new communities, such as those working in wireless power transfer and RF harvesting to broaden the technology remit of our conference. The social program is an important aspect of any conference and the PowerMEMS 2013 banquet will be held in the Science Museum. This provides a fantastic opportunity to network whilst viewing some of the fundamental engineering innovations that have ultimately bought us all here today. There is a long list of individuals we would like to thank for their support in organising PowerMEMS 2013. Once again the TPC, chaired by Eric Yeatman and Douglas Paul, have given us their valuable time and effort in reviewing abstracts. The PowerMEMS School chairs Einar Halvorsen and Shad Roundy and the expert speakers made the School possible. The local organising committee, led by Alwyn Elliott, have provided us with invaluable assistance in making PowerMEMS 2013 happen. The financial support from Imperial College London, the University of Southampton and conference sponsors has also been gratefully appreciated. Finally, we would like to thank you all for attending and helping in making PowerMEMS 2013 a success. We wish you a productive and enjoyable conference and a wonderful stay in London. Paul Mitcheson and Steve Beeby CONFERENCE OFFICIALS Conference Co-Chairs Stephen Beeby, University of Southampton, UK Paul Mitcheson, Imperial College London, UK Technical Program Committee Co-Chairs Douglas Paul, University of Glasgow, UK Eric Yeatman, Imperial College London, UK PowerMEMS School Co Chairs Einar Halvorsen, Vestfold University College, Norway Shad Roundy, University of Utah, USA Local Organising Committee Chair Alwyn Elliott, Imperial College London, UK International Steering Committee Mark Allen, Georgia Institute of Technology, USA Steve Beeby, University of Southampton, UK Young-Ho Cho, KAIST, South Korea Alan Epstein, Massachusetts Institute of Technology, USA Masayoshi Esashi, Tohoku University, Japan Luc Fréchette, Université de Sherbrooke, Canada Reza Ghodssi, University of Maryland, USA Hiroki Kuwano, Tohoku University, Japan Jeff Lang, Massachusetts Institute of Technology, USA Ryutaro Maeda, National Institute of Advanced Industrial Science and Technology, Japan Kazusuke Maenaka, University of Hyogo, Japan Paul Mitcheson, Imperial College London, UK Albert Pisano, UC San Diego, USA Susumu Sugiyama, Ritsumeikan University, Japan Yuju Suzuki, University of Tokyo, Japan Shuji Tanaka, Tohoku University, Japan Miwako Waga, Susano Berkeley LLC, Japan Peter Woias, University Freiburg IMTEK, Germany Technical Program Committee David Arnold, University of Florida, USA Seiji Aoyagi, Kansai University, Japan Skandar Basrour, Tima Laboratory, France Philippe Basset, Université Paris Est/ESIEE Paris, France Mustafa Ilker Beyaz, Antalya International University, Turkey Danick Briand, École Polytechnique Fédérale de Lausanne (EPFL), Switzerland Steve Burrow, University of Bristol, UK Luc Fréchette, University of Sherbrooke, Canada Takayuki Fujita, University of Hyogo, Japan Florian Herrault, Georgia Institute of Technology, USA Andrew Holmes, Imperial College London, UK Hanseup Kim, University of Utah, USA Seong-Hyok Kim, Georgia Institute of Technology, USA Sejin Kwon, KAIST, South Korea Carol Livermore, Northeastern University, USA Matthew McCarthy, Drexel University, USA Jae Park, Kwangwoon University, South Korea Paul Ronney, University of Southern California, USA Nico de Rooij, École Polytechnique Fédérale de Lausanne (EPFL), Switzerland Yuji Suzuki, University of Tokyo, Japan Shuji Tanaka, Tohoku University, Japan Luis Velasque-Garcia, Massachusetts Institute of Technology, USA Huib Visser, Imec Netherlands Ruud Vullers, Imec, Netherlands C Mike Waits, US Army Research Laboratory, USA Xiaohong Wang, Tsinghua University, China David Yates, Imperial College London, UK Local Organising Committee Dibin Zhu, University of Southampton, UK Alex Weddell, University of Southampton, UK Tzern Toh, Imperial College London, UK Michail Kiziroglou, Imperial College London, UK Christopher Kwan, Imperial College London, UK

Application of Micro-Electro-Mechanical Sensors Contactless NDT of Concrete Structures.

PubMed

Ham, Suyun; Popovics, John S

2015-04-17

The utility of micro-electro-mechanical sensors (MEMS) for application in air-coupled (contactless or noncontact) sensing to concrete nondestructive testing (NDT) is studied in this paper. The fundamental operation and characteristics of MEMS are first described. Then application of MEMS sensors toward established concrete test methods, including vibration resonance, impact-echo, ultrasonic surface wave, and multi-channel analysis of surface waves (MASW), is demonstrated. In each test application, the performance of MEMS is compared with conventional contactless and contact sensing technology. Favorable performance of the MEMS sensors demonstrates the potential of the technology for applied contactless NDT efforts. To illustrate the utility of air-coupled MEMS sensors for concrete NDT, as compared with conventional sensor technology.

MEMS in Space Systems

NASA Technical Reports Server (NTRS)

Lyke, J. C.; Michalicek, M. A.; Singaraju, B. K.

1995-01-01

Micro-electro-mechanical systems (MEMS) provide an emerging technology that has the potential for revolutionizing the way space systems are designed, assembled, and tested. The high launch costs of current space systems are a major determining factor in the amount of functionality that can be integrated in a typical space system. MEMS devices have the ability to increase the functionality of selected satellite subsystems while simultaneously decreasing spacecraft weight. The Air Force Phillips Laboratory (PL) is supporting the development of a variety of MEMS related technologies as one of several methods to reduce the weight of space systems and increase their performance. MEMS research is a natural extension of PL research objectives in micro-electronics and advanced packaging. Examples of applications that are under research include on-chip micro-coolers, micro-gyroscopes, vibration sensors, and three-dimensional packaging technologies to integrate electronics with MEMS devices. The first on-orbit space flight demonstration of these and other technologies is scheduled for next year.

CMOS compatible fabrication process of MEMS resonator for timing reference and sensing application

NASA Astrophysics Data System (ADS)

Huynh, Duc H.; Nguyen, Phuong D.; Nguyen, Thanh C.; Skafidas, Stan; Evans, Robin

2015-12-01

Frequency reference and timing control devices are ubiquitous in electronic applications. There is at least one resonator required for each of this device. Currently electromechanical resonators such as crystal resonator, ceramic resonator are the ultimate choices. This tendency will probably keep going for many more years. However, current market demands for small size, low power consumption, cheap and reliable products, has divulged many limitations of this type of resonators. They cannot be integrated into standard CMOS (Complement metaloxide- semiconductor) IC (Integrated Circuit) due to material and fabrication process incompatibility. Currently, these devices are off-chip and they require external circuitries to interface with the ICs. This configuration significantly increases the overall size and cost of the entire electronic system. In addition, extra external connection, especially at high frequency, will potentially create negative impacts on the performance of the entire system due to signal degradation and parasitic effects. Furthermore, due to off-chip packaging nature, these devices are quite expensive, particularly for high frequency and high quality factor devices. To address these issues, researchers have been intensively studying on an alternative for type of resonator by utilizing the new emerging MEMS (Micro-electro-mechanical systems) technology. Recent progress in this field has demonstrated a MEMS resonator with resonant frequency of 2.97 GHz and quality factor (measured in vacuum) of 42900. Despite this great achievement, this prototype is still far from being fully integrated into CMOS system due to incompatibility in fabrication process and its high series motional impedance. On the other hand, fully integrated MEMS resonator had been demonstrated but at lower frequency and quality factor. We propose a design and fabrication process for a low cost, high frequency and a high quality MEMS resonator, which can be integrated into a standard CMOS IC. This device is expected to operate in hundreds of Mhz frequency range; quality factor surpasses 10000 and series motional impedance low enough that could be matching into conventional system without enormous effort. This MEMS resonator can be used in the design of many blocks in wireless and RF (Radio Frequency) systems such as low phase noise oscillator, band pass filter, power amplifier and in many sensing application.

MEMS testing and applications in automotive and aerospace industries

NASA Astrophysics Data System (ADS)

Ma, Zhichun; Chen, Xuyuan

2009-05-01

MEMS technology combines micromachining and integrated circuit fabrication technologies to produce highly reliable MEMS transducers. This paper presents an overview of MEMS transducers applications, particularly in automotive and aerospace industries, which includes inertia sensors for safety, navigation, and guidance control, thermal anemometer for temperature and heat-flux sensors in engine applications, MEMS atomizers for fuel injection, and micromachined actuators for flow control applications. Design examples for the devices in above mentioned applications are also presented and test results are given.

A capacitive CMOS-MEMS sensor designed by multi-physics simulation for integrated CMOS-MEMS technology

NASA Astrophysics Data System (ADS)

Konishi, Toshifumi; Yamane, Daisuke; Matsushima, Takaaki; Masu, Kazuya; Machida, Katsuyuki; Toshiyoshi, Hiroshi

2014-01-01

This paper reports the design and evaluation results of a capacitive CMOS-MEMS sensor that consists of the proposed sensor circuit and a capacitive MEMS device implemented on the circuit. To design a capacitive CMOS-MEMS sensor, a multi-physics simulation of the electromechanical behavior of both the MEMS structure and the sensing LSI was carried out simultaneously. In order to verify the validity of the design, we applied the capacitive CMOS-MEMS sensor to a MEMS accelerometer implemented by the post-CMOS process onto a 0.35-µm CMOS circuit. The experimental results of the CMOS-MEMS accelerometer exhibited good agreement with the simulation results within the input acceleration range between 0.5 and 6 G (1 G = 9.8 m/s2), corresponding to the output voltages between 908.6 and 915.4 mV, respectively. Therefore, we have confirmed that our capacitive CMOS-MEMS sensor and the multi-physics simulation will be beneficial method to realize integrated CMOS-MEMS technology.

Advanced RF Front End Technology

NASA Technical Reports Server (NTRS)

Herman, M. I.; Valas, S.; Katehi, L. P. B.

2001-01-01

The ability to achieve low-mass low-cost micro/nanospacecraft for Deep Space exploration requires extensive miniaturization of all subsystems. The front end of the Telecommunication subsystem is an area in which major mass (factor of 10) and volume (factor of 100) reduction can be achieved via the development of new silicon based micromachined technology and devices. Major components that make up the front end include single-pole and double-throw switches, diplexer, and solid state power amplifier. JPL's Center For Space Microsystems - System On A Chip (SOAC) Program has addressed the challenges of front end miniaturization (switches and diplexers). Our objectives were to develop the main components that comprise a communication front end and enable integration in a single module that we refer to as a 'cube'. In this paper we will provide the latest status of our Microelectromechanical System (MEMS) switches and surface micromachined filter development. Based on the significant progress achieved we can begin to provide guidelines of the proper system insertion for these emerging technologies. Additional information is contained in the original extended abstract.

Validation of Radio Frequency Telemetry Concept in the Presence of Biological Tissue-Like Stratified Media

NASA Technical Reports Server (NTRS)

Miranda, Felix A.; Simons, Rainee N.; Haal, David G.

2004-01-01

In this paper we discuss a novel radio frequency (RF) telemetry concept for biomedical applications. The concept consists of a miniaturized spiral inductor/antenna for bio-MEMS sensors and an external pick-up antenna integrated into a handheld device. The measured relative signal strength in the presence of biological phantoms ranged from 5.9 to 7.5 dB for antenna separations of 5 and 10 cm. These relative signal strengths are easily measurable, therefore validating the RF telemetry concept for biomedical applications.

Ku to V-band 4-bit MEMS phase shifter bank using high isolation SP4T switches and DMTL structures

NASA Astrophysics Data System (ADS)

Dey, Sukomal; Koul, Shiban K.; Poddar, Ajay K.; Rohde, Ulrich L.

2017-10-01

This work presents a micro-electro-mechanical system (MEMS) based on a wide-band 4-bit phase shifter using two back-to-back single-pole-four-throw (SP4T) switches and four different distributed MEMS transmission line (DMTL) structures that are implemented on 635 µm alumina substrate using surface micromachining process. An SP4T switch is designed with a series-shunt configuration and it demonstrates an average return loss of  >17 dB, an insertion loss of  <1.97 dB and maximum isolation of  >28 dB up to 60 GHz. A maximum area of the SP4T switch is ~0.76 mm2. Single-pole-single-throw and SP4T switches are capable of handling 1 W of radio frequency (RF) power up to  >100 million cycles at 25° C; they can even sustained up to  >70 million cycles with 1 W at 85 °C. The proposed wide-band phase shifter works at 17 GHz (Ku-band), 25 GHz (K-band), 35 GHz (Ka-band) and 60 GHz (V-band) frequencies. Finally,a 4-bit phase shifter demonstrates an average insertion loss of  <6 dB, return loss of  >10 dB and maximum phase error of ~3.8° at 60 GHz frequency over 500 MHz bandwidth. Total area of the fabricated device is ~11 mm2. In addition, the proposed device works well up to  >107 cycles with 1 W of RF power. To the best of the author’s knowledge, this is the best reported wide-band MEMS 4-bit phase shifter in the literature that works with a constant resolution.

Progress and opportunities in high-voltage microactuator powering technology towards one-chip MEMS

NASA Astrophysics Data System (ADS)

Mita, Yoshio; Hirakawa, Atsushi; Stefanelli, Bruno; Mori, Isao; Okamoto, Yuki; Morishita, Satoshi; Kubota, Masanori; Lebrasseur, Eric; Kaiser, Andreas

2018-04-01

In this paper, we address issues and solutions for micro-electro-mechanical-systems (MEMS) powering through semiconductor devices towards one-chip MEMS, especially those with microactuators that require high voltage (HV, which is more than 10 V, and is often over 100 V) for operation. We experimentally and theoretically demonstrated that the main reason why MEMS actuators need such HV is the tradeoff between resonant frequency and displacement amplitude. Indeed, the product of frequency and displacement is constant regardless of the MEMS design, but proportional to the input energy, which is the square of applied voltage in an electrostatic actuator. A comprehensive study on the principles of HV device technology and associated circuit technologies, especially voltage shifter circuits, was conducted. From the viewpoint of on-chip energy source, series-connected HV photovoltaic cells have been discussed. Isolation and electrical connection methods were identified to be key enabling technologies. Towards future rapid development of such autonomous devices, a technology to convert standard 5 V CMOS devices into HV circuits using SOI substrate and a MEMS postprocess is presented. HV breakdown experiments demonstrated this technology can hold over 700 to 1000 V, depending on the layout.

MEMS: A new approach to micro-optics

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sniegowski, J.J.

1997-12-31

MicroElectroMechanical Systems (MEMS) and their fabrication technologies provide great opportunities for application to micro-optical systems (MOEMS). Implementing MOEMS technology ranges from simple, passive components to complicated, active systems. Here, an overview of polysilicon surface micromachining MEMS combined with optics is presented. Recent advancements to the technology, which may enhance its appeal for micro-optics applications are emphasized. Of all the MEMS fabrication technologies, polysilicon surface micromachining technology has the greatest basis in and leverages the most the infrastructure for silicon integrated circuit fabrication. In that respect, it provides the potential for very large volume, inexpensive production of MOEMS. This paper highlightsmore » polysilicon surface micromachining technology in regards to its capability to provide both passive and active mechanical elements with quality optical elements.« less

New dynamic silicon photonic components enabled by MEMS technology

NASA Astrophysics Data System (ADS)

Errando-Herranz, Carlos; Edinger, Pierre; Colangelo, Marco; Björk, Joel; Ahmed, Samy; Stemme, Göran; Niklaus, Frank; Gylfason, Kristinn B.

2018-02-01

Silicon photonics is the study and application of integrated optical systems which use silicon as an optical medium, usually by confining light in optical waveguides etched into the surface of silicon-on-insulator (SOI) wafers. The term microelectromechanical systems (MEMS) refers to the technology of mechanics on the microscale actuated by electrostatic actuators. Due to the low power requirements of electrostatic actuation, MEMS components are very power efficient, making them well suited for dense integration and mobile operation. MEMS components are conventionally also implemented in silicon, and MEMS sensors such as accelerometers, gyros, and microphones are now standard in every smartphone. By combining these two successful technologies, new active photonic components with extremely low power consumption can be made. We discuss our recent experimental work on tunable filters, tunable fiber-to-chip couplers, and dynamic waveguide dispersion tuning, enabled by the marriage of silicon MEMS and silicon photonics.

Contour mode resonators with acoustic reflectors

DOEpatents

Olsson, Roy H [Albuquerque, NM; Fleming, James G [Albuquerque, NM; Tuck, Melanie R [Albuquerque, NM

2008-06-10

A microelectromechanical (MEM) resonator is disclosed which has a linear or ring-shaped acoustic resonator suspended above a substrate by an acoustic reflector. The acoustic resonator can be formed with a piezoelectric material (e.g. aluminum nitride, zinc oxide or PZT), or using an electrostatically-actuated material. The acoustic reflector (also termed an acoustic mirror) uses alternating sections of a relatively low acoustic impedance Z.sub.L material and a relatively high acoustic impedance Z.sub.H material to isolate the acoustic resonator from the substrate. The MEM resonator, which can be formed on a silicon substrate with conventional CMOS circuitry, has applications for forming oscillators, rf filters, and acoustic sensors.

MEMS for pico- to micro-satellites

NASA Astrophysics Data System (ADS)

Shea, H. R.

2009-02-01

MEMS sensors, actuators, and sub-systems can enable an important reduction in the size and mass of spacecrafts, first by replacing larger and heavier components, then by replacing entire subsystems, and finally by enabling the microfabrication of highly integrated picosats. Very small satellites (1 to 100 kg) stand to benefit the most from MEMS technologies. These small satellites are typically used for science or technology demonstration missions, with higher risk tolerance than multi-ton telecommunication satellites. While MEMS are playing a growing role on Earth in safety-critical applications, in the harsh and remote environment of space, reliability is still the crucial issue, and the absence of an accepted qualification methodology is holding back MEMS from wider use. An overview is given of the range of MEMS applications in space. An effective way to prove that MEMS can operate reliably in space is to use them in space: we illustrate how Cubesats (1 kg, 1 liter, cubic satellites in a standardized format to reduce launch costs) can serve as low-cost vectors for MEMS technology demonstration in space. The Cubesat SwissCube developed in Switzerland is used as one example of a rapid way to fly new microtechnologies, and also as an example of a spacecraft whose performance is only possible thanks to MEMS.

Novel On-wafer Radiation Pattern Measurement Technique for MEMS Actuator Based Reconfigurable Patch Antennas

NASA Technical Reports Server (NTRS)

Simons, Rainee N.

2002-01-01

The paper presents a novel on-wafer, antenna far field pattern measurement technique for microelectromechanical systems (MEMS) based reconfigurable patch antennas. The measurement technique significantly reduces the time and the cost associated with the characterization of printed antennas, fabricated on a semiconductor wafer or dielectric substrate. To measure the radiation patterns, the RF probe station is modified to accommodate an open-ended rectangular waveguide as the rotating linearly polarized sampling antenna. The open-ended waveguide is attached through a coaxial rotary joint to a Plexiglas(Trademark) arm and is driven along an arc by a stepper motor. Thus, the spinning open-ended waveguide can sample the relative field intensity of the patch as a function of the angle from bore sight. The experimental results include the measured linearly polarized and circularly polarized radiation patterns for MEMS-based frequency reconfigurable rectangular and polarization reconfigurable nearly square patch antennas, respectively.

MEMS Using SOI Substrate

NASA Technical Reports Server (NTRS)

Tang, Tony K.

1999-01-01

At NASA, the focus for smaller, less costly missions has given impetus for the development of microspacecraft. MicroElectroMechanical System (MEMS) technology advances in the area of sensor, propulsion systems, and instruments, make the notion of a specialized microspacecraft feasible in the immediate future. Similar to the micro-electronics revolution,the emerging MEMS technology offers the integration of recent advances in micromachining and nanofabrication techniques with microelectronics in a mass-producible format,is viewed as the next step in device and instrument miniaturization. MEMS technology offers the potential of enabling or enhancing NASA missions in a variety of ways. This new technology allows the miniaturization of components and systems, where the primary benefit is a reduction in size, mass and power. MEMS technology also provides new capabilities and enhanced performance, where the most significant impact is in performance, regardless of system size. Finally,with the availability of mass-produced, miniature MEMS instrumentation comes the opportunity to rethink our fundamental measurement paradigms. It is now possible to expand our horizons from a single instrument perspective to one involving multi-node distributed systems. In the distributed systems and missions, a new system in which the functionality is enabled through a multiplicity of elements. Further in the future, the integration of electronics, photonics, and micromechanical functionalities into "instruments-on-a-chip" will provide the ultimate size, cost, function, and performance advantage. In this presentation, I will discuss recent development, requirement, and applications of various MEMS technologies and devices for space applications.

Wireless Capacitive Pressure Sensor With Directional RF Chip Antenna for High Temperature Environments

NASA Technical Reports Server (NTRS)

Scardelletti, M. C.; Jordan, J. L.; Ponchak, G. E.; Zorman, C. A.

2015-01-01

This paper presents the design, fabrication and characterization of a wireless capacitive pressure sensor with directional RF chip antenna that is envisioned for the health monitoring of aircraft engines operating in harsh environments. The sensing system is characterized from room temperature (25 C) to 300 C for a pressure range from 0 to 100 psi. The wireless pressure system consists of a Clapp-type oscillator design with a capacitive MEMS pressure sensor located in the LC-tank circuit of the oscillator. Therefore, as the pressure of the aircraft engine changes, so does the output resonant frequency of the sensing system. A chip antenna is integrated to transmit the system output to a receive antenna 10 m away.The design frequency of the wireless pressure sensor is 127 MHz and a 2 increase in resonant frequency over the temperature range of 25 to 300 C from 0 to 100 psi is observed. The phase noise is less than minus 30 dBcHz at the 1 kHz offset and decreases to less than minus 80 dBcHz at 10 kHz over the entire temperature range. The RF radiation patterns for two cuts of the wireless system have been measured and show that the system is highly directional and the MEMS pressure sensor is extremely linear from 0 to 100 psi.

Development of the micro pixel chamber based on MEMS technology

NASA Astrophysics Data System (ADS)

Takemura, T.; Takada, A.; Kishimoto, T.; Komura, S.; Kubo, H.; Matsuoka, Y.; Miuchi, K.; Miyamoto, S.; Mizumoto, T.; Mizumura, Y.; Motomura, T.; Nakamasu, Y.; Nakamura, K.; Oda, M.; Ohta, K.; Parker, J. D.; Sawano, T.; Sonoda, S.; Tanimori, T.; Tomono, D.; Yoshikawa, K.

2018-02-01

Micro pixel chambers (μ-PIC) are gaseous two-dimensional imaging detectors originally manufactured using printed circuit board (PCB) technology. They are used in MeV gamma-ray astronomy, medicalimaging, neutron imaging, the search for dark matter, and dose monitoring. The position resolution of the present μ-PIC is approximately 120 μm (RMS), however some applications require a fine position resolution of less than 100 μm. To this end, we have started to develop a μ-PIC based on micro electro mechanical system (MEMS) technology, which provides better manufacturing accuracy than PCB technology. Our simulation predicted the gains of MEMS μ-PICs to be twice those of PCB μ-PICs at the same anode voltage. We manufactured two MEMS μ-PICs and tested them to study their behavior. In these experiments, we successfully operated the fabricatedMEMS μ-PICs and we achieved a maximum gain of approximately 7×103 and collected their energy spectra under irradiation of X-rays from 55Fe. However, the measured gains of the MEMS μ-PICs were less than half of the values predicted in the simulations. We postulated that the gains of the MEMS μ-PICs are diminished by the effect of the silicon used as a semiconducting substrate.

Deep anisotropic ICP plasma etching designed for high-volume MEMS manufacturing

NASA Astrophysics Data System (ADS)

Yu, Keven; Feldbaum, Michael; Pandhumsoporn, Tam; Gadgil, Prashant

1999-08-01

ICP plasma etching is gaining widespread acceptance as an enabling micromachining technology for advanced MEMS fabrication. Whereas this technology has shown a capability of delivering multiple novel applications for R and D, its acceptance by industry for high volume production has been limited. This acceptance into production will only occur when the plasma etching equipment with this technology offers the device performance, throughput, reliability, and uptime criteria required by a production facility. The design of the plasma etcher using this technology and the process capability it consequently delivers, has significant implications in making this a reality. Alcatel has been supplying such a technology to this MEMS industry for over 5 years and in the interim has evolved its product and process to make this technology production worthy. Alcatel's next generation etcher, the Alcatel 601E, offers multiple advantages to MEMS manufacturers in realizing their production goals.

Polymer-based wireless implantable sensor and platform for systems biology study

NASA Astrophysics Data System (ADS)

Xue, Ning

Wireless implantable MEMS (microelectromechanical systems) devices have been developed over the past decade based on the combination of bio-MEMS and Radio frequency (RF) MEMS technology. These devices require the components of wireless telemetric antenna and the corresponding circuit. In the meanwhile, biocompatible material needs to be involved in the devices design. To supply maximum power upon the implantable device at given power supply from the external coil circuit, this dissertation theoretically analyzed the mutual inductance under the positions of variety of vertical distances, lateral displacements and angular misalignments between two coils in certain surgical coils misalignment situations. A planar spiral coil has been developed as the receiver coil of the coupling system. To get maximum induced voltage over the receiver circuit, different geometries of the power coil, system operation frequencies were investigated. An intraocular pressure (IOP) sensor has been developed consisting of only biocompatible matierials-SU-8 and gold. Its size is sufficiently small to be implanted in the eye. The measurement results showed that it has relatively linear pressure response, high resolution and relatively long working stability in saline environment. Finally, a simple and low cost micro-wells bio-chip has been developed with sole polydimethylsiloxane (PDMS) to be used for single cell or small group cells isolation. By performing atomic force microscopy (AFM), contact angle and x-ray photoelectron spectroscopy (XPS) measurements on the PDMS surfaces under various surface treatment conditions, the physical and chemical surface natures were thoroughly analyzed as the basis of study of cells attachment and isolation to the surfaces.

MEMS sensing and control: an aerospace perspective

NASA Astrophysics Data System (ADS)

Schoess, Jeffrey N.; Arch, David K.; Yang, Wei; Cabuz, Cleopatra; Hocker, Ben; Johnson, Burgess R.; Wilson, Mark L.

2000-06-01

Future advanced fixed- and rotary-wing aircraft, launch vehicles, and spacecraft will incorporate smart microsensors to monitor flight integrity and provide flight control inputs. This paper provides an overview of Honeywell's MEMS technologies for aerospace applications of sensing and control. A unique second-generation polysilicon resonant microbeam sensor design is described. It incorporates a micron-level vacuum-encapsulated microbeam to optically sense aerodynamic parameters and to optically excite the sensor pick off: optically excited self-resonant microbeams form the basis for a new class of versatile, high- performance, low-cost MEMS sensors that uniquely combine silicon microfabrication technology with optoelectronic technology that can sense dynamic pressure, acceleration forces, acoustic emission, and many other aerospace parameters of interest. Honeywell's recent work in MEMS tuning fork gyros for inertial sensing and a MEMS free- piston engine are also described.

Systematic analysis of CMOS-micromachined inductors with application to mixer matching circuits

NASA Astrophysics Data System (ADS)

Wu, Jerry Chun-Li

The growing demand for consumer voice and data communication systems and military communication applications has created a need for low-power, low-cost, high-performance radio-frequency (RF) front-end. To achieve this goal, bringing passive components, especially inductors, to silicon is imperative. On-chip passive components such as inductors and capacitors generally enhance the reliability and efficiency of silicon-integrated RF cells. They can provide circuit solutions with superior performance and contribute to a higher level of integration. With passive components on chip, there is a great opportunity to have transformers, filters, and matching networks on chip. However, inductors on silicon have a low quality factor (Q) due to both substrate and metal loss. This dissertation demonstrates the systematic analysis of inductors fabricated using standard complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) system technologies. We report system-on-chip inductor modeling, simulation, and measurements of effective inductance and quality factors. In this analysis methodology, a number of systematic simulations are performed on regular and micromachined inductors with different parameters such as spiral topology, number of turns, outer diameter, thickness, and percentage of substrate removed by using micromachining technologies. Three different novel support structures of the micromachined spiral inductor are proposed, analyzed, and implemented for larger size suspended inductors. The sensitivity of the structure support and different degree of substrate etching by post-processing is illustrated. The results provide guidelines for the selection of inductor parameters, post-processing methodologies, and its spiral supports to meet the RF design specifications and the stability requirements for mobile communication. The proposed CMOS-micromachined inductor is used in a low cost-effective double-balanced Gilbert mixer with on-chip matching network. The integrated mixer inductor was implemented and tested to prove the concept.

A Generalized Polynomial Chaos-Based Approach to Analyze the Impacts of Process Deviations on MEMS Beams.

PubMed

Gao, Lili; Zhou, Zai-Fa; Huang, Qing-An

2017-11-08

A microstructure beam is one of the fundamental elements in MEMS devices like cantilever sensors, RF/optical switches, varactors, resonators, etc. It is still difficult to precisely predict the performance of MEMS beams with the current available simulators due to the inevitable process deviations. Feasible numerical methods are required and can be used to improve the yield and profits of the MEMS devices. In this work, process deviations are considered to be stochastic variables, and a newly-developed numerical method, i.e., generalized polynomial chaos (GPC), is applied for the simulation of the MEMS beam. The doubly-clamped polybeam has been utilized to verify the accuracy of GPC, compared with our Monte Carlo (MC) approaches. Performance predictions have been made on the residual stress by achieving its distributions in GaAs Monolithic Microwave Integrated Circuit (MMIC)-based MEMS beams. The results show that errors are within 1% for the results of GPC approximations compared with the MC simulations. Appropriate choices of the 4-order GPC expansions with orthogonal terms have also succeeded in reducing the MC simulation labor. The mean value of the residual stress, concluded from experimental tests, shares an error about 1.1% with that of the 4-order GPC method. It takes a probability around 54.3% for the 4-order GPC approximation to attain the mean test value of the residual stress. The corresponding yield occupies over 90 percent around the mean within the twofold standard deviations.

A Generalized Polynomial Chaos-Based Approach to Analyze the Impacts of Process Deviations on MEMS Beams

PubMed Central

Gao, Lili

2017-01-01

A microstructure beam is one of the fundamental elements in MEMS devices like cantilever sensors, RF/optical switches, varactors, resonators, etc. It is still difficult to precisely predict the performance of MEMS beams with the current available simulators due to the inevitable process deviations. Feasible numerical methods are required and can be used to improve the yield and profits of the MEMS devices. In this work, process deviations are considered to be stochastic variables, and a newly-developed numerical method, i.e., generalized polynomial chaos (GPC), is applied for the simulation of the MEMS beam. The doubly-clamped polybeam has been utilized to verify the accuracy of GPC, compared with our Monte Carlo (MC) approaches. Performance predictions have been made on the residual stress by achieving its distributions in GaAs Monolithic Microwave Integrated Circuit (MMIC)-based MEMS beams. The results show that errors are within 1% for the results of GPC approximations compared with the MC simulations. Appropriate choices of the 4-order GPC expansions with orthogonal terms have also succeeded in reducing the MC simulation labor. The mean value of the residual stress, concluded from experimental tests, shares an error about 1.1% with that of the 4-order GPC method. It takes a probability around 54.3% for the 4-order GPC approximation to attain the mean test value of the residual stress. The corresponding yield occupies over 90 percent around the mean within the twofold standard deviations. PMID:29117096

Novel First-Level Interconnect Techniques for Flip Chip on MEMS Devices

PubMed Central

Sutanto, Jemmy; Anand, Sindhu; Patel, Chetan; Muthuswamy, Jit

2013-01-01

Flip-chip packaging is desirable for microelectro-mechanical systems (MEMS) devices because it reduces the overall package size and allows scaling up the number of MEMS chips through 3-D stacks. In this report, we demonstrate three novel techniques to create first-level interconnect (FLI) on MEMS: 1) Dip and attach technology for Ag epoxy; 2) Dispense technology for solder paste; 3) Dispense, pull, and attach technology (DPAT) for solder paste. The above techniques required no additional microfabrication steps, produced no visible surface contamination on the MEMS active structures, and generated high-aspect-ratio interconnects. The developed FLIs were successfully tested on MEMS moveable microelectrodes microfabricated by SUMMiTVTM process producing no apparent detrimental effect due to outgassing. The bumping processes were successfully applied on Al-deposited bond pads of 100 μm × 100 μm with an average bump height of 101.3 μm for Ag and 184.8 μm for solder (63Sn, 37Pb). DPAT for solder paste produced bumps with the aspect ratio of 1.8 or more. The average shear strengths of Ag and solder bumps were 78 MPa and 689 kPa, respectively. The electrical test on Ag bumps at 794 A/cm2 demonstrated reliable electrical interconnects with negligible resistance. These scalable FLI technologies are potentially useful for MEMS flip-chip packaging and 3-D stacking. PMID:24504168

Nanotechnology: MEMS and NEMS and their applications to smart systems and devices

NASA Astrophysics Data System (ADS)

Varadan, Vijay K.

2003-10-01

The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with features sizes now down at the sub micron and nanometer level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and systems. This effort offers the promise of: (1) increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed including micro stereo lithographic and micro molding techniques; (2) developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines; (3) development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation; (4) development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems, etc. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composite provide a new avenue for future smart systems. The integration of NEMS (NanoElectroMechanical Systems), MEMS, IDTs (Interdigital Transducers) and required microelectronics and conformal antenna in the multifunctional smart materials and composites results in a smart system suitable for sending and control of a variety functions in automobile, aerospace, marine and civil strutures and food and medical industries. This unique combination of technologies also results in novel conformal sensors that can be remotely sensed by an antenna system with the advantage of no power requirements at the sensor site. This paper provides a brief review of MEMS and NEMS based smart systems for various applications mentioned above. Carbon Nano Tubes (CNT) with their unique structure, have already proven to be valuable in their application as tips for scanning probe microscopy, field emission devices, nanoelectronics, H2-storage, electromagnetic absorbers, ESD, EMI films and coatings and structural composites. For many of these applications, highly purified and functionalized CNT which are compatible with many host polymers are needed. A novel microwave CVD processing technique to meet these requirements has been developed at Penn State Center for the Engineering of Electronic and Acoustic Materials and Devices (CEEAMD). This method enables the production of highly purified carbon nano tubes with variable size (from 5 - 40 nm) at low cost (per gram) and high yield. Whereas, carbon nano tubes synthesized using the laser ablation or arc discharge evaporation method always include impurity due to catalyst or catalyst support. The Penn State research is based on the use of zeolites over other metal/metal oxides in the microwave field for a high production and uniformity of the product. An extended coventional purification method has been employed to purify our products in order to remove left over impurity. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composites will be presented.

MEMS- and NEMS-based smart devices and systems

NASA Astrophysics Data System (ADS)

Varadan, Vijay K.

2001-11-01

The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with features sized now don at the sub micron and nanometer level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and systems. This effort offers the promise of: 1) increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed including micro stereo lithographic an micro molding techniques; 2) developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines; 3) development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation; 4) development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems, etc. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composite provide a new avenue for future smart systems. The integration of NEMS (NanoElectroMechanical Systems), MEMS, IDTs (Interdigital Transducers) and required microelectronics and conformal antenna in the multifunctional smart materials and composites results in a smart system suitable for sensing and control of a variety functions in automobile, aerospace, marine and civil structures and food and medical industries. This unique combination of technologies also results in novel conformal sensors that can be remotely sensed by an antenna system with the advantage of no power requirements at the sensor site. This paper provides a brief review of MEMS and NEMS based smart systems for various applications mentioned above. Carbon Nano Tubes (CNT) with their unique structure, have already proven to be valuable in their application as tips for scanning probe microscopy, field emission devices, nanoelectronics, H2-storage, electromagnetic absorbers, ESD, EMI films and coatings and structural composites. For many of these applications, highly purified and functionalized CNT which are compatible with many host polymers are needed. A novel microwave CVD processing technique to meet these requirements has been developed at Penn State Center for the engineering of Electronic and Acoustic Materials and Devices (CEEAMD). This method enables the production of highly purified carbon nano tubes with variable size (from 5-40 nm) at low cost (per gram) and high yield. Whereas, carbon nano tubes synthesized using the laser ablation or arc discharge evaporation method always include impurity due to catalyst or catalyst support. The Penn State research is based on the use of zeolites over other metal/metal oxides in the microwave field for a high production and uniformity of the product. An extended conventional purification method has been employed to purify our products in order to remove left over impurity. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross- linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composites will be presented.

Analysis of the bending stiffness and adhesion effect in RF-MEMS structures

NASA Astrophysics Data System (ADS)

Birleanu, C.; Pustan, M.; Dudescu, C.; Merie, V.; Pintea, I.

2017-02-01

Microelectromechanical system (MEMS) is a special branch with a wide range of applications in sensing, switching and actuating devices. Designing the reliable MEMS for thin free-standing structures like as bridges and cantilevers requires understanding of the tribomechanical properties of the materials and structures. The effect of geometrical dimensions (cross-section dimensions and length) on mechanical and tribological behavior of free-standing MEMS structures made of electroplated gold was analyzed in this paper. Special attention was given to the dependences between stiffness and cantilever length and the dependences between bending stress and variable travel range of actuated load. The force position was moved from the beams free-end toward to the anchor. The tests were performed at room temperature (22°C) and relative humidity RH of 40% with a noise- and vibration-isolated and environment-controlled XE-70 AFM from Park Systems using the contact mode. Each measurement was repeated many times in order to improve the accuracy of the experimental results. The stiffness of a microcantilever varies if the position of the acting force is changed. The experimental results obtained were in good correlation with those obtained analytically.

U.S. Army Corrosion Office's storage and quality requirements for military MEMS program

NASA Astrophysics Data System (ADS)

Zunino, J. L., III; Skelton, D. R.

2007-04-01

As the Army transforms into a more lethal, lighter and agile force, the technologies that support these systems must decrease in size while increasing in intelligence. Micro-electromechanical systems (MEMS) are one such technology that the Army and DOD will rely on heavily to accomplish these objectives. Conditions for utilization of MEMS by the military are unique. Operational and storage environments for the military are significantly different than those found in the commercial sector. Issues unique to the military include; high G-forces during gun launch, extreme temperature and humidity ranges, extended periods of inactivity (20 years plus) and interaction with explosives and propellants. The military operational environments in which MEMS will be stored or required to function are extreme and far surpass any commercial operating conditions. Security and encryption are a must for all MEMS communication, tracking, or data reporting devices employed by the military. Current and future military applications of MEMS devices include safety and arming devices, fuzing devices, various guidance systems, sensors/detectors, inertial measurement units, tracking devices, radio frequency devices, wireless Radio Frequency Identifications (RFIDs) and network systems, GPS's, radar systems, mobile base systems and information technology. MEMS embedded into these weapons systems will provide the military with new levels of speed, awareness, lethality, and information dissemination. The system capabilities enhanced by MEMS will translate directly into tactical and strategic military advantages.

Microelectromechanical Systems for Aerodynamics Applications

NASA Technical Reports Server (NTRS)

Mehregany, Mehran; DeAnna, Russell G.; Reshotko, Eli

1996-01-01

Microelectromechanical systems (MEMS) embody the integration of sensors, actuators, and electronics on a single substrate using integrated circuit fabrication techniques and compatible micromachining processes. Silicon and its derivatives form the material base for the MEMS technology. MEMS devices, including micro-sensors and micro-actuators, are attractive because they can be made small (characteristic dimension about microns), be produced in large numbers with uniform performance, include electronics for high performance and sophisticated functionality, and be inexpensive. MEMS pressure sensors, wall-shear-stress sensors, and micromachined hot-wires are nearing application in aeronautics. MEMS actuators face a tougher challenge since they have to be scaled (up) to the physical phenomena that are being controlled. MEMS actuators are proposed, for example, for controlling the small structures in a turbulent boundary layer, for aircraft control, for cooling, and for mixing enhancement. Data acquisition or control logistics require integration of electronics along with the transducer elements with appropriate consideration of analog-to-digital conversion, multiplexing, and telemetry. Altogether, MEMS technology offers exciting opportunities for aerodynamics applications both in wind tunnels and in flight

A large-scan-angle piezoelectric MEMS optical scanner actuated by a Nb-doped PZT thin film

NASA Astrophysics Data System (ADS)

Naono, Takayuki; Fujii, Takamichi; Esashi, Masayoshi; Tanaka, Shuji

2014-01-01

Resonant 1D microelectromechanical systems (MEMS) optical scanners actuated by piezoelectric unimorph actuators with a Nb-doped lead zirconate titanate (PNZT) thin film were developed for endoscopic optical coherence tomography (OCT) application. The MEMS scanners were designed as the resonance frequency was less than 125 Hz to obtain enough pixels per frame in OCT images. The device size was within 3.4 mm × 2.5 mm, which is compact enough to be installed in a side-imaging probe with 4 mm inner diameter. The fabrication process started with a silicon-on-insulator wafer, followed by PNZT deposition by the Rf sputtering and Si bulk micromachining process. The fabricated MEMS scanners showed maximum optical scan angles of 146° at 90 Hz, 148° at 124 Hz, 162° at 180 Hz, and 152° at 394 Hz at resonance in atmospheric pressure. Such wide scan angles were obtained by a drive voltage below 1.3 Vpp, ensuring intrinsic safety in in vivo uses. The scanner with the unpoled PNZT film showed three times as large a scan angle as that with a poled PZT films. A swept-source OCT system was constructed using the fabricated MEMS scanner, and cross-sectional images of a fingertip with image widths of 4.6 and 2.3 mm were acquired. In addition, a PNZT-based angle sensor was studied for feedback operation.

RF MEMS and Their Applications in NASA's Space Communication Systems

NASA Technical Reports Server (NTRS)

Williams, W. Daniel; Ponchak, George E.; Simons, Rainee N.; Zaman, Afroz; Kory, Carol; Wintucky, Edwin; Wilson, Jeffrey D.; Scardelletti, Maximilian; Lee, Richard; Nguyen, Hung

2001-01-01

Radio frequency (RF) and microwave communication systems rely on frequency, amplitude, and phase control circuits to efficiently use the available spectrum. Phase control circuits are required for electronically scanning phase array antennas that enable radiation pattern shaping, scanning, and hopping. Two types of phase shifters, which are the phase control circuits, are most often used. The first is comprised of two circuits with different phase characteristics such as two transmission lines of different lengths or a high pass and low pass filter and a switch that directs the RF power through one of the two circuits. Alternatively, a variable capacitor, or varactor, is used to change the effective electrical path length of a transmission line, which changes the phase characteristics. Filter banks are required for the diplexer at the front end of wide band communication satellites. These filters greatly increase the size and mass of the RF/microwave systems, but smaller diplexers may be made with a low loss varactor or a group of capacitors, a switch and an inductor.

Wavefront Correction for Large, Flexible Antenna Reflector

NASA Technical Reports Server (NTRS)

Imbriale, William A.; Jammejad, Vahraz; Rajagopalan, Harish; Xu, Shenheng

2010-01-01

A wavefront-correction system has been proposed as part of an outer-space radio communication system that would include a large, somewhat flexible main reflector antenna, a smaller subreflector antenna, and a small array feed at the focal plane of these two reflector antennas. Part of the wavefront-correction system would reside in the subreflector, which would be a planar patch-element reflectarray antenna in which the phase shifts of the patch antenna elements would be controlled via microelectromechanical systems (MEMS) radio -frequency (RF) switches. The system would include the following sensing-and-computing subsystems: a) An optical photogrammetric subsystem built around two cameras would estimate geometric distortions of the main reflector; b) A second subsystem would estimate wavefront distortions from amplitudes and phases of signals received by the array feed elements; and c) A third subsystem, built around small probes on the subreflector plane, would estimate wavefront distortions from differences among phases of signals received by the probes. The distortion estimates from the three subsystems would be processed to generate control signals to be fed to the MEMS RF switches to correct for the distortions, thereby enabling collimation and aiming of the received or transmitted radio beam to the required precision.

A novel multi-level IC-compatible surface microfabrication technology for MEMS with independently controlled lateral and vertical submicron transduction gaps

NASA Astrophysics Data System (ADS)

Cicek, Paul-Vahe; Elsayed, Mohannad; Nabki, Frederic; El-Gamal, Mourad

2017-11-01

An above-IC compatible multi-level MEMS surface microfabrication technology based on a silicon carbide structural layer is presented. The fabrication process flow provides optimal electrostatic transduction by allowing the creation of independently controlled submicron vertical and lateral gaps without the need for high resolution lithography. Adopting silicon carbide as the structural material, the technology ensures material, chemical and thermal compatibility with modern semiconductor nodes, reporting the lowest peak processing temperature (i.e. 200 °C) of all comparable works. This makes this process ideally suited for integrating capacitive-based MEMS directly above standard CMOS substrates. Process flow design and optimization are presented in the context of bulk-mode disk resonators, devices that are shown to exhibit improved performance with respect to previous generation flexural beam resonators, and that represent relatively complex MEMS structures. The impact of impending improvements to the fabrication technology is discussed.

Wearable Wireless Telemetry System for Implantable Bio-MEMS Sensors

NASA Technical Reports Server (NTRS)

Simons, Rainee N.; Miranda, Felix A.; Wilson, Jeffrey D.; Simons, Renita E.

2006-01-01

In this paper, a telemetry and contact-less powering system consisting of an implantable bio-MEMS sensor with a miniature printed square spiral chip antenna and an external wearable garment with printed loop antenna is investigated. The wearable garment pick-up antenna and the implantable chip antenna are in close proximity to each other and hence couple inductively through their near-fields and behave as the primary and the secondary circuits of a transformer, respectively. The numerical and experimental results are graphically presented, and include the design parameter values as a function of the geometry, the relative RF magnetic near-field intensity as a function of the distance and angle, and the current density on the strip conductors, for the implantable chip antenna.

Integrated MEMS-based variable optical attenuator and 10Gb/s receiver

NASA Astrophysics Data System (ADS)

Aberson, James; Cusin, Pierre; Fettig, H.; Hickey, Ryan; Wylde, James

2005-03-01

MEMS devices can be successfully commercialized in favour of competing technologies only if they offer an advantage to the customer in terms of lower cost or increased functionality. There are limited markets where MEMS can be manufactured cheaper than similar technologies due to large volumes: automotive, printing technology, wireless communications, etc. However, success in the marketplace can also be realized by adding significant value to a system at minimal cost or leverging MEMS technology when other solutions simply will not work. This paper describes a thermally actuated, MEMS based, variable optical attenuator that is co-packaged with existing opto-electronic devices to develop an integrated 10Gb/s SONET/SDH receiver. The configuration of the receiver opto-electronics and relatively low voltage availability (12V max) in optical systems bar the use of LCD, EO, and electro-chromic style attenuators. The device was designed and fabricated using a silicon-on-insulator (SOI) starting material. The design and performance of the device (displacement, power consumption, reliability, physical geometry) was defined by the receiver parameters geometry. This paper will describe how these design parameters (hence final device geometry) were determined in light of both the MEMS device fabrication process and the receiver performance. Reference will be made to the design tools used and the design flow which was a joint effort between the MEMS vendor and the end customer. The SOI technology offered a robust, manufacturable solution that gave the required performance in a cost-effective process. However, the singulation of the devices required the development of a new singulation technique that allowed large volumes of silicon to be removed during fabrication yet still offer high singulation yields.

Vibration nullification of MEMS device using input shaping

NASA Astrophysics Data System (ADS)

Jordan, Scott; Lawrence, Eric M.

2003-07-01

The active silicon microstructures known as Micro-Electromechanical Systems (MEMS) are improving many existing technologies through simplification and cost reduction. Many industries have already capitalized on MEMS technology such as those in fields as diverse as telecommunications, computing, projection displays, automotive safety, defense and biotechnology. As they grow in sophistication and complexity, the familiar pressures to further reduce costs and increase performance grow for those who design and manufacture MEMS devices and the engineers who specify them for their end applications. One example is MEMS optical switches that have evolved from simple, bistable on/off elements to microscopic, freelypositionable beam steering optics. These can be actuated to discrete angular positions or to continuously-variable angular states through applied command signals. Unfortunately, elaborate closed-loop actuation schemes are often necessitated in order to stabilize the actuation. Furthermore, preventing one actuated micro-element from vibrationally cross-coupling with its neighbors is another reason costly closed-loop approaches are thought to be necessary. The Laser Doppler Vibrometer (LDV) is a valuable tool for MEMS characterization that provides non-contact, real-time measurements of velocity and/or displacement response. The LDV is a proven technology for production metrology to determine dynamical behaviors of MEMS elements, which can be a sensitive indicator of manufacturing variables such as film thickness, etch depth, feature tolerances, handling damage and particulate contamination. They are also important for characterizing the actuation dynamics of MEMS elements for implementation of a patented controls technique called Input Shaping«, which we show here can virtually eliminate the vibratory resonant response of MEMS elements even when subjected to the most severe actuation profiles. In this paper, we will demonstrate the use of the LDV to determine how the application of this compact, efficient algorithm can improve the performance of both open- and closed-loop MEMS devices, eliminating the need for costly closed-loop approaches. This can greatly reduce the complexity, cost and yield of MEMS design and manufacture.

BioMEMS for biosensors and closed-loop drug delivery.

PubMed

Coffel, Joel; Nuxoll, Eric

2018-06-15

The efficacy of pharmaceutical treatments can be greatly enhanced by physiological feedback from the patient using biosensors, though this is often invasive or infeasible. By adapting microelectromechanical systems (MEMS) technology to miniaturize such biosensors, previously inaccessible signals can be obtained, often from inside the patient. This is enabled by the device's extremely small footprint which minimizes both power consumption and implantation trauma, as well as the transport time for chemical analytes, in turn decreasing the sensor's response time. MEMS fabrication also allows mass production which can be easily scaled without sacrificing its high reproducibility and reliability, and allows seamless integration with control circuitry and telemetry which is already produced using the same materials and fabrication steps. By integrating these systems with drug delivery devices, many of which are also MEMS-based, closed loop drug delivery can be achieved. This paper surveys the types of signal transduction devices available for biosensing-primarily electrochemical, optical, and mechanical-looking at their implementation via MEMS technology. The impact of MEMS technology on the challenges of biosensor development, particularly safety, power consumption, degradation, fouling, and foreign body response, are also discussed. Copyright © 2018 Elsevier B.V. All rights reserved.

EDITORIAL: International MEMS Conference 2006

NASA Astrophysics Data System (ADS)

Tay, Francis E. H.; Jianmin, Miao; Iliescu, Ciprian

2006-04-01

The International MEMS conference (iMEMS2006) organized by the Institute of Bioengineering and Nanotechnology and Nanyang Technological University aims to provide a platform for academicians, professionals and industrialists in various related fields from all over the world to share and learn from each other. Of great interest is the incorporation of the theme of life sciences application using MEMS. It is the desire of this conference to initiate collaboration and form network of cooperation. This has continued to be the objective of iMEMS since its inception in 1997. The technological advance of MEMS over the past few decades has been truly exciting in terms of development and applications. In order to participate in this rapid development, a conference involving delegates from within the MEMS community and outside the community is very meaningful and timely. With the receipt of over 200 articles, delegates related to MEMS field from all over the world will share their perspectives on topics such as MEMS/MST Design, MEMS Teaching and Education, MEMS/MST Packaging, MEMS/MST Fabrication, Microsystems Applications, System Integration, Wearable Devices, MEMSWear and BioMEMS. Invited speakers and delegates from outside the field have also been involved to provide challenges, especially in the life sciences field, for the MEMS community to potentially address. The proceedings of the conference will be published as an issue in the online Journal of Physics: Conference Series and this can reach a wider audience and will facilitate the reference and citation of the work presented in the conference. We wish to express our deep gratitude to the International Scientific Committee members and the organizing committee members for contributing to the success of this conference. We would like to thank all the delegates, speakers and sponsors from all over the world for presenting and sharing their perspectives on topics related to MEMS and the challenges that MEMS can potentially address.

Additive direct-write microfabrication for MEMS: A review

NASA Astrophysics Data System (ADS)

Teh, Kwok Siong

2017-12-01

Direct-write additive manufacturing refers to a rich and growing repertoire of well-established fabrication techniques that builds solid objects directly from computer- generated solid models without elaborate intermediate fabrication steps. At the macroscale, direct-write techniques such as stereolithography, selective laser sintering, fused deposition modeling ink-jet printing, and laminated object manufacturing have significantly reduced concept-to-product lead time, enabled complex geometries, and importantly, has led to the renaissance in fabrication known as the maker movement. The technological premises of all direct-write additive manufacturing are identical—converting computer generated three-dimensional models into layers of two-dimensional planes or slices, which are then reconstructed sequentially into threedimensional solid objects in a layer-by-layer format. The key differences between the various additive manufacturing techniques are the means of creating the finished layers and the ancillary processes that accompany them. While still at its infancy, direct-write additive manufacturing techniques at the microscale have the potential to significantly lower the barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMS parts that have larger dimensions, high aspect ratios, and complex shapes. In recent years, significant advancements in materials chemistry, laser technology, heat and fluid modeling, and control systems have enabled additive manufacturing to achieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMS fabrication. Compared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, direct-write additive manufacturing techniques allow for rapid design-to-prototype realization by limiting or circumventing the need for cleanrooms, photolithography and extensive training. With current direct-write additive manufacturing technologies, it is possible to fabricate unsophisticated micrometer scale structures at adequate resolutions and precisions using materials that range from polymers, metals, ceramics, to composites. In both academia and industry, direct-write additive manufacturing offers extraordinary promises to revolutionize research and development in microfabrication and MEMS technologies. Importantly, direct-write additive manufacturing could appreciably augment current MEMS fabrication technologies, enable faster design-to-product cycle, empower new paradigms in MEMS designs, and critically, encourage wider participation in MEMS research at institutions or for individuals with limited or no access to cleanroom facilities. This article aims to provide a limited review of the current landscape of direct-write additive manufacturing techniques that are potentially applicable for MEMS microfabrication.

MEMS microphone innovations towards high signal to noise ratios (Conference Presentation) (Plenary Presentation)

NASA Astrophysics Data System (ADS)

Dehé, Alfons

2017-06-01

After decades of research and more than ten years of successful production in very high volumes Silicon MEMS microphones are mature and unbeatable in form factor and robustness. Audio applications such as video, noise cancellation and speech recognition are key differentiators in smart phones. Microphones with low self-noise enable those functions. Backplate-free microphones enter the signal to noise ratios above 70dB(A). This talk will describe state of the art MEMS technology of Infineon Technologies. An outlook on future technologies such as the comb sensor microphone will be given.

