Packaging of ferroelectric liquid crystal-on-silicon spatial light modulators

NASA Astrophysics Data System (ADS)

Lin, W.; Morozova, Nina D.; Ju, TehHua; Zhang, Weidong; Lee, Yung-Cheng; McKnight, Douglas J.; Johnson, Kristina M.

1996-11-01

A self-pulling soldering technology has been demonstrated for assembling liquid crystal on silicon (LCOS) spatial light modulators (SLMs). One of the major challenges in manufacturing the LCOS modules is to reproducibly control the thickness of the gap between the very large scale integrated circuit (VLSI) chip and the cover glass. The liquid crystal material is sandwiched between the VLSI chop and the cover glass which is coated with a transparent conductor. Solder joints with different profiles and sizes have been designed to provide surface tension forces to control the gap accommodating the ferroelectric liquid crystal layer in the range of a micron level with sub- micron uniformity. The optimum solder joint design is defined as a joint that results in the maximum pulling force. This technology provides an automatic, batch assembly process for a LCOS SLM through one reflow process. Fluxless soldering technology is used to assemble the module. This approach avoids residues from chemical of flux and oxides, and eliminates potential contamination to the device. Two different LCOS SLM designs and the process optimization are described.

Fixture aids soldering of electronic components on circuit board

NASA Technical Reports Server (NTRS)

Ross, M. H.

1966-01-01

Spring clamp fixture holds small electronic components in a desired position while they are being soldered on a circuit board. The spring clamp is clipped on the edge of the circuit board and an adjustable spring-steel boom holds components against the board. The felt pad at the end of the boom is replaced with different attachments for other holding tasks.

Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention.

PubMed

Li, M Y; Yang, H F; Zhang, Z H; Gu, J H; Yang, S H

2016-06-08

A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder.

Ceramic ball grid array package stress analysis

NASA Astrophysics Data System (ADS)

Badri, S. H. B. S.; Aziz, M. H. A.; Ong, N. R.; Sauli, Z.; Alcain, J. B.; Retnasamy, V.

2017-09-01

The ball grid array (BGA), a form of chip scale package (CSP), was developed as one of the most advanced surface mount devices, which may be assembled by an ordinary surface ball bumps are used instead of plated nickel and gold (Ni/Au) bumps. Assembly and reliability of the BGA's printed circuit board (PCB), which is soldered by conventional surface mount technology is considered in this study. The Ceramic Ball Grid Array (CBGA) is a rectangular ceramic package or square-shaped that will use the solder ball for external electrical connections instead of leads or wire for connections. The solder balls will be arranged in an array or grid at the bottom of the ceramic package body. In this study, ANSYS software is used to investigate the stress on the package for 2 balls and 4 balls of the CBGA package with the various force range of 1-3 Newton applied to the top of the die, top of the substrate and side of the substrate. The highest maximum stress was analyzed and the maximum equivalent stress was observed on the solder ball and the die. From the simulation result, the CBGA package with less solder balls experience higher stress compared to the package with many solder balls. Therefore, less number of solder ball on the CBGA package results higher stress and critically affect the reliability of the solder balls itself, substrate and die which can lead to the solder crack and also die crack.

Effect of electromigration-induced back stress gradient on nanoindentation marker movement in SnAgCu solder joints

NASA Astrophysics Data System (ADS)

Xu, Luhua; Pang, John H. L.; Tu, K. N.

2006-11-01

The electromigration-induced back stress in Pb-free SnAgCu solder was studied by an area array of nanoindentation markers on the cross section of a solder joint. The marker movements driven by combined electron wind force and electromigration-induced back stress gradient were measured at different locations. The back stress gradient was determined from the observation of marker motion using the proposed model. With the applied current density of 104A/cm2 at 125°C, the stress gradient near the anode is 97kPa/μm.

Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention

PubMed Central

Li, M. Y.; Yang, H. F.; Zhang, Z. H.; Gu, J. H.; Yang, S. H.

2016-01-01

A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder. PMID:27273421

Comparative shear tests of some low temperature lead-free solder pastes

NASA Astrophysics Data System (ADS)

Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

2016-12-01

The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

Solder/Substrate Interfacial Reactions in the Sn-Cu-Ni Interconnection System

NASA Astrophysics Data System (ADS)

Yu, H.; Vuorinen, V.; Kivilahti, J. K.

2007-02-01

In order to obtain a better understanding of the effects of interconnection microstructures on the reliability of soldered assemblies, one of the most important ternary systems used in electronics, the Sn-Cu-Ni system, has been assessed thermodynamically. Based on the data obtained, some recent experimental observations related to the formation of interfacial intermetallic compounds in solder interconnections have been studied analytically. First, the effect of Cu content on the formation of the interfacial intermetallic compounds between the SnAgCu solder alloys and Ni substrate was investigated. The critical Cu content for (Cu,Ni)6Sn5 formation was evaluated as a function of temperature. Second, we analyzed how the Ni dissolved in the Cu6Sn5 compound affects the driving forces for the diffusion of components and hence the growth kinetics of (Cu,Ni)6Sn5 and (Cu,Ni)3Sn reaction layers. With the thermodynamic description, other experimental observations related to the Sn-Cu-Ni system can be rationalized as well. The system can be used also as a subsystem for industrially important higher order solder systems.

Current Space Station Experiments Investigating Component Level Electronics Repair

NASA Technical Reports Server (NTRS)

Easton, John W.; Struk, Peter M.

2010-01-01

The Soldering in a Reduced Gravity Experiment (SoRGE) and Component Repair Experiment (CRE)-1 are tests performed on the International Space Station to determine the techniques, tools, and training necessary to allow future crews to perform manual electronics repairs at the component level. SoRGE provides information on the formation and internal structure of through-hole solder joints, illustrating the challenges and implications of soldering in reduced gravity. SoRGE showed a significant increase in internal void defects for joints formed in low gravity compared to normal gravity. Methods for mitigating these void defects were evaluated using a modified soldering process. CRE-1 demonstrated the removal, cleaning, and replacement of electronics components by manual means on functional circuit boards. The majority of components successful passed a post-repair functional test demonstrating the feasibility of component-level repair within the confines of a spacecraft. Together, these tasks provide information to recommend material and tool improvements, training improvements, and future work to help enable electronics repairs in future space missions.

The Influence of Sn Orientation on the Electromigration of Idealized Lead-free Interconnects

NASA Astrophysics Data System (ADS)

Linares, Xioranny

As conventional lead solders are being replaced by Pb-free solders in electronic devices, the reliability of solder joints in integrated circuits (ICs) has become a high concern. Due to the miniaturization of ICs and consequently solder joints, the current density through the solder interconnects has increased causing electrical damage known as electromigration. Electromigration, atomic and mass migration due to high electron currents, is one of the most urgent reliability issues delaying the implementation of Pb-free solder materials in electronic devices. The research on Pb-free solders has mainly focused on the qualitative understanding of failure by electromigration. There has been little progress however, on the quantitative analysis of electromigration because of the lack of available material parameters, such as the effective charge, (z*), the driving force for electromigration. The research herein uses idealized interconnects to measure the z* of electromigration of Cu in Sn-3.0Ag-0.5Cu (SAC305) alloy under different experimental conditions. Planar SAC 305 interconnects were sandwiched between two Cu pads and subject to uniaxial current. The crystallographic orientation of Sn in these samples were characterized with electron backscatter diffraction (EBSD) and wavelength dispersive spectroscopy (WDS) before and after electromigration testing. Results indicate that samples with the c-axis aligned perpendicular to current flow, polycrystalline, and those with a diffusion barrier on the cathode side all inhibit the growth of intermetallic compounds (IMC). The effective charge values of Cu in SAC 305 under the different conditions tested were quantified for the first time and included in this dissertation. The following research is expected to help verify and improve the electromigration model and identify the desirable conditions to inhibit damage by electromigration in Pb-free solder joints.

Physics Notes.

ERIC Educational Resources Information Center

School Science Review, 1981

1981-01-01

Outlines a variety of laboratory procedures, demonstrations, and classroom materials including a technique for estimating speed of electromagnetic waves; a support for multipin components when soldering; use of dynometer to measure force; bending light; using a microcomputer to measure and produce voltage; force-distance curves; and two games. (DS)

Albumin solder covalently bound to a polymer membrane: New approach to improve binding strength in laser tissue soldering in-vitro.

PubMed

Hiebl, B; Ascher, L; Luetzow, K; Kratz, K; Gruber, C; Mrowietz, C; Nehring, M E; Lendlein, A; Franke, R-P; Jung, F

2018-01-01

Laser tissue soldering (LTS) based on indocyanine green (ICG)-mediated heat-denaturation of proteins might be a promising alternative technique for micro-suturing, but up to now the problem of too weak shear strength of the solder welds in comparison to sutures is not solved. Earlier reports gave promising results showing that solder supported by carrier materials can enhance the cohesive strength of the liquid solder. In these studies, the solder was applied to the carriers by dip coating. Higher reliability of the connection between the solder and the carrier material is expected when the solder is bound covalently to the carrier material. In the present study a poly(ether imide) (PEI) membrane served as carrier material and ICG-supplemented albumin as solder substrate. The latter was covalently coupled to the carrier membrane under physiological conditions to prevent structural protein changes. As laser source a diode continuous-wave laser emitting at 808 nm with intensities between 250 mW and 1500 mW was utilized. The albumin functionalized carrier membrane was placed onto the tunica media of explanted pig thoracic aortae forming an overlapping area of approximately 0.5×0.5 cm2. All tests were performed in a dry state to prevent laser light absorption by water. Infrared spectroscopy, spectro-photometrical determination of the secondary and primary amine groups after acid orange II staining, contact angle measurements, and atomic force microscopy proved the successful functionalization of the PEI membrane with albumin. A laser power of 450 mW LTS could generate a membrane-blood vessel connection which was characterized by a shear strength of 0.08±0.002 MPa, corresponding to 15% of the tensile strength of the native blood vessel. Theoretically, an overlapping zone of 4.1 mm around the entire circumference of the blood vessel could have provided shear strength of the PEI membrane-blood vessel compound identical to the tensile strength of the native blood vessel. These in-vitro results confirmed the beneficial effects of solder reinforcement by carrier membranes, and suggest LTS with covalently bound solders on PEI substrates for further studies in animal models.

KSC-08pd0006

NASA Image and Video Library

2008-01-04

KENNEDY SPACE CENTER, FLA. -- At a lab at NASA's Kennedy Space Center, Bob Arp, an aerospace technician with the United Launch Alliance, solders a pin to the socket of the replacement feed-through connector that will be installed in the external fuel tank for space shuttle Atlantis' STS-122 mission. The technician performed this exacting task on the Centaur upper stage for Atlas and Titan launches in 1994 and was specifically chosen for the task. Soldering the connector pins and sockets together addresses the most likely cause of a problem in the engine cutoff sensor system, or ECO system. Some of the tank's ECO sensors failed during propellant tanking for launch attempts on Dec. 6 and Dec. 9. Results of a tanking test on Dec. 18 pointed to an open circuit in the feed-through connector wiring, which is located at the base of the tank. The feed-through connector passes the wires from the inside of the tank to the outside. After the soldering is completed and the connector is reinstalled, shuttle program managers will decide on how to proceed. The launch date for mission STS-122 is under review. Photo credit: NASA/Kim Shiflett

KSC-08pd0004

NASA Image and Video Library

2008-01-04

KENNEDY SPACE CENTER, FLA. -- At a lab at NASA's Kennedy Space Center, aerospace technicians with the United Launch Alliance inspect an electrical wiring harness that has been inserted into a replacement feed-through connector during preparations to solder the pins to the socket of the connector that will be installed in the external fuel tank for space shuttle Atlantis' STS-122 mission. The technicians performed this exacting task on the Centaur upper stage for Atlas and Titan launches in 1994 and were specifically chosen for the task. Soldering the connector pins and sockets together addresses the most likely cause of a problem in the engine cutoff sensor system, or ECO system. Some of the tank's ECO sensors failed during propellant tanking for launch attempts on Dec. 6 and Dec. 9. Results of a tanking test on Dec. 18 pointed to an open circuit in the feed-through connector wiring, which is located at the base of the tank. The feed-through connector passes the wires from the inside of the tank to the outside. After the soldering is completed and the connector is reinstalled, shuttle program managers will decide on how to proceed. The launch date for mission STS-122 is under review. Photo credit: NASA/Kim Shiflett

KSC-08pd0009

NASA Image and Video Library

2008-01-04

KENNEDY SPACE CENTER, FLA. -- At a lab at NASA's Kennedy Space Center, Bob Arp, an aerospace technician with the United Launch Alliance, examinies the pins remaining to be soldered to the socket of the replacement feed-through connector that will be installed in the external fuel tank for space shuttle Atlantis' STS-122 mission. The technician performed this exacting task on the Centaur upper stage for Atlas and Titan launches in 1994 and was specifically chosen for the task. Soldering the connector pins and sockets together addresses the most likely cause of a problem in the engine cutoff sensor system, or ECO system. Some of the tank's ECO sensors failed during propellant tanking for launch attempts on Dec. 6 and Dec. 9. Results of a tanking test on Dec. 18 pointed to an open circuit in the feed-through connector wiring, which is located at the base of the tank. The feed-through connector passes the wires from the inside of the tank to the outside. After the soldering is completed and the connector is reinstalled, shuttle program managers will decide on how to proceed. The launch date for mission STS-122 is under review. Photo credit: NASA/Kim Shiflett

KSC-08pd0003

NASA Image and Video Library

2008-01-04

KENNEDY SPACE CENTER, FLA. -- At a lab at NASA's Kennedy Space Center, Kevin Wyckoff, an aerospace technician with the United Launch Alliance, inserts an electrical wiring harness into a replacement feed-through connector during preparations to solder the pins to the socket of the connector. The connector will later be installed in the external fuel tank for space shuttle Atlantis' STS-122 mission. The technician performed this exacting task on the Centaur upper stage for Atlas and Titan launches in 1994 and was specifically chosen for the task. Soldering the connector pins and sockets together addresses the most likely cause of a problem in the engine cutoff sensor system, or ECO system. Some of the tank's ECO sensors failed during propellant tanking for launch attempts on Dec. 6 and Dec. 9. Results of a tanking test on Dec. 18 pointed to an open circuit in the feed-through connector wiring, which is located at the base of the tank. The feed-through connector passes the wires from the inside of the tank to the outside. After the soldering is completed and the connector is reinstalled, shuttle program managers will decide on how to proceed. The launch date for mission STS-122 is under review. Photo credit: NASA/Kim Shiflett

Growth of Interfacial Intermetallic Compound Layer in Diffusion-Bonded SAC-Cu Solder Joints During Different Types of Thermomechanical Excursion

NASA Astrophysics Data System (ADS)

Kanjilal, Anwesha; Kumar, Praveen

2018-01-01

The effects of mechanical strain on the growth kinetics of interfacial intermetallic compounds (IMCs) sandwiched between Cu substrate and Sn-1.0 wt.%Ag-0.5 wt.%Cu (SAC105) solder have been investigated. Isothermal aging (IA) at 70°C and 125°C, and thermal cycling (TC) as well as thermomechanical cycling (TMC) with shear strain of 12.8% per cycle between -25°C and 125°C were applied to diffusion-bonded solder joints to study the growth behavior of the interfacial IMC layer under various types of thermomechanical excursion (TME). The microstructure of the solder joint tested under each TME was observed at regular intervals. It was observed that the growth rate of the IMC layer was higher in the case of TMC compared with TC or IA. This increased growth rate of the IMC layer in the presence of mechanical strain suggests an additional driving force that enhances the growth kinetics of the IMC. Finite element analysis was performed to gain insight into the effect of TC and TMC on the stress field in the solder joint, especially near the interface between the solder and the substrate. Finally, an analytical model was developed to quantify the effect of strain on the effective diffusivity and express the growth kinetics for all three types of TME using a single expression.

Effect of laser soldering irradiation on covalent bonds of pure collagen.

PubMed

Constantinescu, Mihai A; Alfieri, Alex; Mihalache, George; Stuker, Florian; Ducray, Angélique; Seiler, Rolf W; Frenz, Martin; Reinert, Michael

2007-03-01

Laser tissue welding and soldering is being increasingly used in the clinical setting for defined surgical procedures. The exact induced changes responsible for tensile strength are not yet fully investigated. To further improve the strength of the bonding, a better understanding of the laser impact at the subcellular level is necessary. The goal of this study was to analyze whether the effect of laser irradiation on covalent bonding in pure collagen using irradiances typically applied for tissue soldering. Pure rabbit and equine type I collagen were subjected to laser irradiation. In the first part of the study, rabbit and equine collagen were compared using identical laser and irradiation settings. In the second part of the study, equine collagen was irradiated at increasing laser powers. Changes in covalent bonding were studied indirectly using the sodium dodecylsulfate polyacrylamide gel electrophoresis (SDS-PAGE) technique. Tensile strengths of soldered membranes were measured with a calibrated tensile force gauge. In the first experiment, no differences between the species-specific collagen bands were noted, and no changes in banding were found on SDS-PAGE after laser irradiation. In the second experiment, increasing laser irradiation power showed no effect on collagen banding in SDS-PAGE. Finally, the laser tissue soldering of pure collagen membranes showed virtually no determinable tensile strength. Laser irradiation of pure collagen at typical power settings and exposure times generally used in laser tissue soldering does not induce covalent bonding between collagen molecules. This is true for both rabbit and equine collagen proveniences. Furthermore, soldering of pure collagen membranes without additional cellular components does not achieve the typical tensile strength reported in native, cell-rich tissues. This study is a first step in a better understanding of laser impact at the molecular level and might prove useful in engineering of combined collagen-soldering matrix membranes for special laser soldering applications.

KSC-08pd0008

NASA Image and Video Library

2008-01-04

KENNEDY SPACE CENTER, FLA. -- At a lab at NASA's Kennedy Space Center, the first two of nine pins have been soldered to the socket of the replacement feed-through connector that will be installed in the external fuel tank for space shuttle Atlantis' STS-122 mission. Two United Launch Alliance technicians, who performed this exacting task on the Centaur upper stage for Atlas and Titan launches in 1994, will be doing the soldering. Soldering the connector pins and sockets together addresses the most likely cause of a problem in the engine cutoff sensor system, or ECO system. Some of the tank's ECO sensors failed during propellant tanking for launch attempts on Dec. 6 and Dec. 9. Results of a tanking test on Dec. 18 pointed to an open circuit in the feed-through connector wiring, which is located at the base of the tank. The feed-through connector passes the wires from the inside of the tank to the outside. After the soldering is completed and the connector is reinstalled, shuttle program managers will decide on how to proceed. The launch date for mission STS-122 is under review. Photo credit: NASA/Kim Shiflett

KSC-08pd0007

NASA Image and Video Library

2008-01-04

KENNEDY SPACE CENTER, FLA. -- At a lab at NASA's Kennedy Space Center, the first two of nine pins have been soldered to the socket of the replacement feed-through connector that will be installed in the external fuel tank for space shuttle Atlantis' STS-122 mission. Two United Launch Alliance technicians, who performed this exacting task on the Centaur upper stage for Atlas and Titan launches in 1994, will be doing the soldering. Soldering the connector pins and sockets together addresses the most likely cause of a problem in the engine cutoff sensor system, or ECO system. Some of the tank's ECO sensors failed during propellant tanking for launch attempts on Dec. 6 and Dec. 9. Results of a tanking test on Dec. 18 pointed to an open circuit in the feed-through connector wiring, which is located at the base of the tank. The feed-through connector passes the wires from the inside of the tank to the outside. After the soldering is completed and the connector is reinstalled, shuttle program managers will decide on how to proceed. The launch date for mission STS-122 is under review. Photo credit: NASA/Kim Shiflett

Line length dependence of threshold current density and driving force in eutectic SnPb and SnAgCu solder electromigration

NASA Astrophysics Data System (ADS)

Yoon, Min-Seung; Ko, Min-Ku; Kim, Bit-Na; Kim, Byung-Joon; Park, Yong-Bae; Joo, Young-Chang

2008-04-01

The relationship between the threshold current density and the critical line length in eutectic SnPb and SnAgCu electromigrations were examined using solder lines with the various lengths ranging from 100to1000μm. When the electron wind-force was balanced by the back-stress gradient force, the net flux of electromigration is zero, at which the current density and line length are defined as the threshold current density and the critical length, respectively. It was found that in SnAgCu electromigration, the 1/L dependence on the threshold current density showed good agreement, whereas the threshold current densities of the eutectic SnPb deviated from the 1/L dependence. The balance between the electron wind-force and the back-stress gradient force was the main factor determining the threshold product of SnAgCu electromigration. On the other hand, in the case of eutectic SnPb, the chemical driving force is contributed as a back-flux force in addition to the back-stress gradient force. The existence of the chemical driving force was caused by the nonequilibrium Pb concentration inside the Pb-rich phases between the cathode and anode during the electromigration procedure.

KSC-08pd0005

NASA Image and Video Library

2008-01-04

KENNEDY SPACE CENTER, FLA. -- At a lab at NASA's Kennedy Space Center, Bob Arp, an aerospace technician with the United Launch Alliance, inserts a wire from an electrical harness onto the pin of a replacement feed-through connector during preparations to solder the pins to the socket of the connector. The connector will be installed in the external fuel tank for space shuttle Atlantis' STS-122 mission. The technician performed this exacting task on the Centaur upper stage for Atlas and Titan launches in 1994 and was specifically chosen for the task. Soldering the connector pins and sockets together addresses the most likely cause of a problem in the engine cutoff sensor system, or ECO system. Some of the tank's ECO sensors failed during propellant tanking for launch attempts on Dec. 6 and Dec. 9. Results of a tanking test on Dec. 18 pointed to an open circuit in the feed-through connector wiring, which is located at the base of the tank. The feed-through connector passes the wires from the inside of the tank to the outside. After the soldering is completed and the connector is reinstalled, shuttle program managers will decide on how to proceed. The launch date for mission STS-122 is under review. Photo credit: NASA/Kim Shiflett

KSC-08pd0002

NASA Image and Video Library

2008-01-04

KENNEDY SPACE CENTER, FLA. -- At a lab at NASA's Kennedy Space Center, Kevin Wyckoff, an aerospace technician with the United Launch Alliance, examines an electrical wiring harness. The harness will be inserted into a replacement feed-through connector during preparations to solder the pins to the socket of the connector. The connector will later be installed in the external fuel tank for space shuttle Atlantis' STS-122 mission. The technician performed this exacting task on the Centaur upper stage for Atlas and Titan launches in 1994 and was specifically chosen for the task. Soldering the connector pins and sockets together addresses the most likely cause of a problem in the engine cutoff sensor system, or ECO system. Some of the tank's ECO sensors failed during propellant tanking for launch attempts on Dec. 6 and Dec. 9. Results of a tanking test on Dec. 18 pointed to an open circuit in the feed-through connector wiring, which is located at the base of the tank. The feed-through connector passes the wires from the inside of the tank to the outside. After the soldering is completed and the connector is reinstalled, shuttle program managers will decide on how to proceed. The launch date for mission STS-122 is under review. Photo credit: NASA/Kim Shiflett

KSC-08pd0001

NASA Image and Video Library

2008-01-04

KENNEDY SPACE CENTER, FLA. -- At a lab at NASA's Kennedy Space Center, a Lockheed Martin technician prepares an electrical wiring harness during a procedure to solder the pins to the socket of the replacement feed-through connector that will be installed in the external fuel tank for space shuttle Atlantis' STS-122 mission. Two United Launch Alliance technicians, who performed this exacting task on the Centaur upper stage for Atlas and Titan launches in 1994, will be doing the soldering. Soldering the connector pins and sockets together addresses the most likely cause of a problem in the engine cutoff sensor system, or ECO system. Some of the tank's ECO sensors failed during propellant tanking for launch attempts on Dec. 6 and Dec. 9. Results of a tanking test on Dec. 18 pointed to an open circuit in the feed-through connector wiring, which is located at the base of the tank. The feed-through connector passes the wires from the inside of the tank to the outside. After the soldering is completed and the connector is reinstalled, shuttle program managers will decide on how to proceed. The launch date for mission STS-122 is under review. Photo credit: NASA/Kim Shiflett

Construction of CHESS compact undulator magnets at Kyma

NASA Astrophysics Data System (ADS)

Temnykh, Alexander B.; Lyndaker, Aaron; Kokole, Mirko; Milharcic, Tadej; Pockar, Jure; Geometrante, Raffaella

2015-05-01

In 2014 KYMA S.r.l. has built two CHESS Compact Undulator (CCU) magnets that are at present installed and successfully operate at the Cornell Electron Storage Ring. This type of undulator was developed for upgrade of Cornell High Energy Synchrotron Source beam-lines, but it can be used elsewhere as well. CCU magnets are compact, lightweight, cost efficient and in-vacuum compatible. They are linearly polarized undulators and have a fixed gap. Magnetic field tuning is achieved by phasing (shifting) top magnetic array relative bottom. Two CCUs constructed by KYMA S.r.l. have 28.4 mm period, 6.5 mm gap, 0.93 T peak field. Magnetic structure is of PPM type, made with NdFeB (40UH grade) permanent magnet material. Transitioning from the laboratory to industrial environment for a novel design required additional evaluation, design adjusting and extensive testing. Particular attention was given to the soldering technique used for fastening of the magnetic blocks to holders. This technique had thus far never been used before for undulator magnet construction by industry. The evaluation included tests of different types of soldering paste, measurements of strength of solder and determining the deformations of the soldered magnet and holder under simulated loading forces. This paper focuses on critical features of the CCU design, results of the soldering technique testing and the data regarding permanent magnets magnetization change due to soldering. In addition it deals with optimization-assisted assembly and the performance of the assembled devices and assesses some of the results of the CCU magnets operation at CESR.

Comparison of torsional stability of 2 types of split crimpable surgical hooks with soldered brass surgical hooks.

PubMed

O'Bannon, Shawn P; Dunn, William J; Lenk, Jason S

2006-10-01

The purpose of this in-vitro study was to compare the torsional stability of split crimpable surgical hooks and soldered brass surgical hooks on a rectangular stabilizing archwire. Coated split crimpable hooks (Never-Slip Grip, TP Orthodontics, LaPorte, Ind), ribbed crimpable hooks (TP Orthodontics), and .032-in brass soldered hooks/notched electrodes (Ormco/Sybron Dental Specialties, Orange, Calif) were attached to a 0.019 x 0.025-in stainless steel archwire. The archwire/hook attachment assembly was secured into a dual contact jig and statically mounted to the base of a universal testing machine. The hooks were engaged by a wire loop attached to the upper load cell of the machine, which pulled the wire until the hook was torsionally displaced from the archwire. The mean forces, measured in newtons (N), required to dislodge the hooks were as follows: soldered brass surgical hooks (51.3 +/- 5.2 N), coated split crimpable hooks (49.9 +/- 6.6 N), and ribbed split crimpable hooks (31.3 +/- 5.4 N). Data were analyzed with 1-way ANOVA and Tukey HSD post-hoc tests at alpha = .05. Ribbed split crimpable hooks provided significantly less resistance to torsional displacement than the other types of hooks (P <001). There was no difference between coated split crimpable hooks and soldered brass surgical hooks (P >05). Under the conditions of this study, the results suggest that soldered brass surgical hooks and coated split crimpable hook attachments provide more stability to torsional dislodgement from a rectangular stabilizing archwire than ribbed split crimpable hooks.

Nanospot soldering polystyrene nanoparticles with an optical fiber probe laser irradiating a metallic AFM probe based on the near-field enhancement effect.

PubMed

Cui, Jianlei; Yang, Lijun; Wang, Yang; Mei, Xuesong; Wang, Wenjun; Hou, Chaojian

2015-02-04

With the development of nanoscience and nanotechnology for the bottom-up nanofabrication of nanostructures formed from polystyrene nanoparticles, joining technology is an essential step in the manufacturing and assembly of nanodevices and nanostructures in order to provide mechanical integration and connection. To study the nanospot welding of polystyrene nanoparticles, we propose a new nanospot-soldering method using the near-field enhancement effect of a metallic atomic force microscope (AFM) probe tip that is irradiated by an optical fiber probe laser. On the basis of our theoretical analysis of the near-field enhancement effect, we set up an experimental system for nanospot soldering; this approach is carried out by using an optical fiber probe laser to irradiate the AFM probe tip to sinter the nanoparticles, providing a promising technical approach for the application of nanosoldering in nanoscience and nanotechnology.

Evaluating Maintenance Performance: Test Administrator's Manual and Test Subject's Instructions for Criterion Referenced Job Task Performance Tests for Electronic Maintenance. Final Report.

ERIC Educational Resources Information Center

Shriver, Edgar L.; And Others

This document furnishes a complete copy of the Test Subject's Instructions and the Test Administrator's Handbook for a battery of criterion referenced Job Task Performance Tests (JTPT) for electronic maintenance. General information is provided on soldering, Radar Set AN/APN-147(v), Radar Set Special Equipment, Radar Set Bench Test Set-Up, and…

Alignment-enhancing feed-through conductors for stackable silicon-on-sapphire wafers

NASA Technical Reports Server (NTRS)

Anthony, Thomas R. (Inventor)

1983-01-01

Alignment-enhancing electrically conductive feed-through paths are provided for the high-speed low-loss transfer of electrical signals between integrated circuits of a plurality of silicon-on-sapphire bodies arrayed in a stack. The alignment-enhancing feed-throughs are made by a process involving the drilling of holes through the body, double-sided sputtering, electroplating, and the filling of the holes with solder by capillary action. The alignment-enhancing feed-throughs are activated by forming a stack of wafers and remelting the solder whereupon the wafers, and the feed-through paths, are pulled into alignment by surface tension forces.

Control of microstructure in soldered, brazed, welded, plated, cast or vapor deposited manufactured components

DOEpatents

Ripley, Edward B.; Hallman, Russell L.

2015-11-10

Disclosed are methods and systems for controlling of the microstructures of a soldered, brazed, welded, plated, cast, or vapor deposited manufactured component. The systems typically use relatively weak magnetic fields of either constant or varying flux to affect material properties within a manufactured component, typically without modifying the alloy, or changing the chemical composition of materials or altering the time, temperature, or transformation parameters of a manufacturing process. Such systems and processes may be used with components consisting of only materials that are conventionally characterized as be uninfluenced by magnetic forces.

Method for making alignment-enhancing feed-through conductors for stackable silicon-on-sapphire

NASA Technical Reports Server (NTRS)

Anthony, Thomas R. (Inventor)

1985-01-01

Alignment-enhancing electrically conductive feed-through paths are provided for the high-speed low-loss transfer of electrical signals between integrated circuits of a plurality of silicon-on-sapphire bodies arrayed in a stack. The alignment-enhancing feed-throughs are made by a process of this invention involving the drilling of holes through the body, double-sided sputtering, electroplating, and the filling of the holes with solder by capillary action. The alignment-enhancing feed-throughs are activated by forming a stack of wafers and remelting the solder whereupon the wafers, and the feed-through paths, are pulled into alignment by surface tension forces.

Force instrumentation for cryogenic wind tunnels using one-piece strain-gage balances

NASA Technical Reports Server (NTRS)

Ferris, A. T.

1980-01-01

The use of cryogenic temperatures in wind tunnels to achieve high Reynolds numbers has imposed a harsh operating environment on the force balance. Laboratory tests were conducted to study the effect cryogenic temperatures have on balance materials, gages, wiring, solder, adhesives, and moisture proofing. Wind tunnel tests were conducted using a one piece three component balance to verify laboratory results. These initial studies indicate that satisfactory force data can be obtained under steady state conditions.

The Chemical Modeling of Electronic Materials and Interconnections

NASA Astrophysics Data System (ADS)

Kivilahti, J. K.

2002-12-01

Thermodynamic and kinetic modeling, together with careful experimental work, is of great help for developing new electronic materials such as lead-free solders, their compatible metallizations and diffusion-barrier layers, as well as joining and bonding processes for advanced electronics manufacturing. When combined, these modeling techniques lead to a rationalization of the trial-and-error methods employed in the electronics industry, limiting experimentation and, thus, reducing significantly time-to-market of new products. This modeling provides useful information on the stabilities of phases (microstructures), driving forces for chemical reactions, and growth rates of reaction products occurring in interconnections or thin-film structures during processing, testing, and in longterm use of electronic devices. This is especially important when manufacturing advanced lead-free electronics where solder joint volumes are decreasing while the number of dissimilar reactive materials is increasing markedly. Therefore, a new concept of local nominal composition was introduced and applied together with the relevant ternary and multicomponent phase diagrams to some solder/conductor systems.

Wiring repair area, southwest corner of room 227, looking east. ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

Wiring repair area, southwest corner of room 227, looking east. Repair area includes soldering equipment and wire dispensing reels hanging from the ceiling - March Air Force Base, Strategic Air Command, Combat Operations Center, 5220 Riverside Drive, Moreno Valley, Riverside County, CA

Recovery of materials from waste printed circuit boards by vacuum pyrolysis and vacuum centrifugal separation.

PubMed

Zhou, Yihui; Wu, Wenbiao; Qiu, Keqiang

2010-11-01

In this research, a two-step process consisting of vacuum pyrolysis and vacuum centrifugal separation was employed to treat waste printed circuit boards (WPCBs). Firstly, WPCBs were pyrolysed under vacuum condition at 600 °C for 30 min in a lab-scale reactor. Then, the obtained pyrolysis residue was heated under vacuum until the solder was melted, and then the molten solder was separated from the pyrolysis residue by the centrifugal force. The results of vacuum pyrolysis showed that the type-A of WPCBs (the base plates of which was made from cellulose paper reinforced phenolic resin) pyrolysed to form an average of 67.97 wt.% residue, 27.73 wt.% oil, and 4.30 wt.% gas; and pyrolysis of the type-B of WPCBs (the base plates of which was made from glass fiber reinforced epoxy resin) led to an average mass balance of 72.20 wt.% residue, 21.45 wt.% oil, and 6.35 wt.% gas. The results of vacuum centrifugal separation showed that the separation of solder was complete when the pyrolysis residue was heated at 400 °C, and the rotating drum was rotated at 1200 rpm for 10 min. The pyrolysis oil and gas can be used as fuel or chemical feedstock after treatment. The pyrolysis residue after solder separation contained various metals, glass fibers and other inorganic materials, which could be recycled for further processing. The recovered solder can be reused directly and it can also be a good resource of lead and tin for refining. Copyright © 2010 Elsevier Ltd. All rights reserved.

Array automated assembly task, phase 2. Low cost silicon solar array project

NASA Technical Reports Server (NTRS)

Rhee, S. S.; Jones, G. T.; Allison, K. T.

1978-01-01

Several modifications instituted in the wafer surface preparation process served to significantly reduce the process cost to 1.55 cents per peak watt in 1975 cents. Performance verification tests of a laser scanning system showed a limited capability to detect hidden cracks or defects, but with potential equipment modifications this cost effective system could be rendered suitable for applications. Installation of electroless nickel plating system was completed along with an optimization of the wafer plating process. The solder coating and flux removal process verification test was completed. An optimum temperature range of 500-550 C was found to produce uniform solder coating with the restriction that a modified dipping procedure is utilized. Finally, the construction of the spray-on dopant equipment was completed.

Optimal parameters for laser tissue soldering: II. Premixed versus separate dye-solder techniques.

PubMed

McNally, K M; Sorg, B S; Chan, E K; Welch, A J; Dawes, J M; Owen, E R

2000-01-01

Laser tissue soldering by using an indocyanine green (ICG)-doped protein solder applied topically to the tissue surface and denatured with a diode laser was investigated in Part I of this study. The depth of light absorption was predominantly determined by the concentration of the ICG dye added to the solder. This study builds on that work with an in vitro investigation of the effects of limiting the zone of heat generation to the solder-tissue interface to determine whether more stable solder-tissue fusion can be achieved. An alternative laser tissue soldering technique was investigated, which increased light absorption at the vital solder-tissue interface. A thin layer of ICG dye was smeared over the surface to be treated, the protein solder was then placed directly on top of the dye, and the solder was denatured with an 808-nm diode laser. Because laser light at approximately 800 nm is absorbed primarily by the ICG dye, this thin layer of ICG solution restricted the heat source to the space between the solder and the tissue surfaces. A tensile strength analysis was conducted to compare the separate dye-solder technique with conventional techniques of laser tissue soldering for which a premixed dye-solder is applied directly to the tissue surface. The effect of hydration on bond stability of repairs formed by using both techniques was also investigated using tensile strength and scanning electron microscopy analysis. Equivalent results in terms of tensile strength were obtained for the premixed dye-solder technique using protein solders containing 0.25 mg/ml ICG (liquid solder, 220 +/- 35 N/cm(2); solid solder, 602 +/- 32 N/cm(2)) and for the separate dye-solder technique (liquid solder, 228 +/- 41 N/cm(2); solid solder, 578 +/- 29 N/cm(2)). The tensile strength of native bovine thoracic aorta was 596 +/- 31 N/cm(2). Repairs created by using the separate dye-solder technique were more stable during hydration than their premixed dye-solder counterparts. The conventional premixed dye-solder was simpler and approximately twice as fast to apply. The separate dye-solder technique, however, increased the shelf-life of the solder, because the dye was mixed at the time of the experiment, thus conserving its spectral absorbency properties. Two laser-assisted tissue soldering techniques have been evaluated for repairing aorta incisions in vitro. The advantages and disadvantages of each of these techniques are discussed. Copyright 2000 Wiley-Liss, Inc.

Solder Reflow Failures in Electronic Components During Manual Soldering

NASA Technical Reports Server (NTRS)

Teverovsky, Alexander; Greenwell, Chris; Felt, Frederick

2008-01-01

This viewgraph presentation reviews the solder reflow failures in electronic components that occur during manual soldering. It discusses the specifics of manual-soldering-induced failures in plastic devices with internal solder joints. The failure analysis turned up that molten solder had squeezed up to the die surface along the die molding compound interface, and the dice were not protected with glassivation allowing solder to short gate and source to the drain contact. The failure analysis concluded that the parts failed due to overheating during manual soldering.

Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints

PubMed Central

Huang, Ying; Zhang, Zhijie

2017-01-01

Sn-Bi solder with different Bi content can realize a low-to-medium-to-high soldering process. To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial behaviors in solder joints with Cu and the joints strength, five Sn-Bi solders including Sn-5Bi and Sn-15Bi solid solution, Sn-30Bi and Sn-45Bi hypoeutectic and Sn-58Bi eutectic were selected in this work. The microstructure, interfacial reaction under soldering and subsequent aging and the shear properties of Sn-Bi solder joints were studied. Bi content in Sn-Bi solder had an obvious effect on the microstructure and the distribution of Bi phases. Solid solution Sn-Bi solder was composed of the β-Sn phases embedded with fine Bi particles, while hypoeutectic Sn-Bi solder was composed of the primary β-Sn phases and Sn-Bi eutectic structure from networked Sn and Bi phases, and eutectic Sn-Bi solder was mainly composed of a eutectic structure from short striped Sn and Bi phases. During soldering with Cu, the increase on Bi content in Sn-Bi solder slightly increased the interfacial Cu6Sn5 intermetallic compound (IMC)thickness, gradually flattened the IMC morphology, and promoted the accumulation of more Bi atoms to interfacial Cu6Sn5 IMC. During the subsequent aging, the growth rate of the IMC layer at the interface of Sn-Bi solder/Cu rapidly increased from solid solution Sn-Bi solder to hypoeutectic Sn-Bi solder, and then slightly decreased for Sn-58Bi solder joints. The accumulation of Bi atoms at the interface promoted the rapid growth of interfacial Cu6Sn5 IMC layer in hypoeutectic or eutectic Sn-Bi solder through blocking the formation of Cu6Sn5 in solder matrix and the transition from Cu6Sn5 to Cu3Sn. Ball shear tests on Sn-Bi as-soldered joints showed that the increase of Bi content in Sn-Bi deteriorated the shear strength of solder joints. The addition of Bi into Sn solder was also inclined to produce brittle morphology with interfacial fracture, which suggests that the addition of Bi increased the shear resistance strength of Sn-Bi solder. PMID:28792440

A comparison of two soldering techniques on the misfit of bar-retained implant-supported overdentures.

PubMed

Alvarez, Angel; Lafita, Pedro; de Llanos, Hector; Gago, Angel; Brizuela, Aritza; Ellacuria, Joseba J

2014-02-01

This study was conducted to measure and compare the effect of the soldering method (torch soldering or ceramic furnace soldering) used for soldering bars to bar-retained, implant-supported overdentures on the fit between the bar gold cylinder and implant transgingival abutment. Thirty-two overdenture implant bars were manufactured and screw retained into two Bränemark implants, which were attached to a cow rib. The bars were randomly distributed in two groups: a torch-soldering group and a porcelain-furnace soldering group. Then all bars were cut and soldered using a torch and a ceramic furnace. The fit between the bar gold cylinders and implant transgingival abutments was measured with a light microscope on the opposite side to the screw tightening side before and after the bar soldering procedure. The data obtained were statistically processed for paired and independent data. The average misfit for all bars before soldering was 33.83 to 54.04 μm. After cutting and soldering the bars, the misfit increased up to a range of 71.74 to 78.79 μm. Both before and after the soldering procedure, the bars soldered using a torch showed a higher misfit when compared to the bars soldered using a porcelain furnace. After the soldering procedure, the misfit was slightly lower on the left side of the bars, which had been soldered using a ceramic furnace. According to our data, the soldering of bars using the torch or furnace oven soldering techniques does not improve the misfit of one-piece cast bars on two implants. The lower misfit was obtained using the porcelain furnace soldering technique. © 2013 by the American College of Prosthodontists.

Soldering tool heats workpieces and applies solder in one operation

NASA Technical Reports Server (NTRS)

Gudkese, V. W.

1966-01-01

Fountain-pen type soldering iron heats workpieces and applies solder to joints in densely packed electronics assemblies. The basic soldering tool is used with different-sized orifice tips, eliminating the need for an assortment of conventional soldering guns.

Influence of solder joint length to the mechanical aspect during the thermal stress analysis

NASA Astrophysics Data System (ADS)

Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

2017-09-01

Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

Tool and Fixture Design

DOE Office of Scientific and Technical Information (OSTI.GOV)

Graham, Mark W.

2015-07-28

In a manufacturing process, a need is identified and a product is created to fill this need. While design and engineering of the final product is important, the tools and fixtures that aid in the creation of the final product are just as important, if not more so. Power supplies assembled at the TA-55 PF-5 have been designed by an excellent engineering team. The task in PF-5 now is to ensure that all steps of the assembly and manufacturing process can be completed safely, reliably, and in a quality repeatable manner. One of these process steps involves soldering fine wiresmore » to an electrical connector. During the process development phase, the method of soldering included placing the power supply in a vice in order to manipulate it into a position conducive to soldering. This method is unacceptable from a reliability, repeatability, and ergonomic standpoint. To combat these issues, a fixture was designed to replace the current method. To do so, a twelve step engineering design process was used to create the fixture that would provide a solution to a multitude of problems, and increase the safety and efficiency of production.« less

Solderability study of RABiTS-based YBCO coated conductors

NASA Astrophysics Data System (ADS)

Zhang, Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

2011-08-01

The solderability of commercially available YBa2Cu3O7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

Solderability Study of RABiTS-Based YBCO Coated Conductors

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zhang, Yifei; Duckworth, Robert C; Ha, Tam T

2011-01-01

The solderability of commercially available YBa{sub 2}Cu{sub 3}O{sub 7-x} (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and withmore » two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.« less

Modified Process Reduces Porosity when Soldering in Reduced Gravity Environments

NASA Technical Reports Server (NTRS)

Watson, Kevin; Struk, Peter; Pettegrew, Richard; Downs, Robert; Haylett, Daniel

2012-01-01

A modified process yields lower levels of internal porosity for solder joints produced in reduced-gravity environments. The process incorporates both alternative materials and a modified procedure. The process provides the necessary cleaning action to enable effective bonding of the applied solder alloy with the materials to be joined. The modified process incorporates a commercially available liquid flux that is applied to the solder joint before heating with the soldering iron. It is subsequently heated with the soldering iron to activate the cleaning action of the flux and to evaporate most of the flux, followed by application of solder alloy in the form of commercially available solid solder wire (containing no flux). Continued heating ensures adequate flow of the solder alloy around and onto the materials to be joined. The final step is withdrawal of the soldering iron to allow alloy solidification and cooling of the solder joint.

Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders

NASA Astrophysics Data System (ADS)

Li, Qin; Ma, Ninshu; Lei, YongPing; Lin, Jian; Fu, HanGuang; Gu, Jian

2016-11-01

Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of β-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100°C to 104°C. However, when the Sn content exceeded 50 wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints.

Effects of limited cu supply on soldering reactions between SnAgCu and Ni

NASA Astrophysics Data System (ADS)

Ho, C. E.; Lin, Y. W.; Yang, S. C.; Kao, C. R.; Jiang, D. S.

2006-05-01

The volume difference between the various types of solder joints in electronic devices can be enormous. For example, the volume difference between a 760-µm ball grid array solder joint and a 75-µm flip-chip solder joint is as high as 1000 times. Such a big difference in volume produces a pronounced solder volume effect. This volume effect on the soldering reactions between the Sn3AgxCu (x=0.4, 0.5, or 0.6 wt.%) solders and Ni was investigated. Three different sizes of solder spheres (300, 500, and 760 µm in diameter) were soldered onto Ni soldering pads. Both the Cu concentration and the solder volume had a strong effect on the type of the reaction products formed. In addition, (Cu,Ni)6Sn5 massively spalled from the interface under certain conditions, including smaller joints and those with lower Cu concentration. We attributed the massive spalling of (Cu,Ni)6Sn5 to the decrease of the available Cu in the solders. The results of this study suggest that Cu-rich SnAgCu solders can be used to prevent this massive spalling.

Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

NASA Astrophysics Data System (ADS)

Lee, Hwa-Teng; Huang, Kuo-Chen

2016-12-01

Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

On-Chip Out-of-Plane High-Q Inductors

DTIC Science & Technology

2002-01-01

and leaves the substrate available for circuits. Magnetic forces [2] and the surface tension of a molten dot of solder [3] or polymer [4] have been...and P. Renaud, "High aspect ratio planar coils embedded in SU8 photoepoxy for MEMS applications," Tech. Digest Eurosensors XII, Southampton, Sep. 13-16

Novel solid protein solder designs for laser-assisted tissue repair.

PubMed

McNally, K M; Sorg, B S; Welch, A J

2000-01-01

Previous studies have shown that the application of chromophore-enhanced albumin protein solders to augment laser tissue repairs significantly improves repair strength, enhances edge co-optation, and reduces thermal tissue injury. These investigations are furthered with this in vitro study conducted to assess a new range of specially designed chromophore-enhanced solid protein solders manufactured and tested for application during laser-assisted tissue repair. The experimental study was divided into three parts. In the first part of the study, the creation of a chromophore concentration gradient across the thickness of the solid protein solder was investigated as a means to improve control of the heat source gradient through the solder during laser irradiation. In the second part of the study, predenaturation of the solid protein solder was investigated as a means for enhancing the stability of the solder in physiological fluids before irradiation. Finally, in the third part of the study, the feasibility of using synthetic polymers as a scaffold for traditional albumin protein solder mixes was investigated as a means of improving the flexibility of the solder. Uniform denaturation across the thickness of the solder was achieved by controlling the chromophore concentration gradient, thus ensuring stable solder-tissue fusion when the specimen was submerged in a hydrated environment. Predenaturation of the solid protein solder significantly reduced the solubility of the solder, and consequently, improved the handling characteristics of the solder. The solder-doped polymer membranes were flexible enough to be wrapped around tissue, whereas their solid nature avoided problems associated with "runaway" of the less viscous liquid solders currently used by researchers. In addition, the solder-doped polymer membranes could be easily tailored to a wide range of geometries suitable to many clinical applications. The novel solid protein solder designs presented here add a new dimension to tissue repair as their flexible, moldable, and absorption controllable nature, greatly improves the clinical applicability of laser-assisted tissue repair. Copyright 2000 Wiley-Liss, Inc.

Electromigration in solder joints and solder lines

NASA Astrophysics Data System (ADS)

Gan, H.; Choi, W. J.; Xu, G.; Tu, K. N.

2002-06-01

Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flipchip solder joint has a built-in currentcrowding configuration to enhance electromigration failure. To better understand electromigration in SnPb and lead-free solder alloys, the authors prepared solder lines in v-grooves etched on Si (001). This article discusses the results of those tests and compares the electromigration failure modes of eutectic SnPb and SnAgCu flip-chip solder joints along with the mean-timeto-failure.

NTF: Soldering Technology Development for Cryogenics

NASA Technical Reports Server (NTRS)

Hall, E. T., Jr.

1985-01-01

The advent of the National Transonic Facility (NTF) brought about a new application for an old joining method, soldering. Soldering for use at cryogenic temperatures requires that solders remain ductile and free from tin-pest (grey tin), have toughness to withstand aerodynamic loads associated with flight research, and maintain their surface finishes. Solders are used to attach 347 Stainless-Steel tubing in surface grooves of models. The solder must fill up the gap and metallurgically bound to the tubing and model. Cryogenic temperatures require that only specific materials for models can be used, including: Vasco Max 200 CVM, lescalloy A-286 Vac Arc, pH 13-8 Mo. Solders identified for testing at this time are: 50% Sn - 49.5% Pb - 0.5% Sb, 95% Sn - 5% Sb, 50% In 50% Pb, and 37.5% Sn - 37.5% Pb - 25% In. With these materials and solders, it is necessary to determine their solderability. After solderability is determined, tube/groove specimens are fabricated and stressed under cryogenic temperatures. Compatible solders are then used for acutual models.

Multiwire conductor having increased interwire resistance and good mechanical stability and method for making same

DOEpatents

Luhman, Thomas; Klamut, Carl

1984-02-14

An improved multiwire conductor of the type which is mechanically stabilized by a solder filler. A solder filled conductor is heated to a temperature sufficient to make the solder brittle, but below the melting point of the solder. While still hot, the conductor is flexed, causing the solder to separate from the wires comprising the conductor, thereby increasing the interwire resistance. In one embodiment the conductor may be heated to a temperature above the eutectic temperature of the solder so that a controlled amount of solder is removed. The subject invention is particularly suited for use with braided, ribbon-type, solder filled superconductors.

Multiwire conductor having increased interwire resistance and good mechanical stability and method for making same

DOEpatents

Luhman, T.; Klamut, C.

1982-03-15

An improved multiwire conductor of the type which is mechanically stabilized by a solder filler. A solder filled conductor is heated to a temperature sufficient to make the solder brittle, but below the melting point of the solder. While still hot, the conductor is flexed, causing the solder to separate from the wires comprising the conductor, thereby increasing the interwire resistance. In one embodiment the conductor may be heated to a temperature above the eutectic temperature of the solder so that a controlled amount of solder is removed. The subject invention is particularly suited for use with braided, ribbon-type, solder filled superconductors.

Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock

NASA Astrophysics Data System (ADS)

Sung, Yong-Gue; Myung, Woo-Ram; Jeong, Haksan; Ko, Min-Kwan; Moon, Jeonghoon; Jung, Seung-Boo

2018-04-01

The effect of thermal shock on the mechanical reliability of epoxy Sn-58wt.%Bi composite (epoxy Sn-58wt.%Bi) solder joints was investigated with different surface-finished substrates. Sn-58wt.%Bi-based solder has been considered as a promising candidate for low-temperature solder among various lead-free solders. However, Sn-58wt.%Bi solder joints can be easily broken under impact conditions such as mechanical shock, drop tests, and bending tests because of their poor ductility. Therefore, previous researchers have tried to improve the mechanical property of Sn-58wt.%Bi solder by additional elements and mixtures of metal powder and epoxy resin. Epoxy Sn-58wt.%Bi solder paste was fabricated by mixing epoxy resin and Sn-58wt.%Bi solder powder to enhance the mechanical reliability of Sn-58wt.%Bi solder joints. The epoxy Sn-58wt.%Bi solder paste was screen-printed onto various printed circuit board surfaces finished with organic solder preservatives (OSP), electroless nickel immersion gold (ENIG), and electroless nickel electroless palladium immersion gold (ENEPIG). The test components were prepared by a reflow process at a peak temperature of 190°C. The thermal shock test was carried out under the temperature range of - 40 to 125°C to evaluate the reliability of Sn-58wt.%Bi and epoxy Sn-58wt.%Bi solder joints. The OSP-finished sample showed a relatively higher mechanical property than those of ENIG and ENEPIG after thermal shock. The average number of cycles for epoxy Sn-58wt.%Bi solder with the OSP surface finish were 6 times higher than that for Sn-58wt.%Bi solder with the same finish. The microstructures of the solder joints were investigated by scanning electron microscopy, and the composition of the intermetallic compound (IMC) layer was analyzed by using energy dispersive spectrometry. Cu6Sn5 IMC was formed by the reaction between Sn-58wt.%Bi solder and a OSP surface-finished Cu after the reflow process. Ni3Sn4 IMC and (Ni, Pd)3Sn4 IMC were formed at the solder joints between the ENIG and solder, and between ENEPIG surface finish and solders, respectively.

Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock

NASA Astrophysics Data System (ADS)

Sung, Yong-Gue; Myung, Woo-Ram; Jeong, Haksan; Ko, Min-Kwan; Moon, Jeonghoon; Jung, Seung-Boo

2018-07-01

The effect of thermal shock on the mechanical reliability of epoxy Sn-58wt.%Bi composite (epoxy Sn-58wt.%Bi) solder joints was investigated with different surface-finished substrates. Sn-58wt.%Bi-based solder has been considered as a promising candidate for low-temperature solder among various lead-free solders. However, Sn-58wt.%Bi solder joints can be easily broken under impact conditions such as mechanical shock, drop tests, and bending tests because of their poor ductility. Therefore, previous researchers have tried to improve the mechanical property of Sn-58wt.%Bi solder by additional elements and mixtures of metal powder and epoxy resin. Epoxy Sn-58wt.%Bi solder paste was fabricated by mixing epoxy resin and Sn-58wt.%Bi solder powder to enhance the mechanical reliability of Sn-58wt.%Bi solder joints. The epoxy Sn-58wt.%Bi solder paste was screen-printed onto various printed circuit board surfaces finished with organic solder preservatives (OSP), electroless nickel immersion gold (ENIG), and electroless nickel electroless palladium immersion gold (ENEPIG). The test components were prepared by a reflow process at a peak temperature of 190°C. The thermal shock test was carried out under the temperature range of - 40 to 125°C to evaluate the reliability of Sn-58wt.%Bi and epoxy Sn-58wt.%Bi solder joints. The OSP-finished sample showed a relatively higher mechanical property than those of ENIG and ENEPIG after thermal shock. The average number of cycles for epoxy Sn-58wt.%Bi solder with the OSP surface finish were 6 times higher than that for Sn-58wt.%Bi solder with the same finish. The microstructures of the solder joints were investigated by scanning electron microscopy, and the composition of the intermetallic compound (IMC) layer was analyzed by using energy dispersive spectrometry. Cu6Sn5 IMC was formed by the reaction between Sn-58wt.%Bi solder and a OSP surface-finished Cu after the reflow process. Ni3Sn4 IMC and (Ni, Pd)3Sn4 IMC were formed at the solder joints between the ENIG and solder, and between ENEPIG surface finish and solders, respectively.

Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test.

PubMed

Jeong, Haksan; Myung, Woo-Ram; Sung, Yong-Gue; Kim, Kyung-Yeol; Jung, Seung-Boo

2018-09-01

Microstructures and mechanical property of Sn-3.0Ag-0.5Cu (SAC305) and epoxy Sn-3.0Ag-0.5Cu (epoxy SAC) solder joints were investigated with various surface finishes; organic solderability preservative (OSP), electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG). Bending property of solder joints was evaluated by 3-point bend test method. Microstructure and chemical composition of solder joints was characterized by scanning electron microscope (SEM) and energy dispersive X-ray spectroscopy (EDX), respectively. Epoxy did not effect on intermetallic compound (IMC) morphology. Scalloped shaped Cu6Sn5 IMC was observed at OSP surface finish. Chunky-like shaped and needle-like shaped (Ni,Cu)6Sn5 IMC were observed at the solder/ENIG joint and solder/ENEPIG joint, respectively. The bending cycles of SAC305/OSP joint, SAC305/ENIG joints and SAC305/ENEPIG joints were 720, 440 and 481 cycle numbers. The bending cycles of epoxy SAC and three types surface finished solder joints were over 1000 bending cycles. Under OSP surface finish, bending cycles of epoxy SAC solder was approximately 1.5 times higher than those of SAC305 solder joint. Bending cycles of epoxy SAC solder was over twice times higher than those of SAC305 solder with ENIG and ENEPIG surface finishes. The bending property of epoxy solder joint was enhanced due to epoxy fillet held the solder joint.

Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

NASA Astrophysics Data System (ADS)

Tikale, Sanjay; Prabhu, K. Narayan

2018-05-01

The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (T L) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy.

The Effect of Copper Addition on the Properties of Sn-0.7Cu Solder Paste

NASA Astrophysics Data System (ADS)

Said, R. M.; Mohamad Johari, F. H.; Salleh, M. A. A. Mohd; Sandu, A. V.

2018-03-01

The effect of copper addition on the properties of Sn-Cu based solder paste were investigate through this study. The Sn-0.7Cu solder paste doped with different concentration of Cu were prepared using solder paste mixture. The bulk solder microstructure of assolidified solder paste was studied. Besides that, intermetallic compound (IMC) formation on Cu substrate and hardness of all solder paste also being investigated. Results shows that increasing Cu concentration cause formation of large Cu6Sn5 IMC at bulk solder and the size of the IMC grew larger at high temperature. In addition, β-Sn area reduce when Cu concentration was high. The IMC morphology for all solder paste almost remain unchanged. However, there are large Cu6Sn5 IMC form near the interfacial IMC in Sn-Cu solder paste with high amount of Cu (Sn-10Cu). The hardness value was decrease when processing temperature at 250 °C due to present of small void in the microstructure while hardness of solder material increased at high temperature.

Investigation of the interaction of the solder components for laser welding of biological tissues

NASA Astrophysics Data System (ADS)

Ryabki, Dmitrii I.; Gerasimenko, Alexander Yu.; Kvasnov, Bogdan A.; Pyankov, Evgeny S.; Pyanov, Ivan V.; Telyshev, Dmitry V.; Podgaetsky, Vitaly M.

2017-07-01

Increase the weld strength is main directions of development of laser welding technology. Laser solders are used to increase tensile strength of welds and reduce of tissue temperature necrosis. Soldering components interaction effect the solder tensile strength characteristics of laser welds. Tensile strengths for welds obtained using of solder various concentration BSA and SWCNT was measured. Dimensions laser solder aggregates were measured. The dependence between the dimensions of the aggregates of laser solder and the tensile strength of the weld has been revealed.

Undercooling Behavior and Intermetallic Compound Coalescence in Microscale Sn-3.0Ag-0.5Cu Solder Balls and Sn-3.0Ag-0.5Cu/Cu Joints

NASA Astrophysics Data System (ADS)

Zhou, M. B.; Ma, X.; Zhang, X. P.

2012-11-01

The microstructure of microscale solder interconnects and soldering defects have long been known to have a significant influence on the reliability of electronic packaging, and both are directly related to the solidification behavior of the undercooled solder. In this study, the undercooling behavior and solidification microstructural evolution of Sn-3.0Ag-0.5Cu solder balls with different diameters (0.76 mm, 0.50 mm, and 0.30 mm) and the joints formed by soldering these balls on Cu open pads of two diameters (0.48 mm and 0.32 mm) on a printed circuit board (PCB) substrate were characterized by differential scanning calorimetry (DSC) incorporated into the reflow process. Results show that the decrease in diameter of the solder balls leads to an obvious increase in the undercooling of the balls, while the undercooling of the solder joints shows a dependence on both the diameter of the solder balls and the diameter ratio of solder ball to Cu pad (i.e., D s/ D p), and the diameter of the solder balls has a stronger influence on the undercooling of the joints than the dimension of the Cu pad. Coarse primary intermetallic compound (IMC) solidification phases were formed in the smaller solder balls and joints. The bulk Ag3Sn IMC is the primary solidification phase in the as-reflowed solder balls. Due to the interfacial reaction and dissolution of Cu atoms into the solder matrix, the primary Ag3Sn phase can be suppressed and the bulk Cu6Sn5 IMC is the only primary solidification phase in the as-reflowed solder joints.

Understanding the reliability of solder joints used in advanced structural and electronics applications: Part 1 - Filler metal properties and the soldering process

DOE PAGES

Vianco, Paul T.

2017-02-01

Soldering technology has made tremendous strides in the past half-century. Whether structural or electronic, all solder joints must provide a level of reliability that is required by the application. This Part 1 report examines the effects of filler metal properties and soldering process on joint reliability. Solder alloy composition must have the appropriate melting and mechanical properties that suit the product's assembly process(es) and use environment. The filler metal must also optimize solderability (wetting-and-spreading) to realize the proper joint geometry. Here, the soldering process also affects joint reliability. The choice of flux and thermal profile support the solderability performance ofmore » the molten filler metal to successfully fill the gap and complete the fillet.« less

Repair strength dependence on solder protein concentration: a study in laser tissue-welding.

PubMed

Lauto, A

1998-01-01

A novel laser-activated solid solder has been coupled with a diode laser to investigate the dependence of the solder protein concentration on the tensile strength of the soldered tissues. The uncertainty of laser welding, due to the fluid glue, was overcome using the solid solder. Sixty-two severed rat tibial nerves and vas deferens were repaired using rectangular protein bands with two different albumin concentrations (58% and 68% by weight). The laser power (90 mW and 140 mW), dose (12.9 +/- 0.7 J/mg, mean +/- s.d.), and solder dimensions (thickness = 0.15 +/- 0.01 mm, surface area = 7.8 +/- 0.4 mm2) were kept constant during the operations. The laser welds with high protein solder concentration were significantly (P < 0.05) stronger (28 +/- 3.5 g) than the welds with low protein solder concentration (23 +/- 5 g). The average tensile strength of the laser soldered tissues increased as the protein solder concentration increased.

Solder flow over fine line PWB surface finishes

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hosking, F.M.; Hernandez, C.L.

1998-08-01

The rapid advancement of interconnect technology has stimulated the development of alternative printed wiring board (PWB) surface finishes to enhance the solderability of standard copper and solder-coated surfaces. These new finishes are based on either metallic or organic chemistries. As part of an ongoing solderability study, Sandia National Laboratories has investigated the solder flow behavior of two azole-based organic solderability preservations, immersion Au, immersion Ag, electroless Pd, and electroless Pd/Ni on fine line copper features. The coated substrates were solder tested in the as-fabricated and environmentally-stressed conditions. Samples were processed through an inerted reflow machine. The azole-based coatings generally providedmore » the most effective protection after aging. Thin Pd over Cu yielded the best wetting results of the metallic coatings, with complete dissolution of the Pd overcoat and wetting of the underlying Cu by the flowing solder. Limited wetting was measured on the thicker Pd and Pd over Ni finishes, which were not completely dissolved by the molten solder. The immersion Au and Ag finishes yielded the lowest wetted lengths, respectively. These general differences in solderability were directly attributed to the type of surface finish which the solder came in contact with. The effects of circuit geometry, surface finish, stressing, and solder processing conditions are discussed.« less

Tubing crimping pliers

DOEpatents

Lindholm, G.T.

1981-02-27

The disclosure relates to pliers and more particularly to pliers for crimping two or more pieces of copper tubing together prior to their being permanently joined by brazing, soldering or the like. A die containing spring-loaded pins rotates within a cammed ring in the head of the pliers. As the die rotates, the pins force a crimp on tubing held within the pliers.

History of Space-Based Infrared Astronomy and the Air Force Infrared Celestial Backgrounds Program

DTIC Science & Technology

2008-04-18

catastrophic cryostat failure that, as Tom Murdock (27 July 1999 e-mail) noted “…split the vent tube plumbing through the heat exchanger like a banana ... peel from end-to-end along the soldered seam of the two quasi- semi circle pieces” and almost terminated the program. Schick and Bell (1997) attributed

SOLDERING OF ALUMINUM BASE METALS

DOEpatents

Erickson, G.F.

1958-02-25

This patent deals with the soldering of aluminum to metals of different types, such as copper, brass, and iron. This is accomplished by heating the aluminum metal to be soldered to slightly above 30 deg C, rubbing a small amount of metallic gallium into the part of the surface to be soldered, whereby an aluminum--gallium alloy forms on the surface, and then heating the aluminum piece to the melting point of lead--tin soft solder, applying lead--tin soft solder to this alloyed surface, and combining the aluminum with the other metal to which it is to be soldered.

Study on the Tensile Creep Behavior of Carbon Nanotubes-Reinforced Sn-58Bi Solder Joints

NASA Astrophysics Data System (ADS)

Yang, Li; Liu, Haixiang; Zhang, Yaocheng

2018-01-01

The microstructure and tensile creep behavior of plain Sn-58Bi solder and carbon nanotubes (CNTs)-reinforced composite solder joints were investigated. The stress exponent n under different stresses and the creep activation energy Q c under different temperatures of solder joints were obtained by an empirical equation. The results reveal that the microstructure of the composite solder joint is refined and the tensile creep resistance is improved by CNTs. The improvement of creep behavior is due to the microstructural change of the composite solder joints, since the CNTs could provide more obstacles for dislocation pile-up, which enhances the values of the stress exponent and the creep activation energy. The steady-state tensile creep rates of plain solder and composite solder joints are increased with increasing temperature and applied stress. The tensile creep constitutive equations of plain solder and composite solder joints are written as \\dot{ɛ }_{s1} = 14.94( {σ /G} )^{3.7} \\exp ( { - 81444/RT} ) and \\dot{ɛ }_{s2} = 2.5( {σ /G} )^{4.38} \\exp ( { - 101582/RT} ) , respectively. The tensile creep mechanism of the solder joints is the effects of lattice diffusion determined by dislocation climbing.

The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

NASA Astrophysics Data System (ADS)

Jang, Guh-Yaw; Duh, Jenq-Gong

2005-01-01

The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

NASA Astrophysics Data System (ADS)

Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

2017-10-01

Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

Enabling two-phase microfluidic thermal transport systems using a novel thermal-flux degassing and fluid charging approach

NASA Astrophysics Data System (ADS)

Singh Dhillon, Navdeep; Pisano, Albert P.

2014-03-01

A novel two-port thermal-flux method has been proposed and demonstrated for degassing and charging two-phase microfluidic thermal transport systems with a degassed working fluid. In microscale heat pipes and loop heat pipes (mLHPs), small device volumes and large capillary forces associated with smaller feature sizes render conventional vacuum pump-based degassing methods quite impractical. Instead, we employ a thermally generated pressure differential to purge non-condensable gases from these devices before charging them with a degassed working fluid in a two-step process. Based on the results of preliminary experiments studying the effectiveness and reliability of three different high temperature-compatible device packaging approaches, an optimized compression packaging technique was developed to degas and charge a mLHP device using the thermal-flux method. An induction heating-based noninvasive hermetic sealing approach for permanently sealing the degassed and charged mLHP devices has also been proposed. To demonstrate the efficacy of this approach, induction heating experiments were performed to noninvasively seal 1 mm square silicon fill-hole samples with donut-shaped solder preforms. The results show that the minimum hole sealing induction heating time is heat flux limited and can be estimated using a lumped capacitance thermal model. However, further continued heating of the solder uncovers the hole due to surface tension-induced contact line dynamics of the molten solder. It was found that an optimum mass of the solder preform is required to ensure a wide enough induction-heating time window for successful sealing of a fill-hole.

Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

PubMed

Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

2014-10-01

The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; P<.001). Follow-up multiple comparisons showed a significant difference among all the groups. Microwave soldering resulted in a higher tensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

Soldering instrument safety improvements

DOEpatents

Kosslow, William J.; Giron, Ronald W.

1996-01-01

A safe soldering device includes a retractable heat shield which can be moved between a first position in which the solder tip of the device is exposed for soldering operation and a second position in which the solder tip is covered by the heat shield. Preferably, the heat shield is biased towards the second position and may be locked in the first position for ease of use. When the soldering device is equipped with a vacuum system, the heat shield may serve to guide the flow of gases and heat from the solder tip away from the work area. The heat shield is preferably made of non-heatsinking plastic.

Soldering In Space Investigation Video

NASA Technical Reports Server (NTRS)

2004-01-01

This video captures Mike Fincke melting solder during the first set of planned In-Space Soldering Investigation (ISSI) experiments onboard the International Space Station (ISS). In the video, Fincke touches the tip of the soldering iron to a wire wrapped with rosin-core solder. Review of the experiment video revealed melting kinetics, wetting characteristics, and equilibrium shape attainment of the solder charge. Samples returned to Earth were examined for porosity and flux distribution as well as microstructural development. ISSI's purpose was to find out how solder behaves in a weightless environment and promote our knowledge of fabrication and repair techniques that might be employed during extended space exploration missions.

The present triumphs and future problems with wave soldering

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vianco, P.T.

1993-10-01

Nearly 40 years of experience with wave soldering have resulted in processes that routinely produce several thousand, defect-free solder joints per minute. However, the climate of electronics manufacturing has changed significantly over the past 10 to 15 years. Environmental restrictions as well as the high quality of products made offshore has placed new demands and challenges on the electronics industry, right down to the assembly process. The impact on wave soldering by environmental regulations and a need for more cost-competitive manufacturing processes has become a serious issue in terms of the economical well-being of the industry. In order to obtainmore » a clearer understanding of the situation, however, it is first most appropriate and necessary to examine the technology of wave soldering. Historically, wave soldering was developed as a refinement of the dip and drag soldering processes with the objective of reducing or eliminating many of the associated defects often present in these earlier processes. Wave soldering reduces the area of contact between the circuit board and the solder. This characteristic, coupled with the agitation generated in the solder, allows flux and its volatile by-products to readily escape from under the board, decreasing the number of skips, unfilled holes, and solder joint voids. The reduced contact area also lessens the potential for thermal damage to the circuit board laminate. Control of the wave profile at the exit point of the circuit board lessens the likelihood of icicles and bridges forming on the solder joints; this latitude is not available in the dip soldering process.« less

Connector design in a long-span-fixed dental prosthesis: a three-dimensional finite element analysis.

PubMed

Harshitha Gowda, B H; Satish Babu, C L

2013-01-01

The goal of every prosthetic management is to simulate nature and be in harmony with nature within the physiological limits. The occlusal forces on a fixed dental prosthesis are transmitted to the surrounding structures through pontics, connectors and retainers and more stresses are seen at the connector region. To analyze the stress patterns in cast and soldered connectors between the two pontics and between the retainer and pontic of a four unit fixed dental prosthesis on axial and non axial loading and also to observe and ascertain the need to modify the design of the rigid connectors. Subsequently four models each of cast and soldered connectors with cylindrical and triangular design, of dimension 3 × 4 mm and thickness 0.5 mm was designed for the study. The first premolar and second molar were considered as the abutments and 2 nd premolar and 1 st molar as the pontics. The analysis was done using ANSYS version 8.0 software and by placing axial and non-axial load of 40 Newtons each. Von Misses stresses were observed at the connector region between the two pontics, especially in the cervical region. The cylindrical cast connectors showed less stress in comparison to triangular design and the difference in the stress distribution of cast and soldered connectors were marginal. The occlusal forces on a fixed dental prosthesis are transmitted to the surrounding structures through pontics, connectors and retainers with maximum stresses concentrated at the connectors. Hence this three-dimensional finite element analysis study investigated stress distribution in a four unit posterior fixed dental prosthesis, having cylindrical and triangular connector designs.

Laser-based rework in electronics production

NASA Astrophysics Data System (ADS)

Albert, Florian; Mys, Ihor; Schmidt, Michael

2007-02-01

Despite the electronic manufacturing is well-established mass production process for a long time, the problem of reworking, i.a. reject and replace of defect components, still exists. The rework operations (soldering, replacement and desoldering) are performed in most cases manually. However, this practice is characterized by an inconsistent quality of the reworked solder joints and a high degree of physiological stress for the employees. In this paper, we propose a novel full-automated laser based soldering and rework process. Our developed soldering system is a pick-and-place unit with an integrated galvanometer scanner, a fiber coupled diode laser for quasi-simultaneous soldering and a pyrometer-based process control. The developed system provides soldering and reworking processes taking into account a kind of defect, a type of electronic component and quality requirements from the IPC- 610 norm. The paper spends a great deal of efforts to analyze quality of laser reworked solder joints. The quality depends mainly on the type and thickness of intermetallic phases between solder, pads and leads; the wetting angles between pad, solder and lead; and finally, the joint microstructure with its mechanical properties. The influence of the rework soldering on these three factors is discussed and compared to conventional laser soldering results. In order to optimize the quality of reworked joints, the different strategies of energy input are applied.

Effects of Grain Orientation on Cu6Sn5 Growth Behavior in Cu6Sn5-Reinforced Composite Solder Joints During Electromigration

NASA Astrophysics Data System (ADS)

Han, Jing; Wang, Yan; Tan, Shihai; Guo, Fu

2018-02-01

Electromigration is a major reliability problem in composite solder joints. Due to the anisotropy of the β-Sn crystal structure, the Sn grain orientations present in the solder matrix dominate the principal failure mechanism in solder joints under electric current stressing. In this work, the Cu6Sn5 growth behavior in Cu6Sn5-reinforced composite solder joints with three different Sn grain orientations was investigated at current density of 104 A/cm2 at room temperature. Micron-sized Cu particles were added to Sn-3.5Ag solder at 2% volume fraction using an in situ method. After current stressing for 528 h, the polarity effect in the composite solder joint was greatest for an angle ( θ) between the c-axis and electron flow direction of 30°, resulting in higher growth rate of Cu6Sn5 in the solder matrix compared with composite solder joints with θ of 60° or 90°. There were no noticeable changes in the composite solder joint with θ of 90°. The growth behavior of Cu6Sn5, Cu atomic motion, and Cu diffusivity in the composite solder joints with different Sn grain orientations were analyzed in detail.

Recrystallization Behavior in Mixed Solder Joints of BGA Components during Thermal Shock

NASA Astrophysics Data System (ADS)

Tan, Shihai; Han, Jing; Guo, Fu

2018-03-01

Sn-37Pb and Sn-3.0Ag-0.5Cu solder pastes printed onto a board were attached to ball grid array (BGA) samples using Sn-3.0Ag-0.5Cu solder balls. Before thermal shock, the initial grain orientations on the cross-section were obtained by scanning electron microscopy equipped with an electron backscattered diffraction system. Three mixed solder joints (two from the corner and another from the middle of the BGA component) and three lead-free solder joints (at the same positions) were selected to investigate the recrystallization behavior under thermal shock (TS) cycling conditions. All of the mixed and lead-free solder joints were initially single crystal. The results showed that recrystallization occurred in both the mixed and lead-free solder joints after 200 TS. For the mixed solder joints, more recrystallization was observed and the location of samples had a significant influence on their recrystallization behavior, while location was not as important for the lead-free samples after 200 TS in this study. Both the mixed and lead-free solder joints at the corner of BGA components showed the poorest reliability. According to misorientation distribution maps and subgrain rotation behaviors, the reliability of mixed solder joints was much poorer than that of lead-free solder joints.

Direct-soldering 6061 aluminum alloys with ultrasonic coating.

PubMed

Ding, Min; Zhang, Pei-lei; Zhang, Zhen-yu; Yao, Shun

2010-02-01

In this study, the authors applied furnace soldering with ultrasonic coating method to solder 6061 aluminum alloy and investigated the effects of both coating time and soldering temperature on its properties. The following results were obtained: firstly, the solder region mainly composed of four kinds of microstructure zones: rich Sn zone, rich-Pb zone, Sn-Pb eutectic phase and rich Al zone. Meanwhile, the microanalysis identified a continuous reaction product at the alumina-solder interface as a rich-Pb zone. Therefore, the joint strength changed with soldering time and soldering temperature. Secondly, the tensile data had significantly greater variability, with values ranging from 13.99MPa to 24.74MPa. The highest value was obtained for the samples coated with Sn-Pb-Zn alloy for 45s. Fractures occurred along the solder-alumina interface for the 6061 aluminum alloy with its surface including hybrid tough fracture of dimple and tear ridge. The interface could initially strip at the rich Bi zone with the effect of shear stress.

Soldering Technology (4th) Proceedings of Annual Seminar, 20-21 February 1980.

DTIC Science & Technology

1980-02-01

from the data is the time to reach a certain predefined stage in the wetting process. ’Me test is more general than many in that it allows testing of...trace to cross the zero force axis and this was the endpoint used for all Me.scograph wetting time results reportea in this paper. For copper foil...measured on the Surface Tension Balance as the slope of the crace at the zero force axis, shows a fairly large range for each value but still

Laser assisted soldering: microdroplet accumulation with a microjet device.

PubMed

Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

1998-01-01

We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

Effect of Electromigration on the Type of Drop Failure of Sn-3.0Ag-0.5Cu Solder Joints in PBGA Packages

NASA Astrophysics Data System (ADS)

Huang, M. L.; Zhao, N.

2015-10-01

Board-level drop tests of plastic ball grid array (PBGA) packages were performed in accordance with the Joint Electron Devices Engineering Council standard to investigate the effect of electromigration (EM) on the drop reliability of Sn-3.0Ag-0.5Cu solder joints with two substrate surface finishes, organic solderability preservative (OSP) and electroless nickel electroless palladium immersion gold (ENEPIG). In the as-soldered state, drop failures occurred at the substrate sides only, with cracks propagating within the interfacial intermetallic compound (IMC) layer for OSP solder joints and along the IMC/Ni-P interface for ENEPIG solder joints. The drop lifetime of OSP solder joints was approximately twice that of ENEPIG joints. EM had an important effect on crack formation and drop lifetime of the PBGA solder joints. ENEPIG solder joints performed better in drop reliability tests after EM, that is, the drop lifetime of ENEPIG joints decreased by 43% whereas that of OSP solder joints decreased by 91%, compared with the as-soldered cases. The more serious polarity effect, i.e., excessive growth of the interfacial IMC at the anode, was responsible for the sharper decrease in drop lifetime. The different types of drop failure of PBGA solder joints before and after EM, including the position of initiation and the propagation path of cracks, are discussed on the basis of the growth behavior of interfacial IMC.

Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer.

PubMed

Xiao, Yong; Wang, Qiwei; Wang, Ling; Zeng, Xian; Li, Mingyu; Wang, Ziqi; Zhang, Xingyi; Zhu, Xiaomeng

2018-07-01

In this study, Cu alloy joints were fabricated with a Ni-foam reinforced Sn-based composite solder with the assistance of ultrasonic vibration. Effects of ultrasonic soldering time on the microstructure and mechanical properties of Cu/Ni-Sn/Cu joints were investigated. Results showed that exceptional metallurgic bonding could be acquired with the assistance of ultrasonic vibration using a self-developed Ni-foam/Sn composite solder. For joint soldered for 5 s, a (Cu,Ni) 6 Sn 5 intermetallic compound (IMC) layer was formed on the Cu substrate surface, Ni skeletons distributed randomly in the soldering seam and a serrated (Ni,Cu) 3 Sn 4 IMC layer was formed on the Ni skeleton surface. Increasing the soldering time to 20 s, the (Ni,Cu) 3 Sn 4 IMC layer grew significantly and exhibited a loose porous structure on the Ni skeleton surface. Further increase the soldering time to 30 s, Ni skeletons were largely dissolved in the Sn base solder, and micro-sized (Ni,Cu) 3 Sn 4 particles were formed and dispersed homogeneously in the soldering seam. The formation of (Ni,Cu) 3 Sn 4 particles was mainly ascribed to acoustic cavitations induced erosion and grain refining effects. The joint soldered for 30 s exhibited the highest shear strength of 64.9 ± 3.3 MPa, and the shearing failure mainly occurred at the soldering seam/Cu substrate interface. Copyright © 2018 Elsevier B.V. All rights reserved.

Distortion of three-unit implant frameworks during casting, soldering, and simulated porcelain firings.

PubMed

Zervas, P J; Papazoglou, E; Beck, F M; Carr, A B

1999-09-01

The aim of this study was to assess distortion inherent in casting, soldering, and simulated porcelain firings of screw-retained, implant-supported three-unit fixed partial dentures (FPDs). Ten wax patterns were fabricated on a die-stone cast containing two implants, 20 mm apart from center to center. Five specimens were cast in a high-palladium alloy, exposed to simulated porcelain firings, sectioned, and then soldered with low-fusing solder. Five specimens were cast, sectioned, soldered with high-fusing solder, and then exposed to simulated porcelain firings. For each specimen, two horizontal and six vertical distances between appropriately scribed reference points were measured with a traveling microscope. Comparisons were made among the various measurements taken after wax-pattern fabrication, casting, high- and low-fusing soldering, and each porcelain firing. Data were analyzed using a repeated-measures factorial ANOVA (alpha = 0.05). Significant difference was detected in the amount of horizontal distortion during casting (53 +/- 24 microns) and high-fusing soldering (-49 +/- 50 microns), as well as in the amount of horizontal distortion during high-fusing soldering (-49 +/- 50 microns) and low-fusing soldering (17 +/- 26 microns). However, no clinically significant difference was found in the amount of horizontal distortion during casting, low-fusing, and high-fusing soldering. The greatest amount of distortion during the simulated porcelain firings took place during the oxidizing cycle. Soldering did not improve the casting misfit of a three-unit implant-retained FPD model. Metal-ceramic implant frameworks should be oxidized before intraoral fit evaluation.

Ultrasonic-assisted soldering of fine-grained 7034 aluminum alloy using Sn-Zn solders below 300°C.

PubMed

Guo, Weibing; Luan, Tianmin; He, Jingshan; Yan, Jiuchun

2018-01-01

The fine-grained Al alloys prefer to be soldered at as low as temperature to keep their mechanical properties. Solders of Sn-4Zn, Sn-9Zn, and Sn-20Zn alloys were used to solder fine-grained 7034 Al alloy pieces by ultrasonic-assisted soldering below 300°C in air. The joint using Sn-4Zn solder had the highest tensile strength of 201MPa and the fractures occurred in both β-Sn and Sn-Zn eutectic phases. Such joint was much stronger than the 1060 Al joint using Sn-4Zn solder, and its strength had approached the strength of 7034 Al joint using Zn-5Al solder. The strength of the joints using Sn-9Zn and Sn-20Zn solders dropped to∼160MPa due to the appearance of weak interfaces between η-Zn and eutectic phases in the bond layers. All the joints using Sn-Zn solders had very strong interfacial bonding, and alumina interlayers were identified at all the interfaces. Al dissolved in the bond layer reacted with the O rapidly to form alumina interlayers at the interfaces under the ultrasonic action. Zn segregated at the interface and formed strong bonds with both the Al terminated surface of alumina and the bond layer, resulting in strong interfacial bonding between Sn-Zn solders and Al alloys. Copyright © 2017 Elsevier B.V. All rights reserved.

Properties of Sn3.8Ag0.7Cu Solder Alloy with Trace Rare Earth Element Y Additions

NASA Astrophysics Data System (ADS)

Hao, H.; Tian, J.; Shi, Y. W.; Lei, Y. P.; Xia, Z. D.

2007-07-01

In the current research, trace rare earth (RE) element Y was incorporated into a promising lead-free solder, Sn3.8Ag0.7Cu, in an effort to improve the comprehensive properties of Sn3.8Ag0.7Cu solder. The range of Y content in Sn3.8Ag0.7Cu solder alloys varied from 0 wt.% to 1.0 wt.%. As an illustration of the advantage of Y doping, the melting temperature, wettability, mechanical properties, and microstructures of Sn3.8Ag0.7CuY solder were studied. Trace Y additions had little influence on the melting behavior, but the solder showed better wettability and mechanical properties, as well as finer microstructures, than found in Y-free Sn3.8Ag0.7Cu solder. The Sn3.8Ag0.7Cu0.15Y solder alloy exhibited the best comprehensive properties compared to other solders with different Y content. Furthermore, interfacial and microstructural studies were conducted on Sn3.8Ag0.7Cu0.15Y solder alloys, and notable changes in microstructure were found compared to the Y-free alloy. The thickness of an intermetallic compound layer (IML) was decreased during soldering, and the growth of the IML was suppressed during aging. At the same time, the growth of intermetallic compounds (IMCs) inside the solder was reduced. In particular, some bigger IMC plates were replaced by fine, granular IMCs.

Evaluation on the characteristics of tin-silver-bismuth solder

NASA Astrophysics Data System (ADS)

Xia, Z.; Shi, Y.; Chen, Z.

2002-02-01

Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

Die Soldering in Aluminium Die Casting

DOE Office of Scientific and Technical Information (OSTI.GOV)

Han, Q.; Kenik, E.A.; Viswanathan, S.

2000-03-15

Two types of tests, dipping tests and dip-coating tests were carried out on small steel cylinders using pure aluminum and 380 alloy to investigate the mechanism of die soldering during aluminum die casting. Optical and scanning electron microscopy were used to study the morphology and composition of the phases formed during soldering. A soldering mechanism is postulated based on experimental observations. A soldering critical temperature is postulated at which iron begins to react with aluminum to form an aluminum-rich liquid phase and solid intermetallic compounds. When the temperature at the die surface is higher than this critical temperature, the aluminum-richmore » phase is liquid and joins the die with the casting during the subsequent solidification. The paper discusses the mechanism of soldering for the case of pure aluminum and 380 alloy casting in a steel mold, the factors that promote soldering, and the strength of the bond formed when soldering occurs. conditions, an aluminum-rich soldering layer may also form over the intermetallic layer. Although a significant amount of research has been conducted on the nature of these intermetallics, little is known about the conditions under which soldering occurs.« less

Controlling intermetallic compound growth in SnAgCu/Ni-P solder joints by nanosized Cu6Sn5 addition

NASA Astrophysics Data System (ADS)

Kao, Szu-Tsung; Lin, Yung-Chi; Duh, Jenq-Gong

2006-03-01

Nanosized Cu6Sn5 dispersoids were incorporated into Sn and Ag powders and milled together to form Sn-3Ag-0.5Cu composite solders by a mechanical alloying process. The aim of this study was to investigate the interfacial reaction between SnAgCu composite solder and electroless Ni-P/Cu UBM after heating for 15 min. at 240°C. The growth of the IMCs formed at the composite solder/EN interface was retarded as compared to the commercial Sn3Ag0.5Cu solder joints. With the aid of the elemental distribution by x-ray color mapping in electron probe microanalysis (EPMA), it was revealed that the SnAgCu composite solder exhibited a refined structure. It is proposed that the Cu6Sn5 additives were pinned on the grain boundary of Sn after heat treatment, which thus retarded the movement of Cu toward the solder/EN interface to form interfacial compounds. In addition, wetting is an essential prerequisite for soldering to ensure good bonding between solder and substrate. It was demonstrated that the contact angles of composite solder paste was <25°, and good wettability was thus assured.

Aeroflex Technology as Class-Y Demonstrator

NASA Technical Reports Server (NTRS)

Suh, Jong-ook; Agarwal, Shri; Popelar, Scott

2014-01-01

Modern space field programmable gate array (FPGA) devices with increased functional density and operational frequency, such as Xilinx Virtex 4 (V4) and S (V5), are packaged in non-hermetic ceramic flip chip forms. These next generation space parts were not qualified to the MIL-PRF-38535 Qualified Manufacturer Listing (QML) class-V when they were released because class-V was only intended for hermetic parts. In order to bring Xilinx V5 type packages into the QML system, it was suggested that class-Y be set up as a new category. From 2010 through 2014, a JEDEC G12 task group developed screening and qualification requirements for Class-Y products. The Document Standardization Division of the Defense Logistics Agency (DLA) has completed an engineering practice study. In parallel with the class-Y efforts, the NASA Electronic Parts and Packaging (NEPP) program has funded JPL to study potential reliability issues of the class-Y products. The major hurdle of this task was the absence of adequate research samples. Figure 1-1 shows schematic diagrams of typical structures of class-Y type products. Typically, class-Y products are either in ceramic flip chip column grid array (CGA) or land grid array (LGA) form. In class-Y packages, underfill and heat spread adhesive materials are directly exposed to the spacecraft environment due to their non-hermeticity. One of the concerns originally raised was that the underfill material could degrade due to the spacecraft environment and negatively impact the reliability of the package. In order to study such issues, it was necessary to use ceramic daisy chain flip chip package samples so that continuity of flip chip solder bumps could be monitored during the reliability tests. However, none of the commercially available class-Y daisy chain parts had electrical connections through flip chip solder bumps; only solder columns were daisy chained, which made it impossible to test continuity of flip chip solder bumps without using extremely costly functional parts. Among space parts manufacturers who were interested in producing class-Y products, Aeroflex Microelectronic Solutions-HiRel had been developing assembly processes using their internal R&D classy type samples. In early 2012, JPL and Aeroflex initiated a collaboration to study reliability of the Aeroflex technology as a class-Y demonstrator.

Effect of Embedding Cu-Graphene Hybrid Powder into 2-Phase In-Cu Solders on Its Suitability as Metallic Thermal Interface Material

NASA Astrophysics Data System (ADS)

Sharma, Deepak; Jain, Aman; Somaiah, Nalla; Narayanan, P. Ramesh; Kumar, Praveen

2018-05-01

The effect of embedding Cu-graphene hybrid powder, namely "graphene nano-sheet Cu" (GNS-Cu) powder, into In-40 vol.% Cu solder alloy on the electrical and mechanical properties of In-Cu solder is investigated. GNS-Cu hybrid powders were prepared by mixing reduced graphene oxide powders and CuSO4·5H2O, followed by reduction of the mixture with hydrazine. Subsequently, In-Cu solders with GNS-Cu powders were prepared using a 2-step process, comprising liquid phase sintering (LPS) of In and Cu powders followed by accumulative roll bonding (ARB). During ARB, the GNS-Cu powders were embedded as distinct layers into In-Cu composite solders. Electrical conductivity of the GNS-Cu embedded solders increased by > 20% as compared to pure In-Cu solders processed through the same combination of LPS-ARB steps. The yield strength of In-Cu solder increased by only 10% with the addition of GNS-Cu powders and thus retained the moderate strength often associated with pure In-Cu composite solders. Moreover, the thermal conductivity of GNS-Cu-embedded solders was estimated theoretically to increase by > 60%. These promising findings suggest that GNS-Cu-embedded In-Cu solders can be suitable for next-generation metallic thermal interface material and package-level interconnect applications.

Soldering of Carbon Materials Using Transition Metal Rich Alloys.

PubMed

Burda, Marek; Lekawa-Raus, Agnieszka; Gruszczyk, Andrzej; Koziol, Krzysztof K K

2015-08-25

Joining of carbon materials via soldering has not been possible up to now due to lack of wetting of carbons by metals at standard soldering temperatures. This issue has been a severely restricting factor for many potential electrical/electronic and mechanical applications of nanostructured and conventional carbon materials. Here we demonstrate the formation of alloys that enable soldering of these structures. By addition of several percent (2.5-5%) of transition metal such as chromium or nickel to a standard lead-free soldering tin based alloy we obtained a solder that can be applied using a commercial soldering iron at typical soldering temperatures of approximately 350 °C and at ambient conditions. The use of this solder enables the formation of mechanically strong and electrically conductive joints between carbon materials and, when supported by a simple two-step technique, can successfully bond carbon structures to any metal terminal. It has been shown using optical and scanning electron microscope images as well as X-ray diffraction patterns and energy dispersive X-ray mapping that the successful formation of carbon-solder bonds is possible, first, thanks to the uniform nonreactive dispersion of transition metals in the tin-based matrix. Further, during the soldering process, these free elements diffuse into the carbon-alloy border with no formation of brazing-like carbides, which would damage the surface of the carbon materials.

ECM soldering technologies for small businesses. Final report/project accomplishments summary, project number 93-KCPP-015-E1

DOE Office of Scientific and Technical Information (OSTI.GOV)

Becka, G.A.

1997-03-01

The purpose of this outreach project was to demonstrate, transfer, and educate multiple small and medium-sized US firms in the methodology and technology of environmentally conscious manufacturing soldering techniques. Consultation on replacement solvents for ozone-depleting chemicals, low residue/no clean soldering, and lead-free solder alloys were examples of available FM and T expertise. Depending upon the needs, materials engineering or process engineering help was made available under the program. Requesting businesses could obtain up to 250 hours of assistance from AlliedSignal FM and T on these efforts. The participating companies mainly requested assistance with their immediate needs. Examples of assistance providedmore » included specialized training for their particular product line. FM and T Solder Certification School has an excellent reputation and responded with solder training and help with course outlines for the requesters. One company reported problems soldering certain components. FM and T evaluations determined that the company was received components with solderability levels that did not meet specification rather than experiencing a soldering process problem. Other companies received assistance in incorporating lead-free soldering materials into their production lines and development assistance with fluxless soldering processes. The project was terminated when it was determined that this need could be served by FM and T`s current Technical Assistance Program.« less

Solder for oxide layer-building metals and alloys

DOEpatents

Kronberg, James W.

1992-01-01

A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel. The comosition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than aproximatley 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300.degree. C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.

Solder for oxide layer-building metals and alloys

DOEpatents

Kronberg, J.W.

1992-09-15

A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel is disclosed. The composition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than approximately 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300 C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.

Multi-objective optimization on laser solder jet bonding process in head gimbal assembly using the response surface methodology

NASA Astrophysics Data System (ADS)

Deeying, J.; Asawarungsaengkul, K.; Chutima, P.

2018-01-01

This paper aims to investigate the effect of laser solder jet bonding parameters to the solder joints in Head Gimbal Assembly. Laser solder jet bonding utilizes the fiber laser to melt solder ball in capillary. The molten solder is transferred to two bonding pads by nitrogen gas. The response surface methodology have been used to investigate the effects of laser energy, wait time, nitrogen gas pressure, and focal position on the shear strength of solder joints and the change of pitch static attitude (PSA). The response surface methodology is employed to establish the reliable mathematical relationships between the laser soldering parameters and desired responses. Then, multi-objective optimization is conducted to determine the optimal process parameters that can enhance the joint shear strength and minimize the change of PSA. The validation test confirms that the predicted value has good agreement with the actual value.

Anand constitutive model of lead-free solder joints in 3D IC device

NASA Astrophysics Data System (ADS)

Zhang, Liang; Liu, Zhi-quan; Ji, Yu-tong

2016-08-01

Anand constitutive relation of SnAgCu and SnAgCu-nano Al solders were studied under uniaxial tension, and the constitutive model was used in the finite element simulation to analyze the stress-strain response of lead-free solder joints in 3D IC devices. The results showed that the nine parameters of the Anand model can be determined from separated constitutive relations and experimental results. Based on Anand model, the finite element method was selected to calculate the stress-strain response of lead-free solder joints, it was found that in the 3D IC device the maximum stress-strain concentrated in the concern solder joints, the stress-strain of SnAgCu-nano Al solder joints was lower than that of SnAgCu solder joints, which represented that the addition of nano Al particles can enhance the reliability of lead-free solder joints in 3D IC devices.

Fixture facilitates soldering operations

NASA Technical Reports Server (NTRS)

White, C. M.

1968-01-01

Soldering fixture, designed for printed circuit cards, is a basic bench-mounted, self-contained integral unit combining all soldering needs into a compact, readily available work station. All tools, materials, and accessories are available to provide an ideal station to perform critical soldering.

Preparing Solar Cells for Soldering

NASA Technical Reports Server (NTRS)

Hagerty, J. J.

1983-01-01

Solder paste and contact ribbon dispensed in synchronism. Solder-paste dispenser operates on one cell at a time. Ribbon fed up ramps and into positioned while solder paste is applied. When ramps are moved out of way, ribbon lies down onto cell.

40 CFR 438.2 - General definitions.

Code of Federal Regulations, 2013 CFR

2013-07-01

... chemical conversion coating operations. (d) Metal-bearing operations means one or more of the following... descaling; shot tower—lead shot manufacturing; soldering; solder flux cleaning; solder fusing; solder...) Oily operations means one or more of the following: abrasive blasting; adhesive bonding; alkaline...

40 CFR 438.2 - General definitions.

Code of Federal Regulations, 2010 CFR

2010-07-01

... conversion coating operations. (d) Metal-bearing operations means one or more of the following: abrasive jet... descaling; shot tower—lead shot manufacturing; soldering; solder flux cleaning; solder fusing; solder...) Oily operations means one or more of the following: abrasive blasting; adhesive bonding; alkaline...

40 CFR 438.2 - General definitions.

Code of Federal Regulations, 2012 CFR

2012-07-01

... chemical conversion coating operations. (d) Metal-bearing operations means one or more of the following... descaling; shot tower—lead shot manufacturing; soldering; solder flux cleaning; solder fusing; solder...) Oily operations means one or more of the following: abrasive blasting; adhesive bonding; alkaline...

40 CFR 438.2 - General definitions.

Code of Federal Regulations, 2011 CFR

2011-07-01

... conversion coating operations. (d) Metal-bearing operations means one or more of the following: abrasive jet... descaling; shot tower—lead shot manufacturing; soldering; solder flux cleaning; solder fusing; solder...) Oily operations means one or more of the following: abrasive blasting; adhesive bonding; alkaline...

40 CFR 438.2 - General definitions.

Code of Federal Regulations, 2014 CFR

2014-07-01

... chemical conversion coating operations. (d) Metal-bearing operations means one or more of the following... descaling; shot tower—lead shot manufacturing; soldering; solder flux cleaning; solder fusing; solder...) Oily operations means one or more of the following: abrasive blasting; adhesive bonding; alkaline...

Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

NASA Astrophysics Data System (ADS)

Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

2004-04-01

Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation

NASA Astrophysics Data System (ADS)

Chawla, N.; Shen, Y.-L.; Deng, X.; Ege, E. S.

2004-12-01

The lap-shear technique is commonly used to evaluate the shear, creep, and thermal fatigue behavior of solder joints. We have conducted a parametric experimental and modeling study, on the effect of testing and geometrical parameters on solder/copper joint response in lap-shear. It was shown that the farfield applied strain is quite different from the actual solder strain (measured optically). Subtraction of the deformation of the Cu substrate provides a reasonable approximation of the solder strain in the elastic regime, but not in the plastic regime. Solder joint thickness has a profound effect on joint response. The solder response moves progressively closer to “true” shear response with increasing joint thickness. Numerical modeling using finite-element analyses were performed to rationalize the experimental findings. The same lap-shear configuration was used in the simulation. The input response for solder was based on the experimental tensile test result on bulk specimens. The calculated shear response, using both the commonly adopted far-field measure and the actual shear strain in solder, was found to be consistent with the trends observed in the lap-shear experiments. The geometric features were further explored to provide physical insight into the problem. Deformation of the substrate was found to greatly influence the shear behavior of the solder.

Soldering Tested in Reduced Gravity

NASA Technical Reports Server (NTRS)

Struk, Peter M.; Pettegrew, Richard D.; Watson, J. Kevin; Down, Robert S.; Haylett, Daniel R.

2005-01-01

Whether used occasionally for contingency repair or routinely in nominal repair operations, soldering will become increasingly important to the success of future long-duration human space missions. As a result, it will be critical to have a thorough understanding of the service characteristics of solder joints produced in reduced-gravity environments. The National Center for Space Exploration Research (via the Research for Design program), the NASA Glenn Research Center, and the NASA Johnson Space Center are conducting an experimental program to explore the influence of reduced gravity environments on the soldering process. Solder joint characteristics that are being considered include solder fillet geometry, porosity, and microstructural features. Both through-hole (see the drawing and image on the preceding figure) and surface-mounted devices are being investigated. This effort (the low-gravity portion being conducted on NASA s KC-135 research aircraft) uses the soldering hardware currently available on the International Space Station. The experiment involves manual soldering by a contingent of test operators, including both highly skilled technicians and less skilled individuals to provide a skill mix that might be encountered in space mission crews. The experiment uses both flux-cored solder and solid-core solder with an externally applied flux. Other experimental parameters include the type of flux, gravitational level (nominally zero,

Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder

PubMed Central

Yang, Fan; Zhang, Liang; Liu, Zhi-quan; Zhong, Su Juan; Ma, Jia; Bao, Li

2017-01-01

With the purpose of improving the properties of the Sn-58Bi lead-free solder, micro-CuZnAl particles ranging from 0 to 0.4 wt % were added into the low temperature eutectic Sn-58Bi lead-free solder. After the experimental testing of micro-CuZnAl particles on the properties and microstructure of the Sn-58Bi solders, it was found that the wettability of the Sn-58Bi solders was obviously improved with addition of CuZnAl particles. When the addition of CuZnAl particles was 0.2 wt %, the wettability of the Sn-58Bi solder performed best. At the same time, excessive addition of CuZnAl particles led to poor wettability. However, the results showed that CuZnAl particles changed the melting point of the Sn-58Bi solder slightly. The microstructure of the Sn-58Bi solder was refined by adding CuZnAl particles. When the content of CuZnAl addition was between 0.1 and 0.2 wt %, the refinement was great. In addition, the interfacial IMC layer between new composite solder and Cu substrate was thinner than that between the Sn-58Bi solder and Cu substrate. PMID:28772917

Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock

NASA Astrophysics Data System (ADS)

Han, Jing; Tan, Shihai; Guo, Fu

2018-01-01

Ball grid array (BGA) samples were soldered on a printed circuit board with Sn37Pb solder paste to investigate the recrystallization induced by subgrain rotation during thermal shock. The composition of the solder balls was Sn3.0Ag0.5Cu-Sn37Pb, which comprised mixed solder joints. The BGA component was cross-sectioned before thermal shock. The microstructure and grain orientations were obtained by a scanning electron microscope equipped with an electron back-scattered diffraction system. Two mixed solder joints at corners of the BGA component were selected as the subjects. The results showed that recrystallization occurred at the corner of the solder joints after 200 thermal shock cycles. The recrystallized subgrains had various new grain orientations. The newly generated grain orientations were closely related to the initial grain orientations, which indicated that different subgrain rotation behaviors could occur in one mixed solder joint with the same initial grain orientation. When the misorientation angles were very small, the rotation axes were about Sn [100], [010] and [001], as shown by analyzing the misorientation angles and subgrain rotation axes, while the subgrain rotation behavior with large misorientation angles in the solder joints was much more complicated. As Pb was contained in the solder joints and the stress was concentrated on the corner of the mixed solder joints, concaves and cracks were formed. When the adjacent recrystallized subgrains were separated, and the process of the continuous recrystallization was limited.

Multi-lead heat sink

DOEpatents

Roose, L.D.

1984-07-03

The disclosure relates to a heat sink used to protect integrated circuits from the heat resulting from soldering them to circuit boards. A tubular housing contains a slidable member which engages somewhat inwardly extending connecting rods, each of which is rotatably attached at one end to the bottom of the housing. The other end of each rod is fastened to an expandable coil spring loop. As the member is pushed downward in the housing, its bottom edge engages and forces outward the connecting rods, thereby expanding the spring so that it will fit over an integrated circuit. After the device is in place, the member is slid upward and the spring contracts about the leads of the integrated circuit. Soldering is now conducted and the spring absorbs excess heat therefrom to protect the integrated circuit. The placement steps are repeated in reverse order to remove the heat sink for use again. 4 figs.

Multi-lead heat sink

DOEpatents

Roose, Lars D.

1984-01-01

The disclosure relates to a heat sink used to protect integrated circuits from the heat resulting from soldering them to circuit boards. A tubular housing contains a slidable member which engages somewhat inwardly extending connecting rods, each of which is rotatably attached at one end to the bottom of the housing. The other end of each rod is fastened to an expandable coil spring loop. As the member is pushed downward in the housing, its bottom edge engages and forces outward the connecting rods, thereby expanding the spring so that it will fit over an integrated circuit. After the device is in place, the member is slid upward and the spring contracts about the leads of the integrated circuit. Soldering is now conducted and the spring absorbs excess heat therefrom to protect the integrated circuit. The placement steps are repeated in reverse order to remove the heat sink for use again.

Multi-lead heat sink

DOEpatents

Roose, L.D.