MEMS and FOG Technologies for Tactical and Navigation Grade Inertial Sensors—Recent Improvements and Comparison

PubMed Central

Deppe, Olaf; Dorner, Georg; König, Stefan; Martin, Tim; Voigt, Sven; Zimmermann, Steffen

2017-01-01

In the following paper, we present an industry perspective of inertial sensors for navigation purposes driven by applications and customer needs. Microelectromechanical system (MEMS) inertial sensors have revolutionized consumer, automotive, and industrial applications and they have started to fulfill the high end tactical grade performance requirements of hybrid navigation systems on a series production scale. The Fiber Optic Gyroscope (FOG) technology, on the other hand, is further pushed into the near navigation grade performance region and beyond. Each technology has its special pros and cons making it more or less suitable for specific applications. In our overview paper, we present latest improvements at NG LITEF in tactical and navigation grade MEMS accelerometers, MEMS gyroscopes, and Fiber Optic Gyroscopes, based on our long-term experience in the field. We demonstrate how accelerometer performance has improved by switching from wet etching to deep reactive ion etching (DRIE) technology. For MEMS gyroscopes, we show that better than 1°/h series production devices are within reach, and for FOGs we present how limitations in noise performance were overcome by signal processing. The paper also intends a comparison of the different technologies, emphasizing suitability for different navigation applications, thus providing guidance to system engineers. PMID:28287483

Piezoelectric MEMS: Ferroelectric thin films for MEMS applications

NASA Astrophysics Data System (ADS)

Kanno, Isaku

2018-04-01

In recent years, piezoelectric microelectromechanical systems (MEMS) have attracted attention as next-generation functional microdevices. Typical applications of piezoelectric MEMS are micropumps for inkjet heads or micro-gyrosensors, which are composed of piezoelectric Pb(Zr,Ti)O3 (PZT) thin films and have already been commercialized. In addition, piezoelectric vibration energy harvesters (PVEHs), which are regarded as one of the key devices for Internet of Things (IoT)-related technologies, are promising future applications of piezoelectric MEMS. Significant features of piezoelectric MEMS are their simple structure and high energy conversion efficiency between mechanical and electrical domains even on the microscale. The device performance strongly depends on the function of the piezoelectric thin films, especially on their transverse piezoelectric properties, indicating that the deposition of high-quality piezoelectric thin films is a crucial technology for piezoelectric MEMS. On the other hand, although the difficulty in measuring the precise piezoelectric coefficients of thin films is a serious obstacle in the research and development of piezoelectric thin films, a simple unimorph cantilever measurement method has been proposed to obtain precise values of the direct or converse transverse piezoelectric coefficient of thin films, and recently this method has become to be the standardized testing method. In this article, I will introduce fundamental technologies of piezoelectric thin films and related microdevices, especially focusing on the deposition of PZT thin films and evaluation methods for their transverse piezoelectric properties.

Triz in Mems

NASA Astrophysics Data System (ADS)

Apte, Prakash R.

1999-11-01

TRIZ is a Russian abbreviation. Genrich Altshuller developed it fifty years ago in the former Soviet Union. He examined thousands of inventions made in different technological systems and formulated a 'Theory of Inventive problem solving' (TRIZ). Altshuller's research of over fifty years on Creativity and Inventive Problem Solving has led to many different classifications, methods and tools of invention. Some of these are, Contradictions table, Level of inventions, Patterns in evolution of technological systems, ARIZ-Algorithm for Inventive Problem Solving, Diagnostic problem solving and Anticipatory Failure Determination. MEMS research consists of conceptual design, process technology and including of various Mechanical, ELectrical, Thermal, Magnetic, Acoustic and other effects. MEMS system s are now rapidly growing in complexity. Each system will thus follow one or more 'patterns of evolution' as given by Altshuller. This paper attempts to indicate how various TRIZ tools can be used in MEMS research activities.

Advanced Sensor and Packaging Technologies for Intelligent Adaptive Engine Controls (Preprint)

DTIC Science & Technology

2013-05-01

combination of micro-electromechanical systems (MEMS) sensor technology, novel ceramic materials, high - temperature electronics, and advanced harsh...with simultaneous pressure measurements up to 1,000 psi. The combination of a high - temperature , high -pressure-ratio compressor system, and adaptive...combination of micro-electromechanical systems (MEMS) sensor technology, novel ceramic materials, high temperature electronics, and advanced harsh

Initial animal studies of a wireless, batteryless, MEMS implant for cardiovascular applications.

PubMed

Najafi, Nader; Ludomirsky, Achiau

2004-03-01

This paper reports the results of the initial animal studies of a wireless, batteryless, implantable pressure sensor using microelectromechanical systems (MEMS) technology. The animal studies were acute and proved the functional feasibility of using MEMS technology for wireless bio sensing. The results are very encouraging and surpassed the majority of the application's requirements, including high sampling speed and high resolution. Based on the lessons learned, second generation wireless sensors are being developed that will provide total system solution.

MEMS: Enabled Drug Delivery Systems.

PubMed

Cobo, Angelica; Sheybani, Roya; Meng, Ellis

2015-05-01

Drug delivery systems play a crucial role in the treatment and management of medical conditions. Microelectromechanical systems (MEMS) technologies have allowed the development of advanced miniaturized devices for medical and biological applications. This Review presents the use of MEMS technologies to produce drug delivery devices detailing the delivery mechanisms, device formats employed, and various biomedical applications. The integration of dosing control systems, examples of commercially available microtechnology-enabled drug delivery devices, remaining challenges, and future outlook are also discussed. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Investigation of improving MEMS-type VOA reliability

NASA Astrophysics Data System (ADS)

Hong, Seok K.; Lee, Yeong G.; Park, Moo Y.

2003-12-01

MEMS technologies have been applied to a lot of areas, such as optical communications, Gyroscopes and Bio-medical components and so on. In terms of the applications in the optical communication field, MEMS technologies are essential, especially, in multi dimensional optical switches and Variable Optical Attenuators(VOAs). This paper describes the process for the development of MEMS type VOAs with good optical performance and improved reliability. Generally, MEMS VOAs have been fabricated by silicon micro-machining process, precise fibre alignment and sophisticated packaging process. Because, it is composed of many structures with various materials, it is difficult to make devices reliable. We have developed MEMS type VOSs with many failure mode considerations (FMEA: Failure Mode Effect Analysis) in the initial design step, predicted critical failure factors and revised the design, and confirmed the reliability by preliminary test. These predicted failure factors were moisture, bonding strength of the wire, which wired between the MEMS chip and TO-CAN and instability of supplied signals. Statistical quality control tools (ANOVA, T-test and so on) were used to control these potential failure factors and produce optimum manufacturing conditions. To sum up, we have successfully developed reliable MEMS type VOAs with good optical performances by controlling potential failure factors and using statistical quality control tools. As a result, developed VOAs passed international reliability standards (Telcodia GR-1221-CORE).

Investigation of improving MEMS-type VOA reliability

NASA Astrophysics Data System (ADS)

Hong, Seok K.; Lee, Yeong G.; Park, Moo Y.

2004-01-01

MEMS technologies have been applied to a lot of areas, such as optical communications, Gyroscopes and Bio-medical components and so on. In terms of the applications in the optical communication field, MEMS technologies are essential, especially, in multi dimensional optical switches and Variable Optical Attenuators(VOAs). This paper describes the process for the development of MEMS type VOAs with good optical performance and improved reliability. Generally, MEMS VOAs have been fabricated by silicon micro-machining process, precise fibre alignment and sophisticated packaging process. Because, it is composed of many structures with various materials, it is difficult to make devices reliable. We have developed MEMS type VOSs with many failure mode considerations (FMEA: Failure Mode Effect Analysis) in the initial design step, predicted critical failure factors and revised the design, and confirmed the reliability by preliminary test. These predicted failure factors were moisture, bonding strength of the wire, which wired between the MEMS chip and TO-CAN and instability of supplied signals. Statistical quality control tools (ANOVA, T-test and so on) were used to control these potential failure factors and produce optimum manufacturing conditions. To sum up, we have successfully developed reliable MEMS type VOAs with good optical performances by controlling potential failure factors and using statistical quality control tools. As a result, developed VOAs passed international reliability standards (Telcodia GR-1221-CORE).

European MEMS foundries

NASA Astrophysics Data System (ADS)

Salomon, Patric R.

2003-01-01

According to the latest release of the NEXUS market study, the market for MEMS or Microsystems Technology (MST) is predicted to grow to $68B by the year 2005, with systems containing these components generating even higher revenues and growth. The latest advances in MST/MEMS technology have enabled the design of a new generation of microsystems that are smaller, cheaper, more reliable, and consume less power. These integrated systems bring together numerous analog/mixed signal microelectronics blocks and MEMS functions on a single chip or on two or more chips assembled within an integrated package. In spite of all these advances in technology and manufacturing, a system manufacturer either faces a substantial up-front R&D investment to create his own infrastructure and expertise, or he can use design and foundry services to get the initial product into the marketplace fast and with an affordable investment. Once he has a viable product, he can still think about his own manufacturing efforts and investments to obtain an optimized high volume manufacturing for the specific product. One of the barriers to successful exploitation of MEMS/MST technology has been the lack of access to industrial foundries capable of producing certified microsystems devices in commercial quantities, including packaging and test. This paper discusses Multi-project wafer (MPW) runs, requirements for foundries and gives some examples of foundry business models. Furthermore, this paper will give an overview on MST/MEMS services that are available in Europe, including pure commercial activities, European project activities (e.g. Europractice), and some academic services.

MEMS device for spacecraft thermal control applications

NASA Technical Reports Server (NTRS)

Swanson, Theordore D. (Inventor)

2003-01-01

A micro-electromechanical device that comprises miniaturized mechanical louvers, referred to as Micro Electro-Mechanical Systems (MEMS) louvers are employed to achieve a thermal control function for spacecraft and instruments. The MEMS louvers are another form of a variable emittance control coating and employ micro-electromechanical technology. In a function similar to traditional, macroscopic thermal louvers, the MEMS louvers of the present invention change the emissivity of a surface. With the MEMS louvers, as with the traditional macroscopic louvers, a mechanical vane or window is opened and closed to allow an alterable radiative view to space.

Surface chemistry and tribology of MEMS.

PubMed

Maboudian, Roya; Carraro, Carlo

2004-01-01

The microscopic length scale and high surface-to-volume ratio, characteristic of microelectro-mechanical systems (MEMS), dictate that surface properties are of paramount importance. This review deals with the effects of surface chemical treatments on tribological properties (adhesion, friction, and wear) of MEMS devices. After a brief review of materials and processes that are utilized in MEMS technology, the relevant tribological and chemical issues are discussed. Various MEMS microinstruments are discussed, which are commonly employed to perform adhesion, friction, and wear measurements. The effects of different surface treatments on the reported tribological properties are discussed.

Radioistopes to Solar to High Energy Accelerators - Chip-Scale Energy Sources

NASA Astrophysics Data System (ADS)

Lal, Amit

2013-12-01

This talk will present MEMS based power sources that utilize radioisotopes, solar energy, and potentially nuclear energy through advancements in integration of new structures and materials within MEMS. Micro power harvesters can harness power from vibration, radioisotopes, light, sound, and biology may provide pathways to minimize or even eliminate batteries in sensor nodes. In this talk work on radioisotope thin films for MEMS will be include the self-reciprocating cantilever, betavoltaic cells, and high DC voltages. The self-reciprocating cantilever energy harvester allows small commercially viable amounts of radioisotopes to generate mW to Watts of power so that very reliable power sources that last 100s of years are possible. The tradeoffs between reliability and potential stigma with radioisotopes allow one to span a useful design space with reliability as a key parameter. These power sources provide pulsed power at three different time scales using mechanical, RF, and static extraction of energy from collected charge. Multi-use capability, both harvesting radioisotope power and local vibration energy extends the reliability of micro-power sources further.

Development of a wireless MEMS multifunction sensor system and field demonstration of embedded sensors for monitoring concrete pavements : tech transfer summary.

DOT National Transportation Integrated Search

2016-08-01

Micro-electromechanical sensors and systems- (MEMS)-based and : wireless-based smart-sensing technologies have, until now, rarely : been used for monitoring pavement response in the field, and the : requirements for using such smart sensing technolog...

Towards a biomimetic gyroscope inspired by the fly's haltere using microelectromechanical systems technology

PubMed Central

Droogendijk, H.; Brookhuis, R. A.; de Boer, M. J.; Sanders, R. G. P.; Krijnen, G. J. M.

2014-01-01

Flies use so-called halteres to sense body rotation based on Coriolis forces for supporting equilibrium reflexes. Inspired by these halteres, a biomimetic gimbal-suspended gyroscope has been developed using microelectromechanical systems (MEMS) technology. Design rules for this type of gyroscope are derived, in which the haltere-inspired MEMS gyroscope is geared towards a large measurement bandwidth and a fast response, rather than towards a high responsivity. Measurements for the biomimetic gyroscope indicate a (drive mode) resonance frequency of about 550 Hz and a damping ratio of 0.9. Further, the theoretical performance of the fly's gyroscopic system and the developed MEMS haltere-based gyroscope is assessed and the potential of this MEMS gyroscope is discussed. PMID:25100317

Microelectromechanical Systems

NASA Technical Reports Server (NTRS)

Gabriel, Kaigham J.

1995-01-01

Micro-electromechanical systems (MEMS) is an enabling technology that merges computation and communication with sensing and actuation to change the way people and machines interact with the physical world. MEMS is a manufacturing technology that will impact widespread applications including: miniature inertial measurement measurement units for competent munitions and personal navigation; distributed unattended sensors; mass data storage devices; miniature analytical instruments; embedded pressure sensors; non-invasive biomedical sensors; fiber-optics components and networks; distributed aerodynamic control; and on-demand structural strength. The long term goal of ARPA's MEMS program is to merge information processing with sensing and actuation to realize new systems and strategies for both perceiving and controlling systems, processes, and the environment. The MEMS program has three major thrusts: advanced devices and processes, system design, and infrastructure.

MEMS-based thermoelectric infrared sensors: A review

NASA Astrophysics Data System (ADS)

Xu, Dehui; Wang, Yuelin; Xiong, Bin; Li, Tie

2017-12-01

In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

MEMS startups: disruptive technology and business do's and don'ts

NASA Astrophysics Data System (ADS)

Bryzek, Janusz

2005-02-01

This paper characterizes factors that affect the probability of success for new startups. These guidelines are derived primarily from Venture Capital industry experience in funding disruptive technology companies. It follows with an overview of Silicon Valley MEMS and MOEMS startups and provides with a summary of Do"s and Don"ts for entrepreneurs.

Nonlinear dynamic modeling of a V-shaped metal based thermally driven MEMS actuator for RF switches

NASA Astrophysics Data System (ADS)

Bakri-Kassem, Maher; Dhaouadi, Rached; Arabi, Mohamed; Estahbanati, Shahabeddin V.; Abdel-Rahman, Eihab

2018-05-01

In this paper, we propose a new dynamic model to describe the nonlinear characteristics of a V-shaped (chevron) metallic-based thermally driven MEMS actuator. We developed two models for the thermal actuator with two configurations. The first MEMS configuration has a small tip connected to the shuttle, while the second configuration has a folded spring and a wide beam attached to the shuttle. A detailed finite element model (FEM) and a lumped element model (LEM) are proposed for each configuration to completely characterize the electro-thermal and thermo-mechanical behaviors. The nonlinear resistivity of the polysilicon layer is extracted from the measured current-voltage (I-V) characteristics of the actuator and the simulated corresponding temperatures in the FEM model, knowing the resistivity of the polysilicon at room temperature from the manufacture’s handbook. Both developed models include the nonlinear temperature-dependent material properties. Numerical simulations in comparison with experimental data using a dedicated MEMS test apparatus verify the accuracy of the proposed LEM model to represent the complex dynamics of the thermal MEMS actuator. The LEM and FEM simulation results show an accuracy ranging from a maximum of 13% error down to a minimum of 1.4% error. The actuator with the lower thermal load to air that includes a folded spring (FS), also known as high surface area actuator is compared to the actuator without FS, also known as low surface area actuator, in terms of the I-V characteristics, power consumption, and experimental static and dynamic responses of the tip displacement.

EDITORIAL: The Fourth International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2004)

NASA Astrophysics Data System (ADS)

Tanaka, Shuji; Toriyama, Toshiyuki

2005-09-01

This special issue of the Journal of Micromechanics and Microengineering features papers selected from the Fourth International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2004). The workshop was held in Kyoto, Japan, on 28-30 November 2004, by The Ritsumeikan Research Institute of Micro System Technology in cooperation with The Global Emerging Technology Institute, The Institute of Electrical Engineers of Japan, The Sensors and Micromachines Society, The Micromachine Center and The Kyoto Nanotech Cluster. Power MEMS is one of the newest categories of MEMS, which encompasses microdevices and microsystems for power generation, energy conversion and propulsion. The first concept of power MEMS was proposed in the late 1990s by Epstein's group at the Massachusetts Institute of Technology, where they continue to study MEMS-based gas turbine generators. Since then, the research and development of power MEMS have been promoted by the need for compact power sources with high energy and power density. Since its inception, power MEMS has expanded to include not only various MEMS-based power generators but also small energy machines and microdevices for macro power generators. At the last workshop, various devices and systems, such as portable fuel cells and their peripherals, micro and small turbo machinery, energy harvesting microdevices, and microthrusters, were presented. Their power levels vary from ten nanowatts to hundreds of watts, spanning ten orders of magnitude. The first PowerMEMS workshop was held in 2000 in Sendai, Japan, and consisted of only seven invited presentations. The workshop has grown since then, and in 2004 there were 5 invited, 20 oral and 29 poster presentations. From the 54 papers in the proceedings, 12 papers have been selected for this special issue. I would like to express my appreciation to the members of the Organizing Committee and Technical Program Committee. This special issue was edited in collaboration with Professor Toshiyuki Toriyama (Ritsumeikan University), Co-chair of the Technical Program Committee, and the Institute of Physics Publishing staff.

In situ MEMS testing: correlation of high-resolution X-ray diffraction with mechanical experiments and finite element analysis

NASA Astrophysics Data System (ADS)

Schifferle, Andreas; Dommann, Alex; Neels, Antonia

2017-12-01

New methods are needed in microsystems technology for evaluating microelectromechanical systems (MEMS) because of their reduced size. The assessment and characterization of mechanical and structural relations of MEMS are essential to assure the long-term functioning of devices, and have a significant impact on design and fabrication.

Miniature Inertial and Augmentation Sensors for Integrated Inertial/GPS Based Navigation Applications

DTIC Science & Technology

2010-03-01

in this paper. Velocity sensing can be accomplished in the optical domain with laser Doppler radar (i.e. LIDAR ), through RF band or ultrasonic... Doppler radar. Reference [34] discusses an example of a LIDAR based velocimeter, used to furnish landing speed information for spacecraft terminal descent...in military (and commercial) capabilities: the Ring Laser Gyro (since ~1975), Fiber Optic Gyros (since ~1985), and MEMS (since ~1995). RLGs enabled

Selected papers from the 12th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2012) (Atlanta, GA, USA, 2-5 December 2012)

NASA Astrophysics Data System (ADS)

Allen, Mark G.; Lang, Jeffrey

2013-11-01

Welcome to this special section of the Journal of Micromechanics and Microengineering (JMM). This section, co-edited by myself and by Professor Jeffrey Lang of the Massachusetts Institute of Technology, contains expanded versions of selected papers presented at the Power MEMS meeting held in Atlanta, GA, USA, in December of 2012. Professor Lang and I had the privilege of co-chairing Power MEMS 2012, the 12th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications. The scope of the PowerMEMS series of workshops ranges from basic principles, to materials and fabrication, to devices and systems, to applications. The many applications of power MEMS (microelectromehcanical systems) range from MEMS-enabled energy harvesting, storage, conversion and conditioning, to integrated systems that manage these processes. Why is the power MEMS field growing in importance? Smaller-scale power and power supplies (microwatts to tens of watts) are gaining in prominence due to many factors, including the ubiquity of low power portable electronic equipment and the proliferation of wireless sensor nodes that require extraction of energy from their embedding environment in order to function. MEMS manufacturing methods can be utilized to improve the performance of traditional power supply elements, such as allowing batteries to charge faster or shrinking the physical size of passive elements in small-scale power supplies. MEMS technologies can be used to fabricate energy harvesters that extract energy from an embedding environment to power wireless sensor nodes, in-body medical implants and other devices, in which the harvesters are on the small scales that are appropriately matched to the overall size of these microsystems. MEMS can enable the manufacturing of energy storage elements from nontraditional materials by bringing appropriate structure and surface morphology to these materials as well as fabricating the electrical interfaces required for their operation and interconnection. Clearly, the marriage of MEMS technologies and energy conversion is a vital application space; and we are pleased to bring you some of the latest results from that space in this special section. Approximately 130 papers were presented at the Power MEMS 2012 conference. From these, the 20 papers you have before you were selected based on paper quality and topical balance. As you can see, papers representing many of the important areas of power MEMS are included: energy harvesters using multiple transduction schemes; MEMS-based fabrication of compact passive elements (inductors, supercapacitors, transformers); MEMS-enabled power diagnostics; MEMS-based batteries; and low power circuitry adapted to interfacing MEMS-based harvesters to overall systems. All of the papers you will read in this special section comprise substantial expansion from the proceedings articles and were reviewed through JMM's normal reviewing process. Both Professor Lang and I hope that you will share our enthusiasm for the field of power MEMS and that you will find this special section of JMM exciting, interesting and useful.  Sincerely,  Mark G Allen

A review of MEMS micropropulsion technologies for CubeSats and PocketQubes

NASA Astrophysics Data System (ADS)

Silva, Marsil A. C.; Guerrieri, Daduí C.; Cervone, Angelo; Gill, Eberhard

2018-02-01

CubeSats have been extensively used in the past decade as scientific tools, technology demonstrators and for education. Recently, PocketQubes have emerged as an interesting and even smaller alternative to CubeSats. However, both satellite types often lack some key capabilities, such as micropropulsion, in order to further extend the range of applications of these small satellites. This paper reviews the current development status of micropropulsion systems fabricated with MEMS (micro electro-mechanical systems) and silicon technology intended to be used in CubeSat or PocketQube missions and compares different technologies with respect to performance parameters such as thrust, specific impulse, and power as well as in terms of operational complexity. More than 30 different devices are analyzed and divided into 7 main categories according to the working principle. A specific outcome of the research is the identification of the current status of MEMS technologies for micropropulsion including key opportunities and challenges.

Thin Film Transistor Control Circuitry for MEMS Acoustic Transducers

NASA Astrophysics Data System (ADS)

Daugherty, Robin

This work seeks to develop a practical solution for short range ultrasonic communications and produce an integrated array of acoustic transmitters on a flexible substrate. This is done using flexible thin film transistor (TFT) and micro electromechanical systems (MEMS). The goal is to develop a flexible system capable of communicating in the ultrasonic frequency range at a distance of 10-100 meters. This requires a great deal of innovation on the part of the FDC team developing the TFT driving circuitry and the MEMS team adapting the technology for fabrication on a flexible substrate. The technologies required for this research are independently developed. The TFT development is driven primarily by research into flexible displays. The MEMS development is driving by research in biosensors and micro actuators. This project involves the integration of TFT flexible circuit capabilities with MEMS micro actuators in the novel area of flexible acoustic transmitter arrays. This thesis focuses on the design, testing and analysis of the circuit components required for this project.

MEMS applications in space exploration

NASA Astrophysics Data System (ADS)

Tang, William C.

1997-09-01

Space exploration in the coming century will emphasize cost effectiveness and highly focused mission objectives, which will result in frequent multiple missions that broaden the scope of space science and to validate new technologies on a timely basis. MEMS is one of the key enabling technology to create cost-effective, ultra-miniaturized, robust, and functionally focused spacecraft for both robotic and human exploration programs. Examples of MEMS devices at various stages of development include microgyroscope, microseismometer, microhygrometer, quadrupole mass spectrometer, and micropropulsion engine. These devices, when proven successful, will serve as models for developing components and systems for new-millennium spacecraft.

Applications of MEMS for Space Exploration

NASA Astrophysics Data System (ADS)

Tang, William C.

1998-03-01

Space exploration in the coming century will emphasize cost effectiveness and highly focused mission objectives, which will result in frequent multiple missions that broaden the scope of space science and to validate new technologies on a timely basis. Micro Electro Mechanical Systems (MEMS) is one of the key enabling technologies to create cost-effective, ultra-miniaturized, robust, and functionally focused spacecraft for both robotic and human exploration programs. Examples of MEMS devices at various stages of development include microgyroscope, microseismometer, microhygrometer, quadrupole mass spectrometer, and micropropulsion engine. These devices, when proven successful, will serve as models for developing components and systems for new-millennium spacecraft.

EDITORIAL: The 7th International Workshop on Micro and Nanotechnologies for Power Generation and Energy Conversion Applications (PowerMEMS 2007)

NASA Astrophysics Data System (ADS)

Hebling, C.; Woias, P.

2008-10-01

This special issue of Journal of Micromechanics and Microengineering (JMM) contains a selection of papers from the 7th International Workshop on Micro and Nanotechnologies for Power Generation and Energy Conversion (PowerMEMS 2007). The workshop was held in Freiburg, Germany on 27-29 November 2007 under the joint organization of the Fraunhofer Institute for Solar Energy Systems (FhG-ISE), Freiburg and the Department of Microsystems Engineering (IMTEK) of the Albert-Ludwig-University of Freiburg. PowerMEMS 2007 continues a series of workshops initiated in 2000 in Japan to create an annual discussion forum in the emerging field of micro energy technology. With a single exception in 2001, the workshop has continued as an annual meeting ever since, with a continuous increase in the number of presentations and participants. The program of PowerMEMS 2007 was composed of 2 invited talks, 25 oral talks and 61 poster presentations. From these 88 presentations 16 have been selected for this special issue. It was at the end of 1959 when the Caltech physicist Richard Feynman gave his famous lecture entitled 'There Is Plenty of Room at the Bottom' in which he discussed the possibilities of miniaturization for both storage capacity ('Encyclopaedia Britannica on the head of a pin') as well as micro machining ('rearranging the atoms'), although there were absolutely no technological possibilities in sight for an adequate realization of such ideas. Now, nearly 50 years later, we not only have incredible knowledge about the nanoworld, but even more we are now able to generate microelectromechanical devices which, next to their electronic properties, can integrate physical and analytical functions. Today, Feynman might easily have added a second lecture entitled 'There is Plenty of Energy at the Bottom'. Micro energy technology has seen a tremendous rise in MEMS and material sciences and is regarded today as one of their hot topics. Also, there are more and more companies in this field trying to commercialize micro energy harvesting devices, micro thermo-photovoltaics or micro fuel cells in order to make an impact on our daily life. It is interesting to see the remarkable scientific dynamics and innovations in micro energy technology that have been mirrored in the scope of consecutive PowerMEMS workshops. Micro fuel cells, micro combustion systems and heat engines have been on-going topics from the beginning due to their promising power densities and high power levels up to hundreds of watts. At the other end of the power scale micro energy harvesting has entered the stage, with a remarkable growth rate of presentations during the last three workshops, towering over all other topics with 33 presentations at PowerMEMS 2007. Another significant trend is the slow but steady emergence of electronic energy management as a future key technology. As Guest Editors of this special issue we would like to express our appreciation to the members of the Organizing Committee and the Technical Program Committee of PowerMEMS for their on-going efforts. By selecting the research fields mentioned above they formed the PowerMEMS 2007 program as a comprehensive digest of today's micro energy technology that is reflected, along with selected high quality publications, in this special issue of JMM. We hope that this work will stimulate further innovative research in micro energy technology and will help to mark the trail for further progress in this exciting field of MEMS science and technology.

Nano/micro-electro mechanical systems: a patent view

NASA Astrophysics Data System (ADS)

Hu, Guangyuan; Liu, Weishu

2015-12-01

Combining both bibliometrics and citation network analysis, this research evaluates the global development of micro-electro mechanical systems (MEMS) research based on the Derwent Innovations Index database. We found that worldwide, the growth trajectory of MEMS patents demonstrates an approximate S shape, with United States, Japan, China, and Korea leading the global MEMS race. Evidenced by Derwent class codes, the technology structure of global MEMS patents remains steady over time. Yet there does exist a national competitiveness component among the top country players. The latecomer China has become the second most prolific country filing MEMS patents, but its patent quality still lags behind the global average.

MEMS Applications in Aerodynamic Measurement Technology

NASA Technical Reports Server (NTRS)

Reshotko, E.; Mehregany, M.; Bang, C.

1998-01-01

Microelectromechanical systems (MEMS) embodies the integration of sensors, actuators, and electronics on a single substrate using integrated circuit fabrication techniques and compatible bulk and surface micromachining processes. Silicon and its derivatives form the material base for the MEMS technology. MEMS devices, including microsensors and microactuators, are attractive because they can be made small (characteristic dimension about 100 microns), be produced in large numbers with uniform performance, include electronics for high performance and sophisticated functionality, and be inexpensive. For aerodynamic measurements, it is preferred that sensors be small so as to approximate measurement at a point, and in fact, MEMS pressure sensors, wall shear-stress sensors, heat flux sensors and micromachined hot wires are nearing application. For the envisioned application to wind tunnel models, MEMS sensors can be placed on the surface or in very shallow grooves. MEMS devices have often been fabricated on stiff, flat silicon substrates, about 0.5 mm thick, and therefore were not easily mounted on curved surfaces. However, flexible substrates are now available and heat-flux sensor arrays have been wrapped around a curved turbine blade. Electrical leads can also be built into the flexible substrate. Thus MEMS instrumented wind tunnel models do not require deep spanwise grooves for tubes and leads that compromise the strength of conventionally instrumented models. With MEMS, even the electrical leads can potentially be eliminated if telemetry of the signals to an appropriate receiver can be implemented. While semiconductor silicon is well known for its electronic properties, it is also an excellent mechanical material for MEMS applications. However, silicon electronics are limited to operations below about 200 C, and silicon's mechanical properties start to diminish above 400 C. In recent years, silicon carbide (SiC) has emerged as the leading material candidate for applications in high temperature environments and can be used for high-temperature MEMS applications. With SiC, diodes and more complex electronics have been shown to operate to about 600 C, while the mechanical properties of SiC are maintained to much higher temperatures. Even when MEMS devices show benefits in the laboratory, there are many packaging challenges for any aeronautics application. Incorporating MEMS into these applications requires new approaches to packaging that goes beyond traditional integrated circuit (IC) packaging technologies. MEMS must interact mechanically, as well as electrically with their environment, making most traditional chip packaging and mounting techniques inadequate. Wind tunnels operate over wide temperature ranges in an environment that is far from being a 'clean-room.' In flight, aircraft are exposed to natural elements (e.g. rain, sun, ice, insects and dirt) and operational interferences(e.g. cleaning and deicing fluids, and maintenance crews). In propulsion systems applications, MEMS devices will have to operate in environments containing gases with very high temperatures, abrasive particles and combustion products. Hence deployment and packaging that maintains the integrity of the MEMS system is crucial. This paper presents an overview of MEMS fabrication and materials, descriptions of available sensors with more details on those being developed in our laboratories, and a discussion of sensor deployment options for wind tunnel and flight applications.

Fusion of current technologies with real-time 3D MEMS ladar for novel security and defense applications

NASA Astrophysics Data System (ADS)

Siepmann, James P.

2006-05-01

Through the utilization of scanning MEMS mirrors in ladar devices, a whole new range of potential military, Homeland Security, law enforcement, and civilian applications is now possible. Currently, ladar devices are typically large (>15,000 cc), heavy (>15 kg), and expensive (>$100,000) while current MEMS ladar designs are more than a magnitude less, opening up a myriad of potential new applications. One such application with current technology is a GPS integrated MEMS ladar unit, which could be used for real-time border monitoring or the creation of virtual 3D battlefields after being dropped or propelled into hostile territory. Another current technology that can be integrated into a MEMS ladar unit is digital video that can give high resolution and true color to a picture that is then enhanced with range information in a real-time display format that is easier for the user to understand and assimilate than typical gray-scale or false color images. The problem with using 2-axis MEMS mirrors in ladar devices is that in order to have a resonance frequency capable of practical real-time scanning, they must either be quite small and/or have a low maximum tilt angle. Typically, this value has been less than (< or = to 10 mg-mm2-kHz2)-degrees. We have been able to solve this problem by using angle amplification techniques that utilize a series of MEMS mirrors and/or a specialized set of optics to achieve a broad field of view. These techniques and some of their novel applications mentioned will be explained and discussed herein.

Quasi-Optical Network Analyzers and High-Reliability RF MEMS Switched Capacitors

NASA Astrophysics Data System (ADS)

Grichener, Alexander

The thesis first presents a 2-port quasi-optical scalar network analyzer consisting of a transmitter and receiver both built in planar technology. The network analyzer is based on a Schottky-diode mixer integrated inside a planar antenna and fed differentially by a CPW transmission line. The antenna is placed on an extended hemispherical high-resistivity silicon substrate lens. The LO signal is swept from 3-5 GHz and high-order harmonic mixing in both up- and down- conversion mode is used to realize the 15-50 GHz RF bandwidth. The network analyzer resulted in a dynamic range of greater than 40 dB and was successfully used to measure a frequency selective surface with a second-order bandpass response. Furthermore, the system was built with circuits and components for easy scaling to millimeter-wave frequencies which is the primary motivation for this work. The application areas for a millimeter and submillimeter-wave network analyzer include material characterization and art diagnostics. The second project presents several RF MEMS switched capacitors designed for high-reliability operation and suitable for tunable filters and reconfigurable networks. The first switched-capacitor resulted in a digital capacitance ratio of 5 and an analog capacitance ratio of 5-9. The analog tuning of the down-state capacitance is enhanced by a positive vertical stress gradient in the the beam, making it ideal for applications that require precision tuning. A thick electroplated beam resulted in Q greater than 100 at C to X-band frequencies, and power handling of 0.6-1.1 W. The design also minimized charging in the dielectric, resulting in excellent reliability performance even under hot-switched and high power (1 W) conditions. The second switched-capacitor was designed without any dielectric to minimize charging. The device was hot-switched at 1 W of RF power for greater than 11 billion cycles with virtually no change in the C-V curve. The final project presents a 7-channel channelizer based on the mammalian cochlea. The cochlea is an amazing channelizing filter, covering three decades of bandwidth with over 3,000 channels in a very small physical space. Using a simplified mechanical cochlear model and its electrical analogue, a design method is demonstrated for RF and microwave channelizers that retains the desirable features of the cochlea including the ability to cascade a large number of channels (for multiple-octave frequency coverage), and a high-order stop-band rejection. A 6-pole response is synthesized in each channel using the top-C coupled topology. A constant absolute 3 dB bandwidth of around 4.3 MHz and an insertion loss of around 3.9 dB is measured in each channel. A high isolation (greater than 35 dB) is achieved between adjacent channels. A reflection loss of greater than 15 dB is measured at the input port over the entire channelizer bandwidth. Application areas for the demonstrated channelizer include wideband, contiguous-channel receivers for signal intelligence or spectral analysis.

Investigation into Contact Resistance And Damage of Metal Contacts Used in RF-MEMS Switches

DTIC Science & Technology

2009-09-01

mechanically cycled by a piezo- electric transducer ( PZT ). The resistance through the simulated switch was measured using a four-wire measurement technique...research, including a brief overview of contact theory. Then chapter 3 gives an overview of engi- 13 V I PZT Sample Mount Cantilever Lower Contact...as described in [3, 118]. The measurement of surface texture and 4These figures were published in Materials Selection in Mechanical Design, Michael F

Nanotechnology-Enhanced Lubricants for RF MEMS Switches

DTIC Science & Technology

2011-03-01

and have greater capabilities. 2.1. Problem Background The Air Force employs numerous communication links between space -borne assets, airborne...beyond 10B of rated cold-switched life, such as high-value space -borne assets with 12+ year horizons to deployment. Warm-switched operation refers to...lids for 5 min. at 300W in oxygen 5. Stud bump substrates using a gold- silver alloy wire bonder – packages may be stored 6. Tack seal pre-form to lid

A review: aluminum nitride MEMS contour-mode resonator

NASA Astrophysics Data System (ADS)

Yunhong, Hou; Meng, Zhang; Guowei, Han; Chaowei, Si; Yongmei, Zhao; Jin, Ning

2016-10-01

Over the past several decades, the technology of micro-electromechanical system (MEMS) has advanced. A clear need of miniaturization and integration of electronics components has had new solutions for the next generation of wireless communications. The aluminum nitride (AlN) MEMS contour-mode resonator (CMR) has emerged and become promising and competitive due to the advantages of the small size, high quality factor and frequency, low resistance, compatibility with integrated circuit (IC) technology, and the ability of integrating multi-frequency devices on a single chip. In this article, a comprehensive review of AlN MEMS CMR technology will be presented, including its basic working principle, main structures, fabrication processes, and methods of performance optimization. Among these, the deposition and etching process of the AlN film will be specially emphasized and recent advances in various performance optimization methods of the CMR will be given through specific examples which are mainly focused on temperature compensation and reducing anchor losses. This review will conclude with an assessment of the challenges and future trends of the CMR. Project supported by National Natural Science Foundation (Nos. 61274001, 61234007, 61504130), the Nurturing and Development Special Projects of Beijing Science and Technology Innovation Base's Financial Support (No. Z131103002813070), and the National Defense Science and Technology Innovation Fund of CAS (No. CXJJ-14-M32).

Wafer-level vacuum/hermetic packaging technologies for MEMS

NASA Astrophysics Data System (ADS)

Lee, Sang-Hyun; Mitchell, Jay; Welch, Warren; Lee, Sangwoo; Najafi, Khalil

2010-02-01

An overview of wafer-level packaging technologies developed at the University of Michigan is presented. Two sets of packaging technologies are discussed: (i) a low temperature wafer-level packaging processes for vacuum/hermeticity sealing, and (ii) an environmentally resistant packaging (ERP) technology for thermal and mechanical control as well as vacuum packaging. The low temperature wafer-level encapsulation processes are implemented using solder bond rings which are first patterned on a cap wafer and then mated with a device wafer in order to encircle and encapsulate the device at temperatures ranging from 200 to 390 °C. Vacuum levels below 10 mTorr were achieved with yields in an optimized process of better than 90%. Pressures were monitored for more than 4 years yielding important information on reliability and process control. The ERP adopts an environment isolation platform in the packaging substrate. The isolation platform is designed to provide low power oven-control, vibration isolation and shock protection. It involves batch flip-chip assembly of a MEMS device onto the isolation platform wafer. The MEMS device and isolation structure are encapsulated at the wafer-level by another substrate with vertical feedthroughs for vacuum/hermetic sealing and electrical signal connections. This technology was developed for high performance gyroscopes, but can be applied to any type of MEMS device.

Macro, mini, micro and nano (M(sup 3)N) technologies for the future

NASA Technical Reports Server (NTRS)

Friedrich, Craig R.; Warrington, Robert O.; Gao, Robert X.; Lin, Gang

1993-01-01

Microelectromechanical systems (MEMS), micro systems technologies (MST), and micromanufacturing are relatively recent phrases or acronyms that have become synonymous with the design, development, and manufacture of 'micro' devices and systems. Micromanufacturing encompasses MEMS or MST and, in addition, includes all of the processes involved in the production of micro things. Integration of mechanical and electrical components, including built-in computers, can be formed into systems which must be connected to the macroworld. Macro, mini, micro, and nano technologies are all a part of MEMS or micromanufacturing. At this point in the development of the technology, it is becoming apparent that mini systems, with micro components, could very well be the economic drivers of the technology for the foreseeable future. Initial research in the fabrication of microdevices using IC processing technology took place over thirty years ago. Anisotropic etching of silicon was used to produce piezoresistive diaphragms. Since the early 60's, there has been gradual progress in MEMS until the early 1980's when worldwide interest in the technology really started to develop. During this time high aspect ratio micromachining using x rays was started in Germany. In 1987 the concept of a 'silicon micromechanics foundry' was proposed. Since then the interest in the U.S., Germany, and Japan has increased to the point where hundreds of millions of dollars of research monies are being funneled into the technology (at least in Germany and Japan) and the technology has been classified as critical or as a technology or national importance by the U.S. government.

Reliability enhancement of Ohmic RF MEMS switches

NASA Astrophysics Data System (ADS)

Kurth, Steffen; Leidich, Stefan; Bertz, Andreas; Nowack, Markus; Frömel, Jörg; Kaufmann, Christian; Faust, Wolfgang; Gessner, Thomas; Akiba, Akira; Ikeda, Koichi

2011-02-01

This contribution deals with capacitively actuated Ohmic switches in series single pole single throw (SPST) configuration for DC up to 4 GHz signal frequency (<0.5 dB insertion loss, 35 dB isolation) and in shunt switch SPST configuration for a frequency range from DC up to 80 GHz (<1.2 dB insertion loss, 18 dB isolation at 60 GHz). A novel high aspect ratio MEMS fabrication sequence in combination with wafer level packaging is applied for fabrication of the samples and allows for a relatively large actuation electrode area, and for high actuation force resulting in fast onresponse time of 10 μs and off-response time of 6 μs at less than 5 V actuation voltage. Large actuation electrode area and a particular design feature for electrode over travel and dynamic contact separation lead to high contact force in the closed state and to high force for contact separation to overcome sticking. The switch contacts, which are consisting of noble metal, are made in one of the latest process steps. This minimizes contamination of the contact surfaces by fabrication sequence residuals. A life time of 1 Billion switch cycles has been achieved. This paper covers design for reliability issues and reliability test methods using accelerated life time test. Different test methods are combined to examine electric and mechanical motion parameters as well as RF performance.

BioMEMS and Lab-on-a-Chip Course Education at West Virginia University

PubMed Central

Liu, Yuxin

2011-01-01

With the rapid growth of Biological/Biomedical MicroElectroMechanical Systems (BioMEMS) and microfluidic-based lab-on-a-chip (LOC) technology to biological and biomedical research and applications, demands for educated and trained researchers and technicians in these fields are rapidly expanding. Universities are expected to develop educational plans to address these specialized needs in BioMEMS, microfluidic and LOC science and technology. A course entitled BioMEMS and Lab-on-a-Chip was taught recently at the senior undergraduate and graduate levels in the Department of Computer Science and Electrical Engineering at West Virginia University (WVU). The course focused on the basic principles and applications of BioMEMS and LOC technology to the areas of biomedicine, biology, and biotechnology. The course was well received and the enrolled students had diverse backgrounds in electrical engineering, material science, biology, mechanical engineering, and chemistry. Student feedback and a review of the course evaluations indicated that the course was effective in achieving its objectives. Student presentations at the end of the course were a highlight and a valuable experience for all involved. The course proved successful and will continue to be offered regularly. This paper provides an overview of the course as well as some development and future improvements. PMID:25586697

MEMS scanning micromirror for optical coherence tomography.

PubMed

Strathman, Matthew; Liu, Yunbo; Keeler, Ethan G; Song, Mingli; Baran, Utku; Xi, Jiefeng; Sun, Ming-Ting; Wang, Ruikang; Li, Xingde; Lin, Lih Y

2015-01-01

This paper describes an endoscopic-inspired imaging system employing a micro-electromechanical system (MEMS) micromirror scanner to achieve beam scanning for optical coherence tomography (OCT) imaging. Miniaturization of a scanning mirror using MEMS technology can allow a fully functional imaging probe to be contained in a package sufficiently small for utilization in a working channel of a standard gastroesophageal endoscope. This work employs advanced image processing techniques to enhance the images acquired using the MEMS scanner to correct non-idealities in mirror performance. The experimental results demonstrate the effectiveness of the proposed technique.

MEMS scanning micromirror for optical coherence tomography

PubMed Central

Strathman, Matthew; Liu, Yunbo; Keeler, Ethan G.; Song, Mingli; Baran, Utku; Xi, Jiefeng; Sun, Ming-Ting; Wang, Ruikang; Li, Xingde; Lin, Lih Y.

2014-01-01

This paper describes an endoscopic-inspired imaging system employing a micro-electromechanical system (MEMS) micromirror scanner to achieve beam scanning for optical coherence tomography (OCT) imaging. Miniaturization of a scanning mirror using MEMS technology can allow a fully functional imaging probe to be contained in a package sufficiently small for utilization in a working channel of a standard gastroesophageal endoscope. This work employs advanced image processing techniques to enhance the images acquired using the MEMS scanner to correct non-idealities in mirror performance. The experimental results demonstrate the effectiveness of the proposed technique. PMID:25657887

3D MEMS in Standard Processes: Fabrication, Quality Assurance, and Novel Measurement Microstructures

NASA Technical Reports Server (NTRS)

Lin, Gisela; Lawton, Russell A.

2000-01-01

Three-dimensional MEMS microsystems that are commercially fabricated require minimal post-processing and are easily integrated with CMOS signal processing electronics. Measurements to evaluate the fabrication process (such as cross-sectional imaging and device performance characterization) provide much needed feedback in terms of reliability and quality assurance. MEMS technology is bringing a new class of microscale measurements to fruition. The relatively small size of MEMS microsystems offers the potential for higher fidelity recordings compared to macrosize counterparts, as illustrated in the measurement of muscle cell forces.

Sputtered highly oriented PZT thin films for MEMS applications

NASA Astrophysics Data System (ADS)

Kalpat, Sriram S.

Recently there has been an explosion of interest in the field of micro-electro-mechanical systems (MEMS). MEMS device technology has become critical in the growth of various fields like medical, automotive, chemical, and space technology. Among the many applications of ferroelectric thin films in MEMS devices, microfluidics is a field that has drawn considerable amount of research from bio-technology industries as well as chemical and semiconductor manufacturing industries. PZT thin films have been identified as best suited materials for micro-actuators and micro-sensors used in MEMS devices. A promising application for piezoelectric thin film based MEMS devices is disposable drug delivery systems that are capable of sensing biological parameters, mixing and delivering minute and precise amounts of drugs using micro-pumps or micro mixers. These devices call for low driving voltages, so that they can be battery operated. Improving the performance of the actuator material is critical in achieving battery operated disposal drug delivery systems. The device geometry and power consumption in MEMS devices largely depends upon the piezoelectric constant of the films, since they are most commonly used to convert electrical energy into a mechanical response of a membrane or cantilever and vice versa. Phenomenological calculation on the crystal orientation dependence of piezoelectric coefficients for PZT single crystal have reported a significant enhancement of the piezoelectric d33 constant by more than 3 times along [001] in the rhombohedral phase as compared to the conventionally used orientation PZT(111) since [111] is the along the spontaneous polarization direction. This could mean considerable improvement in the MEMS device performance and help drive the operating voltages lower. The motivation of this study is to investigate the crystal orientation dependence of both dielectric and piezoelectric coefficients of PZT thin films in order to select the appropriate orientation that could improve the MEMS device performance. Potential application of these devices is as battery operated disposable drug delivery systems. This work will also investigate the fabrication of a flexural plate wave based microfluidic device using the PZT thin film of appropriate orientation that would enhance the device performance. (Abstract shortened by UMI.)

Flexible MEMS: A novel technology to fabricate flexible sensors and electronics

NASA Astrophysics Data System (ADS)

Tu, Hongen

This dissertation presents the design and fabrication techniques used to fabricate flexible MEMS (Micro Electro Mechanical Systems) devices. MEMS devices and CMOS(Complementary Metal-Oxide-Semiconductor) circuits are traditionally fabricated on rigid substrates with inorganic semiconductor materials such as Silicon. However, it is highly desirable that functional elements like sensors, actuators or micro fluidic components to be fabricated on flexible substrates for a wide variety of applications. Due to the fact that flexible substrate is temperature sensitive, typically only low temperature materials, such as polymers, metals, and organic semiconductor materials, can be directly fabricated on flexible substrates. A novel technology based on XeF2(xenon difluoride) isotropic silicon etching and parylene conformal coating, which is able to monolithically incorporate high temperature materials and fluidic channels, was developed at Wayne State University. The technology was first implemented in the development of out-of-plane parylene microneedle arrays that can be individually addressed by integrated flexible micro-channels. These devices enable the delivery of chemicals with controlled temporal and spatial patterns and allow us to study neurotransmitter-based retinal prosthesis. The technology was further explored by adopting the conventional SOI-CMOS processes. High performance and high density CMOS circuits can be first fabricated on SOI wafers, and then be integrated into flexible substrates. Flexible p-channel MOSFETs (Metal-Oxide-Semiconductor Field-Effect-Transistors) were successfully integrated and tested. Integration of pressure sensors and flow sensors based on single crystal silicon has also been demonstrated. A novel smart yarn technology that enables the invisible integration of sensors and electronics into fabrics has been developed. The most significant advantage of this technology is its post-MEMS and post-CMOS compatibility. Various high-performance MEMS devices and electronics can be integrated into flexible substrates. The potential of our technology is enormous. Many wearable and implantable devices can be developed based on this technology.

Realization of MEMS-IC Vertical Integration Utilizing Smart Bumpless Bonding

NASA Astrophysics Data System (ADS)

Shiozaki, Masayoshi; Moriguchi, Makoto; Sasaki, Sho; Oba, Masatoshi

This paper reports fundamental technologies, properties, and new experimental results of SBB (Smart Bumpless Bonding) to realize MEMS-IC vertical integration. Although conventional bonding technologies have had difficulties integrating MEMS and its processing circuit because of their rough bonding surfaces, fragile structures, and thermal restriction, SBB technology realized the vertical integration without thermal treatment, any adhesive materials including bumps, and chemical mechanical polishing. The SBB technology bonds sealing parts for vacuum sealing and electrodes for electrical connection simultaneously as published in previous experimental study. The plasma CVD SiO2 is utilized to realize vacuum sealing as sealing material. And Au projection studs are formed on each electrode and connected electrically between two wafers by compressive plastic deformation and surface activation. In this paper, new experimental results including vacuum sealing properties, electrical improvement, IC bonding results on the described fundamental concept and properties are reported.

Liquid Tunable Microlenses based on MEMS techniques

PubMed Central

Zeng, Xuefeng; Jiang, Hongrui

2013-01-01

The recent rapid development in microlens technology has provided many opportunities for miniaturized optical systems, and has found a wide range of applications. Of these microlenses, tunable-focus microlenses are of special interest as their focal lengths can be tuned using micro-scale actuators integrated with the lens structure. Realization of such tunable microlens generally relies on the microelectromechanical system (MEMS) technologies. Here, we review the recent progress in tunable liquid microlenses. The underlying physics relevant to these microlenses are first discussed, followed by description of three main categories of tunable microlenses involving MEMS techniques, mechanically driven, electrically driven, and those integrated within microfluidic systems. PMID:24163480

Multi-scale Modeling and Analysis of Nano-RFID Systems on HPC Setup

NASA Astrophysics Data System (ADS)

Pathak, Rohit; Joshi, Satyadhar

In this paper we have worked out on some the complex modeling aspects such as Multi Scale modeling, MATLAB Sugar based modeling and have shown the complexities involved in the analysis of Nano RFID (Radio Frequency Identification) systems. We have shown the modeling and simulation and demonstrated some novel ideas and library development for Nano RFID. Multi scale modeling plays a very important role in nanotech enabled devices properties of which cannot be explained sometimes by abstraction level theories. Reliability and packaging still remains one the major hindrances in practical implementation of Nano RFID based devices. And to work on them modeling and simulation will play a very important role. CNTs is the future low power material that will replace CMOS and its integration with CMOS, MEMS circuitry will play an important role in realizing the true power in Nano RFID systems. RFID based on innovations in nanotechnology has been shown. MEMS modeling of Antenna, sensors and its integration in the circuitry has been shown. Thus incorporating this we can design a Nano-RFID which can be used in areas like human implantation and complex banking applications. We have proposed modeling of RFID using the concept of multi scale modeling to accurately predict its properties. Also we give the modeling of MEMS devices that are proposed recently that can see possible application in RFID. We have also covered the applications and the advantages of Nano RFID in various areas. RF MEMS has been matured and its devices are being successfully commercialized but taking it to limits of nano domains and integration with singly chip RFID needs a novel approach which is being proposed. We have modeled MEMS based transponder and shown the distribution for multi scale modeling for Nano RFID.

MEMS Deformable Mirror Technology Development for Space-Based Exoplanet Detection

NASA Astrophysics Data System (ADS)

Bierden, Paul; Cornelissen, S.; Ryan, P.

2014-01-01

In the search for earth-like extrasolar planets that has become an important objective for NASA, a critical technology development requirement is to advance deformable mirror (DM) technology. High-actuator-count DMs are critical components for nearly all proposed coronagraph instrument concepts. The science case for exoplanet imaging is strong, and rapid recent advances in test beds with DMs made using microelectromechanical system (MEMS) technology have motivated a number of compelling mission concepts that set technical specifications for their use as wavefront controllers. This research will advance the technology readiness of the MEMS DMs components that are currently at the forefront of the field, and the project will be led by the manufacturer of those components, Boston Micromachines Corporation (BMC). The project aims to demonstrate basic functionality and performance of this key component in critical test environments and in simulated operational environments, while establishing model-based predictions of its performance relative to launch and space environments. Presented will be the current status of the project with modeling and initial test results.

MEMS for Space Flight Applications

NASA Technical Reports Server (NTRS)

Lawton, R.

1998-01-01

Micro-Electrical Mechanical Systems (MEMS) are entering the stage of design and verification to demonstrate the utility of the technology for a wide range of applications including sensors and actuators for military, space, medical, industrial, consumer, automotive and instrumentation products.

SMA Foils for MEMS: From Material Properties to the Engineering of Microdevices

NASA Astrophysics Data System (ADS)

Kohl, Manfred; Ossmer, Hinnerk; Gueltig, Marcel; Megnin, Christof

2018-03-01

In the early nineties, microelectromechanical systems (MEMS) technology has been still in its infancy. As silicon (Si) is not a transducer material, it was clear at the very beginning that mechanically active materials had to be introduced to MEMS in order to enable functional microdevices with actuation capability beyond electrostatics. At that time, shape memory alloys (SMAs) have been available in bulk form, mainly as SMA wires and SMA plates. On the macro scale, these materials show highest work densities compared to other actuation principles in the order of 107 J/m3, which stimulated research on the integration of SMA to MEMS. Subsequently, two approaches for producing planar materials have been initiated (1) magnetron sputtering of SMA thin films and (2) the integration of rolled SMA foils, which both turned out to be very successful creating a paradigm change in microactuation technology. The following review covers important milestones of the research and development of SMA foil-based microactuators including materials characterization, design engineering, technology, and demonstrator development as well as first commercial products.

SMA Foils for MEMS: From Material Properties to the Engineering of Microdevices

NASA Astrophysics Data System (ADS)

Kohl, Manfred; Ossmer, Hinnerk; Gueltig, Marcel; Megnin, Christof

2017-12-01

In the early nineties, microelectromechanical systems (MEMS) technology has been still in its infancy. As silicon (Si) is not a transducer material, it was clear at the very beginning that mechanically active materials had to be introduced to MEMS in order to enable functional microdevices with actuation capability beyond electrostatics. At that time, shape memory alloys (SMAs) have been available in bulk form, mainly as SMA wires and SMA plates. On the macro scale, these materials show highest work densities compared to other actuation principles in the order of 107 J/m3, which stimulated research on the integration of SMA to MEMS. Subsequently, two approaches for producing planar materials have been initiated (1) magnetron sputtering of SMA thin films and (2) the integration of rolled SMA foils, which both turned out to be very successful creating a paradigm change in microactuation technology. The following review covers important milestones of the research and development of SMA foil-based microactuators including materials characterization, design engineering, technology, and demonstrator development as well as first commercial products.

Resonant Magnetic Field Sensors Based On MEMS Technology.

PubMed

Herrera-May, Agustín L; Aguilera-Cortés, Luz A; García-Ramírez, Pedro J; Manjarrez, Elías

2009-01-01

Microelectromechanical systems (MEMS) technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI) and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration.

Resonant Magnetic Field Sensors Based On MEMS Technology

PubMed Central

Herrera-May, Agustín L.; Aguilera-Cortés, Luz A.; García-Ramírez, Pedro J.; Manjarrez, Elías

2009-01-01

Microelectromechanical systems (MEMS) technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI) and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration. PMID:22408480

Thermoelectric microdevice fabricated by a MEMS-like electrochemical process

NASA Technical Reports Server (NTRS)

Snyder, G. Jeffrey; Lim, James R.; Huang, Chen-Kuo; Fleurial, Jean-Pierre

2003-01-01

Microelectromechanical systems (MEMS) are the basis of many rapidly growing technologies, because they combine miniature sensors and actuators with communications and electronics at low cost. Commercial MEMS fabrication processes are limited to silicon-based materials or two-dimensional structures. Here we show an inexpensive, electrochemical technique to build MEMS-like structures that contain several different metals and semiconductors with three-dimensional bridging structures. We demonstrate this technique by building a working microthermoelectric device. Using repeated exposure and development of multiple photoresist layers, several different metals and thermoelectric materials are fabricated in a three-dimensional structure. A device containing 126 n-type and p-type (Bi, Sb)2Te3 thermoelectric elements, 20 microm tall and 60 microm in diameter with bridging metal interconnects, was fabricated and cooling demonstrated. Such a device should be of technological importance for precise thermal control when operating as a cooler, and for portable power when operating as a micro power generator.

A MEMS-based super fast dew point hygrometer—construction and medical applications

NASA Astrophysics Data System (ADS)

Jachowicz, Ryszard S.; Weremczuk, Jerzy; Paczesny, Daniel; Tarapata, Grzegorz

2009-12-01

The paper shows how MEMS (micro-electro-mechanical system) technology and a modified principle of fast temperature control (by heat injection instead of careful control of cooling) can considerably improve the dynamic parameters of dew point hygrometers. Some aspects of MEMS-type integrated sensor construction and technology, whole measurement system design, the control algorithm to run the system as well as empirical dynamic parameters from the tests are discussed too. The hygrometer can easily obtain five to six measurements per second with an uncertainty of less than 0.3 K. The meter range is between -10 °C and 40 °C dew point. In the second part of the paper (section 2), two different successful applications in medicine based on fast humidity measurements have been discussed. Some specific constructions of these super fast dew point hygrometers based on a MEMS sensor as well as limited empirical results from clinical tests have been reported too.

Sensors and Micromachined Devices for the Automotive and New Markets: The Delphi Delco Electronics MEMS Story.

NASA Astrophysics Data System (ADS)

Logsdon, James

2002-03-01

This presentation will provide a brief history of the development of MEMS products and technology, beginning with the manifold absolute pressure sensor in the late seventies through the current variety of Delphi Delco Electronics sensors available today. The technology development of micromachining from uncompensated P plus etch stops to deep reactive ion etching and the technology development of wafer level packaging from electrostatic bonding to glass frit sealing and silicon to silicon direct bonding will be reviewed.

MemFlash device: floating gate transistors as memristive devices for neuromorphic computing

NASA Astrophysics Data System (ADS)

Riggert, C.; Ziegler, M.; Schroeder, D.; Krautschneider, W. H.; Kohlstedt, H.

2014-10-01

Memristive devices are promising candidates for future non-volatile memory applications and mixed-signal circuits. In the field of neuromorphic engineering these devices are especially interesting to emulate neuronal functionality. Therefore, new materials and material combinations are currently investigated, which are often not compatible with Si-technology processes. The underlying mechanisms of the device often remain unclear and are paired with low device endurance and yield. These facts define the current most challenging development tasks towards a reliable memristive device technology. In this respect, the MemFlash concept is of particular interest. A MemFlash device results from a diode configuration wiring scheme of a floating gate transistor, which enables the persistent device resistance to be varied according to the history of the charge flow through the device. In this study, we investigate the scaling conditions of the floating gate oxide thickness with respect to possible applications in the field of neuromorphic engineering. We show that MemFlash cells exhibit essential features with respect to neuromorphic applications. In particular, cells with thin floating gate oxides show a limited synaptic weight growth together with low energy dissipation. MemFlash cells present an attractive alternative for state-of-art memresitive devices. The emulation of associative learning is discussed by implementing a single MemFlash cell in an analogue circuit.

Projection displays and MEMS: timely convergence for a bright future

NASA Astrophysics Data System (ADS)

Hornbeck, Larry J.

1995-09-01

Projection displays and microelectromechanical systems (MEMS) have evolved independently, occasionally crossing paths as early as the 1950s. But the commercially viable use of MEMS for projection displays has been illusive until the recent invention of Texas Instruments Digital Light Processing TM (DLP) technology. DLP technology is based on the Digital Micromirror DeviceTM (DMD) microchip, a MEMS technology that is a semiconductor digital light switch that precisely controls a light source for projection display and hardcopy applications. DLP technology provides a unique business opportunity because of the timely convergence of market needs and technology advances. The world is rapidly moving to an all- digital communications and entertainment infrastructure. In the near future, most of the technologies necessary for this infrastrucutre will be available at the right performance and price levels. This will make commercially viable an all-digital chain (capture, compression, transmission, reception decompression, hearing, and viewing). Unfortunately, the digital images received today must be translated into analog signals for viewing on today's televisions. Digital video is the final link in the all-digital infrastructure and DLP technoogy provides that link. DLP technology is an enabler for digital, high-resolution, color projection displays that have high contrast, are bright, seamless, and have the accuracy of color and grayscale that can be achieved only by digital control. This paper contains an introduction to DMD and DLP technology, including the historical context from which to view their developemnt. The architecture, projection operation, and fabrication are presented. Finally, the paper includes an update about current DMD business opportunities in projection displays and hardcopy.

Characterizing the reliability of a bioMEMS-based cantilever sensor

NASA Astrophysics Data System (ADS)

Bhalerao, Kaustubh D.

2004-12-01

The cantilever-based BioMEMS sensor represents one instance from many competing ideas of biosensor technology based on Micro Electro Mechanical Systems. The advancement of BioMEMS from laboratory-scale experiments to applications in the field will require standardization of their components and manufacturing procedures as well as frameworks to evaluate their performance. Reliability, the likelihood with which a system performs its intended task, is a compact mathematical description of its performance. The mathematical and statistical foundation of systems-reliability has been applied to the cantilever-based BioMEMS sensor. The sensor is designed to detect one aspect of human ovarian cancer, namely the over-expression of the folate receptor surface protein (FR-alpha). Even as the application chosen is clinically motivated, the objective of this study was to demonstrate the underlying systems-based methodology used to design, develop and evaluate the sensor. The framework development can be readily extended to other BioMEMS-based devices for disease detection and will have an impact in the rapidly growing $30 bn industry. The Unified Modeling Language (UML) is a systems-based framework for design and development of object-oriented information systems which has potential application for use in systems designed to interact with biological environments. The UML has been used to abstract and describe the application of the biosensor, to identify key components of the biosensor, and the technology needed to link them together in a coherent manner. The use of the framework is also demonstrated in computation of system reliability from first principles as a function of the structure and materials of the biosensor. The outcomes of applying the systems-based framework to the study are the following: (1) Characterizing the cantilever-based MEMS device for disease (cell) detection. (2) Development of a novel chemical interface between the analyte and the sensor that provides a degree of selectivity towards the disease. (3) Demonstrating the performance and measuring the reliability of the biosensor prototype, and (4) Identification of opportunities in technological development in order to further refine the proposed biosensor. Application of the methodology to design develop and evaluate the reliability of BioMEMS devices will be beneficial in the streamlining the growth of the BioMEMS industry, while providing a decision-support tool in comparing and adopting suitable technologies from available competing options.

CNES reliability approach for the qualification of MEMS for space

NASA Astrophysics Data System (ADS)

Pressecq, Francis; Lafontan, Xavier; Perez, Guy; Fortea, Jean-Pierre

2001-10-01

This paper describes the reliability approach performs at CNES to evaluate MEMS for space application. After an introduction and a detailed state of the art on the space requirements and on the use of MEMS for space, different approaches for taking into account MEMS in the qualification phases are presented. CNES proposes improvement to theses approaches in term of failure mechanisms identification. Our approach is based on a design and test phase deeply linked with a technology study. This workflow is illustrated with an example: the case of a variable capacitance processed with MUMPS process is presented.

The radiofrequency frontier: a review of radiofrequency and combined radiofrequency pulsed-light technology in aesthetic medicine.

PubMed

Sadick, Neil; Sorhaindo, Lian

2005-05-01

Radiofrequency (RF) and combined RF light source technologies have established themselves as safe and effective treatment modalities for several dermatologic procedures, including skin tightening, hair and leg vein removal, acne scarring, skin rejuvenation, and wrinkle reduction. This article reviews the technology, clinical applications, and recent advances of RF and combined RF light/laser source technologies in aesthetic medicine.

DMD: a digital light processing application to projection displays

NASA Astrophysics Data System (ADS)

Feather, Gary A.

1989-01-01

Summary Revolutionary technologies achieve rapid product and subsequent business diffusion only when the in- ventors focus on technology application, maturation, and proliferation. A revolutionary technology is emerg- ing with micro-electromechanical systems (MEMS). MEMS are being developed by leveraging mature semi- conductor processing coupled with mechanical systems into complete, integrated, useful systems. The digital micromirror device (DMD), a Texas Instruments invented MEMS, has focused on its application to projec- tion displays. The DMD has demonstrated its application as a digital light processor, processing and produc- ing compelling computer and video projection displays. This tutorial discusses requirements in the projection display market and the potential solutions offered by this digital light processing system. The seminar in- cludes an evaluation of the market, system needs, design, fabrication, application, and performance results of a system using digital light processing solutions.

System Modeling of a MEMS Vibratory Gyroscope and Integration to Circuit Simulation.

PubMed

Kwon, Hyukjin J; Seok, Seyeong; Lim, Geunbae

2017-11-18

Recently, consumer applications have dramatically created the demand for low-cost and compact gyroscopes. Therefore, on the basis of microelectromechanical systems (MEMS) technology, many gyroscopes have been developed and successfully commercialized. A MEMS gyroscope consists of a MEMS device and an electrical circuit for self-oscillation and angular-rate detection. Since the MEMS device and circuit are interactively related, the entire system should be analyzed together to design or test the gyroscope. In this study, a MEMS vibratory gyroscope is analyzed based on the system dynamic modeling; thus, it can be mathematically expressed and integrated into a circuit simulator. A behavioral simulation of the entire system was conducted to prove the self-oscillation and angular-rate detection and to determine the circuit parameters to be optimized. From the simulation, the operating characteristic according to the vacuum pressure and scale factor was obtained, which indicated similar trends compared with those of the experimental results. The simulation method presented in this paper can be generalized to a wide range of MEMS devices.

Dynamic metasurface lens based on MEMS technology

NASA Astrophysics Data System (ADS)

Roy, Tapashree; Zhang, Shuyan; Jung, Il Woong; Troccoli, Mariano; Capasso, Federico; Lopez, Daniel

2018-02-01

In the recent years, metasurfaces, being flat and lightweight, have been designed to replace bulky optical components with various functions. We demonstrate a monolithic Micro-Electro-Mechanical System (MEMS) integrated with a metasurface-based flat lens that focuses light in the mid-infrared spectrum. A two-dimensional scanning MEMS platform controls the angle of the lens along two orthogonal axes by ±9°, thus enabling dynamic beam steering. The device could be used to compensate for off-axis incident light and thus correct for aberrations such as coma. We show that for low angular displacements, the integrated lens-on-MEMS system does not affect the mechanical performance of the MEMS actuators and preserves the focused beam profile as well as the measured full width at half maximum. We envision a new class of flat optical devices with active control provided by the combination of metasurfaces and MEMS for a wide range of applications, such as miniaturized MEMS-based microscope systems, LIDAR scanners, and projection systems.

Controlling Variable Emittance (MEMS) Coatings for Space Applications

NASA Technical Reports Server (NTRS)

Farrar, D.; Schneider, W.; Osiander, R.; Champion, J. L.; Darrin, A. G.; Douglas, Donya; Swanson, Ted D.

2003-01-01

Small spacecraft, including micro and nanosats, as they are envisioned for future missions, will require an alternative means to achieve thermal control due to their small power and mass budgets. One of the proposed alternatives is Variable Emittance (Vari-E) Coatings for spacecraft radiators. Space Technology-5 (ST-5) is a technology demonstration mission through NASA Goddard Space Flight Center (GSFC) that will utilize Vari-E Coatings. This mission involves a constellation of three (3) satellites in a highly elliptical orbit with a perigee altitude of approximately 200 kilometers and an apogee of approximately 38,000 kilometers. Such an environment will expose the spacecraft to a wide swing in the thermal and radiation environment of the earth's atmosphere. There are three (3) different technologies associated with this mission. The three technologies are electrophoretic, electrochromic, and Micro ElectroMechanical Systems (MEMS). The ultimate goal is to make use of Van-E coatings, in order to achieve various levels of thermal control. The focus of this paper is to highlight the Vari-E Coating MEMS instrument, with an emphasis on the Electronic Control Unit responsible for operating the MEMS device. The Test & Evaluation approach, along with the results, is specific for application on ST-5, yet the information provides a guideline for future experiments and/or thermal applications on the exterior structure of a spacecraft.

BioMEMS –Advancing the Frontiers of Medicine

PubMed Central

James, Teena; Mannoor, Manu Sebastian; Ivanov, Dentcho V.

2008-01-01

Biological and medical application of micro-electro-mechanical-systems (MEMS) is currently seen as an area of high potential impact. Integration of biology and microtechnology has resulted in the development of a number of platforms for improving biomedical and pharmaceutical technologies. This review provides a general overview of the applications and the opportunities presented by MEMS in medicine by classifying these platforms according to their applications in the medical field. PMID:27873858

Dual Mode Thin Film Bulk Acoustic Resonators (FBARs) Based on AlN, ZnO and GaN Films with Tilted c-Axis Orientation

DTIC Science & Technology

2010-01-01

TERMS MEMS , acoustic wave devices, acoustic wave sensors Qing-Ming Wang University of Pittsburgh 123 University Place University Club Pittsburgh, PA...resonators,” Proc. SPIE Vol. 6223, 62230I, Micro ( MEMS ) and Nanotechnologies for Space Applications; Thomas George, Zhong-Yang Cheng; Eds. (May...microelectromechanical resonators has been recognized as a technological challenge in the current microelectronics and MEMS development. The

New-generation radiofrequency technology.

PubMed

Krueger, Nils; Sadick, Neil S

2013-01-01

Radiofrequency (RF) technology has become a standard treatment in aesthetic medicine with many indications due to its versatility, efficacy, and safety. It is used worldwide for cellulite reduction; acne scar revision; and treatment of hypertrophic scars and keloids, rosacea, and inflammatory acne in all skin types. However, the most common indication for RF technology is the nonablative tightening of tissue to improve skin laxity and reduce wrinkles. Radiofrequency devices are classified as unipolar, bipolar, or multipolar depending on the number of electrodes used. Additional modalities include fractional RF; sublative RF; phase-controlled RF; and combination RF therapies that apply light, massage, or pulsed electromagnetic fields (PEMFs). This article reviews studies and case series on these devices. Radiofrequency technology for aesthetic medicine has seen rapid advancements since it was used for skin tightening in 2003. Future developments will continue to keep RF technology at the forefront of the dermatologist's armamentarium for skin tightening and rejuvenation.

Calibration of High Frequency MEMS Microphones

NASA Technical Reports Server (NTRS)

Shams, Qamar A.; Humphreys, William M.; Bartram, Scott M.; Zuckewar, Allan J.

2007-01-01

Understanding and controlling aircraft noise is one of the major research topics of the NASA Fundamental Aeronautics Program. One of the measurement technologies used to acquire noise data is the microphone directional array (DA). Traditional direction array hardware, consisting of commercially available condenser microphones and preamplifiers can be too expensive and their installation in hard-walled wind tunnel test sections too complicated. An emerging micro-machining technology coupled with the latest cutting edge technologies for smaller and faster systems have opened the way for development of MEMS microphones. The MEMS microphone devices are available in the market but suffer from certain important shortcomings. Based on early experiments with array prototypes, it has been found that both the bandwidth and the sound pressure level dynamic range of the microphones should be increased significantly to improve the performance and flexibility of the overall array. Thus, in collaboration with an outside MEMS design vendor, NASA Langley modified commercially available MEMS microphone as shown in Figure 1 to meet the new requirements. Coupled with the design of the enhanced MEMS microphones was the development of a new calibration method for simultaneously obtaining the sensitivity and phase response of the devices over their entire broadband frequency range. Over the years, several methods have been used for microphone calibration. Some of the common methods of microphone calibration are Coupler (Reciprocity, Substitution, and Simultaneous), Pistonphone, Electrostatic actuator, and Free-field calibration (Reciprocity, Substitution, and Simultaneous). Traditionally, electrostatic actuators (EA) have been used to characterize air-condenser microphones for wideband frequency ranges; however, MEMS microphones are not adaptable to the EA method due to their construction and very small diaphragm size. Hence a substitution-based, free-field method was developed to calibrate these microphones at frequencies up to 80 kHz. The technique relied on the use of a random, ultrasonic broadband centrifugal sound source located in a small anechoic chamber. Phase calibrations of the MEMS microphones were derived from cross spectral phase comparisons between the reference and test substitution microphones and an adjacent and invariant grazing-incidence 1/8-inch standard microphone.

GaAs MOEMS Technology

DOE Office of Scientific and Technical Information (OSTI.GOV)

SPAHN, OLGA B.; GROSSETETE, GRANT D.; CICH, MICHAEL J.

2003-03-01

Many MEMS-based components require optical monitoring techniques using optoelectronic devices for converting mechanical position information into useful electronic signals. While the constituent piece-parts of such hybrid opto-MEMS components can be separately optimized, the resulting component performance, size, ruggedness and cost are substantially compromised due to assembly and packaging limitations. GaAs MOEMS offers the possibility of monolithically integrating high-performance optoelectronics with simple mechanical structures built in very low-stress epitaxial layers with a resulting component performance determined only by GaAs microfabrication technology limitations. GaAs MOEMS implicitly integrates the capability for radiation-hardened optical communications into the MEMS sensor or actuator component, a vitalmore » step towards rugged integrated autonomous microsystems that sense, act, and communicate. This project establishes a new foundational technology that monolithically combines GaAs optoelectronics with simple mechanics. Critical process issues addressed include selectivity, electrochemical characteristics, and anisotropy of the release chemistry, and post-release drying and coating processes. Several types of devices incorporating this novel technology are demonstrated.« less

Integrated MEMS-tunable VCSELs for reconfigurable optical interconnects

NASA Astrophysics Data System (ADS)

Kögel, Benjamin; Debernardi, Pierluigi; Westbergh, Petter; Gustavsson, Johan S.; Haglund, Åsa; Haglund, Erik; Bengtsson, Jörgen; Larsson, Anders

2012-03-01

A simple and low-cost technology for tunable vertical-cavity surface-emitting lasers (VCSELs) with curved movable micromirror is presented. The micro-electro-mechanical system (MEMS) is integrated with the active optical component (so-called half-VCSEL) by means of surface-micromachining using a reflown photoresist droplet as sacrificial layer. The technology is demonstrated for electrically pumped, short-wavelength (850 nm) tunable VCSELs. Fabricated devices with 10 μm oxide aperture are singlemode with sidemode suppression >35 dB, tunable over 24 nm with output power up to 0.5mW, and have a beam divergence angle <6 °. An improved high-speed design with reduced parasitic capacitance enables direct modulation with 3dB-bandwidths up to 6GHz and error-free data transmission at 5Gbit/s. The modulation response of the MEMS under electrothermal actuation has a bandwidth of 400 Hz corresponding to switching times of about 10ms. The thermal crosstalk between MEMS and half-VCSEL is negligible and not degrading the device performance. With these characteristics the integrated MEMS-tunable VCSELs are basically suitable for use in reconfigurable optical interconnects and ready for test in a prototype system. Schemes for improving output power, tuning speed, and modulation bandwidth are briefly discussed.

MEMS Louvers for Thermal Control

NASA Technical Reports Server (NTRS)

Champion, J. L.; Osiander, R.; Darrin, M. A. Garrison; Swanson, T. D.

1998-01-01

Mechanical louvers have frequently been used for spacecraft and instrument thermal control purposes. These devices typically consist of parallel or radial vanes, which can be opened or closed to vary the effective emissivity of the underlying surface. This project demonstrates the feasibility of using Micro-Electromechanical Systems (MEMS) technology to miniaturize louvers for such purposes. This concept offers the possibility of substituting the smaller, lighter weight, more rugged, and less costly MEMS devices for such mechanical louvers. In effect, a smart skin that self adjusts in response to environmental influences could be developed composed of arrays of thousands of miniaturized louvers. Several orders of magnitude size, weight, and volume decreases are potentially achieved using micro-electromechanical techniques. The use of this technology offers substantial benefits in spacecraft/instrument design, integration and testing, and flight operations. It will be particularly beneficial for the emerging smaller spacecraft and instruments of the future. In addition, this MEMS thermal louver technology can form the basis for related spacecraft instrument applications. The specific goal of this effort was to develop a preliminary MEMS device capable of modulating the effective emissivity of radiators on spacecraft. The concept pursued uses hinged panels, or louvers, in a manner such that heat emitted from the radiators is a function of louver angle. An electrostatic comb drive or other such actuator can control the louver position. The initial design calls for the louvers to be gold coated while the underlying surface is of high emissivity. Since, the base MEMS material, silicon, is transparent in the InfraRed (IR) spectrum, the device has a minimum emissivity when closed and a maximum emissivity when open. An initial set of polysilicon louver devices was designed at the Johns Hopkins Applied Physics Laboratory in conjunction with the Thermal Engineering Branch at NASA's Goddard Space Flight Center.

From magic to technology: materials integration by wafer bonding

NASA Astrophysics Data System (ADS)

Dragoi, Viorel

2006-02-01

Wafer bonding became in the last decade a very powerful technology for MEMS/MOEMS manufacturing. Being able to offer a solution to overcome some problems of the standard processes used for materials integration (e.g. epitaxy, thin films deposition), wafer bonding is nowadays considered an important item in the MEMS engineer toolbox. Different principles governing the wafer bonding processes will be reviewed in this paper. Various types of applications will be presented as examples.

MEMS for optical switching: technologies, applications, and perspectives

NASA Astrophysics Data System (ADS)

Lin, Lih-Y.; Goldstein, Evan L.

1999-09-01

Micro-electro-mechanical-systems (MEMS), due to their unique ability to integrate electrical, mechanical, and optical elements on a single chip, have recently begun to exhibit great potential for realizing optical components and subsystems in compact, lowcost form. Recently, this technology has been applied to wavelength-division-multiplexed (WDM) networks, and resulted in advances in several network elements, including switches, filters, modulators, and wavelength-add/drop multiplexers. Due largely to the exploding capacity demand arising from data traffic, the transmission capacity demanded of and available from WDM networks is anticipated to increase rapidly. For managing such networks, optical switching is of particular interest due to the fact that its complexity is essentially immune to steady advances in the per-channel bit-rate. We will review various micromachined optical-switching technologies, emphasizing studies of their reliability. We then summarizing recent progress in the free-space MEMS optical switch we have demonstrated.

MEMS for optical switching: technologies, applications, and perspectives

NASA Astrophysics Data System (ADS)

Lin, Lih-Yuan; Goldstein, Evan L.

1999-09-01

Micro-electro-mechanical-systems (MEMS), due to their unique ability to integrate electrical, mechanical, and optical elements on a single chip, have recently begun to exhibit great potential for realizing optical components and subsystems in compact, low-cost form. Recently, this technology has been applied to wavelength-division-multiplexed (WDM) networks, and resulted in advances in several network elements, including switches, filters, modulators, and wavelength-add/drop multiplexers. Due largely to the exploding capacity demand arising from data traffic, the transmission capacity demanded of and available from WDM networks is anticipated to increase rapidly. For managing such networks, optical switching is of particular interest due to the fact that its complexity is essentially immune to steady advances in the per-channel bit-rate. We will review various micromachined optical-switching technologies, emphasizing studies of their reliability. We then summarizing recent progress in the free-space MEMS optical switch we have demonstrated.

On-Orbit, Immuno-Based, Label-Free White Blood Cell Counting System with Microelectromechanical Sensor Technology (OILWBCS-MEMS)

NASA Technical Reports Server (NTRS)

Edmonds, Jessica

2015-01-01

Aurora Flight Sciences, in partnership with Draper Laboratory, has developed a miniaturized system to count white blood cells in microgravity environments. The system uses MEMS technology to simultaneously count total white blood cells, the five white blood cell differential subgroups, and various lymphocyte subtypes. The OILWBCS-MEMS detection technology works by immobilizing an array of white blood cell-specific antibodies on small, gold-coated membranes. When blood flows across the membranes, specific cells' surface protein antigens bind to their corresponding antibodies. This binding can be measured and correlated to cell counts. In Phase I, the partners demonstrated surface chemistry sensitivity and specificity for total white blood cells and two lymphocyte subtypes. In Phase II, a functional prototype demonstrated end-to-end operation. This rugged, miniaturized device requires minimal blood sample preparation and will be useful for both space flight and terrestrial applications.

MEMS-Based Flexible Force Sensor for Tri-Axial Catheter Contact Force Measurement

PubMed Central

Sheng, Jun; Desai, Jaydev P.

2016-01-01

Atrial fibrillation (AFib) is a significant healthcare problem caused by the uneven and rapid discharge of electrical signals from pulmonary veins (PVs). The technique of radiofrequency (RF) ablation can block these abnormal electrical signals by ablating myocardial sleeves inside PVs. Catheter contact force measurement during RF ablation can reduce the rate of AFib recurrence, since it helps to determine effective contact of the catheter with the tissue, thereby resulting in effective power delivery for ablation. This paper presents the development of a three-dimensional (3D) force sensor to provide the real-time measurement of tri-axial catheter contact force. The 3D force sensor consists of a plastic cubic bead and five flexible force sensors. Each flexible force sensor was made of a PEDOT:PSS strain gauge and a PDMS bump on a flexible PDMS substrate. Calibration results show that the fabricated sensor has a linear response in the force range required for RF ablation. To evaluate its working performance, the fabricated sensor was pressed against gelatin tissue by a micromanipulator and also integrated on a catheter tip to test it within deionized water flow. Both experiments simulated the ventricular environment and proved the validity of applying the 3D force sensor in RF ablation. PMID:28190945

Localized heating/bonding techniques in MEMS packaging

NASA Astrophysics Data System (ADS)

Mabesa, J. R., Jr.; Scott, A. J.; Wu, X.; Auner, G. W.

2005-05-01

Packaging is used to protect and enable intelligent sensor systems utilized in manned/unmanned ground vehicle systems/subsystems. Because Micro electro mechanical systems (MEMS) are used often in these sensor or actuation products, it must interact with the surrounding environment, which may be in direct conflict with the desire to isolate the electronics for improved reliability/durability performance. For some very simple devices, performance requirements may allow a high degree of isolation from the environment (e.g., stints and accelerometers). Other more complex devices (i.e. chemical and biological analysis systems, particularly in vivo systems) present extremely complex packaging requirements. Power and communications to MEMS device arrays are also extremely problematic. The following describes the research being performed at the U.S. Army Research, Development, and Engineering Command (RDECOM) Tank and Automotive Research, Development, and Engineering Center (TARDEC), in collaboration with Wayne State University, in Detroit, MI. The focus of the packaging research is limited to six main categories: a) provision for feed-through for electrical, optical, thermal, and fluidic interfaces; b) environmental management including atmosphere, hermiticity, and temperature; c) control of stress and mechanical durability; d) management of thermal properties to minimize absorption and/or emission; e) durability and structural integrity; and f) management of RF/magnetic/electrical and optical interference and/or radiation properties and exposure.

Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors

PubMed Central

Hera, Daniel; Berndt, Armin; Günther, Thomas; Schmiel, Stephan; Harendt, Christine; Zimmermann, André

2017-01-01

Packaging represents an important part in the microintegration of sensors based on microelectromechanical system (MEMS). Besides miniaturization and integration density, functionality and reliability in combination with flexibility in packaging design at moderate costs and consequently high-mix, low-volume production are the main requirements for future solutions in packaging. This study investigates possibilities employing printed circuit board (PCB-)based assemblies to provide high flexibility for circuit designs together with film-assisted transfer molding (FAM) to package sensors. The feasibility of FAM in combination with PCB and MEMS as a packaging technology for highly sensitive inertia sensors is being demonstrated. The results prove the technology to be a viable method for damage-free packaging of stress- and pressure-sensitive MEMS. PMID:28653992

Design, Simulation and Fabrication of Triaxial MEMS High Shock Accelerometer.

PubMed

Zhang, Zhenhai; Shi, Zhiguo; Yang, Zhan; Xie, Zhihong; Zhang, Donghong; Cai, De; Li, Kejie; Shen, Yajing

2015-04-01

On the basis of analyzing the disadvantage of other structural accelerometer, three-axis high g MEMS piezoresistive accelerometer was put forward in order to apply to the high-shock test field. The accelerometer's structure and working principle were discussed in details. The simulation results show that three-axis high shock MEMS accelerometer can bear high shock. After bearing high shock impact in high-shock shooting test, three-axis high shock MEMS accelerometer can obtain the intact metrical information of the penetration process and still guarantee the accurate precision of measurement in high shock load range, so we can not only analyze the law of stress wave spreading and the penetration rule of the penetration process of the body of the missile, but also furnish the testing technology of the burst point controlling. The accelerometer has far-ranging application in recording the typical data that projectile penetrating hard target and furnish both technology guarantees for penetration rule and defend engineering.

MEMS-based thin-film fuel cells

DOEpatents

Jankowksi, Alan F.; Morse, Jeffrey D.

2003-10-28

A micro-electro-mechanical systems (MEMS) based thin-film fuel cells for electrical power applications. The MEMS-based fuel cell may be of a solid oxide type (SOFC), a solid polymer type (SPFC), or a proton exchange membrane type (PEMFC), and each fuel cell basically consists of an anode and a cathode separated by an electrolyte layer. Additionally catalyst layers can also separate the electrodes (cathode and anode) from the electrolyte. Gas manifolds are utilized to transport the fuel and oxidant to each cell and provide a path for exhaust gases. The electrical current generated from each cell is drawn away with an interconnect and support structure integrated with the gas manifold. The fuel cells utilize integrated resistive heaters for efficient heating of the materials. By combining MEMS technology with thin-film deposition technology, thin-film fuel cells having microflow channels and full-integrated circuitry can be produced that will lower the operating temperature an will yield an order of magnitude greater power density than the currently known fuel cells.

Stability, Nonlinearity and Reliability of Electrostatically Actuated MEMS Devices

PubMed Central

Zhang, Wen-Ming; Meng, Guang; Chen, Di

2007-01-01

Electrostatic micro-electro-mechanical system (MEMS) is a special branch with a wide range of applications in sensing and actuating devices in MEMS. This paper provides a survey and analysis of the electrostatic force of importance in MEMS, its physical model, scaling effect, stability, nonlinearity and reliability in detail. It is necessary to understand the effects of electrostatic forces in MEMS and then many phenomena of practical importance, such as pull-in instability and the effects of effective stiffness, dielectric charging, stress gradient, temperature on the pull-in voltage, nonlinear dynamic effects and reliability due to electrostatic forces occurred in MEMS can be explained scientifically, and consequently the great potential of MEMS technology could be explored effectively and utilized optimally. A simplified parallel-plate capacitor model is proposed to investigate the resonance response, inherent nonlinearity, stiffness softened effect and coupled nonlinear effect of the typical electrostatically actuated MEMS devices. Many failure modes and mechanisms and various methods and techniques, including materials selection, reasonable design and extending the controllable travel range used to analyze and reduce the failures are discussed in the electrostatically actuated MEMS devices. Numerical simulations and discussions indicate that the effects of instability, nonlinear characteristics and reliability subjected to electrostatic forces cannot be ignored and are in need of further investigation.

Advanced Refrigerator/Freezer Technology Development. Technology Assessment

NASA Technical Reports Server (NTRS)

Gaseor, Thomas; Hunter, Rick; Hamill, Doris

1996-01-01

The NASA Lewis Research Center, through contract with Oceaneering Space Systems, is engaged in a project to develop advanced refrigerator/freezer (R/F) technologies for future Life and Biomedical Sciences space flight missions. The first phase of this project, a technology assessment, has been completed to identify the advanced R/F technologies needed and best suited to meet the requirements for the five R/F classifications specified by Life and Biomedical Science researchers. Additional objectives of the technology assessment were to rank those technologies based on benefit and risk, and to recommend technology development activities that can be accomplished within this project. This report presents the basis, the methodology, and results of the R/F technology assessment, along with technology development recommendations.

Special Technology Area Review on Vacuum Electronics Technology for RF Applications

DTIC Science & Technology

2000-12-12

systems. QUESTIONS TO BE ADDRESSED AT THE STAR: 1. What are the RF applications and systems that will benefit from advances in Vacuum Electronic...technologies? What are the status and prospects of early insertion efforts? What is the impact if technology efforts are successful? 2. What are the RF...technical barriers best addressed by Vacuum Electronic technologies? What are the technology advancement needs and opportunities? Can the barriers

Human Pulse Wave Measurement by MEMS Electret Condenser Microphone

NASA Astrophysics Data System (ADS)

Nomura, Shusaku; Hanasaka, Yasushi; Ishiguro, Tadashi; Ogawa, Hiroshi

A micro Electret Condenser Microphone (ECM) fabricated by Micro Electro Mechanical System (MEMS) technology was employed as a novel apparatus for human pulse wave measurement. Since ECM frequency response characteristic, i.e. sensitivity, logically maintains a constant level at lower than the resonance frequency (stiffness control), the slightest pressure difference at around 1.0Hz generated by human pulse wave is expected to detect by MEMS-ECM. As a result of the verification of frequency response of MEMS-ECM, it was found that -20dB/dec of reduction in the sensitivity around 1.0Hz was engendered by a high input-impedance amplifier, i.e. the field effect transistor (FET), mounted near MEMS chip for amplifying tiny ECM signal. Therefore, MEMS-ECM is assumed to be equivalent with a differentiation circuit at around human pulse frequency. Introducing compensation circuit, human pulse wave was successfully obtained. In addition, the radial and ulnar artery tracing, and pulse wave velocity measurement at forearm were demonstrated; as illustrating a possible application of this micro device.

Fabrication and analysis of radiofrequency MEMS series capacitive single-pole double-throw switch

NASA Astrophysics Data System (ADS)

Bansal, Deepak; Bajpai, Anuroop; Kumar, Prem; Kaur, Maninder; Rangra, Kamaljit

2016-10-01

A compact radiofrequency (RF) MEMS single-pole double-throw (SPDT) switch based on series capacitive configuration is proposed. The critical process parameters are analyzed to improve the fabrication process. A technique of cold-hot thermal shock for lift-off method is explored. The residual stress in the structure is quantified by lancet test structures that come out to be 51 MPa. Effect of residual stress on actuation voltage is explored, which changes its value from 24 to 22 V. Resonance frequency and switching speed of the switch are 11 kHz and 44 μs, respectively, measured using laser Doppler vibrometer. Measured bandwidth of the SPDT switch is 20 GHz (5 to 25 GHz), which is verified with finite element method simulations in high frequency structure simulator©; and an equivalent LCR circuit in advanced design system©;. Insertion loss of the switch lies in -0.1 to -0.5 dB with isolation better than -20 dB for the above-mentioned bandwidth.

A low power, on demand electrothermal valve for wireless drug delivery applications

PubMed Central

Li, Po-Ying; Givrad, Tina K.; Sheybani, Roya; Holschneider, Daniel P.; Maarek, Jean-Michel I.

2014-01-01

We present a low power, on demand Parylene MEMS electrothermal valve. A novel Ω-shaped thermal resistive element requires low power (~mW) and enables rapid valve opening (~ms). Using both finite element analysis and valve opening experiments, a robust resistive element design for improved valve opening performance in water was obtained. In addition, a thermistor, as an inrush current limiter, was added into the valve circuit to provide variable current ramping. Wireless activation of the valve using RF inductive power transfer was demonstrated. PMID:20024057

RF to millimeter wave integration and module technologies

NASA Astrophysics Data System (ADS)

Vähä-Heikkilä, T.

2015-04-01

Radio Frequency (RF) consumer applications have boosted silicon integrated circuits (IC) and corresponding technologies. More and more functions are integrated to ICs and their performance is also increasing. However, RF front-end modules with filters and switches as well as antennas still need other way of integration. This paper focuses to RF front-end module and antenna developments as well as to the integration of millimeter wave radios. VTT Technical Research Centre of Finland has developed both Low Temperature Co-fired Ceramics (LTCC) and Integrated Passive Devices (IPD) integration platforms for RF and millimeter wave integrated modules. In addition to in-house technologies, VTT is using module and component technologies from other commercial sources.

Analog Techniques in CEBAF's RF Control System

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hovater, J.; Fugitt, Jock

1988-01-01

Recent developments in high-speed analog technology have progressed into the areas of traditional RF technology.Diode-related devices are being replaced by analog IC's in the CEBAF RF control system.Complex phase modulators and attenuators have been successfully tested at 70 MHz.They have three advantages over existing technology: lower cost, less temperature sensitivity, and more linearity.RF signal conditioning components and how to implement the new analog IC's will be covered in this paper.

Haptic Technologies for MEMS Design

NASA Astrophysics Data System (ADS)

Calis, Mustafa; Desmulliez, Marc P. Y.

2006-04-01

This paper presents for the first time a design methodology for MEMS/NEMS based on haptic sensing technologies. The software tool created as a result of this methodology will enable designers to model and interact in real time with their virtual prototype. One of the main advantages of haptic sensing is the ability to bring unusual microscopic forces back to the designer's world. Other significant benefits for developing such a methodology include gain productivity and the capability to include manufacturing costs within the design cycle.

Novel analytical model for optimizing the pull-in voltage in a flexured MEMS switch incorporating beam perforation effect

NASA Astrophysics Data System (ADS)

Guha, K.; Laskar, N. M.; Gogoi, H. J.; Borah, A. K.; Baishnab, K. L.; Baishya, S.

2017-11-01

This paper presents a new method for the design, modelling and optimization of a uniform serpentine meander based MEMS shunt capacitive switch with perforation on upper beam. The new approach is proposed to improve the Pull-in Voltage performance in a MEMS switch. First a new analytical model of the Pull-in Voltage is proposed using the modified Mejis-Fokkema capacitance model taking care of the nonlinear electrostatic force, the fringing field effect due to beam thickness and etched holes on the beam simultaneously followed by the validation of same with the simulated results of benchmark full 3D FEM solver CoventorWare in a wide range of structural parameter variations. It shows a good agreement with the simulated results. Secondly, an optimization method is presented to determine the optimum configuration of switch for achieving minimum Pull-in voltage considering the proposed analytical mode as objective function. Some high performance Evolutionary Optimization Algorithms have been utilized to obtain the optimum dimensions with less computational cost and complexity. Upon comparing the applied algorithms between each other, the Dragonfly Algorithm is found to be most suitable in terms of minimum Pull-in voltage and higher convergence speed. Optimized values are validated against the simulated results of CoventorWare which shows a very satisfactory results with a small deviation of 0.223 V. In addition to these, the paper proposes, for the first time, a novel algorithmic approach for uniform arrangement of square holes in a given beam area of RF MEMS switch for perforation. The algorithm dynamically accommodates all the square holes within a given beam area such that the maximum space is utilized. This automated arrangement of perforation holes will further improve the computational complexity and design accuracy of the complex design of perforated MEMS switch.

Wearable Wireless Telemetry System for Implantable BioMEMS Sensors

NASA Technical Reports Server (NTRS)

Simons, Rainee N.; Miranda, Felix A.; Wilson, Jeffrey D.; Simons, Renita E.

2008-01-01

Telemetry systems of a type that have been proposed for the monitoring of physiological functions in humans would include the following subsystems: Surgically implanted or ingested units that would comprise combinations of microelectromechanical systems (MEMS)- based sensors [bioMEMS sensors] and passive radio-frequency (RF) readout circuits that would include miniature loop antennas. Compact radio transceiver units integrated into external garments for wirelessly powering and interrogating the implanted or ingested units. The basic principles of operation of these systems are the same as those of the bioMEMS-sensor-unit/external-RFpowering- and-interrogating-unit systems described in "Printed Multi-Turn Loop Antennas for Biotelemetry" (LEW-17879-1) NASA Tech Briefs, Vol. 31, No. 6 (June 2007), page 48, and in the immediately preceding article, "Hand-Held Units for Short-Range Wireless Biotelemetry" (LEW-17483-1). The differences between what is reported here and what was reported in the cited prior articles lie in proposed design features and a proposed mode of operation. In a specific system of the type now proposed, the sensor unit would comprise mainly a capacitive MEMS pressure sensor located in the annular region of a loop antenna (more specifically, a square spiral inductor/ antenna), all fabricated as an integral unit on a high-resistivity silicon chip. The capacitor electrodes, the spiral inductor/antenna, and the conductor lines interconnecting them would all be made of gold. The dimensions of the sensor unit have been estimated to be about 110.4 mm. The external garment-mounted powering/ interrogating unit would include a multi-turn loop antenna and signal-processing circuits. During operation, this external unit would be positioned in proximity to the implanted or ingested unit to provide for near-field, inductive coupling between the loop antennas, which we have as the primary and secondary windings of an electrical transformer.

Novel ultra-lightweight and high-resolution MEMS x-ray optics

NASA Astrophysics Data System (ADS)

Mitsuishi, Ikuyuki; Ezoe, Yuichiro; Takagi, Utako; Mita, Makoto; Riveros, Raul; Yamaguchi, Hitomi; Kato, Fumiki; Sugiyama, Susumu; Fujiwara, Kouzou; Morishita, Kohei; Nakajima, Kazuo; Fujihira, Shinya; Kanamori, Yoshiaki; Yamasaki, Noriko Y.; Mitsuda, Kazuhisa; Maeda, Ryutaro

2009-05-01

We have been developing ultra light-weight X-ray optics using MEMS (Micro Electro Mechanical Systems) technologies.We utilized crystal planes after anisotropic wet etching of silicon (110) wafers as X-ray mirrors and succeeded in X-ray reflection and imaging. Since we can etch tiny pores in thin wafers, this type of optics can be the lightest X-ray telescope. However, because the crystal planes are alinged in certain directions, we must approximate ideal optical surfaces with flat planes, which limits angular resolution of the optics on the order of arcmin. In order to overcome this issue, we propose novel X-ray optics based on a combination of five recently developed MEMS technologies, namely silicon dry etching, X-ray LIGA, silicon hydrogen anneal, magnetic fluid assisted polishing and hot plastic deformation of silicon. In this paper, we describe this new method and report on our development of X-ray mirrors fabricated by these technologies and X-ray reflection experiments of two types of MEMS X-ray mirrors made of silicon and nickel. For the first time, X-ray reflections on these mirrors were detected in the angular response measurements. Compared to model calculations, surface roughness of the silicon and nickel mirrors were estimated to be 5 nm and 3 nm, respectively.

Advanced Exploration Technologies: Micro and Nano Technologies Enabling Space Missions in the 21st Century

NASA Technical Reports Server (NTRS)

Krabach, Timothy

1998-01-01

Some of the many new and advanced exploration technologies which will enable space missions in the 21st century and specifically the Manned Mars Mission are explored in this presentation. Some of these are the system on a chip, the Computed-Tomography imaging Spectrometer, the digital camera on a chip, and other Micro Electro Mechanical Systems (MEMS) technology for space. Some of these MEMS are the silicon micromachined microgyroscope, a subliming solid micro-thruster, a micro-ion thruster, a silicon seismometer, a dewpoint microhygrometer, a micro laser doppler anemometer, and tunable diode laser (TDL) sensors. The advanced technology insertion is critical for NASA to decrease mass, volume, power and mission costs, and increase functionality, science potential and robustness.

Surface-micromachined and high-aspect ratio electrostatic actuators for aeronautic and space applications: design and lifetime considerations

NASA Astrophysics Data System (ADS)

Vescovo, P.; Joseph, E.; Bourbon, G.; Le Moal, P.; Minotti, P.; Hibert, C.; Pont, G.

2003-09-01

This paper focuses on recent advances in the field of MEMS-based actuators and distributed microelectromechanical systems (MEMS). IC-processed actuators (e.g. actuators that are machined using integrated circuit batch processes) are expected to open a wide range of industrial applications on the near term. The most promising investigations deal with high-aspect ratio electric field driven microactuators suitable for use in numerous technical fields such as aeronautics and space industry. Because the silicon micromachining technology have the potential to integrate both mechanical components and control circuits within a single process, MEMS-based active control of microscopic and macroscopic structures appears to be one of the most promising challenges for the next decade. As a first step towards new generations of MEMS-based smart structures, recent investigations dealing with silicon mechanisms involving MEMS-based actuators are briefly discussed in this paper.

MEMS reliability: coming of age

NASA Astrophysics Data System (ADS)

Douglass, Michael R.

2008-02-01

In today's high-volume semiconductor world, one could easily take reliability for granted. As the MOEMS/MEMS industry continues to establish itself as a viable alternative to conventional manufacturing in the macro world, reliability can be of high concern. Currently, there are several emerging market opportunities in which MOEMS/MEMS is gaining a foothold. Markets such as mobile media, consumer electronics, biomedical devices, and homeland security are all showing great interest in microfabricated products. At the same time, these markets are among the most demanding when it comes to reliability assurance. To be successful, each company developing a MOEMS/MEMS device must consider reliability on an equal footing with cost, performance and manufacturability. What can this maturing industry learn from the successful development of DLP technology, air bag accelerometers and inkjet printheads? This paper discusses some basic reliability principles which any MOEMS/MEMS device development must use. Examples from the commercially successful and highly reliable Digital Micromirror Device complement the discussion.

3-D Printing as an Effective Educational Tool for MEMS Design and Fabrication

ERIC Educational Resources Information Center

Dahle, Reena; Rasel, Rafiul

2016-01-01

This paper presents a series of course modules developed as a high-impact and cost-effective learning tool for modeling and simulating the microfabrication process and design of microelectromechanical systems (MEMS) devices using three-dimensional (3-D) printing. Microfabrication technology is an established fabrication technique for small and…

Long Life MEM Switch Technology

DTIC Science & Technology

2006-05-23

Dussopt et al. on the two-level switched-capacitors [2], Peroulis et al. on the extended analog varactor [3], B- Kassem at el. on an extended range analog...Katehi, ”Highly reliable analog MEMS varactors,” 2004 IEEE MTT-S Int. Microwave Symp. Dig., vol. 2, pp. 869-872, June 2004. [4] M. Bakri- Kassem , R. R

Urban MEMS based seismic network for post-earthquakes rapid disaster assessment

NASA Astrophysics Data System (ADS)

D'Alessandro, A.; Luzio, D.; D'Anna, G.

2014-09-01

In this paper, we introduce a project for the realization of the first European real-time urban seismic network based on Micro Electro-Mechanical Systems (MEMS) technology. MEMS accelerometers are a highly enabling technology, and nowadays, the sensitivity and the dynamic range of these sensors are such as to allow the recording of earthquakes of moderate magnitude even at a distance of several tens of kilometers. Moreover, thanks to their low cost and smaller size, MEMS accelerometers can be easily installed in urban areas in order to achieve an urban seismic network constituted by high density of observation points. The network is being implemented in the Acireale Municipality (Sicily, Italy), an area among those with the highest hazard, vulnerability and exposure to the earthquake of the Italian territory. The main objective of the implemented urban network will be to achieve an effective system for post-earthquake rapid disaster assessment. The earthquake recorded, also that with moderate magnitude will be used for the effective seismic microzonation of the area covered by the network. The implemented system will be also used to realize a site-specific earthquakes early warning system.

Solid oxide MEMS-based fuel cells

DOEpatents

Jankowksi, Alan F.; Morse, Jeffrey D.

2007-03-13

A micro-electro-mechanical systems (MEMS) based thin-film fuel cells for electrical power applications. The MEMS-based fuel cell may be of a solid oxide type (SOFC), a solid polymer type (SPFC), or a proton exchange membrane type (PEMFC), and each fuel cell basically consists of an anode and a cathode separated by an electrolyte layer. The electrolyte layer can consist of either a solid oxide or solid polymer material, or proton exchange membrane electrolyte materials may be used. Additionally catalyst layers can also separate the electrodes (cathode and anode) from the electrolyte. Gas manifolds are utilized to transport the fuel and oxidant to each cell and provide a path for exhaust gases. The electrical current generated from each cell is drawn away with an interconnect and support structure integrated with the gas manifold. The fuel cells utilize integrated resistive heaters for efficient heating of the materials. By combining MEMS technology with thin-film deposition technology, thin-film fuel cells having microflow channels and full-integrated circuitry can be produced that will lower the operating temperature an will yield an order of magnitude greater power density than the currently known fuel cells.

Solid polymer MEMS-based fuel cells

DOEpatents

Jankowski, Alan F [Livermore, CA; Morse, Jeffrey D [Pleasant Hill, CA

2008-04-22

A micro-electro-mechanical systems (MEMS) based thin-film fuel cells for electrical power applications. The MEMS-based fuel cell may be of a solid oxide type (SOFC), a solid polymer type (SPFC), or a proton exchange membrane type (PEMFC), and each fuel cell basically consists of an anode and a cathode separated by an electrolyte layer. The electrolyte layer can consist of either a solid oxide or solid polymer material, or proton exchange membrane electrolyte materials may be used. Additionally catalyst layers can also separate the electrodes (cathode and anode) from the electrolyte. Gas manifolds are utilized to transport the fuel and oxidant to each cell and provide a path for exhaust gases. The electrical current generated from each cell is drawn away with an interconnect and support structure integrated with the gas manifold. The fuel cells utilize integrated resistive heaters for efficient heating of the materials. By combining MEMS technology with thin-film deposition technology, thin-film fuel cells having microflow channels and full-integrated circuitry can be produced that will lower the operating temperature an will yield an order of magnitude greater power density than the currently known fuel cells.

Optical MEMS platform for low-cost on-chip integration of planar light circuits and optical switching

NASA Astrophysics Data System (ADS)

German, Kristine A.; Kubby, Joel; Chen, Jingkuang; Diehl, James; Feinberg, Kathleen; Gulvin, Peter; Herko, Larry; Jia, Nancy; Lin, Pinyen; Liu, Xueyuan; Ma, Jun; Meyers, John; Nystrom, Peter; Wang, Yao Rong

2004-07-01

Xerox Corporation has developed a technology platform for on-chip integration of latching MEMS optical waveguide switches and Planar Light Circuit (PLC) components using a Silicon On Insulator (SOI) based process. To illustrate the current state of this new technology platform, working prototypes of a Reconfigurable Optical Add/Drop Multiplexer (ROADM) and a l-router will be presented along with details of the integrated latching MEMS optical switches. On-chip integration of optical switches and PLCs can greatly reduce the size, manufacturing cost and operating cost of multi-component optical equipment. It is anticipated that low-cost, low-overhead optical network products will accelerate the migration of functions and services from high-cost long-haul markets to price sensitive markets, including networks for metropolitan areas and fiber to the home. Compared to the more common silica-on-silicon PLC technology, the high index of refraction of silicon waveguides created in the SOI device layer enables miniaturization of optical components, thereby increasing yield and decreasing cost projections. The latching SOI MEMS switches feature moving waveguides, and are advantaged across multiple attributes relative to alternative switching technologies, such as thermal optical switches and polymer switches. The SOI process employed was jointly developed under the auspice of the NIST APT program in partnership with Coventor, Corning IntelliSense Corp., and MicroScan Systems to enable fabrication of a broad range of free space and guided wave MicroOptoElectroMechanical Systems (MOEMS).

History and Technology Developments of Radio Frequency (RF) Systems for Particle Accelerators

NASA Astrophysics Data System (ADS)

Nassiri, A.; Chase, B.; Craievich, P.; Fabris, A.; Frischholz, H.; Jacob, J.; Jensen, E.; Jensen, M.; Kustom, R.; Pasquinelli, R.

2016-04-01

This article attempts to give a historical account and review of technological developments and innovations in radio frequency (RF) systems for particle accelerators. The evolution from electrostatic field to the use of RF voltage suggested by R. Wideröe made it possible to overcome the shortcomings of electrostatic accelerators, which limited the maximum achievable electric field due to voltage breakdown. After an introduction, we will provide reviews of technological developments of RF systems for particle accelerators.

Review of the potential of a wireless MEMS and TFT microsystems for the measurement of pressure in the GI tract.

PubMed

Arshak, A; Arshak, K; Waldron, D; Morris, D; Korostynska, O; Jafer, E; Lyons, G

2005-06-01

Telemetry capsules have existed since the 1950s and were used to measure temperature, pH or pressure inside the gastrointestinal (GI) tract. It was hoped that these capsules would replace invasive techniques in the diagnosis of function disorders in the GI tract. However, problems such as signal loss and uncertainty of the pills position limited their use in a clinical setting. In this paper, a review of the capabilities of MicroElectroMechanical Systems (MEMS) and thick film technology (TFT) for the fabrication of a wireless pressure sensing microsystem is presented. The circuit requirements and methods of data transfer are examined. The available fabrication methods for MEMS sensors are also discussed and examples of wireless sensors are given. Finally the limitations of each technology are examined.

EDITORIAL: Special issue for papers selected from The 8th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2008) Special issue for papers selected from The 8th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2008)

NASA Astrophysics Data System (ADS)

Tanaka, Shuji

2009-09-01

This special issue of the Journal of Micromechanics and Microengineering features papers selected from The 8th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2008) with the 2nd Symposium on Micro Environmental Machine Systems (μMEMS 2008). The workshop was held in Sendai, Japan on 9-12 November 2008 by Tohoku University. This is the second time that the PowerMEMS workshop has been held in Sendai, following the first workshop in 2000. Power MEMS is one of the newest categories of MEMS, which encompasses microdevices and microsystems for power generation, energy conversion and propulsion. The first concept of Power MEMS was born in the late 1990's from a MEMS-based gas turbine project at Massachusetts Institute of Technology. After that, the research and development of Power MEMS have been promoted by the strong need for compact power sources with high energy and/or power density. Since its inception, Power MEMS has expanded to include not only various MEMS-based power generators but also small energy machines and microdevices for macro power generators. Previously, the main topics of the PowerMEMS workshop were miniaturized gas turbines and micro fuel cells, but recently, energy harvesting has been the hottest topic. In 2008, energy harvesting had a 41% share in the 118 accepted regular papers. This special issue includes 19 papers on various topics. Finally, I would like to express my sincere appreciation to the members of the International Steering Committee, the Technical Program Committee, the Local Organizing Committee and financial supporters. This special issue was edited in collaboration with the staff of IOP Publishing.

Nanocharacterization of the adhesion effect and bending stiffness in optical MEMS

NASA Astrophysics Data System (ADS)

Pustan, Marius; Birleanu, Corina; Dudescu, Cristian

2017-11-01

The scope of this paper is the reliability design and testing of flexible MEMS components as clamp-clamp beams for the out-of-plane displacement. The field of implementation of such structures is in optical relevant applications such as the optical microsensors or optical microswitches. Moreover these structures can be successfully implemented in RF switches or in the other MEMS applications. The research studies presented in this paper consider the analytical and numerical analysis follow by the experimental validation. The mechanical and tribological characteristics such as the sample static response under an applied force and the adhesion effect between the flexible structure and substrate are investigated. The samples under test are fabricated from a reflective material - gold. Experimental investigations are performed by atomic force microscopy in order to determine the response of the gold microbridges under an applied force. Moreover, to identify the proper geometry that is less sensitive to a thermal gradient, different geometrical configurations of microbridges are tested under different temperatures. An etalon structure is considered as a reference beam and it is compared with the other samples fabricated in the same geometrical dimensions but with some additional rectangular holes performed on the flexible plate. The scope of holes is to reduce the temperature influence on the mechanical behaviour of clamp-clamp beam from application where a thermal gradient occurs. During numerical analysis and experimental investigations, the temperature of samples is increased from 20 °C to 100 °C and the sample response is monitored. A comparison between numerical and experimental results is provided at the end of paper. The research results are useful for designers to predict the behaviour of material and structure from optical or thermal applications in order to improve the reliability and the MEMS lifetime.

Development, characterization and application of compact spectrometers based on MEMS with in-plane capacitive drives

NASA Astrophysics Data System (ADS)

Kenda, A.; Kraft, M.; Tortschanoff, A.; Scherf, Werner; Sandner, T.; Schenk, Harald; Luettjohann, Stephan; Simon, A.