1982-08-25

The disclosure relates to a heat sink used to protect integrated circuits from the heat resulting from soldering them to circuit boards. A tubular housing contains a slidable member which engages somewhat inwardly extending connecting rods, each of which is rotatably attached at one end to the bottom of the housing. The other end of each rod is fastened to an expandable coil spring loop. As the member is pushed downward in the housing, its bottom edge engages and forces outward the connecting rods, thereby expanding the spring so that it will fit over an integrated circuit. After the device is in place, the member is slid upward and the spring contracts about the leads of the integrated circuit. Soldering is now conducted and the spring absorbs excess heat therefrom to protect the integrated circuit. The placement steps are repeated in reverse order to remove the heat sink for use again.

Nanoshell assisted laser soldering of vascular tissue.

PubMed

Schöni, Daniel S; Bogni, Serge; Bregy, Amadé; Wirth, Amina; Raabe, Andreas; Vajtai, Istvan; Pieles, Uwe; Reinert, Michael; Frenz, Martin

2011-12-01

Laser tissue soldering (LTS) is a promising technique for tissue fusion but is limited by the lack of reproducibility particularly when the amount of indocyanine green (ICG) applied as energy absorber cannot be controlled during the soldering procedure. Nanotechnology enables the control over the quantitative binding of the ICG. The aim of this study was to establish a highly reproducible and strong tissue fusion using ICG packed nanoshells. By including the chromophore in the soldering scaffold, dilution of the energy absorber during the soldering procedure is prevented. The feasibility of this novel nanoshell soldering technique was studied by assessing the local heating of the area and tensile strength of the resulting fused tissue. Nanoshells with a diameter of 250-270 nm were loaded with ICG and included in a porous polycaprolactone (PCL) scaffold doped with albumin solder. The nanoshell scaffold was used in a flexible, semi-dry formulation suitable for surgical use. Heat development, tensile strength as well as tissue damage were assessed. Rabbit aortic arteries were successfully soldered using an ICG packed nanoshell scaffold. Tensile strengths of these nanoshell soldered anastomoses were found to be 734 ± 327 mN (median = 640 mN). Thermal damage was restricted to the adventitia at the irradiated area. In addition, absorber dilution was prevented during the soldering procedure resulting in significantly lower variance in maximum temperature (P = 0.03) compared to the classical liquid ICG soldering technique. Using nanoshells, controlled amounts of chromophore could successfully be bound into the polymer scaffold. Diode laser soldering of vascular tissue using ICG-nanoshell scaffolds leads to strong and reproducible tissue fusion. With optimally chosen settings of irradiation time, nanoshells coating and scaffold properties, our improved LTS procedure demonstrates the potential for a clinically applicable anastomosis technique. Copyright © 2011 Wiley Periodicals, Inc.

Effect of Sn-Ag-Cu on the Improvement of Electromigration Behavior in Sn-58Bi Solder Joint

NASA Astrophysics Data System (ADS)

Wang, Fengjiang; Zhou, Lili; Zhang, Zhijie; Wang, Jiheng; Wang, Xiaojing; Wu, Mingfang

2017-10-01

Reliability issues caused by the formation of a Bi-rich layer at the anode interface usually occurs in the Sn-58Bi eutectic solder joint during electromigration (EM). To improve the EM performance of a Sn-58Bi solder joint, Sn-3.0Ag-0.5Cu solder was introduced into it to produce SnBi-SnAgCu structural or compositional composite joints, and their EM behaviors were investigated with the current density of 1.0 × 104 A/cm2 for different stressing times. The structure of the compositional composite solder joint was obtained by the occurrence of partial or full mixing between Sn-Bi and Sn-Ag-Cu solder with a suitable soldering temperature. In the structural composite joint, melted Sn-Bi was partially mixed with Sn-Ag-Cu solder to produce a Cu/Sn-Bi/Sn-Ag-Cu/Sn-Bi/Cu structure. In the compositional composite joint, full melting and mixing between these two solders occurred to produce a Cu/Sn-Ag-Cu-Bi/Cu structure, in which the solder matrix was a homogeneous structure including Sn, Bi phases, Cu6Sn5 and Ag3Sn IMCs. After current stressing, the EM performance of Sn-Bi solder was obviously improved with the structural or the compositional composite joint. In Sn-58Bi joints, a thick Bi-rich layer was easily produced at the anode interface, and obviously increased with stressing time. However, after current stressing on the structural composite joints, the existence of s Sn-3.0Ag-0.5Cu interlayer between the two Sn-58Bi solders effectively acted as a diffusion barrier and significantly slowed the formation of the Bi-rich layer at the anode side and the IMC thicknesses at the interfaces.

Thermal and Microstructure Characterization of Zn-Al-Si Alloys and Chemical Reaction with Cu Substrate During Spreading

NASA Astrophysics Data System (ADS)

Berent, Katarzyna; Pstruś, Janusz; Gancarz, Tomasz

2016-08-01

The problems associated with the corrosion of aluminum connections, the low mechanical properties of Al/Cu connections, and the introduction of EU directives have forced the potential of new materials to be investigated. Alloys based on eutectic Zn-Al are proposed, because they have a higher melting temperature (381 °C), good corrosion resistance, and high mechanical strength. The Zn-Al-Si cast alloys were characterized using differential scanning calorimetry (DSC) measurements, which were performed to determine the melting temperatures of the alloys. Thermal linear expansion and electrical resistivity measurements were performed at temperature ranges of -50 to 250 °C and 25 to 300 °C, respectively. The addition of Si to eutectic Zn-Al alloys not only limits the growth of phases at the interface of liquid solder and Cu substrate but also raises the mechanical properties of the solder. Spreading test on Cu substrate using eutectic Zn-Al alloys with 0.5, 1.0, 3.0, and 5.0 wt.% of Si was studied using the sessile drop method in the presence of QJ201 flux. Spreading tests were performed with contact times of 1, 8, 15, 30, and 60 min, and at temperatures of 475, 500, 525, and 550 °C. After cleaning the flux residue from solidified samples, the spreadability of Zn-Al-Si on Cu was determined. Selected, solidified solder/substrate couples were cross-sectioned, and the interfacial microstructures were studied using scanning electron microscopy and energy dispersive x-ray spectroscopy. The growth of the intermetallic phase layer was studied at the solder/substrate interface, and the activation energy of growth of Cu5Zn8, CuZn4, and CuZn phases were determined.

Inspection criteria ensure quality control of parallel gap soldering

NASA Technical Reports Server (NTRS)

Burka, J. A.

1968-01-01

Investigation of parallel gap soldering of electrical leads resulted in recommendation on material preparation, equipment, process control, and visual inspection criteria to ensure reliable solder joints. The recommendations will minimize problems in heat-dwell time, amount of solder, bridging conductors, and damage of circuitry.

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

PubMed Central

Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

2015-01-01

Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. PMID:27877786

Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer

NASA Astrophysics Data System (ADS)

Liu, C. Y.; Li, Jian; Vandentop, G. J.; Choi, W. J.; Tu, K. N.

2001-05-01

The wetting behavior of SnAg based Pb-free solders on Cu and Cu substrates plated with Au, Pd, and Au/Pd thin films have been studied. The wetting angle and kinetics of interfacial reaction were measured. The Au-plated substrates exhibit better wetting than the Pd-plated substrates. In the case of SnAg on Pd-plated Cu, SEM observation revealed that the solder cap was surrounded by an innerring of Cu-Sn compound and an outer ring of Pd-Sn compound. This implies that the molten SnAg solder had removed the Pd and wetted the Cu directly in the equilibrium state. The effects of pre-doping Cu in the SnAg solder on wetting behavior were also investigated. We found that wettability decreases with increasing Cu content in the solder. We also observed that the SnAgCu solders have a lower Cu consumption rate than the SnAg solder.

Imaging and Analysis of Void-defects in Solder Joints Formed in Reduced Gravity using High-Resolution Computed Tomography

NASA Technical Reports Server (NTRS)

Easton, John W.; Struk, Peter M.; Rotella, Anthony

2008-01-01

As a part of efforts to develop an electronics repair capability for long duration space missions, techniques and materials for soldering components on a circuit board in reduced gravity must be developed. This paper presents results from testing solder joint formation in low gravity on a NASA Reduced Gravity Research Aircraft. The results presented include joints formed using eutectic tin-lead solder and one of the following fluxes: (1) a no-clean flux core, (2) a rosin flux core, and (3) a solid solder wire with external liquid no-clean flux. The solder joints are analyzed with a computed tomography (CT) technique which imaged the interior of the entire solder joint. This replaced an earlier technique that required the solder joint to be destructively ground down revealing a single plane which was subsequently analyzed. The CT analysis technique is described and results presented with implications for future testing as well as implications for the overall electronics repair effort discussed.

Lead-free solder

DOEpatents

Anderson, Iver E.; Terpstra, Robert L.

2001-05-15

A Sn--Ag--Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn--Ag--Cu eutectic solder alloy based on the ternary eutectic Sn--4.7%Ag--1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.

An Accelerated Method for Testing Soldering Tendency of Core Pins

DOE Office of Scientific and Technical Information (OSTI.GOV)

Han, Qingyou; Xu, Hanbing; Ried, Paul

2010-01-01

An accelerated method for testing die soldering has been developed. High intensity ultrasonic vibrations has been used to simulate the die casting conditions such as high pressure and high impingement speed of molten metal on the pin. Soldering tendency of steels and coated pins has been examined. The results indicate that in the low carbon steel/Al system, the onset of soldering is 60 times faster with ultrasonic vibration than that without ultrasonic vibration. In the H13/A380 system, the onset of soldering reaction is accelerated to 30-60 times. Coating significantly reduces the soldering tendency of the core pins.

Diode laser soldering using a lead-free filler material for electronic packaging structures

NASA Astrophysics Data System (ADS)

Chaminade, C.; Fogarassy, E.; Boisselier, D.

2006-04-01

As of today, several lead-free soldering pastes have been qualified for currently used soldering process. Regarding the new potential of laser-assisted soldering processes, the behaviour of the SnAgCu soldering paste requires, however, new investigations. In the first part of this study, the specific temperature profile of a laser soldering process is investigated using a high power diode laser (HPDL). These experimental results are compared to a thermal simulation developed for this specific application. The second part of this work deals with the diffusion of the tin-based filler material through the nickel barrier using the information extracted from the temperature simulations.

Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint

NASA Astrophysics Data System (ADS)

Dele-Afolabi, T. T.; Azmah Hanim, M. A.; Norkhairunnisa, M.; Suraya, M. T.; Yusoff, H. M.

2017-09-01

In this study, the effects of multi-walled carbon nanotubes on the melting temperature and microstructural evolution of the Sn-5Sb/Cu joints are evaluated. Plain and carbon nanotubes (CNTs) reinforced Sn-5Sb solder systems with solder formulations Sn-5Sb, Sn-5Sb-0.01CNT, Sn-5Sb-0.05CNT and Sn-5Sb-0.1CNT were prepared through the powder metallurgy route and thereafter samples were subjected to thermal and microstructural evaluation. As retrieved from the DSC scans, a slight decline in the peak temperature was observed in the composite solders which is indicative of the CNTs role in exciting surface instability in the host Sn matrix. In order to prepare the solder joints and analyze the interfacial intermetallic compound (IMC) evolution, respective solder systems were placed on copper (Cu) substrate and subjected to both reflow soldering and isothermal aging (170°C) conditions. From the IMC thickness result, considerable retardation in the IMC layer growth was observed in the CNTs reinforced solder joints, especially the 0.05wt.% CNTs solder system owing to the inhibition of Sn atoms diffusion by reinforcement material.

Laser-activated protein solder for peripheral nerve repair

NASA Astrophysics Data System (ADS)

Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

1995-05-01

A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

Effect of the Angle Between Sn Grain c-Axis and Electron Flow Direction on Cu-Reinforced Composite Solder Joints Under Current Stressing

NASA Astrophysics Data System (ADS)

Wang, Yan; Han, Jing; Wang, Yishu; Ma, Limin; Guo, Fu

2018-01-01

With a body-centered tetragonal crystal structure, Sn grains were demonstrated to have highly anisotropic behaviors in various properties. The electromigration behavior of lead-free solder was impacted by the grain orientations. In this paper, the angle between the c-axis and the electron flow direction in composite solder joints (angle θ) was proven to be an important factor during electromigration. The effects of angle θ on the electromigration of composite solder joints were investigated in this paper. Cu particle-reinforced Sn3.5Ag solder joints were stressed under a current density of 104 A/cm2 at room temperature. After 336 h current stressing time, different electromigration phenomena occurred at the two sides of the grain boundary in the composite solder joint which contained two Sn grains with different angle θ. The Sn grains with the larger angle θ had a smaller growth rate of Cu6Sn5. In addition, a composite solder joint with a single Sn grain was set as the contrast and its angle θ was smaller than that of the composite solder joint with two Sn grains. The growth rate of Cu6Sn5 in the composite solder joint with a single grain was faster than that of the composite solder joint with two Sn grains.

Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits

NASA Technical Reports Server (NTRS)

Mandal, R. P.

1976-01-01

Technology for interconnecting monolithic integrated circuit chips with other components is investigated. The advantages and disadvantages of the current flip-chip approach as compared to other interconnection methods are outlined. A fluxless solder-bump contact technology is evaluated. Multiple solder-bump contacts were formed on silicon integrated circuit chips. The solder-bumps, comprised of a rigid nickel under layer and a compliant solder overlayer, were electroformed onto gold device pads with the aid of thick dry film photomasks. Different solder alloys and the use of conductive epoxy for bonding were explored. Fluxless solder-bump bond quality and reliability were evaluated by measuring the effects of centrifuge, thermal cycling, and high temperature storage on bond visual characteristics, bond electrical continuity, and bond shear tests. The applicability and suitability of this technology for hybrid microelectronic packaging is discussed.

30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

Heat Lamps Solder Solar Array Quickly

NASA Technical Reports Server (NTRS)

Coyle, P. J.; Crouthamel, M. S.

1982-01-01

Interconnection tabs in a nine-solar-cell array have been soldered simultaneously with radiant heat. Cells and tabs are held in position for soldering by sandwiching them between compliant silicone-rubber vacuum platen and transparent polyimide sealing membrane. Heat lamps warm cells, producing smooth, flat solder joints of high quality.

Testing of printed circuit board solder joints by optical correlation

NASA Technical Reports Server (NTRS)

Espy, P. N.

1975-01-01

An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

Code of Federal Regulations, 2014 CFR

2014-07-01

... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

Capacitor Test, Evaluation. and Modeling Within NASA Electronic Parts and Packaging (NEPP) Program. "Why Ceramic Capacitors Fracture During Manual Soldering and How to Avoid Failures"

NASA Technical Reports Server (NTRS)

Teverovsky, Alexander

2011-01-01

Presentation discusses: (1) Why Multi-Layer Ceramic Capacitors(MLCCs) crack during manual soldering? Workmanship and parts issues. (2) Do existing qualification requirements assure crack-free soldering? MIL-spec Thermal Shock (TS) testing. MIL-spec Resistance to Soldering Heat (RSH) test. (3) What test can assure reliable soldering? Mechanical characteristics of ceramics. Comparison of three TS techniques: LND, TSD, and IWT. (4) Simulation of TS conditions.

Solderability of pre-tinned Cu sheet

NASA Astrophysics Data System (ADS)

Sunwoo, A. J.; Morris, J. W.; Lucey, G. K.

1992-05-01

The reliability and integrity of pre-tinned copper-clad printed circuit (PC) boards are serious concerns in the manufacture of electronic devices. The factors that influence the wetting during soldering of Cu are discussed. The results suggest that pre-tinning with a Pb-rich solder, such as 95Pb-5Sn, is preferred to pre-tinning with eutectic solder, since the latter can develop exposed intermetallics during aging that wet poorly. The results also confirm that the use of flux leads to carbon contamination in the solder.

Aspects of the structural evolution of lead-free solder joints

NASA Astrophysics Data System (ADS)

Zribi, A.; Kinyanjui, R.; Borgesen, P.; Zavalij, L.; Cotts, E. J.

2002-06-01

Studies of the formation of intermetallic compounds at some lead-free solder/metallization interfaces are briefly reviewed in this article. SnAgCu/Ni and SnAgCu/Cu interfaces are examined in particular. It has been found that (Cu,Ni)6Sn5 forms at SnAgCu/Ni interfaces until copper is depleted from the solder matrix. This article also contrasts the formation of (Au,Ni)Sn4 and related compounds in PbSn/Ni solder joints and lead-free solder joints.

Laparoscopic laser soldering for repair of ureteropelvic junction obstruction in the porcine model.

PubMed

Shumalinsky, Dmitry; Lobik, Leonid; Cytron, Shmuel; Halpern, Marisa; Vasilyev, Tamar; Ravid, Avi; Katzir, Abraham

2004-03-01

Laparoscopic pyeloplasty is used for the repair of ureteropelvic junction (UPJ) obstruction. Our objective was to introduce laser soldering to this procedure. We developed a system based on a CO2 laser, an infrared detector, and two infrared transmitting optical fibers to obtain temperature-controlled laser soldering of cuts in tissues. The system was used for laparoscopic soldering of incisions in the kidneys of pigs. We carried out laparoscopic pyeloplasty successfully in a porcine model using fiberoptic laser soldering. Laparoscopic laser soldering was found to be faster than suturing. It was easier to use and provided watertight bonding. This technique will be useful in pyeloplasty as well as other laparoscopic surgical procedures.

Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

PubMed

Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

2010-09-15

As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH < 2.5 and chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

Modeling the Rate-Dependent Durability of Reduced-Ag SAC Interconnects for Area Array Packages Under Torsion Loads

NASA Astrophysics Data System (ADS)

Srinivas, Vikram; Menon, Sandeep; Osterman, Michael; Pecht, Michael G.

2013-08-01

Solder durability models frequently focus on the applied strain range; however, the rate of applied loading, or strain rate, is also important. In this study, an approach to incorporate strain rate dependency into durability estimation for solder interconnects is examined. Failure data were collected for SAC105 solder ball grid arrays assembled with SAC305 solder that were subjected to displacement-controlled torsion loads. Strain-rate-dependent (Johnson-Cook model) and strain-rate-independent elastic-plastic properties were used to model the solders in finite-element simulation. Test data were then used to extract damage model constants for the reduced-Ag SAC solder. A generalized Coffin-Manson damage model was used to estimate the durability. The mechanical fatigue durability curve for reduced-silver SAC solder was generated and compared with durability curves for SAC305 and Sn-Pb from the literature.

Laser Inspection Or Soldered Connections

NASA Astrophysics Data System (ADS)

Alper, Richard I.; Traub, Alan C.

1986-07-01

A sensitive infrared detection system monitors the slight warming and cooling of a solder joint on a PWB in response to a focused laser beam pulse lasting for 30 milliseconds. Heating and cooling rates depend on the surface finish of the solder and also upon its interr.1 features. Joints which are alike show similar heating rates; defects behave differently and are flagged as showing abnormal thermal signatures Defects include surface voids, cold solder, insufficient or missing solder, residual solder flux, contamination and large subsurface voids. Solder bridges can usually be found by targeting at suspected bridge locations. Feed-through joints at DIPs and lap joints at flat-pack ICs are readily inspected by this method. By use of computer-controlled tiltable optics, access is had to the "harder to see" joints such as at leadless chip carriers and other surface mounts. Inspection rates can be up to 10 joints per second.

Composition of low-strength solder joints in solar-concentrator-cell arrays

NASA Astrophysics Data System (ADS)

Chamberlain, M. B.; Nordstrom, T. V.

Bond strengths of Cu strips soldered to the backside metallization of solar concentrator cells were found to be unacceptably low. To determine whether contaminants in the cell metallization caused these low strengths, unsoldered cells and soldered cells were characterized by scanning Auger microscopy. The backside metallization consisted of a 5 micrometers Ag conductor layer, a 150 nm Pd diffusion barrier and a 150 nm Ti adhesion layer next to an Al ohmic contact layer on the Si cell. The analysis showed that the Ti layer are partially oxidized during soldering, that Pb from the Pb-5 wt % Sn - 2.5 wt % Ag solder segregated during soldering to the Pd-oxidized Ti interface, and that low strength fractures occurred in this Pb layer at the Pd-oxidized Ti interface. The problem was solved by changing the ambient gas used during soldering from N2 to forming gas (80% N2 + 20% H2).

30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

Code of Federal Regulations, 2014 CFR

2014-07-01

... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

The failure analysis and lifetime prediction for the solder joint of the magnetic head

NASA Astrophysics Data System (ADS)

Xiao, Xianghui; Peng, Minfang; Cardoso, Jaime S.; Tang, Rongjun; Zhou, YingLiang

2015-02-01

Micro-solder joint (MSJ) lifetime prediction methodology and failure analysis (FA) are to assess reliability by fatigue model with a series of theoretical calculations, numerical simulation and experimental method. Due to shortened time of solder joints on high-temperature, high-frequency sampling error that is not allowed in productions may exist in various models, including round-off error. Combining intermetallic compound (IMC) growth theory and the FA technology for the magnetic head in actual production, this thesis puts forward a new growth model to predict life expectancy for solder joint of the magnetic head. And the impact of IMC, generating from interface reaction between slider (magnetic head, usually be called slider) and bonding pad, on mechanical performance during aging process is analyzed in it. By further researching on FA of solder ball bonding, thesis chooses AuSn4 growth model that affects least to solder joint mechanical property to indicate that the IMC methodology is suitable to forecast the solder lifetime. And the diffusion constant under work condition 60 °C is 0.015354; the solder lifetime t is 14.46 years.

Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

NASA Astrophysics Data System (ADS)

Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

2015-12-01

Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions.

PubMed

Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

2015-01-01

Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

New multicomponent solder alloys of low melting pointfor low-cost commercial electronic assembly

NASA Astrophysics Data System (ADS)

Al-Ganainy, G. S.; Sakr, M. S.

2003-09-01

The requirements of the telecommunications, automobile, electronics and aircraft industries for non-toxic solders with melting points close to that of near-eutectic Pb-Sn alloys has led to the development of new Sn-Zn-In solder alloys. Differential thermal analysis (DTA) shows melting points of 198, 195, 190 and 185 +/- 2 °C for the alloys Sn-9Zn, Sn-9Zn-2In, Sn-9Zn-4In and Sn-9Zn-6In, respectively. An equation that fits the data relating the melting point to the In content in the solders is derived. The X-ray diffraction patterns are analyzed to determine the phases that exist in each solder. The stress-strain curves are studied in the temperature range from 90 to 130 °C for all the solders except for those that contain 4 wt% of In, where the temperature range continues to 150 °C. The work-hardening parameters, y (the yield stress), f (the fracture stress), and the parabolic work-hardening coefficient X, increase with increasing indium content in the solders at all working temperatures. They decrease with increasing working temperature for each solder, and show two relaxation stages only for the Sn-9Zn-4In solder around a temperature of 120 °C. (

Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

NASA Astrophysics Data System (ADS)

Sorg, Brian S.; Welch, Ashley J.

2001-05-01

Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

NASA Astrophysics Data System (ADS)

Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

2018-03-01

In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders

NASA Astrophysics Data System (ADS)

Yakymovych, A.; Švec, P.; Orovcik, L.; Bajana, O.; Ipser, H.

2018-01-01

This study investigates the effect of minor additions of Ni, Ni3Sn or Ni3Sn2 nanoparticles on the microstructure and mechanical properties of Cu/solder/Cu joints. The nanocomposite Sn-3.0Ag-0.5Cu (SAC305) solders with 0.5, 1.0 and 2.0 wt.% metallic nanoparticles were prepared through a paste mixing method. The employed Ni and Ni-Sn nanoparticles were produced via a chemical reduction method. The microstructure of as-solidified Cu/solder/Cu joints was studied by x-ray diffraction and scanning electron microscopy. The results showed that additions of Ni and Ni-Sn nanoparticles to the SAC305 solder paste lead initially to a decrease in the average thickness of the intermetallic compound layer in the interface between solder and substrate, while further additions up to 2.0 wt.% did not induce any significant changes. In addition, shear strength and microhardness tests were performed to investigate the relationship between microstructure and mechanical properties of the investigated solder joints. The results indicated an increase in both of these properties which was most significant for the solder joints using SAC305 with 0.5 wt.% Ni or Ni-Sn nanoparticles.

Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering.

PubMed

Tan, Ai Ting; Tan, Ai Wen; Yusof, Farazila

2017-01-01

Techniques to improve solder joint reliability have been the recent research focus in the electronic packaging industry. In this study, Cu/SAC305/Cu solder joints were fabricated using a low-power high-frequency ultrasonic-assisted reflow soldering approach where non-ultrasonic-treated samples were served as control sample. The effect of ultrasonic vibration (USV) time (within 6s) on the solder joint properties was characterized systematically. Results showed that the solder matrix microstructure was refined at 1.5s of USV, but coarsen when the USV time reached 3s and above. The solder matrix hardness increased when the solder matrix was refined, but decreased when the solder matrix coarsened. The interfacial intermetallic compound (IMC) layer thickness was found to decrease with increasing USV time, except for the USV-treated sample with 1.5s. This is attributed to the insufficient USV time during the reflow stage and consequently accelerated the Cu dissolution at the joint interface during the post-ultrasonic reflow stage. All the USV-treated samples possessed higher shear strength than the control sample due to the USV-induced-degassing effect. The shear strength of the USV-treated sample with 6s was the lowest among the USV-treated samples due to the formation of plate-like Ag 3 Sn that may act as the crack initiation site. Copyright © 2016 Elsevier B.V. All rights reserved.

A novel method for direct solder bump pull testing using lead-free solders

NASA Astrophysics Data System (ADS)

Turner, Gregory Alan

This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

PubMed

Lee, Sang-Yeob; Lee, Jong-Hyuk

2010-12-01

The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P < .05). There was no significant difference in ultimate tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

NASA Astrophysics Data System (ADS)

Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

2011-01-01

The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint

PubMed Central

Lee, Sang-Yeob

2010-01-01

PURPOSE The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. MATERIALS AND METHODS Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. RESULTS Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P < .05). CONCLUSION There was no significant difference in ultimate tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm. PMID:21264189

Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

NASA Astrophysics Data System (ADS)

Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

2016-12-01

To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

Albumin-genipin solder for laser tissue repair.

PubMed

Lauto, A; Foster, L J R; Ferris, L; Avolio, A; Zwaneveld, N; Poole-Warren, L A

2004-01-01

Laser tissue soldering (LTS) is an alternative technique to suturing for tissue repair that avoids foreign body reaction and provides immediate sealing of the wound. One of the major drawbacks of LTS, however, is the weak tensile strength of the solder welds when compared to sutures. In this study, a crosslinking agent of low cytotoxicity was investigated for its ability to enhance the bond strength of albumin solders with sheep intestine. Solder strips were welded onto rectangular sections of sheep small intestine using a diode laser. The laser delivered in continuous mode a power of 170 +/- 10 mW at lambda = 808 nm, through a multimode optical fiber (core size = 200 microm) to achieve a dose of 10.8 +/- 0.5 J/mg. The solder thickness and surface area were kept constant throughout the experiment (thickness = 0.15 +/- 0.01 mm, area = 12 +/- 1.2 mm2). The solder was composed of 62% bovine serum albumin (BSA), 0.38% genipin, 0.25% indocyanin green dye (IG), and water. Tissue welding was also performed with a BSA solder without genipin, as a control group. The repaired tissue was tested for tensile strength by a calibrated tensiometer. Murine fibroblasts were also cultured in extracted media from heat-denatured genipin solder to assess cell growth inhibition in a 48 hours period. The tensile strength of the genipin solder was doubled that of the BSA solder (0.21 +/- 0.04 N and 0.11 +/- 0.04 N, respectively; P = 10(-15) unpaired t-test, N = 30). Media extracted from crosslinked genipin solder showed negligible toxicity to fibroblast cells under the culture conditions examined here. Addition of a chemical crosslinking agent, such as genipin, significantly increased the tensile strength of adhesive-tissue bonds. A proposed mechanism for this enhanced bond strength is the synergistic action of mechanical adhesion with chemical crosslinking by genipin.

30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

Efforts to Develop a 300°C Solder

DOE Office of Scientific and Technical Information (OSTI.GOV)

Norann, Randy A

2015-01-25

This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

21 CFR 189.240 - Lead solders.

Code of Federal Regulations, 2014 CFR

2014-04-01

... 21 Food and Drugs 3 2014-04-01 2014-04-01 false Lead solders. 189.240 Section 189.240 Food and...-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in any container that makes use of lead...

21 CFR 189.240 - Lead solders.

Code of Federal Regulations, 2013 CFR

2013-04-01

... 21 Food and Drugs 3 2013-04-01 2013-04-01 false Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in any...

21 CFR 189.240 - Lead solders.

Code of Federal Regulations, 2011 CFR

2011-04-01

... 21 Food and Drugs 3 2011-04-01 2011-04-01 false Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in any...

21 CFR 189.240 - Lead solders.

Code of Federal Regulations, 2012 CFR

2012-04-01

... 21 Food and Drugs 3 2012-04-01 2012-04-01 false Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in any...

21 CFR 189.240 - Lead solders.

Code of Federal Regulations, 2010 CFR

2010-04-01

... 21 Food and Drugs 3 2010-04-01 2009-04-01 true Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in any...

Anomalous creep in Sn-rich solder joints

DOE Office of Scientific and Technical Information (OSTI.GOV)

Song, Ho Geon; Morris Jr., John W.; Hua, Fay

2002-03-15

This paper discusses the creep behavior of example Sn-rich solders that have become candidates for use in Pb-free solder joints. The specific solders discussed are Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-0.7Cu and Sn-10In-3.1Ag, used in thin joints between Cu and Ni-Au metallized pads.

30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

Code of Federal Regulations, 2014 CFR

2014-07-01

... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

Thermo-Mechanical Response of Monolithic and NiTi Shape Memory Alloy Fiber Reinforced Sn-3.8Ag-0.7Cu Solder

DTIC Science & Technology

2005-09-01

novel adaptive Tin-Silver-Copper ( SnAgCu ) solder reinforced with NiTi shape-memory alloy (particles or fiber) developed. An experimental...to meet the demands of miniaturization and enhanced performance in severe environments, a novel adaptive Tin-Silver-Copper ( SnAgCu ) solder...4. Crack region of SnAgCu solder after TMF, from reference [1] ............. 5 Figure 5. Phase diagram of 95.5Sn-3.8Ag-0.7Cu solder, from reference

Ultrasonic Attenuation in Normal and Superconducting Indium.

DTIC Science & Technology

1980-05-22

dimension x space coordinate, dislocation displacement dislocation displacement y space coordinate.1z space coordinate x ACKNOWLEDGMENTS The author...The driving force on the dislocation is given by: F=bO (2.7) In general, the dislocation displacement will be a function of three space coordinates...mm diameter, 50 Q impedance coaxial conductors 47 * made of stainless steel and teflon . The cavity button is soldered * directly to the rigid

Method for making a high current fiber brush collector

NASA Astrophysics Data System (ADS)

Scuro, S. J.

1986-05-01

An axial-type homopolar motor having high density, high current fiber brush collectors affording efficient, low contact resistance and low operating temperatures is discussed. The collectors include a ring of concentric row of brushes in equally spaced beveled holes soldered in place using a fixture for heating the ring to just below the solder melting point at a soldering iron for the local application of additional heat at each brush. Prior to soldering, an oxide film is formed on the surfaces of the brushes and ring, and the bevels are burnished to form a wetting surface. Flux applied with the solder at each bevel removes to an effective soldering depth the oxide film on the brushes and the holes.

Dry soldering with hot filament produced atomic hydrogen

DOEpatents

Panitz, Janda K. G.; Jellison, James L.; Staley, David J.

1995-01-01

A system for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs.

An Accelerated Method for Soldering Testing

DOE Office of Scientific and Technical Information (OSTI.GOV)

Han, Qingyou; Xu, Hanbing; Ried, Paul

2007-01-01

An accelerated method for testing die soldering has been developed. High intensity ultrasonic vibrations have been applied to simulate the die casting conditions such as high pressure and high molten metal velocity on the pin. The soldering tendency of steels and coated pins has been examined. The results suggest that in the low carbon steel/Al system, the onset of soldering is 60 times faster with ultrasonic vibration than that without ultrasonic vibration. In the H13/A380 system, the onset of soldering reaction is accelerated to between 30-60 times. Coatings significantly reduce the soldering tendency. For purposes of this study, several commercialmore » coatings from Balzers demonstrated the potential for increasing the service life of core pins between 15 and 180 times.« less

Soldering Tool for Integrated Circuits

NASA Technical Reports Server (NTRS)

Takahashi, Ted H.

1987-01-01

Many connections soldered simultaneously in confined spaces. Improved soldering tool bonds integrated circuits onto printed-circuit boards. Intended especially for use with so-called "leadless-carrier" integrated circuits.

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

NASA Astrophysics Data System (ADS)

Hammad, A. E.; El-Taher, A. M.

2014-11-01

The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solidified Sn-3.5Ag Lead-Free Solder

NASA Astrophysics Data System (ADS)

Ma, Hai-Tao; Wang, Jie; Qu, Lin; Zhao, Ning; Kunwar, A.

2013-08-01

A rapidly solidified Sn-3.5Ag eutectic alloy produced by the melt-spinning technique was used as a sample in this research to investigate the microstructure, thermal properties, solder wettability, and inhibitory effect of Ag3Sn on Cu6Sn5 intermetallic compound (IMC). In addition, an as-cast Sn-3.5Ag solder was prepared as a reference. Rapidly solidified and as-cast Sn-3.5Ag alloys of the same size were soldered at 250°C for 1 s to observe their instant melting characteristics and for 3 s with different cooling methods to study the inhibitory effect of Ag3Sn on Cu6Sn5 IMC. Experimental techniques such as scanning electron microscopy, differential scanning calorimetry, and energy-dispersive spectrometry were used to observe and analyze the results of the study. It was found that rapidly solidified Sn-3.5Ag solder has more uniform microstructure, better wettability, and higher melting rate as compared with the as-cast material; Ag3Sn nanoparticles that formed in the rapidly solidified Sn-3.5Ag solder inhibited the growth of Cu6Sn5 IMC during aging significantly much strongly than in the as-cast material because their number in the rapidly solidified Sn-3.5Ag solder was greater than in the as-cast material with the same soldering process before aging. Among the various alternative lead-free solders, this study focused on comparison between rapidly solidified and as-cast solder alloys, with the former being observed to have better properties.

Optimal parameters for laser tissue soldering

NASA Astrophysics Data System (ADS)

McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

1998-07-01

Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys

NASA Astrophysics Data System (ADS)

Lis, Adrian; Nakanishi, Kohei; Matsuda, Tomoki; Sano, Tomokazu; Minagawa, Madoka; Okamoto, Masahide; Hirose, Akio

2017-07-01

Solder joints between leads and printed circuit boards in thin small outline packages were produced with conventional Sn1.0Ag0.7Cu (SAC107) and Sn3.0Ag0.7Cu (SAC305) solders as well as various solder alloys with gradually increasing amounts of Bi (up to 3.0 wt.%) and In (up to 1.0 wt.%) within the SAC107 base solder. The reliability of soldered leads in temperature cycle (TC) tests improved most with solder alloys containing both Bi (1.6 wt.%) and In (0.5 wt.%). Microindentation and electron probe microanalysis mappings revealed that the effect originates from a combination of solution and precipitation strengthening of the initial SAC alloy. The distribution of inelastic strain accumulation (ISA), as a measure for degradation, was determined in the solder joints by finite element calculations. It was shown that defects in the solder proximal to the lead (<60-75 μm) strongly impact the reliability and provoke crack initiation around the defect where the highest ISA is located. In particular, similar TC performance can be expected for defect-free joints and for those whose defects exceed the threshold distance from the lead (>60-75 μm), which was underpinned by similar cracking characteristics along the lead-solder interface. The ISA was confirmed to be lower in SAC+Bi/In alloys owing to their enhanced elasto-plastic properties. Moreover, the addition of a thin Cu coating on the leads could improve the joint reliability, as suggested by the calculation of the ISA and the acceleration factor.

Recrystallization Behavior in SAC305 and SAC305 + 3.0POSS Solder Joints Under Thermal Shock

NASA Astrophysics Data System (ADS)

Han, Jing; Gu, Penghao; Ma, Limin; Guo, Fu; Liu, Jianping

2018-04-01

Sn-3.0Ag-0.5Cu (SAC305) and SAC305 + 3.0 polyhedral oligomeric silsesquioxanes (POSS) ball grid array (BGA) assemblies have been prepared, observed, and subjected to thermal shock. The microstructure and grain orientation evolution of the solder joints located at the same position of the package were characterized by scanning electron microscopy and electron backscattering diffraction, respectively. The results showed that the microstructure of the solder joints was refined by addition of POSS particles. In addition, compared with the single-grained or tricrystal joints normally observed in SAC305 BGA solder joints, the frequency of single-grained as-reflowed SAC305 + 3.0POSS BGA joints was greatly reduced, and the solder joints were typically composed of multicrystals with orientations separated by high-angle grain boundaries. These multicrystal joints appear to be obtained by dominant tricrystals or double tricrystals with deviation of the preferred [110] and [1\\bar{1}0] growth directions of Sn dendrites in Sn-Ag-based solder alloys during solidification from the melt. After 928 thermal shock cycles, the SAC305 solder joint had large-area recrystallization and cracks in contrast to the SAC305 + 3.0POSS solder joint located at the same position of the package, indicating that addition of POSS to SAC305 solder joints may contribute to postponement of recrystallization and subsequent crack initiation and propagation along recrystallized grain boundaries by pinning grain boundaries and movement of dislocations. This finding also confirms the double tricrystal solidification twinning nucleation behavior in Pb-free solder joints.

Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

NASA Astrophysics Data System (ADS)

Yakymovych, A.; Plevachuk, Yu.; Švec, P.; Švec, P.; Janičkovič, D.; Šebo, P.; Beronská, N.; Roshanghias, A.; Ipser, H.

2016-12-01

To date, additions of different oxide nanoparticles is one of the most widespread procedures to improve the mechanical properties of metals and metal alloys. This research deals with the effect of minor ceramic nanoparticle additions (SiO2, TiO2 and ZrO2) on the microstructure and mechanical properties of Cu/solder/Cu joints. The reinforced Sn3.0Ag0.5Cu (SAC305) solder alloy with 0.5 wt.% and 1.0 wt.% of ceramic nanoparticles was prepared through mechanically stirring. The microstructure of as-solidified Cu/solder/Cu joints was studied using scanning electron microscopy. The additions of ceramic nanoparticles suppressed the growth of the intermetallic compound layer Cu6Sn5 at the interface solder/Cu and improved the microstructure of the joints. Furthermore, measurements of mechanical properties showed improved shear strength of Cu/composite solder/Cu joints compared to joints with unreinforced solder. This fact related to all investigated ceramic nanoinclusions and should be attributed to the adsorption of nanoparticles on the grain surface during solidification. However, this effect is less pronounced on increasing the nanoinclusion content from 0.5 wt.% to 1.0 wt.% due to agglomeration of nanoparticles. Moreover, a comparison analysis showed that the most beneficial influence was obtained by minor additions of SiO2 nanoparticles into the SAC305 solder alloy.

Dural reconstruction by fascia using a temperature-controlled CO2 laser soldering system

NASA Astrophysics Data System (ADS)

Forer, Boaz; Vasilyev, Tamar; Brosh, Tamar; Kariv, Naam; Gil, Ziv; Fliss, Dan M.; Katzir, Abraham

2005-04-01

Conventional methods for dura repair are normally based on sutures or stitches. These methods have several disadvantages: (1) The dura is often brittle, and the standard procedures are difficult and time consuming. (2) The seal is leaky. (3) The introduction of a foreign body (e.g. sutures) may cause an inflammatory response. In order to overcome these difficulties we used a temperature controlled fiber optic based CO2 laser soldering system. In a set of in vitro experiments we generated a hole of diameter 10 mm in the dura of a pig corpse, covered the hole with a segment of fascia, and soldered the fascia to the edges of the hole, using 47% bovine albumin as a solder. The soldering was carried out spot by spot, and each spot was heated to 65° C for 3-6 seconds. The soldered dura was removed and the burst pressure of the soldered patch was measured. The average value for microscopic muscular side soldering was 194 mm Hg. This is much higher than the maximal physiological pressure of the CSF fluid in the brain, which is 15 mm Hg. In a set of in vivo experiments, fascia patches were soldered on holes in five farm pigs. The long term results of these experiments were very promising. In conclusion, we have developed an advanced technique for dural reconstruction, which will find important clinical applications.

Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

NASA Astrophysics Data System (ADS)

Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

2017-08-01

Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

The Shear Strength and Fracture Behavior of Sn-Ag- xSb Solder Joints with Au/Ni-P/Cu UBM

NASA Astrophysics Data System (ADS)

Lee, Hwa-Teng; Hu, Shuen-Yuan; Hong, Ting-Fu; Chen, Yin-Fa

2008-06-01

This study investigates the effects of Sb addition on the shear strength and fracture behavior of Sn-Ag-based solders with Au/Ni-P/Cu underbump metallization (UBM) substrates. Sn-3Ag- xSb ternary alloy solder joints were prepared by adding 0 wt.% to 10 wt.% Sb to a Sn-3.5Ag alloy and joining them with Au/Ni-P/Cu UBM substrates. The solder joints were isothermally stored at 150°C for up to 625 h to study their microstructure and interfacial reaction with the UBM. Single-lap shear tests were conducted to evaluate the mechanical properties, thermal resistance, and failure behavior. The results show that UBM effectively suppressed intermetallic compound (IMC) formation and growth during isothermal storage. The Sb addition helped to refine the Ag3Sn compounds, further improving the shear strength and thermal resistance of the solders. The fracture behavior evolved from solder mode toward the mixed mode and finally to the IMC mode with increasing added Sb and isothermal storage time. However, SnSb compounds were found in the solder with 10 wt.% Sb; they may cause mechanical degradation of the solder after long-term isothermal storage.

Evaluation of ENEPIG and Immersion Silver Surface Finishes Under Drop Loading

NASA Astrophysics Data System (ADS)

Pearl, Adam; Osterman, Michael; Pecht, Michael

2016-01-01

The effect of printed circuit board surface finish on the drop loading reliability of ball grid array (BGA) solder interconnects has been examined. The finishes examined include electroless nickel/electroless palladium/immersion gold (ENEPIG) and immersion silver (ImAg). For the ENEPIG finish, the effect of the Pd plating layer thickness was evaluated by testing two different thicknesses: 0.05 μm and 0.15 μm. BGA components were assembled onto the boards using either eutectic Sn-Pb or Sn-3.0Ag-0.5Cu (SAC305) solder. Prior to testing, the assembled boards were aged at 100°C for 24 h or 500 h. The boards were then subjected to multiple 1500-g drop tests. Failure analysis indicated the primary failure site for the BGAs to be the solder balls at the board-side solder interface. Cratering of the board laminate under the solder-attached pads was also observed. In all cases, isothermal aging reduced the number of drops to failure. The components soldered onto the boards with the 0.15- μm-Pd ENEPIG finish with the SAC305 solder had the highest characteristic life, at 234 drops to failure, compared with the other finish-solder combinations.

Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

NASA Astrophysics Data System (ADS)

Roshanghias, Ali; Khatibi, Golta; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert

2016-08-01

Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows

NASA Astrophysics Data System (ADS)

Li, Yan; Hatch, Olen; Liu, Pilin; Goyal, Deepak

2017-03-01

Solder joint interconnects in three-dimensional (3D) packages with package stacking configurations typically must undergo multiple reflow cycles during the assembly process. In this work, interfacial open joint failures between the bulk solder and the intermetallic compound (IMC) layer were found in Sn-Ag-Cu (SAC) solder joints connecting a small package to a large package after multiple reflow reliability tests. Systematic progressive 3D x-ray computed tomography experiments were performed on both incoming and assembled parts to reveal the initiation and evolution of the open failures in the same solder joints before and after the reliability tests. Characterization studies, including focused ion beam cross-sections, scanning electron microscopy, and energy-dispersive x-ray spectroscopy, were conducted to determine the correlation between IMC phase transformation and failure initiation in the solder joints. A comprehensive failure mechanism, along with solution paths for the solder joint interfacial failures after multiple reflow cycles, is discussed in detail.

Microstructure and mechanical behavior of low-melting point Bi-Sn-In solder joints

NASA Astrophysics Data System (ADS)

Nguyen, Van Luong; Kim, Sang Hoon; Jeong, Jae Won; Lim, Tae-Soo; Yang, Dong-Yeol; Kim, Ki Bong; Kim, Young Ja; Lee, Jun Hong; Kim, Yong-Jin; Yang, Sangsun

2017-09-01

Ternary Bi-31.5Sn-25.0In solder has been proposed and studied for application in temperature-sensitive electronic components. In a Bi-31.5Sn- 25.0In solder joint, In was detected in an intermetallic compound (IMC) layer formed at the solder/Cu substrate interface with a thickness of 4.8 μm. The microstructure of the bulk solder consisted of Sn-rich phases distributed in Bi-rich phases with dispersion of In in both phases. Meanwhile, the nanomechanical properties of the Bi-31.5Sn-25.0In solder showed great strain rate sensitivity. To be specific, hardness increased from 9.91 MPa to 56.84 MPa as the strain rate increased in the range of (0.0005-0.125) s-1. The strain-rate sensitivity exponent ( m) was found to be 0.28, indicating that the excellent ductility was shown for the solder tested under the present conditions. [Figure not available: see fulltext.

Interfacial Phenomena in Al/Al, Al/Cu, and Cu/Cu Joints Soldered Using an Al-Zn Alloy with Ag or Cu Additions

NASA Astrophysics Data System (ADS)

Pstruś, Janusz; Gancarz, Tomasz

2014-05-01

The studies of soldered joints were carried out in systems: Al/solder/Al, Al/solder/Cu, Cu/solder/Cu, where the solder was (Al-Zn)EUT, (Al-Zn)EUT with 0.5, 1.0, and 1.5 at.% of Ag and (Al-Zn)EUT with 0.5, 1.0, and 1.5 at.% of Cu addition. Brazing was performed at 500 °C for 3 min. The EDS analysis indicated that the composition of the layers starting from the Cu pad was CuZn, Cu5Zn8, and CuZn4, respectively. Wetting tests were performed at 500 °C for 3, 8, 15, and 30 min, respectively. Thickness of the layers and their kinetics of growth were measured based on the SEM micrographs. The formation of interlayers was not observed from the side of Al pads. On the contrary, dissolution of the Al substrate and migration of Al-rich particles into the bulk of the solder were observed.

A Study on the Effect of Ageing and Intermetallic Compound Growth on the Shear Strength of Surface Mount Technology Solder Joints

NASA Astrophysics Data System (ADS)

Nath, Jyotishman; Mallik, Sabuj; Borah, Anil

2015-04-01

The effect of ageing and intermetallic compound formation on the surface mount solder joints and its shear strength behavior under extreme mechanical and thermal conditions have been discussed in this paper. The specimens used are solder paste (Sn3.8Ag0.7Cu), bench marker II printed circuit boards (PCB), resistors 1206 and the fabrication of solder joints makes use of conventional surface mount technology (SMT). Reflow process was carried out at a peak temperature of 250 °C and the test samples were exposed to isothermal ageing at a constant temperature of 150 °C for a period of 600 h. Shear test was conducted on the PCB's. The shear strength of the solder joints rapidly increased during isothermal ageing to a certain time period and then started decreasing. Field emission scanning electron microscopy (FESEM) micrograph of the solder joint and energy dispersive X-ray (EDX) was performed on the solder sample to verify the formation of intermetallic compounds.

Microstructural evolution and IMCs growth behavior of Sn-58Bi-0.25Mo solder joint during aging treatment

NASA Astrophysics Data System (ADS)

Yang, Li; Zhu, Lu; Zhang, Yaocheng; Zhou, Shiyuan; Xiong, Yifeng; Wu, Pengcheng

2018-02-01

The microstructural evolution and IMCs growth behavior of Sn-58Bi and Sn-58Bi-0.25Mo solder joints were investigated. The results showed that the microstructure is coarsened, the IMCs layer thickness is increased and the tensile strength of Sn-58Bi and Sn-58Bi-0.25Mo solder joints is decreased with increasing aging time and temperature. Aging temperature is the key factor that causes the excessive IMCs growth of the solder joint compared with aging time, and the activation energy of IMCs layer growth of Sn-58Bi and Sn-58Bi-0.25Mo solder joints is 48.94 kJ mol-1 and 53.79 kJ mol-1, respectively. During the aging treatment, the microstructure of Sn-58Bi solder joint is refined by adding Mo nanoparticles, and the appropriate IMCs layer thickness and improved mechanical properties are obtained by Sn-58Bi-0.25Mo solder joint.

Histologic assessment of mesh fixation following laser-assisted tissue soldering in a lapine model.

PubMed

Lanzafame, Raymond J; Brondon, Philip; Stadler, Istvan; DeVore, Dale P; Soltz, Robert; Soltz, Barbara A

2005-08-01

Wound histology and mesh bioincorporation following intraperitoneal fixation using laser-assisted soldering was evaluated. 2.8-3.2 kg NZW rabbits underwent laparotomy. Controls had 2x2 cm segments of Mersilene stapled to peritoneum. Group 2 segments were affixed with 55% collagen solder onlay by fiber-coupled diode laser (1.43 +/- 10 micro, 2.5 W CW, 4 mm spot, 60 degrees C set temperature). Group 4 had Mersilene inlaid into melted solder. Group 3 had solder-embedded Vicryl mesh affixed. Animals were euthanized at 0, 2, 4, 6 weeks. Fixed sections were assessed for integrity, inflammation, and fibrosis using H & E, Masson's Trichrome and Evans Van Gieson staining. Histology demonstrated cell types, local mesh reaction, and progressive evidence of solder reabsorption mimicking normal healing and bioincorporation. Mersilene groups demonstrated normal arrangement of collagen-rich layers around mesh. Collagen-based tissue soldering permits normal wound healing and may mitigate use of staples. Further development of this strategy is warranted. (c) 2005 Wiley-Liss, Inc.

Robust solder joint attachment of coaxial cable leads to piezoelectric ceramic electrodes.

PubMed

Vianco, P T

1993-01-01

A technique was developed for the solder attachment of coaxial cable leads to silver-bearing thick-film electrodes on piezoelectric ceramics. Soldering the cable leads directly to the thick film caused bonds with low mechanical strength due to poor solder joint geometry. A barrier coating of 1.5 mum Cu/1.5 mum Ni/1.0 mum Sn deposited on the thick-film layer improved the strength of the solder joints by eliminating the adsorption of Ag from the thick film, which was responsible for the improper solder joint geometry. The procedure does not require special preparation of the electrode surface and is cost effective due to the use of nonprecious metal films and the batch processing capabilities of the electron beam deposition technique.

Thermal Cycling Fatigue in DIPs Mounted with Eutectic Tin-Lead Solder Joints in Stub and Gullwing Geometries

NASA Technical Reports Server (NTRS)

Winslow, J. W.; Silveira, C. de

1993-01-01

It has long been known that solder joints under mechanical stress are subject to failure. In early electronic systems, such failures were avoided primarily by avoiding the use of solder as a mechanical structural component. The rule was first to make sound wire connections that did not depend mechanically on solder, and only then to solder them. Careful design and miniaturization in modern electronic systems limits the mechanical stresses exerted on solder joints to values less than their yield points, and these joints have become integral parts of the mechanical structures. Unfortunately, while these joints are strong enough when new, they have proven vulnerable to fatigue failures as they age. Details of the fatigue process are poorly understood, making predictions of expected lifetimes difficult.

Intermetallic compounds in 3D integrated circuits technology: a brief review

NASA Astrophysics Data System (ADS)

Annuar, Syahira; Mahmoodian, Reza; Hamdi, Mohd; Tu, King-Ning

2017-12-01

The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.

Intermetallic compounds in 3D integrated circuits technology: a brief review.

PubMed

Annuar, Syahira; Mahmoodian, Reza; Hamdi, Mohd; Tu, King-Ning

2017-01-01

The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.

Dry soldering with hot filament produced atomic hydrogen

DOEpatents

Panitz, J.K.G.; Jellison, J.L.; Staley, D.J.