2014-05-01

With a trend towards the use of spectroscopic systems in various fields of science and industry, there is an increasing demand for compact spectrometers. For UV/VIS to the shortwave near-infrared spectral range, compact hand-held polychromator type devices are widely used and have replaced larger conventional instruments in many applications. Still, for longer wavelengths this type of compact spectrometers is lacking suitable and affordable detector arrays. In perennial development Carinthian Tech Research AG together with the Fraunhofer Institute for Photonic Microsystems endeavor to close this gap by developing spectrometer systems based on photonic MEMS. Here, we review on two different spectrometer developments, a scanning grating spectrometer working in the NIR and a FT-spectrometer accessing the mid-IR range up to 14 μm. Both systems are using photonic MEMS devices actuated by in-plane comb drive structures. This principle allows for high mechanical amplitudes at low driving voltages but results in gratings respectively mirrors oscillating harmonically. Both systems feature special MEMS structures as well as aspects in terms of system integration which shall tease out the best possible overall performance on the basis of this technology. However, the advantages of MEMS as enabling technology for high scanning speed, miniaturization, energy efficiency, etc. are pointed out. Whereas the scanning grating spectrometer has already evolved to a product for the point of sale analysis of traditional Chinese medicine products, the purpose of the FT-spectrometer as presented is to demonstrate what is achievable in terms of performance. Current developments topics address MEMS packaging issues towards long term stability, further miniaturization and usability.

Advanced Measurement Systems Available to PIWG Members

NASA Technical Reports Server (NTRS)

Anderson, Robert; Lei, Jih-Fen (Technical Monitor)

2002-01-01

It was developed advanced measurement technologies to meet NASA goals: reduce design cycle time, reduce emission, reduce testing time, increase safety. The technology are saving money. This technology are available now for technology transfer: optical diagnostics, the film technology and MEMS devices.

Applications of Digital Micromirror Devices to Astronomical Instrumentation

NASA Astrophysics Data System (ADS)

Robberto, M.

MEMS devices are among the major technological breakthroughs of the last two decades. Besides finding widespread use in high-tech and consumer market electronics, MEMS enable new types of astronomical instruments. I concentrate on Digital Micromirror Devices, which have been already adopted in astronomy and can enable scientific investigations that would otherwise remain beyond our technical capabilities.

MEMSlab: A Practical MEMS Course for the Fabrication, Packaging, and Testing of a Single-Axis Accelerometer

ERIC Educational Resources Information Center

Grundbacher, R.; Hoetzel, J. E.; Hierold, C.

2009-01-01

A microelectro-mechanical systems (MEMS) laboratory course (MEMSlab) in the Mechanical and Process Engineering Department at the Swiss Federal Institute of Technology (ETH Zurich), is presented. The course has been taught for four years and has been attended primarily by Master's students from mechanical and electrical engineering; since fall…

Flexible Chip Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain

PubMed Central

Jackson, Nathan; Muthuswamy, Jit

2009-01-01

We report here a novel approach called MEMS microflex interconnect (MMFI) technology for packaging a new generation of Bio-MEMS devices that involve movable microelectrodes implanted in brain tissue. MMFI addresses the need for (i) operating space for movable parts and (ii) flexible interconnects for mechanical isolation. We fabricated a thin polyimide substrate with embedded bond-pads, vias, and conducting traces for the interconnect with a backside dry etch, so that the flexible substrate can act as a thin-film cap for the MEMS package. A double gold stud bump rivet bonding mechanism was used to form electrical connections to the chip and also to provide a spacing of approximately 15–20 µm for the movable parts. The MMFI approach achieved a chip scale package (CSP) that is lightweight, biocompatible, having flexible interconnects, without an underfill. Reliability tests demonstrated minimal increases of 0.35 mΩ, 0.23 mΩ and 0.15 mΩ in mean contact resistances under high humidity, thermal cycling, and thermal shock conditions respectively. High temperature tests resulted in an increase in resistance of > 90 mΩ when aluminum bond pads were used, but an increase of ~ 4.2 mΩ with gold bond pads. The mean-time-to-failure (MTTF) was estimated to be at least one year under physiological conditions. We conclude that MMFI technology is a feasible and reliable approach for packaging and interconnecting Bio-MEMS devices. PMID:20160981

Radio frequency heating for in-situ remediation of DNAPL

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kasevich, R.S.

1996-08-01

In-situ radio frequency (RF) heating technology for treating soils contaminated with dense nonaqueous phase liquids (DNAPLs) is described. RF imparts heat to non-conducting materials through the application of carefully controlled RF transmissions, improving contaminant flow characteristics and facilitating separation and removal from subsurface soils. The paper outlines advantages and limitations of RF remediation, process operations, general technology considerations, low permeability media considerations, commercial availability, and costs. Two case histories of RF remediation are briefly summarized. 13 refs., 10 figs.

Ultra-compact MEMS FTIR spectrometer

NASA Astrophysics Data System (ADS)

Sabry, Yasser M.; Hassan, Khaled; Anwar, Momen; Alharon, Mohamed H.; Medhat, Mostafa; Adib, George A.; Dumont, Rich; Saadany, Bassam; Khalil, Diaa

2017-05-01

Portable and handheld spectrometers are being developed and commercialized in the late few years leveraging the rapidly-progressing technology and triggering new markets in the field of on-site spectroscopic analysis. Although handheld devices were commercialized for the near-infrared spectroscopy (NIRS), their size and cost stand as an obstacle against the deployment of the spectrometer as spectral sensing components needed for the smart phone industry and the IoT applications. In this work we report a chip-sized microelectromechanical system (MEMS)-based FTIR spectrometer. The core optical engine of the solution is built using a passive-alignment integration technique for a selfaligned MEMS chip; self-aligned microoptics and a single detector in a tiny package sized about 1 cm3. The MEMS chip is a monolithic, high-throughput scanning Michelson interferometer fabricated using deep reactive ion etching technology of silicon-on-insulator substrate. The micro-optical part is used for conditioning the input/output light to/from the MEMS and for further light direction to the detector. Thanks to the all-reflective design of the conditioning microoptics, the performance is free of chromatic aberration. Complemented by the excellent transmission properties of the silicon in the infrared region, the integrated solution allows very wide spectral range of operation. The reported sensor's spectral resolution is about 33 cm-1 and working in the range of 1270 nm to 2700 nm; upper limited by the extended InGaAs detector. The presented solution provides a low cost, low power, tiny size, wide wavelength range NIR spectral sensor that can be manufactured with extremely high volumes. All these features promise the compatibility of this technology with the forthcoming demand of smart portable and IoT devices.

Surface micromachined MEMS deformable mirror based on hexagonal parallel-plate electrostatic actuator

NASA Astrophysics Data System (ADS)

Ma, Wenying; Ma, Changwei; Wang, Weimin

2018-03-01

Deformable mirrors (DM) based on microelectromechanical system (MEMS) technology are being applied in adaptive optics (AO) system for astronomical telescopes and human eyes more and more. In this paper a MEMS DM with hexagonal actuator is proposed and designed. The relationship between structural design and performance parameters, mainly actuator coupling, is analyzed carefully and calculated. The optimum value of actuator coupling is obtained. A 7-element DM prototype is fabricated using a commercial available standard three-layer polysilicon surface multi-user-MEMS-processes (PolyMUMPs). Some key performances, including surface figure and voltage-displacement curve, are measured through a 3D white light profiler. The measured performances are very consistent with the theoretical values. The proposed DM will benefit the miniaturization of AO systems and lower their cost.

Review of Polyimides Used in the Manufacturing of Micro Systems

NASA Technical Reports Server (NTRS)

Wilson, William C.; Atkinson, Gary M.

2007-01-01

Since their invention, polyimides have found numerous uses in MicroElectroMechanical Systems (MEMS) technology. Polyimides can act as photoresist, sacrificial layers, structural layers, and even as a replacement for silicon as the substrate during MEMS fabrication. They enable fabrication of both low and high aspect ratio devices. Polyimides have been used to fabricate expendable molds and reusable flexible molds. Development of a variety of devices that employ polyimides for sensor applications has occurred. Micro-robotic actuator applications include hinges, thermal actuators and residual stress actuators. Currently, polyimides are being used to create new sensors and devices for aerospace applications. This paper presents a review of some of the many uses of polyimides in the development of MEMS devices, including a new polyimide based MEMS fabrication process.

Realization of 10 GHz minus 30dB on-chip micro-optical links with Si-Ge RF bi-polar technology

NASA Astrophysics Data System (ADS)

Ogudo, Kingsley A.; Snyman, Lukas W.; Polleux, Jean-Luc; Viana, Carlos; Tegegne, Zerihun

2014-06-01

Si Avalanche based LEDs technology has been developed in the 650 -850nm wavelength regime [1, 2]. Correspondingly, small micro-dimensioned detectors with pW/μm2 sensitivity have been developed for the same wavelength range utilizing Si-Ge detector technology with detection efficiencies of up to 0.85, and with a transition frequencies of up to 80 GHz [3] A series of on-chip optical links of 50 micron length, utilizing 650 - 850 nm propagation wavelength have been designed and realized, utilizing a Si Ge radio frequency bipolar process. Micron dimensioned optical sources, waveguides and detectors were all integrated on the same chip to form a complete optical link on-chip. Avalanche based Si LEDs (Si Av LEDs), Schottky contacting, TEOS densification strategies, silicon nitride based waveguides, and state of the art Si-Ge bipolar detector technologies were used as key design strategies. Best performances show optical coupling from source to detector of up to 10GHz and - 40dBm total optical link budget loss with a potential transition frequency coupling of up to 40GHz utilizing Si Ge based LEDs. The technology is particularly suitable for application as on-chip optical links, optical MEMS and MOEMS, as well as for optical interconnects utilizing low loss, side surface, waveguide- to-optical fiber coupling. Most particularly is one of our designed waveguide which have a good core axis alignment with the optical source and yield 10GHz -30dB on-chip micro-optical links as shown in Fig 9 (c). The technology as developed has been appropriately IP protected.

Evolution from MEMS-based Linear Drives to Bio-based Nano Drives

NASA Astrophysics Data System (ADS)

Fujita, Hiroyuki

The successful extension of semiconductor technology to fabricate mechanical parts of the sizes from 10 to 100 micrometers opened wide ranges of possibilities for micromechanical devices and systems. The fabrication technique is called micromachining. Micromachining processes are based on silicon integrated circuits (IC) technology and used to build three-dimensional structures and movable parts by the combination of lithography, etching, film deposition, and wafer bonding. Microactuators are the key devices allowing MEMS to perform physical functions. Some of them are driven by electric, magnetic, and fluidic forces. Some others utilize actuator materials including piezoelectric (PZT, ZnO, quartz) and magnetostrictive materials (TbFe), shape memory alloy (TiNi) and bio molecular motors. This paper deals with the development of MEMS based microactuators, especially linear drives, following my own research experience. They include an electrostatic actuator, a superconductive levitated actuator, arrayed actuators, and a bio-motor-driven actuator.

MEMS- and LC-adaptive optics at the Naval Research Laboratory

NASA Astrophysics Data System (ADS)

Restaino, S. R.; Wilcox, C. C.; Martinez, T.; Andrews, J. R.; Santiago, F.; Payne, D. M.

2012-06-01

Adaptive Optics (AO) is an ensemble of techniques that aims at the remedial of the deleterious effects that the Earth's turbulent atmosphere induces on both imagery and signal gathering in real time. It has been over four decades since the first AO system was developed and tested. During this time important technological advances have changed profoundly the way that we think and develop AO systems. The use of Micro-Electro-Mechanical-Systems (MEMS) devices and Liquid Crystal Devices (LCD) has revolutionized these technologies making possible to go from very expensive, very large and power consuming systems to very compact and inexpensive systems. These changes have rendered AO systems useful and applicable in other fields ranging from medical imaging to industry. In this paper we will review the research efforts at the Naval research Laboratory (NRL) to develop AO systems based on both MEMs and LCD in order to produce more compact and light weight AO systems.

Characterization of shape and deformation of MEMS by quantitative optoelectronic metrology techniques

NASA Astrophysics Data System (ADS)

Furlong, Cosme; Pryputniewicz, Ryszard J.

2002-06-01

Recent technological trends based on miniaturization of mechanical, electro-mechanical, and photonic devices to the microscopic scale, have led to the development of microelectromechanical systems (MEMS). Effective development of MEMS components requires the synergism of advanced design, analysis, and fabrication methodologies, and also of quantitative metrology techniques for characterizing their performance, reliability, and integrity during the electronic packaging cycle. In this paper, we describe opto-electronic techniques for measuring, with sub-micrometer accuracy, shape and changes in states of deformation of MEMS strictures. With the described opto-electronic techniques, it is possible to characterize MEMS components using the display and data modes. In the display mode, interferometric information related to shape and deformation is displayed at video frame rates, providing the capability for adjusting and setting experimental conditions. In the data mode, interferometric information related to shape and deformation is recorded as high-spatial and high-digital resolution images, which are further processed to provide quantitative 3D information. Furthermore, the quantitative 3D data are exported to computer-aided design (CAD) environments and utilized for analysis and optimization of MEMS devices. Capabilities of opto- electronic techniques are illustrated with representative applications demonstrating their applicability to provide indispensable quantitative information for the effective development and optimization of MEMS devices.

MEMS-based IR-sources

NASA Astrophysics Data System (ADS)

Weise, Sebastian; Steinbach, Bastian; Biermann, Steffen

2016-03-01

The series JSIR350 sources are MEMS based infrared emitters. These IR sources are characterized by a high radiation output. Thus, they are excellent for NDIR gas analysis and are ideally suited for using with our pyro-electric or thermopile detectors. The MEMS chips used in Micro-Hybrid's infrared emitters consist of nano-amorphous carbon (NAC). The MEMS chips are produced in the USA. All Micro-Hybrid Emitter are designed and specified to operate up to 850°C. The improvements we have made in the source's packaging enable us to provide IR sources with the best performance on the market. This new technology enables us to seal the housings of infrared radiation sources with soldered infrared filters or windows and thus cause the parts to be impenetrable to gases. Micro-Hybrid provide various ways of adapting our MEMS based infrared emitter JSIR350 to customer specifications, like specific burn-in parameters/characteristic, different industrial standard housings, producible with customized cap, reflector or pin-out.

Gas detection with microelectromechanical Fabry-Perot interferometer technology in cell phone

NASA Astrophysics Data System (ADS)

Mannila, Rami; Hyypiö, Risto; Korkalainen, Marko; Blomberg, Martti; Kattelus, Hannu; Rissanen, Anna

2015-06-01

VTT Technical Research Centre of Finland has developed a miniaturized optical sensor for gas detection in a cell phone. The sensor is based on a microelectromechanical (MEMS) Fabry-Perot interferometer, which is a structure with two highly reflective surfaces separated by a tunable air gap. The MEMS FPI is a monolithic device, i.e. it is made entirely on one substrate in a batch process, without assembling separate pieces together. The gap is adjusted by moving the upper mirror with electrostatic force, so there are no actual moving parts. VTT has designed and manufactured a MEMS FPI based carbon dioxide sensor demonstrator which is integrated to a cell phone shield cover. The demonstrator contains light source, gas cell, MEMS FPI, detector, control electronics and two coin cell batteries as a power source. It is connected to the cell phone by Bluetooth. By adjusting the wavelength range and customizing the MEMS FPI structure, it is possible to selectively sense multiple gases.

MEMS-based tunable gratings and their applications

NASA Astrophysics Data System (ADS)

Yu, Yiting; Yuan, Weizheng; Qiao, Dayong

2015-03-01

The marriage of optics and MEMS has resulted in a new category of optical devices and systems that have unprecedented advantages compared with their traditional counterparts. As an important spatial light modulating technology, diffractive optical MEMS obtains a wide variety of successful commercial applications, e.g. projection displays, optical communication and spectral analysis, due to its features of highly compact, low-cost, IC-compatible, excellent performance, and providing possibilities for developing totally new, yet smart devices and systems. Three most successful MEMS diffraction gratings (GLVs, Polychromator and DMDs) are briefly introduced and their potential applications are analyzed. Then, three different MEMS tunable gratings developed by our group, named as micro programmable blazed gratings (μPBGs) and micro pitch-tunable gratings (μPTGs) working in either digital or analog mode, are demonstrated. The strategies to largely enhance the maximum blazed angle and grating period are described. Some preliminary application explorations based on the developed grating devices are also shown. For our ongoing research focus, we will further improve the device performance to meet the engineering application requirements.

MEMS Stirling Cooler Development Update

NASA Technical Reports Server (NTRS)

Moran, Matthew E.; Wesolek, Danielle

2003-01-01

This presentation provides an update on the effort to build and test a prototype unit of the patented MEMS Stirling cooler concept. A micro-scale regenerator has been fabricated by Polar Thermal Technologies and is currently being integrated into a Stirling cycle simulator at Johns Hopkins University Applied Physics Laboratory. A discussion of the analysis, design, assembly, and test plans for the prototype will be presented.

The role of creep in the time-dependent resistance of Ohmic gold contacts in radio frequency microelectromechanical system devices

NASA Astrophysics Data System (ADS)

Rezvanian, O.; Brown, C.; Zikry, M. A.; Kingon, A. I.; Krim, J.; Irving, D. L.; Brenner, D. W.

2008-07-01

It is shown that measured and calculated time-dependent electrical resistances of closed gold Ohmic switches in radio frequency microelectromechanical system (rf-MEMS) devices are well described by a power law that can be derived from a single asperity creep model. The analysis reveals that the exponent and prefactor in the power law arise, respectively, from the coefficient relating creep rate to applied stress and the initial surface roughness. The analysis also shows that resistance plateaus are not, in fact, limiting resistances but rather result from the small coefficient in the power law. The model predicts that it will take a longer time for the contact resistance to attain a power law relation with each successive closing of the switch due to asperity blunting. Analysis of the first few seconds of the measured resistance for three successive openings and closings of one of the MEMS devices supports this prediction. This work thus provides guidance toward the rational design of Ohmic contacts with enhanced reliabilities by better defining variables that can be controlled through material selection, interface processing, and switch operation.

Measured radiofrequency exposure during various mobile-phone use scenarios.

PubMed

Kelsh, Michael A; Shum, Mona; Sheppard, Asher R; McNeely, Mark; Kuster, Niels; Lau, Edmund; Weidling, Ryan; Fordyce, Tiffani; Kühn, Sven; Sulser, Christof

2011-01-01

Epidemiologic studies of mobile phone users have relied on self reporting or billing records to assess exposure. Herein, we report quantitative measurements of mobile-phone power output as a function of phone technology, environmental terrain, and handset design. Radiofrequency (RF) output data were collected using software-modified phones that recorded power control settings, coupled with a mobile system that recorded and analyzed RF fields measured in a phantom head placed in a vehicle. Data collected from three distinct routes (urban, suburban, and rural) were summarized as averages of peak levels and overall averages of RF power output, and were analyzed using analysis of variance methods. Technology was the strongest predictor of RF power output. The older analog technology produced the highest RF levels, whereas CDMA had the lowest, with GSM and TDMA showing similar intermediate levels. We observed generally higher RF power output in rural areas. There was good correlation between average power control settings in the software-modified phones and power measurements in the phantoms. Our findings suggest that phone technology, and to a lesser extent, degree of urbanization, are the two stronger influences on RF power output. Software-modified phones should be useful for improving epidemiologic exposure assessment.

NASA Advanced Refrigerator/Freezer Technology Development Project Overview

NASA Technical Reports Server (NTRS)

Cairelli, J. E.

1995-01-01

NASA Lewis Research Center (LeRC) has recently initiated a three-year project to develop the advanced refrigerator/freezer (R/F) technologies needed to support future life and biomedical sciences space experiments. Refrigerator/freezer laboratory equipment, most of which needs to be developed, is enabling to about 75 percent of the planned space station life and biomedical science experiments. These experiments will require five different classes of equipment; three storage freezers operating at -20 C, -70 C and less than 183 C, a -70 C freeze-dryer, and a cryogenic (less than 183 C) quick/snap freezer. This project is in response to a survey of cooling system technologies, performed by a team of NASA scientists and engineers. The team found that the technologies, required for future R/F systems to support life and biomedical sciences spaceflight experiments, do not exist at an adequate state of development and concluded that a program to develop the advanced R/F technologies is needed. Limitations on spaceflight system size, mass, and power consumption present a significant challenge in developing these systems. This paper presents some background and a description of the Advanced R/F Technology Development Project, project approach and schedule, general description of the R/F systems, and a review of the major R/F equipment requirements.

Fabricating micro-instruments in surface-micromachined polycrystalline silicon

DOE Office of Scientific and Technical Information (OSTI.GOV)

Comtois, J.H.; Michalicek, M.A.; Barron, C.C.

1997-04-01

Smaller, lighter instruments can be fabricated as Micro-Electro-Mechanical Systems (MEMS), having micron scale moving parts packaged together with associated control and measurement electronics. Batch fabrication of these devices will make economical applications such as condition-based machine maintenance and remote sensing. The choice of instrumentation is limited only by the designer`s imagination. This paper presents one genre of MEMS fabrication, surface-micromachined polycrystalline silicon (polysilicon). Two currently available but slightly different polysilicon processes are presented. One is the ARPA-sponsored ``Multi-User MEMS ProcesS`` (MUMPS), available commercially through MCNC; the other is the Sandia National Laboratories ``Sandia Ultra-planar Multilevel MEMS Technology`` (SUMMiT). Example componentsmore » created in both processes will be presented, with an emphasis on actuators, actuator force testing instruments, and incorporating actuators into larger instruments.« less

Deformable Mirrors Correct Optical Distortions

NASA Technical Reports Server (NTRS)

2010-01-01

By combining the high sensitivity of space telescopes with revolutionary imaging technologies consisting primarily of adaptive optics, the Terrestrial Planet Finder is slated to have imaging power 100 times greater than the Hubble Space Telescope. To this end, Boston Micromachines Corporation, of Cambridge, Massachusetts, received Small Business Innovation Research (SBIR) contracts from the Jet Propulsion Laboratory for space-based adaptive optical technology. The work resulted in a microelectromechanical systems (MEMS) deformable mirror (DM) called the Kilo-DM. The company now offers a full line of MEMS DMs, which are being used in observatories across the world, in laser communication, and microscopy.

MEMS (Micro-Electro-Mechanical Systems) for Automotive and Consumer Electronics

NASA Astrophysics Data System (ADS)

Marek, Jiri; Gómez, Udo-Martin

MEMS sensors gained over the last two decades an impressive width of applications: (a) ESP: A car is skidding and stabilizes itself without driver intervention (b) Free-fall detection: A laptop falls to the floor and protects the hard drive by parking the read/write drive head automatically before impact. (c) Airbag: An airbag fires before the driver/occupant involved in an impending automotive crash impacts the steering wheel, thereby significantly reducing physical injury risk. MEMS sensors are sensing the environmental conditions and are giving input to electronic control systems. These crucial MEMS sensors are making system reactions to human needs more intelligent, precise, and at much faster reaction rates than humanly possible. Important prerequisites for the success of sensors are their size, functionality, power consumption, and costs. This technical progress in sensor development is realized by micro-machining. The development of these processes was the breakthrough to industrial mass-production for micro-electro-mechanical systems (MEMS). Besides leading-edge micromechanical processes, innovative and robust ASIC designs, thorough simulations of the electrical and mechanical behaviour, a deep understanding of the interactions (mainly over temperature and lifetime) of the package and the mechanical structures are needed. This was achieved over the last 20 years by intense and successful development activities combined with the experience of volume production of billions of sensors. This chapter gives an overview of current MEMS technology, its applications and the market share. The MEMS processes are described, and the challenges of MEMS, compared to standard IC fabrication, are discussed. The evolution of MEMS requirements is presented, and a short survey of MEMS applications is shown. Concepts of newest inertial sensors for ESP-systems are given with an emphasis on the design concepts of the sensing element and the evaluation circuit for achieving excellent noise performance. The chapter concludes with an outlook on arising new MEMS applications such as energy harvester and micro fuel cells.

Flexible Chip Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain.

PubMed

Jackson, Nathan; Muthuswamy, Jit

2009-04-01

We report here a novel approach called MEMS microflex interconnect (MMFI) technology for packaging a new generation of Bio-MEMS devices that involve movable microelectrodes implanted in brain tissue. MMFI addresses the need for (i) operating space for movable parts and (ii) flexible interconnects for mechanical isolation. We fabricated a thin polyimide substrate with embedded bond-pads, vias, and conducting traces for the interconnect with a backside dry etch, so that the flexible substrate can act as a thin-film cap for the MEMS package. A double gold stud bump rivet bonding mechanism was used to form electrical connections to the chip and also to provide a spacing of approximately 15-20 µm for the movable parts. The MMFI approach achieved a chip scale package (CSP) that is lightweight, biocompatible, having flexible interconnects, without an underfill. Reliability tests demonstrated minimal increases of 0.35 mΩ, 0.23 mΩ and 0.15 mΩ in mean contact resistances under high humidity, thermal cycling, and thermal shock conditions respectively. High temperature tests resulted in an increase in resistance of > 90 mΩ when aluminum bond pads were used, but an increase of ~ 4.2 mΩ with gold bond pads. The mean-time-to-failure (MTTF) was estimated to be at least one year under physiological conditions. We conclude that MMFI technology is a feasible and reliable approach for packaging and interconnecting Bio-MEMS devices.

RF-MEMS Load Sensors with Enhanced Q-factor and Sensitivity in a Suspended Architecture.

PubMed

Melik, Rohat; Unal, Emre; Perkgoz, Nihan Kosku; Puttlitz, Christian; Demir, Hilmi Volkan

2011-03-01

In this paper, we present and demonstrate RF-MEMS load sensors designed and fabricated in a suspended architecture that increases their quality-factor (Q-factor), accompanied with an increased resonance frequency shift under load. The suspended architecture is obtained by removing silicon under the sensor. We compare two sensors that consist of 195 μm × 195 μm resonators, where all of the resonator features are of equal dimensions, but one's substrate is partially removed (suspended architecture) and the other's is not (planar architecture). The single suspended device has a resonance of 15.18 GHz with 102.06 Q-factor whereas the single planar device has the resonance at 15.01 GHz and an associated Q-factor of 93.81. For the single planar device, we measured a resonance frequency shift of 430 MHz with 3920 N of applied load, while we achieved a 780 MHz frequency shift in the single suspended device. In the planar triplet configuration (with three devices placed side by side on the same chip, with the two outmost ones serving as the receiver and the transmitter), we observed a 220 MHz frequency shift with 3920 N of applied load while we obtained a 340 MHz frequency shift in the suspended triplet device with 3920 N load applied. Thus, the single planar device exhibited a sensitivity level of 0.1097 MHz/N while the single suspended device led to an improved sensitivity of 0.1990 MHz/N. Similarly, with the planar triplet device having a sensitivity of 0.0561 MHz/N, the suspended triplet device yielded an enhanced sensitivity of 0.0867 MHz/N.

Improved Design of Optical MEMS Using the SUMMiT Fabrication Process

DOE Office of Scientific and Technical Information (OSTI.GOV)

Michalicek, M.A.; Comtois, J.H.; Barron, C.C.

This paper describes the design and fabrication of optical Microelectromechanical Systems (MEMS) devices using the Sandia Ultra planar Multilevel MEMS Technology (SUMMiT) fabrication process. This state of the art process, offered by Sandia National Laboratories, provides unique and very advantageous features which make it ideal for optical devices. This enabling process permits the development of micromirror devices with near ideal characteristics which have previously been unrealizable in standard polysilicon processes. This paper describes such characteristics as elevated address electrodes, individual address wiring beneath the device, planarized mirror surfaces, unique post-process metallization, and the best active surface area to date.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Rowe, Nathan C; Younkin, James R; Pickett, Chris A

Radio-Frequency (RF) devices have revolutionized many aspects of modern industrial processes. RF technology can enable wireless communication for tag identification, sensor communication, and asset tracking. Radio-frequency identification (RFID) is a technology that utilizes wireless communication to interrogate and identify an electronic tag attached to an item in order to identify the item. The technology can come in many forms: passive or active tags, low to ultra-wideband frequencies, small paper-thin tags to brick-sized units, and simple tags or highly integrated sensor packages. RF technology, and specifically RFID, has been applied widely in commercial markets for inventory, supply chain management, and assetmore » tracking. Several recent studies have demonstrated the safeguards benefits of utilizing RFID versus conventional inventory tagging methods for tracking nuclear material. These studies have indicated that the RF requirements for safeguards functions are more stringent than the RF requirements for other inventory tracking and accounting applications. Additionally, other requirements must be addressed, including environmental and operating conditions, authentication, and tag location and attachment. Facility restrictions on radio spectrum, method of tag attachment, and sensitivity of the data collected impact the tag selection and system design. More important, the intended use of the system must be considered. The requirements for using RF to simply replace or supplement container identifiers such as bar codes that facilitate the inventory function will differ greatly from the requirements for deploying RF for unattended monitoring applications. Several studies have investigated these considerations to advance commercial RF devices for safeguards use, and a number of system concepts have been developed. This paper will provide an overview of past studies and current technologies, and will investigate the requirements, existing gaps, and several potential next steps for advancing RF techniques for safeguards use.« less

Design of a multi-axis implantable MEMS sensor for intraosseous bone stress monitoring

NASA Astrophysics Data System (ADS)

Alfaro, Fernando; Weiss, Lee; Campbell, Phil; Miller, Mark; Fedder, Gary K.

2009-08-01

The capability to assess the biomechanical properties of living bone is important for basic research as well as the clinical management of skeletal trauma and disease. Even though radiodensitometric imaging is commonly used to infer bone quality, bone strength does not necessarily correlate well with these non-invasive measurements. This paper reports on the design, fabrication and initial testing of an implantable ultra-miniature multi-axis sensor for directly measuring bone stresses at a micro-scale. The device, which is fabricated with CMOS-MEMS processes, is intended to be permanently implanted within open fractures, or embedded in bone grafts, or placed on implants at the interfaces between bone and prosthetics. The stress sensor comprises an array of piezoresistive pixels to detect a stress tensor at the interfacial area between the MEMS chip and bone, with a resolution to 100 Pa, in 1 s averaging. The sensor system design and manufacture is also compatible with the integration of wireless RF telemetry, for power and data retrieval, all within a 3 mm × 3 mm × 0.3 mm footprint. The piezoresistive elements are integrated within a textured surface to enhance sensor integration with bone. Finite element analysis led to a sensor design for normal and shear stress detection. A wired sensor was fabricated in the Jazz 0.35 µm BiCMOS process and then embedded in mock bone material to characterize its response to tensile and bending loads up to 250 kPa.

A low-noise MEMS accelerometer for unattended ground sensor applications

NASA Astrophysics Data System (ADS)

Speller, Kevin E.; Yu, Duli

2004-09-01

A low-noise micro-machined servo accelerometer has been developed for use in Unattended Ground Sensors (UGS). Compared to conventional coil-and-magnet based velocity transducers, this Micro-Electro-Mechanical System (MEMS) accelerometer offers several key benefits for battlefield monitoring. Many UGS require a compass to determine deployment orientation with respect to magnetic North. This orientation information is critical for determining the bearing of incoming signals. Conventional sensors with sensing technology based on a permanent magnet can cause interference with a compass when used in close proximity. This problem is solved with a MEMS accelerometer which does not require any magnetic materials. Frequency information below 10 Hz is valuable for identification of signal sources. Conventional seismometers used in UGS are typically limited in frequency response from 20 to 200 Hz. The MEMS accelerometer has a flat frequency response from DC to 5 kHz. The wider spectrum of signals received improves detection, classification and monitoring on the battlefield. The DC-coupled output of the MEMS accelerometer also has the added benefit of providing tilt orientation data for the deployed UGS. Other performance parameters of the MEMS accelerometer that are important to UGS such as size, weight, shock survivability, phase response, distortion, and cross-axis rejection will be discussed. Additionally, field test data from human footsteps recorded with the MEMS accelerometer will be presented.

MEMS Integrated Submount Alignment for Optoelectronics

NASA Astrophysics Data System (ADS)

Shakespeare, W. Jeffrey; Pearson, Raymond A.; Grenestedt, Joachim L.; Hutapea, Parsaoran; Gupta, Vikas

2005-02-01

One of the most expensive and time-consuming production processes for single-mode fiber-optic components is the alignment of the photonic chip or waveguide to the fiber. The alignment equipment is capital intensive and usually requires trained technicians to achieve desired results. Current technology requires active alignment since tolerances are only ~0.2 μ m or less for a typical laser diode. This is accomplished using piezoelectric actuated stages and active optical feedback. Joining technologies such as soldering, epoxy bonding, or laser welding may contribute significant postbond shift, and final coupling efficiencies are often less than 80%. This paper presents a method of adaptive optical alignment to freeze in place directly on an optical submount using a microelectromechanical system (MEMS) shape memory alloy (SMA) actuation technology. Postbond shift is eliminated since the phase change is the alignment actuation. This technology is not limited to optical alignment but can be applied to a variety of MEMS actuations, including nano-actuation and nano-alignment for biomedical applications. Experimental proof-of-concept results are discussed, and a simple analytical model is proposed to predict the stress strain behavior of the optical submount. Optical coupling efficiencies and alignment times are compared with traditional processes. The feasibility of this technique in high-volume production is discussed.

Performance evaluation of hybrid VLC using device cost and power over data throughput criteria

NASA Astrophysics Data System (ADS)

Lee, C. C.; Tan, C. S.; Wong, H. Y.; Yahya, M. B.

2013-09-01

Visible light communication (VLC) technology has attained its attention in both academic and industry lately. It is determined by the development of light emitting diode (LED) technology for solid-state lighting (SSL).It has great potential to gradually replace radio frequency (RF) wireless technology because it offers unregulated and unlicensed bandwidth to withstand future demand of indoor wireless access to real-time bandwidth-demanding applications. However, it was found to provide intrusive uplink channel that give rise to unpleasant irradiance from the user device which could interfere with the downlink channel of VLC and hence limit mobility to users as a result of small coverage (field of view of VLC).To address this potential problem, a Hybrid VLC system which integrates VLC (for downlink) and RF (for uplink) technology is proposed. It offers a non-intrusive RF back channel that provides high throughput VLC and maintains durability with conventional RF devices. To deploy Hybrid VLC system in the market, it must be energy and cost saving to attain its equivalent economical advantage by comparing to existing architecture that employs fluorescent or LED lights with RF technology. In this paper, performance evaluation on the proposed hybrid system was carried out in terms of device cost and power consumption against data throughput. Based on our simulation, Hybrid VLC system was found to reduce device cost by 3% and power consumption by 68% when compares to fluorescent lights with RF technology. Nevertheless, when it is compared to LED lights with RF technology, our proposed hybrid system is found to achieve device cost saving as high as 47% and reduced power consumption by 49%. Such promising results have demonstrated that Hybrid VLC system is a feasible solution and has paved the way for greater cost saving and energy efficient compares with the current RF architecture even with the increasing requirement of indoor area coverage.

MEMS-Based Communications Systems for Space-Based Applications

NASA Technical Reports Server (NTRS)

DeLosSantos, Hector J.; Brunner, Robert A.; Lam, Juan F.; Hackett, Le Roy H.; Lohr, Ross F., Jr.; Larson, Lawrence E.; Loo, Robert Y.; Matloubian, Mehran; Tangonan, Gregory L.

1995-01-01

As user demand for higher capacity and flexibility in communications satellites increases, new ways to cope with the inherent limitations posed by the prohibitive mass and power consumption, needed to satisfy those requirements, are under investigation. Recent studies suggest that while new satellite architectures are necessary to enable multi-user, multi-data rate, multi-location satellite links, these new architectures will inevitably increase power consumption, and in turn, spacecraft mass, to such an extent that their successful implementation will demand novel lightweight/low power hardware approaches. In this paper, following a brief introduction to the fundamentals of communications satellites, we address the impact of micro-electro-mechanical systems (MEMS) technology, in particular micro-electro-mechanical (MEM) switches to mitigate the above mentioned problems and show that low-loss/wide bandwidth MEM switches will go a long way towards enabling higher capacity and flexibility space-based communications systems.

Evaluation of a Programmable Voltage-Controlled MEMS Oscillator, Type SiT3701, Over a Wide Temperature Range

NASA Technical Reports Server (NTRS)

Patterson, Richard; Hammoud, Ahmad

2009-01-01

Semiconductor chips based on MEMS (Micro-Electro-Mechanical Systems) technology, such as sensors, transducers, and actuators, are becoming widely used in today s electronics due to their high performance, low power consumption, tolerance to shock and vibration, and immunity to electro-static discharge. In addition, the MEMS fabrication process allows for the miniaturization of individual chips as well as the integration of various electronic circuits into one module, such as system-on-a-chip. These measures would simplify overall system design, reduce parts count and interface, improve reliability, and reduce cost; and they would meet requirements of systems destined for use in space exploration missions. In this work, the performance of a recently-developed MEMS voltage-controlled oscillator was evaluated under a wide temperature range. Operation of this new commercial-off-the-shelf (COTS) device was also assessed under thermal cycling to address some operational conditions of the space environment

New Research on MEMS Acoustic Vector Sensors Used in Pipeline Ground Markers

PubMed Central

Song, Xiaopeng; Jian, Zeming; Zhang, Guojun; Liu, Mengran; Guo, Nan; Zhang, Wendong

2015-01-01

According to the demands of current pipeline detection systems, the above-ground marker (AGM) system based on sound detection principle has been a major development trend in pipeline technology. A novel MEMS acoustic vector sensor for AGM systems which has advantages of high sensitivity, high signal-to-noise ratio (SNR), and good low frequency performance has been put forward. Firstly, it is presented that the frequency of the detected sound signal is concentrated in a lower frequency range, and the sound attenuation is relatively low in soil. Secondly, the MEMS acoustic vector sensor structure and basic principles are introduced. Finally, experimental tests are conducted and the results show that in the range of 0°∼90°, when r = 5 m, the proposed MEMS acoustic vector sensor can effectively detect sound signals in soil. The measurement errors of all angles are less than 5°. PMID:25609046

Study of the Use of Time-Mean Vortices to Generate Lift for MAV Applications

DTIC Science & Technology

2011-05-31

microplate to in-plane resonance. Computational effort centers around optimization of a range of parameters (geometry, frequency, amplitude of oscillation, etc...issue involved. Towards this end, a suspended microplate was fabricated via MEMS technology and driven to in-plane resonance via Lorentz force...force to drive the suspended MEMS-based microplate to in-plane resonance. Computational effort centers around optimization of a range of parameters

Proceedings of the International Conference on Integrated Micro/Nanotechnology for Space Applications

NASA Technical Reports Server (NTRS)

1995-01-01

The recent evolution of microelectronic technologies coupled with the growth of micro-electro-mechanical systems (MEMS) has had significant impact in the commercial sector. The focus of this conference was to anticipate and extend the incorporation of nano-electronics and MEMS into application specific integrated microinstruments (ASIM's) in space systems. Presentations ranged from mission application of nano-satellites to silicon micromachining for photonic applications.

Three-Dimensionally Printed Micro-electromechanical Switches.

PubMed

Lee, Yongwoo; Han, Jungmin; Choi, Bongsik; Yoon, Jinsu; Park, Jinhee; Kim, Yeamin; Lee, Jieun; Kim, Dae Hwan; Kim, Dong Myong; Lim, Meehyun; Kang, Min-Ho; Kim, Sungho; Choi, Sung-Jin

2018-05-09

Three-dimensional (3D) printers have attracted considerable attention from both industry and academia and especially in recent years because of their ability to overcome the limitations of two-dimensional (2D) processes and to enable large-scale facile integration techniques. With 3D printing technologies, complex structures can be created using only a computer-aided design file as a reference; consequently, complex shapes can be manufactured in a single step with little dependence on manufacturer technologies. In this work, we provide a first demonstration of the facile and time-saving 3D printing of two-terminal micro-electromechanical (MEM) switches. Two widely used thermoplastic materials were used to form 3D-printed MEM switches; freely suspended and fixed electrodes were printed from conductive polylactic acid, and a water-soluble sacrificial layer for air-gap formation was printed from poly(vinyl alcohol). Our 3D-printed MEM switches exhibit excellent electromechanical properties, with abrupt switching characteristics and an excellent on/off current ratio value exceeding 10 6 . Therefore, we believe that our study makes an innovative contribution with implications for the development of a broader range of 3D printer applications (e.g., the manufacturing of various MEM devices and sensors), and the work highlights a uniquely attractive path toward the realization of 3D-printed electronics.

Modeling of the Near Field Coupling Between an External Loop and an Implantable Spiral Chip Antennas in Biosensor Systems

NASA Technical Reports Server (NTRS)

Simons, Rainee N.; Miranda, Felix A.

2006-01-01

In this paper, the near field coupling between an external hand-held loop antenna and an implantable miniature (1x1 mm) printed square spiral chip antenna used in bio-MEMS sensors for contact-less powering and RF telemetry is investigated. The loop and the spiral are inductively coupled and effectively form a transformer. The numerical results include the quasi-stationary magnetic field pattern of the implanted antenna, near zone wave impedance as a function of the radial distance and the values of the lumped elements in the equivalent circuit model for the transformer.

A low-cost CMOS-MEMS piezoresistive accelerometer with large proof mass.

PubMed

Khir, Mohd Haris Md; Qu, Peng; Qu, Hongwei

2011-01-01

This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive sensing material. A full Wheatstone bridge was constructed through easy wiring allowed by the three metal layers in the 0.5 μm CMOS technology. The device fabrication process consisted of a standard CMOS process for sensor configuration, and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. A bulk single-crystal silicon (SCS) substrate is included in the proof mass to increase sensor sensitivity. In device design and analysis, the self heating of the polysilicon piezoresistors and its effect to the sensor performance is also discussed. With a low operating power of 1.5 mW, the accelerometer demonstrates a sensitivity of 0.077 mV/g prior to any amplification. Dynamic tests have been conducted with a high-end commercial calibrating accelerometer as reference.

Two-dimensional (2D) displacement measurement of moving objects using a new MEMS binocular vision system

NASA Astrophysics Data System (ADS)

Di, Si; Lin, Hui; Du, Ruxu

2011-05-01

Displacement measurement of moving objects is one of the most important issues in the field of computer vision. This paper introduces a new binocular vision system (BVS) based on micro-electro-mechanical system (MEMS) technology. The eyes of the system are two microlenses fabricated on a substrate by MEMS technology. The imaging results of two microlenses are collected by one complementary metal-oxide-semiconductor (CMOS) array. An algorithm is developed for computing the displacement. Experimental results show that as long as the object is moving in two-dimensional (2D) space, the system can effectively estimate the 2D displacement without camera calibration. It is also shown that the average error of the displacement measurement is about 3.5% at different object distances ranging from 10 cm to 35 cm. Because of its low cost, small size and simple setting, this new method is particularly suitable for 2D displacement measurement applications such as vision-based electronics assembly and biomedical cell culture.

MEMS-based liquid lens for capsule endoscope

NASA Astrophysics Data System (ADS)

Seo, S. W.; Han, S.; Seo, J. H.; Kim, Y. M.; Kang, M. S.; Min, N. G.; Choi, W. B.; Sung, M. Y.

2008-03-01

The capsule endoscope, a new application area of digital imaging, is growing rapidly but needs the versatile imaging capabilities such as auto-focusing and zoom-in to be an active diagnostic tool. The liquid lens based on MEMS technology can be a strong candidate because it is able to be small enough. In this paper, a cylinder-type liquid lens was designed based on Young-Lippmann model and then fabricated with MEMS technology combining the silicon thin-film process and the wafer bonding process. The focal length of the lens module including the fabricated liquid lens was changed reproducibly as a function of the applied voltage. With the change of 30V in the applied bias, the focal length of the constructed lens module could be tuned in the range of about 42cm. The fabricated liquid lens was also proven to be small enough to be adopted in the capsule endoscope, which means the liquid lens can be utilized for the imaging capability improvement of the capsule endoscope.

Space Fed Subarray Synthesis Using Displaced Feed Location

NASA Astrophysics Data System (ADS)

Mailloux, Robert J.

2002-01-01

Wideband space-fed subarray systems are often proposed for large airborne or spaceborne scanning array applications. These systems allow the introduction of time delay devices at the subarray input terminals while using phase shifters in the array face. This can sometimes reduce the number of time delayed controls by an order of magnitude or more. The implementation of this technology has been slowed because the feed network, usually a Rotman Lens or Butler Matrix, is bulky, heavy and often has significant RF loss. In addition, the large lens aperture is necessarily filled with phase shifters, and so it introduces further loss, weight, and perhaps unacceptable phase shifter control power. These systems are currently viewed with increased interest because combination of low loss, low power MEMS phase shifters in the main aperture and solid state T/R modules in the feed might lead to large scanning arrays with much higher efficiency then previously realizable. Unfortunately, the conventional system design imposes an extremely large dynamic range requirement when used in the transmit mode, and requires very high output power from the T/R modules. This paper presents one possible solution to this problem using a modified feed geometry.

Development of a high hertz-stress contact for conventional batch production using a unique scribing technology

NASA Astrophysics Data System (ADS)

Bhuiyan, M. M. I.; Alamgir, T.; Bhuiyan, M.; Kajihara, M.

2013-12-01

Gradually the electronic devices are getting more compact dimension with respect to the width and thickness. As a result, the contacts are becoming thinner and which leads the contact to be loose and unstable contact. In comercial stamping methode, connector tip diameter should be more than 300μm due to its size limitation. Consequently, the connector contact resistance is becoming higher due to weak contact force. To overcome this problem there were few more basic research using MEMS and Electro Fine Forming (EFF) technology to make high Hertz-Stress Contact (5μm) due to the limitation in the commercial stamping process and the result was in satisfactory level. However, since the MEMS and EFF fabrication is costly therefore, a new method is introduced in this paper using the commercial Phosphor Bronze stamping method to reduce the production cost. Moreover, scribing method is used to make tip on the contact. Accordingly, more compact fine pitch contact is successfully fabricated and tested with 5μm High Hertz Stress without using the MEMS and EFF technology. Hence the manufactured contact resistance becomes less than 20mΩ ±5mΩ.

Diffraction-Based Optical Switching with MEMS

DOE PAGES

Blanche, Pierre-Alexandre; LaComb, Lloyd; Wang, Youmin; ...

2017-04-19

In this article, we are presenting an overview of MEMS-based (Micro-Electro-Mechanical System) optical switch technology starting from the reflective two-dimensional (2D) and three-dimensional (3D) MEMS implementations. To further increase the speed of the MEMS from these devices, the mirror size needs to be reduced. Small mirror size prevents efficient reflection but favors a diffraction-based approach. Two implementations have been demonstrated, one using the Texas Instruments DLP (Digital Light Processing), and the other an LCoS-based (Liquid Crystal on Silicon) SLM (Spatial Light Modulator). These switches demonstrated the benefit of diffraction, by independently achieving high speed, efficiency, and high number of ports.more » We also demonstrated for the first time that PSK (Phase Shift Keying) modulation format can be used with diffraction-based devices. To be truly effective in diffraction mode, the MEMS pixels should modulate the phase of the incident light. We are presenting our past and current efforts to manufacture a new type of MEMS where the pixels are moving in the vertical direction. The original structure is a 32 x 32 phase modulator array with high contrast grating pixels, and we are introducing a new sub-wavelength linear array capable of a 310 kHz modulation rate« less

Biomimetic MEMS to assist, enhance, and expand human sensory perceptions: a survey on state-of-the-art developments

NASA Astrophysics Data System (ADS)

Makarczuk, Teresa; Matin, Tina R.; Karman, Salmah B.; Diah, S. Zaleha M.; Davaji, Benyamin; Macqueen, Mark O.; Mueller, Jeanette; Schmid, Ulrich; Gebeshuber, Ille C.

2011-06-01

The human senses are of extraordinary value but we cannot change them even if this proves to be a disadvantage in modern times. However, we can assist, enhance and expand these senses via MEMS. Current MEMS cover the range of the human sensory system, and additionally provide data about signals that are too weak for the human sensory system (in terms of signal strength) and signal types that are not covered by the human sensory system. Biomimetics deals with knowledge transfer from biology to technology. In our interdisciplinary approach existing MEMS sensor designs shall be modified and adapted (to keep costs at bay), via biomimetic knowledge transfer of outstanding sensory perception in 'best practice' organisms (e.g. thermoreception, UV sensing, electromagnetic sense). The MEMS shall then be linked to the human body (mainly ex corpore to avoid ethics conflicts), to assist, enhance and expand human sensory perception. This paper gives an overview of senses in humans and animals, respective MEMS sensors that are already on the market and gives a list of possible applications of such devices including sensors that vibrate when a blind person approaches a kerb stone edge and devices that allow divers better orientation under water (echolocation, ultrasound).

Wavelength specific excitation of gold nanoparticle thin-films

NASA Astrophysics Data System (ADS)

Lucas, Thomas M.; James, Kurtis T.; Beharic, Jasmin; Moiseeva, Evgeniya V.; Keynton, Robert S.; O'Toole, Martin G.; Harnett, Cindy K.

2014-01-01

Advances in microelectromechanical systems (MEMS) continue to empower researchers with the ability to sense and actuate at the micro scale. Thermally driven MEMS components are often used for their rapid response and ability to apply relatively high forces. However, thermally driven MEMS often have high power consumption and require physical wiring to the device. This work demonstrates a basis for designing light-powered MEMS with a wavelength specific response. This is accomplished by patterning surface regions with a thin film containing gold nanoparticles that are tuned to have an absorption peak at a particular wavelength. The heating behavior of these patterned surfaces is selected by the wavelength of laser directed at the sample. This method also eliminates the need for wires to power a device. The results demonstrate that gold nanoparticle films are effective wavelength-selective absorbers. This "hybrid" of infrared absorbent gold nanoparticles and MEMS fabrication technology has potential applications in light-actuated switches and other mechanical structures that must bend at specific regions. Deposition methods and surface chemistry will be integrated with three-dimensional MEMS structures in the next phase of this work. The long-term goal of this project is a system of light-powered microactuators for exploring cellular responses to mechanical stimuli, increasing our fundamental understanding of tissue response to everyday mechanical stresses at the molecular level.

Ball driven type MEMS SAD for artillery fuse

NASA Astrophysics Data System (ADS)

Seok, Jin Oh; Jeong, Ji-hun; Eom, Junseong; Lee, Seung S.; Lee, Chun Jae; Ryu, Sung Moon; Oh, Jong Soo

2017-01-01

The SAD (safety and arming device) is an indispensable fuse component that ensures safe and reliable performance during the use of ammunition. Because the application of electronic devices for smart munitions is increasing, miniaturization of the SAD has become one of the key issues for next-generation artillery fuses. Based on MEMS technology, various types of miniaturized SADs have been proposed and fabricated. However, none of them have been reported to have been used in actual munitions due to their lack of high impact endurance and complicated explosive train arrangements. In this research, a new MEMS SAD using a ball driven mechanism, is successfully demonstrated based on a UV LIGA (lithography, electroplating and molding) process. Unlike other MEMS SADs, both high impact endurance and simple structure were achieved by using a ball driven mechanism. The simple structural design also simplified the fabrication process and increased the processing yield. The ball driven type MEMS SAD performed successfully under the desired safe and arming conditions of a spin test and showed fine agreement with the FEM simulation result, conducted prior to its fabrication. A field test was also performed with a grenade launcher to evaluate the SAD performance in the firing environment. All 30 of the grenade samples equipped with the proposed MEMS SAD operated successfully under the high-G setback condition.

Diffraction-Based Optical Switching with MEMS

DOE Office of Scientific and Technical Information (OSTI.GOV)

Blanche, Pierre-Alexandre; LaComb, Lloyd; Wang, Youmin

In this article, we are presenting an overview of MEMS-based (Micro-Electro-Mechanical System) optical switch technology starting from the reflective two-dimensional (2D) and three-dimensional (3D) MEMS implementations. To further increase the speed of the MEMS from these devices, the mirror size needs to be reduced. Small mirror size prevents efficient reflection but favors a diffraction-based approach. Two implementations have been demonstrated, one using the Texas Instruments DLP (Digital Light Processing), and the other an LCoS-based (Liquid Crystal on Silicon) SLM (Spatial Light Modulator). These switches demonstrated the benefit of diffraction, by independently achieving high speed, efficiency, and high number of ports.more » We also demonstrated for the first time that PSK (Phase Shift Keying) modulation format can be used with diffraction-based devices. To be truly effective in diffraction mode, the MEMS pixels should modulate the phase of the incident light. We are presenting our past and current efforts to manufacture a new type of MEMS where the pixels are moving in the vertical direction. The original structure is a 32 x 32 phase modulator array with high contrast grating pixels, and we are introducing a new sub-wavelength linear array capable of a 310 kHz modulation rate« less

Impact of radiations on the electromechanical properties of materials and on the piezoresistive and capacitive transduction mechanisms used in microsystems

NASA Astrophysics Data System (ADS)

Francis, Laurent A.; Gkotsis, Petros; Kilchytska, Valeriya; Tang, Xiaohui; Druart, Sylvain; Raskin, Jean-Pierre; Flandre, Denis

2013-03-01

The impact of different types of radiation on the electromechanical properties of materials used in microfabrication and on the capacitive and piezoresistive transduction mechanisms of MEMS is investigated. MEMS technologies could revolutionize avionics, satellite and space applications provided that the stress conditions which can compromise the reliability of microsystems in these environments are well understood. Initial tests with MEMS revealed a vulnerability of some types of devices to radiation induced dielectric charging, a physical mechanism which also affects microelectronics, however integration of novel functional materials in microfabrication and the current trend to substitute SiO2 with high-k dielectrics in ICs pose new questions regarding reliability in radiation environments. The performance of MEMS devices with moving parts could also degrade due to radiation induced changes in the mechanical properties of the materials. It is thus necessary to investigate the effects of radiation on the properties of thin films used in microfabrication and here we report on tests with γ, high energy protons and fast neutrons radiation. Prototype SOI based MEMS magnetometers which were developed in UCL are also used as test vehicles to investigate radiation effects on the reliability of magnetically actuated and capacitively coupled MEMS.

Internet MEMS design tools based on component technology

NASA Astrophysics Data System (ADS)

Brueck, Rainer; Schumer, Christian

1999-03-01

The micro electromechanical systems (MEMS) industry in Europe is characterized by small and medium sized enterprises specialized on products to solve problems in specific domains like medicine, automotive sensor technology, etc. In this field of business the technology driven design approach known from micro electronics is not appropriate. Instead each design problem aims at its own, specific technology to be used for the solution. The variety of technologies at hand, like Si-surface, Si-bulk, LIGA, laser, precision engineering requires a huge set of different design tools to be available. No single SME can afford to hold licenses for all these tools. This calls for a new and flexible way of designing, implementing and distributing design software. The Internet provides a flexible manner of offering software access along with methodologies of flexible licensing e.g. on a pay-per-use basis. New communication technologies like ADSL, TV cable of satellites as carriers promise to offer a bandwidth sufficient even for interactive tools with graphical interfaces in the near future. INTERLIDO is an experimental tool suite for process specification and layout verification for lithography based MEMS technologies to be accessed via the Internet. The first version provides a Java implementation even including a graphical editor for process specification. Currently, a new version is brought into operation that is based on JavaBeans component technology. JavaBeans offers the possibility to realize independent interactive design assistants, like a design rule checking assistants, a process consistency checking assistants, a technology definition assistants, a graphical editor assistants, etc. that may reside distributed over the Internet, communicating via Internet protocols. Each potential user thus is able to configure his own dedicated version of a design tool set dedicated to the requirements of the current problem to be solved.

NASA NDE Applications for Mobile MEMS Devices and Sensors

NASA Technical Reports Server (NTRS)

Wilson, William C.; Atkinson, Gary M.; Barclay, R. O.

2008-01-01

NASA would like new devices and sensors for performing nondestructive evaluation (NDE) of aerospace vehicles. These devices must be small in size/volume, mass, and power consumption. The devices must be autonomous and mobile so they can access the internal structures of aircraft and spacecraft and adequately monitor the structural health of these craft. The platforms must be mobile in order to transport NDE sensors for evaluating structural integrity and determining whether further investigations will be required. Microelectromechanical systems (MEMS) technology is crucial to the development of the mobile platforms and sensor systems. This paper presents NASA s needs for micro mobile platforms and MEMS sensors that will enable NDE to be performed on aerospace vehicles.

An approach to optimal semi-active control of vibration energy harvesting based on MEMS

NASA Astrophysics Data System (ADS)

Rojas, Rafael A.; Carcaterra, Antonio

2018-07-01

In this paper the energy harvesting problem involving typical MEMS technology is reduced to an optimal control problem, where the objective function is the absorption of the maximum amount of energy in a given time interval from a vibrating environment. The interest here is to identify a physical upper bound for this energy storage. The mathematical tool is a new optimal control called Krotov's method, that has not yet been applied to engineering problems, except in quantum dynamics. This approach leads to identify new maximum bounds to the energy harvesting performance. Novel MEMS-based device control configurations for vibration energy harvesting are proposed with particular emphasis to piezoelectric, electromagnetic and capacitive circuits.

CAT/RF Simulation Lessons Learned

DTIC Science & Technology

2003-06-11

IVSS-2003-MAS-7 CAT /RF Simulation Lessons Learned Christopher Mocnik Vetronics Technology Area, RDECOM TARDEC Tim Lee DCS Corporation...developed a re- configurable Unmanned Ground Vehicle (UGV) simulation for the Crew integration and Automation Test bed ( CAT ) and Robotics Follower (RF...Advanced Technology Demonstration (ATD) experiments. This simulation was developed as a component of the Embedded Simulation System (ESS) of the CAT

A Hazardous Gas Detection System for Aerospace and Commercial Applications

NASA Technical Reports Server (NTRS)

Hunter, G. W.; Neudeck, P. G.; Chen, L. - Y.; Makel, D. B.; Liu, C. C.; Wu, Q. H.; Knight, D.

1998-01-01

The detection of explosive conditions in aerospace propulsion applications is important for safety and economic reasons. Microfabricated hydrogen, oxygen, and hydrocarbon sensors as well as the accompanying hardware and software are being developed for a range of aerospace safety applications. The development of these sensors is being done using MEMS (Micro ElectroMechanical Systems) based technology and SiC-based semiconductor technology. The hardware and software allows control and interrogation of each sensor head and reduces accompanying cabling through multiplexing. These systems are being applied on the X-33 and on an upcoming STS-95 Shuttle mission. A number of commercial applications are also being pursued. It is concluded that this MEMS-based technology has significant potential to reduce costs and increase safety in a variety of aerospace applications.

A Hazardous Gas Detection System for Aerospace and Commercial Applications

NASA Technical Reports Server (NTRS)

Hunter, G. W.; Neudeck, P. G.; Chen, L.-Y.; Makel, D. B.; Liu, C. C.; Wu, Q. H.; Knight, D.

1998-01-01

The detection of explosive conditions in aerospace propulsion applications is important for safety and economic reasons. Microfabricated hydrogen, oxygen, and hydrocarbon sensors as well as the accompanying hardware and software are being, developed for a range of aerospace safety applications. The development of these sensors is being done using MEMS (Micro ElectroMechanical Systems) based technology and SiC-based semiconductor technology. The hardware and software allows control and interrocation of each sensor head and reduces accompanying cabling through multiplexing. These systems are being, applied on the X-33 and on an upcoming STS-95 Shuttle mission. A number of commercial applications are also being pursued. It is concluded that this MEMS-based technology has significant potential to reduce costs and increase safety in a variety of aerospace applications.

Concept for a Micro Autonomous Ultrasonic Instrument (MAUI)

NASA Technical Reports Server (NTRS)

Wilson, William C.; Atkinson, Gary M.

2002-01-01

We investigate a concept for the construction a mobile Micro Optical ElectroMechanical Systems (MOEMS) based laser ultrasonic instrument to serve as a Micro Autonomous Ultrasonic Instrument (MAUI). The system will consist of a laser ultrasonic instrument fabricated using Micro Electro-Mechanical Systems (MEMS) technology, and a MEMS based walking platform like those developed by Pister et al. at Berkeley. This small system will allow for automated remote Non-Destructive Evaluation (NDE) of aerospace vehicles.

Programmable differential capacitance-to-voltage converter for MEMS accelerometers

NASA Astrophysics Data System (ADS)

Royo, G.; Sánchez-Azqueta, C.; Gimeno, C.; Aldea, C.; Celma, S.

2017-05-01

Capacitive MEMS sensors exhibit an excellent noise performance, high sensitivity and low power consumption. They offer a huge range of applications, being the accelerometer one of its main uses. In this work, we present the design of a capacitance-to-voltage converter in CMOS technology to measure the acceleration from the capacitance variations. It is based on a low-power, fully-differential transimpedance amplifier with low input impedance and a very low input noise.

Sandia Advanced MEMS Design Tools, Version 2.2.5

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yarberry, Victor; Allen, James; Lantz, Jeffery

2010-01-19

The Sandia National Laboratories Advanced MEMS Design Tools, Version 2.2.5, is a collection of menus, prototype drawings, and executables that provide significant productivity enhancements when using AutoCAD to design MEMS components. This release is designed for AutoCAD 2000i, 2002, or 2004 and is supported under Windows NT 4.0, Windows 2000, or XP. SUMMiT V (Sandia Ultra planar Multi level MEMS Technology) is a 5 level surface micromachine fabrication technology, which customers internal and external to Sandia can access to fabricate prototype MEMS devices. This CD contains an integrated set of electronic files that: a) Describe the SUMMiT V fabrication processmore » b) Facilitate the process of designing MEMS with the SUMMiT process (prototype file, Design Rule Checker, Standard Parts Library) New features in this version: AutoCAD 2004 support has been added. SafeExplode ? a new feature that explodes blocks without affecting polylines (avoids exploding polylines into objects that are ignored by the DRC and Visualization tools). Layer control menu ? a pull-down menu for selecting layers to isolate, freeze, or thaw. Updated tools: A check has been added to catch invalid block names. DRC features: Added username/password validation, added a method to update the user?s password. SNL_DRC_WIDTH ? a value to control the width of the DRC error lines. SNL_BIAS_VALUE ? a value use to offset selected geometry SNL_PROCESS_NAME ? a value to specify the process name Documentation changes: The documentation has been updated to include the new features. While there exist some files on the CD that are used in conjunction with software package AutoCAD, these files are not intended for use independent of the CD. Note that the customer must purchase his/her own copy of AutoCAD to use with these files.« less

Window encapsulation in car industry by using the 50 {Omega} RF technology

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bernard, J.P.; Barboteau, M.; Collet, L.

Throughout the world car industry has been using window encapsulation for a few years now. This technology is mainly used in production lines and is called RIM for polyurethane reaction injection moulding. This technology, however brings about some problems such as: glass breaking during mould closure, high production cost, systematic rough edges. The PSA Group (Peugeot-Citroen), a pioneer in this field, in collaboration with SAIREM has launched a new innovating process for window encapsulation by using the 50 {Omega} RF technology for gelling PVC Plastisol. The study was followed by an industrial prototype. Industrial equipment was then installed at WEBASTOmore » HEULIEZ for window encapsulation of the sunshine roof for the Citroen Xantia. The authors describe the principle of window encapsulation and the different existing processes. They describe the 50 {Omega} RF technology, an industrial installation and the constraints of this technology in order to get maximum efficiency. In the conclusion they present a technical and economical analysis of the different solutions for window encapsulation. They also present the advantages of the 50 {Omega} RF technology and the new opportunities it offers.« less

Temperature-dependent mechanical behavior of silicon dioxide, gold and gold-vanadium thin films for VLSI integrated circuits and MicroElectroMechanical systems (MEMs)

NASA Astrophysics Data System (ADS)

Lin, Ming-Tzer

The Semiconductor Industry has grown rapidly in the last twenty years. The national technology roadmap for semiconductors plans for developing the complexity and packing density of semiconductor devices into the next decade, allowing ever smaller and more densely packed structures to be fabricated. Recently, MEMS (Micro-Electro-Mechanical Systems) have become important in modern technology. The goal of MEMs is to integrate many types of miniature devices on a single chip, creating a new micro-world. The oxidation of silicon is one of the most important processes in semiconductor technology. Producing high-quality IC's and MEMS devices requires an understanding of the basic oxidation mechanism. In addition, for the reliability of IC's and MEMS devices, the mechanical properties of the oxide play a critical role. There has been an apparent convergence of opinion on the relevant mechanism leading to the "standard computational model" for stress effects on silicon oxidation. This model has recently become suspect. Most of the reasonably direct experimental data on the flow properties of SiO 2 thin film do not support a stress-dependent viscosity of the sort envisioned by the model. Gold and gold vanadium alloys are used in electrical interconnections and in radio frequency switch contacts for the semiconductor industry, MEMs sensors for the aerospace industry and also in brain probes by the bioelectronics mechanical industry. Despite the strong potential usage of gold and gold vanadium thin films at the small scale, very little is known about their mechanical properties. Our goal was to experimentally investigate stress and its influence on SiO2 thin films and the mechanical properties of gold and gold vanadium thin films at room temperature and at elevated temperature of different vanadium concentration. We found that the application of relatively small amounts of bending to an oxidizing silicon substrate leads to significant decreases in oxide thickness in the ultrathin oxide regime. Both tensile and compressive bending retard oxide growth, although compressive bending results in somewhat thinner oxides than does tensile bending. We also determined the modulus of gold and gold vanadium, and discovered that there is some evidence for a vanadium concentration dependence of the mechanical properties.

Microfabricated Ion Beam Drivers for Magnetized Target Fusion

NASA Astrophysics Data System (ADS)

Persaud, Arun; Seidl, Peter; Ji, Qing; Ardanuc, Serhan; Miller, Joseph; Lal, Amit; Schenkel, Thomas

2015-11-01

Efficient, low-cost drivers are important for Magnetized Target Fusion (MTF). Ion beams offer a high degree of control to deliver the required mega joules of driver energy for MTF and they can be matched to several types of magnetized fuel targets, including compact toroids and solid targets. We describe an ion beam driver approach based on the MEQALAC concept (Multiple Electrostatic Quadrupole Array Linear Accelerator) with many beamlets in an array of micro-fabricated channels. The channels consist of a lattice of electrostatic quadrupoles (ESQ) for focusing and of radio-frequency (RF) electrodes for ion acceleration. Simulations with particle-in-cell and beam envelope codes predict >10x higher current densities compared to state-of-the-art ion accelerators. This increase results from dividing the total ion beam current up into many beamlets to control space charge forces. Focusing elements can be biased taking advantage of high breakdown electric fields in sub-mm structures formed using MEMS techniques (Micro-Electro-Mechanical Systems). We will present results on ion beam transport and acceleration in MEMS based beamlets. Acknowledgments: This work is supported by the U.S. DOE under Contract No. DE-AC02-05CH11231.

Tissue tightening technologies: fact or fiction.

PubMed

Sadick, Neil

2008-01-01

Skin laxity is associated with chronological aging and exposure to solar radiation. The authors summarize the advantages and limitations of current laser, light-, and radiofrequency (RF)-based technologies purported to treat skin laxity by effecting heat-induced collagen contraction and subsequent remodeling during the months after treatment. Although penetration of laser or broadband light to the deep dermal layers is limited because of scattering of the light by epidermal melanin, a new device in which broadband infrared light is minimally scattered may overcome these limitations. RF energy offers a treatment alternative that has not only been proven to promote collagen contraction and remodeling but also is not scattered by epidermal constituents. Recently launched devices that use combinations of optical and RF energy achieve clinical benefits at lower and therefore safer levels of energy, with only mild pain and few adverse effects. A combined infrared-RF device takes maximum advantage of both optical and RF technologies to achieve the desired clinical effect. The electrooptical synergy systems have proven to be safe, effective, reliable, and user-friendly. Other more advanced powerful technologies may also be effective in this setting.

RF/optical shared aperture for high availability wideband communication RF/FSO links

DOEpatents

Ruggiero, Anthony J; Pao, Hsueh-yuan; Sargis, Paul

2014-04-29

An RF/Optical shared aperture is capable of transmitting and receiving optical signals and RF signals simultaneously. This technology enables compact wide bandwidth communications systems with 100% availability in clear air turbulence, rain and fog. The functions of an optical telescope and an RF reflector antenna are combined into a single compact package by installing an RF feed at either of the focal points of a modified Gregorian telescope.

RF/optical shared aperture for high availability wideband communication RF/FSO links

DOEpatents

Ruggiero, Anthony J; Pao, Hsueh-yuan; Sargis, Paul

2015-03-24

An RF/Optical shared aperture is capable of transmitting and receiving optical signals and RF signals simultaneously. This technology enables compact wide bandwidth communications systems with 100% availability in clear air turbulence, rain and fog. The functions of an optical telescope and an RF reflector antenna are combined into a single compact package by installing an RF feed at either of the focal points of a modified Gregorian telescope.

Poly-SiGe MEMS actuators for adaptive optics

NASA Astrophysics Data System (ADS)

Lin, Blake C.; King, Tsu-Jae; Muller, Richard S.

2006-01-01

Many adaptive optics (AO) applications require mirror arrays with hundreds to thousands of segments, necessitating a CMOS-compatible MEMS process to integrate the mirrors with their driving electronics. This paper proposes a MEMS actuator that is fabricated using low-temperature polycrystalline silicon-germanium (poly-SiGe) surface-micromaching technology (total thermal budget is 6 hours at or below 425°C). The MEMS actuator consists of three flexures and a hexagonal platform, on which a micromirror is to be assembled. The flexures are made of single-layer poly-SiGe with stress gradient across thickness of the film, making them bend out-of-plane after sacrificial-layer release to create a large nominal gap. The platform, on the other hand, has an additional stress-balancing SiGe layer deposited on top, making the dual-layer stack stay flat after release. Using this process, we have successfully fabricated the MEMS actuator which is lifted 14.6 μm out-of-plane by 290-μm-long flexures. The 2-μm-thick hexagonal mirror-platform exhibits a strain gradient of -5.5×10 -5 μm -1 (equivalent to 18 mm radius-of-curvature), which would be further reduced once the micromirror is assembled.

Producing fluid flow using 3D carbon electrodes

NASA Astrophysics Data System (ADS)

Rouabah, H. A.; Park, B. Y.; Zaouk, R. B.; Madou, M. J.; Green, Nicolas G.

2008-12-01

Moving and manipulating bio-particles and fluids on the microscale is central to many lab-on-a-chip applications. Techniques for pumping fluids which use electric fields have shown promise using both DC and AC voltages. AC techniques, however, require the use of integrated metal electrodes which have a low resistance but can suffer from unwanted chemical reactions even at low potentials. In this paper we introduce the use of carbon MEMS technology (C-MEMS), a fabrication method which produces 3D conductive polymeric structures. Results are presented of the fabrication of an innovative design of 3D AC-electroosmotic micropump and preliminary experimental measurements which demonstrate the potential of both the technology and the design.

A novel safety device with metal counter meshing gears discriminator directly driven by axial flux permanent magnet micromotors based on MEMS technology

NASA Astrophysics Data System (ADS)

Zhang, Weiping; Chen, Wenyuan; Zhao, Xiaolin; Li, Shengyong; Jiang, Yong

2005-08-01

In a novel safety device based on MEMS technology for high consequence systems, the discriminator consists of two groups of metal counter meshing gears and two pawl/ratchet wheel mechanisms. Each group of counter meshing gears is onepiece and driven directly by an axial flux permanent magnet micromotor respectively. The energy-coupling element is an optical shutter with two collimators and a coupler wheel. The safety device's probability is less than 1/106. It is fabricated by combination of an LiGA-like process and precision mechanical engineering. The device has simple structure, few dynamic problems, high strength and strong reliability.

Faster sensitivity and non-antimonite permanent photoresist for MEMS

NASA Astrophysics Data System (ADS)

Misumi, Koichi; Saito, Koji; Yamanouchi, Atsushi; Senzaki, Takahiro; Okui, Toshiki; Honma, Hideo

2006-03-01

Micro Electro Mechanical Systems (MEMS) is a three-dimensional micro-fabrication technology based on photolithography. The fields of application are extensive and wide-ranging. Among the applications, those that have already acquired a large market include acceleration sensors for airbags of automobiles, pressure sensors for engine control, inkjet printer heads and thin film magnetic heads. The market is expected to further expand in the optic and biology-related fields in the future. In the MEMS field, the packaging accounts for the cost, and it is difficult to standardize due to the low production volume of highly specific technology application. A typical application in the MEMS process would be to conduct plating and etching (Deep RIE) through an intermediate layer of photoresist patterns, but there are cases where the photoresist itself is left therein as a permanent film. A photoresist composed of epoxy resin as the main component can form the permanent film through a catalyst of the optical cationic polymerizating initiator. In general, the optical cationic polymerizating initiator is of onium salt with antimonite as the anion group due to the nature of the hardening rate or the exposure energy. This paper presents the development status of a high sensitivity permanent photoresist made of epoxy resin as the main component with non-antimonite optical cationic polymerizating initiator with concerns to the impact to the environment and material for packaging.

MEMS capacitive accelerometer-based middle ear microphone.

PubMed

Young, Darrin J; Zurcher, Mark A; Semaan, Maroun; Megerian, Cliff A; Ko, Wen H

2012-12-01

The design, implementation, and characterization of a microelectromechanical systems (MEMS) capacitive accelerometer-based middle ear microphone are presented in this paper. The microphone is intended for middle ear hearing aids as well as future fully implantable cochlear prosthesis. Human temporal bones acoustic response characterization results are used to derive the accelerometer design requirements. The prototype accelerometer is fabricated in a commercial silicon-on-insulator (SOI) MEMS process. The sensor occupies a sensing area of 1 mm × 1 mm with a chip area of 2 mm × 2.4 mm and is interfaced with a custom-designed low-noise electronic IC chip over a flexible substrate. The packaged sensor unit occupies an area of 2.5 mm × 6.2 mm with a weight of 25 mg. The sensor unit attached to umbo can detect a sound pressure level (SPL) of 60 dB at 500 Hz, 35 dB at 2 kHz, and 57 dB at 8 kHz. An improved sound detection limit of 34-dB SPL at 150 Hz and 24-dB SPL at 500 Hz can be expected by employing start-of-the-art MEMS fabrication technology, which results in an articulation index of approximately 0.76. Further micro/nanofabrication technology advancement is needed to enhance the microphone sensitivity for improved understanding of normal conversational speech.

A Compact and Low-Cost MEMS Loudspeaker for Digital Hearing Aids.

PubMed

Sang-Soo Je; Rivas, F; Diaz, R E; Jiuk Kwon; Jeonghwan Kim; Bakkaloglu, B; Kiaei, S; Junseok Chae

2009-10-01

A microelectromechanical-systems (MEMS)-based electromagnetically actuated loudspeaker to reduce form factor, cost, and power consumption, and increase energy efficiency in hearing-aid applications is presented. The MEMS loudspeaker has multilayer copper coils, an NiFe soft magnet on a thin polyimide diaphragm, and an NdFeB permanent magnet on the perimeter. The coil impedance is measured at 1.5 Omega, and the resonant frequency of the diaphragm is located far from the audio frequency range. The device is driven by a power-scalable, 0.25-mum complementary metal-oxide semiconductor class-D SigmaDelta amplifier stage. The class-D amplifier is formed by a differential H-bridge driven by a single bit, pulse-density-modulated SigmaDelta bitstream at a 1.2-MHz clock rate. The fabricated MEMS loudspeaker generates more than 0.8-mum displacement, equivalent to 106-dB sound pressure level (SPL), with 0.13-mW power consumption. Driven by the SigmaDelta class-D amplifier, the MEMS loudspeaker achieves measured 65-dB total harmonic distortion (THD) with a measurement uncertainty of less than 10%. Energy-efficient and cost-effective advanced hearing aids would benefit from further miniaturization via MEMS technology. The results from this study appear very promising for developing a compact, mass-producible, low-power loudspeaker with sufficient sound generation for hearing-aid applications.

Modeling methods of MEMS micro-speaker with electrostatic working principle

NASA Astrophysics Data System (ADS)

Tumpold, D.; Kaltenbacher, M.; Glacer, C.; Nawaz, M.; Dehé, A.

2013-05-01

The market for mobile devices like tablets, laptops or mobile phones is increasing rapidly. Device housings get thinner and energy efficiency is more and more important. Micro-Electro-Mechanical-System (MEMS) loudspeakers, fabricated in complementary metal oxide semiconductor (CMOS) compatible technology merge energy efficient driving technology with cost economical fabrication processes. In most cases, the fabrication of such devices within the design process is a lengthy and costly task. Therefore, the need for computer modeling tools capable of precisely simulating the multi-field interactions is increasing. The accurate modeling of such MEMS devices results in a system of coupled partial differential equations (PDEs) describing the interaction between the electric, mechanical and acoustic field. For the efficient and accurate solution we apply the Finite Element (FE) method. Thereby, we fully take the nonlinear effects into account: electrostatic force, charged moving body (loaded membrane) in an electric field, geometric nonlinearities and mechanical contact during the snap-in case between loaded membrane and stator. To efficiently handle the coupling between the mechanical and acoustic fields, we apply Mortar FE techniques, which allow different grid sizes along the coupling interface. Furthermore, we present a recently developed PML (Perfectly Matched Layer) technique, which allows limiting the acoustic computational domain even in the near field without getting spurious reflections. For computations towards the acoustic far field we us a Kirchhoff Helmholtz integral (e.g, to compute the directivity pattern). We will present simulations of a MEMS speaker system based on a single sided driving mechanism as well as an outlook on MEMS speakers using double stator systems (pull-pull-system), and discuss their efficiency (SPL) and quality (THD) towards the generated acoustic sound.

Microelectromechanical systems for experimental physics and optical telecommunications

NASA Astrophysics Data System (ADS)

Aksyuk, Vladimir Anatolyevich

1999-12-01

Micro-Electro-Mechanical Systems (MEMS) are an emerging technology, which, when applied to the field of physical sensors, offers not only an obvious advantage of being small and cheap, but more importantly, provides some unique experimental opportunities. These are based on the way physical properties scale with decreasing size. This thesis discusses these basic principles and corresponding advantages and limitations of MEMS technology and presents several experiments in which micromachines are used to do physical measurements that could not be done before. Three types of micromechanical magnetometers are demonstrated. When compared to the state of the art traditional techniques they show greater sensitivity, faster response and can be applied over a wider range of experimental conditions. The high-Q micromechanical torsional oscillator magnetometer is used to observe mesoscopic vortex physics, including single flux lines penetrating into a type-II superconductor just above the first critical field. The Faraday balance ``Trampoline'' magnetometer combines high sensitivity, high bandwidth and can be operated in a wide temperature range. It is used in both high pulsed magnetic fields to record deHaas-vanAlphen oscillations and in DC magnetic fields for magnetization measurements at temperatures down to 100mK. The high sensitivity DC torque magnetometer offers yet higher sensitivity and can be used for a variety of magnetization measurements. Several other MEMS devices for physics and telecommunications applications are presented, including a micromachined near field scanning optical microscope, MEMS fiberoptic switches and large-area large-angle scanners. They provide examples of complex functionality that can be achieved with micromechanics by combining sensors with inherently low-power electrostatic actuators. The optically powered optical power limiter demonstrates the possibility of operating MEMS with optical rather than electrical power.

Finite Element Modeling of Micromachined MEMS Photon Devices

DOE Office of Scientific and Technical Information (OSTI.GOV)

Datskos, P.G.; Evans, B.M.; Schonberger, D.

1999-09-20

The technology of microelectronics that has evolved over the past half century is one of great power and sophistication and can now be extended to many applications (MEMS and MOEMS) other than electronics. An interesting application of MEMS quantum devices is the detection of electromagnetic radiation. The operation principle of MEMS quantum devices is based on the photoinduced stress in semiconductors, and the photon detection results from the measurement of the photoinduced bending. These devices can be described as micromechanical photon detectors. In this work, we have developed a technique for simulating electronic stresses using finite element analysis. We havemore » used our technique to model the response of micromechanical photon devices to external stimuli and compared these results with experimental data. Material properties, geometry, and bimaterial design play an important role in the performance of micromechanical photon detectors. We have modeled these effects using finite element analysis and included the effects of bimaterial thickness coating, effective length of the device, width, and thickness.« less

Development of High Precision Metal Micro-Electro-Mechanical-Systems Column for Portable Surface Acoustic Wave Gas Chromatograph

NASA Astrophysics Data System (ADS)

Iwaya, Takamitsu; Akao, Shingo; Sakamoto, Toshihiro; Tsuji, Toshihiro; Nakaso, Noritaka; Yamanaka, Kazushi

2012-07-01

In the field of environmental measurement and security, a portable gas chromatograph (GC) is required for the on-site analysis of multiple hazardous gases. Although the gas separation column has been downsized using micro-electro-mechanical-systems (MEMS) technology, an MEMS column made of silicon and glass still does not have sufficient robustness and a sufficiently low fabrication cost for a portable GC. In this study, we fabricated a robust and inexpensive high-precision metal MEMS column by combining diffusion-bonded etched stainless-steel plates with alignment evaluation using acoustic microscopy. The separation performance was evaluated using a desktop GC with a flame ionization detector and we achieved the high separation performance comparable to the best silicon MEMS column fabricated using a dynamic coating method. As an application, we fabricated a palm-size surface acoustic wave (SAW) GC combining this column with a ball SAW sensor and succeeded in separating and detecting a mixture of volatile organic compounds.

Finite element modeling of micromachined MEMS photon devices

NASA Astrophysics Data System (ADS)

Evans, Boyd M., III; Schonberger, D. W.; Datskos, Panos G.

1999-09-01

The technology of microelectronics that has evolved over the past half century is one of great power and sophistication and can now be extended to many applications (MEMS and MOEMS) other than electronics. An interesting application of MEMS quantum devices is the detection of electromagnetic radiation. The operation principle of MEMS quantum devices is based on the photoinduced stress in semiconductors, and the photon detection results from the measurement of the photoinduced bending. These devices can be described as micromechanical photon detectors. In this work, we have developed a technique for simulating electronic stresses using finite element analysis. We have used our technique to model the response of micromechanical photon devices to external stimuli and compared these results with experimental data. Material properties, geometry, and bimaterial design play an important role in the performance of micromechanical photon detectors. We have modeled these effects using finite element analysis and included the effects of bimaterial thickness coating, effective length of the device, width, and thickness.

High Volume Manufacturing and Field Stability of MEMS Products

NASA Astrophysics Data System (ADS)

Martin, Jack

Low volume MEMS/NEMS production is practical when an attractive concept is implemented with business, manufacturing, packaging, and test support. Moving beyond this to high volume production adds requirements on design, process control, quality, product stability, market size, market maturity, capital investment, and business systems. In a broad sense, this chapter uses a case study approach: It describes and compares the silicon-based MEMS accelerometers, pressure sensors, image projection systems, and gyroscopes that are in high volume production. Although they serve several markets, these businesses have common characteristics. For example, the manufacturing lines use automated semiconductor equipment and standard material sets to make consistent products in large quantities. Standard, well controlled processes are sometimes modified for a MEMS product. However, novel processes that cannot run with standard equipment and material sets are avoided when possible. This reliance on semiconductor tools, as well as the organizational practices required to manufacture clean, particle-free products partially explains why the MEMS market leaders are integrated circuit manufacturers. There are other factors. MEMS and NEMS are enabling technologies, so it can take several years for high volume applications to develop. Indeed, market size is usually a strong function of price. This becomes a vicious circle, because low price requires low cost - a result that is normally achieved only after a product is in high volume production. During the early years, IC companies reduced cost and financial risk by using existing facilities for low volume MEMS production. As a result, product architectures are partially determined by capabilities developed for previous products. This chapter includes a discussion of MEMS product architecture with particular attention to the impact of electronic integration, packaging, and surfaces. Packaging and testing are critical, because they are significant factors in MEMS product cost. These devices have extremelyhigh surface/volume ratios, so performance and stability may depend on the control of surface characteristics after packaging. Looking into the future, the competitive advantage of IC suppliers will decrease as small companies learn to integrate MEMS/NEMS devices on CMOS foundry wafers. Packaging challenges still remain, because most MEMS/NEMS products must interact with the environment without degrading stability or reliability. Generic packaging solutions are unlikely. However, packaging subcontractors recognize that MEMS/NEMS is a growth opportunity. They will spread the overhead burden of high-capital-cost-facilities by developing flexible processes in order to package several types of moderate volume integrated MEMS/NEMS products on the same equipment.

High Volume Manufacturing and Field Stability of MEMS Products

NASA Astrophysics Data System (ADS)

Martin, Jack

Low volume MEMS/NEMS production is practical when an attractive concept is implemented with business, manufacturing, packaging, and test support. Moving beyond this to high volume production adds requirements on design, process control, quality, product stability, market size, market maturity, capital investment, and business systems. In a broad sense, this chapter uses a case study approach: It describes and compares the silicon-based MEMS accelerometers, pressure sensors, image projection systems, and gyroscopes that are in high volume production. Although they serve several markets, these businesses have common characteristics. For example, the manufacturing lines use automated semiconductor equipment and standard material sets to make consistent products in large quantities. Standard, well controlled processes are sometimes modified for a MEMS product. However, novel processes that cannot run with standard equipment and material sets are avoided when possible. This reliance on semiconductor tools, as well as the organizational practices required to manufacture clean, particle-free products partially explains why the MEMS market leaders are integrated circuit manufacturers. There are other factors. MEMS and NEMS are enabling technologies, so it can take several years for high volume applications to develop. Indeed, market size is usually a strong function of price. This becomes a vicious circle, because low price requires low cost - a result that is normally achieved only after a product is in high volume production. During the early years, IC companies reduced cost and financial risk by using existing facilities for low volume MEMS production. As a result, product architectures are partially determined by capabilities developed for previous products. This chapter includes a discussion of MEMS product architecture with particular attention to the impact of electronic integration, packaging, and surfaces. Packaging and testing are critical, because they are significant factors in MEMS product cost. These devices have extremely high surface/volume ratios, so performance and stability may depend on the control of surface characteristics after packaging. Looking into the future, the competitive advantage of IC suppliers will decrease as small companies learn to integrate MEMS/NEMS devices on CMOS foundry wafers. Packaging challenges still remain, because most MEMS/NEMS products must interact with the environment without degrading stability or reliability. Generic packaging solutions are unlikely. However, packaging subcontractors recognize that MEMS/NEMS is a growth opportunity. They will spread the overhead burden of high-capital-cost-facilities by developing flexible processes in order to package several types of moderate volume integrated MEMS/NEMS products on the same equipment.

[A micro-silicon multi-slit spectrophotometer based on MEMS technology].

PubMed

Hao, Peng; Wu, Yi-Hui; Zhang, Ping; Liu, Yong-Shun; Zhang, Ke; Li, Hai-Wen

2009-06-01

A new mini-spectrophotometer was developed by adopting micro-silicon slit and pixel segmentation technology, and this spectrophotometer used photoelectron diode array as the detector by the back-dividing-light way. At first, the effect of the spectral bandwidth on the tested absorbance linear correlation was analyzed. A theory for the design of spectrophotometer's slit was brought forward after discussing the relationships between spectrophotometer spectrum band width and pre-and post-slits width. Then, the integrative micro-silicon-slit, which features small volume, high precision, and thin thickness, was manufactured based on the MEMS technology. Finally, a test was carried on linear absorbance solution by this spectrophotometer. The final result showed that the correlation coefficients were larger than 0.999, which means that the new mini-spectrophotometer with micro-silicon slit pixel segmentation has an obvious linear correlation.

Design and Fabrication of a Miniaturized GMI Magnetic Sensor Based on Amorphous Wire by MEMS Technology

PubMed Central

Chen, Jiawen; Li, Jianhua; Li, Yiyuan; Chen, Yulong

2018-01-01

A miniaturized Co-based amorphous wire GMI (Giant magneto-impedance) magnetic sensor was designed and fabricated in this paper. The Co-based amorphous wire was used as the sense element due to its high sensitivity to the magnetic field. A three-dimensional micro coil surrounding the Co-based amorphous wire was fabricated by MEMS (Micro-Electro-Mechanical System) technology, which was used to extract the electrical signal. The three-dimensional micro pick-up coil was designed and simulated with HFSS (High Frequency Structure Simulator) software to determine the key parameters. Surface micro machining MEMS (Micro-Electro-Mechanical System) technology was employed to fabricate the three-dimensional coil. The size of the developed amorphous wire magnetic sensor is 5.6 × 1.5 × 1.1 mm3. Helmholtz coil was used to characterize the performance of the device. The test results of the sensor sample show that the voltage change is 130 mV/Oe and the linearity error is 4.83% in the range of 0~45,000 nT. The results indicate that the developed miniaturized magnetic sensor has high sensitivity. By testing the electrical resistance of the samples, the results also showed high uniformity of each device. PMID:29494477

MEMS packaging: state of the art and future trends

NASA Astrophysics Data System (ADS)

Bossche, Andre; Cotofana, Carmen V. B.; Mollinger, Jeff R.

1998-07-01

Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.

MEMS Technology for Space Applications

NASA Technical Reports Server (NTRS)

vandenBerg, A.; Spiering, V. L.; Lammerink, T. S. J.; Elwenspoek, M.; Bergveld, P.

1995-01-01

Micro-technology enables the manufacturing of all kinds of components for miniature systems or micro-systems, such as sensors, pumps, valves, and channels. The integration of these components into a micro-electro-mechanical system (MEMS) drastically decreases the total system volume and mass. These properties, combined with the increasing need for monitoring and control of small flows in (bio)chemical experiments, makes MEMS attractive for space applications. The level of integration and applied technology depends on the product demands and the market. The ultimate integration is process integration, which results in a one-chip system. An example of process integration is a dosing system of pump, flow sensor, micromixer, and hybrid feedback electronics to regulate the flow. However, for many applications, a hybrid integration of components is sufficient and offers the advantages of design flexibility and even the exchange of components in the case of a modular set up. Currently, we are working on hybrid integration of all kinds of sensors (physical and chemical) and flow system modules towards a modular system; the micro total analysis system (micro TAS). The substrate contains electrical connections as in a printed circuit board (PCB) as well as fluid channels for a circuit channel board (CCB) which, when integrated, form a mixed circuit board (MCB).

Application of MEMS Microphone Array Technology to Airframe Noise Measurements

NASA Technical Reports Server (NTRS)

Humphreys, William M., Jr.; Shams, Qamar A.; Graves, Sharon S.; Sealey, Bradley S.; Bartram, Scott M.; Comeaux, Toby

2005-01-01

Current generation microphone directional array instrumentation is capable of extracting accurate noise source location and directivity data on a variety of aircraft components, resulting in significant gains in test productivity. However, with this gain in productivity has come the desire to install larger and more complex arrays in a variety of ground test facilities, creating new challenges for the designers of array systems. To overcome these challenges, a research study was initiated to identify and develop hardware and fabrication technologies which could be used to construct an array system exhibiting acceptable measurement performance but at much lower cost and with much simpler installation requirements. This paper describes an effort to fabricate a 128-sensor array using commercially available Micro-Electro-Mechanical System (MEMS) microphones. The MEMS array was used to acquire noise data for an isolated 26%-scale high-fidelity Boeing 777 landing gear in the Virginia Polytechnic Institute and State University Stability Tunnel across a range of Mach numbers. The overall performance of the array was excellent, and major noise sources were successfully identified from the measurements.

Operational characterization of CSFH MEMS technology based hinges

NASA Astrophysics Data System (ADS)

Crescenzi, Rocco; Balucani, Marco; Belfiore, Nicola Pio

2018-05-01

Progress in MEMS technology continuously stimulates new developments in the mechanical structure of micro systems, such as, for example, the concept of so-called CSFH (conjugate surfaces flexural hinge), which makes it possible, simultaneously, to minimize the internal stresses and to increase motion range and robustness. Such a hinge may be actuated by means of a rotary comb-drive, provided that a proper set of simulations and tests are capable to assess its feasibility. In this paper, a CSFH has been analyzed with both theoretical and finite element (FEM) methods, in order to obtain the relation between voltage and generated torque. The FEM model considers also the fringe effect on the comb drive finger. Electromechanical couple-field analysis is performed by means of both direct and load transfer methods. Experimental tests have been also performed on a CSFH embedded in a MEMS prototype, which has been fabricated starting from a SOI wafer and using D-RIE (deep reactive ion etching). Results showed that CSFH performs better than linear flexure hinges in terms of larger rotations and less stress for given applied voltage.

A Low-Cost CMOS-MEMS Piezoresistive Accelerometer with Large Proof Mass

PubMed Central

Khir, Mohd Haris Md; Qu, Peng; Qu, Hongwei

2011-01-01

This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive sensing material. A full Wheatstone bridge was constructed through easy wiring allowed by the three metal layers in the 0.5 μm CMOS technology. The device fabrication process consisted of a standard CMOS process for sensor configuration, and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. A bulk single-crystal silicon (SCS) substrate is included in the proof mass to increase sensor sensitivity. In device design and analysis, the self heating of the polysilicon piezoresistors and its effect to the sensor performance is also discussed. With a low operating power of 1.5 mW, the accelerometer demonstrates a sensitivity of 0.077 mV/g prior to any amplification. Dynamic tests have been conducted with a high-end commercial calibrating accelerometer as reference. PMID:22164052

V-22 Osprey Joint Services Advanced Vertical Lift Aircraft (V-22)

DTIC Science & Technology

2015-12-01

Be Determined TY - Then Year UCR - Unit Cost Reporting U.S. - United States USD(AT&L) - Under Secretary of Defense (Acquisition, Technology and...Rotor Operational Enviroment DECM SIRFC w/RF Jamming DIRCM SIRFC w/RF Jamming DIRCM SIRFC w/RWR, MW, CMDS SIRFC w/RF, Jamming DIRCM SIRFC w/RF

Novel Three-Dimensional Vertical Interconnect Technology for Microwave and RF Applications

NASA Technical Reports Server (NTRS)

Goverdhanam, Kavita; Simons, Rainee N.; Katehi, Linda P. B.

1999-01-01

In this paper, novel 3D interconnects suitable for applications in microwave and RF integrated circuit technology have been presented. The interconnect fabrication process and design details are presented. In addition, measured and numerically modeled results of the performance of the interconnects have been shown. The results indicate that the proposed technology has tremendous potential applications in integrated circuit technology. C,

Non-Ionizing Radiation From Wireless Technology| RadTown ...

EPA Pesticide Factsheets

2017-10-31

Cell phones emit radio frequency (RF) energy. The Federal Communications Commission (FCC) sets safety guidelines to limit RF exposure from wireless devices. Scientists continue to study the effects of long-term exposure to low levels of RF.

Imaging of the native inversion layer in Silicon-On-Insulator wafers via Scanning Surface Photovoltage: Implications for RF device performance

NASA Astrophysics Data System (ADS)

Dahanayaka, Daminda; Wong, Andrew; Kaszuba, Philip; Moszkowicz, Leon; Slinkman, James; IBM SPV Lab Team

2014-03-01

Silicon-On-Insulator (SOI) technology has proved beneficial for RF cell phone technologies, which have equivalent performance to GaAs technologies. However, there is evident parasitic inversion layer under the Buried Oxide (BOX) at the interface with the high resistivity Si substrate. The latter is inferred from capacitance-voltage measurements on MOSCAPs. The inversion layer has adverse effects on RF device performance. We present data which, for the first time, show the extent of the inversion layer in the underlying substrate. This knowledge has driven processing techniques to suppress the inversion.

Hybrid Radio Frequency/Free-Space Optics (RF/FSO) Wireless Sensor Network: Security Concerns and Protective Measures

NASA Astrophysics Data System (ADS)

Banerjee, Koushik; Sharma, Hemant; Sengupta, Anasuya

Wireless sensor networks (WSNs) are ad hoc wireless networks that are written off as spread out structure and ad hoc deployment. Sensor networks have all the rudimentary features of ad hoc networks but to altered points—for instance, considerably lesser movement and far more energy necessities. Commonly used technology for communication is radio frequency (RF) communications. Free-space optics (FSO) is relatively new technology which has the prospective to deliver remarkable increases in network lifetime of WSN. Hybrid RF/FSO communications has been suggested to decrease power consumption by a single sensor node. It is observed that security plays a very important role for either RF WSN or hybrid RF/FSO WSN as those are vulnerable to numerous threats. In this paper, various possible attacks in RF/FSO WSN are discussed and aimed to propose some way out from those attacks.

Radio frequency energy for non-invasive and minimally invasive skin tightening.

PubMed

Mulholland, R Stephen

2011-07-01

This article reviews the non-invasive and minimally invasive options for skin tightening, focusing on peer-reviewed articles and presentations and those technologies with the most proven or promising RF non-excisional skin-tightening results for excisional surgeons. RF has been the mainstay of non-invasive skin tightening and has emerged as the "cutting edge" technology in the minimally invasive skin-tightening field. Because these RF skin-tightening technologies are capital equipment purchases with a significant cost associated, this article also discusses some business issues and models that have proven to work in the plastic surgeon's office for non-invasive and minimally invasive skin-tightening technologies. Copyright © 2011 Elsevier Inc. All rights reserved.

Micro-Raman Analysis of Irradiated Diamond Films

NASA Technical Reports Server (NTRS)

Newton, R. L.; Munafo, Paul M. (Technical Monitor)

2002-01-01

Owing to its unique and robust physical properties, diamond is a much sought after material for use in advanced technologies such as Microelectromechanical Systems (MEMS). The volume and weight savings promised by MEMS-based devices are of particular interest to spaceflight applications. However, much basic materials science research remains to be completed in this field. Results of micro-Raman analysis of proton (1015 - 1017 H+/cm2 doses) irradiated chemical vapor deposited (CVD) diamond reveals that the microstructure is retained even after high radiation exposure.

New technologies for the actuation and controls of large aperture lightweight quality mirrors

NASA Technical Reports Server (NTRS)

Lih, S. S.; Yang, E. H.; Gullapalli, S. N.; Flood, R.

2003-01-01

This paper presents a set of candidate components: MEMS based large stroke (>100 microns) ultra lightweight (0.01 gm) discrete inch worm actuator technology, and a distributed actuator technology, in the context of a novel lightweight active flexure-hinged substrate concept that uses the nanolaminate face sheet.

GRC-2011-C-00579

NASA Image and Video Library

2007-03-28

Photos for Web Feature by Victoria (Tori) Woods; Micro-Electro Mechanical Systems (MEMS) using vacuum technology; fabricating High Temperature Electronics for Harsh Environments using silicon carbide substrates

MEMS-based platforms for mechanical manipulation and characterization of cells

NASA Astrophysics Data System (ADS)

Pan, Peng; Wang, Wenhui; Ru, Changhai; Sun, Yu; Liu, Xinyu

2017-12-01

Mechanical manipulation and characterization of single cells are important experimental techniques in biological and medical research. Because of the microscale sizes and highly fragile structures of cells, conventional cell manipulation and characterization techniques are not accurate and/or efficient enough or even cannot meet the more and more demanding needs in different types of cell-based studies. To this end, novel microelectromechanical systems (MEMS)-based technologies have been developed to improve the accuracy, efficiency, and consistency of various cell manipulation and characterization tasks, and enable new types of cell research. This article summarizes existing MEMS-based platforms developed for cell mechanical manipulation and characterization, highlights their specific design considerations making them suitable for their designated tasks, and discuss their advantages and limitations. In closing, an outlook into future trends is also provided.

Internal Model-Based Robust Tracking Control Design for the MEMS Electromagnetic Micromirror.

PubMed

Tan, Jiazheng; Sun, Weijie; Yeow, John T W

2017-05-26

The micromirror based on micro-electro-mechanical systems (MEMS) technology is widely employed in different areas, such as scanning, imaging and optical switching. This paper studies the MEMS electromagnetic micromirror for scanning or imaging application. In these application scenarios, the micromirror is required to track the command sinusoidal signal, which can be converted to an output regulation problem theoretically. In this paper, based on the internal model principle, the output regulation problem is solved by designing a robust controller that is able to force the micromirror to track the command signal accurately. The proposed controller relies little on the accuracy of the model. Further, the proposed controller is implemented, and its effectiveness is examined by experiments. The experimental results demonstrate that the performance of the proposed controller is satisfying.

Internal Model-Based Robust Tracking Control Design for the MEMS Electromagnetic Micromirror

PubMed Central

Tan, Jiazheng; Sun, Weijie; Yeow, John T. W.

2017-01-01

The micromirror based on micro-electro-mechanical systems (MEMS) technology is widely employed in different areas, such as scanning, imaging and optical switching. This paper studies the MEMS electromagnetic micromirror for scanning or imaging application. In these application scenarios, the micromirror is required to track the command sinusoidal signal, which can be converted to an output regulation problem theoretically. In this paper, based on the internal model principle, the output regulation problem is solved by designing a robust controller that is able to force the micromirror to track the command signal accurately. The proposed controller relies little on the accuracy of the model. Further, the proposed controller is implemented, and its effectiveness is examined by experiments. The experimental results demonstrate that the performance of the proposed controller is satisfying. PMID:28587105

Dynamic focus-tracking MEMS scanning micromirror with low actuation voltages for endoscopic imaging.

PubMed

Strathman, Matthew; Liu, Yunbo; Li, Xingde; Lin, Lih Y

2013-10-07

We demonstrate a 3-D scanning micromirror device that combines 2-D beam scanning with focus control in the same device using micro-electro-mechanical-systems (MEMS) technology. 2-D beam scanning is achieved with a biaxial gimbal structure and focus control is obtained with a deformable mirror membrane surface. The micromirror with 800 micrometer diameter is designed to be sufficiently compact and efficient so that it can be incorporated into an endoscopic imaging probe in the future. The design, fabrication and characterization of the device are described in this paper. Using the focus-tracking MEMS scanning mirror, we achieved an optical scanning range of >16 degrees with <40 V actuation voltage at resonance and a tunable focal length between infinity and 25 mm with <100V applied bias.

Method for measuring thermal accommodation coefficients of gases on thin film surfaces using a MEMS sensor structure

DOE Office of Scientific and Technical Information (OSTI.GOV)

Grau, Mario, E-mail: mario.grau@hs-rm.de; Völklein, Friedemann; Meier, Andreas

A method for measuring the thermal accommodation coefficient α for surface-/gas interfaces is presented. It allows the determination of α for thin films produced by a variety of deposition technologies, such as chemical vapor deposition, physical vapor deposition, and atomic layer deposition (ALD). The setup is based on two microelectromechanical systems (MEMS) Pirani sensors facing each other in a defined positioning. Because these MEMS sensors show a very high sensitivity in their individual molecular flow regimes, it is possible to measure the accommodation coefficients of gases without the disturbing influence of the transition regime. This paper presents the analytical backgroundmore » and the actual measurement principle. The results for air and nitrogen molecules on sputtered Au and Pt surfaces are presented.« less

Three Axes MEMS Combined Sensor for Electronic Stability Control System

NASA Astrophysics Data System (ADS)

Jeong, Heewon; Goto, Yasushi; Aono, Takanori; Nakamura, Toshiaki; Hayashi, Masahide

A microelectromechanical systems (MEMS) combined sensor measuring two-axis accelerations and an angular rate (rotation) has been developed for an electronic stability control system of automobiles. With the recent trend to mount the combined sensors in the engine compartment, the operation temperature range increased drastically, with the request of immunity to environmental disturbances such as vibration. In this paper, we report the combined sensor which has a gyroscopic part and two acceleration parts in single die. A deformation-robust MEMS structure has been adopted to achieve stable operation under wide temperature range (-40 to 125°C) in the engine compartment. A package as small as 10 × 19 × 4 mm is achieved by adopting TSV (through silicon via) and WLP (wafer-level package) technologies with enough performance as automotive grade.

MEMS Microshutter Arrays for James Webb Space Telescope

NASA Technical Reports Server (NTRS)

Li, Mary J.; Beamesderfer, Michael; Babu, Sachi; Bajikar, Sateesh; Ewin, Audrey; Franz, Dave; Hess, Larry; Hu, Ron; Jhabvala, Murzy; Kelly, Dan;

Glassy carbon MEMS for novel origami-styled 3D integrated intracortical and epicortical neural probes

NASA Astrophysics Data System (ADS)

Goshi, Noah; Castagnola, Elisa; Vomero, Maria; Gueli, Calogero; Cea, Claudia; Zucchini, Elena; Bjanes, David; Maggiolini, Emma; Moritz, Chet; Kassegne, Sam; Ricci, Davide; Fadiga, Luciano

2018-06-01

We report on a novel technology for microfabricating 3D origami-styled micro electro-mechanical systems (MEMS) structures with glassy carbon (GC) features and a supporting polymer substrate. GC MEMS devices that open to form 3D microstructures are microfabricated from GC patterns that are made through pyrolysis of polymer precursors on high-temperature resisting substrates like silicon or quartz and then transferring the patterned devices to a flexible substrate like polyimide followed by deposition of an insulation layer. The devices on flexible substrate are then folded into 3D form in an origami-fashion. These 3D MEMS devices have tunable mechanical properties that are achieved by selectively varying the thickness of the polymeric substrate and insulation layers at any desired location. This technology opens new possibilities by enabling microfabrication of a variety of 3D GC MEMS structures suited to applications ranging from biochemical sensing to implantable microelectrode arrays. As a demonstration of the technology, a neural signal recording microelectrode array platform that integrates both surface (cortical) and depth (intracortical) GC microelectrodes onto a single flexible thin-film device is introduced. When the device is unfurled, a pre-shaped shank of polyimide automatically comes off the substrate and forms the penetrating part of the device in a 3D fashion. With the advantage of being highly reproducible and batch-fabricated, the device introduced here allows for simultaneous recording of electrophysiological signals from both the brain surface (electrocorticography—ECoG) and depth (single neuron). Our device, therefore, has the potential to elucidate the roles of underlying neurons on the different components of µECoG signals. For in vivo validation of the design capabilities, the recording sites are coated with a poly(3,4-ethylenedioxythiophene)—polystyrene sulfonate—carbon nanotube composite, to improve the electrical conductivity of the electrodes and consequently the quality of the recorded signals. Results show that both µECoG and intracortical arrays were able to acquire neural signals with high-sensitivity that increased with depth, thereby verifying the device functionality.

PREFACE: The 15th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2015)

NASA Astrophysics Data System (ADS)

Livermore, C.; Velásquez-García, L. F.

2015-12-01

Greetings, and welcome to Boston, MA and PowerMEMS 2015 - the 15th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications! The objective of PowerMEMS 2015 is to catalyze innovation in micro- and nano-scale technologies for the energy domain. The scope of the meeting ranges from basic principles, to materials and fabrication, to devices and systems, to applications. The many applications of Power MEMS range from the harvesting, storage, conversion and conditioning of energy, to integrated systems that manage these processes, to actuation, pumping, and propulsion. Our Conference aims to stimulate the exchange of insights and information, as well as the development of new ideas, in the Power MEMS field. Our goal is to allow the attendees to interact and network within our multidisciplinary community that includes professionals from many branches of science and engineering, as well as energy, policy, and entrepreneurial specialists interested in the commercialization of Power MEMS technologies. Since the first PowerMEMS in Sendai, Japan in 2000, the Conference has grown in size, reputation, impact, and technical breadth. This continuing growth is evident in this year's technical program, which includes an increasing number of papers on nanomaterials, additive manufacturing for energy systems, actuators, energy storage, harvesting strategies and integrated energy harvesting systems, for example. This year's technical program is highlighted by six plenary talks from prominent experts on piezoelectrics, robotic insects, thermoelectrics, photovoltaics, nanocomposite cathodes, and thermal energy conversion systems. The contributed program received a large number of abstract submissions this year, 169 in total. After careful review by the 34-member Technical Program Committee, a total of 135 papers were selected for presentation. The 60 contributed oral presentations are arranged in two parallel sessions. The 75 posters are arranged in a ''two-in-one'' poster session in which the poster session time is divided in two; half the posters will be presented during each half-session, allowing the poster presenters to also browse the posters during the poster session. Posters will remain up during the meeting, so please feel free to peruse them at your leisure. The Proceedings will be visible and accessible through IOP after conclusion of the Conference. We hope to maximize interaction among participants and stimulate lively discussion through the technical program and social events. For the first time at the Conference, a great many sponsors are making their presence known at PowerMEMS through tabletop displays, which will catalyze engaging conversations between our industrial partners and the research community. Also, for the first time at PowerMEMS, we will host a Rump Session - an informal event in which Conference participants engage in honest and fun discussions of topics of relevance to the community while strengthening bonds within the community. This meeting is made possible by many generous contributions of time, effort, and financial support. Thanks are due to the Technical Program Committee for their intensive efforts in reviewing abstract submissions, and to the International Steering Committee for their advice and support. We are grateful to Preferred Meeting Management Inc. for their many and key contributions to the management and organization of our Conference. Finally, we gratefully acknowledge the organizational and financial support provided for this meeting by the Transducers Research Foundation, Northeastern University, the Massachusetts Institute of Technology, and our exhibitors and other supporters. We hope that you find our Conference enjoyable and fruitful, and that you enjoy your stay in the Boston, MA area.

Superconductor Digital-RF Receiver Systems

NASA Astrophysics Data System (ADS)

Mukhanov, Oleg A.; Kirichenko, Dmitri; Vernik, Igor V.; Filippov, Timur V.; Kirichenko, Alexander; Webber, Robert; Dotsenko, Vladimir; Talalaevskii, Andrei; Tang, Jia Cao; Sahu, Anubhav; Shevchenko, Pavel; Miller, Robert; Kaplan, Steven B.; Sarwana, Saad; Gupta, Deepnarayan

Digital superconductor electronics has been experiencing rapid maturation with the emergence of smaller-scale, lower-cost communications applications which became the major technology drivers. These applications are primarily in the area of wireless communications, radar, and surveillance as well as in imaging and sensor systems. In these areas, the fundamental advantages of superconductivity translate into system benefits through novel Digital-RF architectures with direct digitization of wide band, high frequency radio frequency (RF) signals. At the same time the availability of relatively small 4K cryocoolers has lowered the foremost market barrier for cryogenically-cooled digital electronic systems. Recently, we have achieved a major breakthrough in the development, demonstration, and successful delivery of the cryocooled superconductor digital-RF receivers directly digitizing signals in a broad range from kilohertz to gigahertz. These essentially hybrid-technology systems combine a variety of superconductor and semiconductor technologies packaged with two-stage commercial cryocoolers: cryogenic Nb mixed-signal and digital circuits based on Rapid Single Flux Quantum (RSFQ) technology, room-temperature amplifiers, FPGA processing and control circuitry. The demonstrated cryocooled digital-RF systems are the world's first and fastest directly digitizing receivers operating with live satellite signals in X-band and performing signal acquisition in HF to L-band at ˜30GHz clock frequencies.

RF power harvesting: a review on designing methodologies and applications

NASA Astrophysics Data System (ADS)

Tran, Le-Giang; Cha, Hyouk-Kyu; Park, Woo-Tae

2017-12-01

Wireless power transmission was conceptualized nearly a century ago. Certain achievements made to date have made power harvesting a reality, capable of providing alternative sources of energy. This review provides a summ ary of radio frequency (RF) power harvesting technologies in order to serve as a guide for the design of RF energy harvesting units. Since energy harvesting circuits are designed to operate with relatively small voltages and currents, they rely on state-of-the-art electrical technology for obtaining high efficiency. Thus, comprehensive analysis and discussions of various designs and their tradeoffs are included. Finally, recent applications of RF power harvesting are outlined.

The MEMS Knudsen Compressor as a Vacuum Pump for Space Exploration Applications

NASA Technical Reports Server (NTRS)

Vargo, S. E.; Muntz, E. P.; Tang, W. C.