1995-04-25

A system is disclosed for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs. 1 fig.

Ultrasonic-assisted soldering of Cu/Ti joints

NASA Astrophysics Data System (ADS)

Cui, Wei; Wang, Chunyu; Li, Yuhang; Zhong, Tongtong; Yang, Jianguo; Bao, Yefeng

2018-03-01

Cu/Ti joints are expected to be used in various applications, while reliable joining method is still to be developed. It is commonly not possible to solder Ti alloys using Sn-based solder alloys because of their poor wettability. In this study, Sn-Ag-Cu soldering filler metal was used to joining TC4 titanium alloy and pure copper using ultrasonic-assisted soldering. The influence of different temperature and different ultrasonic time on the welded joint is studied and explored. Microstructure of the joints was investigated. Shear strength of the joints reached the maximum value, i.e. 38.2MPa. Relationship between the sonication parameters and the microstructure and strength of the joints was discussed. Thus, it is verified that dissimilar metal brazing of TC4 and copper is suitable for low temperature soldering.

METHOD FOR SOLDERING NORMALLY NON-SOLDERABLE ARTICLES

DOEpatents

McGuire, J.C.

1959-11-24

Methods are presented for coating and joining materials which are considered difficult to solder by utilizing an abrasive wheel and applying a bar of a suitable coating material, such as Wood's metal, to the rotating wheel to fill the cavities of the abrasive wheel and load the wheel with the coating material. The surface of the base material is then rubbed against the loaded rotating wheel, thereby coating the surface with the soft coating metal. The coating is a cohesive bonded layer and holds the base metal as tenaciously as a solder holds to easily solderable metals.

Reduced impedance and superconductivity of SnAgCu solder alloy at high frequency

NASA Astrophysics Data System (ADS)

Yao, Wei; Basaran, Cemal

2012-10-01

Skin effect of lead-free solder joints is investigated over a wide frequency band. Contrary to common believe that `effective impedance of solder alloys increases with frequency', resistance tends to saturate when frequency reaches a critical value, 10 MHz for SAC solder alloys. Negative surface impedance growth rate is observed when employs square waveform AC current loading at high current density. Further increased frequency causes a dramatic reduction of effective resistance. At 11 MHz with current density of 106 A/cm2, effective resistance of solder alloy drops to near zero value.

Natural radioactive contaminants in solder

NASA Astrophysics Data System (ADS)

Bunzl, K.; Kracke, W.

1985-07-01

Comparatively high surface count rates for alpha- and beta-radiation were observed for several solders. They were identified as 210Pb and 210Po. The corresponding specific activities in solder were determined.

Photothermal effects of laser tissue soldering.

PubMed

McNally, K M; Sorg, B S; Welch, A J; Dawes, J M; Owen, E R

1999-04-01

Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5 mg ml(-1) to 0.25 mg ml(-1) was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4 W cm(-2) using a solid protein solder composed of 60% BSA and 0.25 mg ml(-1) ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85+/-5 degrees C with a maximum temperature difference through the 150 microm thick solder strips of about 15 degrees C. Histological examination of the repairs formed using these parameters showed negligible evidence of collateral thermal damage to the underlying tissue. Scanning electron microscopy suggested albumin intertwining within the tissue collagen matrix and subsequent fusion with the collagen as the mechanism for laser tissue soldering. The laser tissue soldering technique is shown to be an effective method for producing repairs with improved tensile strength and minimal collateral thermal damage over conventional laser tissue welding techniques.

Effect of varying chromophores used in light-activated protein solders on tensile strength and thermal damage profile of repairs.

PubMed

Hoffman, Grant T; Byrd, Brian D; Soller, Eric C; Heintzelman, Douglas L; McNally-Heintzelman, Karen M

2003-01-01

Clinical adoption of laser tissue welding (LTW) techniques has been beleaguered by problems associated with thermal damage of tissue and insufficient strength of the resulting tissue bond. The magnitude of these problems has been significantly reduced with the incorporation of indocyanine green (ICG)-doped protein solders into the LTW procedure to form a new technique known as laser tissue soldering (LTS). With the addition of ICG, a secondary concern has arisen relating to the potential harmful effects of the degradation products of the chromophore upon thermal denaturation of the protein solder with a laser. In this study, two different food colorings were investigated, including blue #1 and green consisting of yellow #5 and blue #1, as alternative chromophores for use in LTS techniques. Food coloring has been found to have a suitable stability and safety profile for enteral use when heated to temperatures above 200 degrees C; thus, it is a promising candidate chromophore for LTS which typically requires temperatures between 50 degrees C and 100 degrees C. Experimental investigations were conducted to test the tensile strength of ex vivo repairs formed using solders doped with these alternative chromophores in a bovine model. Two commonly used chromophores, ICG and methylene blue (MB), were investigated as a reference. In addition, the temperature rise, depth of thermal coagulation in the protein solder, and the extent of thermal damage in the surrounding tissue were measured. Temperature rise at the solder/tissue interface, and consequently the degree of solder coagulation and collateral tissue thermal damage, was directly related to the penetration depth of laser light in the protein solder. Variation of the chromophore concentration such that the laser light penetrated to a depth approximately equal to half the thickness of the solder resulted in uniform results between each group of chromophores investigated. Optimal tensile strength of repairs was achieved by optimizing laser and solder parameters to obtain a temperature of approximately 65 degrees C at the solder/tissue interface. The two alternative chromophores tested in this study show considerable promise for application in LTS techniques, with equivalent tensile strength to solders doped with ICG or MB, and the potential advantage of eliminating the risks associated with harmful byproducts.

Investigation of corrosion and stress corrosion cracking susceptibility of S30400 and S31600 stainless steels exposed to commercial soldering flux containing zinc chloride

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nguyen, D.T.

1995-10-01

A corrosion investigation was conducted to determine corrosion behavior and stress corrosion cracking (SCC) susceptibility of S30400 and S31600 stainless steel exposed to soldering flux paste containing 25 wt% zinc chloride. Electrochemical test results indicated that soldering flux paste was not corrosive to S30400 and S31600 at room temperature. The wax phase (light phase) of soldering flux was also not corrosive to S30400 and S31600. However, the heavy phase of solder flux was corrosive to S30400 and S31600 at elevated temperatures. In heavy phase, S30400 did not passivate, while S31600 passivated at temperatures up to 80 C while no passivitymore » was observed at 85 C and above. AC impedance test results showed that S30400 and S31600 corroded at rates of less than 0.1 mpy in solder flux pastes at room temperature. In the soldering flux heavy phase, corrosion rates were about 2 mpy or less for S30400 at temperatures up to 75 C and S31600 at temperatures up to 70 C. However, corrosion rates of S30400 in the soldering flux heavy phase increased to 5, 8, 10, and 22 mpy at 80, 85, 90, and 95 C while corrosion rates of S31600 sst in the soldering flux heavy phase increased to 4, 5, 7, and 11, and 30 mpy at 75, 80, 85, 90 and 95 C, respectively. CERT results revealed that no SCC susceptibility when S30400 and S31600 were exposed to soldering flux paste at room temperature and wax phase at 65 and 95 C. However, both test alloys were susceptible to transgranular SCC when exposed to the soldering flux heavy phase at temperatures of 65+ C. Severity of SCC increased with temperature increase. SCC fractures were characterized by reduction of ductility and numerous SCC secondary cracks on the specimen gage length. The most severe SCC fracture was observed on a S30400 specimen partially submersed in the soldering flux heavy phase and partially submersed in the soldering flux wax phase at 95 C. No similar cracking was observed on S31600.« less

Processing of NiTi Reinforced Adaptive Solder for Electronic Packaging

DTIC Science & Technology

2004-03-01

NAVAL POSTGRADUATE SCHOOL MONTEREY, CALIFORNIA THESIS PROCESSING OF NITI REINFORCED ADAPTIVE SOLDER FOR ELECTRONIC PACKAGING...March 2004 3. REPORT TYPE AND DATES COVERED Master’s Thesis 4. TITLE AND SUBTITLE: Processing of NiTi Reinforced Adaptive Solder for Electronic...reports in the development a process to fabricate solder joints with a fine distribution of shape memory alloys (SMA) NiTi particulates. The

Design and fabrication of lanthanum-doped tin-silver-copper lead-free solder for the next generation of microelectronics applications in severe environment

NASA Astrophysics Data System (ADS)

Sadiq, Muhammad

Tin-Lead solder (Sn-Pb) has long been used in the Electronics industry. But, due to its toxic nature and environmental effects, certain restrictions are made on its use by the European Rehabilitation of Hazardous Substances (RoHS) directive, and therefore, many researchers are looking to replace it. The urgent need for removing lead from solder alloys led to the very fast introduction of lead-free solder alloys without a deep knowledge of their behavior. Therefore, an extensive knowledge and understanding of the mechanical behavior of the emerging generation of lead-free solders is required to satisfy the demands of structural reliability. Sn-Ag-Cu (SAC) solders are widely used as lead-free replacements but their coarse microstructure and formation of hard and brittle Inter-Metallic Compounds (IMCs) have limited their use in high temperature applications. Many additives are studied to refine the microstructure and improve the mechanical properties of SAC solders including iron (Fe), bismuth (Bi), antimony (Sb) and indium (In) etc. Whereas many researchers studied the impact of novel rare earth (RE) elements like lanthanum (La), cerium (Ce) and lutetium (Lu) on SAC solders. These RE elements are known as “vitamins of metals” because of their special surface active properties. They reduce the surface free energy, refine the grain size and improve the mechanical properties of many lead free solder alloys like Sn-Ag, Sn-Cu and SAC but still a systematic study is required to explore the special effects of “La” on the eutectic SAC alloys. The objective of this PhD thesis is to extend the current knowledge about lead free solders of SAC alloys towards lanthanum doping with varying environmental conditions implemented during service. This thesis is divided into six main parts.

49 CFR 393.67 - Liquid fuel tanks.

Code of Federal Regulations, 2012 CFR

2012-10-01

..., by brazing, by silver soldering, or by techniques which provide heat resistance and mechanical... soldering with a lead-based or other soft solder. (2) Fittings. The fuel tank body must have flanges or...

49 CFR 393.67 - Liquid fuel tanks.

Code of Federal Regulations, 2011 CFR

2011-10-01

..., by brazing, by silver soldering, or by techniques which provide heat resistance and mechanical... soldering with a lead-based or other soft solder. (2) Fittings. The fuel tank body must have flanges or...

49 CFR 393.67 - Liquid fuel tanks.

Code of Federal Regulations, 2013 CFR

2013-10-01

..., by brazing, by silver soldering, or by techniques which provide heat resistance and mechanical... soldering with a lead-based or other soft solder. (2) Fittings. The fuel tank body must have flanges or...

Acid soldering flux poisoning

MedlinePlus

Acid soldering flux is a chemical used to clean and protect the area where two pieces of metal are ... The harmful substances in soldering fluxes are called hydrocarbons. They include: Ammonium chloride Rosin Hydrochloric acid Zinc chloride

49 CFR 393.67 - Liquid fuel tanks.

Code of Federal Regulations, 2014 CFR

2014-10-01

..., by brazing, by silver soldering, or by techniques which provide heat resistance and mechanical... soldering with a lead-based or other soft solder. (2) Fittings. The fuel tank body must have flanges or...

The Influence of Processing on Strengthening Mechanisms in Pb-Free Solder Joints

NASA Astrophysics Data System (ADS)

Mutuku, Francis; Arfaei, Babak; Cotts, Eric J.

2017-04-01

The number, and the spacing, of Ag3Sn precipitates in Sn-Ag-Cu/Cu solder joints were related to separate processing parameters. The mechanical properties of an individual solder joint were directly related to the resulting distribution of different dispersoids in the joint. As the number of Ag3Sn precipitates increased, so did solder joint strength and shear fatigue lifetime. The room-temperature shear fatigue lifetime was inversely correlated with the separation between Ag3Sn precipitates. Bi and Sb solid solution strengthening was found to result in significantly larger values of shear strength and shear fatigue lifetime for one Pb-free solder. Room-temperature shear fatigue lifetime tests were identified as a relatively straightforward, yet sensitive means to gain insight into the reliability of Sn-Ag-Cu (SAC) solder joints.

Intermetallic compounds in 3D integrated circuits technology: a brief review

PubMed Central

Annuar, Syahira; Mahmoodian, Reza; Hamdi, Mohd; Tu, King-Ning

2017-01-01

Abstract The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed. PMID:29057024

The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints

NASA Astrophysics Data System (ADS)

Liu, Weiping; Lee, Ning-Cheng

2007-07-01

The impact reliability of solder joints in electronic packages is critical to the lifetime of electronic products, especially those portable devices using area array packages such as ball-grid array (BGA) and chip-scale packages (CSP). Currently, SnAgCu (SAC) solders are most widely used for lead-free applications. However, BGA and CSP solder joints using SAC alloys are fragile and prone to premature interfacial failure, especially under shock loading. To further enhance impact reliability, a family of SAC alloys doped with a small amount of additives such as Mn, Ce, Ti, Bi, and Y was developed. The effects of doping elements on drop test performance, creep resistance, and microstructure of the solder joints were investigated, and the solder joints made with the modified alloys exhibited significantly higher impact reliability.

Determination of Anand parameters for SnAgCuCe solder

NASA Astrophysics Data System (ADS)

Zhang, Liang; Xue, Songbai; Gao, Lili; Zeng, Guang; Sheng, Zhong; Chen, Yan; Yu, Shenglin

2009-10-01

A unified viscoplastic constitutive model, Anand equations, was used to represent the inelastic deformation behavior for Sn3.8Ag0.7Cu/Sn3.8Ag0.7 Cu0.03Ce solders in surface mount technology. The Anand parameters of the constitutive equations for the SnAgCu and SnAgCuCe solders were determined from separated constitutive relations and experimental results. Non-linear least-squares fitting was selected to determine the model constants. Comparisons were then made with experimental measurements of the stress-inelastic strain curves: excellent agreement was found. The model accurately predicted the overall trend of steady-state stress-strain behavior of SnAgCu and SnAgCuCe solders for the temperature ranges from -55 to 125 °C and for the strain rate range from 1% s-1 to 0.01% s-1. It is concluded that the Anand model can be applied to represent the inelastic deformation behavior of solders at high homologous temperatures and can be recommended for finite element simulation of the stress-strain response of lead-free soldered joints. Based on the Anand model, the investigations of thermo-mechanical behavior of SnAgCu and SnAgCuCe soldered joints in fine pitch quad flat package by the finite element code have been done under thermal cyclic loading, and it is found that the reliability of the SnAgCuCe soldered joints is better than that of the SnAgCu soldered joints.

Solderability test system

DOEpatents

Yost, Fred; Hosking, Floyd M.; Jellison, James L.; Short, Bruce; Giversen, Terri; Reed, Jimmy R.

1998-01-01

A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

A Comparative Study on the Microstructure and Mechanical Properties of Cu6Sn5 and Cu3Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves

NASA Astrophysics Data System (ADS)

Zhao, H. Y.; Liu, J. H.; Li, Z. L.; Song, X. G.; Zhao, Y. X.; Niu, H. W.; Tian, H.; Dong, H. J.; Feng, J. C.

2018-07-01

In this study, the microstructure and mechanical properties of Cu6Sn5 and Cu3Sn intermetallic joints, formed by the transient liquid phase (TLP) soldering process with and without the assistance of ultrasonic waves (USWs), were compared. After the application of USWs in the TLP soldering process, Cu-Sn intermetallic compounds (IMCs) exhibited a novel noninterfacial growth pattern in the molten solder interlayer. The resulting Cu6Sn5 and Cu3Sn joints consisted of refined equiaxed IMC grains with average sizes of 3 and 2.3 µm, respectively. The Cu6Sn5 grains in the ultrasonically soldered intermetallic joints demonstrated uniform mechanical properties with elastic modulus and hardness values of 123.0 and 5.98 GPa, respectively, while those of Cu3Sn grains were 133.9 and 5.08 GPa, respectively. The shear strengths of ultrasonically soldered Cu6Sn5 and Cu3Sn joints were measured to be 60 and 65 MPa, respectively, higher than that for reflow-soldered intermetallic joints. Ultrasonically soldered Cu6Sn5 and Cu3Sn joints both exhibited a combination of transgranular and intergranular fractures during shear testing.

Detection of micro solder balls using active thermography and probabilistic neural network

NASA Astrophysics Data System (ADS)

He, Zhenzhi; Wei, Li; Shao, Minghui; Lu, Xingning

2017-03-01

Micro solder ball/bump has been widely used in electronic packaging. It has been challenging to inspect these structures as the solder balls/bumps are often embedded between the component and substrates, especially in flip-chip packaging. In this paper, a detection method for micro solder ball/bump based on the active thermography and the probabilistic neural network is investigated. A VH680 infrared imager is used to capture the thermal image of the test vehicle, SFA10 packages. The temperature curves are processed using moving average technique to remove the peak noise. And the principal component analysis (PCA) is adopted to reconstruct the thermal images. The missed solder balls can be recognized explicitly in the second principal component image. Probabilistic neural network (PNN) is then established to identify the defective bump intelligently. The hot spots corresponding to the solder balls are segmented from the PCA reconstructed image, and statistic parameters are calculated. To characterize the thermal properties of solder bump quantitatively, three representative features are selected and used as the input vector in PNN clustering. The results show that the actual outputs and the expected outputs are consistent in identification of the missed solder balls, and all the bumps were recognized accurately, which demonstrates the viability of the PNN in effective defect inspection in high-density microelectronic packaging.

Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection

NASA Astrophysics Data System (ADS)

Pun, Kelvin P. L.; Islam, M. N.; Rotanson, Jason; Cheung, Chee-wah; Chan, Alan H. S.

2018-05-01

Low-temperature soldering constitutes a promising solution in interconnect technology with the increasing trend of heat-sensitive materials in integrated circuit packaging. Experimental work was carried out to investigate the effect of electroless Ni/electroless Pd/immersion gold (ENEPIG) layer thicknesses on Sn-Bi-Ag solder joint integrity during extended reflow at peak temperatures as low as 175°C. Optimizations are proposed to obtain reliable solder joints through analysis of interfacial microstructure with the resulting joint integrity under extended reflow time. A thin Ni(P) layer with thin Pd led to diffusion of Cu onto the interface resulting in Ni3Sn4 intermetallic compound (IMC) spalling with the formation of thin interfacial (Ni,Cu)3Sn4 IMCs which enhance the robustness of the solder after extended reflow, while thick Ni(P) with thin Pd resulted in weakened solder joints with reflow time due to thick interfacial Ni3Sn4 IMCs with the entrapped brittle Bi-phase. With a suitable thin Ni(P), the Pd thickness has to be optimized to prevent excessive Ni-P consumption and early Cu outward diffusion to enhance the solder joint during extended reflow. Based on these findings, suitable Ni(P) and Pd thicknesses of ENEPIG are recommended for the formation of robust low-temperature solder joints.

A Comparative Study on the Microstructure and Mechanical Properties of Cu6Sn5 and Cu3Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves

NASA Astrophysics Data System (ADS)

Zhao, H. Y.; Liu, J. H.; Li, Z. L.; Song, X. G.; Zhao, Y. X.; Niu, H. W.; Tian, H.; Dong, H. J.; Feng, J. C.

2018-05-01

In this study, the microstructure and mechanical properties of Cu6Sn5 and Cu3Sn intermetallic joints, formed by the transient liquid phase (TLP) soldering process with and without the assistance of ultrasonic waves (USWs), were compared. After the application of USWs in the TLP soldering process, Cu-Sn intermetallic compounds (IMCs) exhibited a novel noninterfacial growth pattern in the molten solder interlayer. The resulting Cu6Sn5 and Cu3Sn joints consisted of refined equiaxed IMC grains with average sizes of 3 and 2.3 µm, respectively. The Cu6Sn5 grains in the ultrasonically soldered intermetallic joints demonstrated uniform mechanical properties with elastic modulus and hardness values of 123.0 and 5.98 GPa, respectively, while those of Cu3Sn grains were 133.9 and 5.08 GPa, respectively. The shear strengths of ultrasonically soldered Cu6Sn5 and Cu3Sn joints were measured to be 60 and 65 MPa, respectively, higher than that for reflow-soldered intermetallic joints. Ultrasonically soldered Cu6Sn5 and Cu3Sn joints both exhibited a combination of transgranular and intergranular fractures during shear testing.

Decomposition of Ag-based soldering alloys used in space maintainers after intra-oral exposure. A retrieval analysis study.

PubMed

Soteriou, Despo; Ntasi, Argyro; Papagiannoulis, Lisa; Eliades, Theodore; Zinelis, Spiros

2014-02-01

The aim of this study was to evaluate the elemental alterations of Ag soldering alloys used in space maintainers after intra-oral exposure. Twenty devices were fabricated by using two different soldering alloys; US (Dentaurum Universal Silver Solder, n = 10) and OS (Leone Orthodontic Solder, n = 10). All devices were manufactured by the same technician. Surface morphology and elemental quantitative analysis of the soldering alloys before and after intra-oral placement in patients was determined by scanning electron microscopy and energy-dispersive X-ray microanalysis (SEM/EDX). Statistical analysis was performed by t-test, Mann Whitney tests and Pearson's correlation. For all tests a 95% confidence level was used (α = 0.05). Both soldering alloys demonstrated substantially increase in surface roughness after intra-oral aging. Statistical analysis illustrated a significant decrease in the Cu and Zn content after treatment. OS demonstrated higher Cu release than US (p < 0.05). The remaining relative concentrations of Cu and Zn after the treatment did not show any correlation (p > 0.05) with intra-oral exposure time, apart from Zn in OS (r = 0.840, p = 0.04). Both soldering alloys demonstrated a significant Cu and Zn reduction after intra-oral exposure that may raise biocompatibility concerns.

Low temperature electrical properties of some Pb-free solders

NASA Astrophysics Data System (ADS)

Kisiel, Ryszard; Pekala, Marek

2006-03-01

The electronic industry is engaged in developing Pb-free technologies for more than ten years. However till now not all properties of new solders are described. The aim of the paper is to present some electrical properties of new series of Pb-free solders (eutectic SnAg, near eutectic SnAgCu with and without Bi) in low temperature ranges 10 K to 273K. The following parameters were analyzed: electrical resistivity, temperature coefficient of resistance and thermoelectric power. The electrical resistivity at temperatures above 50 K is a monotonically rising function of temperature for Pb-free solders studied. The electrical resistivity of the Bi containing alloys is higher as compared to the remaining ones. The thermoelectric power values at room temperature are about -8 μV/K to -6 μV/K for Pb-free solders studied, being higher as compared to typical values -3 μVK of SnPb solder. The relatively low absolute values as well as the smooth and weak temperature variation of electrical resistivity in lead free solders enable the possible low temperature application. The moderate values of thermoelectric power around and above the room temperature show that when applying the solders studied the temperature should be kept as uniform as possible, in order to avoid spurious or noise voltages.

Effect of the Silver Content of SnAgCu Solder on the Interfacial Reaction and on the Reliability of Angle Joints Fabricated by Laser-Jet Soldering

NASA Astrophysics Data System (ADS)

Ji, Hongjun; Ma, Yuyou; Li, Mingyu; Wang, Chunqing

2015-02-01

The silver content of lead-free solders affects their microstructure, the interfacial reaction, and the performance of the joints in reliability tests. In this study, Sn3.0Ag0.5Cu (wt.%, SAC305) and Sn1.0Ag0.5Cu (wt.%, SAC105) solder balls of diameter 55 μm were reflowed on gold surface pads by laser-jet soldering. It was found that four types of layered intermetallic compound (IMC) were formed at the interfaces; these were Au5Sn/AuSn, AuSn, AuSn2, and AuSn4 from the pad side to the solder matrix. The Au5Sn/AuSn eutectic region, thickness 400 nm, formed because of the high cooling rate induced by the laser-jet soldering. During high-temperature storage tests, the silver became segregated at the interfaces between the Au-Sn IMC and the solder matrix, resulting in inhibition of IMC growth in SAC305 joints, the shear strengths of which were higher than those of SAC105 joints. In mechanical drop tests, however, percentage failure of the SAC305 joints was twice that of the SAC105 joints.

The failure models of Sn-based solder joints under coupling effects of electromigration and thermal cycling

NASA Astrophysics Data System (ADS)

Ma, Limin; Zuo, Yong; Liu, Sihan; Guo, Fu; Wang, Xitao

2013-01-01

Currently, the main concerns of Pb-free solder joints are focusing on electromigration (EM) and thermomechanical fatigue (TMF) problems. Many models have been established to understand the failure mechanisms of the joint under such single test conditions. Based on the fact that almost all microelectronic devices serve in combination conditions of fluctuated temperature and electric current stressing, the coupling effects of EM and TMF on evolution of microstructure and resistance of solder joint had been investigated. The failure models of binary SnBi alloy and ternary SnAgCu (SAC) solder under the coupling stressing were divided into four and three different stages, respectively. The failure mechanisms were dominant by the relationship of phase segregation, polarity effect, phase coarsening, and the coefficient of thermal expansion mismatch. Cracks tend to form and propagate along the interface between intermetallic compound layers and solder matrix in SAC solder. However, grain boundary was considered as the nucleation sites for microcracks in SnBi solder. High current density alleviates the deterioration of solder at the beginning stage of coupling stressing through Joule heating effect. An abrupt jump of resistance could be observed before the failure of the joint. The failure molds were determined by interactions of EM behaviors and TMF damages.

Survivability of soldered leadless chip carriers after temperature cycling

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zawicki, L.R.; Lenhardt, B.W.; Smith, F.R.

Temperature cycling evaluations were conducted on leadless chip carriers (LCCs) soldered to thick film networks (TKNs). Various temperature ranges, rates of change, cycle times, number of cycles, and sizes of LCCs were used. The TKNs were attached to metal backing plates with 63Sn/37Pb solder preforms using an infrared vacuum soldering process. The LCCs were attached to Pt/Au TKNs with 63Sn/37Pb solder paste using a belt reflow process. Visual examination and cross-sectional analysis were used to evaluate the survivability. Results were also correlated with finite elemental analysis. Considering the initial results, possible solutions included changing the solder from 63Sn/37Pb to 50Pb/50In,more » deleting the metal backplate, changing the rate of change in the temperature cycle, and/or adding leads to the large LCCs. Because of a system requirement, the rate of change in the temperature cycle could not be changed. Since there was no long term reliability information on the Pt/Au TKN with 50Pb/50In solder, this option was also dropped. Additional evaluations showed little difference in the survivability of large LCC solder joints with or without the metal backing plate. The final results indicated that LCCs beyond a certain physical size required compliant leads to survive the temperature cycle requirements.« less

Lead-Free Electronics: Impact for Space Electronics

NASA Technical Reports Server (NTRS)

Sampson, Michael J.

2010-01-01

Pb is used as a constituent in solder alloys used to connect and attach electronic parts to printed wiring boards (PWBs). Similar Pbbearing alloys are electroplated or hot dipped onto the terminations of electronic parts to protect the terminations and make them solderable. Changing to Pb-free solders and termination finishes has introduced significant technical challenges into the supply chain. Tin/lead (Sn/Pb) alloys have been the solders of choice for electronics for more than 50 years. Pb-free solder alloys are available but there is not a plug-in replacement for 60/40 or 63/37 (Sn/Pb) alloys, which have been the industry workhorses.

Working with Consortia - Advanced Packaging Reliability

NASA Technical Reports Server (NTRS)

Blanche, Jim; Strickland, Mark

2010-01-01

Description: Support the responsible NASA official for lead-free solder evaluation. Serve as the NASA technical liaison to the NASA/DoD Pb-free Project. Assure NASA areas of interest are included in JG-PP follow-on work. Support NASA/DoD telcons and face-to-face meetings. Update MSFC lead-free solder lessons learned report. FY10 plans: - Reliability data on lead-free solder applications for various part lead finishes and board finishes. - Update lead-free solder risks and risk mitigation strategies for NASA. - Evaluate lead-free alloy/lead-free finish reliability in design application. - Status CAVE project on Pb-free solder aging effects. - Compile the LTESE flight and bench data.

Multiwire conductor having greatly increased interwire resistance and method for making same

DOEpatents

Luhman, Thomas; Suenaga, Masaki

1984-01-17

An improved multiwire conductor of the type which is mechanically stabilized by a tin based solder filler. A solder filled conductor is heated to a temperature above its melting point for a period long enough to allow a substantial amount of copper to be dissolved from the wires comprising the conductor. The copper forms the brittle intermetallic compound Cu.sub.5 Sn.sub.6 with tin in the solder. After cooling the conductor is flexed causing a random cracking of the solder, and thereby increasing the interwire resistance of the conductor. The subject invention is particularly adapted for use with braided, ribbon-type solder filled superconductors.

Study of heating capacity of focused IR light soldering systems.

PubMed

Anguiano, C; Félix, M; Medel, A; Bravo, M; Salazar, D; Márquez, H

2013-10-07

An experimental study about four optical setups used for developing a Focused IR Light Soldering System (FILSS) for Surface Mount Technology (SMT) lead-free electronic devices specifically for Ball Grid Arrays (BGA) is presented. An analysis of irradiance and infrared thermography at BGA surface is presented, as well as heat transfer by radiation and conduction process from the surface of the BGA to the solder balls. The results of this work show that the heating provided by our proposed optical setups, measured at the BGA under soldering process, meets the high temperature and uniform thermal distribution requirements, which are defined by the reflow solder method for SMT devices.

Thermal Testing and Quality Assurance of BGA LCC & QFN Electronic Packages

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kuper, Cameron Mathias

The purpose of this project is to experimentally validate the thermal fatigue life of solder interconnects for a variety of surface mount electronic packages. Over the years, there has been a significant amount of research and analysis in the fracture of solder joints on printed circuit boards. Solder is important in the mechanical and electronic functionality of the component. It is important throughout the life of the product that the solder remains crack and fracture free. The specific type of solder used in this experiment is a 63Sn37Pb eutectic alloy. Each package was surrounded conformal coating or underfill material.

Insert sleeve prevents tube soldering contamination

NASA Technical Reports Server (NTRS)

Stein, J.

1966-01-01

Teflon sleeve insert prevents contamination of internal tube surfaces by solder compound during soldering operations that connect and seal the tube ends. The sleeve insert is pressed into the mating tube ends with a slight interference fit.

Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish

NASA Astrophysics Data System (ADS)

Chu, Ming-Hui; Liang, S. W.; Chen, Chih; Huang, Annie T.

2012-09-01

Organic solderable preservative (OSP) has been adopted as the Cu substrate surface finish in flip-chip solder joints for many years. In this study, the electromigration behavior of lead-free Sn-Cu solder alloys with thin-film under bump metallization and OSP surface finish was investigated. The results showed that severe damage occurred on the substrate side (cathode side), whereas the damage on the chip side (cathode side) was not severe. The damage on the substrate side included void formation, copper dissolution, and formation of intermetallic compounds (IMCs). The OSP Cu interface on the substrate side became the weakest point in the solder joint even when thin-film metallization was used on the chip side. Three-dimensional simulations were employed to investigate the current density distribution in the area between the OSP Cu surface finish and the solder. The results indicated that the current density was higher along the periphery of the bonding area between the solder and the Cu pad, consistent with the area of IMC and void formation in our experimental results.

Characteristics of solder joints under fatigue loads using piezomechanical actuation

NASA Astrophysics Data System (ADS)

Shim, Dong-Jin; Spearing, S. Mark

2003-07-01

Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

NASA Astrophysics Data System (ADS)

Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

2018-03-01

The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

The influence of temperature and humidity on printed wiring board surface finishes: Immersion tin vs organic azoles

NASA Astrophysics Data System (ADS)

Ray, U.; Artaki, I.; Gordon, H. M.; Vianco, P. T.

1994-08-01

Substitution of lead-free solders in electronic assemblies requires changes in the conventional Sn:Pb finishes on substrates and component leads to prevent contamination of the candidate lead-free solder. Options for solderability preservative coatings on the printed wiring board include organic (azole or rosin/resin based) films and tin-based plated metallic coatings. This paper compares the solderability performance and corrosion protection effectiveness of electroless tin coatings vs organic azole films after exposure to a series of humidity and thermal cycling conditions. The solderability of immersion tin is directly related to the tin oxide growth on the surface and is not affected by the formation of SnCu intermetallic phases as long as the intermetallic phase is underneath a protective Sn layer. Thin azole films decompose upon heating in the presence of oxygen and lead to solderability degradation. Evaluations of lead-free solder pastes for surface mount assembly applications indicate that immersion tin significantly improves the spreading of Sn:Ag and Sn:Bi alloys as compared to azole surface finishes.

Influence of the volume-contact area ratio on the growth behavior of the Cu-Sn intermetallic phase

NASA Astrophysics Data System (ADS)

Giddaluri, Venkatakamakshi Supraja

Solder Joints play a very important role in electronic packaging industry by serving as mechanical support and provides integrity to the device. The increasing demand for high performance, environmental and economic feasibility and miniaturization led to the development of high density interconnects. With the reduction in the size/standoff height of the solder reliability issues in the surface mount assemblies and packaging structures under various rigorous environments are becoming significant. One of the most important impact factors that affect the solder joint reliability is the growth rate IMC formed between the solder and substrate with reduction in joint size. IMC formation is required to ensure good bonding and connectivity of the device in packaging. However excess IMC growth rate is detrimental to the device from mechanical aspects due to its brittle nature. Thus there is a need to study effect the IMC growth rate behavior with the solder joint size/standoff height. In this present study, two solder joints of different standoff heights and same composition (pure Sn solder) are used subjected to reflow process at 270°C for 1--7 min to study solid liquid interfacial reaction on joint size and the same experiment is repeated with SAC alloy of composition (96.5% Sn, 3.0% Ag, 0.5% Cu) to investigate the effect of joint size and initial copper concentration on IMC growth rate. The IMC thickness of the Sn 15microm solder joint at 1 min and 7 min is found to be 1.52microm and 2.86microm respectively while that of Sn 150microm solder joint is 1.31microm and 3.16 microm. The thickness is high in low standoff height sample at the early stage of reaction with decrease in IMC growth rate as the time of reflow increases. In case of 25microm SAC alloy solder joint the IMC thickness from 1 and 7 min is found to be 2.1microm and 3.5microm while that of 250microm SAC alloy solder joint its 1.43microm and3.235microm. Similar trend is observed but the IMC thickness is more in SAC alloy compared to Pure Sn due to initial Cu concentration effect. The CGC model is applied for growth kinetics of IMC formation and is in well agreement with the experimental results. It is found that the low standoff height solder joint follow t1/3 law and high standoff height solder joint deviates from the t1/3 due to unsaturation. The pure Sn solder of two different standoff heights is also subjected to isothermal aging tests at 120°C for 0--600 hours to investigate the effect of IMC growth rate on solder joint size in solid state diffusion. It has been found that low solder joint height is having high growth rate compared to high standoff height joint and it is found to obey parabolic law and follow reaction diffusion control mechanism.

A maximum entropy fracture model for low and high strain-rate fracture in TinSilverCopper alloys

NASA Astrophysics Data System (ADS)

Chan, Dennis K.

SnAgCu solder alloys exhibit significant rate-dependent constitutive behavior. Solder joints made of these alloys exhibit failure modes that are also rate-dependent. Solder joints are an integral part of microelectronic packages and are subjected to a wide variety of loading conditions which range from thermo-mechanical fatigue to impact loading. Consequently, there is a need for non-empirical rate-dependent failure theory that is able to accurately predict fracture in these solder joints. In the present thesis, various failure models are first reviewed. But, these models are typically empirical or are not valid for solder joints due to limiting assumptions such as elastic behavior. Here, the development and validation of a maximum entropy fracture model (MEFM) valid for low strain-rate fracture in SnAgCu solders is presented. To this end, work on characterizing SnAgCu solder behavior at low strain-rates using a specially designed tester to estimate parameters for constitutive models is presented. Next, the maximum entropy fracture model is reviewed. This failure model uses a single damage accumulation parameter and relates the risk of fracture to accumulated inelastic dissipation. A methodology is presented to extract this model parameter through a custom-built microscale mechanical tester for Sn3.8Ag0.7Cu solder. This single parameter is used to numerically simulate fracture in two solder joints with entirely different geometries. The simulations are compared to experimentally observed fracture in these same packages. Following the simulations of fracture at low strain rate, the constitutive behavior of solder alloys across nine decades of strain rates through MTS compression tests and split-Hopkinson bar are presented. Preliminary work on using orthogonal machining as novel technique of material characterization at high strain rates is also presented. The resultant data from the MTS compression and split-Hopkinson bar tester is used to demonstrate the localization of stress to the interface of solder joints at high strain rates. The MEFM is further extended to predict failure in brittle materials. Such an extension allows for fracture prediction within intermetallic compounds (IMCs) in solder joints. It has been experimentally observed that the failure mode shifts from bulk solder to the IMC layer with increasing loading rates. The extension of the MEFM would allow for prediction of the fracture mode within the solder joint under different loading conditions. A fracture model capable of predicting failure modes at higher strain rates is necessary, as mobile electronics are becoming ubiquitous. Mobile devices are prone to being dropped which can induce loading rates within solder joints that are much larger than experienced under thermo-mechanical fatigue. A range of possible damage accumulation parameters for Cu6Sn 5 is determined for the MEFM. A value within the aforementioned range is used to demonstrate the increasing likelihood of IMC fracture in solder joints with larger loading rates. The thesis is concluded with remarks about ongoing work that include determining a more accurate damage accumulation parameter for Cu6Sn 5 IMC, and on using machining as a technique for extracting failure parameters for the MEFM.

Solderability test system

DOEpatents

Yost, F.; Hosking, F.M.; Jellison, J.L.; Short, B.; Giversen, T.; Reed, J.R.

1998-10-27

A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time. 11 figs.

Solder Creep-Fatigue Interactions with Flexible Leaded Part

NASA Technical Reports Server (NTRS)

Ross, R. G., Jr.; Wen, L. C.

1994-01-01

In most electronic packaging applications it is not a single high stress event that breaks a component solder joint; rather it is repeated or prolonged load applications that result in fatigue or creep failure of the solder. The principal strain in solder joints is caused by differential expansion between the part and its mounting environment due to hanges in temperature (thermal cycles) and/or due to temperature gradients between the part and the board.

Tin soldering of aluminum and its alloys

NASA Technical Reports Server (NTRS)

Gallo, Gino

1921-01-01

A method is presented for soldering aluminum to other metals. The method adopted consists of a galvanic application to the surface of the light-metal parts to be soldered, of a layer of another metal, which, without reacting electrolytically on the aluminum, adheres strongly to the surface to which it is applied, and is, on the other hand, adapted to receive the soft solder. The metal found to meet the criteria best was iron.

Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column

NASA Astrophysics Data System (ADS)

Xu, Luhua; Han, Jung-Kyu; Liang, Jarrett Jun; Tu, K. N.; Lai, Yi-Shao

2008-06-01

To overcome the effect of current crowding on electromigration-induced pancake-type void formation in flip chip solder joints, two types of Cu column in 90μm flip chip SnAgCu solder joints have been studied. They were (1) the solder contacts the Cu column at bottom and side walls and (2) the solder wets only the bottom surface of the copper column. With a current density of 1.6×104A/cm2 at 135°C, no failure was detected after 1290h. However, the resistance increased by about 10% due to the formation of a large fraction of intermetallic compounds. We found that electromigration has accelerated the consumption rate of copper column and converted almost the entire solder joint into intermetallic compound. Mechanically, drop impact test indicates a brittle fracture failure in the intermetallic. The electromigration critical product for the intermetallic is discussed.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Rejent, J.A.; Vianco, P.T.; Woodrum, R.A.

Aging analyses were performed on solder joints from two radar units: (1) a laboratory, N57 tube-type radar unit and (2) a field-returned, B61-0, tube-type radar unit. The cumulative temperature environments experienced by the units during aging were calculated from the intermetallic compound layer thickness and the mean Pb-rich phase particle size metrics for solder joints in the units, assuming an aging time of 35 years for both radars. Baseline aging metrics were obtained from a laboratory test vehicle assembled at AS/FM and T; the aging kinetics of both metrics were calculated from isothermal aging experiments. The N57 radar unit interconnectmore » board solder joints exhibited very little aging. The eyelet solder joints did show cracking that most likely occurred at the time of assembly. The eyelet, SA1126 connector solder joints, showed some delamination between the Cu pad and underlying laminate. The B61 field-returned radar solder joints showed a nominal degree of aging. Cracking of the eyelet solder joints was observed. The Pb-rich phase particle measurements indicated additional aging of the interconnects as a result of residual stresses. Cracking of the terminal pole connector, pin-to-pin solder joint was observed; but it was not believed to jeopardize the electrical functionality of the interconnect. Extending the stockpile lifetime of the B61 tube-type radar by an additional 20 years would not be impacted by the reliability of the solder joints with respect to further growth of the intermetallic compound layer. Additional coarsening of the Pb-rich phase will increase the joints' sensitivity to thermomechanical fatigue.« less

Microstructure and Mechanical Properties of Tin-Bismuth Solder Reinforced by Aluminum Borate Whiskers

NASA Astrophysics Data System (ADS)

Wang, Jun; Wei, Hongmei; He, Peng; Lin, Tiesong; Lu, Fengjiao

2015-10-01

Tin-bismuth solder has emerged as a promising lead-free alternative to tin-lead solder, especially for low-temperature packaging applications. However, the intrinsic brittleness of tin-bismuth solder alloy, aggravated by the coarse bismuth-rich phase and the thick interfacial intermetallic layer, notably limits the mechanical performance of the bonded joints. In this work, the microstructure and mechanical performance of solder joints were improved by adding 3.2 vol.% aluminum borate whiskers to the tin-bismuth solder alloy. This whisker-reinforced composite solder was fabricated through a simple process. Typically, 25- μm to 75- μm tin-bismuth particles were mixed with a small amount of aluminum borate whiskers with diameter of 0.5 μm to 1.5 μm and length of 5 μm to 15 μm. The addition of whiskers restrained the formation of coarse brittle bismuth-rich phase and decreased the lamellar spacing from 0.84 μm to 7.94 μm to the range of 0.22 μm to 1.80 μm. Moreover, the growth rate of the interfacial intermetallic layer during the remelting treatment decreased as well. The joint shear strength increased from 19.4 MPa to 24.7 MPa, and only declined by 4.9% (average, -5.9% to 15.8%) after the tenth remelting, while the shear strength of the joint without whiskers declined by 31.5% (average, 10.1-44.1%). The solder alloy was reinforced because of their high strength and high modulus and also the refinement effect on the solder alloy microstructure.

Dye-enhanced protein solders and patches in laser-assisted tissue welding.

PubMed

Small, W; Heredia, N J; Maitland, D J; Da Silva, L B; Matthews, D L

1997-01-01

This study examines the use of dye-enhanced protein bonding agents in 805 nm diode laser-assisted tissue welding. A comparison of an albumin liquid solder and collagen solid-matrix patches used to repair arteriotomies in an in vitro porcine model is presented. Extrinsic bonding media in the form of solders and patches have been used to enhance the practice of laser tissue welding. Preferential absorption of the laser wavelength has been achieved by the incorporation of chromophores. Both the solder and the patch included indocyanine green dye (ICG) to absorb the 805 nm continuous-wave diode laser light used to perform the welds. Solder-mediated welds were divided into two groups (high power/short exposure and low power/long exposure), and the patches were divided into three thickness groups ranging from 0.1 to 1.3 mm. The power used to activate the patches was constant, but the exposure time was increased with patch thickness. Burst pressure results indicated that solder-mediated and patched welds yielded similar average burst strengths in most cases, but the patches provided a higher success rate (i.e., more often exceeded 150 mmHg) and were more consistent (i.e., smaller standard deviation) than the solder. The strongest welds were obtained using 1.0-1.3 mm thick patches, while the high power/short exposure solder group was the weakest. Though the solder and patches yielded similar acute weld strengths, the solid-matrix patches facilitated the welding process and provided consistently strong welds. The material properties of the extrinsic agents influenced their performance.

Electromigration Critical Product to Measure Effect of Underfill Material in Suppressing Bi Segregation in Sn-58Bi Solder

NASA Astrophysics Data System (ADS)

Zhao, Xu; Takaya, Satoshi; Muraoka, Mikio

2017-08-01

Recently, we detected length-dependent electromigration (EM) behavior in Sn-58Bi (SB) solder and revealed the existence of Bi back-flow, which retards EM-induced Bi segregation and is dependent on solder length. The cause of the back-flow is attributed to an oxide layer formed on the SB solder. At present, underfill (UF) material is commonly used in flip-chip packaging as filler between chip and substrate to surround solder bumps. In this study, we quantitatively investigated the effect of UF material as a passivation layer on EM in SB solder strips. EM tests on SB solder strips with length of 50 μm, 100 μm, and 150 μm were conducted simultaneously. Some samples were coated with commercial thermosetting epoxy UF material, which acted as a passivation layer on the Cu-SB-Cu interconnections. The value of the critical product for SB solder was estimated to be 38 A/cm to 43 A/cm at 353 K to 373 K without UF coating and 59 A/cm at 373 K with UF coating. The UF material acting as a passivation layer suppressed EM-induced Bi segregation and increased the threshold current density by 37% to 55%. However, at very high current density, this effect became very slight. In addition, Bi atoms can diffuse to the anode side through the Sn phase, hence addition of microelements to the Sn phase to form obstacles, such as intermetallic compounds, may retard Bi segregation in SB solder.

Joint Lead-Free Solder Test Program for High Reliability Military and Space Applications

NASA Technical Reports Server (NTRS)

Brown, Christina

2004-01-01

Current and future space and defense systems face potential risks from the continued use of tin-lead solder, including: compliance with current environmental regulations, concerns about potential environmental legislation banning lead-containing products, reduced mission readiness, and component obsolescence with lead surface finishes. For example, the United States Environmental Protection Agency (USEPA) has lowered the Toxic Chemical Release reporting threshold for lead to 100 pounds. Overseas, the Waste Electrical and Electronic Equipment (WEEE) and the Restriction on Hazardous Substances (RoHS) Dicctives in Europe and similar mandates in Japan have instilled concern that a legislative body will prohibit the use of lead in aerospace/military electronics soldering. Any potential banning of lead compounds could reduce the supplier base and adversely affect the readiness of missions led by the National Aeronautics and Space Administration (NASA) and the U.S. Department of Defense (DoD). Before considering lead-free electronics for system upgrades or future designs, however, it is important for the DoD and NASA to know whether lead-free solders can meet their systems' requirements. No single lead-free solder is likely to qualify for all defense and space applications. Therefore, it is important to validate alternative solders for discrete applications. As a result of the need for comprehensive test data on the reliability of lead-free solders, a partnership was formed between the DoD, NASA, and several original equipment manufactures (OEMs) to conduct solder-joint reliability (laboratory) testing of three lead-free solder alloys on newly manufactured and reworked circuit cards to generate performance data for high-reliability (IPC Class 3) applications.

Multiwire conductor having greatly increased interwire resistance and method for making same

DOEpatents

Luhman, T.; Suenaga, M.

1982-03-15

An improved multiwire conductor of the type which is mechanically stabilized by a tin based solder filler is described. A solder filled conductor is heated to a temperature above its melting point for a period long enough to allow a substantial amount of copper to be dissolved from the wires comprising the conductor. The copper forms the brittle intermetallic compound Cu/sub 5/Sn/sub 6/ with tin in the solder. After cooling the conductor is flexed causing a random cracking of the solder, and thereby increasing the interwire resistance of the conductor. The subject invention is particularly adapted for use with braided, ribbon-type solder filled superconductors.

Induction soldering of photovoltaic system components

DOEpatents

Kumaria, Shashwat; de Leon, Briccio

2015-11-17

A method comprises positioning a pair of photovoltaic wafers in a side-by-side arrangement. An interconnect is placed on the pair of wafers such that the interconnect overlaps both wafers of the pair, solder material being provided between the interconnect and the respective wafers. A solder head is then located adjacent the interconnect, and the coil is energized to effect inductive heating of the solder material. The solder head comprises an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil. The magnetic field concentrator defines a passage extending axially through the eye of the coil, and may be of a material with a high magnetic permeability.

The Failure Models of Lead Free Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Low-G and High-G Drop Impact

NASA Astrophysics Data System (ADS)

Gu, Jian; Lei, YongPing; Lin, Jian; Fu, HanGuang; Wu, Zhongwei

2017-02-01

The reliability of Sn-3.0Ag-0.5Cu (SAC 305) solder joint under a broad level of drop impacts was studied. The failure performance of solder joint, failure probability and failure position were analyzed under two shock test conditions, i.e., 1000 g for 1 ms and 300 g for 2 ms. The stress distribution on the solder joint was calculated by ABAQUS. The results revealed that the dominant reason was the tension due to the difference in stiffness between the print circuit board and ball grid array, and the maximum tension of 121.1 MPa and 31.1 MPa, respectively, under both 1000 g or 300 g drop impact, was focused on the corner of the solder joint which was located in the outmost corner of the solder ball row. The failure modes were summarized into the following four modes: initiation and propagation through the (1) intermetallic compound layer, (2) Ni layer, (3) Cu pad, or (4) Sn-matrix. The outmost corner of the solder ball row had a high failure probability under both 1000 g and 300 g drop impact. The number of failures of solder ball under the 300 g drop impact was higher than that under the 1000 g drop impact. The characteristic drop values for failure were 41 and 15,199, respectively, following the statistics.

Interfacial reactions and compound formation of Sn-Ag-Cu solders by mechanical alloying on electroless Ni-P/Cu under bump metallization

NASA Astrophysics Data System (ADS)

Kao, Szu-Tsung; Duh, Jenq-Gong

2005-08-01

Electroless Ni-P under bump metallization (UBM) has been widely used in electronic interconnections due to the good diffusion barrier between Cu and solder. In this study, the mechanical alloying (MA) process was applied to produce the SnAgCu lead-free solder pastes. Solder joints after annealing at 240°C for 15 min were employed to investigate the evolution of interfacial reaction between electroless Ni-P/Cu UBM and SnAgCu solder with various Cu concentrations ranging from 0.2 to 1.0 wt.%. After detailed quantitative analysis with an electron probe microanalyzer, the effect of Cu content on the formation of intermetallic compounds (IMCs) at SnAgCu solder/electroless Ni-P interface was evaluated. When the Cu concentration in the solder was 0.2 wt.%, only one (Ni, Cu)3Sn4 layer was observed at the solder/electroless Ni-P interface. As the Cu content increased to 0.5 wt.%, (Cu, Ni)6Sn5 formed along with (Ni, Cu)3Sn4. However, only one (Cu, Ni)6Sn5 layer was revealed, if the Cu content was up to 1 wt.%. With the aid of microstructure evolution, quantitative analysis, and elemental distribution by x-ray color mapping, the presence of the Ni-Sn-P phase and P-rich layer was evidenced.

Thermomechanical fatigue life prediction for several solders

NASA Astrophysics Data System (ADS)

Wen, Shengmin

Since solder connections operate at high homologous temperature, solders are high temperature materials. This feature makes their mechanical behavior and fatigue phenomena unique. Based on experimental findings, a physical damage mechanism is introduced for solders. The mechanism views the damage process as a series of independent local damage events characterized by the failure of individual grains, while the structural damage is the eventual percolation result of such local events. Fine's dislocation energy density concept and Mura's microcrack initiation theory are adopted to derive the fatigue formula for an individual grain. A physical damage metric is introduced to describe the material with damage. A unified creep and plasticity constitutive model is adopted to simulate the mechanical behavior of solders. The model is cast into a continuum damage mechanics framework to simulate material with damage. The model gives good agreement with the experimental results of 96.5Pb-3.5Sn and 96.5Sn-3.5Ag solders under uniaxial strain-controlled cyclic loading. The model is convenient for implementation into commercial computational packages. Also presented is a fatigue theory with its failure criterion for solders based on physical damage mechanism. By introducing grain orientation into the fatigue formula, an m-N curve (m is Schmid factor) at constant loading condition is suggested for fatigue of grains with different orientations. A solder structure is defined as fatigued when the damage metric reaches a critical threshold, since at this threshold the failed grains may form a cluster and percolate through the structure according to percolation theory. Fatigue data of 96.5Pb-3.5Sn solder bulk specimens under various uniaxial tension tests were analyzed. Results show that the theory gives consistent predictions under broad conditions, while inelastic strain theory does not. The theory is anisotropic with no size limitation to its application, which could be suitable for anisotropic small-scale (micron or nano scale) solder joints. More importantly, the theory is materials science based so that the parameters of the fatigue formula can be worked out by testing of bulk specimens while the formula can be applicable to small-scale structures. The theory suggests metallurgical control in the manufacturing process to optimize the fatigue life of solder structures.