2000-01-01

Several lander, probe and rover missions currently under study at the Jet Propulsion Laboratory (JPL) and especially in the Microdevices Laboratory (MDL) Center for Space Microelectronics Technology, focus on utilizing microelectromechanical systems (MEMS) based instruments for science data gathering. These small instruments and NASA's commitment to "faster, better, cheaper" type missions has brought about the need for novel approaches to satisfying mission requirements. Existing in-situ instrument systems clearly lack novel and integrated methods for satisfying their vacuum needs. One attractive candidate for a MEMS vacuum pump is the Knudsen Compressor, which operates based on thermal transpiration. Thermal transpiration describes gas flows induced by temperature differences maintained across orifices, porous membranes or capillary tubes under rarefied conditions. This device has two overwhelmingly attractive features as a MEMS vacuum pump - no moving parts and no fluids. An initial estimate of a Knudsen Compressor's pumping power requirements for a surface atmospheric sampling task on Mars is less than 80 mW, significantly below than alternative pumps. Due to the relatively low energy use for this task and the applicability of the Knudsen Compressor to other applications, the development of a Knudsen Compressor utilizing MEMS fabrication techniques has been initiated. This paper discusses the initial fabrication of a single-stage MEMS Knudsen Compressor vacuum pump, provides performance criteria such as pumping speed, size, energy use and ultimate pressure and details vacuum pump applications in several MDL related in-situ instruments.

Low-Power RF SOI-CMOS Technology for Distributed Sensor Networks

NASA Technical Reports Server (NTRS)

Dogan, Numan S.

2003-01-01

The objective of this work is to design and develop Low-Power RF SOI-CMOS Technology for Distributed Sensor Networks. We briefly report on the accomplishments in this work. We also list the impact of this work on graduate student research training/involvement.

UAV-borne lidar with MEMS mirror-based scanning capability

NASA Astrophysics Data System (ADS)

Kasturi, Abhishek; Milanovic, Veljko; Atwood, Bryan H.; Yang, James

2016-05-01

Firstly, we demonstrated a wirelessly controlled MEMS scan module with imaging and laser tracking capability which can be mounted and flown on a small UAV quadcopter. The MEMS scan module was reduced down to a small volume of <90mm x 60mm x 40mm, weighing less than 40g and consuming less than 750mW of power using a ~5mW laser. This MEMS scan module was controlled by a smartphone via Bluetooth while flying on a drone, and could project vector content, text, and perform laser based tracking. Also, a "point-and-range" LiDAR module was developed for UAV applications based on low SWaP (Size, Weight and Power) gimbal-less MEMS mirror beam-steering technology and off-the-shelf OEM LRF modules. For demonstration purposes of an integrated laser range finder module, we used a simple off-the-shelf OEM laser range finder (LRF) with a 100m range, +/-1.5mm accuracy, and 4Hz ranging capability. The LRFs receiver optics were modified to accept 20° of angle, matching the transmitter's FoR. A relatively large (5.0mm) diameter MEMS mirror with +/-10° optical scanning angle was utilized in the demonstration to maintain the small beam divergence of the module. The complete LiDAR prototype can fit into a small volume of <70mm x 60mm x 60mm, and weigh <50g when powered by the UAV's battery. The MEMS mirror based LiDAR system allows for ondemand ranging of points or areas within the FoR without altering the UAV's position. Increasing the LRF ranging frequency and stabilizing the pointing of the laser beam by utilizing the onboard inertial sensors and the camera are additional goals of the next design.

Microelectromechanical System (MEMS) Device Being Developed for Active Cooling and Temperature Control

NASA Technical Reports Server (NTRS)

Beach, Duane E.

2003-01-01

High-capacity cooling options remain limited for many small-scale applications such as microelectronic components, miniature sensors, and microsystems. A microelectromechanical system (MEMS) using a Stirling thermodynamic cycle to provide cooling or heating directly to a thermally loaded surface is being developed at the NASA Glenn Research Center to meet this need. The device can be used strictly in the cooling mode or can be switched between cooling and heating modes in milliseconds for precise temperature control. Fabrication and assembly employ techniques routinely used in the semiconductor processing industry. Benefits of the MEMS cooler include scalability to fractions of a millimeter, modularity for increased capacity and staging to low temperatures, simple interfaces, limited failure modes, and minimal induced vibration. The MEMS cooler has potential applications across a broad range of industries such as the biomedical, computer, automotive, and aerospace industries. The basic capabilities it provides can be categorized into four key areas: 1) Extended environmental temperature range in harsh environments; 2) Lower operating temperatures for electronics and other components; 3) Precision spatial and temporal thermal control for temperature-sensitive devices; and 4) The enabling of microsystem devices that require active cooling and/or temperature control. The rapidly expanding capabilities of semiconductor processing in general, and microsystems packaging in particular, present a new opportunity to extend Stirling-cycle cooling to the MEMS domain. The comparatively high capacity and efficiency possible with a MEMS Stirling cooler provides a level of active cooling that is impossible at the microscale with current state-of-the-art techniques. The MEMS cooler technology builds on decades of research at Glenn on Stirling-cycle machines, and capitalizes on Glenn s emerging microsystems capabilities.

On the feasibility to integrate low-cost MEMS accelerometers and GNSS receivers

NASA Astrophysics Data System (ADS)

Benedetti, Elisa; Dermanis, Athanasios; Crespi, Mattia

2017-06-01

The aim of this research was to investigate the feasibility of merging the benefits offered by low-cost GNSS and MEMS accelerometers technology, in order to promote the diffusion of low-cost monitoring solutions. A merging approach was set up at the level of the combination of kinematic results (velocities and displacements) coming from the two kinds of sensors, whose observations were separately processed, following to the so called loose integration, which sounds much more simple and flexible thinking about the possibility of an easy change of the combined sensors. At first, the issues related to the difference in reference systems, time systems and measurement rate and epochs for the two sensors were faced with. An approach was designed and tested to transform into unique reference and time systems the outcomes from GPS and MEMS and to interpolate the usually (much) more dense MEMS observation to common (GPS) epochs. The proposed approach was limited to time-independent (constant) orientation of the MEMS reference system with respect to the GPS one. Then, a data fusion approach based on the use of Discrete Fourier Transform and cubic splines interpolation was proposed both for velocities and displacements: MEMS and GPS derived solutions are firstly separated by a rectangular filter in spectral domain, and secondly back-transformed and combined through a cubic spline interpolation. Accuracies around 5 mm for slow and fast displacements and better than 2 mm/s for velocities were assessed. The obtained solution paves the way to a powerful and appealing use of low-cost single frequency GNSS receivers and MEMS accelerometers for structural and ground monitoring applications. Some additional remarks and prospects for future investigations complete the paper.

Benefits of combined GPS/GLONASS with low-cost MEMS IMUs for vehicular urban navigation.

PubMed

Angrisano, Antonio; Petovello, Mark; Pugliano, Giovanni

2012-01-01

The integration of Global Navigation Satellite Systems (GNSS) with Inertial Navigation Systems (INS) has been very actively researched for many years due to the complementary nature of the two systems. In particular, during the last few years the integration with micro-electromechanical system (MEMS) inertial measurement units (IMUs) has been investigated. In fact, recent advances in MEMS technology have made possible the development of a new generation of low cost inertial sensors characterized by small size and light weight, which represents an attractive option for mass-market applications such as vehicular and pedestrian navigation. However, whereas there has been much interest in the integration of GPS with a MEMS-based INS, few research studies have been conducted on expanding this application to the revitalized GLONASS system. This paper looks at the benefits of adding GLONASS to existing GPS/INS(MEMS) systems using loose and tight integration strategies. The relative benefits of various constraints are also assessed. Results show that when satellite visibility is poor (approximately 50% solution availability) the benefits of GLONASS are only seen with tight integration algorithms. For more benign environments, a loosely coupled GPS/GLONASS/INS system offers performance comparable to that of a tightly coupled GPS/INS system, but with reduced complexity and development time.

A MEMS Condenser Microphone-Based Intracochlear Acoustic Receiver.

PubMed

Pfiffner, Flurin; Prochazka, Lukas; Peus, Dominik; Dobrev, Ivo; Dalbert, Adrian; Sim, Jae Hoon; Kesterke, Rahel; Walraevens, Joris; Harris, Francesca; Roosli, Christof; Obrist, Dominik; Huber, Alexander

2017-10-01

Intracochlear sound pressure (ICSP) measurements are limited by the small dimensions of the human inner ear and the requirements imposed by the liquid medium. A robust intracochlear acoustic receiver (ICAR) for repeated use with a simple data acquisition system that provides the required high sensitivity and small dimensions does not yet exist. The work described in this report aims to fill this gap and presents a new microelectromechanical systems (MEMS) condenser microphone (CMIC)-based ICAR concept suitable for ICSP measurements in human temporal bones. The ICAR head consisted of a passive protective diaphragm (PD) sealing the MEMS CMIC against the liquid medium, enabling insertion into the inner ear. The components of the MEMS CMIC-based ICAR were expressed by a lumped element model (LEM) and compared to the performance of successfully fabricated ICARs. Good agreement was achieved between the LEM and the measurements with different sizes of the PD. The ICSP measurements in a human cadaver temporal bone yielded data in agreement with the literature. Our results confirm that the presented MEMS CMIC-based ICAR is a promising technology for measuring ICSP in human temporal bones in the audible frequency range. A sensor for evaluation of the biomechanical hearing process by quantification of ICSP is presented. The concept has potential as an acoustic receiver in totally implantable cochlear implants.

FOREWORD: Focus on Novel Nanoelectromechanical 3D Structures: Fabrication and Properties Focus on Novel Nanoelectromechanical 3D Structures: Fabrication and Properties

NASA Astrophysics Data System (ADS)

Yamada, Shooji; Yamaguchi, Hiroshi; Ishihara, Sunao

2009-06-01

Microelectromechanical systems (MEMS) are widely used small electromechanical systems made of micrometre-sized components. Presently, we are witnessing a transition from MEMS to nanoelectromechanical systems (NEMS), which comprise devices integrating electrical and mechanical functionality on the nanoscale and offer new exciting applications. Similarly to MEMS, NEMS typically include a central transistor-like nanoelectronic unit for data processing, as well as mechanical actuators, pumps, and motors; and they may combine with physical, biological and chemical sensors. In the transition from MEMS to NEMS, component sizes need to be reduced. Therefore, many fabrication methods previously developed for MEMS are unsuitable for the production of high-precision NEMS components. The key challenge in NEMS is therefore the development of new methods for routine and reproducible nanofabrication. Two complementary types of method for NEMS fabrication are available: 'top-down' and 'bottom-up'. The top-down approach uses traditional lithography technologies, whereas bottom-up techniques include molecular self-organization, self-assembly and nanodeposition. The NT2008 conference, held at Ishikawa High-Tech Conference Center, Ishikawa, Japan, between 23-25 October 2008, focused on novel NEMS fabricated from new materials and on process technologies. The topics included compound semiconductors, small mechanical structures, nanostructures for micro-fluid and bio-sensors, bio-hybrid micro-machines, as well as their design and simulation. This focus issue compiles seven articles selected from 13 submitted manuscripts. The articles by Prinz et al and Kehrbusch et al introduce the frontiers of the top-down production of various operational NEMS devices, and Kometani et al present an example of the bottom-up approach, namely ion-beam induced deposition of MEMS and NEMS. The remaining articles report novel technologies for biological sensors. Taira et al have used manganese nanoparticles to improve the chemical analysis of biological samples by laser desorption/ionization mass spectrometry. Matsumoto et al have prepared sugar microarrays via click chemistry and have applied this to the detection and characterization of proteins. Yoshimura et al have expanded the single-nucleotide polymorphism typing method to differentiate genes from various food crops, such as indica and japonica rice. Finally, Takashi et al have designed a nanoparticle-based strip sensor, which can be used for rapid evaluation of the psychological condition of animals and humans. We hope that this focus issue will help readers to understand, from a materials science viewpoint, different aspects of frontier research into NEMS.

Microsystems: from technologies to products

NASA Astrophysics Data System (ADS)

Ryser, Peter

2003-10-01

In this paper, we outline the process leading from technologies to successful products in the MEMS (Microelectromechanical Systems) and MST (Microsystems Technology) field. The development of new products involves a lot of factors, such as mature technologies, interdisciplinary team, identifying the right business potential and long term oriented investors. The paper summarizes a survey of different technologies and point out that packaging, test and calibration are still major shortcomings for the concerned industries.

RF and Optical Communications: A Comparison of High Data Rate Returns From Deep Space in the 2020 Timeframe

NASA Technical Reports Server (NTRS)

Williams, W. Dan; Collins, Michael; Boroson, Don M.; Lesh, James; Biswas, Abihijit; Orr, Richard; Schuchman, Leonard; Sands, O. Scott

2007-01-01

As NASA proceeds with plans for increased science data return and higher data transfer capacity for science missions, both RF and optical communications are viable candidates for significantly higher-rate communications from deep space to Earth. With the inherent advantages, smaller apertures and larger bandwidths, of optical communications, it is reasonable to expect that at some point in time and combination of increasing distance and data rate, the rapidly emerging optical capabilities would become more advantageous than the more mature and evolving RF techniques. This paper presents a comparison of the burden to a spacecraft by both RF and optical communications systems for data rates of 10, 100, and 1000 Mbps and large distances. Advanced technology for RF and optical communication systems have been considered for projecting capabilities in the 2020 timeframe. For the comparisons drawn, the optical and RF ground terminals were selected to be similar in cost. The RF system selected is composed of forty-five 12-meter antennas, whereas the selected optical system is equivalent to a 10-meter optical telescope. Potential differences in availability are disregarded since the focus of this study is on spacecraft mass and power burden for high-rate mission data, under the assumption that essential communications will be provided by low-rate, high availability RF. For both the RF and optical systems, the required EIRP, for a given data rate and a given distance, was achieved by a design that realized the lowest possible communications subsystem mass (power + aperture) consistent with achieving the lowest technology risk. A key conclusion of this paper is that optical communications has great potential for high data rates and distances of 2.67 AU and beyond, but requires R&D and flight demonstrations to prove out technologies.

On the measurement of stationary electric fields in air

NASA Technical Reports Server (NTRS)

Kirkham, H.

2002-01-01

Applications and measurement methods for field measurements are reviewed. Recent developments using optical technology are examined. The various methods are compared. It is concluded that the best general purpose instrument is the isolated cylindrical field mill, but MEMS technology could furnish better instruments in the future.

Design and optimization of stress centralized MEMS vector hydrophone with high sensitivity at low frequency

NASA Astrophysics Data System (ADS)

Zhang, Guojun; Ding, Junwen; Xu, Wei; Liu, Yuan; Wang, Renxin; Han, Janjun; Bai, Bing; Xue, Chenyang; Liu, Jun; Zhang, Wendong

2018-05-01

A micro hydrophone based on piezoresistive effect, "MEMS vector hydrophone" was developed for acoustic detection application. To improve the sensitivity of MEMS vector hydrophone at low frequency, we reported a stress centralized MEMS vector hydrophone (SCVH) mainly used in 20-500 Hz. Stress concentration area was actualized in sensitive unit of hydrophone by silicon micromachining technology. Then piezoresistors were placed in stress concentration area for better mechanical response, thereby obtaining higher sensitivity. Static analysis was done to compare the mechanical response of three different sensitive microstructure: SCVH, conventional micro-silicon four-beam vector hydrophone (CFVH) and Lollipop-shaped vector hydrophone (LVH) respectively. And fluid-structure interaction (FSI) was used to analyze the natural frequency of SCVH for ensuring the measurable bandwidth. Eventually, the calibration experiment in standing wave field was done to test the property of SCVH and verify the accuracy of simulation. The results show that the sensitivity of SCVH has nearly increased by 17.2 dB in contrast to CFVH and 7.6 dB in contrast to LVH during 20-500 Hz.

Automatic classification of singular elements for the electrostatic analysis of microelectromechanical systems

NASA Astrophysics Data System (ADS)

Su, Y.; Ong, E. T.; Lee, K. H.

2002-05-01

The past decade has seen an accelerated growth of technology in the field of microelectromechanical systems (MEMS). The development of MEMS products has generated the need for efficient analytical and simulation methods for minimizing the requirement for actual prototyping. The boundary element method is widely used in the electrostatic analysis for MEMS devices. However, singular elements are needed to accurately capture the behavior at singular regions, such as sharp corners and edges, where standard elements fail to give an accurate result. The manual classification of boundary elements based on their singularity conditions is an immensely laborious task, especially when the boundary element model is large. This process can be automated by querying the geometric model of the MEMS device for convex edges based on geometric information of the model. The associated nodes of the boundary elements on these edges can then be retrieved. The whole process is implemented in the MSC/PATRAN platform using the Patran Command Language (the source code is available as supplementary data in the electronic version of this journal issue).

A multi-conjugate adaptive optics testbed using two MEMS deformable mirrors

NASA Astrophysics Data System (ADS)

Andrews, Jonathan R.; Martinez, Ty; Teare, Scott W.; Restaino, Sergio R.; Wilcox, Christopher C.; Santiago, Freddie; Payne, Don M.

2011-03-01

Adaptive optics (AO) systems are well demonstrated in the literature with both laboratory and real-world systems being developed. Some of these systems have employed MEMS deformable mirrors as their active corrective element. More recent work in AO for astronomical applications has focused on providing correction in more than one conjugate plane. Additionally, horizontal path AO systems are exploring correction in multiple conjugate planes. This provides challenges for a laboratory system as the aberrations need to be generated and corrected in more than one plane in the optical system. Our work with compact AO systems employing MEMS technology in addition to liquid crystal spatial light modulator (SLM) driven aberration generators has been scaled up to a two conjugate plane testbed. Using two SLM based aberration generators and two separate wavefront sensors, the system can apply correction with two MEMS deformable mirrors. The challenges in such a system are to properly match non-identical components and weight the correction algorithm for correcting in two planes. This paper demonstrates preliminary results and analysis with this system with wavefront data and residual error measurements.

EDITORIAL: MEMS in biology and medicine MEMS in biology and medicine

NASA Astrophysics Data System (ADS)

Pruitt, Beth L.; Herr, Amy E.

2011-05-01

Stimulating—the first word that springs to mind regarding the emerging and expanding role of MEMS in biological inquiry. When invited to guest-edit this special issue on 'MEMS in biology and medicine' for JMM, we jumped at the opportunity. Partly owing to the breadth of the stimulating research in this nascent area and partly owing to the stimulating of biological function made possible with MEMS accessible length and time scales, we were eager to assemble manuscripts detailing some of the most cutting edge biological research being conducted around the globe. In addition to cutting edge engineering, this special issue features challenging biological questions addressed with innovative MEMS technologies. Topics span from Yetisen and colleagues' inquiry into quantifying pollen tube behaviour in response to pistil tissues [1] to Morimoto and colleagues' engineering efforts to produce monodisperse droplets capable of encapsulating single cells (without surface modification) [2]. Questions are bold, including a means to achieve therapeutically-relevant scaling for enrichment of leukocytes from blood (Inglis et al [3]), assessing the dependence of Escherichia coli biofilm formation on bacterial signalling (Meyer et al [4]), and elucidation of adhesion dynamics of circulating tumour cells (Cheung et al [5]) among others. Technologies are diverse, including microfabricated magnetic actuators (Lee et al [6]), stimuli-responsive polymer nanocomposites (Hess et al [7]), and SU-8 electrothermal microgrippers (Chu et al [8]) to name but a few. Contributing authors do indeed span a large swathe of the globe, with contributions from Australia, Italy, China, Canada, Denmark, Japan, the USA and numerous other locations. Collaboration finds a home here—with researchers from macromolecular science and electrical engineering collaborating with the Veterans Affairs Medical Center or neurosurgery researchers working with biological and electrical engineers. The questions posed by this generation of MEMS researchers encapsulate the mission of JMM to 'cover all aspects of microelectromechanical systems, devices and structures as well as micromechanics, microengineering and microfabrication' as the physics and chemical processes under study match the scales of the MEMS technologies now possible. As evidenced by the articles assembled in this issue, the combined maturation of both our biological model systems and our tools is driving a new paradigm in the formulation of biological hypotheses. The intersection of MEMS with cell biology is evidenced in reviews of both methods for applying microscale forces in biological environments by Zheng and Zhang [9] as well as the manipulation of biology through mechanical interactions by Rajagopalan and Saif [10]. Additionally, the potential for microfluidic platforms to miniaturize and improve for a diverse set of biological measurements and assays for medical diagnostics is further reviewed by Tentori and Herr [11]. We hope that you find, as we do, this special issue to be 'essential reading for all MEMS researchers' and perhaps even of technical interest to your life sciences colleagues. References [1] Yetisen A K et al 2011 J. Micromech. Microeng. 21 054018 [2] Morimoto Y et al 2011 J. Micromech. Microeng. 21 054031 [3] Inglis D W et al 2011 J. Micromech. Microeng. 21 054024 [4] Meyer M T et al 2011 J. Micromech. Microeng. 21 054023 [5] Cheung L S-L et al 2011 J. Micromech. Microeng. 21 054033 [6] Lee S A et al 2011 J. Micromech. Microeng. 21 054006 [7] Hess A E et al 2011 J. Micromech. Microeng. 21 054009 [8] Chu J et al 2011 J. Micromech. Microeng. 21 054030 [9] Zheng X R and Zhang X 2011 J. Micromech. Microeng. 21 054003 [10] Rajagopalan J and Saif M T A 2011 J. Micromech. Microeng. 21 054002 [11] Tentori A M and Herr A E 2011 J. Micromech. Microeng. 21 054001

Study on film resistivity of Energy Conversion Components for MEMS Initiating Explosive Device

NASA Astrophysics Data System (ADS)

Ren, Wei; Zhang, Bin; Zhao, Yulong; Chu, Enyi; Yin, Ming; Li, Hui; Wang, Kexuan

2018-03-01

Resistivity of Plane-film Energy Conversion Components is a key parameter to influence its resistance and explosive performance, and also it has important relations with the preparation of thin film technology, scale, structure and etc. In order to improve the design of Energy Conversion Components for MEMS Initiating Explosive Device, and reduce the design deviation of Energy Conversion Components in microscale, guarantee the design resistance and ignition performance of MEMS Initiating Explosive Device, this paper theoretically analyzed the influence factors of film resistivity in microscale, through the preparation of Al film and Ni-Cr film at different thickness with micro/nano, then obtain the film resistivity parameter of the typical metal under different thickness, and reveals the effect rule of the scale to the resistivity in microscale, at the same time we obtain the corresponding inflection point data.

Differential wide temperature range CMOS interface circuit for capacitive MEMS pressure sensors.

PubMed

Wang, Yucai; Chodavarapu, Vamsy P

2015-02-12

We describe a Complementary Metal-Oxide Semiconductor (CMOS) differential interface circuit for capacitive Micro-Electro-Mechanical Systems (MEMS) pressure sensors that is functional over a wide temperature range between -55 °C and 225 °C. The circuit is implemented using IBM 0.13 μm CMOS technology with 2.5 V power supply. A constant-gm biasing technique is used to mitigate performance degradation at high temperatures. The circuit offers the flexibility to interface with MEMS sensors with a wide range of the steady-state capacitance values from 0.5 pF to 10 pF. Simulation results show that the circuitry has excellent linearity and stability over the wide temperature range. Experimental results confirm that the temperature effects on the circuitry are small, with an overall linearity error around 2%.

Differential Wide Temperature Range CMOS Interface Circuit for Capacitive MEMS Pressure Sensors

PubMed Central

Wang, Yucai; Chodavarapu, Vamsy P.

2015-01-01

We describe a Complementary Metal-Oxide Semiconductor (CMOS) differential interface circuit for capacitive Micro-Electro-Mechanical Systems (MEMS) pressure sensors that is functional over a wide temperature range between −55 °C and 225 °C. The circuit is implemented using IBM 0.13 μm CMOS technology with 2.5 V power supply. A constant-gm biasing technique is used to mitigate performance degradation at high temperatures. The circuit offers the flexibility to interface with MEMS sensors with a wide range of the steady-state capacitance values from 0.5 pF to 10 pF. Simulation results show that the circuitry has excellent linearity and stability over the wide temperature range. Experimental results confirm that the temperature effects on the circuitry are small, with an overall linearity error around 2%. PMID:25686312

Dynamic focus-tracking MEMS scanning micromirror with low actuation voltages for endoscopic imaging

PubMed Central

Strathman, Matthew; Liu, Yunbo; Li, Xingde; Lin, Lih Y.

2013-01-01

We demonstrate a 3-D scanning micromirror device that combines 2-D beam scanning with focus control in the same device using micro-electro-mechanical-systems (MEMS) technology. 2-D beam scanning is achieved with a biaxial gimbal structure and focus control is obtained with a deformable mirror membrane surface. The micromirror with 800 micrometer diameter is designed to be sufficiently compact and efficient so that it can be incorporated into an endoscopic imaging probe in the future. The design, fabrication and characterization of the device are described in this paper. Using the focus-tracking MEMS scanning mirror, we achieved an optical scanning range of >16 degrees with <40 V actuation voltage at resonance and a tunable focal length between infinity and 25 mm with <100V applied bias. PMID:24104304

Large-area multiplexed sensing using MEMS and fiber optics

NASA Astrophysics Data System (ADS)

Miller, Michael B.; Clark, Richard L., Jr.; Bell, Clifton R.; Russler, Patrick M.

2000-06-01

Micro-electro-mechanical (MEMS) technology offers the ability to implement local and independent sensing and actuation functions through the coordinated response of discrete micro-electro-mechanical 'basis function' elements. The small size of micromechanical components coupled with the ability to reduce costs using volume manufacturing techniques opens up significant potential not only in military applications such as flight and engine monitoring and control, but in autonomous vehicle control, smart munitions, airborne reconnaissance, LADAR, missile guidance, and even in intelligent transportation systems and automotive guidance applications. In this program, Luna Innovations is developing a flexible, programmable interface which can be integrated direction with different types of MEMS sensors, and then used to multiplex many sensors ona single optical fiber to provide a unique combination of functions that will allow larger quantities of sensory input with better resolution than ever before possible.

Structural design of high-performance capacitive accelerometers using parametric optimization with uncertainties

NASA Astrophysics Data System (ADS)

Teves, André da Costa; Lima, Cícero Ribeiro de; Passaro, Angelo; Silva, Emílio Carlos Nelli

2017-03-01

Electrostatic or capacitive accelerometers are among the highest volume microelectromechanical systems (MEMS) products nowadays. The design of such devices is a complex task, since they depend on many performance requirements, which are often conflicting. Therefore, optimization techniques are often used in the design stage of these MEMS devices. Because of problems with reliability, the technology of MEMS is not yet well established. Thus, in this work, size optimization is combined with the reliability-based design optimization (RBDO) method to improve the performance of accelerometers. To account for uncertainties in the dimensions and material properties of these devices, the first order reliability method is applied to calculate the probabilities involved in the RBDO formulation. Practical examples of bulk-type capacitive accelerometer designs are presented and discussed to evaluate the potential of the implemented RBDO solver.

MEMS-Based Micro Instruments for In-Situ Planetary Exploration

NASA Technical Reports Server (NTRS)

George, Thomas; Urgiles, Eduardo R; Toda, Risaku; Wilcox, Jaroslava Z.; Douglas, Susanne; Lee, C-S.; Son, Kyung-Ah; Miller, D.; Myung, N.; Madsen, L.;

Can mobile phones used in strong motion seismology?

NASA Astrophysics Data System (ADS)

D'Alessandro, Antonino; D'Anna, Giuseppe

2013-04-01

Micro Electro-Mechanical Systems (MEMS) accelerometers are electromechanical devices able to measure static or dynamic accelerations. In the 1990s MEMS accelerometers revolutionized the automotive-airbag system industry and are currently widely used in laptops, game controllers and mobile phones. Nowadays MEMS accelerometers seems provide adequate sensitivity, noise level and dynamic range to be applicable to earthquake strong motion acquisition. The current use of 3 axes MEMS accelerometers in mobile phone maybe provide a new means to easy increase the number of observations when a strong earthquake occurs. However, before utilize the signals recorded by a mobile phone equipped with a 3 axes MEMS accelerometer for any scientific porpoise, it is fundamental to verify that the signal collected provide reliable records of ground motion. For this reason we have investigated the suitability of the iPhone 5 mobile phone (one of the most popular mobile phone in the world) for strong motion acquisition. It is provided by several MEMS devise like a three-axis gyroscope, a three-axis electronic compass and a the LIS331DLH three-axis accelerometer. The LIS331DLH sensor is a low-cost high performance three axes linear accelerometer, with 16 bit digital output, produced by STMicroelectronics Inc. We have tested the LIS331DLH MEMS accelerometer using a vibrating table and the EpiSensor FBA ES-T as reference sensor. In our experiments the reference sensor was rigidly co-mounted with the LIS331DHL MEMS sensor on the vibrating table. We assessment the MEMS accelerometer in the frequency range 0.2-20 Hz, typical range of interesting in strong motion seismology and earthquake engineering. We generate both constant and damped sine waves with central frequency starting from 0.2 Hz until 20 Hz with step of 0.2 Hz. For each frequency analyzed we generate sine waves with mean amplitude 50, 100, 200, 400, 800 and 1600 mg0. For damped sine waves we generate waveforms with initial amplitude of 2 g0. Our tests show as, in the frequency and amplitude range analyzed (0.2-20 Hz, 10-2000 mg0), the LIS331DLH MEMS accelerometer have excellent frequency and phase response, comparable with that of some standard FBA accelerometer used in strong motion seismology. However, we found that the signal recorded by the LIS331DLH MEMS accelerometer slightly underestimates the real acceleration (of about 2.5%). This suggests that may be important to calibrate a MEMS sensor before using it in scientific applications. A drawback of the LIS331DLH MEMS accelerometer is its low sensitivity. This is an important limitation of all the low cost MEMS accelerometers; therefore nowadays they are desirable to use only in strong motion seismology. However, the rapid development of this technology will lead in the coming years to the development of high sensitivity and low noise digital MEMS sensors that may be replace the current seismic accelerometer used in seismology. Actually, the real main advantage of these sensors is their common use in the mobile phones.

Micro-Raman Analysis of Irradiated Diamond Films

NASA Technical Reports Server (NTRS)

Newton, Robert L.

2003-01-01

Owing to its unique and robust physical properties, diamond is a much sought after material for use in advanced technologies, even in Microelectromechanical Systems (MEMS). The volume and weight savings promised by MEMS-based devices are of particular interest to spaceflight applications. However, much basic materials science research remains to be completed in this field. Results of micro-Raman analysis of proton (10(exp 15) - 10(exp 17) H(+)/sq cm doses) irradiated chemical vapor deposited (CVD) films are presented and indicate that their microstructure is retained even after high radiation exposure.

Large optical 3D MEMS switches in access networks

NASA Astrophysics Data System (ADS)

Madamopoulos, Nicholas; Kaman, Volkan; Yuan, Shifu; Jerphagnon, Olivier; Helkey, Roger; Bowers, John E.

2007-09-01

Interest is high among residential customers and businesses for advanced, broadband services such as fast Internet access, electronic commerce, video-on-demand, digital broadcasting, teleconferencing and telemedicine. In order to satisfy such growing demand of end-customers, access technologies such as fiber-to-the-home/building (FTTH/B) are increasingly being deployed. Carriers can reduce maintenance costs, minimize technology obsolescence and introduce new services easily by reducing active elements in the fiber access network. However, having a passive optical network (PON) also introduces operational and maintenance challenges. Increased diagnostic monitoring capability of the network becomes a necessity as more and more fibers are provisioned to deliver services to the end-customers. This paper demonstrates the clear advantages that large 3D optical MEMS switches offer in solving these access network problems. The advantages in preventative maintenance, remote monitoring, test and diagnostic capability are highlighted. The low optical insertion loss for all switch optical connections of the switch enables the monitoring, grooming and serving of a large number of PON lines and customers. Furthermore, the 3D MEMS switch is transparent to optical wavelengths and data formats, thus making it easy to incorporate future upgrades, such higher bit rates or DWDM overlay to a PON.

A learnable parallel processing architecture towards unity of memory and computing

NASA Astrophysics Data System (ADS)

Li, H.; Gao, B.; Chen, Z.; Zhao, Y.; Huang, P.; Ye, H.; Liu, L.; Liu, X.; Kang, J.

2015-08-01

Developing energy-efficient parallel information processing systems beyond von Neumann architecture is a long-standing goal of modern information technologies. The widely used von Neumann computer architecture separates memory and computing units, which leads to energy-hungry data movement when computers work. In order to meet the need of efficient information processing for the data-driven applications such as big data and Internet of Things, an energy-efficient processing architecture beyond von Neumann is critical for the information society. Here we show a non-von Neumann architecture built of resistive switching (RS) devices named “iMemComp”, where memory and logic are unified with single-type devices. Leveraging nonvolatile nature and structural parallelism of crossbar RS arrays, we have equipped “iMemComp” with capabilities of computing in parallel and learning user-defined logic functions for large-scale information processing tasks. Such architecture eliminates the energy-hungry data movement in von Neumann computers. Compared with contemporary silicon technology, adder circuits based on “iMemComp” can improve the speed by 76.8% and the power dissipation by 60.3%, together with a 700 times aggressive reduction in the circuit area.

Scanning laser beam displays based on a 2D MEMS

NASA Astrophysics Data System (ADS)

Niesten, Maarten; Masood, Taha; Miller, Josh; Tauscher, Jason

2010-05-01

The combination of laser light sources and MEMS technology enables a range of display systems such as ultra small projectors for mobile devices, head-up displays for vehicles, wearable near-eye displays and projection systems for 3D imaging. Images are created by scanning red, green and blue lasers horizontally and vertically with a single two-dimensional MEMS. Due to the excellent beam quality of laser beams, the optical designs are efficient and compact. In addition, the laser illumination enables saturated display colors that are desirable for augmented reality applications where a virtual image is used. With this technology, the smallest projector engine for high volume manufacturing to date has been developed. This projector module has a height of 7 mm and a volume of 5 cc. The resolution of this projector is WVGA. No additional projection optics is required, resulting in an infinite focus depth. Unlike with micro-display projection displays, an increase in resolution will not lead to an increase in size or a decrease in efficiency. Therefore future projectors can be developed that combine a higher resolution in an even smaller and thinner form factor with increased efficiencies that will lead to lower power consumption.

A learnable parallel processing architecture towards unity of memory and computing.

PubMed

Li, H; Gao, B; Chen, Z; Zhao, Y; Huang, P; Ye, H; Liu, L; Liu, X; Kang, J

2015-08-14

Developing energy-efficient parallel information processing systems beyond von Neumann architecture is a long-standing goal of modern information technologies. The widely used von Neumann computer architecture separates memory and computing units, which leads to energy-hungry data movement when computers work. In order to meet the need of efficient information processing for the data-driven applications such as big data and Internet of Things, an energy-efficient processing architecture beyond von Neumann is critical for the information society. Here we show a non-von Neumann architecture built of resistive switching (RS) devices named "iMemComp", where memory and logic are unified with single-type devices. Leveraging nonvolatile nature and structural parallelism of crossbar RS arrays, we have equipped "iMemComp" with capabilities of computing in parallel and learning user-defined logic functions for large-scale information processing tasks. Such architecture eliminates the energy-hungry data movement in von Neumann computers. Compared with contemporary silicon technology, adder circuits based on "iMemComp" can improve the speed by 76.8% and the power dissipation by 60.3%, together with a 700 times aggressive reduction in the circuit area.

Comparison of the Thermal Degradation of Heavily Nb-Doped and Normal PZT Thin Films.

PubMed

Yang, Jeong-Suong; Kang, YunSung; Kang, Inyoung; Lim, SeungMo; Shin, Seung-Joo; Lee, JungWon; Hur, Kang Heon

2017-03-01

The degradation of niobium-doped lead zirconate titanate (PZT) and two types of PZT thin films were investigated. Undoped PZT, two-step PZT, and heavily Nb-doped PZT (PNZT) around the morphotropic phase boundary were in situ deposited under optimum condition by RF-magnetron sputtering. All 2- [Formula: see text]-thick films had dense perovskite columnar grain structure and self-polarized (100) dominant orientation. PZT thin films were deposited on Pt/TiO x bottom electrode on Si wafer, and PNZT thin film was on Ir/TiW electrode with the help of orientation control. Sputtered PZT films formed on microelectromechanical system (MEMS) gyroscope and the degradation rates were compared at different temperatures. PNZT showed the best resistance to the thermal degradation, followed by two-step PZT. To clarify the effect of oxygen vacancies on the degradation of the film at high temperature, photoluminescence measurement was conducted, which confirmed that oxygen vacancy rate was the lowest in heavy PNZT. Nb-doping PZT thin films suppressed the oxygen deficit and made high imprint with self-polarization. This defect distribution and high internal field allowed PNZT thin film to make the piezoelectric sensors more stable and reliable at high temperature, such as reflow process of MEMS packaging.

MEMS product engineering: methodology and tools

NASA Astrophysics Data System (ADS)

Ortloff, Dirk; Popp, Jens; Schmidt, Thilo; Hahn, Kai; Mielke, Matthias; Brück, Rainer

2011-03-01

The development of MEMS comprises the structural design as well as the definition of an appropriate manufacturing process. Technology constraints have a considerable impact on the device design and vice-versa. Product design and technology development are therefore concurrent tasks. Based on a comprehensive methodology the authors introduce a software environment that links commercial design tools from both area into a common design flow. In this paper emphasis is put on automatic low threshold data acquisition. The intention is to collect and categorize development data for further developments with minimum overhead and minimum disturbance of established business processes. As a first step software tools that automatically extract data from spreadsheets or file-systems and put them in context with existing information are presented. The developments are currently carried out in a European research project.

Advanced adaptive optics technology development

NASA Astrophysics Data System (ADS)

Olivier, Scot S.

2002-02-01

The NSF Center for Adaptive Optics (CfAO) is supporting research on advanced adaptive optics technologies. CfAO research activities include development and characterization of micro-electro-mechanical systems (MEMS) deformable mirror (DM) technology, as well as development and characterization of high-resolution adaptive optics systems using liquid crystal (LC) spatial light modulator (SLM) technology. This paper presents an overview of the CfAO advanced adaptive optics technology development activities including current status and future plans.

Evaluation of Thermo-Mechanical Stability of COTS Dual-Axis MEMS Accelerometers for Space Applications

NASA Technical Reports Server (NTRS)

Sharma, Ashok K.; Teverovksy, Alexander; Day, John H. (Technical Monitor)

2000-01-01

Microelectromechanical systems in MEMS is one of the fastest growing technologies in microelectronics, and is of great interest for military and aerospace applications. Accelerometers are the earliest and most developed representatives of MEMS. First demonstrated in 1979, micromachined accelerometers were used in automobile industry for air bag crash- sensing applications since 1990. In 1999, N4EMS accelerometers were used in NASA-JPL Mars Microprobe. The most developed accelerometers for airbag crash- sensing are rated for a full range of +/- 50 G. The range of sensitivity for accelerometers required for military or aerospace applications is much larger, varying from 20,000 G (to measure acceleration during gun and ballistic munition launches), and to 10(exp -6) G, when used as guidance sensors (to measure attitude and position of a spacecraft). The presence of moving parts on the surface of chip is specific to MEMS, and particularly, to accelerometers. This characteristic brings new reliability issues to micromachined accelerometers, including cyclic fatigue cracking of polysilicon cantilevers and springs, mechanical stresses that are caused by packaging and contamination in the internal cavity of the package. Studies of fatigue cracks initiation and growth in polysilicon showed that the fatigue damage may influence MEMS device performance, and the presence of water vapor significantly enhances crack initiation and growth. Environmentally induced failures, particularly, failures due to thermal cycling and mechanical shock are considered as one of major reliability concerns in MEMS. These environmental conditions are also critical for space applications of the parts. For example, the Mars pathfinder mission had experienced 80 mechanical shock events during the pyrotechnic separation processes.

Biophysics and clinical utility of irrigated-tip radiofrequency catheter ablation.

PubMed

Houmsse, Mahmoud; Daoud, Emile G

2012-01-01

Catheter ablation by radiofrequency (RF) energy has successfully eliminated cardiac tachyarrhythmias. RF ablation lesions are created by thermal energy. Electrode catheters with 4-mm-tips have been adequate to ablate arrhythmias located near the endocardium; however, the 4-mm-tip electrode does not readily ablate deeper tachyarrhythmia substrate. With 8- and 10-mm-tip RF electrodes, ablation lesions were larger; yet, these catheters are associated with increased risk for coagulum, char and thrombus formation, as well as myocardial steam rupture. Cooled-tip catheter technology was designed to cool the electrode tip, prevent excessive temperatures at the electrode tip-tissue interface, and thus allow continued delivery of RF current into the surrounding tissue. This ablation system creates larger and deeper ablation lesions and minimizes steam pops and thrombus formation. The purpose of this article is to review cooled-tip RF ablation biophysics and outcomes of clinical studies as well as to discuss future technological improvements.

Plasma core reactor simulations using RF uranium seeded argon discharges

NASA Technical Reports Server (NTRS)

Roman, W. C.

1975-01-01

An experimental investigation was conducted using the United Technologies Research Center (UTRC) 80 kW and 1.2 MW RF induction heater systems to aid in developing the technology necessary for designing a self-critical fissioning uranium plasma core reactor (PCR). A nonfissioning, steady-state RF-heated argon plasma seeded with pure uranium hexafluoride (UF6) was used. An overall objective was to achieve maximum confinement of uranium vapor within the plasma while simultaneously minimizing the uranium compound wall deposition. Exploratory tests were conducted using the 80 kW RF induction heater with the test chamber at approximately atmospheric pressure and discharge power levels on the order of 10 kW. Four different test chamber flow configurations were tested to permit selection of the configuration offering the best confinement characteristics for subsequent tests at higher pressure and power in the 1.2 MW RF induction heater facility.

High efficiency low cost monolithic module for SARSAT distress beacons

NASA Technical Reports Server (NTRS)

Petersen, Wendell C.; Siu, Daniel P.

1992-01-01

The program objectives were to develop a highly efficient, low cost RF module for SARSAT beacons; achieve significantly lower battery current drain, amount of heat generated, and size of battery required; utilize MMIC technology to improve efficiency, reliability, packaging, and cost; and provide a technology database for GaAs based UHF RF circuit architectures. Presented in viewgraph form are functional block diagrams of the SARSAT distress beacon and beacon RF module as well as performance goals, schematic diagrams, predicted performances, and measured performances for the phase modulator and power amplifier.

Skin tightening technologies.

PubMed

Greene, Ryan M; Green, Jeremy B

2014-02-01

Radiofrequency (RF) and intense focused ultrasound (IFUS) are increasingly used to address skin laxity of the face and neck. Both nonablative RF and ultrasound create a heat-induced tissue response that leads to collagen remodeling and other ultrastructural changes. Although these treatments are not meant to replace surgical procedures, patient satisfaction in the majority of studies has been consistently high. This article discusses the various RF and IFUS technologies currently in use and reviews pertinent clinical studies evaluating their efficacy and safety. Thieme Medical Publishers 333 Seventh Avenue, New York, NY 10001, USA.

The development of data acquisition and processing application system for RF ion source

NASA Astrophysics Data System (ADS)

Zhang, Xiaodan; Wang, Xiaoying; Hu, Chundong; Jiang, Caichao; Xie, Yahong; Zhao, Yuanzhe

2017-07-01

As the key ion source component of nuclear fusion auxiliary heating devices, the radio frequency (RF) ion source is developed and applied gradually to offer a source plasma with the advantages of ease of control and high reliability. In addition, it easily achieves long-pulse steady-state operation. During the process of the development and testing of the RF ion source, a lot of original experimental data will be generated. Therefore, it is necessary to develop a stable and reliable computer data acquisition and processing application system for realizing the functions of data acquisition, storage, access, and real-time monitoring. In this paper, the development of a data acquisition and processing application system for the RF ion source is presented. The hardware platform is based on the PXI system and the software is programmed on the LabVIEW development environment. The key technologies that are used for the implementation of this software programming mainly include the long-pulse data acquisition technology, multi-threading processing technology, transmission control communication protocol, and the Lempel-Ziv-Oberhumer data compression algorithm. Now, this design has been tested and applied on the RF ion source. The test results show that it can work reliably and steadily. With the help of this design, the stable plasma discharge data of the RF ion source are collected, stored, accessed, and monitored in real-time. It is shown that it has a very practical application significance for the RF experiments.

Variable Emissivity Through MEMS Technology

NASA Technical Reports Server (NTRS)

Darrin, Ann Garrison; Osiander, Robert; Champion, John; Swanson, Ted; Douglas, Donya; Grob, Lisa M.; Powers, Edward I. (Technical Monitor)

2000-01-01

This paper discusses a new technology for variable emissivity (vari-e) radiator surfaces, which has significant advantages over traditional radiators and promises an alternative design technique for future spacecraft thermal control systems. All spacecraft rely on radiative surfaces to dissipate waste heat. These radiators have special coatings, typically with a low solar absorptivity and a high infrared-red emissivity, that are intended to optimize performance under the expected heat load and thermal sink environment. The dynamics of the heat loads and thermal environment make it a challenge to properly size the radiator and often require some means of regulating the heat rejection rate of the radiators in order to achieve proper thermal balance. Specialized thermal control coatings, which can passively or actively adjust their emissivity offer an attractive solution to these design challenges. Such systems would allow intelligent control of the rate of heat loss from a radiator in response to heat load and thermal environmental variations. Intelligent thermal control through variable emissivity systems is well suited for nano and pico spacecraft applications where large thermal fluctuations are expected due to the small thermal mass and limited electric resources. Presently there are three different types of vari-e technologies under development: Micro ElectroMechanical Systems (MEMS) louvers, Electrochromic devices, and Electrophoretic devices. This paper will describe several prototypes of micromachined (MEMS) louvers and experimental results for the emissivity variations measured on theses prototypes. It will further discuss possible actuation mechanisms and space reliability aspects for different designs. Finally, for comparison parametric evaluations of the thermal performances of the new vari-e technology and standard thermal control systems are presented in this paper.

Novel multi-source phase-controlled radiofrequency technology for non-ablative and micro-ablative treatment of wrinkles, lax skin and acne scars.

PubMed

Elman, Monica; Harth, Yoram

2011-01-01

The basic properties of lasers and pulsed light sources limit their ability to deliver high energy to the dermis and subcutaneous tissues without excessive damage to the epidermis. Radiofrequency was shown to penetrate deeper than optical light sources independent of skin color. The early RF-based devices used single source bipolar RF, which is safe but limited in use due to the superficial flow of energy between the two bipolar electrodes. Another type of single source RF employs a single electrode (monopolar) in which the RF energy flows from one electrode on the surface of the skin through the entire body to a plate under the body. Although more effective than bipolar, this devices require intense active cooling of the skin and may be associated with considerable pain and other systemic and local safety concerns. Latest generation of RF technology developed by EndyMed Medical Ltd. (Caesarea, Israel) utilizes simultaneously six or more phase controlled RF generators (3DEEP technology). The multiple electrical fields created by the multiple sources "repel" or "attract" each other, leading to the precise 3 dimensional delivery of RF energy to the dermal and sub-dermal targets minimizing the energy flow through the epidermis without the need for active cooling. Confocal microscopy of the skin has shown that 6 treatment sessions of Multisource RF technology improve skin structure features. The skin after treatment had longer and narrower dermal papilla and denser and finer collagen fiber typical to younger skin as compared to pre treatment skin. Ultrasound of the skin showed after 6 treatment sessions reduction of 10 percent in the thickness of the subcutaneous fat layer. Non ablative facial clinical studies showed a significant reduction of wrinkles after treatment further reduced at 3 months follow-up. Body treatment studies showed a circumference reduction of 2.9 cm immediately after 6 treatments, and 2 cm at 12 months after the end of treatment, proving long term collagen remodeling effect. Clinical studies of the multisource fractional RF application have shown significant effects on wrinkles reduction and deep atrophic acne scars after 1-3 treatment sessions.

Novel multi-source phase-controlled radiofrequency technology for non-ablative and micro-ablative treatment of wrinkles, lax skin and acne scars

PubMed Central

Elman, Monica; Harth, Yoram

2011-01-01

The basic properties of lasers and pulsed light sources limit their ability to deliver high energy to the dermis and subcutaneous tissues without excessive damage to the epidermis. Radiofrequency was shown to penetrate deeper than optical light sources independent of skin color. The early RF-based devices used single source bipolar RF, which is safe but limited in use due to the superficial flow of energy between the two bipolar electrodes. Another type of single source RF employs a single electrode (monopolar) in which the RF energy flows from one electrode on the surface of the skin through the entire body to a plate under the body. Although more effective than bipolar, this devices require intense active cooling of the skin and may be associated with considerable pain and other systemic and local safety concerns. Latest generation of RF technology developed by EndyMed Medical Ltd. (Caesarea, Israel) utilizes simultaneously six or more phase controlled RF generators (3DEEP technology). The multiple electrical fields created by the multiple sources “repel” or “attract” each other, leading to the precise 3 dimensional delivery of RF energy to the dermal and sub-dermal targets minimizing the energy flow through the epidermis without the need for active cooling. Confocal microscopy of the skin has shown that 6 treatment sessions of Multisource RF technology improve skin structure features. The skin after treatment had longer and narrower dermal papilla and denser and finer collagen fiber typical to younger skin as compared to pre treatment skin. Ultrasound of the skin showed after 6 treatment sessions reduction of 10 percent in the thickness of the subcutaneous fat layer. Non ablative facial clinical studies showed a significant reduction of wrinkles after treatment further reduced at 3 months follow-up. Body treatment studies showed a circumference reduction of 2.9 cm immediately after 6 treatments, and 2 cm at 12 months after the end of treatment, proving long term collagen remodeling effect. Clinical studies of the multisource fractional RF application have shown significant effects on wrinkles reduction and deep atrophic acne scars after 1–3 treatment sessions. PMID:24155523

An improved radiofrequency method to pasteurize salmonella in shell eggs

USDA-ARS?s Scientific Manuscript database

The goals of this study were to improve radio frequency (RF) shell egg pasteurization technology to make it more commercially feasible, to evaluate its efficacy in reducing Salmonella, and to determine its effect on the quality changes of the egg. The original RF technology inactivated 6.8 log of E....

An absorptive single-pole four-throw switch using multiple-contact MEMS switches and its application to a monolithic millimeter-wave beam-forming network

NASA Astrophysics Data System (ADS)

Lee, Sanghyo; Kim, Jong-Man; Kim, Yong-Kweon; Kwon, Youngwoo

2009-01-01

In this paper, a new absorptive single-pole four-throw (SP4T) switch based on multiple-contact switching is proposed and integrated with a Butler matrix to demonstrate a monolithic beam-forming network at millimeter waves (mm waves). In order to simplify the switching driving circuit and reduce the number of unit switches in an absorptive SP4T switch, the individual switches were replaced with long-span multiple-contact switches using stress-free single-crystalline-silicon MEMS technology. This approach improves the mechanical stability as well as the manufacturing yield, thereby allowing successful integration into a monolithic beam former. The fabricated absorptive SP4T MEMS switch shows insertion loss less than 1.3 dB, return losses better than 11 dB at 30 GHz and wideband isolation performance higher than 39 dB from 20 to 40 GHz. The absorptive SP4T MEMS switch is integrated with a 4 × 4 Butler matrix on a single chip to implement a monolithic beam-forming network, directing beam into four distinct angles. Array factors from the measured data show that the proposed absorptive SPnT MEMS switch can be effectively used for high-performance mm-wave beam-switching systems. This work corresponds to the first demonstration of a monolithic beam-forming network using switched beams.

Heat convection in a micro impinging jet system

NASA Astrophysics Data System (ADS)

Mai, John Dzung Hoang

2000-10-01

This thesis covers the development of an efficient micro impinging jet heat exchanger, using MEMS technology, to provide localized cooling for present and next generation microelectronic computer chips. Before designing an efficient localized heat exchanger, it is necessary to investigate fluid dynamics and heat transfer in the micro scale. MEMS technology has been used in this project because it is the only tool currently available that can provide a large array of batch-fabricated, micro-scale nozzles for localized cooling. Our investigation of potential MEMS heat exchanger designs begins with experiments that measure the pressure drops and temperature changes in a micro scale tubing system that will be necessary to carry fluid to the impingement point. Our basic MEMS model is a freestanding micro channel with integrated temperature microsensors. The temperature distribution along the channel in a vacuum is measured. The measured flow rates are compared with an analytical model developed for capillary flow that accounts for 2-D, slip and compressibility effects. The work is focused on obtaining correlations in the form of the Nussult number, the Reynolds number and a H/d geometric factor. A set of single MEMS nozzles have been designed to test heat transfer effectiveness as a function of nozzle diameter, ranging from 1.0 mm to 250 um. In addition, nozzle and slot array MEMS devices have been fabricated. In order to obtain quantitative measurements from these micron scale devices, a series of target temperature sensor chips were custom made and characterized for these experiments. The heat transfer characteristics of various MEMS nozzle configurations operating at various steady inlet pressures, at different heights above the heated substrate, have been characterized. These steady results showed that the average heat transfer coefficient, averaged over a 1 cm2 test area, was usually less than 0.035 W/cm 2K for any situation. However, the local heat transfer coefficient, as measured by a single 4mum x 4mum temperature sensor, was as high as 0.5 W/cm2K. Using a mechanical valve and piezo actuator to perturb the flow at frequencies from 10 Hz to 1 kHz, we identify that enhanced heat transfer can occur in an unsteady forced jet. The functional dependence of the enhanced heat transfer on the mean jet speed, perturbation level and perturbing frequency has been established. The expected trend that increased heat transfer at higher values of St number was noticed. In addition the effect of a confined and free jet geometry on an unsteady flow was observed.

An investigation into graphene exfoliation and potential graphene application in MEMS devices

NASA Astrophysics Data System (ADS)

Fercana, George; Kletetschka, Gunther; Mikula, Vilem; Li, Mary

2011-02-01

The design of microelectromecanical systems (MEMS) and micro-opto-electromechanical systems (MOEMS) are often materials-limited with respect to the efficiency and capability of the material. Graphene, a one atom thick honeycomb lattice of carbon, is a highly desired material for MEMS applications. Relevant properties of graphene include the material's optical transparency, mechanical strength, energy efficiency, and electrical and thermal conductivity due to its electron mobility. Aforementioned properties make graphene a strong candidate to supplant existing transparent electrode technology and replace the conventionally used material, indium-tin oxide. In this paper we present preliminary results on work toward integration of graphene with MEMS structures. We are studying mechanical exfoliation of highly ordered pyrolytic graphite (HOPG) crystals by repeatedly applying and separating adhesive materials from the HOPG surface. The resulting graphene sheets are then transferred to silicon oxide substrate using the previously applied adhesive material. We explored different adhesive options, particularly the use of Kapton tape, to improve the yield of graphene isolation along with chemical cross-linking agents which operate on a mechanism of photoinsertion of disassociated nitrene groups. These perfluorophenyl nitrenes participate in C=C addition reactions with graphene monolayers creating a covalent binding between the substrate and graphene. We are focusing on maximizing the size of isolated graphene sheets and comparing to conventional exfoliation. Preliminary results allow isolation of few layer graphene (FLG) sheets (n<3) of approximately 10μm x 44μm. Photolithography could possibly be utilized to tailor designs for microshutter technology to be used in future deep space telescopes.

MEMS-based thermally-actuated image stabilizer for cellular phone camera

NASA Astrophysics Data System (ADS)

Lin, Chun-Ying; Chiou, Jin-Chern

2012-11-01

This work develops an image stabilizer (IS) that is fabricated using micro-electro-mechanical system (MEMS) technology and is designed to counteract the vibrations when human using cellular phone cameras. The proposed IS has dimensions of 8.8 × 8.8 × 0.3 mm3 and is strong enough to suspend an image sensor. The processes that is utilized to fabricate the IS includes inductive coupled plasma (ICP) processes, reactive ion etching (RIE) processes and the flip-chip bonding method. The IS is designed to enable the electrical signals from the suspended image sensor to be successfully emitted out using signal output beams, and the maximum actuating distance of the stage exceeds 24.835 µm when the driving current is 155 mA. Depending on integration of MEMS device and designed controller, the proposed IS can decrease the hand tremor by 72.5%.

Compact Power Conditioning and RF Systems for a High Power RF Source

DTIC Science & Technology

2008-12-01

RF systems have increasing potential for application by the Army. High power RF, or high power microwave ( HPM ), systems can disrupt or disable...that are small, lightweight, portable, and use an independent energy source. The resulting system will be able to produce HPM from a compact package...The consortium was formed to advance the technology of the components required for a compact HPM source with the final goal of full system

MEMS device for mass market gas and chemical sensors

NASA Astrophysics Data System (ADS)

Kinkade, Brian R.; Daly, James T.; Johnson, Edward A.

2000-08-01

Gas and chemical sensors are used in many applications. Industrial health and safety monitors allow companies to meet OSHA requirements by detecting harmful levels of toxic or combustible gases. Vehicle emissions are tested during annual inspections. Blood alcohol breathalizers are used by law enforcement. Refrigerant leak detection ensures that the Earth's ozone layer is not being compromised. Industrial combustion emissions are also monitored to minimize pollution. Heating and ventilation systems watch for high levels of carbon dioxide (CO2) to trigger an increase in fresh air exchange. Carbon monoxide detectors are used in homes to prevent poisoning from poor combustion ventilation. Anesthesia gases are monitored during a patients operation. The current economic reality is that two groups of gas sensor technologies are competing in two distinct existing market segments - affordable (less reliable) chemical reaction sensors for consumer markets and reliable (expensive) infrared (IR) spectroscopic sensors for industrial, laboratory, and medical instrumentation markets. Presently high volume mass-market applications are limited to CO detectros and on-board automotive emissions sensors. Due to reliability problems with electrochemical sensor-based CO detectors there is a hesitancy to apply these sensors in other high volume applications. Applications such as: natural gas leak detection, non-invasive blood glucose monitoring, home indoor air quality, personal/portable air quality monitors, home fire/burnt cooking detector, and home food spoilage detectors need a sensor that is a small, efficient, accurate, sensitive, reliable, and inexpensive. Connecting an array of these next generation gas sensors to wireless networks that are starting to proliferate today creates many other applications. Asthmatics could preview the air quality of their destinations as they venture out into the day. HVAC systems could determine if fresh air intake was actually better than the air in the house. Internet grocery delivery services could check for spoiled foods in their clients' refrigerators. City emissions regulators could monitor the various emissions sources throughout the area from their desk to predict how many pollution vouchers they will need to trade in the next week. We describe a new component architecture for mass-market sensors based on silicon microelectromechanical systems (MEMS) technology. MEMS are micrometer-scale devices that can be fabricated as discrete devices or large arrays, using the technology of integrated circuit manufacturing. These new photonic bandgap and MEMS fabricataion technologies will simplify the component technology to provide high-quality gas and chemical sensors at consumer prices.

Advanced materials and techniques for fibre-optic sensing

NASA Astrophysics Data System (ADS)

Henderson, Philip J.

2014-06-01

Fibre-optic monitoring systems came of age in about 1999 upon the emergence of the world's first significant commercialising company - a spin-out from the UK's collaborative MAST project. By using embedded fibre-optic technology, the MAST project successfully measured transient strain within high-performance composite yacht masts. Since then, applications have extended from smart composites into civil engineering, energy, military, aerospace, medicine and other sectors. Fibre-optic sensors come in various forms, and may be subject to embedment, retrofitting, and remote interrogation. The unique challenges presented by each implementation require careful scrutiny before widespread adoption can take place. Accordingly, various aspects of design and reliability are discussed spanning a range of representative technologies that include resonant microsilicon structures, MEMS, Bragg gratings, advanced forms of spectroscopy, and modern trends in nanotechnology. Keywords: Fibre-optic sensors, fibre Bragg gratings, MEMS, MOEMS, nanotechnology, plasmon.

Simulation of Strain Induced Pseudomagnetic Fields in Graphene Suspended on MEMS Chevron Actuators

NASA Astrophysics Data System (ADS)

Vutukuru, Mounika; Christopher, Jason; Bishop, David; Swan, Anna

Graphene has been shown to withstand remarkable levels of mechanical strain an order of magnitude larger than bulk crystalline materials. This exceptional stretchability of graphene allows for the direct tuning of fundamental material properties, as well as for the investigation of novel physics such as generation of strain induced pseudomagnetic fields. However, current methods for strain such as polymer elongation or pressurized wells do not integrate well into devices. We propose microelectromechanical (MEMS) Chevron actuators as a reliable platform for applying strain to graphene. In addition to their advantageous controllable output force, low input power and ease of integration into existing technologies, MEMS allow for different strain orientations to optimize pseudomagnetic field generation in graphene. Here, we model nonuniform strain in suspended graphene on Chevron actuators using COMSOL Multiphysics. By simulating the deformation of the graphene geometry under the device actuation, we explore the pseudomagnetic field map induced by numerically calculating the components of the strain tensor. Our models provide the theoretical framework with which experimental analysis is compared, and optimize our MEMS designs for further exploration of novel physics in graphene. The authors would like to thank NSF DMR 1411008 for their support on this project.

Design, modeling and simulation of MEMS-based silicon Microneedles

NASA Astrophysics Data System (ADS)

Amin, F.; Ahmed, S.

2013-06-01

The advancement in semiconductor process engineering and nano-scale fabrication technology has made it convenient to transport specific biological fluid into or out of human skin with minimum discomfort. Fluid transdermal delivery systems such as Microneedle arrays are one such emerging and exciting Micro-Electro Mechanical System (MEMS) application which could lead to a total painless fluid delivery into skin with controllability and desirable yield. In this study, we aimed to revisit the problem with modeling, design and simulations carried out for MEMS based silicon hollow out of plane microneedle arrays for biomedical applications particularly for transdermal drug delivery. An approximate 200 μm length of microneedle with 40 μm diameter of lumen has been successfully shown formed by isotropic and anisotropic etching techniques using MEMS Pro design tool. These microneedles are arranged in size of 2 × 4 matrix array with center to center spacing of 750 μm. Furthermore, comparisons for fluid flow characteristics through these microneedle channels have been modeled with and without the contribution of the gravitational forces using mathematical models derived from Bernoulli Equation. Physical Process simulations have also been performed on TCAD SILVACO to optimize the design of these microneedles aligned with the standard Si-Fabrication lines.

EDITORIAL: The 6th International Workshop on Micro and Nanotechnologies for Power Generation and Energy Conversion Applications (PowerMEMS 2006)

NASA Astrophysics Data System (ADS)

Fréchette, Luc G.

2007-09-01

Energy is a sector of paramount importance over the coming decades if we are to ensure sustainable development that respects our environment. The research and development of novel approaches to convert available energy into usable forms using micro and nanotechnologies can contribute towards this goal and meet the growing need for power in small scale portable applications. The dominant power sources for handheld and other portable electronics are currently primary and rechargeable batteries. Their limited energy density and adverse effects on the environment upon disposal suggest that alternative approaches need to be explored. This special issue will showcase some of the leading work in this area, initially presented at PowerMEMS 2006, the 6th International Workshop on Micro and Nanotechnologies for Power Generation and Energy Conversion Applications. Power MEMS are defined as microsystems for electrical power generation and other energy conversion applications, including propulsion and cooling. The range of power MEMS technologies includes micro thermodynamic machines, such as microturbines, miniature internal combustion engines and micro-coolers; solid-state direct energy conversion, such as thermoelectric and photovoltaic microstructures; micro electrochemical devices, such as micro fuel cells and nanostructure batteries; vibration energy harvesting devices, such as piezoelectric, magnetic or electrostatic micro generators, as well as micro thrusters and rocket engines for propulsion. These can either be driven by scavenging thermal, mechanical or solar energy from the environment, or from a stored energy source, such as chemical fuel or radioactive material. The unique scope leads to unique challenges in the development of power MEMS, ranging from the integration of novel materials to the efficient small scale implementation of energy conversion principles. In this special issue, Mitcheson et al provide a comparative assessment of three inertial vibration energy harvesting approaches. Technologies and approaches for micro heat engines are shared, ranging from a complete microsystem for thermal energy harvesting (Cho et al) to core bearing and microturbomachinery technologies for rotating micro heat engines (Waits et al, Nakajima et al). Electrochemical microsystems are also presented, based on methanol as fuel (Morse et al), as well as novel micro and nanofabrication approaches (Chu et al). Fuel cell microsystems with integrated hydrogen generation approaches are also investigated by Peterson et al and Varady et al, illustrating the benefits and challenges of miniaturizing complete power sources. Finally, biological micro fuel cells that leverage the principles found in nature are presented, in contrast to chemical fuel cells (Chen et al, Morishima et al). We hope that this work will inspire others to pursue innovative research and development activities in the area of power MEMS, and consequently contribute to addressing our energy challenges for the 21st century.

R.F Microphotonics for NASA Space Communications Applications

NASA Technical Reports Server (NTRS)

Pouch, John; Nguyen, Hung; Lee, Richard; Miranda, Felix; Hossein-Zadeh, Mani; Cohen, David; Levi, A. F. J.

2007-01-01

An RF microphotonic receiver has-been developed at Ka-band. The receiver consists of a lithium niobate micro-disk that enables RF-optical coupling to occur. The modulated optical signal (- 200 THz) is detected by the high-speed photonic signal processing electronics. When compared with an electronic approach, the microphotonic receiver technology offers 10 times smaller volume, smaller weight, and smaller power consumption; greater sensitivity; and optical isolation for use in extreme environments. The status of the technology development will be summarized, and the potential application of the receiver to NASA space communications systems will be described.

Cu Pillar Low Temperature Bonding and Interconnection Technology of for 3D RF Microsystem

NASA Astrophysics Data System (ADS)

Shi, G. X.; Qian, K. Q.; Huang, M.; Yu, Y. W.; Zhu, J.

2018-03-01

In this paper 3D interconnects technologies used Cu pillars are discussed with respect to RF microsystem. While 2.5D Si interposer and 3D packaging seem to rely to cu pillars for the coming years, RF microsystem used the heterogeneous chip such as GaAs integration with Si interposers should be at low temperature. The pillars were constituted by Cu (2 micron) -Ni (2 micron) -Cu (3 micron) -Sn (1 micron) multilayer metal and total height is 8 micron on the front-side of the wafer by using electroplating. The wafer backside Cu pillar is obtained by temporary bonding, thinning and silicon surface etching. The RF interposers are stacked by Cu-Sn eutectic bonding at 260 °C. Analyzed the reliability of different pillar bonding structure.

MEMS sensor technologies for human centred applications in healthcare, physical activities, safety and environmental sensing: a review on research activities in Italy.

PubMed

Ciuti, Gastone; Ricotti, Leonardo; Menciassi, Arianna; Dario, Paolo

2015-03-17

Over the past few decades the increased level of public awareness concerning healthcare, physical activities, safety and environmental sensing has created an emerging need for smart sensor technologies and monitoring devices able to sense, classify, and provide feedbacks to users' health status and physical activities, as well as to evaluate environmental and safety conditions in a pervasive, accurate and reliable fashion. Monitoring and precisely quantifying users' physical activity with inertial measurement unit-based devices, for instance, has also proven to be important in health management of patients affected by chronic diseases, e.g., Parkinson's disease, many of which are becoming highly prevalent in Italy and in the Western world. This review paper will focus on MEMS sensor technologies developed in Italy in the last three years describing research achievements for healthcare and physical activity, safety and environmental sensing, in addition to smart systems integration. Innovative and smart integrated solutions for sensing devices, pursued and implemented in Italian research centres, will be highlighted, together with specific applications of such technologies. Finally, the paper will depict the future perspective of sensor technologies and corresponding exploitation opportunities, again with a specific focus on Italy.

A noncontact RF-based respiratory sensor: results of a clinical trial.

PubMed

Madsen, Spence; Baczuk, Jordan; Thorup, Kurt; Barton, Richard; Patwari, Neal; Langell, John T

2016-06-01

Respiratory rate (RR) is a critical vital signs monitored in health care setting. Current monitors suffer from sensor-contact failure, inaccurate data, and limited patient mobility. There is a critical need for an accurate and reliable and noncontact system to monitor RR. We developed a contact-free radio frequency (RF)-based system that measures movement using WiFi signal diffraction, which is converted into interpretable data using a Fourier transform. Here, we investigate the system's ability to measure fine movements associated with human respiration. Testing was conducted on subjects using visual cue, fixed-tempo instruction to breath at standard RRs. Blinded instruction-based RRs were compared to RF-acquired data to determine measurement accuracy. The RF-based technology was studied on postoperative ventilator-dependent patients. Blinded ventilator capnographic RR data were collected for each patient and compared to RF-acquired data to determine measurement accuracy. Respiratory rate data collected from 10 subjects breathing at a fixed RR (14, 16, 18, or 20) demonstrated 95.5% measurement accuracy between the patient's actual rate and that measured by our RF technology. Ten patients were enrolled into the clinical trial. Blinded ventilator capnographic RR data were compared to RF-based acquired data. The RF-based data showed 88.8% measurement accuracy with ventilator capnography. Initial clinical pilot trials with our contact-free RF-based monitoring system demonstrate a high degree of RR measurement accuracy when compared to capnographic data. Based on these results, we believe RF-based systems present a promising noninvasive, inexpensive, and accurate tool for continuous RR monitoring. Copyright © 2016 Elsevier Inc. All rights reserved.

Adaptive optics for high-contrast imaging of faint substellar companions

NASA Astrophysics Data System (ADS)

Morzinski, Katie M.

Direct imaging of faint objects around bright stars is challenging because the primary star's diffracted light can overwhelm low-mass companions. Nevertheless, advances in adaptive optics (AO) and high-contrast imaging have revealed the first pictures of extrasolar planets. In this dissertation I employ today's high-contrast AO techniques to image brown dwarfs around stars in the nearby Hyades cluster. Furthermore, I prepare for the next generation of high-contrast AO instrumentation, by qualifying MEMS deformable mirrors for wavefront control in the Gemini Planet Imager. In Part I, I present discovery of 3 new brown dwarfs and 36 low-mass stellar companions to 85 stars in the Hyades, imaged with AO at Keck and Lick Observatories. The "locally-optimized combination of images" (LOCI) image-diversity technique filters out the primary star to reveal faint companions. This survey is complete to the hydrogen-burning limit at separations beyond 20 AU. In the complete sample, multiplicity increases as primary star mass decreases. Additionally, the brown dwarfs are at wide >150 AU separations. Finding this preference for low binding-energy systems is an unexpected result, as the Hyades is 625 Myr old and dynamically relaxed. Future work will continue to explore this trend to understand the dynamical and star formation history of the Hyades. The brown dwarfs are near interesting transition regimes for low-mass objects; therefore, characterizing their atmospheres with spectrophotometry will serve as an important benchmark for our understanding of these cool objects. In Part II, I demonstrate micro-electro-mechanical systems (MEMS) deformable mirrors for high-order wavefront control in the Gemini Planet Imager (GPI). MEMS micromirrors have thousands of degrees of freedom and represent a significant cost efficiency over conventional glass deformable mirrors, making them ideal for high-contrast AO. In Chapter 7, I present experimental evidence that MEMS actuators function well and are stable and repeatable at the sub-nm level over the course of an hour. In Chapter 8, I prove MEMS ability to correct high-order Kolmogorov turbulence and maintain the high-contrast "dark hole" in the GPI woofer-tweeter architecture. Finally, in Chapter 9, I analyze MEMS performance on sky with Villages, a telescope testbed for MEMS technology, visible-light AO, and open-loop control. The MEMS remains repeatably flat and controllable over ˜4 years and ˜800 hours of operation. Open loop control of the hysteresis-free MEMS produces a diffraction-limited core in I-band, while internal static errors dominate the on-sky error budget. This work establishes MEMS deformable mirrors as excellent wavefront correctors for high-order AO. The MEMS in GPI will produce a deeper, broader dark hole, allowing for detection and characterization of directly-imaged planets in a fainter, wider search space.

PREFACE: MEM07: The 5th Annual Workshop on Mechanical and Electromagnetic Properties of Composite Superconductors (Princeton, NJ, USA, 21 24 August 2007)

NASA Astrophysics Data System (ADS)

Larbalestier, D. C.; Osamura, K.; Hampshire, D. P.

2008-05-01

MEM07 was the 5th international workshop concentrating on the mechanical and electrical properties of composite superconductors, which are the technological conductor forms from which practical superconducting devices are made. Such superconducting conductors respond to important challenges we currently face, especially those concerned with the proper management of the world's energy resources. Superconductivity provides a means to address the challenges in the generation, transmission and distribution, and use of energy. For energy generation, the ITER Fusion Tokomak (now underway in France) provides exciting new challenges for the whole superconductivity community, due to the enormous size and strong fields of the plasma confinement superconducting magnets that will form the largest and most powerful superconducting machine yet built. Significant attention was paid at MEM07 to the modeling, characterization, testing and validation of the high-amperage Nb3Sn cable-in-conduit conductors needed for ITER. As for electric energy industry uses, there was much discussion of both first generation (Bi,Pb)2Sr2Ca2Cu3Ox conductors and the rapidly emerging second generation coated conductors made from YBa2Cu37-x. High-performing, affordable conductors of these materials are vital for large capacity transmission cables, energy storage systems, fault current limiters, generators and motors—many prototypes of which are being pursued in technologically advanced countries. There is a broad consensus that the prototype stage for high-current-high-field superconducting applications is nearing its end and that large scale applications are technologically feasible. However full industrialization of large-scale superconducting technologies in electric utility applications will benefit from continuous improvement in critical current, lower ac loss, higher strength and other vital conductor properties. The establishment of optimal procedures for the system design accompanying scale-up is a second vital task. As system design is dependent on material development, there is a critical need to study the key issues in developing high performance superconducting materials. The emphases of MEM07 were The mechanical properties of superconductors including the influence of stress and strain on the critical current of practical conductors including YBCO and ReBCO coated conductors, BSCCO tapes, MgB2 wires and Nb3Sn filamentary conductors. The intrinsic strain effects on critical current density in Nb3Sn, YBCO, BSCCO and MgB2. Recent advances in critical current, the mechanical properties and the reduction in ac losses of HTS tapes and wires. The compositional and microstructural dependence of E-J characteristics and explanations based on flux pinning, grain boundary weak-links and other mechanisms. Standardized test-methods: international cooperative research work to establish test methods for assessing the mechano-electromagnetic properties of superconductors based on the activities of IEC/TC90 and VAMAS/TWA-16. More than 60 researchers from more than 12 countries attended the MEM07 workshop, and about 40 presentations were made. A small selection of papers (15) from the workshop are included in this special issue of Superconductor Science and Technology. Taken together with papers published at earlier MEM meetings, this issue provides an updated view of some of the current state-of-the-art research in the mechano-electromagnetic properties of composite superconductors. The workshop was organized under the activities of the NEDO Grant Project (Applied Superconductivity, 2004EA004) and VAMAS/TWA-16. The meeting was organized by a committee composed of David Larbalestier (Conference Chair) aided by MEM05 and MEM06 Conference Chairs Kozo Osamura (Research Institute for Applied Sciences, Kyoto, Japan), Damian Hampshire (Durham University, UK) and Arman Nyilas (CEME). The Program Committee was composed of Ettore Salpietro (European Fusion Development Agreement), Neil Mitchell (ITER), Kozo Osamura, Damian Hampshire and Arman Nyilas. We express our great thanks to all those whose efforts were key in organizing the meeting, with very special thanks to our Meeting Planner Kate Liu who organized matters large and small with discretion and great efficiency.

Pick-and-place process for sensitivity improvement of the capacitive type CMOS MEMS 2-axis tilt sensor

NASA Astrophysics Data System (ADS)

Chang, Chun-I.; Tsai, Ming-Han; Liu, Yu-Chia; Sun, Chih-Ming; Fang, Weileun

2013-09-01

This study exploits the foundry available complimentary metal-oxide-semiconductor (CMOS) process and the packaging house available pick-and-place technology to implement a capacitive type micromachined 2-axis tilt sensor. The suspended micro mechanical structures such as the spring, stage and sensing electrodes are fabricated using the CMOS microelectromechanical systems (MEMS) processes. A bulk block is assembled onto the suspended stage by pick-and-place technology to increase the proof-mass of the tilt sensor. The low temperature UV-glue dispensing and curing processes are employed to bond the block onto the stage. Thus, the sensitivity of the CMOS MEMS capacitive type 2-axis tilt sensor is significantly improved. In application, this study successfully demonstrates the bonding of a bulk solder ball of 100 µm in diameter with a 2-axis tilt sensor fabricated using the standard TSMC 0.35 µm 2P4M CMOS process. Measurements show the sensitivities of the 2-axis tilt sensor are increased for 2.06-fold (x-axis) and 1.78-fold (y-axis) after adding the solder ball. Note that the sensitivity can be further improved by reducing the parasitic capacitance and the mismatch of sensing electrodes caused by the solder ball.

High-productivity DRIE solutions for 3D-SiP and MEMS volume manufacturing

NASA Astrophysics Data System (ADS)

Puech, M.; Thevenoud, J. M.; Launay, N.; Arnal, N.; Godinat, P.; Andrieu, B.; Gruffat, J. M.

2006-12-01

Emerging 3D-SiP technologies and high volume MEMS applications require high productivity mass production DRIE systems. The Alcatel DRIE product range has recently been optimized to reach the highest process and hardware production performances. A study based on sub-micron high aspect ratio structures encountered in the most stringent 3D-SiP has been carried out. The optimization of the Bosch process parameters have shown ultra high silicon etch rate, with unrivaled uniformity and repeatability leading to excellent process yields. In parallel, most recent hardware and proprietary design optimization including vacuum pumping lines, process chamber, wafer chucks, pressure control system, gas delivery are discussed. A key factor for achieving the highest performances was the recognized expertise of Alcatel vacuum and plasma science technologies. These improvements have been monitored in a mass production environment for a mobile phone application. Field data analysis shows a significant reduction of cost of ownership thanks to increased throughput and much lower running costs. These benefits are now available for all 3D-SiP and high volume MEMS applications. The typical etched patterns include tapered trenches for CMOS imagers, through silicon via holes for die stacking, well controlled profile angle for 3D high precision inertial sensors, and large exposed area features for inkjet printer head and Silicon microphones.

MEMS-based flexible reflective analog modulators (FRAM) for projection displays: a technology review and scale-down study

NASA Astrophysics Data System (ADS)

Picard, Francis; Ilias, Samir; Asselin, Daniel; Boucher, Marc-André; Duchesne, François; Jacob, Michel; Larouche, Carl; Vachon, Carl; Niall, Keith K.; Jerominek, Hubert

2011-02-01

A MEMS based technology for projection display is reviewed. This technology relies on mechanically flexible and reflective microbridges made of aluminum alloy. A linear array of such micromirrors is combined with illumination and Schlieren optics to produce a pixels line. Each microbridge in the array is individually controlled using electrostatic actuation to adjust the pixels intensities. Results of the simulation, fabrication and characterization of these microdevices are presented. Activation voltages below 250 V with response times below 10 μs were obtained for 25 μm × 25 μm micromirrors. With appropriate actuation voltage waveforms, response times of 5 μs and less are achievable. A damage threshold of the mirrors above 8 kW/cm2 has been evaluated. Development of the technology has produced projector engines demonstrating this light modulation principle. The most recent of these engines is DVI compatible and displays VGA video streams at 60 Hz. Recently applications have emerged that impose more stringent requirements on the dimensions of the MEMS array and associated optical system. This triggered a scale down study to evaluate the minimum micromirror size achievable, the impact of this reduced size on the damage threshold and the achievable minimum size of the associated optical system. Preliminary results of this scale down study are reported. FRAM with active surface as small as 5 μm × 5 μm have been investigated. Simulations have shown that such micromirrors could be activated with 107 V to achieve f-number of 1.25. The damage threshold has been estimated for various FRAM sizes. Finally, design of a conceptual miniaturized projector based on 1000×1 array of 5 μm × 5 μm micromirrors is presented. The volume of this projector concept is about 12 cm3.

Percutaneous Steerable Robotic Tool Delivery Platform and Metal MEMS Device for Tissue Manipulation and Approximation: Closure of Patent Foramen Ovale in an Animal Model

PubMed Central

Vasilyev, Nikolay V.; Gosline, Andrew H.; Butler, Evan; Lang, Nora; Codd, Patrick J.; Yamauchi, Haruo; Feins, Eric N.; Folk, Chris R.; Cohen, Adam L.; Chen, Richard; Zurakowski, David; del Nido, Pedro J.; Dupont, Pierre E

2013-01-01

Background Beating-heart image-guided intracardiac interventions have been evolving rapidly. To extend the domain of catheter-based and transcardiac interventions into reconstructive surgery, a new robotic tool delivery platform (TDP) and tissue approximation device have been developed. Initial results employing these tools to perform patent foramen ovale (PFO) closure are described. Methods and Results A robotic TDP comprised of superelastic metal tubes provides the capability of delivering and manipulating tools and devices inside the beating heart. A new device technology is also presented that utilizes a metal-based MicroElectroMechanical Systems (MEMS) manufacturing process to produce fully-assembled and fully-functional millimeter-scale tools. As a demonstration of both technologies, a PFO creation and closure was performed in a swine model. In the first group of animals (N=10), a preliminary study was performed. The procedural technique was validated with a transcardiac handheld delivery platform and epicardial echocardiography, video-assisted cardioscopy and fluoroscopy. In the second group (N=9), the procedure was performed percutaneously using the robotic TDP under epicardial echocardiography and fluoroscopy imaging. All PFO’s were completely closed in the first group. In the second group, the PFO was not successfully created in 1 animal, and the defects were completely closed in 6 of the 8 remaining animals. Conclusions In contrast to existing robotic catheter technologies, the robotic TDP utilizes a combination of stiffness and active steerability along its length to provide the positioning accuracy and force application capability necessary for tissue manipulation. In combination with a MEMS tool technology, it can enable reconstructive procedures inside the beating heart. PMID:23899870

Micromachined fiber optic Fabry-Perot underwater acoustic probe

NASA Astrophysics Data System (ADS)

Wang, Fuyin; Shao, Zhengzheng; Hu, Zhengliang; Luo, Hong; Xie, Jiehui; Hu, Yongming

2014-08-01

One of the most important branches in the development trend of the traditional fiber optic physical sensor is the miniaturization of sensor structure. Miniature fiber optic sensor can realize point measurement, and then to develop sensor networks to achieve quasi-distributed or distributed sensing as well as line measurement to area monitoring, which will greatly extend the application area of fiber optic sensors. The development of MEMS technology brings a light path to address the problems brought by the procedure of sensor miniaturization. Sensors manufactured by MEMS technology possess the advantages of small volume, light weight, easy fabricated and low cost. In this paper, a fiber optic extrinsic Fabry-Perot interferometric underwater acoustic probe utilizing micromachined diaphragm collaborated with fiber optic technology and MEMS technology has been designed and implemented to actualize underwater acoustic sensing. Diaphragm with central embossment, where the embossment is used to anti-hydrostatic pressure which would largely deflect the diaphragm that induce interferometric fringe fading, has been made by double-sided etching of silicon on insulator. By bonding the acoustic-sensitive diaphragm as well as a cleaved fiber end in ferrule with an outer sleeve, an extrinsic Fabry-Perot interferometer has been constructed. The sensor has been interrogated by quadrature-point control method and tested in field-stable acoustic standing wave tube. Results have been shown that the recovered signal detected by the sensor coincided well with the corresponding transmitted signal and the sensitivity response was flat in frequency range from 10 Hz to 2kHz with the value about -154.6 dB re. 1/μPa. It has been manifest that the designed sensor could be used as an underwater acoustic probe.

Graphene Quantum Capacitors for High Frequency Tunable Analog Applications.

PubMed

Moldovan, Clara F; Vitale, Wolfgang A; Sharma, Pankaj; Tamagnone, Michele; Mosig, Juan R; Ionescu, Adrian M

2016-08-10

Graphene quantum capacitors (GQC) are demonstrated to be enablers of radio-frequency (RF) functions through voltage-tuning of their capacitance. We show that GQC complements MEMS and MOSFETs in terms of performance for high frequency analog applications and tunability. We propose a CMOS compatible fabrication process and report the first experimental assessment of their performance at microwaves frequencies (up to 10 GHz), demonstrating experimental GQCs in the pF range with a tuning ratio of 1.34:1 within 1.25 V, and Q-factors up to 12 at 1 GHz. The figures of merit of graphene variable capacitors are studied in detail from 150 to 350 K. Furthermore, we describe a systematic, graphene specific approach to optimize their performance and predict the figures of merit achieved if such a methodology is applied.

Urban MEMS based seismic network for post-earthquakes rapid disaster assessment

NASA Astrophysics Data System (ADS)

D'Alessandro, Antonino; Luzio, Dario; D'Anna, Giuseppe

2014-05-01

Life losses following disastrous earthquake depends mainly by the building vulnerability, intensity of shaking and timeliness of rescue operations. In recent decades, the increase in population and industrial density has significantly increased the exposure to earthquakes of urban areas. The potential impact of a strong earthquake on a town center can be reduced by timely and correct actions of the emergency management centers. A real time urban seismic network can drastically reduce casualties immediately following a strong earthquake, by timely providing information about the distribution of the ground shaking level. Emergency management centers, with functions in the immediate post-earthquake period, could be use this information to allocate and prioritize resources to minimize loss of human life. However, due to the high charges of the seismological instrumentation, the realization of an urban seismic network, which may allow reducing the rate of fatalities, has not been achieved. Recent technological developments in MEMS (Micro Electro-Mechanical Systems) technology could allow today the realization of a high-density urban seismic network for post-earthquakes rapid disaster assessment, suitable for the earthquake effects mitigation. In the 1990s, MEMS accelerometers revolutionized the automotive-airbag system industry and are today widely used in laptops, games controllers and mobile phones. Due to their great commercial successes, the research into and development of MEMS accelerometers are actively pursued around the world. Nowadays, the sensitivity and dynamics of these sensors are such to allow accurate recording of earthquakes with moderate to strong magnitude. Due to their low cost and small size, the MEMS accelerometers may be employed for the realization of high-density seismic networks. The MEMS accelerometers could be installed inside sensitive places (high vulnerability and exposure), such as schools, hospitals, public buildings and places of worship. The waveforms recorded could be promptly used to determine ground-shaking parameters, like peak ground acceleration/velocity/displacement, Arias and Housner intensity, that could be all used to create, few seconds after a strong earthquakes, shaking maps at urban scale. These shaking maps could allow to quickly identify areas of the town center that have had the greatest earthquake resentment. When a strong seismic event occur, the beginning of the ground motion observed at the site could be used to predict the ensuing ground motion at the same site and so to realize a short term earthquake early warning system. The data acquired after a moderate magnitude earthquake, would provide valuable information for the detail seismic microzonation of the area based on direct earthquake shaking observations rather than from a model-based or indirect methods. In this work, we evaluate the feasibility and effectiveness of such seismic network taking in to account both technological, scientific and economic issues. For this purpose, we have simulated the creation of a MEMS based urban seismic network in a medium size city. For the selected town, taking into account the instrumental specifics, the array geometry and the environmental noise, we investigated the ability of the planned network to detect and measure earthquakes of different magnitude generated from realistic near seismogentic sources.

1998 IEEE Aerospace Conference. Proceedings.

NASA Astrophysics Data System (ADS)

The following topics were covered: science frontiers and aerospace; flight systems technologies; spacecraft attitude determination and control; space power systems; smart structures and dynamics; military avionics; electronic packaging; MEMS; hyperspectral remote sensing for GVP; space laser technology; pointing, control, tracking and stabilization technologies; payload support technologies; protection technologies; 21st century space mission management and design; aircraft flight testing; aerospace test and evaluation; small satellites and enabling technologies; systems design optimisation; advanced launch vehicles; GPS applications and technologies; antennas and radar; software and systems engineering; scalable systems; communications; target tracking applications; remote sensing; advanced sensors; and optoelectronics.

DLC Film Formation Technologies by Applying Pulse Voltage Coupled with RF Voltage to Complicated 3-dimensional Substrates and Industrial Application

NASA Astrophysics Data System (ADS)

Suzuki, Yasuo

A uniform plasma-based ion implantation and DLC film formation technologies on the surface of complicated 3-dimensional substrates have been developed by applying pulse voltage coupled with RF voltage to the substrates such as plastics, rubber as well as metals with the similar deposition rate. These technologies are widely applicable to both ion implantation and DLC film formation onto the automobile parts, mechanical parts and metal molds. A problem to be solved is reducing cost. The deposition rate of DLC films is expected to increase to around 10μm/hr, which is ten times larger than that of the conventional method, by hybridizing the ICP (Induction Coupling Plasma) with a plus-minus voltage source. This epoch-making technology will be able to substitute for the electro-plating method in the near future. In this paper, the DLC film formation technology by applying both RF and pulse voltage, its applications and its prospect are presented.

Design of a MEMS-Based Oscillator Using 180nm CMOS Technology.

PubMed

Roy, Sukanta; Ramiah, Harikrishnan; Reza, Ahmed Wasif; Lim, Chee Cheow; Ferrer, Eloi Marigo

2016-01-01

Micro-electro mechanical system (MEMS) based oscillators are revolutionizing the timing industry as a cost effective solution, enhanced with more features, superior performance and better reliability. The design of a sustaining amplifier was triggered primarily to replenish MEMS resonator's high motion losses due to the possibility of their 'system-on-chip' integrated circuit solution. The design of a sustaining amplifier observing high gain and adequate phase shift for an electrostatic clamp-clamp (C-C) beam MEMS resonator, involves the use of an 180nm CMOS process with an unloaded Q of 1000 in realizing a fixed frequency oscillator. A net 122dBΩ transimpedance gain with adequate phase shift has ensured 17.22MHz resonant frequency oscillation with a layout area consumption of 0.121 mm2 in the integrated chip solution, the sustaining amplifier draws 6.3mW with a respective phase noise of -84dBc/Hz at 1kHz offset is achieved within a noise floor of -103dBC/Hz. In this work, a comparison is drawn among similar design studies on the basis of a defined figure of merit (FOM). A low phase noise of 1kHz, high figure of merit and the smaller size of the chip has accredited to the design's applicability towards in the implementation of a clock generative integrated circuit. In addition to that, this complete silicon based MEMS oscillator in a monolithic solution has offered a cost effective solution for industrial or biomedical electronic applications.

Cost-Effectiveness of Remote Cardiac Monitoring With the CardioMEMS Heart Failure System.

PubMed

Schmier, Jordana K; Ong, Kevin L; Fonarow, Gregg C

2017-07-01

Heart failure (HF) is a leading cause of cardiovascular mortality in the United States and presents a substantial economic burden. A recently approved implantable wireless pulmonary artery pressure remote monitor, the CardioMEMS HF System, has been shown to be effective in reducing hospitalizations among New York Heart Association (NYHA) class III HF patients. The objective of this study was to estimate the cost-effectiveness of this remote monitoring technology compared to standard of care treatment for HF. A Markov cohort model relying on the CHAMPION (CardioMEMS Heart Sensor Allows Monitoring of Pressure to Improve Outcomes in NYHA Class III Heart Failure Patients) clinical trial for mortality and hospitalization data, published sources for cost data, and a mix of CHAMPION data and published sources for utility data, was developed. The model compares outcomes over 5 years for implanted vs standard of care patients, allowing patients to accrue costs and utilities while they remain alive. Sensitivity analyses explored uncertainty in input parameters. The CardioMEMS HF System was found to be cost-effective, with an incremental cost-effectiveness ratio of $44,832 per quality-adjusted life year (QALY). Sensitivity analysis found the model was sensitive to the device cost and to whether mortality benefits were sustained, although there were no scenarios in which the cost/QALY exceeded $100,000. Compared with standard of care, the CardioMEMS HF System was cost-effective when leveraging trial data to populate the model. © 2017 Wiley Periodicals, Inc.

Human organ-on-a-chip BioMEMS devices for testing new diagnostic and therapeutic strategies

NASA Astrophysics Data System (ADS)

Leary, James F.; Key, Jaehong; Vidi, Pierre-Alexandre; Cooper, Christy L.; Kole, Ayeeshik; Reece, Lisa M.; Lelièvre, Sophie A.

2013-03-01

MEMS human "organs-on-a-chip" can be used to create model human organ systems for developing new diagnostic and therapeutic strategies. They represent a promising new strategy for rapid testing of new diagnostic and therapeutic approaches without the need for involving risks to human subjects. We are developing multicomponent, superparamagnetic and fluorescent nanoparticles as X-ray and MRI contrast agents for noninvasive multimodal imaging and for antibody- or peptide-targeted drug delivery to tumor and precancerous cells inside these artificial organ MEMS devices. Magnetic fields can be used to move the nanoparticles "upstream" to find their target cells in an organs-on-achip model of human ductal breast cancer. Theoretically, unbound nanoparticles can then be removed by reversing the magnetic field to give a greatly enhanced image of tumor cells within these artificial organ structures. Using branched PDMS microchannels and 3D tissue engineering of normal and malignant human breast cancer cells inside those MEMS channels, we can mimic the early stages of human ductal breast cancer with the goal to improve the sensitivity and resolution of mammography and MRI of very small tumors and test new strategies for treatments. Nanomedical systems can easily be imaged by multicolor confocal microscopy inside the artificial organs to test targeting and therapeutic responses including the differential viability of normal and tumor cells during treatments. Currently we are using 2-dimensional MEMS structures, but these studies can be extended to more complex 3D structures using new 3D printing technologies.

Large-aperture MOEMS Fabry-Perot interferometer for miniaturized spectral imagers

NASA Astrophysics Data System (ADS)

Rissanen, Anna; Langner, Andreas; Viherkanto, Kai; Mannila, Rami

2015-02-01

VTT's optical MEMS Fabry-Perot interferometers (FPIs) are tunable optical filters, which enable miniaturization of spectral imagers into small, mass producible hand-held sensors with versatile optical measurement capabilities. FPI technology has also created a basis for various hyperspectral imaging instruments, ranging from nanosatellites, environmental sensing and precision agriculture with UAVs to instruments for skin cancer detection. Until now, these application demonstrations have been mostly realized with piezo-actuated FPIs fabricated by non-monolithical assembly method, suitable for achieving very large optical apertures and with capacity to small-to-medium volumes; however large-volume production of MEMS manufacturing supports the potential for emerging spectral imaging applications also in large-volume applications, such as in consumer/mobile products. Previously reported optical apertures of MEMS FPIs in the visible range have been up to 2 mm in size; this paper presents the design, successful fabrication and characterization of MEMS FPIs for central wavelengths of λ = 500 nm and λ = 650 nm with optical apertures up to 4 mm in diameter. The mirror membranes of the FPI structures consist of ALD (atomic layer deposited) TiO2-Al2O3 λ/4- thin film Bragg reflectors, with the air gap formed by sacrificial polymer etching in O2 plasma. The entire fabrication process is conducted below 150 °C, which makes it possible to monolithically integrate the filter structures on other ICdevices such as detectors. The realized MEMS devices are aimed for nanosatellite space application as breadboard hyperspectral imager demonstrators.

Cantilever-type Thermal Microactuators Fabricated by SOI-MUMPs with U-type and I-type Configurations

NASA Astrophysics Data System (ADS)

Osada, Takahiro; Ochiai, Kuniyuki; Osada, Kazuki; Muro, Hideo

Recently, the micro fluid systems have been extensively studied, where microactuators such as micro valves fabricated by MEMS technology are essential for realizing these systems. In this paper thermal microactuators with U-type and I-type shapes fabricated by SOI-MUMPs technology have been investigated for optimizing their configurations.

Nanoelectronics and More-than-Moore at IMEC

NASA Astrophysics Data System (ADS)

Cartuyvels, Rudi; Biesemans, Serge; Vandervorst, Wilfried; De Boeck, Jo

2011-11-01

This paper presents an overview of imec's R&D addressing the challenges of CMOS scaling towards the 10 nm node and its outlook beyond. In addition to the relentless geometrical shrinks, opportunities to further increase nanoelectronic system functionality and performance by co-integration and chip stacking technologies combined with emerging MEMS and optoelectronic technologies will be presented.

Gyroscope Technology and Applications: A Review in the Industrial Perspective

PubMed Central

Cuccovillo, Antonello; Vaiani, Lorenzo; De Carlo, Martino

2017-01-01

This paper is an overview of current gyroscopes and their roles based on their applications. The considered gyroscopes include mechanical gyroscopes and optical gyroscopes at macro- and micro-scale. Particularly, gyroscope technologies commercially available, such as Mechanical Gyroscopes, silicon MEMS Gyroscopes, Ring Laser Gyroscopes (RLGs) and Fiber-Optic Gyroscopes (FOGs), are discussed. The main features of these gyroscopes and their technologies are linked to their performance. PMID:28991175

Optical MEMS for Earth observation

NASA Astrophysics Data System (ADS)

Liotard, Arnaud; Viard, Thierry; Noell, Wilfried; Zamkotsian, Frédéric; Freire, Marco; Guldimann, Benedikt; Kraft, Stefan

2017-11-01

Due to the relatively large number of optical Earth Observation missions at ESA, this area is interesting for new space technology developments. In addition to their compactness, scalability and specific task customization, optical MEMS could generate new functions not available with current technologies and are thus candidates for the design of future space instruments. Most mature components for space applications are the digital mirror arrays, the micro-deformable mirrors, the programmable micro diffraction gratings and tiltable micromirrors. A first selection of market-pull and techno-push concepts is done. In addition, some concepts are coming from outside Earth Observation. Finally two concepts are more deeply analyzed. The first concept is a programmable slit for straylight control for space spectro-imagers. This instrument is a push-broom spectroimager for which some images cannot be exploited because of bright sources in the field-of-view. The proposed concept consists in replacing the current entrance spectrometer slit by an active row of micro-mirrors. The MEMS will permit to dynamically remove the bright sources and then to obtain a field-of-view with an optically enhanced signal-to-noise ratio. The second concept is a push-broom imager for which the acquired spectrum can be tuned by optical MEMS. This system is composed of two diffractive elements and a digital mirror array. The first diffractive element spreads the spectrum. A micromirror array is set at the location of the spectral focal plane. By putting the micro-mirrors ON or OFF, we can select parts of field-of-view or spectrum. The second diffractive element then recombines the light on a push-broom detector. Dichroics filters, strip filter, band-pass filter could be replaced by a unique instrument.

Syngas generation from n-butane with an integrated MEMS assembly for gas processing in micro-solid oxide fuel cell systems.

PubMed

Bieberle-Hütter, A; Santis-Alvarez, A J; Jiang, B; Heeb, P; Maeder, T; Nabavi, M; Poulikakos, D; Niedermann, P; Dommann, A; Muralt, P; Bernard, A; Gauckler, L J

2012-11-21

An integrated system of a microreformer and a carrier allowing for syngas generation from liquefied petroleum gas (LPG) for micro-SOFC application is discussed. The microreformer with an overall size of 12.7 mm × 12.7 mm × 1.9 mm is fabricated with micro-electro-mechanical system (MEMS) technologies. As a catalyst, a special foam-like material made from ceria-zirconia nanoparticles doped with rhodium is used to fill the reformer cavity of 58.5 mm(3). The microreformer is fixed onto a microfabricated structure with built-in fluidic channels and integrated heaters, the so-called functional carrier. It allows for thermal decoupling of the cold inlet gas and the hot fuel processing zone. Two methods for heating the microreformer are compared in this study: a) heating in an external furnace and b) heating with the two built-in heaters on the functional carrier. With both methods, high butane conversion rates of 74%-85% are obtained at around 550 °C. In addition, high hydrogen and carbon monoxide yields and selectivities are achieved. The results confirm those from classical lab reformers built without MEMS technology (N. Hotz et al., Chem. Eng. Sci., 2008, 63, 5193; N. Hotz et al., Appl. Catal., B, 2007, 73, 336). The material combinations and processing techniques enable syngas production with the present MEMS based microreformer with high performance for temperatures up to 700 °C. The functional carrier is the basis for a new platform, which can integrate the micro-SOFC membranes and the gas processing unit as subsystem of an entire micro-SOFC system.

Thermal and dynamic range characterization of a photonics-based RF amplifier

NASA Astrophysics Data System (ADS)

Noque, D. F.; Borges, R. M.; Muniz, A. L. M.; Bogoni, A.; Cerqueira S., Arismar, Jr.

2018-05-01

This work reports a thermal and dynamic range characterization of an ultra-wideband photonics-based RF amplifier for microwave and mm-waves future 5G optical-wireless networks. The proposed technology applies the four-wave mixing nonlinear effect to provide RF amplification in analog and digital radio-over-fiber systems. The experimental analysis from 300 kHz to 50 GHz takes into account different figures of merit, such as RF gain, spurious-free dynamic range and RF output power stability as a function of temperature. The thermal characterization from -10 to +70 °C demonstrates a 27 dB flat photonics-assisted RF gain over the entire frequency range under real operational conditions of a base station for illustrating the feasibility of the photonics-assisted RF amplifier for 5G networks.

New vision in fractional radiofrequency technology with switching, vacuum and cooling.

PubMed

Elman, Monica; Gauthier, Nelly; Belenky, Inna

2015-04-01

Since the introduction of fractional technology, various systems were launched to the market. The first generation of fractional RF systems created epidermal ablation with coagulative/necrosis of the dermis with sufficient clinical outcomes, but with some limitations. The aim of this study was to evaluate the efficacy and safety of SVC technology, based on the principle of separate biological responses. Fifty-two patients were treated for 3-6 sessions using fractional RF handpiece and eight patients received combination treatments with non-invasive RF handpiece. All volunteers showed notable to significant improvement in the photoageing symptoms, without any significant complications or adverse events. Due to its wide spectrum of parameters, the SVC technology can promote different biological responses. Owing to the "Switching" technology, the control of energy depth penetration enables delivery of the necessary thermal dose to the targeted skin layer. In addition, this novel technology includes the "Vacuum" and "Cooling" mechanisms, each contributing to the safety of the treatment. The Smart Heat function reduces the necessary energy levels and thereby reduces the pain level and risks for side effects.

Ways of Noninvasive Facial Skin Tightening and Fat Reduction.

PubMed

Fritz, Klaus; Salavastru, Carmen

2016-06-01

For skin tightening, ablative and nonablative lasers have been used with various parameters full or fractionated. Currently, other energy-based technologies have been developed such as radiofrequency (RF) from mono- to multipolar, microneedling RF, and high-intensity focused ultrasound. They heat up the tissue to a clinical endpoint. Temperatures above 42°C stimulate fibroblasts to produce more collagen and some technologies produce small coagulation points that allow to shrink and to tighten the tissue with less downtime or side effects. Alternative treatments not based on heat can be chemical peels from light to deep and microneedling without RF. Thieme Medical Publishers 333 Seventh Avenue, New York, NY 10001, USA.

Evaluation of MEMS-based in-place inclinometers in cold regions : [summary].

DOT National Transportation Integrated Search

2013-03-01

Inclinometer probes are used to measure ground movement. While an industry standard, this technology has drawbacks, including costly trips for manual measurements, : operator error, and limited measurements due to casing deformation. Relatively new M...

Evaluation of MEMS-based in-place inclinometers in cold regions.

DOT National Transportation Integrated Search

2013-03-01

Inclinometer probes are used to measure ground movement. While an industry standard, this technology has drawbacks, including costly trips for manual measurements, : operator error, and limited measurements due to casing deformation. Relatively new M...

Multiscale contact mechanics model for RF-MEMS switches with quantified uncertainties

NASA Astrophysics Data System (ADS)

Kim, Hojin; Huda Shaik, Nurul; Xu, Xin; Raman, Arvind; Strachan, Alejandro

2013-12-01

We introduce a multiscale model for contact mechanics between rough surfaces and apply it to characterize the force-displacement relationship for a metal-dielectric contact relevant for radio frequency micro-electromechanicl system (MEMS) switches. We propose a mesoscale model to describe the history-dependent force-displacement relationships in terms of the surface roughness, the long-range attractive interaction between the two surfaces, and the repulsive interaction between contacting asperities (including elastic and plastic deformation). The inputs to this model are the experimentally determined surface topography and the Hamaker constant as well as the mechanical response of individual asperities obtained from density functional theory calculations and large-scale molecular dynamics simulations. The model captures non-trivial processes including the hysteresis during loading and unloading due to plastic deformation, yet it is computationally efficient enough to enable extensive uncertainty quantification and sensitivity analysis. We quantify how uncertainties and variability in the input parameters, both experimental and theoretical, affect the force-displacement curves during approach and retraction. In addition, a sensitivity analysis quantifies the relative importance of the various input quantities for the prediction of force-displacement during contact closing and opening. The resulting force-displacement curves with quantified uncertainties can be directly used in device-level simulations of micro-switches and enable the incorporation of atomic and mesoscale phenomena in predictive device-scale simulations.

A batch-fabricated electret-biased wideband MEMS vibration energy harvester with frequency-up conversion behavior powering a UHF wireless sensor node

NASA Astrophysics Data System (ADS)

Lu, Y.; O'Riordan, E.; Cottone, F.; Boisseau, S.; Galayko, D.; Blokhina, E.; Marty, F.; Basset, P.

2016-12-01

This paper reports a batch-fabricated, low-frequency and wideband MEMS electrostatic vibration energy harvester (e-VEH), which implements corona-charged vertical electrets and nonlinear elastic stoppers. A numeric model is used to perform parametric study, where we observe a wideband bi-modality resulting from nonlinearity. The nonlinear stoppers improve the bandwidth and induce a frequency-up feature at low frequencies. When the e-VEH works with a bias of 45 V, the power reaches a maximum value of 6.6 μW at 428 Hz and 2.0 g rms, and is above 1 μW at 50 Hz. When the frequency drops below 60 Hz, a ‘frequency-up’ conversion behavior is observed with peaks of power at 34 Hz and 52 Hz. The  -3 dB bandwidth is more than 60% of its central frequency, both including and excluding the hysteresis introduced by the nonlinear stoppers. We also perform experiments with wideband Gaussian noise. The device is eventually tested with an RF data transmission setup, where a communication node with an internal temperature sensor is powered. Every 2 min, a data transmission at 868 MHz is performed by the sensor node supplied by the e-VEH, and received at a distance of up to 15 m.

Sampling and Control Circuit Board for an Inertial Measurement Unit

NASA Technical Reports Server (NTRS)

Chelmins, David; Powis, Rick

2012-01-01

Spacesuit navigation is one component of NASA s efforts to return humans to the Moon. Studies performed at the NASA Glenn Research Center (GRC) considered various navigation technologies and filtering approaches to enable navigation on the lunar surface. As part of this effort, microelectromechanical systems (MEMS) inertial measurement units (IMUs) were studied to determine if they could supplement a radiometric infrastructure. MEMS IMUs were included in the Lunar Extra-Vehicular Activity Crewmember Location Determination System (LECLDS) testbed during NASA s annual Desert Research and Technology Studies (D-RATS) event in 2009 and 2010. The testbed included one IMU in 2009 and three IMUs in 2010, along with a custom circuit board interfacing between the navigation processor and each IMU. The board was revised for the 2010 test, and this paper documents the design details of this latest revision of the interface circuit board and firmware.

Hemispherical array of sensors with contractively wrapped polymer petals for flow sensing

NASA Astrophysics Data System (ADS)

Kanhere, Elgar; Wang, Nan; Kottapalli, Ajay Giri Prakash; Miao, Jianmin; Triantafyllou, Michael

2017-11-01

Hemispherical arrays have inherent advantages that allow simultaneous detection of flow speed and direction due to their shape. Though MEMS technology has progressed leaps and bounds, fabrication of array of sensors on a hemispherical surface is still a challenge. In this work, a novel approach of constructing hemispherical array is presented which employs a technique of contractively wrapping a hemispherical surface with flexible liquid crystal polymer petals. This approach also leverages the offerings from rapid prototyping technology and established standard MEMS fabrication processes. Hemispherical arrays of piezoresistive sensors are constructed with two types of petal wrappings, 4-petals and 8-petals, on a dome. The flow sensing and direction detection abilities of the dome are evaluated through experiments in wind tunnel. Experimental results demonstrate that a dome equipped with a dense array of sensors can provide information pertaining to the stimulus, through visualization of output profile over the entire surface.

NASA Tech Briefs, October 2011

NASA Technical Reports Server (NTRS)

2011-01-01

Topics covered include: Laser Truss Sensor for Segmented Telescope Phasing; Qualifications of Bonding Process of Temperature Sensors to Deep-Space Missions; Optical Sensors for Monitoring Gamma and Neutron Radiation; Compliant Tactile Sensors; Cytometer on a Chip; Measuring Input Thresholds on an Existing Board; Scanning and Defocusing Properties of Microstrip Reflectarray Antennas; Cable Tester Box; Programmable Oscillator; Fault-Tolerant, Radiation-Hard DSP; Sub-Shot Noise Power Source for Microelectronics; Asynchronous Message Service Reference Implementation; Zero-Copy Objects System; Delay and Disruption Tolerant Networking MACHETE Model; Contact Graph Routing; Parallel Eclipse Project Checkout; Technique for Configuring an Actively Cooled Thermal Shield in a Flight System; Use of Additives to Improve Performance of Methyl Butyrate-Based Lithium-Ion Electrolytes; Li-Ion Cells Employing Electrolytes with Methyl Propionate and Ethyl Butyrate Co-Solvents; Improved Devices for Collecting Sweat for Chemical Analysis; Tissue Photolithography; Method for Impeding Degradation of Porous Silicon Structures; External Cooling Coupled to Reduced Extremity Pressure Device; A Zero-Gravity Cup for Drinking Beverages in Microgravity; Co-Flow Hollow Cathode Technology; Programmable Aperture with MEMS Microshutter Arrays; Polished Panel Optical Receiver for Simultaneous RF/Optical Telemetry with Large DSN Antennas; Adaptive System Modeling for Spacecraft Simulation; Lidar-Based Navigation Algorithm for Safe Lunar Landing; Tracking Object Existence From an Autonomous Patrol Vehicle; Rad-Hard, Miniaturized, Scalable, High-Voltage Switching Module for Power Applications; and Architecture for a 1-GHz Digital RADAR.

High quality factor single-crystal diamond mechanical resonators

NASA Astrophysics Data System (ADS)

Ovartchaiyapong, P.; Pascal, L. M. A.; Myers, B. A.; Lauria, P.; Bleszynski Jayich, A. C.

2012-10-01

Single-crystal diamond is a promising material for microelectromechanical systems (MEMs) because of its low mechanical loss, compatibility with extreme environments, and built-in interface to high-quality spin centers. But its use has been limited by challenges in processing and growth. We demonstrate a wafer bonding-based technique to form diamond on insulator, from which we make single-crystal diamond micromechanical resonators with mechanical quality factors as high as 338 000 at room temperature. Variable temperature measurements down to 10 K reveal a nonmonotonic dependence of quality factor on temperature. These resonators enable integration of single-crystal diamond into MEMs technology for classical and quantum applications.