Thermal research of infrared sight thermoelectric cooler control circuit under temperature environment

NASA Astrophysics Data System (ADS)

Gao, Youtang; Ding, Huan; Xue, Xiao; Xu, Yuan; Chang, Benkang

2010-10-01

Testing device TST-05B, which is suitable for adaptability test of semiconductor devices, electronic products and other military equipment under the condition of the surrounding air temperature rapidly changing, is used here for temperature shock test.Thermal stability technology of thermoelectric cooler control circuit infrared sight under temperature shock is studied in this paper. Model parameters and geometry is configured for ADI devices (ADN8830), welding material and PCB which are used in system. Thermoelectric cooler control circuit packaged by CSP32 distribution are simulated and analyzed by thermal shock and waveform through engineering finite element analysis software ANSYYS. Because solders of the whole model have much stronger stress along X direction than that of other directions, initial stress constraints along X direction are primarily considered when the partial model of single solder is imposed by thermal load. When absolute thermal loads stresses of diagonal nodes with maximum strains are separated from the whole model, interpolation is processed according to thermal loads circulation. Plastic strains and thermal stresses of nodes in both sides of partial model are obtained. The analysis results indicates that with thermal load circulation, maximum forces of each circulation along X direction are increasingly enlarged and with the accumulation of plastic strains of danger point, at the same time structural deformation and the location of maximum equivalent plastic strain in the solder joints at the first and eighth, the composition will become invalid in the end.

A non-contact measurement technique at the micro scale

NASA Astrophysics Data System (ADS)

Ghosh, Santaneel

During their production and normal use, electronic packages experience large temperature excursions, leading to high thermo-mechanical stress gradients that cause fatigue failure of the solder joints. In order to prevent premature failure and prolong the fatigue life of solder joints, there is a pressing need for the characterization of the solder, especially lead-free solder, at the micro-level (joint size). The characterization and modeling of solder behavior at the appropriate scale is a major issue. However, direct measurement techniques are not applicable to characterize the deformation response of solder joints because of their micro scale dimensions. Therefore, a non-contact measurement technique utilizing a Scanning Electron Microscope (SEM) in conjunction with Digital Image Correlation (DIC) has been developed. Validation was achieved by performing a four-point bending test in both an in-house optical system with DIC and inside the SEM. This non-contact measurement technique was then used to extract the stress-strain response of the solder. Mechanical tests were performed on solder joints that were created using the same type of solder balls used in the electronic industry and were representative of normal joint scales. The SEM-DIC technique has been proven to be applicable for the determining the stress-strain response of solder material at the micro-scale. This study resulted in a validated material characterization technique specifically designed for micro-scale material response. One of the main contributions of this study is that the method is a lot simpler and cheaper, yet highly effective, compared to the previous methods. This technique is also readily applicable to the measurement of the stress-strain response of any micro-scale specimen, such as other metals, polymers, etc. Also, the measured displacement field by obtained by DIC can be used as the base for calculating the strain field on the surface of a specimen.

Laser-tissue soldering with biodegradable polymer films in vitro: film surface morphology and hydration effects.

PubMed

Sorg, B S; Welch, A J

2001-01-01

Previous research introduced the concept of using biodegradable polymer film reinforcement of a liquid albumin solder for improvement of the tensile strength of repaired incisions in vitro. In this study, the effect of creating small pores in the PLGA films on the weld breaking strength is studied. Additionally, the effect of hydration on the strength of the reinforced welds is investigated. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806-nm CW diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) film was used to reinforce the solder (the controls had solder but no reinforcement). Breaking strengths were measured acutely and after hydration in saline for 1 and 2 days. The data were analyzed by ANOVA (P < 0.05) and multiple comparisons of means were performed using the Newman-Keuls test. The creation of pores in the PLGA films qualitatively improved the film flexibility without having an apparent adverse effect on the breaking strength, while the actual technique of applying the film and solder had more of an effect. The acute maximum average breaking strengths of some of the film reinforced specimens (114.7 g-134.4 g) were significantly higher (P < 0.05) than the acute maximum average breaking strength of the unreinforced control specimens (68.3 g). Film reinforced specimens were shown to have a statistically significantly higher breaking strength than unreinforced controls after 1- and 2-day hydration. Reinforcement of liquid albumin solders in laser-assisted incision repair appears to have advantages over conventional methods that do not reinforce the cohesive strength of the solder in terms of acute breaking strength and after immersion in moist environments for short periods of time. Using a film with the solder applied to one surface only may be advantageous over other techniques.

New Failure Mode of Flip-Chip Solder Joints Related to the Metallization of an Organic Substrate

NASA Astrophysics Data System (ADS)

Jang, J. W.; Yoo, S. J.; Hwang, H. I.; Yuk, S. Y.; Kim, C. K.; Kim, S. J.; Han, J. S.; An, S. H.

2015-10-01

We report a new failure phenomenon during flip-chip die attach. After reflow, flip-chip bumps were separated between the Al and Ti layers on the Si die side. This was mainly observed at the Si die corner. Transmission electron microscopy images revealed corrosion of the Al layer at the edge of the solder bump metallization. The corrosion at the metallization edge exhibited a notch shape with high stress concentration factor. The organic substrate had Cu metallization with an organic solderable preservative (OSP) coating layer, where a small amount of Cl ions were detected. A solder bump separation mechanism is suggested based on the reaction between Al and Cl, related to the flow of soldering flux. During reflow, the flux will dissolve the Cl-containing OSP layer and flow up to the Al layer on the Si die side. Then, the Cl-dissolved flux will actively react with Al, forming AlCl3. During cooling, solder bumps at the Si die corner will separate through the location of Al corrosion. This demonstrated that the chemistry of the substrate metallization can affect the thermomechanical reliability of flip-chip solder joints.

Whisker Formation on SAC305 Soldered Assemblies

NASA Astrophysics Data System (ADS)

Meschter, S.; Snugovsky, P.; Bagheri, Z.; Kosiba, E.; Romansky, M.; Kennedy, J.; Snugovsky, L.; Perovic, D.

2014-11-01

This article describes the results of a whisker formation study on SAC305 assemblies, evaluating the effects of lead-frame materials and cleanliness in different environments: low-stress simulated power cycling (50-85°C thermal cycling), thermal shock (-55°C to 85°C), and high temperature/high humidity (85°C/85% RH). Cleaned and contaminated small outline transistors, large leaded quad flat packs (QFP), plastic leaded chip carrier packages, and solder balls with and without rare earth elements (REE) were soldered to custom designed test boards with Sn3Ag0.5Cu (SAC305) solder. After assembly, all the boards were cleaned, and half of them were recontaminated (1.56 µg/cm2 Cl-). Whisker length, diameter, and density were measured. Detailed metallurgical analysis on components before assembly and on solder joints before and after testing was performed. It was found that whiskers grow from solder joint fillets, where the thickness is less than 25 µm, unless REE was present. The influence of lead-frame and solder ball material, microstructure, cleanliness, and environment on whisker characteristics is discussed. This article provides detailed metallurgical observations and select whisker length data obtained during this multiyear testing program.

Digital Soldering-Iron Tester

NASA Technical Reports Server (NTRS)

Buggle, R. N.; Metka, W. H., Jr

1984-01-01

Instrument reads tip temperature and contact potential in seconds. Tinned soldering tip touched to temperature sensitive button for 4 seconds and to voltage probe for 1 to 3 seconds. Tip temperature and voltage appear on digital displays. Instrument quickly gives assurance conditions are correct for reliable soldering.

Handling fixture for soldering round wires to FCC

NASA Technical Reports Server (NTRS)

Loggins, R.; Martineck, H. G.

1971-01-01

Fixture holds flat conductor cable and wires in position until after soldering of contacting conductor ends and potting of junctions. Device provides for proper spacing of wires and adequate access for soldered joints during fabrication, and positions mold halves during potting operation.

Requirements for soldered electrical connections

NASA Technical Reports Server (NTRS)

1992-01-01

This publication is applicable to NASA programs involving solder connections for flight hardware, mission essential support equipment, and elements thereof. This publication sets forth hand and wave soldering requirements for reliable electrical connections. The prime consideration is the physical integrity of solder connections. Special requirements may exist which are not in conformance with the requirements of this publication. Design documentation contains the detail for these requirements, and they take precedence over conflicting portions of this publication when they are approved in writing by the procuring NASA installation.

Conversion from solvent rinsable fluxes to aqueous rinsable fluxes for hot oil solder leveling

NASA Astrophysics Data System (ADS)

1992-03-01

A water rinsable flux was evaluated for hot oil solder leveling of printed wiring boards. The previously used rosin-activated flux required a solvent containing a chlorinated hydrocarbon for removing the flux residues after soldering. The water rinsable flux requires hot water or a solution of hot detergent for removing flux residues after smoldering. The water rinsable flux produced an acceptable soldered surface. Flux residues were removed by either hot water (120 F) or a solution of hot detergent (120 F).

Solder dross removal apparatus

NASA Technical Reports Server (NTRS)

Webb, Winston S. (Inventor)

1990-01-01

An automatic dross removal apparatus is disclosed for removing dross from the surface of a solder bath in an automated electric component handling system. A rotatable wiper blade is positioned adjacent the solder bath which skims the dross off of the surface prior to the dipping of a robot conveyed component into the bath. An electronic control circuit causes a motor to rotate the wiper arm one full rotational cycle each time a pulse is received from a robot controller as a component approaches the solder bath.

Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder

NASA Astrophysics Data System (ADS)

He, Xiaofei; Azarian, Michael H.; Pecht, Michael G.

2011-09-01

To evaluate the current leakage and electrochemical migration behavior on printed circuit boards with eutectic tin-lead and lead-free solder, IPC B-24 comb structures were exposed to 65°C and 88% relative humidity conditions under direct-current (DC) bias for over 1500 h. These boards were processed with either Sn-3.0Ag-0.5Cu solder or Sn-37Pb solder. In addition to solder alloy, board finish (organic solderability preservative versus lead-free hot air solder leveling), spacing (25 mil versus 12.5 mil), and voltage (40 V versus 5 V bias) were also assessed by using in situ measurements of surface insulation resistance (SIR) and energy-dispersive spectroscopy after testing. It was shown that an initial increase of SIR was caused by consumption of electroactive species on the surface, intermittent drops of SIR were caused by dendritic growth, and a long-term SIR decline was caused by electrodeposition of a metallic layer. The prolonged SIR decline of Sn-3.0Ag-0.5Cu boards was simulated by three-dimensional (3D) progressive and instantaneous nucleation models, whose predictions were compared with experimental data. Sn-37Pb boards exhibited comigration of Sn, Pb, and Cu, while Sn-3.0Ag-0.5Cu boards incurred comigration of Sn, Ag, and Cu. Among the migrated species, Sn always dominated and was observed as either a layer or in polyhedral deposits, Pb was the most common element found in the dendrites, Cu was a minor constituent, and Ag migrated only occasionally. Compared with solder alloy, board finishes played a secondary role in affecting SIR due to their complexation with or dissolution into the solder. The competing effect between electric field and spacing was also investigated.

Microstructural evolution of SiC joints soldered using Zn-Al filler metals with the assistance of ultrasound.

PubMed

Wu, Bingzhi; Leng, Xuesong; Xiu, Ziyang; Yan, Jiuchun

2018-06-01

SiC ceramics were successfully soldered with the assistance of ultrasound. Two kinds of filler metals, namely non-eutectic Zn-5Al-3Cu and eutectic Zn-5Al alloys, were used. The effects of ultrasonic action on the microstructure and mechanical properties of the soldered joints were investigated. The results showed that ultrasound could promote the wetting and bonding between the SiC ceramic and filler metals within tens of seconds. For the Zn-5Al-3Cu solder, a fully grain-refined structure in the bond layer was obtained as the ultrasonic action time increased. This may lead to a substantial enhancement in the strength of the soldered joints. For the Zn-5Al solder, the shear strength of the soldered joints was only ∼102 MPa when the ultrasonic action time was shorter, and fractures occurred in the brittle lamellar eutectic phases in the center of the bond layer. With increasing ultrasonic action time, the lamellar eutectic phase in the bond layer of SiC joints could be completely transformed to a fine non-lamellar eutectic structure. Meanwhile, the grains in the bond layer were obviously refined. Those results led to the remarkable enhancement of the shear strength of the joints (∼138 MPa) using the Zn-5Al solder, which had approached that enhancement using the Zn-5Al-3Cu solder. The enhanced mechanical properties of the joints were attributed to the significant refinement of the grains and the change in the eutectic structure in the bond layer. Prolonged enhanced heterogeneous nucleation triggered by ultrasonic cavitation is the predominant refinement mechanism of the bond metals of the SiC joints. Copyright © 2018 Elsevier B.V. All rights reserved.

The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure

NASA Astrophysics Data System (ADS)

Zribi, A.; Clark, A.; Zavalij, L.; Borgesen, P.; Cotts, E. J.

2001-09-01

The evolution of intermetallics at and near SnAgCu/Cu and SnAgCu/Ni interfaces was examined, and compared to the behavior, near PbSn/metal and Sn/metal interfaces. Two different solder compositions were considered, Sn93.6Ag4.7Cu1.7 and Sn95.5Ag3.5Cu1.0 (Sn91.8Ag5.1 Cu3.1 and Sn94.35Ag3.8Cu1.85 in atomic percent). In both cases, phase formation and growth at interfaces with Cu were very similar to those commonly observed for eutectic SnPb solder. However, the evolution of intermetallics at SnAgCu/Ni interfaces proved much more complex. The presence of the Cu in the solder dramatically altered the phase selectivity at the solder/Ni interface and affected the growth kinetics of intermetallics. As long as sufficient Cu was available, it would combine with Ni and Sn to form (Cu,Ni)6)Sn5 which grew instead of the Ni3Sn4 usually observed in PbSn/Ni and Sn/Ni diffusion couples. This growing phase would, however, eventually consume essentially all of the available Cu in the solder. Because the mechanical properties of Sn-Ag-Cu alloys, depend upon the Cu content, this consumption can be expected to alter the mechanical properties of these Pb-free solderjoints. After depletion of the Cu from the solder, further annealing then gradually transformed the (Cu,Ni)6Sn5 phase into a (Ni,Cu)3Sn4 phase.

Analysis of lead free tin-silver-copper and tin-lead solder wetting reactions

NASA Astrophysics Data System (ADS)

Anson, Scott J.

Lead free electronics soldering is driven by a combination of health and environmental concerns, international legislation and marketing pressure by lead free electronics manufacturing competitors. Since July 1, 2006, companies that do not comply with the European Union legislation are not able to sell circuit assemblies with lead solder in the European Union. China has developed its own regulations, based on the European Union documents with a compliance date of March 1, 2007. Extensive testing by the electronics community has determined that the Sn - Ag - Cu (SAC) family of alloys is the preferred choice for lead free Surface Mount Technology (SMT) soldering. The 96.5Sn/3.0Ag/0.5Cu alloy was used in this study. Lead free soldering requires an increase in reflow peak temperatures which further aggravates component moisture sensitivity risks and thereby decreases assembly yield. Prior research has revealed an enhanced solder spreading phenomena at lower peak temperature and shorter time above liquidus with 63Sn/37Pb solder. This current research investigated solder wetting reactions in 63Sn/37Pb and 96.5Sn/3.0Ag/0.5Cu (SAC305) using materials and manufacturing systems that are industry relevant. The objective was to advance the knowledge base of metal wetting while developing a reflow assembly process that minimized the component defect rates. The components are damaged during reflow by popcorn delamination, which is the result of moisture absorption and subsequent rapid evaporation. A classical Design Of Experiments (DOE) approach was used, with wetted area as the response variable. Outside of the DOE, substrate dissolution depth, and substrate surface new phase formation (reaction product) distance from the triple line (solder wetting front) and reaction product thickness in the solder joint (under the solder) were also analyzed. The samples were analyzed for correlation of reflow peak temperature, reflow Time Above Liquidus (TAL), wetted area, reaction product distance from the triple line, substrate dissolution depth, triple line ridge (substrate protrusion into the molten solder) formation and reaction product thickness in the solder joint. The general results are (1) an improved understanding of 63Sn/37Pb and 96.5Sn/3.0Ag/0.5Cu WT% solder wetting reactions, (2) reduced 63Sn/37Pb and SAC reflow peak temperatures, and thereby reduced risk of moisture sensitivity damage to components. The significance of these results are (1) enhanced applied understanding of the complexity of molten metal wetting a substrate and (2) enhanced assembly yield due to minimal aggravation of component moisture sensitivity. The uniqueness of this research is that it utilized a holistic Systems Science approach which provided a combined microscopic (substrate and molten metal reactions) and macroscopic (wetted area) analysis of metal wetting using materials and processes that were directly relevant to electronics manufacturing.

An evaluation of the spring finger solder joints on SA1358-10 and SA2052-4 connector assemblies (MC3617,W87).

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kilgo, Alice C.; Vianco, Paul Thomas; Hlava, Paul Frank

2006-08-01

The SA1358-10 and SA2052-4 circular JT Type plug connectors are used on a number of nuclear weapons and Joint Test Assembly (JTA) systems. Prototype units were evaluated for the following specific defects associated with the 95Sn-5Sb (Sn-Sb, wt.%) solder joint used to attach the beryllium-copper (BeCu) spring fingers to the aluminum (Al) connector shell: (1) extended cracking within the fillet; (2) remelting of the solder joint during the follow-on, soldering step that attached the EMR adapter ring to the connector shell (and/or soldering the EMR shell to the adapter ring) that used the lower melting temperature 63Sn-37Pb (Sn-Pb) alloy; andmore » (3) spalling of the Cd (Cr) layer overplating layer from the fillet surface. Several pedigrees of connectors were evaluated, which represented older fielded units as well as those assemblies that were recently constructed at Kansas City Plant. The solder joints were evaluated that were in place on connectors made with the current soldering process as well as an alternative induction soldering process for attaching the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely reflected the different extents to which the connector was mated to its counterpart assembly. In all cases, the spring finger solder joints on the SA1358-10 connectors were remelted as a result of the subsequent EMR adapter ring attachment process. Spalling of the Cd (Cr) overplating layer was also observed for these connectors, which was a consequence of the remelting activity. On the other hand, the SA2052-4 connector did not exhibit evidence of remelting of the spring finger solder joint. The Cd (Cr) layer did not show signs of spalling. These results suggested that, due to the size of the SA1358-10 connector, any of the former or current soldering processes used to attach the EMR adapter ring and/or EMR shell to the connector shell, requires a level of heat energy that will always result in the remelting of the spring finger solder joint attached with either the Sn-Ag or the Sn-Sb alloy. Lastly, it was construed that the induction soldering process, which is used to attach the EMR adapter ring onto the shell, was more likely to have caused the remelting event rather than the more localized heat source of the hand soldering iron used to attach the EMR shell to the adapter ring.« less

Solder glass sealing technology for use in packaging of fiber optic sensors

NASA Astrophysics Data System (ADS)

Kreutzmann, Gerd

1990-08-01

The solder glass sealing technology is an alternative to the direct sealing method of the socalled hboptocansu. Using solder glass for the junction of glass and the metal can the temperature at about 500 °C does not destroy the optical quality of the precision glass components. The glass can also be coated with an antireflective layer and even the sealing of filterglass is possible. In cases where coupling losses can't be tolerated, the fiber has to be fed directly through the wall into the housing. Fiber feedthroughs, using solder glass for the sealing of the fiber into a metal tube, are commonly metal soldered or welded into the wall and the fiber surface is directly leading to the semiconductor.

Reliability analysis of different structure parameters of PCBA under drop impact

NASA Astrophysics Data System (ADS)

Liu, P. S.; Fan, G. M.; Liu, Y. H.

2018-03-01

The establishing process of PCBA is modelled by finite element analysis software ABAQUS. Firstly, introduce the Input-G method and the fatigue life under drop impact are introduced and the mechanism of the solder joint failure in the process of drop is analysed. The main reason of solder joint failure is that the PCB component is suffering repeated tension and compression stress during the drop impact. Finally, the equivalent stress and peel stress of different solder joint and plate-level components under different impact acceleration are also analysed. The results show that the reliability of tin-silver copper joint is better than that of tin- lead solder joint, and the fatigue life of solder joint expectancy decrease as the impact pulse amplitude increases.

Hot-air soldering technique prevents overheating of electrical components

NASA Technical Reports Server (NTRS)

1964-01-01

By using a hot-air gun with a small orifice, heat may be localized to the soldering area of the chassis. The solder is placed around the capacitor which is inserted in the mounting hole so the ring is in contact with the chassis.

Solder creep-fatigue interactions with flexible leaded parts

NASA Technical Reports Server (NTRS)

Ross, R. G., Jr.; Wen, L. C.; Mon, G. R.; Jetter, E.

1992-01-01

With flexible leaded parts, the solder-joint failure process involves a complex interplay of creep and fatigue mechanisms. To better understand the role of creep in typical multi-hour cyclic loading conditions, a specialized non-linear finite-element creep simulation computer program has been formulated. The numerical algorithm includes the complete part-lead-solder-PWB system, accounting for strain-rate dependence of creep on applied stress and temperature, and the role of the part-lead dimensions and flexibility that determine the total creep deflection (solder strain range) during stress relaxation. The computer program has been used to explore the effects of various solder creep-fatigue parameters such as lead height and stiffness, thermal-cycle test profile, and part/board differential thermal expansion properties. One of the most interesting findings is the strong presence of unidirectional creep-ratcheting that occurs during thermal cycling due to temperature dominated strain-rate effects. To corroborate the solder fatigue model predictions, a number of carefully controlled thermal-cycle tests have been conducted using special bimetallic test boards.

Ab initio-aided CALPHAD thermodynamic modeling of the Sn-Pb binary system under current stressing

PubMed Central

Lin, Shih-kang; Yeh, Chao-kuei; Xie, Wei; Liu, Yu-chen; Yoshimura, Masahiro

2013-01-01

Soldering is an ancient process, having been developed 5000 years ago. It remains a crucial process with many modern applications. In electronic devices, electric currents pass through solder joints. A new physical phenomenon – the supersaturation of solders under high electric currents – has recently been observed. It involves (1) un-expected supersaturation of the solder matrix phase, and (2) the formation of unusual “ring-shaped” grains. However, the origin of these phenomena is not yet understood. Here we provide a plausible explanation of these phenomena based on the changes in the phase stability of Pb-Sn solders. Ab initio-aided CALPHAD modeling is utilized to translate the electric current-induced effect into the excess Gibbs free energies of the phases. Hence, the phase equilibrium can be shifted by current stressing. The Pb-Sn phase diagrams with and without current stressing clearly demonstrate the change in the phase stabilities of Pb-Sn solders under current stressing. PMID:24060995

Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element

NASA Astrophysics Data System (ADS)

Yang, S. C.; Ho, C. E.; Chang, C. W.; Kao, C. R.

2007-04-01

Massive spalling of intermetallic compounds has been reported in the literature for several solder/substrate systems, including SnAgCu soldered on Ni substrate, SnZn on Cu, high-Pb PbSn on Cu, and high-Pb PbSn on Ni. In this work, a unified thermodynamic argument is proposed to explain this rather unusual phenomenon. According to this argument, two necessary conditions must be met. The number one condition is that at least one of the reactive constituents of the solder must be present in a limited amount, and the second condition is that the soldering reaction has to be very sensitive to its concentration. With the growth of intermetallic, more and more atoms of this constituent are extracted out of the solder and incorporated into the intermetallic. As the concentration of this constituent decreases, the original intermetallic at the interface becomes a nonequilibrium phase, and the spalling of the original intermetallic occurs.

Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yang, S. C.; Ho, C. E.; Chang, C. W.

2007-04-15

Massive spalling of intermetallic compounds has been reported in the literature for several solder/substrate systems, including SnAgCu soldered on Ni substrate, SnZn on Cu, high-Pb PbSn on Cu, and high-Pb PbSn on Ni. In this work, a unified thermodynamic argument is proposed to explain this rather unusual phenomenon. According to this argument, two necessary conditions must be met. The number one condition is that at least one of the reactive constituents of the solder must be present in a limited amount, and the second condition is that the soldering reaction has to be very sensitive to its concentration. With themore » growth of intermetallic, more and more atoms of this constituent are extracted out of the solder and incorporated into the intermetallic. As the concentration of this constituent decreases, the original intermetallic at the interface becomes a nonequilibrium phase, and the spalling of the original intermetallic occurs.« less

Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests

NASA Astrophysics Data System (ADS)

You, Taehoon; Kim, Yunsung; Kim, Jina; Lee, Jaehong; Jung, Byungwook; Moon, Jungtak; Choe, Heeman

2009-03-01

Despite being expensive and time consuming, board-level drop testing has been widely used to assess the drop or impact resistance of the solder joints in handheld microelectronic devices, such as cellphones and personal digital assistants (PDAs). In this study, a new test method, which is much simpler and quicker, is proposed. The method involves evaluating the elastic strain energy and relating it to the impact resistance of the solder joint by considering the Young’s modulus of the bulk solder and the fracture stress of the solder joint during a ball pull test at high strain rates. The results show that solder joints can be ranked in order of descending elastic strain energy as follows: Sn-37Pb, Sn-1Ag-0.5Cu, Sn-3Ag-0.5Cu, and Sn-4Ag-0.5Cu. This order is consistent with the actual drop performances of the samples.

Effect of gap distance on tensile strength of preceramic base metal solder joints.

PubMed

Fattahi, Farnaz; Motamedi, Milad

2011-01-01

In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

Laser-activated protein bands for peripheral nerve repair

NASA Astrophysics Data System (ADS)

Lauto, Antonio; Trickett, Rodney I.; Malik, Richard; Dawes, Judith M.; Owen, Earl R.

1996-01-01

A 100 micrometer core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the protein based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 plus or minus 5 min. (n equals 24) compared to 23 plus or minus 9 min (n equals 13) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 plus or minus 5 g, while microsutured nerves had a tensile strength of 40 plus or minus 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study, with a total of fifty-seven adult male wistar rats, compared laser solder repaired tibial nerves to conventional microsuture repair. Twenty-four laser soldered nerves and thirteen sutured nerves were characterized at three months and showed successful regeneration with average compound muscle action potentials (CMAP) of 2.4 plus or minus 0.7 mV and 2.7 plus or minus 0.8 mV respectively. Histopathology of the in vivo study, confirmed the comparable regeneration of axons in laser and suture operated nerves. A faster, less damaging and long lasting laser based anastomotic technique is presented.

Real-time wetting dynamics and interfacial chemistry in low-melting 57Bi-42Sn-1Ag solder paste on Ni-Au

NASA Astrophysics Data System (ADS)

Bozack, M. J.

2004-11-01

We report the observation of real-time, in situ, wetting and spreading dynamics for 57Bi-42Sn-1Ag solder paste on Ni-Au surfaces during melting in a scanning electron microscope. The 57Bi-42Sn-1Ag is a low melting (139 °C) Pb-free eutectic alloy currently under consideration by automobile manufacturers for use in instrument displays. We find that, while there is excellent wetting of 57Bi-42Sn-1Ag solder paste on Ni-Au, there is almost no spreading. A large amount of Bi segregates to the surface of 57Bi-42Sn-1Ag solder balls during the sintering process. At melting, excessive flux outgassing and pooling are observed, several melted solder balls float on top of the flux, and substantial elemental segregation occurs during the first minutes of wetting. Neither Ni nor Au fully intermixes throughout the alloy at the interface within seconds of wetting. Bi does not move outward with the expanding alloy front. This combination of detrimental effects forms voids in the solder paste, contributes to low reliability of solder joints, and complicates the materials science at the solder-substrate interface as shown by Auger electron spectroscopy. Reliability work in progress (3000 cycles) shows that 57Bi-42Sn-1Ag on Ni-Au is less reliable than eutectic Sn-37Pb on Ni-Au for 2512 chip resistors cycled from -40 to 125 °C.

Enhanced laser tissue soldering using indocyanine green chromophore and gold nanoshells combination.

PubMed

Khosroshahi, Mohammad E; Nourbakhsh, Mohammad S

2011-08-01

Gold nanoshells (GNs) are new materials that have an optical response dictated by the plasmon resonance. The wavelength at which the resonance occurs depends on the core and shell sizes. The purposes of this study were to use the combination of indocyanine green (ICG) and different concentration of gold nanoshells for skin tissue soldering and also to examine the effect of laser soldering parameters on the properties of repaired skin. Two mixtures of albumin solder and different combinations of ICG and gold nanoshells were prepared. A full thickness incision of 2 × 20 mm(2) was made on the surface and after addition of mixtures it was irradiated by an 810 nm diode laser at different power densities. The changes of tensile strength (σ(t)) due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. The results showed at constant laser power density (I), σ(t) of repaired incisions increases by increasing the concentration of gold nanoshells in solder, Ns, and decreasing Vs. It was demonstrated that laser soldering using combination of ICG + GNs could be practical provided the optothermal properties of the tissue are carefully optimized. Also, the tensile strength of soldered skin is higher than skins that soldered with only ICG or GNs. In our case, this corresponds to σ(t) = 1800 g cm(-2) at I ∼ 47 Wcm(-2), T ∼ 85 [ordinal indicator, masculine]C, Ns = 10, and Vs = 0.3 mms(-1).

Closure of skin incisions in rabbits by laser soldering II: Tensile strength.

PubMed

Brosh, Tamar; Simhon, David; Halpern, Marisa; Ravid, Avi; Vasilyev, Tamar; Kariv, Naam; Nevo, Zvi; Katzir, Abraham

2004-01-01

The basic characteristic property of wound closure is the immediate and long-term tensile strength (LTS). The objective of the current study was to compare tissue laser soldering to other available methods (i.e., cyanoacrylate glues and sutures) in the performance and outcome of wound closure and reparative healing process, with an emphasis on the immediate and LTS. The animals were divided into three groups according to the type and details of the closure procedure. Group A: laser treatments at different temperatures were compared to sutured incisions, emphasizing the LTS after 10 days. Group B: laser soldering at 65 +/- 5 degrees C was compared to chemical glues (i.e., Histoacryl and Dermabond), emphasizing the immediate tensile strength (ITS). Group C: LTS of laser soldered incisions was compared to that of sutured incisions at various time intervals emphasizing LTS (3, 7, 14, 28 days). Group A: LTS at 60 degrees C exhibited the highest values (0.48 MPa). Group B: no ITS difference was detected between laser soldering and chemical glues. Group C: soldered incisions at 65 degrees C exhibited higher LTS (1.81 MPa) than that of sutured incisions (1.08 MPa) (P < 0.043). Temperature-controlled laser soldering at 65 degrees C provided sufficient ITS and higher bonding LTS values compared with sutures, resulting in better wound healing characteristics. The laser soldering system presented here should be tested on larger animal models before adopting it for clinical usage.

Spatiotemporal modeling of laser tissue soldering using photothermal nanocomposites.

PubMed

Mushaben, Madaline; Urie, Russell; Flake, Tanner; Jaffe, Michael; Rege, Kaushal; Heys, Jeffrey

2018-02-01

Laser tissue soldering using photothermal solders is a technology that facilitates rapid sealing using heat-induced changes in the tissue and the solder material. The solder material is made of gold nanorods embedded in a protein matrix patch that can be placed over the tissue rupture site and heated with a laser. Although laser tissue soldering is an attractive approach for surgical repair, potential photothermal damage can limit the success of this approach. Development of predictive mathematical models of photothermal effects including cell death, can lead to more efficient approaches in laser-based tissue repair. We describe an experimental and modeling investigation into photothermal solder patches for sealing porcine and mouse cadaver intestine sections using near-infrared laser irradiation. Spatiotemporal changes in temperature were determined at the surface as well as various depths below the patch. A mathematical model, based on the finite element method, predicts the spatiotemporal temperature distribution in the patch and surrounding tissue, as well as concomitant cell death in the tissue is described. For both the porcine and mouse intestine systems, the model predicts temperatures that are quantitatively similar to the experimental measurements with the model predictions of temperature increase often being within a just a few degrees of experimental measurements. This mathematical model can be employed to identify optimal conditions for minimizing healthy cell death while still achieving a strong seal of the ruptured tissue using laser soldering. Lasers Surg. Med. 50:143-152, 2018. © 2017 Wiley Periodicals, Inc. © 2017 Wiley Periodicals, Inc.

Orthodontic soldering techniques: aspects of quality assurance in the dental laboratory.

PubMed

Heidemann, Jutta; Witt, Emil; Feeg, Martin; Werz, Rainer; Pieger, Klaus

2002-07-01

In Germany, the dental technician is required by the Medical Products Act (MPG) to produce workpieces of high safety and quality and to document these properties. Soldering continues to be the prevailing joining technique in the dental laboratory, although problems arise from the susceptibility to corrosion and the low strength of soldered joints. This study aimed to reveal sources of defects in dental laboratory workpieces in order to achieve optimization in terms of quality assurance. The joints were produced by various dental technicians using three different soldering techniques. These joining techniques were investigated for their quality and their corrosion properties during immersion in ferric chloride, orthodontic appliance cleanser, and artificial saliva. Observance of the soldering instructions by the dental technicians was checked. Corrosion attack was confirmed by scanning electron microscopy and by measuring the ion concentrations of copper, silver and zinc in the corrosive agents, using atomic emission spectroscopy with stimulation by inductively coupled plasma (ICP-AES analysis). Incomplete filling of the soldering gap, porosities resulting from the production process, poor corrosion properties, and in particular a high variability of the measured values point to insufficient reliability of two soldering techniques. Variations in quality were also detected among the technicians' modes of operation. The analyses confirm the need for quality assurance of soldering techniques and for increased support for alternative joining techniques such as laser welding in the future. The results of the studies on laser welding are presented in a separate publication.

Safer Soldering Guidelines and Instructional Resources

ERIC Educational Resources Information Center

Love, Tyler S.; Tomlinson, Joel

2018-01-01

Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

A simple, efficient resistance soldering apparatus

NASA Technical Reports Server (NTRS)

Vermillion, C. M.

1972-01-01

Multiple resistance soldering device for attaching electric leads to multiple terminal block connectors uses power source with one terminal connected to working probe, and other terminal attached to connector carrying common pins for lead insertion. Mating of male and female connectors solders each lead to individual cup pin.

Experiments and Demonstrations with Soldering Guns.

ERIC Educational Resources Information Center

Henry, Dennis C.; Danielson, Sarah A.

1993-01-01

Discusses the essential electrical characteristics of a particular model of soldering gun. Presents four classroom demonstrations that utilize the soldering gun to test the following geometrics of wire loops as electromagnets: (1) the original tip; (2) a single circular loop; (3) a Helmholtz coil; and (4) the solenoid. (MDH)

Water Ingress Failure Analysis of Whistler II Unit

DTIC Science & Technology

2014-08-01

contaminants getting in the water, possibly from the batteries, the solder flux, some other means, or some combination. The Whistler Unit was...White residue was present on many of the solder joints. Per Art Harrison, this is consistent with exposure of solder flux to moisture. c

30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

Code of Federal Regulations, 2014 CFR

2014-07-01

... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

Thermodynamic Description of the Quaternary Ag-Bi-Cu-Sn System

NASA Astrophysics Data System (ADS)

Gierlotka, Wojciech

2018-01-01

Lead-free soldering is an important part of electronic devices production. New lead-free solders that replace classical Sn-37Pb solder are still under development. Thermodynamic modeling makes the development process faster, cheaper and more environmentally friendly due to predictions of phases stabilities and phases transformations. In this work, the thermodynamic description of quaternary Ag-Bi-Cu-Sn system is presented. The thermodynamic assessment of promising lead-free quaternary solder was prepared using the Calphad approach. A good agreement between available experimental data and calculation was found.

Phase diagrams for lead-free solder alloys

NASA Astrophysics Data System (ADS)

Kattner, Ursula R.

2002-12-01

The need for new, improved solder alloys and a better understanding of reactions during the soldering process grows steadily as the need for smaller and more reliable electronic products increases. Information obtained from phase equilibria data and thermodynamic calculations has proven to be an important tool in the design and understanding of new lead-free solder alloys. A wide range of candidate alloys can be rapidly evaluated for proper freezing ranges, susceptibility to contamination effects, and reactions with substrate materials before the expensive process of preparing and testing candidate alloys is initiated.

Microstructural Evolution and Tensile Properties of SnAgCu Mixed with Sn-Pb Solder Alloys (Preprint)

DTIC Science & Technology

2009-03-01

AFRL-RX-WP-TP-2009-4132 MICROSTRUCTURAL EVOLUTION AND TENSILE PROPERTIES OF SnAgCu MIXED WITH Sn-Pb SOLDER ALLOYS (PREPRINT...PROPERTIES OF SnAgCu MIXED WITH Sn-Pb SOLDER ALLOYS (PREPRINT) 5a. CONTRACT NUMBER FA8650-04-C-5704 5b. GRANT NUMBER 5c. PROGRAM ELEMENT...ANSI Std. Z39-18 Microstructural evolution and tensile properties of SnAgCu mixed with Sn-Pb solder alloys Fengjiang Wang,1 Matthew O’Keefe,1,2 and

Proceedings of the Annual Soldering/Manufacturing Seminar (10th) Held in China Lake, California on 19-20 February 1986

DTIC Science & Technology

1986-02-19

solderability testing what it wants it to be. We might be preparing to be too demanding. We cannot demand what is unattain- able, but must first determine what ...warehouse environment. We earlier pointed out the lack of IMC growth with the solder-dipped parts. So what is the mechanism for solder consumption...the vendors’ facilities, insight was gained into * what was or was not possible for them to do. In turn, it was then possible to offer suggestions and

Solder dross removal apparatus

NASA Technical Reports Server (NTRS)

Webb, Winston S. (Inventor)

1992-01-01

An automatic dross removal apparatus (10) is disclosed for removing dross from the surface of a solder bath (22) in an automated electric component handling system. A rotatable wiper blade (14) is positioned adjacent the solder bath (22) which skims the dross off of the surface prior to the dipping of a robot conveyed component into the bath. An electronic control circuit (34) causes a motor (32) to rotate the wiper arm (14) one full rotational cycle each time a pulse is received from a robot controller (44) as a component approaches the solder bath (22).

Bond strength of luting cement to casting and soldering alloy.

PubMed

Kumbuloglu, O; Lassila, L V J; User, A; Toksavul, S; Vallittu, P K

2006-03-01

Adjustment of metal alloy framework of the porcelain-fused-to-metal crown by soldering minor marginal deficiences prior insertion may sometimes be needed. The aim of this study was to compare shear bond strengths of four luting cements to casting metal alloy and soldering metal alloy. A total of 64 flame cast non-precious metal alloy and flame soldered metal alloy samples were used. Durelon, Panavia F, RelyX Unicem Applicap and RelyX ARC stubs were bonded to the alloy substrate surface. After stored in water at 37 degrees C for 1 week, shear bond strength of the cement to the alloy was measured. Differences were analyzed using one way ANOVA (p<0.05). There were no difference between the cast metal alloy and soldering metal alloy substrate.

A review on solder reflow and flux application for flip chip

NASA Astrophysics Data System (ADS)

Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan

2017-09-01

This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

NASA Astrophysics Data System (ADS)

Wei, Helin; Wang, Kuisheng

2011-11-01

Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

PubMed Central

Mick, Enrico; Tinschert, Joachim; Mitrovic, Aurica; Bader, Rainer

2015-01-01

Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm) made of alumina toughened zirconia (ATZ), as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM) and energy-dispersive X-ray (EDX) analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings. PMID:28793440

Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

PubMed Central

Abdul Aziz, M. S.; Abdullah, M. Z.; Khor, C. Y.

2014-01-01

An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183°C) < T < 643.15 K (370°C). Both solvers were coupled by the real time coupling software and mesh-based parallel code coupling interface during analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry. PMID:25225638

Soldering in prosthodontics--an overview, part I.

PubMed

Byrne, Gerard

2011-04-01

The fit of fixed multiunit dental prostheses (FDP), traditionally termed fixed partial dentures (FPDs), is an ongoing problem. Poorly fitting restorations may hasten mechanical failure, due to abutment caries or screw failure. Soldering and welding play an important role in trying to overcome misfit of fixed multiunit prostheses. The term FPD will be used to denote multiunit fixed dental prostheses in this review. This is the first of a series of articles that review the state of the art and science of soldering and welding in relation to the fit of cemented or screw-retained multiunit prostheses. A comprehensive archive of background information and scientific findings is presented. Texts in dental materials and prosthodontics were reviewed. Scientific data were drawn from the numerous laboratory studies up to and including 2009. The background, theory, terminology, and working principles, along with the applied research, are presented. This first article focuses on soldering principles and dimensional accuracy in soldering. There is some discussion and suggestions for future research and development. Soldering may improve dimensional accuracy or reduce the distortion of multiunit fixed prostheses. Many variables can affect the outcome in soldering technique. Research science has developed some helpful guidelines. Research projects are disconnected and limited in scope. © 2011 by The American College of Prosthodontists.

Effects of solder temperature on pin through-hole during wave soldering: thermal-fluid structure interaction analysis.

PubMed

Aziz, M S Abdul; Abdullah, M Z; Khor, C Y

2014-01-01

An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183(°)C) < T < 643.15 K (370(°)C). Both solvers were coupled by the real time coupling software and mesh-based parallel code coupling interface during analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry.

Synthesis and characterization of lead-free tin silver nanosolders and their application to halogen free nanosolder pastes

NASA Astrophysics Data System (ADS)

Wernicki, Evan

Solder paste is a key material used in attaching electronic components to printed circuit boards (PCBs). Commonly used lead-based solders, such as eutectic Sn/37Pb, are currently being replaced by lead-free alloy materials due to health and environmental concerns associated with lead. Many solder pastes, both lead-containing and lead-free, contain halogens which act as activators to remove surface oxide and enhance surface wetting, posing further environmental concern from the halogen species. Difficulties in obtaining reliable joints can occur since lead-free solder material candidates have higher melting temperatures (30-50 °C) than that of lead-based solders. Differences in material properties between the numerous materials used in assembly and packaging processes can lead to component damage during manufacturing. Furthermore, designs that include more electrical interconnects in smaller areas give rise for the need for new materials to allow this trend to continue. A surfactant-assisted chemical reduction method was used to synthesize Sn/Ag alloy nanoparticles with a target composition range of 3.5-5 wt% Ag that served as the lead-free solder material within a nanosolder paste. Structure and size characterization via SEM and TEM showed Sn-Ag nanosolders size average approximately 19 nm. Differential scanning calorimetry (DSC) measurements of the nanosolder samples containing 4.5 wt% Ag showed an endothermic peak at 222.5 °C and an onset of 219.2 °C, indicating up to 17.5 °C melting temperature depression when compared to the bulk liquidus value of 240 °C. Composition of the nanosolder material was confirmed using energy dispersive x-ray spectroscopy (EDS) and structures formed were analyzed via x-ray diffraction (XRD). Both halogen-free and halogen-containing flux materials were combined with the nanosolder material, respectively, with varying preparation parameters to form a design of experiments (DoE) for nanosolder paste preparation. Solder pastes prepared with 55, 70, and 85 wt% nanosolder material have been successfully printed and reflowed on Cu substrates to imitate current manufacturing process. Different peak reflow temperatures of 245 °C and 265 °C were used to observe the effect on solder paste spreading and wetting angle of reflowed solder features. Two different flux chemistries, halogen-free and halogen-based, were also studied. Statistical analysis indicated nanosolder loading had a strong impact on both the wetting angle and paste spreading after the reflow process. The wetting angles of the samples, from the highest to lowest weight percentage, resulted in values of 69.7°, 26.2°, and 0°. A 55 wt% nanosolder paste formed multiple reflowed solder bumps, compared to the single bumps obtained with 70 and 85 wt% nanosolders. The highest loading sample was found to spread the least. This can be attributed to a combination of factors such as higher paste viscosity and lower solder-solder surface tension interactions. A larger peak temperature resulted in larger paste spreading values proving to be significant, however it was not found to affect the resulting wetting angle significantly. Flux chemistry was found to statistically have no profound impact on either the wetting angle or the solder spread. Therefore, it was found that the halogen-free solder paste can act as a suitable replacement for the tested halogen-containing nanosolder paste samples. KEYWORDS : solder paste, nanoparticles, paste printing, lead-free, reflow.

Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints

DOE Office of Scientific and Technical Information (OSTI.GOV)

Anderson, Iver E.; Boesenberg, Adam; Harringa, Joel

2011-09-28

Pb-free solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic have promise for widespread adoption across assembly conditions and operating environments, but enhanced microstructural control is needed. Micro-alloying with elements such as Zn was demonstrated for promoting a preferred solidification path and joint microstructure earlier in simple (Cu/Cu) solder joints studies for different cooling rates. This beneficial behavior now has been verified in reworked ball grid array (BGA) joints, using dissimilar SAC305 (Sn-3.0Ag-0.5Cu, wt.%) solder paste. After industrial assembly, BGA components joined with Sn-3.5Ag-0.74Cu-0.21Zn solder were tested in thermal cycling (-55 C/+125 C) along with baseline SAC305 BGA joints beyondmore » 3000 cycles with continuous failure monitoring. Weibull analysis of the results demonstrated that BGA components joined with SAC + Zn/SAC305 have less joint integrity than SAC305 joints, but their lifetime is sufficient for severe applications in consumer, defense, and avionics electronic product field environments. Failure analysis of the BGA joints revealed that cracking did not deviate from the typical top area (BGA component side) of each joint, in spite of different Ag3Sn blade content. Thus, SAC + Zn solder has not shown any advantage over SAC305 solder in these thermal cycling trials, but other characteristics of SAC + Zn solder may make it more attractive for use across the full range of harsh conditions of avionics or defense applications.« less

Transabdominal preperitoneal herniorrhaphy using laser-assisted tissue soldering in a porcine model.

PubMed

Lanzafame, Raymond J; Soltz, Barbara A; Stadler, Istvan; Soltz, Robert

2009-01-01

Collagen solder is capable of fixation of surgical meshes during laparoscopic herniorrhaphy without compromising tissue integration, increasing adhesions or inflammation. This pilot study describes development of instrumentation and techniques for transabdominal preperitoneal (TAPP) herniorrhaphy using laser-assisted soldering technology. Anesthetized 20-kg to 25-kg female Yorkshire pigs underwent laparoscopy performed using a 3-trocar technique. Peritoneal incisions were made and pockets created in the preperitoneal space for mesh placement. Parietex TEC mesh segments embedded in 60% collagen-solder were soldered to the muscle surface by using a prototype laser (1.45micro, 4.5W CW, 5mm spot, and 55 degrees C set temperature) and custom laparoscopic handpiece. Parietex TEC mesh segments (Control) were affixed to the muscle with fibrin sealant (Tisseel). Peritoneal closure was with staples (Control) or by soldering collagen embedded Vicryl mesh segments over the peritoneal incision (Mesh/TAPP). Segments were inserted using a specially designed introducer. Animals were recovered and underwent second-look laparoscopy at 6 weeks postimplantation. Mesh sites were harvested after animals were euthanized. The mesh-solder constructs were easily inserted and affixed in the TAPP approach. Tisseel tended to drip during application, particularly in vertical and ventral locations. Postoperative healing was similar to Control segments in all cases. Mesh/TAPP closures healed without scarring or adhesion formation. Collagen-based tissue soldering permits normal wound healing and may mitigate or reduce use of staples for laparoscopic mesh fixation and peritoneal closure. Laser-assisted mesh fixation and peritoneal closure is a promising alternative for laparoscopic herniorrhaphy. Further development of this strategy is warranted.

Effect of Gap Distance on Tensile Strength of Preceramic Base Metal Solder Joints

PubMed Central

Fattahi, Farnaz; Motamedi, Milad

2011-01-01

Background and aims In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Materials and methods Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. Results The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. Conclusion There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints. PMID:22991610

Computer simulation of solder joint failure

DOE Office of Scientific and Technical Information (OSTI.GOV)

Burchett, S.N.; Frear, D.R.; Rashid, M.M.

The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliability issue for electronic packages. The purpose of this Laboratory Directed Research and Development (LDRD) project was to develop computational tools for simulating the behavior of solder joints under strain and temperature cycling, taking into account the microstructural heterogeneities that exist in as-solidified near eutectic Sn-Pb joints, as well as subsequent microstructural evolution. The authors present two computational constitutive models, a two-phase model and a single-phase model, that were developed to predict the behavior of near eutectic Sn-Pb solder joints under fatigue conditions. Unique metallurgical tests provide themore » fundamental input for the constitutive relations. The two-phase model mathematically predicts the heterogeneous coarsening behavior of near eutectic Sn-Pb solder. The finite element simulations with this model agree qualitatively with experimental thermomechanical fatigue tests. The simulations show that the presence of an initial heterogeneity in the solder microstructure could significantly degrade the fatigue lifetime. The single-phase model was developed to predict solder joint behavior using materials data for constitutive relation constants that could be determined through straightforward metallurgical experiments. Special thermomechanical fatigue tests were developed to give fundamental materials input to the models, and an in situ SEM thermomechanical fatigue test system was developed to characterize microstructural evolution and the mechanical behavior of solder joints during the test. A shear/torsion test sample was developed to impose strain in two different orientations. Materials constants were derived from these tests. The simulation results from the two-phase model showed good fit to the experimental test results.« less

Experimental investigations into cryosorption pumping of plasma exhaust

DOE Office of Scientific and Technical Information (OSTI.GOV)

Perinic, D.; Mack, A.

1988-09-01

Within the framework of the European Fusion Technology Programme the Karlsruhe Nuclear Research Centre has been awarded a contract for the development of cryosorption panels for compound cryopumps of the NEt plasma exhaust pumping system. This task includes the development of a bonding technique for porous sorbent materials with metal substrates and a test programme for development and optimization of cryopanels. A variety of material combinations for sorbent, bonding and substrate were evaluated and listed in a test matrix. Bonding tests involving soldering, cementing and plasma spraying techniques have been carried out.

Soldering iron temperature is automatically reduced

NASA Technical Reports Server (NTRS)

Lum, J. Y.

1966-01-01

Hinged cradle-microswitch arrangement maintains a soldering iron at less than peak temperature when not in use. The microswitch introduces a voltage reducing element into the soldering iron power circuit when the iron is placed on the cradle. The iron, when removed from the cradle, returns to operating temperature in 15 to 30 seconds.

A microstructurally based model of solder joints under conditions of thermomechanical fatigue

NASA Astrophysics Data System (ADS)

Frear, D. R.; Burchett, S. N.; Rashid, M. M.

The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliability issue. We present two computational methodologies that have been developed to predict the behavior of near eutectic Sn-Pb solder joints under fatigue conditions that are based on metallurgical tests as fundamental input for constitutive relations. The two-phase model mathematically predicts the heterogeneous coarsening behavior of near eutectic Sn-Pb solder. The finite element simulations from this model agree well with experimental thermomechanical fatigue tests. The simulations show that the presence of an initial heterogeneity in the solder microstructure could significantly degrade the fatigue lifetime. The single phase model is a computational technique that was developed to predict solder joint behavior using materials data for constitutive relation constants that could be determined through straightforward metallurgical experiments. A shear/torsion test sample was developed to impose strain in two different orientations. Materials constants were derived from these tests and the results showed an adequate fit to experimental results. The single-phase model could be very useful for conditions where microstructural evolution is not a dominant factor in fatigue.

Experimental Methods in Reduced-gravity Soldering Research

NASA Technical Reports Server (NTRS)

Pettegrew, Richard D.; Struk, Peter M.; Watson, John K.; Haylett, Daniel R.