Parylene-based active micro space radiator with thermal contact switch

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ueno, Ai; Suzuki, Yuji

2014-03-03

Thermal management is crucial for highly functional spacecrafts exposed to large fluctuations of internal heat dissipation and/or thermal boundary conditions. Since thermal radiation is the only means for heat removal, effective control of radiation is required for advanced space missions. In the present study, a MEMS (Micro Electro Mechanical Systems) active radiator using the contact resistance change has been proposed. Unlike previous bulky thermal louvers/shutters, higher fill factor can be accomplished with an array of electrostatically driven micro diaphragms suspended with polymer tethers. With an early prototype developed with parylene MEMS technologies, radiation heat flux enhancement up to 42% hasmore » been achieved.« less

Applications of Ferro-Nanofluid on a Micro-Transformer

PubMed Central

Tsai, Tsung-Han; Kuo, Long-Sheng; Chen, Ping-Hei; Lee, Da-sheng; Yang, Chin-Ting

2010-01-01

An on-chip transformer with a ferrofluid magnetic core has been developed and tested. The transformer consists of solenoid-type coil and a magnetic core of ferrofluid, with the former fabricated by MEMS technology and the latter by a chemical co-precipitation method. The performance of the MEMS transformer with a ferrofluid magnetic core was measured and simulated with frequencies ranging from 100 kHz to 100 MHz. Experimental results reveal that the presence of the ferrofluid increases the inductance of coils and the coupling coefficient of transformer; however, it also increases the resistance owing to the lag between the external magnetic field and the magnetization of the material. PMID:22163647

Applications of ferro-nanofluid on a micro-transformer.

PubMed

Tsai, Tsung-Han; Kuo, Long-Sheng; Chen, Ping-Hei; Lee, Da-Sheng; Yang, Chin-Ting

2010-01-01

An on-chip transformer with a ferrofluid magnetic core has been developed and tested. The transformer consists of solenoid-type coil and a magnetic core of ferrofluid, with the former fabricated by MEMS technology and the latter by a chemical co-precipitation method. The performance of the MEMS transformer with a ferrofluid magnetic core was measured and simulated with frequencies ranging from 100 kHz to 100 MHz. Experimental results reveal that the presence of the ferrofluid increases the inductance of coils and the coupling coefficient of transformer; however, it also increases the resistance owing to the lag between the external magnetic field and the magnetization of the material.

System-in Package of Integrated Humidity Sensor Using CMOS-MEMS Technology.

PubMed

Lee, Sung Pil

2015-10-01

Temperature/humidity microchips with micropump were fabricated using a CMOS-MEMS process and combined with ZigBee modules to implement a sensor system in package (SIP) for a ubiquitous sensor network (USN) and/or a wireless communication system. The current of a diode temperature sensor to temperature and a normalized current of FET humidity sensor to relative humidity showed linear characteristics, respectively, and the use of the micropump has enabled a faster response. A wireless reception module using the same protocol as that in transmission systems processed the received data within 10 m and showed temperature and humidity values in the display.

MEMS deformable mirror for wavefront correction of large telescopes

NASA Astrophysics Data System (ADS)

Manhart, Sigmund; Vdovin, Gleb; Collings, Neil; Sodnik, Zoran; Nikolov, Susanne; Hupfer, Werner

2017-11-01

A 50 mm diameter membrane mirror was designed and manufactured at TU Delft. It is made from bulk silicon by micromachining - a technology primarily used for micro-electromechanical systems (MEMS). The mirror unit is equipped with 39 actuator electrodes and can be electrostatically deformed to correct wavefront errors in optical imaging systems. Performance tests on the deformable mirror were carried out at Astrium GmbH using a breadboard setup with a wavefront sensor and a closed-loop control system. It was found that the deformable membrane mirror is well suited for correction of low order wavefront errors as they must be expected in lightweighted space telescopes.

Exploring channeling optimized radiofrequency energy: a review of radiofrequency history and applications in esthetic fields.

PubMed

Belenky, Inna; Margulis, Ariel; Elman, Monica; Bar-Yosef, Udi; Paun, Silviu D

2012-03-01

Because of its high efficiency and safety, radiofrequency (RF) energy is widely used in the dermatological field for heating biological tissue in various esthetic applications, including skin tightening, skin lifting, body contouring, and cellulite reduction. This paper reviews the literature on the use of nonablative RF energy in the esthetic field and its scientific background. The purpose of this article is to describe in detail the extensive use of medical devices based on RF technology, the development of these medical devices over the years, and recent developments and trends in RF technology. The authors conducted a systematic search of publications that address safety and efficacy issues, technical system specifications, and clinical techniques. Finally, the authors focused on their own clinical experiences with the use of patented Channeling Optimized RF Energy technique and mechanical massage. An in-vivo study was conducted in domestic pigs, with a thermal video camera. Twenty-seven female patients participated in a cellulite and body shaping study. The treatments were conducted according to a three-phase protocol. An additional 16 females participated in a skin tightening case study. All of the patients underwent three treatment sessions at 3-week intervals, each according to a protocol specific to the area being treated. The review of the literature on RF-based systems revealed that these systems are safe, with low risks for potential side effects, and effective for cellulite, body contouring, and skin tightening procedures. The in-vivo measurements confirmed the theory that the penetration depth of RF is an inverse function of its frequency, and using a vacuum mechanism makes an additional contribution to the RF energy penetration. The heating effect of RF was also found to increase blood circulation and to induce collagen remodeling. The results from the cellulite and body shaping treatments showed an overall average improvement of 55% in the appearance of cellulite, with an average circumferential reduction of 3.31 cm in the buttocks, 2.94 cm in the thighs, and 2.14 cm in the abdomen. The results from the skin tightening procedure showed moderate improvement of skin appearance in 50% and significant improvement in 31%. At the follow-up visits the results were found to be sustained without any significant side effects. Of all tissue heating techniques, RF-based technologies appear to be the most established and clinically proven. The design and specifications of the described vacuumassisted bipolar RF device fall within the range of the specifications currently prescribed for esthetic, nonablative RF systems.

Infusion of Emerging Technologies and New Teaching Methods into the Mechanical Engineering Curriculum at the City College of New York

ERIC Educational Resources Information Center

Delale, Feridun; Liaw, Benjamin M.; Jiji, Latif M.; Voiculescu, Ioana; Yu, Honghui

2011-01-01

From October 2003 to April 2008 a systemic reform of the Mechanical Engineering program at The City College of New York was undertaken with the goal of incorporating emerging technologies (such as nanotechnology, biotechnology, Micro-Electro-Mechanical Systems (MEMS), intelligent systems) and new teaching methodologies (such as project based…

Methane mitigation timelines to inform energy technology evaluation

NASA Astrophysics Data System (ADS)

Roy, Mandira; Edwards, Morgan R.; Trancik, Jessika E.

2015-11-01

Energy technologies emitting differing proportions of methane (CH4) and carbon dioxide (CO2) vary significantly in their relative climate impacts over time, due to the distinct atmospheric lifetimes and radiative efficiencies of the two gases. Standard technology comparisons using the global warming potential (GWP) with a fixed time horizon do not account for the timing of emissions in relation to climate policy goals. Here we develop a portfolio optimization model that incorporates changes in technology impacts based on the temporal proximity of emissions to a radiative forcing (RF) stabilization target. An optimal portfolio, maximizing allowed energy consumption while meeting the RF target, is obtained by year-wise minimization of the marginal RF impact in an intended stabilization year. The optimal portfolio calls for using certain higher-CH4-emitting technologies prior to an optimal switching year, followed by CH4-light technologies as the stabilization year approaches. We apply the model to evaluate transportation technology pairs and find that accounting for dynamic emissions impacts, in place of using the static GWP, can result in CH4 mitigation timelines and technology transitions that allow for significantly greater energy consumption while meeting a climate policy target. The results can inform the forward-looking evaluation of energy technologies by engineers, private investors, and policy makers.

Introduction to Micro/Nanofabrication

NASA Astrophysics Data System (ADS)

Ziaie, Babak; Baldi, Antonio; Atashbar, Massood

This chapter outlines and discusses important micro- and nanofabrication techniques. We start with the most basic methods borrowed from the integrated circuit (IC) industry, such as thin film deposition, lithography and etching, and then move on to look at MEMS and nanofabrication technologies. We cover a broad range of dimensions, from the micron to the nanometer scale. Although most of the current research is geared towards the nanodomain, a good understanding of top-down methods for fabricating micron-sized objects can aid our understanding of this research. Due to space constraints, we have focused here on the most important technologies; in the microdomain these include surface, bulk and high aspect ratio micromachining; in the nanodomain we concentrate on e-beam lithography, epitaxial growth, template manufacturing and self-assembly. MEMS technology is maturing rapidly, with some new technologies displacing older ones that have proven to be unsuited to manufacture on a commercial scale. However, the jury is still out on methods used in the nanodomain, although it appears that bottom-up methods are the most feasible, and these will have a major impact in a variety of application areas such as biology, medicine, environmental monitoring and nanoelectronics.

Biomimetic patterned surfaces for controllable friction in micro- and nanoscale devices

NASA Astrophysics Data System (ADS)

Singh, Arvind; Suh, Kahp-Yang

2013-12-01

Biomimetics is the study and simulation of biological systems for desired functional properties. It involves the transformation of underlying principles discovered in nature into man-made technologies. In this context, natural surfaces have significantly inspired and motivated new solutions for micro- and nano-scale devices (e.g., Micro/Nano-Electro-Mechanical Systems, MEMS/NEMS) towards controllable friction, during their operation. As a generic solution to reduce friction at small scale, various thin films/coatings have been employed in the last few decades. In recent years, inspiration from `Lotus Effect' has initiated a new research direction for controllable friction with biomimetic patterned surfaces. By exploiting the intrinsic hydrophobicity and ability to reduce contact area, such micro- or nano-patterned surfaces have demonstrated great strength and potential for applications in MEMS/NEMS devices. This review highlights recent advancements on the design, development and performance of these biomimetic patterned surfaces. Also, we present some hybrid approaches to tackle current challenges in biomimetic tribological applications for MEMS/NEMS devices.

High sensitivity capacitive MEMS microphone with spring supported diaphragm

NASA Astrophysics Data System (ADS)

Mohamad, Norizan; Iovenitti, Pio; Vinay, Thurai

2007-12-01

Capacitive microphones (condenser microphones) work on a principle of variable capacitance and voltage by the movement of its electrically charged diaphragm and back plate in response to sound pressure. There has been considerable research carried out to increase the sensing performance of microphones while reducing their size to cater for various modern applications such as mobile communication and hearing aid devices. This paper reviews the development and current performance of several condenser MEMS microphone designs, and introduces a microphone with spring supported diaphragm to further improve condenser microphone performance. The numerical analysis using Coventor FEM software shows that this new microphone design has a higher mechanical sensitivity compared to the existing edge clamped flat diaphragm condenser MEMS microphone. The spring supported diaphragm is shown to have a flat frequency response up to 7 kHz and more stable under the variations of the diaphragm residual stress. The microphone is designed to be easily fabricated using the existing silicon fabrication technology and the stability against the residual stress increases its reproducibility.

The Electrophysiological MEMS Device with Micro Channel Array for Cellular Network Analysis

NASA Astrophysics Data System (ADS)

Tonomura, Wataru; Kurashima, Toshiaki; Takayama, Yuzo; Moriguchi, Hiroyuki; Jimbo, Yasuhiko; Konishi, Satoshi

This paper describes a new type of MCA (Micro Channel Array) for simultaneous multipoint measurement of cellular network. Presented MCA employing the measurement principles of the patch-clamp technique is designed for advanced neural network analysis which has been studied by co-authors using 64ch MEA (Micro Electrode Arrays) system. First of all, sucking and clamping of cells through channels of developed MCA is expected to improve electrophysiological signal detections. Electrophysiological sensing electrodes integrated around individual channels of MCA by using MEMS (Micro Electro Mechanical System) technologies are electrically isolated for simultaneous multipoint measurement. In this study, we tested the developed MCA using the non-cultured rat's cerebral cortical slice and the hippocampal neurons. We could measure the spontaneous action potential of the slice simultaneously at multiple points and culture the neurons on developed MCA. Herein, we describe the experimental results together with the design and fabrication of the electrophysiological MEMS device with MCA for cellular network analysis.

An integrated MEMS infrastructure for fuel processing: hydrogen generation and separation for portable power generation

NASA Astrophysics Data System (ADS)

Varady, M. J.; McLeod, L.; Meacham, J. M.; Degertekin, F. L.; Fedorov, A. G.

2007-09-01

Portable fuel cells are an enabling technology for high efficiency and ultra-high density distributed power generation, which is essential for many terrestrial and aerospace applications. A key element of fuel cell power sources is the fuel processor, which should have the capability to efficiently reform liquid fuels and produce high purity hydrogen that is consumed by the fuel cells. To this end, we are reporting on the development of two novel MEMS hydrogen generators with improved functionality achieved through an innovative process organization and system integration approach that exploits the advantages of transport and catalysis on the micro/nano scale. One fuel processor design utilizes transient, reverse-flow operation of an autothermal MEMS microreactor with an intimately integrated, micromachined ultrasonic fuel atomizer and a Pd/Ag membrane for in situ hydrogen separation from the product stream. The other design features a simpler, more compact planar structure with the atomized fuel ejected directly onto the catalyst layer, which is coupled to an integrated hydrogen selective membrane.

A Capacitance-To-Digital Converter for MEMS Sensors for Smart Applications.

PubMed

Pérez Sanjurjo, Javier; Prefasi, Enrique; Buffa, Cesare; Gaggl, Richard

2017-06-07

The use of MEMS sensors has been increasing in recent years. To cover all the applications, many different readout circuits are needed. To reduce the cost and time to market, a generic capacitance-to-digital converter (CDC) seems to be the logical next step. This work presents a configurable CDC designed for capacitive MEMS sensors. The sensor is built with a bridge of MEMS, where some of them function with pressure. Then, the capacitive to digital conversion is realized using two steps. First, a switched-capacitor (SC) preamplifier is used to make the capacitive to voltage (C-V) conversion. Second, a self-oscillated noise-shaping integrating dual-slope (DS) converter is used to digitize this magnitude. The proposed converter uses time instead of amplitude resolution to generate a multibit digital output stream. In addition it performs noise shaping of the quantization error to reduce measurement time. This article shows the effectiveness of this method by measurements performed on a prototype, designed and fabricated using standard 0.13 µm CMOS technology. Experimental measurements show that the CDC achieves a resolution of 17 bits, with an effective area of 0.317 mm², which means a pressure resolution of 1 Pa, while consuming 146 µA from a 1.5 V power supply.

Improved response time of flexible microelectromechanical sensors employing eco-friendly nanomaterials.

PubMed

Fan, Shicheng; Dan, Li; Meng, Lingju; Zheng, Wei; Elias, Anastasia; Wang, Xihua

2017-11-09

Flexible force/pressure sensors are of interest for academia and industry and have applications in wearable technologies. Most of such sensors on the market or reported in journal publications are based on the operation mechanism of probing capacitance or resistance changes of the materials under pressure. Recently, we reported the microelectromechanical (MEM) sensors based on a different mechanism: mechanical switches. Multiples of such MEM sensors can be integrated to achieve the same function of regular force/pressure sensors while having the advantages of ease of fabrication and long-term stability in operation. Herein, we report the dramatically improved response time (more than one order of magnitude) of these MEM sensors by employing eco-friendly nanomaterials-cellulose nanocrystals. For instance, the incorporation of polydimethysiloxane filled with cellulose nanocrystals shortened the response time of MEM sensors from sub-seconds to several milliseconds, leading to the detection of both diastolic and systolic pressures in the radial arterial blood pressure measurement. Comprehensive mechanical and electrical characterization of the materials and the devices reveal that greatly enhanced storage modulus and loss modulus play key roles in this improved response time. The demonstrated fast-response flexible sensors enabled continuous monitoring of heart rate and complex cardiovascular signals using pressure sensors for future wearable sensing platforms.

INS/GNSS Integration for Aerobatic Flight Applications and Aircraft Motion Surveying.

PubMed

V Hinüber, Edgar L; Reimer, Christian; Schneider, Tim; Stock, Michael

2017-04-26

This paper presents field tests of challenging flight applications obtained with a new family of lightweight low-power INS/GNSS ( inertial navigation system/global satellite navigation system ) solutions based on MEMS ( micro-electro-mechanical- sensor ) machined sensors, being used for UAV ( unmanned aerial vehicle ) navigation and control as well as for aircraft motion dynamics analysis and trajectory surveying. One key is a 42+ state extended Kalman-filter-based powerful data fusion, which also allows the estimation and correction of parameters that are typically affected by sensor aging, especially when applying MEMS-based inertial sensors, and which is not yet deeply considered in the literature. The paper presents the general system architecture, which allows iMAR Navigation the integration of all classes of inertial sensors and GNSS ( global navigation satellite system ) receivers from very-low-cost MEMS and high performance MEMS over FOG ( fiber optical gyro ) and RLG ( ring laser gyro ) up to HRG ( hemispherical resonator gyro ) technology, and presents detailed flight test results obtained under extreme flight conditions. As a real-world example, the aerobatic maneuvers of the World Champion 2016 (Red Bull Air Race) are presented. Short consideration is also given to surveying applications, where the ultimate performance of the same data fusion, but applied on gravimetric surveying, is discussed.

INS/GNSS Integration for Aerobatic Flight Applications and Aircraft Motion Surveying

PubMed Central

v. Hinüber, Edgar L.; Reimer, Christian; Schneider, Tim; Stock, Michael

2017-01-01

This paper presents field tests of challenging flight applications obtained with a new family of lightweight low-power INS/GNSS (inertial navigation system/global satellite navigation system) solutions based on MEMS (micro-electro-mechanical- sensor) machined sensors, being used for UAV (unmanned aerial vehicle) navigation and control as well as for aircraft motion dynamics analysis and trajectory surveying. One key is a 42+ state extended Kalman-filter-based powerful data fusion, which also allows the estimation and correction of parameters that are typically affected by sensor aging, especially when applying MEMS-based inertial sensors, and which is not yet deeply considered in the literature. The paper presents the general system architecture, which allows iMAR Navigation the integration of all classes of inertial sensors and GNSS (global navigation satellite system) receivers from very-low-cost MEMS and high performance MEMS over FOG (fiber optical gyro) and RLG (ring laser gyro) up to HRG (hemispherical resonator gyro) technology, and presents detailed flight test results obtained under extreme flight conditions. As a real-world example, the aerobatic maneuvers of the World Champion 2016 (Red Bull Air Race) are presented. Short consideration is also given to surveying applications, where the ultimate performance of the same data fusion, but applied on gravimetric surveying, is discussed. PMID:28445417

A Capacitance-To-Digital Converter for MEMS Sensors for Smart Applications

PubMed Central

Pérez Sanjurjo, Javier; Prefasi, Enrique; Buffa, Cesare; Gaggl, Richard

2017-01-01

The use of MEMS sensors has been increasing in recent years. To cover all the applications, many different readout circuits are needed. To reduce the cost and time to market, a generic capacitance-to-digital converter (CDC) seems to be the logical next step. This work presents a configurable CDC designed for capacitive MEMS sensors. The sensor is built with a bridge of MEMS, where some of them function with pressure. Then, the capacitive to digital conversion is realized using two steps. First, a switched-capacitor (SC) preamplifier is used to make the capacitive to voltage (C-V) conversion. Second, a self-oscillated noise-shaping integrating dual-slope (DS) converter is used to digitize this magnitude. The proposed converter uses time instead of amplitude resolution to generate a multibit digital output stream. In addition it performs noise shaping of the quantization error to reduce measurement time. This article shows the effectiveness of this method by measurements performed on a prototype, designed and fabricated using standard 0.13 µm CMOS technology. Experimental measurements show that the CDC achieves a resolution of 17 bits, with an effective area of 0.317 mm2, which means a pressure resolution of 1 Pa, while consuming 146 µA from a 1.5 V power supply. PMID:28590425

Practical 3D Printing of Antennas and RF Electronics

DTIC Science & Technology

2017-03-01

Passive RF; Combiners Introduction Additive manufacturing can reduce the time and material costs in a design cycle and enable the on-demand printing of...performance, and create Computer Assisted Manufacturing (CAM) files. By intelligently leveraging this process, the design can be readily updated or...advances in 3D printing technology now enable antennas and RF electronics to be designed and prototyped significantly faster than conventional

Wideband aperture array using RF channelizers and massively parallel digital 2D IIR filterbank

NASA Astrophysics Data System (ADS)

Sengupta, Arindam; Madanayake, Arjuna; Gómez-García, Roberto; Engeberg, Erik D.

2014-05-01

Wideband receive-mode beamforming applications in wireless location, electronically-scanned antennas for radar, RF sensing, microwave imaging and wireless communications require digital aperture arrays that offer a relatively constant far-field beam over several octaves of bandwidth. Several beamforming schemes including the well-known true time-delay and the phased array beamformers have been realized using either finite impulse response (FIR) or fast Fourier transform (FFT) digital filter-sum based techniques. These beamforming algorithms offer the desired selectivity at the cost of a high computational complexity and frequency-dependant far-field array patterns. A novel approach to receiver beamforming is the use of massively parallel 2-D infinite impulse response (IIR) fan filterbanks for the synthesis of relatively frequency independent RF beams at an order of magnitude lower multiplier complexity compared to FFT or FIR filter based conventional algorithms. The 2-D IIR filterbanks demand fast digital processing that can support several octaves of RF bandwidth, fast analog-to-digital converters (ADCs) for RF-to-bits type direct conversion of wideband antenna element signals. Fast digital implementation platforms that can realize high-precision recursive filter structures necessary for real-time beamforming, at RF radio bandwidths, are also desired. We propose a novel technique that combines a passive RF channelizer, multichannel ADC technology, and single-phase massively parallel 2-D IIR digital fan filterbanks, realized at low complexity using FPGA and/or ASIC technology. There exists native support for a larger bandwidth than the maximum clock frequency of the digital implementation technology. We also strive to achieve More-than-Moore throughput by processing a wideband RF signal having content with N-fold (B = N Fclk/2) bandwidth compared to the maximum clock frequency Fclk Hz of the digital VLSI platform under consideration. Such increase in bandwidth is achieved without use of polyphase signal processing or time-interleaved ADC methods. That is, all digital processors operate at the same Fclk clock frequency without phasing, while wideband operation is achieved by sub-sampling of narrower sub-bands at the the RF channelizer outputs.

Measured thermal images of a gallium arsenide power MMIC with and without RF applied to the input

NASA Astrophysics Data System (ADS)

Oxley, C. H.; Coaker, B. M.; Priestley, N. E.

2003-04-01

A gallium arsenide microwave monolithic integrated circuit (MMIC) power amplifier (M/ACom type MAAM71100) has been measured using infra-red microscope technology, with and without the application of a RF input signal. A reduction of approximately 10 °C in chip temperature was observed with the application of a RF input signal, which will influence the MTTF of the chip. Further, the measurement technique may be used to monitor the thermal impedance and dynamic cooling of RF power devices under operational conditions in complex circuits.

MEMS Sensor Technologies for Human Centred Applications in Healthcare, Physical Activities, Safety and Environmental Sensing: A Review on Research Activities in Italy

PubMed Central

Ciuti, Gastone; Ricotti, Leonardo; Menciassi, Arianna; Dario, Paolo

2015-01-01

Over the past few decades the increased level of public awareness concerning healthcare, physical activities, safety and environmental sensing has created an emerging need for smart sensor technologies and monitoring devices able to sense, classify, and provide feedbacks to users’ health status and physical activities, as well as to evaluate environmental and safety conditions in a pervasive, accurate and reliable fashion. Monitoring and precisely quantifying users’ physical activity with inertial measurement unit-based devices, for instance, has also proven to be important in health management of patients affected by chronic diseases, e.g., Parkinson’s disease, many of which are becoming highly prevalent in Italy and in the Western world. This review paper will focus on MEMS sensor technologies developed in Italy in the last three years describing research achievements for healthcare and physical activity, safety and environmental sensing, in addition to smart systems integration. Innovative and smart integrated solutions for sensing devices, pursued and implemented in Italian research centres, will be highlighted, together with specific applications of such technologies. Finally, the paper will depict the future perspective of sensor technologies and corresponding exploitation opportunities, again with a specific focus on Italy. PMID:25808763

Sources of Emittance in RF Photocathode Injectors

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dowell, David

2016-12-11

Advances in electron beam technology have been central to creating the current generation of x-ray free electron lasers and ultra-fast electron microscopes. These once exotic devices have become essential tools for basic research and applied science. One important beam technology for both is the electron source which, for many of these instruments, is the photocathode RF gun. The invention of the photocathode gun and the concepts of emittance compensation and beam matching in the presence of space charge and RF forces have made these high-quality beams possible. Achieving even brighter beams requires a taking a finer resolution view of themore » electron dynamics near the cathode during photoemission and the initial acceleration of the beam. In addition, the high brightness beam is more sensitive to degradation by the optical aberrations of the gun’s RF and magnetic lenses. This paper discusses these topics including the beam properties due to fundamental photoemission physics, space charge effects close to the cathode, and optical distortions introduced by the RF and solenoid fields. Analytic relations for these phenomena are derived and compared with numerical simulations.« less

Wi-Fi and health: review of current status of research.

PubMed

Foster, Kenneth R; Moulder, John E

2013-12-01

This review summarizes the current state of research on possible health effects of Wi-Fi (a commercial name for IEEE 802.11-compliant wireless networking). In response to public concerns about health effects of Wi-Fi and wireless networks and calls by government agencies for research on possible health and safety issues with the technology, a considerable amount of technology-specific research has been completed. A series of high quality engineering studies have provided a good, but not complete, understanding of the levels of radiofrequency (RF) exposure to individuals from Wi-Fi. The limited number of technology-specific bioeffects studies done to date are very mixed in terms of quality and outcome. Unequivocally, the RF exposures from Wi-Fi and wireless networks are far below U.S. and international exposure limits for RF energy. While several studies report biological effects due to Wi-Fi-type exposures, technical limitations prevent drawing conclusions from them about possible health risks of the technology. The review concludes with suggestions for future research on the topic.

EDITORIAL: Selected papers from the 9th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2009) Selected papers from the 9th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2009)

NASA Astrophysics Data System (ADS)

Ghodssi, Reza; Livermore, Carol; Arnold, David

2010-10-01

This special section of the Journal of Micromechanics and Microengineering presents papers selected from the 9th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2009), which was held in Washington DC, USA from 1-4 December 2009. Since it was first held in Sendai, Japan in 2000, the PowerMEMS workshop has focused on small-scale systems that process, convert, or generate macroscopically significant amounts of power, typically with high power density or high energy density. In the workshop's early years, much of the research presented was on small-scale fueled systems, such as micro heat engines and micro fuel cells. The past nine years have seen a dramatic expansion in the range of technologies that are brought to bear on the challenge of high-power, small-scale systems, as well as an increase in the applications for such technologies. At this year's workshop, 158 contributed papers were presented, along with invited and plenary presentations. The papers focused on applications from micro heat engines and fuel cells, to energy harvesting and its enabling electronics, to thermal management and propulsion. Also presented were the technologies that enable these applications, such as the structuring of microscale, nanoscale and biological systems for power applications, as well as combustion and catalysis at small scales. This special section includes a selection of 12 expanded papers representing energy harvesting, chemical and fueled systems, and elastic energy storage at small scales. We would like to express our appreciation to the members of the International Steering Committee, the Technical Program Committee, the Local Organizing Committee, and to the workshop's financial supporters. We are grateful to the referees for their contributions to the review process. Finally, we would like to thank Dr Ian Forbes, the editorial staff of the Journal of Micromechanics and Microengineering, and the staff of IOP Publishing for making this special section possible.

Design of a MEMS-Based Oscillator Using 180nm CMOS Technology

PubMed Central

Roy, Sukanta; Ramiah, Harikrishnan; Reza, Ahmed Wasif; Lim, Chee Cheow; Ferrer, Eloi Marigo

2016-01-01

Micro-electro mechanical system (MEMS) based oscillators are revolutionizing the timing industry as a cost effective solution, enhanced with more features, superior performance and better reliability. The design of a sustaining amplifier was triggered primarily to replenish MEMS resonator’s high motion losses due to the possibility of their ‘system-on-chip’ integrated circuit solution. The design of a sustaining amplifier observing high gain and adequate phase shift for an electrostatic clamp-clamp (C-C) beam MEMS resonator, involves the use of an 180nm CMOS process with an unloaded Q of 1000 in realizing a fixed frequency oscillator. A net 122dBΩ transimpedance gain with adequate phase shift has ensured 17.22MHz resonant frequency oscillation with a layout area consumption of 0.121 mm2 in the integrated chip solution, the sustaining amplifier draws 6.3mW with a respective phase noise of -84dBc/Hz at 1kHz offset is achieved within a noise floor of -103dBC/Hz. In this work, a comparison is drawn among similar design studies on the basis of a defined figure of merit (FOM). A low phase noise of 1kHz, high figure of merit and the smaller size of the chip has accredited to the design’s applicability towards in the implementation of a clock generative integrated circuit. In addition to that, this complete silicon based MEMS oscillator in a monolithic solution has offered a cost effective solution for industrial or biomedical electronic applications. PMID:27391136

Sensing magnetic flux density of artificial neurons with a MEMS device.

PubMed

Tapia, Jesus A; Herrera-May, Agustin L; García-Ramírez, Pedro J; Martinez-Castillo, Jaime; Figueras, Eduard; Flores, Amira; Manjarrez, Elías

2011-04-01

We describe a simple procedure to characterize a magnetic field sensor based on microelectromechanical systems (MEMS) technology, which exploits the Lorentz force principle. This sensor is designed to detect, in future applications, the spiking activity of neurons or muscle cells. This procedure is based on the well-known capability that a magnetic MEMS device can be used to sense a small magnetic flux density. In this work, an electronic neuron (FitzHugh-Nagumo) is used to generate controlled spike-like magnetic fields. We show that the magnetic flux density generated by the hardware of this neuron can be detected with a new MEMS magnetic field sensor. This microdevice has a compact resonant structure (700 × 600 × 5 μm) integrated by an array of silicon beams and p-type piezoresistive sensing elements, which need an easy fabrication process. The proposed microsensor has a resolution of 80 nT, a sensitivity of 1.2 V.T(-1), a resonant frequency of 13.87 kHz, low power consumption (2.05 mW), quality factor of 93 at atmospheric pressure, and requires a simple signal processing circuit. The importance of our study is twofold. First, because the artificial neuron can generate well-controlled magnetic flux density, we suggest it could be used to analyze the resolution and performance of different magnetic field sensors intended for neurobiological applications. Second, the introduced MEMS magnetic field sensor may be used as a prototype to develop new high-resolution biomedical microdevices to sense magnetic fields from cardiac tissue, nerves, spinal cord, or the brain.

Measurement of the Earth tides with a MEMS gravimeter.

PubMed

Middlemiss, R P; Samarelli, A; Paul, D J; Hough, J; Rowan, S; Hammond, G D

2016-03-31

The ability to measure tiny variations in the local gravitational acceleration allows, besides other applications, the detection of hidden hydrocarbon reserves, magma build-up before volcanic eruptions, and subterranean tunnels. Several technologies are available that achieve the sensitivities required for such applications (tens of microgal per hertz(1/2)): free-fall gravimeters, spring-based gravimeters, superconducting gravimeters, and atom interferometers. All of these devices can observe the Earth tides: the elastic deformation of the Earth's crust as a result of tidal forces. This is a universally predictable gravitational signal that requires both high sensitivity and high stability over timescales of several days to measure. All present gravimeters, however, have limitations of high cost (more than 100,000 US dollars) and high mass (more than 8 kilograms). Here we present a microelectromechanical system (MEMS) device with a sensitivity of 40 microgal per hertz(1/2) only a few cubic centimetres in size. We use it to measure the Earth tides, revealing the long-term stability of our instrument compared to any other MEMS device. MEMS accelerometers--found in most smart phones--can be mass-produced remarkably cheaply, but none are stable enough to be called a gravimeter. Our device has thus made the transition from accelerometer to gravimeter. The small size and low cost of this MEMS gravimeter suggests many applications in gravity mapping. For example, it could be mounted on a drone instead of low-flying aircraft for distributed land surveying and exploration, deployed to monitor volcanoes, or built into multi-pixel density-contrast imaging arrays.

A low-frequency versatile wireless power transfer technology for biomedical implants.

PubMed

Jiang, Hao; Zhang, Junmin; Lan, Di; Chao; Liou, Shyshenq; Shahnasser, Hamid; Fechter, Richard; Hirose, Shinjiro; Harrison, Michael; Roy, Shuvo

2013-08-01

Implantable biomedical sensors and actuators are highly desired in modern medicine. In many cases, the implant's electrical power source profoundly determines its overall size and performance . The inductively coupled coil pair operating at the radio-frequency (RF) has been the primary method for wirelessly delivering electrical power to implants for the last three decades . Recent designs significantly improve the power delivery efficiency by optimizing the operating frequency, coil size and coil distance . However, RF radiation hazard and tissue absorption are the concerns in the RF wireless power transfer technology (RF-WPTT) , . Also, it requires an accurate impedance matching network that is sensitive to operating environments between the receiving coil and the load for efficient power delivery . In this paper, a novel low-frequency wireless power transfer technology (LF-WPTT) using rotating rare-earth permanent magnets is demonstrated. The LF-WPTT is able to deliver 2.967 W power at  ∼ 180 Hz to an 117.1 Ω resistor over 1 cm distance with 50% overall efficiency. Because of the low operating frequency, RF radiation hazard and tissue absorption are largely avoided, and the power delivery efficiency from the receiving coil to the load is independent of the operating environment. Also, there is little power loss observed in the LF-WPTT when the receiving coil is enclosed by non-magnetic implant-grade stainless steel.

Mixed-signal 0.18μm CMOS and SiGe BiCMOS foundry technologies for ROIC applications

NASA Astrophysics Data System (ADS)

Kar-Roy, Arjun; Howard, David; Racanelli, Marco; Scott, Mike; Hurwitz, Paul; Zwingman, Robert; Chaudhry, Samir; Jordan, Scott

2010-10-01

Today's readout integrated-circuits (ROICs) require a high level of integration of high performance analog and low power digital logic. TowerJazz offers a commercial 0.18μm CMOS technology platform for mixed-signal, RF, and high performance analog applications which can be used for ROIC applications. The commercial CA18HD dual gate oxide 1.8V/3.3V and CA18HA dual gate oxide 1.8V/5V RF/mixed signal processes, consisting of six layers of metallization, have high density stacked linear MIM capacitors, high-value resistors, triple-well isolation and thick top aluminum metal. The CA18HA process also has scalable drain extended LDMOS devices, up to 40V Vds, for high-voltage sensor applications, and high-performance bipolars for low noise requirements in ROICs. Also discussed are the available features of the commercial SBC18 SiGe BiCMOS platform with SiGe NPNs operating up to 200/200GHz (fT/fMAX frequencies in manufacturing and demonstrated to 270 GHz fT, for reduced noise and integrated RF capabilities which could be used in ROICs. Implementation of these technologies in a thick film SOI process for integrated RF switch and power management and the availability of high fT vertical PNPs to enable complementary BiCMOS (CBiCMOS), for RF enabled ROICs, are also described in this paper.

On the Application of Inverse-Mode SiGe HBTs in RF Receivers for the Mitigation of Single-Event Transients

NASA Astrophysics Data System (ADS)

Song, Ickhyun; Cho, Moon-Kyu; Oakley, Michael A.; Ildefonso, Adrian; Ju, Inchan; Buchner, Stephen P.; McMorrow, Dale; Paki, Pauline; Cressler, John. D.

2017-05-01

Best practice in mitigation strategies for single-event transients (SETs) in radio-frequency (RF) receiver modules is investigated using a variety of integrated receivers utilizing inverse-mode silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs). The receivers were designed and implemented in a 130-nm SiGe BiCMOS technology platform. In general, RF switches, low-noise amplifiers (LNAs), and downconversion mixers utilizing inverse-mode SiGe HBTs exhibit less susceptibility to SETs than conventional RF designs, in terms of transient peaks and duration, at the cost of RF performance. Under normal RF operation, the SET-hardened switch is mainly effective in peak reduction, while the LNA and the mixer exhibit reductions in transient peaks as well as transient duration.

A flexible surface wetness sensor using a RFID technique.

PubMed

Yang, Cheng-Hao; Chien, Jui-Hung; Wang, Bo-Yan; Chen, Ping-Hei; Lee, Da-Sheng

2008-02-01

This paper presents a flexible wetness sensor whose detection signal, converted to a binary code, is transmitted through radio-frequency (RF) waves from a radio-frequency identification integrated circuit (RFID IC) to a remote reader. The flexible sensor, with a fixed operating frequency of 13.56 MHz, contains a RFID IC and a sensor circuit that is fabricated on a flexible printed circuit board (FPCB) using a Micro-Electro-Mechanical-System (MEMS) process. The sensor circuit contains a comb-shaped sensing area surrounded by an octagonal antenna with a width of 2.7 cm. The binary code transmitted from the RFIC to the reader changes if the surface conditions of the detector surface changes from dry to wet. This variation in the binary code can be observed on a digital oscilloscope connected to the reader.

Nano- and micro-electromechanical switch dynamics

NASA Astrophysics Data System (ADS)

Pulskamp, Jeffrey S.; Proie, Robert M.; Polcawich, Ronald G.

2013-01-01

This paper reports theoretical analysis and experimental results on the dynamics of piezoelectric MEMS mechanical logic relays. The multiple degree of freedom analytical model, based on modal decomposition, utilizes modal parameters obtained from finite element analysis and an analytical model of piezoelectric actuation. The model accounts for exact device geometry, damping, drive waveform variables, and high electric field piezoelectric nonlinearity. The piezoelectrically excited modal force is calculated directly and provides insight into design optimization for switching speed. The model accurately predicts the propagation delay dependence on actuation voltage of mechanically distinct relay designs. The model explains the observed discrepancies in switching speed of these devices relative to single degree of freedom switching speed models and suggests the strong potential for improved switching speed performance in relays designed for mechanical logic and RF circuits through the exploitation of higher order vibrational modes.

RF Stealth (Or Low Observable) and Counter- RF Stealth Technologies: Implications of Counter- RF Stealth Solutions for Turkish Air Force

DTIC Science & Technology

2009-03-01

Robotics Coating Facility for Low Observable Material Applications...aircraft. After separation, it would fly to around 78,000 ft altitude and self navigate with its internal Doppler guidance system. If desired, it...lossy magnetic material, with 2 cm of soft rubber , were utilized for purposes of absorbing radar energy and reducing IR signature. Moreover, some tail

Broadband Electric-Field Sensor Array Technology

DTIC Science & Technology

2012-08-05

output voltage modulation on the output RF transmission line (impedance Z0 = 50 Ω) via a transimpedance amplifier connected to the photodiode. The...voltage amplitude is where G is the conversion gain of the photodiode and amplifier . The RF power detected by an RF receiver with a matched impedance...wave (CW) tunable near-infrared laser amplified by an erbium-doped fiber amplifier (EDFA) is guided by single-mode optical fiber and coupled into

RF Performance of Membrane Aperture Shells

NASA Technical Reports Server (NTRS)

Flint, Eirc M.; Lindler, Jason E.; Thomas, David L.; Romanofsky, Robert

2007-01-01

This paper provides an overview of recent results establishing the suitability of Membrane Aperture Shell Technology (MAST) for Radio Frequency (RF) applications. These single surface shells are capable of maintaining their figure with no preload or pressurization and minimal boundary support, yet can be compactly roll stowed and passively self deploy. As such, they are a promising technology for enabling a future generation of RF apertures. In this paper, we review recent experimental and numerical results quantifying suitable RF performance. It is shown that candidate materials possess metallic coatings with sufficiently low surface roughness and that these materials can be efficiently fabricated into RF relevant doubly curved shapes. A numerical justification for using a reflectivity metric, as opposed to the more standard RF designer metric of skin depth, is presented and the resulting ability to use relatively thin coating thickness is experimentally validated with material sample tests. The validity of these independent film sample measurements are then confirmed through experimental results measuring RF performance for reasonable sized doubly curved apertures. Currently available best results are 22 dBi gain at 3 GHz (S-Band) for a 0.5m aperture tested in prime focus mode, 28dBi gain for the same antenna in the C-Band (4 to 6 GHz), and 36.8dBi for a smaller 0.25m antenna tested at 32 GHz in the Ka-Band. RF range test results for a segmented aperture (one possible scaling approach) are shown as well. Measured antenna system actual efficiencies (relative to the unachievable) ideal for these on axis tests are generally quite good, typically ranging from 50 to 90%.

The technological future of 7 T MRI hardware.

PubMed

Webb, A G; Van de Moortele, P F

2016-09-01

In this article we present our projections of future hardware developments on 7 T human MRI systems. These include compact cryogen-light magnets, improved gradient performance, integrated RF-receive and direct current shimming coil arrays, new RF technology with adaptive impedance matching, patient-specific specific absorption rate estimation and monitoring, and increased integration of physiological monitoring systems. Copyright © 2015 John Wiley & Sons, Ltd. Copyright © 2015 John Wiley & Sons, Ltd.

Thermal Deformation and RF Performance Analyses for the SWOT Large Deployable Ka-Band Reflectarray

NASA Technical Reports Server (NTRS)

Fang, H.; Sunada, E.; Chaubell, J.; Esteban-Fernandez, D.; Thomson, M.; Nicaise, F.

2010-01-01

A large deployable antenna technology for the NASA Surface Water and Ocean Topography (SWOT) Mission is currently being developed by JPL in response to NRC Earth Science Tier 2 Decadal Survey recommendations. This technology is required to enable the SWOT mission due to the fact that no currently available antenna is capable of meeting SWOT's demanding Ka-Band remote sensing requirements. One of the key aspects of this antenna development is to minimize the effect of the on-orbit thermal distortion to the antenna RF performance. An analysis process which includes: 1) the on-orbit thermal analysis to obtain the temperature distribution; 2) structural deformation analysis to get the geometry of the antenna surface; and 3) the RF performance with the given deformed antenna surface has been developed to accommodate the development of this antenna technology. The detailed analysis process and some analysis results will be presented and discussed by this paper.

Assessment of Alternative RF Linac Structures for APT

DOE Office of Scientific and Technical Information (OSTI.GOV)

None

The APT program has been examining both normal and superconducting variants of the APT linac for the past two years. A decision on which of the two will be the selected technology will depend upon several considerations including the results of ongoing feasibility experiments, the performance and overall attractiveness of each of the design concepts, and an assessment of the system-level features of both alternatives. The primary objective of the Assessment of Alternative RF Linac Structures for APT study reported herein was to assess and compare, at the system-level, the performance, capital and life cycle costs, reliability/availability/maintainability (RAM) and manufacturingmore » schedules of APT RF linear accelerators based upon both superconducting and normal conducting technologies. A secondary objective was to perform trade studies to explore opportunities for system optimization, technology substitution and alternative growth pathways and to identify sensitivities to design uncertainties.« less

Generation of multiple analog pulses with different duty cycles within VME control system for ICRH Aditya system

NASA Astrophysics Data System (ADS)

Joshi, Ramesh; Singh, Manoj; Jadav, H. M.; Misra, Kishor; Kulkarni, S. V.; ICRH-RF Group

2010-02-01

Ion Cyclotron Resonance Heating (ICRH) is a promising heating method for a fusion device due to its localized power deposition profile, a direct ion heating at high density, and established technology for high RF power generation and transmission at low cost. Multiple analog pulse with different duty cycle in master of digital pulse for Data acquisition and Control system for steady state RF ICRH System(RF ICRH DAC) to be used for operating of RF Generator in Aditya to produce pre ionization and second analog pulse will produce heating. The control system software is based upon single digital pulse operation for RF source. It is planned to integrate multiple analog pulses with different duty cycle in master of digital pulse for Data acquisition and Control system for RF ICRH System(RF ICRH DAC) to be used for operating of RF Generator in Aditya tokamak. The task of RF ICRH DAC is to control and acquisition of all ICRH system operation with all control loop and acquisition for post analysis of data with java based tool. For pre ionization startup as well as heating experiments using multiple RF Power of different powers and duration. The experiment based upon the idea of using single RF generator to energize antenna inside the tokamak to radiate power twise, out of which first analog pulse will produce pre ionization and second analog pulse will produce heating. The whole system is based on standard client server technology using tcp/ip protocol. DAC Software is based on linux operating system for highly reliable, secure and stable system operation in failsafe manner. Client system is based on tcl/tk like toolkit for user interface with c/c++ like environment which is reliable programming languages widely used on stand alone system operation with server as vxWorks real time operating system like environment. The paper is focused on the Data acquisition and monitoring system software on Aditya RF ICRH System with analog pulses in slave mode with digital pulse in master mode for control acquisition and monitoring and interlocking.

Heart Rate Detection During Sleep Using a Flexible RF Resonator and Injection-Locked PLL Sensor.

PubMed

Kim, Sung Woo; Choi, Soo Beom; An, Yong-Jun; Kim, Byung-Hyun; Kim, Deok Won; Yook, Jong-Gwan

2015-11-01

Novel nonintrusive technologies for wrist pulse detection have been developed and proposed as systems for sleep monitoring using three types of radio frequency (RF) sensors. The three types of RF sensors for heart rate measurement on wrist are a flexible RF single resonator, array resonators, and an injection-locked PLL resonator sensor. To verify the performance of the new RF systems, we compared heart rates between presleep time and postsleep onset time. Heart rates of ten subjects were measured using the RF systems during sleep. All three RF devices detected heart rates at 0.2 to 1 mm distance from the skin of the wrist over clothes made of cotton fabric. The wrist pulse signals of a flexible RF single resonator were consistent with the signals obtained by a portable piezoelectric transducer as a reference. Then, we confirmed that the heart rate after sleep onset time significantly decreased compared to before sleep. In conclusion, the RF system can be utilized as a noncontact nonintrusive method for measuring heart rates during sleep.

Effects of Mobile Phones on Children's and Adolescents' Health: A Commentary.

PubMed

Hardell, Lennart

2018-01-01

The use of digital technology has grown rapidly during the last couple of decades. During use, mobile phones and cordless phones emit radiofrequency (RF) radiation. No previous generation has been exposed during childhood and adolescence to this kind of radiation. The brain is the main target organ for RF emissions from the handheld wireless phone. An evaluation of the scientific evidence on the brain tumor risk was made in May 2011 by the International Agency for Research on Cancer at World Health Organization. The scientific panel reached the conclusion that RF radiation from devices that emit nonionizing RF radiation in the frequency range 30 kHz-300 GHz is a Group 2B, that is, a "possible" human carcinogen. With respect to health implications of digital (wireless) technologies, it is of importance that neurological diseases, physiological addiction, cognition, sleep, and behavioral problems are considered in addition to cancer. Well-being needs to be carefully evaluated as an effect of changed behavior in children and adolescents through their interactions with modern digital technologies. © 2017 The Author. Child Development © 2017 Society for Research in Child Development, Inc.

Materials and Manufacturing Technology Directorate Thermal Sciences and Materials Branch (Overview)

DTIC Science & Technology

2010-09-01

Molecular Mechanics for thermo-mechanical response Materials Characterization • CNT modified durable thermal interface ( DTI ) • MEMS-based RTD micro...stabilization. Surface Characterization by Atomic Force Microscopy: Probing Thermal, Electrical, and Mechanical Properties Heater Current Path Anchor Leg 50 µm

[Development of a massage device based on microcontroller in the field of alimentary tract].

PubMed

Huang, Rong; Peng, Chenglin; He, Hongmei; Zhu, Jing

2007-12-01

In this artical is first reported a survey of the progress in research of MEMS technology. Then, the basic structure, features and the principles of a massage device based on microcontroller in the field of alimentary tract are introduced. Special emphasis is laid on the utilization of MSP430F123 microprocessor for producing a kind of period pulse to control the power of massage capsule. In general, the research and development of the massage device in the field of alimentary tract have active support and deep significance to therapy in the clinical and business settings as well as in the development of biomedical engineering and MEMS.

Programmable Low-Power Low-Noise Capacitance to Voltage Converter for MEMS Accelerometers

PubMed Central

Royo, Guillermo; Sánchez-Azqueta, Carlos; Gimeno, Cecilia; Aldea, Concepción; Celma, Santiago

2016-01-01

In this work, we present a capacitance-to-voltage converter (CVC) for capacitive accelerometers based on microelectromechanical systems (MEMS). Based on a fully-differential transimpedance amplifier (TIA), it features a 34-dB transimpedance gain control and over one decade programmable bandwidth, from 75 kHz to 1.2 MHz. The TIA is aimed for low-cost low-power capacitive sensor applications. It has been designed in a standard 0.18-μm CMOS technology and its power consumption is only 54 μW. At the maximum transimpedance configuration, the TIA shows an equivalent input noise of 42 fA/Hz at 50 kHz, which corresponds to 100 μg/Hz. PMID:28042830

Programmable Low-Power Low-Noise Capacitance to Voltage Converter for MEMS Accelerometers.

PubMed

Royo, Guillermo; Sánchez-Azqueta, Carlos; Gimeno, Cecilia; Aldea, Concepción; Celma, Santiago

2016-12-30

In this work, we present a capacitance-to-voltage converter (CVC) for capacitive accelerometers based on microelectromechanical systems (MEMS). Based on a fully-differential transimpedance amplifier (TIA), it features a 34-dB transimpedance gain control and over one decade programmable bandwidth, from 75 kHz to 1.2 MHz. The TIA is aimed for low-cost low-power capacitive sensor applications. It has been designed in a standard 0.18-μm CMOS technology and its power consumption is only 54 μW. At the maximum transimpedance configuration, the TIA shows an equivalent input noise of 42 fA/ Hz at 50 kHz, which corresponds to 100 μg/ Hz .

Recent Advances in High-Resolution MEMS DM Fabrication and Integration

NASA Astrophysics Data System (ADS)

Bifano, T.; Cornelissen, S.; Bierden, P.

2010-09-01

Deformable mirrors fabricated using microelectromechanical systems technology (MEMS-DMs) have been studied at Boston University (BU) and developed/commercialized by Boston Micromachines Corporation (BMC) over the past decade. Recent advances that might have an impact on surveillance telescopes include demonstration of 4092 actuator DMs with continuous mirror face-sheets, and segmented DMs capable of frame rates of greater than 20kHz for devices with up to 1020 independent segments. The 4092 actuator DM, developed by BMC for the Gemini Planet Imaging GPI instrument, was recently delivered to the GPI instrument development team. Its packaging and platform development are described, and the performance results for the latest prototype devices are presented.

MEMS inertial sensors with integral rotation means.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kohler, Stewart M.

The state-of-the-art of inertial micro-sensors (gyroscopes and accelerometers) has advanced to the point where they are displacing the more traditional sensors in many size, power, and/or cost-sensitive applications. A factor limiting the range of application of inertial micro-sensors has been their relatively poor bias stability. The incorporation of an integral sensitive axis rotation capability would enable bias mitigation through proven techniques such as indexing, and foster the use of inertial micro-sensors in more accuracy-sensitive applications. Fabricating the integral rotation mechanism in MEMS technology would minimize the penalties associated with incorporation of this capability, and preserve the inherent advantages of inertialmore » micro-sensors.« less

Single Crystal DMs for Space-Based Observatories

NASA Astrophysics Data System (ADS)

Bierden, Paul

We propose to demonstrate the feasibility of a new manufacturing process for large aperture, high-actuator count microelectromechanical deformable mirrors (MEMS-DMs). These DMs are designed to fill a critical technology gap in NASA s plan for high- contrast space-based exoplanet observatories. We will manufacture a prototype DM with a continuous mirror facesheet, having an active aperture of 50mm diameter, supported by 2040 electrostatic actuators (50 across the diameter of the active aperture), spaced at a pitch of 1mm. The DM will be manufactured using silicon microfabrication tools. The strategic motivation for the proposed project is to advance MEMS DMs as an enabling technology in NASA s rapidly emerging program for extrasolar planet exploration. That goal is supported by an Astro2010 white paper on Technologies for Direct Optical Imaging of Exoplanets, which concluded that DMs are a critical component for all proposed internal coronagraph instrument concepts. That white paper pointed to great strides made by DM developers in the past decade, and acknowledged the components made by Boston Micromachines Corporation to be the most notable MEMS-based technology option. The principal manufacturing innovation in this project will be assembly of the DM through fusion bonding of three separate single crystal silicon wafers comprising the device s substrate, actuator array, and facesheet. The most significant challenge of this project will be to develop processes that allow reliable fusion bonds between multiple compliant silicon layers while yielding an optically flat surface and a robust electromechanical system. The compliance of the DM, which is required for its electromechanical function, will make it challenging to achieve the intimate, planar contact that is generally needed for success in fusion bonding. The manufacturing approach will use photolithography and reactive ion etching to pattern structural layers. Three wafer-scale devices will be patterned and etched independently: one for the substrate and fixed electrode layer, one for the actuator layer, and one for the mirror layer. Subsequently, each of these wafers will be bonded through a thermal fusion process to the others. In an innovative new processing technique, we will employ sacrificial oxide pillars to add temporary support to the otherwise compliant device structures. These pillars will be dissolved after assembly. The result will be a stress-free, single crystal silicon device with broadly expanded design space for geometric parameters such as actuator pitch, mirror diameter, array size, and actuator gap. Consequently, this approach will allow us to make devices with characteristics that are needed for some important NASA applications in space-based coronography, especially where larger array sizes, greater actuator pitch, and better optical surface quality are needed. The significance of this work is that it will provide a technology platform that meets or exceeds the superb optical performance that has been demonstrated in conventional pizezoelectrically actuated DMs, while retaining the advantages in cost, repeatability, and thermal insensitivity that have been demonstrated in the newer generation of MEMS electrostatically actuated DMs. The shift to bonded single-crystal structures will eliminate the single biggest drawback in previously reported NASA-fielded MEMS DM technology: device susceptibility to stress-induced scalloping and print through artifacts resulting from polycrystalline thin film surface micromachining. With single crystal structures bonded at atomic scales, uncorrected surface topography can be controlled to subnanometer levels, enabling the advancement of NASA s next-generation space-based coronagraphs.

The Role of Engineering Principles in the Medical Utilization of Electromagnetic Energies from kHz to Visible Light - Examples

NASA Astrophysics Data System (ADS)

Rosen, Arye; Rosen, Harel D.

2009-12-01

The use of RF/microwaves in medicine has increased dramatically over the last ten years. RF and microwave therapies for the treatment of cancer in humans are well documented, and are presently used in many cancer centers. RF treatment for supra ventricular arrhythmias, and more recently for the treatment of ventricular tachycardia, are currently employed by major hospitals. RF/microwave are also used in human subjects for the treatment of benign prostatic hyperplasia (BPH). In the last few years, several otolaryngological centers have been utilizing RF to treat upper airway obstruction and to alleviate sleep apnea. Many centers also utilize RF for the treatment of gastro-esophageal disease (GERD), for pain management, and for endometrial ablation. Balloon microwave catheters for ablating solid tumors, then forming cavities in those tumors for the local delivery of therapeutic agents, are currently being investigated. New modalities are being studied, such as RF/microwave for the enhancement of drug absorption and microwave septic wound treatment, microwave imaging for the detection of breast cancer, epidemiological studies on the effects of rats’ exposure to microwave, as well as tissue regeneration using electromagnetic fields. In addition, technology is presently being developed that allows for permanent implantation of microwave wireless sensors in humans. A permanently implantable intra-cranial pressure monitor is one such application of the latter technology. Many more areas of research are currently being investigated, a partial list of which is summarized here.

Solid state RF power: The route to 1W per euro cent

DOE Office of Scientific and Technical Information (OSTI.GOV)

Heid, Oliver

2013-04-19

In most particle accelerators RF power is a decisive design constraint due to high costs and relative inflexibility of current electron beam based RF sources, i.e. Klystrons, Magnetrons, Tetrodes etc. At VHF/UHF frequencies the transition to solid state devices promises to fundamentally change the situation. Recent progress brings 1 Watt per Euro cent installed cost within reach. We present a Silicon Carbide semiconductor solution utilising the Solid State Direct Drive technology at unprecedented efficiency, power levels and power densities. The proposed solution allows retrofitting of existing RF accelerators and opens the route to novel particle accelerator concepts.