2002-01-01

The National Center for Microgravity Research, NASA Glenn Research Center, and NASA Johnson Space Center are conducting an experimental program to explore the influence of reduced gravity environments on the soldering process. An improved understanding of the effects of the acceleration environment is important to application of soldering during current and future human space missions. Solder joint characteristics that are being considered include solder fillet geometry, porosity, and microstructural features. Both through-hole and surface mounted devices are being investigated. This paper focuses on the experimental methodology employed in this project and the results of macroscopic sample examination. The specific soldering process, sample configurations, materials, and equipment were selected to be consistent with those currently on-orbit. Other apparatus was incorporated to meet requirements imposed by operation onboard NASA's KC-135 research aircraft and instrumentation was provided to monitor both the atmospheric and acceleration environments. The contingent of test operators was selected to include both highly skilled technicians and less skilled individuals to provide a population cross-section that would be representative of the skill mix that might be encountered in space mission crews.

Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

NASA Technical Reports Server (NTRS)

Teverovsky, Alexander A.

2014-01-01

Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

Repair of pig dura in vivo using temperature controlled CO(2) laser soldering.

PubMed

Forer, Boaz; Vasilyev, Tamar; Brosh, Tamar; Kariv, Noam; Gil, Ziv; Fliss, Dan M; Katzir, Abraham

2005-10-01

The purpose of this study was to demonstrate that laser soldering might be successfully used for closing holes or cuts in the dura layer, which encapsulates the brain. A temperature controlled fiberoptic CO(2) laser system and albumin solder were used for spot soldering of fascia patches to holes in the dura of farm pigs, in vitro and in vivo. The mean burst pressure of the soldered patches in the in vitro experiments was 190 +/- 88 mm Hg-significantly higher than typical maximum CSF pressure of 15 mm Hg. In the in vivo experiments the pigs showed no postoperative complications. Histopathological studies exhibited an accepted level of inflammatory reaction and showed no thermal damage to the underlying brain tissue. It has been clearly demonstrated that temperature controlled laser soldering is a very useful technique for the repair of the dura. It provides significant advantages over standard closure techniques: it is easy to apply, the bond is strong and watertight and the procedure is likely to be much faster than suturing. This research work will lead to clinical trials.

Nano-soldering of magnetically aligned three-dimensional nanowire networks.

PubMed

Gao, Fan; Gu, Zhiyong

2010-03-19

It is extremely challenging to fabricate 3D integrated nanostructures and hybrid nanoelectronic devices. In this paper, we report a simple and efficient method to simultaneously assemble and solder nanowires into ordered 3D and electrically conductive nanowire networks. Nano-solders such as tin were fabricated onto both ends of multi-segmented nanowires by a template-assisted electrodeposition method. These nanowires were then self-assembled and soldered into large-scale 3D network structures by magnetic field assisted assembly in a liquid medium with a high boiling point. The formation of junctions/interconnects between the nanowires and the scale of the assembly were dependent on the solder reflow temperature and the strength of the magnetic field. The size of the assembled nanowire networks ranged from tens of microns to millimeters. The electrical characteristics of the 3D nanowire networks were measured by regular current-voltage (I-V) measurements using a probe station with micropositioners. Nano-solders, when combined with assembling techniques, can be used to efficiently connect and join nanowires with low contact resistance, which are very well suited for sensor integration as well as nanoelectronic device fabrication.

Thermal model for optimization of vascular laser tissue soldering.

PubMed

Bogni, Serge; Stumpp, Oliver; Reinert, Michael; Frenz, Martin

2010-06-01

Laser tissue soldering (LTS) is a promising technique for tissue fusion based on a heat-denaturation process of proteins. Thermal damage of the fused tissue during the laser procedure has always been an important and challenging problem. Particularly in LTS of arterial blood vessels strong heating of the endothelium should be avoided to minimize the risk of thrombosis. A precise knowledge of the temperature distribution within the vessel wall during laser irradiation is inevitable. The authors developed a finite element model (FEM) to simulate the temperature distribution within blood vessels during LTS. Temperature measurements were used to verify and calibrate the model. Different parameters such as laser power, solder absorption coefficient, thickness of the solder layer, cooling of the vessel and continuous vs. pulsed energy deposition were tested to elucidate their impact on the temperature distribution within the soldering joint in order to reduce the amount of further animal experiments. A pulsed irradiation with high laser power and high absorbing solder yields the best results. (c) 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Three Dimensional Characterization of Tin Crystallography and Cu6Sn5 Intermetallics in Solder Joints by Multiscale Tomography

NASA Astrophysics Data System (ADS)

Kirubanandham, A.; Lujan-Regalado, I.; Vallabhaneni, R.; Chawla, N.

2016-11-01

Decreasing pitch size in electronic packaging has resulted in a drastic decrease in solder volumes. The Sn grain crystallography and fraction of intermetallic compounds (IMCs) in small-scale solder joints evolve much differently at the smaller length scales. A cross-sectional study limits the morphological analysis of microstructural features to two dimensions. This study utilizes serial sectioning technique in conjunction with electron backscatter diffraction to investigate the crystallographic orientation of both Sn grains and Cu6Sn5 IMCs in Cu/Pure Sn/Cu solder joints in three dimensional (3D). Quantification of grain aspect ratio is affected by local cooling rate differences within the solder volume. Backscatter electron imaging and focused ion beam serial sectioning enabled the visualization of morphology of both nanosized Cu6Sn5 IMCs and the hollow hexagonal morphology type Cu6Sn5 IMCs in 3D. Quantification and visualization of microstructural features in 3D thus enable us to better understand the microstructure and deformation mechanics within these small scale solder joints.

Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints

NASA Astrophysics Data System (ADS)

Tasooji, Amaneh; Lara, Leticia; Lee, Kyuoh

2014-12-01

Reduction in microelectronic interconnect size gives rise to solder bumps consisting of few grains, approaching a single- or bicrystal grain morphology in C4 bumps. Single grain anisotropy, individual grain orientation, presence of easy diffusion paths along grain boundaries, and the increased current density in these small solder bumps aggravate electromigration. This reduces the reliability of the entire microelectronic system. This paper focuses on electromigration behavior in Pb-free solder, specifically the Sn-0.7 wt.%Cu alloy. We discuss the effects of texture, grain orientation, and grain boundary misorientation angle on electromigration (EM) and intermetallic compound formation in EM-tested C4 bumps. The detailed electron backscatter diffraction (EBSD) analysis used in this study reveals the greater influence of grain boundary misorientation on solder bump electromigration compared with the effect associated with individual grain orientation.

Solder joint aging characteristics from the MC2918 firing set of a B61 accelerated aging unit (AAU)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vianco, P.T.; Rejent, J.A.

1997-10-01

The B61 accelerated aging unit (AAU) provided a unique opportunity to document the effects of a controlled, long-term thermal cycling environment on the aging of materials used in the device. This experiment was of particular interest to solder technologists because thermal cycling environments are a predominant source of solder joint failures in electronic assemblies. Observations of through hole solder joints in the MC2918 Firing Set from the B61 AAU did not reveal signs of catastrophic failure. Quantitative analyses of the microstructural metrics of intermetallic compound layer thickness and Pb-rich phase particle distributions indicated solder joint aging that was commensurate withmore » the accelerated aging environment. The effects of stress-enhanced coarsening of the Pb-rich phase were also documented.« less

Human albumin solders for clinical application during laser tissue welding.

PubMed

Poppas, D P; Wright, E J; Guthrie, P D; Shlahet, L T; Retik, A B

1996-01-01

Fifty percent human albumin solder significantly improves weld strength when compared to lower concentrations [Wright et al., ASLMS meeting, April, 1995]. We developed a method for preparing 50% human albumin that may be considered compatible for clinical applications. Fifty percent human albumin solder was prepared from 25% commercially available human albumin using a lyophilization technique. Assessment of sterility, viscosity, pH, and peak absorption wavelength were performed. This report describes the methodology used to prepare a 50% human albumin solder that is compatible with clinical use. Maintenance of the structural integrity of the albumin was confirmed by polyacrylamide gel electrophoresis. This solder preparation can be used alone or with the addition of exogenous chromophores. The final product is sterile, incorporates viral free protocols, maintains high viscosity, and can be applied easily during open or laparoscopic procedures.

Ultrasonic semi-solid coating soldering 6061 aluminum alloys with Sn-Pb-Zn alloys.

PubMed

Yu, Xin-ye; Xing, Wen-qing; Ding, Min

2016-07-01

In this paper, 6061 aluminum alloys were soldered without a flux by the ultrasonic semi-solid coating soldering at a low temperature. According to the analyses, it could be obtained that the following results. The effect of ultrasound on the coating which promoted processes of metallurgical reaction between the components of the solder and 6061 aluminum alloys due to the thermal effect. Al2Zn3 was obtained near the interface. When the solder was in semi-solid state, the connection was completed. Ultimately, the interlayer mainly composed of three kinds of microstructure zones: α-Pb solid solution phases, β-Sn phases and Sn-Pb eutectic phases. The strength of the joints was improved significantly with the minimum shear strength approaching 101MPa. Copyright © 2016. Published by Elsevier B.V.

STS-57 Pilot Duffy uses TDS soldering tool in SPACEHAB-01 aboard OV-105

NASA Technical Reports Server (NTRS)

1993-01-01

STS-57 Pilot Brian J. Duffy, at a SPACEHAB-01 (Commercial Middeck Augmentation Module (CMAM)) work bench, handles a soldering tool onboard the Earth-orbiting Endeavour, Orbiter Vehicle (OV) 105. Duffy is conducting a soldering experiment (SE) which is part of the Tools and Diagnostic Systems (TDS) project. He is soldering on a printed circuit board, positioned in a specially designed holder, containing 45 connection points and will later de-solder 35 points on a similar board. TDS' sponsor is the Flight Crew Support Division, Space and Life Sciences Directorate, JSC. It represents a group of equipment selected from tools and diagnostic hardware to be supported by the Space Station program. TDS was designed to demonstrate the maintenance of experiment hardware on-orbit and to evaluate the adequacy of its design and the crew interface.

Microstructural evolution and mechanical properties of SnAgCu alloys

NASA Astrophysics Data System (ADS)

Fouassier, O.; Heintz, J.-M.; Chazelas, J.; Geffroy, P.-M.; Silvain, J.-F.

2006-08-01

Lead containing solder paste is now considered as an environmental threat. In order to eliminate this undesirable environmental impact associated to their production, a family of lead-free solder joint, Sn-3.8Ag-0.7Cu, is proposed. Microstructural and mechanical data of this solder joint have been acquired and compared with the most common used SnPb solder paste. The evolution of the microstructure as well as the failure mode and the mechanical properties of SnAgCu solder joint are discussed as a function of strain rate, annealing treatments, and testing temperature. Tensile tests have been performed, at temperatures ranging from -50to+150°C, on bulk samples. Changes of the mechanical properties of bulk tested samples are actually correlated with microstructural changes, as shown by transmission electronic microscopy investigations.

Thermomechanical behavior of tin-rich (lead-free) solders

NASA Astrophysics Data System (ADS)

Sidhu, Rajen Singh

In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local strain response of the lap shear geometry.

Effect of soldering on the metal-ceramic bond strength of an Ni-Cr base alloy.

PubMed

Nikellis, Ioannis; Levi, Anna; Zinelis, Spiros

2005-11-01

Although soldering is a common laboratory procedure, the use of soldering alloys may adversely affect metal-ceramic bond strength and potentially decrease the longevity of metal-ceramic restorations. The purpose of this study was to investigate the effect of soldering on metal-ceramic bond strength of a representative Ni-Cr base metal alloy. Twenty-eight rectangular (25 x 3 x 0.5 mm) Ni-based alloy (Wiron 99) specimens were equally divided into soldering (S) and reference (R) groups. Soldering group specimens were covered with a 0.1-mm layer of the appropriate solder (Wiron-Lot) and reduced by 0.1 mm on the opposite side. Five specimens of each group were used for the measurement of surface roughness parameter (R(z)) and hardness, and 3 were used for measurement of the modulus of elasticity. Six specimens of each group were covered with porcelain (Ceramco 3) and subjected to a 3-point bending test for evaluation of the metal-ceramic bond strength according to the ISO 9693 specification. The data from surface roughness, hardness, modulus of elasticity, and metal-ceramic bond strength were analyzed statistically, using independent t tests (alpha=.05). Statistical analysis of the R(z) surface roughness parameter (S: 3.4 +/- 0.3 mum; R: 3.7 +/- 0.7 microm; P=.07) and bond strength (S: 46 +/- 3 MPa; R: 40 +/- 5 MPa; P=.057) failed to reveal any significant difference between the 2 groups. The specimens of the soldering group demonstrated significantly lower values both in hardness (S: 128 +/- 11 VHN; R: 217 +/- 4 VHN; P<.001) and in modulus of elasticity (S: 135 +/- 4 GPa; R: 183 +/- 6 GPa; P=.035) than the reference group. Under the conditions of the present study, the addition of solder to the base metal alloy did not affect the metal-ceramic bond strength.

Electromigration and solid state aging of flip chip solder joints and analysis of tin whisker on lead-frame

NASA Astrophysics Data System (ADS)

Lee, Taekyeong

Electromigration and solid state aging in flip chip joint, and whisker on lead frame of Pb-containing (eutectic SnPb) and Pb-free solders (SnAg 3.5, SnAg3.8Cu0.7, and SnCu0.7), have been studied systematically, using Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Analysis (EDX), and synchrotron radiation. The high current density in flip chip joint drives the diffusion of atoms of eutectic SnPb and SnAgCu. A marker is used to measure the diffusion flux in a half cross-sectioned solder joint. SnAgCu shows higher resistance against electromigration than eutectic SnPb. In the half cross-sectioned solder joint, void growth is the dominant failure mechanism. However, the whole solder balls in the underfill show that the failure mechanism is a result from the dissolution of electroless Ni under bump metallization (UBM) of about 10 mum thickness. The growth rate between intermetallic compounds in molten and solid solders differed by four orders of magnitude. In liquid solder, the growth rate is about 1 mum/min; the growth rate in solid solder is only about 10 -4 mum/min. The difference is not resulting from factors of thermodynamics, which is the change of Gibbs free energy before and after intermetallic compound formation, but from kinetic factors, which is the rate of change of Gibbs free energy. Even though the difference in growth rate between eutectic SnPb and Pb-free solders during solid state aging was found, the reason behind such difference shown is unclear. The orientation and stress levels of whiskers are measured by white X-ray of synchrotron radiation. The growth direction is nearly parallel to one of the principal axes of tin. The compressive stress level is quite low because the residual stress is relaxed by the whisker growth.

The intermetallic formation and growth kinetics at the interface of near eutectic tin-silver-copper solder alloys and gold/nickel metallization

NASA Astrophysics Data System (ADS)

Gao, Mao

The formation of a one micron thick layer of an intermetallic compound between a solder alloy and a metallic substrate generally constitutes a good solder joint in an electronic device. However, if the compound grows too thick, and/or if multiple intermetallic compounds form, poor solder joint reliability may result. Thus significant interest has been focused on intermetallic compound phase selection and growth kinetics at such solder/metal interfaces. The present study focuses on one such specific problem, the formation and growth of intermetallic compounds at near eutectic Sn-Ag-Cu solder alloy/Ni interfaces. Sn-3.0Ag-0.5Cu solder was reflowed on Au/Ni substrates, resulting in the initial formation and growth of (CuNi)6Sn 5 at Sn-3.0Ag-0.5Cu /Ni interfaces. (NiCu)3Sn4 formed between the (CuNi)6Sn5 and the Ni substrate when the concentration of Cu in the liquid SnAgCu solder decreased to a critical value which depended upon temperature: 0.37, 0.31 and 0.3(wt.%) at reflow temperatures of 260°C, 245°C and 230°C respectively. The growth rate of (CuNi)6Sn5 was found to be consistent with extrapolations of a diffusion limited growth model formulated for lower temperature, solid state diffusion couples. The long range diffusion of Cu did not limit growth rates. The spalling of (CuNiAu)6Sn5 from (NiCu)3 Sn4 surfaces during reflow was also examined. When the Cu concentration in the solder decreased to approximately 0.28wt.%, the (Cu,Ni,Au) 6Sn5 was observed to spall. Compressive stress in (CuNiAu) 6Sn5 and weak adhesion between (CuNiAu)6Sn 5 and (NiCu)3Sn4 was found to cause this effect.

Modeling and Implementation of Solder-activated Joints for Single Actuator, Centimeter-Scale Robotic Mechanisms

DTIC Science & Technology

2010-06-01

Modulus Ratio Annealed Copper 1.0 1.0 1.0 6066 Aluminum 0.63 2.48 3.96 High-Temp Nitinol 0.68 16.8 24.7 1095 Spring Steel 1.82 16.5 9.08 106 5.2.2...were: copper, aluminum, Nitinol , and spring steel. The wetting ability of aluminum and Nitinol to lead-tin solders is poor. There are solders that have...32],[33]. Copper plating may be used to improve a material’s solderability. Nitinol and aluminum are not easily electroplated with copper. Steel and

Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate

PubMed Central

Huang, M. L.; Yang, F.

2014-01-01

The downsizing of solder balls results in larger interfacial intermetallic compound (IMC) grains and less Cu substrate consumption in lead-free soldering on Cu substrates. This size effect on the interfacial reaction is experimentally demonstrated and theoretically analyzed using Sn-3.0Ag-0.5Cu and Sn-3.5Ag solder balls. The interfacial reaction between the Sn-xAg-yCu solders and Cu substrates is a dynamic response to a combination of effects of interfacial IMC growth, Cu substrate consumption and composition variation in the interface zone. A concentration gradient controlled (CGC) kinetics model is proposed to explain the combined effects. The concentration gradient of Cu at the interface, which is a function of solder volume, initial Cu concentration and reaction time, is the root cause of the size effect. We found that a larger Cu concentration gradient results in smaller Cu6Sn5 grains and more consumption of Cu substrate. According to our model, the growth kinetics of interfacial Cu6Sn5 obeys a t1/3 law when the molten solder has approached the solution saturation, and will be slower otherwise due to the interfering dissolution mechanism. The size effect introduced in this model is supported by a good agreement between theoretical and experimental results. Finally, the scope of application of this model is discussed. PMID:25408359

Creep properties of Pb-free solder joints

DOE Office of Scientific and Technical Information (OSTI.GOV)

Song, H.G.; Morris Jr., J.W.; Hua, F.

2002-04-01

Describes the creep behavior of three Sn-rich solders that have become candidates for use in Pb-free solder joints: Sn-3.5Ag, Sn-3Ag-0.5Cu and Sn-0.7Cu. The three solders show the same general behavior when tested in thin joints between Cu and Ni/Au metallized pads at temperatures between 60 and 130 C. Their steady-state creep rates are separated into two regimes with different stress exponents(n). The low-stress exponents range from {approx}3-6, while the high-stress exponents are anomalously high (7-12). Strikingly, the high-stress exponent has a strong temperature dependence near room temperature, increasing significantly as the temperature drops from 95 to 60 C. The anomalousmore » creep behavior of the solders appears to be due to the dominant Sn constituent. Joints of pure Sn have stress exponents, n, that change with stress and temperature almost exactly like those of the Sn-rich solder joints. Research on creep in bulk samples of pure Sn suggests that the anomalous temperature dependence of the stress exponent may show a change in the dominant mechanism of creep. Whatever its source, it has the consequence that conventional constitutive relations for steady-state creep must be used with caution in treating Sn-rich solder joints, and qualification tests that are intended to verify performance should be carefully designed.« less

Study of Sn and SnAgCu Solders Wetting Reaction on Ni/Pd/Au Substrates

NASA Astrophysics Data System (ADS)

Liu, C. Y.; Wei, Y. S.; Lin, E. J.; Hsu, Y. C.; Tang, Y. K.

2016-12-01

Wetting reactions of pure Sn and Sn-Ag-Cu solder balls on Au(100 Å and 1000 Å)/Pd(500 Å)/Ni substrates were investigated. The (Au, Pd)Sn4 phase formed in the initial interfacial reaction between pure Sn and Au(100 Å and 1000 Å)/Pd(500 Å)/Ni substrates. Then, the initially formed (Au, Pd)Sn4 compound layer either dissolved or spalled into the molten Sn solder with 3 s of reflowing. The exposed Ni under-layer reacted with Sn solder and formed an interfacial Ni3Sn4 compound. We did not observe spalling compound in the Sn-Ag-Cu case, either on the thin Au (100 Å) or the thick Au (1000 Å) substrates. This implies that the Cu content in the Sn-Ag-Cu solder can efficiently suppress the spalling effect and really stabilize the interfacial layer. Sn-Ag-Cu solder has a better wetting than that of the pure Sn solder, regardless of the Au thickness of the Au/Pd/Ni substrate. For both cases of pure Sn and Sn-Ag-Cu, the initial wetting (<3-s reflowing) on the thin Au (100 Å) substrate is better than that of the thick Au (1000 Å) substrate. Over 3-s reflowing, the wetting on the thicker Au layer (1000 Å) substrate becomes better than the wetting on the thinner Au layer (100 Å) substrate.

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yang, Ming

Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientationmore » evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.« less

The tensile strength characteristics study of the laser welds of biological tissue using the nanocomposite solder

NASA Astrophysics Data System (ADS)

Rimshan, I. B.; Ryabkin, D. I.; Savelyev, M. S.; Zhurbina, N. N.; Pyanov, I. V.; Eganova, E. M.; Pavlov, A. A.; Podgaetsky, V. M.; Ichkitidze, L. P.; Selishchev, S. V.; Gerasimenko, A. Y.

2016-04-01

Laser welding device for biological tissue has been developed. The main device parts are the radiation system and adaptive thermal stabilization system of welding area. Adaptive thermal stabilization system provided the relation between the laser radiation intensity and the weld temperature. Using atomic force microscopy the structure of composite which is formed by the radiation of laser solder based on aqua- albuminous dispersion of multi-walled carbon nanotubes was investigated. AFM topograms nanocomposite solder are mainly defined by the presence of pores in the samples. In generally, the surface structure of composite is influenced by the time, laser radiation power and MWCNT concentration. Average size of backbone nanoelements not exceeded 500 nm. Bulk density of nanoelements was in the range 106-108 sm-3. The data of welding temperature maintained during the laser welding process and the corresponding tensile strength values were obtained. Maximum tensile strength of the suture was reached in the range 50-55°C. This temperature and the pointwise laser welding technology (point area ~ 2.5mm) allows avoiding thermal necrosis of healthy section of biological tissue and provided reliable bonding construction of weld join. In despite of the fact that tensile strength values of the samples are in the range of 15% in comparison with unbroken strips of pigskin leather. This situation corresponds to the initial stage of the dissected tissue connection with a view to further increasing of the joint strength of tissues with the recovery of tissue structure; thereby achieved ratio is enough for a medical practice in certain cases.

Breakthrough: Lead-free Solder

ScienceCinema

Anderson, Iver

2018-05-07

Ames Laboratory senior metallurgist Iver Anderson explains the importance of lead-free solder in taking hazardous lead out of the environment by eliminating it from discarded computers and electronics that wind up in landfills. Anderson led a team that developed a tin-silver-copper replacement for traditional lead-tin solder that has been adopted by more than 50 companies worldwide.

Development Of Nanoenergetic Micro-fluidic Jet Injectors

DTIC Science & Technology

2012-01-01

resulting in a uniform solder coating on to the exposed solder pads. Following solder coating , the material chamber and fluid reservoir were brought...assembly, and packaging of first generation nanoenergetic fluidic jet generators. The generators consist of an energetic material chamber, elastic...thickness, energetic material composition, and energetic material mass using high-speed photography and compared with theoretical calculations

Nano-soldering to single atomic layer

DOEpatents

Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

2011-10-11

A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

Modified soldering iron speeds cutting of synthetic materials

NASA Technical Reports Server (NTRS)

Schafer, W. G., Jr.

1966-01-01

Modified soldering iron cuts large lots of synthetic materials economically without leaving frayed or jagged edges. The soldering iron is modified by machining an axial slot in its heating element tip and mounting a cutting disk in it. An alternate design has an axially threaded bore in the tip to permit the use of various shapes of cutting blades.

How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

NASA Astrophysics Data System (ADS)

Suhir, E.; Yi, S.; Ghaffarian, R.

2017-03-01

It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

Circularly Polarized Microwave Antenna Element with Very Low Off-Axis Cross-Polarization

NASA Technical Reports Server (NTRS)

Greem. David; DuToit, Cornelis

2013-01-01

The goal of this work was to improve off-axis cross-polarization performance and ease of assembly of a circularly polarized microwave antenna element. To ease assembly, the initial design requirement of Hexweb support for the internal circuit part, as well as the radiating disks, was eliminated. There is a need for different plating techniques to improve soldering. It was also desirable to change the design to eliminate soldering as well as the need to use the Hexweb support. Thus, a technique was developed to build the feed without using solder, solving the lathing and soldering issue. Internal parts were strengthened by adding curvature to eliminate Hexweb support, and in the process, the new geometries of the internal parts opened the way for improving the off-axis cross-polarization performance as well. The radiating disks curvatures were increased for increased strength, but it was found that this also improved crosspolarization. Optimization of the curvatures leads to very low off-axis cross-polarization. The feed circuit was curved into a cylinder for improved strength, eliminating Hexweb support. An aperture coupling feed mechanism eliminated the need for feed pins to the disks, which would have required soldering. The aperture coupling technique also improves cross-polarization performance by effectively exciting the radiating disks very close to the antenna s central axis of symmetry. Because of the shape of the parts, it allowed for an all-aluminum design bolted together and assembled with no solder needed. The advantage of a solderless design is that the reliability is higher, with no single-point failure (solder), and no need for special plating techniques in order to solder the unit together. The shapes (curved or round) make for a more robust build without extra support materials, as well as improved offaxis cross-polarization.

Effect of Mn Nanoparticles on Interfacial Intermetallic Compound Growth in Low-Ag Sn-0.3Ag-0.7Cu- xMn Solder Joints

NASA Astrophysics Data System (ADS)

Tang, Y.; Luo, S. M.; Li, G. Y.; Yang, Z.; Chen, R.; Han, Y.; Hou, C. J.

2018-02-01

Interfacial intermetallic compound (IMC) growth between Cu substrates and low-Ag Sn-0.3Ag-0.7Cu- xMn ( x = 0 wt.%, 0.02 wt.%, 0.05 wt.%, 0.1 wt.%, and 0.15 wt.%) (SAC0307- xMn) solders was investigated under different isothermal aging temperatures of 100°C, 150°C, and 190°C. Scanning electron microscopy (SEM) was employed to observe the microstructural evolution of the solder joints and measure the IMC layer thickness. The IMC phases were identified by energy-dispersive x-ray spectroscopy and x-ray diffraction. The results showed that a Cu6Sn5 IMC layer formed in the as-soldered solder joints, while a duplex structure consisting of a Cu6Sn5 IMC layer near the solder matrix and a Cu3Sn IMC layer was observed after isothermal aging. A considerable drop in the IMC layer thickness was observed when 0.1 wt.% Mn nanoparticles were added. Beyond this amount, the thickness of the IMC layer only slightly increases. Adding Mn nanoparticles can increase the activation energy and thus reduce the interdiffusion rates of the Sn and Cu atoms, which suppresses excessive IMC growth. The solder joint containing 0.1 wt.% Mn nanoparticles has the highest activation energy. SEM images revealed that the number of small particles precipitated in the channels between the Cu6Sn5 IMC layers increases with an increasing proportion of Mn nanoparticles. Based on the microstructural evolution of the solder joints, this study revealed that grain boundary pinning is one of the most important mechanisms for IMC growth inhibition when Mn nanoparticles are added.

Transabdominal Preperitoneal Herniorrhaphy using Laser-Assisted Tissue Soldering in a Porcine Model

PubMed Central

Soltz, Barbara A.; Stadler, Istvan; Soltz, Robert

2009-01-01

Background and Objectives: Collagen solder is capable of fixation of surgical meshes during laparoscopic herniorrhaphy without compromising tissue integration, increasing adhesions or inflammation. This pilot study describes development of instrumentation and techniques for transabdominal preperitoneal (TAPP) herniorrhaphy using laser-assisted soldering technology. Methods: Anesthetized 20-kg to 25-kg female Yorkshire pigs underwent laparoscopy performed using a 3-trocar technique. Peritoneal incisions were made and pockets created in the preperitoneal space for mesh placement. Parietex TEC mesh segments embedded in 60% collagen-solder were soldered to the muscle surface by using a prototype laser (1.45µ, 4.5W CW, 5mm spot, and 55°C set temperature) and custom laparoscopic handpiece. Parietex TEC mesh segments (Control) were affixed to the muscle with fibrin sealant (Tisseel). Peritoneal closure was with staples (Control) or by soldering collagen embedded Vicryl mesh segments over the peritoneal incision (Mesh/TAPP). Segments were inserted using a specially designed introducer. Animals were recovered and underwent second-look laparoscopy at 6 weeks postimplantation. Mesh sites were harvested after animals were euthanized. Results: The mesh-solder constructs were easily inserted and affixed in the TAPP approach. Tisseel tended to drip during application, particularly in vertical and ventral locations. Postoperative healing was similar to Control segments in all cases. Mesh/TAPP closures healed without scarring or adhesion formation. Discussion and Conclusion: Collagen-based tissue soldering permits normal wound healing and may mitigate or reduce use of staples for laparoscopic mesh fixation and peritoneal closure. Laser-assisted mesh fixation and peritoneal closure is a promising alternative for laparoscopic herniorrhaphy. Further development of this strategy is warranted. PMID:19660214

Nanoindentation on SnAgCu lead-free solder joints and analysis

NASA Astrophysics Data System (ADS)

Xu, Luhua; Pang, John H. L.

2006-12-01

The lead-free SnAgCu (SAC) solder joint on copper pad with organic solderability preservative (Cu-OSP) and electroless nickel and immersion gold (ENIG) subjected to thermal testing leads to intermetallic growth. It causes corresponding reliability concerns at the interface. Nanoindentation characterization on SnAgCu solder alloy, intermetallic compounds (IMCs), and the substrates subjected to thermal aging is reported. The modulus and hardness of thin IMC layers were measured by nanoindentation continuous stiffness measurement (CSM) from planar IMC surface. When SAC/Ni(Au) solder joints were subject to thermal aging, the Young’s modulus of the NiCuSn IMC at the SAC/ENIG specimen changed from 207 GPa to 146 GPa with different aging times up to 500 h. The hardness decreased from 10.0 GPa to 7.3 GPa. For the SAC/Cu-OSP reaction couple, the Young’s modulus of Cu6Sn5 stayed constant at 97.0 GPa and hardness about 5.7 GPa. Electron-probe microanalysis (EPMA) was used to thermal aging. The creep effect on the measured result was analyzed when measuring SnAgCu solder; it was found that the indentation penetration, and thus the hardness, is loading rate dependent. With the proposed constant P/P experiment, a constant indentation strain rate h/h and hardness could be achieved. The log-log plot of indentation strain rate versus hardness for the data from the constant P/P experiments yields a slope of 7.52. With the optimized test method and CSM Technique, the Modulus of SAC387 solder alloy and all the layers in a solder joint were investigated.

Isothermal Ageing of SnAgCu Solder Alloys: Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response

NASA Astrophysics Data System (ADS)

Maleki, Milad; Cugnoni, Joë; Botsis, John

2014-04-01

Due to the high homologous temperature and fast cooling rates, the microstructures of SnAgCu (SAC) solders are in a meta-stable state in most applications, which is the cause of significant microstructural evolution and continuous variation in the mechanical behavior of the joints during service. The link between microstructures evolution and deformation behavior of Sn-4.0Ag-0.5Cu solder during isothermal ageing is investigated. The evolution of the microstructures in SAC solders are visualized at different scales in 3D by using a combination of synchrotron x-ray and focused ion beam/scanning electron microscopy tomography techniques at different states of ageing. The results show that, although the grain structure, morphology of dendrites, and overall volume fraction of intermetallics remain almost constant during ageing, considerable coarsening occurs in the Ag3Sn and Cu6Sn5 phases to lower the interfacial energy. The change in the morphometrics of sub-micron intermetallics is quantified by 3D statistical analyses and the kinetic of coarsening is discussed. The mechanical behavior of SAC solders is experimentally measured and shows a continuous reduction in the yield resistance of solder during ageing. For comparison, the mechanical properties and grain structure of β-tin are evaluated at different annealing conditions. Finally, the strengthening effect due to the intermetallics at different ageing states is evaluated by comparing the deformation behaviors of SAC solder and β-tin with similar grain size and composition. The relationship between the morphology and the strengthening effect due to intermetallics particles is discussed and the causes for the strength degradation in SAC solder during ageing are identified.

Implications of Pb-free microelectronics assembly in aerospace applications

NASA Technical Reports Server (NTRS)

Shapiro, A. A.; Bonner, J. K.; Ogunseitan, D.; Saphores, J. D.; Schoenung, J.

2003-01-01

The commercial microelectronics industry is rapidly moving to completely Pb-free assembly strategies within the next decade. This trend is being driven by existing and proposed legislation in Europe and in Japan. The microelectronics industry has become truly global, as indicated by major U .S. firms who already adopted Pb-free implementation programs. Among these forward-looking firms are AT&T, IBM, Motorola, HP and Intel to name a few.Following Moore's law, advances in microelectronics are happening very rapidly. In many cases, commercial industry is ahead of the aerospace sector in technology. Progress by commercial industry, along with cost, drives the use of Commercial Off-The-Shelf (COTS) parts for military and space applications. We can thus anticipate that the aerospace industry will, at some point, be forced to use Pb-free components and subsystems as part of their standard business practices. In this paper we attempt to provide a snapshot of the commercial industry trends and how they may impact electronics in the aerospace environment. In addition, we also look at different strategies for implementation. Finally we present data collected on a recent NASA project to focus on finding suitable alternatives to eutectic tin-lead solders and solder pastes. The world is moving toward implementation of environmentally friendly manufacturing techniques. The aerospace industry will be forced to deal with issues related with Pb free assembly, either by availability or legislation. This paper provides some insight into some of the tradeoffs that should be considered.

Sagittal and vertical load-deflection and permanent deformation of transpalatal arches connected with palatal implants: an in-vitro study.

PubMed

Crismani, Adriano G; Celar, Ales G; Burstone, Charles J; Bernhart, Thomas G; Bantleon, Hans-Peter; Mittlboeck, Martina

2007-06-01

The purposes of this laboratory investigation were to (1) measure the sagittal and vertical deflection of loaded transpalatal arches (TPAs) connected to a palatal implant, (2) measure the extent of permanent deformation of the connecting TPA in the sagittal and vertical directions, (3) test various wire dimensions in terms of deflection behavior, and (4) evaluate soldering vs laser welding vs adhesive bonding of TPAs in terms of load deflection behavior. Stainless steel wires of 6 dimensions were tested: 0.8 x 0.8, 0.9, 1, 1.1, 1.2, and 1.2 x 1.2 mm. For each dimension, 10 specimens were soldered to the palatal implant abutment, 10 were laser welded, and 10 were adhesively bonded to the implant abutment (total, 180 specimens). The measuring device applied increments of force of 50 cN, from 0 to 500 cN. Then the specimens were unloaded. The values were statistically described and analyzed with ANOVA and Wilcoxon rank sum tests. Absolute orthodontic anchorage without deformation of TPAs was not observed with the wire dimensions tested. To prevent loss of anchorage greater than 370 mum (sagittal deflection of 1.2 x 1.2 mm adhesively bonded TPA at 500 cN force level), wires thicker than 1.2 x 1.2 mm or cast anchorage elements must be considered for clinical practice. However, larger cross sections might cause more patient discomfort, and laboratory procedures increase costs.

Bottom-up nanoconstruction by the welding of individual metallic nanoobjects using nanoscale solder.

PubMed

Peng, Yong; Cullis, Tony; Inkson, Beverley

2009-01-01

We report that individual metallic nanowires and nanoobjects can be assembled and welded together into complex nanostructures and conductive circuits by a new nanoscale electrical welding technique using nanovolumes of metal solder. At the weld sites, nanoscale volumes of a chosen metal are deposited using a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. We demonstrate by welding both similar and dissimilar materials that the use of nanoscale solder is clean, controllable, and reliable and ensures both mechanically strong and electrically conductive contacts. Nanoscale weld resistances of just 20Omega are achieved by using Sn solder. Precise engineering of nanowelds by this technique, including the chemical flexibility of the nanowire solder, and high spatial resolution of the nanowelding method, should result in research applications including fabrication of nanosensors and nanoelectronics constructed from a small number of nanoobjects, and repair of interconnects and failed nanoscale electronics.

Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

NASA Astrophysics Data System (ADS)

Hasnine, M.; Tolla, B.; Vahora, N.

2018-04-01

This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bosco, Nick; Silverman, Timothy J.; Kurtz, Sarah

FEM simulations of PbSn solder fatigue damage are used to evaluate seven cities that represent a variety of climatic zones. It is shown that the rate of solder fatigue damage is not ranked with the cities' climate designations. For an accurate ranking, the mean maximum daily temperature, daily temperature change and a characteristic of clouding events are all required. A physics-based empirical equation is presented that accurately calculates solder fatigue damage according to these three factors. An FEM comparison of solder damage accumulated through service and thermal cycling demonstrates the number of cycles required for an equivalent exposure. For anmore » equivalent 25-year exposure, the number of thermal cycles (-40 degrees C to 85 degrees C) required ranged from roughly 100 to 630 for the cities examined. It is demonstrated that increasing the maximum cycle temperature may significantly reduce the number of thermal cycles required for an equivalent exposure.« less

Laser welding of vas deferens in rodents: initial experience with fluid solders.

PubMed

Trickett, R I; Wang, D; Maitz, P; Lanzetta, M; Owen, E R

1998-01-01

This study evaluates the use of sutureless laser welding for vasovasostomy. In 14 rodents, the left vas deferens underwent vasovasostomy using an albumin-based solder applied to the adventitia of the vas deferens. The solder contained the dye, indocyanine green, to allow selective absorption and denaturation by a fiber-coupled 800-nm diode laser. The right vas deferens served as a control, receiving conventional layered microsurgical repair. We used a removable 4/0 nylon stent and microclamps to appose the vas deferens during repair, with no need for stay sutures. The mean time to perform laser solder repair (23.5 min) and conventional repair (23.3 min) were not significantly different (P=0.91). However, examination after 8 weeks showed that granuloma formation (G) and patency (P) rates for the conventional suture technique (G, 14%; P, 93%) were significantly better than observed for the laser solder technique (G, 57%; P, 50%).

Development of a soft-soldering system for aluminum

NASA Astrophysics Data System (ADS)

Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

1983-03-01

The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

NASA Technical Reports Server (NTRS)

Rolin, T. D.; Hodge, R. E.

2008-01-01

An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

Wetting properties of Au/Sn solders for microelectronics

NASA Astrophysics Data System (ADS)

Peterson, K. A.; Williams, C. B.

Hermetic sealing of microelectronic packages with Au/Sn solder is critically dependent upon good wetting. In studying specific problems in hermetic sealing, a solderability test based on ASTM standard F-357-78 has proven useful. The test has helped isolate and quantify the effects of contamination due to epoxy die attach and related handling, thermal preconditioning of packages, gold plating thickness, time and temperature during sealing, and solder alloy composition as they affect wetting. Some differences in hardware have been documented between manufacturing lots, but the overriding factors have been contamination which occurs during packaging process flows and thermal preconditioning during processing. The paper includes a review of metallurgical aspects of soldering to a non-inert surface and an examination of microstructural differences in seal joints. The results also quantify the conventional wisdom that alloys which are on the tin-rich side of the eutectic composition offer superior wetting properties.

Interaction of intermetallic compound formation in Cu/SnAgCu/NiAu sandwich solder joints

NASA Astrophysics Data System (ADS)

Xia, Yanghua; Lu, Chuanyan; Chang, Junling; Xie, Xiaoming

2006-05-01

The interaction between Cu/solder interface and solder/Ni interface at a Cu/SnAgCu/NiAu sandwich solder joint with various surface finishes and solder heights was investigated. The interfacial microstructure and composition of intermetallic compounds (IMCs) were characterized by a scanning electron microscope (SEM) equipped with energy-dispersive x-ray spectroscopy (EDX). The phase structure of IMC was identified by x-ray diffraction (XRD). It is found that ternary (Cu,Ni)6Sn5 IMCs form at both interfaces. The composition, thickness, and morphology of the ternary IMCs depend not only on the interface itself, but also on the opposite interface. That is to say, strong coupling effects exist between the two interfaces. Lattice parameters of (Cu,Ni)6Sn5 shrink with increasing Ni content, in agreement with Vegard’s law. The mechanism of ternary IMC formation and interface coupling effects are discussed in this paper.

NCMS PWB Surface Finishes Team project summary

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kokas, J.; DeSantis, C.; Wenger, G.

1996-04-01

The NCMS PWB Surface Finishes Consortium is just about at the end of the five year program. Dozens of projects related to surface finishes and PWB solder-ability were performed by the team throughout the program, and many of them are listed in this paper. They are listed with a cross reference to where and when a technical paper was presented describing the results of the research. However, due to time and space constraints, this paper can summarize the details of only three of the major research projects accomplished by the team. The first project described is an ``Evaluation of PWBmore » Surface Finishes.`` It describes the solderability, reliability, and wire bondability of numerous surface finishes. The second project outlined is an ``Evaluation of PWB Solderability Test Methods.`` The third project outlined is the ``Development and Evaluation of Organic Solderability Preservatives.``« less

Fluid Dynamics and Solidification of Molten Solder Droplets Impacting on a Substrate in Microgravity

NASA Technical Reports Server (NTRS)

Megardis, C. M.; Poulikakos, D.; Diversiev, G.; Boomsma, K.; Xiong, B.; Nayagam, V.

1999-01-01

This program investigates the fluid dynamics and simultaneous solidification of molten solder droplets impacting on a flat smooth substrate. The problem of interest is directly relevant to the printing of microscopic solder droplets in surface mounting of microelectronic devices. The study consists of a theoretical and an experimental component. The theoretical work uses axisymmetric Navier-Stokes models based on finite element techniques. The experimental work will be ultimately performed in microgravity in order to allow for the use of larger solder droplets which make feasible the performance of accurate measurements, while maintaining similitude of the relevant fluid dynamics groups (Re, We).

Fluid Dynamics and Solidification of Molten Solder Droplets Impacting on a Substrate in Microgravity

NASA Technical Reports Server (NTRS)

Poulikakos, Dimos; Megaridis, Constantine M.; Vedha-Nayagam, M.

1996-01-01

This program investigates the fluid dynamics and simultaneous solidification of molten solder droplets impacting on a flat substrate. The problem of interest is directly relevant to the printing of microscopic solder droplets in surface mounting of microelectronic devices. The study consists of a theoretical and an experimental component. The theoretical work uses axisymmetric Navier-Stokes models based on finite element techniques. The experimental work is performed in microgravity to allow for the use of larger solder droplets that make feasible the performance of accurate measurements while maintaining similitude of the relevant fluid dynamics groups (Re, We) and keeping the effect of gravity negligible.

Solder extrusion pressure bonding process and bonded products produced thereby

DOEpatents

Beavis, Leonard C.; Karnowsky, Maurice M.; Yost, Frederick G.

1992-01-01

Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

Solder extrusion pressure bonding process and bonded products produced thereby

NASA Astrophysics Data System (ADS)

Beavis, L. C.; Karnowsky, M. M.; Yost, F. G.

1990-04-01

The production of soldered joints are highly reliable and capable of surviving 10,000 thermal cycles between about -40 and 110 C. The process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices

NASA Astrophysics Data System (ADS)

Zhang, Liang; Fan, Xi-ying; Guo, Yong-huan; He, Cheng-wen

2014-05-01

Microstructures and fatigue life of SnAgCu and SnAgCu bearing nano-Al particles in QFP (Quad flat package) devices were investigated, respectively. Results show that the addition of nano-Al particles into SnAgCu solder can refine the microstructures of matrix microstructure. Moreover, the nano-Al particles present in the solder matrix, act as obstacles which can create a back stress, resisting the motion of dislocations. In QFP device, it is found that the addition of nano-Al particles can increase the fatigue life by 32% compared with the SnAgCu solder joints during thermal cycling loading.

Research on defects inspection of solder balls based on eddy current pulsed thermography.

PubMed

Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe

2015-10-13

In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

Electrical characteristics for Sn-Ag-Cu solder bump with Ti/Ni/Cu under-bump metallization after temperature cycling tests

NASA Astrophysics Data System (ADS)

Shih, T. I.; Lin, Y. C.; Duh, J. G.; Hsu, Tom

2006-10-01

Lead-free solder bumps have been widely used in current flip-chip technology (FCT) due to environmental issues. Solder joints after temperature cycling tests were employed to investigate the interfacial reaction between the Ti/Ni/Cu under-bump metallization and Sn-Ag-Cu solders. The interfacial morphology and quantitative analysis of the intermetallic compounds (IMCs) were obtained by electron probe microanalysis (EPMA) and field emission electron probe microanalysis (FE-EPMA). Various types of IMCs such as (Cu1-x,Agx)6Sn5, (Cu1-y,Agy)3Sn, and (Ag1-z,Cuz)3Sn were observed. In addition to conventional I-V measurements by a special sample preparation technique, a scanning electron microscope (SEM) internal probing system was introduced to evaluate the electrical characteristics in the IMCs after various test conditions. The electrical data would be correlated to microstructural evolution due to the interfacial reaction between the solder and under-bump metallurgy (UBM). This study demonstrated the successful employment of an internal nanoprobing approach, which would help further understanding of the electrical behavior within an IMC layer in the solder/UBM assembly.

Comparative in vitro study of tissue welding using a 808 nm diode laser and a Ho:YAG laser.

PubMed

Ott, B; Züger, B J; Erni, D; Banic, A; Schaffner, T; Weber, H P; Frenz, M

2001-01-01

In vitro porcine arteries and veins have been welded end-to-end using either a 808 nm diode laser combined with an indocyanine green enhanced albumin solder, or with a continuous-wave (cw) Ho:YAG laser without biological solder. The vascular stumps were approached to each other over a coronary dilatation catheter in order to obtain a precise alignment and good coaptation. Standard histology revealed for both welding techniques lateral tissue damage between 2 and 3 mm caused by laser-induced heat. Good solder attachment to the tissue was observed by the use of a scanning electron microscope. The vessels soldered with the 808 nm diode laser using albumin solder showed considerably higher tensile strength (1 N compared to 0.3 N) than vessels welded exclusively by Ho:YAG laser radiation. In contrast, leaking pressure (350 +/- 200 mmHg) and bursting pressure (457 +/- 200 mmHg) were found to be independent of the welding technique used. This study demonstrates that fast (total welding time about 2-5 min), stable and tight microvascular anastomosis can be achieved with the use of a dye-enhanced albumin laser soldering technique and an ancillary coronary dilatation catheter.

Microstructure characteristics of vacuum glazing brazing joints using laser sealing technique

NASA Astrophysics Data System (ADS)

Liu, Sixing; Yang, Zheng; Zhang, Jianfeng; Zhang, Shanwen; Miao, Hong; Zhang, Yanjun; Zhang, Qi

2018-05-01

Two pieces of plate glass were brazed into a composite of glazing with a vacuum chamber using PbO-TiO2-SiO2-RxOy powder filler alloys to develop a new type of vacuum glazing. The brazing process was carried out by laser technology. The interface characteristics of laser brazed joints formed between plate glass and solder were investigated using optical microscope, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) techniques. The results show that the inter-diffusion of Pb/Ti/Si/O elements from the sealing solder toward the glass and O/Al/Si elements from the glass toward the solder, resulting in a reaction layer in the brazed joints. The microstructure phases of PbTiO3, AlSiO, SiO2 and PbO in the glass/solder interface were confirmed by XRD analysis. The joining of the sealing solder to the glass was realized by the reaction products like fibrous structures on interface, where the wetting layer can help improve the bonding performance and strength between the sealing solder and the plate glass during the laser brazing process.

In vitro conjunctival incision repair by temperature-controlled laser soldering.

PubMed

Norman, Galia; Rabi, Yaron; Assia, Ehud; Katzir, Abraham

2009-01-01

The common method of closing conjunctival incisions is by suturing, which is associated with several disadvantages. It requires skill to apply and does not always provide a watertight closure, which is required in some operations (e.g., glaucoma filtration). The purpose of the present study was to evaluate laser soldering as an alternative method for closing conjunctival incisions. Conjunctival incisions of 20 ex vivo porcine eyes were laser soldered using a temperature-controlled fiberoptic laser system and an albumin mixed with indocyanine green as a solder. The control group consisted of five repaired incisions by a 10-0 nylon running suture. The leak pressure of the repaired incisions was measured. The mean leak pressure in the laser-soldered group was 132 mm Hg compared to 4 mm Hg in the sutured group. There was no statistically significant difference in both the incision's length and distance from the limbus between the groups, before and after the procedure, indicating that there was no severe thermal damage. These preliminary results clearly demonstrate that laser soldering may be a useful method for achieving an immediate watertight conjunctival wound closure. This procedure is faster and easier to apply than suturing.

Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads

NASA Astrophysics Data System (ADS)

Jain, C. C.; Wang, S. S.; Huang, K. W.; Chuang, T. H.

2009-03-01

The interfacial reactions in a Sn-20In-2.8Ag solder ball grid array (BGA) package with immersion Ag surface finish are investigated. After reflow, the Ag thin film dissolves quickly into the solder matrix, and scallop-shaped intermetallic layers, with compositions of (Cu0.98Ag0.02)6(In0.59Sn0.41)5, appear at the interfaces between Sn-20In-2.8Ag solder ball and Cu pad. No evident growth of the (Cu0.98Ag0.02)6(Sn0.59In0.41)5 intermetallic compounds was observed after prolonged aging at 100 °C. However, the growth accelerated at 150 °C, with more intermetallic scallops floating into the solder matrix. The intermetallic thickness versus the square root of reaction time ( t 1/2) shows a linear relation, indicating that the growth of intermetallic compounds is diffusion-controlled. Ball shear tests show that the strength of Sn-20In-2.8Ag solder joints after reflow is 4.4 N, which increases to 5.18 N and 5.14 N after aging at 100 and 150 °C, respectively.

A microstructurally based model of solder joints under conditions of thermomechanical fatigue

DOE Office of Scientific and Technical Information (OSTI.GOV)

Frear, D.R.; Burchett, S.N.; Rashid, M.M.

The thermomechanical fatigue failure of solder joints in increasingly becoming an important reliability issue. In this paper we present two computational methodologies that have been developed to predict the behavior of near eutectic Sn-Pb solder joints under fatigue conditions that are based on metallurgical tests as fundamental input for constitutive relations. The two-phase model mathematically predicts the heterogeneous coarsening behavior of near eutectic Sn-Pb solder. The finite element simulations from this model agree well with experimental thermomechanical fatigue tests. The simulations show that the presence of an initial heterogeneity in the solder microstructure could significantly degrade the fatigue lifetime. Themore » single phase model is a computational technique that was developed to predict solder joint behavior using materials data for constitutive relation constants that could be determined through straightforward metallurgical experiments. A shear/torsion test sample was developed to impose strain in two different orientations. Materials constants were derived from these tests and the results showed an adequate fit to experimental results. The single-phase model could be very useful for conditions where microstructural evolution is not a dominant factor in fatigue.« less

Electromigration and thermomigration in lead-free tin-silver-copper and eutectic tin-lead flip chip solder joints

NASA Astrophysics Data System (ADS)

Ou Yang, Fan-Yi

Phase separation and microstructure change of eutectic SnPb and SnAgCu flip chip solder joint were investigated under thermomigration, electromigration, stressmigration and the combination of these effects. Different morphological behaviors under DC and AC electromigration were seen. Phase separation with Pb rich phase migration to the anode was observed when current density is below 1.6 x 104 A/cm2 at 100°C. For some cases, phase separation of Pb-rich phase and Su-rich phase as well as refinement of lamellar microstructure has also been observed. We propose that the refinement is due to recrystallization. On the other hand, time-dependent melting of eutectic SnPb flip chip solder joints has been observed to occur frequently with current density above 1.6 x 104 A/cm 2at 100°C. It has been found that it is due to joule heating of the on-chip Al interconnects. We found that electromigration has especially generated voids at the anode of the Al. This damage has greatly increased the resistance of the Al, which produces the heat needed to melt the solder joint. Owing to the line-to-bump configuration in flip chip solder joints, current crowding occurs when electrons enters into or exits from the solder bump. At the cathode contact, current crowding induced pancake-type void formation was observed widely. Furthermore, at the anode contact, we note that hillock or whisker forms. The cross-sectioned surface in SnPb showed dimple and bulge after electromigration, while that of SnAgCu remained flat. The difference is due to a larger back stress in the SnAgCu, consequently electromigration in SnAgCu is slower than that in SnPb. For thermomigration in eutectic SnPb flip chip solder joints, phase separation of Sn and Pb occurred, with Pb moving to the cold end. Both Sn and Pb have a stepwise concentration profile across solder bump. Refinement of lamellar microstructure was observed, indicating recrystallization. Also, thermomigration in eutectic SnAgCu flip chip solder joint were presented. It seems that vacancy flux plays a dominant role in thermomigration in Pb-free solder bumps; voids formed on the cold end and Sn moved to the hot end.

The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

NASA Astrophysics Data System (ADS)

Werden, Jesse

The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the coarsening kinetics of SAC305, SAC+Zn, SAC+Mn, and SAC+Sb are all much slower than Pb-Sn alloys, therefore, power aging the solder will not be a viable method of stabilizing the microstructure. However, adding small amounts of Zn or Mn may be useful to maintain the original microstructure so that power aging is not required.

Investigation of Dynamic Oxygen Adsorption in Molten Solder Jetting Technology

NASA Technical Reports Server (NTRS)

Megaridis, Constantine M.; Bellizia, Giulio; McNallan, Michael; Wallace, David B.

2003-01-01

Surface tension forces play a critical role in fluid dynamic phenomena that are important in materials processing. The surface tension of liquid metals has been shown to be very susceptible to small amounts of adsorbed oxygen. Consequently, the kinetics of oxygen adsorption can influence the capillary breakup of liquid-metal jets targeted for use in electronics assembly applications, where low-melting-point metals (such as tin-containing solders) are utilized as an attachment material for mounting of electronic components to substrates. By interpreting values of surface tension measured at various surface ages, adsorption and diffusion rates of oxygen on the surface of the melt can be estimated. This research program investigates the adsorption kinetics of oxygen on the surface of an atomizing molten-metal jet. A novel oscillating capillary jet method has been developed for the measurement of dynamic surface tension of liquids, and in particular, metal melts which are susceptible to rapid surface degradation caused by oxygen adsorption. The experimental technique captures the evolution of jet swells and necks continuously along the jet propagation axis and is used in conjunction with an existing linear, axisymmetric, constant-property model to determine the variation of the instability growth rate, and, in turn, surface tension of the liquid as a function of surface age measured from the exit orifice. The conditions investigated so far focus on a time window of 2-4ms from the jet orifice. The surface properties of the eutectic 63%Sn-37%Pb solder alloy have been investigated in terms of their variation due to O2 adsorption from a N2 atmosphere containing controlled amounts of oxygen (from 8 ppm to 1000 ppm). The method performed well for situations where the oxygen adsorption was low in that time window. The value of surface tension for the 63Sn-37Pb solder in pure nitrogen was found to be 0.49 N/m, in good agreement with previously published work. A characteristic time of O(1ms) or less was determined for the molten-metal surface to be saturated by oxygen at 1000 ppm concentration in N2.

The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

PubMed

Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

2015-12-01

Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (p< 0.05). The mean tensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

The study of a light-activated albumin protein solder to bond layers of porcine small intestinal submucosa.

PubMed

Ware, Mark H; Buckley, Christine A

2003-01-01

This study investigated the feasibility of bonding layers of porcine small intestinal submucosa (SIS, Cook Biotech, Inc.) with a light-activated protein solder. SIS is an acellular, collagen-based extracellular matrix material that is approximately 100 microns thick. The solder consists of bovine serum albumin and indocyanine green dye (ICG) in deionized water. The solder is activated by an 808 nm diode laser, which denatures the albumin, causing the albumin to bond with the collagen of the tissue. The predictable absorption and thermal energy diffusion rates of ICG increase the chances of reproducible results. To determine the optimal condition for laser soldering SIS, the following parameters were varied: albumin concentration (from 30-45% (w/v) in increments of 5%), the concentration of ICG (from 0.5-2.0 mg/ml H2O) and the irradiance of the laser (10-64 W/cm2). While many of the solder compositions and laser irradiance combinations resulted in no bonding, a solder composition of 45% albumin, ICG concentration of 0.5 mg/ml H2O, and a laser irradiance of 21 W/cm2 did produce a bond between two pieces of SIS. The average shear strength of this bond was 29.5 +/- 17.1 kPa (n = 14). This compares favorably to our previous work using fibrin glue as an adhesive, in which the average shear strength was 27 +/- 15.8 kPa (n = 40).

Laparoscopic mesh fixation using laser-assisted tissue soldering in a porcine model.

PubMed

Lanzafame, Raymond J; Soltz, Barbara A; Stadler, Istvan; Soltz, Robert

2009-01-01

Animal studies using open surgical models indicate that collagen solder is capable of fixation of surgical meshes without interfering with tissue integration, increasing adhesions, or increasing inflammation intraperitoneally. This study describes development of instrumentation and techniques for laparoscopic herniorrhaphy using laser-assisted soldering technology. Anesthetized 20 kg to 25 kg female Yorkshire pigs underwent laparoscopy with a 3-trocar technique. Parietex TET, Parietex TEC, and Prolene mesh segments (5 x 5 cm) were embedded in 55% collagen solder. Segments were inserted by using a specially designed introducer and affixed to the peritoneum by using prototype laser devices (1.45 micro, 4.5 W continuous wave, 5-mm spot, 55 degrees C set temperature) and a custom laparoscopic handpiece (IPOM). Parietex PCO mesh was inserted and affixed using the Endo-hernia stapler (Control). Animals were recovered and underwent second-look laparoscopy at 6 weeks. Mesh sites were harvested after animals were euthanized. The mesh-solder constructs were easily inserted and affixed in an IPOM approach. Prolene mesh tended to curl at its edges as the solder was melted. Postoperative healing was similar to that in Control segments in all cases. Collagen-based tissue soldering permits normal wound healing and may mitigate or reduce the use of staples or other foreign bodies for laparoscopic mesh fixation, prevent tissue ischemia and possibly nerve entrapment, which result in severe postoperative pain and morbidity. Laser-assisted mesh fixation is a promising alternative for laparoscopic herniorrhaphy. Further development of this strategy is warranted.

Metallurgical and electrochemical characterization of contemporary silver-based soldering alloys.

PubMed

Ntasi, Argyro; Al Jabbari, Youssef; Mueller, Wolf Dieter; Eliades, George; Zinelis, Spiros

2014-05-01

To investigate the microstructure, hardness, and electrochemical behavior of four contemporary Ag-based soldering alloys used for manufacturing orthodontic appliances. The Ag-based alloys tested were Dentaurum Universal Silver Solder (DEN), Orthodontic Solders (LEO), Ortho Dental Universal Solder (NOB), and Silver Solder (ORT). Five disk-shaped specimens were produced for each alloy, and after metallographic preparation their microstructural features, elemental composition, and hardness were determined by scanning electron microscopy with energy-dispersive X-ray (EDX) microanalysis, X-ray diffraction (XRD) analysis, and Vickers hardness testing. The electrochemical properties were evaluated by anodic potentiodynamic scanning in 0.9% NaCl and Ringer's solutions. Hardness, corrosion current (Icorr), and corrosion potential (Ecorr) were statistically analyzed by one-way analysis of variance and Tukey test (α=.05). EDX analysis showed that all materials belong to the Ag-Zn-Cu ternary system. Three different mean atomic contrast phases were identified for LEO and ORT and two for DEN and NOB. According to XRD analysis, all materials consisted of Ag-rich and Cu-rich face-centered cubic phases. Hardness testing classified the materials in descending order as follows: DEN, 155±3; NOB, 149±3; ORT, 141±4; and LEO, 136±8. Significant differences were found for Icorr of NOB in Ringer's solution and Ecorr of DEN in 0.9% NaCl solution. Ag-based soldering alloys demonstrate great diversity in their elemental composition, phase size and distribution, hardness, and electrochemical properties. These differences may anticipate variations in their clinical performance.

Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying

NASA Astrophysics Data System (ADS)

Kao, Szu-Tsung; Duh, Jenq-Gong

2004-12-01

The mechanical alloying (MA) process is considered an alternative approach to produce solder materials. In this study, the effect of Cu concentration in the ternary Sn-3.5Ag-xCu (x=0.2, 0.7, and 1) solder by MA was investigated. The (Cu,Sn) solid solution was precipitated as the Cu6Sn5 intermetallic compound (IMC), which was distributed nonuniformly through the microstructure. The Cu6Sn5 IMC, which was present in the SnAgCu solder with high Cu composition, causes the as-milled MA particle to fracture to a smaller size. Appreciable distinction on morphology of as-milled MA powders with different Cu content was revealed. When the Cu concentration was low (x=0.2), MA particle aggregated to a spherical ingot with large particle size. For higher Cu concentration (x=0.7 and x=1), the MA particle turned to flakes with smaller particle size. The distinction of the milling mechanism of Sn-3.5Ag-xCu (x=0.2, 0.7, and 1) solder by the MA process was discussed. An effective approach was developed to reduce the particle size of the SnAgCu solder from 1 mm down to 10-100 µm by doping the Cu6Sn5 nanoparticle during the MA process. In addition, the differential scanning calorimetry (DSC) results also ensure the compatibility to apply the solder material for the reflow process.

Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

PubMed

Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

2015-08-01

The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy

DOE Office of Scientific and Technical Information (OSTI.GOV)

Silva, Bismarck Luiz, E-mail: bismarck_luiz@yahoo.com.br; Reinhart, Guillaume; Nguyen-Thi, Henri

2015-09-15

Sn–Bi solders may be applied for electronic applications where low-temperature soldering is required, i.e., sensitive components, step soldering and soldering LEDs. In spite of their potential to cover such applications, the mechanical response of soldered joints of Sn–Bi alloys in some cases does not meet the strength requirements due to inappropriate resulting microstructures. Hence, careful examination and control of as-soldered microstructures become necessary with a view to pre-programming reliable final properties. The present study aims to investigate the effects of solidification thermal parameters (growth rate — V{sub L} and cooling rate — T-dot{sub L}) on the microstructure of the Sn–52more » wt.%Bi solder solidified under unsteady-state conditions. Samples were obtained by upward directional solidification (DS), followed by characterization through metallography and scanning electron microscopy (SEM). The microstructures are shown to be formed by Sn-rich dendrites decorated with Bi precipitates surrounded by a complex regular eutectic mixture, with alternated Bi-rich and Sn-rich phases. Experimental correlations of primary (λ{sub 1}), secondary (λ{sub 2}), tertiary (λ{sub 3}) dendritic and eutectic spacings (λ{sub coarse} and λ{sub fine}) with cooling rate and growth rate are established. Two ranges of lamellar eutectic sizes were determined, described by two experimental equations λ = 1.1 V{sub L}{sup −1/2} and λ = 0.67 V{sub L}{sup −1/2}. The onset of tertiary branches within the dendritic array along the Sn–52 wt.%Bi alloy DS casting is shown to occur for cooling rates lower than 1.5 °C/s. - Highlights: • The Sn–52 wt.%Bi solder was shown to have two eutectic sizes. • The fishbone eutectic is preferably located adjacent to the Bi-rich lamellar phases. • The onset of tertiary dendritic branches in Sn–Bi is associated with T-dot{sub L} < 1.5 °C/s. • Higher eutectic fraction and λ{sub 3} provoked a reverse increase in σ{sub u} and σ{sub y}.« less

A scanning electron microscopy study of CO2 laser-albumin soldering in the rabbit model.

PubMed

Levanon, Daniel; Katzir, Abraham; Ravid, Avi

2004-12-01

We sought to assess the rabbit as an experimental animal in the investigation of laser skin soldering. We studied, using the scanning electron microscope (SEM), the surface appearances of experimental incisions made on the rabbit back skin and soldered by CO(2) laser. Laser soldering of incisions in various tissues is a modality of wound healing of a very promising clinical value. At present, more component studies on animals directed at paving the way towards clinical protocols are needed. Surgical incisions on rabbits back skin were bonded using either albumin-assisted CO(2) laser soldering (experimental) or thread suturing (reference). The incisions closed were excised 2, 3, 4, and 5 days postoperatively, and skin surfaces were studied in the SEM. Naked eye inspection and SEM analysis showed that full-length sealing of soldered and sutured incisions was discernible as early as day 2. In the SEM, all incisions were found confluently coated by epidermal cells along the former cut streak. Soldering subserved to bond incisions efficiently, with surface smooth and close to normal skin. On the other hand, the surface of sutured incisions appeared convoluted and its aesthetic quality inferior to that of the former. Some of the days two and three soldered incisions suffered dehiscence on excision, which suggests an incomplete regeneration of tensile strength at this early phase of healing. Sutured incisions tolerated excision, very probably due to the microthread still present in the skin tissue rather than because of breaking strength regained during wound healing. Also, hair stumps re-grown on the skin by day 5 postoperative might impair satisfactory microscopy of bonded incisions. CO(2) laser soldering of incisions on the rabbit back skin effected rapid wound sealing and resulted in smooth scars indistinguishable from normal skin. The rabbit is well suited for this kind of studies, provided that excision of experimental cuts takes place not later than 5 days post-incision so that hair stumps may not grow large enough to jeopardize the quality of scanning electron microscopy.

Proceedings of the Tenth Biennial Guidance Test Symposium Held at Holloman Air Force Base, New Mexico, 7-9 October, 1981. Volume I,

DTIC Science & Technology

1981-10-01

SOLDER FILLET. SOLD R FILET.S CURRENT TORQUE INPUT [] SCALE FACTOR SELECT RESISTOR 5NP BETWEEN PINS 10 & 11. 6 SIGNAL OUTPUT 1.UNIT WEIGHT : 200 ± 10...The engineers at Contraves Goerz Corporation have recently applied a high range IADS as a high pass compensation element in a rate table control...frequency, since at that frequency the low pass signal phase is -900 and the high pass signal phase is +90". Contraves Goerz has solved that system

Solder extrusion pressure bonding process and bonded products produced thereby

DOEpatents

Beavis, L.C.; Karnowsky, M.M.; Yost, F.G.

1992-06-16

Disclosed is a process for production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about [minus]40 C and 110 C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

Estimation of the Viscosities of Liquid Sn-Based Binary Lead-Free Solder Alloys

NASA Astrophysics Data System (ADS)

Wu, Min; Li, Jinquan

2018-01-01

The viscosity of a binary Sn-based lead-free solder alloy was calculated by combining the predicted model with the Miedema model. The viscosity factor was proposed and the relationship between the viscosity and surface tension was analyzed as well. The investigation result shows that the viscosity of Sn-based lead-free solders predicted from the predicted model shows excellent agreement with the reported values. The viscosity factor is determined by three physical parameters: atomic volume, electronic density, and electro-negativity. In addition, the apparent correlation between the surface tension and viscosity of the binary Sn-based Pb-free solder was obtained based on the predicted model.

Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

NASA Astrophysics Data System (ADS)

This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

Experimental Investigation of Solder Joint Defect Formation and Mitigation in Reduced-Gravity Environments

NASA Technical Reports Server (NTRS)

Watson, J. Kevin; Struk, Peter M.; Pettegrew, RIchard D.; Downs, Robert S.

2006-01-01

This paper documents a research effort on reduced gravity soldering of plated through hole joints which was conducted jointly by the National Center for Space Exploration Research, NASA Glenn Research Center, and NASA Johnson Space Center. Significant increases in joint porosity and changes in external geometry were observed in joints produced in reduced gravity as compared to normal gravity. Multiple techniques for mitigating the observed increase in porosity were tried, including several combinations of flux and solder application techniques, and demoisturizing the circuit board prior to soldering. Results were consistent with the hypothesis that the source of the porosity is a combination of both trapped moisture in the circuit board itself, as well as vaporized flux that is trapped in the molten solder. Other topics investigated include correlation of visual inspection results with joint porosity, pore size measurements, limited pressure effects (0.08 MPa - 0.1 MPa) on the size and number of pores, and joint cooling rate.

Recycling of lead solder dross, Generated from PCB manufacturing

NASA Astrophysics Data System (ADS)

Lucheva, Biserka; Tsonev, Tsonio; Iliev, Peter

2011-08-01

The main purpose of this work is to analyze lead solder dross, a waste product from manufacturing of printed circuit boards by wave soldering, and to develop an effective and environmentally sound technology for its recycling. A methodology for determination of the content and chemical composition of the metal and oxide phases of the dross is developed. Two methods for recycling of lead solder dross were examined—carbothermal reduction and recycling using boron-containing substances. The influence of various factors on the metal yield was studied and the optimal parameters of the recycling process are defined. The comparison between them under the same parameters-temperature and retention time, showed that recycling of dross with a mixture of borax and boric acid in a 1:2 ratio provides higher metal yield (93%). The recycling of this hazardous waste under developed technology gets glassy slag and solder, which after correction of the chemical composition can be used again for production of PCB.

Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hamm, Randy; Peterson, Kenneth A.

2015-10-01

This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tiltmore » was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.« less

Susceptibility to Cracking of Different Lots of CDR35 Capacitors

NASA Technical Reports Server (NTRS)

Teverovsky, Alexander

2017-01-01

On-orbit flight anomalies that occurred after several months of operation were attributed to excessive leakage currents in CDR35 style 0.47 microF 50 V capacitors operating at 10 V. In this work, a lot of capacitors similar to the lot that caused the anomaly have been evaluated in parallel with another lot of similar parts to assess their susceptibility to cracking under manual soldering conditions and get insight into a possible mechanism of failure. Leakage currents in capacitors were monitored at different voltages and environmental conditions before and after terminal solder dip testing that was used to simulate thermal shock during manual soldering. Results of cross-sectioning, acoustic microscopy, and measurements of electrical and mechanical characteristics of the parts have been analyzed, and possible mechanisms of failures considered. It is shown that the susceptibility to cracking and failures caused by manual soldering is lot-related. Recommendations for testing that would help to select lots that are more robust against manual soldering stresses and mitigate the risk of failures suggested.

Gamma ray detector modules

NASA Technical Reports Server (NTRS)

Capote, M. Albert (Inventor); Lenos, Howard A. (Inventor)

2009-01-01

A radiation detector assembly has a semiconductor detector array substrate of CdZnTe or CdTe, having a plurality of detector cell pads on a first surface thereof, the pads having a contact metallization and a solder barrier metallization. An interposer card has planar dimensions no larger than planar dimensions of the semiconductor detector array substrate, a plurality of interconnect pads on a first surface thereof, at least one readout semiconductor chip and at least one connector on a second surface thereof, each having planar dimensions no larger than the planar dimensions of the interposer card. Solder columns extend from contacts on the interposer first surface to the plurality of pads on the semiconductor detector array substrate first surface, the solder columns having at least one solder having a melting point or liquidus less than 120 degrees C. An encapsulant is disposed between the interposer circuit card first surface and the semiconductor detector array substrate first surface, encapsulating the solder columns, the encapsulant curing at a temperature no greater than 120 degrees C.

Characterization of skin tissue soldering using diode laser and indocyanine green: in vitro studies.

PubMed

Khosroshahi, M E; Nourbakhsh, M S; Saremi, S; Tabatabaee, F

2010-03-01

Laser tissue soldering based on protein as biological glues and other compounds can provide greater bond strength and less collateral damage. Endogenous and exogenous materials such as indocyanine green (ICG) are often added to solders to enhance light absorption. The purpose of this in vitro study was to examine the impact of different parameters of laser soldering on the thermo-physical properties of the skin. A mixture of albumin solder and ICG was prepared, and then the coated samples were irradiated by an 810 nm diode laser under different conditions. The temperature rise, number of scans (N(s)), and scan velocity (V(s)) were investigated in this study. The results showed that, at each laser irradiance (I), the tensile strength (sigma) of incisions repaired in static mode was higher than in dynamic mode and that the sigma increased with both increasing N(s) and increasing I. It is therefore important to consider the trade off between scan velocity and surface temperature for achieving an optimum operating condition.

STS-57 Pilot Duffy uses TDS soldering tool in SPACEHAB-01 aboard OV-105

NASA Image and Video Library

1993-07-01

STS057-30-021 (21 June-1 July 1993) --- Astronaut Brian Duffy, pilot, handles a soldering tool onboard the Earth-orbiting Space Shuttle Endeavour. The Soldering Experiment (SE) called for a crew member to solder on a printed circuit board containing 45 connection points, then de-solder 35 points on a similar board. The SE was part of a larger project called the Tools and Diagnostic Systems (TDS), sponsored by the Space and Life Sciences Directorate at Johnson Space Center (JSC). TDS represents a group of equipment selected from the tools and diagnostic hardware to be supported by the International Space Station program. TDS was designed to demonstrate the maintenance of experiment hardware on-orbit and to evaluate the adequacy of its design and the crew interface. Duffy and five other NASA astronauts spent almost ten days aboard the Space Shuttle Endeavour in Earth-orbit supporting the SpaceHab mission, retrieving the European Retrievable Carrier (EURECA) and conducting various experiments.

Derivation of mechanical characteristics for Ni/Au intermetallic surface with SAC305 solder

NASA Astrophysics Data System (ADS)

Kim, Jong-Min; Lee, Hyun-Boo; Chang, Yoon-Suk; Choi, Jae-Boong

2013-03-01

Many surface finish methods are used to connect a substrate with the electric components of IT products in the micro-packaging process, and various types of lead-free solder have been developed as alternative materials to lead-based solder to reduce environmental contamination. However, there has been little research on the mechanical properties of the inter-metallic surface which is generated in the bumping process between the lead-free solder and surface films such as Ni/Au. The present work is to derive the material properties of a Ni/Au inter-metallic surface with SAC305 solder. A series of indentation tests were carried out by changing four nano-scale indentation depths and two strain rates. Also, a reverse algorithm method was adopted to determine the elastic-plastic stress-strain curve based on the load-displacement curve from the indentation test data. As a result of the material characterization effort, the mean elastic modulus, yield strength and strain hardening exponent of IMC with Ni/Au finish were determined.

Hand digit control in children: motor overflow in multi-finger pressing force vector space during maximum voluntary force production.

PubMed

Shim, Jae Kun; Karol, Sohit; Hsu, Jeffrey; de Oliveira, Marcio Alves

2008-04-01

The aim of this study was to investigate the contralateral motor overflow in children during single-finger and multi-finger maximum force production tasks. Forty-five right handed children, 5-11 years of age produced maximum isometric pressing force in flexion or extension with single fingers or all four fingers of their right hand. The forces produced by individual fingers of the right and left hands were recorded and analyzed in four-dimensional finger force vector space. The results showed that increases in task (right) hand finger forces were linearly associated with non-task (left) hand finger forces. The ratio of the non-task hand finger force magnitude to the corresponding task hand finger force magnitude, termed motor overflow magnitude (MOM), was greater in extension than flexion. The index finger flexion task showed the smallest MOM values. The similarity between the directions of task hand and non-task hand finger force vectors in four-dimensional finger force vector space, termed motor overflow direction (MOD), was the greatest for index and smallest for little finger tasks. MOM of a four-finger task was greater than the sum of MOMs of single-finger tasks, and this phenomenon was termed motor overflow surplus. Contrary to previous studies, no single-finger or four-finger tasks showed significant changes of MOM or MOD with the age of children. We conclude that the contralateral motor overflow in children during finger maximum force production tasks is dependent upon the task fingers and the magnitude and direction of task finger forces.

75 FR 45606 - Interagency Ocean Policy Task Force-Final Recommendations of the Interagency Ocean Policy Task Force

Federal Register 2010, 2011, 2012, 2013, 2014

2010-08-03

... COUNCIL ON ENVIRONMENTAL QUALITY Interagency Ocean Policy Task Force--Final Recommendations of the Interagency Ocean Policy Task Force AGENCY: Council on Environmental Quality. ACTION: Notice of Availability, Interagency Ocean Policy Task Force's [[Page 45607

Shrink-Fit Solderable Inserts Seal Hermetically

NASA Technical Reports Server (NTRS)

Croucher, William C.

1992-01-01

Shrink-fit stainless-steel insert in aluminum equipment housing allows electrical connectors to be replaced by soldering, without degrading hermeticity of housing or connector. Welding could destroy electrostatic-sensitive components and harm housing and internal cables. Steel insert avoids problems because connector soldered directly to it rather than welded to housing. Seals between flange and housing, and between connector and flange resistant to leaks, even after mechanical overloading and thermal shocking.

Investigation of gold embrittlement in connector solder joints

NASA Technical Reports Server (NTRS)

Lane, F. L.

1972-01-01

An investigation was performed to determine to what extent typical flight connector solder joints may be embrittled by the presence of gold. In addition to mapping of gold content in connector solder joints by an electron microprobe analyzer, metallographic examinations and mechanical tests (thermal shock, vibration, impact and tensile strength) were also conducted. A description of the specimens and tests, a discussion of the data, and some conclusions are presented.

Experimental Study of Solder/Copper Interface Failure Under Varying Strain Rates

DTIC Science & Technology

2011-03-01

Factors Affecting Solder Joint Reliability Gu et al. [1] determined that during the life cycle of electronic assemblies, approximately 55 percent of...related to vibration and shock, with the remaining percentage associated with changes in 2 humidity. Research conducted by Ross et al. [2] adds...that creep strain is the most important time-dependent factor affecting the reliability of solder joints in electronic equipment. 2. Effects of

Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

NASA Astrophysics Data System (ADS)

Yoon, Jeong-Won; Noh, Bo-In; Jung, Seung-Boo

2011-09-01

Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Paulus, Wilfred; Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor; Rahman, Irman Abdul

Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the incrementmore » of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.« less

Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects

NASA Astrophysics Data System (ADS)

Lee, Tae-Kyu; Ma, Hongtao; Liu, Kuo-Chuan; Xue, Jie

2010-12-01

The interaction between isothermal aging and the long-term reliability of fine-pitch ball grid array (BGA) packages with Sn-3.0Ag-0.5Cu (wt.%) solder ball interconnects was investigated. In this study, 0.4-mm fine-pitch packages with 300- μm-diameter Sn-Ag-Cu solder balls were used. Two different package substrate surface finishes were selected to compare their effects on the final solder composition, especially the effect of Ni, during thermal cycling. To study the impact on thermal performance and long-term reliability, samples were isothermally aged and thermally cycled from 0°C to 100°C with 10 min dwell time. Based on Weibull plots for each aging condition, package lifetime was reduced by approximately 44% by aging at 150°C. Aging at 100°C showed a smaller impact but similar trend. The microstructure evolution was observed during thermal aging and thermal cycling with different phase microstructure transformations between electrolytic Ni/Au and organic solderability preservative (OSP) surface finishes, focusing on the microstructure evolution near the package-side interface. Different mechanisms after aging at various conditions were observed, and their impacts on the fatigue lifetime of solder joints are discussed.

Vibration characteristics of aluminum surface subjected to ultrasonic waves and their effect on wetting behavior of solder droplets.

PubMed

Ma, Lin; Xu, Zhiwu; Zheng, Kun; Yan, Jiuchun; Yang, Shiqin

2014-03-01

The vibration characteristics of an aluminum surface subjected to ultrasonic waves were investigated with a combination of numerical simulation and experimental testing. The wetting behavior of solder droplets on the vibrating aluminum surface was also examined. The results show that the vibration pattern of the aluminum surface is inhomogeneous. The amplitude of the aluminum surface exceeds the excitation amplitude in some zones, while the amplitude decreases nearly to zero in other zones. The distribution of the zero-amplitude zones is much less dependent on the strength of the vibration than on the location of the vibration source. The surface of the liquid solder vibrates at an ultrasonic frequency that is higher than the vibration source, and the amplitude of the liquid solder is almost twice that of the aluminum surface. The vibration of the surface of the base metal (liquid solder) correlates with the oxide film removal effect. Significant removal of the oxide film can be achieved within 2s when the amplitude of the aluminum surface is higher than 5.4 μm or when the amplitude of the liquid solder surface is higher than 10.2 μm. Copyright © 2013 Elsevier B.V. All rights reserved.

Effect of Zn addition on bulk microstructure of lead-free solder SN100C

NASA Astrophysics Data System (ADS)

Nur Nadirah M., K.; Nurulakmal M., S.

2017-12-01

This paper reports the effect of adding Zn (0.5 wt% Zn, 1.0 wt% Zn) to the bulk microstructure and intermetallic compound (IMC) formation of commercial SN100C (Sn-0.7Cu-0.05Ni+Ge) lead-free solder alloy. Solder alloys were prepared by melting SN100C ingot and Zn shots, and subsequently casted into steel mold. Samples were ground and polished for XRF, and polished samples were then etched for microstructure analysis. Microstructure of bulk solder and the IMC were observed using SEM equipped with EDX. SEM result showed the addition of 0.5 wt% Zn resulted in increased grain size of β-Sn matrix but further addition of Zn (1 wt%) reduced the size of β-Sn dendrites in the bulk solder. Several intermetallic compounds (IMCs) were observed distributed in the Sn matrix; Cu-Zn, Ni-Zn and Cu-Zn-Ni IMC but in relatively small percentage compared to Cu-Zn and Ni-Zn. These particles could be considered as effective nucleating agent that led to finer β-Sn grains. It is expected that the finer β-Sn will contribute towards higher solder strength and the various IMCs present could act as suppressant for Sn diffusion which will then tend to reduce the IMC growth during thermal aging.

Advances in Pb-free solder microstructure control and interconnect design

DOE PAGES

Reeve, Kathlene N.; Holaday, John R.; Choquette, Stephanie M.; ...

2016-06-09

New electronics applications demanding enhanced performance and higher operating temperatures have led to continued research in the field of Pb-free solder designs and interconnect solutions. In this paper, recent advances in the microstructural design of Pb-free solders and interconnect systems were discussed by highlighting two topics: increasing β-Sn nucleation in Sn-based solders, and isothermally solidified interconnects using transient liquid phases. Issues in β-Sn nucleation in Sn-based solders were summarized in the context of Swenson’s 2007 review of the topic. Recent advancements in the areas of alloy composition manipulation, nucleating heterogeneities, and rapid solidification were discussed, and a proposal based onmore » a multi-faceted solidification approach involving the promotion of constitutional undercooling and nucleating heterogeneities was outlined for future research. The second half of the paper analyzed two different approaches to liquid phase diffusion bonding as a replacement for high-Pb solders, one based on the application of the pseudo-binary Cu-Ni-Sn ternary system, and the other on a proposed thermodynamic framework for identifying potential ternary alloys for liquid phase diffusion bonding. Furthermore, all of the concepts reviewed relied upon the fundamentals of thermodynamics, kinetics, and solidification, to which Jack Smith substantially contributed during his scientific career.« less

Optimal parameters for arterial repair using light-activated surgical adhesives.

PubMed

Soller, Eric C; Hoffman, Grant T; McNally-Heintzelman, Karen M

2003-01-01

The clinical acceptance of laser-tissue repair techniques is dependent on the reproducibility of viable repairs. Reproducibility is dependent on two factors: (i) the choice of materials to be used as the adhesive; and (ii) obtaining temperatures high enough to cause protein denaturation at the vital tissue interface without causing excessive thermal damage to the surrounding tissue. The use of a polymer scaffold as a carrier for the protein solder provides for uniform application of the solder to the tissue, thus allowing for pre-selection of optimal laser parameters. The scaffold also facilitates precise tissue alignment and ease of clinical application. In addition, the scaffold can be doped with various pharmaceuticals such as hemostatic and thrombogenic agents to aid wound healing. An ex vivo study was performed to correlate solder and tissue temperature with the tensile strength of arterial repairs formed using scaffold-enhanced light-activated surgical adhesives. Previous studies by our group using solid protein solder without the scaffold indicate that a solder/tissue, interface temperature of 65 degrees C is optimal. Using this parameter as a benchmark, laser irradiance was varied and temperatures were recorded at the surface and at the tissue interface of scaffold-enhanced protein solder using an infrared temperature monitoring system, designed by the researchers, and a type-K thermocouple, respectively.

Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders

PubMed Central

Laurila, Tomi; Vuorinen, Vesa

2009-01-01

In this paper we will demonstrate how a thermodynamic-kinetic method can be utilized to rationalize a wide range of interfacial phenomena between Sn-based lead-free solders and Ni metallizations. First, the effect of P on the interfacial reactions, and thus on the reliability, between Sn-based solders and electroless Ni/immersion Au (ENIG) metallizations, will be discussed. Next, the effect of small amounts of Cu in Sn-based solders on the intermetallic compound (IMC), which forms first on top of Ni metallization, will be covered. With the help of thermodynamic arguments a so called critical Cu concentration for the formation of (Cu,Ni)6Sn5 can be determined as a function of temperature. Then the important phenomenon of redeposition of (Au,Ni)Sn4 layer on top of Ni3Sn4 IMC will be discussed in detail. The reasons leading to this behaviour will be rationalized with the help of thermodynamic information and an explanation of why this phenomenon does not occur when an appropriate amount of Cu is present in the soldering system will be given. Finally, interfacial reaction issues related to low temperature Sn-Zn and Sn-Bi based solders and Ni metallization will be discussed.

STUDY OF THE RHIC BPM SMA CONNECTOR FAILURE PROBLEM

DOE Office of Scientific and Technical Information (OSTI.GOV)

LIAW,C.; SIKORA, R.; SCHROEDER, R.

2007-06-25

About 730 BPMs are mounted on the RHIC CQS and Triplet super-conducting magnets. Semi-rigid coaxial cables are used to bring the electrical signal from the BPM feedthroughs to the outside flanges. at the ambient temperature. Every year around 10 cables will lose their signals during the operation. The connection usually failed at the warm end of the cable. The problems were either the solder joint failed or the center conductor retracted out of the SMA connector. Finite element analyses were performed to understand the failure mechanism of the solder joint. The results showed that (1) The SMA center conductor canmore » separate from the mating connector due to the thermal retraction. (2) The maximum thermal stress at the warm end solder joint can exceed the material strength of the Pb37/Sn63 solder material and (3) The magnet ramping frequency (-10 Hz), during the machine startup, can possibly resonant the coaxial cable and damage the solder joints, especially when a fracture is initiated. Test results confirmed that by using the silver bearing solder material (a higher strength material) and by crimping the cable at the locations close to the SMA connector (to prevent the center conductor from retracting) can effectively resolve the connector failure problem.« less

Hybrid framework with cobalt-chromium alloy and gold cylinder for implant superstructure: Bond strength and corrosion resistance.

PubMed

Yoshinari, Masao; Uzawa, Shinobu; Komiyama, Yataro

2016-10-01

The aim of this in vitro study was to evaluate tensile bond strengths and corrosion resistance of CoCr alloys joined with gold cylinder by a soldering system in comparison with the conventional cast-joining system. CoCr alloys joined with gold cylinder by a soldering system using a high-fusing gold solder (CoCr/Solder/Gold cylinder), gold alloy joined with gold cylinder by a cast joining system (Gold alloy/Gold cylinder) and CoCr castings were fabricated. The tensile bond strength and corrosion resistance in 0.9% NaCl solution (pH 7.4 and pH 2.3) were evaluated. Scanning electron microscopy (SEM) of the fractured surface and electron probe microanalysis (EPMA) of the joined interfaces were also performed. The tensile bond strengths of the CoCr/Solder/Gold cylinder specimens showed similar values as the Gold alloy/Gold cylinder specimens. SEM observation and EPMA analyses suggested firm bonding between the CoCr alloy and gold cylinder. The released elements from the CoCr/Solder/Gold cylinder specimens were similar to ones from CoCr castings. Results showed that superstructures made of CoCr alloys joined with the gold cylinder using a high-fusing gold solder had sufficient bond strength and high corrosion resistance. These hybrid frameworks with cobalt-chromium alloy and gold cylinder are promising prosthesis for implant superstructures with the low cost and favorable mechanical properties instead of conventional high-gold alloys. Copyright © 2016 Japan Prosthodontic Society. Published by Elsevier Ltd. All rights reserved.

Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate

NASA Astrophysics Data System (ADS)

Hu, Xiaowu; Xu, Tao; Jiang, Xiongxin; Li, Yulong; Liu, Yi; Min, Zhixian

2016-04-01

The interfacial reactions between Cu and Sn3Ag0.5Cu (SAC305) solder reflowed under various cooling rates were investigated. It is found that the cooling rate is an important parameter in solder reflow process because it influences not only microstructure of solder alloy but also the morphology and growth of intermetallic compounds (IMCs) formed between solder and Cu substrate. The experimental results indicate that only scallop-like Cu6Sn5 IMC layer is observed between solder and Cu substrate in case of water cooling and air cooling, while bilayer composed of scallop-like Cu6Sn5 and thin layer-like Cu3Sn is detected under furnace cooling due to sufficient reaction time to form Cu3Sn between Cu6Sn5 IMC and Cu substrate which resulted from slow cooling rate. Samples with different reflow cooling rates were further thermal-aged at 423 K. And it is found that the thickness of IMC increases linearly with square root of aging time. The growth constants of interfacial IMC layer during aging were obtained and compared for different cooling rates, indicating that the IMC layer thickness increased faster in samples under low cooling rate than in the high cooling rate under the same aging condition. The long prismatic grains were formed on the existing interfacial Cu6Sn5 grains to extrude deeply into solder matrix with lower cooling rate and long-term aging, and the Cu6Sn5 grains coarsened linearly with cubic root of aging time.

Laparoscopic Mesh Fixation Using Laser-Assisted Tissue Soldering in a Porcine Model

PubMed Central

Soltz, Barbara A.; Stadler, Istvan; Soltz, Robert

2009-01-01

Background and Objective: Animal studies using open surgical models indicate that collagen solder is capable of fixation of surgical meshes without interfering with tissue integration, increasing adhesions, or increasing inflammation intraperitoneally. This study describes development of instrumentation and techniques for laparoscopic herniorrhaphy using laser-assisted soldering technology. Study Design and Methods: Anesthetized 20 kg to 25 kg female Yorkshire pigs underwent laparoscopy with a 3-trocar technique. Parietex TET, Parietex TEC, and Prolene mesh segments (5 × 5 cm) were embedded in 55% collagen solder. Segments were inserted by using a specially designed introducer and affixed to the peritoneum by using prototype laser devices (1.45 µ, 4.5 W continuous wave, 5-mm spot, 55° C set temperature) and a custom laparoscopic handpiece (IPOM). Parietex PCO mesh was inserted and affixed using the Endo-hernia stapler (Control). Animals were recovered and underwent second-look laparoscopy at 6 weeks. Mesh sites were harvested after animals were euthanized. Results: The mesh-solder constructs were easily inserted and affixed in an IPOM approach. Prolene mesh tended to curl at its edges as the solder was melted. Postoperative healing was similar to that in Control segments in all cases. Discussion and Conclusion: Collagen-based tissue soldering permits normal wound healing and may mitigate or reduce the use of staples or other foreign bodies for laparoscopic mesh fixation, prevent tissue ischemia and possibly nerve entrapment, which result in severe postoperative pain and morbidity. Laser-assisted mesh fixation is a promising alternative for laparoscopic herniorrhaphy. Further development of this strategy is warranted. PMID:19793465

The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints

PubMed Central

Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

2015-01-01

Statement of the Problem Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. Purpose The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. Materials and Method A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (p< 0.05). Results The mean tensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Conclusion Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint. PMID:26636118

Electromigration analysis of solder joints under ac load: A mean time to failure model

NASA Astrophysics Data System (ADS)

Yao, Wei; Basaran, Cemal

2012-03-01

In this study, alternating current (ac) electromigration (EM) degradation simulations were carried out for Sn95.5%Ag4.0%Cu0.5 (SAC405- by weight) solder joints. Mass transport analysis was conducted with viscoplastic material properties for quantifying damage mechanism in solder joints. Square, sine, and triangle current wave forms ac were used as input signals. dc and pulsed dc (PDC) electromigration analysis were conducted for comparison purposes. The maximum current density ranged from 2.2×106A/cm2 to 5.0×106A/cm2, frequency ranged from 0.05 Hz to 5 Hz with ambient temperature varying from 350 K to 450 K. Because the room temperature is nearly two-thirds of SAC solder joint's melting point on absolute temperature scale (494.15 K), viscoplastic material model is essential. Entropy based damage evolution model was used to investigate mean time to failure (MTF) behavior of solder joints subjected to ac stressing. It was observed that MTF was inversely proportional to ambient temperature T1.1 in Celsius and also inversely proportional to current density j0.27 in A/cm2. Higher frequency will lead to a shorter lifetime with in the frequency range we studied, and a relationship is proposed as MTF∝f-0.41. Lifetime of a solder joint subjected to ac is longer compared with dc and PDC loading conditions. By introducing frequency, ambient temperature and current density dependency terms, a modified MTTF equation was proposed for solder joints subjected to ac current stressing.

Scanning electron microscopy observations of failures of implant overdenture bars: a case series report.

PubMed

Waddell, J Neil; Payne, Alan G T; Swain, Michael V; Kieser, Jules A

2010-03-01

Soldered or cast bars are used as a standard of care in attachment systems supporting maxillary and mandibular implant overdentures. When failures of these bars occur, currently there is a lack of evidence in relation to their specific etiology, location, or nature. To investigate the failure process of a case series of six failed soldered bars, four intact soldered bars, and one intact cast milled bar, which had been supporting implant overdentures. A total of 11 different overdenture bars were removed from patients with different configuration of opposing arches. A failed bar (FB) group (n = 6) had failed soldered overdenture bars, which were recovered from patients following up to 2 years of wear before requiring prosthodontic maintenance and repair. An intact bar (IB) group (n = 5) had both soldered bars and a single cast milled bar, which had been worn by patients for 2 to 5 years prior to receiving other aspects of prosthodontic maintenance. All bars were examined using scanning electron microscopy to establish the possible mode of failure (FB) or to identify evidence of potential failure in the future (IB). Evidence of a progressive failure mode of corrosion fatigue and creep were observed on all the FB and IB usually around the solder areas and nonoxidizing gold cylinder. Fatigue and creep were also observed in all the IB. Where the level of corrosion was substantial, there was no evidence of wear from the matrices of the attachment system. Evidence of an instantaneous failure mode, ductile and brittle overload, was observed on the fracture surfaces of all the FB, within the solder and the nonoxidizing gold cylinders, at the solder/cylinder interface. Corrosion, followed by corrosion fatigue, appears to be a key factor in the onset of the failure process for overdenture bars in this case series of both maxillary and mandibular overdentures. Limited sample size and lack of standardization identify trends only but prevent broad interpretation of the findings.

76 FR 60863 - Aquatic Nuisance Species Task Force Meeting

Federal Register 2010, 2011, 2012, 2013, 2014

2011-09-30

...] Aquatic Nuisance Species Task Force Meeting AGENCY: Fish and Wildlife Service, Interior. ACTION: Notice of meeting. SUMMARY: This notice announces a meeting of the Aquatic Nuisance Species Task Force (ANS Task Force). The ANS Task Force's purpose is to develop and implement a program for U.S. waters to prevent...

78 FR 29378 - Aquatic Nuisance Species Task Force; Public Teleconference/Webinar

Federal Register 2010, 2011, 2012, 2013, 2014

2013-05-20

...-FF09F14000-134] Aquatic Nuisance Species Task Force; Public Teleconference/ Webinar AGENCY: Fish and Wildlife... teleconference/webinar of the Aquatic Nuisance Species Task Force (ANS Task Force). The ANS Task Force's purpose... aquatic nuisance species; to monitor, control, and study such species; and to disseminate related...

Keepin' On: Five Years Down the Road to Better Schools. Reports of the Task Force on Improving Kentucky's Schools and the Task Force on Restructuring Time and Learning.

ERIC Educational Resources Information Center

Prichard Committee for Academic Excellence, Lexington, KY.

This report contains the findings of two task forces established during 1994 by the Prichard Committee for Academic Excellence: (1) the Task Force on Improving Kentucky Schools; and (2) the Task Force on Restructuring Time and Learning. The task forces, comprised of parents and business members of the Prichard Committee, examined key elements of…

Tinless Solder Investigation

DTIC Science & Technology

1937-06-24

tin solder. 4. By soldering coated thin (.015*) plates of tin- plate, terne-plate and galvanised iron with this mixture, the tensile strength in...9700 lbs/ln2 Average 9500 lbs/ln2 •The plates used In this test were tin-plate. Tests on bright annealed, terne-plate, brass and galvanised ...plates (tin-plate, terne- plate and galvanised iron) had coatings, it was impossible to use emery oloth OB them to completely remove the rust or

Materials chemistry. Composition-matched molecular "solders" for semiconductors.

PubMed

Dolzhnikov, Dmitriy S; Zhang, Hao; Jang, Jaeyoung; Son, Jae Sung; Panthani, Matthew G; Shibata, Tomohiro; Chattopadhyay, Soma; Talapin, Dmitri V

2015-01-23

We propose a general strategy to synthesize largely unexplored soluble chalcogenidometallates of cadmium, lead, and bismuth. These compounds can be used as "solders" for semiconductors widely used in photovoltaics and thermoelectrics. The addition of solder helped to bond crystal surfaces and link nano- or mesoscale particles together. For example, CdSe nanocrystals with Na2Cd2Se3 solder was used as a soluble precursor for CdSe films with electron mobilities exceeding 300 square centimeters per volt-second. CdTe, PbTe, and Bi2Te3 powders were molded into various shapes in the presence of a small additive of composition-matched chalcogenidometallate or chalcogel, thus opening new design spaces for semiconductor technologies. Copyright © 2015, American Association for the Advancement of Science.

Pb-free surface-finishing on electronic components' terminals for Pb-free soldering assembly

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tanaka, Hitoshi; Tanimoto, Morimasa; Matsuda, Akira

1999-11-01

Pb-free solderable surface finishing is essential to implement Pb-free solder assembly in order to meet with the growing demand of environmental consciousness to eliminate Pb from electronic products. Two types of widely applicable Pb-free surface finishing technologies are developed. One is the multilayer-system including Pd with Ni undercoat. Heat-resistance of Pd enables whole-surface-plating on to leadframe before IC-assembling process. The other is the double-layer-system with low-melting-point-materials, for example, thicker Sn underlayer and thinner Sn-Bi alloy overlayer, dilutes Sn-Bi alloy's defects of harmful reactivity along with substrate metal and mechanical brittleness with keeping its advantages of solder-wettability and no whisker.

Automation of experimental research of waveguide paths induction soldering

NASA Astrophysics Data System (ADS)

Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

2018-05-01

The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution

NASA Astrophysics Data System (ADS)

Nordarina, J.; Mohd, H. Z.; Ahmad, A. M.; Muhammad, F. M. N.

2018-03-01

The corrosion properties of Sn-9(5Al-Zn), Sn-Cu and SAC305 were studied via potentiodynamic polarization method in an acidic solution of 1 M hydrochloric acid (HCl). Sn-9(5Al-Zn) produced different polarization profile compared with Sn-Cu and SAC305. The morphological analysis showed that small, deep grooves shaped of corrosion product formed on top of Sn-9(5Al-Zn) solder while two distinctive structures of closely packed and loosely packed corrosion product formed on top of Sn-Cu and SAC305 solder alloys. Phase analysis revealed the formations of various corrosion products such as SnO and SnO2 mainly dominant on surface of solder alloys after potentiodynamic polarization in 1 M hydrochloric acid (HCl).

Forced air heat sink apparatus

NASA Technical Reports Server (NTRS)

Rippel, Wally E. (Inventor)

1989-01-01

A high efficiency forced air heat sink assembly employs a split feed transverse flow configuration to minimize the length of the air flow path through at least two separated fin structures. Different embodiments use different fin structure material configurations including honeycomb, corrugated and serpentine. Each such embodiment uses a thermally conductive plate having opposed exterior surfaces; one for receiving a component to be cooled and one for receiving the fin structures. The serpentine structured fin embodiment employs a plurality of fin supports extending from the plate and forming a plurality of channels for receiving the fin structures. A high thermal conductivity bondant, such as metal-filled epoxy, may be used to bond the fin structures to either the plate or the fin supports. Dip brazing and soldering may also be employed depending upon the materials selected.

Grip force and force sharing in two different manipulation tasks with bottles.

PubMed

Cepriá-Bernal, Javier; Pérez-González, Antonio; Mora, Marta C; Sancho-Bru, Joaquín L

2017-07-01

Grip force and force sharing during two activities of daily living were analysed experimentally in 10 right-handed subjects. Four different bottles, filled to two different levels, were manipulated for two tasks: transporting and pouring. Each test subject's hand was instrumented with eight thin wearable force sensors. The grip force and force sharing were significantly different for each bottle model. Increasing the filling level resulted in an increase in grip force, but the ratio of grip force to load force was higher for lighter loads. The task influenced the force sharing but not the mean grip force. The contributions of the thumb and ring finger were higher in the pouring task, whereas the contributions of the palm and the index finger were higher in the transport task. Mean force sharing among fingers was 30% for index, 29% for middle, 22% for ring and 19% for little finger. Practitioner Summary: We analysed grip force and force sharing in two manipulation tasks with bottles: transporting and pouring. The objective was to understand the effects of the bottle features, filling level and task on the contribution of different areas of the hand to the grip force. Force sharing was different for each task and the bottles features affected to both grip force and force sharing.

PRN 94-9: Announcing the Formation of Two Industry-Wide Task Forces: Agricultural Reentry Task Force and Outdoor Residential Exposure Task Force

EPA Pesticide Factsheets

This Notice announces two industry-wide Task Forces being formed in response to generic exposure data requirements. It contains EPA's policy on a registrant's options for, and responsibilities when joining Task Force as a way to satisfy data requirements.

78 FR 60306 - Aquatic Nuisance Species Task Force Meeting

Federal Register 2010, 2011, 2012, 2013, 2014

2013-10-01

...-FF09F14000-134] Aquatic Nuisance Species Task Force Meeting AGENCY: Fish and Wildlife Service, Interior... the Aquatic Nuisance Species (ANS) Task Force. The ANS Task Force's purpose is to develop and... Task Force will meet from 8 a.m. to 4:30 p.m. on Wednesday, November 6, through Thursday, November 7...

ESD Test Apparatus for Soldering Irons

NASA Technical Reports Server (NTRS)

Sancho, Jose; Esser, Robert

2013-01-01

ESDA (Electrostatic Discharge Association) ESD STM 13.1-2000 requires frequent testing of the voltage leakage from the tip of a soldering iron and the resistance from the tip of the soldering iron to the common point ground. Without this test apparatus, the process is time-consuming and requires several wires, alligator clips, or test probes, as well as additional equipment. Soldering iron tips must be tested for electrostatic discharge risks frequently, and this typically takes a lot of time in setup and testing. This device enables the operator to execute the full test in one minute or less. This innovation is a simple apparatus that plugs into a digital multimeter (DMM) and the Common Point Ground (CPG) reference. It enables the user to perform two of the electrostatic discharge tests required in ESD STM 13.1-2000. The device consists of a small black box with two prongs sticking out of one end, two inputs on the opposite end (one of the inputs is used to connect the reference CPG to the DMM), and a metal tab on one side. Inside the box are wires, several washers of various materials, and assembly hardware (nuts and screws/bolts). The device is a passive electronic component that is plugged into a DMM. The operator sets the DMM to read voltage. The operator places the heated tip of the soldering iron onto the metal tab with a small amount of solder to ensure a complete connection. The voltage is read and recorded. The operator switches the DMM to read resistance. The operator places the heated tip of the soldering iron onto the metal tab with a small amount of solder to ensure a complete connection. The resistance is recorded. If the recorded voltage and resistance are below a number stated in ESDA ESD STM 13.1-2000, the test is considered to pass. The device includes all the necessary wiring internal to its body so the operator does not need to do any independent wiring, except for grounding. It uses a stack of high-thermal-resistance washers to minimize the heat transfer from the soldering iron to the wiring used to measure the resistance and voltages. This minimizes thermal error. The device allows very rapid execution of a test that is performed frequently.

Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements

NASA Astrophysics Data System (ADS)

Gadag, Shiva P.; Patra, Susant

2000-12-01

Solder joint interconnects are mechanical means of structural support for bridging the various electronic components and providing electrical contacts and a thermal path for heat dissipation. The functionality of the electronic device often relies on the structural integrity of the solder. The dimensional stability of solder joints is numerically predicted based on their mechanical properties. Algorithms to model the kinetics of dissolution and subsequent growth of intermetallic from the complete knowledge of a single history of time-temperature-reflow profile, by considering equivalent isothermal time intervals, have been developed. The information for dissolution is derived during the heating cycle of reflow and for the growth process from cooling curve of reflow profile. A simple and quick analysis tool to derive tensile stress-strain maps as a function of the reflow temperature of solder and strain rate has been developed by numerical program. The tensile properties are used in modeling thermal strain, thermal fatigue and to predict the overall fatigue life of solder joints. The numerical analysis of the tensile properties as affected by their composition and rate of testing, has been compiled in this paper. A numerical model using constitutive equation has been developed to evaluate the interfacial fatigue crack growth rate. The model can assess the effect of cooling rate, which depends on the level of strain energy release rate. Increasing cooling rate from normalizing to water-quenching, enhanced the fatigue resistance to interfacial crack growth by up to 50% at low strain energy release rate. The increased cooling rates enhanced the fatigue crack growth resistance by surface roughening at the interface of solder joint. This paper highlights salient features of process modeling. Interfacial intermetallic microstructure is affected by cooling rate and thereby affects the mechanical properties.

Study on Joint Interface and Mechanical Properties of Cu/Pb-Sn/Cu Lap Joint Produced by Friction Stir Soldering Process

NASA Astrophysics Data System (ADS)

Sarkari Khorrami, Mahmoud; Kokabi, Amir Hossein; Movahedi, Mojtaba

2015-05-01

In this work, friction stir soldering (FSS) as a new approach for fabrication of copper/copper lap joints was introduced. This process is principally based on the friction stir processing (FSP) that can be performed using FSP tools with and without pin on the top sheet. In the present study, Pb-Sn foil was used as a solder which would be melted and then extruded in the area between the copper sheets during FSS process. This process was carried out using tools with and without pin at various rotation speeds of 1200, 1400, and 1600 rpm and traverse speed of 32 mm/min. Also, the same joint was fabricated using furnace soldering to compare the mechanical properties obtained with FSS and furnace soldering processes. It was observed that FSS possesses some advantages over the conventional furnace soldering process including the formation of more bond area at the interface corresponding to the higher fracture load of FSS joints compared with furnace soldering one. Moreover, it was concluded that the thickness of intermetallic compounds (IMCs) and the formation of voids at the joint interface were the predominant factor determining the mechanical properties of the FSS joints produced by FSS tool with and without pin, respectively. The microstructural examinations revealed that Cu-Sn IMCs of Cu3Sn and Cu6Sn5 were formed at the joint interface. It was observed that the FSS joint produced by tool with pin experienced the more peak temperature in comparison with that produced by pin-free tool. This may lead to the formation of thicker IMCs at the interface. Of course, the thickness of IMCs can be controlled by choosing proper FSS parameters, especially the rotation speed of the tool.

Esophageal incisions repair by CO2 laser soldering.

PubMed

Nageris, Ben I; Zilker, Zeev; Zilker, Maya; Kariv, Noam; Feinmesser, Rafael; Katzir, Abraham

2004-12-01

This study evaluated the feasibility of fiberoptic CO2 laser soldering for the repair of esophageal injuries under tight temperature feedback control in an animal model. Healing was compared to conventional suture closure. A CO2 soldering system equipped with infrared transmitting silver halide fibers was used. The soldered tissue temperature was monitored continuously, and laser power was adjusted to provide constant temperature. The procedure was done with 50% bovine serum albumin solder. Longitudinal incisions measuring 8 to 10 mm were made under general anesthesia in the cervical esophagus of 25 rats. Twenty rats (group I) underwent laser tissue bonding; 8 of which were tested in a preliminary study to determine optimal laser parameters. In the remaining 5 rats (group II, controls), closure was performed with 1 layer of 6/0 Vicryl sutures. The rats were sacrificed 2, 3, 4, and 6 weeks postoperatively, and the esophagus was examined histologically. Optimal temperature was found to be 65 to 70 degrees C and optimal exposure time, 150 to 200 seconds. Laser soldering was successful in 9 of the 12 rats (75%) treated under optimal settings; suturing was successful in 4 of the 5 control rats (80%). There were no significant differences between the groups in healing or complication rates. These results indicate that the CO2 laser soldering technique is a valid option for the correction of esophageal tears or incisions in rats. The confirmation and extension of these findings in further studies with larger animals may ultimately lead to the routine in vivo use of temperature-controlled laser repair for the esophagus and other organs. This method lends itself to endoscopic bonding of tissues.

Comparison of implant-abutment interface misfits after casting and soldering procedures.

PubMed

Neves, Flávio Domingues das; Elias, Gisele Araújo; da Silva-Neto, João Paulo; de Medeiros Dantas, Lucas Costa; da Mota, Adérito Soares; Neto, Alfredo Júlio Fernandes

2014-04-01

The aim of this study was to compare vertical and horizontal adjustments of castable abutments after conducting casting and soldering procedures. Twelve external hexagonal implants (3.75 × 10 mm) and their UCLA abutments were divided according their manufacturer and abutment type: PUN (plastic UCLA, Neodent), PUC (plastic UCLA, Conexão), PU3i (plastic UCLA, Biomet 3i), and PUTN (plastic UCLA with Tilite milled base, Neodent). Three infrastructures of a fixed partial implant-supported bridge with 3 elements were produced for each group. The measurements of vertical (VM) and horizontal (HM) misfits were obtained via scanning electron microscopy after completion of casting and soldering. The corresponding values were determined to be biomechanically acceptable to the system, and the results were rated as a percentage. Statistical analysis establishes differences between groups by chi-square after procedures, and McNeman's test was applied to analyze the influence of soldering over casting (α ≤ .05). For the values of VM and HM, respectively, when the casting process was complete, it was observed that 83.25% and 100% (PUTN), 33.3% and 27.75% (PUN), 33.3% and 88.8% (PUC), 33.3% and 94.35% (PU3i) represented acceptable values. After completing the requisite soldering, acceptable values were 50% and 94.35% (PUTN), 16.6% and 77.7% (PUN), 38.55% and 77.7% (PUC), and 27.75% and 94.35% (PU3i). Within the limitations of this study, it can be concluded that the premachined abutments presented more acceptable VM values. The HM values were within acceptable limits before and after the soldering procedure for most groups. Further, the soldering procedure resulted in an increase of VM in all groups.

Application of albumin protein and indocyanine green chromophore for tissue soldering by using an IR diode laser: ex vivo and in vivo studies.

PubMed

Khosroshahi, M E; Nourbakhsh, M S; Saremi, S; Hooshyar, A; Rabbani, Sh; Tabatabai, F; Anvari, M Sotudeh

2010-12-01

We sought to examine the impact of different parameters of laser soldering on the thermophysical properties of the skin and to optimize these parameters for sealing a full-thickness incision in the rat skin under closed feedback control under in vivo conditions. Laser tissue soldering based on protein as biologic glues and other compounds can provide greater bond strength and less collateral damage. Endogenous and exogenous materials such as indocyanine green (ICG) are often added to solders to enhance light absorption. In ex vivo study, the temperature increase, number of scan (Ns), and scan velocity (Vs) were investigated. In ex vivo studies, four skin incisions were made over rat dorsa and were closed by using two different methods: (a) wound closure by suture and (b) closure by using an automated temperature-controlled system. An automated soldering system was developed based on a diode laser, IR detector, photodiode, digital thermocouple, and camera. The true temperature of heated tissue was determined by using a calibration software method. The results showed that at each laser irradiance (I), the tensile strength (σ) of incisions repaired in the static mode is higher than in the dynamic mode. It must also be noted that the tensile strength of the repaired skin wound was increased by increasing the irradiance in both static and dynamic modes. However, in parallel, an increase in the corresponding temperature was observed. The tensile strength was measured for sutured and laser-soldered tissue after 2 to 10 postoperative days. Histopathologic studies showed a better healing and less inflammatory reactions than with those caused by standard sutures after day 7. It is demonstrated that automated laser soldering technique can be practical provided the optothermal properties of tissue is carefully optimized.

Drinking Water Contamination Due To Lead-based Solder

NASA Astrophysics Data System (ADS)

Garcia, N.; Bartelt, E.; Cuff, K. E.

2004-12-01

The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

Microstructure Characterization Of Lead-Free Solders Depending On Alloy Composition

NASA Astrophysics Data System (ADS)

Panchenko, Iuliana; Mueller, Maik; Wolter, Klaus-Juergen

2010-11-01

Fatigue and crack nucleation in solder joints is basically associated with changes in the microstructure. Therefore the microstructure evolution of SnAgCu solder joints during solidification and subsequent application is an important subject for reliability investigations and physics of failure analysis. The scope of this study is a systematic overview of the as-cast microstructures in small sized lead-free SnAgCu solder spheres after solidification. A total of 32 alloy compositions have been investigated with varying Ag content from 0 to 5 wt.% and varying Cu content from 0 to 1.2 wt.%. The solder spheres had a diameter of approx. 270 μm and were all manufactured under the similar conditions. Subsequent cross-sectioning was carried out in order to analyze the microstructure by optical and electron microscopy as well as Electron Backscatter Diffraction and Energy Dispersive X-ray Spectroscopy. The results allow a comprehensive overview of the dependence of the as-cast microstructure on the solder composition. It is shown that strong changes in microstructure can be caused by small changes in solder composition. In addition, a solidification phenomenon known as cyclic twinning has been found in the samples. Three different microstructures related to that phenomenon will be presented and detailed characterizations of these structures are given in this study. These microstructures differ in their appearance by solidification morphology, phase distribution as well as grain structure and can be described as follows: 1. large dentritic areas of different grain orientations which are characterized by approx. 60° twin boundaries; 2. areas of small β-Sn cells with approx. 60° twin relation and larger intermetallic precipitates; 3. large grains consisting of a β-Sn matrix with very fine intermetallic precipitates and high angle grain boundaries between adjacent grains.

Viscoplastic Creep Response and Microstructure of As-Fabricated Microscale Sn-3.0Ag-0.5Cu Solder Interconnects

NASA Astrophysics Data System (ADS)

Cuddalorepatta, Gayatri; Williams, Maureen; Dasgupta, Abhijit

2010-10-01

The viscoplastic behavior of as-fabricated, undamaged, microscale Sn-3.0 Ag-0.5Cu (SAC305) Pb-free solder is investigated and compared with that of eutectic Sn-37Pb solder and near-eutectic Sn-3.8Ag-0.7Cu (SAC387) solder from prior studies. Creep measurements of microscale SAC305 solder shear specimens show significant piece-to-piece variability under identical loading. Orientation imaging microscopy reveals that these specimens contain only a few, highly anisotropic Sn grains across the entire joint. For the studied loads, the coarse-grained Sn microstructure has a more significant impact on the scatter in primary creep compared to that in the secondary creep. The observed lack of statistical homogeneity (microstructure) and joint-dependent mechanical behavior of microscale SAC305 joints are consistent with those observed for functional microelectronics interconnects. Compared with SAC305 joints, microscale Sn-37Pb shear specimens exhibit more homogenous behavior and microstructure with a large number of small Sn (and Pb) grains. Creep damage in the Pb-free joint is predominantly concentrated at highly misoriented Sn grain boundaries. The coarse-grained Sn microstructure recrystallizes into new grains with high misorientation angles under creep loading. In spite of the observed joint-dependent behavior, as-fabricated SAC305 is significantly more creep resistant than Sn-37Pb solder and slightly less creep resistant than near-eutectic SAC387 solder. Average model constants for primary and secondary creep of SAC305 are presented. Since the viscoplastic measurements are averaged over a wide range of grain configurations, the creep model constants represent the effective continuum behavior in an average sense. The average secondary creep behavior suggests that the dominant creep mechanism is dislocation climb assisted by dislocation pipe diffusion.

NASA-DoD Lead-Free Electronics Project: Vibration Test

NASA Technical Reports Server (NTRS)

Woodrow, Thomas A.

2010-01-01

Vibration testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is a follow-on to the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) Lead-Free Solder Project which was the first group to test the reliability of lead-free solder joints against the requirements of the aerospace/miLItary community. Twenty seven test vehicles were subjected to the vibration test conditions (in two batches). The random vibration Power Spectral Density (PSD) input was increased during the test every 60 minutes in an effort to fail as many components as possible within the time allotted for the test. The solder joints on the components were electrically monitored using event detectors and any solder joint failures were recorded on a Labview-based data collection system. The number of test minutes required to fail a given component attached with SnPb solder was then compared to the number of test minutes required to fail the same component attached with lead-free solder. A complete modal analysis was conducted on one test vehicle using a laser vibrometer system which measured velocities, accelerations, and displacements at one . hundred points. The laser vibrometer data was used to determine the frequencies of the major modes of the test vehicle and the shapes of the modes. In addition, laser vibrometer data collected during the vibration test was used to calculate the strains generated by the first mode (using custom software). After completion of the testing, all of the test vehicles were visually inspected and cross sections were made. Broken component leads and other unwanted failure modes were documented.

Stresses in Solder Joints of Electronic Packages

DTIC Science & Technology

1991-12-31

soldering process. The device is soldered to the circuit board at a temperature of +185zc and this tempature is assumed to propagate only to the lead wire...tri-material assembly, showing the notation used hereafter, is shown in Figure 7. The Suhir model is applicable to assemblies with continuous...therefore the radii of curvature of layers are all equal. Using equilibrium equation (7) and moment-curvature equation (9) yields ()D D Xp (x) D T() -m 3 x

Avionics Integrity Issues Presented during NAECON (National Aerospace and Electronics Convention) 1984.

DTIC Science & Technology

1984-12-01

PLASTIC ABOVE BOOC 2. PTH COPPER SHOULD BE ABOVE 62 ELONGATION, 5OKPSI 3. PTH LIFE IS INCREAS-D WITH LARGER PTH AND POLYIMIDE PWB’S 4. SOLDER JOINT DEFO M...34XTION IS PREDOMINANTLY PLASTIC , THEREFORE HIGH SOLDER DUCTILITY IS IMPORTANT - AVOID SOLDER CONTAMINANTS - AVOID HOT STORAGE OR SLOW COOLDOWN SUMMARY...UTILIZATION OF STEP-STRESS TECHNIQUE o MANAGEMENT CONSIDERATIONS * PLASTIC PARTS AFAILURE ANALYSIS/DPA 0SHELF TIME VS RESCREEN *USE OF ACCELERATED

Occupational risk factors for renal cell carcinoma: agent-specific results from a case-control study in Germany. MURC Study Group. Multicenter urothelial and renal cancer study.

PubMed

Pesch, B; Haerting, J; Ranft, U; Klimpel, A; Oelschlägel, B; Schill, W

2000-12-01

This case-control study was conducted to estimate the renal cell cancer (RCC) risk for exposure to occupation-related agents, besides other suspected risk factors. In a population-based multicentre study, 935 incident RCC cases and 4298 controls matched for region, sex, and age were interviewed between 1991 and 1995 for their occupational history and lifestyle habits. Agent-specific exposure was expert-rated with two job-exposure matrices and a job task-exposure matrix. Conditional logistic regression was used to calculate smoking adjusted odds ratios (OR). Very long exposures in the chemical, rubber, and printing industries were associated with risk for RCC. Males considered as 'substantially exposed to organic solvents' showed a significant excess risk (OR = 1.6, 95% CI : 1.1-2.3). In females substantial exposure to solvents was also a significant risk factor (OR = 2.1, 95% CI : 1.0-4.4). Excess risks were shown for high exposure to cadmium (OR = 1.4, 95% CI : 1.1-1.8, in men, OR = 2.5, 95% CI : 1.2-5.3 in women), for substantial exposure to lead (OR = 1.5, 95% CI : 1.0-2.3, in men, OR = 2.6, 95% CI : 1.2-5.5, in women) and to solder fumes (OR = 1.5, 95% CI : 1.0-2.4, in men). In females, an excess risk for the task 'soldering, welding, milling' was found (OR = 3.0, 95% CI : 1.1-7.8). Exposure to paints, mineral oils, cutting fluids, benzene, polycyclic aromatic hydrocarbons, and asbestos showed an association with RCC development. Our results indicate that substantial exposure to metals and solvents may be nephrocarcinogenic. There is evidence for a gender-specific susceptibility of the kidneys.

Phase Equilibria of the Sn-Ni-Si Ternary System and Interfacial Reactions in Sn-(Cu)/Ni-Si Couples

NASA Astrophysics Data System (ADS)

Fang, Gu; Chen, Chih-chi

2015-07-01

Interfacial reactions in Sn/Ni-4.5 wt.%Si and Sn-Cu/Ni-4.5 wt.%Si couples at 250°C, and Sn-Ni-Si ternary phase equilibria at 250°C were investigated in this study. Ni-Si alloys, which are nonmagnetic, can be regarded as a diffusion barrier layer material in flip chip packaging. Solder/Ni-4.5 wt.%Si interfacial reactions are crucial to the reliability of soldered joints. Phase equilibria information is essential for development of solder/Ni-Si materials. No ternary compound is present in the Sn-Ni-Si ternary system at 250°C. Extended solubility of Si in the phases Ni3Sn2 and Ni3Sn is 3.8 and 6.1 at.%, respectively. As more Si dissolves in these phases their lattice constants decrease. No noticeable ternary solubility is observed for the other intermetallics. Interfacial reactions in solder/Ni-4.5 wt.%Si are similar to those for solder/Ni. Si does not alter the reaction phases. No Si solubility in the reaction phases was detected, although rates of growth of the reaction phases were reduced. Because the alloy Ni-4.5 wt.%Si reacts more slowly with solders than pure Ni, the Ni-4.5 wt.%Si alloy could be a potential new diffusion barrier layer material for flip chip packaging.

Solution-Processed Transistors Using Colloidal Nanocrystals with Composition-Matched Molecular "Solders": Approaching Single Crystal Mobility.

PubMed

Jang, Jaeyoung; Dolzhnikov, Dmitriy S; Liu, Wenyong; Nam, Sooji; Shim, Moonsub; Talapin, Dmitri V

2015-10-14

Crystalline silicon-based complementary metal-oxide-semiconductor transistors have become a dominant platform for today's electronics. For such devices, expensive and complicated vacuum processes are used in the preparation of active layers. This increases cost and restricts the scope of applications. Here, we demonstrate high-performance solution-processed CdSe nanocrystal (NC) field-effect transistors (FETs) that exhibit very high carrier mobilities (over 400 cm(2)/(V s)). This is comparable to the carrier mobilities of crystalline silicon-based transistors. Furthermore, our NC FETs exhibit high operational stability and MHz switching speeds. These NC FETs are prepared by spin coating colloidal solutions of CdSe NCs capped with molecular solders [Cd2Se3](2-) onto various oxide gate dielectrics followed by thermal annealing. We show that the nature of gate dielectrics plays an important role in soldered CdSe NC FETs. The capacitance of dielectrics and the NC electronic structure near gate dielectric affect the distribution of localized traps and trap filling, determining carrier mobility and operational stability of the NC FETs. We expand the application of the NC soldering process to core-shell NCs consisting of a III-V InAs core and a CdSe shell with composition-matched [Cd2Se3](2-) molecular solders. Soldering CdSe shells forms nanoheterostructured material that combines high electron mobility and near-IR photoresponse.

Cytotoxic outcomes of orthodontic bands with and without silver solder in different cell lineages.

PubMed

Jacoby, Letícia Spinelli; Rodrigues Junior, Valnês da Silva; Campos, Maria Martha; Macedo de Menezes, Luciane

2017-05-01

The safety of orthodontic materials is a matter of high interest. In this study, we aimed to assess the in-vitro cytotoxicity of orthodontic band extracts, with and without silver solder, by comparing the viability outcomes of the HaCat keratinocytes, the fibroblastic cell lineages HGF and MRC-5, and the kidney epithelial Vero cells. Sterilized orthodontic bands with and without silver solder joints were added to culture media (6 cm 2 /mL) and incubated for 24 hours at 37°C under continuous agitation. Subsequently, the cell cultures were exposed to the obtained extracts for 24 hours, and an assay was performed to evaluate the cell viability. Copper strip extracts were used as positive control devices. The extracts from orthodontic bands with silver solder joints significantly reduced the viability of the HaCat, MRC-5, and Vero cell lines, whereas the viability of HGF was not altered by this material. Conversely, the extracts of orthodontic bands without silver solder did not significantly modify the viability index of all evaluated cell lines. Except for HGF fibroblasts, all tested cell lines showed decreased viability percentages after exposure to extracts of orthodontic bands containing silver solder joints. These data show the relevance of testing the toxicity of orthodontic devices in different cell lines. Copyright © 2017 American Association of Orthodontists. Published by Elsevier Inc. All rights reserved.

Evaluation of Case Size 0603 BME Ceramic Capacitors

NASA Technical Reports Server (NTRS)

Teverovsky, Alexander A.

2015-01-01

High volumetric efficiency of commercial base metal electrode (BME) ceramic capacitors allows for a substantial reduction of weight and sizes of the parts compared to currently used military grade precious metal electrode (PME) capacitors. Insertion of BME capacitors in space applications requires a thorough analysis of their performance and reliability. In this work, six types of cases size 0603 BME capacitors from three vendors have been evaluated. Three types of multilayer ceramic capacitors (MLCCs) were designed for automotive industry and three types for general purposes. Leakage currents in the capacitors have been measured in a wide range of voltages and temperatures, and measurements of breakdown voltages (VBR) have been used to assess the proportion and severity of defects in the parts. The effect of soldering-related thermal shock stresses was evaluated by analysis of distributions of VBR for parts in 'as is' condition and after terminal solder dip testing at 350 C. Highly Accelerated Life Testing (HALT) at different temperatures was used to assess the activation energy of degradation of leakage currents and predict behavior of the parts at life test and normal operating conditions. To address issues related to rework and manual soldering, capacitors were soldered onto different substrates at different soldering conditions. The results show that contrary to a common assumption that large-size capacitors are mostly vulnerable to soldering stresses, cracking in small size capacitors does happen unless special measures are taken during assembly processes.

Fabrication of Cu-Ni mixed phase layer using DC electroplating and suppression of Kirkendall voids in Sn-Ag-Cu solder joints

NASA Astrophysics Data System (ADS)

Chee, Sang-Soo; Lee, Jong-Hyun

2014-05-01

A solderable layer concurrently containing Cu-rich and Ni-rich phases (mixed-phase layer, MPL) was fabricated by direct current electroplating under varying process conditions. Current density was considered as the main parameter to adjust the microstructure and composition of MPL during the electroplating process, and deposit thickness were evaluated as functions of plating time. As a result, it was observed that the coral-like structure that consisted of Cu-rich and Ni-rich phases grew in the thickness direction. The most desirable microstructure was obtained at a relatively low current density of 0.4 mA/cm2. In other words, the surface was the smoothest and defect-free at this current density. The electroplating rate was slightly enhanced with an increase in current density. Investigations of its solid-state reaction properties, including the formation of Kirkendall voids, were also carried out after reflow soldering with Sn-3.0 Ag-0.5 Cu solder balls. In the solid-state aging experiment at 125°C, Kirkendall voids at the normal Sn-3.0 Ag-0.5 Cu solder/Cu interface were easily formed after just 240 h. Meanwhile, the presence of an intermetallic compound (IMC) layer created in the solder/MPL interface indicated a slightly lower growth rate, and no Kirkendall voids were observed in the IMC layer even after 720 h.

In vitro laser nerve repair: protein solder strip irradiation or irradiation alone?

PubMed

Trickett, I; Dawes, J M; Knowles, D S; Lanzetta, M; Owen, E R

1997-01-01

This study investigated the potential of sutureless nerve repair using two promising laser fusion methods: direct 2 microns irradiation of the epineurium, and protein solder assisted epineurial fusion using a 800 nm laser. Laser anastomosis of the rat sciatic nerve was performed in vitro without stay sutures in two groups of six animals. In the first group, direct laser fusion used a pulsed Cr, Tm: YAG laser. In the second group an albumin-based fluid solder containing the dye indocyanine green was applied to the epineurium, then irradiated with a diode laser. These two techniques were compared with regards to coaptation success and axonal damage. Direct laser welding produced weak bonds despite microscopic investigation of the irradiated nerves showing fusion of the epineurium. The unsatisfactory bonding can be attributed to poor tissue overlap and insufficient protein in the thin epineurium denaturation of underlying axons was also observed. In contrast, the laser solder method produced successful welds with greatly reduced axonal damage, and significantly improved the tensile strength. This study confirmed the technical possibilities of sutureless nerve anastomosis. Laser activated solders enable stronger bonds, by the addition of protein to the anastomosis site, and less thermal damage to underlying tissue through selective absorption of laser energy by dye in the solder. Further in vivo studies are required before drawing final conclusions.

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

PubMed Central

Leong, Yee Mei; Haseeb, A.S.M.A.

2016-01-01

Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

Closure of skin incisions in rabbits by laser soldering: I: Wound healing pattern.

PubMed

Simhon, David; Brosh, Tamar; Halpern, Marisa; Ravid, Avi; Vasilyev, Tamar; Kariv, Naam; Katzir, Abraham; Nevo, Zvi

2004-01-01

Temperature-controlled tissue laser soldering is an innovative sutureless technique awaiting only solid experimental data to become the gold-standard surgical procedure for incision closure. The goals of the current study were: (1) to define the optimal laser soldering conditions, (2) to explore the immediate skin reparative healing events after sealing the wound, and (3) to determine the long-term trajectory of skin wound healing. Skin incisions were generated over rabbit dorsa and were closed using different wound-closure interventions, in three groups: (a) closure, using a temperature-controlled infrared fiberoptic CO2 laser system, employing 47% bovine serum albumin as a solder; (b) wound closure by cyanoacrylate glues; and (c) wound closure by sutures. The reparative outcomes were evaluated macroscopically and microscopically, employing semi-quantitative grading indices. Laser soldering of incisions at T = 65 degrees C emerged as the optimal method achieving immediate wound sealing. This in turn induced accelerated reparative events characterized by a reduced inflammatory reaction, followed by minimal scarring and leading to a fine quality healing. Temperature-controlled laser soldering offers an accelerated wound reparative process with numerous advantages over the conventional methods. Further investigations may reveal additional benefits in the spectrum of advantages that this innovative surgical technology has to offer. This can introduce new scientific insight that will pave the way for clinical use.

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition.

PubMed

Leong, Yee Mei; Haseeb, A S M A

2016-06-28

Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1-0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu₃Al₂. Cu₃Al₂ resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu₆Sn₅ intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu₆Sn₅ IMC but has no significant effect on the thickness of Cu₃Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization

NASA Astrophysics Data System (ADS)

Choi, W. J.; Yeh, E. C. C.; Tu, K. N.

2003-11-01

Electromigration of eutectic SnPb flip chip solder joints and their mean-time-to-failure (MTTF) have been studied in the temperature range of 100 to 140 °C with current densities of 1.9 to 2.75×104 A/cm2. In these joints, the under-bump-metallization (UBM) on the chip side is a multilayer thin film of Al/Ni(V)/Cu, and the metallic bond-pad on the substrate side is a very thick, electroless Ni layer covered with 30 nm of Au. When stressed at the higher current densities, the MTTF was found to decrease much faster than what is expected from the published Black's equation. The failure occurred by interfacial void propagation at the cathode side, and it is due to current crowding near the contact interface between the solder bump and the thin-film UBM. The current crowding is confirmed by a simulation of current distribution in the solder joint. Besides the interfacial void formation, the intermetallic compounds formed on the UBM as well as the Ni(V) film in the UBM have been found to dissolve completely into the solder bump during electromigration. Therefore, the electromigation failure is a combination of the interfacial void formation and the loss of UBM. Similar findings in eutectic SnAgCu flip chip solder joints have also been obtained and compared.

A comparative evaluation of the tensile strength of silver soldered joints of stainless steel and cobalt chromium orthodontic wires with band material--an in vitro study.

PubMed

Dua, R; Nandlal, B

2004-03-01

The present study was conducted to compare and evaluate the tensile strength of silver soldered joints of stainless steel and cobalt-chromium orthodontic wires with band material. An attempt was made to observe the effect of joint site preparation by incorporation of tack welding and increasing metal to metal surface contact area by flattening an end of the wire prior to soldering along with the regularly used round wires without tack welding. A total of 180 wire specimens were soldered to 180 band specimens. Fifteen samples according to joint site preparation were included for each of the wire groups i.e. Gloria (S.S.), Remanium (S.S.) and Remaloy (Co-Cr) wires of 0.036" in diameter. The findings of the study were suggestive that all three wires may be used for preparing silver soldered joints irrespective of the quality of the wire. However, when subjecting the wire to joint site preparation, Gloria (S.S.) wire showed less tensile strength as compared to Remanium and Remaloy.

Effect of Interfacial Microstructures on the Bonding Strength of Sn-3.0Ag-0.5Cu Pb-Free Solder Bump

NASA Astrophysics Data System (ADS)

Kim, Jae-Myeong; Jeong, Myeong-Hyeok; Yoo, Sehoon; Park, Young-Bae

2012-05-01

The effect of interfacial microstructures on the bonding strength of Sn-3.0Ag-0.5Cu Pb-free solder bumps with respect to the loading speed, annealing time, and surface finish was investigated. The shear strength increased and the ductility decreased with increasing shear speed, primarily because of the time-independent plastic hardening and time-dependent strain-rate sensitivity of the solder alloy. The shear strength and toughness decreased for all surface finishes under the high-speed shear test of 500 mm/s as a result of increasing intermetallic compound (IMC) growth and pad interface weakness associated with increased annealing time. The immersion Sn and organic solderability preservative (OSP) finishes showed lower shear strength compared to the electroless nickel immersion gold (ENIG) finish. With increasing annealing time, the ENIG finish exhibited the pad open fracture mode, whereas the immersion Sn and OSP finishes exhibited the brittle fracture mode. In addition, the shear strength of the solder joints was correlated with each fracture mode.

Logistics for the implementation of lead-free solders on electronic assemblies

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vianco, P.T.; Artaki, I.

1993-12-31

The prospects of legislative and regulatory action aimed at taxing, restricting or banning lead-bearing materials from manufactured products has prompted the electronics community to examine the implementation of lead-free solders to replace currently used lead-containing alloys in the manufacture of electronic devices and assemblies. The logistics for changing the well established ``tin-lead solder technology`` require not only the selection of new compositions but also the qualification of different surface finishes and manufacturing processes. The meniscometer/wetting balance technique was used to evaluate the wettability of several candidate lead-free solders as well as to establish windows on processing parameters so as tomore » facilitate prototype manufacturing. Electroplated and electroless 100Sn coatings, as well as organic preservatives, were also examined as potential alternative finishes for device leads and terminations as well as circuit board conductor surfaces to replace traditional tin-lead layers. Sandia National Laboratories and AT&T have implemented a program to qualify the manufacturing feasibility of surface mount prototype circuit boards using several commercial lead-free solders by infrared reflow technology.« less

Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads

NASA Astrophysics Data System (ADS)

Ren, Huai-Hui; Wang, Xi-Shu

2014-04-01

This paper studies and compares the effects of pull-pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package. The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.

Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

NASA Astrophysics Data System (ADS)

Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R.

2014-01-01

A fracture mechanism map (FMM) is a powerful tool which correlates the fracture behavior of a material to its microstructural characteristics in an explicit and convenient way. In the FMM for solder joints, an effective thickness of the interfacial intermetallic compound (IMC) layer ( t eff) and the solder yield strength ( σ ys,eff) are used as abscissa and ordinate axes, respectively, as these two predominantly affect the fracture behavior of solder joints. Earlier, a definition of t eff, based on the uniform thickness of IMC ( t u) and the average height of the IMC scallops ( t s), was proposed and shown to aptly explain the fracture behavior of solder joints on Cu. This paper presents a more general definition of t eff that is more widely applicable to a range of metallizations, including Cu and electroless nickel immersion gold (ENIG). Using this new definition of t eff, mode I FMM for SAC387/Cu joints has been updated and its validity was confirmed. A preliminary FMM for SAC387/Cu joints with ENIG metallization is also presented.

Effect of Thermal Aging on the Mechanical Properties of Sn3.0Ag0.5Cu/Cu Solder Joints Under High Strain Rate Conditions

NASA Astrophysics Data System (ADS)

Nguyen, Van Luong; Kim, Ho-Kyung

2015-07-01

Shear tests with velocities between 0.5 m/s and 2.5 m/s were conducted to investigate the deformation characteristics of 0.76 mm lead-free Sn-3Ag-0.5Cu solder ball joints after thermal aging at 373 K up to 1000 h. A scanning electron microscope equipped with energy dispersive spectroscopy was then used to examine the fracture surfaces and microstructures of the solder joints. The results showed that the main failure mode of the solder joints was the brittle interfacial fracture mode with cleavage failure in the intermetallic compound (IMC). The maximum shear strength and the fracture toughness ( K C) of the solder joint decreased substantially after aging for the initial aging time, after which they decreased gradually with further aging or an increase in the strain rate. The evolution of the IMC layer when it was thicker and had coarser nodules due to thermal aging was the primary cause of the reduction in the shear strength and fracture toughness in this study.

Comparison of laser-activated tissue solders and thrombin-activated cryoprecipitate for wound closure

NASA Astrophysics Data System (ADS)

Kayton, Mark L.; Libutti, Steven K.; Bessler, Marc; Allendorf, John D. F.; Eiref, Simon D.; Marx, Gerard; Mou, Xiaode; Morales, Alfredo M.; Treat, Michael R.; Nowygrod, Roman

1994-09-01

To determine the relative strengths of various biologic adhesives at several timepoints, we compared thrombin-activated SD (solvent-detergent treated) cryoprecipitate with laser- activated SD cryoprecipitate and a laser-activated, albumin-based glue. Male Sprague-Dawley rats (n equals 79) received four, 3-cm, dorsal skin incisions which were closed with either laser- activated cryoprecipitate, laser-activated albumin solder, thrombin-activated cryoprecipitate, or standard skin staples. The cryoprecipitate was derived from pooled human plasma and was treated with a solvent-detergent process, rendering it free of envelope-coated viruses (i.e., HBV, HIV). An 808-nm diode laser was used to activate each solder with an average duration of exposure of 75 seconds per incision. Animals were sacrificed for evaluation of wound tensile strength and histology at 0 hours, 2 hours, 4 hours, and 4 days. At all timepoints tested, laser-activated solders were significantly stronger than thrombin-activated cryoprecipitate (p < 0.03) and control wounds (p < 0.003). There was no significant difference in tensile strength between the two types of laser-activated solder at any timepoint.

The In-Space Soldering Investigation: Research Conducted on the International Space Station in Support of NASA's Exploration Initiative

NASA Technical Reports Server (NTRS)

Grugel, R. N.; Fincke, M.; Sergre, P. N.; Ogle, J. A.; Funkhouser, G.; Parris, F.; Murphy, L.; Gillies, D.; Hua, F.

2004-01-01

Soldering is a well established joining and repair process that is of particular importance in the electronics industry. Still. internal solder joint defects such as porosity are prevalent and compromise desired properties such as electrical/thermal conductivity and fatigue strength. Soldering equipment resides aboard the International Space Station (ISS) and will likely accompany Exploration Missions during transit to, as well as on, the moon and Mars. Unfortunately, detrimental porosity appears to be enhanced in lower gravity environments. To this end, the In-Space Soldering Investigation (ISSI) is being conducted in the Microgravity Workbench Area (MWA) aboard the ISS as "Saturday Science" with the goal of promoting our understanding of joining techniques, shape equilibrium, wetting phenomena, and microstructural development in a microgravity environment. The work presented here will focus on direct observation of melting dynamics and shape determination in comparison to ground-based samples, with implications made to processing in other low-gravity environments. Unexpected convection effects, masked on Earth, will also be shown as well as the value of the ISS as a research platform in support of Exploration Missions.

The In-Space Soldering Investigation: To Date Analysis of Experiments Conducted on the International Space Station

NASA Technical Reports Server (NTRS)

Grugel, Richard N.; Gillies, D. C.; Hua, F.; Anilkumar, A.

2006-01-01

Soldering is a well established joining and repair process that is of particular importance in the electronics industry. Still, internal solder joint defects such as porosity are prevalent and compromise desired properties such as electrical/thermal conductivity and fatigue strength. Soldering equipment resides aboard the International Space Station (ISS) and will likely accompany Exploration Missions during transit to, as well as on, the moon and Mars. Unfortunately, detrimental porosity appears to be enhanced in lower gravity environments. To this end, the In-Space Soldering Investigation (ISSI) is being conducted in the Microgravity Workbench Area (MWA) aboard the ISS as "Saturday Science" with the goal of promoting our understanding of joining techniques, shape equilibrium, wetting phenomena, and microstructural development in a microgravity environment. The work presented here will focus on direct observation of melting dynamics and shape determination in comparison to ground-based samples, with implications made to processing in other low-gravity environments. Unexpected convection effects, masked on Earth, will also be shown as well as the value of the ISS as a research platform in support of Exploration Missions.

Multicolor printing plate joining

NASA Technical Reports Server (NTRS)

Waters, W. J. (Inventor)

1984-01-01

An upper plate having ink flow channels and a lower plate having a multicolored pattern are joined. The joining is accomplished without clogging any ink flow paths. A pattern having different colored parts and apertures is formed in a lower plate. Ink flow channels each having respective ink input ports are formed in an upper plate. The ink flow channels are coated with solder mask and the bottom of the upper plate is then coated with solder. The upper and lower plates are pressed together at from 2 to 5 psi and heated to a temperature of from 295 F to 750 F or enough to melt the solder. After the plates have cooled and the pressure is released, the solder mask is removed from the interior passageways by means of a liquid solvent.

Work-related respiratory disease in employees leaving an electronics factory.

PubMed

Perks, W H; Burge, P S; Rehahn, M; Green, M

1979-02-01

Examination of the records of employees leaving an electronics factory over three-and-a-half years showed that a significantly greater proportion left the shop floor (where soldering took place) because of ill health than left the stores and office areas. This difference was largely due to work-related respiratory disease in those whose job was soldering. Shop floor workers leaving for health reasons also had increased sickness certification due to respiratory illness compared to stores and office workers. These findings suggest that work-related respiratory illness is a significant cause of morbidity and loss of employment in solderers working at the factory and that this has been a longstanding problem with its onset before the first recorded cases of occupational asthma caused by solder flux containing colophony.

NASA-DoD Lead-Free Electronics Project

NASA Technical Reports Server (NTRS)

Kessel, Kurt R.

2009-01-01

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BOA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BOA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

Low-temperature hermetic sealing of optical fiber components

DOEpatents

Kramer, D.P.

1996-10-22

A method for manufacturing low-temperature hermetically sealed optical fiber components is provided. The method comprises the steps of: inserting an optical fiber into a housing, the optical fiber having a glass core, a glass cladding and a protective buffer layer disposed around the core and cladding; heating the housing to a predetermined temperature, the predetermined temperature being below a melting point for the protective buffer layer and above a melting point of a solder; placing the solder in communication with the heated housing to allow the solder to form an eutectic and thereby fill a gap between the interior of the housing and the optical fiber; and cooling the housing to allow the solder to form a hermetic compression seal between the housing and the optical fiber. 5 figs.

Intelligent laser soldering inspection and process control

NASA Technical Reports Server (NTRS)

Vanzetti, Riccardo

1987-01-01

Component assembly on printed circuitry keeps making giant strides toward denser packaging and smaller dimensions. From a single layer to multilayer, from through holes to surface mounted components and tape applied bonds, unrelenting progress results in new, difficult problems in assembling, soldering, inspecting and controlling the manufacturing process of the new electronics. Among the major problems are the variables introduced by human operators. The small dimensions and the tight assembly tolerances are now successfully met by machines which are faster and more precise than the human hand. The same is true for soldering. But visual inspection of the solder joints is now so severely limited by the ever shrinking area accessible to the human eye that the inspector's diagnosis cannot be trusted any longer. Solutions to correcting these problems are discussed.

NASA-DoD Lead-Free Electronics Project

NASA Technical Reports Server (NTRS)

Kessel, Kurt R.

2009-01-01

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

Low-temperature hermetic sealing of optical fiber components

DOEpatents

Kramer, Daniel P.

1996-10-22

A method for manufacturing low-temperature hermetically sealed optical fi components is provided. The method comprises the steps of: inserting an optical fiber into a housing, the optical fiber having a glass core, a glass cladding and a protective buffer layer disposed around the core and cladding; heating the housing to a predetermined temperature, the predetermined temperature being below a melting point for the protective buffer layer and above a melting point of a solder; placing the solder in communication with the heated housing to allow the solder to form an eutectic and thereby fill a gap between the interior of the housing and the optical fiber; and cooling the housing to allow the solder to form a hermetic compression seal between the housing and the optical fiber.

77 FR 61019 - Aquatic Nuisance Species Task Force Meeting

Federal Register 2010, 2011, 2012, 2013, 2014

2012-10-05

..., Cost Center: FF09F14000, Fund: 134] Aquatic Nuisance Species Task Force Meeting AGENCY: Fish and... Aquatic Nuisance Species (ANS) Task Force. The ANS Task Force's purpose is to develop and implement a.... DATES: The ANS Task Force will meet from 8:30 a.m. to 5:00 p.m. Wednesday November 14, and from 8:30 a.m...

A new active solder for joining electronic components

DOE Office of Scientific and Technical Information (OSTI.GOV)

SMITH,RONALD W.; VIANCO,PAUL T.; HERNANDEZ,CYNTHIA L.

Electronic components and micro-sensors utilize ceramic substrates, copper and aluminum interconnect and silicon. The joining of these combinations require pre-metallization such that solders with fluxes can wet such combinations of metals and ceramics. The paper will present a new solder alloy that can bond metals, ceramics and composites. The alloy directly wets and bonds in air without the use flux or premetallized layers. The paper will present typical processing steps and joint microstructures in copper, aluminum, aluminum oxide, aluminum nitride, and silicon joints.

Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder

NASA Astrophysics Data System (ADS)

Sparks, D.; Queen, G.; Weston, R.; Woodward, G.; Putty, M.; Jordan, L.; Zarabadi, S.; Jayakar, K.

2001-11-01

The fabrication and reliability of a solder wafer-to-wafer bonding process is discussed. Using a solder reflow process allows vacuum packaging to be accomplished with unplanarized complementary metal-oxide semiconductor (CMOS) surface topography. This capability enables standard CMOS processes, and integrated microelectromechanical systems devices to be packaged at the chip-level. Alloy variations give this process the ability to bond at lower temperatures than most alternatives. Factors affecting hermeticity, shorts, Q values, shifting cavity pressure, wafer saw cleanliness and corrosion resistance will be covered.

Proceedings of the Annual Electronics Manufacturing Seminar (12th) Held in China Lake, California on 17-19 February 1988

DTIC Science & Technology

1988-02-01

8217age resistant’ solder lead finish for comparison purposes. * Solder coating thickness ranged from 5 through 10 microns, and solder composition was...approximate composition NiSn3, which does not correspond to any of the stable Ni-Sn IMC’s on the 60- equilibrium phase diagram. A long-term low-temperature...phase, and so is the composition . Differential scanning calorimetry measurements determined that NiSn 3 indeed is a metastable phase which rapidly

Soldering Technology. Proceedings of Annual Seminar (8th) Held on 22-23 February 1984

DTIC Science & Technology

1984-02-01

conducted and test data proves that they can not only be cost effective, but that they also improve product quality. These proceedings are published for your...aoticr piobiem with tK old system. and density per assembly ranges from 10 to 650 Very little or no data was recorded to evaluate the components. In the...soldering. This process, illustrated in on each board. Figure 2. provides engineering with the data 9 Defined Solder Screen - The same defect on needed and

Suppressing tin whisker growth in lead-free solders and platings

DOEpatents

Hoffman, Elizabeth N; Lam, Poh-Sang

2014-04-29

A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.

Methods of making metallic glass foil laminate composites

DOEpatents

Vianco, P.T.; Fisher, R.W.; Hosking, F.M.; Zanner, F.J.

1996-08-20

A process for the fabrication of a rapidly solidified foil laminate composite. An amorphous metallic glass foil is flux treated and coated with solder. Before solidification of the solder the foil is collected on a take-up spool which forms the composite into a solid annular configuration. The resulting composite exhibits high strength, resiliency and favorable magnetic and electrical properties associated with amorphous materials. The composite also exhibits bonding strength between the foil layers which significantly exceeds the bulk strength of the solder alone. 6 figs.

Methods of making metallic glass foil laminate composites

DOEpatents

Vianco, Paul T.; Fisher, Robert W.; Hosking, Floyd M.; Zanner, Frank J.

1996-01-01

A process for the fabrication of a rapidly solidified foil laminate composite. An amorphous metallic glass foil is flux treated and coated with solder. Before solidification of the solder the foil is collected on a take-up spool which forms the composite into a solid annular configuration. The resulting composite exhibits high strength, resiliency and favorable magnetic and electrical properties associated with amorphous materials. The composite also exhibits bonding strength between the foil layers which significantly exceeds the bulk strength of the solder alone.

Task specific grip force control in writer's cramp.

PubMed

Schneider, A S; Fürholzer, W; Marquardt, C; Hermsdörfer, J

2014-04-01

Writer's cramp is defined as a task specific focal dystonia generating hypertonic muscle co-contractions during handwriting resulting in impaired writing performance and exaggerated finger force. However, little is known about the generalisation of grip force across tasks others than writing. The aim of the study was to directly compare regulation of grip forces during handwriting with force regulation in other fine-motor tasks in patients and control subjects. Handwriting, lifting and cyclic movements of a grasped object were investigated in 21 patients and 14 controls. The applied forces were registered in all three tasks and compared between groups and tasks. In addition, task-specific measures of fine-motor skill were assessed. As expected, patients generated exaggerated forces during handwriting compared to control subjects. However there were no statistically significant group differences during lifting and cyclic movements. The control group revealed a generalisation of grip forces across manual tasks whereas in patients there was no such correlation. We conclude that increased finger forces during handwriting are a task-specific phenomenon that does not necessarily generalise to other fine-motor tasks. Force control of patients with writer's cramp in handwriting and other fine-motor tasks is characterised by individualised control strategies. Copyright © 2013 International Federation of Clinical Neurophysiology. Published by Elsevier Ireland Ltd. All rights reserved.

Welding, brazing, and soldering handbook

NASA Technical Reports Server (NTRS)

Kilgore, A. B.; Koehler, M. L.; Metzler, J. W.; Sturges, S. R.

1969-01-01

Handbook gives information on the selection and application of welding, brazing, and soldering techniques for joining various metals. Summary descriptions of processes, criteria for process selection, and advantages of different methods are given.

Effects of soldering and laser welding on bond strength of ceramic to metal.

PubMed

Aladağ, Akin; Cömlekoğlu, M Erhan; Dündar, Mine; Güngör, M Ali; Artunç, Celal

2011-01-01

Welding or soldering of metal frameworks negatively affects the overall bond strength between the veneering ceramic and metal. The purpose of this study was to evaluate the effect of soldering and laser-welding procedures on the bond strength between ceramic and metal. Thirty Ni-based metal specimens (Wiron 99) (8 × 4 × 4 mm) were fabricated and divided into 3 groups; soldered (S), laser welded (L), and control (untreated cast alloy) (n=10). In S and L specimens, a notch (1 × 1.5 mm) was prepared longitudinally on the surface of each specimen and filled with compatible alloy (Wiron soldering rods and Wiroweld NC, respectively). Vickers hardness measurements were made after polishing the surfaces with a metallographic polishing kit. A veneering ceramic (VITA VMK 95) was vibrated, condensed in a mold, and fired on the metal frameworks. The specimens were sectioned in 2 axes to obtain nontrimmed bar specimens with a bonding area of approximately 1 mm². Forty bars per block were obtained. Each bar was subjected to microtensile bond strength (μTBS) testing with a crosshead speed of 1 mm/min. The μTBS data (MPa) were recorded, and SEM was used for failure analysis of the tested bars. The measurements were statistically analyzed using a 1-way ANOVA and Tamhane tests (α=.05). The mean differences in μTBS of veneering ceramic to soldered (10.4 ±2.4 MPa) and laser-welded (11.7 ±1.3 MPa) metal surfaces were not significantly different and were significantly lower than that of the cast alloy (25.4 ±3.6 MPa) (P<.05). The mean Vickers hardness of cast alloy was significantly higher (236 ±17 HV) than soldered (114 ±9 HV) and laser-welded groups (129 ±11 HV) (P<.05). Soldering and laser welding significantly decreased the μTBS of a veneering ceramic to a base metal alloy. Copyright © 2011 The Editorial Council of the Journal of Prosthetic Dentistry. Published by Mosby, Inc. All rights reserved.

Intermetallic Compound Growth between Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Sn-3.5Ag or Sn-3.0Ag-0.5Cu Solder

NASA Astrophysics Data System (ADS)

Oda, Yukinori; Fukumuro, Naoki; Yae, Shinji

2018-04-01

Using an electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish with a thick palladium-phosphorus (Pd-P) layer of 1 μm, the intermetallic compound (IMC) growth between the ENEPIG surface finish and lead-free solders Sn-3.5Ag (SA) or Sn-3.0Ag-0.5Cu (SAC) after reflow soldering and during solid-state aging at 150°C was investigated. After reflow soldering, in the SA/ENEPIG and SAC/ENEPIG interfaces, thick PdSn4 layers of about 2 μm to 3 μm formed on the residual Pd-P layers ( 0.5 μm thick). On the SA/ENEPIG interface, Sn was detected on the upper side of the residual Pd-P layer. On the SAC/ENEPIG interface, no Sn was detected in the residual Pd-P layer, and Cu was detected in the interface between the Pd-P and PdSn4 layers. After 300 h of aging at 150°C, the residual Pd-P layers had diffused completely into the solders. In the SA/ENEPIG interface, an IMC layer consisting of Ni3Sn4 and Ni3SnP formed between the PdSn4 layer and the nickel-phosphorus (Ni-P) layer, and a (Pd,Ni)Sn4 layer formed on the lower side of the PdSn4 layer. On the SAC/ENEPIG interface, a much thinner (Pd,Ni)Sn4 layer was observed, and a (Cu,Ni)6Sn5 layer was observed between the PdSn4 and Ni-P layers. These results indicate that Ni diffusion from the Ni-P layer to the PdSn4 layer produced a thick (Pd,Ni)Sn4 layer in the SA solder case, but was prevented by formation of (Cu,Ni)6Sn5 in the SAC solder case. This causes the difference in solder joint reliability between SA/ENEPIG and SAC/ENEPIG interfaces in common, thin Pd-P layer cases.

76 FR 22685 - Interagency Management Task Force Public Meeting

Federal Register 2010, 2011, 2012, 2013, 2014

2011-04-22

... Force Public Meeting AGENCY: Office of Energy Efficiency and Renewable Energy, Department of Energy (DOE... meetings of the Interagency Energy Management Task Force (Task Force) in 2011. FEMP intends to hold recurring public meetings of the Task Force. Interested parties can check http://www.femp.energy.gov/news...

Learning high-quality soldering

NASA Technical Reports Server (NTRS)

Read, W. S.

1981-01-01

Soldering techniques for high-reliability electronic equipment are taught in 5 day course at NASA's Jet Propulsion Laboratory. Topic covered include new circuit assembly, printed-wiring board reworking, circuit changes, wire routing, and component installation.

49 CFR 178.33-6 - Manufacture.

Code of Federal Regulations, 2014 CFR

2014-10-01

...) Seams when used must be as follows: (1) Circumferential seams: By welding, swedging, brazing, soldering, or double seaming. (2) Side seams: By welding, brazing, or soldering. (c) Ends: The ends shall be of...

49 CFR 178.33-6 - Manufacture.

Code of Federal Regulations, 2011 CFR

2011-10-01

...) Seams when used must be as follows: (1) Circumferential seams: By welding, swedging, brazing, soldering, or double seaming. (2) Side seams: By welding, brazing, or soldering. (c) Ends: The ends shall be of...